context: In addition, it is desirable to form openings for forming solder bumps simultaneously with the formation of the openings for optical paths.
answer_0: Secondly, the formation of the openings for optical paths and the formation of the openings for forming solder bumps may be carried out separately.
answer_1: Supposedly, the formation of the openings for optical paths and the formation of the openings for forming solder bumps may be carried out separately.
answer_2: Accordingly the formation of the openings for optical paths and the formation of the openings for forming solder bumps may be carried out separately.
answer_3: Yet, the formation of the openings for optical paths and the formation of the openings for forming solder bumps may be carried out separately.
answer_4: Additionally the formation of the openings for optical paths and the formation of the openings for forming solder bumps may be carried out separately.
answer_5: Finally, the formation of the openings for optical paths and the formation of the openings for forming solder bumps may be carried out separately.
answer_6: Eventually, the formation of the openings for optical paths and the formation of the openings for forming solder bumps may be carried out separately.
answer_7: Amazingly, the formation of the openings for optical paths and the formation of the openings for forming solder bumps may be carried out separately.
answer_8: By doing this, the formation of the openings for optical paths and the formation of the openings for forming solder bumps may be carried out separately.
answer_9: Alternatively the formation of the openings for optical paths and the formation of the openings for forming solder bumps may be carried out separately.