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11857988 | With reference to the figures,FIG.1shows a plant according to the invention, denoted generally by10. This plant10comprises at least one painting booth11in which there are one or more painting systems12for painting objects13, for example in particular motor vehicle bodies or parts thereof, which are conveyed into the at least one painting booth11preferably by means of a sequential transportation line14(for example a suitable and known sequential chain, roller or similar conveyor). The painting systems12may be manual systems with paint application devices12b(for example paint spray guns) or, for example, may comprise one or more painting robots12a(advantageously of the anthropomorphic arm type) provided at the end with a suitable paint application device12b(for example a suitable paint spray gun). Below, for the sake of simplicity, reference will be made to paint application devices12b(of both the manual and automatically operated type) using the term “paint spray gun”, it being understood, however, that this term may mean any known paint application device12b, as will be obvious to the person skilled in the art. The at least one painting booth11has advantageously a grille-type floor15for allowing the throughflow of the overspray (namely the atomized paint inside the at least one painting booth11which has not become attached to the object to be painted) which is preferably transported by an air flow which is introduced via the ceiling of the at least one painting booth11through an inlet duct16and which exits through the grille-type floor15so as to convey the air with the overspray into a known abatement system17for eliminating the overspray (for example by means of filters, water jets or other means well-known in the sector) which separates the overspray from the air flow. The air cleaned of the overspray then exits the abatement system17, for example through one or more ducts18, and is then introduced into the surrounding environment and/or conveyed back into the at least one painting booth11through the inlet duct16. Special ventilators (not shown) move the air flow. Such a structure for the at least one painting booth11is well-known to the person skilled in the art and therefore will not be further shown or described. The plant10comprises an automatic magazine19which receives inside special seats a plurality of cartridges20(e.g., color) so as to select them and release them on command. The automatic magazine19may be of the type known per se for receiving, selecting and releasing objects on command. Close to the automatic magazine19or inside the automatic magazine19there is a starting station22of a transport system23for automatically transporting the cartridges20from the starting station22to at least one arrival station33. The automatic magazine19may for example release and automatically insert into the starting station22a selected cartridge20. The automatic magazine19may for example be provided with a system21for selecting and picking up a cartridge20from the plurality of cartridges20present in the automatic magazine19and insert the cartridge20directly into the starting station22of the transport system23for automatically transporting the cartridge20toward the at least one painting booth11, as far as a suitable the at least one arrival station33. The transport system23for automatically transporting the cartridges20may be advantageously realized as a pneumatic transport system23, with each cartridge20which is transported along the system (formed by suitable ducts) by means of a suitable air flow. The at least one painting booth11has, associated with it, at least one feeding station24which feeds the paint from the cartridge20to the painting system12present in the at least one painting booth11. In an automatic transport system23, a cartridge20transported from the automatic magazine19to the at least one arrival station33of the transport system23may be directly introduced from the at least one arrival station33into the at least one feeding station24. In this case, the at least one feeding station24comprises or advantageously forms also the at least one arrival station33of the transport system23and is designed to receive a cartridge20sent from the automatic magazine19through the transport system23and to connect the cartridge20automatically to the associated painting system12so as to send to the associated painting system12a flow of paint removed from the cartridge20. Advantageously, at least one arrival station33and/or at least one feeding station24may be associated with each paint spray gun and/or each painting robot12a. The at least one feeding station24may be situated in the vicinity of the painting station and a short duct25may convey the paint from the cartridge20(e.g., color) contained inside the at least one feeding station24to the paint spray gun. For example, the at least one feeding station24may be situated in the proximity or in the base of the painting robot12asuch that the mass which the painting robot12amust move remains in any case small. Alternatively, the station may be located closer to the paint spray gun and the duct25may consequently be shorter. If need be, the duct25may be eliminated and the cartridge20may reach and be engaged inside the paint spray gun which with the cartridge20thus forms also the at least one arrival station33and the at least one feeding station24. In any case, a controlled operation system for cleaning the paint along the section connecting together the cartridge20and the paint spray gun may be provided in the at least one feeding station24or connected thereto. This controlled operation system may for example employ a controlled circulation of a suitable cleaning liquid. The quantity of cleaning liquid may be kept small since the parts of the plant which come into contact with the paint are few and have small dimensions. It may also be advantageously envisaged inserting into the automatic magazine19also cartridges20containing a cleaning liquid (e.g., cleaning), in addition to cartridges20containing paint (e.g., color). In this way, when cleaning is required, a cartridge20(e.g., cleaning) may be sent to the at least one arrival station33instead of a cartridge20(e.g., color) so that the cleaning liquid may be circulated where the paint first circulated. As a result it is possible to avoid having a separate circuit for managing the cleaning liquid and the cleaning system is simplified. It is in fact merely necessary for the painting system12to emit the cleaning liquid into a special zone of the at least one painting booth11(for example inside a recovery container (not shown)) like those using the paint. The transport system23may comprise suitable routing units26for sending on command the cartridges20from the starting station22in the automatic magazine19to a selected arrival station33of the at least one painting booth11. Advantageously a first duct27may be provided, said duct leading from the starting station22to a routing unit28which routes the cartridges20into a plurality of ducts28each directed toward an arrival station33. Several routing units may be provided for further routing the cartridges20toward a plurality of painting booths11and/or painting systems12inside the painting booths11. In the case of pneumatic transport, the starting station22may produce an adequate flow of air for pushing the cartridges20along the ducts of the system and the routing unit26may comprise a mobile selector which connects on command the inlet duct27alternately to a desired outlet duct28, so as to allow a cartridge20arriving at the routing unit26to be introduced without difficulty into the desired duct28and thus continue toward the selected arrival station33. In order to facilitate the pneumatic displacement of the cartridges20, the cartridges20may have a transverse diameter slightly smaller than the internal diameter of the ducts of the transport system23and optionally may also comprise circumferential sealing rings in the proximity of their ends, as substantially known in the case of pneumatic postal systems. If required, the cartridges20may also have edges of the front and rear ends which are rounded. The rear end of the cartridges20may have a substantially flat surface so as to obtain a better pneumatic thrust. The front end may have a rounded surface for favoring the sliding movement of the cartridge20along the ducts also in the case of relatively tight bends along the path. If required, in addition to a pneumatic thrust, it may also be envisaged providing an opposite vacuum force which sucks the cartridges20toward their destination. The cartridges20may have an engaging valve (for example on their front end) for automatic engagement with the paint feeding circuit present in the at least one feeding station24. Alternatively, the cartridges20may have a zone which can be perforated and the circuit present in the at least one feeding station24for feeding the paint to the painting system12may comprise a system for perforating the cartridge20so as to introduce a duct for removing the paint through this zone. The cartridge20may for example be made in the form of a can and have a wall part which is sufficiently weak for it to be perforated by the removal duct made for example with a suitable pointed shape. The perforatable zone may also be made of a material different from the rest of the cartridge20. For example, this zone may be made with a membrane made of elastomeric material which may be more easily perforated and which, if desired, may also provide a hydraulic seal after extraction of the removal duct from the cartridge20, so as to prevent the spread externally of any residual paint which may be left inside the cartridge20. Preferably, the at least one feeding station24may also expel the empty cartridge20, for example via a chute29which leads into a collection container30. The used cartridges20are thus quickly ejected from the plant to be eliminated. The plant may be advantageously managed by a control system31, which is for example made with a suitably programmed electronic controller, known per se, and which may also comprise one or more terminals32for displaying information about the plant and the introduction of any commands by an operator. The control system31may for example be programmed to send to a desired painting system12(for example a particular painting robot12a) a cartridge20containing the desired color from among those colours colors available in the cartridges20present in the automatic magazine19, detecting also when a cartridge20is empty so that another replacement cartridge20of the same color or with a different color can be sent, as required. In the event a change in color, the control system may also control operation of the cleaning system so as to eliminate traces of the previous color before using the color of the new cartridge20. In the case where cartridges20(e.g., cleaning) as mentioned above are used, the control system may perform cleaning in a very simple manner, retrieving from the automatic magazine19a cartridge20(e.g., cleaning) before the cartridge20(e.g., cleaning) with the new color and performing withdrawal and emission of the cleaning liquid in the zone where the paint was previously circulating. FIG.2shows a simplified variant of a plant according to the invention. Parts similar to those shown inFIG.1are indicated inFIG.2using the same numbering as inFIG.1and, except where differently indicated below, for these parts reference may be made to the description provided above. Basically, the plant10according toFIG.2always comprises at least one painting booth11containing one or more automatic or manual painting systems12for painting objects13, for example in particular motor vehicle bodies or parts thereof, which are conveyed into the at least one painting booth11preferably by means of the sequential transportation line14. The at least one painting booth11may have a grille-type floor15and an air circulation and filtration system16,17,18(e.g., inlet duct16, abatement system17, and one or more ducts18) for eliminating the overspray. The at least one painting booth11has at least one feeding station24for feeding the paint from the cartridges20inserted inside the at least one feeding station24to the painting devices inside the at least one painting booth11. The plant comprises a manual magazine119inside which the cartridges20(e.g., color) are stored. In the proximity of the manual magazine119there is the starting station22of the transport system23which transports the cartridges20to the at least one arrival station33so that they can be transferred and inserted into the corresponding feeding station24. In the version of the plant10shown inFIG.2, the transfer of the cartridges20from the manual magazine119to the starting station22may be performed manually by an operator, who removes a cartridge20from the manual magazine119and inserts it into the starting station22. The choice of the cartridge20may for example be indicated to the operator by the control system31via a terminal32. Similarly, the transfer of the cartridges20from the at least one arrival station33to the at least one feeding station24may be performed manually by an operator who removes the cartridge20which has arrived at the at least one arrival station33and inserts the cartridge20inside the at least one feeding station24. Owing to the plant described, once a cartridge20in the at least one feeding station24is empty, a new cartridge20may be automatically requested by the control system31or by an operator at the at least one painting booth11. An operator at the manual magazine119may remove from the manual magazine119a cartridge20containing a suitable color, insert the cartridge20into the starting station22and send it via the transport system23to the at least one arrival station33from where the cartridge20may be removed by an operator and inserted into the at least one feeding station24of the painting system12waiting for the paint, after extraction of the empty cartridge20. All of this may be performed in a rapid and easy manner. At this point it is clear how the objects of the invention have been achieved. Owing to the system according to the invention it becomes simple to obtain a painting plant10which may change color very rapidly and perform also short painting operations with a particular color and then change to a new color without wastage of material. For example, the cartridges20may have small dimensions (also only 0.1 to 2 litres) and, if a greater capacity is required in order to paint for a longer period of time using the same color, it is sufficient to recall in succession the cartridges20containing paint of the same color. The cartridges20may be made of low-cost recyclable materials and may be of the disposable type or the type which can be reused several times by filling them again. For example, the cartridges20may be made of cardboard, aluminium, plastic, etc. As clear from the above description, the cartridges20are used substantially as “consumables” which are sent to the painting system12from the warehouse and then once the paint has been consumed, they are ejected directly, as substantially “disposable” elements. The magazine whether it be an automatic magazine19or a manual magazine119, may be easily filled manually by an operator, in view also of the low weight which the single cartridges20may have. Obviously the description given above of embodiments applying the innovative principles of the present invention is provided by way of example of these innovative principles and must therefore not be regarded as limiting the scope of the rights claimed herein. For example, depending on the requirements, several painting booths11may be fed by several magazines (one or more automatic magazines19and/or one or more manual magazines119) or several magazines (one or more automatic magazines19and/or one or more manual magazines119) may be used in order to supply the cartridges20to a single painting booth11or group of painting booths11. Each automatic magazine19or manual magazine119may obviously be of any desired size and house any number of cartridges20. The paints used may be of various types and different methods used to apply them onto the object to be painted. For example, the paints may also be in powder form as well as liquid form and may be applied by the paint spray guns using pressurized spray nozzles, electrostatic methods, etc. Owing to the invention, a same magazine (e.g., an automatic magazine19or a manual magazine119) may contain also cartridges20with paints of a different type together with any suitable corresponding different cleaning liquids and the plant10may use the different paints and liquids in any case, in a rapid and efficient manner, depending on the requirements. The painting systems12inside the painting booths11may be different from those shown in the drawings. For example, the paint spray guns inside the painting booths11may be moved using systems different from those shown. For example, painting robots12awithout anthropomorphic arms may be used or the paint spray guns may be simply manually operated by human operators. It is also possible to envisage having separate—automatic19or manual119—magazines for the cartridges20containing paint (e.g., color) and for the cartridges20containing the cleaning liquids (e.g., cleaning). Finally, parts described for the embodiment shown inFIG.1may also be used for the embodiment shown inFIG.2. For example, inFIG.2, an automatic magazine19may be used instead of the manual magazine119so as to supply automatically the cartridges20directly to the starting station22or to the operator who must transfer them to the starting station22. In the plant10according toFIG.1, the at least one arrival station33and the at least one feeding station24which are separate and with an operator who transfers the cartridges20from the at least one arrival station33to the at least one feeding station24may also be used, as shown inFIG.2. | 18,068 |
11857989 | DETAILED DESCRIPTION Reference will now be made to the example embodiments of the present general inventive concept, examples of which are illustrated in the accompanying drawings and illustrations. The example embodiments are described herein in order to explain the present general inventive concept by referring to the figures. Note that spatially relative terms, such as “up,” “down,” “right,” “left,” “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over or rotated, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the exemplary term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. Although example embodiments the present general inventive concept will be particularly described as being applied to a system for applying coatings to cabinets or wood products, it will be appreciated that the present general inventive concept can be applied to a variety of other objects, for example furniture, windows, models, and can be made of materials other than wood. Referring toFIG.1, example embodiments of the present general inventive concept can be implemented in connection with a rack system for holding multiple movable car members for suspending cabinetry items, which for the purposes of the invention may also include, but is not limited to, other items such as doors or windows. As illustrated in the example embodiment ofFIG.1, a cantilevered rack100is shown with multiple slideable, car members110attached to its horizontal rail120. AlthoughFIG.1shows 10 car members110, any number of car members110may be utilized subject to the size constraints of the horizontal rail120. The horizontal rail120, as shown, may have a rail coupling (described below) so that it can be configured to join securely with other racks100. A vertical arm140is shown which may support the weight of the horizontal rail120along with any items being held. The vertical arm140is shown attached to a cart150with rotatable cart wheels160. The horizontal rail120, vertical arm140, and cart150may be constructed of a material strong enough to be able to support the weight of the cabinets, fairly rigid to avoid against undue flex, light weight for easy transportation, and not overly expensive. Two examples of such material are aluminum and steel, although other materials are also possible. Although the cart150is shown inFIG.1as2joists spanned by a cross beam, it is also possible to carry out embodiments of the present general inventive concept using other systems which are configured for supporting and moving the rack. All such configurations and modifications are intended to be included within the scope and spirit of the present general inventive concept. FIG.2is a close-up view of the horizontal rail120with one of the car members110shown attached to the horizontal rail120. Multiple attachment devices (shown in subsequent figures) can be specialized for cabinet components, and are used to suspend cabinet components and other objects from the rack100. Included amongst these attachment devices may be a drawer front holder400, a shelf holder300and a hanger700. Further description of these devices will be provided in the description below. Also shown in the close up view ofFIG.2is a cut out view of the horizontal rail120, showing the channel200within which the car members110may be suspended, and within which they may move in a lateral direction. Although not shown inFIG.2, in an example embodiment, a stop may be placed at the end of the horizontal rail120in order to restrain the car members110in a lateral direction. Such an embodiment will be described in a subsequent paragraph below. FIGS.3A and3Bshow different views of the car members110.FIG.3Ashows a perspective view of a car member110. The car member wheels210are configured to hang and roll within the channel200of the horizontal rail120. It may be useful for the car member wheels210to encounter enough resistance within the channel200such that the cabinet components do not move under the force of the spray finishing. Additionally, wheel brakes (not shown) may be utilized to resist the movement of the car members110and the cabinet components in a lateral direction once a desired position is reached. The car member wheels210may be attached to each other with axles220, and the car member wheels210and axles220attached to a spindle230. The car member wheels210, axles220and spindle230(or “upper assembly”) may be configured to rotate on a platform240in relation to the lower assembly250. In one embodiment of the invention, the lower assembly250may rotate in 4 distinct positions relative to the upper assembly, in 90 degree increments, to provide easy access to the cabinet components for finishing and also to resist movement in a circumferential direction. However, it also possible in other embodiments to have more or less than 4 distinct positions subject to physical size constraints. In addition to the rotation as described herein, the car members110may also pivot in relation to the horizontal plane, in order to limit the amount of running paint or other finish and to allow proper drying, for example. Additionally, the car members110may include a spring system to enable staggered height of adjacent cabinet components or doors. Also shown inFIG.3are the lower grooves260, which may be configured to accept the multiple attachment devices, and which may include the drawer front holder400, the shelf holder300, and the hanger700. A foam pad may also be provided for use with the rack system100to pad between cabinet components after they have dried, and the foam pad may be attached to the car members110as by a magnet, hook or other attachment structure. FIG.3Bshows an internal view of a car member110including one embodiment of a mechanism for providing the distinct positions of rotation between the lower assembly250and the upper assembly. The upper assembly including the spindle230are shown attached to a hat270with multiple detents275cut into the brim of the hat270. The detents275may be spaced in a circumferential direction around the brim of the hat270and correspond with the distinct rotation positions of the lower assembly250relative to the upper assembly. A pin280may rest matingly within the detents275of the hat270. A spring290may be in physical contact with the pin280, and the spring force may bias the pin280in an upward direction. Rotation of the upper assembly including the spindle230in either a clockwise or counterclockwise direction rotates the hat270, applies a downward force on the spring and moves the pin280out of the detent275of the hat270within which it was resting, until the pin280finds an adjacent detent within which it can rest. Although there may be any number of detents275cut into the brim of the hat270subject to the physical size constraints of the hat270, pin280, and detent275, in one embodiment the detents275are spaced in equal increments apart such that they provide equal access to surface features of the cabinet components. FIG.3Cshows an alternative embodiment of the car member110including one embodiment of a mechanism for providing the distinct positions of rotation between the lower assembly250and the upper assembly. In this embodiment, internal spring plates285rest matingly within the detents275of the hat270, while intermediate positions between the detents275deflect the internal spring plates285in a downward direction. FIG.4shows a perspective view of a shelf holder300configured for holding a shelf securely within the rack100. Two side tabs310are configured to fit matingly within the lower grooves260of the car members110. Additionally, a rear tab330with a corresponding hole may be used to attach to a hanger700when used with at least one other shelf holder300, as described in a subsequent paragraph. At the lower end of the shelf holder300is a bottom hole320of sufficient size to accept a wood screw such as, for example, the wood screw illustrated inFIG.5discussed herein. It is understood that the present general inventive concept is not limited to any particular type of screw, a variety of other fastening members could be used to attach a workpiece to the workpiece hanger. In one embodiment of the invention, the bottom hole320may be used to screw into a hidden edge of a cabinet shelf in order to support the shelf for spray finishing. Also shown inFIG.4are additional side holes325which may be used for attachment to the cabinet shelf, for other cabinet components, or any other object for spray finishing. The multiple side holes325may provide a more secure attachment, as opposed to a single bottom hole320. FIG.5shows a perspective view of a drawer front holder400configured for holding a drawer securely within the rack100. Two side tabs410are configured to fit matingly within the lower grooves260of the car members110. Additionally, a rear tab430with a corresponding hole may be used to attach to a hanger when used with at least one other drawer front holder400, as described in a subsequent paragraph. At the lower end of the drawer front holder400is a bottom hole420of sufficient size to accept a wood screw. In one embodiment of the invention, the bottom hole420may be used to screw into a hidden area, for example on the back of the drawer front, in order to support the drawer for spray finishing. FIG.6shows a perspective view of a door holder500with attached door520. The door holder500may consist of 2 distinct components, the door hanger502and one or more blocks504, and a pipe516which can be inserted through holes in blocks504. The door hanger502may include a center brace510which serves as the connection between the car member110and the door holder500. The center brace510has two tabs (not shown) which fit matingly within the lower grooves260of the car members110. The door hanger502may also include a support plank512and two or more hooks514. The hooks514are attached to the support plank512. In the embodiment shown inFIG.6, slats are shown cut into the support plank512. By loosening the screws connecting the hooks514to the support plank512, an operator would then be able to move the hooks514in a lateral direction to provide for quick adjustment of the balance of the door520prior to spray refinishing. The blocks504may attach to the door520in the area of the hinge cutouts of the door520, which will be hidden from view once the hinges are installed or reattached. The pipe516is inserted through holes in the blocks504, and the door520may then be suspended onto the hooks514prior to refinishing of the door520. The pipe516may be made of steel, wood, or other solid material. In another embodiment, an expandable hole mount (shown as600inFIG.7A), that fits into the knob hole of the door520, may be used to suspend the door520from the rack100. Although the door hanger502may be made of wood as shown inFIG.6, other materials are also possible, for example aluminum or steel. FIG.7Ashows an illustration of the expandable hole mount600, which may be used to attach to a door knob opening, or other opening in a cabinet component or other object. The expandable hole mount600can act in the same fashion as the other attachment devices described above, which can be used to suspend cabinet components and other objects from the rack100. The expandable hole mount600consists of a prior art expandable plug610, with an actuation device620, shown as a wing nut inFIG.7A, but which could also be a lever, handle, knob, etc. Actuation of the expandable plug610creates a tight fit within a door knob opening, or other opening in a cabinet component or other object, and creates a secure attachment point. On the other end of the expandable hole mount600are two side tabs630which are configured to fit matingly within the lower grooves260of the car members110.FIG.7Bshows an alternate embodiment of the expandable hole mount600. In this embodiment, a screw knob632is rotated to actuate expanding core components634which may be used to attach to a door knob opening, or other opening in a cabinet component or other object. The expanding core components634consist of an inner block635and a sleeve636, and rotation of the inner block635by rotating the screw knob632causes the sleeve636to move in an outward direction, which can cause it to provide a secure attachment within the knob hole of a door520. FIG.8shows a hanger700which can be used to suspend cabinet components and other objects from the rack100. The hanger700can come in different sizes based on the size of the cabinet component or other object it is intended to support. At the top of the hanger700are two side tabs710which are configured to fit matingly within the lower grooves260of the car members110. Also located on the hanger700are multiple upward tabs720, which are generally equally spaced apart across the hanger rail730, and which can be used with finishing clips (shown as810inFIG.9). Additional embodiments may include a custom hangar700with multiple holes in different locations to support an operator created configuration. FIG.9shows the hanger700being used in conjunction with the finishing clips810to support a cabinet door820from the rack100. The upper end of the finishing clips810may form a loop which can hang over the upward tabs720, and the upward tabs720resist movement of the finishing clips810and cabinet door820or other object in a lateral direction. The bottom end of the finishing clips810may form a hook which can fit within the hole830of the cabinet door820or other object in order to secure the cabinet door820or other object prior to and during spray finishing. Given their generally looser fit within a hole830of the cabinet door820or other object, in comparison with the expandable plugs610described above, the finishing clips810are intended to be used in pairs with the hanger700. FIG.10Ashows a rail coupling910which allows a rack100to be configured to join securely with other racks100. The horizontal rail120of each rack100is shown on the right and left ofFIG.10. The rail coupling910may be composed of two distinct parts, the spool coupler912and the fork coupler914. These two parts join together to provide for proper alignment and attachment of the two racks100. Also shown inFIG.10Aare the spools920, fork930, latch940, and latch release handle946. A latch limiting and adjustment screw942allows the user to adjust the latch for a secure fit. A side plate944is configured to overlap the horizontal rail120when the horizontal rails120are in a coupled state (as shown inFIG.10A), in order to promote proper alignment of the horizontal rails120. FIG.10Bshows a view of the spool coupler912and the fork coupler914in an uncoupled state. As the spool coupler912and the fork coupler914are advanced towards each other, the spools920are inserted between the arms of the fork930, providing for proper alignment of the two racks100. A latch tab950may be configured to mate with one of the spools920, so that once the spools920are fully inserted between the arms of the fork930, and the horizontal rail120ends meet up, the latch tab950engages with the spool920creating a locking fit. Moving the latch940, by means of the latch release handle946in a vertical direction releases the rail coupling910.FIG.10Ashows the engaged position of the two racks100. Shown inFIG.10Cis an interior view of the distal end of the horizontal rail120. A stopper cam955is shown attached near the end of the horizontal rail120. The stopper cam955has a limited range of motion in the circumferential direction and serves to prevent the car members110from rolling off the ends of the rack100when uncoupled. As shown inFIG.10C, with the car member110resting against the stopper cam955near the end of the horizontal rail120, the stopper cam955has reached the limit of its range of motion in the counter-clockwise direction, and the car members110are prevented from rolling off the ends of the rack100. A torsion spring960is attached to the stopper cam955in order to bias the stopper cam955in a position so that it contacts the car member110as the car member110approaches the end of the of the horizontal rail120, when the rack100is in an uncoupled state. FIG.10Dshows an interior view of the distal end of the horizontal rails120in a coupled state. In this case, the stopper cams955rotate against the biasing force of the torsion spring960and are no longer in position to engage with a car member110as it approaches the end of the of the horizontal rail120. Thus, when the rack100is in a coupled state, the car members110can move freely between racks100. FIG.10Eshows a view of one end of a horizontal rail120when the rack100is in an uncoupled state, including a stopper cam finger relief956. By depressing the stopper cam finger relief956, the stopper cam955is no longer in position to engage with a car member110as it approaches the end of the of the horizontal rail120, and may be used to manually remove a car member110, for example to service it. In one embodiment of the present general inventive concept, a rack100as shown inFIG.1attached to a movable cart150may be coupled to a fixed rack100in order to provide a stable platform during the spray finishing process. The fixed rack100may be attached to a wall, ceiling, or other immovable surface. After suspending the cabinet component(s) from the car member110of the rack100attached to a movable cart150, the rack100may then be moved into position in line with the fixed rack100. The spool coupler912of one rack100may then be joined with the fork coupler914on the other rack100until they are locked in place, in order to provide a substantially pivot-free connection. At that point, the operator may proceed with spray finishing of the cabinet components. In one embodiment, one rack100may be used to spray a cabinet component, after which the sprayed and dried cabinet component may be loaded onto the other rack100for transport or storage or the like. Example embodiments include providing systems for retaining and maneuvering cabinetry items from one or more rack systems while applying coatings to the cabinetry items, including providing one or more car members configured to support the cabinetry items, providing one or more attachment devices configured to be removably attachable to the one or more car members and to the cabinetry items, providing a horizontal rail configured to support the one or more car members and to provide a channel for the one or more car members to move in a generally parallel direction with respect to the rail, providing a base configured to support the weight of the rail, one or more car members, and cabinetry items such that the system supports the cabinetry item from the one or more of the attachment devices, and supports the attachment device and cabinetry item from one of the one or more car members such that the cars can be moved along the horizontal rail and rotated until the cabinetry item is in position for spray finishing. The systems and methods can also include providing a rail coupling attached to the end of one or more horizontal rails to facilitate mating or coupling of one rack system with another to facilitate movement of items to be spray coated from one rack to another. While most of the example embodiments described so far have included car members that are equipped with rotatable workpiece hanger mounts that fit matingly with various workpiece hangers, sometimes referred to herein as attachment devices, such as the described drawer front holder, shelf holder, door holder, and so on, various other example embodiments of the present general inventive concept may provide such workpiece hanger mounts in a host of other device/assembly configurations. For example, the mating grooves260configuration ofFIGS.3A-Bmay be provided to a workpiece hanger mount that is configured to be attached to a support surface so as to remain stationary, or at a fixed position, on that support surface, or may be configured to rotate about an axis extending away from that support surface while remaining attached to the same point, as well as other movable car embodiments. In the remaining example embodiments described herein, the term workpiece hanger mount, or simply hanger mount, may be used to describe the portion generally referred to as the lower assembly250ofFIGS.3A-B. Also, the various attachment devices such as those described inFIGS.4-6may be referred to herein generally as workpiece hangers, while the various components attached to or suspended from the workpiece hangers may be referred to generally as workpieces. As illustrated inFIGS.2-9, and as described in relation to those figures, the workpiece hanger mounts are configured with a grooved configuration that fits matingly with a generally T-shaped connecting configuration arranged at the top of the various workpiece hangers. The configuration that allows such a beneficial mating fit of the various different selectable workpiece hangers to the same hanger mount will now be described in more detail in relation to various example embodiments of the hanger mount and hanger mount assemblies. FIGS.11A-Billustrate perspective and front views, respectively, of a workpiece hanger mount according to an example embodiment of the present general inventive concept. As illustrated inFIGS.11A-B, a workpiece hanger mount1000includes a general body portion1010and two side portions1020that extend downward from the body portion1010so as to define an upper open space1030between upper parts of the side portions1020. An inwardly extending shelf or flange portion1040is provided at the distal end of each of the side portions1020, the flange portions1040being arranged so as to extend toward one another and define a lower open space1050between the distal ends of the flange portions1040. The arrangement of the lower open space1050located below and opening into the wider upper open space1030roughly corresponds to the generally T-shaped upper portion of the workpiece hangers illustrated inFIGS.4-8such that the T-shaped upper portion can be passed through the opening spaces of the hanger mount1000from the front or the back, with the wider portion of the T-shape passing through upper open space1030, and the “stem” portion below the wider portion passing through the lower open space1050. This facilitates convenient mounting of the workpiece hangers in the hanger mount1000as described in relation to the previously illustrated example embodiments. In various example embodiments a back wall of such a hanger mount may be closed, such that the open spaces1030,1050are only accessed from the front of the hanger mount. A groove1060is formed in each of the flange portions1040, extending downward from the upper surface of the flange portions1040and arranged to be aligned with one another through the lower open space1050. The grooves1060each extend from a distal end of the flange portions1040toward the respective side portions1020of the hanger mount1000, and are arranged to accept portions of the workpiece hangers as previously described in relation toFIGS.2-9, and which will be described in more detail herein. FIGS.12A-Billustrate the mounting of a workpiece hanger in the workpiece hanger mount ofFIGS.11A-Baccording to an example embodiment of the present general inventive concept. In the example embodiment illustrated inFIGS.12A-Ba workpiece hanger1070is configured as a universal hanger that extends substantially directly downward from the hanger mount1000when mounted therein, with a screw member1080that extends down substantially along a longitudinal axis of the workpiece hanger1070to be screwed directly into an upper surface of a workpiece. The universal hanger configuration may also include, as illustrated, other screw apertures1090to allow lateral connection to a workpiece. In various example embodiments the workpiece hangers may be configured such that they only contact workpieces in one or more locations that are eventually hidden by assembly of the workpieces. As previously described in relation toFIGS.4-8, the workpiece hanger1070includes a lower portion1100that is configured to be attached to a workpiece, and an upper portion1110that is configured to be received in the hanger mount1000to hang the workpiece from the hanger mount1000via the workpiece hanger1070. Since the lower portion1100of the workpiece hanger1070can be configured in a host of different ways according to the workpiece to be suspended from the hanger mount1000, with the upper portion1110having the same general configuration regardless of the configuration of the lower portion1100, the same hanger mount1000can be used for a host of differently configured workpiece hangers. The upper portion1110of the workpiece hanger1070includes two side tabs1120extending away from one another and configured to be respectively received in the grooves1060of the hanger mount1000. The side tabs1120extend away from at least a portion of an elongated member1130that extends away from the side tabs1120. Thus, in the example embodiment illustrated inFIGS.12A-B, the elongated member1130and side tabs1120of the upper portion1110of the workpiece hanger1070are configured in a T-shape such that the workpiece hanger1070can be hung from the hanger mount1000by passing the side tabs1120through the upper open space1030, with the part of the elongated member1130proximate the side tabs1120passing through the lower open space1050, until the side tabs1120are over the grooves1060, and then lowering the side tabs1120into the grooves1060. As the side tabs1120are formed to generally correspond with the dimensions of the grooves1060, this provides a stable coupling of the workpiece hanger1070to the hanger mount1000. The bottom of the side tabs1120at least partially rest on an upper surface of the grooves1060, due to gravity, providing support so that the workpiece hanger1070cannot be moved further downward, and the front and/or back surfaces of the side tabs1120rest against, or in close proximity to, one or both sides of the grooves1060to provide support so that the workpiece hanger1070is limited, if not entirely prohibited, from movement in the front and back directions relative to the hanger mount1000. In some example embodiments the overall length of the grooves1060between the ends of each proximate the side portions1020, are formed to correspond to the overall length from end to end of the side tabs1120, so that the ends of the side tabs1120contact the end surfaces of the grooves to inhibit or prohibit movement of the workpiece hanger1070from side to side relative to the hanger mount1000. In various example embodiments, the grooves1060are formed so as to correspond to the thickness and/or length of the side tabs1120such that a friction fit may be formed with the front/back surfaces and/or end surfaces of the side tabs1120. For example, if the width of the grooves1060are formed to register with the thickness of the side tabs1120, a friction fit may be formed that prohibits any movement of the workpiece hanger1070in the front and back directions relative to the hanger mount1000. Similarly, if the length of the grooves1060are formed to register with the overall length of the side tabs1120, a friction fit may be formed that prohibits any movement of the workpiece hanger1070in a lateral direction relative to the hanger mount1000. In various example embodiments the grooves1060may be formed to provide a slip fit for one or more of the dimensions of the side tabs1120, in order to provide easier mounting and unmounting of the workpiece hanger1070from the hanger mount1000. In various example embodiments, as illustrated inFIGS.11A-12B, the tops of the grooves1060may flare out to provide more accessible guidance of the side tabs1120into the grooves1060. In other various example embodiments the bottoms of the side tabs1120may be tapered to a smaller thickness to provide a similar more accessible guidance into the grooves1060. Thus, with the mating fit of the hanger mount1000to the upper portion1110of the workpiece hanger1070, different workpiece hangers, and therefore different workpieces, can be quickly and easily mounted to the hanger mount1000for spraying or other processes. The geometry of the matingly fitting components allows a simple and ergonomic hang/unhang motion, is economical to produce, and also transfers stability to the hanging workpiece. In various example embodiments, the mating parts are effectively “hidden” when the workpiece hanger1070is mounted on the hanger mount1000. In various example embodiments the grooves accepting the T-shaped connection of the workpiece hangers could be configured to be offset from the rotational axis of the offset hanger, such as, for example, being formed outside a perimeter of the general body portion of the hanger mount. In various example embodiments of the present general inventive concept the mating components described herein could be reversed, with the T-shaped connection provided to a hanger mount, and a grooved assembly provided to the upper portion of one or more workpiece hangers that is configured to be receive the T-shaped connection by moving the grooves of the workpiece hanger over and onto the T-shaped connection. Further, various example embodiments may provide a host of differently configured mating fits between a workpiece hanger mount and a workpiece hanger without departing from the scope of the present general inventive concept. For example, various example embodiments may provide a plurality of grooves that may also be differently configured to fit matingly with corresponding tabs of a workpiece hanger, such as a plurality of grooves arranged on one or both of the flange portions described herein. Such grooves could be formed in an X-pattern, or otherwise be angled away from one another, or could be arranged in a parallel fashion, and so on. Rather than having two side portions forming an open space that receives a tabbed workpiece hanger portion to allow a tab member be entered into a groove from above, such grooves could be formed directly in or on the workpiece hanger mount body such that the workpiece hanger is entered from a position forward from the groove or grooves, to provide a convenient approach path for the workpiece hanger. For example, two aligned but separated grooves such as those described herein could be formed on a single portion of the mount body facing a worker in at least one orientation of the workpiece hanger mount. Various example embodiments may provide a workpiece hanger mount that has a single groove to accept a single workpiece hanger tab therein to fit matingly and inhibit movement of the workpiece hanger on one or more axes of direction. Various example embodiments may provide a mount body having at least one groove portion having at least a first mating surface, and a workpiece hanger having an upper portion with at least one tab member having at least a second mating surface configured such that the first and second mating surfaces mate with one another to securely hold the workpiece when mounted on the workpiece hanger mount, and may further securely hold the workpiece proximate a center of gravity of the workpiece so as to inhibit lateral movement of the workpiece relative to the workpiece hanger mount. As illustrated inFIGS.11A-12B, the hanger mount is provided with an attachment portion1140configured to couple the hanger mount1000to a support surface in a stationary position. In this example embodiment, the attachment portion1140is configured as a bracket designed to be affixed to a cylinder shape such as a rod of a support rack. In various example embodiments the attachment portion1140may be removably coupled to the hanger mount1000such that a user can selectively provide different attachment portions to the same hanger mount1000, depending upon the desired support surface.FIG.13illustrates a plurality of hanger mounts coupled to a bar1150of a support rack according to an example embodiment of the present general inventive concept. As illustrated inFIG.13, each of the hanger mounts1000are affixed to the bar1150of the support rack at specific locations along the bar1150. Thus, in contrast to the hanger mounts illustrated inFIGS.3A-B, for example, the hanger mounts1000ofFIG.13are not configured to be rolled along a rail as a car member, but are rather configured to be stationary at the attachment location and not move toward any adjacent hanger mount1000. Also, while the hanger mounts ofFIGS.3A-Bare configured to be rotatable relative to the attachment portion suspending those hanger mounts from a rail, the hanger mounts1000ofFIGS.11A-13are configured to remain at a fixed orientation relative to the attachment portion1140. As such, a plurality of workpieces attached to workpiece hangers1070respectively mounted to the hanger mounts1000can maintain a fixed distance from one another, and also not rotate so as to contact one another. In this way, workpieces can be suspended from a rack after various processes without danger of the workpieces contacting each other while, for example, paint dries, and so on. Although many of the example embodiments herein are described as being hanger mounts attached to various types of racks, other mounting configurations are possible without departing from the scope of the present general inventive concept. For example, hanger mounts of various embodiments may be configured to be mounted directly to a flat surface such as, for example, 2× lumber. Such a hanger mount may be configured with screw holes passing through the hanger mount body from top to bottom to allow the mount to be suspended from above from such a surface, and/or with screw holes passing through the hanger mount body from front to back to allow the mount to be suspended on a wall surface or vertically arranged board or the like. As previously noted and described, hanger mounts according to various example embodiments of the present general inventive concept may be configured to be rotatable relative to an attachment device/assembly coupling the hanger mounts to a support surface, or may be configured to maintain a fixed orientation relative to the attachment device/assembly. Also, hanger mounts according to various example embodiments may be provided with attachment devices/assemblies that are configured to maintain a fixed or stationary location on a support surface, or may be provided with attachment devices/assemblies that are configured to move along the support surface.FIG.14illustrates a hanger mount that is rotatable about a fixed location attachment member according to an example embodiment of the present general inventive concept, andFIG.15illustrates a hanger mount that is rotatable about a movable attachment member according to another example embodiment of the present general inventive concept. The hanger mounts illustrated inFIGS.14-15each rotate around a spindle coupling the hanger mounts to the attachment portions, and are configured similarly to the example embodiment illustrated inFIGS.3A-B,FIGS.14-15demonstrate how the same or similar hanger mounts can be suspended from a fixed location or movable attachment portion. As illustrated inFIGS.14-15, a rotatable hanger mount includes a body portion1210from which side portions1220extend downwardly from substantially opposite sides thereof to define an upper open space1230therebetween, and flange portions1240extending inwardly from proximate the distal ends of the side portions1220to define a lower open space1250therebetween. The grooves1260formed on the flange portions1240are configured to receive side tabs of a workpiece hanger therein, and in this example embodiment are formed with an irregular surface to provide a close fit with portions of the front and/or back surfaces of the side tabs received in the grooves1260. In these general features, the hanger mount1200is substantially similar to the example embodiments illustrated inFIGS.3A-Band11A-12B. In contrast to the fixed orientation hanger mount1000ofFIGS.11A-12B, however, the body portion1210of the hanger mount1200is configured to receive and at least partially surround a spindle member1270extending downward from an attachment portion (the fixed attachment portion1280inFIG.14, the movable car configured attachment portion1290inFIG.15). The hanger mount1200is configured to rotate about the stationary spindle member1270, the spindle member1270being fixed to the respective attachment portion1280or1290, and thus the hanger mount1200is rotatable about an axis extending down from the attachment portion. As with the example embodiment illustrated inFIGS.3A-B, the spindle member1270may be configured with a hat portion1300proximate a lower end of the spindle member1270, or a hat portion formed integrally with the spindle member1270, that is configured with a plurality of detents1310, which may be, for example, inverted V-shaped grooves, formed into the brim of the hat portion1300. The detents1310may be spaced in a circumferential direction around the brim of the hat portion1300so as to correspond with distinct rotational positions of the hanger mount1200that may be chosen by a user such that the hanger mount1200does not move from that rotational orientation without a rotational force being applied to it. A biased member1320may rest matingly within one of the detents1310of the hat portion1300when the hanger mount1200is oriented at one of the selectable rotational positions. The biased member1320may be biased by a spring1330in contact with the biased member1320that is pressing the biased member upward towards the hat portion1300. Rotation of the hanger mount1200about the spindle member1270in either a clockwise or counterclockwise direction rotates the biased member1320and spring1330inside the hanger mount1200, applies a downward force on the spring1330and moves the biased member1320out of the detent1310in which the biased member1320was resting, until the biased member1320finds an adjacent detent1310within which it can rest. Although there may be various numbers of detents1310cut into the brim of the hat portion1300according to various example embodiments of the present general inventive concept, in an example embodiment the detents1310may be spaced in equal increments apart such that they provide equal access to surface features of the workpiece hung from the workpiece hanger suspended from the hanger mount1200. The hanger mount1200may be coupled to the attachment portion1280ofFIG.14so that the hanger mount1200may be pivoted about a fixed location, such as a work station, on which workpieces are individually suspended from the hanger mount1200for a process such as spraying. The hanger mount1200may be coupled to the attachment portion1290ofFIG.15so that the hanger mount1200may be both rotatable and moved as a car member, via rotatable car wheels1294, along a rail such as that illustrated inFIGS.1-2. FIG.16illustrates a plurality of fixed position hanger mounts coupled to a movable rack according to an example embodiment of the present general inventive concept. In this illustrated embodiment, a plurality of the hanger mounts1000ofFIGS.11A-12Bhave been coupled to the bar1150of a rolling rack so that a plurality of workpieces can be moved from one work station to another. The workpieces in this example are panels1350that are suspended from offset hangers1360hanging from a long hanger type workpiece hanger1370that allows the center of mass of the panels1350to be substantially centered on a rotational axis of a rotation hanger mount1200that they may be transferred to at various work stations such as those illustrated inFIGS.17A-B. The rotational axis of the rotation hanger mount1200may be substantially centered on the longitudinal axis passing down through the upper and lower open spaces1030,1050of the non-rotational hanger mount1000.FIGS.17A-Billustrate a method of using a rotational hanger mount at work station according to an example embodiment of the present general inventive concept. InFIG.17Aa user has removed the workpiece hanger1370supporting one of the panels1350from the hanger mount1000rolling rack1340and mounted that workpiece hanger to the rotational hanger mount1200that is coupled, via the attachment portion1280, to a fixed work station support member1380. The support member1380of this example embodiment is a floor stand, but could be ceiling or otherwise mounted in other various example embodiments. The hanger mount1200is configured to be biased to rest at one of four evenly distributed positions around the axis of rotation when rotational force is not applied to the hanger mount1200, and a one of those positions is illustrated inFIG.17A. After the user/worker has completed a spray operation on a first surface as shown inFIG.17A, the user can rotate the hanger mount1200, by applying force to the hanger mount1200, workpiece hanger1370, offset hangers1360, or the panel1350itself to move the panel to the next rotational position configured in the biased rotational hanger mount1200. The next position is shown inFIG.17B. Thus, after completing the spraying operation on all four sides of the panel1350, the user can move the workpiece hanger1370, and therefore the panel1350, back to the rolling rack1340or another similarly configured rack, upon which the spaced apart, non-rotational hanger mounts1000prevent the panels from contacting one another during transit of the rolling rack1340. FIG.18illustrates an offset hanger and workpiece mounted to a rotational hanger mount according to an example embodiment of the present general inventive concept. In this example embodiment, a workpiece panel1400is attached to an offset hanger1390that is mounted to the rotatable hanger mount1200, which is coupled to the rolling car attachment portion1290as illustrated inFIG.15. Since the offset hanger1390bends out from the upper T-shaped mounting portion before extending downward and then back toward the rotational axis of the hanger mount1200to connect to the panel1400, the center of mass of the panel is able to be substantially centered on the rotational axis of the hanger mount1200, even though the panel1400is attached to the offset hanger1390through a side surface of the panel1400. Thus, a user can rotate the panel1400between various positions without the panel rotating at on offset distance about the rotational axis of the hanger mount1200.FIG.19illustrates a universal hanger and workpiece mounted to a rotational hanger mount according to an example embodiment of the present general inventive concept. In this example embodiment a panel1420is attached to a universal hanger1410via a screw that is configured to be substantially coaxial with the rotational axis of the rotatable hanger mount1200. The universal hanger1410is mounted to the rotatable hanger mount1200, which is coupled to a stationary or fixed point attachment portion1280as illustrated inFIG.14. Thus, the center of mass of the panel1420is substantially centered on the rotational axis of the rotatable hanger mount1200. Various example embodiments of the present general inventive concept may provide a system for retaining and maneuvering workpiece items to be spray-coated, the system including a workpiece hanger mount including a body portion, two side portions extending downward from the body portion to form an upper open space therebetween, two flange portions extending inwardly respectively from proximate distal ends of the two side portions to form a lower open space therebetween, and a groove formed in an upper surface of each of the flange portions, and one or more workpiece hangers including a lower portion configured to be attached to a workpiece, and an upper portion having two side tabs extending away from one another and configured to be selectively received in the respective grooves formed in the flange portions of the hanger mount, wherein a workpiece is selectively hung from the system by attaching the workpiece to one of the workpiece hangers and mounting the workpiece hanger in the hanger mount. The upper portion of each of the one or more workpiece hangers may be configured in a T-shape with the two side tabs extending away from an upper end of an elongated member. A portion of the elongated member below the side tabs may be configured to be selectively passed through the lower open space of the hanger mount. Each of the side tabs may have lower surfaces configured to register with bottoms of the respective grooves of the hanger mount. Each of the side tabs may have side surfaces configured to register with sides of the respective grooves of the hanger mount. Each of the side tabs may have end surfaces configured to register with ends of the respective grooves of the hanger mount. Each of the side tabs may have lower surfaces configured to register with bottoms of the respective grooves of the hanger mount, side surfaces configured to register with sides of the respective grooves of the hanger mount, and end surfaces configured to register with ends of the respective grooves of the hanger mount, such that the workpiece hanger is substantially stable in three axes when suspended from the hanger mount. The system may further include an attachment portion connected to the body portion of the hanger mount, the attachment portion being configured to couple the hanger mount to a support surface. The body portion of the hanger mount may be connected to the attachment portion so as to maintain the hanger mount in a fixed orientation relative to the attachment assembly. The body portion of the hanger mount may be connected to the attachment portion so as to be rotatable relative to the attachment portion. The hanger mount may be biased to rest at a plurality of predetermined rotational positions when rotational force is not applied to the hanger mount. The hanger mount may be biased to rest at four selectable rotational positions when rotational force is not applied to the hanger mount, each of the four rotational positions being 90 degrees from any adjacent rotational position. The system may further include a spindle configured to couple the body portion to the attachment portion such that the hanger mount is rotatable about the spindle and relative to the attachment portion. The system may further include a hat portion provided to the spindle and configured with a plurality of detents formed to interact with the hanger mount such that the hanger mount is biased to rest at a plurality of selectable predetermined rotational positions when rotational force is not applied to the hanger mount. The hanger mount may further include a spring-loaded member to engage one of the detents to maintain the hanger mount at a rotational position at which the spring-loaded member engages the one of the detents. Rotation of the hanger mount about the spindle and hat portion may force the spring-loaded member to be moved out of the detent engaged by the spring-loaded member, and to engage a detent adjacent to the previously engaged detent to maintain the hanger mount at another rotational position corresponding to the newly engaged detent. The spring-loaded member may be a spring-loaded pin or a spring plate. The system may further include a plurality of wheels provided to the attachment portion such that the attachment portion can be moved along the support surface. The one or more workpiece hangers may be configured to be attached to workpieces such that a center of mass of the respective workpieces is substantially centered on a rotational axis of the hanger mount. The one or more workpieces may include a drawer front holder, a shelf holder, a hinge hole mount, a universal hanger, or any combination thereof. A plurality of grooves may be formed in an upper surface of each of the flange portions, and a corresponding plurality of tabs may be formed in the upper portion of the one or more workpiece hangers, the plurality of tabs being configured to fit matingly in the respective plurality of grooves. Various example embodiments of the present general inventive concept may provide a system for retaining and maneuvering workpiece items to be spray-coated, the system including a workpiece hanger mount including a body portion configured with at least one groove portion, and one or more workpiece hangers including a lower portion configured to be attached to a workpiece, and an upper portion having at least one tab member configured to be selectively received in the at least one groove portion of the hanger mount, wherein a workpiece is selectively hung from the system by attaching the workpiece to one of the workpiece hangers and mounting the workpiece hanger in the hanger mount, and wherein the at least one tab member of the one or more workpiece hangers is configured to fit matingly within the at least one groove portion of the workpiece hanger mount. The at least one groove portion of the workpiece hanger mount may be configured with at least a partially open upper surface such that the at least one tab member enters the at least one groove portion from above, and rests therein at least partially due to gravity, when the corresponding workpiece hanger is mounted to the workpiece hanger mount. Various example embodiments of the present general inventive concept may provide a system for retaining and maneuvering workpiece items to be spray-coated, the system including a workpiece hanger mount including a body portion configured with at least one groove portion having at least a first mating surface, and one or more workpiece hangers including a lower portion configured to be attached to a workpiece, and an upper portion having at least one tab member configured to be selectively received in the at least one groove portion of the hanger mount, the at least one tab member having at least a second mating surface such that when a workpiece is attached to the lower portion of the one or more workpiece hangers and the at least one tab member is received in the at least one groove portion, the at least one first and second mating surfaces mate with one another to securely hold the workpiece proximate a center of gravity of the workpiece so as to inhibit lateral movement of the workpiece relative to the workpiece hanger mount. It is noted that the simplified diagrams and drawings do not illustrate all the various connections and assemblies of the various components, however, those skilled in the art will understand how to implement such connections and assemblies, based on the illustrated components, figures, and descriptions provided herein, using sound engineering judgment. Numerous variations, modifications, and additional embodiments are possible, and accordingly, all such variations, modifications, and embodiments are to be regarded as being within the spirit and scope of the present general inventive concept. For example, regardless of the content of any portion of this application, unless clearly specified to the contrary, there is no requirement for the inclusion in any claim herein or of any application claiming priority hereto of any particular described or illustrated activity or element, any particular sequence of such activities, or any particular interrelationship of such elements. Moreover, any activity can be repeated, any activity can be performed by multiple entities, and/or any element can be duplicated. While example embodiments have been illustrated and described, it will be understood that the present general inventive concept is not intended to limit the disclosure, but rather it is intended to cover all modifications and alternate devices and methods falling within the spirit and the scope of the invention as defined in the appended claims. | 52,417 |
11857990 | Corresponding reference characters indicate corresponding parts throughout the drawings in accordance with an implementation. DETAILED DESCRIPTION Cold spray additive manufacturing (also “cold spray” or “CSAM” herein) is a material-deposition process where metal or metal-ceramic mixtures of powders (also referred to as “particles” herein) suspended in a gas propelled at supersonic speed are used to form a coating or freestanding structure. Specifically, cold spraying is defined herein as spraying a material at a temperature that is below the melting point of the material being sprayed. CSAM is a solid state process: neither the powders nor the substrate to which the powders are applied are melted during the process. Thus, use of CSAM provides material-deposition that does not cause thermally induced alterations to the substrate or powder (e.g., deformation, crystallization, imperfections, or other types of damage). Due to the direct impingement of the gases carrying the powders upon the substrate, cold spray generates a stationary shock wave and also a lateral flow of gas along the surface of the part subject to CSAM. As used herein, a stationary shock wave in the context of the flow of supersonic gas (also called a “stationary normal shock wave”) is a discontinuity that forms in order for the flow to meet some downstream condition (e.g., an obstacle or back pressure). When the back pressure becomes too great, the flow of gas cannot achieve supersonic speeds and is compressed at the nozzle before expanding. The presence of stationary shock waves thus detracts from optimal supersonic gas flow in CSAM systems and methods. Implementations of the disclosure also mitigate such stationary shock waves. High- and low-pressure cold spray is an emerging technology finding increasing applications in various types of structural repairs. In some implementations, cold spray is usable to repair metallic structures (e.g., airplane or helicopter components). A closer examination of an implantation of a CSAM apparatus and process is provided in the discussion ofFIG.5herein. Referring to the figures, implementations of the disclosure include systems and methods for cold spray additive manufacturing with gas recovery that provide a superior cost/benefit ratio in comparison to conventional cold spray implementations. Recapturing and reusing the gas enables potentially large cost savings and renders cold spray additive manufacturing far more commercially viable and efficient. The various implementations not only allow for the reuse of the gas, but also enable cold spray additive manufacturing to occur in situ in an open environment (e.g., repairs on an airplane in an airplane hangar). Because no cold spray booth is required, the implementations completely avoid the need for disassembly, shipping a damaged part to a repair facility, conducting repairs in a booth fitted with a gas recovery system, shipping back to the point of origin, and reassembly. Comparatively, conducting cold spray additive manufacturing-based repairs in situ in an open environment is efficient, far less expensive, and avoids entirely multiple vectors for new damage to parts involved in contemporary pre-existing cold spray processes as well as the associated follow-up costly repairs or replacements. The elements described herein in various implementations operate in an unconventional manner to provide systems and methods for cold spray additive manufacturing with gas recovery by utilizing a gas recovery nozzle. Implementations of the gas recovery nozzle are configured to attach to a supersonic nozzle used to conduct cold spray additive manufacturing. The gas recovery nozzle captures a lateral flow of gas from a part under repair and circulates the gas to a gas recovery sub-system. The gas recovery nozzle accomplishes this by creating an envelope over the supersonic nozzle that captures at least some of the gas that is deflected laterally on impact with the part under repair during cold spray additive manufacturing. The captured gas is circulated to the gas recovery sub-system. The gas recovery sub-system collects the captured gas into storage devices for later treatment (e.g., purification) and reuse in future cold spray additive manufacturing processes. Some implementations of the gas recovery nozzle further comprise a flexible coupling to control the standout distance from the gas recovery nozzle to the substrate of the part. Maintaining an efficient standout distance between the gas recovery nozzle and the substrate of the part: (1) prevents additive particles from clogging either the supersonic nozzle or the gas recovery nozzle, allowing for a higher sustained rate of gas recovery per unit time; (2) prevents a stationary shock wave of the gas recovery nozzle from interfering with a supersonic flow of gas; (3) focuses or redirects the supersonic flow of gas in a useful and beneficial way; and (4) provides an adequate sealing that increases the gas capture rate. Effects of various standout distances on various implementations of the disclosure are discussed elsewhere herein. Further, the gas recovery nozzle acts as a suppressor for the supersonic nozzle, significantly reducing the very high decibel noise, and the associated disruption (e.g., from hearing damage or an inability to hear shouted warnings in a work area), typical of cold spray additive manufacturing solutions. In some implementations, the flexible coupling is a single component; in other implementations the flexible coupling is a mechanism with more than one component. Multi-part flexible couplings include but are not limited to flexible couplings assembled using petal joins. The implementations of the present disclosure are thus superior to typical implementations of cold spray additive manufacturing systems and methods that fail completely to capture and reuse gas when repairs are conducted in situ without disassembly and use of a repair booth. The performance of implementations of the systems and methods for cold spray additive manufacturing with gas recovery disclosed herein, as measured by the ability to capture and reuse supersonically-propelled gas propelling particles onto a substrate, substantially equals and sometimes exceeds conventional existing contemporary systems and methods for cold spray additive manufacturing with gas recovery having designs that introduce inherent and unavoidable loss of supersonically-propelled gas. The disclosure is thus mechanically more robust and more cost effective to implement, while at the same time being more effective than conventional systems and methods for cold spray additive manufacturing at both enabling reuse of supersonically-propelled gas and in-situ repairs. Referring again toFIG.1, a cross-sectional side elevation view illustrates an implementation of a gas recovery nozzle100in accordance with an implementation. The gas recovery nozzle100comprises a main body102configured to attach to a supersonic nozzle180and a first end104having angled walls106at an opening108defining a gas flow path110from the supersonic nozzle180. In some implementations, a larger diameter opening is thereby defined at the distal end by an angled wall portion between laterally or longitudinally (e.g., straight) extending wall portions extending outward from a distal end of the supersonic nozzle. The first end104can take different shapes and configurations, such as having curved or arcuate walls that are continuously or gradually increasing or decreasing in curvature. That is, the present disclosure contemplates different conical shaped ends, or ends having different angled openings. It should be noted that the first end104is illustrated as being located within the main body102. However, the first end104in some implementations extends to the end of the main body102. In various implementations the first end104is co-axial with the main body102. The gas recovery nozzle100further comprises a passage112extending from the first end104to a second end114. The first end104is a distal end and the second end114is a proximal end relative to the supersonic nozzle180. The gas recovery nozzle100further comprises a cavity116surrounding the passage112. The cavity116is configured to collect at least some gas160expelled from the supersonic nozzle180. In some implementations, an open end140of the cavity116at a part side142comprises curved walls144(e.g., arcuate shaped). In some other implementations, the open end140of the cavity116extends farther distally than the opening108at the first end104(and has a greater diameter than the first end104such that a space is defined between a gas flow path having the opening108, and an inner surface of the main body102). That is, the conical shaped first end104is positioned concentrically within the main body102and does not extend to the open end140. The curved wall144is shaped and/or configured to facilitate capture of the expelled gas160after impinging on a part152. In some implementations, the gas160comprises an at least one of Helium or Nitrogen gas. In some implementations including the supersonic nozzle180, Helium is the preferred gas160. In the supersonic nozzle180, the speed of the gas160correlates with the speed of sound and the Mach number of the gas160. For Helium, the speed of sound at standard atmospheric conditions is 1007 m/s (1620 k/s). For Nitrogen, the speed of sound at standard atmospheric conditions is only 349 m/s (561 k/s). This translates into higher particle velocities when Helium is used versus when Nitrogen is used. Thus, if cost and availability are not deciding factors (that is, if the disclosure herein is implemented such that the gas160is reusable across cold spray sessions), then Helium provides superior performance in CSAM applications versus Nitrogen. The cavity116defines a gas recovery path162that leads to an outlet118. That is, the gas recovery nozzle100further comprises the outlet118within the main body102configured to connect to a gas recovery sub-system190. In some implementations, the outlet118comprises an opening120configured to connect to a compressor pump192of the gas recovery sub-system190. In some implementations including the compressor pump192, a gas diffuser196is provided at the opening120of the cavity116, which can be located inside, outside, or both inside and outside the cavity116. The gas diffuser is constructed of an open pore metallic foam (e.g., ALUPOR™ cast aluminum metallic foam) or any mechanically equivalent material or component (e.g., a RADNOR® 14 Series gas diffuser). The gas diffuser196is configured to slow the flow of the gas160inside the cavity116to the opening120. The gas diffuser196facilitates at least one of slowing the flow of gas160or directing the flow of gas160to the compressor pump192. Other implementations replace or complement the compressor pump192with another suitable type of pump, a turbofan, or any other mechanically suitable mechanism configured to pull the gas160into the gas recovery sub-system190. In some other implementations, the outlet118comprises an opening120configured to connect to a movable gas recovery tank194. In some implementations, more than one moveable gas recovery tank194is connected to the opening120. In implementations including the moveable gas recovery tank194, the compressor pump192, other suitable type of pump, the turbofan, vacuum, or any other mechanically suitable mechanism configured to both intake the gas160into the gas recovery sub-system190is further configured to ensure that the greatest possible volume of the gas160is compressed into and stored in the moveable gas recovery tank194. Once the gas160is stored, the gas160is available for purification and reuse with suitable processes and apparatuses as described elsewhere herein (see, e.g., the discussion ofFIG.5). In some implementations, purification includes removal of Oxygen and other matter that is not the gas160. In some implementations, the main body102is tubular and configured to surround an end182of the supersonic nozzle180. In some other implementations, the main body102is configured as a removable cover130to capture a flow of gas160from the supersonic nozzle180and circulate the gas160to the gas recovery sub-system190. That is, the main body102is removably coupled to the supersonic nozzle180, which may include mechanical attachment (e.g., bolt or screw attachment to a portion of the base of the supersonic nozzle180) to secure the main body102thereto. That is, in some implementations, the gas recovery nozzle100is fixed proximate to the supersonic nozzle180by at least one screw or other mechanically suitable fastener. Some implementations of the gas recovery nozzle100further comprise a flexible coupling150attached to the first end104and configured to engage the part152. The part152is any item (e.g., portion of an aircraft or helicopter) requiring CSAM repair processes. In some implementations, the flexible coupling150is ring-shaped and positioned proximate to the substrate of the part152and forms at least a partial seal between the gas recovery nozzle100and the part152. When forming at least a partial seal, the flexible coupling150comprises a gas capture cover154. The flexible coupling150is constructed of at least one of an elastomer, flexible metallic material, or other mechanically suitable material that is sufficiently durable to provide an acceptable service lifetime before needing replacement, and also able to conform to the contours and dimensions of variously shaped parts152. The flexible coupling150, which is configured as a gas capture cover154in the illustrated implementation, addresses the standout distance effect, which has considerable performance implications for any implementation of CSAM in general and the gas recovery nozzle100in particular. If the standout distance between the gas recovery nozzle100and the part152is too small, the gas recovery nozzle100will be subject to clogging and other phenomenon having a deleterious performance impact and eventually requiring cleaning or even replacement. If the standout distance between the gas recovery nozzle100and the part152is too great, the performance of the gas recovery nozzle100degrades, leading to the escape of some or even all of the gas160otherwise subject to capture by the gas recovery nozzle100. The flexible coupling150addresses the standout distance effect by (1) providing superior control of the exact standout distance during any CSAM repair session versus implementations not using the flexible coupling150, and (2) in some implementations, directly contacting or almost contacting the substrate of the part152to further reduce the amount of used gas able to escape recapture. In some implementations, the flexible coupling150further comprises a spring or mechanical or electrical actuator to maintain such contact or partial contact. In some implementations, the flexible coupling150is a single component; in other implementations the flexible coupling150is a mechanism with more than one component. Multi-part flexible couplings150include but are not limited to flexible couplings150assembled using petal joins. Modelling and experiments using implementations of the present disclosure indicate that negligible or zero gas recovery occurs when the standout distance is greater than or equal to one millimeter. Various such models and experiments using standout distances less than one millimeter demonstrate recovery of at least fifty percent to at least ninety percent of the gas160used in a particular CSAM session incorporating the gas recovery nozzle100fitted with the flexible coupling150, depending on the standout distance. These models and experiments further indicate that implementations using a standout distance of 0.5 millimeters perform well, and the performance of implementations using 0.25 or less millimeters is optimal.FIG.1illustrates the gas recovery nozzle100comprising the flexible coupling150configured to mitigate the standout distance effect described above. By contrast,FIG.5as discussed elsewhere herein illustrates an implementation of a gas recovery nozzle not including the flexible coupling150, demonstrating that implementations of the disclosure are still functional even when a flexible coupling or gas capture cover is not present to mitigate the standout distance effect. Some implementations of the gas recovery nozzle100further comprise a heat transfer device170proximate to the supersonic nozzle180and the main body102. The heat transfer device170is configured to regulate a temperature of the gas160such that the gas recovery nozzle100is protected from heat-induced damage from a flow of the gas160. In some such implementations, the heat transfer device170further comprises a liquid cooling system. The heat transfer device170is any suitable device for transferring waste heat. Depending on the requirements of a particular application of an implementation of the gas recovery nozzle100, the heat transfer device170is at least one of a heat pipe, heat sink, liquid cooling tube, or any other suitable heat transfer device or mechanism that is capable of transferring waste heat away from the gas160and or the gas recovery nozzle100. The gas expansion will reduce the temperature of the gas proximate to the first end104, cooling is more relevant close to the second end114. In some implementations, the heat transfer device170is an open system, such as a liquid cooling tube wherein the fluid flowing through the liquid cooling tube is in thermal communication with one or more additional heat transfer devices, such as a heat sink such that heat may be transferred from the heat transfer device170to the heat sink. For instance, the heat sink can be cooled with air, liquid, or a fan, or the heat sink can be a cold plate, or any other suitable heat sink. In some other implementations, waste heat carried by the heat transfer device170is dissipated into space using protrusions in thermal communication with the heat transfer device170. In some other implementations, the heat transfer device170is a closed system (e.g., a pulsating heat pipe (“PHP”) or loop heat pipe (“LHP”)). Each of the PHP and LHP are passive devices that operate under pressure differences caused by heat to force heated fluid to propagate toward a heat sink or other location where waste heat is withdrawn from the fluid. In yet other implementations, the heat transfer device170utilizes various configurations of heat pipes, such as straight, curved, crossing, or any number of configurations for achieving a desired amount of cooling. The heat transfer device170is configuration in various implementations to surround at least a portion of the main body102and be positioned between the main body102and the supersonic nozzle180. FIG.2is a side elevation illustration of a spray path of an implementation of a cold spray additive manufacturing system200in use in accordance with an implementation. The cold spray additive manufacturing system200does not show a gas recovery nozzle (e.g., the gas recovery nozzle100ofFIG.1), but instead illustrates how gas208(e.g., the gas160ofFIG.1) is lost when the gas recovery nozzle is not present. A nozzle202(e.g., the supersonic nozzle180ofFIG.1) propels additive particles204along the additive vector210to a substrate206through the nozzle202at a supersonic speed using the gas208to perform cold spray additive manufacturing of a part212. While the additive particles204bond to the part212as described inFIG.5herein, the used gas escapes laterally along the substrate of the part212, on the escape vector220. Without use of the gas recovery nozzle as disclosed elsewhere herein, all of the gas208is lost along the escape vector220and cannot be reused. In some implementations, there are multiple escape vectors220, each with a different direction. Gas traversing along any of the escape vectors220is permanently lost. FIG.3is a flowchart illustrating a method300for performing cold spray additive manufacturing of a part (e.g., the part152) in accordance with an implementation. In some implementations, the process shown inFIG.3is performed by, at least in part, a gas recovery nozzle, a supersonic nozzle, a heat transfer device, and a gas recovery sub-system, such as the gas recovery nozzle100, the supersonic nozzle180, the heat transfer device170, and the gas recovery sub-system190inFIG.1. The method300propels particles to a substrate through a nozzle at a supersonic speed using a gas to perform cold spray additive manufacturing of a part at operation302, captures a flow of the gas propelled from an end of the nozzle at operation304, and circulates the flow of the gas to a gas recovery system at operation306. The method300allows for in-situ cold spray additive manufacturing of a part. In some implementations, the substrate comprises at least one of the original substrate of a part or material (e.g., particles) applied previously to the original substrate (e.g., via a previous application of a CSAM method). Thereafter, the process is complete. While the operations illustrated inFIG.3are performed by, at least in part, a gas recovery nozzle, a supersonic nozzle, a heat transfer device, and a gas recovery sub-system, aspects of the disclosure contemplate performance of the operations by other entities. In some implementations, a cloud service performs one or more of the operations (e.g., by controlling the nozzle to cause particles to be propelled to a substrate through a nozzle at a supersonic speed using a gas to perform cold spray additive manufacturing of a part). In some implementations of the method300, the propelling of particles comprises structurally repairing the part in situ as further described elsewhere in this disclosure. In some other implementations, the gas comprises an at least one of a high-pressure Helium or Nitrogen gas. In yet other implementations, the gas comprises an at least one of a low-pressure Helium or Nitrogen gas. FIG.4is a flow chart illustrating another method400for performing cold spray additive manufacturing of a part (e.g., the part152) in accordance with an implementation. In some implementations, the method shown inFIG.4is performed by, at least in part, a gas recovery nozzle, a supersonic nozzle, a heat transfer device, a gas recovery sub-system, a flexible coupling, and a gas capture cover, such as the gas recovery nozzle100, the supersonic nozzle180, the heat transfer device170, the gas recovery sub-system190, the flexible coupling150, and the gas capture cover154inFIG.1. The method400uses a flexible coupling attached to an end of the nozzle to seal a gas capture cover, coupled to the nozzle, to the part at operation402. Operations404,406, and408are similar to operations302,304, and306of the method300depicted inFIG.3, and accordingly the description will not be repeated. The method400accommodates for variations in standout distances as described in more detail herein. Thereafter, the process is complete. While the operations illustrated inFIG.4are performed by performed by, at least in part, a gas recovery nozzle, a supersonic nozzle, a heat transfer device, a gas recovery sub-system, a flexible coupling, and a gas capture cover, aspects of the disclosure contemplate performance of the operations by other entities. In some implementations, a cloud service performs one or more of the operations (e.g., by controlling the nozzle to cause particles to be propelled to a substrate through a nozzle at a supersonic speed using a gas to perform cold spray additive manufacturing of a part). An operating environment is illustrated inFIG.5showing a block diagram of an implementation of a system500for performing cold spray additive manufacturing with gas recovery in accordance with an implementation. The system500comprises a robotic control system502configured to control a cold spray apparatus504. In some implementations, the robotic control system further comprises a robotic positioning arm516(e.g., robotically controlled mechanical arm). In some implementations, the robotic control system502is a manual or at least partially automated apparatus. In some such implementations, the robotic control system is controllable using a computing device, such as the computing device800ofFIG.8herein. In some implementations, the robotic positioning arm516is at least a five-axis positioning system that includes two axes for positioning in a plane of the part under repair, one axis for the standout distance, and two additional axes for additional requisite positioning. Alternatively, the robotic positioning arm516is at least a two axis positioning system for XY positioning in the plane of part under repair and a rolling system that maintains parallelism and standout distance with the substrate of the part under repair. The robotic positioning arm516, in some implementations, is an ADEPT® Viper robot from Omron Adept Technologies, Inc. The cold spray apparatus504of the system500further comprises a supersonic nozzle535(e.g., implemented as the supersonic nozzle180ofFIG.1) and is configured to perform cold spray additive manufacturing of a part506(e.g., the part152ofFIG.1). In some implementations, the cold spray apparatus504is further configured to cold spray a powder530onto a substrate551of the part506. In such implementations, the cold spray apparatus504further comprises a source518of gas512connected to a gas control module520. The gas control module520controls the flow of the gas512through a first line515connected to the supersonic nozzle535and through a second line520connected to a powder chamber531and then to the supersonic nozzle535. The cold spray apparatus504additionally comprises a heater525that heats the gas512to a requisite temperature prior to entrance of the gas512into the supersonic nozzle535. In some implementations, the substrate551is also heated to further facilitate mechanical bonding. In operation, the gas512flows through the first line515and the second line520causing the powder530located within the powder chamber531to be sprayed in a supersonic gas jet from the supersonic nozzle535as a particle stream540. The particle stream540is sprayed at a temperature below the melting point of the powder530and travels at a supersonic velocity from the supersonic nozzle535. In some implementations, the particle stream540travels at several times the speed of sound. (The exact speed of sound at a given time varies depending on local conditions). In some implementations, the particle stream540travels at least two- to four-times the speed of sound. The particle stream is deposited on the substrate551of the part506, whereby on impact on the substrate551, particles of the particle stream540undergo plastic deformation due to the supersonic velocity of the particle stream540and bond to each other and the substrate551of the part506using mechanical energy. The heater525accelerates the speed of the particle stream540, but the heat from the heated gas512is not transferred to the bonding of the particles of the particle stream540. Thus, the heat cannot cause deformities, warping, stresses, or other deleterious impacts to the bonding. In some implementations, once the cold spray process is complete the substrate551is further processes, such as polished to create or restore a smooth finish. The system500further comprises a gas recovery nozzle508(e.g., implemented as the gas recovery nozzle100ofFIG.1). The gas recovery nozzle508comprises a main body (e.g., implemented as the main body102ofFIG.1) configured to attach to the supersonic nozzle; a first end (e.g., implemented as the first end104ofFIG.1) having angled walls (e.g., implemented as the angled walls106ofFIG.1) at an opening (e.g., implemented as the opening108ofFIG.1) defining a gas flow path (e.g., implemented as the gas flow path110ofFIG.1) from the supersonic nozzle and a passage (e.g., implemented as the passage112ofFIG.1) extending from the first end to a second end (e.g., implemented as the second end114ofFIG.1), the first end being a distal end and the second end being a proximal end relative to the supersonic nozzle. The gas recovery nozzle508further comprises a cavity (e.g., implemented as the cavity116ofFIG.1) surrounding the passage and configured to collect at least some gas512(e.g., such as the gas160ofFIG.1) expelled from the supersonic nozzle and defining a gas recovery path (e.g., implemented as the gas recovery path162ofFIG.1), and an outlet (e.g., implemented as the outlet118ofFIG.1) within the main body configured to connect to a gas recovery sub-system510(e.g., implemented the gas recovery sub-system190ofFIG.1). The gas recovery sub-system510is configured to connect to the outlet and also configured to collect at least some gas512expelled from the supersonic nozzle535through the gas recovery path into a storage device514(e.g., implemented as the moveable gas recovery tank194ofFIG.1). The gas512is thereby collected into the storage device514and is stored for treatment and reuse in the cold spray apparatus504. In some implementations, the gas recovery sub-system510further comprises a gas condenser560configured to condense at least some gas512in the storage device514, such that storage device514stores the greatest possible volume of at least some gas512. In some implementations, the gas condenser560is the compressor pump192ofFIG.1or an equivalent device. The storage device514is configured to be transportable to a purifier configured to remove all contaminants from at least some gas512such that at least some gas512is suitable for re-use in the cold spray apparatus504. ADDITIONAL EXAMPLES In general, there are two types of cold spray repair techniques. Non-Structural Cold Spray is concerned with adding thickness to a part. This technology has been developed and matured to the point that the United States Department of Defense has installed Non-Structural Cold Spray repair systems at many depots. Non-structural cold spray does not require the use of Helium carrier gas, due to less demanding mechanical requirements. Various implementations of the disclosure herein are targeted to Structural Cold Spray, which is concerned not merely with adding thickness to existing parts but reconditioning and repair of damaged, worn, or otherwise out of spec parts. Among other applications, Structural Cold Spray is suitable to repair corrosion, repair cracks, or restore tolerances/exact dimensions. Additionally, some implementations of Structural Cold Spray do not require stripping and reapply the finish of the part subject to repair. As disclosed herein, CSAM mechanically bonds particles to a substrate using purely mechanical energy, with no need for added adhesives. The implementations herein provide apparatuses, methods, and systems for using cold spray technology to conduct structural repairs in situ by capturing the flow of gas from the supersonic nozzle during a cold spray process and circulating the gas to a gas recovery sub-system for later reuse in additional cold spray processes. Some implementations of the gas recovery nozzle incorporate a cover (e.g., a flexible coupling) to capture the flow of gas and circulate the gas to the gas recovery sub-system. The disclosure herein operates at the point of repair to capture spent gas proximate to a supersonic nozzle via a gas recovery nozzle and store the gas for later purification and reuse. Unless otherwise stated, any implementation described herein as being incorporated into or being used in combination with a specific type of vehicle (e.g., an aircraft or helicopter) shall be understood to be installable into and usable with any other type of vehicle (e.g., trains, submersibles, tanks, armored personnel carriers, watercraft, etc.). Implementations of the disclosure herein are well-suited to repairing aircraft in-situ as described elsewhere herein, allowing the service life of such aircraft to be maximally extended at lesser cost. Cold spray is recognized by various organizations as a solution distinct from and advantageous over thermal spray. In particular, as aircraft enter the extreme ends of repeatedly extended service lifetimes, inevitably fleet fatigue causes cracks and other damage requiring structural repairs, part replacement, and part repair to keep the aircraft in service. This escalates the cost of keeping such aircraft flying due to requiring recurrent inspections to maintain air worthiness, eventual retrofits, and long lead times and high expenses associated with supply chain issues. Cold spray is especially well suited to perform these types of repairs in situ to rehabilitate existing parts of such aircraft (e.g., repairs performed on aircraft components in an aircraft hangar without disassembly), potentially significantly reducing maintenance costs and also lowing downtime for military aircraft platforms. In 2008 (with revisions following in 2011 and 2015), the United States Department of Defense adopted and promulgated MIL Spec MIL-STD-3021 (“DOD Manufacturing Process Standard, Materials Deposition, Cold Spray”). The MIL-STD-3021 standard has been adopted by various other organizations around the world. The disclosure herein is usable in a number of present military and commercial cold spray applications. Such applications include but are not limited to:Use by the United States Army through Maintenance Engineering Order T-7631 by the Program Office UH-60 Blackhawk for the repair of magnesium aerospace components;Use in maintenance and repair of landing gear hydraulics for the B1 Rockwell B-1 Lancer supersonic heavy bomber;Research by the U.S. Army Research Laboratory in collaboration with private industry for applications for additive manufacturing as diverse as near-net forming of shape charge liners, donor tubes for explosive cladding and sputter targets;Automotive repairs;Magnesium aerospace component repairs; andA growing number of worldwide RDT and E programs other qualified aerospace repair procedures worldwide. At the time of this disclosure, in cold spray applications using Helium without any means to recover and reuse the gas, the cost of each cold spray additive manufacturing repair session can include at least $1,000-$2,000 per hour in unrecoverable, single-use Helium expenditures. In many instances, this comprises the majority of the expense for such cold spray additive manufacturing repair sessions. Such sessions take more time and cost more money the more complex the part is that is under repair. Without a means to reuse the Helium, the commercial economic viability of CSAM repair is severely curtailed. Various implementations herein use a gas recovery sub-system (e.g., the gas recovery sub-system190ofFIG.1or510ofFIG.5) to gather and store used gas for later purification and reuse in future cold spray additive manufacturing processes. The disclosure is usable with a number of commercially available purification/purifier systems, including those both presently available and not yet released. In some implementations, the disclosure is usable with QUANTUMPURE CS™ and QuantumPure CS-TRI GAS™ Helium recovery and purification systems by Quantum Technology Corporation. At least a portion of the functionality of the various elements in the figures are in some implementations performed by other elements in the figures, and or an entity (e.g., a computer) not shown in the figures. In some implementations, the operations illustrated inFIG.3andFIG.4are performed by a single person, a group of persons, a fully- or partially-automated cold spray additive manufacturing with gas recovery system, or any combination of the foregoing. As an illustration, in some implementations the gas recovery nozzle, supersonic nozzle, heat transfer device, and gas recovery sub-system are each be provided by distinct suppliers to a wholly separate assembler who couples the gas recovery nozzle to the supersonic nozzle. While the aspects of the disclosure have been described in terms of various implementations with their associated operations, a person skilled in the art would appreciate that a combination of operations from any number of different implementations is also within scope of the aspects of the disclosure. Exemplary Operating Environment The present disclosure is operable within an aircraft manufacturing and service method according to an implementation as a method600inFIG.6. During pre-production of the aircraft, some implementations of method600include specification and design of the aircraft at operation602, and material procurement at operation604. During production, some implementations of method600include component and subassembly manufacturing at operation606and aircraft system integration at operation608. The aircraft undergoes certification and delivery at operation610in order to be placed in service at operation612. While in service of a customer, the aircraft is scheduled for routine maintenance and service at operation614. In some implementations, operation614comprises modification, reconfiguration, refurbishment, and other operations associated with maintaining the aircraft in acceptable, safe condition during ongoing flight operations. Systems and methods for cold spray additive manufacturing as disclosed herein are used during operation614. Each of the processes of method600are performable or practicable by a system integrator, a third party, or an operator (e.g., a customer). For the purposes of this disclosure, a system integrator comprises any number of aircraft manufacturers and major-system subcontractors; a third party comprises any number of vendors, subcontractors, and suppliers; and an operator comprises an airline, leasing company, military entity, service organization, and similar entities providing similar sales and leasing services. The present disclosure is operable in a variety of terrestrial and extra-terrestrial environments for a variety of applications. For illustrative purposes only, and with no intent to limit the possible operating environments in which implementations of the disclosure operate, the following exemplary operating environment is presented. The present disclosure is operable within an aircraft operating environment according to an implementation as an aircraft700inFIG.7. Implementations of the aircraft700include but are not limited to an airframe702, a plurality of high-level systems704, and an interior706. Some implementations of the aircraft700incorporate high-level systems704including but not limited to: one or more of a propulsion system708, an electrical system710, a hydraulic system712, and an environmental system714. Any number of other systems may be included in implementations of the aircraft700. Although an aerospace implementation is shown, the principles are applicable to other industries, such as the automotive and nautical industries. The present disclosure is operable with a computing apparatus according to an implementation as a functional block diagram800inFIG.8. In such an implementation, components of a computing apparatus818may be implemented as a part of an electronic device according to one or more implementations described in this specification. The computing apparatus818comprises one or more processors819which may be microprocessors, controllers or any other suitable type of processors for processing computer executable instructions to control the operation of the electronic device. Platform software comprising an operating system820or any other suitable platform software may be provided on the apparatus818to enable application software821to be executed on the device. According to an implementation, the cold spray additive manufacturing system as described herein may be implemented at least partially by software. Computer executable instructions may be provided using any computer-readable media that are accessible by the computing apparatus818. Computer-readable media may include, without limitation, computer storage media such as a memory822and communications media. Computer storage media, such as a memory822, include volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or the like. Computer storage media include, but are not limited to, RAM, ROM, EPROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that is usable to store information for access by a computing apparatus. In contrast, communication media may embody computer readable instructions, data structures, program modules, or the like in a modulated data signal, such as a carrier wave, or other transport mechanism. As defined herein, computer storage media do not include communication media. Therefore, a computer storage medium should not be interpreted to be a propagating signal per se. Propagated signals per se are not examples of computer storage media. Although the computer storage medium (the memory822) is shown within the computing apparatus818, it will be appreciated by a person skilled in the art, that the storage may be distributed or located remotely and accessed via a network or other communication link (e.g., using a communication interface823). The computing apparatus818may comprise an input/output controller824configured to output information to one or more output devices825, in some implementations a display or a speaker, which may be separate from or integral to the electronic device. The input/output controller824may also be configured to receive and process an input from one or more input devices826, in some implementations a keyboard, a microphone or a touchpad. In one implementation, the output device825may also act as the input device. A touch sensitive display is one such device. The input/output controller824may also output data to devices other than the output device, e.g., a locally connected printing device. In some implementations, a user may provide input to the input device(s)826and/or receive output from the output device(s)825. The functionality described herein is performable, at least in part, by one or more hardware logic components. According to an implementation, the computing apparatus818is configured by the program code when executed by the processor819to execute the implementations of the operations and functionality described. Alternatively, or in addition, the functionality described herein is performable, at least in part, by one or more hardware logic components. Without limitation, illustrative types of hardware logic components that are usable include Field-programmable Gate Arrays (FPGAs), Application-specific Integrated Circuits (ASICs), Program-specific Standard Products (ASSPs), System-on-a-chip systems (SOCs), Complex Programmable Logic Devices (CPLDs), Graphics Processing Units (GPUs). Thus, various implementations include systems and methods for performing cold spray additive manufacturing with gas recovery comprising propelling particles to a substrate through a nozzle at a supersonic speed using a gas to perform cold spray additive manufacturing of a part; capturing a flow of the gas propelled from an end of the nozzle; and circulating the flow of the gas to a gas recovery system. As described herein, the present disclosure provides systems and methods for cold spray additive manufacturing with gas recovery. The systems and methods herein efficiently and effectively construct and deploy within cold spray additive manufacturing with gas recovery system suitable for use in connection with repairs in situ of a number of moving vehicles, including but not limited to the above exemplary operating environment. While various spatial and directional terms, such as top, bottom, lower, mid, lateral, horizontal, vertical, front and the like may be used to describe the present disclosure, it is understood that such terms are merely used with respect to the orientations shown in the drawings. The orientations may be inverted, rotated, or otherwise changed, such that an upper portion is a lower portion, and vice versa, horizontal becomes vertical, and the like. As used herein, a structure, limitation, or element that is “configured to” perform a task or operation is particularly structurally formed, constructed, or adapted in a manner corresponding to the task or operation. For purposes of clarity and the avoidance of doubt, an object that is merely capable of being modified to perform the task or operation is not “configured to” perform the task or operation as used herein. Any range or value given herein is extendable or alterable without losing the effect sought, as will be apparent to the skilled person. Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as exemplary forms of implementing the claims. It will be understood that the benefits and advantages described above can relate to one implementation or can relate to several implementations. The implementations are not limited to those that address every issue discussed in the Background herein or those that have any or all of the stated benefits and advantages. The implementations illustrated and described herein as well as implementations not specifically described herein but within the scope of aspects of the claims constitute exemplary means for cold spray additive manufacturing with gas recovery. The order of execution or performance of the operations in implementations of the disclosure illustrated and described herein is not essential, unless otherwise specified. That is, the operations may be performed in any order, unless otherwise specified, and examples of the disclosure may include additional or fewer operations than those disclosed herein. As an illustration, it is contemplated that executing or performing a particular operation before, contemporaneously with, or after another operation is within the scope of aspects of the disclosure. When introducing elements of aspects of the disclosure or the implementations thereof, the articles “a,” “an,” “the,” and “said” are intended to mean that there are one or more of the elements. The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements. The term “exemplary” is intended to mean “an example of” The phrase “one or more of the following: A, B, and C” means “at least one of A and/or at least one of B and/or at least one of C.” Having described aspects of the disclosure in detail, it will be apparent that modifications and variations are possible without departing from the scope of aspects of the disclosure as defined in the appended claims. As various changes could be made in the above constructions, products, and methods without departing from the scope of aspects of the disclosure, it is intended that all matter contained in the above description and shown in the accompanying drawings shall be interpreted as illustrative and not in a limiting sense. It is to be understood that the above description is intended to be illustrative, and not restrictive. As an illustration, the above-described implementations (and/or aspects thereof) are usable in combination with each other. In addition, many modifications are practicable to adapt a particular situation or material to the teachings of the various implementations of the disclosure without departing from their scope. While the dimensions and types of materials described herein are intended to define the parameters of the various implementations of the disclosure, the implementations are by no means limiting and are exemplary implementations. Many other implementations will be apparent to those of ordinary skill in the art upon reviewing the above description. The scope of the various implementations of the disclosure should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means-plus-function format and are not intended to be interpreted based on 35 U.S.C. § 112(f), unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure. This written description uses examples to disclose the various implementations of the disclosure, including the best mode, and also to enable any person of ordinary skill in the art to practice the various implementations of the disclosure, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the various implementations of the disclosure is defined by the claims, and includes other examples that occur to those persons of ordinary skill in the art. Such other examples are intended to be within the scope of the claims if the examples have structural elements that do not differ from the literal language of the claims, or if the examples include equivalent structural elements with insubstantial differences from the literal language of the claims. CLAUSES The following clauses describe further aspects: Clause Set A: A1. A gas recovery nozzle comprising:a main body configured to attach to a supersonic nozzle;a first end having angled walls at an opening defining a gas flow path from the supersonic nozzle;a passage extending from the first end to a second end, the first end being a distal end and the second end being a proximal end relative to the supersonic nozzle;a cavity surrounding the passage and configured to collect at least some gas expelled from the supersonic nozzle and defining a gas recovery path;an outlet within the main body configured to connect to a gas recovery sub-system. A2. The gas recovery nozzle of any preceding clause, wherein the outlet comprises an opening configured to connect to a compressor pump of the gas recovery sub-system; and wherein the cavity further comprises a gas diffuser;the gas diffuser configured to slow the flow of the at least some gas inside the cavity to the opening;whereby the gas diffuser facilitates at least one of slowing the flow of the at least some gas or directing the flow of the at least some gas to the compressor pump. A3. The gas recovery nozzle of any preceding clause, wherein the outlet comprises an opening configured to connect to a movable gas recovery tank. A4. The gas recovery nozzle of any preceding clause, wherein the gas comprises an at least one of Helium or Nitrogen gas. A5. The gas recovery nozzle of any preceding clause, wherein the main body is tubular and configured to surround an end of the supersonic nozzle. A6. The gas recovery nozzle of any preceding clause, wherein the main body is configured as a removable cover to capture a flow of gas from the supersonic nozzle and circulate the gas to the gas recovery sub-system. A7. The gas recovery nozzle of any preceding clause, wherein the main body is configured as a removable cover to suppress noise during a cold spray process wherein gas is expelled from the supersonic nozzle. A8. The gas recovery nozzle of any preceding clause, wherein an open end of the cavity at a part side comprises curved walls. A9. The gas recovery nozzle of any preceding clause, wherein the open end of the cavity extends farther distally than the opening at the first end. A10. The gas recovery nozzle of any preceding clause, further comprising a flexible coupling attached to the first end and configured to engage a part. Clause Set B: B1. A method for performing cold spray additive manufacturing, the method comprising:propelling particles to a substrate through a nozzle at a supersonic speed using a gas to perform cold spray additive manufacturing of a part;capturing a flow of the gas propelled from an end of the nozzle; andcirculating the flow of the gas to a gas recovery system. B2. The method of any preceding clause, wherein the propelling of particles comprises structurally repairing the part in situ. B3. The method of any preceding clause, wherein the gas comprises an at least one a of a high-pressure Helium or Nitrogen gas. Clause Set C: C1. A system for performing cold spray additive manufacturing with gas recovery (500), comprising:a robotic control system configured to control a cold spray apparatus;the cold spray apparatus having a supersonic nozzle, the cold spray apparatus configured to perform cold spray additive manufacturing of a part;a gas recovery nozzle comprising:a main body configured to attach to the supersonic nozzle;a first end having angled walls at an opening defining a gas flow path from the supersonic nozzle;a passage extending from the first end to a second end, the first end being a distal end and the second end being a proximal end relative to the supersonic nozzle;a cavity surrounding the passage and configured to collect at least some gas expelled from the supersonic nozzle and defining a gas recovery path;an outlet within the main body configured to connect to a gas recovery sub-system; andthe gas recovery sub-system configured to connect to the outlet and also configured to collect at least some gas expelled from the supersonic nozzle through the gas recovery path into a storage device;whereby at least some gas collected into the storage device is stored for treatment and reuse in the cold spray apparatus. C2. The system of any preceding clause, wherein the robotic control system further comprises a robotic positioning arm. C3. The system of any preceding clause, wherein the cold spray apparatus is further configured to cold spray a powder onto a substrate of a part, the cold spray apparatus further comprising:a source of gas connected to a gas control module, the gas control module controlling the flow of the gas through a first line connected to the supersonic nozzle and through a second line connected to a powder chamber and then to the supersonic nozzle;a heater that heats the gas to a requisite temperature prior to entrance of the gas into the supersonic nozzle;the gas flowing through the first line and the second line causing the powder located within the powder chamber to be sprayed in a supersonic gas jet from the supersonic nozzle as a particle stream, the particle stream being sprayed at a temperature below the melting point of the powder;the particle stream travelling at a supersonic velocity from the supersonic nozzle and being deposited on the substrate of the part;whereby on impact on the substrate, particles of the particle stream undergo plastic deformation due to the supersonic velocity of the particle stream and bond to each other; andwhereby the heater accelerates the speed of the particle stream, but the heat from the heated gas is not transferred to the bonding of the particles of the particle stream. C4. The system of any preceding clause, wherein the gas recovery sub-system further comprises:a gas condenser configured to condense the at least some gas in the storage device, such that storage device stores the greatest possible volume of at least some gas;the storage device configured to be transportable to a purifier;the purifier being configured to remove all contaminants from the at least some gas such that the at least some gas is suitable for re-use in the cold spray apparatus. | 56,232 |
11857991 | DESCRIPTION The plastic molded scrubber of the present invention generally functions in the same manner as the wet scrubber disclosed in U.S. Pat. No. 8,241,405 (B2) issued to the same inventor, the entire disclosure of which patent is hereby expressly incorporated by reference. Taking the internal shape of the scrubber of the present invention into consideration, it was determined that a rotational molding process could be used to fabricate a structure with a small number of separate components including a main body, a front exhaust extension, and a back exhaust extension. In this process, commonly used for kayak fabrication, the mold is shaped to match the desired exterior shape of the scrubber. The amount of material is calculated to generate a certain wall thickness. The molding material is placed inside the mold and the mold is warmed and rotated until the material is melted and covers as uniformly as possible the interior of the mold. The mold is subsequently cooled. The solidified part is then extracted. The part is typically a fully enclosed shape. The openings, discussed below, for the inlet and outlet in the scrubber are cut after the molding process is completed. Other molding processes may be used to form the scrubber of the present invention. While the scrubbers of the present invention can be made out of any various plastic materials that are mechanically suitable, preferred materials for a particular use should be able to withstand chemical or solvents that are present in the fluids to be processed. Polyolefin resins are typically used for rotational molding, with thermoplastic polymers of ethylene being most often used. For general purposes it was determined that High Density Polyethylene (HDP) and Low Density Polyethylene (LHP) are particularly suitable for forming the scrubber of the present invention. Due to the limitations involved in molding a plastic scrubber, nozzle inserts were developed during the course of the present invention to provide for adjustment of airflow that correspond or reflect changes in operating conditions of the overall system in which the scrubbers of the present invention are incorporated in. Details about such a nozzle insert as well as its components and advantages are discussed below. Use of the scrubber will be described below in reference to a downdraft paint spray booth as disclosed in U.S. Pat. Nos. 8,241,405 (B2) and 9,981,281 (B2), the complete disclosures of which are hereby expressly incorporated by reference, it being noted that the scrubber could be used in other types of paint booths, including semi-downdraft paint booths. Typical automotive spray booths are manufactured in modular sections that are repeated lengthwise to create the complete booth. As seen inFIG.1, a modular paint spray booth1includes an upper or spraying section2and an under or capturing section3. The upper section2is in fluid communication with an air supply4, such as conditioned air blown in from outside the booth. Some of this air from the air supply4may be directed through filters5to a spraying area6that contains a plurality of paint spray guns7. As a workpiece, which for illustration purposes, is an automobile body8, enters the spraying area6, the paint spray guns7are activated to deliver paint to the body8. During this spraying process, paint that does not stick to the body8floats in the air as paint mist or overspray. With the assistance of an exhaust fan connected to the booth by exhaust duct9, the flowing air and paint mist are directed from the spraying area6, through a floor grating10and towards an inlet11of a wet scrubber12, the details of which, according to the present invention, are further discussed below. Depending on the amount of air flow handled by the paint spray booth1, the module of the paint spray booth1may include one or more wet scrubbers12with a common central inlet or individual inlets. The under section3further includes an exhaust enclosure13. Within the exhaust enclosure13, the water and scrubbed air exit the wet scrubber12by way of a flow director or exhaust extension14that empties the water onto a floor15of the exhaust enclosure13, which may be the floor of the under section3. Ideally, the water containing the paint particles captured in the wet scrubber12flows out of an outlet16of the exhaust extension14, along the floor15of the exhaust enclosure13and into a sluice17. Preferably, the floor15of the exhaust enclosure13is sloped toward the sluice17. From the sluice17, the paint laden water18may be collected for treatment and recycling or disposal, as desired. The exhaust extension configuration described previously is substantially similar in operation and overall configuration to that of the scrubber described in U.S. Pat. No. 8,241,405 (B2), which is hereby expressly incorporated by reference. Air exiting the outlet16of the exhaust extension14is routed toward an exhaust plenum19of the exhaust assembly9, but may have a minimal amount of paint particles and water droplets suspended therein. To capture the residual water droplets and paint particles, en route to the exhaust plenum19, the air proceeds through a plurality of baffles or mist eliminators20where the residual paint particles and water droplets are further collected. Finally, the air passes through the exhaust assembly9where it may be directed through a final exhaust filter or filter system (not shown) before it is discharged into the surrounding environment. In one configuration of a wet scrubber12, the inlet11of the wet scrubber12is mounted in a sealed manner to what is known as a flooded floor21, which is a floor having a film or flow of water that is also directed to the inlet11. In the described embodiment the inlet11is provided as a separate component and may be formed of sheet-metal which facilitates attachment to flooded floor21in a sealed manner. Moreover, forming the inlet11of metal provides enhanced protection against damage due to drop parts etc. within spraying area6. Since the inlet11provides the only exit path for the paint laden air from the spraying area6, a mixture of water from the flooded floor21and air entrained with paint particles enters the inlet11of the wet scrubber12together. As described below, in accordance with the present invention, the inlet11and a nozzle insert24are mounted in a sealed manner to the flooded floor21of a paint booth1and to the inlet of the scrubber so that the paint laden air from the spraying area6mixed with water from the flooded floor21enter the inlet11of the scrubber flowing through the nozzle insert24and exits from the bottom of the nozzle insert24into the wet scrubber12. With reference toFIGS.2and3, wet scrubber12forming one aspect of the present invention is formed of a body including an inlet11, a mixing chamber22, and a pair of vortex chambers23, with the body connected with an exhaust extension14. A nozzle insert24is a separate component placed into the inlet11. The inlet11as depicted inFIGS.2and3has a substantially rectangular or square cross-section, it being understood that other cross-sectional configurations could be used. The body of wet scrubber12is molded from a plastic material such as HDP or LDP as discussed above. A nozzle insert24is configured to be received in the inlet11of the wet scrubber12. As discussed below the nozzle insert24is used to optimize the speed and mass flow rate of the air entrained with paint that enters the mixing chamber22of the wet scrubber12. Preferably, the nozzle insert24is positioned in substantially the center of the wet scrubber12to provide optimal delivery of air entrained with paint and water to the mixing chamber22and the vortex chamber23. Proceeding from the inlet11to the outlet26of the nozzle insert24, the nozzle insert24has a decreasing cross-sectional area. This change in dimension results in the speed of the air flow increasing as it proceeds through the nozzle insert24. As discussed below, the sides of the nozzle insert24are angled inward from top to bottom at an angle or configuration that can optimize the speed of the air entrained with paint that exits the nozzle insert24. The scrubber inlet11can be conveniently welded to structure of the flooded for floor21. As mentioned above the nozzle inlet11and insert24are preferably formed of metal which is more conveniently attached by welding to other metal components and further is more damage resistant in the environment of the spray booth interior. When the nozzle insert24is inserted into the mixing chamber22it can be sealed against the interior surface of the inlet11by use of caulking, gaskets etc. One approach for attaching the inlet11to the main body of scrubber12is provided via attachment flanges60and62connected together via mechanical fasteners64. The mixing chamber22includes an impingement pool27positioned adjacent to the outlet26of the nozzle insert24. Water flowing down the nozzle insert24is collected in the impingement pool27. The air proceeding down the nozzle insert24strikes the water in the impingement pool27, thereby mixing with the water. Because of the turbulence created by this mixing, some of the paint particles in the air become transferred to the water and stay suspended therein. Hence, the water serves to “trap” these particles. To increase this turbulence and assist with substantially evenly diverting the air into the vortex chambers23, the mixing chamber22includes a flow divider28, which also provides stability to the flow inside the wet scrubber12. As shown inFIG.2, the flow divider28forms joined curved surfaces29a,29bof the impingement pool27, such that the apex of the divider28substantially forms a line having a width W1(seeFIG.3), which may be substantially equal to the width at the outlet26. Accordingly, at least a portion of the air and water that exits the outlet26engages the divider28and/or the curved surfaces29a,29b. Ideally, the divider28substantially evenly divides the air, thus providing a similar amount of air to each vortex chamber23. This helps to create a stable system which further increases efficiency and saves energy. Besides dividing the supply of air and water, the divider28causes further mixing of the air and water in the impingement pool27, thereby increasing the mixing of these fluids and trapping more paint particles in the water. The principle by which the flow divider28placed at the center of the impingement pool27may assist particulate capturing while pre-conditioning the mixture that enters the vortex chambers23is explained next. In a similar manner as described in U.S. Pat. No. 8,241,405 (B2), when entering the nozzle insert24through the inlet11, water coming from a flooded floor21of a paint booth1runs as a film over the internal surfaces of walls30of the nozzle insert24, while the paint laden air flows mainly through the center region of the nozzle insert24. Due to acceleration of the air in the nozzle insert24, the water film is broken into droplets that penetrate into the center region of the nozzle insert24where the air is flowing. However, it is possible that, at outlet26, segregated regions containing air entrained with overspray and a partially broken water film would still exist at the central and peripheral regions of the flow, respectively. The divider28further enhances capturing by bisecting these segregated regions and reversing their relative locations. For example, after being acted upon by the divider28, the region containing paint laden air enters the vortex chamber23at the peripheral region while the water film enters the vortex chamber23at the center region. Therefore, the paint laden air is “sandwiched” between the water film and the water contained at the bottom of the impingement pool27of the mixing chamber22. Since water is roughly three orders of magnitude heavier than air, as soon as the sandwiched region enters the vortex chambers23, the centrifugal force exerted squeezes the air and forces it through the water, hence, providing contact between the particles in the air and the water and, therefore, enhancing capturing. The wet scrubber12includes two vortex chambers23symmetrically positioned about the line Y-Y. As shown, the vortex chambers23are substantially cylindrical, each having an inner wall surface31. Upon entering the vortex chambers23, the air and some of the water from the impingement pool27and/or the outlet26, begin to circulate. Given the geometry of the vortex chambers23, the air/water mixture rotates around the chamber, thereby forming vortices. These vortices cause heavier particles, such as paint particles and water droplets, to move toward the outer periphery of the vortex chambers23and displace smaller droplets toward the center of the vortex where they stay colliding with other small droplets until they are big enough to precipitate to the outer periphery of the vortex chambers23. As these heavier particles contact one another, they join or coagulate to form bigger particles. Specifically, the centrifugal force on the air/water mixture propels large water droplets and paint particles toward the inner wall surface31of the vortex chambers23, which is covered with a water film. As the paint particles collide with the water on this surface, they become trapped in the water. With reference toFIG.3, the vortex chambers23may include a projection or protrusion, such as a rib32, projecting from the inner wall surface31of each vortex chamber23. As shown, the rib32extends less than halfway around the periphery of each vortex chamber23; however, the rib32may have a longer extension. Preferably, the rib32is attached approximately midway along the length of the vortex chamber23between end caps33of the vortex chambers23. This results in the rib32dividing the vortex chamber23into substantially equal sized sub-chambers23a,23b. The rib32functions in a way similar to that of flow divider28by dividing the volume of air entering sub-chambers23a,23bequally, thereby further stabilizing the vortex and enhancing capturing. Due to the high speed circulation flow in the vortex chambers23, the region at its center (the central vortex) has the lowest pressure. To reduce the pressure drop through the scrubber (that is, the difference between the pressure values at the inlet and outlet of the scrubber), this lowest pressure has to be returned to a higher pressure value at the exit, hence, recovering pressure energy. By conservation of energy, this pressure recovery process is achieved by smoothly decelerating the flow that exits the scrubber. This deceleration has to be done in such a way that no substantial recirculation appear at the outlet of the scrubber. After the air/water mixture goes through the vortex chambers23it enters the diffuser68. As shown inFIGS.2and3, a plurality of diffusers68are positioned on the wet scrubber12. Preferably, one diffuser68would be positioned at each end of each vortex chamber23. The diffusers68include a plurality of curved surfaces34extending away from the vortex chamber23. In other words, the surfaces34forming the diffuser68are curved in a opposite direction than the curvature of the vortex chambers23. This difference in curvature helps to prevent the exhausted air from recirculating back into the vortex chambers23, thereby resulting in a more efficient wet scrubber. Since the higher speed flow runs close to the peripheral regions of the vortex chamber23, the opposite curvature helps decelerate the flow in that region to better equalize the speed of the flow exiting the scrubber12. FIGS.2and3illustrate a nozzle insert24according to one embodiment of the present invention. The design of the nozzle insert24of the present invention was developed as a way to provide structures that function similar to the adjustable plates23aand23bin U.S. Pat. No. 8,241,405 (B2). In the preferred manner of fabricating the body of the scrubber of the present invention out of plastic by a rotational molding process it was determined that structures similar to the adjustable plates23aand23bin U.S. Pat. No. 8,241,405 (B2) could not be readily produced by the rotational molding process. Further in the case of using HDP or LHP as the material or choice structural elements cannot be glued or welded to the internal walls of the plastic scrubber or otherwise attached in any acceptable manner. In order to provide for adjustment of airflow in the plastic scrubbers of the present invention it was determined that nozzle insert24could be configured and used which replace the adjustable plates23aand23bin U.S. Pat. No. 8,241,405 (B2). Nozzle insert24may be formed of metal or another material. FIG.4depicts the manner in which the nozzle insert24is received in the inlet11of the wet scrubber12andFIG.2depicts the nozzle insert24positioned in the wet scrubber12. Proper alignment of the nozzle insert24in the wet scrubber12is achieved when the flow divider28(FIG.2) is received in alignment notch35that is formed in the bottom of the front and rear walls of the nozzle insert24. With reference toFIGS.5A and5Bthe nozzle insert24includes front and rear walls36and37that have alignment notches35formed centrally in the bottoms of the front and rear walls36and37. As discussed above when the nozzle insert24is inserted into the inlet11of the wet scrubber12and lowered downward the flow divider28of the wet scrubber12is received in alignment notches35to assist in properly aligning the nozzle insert24in the wet scrubber12. As depicted inFIGS.5A and5Bthe side walls38and39of the nozzle insert24taper or slant inward from the top to the bottom of the nozzle insert24. As can be understood by those skilled in the art, the degree to which the side walls38and39taper or slant inwardly affects the speed of the air entrained with paint that exits the nozzle insert24. According to the present invention, the adjustment of airflow for changes in operating conditions can be accomplished merely by providing nozzle insert24that is configured to produce different airflow characteristics and changing the nozzle insert24to accommodate or optimize operating conditions for a given system process. As can be understood, nozzle insert24of differing configurations can be exchanged by removing and installing each from the top of the scrubber12. This operation can be easily performed from the upper section2without having to access under section3as in other scrubber designs. In the case of scrubber inlet11and the nozzle insert24being formed of metal, the inlet11can be directly welded or otherwise affixed to the flooded floor21which facilitates installation. In addition, by forming the scrubber inlet11and the nozzle insert24of metal enhanced durability is provided in the case that hard heavy objects are dropped or otherwise inserted into the inlet of the scrubber. The insert inlet25at the top of the nozzle insert24has a funnel shape with an angle slightly larger than the local angle of the wall of the scrubber inlet11. This configuration allows the insert inlet25of the nozzle scrubber insert24to sit flush and to seal against the internal surface of the scrubber inlet11. As a result, the scrubbing liquid flowing down from the flooded floor21of a paint booth1enters the scrubber inlet11and continues toward the nozzle insert24, avoiding flow from the inlet to bypass the nozzle insert24. In one embodiment, the nozzle insert24is maintained in position by its own weight and by the pressure drop generated in the same nozzle insert24. To further avoid leaking between the nozzle insert24and the scrubber inlet11, the exterior edge of the nozzle insert24is provided with some caulking material. Of course, other means of maintaining the insert24in place and of avoiding leaks between the inlet11and the insert24are also possible. For example, the insert24could be held in place by using screws, pins, clips, etc. Also, leaks could be avoided by using gaskets, neoprene tape, or other sealing materials. FIGS.6A and6Bdepict frontal and side views of an exhaust extension14according to one embodiment of the present invention. The illustrated exhaust extension is molded from a similar plastic material as that from which the wet scrubber12is molded. Here it is noted that during the course of the present invention it was determined that the use of plastic materials such as HDP or LDP prevent materials from sticking on the surfaces of the molded scrubber and exhaust extension, thus providing a self-cleaning function that reduces or eliminates periodic manual cleaning. The general shape and function of the exhaust extension14is similar to that taught in U.S. Pat. No. 10,857,494 (B2) by the present inventor, the complete disclosure of which is hereby expressly incorporated by reference. Exhaust extension14is provided in the form of a generally rectangular or square cross-section closed duct with side walls40, a top wall41and a bottom wall42. Attached to end of the exhaust extension14and located laterally adjacent to the sides of the outlet16is a pair of wings43which extend from the side walls40. For simplicity and ease of fabrication, the wings43presented herein are flat and generally triangular in shape. The surface of the wings43, however, need not necessarily be flat or triangular. Rather, in the direction proceeding from the outlet of the wet scrubber12toward a distal end or tip44of the wings43, a curved shape may be employed. Specifically, partially circular, parabolic or other curved shapes could be used to efficiently provide a smooth and gradual deceleration of the flow of air out of the outlet16. The depicted triangular shape of the wings43could also be varied. For example, the tips44of the wings43may be rounded or otherwise truncated to avoid sharp points or edges that could be encountered during handling, installation or maintenance of the wet scrubber12. Additionally, the triangular shape of the wings43can be substituted with a rectangular shape, a rounded shape, a parabolic, etc. In each case, the wings43could be flat or curved (as previously discussed), all with the purpose of enhancing deceleration of the exhaust airflow and the further separation of any entrained water droplets. The outlet16of the exhaust extension14can be reinforced to prevent deformation created by the effect of airflow passing through the exhaust extension14, bending by the action of weight when the exhaust extension14is stored sideways before installation, deformation when the plastic material of the flow extension14dries and/or softens in a harsh environment, etc. According to one embodiment, such reinforcement can be accomplished by providing or molding ribs70that surround the opening of the outlet16and/or ribs that extend across the opening of the outlet16. Such reinforcement ribs can be molded or simply formed when cutting the outlet16into the plastic molded exhaust extension14. A flange45is formed so as to extend outwardly around the inlet of the exhaust extension14as shown. A similar flange46is attached so as to extend outwardly around the outlet of the wet scrubber12as shown inFIG.7. The inlet of the exhaust extension14is attached to the outlet of the main body of the scrubber12by placing a gasket (not shown) between the flanges45and46and securing the flanges45and46together by suitable mechanical fasteners50such as, clips, pins, threated elements such as bolts and nuts, etc. As shown inFIG.7on the ends of the vortex chambers23can be provided with embedded fastener elements47that can be used to secure the wet scrubber12beneath a flooded floor or other structure of a processing system. Non-limiting examples of embedded fasteners include threaded screws, rods, bolts, nuts, pins, etc. In the embodiment shown inFIG.7the embedded elements47are internally threaded nuts and, as show inFIG.7, the wet scrubber12is mounted to the illustrated overhead structure by means of brackets48that are secured to the embedded nuts47by threaded fasteners49. The location of the embedded fasteners are according to convenience or to minimize any interference with the flow inside the wet scrubber12. The plastic molded scrubbers of the present invention are very light in weight. As compared to a wet vortex scrubber having a similar design, shape and size and fabricated from metal, a plastic molded scrubber according to the present invention may provide a weight reduction on the order of 85%. This difference in weight becomes very significant when workers have to install wet scrubbers in the limited space inside the under section3(seeFIG.1) of a paint booth which may be as small as only 4 feet high. Reduction of weight also reduces labor cost of installation and replacement. The plastic material of the scrubber acts as a thermal insulator reducing heat transfer and enhancing the performance of the dehumidification effect provided by operation of the scrubber. While the design of the nozzle insert24described herein was driven by the inability to mold internal air adjustment plates in the plastic scrubbers of the present invention, the nozzle insert24can be used in metal wet scrubbers in place of typical or customary adjustment plates. An advantage associated with the use of the nozzle insert of the present invention is that they can be easily removed, replaced and exchanged from the top of a wet scrubber. In the case of fixed adjustment plates, they can be inadvertently contacted during cleaning or maintenance and go out of adjustment in which case they can only be accessed and manually readjusted from below. The configuration of the nozzle insert24presented here is for illustration purposes. Other configurations and designs are possible to achieve the same objective of controlling the optimum speed inside the wet scrubber12(seeFIG.2) while providing the advantage of being accessed and replaced from the upper section2of spray booth1(seeFIG.1). The embodiments described above were chosen to provide the best application to thereby enable one of ordinary skill in the art to utilize the disclosed inventions in various embodiments and with various modifications as are suited to the particular use contemplated. All such modifications and variations are within the scope of the invention. | 26,232 |
11857992 | DETAILED DESCRIPTION FIGS.1and2illustrate an acoustic wave microfluidic device10according to embodiments of the present invention. The device10may generally comprise an electroacoustic transducer12on a substrate14, and a power supply (not shown) to supply electromagnetic wave energy, such as RF power, to the electroacoustic transducer12. The device10may further comprise a source16to of a substance that is movable to the substrate14. The substance may comprise matter or material in a form that is movable from the source16to the substrate14by acoustic wave energy. The substance may comprise a liquid, a solid, a gas, or combinations or mixtures thereof. For example, the substance may comprise matter or material as a liquid, a solution, a dispersion, etc. The electroacoustic transducer12may comprise a large plurality of IDT electrodes arranged on a first surface18of the substrate14, an opposite second surface20of the substrate14, or a combination thereof. Other equivalent or alternative electroacoustic transducers may also be used. The substrate14may be a single crystal piezoelectric substrate, such as a rotated Y-cut of lithium niobate (LN) or lithium tantalate. For example, the substrate14may comprise a 128° rotated Y-axis, X-axis propagating lithium niobate crystal cut (128YX LN). Other equivalent or alternative piezoelectric substrates may also be used. Although not shown, one end of the substrate14may be mechanically secured and supported between two or more contact probes which provide RF power. Further, the one supported end of the substrate14may be mounted via one of more springs and/or fixtures on the first surface18opposite to the IDT finger electrodes12to create minimum contact area with the substrate14to minimise the damping out of the vibrational energy imparted to the substrate14by the electroacoustic transducer12. The substrate14may therefore protrude from its mechanical fixtures at the one resiliently-supported end in similar fashion to a tuning fork such that it allows for maximum acoustic vibration at an opposite free end of the substrate14. The source16of the substance may be arranged on, in or closely adjacent, in touching or non-touching relationship, to the first and/or second surfaces18,20of the substrate14via a side edge22of the substrate14, an end edge24of the substrate14, or a combination thereof. Referring toFIG.1, in one embodiment, the source16may comprise a reservoir26of a liquid substance and a wick28arranged to contact the side and/or end edges22,24of the substrate14. Referring toFIG.2, in another embodiment, the source16may comprise the reservoir24alone arranged to directly contact the end edge24of the substrate14. Other equivalent or alternative substance source arrangements may also be used. The electroacoustic transducer12and the substrate14may be configured to generate acoustic wave energy that is used both to move (eg, draw out, pull out and/or thin out) the liquid substance from the source16onto the substrate14as a thin liquid film, and to atomise or nebulise the thin liquid film. For example, in one embodiment of the device10, the acoustic wave energy may manifest as SAW propagating along the first surface18of the substrate14, the second surface20of the substrate14, or both the first and second surfaces18,20of the substrate14. That is, SAW may propagate along the first surface18, around the end edge24, and along the second surface20of the substrate14. While it is not intended to be bound by any particular theory, it is believed that it is possible that SAW may propagate in both forward and reverse directions relative to the electroacoustic transducer12on each of the first and second surfaces18,20of the substrate14. It is believed that SAW travelling in the reverse direction on the first and/or second surfaces18,20may at least partially be responsible for drawing, pulling and thinning out the liquid substance from the reservoir26and/or wick28. The use of acoustic wave energy travelling along the second surface20is contrary to conventional SAW microfluidic devices where only the first surface18is used. This manifestation and utilisation of the available acoustic wave energy may be achieved by configuring the substrate14so that it has a thickness which is comparable (eg, approximately equal) to the SAW wavelength. In other words, the device10may be configured to satisfy a relationship of λSAW/h˜1, where h represents a thickness of the substrate14, and λSAWrepresents the SAW wavelength which corresponds to the resonant frequency of the device10. The SAW wavelength may be determined based at least in part by the configuration of the electroacoustic transducer12, for example, the spacing of the IDT electrodes. Mass loading of a large plurality of IDT fingers (eg, equal to or greater than around 40 to 60 fingers) and low frequency IDT designs between around 10 to 20 MHz may be selected to give the optimal combination of SAW and SRBW. Other equivalent or alternative configurations of the electroacoustic transducer12and the substrate14may also be used. Further, by configuring the thickness of the substrate14to be comparable to the wavelength of the acoustic wave energy, the acoustic wave energy in another embodiment of the device10may manifest as SRBW propagating along the first and second surfaces18,20by internal reflection through the substrate14between the first and second surfaces18,20. Again, while it is not intended to be bound by any particular theory, it is believed that it is possible that SRBW may also propagate in both forward and reverse directions relative to the electroacoustic transducer12on each of the first and second surfaces18,20of the substrate14. It is believed that SRBW travelling in the reverse direction on the first and/or second surfaces18,20may at least partially be responsible for drawing, pulling and thinning out the liquid substance from the reservoir26and/or wick28. A combination of SAW and SRBW may then be used both to draw out the liquid substance from the liquid supply16onto the substrate14as a thin liquid film, and to atomise the thin liquid film. For example, in the embodiment illustrated inFIG.1, the combination of SAW and SRBW travelling along both the first and second surfaces18,20of the substrate14may be used both to draw out the liquid substance from the source16onto the first surface18of the substrate14as a thin liquid film, and to atomise or nebulise the thin liquid film on the first surface18of the substrate14. In a further embodiment of the device10, the electroacoustic transducer12and the substrate14may be configured to generate acoustic wave energy that may manifest as a standing acoustic wave in or on the electroacoustic transducer12. SAW may be used to draw out the liquid substance from the source16along the substrate14and onto the electroacoustic transducer12as a thin liquid film. The standing acoustic wave may then be used to atomise the thin liquid film directly on the electroacoustic transducer12. For example, in the embodiment illustrated inFIG.2, SAW travelling along the first surface18of the substrate14may be used to draw out the liquid substance from the source16along the first surface18and onto the electroacoustic transducer12as a thin liquid film. The standing acoustic wave in or on electroacoustic transducer12may then be used to directly atomise or nebulise the thin liquid film. Since the acoustic wave energy on the IDT12is the strongest, the efficiency here is at the highest in terms of microfluidic manipulation. In other words, atomising directly on the IDT12by drawing, running and thinning out a liquid film from the reservoir26to the IDT12may result in very high and efficient atomisation rates, for example, equal to or greater than 1 ml/min.FIG.15illustrates a strong aerosol jet or liquid stream generated directly on the IDT12of this embodiment of the device10. Referring toFIGS.3and4, in one embodiment of the device10, the power supply, substrate14and source16may be integrated in a USB holder30. For example, the resilient supports and couplings for the one supported end of the substrate14described above may be integrated into the body of the USB holder30. Further, the power supply for the electroacoustic transducer12may be integrated into, or provided via, the USB holder30. For example, the power supply may comprise a battery integrated in the USB holder30. Further, the source16of the liquid substance may be integrated onto the USB holder30. For example, the source16may further comprise a source body32arranged under the USB holder30to fluidly connect the reservoir26to the wick28. The reservoir18may be arranged at the rear of the USB holder34, and the wick20may be arranged on the source body32adjacent to the free end edge24of the substrate14. The wick28may fluidly contact a lower side edge22of the substrate14between the first and second surfaces18,20. As described above, the electroacoustic transducer12and the substrate14may be collectively configured so that the device10generates a combination of SAW and SRBW which may be used collectively to move or draw out the liquid substance from the source16onto each of the first and second surfaces18,20of the substrate14as a thin liquid film, and to atomise or nebulise the thin liquid film on each of the first and second surfaces18,20to generate two opposite, outwardly-directed jets, streams or mists of aerosol drops of the liquid.FIGS.5and6illustrate the generation of twin aerosol jets by this embodiment of the device10. Embodiments of the device10described above may be used to atomise or nebulise a liquid substance a rate greater than 100 μl/min, for example, equal to or greater than 1 ml/min. The liquid substance may comprise functional or therapeutic agents selected from drugs, soluble substances, polymers, proteins, peptides, DNA, RNA, cells, stem cells, scents, fragrances, nicotine, cosmetics, pesticides, insecticides, and combinations thereof. Other equivalent or alternative functional or therapeutic agents may be mixed, dissolved, dispersed, or suspended in the liquid, for example, biological substances, pharmaceutical substances, fragrant substances, cosmetic substances, antibacterial substances, antifungal substances, antimould substances, disinfecting agents, herbicides, fungicides, insecticides, fertilisers, etc. The device10may also be used to atomise or nebulise a soluble substance to produce particles, powders or crystals with a diameter of 1 nm to 1 mm. Further, the device10may be used to coat or encapsulate drug molecules for therapeutic purposes within particles or powders with a diameter of 1 nm to 1 mm. The device10may also be used for other equivalent or alternative biomicrofluidic, microfluidic, microparticle, nanoparticle, nanomedicine, microcrystallisation, microencapsulation, and micronisation applications. For example, the device10may be configured to perform acoustic wave microfluidic operations on a substance comprising atomising, nebulising, moving, transporting, mixing, jetting, streaming, centrifuging, trapping, separating, sorting, coating, encapsulating, manipulating, desalinating, purifying, exfoliating, layering, and combinations thereof. Other alternative or equivalent microfluidic operations may also be performed using the device10. The device10may be implemented with battery power in a compact size at low cost with a low form factor so that it is suitable for incorporation into a wide variety of other devices, systems and apparatus. For example, the device10may be incorporated into, or configured as, an inhaler or nebuliser for pulmonary drug delivery. The device10may also be incorporated into an electronic cigarette to atomise liquids containing nicotine and/or flavours. The device10may further be configured as a scent generator and incorporated into a game console. Alternatively, the device10may be incorporated into eyewear36, such as goggles or glasses, for ophthalmic drug delivery, as illustrated inFIG.14. A power supply38for the device10may be provided in an arm of the eyewear36. The eyewear36may be used for delivery of aerosols, particles and powders comprising a drug, as well as polymer particles encapsulating the drug, for treating ophthalmic conditions. Other equivalent or alternative applications of the device10may also be used. The device10described above may also be used to purify or desalinate a liquid by separating salt, crystals, particles, impurities, or combinations thereof, from the liquid. For example, nebulisation of saline solutions by the device10may lead to the generation of aerosol droplets comprising the same solution, whose evaporation leads to the formation of precipitated salt crystals. Due to their mass, the salt crystals sediment and therefore can be inertially separated from the water vapour, which, upon condensation, results in the recovery of purified water. Scaling out (or numbering up) the device10into a platform comprising many devices10in parallel may then lead to an energy efficient method for large-scale desalination. Alternatively, a miniaturised platform of a single or a few devices10may be used as a battery operated portable water purification system, which is potentially useful in third world settings. In other embodiments, the device10may be used exfoliate a material from a 3D bulk form to a 2D exfoliated form. The material may, for example, comprise graphene, BN, TMDs, TMOs, black phosphorous, silicene, germanene, and combinations thereof. Other alternative or equivalent materials may also be used. The 3D bulk aggregate form of the material may comprise the material in a liquid or an intercalating material. The 2D exfoliated form of the material may comprise a sheet, a QD, a flake, a layer, a film, or combinations or pluralities or structures thereof. The 2D exfoliated form of the material may, for example, have lateral dimensions between 1 nm and 200 nm. In these embodiments, the HYDRA device10may be used to provide a unique, high-throughput, rapid exfoliation method to produce large sheets and QDs of, for example, but not limited to TMOs, TMDs, as well as other host of 2D materials using high frequency sound waves produced by the HYDRA device10in water or in the presence of a pre-exfoliation step using an intercalating material. Nebulisation of the bulk solution with the HYDRA device10may lead to shearing of the interlayer bonds within the 3D bulk material producing single, or few layers of, flakes, as illustrated inFIG.16. In the illustrated embodiment, a 3D bulk material solution30may be fed via a conduit26with the aid of a paper wick28along the central line of substrate14of the HYDRA device10. The high frequency sound waves produced during nebulisation may lead to shearing of the 3D bulk material30in flight to form 2D exfoliated materials32.FIG.17is a TEM image showing a HYDRA nebulised drop with a few layers of MoS2QDs.FIG.18is an AFM image of a thin film of MoS2QDs covering a 2 μm x and 2 μm. In this application, the HYDRA device10may provide the ability to produce large area coverage through continuously nebulising the 2D material on a substrate producing a tunable film pattern and thickness, suitable for application purposes in, but not limited to, field-effect transistors (FETs), memory devices, photodetectors, solar cells, electrocatalysts for hydrogen evolution reactions (HERs), and lithium ion batteries. Over the last few years, the study of 2D materials has become one of the most vibrant areas of nanoscience. Although this area was initially dominated by research into graphene, it has since broadened to encompass a wide range of 2D materials including BN, TMDs such as MoS2and WSe2, TMOs such as MoO3and RuO2, as well as a host of others including black phosphorous, silicene, and germanene. These materials are extremely diverse and have been employed in a wide range of applications in areas from energy to electronics to catalysis. To prepare large quantities of 2D nanosheets from their 3D bulk materials, the previously proposed nanosheet production methods comprise either mechanical exfoliation or liquid phase exfoliation (LPE) (or “Scotch tape method”). Due to high quality monolayers occurring from mechanical exfoliation, this method is popularly used for intrinsic sheet production and fundamental research. Nevertheless, this method is not suitable for practical applications on a large scale due to its low yield and disadvantages in controlling sheet size and layer number. In the LPE method, layered crystals, usually in powdered form, are exfoliated by ultrasonication, or shear mixing, usually in appropriate solvents or surfactant solutions. After centrifugation to remove any unexfoliated powder, this method gives dispersions containing large quantities of high quality nanosheets. Chemical exfoliation could largely increase production than mechanical exfoliation, whereas sonication during this process would cause defects to 2D lattice structure and reduce flake size down to a few thousand nanometers, limiting the applications of 2D nanosheets in the field of large-scale integrated circuits and electronic devices. Recently, controllable preparation of 2D TMDs with large-area uniformity has remained a big challenge. The chemical vapour deposition (CVD) approach has attracted wide attention because it could synthesise 2D TMDs on a wafer-scale, which shows great potential toward practical applications like large-scale integrated electronics. This method not only could prepare continuous single film with certain thickness, but highlight in directly growth layered heterostructures, which would largely avoid interfacial contamination introduced during layer by layer transfer process. However, this method is of a low throughput, time-consuming and needs expertise. In the context described above, embodiments of the device10of the present invention provide a useful alternative to conventional CVD, LPE and mechanical exfoliation methods. The invention will now be described in more detail, by way of illustration only, with respect to the following examples. The examples are intended to serve to illustrate this invention, and should not be construed as limiting the generality of the disclosure of the description throughout this specification. Example 1 Pure SAW Referring toFIGS.7(a) to7(c), an acoustic wave microfluidic device10may be fabricated by patterning a mm aperture 40 pairs of finger 10 nm Cr/250 nm AI IDT12on a 128YX LN substrate14(Roditi Ltd, London, UK) using standard photolithography techniques. Note that the device10has been flipped relative toFIG.1such that the underside of the substrate14constitutes the surface along which the IDT12generates SAW. The device10is generally similar to the device10described above and depicted in the preceding figures except that the orientation of the IDT12is shown on the lower surface. A relevant design parameter may be the ratio between λSAW, determined by the width and gap of the IDT fingers12, and the substrate14thickness h. Various asymptotic cases may be demonstrated in these examples by maintaining h constant throughout and altering the device's10resonant frequency f and hence λSAW. SAW may be generated by applying a sinusoidal electrical input at the resonant frequency of 10 MHz to the IDT12with a signal generator (SML01, Rhode & Schwarz, North Ryde, NSW, Australia) and amplifier (ZHL-5W-1 Mini Circuits, Mini Circuits, Brooklyn, NY 11235-0003, USA). Deionized (DI) water at room temperature may be used as the test fluid. The conventional pure SAW device is therefore the case when λSAW<<1 h; ie, when the frequency is large, as illustrated in the schematic inFIG.7(c)and the lower row ofFIG.8(b). In this configuration, the SAW energy, being confined within the penetration depth adjacent to the underside surface along which SAW is generated, rapidly decays over a lengthscale exp(−βz) through the thickness of the substrate14, where β is the attenuation coefficient over which the SAW decays in the solid in the vertical z direction, such that it is completely attenuated before it reaches the top side of the substrate14. In other words, no vibration on this face exists due to leakage of SAW energy through the substrate14(ie, the side on which the IDTs12are patterned). Instead, SAW on the underside surface propagates to the edge and continues around onto the top side if it is not reflected by a set of IDTs12, although its energy attenuates along the substrate surface along its propagation direction x as exp(−αx), where α is the longitudinal attenuation coefficient of SAW in an unbounded fluid; ie, either in air or in liquid if one is present on the device10. This can be seen from the LDV scan images inFIGS.7(a) and7(b)(LDV; UHF-120; Polytec PI, Waldbronn, Germany) which confirm the existence of SAW on both sides of the substrate14. Further evidence of SAW may be seen in the lower row of LDV scans inFIG.8(a)from the opposing directions that a millimetre dimension sessile drop38is transported under the SAW when placed on the top and bottom faces, given that a drop with height much greater than λSAWtranslates in the direction of the SAW propagation due to Eckart flow. Example 2 Pure SRBW Referring to the schematic in the top row ofFIG.8(b), if the substrate14thickness becomes comparable to the SAW wavelength, (ie, λSAW/h˜1) at moderate frequencies, it may be seen that the energy associated with the SAW, which propagates along the underside of the substrate, is transmitted throughout its thickness and is therefore no longer completely attenuated at the top side of the substrate14. As such a bulk wave exists throughout the thickness of the substrate12, which, due to the phase mismatch with the SAW and multiple internal reflections within the substrate14, manifests as a travelling bulk surface wave along the top side, in what may be termed as a SRBW. The individual identity of such waves may have previously been overlooked, or merely referred to or conflated collectively with a wide range of other spurious bulk wave modes through the substrate14thickness simply as generic bulk acoustic waves—a consequence perhaps of the long-standing view since the 1950s that they were undesired and to be suppressed. The existence of pure SRBW may be verified from the LDV scans as well as the opposing drop translational behaviour illustrated in the upper row ofFIG.8(b). When the SRBW is suppressed by placing the absorbent gel40(Geltec Ltd, Yokohama, Japan) on the top side of the substrate14, a pure SAW exists that may be seen not only to translate the sessile drop38along the underside of the substrate14in the direction of its propagation, but also to push it around the edge to the top side. In contrast, when the SAW is absorbed by the gel40at the underside edge to prevent it from wrapping around to the top side, the SRBW drives the drop to translate along its propagation direction, which is opposite to the direction which the SAW would have caused it to translate had it travelled around the edge and onto the top side of the substrate14. Example 3 Hybrid SAW/SRBW FIG.11(c)illustrates the device10configured to exploit a combination of the SAW and SRBW on both faces of the substrate14for efficient microfluidic manipulation; ie, by requiring λSAW/h˜1. Compared to microfluidic manipulation or nebulisation driven by pure SRBWs or pure SAWs as shown inFIGS.9(a) to9(c) and10(a) to10(c)respectively,FIGS.11(a) and11(b)show that there is a significant enhancement in the microfluidic manipulation or nebulisation performance—for example, an order of magnitude increase in the nebulisation rate—when both phenomena are combined, which hereafter may be referred to as HYbriD Resonant Acoustics (HYDRA). On the other hand, the size distributions of the aerosols that are generated, as determined by laser diffraction (Spraytec, Malvern Instruments, Malvern, UK), indicate that the mean aerodynamic diameters lie within the range of 1-3 μm for optimum dose delivery to the lung alveolar region. Aerosols above this range mainly deposit in the upper respiratory tract due to their inability to follow the inspiratory airflow trajectory in navigating the highly bifurcated branched network of the respiratory whereas aerosols below this range tend to be exhaled. FIG.12is an example LDV profile of the hybrid SAW/SRBW generated in this example, whileFIG.13is an example LDV profile of the pure SAW generated in Example 1. Embodiments of the present invention provide small, compact, low cost and battery-powered acoustic wave microfluidic devices with increased acoustic wave energy utilisation that are useful for a wide range of microfluidic applications and operations, including those requiring increased microfluidic atomisation or nebulisation rates equal to or greater than 1 ml/min. In addition to nebulisation and atomisation of fluids and droplets, the microfluidic operations performed by embodiment devices may comprise all other alternative or equivalent types of acoustic wave microfluidic operations on the lithium niobate (and other piezoelectric substrates) including, but not limited to, fluid transport, mixing, jetting, sorting, centrifuging, particle trapping, particle sorting, coating, encapsulating, manipulating, and combinations thereof. Different embodiments of the invention are configured differently to use different combinations of different modes of acoustic wave energy—SAW, SRBW and standing acoustic waves—to optimise the net acoustic wave energy made available to atomise liquids. This results in acoustic wave microfluidic devices capable of providing very high and efficient rates of microfluidic manipulation of fluids, droplets, liquids, or reactions compared to previously proposed devices. For the purpose of this specification, the word “comprising” means “including but not limited to,” and the word “comprises” has a corresponding meaning. The above embodiments have been described by way of example only and modifications are possible within the scope of the claims that follow. | 26,128 |
11857993 | MODE FOR INVENTION Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. FIG.1is an exploded perspective view of the present disclosure,FIG.2is a plan sectional view of the present disclosure, andFIG.3is a side sectional view of the present disclosure. A vibration nozzle100for a bidet according to the present disclosure is composed of a nozzle cover110, a nozzle tip120, a vibration motor130, washing-water supply tubes140, vibration-proof members150, and a closure cover160, which will be described in detail below. First, the nozzle cover110is formed to have a length accommodating the nozzle tip120, the vibration motor130, the washing-water supply tubes140, and the vibration-proof members150, and is preferably formed of a resin material or a stainless material. Furthermore, the nozzle tip120is coupled to the front end of the nozzle cover110, and is spaced apart from the vibration motor130coupled to a rear portion of the nozzle tip120by a predetermined distance. The nozzle tip120is provided with a body121in which a washing-water discharge hole121aand a bidet discharge hole121bare formed respectively, and a coupler122protrudes from a center of a rear end of the body121so that a shaft131of the vibration motor130is coupled thereto. Connectors123are formed on both sides of the coupler122to be connected to the washing-water supply tubes140and thereby supply washing water to the washing-water discharge hole121aand the bidet discharge hole121b. Since the nozzle tip120is formed in a small size so that it is mounted not on the entire nozzle cover110but on a part of the front end thereof, manufacturing costs may be minimized. Furthermore, the vibration motor130is coupled to the inside of the nozzle cover110to impart vibration to the nozzle tip120. The internal structure of the vibration motor130is the same as a conventional vibration motor, and is electrically connected to a controller of the bidet. The vibration motor130is coupled to the rear portion of the nozzle tip120to be spaced apart from the nozzle tip120by a predetermined distance. An empty space is defined between the nozzle tip120and the vibration motor130so that there is no interference of any structure. The length of the empty space may be reduced or further extended to correspond to the length of the shaft131. The shaft131provided on the center of the vibration motor130is coupled to the coupler122formed on the rear end of the nozzle tip120, and transmits vibration generated by the operation of the vibration motor130to the nozzle tip120. Furthermore, the washing-water supply tubes140are coupled to the connectors123formed on the nozzle tip120. Each washing-water supply tube140is formed of a flexible hose, so that the position of the water channel may be freely changed. A step141is formed inside the front end of each washing-water supply tube140, thus making it easy to couple the washing-water supply tube with the connector123. The washing-water supply tubes140are connected to the connectors123formed on both sides of the coupler122, so that the washing-water supply tubes are located on both sides of the shaft131of the vibration motor130. The position of the washing-water supply tubes140may be changed according to the coupling number, and may be changed according to the installation direction of the vibration motor130. Therefore, since each washing-water supply tube140is formed of a hose, it is unnecessary to form a separate resin tube, thus minimizing manufacturing costs and varying the position of the water channel depending on a situation. Furthermore, the soft vibration-proof members150are coupled to the front end and rear end of the vibration motor130, respectively. Each vibration-proof member150is in close contact between the vibration motor130and the nozzle cover110, thus preventing vibration generated by the vibration motor130from being transmitted to the nozzle cover110. A through hole151opened to allow the shaft131to be coupled to the nozzle tip120is formed in the center of the vibration-proof member150, and accommodation spaces152extend from both sides of the through hole151to accommodate and support the washing-water supply tubes140, respectively. The accommodation spaces152of the vibration-proof members150are preferably located on both sides of the vibration motor130, and the direction of the accommodation spaces may be changed according to the arrangement position of the washing-water supply tubes140. Furthermore, the closure cover160is coupled to the rear end of the nozzle cover110so that the vibration motor130is not separated from the nozzle cover110. The closure cover160is shaped to be opened at a center thereof, the washing-water supply tube140is connected to the inside of the bidet in a guide space161that is opened as such, a support piece162formed on a lower portion of the closure cover160is in close contact with the rear portion of the vibration-proof member150coupled to the rear end of the vibration motor130, so that the vibration motor130is firmly coupled so as not to be movable inside the nozzle cover110. As shown inFIGS.5and6, the vibration nozzle100for the bidet of the present disclosure configured as such is operated as follows: if a wash button of the bidet controller is operated, washing water is supplied to the washing-water supply tube140connected to the washing-water discharge hole121aamong the washing-water supply tubes140disposed on both side of the shaft131through a water tank in the bidet, and simultaneously washing water is supplied to the washing-water discharge hole121aof the nozzle tip120. In this case, the vibration motor130generates vibration at high speeds, and the shaft131is vibrated 60,000 times/second or more, thus transmitting vibration to the nozzle tip120that is spaced apart from the shaft by a predetermined distance. Furthermore, the washing water fed to the nozzle tip120is discharged through the washing-water discharge hole121aand simultaneously the washing water provides large movement by the vibration transmitted to the nozzle tip120to form fine particles and is dispersed in an S-shaped curve, thus allowing a user's parts to be more cleanly washed. While the present disclosure has been particularly described with reference to exemplary embodiments shown in the drawings, terms or words used in the specification and claims should be interpreted as meanings and concepts consistent with the technical idea of the present disclosure without being limited to common or dictionary meanings. Accordingly, since embodiments described in the specification and shown in the drawings are intended not to limit the technical idea of the disclosure, it will be understood by those of ordinary skill in the art that various changes and modifications may be made without departing from the spirit and scope of the present disclosure as defined by the appended claims. | 6,969 |
11857994 | DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring now to the drawings and the illustrative embodiments depicted therein, a multi-component fluid mixing and dispensing system10includes a dispensing gun12configured to receive and convey two different fluid reactants from respective fluid sources along a pair of conduits14to an end fitting or dispensing manifold16, where crossover prevention valve18and a dispensing nozzle20are mounted, such as shown inFIG.1. Mixing and dispensing system10is operated by depressing a pair of triggers22to allow the two different fluid reactants, which are pressurized when they reach the gun12, to pass along conduits14and into end fitting16, where the fluid reactants remain separate as they pass into crossover prevention valve18. It will be appreciated that dispensing gun12is representative of substantially any common or known dispensing gun or apparatus capable of conveying two or more fluids along separate and isolated flow paths until a point or region at which they are to be mixed and/or discharged, and that the principles of the present invention may be adapted for use with substantially any desired dispensing system for two or more separate fluid streams. As will be described in more detail below, crossover prevention valve18includes a valve body19in which a pair of one-way check valves24are mounted, the valves24permitting the fluids to flow out into a mixing chamber26defined by the crossover prevention valve18and a proximal end portion20aof dispensing nozzle20(FIG.3), but which valves24preclude any flow reversal (i.e., from the mixing chamber26into the valve body19) even under significant pressure differentials, in part by closing more tightly in response to elevated downstream pressures. This arrangement permits the mixing and dispensing system10to be operated such that reactant fluids in mixing chamber26can be left to cure, without clogging the valve body's fluid passageways, while facilitating a quick change of the dispensing nozzle20to resume dispensing fresh reactant fluids. Valve body19has two fluid passageways28extending therethrough, the fluid passageways28extending from inlet or upstream end portions28aat a rearward body surface30, to outlet or downstream end portions28bat a forward body surface32(FIGS.2-8). A perimeter body surface34is circular in cross-section and extends between the forward and rearward body surfaces32,30. In the illustrated embodiment, perimeter body surface34has a generally frusto-conical shape that tapers slightly inwardly toward forward body surface32. In addition, a circular flange36is formed or established at rearward body surface30, and has a somewhat larger diameter than the diameter of the adjacent region of perimeter body surface34. Flange36may facilitate sealing off the mixing chamber26upon attachment of dispensing nozzle20to end fitting16, as will be described below. In the illustrated embodiment, forward body surface32and rearward body surface30are both substantially planar and are parallel to one another, so that valve body19is a substantially solid and generally cylindrical shape. Each of fluid passageways28includes an enlarged-diameter region38in between the inlet and outlet end portions28a,28b, such as shown inFIGS.4-5B. Fluid passageways28are sized and shaped to receive respective fluid outlet nozzles40of end fitting16(FIGS.3,6and6A). Thus, inlet end portions28aof the fluid passageways28may be substantially the same diameter and length as the main diameter and length of the fluid outlet nozzles40. Each of the nozzles40terminates at an enlarged-diameter flange42, which provide a function similar to hose barbs when the nozzles40are inserted into the fluid passageways28of valve body19, by retaining valve body19at end fitting16until it is manually removed by a user. Valve body19is made of a flexible and resilient material, such as silicone rubber or other elastomer, which allows inlet end portions28aof fluid passageways28to expand around flanges42as the nozzles40are inserted into the fluid passageways28until flanges42are seated in the respective enlarged-diameter regions38of fluid passageways28. One-way check valves24are mounted in the outlet end portions28bof the respective fluid passageways28, downstream of the enlarged-diameter regions38of the fluid passageways, such as shown inFIGS.4-5A. In the illustrated embodiment, check valves24are “duckbill” valves made of silicone rubber, which are available from many different sources including Minivalve, Inc. of Cleveland, Ohio. Other suitable duckbill valves may be made from resinous plastics, rubber or rubber-like material, or even metals. Duckbill valves exhibit very low flow resistance in the discharge direction (into mixing chamber26), but seal tight in conditions of no pressure differential and also seal against backflow (i.e., from mixing chamber26into fluid passageways28) in the presence of elevated fluid pressures in the mixing chamber26. For example, if an operator of system10depressed only one trigger22of the two-trigger spray gun12while a blockage was present in dispensing nozzle20, operating fluid pressure [which may be approximately 50 psi to 250 psi (345 kPa to 1,725 kPa), for example] would urge only a first of the reactant fluids into mixing chamber26, which would quickly stabilize at the operating fluid pressure due to the blockage. In this condition, if not for the check valve24the pressure in mixing chamber26would force the first reactant fluid into the fluid passageway28of the second reactant fluid, thereby initiating a chemical reaction in the second reactant fluid's passageway28and quickly causing a further blockage that would render the system unusable until replacement or partial disassembly and cleaning of at least the end fitting16could be performed. In the illustrated embodiment, duckbill check valves24have round bases44that serve as fluid inlets that are open to a respective fluid passageway28, downstream of enlarged-diameter region38. Round bases44are positioned behind forward body surface32and are substantially surrounded by molded material of valve body19, which thereby secures the valves24in valve body19. Check valves24have narrowed discharge tips46that project outwardly from forward body surface32and are in fluid communication with their bases44. Because discharge tips46are located at forward body surface32, any air or other compressible fluid (gas) that may be entrapped in fluid passageways28, or in the fluid passageways of end fitting16or of conduits14, will have no effect on the ability of check valves24to prevent undesired mixing and curing of the reactant fluids that could form an undesirable and difficult-to-clear blockage inside a fluid passageway that is intended to carry only one reactant fluid. It will be appreciated that other shapes of duckbill valves may be used, in addition to other types of one-way check valves, and that the crossover prevention valve of the present invention is not necessarily limited to embodiments having only certain types, shapes, or configurations of check-valves. A slit formed in each discharge tip46is normally closed when there is no fluid pressure differential across the valve24, and maintains a tight seal when fluid pressure downstream of discharge tip46(e.g., in the mixing chamber26) is higher than the fluid pressure in the vicinity of base44(e.g., in the fluid passageway28). Closed discharge tips46may also form an effective moisture barrier to isolate moisture-sensitive reactant fluids in fluid passageways28from humidity or liquid water in the surrounding environment, particularly when no dispensing nozzle20is attached. However, the slit in each discharge tip46readily forms an opening48(FIGS.5B and6B) in response to elevated fluid pressure in the vicinity of base44(e.g., in the fluid passageway28) as compared to the fluid pressure downstream of discharge tip46. Thus, reactant fluids are readily discharged through check valves24with minimal resistance in response to elevated fluid pressure in fluid passageways28, and the check valves quickly close and remain sealed when there is no pressure difference across the valves or when the fluid pressure downstream of the discharge tips46is elevated. Although duckbill valves have been determined to provide suitably low flow resistance in a discharged direction and to seal tightly against backflow, even under high pressures, it will be appreciated that other types of one-way check valves may also perform suitably, such as umbrella valves, spring-ball valves, and the like, any of which is designed to allow material to flow only in one direction. However, duckbill valves are an economical option that are readily incorporated into valve body19, such as by placing the duckbill valves into a mold with their bases44facing downwardly and engaged by mold inserts that form the fluid passageways28, then pouring or injecting liquid silicone rubber, or other suitable material, into the mold where it cures to form the valve body19and the finished crossover prevention valve18with the duckbill valves at least partially over-molded by the material of valve body19. Optionally, a crossover prevention valve may be unitarily formed with all passageways and valves (such as duckbill valves) formed directly in a single piece of molded material. It is envisioned that by integrating or forming the valves directly with the same material that forms the valve body, the crossover prevention valve can be manufactured very economically as a one-piece unit, which may also have improved durability over a comparable valve having separate component parts that are molded or otherwise retained in place by adhesive or by other valve body material. Rearward body surface30of valve body19engages a forward surface50of end fitting16that acts as a nozzle base, with a central wall portion of valve body19(between fluid passageways28) engaging the nozzle base50between fluid outlet nozzles40, such as shown inFIGS.3and6-8. Valve body19is pressed into sealing engagement with nozzle base50upon securing the dispensing nozzle20in place. Dispensing nozzle20has an outwardly-flared proximal end portion20aand a distal tip portion20bin fluid communication with the proximal end portion20a. Optionally, a turbulence-inducing mixer insert52is positioned in the distal tip portion20band serves to further mix the reactant fluids after they leave mixing chamber26. In the illustrated embodiment, proximal end portion20ahas a slightly tapered or constant-diameter smooth-walled portion54that sealingly engages perimeter body surface34of valve body19, and has a circular edge56that sealingly engages flange36of valve body19when dispensing nozzle20is fully seated (FIG.6A). However, it will be appreciated that smooth-walled portion54could be omitted, and a tapered interior surface64of outwardly-flared proximal end portion20aengaged with forward body surface32to form a seal near where forward body surface32meets perimeter body surface34, while still forming a suitable mixing chamber26. Dispensing nozzle20is secured to end fitting16by a threaded collar58(FIGS.2,3,6and6A) that is sized and shaped to permit distal tip portion20bto slide freely through the collar, and to engage the outwardly-flared proximal end portion20aand press it into contact with at least valve body19(FIGS.3,6and6A). Threaded collar58has interior threads60that engage male threads62of end fitting16, which are rearward of nozzle base50. As threaded collar58is rotated to tighten and secure it to end fitting16, the outwardly-flared proximal end portion20ais tightened against valve body19for form a fluid-tight seal between smooth-walled portion54and the valve body's perimeter body surface34, and/or between circular edge56and the valve body's flange36(FIG.3). This tightening also forms or strengthens a seal between the valve body's rearward surface30and the nozzle base50of end fitting16, and forms or strengthens a seal between the interior surfaces of valve body19that form inlet end portions28aand enlarged-diameter regions28of fluid passageways28, and the exterior surfaces of fluid outlet nozzles40including enlarged-diameter flanges42. It will be appreciated that the operational step of injecting reactant fluids only into fluid passageways28, without applying fluid pressure directly against rearward body surface30of valve body19(FIG.6A), limits or prevents any seepage or mixing of the reactant fluids in areas between the valve body19and the end fitting16and its outlet nozzles40. The assembly of threaded collar58and dispensing nozzle20to end fitting16and valve body19results in the mixing chamber26being formed between forward body surface32and the tapered interior surface64of outwardly-flared proximal end portion20a, which is located between smooth-walled portion54and distal tip portion20bof dispensing nozzle20. By injecting the reactant fluids directly into fluid passageways28and out through check valves24into mixing chamber26, reacted or cured product of the mixed fluids is precluded from forming anywhere but along and in front of forward body surface32(i.e., in the mixing chamber26), although it is envisioned that some limited amount of reacted or cured product could be present along at least a forward portion of perimeter body surface34, between the perimeter body surface34and smooth-walled portion54of dispensing nozzle20. The hardened product may form a plug66in mixing chamber26(FIG.7) when triggers22are released to stop the flow of reactant fluids, such as at the end of a spraying session. Therefore, it is desirable that forward body surface32has a smooth surface texture resembling a polished surface, preferably having non-stick characteristics, to facilitate removal of any cured and hardened product of the reactant fluids present in mixing chamber26. In addition, it will be observed that forward body surface32is substantially lacking in outwardly-extending walls or other shapes that could cause cured and hardened product to stick, and which also permits substantially the entire volume of mixing chamber26to be used for fluid mixing since the fluid chamber is not bifurcated. The check valves' dispensing tips46, which may protrude or extend forwardly into mixing chamber26from forward body surface32such as shown in the illustrated embodiment, are also preferably sufficiently smooth so as to be readily released from the hardened product, and form wedge-shapes with pointed tips when they are closed, which further facilitates releasing the tips46from any cured product. When plug66has formed, it is readily cleared and the mixing and dispensing system10readied for further spraying or dispensing by removing dispensing nozzle20(which is typically an inexpensive disposable item that is discarded after use, rather than cleaned) by unscrewing threaded collar58and pulling dispensing nozzle20away from valve body19and end fitting16. This action alone may cause plug66to pull away from valve body19and remain inside the flared proximal end portion20aof dispensing nozzle20, which permits the immediate installation of a fresh dispensing nozzle20so that the mixing and dispensing system10is again ready for use. However, if plug66remains attached to valve body19upon removal of dispensing nozzle20, such as shown inFIG.7, it is generally a quick and simple matter for an operator to remove the plug66by peeling it away from forward surface32of valve body19using a thumbnail68or tool between forward body surface32and plug66, such as shown inFIG.8. By forming valve body19of a relatively soft resilient material such as silicone rubber or other elastomer, the valve body may be readily deflected to facilitate working a fingernail or small tool between the plug66and valve body19, and to momentarily change the shape of the valve body's surfaces (particularly forward surface32and perimeter surface34) to facilitate separation of the hardened plug from the valve body surfaces. It will be appreciated that valve body19is typically sufficiently retained at end fitting16, via engagement of fluid outlet nozzles40in fluid passageways28, so as to resist or prevent removal of the valve body19from the end fitting16when an operator attempts to remove plug66in the above-described manner. However, if valve body19were inadvertently removed during this cleaning operation, it can be readily re-seated at end fitting16after removal of the plug66. In this case, care should be taken to ensure that the outlet nozzles40are re-inserted into the same fluid passageways28as before, since a change (without first cleaning out the fluid passageways) could result in the undesired mixing of reactant fluids in the fluid passageways. Therefore, it is envisioned that a keying arrangement may be used to ensure that valve body19can only be mounted on outlet nozzles40in a single orientation, to limit or prevent inadvertent mixing of reactant fluids inside valve body19if the valve body were removed and replaced at the end fitting after an initial use of the mixing and dispensing system10. Other valve body arrangements are envisioned in addition to the valve body19described above and shown in the drawings, which alternative arrangements would also facilitate quickly readying the mixing and dispensing system10for use after a sufficiently long pause in operation that results in the fluid reactants solidifying in the mixing chamber26. For example, a valve body may be formed with inlet nozzles protruding rearwardly from the rearward surface, where the inlet nozzles would be insertable into respective rearwardly-extending bores formed in the nozzle base of the system's end fitting. Optionally, a valve body having three or more fluid passageways, such as for conveying three or more reactant fluids, or for conveying two or more reactant fluids plus a non-reactant fluid (e.g., a thinner or solvent, a colorant, or a gas), is also envisioned as being within the scope of the present invention. It is further envisioned that a suitable valve body could be sized and shaped to be received in a recess formed in a forward end of the system's end fitting, such as with an interference fit, so as to retain the valve body in the recess via the interference fit instead of (or in addition to) retaining the valve body via engagement of fluid outlet nozzles inside the valve body's fluid passageways. A suitable valve body may also be integrally or unitarily formed at an end portion of a manifold or end fitting similar to end fitting16. The resulting mixing and dispensing system10requires minimal maintenance and attention during use, particularly since any mixing of the reactant fluids is limited to areas of the mixing chamber26and distal tip20bof the dispensing nozzle20, of which the dispensing nozzle20is readily removable and replaceable, and the valve body's forward body surface32will readily release any hardened plug66of cured material that initially adheres to is. Thus, a mixing and dispensing system10that is operated by spraying or otherwise discharging reactant fluids, followed by the spray or discharge operation being halted a sufficient amount of time so as to form a cured or partially-cured plug66of reacted material, can be returned to service in a matter of seconds and without any tools, scraping, or solvents. Various aspects of crossover prevention valve18may be selected as a matter of design choice, such as to optimize it for reactant fluids having different viscosities, operating pressures, and mix ratios. For example, in order to achieve a 1:1 mix ratio of two reactant fluids at the same operating pressure but one reactant fluid having higher viscosity than the other reactant fluid, it may be necessary to provide a larger diameter fluid passageway and a check valve having a larger opening for the higher viscosity reactant fluid. The material selected for valve body19may also be chosen for its relative hardness or softness, its ability to form a fluid-tight seal with other components such as end fitting16and dispensing nozzle20at a wide range of temperatures, its resistance to deterioration due to contact with the reactant fluids that it is intended to carry and/or due to frequent handling, as well as its raw material and forming costs. Optionally, compressed air or other mixing gas (or other fluid) may be introduced to a mixing chamber via a separate fluid-injection collar70(FIG.1). Fluid-injection collar70is used to secure dispensing nozzle20to end fitting16in substantially the same manner that threaded collar58does so. However, the flared proximal end portion20aof the dispensing nozzle20may be shaped somewhat differently than is shown inFIGS.2,3and6A-7, in order to permit a fluid passageway in the fluid-injection collar70to be open to the mixing chamber. Thus, the mixing chamber in this particular embodiment would be formed between the forward body surface32of the valve body19, the tapered interior surface of the dispensing nozzle's proximal end portion, and a generally cylindrical interior surface of fluid-injection collar70. Fluid-injection collar70permits pressurized gases (e.g., air) or other fluids (e.g., colorants, blowing agents, solvents) to be introduced in to the mixing chamber via a conduit or fitting72, such as to facilitate agitating and mixing the reactant fluids, to clear the mixing chamber and nozzle of reactant fluids, for example. Such a fluid injection collar, as well as a complete multi-component fluid mixing and dispensing system, are more fully described in commonly-owned U.S. patent application Ser. No. 14/885,476, filed Oct. 16, 2015 (corresponding to U.S. Publication No. 2016/0184847), entitled “VORTEX MIXING AND RATIO ADJUSTMENT SYSTEM,” which is a continuation-in-part of U.S. patent application Ser. No. 14/470,261, filed Aug. 27, 2014 (corresponding to U.S. Pat. No. 9,802,166), entitled “VORTEX MIXING SYSTEM,” both of which are hereby incorporated herein by reference in their entireties. In addition to simplifying the procedure needed to resume use of a multi-component fluid mixing and dispensing system, the crossover prevention valve18facilitates the operation of relatively low pressure mixing and dispensing systems, and compatible reactant fluids. For example, favorable operation may be obtained at fluid operating pressures of about 50 psi to 250 psi (345 kPa to 1,725 kPa), as compared to higher pressure systems that must be operated at fluid pressures at about 250 psi (345 kPa) or higher, in which case a higher standard of personal protective equipment (“PPE”) may be required to be worn by operators. However, the valves in the crossover prevention valve18may be sensitive enough to permit fluid flow in the intended flow direction with pressure differentials of less than 1 psi. Thus, the pumps, motors, and fluid fittings and conduits associated with the multi-component fluid mixing and dispensing system may be made substantially lighter, less powerful, and less energy-consuming than known systems that must be operated at higher pressures. However, it will be appreciated that the crossover prevention valve of the present invention may be readily incorporated and adapted for use in higher pressure systems, as desired. Such systems are more fully described in the commonly-owned published U.S. patent applications that are incorporated hereinabove. Although the crossover prevention valve18has been found to provide desirable results when used in a multi-component fluid mixing and dispensing system, it may be possible to achieve similar or even better performance using alternative configurations of the crossover prevention valve discussed above, which alternative configurations are illustrated inFIGS.9-14and discussed in more detail below. It is contemplated that the alternative configurations may provide additional benefits, such as for example to facilitate impingement mixing of two fluid components, or to reduce complexity and/or production costs for the crossover prevention valve. In many respects these alternative configurations are similar or nearly identical to the crossover prevention valve18, such that the following discussion of the alternative configurations will focus primarily on the configuration differences. With reference toFIG.9, another crossover prevention valve118includes a valve body119in which a pair of one-way check valves124aand124bare mounted or integrally formed. The valve body119may be formed from a relatively soft resilient material such as silicone rubber or other elastomer, such that one-way check valves124aand124bmade from silicone will quickly “snap” closed once pressure is equalized on either side of the respective check valve, or if higher pressure is on the downstream side of the valves. That is, silicone rubber has little or no discernable “memory” for its valve-open configuration, such that it quickly returns to its natural (valve-closed) state once the flow is halted. Two fluid passageways128aand128bextend through the valve body119and are in fluid communication with the respective check valves124aand124b. Each of the fluid passageways128a,128bincludes an enlarged-diameter region138for receiving nozzle flanges, such as described above. The check valves124a,124bpermit the fluids flowing through the respective fluid passageways128a,128bto flow out along respective fluid axes Fa, Fb into a mixing chamber defined by the crossover prevention valve118and the proximal end portion20aof dispensing nozzle20, such as in the manner shown inFIG.3. Additionally, valve body119includes a circular flange136formed at a rearward body surface130. In the illustrated embodiment ofFIG.9, a downstream end portion129bof the fluid passageway128bis angled or slanted towards a downstream end portion129aof the fluid passageway128a, which extends along fluid flow axis Fa and is aligned generally perpendicular to the rearward body surface130. Consequently, a longitudinal extent of check valve124bis directed or angled towards a longitudinal extent of check valve124a, which longitudinally extends along fluid flow axis Fa and is aligned generally perpendicular to the rearward body surface130. While both check valves124a,124bmaintain respective fixed flow axes, the angled configuration of the check valve124brelative to the check valve124ais particularly useful when mixing two fluid components at different ratios, such as for example 10:1 (with higher flow through valve124a, and with the flow through valve124bimpinging into the flow out of valve124a). Such configuration of the check valves124a,124bensures proper mixing of the two fluid components, rather than the lower-flow fluid component being pushed aside by the higher-flow fluid component, which could limit or prevent complete mixing. It should be appreciated that arrows are used inFIGS.9-11to generally indicate fluid flow through the respective valves, despite some valves being illustrated as more open than others. The valves may be expected to open to different degrees according to flow rate and/or fluid pressure. InFIGS.10-14it will be understood that components and regions of additional embodiments of crossover prevention valves218,318,418,518, and618, which correspond to components and regions of the crossover prevention valve118ofFIG.9, are assigned corresponding numerals with the addition of 100, 200, 300, 400, and 500, respectively. Referring to the crossover prevention valve218ofFIG.10, a valve body219includes a pair of one-way check valves224aand224bthat are mounted or integrally formed. Valve body219defines two fluid passageways228aand228bthat are in fluid communication with the respective check valves224aand224b. In the illustrated embodiment, downstream end portions229a,229bof the respective fluid passageway228a,228bare angled towards one another, along with longitudinal axes of check valves224a,224bbeing directed or angled towards one another. While both check valves224a,224bmaintain respective fixed flow axes, the configuration of check valves224a,224bangled towards one another provides for impingement mixing of the respective fluids immediately after exiting the respective check valves, which may at times be desired. In the embodiment ofFIG.11, a crossover prevention valve318is substantially similar to the crossover prevention valve18described above, except that fluid passageways328a,328bdo not include an enlarged-diameter region to receive respective enlarged-diameter flanges42(FIG.2) to hold the crossover prevention valve318in place. Referring toFIG.12, another crossover prevention valve418is also substantially similar to the crossover prevention valve18described above, except that valve body419does not include a circular flange formed at a rearward body surface430. In the illustrated embodiment ofFIG.12, a slit446formed in each discharge tip of check valves424a,424bis shown as closed when there is no fluid pressure differential across the valves424a,424b, or when the downstream fluid pressure (in the mixing chamber) is greater than the upstream fluid pressure in the fluid passageways428a,428b. Referring now toFIG.13, another crossover prevention valve518is similar to the crossover prevention valve18described above, except that fluid passageways528a,528bdo not include an enlarged-diameter region. Instead, each fluid passageway528a,528bincludes a reverse undercut538extending around fluid passageways528aand528bto hold the crossover prevention valve518in place. In the illustrated embodiment ofFIG.13, a slit546formed in each discharge tip of check valves524a,524bis shown as closed when there is no fluid pressure differential across the valves524a,524b, or when the downstream fluid pressure (in the mixing chamber) is greater than the upstream fluid pressure in the fluid passageways528a,528b. In the embodiment ofFIG.14, a crossover prevention valve618is similar to the crossover prevention valve18described above, except that crossover prevention valve618is split into two separate but identical pieces or parts, with each part having a fluid passageway628aand628bconfigured to be separately mounted over respective fluid outlet nozzles40of dispensing manifold16, such as shown inFIG.2. In the illustrated embodiment ofFIG.14, a slit646formed in each discharge tip of check valves624a,624bis shown as closed when there is no fluid pressure differential across the check valves624a,624b, or when the downstream fluid pressure (in the mixing chamber) is greater than the upstream fluid pressure in the fluid passageways628a,628b. Referring toFIGS.15and16, a dispensing manifold116is similar to the dispensing manifold16discussed above with reference toFIG.1, and is more fully described in commonly-owned co-pending U.S. provisional patent application, Ser. No. 62/888,008, filed Aug. 16, 2019 and entitled “MULTIPLE FLUID APPLICATION SPLIT MANIFOLD,” which is hereby incorporated herein by reference in its entirety. InFIG.15the dispensing manifold116is shown without the crossover prevention valve and inFIG.16the crossover prevention valve18is mounted to the manifold116. Another dispensing manifold216(FIG.17) is configured to receive a pair of one-way check valves724,824,924having different sizes, such as shown inFIGS.18A-18C. Desired check valves724,824,924may be inserted or over-molded into a dispensing end of the dispensing manifold216such as shown inFIG.17, in which a pair of check valves824is inserted into a pair of cylindrical openings217. Alternatively the check valves824may be over-molded in the dispensing manifold216. The differently sized check valves724,824,924may be chosen for the dispensing manifold216according to fluid viscosity, desired flow rates, desired flow ratios, and the like. Optionally, and with reference toFIG.18D, a flow-restrictor1024may be inserted into one or both cylindrical openings217of the dispensing manifold216, or into the fluid outlet nozzles40of the end fitting16described above. Flow-restrictor1024may be made from silicone rubber or substantially any suitable rigid or semi-rigid material, and used to restrict fluid flow through a given nozzle40,140or cylindrical opening217by channeling all flow through a reduced-size bore1026. By selecting a desired flow-restrictor1024according to size of its bore1026, a user may select the fluid flow ratio between the two (or more) outlets or nozzles of a given manifold. When a check valve is fitted over or downstream of the flow-restrictor1024, the check valve receiving restricted flow will still emit that flow into the mixing chamber provided that the fluid pressure exiting the flow-restrictor1024exceeds the fluid pressure of the mixing chamber, but in a thinner or otherwise smaller stream than the higher-flow fluid of the other, non-restricted outlet(s) or nozzle(s). It will be appreciated that a similar effect may also be achieved without the use of a flow-restrictor1024, such as by regulating (reducing) the fluid pressure of one fluid flow compared to the fluid pressure of the other fluid flow, to achieve an uneven (non-1:1) ratio of one fluid component to the other in the mixing chamber. Thus, the crossover prevention valve of the present invention is effective in simplifying the use of multi-component reactive fluid mixing and dispensing systems, such as may be used for spray-dispensing two-part polyurethane foams for building or vehicle insulation, or for dispensing two-part epoxy adhesives, or the like. Such systems may include, for example, polyurethane elastomer systems, polyurethane adhesive and coating systems, polyurethane and polyurea systems, polyacrylic and polyurethane systems, epoxy adhesive systems, and substantially any reactive chemical system where cross contamination is to be avoided. The crossover prevention valve ensures that any mixing of reactive fluids takes place only in desired locations where any buildup of cured material can quickly and easily be cleared so that the system can be readied for further use. Although it is envisioned that the crossover prevention valve can be reused many times through many spaced-apart dispensing or spraying operations, the valve may be sufficiently economical as to be considered a disposable component that can be replaced daily, weekly, monthly or at any desired interval if it incurs wear during use. Changes and modifications in the specifically-described embodiments may be carried out without departing from the principles of the present invention, which is intended to be limited only by the scope of the appended claims as interpreted according to the principles of patent law including the doctrine of equivalents. | 34,654 |
11857995 | DETAILED DESCRIPTION OF THE EMBODIMENTS Features which have the same or a similar function will be described in the following using the same reference numeral. It is also understood that the description given with respect to reference numerals used in one embodiment also applies to the same reference numerals in connection with other embodiments unless something is stated to the contrary. FIG.1shows a first embodiment of a cartridge10. The cartridge10comprises an outlet12, two chambers14a,14band two pistons16a,16b. The outlet12of the cartridge10is sealed through the use of a cap mechanism18. The cap mechanism18comprises a cap20which is secured to the cartridge10by a circlip22engaging a sealing plug24. The outlets12are sealed through the use of the sealing plug24. The cartridge10shown inFIG.1is a so-called1:1cartridge10. FIG.2shows a further embodiment of a cartridge10. In contrast to the embodiment ofFIG.1the cartridge10ofFIG.2shows a so-called4:1cartridge10. This means that a volume of material M that can be stored in the first chamber14bis four times a volume of material M′ that can be stored in the second chamber14a. A further difference between the cartridges10ofFIG.1andFIG.2is the closure cap26. The closure cap26ofFIG.2is secured at the cartridge10by a so-called bayonet means or device27as is well known in the art. Other kinds of closure caps (not shown) can also be used to seal off the outlet12from the cartridge10. The closure cap26, the cap mechanism18and the ratios of cartridges10shown inFIG.1andFIG.2can be arbitrarily combined, depending on the specific use of the cartridge10and/or of the materials to be dispensed using said cartridge10. Since the volume of the chambers14a,14bof the cartridge ofFIG.2is different, the outer diameter, i.e. the size of the pistons16a,16bemployed in the chambers14a,14bis also different as is clear fromFIG.2. FIG.3shows a schematic view of a piston16. The piston16comprises a generally cylindrically shaped piston body28and a piston cover30. The piston cover30covers at least a substantial part of a first side32of the piston16. The piston body28further comprises a centering portion34in the form of a circumferentially extending chamfered lip34aat the first side32. The lip34ahas three venting slots36disposed therein as venting means or system36ain order to permit venting of air present between the lip34aand a chamber wall of the cartridge (not shown) once the piston16is installed in the cartridge10and the venting process is carried out. A sealing lip38is disposed beneath the chamfered lip34aas a sealing means or device38a. The selling lip38is provided to ensure a seal between the cartridge10and the piston16in order to prevent air or the like from entering or exiting the cartridge10via the sealing lip38. As can be seen the sealing lip38is adjacent to the centering portion34. Moreover, a boundary of the venting slots36is preferably directly adjacent to a boundary of the sealing lip38which is adjacent to the centering portion34. This ensures that the venting means36aare positioned such that air can be reliably vented from the space between the centering lip34and the cartridge wall. In the Figure shown, the venting slots36have the form of a generally U-shaped valley in a cross-section thereof. Naturally speaking any other kind of shape can be selected for the venting slots36, such as a V-shaped valley or a simple through bore extending through the centering portion. On insertion of the piston16into the cartridge10the centering portion34not only functions as a centering aid to protect the sealing lip38from becoming damaged on insertion of the piston16into the cartridge and thus aids in avoiding leaks, but also as a scraper and thereby helps to clear material and any particles present at the cartridge wall from the area close to the cartridge wall (this is naturally only the case when the materials include particles). In this connection it should be noted that the piston cover30is typically made from a material different from that of the piston body28. The material of the piston cover30can e.g. comprise PE or PBT; that of the piston body28can e.g. comprise PA (polyamide) or HDPE. In a preferred embodiment of the two-component piston16, the piston cover30comprises PBT and the piston body28comprises HDPE. The piston cover30has a concavely shaped central region42which can be considered to have the shape of a plate. Venting grooves (not shown) can be disposed at a front side50of the piston cover30to facilitate the air removal from the concavely shaped central region42. Such venting grooves could extend from the central region42of the piston cover30, and also project downwardly along a peripherally extending side portion44of the piston cover30into a groove46formed within the piston body28. The venting grooves could extend into the groove46over a complete height of the side portion44. FIG.4shows a section through the piston16ofFIG.3along the sectional line A-A ofFIG.3that coincides with a longitudinal axis A of the piston16. The piston cover30extends into the peripherally extending groove46of the piston body28. Moreover, the piston cover30has the front side50at the first side32and a rear side48. The rear side48has a shape which is complementary to a substantial part of the shape of the first side32of the piston body28. The piston cover30also has a so-called valve pin52which forms part of a valve54arranged between the piston cover30and the piston body28. The center of the valve pin52coincides with the longitudinal axis A of the piston16. At the first side32, the piston body28comprises an inner wall33having a top end40′, an outer surface40and a valve surface40″. Parts of the rear side48the piston cover30are supported at the inner wall33in a non-venting state of the piston16. On installation of the piston16into the cartridge10, the valve pin52can be actuated. Thereby the piston cover30is lifted off from the piston body28and permits an air flow in a venting channel (not shown) then present between the rear side50of the piston cover30and the wall33of the piston body28, i.e. between the piston cover and the top end40′, the outer surface40and the valve surface40″. This then permits a venting of residual are present at the first side32of the piston16from the front side50of the piston cover via the valve54. On actuating the valve pin52from the second side68, the valve pin52is moved along the longitudinal axis A in the direction of the piston cover30causing the concavely shaped central region42to deflect and to become less concave or in some instances even convex. Thereby forming the venting channel (not shown) between the rear side50of the piston cover30and the piston body28in the region of the top end40′, the outer surface40as well as the valve surface40″. The longer a length of the valve pin52selected, the further the piston cover30can be lifted from the piston body28. Thereby, a space of the venting channel provided for air to be vented from the cartridge10via the piston16is enlarged. Rather than using the valve pin52shown in the Figures other forms of valve members52a, such as a hollow cylindrical member (not shown) can be used. The valve member52ahas two functions, namely to cooperate with a plunger for venting and with the valve surface40″ of the piston body to form the valve54. The piston16has an outer peripheral surface56formed by a peripherally extending outer wall57, with the annular groove46being formed between the outer wall57and the inner wall33. The outer peripheral surface56respectively the outer wall57ofFIG.4has a substantially cylindrical outer shape and has the chamfered centering lip34at the first side32. Following an outer contour of the outer peripheral surface56from the first side32to a second side68of the piston16, the piston body28comprises the centering lip34, the sealing lip38, a first recess58and a stabilizing projection60formed at the second side68. The first recess58is arranged between the sealing lip38and the stabilizing projection60. The stabilizing projection60is disposed on the piston16in order to stabilize the piston16as it travels along the cartridge wall during a dispensing action. This ensures that the piston16travels along the cartridge wall in an as uniform as possible manner. Moreover, a sprue mark78is present in the first recess58, indicating that the piston body28is formed in an injection molding process and that the point of injection of the molding material at the corresponding mold96(seeFIG.6B) is present in a region of the mold designed to form the outer wall57. The second side68of the piston16further comprises a central recess70into which a plunger (not shown) can be introduced in order to actuate the valve pin52. The second side68can further be actuated to move the piston16in the cartridge to dispense a material M, M′ present in the cartridge10via the outlet12. The plunger is designed such that it does not engage the valve54during a dispensing action, as otherwise a component present in the cartridge10could leak out of the cartridge10via the central recess70on dispensing. The piston body28can comprise an O-ring (not shown) arranged at the outer peripheral surface56. Such sealing O-rings are advantageously used, in order to ensure a continuous seal of cartridges that are not only used for one application, but for many applications spaced apart in time. The piston cover30is non-releasably connected to the piston body28. The non-releasable connection is formed by a part62of the piston body28extending through an attachment portion64of the piston cover30. The piston cover30comprises at least two attachment portions64for the non-releasable connection between the piston cover30and the piston body28. The piston body28comprises two parts62that each respectively extend through a respective attachment portion64. The attachment portions64are arranged such that they face one another on opposite sides of the longitudinal axis A. The attachment portion64projects from the piston cover30at least generally in the direction of the second side68. Each attachment portion64comprises an aperture64′ (see alsoFIGS.5A to5C) and the part62of the piston body28that extends through the attachment portion64at least substantially completely fills an internal space of the aperture64′. In the present example the part62of the piston body28that extends through the attachment portion64is formed by a web62′ of material that extends through the attachment portion64. The web of material is non-releasably connected to two sections of the piston body28disposed on either side of the attachment portion64. The web62′ is formed from the same material as the piston body. Similarly the attachment portion64is formed from the same material as the piston cover30. The attachment portion64is integrally formed with the piston cover and projects from the piston cover30at a region of a base66of the groove46of the piston body28in the direction of the second side68. The attachment portion64is completely received in the piston body. To this end the base66of the groove46comprises an attachment portion recess65. The piston body28is formed around the attachment portion64and adjacent to the piston cover30. The central region42of the piston cover comprises a crown74. A sprue mark76is present at the center of the crown74. This sprue mark76indicates that the piston cover30was injection molded and that the point of injection of the molding material at a corresponding mold92(seeFIG.6A) is present in the region of the crown74. FIGS.5A to5Cshow various views of the piston cover30. As can be seen the aperture64′ has an at least generally rectangular shape. The dimensions of the aperture64′ are chosen such that the lower frame84of the aperture64′ (i.e. the part which is completely embedded in the second plastic) is located roughly at equal distances to the surrounding exterior surfaces of the piston body28, i.e. the outer wall57and a wall of the recess70. The lower frame84is connected to the upper frame86of the attachment portion64via two arms88. In the drawing shown a width of the arms88is greater than a height of the lower frame84. The height of the lower frame could also be more than a width of the arms88or equivalent thereto. The upper frame86is integrally formed at a lower side89of the piston cover30and thus projects from the piston cover30at the lower side89thereof. The side portion44of the piston cover has an undulated shape indicated by two recesses80,80′ and two peaks82,82′. These features are present in order to ensure a gripping of the piston cover30during a forming of the piston body28as will be discussed in the following. FIG.6Ashows a schematic section of an injection mold90for the two-component piston16discussed in the foregoing. The injection mold90comprises a first mold92for the piston cover30. The first mold has a first injection channel94forming a first point of injection for the injection molding material for the piston cover30. The first injection channel94is present at a part of the first mold92for molding the front side50of the piston cover30. The injection molding material is introduced into the first mold92at the respective temperatures and pressures typically used for the material of the piston cover30via the first injection channel94. On molding the piston cover30the sprue mark76will be present at the crown74. As shown inFIG.6B, the injection mold90further comprises a second mold96for the piston body28. On injection molding the piston16, the piston cover is initially molded in the first mold92and subsequently forms a part of the second mold96. The second mold96comprises a second injection channel98forming a second point of injection used for the injection of molding material for the piston body28. The second point of injection is present in a region of a part of the second mold96for an outer peripheral wall57of the piston body28. Thus, in the method of manufacturing the two-component piston, the sprue marks for the piston cover30and for the piston body28are moved in comparison to prior art molds. In the prior art processes, the plastic was injected from the bottom of the pin which is also the position where the valve is operated (by pressing the pin in the direction of the material side). In order to minimize the size of the sprue mark formed there good care needed to be taken to keep the sprue mark under control. This necessitated the use of a needle valve for the hot runner which is rather expensive. Moving the sprue mark to the front side of the piston cover in the new method, the position of the sprue mark is less critical with respect to any local residual resin. Thus a cheaper runner system can be used. In this connection it should be noted that the position of the sprue needs to be close to the axis of symmetry for the formation of the piston cover30. Also the sprue mark78for the piston body has been moved from the second side68to the outer wall57in comparison to prior art molds. This also simplifies the method of manufacture of the piston body28. On making a piston the following method of making the two-component piston16is carried out: In a first step the piston cover30is formed by injecting injection molding material via the first injection channel94into the first mold92. Subsequently in a second step the piston body28is formed at the piston cover30in the second mold96. During the first step the piston cover30is formed starting from a position present at the front side50of the piston cover30, more specifically at a position representing the center of the crown74of the central region42. This starting position is later defined by the sprue mark76present at the piston cover30. Once the piston cover30has been allowed to cure for a certain period of time either completely or partially, parts of the first mold92specific to the rear side48of the piston cover30are removed from the injection mold90. The piston cover30is then used as a part of a second mold96for the piston body28. This can be conducted in a further injection mold90or in the same injection mold90in which the piston cover30was formed. During the second step the piston body28is formed starting from a position present at the outer wall57, more specifically, at a position present at the recess58of the outer wall57via the second injection channel98. This second injection channel98forms the second point of injection that causes the sprue mark78to be formed in the recess58. Once the position of the piston cover30has been ensured in the second mold96the remaining parts of the second mold96specific to the piston body28are introduced into the injection mold90. Thereafter, the piston body28is formed by introducing injection molding material into the second mold96at the respective temperatures and pressures typically used for the material of the piston body28via the second point of injection96. Thereafter, the piston body is allowed to at least partly, preferably completely, cure in the second mold96, before the final two-component piston16is removed from the second mold96and made available for assembly with the cartridge10. | 17,164 |
11857996 | DESCRIPTION OF EMBODIMENTS The present invention will now be described in detail by means of embodiments and with reference to the accompanying drawings. Other features and uses of the invention and its associated advantages will be appreciated by one skilled in the art upon reading the specification and the accompanying examples. It will be appreciated that this invention is not limited to the particular embodiments shown herein. The following examples are appended for illustrative purposes only and are not intended to limit the scope of the invention as the scope of the present invention is limited only by the appended claims and equivalents thereof. Unless otherwise defined, the terms used herein are intended to have the meanings commonly understood by those skilled in the art of the field to which the invention pertains. The term “about” as used in connection with a numerical value throughout the specification and claims denotes an accuracy range well known and acceptable to one skilled in the art. The term coating means that a film or layer of, for example, a foam, filter, paper, paint has been applied on the surface of an object, commonly called a substrate. Various coatings are often used to improve surface properties of the substrate, such as appearance, adhesion, corrosion resistance, abrasion resistance and scratch resistance. The term mantle means that an object has an outer sheath, the outer sheath is applied by sheathing and the object/substrate is sheathed. In the description, the terms coating and mantle are considered synonymous. The invention is described below with reference to a pipe, but other cylindrical objects such as cables and hoses can of course be coated with the described tool. FIG.1shows a side view of a tool1according to the present invention. The tool comprises a tool head2, with an axially through hole3having a substantially circular cross-section. The tool head2is in this embodiment divided into two halves2a,2b, so that the tool head can easily be passed over a pipe10(seeFIG.2) which is to be coated with a liquid agent, i.e. get a mantle, and then closed around it. Furthermore, the tool1comprises two handles4a,4b, and in this embodiment a spring5is arranged between the handles4a,4b, and an injection pipe11to the distribution chamber12(shown inFIG.2) to be able to supply liquid agent to it. The handles4a,4bare connected to each other, for example via a hinge or a pin6. The tool head can be opened and closed to facilitate the positioning of the tool1around a pipe or the like. The tool head2then comprises two halves2a,2bwhich move from a closed position to an open position by pressing the handles4a,4btogether, or vice versa by opening the handles, like the mechanism of a pair of scissors. In the case of opening of the head by pressing the handles together, the spring5return the handles4to the initial position when the handles4a,4bare no longer pressed together. In the open position a pipe10is positioned in the opening, then the tool head2is closed around the pipe to be able to coat the pipe all around with an even layer of liquid agent, for example an insulating foam, an adhesive, paint, or a chemical metal. In a second embodiment the tool head2is not divisible. Then the pipe instead is in-serted/fed into the through hole3of the tool head, or vice versa, the tool head2can be arranged around the pipe10. FIG.2shows a cross-section of the tool head2around a pipe10. The tool head2comprises an inner flange8where the through hole3in at least one axial position is delimited by an application surface9, having an application radius r1, adapted to be guided along the pipe10to be coated. This can be done by selecting a tool head2which has an application radius r1 slightly larger than the radius of the pipe10to be coated. For example, the application radius may be 0.3 mm larger than the radius of the tube10if a 12 mm tool head is used. The clearance can be adapted to the dimensions and surface of the pipe, e.g. 1-10% larger radius. The tool head2further comprises an outer flange16which extends axially after the inner flange8at a radial distance from the center of the hole, which radial distance is larger than the application radius r1. Preferably, the through hole3in at least one position is defined by a mantle forming surface18having a forming radius r2, which is larger than the application radius r1. In this embodiment, the injection pipe11is arranged at the bottom of the tool head2, so that the agent that is to be applied has the greatest possibility of reaching the back of the tool head2, but it is not essential to arrange it close to the bottom. The injection pipe11is connected to a container (not shown), comprising the liquid agent to be applied. The container can, for example, be connected via a hose or other suitable part to the injection pipe11. The container can be a pressurized container, or the pressure can be applied manually. The container comprising the liquid agent to be applied is not part of the present invention. The liquid agent is led/pushed further into a distribution chamber12of the tool head2. The distribution chamber12is for the agent to be evenly distributed around the pipe10and has a volume so that the agent can reach around the pipe10. The distribution chamber12runs around the inner flange8, which leads out to the through hole3where the outer flange16extends axially after the inner flange8. An injection pipe11leads to the distribution chamber12for supplying the liquid agent to it. When liquid agent is supplied to the distribution chamber12the pressure will be highest on the side where the injection pipe11connects to the distribution chamber12, and lowest on the opposite side. The outlet13is distributed around the through hole3and has an asymmetrical restriction, so that the outlet is restricted where the pressure is as highest14. In the embodiment shown inFIGS.1-4, the asymmetrical restriction is provided by an inner cam17of the outer flange16. The inner cam17has a varying radial distance r3 from the center of the through hole3. The varying distance r3 is preferably greater than the application radius r1, and at most equal to the formation radius r2, i.e. r1≤r3≤r2. At a position14closest to the injection pipe11, the cam is at its highest (in radial direction) to gradually become lower towards the opposite side15where it is at its lowest. The distance between the application surface9of the inner sleeve8and the mantle forming surface18of the outer flange16leaves a play so that the agent shall lie against the surface of the pipe10. The mantle forming surface18of the outer flange16presses the agent against the surface of the pipe10to obtain sufficient adhesion. The length of the inner flange8is preferably long enough to obtain lateral stability when the tool head2is advanced by means of the handles4a,4b. FIG.3shows the tool head2from above arranged around a pipe10. The drawing also shows the injection pipe11, the inner cam17, and the mantle forming surface18. FIGS.4aandbshow a detailed view of the tool head halves2a,2bwith the addition that the outer flange16is terminated with a release surface19having gradually increasing radius. The release surface19can of course be combined with other embodiments. The halves2a,2bcomprise at least one inner cam17, or another part which creates a asymmetrical outlet13. This is because the pressure is highest at the injection pipe11, and lowest on the opposite side. The pressure in relation to the outlet13should give a constant amount of mass around the entire flange, i.e. the same amount of mass should exit regardless of where on the circumference of the pipe10it exits. The difference in radius between the application surface9of the inner flange8and the mantle forming surface18of the outer flange16creates a play for the agent to adhere against the surface of the pipe10. The asymmetrical restriction is provided partly between the inner flange8and the inner cam17. This fulfills the function that the inner flange8can have a greater clearance to the pipe to be coated, as the mantle here is formed independently of the pipe10. It is also conceivable that the inner cam17lies axially outside of the inner flange8and only acts against the outer surface of the pipe10. The tool head can, for example, be sealed with male and female sealings21,22to prevent the agent from being pressed out. Other solutions for achieving the same purpose are known to those skilled in the art. The dimensions of the tool head2are scalable and can therefore be dimensioned so that the tool can be used by the general public as a hand-held tool, but it can also be used for coating larger pipes and then being adapted for industrial use. Several injection pipes may also be needed. The tool1can be manufactured as a set, comparable to a socket wrench set, i.e. tool heads2are manufactured in different dimensions and are adapted to different purposes. Each respective tool head2can be mounted to the handles4a,4b. This means that one tool set can be comprised of handles4a,4bof different length/size and a number of tool heads with different dimensions. The parts of the tool, such as the tool head2or handles4a,4bcan be manufactured of different materials. The choice of material depends on the type of coating and size of substrate (pipe) it is intended for. For example, the parts of the hand-held tool1can be made of a light metal, for example aluminium. In one embodiment, a coating/alloy is applied on the metal so that the tool becomes smoother so that the coating agent does not stick. In another embodiment, the entire tool1is manufactured in one piece, for example by molding. It could be made of, for example, a plastic to keep costs down. The tool head2is then cast to fit different dimensions. The size of the handles is adapted to the purpose. The tool1may in one embodiment also include a support for better support and control when moving the tool forwards. A lock can also be included so that the tool can be locked in the closed position. A container with coating agent is connected where a pressure is produced. Either the pressure is in the container, or it is built up manually. The connection is made with or without hose. The nozzle on the injection pipe may in one embodiment be movable to facilitate angling of the tool. The tool head2is arranged around the pipe10, after which the pressure in the container is increased until it is seen that the agent flows out. Then the tool1is moved forward in a speed which leaves the desired thickness of the coating (mantle). For example, commercial polyurethane foam that expands and dries can be used to insulate pipes. The agent applied to a pipe does not have to be for insulating purposes. For example, paint, adhesives, silicone, softener, etc. can also be applied with the present invention. Coating of pipes10with different dimensions has been tested successfully, for example pipes with dimensions 6, 10, 12, 15 mm and 110 mm. The size does not limit the present invention. FIGS.5aandbshow further embodiments of the tool head, where the liquid agent is evenly distributed by means of different sized outlets23or distributed by means of different den-sities between the outlets. It is of course possible to combine density and size of the outlets in order to control that the outlet area is varied around the through hole. Of course, it does not have to be circular holes, but holes of all forms work just as well. In summary, the present invention provides a tool that simplifies the process of coating a pipe with an even layer of agent. The thickness of the coating is regulated by how fast the tool is moved over the pipe. With the tool, no accurate measurement needs to be made of pipes to be insulated. The tool is light and takes up little space, which means that you can easily bring tools that fit different pipe dimensions. Foam is cheaper than other insulation materials, does not form joints, provides no waste, takes up much less space during transport and is faster to apply than other insulation materials, which leads to lower labor costs. | 12,169 |
11857997 | DETAILED DESCRIPTION The following detailed description is merely illustrative and is not intended to limit embodiments and/or application or uses of embodiments. Furthermore, there is no intention to be bound by any expressed or implied information presented in the preceding Background or Summary sections, or in the Detailed Description section. One or more embodiments are now described with reference to the drawings, wherein like referenced numerals are used to refer to like elements throughout. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a more thorough understanding of the one or more embodiments. It is evident, however, in various cases, that the one or more embodiments can be practiced without these specific details. CMOS and post CMOS devices for advanced computing can be fabricated using one or more lithography processes to pattern metal materials (e.g., to pattern layers of aluminum, copper, nickel, and/or the like). The lithography processes can further involve the use of highly basic solutions (e.g., potassium hydroxide, tetramethylammonium hydroxide, and/or the like). However, the basic solutions used in the one or more lithography processes can have undesirable effects on one or more metal substrates being patterned. Thereby, the lithography process utilized to pattern one or more metal layers can negatively degrade one or more metal substrates of the device being fabricated. Various embodiments described herein can regard one or more methods of protecting the metal substrates from degradation during the one or more lithography processes. For example, one or more embodiments described herein can regard the depositing of a film of organic polymers to coat and protect the metal substrate. For instance, the organic polymers can comprise one or more functional groups that can interact with one or more metal oxide surfaces of the metal substrate. In one or more embodiments, the polymer film can comprise polymers and/or co-polymers having one or more phosphonic acid groups (e.g., pendent functional groups) that can form covalent bonds with native metal oxides on the metal substrate and prevent basic solutions from reacting with the surface of the metal substrate during the lithography process. For instance, the one or more polymers and/or co-polymers can self-assemble on one or more metal oxide surfaces of the metal substrate to form a monolayer or thin film. Additionally, various embodiments described herein can regard one or more metal protection structures comprising the organic polymer film that can be established prior to the implementation of one or more lithography processes. As described herein, the terms “lithography process” and/or “lithography processes” can refer to the formation of three-dimensional relief images or patterns on a substrate (e.g., a metal substrate) for subsequent transfer of the pattern to the substrate. In semiconductor lithography, the patterns can be formed by a light sensitive polymer called a photo-resist. To build the complex structures that make up a semiconductor device and the many wires that connect the various features of a circuit, lithography processes and/or etch pattern transfer steps can be repeated multiple times. Each pattern being printed on the substrate can be aligned to the previously formed patterns and slowly the subject features (e.g., conductors, insulators and/or selectively doped regions) can be built up to form the final device. As described herein, the terms “etching process”, “etching process”, “removal process”, and/or “removal processes” can refer to any process that removes one or more first materials from one or more second materials. Example etching and/or removal processes can include, but are not limited to: wet etching, dry etching (e.g., reactive ion etching (“RIE”)), chemical-mechanical planarization (“CMP”), a combination thereof, and/or the like. FIG.1illustrates a diagram of an example, non-limiting metal protection structure100that can be established in preparation of one or more lithography processes in accordance with one or more embodiments described herein. Repetitive description of like elements employed in other embodiments described herein is omitted for sake of brevity. As shown inFIG.1, the metal protection structure100can comprise one or more polymer films102that can coat and protect one or more metal substrates104. In various embodiments, the one or more metal substrates104can comprise one or more layers of a metal and/or metal alloy. Example metals that can be comprised within the one or more metal substrates104can include, but are not limited to: aluminum, copper, nickel, silicon, hafnium, titanium, a combination thereof, and/or the like. In one or more embodiments, the one or more metal substrates104can have a thickness (e.g., along the y-axis shown inFIG.1) of, for example, greater than or equal to 20 nanometers (nm) and less than or equal to 5 micrometers. Further, one or more surfaces of the one or more metal substrates104can be oxidized, forming one or more metal oxide surfaces106of the metal substrates104. Example metal oxides that can be comprised within the one or more metal oxide surfaces106can include, but are not limited to: aluminum oxide, copper oxide, nickel oxide, silicon oxide, hafnium oxide, titanium oxide, a combination thereof, and/or the like. In various embodiments, the one or more metal oxide surfaces106can be native to the metal substrate104. In one or more embodiments, the one or more metal oxide surfaces106can be the result of one or more oxidation conditions (e.g., originating from the ambient environment) and/or reactions (e.g., originating from one or more implemented chemical reactions). In one or more embodiments, the one or more metal oxide surfaces106can have a thickness (e.g., along the y-axis shown inFIG.1) of, for example, greater than or equal to 1 nm and less than or equal to 10 nm. Additionally, whileFIG.1illustrates the metal oxide surface106positioned at a single surface of the metal substrate104, embodiments comprising one or more metal oxide surfaces106positioned at multiple surfaces of the metal substrate104are also envisaged. Further, the metal oxide surface106can cover an entirety of the metal substrate104surface or a portion of the metal substrate104surface. In one or more embodiments, the one or more metal substrates104, and thereby the one or more metal oxide surfaces106, can be positioned on one or more semiconductor substrates108. For example, the one or more semiconductor substrates108can be crystalline, semi-crystalline, microcrystalline, or amorphous. The semiconductor substrate108can comprise essentially (e.g., except for contaminants) a single element (e.g., silicon or germanium) and/or a compound (e.g., aluminum oxide, silicon dioxide, gallium arsenide, silicon carbide, silicon germanium, a combination thereof, and/or the like). The semiconductor substrate108can also have multiple material layers, such as, but not limited to: a semiconductor-on-insulator substrate (“SeOI”), a silicon-on-insulator substrate (“SOI”), germanium-on-insulator substrate (“GeOI”), silicon-germanium-on-insulator substrate (“SGOI”), a combination thereof, and/or the like. Additionally, the semiconductor substrate108can also have other layers, such as oxides with high dielectric constants (“high-K oxides”) and/or nitrides. In one or more embodiments, the semiconductor substrate108can be a silicon wafer. In various embodiments, the semiconductor substrate108can comprise a single crystal silicon (Si), silicon germanium (e.g., characterized by the chemical formula SiGe), a Group III-V semiconductor wafer or surface/active layer, a combination thereof, and/or the like. As shown inFIG.1, the one or more polymer films102can be positioned on the one or more metal oxide surfaces106. The one or more polymer films102can comprise one or more layers of organic polymers and/or co-polymers. Additionally, the one or more organic polymers and/or co-polymers can comprise one or more functional groups that can interact with the one or more metal oxide surfaces106. In various embodiments, the one or more functional groups comprised within the one or more polymer films102can bond the one or more polymer films102to the one or more metal oxide surfaces106covalently and/or via one or more electrostatic interactions. Example functional groups that can be included in the one or more organic polymers and/or co-polymers of the polymer film102can include, but are not limited to: phosphonic acid groups, hydroxamic acid groups, carboxylic acid groups, a combination thereof, and/or the like. Additionally, in one or more embodiments the one or more functional groups can enable the one or more organic polymers and/or co-polymers to self-assemble one or more layers on the metal oxide surface106to form the polymer film102. For instance, polymer film102can be a self-assembled monolayer (e.g., a single layer of the polymers and/or co-polymers, such that the dimensions of the polymer film102does not exceed the molecular dimensions of the constituent molecules). Alternatively, the one or more polymer films102can comprise a plurality of self-assembled layers of the one or more organic polymers and/or co-polymers. For instance, the one or more polymer films102can be thin film comprising a plurality of monolayers. In one or more embodiments, the one or more polymer films102can have a thickness (e.g., along the y-axis shown inFIG.1) of, for example, greater than or equal to 1 nm and less than or equal to 500 nm. Example organic polymers and/or co-polymers that can be comprised within the one or more polymer films102, and/or that can have the one or more functional groups, can include, but are not limited to: poly(styrenephosphonic) acid,-co-poly(styrene-vinylphosphonic acid), poly(vinylphosphonic acid), poly(vinylphosphonic acid)-co-poly(methacrylic acid), a combination thereof, and/or the like. In various embodiments, the one or more polymer films102can cover an entirety of the metal oxide surface106or a portion of the metal oxide surface106. For example, the one or more polymer films102can coat the one or more metal oxide surfaces106in a continuous, or near continuous, manner. In various embodiments, the metal protection structure100can be formed during the fabrication of one or more CMOS or post CMOS devices. For example, one or more additional metal layers can be lithographically patterned onto the metal protection structure100, wherein the polymer film102can protect the metal substrate104from degradation by the one or more lithography processes. For instance, the one or more polymer films102can protect the one or more metal substrates104from chemically reacting with one or more basic solutions employed during implementation of the one or more lithography processes. FIG.2illustrates a diagram of the example, non-limiting metal protection structure100during a first stage of manufacturing in accordance with one or more embodiments described herein. Repetitive description of like elements employed in other embodiments described herein is omitted for sake of brevity. During a first stage of manufacturing, the one or more metal substrates104can be cleaned prior to depositing the one or more polymer films102. For example, the one or more metal substrates104and/or metal oxide surfaces106can be cleaned via one or more cleaning processes that can include, but are not limited to: an oxygen plasma cleaning, an ultraviolet-ozone cleaning, a wet process cleaning (e.g., comprising a successive wash with acetone, alcohol, and water), a combination thereof, and/or the like. Additionally, the one or more cleaning processes can include one or more drying steps. For instance, the one or more metal substrates104and/or metal oxide surfaces106can be dried under inert gas (e.g., nitrogen). In various embodiments, the one or more cleaning processes performed at the first stage of manufacturing can remove one or more contaminants and/or debris from the one or more metal oxide surfaces106that could otherwise impede one or more interactions between the one or more polymer films102and metal oxide surfaces106. For example, contaminants such as oils, dust, grit, grime, and/or dirt can inhibit covalent bonding between the one or more polymers and/or co-polymers of the polymer films102and the one or more metal oxide surfaces106such that the polymer film102subsequently forms in a discontinuous manner (e.g., resulting in one or more gaps within the polymer film102). In various embodiments, the first stage of manufacturing can comprise cleaning the one or more metal substrates104with an oxygen plasma cleaning process. The oxygen plasma cleaning process can include plasma generated by a radio-frequency electromagnetic field, a direct current (“DC”) electromagnetic filed, a pulsed DC electromagnetic field, and/or an asymmetric pulsed electromagnetic field. In one or more embodiments, the oxygen plasma can be generated by intense ultra-violet light. In one or more embodiments, the oxygen plasma can generate one or more metal oxide groups on the surface of the metal substrate104to generate and/or contribute to the one or more metal oxide surfaces106. Additionally, the first stage of manufacturing can include a plurality of cleaning processes. For instance, the one or more metal substrates104can be rinsed with a cleaning solvent and treated with oxygen plasma. FIG.3illustrates a diagram of the example, non-limiting metal protection structure100during a second stage of manufacturing in accordance with one or more embodiments described herein. Repetitive description of like elements employed in other embodiments described herein is omitted for sake of brevity. During a second stage of manufacturing, one or more aqueous solutions302comprising the one or more polymers, co-polymers, and/or functional groups comprised within the one or more polymer films102can be deposited onto the one or more metal substrates104(e.g., onto the one or more metal oxide surfaces106). The one or more aqueous solutions302can comprise the one or more polymers and/or co-polymers of the polymer films102in conjunction with one or more solvents and/or surfactants. For instance, the one or more polymers and/or co-polymers of the polymer films102can be water soluble, and the one or more aqueous solutions302can comprise the one or more polymers and/or co-polymers in water. The one or more aqueous solutions302can be deposited via one or more deposition processes that can include, but are not limited to: spin coating, doctor blading, immersion coating (e.g., dip coating), roller coating, spray coating, wipe coating, a combination thereof, and/or the like. For instance, the one or more aqueous solutions302can be spin coated onto the one or more metal oxide surfaces106, wherein the metal substrate104can be flooded with the aqueous solution302and then spun to facilitate an even, or substantially even, distribution of the aqueous solution302across the one or more metal oxide surfaces106. In another instance, the one or more aqueous solutions302can be immersion coated onto the one or more metal oxide surfaces106, wherein the metal substrate104can be immersed in the aqueous solution302and then withdrawn to facilitate deposition of the aqueous solution302across the one or more metal oxide surfaces106. Additionally, the one or more aqueous solutions302can be deposited onto the metal substrates104(e.g., onto the one or more metal oxide surfaces106) to one or more desired thicknesses (e.g., along the y-axis shown inFIG.3). One of ordinary skill in the art will recognize that the desired thickness can vary depending, for example, on the one or more lithography processes to be subsequently implemented. In accordance with various embodiments described herein, the one or more polymers and/or co-polymers included in the aqueous solution302that subsequently forms the polymer film102can include one or more alkyl and/or aryl molecular backbones (e.g., a polystyrene, polyvinyl, and/or poly(styrene-vinyl) molecular backbone) having one or more functional groups (e.g., one or more pendent phosphonic acid groups). In one or more embodiments, the one or more polymers and/or co-polymers can form self-assembled monolayers on the one or more metal oxide surfaces106, wherein the one or more functional groups can covalently bond with one or more oxide groups and/or hydroxyl groups of the metal oxide surfaces106. Further, the molecular backbones of the polymers and/or co-polymers can arrange themselves in an ordered array substantially parallel to each other and/or, for example, substantially perpendicular to the one or more metal oxide surfaces106. For instance, the one or more functional groups can be head groups of the one or more polymers and/or co-polymers bonded to the one or more metal oxide surfaces106, wherein the molecular backbones of the polymers and/or co-polymers can be tail groups that interact with neighboring polymers and/or co-polymers. FIG.4illustrates a diagram of the example, non-limiting metal protection structure100during a second stage of manufacturing in accordance with one or more embodiments described herein. Repetitive description of like elements employed in other embodiments described herein is omitted for sake of brevity. During a third stage of manufacturing, the one or more solvents and/or surfactants of the aqueous solution302can be removed from the one or more metal oxide surfaces106. For example, the one or more aqueous solutions302can be subjected to heat, reduced pressure, ventilation, a combination thereof, and/or the like. By removing the one or more diluents (e.g., solvents and/or surfactants) of the aqueous solution302, the metal protection structure100depicted inFIG.1can be achieved. In one or more embodiments, the one or more metal substrates104and/or metal oxide surfaces106can be heated. The heat can evaporate one or more solvents and/or surfactants from the one or more aqueous solutions302and/or can catalyze one or more interactions between the one or more polymers and/or co-polymers of the polymer film102and the metal oxide surfaces106. For example, evaporation of the one or more solvents of the aqueous solution302can be represented by the plurality of arrows depicted inFIG.4. In various embodiments, the one or more metal substrates104and/or metal oxide surfaces106can be heated to a temperature ranging from, for example, greater than or equal to 80 degrees Celsius (° C.) and less than or equal to 150° C. (e.g., 100-140° C.). Additionally, the one or more metal substrates104and/or metal oxide surfaces106can be heated for a period of time ranging from, for example, greater than or equal to 1 minute and less than or equal to 30 minutes (e.g., 1-5 minutes). FIG.5illustrates a diagram of the example, non-limiting metal protection structure100being implemented within a first stage of one or more lithography processes in accordance with one or more embodiments described herein. Repetitive description of like elements employed in other embodiments described herein is omitted for sake of brevity. During the first stage of the one or more lithography processes, the metal protection structure100can be cleaned and/or prepared for a photoresist502, and/or the photoresist502can be deposited onto the one or more polymer films102. Subsequent to formation of the one or more polymer films102, an exposed surface of the polymer films102can be cleaned in preparation of the photoresist502. For example, one or more contaminants can be removed from the surface of the polymer film102via a wet chemical treatment that can include, for instance, solutions of hydrogen peroxide, trichloroethylene, acetone, methanol, and/or the like. Additionally, the metal protection structure100can be heated to a temperature sufficient to remove any moisture. Further, a layer of the photoresist502can be deposited onto the one or more polymer films102via one or more deposition processes. For example, the photoresist502can be deposited via one or more spin coating depositions to provide a uniform thickness (e.g., along the y-axis shown inFIG.5). Wherein the photoresist502is deposited via an aqueous solution (e.g., via a spin coating deposition), one or more diluents (e.g., solvents) of the aqueous solution can be evaporated (e.g., via heating) to achieve the final thickness (e.g., along the y-axis shown inFIG.5) of the photoresist502. For example, the photoresist502can have a thickness (e.g., along the y-axis) ranging from greater than or equal to 0.5 micrometers and less than or equal to 5.0 micrometers. The photoresist502can comprise one or more photoactive compounds (“PAC”) that can be sensitive to radiation (e.g., light) exposure. For instance, the one or more PACs can undergo a chemical change in the presence of radiation exposure that alters the solubility of the PACs. Example PACs that can be comprised within the one or more photoresists502can include, but are not limited to: diazonaphthaquinone, chemically amplified positive-tone resists containing partially protected poly(hydroxystyrene) and a photoacid generator, a combination thereof, and/or the like. The chemical change can render the PACs soluble or insoluble in one or more developers subsequently used to remove a portion of the photoresist502and form a pattern in the photoresist502. For example, a positive photoresist502can comprise one or more PACs that become soluble in the developer once exposed to radiation (e.g., light); thereby subjecting the exposed portions to subsequent removal to form the photoresist502pattern. In another example, a negative photoresist502can comprise one or more PACs that become insoluble in the developer once exposed to radiation (e.g., light); thereby subjecting the portions protected from radiation to subsequent removal to form the photoresist502pattern. FIG.6illustrates a diagram of the example, non-limiting metal protection structure100being implemented within a second stage of one or more lithography processes in accordance with one or more embodiments described herein. Repetitive description of like elements employed in other embodiments described herein is omitted for sake of brevity. During the second stage of the one or more lithography processes, one or more portions of the photoresist502can be exposed to radiation (e.g., light) in order to pattern the photoresist502. As shown inFIG.6, one or more photomasks602can be utilized to cover one or more portions of the photoresist502. The portions of the photoresist502covered by the one or more photomasks602can be protected from exposure to radiation (e.g., represented by the down-ward pointing arrows inFIG.6). Additionally, portions of the photoresist502that are not covered by the one or more photomasks602can be exposed to the radiation. Thereby, a pattern of chemical reactivity in the photoresist502can be directed by the positioning of the one or more photomasks602. In accordance with the various embodiments described herein, the exposed portions of the photoresist502can undergo a chemical alteration induced by the radiation (e.g., light) that renders the portions soluble or insoluble in the presence of a developer. FIG.7illustrates a diagram of the example, non-limiting metal protection structure100being implemented within a third stage of one or more lithography processes in accordance with one or more embodiments described herein. Repetitive description of like elements employed in other embodiments described herein is omitted for sake of brevity. During the third stage of the one or more lithography processes, one or more developer solutions702can be utilized to removed one or more portions of the photoresist502. The one or more developer solutions702can be deposited onto the photoresist502to remove one or more portions of the photoresist502(e.g., via spin development, spray development, batch development, puddle development, and/or the like). For example,FIG.7depicts a positive photoresist502, in which the photoresist502portions exposed to radiation (e.g., light) have become soluble in the developer solution702, while the previously covered portions of the photoresist502(e.g., protected by the one or more photomasks602) remain insoluble in the developer solution702. The one or more developer solutions702can comprise base compounds that can be reactive with the metal substrate104. Example base compounds comprised within the one or more developer solutions702can include, but are not limited to: potassium hydroxide, tetramethylammonium hydroxide, tetraethylammonium hydroxide, sodium hydroxide (e.g., used with sodium chloride as a high-contrast developer for electron beam resists), a combination thereof, and/or the like. However, the one or more polymer films102can protect the metal substrate104from chemical interaction with the one or more developer solutions702. In accordance with various embodiments described herein, the one or more polymer films102can coat one or more surfaces of the metal substrate104(e.g., coat the one or more metal oxide surfaces106), and thereby form a barrier between the developer solution702and the metal substrate104. In one or more embodiments, the one or more polymer films102can be insoluble and/or inert, or substantially inert, with regards to the one or more developer solutions702. As shown inFIG.7, as the one or more developer solutions702remove portions of the photoresist502, one or more underlying portions of the metal substrate104would have otherwise been exposed to the developer solutions702absent the protection granted by the one or more polymer films102. For instance, the one or more polymer films102can remain positioned between the one or more developer solutions702and the metal substrate104despite the solubility of one or more portions of the photoresist502. FIG.8illustrates a diagram of the example, non-limiting metal protection structure100being implemented within a fourth stage of one or more lithography processes in accordance with one or more embodiments described herein. Repetitive description of like elements employed in other embodiments described herein is omitted for sake of brevity. During the fourth stage of the one or more lithography processes, the one or more developer solutions702can be removed in preparation for one or more subsequent implantation and/or etching processes to the metal substrate104. Removal of the one or more developer solutions702can inherently include removal of the one or more soluble portions of the photoresist502. Thereby, a pattern can be formed in the photoresist502, wherein the photoresist502pattern covers one or more portions of the polymer film102and metal substrate104and leaves other portions of the polymer film102and metal substrate104exposed. In various embodiments, the patterned photoresist502can be heated to harden the photoresist502. For example, the heat can induce crosslinking within the photoresist502, and thereby render the photoresist502more thermally stable. As shown inFIG.8, the photoresist502pattern can guide one or more implantation and/or etching process of the metal substrate104. For example,FIG.8illustrates an embodiment in which the metal substrate104can be subject to one or more etching processes. Portions of the polymer film102and/or metal substrate104covered by the photoresist502pattern can be protected from the one or more etching processes. In contrast, portions of the polymer film102and/or metal substrate104left exposed by the photoresist502pattern can be subject to the one or more etching processes. In various embodiments, one or more implants can be deposited into the portions of the polymer film102and/or metal substrate104left exposed by the photoresist502pattern. Thereby, the pattern of the photoresist502can be transferred to the implementation of the one or more implantation and/or etching processes, and the metal substrate104can be patterned. As shown inFIG.8, the one or more polymer films102can also be subject to the pattern transfer implemented via the one or more lithography processes. FIG.9illustrates a diagram of the example, non-limiting metal protection structure100being implemented within a fifth stage of one or more lithography processes in accordance with one or more embodiments described herein. Repetitive description of like elements employed in other embodiments described herein is omitted for sake of brevity. During the fifth stage of the one or more lithography processes, the photoresist502can be removed from the one or more polymer films102. In various embodiments, the photoresist502can be stripped from the one or more polymer films102via one or more wet stripping or dry stripping techniques. For example, the photoresist502can be removed via one or more plasma stripping techniques. During the photoresist502removal, the one or more polymer films102can protect the metal substrate104from undesirable degradation. For example,FIG.9illustrates an embodiment in which at least a portion of the polymer film102remains bonded to the metal substrate104. In another example, removal of the photoresist502can include a plasma stripping that is reactive towards organic polymers, wherein the polymer film102can act as a sacrificial layer and be removed with the photoresist502(e.g., leaving the patterned metal substrate104exposed). One of ordinary skill in the art will recognize that the metal substrate104can be patterned via multiple lithography processes. In one or more embodiments, the one or more polymer films102can be established prior to the plurality of lithography processes and protect the metal substrate104throughout the patterning. In addition, or alternatively, the one or more polymer films102can be established, or re-established, between lithography processes in accordance with the various embodiments described herein. FIG.10illustrates a flow diagram of an example, non-limiting method1000that can facilitate manufacturing the metal protection structure100in accordance with one or more embodiments described herein. Repetitive description of like elements employed in other embodiments described herein is omitted for sake of brevity. In various embodiments, method1000can be implemented to protect one or more metal substrates104from one or more undesirable chemical reactions with one or more developer solutions702implemented in one or more lithography processes. At1002, the method1000can comprise coating one or more metal substrates104with one or more polymer films102that can self-assemble on one or more metal oxides positioned on one or more surfaces (e.g., metal oxide surfaces106) of the metal substrate104. In accordance with the various embodiments described herein, the one or more metal oxides can be native to the one or more metal substrates104and/or can be induced by one or more chemical reactions (e.g., at least partially induced by an oxygen plasma cleaning process). Further, the one or more polymer films102can include one or more organic polymers and/or co-polymers (e.g., polystyrene, polyvinyl, poly(styrene-vinyl), and/or the like) comprising alkyl and/or aryl chemical structures. Additionally, the one or more organic polymers and/or co-polymers of the one or more polymer films102can include one or more functional groups (e.g., pendent functional groups) that can bond (e.g., covalently or electrostatically) to the one or more metal oxides. Example functional groups can include, but are not limited to: phosphonic acid groups, hydroxamic acid groups, carboxylic acid groups, a combination thereof, and/or the like. In various embodiments, the one or more polymer films102can form monolayers or a thin film on the metal oxides (e.g., on the one or more metal oxide surfaces106). At1004, the method1000can comprise covalently bonding the one or more polymer films102to the one or more metal oxides. As described herein, the one or more polymer films102can comprise organic polymers and/or co-polymers that can self-assemble on the one or more metal oxides. Further, the one or more polymer films102can be heated to remove diluents and/or catalyze covalent bonding between the functional groups of the polymers and/or co-polymers and the one or more metal oxides (e.g., metal oxide surfaces106). In various embodiments, the covalent bonding at1004can result in an ordered arrangement of the one or more organic polymers and/or co-polymers that can continuously, or near continuously, cover the one or more metal substrates104. FIG.11illustrates a flow diagram of an example, non-limiting method1100that can facilitate manufacturing the metal protection structure100in accordance with one or more embodiments described herein. Repetitive description of like elements employed in other embodiments described herein is omitted for sake of brevity. In various embodiments, method1100can be implemented to protect one or more metal substrates104from one or more undesirable chemical reactions with one or more developer solutions702implemented in one or more lithography processes. At1102, the method1100can comprise cleaning one or more metal substrates104. In accordance with the various embodiments described herein, one or more cleaning processes can be implemented at1102, including, but not limited to: an oxygen plasma cleaning, an ultraviolet-ozone cleaning, a wet process cleaning (e.g., comprising successive washes with acetone, alcohol, and water), a combination thereof, and/or the like. At1104, the method1100can comprise coating one or more metal substrates104with one or more aqueous solutions302comprising one or more polymer films102that can self-assemble on one or more metal oxides positioned on one or more surfaces (e.g., metal oxide surfaces106) of the metal substrate104. In accordance with the various embodiments described herein, the one or more metal oxides can be native to the one or more metal substrates104and/or can be induced by one or more chemical reactions (e.g., at least partially induced by an oxygen plasma cleaning process performed at1102). As described herein, the one or more aqueous solutions302can comprise the constituents of the polymer film102along with one or more solvents and/or surfactants. Additionally, the one or more aqueous solutions302can be coated onto the one or more metal substrates104via one or more deposition processes that can include, but are not limited to: spin coating, doctor blading, immersion coating (e.g., dip coating), roller coating, spray coating, wipe coating, a combination thereof, and/or the like. Further, the constituents of the one or more polymer films102can include one or more organic polymers and/or co-polymers (e.g., polystyrene, polyvinyl, poly(styrene-vinyl), and/or the like) comprising alkyl and/or aryl chemical structures. Additionally, the one or more organic polymers and/or co-polymers of the one or more polymer films102can include one or more functional groups (e.g., pendent functional groups) that can bond (e.g., covalently or electrostatically) to the one or more metal oxides. Example functional groups can include, but are not limited to: phosphonic acid groups, hydroxamic acid groups, carboxylic acid groups, a combination thereof, and/or the like. In various embodiments, the one or more polymer films102can form monolayers or a thin film on the metal oxides (e.g., on the one or more metal oxide surfaces106). At1106, the method1100can comprise heating the one or more metal substrates104and/or polymer films102. For example, the heating at1106can evaporate one or more diluents (e.g., solvents and/or surfactants) from the one or more aqueous solutions302. Further, the heating at1106can catalyze one or more chemical reactions between the polymer film102and the one or more metal oxides (e.g., the one or more metal oxide surfaces106. In various embodiments, method1100can establish the polymer film102that can protect the one or more metal substrates104from undesirable chemical reactions. In addition, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” That is, unless specified otherwise, or clear from context, “X employs A or B” is intended to mean any of the natural inclusive permutations. That is, if X employs A; X employs B; or X employs both A and B, then “X employs A or B” is satisfied under any of the foregoing instances. Moreover, articles “a” and “an” as used in the subject specification and annexed drawings should generally be construed to mean “one or more” unless specified otherwise or clear from context to be directed to a singular form. As used herein, the terms “example” and/or “exemplary” are utilized to mean serving as an example, instance, or illustration. For the avoidance of doubt, the subject matter disclosed herein is not limited by such examples. In addition, any aspect or design described herein as an “example” and/or “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects or designs, nor is it meant to preclude equivalent exemplary structures and techniques known to those of ordinary skill in the art. It is, of course, not possible to describe every conceivable combination of components, products and/or methods for purposes of describing this disclosure, but one of ordinary skill in the art can recognize that many further combinations and permutations of this disclosure are possible. Furthermore, to the extent that the terms “includes,” “has,” “possesses,” and the like are used in the detailed description, claims, appendices and drawings such terms are intended to be inclusive in a manner similar to the term “comprising” as “comprising” is interpreted when employed as a transitional word in a claim. The descriptions of the various embodiments have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein. | 38,540 |
11857998 | DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS In its broadest aspects, the present invention provides the skilled artisan with the analytical tools and technical know-how sufficient to create a hydrophobic or superhydrophobic coating on a substrate material. As used herein, a hydrophobic or superhydrophobic surface implies “anti-icing” properties such that, the surface in the presence of liquid water or water vapor, is characterized by the ability to (i) depress the freezing point of water and (ii) delay the onset of freezing of water at a temperature below the freezing point. Additionally, in this specification “water” does not necessarily mean pure water when referencing “hydrophobic properties”. Any number or type of impurities or additives may be present in water, as referenced herein. Referring generally toFIG.10, a flowchart representation of an embodiment of the claimed process500can be seen including, for example but not limited thereto, four steps. Step501is the initial application of the polymer or adhesive material to the substrate to create a coating layer15having a top surface17. The next step503is initially curing the applied coating layer for a specified amount of time, allowing the coating layer to partially cure. Another step505includes applying the solution of hydrophobic or superhydrophobic particles on the top surface of the initially cured coating layer, forming an outer layer19. An additional step507is the subsequent curing step, where the substrate, initially cured coating layer, and outer layer are all cured. Referring generally toFIGS.1A-1C, in an aspect of an embodiment of the present invention, the process may begin with obtaining a substrate material such as aluminum, or any other material that a polymer or adhesive material can be applied to. The substrate may optionally be placed upon a platform37. The next step may be applying a polymer or adhesive material to the surface of the substrate. Compounds such as epoxy, resin, foamed acrylic or cyanoacrylate are suitable herein Claim4,5. Other resins such as vinyl ester resin and polyester resin can be used. Other adhesive materials can be used. This layer of polymer or adhesive material forms a coating layer which is initially cured before a solution29, comprising particles and a solvent28, can be added to in order to form an outer layer. The initial curing31can be performed by multiple methods, including, UV curing, plasma curing, thermal curing, ambient air curing, or chemical hardening, or a combination thereof. The curing time for the initial curing can vary depending on the curing method and polymer or adhesive material used. The initial curing may be various specified durations including but not limited thereto; a range of about 20 minutes to about 25 minutes; a range of about 1 nanosecond to about 1 hour; a range of about 1 hour to about 12 hours; a range of about 1 hour to about 24 hours; or a range of about 1 day to about 5 days. In an embodiment, the duration may be less than or greater than the ranges provided. In an embodiment, the solution29can comprise hydrophobic or superhydrophobic particles27of the same or different materials. Particles such as PTFE, polypropylene, polyethylene, polyolefin, polydimethylsiloxane (PDMS), or fluorinated ethylene propylene (FEP) would be suitable for these particles. In an embodiment, other materials may be utilized. Particle sizes may vary but in one embodiment may include a mean diameter of one of the following; a range of about 1 nm to about 25000 nm; a range of about 10 nm to about 15,000 nm; a range of about 100 nm to about 10,000 nm; or about 300 nm. In an embodiment, the mean diameter may be less than or greater than the ranges provided. In an embodiment, solvents28such as acetone, methanol, hexane, or isopropanol would be suitable as the solvent28in the solution29. The solvent and the particles in an embodiment may have a weight fraction of particles to solvent of one of, but not limited to the following: a range of about 0.1% to about 30%; a range of about 1% to about 20%; a range of about 5% to about 10%; a range of about 10% to about 20%; or about 5%. In an embodiment, the weight fraction may be less than or greater than the ranges provided. In an embodiment, the solution29may be applied to the coating layer15via an application method33such as application with an airbrush or hand application. The application method must have sufficient velocity to partially embed some particles into the coating layer. This required velocity will change depending on the composition of the coating layer15and the partial cure length/cure procedure. One embodiment may include spray pressure for an airbrush including, but not limited to the following: about 10 kPa to about 1.000 kPa; about 100 kPa to about 500 kPa; or about 200 kPa. In an embodiment, the spray pressure may be less than or greater than the ranges provided. In an embodiment, referring toFIG.2C, the solution29(shown inFIG.2B) containing the particles (denoted as21) will partially embed themselves into the coating layer15and accumulate on top surface17of the coating layer15. Some of the particles (denoted as23) may accumulate in contact with the top surface17of the coating layer15, without being embedded in the coating layer15. Some of the particles may clump into groups resulting in some particles (denoted as25) only touching other particles (denoted as21or23), without touching the coating layer15. The particles (denoted as21,23, and25) constitute the outer layer19. It is possible that gaps18may be present on the top surface17between some of the particles. In an alternative embodiment, referring toFIG.2D, the particles26may be entirely embedded in the coating layer15, without being in contact with the outer layer19or without any exposure outside the coating layer15. Referring toFIG.2E, the solution29(shown inFIG.2B) containing the particles (denoted as21) will partially embed themselves into the coating layer15and accumulate on top surface17of the coating layer15. The particles (denoted as23) may accumulate in contact with the top surface17of the coating layer15, without being embedded in the coating layer15. Still referring generally toFIGS.2C and2E, the substrate, the coating layer, and the outer layer are then subsequently cured for a specified amount of time. This curing can be done via multiple methods, including furnace curing, UV curing, plasma curing, ambient air curing, or chemical hardening, or a combination thereof Claim15. This curing can also range in time and temperature depending on the curing method. In an embodiment, the subsequent curing may include temperatures including, but not limited to: a range of about 10° C. to about 45° C.; a range of about 10° C. to about 400° C.; a range of about 400° C. to about 750° C.; a range of about 10° C. to about 750° C.; a range of about −200° C. to about 400° C. a range of about 100° C. to about 750° C.; a range of about 200° C. to about 500° C.; a range of about 300° C. to about 400° C.; or about 315° C. For example, liquid nitrogen could be at −200° C. In an embodiment, the temperature may be less than or greater than the ranges provided. In an embodiment, the subsequent curing may include a time length including, but not limited to: a range of about 1 month to about six months; a range of about 4 hours to about 3 days; a range of about 1 nanosecond to about 1 hour; a range of about 1 minute to about 1 day; about 12 hours; about 24 hours; or about 2 days; about a month; about a year. In an embodiment, the duration may be less than or greater than the ranges provided. Structure Description In its broadest aspects, an aspect of an embodiment of the present invention is a composition configured to be disposed on a substrate13. In an embodiment, the composition may comprise a coating layer15disposed on the substrate wherein the composition includes a top surface17of the coating layer15and an outer layer19disposed on the coating layer15. The coating layer15can comprise a polymer or adhesive material including one or more of the following: resin, epoxy, foamed acrylic or cyanoacrylate. The outer layer19may comprise substantially uniform distributed hydrophobic particles or superhydrophobic particles27. The hydrophobic or superhydrophobic particles can be either of the same material or of different materials. The particle materials may include PTFE, polypropylene, polyethylene, polyolefin, polydimethylsiloxane (PDMS), or fluorinated ethylene polypropylene (FEP), or any combination thereof. An embodiment may include, but is not limited to, the particles with a mean diameter of: a range of about 1 nm to about 25,000 nm; a range of about 10 nm to about 15,000 nm; a range of about 100 nm to about 10,000 nm; or about 300 nm. In an embodiment, the mean diameter may be less than or greater than the ranges provided. Referring generally toFIG.2A-2B, in an embodiment the composition begins with a substrate13, coating layer15, and top surface of the coating layer17. A solution29comprising hydrophobic particles or superhydrophobic particles27and a solvent28is then applied to the coating layer via an applicator33. Referring generally toFIG.2C-2E, in an embodiment the composition is disposed on the substrate13that may comprise:a) individual hydrophobic particles or superhydrophobic particles21that are partially embedded into the partially cured coating layer15while also being partially exposed above the top surface17of the partially cured coating layer15to form the outer layer19,b) individual hydrophobic particles or superhydrophobic particles23that are fixedly disposed in contact with the top surface17of the partially cured coating layer15without being embedded within the partially cured coating layer to form the outer layer19,c) individual hydrophobic particles or superhydrophobic particles25that are optionally, fixedly disposed in contact with the outer layers of ‘a’ (depicted as21) and/or ‘b’ (depicted as23) without being in contact with the partially cured coating layer15to form the outer layer19, andd) individual hydrophobic particles or superhydrophobic particles26that are optionally, entirely embedded in the partially cured coating layer15apart from the outer layer19. Still referring generally toFIG.2C-2E, the outer layer19exhibits hydrophobic properties or superhydrophobic properties after the substrate13, partially cured coating layer15, and outer layer19, are subsequently cured at a specified temperature for a specified period of time. In an embodiment, the outer layer19may exhibit a peak-valley difference of, but is not limited to: a range of about 1 nm to about 300,000 nm, a range of about 1,000 nm to about 300,000 nm, a range of about 1 nm to about 50,000 nm, a range of about 1,000 nm to about 300,000 nm, a range of about 10,000 nm to about 200,000 nm, a range of about 50,000 nm to about 100,000 nm, or about 39,000 nm. In an embodiment, the peak-valley difference may be less than or greater than the ranges provided. For example, the peak-valley difference is based on the particles used in the creation of the outer layer. As such, the peak-valley difference must at least cover the sizes of the various particles. Peak-valley ranges will be entirely dependent on particle diameter and is irrespective of material. Therefore, peak-valley difference will be the same for hydrophobic and superhydrophobic, if the particles are the same diameter. In an embodiment, the outer layer19may be used commercially as one of the following: an outer surface of an aircraft wing wherein the substrate is an aircraft wing component, an outer surface of a turbine blade wherein the substrate is a turbine blade component, an outer surface of a cooling or heating system blade wherein the substrate is a cooling or heating system blade component, an outer surface of a cooling or heating system coil wherein the substrate is a cooling or heating system coil component, an outer surface of a wind turbine wherein the substrate is a wind turbine component, an outer surface of a solar panel wherein the substrate is a solar panel component, an outer surface of a window wherein the substrate is a window component. Other equivalent uses are well within the skill of the ordinary practitioner and would require no more than routine experimentation. Available methods for the fabrication of various substrates and structures are also considered part of the present invention. Other substrates and structures may, of course, be employed within the context of the invention. EXAMPLES Practice of an aspect of an embodiment (or embodiments) of the invention will be still more fully understood from the following examples and experimental results, which are presented herein for illustration only and should not be construed as limiting the invention in any way. Example and Experimental Results Set No. 1 Preparation of PTFE Teflon Particle Coatings The PTFE nanoparticles were selected as the microtexture material because of PTFEs low surface energy and natively hydrophobic properties. The PTFE powder used in the present study was Fluo X-1406, obtained from Micro Powders Inc. The Fluo X-1406 is a pure PTFE powder with an average particle size around 300 nm. In the experimental processes, the Fluo X-1406 particles were dispersed in acetone to achieve 5% weight fraction suspension for spray coating. Fabrication of the Spray-Coated Surfaces To fabricate the anti-icing surface with the spray coating concept, for example, there were three major steps, shown schematically inFIG.1.FIG.1Ais a schematic depiction of the substrate13with the coating layer15disposed on it, while optionally resting upon a hotplate35to facilitate even distribution of the coating layer. The coating layer is initially cured by an initial curing source31.FIG.1Bis a schematic depiction of an application method of the outer layer19. The solution29of particles can be applied via an application method such as using an applicator33or other type of a spray device.FIG.1Cis a schematic depiction of the subsequent curing step where the structure11is cured by a subsequent curing source39, wherein the curing step may be accomplished by a furnace, or in an embodiment may be accomplished in an ambient environment. Optionally, the structure11may be set on a platform37or the like. In an embodiment, a first step, for example, was to prepare the epoxy resin layer and to partially cure it. A hotplate was employed with a surface temperature set to 90° C. The aluminum substrate was placed on the hotplate. Due to the temperature gradient in the aluminum and the heat transfer with the surrounding air, the actual temperature on the top of aluminum in this configuration was about 40-50° C. The elevated aluminum substrate temperature decreased the viscosity of the epoxy resin. This, in turn, caused the epoxy resin which was poured onto the aluminum to more easily spread and achieve complete and uniform surface coverage. After about 5 to 10 minutes, the epoxy resin became sticky, and polymer chains of the epoxy resin could be pulled from the bulk on the substrate. After about 20 to 25 minutes, the epoxy resin remained sticky, but the polymer chains could no longer be pulled from the bulk. At this point in the curing process of the epoxy, the spray coating of PTFE particles was applied while the sample was still on the hot plate. After about 35 minutes, the epoxy resin was fully cured and became hard. The reason for using partially cured epoxy resin rather than fully-cured was because these PTFE particles partially embedded into the half-cured epoxy resin. In a second step, for example, the PTFE particles were dispersed in acetone and the 5% weight fraction suspension was poured in the cup of the airbrush. The airbrush used in the experiments was a Badger Model R2S, and the spray coating air pressure was set at 200 kPa. The distance between the airbrush nozzle and the coating surface was around 200 mm. Multiple coating layers were applied, until the epoxy resin surface became opaque because the PTFE particles are white in color. In a third step, for example, the coated sample was placed in a furnace. The furnace temperature was set at 315° C. The thermal gravimetric analysis (TGA) showed that the temperature of epoxy resin degradation is greater than 300° C., and it can be improved by being filled with micro- or nano-particles. Furthermore, the temperature of the epoxy resin cannot reach the furnace temperature because of the temperature gradience, ensuring that the epoxy resins cannot be decomposed. The plain epoxy resin samples have been set in the same furnace conditions, and no decomposition was investigated. There are various objectives and purposes of this furnace operation. For example, a first purpose was to vaporize the acetone left on the sample. A second purpose and one of the essential components of the procedure were to soften and partially melt the particles in order to strengthen the bonding between PTFE particles, as well as the bonding between PTFE particle clusters and PTFE particles that are partially embedded epoxy resin due to spray injection. For example, a third purpose was to fully cure the epoxy resin. When these steps were done, the sample was moved out into room temperature and allowed to sit for 24 hours. As a result, the mechanical bonding between the PTFE particles and the epoxy resin is enhanced after the processing. Example and Experimental Results Set No. 2 Procedure for Determining Structure Characteristics The 3-D surface feature topology and measurements were carried out by a white light interferometer (NewView 7300, Zygo) by the present inventor. Scanning electron microscope (SEM) imaging of the surface was conducted using a Quanta 650 (FEI) microscope under low vacuum conditions. Low vacuum conditions allowed for the non-destructive imaging of the samples and without a conductive coating. The wetting properties of the spray-coated surface were determined by the measurements of contact angle (CA) and roll-off angle (ROA). The anti-icing property evaluation was done by the ice adhesion strength measurements. During the CA measurements, 10 μL drops of deionized water were placed on the spray-coated surface, which was mounted on the platform of a custom-built goniometer. The profile image of the drop and the surface was captured by a camera. Then the pictures were post-processed and analyzed using ImageJ with the DropSnake plugin to get the CA values. During the ROA measurements, 20 μL drops were used instead of 10 μL, and the platform of the goniometer was tilted until the drop started to roll off. This tilt angle was recorded as the ROA. The wetting characterization procedure is common to this type of study, and was the same as the experimental methods previously done by the UVa research group. [See Mulroney, A. T., Kessler, E. D., Combs, S. and Gupta, M. C., 2018. Low ice adhesion surfaces using microtextured hydrophobic tapes and their applications in refrigeration systems,Surface and Coatings Technology,351, pp. 108-114, of which is hereby incorporated by reference herein in its entirety; and See Caffrey, P. O. and Gupta, M. C., 2014, Electrically conducting superhydrophobic microtextured carbon nanotube nanocomposite,Applied Surface Science,314, pp. 40-45, of which is hereby incorporated by reference herein in its entirety.] Per each sample, five individual CA and ROA measurements were made, and the reported value was the average of the measurements. The formation of ice on the sample surface occurred under the temperature of −10° C. and the relative humidity (RH) of 16% within a commercial freezer. In order to control the contact area, a 7.4 mm plastic tube was placed on the surface and then it was filled with deionized water, shown inFIG.2. Pure deionized water was used, and the period of ice formation before measuring ice adhesion strength was 30 minutes. To test the durability of icing detachment, the measurements were also repeated on the same location of the same sample. Since the diameter of the ice cylinder was found to be 7.4 mm, this value was used to calculate a contact area of 42.55 mm2and therefore served as the area used to calculate the ice detachment pressure. As our research group demonstrated previously [See Mulroney, A. T., Kessler, E. D., Combs, S. and Gupta, M. C., 2018. Low ice adhesion surfaces using microtextured hydrophobic tapes and their applications in refrigeration systems,Surface and Coatings Technology,351, pp. 108-114, of which is hereby incorporated by reference herein in its entirety.], a Shimpo Digital Force Gauge (FG 7002) mounted on a Shimpo hand wheel operated test stand (FGS 250W) was employed to obtain the ice detachment pressure. The sketch of the test system is shown inFIG.3. During the measurements, the surface (labeled as “sample”) with ice in a cylinder of known diameter was carefully mounted on the platform immediately after moving from the freezer. The force gauge probe was moved on a horizontal axis towards to the ice cylinder at a constant speed. When the probe touched the side of the ice cylinder, the force gauge recorded the force until the ice detachment occurred. The peak value of the force was considered for the detachment pressure calculation. The reported results were based on the averaged values of 5 repeated experiments (SeeFIGS.7and8). Structure of Spray Coated Surface: FIG.4shows the results of the white light interferometry characterization, used to obtain root-mean-square roughness of the coated surface.FIG.4depicts the outer layer19with particles (denoted as21) partially embedded in the coating layer, particles (denoted as23) fixed in contact on top surface17of the coating layer15, but not embedded in the coating layer15, and particles (denoted as25) in contact with other particles (denoted as21and23) but not in contact with the coating layer25. In an embodiment, the scan area is 570 μm by 400 μm, and the peak-valley difference is 39.0 μm. It can be seen from this figure that the developed method of spray coating PTFE particles generated a microtextured surface. The root-mean-square roughness and the arithmetical mean deviation is 4.37 μm and 3.39 μm respectively. SEM images of the outer layer19at different magnifications are shown inFIG.5.FIG.5depicts the outer layer19with particles (denoted as21) partially embedded in the coating layer15, particles (denoted as23) fixed in contact on the top surface17of the coating layer15, but not embedded in the coating layer, and particles (denoted as25) in contact with other particles (denoted as21and23) but not in contact with the coating layer25. In an embodiment, the surface roughness of microns in size could be observed on the surface for images acquired at 1,000 times and 5,000 times (FIGS.5A and5B).FIG.5Cis a higher magnification, compared toFIGS.5A and5B, at 10,000 times, which also revealed the existence of micron-scale clusters and 300-nm sized particles embedded within the clusters.FIG.5Badditionally depicts gaps18of the top surface17of the outer layer19between clusters of particles (denoted as21,23and25). It should be appreciated thatFIGS.4-5have a plurality of particles (denoted as21,23, and25) and should not be limited by the amount called out in the drawing. FIG.6is a graphical representation of an experimental comparison of the contact angle (CA) and the roll off angle (ROA) of aluminum, of plain epoxy resin, and of a PTFE spray coated surface that which represents the outer layer19(not shown) of an embodiment. As seen inFIG.6, the spray coated surface was significantly more hydrophobic when compared to aluminum and plain epoxy resin surfaces. The PTFE spray coated surface demonstrated a CA of 154.4°. This CA was much higher than that for both polished aluminum at 81°, smooth epoxy resin at 76°, and 115° for smooth PTFE. [See Mulroney, A. T., Kessler, E. D., Combs, S. and Gupta, M. C., 2018. Low ice adhesion surfaces using microtextured hydrophobic tapes and their applications in refrigeration systems,Surface and Coatings Technology,351, pp. 108-114, of which is hereby incorporated by reference herein in its entirety.] The ROA of the spray coated surface was 2°, being so low that water drops rolled off immediately when placed on the surface. To compare, water drops were pinned on both the aluminum and epoxy resin surfaces; while for smooth PTFE, the ROA is 23.3°. [See Mulroney, A. T., Kessler, E. D., Combs, S. and Gupta, M. C., 2018. Low ice adhesion surfaces using microtextured hydrophobic tapes and their applications in refrigeration systems,Surface and Coatings Technology,351, pp. 108-114, of which is hereby incorporated by reference herein in its entirety.] This demonstrated that spray coating of PTFE particles can introduce the surface microtexture to achieve superhydrophobicity. Considering the low ROA of the powder-coated surface specifically, the droplet mobility of the low surface energy PTFE is integral. As investigated, the low surface energy property of PTFE was used to produce a surface with high droplet mobility and therefore a surface with a much lower ROA. FIG.7is a graphical representation of an experimental comparison of ice detachment pressure of aluminum, of plain epoxy resin, and of a PTFE spray coated surface that represents the outer layer19of an embodiment. Ice detachment pressure for an ice cylinder frozen to the surface with a forming mold of known diameter for each surface is summarized inFIG.7. The PTFE spray coated surface demonstrated an average detachment pressure of 28 kPa, while the plain epoxy resin demonstrated an average detachment pressure at 161 kPa. We previously measured the ice detachment pressure for smooth PTFE at 137 kPa. [See Mulroney, A. T., Kessler, E. D., Combs, S. and Gupta, M. C., 2018. Low ice adhesion surfaces using microtextured hydrophobic tapes and their applications in refrigeration systems,Surface and Coatings Technology,351, pp. 108-114, of which is hereby incorporated by reference herein in its entirety.] The detachment pressure for the polished aluminum could not be directly measured as it was above the range (10 N in forces, 232.5 kPa in pressure) for the digital force gauge. The aluminum ice adhesion strength value of 1210 kPa was based on the previous measurements by Yang et al. [See Yang, S., Xia, Q., Zhu, L., Xue, J., Wang, Q. and Chen, Q. M., 2011, Research on the icephobic properties of fluoropolymer-based materials,Applied Surface Science,257(11), pp. 4956-4962, of which is hereby incorporated by reference herein in its entirety.] The ice adhesion experiments on the spray-coated surface revealed that its ice detachment strength was very low: about 2.5% of the ice detachment strength of an aluminum substrate, 12.5% of the ice detachment strength of a pure epoxy resin surface, 20.5% of the ice detachment strength of a smooth non-textured PTFE Teflon sheet, and among the lowest superhydrophobic ice adhesion strength reported in literature. FIG.8is a graphical representation of successive test cycles of ice detachment pressures of the outer layer19of an embodiment. To demonstrate the durability of the PTFE spray coating, the ice adhesion and detachment tests were then repeated on the same area of the same sample for more than 10 times. The interval between two tests varied from 30 minutes to 12 hours. InFIG.8, the ice detachment pressures are shown in a time series. The first two data points were neglected for the mean and standard deviation calculations. It could be observed that within 10 cycles, the ice detachment pressures were maintained in a region that has a mean value of 27.5 kPa and a deviation value of 11.4 kPa. The surface has been investigated through the optical microscope, and it is confirmed that there was no damage to the coating. Thus, it shows that this fabricated surface has the capability to keep its function during repeated ice adhesions and detachments. FIG.9Ais photographic depiction of a water droplet40on a 25.4 mm by 25.4 mm dimension outer layer19of an embodiment.FIG.9Bis photographic depiction of a water droplet40on a 101.6 mm by 101.6 mm dimension outer layer19of an embodiment. In addition, it is worth noting that this spray coating method can be used for a large area. To demonstrate this scalability of the coating method, a 101.6 mm by 101.6 mm sample was fabricated in the laboratory.FIGS.9A and9Bare two depictions of drop profile images captured during the contact angle measurements. The images depict a water droplet40on the outer layer19. Both of them have the same CA of 154° and a ROA of below 2°. This step proves the scalability of the coating to be able to cover large area applications. A design goal of the fabrication approach for the spray coated surface was ease of manufacturing, specifically targeting production cost, difficulty, and avoiding the use of hazardous chemicals. To cover a 1 ft2(929 cm2) surface area, the estimated material cost was $2.99, including $2.23 for the epoxy resin and $0.76 for the PTFE particle powder. For comparison, a sheet of PTFE for the same area would cost $4.10. [See Mulroney, A. T., Kessler, E. D., Combs, S. and Gupta, M. C., 2018. Low ice adhesion surfaces using microtextured hydrophobic tapes and their applications in refrigeration systems,Surface and Coatings Technology,351, pp. 108-114, of which is hereby incorporated by reference herein in its entirety.] Additionally, the spray coating process used no hazardous chemicals at any stage. In addition, the wetting performance of the spray-coated surfaces with liquids of different viscosities and surface tensions was studied and compared with unmodified plain surfaces. The CA and ROA of the fabricated surfaces with its respective test liquids are shown in Table 1. Results showed that a decrease in surface tension significantly affected the wettability of the surfaces: the contact angle decreases and the roll-off angle increases. When test liquids of surface tension go below 68 mN/m (water+50% glycerol), then the result will be a loss of superhydrophobicity, i.e., the contact angle becomes less than 150°, but the surface still holds the hydrophobicity. Then a complete spreading of the liquid on the surface happened as the surface tension of test liquids at 20 mN/m or lower (silicon oil). Compared with the unmodified plain epoxy resin surface, the spray-coated surface shows a large improvement on the wettability. Additionally, no viscosity effects on wettability were observed. TABLE 1Wetting performance of the PTFE spray coated surface withliquids of different viscosities and surface tension.Mean ContactMean Roll-offAngle [°]Angle [°]SurfacePlainPlainViscosityTensionEpoxySpray-coatedEpoxySpray-coated[cP][mN/m]ResinSurfaceResinSurfaceWater1.371.976.0154.4Pinned<2Water + 50% Glycerol6.068.671.7146.8Pinned<5Ethylene Glycol16.947.749.0144.4Pinned<10Silicon Oil10020.9SpreadSpreadSpreadSpread Additional Examples Example 1. A method of applying a coating to a substrate creating a hydrophobic or superhydrophobic surface, wherein said method comprises:applying a polymer material or an adhesive material to said substrate creating a polymer coating layer having a top surface;initially curing said applied coating layer for a specified amount of time allowing said coating layer to partially cure;applying a solution, at a specified velocity, containing hydrophobic particles or superhydrophobic particles on top of said partially cured coating layer, wherein individual said hydrophobic particles or superhydrophobic particles are:a) partially embedded into said partially cured coating layer while also being partially exposed above said top surface of said partially cured coating layer to form an outer layer,b) fixedly disposed in contact with said top surface of said partially cured coating layer without being embedded within said partially cured coating layer to form said outer layer,c) optionally, fixedly disposed in contact with said outer layers of ‘a’ and/or ‘b’ without being in contact with said partially cured coating layer to form said outer layer, andd) optionally, entirely embedded in said partially cured coating layer apart from said outer layer; andsubsequently curing said substrate, said partially cured coating layer, and said outer layer, at a specified temperature for a specified period of time, wherein said outer layer exhibits hydrophobic properties or superhydrophobic properties. Example 2. The method claim1, wherein said hydrophobic particles are of the same material and said superhydrophobic particles are of the same material. Example 3. The method claim1(as well as subject matter in whole or in part of example 2), wherein said hydrophobic particles are of different materials and said superhydrophobic particles are of different materials. Example 4. The method claim1(as well as subject matter of one or more of any combination of examples 2-3, in whole or in part), wherein said polymer includes one or more of any of the following: resin or epoxy. Example 5. The method claim1(as well as subject matter of one or more of any combination of examples 2-4, in whole or in part), wherein said adhesive material includes one or more of any of the following: foamed acrylic or cyanoacrylate. Example 6. The method claim1(as well as subject matter of one or more of any combination of examples 2-5, in whole or in part), wherein said hydrophobic particles and said superhydrophobic particles include any one or more of the following: PTFE, polypropylene, polyethylene, polyolefin, polydimethylsiloxane (PDMS), or fluorinated ethylene propylene (FEP). Example 7. The method of claim1(as well as subject matter of one or more of any combination of examples 2-6, in whole or in part), wherein said solution comprises said hydrophobic particles or superhydrophobic particles and any one of the following solvents: acetone, methanol, hexane, or isopropanol. Example 8. The method of claim1(as well as subject matter of one or more of any combination of examples 2-7, in whole or in part), wherein said hydrophobic or superhydrophobic particles exhibit a particle size having a mean diameter in one of the following:a range of about 1 nm to about 25,000 nm;a range of about 10 nm to about 15.000 nm;a range of about 100 nm to about 10.000 nm; orabout 300 nm. Example 9. The method as defined in claim1(as well as subject matter of one or more of any combination of examples 2-8, in whole or in part), wherein said solution comprises a weight fraction of fluoropolymer particles to acetone at one of or more of the following:a range of about 0.1% to about 30%;a range of about 1% to about 20%;a range of about 5% to about 10%;a range of about 10% to about 20%; orabout 5%. Example 10. The method as defined in claim1(as well as subject matter of one or more of any combination of examples 2-9, in whole or in part), wherein said solution comprises a weight fraction of said hydrophobic particles or superhydrophobic particles to solvent at one of or more of the following:a range of about 0.1% to about 30%;a range of about 1% to about 20%;a range of about 5% to about 10%;a range of about 10% to about 20%; orabout 5%. Example 11. The method of claim10, wherein said solvent includes any one of the following: acetone, methanol, hexane, possibly or isopropanol. Example 12. The method of claim1(as well as subject matter of one or more of any combination of examples 2-11, in whole or in part), wherein said initial curing includes any one or more of the following: UV curing, plasma curing, thermal curing, ambient air curing, or chemical hardening, or a combination thereof. Example 13 The method claim1(as well as subject matter of one or more of any combination of examples 2-12, in whole or in part), wherein said initial curing includes one or more of the following durations:a range of about 20 minutes to about 25 minutes;a range of about 1 nanosecond to about 1 hour;a range of about 1 hour to about 12 hours;a range of about 1 hour to about 24 hours; ora range of about 1 day to about 5 days. Example 14. The method of claim1(as well as subject matter of one or more of any combination of examples 2-13, in whole or in part), wherein said solution is applied to said epoxy layer using an airbrush with a spray pressure that includes one or more of the following:about 10 kPa to about 1,000 kPa;about 100 kPa to about 500 kPa; orabout 200 kPa. Example 15. The method of claim1(as well as subject matter of one or more of any combination of examples 2-14, in whole or in part), wherein said subsequent curing includes any one or more of the following: UV curing, plasma curing thermal curing, ambient air curing, or chemical hardening; or a combination thereof. Example 16. The method as defined in claim1(as well as subject matter of one or more of any combination of examples 2-15, in whole or in part), wherein said subsequent curing temperature is at one of the following:a range of about 10° C. to about 45° C.;a range of about 10° C. to about 400° C.;a range of about 400° C. to about 750° C.;a range of about 10° C. to about 750° C.;a range of about −200° C. to about 400° C.;a range of about 100° C. to about 750° C.;a range of about 200° C. to about 500° C.;a range of about 300° C. to about 400° C.; orabout 315° C. Example 17. A method as defined in claim1(as well as subject matter of one or more of any combination of examples 2-16, in whole or in part), wherein after said subsequent curing, said substrate, said partially cured coating layer, said outer layer, and said embedded hydrophobic or superhydrophobic particles are cooled at ambient temperature for one of the following:a range of about 1 month to about six months;a range of about 4 hours to about 3 days;a range of about 1 nanosecond to about 1 hour;a range of about 1 minute to about 1 day;about 12 hours;about 24 hours; orabout 2 days;about a month;about a year; Example 18. The method as defined in claim1(as well as subject matter of one or more of any combination of examples 2-17, in whole or in part), wherein said hydrophobic outer layer or superhydrophobic outer layer exhibits peak-valley difference at about one of the following:a range of about 1 nm to about 300,000 nm;a range of about 1,000 nm to about 300,000 nm;a range of about 1 nm to about 50,000 nm;a range of about 1,000 nm to about 300,000 nm;a range of about 10,000 nm to about 200,000 nm;a range of about 50,000 nm to about 100,000 nm; orabout 39,000 nm. Example 19. The method of claim1(as well as subject matter of one or more of any combination of examples 2-18, in whole or in part), wherein said hydrophobic outer layer or superhydrophobic outer layer is one of the following:an outer surface of an aircraft wing wherein said substrate is an aircraft wing component;an outer surface of a turbine blade wherein said substrate is a turbine blade component;an outer surface of a cooling or heating system blade wherein said substrate is a cooling or heating system blade component;an outer surface of a cooling or heating system coil wherein said substrate is a cooling or heating system coil component;an outer surface of a wind turbine wherein said substrate is a wind turbine component;an outer surface of a solar panel wherein said substrate is a solar panel component; oran outer surface of a window wherein said substrate is a window component. Example 20. The method as defined in claim1, further comprising removing a specified amount of said individual said hydrophobic particles or superhydrophobic particles including one or more of the following:said hydrophobic particles or superhydrophobic particles of ‘a’;said hydrophobic particles or superhydrophobic particles of ‘b’; oroptionally, said hydrophobic particles or superhydrophobic particles of ‘c’. Example 21. A composition configured to be disposed on a substrate, wherein said composition comprises:a coating layer disposed on said substrate comprised of a polymer material or adhesive material, wherein said coating includes a top surface;an outer layer disposed on said coating layer;wherein said outer layer comprises substantially uniform distributed hydrophobic particles or superhydrophobic particles; andwherein said individual said hydrophobic particles or superhydrophobic particles are:a) partially embedded into said partially cured coating layer while also being partially exposed above said top surface of said partially cured coating layer to form said outer layer,b) fixedly disposed in contact with said top surface of said partially cured coating layer without being embedded within said partially cured coating to form said outer layer,c) optionally, fixedly disposed in contact with said outer layers of ‘a’ and/or ‘b’ without being in contact with said partially cured coating layer to form said outer layer, andd) optionally, entirely embedded in said partially cured coating layer apart from said outer layer; andwherein said outer layer exhibits hydrophobic properties or superhydrophobic properties. Example 22. The composition of claim 21, wherein said hydrophobic particles are of the same material and said superhydrophobic particles are of the same material. Example 23. The composition of claim 21 (as well as subject matter in whole or in part of example 21), wherein said hydrophobic particles are of different materials and said superhydrophobic particles are of different materials. Example 24. The composition of claim 21 (as well as subject matter of one or more of any combination of examples 22-23, in whole or in part), wherein said polymer includes one or more of any of the following: resin, epoxy, or fiberglass. Example 25. The composition of claim 21 (as well as subject matter of one or more of any combination of examples 22-24, in whole or in part), wherein said adhesive material includes one or more of any of the following: foamed acrylic or cyanoacrylate. Example 26. The composition of claim 21 (as well as subject matter of one or more of any combination of examples 22-25, in whole or in part), wherein said hydrophobic particles and said superhydrophobic particles include any one or more of the following: PTFE, polypropylene, polyethylene, polyolefin, polydimethylsiloxane (PDMS), or fluorinated ethylene propylene (FEP). Example 27. The composition of claim 21 (as well as subject matter of one or more of any combination of examples 22-26, in whole or in part), wherein said hydrophobic or superhydrophobic particles exhibit a particle size having a mean diameter in one of the following:a range of about 1 nm to about 25,000 nm;a range of about 10 nm to about 15,000 nm;a range of about 100 nm to about 10,000 nm; orabout 300 nm. Example 28. The composition as defined in claim 21 (as well as subject matter of one or more of any combination of examples 22-27, in whole or in part), wherein said hydrophobic outer layer or superhydrophobic outer layer exhibits peak-valley difference at about one of the following:a range of about 1 nm to about 300,000 nm;a range of about 1,000 nm to about 300,000 nm;a range of about 1 nm to about 50,000 nm;a range of about 1,000 nm to about 300,000 nm;a range of about 10,000 nm to about 200,000 nm;a range of about 50,000 nm to about 100,000 nm; orabout 39,000 nm. Example 29. The composition of claim 21 (as well as subject matter of one or more of any combination of examples 22-28, in whole or in part), wherein said hydrophobic outer layer or superhydrophobic outer layer is one of the following:an outer surface of an aircraft wing wherein said substrate is an aircraft wing component;an outer surface of a turbine blade wherein said substrate is a turbine blade component;an outer surface of a cooling or heating system blade wherein said substrate is a cooling or heating system blade component;an outer surface of a cooling or heating system coil wherein said substrate is a cooling or heating system coil component;an outer surface of a wind turbine wherein said substrate is a wind turbine component;an outer surface of a solar panel wherein said substrate is a solar panel component; oran outer surface of a window wherein said substrate is a window component. Example 30. A method of manufacturing any one or more of the compositions in any one or more of Examples 21-29. Example 31. A method of using any one or more of the compositions in any one or more of Examples 21-29. Example 32. An article of manufacture produced by any one or more of the methods in any one or more of Examples 1-20. Example 33. A system configured for applying the methods in any one or more of Examples 1-20. Example 34. A method of applying a coating to a substrate creating a hydrophobic or superhydrophobic surface, wherein said method comprises:applying a polymer material or an adhesive material to said substrate creating a polymer coating layer having a top surface;initially curing said applied coating layer for a specified amount of time allowing said coating layer to partially cure;applying a solution, at a specified velocity, containing hydrophobic particles or superhydrophobic particles on top of said partially cured coating layer, wherein individual said hydrophobic particles or superhydrophobic particles are:a) partially embedded into said partially cured coating layer while also being partially exposed above said top surface of said partially cured coating layer to form an outer layer,b) fixedly disposed in contact with said top surface of said partially cured coating layer without being embedded within said partially cured coating layer to form said outer layer,c) fixedly disposed in contact with said outer layers of ‘a’ and ‘b’ without being in contact with said partially cured coating layer to form said outer layer, andd) entirely embedded in said partially cured coating layer apart from said outer layer; andsubsequently curing said substrate, said partially cured coating layer, and said outer layer, at a specified temperature for a specified period of time, wherein said outer layer exhibits hydrophobic properties or superhydrophobic properties. Example 35. A composition configured to be disposed on a substrate, wherein said composition comprises:a coating layer disposed on said substrate comprised of a polymer material or adhesive material, wherein said coating includes a top surface;an outer layer disposed on said coating layer;wherein said outer layer comprises substantially uniform distributed hydrophobic particles or superhydrophobic particles; andwherein said individual said hydrophobic particles or superhydrophobic particles are:a) partially embedded into said partially cured coating layer while also being partially exposed above said top surface of said partially cured coating layer to form said outer layer,b) fixedly disposed in contact with said top surface of said partially cured coating layer without being embedded within said partially cured coating to form said outer layer,c) fixedly disposed in contact with said outer layers of ‘a’ and ‘b’ without being in contact with said partially cured coating layer to form said outer layer, andd) entirely embedded in said partially cured coating layer apart from said outer layer; andwherein said outer layer exhibits hydrophobic properties or superhydrophobic properties. REFERENCES The devices, systems, apparatuses, modules, compositions, materials, computer program products, non-transitory computer readable medium, and methods of various embodiments of the invention disclosed herein may utilize aspects (such as devices, apparatuses, modules, systems, compositions, materials, computer program products, non-transitory computer readable medium, and methods) disclosed in the following references, applications, publications and patents and which are hereby incorporated by reference herein in their entirety (and which are not admitted to be prior art with respect to the present invention by inclusion in this section).1. U.S. Utility patent application Ser. No. 14/824,060, entitled “METHOD OF FORMING A SPECTRAL SELECTIVE COATING”, filed Aug. 11, 2015; U.S. Pat. No. 10,201,947, issued Feb. 12, 2019.2. U.S. Utility patent application Ser. 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No. 13/536,695, entitled “Micro-Structure and Nano-Structure Replication Methods and Article of Manufacture”, filed Jun. 28, 2012; U.S. Pat. No. 10,131,086, issued Nov. 20, 2018.7. U.S. Utility patent application Ser. No. 12/530,313, entitled “Systems and Methods of Laser Texturing of Material Surfaces and their Applications”, filed Sep. 8, 2009; Publication No. 2010/0143744, Jun. 10, 2010.8. International Patent Application Serial No. PCT/US2008/056033, entitled “Systems and Methods of Laser Texturing of Material Surfaces and their Applications”, filed Mar. 6, 2008; Publication No. WO 2008/127807, Oct. 23, 2008.9. U.S. Utility patent application Ser. No. 12/098,000, entitled “Conducting Nanotubes or Nanostructures Based Composites, Method of Making Them and Applications”, filed Jun. 18, 2008; U.S. Pat. No. 8,424,200, issued Apr. 23, 2013.10. International Patent Application Serial No. PCT/US2006/048165, entitled “Conducting Nanotubes or Nanostructures Based Composites, Method of Making Them and Applications”, filed Dec. 19, 2006; Publication No. WO2008/045109, Apr. 17, 2008.11. U.S. Pat. No. 7,434,793 B2, Kunath, et al., “Coating for a Throttle Body”, Oct. 14, 2008.12. U.S. Patent Application Publication No. US 2020/0181427 A1, Nowak, et al., “Compositions and Methods for Fabricating Durable, Low-Ice-Adhesion Coatings”, Jun. 11, 2020.13. U.S. Pat. No. 10,619,057 B2, Nowak, et al., “Compositions and Methods for Fabricating Durable, Low-Ice-Adhesion Coatings”, Apr. 14, 2020.14. U.S. Patent Application Publication No. US 2019/0023830 A1, Nowak, et al., “Compositions for Fabricating Durable, Low-Ice-Adhesion Coatings”, Jan. 24, 2019.15. U.S. Patent Application Publication No. US 2019/0176188 A1, Rodriguez, et al., “Methods for Fabricating Transparent Icephobic Coatings, and Transparent Icephobic Coatings Obtained Therefrom”, Jun. 13, 2019.16. Mulroney A T, Kessler E D, Combs S, Gupta M C, “Low Ice Adhesion Surfaces Using Microtextured Hydrophobic Tapes and Their Applications in Refrigeration Systems”, Surface & Coatings Technology. 2018; 351: 108-114. https://doi.org/10.1016/j.surfcoat.2018.07.060.17. Qin C, Mulroney A T, Gupta M C, “Anti-Icing Epoxy Resin Surface Modified by Spray Coating of PTFE Teflon Particles for Wind Turbine Blades”, Materials Today Communications. 2019; 22: 100770. https://doi.org/10.1016/j.mtcomm.2019.100770.18. European Patent No. EP 1 849 843 B1, Watson, et al., “Erosion Resistant Anti-Icing Coatings”, Sep. 30, 2015.19. U.S. Pat. No. 4,032,090, Thornton-Trump, “Method for Deicing Aircraft”, Jun. 28, 1977.20. European Patent No. EP 2 632 612 B1, Zhang, et al., “Superhydrophobic Films”, May 25, 2016.21. U.S. Pat. No. 10,584,260 B2, Nowak, et al., “Coatings, Coating Compositions, and Methods of Delaying Ice Formation”, Mar. 10, 2020.22. U.S. Pat. No. 9,637,658 B2, Nowak, et al., “Coatings, Coating Compositions, and Methods of Delaying Ice Formation”, May 2, 2017.23. Mulroney, A. T., Kessler, E. D., Combs, S. and Gupta, M. C., 2018, Low ice adhesion surfaces using microtextured hydrophobic tapes and their applications in refrigeration systems,Surface and Coatings Technology,351, pp. 108-114.24. Yang, S., Xia, Q., Zhu, L., Xue, J., Wang, Q. and Chen, Q. M., 2011, Research on the icephobic properties of fluoropolymer-based materials,Applied Surface Science,257(11), pp. 4956-4962.25. Caffrey, P. O. and Gupta, M. C., 2014. Electrically conducting superhydrophobic microtextured carbon nanotube nanocomposite.,Applied Surface Science,314, pp. 40-45. In summary, while the present invention has been described with respect to specific embodiments, many modifications, variations, alterations, substitutions, and equivalents will be apparent to those skilled in the art. The present invention is not to be limited in scope by the specific embodiment described herein. Indeed, various modifications of the present invention, in addition to those described herein, will be apparent to those of skill in the art from the foregoing description and accompanying drawings. Accordingly, the invention is to be considered as limited only by the spirit and scope of the following claims including all modifications and equivalents. Still other embodiments will become readily apparent to those skilled in this art from reading the above-recited detailed description and drawings of certain exemplary embodiments. It should be understood that numerous variations, modifications, and additional embodiments are possible, and accordingly, all such variations, modifications, and embodiments are to be regarded as being within the spirit and scope of this application. For example, regardless of the content of any portion (e.g., title, field, background, summary, abstract, drawing figure, etc.) of this application, unless clearly specified to the contrary, there is no requirement for the inclusion in any claim herein or of any application claiming priority hereto of any particular described or illustrated activity or element, any particular sequence of such activities, or any particular interrelationship of such elements. Moreover, any activity can be repeated, any activity can be performed by multiple entities, and/or any element can be duplicated. Further, any activity or element can be excluded, the sequence of activities can vary, and/or the interrelationship of elements can vary. Unless clearly specified to the contrary, there is no requirement for any particular described or illustrated activity or element, any particular sequence or such activities, any particular size, speed, material, dimension or frequency, or any particularly interrelationship of such elements. Accordingly, the descriptions and drawings are to be regarded as illustrative in nature, and not as restrictive. Moreover, when any number or range is described herein, unless clearly stated otherwise, that number or range is approximate. When any range is described herein, unless clearly stated otherwise, that range includes all values therein and all sub ranges therein. Any information in any material (e.g., a United States/foreign patent, United States/foreign patent application, book, article, etc.) that has been incorporated by reference herein, is only incorporated by reference to the extent that no conflict exists between such information and the other statements and drawings set forth herein. In the event of such conflict, including a conflict that would render invalid any claim herein or seeking priority hereto, then any such conflicting information in such incorporated by reference material is specifically not incorporated by reference herein. | 55,837 |
11857999 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention are described in detail hereinbelow with reference to the accompanying figures. Further modifications of specific features mentioned in this connection can each individually be combined with one another in order to form new embodiments. FIG.1shows, schematically, the interplay of individual participants in the handling of a coating material according to one embodiment of the method of the present invention. By way of example, a manufacturer of a coating material is here shown together with three customers, or three processing establishments. As is further apparent fromFIG.1, a cloud-based server1constitutes a communication interface between the manufacturer and the customers (I to III). As is illustrated inFIG.1by means of a continuous connecting line between a computer of the manufacturer and the cloud-based server1, only the manufacturer has full access to the server. The manufacturer accordingly acts as the administrator of the server1and administers a database on the server1. To which the customers have access, in particular limited access. The customers can thereby have access to the cloud-based server1, as illustrated, by means of a control device of a processing device, in particular a coating machine, a desktop computer or by means of a mobile device, such as a tablet, a laptop, a smartphone, etc. As will be described in detail later in relation toFIG.2, the manufacturer can store in the database of the server1first information2, which relates to a marked coating material, and thus make that information accessible to the customers via the cloud-based server1. The customers can in turn access that stored first information2and themselves store on the server1second information3, which relates to the same coating material or at least to a coating material of the same type. After this second information3has been stored on the server by the customers, the manufacturer is in turn able to access that second information3. For that reason, two arrows are shown between the manufacturer and the server as well as between the individual customers and the server, which arrows illustrate the flow of communication. FIG.2shows a flow diagram of an embodiment of the method of the present invention. In this method, in step1, a marking is applied by a manufacturer to a preferably finished coating material for identifying first information2relating to the coating material. The marking can thereby be applied in the form of, for example, a barcode or an RFID tag. In the second step of the method, the first information2relating to the coating material, in particular an item number by which the coating material is clearly identifiable in the database of the cloud-based server1, as well as processing data relating to the coating material are stored on the cloud-based server1, in particular under the item number. The finished coating material is then generally packed and delivered to a customer, or a processing establishment. If the coating material is required for coating a workpiece, the customer can clearly identify the coating material in question in step3by detecting the marking of the coating material. The customer thereby accesses the cloud-based server1by means of the item number stored in the marking, in particular in the first information2, and identifies the coating material. He can thereby access further data of the first information2linked with the item number, such as, for example, processing data etc. Optionally, a step4is shown, which is marked as being optional by a broken line. In step4, on the basis of the first information2, in particular processing data, provided by the cloud-based server1, a coating machine can be adjusted, in particular automatically adjusted, according to the requirements of the identified coating material. This is to be understood as meaning that a controller of the coating machine, after detecting the marking and the associated identification of the loaded coating material, automatically acquires the necessary processing data (processing parameters) from the cloud-based server1and configures the coating machine accordingly. Then, according to the present embodiment of the present invention, coating of a workpiece with the detected and identified coating material takes place in step5, wherein coating preferably takes place fully automatically. In the following step6, which again is an optional step, the quality of the coating can be checked. Checking of the quality can thereby be carried out fully automatically by a testing device, such as, for example, by a camera system or the like, or can be performed by an operator by visual testing. Then, in a final step7, second information3relating to the coating material is stored on the cloud-based server1. This second information is preferably empirical values or optimised processing data for processing the coating material obtained as a result of the processing of the coating material, as well as the quality assessment optionally determined in step6. On the basis of the second information3stored on the server1, in particular if second information3has been stored by different customers in respect of a same coating material type, the manufacturer can carry out an evaluation of the accumulated second information3and, on the basis thereof, optionally determine optimised manufacturing parameters of the coating material or optimised processing data for the coating material. If optimised processing data can be determined, these can be stored on the cloud-based server1as updated first information2and can thus be provided to customers for the future processing of the same coating material. | 5,760 |
11858000 | DESCRIPTION OF EXEMPLARY EMBODIMENTS First, the present disclosure will be schematically described. An ultrasonic device according to a first aspect of the present disclosure for solving the problem described above includes a substrate and a vibration plate provided on the substrate and having one or more vibrators configured to generate an ultrasonic wave by vibration. The vibration plate has a movable portion provided with the vibrator and configured to vibrate accompanying with the vibration of the vibrator, and a fixed portion fixed to the substrate. A vibration frequency of a reflected wave based on a wave transmitted from the movable portion and received by the movable portion is outside a vibration frequency band region of the vibrator. According to this aspect, the vibration frequency of the reflected wave (a crosstalk vibration frequency) based on the wave transmitted from the movable portion and received by the movable portion is outside the vibration frequency band region of the vibrator. Therefore, vibration due to crosstalk in a vibrator formation portion can be prevented from affecting the vibration of the vibrator. That is, it is possible to prevent accuracy of the ultrasonic device from lowering. Here, the crosstalk refers to that a reception element is vibrated accompanying with driving of a transmission element and sensitivity of the reception element is affected. The ultrasonic device according to a second aspect of the present disclosure is based on the first aspect, in which the vibration frequency of the reflected wave is higher than the vibration frequency band region of the vibrator. If the crosstalk vibration frequency is lower than the vibration frequency band region of the vibrator, even when a crosstalk vibration frequency in a primary mode is outside the vibration frequency band region of the vibrator, a crosstalk vibration frequency in a secondary mode or a tertiary mode may fall within the vibration frequency band region of the vibrator. However, according to this aspect, the crosstalk vibration frequency is higher than the vibration frequency band region of the vibrator. Therefore, the crosstalk vibration frequency in the secondary mode or the tertiary mode can be prevented from falling within the vibration frequency band region of the vibrator. The ultrasonic device according to a third aspect of the present disclosure is based on the second aspect, in which a plurality of vibrators are provided, a first wall portion is provided between the vibrators in the movable portion, a second wall portion is provided at a fixed portion side of a vibrator disposed at an end in arrangement of the plurality of vibrators, on a side of the second wall portion opposite to the vibrator is a space portion or a member formed of a material different from that of the second wall portion, and a volume of the space portion or the member formed of a material different from that of the second wall portion is adjusted to be equal to or smaller than a predetermined volume, so that the vibration frequency of the reflected wave is adjusted to be higher than the vibration frequency band region of the vibrators. According to this aspect, the crosstalk vibration frequency can be simply adjusted to be higher than the vibration frequency band region of the vibrators by adjusting the volume of the space portion or the member formed of a material different from that of the second wall portion to be equal to or smaller than the predetermined volume. The ultrasonic device according to a fourth aspect of the present disclosure is based on the first aspect, and further includes a reinforcement plate that reinforces the substrate. The substrate may be thin and easy to break, but according to this aspect, the reinforcement plate that reinforces the substrate is provided, so that the substrate can be prevented from breakage. The ultrasonic device according to a fifth aspect of the present disclosure is based on the fourth aspect, in which the vibrator is provided on a surface of the vibration plate at a first direction side of the substrate, and the reinforcement plate is provided at the first direction side of the vibration plate. According to this aspect, the reinforcement plate is provided at the first direction side of the vibration plate. Therefore, in the ultrasonic device configured to transmit ultrasonic waves at a second direction (a direction opposite to the first direction) side, the substrate can be prevented from breakage and accuracy of the ultrasonic device can be prevented from lowering. The ultrasonic device according to a sixth aspect of the present disclosure is based on the fifth aspect, and further includes an intermediate member provided between the reinforcement plate and the vibration plate. According to this aspect, the intermediate member is provided between the reinforcement plate and the vibration plate. Therefore, even in a configuration in which the reinforcement plate and the vibration plate are not directly in contact with each other, the ultrasonic device can be simply configured to transmit ultrasonic waves at the second direction side. The ultrasonic device according to a seventh aspect of the present disclosure is based on the fourth aspect, in which the vibrator is provided on a surface of the vibration plate at a first direction side of the substrate, and the reinforcement plate is provided at a second direction (a direction opposite to the first direction) side of the substrate. According to this aspect, the reinforcement plate is provided at the second direction side of the vibration plate. Therefore, in the ultrasonic device configured to transmit ultrasonic waves at the first direction side, the substrate can be prevented from breakage and accuracy of the ultrasonic device can be prevented from lowering. The ultrasonic device according to an eighth aspect of the present disclosure is based on the seventh aspect, and further includes an intermediate member provided between the reinforcement plate and the substrate. According to this aspect, the intermediate member is provided between the reinforcement plate and the substrate. Therefore, even in a configuration in which the reinforcement plate and the substrate are not directly in contact with each other, the ultrasonic device can be simply configured to transmit ultrasonic waves at the first direction side. An ultrasonic sensor according to a ninth aspect of the present disclosure includes the ultrasonic device according to any one of the first to eighth aspects, and a timer configured to measure time up to reception of a reflected wave of an ultrasonic wave transmitted by the vibration of the vibrator. According to this aspect, it is possible to prevent accuracy from lowering and measure the time up to reception of the reflected wave of the ultrasonic wave transmitted by the vibration of the vibrator. Hereinafter, embodiments of the present disclosure will be described with reference to accompanying drawings. First Embodiment First, an ultrasonic sensor1according to a first embodiment, serving as an example of an ultrasonic device according to the present disclosure, will be described with reference toFIGS.1to9. As shown inFIG.1, the ultrasonic sensor1includes a transmission and reception unit100that transmits ultrasonic waves in a transmission direction D1and receives ultrasonic waves that are reflected by an object O and move in a reception direction D2. As will be described later in detail, the transmission and reception unit100includes a transmission element124athat transmits ultrasonic waves and a reception element124bthat receives ultrasonic waves transmitted from the transmission element124aas shown inFIG.8. The ultrasonic sensor1further includes a timer200that measures time up to reception of ultrasonic waves transmitted from the transmission and reception unit100. The ultrasonic sensor1can measure a distance Lo from the ultrasonic sensor1to the object O based on the time measured by the timer200. As indicated by a pulse P1inFIG.2, the transmission element124avibrates when transmitting ultrasonic waves from the transmission element124a, and as indicated by a pulse P2inFIG.2, the reception element124balso vibrates due to the transmission of the vibration of the transmission element124a. When the ultrasonic waves are reflected by the object O and return to the transmission and reception unit100, the reception element124bis vibrated as indicated by a pulse P3inFIG.2. The ultrasonic sensor1measures the distance Lo from the ultrasonic sensor1to the object O based on the time from transmission of the pulse P1to reception of the pulse P3. Specifically, in the present embodiment, vibration of the transmission element124aand vibration of the reception element124bare detected by voltages generated accompanying with the vibration of the transmission element124aand the vibration of the reception element124b. That is, the distance Lo from the ultrasonic sensor1to the object O is measured based on applicable timing of a voltage exceeding a predetermined threshold. However, a measurement method of the distance Lo from the ultrasonic sensor1to the object O is not particularly limited, and may be a method of detecting a matter other than a voltage. InFIG.2, since the vibration of the reception element124bcaused by the transmission of the vibration of the transmission element124ais attenuated immediately as indicated by the pulse P2, the pulse P3can be accurately detected. However, if the vibration of the reception element124bcaused by the transmission of the vibration of the transmission element124acontinues for a long time, the vibration of the reception element124bcaused by the transmission of the vibration of the transmission element124aand vibration of the reception element124baccompanying with the ultrasonic waves reflected by the object O and returning to the transmission and reception unit100may interfere with each other and crosstalk may occur. When such interference occurs, measurement accuracy of the distance Lo from the ultrasonic sensor1to the object O may be lowered. Here, the ultrasonic sensor1according to the present embodiment has a configuration of the transmission and reception unit100to be described below, so that such interference is less likely to occur. Next, a specific configuration of the transmission and reception unit100will be described. As shown inFIG.3, the transmission and reception unit100includes a vibrator formation portion120in which the transmission element124aand the reception element124bare formed as vibrators124(seeFIG.4), and a peripheral portion110that is positioned in a periphery of the vibrator formation portion120and in which the vibrators124are not formed. Here, the transmission and reception unit100has a substantially flat plate shape. When the substantially plat plate shaped transmission and reception unit100is placed in a horizontal surface inFIG.3or the like, a state indicated inFIG.3serves as a plan view. InFIG.3and the like, an X axis direction is a horizontal direction, a Y axis direction is a horizontal direction orthogonal to the X axis direction, and a Z axis direction is a vertical direction. In the transmission and reception unit100according to the present embodiment, both a length L1aalong the X axis direction of the peripheral portion110and a length L1balong the Y axis direction of the peripheral portion110are about 1 cm, and both a length L2aalong the X axis direction of the vibrator formation portion120and a length L2balong the Y axis direction of the vibrator formation portion120are about 5 mm. The vibrator formation portion120is divided into nine regions including regions R1to R9. In each of the regions R1to R9, 11 vibrators124are provided along the X axis direction, 11 vibrators124are provided along the Y axis direction, that is, a total of 121 vibrators124are provided. That is, a total of 1089 vibrators124are provided in the entire vibrator formation portion120. The number of regions obtained by dividing the vibrator formation portion120and the number of the vibrators124in each region are not particularly limited. Here, in the transmission and reception unit100according to the present embodiment, the vibrators124formed in the region R5are used as the reception elements124b, and the vibrators124formed in the regions R1to R4and regions R6to R9are used as the transmission elements124a. All of the vibrators124have the same configuration. That is, all of the transmission elements124ahave the same configuration, all of the reception elements124bhave the same configuration, and all of the transmission elements124aand all of the reception elements124bhave the same configuration. In the present embodiment, the vibrators124formed in the region R5are used as the reception elements124b, and the vibrators124formed in the regions R1to R4and the regions R6to R9are used as the transmission elements124a. However, the vibrators124formed in regions other than the region R5may be used as the reception elements124b, or the number of regions in which the vibrators124are used as the reception elements124band the number of regions in which the vibrators124are used as the transmission elements124amay be changed. In addition, all vibrators124in each of the regions R1to R9may be used as the transmission elements124aand as the reception elements124b. As shown inFIG.4, the vibrator124is formed by overlapping a first electrode123, a piezoelectric layer122, and a second electrode121along the Z axis direction. The first electrode123extends along the Y axis direction and a plurality of first electrodes123are provided in the X axis direction. The second electrode121extends along the X axis direction and a plurality of second electrodes121are provided in the Y axis direction. The piezoelectric layers122have a matrix shape and are provided along the X axis direction and along the Y axis direction. A material of the first electrode123and the second electrode121is not limited as long as the material has conductivity. Examples of the material of the first electrode123and the second electrode121include a metal material such as platinum (Pt), iridium (Ir), gold (Au), aluminum (Al), copper (Cu), titanium (Ti), and stainless steel, a Tin oxide-based conductive material such as an indium tin oxide (ITO) and a fluorine-doped tin oxide (FTC)), an oxide conductive material such as a zinc oxide-based conductive material, strontium ruthenate (SrRuO3), lanthanum nickel oxide (LaNiO3), and element-doped strontium titanate, and a conductive polymer. The piezoelectric layer122may use a typical composite oxide of a lead zirconate titanate (PZT)-based perovskite structure (an ABO three-type structure). Accordingly, it is easy to ensure a displacement amount of the vibrator124which is a piezoelectric element. The piezoelectric layer122may use a composite oxide of a perovskite structure (an ABO three-type structure) containing no lead. Accordingly, the ultrasonic sensor1can be implemented by using a lead-free material which has a small load on the environment. Examples of such a lead-free piezoelectric material include a BFO-based material containing bismuth ferrite (BFO and BiFeO3). Bi is positioned at an A sit and iron (Fe) is positioned at a B site in BFO. Other elements may be added to BFO. For example, at least one element selected from manganese (Mn), aluminum (Al), lanthanum (La), barium (Ba), titanium (Ti), cobalt (Co), cerium (Ce), samarium (Sm), chromium (Cr), potassium (K), lithium (Li), calcium (Ca), strontium (Sr), vanadium (V), niobium (Nb), tantalum (Ta), molybdenum (Mo), tungsten (W), nickel (Ni), zinc (Zn), praseodymium (Pr), neodymium (Nd), and europium (Eu) may be added to BFO. Another example of the lead-free piezoelectric material includes a KNN-based material containing potassium sodium niobate (KNN and KNaNbO3). Other elements may be added to KNN. For example, at least one element selected from manganese (Mn), lithium (Li), barium (Ba), calcium (Ca), strontium (Sr), zirconium (Zr), titanium (Ti), bismuth (Bi), tantalum (Ta), antimony (Sb), iron (Fe), cobalt (Co), silver (Ag), magnesium (Mg), zinc (Zn), copper (Cu), vanadium (V), chromium (Cr), molybdenum (Mo), tungsten (W), nickel (Ni), Aluminum (Al), silicon (Si), lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), and europium (Eu) may be added to KNN. The composite oxide of a perovskite structure includes a composite oxide deviated from a stoichiometric composition due to deficiency and excess or a composite oxide in which a part of elements is replaced with other elements. That is, as long as a perovskite structure is obtained, it is acceptable that the composite oxide inevitably deviates from a composition due to lattice mismatch, oxygen deficiency, or the like, apart of elements is replaced, and the like. Next, a detailed configuration of the vibrator formation portion120will be described with reference toFIGS.5to7. As shown inFIGS.5to7, the ultrasonic sensor1according to the present embodiment includes a substrate150on which openings160are formed, a vibration plate140provided on the substrate150so as to close the openings160, and the vibrator124including the first electrode123, the piezoelectric layer122, and the second electrode121stacked on the vibration plate140at an opposite side to the openings160. A portion where the first electrode123, the piezoelectric layer122, and the second electrode121are completely overlapped with each other in the Z axis direction serves as the vibrator124. The substrate150is formed of silicon. The substrate150includes partition walls150asurrounding the openings160. The vibration plate140is a stacked body formed of a silicon oxide film and zirconium oxide. The vibration plate140is supported by the partition walls150aof the substrate150. When viewed in a plan view, the opening160has a shape having a high aspect ratio, for example, an aspect ratio of 1:70, at which a length in the Y axis direction is considerably larger than a length in the X axis direction. When viewed in a plan view, the vibrator124has a shape having a low aspect ratio, for example, an aspect ratio of 1, at which a length in the X axis direction is approximate to a length in the Y axis direction. Theoretically, it is ideal that the aspect ratio of the vibrator124is 1 considering to increase a strain in the Z axis direction. Alternatively, the aspect ratio of the vibrator124may be a value larger than 1. A plurality of vibrators124are provided with respect to one opening160. When a voltage is applied between the first electrode123and the second electrode121, the vibrator124is elastically deformed together with the vibration plate140, thereby generating ultrasonic waves. Since the easiness of bending and deforming the vibrator124varies depending on the materials, thickness, installation positions, and sizes of the vibrator124and the vibration plate140, the vibrator124and the vibration plate140can be appropriately adjusted according to an application or a usage situation. A charge signal whose frequency coincides or substantially coincides with a resonance frequency unique to each material may be applied to the vibrator124, and the vibrator124is bent and deformed due to resonance. The first electrode123is patterned with a predetermined width in the X axis direction, and is continuously provided across a plurality of vibrators124in the Y axis direction. The second electrode121is continuously provided across the plurality of vibrators124in the X axis direction and is patterned with a predetermined width in the Y axis direction. Although not shown, the second electrode121is pulled out in the X axis direction and is coupled to a common electrode extending in the Y axis direction. The vibrator124is driven by applying a voltage between the first electrode123and the second electrode121. Although all of the plurality of vibrators124may be individually driven, the vibrators124are generally divided into several regions such as the regions R1to R9in the present embodiment and the vibrators124are driven on a region basis. In most cases, a fixed potential is applied to one of the first electrode123and the second electrode121. Therefore, although not shown, it is common to provide wires for sharing the first electrode123or the second electrode121in each region or a wire for concentrating the wires. As shown inFIGS.5to7, an insulation layer125formed of alumina or the like is patterned on the second electrode121. Further, a reinforcement plate130that seals a space Sa around the vibrators124and reinforces the substrate150is provided on a vibrator124side of the substrate150. When the substrate150is thin and easy to break, the substrate150is prevented from breakage by providing the reinforcement plate that reinforces the substrate150. The reinforcement plate130has columnar portions130athat prevent vibration of the vibration plate140. A joint portion of the reinforcement plate130joins with the substrate150, so that the space Sa around the vibrators124is sealed. The columnar portion130afunctions as a prevention portion that prevents vibration of the vibration plate140. As shown inFIG.5, the partition wall150ais present between adjacent vibrators124in the X axis direction. The vibration plate140is fixed by the partition walls150aof the substrate150at both portions outside two sides parallel to the Y axis direction of each vibrator124. On the other hand, as shown inFIG.7, the columnar portions130aare provided at portions where the partition wall150ais not present between vibrators124adjacent in the Y axis direction. Therefore, the vibration plate140is fixed by the columnar portions130aprovided at the reinforcement plate130or by the partition walls150aof the substrate150at both portions outside two sides parallel to the X axis direction of each vibrator124. Next, the ultrasonic sensor1according to the present embodiment will be described more specifically while comparing the ultrasonic sensor1according to the present embodiment inFIGS.8and9with an ultrasonic sensor according to a reference example inFIGS.13and14.FIGS.8and13are cross-sectional views taken along positions of the region R4, the region R5, and the region R6inFIG.3, and the vibrators124in the region R4, the region R5, and the region R6are omitted and only one vibrator124in each region is shown. In practice, a plurality of vibrators124are provided in any one of the region R4, the region R5, and the region R6as described above. Accordingly, a plurality of columnar portions130athat divide the vibrators124are provided. As shown inFIG.8, in the ultrasonic sensor1according to the present embodiment, the substrate150, the vibration plate140, and the reinforcement plate130are stacked along the Z axis direction. The reinforcement plate130is provided with a plurality of columnar portions130a, and the columnar portion130aincludes a first wall portion131that divides the space Sa which is an arrangement space of the vibrator124, and a second wall portion132that divides the vibrator formation portion120and the peripheral portion110and divides the space Sa and a space portion Sb formed in the peripheral portion110. Here, the reason of providing the second wall portions132is to uniform a vibration state of the vibrator124adjacent to the peripheral portion110and a vibration state of the vibrator124that is not adjacent to the peripheral portion110and is divided by the first wall portion131. In a configuration in which the peripheral portion110is not provided with the space portion Sb and the second wall portion132is not provided, when the vibrator124adjacent to the peripheral portion110is vibrated, the vibration may be constrained at a peripheral portion110side, and a vibration state thereof may be greatly different from a vibration state of the vibrator124that is not adjacent to the peripheral portion110. In the present embodiment, the vibrator124is accommodated in the space Sa. However, the “arrangement space of the vibrator124” refers to a configuration in which the vibrator124is accommodated in the space Sa as in the present embodiment, and also refers to a configuration in which the space Sa is positioned at a second direction side with respect to the vibrator124, for example, and the vibrator124is not accommodated in the space Sa, as in an ultrasonic sensor according to a third embodiment to be described later inFIG.11and in an ultrasonic sensor according to a fourth embodiment to be described later inFIG.12. Similar to the ultrasonic sensor1according to the present embodiment shown inFIG.8, the ultrasonic sensor according to the reference example shown inFIG.13also includes the space portion Sb in the peripheral portion110and the second wall portion132that divides the space portion Sb and the space Sa. However, when comparingFIG.8withFIG.13, it will become apparent that the space portion Sb of the ultrasonic sensor1according to the present embodiment shown inFIG.8is narrower than the space portion Sb of the ultrasonic sensor according to the reference example shown inFIG.13. When the ultrasonic sensor1according to the present embodiment has such a configuration, as shown inFIG.9, a crosstalk vibration frequency that is a frequency of the vibration of the vibrator formation portion120due to crosstalk generated accompanying with the vibration of the vibrators124is outside a vibration frequency band region of the vibrators124. On the other hand, in the ultrasonic sensor according to the reference example shown inFIG.13, a crosstalk vibration frequency overlaps the vibration frequency band region of the vibrators124as shown inFIG.14. Since the reception element124bis formed in the vibrator formation unit120, when the crosstalk vibration frequency overlaps the vibration frequency band region of the vibrators124, reception accuracy of ultrasonic waves that are transmitted from the transmission element124aand that are reflected by the object O and are returned as reflected waves is lowered due to the vibration of the vibrator formation portion120caused by the crosstalk. On the other hand, when the crosstalk vibration frequency does not overlap the vibration frequency band region of the vibrators124, reception accuracy of the reflected waves is less likely to be lowered. As described above, the ultrasonic sensor1according to the present embodiment, serving as an ultrasonic device, includes the substrate150, and the vibration plate140provided on the substrate150and having one or more vibrators that generate ultrasonic waves by vibration. The vibration plate140includes the vibrator formation portion120serving as a movable portion that is provided with the vibrators124and vibrates accompanying with the vibration of the vibrators124, and the peripheral portion110serving as a fixed portion that is provided around the vibrator formation portion120and is fixed to the substrate150. The peripheral portion110is configured such that a crosstalk vibration frequency that is a frequency of vibration caused by the crosstalk of the vibrator formation portion120accompanying with the vibration of the vibrators124is outside the vibration frequency band region of the vibrators124. That is, a vibration frequency of the reflected waves based on waves transmitted from the movable portion and to be received by the movable portion is outside the vibration frequency band region of the vibrators124. Since the ultrasonic sensor1according to the present embodiment is configured such that the crosstalk vibration frequency is outside the vibration frequency band region of the vibrators124, vibration caused by the crosstalk in the vibrator formation portion120can be prevented from affecting the vibration of the vibrators124. That is, the ultrasonic sensor1according to the present embodiment includes the vibration plate140that has the region R5serving as a first vibration portion in which the reception elements124bare formed and that is vibrated accompanying with vibration of the transmission elements124a, and the regions R1to R4and the regions R6to R9serving as a second vibration portion that are adjacent to the region R5in which the transmission elements124aare formed, and the ultrasonic sensor1according to the present embodiment is configured such that a vibration frequency band of the second vibration portion is different from a vibration frequency band of the first vibration portion. With such a configuration, sensitivity of the reception elements can be prevented from being affected by crosstalk caused by transmission of vibration of the first vibration portion accompanying with driving of the transmission elements124ato the second vibration portion, and accuracy of the ultrasonic device can be prevented from lowering. Here, as shown inFIG.9, the vibration frequency of the reflected waves (the crosstalk vibration frequency) is higher than the vibration frequency band region of the vibrators124. If the crosstalk vibration frequency is lower than the vibration frequency band region of the vibrators124, even when a crosstalk vibration frequency in a primary mode is outside the vibration frequency band region of the vibrators, a crosstalk vibration frequency in a secondary mode or a tertiary mode may fall within the vibration frequency band region of the vibrators214. However, in the ultrasonic sensor1according to the present embodiment, since the crosstalk vibration frequency is higher than the vibration frequency band region of the vibrators124, the crosstalk vibration frequency in the secondary mode or the tertiary mode can be prevented from falling within the vibration frequency band region of the vibrators124. Although the crosstalk vibration frequency is higher than the vibration frequency band region of the vibrators124in the ultrasonic sensor1according to the present embodiment as described above, the crosstalk vibration frequency may be lower than the vibration frequency band region of the vibrators124. However, in this case, it is preferable that the crosstalk vibration frequency in the secondary mode or the tertiary mode does not fall within a full width at half maximum region of vibration frequencies of the vibrators124. In other words, in the ultrasonic sensor1according to the present embodiment, the vibration frequency band of the second vibration portion is higher than the vibration frequency band of the first vibration portion. If the vibration frequency band of the second vibration portion is lower than the vibration frequency band of the first vibration portion, even when a vibration frequency band of the first vibration portion transmitted as a primary mode is outside the vibration frequency band of the second vibration portion, a vibration frequency band of the first vibration portion transmitted as a secondary mode or a tertiary mode may fall within the vibration frequency band of the second vibration portion. However, in the ultrasonic sensor1according to the present embodiment, the vibration frequency band of the second vibration portion is higher than the vibration frequency band of the first vibration portion. Therefore, the vibration frequency band of the first vibration portion transmitted as the secondary mode or the tertiary mode can be prevented from falling within the vibration frequency band of the second vibration portion. As described above, the ultrasonic sensor1according to the present embodiment includes a plurality of vibrators124. The vibrator formation portion120is formed with the first wall portion131that divides the space Sa which is an arrangement space of the vibrators124. The peripheral portion110has the space portion Sb and is formed with the second wall portion132that divides the space Sb and the vibrator formation portion120. When comparingFIG.8withFIG.13, it will become apparent that a volume of the space portion Sb is adjusted to be equal to or smaller than a predetermined volume, so that the crosstalk vibration frequency is adjusted to be higher than the vibration frequency band region of the vibrators124as shown inFIG.9. That is, in the ultrasonic sensor1according to the present embodiment, the crosstalk vibration frequency is adjusted to be higher than the vibration frequency band region of the vibrators124by a simple method of adjusting the volume of the space portion Sb to be equal to or smaller than the predetermined volume. However, the method of adjusting the crosstalk vibration frequency to be higher than the vibration frequency band region of the vibrators124is not limited to the method described above, and may be a method in which, for example, the second wall portion132is formed of a different material from the first wall portion131, and a volume of a different material region is adjusted to be equal to or smaller than a predetermined volume. As shown inFIG.8, in the ultrasonic sensor1according to the present embodiment, the vibration plate140is provided on the substrate150such that the vibrators124are provided on a surface of a first direction side corresponding to an upper side inFIG.8and a surface of a second direction (a direction opposite to the first direction) side faces the substrate150. The reinforcement plate130is provided at the first direction side of the vibration plate140. In this manner, the reinforcement plate130is provided at the first direction side of the vibration plate140, so that an ultrasonic device can be configured to transmit ultrasonic waves at the second direction side as indicated by an arrow of the transmission direction D1and an arrow of the reception direction D2inFIG.8. In the ultrasonic device having such a configuration, the substrate150can be prevented from breakage and accuracy of the ultrasonic device can be prevented from lowering. However, the present disclosure is not limited to the configuration shown inFIG.8. Hereinafter, a specific example of an ultrasonic sensor including a transmission and reception unit100having a configuration different from that of the transmission and reception unit100shown inFIG.8will be described. Second Embodiment Next, an ultrasonic sensor according to a second embodiment will be described with reference toFIG.10.FIG.10corresponds toFIG.8showing the ultrasonic sensor1according to the first embodiment. InFIG.10, components the same as those in the first embodiment will be denoted by the same reference numerals and detailed description thereof will be omitted. The ultrasonic sensor according to the present embodiment has the same characteristics as the ultrasonic sensor1according to the first embodiment described above, and has the same configuration as the ultrasonic sensor1according to the first embodiment except for the following points. Specifically, the ultrasonic sensor according to the present embodiment has the same configuration as the ultrasonic sensor1according to the first embodiment except a configuration of the transmission and reception unit100. As shown inFIG.10, the transmission and reception unit100of the ultrasonic sensor according to the present embodiment includes an intermediate member135provided between the reinforcement plate130and the vibration plate140. With such a configuration, even when the reinforcement plate130and the vibration plate140are not directly in contact with each other, the ultrasonic device can be simply configured to transmit ultrasonic waves at the second direction side corresponding to a lower side inFIG.10. The intermediate member may use, for example, a photosensitive resin. In the transmission and reception unit100according to the present embodiment, in order to simplify a configuration of the reinforcement plate130, the reinforcement plate130has a flat plate shape with no irregularities. The intermediate member135is provided with columnar portions135acorresponding to the first wall portion131and the second wall portion132. However, the present disclosure is not limited to such a configuration. Similar to the reinforcement plate130of the ultrasonic sensor1according to the first embodiment, the reinforcement plate130may be provided with the columnar portions130aor the like and the intermediate member135is provided between the columnar portions130aand the vibration plate140. Third Embodiment Next, an ultrasonic sensor according to a third embodiment will be described with reference toFIG.11.FIG.11corresponds toFIG.8showing the ultrasonic sensor1according to the first embodiment. InFIG.11, components the same as those in the first embodiment and the second embodiment will be denoted by the same reference numerals and detailed description thereof will be omitted. Here, the ultrasonic sensor according to the present embodiment has the same characteristic as the ultrasonic sensor1according to the above-described first embodiment and second embodiment, and has the same configuration as the ultrasonic sensor1according to the first embodiment and the second embodiment except for the following points. Specifically, the ultrasonic sensor according to the present embodiment has the same configuration as the ultrasonic sensor1according to the first embodiment and the second embodiment except a configuration of the transmission and reception unit100. As shown inFIG.11, in transmission and reception unit100of the ultrasonic sensor according to the present embodiment, the vibration plate140is provided on the substrate150such that the vibrators124are provided on a surface of a first direction side corresponding to an upper side inFIG.11and a surface of a second direction (a direction opposite to the first direction) side faces the substrate150. The reinforcement plate130is provided at the second direction side of the substrate150. In this manner, the reinforcement plate130is provided at the second direction side of the vibration plate140, so that the ultrasonic device can be configured to transmit ultrasonic waves at the first direction side as indicated by an arrow of the transmission direction D1and an arrow of the reception direction D2inFIG.11. In the ultrasonic device having such a configuration, the substrate150can be prevented from breakage and accuracy of the ultrasonic device can be prevented from lowering. Fourth Embodiment Next, an ultrasonic sensor according to a fourth embodiment will be described with reference toFIG.12.FIG.12corresponds toFIG.8showing the ultrasonic sensor1according to the first embodiment. InFIG.12, components the same as those in the first to third embodiments will be denoted by the same reference numerals and detailed description thereof will be omitted. Here, the ultrasonic sensor according to the present embodiment has the same characteristic as the ultrasonic sensor1according to the above-described first to third embodiments, and has the same configuration as the ultrasonic sensor1according to the first to third embodiments except for the following points. Specifically, the ultrasonic sensor according to the present embodiment has the same configuration as the ultrasonic sensor1according to the first to third embodiments except a configuration of the transmission and reception unit100. As shown inFIG.12, the transmission and reception unit100of the ultrasonic sensor according to the present embodiment includes the intermediate member135provided between the reinforcement plate130and the substrate150. With such a configuration, even when the reinforcement plate130and the substrate150are not directly in contact with each other, the ultrasonic device can be simply configured to transmit ultrasonic waves at the first direction side corresponding to an upper side inFIG.12. The intermediate member may use, for example, a photosensitive resin. In the transmission and reception unit100according to the present embodiment, in order to simplify a configuration of the reinforcement plate130, the reinforcement plate130has a flat plate shape with no irregularities. The intermediate member135is provided with columnar portions135acorresponding to the first wall portion131and the second wall portion132. However, the present disclosure is not limited to such a configuration. Similar to the reinforcement plate130of the ultrasonic sensor1according to the third embodiment, the reinforcement plate130may be provided with the columnar portions130aor the like and the intermediate member135is provided between the columnar portions130aand the vibration plate140. The present disclosure is not limited to the embodiments described above, and can be implemented in various configurations without departing from the scope of the disclosure. In order to solve some or all of problems described above, or to achieve some or all of effects described above, technical features in the embodiments corresponding to technical features in the aspects described in the summary can be replaced or combined as appropriate. The technical features can be deleted as appropriate unless the technical features are described as essential in the present specification. | 41,158 |
11858001 | DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS.1-3have been discussed in Background section of this document. As defined herein, a point-like pressure source is a pressure source which has at least one of its dimension smaller, e.g. at least two times smaller than the wavelength generated by the pressure source in a fluid within the device to be cleaned and/or in a wall of the device to be cleaned. For example, for a point source contacting a metal surface utilizing longitudinal 20 kHz ultrasound, a point-like pressure source is a source with a contact diameter significantly smaller than 25 mm, e.g. 12.5 mm, and for 100 kHz ultrasound, significantly smaller than 5 mm, e.g. 2.5 mm. For different wave modes, these diameters are adjusted according to the speed of sound of the mode. In the following text, the system and the method of the present invention is exemplified by different transducer assemblies. The principle of the method of the present invention for cleaning a device holding fluid, such as liquid, is presented using an exemplary non-limiting system shown inFIGS.4A and4B. Accordingly, a system200suitable for the method comprises a mechanical wave generating means201and a waveguide202. The waveguide comprises a first end202aadapted to be positioned on outer surface203aof a device to be cleaned and a second end202bwhich is in contact with the mechanical wave generating means. The waveguide comprises a cavity204comprising a base portion204awhich is substantially in xz-plane of the coordinate system299. The cavity is preferably positioned around acoustic axis205of the system. Distance of the base portion from the second end of the waveguide in y-direction of the coordinate system is marked in the figure with a letter I. The distance I is selected such that when the mechanical wave generating means emits succession of mechanical waves through the wave guide to the outer surface, there is an antinode206at distance I from the second end, i.e. in proximity of the base portion. Diameter of the waveguide, and diameter of the cavity at the distance I from the second end in x-direction of the coordinate system299is marked inFIG.4Awith symbols D and d, respectively. When the ratio d/D is 0.9 or less, the portions of the waveguide marked with reference numbers207aand207binFIG.4Bact as point like pressure sources and are adapted to emit mechanical waves, marked with arrows208aand208binFIG.4B, towards the outer surface. The correct position of the antinode can be adjusted by proper design of the system as discussed later in detail. Distance of the portions207aand207bfrom the acoustic axis205of the system is preferably same. The maximum diameter Dmaxof the waveguide is less than ½ of wavelength of the mechanical waves. In titanium λ would be ca 0.4 m, whereas in copper it would be ca 0.2 m, and in steel it would be ca 0.3 m. The portions207aand207bact as point pressure sources and interfere in the waveguide resulting a propagating wave marked with an arrow209. The waveguide delivers the wave through the wall203to the inner surface203b. The interfering mechanical waves210make the inner surface vibrate. As the vibrating inner surface moves, the motion produces pressure pulse211in the fluid212in the device. The pressure pulse cleans the device, for instance removes fouling from the device. FIG.5show the magnitude (Magn) and phase (Arg) of the impedance curves of a situation wherein the transducer assembly200is in contact with an outer surface of a device to be cleaned. The thickness of the wall is 10 mm. The resonance frequency is 20.4 kHz i.e. consistent with the fundamental resonance of the transducer, the impedance magnitude is relatively low (150Ω) and the phase curve shifts from negative to positive at the resonance. The curves are very close to those of an unloaded transducer. In comparison,FIG.3shows curves for a fully mass loaded transducer. The resonance frequency is shifted to 26 kHz, the impedance magnitude is relatively high (550Ω) and the phase curve does not shift from negative to positive at the resonance. Accordingly, as the mass loading of the transducer assembly to the device to be cleaned is reduced compared e.g. to the system100, operation of the transducer close to its natural resonance frequency is permitted. The system of the present invention must have a waveguide comprising a cavity. It is essential that ratio of the diameter of the cavity and the waveguide at distance I from the second end is 0.9 or less, preferably 0.2 to 0.9, more preferably from 0.4 to 0.8. This is to ensure that the system can operate at its fundamental frequency even when in contact with a device to be cleaned. Other dimensions and shapes of the cavity are not critical. FIGS.6a-crepresent exemplary non-limiting cavity configurations of a cylindrical waveguide. Accordingly, the cavity can be an opening, i.e. a through hole (FIG.6b), or a hollow portion in the wave guide (FIG.6a,c). According to a particular embodiment the area of the first end of a waveguide is larger than area of the second end. This allows the acoustic radiation efficiency to be increased, by increasing the acoustic radiation impedance versus ultrasound impedance of the system. Side view of an exemplary waveguide of this type is shown inFIG.6d. According to another particular embodiment the first end is shaped for interfacing with geometry of the outer surface of the device to be cleaned. Side view of an exemplary waveguide of this type is shown inFIG.6e. The first end, such as the one shown inFIG.6emay also comprise clamping means for fastening and tightening the system to the outer surface of the device to be cleaned. As shown inFIG.4A, the base portion204aof the cavity is separated from the first end by a distance marked with letter h.FIG.7presents radiated acoustic power of a system as a function of the distance h when the actuation power was fixed. The figure is based on numerically simulated 20 kHz driving of a 38 mm cylindrical waveguide fixed at a 10 mm thick steel wall having water on the other side. As seen from the figure, the distance h has plurality optimums, one of which is about 85 mm and another one at about 210 mm. According to still another particular embodiment, the first end of the waveguide is designed to further enhance the ability of the system to operate at its fundamental resonance frequency. Exemplary design alternatives are presented inFIG.8. According to one embodiment, the first end comprises an opening813a, wherein the opening is adapted to be towards the outer surface. According to this embodiment side walls814of the opening act as point like pressure sources when the system is in operation. The opening can be also such that it is not through the walls of the first end but like the one shown inFIG.8d. According to another embodiment the first end comprises at least one pair of protrusions813bor one or more circular protrusions813cadapted to be positioned on the outer surface of the device to be cleaned. The distance d′ between the two protrusion in the x-direction of the coordinate system899is preferably smaller than half of the acoustic wavelength in the fluid and/or wall of the device, for example, at 20 kHz d′<38 mm. If the wall thickness of the device to be cleaned is thin e.g. <10 mm, the protrusions should be close to each other. An exemplary distance d′ is 5-25 mm, 20 kHz. This is to ensure that an interference point is formed on the inner surface of the wall. According to an exemplary embodiment the height of the protrusion in the y-direction of the coordinate system899is 1-100 mm. An exemplary protrusion length is 10 mm. The protrusions are adapted to act as point-like pressure sources. The contact area of the first end i.e. the contact area of the protrusions is less than 100%. According to a preferable embodiment, the contact area of the at least one pair of protrusions is 1-30%, more preferably 1-20%, most preferably about 10% of the total area of the first end. An exemplary contact area of a protrusion or a circular protrusion acting as a point-line pressure source is 110-330 mm2. In the structure depicted inFIG.8(804,813a) there are two cavities, one in the wave generating means similarly as described inFIG.4, and another one in the coupling structure812. The first cavity decouples the transducer from the load, whereas the second cavity813agenerates two point-like sources from the edges of the cavity814which generate waves which constructively interfere and generate a leaky Lamb wave which efficiently generates sound in the fluid. This dual cavity structure allows more freedom when selecting the size of the secondary cavity813a. According to one embodiment the mechanical wave generating means is a Langevin transducer. A Langevin transducer comprises a front mass (head), a back mass (tail) and piezoelectric ceramics. A Langevin transducer is a resonant transducer for high-power ultrasonic actuation. The transducer is composed by a stack of piezoelectric disks201a, e.g. 2, 4, 6 or 8 disks, clamped between two metallic bars, typically aluminum, titanium or stainless-steel, that feature a front mass and a back mass of the transducer, respectively. The length of the front mass and back mass of the transducer are tuned so that the transducer behaves as a half-wavelength resonator, i.e. a fundamental standing wave is born along the long axis of the transducer, featuring an antinode at both ends of the transducer. This results in an antinode at the first end300aand at the second end300bof the transducer assembly, and a nodal point at the middle of the waveguide. Such a transducer is narrowband featuring sharp resonance and antiresonance, separated typically by a narrow, e.g. 1 kHz, frequency interval. Optimal and natural resonance behavior occurs when the transducer is driven in free space (no mechanical load). Any loading damps the resonance, increases the bandwidth and affects the resonance frequency. Heavy loading kills the fundamental resonance. Although the transducer assembly still is able to operate at higher resonance frequencies even when heavily loaded its efficiency is reduced. The higher resonance frequencies are in this case those of the coupled system, i.e. loading-modified higher resonance frequencies of the transducer assembly. According to another embodiment the present invention concerns a method for cleaning a device holding fluid. The method comprising the following stepsa) providing a system200comprisingmechanical wave generating means201anda waveguide202comprisinga first end202aadapted to be in contact with outer surface of the device203a second end202bwherein the second end is in contact with the mechanical wave generating means,a waveguide comprising a cavity204comprising a base portion204ain xz-plane of the coordinate system299, the base portion separated from the second end by a distance I in y-direction of the coordinate system,the mechanical wave generating means is adapted to emit mechanical waves through the waveguide to the outer surface,waveform of the mechanical waves is adapted to be such that there is an antinode205positioned in the waveguide at the distance I from the second end,maximum diameter Dmaxof the waveguide in x-direction of the coordinate system299is less than ½ of wavelength of the mechanical waves and in thatratio of diameter d of the base portion and the diameter D of the waveguide in x-direction of the coordinate system299at distance I is 0.9 or less, preferably from 0.2 to 0.9, most preferably from 0.2 to 0.8.b) contacting the first end with outer surface of the device,c) the mechanical wave generating means emitting, via waveguide succession of mechanical waves inner surface of the device,d) the mechanical waves interfering at the inner surface and producing a vibrating inner surface, ande) the vibrating inner surface producing and emitting a pressure pulse into the fluid. The thickness of the vessel wall of the device to be cleaned is typically 2-30 mm. The point like pressure sources such as the protrusions of the waveguides of a transducer are preferably made of material that is softer than the material of surface of the device. According to an exemplary embodiment, the surface of the device is made of stainless steel and the protrusions are made of aluminum. Experimental Design of the Transducer Assembly The transducer assembly was composed of a piezoelectric ultrasonic stack transducer (Langevin transducer, sandwich transducer) and an optional waveguide. The transducer was either a commercially available model, or a custom made one. The transducer was a narrowband (featuring typically e.g. a 1 kHz bandwidth) resonant transducer, composed by a stack of piezoelectric disks (e.g. 2, 4, 6 or 8 disks), clamped between two metallic bars (typically aluminium, titanium or stainless steel) that feature front mass and back mass of the transducer. The transducer design was based on a chosen resonant frequency (e.g. 20 kHz) which determines the choice (material and dimensions) of the piezoelectric disks. The stack of piezoelectric disks features a narrowband resonator. The lengths of the front mass and back mass were tuned such that the coupled resonator (i.e. transducer) behaves as a half-wavelength (lambda/2) resonator at the chosen frequency. This is the fundamental resonance of the transducer. The bandwidth remained narrow (e.g. 1 kHz). Transducer design was based on theoretical and/or numerical modelling (finite-element simulations). An optional waveguide was fitted as an extension on the first end of the transducer. The length of the waveguide was chosen/tuned so as to maintain the fundamental resonance behavior of the transducer. To this end, the waveguide length must be a multiple of lambda/2. A waveguide may be useful e.g. to increase the q-value of the transducer assembly, to provide thermal insulation between the transducer and a system to be cleaned, or to provide flexibility in transducer placement in situations when the transducer cannot directly fit against the device to be cleaned. Waveguide design is based on theoretical and/or numerical modelling (e.g. finite-element simulations). Point-like contacts (e.g. contact protrusions, openings) were machined as extensions on the first end of a transducer assembly. Cavities were machined in the waveguide. The shapes of the contact structures were evaluated and optimized by theoretical and/or numerical modelling (finite-element simulations). The specific examples provided in the description given above should not be construed as limiting the scope and/or the applicability of the appended claims. | 14,691 |
11858002 | DETAILED DESCRIPTION The present disclosure may be understood more readily by reference to this detailed description as well as to the specific embodiments described herein. For simplicity and clarity of illustration, where appropriate, reference numerals may be repeated among portions of the drawings to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the disclosed subject matter and various embodiments described herein. However, it will be understood by those of ordinary skill in the art that the subject matter and embodiments described herein can be practiced without these specific details. In other instances, for example, components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the subject matter described herein. The drawings are not necessarily to scale and the proportions of certain parts may have been exaggerated to better illustrate details and features of the present disclosure. As used herein and in the appended claims, terms describing the orientation of components such as top, bottom, lowermost, etc., are to be construed in view of the manner in which the components are oriented in the drawings included herewith. As used herein and in the appended claims, an element or component that “comprises” or “includes” one or more specified components means that the element or component includes the specified component(s) alone, or includes the specified component(s) together with one or more additional components. An element or component that “consists of” one or more specified components means that the element or component includes only the specified component(s). An element or component that “consists essentially of” one or more specified components means that the element or component consists of the specified component(s) alone, or consists of the specified component(s) together with one or more additional components that do not materially affect the basic properties of the element or component. Whenever a range is disclosed herein, the range includes independently and separately every member of the range extending between any two numbers enumerated within the range. Furthermore, the lowest and highest numbers of any range shall be understood to be included within the range set forth. In accordance with this disclosure, a shaker screen and a method of making a shaker screen are provided. As used herein and in the appended claims, a shaker machine refers to a vibratory shaker machine. A shaker screen refers to a vibratory shaker screen for use in connection with a shaker machine to separate solids from a mixture of solids and liquids. Referring toFIG.1, a shaker machine is described and generally designated by the reference number5. Shaker machine5has a basket6into which shaker screens are inserted. Shaker machine5is of a type that may have multiple levels8, which in the embodiment described may be two levels10and12. While the described embodiment includes two levels, it is understood that a shaker machine5may include only one level, or may include more than two levels. A vibratory motor14may be mounted to the frame16of shaker machine5and springs18may be mounted in such a way as to control the vibration applied by the vibratory motors14. A shaker machine5of the type described can accommodate a plurality of shaker screens20. For example, two shaker screens20may be inserted side by side on opposite sides22and24of a divider26in the shaker machine5. In addition, a plurality of shaker screens20may be connected end to end for insertion into and removal from shaker machine5. Two, three or more, shaker screens20may be connected end to end in each level8, and on both sides22and24of shaker machine5. Flanges28may be connected to frame16in shaker5. Shaker screens20may be inserted adjacent flanges28, and an air bladder25(seen for example inFIG.2andFIG.3) will be attached to flanges28. Air bladder25when inflated will apply a downward force to the top surface of the shaker screens20at the outer sides thereof. Shaker screen20comprises a panel30, with a plurality of openings31defined therein. Panel30may be referred to herein as a perforated panel30. A screen member32, which may be a single mesh screen or a plurality of layered mesh screens are attached to panel30. The screen member32is attached in a manner known in the art. In one example, the screen member is heat bonded to panel30. Other methods of attachment, such as glue or epoxy may be used. Panel30in one embodiment is fabricated from a metal such as, in a non-limiting example, steel. Panel30has a top surface33and a bottom surface34. Top surface33is a smooth surface. Panel30has a thickness38. Panel30has first end40, second end42and defines a length44therebetween. Panel30has first side46and second side48, and first and second peripheral side edges50and52respectively at the first and second sides46and48thereof. Top surface33has first and second bladder engagement surfaces53and54at the first and second sides46and48thereof. Bladder engagement surface53is defined on the portion of the top surface33between peripheral edge50and an edge55of the openings31in panel30at first side46. Bladder engagement surface54is defined on the portion of the top surface33between peripheral edge52and an edge56of the openings31in panel30at second side48thereof. Bladder engagement surfaces53and54are contiguous surfaces with no openings into which an air bladder may pass, and which could cause deformation and damage to the air bladder25. The only interruptions in bladder engagement surfaces53and54are the slight protrusions of fastener heads that attach side rails60to panel30. Side rails60comprise first and second side rails62and64. First and second side rails62and64in one embodiment are mirror images of one another. The same identifying numbers will be used on both, except that the subscript “a” will be used for features on second side rail64. Side rails60are generally triangularly shaped side rails. Side rails60have a first, or hook end68and a second, or receiving end70. Side rails60have a top leg74with a top surface76, which is a flat surface. Top leg74has a length72. A lip78extends upwardly from top surface76along the length72of top leg74. Lip78has a height80, which is substantially equal to the thickness38of panel30. A side leg82is connected to top leg74. Side leg82has a surface84which is a flat surface along the length thereof. Side leg82and top leg74define an angle86therebetween, which in the embodiment described is an acute angle which may be in the range of, and which in one embodiment is about forty-five degrees, but which can have a broad range of angles. A plurality of spaced apart ribs88connect top leg74and side leg82and provide strength to side rails60. The generally triangular shape is formed by the top leg74, side leg82and ribs88. Side rails60in one embodiment may be molded side rails formed from a thermoplastic material, such as a nylon composite. It is understood that separately formed side rails60may be made from other plastics and materials, such as a metal material. Side rails60are formed separately from panel30, which makes the construction and assembly of shaker screens20considerably more efficient and economic than existing screens. Existing shaker screens for use as described herein are generally formed by bending the outer edge of a metal panel into a generally triangular shape such that it is integral to the panel. The processes for creating such a panel are more involved and time consuming that those necessary for screens20. Side rails60are connected to panel30with rivets90or other fasteners that connect panel30to top leg74. A head of rivet90will protrude only slightly above top surface33of panel30. A flange92at first end68of side rails60has an upwardly extending hook94connected thereto. Top leg74at second end70of side rails60has a receiving slot98defined therein. Shaker screens20thus comprise a panel30with mesh screens32attached thereto, and side rails60attached to the panel30. When panel30and side rails60are connected, receiving slot98is covered by panel30, so that there are no exposed openings in bladder engagement surfaces53and54. Shaker screens20are shown in exemplary fashion inserted into a shaker5in the schematic perspective view ofFIG.1.FIG.1is an exemplary view looking directly into a basket6of shaker5. As shown inFIG.4, the bladder engagement surfaces53and54of top surface33are smooth and continuous, with no exposed openings into which an air bladder may be pushed, and thereby deformed or damaged. Shaker5may have a rigid crowning structure, which may be for example upstands, or ribs102spaced apart and supported by a support plate103that will be fixed to the frame16of shaker5. A center rib104will be slightly taller than outer ribs106, such that when the air bladder25is inflated to push down on panel30, the shaker screen20is crowned and secured against the ribs102. Air may be supplied to air bladders25through air hoses108from an air supply, such as an air compressor (not shown) or other air supply. As noted above, it may be desirable to place shaker screens20side by side and end to end. To connect the shaker screens end to end to form a shaker screen assembly110with a plurality of shaker screens20, the connecting hooks94at first end68of side rails60on a first shaker screen20are inserted into the receiving slots98on an adjacent second shaker screen20. It is possible to connect as many shaker screens as desired in this fashion to achieve the desired length of shaker screen assembly110needed for a particular shaker machine. The air bladder25will be inflated once shaker screens20are inserted into shaker machine5, and will press down on bladder engagement surfaces53and54to secure the shaker screens in the shaker machine5. The screens are easily replaced as deflating the bladder25and pulling on the first shaker screen in a shaker screen assembly110will efficiently and effectively remove all of the shaker screens20in that assembly, since all are connected together with connecting hooks94and receiving slots98. A method of making a shaker screen may comprise, for example, providing a panel with mesh screens attached thereto and connecting separately formed side rails to the panel. The separately formed side rails may be molded side rails formed from a thermoplastic material, such as a nylon composite. The separately formed side rails may be connected to the panel with fasteners, such as rivets, or by other means. The method may further include inserting the shaker screen into a shaker machine, and securing the shaker screen with an inflatable air bladder. Therefore, the shaker screen and shaker screen assembly disclosed herein are well adapted to attain the ends and advantages mentioned, as well as those that are inherent therein. The embodiments disclosed are illustrative only, as the shaker screen, shaker screen assembly, and method disclosed herein may be modified and practiced in different but equivalent manners, as will be apparent to those skilled in the art having the benefit of the teachings herein. Furthermore, no limitations are intended to the details of construction or design herein shown, other than as described in the claims below. It is therefore evident that the particular illustrative embodiments disclosed above may be altered or modified, and all such variations are considered within the scope and spirit of the present process. While the present shaker screen assembly, screen subassembly and method and the individual components and steps thereof may be described in terms of “comprising,” “containing,” “having,” or “including” various steps or components, the process and system can also, in some examples, “consist essentially of” or “consist of” the various steps and components. Whenever a numerical range with a lower limit and an upper limit is disclosed, any number and any included range falling within the range are specifically disclosed. In particular, every range of values (of the form, “from about a to about b,” or, equivalently, “from approximately a to b,” or, equivalently, “from approximately a-b”) disclosed herein is to be understood to set forth every number and range encompassed within the broader range of values. Also, the terms in the claims have their plain ordinary meaning unless otherwise explicitly and clearly defined by the patentee. | 12,584 |
11858003 | DETAILED DESCRIPTION Provided herein are systems and methods for managing the waste associated with the extraction of rubber from guayule shrubs. Also provided herein is a portable local sub-station for reducing the transportation costs associated with the processing of guayule shrubs for the extraction of rubber. Use of the disclosed systems, methods and/or local sub-station can reduce transportation costs, reduce processing costs and reduce the downstream processing complexity associated with the extraction of rubber from guayule shrubs. Definitions The terminology as set forth herein is for description of the embodiments only and should not be construed as limiting the invention as a whole. As used herein, the term non-Hevea plant is intended to encompass plants that contain natural rubber within the individual cells of the plant. As used herein the term “bagasse” is used to refer to that portion of the ground or chopped plant matter from a non-Hevea plant that is insoluble and hence is suspended rather than dissolved by organic solvents. As used herein, bagasse should be understood to include dirt and ash, unless otherwise specified. As used herein the term “plant matter” means material obtained from a non-Hevea plant. Unless otherwise specified, the plant matter may include roots, stems, bark, woody material, pith, leaves and dirt. As used herein the term “woody material” means the vascular tissue and meristematic material obtained from a non-Hevea plant. Unless otherwise specified, woody material does not include bark. As used herein the term “bark” refers to the tough outer covering present on the stems and roots of certain (particularly woody or shrub-like) non-Hevea plants and should be understood to include all tissues outside the vascular cambium. Not all non-Hevea plants will contain bark. As used herein the term “resin” means the naturally occurring non-rubber chemical entities present in non-Hevea plant matter, including but not limited to resins (such as terpenes), fatty acids, proteins, and inorganic materials. As used herein the term “dirt” (such as used in the connection with the solid purified rubber produced by the processes disclosed herein) means non-plant material that may be associated with non-Hevea plants, particularly upon harvesting, such as soil, sand, clay and small stones. Dirt content in solid purified rubber can be determined by completely re-dissolving the solid rubber and pouring the solution through a 45 micron sieve. The sieve is then rinsed with additional solvent and dried. The weight of the material retained on the sieve represents the “dirt” content of the solid purified rubber. In a first embodiment, a method for managing waste associated with the processing of guayule shrubs for the extraction of rubber is provided. The method comprises utilizing harvested guayule shrubs including leaves, bark, woody material, and optionally roots from a harvest site; utilizing a local sub-station to remove at least one of the leaves and dirt from the harvested guayule shrubs thereby producing a semi-processed guayule material with a weight that is at least 10% lower than the weight of the harvested guayule shrubs; and transporting the semi-processed guayule material to a remote rubber extraction plant capable of producing rubber, resin and waste bagasse from the semi-processed guayule material where the waste bagasse comprises at least 60% by weight of the semi-processed guayule material. (It should be understood that the terms process and method, as used with respect to the first embodiment, are used interchangeably herein.) In a first sub-embodiment of the first embodiment, a method for managing waste associated with the processing of guayule shrubs for the extraction of rubber is provided. The method comprises utilizing harvested guayule shrubs including leaves, roots, bark and woody material from a harvest site; utilizing a local sub-station to remove at least one of the leaves and root dirt from the harvested guayule shrubs thereby producing a semi-processed guayule material with a weight that is at least 5% lower than the weight of the harvested guayule shrubs; and transporting the semi-processed guayule material to a remote rubber extraction plant capable of producing rubber, resin and waste bagasse from the semi-processed guayule material where the waste bagasse comprises at least 60% by weight of the semi-processed guayule material (on a dry weight basis). In a second sub-embodiment of the first embodiment, a method for managing waste associated with the processing of guayule shrubs for the extraction of rubber is provided. The method comprises utilizing harvested guayule shrubs including leaves, bark and woody material from a harvest site; utilizing a local sub-station to remove at least one of the leaves and root dirt from the harvested guayule shrubs thereby producing a semi-processed guayule material with a weight that is at least 5% lower than the weight of the harvested guayule shrubs; and transporting the semi-processed guayule material to a remote rubber extraction plant capable of producing rubber, resin and waste bagasse from the semi-processed guayule material where the waste bagasse comprises at least 60% by weight of the semi-processed guayule material (on a dry weight basis). In a third sub-embodiment of the first embodiment, a method for managing waste associated with the processing of guayule shrubs for the extraction of rubber is provided. The method comprises utilizing harvested guayule shrubs including leaves, bark and woody material from a harvest site; utilizing a local sub-station to perform at least one of leaf removal, root dirt removal and woody material and bark separation from the harvested guayule shrubs thereby producing a semi-processed guayule material with a weight that is at least 20% lower than the weight of the harvested guayule shrubs; and transporting the semi-processed guayule material to a remote rubber extraction plant capable of producing rubber, resin and waste bagasse from the semi-processed guayule material where the waste bagasse comprises at least 60% by weight of the semi-processed guayule material (on a dry weight basis). In a second embodiment, a portable local sub-station for reducing the transportation costs associated with the processing of guayule shrubs for the extraction of rubber is provided. The portable local sub-station comprises at least one of a chopper, a debarker, a briquetting machine, an air separator, a leaf remover and a compression machine suitable for initial processing of a quantity of harvested guayule shrub thereby reducing the weight of the harvested guayule shrub by at least 5%. The local sub-station is capable of being transported to multiple locations. Also provided herein are systems relating to the processing of guayule shrubs for the extraction of rubber. In a first system embodiment, a system for managing waste associated with the processing of guayule shrubs for the extraction of rubber is provided. The system comprises a sub-system for receiving harvested guayule shrubs including leaves, bark, woody material and optionally roots from a harvest site; a pre-processing sub-system comprising a local sub-station for removing at least one of the leaves and root dirt from the harvested guayule shrubs thereby producing a semi-processed guayule material with a weight that is at least 5% lower than the weight of the harvested guayule shrubs; and a transportation sub-system for transporting the semi-processed guayule material to a remote rubber extraction plant capable of producing rubber, resin and waste bagasse where the waste bagasse comprises at least 60% by weight of the semi-processed guayule material (on a dry weight basis). In a second system embodiment, a system for pre-processing guayule shrubs prior to the extraction of rubber from the shrubs is provided. The system comprises a pre-processing sub-system comprising a local sub-station for receiving harvested guayule shrubs from a harvest site and for removing at least one of the leaves and root dirt from the harvested guayule shrubs thereby producing a semi-processed guayule material with a weight that is at least 5% lower than the weight of the harvested guayule shrubs, wherein the local processing sub-system is located within 25 miles of the harvest site. In a third system embodiment, a system for processing guayule shrubs to extract rubber from the shrubs that comprises a remote rubber extraction plant for receiving pre-processed guayule shrub material from a pre-processing site and for further processing the pre-processed guayule shrub material to produce rubber, resin and waste bagasse is provided. The pre-processed guayule shrub material that is received at the remote rubber extraction plant has been pre-processed to remove at least one of the leaves and root dirt thereby eliminating or reducing the need for such removal at the remote rubber extraction plant. In such embodiments, the remote rubber extraction plant is located more than 10 miles from the pre-processing site. As previously discussed, in a first sub-embodiment of the first embodiment of the methods disclosed herein, the harvested guayule shrubs include leaves, roots, bark and woody material and the local sub-station of the first embodiment is used to remove at least one of the leaves and root dirt from the harvested guayule shrubs. In a second sub-embodiment of the first embodiment of the methods disclosed herein, the harvested guayule shrubs include leaves, bark and woody material and the local sub-station is used to remove at least one of the leaves and root dirt from the harvested guayule shrubs. In a third sub-embodiment of the first embodiment of the methods disclosed herein, the harvested guayule shrubs include leaves, bark and woody material and the local sub-station is used to perform at least one of leaf removal, root dirt removal and bark and woody material separation. (The harvested guayule shrubs that are utilized in the second embodiment and in the first, second and third embodiments of the systems disclosed herein can have any of the foregoing compositions.) Generally, leaf removal may be desirable because the leaves of the guayule shrub contain a relatively lower percentage of rubber as compared to the woody material. Similarly, it may also be desirable to remove the root dirt from the harvested guayule shrubs to prevent the dirt from entering the ultimate rubber extraction process since fine particles of dirt can contaminate the guayule rubber and lead to a lower grade, less desirable rubber product. In certain embodiments according to the first embodiment, separation of the bark and woody material from the harvested guayule shrubs may be desirable to form two streams of material from which rubber may be extracted. In certain embodiments, the bark stream and the woody material stream may be subjected to different subsequent treatments such as different types of compression into briquettes and even different rubber extraction procedures at a remote rubber extraction plant. In certain embodiments according to the first, second and third sub-embodiments of the first embodiment of the processes disclosed herein and of the systems disclosed herein and the second embodiment disclosed herein, the portable sub-station is used to remove the leaves and the root dirt from the harvested guayule shrubs. Generally, the incorporation of pre-processing processes such as one or more of leaf removal, root dirt removal, chopping, compression and bark and woody material separation at a location separate from the location where rubber extraction occurs can simplify the rubber extraction process in that relatively fewer steps (and, hence, relatively fewer pieces of equipment) are required during the rubber extraction process. In certain embodiments according to the first, second and third sub-embodiments of the first embodiment of the processes disclosed herein and of the systems disclosed herein and the second embodiment disclosed herein, it may be desirable to have twigs and pieces of dead plant matter removed at the sub-station since these components have either lower overall rubber contents and/or contain degraded rubber (i.e., lower molecular weight). In preferred embodiments according to the first, second and third sub-embodiments of the first embodiment of the processes disclosed herein and systems disclosed herein and the second embodiment disclosed herein, the local sub-station is located relatively near to the harvest site where the guayule shrubs are grown and harvested so as to facilitate easy delivery of the harvested guayule shrubs to the local sub-station. In certain embodiments, the sub-station is located within 25 miles, within 5 miles, within 1 mile, within ½ mile or even within ¼ mile of the harvest site. Conversely, the remote rubber extraction plant is located relatively remotely from the harvest site such that transportation of the entire guayule shrub without pre-processing at the local sub-station can lead to high transportation costs. In certain embodiments, the remote rubber extraction plant is located more than 10 miles, more than 25 miles or even more than 100 miles from the harvest site and/or from the site where the sub-station is located. It is specifically contemplated that the remote rubber extraction plant may take various forms and employ various processes for extracting the rubber from the guayule shrub, including, but not limited to aqueous extraction and organic solvent extraction. Exemplary methods for organic solvent extraction of rubber from guayule shrubs are disclosed in U.S. Patent Applications Ser. Nos. 61/607,448, 61/607,460 and 61/607,469, the entire disclosure of each being herein incorporated by reference. In certain embodiments according to the first, second and third sub-embodiments of the first embodiment of the processes disclosed herein and according to the first, second and third embodiments of the systems disclosed herein the sub-station is portable. The degree of portability may vary. In preferred embodiments, the portable local sub-station may be located and utilized on a transportable platform or surface such as a trailer bed. In such embodiments, the re-location of the sub-station to a new sub-station location for initial processing of the harvested guayule shrub and/or the re-location of the sub-station to the remote rubber extraction plant will be relatively easy. In other embodiments, the sub-station may be portable in terms of being capable of being loaded onto a truck or moved via another transportation device for delivery to a suitable sub-station location or to the remote rubber extraction plant, off loaded from the transportation device and useable after placement on the ground, located at or near the harvest site or remote rubber extraction plant on a platform (with or without mounting fixtures) or temporarily installable in a building or other shelter (again, with or without mounting fixtures) at or near the harvest site or remote rubber extraction plant. Preferably, the portable sub-station is configured such that it is usable within no more than a few hours (i.e., 2-4 hours or less) of being moved to a new location. In certain embodiments according to the first, second and third sub-embodiments of the first embodiment of the processes disclosed herein and of the systems disclosed herein and according to the second embodiment disclosed herein, the sub-station is re-located from a first local location that is no more than 5 miles (preferably no more than 1 mile) from a first harvest site to a second local location that is not more than 5 miles (preferably no more than 1 mile) from a second harvest site. Such an embodiment allows for the movement of a local sub-station to more than one harvest site where the harvest sites may be different farm locations that are located various distances from each other (e.g., more than 10 miles apart, more than 20 miles apart or even more than 100 miles apart) and are also each relatively remote from the remote rubber extraction plant (e.g., each more than 10 miles from the remote rubber extraction plant). Such movement to accommodate various harvest sites can have the advantage of achieving more efficient use of equipment as a particular harvest site will likely only harvest guayule shrubs during a certain period or periods during the year. The local sub-station may contain various types of equipment in order to remove at least one of the leaves, roots and bark from the harvested guayule shrub. Various methods for removing leaves from shrubs are known and the methods disclosed herein should not be considered to be particularly limited to any individual method. For example, in certain embodiments, leaf removal may be facilitated by the use of blown air, shaking or a combination of both. In certain embodiments, leaf removal can be facilitated by allowing the harvested guayule shrubs to dry in the field (e.g., for several days up to 2-3 weeks) whereby the leaves will tend to become dry and brittle and more easily removable. Various methods for removing dirt from the roots of shrubs exist and the methods disclosed herein should not be considered to be particularly limited to any individual method of root dirt removal. For example, in certain embodiments, root dirt removal may be achieved by shaking, vibrating, air blowing, air separator, and the use of water pressure. Various methods for separating or removing bark from the woody material of shrubs are known and the methods disclosed herein should not be considered to be particularly limited to any individual method of bark removal or separation. In certain embodiments, bark removal/separation can be facilitated by the use of a rice polisher, a drum debarker or a hydraulic debarker. A drum debarker uses a rotating drum to remove the bark. A hydraulic debarker uses high pressure water to remove the bark. In certain embodiments according to the first, second and third sub-embodiments of the first embodiment of the processes disclosed herein and of the systems disclosed herein and the second embodiment disclosed herein, the local sub-station will also include a chopper that is capable of chopping the harvested guayule shrub into pieces having an average length of ¼″ to 4″. (Preferably, any chopping is conducted subsequent to the leaf removal and/or root dirt removal. However, in certain embodiments, depending upon the type of leaf removal and/or root dirt removal utilized, it can be feasible to chop the harvested guayule shrub into pieces prior to leaf removal and/or root dirt removal.) The chopped pieces may be more easily transported to the remote rubber extraction plant and can also decrease the amount of processing that is required at the remote rubber extraction plant during the rubber extraction process. Various methods exist for chopping woody materials such as guayule shrubs and the methods disclosed herein should not be considered to be particularly limited to any individual method. For example, one exemplary way of obtaining chopped plant matter is to feed raw plant material into a shredder, a granulator or a hammer mill. A granulator is a well-known machine designed for chopping or grinding material into various sizes. Most granulators contain multiple knives (often steel knives) and one or more screens (sometimes interchangeable) with various diameter holes to determine the size of the final product. Various size granulators exist and may be useful in chopping the plant matter such as those containing openings of ⅜″, ¼″ and ⅛″. A hammer mill can generally be described as a steel drum containing a vertical or horizontal rotating shaft or drum on which hammers are mounted; the hammers “pound” the material that is passed through the mill. Various size hammer mills exist and may be useful in chopping the plant matter such as those containing openings of ⅜″, ¼″ and ⅛″. In certain embodiments according to the first, second and third sub-embodiments of the first embodiment of the processes disclosed herein and of the systems disclosed herein and according to the second embodiment disclosed herein, the local sub-station will also include a compression machine that is capable of compressing the chopped plant matter into a more dense form such as a briquette or a pellet. In certain embodiments, the compressed material is a briquette or pellet that has a density that is 150-325% higher than the density of the non-compressed chopped plant matter. Producing such briquettes at a location local to the harvest site or sites can lead to reduced shipping and transportation costs as relatively more briquettes (and, hence more rubber) can be transported to the remote rubber extraction plant or stored (at the location of the local sub-station, at the remote rubber extraction plant or at another location) within the same volume of shipping or storage container. In yet other embodiments, the briquettes have a density that is 40-100% higher than the density of the non-compressed chopped plant matter. Briquettes with such densities can provide advantages in terms of being easier to produce and easier to grind and dissolve in organic solvent. In certain embodiments, the briquettes have a density of 3 to 8.5 pounds/gallon (0.4 to 1 kg/liter). This density is the true density of the briquettes (excluding the volume of pores) and not a bulk density. Various methods (e.g., optical, gas expansion and liquid imbibitions) for determining the true density of a porous solid exist and are known to those skilled in the art, but they all generally entail measuring the volume of pores existing within the porous solid so that this volume can be excluded from the volume that is used to calculate true density. In those embodiments of the first, second and third sub-embodiment of the first embodiment of the processes disclosed herein and of the systems disclosed herein and of the second embodiment disclosed herein, where the local sub-station includes a compression machine or briquetting machine, the briquettes, pellets or other compressed form that is produced may contain a certain amount of water. In certain embodiments, the briquettes contain 2-20% by weight water (based upon the total weight of the briquette). In other embodiments the briquettes contain 5-15% by weight water. The water that is within the briquettes has as its primary source residual water from the plant matter. The amount of water present in the briquettes can be adjusted such as by drying the chopped plant matter prior to compacting it into briquettes. In certain embodiments, the chopped plant matter is dried to reduce its moisture content by at least 2 weight %, by at least 4 weight % or even by at least 6 weight % prior to compacting the plant matter into briquettes. Various methods of achieving drying of the chopped plant matter can be utilized, including, but not limited to, sun drying, forced air drying (with air that is dry and/or heated). In certain embodiments, the plant matter may be dried prior to chopping. Another potential source for the water that may be present in the briquettes is additives added to the plant matter after harvest. As discussed in more detail later, these additives can include antioxidants and/or binders that may optionally be applied via aqueous solutions of the active ingredients. In certain embodiments according to the first, second and third sub-embodiments of the first embodiment of the processes disclosed herein and of the systems disclosed herein and according to the second embodiment disclosed herein, the local sub-station includes a chopper. In certain such embodiments, the plant matter comprises chopped guayule shrub including bark and woody tissue from the shrub but with no more than 5 weight %, preferably no more than 4 weight % or no more than 3 weight % or even more preferably no more than 1 weight % of the plant matter comprising leaves from the guayule shrub. In certain of the foregoing embodiments, the guayule shrub used for the plant matter initially comprises both the above-ground portions and below-ground portions of the shrub (i.e., the stems (with bark, woody tissue and pith) and the roots). In other of the foregoing embodiments, the guayule shrub used for the plant matter initially comprises only the above-ground portions of the shrub (in other words, the roots are not included in the plant matter). The leaves of the guayule shrub may be removed using various methods such as field drying followed by shaking. Other methods for removing the leaves from the plant matter of the guayule shrub before incorporating that plant matter into briquettes may be utilized as the particular method for removing leaves is not considered to be a significant limitation of the processes and systems disclosed herein. In certain embodiments, according to the first, second and third sub-embodiments of the first embodiment of the processes disclosed herein and of the systems disclosed herein and according to the second embodiment disclosed herein, the local sub-station prepares briquettes from plant matter containing a combination of bagasse, rubber and resin. In certain embodiments, the plant matter utilized in the briquettes includes bark, woody material, rubber and resin. In certain embodiments, woody material comprises at least 70 weight %, at least 80 weight %, at least 85 weight % or even at least 90 weight % of the briquette and the remaining amount of the briquette comprises bark and leaves. In order to achieve the foregoing make-up of plant matter within the briquette it may be necessary to remove or limit the amount of bark and leaves that is utilized within the plant matter and compacted into briquettes. In yet other embodiments, bark comprises at least 50 weight %, at least 60 weight %, at least 70 weight % or even at least 80 weight % of the briquettes and the remaining amount of the briquettes comprise woody material and leaves. In order to achieve the foregoing make-up of plant matter within the briquettes it will likely be necessary to remove or limit the amount of woody material and leaves that is utilized within the plant matte and compacted into briquettes. In certain embodiments, the briquettes comprise at least 80 weight % bark, less than 20 weight % woody material and less than 1 weight % leaves. In order to achieve the foregoing make-up of plant matter within the briquettes it will likely be necessary to remove or limit the amount of woody material and leaves that is utilized within the plant matter and compacted into briquettes. In yet other embodiments, the briquettes contain less than 5 weight % woody material, with the remaining amount of the briquettes comprising up to 95 weight % bark and preferably less than 2 weight % leaves, even more preferably less than 1 weight % leaves. Each portion of the plant matter (i.e., bark, woody material, roots and leaves) used within the briquettes will contain varying amounts of bagasse, rubber, resin and water. As used herein the terms briquette and pellet are used interchangeably and should be construed broadly to encompass various forms or shapes, including, but not limited to, pellets, cubes, rectangular solids, spherical solids, egg-shaped solids, bricks and cakes. Various methods exist for compacting the plant matter into briquettes. One method of preparing briquettes from the plant matter is to utilize a commercial briquetting machine to prepare the briquettes. Various companies manufacture these machines and they are available in various sizes and specifications. Exemplary briquetting machines include those manufactured by K. R. Komarek, Inc. (Wood Dale, IL), including the roll-type briquetting machines model no. B 100R and BR200QC. Generally, a briquetting machine utilizes a roll-type system to compact material, with or without the addition of a binder to the material that is being compressed. Pressure can be applied by the machine in varying amounts depending upon the machine utilized, the properties of the chipped plant matter and the properties desired in the briquettes. In certain embodiments, briquettes of plant matter from guayule shrubs are made using a briquetting machine. In certain of the foregoing embodiments, a binder is applied to the chipped plant matter prior to its being compressed into briquettes. Other methods of preparing briquettes of chopped plant matter from non-Hevea plants may be utilized within the scope of the processes and systems disclosed herein. In this regard, the disclosure of U.S. Patent Application Ser. No. 61/607,475 entitled “Processes For Recovering Rubber From Non-Hevea Plants Using Briquettes” is herein incorporated by reference. In certain embodiments, the briquettes made by the local sub-station are made from chopped plant matter that has been treated with one or more binders prior to compression into briquettes. Various types of binders may be utilized, including, but not limited to, organic-based binders (such as wood products, clay, starches and ash), chemical-based binders (such as -sulfonate, lime, and sodiumbentonite and liquids such as water. The amount of binder utilized with the chipped plant matter may vary depending upon the type of briquette being formed. In certain embodiments, the amount of binder utilized with the briquette is 0.1-5 weight % (based on the total weight of the briquette). In certain embodiments, the briquettes made by the local sub-station are made from chopped plant matter that has been treated with one or more antioxidants prior to compression into briquettes. Suitable compounds for use as the one or more antioxidants in certain embodiments include, but are not limited to, 2,6-di-t-butyl-4-methylphenol (also known as 2,6-di-t-butyl-p-cresol); N-(1,3-dimethylbutyl)-N′-phenyl-1,4-benzenediamine; octadecyl-3-(3,5-di-tert.butyl-4-hydroxyphenyl)-propionate (commercially available as Irganox® 1076); 4,6-bis (octylthiomethyl)-o-cresol (commercially available as Irganox® 1520), monohydric hindered phenols such as 6-t-butyl-2,4-xylenol, styrenated phenols, butylated octylphenols; bisphens, for example 4,4′-butylidenebis(6-t-butyl-m-cresol), polybutylated bisphenol A, hindered hydroquinones such as 2,4-di-t-amylhydroquinone; polyphenols, such as butylated p-cresol-dicyclopentadiene copolymer; phenolic sulfides such as 4,4′-thiobis(6-t-butyl-3-methyl-phenol), alkylated-arylated bisphenol phosphites such as tris(nonylphenyl)phosphite, triazinetriones such as alkylated hydroxycinnamate triester of tris(2-hydroxyethyl)-triazinetrione, tris(alkyhydroxybenzyl)-triazinetrione; pentaerythritol esters such as tetrakis(methylene-3,5-di-t-butyl-4-hydroxyhydrocinnamate)-methane; substituted diphenylamines such as octylated diphenylamines, p-(p-touenesulfonamido)-di-phenylamine, nonylated diphenylamine, diisobutylene-diphenylamine reaction products; dihydroquinolines such as 6-dodecyl-1,2-dihydro-2,2,4-trimethylquinoline; dihydroquinoline polymers such as 1,2-dihydro-2,2,4-trimethylquinoline polymer; mercaptobenz-imidazoles such as 2-mercaptobenzimidazole; metal dithiocarbamates such as nickel dibutyldithiocarbamate, nickel diisobutyldithiocarbamate, nickel dimethyldithiocarbamate; ketone/aldehyde-arylamine reaction products such as aniline-butyraldehyde condensation products, diarylamine-ketone-aldehyde reaction products; and substituted p-phenylenediamines such as di-b-naphthyl-p-phenylenephenylenediamine and N-phenyl-N′-cyclohexyl-p-phenylenediamine. The total amount of the antioxidant employed in those embodiments that utilize at least one antioxidant may be in the range of 0.2-2 weight % of the purified solid rubber ultimately produced by the process (based upon the weight of the purified solid rubber containing less than 0.8 weight % solvent). In certain embodiments, the plant matter that is compressed into the briquettes by the local sub-station has not only been chopped but has also been subjected to a roller mill/cracker mill, flaker mill/flaker, hammer mill and/or other mechanical treatment capable of rupturing the cell walls of the cells that contain the natural rubber. A roller mill/cracker mill can generally be described as a device with two or more rolls each containing longitudinal grooves which assist in further size reduction of material fed through the mill. A flaker mill or flaker can generally be described as a device with two or more rolls each having a smooth surface, usually operated at different speeds, with a defined and adjustable clearance between rolls which primarily assist in providing further rupturing of plant cell walls. A hammer mill can generally be described as a steel drum containing a vertical or horizontal rotating shaft or drum on which hammers are mounted; the hammers “pound” the material that is passed through the mill. Such types of mechanical treatment tend to increase the amount of natural rubber that can ultimately be recovered from the plant matter. In certain embodiments, chopped plant matter from the guayule shrub is used for the briquettes, and the chipped plant matter is subjected to at least one of roll milling, flake milling and hammer milling prior to compression into a briquette. In those embodiments where at least one of roll milling, flake milling or hammer milling is used upon the chipped plant matter, the chopped plant matter is preferably treated with at least one antioxidant prior to being compressed into a briquette (the amount of the antioxidant being in accordance with the previous antioxidant discussion). In certain embodiments, the briquettes are capable of being stored for at least 90 days after compacting while still having the rubber contained within the briquettes retain a molecular weight of at least 800,000, preferably at least 1,000,000. The briquettes may be stored at a location at or near the location of the sub-station, at or near the rubber extraction plant or at a separate location such as one capable of providing temperature or other environmental controls. In certain preferred embodiments, the briquettes are made of chopped plant matter from a guayule shrub and the briquettes are capable of being stored for at least 90 days after compacting while still having the rubber contained within the briquettes retain a molecular weight of at least 800,000, preferably at least 1,000,000. In other embodiments, the briquettes are capable of being stored for at least 7 months (210 days) after compacting while still having the rubber contained within the briquettes retain a molecular weight of at least 800,000, preferably at least 1,000,000. In certain preferred embodiments, the briquettes are made of chipped plant matter from a guayule shrub and the briquettes are capable of being stored for at least 7 months (210 days) after compacting while still having the rubber contained within the briquettes retain a molecular weight of at least 800,000, preferably at least 1,000,000. While the sub-embodiments of the first, second and third embodiments of the first embodiment of the processes disclosed herein, the embodiments of the systems disclosed herein, and of the second embodiment disclosed herein have been discussed primarily in terms of one local sub-station and one remote rubber extraction plant, it should be considered to be within the spirit of the current disclosure to utilize more than one local sub-station and/or to utilize more than one remote rubber extraction plant. For example, depending upon the size and number of the harvest sites and the size of the remote rubber extraction, it may be advantageous to utilize more than one local sub-station (e.g., two local sub-stations, three local sub-stations or more). To the extent that the term “includes” or “including” is used in the specification or the claims, it is intended to be inclusive in a manner similar to the term “comprising” as that term is interpreted when employed as a transitional word in a claim. Furthermore, to the extent that the term “or” is employed (e.g., A or B) it is intended to mean “A or B or both.” When the applicants intend to indicate “only A or B but not both” then the term “only A or B but not both” will be employed. Thus, use of the term “or” herein is the inclusive, and not the exclusive use. See Bryan A. Garner, A Dictionary of Modern Legal Usage 624 (2d. Ed. 1995). Also, to the extent that the terms “in” or “into” are used in the specification or the claims, it is intended to additionally mean “on” or “onto.” Furthermore, to the extent the term “connect” is used in the specification or claims, it is intended to mean not only “directly connected to,” but also “indirectly connected to” such as connected through another component or components. While the present application has been illustrated by the description of embodiments thereof, and while the embodiments have been described in considerable detail, it is not the intention of the applicants to restrict or in any way limit the scope of the appended claims to such detail. Additional advantages and modifications will readily appear to those skilled in the art. Therefore, the application, in its broader aspects, is not limited to the specific details, the representative apparatus, and illustrative examples shown and described. Accordingly, departures may be made from such details without departing from the spirit or scope of the applicant's general inventive concept. | 37,594 |
11858004 | DETAILED DESCRIPTION In the following description, like reference signs denote like elements or steps. FIG.1shows a three-dimensional drawing of a mobile screening apparatus100in a two-way split configuration combining oversize and middle deck oversize fractions. The apparatus comprises:110: feed equipment of the apparatus, such as a feed hopper and a feed conveyor;120: a multi-deck screen, comprising a first screen deck or oversize screen deck122, a second screen deck124and a third screen deck126;130: a first discharge conveyor;140: a second discharge conveyor, in this configuration aligned with the first discharge conveyor;150: a third discharge conveyor, here turned to a sideways direction;160: a fourth discharge conveyor, here turned to a sideways direction;170: a fines conveyor under the third screen deck126for conveying undersize fraction of the third screen deck126to the fourth discharge conveyor;180: body extending to support a discharge conveyor (here second discharge conveyor140). Material consisting of rock material and/or sand in a variety of fractions is fed on the feeder110, for example, by a wheel loader or an excavator. The feeder110feeds material to the first screen deck122. Oversize material i.e., oversize material that does not pass the apertures of the screen deck122will be moved towards the feeding end of the first discharge conveyor130. FIG.2shows a three-dimensional drawing of a mobile screening apparatus in another configuration separating different fractions to different discharge regions. InFIG.2, the first discharge conveyor130is turned to a sideways direction (second direction) on a first side of the mobile screening apparatus. InFIG.2, the second discharge conveyor140is directed forward to a first direction. The second discharge conveyor140is also pivotable to the first direction. One or both of the first and second discharge conveyors130,140is pivotable further to a third direction on a second side, that is opposite to the first side. The third direction may be opposite to the second direction. The second and third directions surround the first direction, i.e. a discharge conveyor pivoting between the second and third directions pivots over the first direction. The third discharge conveyor150direction is also drawn inFIGS.1and2as directed to the third direction. The directions preferable reside in a horizontal plane so that the pivoting of the conveyors would not change potential energy of pivoted mass, if the mobile screening apparatus is horizontally aligned when operating. FIG.3shows a schematic side view of some material dividing and blending alternatives. Solid arrows are drawn to illustrate a normal exit path of oversize fractions from the first to third screen decks122,124and126, respectively. Oversize material or oversize fraction of screen deck126falls to conveyor150and undersize material passing through the screen deck126falls on conveyor170(seeFIG.1) below the screen deck126. Dashed arrows illustrate alternative paths that can be produced with a splitting arrangement illustrated inFIG.4with one example implementation. FIG.4shows a three-dimensional view of some material dividing and blending structures usable for implementing a splitting arrangement. The first screen deck exit is provided with controllable plate systems or chutes that enable directing either or both of a left-hand side stream and a right-hand side stream to any of the first discharge conveyor130, the second discharge conveyor140or the third discharge conveyor150. FIG.4illustrates three apertures between the screen deck and the conveyor: one on the left-hand side, one in the middle and on the right-hand side. These apertures may be openable and closable by removable plates, for example. FIG.5shows details of a pivotable mounting of a discharge conveyor, such as the first discharge conveyor130, the second discharge conveyor140or the third discharge conveyor150. The discharge conveyor, in this example the second discharge conveyor140, is mounted to the body180via a slewing ring510to allow rotational movement or pivoting of the discharge conveyor as desired. FIG.6shows a three-dimensional drawing of the dividing and blending structures ofFIG.4in another configuration.FIG.6shows two adjustable chutes for first and second screen decks122,124, respectively. In each of these chutes, there are a plurality of aperture forming structures610to630each of which can be covered individually by a respective closing structure such as plates640to660. Notably, the chutes need not be of same shape or size and the different aperture structures may form apertures of different sizes. While inFIG.6first and second screen decks122,124all of the aperture structures of one screen deck are closed or open, in other configurations only some of the aperture structures are covered or blocked to lead a portion of the oversize material to a discharge conveyor ahead and to let another portion of the oversize material to fall down onto one or more subsequent screen deck's discharge conveyor. FIG.6also shows that the outputs of the first and second screen decks122,124may extend laterally to different extents or to similar extent. In some cases, it can be useful to allow (at least some) oversize material of the first screen deck122fall through the aperture structures of the first screen deck122and also through the aperture structures of the second screen deck124so as to combine with the oversize material of the third screen deck126. By enabling adjustable mixing of some oversize material of different decks, desirable new screening blends can be produced without separate mixing. For example, by mixing larger particle sized oversize fractions of the first and second screen decks122,124with the finer oversize fraction of the third screen deck126, a desirable combination of load bearing and settling of the blend can be attained for road or railroad structure or concrete production. FIG.7shows a three-dimensional drawing of a mobile screening apparatus in a transport configuration. The second to fourth exit conveyors140,150,160are each turned by two transportation joints up and sideways (in either order). The first exit conveyor130is directed forward and folded to reduce the length of the entire apparatus suitably for towing with normal trucks on a semi-trailer.FIG.7further shows a track base710of the mobile screening apparatus. Alternatively, the mobile screening apparatus may comprise wheels or skids for on-site transfers. FIG.8shows a flow chart of a mobile screening process in a mobile screening apparatus, illustrating:805. receiving material for screening with a feed of the apparatus;810. receiving and screening material from the feed by a first screen deck;815. outputting by a first discharge conveyor an oversize fraction of the first screen deck;820. receiving by a second screen deck an undersize fraction of the first screen deck;825. outputting by a second discharge conveyor an oversize fraction of the second screen deck;830. pivoting the first discharge conveyor to operate in a direction selected between a first direction and a second direction, which second direction differs from the first direction; in an example embodiment with a freely selected angle or with two or more steps between the first direction and the second direction;835. pivoting the second discharge conveyor to operate in a direction selected between a first direction and a second direction, which second direction differs from the first direction; in an example embodiment with a freely selected angle or with two or more steps between the first direction and the second direction;845. selectively discharging in a common pile the oversize fraction of the first screen deck and the oversize fraction of the second screen deck;840. pivoting one or both of the first and second discharge conveyors from a first side of the mobile multi-deck screening apparatus to an opposite second side of the mobile multi-deck screening apparatus;850. folding the first discharge conveyor over a horizontal axis in a forward direction for preparing the mobile screening apparatus to a transport configuration;855. folding the second discharge conveyor twice with each folding axis being horizontal and at a perpendicular angle for preparing the mobile screening apparatus to a transport configuration. In an embodiment, the process excludes step845. In an embodiment, the process alternatively or additionally excludes step850. In an embodiment, the process alternatively or additionally excludes step855. Advantageously, the mobile multi-deck screening apparatus may enable the co-piling with at least one of the discharge conveyors that is pivoted into any direction between the second and third direction. The mobile multi-deck screening apparatus may comprise a mobile platform providing forward and backward movement either by self-propelling or towing. In either case, the allowing of co-piling onto either side of the mobile multi-deck screening apparatus facilitates piling on either side without maneuvering the mobile multi-deck screening apparatus. Various embodiments have been presented. It should be appreciated that in this document, words comprise, include, and contain are each used as open-ended expressions with no intended exclusivity. The foregoing description has provided by way of non-limiting examples of particular implementations and embodiments of the invention a full and informative description of the best mode presently contemplated by the inventors for carrying out the invention. It is however clear to a person skilled in the art that the invention is not restricted to details of the embodiments presented in the foregoing, but that it can be implemented in other embodiments using equivalent means or in different combinations of embodiments without deviating from the characteristics of the invention. Furthermore, some of the features of the afore-disclosed embodiments of this invention may be used to advantage without the corresponding use of other features. As such, the foregoing description shall be considered as merely illustrative of the principles of the present invention, and not in limitation thereof. Hence, the scope of the invention is only restricted by the appended patent claims. | 10,322 |
11858005 | DETAILED DESCRIPTION In the following description, certain specific details are set forth in order to provide a thorough understanding of various implementations. However, one skilled in the art will understand that the invention may be practiced without these details. In other instances, well-known structures associated with computers, cameras, photo detection, wired or wireless communications, with other digital devices, with data display, and/or with data storage or data transmission, have not been shown or described in detail to avoid unnecessarily obscuring descriptions of the implementations. Unless the context requires otherwise, throughout the specification and claims which follow, the word “comprise” and variations thereof, such as, “comprises” and “comprising” are to be construed in an open sense, that is, as “including, but not limited to.” Reference throughout this specification to “one implementation” or “an implementation” and the like means that a particular feature, structure or characteristic described in connection with the implementation is included in at least one implementation. Thus, the appearances of the phrases “in one implementation” or “in an implementation” in various places throughout this specification are not necessarily all referring to the same implementation. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more implementations. In the present disclosure, the systems and methods may be characterized at points in terms of a representative or exemplary system being developed by the United States Postal Service (USPS) and referred to as the USPS Sort to Indicator system or Sort to Light (STL) system. Various implementations of the Sort to Indicator system improve, and solve several problems associated with, current manual sortation processes and operations. For example, various implementations of the Sort to Indicator system described herein automatically read and process the address information from a delivery item, reducing or eliminating human delay and error in this operation, and automatically determine and designate the proper physical location at which the human operator should place the delivery item, reducing or eliminating human error and slowness in this operation. This enables operators to efficiently and accurately sort mail items to their assigned sort output locations without having to know, memorize, or read the sort plan or the meaning of each sort output location, because all the operators must do is place each delivery item at or in the location specified by an automated designator, for example, a designator such as an illuminated colored LED or light that is over a mail bag. In other words, the designator notifies the human operator regarding where to put the delivery item in accordance with correct sorting. It will be understood, however, that the implementations described herein, including the Sort to Indicator system and the sorting software, refer to examples of possible implementations only. The claimed invention may encompass other processes and systems as yet undeveloped or to be developed, which employ similar elements, functions and/or operations, which may be designed or developed by parties other than the USPS, and which may be referred to by terms other than the Sort to Indicator system, Sort to Light system, or the like. FIG.1is a block diagram illustrating an example of a Sort to Indicator system100for processing and sorting delivery items. The Sort to Indicator system100includes delivery items to be sorted140(e.g., mail pieces)j; radio frequency (RF) transceivers108,110,112; indicator devices102,104,106, (e.g., computer-controlled multicolor LEDs or lights, for example as described with respect toFIG.4), at sort output locations, which are operably coupled to the respective transceivers108,110,112; a computing device116having a microprocessor(s) (e.g., a server computer, a personal computer, a tablet computer, or the like) that executes instructions, such as sort software; an RF transceiver114that is operably coupled to the computing device116and that communicates with the RF transceivers108,110,112; another RF transceiver118, (e.g., a Bluetooth transceiver118) and that is also operably coupled to the computing device116; operators122,126,130,134,138and scanners120,124,128,132,136, (e.g., Bluetooth™ wireless scanners), which may be wearable by the operators and that communicate with the transceiver118. In some implementations, the RF transceivers114,108,110, and112may be replaced by wired communications devices; and/or in some implementations, the BT transceivers118and the BT wireless scanners120,124,128,132,136may be replaced by wired scanner devices. The delivery items to be sorted140may be mail pieces having delivery address indicia (e.g., a barcode(s) and/or a text address) that is manually scanned by the operators, such as the operator122using the scanner120, according to one implementation. In some implementations, the scanners120,124,128,132,136may be wearable wireless scanners that utilize Bluetooth™ technology, for example, the model RS507 cordless ring imager by the Zebra Company of Lincolnshire, IL or the Honeywell 8670 wireless ring scanner. In other implementations, the scanner may be a digital camera that is communicatively connected to the computing device116, a camera-equipped smart phone, or the like. In some implementations, the scanner's RF access point, such as the Bluetooth™ transceiver118, may support up to a maximum number of wireless imagers or scanners120,124,128,132,136, such as a maximum of seven. Additional Bluetooth access points (not shown) may be used to increase this number. In additional or alternative implementations, or one or more wired scanners, which may or may not be stationary, can be connected to the computing device116. In some implementations, the scanners120,124,128,132,136may signal a successful scan, transmission, and/or processing with a green light and/or a positive audio feedback, such as a short beep; and may signal an unsuccessful scan, transmission, and/or processing (e.g., for an invalid barcode or failed scan) with a red light and/or a negative audio feedback, such as a long beep, which alerts the operator to handle the delivery item140differently than usual. In various implementations, the computing device116with sort software includes or has operable access to a storage device (not shown) or machine-readable (e.g., computer-readable) medium that stores the sort software and/or a sort plan that indicates sort output locations for various delivery addresses. In various implementations, the computing device116is operably connected to a network (not shown) that enables communication with other computing devices (not shown) that may perform related ancillary functions, such as returning a ZIP code that corresponds to a unique identifier (e.g., a tracking barcode) from a delivery item140. In one implementation, the sort software interfaces with, communicates with, or includes Manual Sortation Appliance (MSA) computer software developed by the USPS. In various implementations, the MSA software determines the sort output location for a mail piece by identifying or determining the mail piece's destination ZIP code from data received from the scanners120,124,128,132,136; then comparing the ZIP code to the current sort plan to determine a ZIP-code range or group into which the ZIP code falls, and which is assigned to a specific sort output location, which may correspond to or represent, e.g., a physical location in the processing/sorting facility, such as the location of, or a, specific container for delivery items in that ZIP-code range or group. In some implementations, the delivery items that are to be sorted140are a subset of the mail pieces which are processed by a processing/sorting facility. For instance, items to be sorted140using the Sort to Indicator system100may be items that cannot be or is not typically processed by automated sorting equipment, such as large or oddly shaped items or parcels (e.g., snow skis), or ordinary mail items that were rejected by or unsuitable for automated equipment for some reason and consequently require manual sorting. In the example ofFIG.1, the items to be sorted140typically have address information in the form of a barcode that contains a destination delivery code or postal code (e.g., a ZIP code encoded in a barcode), and/or a unique identifier that can be used to determine the delivery or postal code of the destination (e.g., an Intelligent Mail barcode). The operators122,126,130,134,138pick up or otherwise handle one of the mail items140and use the scanners120,124,128,132,136to obtain, capture, or scan the address information (e.g., barcode) from each item140. In some instances, the address information may be in the form of letters and numbers that represent the destination/delivery address in writing. In some implementations, if an item140does not have a scannable or usable barcode, then the computing device116and/or the scanner120may recognize or identify the destination address information, such as the postal code, using optical character recognition (OCR) of the numbers and letters on the item140. In some other implementations, if an item140does not have a scannable or usable barcode, then the operator122,126,130,134,138may visually read and enter the destination address information (e.g., the postal code) into the computing device116and/or the scanner120, e.g., via a keyboard, touch screen, or speech recognition interface. In various implementations, the scanned destination address information, such as the destination postal code, is transmitted by one of the wireless scanners, such as scanner120, and received by the computing device116via the Bluetooth transceiver118, which is operably connected to the computing device116. In various implementations, the scanner120also transmits, with the postal code, an identifier that uniquely identifies the scanner120, and which is received by the computing device116via the Bluetooth transceiver118along with the address information. According to some such implementations, the identifier that identifies a specific one of the wireless wearable scanners120,124,128,132,136is the unique media access control (MAC) address of each particular scanner. In various implementations, the destination address information, e.g., the destination postal code, from each of the delivery items140is used by the sort software on the computing device116to determine or identify one of the indicator devices102,104,106, which are each at or associated with one of the sort output locations. For example, after reception, the computing device116, e.g., executing the sort software and using, based on, or according to a predetermined sort plan, determines the proper sort output location and its associated indicator device102-106for the item140that was scanned. In certain implementations, each indicator-equipped sort output location is or includes a container for delivery items that are destined for a general delivery area or areas, which area(s) may be specified by a postal-code range or group. For example, the container at the location “A” with the indicator device102may be for mail pieces140having ZIP codes from 20100-29999; the container at location “B” with the indicator device104may be for mail pieces140having ZIP codes from 30000-39999; and the container at location “C” with the indicator device106may be for mail pieces140having ZIP codes from 70000-79999, according to the sort plan. In various implementations, the delivery codes or postal codes may be a continuous range (as in the example above) or a non-continuous group, (such as 30000-31999 and 39800-39999). In some implementations, the computer116may also upload the scanned barcode/address information to a central tracking system which enables more accurate tracking of the mail piece and creates visibility of the mail flow. In various implementations, after determining the correct indicator device102-106and sort output location for an item140, the computing device116sends or transmits information, such as a command(s) specifying a designator (e.g., a visual or audio signal, display, or presentation that is recognizable by a human operator, such as a specific color, pattern, sound, or the like) that is associated with one particular scanner, from the RF transceiver114to the determined specific one of the indicator devices102-106, via its associated transceiver108-112, to cause that indicator device to produce, display, provide or otherwise present the appropriate designator for that one particular scanner (e.g., a specific color, such as blue), which designator is recognizable by the operator that scanned that item140using that particular scanner. In the example of implementations that use lights or LEDs as or included with the indicator devices102-106, the command(s) from the computing device116may cause the illumination of one or more lights/LEDs in a designated color (e.g., blue) or pattern or sequence, and the lights/LEDs may be positioned near (e.g., above) the container that is the sort output location for a specified range of ZIP codes. As just noted, in various implementations, each of the indicator devices102-106may be a remote-and-computer-controlled strip or group of multicolor LEDs—i.e., LEDs that can display more than one color, for example as shown and described with respect toFIG.4. In various implementations, the indicator devices102-106may additionally or alternatively be monitors or the like (e.g., display devices such as flat-panel liquid crystal display (LCD) or organic light-emitting diode (OLED) screens), which can display different colored panels, different colored windows, characters, symbols, text, or the like that designates the sort output location for each scanner120,124,128,132,136. The designator notifies the operator regarding where to place/sort the delivery item. Upon seeing, hearing, detecting, recognizing or otherwise being notified by the designator (e.g., a blue light) presented by one of the indicator devices102-104, the operator using the scanner that is associated with that designator (e.g., the blue scanner136) moves, places, or otherwise sorts the scanned item140into the sort output location A, B, or C associated with the designator-presenting indicator device102-106(e.g., into a bag in rack “A” that is below the indicator device102that is displaying the blue-light designator). As shown inFIG.1, multiple operators (e.g., five in the non-limiting example ofFIG.1) can be supported in the same manual sorting area by using or assigning different designators, such as colors, for each scanner/operator pairing. In the example ofFIG.1, operator122uses wireless scanner120and is assigned the color red as a designator, operator126uses wireless scanner124and is assigned the color white as a designator, operator130uses wireless scanner128and is assigned the color green, operator134uses wireless scanner132and is assigned the color yellow, and operator138uses wireless scanner136and is assigned the color blue. It is to be understood that scanners and colors assigned to individual operators are not fixed and can be dynamically reassigned, as needed, due to personnel changes, changes in scanner hardware, and changes to the sort plan. It is to be further understood that the designators are not limited to the colors shown, or even to the use of colors or other visual-type designators—for example audible designators could be used additionally or alternatively; and/or mono-color LEDs could be used, where the LED's position or pattern in an LED strip is the designator; and/or text or numbers on a monitor or screen could be used as a designator, etc. Additionally, in some implementations, the Sort to Indicator system100may support multiple sort areas that are similar to the sort area shown inFIG.1, where the multiple areas can be controlled by one computing device116by networking their indicator devices with the computing device116and the indicator devices102,104,106. In such implementations, the computing device116may control additional indicator devices for multiple sort areas using different node numbers and network numbers for the additional indicator devices and their RF transceivers. In some such implementations, the computing device116may use a different sort plan (e.g., like sort plan162) to support the multiple sort areas at the same time, such as up to approximately seven different sort plans to support seven different sort areas that are similar to the sort area shown inFIG.1, although only one has the computing device116. In still other implementations, the computing device116may record and analyze data reflecting the actions of the operators122,126,130,134,138while performing sorting tasks using the Sort to Indicator system100, such as how long in time it takes an operator to scan an item and place it in an output location, how long it takes an operator between item scans, the number of items140processed by an operator per hour, number of sorting errors by an operator, and the like. The analysis may produce metrics indicating each operator's productivity, efficiency, error rate, average time to sort a package, and the like. FIG.2is a flowchart illustrating an example of a method250for sorting delivery items using the system ofFIG.1, according to one implementation. The method250will be described with continued reference to the operation of the Sort to Indicator system100shown inFIG.1. In various implementations, the operations, functions, instructions, blocks, or steps of the method250may be performed or executed by or using a computer or the like, such as the computing system116ofFIG.1, which may access and/or control appropriate peripheral devices, such as a storage device262, transceivers108-114, indicator devices102-106, and controllers602. The method250starts at operation255with receiving address information from a delivery item along with an identifier of the device (e.g., scanner) that gathered and sent the address information. For example, the “red” operator122may use the “red” scanner120to scan an item to be sorted140, and the scanner120may detect, record, or capture the delivery address information, such as a delivery postal code, on the item140. The “red” scanner120may wirelessly send data to the computing device116, which receives the data via the Bluetooth transceiver118. The data may include the address information from the scanned delivery item140, including the delivery postal code, and an identifier associated with the “red” scanner120, such as the scanner120's unique MAC address. At operation260, the method250looks up, identifies or otherwise determines a sort output location for the delivery item140based on the received address info and a sort plan262that may be stored in a storage device. In various implementations, the sort plan262specifies or defines how to group by general delivery area (e.g., by state, by destination postal code, or the like) the current batch of items to be sorted140. The sort plan262indicates how all of the delivery items140going to the same general destination area get grouped or sorted into the same output location, such into the same bag, bundle, tray or other container. In various implementations, the sort plan262may specify the destination areas using a ZIP code range and/or a group of ZIP codes. Typically, sort plans include a “leftovers” output location, to which all the items140that don't fall into one of the sort plan's other general destination areas are sorted. In various implementations, as shown, the sort plan262may be stored in a computer-readable medium that is accessible by the computing device116and the sort plan262may change for sorting each different batch of items140. In some implementations, the sort plan may be represented as a table or other data structure similar to Table 1 below: TABLE 1Sort OutputCorresponding IndicatorZIP CodesLocationDevice ID20100-29999A10230000-39999B10470000-79999C106 Consider an example using Table 1 andFIG.1and an item140that has a destination ZIP code of 20170, where the computing device116may determine the sort output location for the scanned item140by comparing the scanned item140's ZIP-code address information (e.g.,20170) to the sort plan ZIP code groupings in the left column, and then looking up or identifying the corresponding sort output location in the center column of the same row of Table 1, which is sort output location “A”. Thus, the sort plan may be used by the sort software running on the computing device116to map an item's ZIP code to a specific sort output location A, B, C. At265, the method250looks up, identifies or otherwise determines the indicator device that corresponds to the sort output location that was determined in operations260. Continuing the same example using Table 1 andFIG.1and the item with ZIP code 20170, the computing device116may determine the indicator device that corresponds to the sort output location by looking up or identifying the indicator-device identifier that corresponds to the sort output location A in the right column of the same row of Table 1, which is indicator-device ID “102.” Thus, the sort plan may be used by the sort software running on the computing device116to map an item's sort output location to a specific indicator device102,104,106. Although this example uses a single data structure as represented in Table 1 to map or correlate address information (e.g., ZIP codes) with sort output locations and with indicator-device identifiers, in other implementations two separate data structures may be used: a sort plan structure that maps address information (e.g., ZIP codes) to sort output locations and another structure that maps sort output locations to indicators. At operation270, the method250looks up, identifies or otherwise determines the designator associated with the scanner that sent the address info, based on the identifier for that scanner, which was received in operation255. In some implementations, the designator may be a color, such as red for scanner120, white for scanner124, green for scanner128, yellow for scanner132, and blue for scanner136, as shownFIG.1. In various implementations, the scanners120,124,128,132, and136may be labelled or painted with, or have a screen that displays, their designator color so that the operator of each scanner will recognize the correct designator color when it is displayed or presented by the indicator devices102-106. In some implementations, the relationship between a scanner and its designator may be represented as a table or other data structure similar to Table 2 below: TABLE 2Scanner IdentifierDesignator120red124white128green132yellow136blue Continuing the same example using the item140having ZIP code 20170, and given that the operator122used the scanner120to scan the item140, then the computing device116may determine the designator that corresponds to the scanner having the identifier120by looking up or identifying the designator that corresponds to the scanner identifier120in the right column of the same row of Table 2, which is the designator “red.” In some other implementations, the scanner120may provide (e.g., transmit) its designator, e.g., “red”, to the computing device116with its identifier and the address information captured from the item140(e.g., as part of operation155), and the computing device116may determine the designator by simply reading it from the data received from the scanner120. At275, the method250transmits or otherwise sends a command to the indicator device500that corresponds to the sort output location, where the command causes the indicator device500to produce, render, or otherwise present the designator that was determined in operation265. Continuing the same example above where the appropriate designator is “red” and the appropriate indicator device is indicator device102, computing device116may wirelessly send, via the RF transceiver114a command to display a red light to the indicator device102, which receives the command via its RF transceiver108. Upon receiving the command of operation275, the indicator device102switches on, illuminates, or otherwise presents the commanded designator, such as a red light, LED, display area of a monitor, or the like. Upon seeing the red-light designator on the indicator device102, the operator122of the scanner120moves the item140that he/she just scanned to the sort output location A, which is associated with the indicator device102. After sorting the scanned item into the proper location, the operator122may then scan a new item to be sorted140, which triggers a new iteration of the method250. As shown in the examples ofFIGS.2and4, in one possible implementation the indicator device102may be a remote-controlled strip of multicolor LEDs, which may be commanded to illuminate in various colors and/or patterns and/or sequences, which act to designate to an operator122,126,130,134,138that the item140they have just scanned should be placed at the sort output location of the indicator. In this implementation, the computing device116transmits instructions via the RF transceiver114to illuminate a specific LED(s) of the LED-strip indicator device102with the specific color (e.g., red) that is the designator assigned to the scanner120and its operator122. In various implementations, the indicator device102may transmit an acknowledgment back to the computing device116via the RF transceiver108and the RF transceiver114. The acknowledgment be a digital message with data indicating that the command(s) were received at the indicator device102and indicating that the appropriate designator was presented, for example, that the appropriate LED(s) was illuminated in the specified color. According to certain implementations, if the appropriate designator cannot be presented (e.g., due to a hardware or communications failure), the indicator device102may transmit a maintenance message back to the computing device116via the RF transceiver108and the RF transceiver114. In some such implementations, if a maintenance indication is transmitted, a maintenance indicator can be audibly or visually presented by the indicator device102. For example, the indicator device102may blink a ‘maintenance required’ light pattern or produce a “maintenance required” sound if it cannot process a command from the computing device116. In some implementations, the indicator device102may include or be connected to a sensor that senses when an item140has been placed in the sort output location A that is associated with the indicator device102. In response to detecting that the item140has been placed in the correct sort output location (e.g., in a bin, sack, container or the like), the indicator device102may cease or stop presenting the designator (e.g., turn off the red LED(s)). In such implementations, the indicator device102may also transmit the sensor data back to the computing device116via the RF transceiver108and the RF transceiver114so that the sort software on the computing device116can confirm that the scanned item140was placed in the appropriate sort output location. In some additional or alternative implementations, the indicator device102may cease presenting (e.g., turn off) the designator after a predetermined time period that allows the operator to efficiently move the item140to the sort output location, such as 5 seconds, 10 seconds, 15 seconds, 20 seconds, or the like. In some implementations, ceasing to present (e.g., turning off) the designator may be done independently by the indicator device102or in response to a “cease” command that is sent by the computing device116after determining that the predetermined time period has elapsed. In still other additional or alternative implementations, instead of based on time, the computing device116may send a “cease” command for a given designator (e.g., red) when the scanner for that designator (e.g., the red scanner120) subsequently scans another delivery item140and transmits the scan data to the computing device116. In other words, the next scan by a given scanner triggers the “cease” command. In various implementations, the methods, processes and/or some or all of the operations described herein for the computing device116and/or the indicator devices102-106and/or the controller602and/or the scanners102, etc., may be fully or partially embodied on one or more computer-readable, non-transitory storage media or device that include instructions that are executed by a processor, e.g., the processor of a computing system. FIG.3depicts an example of a frame or rack402that defines five sort output locations406,408,410,412,414and that includes two indicator devices (one front and one rear) for each of the sort locations, according to one exemplary implementation. In the example shown, the rack402defines openings for the five sort output locations or openings406,408,410,412,414, with frames from which mail sacks or bags may be hung, or under which containers, such as wheeled barrels or carts, may be positioned, such that delivery items dropped through the openings406,408,410,412,414fall into the sacks or other containers. In some embodiments, the rack402may be configured and sized to accommodate spinner carts, which are wheeled carts from which mail sacks or bags are hung (as opposed to being hung from the rack402). With reference toFIGS.5and1, and using the rack402in the system100ofFIG.1, the sort output location406ofFIG.5could be the sort output location A ofFIG.1; the sort output location408ofFIG.5could be the sort output location B ofFIG.1; and the sort output location410ofFIG.5could be the sort output location C ofFIG.1. In the implementations shown, the rack402may be known as a Sort to Light Frame (STLF) and is made of metal (e.g., steel) members to which are mounted front indicator devices407F,409F,411F,413F, and415F, and rear indicator devices407R,409R,411R,413R, and415R. As shown, the indicator devices may be LED-strip indicator devices as described with respect toFIG.4, or other visual indicator devices, such as LCDs or incandescent lights. By being positioned, configured, or mounted in close proximity to—in this example directly in front of and behind—the sort output locations406,408,410,412,414, it is clear which two indicator devices are linked to, associated with, or are indicators for, each of the sort output locations. As shown inFIG.3, the rack402may also have mounted on it an indicator-device controller602as described with respect toFIGS.5Aand B. The indicator-device controller602is connected to the front indicator devices407F,409F,411F,413F, and415F, and to the rear indicator devices407R,409R,411R,413R, and415R by wires, cables, or the like, which are not shown inFIG.3. In various embodiments, the indicator-device controller602includes or contains an RF transceiver108-112as described previously. It should be noted that other implementations may use only a single indicator device for each of the sort output locations406,408,410,412,414, such as only the rear indicator device407R for the sort output location406; only the rear indicator device409R for the sort output location408; only the rear indicator device411R for the sort output location410; etc. FIG.4is a diagram of an indicator device500that can be used in processing and sorting delivery items according to one exemplary implementation. According to various implementations, the indicator device500can be embodied as a remote-controlled light or LED strip assembly. In one such implementation as shown, the device500can include ten individually addressable red green blue (RGB) multicolor LEDs501-510, which may be mounted on a printed circuit board inside a case or housing520, which may be an acrylonitrile butadiene styrene (ABS) plastic housing. The LEDs501-510are controllable to switch on and off and to emit or present any of the various colors that can be formed from combinations of red, green, and blue light. In various embodiments, the indicator device500may be connected to and controlled by a controller, such as the wireless indicator-device controller602described inFIGS.5A and5B. In certain implementations, the LEDs501-510in the indicator device500are controlled in pairs, which allows two-LED designators for up to five different scanners/operators. For example, each pair of LEDs (e.g., LEDs501and502, LEDs503and504, etc.) can be illuminated using the five distinct designator colors described inFIG.1—namely, red, white, green, yellow, and blue, which may be produced by mixing red, green, and blue light in different intensities, where each color is assigned as the designator for one scanner/operator. In other implementations, the indicator device's LEDs501-510may be controlled singly, allowing up to ten LED designators for up to ten different scanners/operators. Other variations are possible. In various implementations, for example as shown inFIG.3, there may be more than one LED strip indicator device500associated with each sort output location, such as rear indicator device407R and front indicator device407F for sort output locations406. Thus, the implementation shown inFIG.3may support up to 20 different scanners/operators if the LEDs501-510are controlled singly to provide designators or up to 10 different scanners/operators if the LEDs501-510are controlled in pairs. Other variations are possible; for example the front and rear indicator devices may duplicate each other and thus support no more than 10 different scanners/operators. In certain implementations, the indicator device500may include a bracket(s)530to hold or mount the indicator device500and wiring harnesses (not shown) to serially connect the individual indicator devices500to each other and to the wireless indicator-device controller602. FIG.5Adepicts a top view of a wireless indicator-device controller602with its cover removed that can be used in processing and sorting delivery items according to one exemplary implementation. In some implementations, the wireless indicator-device controller602connects to and is operable to control the indicator devices102-106,500, to communicate wirelessly with a computing device, such as the computing device116ofFIG.1, and to process and implement the commands received from the computing device116, among other things. In the implementation shown, the wireless indicator-device controller602includes at least one indicator device circuit board610, which includes a microprocessor, microcontroller, and/or logic circuits and hardware to perform the controller602's functions. In some implementations, controller602may include a housing620(e.g., an ABS plastic housing), cable mounts and seals615, and wiring harnesses (not shown) for electrically and communicatively connecting the indicator-device controller602to one or more indicator devices102-106, e.g. indicator device(s)500ofFIG.4. According to certain implementations, the indicator-device controller602communicates wirelessly with the RF transceiver114of the computing device116using a 915 MHz radio transceiver, which may be connected via a cable harness or which may be part of the circuit board(s) inside the housing620. As noted previously, in some such implementations, to help ensure that the correct designator(s) is displayed when an RF message/command did not transfer properly to the controller602, the controller602may periodically refresh the indicator device(s)500, such as every 100 or 200 milliseconds or the like and/or may shut off previously received designators after a predetermined time period, such as 20 seconds. In some implementations, a command received by the controller602from the computing device116may be or include a data array representation of all LEDs of an indicator device500or of all the indicator devices controlled by the controller602(e.g.,102-106,407F,409F,411F,413F,415F,407R,409R,411R,413R,415R), where the data in each array position indicates either a designator (e.g. color) to present by an LED or an “off” state for the LED. This array-representation command can be transmitted to the transceiver102,104,106,602that is associated with controlling the indicator device(s)500,102-106,407F,409F,411F,413F,415F,407R,409R,411R,413R,415R. In some embodiments, the controller602may calculate or determine the number of LEDs of the indicator device500to turn on in each designator color based on how many scanners currently have scanned items140that need to be sorted to the output location that is equipped with the indicator device500, so as to maximize the number of LEDs illuminated in each color of ease of visibility and designation. For example, if only one scanner/operator has scanned a delivery item that goes to a given sort output location, then the controller602may illuminate all ten LEDs at that output location in the designator color assigned to that scanner/operator. Continuing the example, if two scanners/operators have scanned items140that go to the same sort output location, then the controller602may illuminate five LEDs in each of the two designator colors assigned to each of the two scanners/operators. Similarly, if three or more scanners/operators scan barcodes that go to the same destination, then the controller602may illuminate two LEDs in each of the three or more designator colors assigned to each of the three or more scanners/operators, etc. In embodiments that control the LEDs of the indicator device500in pairs, the controller602may illuminate ten, five and two LEDs, respectively, in the examples described in this paragraph. In some other embodiments, the calculations, determinations and functions described in this paragraph may instead be performed by the computing device116, and the output may be sent to the controller602in a command(s). FIG.5Bdepicts a side view of the wireless indicator-device controller602shown inFIG.5A. FIG.6schematically depicts an example of the electronic components700that can be used in processing and sorting delivery items according to one implementation. As shown in this example, the components700include a power supply assembly708that accepts 120 volt alternating current power and outputs direct current power as needed by the controllers602and indicator devices415,720,722, such as 24V DC, sort to light frames or racks402,718, a cable extension710(if needed) to connect the first sort to light frame402to the power supply708, a jumper cable712to connect the first sort to light frame702the next sort to light frame718in a series of N sort to light frames included in the system components700, where N can be two or more, such as five. InFIG.7, cable plugs a denoted with P2 and the joiners that connect to the plugs are denoted by J2 and the like. As shown inFIG.7, the first sort to light frame402includes an indicator-device controller706(e.g., as described inFIGS.5Aand B), a rear LED indicator device415R and a front LED indicator device415F (e.g., as described inFIGS.3and4). Similarly, the last (e.g., Nth) sort to light frame718included in the system components700includes an indicator-device controller706, a rear LED indicator device720and a front LED indicator device722. Although, for clarity of explanation regarding connecting together multiple racks, the implementation shown inFIG.6includes only a single pair of indicator devices for each rack402,718, (which means that each of the racks402,718services only a single sort output location), it will be appreciated that in other implementations each of the racks402,718could service multiple sort output locations and could include several pairs of indicator devices. For example, each of the racks402,718could support five sort output locations, and the corresponding indicator devices, as shown in the implementation depicted inFIG.3. One of ordinary skill will recognize that the systems, components, computer-readable media, methods, processes, functions, and operations described herein are examples that can be included in implementations consistent with present invention, and the examples are not intended to be limiting. In other implementations, additional, or fewer, or substitute systems, components, computer-readable media, methods, processes, functions, and operations could be used within the scope of the invention. Similarly, the examples of steps, functions, operations disclosed in the examples herein could, in other implementations, be performed in a different order, in parallel, in an overlapping manner, etc., within the scope of the invention. While the foregoing disclosure has been described in some detail by way of illustration and example for purposes of clarity and understanding, it will be clear to one of ordinary skill in the art from a reading of this disclosure that various changes in form and detail can be made without departing from the true scope of the disclosure and may be practiced within the scope of the appended claims. For example, all the methods, computer readable media, delivery item processing systems, and/or component parts or other aspects thereof can be used in various combinations. | 41,368 |
11858006 | DETAILED DESCRIPTION The following description of various typical aspect(s) is merely exemplary in nature and is in no way intended to limit the disclosure, its application, or uses. As used throughout this disclosure, ranges are used as shorthand for describing each and every value that is within the range. It should be appreciated and understood that the description in a range format is merely for convenience and brevity, and should not be construed as an inflexible limitation on the scope of any embodiments or implementations disclosed herein. Accordingly, the disclosed range should be construed to have specifically disclosed all the possible subranges as well as individual numerical values within that range. As such, any value within the range may be selected as the terminus of the range. For example, description of a range such as from 1 to 5 should be considered to have specifically disclosed subranges such as from 1.5 to 3, from 1 to 4.5, from 2 to 5, from 3.1 to 5, etc., as well as individual numbers within that range, for example, 1, 2, 3, 3.2, 4, 5, etc. This applies regardless of the breadth of the range. Additionally, all numerical values are “about” or “approximately” the indicated value, and take into account experimental error and variations that would be expected by a person having ordinary skill in the art. It should be appreciated that all numerical values and ranges disclosed herein are approximate values and ranges, whether “about” is used in conjunction therewith. It should also be appreciated that the term “about,” as used herein, in conjunction with a numeral refers to a value that may be ±0.01% (inclusive), ±0.1% (inclusive), ±0.5% (inclusive), ±1% (inclusive) of that numeral, ±2% (inclusive) of that numeral, ±3% (inclusive) of that numeral, ±5% (inclusive) of that numeral, ±10% (inclusive) of that numeral, or ±15% (inclusive) of that numeral. It should further be appreciated that when a numerical range is disclosed herein, any numerical value falling within the range is also specifically disclosed. As utilized herein, the term “delivery item” may refer to an item, mail piece, package, or the like delivered by any delivery service, government or private. Illustrative delivery items may be or include, but are not limited to, printed materials, flats, letters, packages, parcels, boxes, oversized items, machinable objects, nonmachinable objects (NMOs), or the like, or combinations thereof. Illustrative delivery items may also be or include, but are not limited to, bounded bundles, containers, trays, or other items used to assemble and transport a plurality of individual items, or the like, or combinations thereof. FIG.1illustrates a schematic diagram of an exemplary system100for processing and sorting a plurality of delivery items, according to one or more implementations. The system100may include one or more computing systems (one is shown102), one or more intake areas (one is shown104), one or more sorting areas (two are shown106,108), or combinations thereof, operably and/or communicably coupled among one another (e.g., adjacent to one another and/or with conveyors or other equipment that is configured to interoperate or move items from one area(s) into another area(s)). The intake area104may be capable of or configured to receive the delivery items and direct the delivery items to the one or more sorting areas106,108. The sorting areas106,108may be capable of or configured to receive the delivery items from the intake area104and sort the delivery items. The intake area104may include one or more sources of delivery items (two are shown110,112) and one or more operators (two are shown114,116) associated with the one or more of sources of delivery items110,112. Examples of a source of delivery items are containers, bins, boxes, or the like, and the end of a conveyor device. Each of the sources of delivery items110,112may include a plurality of delivery items (not shown) to be sorted. Each of the delivery items of or in the sources of delivery items110,112may include an indicia or label indicating or providing the respective delivery address for each of delivery items. Illustrative indicia may be or include, but is not limited to, address information in the form of text, symbols, or the like, such as name and address, postal code (e.g., USPS Zone Improvement Plan or ZIP codes), or the like, or combinations thereof. The indicia may be in a machine-readable format. For example, the indicia may be in the form of text, barcode, quick response (QR) code, or any other machine-readable format. Each of the operators114,116may be associated with one or more of the sources of delivery items110,112. For example, a first operator114may be associated with a first source of delivery items110, and a second operator116may be associated with a second source of delivery items112. In another example, each of the first and second operators114,116may be associated with both the first and second sources of delivery items110,112. In at least one implementation, the intake area104may include a dedicated scanner (e.g., a bar code scanner, an OCR scanner, a PASS cart scanner, etc.) for the operators114,116thereof. In another implementation illustrated inFIG.1, the intake area104or the operators114,116thereof may each include or be associated with a respective scanner118,120. Each of the scanners118,120may be capable of or configured to scan or otherwise read an indicia of each of the delivery items. The scanner118,120may be operably and/or communicably coupled with the computing system102. For example, the scanner118,120may be communicably coupled with the computing system102via a wired or wireless connection. For example, each of the scanners118,120may be capable of or configured to communicate with the computing system102via a wired connection. In another example, each of the scanners118,120may be capable of or configured to communicate with the computing system102via a wireless connection, such as via a transceiver (not shown) (e.g., Bluetooth transceiver, RF access point, or the like). In at least one implementation, the scanner118,120may be a wearable wireless scanner. For example, each of the scanners118,120may be a wireless ring scanner Model RS507, which is commercially available from Zebra Company of Lincolnshire, IL or a wireless ring scanner Model 8670, which is commercially available from Honeywell of Charlotte, NC In another implementation, the scanner118,120may include a digital camera or a camera-equipped smart phone or tablet operably and/or communicably coupled with the computing system102. It should be appreciated that each of the sorting areas106,108disclosed herein may include similar components and/or parts, and may further be similarly operated. Consequently, discussions herein regarding any one or more of the sorting areas106,108, the components thereof, and/or the operation thereof may be equally applicable to the remaining sorting areas106,108. For example, discussions regarding a first sorting area106and the operation thereof may be equally applicable to a second sorting area108and the operation thereof. In another example, discussions regarding a component of the first sorting area106and the operation thereof may be equally applicable to the same component of the second sorting area108. In at least one implementation, each of the sorting area106,108may include one or more conveyors122,124, one or more indicators126,128, one or more sensors130,132,134,136, one or more sort locations138,139,140,141one or more operators142,144, or combinations thereof. For example, as illustrated inFIG.1, the first sorting area106may include a conveyor122, an indicator126, two sensors130,132, one operator142, and four sort locations138,139. Similarly, the second sorting area108may include a conveyor124, an indicator128, two sensors134,136, one operator144, and four sort locations140,141. In various embodiments, the indicators126,128may be devices that create an audio and/or visual manifestation that is noticeable by a human operator, such as a loudspeaker(s), a light(s), an LED array, a monitor(s), a television(s), a display screen(s), or the like. In various embodiments, the sort locations138,139,140,141may include one or more containers, carts, bins, boxes, bags, or the like into which delivery items may be sorted or placed. WhileFIG.1illustrates each of the sorting areas106,108with a similar arrangement of components, it should be appreciated that in other implementations, each of the sorting areas106,108may include a different amount and/or arrangement of components and parts. The conveyors122,124may be devices capable of or configured to translate or otherwise move the delivery items along a length thereof, such as a conveyor belt device. For example, a first conveyor122may be capable of or configured to move the delivery items from a first end portion146thereof (e.g., the input end) towards a second end portion148thereof (e.g., the output end). Similarly, a second conveyor124may be capable of or configured to move the delivery items from a first end portion150thereof towards a second end portion152thereof. In at least one implementation, the conveyors122,124may be capable of or configured to operably couple the sorting areas106,108, the intake area104, or combinations thereof with one another. For example, as illustrated inFIG.1, the first conveyor122may be capable of or configured to operably couple the first sorting area106with the intake area104, and may further be capable of or configured to operably couple the first sorting area106with the second sorting area108. In another example illustrated inFIG.1, the first conveyor122may be capable of or configured to operably couple the intake area104with the second sorting area108. In at least one implementation, each of the conveyors122,124may be operably and/or communicably coupled with one another and/or arranged relative to one another. For example, each of the conveyors122,124may be operably and/or communicably coupled with one another wirelessly, via one or more wires (e.g., electrical and/or data), mechanically (e.g., clamps, mating elements, etc.), or combinations thereof. In at least one implementation, the first conveyor122may be operably coupled with the computing system102and the second conveyor124, and configured to transmit electrical power, data, signals, or the like, or combinations thereof therebetween. For example, the first conveyor122may be wirelessly coupled with the computing system102and further coupled with the second conveyor124via a wire (e.g., electrical and/or data wire); thus, the first conveyor122may be capable of or configured to delivery electrical power to the second conveyor124and/or transmit data or signals between the second conveyor124and the computing system102. Each of the conveyors122,124may also be mechanically coupled with one another via mating elements. For example, the first end portion150of the second conveyor124may be mechanically coupled with the second end portion148of the first conveyor124to secure or couple the first and second conveyors122,124with one another. WhileFIG.1illustrates the conveyors122,124arranged in a linear configuration (e.g., end to end), it should be appreciated that the conveyors122,124may also be arranged at any angle, such as a right angle, relative to one another. In at least one implementation, each of the conveyors122,124may be substantially similar or the same with one another. For example, the dimensions and/or features of each of the conveyors122,124may be the same. In another implementation, any one or more of the conveyors122,124may have different dimensions and/or features with respect to the remaining conveyors122,124. The conveyors122,124may have a length of at least about 8 feet (ft), at least about 10 ft, at least about 12 ft, at least about 14 ft, or greater. Each of the conveyors122,124may be capable of or configured to move or translate the delivery items along the length thereof at a rate of at least about 0.35 meters per second (m/s), at least about 0.5 m/s, at least about 0.8 m/s, at least about 1 m/s, at least about 1.5 m/s, or greater. The rate of each of the conveyors122,124may be variable. The variable rate of the conveyors122,124may be at least partially determined by one or more factors of the system100and/or components thereof. For example, the variable rate of the conveyors122,124may be at least partially determined by the rate of operating the intake area104, the rate of operating any one or more of the sorting areas106,108, the rate of any one or more of the operators114,116,142,144, the computing system102, or the like, or combinations thereof. In at least one implementation, the rate may be determined by the computing system102and/or the processing/sorting facility in which the system100may be located. Each of the conveyors122,124may be capable of or configured to be moved relative to one or more components of the system100. For example, each of the conveyors122,124may include wheels or casters (not shown) that allows each of the conveyors122,124to be moved and locked into place. In at least one implementation, each of the conveyors122,124may be locked into place when power is applied thereto (e.g., when A/C power is provided). Each of the conveyors122,124may also include means or mechanisms to tilt the conveyors122,124on end and/or to nest the conveyors122,124with one another to minimize space when the conveyors122,124are stored and/or not in use. In at least one implementation, each of the conveyors122,124may be stacked and/or stored on end vertically along and against a wall of the processing/sorting facility. Any one or more of the conveyors122,124may be or include a Horizontal Belt Conveyor, Model TR, which is commercially available from the Gilmore-Kramer Company of West Greenwich, RI. In at least one implementation, each of the indicators126,128may be operably and/or communicably coupled with the computing system102(e.g., wired or wireless) and capable of or configured to receive instructions, commands, or signals therefrom. For example, as illustrated inFIG.1, a first indicator126may be directly coupled with the computing system102via a wired connection (as indicated by the solid arrow154) capable of or configured to allow the delivery or transmission of data, power, signals, or the like, therebetween. In another example, illustrated inFIG.1, the second indicator128may be wirelessly coupled with the computing system102via a wireless connection (as indicated by the hashed arrow156) capable of or configured to allow the delivery or transmission of data and/or signals therebetween. It should be appreciated that any one or more of the indicators126,128may be separately coupled with a power source, or may be capable of or configured to receive power from any remaining components of the respective sorting areas106,108. For example, any one or more of the indicators126,128may be coupled with one of the conveyors122,124and configured to receive power therefrom. The one or more indicators126,128may be capable of or configured to direct or bring the attention of the operators142,144to one or more locations, portions, or areas within the respective sorting area106,108. For example, the one or more indicators126,128may be capable of or configured to direct or bring the attention of the operator142,144to the one or more locations, portions, or areas within the respective sorting area106,108via one or more signals (e.g., visual, audio, display, presentation recognized by the operator142,144, such as a color, shape, pattern, or the like, etc.). In at least one implementation, the one or more indicators126,128may be capable of or configured to designate, indicate, or otherwise show the operators142,144the proper sort location138,139,140,141for a delivery item. For example, the indicator126of the first sorting area106may be capable of or configured to indicate to the operator142the proper sort locations138,139of the first sorting area106to place or dispose a delivery item. For example, the indicator126may illuminate one of the sort locations138,139or an area (shown in phantom162) proximal the sort location138,139to indicate the proper sort location138,139to the operator142. In yet another example, the one or more indicators126,128may also be capable of or configured to bring the attention of the operators142,144to an incoming delivery item. For example, the indicator126,128may be capable of or configured to indicate one or more areas (shown in phantom158,160) disposed in or proximal the first end portion146of the first conveyor122to bring the attention of the operator142to an incoming delivery item near or proximal the respective areas158,160. In yet another example, the one or more indicators126,128may be capable of or configured to track the delivery item along the respective length of each of the conveyors122,124. For example, any one or more of the indicators126,128may be a device capable of illuminating the delivery item to facilitate or otherwise aid the tracking (e.g., visual tracking) of the delivery item by the operator142,144. In at least one implementation, any one or more of the indicators126,128may be a motorized spotlight capable of or configured to maintain constant or temporary illumination of the delivery item along the respective conveyor122,124to facilitate the tracking of the delivery item by the operators142,144. Illustrative indicators may be or include, but are not limited to, fixed spotlights, motorized spotlights, video projector, lasers, LEDs, or the like, or combinations thereof. WhileFIG.1illustrates each of the sorting areas106,108including a single indicator126,128, it should be appreciated that each of the sorting areas106,108may include a plurality of indicators. For example, each of the sorting areas106may include a dedicated indicator (e.g., fixed spotlight) for each of the areas158,160,162and/or each of the sorting locations138,139,140,141. In at least one implementation, each of the dedicated indicators is a spotlight fixed to a beam, rail, channel, or the like disposed above the respective conveyor. In at least one implementation, the indicator126,128for any one or more of the sorting areas106,108may be or include a display or monitor (not shown). The display may be operably and/or communicably coupled with the computing system102and configured to communicate therewith. The display may be capable of or configured to show the arrangement or configuration of each of the components of the respective sorting area106,108. For example, the display may be capable of or configured to show the arrangement of the sort locations138,139,140,141about the respective conveyors122,124. The display may be capable of or configured to illustrate or show an image of each delivery item to the operator142,144, and may further be capable of or configured to indicate or illustrate which sort location138,139,140,141the delivery item is to be disposed. For example, the display and/or the computing system102operably coupled therewith may designate a symbol (e.g., letter, number, shape, text, color, etc.) to each of the sorting locations138,139,140,141, and may further illustrate that symbol on an image of the delivery item on the display to indicate the proper sorting location138,139,140,141. The display may be capable of or configured to illustrate or show an image of the delivery item moving along a representative image of the respective conveyor122,124in real-time for the operator142,144to facilitate tracking of the delivery item along the respective conveyor122,124. The one or more sensors130,132,134,136of each of the sorting areas106,108may be capable of or configured to determine when a delivery item is present and/or absent along one or more predetermined positions of the respective conveyor122,126. For example, a first sensor130of the first sorting area106may be disposed in or proximal the first end portion146of the conveyor122thereof and configured to determine if and/or when the delivery item is present at or proximal the first end portion146. In another example, illustrated inFIG.1, a second sensor132of the first sorting area106may be disposed in or proximal the second end portion148of the conveyor122thereof and configure to determine if and/or when the delivery item is present at or proximal the second end portion148. Illustrative sensors may be or include, but are not limited to, photoelectric sensors, digital cameras, mechanical gates or switches, or any other device suitable for determining the presence and absence of the delivery item along the conveyors122,124, or the like, or combinations thereof. Each of the sensors130,132,134,136may be operably and/or communicably coupled with the computing system102(e.g., wired or wireless) and capable of or configured to receive and/or send instructions, commands, or signals therewith. For example, each of the sensors130,132,134,136may be operably and/or communicably coupled with the computing system102and configured to send data and/or signals thereto related to the presence and/or absence of the delivery item along the predetermined positions of the respective conveyor122,124. For example, the first sensor130may be configured to send a signal or data to the computing system102when the delivery item is present at or proximal the first end portion146of the conveyor122. Similarly, the second sensor132may be configured to send a signal or data to the computing system102when the delivery item is present at or proximal the second end portion148of the conveyor122. It should be appreciated that any one or more of the sensors130,132,134,136may be separately coupled with a power source, or may be capable of or configured to receive power from any remaining components of the respective sorting area106,108. For example, any one or more of the sensors130,132,134,136may be coupled with one of the conveyors122,124and configured to receive power therefrom. In at least one implementation, the sort locations138,139,140,141of each of the respective sorting areas106,108may be disposed proximal the respective conveyors122,124thereof. For example, as illustrated inFIG.1, the sort locations138may be disposed proximal the first conveyor122on a first side164thereof, and the sort locations139may be disposed proximal the first conveyor122on a second side166thereof. Each of the sort locations138,139,140,141may be capable of or configured to receive and store the delivery items. For example, each of the sort locations138,139,140,141may be or include a container capable of or configured to receive and store the delivery items. Illustrative containers may be or include, but are not limited to, bins, trays, wire cages, roller tables, racks, or the like, or combinations thereof. In an exemplary implementation, any one or more of the sort locations138,139,140,141may be or include a conveyance device, system, or method capable of or configured to transport the delivery items to another operation or process. For example, any one or more of the sort locations138,139,140,141may be, be associated with, include, or have a roller table, a slide, or a conveyor similar to the conveyors122,124disclosed herein. Each of the sort locations138,139,140,141may correspond to a predetermined or specified location. Illustrative locations that each of the sort locations138,139,140,141may correspond to may be or include, but are not limited to, a location (e.g., physical location) in a processing/sorting facility, a particular ZIP code, a range of ZIP codes, another sorting/processing facility, another intake area, another system, another sorting area, another operation or process within the facility, or the like. In at least one implementation, each of the sorting areas106,108may include one or more additional indicators168,170capable of or configured to direct the attention of the operators142,144of the respective sorting areas106,108toward the first or second side164,166of the conveyors122,124. For example, as illustrated inFIG.1, the first sorting area106may include the additional indicators168,170disposed between the first and second sides164,166of the conveyor122. In at least one example, a first additional indicator168may correspond to the first side164of the conveyor122and a second additional indicator170may correspond to the second side166of the conveyor122. As such, the first additional indicator168may be actuated or otherwise “turned on” when a delivery item is to be disposed or placed in the sort locations168disposed on the first side164of the conveyor122. Similarly, the second additional indicator170may be turned on when a delivery item is to be disposed or placed in the sort locations139disposed on the second side166of the conveyor122. In at least one implementation, the additional indicators168,170may be fixed, stationary, or otherwise not motorized. It should be appreciated that in at least one implementation, the indicators126,128discussed above may also be capable of or configured to direct the attention of the operators142,144of the respective sorting areas106,108, toward the first or second side164,166of the conveyors122,124. It should further be appreciated that the additional indicators168,170may operate in conjunction with the indicators126,128discussed above. In one example, both the additional indicators168,170and the indicators126,128may be operably coupled with the computing system102, and the computing system102may operate the additional indicators168,170and the indicators126,128in conjunction with one another. In at least one implementation, each of the sorting areas106,108may include one or more audio devices172,174capable of or configured to output sound. Illustrative audio devices172,174may be or include speakers. The audio devices172,174may be disposed on or about any one or more of the conveyors122,124. For example, as illustrated inFIG.1, a first audio device172may be disposed at or proximal the first end portion or inlet150of the second conveyor124, and a second audio device174may be disposed at or proximal the second end portion or outlet152of the second conveyor124. Each of the audio devices172,174may be operably and/or communicably coupled with the computing system102(e.g., wired or wireless) and capable of or configured to receive signals therefrom. It should be appreciated that any one or more of the audio devices172,174may be separately coupled with a power source, or may be capable of or configured to receive power from any other components of the respective sorting areas106,108. For example, any one or more of the audio devices172,174may be coupled with one of the conveyors122,124and configured to receive power therefrom. The audio devices172,174may be capable of or configured to communicate with the operators142,144and/or bring the attention of the operators142,144to one or more locations, portions, or areas of the system100or the respective sorting areas106,108. In at least one implementation, the audio devices172,174may be capable of or configured to output a predetermined sound, such as an alarm sound, to indicate an event, such as an emergency event or an event that requires the attention of the operators142,144. For example, the audio devices172,174may be capable of or configured to indicate an unexpected delivery item. In another implementation, the audio devices172,174may be capable of or configure to bring the attention of the operators142,144to a delivery item at, near, or proximal the respective sorting areas106,108. For example, the audio devices172,174may be capable of or configured to indicate the movement of the delivery item along the system100or a component thereof (e.g., the conveyors122,124) by increasing or decreasing the volume of the sound from each of the audio devices172,174. In another example, the audio devices172,174may be capable of or configured to play a predetermined sound when the delivery item is at a predetermined position along the conveyors122,124. Each of the audio devices172,174may be operated independently or cooperatively with one another. For example, the volume of the first audio device172may be decreased while the volume of the second audio device174may be increased. In another example, the audio devices172,174may operate together to provide stereo sound. In at least one implementation, the audio devices172,174may be capable of or configured to facilitate engagement of the operators142,144. For example, the audio devices172,174may be capable of or configured to play sound clips, music (e.g., songs), sound effects, or the like, or combinations thereof. The audio devices172,174may facilitate or encourage cooperation between the operators142,144and/or improve productivity. For example, the audio devices172,174may be configured to play music when the system100reaches a predetermined throughput for a predetermined amount of time, or if the throughput of the system100is near or at a historical maximum. The computing system102may include one or more microprocessors (e.g., a server, a personal computer, a tablet computer, or the like, or combinations thereof) capable of or configured to execute instructions and/or software, such as sort instructions or sort software. The computing system102may include or have access to a storage media or machine-readable media that stores the sort software, instructions for sorting, or a sort plan that provides data regarding respective sort or output locations138,139,140,141, for each of the delivery items. The computing system102may be operably and/or communicably coupled with a network (not shown) to facilitate or enable communication with other stored media and/or computing systems that may perform related ancillary functions. Ancillary functions may be or include, but is not limited to, returning a ZIP code corresponding to the indicia (e.g., barcode) of the respective delivery item. The computing system102may also be operably and/or communicably coupled with any one or more of the intake areas104, the sorting areas106,108, components thereof, or combinations thereof, and configured to at least partially operate and/or communicate (e.g., send and receive instructions) therewith. For example, as previously discussed, the computing system102may be communicably coupled with the intake area104via the scanners118,120. In another example, the computing system102may be communicably coupled with each of the sorting areas106,108via the respective conveyors122,124, the respective indicators126,128, the respective sensors130,132,134,136, the respective additional indicators168,170, or combinations thereof. In at least one implementation, the sort software may interface with, communicate with, and/or include software developed by the USPS. The software may determine the sort locations138,139,140,141for each of the delivery items. For example, the software may receive data from the scanners118,120and/or the computing system102and utilize the data from the scanners118,120to determine the respective ZIP code (or other information) for each of the delivery items. The software may then utilize the ZIP code for the respective delivery item and determine the proper sort location138,139,140,141that corresponds to the ZIP code. In at least one implementation, the computing system102may record and/or analyze data reflecting operations of the system100or one or more components thereof. The computing system102may record and/or analyze data concurrently or while performing sorting tasks with the system100. For example, the computing system102may record and/or analyze the speed in which a delivery item is traveling through the system, how many delivery items are being sorted, how many delivery items are being scanned, the number of items processed by an operator114,116,142,144, the number of incorrectly sorted delivery items, or the like, or any combination thereof. The computing system102may then produce metrics indicating the efficiency of the system100, the components of the system100, and/or the operators114,116,142,144of the system100. Illustrative metrics may be or include, but are not limited to, efficiency, operator productivity, error rate, average time to sort, or the like. In at least one implementation, each of the sorting areas106,108may further include one or more operator interfaces176(one is shown). The operator interfaces176may be disposed on or about the respective conveyor122,124of each of the sorting areas106,108. For example, as illustrated inFIG.1, the operator interface176may be coupled with the first conveyor122between the first end portion146and the second end portion148thereof. As further illustrated inFIG.1, the operator interface176may be disposed on the first side164of the conveyor122. WhileFIG.1illustrates the operator interface176on the first side164of the conveyor122between the first and second end portions146,148thereof, it should be appreciated that any one or more operator interfaces176may be disposed on the first side164, on the second side166, at or about the first end portion146, at or about the second end portion148, between the first and second end portions146,148, or any combination thereof. The operator interface176may be capable of or configured to facilitate communication with or between one or more of the operators114,116,142,144. For example, the operator interface176may include a microphone, a push to talk intercom, or combinations thereof. The operator interface176may allow or facilitate communications with another operator via a respective operator interface (not shown) of another sorting area, such as the second sorting area108. For example, the operator interface176of the first sorting area106may include a push to talk intercom capable of providing communication between the operator142of the first sorting area106and the operator144of the second sorting area108via the respective operator interface (not shown) of the second sorting area108. In another example, the operator interface176of the first sorting area106may include a push to talk intercom capable of providing communication from the operator142of the first sorting area106to the operator144of the second sorting area108via the audio devices172,174. The operator interface176may also allow or facilitate communications with an operator or supervisor outside the system100for processing and sorting the delivery items. The operator interface176may also include volume controls to modulate or control the volume of the audio devices172,174. The operator interface176may be operably and/or communicably coupled with the computing system102, and configured to transmit electrical power, data, signals, or the like, or combinations thereof with the computing system102. For example, the operator interface176may be coupled with the computing system102(e.g., wirelessly and/or wired) and capable of or configured to transmit data or signals with the computing system102. In another example, the operator interface176may be capable of or configured to send and/or receive instructions, commands, and/or signals with the computing system102. In at least one implementation, the operator interface176may include one or more switches, input devices, or buttons, capable of or configured to send a command and/or a signal to the computing system102to facilitate and/or control the operation of the system100or one or more components thereof. In an exemplary operation of the system100with continued reference toFIG.1, the operator114,116designated to the intake area104may receive a delivery item from one of the sources of delivery items110,112, scan the respective indicia of the delivery item with the respective scanner118,120, and place or dispose the delivery item on the conveyor122at the first end portion146thereof. The scanner118,120may read the indicia and transmit data related to the indicia to the computing system102. The computing system102may receive the data from the scanner118,120and determine a respective or proper sort location138,139,140,141for the delivery item. For example, the computing system102may receive data from the scanner118,120and utilize the data from the scanner118,120to determine a respective ZIP code or delivery route or other information for the delivery item. The computing system102may then determine the proper sorting area106,108and/or the proper sort location138,139,140,141corresponding to the respective ZIP code or the respective delivery route for the delivery item. The computing system102may determine the respective ZIP code or delivery route for the delivery item by executing software, accessing the storage or machine-readable media that stores the software, accessing instructions for sorting, accessing a sort plan that provides data regarding respective sort locations138,139,140,141for the delivery item, or combinations thereof. As further described herein, the computing system102may then transmit signals, transmit instructions, or otherwise operate any one or more of the sorting locations106,108or components thereof to facilitate the disposition of the delivery item to the appropriate sort location138,139,140,141as determined by the sort plan, the software, or instructions for sorting. In at least one implementation, the computing system102may operate the indicator126of the first sorting area106to bring the attention of the operator142thereof to an incoming delivery item. For example, the computing system102may send instructions, signals, or commands to the indicator126and/or operate the indicator126to illuminate the area158disposed in the first end portion146of the first conveyor122to bring the attention of the operator142to the incoming delivery item. The delivery item disposed on the conveyor122may move from the first end portion146thereof towards the second end portion148thereof. As the delivery item moves along the first conveyor122, the indicator126may maintain constant illumination of the delivery item to facilitate tracking of the delivery item by the operator142. The computing system102may also send signals, commands or instructions to the indicator126to illuminate the proper sort location138,139for the delivery item. For example, the computing system102may illuminate any one of the sort locations138,139of the first sorting area106to indicate to the operator142thereof of the proper sort location138,139for the delivery item. It should be appreciated that if the proper sort location138,139,140,141is located in the second sorting area108, the computing system102may not illuminate any of the sort locations138,139of the first sorting area106, thereby instructing the operator142to allow the delivery item to move to the conveyor124of the second sorting location108. In response to the indicator126, the operator142may place the delivery item in the proper sort location138,139designated by the indicator126. As the delivery item moves along the conveyors122,124, the one or more sensors130,132,134,136thereof may detect the presence or absence of the delivery item at one or more predetermined locations along the respective conveyors122,124, and transmit the data or information regarding the presence or absence of the delivery item to the computing system102. For example, as illustrated inFIG.1, the first sensor130may determine when the delivery item is present or absent at the first end portion146of the first conveyor122, and may further communicate that information or data to the computing system102. Similarly, the second sensor132may determine if and/or when the delivery item is present or absent at the second end portion148of the first conveyor122, and may further communicate that information or data to the computing system102. The computing system102may receive the information regarding the presence or absence of the delivery item from the first and/or second sensors130,132and utilize the information to operate one or more components and/or functions of the system100. For example, the computing system102may be capable of or configured to determine the exact or approximate location of the delivery item along the respective conveyor122,124by utilizing the rate or speed of the conveyor122,124and the data (e.g., presence and/or absence) from the first and/or second sensors130,132,134,136. The computing system102may also be capable of or configured to determine when or if the delivery item is incorrectly sorted. For example, the computing system102may determine that the delivery item was incorrectly sorted when the second sensor132at the second end portion or outlet148of the first conveyor122indicates the presence of a delivery item that should have been sorted in one of the sort locations138,139of the first sorting area106. Similarly, the computing system102may determine that the delivery item was incorrectly sorted when the second sensor132at the second end portion or outlet148and/or the first sensor134at the first end portion or inlet150of the second conveyor124does not indicate the presence of the delivery item that should have been sorted in one of the sort locations140,141of the second sorting area108. In at least one implementation, the computing system102may alert any operator114,116,142,144of the system100of an incorrectly sorted delivery item. For example, the computing system102may indicate an incorrectly sorted delivery item by operating any one or more of the indicators126,128of the sorting areas106,108. For example, upon determining that the delivery item was incorrectly sorted, the computing system102may strobe or flash any one or more of the indicators126,128to alert or communicate with the operators114,116,142,144that the delivery item was incorrectly sorted. In at least one implementation, the computing system102may operate one or more components of the system100to facilitate the correction of the incorrectly sorted delivery item. For example, upon determining that the delivery item was incorrectly sorted, the computing system102may send signals, commands or instructions to any one or more of the conveyors122,124to reduce the rate of, reverse movement, or stop the conveyors122,124and thereby allow the operators142,144sufficient time to correctly sort the delivery item to the proper sort location138,139,140,141. FIG.2illustrates a schematic diagram of another exemplary system200for processing and sorting a plurality of delivery items, according to one or more implementations. The system200may be similar in some respects to the system100described above and therefore may be best understood with reference to the description ofFIG.1where like numerals may designate like components and will not be described again in detail. The system200may include one or more roller-tables (two are shown202,204) operably coupled with and/or forming a portion of any one of the sorting areas106,108. For example, as illustrated inFIG.2, a first roller-table202may be incorporated with the second sorting area108. As illustrated inFIG.2, one of the sorting locations140,141of the second sorting area108may be or may be replaced with a roller-table202. In another example, a second roller-table204may be disposed proximal or adjacent to the second sorting area108. Particularly, the second roller-table204may be disposed adjacent to the second end portion or output152of the conveyor124of the second sorting area108. In at least one implementation, one or more sort locations208,210may be disposed proximal or adjacent the one or more roller-tables202,204. For example, as illustrated inFIG.2, two sort locations208,210may be disposed adjacent the first roller-table202. In at least one implementation, an operator206may be associated with the one or more of the roller-table202,204and/or the sort locations208,210. For example, the operator206may be associated with, responsible for, or assigned to the first roller-table202and the sort locations208,210disposed adjacent thereto. In another implementation, no operator may be associated with one or more of the roller-tables202,204. For example, no operator is associated with or assigned to the second roller-table204. It should be appreciated that the second roller-table204may be capable of or configured to receive and store delivery items that are not able to be stored in any one or more of the sort locations138,139,140,141,208,210. For example, the second roller-table304may be capable of or configured to receive and store oversized delivery items (e.g., golf clubs, skis, etc.) that may not properly fit in any one or more of the sort locations138,139,140,141,208,210. In at least one example, the second roller-table204may be capable of or configured to receive and store delivery items for subsequent sorting, such as sorting in another system. It should be appreciated that utilizing any of the roller-tables202,204for storage of the delivery items will preserve the order of the delivery items. As such, in operation, an operator may scan the first delivery item (i.e., delivery item at the end of the roller-table202,204), the system100or one or more components thereof may then determine the proper location for the delivery item, and the system100or one or more components thereof may indicate the proper location to the operator. It should be appreciated that any one or more of the roller-tables202,204may include one or more sensors, similar to the sensors130,132,134,136discussed above, capable of or configured to determine when a delivery item is present and/or absent along one or more predetermined positions of the roller-table202,204. As such, it should be appreciated that the computing system102may be capable of or configured to determine if and/or when the roller-tables202,204are full. For example, the roller-tables202,204may include a sensor (not shown) at (e.g., first and/or second end portion) an inlet and/or an outlet thereof. FIG.3illustrates a schematic diagram of another exemplary system300for processing and sorting a plurality of delivery items, according to one or more implementations. The system300may be similar in some respects to the system100described above and therefore may be best understood with reference to the description ofFIG.1where like numerals may designate like components and will not be described again in detail. The system300may include the computing system102, an intake area302, and two sorting areas106,108operably and/or communicably coupled with one another. The first and second sorting areas106,108may both be directly operably and/or communicably coupled with the intake area302and capable of receiving the delivery items directly therefrom. For example, as illustrated inFIG.3, the first sorting area106may be disposed adjacent the intake area302such that the first end portion or inlet146of the conveyor122is disposed proximal or adjacent to the intake area302. As further illustrated inFIG.3, the second sorting area108may be disposed adjacent the intake area302such that the first end portion or inlet150of the conveyor124is disposed proximal or adjacent to the intake area302. The intake area302may include two sources of delivery items (two are shown304,306) and one or more operators (four are shown308,310,312,314) associated with one or more of the sources of delivery items304,306. For example, as illustrated inFIG.3, at least two of the operators308,310may be associated with a first source of delivery items304, and at least two of the operators312,314may be associated with a second source of delivery items306. The intake area302may also include a dedicated scanner316(e.g., PASS cart scanner) capable of or configured to scan or otherwise read respective indicia of each of the delivery items. The scanner316may be operably and/or communicably coupled with the computing system102via a wired or wireless connection. It should be appreciated that the dedicated scanner316may be utilized in lieu of or may be utilized in combination with the scanners118,120previously discussed with respect toFIG.1. In an exemplary operation of the system300with continued reference toFIG.3, the operators308,310,312,314designated to the intake area302may receive a delivery item from one of the sources of delivery items304,306, scan the respective indicia of the delivery item with the dedicated scanner316, and directly place or dispose the delivery item on the conveyor122of the first sorting area106or the conveyor124of the second sorting area108. It should be appreciated that directly coupling the first and second sorting areas106,108to the intake area302may increase the efficiency and/or productivity of sorting the delivery items by reducing the travel distance and/or time for the delivery items. For example, the delivery items may be placed directly on the proper conveyor without traveling along a series of conveyors before reaching the proper conveyor. In at least one implementation, any one or more of the systems100,200,300disclosed herein may include one or more accumulator areas318capable of or configured to receive one or more delivery items and store the delivery items for later or subsequent sorting. For example, as illustrated inFIG.3, the system300may include an accumulator area318operably and/or communicably coupled with the first sorting area106. WhileFIG.3illustrates the accumulator area318as being operably and/or communicably coupled with the first sorting area106, it should be appreciated that the accumulator area318may be directly or indirectly coupled with any component or portion of the system300. For example, the accumulator area318may be operably and/or communicably coupled with the intake area302, the second sorting area108, or combinations thereof. The accumulator area318may include one or more conveyors (one is shown320) capable of or configured to receive and store the delivery items for later or subsequent sorting. The accumulator area318may also include one or more sensors (two are shown322,324) coupled with or otherwise disposed on or about the conveyor320. For example, as illustrated inFIG.1, a first sensor (e.g., photoelectric sensor)322may be disposed in or proximal a first end portion326of the conveyor320, and a second sensor324may be disposed in or proximal a second end portion328of the conveyor320. The sensors322,324may be operably and/or communicably coupled with the computing system102and configured to send data and/or signals thereto related to the presence and/or absence of a delivery item along the conveyor320. As discussed above, the accumulator area318may be capable of or configured to receive one or more delivery items and store the delivery items for later or subsequent sorting. In an exemplary operation of the accumulator area318with continued reference toFIG.3, a delivery item to be stored at the accumulator area318may be delivered to the conveyor320at the first end portion326thereof. The conveyors320may receive the deliver item from the intake area302or any one of the sorting areas106,108. For example, as illustrated inFIG.1, the conveyor320may receive the delivery item from the first sorting area106disposed upstream thereof. The delivery item at the first end portion326of the conveyor320may be detected by the first sensor130, and the first sensor130may send a signal to the computing system102to communicate the presence of the delivery item. In response, the computing system102may transmit a signal or command to the conveyor320to move the delivery item towards the second end portion328thereof. When the first sensor322does not indicate the presence or indicates the absence of the delivery item, the first sensor322may send a signal to the computing system102to communicate the absence of the delivery item at the first end portion326of the conveyor320, and the computing system102may send or transmit a signal or command to the conveyor320to stop the movement of the delivery item towards the second end portion328thereof. This process may be repeated until the second sensor324at the second end portion328of the conveyor320detects the presence of the delivery item (e.g., the first delivery item), which may indicate that the conveyor320is full and may not receive any additional delivery items. In at least one implementation, the accumulator area318may include one or more operators (not shown), one or more sort locations (not shown), or combinations thereof. For example, the accumulator318may include one or more sort locations and any number of operators assigned to the sort locations. It should be appreciated that any one of the sorting areas106,108may also be utilized or converted to an accumulator areas318 In at least one implementation, any one or more of the systems100,200,300disclosed herein may be modular such that the components of any one or more of the systems100,200,300disclosed herein may be disposed in various configurations or arrangements, as illustrated inFIGS.1-3. For example, any one or more of the sorting areas106,108may be disposed proximal or adjacent to any one or more of the roller-tables202,204, any one or more of the intake areas104,302, any one or more of the accumulator areas318, or combinations thereof. Similarly, any one or more of the roller-tables202,204may be disposed proximal or adjacent to any one or more of the intake areas104,302, any one or more of the accumulator areas318, or combinations thereof. In yet another example, any one or more of the accumulator areas318may be disposed proximal or adjacent to any one or more of the sorting areas106,108, any one or more of the roller-tables202,204, any one or more of the intake areas104,302, or combinations thereof. In at least one implementation, the computing system102may be capable of or configured to determine the particular configuration or arrangement of the components of the systems100,200,300. For example, in operation with reference toFIG.1, the system100may be arranged such that the sorting areas106,108are in series. To determine the particular configuration of the system100, a test delivery item could be placed on the first conveyor122. The test delivery item may move along the conveyor122from the first end portion or inlet146toward the second end portion or outlet148. As the test delivery item moves along the conveyor122, one or more of the sensors130,132,134,136may detect the presence of the test delivery item and communicate the presence of the test delivery item to the computing system102. The computing system102may then utilize the information/data from the sensors130,132,134,136and/or the order in which it received the information/data to determine a particular order and/or arrangement of the sorting areas106,108. For example, with reference toFIG.1, as the test delivery item moves along the conveyors122,124of the first and second sorting areas106,108, the computing system102may receive signals of the presence of the test delivery item from each of the sensors130,132,134,136, and utilize the order in which the computing system102received the signals to determine the particular order and/or arrangement of the components of the system100. It should be appreciated that the ability of the computing system102to determine a particular order and/or arrangement of the sorting areas106,108allows any one or more of the conveyors122,124to be easily replaced (e.g., during repair operations) with a spare conveyor to restore the system100. It should be appreciated that various implementations of the systems100,200,300disclosed herein may improve and solve problems associated with conventional manual sorting and/or processing of delivery items. For example, the various implementations of the systems100,200,300disclosed herein may automatically read and process information from respective indicia of each of the delivery items, thereby reducing or eliminating human delay and/or error. In another example, the various implementations of the systems100,200,300disclosed herein may automatically determine and designate the proper sort location138,139,140,141in which a delivery item should be disposed, thereby reducing or eliminating human error and/or increasing efficiency for sorting the delivery items. The present disclosure has been described with reference to exemplary implementations. Although a limited number of implementations have been shown and described, it will be appreciated by those skilled in the art that changes may be made in these implementations without departing from the principles and spirit of the preceding detailed description. It is intended that the present disclosure be construed as including all such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof. | 56,882 |
11858007 | DESCRIPTION OF EMBODIMENT An embodiment of the present disclosure will be described with reference to the drawings. FIG.1shows a side cross-sectional view showing a simplified inner structure of an optical granular matter sorter1.FIG.2shows a control block of the optical granular matter sorter. The optical granular matter sorter1has a granular matter supply unit at the top thereof, the granular matter supply unit including a tank2and a vibrating feeder3. An inclined chute4having a predetermined width is disposed below the granular matter supply unit. Granular matters supplied from the granular matter supply unit are spread over the entire width of the inclined chute4and continuously flow down by gravity, and then are thrown into the air along a predetermined falling trajectory from the lower end of the inclined chute4. At least a pair of optical detecting devices5aand5bare disposed in front of and behind the predetermined falling trajectory so as to face each other. The optical detecting devices5aand5bcapture images of the granular matters at a granular matter detection position O that linearly extends in parallel with the width direction of the inclined chute4. The optical detecting devices5aand5binclude imaging units51aand51b, such as CCD cameras including CCD line sensors, illuminating units52aand52bimplemented by an LED or the like, and background units53aand53bthat serve as a background when imaging the granular matters, respectively, for example. In addition, an air ejecting device7that removes defective granular matters, foreign matters, or the like (hereinafter referred to as “defective granular matters or the like”) with ejected air is disposed below the granular matter detection position O. The air ejecting device7includes an air ejecting nozzle71including a plurality of piezoelectric valves which will be described later arranged in parallel with each other, a driving device72that opens and closes the piezoelectric valves included in the air ejecting nozzle71, and a compressed air supplying device73that supplies compressed air to the air ejecting nozzle71. Based on the detection result from each of the optical detecting devices5aand5b, the air ejecting device7selectively drives the piezoelectric valves to open, and blows off the granular matters thrown from the lower end of the inclined chute4by ejecting air from the plurality of nozzle holes of the air ejecting nozzle71arranged in correspondence to the respective positions of falling trajectories of the granular matters in the width direction. Note that the piezoelectric element of the piezoelectric valve is electrically connected to a driving circuit of the driving device72. In the optical granular matter sorter1described above, the granular matters spread over the inclined chute4in the width direction, continuously flown down by gravity, and then thrown into the air along the predetermined falling trajectory from the lower end of the inclined chute4are imaged at the granular matter detection position O by the imaging units51aand51bof the optical detecting devices5aand5b. The imaging data is transmitted to a control device6. The control device6specifies a granular matter to be removed, such as a defective granular matter, based on the imaging data. The control device6acquires information concerning the size of the granular matter, information concerning the size of a defect of the granular matter, or the like, and transmits a signal for removal of the defective granular matter or the like to the driving device72. Based on the signal for removal transmitted to the driving device72, the air ejecting device7selectively drives the plurality of piezoelectric valves at a predetermined time. The air ejecting device7ejects air to the defective granular matters or the like that pass through a granular matter removal position E that linearly extends in parallel with the width direction of the inclined chute4from the nozzle holes of the air ejecting nozzle71provided in correspondence to the respective positions in the width direction. The defective granular matters or the like blown off by the ejected air from the respective nozzle holes of the air ejecting nozzle71are discharged to the outside through a defective granular matter discharge port81. The non-defective granular matters or the like that have passed along the predetermined falling trajectory without being blown off the ejected air are collected through a non-defective granular matter discharge port82. In an embodiment of the present disclosure, the control device6has a comparing unit61that compares a defect detection time t for imaging data and a single-granular matter passage set time t1set in advance, and a calculating unit62that calculates an air ejection time based on a comparison result obtained by the comparing unit61. Herein, the single-granular matter passage set time t1corresponds to a time (a single-granular matter passage time) detected when a single granular matter passes (falls down) through the granular matter detection position O, and can be set in advance in accordance with the target to be sorted. In an embodiment of the present disclosure, in a case in which the defect detection time t is shorter than or equal to the single-granular matter passage set time t1(t≤t1) as a result of the comparison between the defect detection time t and the single-granular matter passage set time t1in the comparing unit61, a defect-including granular matter is regarded as a single granular matter. In a case in which the defect detection time t exceeds the single-granular matter passage set time t1(t>t1), the defect-including granular matter shall be regarded as multiple granular matters. Then, the calculating unit62multiplies the defect detection time t by coefficients different between the case of regarding the defect-including granular matter as a single granular matter and the case of regarding the defect-including granular matter as multiple granular matters to calculate air ejection times. The control device6transmits the signal for removal of defective granular matters or the like to the driving device72based on the result of calculation obtained by the calculating unit62to control the time and the like for ejecting air from the air ejecting device7. FIG.3shows a waveform graph of an output signal of imaging data of the imaging units in the optical detecting device. The control device6compares the output signal of imaging data in the imaging units51aand51bwith a threshold value to detect a defective portion, and acquires the defect detection time t. Herein, in an embodiment of the present disclosure, the defect means, for example, a defective portion (including the entirety) such as damaged grains, dead rice, colored grains, or immature grains in a case in which the granular matters are rice grains. In a case of a foreign matter, the defect means the entirety thereof. In an embodiment of the present disclosure, in the case of regarding the defect-including granular matter as a single granular matter as a result of the comparison obtained by the comparing unit61, the control device6multiplies the defect detection time t by, for example, a coefficient of more than or equal to 0.5 and less than 1.0, preferably a coefficient of more than or equal to 0.6 and less than 0.8, and more preferably a coefficient of approximately 0.7 in the calculating unit62to calculate the air ejection time. In the case of regarding the defect-including granular matter as multiple granular matters as a result of the comparison obtained by the comparing unit61, the control device6multiplies the defect detection time t by a coefficient of, for example, more than or equal to 1.0 and less than 1.5, preferably a coefficient of 1.0, which is larger than that in the case of regarding the defect-including granular matter as a single granular matter, in the calculating unit62to calculate the air ejection time. In the case of regarding the defect-including granular matter as a single granular matter as a result of the comparison obtained by the comparing unit61, by multiplying the defect detection time t by, for example, a coefficient of more than or equal to 0.5 and less than 1.0, preferably a coefficient of more than or equal to 0.6 and less than 0.8, and more preferably a coefficient of approximately 0.7 in the calculating unit62to calculate the air ejection time, the ratio of the air ejection time to the defect detection time t is reduced. Thus, the proportion of non-defective granular matters blown off collaterally with defective granular matters or the like when blowing off the defective granular matters or the like can be reduced. In addition, the amount of air consumption can be reduced. In addition, in the case of regarding the defect-including granular matter as multiple granular matters as a result of the comparison obtained by the comparing unit61, by multiplying the defect detection time t by, for example, a coefficient of more than or equal to 1.0 and less than 1.5, and preferably a coefficient of 1.0, which is larger than in the case of regarding the defect-including granular matter as a single granular matter, in the calculating unit62to calculate the air ejection time, the ratio of the air ejection time to the defect detection time t is increased to ensure the air ejection time. Thus, even in a case in which a plurality of defective granular matters or the like fall down in a state overlapping one another, all the defective granular matters or the like can be blown off. In an embodiment of the present disclosure, in the case of regarding the defect-including granular matter as a single granular matter as a result of the comparison obtained by the comparing unit61, the control device6further compares in the comparing unit61a calculated value calculated by multiplying the defect detection time t by the coefficient for the case of regarding the defect-including granular matter as a single granular matter and a minimum ejection set time t2which is shorter than the single-granular matter passage set time t1and set in advance, and in a case in which the calculated value is less than the minimum ejection set time t2, the minimum ejection set time t2can be determined as the ejection time. Herein, the minimum ejection set time t2is the minimum air ejection time that enables granular matters to be blown off, and can be set in advance in accordance with the target to be sorted. By configuring the comparing unit61to compare the calculated value and the minimum ejection set time t2which is shorter than the single-granular matter passage set time t1and set in advance, and in the case in which the calculated value is less than the minimum ejection set time t2, determine the minimum ejection set time t2as the ejection time, the minimum air ejection time required to blow off the granular matters can be ensured even in a case in which the defect of the defective granular matters or the like is small. This enables the defective granular matters or the like to be blown off reliably. In an embodiment of the present disclosure, in the case of regarding the defect-including granular matter as a single granular matter as a result of the comparison obtained by the comparing unit61, the control device6is configured to further compare, in the comparing unit61, the calculated value calculated by multiplying the defect detection time t by the coefficient for the case of regarding the defect-including granular matter as a single granular matter and the minimum ejection set time t2which is shorter than the single-granular matter passage set time t1and set in advance. However, in the comparing unit61, the calculated value calculated by multiplying the defect detection time t by the coefficient for the case of regarding the defect-including granular matter as a single granular matter and the minimum ejection set time t2can be compared at a stage before comparing the defect detection time t and the single-granular matter passage set time t1. In that case, in a case in which the calculated value calculated by multiplying the defect detection time t by the coefficient for the case of regarding the defect-including granular matter as a single granular matter is longer than the minimum ejection set time t2, the defect detection time t and the single-granular matter passage set time t1are compared, and the defect detection time t is multiplied by a predetermined coefficient to calculate the air ejection time. FIG.4is a schematic explanatory diagram showing air ejection characteristics of a solenoid valve and a piezoelectric valve for comparison. InFIG.4, the upper diagram shows ON/OFF of an air ejection signal for driving the valve included in the air ejecting nozzle to open/close (in the case of the driving device72, an input signal to the driving circuit for displacing the piezoelectric element by expansion/contraction), while the lower diagram shows an example of an air ejection pressure associated with opening/closing of the valve. As shown inFIG.4, in the case of the solenoid valve, there is a large delay in rising/falling of the air ejection pressure in response to ON/OFF of the air ejection signal, whereas in the case of the piezoelectric valve, there is little delay in rising/falling of the air ejection pressure, and the piezoelectric valve is significantly superior to the solenoid valve in responsivity when opening/closing the valve. Note thatFIG.4shows a valve open time (air ejection signal ON time) c, an air ejection time a for the solenoid valve during which an air ejection pressure is more than or equal to p at which defective granular matters or the like can be removed reliably, and an air ejection time b for the piezoelectric valve during which the air ejection pressure is more than or equal to p. FIG.5shows an example of response performance of the solenoid valve and the piezoelectric valve for comparison, and shows a table in which the respective air ejection times a, b and the valve open time c inFIG.4are compared. As shown inFIG.5, in the case of the solenoid valve, the valve open time c is 0.50 (ms) to 1.00 (ms), and the air ejection time a is 0.18 (ms) to 0.75 (ms). As the valve open time c is shorter, the proportion of the air ejection time a to the valve open time c decreases. When the valve open time c is less than or equal to 0.45 (ms), the air ejection time a is zero. On the other hand, in the case of the piezoelectric valve, the valve open time c is 0.35 (ms) to 1.00 (ms), and the air ejection time b is 0.32 (ms) to 1.00 (ms). The valve open time c and the air ejection time b substantially agree to each other. In the example shown inFIG.5, the piezoelectric valve can ensure a time for removal of defective granular matters or the like which is substantially the same degree as in the solenoid valve with a valve open time approximately 0.5 to 0.8 times that of the solenoid valve. The above-described optical granular matter sorter1includes the air ejecting nozzle in which the piezoelectric valve is utilized, and supply of air can be stabilized promptly. This enables granular matters to be sorted more stably in cooperation with good responsivity when opening the valve. In the above-described optical granular matter sorter, granular matters targeted for sorting are representatively cereal grains, in particular, rice grains, but are not necessarily limited to cereal grains. The target may be anything that has a size and mass that can be blown off with ejected air. The piezoelectric valve will now be described. FIG.6is a schematic explanatory diagram of the piezoelectric valve in a state in which a side surface of a valve main body is opened, showing the side surface when the valve is closed. The piezoelectric valve9includes a valve main body91, a valve body92, a piezoelectric element93, displacement enlarging mechanisms94, and a driving device95. The valve main body91has a gas pressure chamber911that receives a compressed gas supplied from an external compressed gas supply source (not shown), and a gas discharge channel912that ejects the gas in the gas pressure chamber911to the outside. The valve body92is disposed in the gas pressure chamber911in the valve main body91, and opens and closes the gas discharge channel912. The piezoelectric element93is disposed in the valve main body91, and has one end fixed to the valve main body91. The displacement enlarging mechanisms94are disposed in the gas pressure chamber911in the valve main body91, and enlarge displacement of the piezoelectric element93so as to be acted on the valve body92. The driving device95includes a charging driving circuit that applies a driving voltage to the piezoelectric element93to store electric charge to expand the piezoelectric element93, and a discharging driving circuit that discharges the stored electric charge to contract the piezoelectric element93. The driving device95displaces the piezoelectric element93by expansion and contraction, thereby driving the valve body92to open and close. Note that the driving device95may be any driving device in which both the driving circuits are electrically connected to the piezoelectric element, and does not always have to be physically integrated with the valve main body91, for example. The displacement enlarging mechanisms94are a pair of displacement enlarging mechanisms that are disposed symmetrically with respect to a line that connects the longitudinal axis of the piezoelectric element93and the gas discharge channel912(hereinafter referred to as a “center line”). A first displacement enlarging mechanism includes a first hinge96a, a second hinge97a, a first arm member98a, and a first leaf spring99a. The first hinge96ahas one end coupled to the valve main body91. The second hinge97ahas one end coupled to a cap member931attached to the piezoelectric element93. The first hinge96aand the second hinge97ahave the other ends coupled to a base part of the first arm member98a. The first leaf spring99ahas one end coupled to an outer leading end portion of the first arm member98a. The first leaf spring99ahas the other end coupled to one side end part of the valve body92. On the other hand, a second displacement enlarging mechanism includes a third hinge96b, a fourth hinge97b, a second arm member98b, and a second leaf spring99b. The third hinge96bhas one end coupled to the valve main body91. The fourth hinge97bhas one end coupled to the cap member931attached to the piezoelectric element93. The third hinge96band the fourth hinge97bhave the other ends coupled to a base part of the second arm member98b. The second leaf spring99bhas one end coupled to an outer leading end portion of the second arm member98b. The second leaf spring99bhas the other end coupled to the other side end part of the valve body92. In the piezoelectric valve9, when the driving device95applies a voltage to the piezoelectric element93in the state ofFIG.6, the piezoelectric element93expands in the rightward direction in the drawing. The first displacement enlarging mechanism enlarges a displacement of the piezoelectric element93through expansion by the principle of leverage with the second hinge97aserving as a point of power, the first hinge96aserving as a fulcrum, and the leading end portion of the first arm member98aserving as a point of action, thereby largely displacing the outer leading end portion of the first arm member98a. Similarly, the second displacement enlarging mechanism enlarges a displacement of the piezoelectric element93through expansion by the principle of leverage with the fourth hinge97bserving as a point of power, the third hinge96bserving as a fulcrum, and the leading end portion of the second arm member98bserving as a point of action, thereby largely displacing the outer leading end portion of the second arm member98b. The displacements of the first arm member98aand the second arm member98bat the respective outer leading end portions cause the valve body92to separate from a valve seat951via the first leaf spring99aand the second leaf spring99b, thereby opening the gas discharge channel912. On the other hand, when application of the voltage to the above-described piezoelectric element93by the driving device95is canceled in the piezoelectric valve9, the piezoelectric element93contracts, and the contraction is transferred to the valve body92via the first and second displacement enlarging mechanisms, and the valve body92seats on the valve seat951. The structure of the above-described piezoelectric valve is not limited to that shown inFIG.6as long as the piezoelectric valve includes the valve main body having the gas pressure chamber that receives supply of a compressed gas from the compressed gas supply source and the gas discharge channel that ejects the gas in the gas pressure chamber to the outside, the valve body disposed in the gas pressure chamber and opening/closing the gas discharge channel, the piezoelectric element disposed in the valve main body, and having one end fixed to the valve main body, and the displacement enlarging mechanisms disposed in the gas pressure chamber and enlarging displacements of the piezoelectric element so as to be acted on the valve body. The optical granular matter sorter in the above-described embodiment of the present disclosure includes the air ejecting nozzle71including the piezoelectric valve having excellent responsivity when opening/closing the valve, but may include the air ejecting nozzle71including a solenoid valve instead of the piezoelectric valve. The present disclosure is not limited to the above embodiment, but can obviously be modified as appropriate in its configuration within the scope of the disclosure. INDUSTRIAL APPLICABILITY The optical granular matter sorter of the present disclosure is highly useful in that the proportion of non-defective granular matters blown off collaterally with defective granular matters can be reduced, and even in a case in which a plurality of defective granular matters or the like fall down in a state overlapping one another, all the defective granular matters or the like can be blown off. REFERENCE SIGNS LIST 1optical granular matter sorter4inclined chute5a,5boptical detecting device51a,51bCCD camera (imaging unit)6control device61comparing unit62calculating unit7air ejecting device71air ejecting nozzle72driving device73compressed air supplying device9piezoelectric valve91valve main body911gas pressure chamber912gas discharge channel92valve body93piezoelectric element94displacement enlarging mechanism95driving device951valve seat98a,98barm member99a,99bleaf springa air ejection time for solenoid valve during which air ejection pressure is more than or equal to pb air ejection time for piezoelectric valve during which air ejection pressure is more than or equal to pc valve open time (air ejection signal ON time)p air ejection pressure at which defective granular matters or the like can be removed reliablyt defect detection time | 23,079 |
11858008 | DETAILED DESCRIPTION The present application relates to particle sorting systems that include a monitoring system downstream of a particle separator or sorter. The particle sorting system utilizes a sort delay to determine when to actuate the separator to perform a sort operation to sort a particle of interest. The sort delay represents the time between when the expected sortable unit containing one or more particles of interest is interrogated and the time when the actual sortable unit predicted to contain the one or more particles of interest is in position to be sorted by the sorter or separator. When the sort delay value is set properly, there are a countable number of non-targeted sortable units that are adjacent in time (succeeding or preceding) to targeted sortable units that contain or are predicted to contain particles of interest. The monitoring system is used to determine the proper drop delay parameter for the sorter. In some embodiments, the proper drop delay parameter may be determined by the monitoring system before the start of a sort operation. In some embodiments, the proper drop delay parameter may be determined by the monitoring system during a sort operation. In some systems and methods taught herein, sortable units (e.g., sortable fluid segments or droplets or expected droplets) are identified that are non-targeted, for example, that are expected to contain no particles of interest or, in some cases, no particles (i.e., empty), but that are positionally adjacent (i.e., either immediately before or after in sequence) to sortable units that are targeted, for example, that are predicted to contain one or more particles of interest. After the adjacent non-targeted sortable units and the targeted, particle-containing sortable units have been separated and sorted, optical measurements of the adjacent non-targeted sortable units are generated by the monitoring system to determine fluorescence emission resulting from the presence of particles, for example, particles of interest in the adjacent non-targeted sortable units. By measuring fluorescence emission of the adjacent non-targeted sortable units at a variety of sort delay settings, it is possible to determine the correct or proper sort delay. In some embodiments, adjacent non-targeted sortable units are presented for measurement by the monitoring system. In other words, sortable units that are not targeted and that are not adjacent to targeted sortable units are ignored and are not measured. The set of adjacent non-targeted sortable units provide a sensitive indicator of correct or proper sort delay because a particle that is predicted to be, but is not, in a targeted sortable unit most likely can be detected in an adjacent non-targeted sortable unit. The monitoring systems taught herein can monitor adjacent sortable units before, during, or after a sorting operation. The monitoring system provides feedback signals to a processing unit that can adjust operational parameters of the system based upon the signals. Operational parameters that can be adjusted affect sort delay and sort masks. The adjustment of operational parameters can occur in real time during a sort operation for a sample. Conventionally, operational parameters of particle sorting systems are calibrated in a separate initial step before a sample is placed into the system or by using an initial portion of the sample. This initial calibration occurs at one point in time whether before the sample is placed into the system (and using standard particles such as fluorescent polymer beads) or right after initial sample loading. In the event that beads or non-sample particles are used for calibration, introduction of foreign material into the system could impact the final sorted product, particularly if the experimenter uses the calibration particles in situ to calibrate the system during sample sorting rather than as a separate step. Moreover, exchanging the standard control for the desired sample to be sorted after calibration is complete can potentially introduce changes to the system that introduce a degree of instability in the system. When using an initial portion of the sample itself for calibration, the initial portion must usually be discarded as having unreliable levels of purity, and this is undesirable particularly for valuable samples. In some conventional droplet-sorter systems, the sorting delay is calibrated by determining the stream velocity using strobed imaging that is timed to coincide with droplet formation and measures an undulation wavelength of the stream. In systems that use strobed imaging, precision light sources and imaging detectors that operate at high frequency can be expensive and can require rapid image analysis of detector frames to determine the stream parameters. The systems and methods of the present disclosure overcome these issues in some embodiments by monitoring adjacent non-targeted sortable units in real-time as the sample itself is being sorted. The ability to self-calibrate during processing of a sample avoids the potential for contamination with foreign material, avoids the need to change fluidic connections or control samples after calibration, avoids or reduces wasted sample, and enables continuous calibration throughout a sort operation rather than at only a single point in time before sorting begins. The monitoring of adjacent non-targeted sortable units can be done without strobed imaging, which results in high precision at lower operating cost and system complexity. Real-time adjustment also enables the system to react to changes that may occur in the sample over time such as settling or changes in fluid content or viscosity that can alter the number of particles per second that pass through the device. Systems and methods described herein also provide the ability to calibrate operational parameters such as sort delay while maintaining high throughput rates. This advantage derives from several improvements over conventional systems. First, the ability to calibrate operational parameters in real time during particle sorting means that a user does not need to stop sorting particles to perform a separate calibration operation, thus leading to greater throughput over multiple samples over time. The time savings can be substantial, particularly over a conventional method of calibration that requires obtaining sorted aliquots on microscope slides at different values of operating parameters and comparing expected counts with actual counts of particles observed under a microscope. To create these sorted aliquots, it is necessary to reduce particle input rates by orders of magnitude to reduce the probability of a sortable unit containing multiple particles. The change in sample rates can cause instability in the system and may not be directly relatable to operation at high sort rates. Systems and methods described herein can perform adjustment or calibration of operating parameters in real time while operating at high throughput values, which avoids the need to slow down the system for calibration or to take time to prepare and observe microscope slides. Systems and methods described herein provide improvements over other conventional methods of calibration as well. Some conventional systems utilize precise measurement of distance using either manual observation or an imaging system (camera) to measure the distance between the laser/stream intersection and the first free droplet. These systems can also measure the apparent wavelength of the stream undulations (as observed with strobe illumination at the same frequency and phase-locked with droplet generation). The wavelength measurement provides a method to determine stream velocity and therefore time of flight of a particle from the laser intersection to the first free droplet. Another approach used by some conventional systems is to use a calibration particle that can be either added to the sample or run as an independent sample suspension. The sorter can then be programmed to sort all calibration particles. A detector can be used to detect particles in a deflected stream. Delay can be adjusted until the measurement in the deflected stream indicates all particles are sorted (e.g., the delay setting that creates the brightest camera image). In still other conventional systems, an illumination laser is used to illuminate the stream for the purpose of measuring sort delay. The laser is strobed at the same frequency as droplet generation. The first detached droplet along with the adjacent droplets are observed using an imaging system, and sort delay is adjusted until all of the fluorescing particles fall into the correct droplet. These conventional techniques have in common the use of high precision instrumentation, standard calibration particles, and high accuracy timing systems that can be expensive to maintain and can require precise alignment. Systems and methods described herein improve adjustment of operational parameters by using the actual sorted particles of interest to measure the delay (e.g., no contamination with latex particles) and avoiding the use of strobed imaging. The systems and methods described herein that measure adjacent non-targeted sortable units provide a very sensitive measurement of sort delay error, can be used during production sorting, and do not require the interruption of production sorting for calibration purposes. Systems and methods described herein can be used to measure the sorting error rate and to test the efficacy of sort masks or sort windows applied to improve sorting outcomes such as sample purity. When a particle flowing in a fluid stream is close to the boundary between expected sortable units, there is uncertainty as to which actual sortable unit (on either side of the boundary) ultimately contains the particle. A sort mask or sort window causes the sort logic to reject (i.e., fail to sort) particles that fall near the boundary between expected sortable units. Signals from the monitoring device can be used to determine the sorting error rate in some embodiments. Similarly, signals from the monitoring device can be used to tune the width of such a sort mask or sort window by measuring the rate of particle-droplet correlation error. For example, when the error is high, a low purity sort is possible. The ability for systems and methods taught herein to accurately tune a purity mask while actively sorting a sample enables optimized particle recovery and purity levels. As used herein, a “sortable unit” is a unit of fluid flowing within a fluid stream in the systems taught herein. A “sortable fluid segment” is a sortable unit of fluid that forms part of a continuous stream. A “droplet” is a sortable unit of fluid that forms part of a discretized stream. In other words, a “sortable fluid segment” shares a fluidic boundary with at least one neighboring sortable fluid segment while a “droplet” does not share a fluidic boundary with a neighboring droplet. “Droplet” is commonly associated with sortable units downstream of a sorter in jet-in-air type particle sorters where the units of fluid are suspended in air. “Sortable fluid segment” is commonly associated with expected sortable units upstream of the sorter in jet-in-air and on-chip systems as well as with sortable units downstream of the sorter in on-chip systems. An “expected sortable unit” is a volume of fluid (i.e., a sortable fluid segment) upstream of a sorter or separator in the system that is predicted or expected to correspond to a resulting sortable unit downstream of the sorter or separator. The expected sortable unit can be defined in some computational contexts as being associated with a time segment during which particles of interest are measured at an inspection zone of the system based on sort delay. As used herein, the term “particle” includes, but is not limited to, cells (e.g., blood platelets, white blood cells, tumor cells, embryonic cells, spermatozoa and other suitable cells), organelles, and multi-cellular organisms. Particles may include liposomes, proteoliposomes, yeast, bacteria, viruses, pollens, algae, or the like. Additionally, particles may include genetic material, biomolecules, RNA, DNA, proteins, or fragments thereof. Particles may be symmetrical or asymmetrical. Particles may also refer to non-biological particles. For example, particles may include metals, minerals, polymeric substances, glasses, paints, ceramics, composites, or the like. Particles may also refer to synthetic beads (e.g., polystyrene or latex), for example, beads provided with fluorochrome conjugated antibodies. As used herein, “sort delay” is defined as the electronic time delay taken by a computing device between the time that a sortable unit containing one or more detected particles enters the inspection zone and the execution of a sort operation for that sortable unit to account for the duration of time needed for the sortable unit containing the particle(s) to flow from the point of detection to the point where that sortable unit is separated from neighboring sortable units in the stream (e.g., the point of droplet breakoff in a jet-in-air system or the point where the sorter switches a volume of fluid to a new branch path in an on-chip system). In some embodiments, sort delay can be expressed in units of whole or partial periods of a droplet generation signal. In some embodiments, the sort delay is expressed to the nearest hundredth of a period (i.e., 0.01*clock period). If the sort delay is set improperly in a system, the system may execute sort operations too early (i.e., before the particle has arrived at the sorter, thus leaving one or more particles in a later-forming sortable unit) or too late (i.e., after the particle has passed through the sorter, thus leaving one or more of the particles in a prior-forming sortable unit), which results in incorrect sorting. In a given sorting operation, particles of interest are identified and sorted to isolate the particles of interest from those particles of an undesired type or possessing an undesired characteristic, fluids, debris, or other unwanted entities. As used herein, “non-targeted” sortable units are those sortable units that are predicted or anticipated to contain zero particles of interest based on the current drop delay setting. The non-targeted sortable units may contain zero or more particles of an undesired type or undesired characteristic, fluids, debris, or other entities. As used herein, “targeted” sortable units are those sortable units that are predicted or anticipated to contain one or more particles of interest based on the current drop delay setting. Cytometers or particle sorting systems can create sortable units and sort the sortable units into different pathways or buckets. Systems track specific particles of interest and to which expected sortable unit the particles of interest belong. The systems are usually time dependent such that a specific time segment is correlated to each expected sortable unit. One or more particles of interest may pass through the inspection zone during each time segment and are therefore identified as residing in the associated sortable unit. An expected sortable unit that correlates to a time segment during which one or more particles of interest were detected is a “targeted” sortable unit. An expected sortable unit that correlates to a time segment during which no particles of interest were detected is a “non-targeted” sortable unit. To test the accuracy of the correlation between time segments/expected sortable units and resulting actual sortable units (e.g., droplets), systems and methods of the present disclosure introduce a time variance from a nominal value of sort delay and then observe whether particles of interest intended for a specific targeted sortable unit actually show up in either the preceding adjacent non-targeted sortable unit or the following adjacent non-targeted sortable unit. Under proper operating conditions (e.g., proper values of sort delay meaning correct correlation between time segments/expected sortable units and the resulting actual sortable units), the non-targeted adjacent sortable units should contain no particles of interest. However, randomness associated with the sorting process can cause non-targeted sortable units to contain particles of interest on occasion. In some embodiments, systems and methods described herein can determine the optimal values of sort delay by adjusting the time segment forward and backward in time (i.e., changing sort delay values) while measuring adjacent, non-targeted sortable units until the number of measurements of particles of interest is reduced or minimized. FIG.1Aillustrates a particle sorting system10including a monitoring system205in accordance with certain aspects of this disclosure. In this example, the particle sorting system10is illustrated as a jet-in-air flow cytometer and the sortable units are often referred to as “droplets.” The particle sorting system10may include a particle delivery device12in the form of a jet-in-air flow cytometer sort head50, sometimes referred to as a sort head, for delivering two or more sortable units in a fluid stream including particles14to a detection system22and then to a separator34, which is sometimes referred to herein as a sorter. The separator34directs droplets of fluid, which may be empty or may contain particles, along two or more pathways77,79,81. A monitoring system205interrogates non-targeted droplets of fluid that were adjacent in sequence to targeted (e.g., containing particles of interest) droplets of fluid as described in greater detail below. A processing unit24operatively connected to the separator34and the monitoring system205can adjust a sort logic based upon the interrogation of the non-targeted adjacent droplets203. The particles14may be single cell organisms such as bacteria or individual cells in a fluid, such as various blood cells, sperm or nuclei derived from tissue. Depending on the application, the particles14may be stained with a variety of stains, probes, or markers selected to differentiate particles or particle characteristics. Some stains or markers will only bind to particular structures, while others, such as DNA/RNA dyes, may bind UY TM-2 stoichiometrically to nuclear DNA or RNA. Particles14may be stained with a fluorescent dye which emits fluorescence in response to an excitation source. As one non-limiting example, sperm may be stained with Hoechst 33342 which stoichiometrically binds to X-chromosomes and Y-chromosomes. U.S. Pat. No. 5,135,759 (Johnson et al.) and U.S. Pat. No. 7,758,811 (Durack et al.) describe methods for staining sperm, and each is incorporated herein by reference in its entirety. In oriented sperm, the relative quantity of Hoechst 33342 can be determined providing means for differentiating X-chromosome bearing sperm from Y-chromosome bearing sperm. Additionally, certain embodiments can work with DNA-sequence specific dyes or sex specific dyes. The sort head50may provide a means for delivering particles14to the detection system22and more specifically to the inspection zone16. Other particle delivery devices12are contemplated for use herein, such as fluidic channels as described below with respect toFIG.2. The sort head50may include a nozzle assembly62for forming a fluid stream64. The fluid stream64may be a coaxial fluid stream64having an inner stream66, referred to as a core stream, containing a sample54, and an outer stream70comprising sheath fluid56. The sample54may include the cells or particles of interest, as well as, biological fluids, and other extenders or components for preserving cells in vivo. The sample54may be connected to the nozzle assembly62through a sample inlet88into a nozzle body80having an upstream end82and a downstream end84. An injection needle90may be in fluid communication with the sample inlet88for delivering the inner stream66of the sample54centrally within the nozzle body80towards the downstream end84. The sheath fluid56may be supplied through a sheath inlet86at the upstream end82of the nozzle body80. The sheath fluid56may form an outer stream70which serves to hydrodynamically focus an inner stream66of sample54towards the downstream end84of the nozzle body80. In addition to the formation of the fluid stream64, the nozzle assembly62may serve to orient particles14in the sample54. The interior geometry of the nozzle body80, in combination with an orienting tip124, may subject particles, such as aspherical particles, to forces tending to bring them into similar orientations. Examples of interior nozzle body geometries for orienting particles are described in U.S. Pat. Nos. 6,263,745 and 6,782,768, both to Buchanan et al., each of which are incorporated herein by reference. The teachings of this disclosure are also contemplated for use with flow cytometers or other devices configured without orienting means, such as a conventional jet-in-air flow cytometers, or immersion lens flow cytometers, or such as a device described in U.S. Pat. No. 6,819,411, having radial collection or radial illumination means. In order to perform the function of separating particles, the nozzle assembly62may further include an oscillator72for breaking the fluid stream64into droplets74downstream of the inspection zone16at a break-off point. The oscillator72may include a piezoelectric crystal which perturbs the fluid stream64predictably in response to a drop drive signal78. InFIG.1A, the drop drive signal78is represented by the electrical connection to the oscillator72carrying the drop drive signal78. The waveform shape, phase, amplitude, and frequency of the drop drive signal may directly affect the shape and size of the droplets as well as the presence of satellites. The amplitude, shape, phase, or frequency of the drop drive signal78are operational parameters that may be modified during sorting in response to various other operational parameters, event parameters, or measurements. FIG.1Aprovides an enlarged view of the fluid stream64including the inner stream66and the outer stream70. The fluid stream64is illustrated as being divided into expected sortable fluid segments101,102,103that are expected to become actual sortable units, e.g., droplets. Some expected sortable fluid segments101contain particles14, which may be sperm cells150. The dimensions of any of the inner stream66, outer stream70, expected sortable fluid segments101,102,103, or particles14may not be illustrated to scale. The length of the fluid stream64included in each expected sortable fluid segment101,102,103depends on the frequency of the drop drive signal78and the flow velocity of the stream. In some embodiments, the expected sortable fluid segments101,102,103are mapped by the processing unit24(e.g., in a memory) as defined by some time segment or resolution relative to the drop drive clock period, for example, 0.01* the clock period. Similarly, the widths of the inner stream66and the outer stream70may be determined by the pressure at which sample54and sheath fluid are supplied to the nozzle body80, respectively. One expected sortable fluid segment101is illustrated substantially at the inspection zone16containing a particle14delivered by the particle delivery device12for inspection. Two additional expected sortable fluid segments101are illustrated containing single particles of interest, while one expected sortable fluid segment101is illustrated containing two particles of interest. Thus, expected sortable fluid segments101are targeted expected sortable fluid segments. Two other expected sortable fluid segments103are illustrated as empty, but these expected sortable fluid segments103are adjacent to at least one expected sortable fluid segment101that contains a particle. Thus, expected sortable fluid segments103are non-targeted adjacent expected sortable fluid segments. One expected sortable fluid segment102is illustrated as empty and not adjacent to a stream segment101that contains a particle. As such, the expected sortable fluid segments102are non-targeted, non-adjacent expected sortable units. To properly sort or separate droplets containing particles of interest (i.e., targeted) from those that do not (i.e., non-targeted), the timing of each particle measurement (coinciding with the transit of the particle through the inspection zone as described below) is correlated (e.g., by the processing unit24) with the passage of the specific expected sortable fluid segment that would become a free droplet. In other words, a prediction is made, at the time of measurement in the inspection zone, as to which free droplet each particle of interest would most likely be in. The presence of the prediction creates the targeted and non-targeted designations for the sortable units. The system10then applies the appropriate surface charge to each droplet (as described below) just before breakoff to cause the droplet to deflect according to a sort logic for sorting the particles. Upstream of the break-off point, the fluid stream64is continuous and the expected sortable fluid segments are constructs identified at the inspection zone16such that the fluid and contents of each expected sortable fluid segment is expected to correspond to a droplet downstream of the break-off point. Inaccuracies in the expected correspondence can arise because the expected sortable fluid segments must travel from the point of detection in the inspection zone16to the break-off point. The travel and break-off of the stream segments can depend upon random processes and upon operational parameters of the system and sort logic such as the drop delay time (which can be expressed in units of the droplet period for systems that produce droplets), the parameters of the drop drive signal78, the nozzle height parameters, the position of the inspection zone parameters along the stream, and other parameters. The operational parameters can be controlled to improve the prediction as to which droplet will eventually contain a particle detected at the inspection zone16. In the example ofFIGS.1A and1B, when a particle is identified in a targeted expected sortable fluid segment101, the system predicts that it will be located in a targeted droplet201downstream of the break-off point. If the prediction is ultimately incorrect, the cause will likely be that the particle has “slipped” into an adjacent non-targeted droplet203that had been predicted to be empty or, at least, to not contain a particle of interest. By measuring adjacent non-targeted droplets203in the monitoring system205, the accuracy of the initial prediction of particle location can be established and, if necessary, operational parameters of the system can be controlled to reduce the rate of incorrect predictions. By measuring adjacent non-targeted droplets203to calibrate the system in real-time, improvements can be realized in total sample recovery. Once a particle14, such as a stained particle, is delivered to the inspection zone16, it may be interrogated with an electromagnetic radiation source18. The electromagnetic radiation source18may be an arc lamp or a laser. As one non-limiting example, the electromagnetic radiation source18may be a pulsed laser emitting photons of radiation52at specified wavelengths. The wavelength of a pulsed laser may be selected based upon the particle characteristic of interest and may be selected to match an excitation wavelength of any stain or marker used to differentiate that characteristic. As a non-limiting example, a family of UV excitable dyes may be interrogated with a pulsed Vanguard Laser available from Newport Spectra-Physics and may have an emission wavelength of 355 nm and be operated at 175 mW. Particles14at the inspection zone16may produce a secondary electromagnetic radiation in the form of emitted (fluoresced) or reflected (scattered) electromagnetic radiation20in response to the laser interrogation. The characteristics of the emitted or reflected electromagnetic radiation20may provide information relating to the characteristics of particles14. The characteristics of the particles can determine whether the particle14is classified as a particle of interest that is to be sorted in a particular way (such as to a collection container to collect particles of interest). The intensity of the emitted or reflected electromagnetic radiation20may be quantified in a plurality of directions and/or at a plurality of specified wavelengths to provide a large amount of information about the interrogated particles. Alternatively or in addition to emitted and reflected light, light extinction or absorption can also be used to detect and identify particle characteristics that indicate the presence of a particle14. FIG.1Aillustrates detection system22that includes a first detector128, sometimes referred to as at least one detector, configured to detect emitted or reflected electromagnetic radiation20from particles14in the inspection zone16. The detection system22may include any number of detectors configured in one or more directions from the inspection zone16. The first detector128and any additional detectors communicate signals to the processing unit24for differentiating particles and determining sort actions. As a non-limiting example, the first detector128may be configured in the forward direction, or in the same direction photons are propagated from the electromagnetic radiation source18toward the inspection zone16. The first detector128may be a forward fluorescence detector including a filter for blocking any electromagnetic radiation below a certain wavelength. A plurality of detectors may be placed in a plurality of directions, including the rear, forward and/or side directions. Each direction may include an optical configuration of collection lenses, reflective elements, or objective lenses in combination with splitters, dichroic mirrors, filters and other optical elements for detecting the intensities of various wavelengths collected from any particular direction. Optical configurations may also be employed for detecting light extinction or light scatter. A detector system22that is compatible with the present disclosure is described in U.S. Pat. No. 8,705,031, issued Apr. 22, 2014 and incorporated herein by reference in its entirety. The detector system22may include optical elements and filters and can include two detectors that view the fluid stream64from orthogonal directions. Each detector128may be controlled with a PMT controller140for adjusting the gain in each detector128. Signals produced by each detector may be amplified at the detector preamplifier142before being passed to the processing unit24. Depending on the particle characteristics of interest, sensors other than PMTs may be employed, including but not limited to a photodiode, a charge coupled device (CCD), or an avalanche photodiode. In some embodiments, the processing unit24may be a part of a personal desk top computer including all the acquisition and sort electronics40for operating the sort head50and the sorter34in response to signals produced by the detectors128,130. In another embodiment, the processing unit24may comprise a laptop with an external PCIe interface to the bus. The personal desk top computer or laptop may be an example computing device151described in greater detail below with respect toFIG.8. The acquisition and sort electronics40may be implemented on a PCIe board44having a programmable processor. The programmable processor may be a field programmable gate array26, such as the Spartan 3A, available from XILINX, San Jose, California US. Other field programmable gate arrays consisting of multiple thousands of configurable logic blocks may also be used. A field programmable gate array may be desirable as an implementation of a sort logic having configurable logic blocks which may operate asynchronously with a master clock. A field programmable gate array may further be desirable having configurable logic blocks with distributed RAM memory or without distributed RAM memory. In combination with an amplifier unit112, the processing unit24comprises a digital upgrade for some flow cytometer systems capable of replacing large racks including analog electronics. Specifically, the rack from an analog MoFlo™ (Beckman Coulter, formerly available from Cytomation) flow cytometer can be replaced with an amplifier unit112and a desk top computer having a PCIe board44with the field programmable gate array26(FPGA) described herein. The PCIe board44should be understood to include boards or cards having a PCIe interface46. The acquisition and sort electronics40or the PCIe board44may be connected through a common bus48in the desk top computer for displaying univariate histograms, bivariate plots and other graphical representations of acquired signals on a display for a graphical user interface94(GUI). Input devices may be associated with the GUI94such as a monitor, a touch screen monitor, a keyboard, or a mouse for controlling various aspects of the sort head50or sorter34. As will be described in more detail below, the PCIe board44with the FPGA26may operate to identify the occurrence of a pulse23in the signals produced by either the first detector128or the second detector130through the acquisition of signals and the execution of instructions on the PCIe board44. Each detected pulse23may represent the presence of a particle14in the inspection zone16and may define an event, or a particle event. Generally, field programmable gate arrays contain thousands of programmable, interconnectable logic blocks. Embodiments of this disclosure comprise an FPGA performing parallel operations across programmed interconnected paths for performing one or more of the following functions: detecting pulses, calculating measured pulse parameters, translating measured pulse parameters; classifying particles; compiling event parameters; and making sort decisions. Programming architecture may be stored in individual configurable blocks or in combinations of configurable blocks, including configurable blocks with RAM and configurable blocks without RAM. Written instructions may be included on these configurable blocks and combinations of configurable blocks and may include bitmap look up tables (LUTs), state machines, and other programming architecture. In one aspect, written instructions stored on the FPGA may provide for constructing an event memory map tracking event parameters for each droplet, as well as tracking parameters for each event within each droplet. The FPGA26may produce a number of control signals116to control the sort head50. The control signals116may control operational parameters set by a user at the GUI94or may dynamically adjust parameters based on detected event parameters. The control signals116may include the drop drive signal78for controlling the oscillator72and a charge signal92for controlling the charge of the fluid stream64based upon a sort decision. The charge signal92is represented inFIG.1Aby the electrical connection for carrying the charge signal92from the processing unit24to an amplifier unit112and the electrical connection carrying the charge signal92from the amplifier unit112to a charge connection127in the nozzle assembly62. The charge signal92carried from the amplifier unit112to a charge connection127in communication with the sheath fluid56. An additional control signal116may include the strobe signal120, represented by the electrical connection from the FPGA26to the amplifier unit112, and from the amplifier unit112to the strobe122. The sort logic can determine how a sorter or separator34sorts each sortable unit based upon characteristics of the sortable unit. Suitable characteristics of the sortable unit that can form the basis for a sort decision include the presence or absence of particles of interest within the sortable unit and whether the sortable unit is adjacent in sequence to another sortable unit that includes a particle of interest (i.e., a particle having a pre-determined characteristic). In other words, the sort logic can base sort decisions on characteristics of the sortable unit itself, characteristics of sortable units prior in time or later in time, characteristics of particles within the sortable unit, or any combination of the above. Once a sort decision is determined for a particular sortable unit, the fluid stream64may be charged with an appropriate charge just prior to the time a droplet74breaks off the fluid stream64encapsulating the particle14.FIG.1Aillustrates several droplets74after break-off from the fluid stream (i.e., downstream of the breakoff point) but before separation in box129. An expanded view of box129is provided to the right inFIG.1A. As shown in box129, the broken-off droplets74fall under gravity in a sequence. Targeted droplets201are droplets that are predicted to contain particles of interest when sorted. Adjacent non-targeted droplets203a-dare particles that are predicted not to contain particles of interest, but that are adjacent in sequence to at least one of the targeted droplets201a-c. Non-adjacent, non-targeted droplets202a-bare predicted not to contain particles of interest and are not adjacent in sequence to at least one targeted droplet201a-c. The adjacent non-targeted droplets203a,203bare located adjacent to targeted droplet201ain sequence: adjacent non-targeted droplet203ais after targeted droplet201awhile adjacent non-targeted droplet203bis before the targeted droplet201a. In some circumstances, multiple targeted droplets201b,201ccan be adjacent in sequence to form a train. In this case, adjacent non-targeted droplets203c,203dcan be identified that are before the first targeted droplet201cin the train (i.e., adjacent non-targeted droplet203d) and after the last targeted droplet201bin the train (i.e., adjacent non-targeted droplet203c). As droplets fall, each droplet74may be subjected to an electromagnetic field produced by the separator34for physically separating particles14based upon a desired characteristic. In the case of a jet-in-air flow cytometer, the separator34may comprise deflection plates114a,114b. The deflection plates114a,114bmay include high polar voltages for producing an electromagnetic field that acts on droplets74as they pass. The deflection plates114may be charged at up to ±3,000 Volts to deflect droplets74at high speeds into collection containers126. In some embodiments, the separator34can direct droplets74that are expected to include particles (i.e., targeted droplets201) along a first pathway77. The separator34can direct droplets that are not targeted but that are adjacent in sequence to targeted droplets (i.e., adjacent non-targeted droplets203) along a second pathway79. The separator34can direct droplets74that are not targeted and that are not adjacent in sequence to targeted droplets (i.e., non-adjacent non-targeted droplets202) along a third pathway81. FIG.1Billustrates an enlarged view of the separator34, pathways77,79,81, monitoring system205, and collection containers126ofFIG.1Aat a point in time after the particular expected sortable fluid segments101,102,103shown inFIG.1Ahave formed into droplets201,202,203and have been separated by the separator34onto different pathways77,79,81. Droplets201a-c,202a-b,203a-dare shown that correspond to the droplets201a-c,202a-b,203a-dillustrated inFIG.1A. The monitoring system205interrogates adjacent non-targeted droplets203to monitor the presence or absence of particles of interest in the adjacent non-targeted droplets203. Note that the adjacent non-targeted droplets203are not predicted to contain particles of interest (or they would be targeted droplets) but, nonetheless, the adjacent non-targeted droplet203may include particles of interest due to random fluidic processes of the system or because the operational parameters (such as sort delay) are set to sub-optimal values. By monitoring adjacent non-targeted droplets while simultaneously adjusting operational parameters to seek reduction or minimization of detected signal from the adjacent non-targeted droplets, the operational parameters can be optimized. By monitoring adjacent non-targeted droplets203, which are a subset of the total number of droplets202,203that are not targeted, the monitoring system205can operate in real time as the total number of droplets that are monitored is reduced and highly manageable. At the same time, the real-time operation does not sacrifice accuracy because mis-sorted particles are highly likely to be present in adjacent non-targeted droplets203rather than non-adjacent non-targeted droplets202. In an active system, the drop delay is often incorrect by less than one droplet period (i.e., a fractional drop delay period). As a result, mis-sorted particles frequently appear either one droplet earlier or later in sequence. As such, measurement of non-adjacent non-targeted droplets202confounds the measurement of drop delay whereas measuring only adjacent non-targeted droplets203provides a highly sensitive measure of a fractional drop delay error. Additional insight as to why measurement of every non-targeted droplet (whether adjacent or not) does not lead to this sensitive result is described below with respect toFIGS.5A-5B. Adjacent non-targeted droplets203are droplets that immediately precede or follow droplets in sequence that are predicted to contain particles of interest (i.e., targeted droplets201). Signals related to the presence or absence of particles of interest are received at the processing unit24from the monitoring system205. The processing unit24is configured to adjust or calibrate operational parameters of the system, such as drop delay time, purity mask parameters such as mask width or mask position, or characteristics of the drop drive signal78, based upon the received signals. By monitoring adjacent non-targeted droplets203using the monitoring system205, the system10can monitor the success of a sorting operation in real time and adjust operational parameters of the system in real time to achieve target goals for purity, recovery, or other statistical properties of the sorted product. The separator34diverts droplets201,202,203onto two or more output pathways77,79,81. In some embodiments, targeted droplets201(that is, droplets anticipated to contain particles of interest) are directed along a first pathway77. Adjacent non-targeted droplets203that are anticipated to contain no particles of interest, but that were adjacent in sequence as expected sortable fluid segments103to other expected sortable fluid segments101that contained particles, are directed along a second pathway79. Non-adjacent, non-targeted droplets202that are anticipated to contain no particles of interest and that were not adjacent as expected sortable fluid segments102to other expected sortable fluid segments101that contained particles are directed along a third pathway81. Although an example configuration is shown here, one of ordinary skill would appreciate that any pathway (e.g., diverted or non-diverted) can be assigned to any droplet classification as needed. For example, the targeted droplets201could be allowed to pass straight down (undeflected) while adjacent non-targeted droplets203are deflected to the left and non-adjacent non-targeted droplets202are deflected to the right. The monitoring system205interrogates adjacent non-targeted droplets203downstream of the break-off point. In some embodiments, the interrogation can reveal if a particle of interest is located in the adjacent non-targeted droplet203. In some embodiments, the processing unit24can adjust operational parameters of the system to minimize the signal from the monitoring system205associated with identification of particles of interest in adjacent non-targeted droplets203. The configuration shown inFIGS.1A-1Bapplies to microfluidic systems of all forms and shapes including, but not limited to, jet-in-air and microfluidic chip/channel sorting systems as described in greater detail below with reference toFIG.2. Referring toFIG.2, a microfluidic chip58is illustrated that is operatively engaged with a monitoring system205according to some embodiments described herein. The microfluidic chip58includes a sorter34′ that sorts expected sortable fluid segments based on a characteristic of the expected sortable fluid segment onto a first flow path57or a second flow path59. The particle delivery device may include a sample inlet88′ for introducing a sample54′ containing particles14into a fluid chamber54′ passing in a fluid stream60through an inspection zone16′. The sample54′ may be insulated from interior channel walls and/or hydrodynamically focused with a sheath fluid56′ introduced through a sheath inlet86′. After inspection at the inspection zone16′ using a measurement system similar to the one described with respect toFIG.1A, expected sortable fluid segments that include particles of interest14in the fluid chamber54′ can be determined. Sortable fluid segments that correspond to the expected sortable fluid segments can be mechanically or acoustically directed to the second flow path59using the sorter34′, which is analogous in function to the separator34described above in relation toFIGS.1A and1B. Adjacent non-targeted sortable fluid segments and non-adjacent non-targeted sortable fluid segments can be diverted or can flow naturally along the first flow path57. The monitoring system205advantageously provides an empirical method to assess optimal switch timing under actual sorting conditions using actual particles of interest. By switching a sortable fluid volume that is expected to have no particles of interest, but that is adjacent to a sortable fluid volume that is expected to contain particles of interest, the user can determine for the specific sample being sorted what the correct and shortest effective switching times between switch periods can be. Factors such as particle size and drag can impact the inter-switching period (which may also be referred to as the switch recovery period). Using the monitoring system205, the user can not only determine the delay timing needed to switch particles of interest in the microfluidic chip58but also assess how quickly the next switch actuation can occur (as it may take a finite amount of time to restore normal flow after a switch actuation). Thus, the user can assess the “emptiness” of switched anticipated empty fluid volumes that are adjacent to anticipated occupied fluid volumes. Although not shown inFIG.2, some microfluidic chips may also include a third flow path, which can be located opposite the second flow path59. In such an embodiment, the sorter34′ can direct non-adjacent non-targeted sortable fluid segments along the third flow path. The sorter34′ may alter fluid pressure or divert fluid flow to selectively direct targeted sortable fluid segments from the fluid stream along either the first flow path57or the second flow path59. For example, the sorter34′ can include a membrane in some embodiments which, when depressed, may cause a pressure pulse to divert targeted sortable fluid segments into the second flow path59. Other mechanical or electro-mechanical switching means such as transducers and switches may also be used to divert particle flow. The sortable units can pass to collection containers126′, which can include sealed wells or voids on chip to collect the sortable units or can include sealable output ports that transport the targeted sortable fluid segments off chip. The point at which the particles14are directed to one of the flow paths in this embodiment is analogous to the break-off point in the embodiment ofFIGS.1A-1Bbecause the particles14take some time to travel from the inspection zone16′ to the point at which the sorter34′ acts upon the sortable fluid segment. The sorter34′ can sort targeted sortable fluid segments along the second flow path59and adjacent non-targeted sortable fluid segments along the first flow path57. The monitoring system205can monitor adjacent non-targeted sortable fluid segments that are directed along the first flow path57. For example, the monitoring system205can include an electromagnetic source and detector positioned on opposite sides of the microfluidic chip58to view light emanating from within the first sort path57. In some embodiments, the monitoring system205can be operatively connected with an electronic gate system that enables the monitoring system205to provide signals that are gated to time periods when the adjacent non-targeted sortable fluid segments are passing the view of the monitoring device205along the first flow path57. The electronic gate system enables the monitoring system205to reject measurements that are obtained during times when adjacent non-targeted sortable fluid segments are not passing the view of the monitoring system205, e.g., at times when non-adjacent sortable fluid segments are passing the view of the monitoring system205. In embodiments that have a third flow path onto which the sorter34′ directs adjacent non-targeted sortable fluid segments, the monitoring system34′ can monitor primarily or only those sortable fluid segments that qualify as adjacent non-targeted sortable fluid segments. Signals from the monitoring system205can be used to adjust an operational parameter of the system such as sort delay. FIGS.3A and3Bdepict views of the monitoring system205in accordance with various embodiments described herein.FIG.3Cillustrates a top view of the monitoring system205. In some embodiments, the monitoring system205can include an electromagnetic radiation source212and a detector214. The monitoring system205shown inFIGS.3A and3Bis configured to monitor adjacent non-targeted droplets203in air and includes a housing211through which the droplets pass. The housing211can include an opening213through which the adjacent non-targeted droplets203enter the housing211. Droplets can be captured in the housing211or can pass out of the housing211to be disposed of or captured elsewhere, for example, in a collection container126as shown inFIGS.1A and1B. In some embodiments, the housing211can include one or more holders215for collection containers126to hold a collection container126in place where each collection container126is associated with a different flow path77,79,81. The holder215can hold a collection container126to enable removal of the collection contain126from the holder215and insertion of the collection container126into the holder215. Other forms of monitoring system205are contemplated in this disclosure that monitor adjacent non-targeted droplets203in the microfluidic chip context and may not include a separate housing211. The electromagnetic radiation source212can illuminate each adjacent non-targeted droplet203to identify the presence or absence of one or more particles in each adjacent non-targeted droplet203. For example, the electromagnetic radiation source212can include one or more light emitting diodes. The light emitting diodes can emit light in the ultraviolet range, for example, at a center wavelength of 365 nm. In some embodiments, the electromagnetic radiation source212can include a heat sink to dissipate heat generated during light emission. In some embodiments, the electromagnetic radiation source212can illuminate a large volume within the housing211through which the adjacent non-targeted droplets203pass from top to bottom. For example, the large volume can have a diameter of about 5 mm in some embodiments. The detector214collects light from this large illuminated volume. For example, the detector214can include a charge-coupled device (CCD), a photodiode, or other imaging device that detects the illumination light. Optical filters can be used in some embodiments to narrow the illumination wavelength band, to filter the emission received at the detector214, or both. In some embodiments, optical filters can include bandpass filters that narrow the illumination wavelength band to a range of approximately 350 nm+/−10 nm or 376 nm+/−30 nm. The optical filters can include neutral density filters such as optical density (OD) 4 filters. In some embodiments, the optical filters can include shortpass filters. In some embodiments, optical filters such as bandpass filters can be used to narrow the emission wavelength band received at the detector214to a range of approximately 415 to 550 nm. In some embodiments, the optical filters can include longpass filters with a cutoff wavelength of 410 nm. The optical filters can include neutral density filters such as OD 4 filters. The detector214can also interface with other optical elements such as lenses or mirrors. In some embodiments, the field of view of the detector214(with or without other optical elements) is large compared to the size of individual droplets203. In some cases, five or more adjacent non-targeted droplets203may be within the field of view of the detector214at any time. In some embodiments, the detector214reads out at a rate of 30 Hz. For example, the detector214can include CCD elements that charge for 1/30thof a second (i.e., the detector214has a frame rate of 30 frames/second), which can essentially integrate the total emission within the field of view of the detector214for each time period. The sum of the values of all pixels for a single frame is called the frame count. The detector214can output a signal (e.g., a frame count) representative of the total emission to the processing unit24that is also controlling the sort delay and other operating parameters of the particle sorter. In some embodiments, a high value for the frame count is an indication that the intensity of light received at the detector214is high which may mean that particles of interest were located in the measured adjacent non-targeted droplets203. The processing unit24can generate what is referred to herein as an “intensity measurement” based upon one or more signals received from the detector214. Generally, the intensity measurement can be based on an average or cumulative measurement from multiple frame counts. For example, the processing unit24can collect n frame counts at a particular value of sort delay. In some embodiments, the processing unit24can process the n frame counts to remove outlier frame counts (e.g., the highest and lowest frame counts in the set of n frame counts). The remaining frame counts can be averaged to become the intensity measurement. The data plotted inFIGS.5A,5B, and6Bare intensity measurements as described herein. In some embodiments, the number of frame counts n that are averaged for a particular value of sort delay can be between 5 and 10. The system including processing unit24can maintain the proper phase of the droplet break off during calibration or active sample sorting. In some embodiments, the housing211can include a holder to hold collection containers126for one or more sorting pathways77,79,81. For example,FIG.3Ashows a collection container126mounted in a holder opposite the opening213in the housing211of the monitoring device205. In some embodiments, targeted droplets201can be directed into the collection container126while calibration measurements are underway. Cells or particles that pass largely in single file, after hydrodynamic focusing, through a flow cytometer or cell sorter are physically separated at random, Poisson-distributed, intervals. Because droplets201,202,203are formed synchronously by the nozzle assembly62and particles14arrive asynchronously at random intervals, it is possible to apply Poisson probability to calculate the probability of k particles arriving during a single droplet period as follows: P(keventsininterval)=λke-λk! Importantly, this equation can be used to predict what fraction of droplets201,202,203can be expected to contain no particles based on the stream velocity, average rate of particle arrival, and droplet generation frequency. Therefore it is possible to operate the separator34at a wide range of predictable operating points where a predictable fraction of the droplets will contain zero particles. It is possible to use the Poisson probability equation to predict the number of droplets that can be expected to be empty for any operating point. Systems and methods of the present disclosure can use signals from the monitoring system205to calibrate or adjust operational parameters of the system. Adjustable operational parameters in various embodiments can include nozzle height, laser beam vertical position, amplitude of the drop drive signal provided to the drive transducer, and other parameters. For example, the signals from the monitoring system205can be used to calibrate or adjust a sort delay parameter.FIG.4Aillustrates simulated results for fluorescence intensity measured at the example monitoring system205as a function of sort delay for several input sample rates. Relevant inputs and outputs for this simulation are listed in tabular form inFIG.4B. The simulation accounts for multiple cells per drop due to Poisson probability. At an input sample rate of 40,000 particles per second and a droplet generation frequency of 65 kHz, 46.14% of all droplets in the simulation contain particles (29,990 per second) while there are 25,338 adjacent non-targeted droplets per second and around 9,600 non-targeted droplets that were not adjacent to a targeted droplet. In the simulation, the detector214operates at 30 frames per second and an output signal from the detector214to the processing unit24includes an integration of pixel counts over 5 frames. The simulation was run for several input sample rates. InFIG.4A, the horizontal axis is the relative sort delay value where a relative sort delay=0 is the absolute proper sort delay setting as indicated by line501. The two neighboring dotted lines502are positioned at +1 and −1 from the proper sort delay setting. The other dotted lines503are positioned at +2, +3, and −2 from the proper sort delay setting. The whole number values used in this figure represent period multipliers of the formation time of a droplet. A relative sort delay of +1 or −1 (lines502) represents the situation where the sort delay setting is off by one full period such that a detected particle is sorted into the droplet immediately before or after the droplet that is expected to contain the particle. As indicated on the curve representing the 40,000 events per second (eps) input sample rate, one can see that the lowest intensity point505is a clear feature and that this point505marks the proper sort delay setting at line501. One can also see that maximum intensity peaks507occur at +1 and −1 relative sort delay (lines502). Each maximum intensity peak occurs where there is an error in timing by one full period, so that the likelihood is high that the adjacent droplet contains the particle, which is then detected, for example, as high fluorescence intensity detected by the monitoring device205. Similar maximum and minimum intensity points are seen on the other curves in the figure. When the relative sort delay is greater than +1 or less than −1, the curve approaches a flat background value509. This background value represents the average fluorescence for sortable units selected randomly from the stream and depends on the overall cell rate and particle fluorescence intensity. The background value therefore varies from sample to sample. The background value remains roughly constant as relative sort delay moves further away from zero. By generating a curve such as that shown inFIG.4A, the processing unit24can determine the minimum intensity point on this curve and the corresponding proper sort delay value. The corresponding sort delay value represents the proper set point for sort delay. The simulation suggests that higher event rates produce more pronounced curve minima, which should be easier to detect. In some embodiments, the system can measure events at a sample sorting rate in a range from 5,000 events per second (eps) to 40,000 eps. The approach to determining the appropriate sort delay value is described in greater detail below. Curves such as those shown inFIG.4AandFIGS.5A and6, which are discussed below, cannot be realized in a system that monitors all expected empty droplets including both adjacent and non-adjacent droplets. The particular characteristics of the curve including minima and maxima around a baseline are present because only adjacent droplets are monitored. In the event that all expected empty (i.e., non-targeted) droplets are monitored, the shape of the curve as the value of sort delay is swept is largely dominated by random noise around the baseline as particles are measured in non-targeted droplets that are completely uncorrelated to any particular sort decision. For example, using the monitoring device to measure all non-targeted droplets (i.e., all droplets predicted to lack particles of interest without regard to whether the droplet was adjacent to a targeted droplet) would mean that the peaks507inFIG.4A and602inFIG.5Awould not exist. In such a case, the baseline level509would raise to approximately the level of the maximum intensity points507because essentially all particles would be seen at all delay values. In some embodiments, the obvious signature of the background509(based on random sampling of drops, which is low), the peaks507(which identify the +/−1 drop boundary) and the minimum505(which identifies the correct delay setting) improves identification of system issues and proper calibration values. In particular, the overall shape of the curve can provide an important diagnostic for the system. For example, if only one of the peaks507is present, the performance of the calibration system is suspect. Thus, the measurement of only adjacent non-targeted droplets increases sensitivity while also providing self-calibration and self-quality control capabilities to the system. FIG.5Aillustrates data curves of intensity measurement data as a function of sort delay value obtained using the system10to measure Hoechst-stained sperm cells and nuclei in accordance with the present disclosure.FIG.5Bis a magnified view of a portion ofFIG.5A. Data in the figures was obtained at sample input rates ranging from 1000 events per second (eps) to 40,000 eps, which are essentially the same input rates shown in the simulations ofFIG.4A. From highest to lowest background value,FIGS.5A and5Bshow curves acquired at 40k eps (curve670), 20k eps (curve672), 10k eps (curve674), 5k eps (curve676), 2k eps (curve678), and 1k eps (curve680). The actual measured curves inFIGS.5A and5Bshow strong agreement with the simulated curves ofFIG.4A, particularly in terms of showing the steep intensity rises at +1 and −1 relative sort delay producing peaks602that bracket a curve minimum605value at the proper sort delay value. FIG.5Billustrates a magnified view ofFIG.5Anear the minimum intensity value605for each of the event rates. The minimum605is well defined and similar to what was predicted by the simulation. FIG.6Aillustrates a process600for adjusting sort delay using data from the monitoring system205as described herein.FIG.6Bis also provided to help graphically illustrate steps of the process. In some embodiments, one or more steps in the process600can be implemented as a computer application such as the sort monitor calibration application940ofFIG.8. As an initial step, the system can initiate a calibration or adjustment operation (step602). Alternatively, as an initial step the system can start sorting based on a prior calibration. For example, a user can initiate the calibration or adjustment process through interaction with the processing unit24such as by pressing a button on a graphical user interface displayed by the processing unit24on a touchscreen monitor. Alternatively, the system itself can initiate the calibration operation based upon a triggering event. The triggering event could be detection of an out-of-bounds statistical value of the sample (e.g., detection that purity has fallen below a threshold) or could be based on a time (i.e., calibration occurs on a set schedule or after a certain amount of active operation time has passed since the last calibration). The processing unit24can first determine the background intensity value710(step604) by setting the sort delay to a value far from the last-known or expected proper sort delay value. The background intensity value represents the average value of intensity measurements for sort delay values that are significantly greater or less than the proper sort delay value (e.g., more than 2 periods away from the proper sort delay value). In other terms, the background is a mean value that represents the background (or random sampling of droplet fluorescence) at the current operating point. In some embodiments, the background intensity value710can be an average intensity measurement value from at least 10,000 droplets. The background value can be measured immediately before the process of adjustment of operational parameters is begun. At such values of sort delay, the connection between the detection and sorting operations becomes nearly completely uncorrelated and, thus, random, which establishes the background value710because the monitoring system205is sampling random droplets out of phase with the sorting system. Next, the processing unit24identifies a threshold intensity value715based upon the background intensity value710(step606). For example, the threshold intensity value715can be a percentage of the background intensity value710such as 70%. The processing unit24can sweep the value of sort delay until the intensity value falls below the threshold intensity value715. This may be done initially using coarse increments to the value of sort delay. For example, coarse increments of sort delay can be in a range from 0.1 to 0.5 times the period of the droplet generation signal. If the search is done with an increment greater than 0.5 times the period of the droplet signal, it is possible to miss (i.e., skip over) detection of the signal dip. The coarse increment of sort delay can be 0.25 times the period of the droplet generation signal in some embodiments. The processing unit can determine crossing sort delay values720where the intensity value crosses the threshold intensity value715(step608). Then, the processing unit can do a sweep of sort delay using fine increments between the crossing sort delay values720to form a histogram725of intensity values (step610). For example, fine increments of sort delay can be in a range from 0.01 to 0.1 times the period of the droplet generation signal. In some embodiments, the fine increment of sort delay can be 0.05 or 0.02 times the period of the droplet generation signal. In some embodiments, the fine increment of sort delay can be limited to the maximum timing resolution of the system. The processing unit can identify a median value of the histogram725(step612). The median value of the histogram725is the proper value of sort delay. In some embodiments taught herein, systems and methods can use signals from the monitoring device205to improve statistical sort outcomes such as purity, throughput, or recovery. For example, the signals can be used to adjust operational parameters of a purity mask (e.g., mask width or position), sample rate, or other parameters to provide an output purity that exceeds a defined threshold.FIG.7illustrates measured intensity in the monitoring device205as a function of sort delay with an identification of error910measured over baseline. The monitoring device205can be used to compare the number of adjacent non-targeted droplets203that should theoretically be observed vs. the number of adjacent non-targeted droplets203that are actually devoid of particles of interest. The discrepancy between these quantities arises due to the uncertainty in membership of particles to expected droplets for particles that are located near the boundary between stream segments. In the example show inFIG.7, the error910is illustrated for the 40k eps curve670. For curves having a minimum605above the baseline or background intensity value710, the error910is non-zero and is directly related to the number of particles that “slipped” through due to various random processes. The size of the error910can be manipulated (e.g., reduced) by tuning various operating parameters of the system. For example, increasing overall droplet drive, reducing overall delay, reducing sample rate, and pushing droplets closer to the nozzle will reduce error910. In some embodiments, the size of the error910is predictive of the achievable purity under current operating conditions. In some embodiments, a window or mask can be defined on the expected sortable fluid segments such that the sort logic aborts sorting of sortable units where particles are too close to the leading or trailing boundary of the expected sortable fluid segment. Specifically, the droplets with ambiguous particle location will not be sorted to output pathway77corresponding to targeted particle droplets201inFIG.1B. To enable automated adjustment of sort windows and mask widths within the sort logic, adjacent non-targeted droplets203that are measured by the monitoring system205can be required to be adjacent to targeted droplets201that are actually sorted (as opposed to targeted droplets that are not sorted because they were rejected by the sort logic using the purity mask). Under this condition, output signals from the monitoring system205can be used to assess the efficiency of such a purity window or mask by, for example, comparing the size of the error910when the sort logic is employing the mask to the size of the error910when the sort logic is not employing a mask. This can allow real time or automated adjustment of these window or mask widths based on feedback from the apparatus. This enables optimal purity and optimal recovery at that purity. Automation allows for the dynamic adjustment of these windows or masks in real time to accommodate changes in sample characteristics that may impact this error. At higher event rates, the number of particles assigned to incorrect droplets may increase. This measured error shown inFIG.7is a direct measurement of particles that were registered at measurement as being in a particular expected sortable fluid segment but that actually slip into an adjacent non-targeted droplet203and are measured by the monitoring system205. By applying a sort window or sort mask in the sort logic, it is possible to abort the sorting of targeted droplets where particles are near a boundary between stream segments. Thus, the monitoring system205can be used to assess how well such a sort window or sort mask is working, allowing real-time tuning of the parameters of the mask such as width or position relative to expected boundaries between expected sortable fluid segments. In the event that the errors are eliminated, the minima605for each curve inFIG.7drops to the baseline710(i.e., the error910is zero). FIG.8is a block diagram of a computing device151for implementing some embodiments of the present disclosure. The computing device151includes one or more non-transitory computer-readable media for storing one or more computer-executable instructions or software modules for implementing some embodiments. The non-transitory computer-readable media may include, but are not limited to, one or more types of hardware memory, non-transitory tangible media (for example, one or more magnetic storage disks, one or more optical disks, one or more flash drives, one or more solid state disks), and the like. The memory906included in the computing device151or the storage device926included in or connected to the computing device151may store computer-readable and computer-executable instructions or software for implementing operations of the computing device151or processing unit24described herein. For example, the software can analyze signals received from the detector, alter the sort logic, implement the sort logic, or other operations as taught above. The software can include the sort monitor calibration application940that includes instructions to carry out operation of the system100to execute the methodology of adjusting operational parameters and data analysis described above with respect toFIGS.4A,4B,5A,5B,6A,6B, and7. The software instructions in the sort monitor calibration application640or other similar operational parameter calibration application can be executed by the processing unit24to execute the steps of the methodology described above. The software can also be stored in a storage device926as taught below. The computing device151also includes configurable and/or programmable processing unit24and associated core(s)904, and optionally, one or more additional configurable and/or programmable processing unit(s)902′ and associated core(s)904′ (for example, in the case of computer systems having multiple processors/cores), for executing computer-readable and computer-executable instructions or software stored in the memory906and other programs for implementing some embodiments of the present disclosure. Processing unit24and processing unit(s)902′ may each be a single core processor or multiple core (904and904′) processor. Either or both of processing unit24and processing unit(s)902′ may be configured to execute one or more of the instructions taught in connection with the computing device151. Virtualization may be employed in the computing device151so that infrastructure and resources in the computing device151may be shared dynamically. A virtual machine912may be provided to handle a process running on multiple processors so that the process appears to be using only one computing resource rather than multiple computing resources. Multiple virtual machines may also be used with one processor. Memory906may include a computer system memory or random access memory, such as DRAM, SRAM, EDO RAM, and the like. Memory906may include other types of memory as well, or combinations thereof. A user may interact with the computing device151through a visual display device914, such as a computer monitor, which may display one or more graphical user interfaces94. The user may interact with the computing device151through a multi-point touch interface920or a pointing device918in some embodiments. The computing device151may also include one or more storage devices926, such as a hard-drive, CD-ROM, or other computer readable media, for storing data and computer-readable instructions and/or software that implement some embodiments of the present disclosure. The computing device151can include a network interface908configured to interface via one or more network devices924with one or more networks, for example, Local Area Network (LAN), Wide Area Network (WAN) or the Internet through a variety of connections including, but not limited to, standard telephone lines, LAN or WAN links (for example, 802.11, T1, T3, 56 kb, X.25), broadband connections (for example, ISDN, Frame Relay, ATM), wireless connections, controller area network (CAN), or some combination of any or all of the above. In some embodiments, the computing device151can include one or more antennas922to facilitate wireless communication (e.g., via a network interface908) between the computing device151and a network. The network interface908may include a built-in network adapter, network interface card, PCMCIA network card, card bus network adapter, wireless network adapter, USB network adapter, modem or any other device suitable for interfacing the computing device151to any type of network capable of communication and performing the operations taught herein. The computing device151may run any operating system911, such as any of the versions of the Microsoft® Windows® operating systems, the different releases of the Unix® and Linux® operating systems, any version of the MacOS® for Macintosh computers, any embedded operating system, any real-time operating system, any open source operating system, any proprietary operating system, or any other operating system capable of running on the computing device151and performing the operations taught herein. In some embodiments, the operating system911may be run in native mode or emulated mode. In an exemplary embodiment, the operating system911may be run on one or more cloud machine instances. FIG.9depicts a monitoring system205as taught herein. The housing211of the monitoring system205can conceal the electromagnetic radiation source or detector to prevent direct user access or to protect these components from environmental conditions such as humidity. The housing includes an opening213through which adjacent non-targeted droplets pass to be measured by the monitoring system205. The monitoring system205can include one or more ports or connectors217to enable connection of interior components (such as the electromagnetic radiation source or the detector) to a power source or the computing device151. As will be apparent to those of skill in the art upon reading this disclosure, each of the embodiments taught and illustrated herein has discrete components and features which may be readily separated from or combined with the features of any of the other several embodiments without departing from the scope or spirit of the present disclosure. Any recited method can be carried out in the order of events recited or in any other order that is logically possible. | 77,667 |
11858009 | DETAILED DESCRIPTION Referring toFIG.1, a card/carrier handling system10is illustrated. The system includes a card/carrier combination sorter system12that is configured for use with a card/carrier combination production system14. The sorter system12is configured to receive a plurality of card/carrier combinations one-by-one from the production system14, sort some or all of the received card/carrier combinations into one or more bins of the sorter system12, and in some embodiments output some of the card/carrier combinations to an inserter system16which is configured to insert the output card/carrier combinations into envelopes for mailing to the intended recipients. The inserter system16is optional whereby the sorter system12can be used with or without the inserter system16. When used without the inserter system16, the sorter system12may receive the card/carrier combinations from the production system14and sort the card/carrier combinations into a plurality of the bins of the sorter system12. The sorted card/carrier combinations in the bins can then be handled separately by, for example, being later input into an inserter system (which could be the inserter system16or a different inserter system) for insertion into envelopes and mailed to the intended recipients. When used with the inserter system16, the sorter system12may receive the card/carrier combinations from the production system14and sort some of the card/carrier combinations into one or more bins of the sorter system12, while other ones of the card/carrier combinations are not sorted but are instead immediately output from the sorter system12to the inserter system16. FIG.2Aillustrates an example of a card/carrier combination20that can be used with the sorter system12. The card/carrier combination20includes a carrier form22and one or more personalized plastic cards24fixed to the carrier form22. In the example ofFIG.2A, the carrier form22is illustrated as being tri-folded.FIG.2Billustrates another example of a card/carrier combination30that can be used with the sorter system12. The card/carrier combination30includes the carrier form22and one or more of the personalized plastic cards24fixed to the carrier form22. In the example ofFIG.2B, the carrier form22is illustrated as being bi-folded. The examples inFIGS.2A and2Bshow two of the cards24attached to the carrier forms22. However, a single card24or more than two cards24can be attached to the carrier forms22. The folding of the carrier form22, whether tri-fold or bi-fold, can occur at any suitable location in the system10. For example, the carrier form22can be folded in the production system14whereby the carrier form22is received by the sorter system12in its folded condition. Alternatively, the carrier form22(with the card(s)24attached thereto) can be output from the production system14in an unfolded condition, and then folded in the sorter system12. The card/carrier combinations20,30can be of standard construction known in the art. The carrier form22is typically made from paper and can include printed information thereon such as terms of use of the personalized plastic card(s)24, one or more logos for example of the issuer of the card(s)24, the intended recipient's name and mailing address, and other conventional information. In some embodiments, the carrier form22can be pre-printed, with no printing on the carrier form22occurring in the production system14. In other embodiments, the carrier form22can be pre-printed with some information with additional information, such as the intended recipient's name and mailing address, being printed on the carrier form22in the production system14. In still other embodiments, the carrier form22can be substantially blank with all or substantially all of the information being printed on the carrier form22in the production system14. The personalized plastic cards24described herein include financial (e.g., credit, debit, or the like) cards, driver's licenses, national identification cards, business identification cards, gift cards, and other plastic or composite cards which bear personalized data unique to or assigned specifically to the cardholder, such as the name of the cardholder, an account number, an image of the face of the cardholder, and/or which bear other card information. The term “plastic card” or the like as used herein is intended to encompass cards that are completely or substantially plastic, as well as cards that have non-plastic or composite components and cards having other formulations that function like the card types indicated above. In one specific embodiment, and referring toFIG.3, the personalized plastic cards24can be plastic financial cards. A financial card, which may also be referred to as a credit card or a debit card, as used herein refers to a type of card that allows the cardholder to borrow funds or that has a stored monetary value. As shown inFIG.3, a financial card typically has at least a cardholder name26, an account number28, expiration date32, and bank information34provided thereon, on the front and/or rear surface of the card, often by printing. A financial card may also have an integrated circuit chip36that stores data relating to the card and/or a magnetic stripe38that stores data relating to the card, as well as a security hologram40and a signature panel42. However, the concepts described herein can be used with other types of plastic cards that have other configurations and bear other data. Returning toFIG.1, the production system14can have any configuration that is capable of personalizing the plastic cards24, provide the carrier forms22, attach the cards24to the carrier forms22to produce the card/carrier combinations20,30, preferably fold the carrier forms22, and output the card/carrier combinations20,30one-by-one through an output thereof to the sorter system12. In one non-limiting example, the production system14can be comprised of a separate card personalization system50, a separate carrier form printer52, and a separate card fixing mechanism54. An example of a production system configuration is disclosed in U.S. Pat. No. 9,415,580 which is incorporated by reference herein in its entirety. The card personalization system50can be any system that is designed to perform one or more personalization and/or processing operations on plastic cards. Examples of personalization and/or processing operations include, but are not limited to, printing, programming a magnetic stripe or an integrated circuit chip, laminating, embossing, laser personalization, indent printing, and the like, all of which are well known in the art. Examples of the type of personalization that can be added to the card include, but are not limited to, the user's name, the user's address, a photograph of the user, an account number assigned to the user, and other types of data well known to those of ordinary skill in the art. The card personalization system50is often referred to as a central issuance system that is often room sized, configured with multiple personalization/processing stations or modules performing different personalization/processing tasks, and that is generally configured to process multiple cards at once in relatively high processing volumes (for example, on the order of hundreds or thousands per hour). An example of a central issuance system is the MX and MPR line of card issuance systems available from Entrust Datacard Corporation of Shakopee, Minnesota Central issuance systems are described in U.S. Pat. Nos. 6,902,107, 5,588,763, 5,451,037, and 5,266,781 which are incorporated by reference herein in their entirety. In one embodiment, the cards24that are processed by the card personalization system50are mechanically input directly into the mechanism54for attaching to the carrier forms22. In this embodiment, the card personalization system50is considered to be “in-line” with the mechanism54, or in other words mechanically in-line with the mechanism54so that cards that are output from the card personalization system50can be transported by mechanical transport mechanisms that are well known in the art, for example transport rollers, transport belts and the like, into the mechanism54. This embodiment tends to permit high throughput of cards since the cards do not need to be manually carried from an output of the card personalization system50and manually input into the mechanism54. The integration of card personalization systems with card fixing mechanisms54is well known in the art, for example from the MXD™ card delivery system available from Entrust Datacard Corporation of Shakopee, Minnesota. In another embodiment, the card personalization system50can be separate from, or “off-line” from, the card fixing mechanism54so that cards that are processed by and output from the card personalization system50must be manually input into the card fixing mechanism54by loading the cards into an input hopper of the card fixing mechanism54. The carrier form printer52prints the carrier forms22to which the card or cards24personalized in the card personalization system50are attached. An example of a carrier form printer is described in U.S. Pat. No. 7,059,532 the entire contents of which are incorporated herein by reference. The carrier form printer52can include a hopper containing carrier forms22to be printed on, and a printer mechanism that prints on the carrier forms22. The carrier forms22can be printed with any text, graphics or other data that one wishes to add to the carrier forms. Examples of data that can be printed on the carrier forms include the names and addresses of the cardholders corresponding to the cards24to be attached to the carrier forms22. The printed carrier forms22are then output into the fixing mechanism54. If printing on the carrier forms22is not required, the carrier forms22can be contained in a hopper in the form printer52and fed therefrom into the fixing mechanism54without any printing. In such an embodiment, the form printer52need not have a printer mechanism and can instead be referred to as a carrier form feeder. In the card fixing mechanism54, which may also be referred to as a transition module, the appropriate card(s)24is matched with and attached to the appropriate carrier form22to form the card/carrier combination20,30. In addition, if folding is to occur within the production system14, the card/carrier combination20,30can be folded in the card fixing mechanism54using a folding mechanism56, and the folded card/carrier combinations20,30are mechanically transported one-by-one through the output of the production system14and fed into the sorter system12. If folding is to occur outside of the production system14, for example in the sorter system12using the folding mechanism56, the card/carrier combinations20,30can be output one-by-one through the output in an unfolded condition and fed into the sorter system12where the card carrier/combination is folded prior to being diverted/sorted. Referring now toFIG.4, an example configuration of the sorter system12is illustrated. The sorter system12can have any configuration that permits it to receive a plurality of the card/carrier combinations20,30one-by-one from the production system14, and sort some or all of the received card/carrier combinations20,30into one or more bins60of the sorter system12. In some embodiments, the sorter system12may also output some of the card/carrier combinations20,30to the inserter system16which is configured to insert the output card/carrier combinations20,30into envelopes for mailing to the intended recipients. The sorter system12is illustrated as receiving the card/carrier combinations20,30already folded, where the folding occurred with the production system14or in a separate mechanism upstream of the sorter system12. The folded card/carrier combinations20,30are received one-by-one through an input62of the sorter system12that is in communication with the output of the production system14. The folded card/carrier combinations20,30are transported along a transport path64that extends from the input62. The folded card/carrier combinations20,30can be transported along the transport path using any suitable transport mechanism(s) that are known in the art including, but not limited to, transport rollers, transport belts, and the like. Suitable mechanisms for transporting folded card/carrier combinations are known from the MXD™ card delivery system available from Entrust Datacard Corporation of Shakopee, Minnesota. As shown inFIG.4, the card/carrier combinations20,30can be transported with long edges LE thereof substantially perpendicular to the direction of transport along the transport path64(i.e. the short edges SE thereof can be substantially parallel to the direction of transport along the transport path64). A plurality of the bins60are spaced along the transport path64. Each one of the bins60is configured to receive select ones of the card/carrier combinations20,30therein, and to stack the card/carrier combinations20,30side-by-side along their short edges SE. The card/carrier combinations20,30are diverted from the transport path64and into the respective bin60by a diverter70(described below with respect toFIG.6) that is associated with each bin60. The bins60can be located substantially on the exterior of the sorter system12(see the 3 bins60to the left inFIG.4), the bins60can be located substantially within the interior of the sorter system12(see the 3 bins60to the right inFIG.4), or some of the bins60can be located on the exterior and some of the bins60can be located within the interior. The bins60can be removably installed in the sorter system12to allow changes to the number of bins60that are used by removing and adding bins60to the sorter system12. An identification system can also be used whereby each bin60is uniquely identified. This permits a user to know the types of card/carrier combinations20,30that are stacked in each bin60. In embodiments where the sorter system12is used with the inserter system16, the sorter system12further includes an output66disposed at the end of the transport path64through which certain ones (or even all) of the card/carrier combinations20,30can be output to the inserter system16. FIG.5illustrates another example configuration of the sorter system12. This embodiment also illustrates the sorter system12as receiving the card/carrier combinations20,30already folded, where the folding occurred within the production system14or in a separate mechanism upstream of the sorter system12. The folded card/carrier combinations20,30are received one-by-one through the input62of the sorter system12that is in communication with the output of the production system14. In the embodiment ofFIG.5, the sorter system12is illustrated as including a divert section68aand a sorting section68b. The divert section68aincludes a transport path64athat extends from the input62to the optional output66. In addition, a second transport path64bextends from the transport64asubstantially perpendicular thereto, with the transport path64bextending into the sorting section68b. The sorting section68bfurther includes a plurality of the bins60spaced along the transport path64b. The card/carrier combinations20,30can be sorted by the sorting section68binto the different bins60. The bins60can be located substantially on the exterior of the sorting section68b, the bins60can be located substantially within the interior of the sorting section68b, or some of the bins60can be located on the exterior and some of the bins60can be located within the interior. The bins60can be removably installed in the sorting section68bto allow changes to the number of bins60that are used by removing and adding bins60. An identification system can also be used whereby each bin60is uniquely identified. This permits a user to know the types of card/carrier combinations20,30that are stacked in each bin60. As shown inFIG.5, the card/carrier combinations20,30enter the divert section68awith the long edges LE thereof substantially perpendicular to the direction of transport along the transport path64a(i.e. the short edges SE thereof can be substantially parallel to the direction of transport along the transport path64a). The card/carrier combinations20,30can be transported to the output66or diverted by a suitable diverter, similar to the diverter70described below with respect toFIG.6, onto the transport path64band transported into the sorting section68b. When a card/carrier combination20,30is diverted onto the transport path64b, the card/carrier combination20,30now travels with its long edges LE substantially parallel to the direction of transport along the transport path64band the short edges SE thereof now substantially perpendicular to the direction of transport. The card/carrier combinations20,30are then diverted from the transport path64band into the respective bin60by the diverter70(described below with respect toFIG.6) that is associated with each bin60. Each one of the bins60is configured to receive select ones of the card/carrier combinations20,30therein, and to stack the card/carrier combinations20,30side-by-side along their long edges LE. In the embodiment ofFIG.5, the folded card/carrier combinations20,30can be transported along the transport paths64a,64busing any suitable transport mechanism(s) that are known in the art including, but not limited to, transport rollers, transport belts, and the like. Suitable mechanisms for transporting folded card/carrier combinations are known from the MXD™ card delivery system available from Entrust Datacard Corporation of Shakopee, Minnesota. FIG.10illustrates another example configuration of the sorter system12. In this embodiment, the diverting and sorting functions are performed in separate mechanisms that can be connectable and separable from one another. In particular, the sorter system12includes a diverter mechanism110and a separate sorter mechanism112. The diverter mechanism110and the sorter mechanism112can be separately manufactured, sold and assembled together. This provides flexibility in manufacturing the diverter mechanism110and the sorter mechanism112and permits the diverter mechanism110to be used with different types of sorter mechanisms112as well as allowing the sorter mechanism112to be used with different types of diverter mechanisms. The diverter mechanism110includes the input62that is in communication with the output of the production system14and through which the folded card/carrier combinations20,30are received one-by-one. The diverter mechanism110also includes the output66(which can be referred to as a first output) that during use can communicate with the inserter system. The diverter mechanism110further includes a second output114through which diverted card/carrier combinations20,30can be outputted from the diverter mechanism110. The diverter mechanism110can include the diverter70described herein for diverting the card/carrier combinations. The sorter mechanism112is configured to be connectable to the diverter mechanism110to sort the diverted card/carrier combinations into bins. For example, the sorter mechanism112can include an input116through which diverted card/carrier combinations that are output through the second output114of the diverter mechanism110can be input. The diverted card/carrier combinations can then be sorted into respective ones of the bins60as described above forFIG.5. In another embodiment, a sorter mechanism (for example, similar to the sorter mechanism112or a different sorter mechanism) can be connected to the system12inFIG.4or to the system inFIG.5(or to the sorter mechanism112inFIG.10). The added sorter mechanism is illustrated diagrammatically inFIGS.4and5by element112′ in dashed lines. In such an embodiment, the systems12inFIGS.4and5would include an additional card/carrier combination outlet120that is in communication with an inlet of the additional sorter mechanism112′. The added sorter mechanism112′ can expand the sorting capability of the systems12inFIGS.4and5. For example, sorting of some of the card/carrier combinations can occur in the bins60of the systems12, while additional sorting can occur in additional bins of the added sorter mechanism112′. FIGS.6and7illustrate an example of the diverter70that can be used to divert the card/carrier combinations20,30from the transport path64into the bins60(inFIG.4), from the transport path64binto the bins60(inFIG.5), used in the diverter mechanism110and the sorter mechanism112ofFIG.10, or in the sorter mechanism112′. A similar diverter can be used to divert the card/carrier combinations20,30from the transport path64aonto the transport path64b. It is to be realized that the diverter70can have any configuration(s) suitable for diverting the card/carrier combinations20,30as described herein. Further, each one of the bins60has one of the diverters70associated therewith. In the example illustrated inFIGS.6and7, the diverter70of one of the bins60is illustrated. The diverter70includes an upper set of transport rollers72and a lower set of transport rollers74, with each one of the upper transport rollers72being associated with one of the lower transport rollers74. The transport rollers72,74are disposed above and below, respectively, the transport path64,64bso that the card/carrier combinations20,30travel between the upper and lower transport rollers72,74when traveling along the travel path64,64b. The arrow A inFIG.6indicates the direction of travel of the card/carrier combinations20,30between the upper and lower transport rollers72,74. The transport rollers72,74are each rotatable about an axis R-R that is parallel to the transport direction64,64a,64balong which the card/carrier combination20,30is being transported just prior to being diverted by the diverter70. The upper and lower sets of transport rollers72,74are initially spaced from one another to define a path of travel for the card/carrier combinations20,30along the travel path64,64bbetween the rollers72,74. When a card/carrier combination20,30is to be diverted, the upper and lower transport rollers72,74are movable toward one another so as to bring the upper and lower transport rollers72,74into engagement with the upper and lower surfaces of the card/carrier combination20,30. For example, the upper set of transport rollers72can be movable vertically toward and away from the lower set of transport rollers74which remain fixed in vertical position. In addition, the rollers of either the upper set of transport rollers72or the lower set of transport rollers74are in driving engagement with a drive motor (not shown) which drives the transport rollers, while the other set of rollers are idler rollers that are not driven. For example, the lower set of transport rollers74can be driven by the drive motor while the upper set of transport rollers72are the idler rollers. When the upper and lower transport rollers72,74are moved toward one another to bring the upper and lower transport rollers72,74into engagement with the upper and lower surfaces of the card/carrier combination20,30, and when the transport rollers, such as the transport rollers72are driven, the card/carrier combination20,30is driven in the direction of the arrow B inFIG.6thereby removing the card/carrier combination from the transport path64,64band driving the card/carrier combination20,30toward and possibly into the associated bin60. As illustrated inFIGS.6and7, the rollers74of the lower set that are disposed in the transport path64,64bare formed with a flat spot76. For example, the two rollers labeled74aare disposed in the transport path64,64band thus provided with the flat spot76, while the two rollers74labeled74bare not in the transport path64,64band do not have the flat spot76. This permits the rollers74ato be positioned as shown inFIG.6with the flat spots76each facing upward. The flat spots76allow the card/carrier combinations20,30to pass over the rollers74athat are disposed in the transport path64,64bwithout interference from the rollers74a. However, when the upper set of rollers72are dropped into diversion position and the rollers74rotated, the card/carrier combination20,30is diverted in the direction B. As indicated above, a similar diverter can be used to divert the card/carrier combinations20,30inFIG.5from the transport path64ato the transport path64b. FIG.8illustrates an example of an identification system that can be used to uniquely identify each bin60in either the system ofFIG.4and/or in the system ofFIG.5.FIG.8shows four of the bins60arranged side-by-side. Each of the bins60has a display80associated therewith. Each display80can be, for example, an electronic display, such as a liquid crystal display, that can electronically display information relating to the bin60. For example, the displayed information can uniquely identify the respective bin60and/or uniquely identify the card/carrier combinations20,30that have been diverted into the associated bin60. In addition to the preceding information, or separate from the preceding information, the displayed information on the display80may include a count of the number of card/carrier combinations20,30diverted into the associated bin60. Referring toFIG.9along withFIGS.4and5, an example card/carrier combination diversion process90is illustrated. In a step92, the card/carrier combination20,30is created. As described above, the card/carrier combination can be created by the production system14. The card/carrier combination is then output from the production system14and input into the sorter system12in a step94. A determination is then made at a step96whether or not the card/carrier combination is to be diverted. If the answer at step96is “no”, the card/carrier combination is output from the sorter system12at step98, for example to the inserter system16for insertion into an envelope followed by mailing to the intended recipient. If the answer at step96is “yes”, the card carrier combination is sorted into the appropriate bin60at step100. The determination as to whether or not a card/carrier combination is to be diverted, as well as the sorting determination, can be made using suitable logic programmed into one or more controllers that control the operation of the sorter system12. In one embodiment, the controller(s) keeps track of the position/location of each card/carrier combination20,30within the system10. The controller(s) also know the content of each card/carrier combination and whether or not each card/carrier combination is to be diverted, and if so, which one of the bins60the card/carrier combination is to be sorted in to. Therefore, the controller(s) knows when each card/carrier combination reaches the sorter system12, and based on that knowledge knows whether or not each card/carrier combination is to be diverted and knows which bin each diverted card/carrier combination is to be sorted in to. As an alternative, the system10can track each card/carrier combination20,30and a code or other information on each card/carrier combination can be read by one or more sensors, for example at the output of the production system14or within the sorter system12. Based on the sensor reading, the controller(s) can then determine whether or not that card/carrier combination should be diverted. The examples disclosed in this application are to be considered in all respects as illustrative and not limitative. The scope of the invention is indicated by the appended claims rather than by the foregoing description; and all changes which come within the meaning and range of equivalency of the claims are intended to be embraced therein. | 27,696 |
11858010 | DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the invention are shown. Indeed, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. Like numbers refer to like elements throughout. I. OVERVIEW OF AN EXEMPLARY EMBODIMENT Various embodiments of the present invention are directed to systems and methods for utilizing an improved conveyor belt assembly, associated user device(s), and a generated augmented reality environment to associate and direct an asset to a particular sort location. As used herein, an asset may be a parcel or group of parcels, a package or group of packages, a box, a crate, a drum, a box strapped to a pallet, and/or the like. According to standard practices, packages to be sorted are moved along a conveyor belt from some package source to an intake location (e.g., one or more sort employee workstations). A user (e.g., a sort employee) scans a bar code on the package, or simply reviews information printed on the package, and moves that package to an appropriate sort location (e.g., a vehicle, a shelf, and/or the like) based on the information provided on the package or via the barcode scanner. As described herein, embodiments utilizing an improved conveyor belt assembly rely upon an acquisition device (e.g., a stationary imager) positioned above the conveyor, upstream of the intake location or sort employee workstations to capture data associated with the package. The conveyor belt itself also incorporates a non-repeating pattern of colored, optionally transverse, stripes along its length, such that each package is positioned atop a plurality of uniquely patterned stripes. In this manner, as the conveyor moves packages under the acquisition device, scanned or otherwise captured data for respective packages is associated with the correspondingly unique pattern of stripes atop which each respective package is located. At the one or more sort employee workstations, the sort employees utilize one or more user devices, which may be augmented reality scanners (e.g., glasses), configured to constantly monitor the non-repeating and unique pattern of stripes of the conveyor belt as it moves and transports packages toward the intake locations and the sort employees. Once the augmented reality scanners (e.g., glasses) recognize a portion of the pattern that is associated with a particular package, the glasses generate and display at least one sort instruction within the line of sight of the sort employee, also proximate the package in question. Because the striped pattern on the conveyor belt is significantly larger than printed indicia (e.g., barcodes) on the packages themselves, the glasses are able to recognize distinctive differences between respectively unique portions of the stripes upon the conveyor belt, and thereby recognize various packages (and their sorting instructions) without having to separately scan each package, whether automatically or by each individual sort employee. In at least one embodiment, the glasses may generate and display navigational instructions over one or more of the properly associated packages so as to guide the sort employee to packages assigned to them. The glasses are also configured to constantly self-determine their own location relative to the improved conveyor, so as to in identifying the pattern thereon, also account for differences in perspective that may alter the appearance of the striped pattern relative to the scanners. Once a sort employee picks up a package and begins moving the package toward a sort location, the control system (e.g., an augmented reality system) facilitates identification of and movement to the appropriate sort location for the package. To facilitate efficient and accurate identification of the sort location, each sort location may, in certain embodiments, have a corresponding marker (e.g., a bar code, QR code, symbol, etc.) that may be identified by the augmented reality scanner (e.g., glasses). In this manner, the glasses may identify each marker, determine whether the marker corresponds to the correct sort location for the package, and determine the location of the proper sort location relative to the identified marker. In at least one embodiment, the glasses may generate and display navigational instructions over one or more of the identified markers to guide the sort employee (once holding an assigned package) to the proper sort location. For example, the glasses may overlay arrows over each identified marker pointing toward the proper sort location (based on known relative locations of each marker to the known proper sort location), and/or an emphasizing symbol to indicate the location of the proper sort location. In other embodiments, the glasses may generate and display navigational instructions without overlay thereof relative to any markers (or the like); in these instances, the glasses may utilize software that uses the markers to calculate or otherwise determine/generate a three-dimensional space surrounding the glasses and via that generated space and/or environment, place the guiding signs or navigational instructions anywhere suitable within the space/environment. Three-dimensional mapping and identification of discrete points within the mapped space and/or environment may be utilized to provide requisite and/or desired granularity of discrete points for placement of the guiding signs or navigational instructions. II. COMPUTER PROGRAM PRODUCTS, METHODS, AND COMPUTING ENTITIES Embodiments of the present invention may be implemented in various ways, including as computer program products that comprise articles of manufacture. A computer program product may include a non-transitory computer-readable storage medium storing applications, programs, program modules, scripts, source code, program code, object code, byte code, compiled code, interpreted code, machine code, executable instructions, and/or the like (also referred to herein as executable instructions, instructions for execution, computer program products, program code, and/or similar terms used herein interchangeably). Such non-transitory computer-readable storage media include all computer-readable media (including volatile and non-volatile media). In one embodiment, a non-volatile computer-readable storage medium may include a floppy disk, flexible disk, hard disk, solid-state storage (SSS) (e.g., a solid state drive (SSD), solid state card (SSC), solid state module (SSM)), enterprise flash drive, magnetic tape, or any other non-transitory magnetic medium, and/or the like. A non-volatile computer-readable storage medium may also include a punch card, paper tape, optical mark sheet (or any other physical medium with patterns of holes or other optically recognizable indicia), compact disc read only memory (CD-ROM), compact disc-rewritable (CD-RW), digital versatile disc (DVD), Blu-ray disc (BD), any other non-transitory optical medium, and/or the like. Such a non-volatile computer-readable storage medium may also include read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), flash memory (e.g., Serial, NAND, NOR, and/or the like), multimedia memory cards (MNIC), secure digital (SD) memory cards, SmartMedia cards, CompactFlash (CF) cards, Memory Sticks, and/or the like. Further, a non-volatile computer-readable storage medium may also include conductive-bridging random access memory (CBRAM), phase-change random access memory (PRAM), ferroelectric random-access memory (FeRAM), non-volatile random-access memory (NVRAM), magnetoresistive random-access memory (MRAM), resistive random-access memory (RRAM), Silicon-Oxide-Nitride-Oxide-Silicon memory (SONOS), floating junction gate random access memory (FJG RAM), Millipede memory, racetrack memory, and/or the like. In one embodiment, a volatile computer-readable storage medium may include random access memory (RAM), dynamic random access memory (DRAM), static random access memory (SRAM), fast page mode dynamic random access memory (FPM DRAM), extended data-out dynamic random access memory (EDO DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), double data rate type two synchronous dynamic random access memory (DDR2 SDRAM), double data rate type three synchronous dynamic random access memory (DDR3 SDRAM), Rambus dynamic random access memory (RDRAM), Twin Transistor RAM (TTRAM), Thyristor RAM (T-RAM), Zero-capacitor (Z-RAM), Rambus in-line memory module (RIMNI), dual in-line memory module (DIMM), single in-line memory module (SINN), video random access memory (VRAM), cache memory (including various levels), flash memory, register memory, and/or the like. It will be appreciated that where embodiments are described to use a computer-readable storage medium, other types of computer-readable storage media may be substituted for or used in addition to the computer-readable storage media described above. As should be appreciated, various embodiments of the present invention may also be implemented as methods, apparatus, systems, computing devices, computing entities, and/or the like. As such, embodiments of the present invention may take the form of an apparatus, system, computing device, computing entity, and/or the like executing instructions stored on a computer-readable storage medium to perform certain steps or operations. However, embodiments of the present invention may also take the form of an entirely hardware embodiment performing certain steps or operations. Embodiments of the present invention are described below with reference to block diagrams and flowchart illustrations. Thus, it should be understood that each block of the block diagrams and flowchart illustrations may be implemented in the form of a computer program product, an entirely hardware embodiment, a combination of hardware and computer program products, and/or apparatus, systems, computing devices, computing entities, and/or the like carrying out instructions, operations, steps, and similar words used interchangeably (e.g., the executable instructions, instructions for execution, program code, and/or the like) on a computer-readable storage medium for execution. For example, retrieval, loading, and execution of code may be performed sequentially such that one instruction is retrieved, loaded, and executed at a time. In some exemplary embodiments, retrieval, loading, and/or execution may be performed in parallel such that multiple instructions are retrieved, loaded, and/or executed together. Thus, such embodiments can produce specifically-configured machines performing the steps or operations specified in the block diagrams and flowchart illustrations. Accordingly, the block diagrams and flowchart illustrations support various combinations of embodiments for performing the specified instructions, operations, or steps. III. EXEMPLARY SYSTEM ARCHITECTURE Generally, embodiments of the present invention relate to concepts for utilizing an improved conveyor belt assembly, associated user device(s), and an augmented reality environment to automatically associate and direct an asset/package to a particular sort location.FIG.1is a schematic diagram showing the exemplary communication relationships between components of various embodiments of the present invention. As shown inFIG.1, the system may include one or more control systems100, one or more user devices110, one or more location devices415associated with a sort location400, one or more improved conveyor belt assemblies800, and one or more networks105. Each of the components of the system may be in electronic communication with one another over the same or different wireless or wired networks including, for example, a wired or wireless Personal Area Network (PAN), Local Area Network (LAN), Metropolitan Area Network (MAN), Wide Area Network (WAN), or the like. Additionally, whileFIG.1illustrates certain system entities as separate, standalone entities, the various embodiments are not limited to this particular architecture. A. Exemplary Control System FIG.2provides a schematic of a control system100according to one embodiment of the present invention. As described above, the control system100may be incorporated into a system as one or more components for providing information regarding the appropriate sort location for each of one or more assets10(FIG.5). In general, the terms computing entity, computer, entity, device, system, and/or similar words used herein interchangeably may refer to, for example, one or more computers, computing entities, desktops, mobile phones, tablets, phablets, notebooks, laptops, distributed systems, gaming consoles (e.g., Xbox, Play Station, Wii), watches, glasses, key fobs, radio frequency identification (RFID) tags, ear pieces, scanners, televisions, dongles, cameras, wristbands, kiosks, input terminals, servers or server networks, blades, gateways, switches, processing devices, processing entities, set-top boxes, relays, routers, network access points, base stations, the like, and/or any combination of devices or entities adapted to perform the functions, operations, and/or processes described herein. Such functions, operations, and/or processes may include, for example, transmitting, receiving, operating on, processing, displaying, storing, determining, creating/generating, monitoring, evaluating, comparing, and/or similar terms used herein interchangeably. In one embodiment, these functions, operations, and/or processes can be performed on data, content, information, and/or similar terms used herein interchangeably. The control system100may also comprise various other systems, such as an Address Matching System (AMS), an Internet Membership System (IMS), a Customer Profile System (CPS), a Package Center Information System (PCIS), a Customized Pickup and Delivery System (CPAD), a Web Content Management System (WCMS), a Notification Email System (NES), a Fraud Prevention System (FPS), and a variety of other systems and their corresponding components. As indicated, in one embodiment, the control system100may also include one or more communications interfaces220for communicating with various computing entities, such as by communicating data, content, information, and/or similar terms used herein interchangeably that can be transmitted, received, operated on, processed, displayed, stored, and/or the like. As shown inFIG.2, in one embodiment, the control system100may include or be in communication with one or more processing elements205(also referred to as processors, processing circuitry, and/or similar terms used herein interchangeably) that communicate with other elements within the control system100via a bus, for example. As will be understood, the processing element205may be embodied in a number of different ways. For example, the processing element205may be embodied as one or more complex programmable logic devices (CPLDs), microprocessors, multi-core processors, co-processing entities, application-specific instruction-set processors (ASIPs), microcontrollers, and/or controllers. Further, the processing element205may be embodied as one or more other processing devices or circuitry. The term circuitry may refer to an entirely hardware embodiment or a combination of hardware and computer program products. Thus, the processing element205may be embodied as integrated circuits, application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), programmable logic arrays (PLAs), hardware accelerators, other circuitry, and/or the like. As will therefore be understood, the processing element205may be configured for a particular use or configured to execute instructions stored in volatile or non-volatile media or otherwise accessible to the processing element205. As such, whether configured by hardware or computer program products, or by a combination thereof, the processing element205may be capable of performing steps or operations according to embodiments of the present invention when configured accordingly. In one embodiment, the control system100may further include or be in communication with non-volatile media (also referred to as non-volatile storage, memory, memory storage, memory circuitry and/or similar terms used herein interchangeably). In one embodiment, the nonvolatile storage or memory may include one or more non-volatile storage or memory media210, including but not limited to hard disks, ROM, PROM, EPROM, EEPROM, flash memory, MMCs, SD memory cards, Memory Sticks, CBRAM, PRAM, FeRAM, NVRAM, MRAM, RRAM, SONOS, FJG RAM, Millipede memory, racetrack memory, and/or the like. As will be recognized, the non-volatile storage or memory media may store databases, database instances, database management systems, data, applications, programs, program modules, scripts, source code, object code, byte code, compiled code, interpreted code, machine code, executable instructions, and/or the like. Such code may include an operating system, an acquisition module, a sort location module, a matching module, and a notification module. The terms database, database instance, database management system, and/or similar terms used herein interchangeably may refer to a structured collection of records or data that is stored in a computer-readable storage medium, such as via a relational database, hierarchical database, and/or network database. In one embodiment, the control system100may further include or be in communication with volatile media (also referred to as volatile storage, memory, memory storage, memory circuitry and/or similar terms used herein interchangeably). In one embodiment, the volatile storage or memory may also include one or more volatile storage or memory media215, including but not limited to RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, TTRAM, T-RAM, Z-RAM, RIMM, DIMM, SIMM, VRAM, cache memory, register memory, and/or the like. As will be recognized, the volatile storage or memory media may be used to store at least portions of the databases, database instances, database management systems, data, applications, programs, program modules, scripts, source code, object code, byte code, compiled code, interpreted code, machine code, executable instructions, and/or the like being executed by, for example, the processing element205. Thus, the databases, database instances, database management systems, data, applications, programs, program modules, scripts, source code, object code, byte code, compiled code, interpreted code, machine code, executable instructions, and/or the like may be used to control certain aspects of the operation of the control system100with the assistance of the processing element205and operating system. As indicated, in one embodiment, the control system100may also include one or more communications interfaces220for communicating with various computing entities, such as by communicating data, content, information, and/or similar terms used herein interchangeably that can be transmitted, received, operated on, processed, displayed, stored, and/or the like. Such communication may be executed using a wired data transmission protocol, such as fiber distributed data interface (FDDI), digital subscriber line (DSL), Ethernet, asynchronous transfer mode (ATM), frame relay, data over cable service interface specification (DOCSIS), or any other wired transmission protocol. Similarly, the control system100may be configured to communicate via wireless external communication networks using any of a variety of protocols, such as general packet radio service (GPRS), Universal Mobile Telecommunications System (UMTS), Code Division Multiple Access 2000 (CDMA2000), CDMA2000 1× (1×RTT), Wideband Code Division Multiple Access (WCDMA), Time Division-Synchronous Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), Evolved Universal Terrestrial Radio Access Network (E-UTRAN), Evolution-Data Optimized (EVDO), High Speed Packet Access (HSPA), High-Speed Downlink Packet Access (HSDPA), IEEE 802.11 (Wi-Fi), 802.16 (WiMAX), ultra-wideband (UWB), infrared (IR) protocols, near field communication (NFC) protocols, Bluetooth' protocols (e.g., Bluetooth™ Smart), wireless universal serial bus (USB) protocols, and/or any other wireless protocol. The control system100may include or be in communication with one or more input elements, such as a keyboard input, a mouse input, a touch screen/display input, motion input, movement input, audio input, pointing device input, joystick input, keypad input, and/or the like. The control system100may also include or be in communication with one or more output elements (not shown), such as audio output, video output, screen/display output, motion output, movement output, and/or the like. As will be appreciated, one or more of the control system's100components may be located remotely from other control system100components, such as in a distributed system. Furthermore, one or more of the components may be combined and additional components performing functions described herein may be included in the control system100. Thus, the control system100can be adapted to accommodate a variety of needs and circumstances. As will be recognized, these architectures and descriptions are provided for exemplary purposes only and are not limiting to the various embodiments. Additional details in this respect may be understood from U.S. Ser. No. 15/390,109, the contents of which as are incorporated herein by reference in their entirety. B. Exemplary User Device FIG.3depicts a user device110that a user5(FIG.8) may operate. As used herein, a user5(FIG.8) may be an individual (e.g., sort personnel), group of individuals, and/or the like. In various embodiments, a user5may operate the user device110, which may include one or more components that are functionally similar to those of the control system100. In one embodiment, the user device110may be one or more mobile phones, tablets, watches, glasses (e.g., Google Glass, HoloLens, Vuzix M-100, SeeThru, Optinvent ORA-S, Epson Moverio BT-300, Epson Moverio BT-2000, ODG R-7, binocular Smart Glasses, monocular Smart Glasses, and the like), wristbands, wearable items/devices, head-mounted displays (HMDs) (e.g., Oculus Rift, Sony HMZ-T3W, and the like), the like, and/or any combination of devices or entities adapted to perform the functions, operations, and/or processes described herein. The term user device110is intended to refer to any device that projects, superimposes, overlays, or otherwise provides an image on a surface with respect to a user's viewing angle or line of vision or a user device110's angle. Certain devices within the scope of the term user device110may also not project/provide any image on a surface; instead, an image may be implanted directly in the optic nerve or even the brain of a user utilizing (e.g., wearing) the user device. The term user device110is intended to also include any other peripheral electronics and functionality that may be provided in conjunction with such devices. For example, a user device110may include speakers, headphones, or other electronic hardware for audio output, a plurality of display devices (e.g., the use of two display devices, one associated with each of the user's eyes, to enable a stereoscopic, three-dimensional viewing environment), one or more position sensors (e.g., gyroscopes, global positioning system receivers, and/or accelerometers), battery packs, beacons for external sensors (e.g., infrared lamps), or the like. In one embodiment, the user device110can be used to provide an augmented reality environment/area, a mixed reality environment/area, and/or similar words used herein interchangeably to a user. The terms augmented/mixed environment/area should be understood to refer to a combined environment/area including the physical environment/area and elements of a virtual environment/area. As shown inFIG.3, the user device110can include an antenna312, a transmitter304(e.g., radio), a receiver306(e.g., radio), and a processing element308(e.g., CPLDs, microprocessors, multi-core processors, co-processing entities, ASIPs, microcontrollers, and/or controllers) that provides signals to and receives signals from the transmitter304and receiver306, respectively. Certain embodiments of the user device110may also include and/or be associated with any of a variety of sensors (e.g., three-dimensional sensors, depth cameras, three-dimensional scanners, binocular cameras, stereo-vision systems, and the like). Still further, other input methods, including eye tracking devices, mind-reading interfaces, and body hacks (e.g., implanted sub-skin sensors) may be utilized in conjunction with and/or incorporated as components of the user device110described herein. The signals provided to and received from the transmitter304and the receiver306, respectively, may include signaling information in accordance with air interface standards of applicable wireless systems. In this regard, the user device110may be capable of operating with one or more air interface standards, communication protocols, modulation types, and access types. More particularly, the user device110may operate in accordance with any of a number of wireless communication standards and protocols, such as those described above with regard to the control system100. In a particular embodiment, the user device110may operate in accordance with multiple wireless communication standards and protocols, such as UMTS, CDMA2000, 1×RTT, WCDMA, TD-SCDMA, LTE, E-UTRAN, EVDO, HSPA, HSDPA, Wi-Fi, WiMAX, UWB, IR, NFC, Bluetooth' Smart, USB, and/or the like. Similarly, the user device110may operate in accordance with multiple wired communication standards and protocols, such as those described above with regard to the control system100via a network interface320. Via these communication standards and protocols, the user device110can communicate with various other entities (e.g., an acquisition/display entity115and/or a location device415) using concepts such as Unstructured Supplementary Service Data (US SD), Short Message Service (SMS), Multimedia Messaging Service (MIMS), Dual-Tone Multi-Frequency Signaling (DTMF), and/or Subscriber Identity Module Dialer (SIM dialer). The user device110can also download changes, add-ons, and updates, for instance, to its firmware, software (e.g., including executable instructions, applications, program modules), and operating system. According to one embodiment, the user device110may include a location and/or perspective determining aspect, device, module, functionality, and/or similar words used herein interchangeably. For example, the user device110may include outdoor and/or environmental positioning aspects, such as a location module adapted to acquire, for example, latitude, longitude, geocode, course, direction, heading, speed, universal time (UTC), date, and/or various other information/data. In one embodiment, the location module can acquire data, sometimes known as ephemeris data, by identifying the number of satellites in view and the relative positions of those satellites. The satellites may be a variety of different satellites, including Low Earth Orbit (LEO) satellite systems, Department of Defense (DOD) satellite systems, the European Union Galileo positioning systems, the Chinese Compass navigation systems, Indian Regional Navigational satellite systems, and/or the like. Alternatively, the location information may be determined by triangulating the user device110's position in connection with a variety of other systems, including cellular towers, Wi-Fi access points, and/or the like. Similarly, the user device110may include indoor positioning aspects, such as a location/environment module adapted to acquire, for example, latitude, longitude, geocode, course, direction, heading, speed, time, date, and/or various other information/data. Some of the indoor systems may use various position or location technologies including RFID tags, indoor beacons or transmitters, Wi-Fi access points, cellular towers, nearby computing devices (e.g., smartphones, laptops), nearby components with known relative locations, and/or the like. For instance, such technologies may include the iBeacons, Gimbal proximity beacons, Bluetooth Low Energy (BLE) transmitters, Near Field Communication (NFC) transmitters, three-dimensional scanners, robot vision systems, environmental mapping devices, and/or the like. These indoor positioning aspects can be used in a variety of settings to determine the location of someone or something to within inches or centimeters. The user device110may also detect markers and/or target objects. For example, the user device110may include readers, scanners, cameras, sensors, and/or the like for detecting when a marker and/or target object and/or a pattern of unique colors (or a unique subset thereof; seeFIG.16B) on the improved conveyor belt is within its point-of-view (POV)/field-of-view (FOV) of the real world environment/area. For example, readers, scanners, cameras, sensors, and/or the like may include RFID readers/interrogators to read RFID tags, scanners and cameras to capture visual patterns and/or codes (e.g., text, barcodes, character strings, Aztec Codes, MaxiCodes, information/data Matrices, QR Codes, electronic representations, and/or the like), and sensors to detect beacon signals transmitted from target objects or the environment/area in which target objects are located. For example, in some embodiments, the user device110may detect signals transmitted from the control system100(FIGS.1-2), an asset10(FIG.5), an improved conveyor belt assembly (FIG.10), and/or from a location device415(FIG.1). In one embodiment, the user device110may include accelerometer circuitry for detecting movement, pitch, bearing, orientation, and the like of the user device110. This information/data may be used to determine which area of the augmented/mixed environment/area corresponds to the orientation/bearing of the user device110(e.g., x, y, and z axes), so that the corresponding environment/area of the augmented/mixed environment/area may be displayed via the display along with a displayed image. For example, the user device110may overlay an image in a portion of the user's POV/FOV of the real world environment/area. The user device110may also comprise or be associated with an asset indicia reader, device, module, functionality, and/or similar words used herein interchangeably. For example, the user device110may include an RFID tag reader configured to receive information from passive RFID tags and/or from active RFID tags associated with an asset10. The user device110may additionally or alternatively include an optical reader configured for receiving information printed on an asset10. For example, the optical reader may be configured to receive information stored as a bar code, QR code, or other machine-readable code. The optical reader may be integral to the user device110and/or may be an external peripheral device in electronic communication with the user device110. The optical reader may also or alternatively be configured to receive information stored as human readable text, such as characters, character strings, symbols, and/or the like. The user device110may utilize the asset indicia reader to receive information regarding an asset10to be sorted. In at least one embodiment, the user device110may be equipped with an optical reader or the like configured to receive and/or monitor information associated with an improved conveyor belt, as detailed elsewhere herein. For example, the optical reader may be configured to receive and/or otherwise monitor and/or recognize a plurality of non-repeating patterned stripes located on the improved conveyor belt and associated with respective assets or packages. In this manner, the optical reader may be configured to identify a particular asset or package and based upon the sensed or detected pattern, retrieve and/or otherwise generate/display data associated with the particular asset or package. Such data may include package-level detail, sort instructions for the package (as detailed elsewhere herein), and/or assignment data, reflective of whether the package is assigned to a particular user (e.g., sort employee) utilizing the user device in question. For example, where the user devices are individually wearable glasses, each may be associated with a specific sort employee wearing the glasses at that time, such that only those packages assigned to that sort employee are analyzed and processed. The user device110may also comprise a user interface (that can include a display or see-through display114coupled to a processing element308and/or a user input device318coupled to a processing element308). For example, the user interface may be a user application, browser, user interface, and/or similar words used herein interchangeably executing on and/or accessible via the user device110to interact with and/or cause display of information, as described herein. The user interface can comprise any of a number of devices allowing the user device110to receive data, such as a keypad (hard or soft), a touch display, voice or motion interfaces, or other input device. In embodiments including a keypad, the keypad can include (or cause display of) the conventional numeric (0-9) and related keys (#, *), and other keys used for operating the user device110and may include a full set of alphabetic keys or set of keys that may be activated to provide a full set of alphanumeric keys. In addition to providing input, the user input interface can be used, for example, to activate or deactivate certain functions, such as screen savers and/or sleep modes. The user device110can also include volatile storage or memory322and/or non-volatile storage or memory324, which can be embedded and/or may be removable. For example, the non-volatile memory may be ROM, PROM, EPROM, EEPROM, flash memory, MMCs, SD memory cards, Memory Sticks, CBRAM, PRAM, FeRAM, NVRAM, MRAM, RRAM, SONOS, FJG RAM, Millipede memory, racetrack memory, and/or the like. The volatile memory may be RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, TTRAM, T-RAM, Z-RAM, RIMM, DIMM, SIMM, VRAM, cache memory, register memory, and/or the like. The volatile and non-volatile storage or memory can store databases, database instances, database management systems, data, applications, programs, program modules, scripts, source code, object code, byte code, compiled code, interpreted code, machine code, executable instructions, and/or the like to implement the functions of the user device110. As indicated, this may include a user application that is resident on the entity or accessible through a browser or other user interface for communicating with the control system100(FIG.2), location device415(FIG.1), and/or various other computing entities. In another embodiment, the user device110may include one or more components or functionality that are the same or similar to those of the control system100, as described in greater detail above. As will be recognized, these architectures and descriptions are provided for exemplary purposes only and are not limiting to the various embodiments. FIG.4shows an embodiment of an exemplary user device110that sends, receives, and/or displays information related to the asset10(FIG.5) and/or the sort location400(FIG.1) and/or the improved conveyor belt assembly800(FIG.10). In one embodiment, the user device110includes a set of glasses112, as described in U.S. Pat. No. 7,063,256; U.S. Publication No. 2016/0370452; and U.S. Ser. No. 15/390,109, all of which as are hereby incorporated by reference in their entirety. The glasses112include the display114(which may be monocular, as illustrated, or binocular) and an information gathering device such as an image camera116. The user device110may further include a local computer120having the processing device308(FIG.3), the antenna312(FIG.3), the network interface320(FIG.3), the transmitter304(FIG.3), the receiver306(FIG.3), the volatile memory322(FIG.3), and/or the non-volatile memory324(FIG.3). In some embodiments, the user device110is an optical, wearable display, such as Google Glass, available from Google Inc., HoloLens available from Microsoft Inc., Epson Moverio BT-300 or BT-2000, ODG R-7, or the like. In certain embodiments, the user device110is a monocular-based set of glasses; in other embodiments, a binocular-based set of glasses may be provided. In still other embodiments, the display may be a device separate from the glasses through which the items may be viewed or, in other embodiments, on which a representation of the item may be viewed wherein such representation may include outline images of the items, symbols that represents the items or characteristic information about the items. In the embodiment shown inFIG.4, the information gathering device is an image camera116that is mounted on the glasses112. In other embodiments, the information gathering device may be a three-dimensional depth sensor, a stereo camera, and/or the like. The image camera116, in one embodiment, is a center-view visible light camera that is used to acquire label images and may acquire images associated with an asset10(FIG.5) and/or an improved conveyor belt assembly800(FIG.10). The POV/FOV of the image camera116may correspond to the direction of the user device110and therefore the POV/FOV of the user5(FIG.8). With the POV/FOV, images can be presented to the user of target objects (e.g., an asset10) that are within the environment/area of the user device110. For example, while the user5(FIG.8) is going about his daily work, the user device110can display the corresponding environment/area and images overlaid on the same. The displayed image may include images (e.g., stock images of assets10or actual images of assets10), text (sorting instructions or warnings), video (e.g., handling procedures), menus, selection boxes, navigation icons, and/or the like. In this manner, the displayed image(s) is merged with objects in the physical world/environment in a seamless manner, so as to provide a sense that the displayed image(s) is an extension of the reality present in the physical world/environment. This is oftentimes referred to as a “mixed reality” or a “hybrid reality” environment, whereby the merging of real and virtual worlds produces a new environment containing visualizations of both physical and digital objects that are able to co-exist and interact relative to one another in a real-time manner. Stated otherwise, provided and/or generated is an overlay of synthetic content on the real world or physical environment, with the former being anchored to and able to in a real-time manner (e.g., upon movement of a user) interact with the real world or physical environment (sic). The local computer120is comprised of a computer including the network interface320(FIG.3) which may determine the orientation and position determination of the user5(FIG.8) based on images obtained from the image camera116. Alternatively, the local computer120may determine the orientation and position of the user5(FIG.8) based on a location module adapted to acquire, for example, latitude, longitude, geocode, course, direction, heading, speed, universal time (UTC), date, and/or various other information/data, as described above. The local computer120also performs view-plane computations, which is a process that uses the three-dimensional position data for each relevant object, and determines the position and orientation of the wearer of the user device110. The local computer120manages the application-provided display symbology for each relevant object to determine what is to be displayed in the display114and where to display the information such that it appears superimposed proximately about or on an item, such as an asset10(FIG.5). The local computer120packaging may also contain a power source (not shown), which may be self-contained such as, for example, batteries or other forms of rechargeable, replaceable, reusable or renewable power sources. Peripherals may also be provided, including a belt bag (e.g., for holding the external battery or the like), an external scanner (e.g., Bluetooth capable or the like), and/or QR cards for a user to utilize when handling items. Additional details in this respect may be understood from U.S. Ser. No. 15/390,109, the contents of which as are incorporated herein by reference in their entirety. C. Exemplary Improved Conveyor Belt Assembly FIG.10depicts an improved conveyor belt assembly800in communication with the control system100, where the improved conveyor belt assembly facilitates obtaining of asset10information and association thereof with a unique pattern of colored stripes808(see alsoFIGS.16A-B). In the embodiment depicted inFIG.10, the improved conveyor belt assembly800may comprise a conveying mechanism802and an acquisition/display entity115(see alsoFIG.5), each of which as are described in further detail below. 1. Exemplary Improved Conveying Mechanism802 FIG.10depicts an improved conveying mechanism802that has a pattern of stripes808(which may be colored) provided thereon. Via utilization of the pattern of stripes808, the improved conveying mechanism is configured to enable a unique set of stripes to be associated with each asset10traveling upon the conveying mechanism. In this manner, a user5approaching the conveying mechanism and utilizing (e.g., wearing) a user device110may recognize and/or otherwise capture respectively unique sets of stripes approaching and based thereon (e.g., via communication with the acquisition device115and/or the control system110) view one or more visual indicators810associated with the asset10that has been previously (e.g., via the acquisition device115) associated with the unique sets of stripes (see alsoFIG.16B). Advantageously, this configuration enables identification of the asset10from much longer distances (of the user relative to the conveying mechanism) than configurations wherein the user device must be sufficiently close to the asset so as to read/sense information directly therefrom. With respect to the pattern of stripes808provided, reference now toFIGS.16A and16Bis beneficial. InFIG.16A, there is depicted an exemplary color spectrum806that may be utilized according to various embodiments. It should be understood, though, that in certain embodiments, varying degrees of grayscale-based stripes may be provided, as opposed to full color versions thereof. Still further, althoughFIG.16Aillustrates a set of eight (8) colors806A-806H that may be utilized to generate the unique pattern of stripes808upon the conveying mechanism802, it may be understood that less than eight or more than eight colors may be utilized, with the advantage being that the more colors used, the more permutations of unique sets of stripes may be generated. Indeed, many more than eight colors may be utilized, as most cameras utilized today can differentiate between several million distinct colors. That said, at least one factor informing a particularly advantageous range of a volume of colors used is that the matching of unique permutations of the colors—and the colors themselves—to a picture or image captured or sensed in differing light conditions must be performed with relative speed. Utilizing millions of colors would result in tens of millions (if not more) permutations, the processing time associated with identifying matches therein as would be quite lengthy. A lesser volume of colors is thus advantageous. Offsetting this potential limitation in certain embodiments on the number of colors used is the ability to calibrate the user device (or sensors associated therewith) via a reference chart of available colors. This chart may be electronically generated and/or a physical component in the physical realm (e.g., a poster near the conveying mechanism that can be used to calibrate the sensor by providing examples of the same colors in the conveyor, under the same light conditions currently present, so that the software within the user device can take a picture thereof and—as necessary—adjust hue to read the pattern and/or color intensity correctly. In certain embodiments, this color calibration may occur periodically (e.g., daily); in other embodiments, it need only occur if light conditions surrounding the conveying mechanism change, which change may also be automatically sensed and/or monitored. For example, where eight colors are used, more than 300 permutations of unique sets of stripes may be provided (and thus assigned uniquely to associated assets10), at least where the sets of stripes are defined by three consecutive stripes positioned adjacent one another. It should be understood, of course, that more than three consecutive stripes may be utilized to define a unique set of stripes, as may be desirable, for example, relative to larger assets10. It is not envisioned, though, that fewer than three colors (of colors806A-806H) would ever be utilized so as to define the color spectrum806. Still further, the colors806A-806H illustrated are exemplary (e.g., red, yellow, green, blue, purple, black, gray, and white); it should understood that any of a variety of known colors and/or grayscale depictions may be used. In other embodiments as well, the colors of the stripes may be provided with a pattern thereon, whether a hatching or the like, as described in further detail in U.S. Pat. No. 9,599,459, the contents of which as are incorporated herein in their entirety. FIG.16Bdepicts an exemplary pattern of stripes808generated utilizing the color spectrum806ofFIG.16A. Rows as placed upon the conveying mechanism802(or otherwise incorporated within, for example, as a material of the same), may be understood as being numbered consecutively 1-64. With reference toFIG.10, it may be also understood that according to certain embodiments, the orientation of the rows/stripes within the pattern808may be oriented transverse to a machine direction (or direction of travel, as seen inFIG.5) of the conveying mechanism. In certain embodiments, when so transversely oriented, the stripes may extend substantially continuously across an entire width of the conveying mechanism; in other embodiments, however, the stripes may only extend across a majority of the width, as may be desirable. In still other embodiments, the stripes may be oriented other than in a transverse direction relative to the direction of travel of the conveying mechanism802. Referencing still furtherFIG.16B, it may be understood that within the pattern of stripes808generated there are distinctly unique sets of stripes808A-808H, which may each include three, four, or even more sets of adjacently positioned/oriented stripes. In any of these and still other embodiments, it should be noted that the pattern of stripes808and the unique sets defined there-within are non-repeating, as should be evident fromFIG.16B. It is in this manner that the acquisition device115is able to associate a unique set of stripes (e.g.,808A) with a first asset10and a second unique set of stripes (e.g.,808B) with a second asset, such that thereafter a user5wearing the user device110may utilize the user device to recognize (e.g., image capture) any of the unique sets of stripes (e.g.,808A-808H and the like) and therefrom alone determine asset identifier data associated with the particular asset10positioned atop the unique set of stripes recognized. If the pattern were repeating, or at least not sufficiently non-repeating, multiple assets could conceivably be associated with the same unique set of stripes (e.g.,808A); however, as designed, the pattern of stripes808has sufficient permutations to provide a non-repeating pattern so as to facilitate unique association of each set of stripes with a unique asset. Remaining withFIG.16Bbut also with reference toFIG.10, it may be understood also that each of the stripes defining the pattern of stripes808may have the substantially the same width. In certain embodiments, however, in addition to having the non-repeating pattern of colors, the widths of the stripes may also be variable, so as to generate still further unique permutations within the pattern. In at least one embodiment, the widths of each of the stripes may be approximately ten (10) centimeters. In other embodiments, the widths may be greater than or less than ten centimeters, for example in a range of approximately 5-15 centimeters or in a range of approximately 2-20 centimeters. Additional details in this respect are described in detail in U.S. Pat. No. 9,599,459, the contents of which as are incorporated herein in their entirety. It should also be understood that according to various embodiments, in addition to having a pattern of stripes808incorporated as part of the conveying mechanism802, each of the stripes within the pattern may be made of different materials and/or differently formed. For example, certain stripes may be formed from a material that is akin to conventional conveyor belts, while other stripes may be formed from a material having a high lumen factor or the like. Due to known widths of the stripes, beyond associating a unique set of stripes (e.g.,808A-808H) with each individual asset10, the improved conveyor belt assembly800, whether due to utilization of the acquisition device115or otherwise, may also determine relative dimensions of each asset10. Additional details in this respect and otherwise are described in further detail in U.S. Pat. No. 9,599,459, the contents of which as are incorporated herein in their entirety. 2. Exemplary Acquisition/Display Entity115 FIG.10depicts an acquisition/display entity115according to one embodiment that operates in communication with the control system100, where the acquisition/display entity115is configured to obtain/show/transmit information or data associated with an asset10and/or the improved conveyor belt assembly (i.e., the unique pattern of colored stripes808(or a defined subset thereof) on the conveying mechanism802described previously herein). In the embodiment depicted inFIG.10the acquisition/display entity115includes one or more imaging devices configured to capture images (e.g., image data) of assets10(and/or item/shipment identifiers) moving along the conveying mechanism402and/or to capture images (e.g., image data) of the unique pattern of colored stripes808adjacent each asset10on the improved conveying mechanism802, all as described elsewhere herein. Reference toFIG.5is useful in this respect, wherein the acquisition/display entity115in communication with the control system100is also illustrated, where the acquisition/display entity115shows information associated with an asset10(and/or the improved conveying mechanism802) according to various embodiments. In the embodiment depicted inFIG.5, the acquisition/display entity115may comprise not only one or more acquisition devices410(e.g., imaging devices) for acquiring information/data from an asset10and/or the improved conveying mechanism802(as illustrated also inFIG.10), but also a display420for showing information/data associated with the asset10, as described in U.S. Publication No. 2015/0262348, which is hereby incorporated by reference in its entirety. In one embodiment, each asset10may include an item/shipment identifier, such as an alphanumeric identifier. Such item/shipment identifiers may be represented as text, barcodes, Aztec Codes, MaxiCodes, Data Matrices, Quick Response (QR) Codes, electronic representations, tags, character strings, and/or the like. The unique item/shipment identifier (e.g., 123456789) may be used by the carrier to identify and track the item as it moves through the carrier's transportation network. Further, such item/shipment identifiers can be affixed to items by, for example, using a sticker (e.g., label) with the unique item/shipment identifier printed thereon (in human and/or machine readable form) or an RFID tag with the unique item/shipment identifier stored therein. As shown, the one or more acquisition devices410may be configured for acquiring asset identifier data and/or conveyor belt data (see alsoFIG.11, Step901) (including item/shipment identifiers and/or capture of a subset of the unique pattern of colored stripes808(seeFIG.16B) upon which the asset10is located) for one or more acquisition zones401positioned in front of one or more work zones405. The acquisition devices410may communicate this data to the control system100(FIG.2). Thus, an item traveling on a conveying mechanism402(FIG.5) or an improved conveying mechanism802(FIG.10) (e.g., conveyor belt, slide, chute, bottle conveyor, open or enclosed track conveyor, I-beam conveyor, cleated conveyor, and/or the like) can pass through an acquisition zone401prior to entering an intake location450. Certain data associated with the item or asset—along with certain data associated with, for instance, one or more characteristics of the improved conveying mechanism itself—may be thus captures in the acquisition zone401. Acquisition of data in the acquisition zone401may, in certain embodiments, always occur upstream (seeFIGS.5and10alike), namely prior to the asset10or item entering an intake location450where personnel or users of the systems described herein may be tasked with sorting the asset or item. However, as will be understood by one skilled in the art, the acquisition zone401may at least partially overlap the intake location450such that an asset10may reside in both the acquisition zone401and intake location450simultaneously. In various embodiments, the acquisition zone401and intake location450may be substantially the same size and shape. However, as will be understood by one skilled in the art, the acquisition zone401and intake location450may be of different sizes and/or shapes. In various embodiments, the acquisition device410can be positioned substantially above the conveying mechanism402or the improved conveying mechanism802. However, the acquisition device410may be located at any other position in relation to the conveying mechanism402or the improved conveying mechanism802, such as substantially above and adjacent to an edge of the conveying mechanism402or the improved conveying mechanism802. In certain embodiments, the acquisition device410may include or be associated with one or more imaging devices configured to capture images (e.g., image data) of assets10(and/or item/shipment identifiers) moving along the conveying mechanism402and/or to capture images (e.g., image data) of various subsets of the unique pattern of colored stripes808provided on the improved conveying mechanism802. For example, the acquisition device410may include or be associated with a video camera, camcorder, still camera, web camera, Single-Lens Reflex (SLR) camera, high-speed camera, and/or the like. In various embodiments, the acquisition device410may be configured to record high-resolution image data (e.g., images comprising at least 480 horizontal scan lines) and/or to capture image data at a high speed (e.g., utilizing a frame rate of at least 60 frames per second). Alternatively, the acquisition device410may be configured to record low-resolution image data (e.g., images comprising less than 480 horizontal scan lines) and/or to capture image data at a low speed (e.g., utilizing a frame rate less than 60 frames per second). As will be understood by those skilled in the art, the acquisition device410may be configured to operate with various combinations of the above features (e.g., capturing images with less than 480 horizontal scan lines and utilizing a frame rate of at least 60 frames per second, or capturing images with at least 480 horizontal scan lines and utilizing a frame rate less than 60 frames per second). In various embodiments, the acquisition device410may be configured to capture image data of the assets10and conveying mechanism402of sufficient quality that a user viewing the image data on the display420can identify each asset10represented in the displayed image data. In other embodiments, the acquisition device410may be configured to capture image data of various subsets of the unique pattern of colored stripes808(seeFIG.16B) on the improved conveying mechanism802relative to the assets10of sufficient quality that the control system100may accurately and efficiently associate the image data—and thus the unique pattern of colored stripes immediately adjacent and/or under each asset with respective assets. Still further, in embodiments wherein the conveying mechanism402and assets10are moving at a high rate of speed, the acquisition device410may be configured to capture image data at a high speed. The image data can be captured in or converted to a variety of formats, such as Joint Photographic Experts Group (JPEG), Motion JPEG (MJPEG), Moving Picture Experts Group (MPEG), Graphics Interchange Format (GIF), Portable Network Graphics (PNG), Tagged Image File Format (TIFF), bitmap (BMP), H.264, H.263, Flash Video (FLV), Hypertext Markup Language 5 (HTML5), VP6, V8, and/or the like. In certain embodiments, various features (e.g., text, objects of interest, codes, item/shipment identifiers, and/or the like) can be extracted from the image data. While in at least one embodiment the acquisition device410is image-based only, the acquisition device410may additionally or alternatively include or be associated with one or more scanners, readers, interrogators, and similar words used herein interchangeably configured for capturing item indicia for each asset10(e.g., including item/shipment identifiers). For example, the scanners may include a barcode scanner, an RFID reader, and/or the like configured to recognize and identify item/shipment identifiers associated with each asset10. In one embodiment, the acquisition device410may be capable of receiving visible light, infrared light, radio transmissions, and other transmissions capable of transmitting information to the acquisition device410. Similarly, the acquisition device410may include or be used in association with various lighting, such as light emitting diodes (LEDs), Infrared lights, array lights, strobe lights, and/or other lighting mechanisms to sufficiently illuminate the zones of interest to capture image data for analysis. These capabilities may be, for example, provided as a “fail-safe” so as to ensure that the optical imaging capabilities (detailed previously herein) configured to capture and/or otherwise monitor the unique pattern of colored stripes808on the improved conveying mechanism802are sufficiently accurate. In various embodiments, information associated with items can be presented via a display420. The display420may take a variety of forms, such as a Liquid Crystal Display (LCD), a Liquid Crystal on Silicon (LCoS) display, an Active Matrix Organic Light-Emitting Diode (AMOLED) display, a Digital Light Processing (DLP) display, a plasma display, a Cathode Ray Tube (CRT) display, a projected laser, an electronic ink display, and/or the like. The display420may be in direct communication with the acquisition device410or may be indirectly in communication with the acquisition device through the control system100(FIG.2). The display420may be configured for direct viewing, rear projection onto a surface, or front projection onto a surface. For example, in some embodiments, the display420may project images directly on or proximate to the assets10, as described in U.S. Pat. No. 7,090,134, which is incorporated herein by reference in its entirety. The display420may be fixed in a particular location, it may be movable to various locations, or it may be wearable by a user (seeFIG.4). In various embodiments, the display420may display images using a black-and-white display, a grey-scale display, and/or a color display. The displayed information may be correlated to the specific assets10, or may be general information unrelated to the specific assets10(e.g., information related to the non-repeating pattern of stripes, or the like). The displayed information, for instance, may be in the form of sorting instructions informing a user located near the intake location450how each asset10should be processed or handled, the source of an asset10, and/or the like. Alternatively, the displayed information may comprise information regarding the volume of assets10on the conveying mechanism (402,802), or information regarding upcoming scheduled user breaks (e.g., a lunch break). As will be recognized, a variety of other approaches and techniques can be used to adapt to various needs and circumstances. Similar to the controller system100described above, in one embodiment, the acquisition/display entity115may also include one or more communications interfaces for communicating with various computing entities, such as by communicating data, content, information, and/or similar terms used herein interchangeably that can be transmitted, received, operated on, processed, displayed, stored, and/or the like. Such communication may be executed using a wired data transmission protocol, such as FDDI, DSL, Ethernet, ATM, frame relay, DOCSIS, or any other wired transmission protocol. Similarly, the acquisition/display entity115may be configured to communicate via wireless external communication networks using any of a variety of protocols, such as GPRS, UMTS, CDMA2000, 1×RTT, WCDMA, TD-SCDMA, LTE, E-UTRAN, EVDO, HSPA, HSDPA, Wi-Fi, WiMAX, UWB, IR protocols, NFC protocols, Bluetooth' protocols, wireless USB protocols, and/or any other wireless protocol. As will be understood by those skilled in the art, the system may include more than one acquisition device410and/or display420and/or any combination thereof In various embodiments, one or more additional acquisition devices may be used to capture additional image data at one or more additional acquisition zones located on the conveying mechanisms402/802or an additional conveying mechanism. Such additional acquisition devices may be located, for example, after the flow of items along the conveying mechanism402/802is disturbed (e.g., the flow of assets10is culled, merged with an additional flow of assets10, or diverted to an additional conveying mechanism). Alternatively, one or more additional acquisition devices may be located along the conveying mechanism402,802after the intake location450, such that the one or more additional acquisition devices may capture updated image data after one or more of the assets10may have been removed from the conveying mechanism402,802. In various embodiments, the one or more additional acquisition devices may include components substantially similar to the acquisition device410. For example, the one or more additional acquisition devices may include or be associated with one or more imaging devices and one or more scanners, readers, interrogators, and similar words used herein interchangeably, as described above in regards to the acquisition device410. However, the one or more additional acquisition devices may include fewer components than acquisition device410. For example, the one or more additional acquisition devices may not include a scanner, reader, interrogator, or similar words used herein, and may be configured to receive item identifiers from the acquisition device410. In various embodiments, one or more additional displays may be located such that they are visible from one or more additional work zones (e.g., an additional work zone located on the conveying mechanism after the intake location450). The one or more additional displays may be substantially similar to the display420. For example, the one or more additional displays may be configured to display image data to an additional user sorting items at an additional sorting location. The one or more additional displays may be configured to display the image data captured by the acquisition device410, or may be configured to present the updated image data captured by one or more additional acquisition devices. FIGS.6A and6BandFIGS.7A and7Bshow exemplary schematics showing the intake location450and a display420at particular points in time. As shown inFIG.6A, the intake location450contains four assets10moving along the conveying mechanism402(by analogy also relative to the improved conveying mechanism802) with a certain orientation. At the same time, the display420may be configured to present captured image data (e.g., video) containing representations of the same four assets10with corresponding display features451as shown inFIG.6B. In the embodiment depicted inFIG.6B, the display features451may be utilized to convey additional information to a user5(FIG.8) related to (e.g., assigned to) the asset10. For example, as shown inFIG.6B, the display features451indicate different designations for each of the assets10, depicted as “3A,” “4A,” and “4B,” which may indicate different sort locations400(FIG.8) to which each of the assets10are to be placed. FIG.7Ashows a second exemplary schematic of an intake location450; however as shown inFIG.7A, only one asset10is completely within the intake location450and two assets10are partially within the intake location450. The corresponding display420, shown inFIG.7B, presents captured image data of the one full item and two partial items corresponding to each of the items450at least partially within the intake location450and corresponding display features451located on or near each asset. Alternatively, the display420may incorporate a predetermined delay (e.g., 20 seconds), prior to presenting the image data (e.g., video) via the display420. Additional details in this respect may be understood from U.S. Ser. No. 15/390,109, the contents of which as are incorporated herein by reference in their entirety. D. Exemplary Location Device In various embodiments, one or more sort locations400may be associated with one or more location devices415configured for identifying one or more assets10being sorted to each sort location400. As non-limiting examples, such sort locations400may include one or more vehicles (e.g., aircraft, tractor-trailer, cargo container, local delivery vehicles, and/or the like), pallets, identified areas within a building, bins, chutes, conveyor belts, shelves, and/or the like. The one or more location devices415may be attached to a sort location400or located within a sort location400. Alternatively the one or more location devices415may be located adjacent to a sort location400or otherwise proximate the sort location400. In various embodiments, a location device415may be located proximate to an area designated to store the sort location400. For example, when the sort location400includes a delivery vehicle, a location device415may be located above each of a plurality of parking areas designated for one or more delivery vehicles. In various embodiments, the one or more location devices415may include components functionally similar to the control system100and/or the user device110. As noted above in referencing the control system100, the term “computing entity” may refer to, for example, one or more computers, computing entities, desktops, mobile phones, tablets, phablets, notebooks, laptops, distributed systems, gaming consoles (e.g., Xbox, Play Station, Wii), watches, glasses, key fobs, RFID tags, ear pieces, scanners, televisions, dongles, cameras, wristbands, kiosks, input terminals, servers or server networks, blades, gateways, switches, processing devices, processing entities, set-top boxes, relays, routers, network access points, base stations, the like, and/or any combination of devices or entities adapted to perform the functions, operations, and/or processes described herein. Like the user device shown schematically inFIG.3, the location device415can include an antenna, a transmitter (e.g., radio), a receiver (e.g., radio), and a processing element (e.g., CPLDs, microprocessors, multi-core processors, co-processing entities, ASIPs, microcontrollers, and/or controllers) that provides signals to and receives signals from the transmitter and receiver, respectively. The signals provided to and received from the transmitter and the receiver, respectively, may include signaling information in accordance with air interface standards of applicable wireless systems. In this regard, the location device415may be capable of operating with one or more air interface standards, communication protocols, modulation types, and access types. More particularly, the location device415may operate in accordance with any of a number of wireless communication standards and protocols, such as those described above with regard to the control system100. In a particular embodiment, the location device415may operate in accordance with multiple wireless communication standards and protocols, such as UMTS, CDMA2000, 1×RTT, WCDMA, TD-SCDMA, LTE, E-UTRAN, EVDO, HSPA, HSDPA, Wi-Fi, WiMAX, UWB, IR, NFC, Bluetooth', USB, and/or the like. Similarly, the location device415may operate in accordance with multiple wired communication standards and protocols, such as those described above with regard to the control system100via a network interface. Via these communication standards and protocols, the location device415can communicate with various other entities (e.g., the user device110) using concepts such as USSD, SMS, MMS, DTMF, and/or SIM dialer. The location device415can also download changes, add-ons, and updates, for instance, to its firmware, software (e.g., including executable instructions, applications, program modules), and operating system. According to one embodiment, the location device415may include a location determining aspect, device, module, functionality, and/or similar words used herein interchangeably. For example, the location device415may include outdoor positioning aspects, such as a location module adapted to acquire, for example, latitude, longitude, geocode, course, direction, heading, speed, UTC, date, and/or various other information/data. In one embodiment, the location module can acquire data, sometimes known as ephemeris data, by identifying the number of satellites in view and the relative positions of those satellites. The satellites may be a variety of different satellites, including LEO satellite systems, DOD satellite systems, the European Union Galileo positioning systems, the Chinese Compass navigation systems, Indian Regional Navigational satellite systems, and/or the like. Alternatively, the location information may be determined by triangulating the location device415's position in connection with a variety of other systems, including cellular towers, Wi-Fi access points, and/or the like. Similarly, the location device415may include indoor positioning aspects, such as a location module adapted to acquire, for example, latitude, longitude, geocode, course, direction, heading, speed, time, date, and/or various other information/data. Some of the indoor systems may use various position or location technologies including RFID tags, indoor beacons or transmitters, Wi-Fi access points, cellular towers, nearby computing devices (e.g., smartphones, laptops) and/or the like. For instance, such technologies may include the iBeacons, Gimbal proximity beacons, BLE transmitters, NFC transmitters, and/or the like. These indoor positioning aspects can be used in a variety of settings to determine the location of someone or something to within inches or centimeters. The location device415can also include volatile storage or memory and/or non-volatile storage or memory, which can be embedded and/or may be removable. For example, the non-volatile memory may be ROM, PROM, EPROM, EEPROM, flash memory, MMCs, SD memory cards, Memory Sticks, CBRAM, PRAM, FeRAM, NVRAM, MRAM, RRAM, SONOS, FJG RAM, Millipede memory, racetrack memory, and/or the like. The volatile memory may be RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, TTRAM, T-RAM, Z-RAM, RIMM, DIMM, SIMM, VRAM, cache memory, register memory, and/or the like. The volatile and non-volatile storage or memory can store databases, database instances, database management systems, data, applications, programs, program modules, scripts, source code, object code, byte code, compiled code, interpreted code, machine code, executable instructions, and/or the like to implement the functions of the location device415. As indicated, this may include a user application that is resident on the entity or accessible through a browser or other user interface for communicating with the control system100, user device110, and/or various other computing entities. In another embodiment, the location device415may include one or more components or functionality that are the same or similar to those of the control system100or user device110, as described in greater detail above. As will be recognized, these architectures and descriptions are provided for exemplary purposes only and are not limiting to the various embodiments. Additional details in this respect may be understood from U.S. Ser. No. 15/390,109, the contents of which as are incorporated herein by reference in their entirety. E. Exemplary Sort Location Referring toFIG.9, an exemplary sort location400is schematically depicted. As described above, the sort location400may include may include one or more vehicles (e.g., aircraft, tractor-trailer, cargo container, local delivery vehicles, and/or the like), pallets, identified areas within a building, bins, chutes, conveyor belts, shelves, and/or the like. In the embodiment depicted inFIG.9, the sort location400includes a plurality of shelves450onto which the assets10may be placed. WhileFIG.9depicts the plurality of shelves450as being stacked in a vertical direction, it should be understood that the shelves450may be arranged in any suitable configuration to hold the assets10. Each of the shelves450include one or more visual indicators452positioned on or proximate to the shelves450. The visual indicators452, much like the visual indicators810of the conveyor belt assembly800may assist in identifying an appropriate position for placement of the asset10within the sort location, as described in U.S. Pat. No. 9,156,628, which is incorporated herein in its entirety. In particular embodiments, for example, a user5(FIG.8) may utilize the indicia reader of the user device110to scan, read, or otherwise receive asset identifier data from the asset10to identify, in cooperation with the control system100, an appropriate position for placement of the asset10within the sort location400. In other embodiments, the control system100may determine the appropriate position for placement of the asset within the sort location400and convey that information to the user device110in response to the user device having recognized a unique pattern of stripes on the improved conveyor mechanism802and queried the control system regarding the same, as will be detailed elsewhere herein. Still further, the control system100may determine the appropriate position for placement of the asset10within the sort location400based on a variety of factors. For example and without limitation, the control system100may determine the appropriate position for placement of the asset10within the sort location400based on the destination of the assets10. When the sort location400includes a vehicle, such as a delivery truck, the assets10may be placed within the sort location400based on the order in which the assets10will be unloaded and delivered. In some embodiments, the control system100may identify an asset10designated for special or expedited handling (sometimes referred to as a “hot pull”) based on the asset identifier data, and the control system100may determine placement of the asset10to facilitate easy access to the asset10in the sort location400to allow expedited handling. In some embodiments, the control system100may utilize an algorithm based on the attributes of the asset (such as the size and/or shape of the asset10) to determine the placement of the asset10within the sort location400to optimize space and stability of the assets10within the sort location. One example of an algorithm to determine the placement of assets within the sort location400is described in U.S. Pat. No. 5,908,283, which is incorporated by reference herein in its entirety. When the control system100identifies the appropriate position for the asset10within the sort location400, the control system100may command one or more of the visual indicators452to provide a visual indication (e.g., by illuminating the visual indicator452) of the appropriate location for the asset10. Once the asset10is positioned in the appropriate location on the shelf450, the user5(FIG.8) may utilize the user device110to send a signal to the control system100that the asset10has been placed in the appropriate location. Alternatively, the sort location400may include a user interface, such as a keyboard, a touchscreen, or the like, that the user5may communicate with the control system100that the asset10has been placed in the appropriate location. In some embodiments, the sort location400may include one or more sensors, such as a light sensor, proximity sensor, or the like, configured to detect the presence of an asset10within the sort location400, and the sensors may send a signal to the control system100when the asset10has been placed into the appropriate location. Additional details in this respect may be understood from U.S. Ser. No. 15/390,109, the contents of which as are incorporated herein by reference in their entirety. It should be understood that according to various embodiments, the visual indicators452/810may be computer-generated and/or overlaid over an augmented reality environment, which may in certain embodiments be displayed to the user via utilized user devices110(e.g., glasses worn by the user; seeFIG.4).FIGS.15A-Fillustrate exemplary visual indicators452/810that may be utilized. InFIG.15F, an augmented reality environment1006, including a conveying mechanism402/802and a sort location400, is displayed. With reference toFIGS.15A-B, as previously described, certain of the visual indicators810generated may convey to a user5standing adjacent the conveying mechanism402/802a “push forward” (or let pass) indicator1001or “push to the other side” indicator1002, instructing movement of assets10not identified for association with and sorting by that particular user.FIG.15C, in contrast, illustrates an exemplary visual indicator810conveying to a user5that the asset10with which the indicator is associated is selected for “pick and sort”1003by that particular user. In the illustrated embodiment ofFIG.15C, the “pick and sort” indicator1003is illustrated as being positioned beside the asset; in other embodiments, however (seeFIG.10) the visual indicators810may be positioned atop or otherwise substantially overhead of each asset10. Relative specifically to the exemplary sort location400ofFIG.9,FIGS.15D-Eillustrate exemplary visual indicators452that might be overlaid in an augmented reality environment according to various embodiments.FIG.15D, in particular, illustrates a plurality of “look that way” indicators1004that may be configured to guide the user5toward the correct sort location for a held asset.FIG.15E, by way of comparison, illustrates a “sort here” indicator1005, so as to convey to the user5the correct sorting location. AlthoughFIGS.15A-Fillustrate the various exemplary visual indicators452/810therein as red or green arrows and/or a green placard containing some portion of asset data printed thereon (seeFIG.15E), it should be understood that any of a variety of indicators—color or not—may be provided, so long as each are configured to, via the augmented reality (e.g., a mixed reality or hybrid reality) environment1006described herein to guide the user5utilizing a user device110as described herein to the proper sort location for respective assets10. In at least one embodiment, a floating green sphere that signals the correct location may be provided; in another embodiment, a white frame with green corners that highlight the correct location may be provided. In still other embodiments, any indicator configured to simplistically and succinctly convey correct location data may be utilized. IV. EXEMPLARY CONTROL SYSTEM CONFIGURATION In various embodiments, the control system100may comprise a plurality of modules, each module configured to perform at least a portion of the functions associated with the methods described herein. For example, the control system100may comprise an acquisition module, a sort location module, a matching module, and a notification module. Although described herein as being individual components of the control system100, the various modules may operate on a combination of one or more devices (e.g., the acquisition/display device115, the user device110, the location device415, and/or the control system100), such that each device performs the functions of one or more modules. A. Acquisition Module In various embodiments, the acquisition module may be configured to obtain asset identifier data and/or conveyor belt data regarding and/or associated with an asset10to be sorted. In various embodiments, the asset identifier data may comprise a unique asset identifier such as a tracking number or code, and data defining the one or more appropriate sort locations400for the asset10as it moves between an origin and a destination, and/or the like. In various embodiments, the conveyor belt data may comprise at least a portion of a unique pattern of colored stripes808(seeFIG.16B) provided on the conveying mechanism802, whereby capture of the unique pattern of colored stripes immediately surrounding (and under) the asset10occurs as the asset10moves between an origin and a destination, and/or the like. As a non-limiting example, the acquisition module may be configured to obtain data from the user device110(FIGS.3and4) and/or the acquisition device410(FIG.5). In various embodiments, the data received from the user device110(FIGS.3and4) and/or the acquisition device410(FIG.5) may include the entirety of the asset identifier data and therefore the acquisition module need only receive asset identifier data from one of the user device110(FIGS.3and4) and/or the acquisition device410(FIG.5). However, in various embodiments, the data received from the user device110(FIGS.3and4) and/or the acquisition device410(FIG.5) may comprise only a portion of the asset identifier data, and the acquisition module may be configured to obtain the remainder of the asset identifier data from one or more other sources. As a non-limiting example, the acquisition module may be configured to search one or more databases in communication with the control system100for asset identifier data corresponding to the data received from the user device110(FIGS.3and4) and/or the acquisition device410(FIG.5). The acquisition module may additionally be configured to receive and store at least a portion of the asset identifier data corresponding to the asset10that is stored in one or more databases. In various embodiments, the acquisition module may be configured to transmit at least a portion of the asset identifier data to one or more devices (e.g., the user device110, the location device415, the display420, and/or the control system100) and/or one or more modules (e.g., the sort location module, the matching module, and/or the notification module). Moreover, upon receiving the asset identifier data regarding an asset10to be sorted, the acquisition module may be configured to link or otherwise associate the user device110and the asset identifier data. As will be described in greater detail herein, the user device110may be associated with the asset identifier data by storing at least a portion of the asset identifier data in a memory associated with the user device110. As mentioned, the acquisition module may be configured to, in addition to asset identifier data, also obtain conveyor belt data, the latter comprising a visual image capture of at least a portion of the unique pattern of colored stripes808provided on the conveying mechanism802. In those embodiments that the acquisition module is so configured, the module may be additionally configured to associate the captured portion of the unique pattern of colored stripes808with the captured/obtained asset identifier data, such that the asset10is associated with or otherwise “assigned to” the captured portion of the pattern. In this manner, as described elsewhere herein, the user device110may be configured to recognize only portions of the pattern and therefrom identify an asset associated therewith, as previously captured via the acquisition device415. B. Sort Location Module The sort location module may be configured to receive asset identifier data from the acquisition module. The sort location module is configured to ascertain the appropriate sort location400and/or the appropriate position within the sort location400for the asset10based at least in part on the asset identifier data. In certain embodiments, the sort location module may be configured to determine the appropriate sort location400based at least in part on the asset identifier data and sort location data that is associated with the each of the plurality of sort locations400. The sort location data may be generated based not only upon the asset identifier data, but also upon associated conveyor belt data. In various embodiments, each of the plurality of sort locations400may be identified by sort location data, which may include a unique sort location identifier. The unique sort location identifier may comprise a unique character string individually identifying each of the plurality of sort locations400. In various embodiments, the sort location data may define any subsequent processing to be performed on assets10within each sort location400, and may comprise the unique sort location identifier for each of the plurality of sort locations400the assets10will pass through. In various embodiments, the sort location module may determine whether the processing to be performed on assets10in each of the plurality of sort locations400(as defined in the sort location data) will move the asset10closer to its final destination. In various embodiments, the sort location module may determine whether the processing steps to be performed on the assets10in each of the sort locations400complies with the service level (e.g., Same Day shipping, Next Day Air, Second Day Air, 3 Day Select, Ground shipping, and/or the like) corresponding to the asset10. As a non-limiting example, the sort location module may determine the appropriate sort location for an asset10to be delivered to 123 Main Street, Atlanta, Georgia is a delivery vehicle that will deliver other assets10to the same address or nearby addresses (e.g., along the same delivery route). As a second non-limiting example, the sort location module may determine the appropriate sort location for an asset10to be delivered to 345 Broad Street, Los Angeles, California via Next Day Delivery is a pallet to be loaded onto a plane destined for Los Angeles, California. After determining the appropriate sort location400and/or the appropriate position for the asset10within the sort location400, the sort location module may be configured to transmit data defining the appropriate sort location400and/or the appropriate position for the asset10within the sort location400to one or more devices (e.g., the user device110, the display420, the visual indicator452, the location device415, and/or the control system100) and/or modules (e.g., the matching module and/or the notification module). Additional details in this respect are provided in U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. C. Matching Module The matching module may be configured to receive asset identifier data and/or conveyor belt data from the acquisition module and/or the sort location module, and may be configured to receive data defining the appropriate sort location from the sort location module. Moreover, the matching module may be configured to receive data indicating the user device110(and consequently the asset10) is proximate a first sort location400. In various embodiments and referring toFIG.5, the user device110and/or one or more location devices415may determine that the user device110is within a communication area405corresponding to the one or more location devices415, and is therefore proximate to the first sort location400corresponding to the one or more location devices415. As a non-limiting example, each of the one or more location devices415may be embodied as a wireless beacon broadcasting a signal indicating the identity of the associated sort location. In various embodiments, each sort location may be associated with a plurality of such location devices415. The user device110may be configured to receive the wireless signals broadcast from the plurality of location devices415and determine whether the received signal satisfies one or more signal criteria. For example, the user device110may determine whether the signal received from each of the plurality of location devices415satisfies a predetermined signal strength threshold and/or may determine whether wireless signals are received from at least a minimum number of location devices415broadcasting data regarding a single sort location. Upon a determination that the signal received from the plurality of location devices415satisfies each of the signal criteria, the user device110may transmit asset identity data and sort location identity data to the matching module to determine whether the user device110is proximate the appropriate sort location for the asset. Upon determining the user device110is proximate a first sort location400, at least one of the user device110and the one or more location devices415may transmit data indicating the user device110is proximate the first sort location400to the matching module. The data indicating that the user device110is proximate the first sort location400may also be indicative of the identity of the first sort location400(e.g., the data may comprise the unique sort location identifier corresponding to the first sort location400). The matching module may be configured to determine whether the first sort location400is the appropriate sort location based at least in part on the received data defining the appropriate sort location. In various embodiments, the matching module may be configured to transmit data indicating whether the first sort location400is the appropriate sort location to one or more devices (the user device110and/or the one or more location devices415) and/or one or more modules (e.g., the notification module). For example, upon a determination that the proximate sort location400is the appropriate sort location, the matching module may generate and transmit confirmation data to the notification module for additional processing. Alternatively, upon a determination that the proximate sort location400is not the appropriate sort location, the matching module may generate and transmit mistake data to the notification module for additional processing. In various embodiments, the matching module may additionally be configured to link and/or associate the asset identifier data and the sort location identifier data corresponding to the sort location400at which the asset is deposited. As a non-limiting example, the asset identifier data may be updated to reflect the link between the asset identifier data and the sort location identifier data. Alternatively, the sort location identifier data may be updated to reflect each of the assets associated with the sort location400. As described herein, the matching module may be configured to link the asset identifier data and the sort location identifier data upon the occurrence of a triggering event, as will be described in greater detail herein. To link and/or associate the asset identifier data and the sort location identifier data corresponding to the sort location400at which the asset it deposited, the matching module may receive at least a portion of the asset identifier data and at least a portion of the location data and associate these data in, for example, one or more databases. As previously noted, however, the matching module may be configured to associate the asset identifier data and the sort location data by updating at least one of the asset identifier data or the sort location data to reflect the association. Again, the updated data may be stored in one or more databases. Additional details in this respect are provided in U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. D. Notification Module In various embodiments, the notification module may receive data indicating whether the first sort location400is the appropriate sort location from the matching module. As described herein, the notification module may cause one or more alerts to be generated in order to notify the user5(e.g., sort personnel) whether the asset10should be deposited in the first sort location400. For example, the notification module may be configured to transmit confirmation data and/or mistake data to the user device110, the display420, and/or the one or more location devices415in order to cause at least one of the devices to generate an alert discernible by the user5(e.g., sort personnel) indicative of the appropriate sort location for the asset10. To ascertain whether confirmation data and/or mistake data is appropriate for transmission, the user device110(and/or sensors associated therewith, e.g., three-dimensional sensors) may be configured to determine not only the position of the asset but also the position of the user's hands (e.g., including not only location, but also gestures), so as to gauge whether or not sorting of the asset is proceeding properly. In various embodiments, the notification module may cause the user device110to display a confirmation message upon a determination that the first sort location400is the appropriate sort location. As non-limiting examples, the confirmation message may indicate that the first sort location400is the appropriate sort location, or the confirmation message may indicate that an asset has been deposited at the appropriate sort location400. Alternatively, the notification module may cause a light located near the first sort location400to illuminate upon a determination that the first sort location400is the appropriate sort location400. As yet another non-limiting example, the notification module may cause the user device110to display a message upon a determination that the first sort location400is not the appropriate sort location400. Similarly, the notification module may cause a light located near the first sort location400to illuminate upon a determination that the proximate sort location400is not the appropriate sort location. In various embodiments, the notification module may cause one or more sounds to be generated, one or more lights to illuminate, one or more mechanical assemblies to move, and/or other processes discernible by a user5to operate and thus indicate to the user5whether the first sort location400is the appropriate sort location. Moreover, the notification module may be configured to generate an alert after associating asset identifier data with location data. The notification module may be configured to generate an alert to inform the user5(e.g., sort personnel) or other users regarding asset identifier data being associated with location data. As a non-limiting example, the notification module may be configured to cause a message to be displayed via the user device110and/or the display420in order to notify the user5that asset identifier data corresponding to an asset10has been associated with location data corresponding to a sort location. Thus, the notification module may facilitate a determination that asset identifier data has been incorrectly associated with location data, and may therefore facilitate the correction of an inappropriate association. For example, based upon the generated alert, the user5may determine that the asset identification data was incorrectly associated with a location data corresponding to a first sort location400. Additional details in this respect are provided in U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. According to various embodiments, whether adjacent a sort location400or a conveying mechanism802, the notification module may be configured to generate one or more visual indicators452/810to convey sorting instructions to the user5. It should be understood that according to various embodiments, the visual indicators452/810may be computer-generated and/or overlaid over an augmented reality environment, which may in certain embodiments be displayed to the user via utilized user devices110(e.g., glasses worn by the user; seeFIG.4).FIGS.15A-Fillustrate exemplary visual indicators452/810that may be utilized. InFIG.15F, an augmented reality environment1006, including a conveying mechanism402/802and a sort location400, is displayed. With reference toFIGS.15A-B, as previously described, certain of the visual indicators810generated may convey to a user5standing adjacent the conveying mechanism402/802a “push forward” (or let pass) indicator1001or “push to the other side” indicator1002, instructing movement of assets10not identified for association with and sorting by that particular user.FIG.15C, in contrast, illustrates an exemplary visual indicator810conveying to a user5that the asset10with which the indicator is associated is selected for “pick and sort”1003by that particular user. In the illustrated embodiment ofFIG.15C, the “pick and sort” indicator1003is illustrated as being positioned beside the asset; in other embodiments, however (seeFIG.10) the visual indicators810may be positioned atop or otherwise substantially overhead of each asset10. Relative specifically to the exemplary sort location400ofFIG.9,FIGS.15D-Eillustrate exemplary visual indicators452that might be overlaid in an augmented reality environment according to various embodiments.FIG.15D, in particular, illustrates a plurality of “look that way” indicators1004that may be configured to guide the user5toward the correct sort location for a held asset.FIG.15E, by way of comparison, illustrates a “sort here” indicator1005, so as to convey to the user5the correct sorting location. Additionally, althoughFIGS.15A-Fillustrate the various exemplary visual indicators452/810therein as red or green arrows and/or a green placard containing some portion of asset data printed thereon (seeFIG.15E), it should be understood that any of a variety of indicators—color or not—may be provided, so long as each are configured to, via the augmented reality environment1006described herein to guide the user5utilizing V. EXEMPLARY SYSTEM OPERATION A. Exemplary Acquisition Device Operation FIGS.5,10, and15Fillustrate an exemplary environment in which assets10are moved from an intake location450(e.g., an unsorted location) to one or more sort locations400. In various embodiments, a user5(e.g., sort personnel) may utilize a user device110as described herein while transporting assets10from an intake location450to one or more sort locations400. As described herein, the user device110may be configured for receiving information regarding a particular asset10to be sorted, and for informing the user5whether the asset10is being sorted to the appropriate sort location. FIG.11illustrates exemplary steps carried out by the acquisition device115according to various embodiments of the present invention. As illustrated inFIG.11, the acquisition device115may be configured to receive at Block901asset identifier data associated with an asset10to be sorted and conveyor belt data related to a unique pattern of colored stripes808adjacent and/or surrounding the asset on the conveying mechanism802. In various embodiments, the acquisition device115may scan, read, image, or otherwise obtain/capture the asset identifier data from the asset10; the conveyor belt data may be obtained generally via an imaging capability within the acquisition device, as previously described herein. As noted herein, the asset identifier data may be printed or otherwise affixed to the asset10to be sorted. In various embodiments, the user device110and/or the acquisition device410may receive asset identifier data by, for example, reading an RFID tag associated with the asset10, reading a bar code, QR code, character string, and/or symbol printed on the asset10or otherwise associated with the asset10, and/or otherwise obtaining asset identifier data regarding the asset10to be sorted. The user device110may be configured to store the asset identifier data in a memory associated with the user device for later retrieval and use. As noted above, in various embodiments, the asset identifier data may comprise a unique asset identifier, such as a tracking code or other unique identifier. Alternatively or additionally, the asset identifier data may comprise origin identifying data (e.g., origin address, shipper identity, and/or the like), destination identifying data (e.g., destination address, recipient identity, and/or the like), service level data (e.g., Same Day shipping, Next Day Air, Second Day Air, 3 Day Select, Ground shipping, and/or the like), and/or the like. As described above, the asset identifier data may additionally include indications designating an asset10for special or expedited handling. Moreover, in various embodiments, the asset identifier data may comprise more detailed data regarding the asset10to be sorted, such as sort locations400for each intermediate shipping point. In various embodiments, the asset identifier data may be updated at various times during the shipping process. For example, after determining an appropriate sort location400for the asset10to be sorted (a process described in greater detail herein), the asset identifier data may be updated to reflect the appropriate sort location400. The asset identifier data400may additionally be updated to reflect the appropriate position of the asset10within the sort location400. Alternatively, the asset identifier data may be fixed after being created, such that it is not updated with new and/or alternative information during shipment. As noted above, in various embodiments, the conveyor belt data may comprise a unique pattern of colored stripes808(see alsoFIG.16B) that may be provided upon the conveying mechanism802. In certain embodiments, the unique pattern may be generated via utilization of a color spectrum806containing at least seven distinct colors806A-806G. By providing, for example, seven distinct colors, certain embodiments provide over 200 unique permutations (where groupings of colors are limited to three stripes, as detailed previously herein) that may be readable by the user device110at a distance of up to 94 meters (although such distance is typically not necessary). In this manner, though, the various embodiments provided herein eliminate the need for a user5utilizing the user device110to have to physically position themselves very close to the conveying mechanism802so as to be able to scan, read, or otherwise capture specific asset identifier data from each respective asset10. Instead, from further distances, the user device110may capture only monitor for and recognize unique patterns of stripes on the conveying mechanism802, whereby upon recognition thereof (as detailed elsewhere herein) sort location data may be generated without any scan of asset identifier data by the user device110. FIG.16Billustrates an exemplary conveying mechanism802having thereon a unique pattern of colored stripes808. Subsets thereof (see808A-808H) are also unique and may comprise sets of three, four, or even more consecutive stripes, as detailed elsewhere herein. At least a portion of the unique pattern808—typically at least one of the subsets thereof (e.g., one of808A-808H, whether a set of three or four or more stripes)—is that which is captured by the acquisition device in Block901. Specifically captured is that subset of the unique pattern (which is also unique as a subset) that is surrounding (i.e., adjacent to and passing underneath) the asset10for which asset identifier data is received Returning now toFIG.11, in Block902, which the above-detailed combination of asset identifier data and conveyor belt data, the acquisition device115proceeds to associate or otherwise somehow assign or correlate the asset identifier data with conveyor belt data corresponding thereto (i.e., conveyor belt data surrounding, adjacent to and passing underneath, the location of the asset10on the conveying mechanism802). This associated set of data (asset and conveyor belt related alike) is transmitted to the control system100in Block903. In certain embodiments, the associated set of data may be transmitted directly from the acquisition device to the user device; however, in other embodiments—for example where multiple user devices may be being utilized, transmission first to the control system enables proper redistribution thereof via the control system, which may be centralized. In certain embodiments wherein the acquisition device115includes not only an acquisition element410but also a display element420, the acquisition device115may be further configured to execute Blocks904and905. In at least these embodiments, upon receipt of appropriate sort location from the control system in Block904, the acquisition device may be configured to generate appropriate sort location data in Block905for display to a user5. Such sort location data may be computer-generated in the form of indicators or notifications, considering for example the visual indicators452/810, along with those indicators1001-1005illustrated inFIGS.15A-E. In other embodiments, however, the acquisition device115need not execute Blocks904/905, as the augmented reality environment—and the visual indicators and/or associated notifications (visual, audible, or the like)—are generated at each user device110and not at the acquisition device115(or more specifically any display element420thereof). B. Exemplary User Device Operation FIGS.5,10, and15Fillustrate an exemplary environment in which assets10are moved from an intake location450(e.g., an unsorted location) to one or more sort locations400. In various embodiments, a user5(e.g., sort personnel) may utilize a user device110as described herein while transporting assets10from an intake location450to one or more sort locations400. As described herein, the user device110may be configured for receiving information regarding a particular asset10to be sorted, and for informing the user5whether the asset10is being sorted to the appropriate sort location. FIG.12illustrates exemplary steps carried out by the user device110according to various embodiments of the present invention. As illustrated inFIG.11, the user device110may be configured to monitor and capture conveyor belt data associated with an asset10(yet to be identified) to be sorted at Block501. In various embodiments, the user5may utilize an imaging component of the user device110to capture conveyor belt data—specifically a portion of the unique pattern of colored stripes, the portion or subset thereof also being unique, as described elsewhere herein—surrounding (e.g., adjacent and passing under) the asset10. In Block502the user device110transmits the captured conveyor belt data to the control system100, and in response receives in Block503from the control system appropriate sort location. As described elsewhere herein, the control system100is able to return the appropriate sort location in Block503due to an association made between the conveyor belt data and the asset identifier data captured by the acquisition device115upstream of the user's utilization of the user device110(seeFIGS.5and10). In Block504ofFIG.12, the user device110is configured to generate appropriate sort location data. Alternatively or additionally, as previously described herein, a display element420of the acquisition device may be configured to inform the user5of the appropriate sort location400for a particular asset10at Block904. In those embodiments, though, where the user device110is user-worn, generation of appropriate sort location data occurs thereon, so as to provide a user-perspective augmented reality environment. As a non-limiting example, the user device110may cause display of the appropriate sort location via the display114to the user5(e.g., sort personnel) or may audibly inform the user5of the appropriate sort location for the asset10. In one embodiment, the display114of the user device110(e.g., glasses) may display an indication of the appropriate sort location400shown superimposed over or positioned proximate to the asset10. For example, upon receiving the appropriate sort location400from the control system100, the user device110may display an indication of the sort location400on the display114. In such embodiments, the user device110may display the indication of the sort location400on the display114regardless of the FOV of the user device110. Alternatively, in some embodiments, the presentation of the indication of the sort location400on the display114may be dependent upon a detected FOV of the user device110. For example, as described above, the user device110may detect an asset10within its FOV. Upon detecting an asset10within the FOV of the user device110, the local computer120of the user device110may generate an augmented reality (AR) image or layer for presentation on the display114. The AR image or layer may be based on the detection of the asset10by the user device110and the received appropriate sort location400from the control system100. The user device110may then display the AR image or layer on the display114such that the sort location400is overlaid over or positioned proximate to the asset10when the asset10is within the FOV of the user device110. In embodiments including the display420(FIG.5), the indication of the appropriate sort location may be shown on the display420and/or projected onto the asset10. The displayed sort location400may comprise a sort location identifier, such as a symbol, character string, and/or the like. Additionally, in various embodiments, information indicative of the appropriate sort location may be printed on the asset10(e.g., directly onto a surface of the asset10, onto a sticker or other label secured to the asset10, and/or the like). In various embodiments, the user device110and/or the display420may not display the appropriate sort location for the asset10, and accordingly the user5may rely on the information printed on the asset10to determine the appropriate sort location. Accordingly, in such embodiments, after receiving asset identifier data as illustrated in Block501ofFIG.10, the user device may be configured to thereafter await receipt of sort location data as illustrated in Block505. Additional details in this respect may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. Returning momentarily to Blocks501-504collectively, although described previously herein as a process whereby the user device110captures conveyor belt data and transmits that to the control system, so as to receive back from the control system an appropriate sort location, in certain embodiments, depending upon local storage and memory capacities of the user device, Block502may be eliminated. In at least these embodiments, the user device110may receive sort location data, asset identifier data, and conveyor belt data periodically (or in a near real-time manner) from the control system100without having to request any of the same (i.e., by transmission of conveyor belt data). In this manner, the user device110may be configured to simply monitor the conveying mechanism802and upon identification thereon of a unique pattern of colored stripes808, determine locally whether each iteratively recognized pattern is associated (as previously done via the control system100) with a particular asset10. If so, the user device flow proceeds to Block504, generating appropriate sort location data based upon that data previously transmitted by the control system to the user device. Turning now to Block505, the user5(e.g., sort personnel) may transport the asset10and the user device110to a sort location400. As the user5nears the sort location400(e.g., enters the communication area405corresponding to the sort location400), the user device110may establish a wireless communication connection with one or more location devices415associated with the sort location400and receive sort location data from the one or more location devices415at Block505. As the user device110is moved proximate the sort location, the user device110receives the signals broadcast by one or more of the location devices415at Block505. At Block506the user device110may determine whether the received signals satisfy one or more signal criteria in order to validate the identity of the proximate sort location. For example, the user device110may determine whether the signal strength received from each of the one or more location devices415satisfies a predetermined signal strength threshold (e.g., the signal strength threshold may define a minimum signal strength). Moreover, the user device110may determine whether a signal is received from a minimum number of location devices415associated with a particular sort location. As yet another example, the user device110may determine whether a signal indicating that the user device is proximate to sort location400from at least 3 location devices415each broadcasting the identity of the sort location400. In various embodiments, the user device110may determine whether two or more signal criteria are satisfied (e.g., the signal strength threshold and the minimum number of location devices415). Such criteria may impede false positive determinations that the user device110is proximate a particular sort location. Additional details in this respect may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. Upon determining that the signals received by the user device110satisfy the one or more signal criteria, the user device110may transmit the sort location identity data received from the one or more location devices415and the asset identity data to the control system100at Block506. The control system100may then determine whether the user device110is proximate the appropriate sort location for the asset. The control system100may be configured to transmit an indication of whether the user device110is proximate the appropriate sort location to the user device110. Alternatively, after the user device110enters the communication area405, the user device110may be configured to transmit the asset identifier to the location devices415. In various embodiments wherein the asset identifier data comprises data regarding the appropriate sort location for the asset10, the location devices415may be configured to transmit data indicating whether the user device110, and consequently the user5and asset10, is proximate the appropriate sort location (e.g., within the communication area405) to the user device110. In various embodiments, the one or more location devices415may be configured to transmit at least a portion of the asset identifier data to the control system100, which may be configured to determine whether the user device110is proximate the appropriate sort location. The control system100may be configured to transmit an indication of whether the user device110is proximate the appropriate sort location to the one or more location devices415, which may be configured to transmit an indication of whether the user device is proximate the appropriate sort location to the user device110. Additional details in this respect may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. Referring again toFIG.8, upon a determination that the user device110is proximate an incorrect sort location400(e.g., within a communication area405corresponding to a final delivery vehicle that does not travel to the asset's10destination address) at Block508, at least one of the control system100and/or the one or more location devices415may be configured to transmit mistake data to the user device110, and the user device110may be configured to receive the mistake data at Block512. Upon receiving the mistake data, the user device110may be configured to generate a mistake message to inform the user5(e.g., sort personnel) that the asset10is proximate an incorrect sort location400at Block513. Alternatively or additionally, the display420may be configured to display a mistake message to inform the user5that the asset10is proximate to an incorrect sort location400at Block513. Additional details in this respect may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. Thus, as a non-limiting example, mistake data may be generated if the user5approaches an incorrect sort location and/or enters an incorrect sort location. As indicated at Block514, the user device110may unlink the asset identifier data and the user device110such that the asset identifier data is cleared from the memory of the user device110such that the asset identifier data is no longer stored in the memory of the user device110upon the occurrence of a triggering event. Such triggering event may be, for example, reading, scanning, or otherwise receiving asset identifier data (e.g., via the indicia reader device) while the user device110is in the communication area405, losing connection between one or more location devices415and the user device110(e.g., upon a determination that the wireless communication connection between the plurality of location devices415and the user device110no longer satisfy the signal criteria), after receiving asset identifier data regarding a second asset10, and/or otherwise after a triggering event. In various embodiments, the user device110may be configured to reset, or otherwise dissociate the asset identified data from the user device110upon the occurrence of a triggering event. Accordingly, in the event that the user device110is located proximate an incorrect sort location, the user may be required to rescan the indicia associated with the asset10to relink the asset identified data with the user device110before transporting the asset10to the appropriate sort location. This may be associated further with a re-sort of the item or asset10in Block515, for which additional details in this respect may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. Referring again to Block508, the process may proceed after transmission of the asset identifier data and/or sort location identifier data to the one or more location devices415and/or control system100(illustrated as Block507) with reference to Blocks509-511if the user5approaches the appropriate sort location. Upon a determination that the user device110is proximate and/or within the appropriate sort location (e.g., within the communication area405corresponding to the appropriate sort location), the control system100and/or the one or more location devices415may be configured to transmit confirmation data to the user device110indicating the user device110is proximate the appropriate sort location for the asset10, and the user device110may be configured to receive the confirmation data at Block509. Upon receiving the confirmation data, the user device110may be configured to generate a confirmation message to inform the user5(e.g., sort personnel) that the asset10is near the appropriate sort location400at Block510. Alternatively or additionally, the display420may be configured to display a confirmation message to inform the user5that the asset10is near the appropriate sort location400at Block510. As a non-limiting example, the user device110may be configured to cause display of a confirmation message via the display114, emit a confirmation sound, and/or otherwise provide the user5with confirmation that the user device110is proximate the appropriate sort location. In various embodiments, after receiving the confirmation data, the user device110may be configured to associate the asset identifier data with a sort location identifier. Alternatively, the asset identifier data may be transmitted to the control system100, which may be configured to associate the asset identifier data with the sort location data. After receiving the confirmation data and/or after another triggering event, the user device110may be configured to dissociate, unlink, delete, clear, or otherwise remove the asset identifier data regarding the recently sorted asset10from the active memory of the user device110at Block511. The user device110may be configured to unlink the asset identifier data after the user device110determines that the one or more signal criteria are no longer satisfied, after a predetermined amount of time after receiving the confirmation data; after scanning, reading, or otherwise receiving the asset identifier data regarding the asset10(e.g., via the indicia reader) while the user device110is located within the communication area405; after receiving asset identifier data regarding a second asset10; after receiving user input via the user device110; and/or otherwise after a triggering event. The user device110may be utilized to receive asset identifier data regarding a subsequent asset10to be sorted, and the process may be repeated. The user device110may have any of a variety of configurations. For example, the user device110may not transmit or receive data (e.g., asset identifier data) from the control system100, and may instead only transmit and receive data from one or more location devices415. Moreover, the user device110may not generate and/or display appropriate sort location data, and instead the user5(e.g., sort personnel) may be required to ascertain the appropriate sort location for an asset10without a reminder or other indication from the user device110. Alternatively, the appropriate sort location may be printed on the asset10in human readable form such that the user5(e.g., sort personnel) may determine the appropriate sort location based on information printed on or otherwise physically associated with the asset10. As yet another alternative, the user device110need not establish a new connection with one or more proximate location devices415each time the user device enters a connection area405. In various embodiments, the user device110may be configured to associate the asset identifier data and the location data prior to a determination whether the first sort location400is the appropriate sort location for the asset10. Alternatively, the user device110may be configured to associate the asset identifier data and the location data without determining whether the first sort location400is the appropriate sort location for the asset10. The user device110may be further configured to generate one or more alerts regarding the association between the asset identifier data and the location data. The user device110may be configured to generate an alert to inform the user5(e.g., sort personnel) or other users regarding asset identifier data being associated with location data. Additional details in this respect and otherwise related to the user device110operation relative to a particular sort location400may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. C. Exemplary Location Device Operation In various embodiments, each sort location may be associated with a plurality of location devices415embodied as wireless beacons each configured to broadcast data indicative of the identity of the associated sort location400such that the user device110may receive such broadcast data. Accordingly, each location device415may be configured to establish a one-way communication connection with a user device110such that each of the location devices415may transmit data, but not receive data from the user device110. For example, each location device415may be configured to transmit data indicative of the identity of the sort location400to the user device110upon the user device entering the broadcast area of the location device415. The user device110may then be configured to transmit the sort location identity data and/or the asset identity data indicative of the identity of the asset being transported by the user to the control system100for additional processing. Alternatively, each location device415may be configured to transmit and/or receive data from the user device110and/or the control system100.FIG.13illustrates exemplary steps carried out by a location device415according to various embodiments of the present invention. As illustrated inFIG.13, each location device415may receive asset identifier data at Block601. The asset identifier data may be transmitted to one or more location devices415from a user device110. Additional details in this respect may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. In various embodiments, the location device415may be configured to transmit at least a portion of the received asset identifier data to the control system100at Block602. The control system100may be configured to determine the appropriate sort location for the asset10based at least in part on the asset identifier information received from the location device415. Alternatively, the location device415may be configured to determine whether the sort location400associated with the location device is the appropriate sort location for the asset10. Additional details in this respect may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. As indicated at Block603, the remaining steps to be completed may be selected based at least in part on a determination of whether the location device415corresponds to the appropriate sort location400. Upon a determination that the sort location400associated with the location device415is not the determined appropriate sort location, the location device is configured to receive mistake data at Block607. At Block608, the location device415may be configured to transmit the mistake data to the user device110(see alsoFIG.15D). The user5(e.g., sort personnel) may then continue transporting the asset10(and consequently the user device110) to another sort location400at Block609, and the process ends at Block611. Additional details in this respect may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. Referring again to Block603, the process may proceed after transmission of the asset identifier data to the control system100(illustrated as Block602) with reference to Blocks604606if the user5approaches the appropriate sort location (see alsoFIG.15E). Upon a determination that the sort location400associated with the location device415is the appropriate sort location, the location device may be configured to receive confirmation data at Block604. As indicated herein, the confirmation data may indicate that the user device110is proximate the appropriate sort location. At Block605, the location device415may be configured to transmit the confirmation data to the user device110and/or the display420. As indicated herein, the user device110and/or the display420may be configured to generate an indication discernible by the user5that the proximate sort location400(i.e., the sort location400associated with the location device415) is the determined appropriate sort location for the asset10(see again,FIG.15E). The user5(e.g., sort personnel) may then deposit the asset10at the appropriate sort location. At Block606, the location device415may associate the asset identifier data with sort location identifier data upon the occurrence of a triggering event. As non-limiting examples, the triggering event may be the expiration of a predetermined amount of time after receiving or generating confirmation data, the reception of asset identifier data while the user device110is within the communication area405, the reception of user input via the user device110, and/or the like. The location device415may have any of a variety of different configurations. Additional details in this respect may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. D. Exemplary Control System Operation FIG.14illustrates exemplary steps carried out by the control system100according to various embodiments of the present invention. As illustrated inFIG.14, the control system100may receive asset identifier data and conveyor belt data at Block701. As indicated herein, the asset indicator data may be received from the user device110, the acquisition device115, and/or the one or more location devices415. The conveyor belt data (e.g., the imaging of unique portions of the pattern of colored stripes808on the conveying mechanism802(seeFIGS.10and16B)) may be received from the user device110and/or the acquisition device115. Further details regarding the scope and contents of the asset identifier data and the conveyor belt data have been described previously herein. Relative to the asset identifier data, still additional details in this respect may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. At Block702, the control system100may be configured to determine the appropriate sort location400for the asset10and/or the appropriate position within the sort location for the asset10. In various embodiments, the determination of the appropriate sort location for the asset10may be based at least in part on the received asset identifier data. Moreover, the control system100may utilize sort location data corresponding to each of the sort locations400to determine whether any subsequent processing to be performed on assets10at each sort location400will move the asset10closer to its final destination. As a non-limiting example, the control system100may determine the appropriate sort location for an asset10to be delivered to 123 Main Street, Atlanta, Georgia is the delivery vehicle that will deliver other assets10to 123 Main Street, Atlanta, Georgia. Additional details in this respect may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. Referring again toFIG.14, at Block703the control system100may be configured to transmit data identifying the appropriate sort location to the user device110. As noted herein, the user device110and/or the display420may be configured to generate an indicator (e.g., visual indicators452/810) discernible by the user5(e.g., sort personnel) regarding the appropriate sort location for the asset10. However, as noted herein, each asset10may have information indicative of an appropriate sort location printed thereon, and accordingly the control system100may not transmit appropriate sort location data to the user device110and/or the display420for display to the user5. In certain embodiments, the sort location data transmitted in Block703by the control system100may be associated not only with the asset10but also the unique pattern of colored stripes808received and associated therewith (e.g., as may be received from the acquisition device115, as detailed elsewhere herein). In these and other embodiments, the sort location data may be configured to facilitate identification of the asset10by a user5via use of the user device110only monitoring and recognizing the unique pattern of colored stripes808on the conveying mechanism802. Stated otherwise, in certain embodiments, the user device110need not obtain or otherwise scan asset identifier data directly, so as to enable utilization of user-worn (e.g., glasses) devices110from further distances relative to the assets10(and in particular a label thereon containing the asset identifier data). The control system100may also be configured to receive sort location data from the user device110and/or the location device415upon the user device entering the communication area405corresponding to the location device415at Block704. At Block705, the control system100may subsequently compare the appropriate sort location and the sort location data received at Block704to determine whether the user device110is proximate the appropriate sort location. As indicated at Block706, the remaining steps to be completed may be selected based at least in part on a determination of whether the location device415corresponds to the appropriate sort location. Additional details in this respect may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. Upon a determination that the user device110is proximate an incorrect sort location400, the control system100may generate mistake data at Block710. Upon generating the mistake data, the control system100may transmit the mistake data to the user device110, the display420, and/or the location device415at Block711. As indicated herein, the user device110, the display420, and/or the location device415may be configured to generate a message discernible by the user5(e.g., sort personnel) indicating the user device110is proximate an incorrect sort location400(seeFIG.15D). In various embodiments, the control system100may be configured to associate the asset identifier data with the sort location data corresponding to the sort location400at Block712. At Block713, the user5may continue transporting the asset10(and consequently the user device110) to another sort location400. The process may return to Block701and repeat the recited steps. Referring again to Block706, the process may proceed after comparing the sort location data and the appropriate sort location data for the asset10(illustrated as Block705) with reference to Blocks707-709if the user5approaches the appropriate sort location. Additional details in this respect may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. The control system100may be further configured to generate one or more alerts regarding the association between the asset identifier data and the location data. The control system100may be configured to generate an alert to inform the user5(e.g., sort personnel) or other users regarding asset identifier data being associated with location data. Additional details in this respect may likewise be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. VI. EXEMPLARY USE Referring again toFIGS.5,10, and15Fcollectively, shown therein are exemplary sort facilities in which assets10may be moved by a user5(e.g., sort personnel) from an intake location450(e.g., adjacent an acquisition device115/410) via a conveying mechanism402/802to one of a plurality of sort locations400. As shown inFIG.10specifically, exemplary use of the system and architecture described herein may begin in certain embodiments with passing of one or more assets10through an acquisition zone401(seeFIG.5), which is adjacent to and/or surrounding an acquisition device115/410. In this zone401the acquisition device115is configured, according to various embodiments to capture (e.g., image and/or scan) a combination of asset identifier data (e.g., shipping label data, tracking indicia, or the like) and conveyor belt data (e.g., an image of a set of uniquely patterned stripes surrounding the asset captured). Once captured, the asset identifier data and the conveyor belt data (including the unique pattern of stripes surrounding the asset with which the identifier data is associated) is transmitted to the control system100for storage and correlation relative to one another. In certain embodiments this associated set of data may be periodically and/or proactively forwarded by the control system100to appropriate user devices110; in other embodiments, the control system100may be configured to passively await receipt of conveyor belt data from at least one user device110, at which point in time a match between the received conveyor belt data and that stored is conducted. Once matching occurs, the asset identifier data may be received/displayed at the user device110. Returning toFIG.10once more, it may be understood that downstream of the acquisition device115is a sorting zone (see alsoFIG.5, zone405). In this zone, following capture of data related to the assets by the acquisition device, a user5wearing or otherwise utilizing a user device110may approach the conveying mechanism402/802(e.g., a conveyor belt, slide, chute, bottle conveyor, open or enclosed track conveyor, I-beam conveyor, cleated conveyor, and/or the like) upon which the assets remain. When adjacent or near the conveying mechanism802, the user device110is configured to monitor, detect, and/or otherwise recognize the unique patterns of stripes on the conveying mechanism as the latter moves by. Via interactions with the control system100and/or the acquisition device115, upon detection of a unique pattern, the user device110may—upon matching thereof with a stored unique pattern associated with obtained asset identifier data—generate for the user a visual indicator810(see also indicators1001-1003inFIGS.15A-C) that, based upon the asset identifier data retrieved via association with the stored unique pattern, convey to the user5utilizing the user device110(for example, via a generated augmented reality environment projected via glasses worn by the user) sorting instructions for the assets approaching (or passing by) on the conveying mechanism802. Based upon the visual indicator810displayed, a user5may remove an asset10from an intake location (see alsoFIG.5) and scan, read, or otherwise obtain (e.g., without direct scan, but only via information electronically communicated to the user device110) asset identifier data from the asset10. In one embodiment, the user device110may receive and store asset identifier data based at least in part on the information received from the asset indicia. In other embodiments, the user device110may receive and store asset identifier data only electronically, without any direct scan or imaging thereof by the user device (e.g., the user device110would only scan, monitor, and/or image the unique patterns of stripes808on the conveying mechanism802. In any of these and still other embodiments, though, upon removal of the asset10from the intake location, the user5may then transport (e.g., carry) the asset10and the user device110away from the intake location450(and thus the conveying mechanism402/802) and toward one of the plurality of sort locations400. As the user5nears a sort location, the user device110may then receive sort location identifier data from one or more location devices415, as described elsewhere herein and also described in additional detail in U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. Handling generally of the asset10by the user5at or near the sort locations400is likewise best understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. In various embodiments, though, after depositing the asset10at a sort location400, the user5may return to the intake location450with the user device110and begin the above described method for a second asset10to be sorted. Still further alternative and/or additional exemplary uses may be understood with reference to U.S. Ser. No. 15/390,109, the contents of which as are hereby incorporated by reference in their entirety. VII. CONCLUSION Many modifications and other embodiments of the inventions set forth herein will come to mind to one skilled in the art to which these inventions pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. For example, various embodiments may be configured to associate a plurality of assets with a particular sort location. In such embodiments, a sort employee may scan the improved conveyor belt to identify multiple patterns thereon associated with a plurality of asset identifiers (e.g., sequentially and/or simultaneously depending upon field of view) before transporting two or more of the plurality of items to a sort location (whether a single shared location or separate respective locations). Thereafter, the plurality of assets may be associated with the proximate sort location according to the features and methods described herein. Therefore, it is to be understood that the inventions are not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation. | 142,844 |
11858011 | DETAILED DESCRIPTION Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the various embodiments to be described below, similar elements are denoted by the same reference numeral, and redundant description thereof will be omitted. First, a cleaning system10according to an embodiment will be described with reference toFIG.1andFIG.2. The cleaning system10is configured to clean a work area62of a machine tool50. As illustrated inFIG.2, the machine tool50includes a splash guard54, a machining head56, a telescopic cover58, and a machining table60. The splash guard54is a hollow member defining an interior space A, and prevents foreign matter such as cutting fluid or chips generated in the interior space A from leaking to the outside. The splash guard54includes a bottom wall54aand a side wall54bextending upward from the bottom wall54a. An opening54cis formed in the side wall54b. The opening54cis opened and closed as necessary by an automatic door (not illustrated). The machining head56is installed in the interior space A, and a tool64is attached to a tip of the machining head56. The machining head56rotates the tool64to machine a workpiece. The telescopic cover58is a telescopic hollow member, and provided on the bottom wall54aof the splash guard54. The telescopic cover58prevents a component of the machine tool50from being exposed to the foreign matter. The machining table60is provided so as to be movable in a horizontal direction in the interior space A, and disposed upward of the telescopic cover58. A jig (not illustrated) is detachably mounted on the machining table60, and the workpiece is removably set to the jig. In the present embodiment, the work area62of the machine tool50is an area to be influenced by an operation for the workpiece (e.g., due to adhesion of the foreign matter) in the interior space A, and defined as an area including the splash guard54(bottom wall54a), the telescopic cover58, and the machining table60(jig), for example. As illustrated inFIG.1, the cleaning system10includes a control device12, an imaging device14, a cleaning nozzle16, and a fluid supply device18. The control device12controls operations of the imaging device14and the fluid supply device18. Specifically, the control device12is a computer including e.g. a processor20(CPU, GPU, etc.) and a memory22(ROM, RAM, etc.). The processor20is communicably connected to the memory22via a bus24, and performs calculations for executing various functions to be described below, while communicating with the memory22. Note that the control device12may be configured to control a machining operation by the machine tool50by controlling operations of the machining head56and the machining table. Alternatively, a second control device (not illustrated) different from the control device12may be provided to control the machining operation by the machine tool50. In this case, the control device12may be communicably connected to the second control device. The memory22temporarily or permanently stores various data. The imaging device14images the work area62of the machine tool50. As an example, the imaging device14is a camera including e.g. an image sensor such as a CCD or CMOS, an optical lens such as a focus lens, and an image processing processor. As another example, the imaging device14may be a laser scanner type imaging device including e.g. a laser emitting section configured to emit laser beam, a light receiving section configured to receive the laser light reflected by an object, and an image generation section configured to generate image data from the laser light received by the light receiving section. As yet another example, the imaging device14may be a three-dimensional vision sensor capable of imaging an object and measuring a distance to the object. Note that the imaging device14may be fixed in the interior space A of the machine tool50, or may be installed outside the splash guard54if a part of the wall of the splash guard54of the machine tool50is open (or is made of a transparent material). Alternatively, the imaging device14may be moved to any position and orientation by a robot to be described below. The imaging device14images the work area62of the machine tool50in accordance with a command from the control device12, and transmits the captured image data to the control device12. The cleaning nozzle16is hollow and has an injection port16aat its tip. The cleaning nozzle16injects fluid supplied therein from the injection port16ain a predetermined injection direction. Note that the cleaning nozzle16may be fixed in the interior space A. In this case, the cleaning nozzle16is positioned such that the injection direction thereof is directed to the work area62(e.g., the machining table60) to be cleaned. Alternatively, the cleaning nozzle16may be moved to any position and orientation by the robot to be described below. The fluid supply device18supplies fluid to the cleaning nozzle16in accordance with a command from the control device12. Specifically, the fluid supply device18is fluidically coupled to the cleaning nozzle16via a fluid supply tube26(e.g., a flexible hose), and supplies the fluid (e.g., compressed gas or compressed liquid) inside the cleaning nozzle16through the fluid supply tube26. The cleaning nozzle16cleans the work area62by injecting the fluid supplied from the fluid supply tube26to the work area62(e.g., the machining table60). Next, an operation of the cleaning system10will be described with reference toFIG.3. A flow illustrated inFIG.3is started when the processor20receives a work-start command from an operator, a host controller, or a computer program. At the start of the flow illustrated inFIG.3, assume that a workpiece is not set on the machining table60, and the work area62of the machine tool50is substantially free of the foreign matter. In step S1, the processor20images the work area62by the imaging device14. In this embodiment, the processor20performs a simulation machining process before imaging the work area62. Specifically, an operator (or a robot for loading a workpiece) sets the jig on a top surface60aof the machining table60, and then sets a dummy workpiece to the jig. The dummy workpiece has the same dimension as a workpiece after machining in step S2to be described below. Then, the processor20(or the second control device) operates the machining head56and the machining table60in accordance with a machining program. The machining program includes a command for operating the machining head56and the machining table60, and a command for injecting machining fluid (cutting fluid, coolant, etc.) from a machining fluid injection device (not illustrated), and pre-stored in the memory22. By executing the machining program, the processor20causes the machining head56and the machining table60to perform the same operations as the step S2to be described below, and causes the machining fluid injection device to inject the machining fluid at the same timing and flow rate as step S2to be described below. When the machining program is ended, the machining head56and the machining table60return to their initial positions. Then, the processor20causes the imaging device14to image the work area62at a time t2at which a predetermined time τ elapses from a time point t1when the machining fluid has been injected from the machining fluid injection device last time (i.e., t2=t1+τ). Here, the time τ may be set such that the time t2is a time after the processor20ends the machining program in the simulation machining process. For example, the imaging device14images the top surface60aof the machining table60in the work area62. Alternatively, the imaging device14may image an inner surface of the bottom wall54aof the splash guard54, a top surface58aof the telescopic cover58, and the top surface60aof the machining table60in the work area62. The imaging device14transmits captured image data ID1(first image data) to the processor20, and the processor20stores the image data ID1in the memory22. This image data ID1is image data of the work area62(e.g., the top surface60a) imaged by the imaging device14before the workpiece is machined in the subsequent step S2.FIG.4illustrates an example of the image data ID1obtained when the imaging device14images the top surface60aof the machining table60. In step S2, the machine tool50machines the workpiece in the work area62. Specifically, the operator (or the robot for loading a workpiece) attaches the tool64to the machining head56, sets the jig on the top surface60aof the machining table60, and then sets the workpiece to the jig. Then, the processor20(or the second control device) operates the machining head56and the machining table60in accordance with the above-described machining program so as to machine the workpiece by the tool64, while injecting the machining fluid from the machining fluid injection device. As a result, foreign matters such as chips are deposited in the work area62of the machine tool50. When the machining program ends in this step S2, the machining head56and the machining table60return to the same initial position as at the end of the simulation machining process described above. In step S3, the processor20controls the imaging device14to image the work area62. Specifically, the processor20executes this step S3at the time t2when the predetermined time τ elapses from the time point t1at which the machining fluid has been injected from the machining fluid injection device last time at step S2, and causes the imaging device14to image the work area62. For example, the imaging device14images the top surface60aof the machining table60along the same visual line direction as in step S1. The imaging device14transmits captured image data ID2(second image data) of the work area62to the processor20, and the processor20stores the image data ID2in the memory22. This image data ID2is image data of the work area62(e.g., the top surface60a) imaged by the imaging device14after the workpiece is machined in step S2.FIG.5illustrates an example of the image data ID2obtained when the imaging device14images the top surface60a. The image data ID2imaged after machining contains foreign matters B such as chips on the top surface60a. In step S4, the processor20generates image data ID3(third image data) indicating a degree of change in brightness between the image data ID1imaged in step S1and the image data ID2imaged in the most-recent step S3. This image data ID3is an image having the number of pixels NTthe same as the image data ID1and the image data ID2. A method of generating the image data ID3will be described below with reference toFIG.6toFIG.10. FIG.6is a diagram schematically illustrating an example of quantifying brightness of each pixel of the image data ID1imaged before machining, whileFIG.7is a diagram schematically illustrating an example of quantifying brightness of each pixel of the image data ID2imaged after machining. Note that, inFIG.6andFIG.7, five rows and five columns of pixels are illustrated among whole pixels of the image data ID1and the image data ID2, for the sake of easy understanding. The processor20generates the image data ID3based on the image data ID1and the image data ID2. Brightness BR3of each pixel of the image data ID3is calculated by the following method as a value corresponding to a degree of change between brightness BR1of a pixel of the image data ID1and brightness BR2of a pixel of the image data ID2which corresponds to the pixel of the image data ID1. As an example, the processor20calculates the brightness BR3of each pixel of the image data ID3from Equation (1) of BR3=BR1−BR2.FIG.8illustrates a schematic diagram in which the brightness BR3of each pixel of the image data ID3is quantified when the brightness BR3is calculated from Equation (1). For example, regarding the brightness BR3of the pixel at the yn-th row and the xn-th column of the image data ID3, since the brightness BR1of the pixel at the yn-th row and the xn-th column of the image data ID1is 100 (FIG.6), and the brightness BR2of the pixel at the yn-th row and the xn-th column of the image data ID2is 100 the same as the brightness BR1(FIG.7), BR3=BR2−BR1=0 is satisfied from Equation (1). That is, if there is no change in brightness between the corresponding pixels of the image data ID1before machining and the image data ID2after machining when the Equation (1) is employed, every brightness BR3of the corresponding pixel of the image data ID3becomes zero. On the other hand, regarding the pixel at the yn+2-th row and the xn+4-th column of the image data ID3, the brightness BR1of the pixel at the yn+2-th row and the xn+4-th column of the image data ID1is 1 (FIG.6), while the brightness BR2of the pixel at the yn+2-th row and the xn+4-th column of the image data ID2is 255 (FIG.7) different from the brightness BR1. Such a change between the brightness BR1and the brightness BR2may occur due to the foreign matters B illustrated inFIG.5. In this case, the brightness BR3of the pixel at the yn+2-th row and the xn+4-th column of the image data ID3satisfies BR3=BR2−BR1=254 from Equation (1). As described above, in Equation (1), the brightness BR3of each pixel of the image data ID3is calculated as a difference between the brightness BR1and the brightness BR2, and as illustrated inFIG.8, the brightness BR3of the pixel is zero when there is no change in brightness between the pixels of the image data ID1and the image data ID2, while the brightness BR3of the pixel is a value other than zero when there is a change in brightness between the pixels of the image data ID1and the image data ID2. Note that, inFIG.8, the pixels having the brightness BR3other than zero are highlighted, for the sake of easy understanding. As another example, the processor20calculates the brightness BR3of each pixel of the image data ID3from Equation (2) of BR3=(BR1−BR2)/2+128.FIG.9illustrates a schematic diagram in which the brightness of each pixel of the image data ID3is quantified when the brightness BR3of each pixel of the image data ID3is calculated from Equation (2). For example, regarding the pixel at the yn-th row and the xn-th column, the brightness BR1of the image data ID1is 100, the brightness BR2of the image data ID2is 100, and therefore BR3=(BR1−BR2)/2+128=128 is obtained from Equation (2). In other words, if there is no change in brightness between the corresponding pixels of the image data ID1before machining and the image data ID2after machining when this Equation (2) is used, every brightness BR3of the corresponding pixel of the image data ID3becomes 128. On the other hand, regarding the pixel at the yn+2-th row and the xn+4-th column, the brightness BR1of the image data ID1is 1, whereas the brightness BR2of the image data ID2is 255, and therefore, BR3=(BR1−BR2)/2+128=255 is obtained. Thus, in Equation (2), the brightness BR3of each pixel of the image data ID3is calculated based on a difference between the brightness BR1and the brightness BR2, and as illustrated inFIG.9, the brightness BR3is 128 if there is no change in brightness between the pixels of the image data ID1and the image data ID2, while the brightness BR3is a value other than 128 if there is a change in brightness between the pixels of the image data ID1and the image data ID2. As yet another example, the processor20calculates the brightness BR3of each pixel of the image data ID3from Equation (3) of BR3=(BR2+1)/(BR1+1).FIG.10illustrates a schematic diagram in which the brightness of each pixel of the image data ID3is quantified when the brightness BR3of each pixel of the image data ID3is calculated from Equation (3). For example, regarding the pixel at the yn-th row and the xn-th column, the brightness BR1of the image data ID1is 100, the brightness BR2of the image data ID2is 100, and therefore, BR3=(BR2+1)/(BR1+1)=1 is obtained from Equation (3). In other words, if there is no change in brightness between the corresponding pixels of the image data ID1before machining and the image data ID2after machining when this Equation (3) is used, every brightness BR3of the corresponding pixel of the image data ID3is 1. On the other hand, regarding the pixel at the yn+2-th row and the xn+4-th column, the brightness BR1of the image data ID1is 1, whereas the brightness BR2of the image data ID2is 255, and therefore BR3=(BR2+1)/(BR1+1)=128 is obtained. Thus, in Equation (3), the brightness BR3of each pixel of the image data ID3is calculated based on a ratio ((BR2+1)/(BR1+1)) between the brightness BR1and the brightness BR2, and as illustrated inFIG.10, the brightness BR3is 1 if there is no change in brightness between the pixels of the image data ID1and the image data ID2, whereas the brightness BR3is a value other than 1 if there is a change in brightness between the pixels of the image data ID1and the image data ID2. By means of the above described method, the processor20generates the image data ID3indicating the degree of change between the brightness BR1of the image data ID1and the brightness BR2of the image data ID2. Accordingly, the processor20functions as an image data generation section28(FIG.1). The processor20stores the generated image data ID3in the memory22. Note that, inFIG.8toFIG.10, for the sake of easy understanding, the image data ID3is shown as grid data of y columns×x rows. However, the image data ID3generated by the processor20is not necessarily be such grid data, but it may be data in which the pixels and the corresponding brightness BR3are stored in the form of a list, for example. Again, with reference toFIG.3, in step S5, the processor20acquires a histogram HG of the image data ID3generated in step S4. The histogram HG is data indicating a relationship between the brightness BR3of each pixel of the image data ID3and the number of pixels N. An example of a diagram depicting the histogram HG is illustrated inFIG.11. Note that the processor20may acquire the histogram HG in the form of only numerical data, or may generate an image of the histogram HG as illustrated inFIG.11and display the image on a display (not illustrated) provided on the control device12. In general, brightness of each pixel in image data is displayed by a total of 256 stages of 0 to 255. When an image of the histogram HG obtained by above Equation (2) is generated, the brightness BR3can be represented by the 256 stages, and a position of the brightness BR3=128 can be a median of brightness. Thus, according to Equation (2), the image of the histogram HG can be displayed by an existing image processing program. Further, if Equation (3) described above is used and the brightness of the pixels is displayed by the total of 256 stages of 0 to 255, it is possible to prevent the brightness BR1from being infinity even when BR1=0 is satisfied. Note that, if the brightness of the pixels is displayed by the total of 256 stages of 1 to 256, Equation (3) may be defined as an equation of BR3=BR2/BR1. Regarding the histogram HG, if there is no change in brightness between the corresponding pixels of the image data ID1before machining and the image data ID2after machining (i.e., if there is no foreign matter B illustrated inFIG.5), the number of pixels N where the brightness BR3is a reference value α0is substantially the same as a total number of pixels NTof the image data ID3(i.e., the histogram HG becomes a characteristics in which an impulse of N≈NTexists at BR3=α0), in the histogram HG. The reference value α0is zero when Equation (1) is used, the reference value α0is 128 when Equation (2) is used, and the reference value α0is 1 when Equation (3) is used. On the other hand, if there is a change in brightness between the corresponding pixels of the image data ID1before machining and the image data ID2after machining (i.e., if the foreign matters B illustrated inFIG.5exist), the number of pixels N exists in a range of the brightness BR3other than the reference value α0, in the histogram HG. Thus, the histogram HG is data statistically indicating the change in brightness between the image data ID1before machining and the image data ID2after machining. In step S6, the processor20determines whether or not to clean the work area62based on the histogram HG. As an example, the processor20determines that it is necessary to clean the work area62when a rate R1of the number of pixels NXhaving the brightness BR3being within a predetermined range [α1, α2] with respect to the total number of pixels NT(i.e., R1=NX/NT) in the histogram HG is equal to or smaller than a predetermined threshold value Rth1(i.e., R1=NX/NTRth1). Specifically, as described above, if there is a change in brightness between the image data ID1before machining and the image data ID2after machining, instead of a decrease in the number of pixels N at the reference value α0, the number of pixels N is widely distributed in the range of the brightness BR3other than the reference value α0. Accordingly, if the threshold values α1and α2of the range [α1, α2] are set to include the reference value α0as illustrated inFIG.11, the larger the change in brightness between the image data ID1and the image data ID2(i.e., the more the number of foreign matters B inFIG.5is), the less the number of pixels NXwithin the range α1≤BR3≤α2is. Therefore, the rate R1of the number of pixels NXwith respect to the total number of pixels NT(R1=NX/NT) is data that quantitatively represents a magnitude of the change in brightness between the image data ID1and the image data ID2(i.e., largeness of the number of the foreign matters B included in the image data ID2after machining). The processor20calculates the rate R1from the data of the histogram HG, and determines that it is necessary to clean the work area62(i.e., determines YES) when the rate R1is equal to or less than the threshold value Rth1, and then proceeds to step S7. On the other hand, the processor20determines NO when the rate R1is larger than the threshold value Rth1, and proceeds to step S8. As another example, the processor20determines that it is necessary to clean the work area62when a rate R2of the number of pixels NYhaving the brightness BR3being out of the range [α1, α2] with respect to the total number of pixels NT(i.e., R2=NY/NT) in the histogram HG is equal to or larger than a predetermined threshold value Rth2(i.e., R2=NY/NT≥Rth2). In this regard, as the change in brightness between the image data ID1and the image data ID2is larger (i.e., as the number of the foreign matters B inFIG.5increases), the number of pixels NXwithin the range of α1≤BR3≤α2decreases, while the number of pixels NYin the range of BR3<α1or α2<BR3increases. Therefore, the rate R2of the number of pixels NYwith respect to the total number of pixels NT(R2=NY/NT) is data that quantitatively represents the number of foreign matters B included in the image data ID2after machining. The processor20calculates the rate R2from the data of the histogram HG, and determines that it is necessary to clean the work area62(YES) when the rate R2is equal to or larger than the threshold value Rth2. As yet another example, the processor20extracts a locus of a graph line of the histogram HG (seeFIG.11) acquired in step S5, and calculates a matching degree between a shape of the locus of the graph line in the histogram HG and a locus of a graph line of a reference histogram HGR. The reference histogram HGRis a histogram in a case where there is no change in brightness between the image data ID1and the image data ID2. The reference histogram HGRmay be obtained in the following manner, for example. Specifically, the processor20images the image data ID1twice before machining (step S1). Then, the processor20generates reference image data IDRindicating a degree of change in brightness between two pieces of image data ID1imaged before machining, by the method described in above step S4. Then, the processor20acquires the reference histogram HGRfrom the reference image data IDR. Alternatively, the reference histogram HGRmay be manually created by the operator. The processor20determines YES in this step S6when the matching degree between the shape of the locus of the graph line of the histogram HG and the shape of the locus of the graph line of the reference histogram HGRis less than a predetermined threshold value. As yet another example, the processor20calculates a standard deviation of the histogram HG acquired in step S5. The processor20determines YES in this step S6when the standard deviation of the histogram HG is larger than a predetermined threshold value. By the method described above, the processor20determines whether or not to clean the work area62(e.g., the top surface60a) based on the histogram HG. Accordingly, the processor20functions as the determination section30(FIG.1) configured to determine whether or not to clean the work area62. In step S7, the processor20performs cleaning of the work area62. Specifically, the processor20operates the fluid supply device18to supply fluid to the cleaning nozzle16. The cleaning nozzle16injects the fluid supplied from the fluid supply tube26to the work area62(the top surface60aof the machining table60) to clean the work area62. After step S7, the processor20returns to step S3and repeatedly executes a loop of steps S3to S7until it determines NO in step S6. Note that the processor20may count the number of times “m” for that it executes step S7(or it determines YES in step S6), output an alarm signal in the form of sound or image indicating that “The number of times of cleaning reached predetermined number” when the number of times “m” reaches a predetermined number m (e.g., mMAX=3), and proceed to step S8(or may end the flow inFIG.3). Due to this, it is possible to prevent the number of times of execution of step S7from being too large. In step S8, the processor20analyzes the computer program and determines whether or not there is another workpiece to be machined. The processor20returns to step S2when it determines that there is another workpiece to be machined (i.e., determines YES), while the processor20ends the flow illustrated inFIG.3when it determines that there is no workpiece to be machined (i.e., determines NO). As described above, in the present embodiment, the imaging device14images the image data ID1and the image data ID2before and after machining, the image data generation section28generates the image data ID3, and the determination section30determines whether or not to clean the work area62based on the histogram HG. Accordingly, the imaging device14, the image data generation section28, and the determination section30constitute a device70(FIG.1) configured to determine whether or not it is necessary to clean the work area62of the machine tool50. In the present embodiment, the processor20determines whether or not to clean the work area62based on the histogram HG that statistically indicates the change in brightness between the image data ID1and the image data ID2captured before and after machining. According to this configuration, it is possible to determine whether or not it is necessary to clean the work area62with high accuracy, by means of a statistical technique. Also, in the present embodiment, the processor20determines that it is necessary to clean the work area62if the rate R1is less than or equal to the threshold value Rth1or the rate R2is equal to or larger than the threshold value Rth2, in the histogram HG. According to this configuration, it is possible to automatically determine whether or not to clean the work area62by a relatively simple algorithm. Further, in the present embodiment, the processor20causes the imaging device14to image the image data ID1after performing the simulation machining process in step S1. According to this configuration, the arrangement of elements in the work area62, such as the machining table60, and a state of the machining fluid, which are shown in the image data ID1and ID2, can be the same between the image data ID1captured in step S1and the image data ID2captured in step S3after machining. Accordingly, it is possible to prevent the brightness BR3of each pixel of the image data ID3from including a value due to the arrangement of elements in the work area62and the machining fluid. Next, a cleaning system100according to another embodiment will be described with reference toFIG.12andFIG.13. The cleaning system100is for cleaning the work area62of the machine tool50, and includes the imaging device14, the cleaning nozzle16, the fluid supply device18, a control device102, a robot104, and an attachment device claws. The control device102controls operations of the imaging device14, the fluid supply device18, the robot104, and the attachment device claws. Specifically, the control device102is a computer including e.g., a processor108(CPU, GPU, etc.) and the memory22(ROM, RAM, etc.). The processor108is communicably connected to the memory22via the bus24, and performs calculations for carrying out various functions to be described below, while communicating with the memory22. As illustrated inFIG.13, in the present embodiment, the robot104is a vertical articulated robot, and includes a robot base110, a turning body112, a robot arm114, a wrist116, and robot hands118and120. The robot base110is fixed on a floor of a work cell. The turning body112is provided at the robot base110so as to be rotatable about a vertical axis. The robot arm114includes a lower arm122rotatably attached to the turning body112, and an upper arm124rotatably attached to a distal end of the lower arm122. The wrist116is provided at a distal end of the upper arm124, and rotatably supports the robot hands118and120. Servo motors (not illustrated) are provided in the robot base110, the turning body112, the robot arm114, and the wrist116, respectively. These servo motors drive the turning body112, the robot arm114, and the wrist116about their drive shafts under commands from the control device102, thereby operating the robot104. The robot hand118includes a hand base128fixed to an adapter126provided at a distal end of the wrist116, and a plurality of fingers130provided at the hand base128so as to open and close. A finger driver (not illustrated) having an air cylinder or a motor is incorporated in the hand base128, and causes the fingers130to open and close under a command from the control device102. As a result, the robot hand118grips or releases the cleaning nozzle16with its fingers130. Note that the fingers130of the robot hand118may be configured to be able to grip a workpiece to be gripped by the robot hand120, in addition to the cleaning nozzle16. On the other hand, the robot hand120includes a hand base132fixed to the adapter126, and a plurality of fingers134provided at the hand base132so as to open and close. A second finger driver (not illustrated) having an air cylinder or a motor is incorporated in the hand base132, and causes the fingers134to open and close under a command from the control device102. As a result, the robot hand120grips or releases an object such as a workpiece with its fingers134. The attachment device106is disposed at a predetermined position in the interior space A of the machine tool50, and mounted on the side wall54bof the splash guard54. Specifically, as illustrated inFIG.14, the attachment device106includes a base136fixed to the side wall54b, a plurality of claws138provided at the base136so as to open and close, and a claw drive section140configured to open and close the claws138. The claw drive section140has an air cylinder or a motor, and automatically opens and closes the claws138under a command from the control device102. The attachment device106can hold the cleaning nozzle16between the claws138by closing the claws138, as illustrated inFIG.15. Further, the attachment device106can releases the held cleaning nozzle16by opening the claws138as illustrated inFIG.14. Note that, in the present embodiment, a flat surface portion138ais formed on an inner surface of each claw138, whereas a flat surface portion16bthat surface-contacts the flat surface portion138ais formed on each of both side surfaces of the cleaning nozzle16. Due to the surface-contact between the flat surface portion138aand the flat surface portion16b, the claws138can stably grip the cleaning nozzle16. Note that a high friction portion (a concave-convex portion, a rubber layer, a high-friction resin layer, etc.) that increases a friction coefficient between the claws138and the cleaning nozzle16may be provided on the flat surface portion138aof each claws138. Additionally, the cleaning system100may further include a blower (not illustrated) that blows off foreign matter adhered to the inner surfaces of the claws138by injecting fluid (e.g., compressed gas) on the inner surfaces. In this case, the blower may be incorporated in the attachment device106(e.g., the base136), and a fluid injection port of the blower may be provided on the inner surfaces (e.g., the flat surface portions138a) of the claws138. Due to this, it is possible to prevent foreign matter from being adhered to the inner surfaces of the claws138, and thus the attachment device106can reliably hold the cleaning nozzle16at the same position and orientation. As illustrated inFIG.13, the imaging device14is fixed to the adapter126via a bracket142, and moved to any position and orientation by the robot104. In the present embodiment, the imaging device14is a three-dimensional vision sensor configured to image an object and measure a distance to the object. A robot coordinate system CRis set for the robot104. The robot coordinate system CRis a coordinate system that serves as a reference for automatic control of each of the movable components (the turning body112, the robot arm114, and the wrist116) of the robot104. In the present embodiment, the robot coordinate system CRis set such that its origin is positioned at a center of the robot base110, and its z-axis coincides with a rotation axis of the turning body112. The processor108generates a command to each servo motor of the robot104with reference to the robot coordinate system CR, and operates each movable component of the robot104so as to arrange the imaging device14and the robot hands118and120at any position and orientation in the robot coordinate system CR. The robot base110and the turning body112of the robot104are installed outside the splash guard54of the machine tool50. The processor108operates the robot104so as to advance and retract the imaging device14and the robot hands118and120to and from the interior space A of the machine tool50through the opening54cprovided in the side wall54bof the splash guard54. Next, an operation of the cleaning system100will be described with reference toFIG.16. A flow illustrated inFIG.16is started when the processor108receives a work-start command from an operator, a host controller, or a computer program. At the start of the flow illustrated inFIG.16, a workpiece is not set on the machining table60, and the work area62of the machine tool50is substantially free of foreign matter. In addition, at the start of the flow illustrated in FIG.16, the cleaning nozzle16is attached to the attachment device106(FIG.15). In step S11, the processor108images the work area62by the imaging device14. In this embodiment, the processor108performs the simulation machining process before imaging the work area62. Specifically, the operator (or the robot104) sets the jig on the top surface60aof the machining table60. Next, the processor108operates the robot104to grip a dummy workpiece placed at a predetermined storage place outside the machine tool50with the robot hand120, transports the dummy workpiece to the interior space A of the machine tool50through the opening54cof the splash guard54, and then sets the dummy workpiece on the jig. The dummy workpiece has a dimension the same as a workpiece, which is to be machined in step S14described below and which has been already machined. Then, the processor108operates the machining head56and the machining table60in accordance with the machining program. By executing the machining program, the processor108causes the machining head56and the machining table60to perform the same operation as in the step S14described below, while injecting the machining fluid from the machining fluid injection device at the same timing and flow rate as in the step S14described below. When the machining program is ended, the machining head56and the machining table60return to their initial positions. Then, the processor108starts the imaging operation by the imaging device14at the time t2at which the predetermined time τ elapses from the time t1when the machining fluid has been injected from the machining fluid injection device last time. Specifically, the processor108operates the robot104to dispose the imaging device14at a predetermined imaging position. For example, when the imaging device14is disposed at the imaging position, the imaging device14is disposed upward (i.e., in the z-axis positive direction of the robot coordinate system CR) of the work area62, the visual line direction of the imaging device14is parallel to the z-axis in the robot coordinate system CR(i.e., in the vertical direction), and the bottom wall54aof the splash guard54, the top surface58aof the telescopic cover58, and the top surface60aof the machining table60of the work area62fall within the field of view of the imaging device14. Position data of the imaging position in the robot coordinate system CRis pre-stored in the memory22. When the imaging device14is disposed at the imaging position, the processor108operates the imaging device14to image the work area62. The imaging device14transmits the captured image data ID1(the first image data) to the processor108, and the processor108stores the image data ID1in the memory22. This image data ID1is image data of the work area62imaged by the imaging device14before machining the workpiece in the subsequent step S14.FIG.17illustrates an example of the image data ID1obtained by the imaging device14imaging the work area62in this step S11. In step S12, the processor108operates the imaging device14to measure a height h of the work area62. As described above, the work area62includes the bottom wall54a, the telescopic cover58, and the machining table60. As illustrated inFIG.13, the top surface58aof the telescopic cover58is positioned at a height h2upward from the inner surface of the bottom wall54a, and the top surface60aof the machining table60is positioned at a height h3(>h2) upward from the bottom wall54a. Thus, the work area62includes a zone54a(the inner surface of the bottom wall54a), a zone58a(the top surface58a), and a zone60a(the top surface60a), whose heights h are different from each other. The imaging device14images the image data ID1in step S11, and measures the height h of each zone (54a,58a,60a) of the work area62included in the image data ID1. For example, the imaging device14includes a laser emitting section configured to emit laser beam, and a light receiving section configured to receive the laser light reflected by an object in the work area62. The imaging device14measures a distance from the imaging device14to the object in the work area62by a triangulation method. Alternatively, the imaging device14may have two cameras and measure the distance to the object in the work area62from two images captured by the two cameras. By such a technique, the imaging device14can measure a distance d3to the zone60a, a distance d2to the zone58a, and a distance d1to the zone54a, which are present in the work area62. These distances d1, d2, and d3are information indicating the heights h of the zones54a,58a, and60a. Specifically, if the zone54ais used as a reference of the height h, the height h2of the zone58acan be obtained by subtracting the distance d2from the distance d1, and the height h3of the zone60acan be obtained by subtracting the distance d3from the distance d1. The imaging device14may measure the distances d1, d2, and d3as information of the heights h of the zones54a,58a, and60a, or may measure the heights h2and h3. The processor108acquires the information of the heights h measured by the imaging device14from the imaging device14, and stores the information in the memory22. In step S13, the processor108sets a plurality of image zones in response to the heights h of the work area62, in the image data ID1imaged by the imaging device14in step S11. Specifically, the processor108extracts from the image data ID1each zone in the work area62for each height h, based on the information of the heights h acquired in step S12. For example, when the distances d1, d2, and d3are acquired as the information of the heights h in step S12, the processor108extracts from the image data ID1the zone where the distance d is within a predetermined range of dth1≤d<dth2. For example, assume that the distance d3of the zone60asatisfies dth1≤d3<dth2. In this case, the processor108extracts an image zone that shows the zone60afrom the image data ID1, and sets this image zone as an image zone60a′ of “height level3”. Additionally, the processor108extracts a zone where the distance d is within a predetermined range of dth2≤d<dth3from the image data ID1. For example, assume that the distance d2of the zone58asatisfies dth2≤d2<dth3. In this case, the processor108extracts an image zone that shows the zone58afrom the image data ID1, and sets this image zone as an image zone58a′ of “height level2”. In addition, the processor108extracts the zone where the distance d is within a predetermined range of dth3≤d from the image data ID1. For example, assume that the distance d3of the zone54asatisfies dth3≤d3. In this case, the processor108extracts an image zone that shows the zone54afrom the image data ID1, and sets this image zone as an image zone54a′ of “height level1”. InFIG.17, for the sake of easy understanding, the image zone54a′ (zone54a) is indicated by white color, the image zone58a′ (zone58a) is indicated by light gray color, and the image zone60a′ (zone60a) is indicated by dark gray color. The threshold values dth1, dth2and dth3, which define a range of the distance d described above, are predetermined by an operator depending on the imaging position of the imaging device14, and stored in the memory22. In this way, the processor108sets the plurality of image zones54a′,58a′ and60a′ in the image data ID1in response to the height h of the work area62, based on the information of the height h acquired in step S12(i.e., the distances d). Accordingly, the processor108functions as an image zone setting section144(FIG.12) configured to set the image zones60a′,58a′ and54a′. Note that, if the heights h2and h3are acquired as the information of the heights h in step S12, the processor108can extract each zone in the work area62for each height h from the image data ID1by setting a predetermined range for the height h in the same manner as for the distance d, and can set the image zones60a′,58a′ and54a′, similarly. In step S14, the processor108machines the workpiece. Specifically, the operator (or the robot104) attaches the tool64to the machining head56, and sets the jig on the top surface60aof the machining table60. The processor108then operates the robot104so as to grip the workpiece placed at the predetermined storage place outside the machine tool50with the robot hand120, transports the workpiece to the interior space A of the machine tool50through the opening54cof the splash guard54, and then sets the workpiece on the jig. Next, the processor108(or the second control device described above) operates the machining head56and the machining table60in accordance with the machining program so as to machine the workpiece by the tool64while injecting the machining fluid from the machining fluid injection device. As a result, foreign matters are deposited in the work area62of the machine tool50. When the machining program is ended, the machining head56and the machining table60return to the same initial position as at the end of the simulation machining process in step S11. Position data in the robot coordinate system CRof a workpiece position at which the workpiece is to be placed at the storage place and of a position on the machining table60on which the workpiece is to be set is pre-stored in the memory22. In step S15, the processor108images the work area62by the imaging device14. The processor108starts this step S15at the time t2when the predetermined time τ elapses from the time t1at which the machining fluid has been injected from the machining fluid injection device last time in step S14. Specifically, the processor108operates the robot104so as to dispose the imaging device14at the same imaging position as in step11, and operates the imaging device14so as to image the work area62along the same visual line direction as in step11. The imaging device14transmits the captured image data ID2(second image data) to the processor108, and the processor108stores the image data ID2in the memory22. This image data ID2is image data of the work area62imaged by the imaging device14after the workpiece is machined in step S14.FIG.18illustrates an example of the image data ID2obtained by the imaging device14imaging the work area62in this step S15. In the image data ID2imaged after machining, the foreign matters B are shown in the work area62(the zones54a,58a, and60a). In step S16, the processor108sets the image zones54a′,58a′ and60a′ in the image data ID2captured in the most-recent step S15. Specifically, the processor108sets the image zones54a′,58a′ and60a′ in the image data ID2in the same manner as in step S13, based on setting information of the image zones54a′,58a′ and60a′ set in step S13(e.g., position data of boundary lines of the image zones54a′,58a′ and60a′ in the image data). As a result, the positions in the image data ID1of the image zones54a′,58a′ and60a′ set in the image data ID1in step S13, and the positions in the image data ID2of the image zones54a′,58a′ and60a′ set in the image data ID2in this step S16are the same. In step S17, the processor108determines whether or not it is necessary to clean the zone60aof height level3. Specifically, the processor108determines whether or not to clean the zone60a, based on image data ID1_3of the image zone60a′ of height level3in the image data ID1captured in step S11, and on image data ID2_3of the image zone60a′ of height level3in the image data ID2captured in the most-recent step S15. Specifically, the processor108may compare brightness of each pixel of the image data ID1_3before machining with brightness of each pixel of the image data ID2_3after machining, and may detect whether or not there are the foreign matters in the zone60afrom a difference between them. The processor108determines that it is necessary to clean the zone60a(i.e., determines YES) when the foreign matters in zone60aare detected in this step S17. The processor108proceeds to step S18when it determines YES, whereas the processor108proceeds to step S19when it determines NO. Thus, in the present embodiment, the processor108functions as a determination section146(FIG.12) configured to determine whether or not to clean the work area62(zone60a), based on the image data ID1, ID2(specifically, the image data ID1_3, ID2_3). In step S18, the processor108sets a cleaning-target zone. Specifically, the processor108sets the zone60adetermined to be cleaned in step S17as the cleaning-target zone, along with which, the processor108also sets the zones58aand54a, which are lower in height h than the zone60a, as the cleaning-target zone, automatically. As a result, the zones60a,58aand54aare set as the cleaning-target zone. Thus, in the present embodiment, the processor108functions as a cleaning target zone setting section148(FIG.12). In step S19, the processor108determines whether or not it is necessary to clean the zone58aof height level2. Specifically, the processor108determines whether or not to clean the zone58a, based on image data ID1_2of the image zone58a′ of height level2in the image data ID1captured in step S11, and on image data ID2_2of the image zone58a′ of height level2in the image data ID2captured in the most-recent step S15. Specifically, the processor108may compare brightness of each pixel of the image data ID1_2before machining with brightness of each pixel of the image data ID2_2after machining, and may detect whether or not there are foreign matters in the zone58afrom a difference between them. The processor108determines that it is necessary to clean the zone58a(i.e., determines YES) when the foreign matters in the zone58aare detected in this step S19. The processor108proceeds to step S20when it determines YES, whereas the processor108proceeds to step S21when it determines NO. In step S20, the processor108sets the cleaning-target zone. Specifically, the processor108sets the zone58adetermined to be cleaned in step S19as the cleaning-target zone, along with which, the processor108also sets the zone54a, which is lower in height h than the zone58a, as the cleaning-target zone, automatically. Thus, the zones58aand54aare set as the cleaning-target zone. In this way, when the processor108determines that it is necessary to clean one zone60a(or58a) in step S17(or S19), in step S18(or S20), the processor108automatically sets the zones58aand54a(or54a) lower in height h than the one zone60a(or58a) as the cleaning-target zone, together with the one section60a(or58a). In step S21, the processor108determines whether or not it is necessary to clean the zone54aof height level1. Specifically, the processor108determines whether or not to clean the zone54a, based on image data ID1_1of the image zone54a′ of height level1in the image data ID1captured in step S1, and on image data ID2_1of the image zone54a′ of height level1in the image data ID2captured in the most-recent step S15. Specifically, the processor108may compare brightness of each pixel of the image data ID1_1before machining with brightness of each pixel of the image data ID2_1after machining, and detect whether or not there is foreign matters in the zone54afrom a difference between them. The processor108determines that it is necessary to clean the zone54a(i.e., determines YES) when the foreign matters in zone54aare detected in this step S21. The processor108proceeds to step S22when it determines YES, whereas the processor108proceeds to step S24when it determines NO. In step S22, the processor108sets the zone54adetermined to be cleaned in step S21as the cleaning-target zone. In step S23, the processor108executes the cleaning operation. Specifically, the processor108first carries out a detaching operation to cause the robot104to grip the cleaning nozzle16attached to the attachment device106and detach the cleaning nozzle16from the attachment device106. In this detaching operation, the processor108operates the robot104to move the robot hand118(TCP) to a gripping position for gripping the cleaning nozzle16held by the claws138of the attachment device106, in a state where the fingers130are opened. When the robot hand118is disposed at the gripping position, the cleaning nozzle16held by the claws138of the attachment device106is disposed between the fingers130of the robot hand118, and the flat surface portions16bof the cleaning nozzle16face the inner surfaces of the fingers130, respectively. Position data of the gripping position in the robot coordinate system CRis pre-stored in the memory22. The processor108then closes the fingers130to grip the flat surface portions16bof the cleaning nozzle16with the fingers130. Then, the processor108drives the claw drive section140of the attachment device106so as to open the claws138. In this way, the robot104detaches the cleaning nozzle16from the attachment device106. After the detaching operation of the cleaning nozzle16, the processor108performs the cleaning operation on the cleaning-target zone set in step S18, S20, or S22. For example, when step S23is carried out after step S18, the processor108performs the cleaning operation on the zones60a,58a, and54aset as the cleaning-target zone in the descending order of height h, i.e., in the order of the zone60a, the zone58a, and the zone54a. Specifically, the processor108operates the fluid supply device18so as to inject the fluid from the cleaning nozzle16while operating the robot104so as to move the cleaning nozzle16gripped by the robot hand118with respect to the zone60a, thereby cleaning the entire zone60aby the injected fluid. The processor108then cleans the entire zone58aby causing the fluid to be injected from the cleaning nozzle16while moving the cleaning nozzle16with respect to the zone58aby the robot104. The processor108then cleans the entire zone54aby causing the fluid to be injected from the cleaning nozzle16while moving the cleaning nozzle16with respect to the zone54aby the robot104. Note that a movement path (or the cleaning position) in which the robot104moves the cleaning nozzle16(or TCP) when cleaning each of the zones60a,58a, and54amay be defined in the computer program in advance. On the other hand, when step S23is carried out after step S20, the processor108performs the cleaning operation on the zones58aand54aset as the cleaning-target zone in the descending order of height h, i.e., in the order of the zone58a, and the zone54a. Also, when step S23is carried out after step S22, the processor108performs the cleaning operation on the zone54a. In this way, the processor108performs the cleaning operation to clean the work area62by causing the fluid to be injected from the cleaning nozzle16while moving the cleaning nozzle16with respect to the work area62(zones60a,58a, and54a) by the robot104. Thus, the processor108functions as a cleaning execution section150(FIG.12) configured to execute the cleaning operation. After step S23, the processor108returns to step S15and repeats a loop of steps S15to S23until it is determined NO in step S21. Note that the processor108may count the number of times “m” for that the processor108has performed step S23(or the number of times for that it has been determined YES in steps S17, S19, or S21), and when the number of times “m” reaches a predetermined number m (e.g., mMAX=3), the processor108may send an alarm signal in the form of sound or image indicating that “The number of times of cleaning reached predetermined number”, and proceed to step S24(or may end the flow ofFIG.16). Due to this, it is possible to prevent the number of times of execution of step S23from being too large. When it is determined NO in step S21, the processor108performs an attaching operation to attach the cleaning nozzle16to the attachment device. Specifically, the processor108operates the robot104to dispose the robot hand118(TCP) gripping the cleaning nozzle16at an attaching position. At this time, the claws138of the attachment device106are opened. When the robot hand118is disposed at the attaching position, the flat surface portions138aof the claws138of the attachment device106face the respective flat surface portions16bof the cleaning nozzle16to be gripped by the robot hand118. Then, the processor108drives the claw drive section140of the attachment device106so as to close the claws138to grip the cleaning nozzle16, and subsequently, open the fingers130of the robot hand118. In this way, the processor108attaches the cleaning nozzle16to the attachment device106by the robot104. In step S24, similarly as in step S8described above, the processor108determines whether or not there is another workpiece to be machined. The processor108returns to step S14when it determines YES, and repeats a loop of steps S14to24until it determines NO in step S24. On the other hand, when the processor108determines NO in step S24, it ends the flow illustrated inFIG.16. As described above, in the present embodiment, the processor108causes the robot104to perform the detaching operation of the cleaning nozzle16and the cleaning operation on the work area62. According to this configuration, since the cleaning nozzle16can be operated by the robot104to perform cleaning of the work area62of the machine tool50, it is possible to improve the efficiency of the cleaning operation. In addition, in the present embodiment, the cleaning nozzle16is provided in the interior space A of the machine tool50. According to this configuration, since there is no need to carry the cleaning nozzle16and the fluid supply tube26into and out from the machine tool50, it is possible to improve the efficiency of the cleaning operation, while preventing the fluid for cleaning from leaking from the cleaning nozzle16or the fluid supply tube26to the outside of the machine tool50. In addition, piping of the fluid supply tube26in the interior space A of the machine tool50can be simplified. Further, in this embodiment, when it is determined that it is necessary to clean one zone60a(or58a), the processor108automatically sets, as the cleaning-target zone (steps S18and S20), the zones58aand54a(or54a) which are lower in height h than the one zone60a(or58a), together with the one zone60a(or58a). Then, the processor108performs the cleaning operation on the zones60a,58a, and54aset as the cleaning-target zone, in the descending order of height h. According to this configuration, the processor108can optimize the number of cleaning operations for the work area62. In particular, the foreign matters B, which are blown off when one zone is cleaned by the fluid injected from the cleaning nozzle16, can eventually accumulate in a zone lower in height than the one zone by the actin of gravity. Accordingly, if the zone60ais cleaned after the zone58a, the foreign matters B blown away from the zone60amay be deposited in the cleaned zone58a. By carrying out the cleaning operation on the plurality of zones60a,58a, and54ain the descending order of height h, it is possible to efficiently clean the plurality of zones60a,58a, and54a. Furthermore, in the present embodiment, the robot104includes the robot hand118for gripping the cleaning nozzle and the robot hand120for workpiece loading. Thus, a variety of operations can be performed by the single robot104, and therefore it is possible to improve work efficiency and reduce a manufacturing cost. Note that, in the flow illustrated inFIG.16, the processor108may execute a loop of steps S15to S23every time a total of “n” workpieces are machined (e.g., n=20). Note that the above-described device70can be applied to the cleaning system100. Below, with reference toFIG.19, another function of the cleaning system100will be described. In the present embodiment, the processor108functions as the image data generation section28. Accordingly, the imaging device14, the image data generation section28, and the determination section146constitute the device70. Next, another example of the operation of the cleaning system100will be described with reference toFIG.20. A flow illustrated inFIG.20differs from the flow illustrated inFIG.16in steps S31, S32, and S33. Specifically, after step S16, in step S31, the processor108executes a cleaning determination scheme for height level3. This step S31will be described with reference toFIG.21. In step S41, the processor108functions as the image data generation section28to generate image data ID3_3(the third image data) indicating a degree of change in brightness between image data ID1_3of the image zone60a′ of height level3in the image data ID1captured in step S11, and image data ID2_3of the image zone60a′ of height level3in the image data ID2captured in the most-recent step S15. Specifically, similarly to step S4described above, the processor108generates the image data ID3_3having the number of pixels the same as the image data ID1_3and the image data ID2_3, by calculating the brightness BR3of each pixel of the image data ID3_3using Equation (1), Equation (2), or Equation (3). The brightness BR3of each pixel of the image data ID3_3is a value corresponding to the degree of change between the brightness BR1of the pixel of the image data ID1_3and the brightness BR2of the pixel of the image data ID2_3which corresponds to the pixel of the image data ID1_3. In step S42, the processor108acquires a histogram HG3of the image data ID3_3generated in step S41. The histogram HG3is data indicating a relationship between the brightness BR3of each pixel of the image data ID3_3and the number of pixels N of the image data ID3_3. In step S43, the processor108functions as the determination section146to determine whether or not to clean the zone60aof height level3based on the histogram HG3, using the same technique as above-described step S6. As an example, similarly to step S6described above, the processor108determines that it is necessary to clean the zone60aof height level3(i.e., determines YES) when a rate R1_3of the number of pixels NX_3having the brightness BR3being within a predetermined range [α1_3, α2_3] with respect to a total number of pixels NT_3(i.e., R1_3=NX_3/NT_3) in the histogram HG3is equal to or smaller than a predetermined threshold value Rth1_3. As another example, the processor108determines YES when a rate R2_3of the number of pixels NY_3having the brightness BR3being out of the predetermined range [α1_3, α2_3] with respect to the total number of pixels NT_3(i.e., R2_3=NY_3/NY_3) in the histogram HG3is equal to or larger than a predetermined threshold value Rth2_3. As yet another example, the processor108determines YES when a matching degree between a locus of a graph line in the histogram HG3and a locus of a graph line in a reference histogram HGR_3is smaller than a predetermined threshold value. As yet another example, the processor108determines YES when a standard deviation of the histogram HG3is larger than a predetermined threshold value. The processor108proceeds to step S18inFIG.20when it determines YES in this step S43, whereas the processor108proceeds to step32inFIG.20when it determines NO. In step S32, the processor108executes a cleaning determination scheme for height level2. This step S32will be described with reference toFIG.22. In step S51, the processor108functions as the image data generation section28to generate image data ID3_2(third image data) indicating a degree of change in brightness between the image data ID1_2of the image zone58a′ of height level2in the image data ID2captured in step S11, and the image data ID2_2of the image zone58a′ of height level2in the image data ID2captured in the most-recent step S15. Specifically, similarly to above-described step S4, the processor108generates the image data ID3_2having the number of pixels the same as the image data ID2_2and the image data ID2_2, by calculating the brightness BR3of each pixel of the image data ID3_2, using Equation (1), Equation (2), or Equation (3). The brightness BR3of each pixel of the image data ID3_2is a value corresponding to the degree of change between the brightness BR2of the pixel of the image data ID1_2and the brightness BR2of the pixel of the image data ID2_2which corresponds to the pixel of the image data ID1_2. In step S52, the processor108acquires a histogram HG2of the image data ID3_2generated in step S51. The histogram HG2is data indicating a relationship between the brightness BR3of each pixel of the image data ID3_2and the number of pixels N of the image data ID3_2. In step S53, the processor108functions as the determination section146to determine whether or not to clean the zone58aof height level2, based on the histogram HG2. As an example, similarly to step S6described above, the processor108determines that it is necessary to clean the zone58aof height level2(i.e., determines YES) when a rate R1_2of the number of pixels NX_2having the brightness BR3being within a predetermined range [α1_2, α2_2] with respect to the total number of pixels NT_2(i.e., R1_2=NX_2/NT_2) in the histogram HG2is equal to or smaller than a predetermined threshold value Rth1_2. As another example, the processor108determines YES when a rate R2_2of the number of pixels NY_2having the brightness BR3being out of the range [α1_2, α2_2] with respect to the total number of pixels NT_2(i.e., R2_2=NY_2/NT_2) in the histogram HG2is equal to or larger than a predetermined threshold value Rth2_2. As yet another example, the processor108determines YES when a matching degree between a locus of a graph line in the histogram HG2and a locus of a graph line of a reference histogram HGR_2is smaller than a predetermined threshold value. As yet another example, the processor108determines YES when a standard deviation of the histogram HG2is larger than a predetermined threshold value. The processor108proceeds to step S20inFIG.20when determining YES in this step S53, while the processor108proceeds to step S33inFIG.20when determining NO. In step S33, the processor108executes a cleaning determination scheme for height level1. This step S33will be described with reference toFIG.23. In step S61, the processor108functions as the image data generation section28to generate image data ID3_1(third image data) indicating a degree of change in brightness between the image data ID1_1of the image zone54a′ of height level1in the image data ID1captured in step S11, and the image data ID2_1of the image zone54a′ of height level1in the image data ID2captured in the most-recent step S15. Specifically, similarly to step S4described above, the processor108generates the image data ID3_1having the number of pixels the same as the image data ID1_1and the image data ID2_1, by calculating the brightness BR3of each pixel of the image data ID3_1, using Equation (1), Equation (2), or Equation (3). The brightness BR3of each pixel of the image data ID3_1is a value corresponding to the degree of change between the brightness BR1of the pixel of the image data ID1_1and the brightness BR2of the pixel of the image data ID2_1which corresponds to the pixel of the image data ID1_1. In step S62, the processor108acquires the histogram HG1of the image data ID3_1generated in step S61. The histogram HG1is data indicating a relationship between the brightness BR3of each pixel of the image data ID3_1and the number of pixels N of the image data ID3_1. In step S63, the processor108functions as the determination section146to determine whether or not to clean the zone54aof height level1based on the histogram HG1. As an example, similarly to step S6described above, the processor108determines that it is necessary to clean the zone54aof height level1(i.e., determines YES) when a rate R1_1of the number of pixels NX_1having the brightness BR3being within a predetermined range [α1_1, α2_1] with respect to the total number of pixels NX_1(i.e., R1_1=NX_1/NX_1) in the histogram HG1is equal to or smaller than a predetermined threshold value Rth1_1. As another example, the processor108determines YES when a rate R2_1of the number of pixels NY_1having the brightness BR3being out of the range [α1_1, α2_1] with respect to the total number of pixels NT_1(i.e., R2_1=NY_1/NT_1) in the histogram HG1is equal to or larger than a predetermined threshold value Rth2_1. As yet another example, the processor108determines YES when a matching degree between a locus of a graph line of the histogram HG1and a locus of a graph line of a reference histogram HGR_1is smaller than a predetermined threshold value. As yet another example, the processor108determines YES when a standard deviation of the histogram HG1is larger than a predetermined threshold value. The processor108proceeds to step S22inFIG.20when determining YES in this step S63, whereas the processor108proceeds to step S24inFIG.20when determining NO. Thus, in the present embodiment, the processor108acquires the histograms HG3, HG2, and HG1for the respective image zones60a′,58a′, and54a′ set in step S16, and determines whether or not to clean the zones60a,58a, and54arespectively, based on the acquired histograms HG3, HG2, and HG1. According to this configuration, it is possible to determine whether or not to clean each of the zones60a,58a, and54awith high accuracy, by means of a statistical technique. Note that the cleaning system100may include a plurality of cleaning nozzles and a plurality of attachment devices. Such an embodiment is illustrated inFIG.24. The cleaning system100′ illustrated inFIG.24differs from the above-described cleaning system100in that the cleaning system100′ includes a plurality of cleaning nozzles16A and16B, and a plurality of attachment devices106A and106B. The fluid supply device18supplies fluid to the cleaning nozzle16A through a fluid supply tube26A, and supplies fluid to the cleaning nozzle16B through a fluid supply tube26B. The attachment devices106A and106B are provided on the side walls54bof the splash guard54, which face each other in the x-axis direction of the robot coordinate system CR. The cleaning nozzle16A is detachably attached to the attachment device106a, while the cleaning nozzle16B is detachably attached to the attachment device106B. The processor108divides the work area62into an area62A on the x-axis negative direction side of the robot coordinate system CR, and an area62B on the x-axis positive direction side of the robot coordinate system CR. The processor108causes the robot104to grip the cleaning nozzle16B and clean the work area62by the cleaning nozzle16B, after (or before) causing the robot104to grip the cleaning nozzle16A and cleaning the area62A by the cleaning nozzle16A. For example, the processor108cleans each of the areas62A and62B by executing the flow illustrated inFIG.16orFIG.20for each of the areas62A and62B. When executing the flow illustrated inFIG.16orFIG.20for the area62A, in steps S11and S15, the processor108images the area62A by the imaging device14. On the other hand, when executing the flow illustrated inFIG.16orFIG.20for the area62B, in steps S11and S15, the processor108images the area62B by the imaging device14. According to the present embodiment, it is possible to reliably perform the cleaning operation on each of the areas62A and62B of the work area62, using the corresponding cleaning nozzles16A and16B. In the cleaning system100or100′ described above, the imaging device14is a three-dimensional vision sensor capable of measuring a distance to an object. However, the cleaning system100or100′ may further include a height measurement instrument for measuring the height h of the work area62, wherein the imaging device14may be a camera capable of capturing image data. In the embodiments described above, the work area62includes the zones54a,58a, and60aof three height levels. However, it should be understood that the work area62may include zones of any number of height levels. In the embodiments described above, the bottom wall54a, the telescopic cover58, and the machining table60are exemplified as elements constituting the zones54a,58a, and60aof different height levels. However, the work area62may have any element other than the bottom wall54a, the telescopic cover58, and the machining table60. The cleaning system10,100, or100′ described above may include a plurality of imaging devices14A and14B. For example, the imaging device14A may image a part of the work area62(e.g., the area62A described above), while the imaging device14B may image the other part of the work area62(e.g., the area62B described above). Further, a light source for assisting image-capturing (not illustrated) may be provided for increasing light emitted to the work area62when imaging the work area62by the imaging device14,14A or14B in the above-described steps S1, S3, S11, or S15. The light source for assisting image-capturing may be a fluorescent lamp, an LED, or the like, and may be integrally incorporated in the imaging device14,14A or14B, or may be provided separate from the imaging device14,14A or14B. In the embodiments described above, the processor20performs the simulation machining process in steps S1and S11. However, if the machining fluid is not used in the above-described step S2or S14for example, the processor20may cause the imaging device14to image the work area62without performing the simulation machining process in step S1or S11. Further, in the simulation machining process performed in step S1or S11described above, a dummy workpiece having any shape, with which the tool64does not contact during the simulation machining process, may be used. Further, in step S1or S11, after the simulation machining process is performed, the dummy workpiece is removed and then the image of the work area62may be captured, and subsequently, in step S3or S15described above, after the workpiece machined in step S2or S14is removed from the jig and then the image of the work area62may be captured. When the cleaning system100executes the flow illustrated inFIG.16, the image data ID1indicating the state before machining is not necessarily imaged by the imaging device14in step S11, but may be created by an operator as image data of computer graphics, for example. The robot104describe above may be any type of robot, such as a horizontal articulated robot, and a parallel link robot. Although the present disclosure has been described through the above embodiments, the above embodiments are not intended to limit the claimed invention. | 73,491 |
11858012 | DESCRIPTION OF EXEMPLARY EMBODIMENTS Currently used cleanroom wipers pre-saturated with LPA are comprised of polyester. Polyester wipers need to fully wet a surface to be cleaned in order to get any kind of cleaning efficiency. One hundred percent polyester fabrics do not leave surfaces dry. Leaving a cleaned surface in a cleanroom wet with IPA is not a concern because all of the IPA will quickly evaporate. However, the downside to using IPA is that the IPA fumes are hazardous, flammable, and a source of pollution. In addition, 100% polyester easily sheds particles due to its lower resistance to abrasion. Despite the issues and drawbacks associated with IPA pre-saturated polyester wipers, semiconductor fabrication plants would never consider using water with wipers because many tools in the semiconductor manufacturing process must operate at 104to 107atmospheres and leaving water in the tool will extend pump down times by three to five times or by many hours. Plants will not allow these pump down times because the tools are valued at over $10,000 dollars/hr. However, if a wiper for use with water could be manufactured such that it would function like a wiper used with IPA, i.e. function so that it cleans but does not leave a cleaned surface wet, then semiconductor fabrication plants may readily elect to use them since they do not possess the safety and health risks associated with IPA. The present invention is directed to just such a wiper. The present invention includes a pre-saturated wiper that is saturated exclusively with Ultrapure water (UPW) and that is constructed in such a way that the UPW immediately and evenly wets into the wiper and is capable of cleaning critical surfaces without leaving water on the critical surface. The present invention also includes a method for making the UPW pre-saturated wiper of the present invention. FIG.1is a flow chart showing steps in an exemplary method10for making the UPW pre-saturated cleanroom wiper of the present invention. First, in step12, fibers are selected for creating a woven fabric that will be used to make the wipers. The fibers include a first microfiber that is a nylon/polyester conjugate and a second fiber that is a polyester. A photo of a first microfiber that can be used to make the woven fabric that is used to make one exemplary embodiment of the wiper of the present invention is shown inFIG.2. The first microfiber material is soft, shiny, and very bulky. It also provides for excellent moisture penetration and air ventilation. The nylon/polyester conjugate may be made of 25-30% nylon and 70-75% polyester. In one particular exemplary embodiment, the nylon/polyester conjugate may comprise 72% polyester and 28% nylon. A photo of a second microfiber that can be used to make the woven fabric that is used to make the exemplary embodiment of the wiper of the present invention is shown inFIG.3. The second microfiber material is soft, high density, waterproof, permeable to moisture, and has a high tensile strength. In step14, the first and second microfibers are woven using a specific weaving pattern like that shown inFIG.5which assists in enabling the woven fabric to be Fast Water Wet Out, meaning that water can immediately and evenly wet into the woven fabric. The weaving pattern shown inFIG.5is one repeating unit that includes 6 warp threads and 18 weft threads. Each box shows the interlocking point of the weave. “X” means the warp yarn/microfiber is above the weft yarn/microfiber on this interlocking point. The first microfiber material described above is used as the weft thread and the second microfiber material described above is used as the warp thread. The first and second microfibers are woven to create a roll of woven fabric that is used to make the wipers. In one exemplary method, the rolls of woven fabric may comprise 61-inch-wide rolls of woven fabric. The woven fabric is processed in step16with high temperature and high pressure and one or more agents such as a surfactant that lowers the interfacial tension between UPW and the woven fabric thereby acting as a wetting agent. This processing further assists in enabling the woven fabric to be Fast Water Wet Out. After processing, a special arrangement on the loom used to weave the microfibers into the woven fabric is used to relax the woven fibers as shown inFIG.6. A resulting starfish type cross section of the Fast Water Wet Out processed woven fabric is shown inFIG.4. In step18, the processed roll of woven fabric is then clean processed with aseptic ultra pure water. More specifically, the roll of processed woven fabric is washed with detergent for 10 minutes and then rinsed for 36 minutes by performing nine rinses for 4 minutes each. Water is extracted from the roll by spinning it for 5 minutes at 300 rpm and then for 5 minutes at 600 rpm. The roll is then dried in the dryer at 85 degrees Celsius for 2 hours. Wipers are then formed from the roll of processed woven fabric in step20. The roll of processed woven fabric is further processed into thinner rolls of fabric and finally to sheets. Smaller rolls and sheets of processed woven fabric are simultaneously cut and sealed with an ultrasonic tool that has a PVD coating on top of the stainless steel to minimize metal contamination transferring to the wiper from the tooling. The fabric is cut and sealed along the length to form sealed edges and then it is processed on another machine to be cut and sealed across the web to create an individual wiper. In step22, the individual sealed edge wipers are packaged and pre-saturated with UPW. The wipers are flat stacked on top of each other with 10 or 20 wipers per package. Rolling, ironing, and cutting of the roll of processed woven fabric to form wipers is done in a clean room. Packing and pre-saturation of the wipers is also done in a clean room. The packaged pre-saturated wipers are then sterilized using gamma radiation in step24. Gamma irradiation is a standard sterilization procedure in which gamma irradiators are powered by Cobalt-60 to effectively kill microorganisms throughout the product and its packaging with very little temperature effect and no residues. Finally, lots of packaged, sterilized products are tested in step26to certify cleanliness. The UPW pre-saturated cleanroom wipers of the present invention work like IPA pre-saturated cleanroom wipers without the safety, environmental, and health issues that are associated with IPA. The UPW pre-saturated cleanroom wipers are clean, smooth and capable of effective cleaning without leaving water behind on the cleaned surface. The woven fabric that comprises the pre-saturated wipers is designed so that the cleaning surface dries very quickly, as it does with IPA pre-saturated wipers. Process benefits from using the UPW pre-saturated cleanroom wipers of the present invention include, but are not limited to, 1) protecting VOC sensitive fab modules such as lithography, metrology, and CVD from solvent fumes, 2) reducing the risk of fiber and particle excursions associated with fab wipers, 3) improved contamination pickup leading to faster preventative maintenance and improved equipment uptime, 4) even, consistent wetting of wipers which enables excellent first pass cleaning results and reduced cleaning time, and 5) a wiper optimized for use in the most advanced wafer fabs. In addition, using the UPW pre-saturated cleanroom wipers of the present invention enables reduced cost of ownership by reducing wiper usage resulting in a reduction of waste removal cost, greatly reducing VOC process exposure and fugitive emissions costs by eliminating IPA wipes, reducing the cost of Test Wafers by improving 1thPass quality, reducing costs associated with tool downtime by improving particle control, and reducing mean time to clean. Environmental health and safety benefits experienced with the use of the UPW pre-saturated cleanroom wipers of the present invention include, but are not limited to, 1) eliminating fire risk during cleanroom wipe downs by reducing flammable chemical storage and solvent squirt bottles, 2) eliminating fugitive VOC emissions and air permit implications associated with solvent wiping, and 3) eliminating personnel exposure to isopropyl alcohol during cleanroom wipe downs. Initial evaluations of performance and contamination characteristics of the UPW pre-saturated cleanroom wipers of the present invention show improvements over existing IPA pre-saturated wipers. Some initial data showing these characteristics for the UPW pre-saturated cleanroom wipers of the present invention are set forth in Table 1 below. The data in Table 1 represents typical analyses of the wipers after seven days of saturation (in dry state). The unit of measurement refers to the standard unit used in standard test methodEST-RP-C004.3. TABLE 1PropertyTypical ValuePerformance CharacteristicsBasis Weight160g/m2AbsorbencySorptive Capacity330mL/m2Sorptive Rate0.5secondsContamination CharacteristicsLPC ≥ 0.5 μm700particles/cm2Fibers ≥ 100 μm250fibers/m2Non-Volatile ResidueIPA extractant0.15g/m2DI Water extractant0.05g/m2IonsChloride0.10ppmSodium0.20ppmPotassium0.20ppmOrganic with FTIRSiliconeNot detectedAmideNot detectedDOPNot detectedVOC0ppb The drawings and description of exemplary embodiments of the invention herein shows various exemplary embodiments of the invention. These exemplary embodiments and modes are described in sufficient detail to enable those skilled in the art to practice the invention and are not intended to limit the scope, applicability, or configuration of the invention in any way. Rather, the following disclosure is intended to teach both the implementation of the exemplary embodiments and modes and any equivalent modes or embodiments that are known or obvious to those reasonably skilled in the art. Additionally, all included examples are non-limiting .illustrations of the exemplary embodiments and modes, which similarly avail themselves to any equivalent modes or embodiments that are known or obvious to those reasonably skilled in the art. Other combinations and/or modifications of structures, arrangements, applications, proportions, elements, materials, or components used in the practice of the instant invention, in addition to those not specifically recited, can be varied or otherwise particularly adapted to specific environments, manufacturing specifications, design parameters, or other operating requirements without departing from the scope of the instant invention and are intended to be included in this disclosure. Unless specifically noted, it is the Applicant's intent that the words and phrases in the specification and the claims be given the commonly accepted generic meaning or an ordinary and accustomed meaning used by those of ordinary skill in the applicable arts. In the instance where these meanings differ, the words and phrases in the specification and the claims should be given the broadest possible, generic meaning. If any other special meaning is intended for any word or phrase, the specification will clearly state and define the special meaning. | 11,148 |
11858013 | The Figures described above are a representative set, and are not an exhaustive with respect to embodying the invention. DESCRIPTION Disclosed are a system, method, and article of manufacture of automatic and simultaneous coloring of multiple molded or 3D printed articles in multiple shapes and colors. The following description is presented to enable a person of ordinary skill in the art to make and use the various embodiments. Descriptions of specific devices, techniques, and applications are provided only as examples. Various modifications to the examples described herein can be readily apparent to those of ordinary skill in the art, and the general principles defined herein may be applied to other examples and applications without departing from the spirit and scope of the various embodiments. Reference throughout this specification to “one embodiment,” “an embodiment,” “one example,” or similar language means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, appearances of the phrases “in one embodiment,” “in an embodiment,” and similar language throughout this specification may, but do not necessarily, all refer to the same embodiment. Furthermore, the described features, structures, or characteristics of the invention may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided, such as examples of programming, software modules, user selections, network transactions, database queries, database structures, hardware modules, hardware circuits, hardware chips, etc., to provide a thorough understanding of embodiments of the invention. One skilled in the relevant art can recognize, however, that the invention may be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention. The schematic flow chart diagrams included herein are generally set forth as logical flow chart diagrams. As such, the depicted order and labeled steps are indicative of one embodiment of the presented method. Other steps and methods may be conceived that are equivalent in function, logic, or effect to one or more steps, or portions thereof, of the illustrated method. Additionally, the format and symbols employed are provided to explain the logical steps of the method and are understood not to limit the scope of the method. Although various arrow types and line types may be employed in the flow chart diagrams, and they are understood not to limit the scope of the corresponding method. Indeed, some arrows or other connectors may be used to indicate only the logical flow of the method. For instance, an arrow may indicate a waiting or monitoring period of unspecified duration between enumerated steps of the depicted method. Additionally, the order in which a particular method occurs may or may not strictly adhere to the order of the corresponding steps shown. Definitions Autoclave is a pressure chamber used to carry out industrial processes using elevated temperature and pressure different from ambient air pressure. Programmable logic controller (PLC) is an industrial digital computer which has been ruggedized and adapted for the control of manufacturing processes. Polyamide 11 (PA 11) is a polyamide, bioplastic and a member of the nylon family of polymers produced by the polymerization of 11-aminoundecanoic acid. Polyamide 12 is a polymer with the formula [(CH2)11C(O)NH]n. Polyamide 12 is made from w-aminolauric acid or laurolactam monomers that each have 12 carbons. Pound per square inch (psi) is a unit of pressure or of stress based on avoirdupois units. It is the pressure resulting from a force of one pound-force applied to an area of one square inch. In SI units, one (1) psi is approximately equal to 6895 N/m2. Sintering is the process of compacting and forming a solid mass of material by heat or pressure without melting it to the point of liquefaction. Selective laser sintering (SLS) is an additive manufacturing (AM) technique that uses a laser as the power source to sinter powdered material (e.g. nylon/polyimide), aiming the laser automatically at points in space defined by a 3D model, binding the material together to create a solid structure. Solenoid valve is an electromechanical device in which the solenoid uses an electric current to generate a magnetic field and thereby operate a mechanism which regulates the opening of fluid flow in a valve. 3D is three-dimensional space. Ultrasonic transducer is a type of acoustic sensor that can include, inter alia: transmitters (convert electrical signals into ultrasound), receivers (receivers convert ultrasound into electrical signals) and transceivers (transceivers can both transmit and receive ultrasound). Exemplary Systems An example system for permeating color into the components can include, inter alia: an ultrasonic cleaning tank, an autoclave, carrier, a lid assembly, a robotic system, an ultrasonic transducer, a thermocouple, a pressure transducer or indicator, a water level indicator, a solenoid valve, a pressure relief valve, a gaskets, pumps, piping assembly, a water tank, nozzles, a pneumatic cylinder, PLC, band heater with insulating jackets and non-return valve. FIG.1discloses a carrier (e.g. carrier204infra), which can be used as a medium to carry the substrate or a part, which is to be colored. As disclosed, said carrier comprises of a perforated body103, handles101and legs102. The perforated body103is designed in such a fashion that it can retain the substrate/part, which is to undergo color permeation. The designing of the body is such that it safely retains the part and also facilitates permeation of color on the same. The said carrier can be operated using handles101and its movement is facilitated by legs102, which can be foldable and can be adjusted. Reference is made toFIG.2toFIG.4discloses a single automated coloring unit. The system for permeating color comprises of various modules, which can work in synchronization with each other as a single unit as well as a combination of multiple units working independently of each other undertaking different activities at the same time. More specifically,FIGS.2A-C illustrate an example single automated coloring unit200, according to some embodiments. The system discloses an autoclave201, which acts as a pressure vessel which can dye frames with the color of own choice. The carrier204is a removable part, wherein three (3) different parts of one frame can be kept. The present invention further comprises of a lid assembly202, which has automated opening and closing assembly with toggle clamping mechanism, working on pneumatic system. It further comprises of a robotic system for automatic loading and unloading of carrier(s)204and for transporting the carrier204for next operation. The ultrasonic transducer is used for agitation of dye bath. Thermocouples213present acts as temperature sensor. Pressure transducer or indicator is used for measurement of internal pressure of the autoclave. There exists a water level indicator for measuring the two different level of solution/fluid in each autoclave. A solenoid valve is used for controlling the feed, whereas pressure relief valve is used for safety. Gaskets are used to seal the Automated Lid Opening/Closing Assembly203, whereas pumps can be used for water feeding. Piping assembly can be used for 8 transportation of liquid. Water tank is used for storage of hot water. The nozzles207can facilitate opening of feed system. The pneumatic cylinder is used for opening and closing assembly of the lid. PLC can be used for reliable control and ease of programming and process fault diagnosis. The band heater (e.g. heater assembly205) with insulating jackets can be used for heating system. The non-return valves are used for better fluid control. Holder206can hold single automated coloring unit200. FIG.3illustrates an example cluster300of ten (10) autoclaves, according to some embodiments. Cluster300includes an ultrasonic machine301for the ten (10) autoclaves. Cluster300includes water tank with motor302. Cluster300includes drainage tank303. Cluster300includes ten (10) autoclaves such as autoclave304. It is noted that in other examples n-number autoclaves can be included in system300. Autoclaves are connected to water pipeline305via solenoid valve306. Water pipeline305connects/drains from water tank with motor302. Autoclaves are connected to sewage pipeline307. Sewage pipeline307drains to drainage tank303. FIG.4illustrates an example schematic of feeding system400, according to some embodiments. Feeding system400includes reservoir401. Feeding system400includes hot water tank402. Feeding system400includes chemical mixing tank403. Feeding system400includes valve(s)404. Feeding system400includes nozzles405. Feeding system400includes autoclave406. Feeding system400includes carrier407. Exemplary Methods FIG.5illustrates an example process500for permeating color into components, according to some embodiments. In step502, the substrates (e.g. parts) are manually placed inside the carrier and the carrier is placed inside ultrasonic cleaning tank. The ultrasonic cleaning machine is operated and two to three grams (2-3 gms) of NaOH can be added. The PH level is maintained between eight to ten (8-10) and continued till a specified time. After ultrasonic cleaning, the carrier is transported with a robotic arm to the next station. In step504, the carrier is then inserted into a washing tank for neutralization of substrate with water. The door/lid of autoclave is kept open and place the carrier inside with a robot system and close the door. In step506, warm water is fed into a channel of the washing tank up to a specified level (e.g. level one (1) of water208, etc.). In step508, steaming can be implemented (see infra). For example, once the desired value of psi pressure (e.g. lbf/in2) is achieved, process500starts a count of time and maintains the same pressure for a pre-defined time period. The heater can then be turned off. In step510, after steaming, process500feeds the water up to another specified level (e.g. level two (2) of chemical mixed water209for dyeing, etc.). In step512, process500adds the dyestuff with the inclined hopper. The vibratory system is started along with a heater, when the pressure increases to fifteen (15) psi start count of time to five (5) minutes (e.g. maintain fifteen (15) psi pressure of steam during dyeing) and then turn off heater. The solution is cooled (e.g. up to forty to sixty (40-60) degrees, etc.) followed by stopping the vibratory system. The pressure is then released and the doors are kept open for picking the carrier and put into the washing tank with two to three (2 to 3) wash cycles. The solution is simultaneously drained through discharge valve. The autoclave is washed with water and cleaning liquid. In another embodiment, the plastic article is made up of a class of polyamide plastic that includes polyamide 11, polyamide 12 including its filled grade by using molded or selective laser sintered 3D printing process or by any additive manufacturing process. Other plastic or composite materials may also be used which formed using other additive processes are including stereo lithography and filament fusion techniques or Injection molded. The plastic article is cleaned 10 with bead blasting machine or pressurized compressed air (two to four (2 to 4) bar pressure) to remove un-sintered powder which gets stuck to parts while processing. Cleaned parts are polished in a vibratory tumbler or centrifugal finishing machine or disc finishing machine or sand papered or buffed depending upon final application and finish of the parts. Parts are loaded into individual carriers which are connected to a robotic arm that automatically takes the parts through the stages of the coloring process. The parts are submerged in an ultrasonic cleaning tank to remove the dirt, grease, oil etc. Ultrasonic cleaning is performed by using a twenty percent (20%) NaOH solution. The parts are fed into n-different carriers (e.g. twenty-five (25) different carriers, etc.) and placed inside separate pressurized vessels or autoclaves with the robotic arm for coloring the n-different shades (e.g. twenty-five (25) shades, etc.) of a same or a different color or mixture of colors. It is noted that in step508, parts are steamed in the closed vessel for predetermined period (e.g. five to one-hundred and twenty minutes (5 to 120 min)). The time period can be a function of the dye being used and the material properties of the parts. Color particles are added depending upon specified shades (Light, dark) between 0.5 μm to 100 μm with the specified auxiliaries (e.g. leveling agent, dispersing agent, wetting agent, buffer solution, fixing agent, scoring agent) to the solvent in n-different (e.g. 25 different, etc.) pressure vessels automatically. Coloring is performed under low pressure between ten to fifteen (10 to 15) psi pressure for predetermined period of time between five to one-hundred and eighty minutes (5 min to 180 min) at a temperature between fifty degrees Celsius (50° C.) to one-hundred and eighty degrees Celsius (180° C.) depending on the dye and auxiliaries used in the process as well as material properties of the part being colored. The solution is allowed to cool between ten to one-hundred and twenty minutes (10 to 120 min) for conditioning the parts. The carriers are unloaded from the vessel and placed in the washing tank with the robotic arm to perform clean step514. Two cycles of washing can be performed, one with hydro-mixed warm water (one of the bleaching system to remove the loose color particle) and second with cold or warm demineralized water. After washing, the parts are unloaded from the carrier and placed into the drying chamber, in step516, for predetermined time between ten to sixty minutes (10 min to 60 min). Drying temperature is set by considering temperature of the plastic parts. Drying is performed with infrared light, convection oven or vacuum oven to remove excess or entrapped moisture from the surface of the article. An example embodiment of process500is now described. The plastic article is made up of selective laser sintering (SLS). This is an additive manufacturing (AM) technology that uses a laser to sinter powdered plastic material into a solid structure or article based on a molded or 3D model. This method work with a range of materials, including plastics, metals, glass, ceramics, and various composite material powders. Other plastic or material also be used which are formed by other additive manufacturing process (e.g. stereo lithography, filament fusion technique, injection molded, etc.). Different parts are fixed in the different carriers depending on which color to be done. The carriers are then moved to the next operation in the automated coloring machine with a robotic arm. Robotic arm is used to carry the carrier to the next station. The carrier is a metallic body with a handle designed to hold different parts for the ease of operation in the automatic coloring machine. The automated coloring machine consists of twenty-five (25) different autoclaves aligned in the rectangular form which are linked to each other with a different piping system for various purposes. Each autoclave has approximately ten-liter volumetric capacity and works below fifteen (15) psi internal pressure, as a result this is not come under any boiler act. The autoclave consists of nozzles for solvent and dyestuffs which work using an auto feeding system. Autoclave is equipped with different sensors and measuring instruments for ease of automation and safety consideration. The autoclave lid is closed automatically after keeping carrier inside. Lid opening and closing assembly211works on a toggle clamping mechanism with pneumatic system with substantially no pressure leakage. A pressure gauge can be located at opening for pressure gauge212. Process500can inject the solvent into autoclave with automatic system up to desired level for steaming. Demineralized water is used as a solvent for steaming operation. Steam is generated inside the autoclave by heating the solvent at an elevated temperature, most preferably above one-hundred and twenty degrees Celsius (120° C.) and low pressure of steam is maintained, most preferably fifteen (15) psi. Process500can steam the parts for five (5) minutes to three (3) hours after reaching fifteen (15) psi of pressure inside the autoclave. Process500can release the steam pressure with a release valve to conduct next operation called dyeing. For the dyeing operation, process500can inject solvent to the next desired level (e.g. fully submerge article being dyed) with automatic system. Process500can insert the dyeing solution into solvent and mixed it with ultrasonic transducer. Ultrasonic transducer can have a frequency of around forty to fifty Hertz (40-50 Hz). The dye solution is prepared by mixing of dye particles with different auxiliaries. Each of different auxiliaries has its special purpose in the dyeing process. Dye particles can be the class of metal complex acid dyes, acid dyes, solvent dyes, reactive dyes, direct dyes. Auxiliaries can include, inter alia: levelling agent, dispersing agent, wetting agent, buffer solution, fixing agent, scoring agent, etc. The dye solution is injected into the solvent with an automatic injection system. Process500can heat the solution from fifty to one-hundred and eighty degrees Celsius (50° C. to 180° C.). In one example, this can be between ninety and one-hundred and twenty-five degrees Celsius (90° C. to 125° C.). Process500can maintain the pressure equal to and less than fifteen (15) psi for predetermined time between five to one-hundred and eighty (5 to 180 min). In one example, this can be between fiver to sixty minutes (5 to 60 min). More preferably between five to thirty minutes (5 to 30 min). Allow the solution to cool up to 50° C. and stopped the vibratory system. Process500can drain the dyeing solution with a drainage valve. Open the lid of autoclave, remove the carrier with the robotic arm and carry to the next station. Process500can simultaneously clean (e.g. in step514) the autoclave with the cleaning solution two to three (2 to 3) times. Process500can clean the dyed parts in the washing tank. Process500can remove the parts from the carrier and dry it in the hot air oven or in vacuum oven or with the infrared light for thirty to sixty minutes (30 to 60 min). FIG.6illustrate an example process600for permeating color into components, according to some embodiments. In step602, process600permeates color in a part, in such a manner, that it adheres on to the parts even after low depth scratches on the surface. In step604, process600permeates color such that the visual appearance of the color shade remains the same, even after the top surface has reasonable wear. In step606, process600can be applied to different types of 3D printed parts that are polymer based, including 3D printed composite parts such as PAI 1, 12, aluminum filled polyamide, carbon filled polyamide etc. In step608, process600is made scalable, that is, which can manufacture high volumes of parts within short cycle time. In step610, process600is configured to capable of coloring a number of different parts simultaneously such as applications include eyewear, footwear, accessories, jewelry, furniture, lighting and other consumer products. In step612, process600permeates color into components, such that it automates the post-processing and coloring of molded or 3D-printed parts in multiple different colors simultaneously. CONCLUSION Although the present embodiments have been described with reference to specific example embodiments, various modifications and changes can be made to these embodiments without departing from the broader spirit and scope of the various embodiments. For example, the various devices, modules, etc. described herein can be enabled and operated using hardware circuitry, firmware, software or any combination of hardware, firmware, and software (e.g., embodied in a machine-readable medium). In addition, it will be appreciated that the various operations, processes, and methods disclosed herein can be embodied in a machine-readable medium and/or a machine accessible medium compatible with a data processing system (e.g., a computer system), and can be performed in any order (e.g., including using means for achieving the various operations). Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense. In some embodiments, the machine-readable medium can be a non-transitory form of machine-readable medium. | 21,068 |
11858014 | SUMMARY The method of reducing marine growth on underwater portions of marine vessels hulls and vibratory sensitive underwater structures includes providing a plurality of ultrasound (US) transducers in contact with an inboard surface the underwater portions of marine vessels and structures. The inboard surface these underwater portions of marine vessels and vibratory sensitive structures must be able to transmit US waveforms therethrough. The method digitally generates disruptive, multi-frequency, interfering US waveform signals, then converts the digital signals into analog signals and then applies the analog signals to the US transducers. As a result, the transducers generate disruptive, multi-frequency, interfering US waveforms through the underwater portions of the marine vessels and structures which US waveforms disrupt unwanted marine growth on the vessel or structure. The digital signals, and also the analog signals, are complex waveform signals, typically produced with a Bessel function. The US transducers are either circular membrane transducers or surface transducers. The system for reducing or controlling marine growth includes a computer processor coupled to a memory store. The processor and memory digitally generate disruptive, multi-frequency, interfering US waveform signals which are applied to a digital to analog converter to obtain representative analog signals. A plurality of ultrasound (US) transducers are disposed inboard of the underwater portions of marine vessels or structures. The analog signals are applied to the US transducers. As a result, the US transducers generate disruptive, multi-frequency, interfering US waveforms through the underwater portions of the marine vessels or structures. DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION The present invention relates to a method and a system for controlling marine growth using complex ultrasonic waveforms. FIG.1diagrammatically illustrates the driver-processor for the complex US waveform generator and several US transducers. In a preferred embodiment, the driver-processor includes processor12, memory14, and input-output (I/O) module16. The output from processor12is applied to digital-analog (D/A) converter18. The output of the D/A converter18is applied to an amplifier20. Several amplifiers may be needed dependent upon the number of US transducers. The output of amplifier20is applied to one or more US transducers,23,25and27. Input is provided to processor12and memory14via a keypad or keyboard32. A display34permits the user to visually interact with processor12and memory14. Keypad32and display34is coupled to I/O30. In one embodiment, the processor12, memory14, D/A converter18, and amplifier20may be located on a single computer board. Keypad32and display34may be any electronically coupled input and output device used in connection with computer systems. FIG.2diagrammatically illustrates a portion of a vessel or structure, subject to marine growth due to the maritime environment49, and also illustrates a number of US transducers (UT) coupled to the driver-processor60mounted in a computer cabinet housing computer system54. Hull segment or vibratory sensitive underwater structure52represents underwater portions of marine vessels hulls and underwater portions of vibratory sensitive structures. These underwater portions of vibratory sensitive structures must be able to transmit US waveforms, in a generally similar manner as the hull of a vessel. UTs23,25,27,29are disposed inboard the vessel or the structure in order to permit transmission of the US waveforms therethrough. Computer system54includes a central processing unit, CPU62, and other computer components. As discussed below, driver-processor-computer60is, in one embodiment, a Raspberry Pi board-mounted computer. The compact circuit board computer60is connected to the main bus77of computer system54. As is known in the computer industry, circuit boards are typically slid into complementary slots in the computer box or enclosure. Other computer boards in the computer system54carry CPU62and memory64. I/O board66is typically mounted in a different slot in the computer enclosure. I/O66communicates with other external devices76. Power is supplied to computer system54by power system74. The vessel may include a navigation (NAV) system. The navigation module68may be disposed in computer system54. The NAV system has an I/O module70coupled to other navigational components72such as radar detectors, sonar detectors and other antennas. To better disrupt marine growth on hull52, the invention produces US signals other than square waves. To achieve this, one embodiment of the invention uses a digital to analog converter (D-A18) attached to the Raspberry Pi controller/driver (processor12, memory14). The Raspberry Pi is a low cost, credit-card sized computer which can be programmed similar to processor12using programs stored in memory14. The output of the computer processor12is applied to a high speed digital to analog (D/A) converter18(for example, an MCP4921) which converts the digital signal from the computer processor to an analog counterpart. In an enhanced embodiment, the D/A conversion is part of the US transducers. In any event, analog electrical signals are applied to the circular membrane or surface transducers. In other embodiments, the D/A converter is a distinct module. In one embodiment, the controller/driver/processor12generates a selected pattern of twelve binary values which are applied to D/A converter18which in turn produces an analog output with a resolution of 4,096 points. The D/A converter18allows the system to reproduce far more complex wave shapes than the prior art square wave generator. In addition, the D/A converter in the present embodiment can operate at a high enough sampling rate to properly reproduce ultrasonic frequencies. In one embodiment, a complex Bessel waveform is generated by the computer processor12and D/A converter18. The digitally generating disruptive, multi-frequency, interfering US waveform signals replicate a Bessel function stored in the memory14and the signals are generated by processor12. The selected Bessel function is downloaded or coded into memory14. In one embodiment, the complex US waveform generated by processor12was modeled via software using a Bessel mathematical function. The Bessel function, also called the Cylinder Function, is any of a set of mathematical functions systematically derived around 1817 by the German astronomer Friedrich Wilhelm Bessel. One of the several core concepts in the present invention is the use of a disruptive ultrasound (US) generation system where multiple frequencies are emitted at the same time that interfere both constructively and destructively to create a complex-US waveform applied to the vessel hull. Such complex waveforms are best expressed by Bessel functions. Other complex waveforms may be used provided that the US waveforms have disruptive, multi-frequency, interfering waveforms. The interference is both constructive and destructive in nature. An investigation has shown that effective, anti-fouling US waveforms (ultrasonic or ultrasound waveforms) should be complex (not simple sine waves or square waves); have a composite frequency spectrum about 20 kHz otherwise in an (ultrasonic range); and generate vibrations produced by a circular membrane or surface (like a drum or cymbal). As an example, a circular SOANAR transducer was used in the tests described below. These SOANAR transducers were driven by electrical signals representing a Bessel function. Other circular membrane/surface transducers could be used. Investigations used three basic empirical steps to develop the desired complex (Bessel) enhanced marine growth control waveforms. First, recordings were made of instruments that make use of a vibrating membrane (drums). Second, the recordings were frequency shifted from the human audible range to the ultrasonic range above 20 khz using sound editing software (see AUDACITY software). This frequency shifting was accomplished by speeding up the recording, similar to running a tape recording at a higher speed than originally recorded. Third, the frequency shifted recordings were combined to cause the most disturbance as empirically observed using a “Disturbance Observation Apparatus (DOA)”. The DOA enabled a visual evaluation of the impact of a waveform on a test surface. The DOA apparatus included a closed top, generally square Plexiglass container to which was attached the US transducer. A number of plastic beads are inserted into the Plexiglass container. In addition, the container is filled with sea water to allow for a better simulation of the effectiveness of the waveform under test and observation and its effectiveness to create disturbance patterns on the beads submerged in the sea water. The container was temporarily sealed to prevent the beads and water from escaping. The DOA established an empirical gauge of the effectiveness of applied ultrasonic waveforms permitting observation of the disturbed, water-bound plastic beads. The observed empirical results guided the design of new US waveforms. Thereafter, the effectiveness of different US waveforms, compared to prior art waveforms, was the subject of long-term sea trials. The present invention discovered the benefits of different frequencies and the use of a succession of multiple frequencies ranging from lower ultrasonic to higher micro-sonic frequency to efficiently remove populations of particles that vary widely in size. The complex Bessel function US waveform method makes use of multiple frequencies by generating a more complex and random pattern as produced by prior art vibrating circular membranes. The effectiveness and superiority of these complex waveforms over the current state of the art as anti-fouling technique was studied. Prior art studies have shown that higher US frequencies have a more evenly distributed cleaning effect whereas lower US frequencies have a less evenly distributed cleaning effect. Lower frequencies are usually better cleaning surfaces with large, highly-bonded contaminants. Higher US frequencies are better for thinner and more detailed contaminants or contaminants that have already been disrupted or damaged by other US cleaning systems. Testing of Bessel function-based US waveforms in a marine setting were conducted comparing a prior art US anti-fouling system (a SOANAR System) to the Bessel function based US system to control boat hull marine growth by inhibiting more bio-fouling. Tests were conducted on surfaces with and without anti-fouling paint. The weight of marine growth was measured. The tests were designed to maintain: hull sample surface size and material (fiberglass rectangles); time in a typical marine underwater environment; submersion location; and, the presence or absence of anti-fouling paint. Sample surfaces were weighed, placed in the marine environment, and extracted after one (1) month. The sample surfaces were then re-weighed to determine the sample-to-sample, one month marine growth. The results of these tests are set forth below. A three-month trial was conducted for the purpose of measuring barnacle growth or lack thereof using the Bassel-function US system compared to the prior art SOANAR Ultrasonic Antifouling System. Four fiberglass samples were weighed and then submerged undisturbed for the duration of the one (1) month time period for each trial. Observations confirmed that barnacle growth was consistent on all of the submerged specimen surfaces. Upon removal of specimens, the fiberglass samples were once again weighed. The delta of weight increase noted is from initial submersion to removal from ocean water after a 1-month period. Trials 2 and 3 were conducted after the initial 1-month period. The control (CTRL) surface was unpainted and not impacted with US waveforms. The painted, anti-fouling control (CTRL-AFP) surface also not impacted with US waveforms. TABLE 1First TrialSampleInitial weight (g.)Final weight (g.)ChangeSOANAR667.43685.3318%Bessel661.21674.7814%CTRL108.17137.6129%CTRL-AFP96.5110.0414% TABLE 2Second TrialSampleInitial weight (g.)Final weight (g.)ChangeSOANAR664.46684.1320%Bessel665.74680.5415%CTRL84.63120.1636%CTRL-AFP80.1493.9814% TABLE 3Third TrialSampleInitial weight (g.)Final weight (g.)ChangeSOANAR664.46684.1322%Bessel665.74680.5416%CTRL84.63120.1627%CTRL-AFP80.1493.9816% A statistical analysis of the results, using a Kruskal-Wallis analysis, shows that there is a statistically significant difference (p-value of 0.05) between the prior art SOANAR device and the complex Bessel function US system. The investigation reveals that the Bessel-based US transducer system better controls marine growth with the application of complex ultrasonic waveforms and eliminates or reduces barnacle growth compared to the prior art SOANAR US Antifouling System. Test results indicate that the Bessel function US waveforms outperform the SOANAR system and inhibit marine growth by about 25%. Studies show that the Bessel-based US waveform system inhibits marine or barnacle growth because the Bessel Function causes a greater disturbance over the hull surface samples and affects different species of marine growth at different rates ultimately covering more species than the SOANAR system. As a result, the use of the Bessel-based US waveform system or similar complex US waveform systems (with disruptive, multi-frequency, interfering waveforms) replace the use of anti-fouling paint and, as a further result, reduce the introduction of potentially harmful anti-fouling paint chemicals into the sea and marine life. With the use of a compact, slide-in computer board (creating the complex US waveforms and driving the US transducers), the US anti-fouling system can be expanded in several ways. First, the use of small, computer processor boards with programmable memory stores enables the generation of several different waveforms. For example, the Raspberry Pi board can be programed to generate many different digital waveforms which are then converted to analog US waves. Second, if multiple studies were conducted using the pre-set or initial Bessel complex waveform system throughout the U.S. and over the world at certain geographic locations, and the geo-location or GPS data was marine growth data was collected for these studies, this geo-specific growth vs complex waveform data can be used to improve the performance of the complex wave generation system at different marine locations. Third, the present inventive system and method can be employed and integrated into the following vessel-related systems. The system fully integrates with existing electronic subsystems that are commonly available on marine vessels. (1) The complex US waveform system connects to existing vessel computer-based GPS systems because the computer-processor board slides into a slot in the vessel's computer IT system. The Raspberry Pi controller/driver/processor is designed to be an insertable board in common computer IT systems. (2) Raspberry Pi controller/driver/processor system can be re-purposed or have a dual purpose as an amplifier for the vessel's media/audio system. (3) The Raspberry Pi controller/driver/processor computer board can be used to produce complex waveforms can be re-purposed as the vessel's multimedia communication system and fish finding apparatus providing but not limited to: (a) entertainment audio and video capabilities; (b) Internet access/network routing; (c) GPS and chatting, navigation software; (d) fish finding apparatus; and (e) depth finder. The complex waveform functionality on the Raspberry Pi controller/driver/processor computer board only needs to be enabled once vessel is docked/stored. While vessel is in use, the system provides the above-noted, alternate functionalities. As for potential adverse effects of the complex US waveform system on marine life, an analysis reveals a relatively low risk to the marine environment. First, the complex waveform US system uses very low powered UTS (Ultrasonic Transducers). The maximum output power (assuming 100% efficiency) of the UTS in the complex US waveform system is generally defined by Ohm's Law wherein the output power in watts is defined by the equation P=VI where V and I are, respectively, the volts V across the load (the Piezo Electric Speaker, “PES”) and the current I through the same UT speaker. Ohm's Law states that V=IR with output voltage V and resultant current I across the load (in this case the PIEZO speaker). The PES has a rated resistance of 8 Ohms above 20 Khz. Using the two equations, P=V*V/R or P=V{circumflex over ( )}/R where R is 8 Ohms. Given from experimental observation that the maximum amplitude of the ultrasonic waveform presented to the PES is about 10 V, the output power is P=V{circumflex over ( )}/8 or P=10{circumflex over ( )}/8=12.5 watts. Also, the amplitude of the US waveforms degrade exponentially based upon the distance from the UT vibratory outputs. The power of the US waveforms degrades as the distance from marine vessel increases. An analysis was conducted to determine how the US signal diminishes as the distance from the UT generating source is increased. The experiment used a PIEZO speaker attached to a sample of fiberglass in a container filled with sea water. As expected, the amplitude of the US signal generally exponentially decayed based upon the distance between the UT transmitter and the UT receiver. After about 38 cm, the signal is significantly attenuated. Also, the complex waveform system and method use much lower frequencies than typical fish finder systems. The typical power output of depth/fish finders is usually at least 600 watts and very commonly exceeds 1000 watts. The current complex waveform system produces about 12.5 watts. Hence, the sonic power in the present complex waveform system is about 100 times smaller than the power commonly used in the industry as depth or fish finder systems. Since the present complex US waveform system is used dockside, the amount of marine life exposed to the ultrasonic waveforms is limited to within one (1) meter of the vessel's docked location. As for marine plan life, during photosynthesis, the plants produce waveforms in the ultrasonic range. Since the plant-produced waveforms are in the ultrasonic range, introducing similar waveforms to the plants' environment most likely would not adversely effect plant life. The claims upended hereto are meant to cover modifications an changes within the scope of the invention. | 18,660 |
11858015 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The detailed description and technical contents of the present invention are described below with reference to the drawings. Please refer toFIG.3,FIG.4,FIG.5,FIG.6,FIG.7andFIG.10. The invention provides an auto-feed pipe cleaner for clearing pipelines. A pipe cleaner3comprises a take-up unit4and a feed unit5, wherein the take-up unit4comprises a wire drum41and a spring wire42accommodated in the wire drum41, and the wire drum41comprises a front cover411, and a rear cover412assembled with the front cover411. A flange tube414is provided in an extension direction at one side of the front cover411without assembling with the rear cover412, and a round convex portion413is provided at the extension direction that the front cover411connected with the flange tube414. A through hole4140is formed in the flange tube414for communicating with an inner hollow4110of the front cover411, and an outer periphery of the flange tube414includes a plurality of convex strips4141disposed at intervals. The front cover411includes a first opening415communicating with the inner hollow4110of the front cover411and facing toward one end of the flange tube414, and the front cover411includes a plurality of locking holes4111and a plurality of protruding rods4112disposed at intervals on an inner periphery of the first opening415. The rear cover412includes a second opening416communicating with an inner hollow4120of the rear cover412and corresponding to one end of the front cover411, and the rear cover412includes a plurality of fixing rods4121and a plurality of sleeve rods4122disposed at intervals on an inner periphery of the second opening416, the plurality of fixing rods4121are inserted by a plurality of screws4123to be locked with the plurality of locking holes4111, and the plurality of protruding rods4112are correspondingly connected with the plurality of sleeve rods4122. A concave portion417is provided at a side opposite to the second opening416of the rear cover412, and the concave portion417is provided with a convex rim4170with an inverted convex hole4171at a side that the second opening416is located, wherein a plurality of convex dots4172are disposed at intervals on an outer periphery of the convex rim4170. The rear cover412is provided with a small handle418at the side opposite to the second opening416, the small handle418is provided with a convex connecting rod4181, and a hollow cylinder4182for embedding with one end of the convex connecting rod4181so that the hollow cylinder4182is sleeved on the convex connecting rod4181to drive the wire drum41rotating. The spring wire42is accommodated in the inner hollow4110of the front cover411and the inner hollow4120of the rear cover412, one end of the spring wire42protrudes from the through hole4140of the flange tube414, and the end of the spring wire42can be made into a hook to facilitate hooking of obstructions in a drain pipe. The feed unit5comprises a telescopic tube51, a feeder52, a tube handle55and an elastic plate56, wherein an inside of the telescopic tube51is hollow, an inner top of the telescopic tube51is provided with a groove portion510, the feeder52is disposed at the inside of the telescopic tube51, and a movable bearing53and two fixed bearings54are obliquely disposed in the feeder52. The tube handle55is sleeved on the flange tube414of the front cover411, one end of the tube handle55is embedded with one end of the feeder52and disposed at the inside of the telescopic tube51, so that the telescopic tube51is capable of moving forward and backward outside the feeder52and the tube handle55, and a folded end561of the elastic plate56is embedded in the groove portion510of the telescopic tube51. In one embodiment, the telescopic tube51comprises a first half tube511and a second half tube512assembled with the first half tube511, a first inner space5111is provided in the first half tube511and a second inner space5121is provided in the second half tube512, a first accommodating portion5114is extended upward from the first half tube511and a second accommodating portion5124is extended upward from the second half tube512. An inside of the first accommodating portion5114, an inside of the second accommodating portion5124, the first inner space5111and the second inner space5121are provided for disposal of the feeder52and the tube handle55. The first half tube511is provided with a first holding part5112and the second half tube512is provided with a second holding part5122, wherein the first holding part5112and the second holding part5122are adjacent to one end of the wire drum41. The first holding part5112includes a first half sleeve hole5110and the second holding part5122includes a second half sleeve hole5120, wherein the first half sleeve hole5110and the second half sleeve hole5120are assembled to provide a sleeve hole for disposal of one end of the tube handle55where is opposite to the feeder52. A first semicircular hole5113is provided at one end of the first half tube511opposite to the first half sleeve hole5110, and a second semicircular hole5123is provided at one end of the second half tube512opposite to the second half sleeve hole5120, wherein the first semicircular hole5113and the second semicircular hole5123are assembled as a round hole for the spring wire42to protrude or take up. The groove portion510of the telescopic tube51is divided into a first groove5115at an inner top of the first accommodating portion5114and a second groove5125at inner top of the second accommodating portion5124to provide the folded end561of the elastic plate56for embedding therein. The first half tube511and the second half tube512are joined in a manner such that a protruding part513and a recessed part514are provided at an joining position of the first half tube511and the second half tube512, inner peripheries of the first half tube511and the second half tube512are respectively provided with a plurality of locking parts515for a plurality of screws516to be screwed and inserted, so as to combine and fix the first half tube511with the second half tube512. Through the plurality of locking parts515are adjacent to the first accommodating portion5114and the second accommodating portion5124, the telescopic tube51can be pushed forward to enable the plurality of locking parts515abutting against the feeder52, so as to prevent the telescopic tube51from being continuously pushed further forward. In one embodiment, the feeder52comprises a first feeder body521and a second feeder body522assembled with the first feeder body521from top to bottom, a flange joint portion523is formed in a direction extended upward from the first feeder body521, a hollow hole524is provided in the flange joint portion523, a top end of the flange joint portion523is provided with a notch5231, and a bottom end of the hollow hole524of the flange joint portion523is provided with an adaptor5241and a guiding tenon5242protruding from an inner edge of the adaptor5241, so that the movable bearing53is able to be inserted from the hollow hole524of the flange joint portion523. The first feeder body521is extended downward to form an engaging convex body5211. Two fixing parts525which are relatively staggered and obliquely disposed on an inner periphery of one side of the second feeder body522, one side of the two fixing parts525is axially connected with the two fixed bearings54, and a slot5221is provided on an inner periphery of one end of the second feeder body522where is corresponding to the engaging convex body5211. Inner peripheries of the first feeder body521and the second feeder body522are respectively provided with a plurality of locking portions526(527) and a plurality of screws528to screw and insert into the plurality of locking portions526,527, so as to combine and fix the first feeder body521with the second feeder body522. The movable bearing53comprises a movable fixing shaft531, a bearing532, a spring533and a steel ball534, wherein a flange joint body535is provided at a top of the movable fixing shaft531for placing the steel ball534, the flange joint body535extends downwardly to form a vertical rod536, wherein an outer diameter of the vertical rod536is smaller than an outer diameter of the flange joint body535, an end of the vertical rod536is provided with a groove537to be inserted by the bearing532, a first fixing member538is inserted into the end of the vertical rod536to axially connect the bearing532so that the bearing532is capable of rotating in the groove537. The spring533is sleeved on an outer periphery of the vertical rod536and abutted between the flange joint body535and the first fixing member538, an elongated slot5361is provided at an outer side of the vertical rod536where the first fixing member538passes through, and the movable fixing shaft531is obliquely inserted into the hollow hole524of the flange joint portion523, and the bearing532is axially connected in the groove537, so that the flange joint body535of the movable fixing shaft531is abutted on the adaptor5241, and the movable fixing shaft531is capable of moving upward and downward through the disposal of the spring533sleeved on the outer periphery of the vertical rod536, and the movable bearing53is capable of moving upward and downward in the hollow hole524of the flange joint portion523. Two second fixing members541are respectively inserted into the two fixing parts525to axially connect the two fixed bearings54, and enable the two fixed bearings54rotating on one side of the fixing parts525. The tube handle55comprises a convex tube section551disposed at one end of the tube handle55, an outer sleeve552disposed at the other end of the tube handle55, and a via hole553is located in the tube handle55. The convex tube section551is provided with a convex tube section slot554and a block555which is disposed opposite to the convex tube section slot554on an outer side of the convex tube section551, the convex tube section slot554is provided for engaging and fixing the engaging convex body5211of the first feeder body521, and the block555is jammed and fixed in the slot5221of the second feeder body522. The outer sleeve552of the tube handle55abuts on the round convex portion413of the front cover411, the via hole553of the tube handle55is inserted by the flange tube414, and the plurality of convex strips4141of the flange tube414contact with the via hole553, and the flange tube414of the wire drum41is able to be rotated in the via hole553. The folded end561of the elastic plate56is in an elongate shape, the other end of the elastic plate56is inclined downward to form a hook562, the folded end561of the elastic plate56is embedded in the first groove5115at an inner top end of the first accommodating portion5114and the second groove5125at the second accommodating portion5124, and the hook562of the elastic plate56is located in the hollow hole524of the flange joint portion523and the notch5231of the flange joint portion523. Please refer toFIG.10andFIG.11A, when a pipeline of a drain pipe is blocked, a user has to use the pipe cleaner3to clear the drain pipe, the user holds the small handle418of the wire drum41with one hand to rotate the wire drum41and drive the spring wire42to rotate clockwise, and the other hand holds as well as pushes the telescopic tube51forward to press against the movable bearing53with the hook562of the elastic plate56. The movable bearing53is pressed downward and actuated with the fixed bearings54through the disposal of the spring533sleeved on the outer periphery of the vertical rod536, and the spring wire42evenly pressed between the movable bearing53and the fixed bearings54is rotatably fed. The hook562of the elastic plate56is detached from the movable bearing53when the telescopic tube51is pulled backward, and the movable bearing53is not pressed down by the hook562of the elastic plate56, the movable bearing53rises through disposal of the spring533sleeved on the outer periphery of the vertical rod536, so that the movable bearing53and the fixed bearings54are not actuated to stop feeding of the spring wire42. Contrarily, when the wire drum41is counterclockwise rotation to drive the spring wire42to rotate counterclockwise, the telescopic tube51is pushed forward to press against the movable bearing53with the hook562of the elastic plate56, the movable bearing53is pressed downward and actuated with the fixed bearings54through disposal of the spring533sleeved on the outer periphery of the vertical rod536, the spring wire42is evenly pressed between the movable bearing53and the fixed bearings54, and the spring wire42is taken up into the wire drum41. The hook562of the elastic plate56is detached from the movable bearing53when the telescopic tube51is pulled backward, the movable bearing53is not pressed down by the hook562of the elastic plate56, and the movable bearing53rises through disposal of the spring533sleeved on the outer periphery of the vertical rod536, so that the movable bearing53and the fixed bearings54are not actuated to stop taking up the spring wire42in order to achieve convenient operation. Please refer toFIG.8,FIG.9,FIG.10andFIG.11B. The take-up unit4further includes a clutch device6installed on the rear cover412of the wire drum41. The clutch device6comprises a first sleeve61, a second sleeve62, a central shaft63, a compression spring64, a first gasket65, a second gasket66and a fixing plate67. The first sleeve61is provided with a cover611abutting on the concave portion417of the rear cover412, an inside of the cover611extends outward to form an outer cylinder612with a third opening613, and the inside of the cover611is provided with a screw hole614communicating with the third opening613. A chamber615is formed inside the outer cylinder612for sleeving the compression spring64, a bottom of the chamber615is abutted by the first gasket65and an end641of the compression spring64, the second sleeve62is provided with a convex cover621embedded and positioned in the inverted convex hole4171of the convex rim4170, and a convex cover rod622on the convex cover621for sleeving with the compression spring64. A shaft hole623is disposed inside the convex cover621and the convex cover rod622, the convex cover621includes a plurality of embedding grooves624adjacent to the shaft hole623, and a plurality of holes625are located on an outer periphery of the convex cover621for the convex dots4172of the concave portion417to tenon. An external screw thread626is provided at one end of the convex cover rod622to screw joint with the screw hole614of the cover611. The central shaft63is provided with a disc surface631with a hexagon head632, and a shaft633is located at one side of the disc surface631opposite to the hexagon head632. The shaft633protrudes from the convex cover rod622. The disc surface631is provided with a plurality of convex embedding parts634adjacent to the shaft633and corresponding to one side of the second sleeve62for embedding with or detaching from the plurality of embedding grooves624, and a plurality of abutting convex dots635disposed between the plurality of convex embedding parts634to abut against the convex cover621. The first gasket65includes a first inner hole651, the second gasket66includes a second inner hole661, and the fixing plate67includes a third inner hole671, wherein the external screw thread626of the convex cover rod622is inserted into the first inner hole651, and one end of the shaft633opposite to the hexagon head632is inserted into the second inner hole661of the second gasket66and protruded out from the third inner hole671of the fixing plate67, so that the fixing plate67is fixed on the second gasket66together with the shaft633, thereby the shaft633is capable of moving forward and backward in the chamber615of the outer cylinder612through an action of the compression spring64as shown inFIG.11C. Please refer to the embodiments shown inFIG.10,FIG.11B,FIG.11CandFIG.12, the pipe cleaner3may also include an electric drill7to be installed on the shaft633of the wire drum41for replacing the small handle418. The user holds the electric drill7with one hand to rotate the wire drum41and the spring wire42clockwise or counterclockwise, and the principle that the telescopic tube51is pushed forward and pulled backward with the one hand are disclosed inFIG.3,FIG.10andFIG.11Aof the invention, and thus will not be repeated herein. When the spring wire42of the pipe cleaner3is fed into the drain pipe and hits an oversized obstruction which blocks the drain pipe, the central shaft63will be pushed forward to disengage the disc surface631and the plurality of convex embedding parts634from the convex cover621the plurality of embedding grooves624since a force of the compression spring64is less than a force of the central shaft63in the clutch device6, thereby the central shaft63is idled without driving the wire drum41to rotate clockwise. By disposal of the clutch device6on the take-up unit4, the spring wire42is prevented to be deformed and knotted from overly twisting in order to remind the user to stop clearing the pipeline immediately. | 17,102 |
11858016 | DETAILED DESCRIPTION OF THE DRAWING FIGURES The inventor has conceived, and reduced to practice, a system and method for vertically-oriented, modular, automated, emissions-controlled composting. In a preferred embodiment, the system and method involve construction of a vertically-oriented set of composting modules comprising a receiving and offloading level, one or more composting bay levels, a feedstock staging level, a biofilter level, a vertical conveyor for uploading feedstock to the feedstock staging level, a freight and personnel elevator, and a leachate tank. This composting system and method reduces the land area required for composting, increases the capture of emissions from composting, and reduces the labor-intensive and heavy-equipment-intensive nature of current methods. Efforts to expand composting are hampered by the current composting methodologies. Current methods of composting are land-intensive. Compost is created in piles spread out over large lots of land and turned using bulldozers and other heavy equipment. This methodology results in a number of substantial restrictions on composting. First, it places a limit on the amount of compost that can be created per unit of land as compost can only be piled to a certain height above which too much heat is generated within the compost pile. Second, since large areas of land are required, composting facilities must be located outside of urban areas where the organic waste is generated, causing increased transportation costs and bottlenecks. Third, such facilities are typically “open air” facilities, meaning that little or no emissions from the composting process are captured. Even where some emissions are captured through the use of covers over compost piles, the covers are inefficient at capturing emissions, and substantially hamper composting operations. Thus, the failure to capture emissions requires that composting facilities be located away from residential locations even where sufficient land space exists nearby. Existing composting facilities do not even attempt to quantify or document their emissions, so emissions from such facilities are largely unknown at this time. Fourth, composting operations at such facilities are highly labor intensive, requiring continuous heavy equipment operations to turn compost piles. The composting system and method herein described remedy these deficiencies by reducing the land area required for composting, increasing the capture of emissions from composting, and reducing the labor-intensive and heavy-equipment-intensive nature of current methods. The system comprises a vertical composting structure having different levels for different operations. The system may be constructed as a single, stand-alone structure, or as a set of separately-constructed modules that can be stacked on top of one another to form the composting system, or some combination of both (i.e., some portions of the composting system could be constructed as a permanent structure while others could be modules such as composting bins that can be added or removed from the structure to, for example, increase or decrease processing capacity). Regarding emissions, specifically, the composting system and method herein described allow for real time sampling of air emissions to quantify, document, and adjust emissions from the composting process. In a preferred embodiment, the system and method involve construction of a vertically-oriented set of composting modules comprising a receiving and offloading level, one or more composting bay levels, a feedstock staging level, a biofilter level, a vertical conveyor for uploading feedstock to the feedstock staging level, a freight and personnel elevator, and a leachate tank. This composting system and method reduces the land area required for composting, increases the capture of emissions from composting, and reduces the labor-intensive and heavy-equipment-intensive nature of current methods. The composting bays level may comprise multiple bay levels, wherein compost is turned not by heavy equipment operations, but rather by dropping the compost from a higher bay level to a lower one. Each bay level comprises one or more composting bins, each of which is fitted with a horizontal conveyor such as a “moving floor” (such as the Walking Floor®) which conveys the compost material from bin loading area (from the bay above) to the transition chute to the next bay level down. The horizontal conveyor has an aerated floor fitted with holes, slits, or sections which serve the dual purposes of aeration and leachate collection. Each composting bin is further fitted with a cover such as a flexible hoop bay cover and a vacuum system whereby emissions are drawn from bin loading area end to the transition chute end and out to a biofilter prior to venting to the environment. One or more different aspects may be described in the present application. Further, for one or more of the aspects described herein, numerous alternative arrangements may be described; it should be appreciated that these are presented for illustrative purposes only and are not limiting of the aspects contained herein or the claims presented herein in any way. One or more of the arrangements may be widely applicable to numerous aspects, as may be readily apparent from the disclosure. In general, arrangements are described in sufficient detail to enable those skilled in the art to practice one or more of the aspects, and it should be appreciated that other arrangements may be utilized and that structural, logical, software, electrical and other changes may be made without departing from the scope of the particular aspects. Particular features of one or more of the aspects described herein may be described with reference to one or more particular aspects or figures that form a part of the present disclosure, and in which are shown, by way of illustration, specific arrangements of one or more of the aspects. It should be appreciated, however, that such features are not limited to usage in the one or more particular aspects or figures with reference to which they are described. The present disclosure is neither a literal description of all arrangements of one or more of the aspects nor a listing of features of one or more of the aspects that must be present in all arrangements. Headings of sections provided in this patent application and the title of this patent application are for convenience only, and are not to be taken as limiting the disclosure in any way. Devices that are in communication with each other need not be in continuous communication with each other, unless expressly specified otherwise. In addition, devices that are in communication with each other may communicate directly or indirectly through one or more communication means or intermediaries, logical or physical. A description of an aspect with several components in communication with each other does not imply that all such components are required. To the contrary, a variety of optional components may be described to illustrate a wide variety of possible aspects and in order to more fully illustrate one or more aspects. Similarly, although process steps, method steps, algorithms or the like may be described in a sequential order, such processes, methods and algorithms may generally be configured to work in alternate orders, unless specifically stated to the contrary. In other words, any sequence or order of steps that may be described in this patent application does not, in and of itself, indicate a requirement that the steps be performed in that order. The steps of described processes may be performed in any order practical. Further, some steps may be performed simultaneously despite being described or implied as occurring non-simultaneously (e.g., because one step is described after the other step). Moreover, the illustration of a process by its depiction in a drawing does not imply that the illustrated process is exclusive of other variations and modifications thereto, does not imply that the illustrated process or any of its steps are necessary to one or more of the aspects, and does not imply that the illustrated process is preferred. Also, steps are generally described once per aspect, but this does not mean they must occur once, or that they may only occur once each time a process, method, or algorithm is carried out or executed. Some steps may be omitted in some aspects or some occurrences, or some steps may be executed more than once in a given aspect or occurrence. When a single device or article is described herein, it will be readily apparent that more than one device or article may be used in place of a single device or article. Similarly, where more than one device or article is described herein, it will be readily apparent that a single device or article may be used in place of the more than one device or article. The functionality or the features of a device may be alternatively embodied by one or more other devices that are not explicitly described as having such functionality or features. Thus, other aspects need not include the device itself. Techniques and mechanisms described or referenced herein will sometimes be described in singular form for clarity. However, it should be appreciated that particular aspects may include multiple iterations of a technique or multiple instantiations of a mechanism unless noted otherwise. Process descriptions or blocks in figures should be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps in the process. Alternate implementations are included within the scope of various aspects in which, for example, functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those having ordinary skill in the art. Detailed Descriptions of the Drawing Figures FIG.1is a diagram illustrating an exemplary vertically-oriented, modular composting facility100. Composting facility100as herein described reduces the land area required for composting, increases the capture of emissions from composting, and reduces the labor-intensive and heavy-equipment-intensive nature of current methods. The system comprises a vertical composting structure having different levels for different operations. The system may be constructed as a single, stand-alone structure, or as a set of separately-constructed modules that can be stacked on top of one another to form the composting system, or some combination of both (i.e., some portions of the composting system could be constructed as a permanent structure while others could be modules such as composting bins that can be added or removed from the structure to, for example, increase or decrease processing capacity). In this exemplary embodiment, the composting facility is a vertically-oriented set of composting modules comprising a receiving and offloading level110, a composting bay level200comprising one or more composting bays, a feedstock staging level130, a biofilter level140, a vertical conveyor150for uploading feedstock to the feedstock staging level, a freight and personnel elevator160, and a leachate tank170. Receiving and offloading level110is the bottom level of the structure and is typically built at ground level so that composting feedstock and finished compost can be loaded and unloaded using heavy equipment such as front loaders. Receiving and offloading level110comprises a receiving bay111, an offloading bay112, and optionally administrative facilities113such as offices, control rooms, and crew rooms. Receiving bay111receives compost feedstock for processing into compost, and may comprising equipment for grinding and blending the feedstock prior to transfer up the vertical conveyor to a feedstock staging area to start the composting process. Offloading bay112receives finished compost from composting bay level200, and may comprising equipment for screening of finished compost and loading of finished compost onto outbound transportation (e.g., trucks, trains, etc.) or onto conveyors to nearby storage facilities. Administrative facilities113for composting facility100such as offices, control rooms, and crew rooms are conveniently located at receiving and offloading level110. Composting bay level200comprises one or more composting bays arranged vertically, wherein compost is turned not by heavy equipment operations, but rather by dropping the compost from a higher bay level to a lower one. Each bay level comprises one or more composting bins, each of which is fitted with a horizontal conveyor such as a “moving floor” which conveys the compost material from bin loading area (from the bay above) to the transition chute to the next bay level down. The horizontal conveyor has an aerated floor fitted with holes, slits, or sections which serve the dual purposes of aeration and leachate collection. Each composting bin is further fitted with a cover such as a flexible hoop bay cover and a vacuum system whereby emissions are drawn from bin loading area end to the transition chute end and out to a biofilter prior to venting to the environment. Note that while a moving floor is a convenient conveyor, other forms of conveyance may also be used including, but not limited to, a single-piece flexible conveyor belt with holes or slits for aeration and leachate collection underneath the belt, a multiple-piece conveyor belt (having either longitudinal strips along the length of the bin or transverse strips across the width of the bin) with aeration and leachate collection between the pieces of the belt, and a conveyor track configured similarly to a conveyor belt but having hard slats mechanically connected to one another with aeration and leachate collection between the pieces of the track. In some configurations, a solid floor may be used instead of a conveyor, the solid floor having holes or slits for aeration and leachate collection and the feedstock being moved by small equipment such as frontend loaders or bulldozers. Feedstock staging level130receives feedstock from vertical conveyor150into a feedstock staging area. Feedstock may be fed from feedstock staging area via horizontal conveyors such as moving floors, or via small equipment such as frontend loaders and bulldozers. At the feedstock staging area, feedstock can be inoculated with microorganisms beneficial to the composting process and moisturized to optimal levels for composting. Feedstock staging area may be further fitted with dust control to remove potentially harmful dust from dry feedstock materials such as wood chips. Biofilter level140will typically be at the top of composting facility100. One or more biofilters at biofilter level140will receive emissions from emissions collection systems in the composting bins at composting bays level200, and force the emissions up through a biofilter material comprising organic material which supports a population of microorganisms which oxidize biodegradable gasses into carbon dioxide, water, and mineral salts. The biofilter material may comprise peat, soil, compost, wood chips, straw, or other material and mixtures which provide a suitable environment for microbial growth and maintain a high porosity to allow air to flow easily. Important considerations in biofilter material selection are the type of biofilter material, the thickness of the biofilter material layer, airflow through the biofilter material layer, nutrient content, and moisture control. Properly designed biofilters will remove the majority of odor-causing agents from compost emissions, allowing for venting of filtered emissions to the outside environment. Vertical conveyor150transfers feedstock from receiving and offloading level110to feedstock staging level130. A variety of types of vertical conveyors exist and may be used. The most suitable types of vertical conveyor for this application would be either a vertical screw-type conveyor which pushes feedstock upward along the threads of a large, vertically-mounted, rotating screw, or a vertical belt-type conveyor which carries feedstock up a vertically-mounted belt on which buckets are mounted for carrying the feedstock. The freight and personnel elevator160is a typical industrial freight elevator configured to carry people and/or equipment to the various levels of composting facility100for operation and maintenance of the facility. Leachate tank170is a liquid storage tank configured for capture and storage of leachate for later treatment or disposal. Compost leachate is liquid that drains from feedstock during composting. Leachate contains soluble minerals, organic matter, and suspended solids, including mineral and organic colloids. The exact composition of the leachate is determined by the nature of the feedstock, the degree of progress of the composting process, and the composition of any liquid that infiltrates into the compost. If feedstock contains any contaminants such as metals or hydrocarbons, leachate will likely contain those, as well. Leachate is typically collected in tanks or pools for treatment or disposal. Leachate tank170is shown here as being above ground and outside the main structure, but may be located in other places such as underground or inside the main structure. FIG.2is a cross-sectional diagram illustrating an exemplary interior organization of a vertically-oriented, modular composting facility. Composting facility100as herein described reduces the land area required for composting, increases the capture of emissions from composting, and reduces the labor-intensive and heavy-equipment-intensive nature of current methods. The system comprises a vertical composting structure having different levels for different operations. The system may be constructed as a single, stand-alone structure, or as a set of separately-constructed modules that can be stacked on top of one another to form the composting system, or some combination of both (i.e., some portions of the composting system could be constructed as a permanent structure while others could be modules such as composting bins that can be added or removed from the structure to, for example, increase or decrease processing capacity). In this exemplary embodiment, the composting facility is a vertically-oriented set of composting modules comprising a receiving and offloading level110, a composting bay level200comprising one or more composting bays, a feedstock staging level130, a biofilter level140, a vertical conveyor150for uploading feedstock to the feedstock staging level, a freight and personnel elevator160, and a leachate tank170. Each level of composting facility may be configured with personnel walkways220for personnel to manage the operations of composting facility100at each level. Receiving and offloading level110is the bottom level of the structure and is typically built at ground level so that composting feedstock and finished compost can be loaded and unloaded using heavy equipment such as front loaders. Receiving and offloading level110comprises a receiving bay111, an offloading bay112, and optionally administrative facilities113such as offices, control rooms, and crew rooms. Receiving bay111receives compost feedstock for processing into compost, and may comprising equipment for grinding and blending the feedstock prior to transfer up the vertical conveyor to a feedstock staging area to start the composting process. Offloading bay112receives finished compost from composting bay level200, and may comprising equipment for screening of finished compost and loading of finished compost onto outbound transportation (e.g., trucks, trains, etc.) or onto conveyors to nearby storage facilities. Administrative facilities113for composting facility100such as offices, control rooms, and crew rooms are conveniently located at receiving and offloading level110. Composting bay level200comprises one or more composting bays210,210a-carranged vertically, wherein compost is turned not by heavy equipment operations, but rather by dropping the compost from a higher bay level to a lower one. Here, Bay 1210is shown and described, and Bays 2-3210a-care similarly configured. Composting bays level200may comprise any number of such bays210,210a-c. Each bay level210comprises one or more composting bins, each of which is fitted with a horizontal conveyor400which conveys the compost material from bin loading area320(from the bay above via a transition chute330) to a transition chute opening331to the next bay level down. Turning of compost feedstock is accomplished via the vertical drop of the feedstock from a higher bay level to a lower one via transition chute330. Inoculation and moisturizing of feedstock may be performed at turning via sprayers340. Horizontal conveyor400has an aerated floor fitted with holes, slits, or sections which serve the dual purposes of aeration and leachate collection via an aeration and leachate collection system500. Each bay level comprises one or more composting bins, each of which is fitted with a horizontal conveyor such as a “moving” or “live” floor (an example of which is a Walking Floor®) which conveys the compost material from bin loading area (from the bay above) to the transition chute to the next bay level down. Each composting bin is further fitted with an impermeable cover or enclosure (not shown) such as a flexible hoop bay cover and a vacuum system (not shown) whereby emissions are drawn from bin loading area320end to transition chute330end and out to biofilter level140prior to venting to the environment. Feedstock staging level130receives feedstock from vertical conveyor150into a feedstock staging area. Feedstock may be fed from feedstock staging area via a horizontal conveyor such as moving floors, or via small equipment such as frontend loaders and bulldozers. At the feedstock staging area, feedstock can be inoculated with microorganisms beneficial to the composting process and moisturized to optimal levels for composting. Feedstock staging area may be further fitted with dust control to remove potentially harmful dust from dry feedstock materials such as wood chips. Biofilter level140will typically be at the top of composting facility100but can be located elsewhere depending on the facility design. One or more biofilters at biofilter level140will receive emissions from emissions collection systems in the composting bins at composting bays level200, and force the emissions up through a biofilter material comprising organic material which supports a population of microorganisms which oxidize biodegradable gasses into carbon dioxide, water, and mineral salts. The biofilter material may comprise peat, compost, wood chips, Bio-char, or other material and mixtures which provide a suitable environment for microbial growth and maintain a high porosity to allow air to flow easily. Important considerations in biofilter material selection are the type of biofilter material, the thickness of the biofilter material layer, airflow through the biofilter material layer, nutrient content, and moisture control. Properly designed biofilters will remove the majority of odor-causing agents from compost emissions, allowing for venting of filtered emissions to the outside environment. Vertical conveyor150transfers feedstock from receiving and offloading level110to feedstock staging level130. A variety of types of vertical conveyors exist and may be used. The most suitable types of vertical conveyor for this application would be either a vertical screw-type conveyor which pushes feedstock upward along the threads of a large, vertically-mounted, rotating screw, or a vertical belt-type conveyor which carries feedstock up a vertically-mounted belt on which buckets are mounted for carrying the feedstock. The freight and personnel elevator160is a typical industrial freight elevator configured to carry people and/or equipment to the various levels of composting facility100for operation and maintenance of the facility. Leachate tank170is a liquid storage tank configured for capture and storage of leachate for later treatment or disposal. Compost leachate is liquid that drains from feedstock during composting. Leachate contains soluble minerals, organic matter, and suspended solids, including mineral and organic colloids. The exact composition of the leachate is determined by the nature of the feedstock, the degree of progress of the composting process, and the composition of any liquid that infiltrates into the compost. If feedstock contains any contaminants such as metals or hydrocarbons, leachate will likely contain those, as well. Leachate is typically collected in tanks or pools for treatment or disposal. Leachate tank170is shown here as being above ground and outside the main structure, but may be located in other places such as underground or inside the main structure. FIG.3is a top down diagram illustrating an exemplary modular composting bay of a vertically-oriented, modular composting facility. In this exemplary diagram, Bay 1210is shown and described, with other bay levels210a-cbeing similarly configured. Bay210comprises one or more composting bins300,300a-c. Bin 1300is shown and described with other bins300a-cbeing similarly configured. In this example, four composting bins300,300a-care shown, but there may be any number of bins300,300a-cper bay level210,210a-c, and any number of bay levels in composting facility100. Thus, in the exemplary configuration of composting facility100herein described, there are four bay levels each with four compost bins, for a total of 16 compost bins, but any number of such levels and bins may be used. Composting bin300comprises bin loading area320, transition chute330(not shown) from previous level, transition chute opening331to next bay level down, sprayers340, walls350, horizontal conveyor400, and aeration and leachate collection system500. Compost is received at bin loading area320via transition chute330(not shown) and is contained via bin walls350. Horizontal conveyor400conveys compost material from bin loading area320to a transition chute opening331to the next bay level down. Turning of compost feedstock is accomplished via the vertical drop of the feedstock from a higher bay level to a lower one via transition chute where it is agitated and de-clumped330. Inoculation and moisturizing of feedstock may be performed at turning via sprayers340. In this diagram, horizontal conveyor400is shown with an aerated floor fitted with holes420which serve the dual purposes of aeration and leachate collection via an aeration and leachate collection system500. Each composting bin is further fitted with an impermeable cover or enclosure (not shown) such as a flexible hoop bay cover and a vacuum system (not shown) whereby emissions are drawn from bin loading area320end to transition chute330end and out to biofilter level140prior to venting to the environment. FIG.4(PRIOR ART) is a diagram illustrating operation of a moving floor. A moving floor is a type of horizontal conveyor for moving material in a desired direction. A moving floor comprises a series of slats410a-fwhich alternately draw backward under the material401until all slats410a-fhave been drawn backward, at which point all slats410a-fare pushed forward in unison, carrying the material forward in the desired direction. In a typical configuration, every third slat is drawn backward until all such slats have been drawn backward, but any such configuration may be used (e.g., every second slat, every fourth slat, etc.). In a first step, slats410a, bare drawn backward in the direction of arrows411underneath material401. In a second step, slats410c, dare drawn backward in the direction of arrows412underneath material401. In a third step, slats410e, fare drawn backward in the direction of arrows413underneath material401. In a fourth and final step, all six slats410a-fare pushed forward in the direction of arrows414, carrying the material along with them in the desired direction. FIG.5is a diagram illustrating an exemplary aeration and leachate collection system of a vertically-oriented, modular composting facility. This exemplary aeration and leachate collection system is configured for use with a walking-floor-type horizontal conveyor system. In this exemplary embodiment, a pipe510is physically attached to a slat410of a moving floor. Pipe510has risers420extending up from pipe510through slat410ending in open holes420flush with or lower than holes in slat410. An air pump530(e.g., a fan, blower, pump, bellows, or other device configured to move air) forces air at an appropriate rate (determined by the stage of composting, porosity of feedstock, and other factors) via a flexible air hose540into pipe or tube510, up through risers520, and out of holes420into feedstock. At the same time, leachate flows from feedstock into holes420, down risers520, into pipe510, and out of a flexible drain hose550connected to the bottom of pipe510, and into leachate tank560. Both aeration and leachate collection can occur simultaneously through the same holes420and risers520as the flow volume of leachate will rarely be sufficient to fully occlude risers and even where flow volume is high, leachate will manage to drip or seep downward into risers despite air flow in the opposite direction. As slat410moves backward (arrow414) and forward (arrow412) in its operation as part of a moving floor, flexible hoses540,550allow for movement of slat410, pipe510, and risers520. In some embodiments, pipe510or slat410may be placed on a slope toward leachate tank560to facilitate drainage of leachate from pipe510. This exemplary aeration and leachate collection system is shown in the context of a moving floor, but can be applied to any sort of horizontal conveyor. In embodiments where other horizontal conveyors are used (e.g., a conveyor belt, a conveyor track, etc.), the aeration and leachate collection system may be configured as a collection pan or tray with a cover having holes for aeration and piping from the collection pan or tray, wherein the belt or track slides over the top of the cover and wherein holes, slits, or gaps in the conveyor belt or track periodically coincide with the holes in the cover and leachate is collected in the pan or tray and routed leachate tank via piping. FIG.6is a side view diagram illustrating an exemplary composting bin of a vertically-oriented, modular composting facility. Bin300is fitted with a horizontal conveyor400which conveys the compost material (i.e., feedstock)401from bin loading area320(from the bay above via a transition chute330as indicated by arrow601) to a transition chute opening331to the next bay level down (as indicated by arrow602). Turning of compost feedstock is accomplished via the vertical drop of the feedstock from a higher bay level to a lower one via transition chute330. Inoculation and moisturizing of feedstock may be performed at turning via sprayers340. Horizontal conveyor with aeration and leachate system400,500is as described above. Horizontal conveyor400has an aerated floor fitted with holes, slits, or sections which serve the dual purposes of aeration and leachate collection via an aeration and leachate collection system500. Bin300is fitted with walls350(transparent in this diagram to show compost material contained between them) to contain compost material401as it proceeds along bin, and a horizontal conveyor400such as a “moving floor” which conveys the compost material from bin loading area (from the bay above) to the transition chute to the next bay level down. Bin300is further fitted with an impermeable cover or enclosure. In this exemplary diagram, the impermeable cover or enclosure is a flexible hoop bay cover360comprising an impermeable material361such as a plastic sheet held up by hoop supports362such that flexible hoop bay cover360encloses all or part of the compost material401with an opening at bin loading area320end of bay300. A vacuum system370comprises an air pump371(e.g., a fan, blower, pump, bellows, or other device configured to move air), a hood372connected to the cover or enclosure, a hose or piping373from the hood to the pump, and a hose or piping374to the biofilter level140. Vacuum system370draws air from the opening at bin loading area320through flexible hoop bay cover360in the direction of arrow372, into vacuum system comprising a hood370and hose371, and to biofilter level140, thus capturing emissions from the composting process and filtering them before venting to the environment. Also, shown for clarity are personnel walkways220and railings221. FIG.7is a side view diagram illustrating a biofilter module of a vertically-oriented, modular composting facility. Biofilter level140will typically be at the top of composting facility100. One or more biofilters710at biofilter level140will receive emissions from emissions collection systems in the composting bins at composting bays level200via a hose720or other suitable piping, and force the emissions up through a biofilter material740comprising organic material which supports a population of microorganisms which oxidize biodegradable gasses into carbon dioxide, water, and mineral salts. Biofilter710further comprise a gas distribution layer730such as a layer of gravel through which the emissions may evenly disperse for consistent distribution throughout biofilter material740or a horizontal conveyor400such as the moving floor embodiments described herein. Biofilter material740may comprise peat, soil, compost, wood chips, straw, or other material and mixtures which provide a suitable environment for microbial growth and maintain a high porosity to allow air to flow easily. Important considerations in biofilter material740selection are the type of biofilter material, the thickness of the biofilter material layer, airflow through the biofilter material layer, nutrient content, and moisture control. Properly designed biofilters will remove the majority of odor-causing agents from compost emissions, allowing for venting of filtered emissions to the outside environment via a vent to the environment750in the direction of arrows701. Also, shown for clarity are personnel walkways220and railings221. While a single biofilter is shown in this diagram for the sake of clarity and simplicity, a plurality of such biofilters may be used either in parallel, in series, or in a recirculating configuration where already-filtered emissions are re-circulated through one or more biofilters to achieve higher levels of emissions control. In this exemplary configuration, biofilter layer140further comprises a transition chute opening331which may be used either to dispose of biofilter material740when saturated with or decomposed, or in some cases to incorporate biofilter material740into feedstock for composting bins at composting bays level200, both via transition chute330as indicated by arrow702. Where a horizontal conveyor400is used as gas distribution layer730, biofilter material740is easily transferred to transition chute opening331as described herein above. FIG.8is a flow diagram illustrating an exemplary overall composting process for a vertically-oriented, modular composting facility. At step801, feedstock is received at receiving bay111. At step802, the feedstock is prepared by grinding it, filtering or sorting it by size, and moisturizing it. At step803, the feedstock is elevated via vertical conveyor150to feedstock staging area131. At step804, the feedstock is loaded into the first bay level for Phase 1 processing. The residency time at each stage of processing is determined by an operations plan for compo sting. At step805, the feedstock is agitated by dropping it through a chute to a lower bay level, at which time further moisturizing may be performed. At step806, feedstock is loaded into offloading bay112by dropping it through a chute. At step807, the feedstock is screened into finished compost and oversized feedstock material is recycled or discarded. At step808, the finished compost is offloaded to trucks or other transportation for sale. Hardware Architecture For computer-implemented aspects, the techniques disclosed herein may be implemented on hardware or a combination of software and hardware. For example, they may be implemented in an operating system kernel, in a separate user process, in a library package bound into network applications, on a specially constructed machine, on an application-specific integrated circuit (ASIC), or on a network interface card. Software/hardware hybrid implementations of at least some of the aspects disclosed herein may be implemented on a programmable network-resident machine (which should be understood to include intermittently connected network-aware machines) selectively activated or reconfigured by a computer program stored in memory. Such network devices may have multiple network interfaces that may be configured or designed to utilize different types of network communication protocols. A general architecture for some of these machines may be described herein in order to illustrate one or more exemplary means by which a given unit of functionality may be implemented. According to specific aspects, at least some of the features or functionalities of the various aspects disclosed herein may be implemented on one or more general-purpose computers associated with one or more networks, such as for example an end-user computer system, a client computer, a network server or other server system, a mobile computing device (e.g., tablet computing device, mobile phone, smartphone, laptop, or other appropriate computing device), a consumer electronic device, a music player, or any other suitable electronic device, router, switch, or other suitable device, or any combination thereof. In at least some aspects, at least some of the features or functionalities of the various aspects disclosed herein may be implemented in one or more virtualized computing environments (e.g., network computing clouds, virtual machines hosted on one or more physical computing machines, or other appropriate virtual environments). Referring now toFIG.9, there is shown a block diagram depicting an exemplary computing device10suitable for implementing at least a portion of the features or functionalities disclosed herein. Computing device10may be, for example, any one of the computing machines listed in the previous paragraph, or indeed any other electronic device capable of executing software- or hardware-based instructions according to one or more programs stored in memory. Computing device10may be configured to communicate with a plurality of other computing devices, such as clients or servers, over communications networks such as a wide area network a metropolitan area network, a local area network, a wireless network, the Internet, or any other network, using known protocols for such communication, whether wireless or wired. In one aspect, computing device10includes one or more central processing units (CPU)12, one or more interfaces15, and one or more busses14(such as a peripheral component interconnect (PCI) bus). When acting under the control of appropriate software or firmware, CPU12may be responsible for implementing specific functions associated with the functions of a specifically configured computing device or machine. For example, in at least one aspect, a computing device10may be configured or designed to function as a server system utilizing CPU12, local memory11and/or remote memory16, and interface(s)15. In at least one aspect, CPU12may be caused to perform one or more of the different types of functions and/or operations under the control of software modules or components, which for example, may include an operating system and any appropriate applications software, drivers, and the like. CPU12may include one or more processors13such as, for example, a processor from one of the Intel, ARM, Qualcomm, and AMD families of microprocessors. In some aspects, processors13may include specially designed hardware such as application-specific integrated circuits (ASICs), electrically erasable programmable read-only memories (EEPROMs), field-programmable gate arrays (FPGAs), and so forth, for controlling operations of computing device10. In a particular aspect, a local memory11(such as non-volatile random access memory (RAM) and/or read-only memory (ROM), including for example one or more levels of cached memory) may also form part of CPU12. However, there are many different ways in which memory may be coupled to system10. Memory11may be used for a variety of purposes such as, for example, caching and/or storing data, programming instructions, and the like. It should be further appreciated that CPU12may be one of a variety of system-on-a-chip (SOC) type hardware that may include additional hardware such as memory or graphics processing chips, such as a QUALCOMM SNAPDRAGON™ or SAMSUNG EXYNOS™ CPU as are becoming increasingly common in the art, such as for use in mobile devices or integrated devices. As used herein, the term “processor” is not limited merely to those integrated circuits referred to in the art as a processor, a mobile processor, or a microprocessor, but broadly refers to a microcontroller, a microcomputer, a programmable logic controller, an application-specific integrated circuit, and any other programmable circuit. In one aspect, interfaces15are provided as network interface cards (NICs). Generally, NICs control the sending and receiving of data packets over a computer network; other types of interfaces15may for example support other peripherals used with computing device10. Among the interfaces that may be provided are Ethernet interfaces, frame relay interfaces, cable interfaces, DSL interfaces, token ring interfaces, graphics interfaces, and the like. In addition, various types of interfaces may be provided such as, for example, universal serial bus (USB), Serial, Ethernet, FIREWIRE™ THUNDERBOLT™, PCI, parallel, radio frequency (RF), BLUETOOTH™, near-field communications (e.g., using near-field magnetics), 802.11 (WiFi), frame relay, TCP/IP, ISDN, fast Ethernet interfaces, Gigabit Ethernet interfaces, Serial ATA (SATA) or external SATA (ESATA) interfaces, high-definition multimedia interface (HDMI), digital visual interface (DVI), analog or digital audio interfaces, asynchronous transfer mode (ATM) interfaces, high-speed serial interface (HSSI) interfaces, Point of Sale (POS) interfaces, fiber data distributed interfaces (FDDIs), and the like. Generally, such interfaces15may include physical ports appropriate for communication with appropriate media. In some cases, they may also include an independent processor (such as a dedicated audio or video processor, as is common in the art for high-fidelity A/V hardware interfaces) and, in some instances, volatile and/or non-volatile memory (e.g., RAM). Although the system shown inFIG.9illustrates one specific architecture for a computing device10for implementing one or more of the aspects described herein, it is by no means the only device architecture on which at least a portion of the features and techniques described herein may be implemented. For example, architectures having one or any number of processors13may be used, and such processors13may be present in a single device or distributed among any number of devices. In one aspect, a single processor13handles communications as well as routing computations, while in other aspects a separate dedicated communications processor may be provided. In various aspects, different types of features or functionalities may be implemented in a system according to the aspect that includes a client device (such as a tablet device or smartphone running client software) and server systems (such as a server system described in more detail below). Regardless of network device configuration, the system of an aspect may employ one or more memories or memory modules (such as, for example, remote memory block16and local memory11) configured to store data, program instructions for the general-purpose network operations, or other information relating to the functionality of the aspects described herein (or any combinations of the above). Program instructions may control execution of or comprise an operating system and/or one or more applications, for example. Memory16or memories11,16may also be configured to store data structures, configuration data, encryption data, historical system operations information, or any other specific or generic non-program information described herein. Because such information and program instructions may be employed to implement one or more systems or methods described herein, at least some network device aspects may include nontransitory machine-readable storage media, which, for example, may be configured or designed to store program instructions, state information, and the like for performing various operations described herein. Examples of such nontransitory machine-readable storage media include, but are not limited to, magnetic media such as hard disks, floppy disks, and magnetic tape; optical media such as CD-ROM disks; magneto-optical media such as optical disks, and hardware devices that are specially configured to store and perform program instructions, such as read-only memory devices (ROM), flash memory (as is common in mobile devices and integrated systems), solid state drives (SSD) and “hybrid SSD” storage drives that may combine physical components of solid state and hard disk drives in a single hardware device (as are becoming increasingly common in the art with regard to personal computers), memristor memory, random access memory (RAM), and the like. It should be appreciated that such storage means may be integral and non-removable (such as RAM hardware modules that may be soldered onto a motherboard or otherwise integrated into an electronic device), or they may be removable such as swappable flash memory modules (such as “thumb drives” or other removable media designed for rapidly exchanging physical storage devices), “hot-swappable” hard disk drives or solid state drives, removable optical storage discs, or other such removable media, and that such integral and removable storage media may be utilized interchangeably. Examples of program instructions include both object code, such as may be produced by a compiler, machine code, such as may be produced by an assembler or a linker, byte code, such as may be generated by for example a JAVA™ compiler and may be executed using a Java virtual machine or equivalent, or files containing higher level code that may be executed by the computer using an interpreter (for example, scripts written in Python, Perl, Ruby, Groovy, or any other scripting language). In some aspects, systems may be implemented on a standalone computing system. Referring now toFIG.10, there is shown a block diagram depicting a typical exemplary architecture of one or more aspects or components thereof on a standalone computing system. Computing device20includes processors21that may run software that carry out one or more functions or applications of aspects, such as for example a client application24. Processors21may carry out computing instructions under control of an operating system22such as, for example, a version of MICROSOFT WINDOWS™ operating system, APPLE macOS™ or iOS™ operating systems, some variety of the Linux operating system, ANDROID™ operating system, or the like. In many cases, one or more shared services23may be operable in system20, and may be useful for providing common services to client applications24. Services23may for example be WINDOWS™ services, user-space common services in a Linux environment, or any other type of common service architecture used with operating system21. Input devices28may be of any type suitable for receiving user input, including for example a keyboard, touchscreen, microphone (for example, for voice input), mouse, touchpad, trackball, or any combination thereof. Output devices27may be of any type suitable for providing output to one or more users, whether remote or local to system20, and may include for example one or more screens for visual output, speakers, printers, or any combination thereof. Memory25may be random-access memory having any structure and architecture known in the art, for use by processors21, for example to run software. Storage devices26may be any magnetic, optical, mechanical, memristor, or electrical storage device for storage of data in digital form (such as those described above, referring toFIG.9). Examples of storage devices26include flash memory, magnetic hard drive, CD-ROM, and/or the like. In some aspects, systems may be implemented on a distributed computing network, such as one having any number of clients and/or servers. Referring now toFIG.11, there is shown a block diagram depicting an exemplary architecture30for implementing at least a portion of a system according to one aspect on a distributed computing network. According to the aspect, any number of clients33may be provided. Each client33may run software for implementing client-side portions of a system; clients may comprise a system20such as that illustrated inFIG.10. In addition, any number of servers32may be provided for handling requests received from one or more clients33. Clients33and servers32may communicate with one another via one or more electronic networks31, which may be in various aspects any of the Internet, a wide area network, a mobile telephony network (such as CDMA or GSM cellular networks), a wireless network (such as WiFi, WiMAX, LTE, and so forth), or a local area network (or indeed any network topology known in the art; the aspect does not prefer any one network topology over any other). Networks31may be implemented using any known network protocols, including for example wired and/or wireless protocols. In addition, in some aspects, servers32may call external services37when needed to obtain additional information, or to refer to additional data concerning a particular call. Communications with external services37may take place, for example, via one or more networks31. In various aspects, external services37may comprise web-enabled services or functionality related to or installed on the hardware device itself. For example, in one aspect where client applications24are implemented on a smartphone or other electronic device, client applications24may obtain information stored in a server system32in the cloud or on an external service37deployed on one or more of a particular enterprise's or user's premises. In addition to local storage on servers32, remote storage38may be accessible through the network(s)31. In some aspects, clients33or servers32(or both) may make use of one or more specialized services or appliances that may be deployed locally or remotely across one or more networks31. For example, one or more databases34in either local or remote storage38may be used or referred to by one or more aspects. It should be understood by one having ordinary skill in the art that databases in storage34may be arranged in a wide variety of architectures and using a wide variety of data access and manipulation means. For example, in various aspects one or more databases in storage34may comprise a relational database system using a structured query language (SQL), while others may comprise an alternative data storage technology such as those referred to in the art as “NoSQL” (for example, HADOOP CASSANDRA™, GOOGLE BIGTABLE™, and so forth). In some aspects, variant database architectures such as column-oriented databases, in-memory databases, clustered databases, distributed databases, or even flat file data repositories may be used according to the aspect. It will be appreciated by one having ordinary skill in the art that any combination of known or future database technologies may be used as appropriate, unless a specific database technology or a specific arrangement of components is specified for a particular aspect described herein. Moreover, it should be appreciated that the term “database” as used herein may refer to a physical database machine, a cluster of machines acting as a single database system, or a logical database within an overall database management system. Unless a specific meaning is specified for a given use of the term “database”, it should be construed to mean any of these senses of the word, all of which are understood as a plain meaning of the term “database” by those having ordinary skill in the art. Similarly, some aspects may make use of one or more security systems36and configuration systems35. Security and configuration management are common information technology (IT) and web functions, and some amount of each are generally associated with any IT or web systems. It should be understood by one having ordinary skill in the art that any configuration or security subsystems known in the art now or in the future may be used in conjunction with aspects without limitation, unless a specific security36or configuration system35or approach is specifically required by the description of any specific aspect. FIG.12shows an exemplary overview of a computer system40as may be used in any of the various locations throughout the system. It is exemplary of any computer that may execute code to process data. Various modifications and changes may be made to computer system40without departing from the broader scope of the system and method disclosed herein. Central processor unit (CPU)41is connected to bus42, to which bus is also connected memory43, nonvolatile memory44, display47, input/output (I/O) unit48, and network interface card (NIC)53. I/O unit48may, typically, be connected to peripherals such as a keyboard49, pointing device50, hard disk52, real-time clock51, a camera57, and other peripheral devices. NIC53connects to network54, which may be the Internet or a local network, which local network may or may not have connections to the Internet. The system may be connected to other computing devices through the network via a router55, wireless local area network56, or any other network connection. Also shown as part of system40is power supply unit45connected, in this example, to a main alternating current (AC) supply46. Not shown are batteries that could be present, and many other devices and modifications that are well known but are not applicable to the specific novel functions of the current system and method disclosed herein. It should be appreciated that some or all components illustrated may be combined, such as in various integrated applications, for example Qualcomm or Samsung system-on-a-chip (SOC) devices, or whenever it may be appropriate to combine multiple capabilities or functions into a single hardware device (for instance, in mobile devices such as smartphones, video game consoles, in-vehicle computer systems such as navigation or multimedia systems in automobiles, or other integrated hardware devices). In various aspects, functionality for implementing systems or methods of various aspects may be distributed among any number of client and/or server components. For example, various software modules may be implemented for performing various functions in connection with the system of any particular aspect, and such modules may be variously implemented to run on server and/or client components. The skilled person will be aware of a range of possible modifications of the various aspects described above. Accordingly, the present invention is defined by the claims and their equivalents. | 55,925 |
11858017 | List of Reference Numerals: sectional combined input head—1; intermediate connector—2; first high-pressure-gas through hole—201; first heat-transfer-oil through hole202; second heat-transfer-oil through hole—203; first hot-water through hole—204; second hot-water through hole—205; first connection hole—206; second connection hole—207; water-vapor coupling injection activation chip—3; second high-pressure-gas through hole—301; third heat-transfer-oil through hole—302; fourth heat-transfer-oil through hole—303; third hot-water through hole304; fourth hot-water through hole—305; gas-liquid spraying hole—306; first connection board—401; second connection board—402; third connection board—403; fourth connection board—404; fifth connection board—405; bottom protector—5. DETAILED DESCRIPTION A detailed description of the technical schemes of the present disclosure will be made below regarding the drawings, but the protection scope of the present disclosure is not limited to the embodiments. FIGS.1-7show an in-situ vapor injection thermal desorption device, which includes a sectional combined input head1, several intermediate connectors2and a bottom protector5connected in order from top to bottom. The in-situ vapor injection thermal desorption device further includes several water-vapor coupling injection activation chip3. There are four intermediate connectors2, namely, a first intermediate connector, a second intermediate connector, a third intermediate connector, and a fourth intermediate connector. There are three water-vapor coupling injection activation chips, namely, a first water-vapor coupling injection activation chip, a second water-vapor coupling injection activation chip, and a third water-vapor coupling injection activation chip, and they are disposed below the second intermediate connector, the third intermediate connector, and the fourth intermediate connector, respectively. The sectional combined input head1, the intermediate connectors2, the water-vapor coupling injection activation chips3, and the bottom protector5are connected through flanges. In addition to the flange connection, four first connection boards401are disposed on an outer side of the connection portion of the sectional combined input head1and the first intermediate connector. An upper end and a lower end of each first connection board401are fixed to the sectional combined input head and the first intermediate connector respectively through bolts. Four second connection boards402are disposed on an outer side of the connection portion of the first intermediate connector and the second intermediate connector, and an upper end and a lower end of each second connection board402are fixed to the first intermediate connector and the second intermediate connector respectively through bolts. A third connection board403is disposed on an outer side of the connection portion of the second intermediate connector and the third intermediate connector. An upper end, a middle portion and a lower end of the third connection board403are fixed to the second intermediate connector, the first water-vapor coupling injection activation chip and the third intermediate connector, respectively, through bolts. The third connection board403is provided with a second through hole corresponding to an outlet end of gas-liquid spraying holes on the first water-vapor coupling injection activation chip. A fourth connection board404is disposed on an outer side of the connection portion of the third intermediate connector and the fourth intermediate connector. An upper end, a middle portion and a lower end of the fourth connection board404are fixed to the third intermediate connector, the second water-vapor coupling injection activation chip and the fourth intermediate connector, respectively, through bolts. The fourth connection board404is provided with a third through hole corresponding to an outlet end of gas-liquid spraying holes on the second water-vapor coupling injection activation chip. A fifth connection board405is disposed on an outer side of the connection portion of the fourth intermediate connector and the bottom protector. An upper end, a middle portion and a lower end of the fifth connection board405are fixed to the fourth intermediate connector, the third water-vapor coupling injection activation chip and the bottom protector, respectively, through bolts. The fifth connection board405is provided with a fourth through hole corresponding to an outlet end of gas-liquid spraying holes on the third water-vapor coupling injection activation chip. The sectional combined input head1is provided with a high-pressure-gas inlet, two heat-transfer-oil inlets, two heat-transfer-oil outlets, two hot-water inlets and two hot-water outlets thereon. An annular mounting board is disposed on an outer side of the sectional combined input head1for mounting the in-situ vapor injection thermal desorption device on a thermal enhanced vapor extraction box. The mounting board is provided with several through holes. The mounting board is located below the heat-transfer-oil inlets, the heat-transfer-oil outlets, the high-pressure-gas inlet, the hot-water inlets, and the hot-water outlets. In some embodiments of the present disclosure, one first high-pressure-gas through hole201, two first heat-transfer-oil through holes202, two second heat-transfer-oil through holes203, two first hot-water through holes204and two second hot-water through holes205are disposed inside the intermediate connector2and run through up and down. The first heat-transfer-oil through hole202and the second heat-transfer-oil through hole203adjacent to each other are communicated through a first connection hole206. The first hot-water through hole204and the second hot-water through hole205adjacent to each other are communicated through a second connection hole207. The first high-pressure-gas through hole is disposed at the middle of the intermediate connector2. The first heat-transfer-oil through holes202, the second heat-transfer-oil through holes203, the first hot-water through holes204, and the second hot-water through holes205are uniformly distributed around the first high-pressure-gas through hole201. Furthermore, one second high-pressure gas through hole301, two third heat-transfer-oil through holes302, two fourth heat-transfer-oil through holes303, and two third hot-water through holes304and two fourth hot-water through holes305are disposed inside the water-vapor coupling injection activation chip3and run through up and down. The second high-pressure gas through hole301is disposed at the middle of the water-vapor coupling injection activation chip3. The third heat-transfer-oil through holes302, the fourth heat-transfer-oil through holes303, the third hot-water through holes304and the fourth hot-water through holes305are distributed around the second high-pressure-gas through hole301. Four gas-liquid spraying holes306are uniformly disposed inside the water-vapor coupling injection activation chip3and arranged transversely therein. The gas-liquid spraying hole306is a Y-shaped through hole, including two inlet ends and one outlet end. The outlet end of the gas-liquid spraying hole306is disposed on the side of the water-vapor coupling injection activation chip3. The inlet end of the gas-liquid spraying hole306is communicated with the second high-pressure gas through hole. The two inlet ends are respectively communicated with the second high-pressure-gas through hole. The third hot-water through hole304or the fourth hot-water through hole305is communicated with a connection portion between the inlet end and the outlet end of an adjacent gas-liquid spraying hole306through a third connection pipe arranged transversely. The outlet end of the gas-liquid spraying hole306has a flared shape. The high-pressure-gas inlet, the first high-pressure-gas through hole201and the second high-pressure-gas through hole301are communicated with one another correspondingly. The heat-transfer-oil inlet, the first heat-transfer-oil through hole202and the third heat-transfer-oil through hole302are communicated with one another correspondingly. The heat-transfer-oil outlet, the second heat-transfer-oil through hole203and the fourth heat-transfer-oil through hole303are communicated with one another correspondingly. The hot-water inlet, the first hot-water through hole204and the third hot-water through hole304are communicated with one another correspondingly. The hot-water outlet, the second hot-water through hole205and fourth hot-water through hole305are communicated with one another correspondingly. An end surface of the bottom protector5connected to the adjacent intermediate connector2is a closed surface. The heat-transfer-oil enters the first heat-transfer-oil through the hole of the intermediate connector and the third heat-transfer-oil through the hole inside the water-vapor coupling injection activation chip from the heat-transfer-oil inlet of the sectional combined input head, and the first heat-transfer-oil through the hole and the second heat-transfer-oil through hole of the intermediate connector are communicated through the first connection hole so that the heat-transfer-oil enters the second heat-transfer-oil through hole of the intermediate connector and the fourth heat-transfer-oil through the hole inside the water-vapor coupling injection activation chip and then flows out from the heat-transfer-oil outlet. The hot-water enters the first hot-water through the hole of the intermediate connector and the third hot-water through the hole inside the water-vapor coupling injection activation chip from the hot-water inlet of the sectional combined input head, and the first hot-water through the hole and the second hot-water through hole of the intermediate connector are communicated with each other through the second connection hole so that the hot-water enters the second heat-transfer-oil through hole of the intermediate connector and the fourth heat-transfer-oil through hole of the water-vapor coupling injection activation chip and a portion of the hot-water enters the gas-liquid spraying hole of the water-vapor coupling injection activation chip, so as to be sprayed out from the outlet end of the gas-liquid spraying hole under the drive of high-pressure-gas, and a portion of the hot-water is discharged from the hot-water outlet. The intermediate connector and the water-vapor coupling injection activation chip can be assembled together. In an on-site application, according to actual remediation depth, several water-vapor coupling injection activation chips can be flexibly provided to ensure that a deep polluted zone can be remediated by spraying. The intermediate connectors are used to connect the respective water-vapor coupling injection activation chips and enable the height of the in-situ vapor injection thermal desorption device to match the depth of the organic polluted soil, so that the water vapor can reach the organic polluted soil uniformly. The intermediate connector can also increase the distance between the two water-vapor coupling injection activation chips according to the need so as to avoid waste of vapor caused by the two water-vapor coupling injection activation chips being too close. The gas-liquid spraying holes are uniformly disposed in the water-vapor coupling injection activation chip. When the in-situ vapor injection thermal desorption device is disposed in the middle position of the box containing organic polluted soil, the gas-liquid spraying holes arranged uniformly can spray vapor evenly to the surroundings of the in-situ vapor injection thermal desorption device. The gas-liquid spraying hole is a Y-shaped through hole, with two inlet ends and one outlet end, which can further pressurize two-phase substances, i.e., the high-pressure gas and the hot-water. The pressure at the central connection portion of the Y-shaped through the hole is greater than the pressure at the outlet end of the Y-shaped though hole. Therefore, the pressure gradient difference can be utilized to realize gas tight effect, achieving the function of only spraying out the water vapor without condensing the water vapor and causing backflow. The design of high-pressure gas and the Y-shaped through hole can both increase the distance of vapor spraying so that the vapor can reach the inner wall of the box. The outlet of the Y-shaped through hole is of a flared shape. The spraying angle can be adjusted through an outlet end having different flaring degrees. In addition to the flange connection between the sectional combined input head, the intermediate connector, the water-vapor coupling injection activation chip and the bottom protector, the connection board is also used to reinforce the connection and further prevent the departure of components. The entire structure combined by the sectional combined input head, the intermediate connector, the water-vapor coupling injection activation chips and the bottom protector is in a segmented form, such as a skeleton structure. In order to ensure the working stability of the in-situ vapor injection thermal desorption device in an in-situ application on the spot, especially in a zone for deep polluted organic soil remediation, it needs to perform a good construction treatment at the injection point to guarantee the stability of the soil body and prevent the damage to the in-situ vapor injection thermal desorption device by a side pressure of the soil body. During good construction, a Geoprobe is used to place a porous, high-intensive, corrosion-resistant ABS plastic tube well in a remediation zone in advance so that it cannot only stabilize the soil layer and protect the in-situ vapor injection thermal desorption device but also can be used as a subsequent remediation monitoring spot or a secondary spot for supplemental remediation. Although the present disclosure has been illustrated and explained as above with reference to specific preferred embodiments, it must not be interpreted as limiting the invention itself. Instead, various changes can be made in forms and details without departing from the spirit and scope of the disclosure defined by the claims. | 14,266 |
11858018 | DETAILED DESCRIPTION The present application is further explained in detail through specific embodiments. Embodiment 1 As shown inFIG.2,FIG.3,FIG.4,FIG.5andFIG.11, an in-situ remediation method for a lead-zinc slag4dump includes:step 1: a curing agent layer5, a clay barrier layer6and a planting soil layer7are provided on a surface of the lead-zinc slag4dump in sequence, and an interceptor ditch10and a retaining wall3are provided at a highest position and a lowest position of the lead-zinc slag4dump respectively, where quick lime is used as the curing agent, an amount of the quick lime is 30-32 kilograms per square meter (kg/m 2), a thickness of the clay barrier layer6is 15-17 centimeter (cm) and a thickness of the planting soil layer7is 20-25 cm;step 2: ground covers8and shrubs9are planted in the planting soil layer7, whereCynodon dactylonandTrifoliumare used as the ground covers8, a total seeding amount of theCynodon dactylonand theTrifoliumis 30-32 grams per square meter (g/m2),Broussonetia papyrifera, Cryptomeria japonicaandRobinia pseudoacaciaare used as the shrubs9, and a total planting amount of theBroussonetia papyrifera, theCryptomeria japonicaand theRobinia pseudoacaciais 250-280 plants/mu (1 mu≈666.7 m2);step 3: baffle plates and twenty-one regulating assemblies are provided in the lead-zinc slag4, where each of the regulating assemblies includes a water tank14, a blind ditch13and a first isolation plate16, in which the water tank14is semi-circular, the blind ditch13is located in the water tank14, a bottom of the water tank14is uniformly provided with deflector holes15, in which distances between the adjacent deflector holes15are 1-1.5 meters (m), a sliding groove is provided in a wall of the water tank14, in which an extension direction of the sliding groove is consistent with a length direction of the water tank14, the sliding groove is communicated with the deflector hole15, in which a width of the sliding groove is greater than bore diameters of the deflector holes15, the first isolation plate16is slidably connected in the sliding groove and is provided with first water through holes corresponding to the deflector holes15, a water outlet end of the water tank14and a water outlet end of the blind ditch13are connected with a reservoir, ends of a plurality of water tanks14and ends of a plurality of blind ditches13far away from the reservoir are fixedly connected through the baffle plates, and the baffle plates block the ends of the water tanks14and the ends of the blind ditches13far away from the reservoir; eleven water spraying components are provided in the planting soil layer7, where each of the water spraying components includes a water supply pipe11, a second isolation plate18and a plurality of sprinklers17, the plurality of sprinklers17are installed in a top of the water supply pipe11, are communicated with the water supply pipe11and extend to the planting soil layer7outside, a bottom of the water supply pipe11is uniformly provided with diversion holes, and the second isolation plate18is connected to an inner bottom of the water supply pipe11in a sliding way and is provided with second water through holes corresponding to the diversion holes; the water supply pipe11is connected with a pool, submersible pumps are provided in the pool, a water outlet end of each of the submersible pumps is connected with a water delivery pipe, and the water delivery pipe is communicated with the water supply pipe11, where a number of the submersible pumps is adjusted according to a number and diameters of the water supply pipes11; each of the second water through holes is connected with a shunt pipe19, and an end of the shunt pipe19far from corresponding one of the second water through holes is communicated with the blind ditch13; in upper and lower adjacent regulating assemblies, the blind ditch13in the upper regulating assemblies and the water tank14in the lower regulating assemblies are communicated to each other by the guide pipe20, specifically: an end of the guide pipe20is threadedly connected in corresponding one of the deflector holes15in the upper regulating assemblies, and an other end of the guide pipe20is communicated with the adjacent blind ditch13in the lower regulating assemblies, where a number of guide pipes20is a half number of the deflector holes15on the water tank14, and the guide pipes20are arranged at intervals;the first isolation plate16and the second isolation plate18are both connected to power components that drive the first isolation plate16and the second isolation plate18to slide, each of the power component includes an electric motor and a power transmission mechanism, in which the power transmission mechanism are a gear, a bottom of the first isolation plate16and a bottom of the second isolation plate18are provided with a meshing gear respectively that mesh with the gear; the submersible pumps and the motor are connected to a plc controller by electrical signals, where the plc controller is Siemens S7-400 plc controller; eleven protective nets12are provided in the lead-zinc slag4, and the protective nets12are fixedly connected with the water tanks14;step 4: the ground covers8and the shrubs9are watered through the pool, specifically: the second isolation plate18is driven to move through corresponding one of the power components, so that the diversion holes are staggered with the second water through holes on the second isolation plate18, the submersible pumps are started through the plc controller, water in the pool is pumped to the water supply pipe11by the submersible pumps, and then the ground covers8and the shrubs9are watered via the sprinklers17; depending on actual needs, a medicine or a liquid fertilizer is put into the pool and then applied to the ground covers8and the shrubs9; andstep 5: nutrients are provided for the microorganisms in the lead-zinc slag4through the pool, specifically: the plc controller controls the motor (including steering, rotating speed and working time) to work, the first isolation plate16and the second isolation plate18are simultaneously driven to move by the power components, so that the first water through holes are communicated with corresponding the deflector holes15, the nutrients are injected into the pool and pumped to the water supply pipes11by the submersible pumps, so that the nutrients enter the blind ditches13through the shunt pipes19, and finally enter the lead-zinc slag4through the deflector holes15of the water tanks14;biogas slurry is used as the nutrients and sprayed once a month; the shrubs9and the ground covers8are watered and sprayed with the medicine according to actual conditions; the lead-zinc slag4is supplemented with functional bacteria resistant to lead-zinc every 3-5 months, whereVerticillium insectivumis used as the functional bacteria resistant to lead-zinc, specifically: the functional bacteria resistant to lead-zinc are put into the pool, pumped into the water supply pipes11by corresponding one of the submersible pumps, then flow through the shunt pipes19, the blind ditches13and the water tanks14to the lead-zinc slag4. The difference between embodiment 2 and embodiment 1 is that the planting soil layer7is sprayed with vegetation-growing concrete with a thickness of 5-6 cm. Implementation Verification: In August, 2012, the applicant carried out in-situ remediation of a lead-zinc slag in Qunfa Village, Houchang Town, Weining County according to the in-situ remediation method in embodiment 1. As shown inFIG.6, a volume of slag obtained by indigenous zinc smelting at this site is 480 cubic meters (m3) and the slag covers an area of about 7000 (m2). In a process of the in-situ remediation, the difference from embodiment 1 is that downward extending drainage ditches were provided in the middle of the lead-zinc slag dump mainly based on the safety concerns of the people's houses above, and the place was photographed and compared in March 2018, as shown inFIG.7-FIG.8. By measuring contents of heavy metals in the pool, it may be found that the contents of the heavy metals decrease by about 20% every year compared with the previous year, and theTrifoliumand theCynodon dactylonon the dump have been gradually succeeded by macrophanerophytes. In addition, in May, 2012, the applicant used the prior art (different from that in embodiment 1, the prior art was not provided with the regulating assemblies, the baffle plates and other related equipment, but only provided with the water supply pipes11and the sprinklers17; the shrubs9were mainlyCryptomeria japonica) to carry out in-situ remediation of a lead-zinc slag dump in Douqing Town, Shuicheng County, and situations of the dump were shown inFIG.9.FIG.10shows a photo of the dump taken in May 2018. By comparing the drawings, it may be seen that the in-situ remediation method in the application may achieve better results. The technical schemes of the present application are clearly and completely described with reference to the drawings, and it is clear that the described embodiments are a part of the embodiments of the present application, and not all of them. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without making creative labor fall within the scope of protection of the present application. It should be understood that the technical schemes of the present application are not limited to the limits of the above specific embodiments, and any technical variations made according to the technical solutions of the present application, without departing from the scope protected by the objective and claims of the present application, fall within the scope of protection of the present application. | 9,787 |
11858019 | DESCRIPTION OF EMBODIMENTS Preferred embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. In this specification and the drawings, constituent elements having substantially the same functional constitution will be denoted by the same reference numerals and duplicate description thereof will be omitted. In this specification, a numerical range represented using the word “to” refers to a range including numerical values stated before and after the word “to” as a lower limit value and an upper limit value. In this specification, the term “process” is used not only to mean an independent process and also includes a process which cannot be clearly distinguished from other processes as long as an intended purpose of the process is achieved. Furthermore, it is obvious that constituent elements of the following embodiments can be combined. 1. Continuous Casting Facility An example of a constitution of a continuous casting facility configured to manufacture a slab will be described with reference toFIGS.1and2.FIG.1is a diagram illustrating a continuous casting facility1configured to manufacture a slab.FIG.2is a plan view illustrating an example of a constitution of a continuous casting device10when viewed from directly above in a casting direction. Referring toFIG.1, the continuous casting facility1includes the twin-drum type continuous casting device10(hereinafter referred to as a “continuous casting device10”), a first pinch roll20, a rolling mill30, a control device100, a meandering meter110, a second pinch roll40, and a winding device50. The continuous casting device10includes a pair of casting drums including a first casting drum11and a second casting drum12. The pair of casting drums are arranged to face each other in a horizontal direction. The continuous casting device10continuously casts a slab S by rotating the first casting drum11and the second casting drum12in different circumferential directions so that facing surfaces of the pair of casting drums extend downward and cooling and solidifying a molten metal injected into a molten metal pool part formed by the circumferential surfaces of these casting drums on the circumferential surfaces of the casting drums. Here, a constitution of the continuous casting device10will be described with reference toFIG.2. Referring toFIG.2, in the continuous casting device10, the first casting drum11and the second casting drum12are arranged to face each other in the horizontal direction and a slab is cast between the first casting drum11and the second casting drum12. The first casting drum11and the second casting drum12rotate through the driving of a motor M and send out the slab S downstream in the casting direction. The continuous casting device10includes a side weir15dand a side weir15wformed at both end portions of the first casting drum11and the second casting drum12in a width direction so that the side weir15dand the side weir15wsurround a gap formed by the first casting drum11and the second casting drum12facing each other. A molten metal is stored in a region surrounded by the first casting drum11, the second casting drum12, the side weir15d, and the side weir15wand slabs S are sequentially cast. Both end portions of axles of the first casting drum11and the second casting drum12in the width direction are supported by a housing13dand a housing13w. In both end portions of the axle of the second casting drum12, a joining part19configured to join both end portions of the axle of the second casting drum12is provided on a side opposite to a side on which the first casting drum11is arranged in the horizontal direction in which the casting drums face. The joining part19is connected to a cylinder17on a side opposite to a side on which the second casting drum12is arranged. The cylinder17can screw down each of the casting drums in the horizontal direction in which the casting drums face. When the cylinder17screws down the joining part19, the second casting drum12can move in the horizontal direction in which the casting drums face. When the second casting drum12moves, the slab S can be screwed down using the first casting drum11and the second casting drum12. A load cell14dand a load cell14wconfigured to measure a load applied to the first casting drum11are provided at both end portions of the axle of the first casting drum11opposite to a side on which the cylinder17is arranged. Thus, it is possible to measure a load due to the screw-down of the cylinder17. The cast slab S is sent from the continuous casting device10to the rolling mill30using the first pinch roll20. The rolling mill30rolls the slab S such that it has a desired plate thickness. The rolling mill30includes an upper work roll31, a lower work roll32, and an upper backup roll33and a lower backup roll34configured to support the upper work roll31and the lower work roll32. The rolling mill30screws down the slab S so that the slab S is arranged between the upper work roll31and the lower work roll32. The control device100and the meandering meter110are provided upstream of the rolling mill30illustrated inFIG.1in a rolling direction thereof. The meandering meter110has a function of acquiring position information regarding the slab S with respect to a work roll of the rolling mill30. The meandering meter110also has a function of outputting the acquired position information to the control device100. The meandering meter110may be, for example, an imaging device such as a camera. In this case, it is possible to acquire position information regarding the slab S by performing image processing on a captured image. Although the meandering meter110has been utilized as an example to acquire the position information in this embodiment, a form of the position information is not limited as long as the form can acquire position information. For example, position information regarding the slab S may be acquired using a thermometer in a width direction instead of the meandering meter110or position information regarding the slab S may be acquired by installing a split type looper in a pass line of the slab S and utilizing the tension obtained from the looper. Also, although the meandering meter110is installed upstream of the rolling mill30in the rolling direction thereof in this embodiment, the meandering meter110may be installed downstream in the rolling direction thereof. A place in which the meandering meter110is installed is upstream or downstream of the rolling mill30in the rolling direction thereof. In addition, when the place is closer to the rolling mill30, it is possible to quickly acquire position information regarding the slab S. The control device100includes a plate thickness calculator, a ratio calculator, and a controller. The control device100has a function of acquiring position information regarding the slab S in the width direction from the meandering meter110and controlling the rolling mill30on the basis of the position information. Details of an operation of the control device100will be described later. The rolling mill30is controlled by the control device100. The control device100controls screw-down positions of the upper work roll31and the lower work roll32on the basis of the measurement results of the meandering meter110, for example, when the slab S is rolled. The slab S rolled by the rolling mill30to have a desired plate thickness is sent to the winding device50using the second pinch roll40and is wound in a coil shape using the winding device50. 2. Method for Rolling Slab A method for rolling a slab described in the following description relates to a technique for further reducing meandering of a slab using a rolling mill and reducing a plate passing trouble in a continuous casting facility having a twin-drum type continuous casting device and a rolling mill. The meandering in the rolling mill30will be described with reference toFIGS.3and4.FIG.3is a schematic plan view illustrating a state of meandering of a slab S in the rolling mill30and is a diagram of a plate surface of the slab S when viewed from the upper work roll31side.FIG.4is a schematic plan view illustrating a state in which a slab having a wedge generated therein is cast. Referring toFIG.3, the slab S rolled using the upper work roll31and the lower work roll32does not move forward parallel to the rolling direction and has meandering occurring so that a plate passing position of the slab moves in a direction perpendicular to the rolling direction. The meandering is caused by asymmetric rolling of one ends and the other ends, that is, the lefts and rights, of the upper work roll31and the lower work roll32. Such meandering of the slab S can occur due to a shape of a plate thickness of the slab S prior to the slab is rolled using the rolling mill30, that is, at the time of casting. For example, as illustrated inFIG.4, the continuous casting device10may cast a slab S whose plate thickness gradually changes from one end portion thereof in the width direction toward the other end portion thereof in some cases. A plate thickness t1of one end portion of the slab S ofFIG.4is thicker than a plate thickness t2of the other end portion thereof. If the slab S whose plate thickness is not uniform and in which the wedges are generated in this way is rolled using the rolling mill30, a portion thereof in which the plate thickness is thick stretches more than a portion thereof in which the plate thickness thereof is thin. On an entry side of the rolling mill30, a reduction ratio at an end portion on the plate thickness t1side in the rolling mill30is larger than on the plate thickness t2side. In this case, a material speed at the end portion on the t1side on the entry side of the rolling mill30of the slab S at the time of rolling is smaller than on the plate thickness t2side on the entry side. In this way, when a difference in material speed between one end and the other end of the slab S, that is, the rotation of the slab S in a plane occurs, meandering occurs. In order to reduce the occurrence of meandering, it is effective to minimize the difference in material speed between one end and the other end of the slab S as described above and to roll the slab so that the slab has a desired exit-side plate thickness. The inventors of the present disclosure have diligently studied a rolling method for rolling a slab S so that the slab S has a desired exit-side plate thickness by minimizing a difference in material speed between one end and the other end of the slab S and have found a rolling method in which meandering in the rolling mill30is minimized and a plate passing trouble is minimized. A description will be provided with reference toFIG.5. (a) ofFIG.5illustrates a state in which a slab S in which wedges are generated is rolled in the rolling mill30and a cross section of the slab S in the width direction on the entry side and an exit side of the rolling mill30.FIG.5is an example of a cross-sectional view of a slab in which meandering occurs in a longitudinal direction (a transportation direction) when viewed in a cross-sectional view. As illustrated in (b) ofFIG.5, prior to rolling, that is, on the entry side of the rolling mill30, the slab S has a shape in which a plate thickness HDat one end of the slab S is thinner than a plate thickness HWat the other end thereof and a plate thickness thereof gradually changes from one side to the other side in the width direction. When such a slab S is rolled using the rolling mill30, as illustrated in (c) ofFIG.5, it is assumed that the slab S on the exit side of the rolling mill30has, for example, a shape in which one end of the slab S has a plate thickness hDand the other end thereof has a plate thickness hW. In the rolling mill30according to this embodiment, in order to minimize differences in material speed of the slab S in the width direction occurring at the time of rolling in the rolling mill30, the slab S in which the wedges are generated is rolled so that reduction ratios of the slab S in the width direction are substantially the same. At this time, a screw-down position of the rolling mill30is controlled by acquiring an entry-side wedge ratio ((plate thickness HD-plate thickness HW)/entry-side plate thickness) and an exit-side wedge ratio ((plate thickness hD_plate thickness hW)/exit-side plate thickness) and by determining whether the reduction ratio of the slab S in the width direction is substantially the same from these differences. If it is determined that the reduction ratio of the slab S in the width direction are substantially the same, a difference in material speed of the slab S in the width direction does not occur and the rotation of the slab S in a plane does not occur. Thus, it is possible to minimize the occurrence of meandering in the rolling mill. In order to realize such a rolling method, the plate thickness calculator of the control device100first calculates an entry-side wedge ratio (%) indicating a ratio of an entry-side wedge (plate thickness HD-plate thickness HW) which is a difference in plate thickness between both end portions of a slab S on an entry side of the rolling mill to an entry-side plate thickness of the slab. The entry-side plate thickness of the slab S may be a plate thickness HCat a center of the slab S in the width direction. Subsequently, the plate thickness calculator calculates an exit-side wedge ratio (%) indicating a ratio of an exit-side wedge (plate thickness hD-plate thickness hW) which is a difference in plate thickness at both end portions on an exit side of the rolling mill to an exit-side plate thickness of the slab. An exit-side plate thickness of the slab S may be a plate thickness hCat a center of the slab S in the width direction. Also, the ratio calculator of the control device100acquires a difference between the entry-side wedge ratio (%) and the exit-side wedge ratio (%). After that, the controller of the control device100adjusts a screw-down position of the rolling mill so that the difference is within a prescribed range. The prescribed range of the difference between the entry-side wedge ratio and the exit-side wedge ratio may be empirically obtained from, for example, an amount of meandering which is allowable in an actual operation. The prescribed range may be a value of 0% or more and 2% or less. When an upper limit of a magnitude of the difference is 2%, it is possible to reduce meandering in the rolling mill30more reliably. Thus, it is possible to minimize a difference in material speed between one end and the other end of the slab S and to minimize meandering. Each process will be described in detail below. (Method for Calculating Rolling Mill Entry-Side Wedge Ratio) First, a method for calculating an entry-side wedge ratio in the plate thickness calculator will be described. A slab S rolled using the rolling mill30is cast using the continuous casting device10arranged upstream from the rolling mill30in the rolling direction. In this embodiment, a plate thickness of the slab S cast using the continuous casting device10is calculated and is used for calculation of the rolling mill entry-side wedge ratio as an entry-side plate thickness of the rolling mill30. Thus, it is possible to acquire a plate thickness of the slab S on the entry side of the rolling mill30even if a plate thickness gauge or the like is not installed on an entry side of the rolling mill30. A plate thickness of the slab S on the entry side of the rolling mill30is estimated from a drum gap between the casting drums. The drum gap between the casting drums changes in accordance with a load applied to the casting drums, contact with the slab, and the like, in addition to changes due to a cylinder screw-down position. Changes in the drum gap due to the load applied to the casting drums, the contact with the slab, and the like can be considered separately as an amount of contribution of elastic deformation of the casting drums, an amount of contribution of elastic deformation other than that of the drums, and an amount of contribution of changes in drum profile of the casting drums. The amount of contribution of elastic deformation other than that of the casting drums is referred to as “casting drum housing screw-down system deformation”. Thus, it is possible to estimate the entry-side plate thickness of the rolling mill30from the following Expression 1 using various conditions of the casting drums: (Estimatedplatethicknessonentrysideofrollingmill)=Expression1(screw-downpostionofcastingcylinder)+(elasticdeformationofcastingdrum)+(castingdrumhousingscrew-downsystemdeformation)+(drumprofileofcastingdrum)-(elasticdeformationofcastingdrumatthetimeofscrew-downpositionzero-pointadjustment). Here, in Expression 1, a screw-down position and casting drum housing screw-down system deformation of the casting cylinder represent differences from when the screw-down position zero-point is adjusted. The differences may be differences with respect to the cylinder screw-down position and the casting drum housing deformation at the time of screw-down position zero-point adjustment. (Screw-Down Position of Cylinder) The screw-down position of the cylinder indicates a screw-down position of the cylinder17in a direction in which the cylinder17of the continuous casting device10illustrated inFIG.2is pressed. For example, the screw-down position of the cylinder indicates a position due to a difference from an initial value which is a zero point at which a position of the cylinder is subjected to zero point adjustment. It is possible to obtain the screw-down position of the cylinder from the displacement in a direction along an arrow a ofFIG.2orFIG.7. It is possible to timely measure the screw-down position of the cylinder using a position sensor or the like (not shown) capable of measuring an amount of the cylinder17to be moved. (Elastic Deformation of Casting Drum) The elastic deformation of the casting drums at the time of casting indicates elastic deformation of the casting drums at any time from the start of casting to the end of casting. In each of the casting drums, the axis of the casting drum is bent or flat deformation occurs in the casting drum due to an influence of a reaction force from the slab in contact with the casting drum and an external force applied to the casting drum. These deformations are referred to as elastic deformations of the casting drum at the time of casting. It is possible to obtain the elastic deformation of the casting drum using a means such as analysis using an elastic theory. For example, the deflection of the axis of the casting drum due to an amount of contribution of drum deformation of the casting drum can be calculated from the calculation of beam deflection in strength of materials by regarding the casting drum as a support beam for both ends. With regard to a load distribution in the width direction used at the time of calculating deflection, there is no problem if the linear distribution in the width direction is assumed on the basis of load cell values provided at both end portions of the axis of the casting drum. (Casting Drum Housing Screw-Down System Deformation) Casting drum housing screw-down system deformation characteristics include deformation characteristics which include characteristics in which the housing13dand the housing13wdeform and characteristics in which a constitution in which the casting drum including the cylinder17is screwed down deforms under an influence of a screw-down load applied to the casting drum. The casting drum housing screw-down system deformation of the foregoing Expression 1 indicates an amount of casting drum housing to deform calculated using the casting drum housing screw-down system deformation characteristics. For example, the casting drum housing screw-down system deformation characteristics can be obtained using the method described in Patent Document 6. The casting drum housing screw-down system deformation can be calculated on the basis of the load or the like measured by the load cell14d(or the load cell14w) as will be described later. (Drum Profile of Casting Drum) A drum profile of the casting drum is an index indicating an amount of thermal expansion of the casting drum or an amount of wear of the casting drum. In the drum profile of the casting drum, for the amount of thermal expansion, an amount of deformation of a surface shape of the casting drum is calculated on the basis of the heat applied to the casting drum. The amount of wear may be obtained by actually measuring the drum profile prior to the casting or estimated from the casting conditions. For example, since a surface shape at the time of designing a casting drum is known, it is possible to obtain an amount of deformation of the drum profile by adding the shape deformation due to thermal expansion and wear to the surface shape thereof. (Elastic Deformation of Casting Drum at the Time of Screw-Down Position Zero-Point Adjustment) The elastic deformation of the casting drum at the time of screw-down position zero-point adjustment refers to the elastic deformation of the casting drum at the time of screw-down position zero-point adjustment in which the initial value of the screw-down position of the casting drum is determined prior to the start of casting. Since the screw-down position zero-point adjustment is performed with a load applied to the casting drum, elastic deformation occurs in the casting drum. An amount of elastic deformation at that time is defined as elastic deformation of the casting drum at the time of screw-down position zero-point adjustment. This amount of elastic deformation can be calculated from the calculation of beam deflection in strength of materials in which the drum is regarded as a support beam for both ends, as in the elastic deformation of the casting drum at the time of casting. As described above, the estimated plate thickness is obtained by subtracting a value of “elastic deformation of the casting drum at the time of screw-down position zero-point adjustment of the casting drum” from a sum of values of a “screw-down position of a casting cylinder”, “elastic deformation of the casting drum”, “casting drum housing screw-down system deformation”, and a “drum profile of the casting drum”. Since the exit-side plate thickness of the continuous casting device10due to the gap between the casting drums obtained using the forgoing Expression 1 is equal to the plate thickness of the slab on the entry side of the rolling mill30, it is possible to acquire plate thicknesses at both end portions of the slab S from the exit-side plate thickness of this continuous casting device10. Moreover, it is possible to calculate an entry-side wedge ratio from the difference in plate thickness at both end portions of the slab S and the plate thickness at the center of the slab S in the width direction. (Method for Calculating Rolling Mill Exit-Side Wedge Ratio) A method for calculating an exit-side wedge ratio of the rolling mill30will be described below. The exit-side plate thickness can be estimated using, for example, the following Expression 2 in which a gap between the upper work roll31and the lower work roll32is calculated. If a distribution of the gap between the upper work roll31and the lower work roll32in the width direction is grasped, a profile of the slab S rolled using the upper work roll31and the lower work roll32can also be estimated: (Estimatedplatethicknessonexitsideofrollingmill)=Expression2(screw-downpositionofrollingcylinder)+(elasticdeformationofworkroll)+(rollingmillhousingscrew-downsystemdeformation)+(rollprofileofworkroll)-(elasticdeformationofworkrollatthetimeofscrew‐downpositionzero-pointadjustment) A screw-down position of a rolling cylinder indicates a position of the cylinder in a direction in which the cylinder configured to screw down the work roll of the rolling mill is screwed down. For example, the screw-down position of the cylinder indicates a position due to a difference from an initial value which is a zero point at which a position of the cylinder is subjected to zero-point adjustment. The elastic deformation of the work roll indicates the elastic deformation of the work roll at any time from the start of rolling to the end of rolling. In the work roll, the axis of the work roll is bent or flat deformation occurs in the work roll due to an influence of the reaction force from a slab in contact with the work roll or a backup roll and an external force applied to the work roll. These deformations are referred to as “work roll elastic deformations”. It is possible to acquire the deflection of the axis of the work roll and the flat deformation of the work roll which are the work roll elastic deformations using, for example, the method described in Patent Document 6. The rolling mill housing screw-down system deformation characteristics indicate deformation characteristics which include characteristics in which housings configured to support the work rolls and the like deform and characteristics in which a constitution in which the work roll including the cylinder is screwed down deforms under an influence of a rolling load applied to the work roll. For example, it is possible to acquire the rolling mill housing screw-down system deformation characteristics using the method described in Patent Document 6. The roll profile of the work roll is an index indicating an amount of thermal expansion of the work roll or an amount of wear of the casting drum. In the roll profile of the work roll, for the amount of thermal expansion, an amount of deformation of a surface shape of the work roll is calculated on the basis of the heat applied to the work roll. The amount of wear may be obtained by actually measuring a roll profile prior to rolling or estimated from the rolling conditions. For example, since the surface shape of the work roll at the time of designing the rolling mill is known, it is possible to acquire an amount of deformation of the roll profile by adding the shape deformation due to thermal expansion to the surface shape. The work roll elastic deformations at the time of screw-down position zero-point adjustment indicate the work roll elastic deformations at the time of screw-down position zero-point adjustment in which the initial value of the screw-down position of the rolling mill is determined prior to the start of rolling. Since the screw-down position zero-point adjustment is performed with a load applied to the work roll, elastic deformation occurs in the work roll. An amount of elastic deformation at that time is defined as the work roll elastic deformations at the time of the screw-down position zero-point adjustment. It is possible to calculate this amount of elastic deformation as in the work roll elastic deformations at the time of rolling. As described above, the gap between the work rolls on the exit side of the rolling mill is obtained by subtracting a value of “work roll elastic deformation at the time of the screw-down position zero-point adjustment” from a sum of values of a “screw-down position of a rolling cylinder”, “work roll elastic deformation”, “rolling mill housing screw-down system deformation”, and a “roll profile of a work roll”. Here, in order to calculate the wedges of the slab on the exit side of the rolling mill30, in the foregoing Expression 2, it is necessary to specifically designate a position of the slab S in the width direction with respect to the upper work roll31and the lower work roll32of the rolling mill30. This is because the work roll elastic deformations change and a distribution of the gap between the upper work roll31and the lower work roll32in the width direction changes when a position of a point of action of the reaction force from the slab in contact with the work roll changes or a distribution of the reaction force in the width direction exerted on the work roll from the slab S or the backup roll changes in accordance with the position of the slab S. Therefore, the plate thickness calculator acquires position information regarding the slab S from the meandering meter110and specifically designates a position of the slab S in the width direction with respect to the rolling mill30. Moreover, the plate thickness calculator calculates the gap between the work rolls corresponding to the position of the slab S in the width direction as an exit-side plate thickness of the slab S from a distribution of the gap between the work rolls acquired using the foregoing Expression 2. Thus, a plate thickness corresponding to both end portions of the slab S is obtained. The plate thickness calculator calculates an exit-side wedge ratio on the basis of the difference in plate thickness at both end portions of the slab S and the plate thickness at the center of the slab in the width direction. The position information of the slab S will be described with reference toFIG.6.FIG.6is a schematic diagram of the rolling mill30when viewed in the rolling direction. The position information is position information of the slab S with respect to the work roll. The position information may be information indicating of a place in which the slab S is in contact with the work roll. To be specific, the position information may be a distance Y from a center point Sc of the slab S in the width direction to a midpoint We of a straight line connecting a center point31cof the upper work roll31in the width direction to a center point32cof the lower work roll32in the width direction. In this way, the plate thickness calculator and the ratio calculator calculate the entry-side wedge ratio and the exit-side wedge ratio of the rolling mill30. The ratio calculator outputs the calculated entry-side wedge ratio and exit-side wedge ratio to the controller. (Control of Rolling Mill) The controller acquires the entry-side wedge ratio and the exit-side wedge ratio from the ratio calculator and obtains a difference between the entry-side wedge ratio and the exit-side wedge ratio. The controller adjusts a screw-down position of the rolling mill30so that this difference is within a prescribed range. The adjustment of the rolling mill30is performed using the cylinder provided in the rolling mill30. Although the prescribed range (that is, an allowable magnitude of the difference between the entry-side wedge ratio and the exit-side wedge ratio) can be appropriately determined in accordance with a material of the slab, a state of the rolling mill30, and the like, for example, the prescribed range may be 0% or more and 2% or less. It is possible to more reliably minimize the occurrence of meandering of the rolling mill30by setting the magnitude of the difference between the entry-side wedge ratio and the exit-side wedge ratio to 2% or less. 3. Slab Manufacturing Method With regard to a slab manufacturing method relating to the embodiment, a specific overall procedure will be described below. First, the plate thickness calculator of the control device100calculates an entry-side plate thickness on the entry side of the rolling mill30. The entry-side plate thickness is calculated on the basis of the foregoing Expression 1. The continuous casting device10includes, for example, various measuring instruments such as a temperature measuring instrument for the first casting drum11and the second casting drum12and the load cell14dand the load cell14wconfigured to measure a load. The plate thickness calculator acquires various values from these various measuring instruments and calculates estimated plate thicknesses at both end portions of the slab using the forgoing Expression 1. The plate thickness calculator calculates an entry-side wedge using plate thicknesses at both end portions of the slab S having the entry-side plate thickness calculated using the foregoing Expression 1. Subsequently, the plate thickness calculator calculates an exit-side plate thickness on the exit-side of the rolling mill30. The exit-side plate thickness is calculated on the basis of the foregoing Expression 2. The rolling mill30includes, for example, various measuring instruments such as a temperature measuring instrument for the upper work roll31and the lower work roll32and a load measuring instrument configured to measure a load. The plate thickness calculator acquires various values from these various measuring instruments and calculates an exit-side plate thickness using the foregoing Expression 2. Here, the plate thickness calculator calculates position information regarding the slab S from the meandering meter110. The plate thickness calculator specifically designates a position of the slab S with respect to the work roll using the position information. The plate thickness calculator estimates a plate thickness corresponding to both end portions of the slab S from the specifically designated position of the slab S and the exit-side plate thickness calculated using the foregoing Expression 2 and calculates an exit-side wedge. Subsequently, the ratio calculator calculates a wedge ratio from the wedges of the slab S on the entry side and the exit side of the rolling mill30and the plate thickness of the slab on the entry side and the exit side of the rolling mill30which are calculated using the plate thickness calculator. To be specific, the ratio calculator calculates an entry-side wedge ratio using an entry-side wedge and a plate thickness at a center of an entry-side slab in the width direction or an average plate thickness of the entry-side slab and calculates an exit-side wedge ratio using the exit-side wedge and a plate thickness at a center of an exit-side slab in the width direction or an average plate thickness of the exit-side slab. Subsequently, the controller calculates a difference between the entry-side wedge ratio and the exit-side wedge ratio calculated by the ratio calculator and adjusts a screw-down position of the cylinder (not shown) of the rolling mill30so that the difference is within a prescribed range. Details of the slab manufacturing method in this embodiment have been described above. 4. Improvement of Accuracy of Rolling Mill Entry-Side Plate Thickness Calculation In this embodiment, the plate thickness of the slab S on the entry side of the rolling mill30is estimated using various conditions of the casting drum on the basis of the foregoing Expression 1. When the accuracy of estimating the plate thickness using the foregoing Expression 1 increases, the accuracy of the difference between the entry-side wedge ratio and the exit-side wedge ratio increases. As a result, it is possible to further minimize meandering of the rolling mill30as well. Here, among the items of the foregoing Expression 1, the casting drum housing screw-down system deformation characteristics indicating the deformation characteristics of constitutions other than the drums significantly depend on a delicate shape of a contact surface, especially in a low load region. Thus, the characteristics easily change and it is difficult to accurately grasp a geometric shape using a known physical model as well. Thus, the inventors of the present disclosure have studied a method for acquiring the casting drum housing screw-down system deformation characteristics and have come up with the method described below. (Acquisition of Casting Drum Housing Screw-Down System Deformation Characteristics) A method for acquiring casting drum housing screw-down system deformation characteristics will be described with reference toFIG.7.FIG.7is a diagram illustrating an example of the method for acquiring the casting drum housing screw-down system deformation characteristics. As illustrated inFIG.7, the casting drum housing screw-down system deformation characteristics are acquired by arranging a test plate16between the first casting drum11and the second casting drum12. A length of the test plate16in a longitudinal direction is longer than a length of a barrel in the width direction of the casting drum and the test plate16has a uniform plate thickness. When the test plate16is pressed and tightened using the cylinder17from this state, the test plate16is pressed by the first casting drum11and the second casting drum12. Although a length of the test plate16in a direction perpendicular to the longitudinal direction is not limited, it is more desirable that the length thereof be a length of about 50 to 100 cm, which is about twice a drum diameter of the first casting drum11and the second casting drum12so that the test plate16can be sufficiently in contact with the first casting drum11and the second casting drum12. When the test plate16longer than the length of the barrel is utilized in this way, it is possible to apply an even load to both end portions of the casting drum and to obtain the casting drum housing screw-down system deformation with high precision. The casting drum housing screw-down system deformation indicates a relationship between a load change and an amount of deformation of the casting drum housing screw-down system. To be specific, in a state in which the test plate16is arranged between the casting drums, an amount of deformation of the casting drum with each load is calculated by tightening the casting drum with a prescribed load larger than a load at the time of adjusting a zero point with respect to the test plate16while the first casting drum11and the second casting drum12does not rotate and obtaining the screw-down position of the casting drum and the load measured by the load cells14dand14w. Moreover, a casting drum housing screw-down system deformation amount is obtained with respect to each load by subtracting the amount of deformation of the casting drum from the screw-down position of the casting drum. Thus, it is possible to acquire the casting drum housing screw-down system deformation characteristics indicating the casting drum housing screw-down system deformation amount according to the load applied to the slab S at the time of casting the slab S. Furthermore, as another method, an average value of the load and the screw-down position of the casting drum may be obtained by rotating the first casting drum11and the second casting drum12in a state in which the test plate16arranged between the casting drums, tightening the casting drums with the prescribed load, and holding the load by a prescribed time. After that, furthermore, the average value of a load of another level and the screw-down position of the casting drum may be obtained by changing the load of the casting drum and holding the changed load by a prescribed time. Here, a time at which each load is held may be an amount corresponding to two rotations of the casting drum. In addition, this average value may be calculated from theses time averages by acquiring time series data of the load and the screw-down position. Thus, the casting drum housing screw-down system deformation amount with respect to each load is obtained by calculating the amount of deformation of the casting drum under each load and subtracting the amount of deformation of the casting drum from the screw-down position of the casting drum. In this way, the casting drum housing screw-down system deformation characteristics using the test plate16whose length is longer than the length of the barrel of the casting drum in the width direction and whose plate thickness is uniform can be obtained and the amount of deformation of the screw-down system including the casting drum housing, the cylinder, and the like due to the load applied to the casting drum at the time of casting can be obtained so that they are reflected in Expression 1. As a result, it is possible to improve the accuracy of the estimated plate thicknesses obtained using Expression 1. The casting drum housing screw-down system deformation characteristics need only to be acquired once prior to the start of a series of casting operations. Furthermore, it is possible to acquire the casting drum housing screw-down system deformation characteristics according to the facility conditions by performing the acquiring of the characteristics when a part of the constitution of the housing or the screw-down system is replaced. It is desirable that the test plate16be formed of, for example, a material which is softer than those of the first casting drum11and the second casting drum12so that dimples or the like formed in surfaces of the first casting drum11and the second casting drum12are not crushed. Although the test plate16is not limited, it is desirable that the test plate16be made of, for example, an aluminum alloy. (Application to Screw-Down Position Zero-Point Adjustment) Also, in the screw-down position zero-point adjustment of the casting drum, as illustrated inFIG.7, the casting drums may be tightened by opening a pair of side weirs provided at end portions of the casting drums in the width direction and arranging a plate whose length is longer than a drum length of the casting drums and whose plate thickness is uniform between the casting drums. Thus, since the drums of the slab is tightened in a state in which the rotation axes of the casting drums are kept parallel to each other, it is possible to apply an even load to both end portions of the casting drums and it is possible to improve the accuracy of the estimated plate thickness on the entry side of the rolling mill by improving the accuracy of the screw-down position zero-point adjustment. In the continuous casting device10, the screw-down position zero-point adjustment of the casting drum is performed prior to the start of operation. Since the drum gap is estimated in a state in which the plate thickness of the slab rolled using the rolling mill30is estimated, it is required that the zero-point adjustment in the casting drum is performed with high precision. First, the screw-down position zero-point adjustment will be described with reference toFIG.8toFIG.10.FIG.8toFIG.10are schematic diagrams of the casting drums at the time of the screw-down position zero-point adjustment prior to the start of casting. InFIGS.8to10, an emphasized concave shape of a profile is illustrated for the sake of explanation. As illustrated inFIG.8toFIG.10, the drum profile of the casting drum prior to the start of casting has a concave shape in the width direction of the plate. This is caused by the change due to the elapsed time and the thermal expansion until the first casting drum11and the second casting drum12reach the steady state of casting from the start of casting. In the casting drum, an initial profile of the casting drum is set so that a plate profile (a crown) of the slab in the steady state of casting in which the thermal expansion is observed is a desired plate profile. That is to say, the initial profile of the casting drum is set to have a concave crown in which a drum diameter of a center portion of the casting drum in a width direction is smaller than drum diameters at both end portions of the casting drum. In the casting drum in which such a concave crown is provided, the screw-down position zero-point adjustment is performed by setting, to zero, a screw-down position (a pressing position) when a prescribed load F is applied to the pair of casting drums in contact with (kissing) each other. The initial value or the like of the screw-down position of the cylinder configured to press the casting drums can be set through this screw-down position zero-point adjustment. Incidentally, the concave crown is provided in each of the casting drums as described above. For this reason, when a prescribed load F is applied to the casting drums by bringing the casting drums into contact with (to kiss) each other, only both end portions of the casting drums come into contact with each other. For this reason, for example, as illustrated inFIG.8, when positions of the casting drums in the width direction do not fully match each other and a prescribed load F is applied to the casting drums, contact points between both end portions of the first casting drum11and both end portions of the second casting drum12are shifted and an amount of shift x is generated, resulting in an unstable state. For this reason, the accuracy of the screw-down position zero-point adjustment is reduced. In order to prevent this, at the time of the screw-down position zero-point adjustment in which the casting drums in which the concave crown is provided are utilized, as illustrated inFIG.9, the screw-down position zero-point adjustment in which a thin plate18is arranged between the casting drums is performed. InFIG.9, an intermediate point18C of a length of the thin plate18in the width direction is arranged on a straight line connecting an intermediate point11C of a length of the first casting drum11in the width direction to an intermediate point12C of a length of the second casting drum12in the width direction. Thus, a shift does not occur at both end portions of the casting drums. If a shift does not occur, a rotation axis Ar1of the first casting drum11is parallel to a rotation axis Ar2of the second casting drum12. Thus, it is possible to stably perform the screw-down position zero-point adjustment. However, even when the thin plate18is arranged between the casting drums to minimize a shift and the screw-down position zero-point adjustment is performed, as illustrated inFIG.10, the intermediate point18C of the length of the thin plate18in the width direction may not be arranged on the straight line connecting the intermediate point11C of the length of the first casting drum11in the width direction to the intermediate point12C of the length of the second casting drum12in the width direction and the thin plate18may arranged closer to either end portions of the casting drums in the width direction in some cases. In this case, as illustrated inFIG.10, the rotation axis Ar1of the first casting drum11is no longer parallel to the rotation axis Ar2of the second casting drum12. Thus, even if the screw-down position zero-point adjustment is performed, an error is included on the left sides and the right sides of the casting drums (both end portions of the first casting drum11and the second casting drum12in the width direction). If an error is included in the screw-down position zero-point adjustment, the screw-down position or the like of the casting drum during casting includes an error. Thus, accuracy is reduced when a plate thickness of the rolling mill30is estimated. Therefore, if the accuracy of the screw-down position zero-point adjustment can be improved, it is possible to further reduce meandering in the rolling mill30. Thus, as illustrated inFIG.7, the screw-down position zero-point adjustment is performed in a state in which a pair of side weirs are provided at the end portions of the casting drums in the width direction as in the acquisition of the casting drum housing screw-down system deformation characteristics are opened and the test plate16whose plate width is longer than the drum length of the casting drums and whose plate thickness is uniform is arranged between the casting drums. Thus, it is possible to perform the screw-down position zero-point adjustment with high precision. When the screw-down position zero-point adjustment is performed through such a method, the casting drum housing screw-down system deformation characteristics may be acquired in the screw-down position zero-point adjustment. 5. Modified Example An example of a modified example of the slab manufacturing method according to the embodiment will be described below with reference toFIG.11.FIG.11is a diagram illustrating the example of the modified example of the slab manufacturing method according to the embodiment. A slab manufacturing method in which a continuous casting facility1for a slab illustrated inFIG.11is utilized differs in that a control device200uses an actually-measured plate thickness acquired from a plate thickness gauge210at the time of calculating an exit-side wedge instead of the meandering meter110illustrated inFIG.1. InFIG.11, the plate thickness gauge210is installed downstream from a rolling mill30of the continuous casting facility1for a slab in a rolling direction. The plate thickness gauge210may be, for example, a thickness distribution meter capable of measuring a plate thickness of a slab S in a width direction. In this modified example, an exit-side plate thickness used for calculating an exit-side wedge ratio is an actually measured value of the plate thickness gauge210for a slab on an exit side of the rolling mill30. The control device200acquires actually measured values of plate thicknesses at both end portions of the slab S from the plate thickness gauge210and obtains an exit-side wedge ratio. The entry-side wedge ratio is obtained in the same manner as in the embodiment. The control device200further obtains a difference between the obtained entry-side wedge ratio and exit-side wedge ratio. The control device200adjusts a screw-down position of the rolling mill30so that the obtained difference is within a prescribed range. Thus, it is possible to control the rolling mill30with high precision by minimizing an error in a calculation process and calculating an exit-side wedge. The plate thickness gauge210may be installed at least downstream from the rolling mill30in the rolling direction. EXAMPLES In this example, in order to confirm the effects of the present disclosure, a slab was manufactured using the continuous casting facility1illustrated in the embodiment. Casting drums used in this example had a drum barrel length of 1000 mm. Values of a stationary part were used for a cylinder position, pressure, and a plate thickness in the rolling mill. Here, the stationary part means a place in which a change in screw-down position due to control of a screw-down position of left and right cylinders of the rolling mill decreases, which is performed on a material to be rolled so that a difference between the entry-side wedge ratio and the exit-side wedge ratio of the rolling mill decreases. In this example, an average value of each value in a time from after 1 minute 30 seconds had elapsed to after 1 minute 40 seconds had elapsed after the start of rolling was used. Various conditions and values in each example and comparative example and evaluation of plate-passability are summarized and written in Table 1 below. In the evaluation of plate-passability, a maximum amount of meandering of less 30 mm was evaluated as ◯ (good), less than 80 mm was evaluated as ∘ (pass), and 80 mm or more was evaluated as x (fail). In Example 1, as a method for adjusting a screw-down position zero-point of a casting drum, as illustrated inFIG.7, the screw-down position zero-point adjustment is performed in a state in which a pair of side weirs provided at end portions of the casting drums in a width direction are opened and a plate whose length is longer than a drum length of casting drums and whose plate thickness is uniform is arranged between the casting drums. In Table 1, this screw-down position zero-point adjustment method is written as A. A rolling mill was controlled by controlling a screw-down position of left and right cylinders of the rolling mill so that a difference between an entry-side wedge ratio and an exit-side wedge ratio of the rolling mill decreases. In Example 2, as a method for adjusting a screw-down position zero-point of a casting drum, the screw-down position zero-point adjustment was performed in a state in which a plate whose length is shorter than a drum barrel length of casting drums as illustrated inFIG.9is arranged between a pair of casting drums. In Table 1, this screw-down position zero-point adjustment method is written as B. A rolling mill is controlled by controlling a screw-down position of left and right cylinders of the rolling mill so that a difference between an entry-side wedge ratio and an exit-side wedge ratio of the rolling mill decreases. In Example 3, as a method for adjusting a screw-down position zero-point of a casting drum, the screw-down position zero-point adjustment was performed in a state in which a plate whose length is shorter than a drum barrel length of casting drums as illustrated inFIG.9is arranged between a pair of casting drums. In Table 1, this screw-down position zero-point adjustment method is written as B. A plate thickness gauge was installed on an exit side of the rolling mill. The rolling mill was controlled by controlling a screw-down position of left and right cylinders provided at both end portions of the rolling mill so that a difference between an entry-side wedge ratio and an exit-side wedge ratio is 0. In Comparative Example 1, as a method for adjusting a screw-down position zero-point of a casting drum, as in Example 2, the screw-down position zero-point adjustment was performed in a state in which a plate whose length is shorter than a drum barrel length of casting drums as illustrated inFIG.9is arranged between a pair of casting drums. In Table 1, this screw-down position zero-point adjustment method is written as B. The rolling mill was controlled by controlling a screw-down position of left and right cylinders of the rolling mill so that left and right screw-down forces are the same. In Comparative Example 2, as a method for adjusting a screw-down position zero-point of a casting drum, as in Example 2, the screw-down position zero-point adjustment was performed in a state in which a plate whose length is shorter than a drum barrel length of casting drums as illustrated inFIG.9was arranged between a pair of casting drums. In Table 1, this screw-down position zero-point adjustment method is written as B. The rolling mill was controlled by controlling a screw-down position of left and right cylinders of the rolling mill so that left and right screw-down positions of the rolling mill are the same. In the slabs relating to Examples 1 to 3 and Comparative Examples 1 and 2, with regard to actually measured plate thicknesses at a stationary part on an entry side of an rolling mill, a plate thickness at an end portion on a drive side DS was 1.760 mm, a plate thickness at an end portion on a work side WS was 1.820 mm, and a wedge (an amount of wedge) was −60 μm. Furthermore, a wedge ratio of an entry-side slab with respect to a plate thickness was −3.35%. The results of manufacturing a slab using each control method will be described below. In Example 1, the plate thickness at both end portions on the entry side of the rolling mill was estimated using the foregoing Expression 1 and the plate thickness at both end portions on the exit side of the rolling mill was estimated using the foregoing Expression 2. The rolling mill was controlled on the basis of these estimated plate thicknesses. In actually measured values of a slab on the exit side of the rolling mill, a plate thickness at the end portion on the drive side DS on the exit side of the rolling mill was 1.232 mm, a plate thickness at the end portion on the work side WS was 1.287 mm, and a wedge was −55 μm. Furthermore, a wedge ratio of the exit-side slab with respect to the plate thickness was −4.35%. Thus, a difference between the wedge ratios was 0.99%. A maximum amount of meandering in the rolling mill was about 20 mm and rolling could be performed from a distal end portion to a tail end portion of a slab S without any problem. In Example 2, the plate thickness at both end portions on the entry side of the rolling mill was estimated using the foregoing Expression 1 and the plate thickness at both end portions on the exit side of the rolling mill was estimated using the foregoing Expression 2. The rolling mill was performed on the basis of these estimated plate thicknesses. In actually measured values of a slab on the exit side of the rolling mill, a plate thickness at the end portion on the drive side DS on the exit side of the rolling mill was 1.243 mm, a plate thickness at the end portion on the work side WS was 1.259 mm, and a wedge was −17 μm. Furthermore, a wedge ratio of the exit-side slab with respect to the plate thickness was −1.35%. Thus, a difference between the wedge ratios was 2.00%. A maximum amount of meandering in the rolling mill was about 70 mm and rolling could be performed from a distal end portion to a tail end portion of a slab S without any problem. In Example 3, the plate thickness at both end portions on the entry side of the rolling mill was estimated using the foregoing Expression 1, the plate thickness at both end portions on the exit side of the rolling mill was actually measured using a plate thickness gauge, and the rolling mill was controlled on the basis of the estimated plate thicknesses and the actually measured plate thickness. In actually measured values of a slab on the exit side of the rolling mill, a plate thickness at the end portion on the drive side DS on the exit side of the rolling mill was 1.232 mm, a plate thickness at the end portion on the work side WS was 1.284 mm, and a wedge was −52 μm. Furthermore, a wedge ratio of the exit-side slab with respect to the plate thickness was −4.13%. Thus, a difference between the wedge ratios was 0.78%. A maximum amount of meandering in the rolling mill was about 15 mm and rolling was performed from a distal end portion to a tail end portion of a slab S without any problem. In Comparative Example 1, in actually measured values of a slab on the exit side of the rolling mill, a plate thickness at the end portion on the drive side DS on the exit side of the rolling mill was 1.285 mm, a plate thickness at the end portion on the work side WS was 1.238 mm, and a wedge was 47 μm. Furthermore, a wedge ratio of the exit-side slab with respect to the plate thickness was 3.74%. Thus, a difference between the wedge ratios was 7.09%. A maximum amount of meandering in the rolling mill was about 200 mm and narrowing occurred at a tail end portion of a slab S. In Comparative Example 2, in actually measured values of a slab on the exit side of the rolling mill, a plate thickness at the end portion on the drive side DS on the exit side of the rolling mill was 1.285 mm, a plate thickness at the end portion on the work side WS was 1.219 mm, and a wedge was 65 μm. Furthermore, a wedge ratio of the exit-side slab with respect to the plate thickness was 5.22%. Thus, a difference between the wedge ratios was 8.58%. A maximum amount of meandering in the rolling mill was about 250 mm and a slab came into contact with a side guide on the entry side of the rolling mill and was broken, resulting in breakage. From the above, when a slab is manufactured using the slab manufacturing facility as described above, it is possible to reduce meandering in the rolling mill and to reduce a plate passing trouble by estimating the plate thickness of the slab S using the casting drum housing screw-down system deformation characteristics acquired prior to the start of slab casting indicating the deformation characteristics of the housings configured to support the casting drums and the deformation characteristics of the screw-down system configured to screw down the casting drums and adjusting the screw-down position of the rolling mill so that the difference between the entry-side wedge ratio and the exit-side wedge ratio of the rolling mill is within a prescribed range. TABLE 1Actually measuredActually measuredplate thickness onplate thickness onZero-pointentry side of rollingEntry-sideEntry-sideexit side of rollingadjustmentRolling mill controlmillwedgewedge ratiomillmethodmethodDSWS[μm][%]DSExample 1AControl difference1.7601.820−60−3.351.232between entry-exit-side wedge ratios tohave constant valueExample 2BControl difference1.7601.820−60−3.351.243between entry-exit-side wedge ratios tohave constant valueExample 3BControl difference1.7601.820−60−3.351.232between entry-exit-side wedge ratios tohave constant valueComparativeBLeft and right1.7601.820−60−3.351.285Example 1screw-down forcesare sameComparativeBLeft and right1.7601.820−60−3.351.285Example 2screw-down forcesare sameActually measuredplate thickness onDifferenceexit side of rollingExit-sideExit-sidebetween wedgemillwedgewedge ratioratiosEvaluation ofWS[μm][%][%]plate-passabilityExample 11.287−55−4.350.99◯Example 21.259−17−1.352.00∘Example 31.284−52−4.130.78◯Comparative1.238473.747.09xExample 1Comparative1.219655.228.58xExample 2 Although the preferred embodiments of the present disclosure have been described in detail below with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that a person having ordinary knowledge in the field of technology to which the present disclosure belongs can come up with various modifications or modifications within the scope of the technical ideas described in the claims. In addition, it is naturally understood that these also belong to the technical scope of the present disclosure. INDUSTRIAL APPLICABILITY According to the present disclosure, since it is possible to further reduce meandering in a rolling mill and to reduce a plate passing trouble when a slab is manufactured in a continuous casting facility having a twin-drum type continuous casting device and a rolling mill, a high industrial applicability is provided. BRIEF DESCRIPTION OF THE REFERENCE SYMBOLS 10Continuous casting device11First casting drum12Second casting drum20First pinch roll30Rolling mill40Second pinch roll50Winding device100Control device110Meandering meter200Control device210Plate thickness gauge111,112Bearing box (or chock) | 61,879 |
11858020 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, a preferred embodiment of a process according to the invention for producing a metallic strip or sheet1is explained with reference toFIGS.1to7. It is noted that the drawing inFIG.4,FIG.6andFIG.7is merely simplified and in particular shown without scale. In the process according to the invention, a temperature calculation model is used with which a temperature that the produced metallic strip or sheet1possesses at an exit of a last roll stand of a rolling mill can be specifically calculated. Prior to explaining the temperature calculation model and its application in a system for the production or processing of a strip or sheet in more detail, general principles relating to the temperature calculation for a metallic strip or sheet are explained: The basis of the temperature calculation is Fourier's heat equation (1), in which cp represents the specific heat capacity of the system, λ the thermal conductivity, p the density and s the spatial coordinate. T indicates the calculated temperature. The term Q on the righthand side accounts for energies released during the phase transformation (equation 2). In the transition from liquid to solid, this term denotes the heat of fusion, fsindicates the degree of phase transformation. ρcp∂T∂t-∂∂s(λ∂T∂s)=Q(1)Q=ρL∂fs∂t(2) Among the necessary input variables of the equation, the thermal conductivity and the total enthalpy are particularly important since these quantities significantly influence the temperature result. The thermal conductivity is a function of temperature, chemical composition and phase fraction and can be accurately determined experimentally. The total enthalpy H or the molar enthalpy of a material portion or material section can be calculated using the Gibbs energy as follows (3): H=G-T(∂G∂T)p(3)with the molar Gibbs energy G of the system. For a phase mixture, the Gibbs energy of the total system can be calculated via the Gibbs energies of the pure phases as well as their phase fractions G=fiGi+fγGγ+fpαGpα+feαGeα+fecGec(4)with the phase fractions fφof the phase φ and Gφthe molar Gibbs energy of this phase. For the austenite, ferrite and liquid phase (φ), the Gibbs energy is given by Gϕ=Σi=1nxiϕGiϕ+RTΣi=1nxiln(xi+EGϕ+magnGϕ(5) EGϕ=ΣxixjaLi,jϕ(xi−xj)a+ΣxixjxkLi,j,kϕ(6) magnGϕ=RTln(1+β)f(τ) (7) In equation (4), the terms each correspond to a single-element energy, a contribution for the ideal mixture, as well as a contribution for the non-ideal mixture and the magnetic energy (equation 7). If the Gibbs energy of the system is known, the molar specific heat capacity can be calculated therefrom: cp=-T(∂2G∂T2)p(8) The parameters of the terms of equations (5)-(7) are listed in a Thermocalc and Matcalc database and can be used to determine the Gibbs energies of a steel composition. With the aid of a mathematical derivation, this yields the total enthalpy of this steel composition. FIG.1shows the representation of the Gibbs energy for pure iron. This shows that the individual phases ferrite, austenite and the liquid phase assume a minimum for a certain characteristic temperature range at which these phases are stable. FIG.2shows the phase boundaries of an Fe—C alloy with 0.02% Si, 0.310% Mn, 0.018% P, 0.007% S, 0.02% Cr, 0.02% Ni, 0.027% Al and variable C content. With the formulation of the Gibbs energy, it is possible to construct such a phase diagram with any chemical composition and show the stable phase fractions. FIG.3shows the Gibbs total enthalpy curve for a low carbon steel as a function of temperature. The solidus and liquidus temperatures are also shown in the figure. FIG.4shows a simplified schematic side view of a plant10set up for the application of the process according to the invention, with which a strip or sheet1is produced or processed in a conveying direction F. The plant10includes a multi-stand rolling mill11, which in the shown example has a first roll stand12, a center roll stand13and a last roll stand14. Located immediately downstream of the last roll stand14or at its exit A is a rapid cooling device16, followed by a further cooling in the form of a laminar cooling device18. At the end of the production line, a reel20is provided with which a finished strip1can be wound up. Between the first roll stand12and the center roll stand13, an unspecified intermediate stand cooling system is provided for the rolling mill11. In the illustration ofFIG.4, arrow “F” indicates a conveying direction (from left to right in the drawing plane) in which a strip or sheet1is moved in the plant10or passes through the rolling mill11with the mentioned roll stands12-14. The system10includes several temperature measuring devices to measure the temperature of the strip or sheet at various points. These temperature measuring devices include: a first pyrometer P1, arranged upstream of the first roll stand12as viewed in conveying direction F; a second pyrometer P2, which is arranged between the second roll stand13and the last roll stand14(and thus upstream of the last roll stand14as viewed in conveying direction F); a third pyrometer P3arranged between the rolling mill11and the laminar cooling device18, as viewed in the conveying direction F; and a fourth pyrometer P4arranged between the laminar cooling device18and the coiler20. With regard to the second pyrometer P2, which is arranged upstream of the last roll stand14as viewed in conveying direction F, it is separately emphasized that it is used to measure a temperature T2which the strip or sheet1possesses prior to entering the last roll stand14. Similarly, the temperatures measured by the pyrometers P1, P3and T4, are hereinafter respectively designated T1, T3and T4. The use of the rapid cooling device16results in the strip or sheet1being cooled between the second pyrometer P2(=T2) and the third pyrometer P3(=T3) at a cooling rate CR23. The same applies to the area between the third pyrometer P3(=T3) and the fourth pyrometer P4(=T4), in which the laminar cooling device18is used for cooling at a cooling rate CR34. The system10further includes a computing and control device, hereinafter briefly referred to as the control device, designated by “100” inFIG.4, and symbolized in simplified form by a rectangle. The control device100is equipped with the temperature calculation model. The temperature calculation model can have or be based on a DTR or DSC (Dynamic Temperature Control/Dynamic Solidification Control). The calculation is carried out using a finite difference method. The vertical arrows shown in the illustration ofFIG.4between the plant10and the rectangle for the control device100, symbolize the interactions between individual components of the plant10and the control device100. Specifically, the arrows pointing upwards in each case illustrate that the temperatures measured by the pyrometers P1-P4in each case are input into the control device100and processed therein in terms of signal technology. The arrows pointing downwards in each case symbolize that the associated components of the plant10can be controlled or regulated by the control device10—this relates to the intermediate stand cooling (between the first roll stand12and the central roll stand13), the last roll stand14, the rapid cooling device16and/or the laminar cooling device18, for example with regard to the supply of a coolant quantity to these components. Using the aforementioned temperature calculation model, a temperature TFM present for the strip or sheet1immediately at the exit A of the last roll stand14is computationally determined based on or starting from the temperature T2that was measured by the second pyrometer P2upstream of the last roll stand14, and input to the control device100as explained. This calculation is carried out according to the finite difference method for a system of the strip or sheet1formed by the material section of the strip or sheet1situated between the point at which the second pyrometer P2is arranged and the exit A of the last roll stand14. As explained above, in order to calculate this temperature profile or temperature TFM, the Fourier heat equation is solved. The boundary conditions in the rolling mill11(e.g., temperature output to air via radiation and convection as well as to the rolls of the last roll stand14) and in the cooling section (temperature output to water cooling, air and roller table) are taken into account. Also taken into account is the heat generated by phase transformation, which can occur either in the rolling mill11or in the cooling section. The various temperatures T1-T4which occur along the length of the plant10for a strip or sheet1produced with the plant are shown in the diagram ofFIG.5with a corresponding curve. The diagram also shows the calculated temperature TFM (at the exit A of the last roll stand14) and the cooling rates CR23and CR34explained above. Following computation of the temperature TFM, the computed temperature is then compared by the control device100with a predetermined reference value TFMref. Taking this comparison into account, a cooling water supply for the strip or sheet1is then suitably adjusted, i.e., controlled or regulated, by means of the control device100, if necessary. The control (or regulation) of the cooling water supply may have the purpose to make a temperature of the strip or sheet1at the exit A of the last roll stand14to correspond with the predetermined reference value TFMref, and/or to suitably adjust the further temperatures T3(for pyrometer P3) and/or T4(for pyrometer P4). FIG.6shows a further embodiment of the plant10which, compared with the embodiment ofFIG.4, additionally includes the components inductive heating26, furnace28and/or thermal insulation hood30. As can be seen, these components26,28,30are each arranged upstream of the rolling mill11, as viewed in the conveying direction F of the strip or sheet, with the strip or sheet1being able to be guided through these components. The arrows extending from the control device100towards these components26,28and30, illustrate that the inductive heater26, the furnace28and/or the thermal insulation hood30can be controlled or regulated by means of the control device100, namely, as explained above, as a function of the calculated temperature TFM and the comparison with the predetermined reference value TFMref made therewith. In this way, a temperature for the strip or sheet1is specifically influenced or increased. The thermal insulation hood30operates as a device that thermally insulates the strip or sheet1. Opening or closing the thermal insulation hood30allows influencing the degree of thermal insulation for the strip or sheet1on a roller table. By controlling the thermal insulation hood30with the control device100, the thermal insulation hood30is opened or closed accordingly, or also caused to assume an intermediate position, whereby the temperature for the strip or sheet1is influenced in dependence on the respective position of the thermal insulation hood3011. In the embodiment ofFIG.7, a preliminary strip cooling24is provided for the plant10upstream of the rolling mill11, viewed in the conveying direction F of the strip or sheet1, which preliminary strip cooling24can also be controlled or regulated by means of the control device100, as indicated by the arrow. Depending on the calculated temperature TFM and the comparison with predetermined reference value TFMref, a coolant quantity for this preliminary strip cooling24is then controlled or regulated in order to influence or reduce the temperature of the strip or sheet1in a targeted manner. In the illustrations ofFIGS.4,6and7, “22” symbolizes an intermediate stand cooling, which can also be controlled or regulated by means of the control device100, namely by adjusting the amount of coolant supplied and/or by the number of spray nozzles used. In another embodiment of the process according to the invention, it can be provided that in the control device100or for the temperature calculation model stored therein, corresponding reference values T1ref, T2ref, T3ref, T4ref are also specified for the temperatures T1, T2, T3and T4on the basis of a microstructure model to enable achieving optimum properties. Alternatively, the reference values would have to be determined on the basis of empirical values or measurement and production data. These could be models based on neural networks, the Kriging algorithm or the like. In the case of deviations of T2from T2ref, it can also be decided with the aid of the microstructure model that this deviation does not result in a quality degradation of the strip1to be produced. For this case, the measured value for the temperature T2then becomes the new target value for this strip, with new target values being calculated accordingly for T3and T4. In addition, the cooling rates CR23and/or CR34can be changed to achieve the same characteristics due to the changed temperature profile. The same applies to deviations of T3from T3ref or T4from T4ref. It is also possible to make this decision using a data-based empirical model based on the available measurement and production data. These can for example include models based on neural networks, the Kriging algorithm or the like. The temperature calculation can be carried out via the Gibbs energies and the enthalpy. In this respect, reference is made to the above explanations of equations (1)-(8). LIST OF REFERENCE SYMBOLS 1strip or sheet10plant11rolling mill12first roll stand (of rolling mill11)13middle roll stand (of rolling mill11)14last roll stand (of rolling mill11)16rapid cooling device18laminar cooling device20reel22inter-stand cooling24preliminary strip cooling26inductive heating28furnace30thermal insulation hood100computing and control deviceA exit (of the last roll stand14)F direction of conveyance (for the strip or sheet1)P1first pyrometerP2second pyrometerP3third pyrometerP4fourth pyrometerT1-T4temperatures of the strip or sheet1, at the measuring point of the pyrometer P1-P4 | 14,078 |
11858021 | DESCRIPTION OF THE EMBODIMENTS According toFIG.1, a rolling mill train has multiple roll stands1. Only the working rolls from the roll stands1are depicted inFIG.1. Normally, the roll stands1additionally have at least support rolls, and in some cases additionally further rolls beyond the support rolls. For example, there may be intermediate rolls arranged between the working rolls and the support rolls. A metal strip2is being rolled in the rolling mill train. Each of the roll stands1is controlled by a respective stand controller3a. The stand controllers3aare part of a respective control device3bfor the respective roll stand1. The control devices3bcan be coordinated by a higher-level coordination device3c, although this is not absolutely necessary. The roll stands1are arranged in succession in a rolling direction x. The roll stands1therefore carry the same section of the metal strip2one roll stand after the other. The metal strip2can be made from steel or aluminum, for example. The rolling can be hot rolling, for example, in particular in a multi-stand production line of a hot rolling mill. FIG.2shows a single roll stand1. A metal strip2is likewise being rolled in the roll stand ofFIG.2. The roll stand1can be one of the roll stands1of the rolling mill train ofFIG.1. Therefore, a further roll stand1of the rolling mill train is additionally shown inFIG.2. This further roll stand1is depicted only in broken lines, however, since only the roll stand1depicted in solid lines matters forFIG.2and the other Figures. Therefore, the explanations that follow relate to this roll stand1. Alternatively, a reversing stand may be involved, in which the metal strip2is rolled in reverse. In this case, the roll stand1may be the only roll stand in which the metal strip2is rolled. The roll stand1, just like the roll stands1ofFIG.1, is controlled by a control device3bwith a stand controller3a, whereby the control device3bis able to have a coordination device3con a higher level. Each control device3bis programmed with a control program4. This is shown inFIG.1andFIG.2only for one of the control devices3b. The control program4comprises machine code5that can be executed by the control device3b. The execution of the machine code5by the control device3bcauses the control device3bto control the roll stand1using a control method that is explained in more detail below. This first involves an explanation of a mode that also takes place in the prior art, and later a discussion of features according to the invention. The control device3breceives measurement data M from a capture device6inFIG.2. See also a step S1inFIG.3. The measurement data M are received while the metal strip2is being rolled in the roll stand1. The measurement data M are characteristic of a lateral position y of the metal strip2that exists on the exit side of the roll stand1according to the depiction inFIG.4. The control device3btherefore ascertains the lateral position y of the metal strip2from the measurement data M in a step S2. It takes the deviation in the lateral position y from a desired position y* as a basis for ascertaining a pivot value δs for the roll stand1in a step S3. As a starting point, the ascertainment involves the lateral position y of the metal strip2being brought closer to the desired position y*. The stand controller3aactuates the roll stand1according to the ascertained pivot value δs in a step S4. When ascertaining the pivot value δs, the stand controller3atakes account of not only the deviation in the lateral position y from a desired position y*, but additionally also at least one parameter P, and usually multiple parameters P. Parameters P are somewhat different than a variable. A variable is a quantity that changes in each cycle of the stand controller3a. Typical variables are the desired value y*, the actual value y and the manipulated quantity δs. Parameters P, on the other hand, are values that are normally prescribed for the stand controller3aonly once and then constantly retained throughout the control operation, that is over a multiplicity of cycles. In the case of a conventional PI controller, for example, the parameter P can be a proportional gain or an integration time constant. For a stand controller3a, as is used in the present case and known from the aforementioned EP 3 202 502 A1, for example, the parameters P can declare for example a maximum permissible value for the pivot value δs or a maximum value for the change in the pivot value δs from cycle to cycle of the stand controller3a. The maximum permissible value for the pivot value δs can be declared separately for the two pivot directions if necessary. To the extent explained above, the operation of the control device3bcorresponds to normal strip position control as is known generally and also as explained in detail in EP 3 202 502 A1, for example. This approach forms the basis for the present invention. This is because, according to the invention, in a step S5, the control device3bascertains at least one quantity V1, V2, Q1, Q2that reveals, for both strip edges7,8of the metal strip2(seeFIG.4), whether the metal strip2is forming a wave9(seeFIG.5) in the region of the respective strip edge7,8. In a step S6, the control device3buses the at least one quantity V1, V2, Q1, Q2to check whether and if necessary at which strip edge7,8the metal strip2is forming a wave9. If the check in step S6has a negative outcome, that is no wave9is detected, a step S7is skipped. If the check in step S6has a positive outcome, that is a wave9is detected, on the other hand, the control device3bmoves to step S7. In step S7, the control device3bvaries at least one of the parameters P of the stand controller3a. From this time onward, that is from the varying of the at least one parameter P onward, the stand controller3aascertains the pivot value δs in light of the varied parameter P. The control device3bvaries the parameter P such that the formation of the wave9is prevented or an extent h to which the wave9forms is limited to a predetermined degree. In particular, the control device3bcan vary the parameter P that declares the maximum permissible value for the pivot value δs. In particular, the absolute value of this value can be reduced from its currently valid value. The varying can alternatively be carried out for both pivot directions or just for the pivot direction that is responsible for the wave9that has arisen. In contrast to the approach of the prior art, wherein the wave is not automatically taken into account, the present invention therefore involves the pivot value δs being ascertained in light of the circumstance of whether the metal strip2is forming a wave9in the region of one of its strip edges7,8. The varied parameter P is retained by the control device3bas time goes by until a specific event occurs on the basis of which the value of the applicable parameter P is varied again. If the absolute value of the parameter P is reduced for both pivot directions, a specific event of this kind is that another wave9is detected at one of the strip edges7,8despite the variation of the parameter P that was just mentioned. If the absolute value of the parameter P is reduced for the respective pivot direction only, a specific event of this kind is that, despite the variation of the parameter P that was just mentioned, another wave9is detected at the same strip edge7, as previously. Other specific events are a change in the rolling process. In particular, according to the depiction inFIG.6, it is possible for the control device3bto check, in a step S11, whether the tensile state Z of the metal strip2has changed. The tensile state Z changes in particular when there is a transition from rolling the metal strip2under tension to rolling the metal strip2without tension or, vice versa, a transition from rolling the metal strip2without tension to rolling the metal strip2under tension. A change from rolling the metal strip2without tension to rolling the metal strip2under tension generally occurs in particular when a strip head11of the metal strip2enters a downstream device, for example is threaded into the downstream roll stand1in the case of a multi-stand rolling mill train. Conversely, a change from rolling the metal strip2under tension to rolling the metal strip2without tension occurs when a strip tail of the metal strip exits an upstream device, for example is threaded out of the upstream roll stand of a multi-stand rolling mill train. Alternatively or additionally, the control device3bcan check, in a step S12, whether the metal strip2has been completely rolled in the roll stand1. In this case, the parameters P can be declared again in a step S13. It is possible to always declare the parameters P to have the same values. Preferably, the procedure fromFIG.6is complemented by steps S21to S24in accordance with the depiction fromFIG.7, however. Step S21is performed when the control device3bvaries the at least one parameter P. In this case, the control device3bsupplies the varied parameter P to a database DB (seeFIG.2) in association with data D that are characteristic of the rolled metal strip2. This allows the control device3b, prior to rolling a respective metal strip2, to use characteristic data D for the new metal strip2to be rolled to check in step S22whether parameters P are already stored in the database DB for such a metal strip2or a metal strip2having sufficiently similar characteristic data D. If such parameters P are stored, the control device3bcan retrieve these parameters P from the database DB as initial values in step S23. Otherwise, the control device3bcan calculate standard values for the parameters P in step S24. The measurement data M can be determined as required. The capture device6is also designed accordingly. Preferably, the capture device6is in the form of a single camera7or, as seen inFIG.4, in the form of a group of cameras10. In this case, the measurement data M are images B or groups of images B. It is possible for the groups of images B to each comprise just a single image B. In this case, the respective image B is referenced to a respective capture time. As already mentioned, the capture device6may also be in the form of a group of cameras10, however. In this case, the cameras10each capture a separate image B. In this case, the individual cameras10each capture their respective image B at a consistent capture time. In this case, the images B of the respective group are thus referenced to a respective consistent capture time. Preferably, the control device3bdoes not just use the groups of images B in step S2, that is when ascertaining the lateral position y of the metal strip2. Instead, the control device3bpreferably also uses the groups of images B in step S5to ascertain the at least one quantity V1, V2, Q1, Q2that reveals, for both strip edges7,8of the metal strip2, whether the metal strip2is forming a wave9in the region of the respective strip edge7,8. As already mentioned, the groups of images B can each comprise more than one image B. For example, in accordance with the depiction inFIG.4, there may be multiple cameras10present that each capture a separate image B. In this case, the control device3bcan preprocess the images B captured at a consistent capture time so that it ascertains the three-dimensional surface of the metal strip2. In this case, the control device3buses the ascertained three-dimensional surface of the metal strip2in step S5. Similarly, there is also the possibility that, although only a single image B is captured per group of images B, the single image B already contains the required three-dimensional information. In this case, the applicable image B is a so-called depth image. In this case too, the control device3buses the three-dimensional surface of the metal strip2in step S5. To implement step S5, that is to ascertain the at least one quantity V1, V2, Q1, Q2that reveals, for both strip edges7,8of the metal strip2, whether the metal strip2is forming a wave9in the region of the respective strip edge7,8, the control device3bcan, in a step S31, while evaluating the respective group of images B for one strip edge7,8of the metal strip2, ascertain an extent of a wave9, to which the metal strip2forms the wave9in the region of the strip edge7,8, in accordance with the depiction inFIG.8. For example, the control device3bcan ascertain the height h of the wave9. To ascertain the extent of the wave9, the control device3bexecutes an algorithm in the broader sense. For example, the control device3bcan be programmed with a learning algorithm, machine learning algorithm, wherein a multiplicity of groups of images B are prescribed for the learning algorithm in a learning phase in advance, that is before performance of the control method fromFIG.3, and, in addition to the respective group of images B, the associated extent, for example the height h of the wave9, is also communicated, as a result of which the control device3bwas able to “learn” the correct evaluation. As an alternative to the extent, a piece of Boolean information derived from the extent can also be supplied to the control device3b. During later operation, during performance of the control method fromFIG.3, only the respective group of images B is then prescribed for the learning algorithm, and the control device3buses the learning algorithm to determine the associated extent or the Boolean information derived therefrom. Alternatively or additionally, a different piece of information can be supplied to the control device3as part of the learning process, for example control interventions by operators during the rolling of the metal strip2. An example of a suitable learning algorithm is a neural network, in particular a DNN=deep neural network. The design and manner of training of a neural network of this kind are explained for example in the technical paper by Zhong-Qiu Zhao mentioned at the outset. In a step S32, the control device3bchecks whether the ascertained extent exceeds a predetermined threshold value SW. If this is the case, the control device3bsets a Boolean variable V1to the value TRUE in a step S33. Otherwise, the control device3bsets the Boolean variable V1to the value FALSE in a step S34. In steps S35to S38, the control device3bascertains the value of a Boolean variable V2for the other strip edge8in a totally analogous manner. In the procedure according toFIG.8, the Boolean variables V1, V2are thus the at least one quantity that reveals whether the metal strip2is forming a wave9in the region of the respective strip edge7,8. Instead of the two Boolean variables V1, V2, it would naturally also be possible to use one variable having at least three values. By way of example, the value +1 could be used for a wave9at one strip edge7, the value −1 could be used for a wave9at the other strip edge8and the value 0 could be used for no wave9. The procedure fromFIG.9is similar to the procedure fromFIG.8. Steps S32to S34and S36to S38can be dispensed with, however. Instead, steps S41and S42are present. In step S41, the control device3bascertains a quantified value Q1for the extent ascertained in step S31. In the simplest case, the control device3baccepts the extent ascertained in step S31in step S41. Preferably, however, the control device3buses the extent ascertained in step S31as quantified value Q1to ascertain the associated I unit of the metal strip2in the region of the strip edge7,8in step S41. In an analogous manner, the control device3bascertains a quantified value Q2for the extent ascertained in step S35in step S42. In the case of the configuration according toFIG.9, the quantified values Q1, Q2thus represent the at least one quantity that reveals whether the metal strip2is forming a wave9in the region of the respective strip edge7,8. Instead of the two quantified values Q1, Q2, it would naturally also be possible to use a consistent variable that indicates the height h of the wave9at one strip edge7in the case of a positive value and the height h of the wave9at the other strip edge8in the case of a negative value, for example. In accordance with the depiction inFIG.4, the images B show the metal strip2on the exit side of the roll stand1in a relaxed state. This is the case anyway if the roll stand1is configured as a pure reversing stand. If the roll stand1is configured as part of the multi-stand rolling mill train fromFIG.1, the situation arises for the time range in which although the strip head11of the metal strip2has already passed through the roll stand1, it has not yet reached the further roll stand1shown in in broken lines. For example, if the roll stand1has coil boxes or similar devices arranged upstream and downstream of it, this applies in each case up to the time at which the strip head11reaches the respective coil box. Similar statements apply to the strip tail. At a reversing stand, the metal strip2is rolled in reverse. The exit side of the roll stand1therefore changes with each rolling pass. For a reversing stand, the term “exit side” is therefore not static, but rather dynamic with reference to the respective rolling pass. The same applies to the term “entry side”. The present invention has been explained above in conjunction with a capture of the lateral position y on the exit side of the roll stand1. This is the norm for the present invention. Alternatively or additionally, however, it is likewise possible to carry out the procedure for the entry side of the roll stand1. The present invention has many advantages. In particular, the approach according to the invention allows detection and correction of not only a fault in the strip path but also a fault when a wave9is produced. The detection of waves9as such in the captured images B can be implemented without any difficulty. The approach according to the invention can be used in particular for automated optimization of the operation when the metal strip2is threaded into a downstream roll stand1or in general when the metal strip2enters a downstream device. Additionally, the requisite hardware for capturing and using the images B is usually present anyway, which means that only the costs for the associated software are incurred. Although the invention has been illustrated and described more thoroughly in detail by the preferred exemplary embodiment, the invention is not restricted by the disclosed examples, and other variants can be derived therefrom by a person skilled in the art without departing from the scope of protection of the invention. LIST OF REFERENCE SIGNS 1Roll stand2Metal strip3Control device3aStand controller3bAutomation device4Control program5Machine code6Capture device7,8Strip edges9Waves10Cameras11Strip headB ImagesD DataDB Databaseh HeightM Measurement dataP ParameterQ1, Q2Quantified valuesS1to S42StepsSW Threshold valueV1, V2Boolean variablex Rolling directiony Lateral directiony* Desired positionZ Tensile stateδs Pivot value | 19,005 |
11858022 | DETAILED DESCRIPTION The subject matter of embodiments of the present invention is described here with specificity to meet statutory requirements, but this description is not necessarily intended to limit the scope of the claims. The claimed subject matter may be embodied in other ways, may include different elements or steps, and may be used in conjunction with other existing or future technologies. This description should not be interpreted as implying any particular order or arrangement among or between various steps or elements except when the order of individual steps or arrangement of elements is explicitly described. As used herein, thickness generally refers to a point measurement of the thickness of a metal strip taken perpendicular to the face of the strip, often, but not necessarily, at the centerline of the metal strip. Thickness profile or profile generally refers to the aggregation of thickness measurements taken across a particular cross section of the metal strip perpendicular to the rolling direction. The thickness profile may be directly measured by continuous measurements of the thickness across the face of the metal strip, such as with a traversing or oscillating thickness sensor, or by measuring the thickness at multiple locations across a particular cross section of the strip and approximating the profile with a mathematical model. The thickness profile may be approximated by a second or higher order polynomial, though other mathematical models may also be used. Thickness and/or thickness profile may be expressed in units of length, generally mils, millimeters, or microns. Crown and wedge are parameters of the measured thickness profile. Crown generally describes the difference in thickness between the centerline of the metal strip and the average of the two edge thicknesses. Wedge generally refers to the thickness difference between the two strip edges of the metal strip. Crown and wedge are generally expressed as a percentage of the polynomial centerline thickness. Generally, flatness is a measure of the buckling of the metal strip when it is not under tension due to unequal elongation at different points across the metal strip as it is passed through the rollers and experiences a reduction in thickness. Roll camber generally refers to the shape and/or deviation from perfectly cylindrical rolls in a rolling mill. Camber may describe the shape of a work roll that directly contacts the metal strip, or any of the other rolls that are present in the rolling mill and is generally expressed in units of length. Throughout this specification, references to the properties, parameters, or the like of the metal strip may include, but are not limited to, thickness, thickness profile, flatness, temperature, electrical conductivity, width, position, angles in the rolling direction, angles in the lateral direction, total tension outside the roll gap, and/or differential tension outside the roll gap. These properties and parameters may be measured by a variety of sensors, including, in certain cases, one or more of the metal strip property and position sensors described below. The rolling mill and/or any individual rolling mill stands may also include one or more profile actuators and/or mill control mechanisms. For example, a rolling mill or rolling stand may include profile actuators such as bending jacks and/or other mechanisms to apply a bending force to the work and/or backup rolls, thermal crown actuators, which may include roll heating and/or roll cooling via hot or cold sprays, induction heaters or any other thermal management mechanism, continuous variable crown (CVC) intermediate and/or work rolls, deformable backup rolls, roll tilting, and/or roll pair crossing. In some cases, a rolling mill and/or rolling stand may also have one or more setup or production parameters that may be taken into account during rolling, startup, shut down, transient behavior, and may be measured through the use of one or more sensors, such as the metal strip property and position sensors described below or by dedicated sensors used for a particular purpose. These setup or production parameters may include, but are not limited to, thickness reduction, work roll position, differential rolling load, rolling speed, speed differences between individual stands of the rolling mill, roll torque, and/or differential strip cooling. A rolling mill and/or individual rolling stands, as described throughout this specification, may have any number of additional sensors to monitor the rolling mill and/or rolling stand processing conditions. In some cases, sensors in the rolling mill and/or individual rolling stands may monitor rolling load, bending forces, roll and metal strip speed, roll torque and/or work roll position. Furthermore, sensors may monitor the roll camber of the work and/or backup rolls with ultrasonic, infrared, touch and/or other suitable sensors. In certain cases, a rolling mill and/or individual rolling stand may also include infrared, ultrasonic, touch, laser and/or other suitable sensors for directly measuring the roll gap geometry. Further, the roll gap geometry can also be determined indirectly by calculating it based on roll camber measurements, and/or the change of thickness profile and flatness between the incoming and outgoing strip together with other rolling parameters such as, but not limited to, rolling load, bending forces, strip tensions and metal sheet properties. Any of the above mentioned sensors, parameters and/or operating conditions may be used in the control systems and methods described throughout this specification. One or more of these sensors, parameters and/or operating conditions can be monitored and/or adjusted to maintain or change the roll gap geometry of one or more rolling stands of a rolling mill to produce rolled metal sheet or plate with properties or parameters that are within a desired range or tolerance. Certain aspects and features of the present disclosure relate to the use of interstand metal strip property and position sensors in multi-stand hot rolling mills to process aluminum sheet or plate. The use of metal strip property and position sensors to measure the strip thickness profile between individual stands of a hot rolling mill offers advantages and opportunities for enhanced control methods, improved efficiency, and higher product quality than is available with traditional control systems that only incorporate sensors before and after the first and final rolling mill stands, respectively. Interstand measurement of the thickness profile and/or other properties or parameters of the metal sheet or plate, often referred to as the strip, along with measurement of roll thermal camber, roll gap geometry and/or monitoring of other rolling mill process parameters, provides information about the current operating conditions of the hot rolling mill and allows an operator or control system to compensate for constant or dynamic variances or irregularities. Interstand measurements of the metal strip thickness profile and/or other properties or parameters such as roll thermal camber and roll gap geometry and/or mill process parameter measurements may be used to more accurately control the rolling mill, to determine which rolling stand may be causing excessive variance, and to replace or support setup tables and mathematical models with direct measurement and feedback loop and/or other, more advanced controls. Improved control over the rolling mill and individual rolling stands allows for production of higher quality products and reduced waste because the rolling mill and rolling stands may react faster to out of specification sheet to minimize the amount of unacceptable product and/or adjust subsequent rolling stands to compensate with no or reduced loss of material. Improved measurement of rolling mill conditions may also be used to improve adjacent processes by feeding information from the hot rolling mill to, for example, a reversing mill. FIG.1is a schematic side view of a multi-stand hot rolling mill100that incorporates a number of sensors to monitor rolling mill100operating conditions and control mechanisms to adjust rolling mill100parameters to compensate for changing process conditions and maintain acceptable product quality specifications. The rolling mill100comprises a first rolling stand102, a second rolling stand104, a third rolling stand106, and a fourth rolling stand108. However, the rolling mill100may incorporate as few or as many rolling stands as is necessary for the particular material, final product specifications, and/or processing plant spacing and production considerations. Each rolling stand102,104,106,108includes an upper backup roll110that provides support to an upper work roll112. Similarly, each rolling stand102,104,106,108also includes a lower backup roll114to provide support to a lower work roll116. In some cases, additional or no backup rolls are used. A metal strip136passes between the upper and lower work rolls112,116of the rolling stands102,104,106,108from left to right inFIG.1. The rolling mill100also incorporates a number of sensors to provide information regarding the operating conditions of the rolling mill100and the condition of the metal strip136as it enters, passes through, and exits the rolling mill100. In certain cases, sensors may be used to directly measure the operating conditions of the rolling mill100and its individual rolling stands102,104,106,108and work rolls112,116. As shown inFIG.1, work roll camber measurement sensors118may be used to determine the amount of camber or distortion in the upper work rolls112. In some cases, the work roll camber measurement sensors118, which may be ultrasonic sensors, infrared sensors, laser based roll gap geometry sensors, touch sensors, or any type of sensor that is suitable to determine the thermal camber of the work rolls, may be used on the upper work rolls112, lower work rolls116, both upper and lower work rolls112,116, or any combination or subset thereof. However, in many applications, measurement of the thermal camber of only the upper work rolls112or lower work rolls116may be sufficient to determine the operating conditions and roll gap geometry for that particular rolling stand102,104,106,108. Additional sensors to measure rolling mill100operating conditions may include, but are not limited to, work roll temperature sensors, work roll contact pressure sensors, or any other sensor that is necessary for the particular application or rolling mill100design or apparatus. The rolling mill100and any associated control system may also include sensors to directly measure metal strip136properties or conditions. For example, an entrance temperature sensor126may be used to measure the temperature of the metal strip136prior to its entrance into the first rolling stand102. An exit temperature sensor128may also be used to measure the temperature of the metal strip136as it exits the final rolling stand108of the rolling mill100. In certain cases, it may be possible to measure the temperature of the metal strip136between rolling stands102,104,106,108based on the change in conductivity when the temperature and conductivity of the metal strip136are known prior to entering the first rolling stand102. In some cases, the temperature of the metal strip136may be measured at multiple points, or by a scanning and/or oscillating sensor, to provide a temperature profile across the metal strip136and compensate for differential expansion due to temperature gradients caused by varying levels of force, reductions in thickness, or other variations in the metal rolling process. The rolling mill100may also include sensors to determine the centerline thickness and thickness profile of the metal strip136and calculate the corresponding crown and/or wedge values for the metal strip136as it enters the rolling mill100, during processing, and as it exits the final rolling stand108. For example, one or more incoming metal strip property and position sensors132may be positioned to measure the thickness, thickness profile, conductivity and/or any other properties or parameters of the metal strip136before it enters the first rolling stand102. Similarly, one or more exit metal strip property and position sensors134may be positioned to measure the thickness, thickness profile and/or any other properties or parameters of the metal strip136as it exits the final rolling stand108. A flatness roll130may be positioned after the final rolling stand108to measure the consistency of the tension stresses across the width of the metal strip136to determine the tendency for strip buckling that is present in the metal strip136after passing through the rolling mill100. In certain cases, a flatness roll130may be positioned between the last and second-to-last stands, here the third rolling stand106and fourth rolling stand108, to measure the tension stresses across the width of the metal strip136to indicate any variations or discrepancies in the work roll112,116gap geometry as the metal strip136passes through the rolling mill100. In certain cases, any tendency for buckling may be measured using one or more of the incoming metal strip property and position sensors132, exit metal strip property and position sensors134, and/or interstand metal strip property and position sensors138to measure the strip angles in the rolling and lateral directions. In addition, one or more interstand metal strip property and position sensors138may also be positioned between the first rolling stand102and the second rolling stand104. The one or more interstand metal strip property and position sensors138provide information to a control system and/or operator regarding the thickness profile and/or any other properties or parameters of the metal strip136as it exits the first rolling stand102and before it enters the second rolling stand104. In some cases, the one or more interstand metal strip property and position sensors138may be positioned between other rolling stands102,104,106,108or additional interstand metal strip property and position sensors138may be added between subsequent rolling stands104,106,108to provide more information on the processing of the metal strip136as it passes between individual rolling stands102,104,106,108. This information provides much faster feedback to the control system and/or operator regarding the performance of the rolling mill100and the conditions of the metal strip136, including any deformities, abnormalities, and/or dimensions that are not within desired tolerances or specifications. As a result, the operator and/or control system may adjust one or more of any available rolling mill control mechanisms of the first rolling stand102and/or any subsequent rolling stand104,106,108to compensate for metal strip136thickness profile, crown, wedge, thickness tolerance, flatness and/or other irregularities while the metal strip136is being processed in the rolling mill100so that the metal strip136will exit the rolling mill100with an acceptable thickness profile and/or levels of wedge, crown, flatness, thickness variation, or any other desired characteristics or metrics for the metal strip136. The reduced delay between processing and measurement gives more accurate, real-time or nearly real-time control over the rolling mill100and its individual rolling stands102,104,106,108. Direct measurement of the metal strip136with one or more interstand metal strip property and position sensors138and/or direct measurement of work roll112,116thermal camber reduces or eliminates the need for mathematical or computer modeling or use of setup tables of the rolling mill100, either during steady state, acceleration, deceleration, or startup procedures. Rather, control of the rolling mill100in any steady state or transitional condition may be achieved with feedback or other, more advanced controls in combination with real time information from one or more of the incoming metal strip property and position sensors132, exit metal strip property and position sensors134, interstand metal strip property and position sensors138, work roll camber measurement sensors118, and/or any other sensors for determining the status of the metal strip136, rolling mill100, or any individual rolling stand102,104,106,108. Due to the reduced delay in measuring metal strip136properties and improved methods of control, the rolling mill100may provide improved product quality and higher efficiency because a greater portion of the metal strip136will achieve acceptable product tolerances and specifications. Still referring toFIG.1, the rolling mill100may also include a number of control mechanisms designed to alter or adjust the operating conditions of the rolling mill100and/or any individual rolling stands102,104,106,108. The rolling mill100may include work roll112,116thermal crown control via mechanisms such as upper sprays120and/or lower sprays122to apply heated or cooled liquid to the upper and lower work rolls112,116, respectively. If desired, forces may be applied to distort or bend the upper and/or lower work roll112,116during processing of the metal strip136by jacking the work rolls (through the bending system) or tilting the stack (through the roll tilt system), or other suitable mechanisms. Additional or alternative control mechanisms may also be employed by a rolling mill100including, but not limited to, induction heaters, differential strip cooling, deformable backup and/or work rolls, and/or continuous variable crown (CVC) intermediate and/or work rolls. The control mechanisms may be integrated with the control system, or may work directly with the one or more interstand strip property and position sensors138and other associated sensors described above to adjust the rolling mill100so as to process the metal strip136within the desired tolerances or specifications. For the thickness range of a metal strip136in a multi-stand hot rolling mill100, the amount of crown change available for any particular rolling stand102,104,106,108without affecting the flatness of the metal strip136may be limited. To maintain control of the metal strip136as it passes through the rolling mill100, and to facilitate subsequent coiling of the metal strip136, a thickness profile with a small positive crown (i.e. a thicker center) may be preferred. For aluminum, this crown is generally in the range of 0.1-0.9%, preferably 0.3-0.9%, or more preferably 0.3-0.5% or 0.5-0.9% of the metal strip136thickness and is parabolic in shape. The above-mentioned control mechanisms for the rolling mill100may be used to alter the roll gap geometry and/or the relative spacing between the work rolls112,116through which the metal passes. To reduce crown, the roll gap between the work rolls112,116is reduced in the center relative to the edges. Similarly, to increase the crown, the roll gap between the work rolls112,116is increased in the center relative to the edges. Changes to the roll gap between the work rolls112,116will cause the material of the metal strip136to flow in two directions, changing the thickness profile, crown, and wedge of the metal strip136. The material of the metal strip136will flow in a lateral direction between the center and edges of the metal strip136. The material of the metal strip136will also flow in a longitudinal direction causing a change in the elongation of the metal strip136in the rolling direction relative to other points across the strip, resulting in a change to the flatness of the metal strip136. At relatively high thicknesses, the difference between the roll gap geometry and metal strip136thickness profile is generally taken up by lateral flow rather than longitudinal flow, resulting in changes to the crown of the metal strip136as opposed to flatness. As the metal strip136becomes thinner, for the same relative discrepancy between the thickness profile of the metal strip136and the roll gap geometry, the differential elongation of the metal strip136increases relative to the lateral flow, causing changes in the flatness of the metal strip136rather than changes in the crown. For these reasons, it may be advantageous to correct the thickness profile of the metal strip136in the first rolling stand102and control the roll gap geometry of the subsequent rolling stands104,106,108, which are under load when the metal strip136is in the rolling mill100, to match the thickness profile of the metal strip136such that the relative thickness reduction is the same across the width of the metal strip136to avoid changing the crown or flatness of the metal strip136. With measurement of the thermal camber of the work rolls112,116and/or backup rolls110,114and data on the rolling load, it is straightforward to calculate the resulting changes in roll gap and geometry due to roll deflection and flattening under load. The control mechanisms of the rolling mill100may then be used to achieve the desired roll gap and roll gap geometry. The objectives of controlling and maintaining a target thickness profile may be achieved using two types of control loops: a fast loop at one or more rolling stands102,104,106,108that changes roll gap geometry control mechanisms while the mill is under load and the metal strip136is rolled, and a slow loop that acts continuously to control longer term changes in the thickness profile, crown, and/or wedge between rolling metal strips136and while the metal strip136is rolled. The fast loop controls the measured thickness profile and flatness of the metal strip136at the exit of one or more rolling stands102,104,106,108to within an acceptable tolerance of a target thickness profile and flatness, and reduce thickness profile variation in the metal strip136resulting from material variation and/or transient effects due to acceleration of the rolling mill100or other transient behavior. The slower loop adjusts the thermal camber of the work rolls112,116and other control mechanisms of one or more of the rolling stands102,104,106,108such that the available range of bending force124may be optimized for the fast control loops. The resulting performance of the rolling mill100may then minimize any errors in the thickness profile and flatness of the metal strip136. Because the transfer functions for the control mechanisms of the rolling mill100are well-known, and the thermal camber of the rolls112,116is controlled, these control mechanisms may be adjusted under load to match roll gap geometry of any downstream rolling stands to the measured thickness profile of the metal strip136leaving any upstream rolling stand, such that changes in thickness profile and flatness are minimized. Since the thickness profile of the metal strip136may match the roll gap geometry of any particular rolling stand102,104,106,108, each point across the metal strip136may have the same relative reduction in thickness, such that there is no change in the relative thickness profile of the metal strip136. In this way, the desired thickness profile, crown and/or wedge that is achieved after the first rolling stand102is maintained through subsequent rolling stands104,106,108. The result is relatively little differential deformation across the metal strip136and relatively minimal differential elongation and change in flatness. To ensure that the flatness targets are met, a flatness roll130, or any other flatness measurement sensing device, such as the use of one or more of the metal strip property and position sensors132,134,138measuring the position and angles of the metal strip136in the rolling and lateral directions, may be added after the last rolling stand108or any of the other rolling stands102,104,106so that flatness errors may be fed back to the control system to adjust work roll112,116heating, cooling, bending, roll tilting, and/or any other control mechanisms available to the rolling mill100that may influence the roll gap geometry of the rolling stands102,104,106,108. The feedback from the one or more interstand strip property and position sensors138at the exit of a rolling stand102,104,106is used to adjust any available control mechanisms in each subsequent rolling stand104,106,108using the fast control loop. In the case of a coil or product change, the slow control loop may adjust the work roll112,116thermal camber and/or any other control mechanisms of the rolling mill100or any individual rolling stand102,104,106,108such that unwanted distortions of the desired thickness profile and flatness of the metal strip136are minimized during the transition phase. FIG.2is a simplified schematic end view of the exit side of a hot rolling mill stand with multiple work roll camber measurement sensors203and multiple interstand metal strip property and position sensors210,212,214. The rolling mill stand includes an upper work roll202and a lower work roll204. The upper and lower work rolls202,204may have a bending force206applied by a bending or jacking system (not shown) and/or a roll tilting system (not shown) that may, in combination with any work roll camber, influence the roll gap geometry between the upper and lower work rolls202,204. A metal strip208passes through the upper and lower work rolls202,204in the direction of the viewer during processing. At the exit of the rolling mill stand, a central interstand metal strip property and position sensor210, right interstand metal strip property and position sensor212, and left interstand metal strip property and position sensor214are positioned to read the centerline thickness, thickness profile, flatness and/or any other property or parameter of the metal strip208after it has passed through the upper and lower work rolls202,204and before it enters a subsequent stand for further rolling. As shown, the rolling mill may include, before or after any individual stand, any suitable number of interstand metal strip property and position sensors, such as multiple interstand metal strip property and position sensors210,212,214, to measure at different points, zones or areas across the face of the metal strip208. In certain cases, a single interstand metal strip property and position sensor that quickly scans the face of the metal strip208or one or more oscillating interstand metal strip property and position sensors that may be capable of measuring different points along the face of the metal strip208may be used. In some cases, the interstand metal strip property and position sensors210,212,214may be single-sided sensors, double-sided sensors, or any combination thereof. Furthermore, the interstand metal strip property and position sensors210,212,214may be any type of sensor including, but not limited to, induction sensors, eddy current sensors, x-ray sensors, or any other type of sensor that is capable of measuring the thickness, thickness profile, conductivity, strip angles, temperature and/or any other desirable parameter or property of the metal strip208. The type of interstand strip property and position sensor chosen for a particular application may be based on an evaluation of factors such as the type of metal being measured, the throughput speed of the metal strip208, the temperature of the metal strip208or environment surrounding the metal strip208, any cooling or heating fluids, or any other environmental considerations. The interstand metal strip property and position sensors210,212,214should be selected to provide accurate results and survivability in the conditions of the application. Still referring toFIG.2, the metal strip208includes a centerline thickness216, right thickness218, and a left thickness220. The measurements taken by the central strip property and position sensor210, the right strip property and position sensor212and the left strip property and position sensor214indicate the thickness of the metal strip208at particular points along the cross section or face of the metal strip208. In some cases, a greater or lesser number of thickness measurements may be taken across the width of the metal strip208. Furthermore, multiple thickness measurements across the width of the metal strip208may not be evenly distributed and can be located at any position across the face of the metal strip208. Said differently and by way of example, in certain cases a relatively large number of thickness measurements may be clustered in an area that is particularly problematic or critical to the performance of the metal strip208, while other areas may include relatively fewer thickness measurements. As another non-limiting example, in some cases, the right strip property and position sensor212and the left strip property and position sensor214can be located at various distances from edges of the metal strip208such that the sensors212,214measure the metal strip208at a distance from the edges of the metal strip208, respectively. In other examples, several rows of sensors may be provided across the width. For example, in some cases, one sensor row may be at the exit of the first stand, another sensor row may be a predetermined distance away from the first stand, and yet another sensor row may be at the entry of the second stand. Various other configurations of sensors may be used. As the metal strip208passes through the rolling stands of the mill, the interstand metal strip property and position sensors210,212,214will measure, among other properties of the metal strip208, the thicknesses216,218,220. Because the interstand metal strip property and position sensors210,212,214are positioned relative to the face of the metal strip208and the metal strip208moves past them, multiple measurements by the interstand metal strip property and position sensors210,212,214may be compiled to provide a three-dimensional thickness profile and flatness function that describes the thickness profile and flatness variations for a length of the metal strip208, and that may be used, among other things, to control the three-dimensional flatness and thickness profile of the metal strip208and/or to continuously adjust the rolling stands of the mill to correct or compensate for any portions of the metal strip208that do not have acceptable flatness, thickness profile, or other strip properties as it passes through the rolling mill. For example, if a first portion of the metal strip208has a different profile than a second, later portion, the rolling mill and any associated control system may use the different thickness profile measurements along the length of the metal strip208to alter subsequent rolling stands to account for these differences as the metal strip208progresses through the rolling mill. The thickness measurements216,218,220may also be used to calculate other properties of the metal strip208as it passes through the rolling mill. As shown inFIG.2, the metal strip208may deviate from an ideal rectangular profile with differing thickness measurements216,218,220across its width (deviations enlarged to show detail). The thickness measurements216,218,220taken by the interstand metal strip property and position sensors210,212,214may be used to calculate the curvature or crown of the metal strip208by determining the differences across the face of the metal strip208relative to the centerline thickness216. Also, the difference in the right thickness218and left thickness220may be used to calculate any wedge or sloped profile of the metal strip208during processing. These values may then be compared to desired or acceptable ranges for thickness profile, crown and/or wedge to determine whether adjustments to the rolling mill or individual rolling stands are necessary. Should adjustment be necessary, any of the above described control mechanisms ofFIG.1may be used to control the thickness profile, centerline thickness, flatness and/or any other properties or parameters of the metal strip208. Similarly, any of the above mentioned sensors ofFIG.1may be incorporated into the control system to provide further information on which control mechanisms require adjustment and/or the extent of those adjustments. The multiple interstand strip property and position sensors210,212,214may also be used to determine the relative location and contour of the metal strip208as it passes through the work rolls202,204. For example, the strip property and position sensors210,212,214may be used to measure the lateral positions of the edges, the strip height position relative to a pass line, and/or the surface angles of the metal strip208, among others. These measurements may then be used to calculate or determine the three-dimensional position, form and/or manifested off-flatness of the metal strip208. These values may then be used for steering the metal strip208to maintain its position at the centerline of the work rolls202,204and control the roll gap geometry to avoid errors in the thickness profile and/or flatness of the metal strip208. Maintaining the metal strip208at the centerline of the work rolls202,204improves the accuracy of measurements of the thickness profile and likelihood of a symmetric thickness profile. The strip property and position sensors210,212,214may also be used to measure the temperature of the metal strip208by detecting the conductivity of the metal strip208, or the changes in conductivity of the metal strip208from when it entered the rolling mill to its current position. FIG.3is an exemplary method for controlling a hot rolling mill incorporating interstand metal strip property and position sensors such as, but not limited to, sensors138,210,212, and/or214. During the operation of a rolling mill, the interstand metal strip property and position sensors may record the position, strip angles, flatness, temperature, point thicknesses and/or the thickness profile of the metal strip at block302. Depending on the particular strip property and position sensors used and their capabilities, the thickness profile may be either directly measured or it may be calculated based on individual point thickness measurements of the metal strip. These measurements may then be used to calculate the metal strip thickness profile, crown, wedge and/or flatness at block304. The calculated values of the metal strip thickness profile, crown, wedge and/or flatness, and the directly measured values for the strip thickness and/or thickness profile and/or position, may then be compared to desired or target values and/or desired or target values incorporating an allowable or acceptable tolerance range at block306. Based on the measured thicknesses and/or thickness profile and the calculated thickness profile, crown, wedge, flatness and/or any other property or parameter values, a control system and/or operator may adjust the first stand or subsequent stands to compensate for or correct any measurements that are not within a desired or target range at block308. In some cases, it may be preferable to adjust the first stand, one or more subsequent stands, or both. This determination may be made based on the type of error, whether it is a relatively constant error or a fluctuating error, and the amount of the discrepancy between the desired values and the measured thicknesses and/or thickness profile and/or the calculated metal strip thickness profile, crown, wedge and/or flatness. Furthermore, any adjustment to the rolling mill control mechanisms at block308that affect the roll gap geometry in order to influence any one of the thickness profile (including crown and/or wedge), centerline thickness and/or flatness and/or position of the metal strip will tend to affect the other measured and/or calculated metal strip parameters. As a result, any changes to roll gap geometry at block308to correct an error in one metal strip parameter should also include considerations of the effect of the roll gap geometry change on the other, related metal strip parameters. After the metal strip leaves the rolling mill, a final measurement of the metal strip thickness profile and flatness may be made using an exit metal strip property and position sensor and/or a separate profile gauge such as an x-ray profile gauge and/or flatness roll at block310. This final measurement of the metal strip parameters, including thickness profile, flatness and/or other properties such as the strip position and temperature, allows the control system to verify that any adjustments made have resulted in the metal strip achieving desired or target ranges for any given measurement of thickness, thickness profile, crown, wedge, flatness and/or the value of any other performance metrics, measurements, or properties. The control system and/or operator may then continue continuously monitoring the measured thicknesses, thickness profile, calculated crown, calculated wedge, centerline thickness, strip position, flatness and/or contour and adjust rolling mill or rolling stand operating conditions as necessary to maintain the metal strip within the desired or target ranges for thickness profile, crown, wedge, flatness and/or other strip properties at block312. Still referring toFIG.3, the control method of blocks302-312is described with reference to one or more interstand strip property and position sensors positioned after a first rolling stand. However, the method may be easily adapted for use with one or more interstand metal strip property and position sensors positioned between any pair of rolling stands downstream of a first rolling stand or multiple sets of interstand metal strip property and position sensors between any pair of rolling stands. The use of multiple sets of interstand metal strip property and position sensors may be useful in determining if one or more of the individual rolling stands may be the cause of an out of specification condition in the metal strip. Furthermore, the measured thickness or thickness profile and any values calculated from them may be used to adjust rolling stands either upstream or downstream of that particular interstand metal strip property and position sensor used to take the measured thickness or thickness profile. The method of blocks302-312may also incorporate any additional sensors as described with reference toFIG.1above, and similarly may adjust the rolling mill100and/or rolling stands102,104,106,108based upon any of the above described control mechanisms. In certain cases, the method of control of blocks302-312may be based on a feedback loop strategy that adjusts the rolling mill and/or upstream rolling mill stands, continues monitoring the interstand metal strip property and position sensors, and continues adjusting in an iterative process to achieve the desired or target values for the centerline thickness, thickness profile, crown, wedge, flatness and/or any other property or parameter of the metal strip. In certain cases, the method of control of blocks302-312may use a feed-forward loop strategy to adjust the rolling mill and/or downstream rolling mill stands. FIG.4is a sample control loop for adjusting a rolling mill and/or individual rolling mill stands to maintain or achieve a desired thickness, thickness profile, crown, wedge, flatness and/or any other property or parameter of the metal strip. One or more parameters may be measured and/or input into the control loop. For example, a user may input a desired metal strip thickness profile at block402, a desired flatness at block403, a thickness tolerance for the centerline thickness at block404, a flatness tolerance at block405, a thickness profile tolerance at block406, and/or metal strip material at block408. The control system may then receive values from various sensors, which may be integrated or otherwise in communication with the control system. For example, the control system may receive metal strip temperature entering the rolling mill at block410, metal strip temperature exiting the rolling mill at block412, metal strip throughput speed at block414, metal strip flatness into a rolling stand at block415, metal strip centerline thickness and thickness profile into a rolling stand at block416, metal strip flatness out of a rolling stand at block417, metal strip centerline thickness and thickness profile exiting a rolling stand at block418, metal strip position into and out of stand at block419, work roll temperature at block420, metal strip temperature into and out of stand at block421, and work roll camber at block422. In some cases, the control system may use one, multiple, all, or additional unlisted input or measured parameters to determine the applicable metal strip properties and/or desired process outcomes. These measured and/or input values may then be used to calculate the metal strip crown, wedge and/or flatness at block424. The values of the metal strip thickness, thickness profile, crown, wedge, position and/or flatness may be compared to the desired thickness, thickness profile, crown, position, wedge and/or flatness and any applicable tolerances or allowable variances at block426. If the measured and/or calculated parameters for the metal strip are within desired ranges at block428, the control system may maintain the current rolling mill and/or rolling stand settings at block430. In this case, the control system will continue to monitor the metal strip parameters, measurements and/or properties for any variations or deviations from the desired or target values. Still referring toFIG.4, if the measured thickness, thickness profile, calculated crown, position, wedge and/or flatness values do not match the desired values for thickness, thickness profile, crown, wedge, position and/or flatness or within acceptable tolerances of those desired values at block432, the control system may modify one or more settings to one or more control mechanisms of a rolling stand or the rolling mill to adjust the roll gap geometry, contact pressure, or other variables at block434. The control system may alter or adjust any applicable control mechanism present on the particular rolling mill or rolling stand. Control mechanisms may include any of the above described control mechanisms ofFIG.1and/or additional controls as described in this specification that influence the performance and output of the rolling mill or rolling stands. For example, the control system may adjust work roll heating at block436, work roll cooling at block438, work roll bending forces at block440, deformable backup roll pressure at block442, continuous variable crown work, and/or intermediate roll positioning at block444, work and/or backup roll tilting at block446, adjusting the position of intermediate rolls at block448, and/or adjustment of roll crossing and/or pair crossing parameters at block450. The control system may make adjustments to any of the control mechanisms of blocks436-450and/or any other control mechanisms or mill processing conditions as described above based on predictive modeling. The control system may take into account the amount of variance between the measured thickness or thickness profile, calculated crown, and/or calculated wedge and their respective desired or target values and determine which control mechanism or mechanisms to adjust and the amount of adjustment necessary. The control system may then continue measuring and receiving information about the metal strip, rolling mill, and/or rolling stands at blocks402-423, calculate necessary values at block424, and compare read in and calculated values to the desired values at block426. In certain cases, the control system may not require predictive modeling and may cycle through iterations of the control loop based on feedback loop or feed-forward loop control. Said differently, the control system will receive inputs and measured values at blocks402-423, make any necessary calculations at block424, compare the measured and calculated values of block424with desired or target values at block426, and make any necessary adjustments at blocks436-450. The control system may then repeat these steps of the control loop adjusting the control mechanisms at blocks436-450and comparing values at block426until the measured and calculated values for the metal strip properties or parameters fall within their respective desired or target ranges. Once the metal strip properties or parameters are within their respective desired or target ranges, the control system may maintain the control mechanisms at the current settings and continue to compare the measured and calculated values to the inputs. FIG.5is a schematic side view of an exemplary multi-stand rolling mill500with various sensors and a control system. The rolling mill500comprises a first rolling stand502, a second rolling stand504, a third rolling stand506, and a fourth rolling stand508. However, the rolling mill500may incorporate as few or as many stands as desired. Furthermore, while the rolling stands502,504,506,508are described here with numerical order, they may also be described in relative terms as downstream or upstream. For example, as shown, the metal strip536will pass through the rolling mill500from left to right. Any individual rolling stand502,504,506,508that is to the left of another rolling stand502,504,506,508may be described as relatively upstream. Similarly, any rolling stand502,504,506,508to the right of another rolling stand502,504,506,508may be described as relatively downstream. Each individual rolling stand502,504,506,508may include an upper backup roll510, an upper work roll512, a lower backup roll514, and a lower work roll516. The rolling mill500and/or each individual rolling stand502,504,506,508includes one or more sensors or measurement devices to monitor a number of rolling mill500process conditions and/or metal strip536properties or parameters. For example, as shown inFIG.5, the rolling mill500includes, among other things, one or more upper work roll camber sensors518, one or more lower work roll camber sensors519, one or more interstand metal strip property and position sensors538located between successive rolling stands502,504,506,508, one or more tension rolls531, one or more entry metal strip property and position sensors532, one or more exit metal strip property and position sensors534and/or a flatness roll530. These sensors feed information about the rolling mill500and individual rolling stand502,504,506,508operating conditions, roll gap geometry, and the properties and parameters of the metal strip536into one or more fast loop profile controllers540, fast loop thermal camber controllers542, fast loop flatness controllers544and/or rolling mill profile controller546. The controllers540,542,544,546, in turn, adjust one or more rolling mill control mechanisms based on the measurements and readings of the sensors. In some cases, the rolling mill500and/or individual rolling stands502,504,506,508may include hot or cold upper sprays520, hot or cold lower sprays522, bending forces524applied by bending jacks or other roll bending mechanisms, rolling load525, work roll tilting, continuous variable crown (CVC) work and/or intermediate rolls. The rolling mill500and/or rolling stands502,504,506,508may also include sensors or measurement devices to monitor any of the metal strip536properties or parameters described above and may adjust the operating conditions of the rolling mill500and/or individual rolling stands502,504,506,508as described above. Still referring toFIG.5, the control system for the rolling mill500includes both fast and slow loops to control the operating conditions of the individual rolling stands502,504,506,508and the rolling mill500, respectively. The fast control loops monitor and adjust the operating conditions of an individual rolling stand502,504,506,508to provide quick response to changing conditions in the rolling mill500and compensate for variations or errors in the thickness, thickness profile, crown, wedge, flatness and/or any other properties or parameters of the metal strip536during rolling. Simultaneously, the slow loop obtains information about the operating conditions and processes of the rolling mill500as a whole. The slow loop then adjusts the control mechanisms of rolling mill500and/or individual rolling stands502,504,506,508and/or the targets of the fast control loops to both compensate for slower, overall process variation and to maximize the available bending ranges for the rolling mill500and/or individual rolling stands502,504,506,508. The control system may have any number of different configurations depending upon the particular application, configuration of the rolling mill500and/or individual rolling stands502,504,506,508, and the types and numbers of sensors and rolling mill control mechanisms. For example, the control system may include a slow loop to control the overall rolling mill500, and then one or more fast loops directed to one or a subset of individual rolling stands502,504,506,508. In certain cases, each individual rolling stand502,504,506,508may have an independent fast control loop. Furthermore, each fast control loop may include one or more sub-loops and one or more controllers. In some cases, both the fast and slow control loops may be carried out by a single controller or processor that monitors the operation of the rolling mill500and the individual rolling stands502,504,506,508. In some cases, information may be shifted or shared between the fast loops of individual rolling stands502,504,506,508and/or the slow loop for the rolling mill500, with corrections for roll gap geometry propagated upstream or downstream to maintain uniform reductions in thickness through the rolling stands502,504,506,508. As shown inFIG.5, the rolling mill500may include a slow loop controlled by the rolling mill profile controller546. The rolling mill profile controller546may obtain information from the upper work roll camber measurement sensors518, lower work roll camber measurement sensors519, interstand metal strip property and position sensors538, entry metal strip property and position sensor532, exit metal strip property and position sensor534, flatness roll530and/or other measured process and metal strip536data. The rolling mill profile controller546may then compare the information it receives from the sensors to determine whether to adjust any of the rolling mill control mechanisms, such as, but not limited to the upper sprays520, lower sprays522, bending force524, rolling load525, CVC work and/or intermediate rolls and/or work roll tilt. The rolling mill profile controller546may then adjust the roll gap geometry of one or more of the rolling stands502,504,506,508to achieve the desired thickness, thickness profile, crown, wedge, flatness and/or other properties or parameters of the metal strip536. The rolling mill profile controller546may also feed target values for the properties or parameters of the metal strip536and/or roll gap geometry to one or more of the fast loop profile controllers540, fast loop thermal camber controllers542and/or fast loop flatness controller544. Each rolling stand502,504,506,508may also have one or more fast control loops having the fast loop profile controller540and/or the fast loop thermal camber controller542. The fast loop profile controller540may obtain readings from one or more of the interstand metal strip property and position sensors538and/or the entry metal strip property and position sensor532, and/or the exit metal strip property and position sensor534. The fast loop profile controller540may then compare the readings of thickness, thickness profile, crown, wedge, flatness and/or any other properties or parameters of the metal strip536and the mill500to its desired values, either as input by an operator or as directed by the slow loop profile controller546and determine whether to adjust the upper and lower sprays520,522, bending force524, rolling force525, CVC work and/or intermediate rolls, work roll tilt and/or any other rolling mill control mechanisms to adjust the roll gap geometry for its associated rolling stand502,504,506,508. In certain cases, the fast loop profile controller540may also direct upstream and/or downstream rolling stands502,504,506,508to also adjust their roll gap geometry so as to provide uniform reductions in thickness across the width of the metal strip536in other rolling stands and maintain the correct thickness profile. The fast loop profile controller540may also output data or other information to the rolling mill profile controller546. Similarly, each rolling stand502,504,506,508may include a fast loop thermal camber controller542. In certain cases, the fast loop thermal camber controller may obtain readings of upper work roll512and/or lower work roll516camber via the upper work roll camber measurement sensors518and/or lower work roll camber measurement sensors519, respectively. The thermal camber controller542may then compare the measured upper and/or lower work roll512,516camber to a desired work roll camber, either as input by an operator or as directed by the slow loop profile controller546. The thermal camber controller542may then adjust one or more of the rolling mill control mechanisms, such as, but not limited to, upper and lower sprays520,522, for its rolling stand502,504,506,508. These changes may be directed at achieving a specified roll gap geometry, specific properties or parameters of the metal strip536, or both. The thermal camber controller542may also, in some cases, propagate changes to the upper and/or lower work roll512,516camber in upstream and/or downstream rolling stands502,504,506,508. In certain cases, the thermal camber controller542may also return data or other information to the rolling mill profile controller546. The rolling mill500may also include one or more fast loop flatness controllers544, which may be located at the final rolling stand508or any other rolling stand502,504,506that may require direct control of the flatness of the metal strip536. As shown, the fast loop flatness controller544may receive information on the flatness of the metal strip536either directly via the flatness roll530or indirect via strip angle information form any of the strip property and position sensors532,534or538. The fast loop flatness controller544may then direct one or more of the rolling mill control mechanisms, including, but not limited to, upper and lower sprays520,522, bending force524, rolling force525, CVC work and/or intermediate rolls and/or work roll tilt to adjust the rolling mill500and any individual rolling stand502,504,506,508to achieve the desired flatness. The fast loop flatness controller544may also output data or other information to the rolling mill profile controller546. Throughout the fast and slow loops for the rolling stands502,504,506,508and/or rolling mill500, the fast loop profile controllers540, fast loop thermal camber controllers542, fast loop flatness controller544and/or rolling mill profile controller546may exchange information or otherwise interact with one another to achieve the desired properties and parameters for the metal strip536. Notably, any change to the roll gap geometry on one rolling stand502,504,506,508may require adjustments or alterations in upstream and/or downstream rolling stands502,504,506,508. Furthermore, any changes to the rolling mill500and/or rolling stands502,504,506,508will affect the thickness, thickness profile, crown, wedge, flatness and/or other properties or parameters of the metal strip536as a group. Therefore, it may be necessary to continually monitor all measured and/or calculated metrics for the metal strip536to compensate for any changes that may occur to values that are within acceptable ranges while adjusting the rolling mill control mechanisms to bring an out of range value within an acceptable range. For example, if the flatness of the metal strip536is out of range, any changes made to compensate or correct a flatness error may require monitoring of the thickness profile, crown, wedge, or other properties or parameters of the metal strip536for any unintended effects that may require additional adjustments or corrections. FIGS.6A and6Bare a sample control method for adjusting a rolling mill and/or individual rolling mill stands using a fast control loop728and/or a slow control loop730. The control method is intended to achieve desired properties or parameters of a metal strip as it is processed by the rolling mill. While a number of measurements, inputs, rolling mill control mechanisms, and a logic path are described below, they are by no means exhaustive lists. Rather, control systems may comprise additional inputs, measurements and/or rolling mill control mechanisms. Furthermore, a control system may include only a subset of the listed steps, or additional steps in use. Instead of the below described feedback control loops also more advanced control methods like predictive control methods may be used to achieve a better performance. The control system may receive any number of measured or otherwise sensed values from devices such as entrance, interstand and/or exit metal strip property and position sensors, work roll camber measurement sensors, tension rolls, flatness rolls and/or any other sensors or measurement devices as desired or required by a particular application. For example, the control system may read in measured or sensed values for the strip thickness into a stand at block602, strip thickness out of a stand at block604, work roll camber at block606, strip temperature into a stand at block608, strip temperature out of a stand at block610, strip electrical conductivity into a stand at block612, strip electrical conductivity out of a stand at block614, strip width into a stand at block616, strip width out of a stand at block618, strip position into a stand at block620, strip position out of a stand at block622, strip angles in the rolling direction into the stand at block624, strip angles in the rolling direction out of the stand at block626, strip angles in the lateral direction into the stand at block628, strip angles in the lateral direction out of the stand at block630, strip total tension into the stand at block632, strip total tension out of the stand at block634, strip differential tension into the stand at block636and/or strip differential tension out of the stand at block638. These measured or sensed values602-638may then be sent to a fast loop controller668. The fast loop controller668may also receive input values from an operator or other controller and/or control system that describe the desired outputs or metrics of the rolling process. For example, the control system may receive input values including, but not limited to, the desired centerline thickness at block640, centerline thickness tolerance at block642, desired thickness profile at block644, thickness profile tolerance at block646, desired crown at block648, crown tolerance at block650, desired wedge at block652, wedge tolerance at block654, desired flatness at block656, flatness tolerance at block658, starting material thickness at block660, thickness reduction at block662, desired thickness at block664, thickness tolerance at block666, desired strip position667aand/or strip position tolerance667b. Once the fast loop controller668has received the measured or sensed values602-638, the fast loop controller668may calculate other values such as, but not limited to, the thickness profile, crown, wedge and/or flatness of the strip at block670. The calculated values of block670and/or the measured or sensed values602-638may then be compared at block672to the desired values of centerline thickness, thickness profile, crown, wedge, flatness and/or desired thickness and/or position from the inputs640-667b. If the calculated values of block670and/or measured or sensed values of602-638are within the acceptable tolerance of the desired values of the inputs at blocks640-667bat block674, then the fast loop controller668may maintain the current settings at block675and continue to compare the measured or sensed values602-638and/or calculated values670to the inputs640-667b. If the values are out of tolerance at block676, the fast loop controller668may then use the measured or sensed values602-638to calculate the roll gap geometry of the work rolls of one or more rolling stands at block678. The fast loop controller668may then determine, based upon the calculated values at block670and the measured or sensed values of block602-638, the new roll gap geometry at block680. Because a change to the roll gap geometry for one of the desired values as described by the inputs640-667bmay influence other desired values for the inputs640-667b, the fast loop controller668may calculate the new roll gap geometry at block680based upon the interrelatedness of the inputs640-667b. In some cases, the fast loop controller668may calculate the new roll gap geometry at block680only to adjust the one or more values that are out of tolerance. The fast loop controller668may then monitor the measured or sensed values602-638and continue to calculate a new roll gap geometry at block680through an iterative process to find the optimal new roll gap geometry. Once the fast loop controller668has determined a new roll gap geometry at block680, it may adjust one or more rolling mill control mechanisms at block682. The fast loop controller668may adjust one or more rolling mill control mechanisms to influence the roll gap geometry. For example, the rolling mill may include rolling mill control mechanisms such as, but not limited to, work roll heating684, work roll cooling686, work roll bending688, CVC roll positioning690, deformable backup roll pressure692, roll tilting694, roll crossing and/or pair crossing696, differential strip cooling697, work roll position698, differential rolling load700, rolling speed702, speed difference between rolling stands704, roll torque706and/or rolling load708. As a non-limiting example, differential strip cooling may be used to control a strip quench at the exit of a stand by adjusting the flow volume selectively at different zones to control the flatness and the strip temperature at the exit of the quench. Block682may also take into account the current values of the rolling mill control mechanisms684-708to respect given actuator limits. After adjusting one or more of the rolling mill control mechanisms684-708, the fast loop controller668may continue to monitor the measured or sensed values602-638and compare the measured or sensed values602-638and/or calculated values670with the inputs640-667bat block672throughout the rolling mill production cycle. A slow loop730operates on similar principles as the fast loop728. A slow loop controller710may receive measured or sensed values602-638and inputs640-667b. The slow loop controller710may then calculate values such as the thickness profile, crown, wedge and/or flatness at block712. The measured or sensed values602-638and/or calculated values712may be compared to the inputs640-667bat block714. If the values are within tolerance at block716, the slow loop controller710may maintain the current settings at block718and continue to monitor the rolling mill processes. If one or more of the measured or sensed values602-638and/or calculated values712are not within the tolerance of the inputs640-667bat block720, the slow loop controller710may calculate the current roll gap geometry at block722and determine a new roll gap geometry at block724. As described above, the slow loop controller710may determine the new roll gap geometry at block724while taking into account the interrelatedness of the effects of changing the roll gap geometry to bring one of the measured or sensed values602-638and/or calculated values712within tolerances of the inputs640-667band subsequently affecting one or more of the other measured or sensed values602-638and/or calculated values712. In some cases, the slow loop controller710may also change the roll gap geometry to bring the one or more measured or sensed values602-638and/or calculated values712within tolerance and continue an iterative process for determining a new roll gap geometry at block724until all of the measured or sensed values602-638and/or calculated values712are within the tolerances of the inputs640-667b. Once the slow loop controller710has determined a new roll gap geometry at block724, it may then adjust one or more of the rolling mill control mechanisms684-708at block726. Block726may also take into account the current values of the rolling mill control mechanisms684-708to respect given actuator limits and/or change one or more input values640-667bfor the fast control loops. In some cases, the slow loop controller may take into account operator feedback on certain parameters or properties. By way of example, in some cases, a flatness roll may not be included with a rolling mill, and the operator may provide feedback on achieved flatness. Though the fast loop728and slow loop730use similar logical pathways, the fast loop728and slow loop730may perform different functions. The slow loop730operates to control the overall rolling mill and its production process. The slow loop730may also function to allow the rolling mill to compensate for relatively larger time scale changes in the rolling mill process using certain rolling mill control mechanisms and to allow roll bending, which may be a faster responding rolling mill control mechanism, to retain maximum variability for the fast loop728. The fast loop728, by contrast, may be used to quickly alter or adjust the roll gap geometry to maintain proper rolling mill function during transient or other relatively fast moving changes to the rolling process. In certain cases, the overall control system may include multiple fast loops728. For example, a rolling mill with multiple rolling stands may have a fast loop728for each rolling stand or any subset thereof. Also, there may be transfers of instructions and/or data between individual fast loops728and/or the slow loop730. The slow loop730may provide instructions and/or data to one or more fast loops728or vice versa. Similarly, individual fast loops728may exchange instructions and/or data, and roll gap geometry changes may be propagated upstream or downstream in the rolling mill, to ensure even reductions in thickness and maintenance of a desired thickness profile, crown, wedge and/or flatness as the metal strip passes through individual rolling stands. Different arrangements of the components depicted in the drawings or described above, as well as components and steps not shown or described are possible. Similarly, some features and sub-combinations are useful and may be employed without reference to other features and sub-combinations. Embodiments of the invention have been described for illustrative and not restrictive purposes, and alternative embodiments will become apparent to readers of this patent. Accordingly, the present invention is not limited to the embodiments described above or depicted in the drawings, and various embodiments and modifications can be made without departing from the scope of the claims below. A collection of exemplary embodiments, including at least some explicitly enumerated as “ECs” (Example Combinations), providing additional description of a variety of embodiment types in accordance with the concepts described herein are provided below. These examples are not meant to be mutually exclusive, exhaustive, or restrictive; and the invention is not limited to these example embodiments but rather encompasses all possible modifications and variations within the scope of the issued claims and their equivalents. EC 1. A method comprising: measuring a thickness profile of a metal strip with a thickness profile measurement sensor, wherein the thickness profile measurement sensor is disposed at one of an entry side or an exit side of a rolling mill stand of a rolling mill; measuring a flatness of the metal strip with a flatness measurement sensor, wherein the flatness measurement sensor is disposed at one of the entry side or the exit side of the rolling mill stand; measuring a camber of a roll of the rolling mill with a roll camber sensor; measuring a roll gap geometry of the rolling mill stand with a roll gap geometry sensor; receiving data at a controller from at least one of the thickness profile measurement sensor, the flatness measurement sensor, the roll camber sensor, or the roll gap geometry sensor; and adjusting, by the controller, a rolling mill control mechanism such that the roll gap geometry provides a desired thickness profile and a desired flatness of the metal strip within predefined tolerances. EC 2. The method of any preceding or subsequent example combinations, wherein adjusting the rolling mill control mechanism comprises adjusting the camber of the roll such that a bending range is within a predefined range. EC 3. The method of any preceding or subsequent example combinations, wherein the metal strip is a first metal strip, and wherein adjusting the rolling mill control mechanism comprises adjusting the camber of the roll such that the roll gap geometry of the first metal strip matches a roll gap geometry of a subsequent metal strip. EC 4. The method of any preceding or subsequent example combinations, wherein adjusting the rolling mill control mechanism comprises minimizing at least one of a roll cooling time and a roll heating time of the roll. EC 5. The method of any preceding or subsequent example combinations, wherein the rolling mill stand is a first rolling mill stand, and wherein adjusting the rolling mill control mechanism comprises adjusting a roll gap geometry of a second rolling mill stand downstream from the first rolling mill stand to maintain the thickness profile and the flatness of the metal strip. EC 6. The method of any preceding or subsequent example combinations, wherein the rolling mill stand is one rolling mill stand of a plurality of rolling mill stands, and wherein adjusting the rolling mill control mechanism comprises adjusting the roll gap geometry of the plurality of rolling mill stands to create a symmetric profile of the metal strip. EC 7. The method of any preceding or subsequent example combinations, wherein the rolling mill stand is one rolling mill stand of a plurality of rolling mill stands, and wherein adjusting the rolling mill control mechanism comprises implementing profile changes of the metal strip in at least two of the plurality of rolling mill stands. EC 8. The method of any preceding or subsequent example combinations, wherein implementing profile changes in at least two of the plurality of rolling mill stands comprises accounting for thermal conditions of the roll in the plurality of rolling mill stands. EC 9. The method of any preceding or subsequent example combinations, wherein adjusting the rolling mill control mechanism comprises calibrating a thermal model of a setup model based on at least one of a measured thermal condition and a calculated thermal condition of the roll. EC 10. The method of any preceding or subsequent example combinations, wherein the roll is an upper roll, and wherein measuring a thermal condition of the roll, measuring the camber of the roll, and measuring the roll gap geometry comprises at least one of: measuring the roll gap geometry with ultrasonic sensing while the upper roll is rolling; measuring the roll gap geometry by measuring a distance between the upper roll and a lower roll with a laser; measuring the camber of the upper roll and the lower roll with ultrasonic sensing; calculating the roll gap geometry based on a difference between an ingoing thickness profile and an outgoing thickness profile, the flatness, and rolling condition information; calculating the roll gap geometry based on roll camber measurements, and the rolling condition information; or calculating the roll camber of the roll based on roll gap geometry measurements, and the rolling condition information. EC 11. The method of any preceding or subsequent example combinations, wherein the rolling condition information is at least one of a rolling load measurement and a bending force measurement. EC 12. The method of any preceding or subsequent example combinations, wherein measuring the thickness profile of the metal strip comprises measuring multiple thicknesses across a face of the metal strip. EC 13. The method of any preceding or subsequent example combinations, wherein the rolling mill stand is a first rolling mill stand, and wherein the method further comprises: adjusting the first rolling mill stand and a second rolling mill stand downstream from the first rolling mill stand with the rolling mill control mechanism to maintain the thickness profile of the metal strip through the second rolling mill stand, wherein the adjusting of the rolling mill stands with the rolling mill control mechanism is based on at least one of the measuring of the camber of the roll of the rolling mill or the measuring of the roll gap geometry of the rolling mill stand of the rolling mill. EC 14. The method of any preceding or subsequent example combinations, further comprising: measuring at least one additional process parameter of the rolling mill; and adjusting the at least one additional process parameter of the rolling mill to provide the roll gap geometry of the rolling mill stand of the rolling mill to maintain the thickness profile and the flatness of the metal strip to the desired thickness profile and the flatness within the thickness profile and the flatness tolerances. EC 15. The method of any preceding or subsequent example combinations, wherein the rolling mill control mechanism comprises an actuator in the rolling mill stand or at an interstand position, wherein the actuator comprises at least one of: positive and negative roll bending; heating and cooling of the roll; controlling the positioning of a continuously variable crown roll or an intermediate roll; deforming a deformable backup roll; roll tilting; roll crossing and pair crossing; differential strip cooling and heating; rolling load and differential rolling load; rolling speed; and dynamic shifting of thickness reductions within a plurality of rolling mill stands. EC 16. The method of any preceding or subsequent example combinations, further comprising controlling the rolling mill control mechanism based on at least one of: one or more feedback loops; one or more feed-forward loops; and advanced control methods such as model predictive control. EC 17. The method of any preceding or subsequent example combinations, wherein the measuring of the thickness profile of the metal strip comprises measuring the thickness profile of the metal strip with an eddy current sensor. EC 18. The method of any preceding or subsequent example combinations, further comprising fast control loops and slow control loops. EC 19. The method of any preceding or subsequent example combinations, further comprising at least one of: controlling a thickness profile and a flatness target at the exit of the rolling mill stand with the fast control loops; controlling the thermal camber of the roll with the fast control loops; optimizing available bending ranges with the slow control loops; correcting a thickness profile target and a flatness target at the exit of the rolling mill stand with the slow control loops; optimizing a thermal condition of the roll for product transitions by adjusting the targets of the fast control loops via the rolling mill control mechanism. EC 20. A method comprising: measuring a roll gap geometry of at least one rolling stand of a rolling mill; measuring a thickness profile of a metal strip between one or more upstream stands and one or more downstream stands at a first interstand location of the rolling mill after the metal strip has passed through the one or more upstream stands; comparing the thickness profile of the metal strip to a desired thickness profile; and adjusting the one or more upstream stands with one or more rolling mill control mechanisms to provide a roll gap geometry of the one or more upstream stands that matches the thickness profile of the metal strip to the desired thickness profile within a thickness profile tolerance. EC 21. The method of any preceding or subsequent example combinations, further comprising calculating a crown of the metal strip from the thickness profile of the metal strip; comparing the crown to a desired crown; and adjusting the one or more upstream stands with the one or more rolling mill control mechanisms to match the crown to the desired crown within a crown tolerance. EC 22. The method of any preceding or subsequent example combinations, wherein the measuring the thickness profile of the metal strip comprises measuring multiple thicknesses across a face of the metal strip. EC 23. The method of any preceding or subsequent example combinations, wherein the one or more rolling mill control mechanisms influence the roll gap geometry of the at least one rolling stand of the rolling mill. EC 24. The method of any preceding or subsequent example combinations, further comprising adjusting the one or more downstream stands with the one or more rolling mill control mechanisms to maintain the thickness profile of the metal strip through the one or more downstream stands, wherein the adjusting of the one or more downstream stands with the one or more rolling mill control mechanisms is based on measuring the roll gap geometry of the at least one rolling stand of the rolling mill. EC 25. The method of any preceding or subsequent example combinations, further comprising: measuring at least one additional process parameter of the rolling mill; and adjusting the at least one additional process parameter of the rolling mill to provide the roll gap geometry of the at least one rolling stand of the rolling mill to maintain the thickness profile of the metal strip to the desired thickness profile within the thickness profile tolerance. EC 26. The method of any preceding or subsequent example combinations, further comprising: adjusting the one or more rolling mill control mechanisms to provide a work roll camber of the at least one rolling stand of the rolling mill, wherein the work roll camber of the at least one rolling stand provides the roll gap geometry of the at least one rolling stand such that an available bending range is maximized. EC 27. The method of any preceding or subsequent example combinations, wherein the one or more rolling mill control mechanisms comprises bending at least one work roll of the at least one rolling stand. EC 28. The method of any preceding or subsequent example combinations, wherein the one or more rolling mill control mechanisms comprises at least one of heating at least one work roll of the at least one rolling stand, cooling at least one work roll of the at least one rolling stand, controlling the positioning of a continuously variable crown work roll or intermediate roll, or deforming a deformable backup roll. EC 29. The method of any preceding or subsequent example combinations, wherein measuring the roll gap geometry of at least one rolling mill comprises measuring the roll gap geometry of a plurality of rolling stands of the rolling mill. EC 30. The method of any preceding or subsequent example combinations, further comprising controlling the one or more rolling mill control mechanisms based on a feedback loop or feed-forward loop. EC 31. The method of any preceding or subsequent example combinations, further comprising measuring at least one additional thickness at a second interstand location of the rolling mill, wherein the at least one additional thickness is measured between the one or more upstream stands and the one or more downstream stands of the rolling mill. EC 32. The method of any preceding or subsequent example combinations, wherein measuring the roll gap geometry of the plurality of rolling stands of the rolling mill comprises ultrasonic sensing of the roll gap geometry. EC 33. The method of any preceding or subsequent example combinations, further comprising measuring a flatness of the metal strip after the metal strip leaves the rolling mill with a flatness roll; and adjusting at least one of the one or more upstream stands or the one or more downstream stands with the one or more rolling mill control mechanisms to provide the roll gap geometry of the one or more upstream stands or the one or more downstream stands to match the flatness of the metal strip to a desired flatness of the metal strip within a flatness tolerance. EC 34. The method of any preceding or subsequent example combinations, wherein the one or more rolling mill control mechanisms comprises applying differential cooling to the metal strip. EC 35. The method of any preceding or subsequent example combinations, wherein the measuring the thickness profile of the metal strip comprises measuring the thickness profile of the metal strip with an eddy current sensor. EC 36. A rolling mill control system comprising: at least one thickness profile measurement sensor for measuring a thickness profile of a metal strip, wherein the at least one thickness profile measurement sensor is disposed between one or more upstream stands and one or more downstream stands at a first interstand location of a rolling mill having a plurality of rolling stands; at least one roll camber sensor for measuring a camber of at least one of a plurality of work rolls; a rolling mill control mechanism; and a controller; wherein the controller receives data from the at least one thickness profile measurement sensor and the at least one roll camber sensor and adjusts the rolling mill control mechanism such that a roll gap geometry of at least one of the plurality of rolling stands is configured to produce a desired thickness profile of the metal strip. EC 37. The rolling mill control system of any preceding or subsequent example combinations, wherein the rolling mill control mechanism comprises a work roll bending mechanism. EC 38. The rolling mill control system of any preceding or subsequent example combinations, wherein the rolling mill control mechanism comprises a work roll heating or cooling system. EC 39. The rolling mill control system of any preceding or subsequent example combinations, wherein the rolling mill control mechanism comprises a deformable backup roll, a continuously variable crown work roll, or a continuously variable crown intermediate roll. | 82,628 |
11858023 | in which: 10: press connector;11: upper die base;12: wedge;121: inclined surface;122: inclined surface;13: left half male die;131: inclined surface;14: right half male die;141: inclined surface;15: left half male die retainer;16: right half male die retainer;17: left retainer hydraulic cylinder;18: right retainer hydraulic cylinder;19: female die;191: outer side wall;192: annular stiffener;193: die cavity;195: short stiffener;20: rotation driving device;201: first gear;202: first pulley;203: second gear;204: second pulley;205: clutch;206: motor;21: stopper;210: annular oil gallery;22: lower die base;221: circular cavity;222: annular oil gallery;23: thrust bearing plate;24: steel ball bearing bracket;241: receiving cavity;25: steel ball;251: annular groove;26: spring;27: ejector bar;28: through hole;29: ejector plate;291: first notch;292: second notch;3: blank;31: inner side wall;32: outer side wall; and33: bulge. DETAILED DESCRIPTION OF THE PRESENT INVENTION It should be noted that the embodiments and characteristics therein of the present disclosure may be combined with each other without conflict. The present disclosure will be described in detail as below with reference to the accompanying drawings by the embodiments. As shown inFIGS.1to16, the present disclosure provides a rotary extrusion forming die for a cabin section workpiece, which is mainly used for extrusion forming of an irregularly-shaped thin-walled cabin section workpiece. The forming die includes a male die, a female die19, an upper die assembly100and a lower die base22. The female die19is a floating die which can rotate on the lower die base22and float up and down. Specifically, a die cavity193is provided in the female die19, and can be used for receiving a blank3, and the female die19arranged on the lower die base22in such a manner that it can rotate about a vertical axis, i.e., the groove19can rotate horizontally on the lower die base22. The male die is arranged on the upper die assembly100and can extend into the die cavity193along with the upper die assembly100, and the upper die assembly100can drive the male die to move in the vertical and horizontal directions to perform extrusion forming on the blank3in the die cavity193, thus extruding the blank3into the cabin section workpiece of an irregularly-shaped thin-walled structure. The irregularly-shaped thin-walled structure refers to a thin-walled structure of the cabin section workpiece with a non-straight wall face as its machining face. With the above solution, the deficiencies of the traditional turning technology are overcome, and the workpiece can be formed by one-time heating and one-time rotary extrusion of a main body thereof under the condition of mass production, which avoids machining by cutting, improves material utilization rate, and reduces consumption in subsequent machining stages, thereby reducing the production cost, improving the production efficiency and effectively shortening the production process. Preferably, in the embodiment combined with the above solution, as shown inFIGS.1to16, the male die includes a left half male die13and a right half male die14, and the upper die assembly100includes an upper die base11and a push-pull device, wherein the left half male die13and the right half male die14are movably arranged on the upper die base11along the horizontal direction, and a push-pull device is arranged on the upper die base11and connected to the left half male die13and the right half male die14respectively, so as to drive the left half male die13and the right half male die14to move left and right in the horizontal direction. The upper die base11is connected to a press to drive the left half male die13and the right half male die14to move up and down in the vertical direction, thereby performing extrusion forming on the blank3. Preferably, in the embodiment combined with the above solution, as shown inFIGS.1to16, the upper die assembly100further includes a press connector10and a wedge12. An inclined surface121is formed on both sides of the wedge12respectively, and inclined surfaces are formed between the left half male die13and the right half male die14, wherein an inclined surface131is provided on one side of the left half male die13while an inclined surface141is provided on one side of the right half male die14, and the inclined surfaces121on the both sides of the wedge12are fitted to the inclined surface131of the left half male die13and the inclined surface141of the right half male die14. Further, the wedge12is arranged in a sliding manner on the inclined surfaces between the left half male die13and the right half male die14. The inclined surface on the left side of the wedge12matches with the inclined surface131of the left half male die13and that on the right side of the wedge12matches with the inclined surface141of the right half male die14. The top of the wedge12is also connected to the press connector which is connected to the press through the upper die base11, so as to drive the wedge12to move up and down. The press is a double-action press, which can drive the upper die base11and wedge12to move respectively. With the above solution, on one hand, the press connector10acts on the upper die base11to drive the upper die base11to move up and down, thereby driving the left half male die13and the right half male die14to move up and down. On the other hand, the press connector10acts on the wedge12to drive the wedge12to move up and down, so that when the push-pull device drives the left half male die13and the right half male die14to open and close to a preset width, and the wedge12is used to limit the horizontal movement of the left half male die13and the right half male die14. In this way, the horizontal radial pressure between the left half male die13and the right half male die14can be counteracted during the extrusion of the blank3, thus improving the machining stability of the workpiece. Preferably, in the embodiment combined with the above solution, as shown inFIGS.1to16, the push-pull device includes a left half male die retainer15, a left retainer hydraulic cylinder17, a right half male die retainer16and a right retainer hydraulic cylinder18. The left half male die13is arranged on the upper die base11through a left half male die retainer15, and the left retainer hydraulic cylinder17is arranged on the upper die base11to drive the left half male die13to move left and right. Similarly, the right half male die14is arranged on the upper die base11through the right half male die retainer16, and the right retainer hydraulic cylinder18is arranged on the upper die base11to drive the right half male die14to move left and right. Specifically, one end of the left retainer hydraulic cylinder17is fixed on the upper die base11while the other end thereof is fixed on the left half male die retainer15. One end of the right retainer hydraulic cylinder18is fixed on the upper die base11while the other end thereof is fixed on the right half male die retainer16. The left half male die retainer15and the right half male die retainer16slide left and right on the upper die base11respectively through the left retainer hydraulic cylinder17and the right retainer hydraulic cylinder18. In some embodiments, the left half male die retainer15and the right half male die retainer16are mounted on the upper die base11through guide grooves with a T-shaped section, and can slide left and right on the T-shaped guide grooves, to achieve tight fit. In some embodiments, the left retainer hydraulic cylinder17and the right retainer hydraulic cylinder18respectively drive the left half male die13and the right half male die14to move at the same time, and an elastic buffer, which plays a buffering role, is provided at a coupling end of the right retainer hydraulic cylinder18and the upper die base11. Preferably, in combination with the above solution, as shown inFIGS.1to16, the rotary extrusion forming die for a cabin section workpiece provided by the present disclosure further includes a rotation driving device20, which is arranged on the side of the female die19to drive the female die19to rotate about the vertical axis. Specifically, the rotation driving device20includes a first gear201, a first pulley202, a second gear203, a second pulley204and a motor206. A keyway, which is inlaid with a flat key and connected to the first gear201through the flat key, is provided on the outer side wall191of the female die19, and the first gear201is engaged with the second gear203which is in drive connection with the first pulley202. The first pulley202is in drive connection with the second pulley204through a belt, and the motor206is in drive connection with the second pulley204through a clutch205to drive the second pulley204to rotate. Specifically, the clutch205is a dog clutch, and the power of the motor206is transmitted to the female die19through a coupling, the clutch205, the second pulley204, the first pulley202, the second gear203and the first gear201. By controlling the clutch205, the power transmission between the motor206and the female die19can be randomly connected and disconnected. According to the actual power required for extruding and rotating functions, the blank of various sizes can be extruded and rotated by replacing the motor206and a variable gearing mechanism. Preferably, in combination with the above solution, as shown inFIGS.1to16, the rotary extrusion forming die for a cabin section workpiece provided by the present disclosure further includes a floating device. A circular cavity221is provided on the lower die base22, and the floating device is arranged at the bottom of the circular cavity221for driving the female die19to float up and down. Specifically, the female die19is rotatably arranged in the circular cavity221and located at an upper end of the floating device, and the floating device is used for driving the female die19to float up and down. In some embodiments, there are a plurality of floating devices, which are uniformly distributed at the bottom of the circular cavity221, and are respectively used for driving the female die19to float up and down and keep balance. Preferably, in the embodiment combined with the above solution, as shown inFIGS.1to16, the floating device includes steel ball bearing brackets24, steel balls25and springs26. Specifically, steel ball bearing bracket24is fixedly arranged in the lower die base22by screws, and a receiving cavity241with the spring26inside is arranged in the steel ball bearing bracket24. The steel ball25is arranged in the receiving cavity241and located at the top of the spring26, and can move up and down as the spring26stretches. Annular grooves251are correspondingly provided at the bottom of the female die19, and the steel ball25can roll in the annular groove251under the acting force of the spring. With the above solution, the floating device can drive the female die19to float up and down on the lower die base22. In addition, as the annular grooves251are correspondingly provided at the bottom of the female die19, the floating device and the female die19are connected more reliably without easily disengaging from each other. Preferably, in combination with the above solution, as shown inFIGS.1to16, in order to make the structure of the forming die more stable, the rotary extrusion forming die for a cabin section workpiece provided by the present disclosure further includes stopper21. Stopper21is fixedly arranged on an upper end face of the lower die base22and located at the side of the circular cavity221. A groove is provided on an inner side of the stopper21along the radial direction of the female die19, and an annular stiffener192is provided on the outer side wall191of the female die19. The female die19extends into the groove through the annular stiffener192and can float up and down in the groove, and the stopper21plays a role of limiting position in the radial direction of the female die19. With the above solution, the female die19can stably float up and down in the stopper21, with its floating height H being limited by the stopper21, so the female die19is not easy to fall off, and the stopper21can act as a guide to improve forming accuracy. Preferably, in the embodiment combined with the above solution, as shown inFIGS.1to16, annular oil galleries210are provided in positions where the annular stiffeners192is in contact with the groove. With this solution, the annular oil galleries210are provided at the contact surfaces between the groove and the annular stiffeners192, which can reduce the friction between the groove and the annular stiffeners192. Similarly, the annular oil galleries210are provided in positions where the side wall of the female die19is in contact with the circular cavity221, which can also reduce the friction between the side wall of the female die19and the circular cavity221. Preferably, in combination with the above solution, as shown inFIGS.1to16, the rotary extrusion forming die for a cabin section workpiece provided by the present disclosure further includes thrust bearing plates23having an upper thrust bearing plate arranged at the bottom of the female die19and a lower thrust bearing plate arranged at the bottom of the circular cavity221. When the female die19moves down to a lower limit position of the groove, the upper thrust bearing plate and the lower thrust bearing plate are interlocked through a locking structure, thereby limiting the movement of the female die19. Specifically, the locking structure can be a bump and groove structure. Preferably, in combination with the above solution, as shown inFIGS.1to16, the rotary extrusion forming die for a cabin section workpiece provided by the present disclosure further includes a stripping device which includes an ejector bar27and an ejector plate29, wherein a through hole28is arranged at the center of the die cavity193, the ejector plate29is arranged at the bottom of the die cavity193, the blank3is located at an upper end of the ejector plate29, and the ejector bar27is telescopically arranged in the through hole28. Specifically, one end of the ejector bar27passes through the through hole28and abuts against the ejector plate29, and the other end thereof is connected to a drive member. In some embodiments, a plurality of notches for interlocking with short stiffeners195on the female die are provided circumferentially on the ejector plate29, and there may be five, six or seven notches. In some embodiments, there may be five, six or seven short stiffeners195on the female die corresponding to the notches. With the above solution, the ejector bar27can jack up the ejector plate29, so that the formed workpiece is separated from the die cavity193to facilitate unloading and stripping. Preferably, in the embodiment combined with the above solution, as shown inFIGS.1to16, in order to facilitate the rotation of the blank3along with the female die19, the blank3is of a hollow structure into which the male die can extend, to extrude the inner side wall31of the blank3. The outer side wall32of the blank3is fitted in the die cavity193, and bulges33are provided at the bottom of the blank3. First notches291and second notches292are provided on the ejector plate29, the short stiffeners195matched with the first notches291are provided at the bottom of the die cavity193, and the blank3is clamped in the second notches292through the bulges33to avoid self-rotation during rotation. The rotary extrusion forming die for a cabin section workpiece provided by the present disclosure can avoid machining by cutting, improve material utilization rate, and reduce consumption in subsequent machining stages, thereby reducing the production cost and improving the production efficiency. On the other hand, it can also improve the mechanical performance of the main body of the workpiece and avoid the decline in the load-bearing capacity caused by cutting-off streamline. Furthermore, by employing the solution provided by the present disclosure, the workpiece adopts an isothermal forming mode in the forming process, i.e., the blank is always closed in the female die in the forming process, thereby avoiding the temperature reduction of the blank, eliminating the uneven deformation caused by the heat exchange between the blank and the air, further improving the deformation uniformity and reducing the wall thickness difference. Accordingly, in combination with the above solution, as shown inFIGS.1to16, the present disclosure also provides a rotary extrusion forming method for a cabin section workpiece, which can be applied to the rotary extrusion forming die for a cabin section workpiece. Further, the method specifically includes a male die, a female die, an upper die assembly100, a lower die base and a rotation driving device. The male die is arranged on the upper die assembly100which can drive the male die to move up and down in the vertical direction and to move left and right in the horizontal direction; the female die is arranged on the lower die base in such a manner that it can rotate about a vertical axis; and the rotation driving device is in drive connection with the female die and can drive the female die to rotate about the vertical axis. The method further includes the following steps as follows.S1: Blanking is performed to prepare a hollow truncated cone-shaped blank. Specifically, the blank is preferably made of light alloy, which is aluminum alloy, titanium alloy or magnesium alloy, and so on.S2: Preparation for forming is performed, namely the prepared blank is heated to a molding temperature and held at this temperature, the molding temperature to which the blank is heated is a recrystallization temperature of the blank material, after the blank is heated to the molding temperature (i.e., the recrystallization temperature), the holding time is preferably 4-6 hours, preferably 4 hours, and the female die and the male die are preheated to above the molding temperature and held.S3: Die assembly is performed, namely the upper die assembly100is assembled on a press. Further, the die assembly includes an upper die base and a press connector which are in drive connection with the press respectively, and the press is a double-action press. The male die includes a left half male die and a right half male die which are movably arranged on the upper die base along the horizontal direction. A wedge connected to the press connector is arranged between the left half male die and the right half male die, and the upper die base and the press connector are in drive connection with the press respectively.S4: Lubricant is applied evenly on the die cavity193of the female die19, the left half male die13and the right half male die14, and the heated blank is put and fixed into the die cavity193of the female die19. The lubricant application is mainly used to facilitate die stripping. At the same time, the deformation between the blank and the die cavity193in the process of extruding the blank by the male die can be avoided, and the machining accuracy is improved.S5: Forming is performed, namely the rotation driving device is started up to drive the female die to rotate on the lower die base, so that the female die drives the blank to rotate; the press is started up to move the male die down to a machining position of the blank in the die cavity through the upper die assembly100, and the inner side walls of the blank are machined.S6: After the blank is formed by machining, the press makes the male die up move to a preset position through the press connector.S7: An ejector plate at the bottom of the die cavity is jacked up by an ejector bar, so as to strip the formed workpiece.S8: Application of lubricating oil is continued, so as to proceed with the next process of rotary extrusion of a shaped thin-walled cabin section workpiece. With the above solution, the deficiencies of the traditional turning technology are overcome, and the workpiece can be formed by one-time heating and one-time rotary extrusion of a main body thereof under the condition of mass production, which avoids machining by cutting, improves material utilization rate, and reduces consumption in subsequent machining stages, thereby reducing the production cost, improving the production efficiency and effectively shortening the production process. Preferably, in the embodiment combined with the above solution, the workpiece machining process is as follows: the rotation driving device20is started up to drive the female die19to rotate on the lower die base22, and the female die19drives the blank3to rotate, and the left half male die13and the right half male die14are closed on the upper die base11and fixed under the press connector10. The upper die base11drives the left half male die13and the right half male die14to move down. When the left half male die13and the right half male die14move down to the machining position in the blank3, the press connector10drives the wedge12to move down, and a push-pull device drives the left half male die13and the right half male die14to feed separately, so as to start to extrude the inner side wall31of the blank3. After a first forming position is reached, the wedge12remains motionless, and the upper die base11drives the left half male die13and the right half male die14to move up. After a second forming position is reached, the press connector10drives the wedge12to move up, and a gap is left between the left half male die13and the right half male die14, so that the push-pull device pushes the left half male die13and the right half male die14to move left and right. After a designated position is reached, the upper die base11drives the left half male die13and the right half male die14to move up, and the formed workpiece and an ejector plate29held in the female die19are jacked up by an ejector bar27to complete die stripping. Preferably, in the embodiment combined with the above solution, an inclined surface is formed on both sides of the wedge, respectively, and inclined surfaces, on which the wedge is arranged in a sliding manner, are formed between the left half male die and the right half male die; the inclined surface on the left side of the wedge matches with the inclined surface of the left half male die and the inclined surface on the right side of the wedge matches with the inclined surface of the right half male die. The wedge slides up and down on the inclined surfaces between the left half male die and the right half male die to drive the left half male die and the right half male die to open or close. Preferably, in the embodiment combined with the above solution, as shown inFIGS.1to16, the inclined surfaces121on the both sides of the wedge12are consistent with the gradient of an outer side wall32of the blank, and/or are consistent with the gradient of the inclined surfaces of the left half male die13and the right half male die14. In some embodiments, the die cavity193is provided in the female die19, and the inner wall of the die cavity193is consistent with the gradient of the outer side walls32of the blank. Preferably, in the embodiment combined with the above solution, as shown inFIGS.1to16, a circular cavity221, having a floating device arranged at the bottom thereof, is provided on the lower die base22, and the female die19is rotatably arranged in the circular cavity221and floats up and down in the circular cavity221through the floating device. A stopper21, having a groove arranged on an inner side face thereof, is provided on an upper end face of the lower die base22. An annular stiffener192is provided on the outer side wall191of the female die19, and the female die19is clamped in the groove through the annular stiffener192and can float up and down in the groove. Preferably, in the embodiment combined with the above solution, as shown inFIGS.1to16, it further includes thrust bearing plates23having an upper thrust bearing plate arranged at the bottom of the female die19and a lower thrust bearing plate arranged at the bottom of the circular cavity221. When the female die19moves down to a lower limit position of the groove, the upper thrust bearing plate and the lower thrust bearing plate are interlocked through a locking structure, thereby limiting the movement of the female die19. Specifically, the locking structure can be a bump and groove structure. With the above solution, the blanking can be performed by sawing the ready-made blank, the workpiece can be formed by one-time heating and one-time rotary extrusion of a main body thereof, which avoids machining by cutting, improves material utilization rate, and reduces consumption in subsequent machining stages, thereby reducing the production cost and improving the production efficiency Those described above are merely preferred embodiments of the present disclosure, and are not intended to limit the present disclosure in any form. Without departing from the scope of the technical solution of the present disclosure, those of skill in the art may make many possible variations and modifications to the technical solution of the present disclosure or modify them into equivalent embodiments with equivalent variations using the above-described technical content. Therefore, any changes, equivalent variations and modifications made without departing from the scope of the technical solution of the present disclosure to the above embodiments according to the technology of the present disclosure shall fall within the protection scope of the technical solution. | 25,598 |
11858024 | BEST MODE Mode for Invention Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it should be understood that the present invention may be implemented in various different forms and is not limited to the described embodiments. FIG.1is a process diagram showing a method for manufacturing a safety vent according to the present invention.FIG.2shows views illustrating a safety vent forming step of the method for manufacturing the safety vent according to the present invention.FIG.3shows views illustrating a discharge material portion cutting and removing step the method for manufacturing the safety vent according to the present invention.FIG.4shows views illustrating a cutting device configured according to another embodiment of the present invention. In addition,FIG.5shows views illustrating a safety vent forming step of the method for manufacturing the safety vent according to the present invention. As shown in the drawings, the method for manufacturing a safety vent of a cap plate for a secondary battery according to the present invention is configured to form a safety vent2in a material plate1of a cap plate, and includes a safety vent forming step100, a discharge material portion cutting and removing step200, and a lower surface flattening step300. First, in the safety vent forming step100, as shown inFIGS.1and2, a material plate1serving as a material of the cap plate is put on a top surface of a lower forming portion5of a press P including the lower forming portion5formed therein with a peripheral discharge part52, accommodated therein with a lower elevating mold D2, and formed with a long elongated hole51rearward and forward, and an upper forming portion4provided therein with an upper elevating mold D1. Then, after the material is discharged to the peripheral discharge part52to form a discharge material portion3while a safety vent2is formed in a groove shape to have a vent plate21at a lower portion of the material plate1by lowering the upper forming portion4and the upper elevating mold D1and raising the lower elevating mold D2, the safety vent2is formed by returning and raising the upper forming portion4and the upper elevating mold D1and returning and lowering the lower elevating mold D2. In addition, in the safety vent forming step100, the safety vent2may be formed by simultaneously lowering the upper forming portion4and the upper elevating mold D1and raising the lower elevating mold D2such that the safety vent is formed in one time of forging. In addition, in the safety vent forming step100, the safety vent2may be formed by raising the lower elevating mold D2after lowering the upper forming portion4and the upper elevating mold D1such that compressive loads applied to the upper forming portion4and the lower forming portion5are distributed and reduced. Next, as shown inFIGS.1to3, the discharge material portion cutting and removing step200proceeds after the safety vent forming step100is performed. First, the safety vent2formed with the material plate1is put on the top surface of the lower forming portion5of the press P having the lower forming portion5formed with a discharge material portion insertion hole53accommodating a cutting device6for cutting an upper portion of the discharge material portion3, so that the discharge material portion3of the material plate1is inserted into the discharge material portion insertion hole53. Then, the upper portion of the discharge material portion3is cut by operating the cutting device6for the discharge material portion so as to remove the discharge material portion3. In addition, in the discharge material portion cutting and removing step200, a residual material part31at the upper portion of the discharge material portion3remains on a bottom surface of the material plate1. In addition, in the discharge material portion cutting and removing step200, the upper forming portion4constituting the press P may be moved down to further press the top surface of the material plate1, such that the material plate1put on the top surface of the lower forming portion5is more firmly fixed to the top surface of the lower forming portion5. The cutting device6may include an internal cutting member61positioned inside the discharge material portion3, formed with slant blade portions C at front, rear, left and right edges of an upper periphery of the cutting device, and provided to be movable in front, rear, left, and right directions through a driving device M, so as to sequentially cut the discharge material portion3. In addition, since various driving devices using a cylinder, a motor or the like are generally known for the driving device M configured to move the internal cutting member61in the front, rear, left, and right directions, the detailed description will be omitted. Further, in the discharge material portion cutting and removing step200, it is most preferable that the internal cutting member61sequentially moves in the left direction and returns, moves in the right direction and returns, moves in the front direction and returns, and moves in the rear direction and returns so as to cut the upper portion of the discharge material portion3, so as to sequentially cut the discharge material portion3. In addition, as shown inFIG.4, the cutting device6may include front, rear, left, and right cutting members62a,62b,62c, and62dpositioned at front, rear, left and right outer sides of the discharge material portion3, formed at each upper inner edge thereof with a slant blade portion C, and sequentially moved inward and outward one by one through the driving device M to cut the upper portion of the discharge material portion3, such that the upper portion of the discharge material portion3is cut in an inward direction from the outside. In addition, since various driving devices using a cylinder, a motor or the like are generally known for the driving device M configured to move each of the front, rear, left, and right cutting members62a,62b,62c, and62dinward and outward, the detailed description will be omitted. Next, as shown inFIGS.1and5, in the lower surface flattening forming step300, the bottom surface of the material plate is formed into a flat surface by forging the residual material part31remaining on the bottom surface of the material plate1in the discharge material portion cutting and removing step200. In other words, the lower surface flattening forming step300proceeds after the discharge material portion cutting and removing step200is performed, in which, after the material plate1from which the upper portion of the discharge material portion3is cut is put on the top surface of the lower forming portion5of the press P including the lower forming portion5having a flat surface and the upper forming portion4formed on a lower portion thereof with a safety vent insertion part41, the bottom surface of the material plate1is flattened by moving down the upper forming portion4, and the upper forming portion4is moved up. Thus, in the method for manufacturing the safety vent of the cap plate according to the present invention, the safety vent2may be simply formed even by only one time of forging process in which the upper forming portion4and the upper elevating mold D1are moved down and the lower elevating mold D2is simultaneously moved up, or two forging processes in which the upper forming portion4and the upper elevating mold D1are moved down and then the lower elevating mold D2is moved up. Therefore, the method for manufacturing the safety vent of the cap plate of the present invention is the useful invention, in which a forged hardening is prevented from occurring in a vent plate21formed at a lower portion of the safety vent2during forging by simply forming the safety vent2through only once or two times of forging processes, so that a forming defect of a safety vent2in which a vent plate21has an excessive hardness can be prevented. In other words, since the number of forgings to form the safety vent2according to the present invention is only one or two, the forged hardening of the bent plate, which conventionally occurs when the forging is performed three times or more, rarely occurs because the safety vent2of the present invention is forged once or two times. In addition, the method for manufacturing a safety vent of a cap plate of the present invention is the useful invention, since forging of the safety vent2is facilitated while a forging torque is minimized by moving and discharging the material downward while forming the safety vent2by moving down the upper elevating mold D1so that power energy can be reduced when the safety vent2is forged. Meanwhile, as shown inFIG.2, the device for manufacturing the safety vent of the cap plate for the secondary battery according to the present invention is used for the above-described method for manufacturing the safety vent of the cap plate. Accordingly, the device for manufacturing a safety vent of a cap plate according to the present invention includes a safety vent forming portion10including a lower forming portion5formed therein with a peripheral discharge part52, accommodated therein with a lower elevating mold D2, and formed with a long elongated hole51rearward and forward, and an upper forming portion4disposed over the lower forming portion5so as to be movable up and down and provided therein with an upper elevating mold D1so as to be movable up and down. In addition, the device for manufacturing the safety vent according to the present invention includes a discharge material portion cutting portion20accommodated therein with a cutting device6configured to cut the discharge material portion3, and having a lower forming portion5formed with a discharge material portion insertion hole53, and a lower surface flattening portion30including a lower forming portion5having a flat upper surface and an upper forming portion4formed at a lower portion thereof with a safety vent insertion part41. In addition, the safety vent forming portion10, the discharge material portion cutting portion20, and the lower surface flattening portion30may be sequentially provided at one press P according to a moving sequence of the material plate1, or may be provided at a plurality of presses P one by one. FIG.6shows views illustrating a method for manufacturing a cap plate of a first embodiment according to the present invention. The method for manufacturing a safety vent of a cap plate for a secondary battery of the first embodiment according to the present invention uses the above-described method for manufacturing the safety vent of the cap plate as shown inFIGS.1to6, and is presumed to include all of the above-described method for manufacturing the safety vent of the cap plate. Accordingly, in the method for manufacturing the cap plate of the first embodiment according to the present invention, the material plate1supplied during the safety vent forming step100is formed of a long plates extending laterally, and the safety vent forming step100, the discharge material portion cutting and removing step200, and the lower surface flattening forming step300are successively performed by continuously moving the long material plate1one-by-one pitch. In other words, when the long material plate1is moved by every one pitch, the sequence proceeds such that the long material plate1descends, ascends, and move by every one pitch. In the case that the long material plate1is moved by one pitch as in the above manner, a plurality of moving pin holes into which elevating and moving pins are inserted are formed in front and rear of the material plate1, and then the long material plate1is moved by every one pitch. Since the above configuration of moving the long material plate1by every one pitch is already applied and generally used in a forging press P, the descriptions for detailed configurations and operations will be omitted. Accordingly, before the material plate1is supplied, a plurality of moving pin holes (not shown) are perforated at the front and rear of the long material plate1moved by every one pitch. In addition, according to the method for manufacturing the cap plate of the first embodiment according to the present invention, a post-forging forming step further proceeds in which, after the lower surface flattening forming step proceeds, at least one time of forging process of forging another configuration formed in the cap plate is performed by operating the press P. After the post-forging forming step is performed, a material plate cutting step proceeds in which the material plate1formed therein with the configuration different from a configuration of the safety vent2is cut into a rectangular shape as the cap plate by operating the press P, so that the cap plate is manufactured. In other words, in the post-forging forming step, a rivet mount portion consisting essentially of a fluid inlet hole and a rivet hole is required to be forged and formed. In addition, a terminal plate or component fixing holes may be further molded through forging according to a type of the cap plate. Accordingly, the method for manufacturing the cap plate of the first embodiment according to the present invention is the useful invention, since the cap plate is simply manufactured by cutting the long material plate1after simply forming the safety vent2through only once or two times of forging processes as described above so that the productivity of manufacturing the cap plate can be improved. Therefore, the cap plate according to the present invention can be manufactured by a simple process through the above-described method for manufacturing the cap plate according to the first embodiment. FIG.7shows views illustrating a method for manufacturing a cap plate of a second embodiment according to the present invention. The method for manufacturing a safety vent of a cap plate for a secondary battery of the second embodiment according to the present invention uses the above-described method for manufacturing the safety vent of the cap plate as shown inFIGS.1,3to5, and7, and is presumed to include all of the above-described method for manufacturing the safety vent of the cap plate. Thus, according to the method for manufacturing the cap plate of the second embodiment according to the present invention, the material plate1supplied in the safety vent forming step100is formed of a rectangular material plate1having a rectangular periphery and elongated in the front and rear directions. In the safety vent forming step100, when the rectangular material plate1is forged, a tight protruding part54is further formed on a periphery of the upper portion of the lower forming portion5so that the periphery of the rectangular material plate1comes into close contact. In the lower surface flattening forming step300, when the rectangular material plate1is forged, a tight protruding part54is further formed on a periphery of the upper portion of the lower forming portion5so that the periphery of the rectangular material plate1comes into close contact. In addition, according to the method for manufacturing the cap plate of the second embodiment according to the present invention, after the lower surface flattening forming step300proceeds, a post-forging forming step further proceeds in which a configuration different from a configuration of the safety vent2is formed by operating the press P by putting the formed rectangular material plate1into the next forging process. Thus, the cap plate is manufactured. In other words, in the post-forging forming step, a rivet mount portion consisting essentially of a fluid inlet hole and a rivet hole is required to be forged and formed. In addition, a terminal plate or component fixing holes may be further molded through forging according to a type of the cap plate. Accordingly, the method for manufacturing the cap plate of the second embodiment according to the present invention is the useful invention, since the cap plate is simply manufactured through the post-forging forming step after simply forming the safety vent2using only once or two times of forging processes as described above, so that the productivity of manufacturing a cap plate can be improved. Therefore, the cap plate according to the present invention can be manufactured by a simple process through the above-described method for manufacturing the cap plate according to the second embodiment. Although the preferred embodiment of the present invention has been described above, the present invention may use various changes, modifications, and equivalents. It is obvious that the present invention may be applied in the same manner by appropriately modifying the above embodiments. Therefore, the above description does not limit the scope of the invention as defined by the limitations of the following claims. Although the detailed description of the present invention has been described exemplary embodiments, it shall be apparent to a person having ordinary skill in the art that various modifications are available without departing from the scope of the invention. [Description of Reference Numerals]1: Material plate2: Safety vent21: Vent plate3: Discharge material portion31: Residual material part4: Upper forming portion41: Safety vent insertion part5: Lower forming portion51: Elongated hole52: Peripheral discharge part53: Discharge material portion insertionhole54: Tight protruding part6: Cutting device61: Internal cutting member62a, 62b, 62c, 62d: Front, rear, left andright cutting membersC: Slant blade portionD1: Upper elevating moldD2: Lower elevating moldP: Press | 17,714 |
11858025 | DETAILED DESCRIPTION A process is provided for making bulk textured material sheeting. As a continuous supply of flat material sheeting is fed, the sheeting is repeatedly impacted with toothed knives, each knife creating a row of raised and generally pointed (nail-like) structures on the sheeting to texture the sheeting. The process is shown in summary form inFIG.1. A feed mechanism draws the material2from a self-wound coil1(or supply reel). The material is fed into an apparatus3for texturing. The apparatus includes a base6. The apparatus uses knives (not shown) to impact the material and raise pointed structures on its surface. The material emerges from the apparatus now bearing pointed structures. This textured material4is then guided into a coil5(or onto a take-up reel). As shown inFIG.2, the material2may also be textured on both sides. A feed mechanism draws the material2from the self—wound coil1(or supply reel). The material is fed into a modified apparatus3, that includes opposed impacting sections (knives disposed on both sides of the material—not shown). The material emerges from the apparatus now bearing pointed structures on both sides. This textured material4is then guided into a coil5(or onto a take-up reel). Alternatively, a roll of single-sided textured material4may be run through the apparatus a second time to texture the opposing face using appropriate support to protect the first face's pointed structures. As shown inFIG.5, the pointed structures may be in the form of hooks. Each hook is integrally formed from the material itself that is gouged or scraped up from the surface of the material by the impacting knives. The hooks are not punched through from the opposing side, so the underlying material is not punctured or perforated, but retains the integrity of its continuous body. Detail of the pointed structures (here, hooks) is shown inFIG.4. The apparatus and tooling can be modified to form various shapes, dimensions and densities of hooks, depending on the material requirements and tolerances. The knives of the apparatus are preferably in a pack with opposing knives being positioned offset from each other (i.e. an “A” set of knives and a “B” set of knives interleaved with each other in a pack, with the “A” set extended out to one side and the “B” set extended out to the other side). Side impacts from the apparatus force the “A” and “B” sets toward each other, so that the teeth of the knives gouge or scrape up hooks from the surface of the material. Various types of apparatus may be used to drive the knives and form the hooks. One useful embodiment uses a press to actuate the toothed knives generally into and across the surface of the material sheeting. As shown inFIG.3, apparatus3includes an upper die plate13(this may be mounted in a press, or be part of a free standing assembly actuated by an independent press—as in CA 2,760,923, filed on Dec. 6, 2011, publication forthcoming). Transverse slide rods16are suspended from the apparatus and slide within slots in the knives10. Return springs (not shown) are connected to the slide rods to bias the slide rods toward each other. A pressure plate19is disposed above the knives. Two block housings21are mounted transversely on the upper die plate adjacent to the edges of the knives. A drive block22is mounted on each block housing by slide bolt23, which is disposed substantially parallel to the longitudinal axis of the knives. A slide block24is slidably mounted in each housing adjacent to the drive block. The apparatus3and3′ includes the base6(seeFIGS.1and2). At least one of the knives10extends along a knife axis21and is mounted above the base6. In operation, a press (not shown) drives upper die plate13of the apparatus3onto the material that has been fed into a material strike zone below knives10. The force of the press causes the slide block24to impact the bottom surface of the press (not shown) before the knives10impact the surface of the material. The impact against the bottom surface of the material drives the slide block up relative to the drive block22, causing the angled surface of24to exert a force on the drive block in a direction substantially parallel to the longitudinal axis of the knives. This force causes each drive block to move separate individual knives in the pack in opposing directions along their respective longitudinal axes. Because only alternate knives contact each drive block before impact, adjacent knives are pushed in opposite directions by each drive block. Preferably, the knives are moving before contact with the material surface. The teeth11of the knives are pushed down into the material, and the knives also slide along slide rods16parallel to their longitudinal axes. These simultaneous downward and sliding movements cause each tooth11of a knife to form one pointed structure (hook). After the press lifts, the slide block24is returned to its starting position by compress springs20, and the knives10and drive block22are returned to their starting positions by other springs (not shown). The knives are withdrawn from the material, which is then advanced by the feed mechanism (in a progression) to form another textured section. FIGS.4and5show a possible embodiment of the textured material sheeting in finished form. As shown, the material may be coiled onto itself (or on a take-up reel) and sold as a bulk (mechanical-attachment-ready) material. The finished material can be cut into specific products or combined with one or more heterogeneous materials in a double- or multi-ply laminate. Material may also be directed to other downstream operations (e.g., stamping into shaped parts/strips/pieces, joining with one or more heterogeneous materials in a laminate, or other forming. The bulk material in one embodiment may be roll-formed or bent to take on a three-dimensional shape (e.g. cylindrical or other shaped tube). Various ductile materials can be used with this process. Although metal sheeting is shown inFIGS.4and5, the process has also been found to work on various harder plastics (Shore hardness of approximately D55 and up) and other materials in a range of widths and thicknesses. The sheeting can also be cooled or heated prior to impacting in order to make it more ductile or otherwise amenable to the texturing operation. For example, soft and rubbery materials (including those below the suggested Shore hardness of DSS) may be cooled or frozen to apply this process. Further, although the material may be selected to retain and hold an upstanding pointed structure as taught and shown, there may also be advantages in processing material according to this method where the hooks do not stay raised but collapse on themselves. The process may be advantageous simply for roughening or providing a disturbed surface on a material. FIG.6shows aspects30related to a first knife and a second knife. At32, a first knife is mounted above the base6, the first knife extends along a generally horizontal knife axis21, and includes a plurality of teeth11that are spaced apart along the knife axis21, the first knife being moveable vertically towards the base6and horizontally across the base6. At34, a second knife is mounted above the base6, the second knife extends generally parallel to the knife axis21and is moveable vertically towards the base6and horizontally across the base6. At36, the second knife is actuated generally downward and across the first side of the sheet of metal2in a second widthwise direction to form a second plurality of raised and pointed structures that extend in a direction that is opposite to the first plurality of raised and pointed gouged structures. The first widthwise direction is different than the second widthwise direction. At38, The second knife is actuated generally downward and across the first side of the sheet of metal2in a second widthwise direction to form a second plurality of raised and pointed structures that extend in a direction that is opposite to the first plurality of raised and pointed gouged structures. This aspect may be generally seen inFIG.5. The first widthwise direction is different than the second widthwise direction (see alsoFIG.5). At40, a pack including a first plurality of knives and a second plurality of knives that are interleaved and offset with one another is shown. The foregoing description illustrates only certain preferred embodiments of the invention. The invention is not limited to the foregoing examples. That is, persons skilled in the art will appreciate and understand that modifications and variations are, or will be, possible to utilize and carry out the teachings of the invention described herein. The scope of the claims should not be limited by the preferred embodiments set forth in the examples, but should be given the broadest purposive construction consistent with the description as a whole. | 8,907 |
11858026 | DESCRIPTION OF THE PREFERRED EMBODIMENTS It will be appreciated that the specific elements and embodiments illustrated in the figures herein and described in the following specification are simply exemplary embodiments of the disclosed concept, which are provided as non-limiting examples solely for the purpose of illustration. Therefore, specific dimensions, orientations, assembly, number of components used, embodiment configurations and other physical characteristics related to the embodiments disclosed herein are not to be considered limiting on the scope of the disclosed concept. Directional phrases used herein, such as, for example, clockwise, counterclockwise, left, right, top, bottom, upwards, downwards and derivatives thereof, relate to the orientation of the elements shown in the drawings and are not limiting upon the claims unless expressly recited therein. As used herein, the singular form of “a,” “an,” and “the” include plural references unless the context clearly dictates otherwise. As used herein, “movably coupled” means that two elements are coupled in a manner such that at least some movement of one or both of the elements with respect to the other element is permitted without uncoupling the elements. For example, a door is “movably coupled” to a door frame by one or more hinges. As used herein, “selectively coupled” means that two or more elements are coupled in a manner which may be readily undone without causing damage to either of such elements. For example, two elements that are bolted or screwed together are “selectively coupled”, while two elements that are glued or welded together are not “selectively coupled” as used herein. As used herein, “structured to [verb]” means that the identified element or assembly has a structure that is shaped, sized, disposed, coupled and/or configured to perform the identified verb. For example, a member that is “structured to move” is movably coupled to another element and includes elements that cause the member to move or the member is otherwise configured to move in response to other elements or assemblies. As such, as used herein, “structured to [verb]” recites structure and not function. Further, as used herein, “structured to [verb]” means that the identified element or assembly is intended to, and is designed to, perform the identified verb. Thus, an element that is merely capable of performing the identified verb but which is not intended to, and is not designed to, perform the identified verb is not “structured to [verb].” As used herein, in a term such as, but not limited to, “[X] structured to [verb] [Y],” the “[Y]” is not a recited element. Rather, “[Y]” further defines the structure of “[X].” That is, assume in the following two examples “[X]” is “a mounting” and the [verb] is “support.” In a first example, the full term is “a mounting structured to support a flying bird.” That is, in this example, “[Y]” is “a flying bird.” It is known that flying birds, as opposed to swimming birds or walking birds, typically grasp a branch for support. Thus, for a mounting, i.e., “[X],” to be “structured” to support a bird, the mounting is shaped and sized to be something a bird is able to grasp similar to a branch. This does not mean, however, that the bird is a recited element. In a second example, “[Y]” is a house; that is the second exemplary term is “a mounting structured to support a house.” In this example, the mounting is structured as a foundation as it is well known that houses are supported by foundations. As before, the house is not a recited element, but rather defines the shape, size, and configuration of the mounting, i.e., the shape, size, and configuration of “[X]” in the term “[X] structured to [verb] [Y].” As used herein, “associated” means that the elements are part of the same assembly and/or operate together, or, act upon/with each other in some manner. For example, an automobile has four tires and four hubcaps. While all the elements are coupled as part of the automobile, it is understood that each hubcap is “associated” with a specific tire. As used herein, a “coupling assembly” includes two or more couplings or coupling components. The components of a coupling or coupling assembly are generally not part of the same element or other component. As such, the components of a “coupling assembly” may not be described at the same time in the following description. Further, as used herein, a “cooperative coupling” or a “cooperative coupling assembly” includes two or more couplings or coupling components. The components of a cooperative coupling assembly are generally not part of the same element or other component. As such, the components of a “cooperative coupling assembly” may not be described at the same time in the following description. “Cooperative coupling assemblies” include, but are not limited to, (1) a combination of a nut, a bolt and passages in other elements through which the bolt extends, (2) a screw/rivet and passages in other elements through which the screw/rivet extend, and (3) tongue-and-groove assemblies. As used herein, a “unilateral coupling” or a “unilateral coupling assembly” means a construct that is structured to be coupled to another element or assembly wherein the other element or assembly is not structured to be coupled to the “unilateral coupling.” “Unilateral coupling assemblies” include, but are not limited to clamps, tension members (e.g., a rope), and adhesive constructs. Further, it is understood that the nature of such constructs as a “unilateral coupling assembly” depend upon the other element to which the coupling assembly is coupled. That is, for example, reins on a horse are a “unilateral coupling” when coupled to a tree because the tree is not a construct that is structured to be coupled to the reins. Conversely, reins on a horse are a “cooperative coupling” when coupled to a hitching post because a hitching post is a construct that is structured to be coupled to the reins. As used herein, a “coupling” or “coupling component(s)” is one or more component(s) of a “coupling assembly,” i.e., either a “cooperative coupling” or a “unilateral coupling.” That is, a cooperative coupling assembly includes at least two components that are structured to be coupled together. It is understood that the components of a cooperative coupling assembly are compatible with each other. For example, in a cooperative coupling assembly, if one coupling component is a snap socket, the other cooperative coupling component is a snap plug, or, if one cooperative coupling component is a bolt, then the other cooperative coupling component is a nut (as well as an opening through which the bolt extends) or threaded bore. In a “unilateral coupling,” the “coupling” or “coupling component” is the construct that is structured to be coupled to another construct. For example, given a rope with a loop formed thereon, the loop in the rope is the “coupling” or “coupling component.” As used herein, a “fastener” is a separate component structured to couple two or more elements. Thus, for example, a bolt is a “fastener” but a tongue-and-groove coupling is not a “fastener.” That is, the tongue-and-groove elements are part of the elements being coupled and are not a separate component. As used herein, the statement that two or more parts or components are “coupled” shall mean that the parts are joined or operate together either directly or indirectly, i.e., through one or more intermediate parts or components, so long as a link occurs. As used herein, “directly coupled” means that two elements are directly in contact with each other. As used herein, “fixedly coupled” or “fixed” means that two components are coupled so as to move as one while maintaining a constant orientation relative to each other. Accordingly, when two elements are coupled, all portions of those elements are coupled. A description, however, of a specific portion of a first element being coupled to a second element, e.g., an axle first end being coupled to a first wheel, means that the specific portion of the first element is disposed closer to the second element than the other portions thereof. Further, an object resting on another object held in place only by gravity is not “coupled” to the lower object unless the upper object is otherwise maintained substantially in place. That is, for example, a book on a table is not coupled thereto, but a book glued to a table is coupled thereto. As used herein, the phrase “removably coupled” or “temporarily coupled” means that one component is coupled with another component in an essentially temporary manner. That is, the two components are coupled in such a way that the joining or separation of the components is easy and would not damage the components. For example, two components secured to each other with a limited number of readily accessible fasteners, i.e., fasteners that are not difficult to access, are “removably coupled” whereas two components that are welded together or joined by difficult to access fasteners are not “removably coupled.” A “difficult to access fastener” is one that requires the removal of one or more other components prior to accessing the fastener wherein the “other component” is not an access device such as, but not limited to, a door. As used herein, “temporarily disposed” means that a first element(s) or assembly (ies) is(are) resting on a second element(s) or assembly(ies) in a manner that allows the first element/assembly to be moved without having to decouple or otherwise manipulate the first element. For example, a book simply resting on a table, i.e., the book is not glued or fastened to the table, is “temporarily disposed” on the table. As used herein, “operatively coupled” means that a number of elements or assemblies, each of which is movable between a first position and a second position, or a first configuration and a second configuration, are coupled so that as the first element moves from one position/configuration to the other, the second element moves between positions/configurations as well. It is noted that a first element may be “operatively coupled” to another without the opposite being true. With regard to electronic devices, a first electronic device is “operatively coupled” to a second electronic device when the first electronic device is structured to, and does, send a signal or current to the second electronic device causing the second electronic device to actuate or otherwise become powered or active. As used herein, the statement that two or more parts or components “engage” one another means that the elements exert a force or bias against one another either directly or through one or more intermediate elements or components. Further, as used herein with regard to moving parts, a moving part may “engage” another element during the motion from one position to another and/or may “engage” another element once in the described position. Thus, it is understood that the statements, “when element A moves to element A first position, element A engages element B,” and “when element A is in element A first position, element A engages element B” are equivalent statements and mean that element A either engages element B while moving to element A first position and/or element A engages element B while in element A first position. As used herein, “operatively engage” means “engage and move.” That is, “operatively engage” when used in relation to a first component that is structured to move a movable or rotatable second component means that the first component applies a force sufficient to cause the second component to move. For example, a screwdriver may be placed into contact with a screw. When no force is applied to the screwdriver, the screwdriver is merely “temporarily coupled” to the screw. If an axial force is applied to the screwdriver, the screwdriver is pressed against the screw and “engages” the screw. However, when a rotational force is applied to the screwdriver, the screwdriver “operatively engages” the screw and causes the screw to rotate. Further, with electronic components, “operatively engage” means that one component controls another component by a control signal or current. As used herein, in the phrase “[x] moves between its first position and second position,” or, “[y] is structured to move [x] between its first position and second position,” “[x]” is the name of an element or assembly. Further, when [x] is an element or assembly that moves between a number of positions, the pronoun “its” means “[x],” i.e., the named element or assembly that precedes the pronoun “its.” As used herein, “correspond” indicates that two structural components are sized and shaped to be similar to each other and may be coupled with a minimum amount of friction. Thus, an opening which “corresponds” to a member is sized slightly larger than the member so that the member may pass through the opening with a minimum amount of friction. This definition is modified if the two components are to fit “snugly” together. In that situation, the difference between the size of the components is even smaller whereby the amount of friction increases. If the element defining the opening and/or the component inserted into the opening is made from a deformable or compressible material, the opening may even be slightly smaller than the component being inserted into the opening. With regard to surfaces, shapes, and lines, two, or more, “corresponding” surfaces, shapes, or lines have generally the same size, shape, and contours. With regard to elements/assemblies that are movable or configurable, “corresponding” means that when elements/assemblies are related and that as one element/assembly is moved/reconfigured, then the other element/assembly is also moved/reconfigured in a predetermined manner. For example, a lever including a central fulcrum and elongated board, i.e., a “see-saw” or “teeter-totter,” the board has a first end and a second end. When the board first end is in a raised position, the board second end is in a lowered position. When the board first end is moved to a lowered position, the board second end moves to a “corresponding” raised position. Alternately, a cam shaft in an engine has a first lobe operatively coupled to a first piston. When the first lobe moves to its upward position, the first piston moves to a “corresponding” upper position, and, when the first lobe moves to a lower position, the first piston, moves to a “corresponding” lower position. As used herein, a “path of travel” or “path,” when used in association with an element that moves, includes the space an element moves through when in motion. As such, any element that moves inherently has a “path of travel” or “path.” Further, a “path of travel” or “path” relates to a motion of one identifiable construct as a whole relative to another object. For example, assuming a perfectly smooth road, a rotating wheel (an identifiable construct) on an automobile generally does not move relative to the body (another object) of the automobile. That is, the wheel, as a whole, does not change its position relative to, for example, the adjacent fender. Thus, a rotating wheel does not have a “path of travel” or “path” relative to the body of the automobile. Conversely, the air inlet valve on that wheel (an identifiable construct) does have a “path of travel” or “path” relative to the body of the automobile. That is, while the wheel rotates and is in motion, the air inlet valve, as a whole, moves relative to the body of the automobile. As used herein, a “planar body” or “planar member” is a generally thin element including opposed, wide, generally parallel surfaces, i.e., the planar surfaces of the planar member, as well as a thinner edge surface extending between the wide parallel surfaces. That is, as used herein, it is inherent that a “planar” element has two opposed planar surfaces with an edge surface extending therebetween. The perimeter, and therefore the edge surface, may include generally straight portions, e.g., as on a rectangular planar member such as on a credit card, or be curved, as on a disk such as on a coin, or have any other shape. As used herein, the word “unitary” means a component that is created as a single piece or unit. That is, a component that includes pieces that are created separately and then coupled together as a unit is not a “unitary” component or body. As used herein, “unified” means that all the elements of an assembly are disposed in a single location and/or within a single housing, frame or similar construct. As used herein, the term “number” shall mean one or an integer greater than one (i.e., a plurality). That is, for example, the phrase “a number of elements” means one element or a plurality of elements. It is specifically noted that the term “a ‘number’ of [X]” includes a single [X]. As used herein, a “radial side/surface” for a circular or cylindrical body is a side/surface that extends about, or encircles, the center thereof or a height line passing through the center thereof. As used herein, an “axial side/surface” for a circular or cylindrical body is a side that extends in a plane extending generally perpendicular to a height line passing through the center. That is, generally, for a cylindrical soup can, the “radial side/surface” is the generally circular sidewall and the “axial side(s)/surface(s)” are the top and bottom of the soup can. Further, as used herein, “radially extending” means extending in a radial direction or along a radial line. That is, for example, a “radially extending” line extends from the center of the circle or cylinder toward the radial side/surface. Further, as used herein, “axially extending” means extending in the axial direction or along an axial line. That is, for example, an “axially extending” line extends from the bottom of a cylinder toward the top of the cylinder and substantially parallel to, or along, a central longitudinal axis of the cylinder. As used herein, a “tension member” is a construct that has a maximum length when exposed to tension, but is otherwise substantially flexible, such as, but not limited to, a chain or a cable. As used herein, “generally curvilinear” includes elements having multiple curved portions, combinations of curved portions and planar portions, and a plurality of linear/planar portions or segments disposed at angles relative to each other thereby forming a curve. As used herein, an “elongated” element inherently includes a longitudinal axis and/or longitudinal line extending in the direction of the elongation. As used herein, “about” in a phrase such as “disposed about [an element, point or axis]” or “extend about [an element, point or axis]” or “[X] degrees about an [an element, point or axis],” means encircle, extend around, or measured around. When used in reference to a measurement or in a similar manner, “about” means “approximately,” i.e., in an approximate range relevant to the measurement as would be understood by one of ordinary skill in the art. As used herein, “generally” means “in a general manner” relevant to the term being modified as would be understood by one of ordinary skill in the art. As used herein, “substantially” means “by a large amount or degree” relevant to the term being modified as would be understood by one of ordinary skill in the art. As used herein, “at” means on and/or near relevant to the term being modified as would be understood by one of ordinary skill in the art. As used herein, a “standard beverage can” or “standard beverage can body” means a generally cylindrical, aluminum can body for a twelve ounce beverage such as, but not limited to, soda or beer. A “standard beverage can” includes, but is not limited to, a “202 beverage can” and cans having a similar shape. See, http://www.cancentral.com/beverage-cans/standards. As used herein, a “dynamic” element is an element that moves during the formation of a can body. Conversely, a “static” element is an element that does not move during the formation of a can body. As used herein, “cooperative” cam surfaces mean two cam surfaces that extend generally parallel to each other and which are structured to be, and/or are, operatively coupled to the same element or assembly. For example, the inner radial surface and the outer radial surface on a generally toroid cam body wherein the two surfaces impart a motion to the same element or assembly are “cooperative” cam surfaces. That is, the inner radial surface and the outer radial surface extend generally parallel to each other. It is understood that the “cooperative” cam surfaces do not necessarily operatively engage the other element or assembly at the same time. That is, when the “cooperative” cam surfaces are defined by a ridge, the “cooperative” cam surfaces do not operatively engage the other element or assembly at the same time. Conversely, when the “cooperative” cam surfaces are defined by a groove, the “cooperative” cam surfaces selectively, operatively engage the other element or assembly at the same time. That is, when the “cooperative” cam surfaces are defined by a groove, the “cooperative” cam surfaces, or portions thereof, are structured to both operatively engage the other element or assembly at the same time, or, are structured to individually operatively engage the other element or assembly at a given time. As used herein, a “direct” [ram] drive assembly means a drive assembly for a ram assembly wherein a rotational motion is converted to a reciprocal motion without a pivoting construct such as, but not limited to, a swing arm. Further, a “direct” [ram] drive assembly means a drive assembly for a ram assembly wherein a rotational motion is converted to a reciprocal motion without a gear box structured to convert rotational motion to a reciprocal motion. That is, to be a “direct” drive assembly, the moving elements of the drive assembly either rotate with, or otherwise correspond to the rotation of, a motor output shaft, or, move generally linearly with the ram assembly. As used herein, to “rotate with, or otherwise correspond to the rotation of, a motor output shaft” does not include a reciprocal pivoting motion that corresponds to the rotation of a motor output shaft. As used herein, to “move generally linearly with the ram assembly” means that an element moves over a path that is generally parallel to, or aligned with, the path of the ram assembly. As used herein, a pivoting construct such as, but not limited to, a swing arm cannot “move generally linearly with the ram assembly.” As used herein, a “single source/[X]-output ram drive assembly” means that the drive assembly includes a single motor, or similar construct that generates motion, that is operatively coupled to [X] forming assemblies where “[X]” is an integer greater than one. Further, a “single motor” means a single construct or assembly that generates motion and which is the only such construct that is operatively coupled to the forming assemblies. That is, as a counter example, a bodymaker with a drive assembly having two motors disposed in an enclosure wherein each motor is coupled to a ram may be described as having a single “drive assembly” (as the motors are disposed in an enclosure), but the drive assembly is not a “single source/[X]-output ram drive assembly” because neither motor is the “single construct or assembly that generates motion and which is the only such construct that is operatively coupled to the forming assemblies.” Stated alternately, merely coupling multiple motors to a housing or similar construct does not convert the multiple motors into a “single source/[X]-output ram drive assembly.” As used herein, a “prime axis of rotation” for a bodymaker ram drive assembly means an axis of rotation of a rotating ram drive assembly element wherein that element is operatively coupled to a plurality of ram assemblies/ram bodies. It is noted that in a bodymaker drive assembly with a crank operatively coupled to two swing arms, and each swing arm coupled to separate connecting rods, and each connecting rod coupled to a separate ram assembly/ram body, the couplings between the connecting rod and a ram assembly/ram body is not a “prime axis of rotation” as the connecting rod is operatively coupled to a single ram assembly/ram body. Further, a “prime axis of rotation” means that the rotating element rotates rather than pivots. That is, for example, a bodymaker crank may have a “prime axis of rotation” but a bodymaker pivoting swing arm can never have a “prime axis of rotation.” As noted above, a ram body moves between a retracted, first position and an extended, second position. Further, a ram body moves over a path with a number of medial positions between the first position and the second position. Thus, as used herein, a ram assembly or a ram body in a “medial position” means that the ram assembly or a ram body is disposed at a position between the first position and the second position. Further, a ram assembly or a ram body in a “medial position” means that the ram assembly or the ram body is moving toward either the first position or the second position. The direction the ram assembly or the ram body is moving is, when needed, indicated by the terms “forward” or “rearward.” That is, when the ram body is moving toward the second position and is in a medial position, the ram body is, as used herein, in a “forward” medial position. The term “forward” indicates the direction associated with the ram assembly or a ram body in a medial position. Conversely, when the ram assembly or the ram body is moving toward the first position and is in a medial position, the ram assembly or the ram body is, as used herein, in a “rearward” medial position. That is, the term “rearward” indicates the direction associated with the ram assembly or the ram body in a medial position. As noted, the terms “forward” and “rearward” are used when needed for clarity. Thus, as used herein, the statement that, “no two ram bodies are in the same medial position at one time” includes a configuration wherein two different ram assemblies/ram bodies are at the midpoint between the first and second positions, but wherein the two different ram assemblies/ram bodies are moving in different directions. Further, it is understood that, and as used herein, when the ram body is exactly at the first or second position, the ram body is not moving forward or rearward; thus, a ram body at the first or second position does not have an associated direction. Further, a medial “position” is selectively identified by “[X]%” wherein the percentage means the portion of the path between the two end positions. That is, for example, a ram body at the “forward 25%” position means that the ram body is moving toward the second position and has traveled 25%, i.e., one quarter, of the distance between the first and second positon. As a further example, a ram body at the “rearward 50%” position means that the ram body is moving toward the first position and has traveled 50%, i.e., one half, of the distance between the first and second positon. Further, a ram assembly that is in a “forward” medial position is, depending upon the position of the blank/cup, in a “forming” position. That is, as used herein, the “forming” position occurs when the blank/cup is moving through the bodymaker die pack. Referring now toFIGS.2-6, a can bodymaker10in accordance with one example embodiment of the disclosed concept is shown. The bodymaker10includes a forming system12and a mounting assembly14. The forming system12includes a number of forming assemblies16(four are shown in the example ofFIGS.2-6, labeled16A-16D) and a ram drive assembly300. In one exemplary embodiment, the bodymaker10and/or each forming assembly16is structured to, and does, form standard beverage can bodies. The mounting assembly14is structured to, and does, support the number of forming assemblies16. The mounting assembly14is further structured to, and does, rotatably support a cam330, discussed below, of the ram drive assembly300. In one exemplary embodiment, the mounting assembly14includes a generally planar mounting assembly body18. Referring toFIG.3, the mounting assembly body18is oriented to be generally horizontal and includes an upper, first surface22and a lower, second surface24opposite the first surface30. Further, and for a bodymaker10including four forming assemblies16A,16B,16C,16D, the mounting assembly body18is generally square. It is understood that the shape of the mounting assembly body18may be varied so long as the mounting assembly body18is structured to support the number of forming assemblies16. In an exemplary embodiment, the mounting assembly body18defines a generally centrally disposed passage20that extends between the first and second surfaces22and24of the mounting assembly body18. Continuing to refer toFIG.3, in the exemplary embodiment shown, the mounting assembly14further includes a number of depending element(s)26disposed at the perimeter of the mounting assembly body18. If there is a single mounting assembly depending element26extending about the perimeter of the mounting assembly body18, the single mounting assembly depending element26forms a housing28defining an enclosed space30under the mounting assembly body18. If there are a plurality of relatively thin, spaced separate mounting assembly depending elements26, the separate mounting assembly depending elements26are identified herein as “legs,” similar to table legs. The mounting assembly depending element(s)26are structured to, and do, support the mounting assembly body18and elements disposed thereon. Further, in an example embodiment, the first surface22of the mounting assembly body18defines a number of recesses34(FIGS.4and6), each recess34being for a corresponding forming assembly16. In an exemplary embodiment, each recess34is a “machined” recess34. As used herein, a “machined” recess means a recess having contours structured to specifically position a forming assembly16on the mounting assembly body18, and thus specifically position the forming assembly16relative to the ram drive assembly300and the cam330. As used herein, “specifically position” means to position a forming assembly16relative to the ram drive assembly300and the cam330in a manner wherein further positioning of the forming assembly16, and/or elements thereof, relative to the ram drive assembly300is not required. That is, while typically not mentioned in references/patents, it is well known that the position of elements of a forming assembly16are adjusted following installation so as to ensure proper alignment of the elements. Thus, unless the lack of adjustment of the forming assembly16(or elements thereof) relative to the ram drive assembly300(or elements thereof) is specifically mentioned in a reference/patent, then the reference/patent does not disclose a configuration wherein the forming assembly16, and/or elements thereof, are “specifically position[ed].” That is, unless the lack of adjustment of the forming assembly16, and/or elements thereof, is specifically mentioned in a reference/patent, then the reference/patent does not disclose a “machined” recess, as used herein. Further, in another exemplary embodiment, each recess34includes a number, and as shown a plurality, of guide pin passages36defined in, and extending through the mounting assembly body18. Each guide pin passage36has a cross-sectional area structured to accommodate a guide bushing37. Each guide bushing37includes a toroid body38. Each guide bushing37is disposed in a corresponding passage36. Each guide bushing37is structured to allow a guide pin39to be passed therethrough. The forming assemblies16are substantially similar and as such only one is described in detail herein. As previously mentioned, it is noted that the different forming assemblies16shown in the Figures are identified by additional letters. Thus, when there are four forming assemblies16, such as shown in the example ofFIG.2, the separate forming assemblies16are identified as forming assemblies16A,16B,16C,16D. This numbering convention applies to the elements of the forming assemblies16A,16B,16C,16D as well. That is, while the generic, single forming assembly16is described as having a die pack56, the first forming assembly16A has a die pack56A and the second forming assembly16B has a die pack56B, and so forth. Referring now toFIGS.3and4, a forming assembly16includes a stationary assembly42and a moving assembly44. In one example embodiment, not shown, the stationary assembly42is coupled, directly coupled, or fixed to the first surface22of the mounting assembly body18, and the moving assembly44is movably coupled to the first surface22of the mounting assembly body18via the stationary assembly42. In the embodiment shown, and as described below, the stationary assembly42and the moving assembly44are a “unified” assembly that is structured to be, and is, temporarily coupled to the mounting assembly body18. That is, the elements of the stationary assembly42and the moving assembly44are coupled, directly coupled, or fixed to each other. Further, the stationary assembly42and the moving assembly44are structured to be, and are, temporarily coupled to a stationary assembly base50, as discussed below. In this configuration, the forming assembly16is a unified assembly. As shown in the example embodiment ofFIG.4, the stationary assembly42of the forming assembly16includes the stationary assembly base50, a ram guide assembly52, a redraw assembly200, a die pack56and a domer58. The base50includes a generally planar member60with a number of upwardly depending, generally planar supports62. The planar member60is structured to, i.e., is machined to, substantially correspond to the recess34defined in the first surface22of the mounting assembly body18. The planar member60has a proximal end64and a distal end66. When the forming assembly16is operatively coupled to the ram drive assembly300, the proximal end64of the planar member60is the end closer to the cam330of the ram drive assembly300and the distal end66of the planar member60is the end further from the cam330of the ram drive assembly300. In one example embodiment, the planar member60includes a number, and as shown a plurality, of guide pin passages68extending through the planar member60of the base50of the stationary assembly42. The number of guide pin passages68are disposed in a pattern corresponding to the guide pin passages36of the recess34of the mounting assembly body18previously discussed. Each guide pin passage68has a cross-sectional area structured to accommodate a guide bushing69. The number of guide pin passages36of the recess34and the number of guide pin passages68of the planar member60, along with the associated guide bushings37and69thereof, are structured to position each forming assembly16relative to the cam330. That is, in an embodiment including the guide pin passages36,68, when a planar member60is disposed in a machined recess34, each guide pin passage36generally aligns with an associated guide pin passage68. Further, when guide pins39are passed through the associated guide pin passages36,68(and the associated bushings37,69), the planar member60is brought into alignment with the cam330. Although two sets of associated guide pin passages36and68are shown, it is to be appreciated that the quantity of associated guide pin passages36and68may be varied without varying from the scope of the disclosed concept. The supports62of the base50include at least a domer support70. The domer support70includes a generally planar body72that may be a separate member coupled to the planar member60, or may be formed unitarily with the planar member60. As shown, the body72of the domer support70extends generally laterally relative to a longitudinal axis L of a ram body122, discussed below. The supports62of the base50further include a die pack support74which, as shown, is a frame76that is raised above the plane of the planar member60of the base50of the forming assembly16. Further, the supports62of the base50include a ram guide assembly support78that is structured to, and does, support the ram guide assembly52of the stationary assembly42. As shown, the ram guide assembly support78includes a generally planar body79that may be a separate member coupled to the planar member60, or may be formed unitary with the planar member60. The body79extends generally parallel to the plane of the body72of the domer support70. Continuing to refer toFIG.4, as well as toFIG.7B, the ram guide assembly52includes a housing80defining a passage81. A number of bearing assemblies82such as, but not limited to, hydrostatic/hydrodynamic bearing assemblies84(which also define a passage, not numbered) are disposed in the housing80. The bearing assemblies84are structured to, and do, support the ram body122as the ram body122reciprocates, as described below. The ram guide assembly52further includes a seal pack assembly86(FIG.4) that is structured to, and does, substantially remove the hydrostatic/hydrodynamic bearing fluid from the ram body122(discussed below), as is known. As shown inFIG.4andFIGS.8A-8C, the redraw assembly200includes both stationary elements and moving elements and is included herein with the stationary assembly42of the forming assembly16. In an exemplary embodiment, the redraw assembly200includes a hold down piston202(shown schematically) and a blank (cup) holder204. The blank holder204is coupled, directly coupled, or fixed to the hold down piston202and moves therewith. The hold down piston202and the blank holder204each include a generally toroid body206,208, respectively, each defining a central passage (not numbered) that is sized to allow a ram body122to pass therethrough. The redraw assembly200also includes a servo-motor209, or similar construct, that is structured to move the hold down piston202, and therefore the blank holder204, in a generally reciprocal motion. That is, the hold down piston202and the blank holder204are structured to move/translate in a linear fashion (e.g., along a translation axis229) between a first positioning, wherein the hold down piston202and the blank holder204are spaced from the die pack56, and, a second positioning wherein the hold down piston202and blank holder204are disposed immediately adjacent the die pack56. As is known, a cup feed assembly108(discussed below) or similar construct, positions a cup or blank at the mouth of the die pack56. The blank holder204maintains the cup/blank in this position until the ram body122engages the cup/blank and moves the cup/blank through the die pack56. In an exemplary embodiment, such as illustrated inFIG.4andFIGS.8A-8C, a servo-motor209is coupled to a number of cam disks214,214′ (two are shown in the illustrated example, further, it is noted that the cam330of the ram drive assembly300, discussed below, is identified as the “cam330”; while, as used herein, the “cam disk214” is identified as the “cam disk214”) and the hold down piston202and the blank holder204are coupled to, or biased against (i.e., away from the die pack56) the cam disk214via a number of suitable biasing members210(e.g., spring(s) or other suitable arrangement(s)). In the exemplary embodiment shown inFIG.4, the cam disk214is a generally planar body that is rotatable about a rotation axis215(disposed perpendicular to the aforementioned translation axis229of the hold down piston202and the blank holder204) by the servo motor209. The hold down piston202and the blank holder204are biased against the edge surface211of the cam disk214. The edge surface211of the cam disk214defines a forward stroke portion216, a forward dwell portion218, a backward stroke portion220and a backward dwell portion222. That is, as the forward stroke portion216engages the hold down piston202, the hold down piston202, and therefore the blank holder204, moves from the first position to the second position (i.e., toward the die pack56), compressing the number of biasing members210. As the forward dwell portion218engages the hold down piston202, the hold down piston202, and therefore the blank holder204, are maintained in the second position. As the backward stroke portion220engages the hold down piston202, the hold down piston202, and therefore the blank holder204, move from the second position to the first position (i.e., away from the die pack56) due to the force of the number of biasing members210. As the backward dwell portion222engages the hold down piston202, the hold down piston202, and therefore the blank holder204, are maintained in the first position. Thus, the hold down piston202, and therefore the blank holder204moves between the first and second positions while dwelling at those positions between periods of motion. This allows a cup/blank to be positioned between the blank holder204and the die pack56while the blank holder204dwells at the first position, and, allows the blank holder204to maintain a cup/blank at the die pack56while the blank holder204dwells at the second position. In another embodiment, not shown, the ram drive assembly300includes a linkage that moves the hold down piston202and the blank holder204between the first and second positions in a similar manner, i.e., moving with dwell periods in between motion periods, thus eliminating the cam disk214. FIGS.9A-9Cshow another exemplary embodiment of a redraw assembly200′ including a hold down piston202and blank holder204similar to redraw assembly200. The hold down piston202and blank holder204are slidably coupled to the die pack support74(e.g., via a number of linear bearing pins226and cooperating linear bearing bushings228) such that the hold down piston202and blank holder204are readily translatable along a translation axis229disposed perpendicular to the rotation axis215. Redraw assembly200′ functions similarly to the redraw assembly200ofFIG.4except the redraw assembly200′ utilizes a cam disk214′ having a groove230′ that is engaged by a roller member232or other suitable construct that is coupled to the hold down piston202. Optionally, redraw assembly200′ further utilizes a second cam disk214″ having a groove230″ that is likewise engaged by a second roller member232′. In operation, one or both of cam disks214′ and214″ are rotated about the rotation axis215by a servo-motor212, or similar construct that is directly coupled the servo motor212(as shown) or coupled thereto via a belt or other suitable arrangement. As one or both of cam disks214′ and214″ are rotated, the grooves230′ and230″ thereof interact with the roller members230and232, thus causing the hold down piston202and the blank holder204to translate back and forth along the translation axis229among a first positioning, wherein the hold down piston202and the blank holder204are spaced from the die pack56, and a second positioning, wherein the hold down piston202and the blank holder204are disposed immediately adjacent the die pack56. Moving on to the die pack56, the die pack56includes a number, and typically a plurality, of dies (none numbered). Each die includes a generally toroid body (none shown) having a central opening sized to iron and otherwise form the cup/blank into a can body (not shown). That is, as is well known, the die pack56is structured to reform/form a cup/blank disposed on a punch124/ram body122into a can body (discussed below). As such, the dies of the die pack56define a forming passage100having an upstream, proximal end102(or “mouth”102) and a downstream, distal end104. The redraw assembly200is disposed at the proximal end102of the forming passage100. Further, and as is known, the die pack56includes, or is disposed adjacent or immediately adjacent, a stripper assembly106structured to strip, i.e., remove, a can body from the ram body122during the return stroke, as described below. That is, the stripper assembly106is disposed at the distal end of the forming passage100. In an exemplary embodiment, the die pack56further includes a cup (or blank) feed assembly108. In an exemplary embodiment, the cup feed assembly108includes a servo-motor and a rotary support (neither numbered). Cups, or blanks, are disposed on the cup feed assembly rotary support. The cup feed assembly servo-motor is structured to, and does, rotate the cup feed assembly rotary support so that a cup (or blank) is positioned at the proximal end102of the forming passage100of the die pack56prior to the ram body122moving through the die pack56, as discussed below. The domer58includes a mounting assembly110and a domer body112. The mounting assembly110is structured to be coupled to the domer support70. The mounting assembly110is further structured to adjustably support the domer body112. The domer body112includes a domed surface114having a vertex116. The domed surface114/vertex116is disposed facing, and generally aligned with, the forming passage100of the die pack56, as is known. Referring toFIGS.4-6, the moving assembly44of the forming assembly16includes a ram assembly120and a cam follower assembly150. The ram assembly120includes an elongated body122(hereinafter, and as used herein, “ram body”122) and a punch124(hereinafter, and as used herein, “punch”124). The ram body122has a proximal, or first, end126, a medial portion125and a distal, or second, end128. As is known, the punch124is coupled, directly coupled, or fixed to the ram body distal end128. As is known, the distal end128has a smaller cross-sectional area relative to the proximal end126and the medial portion125. In an exemplary embodiment, the punch124has a cross-sectional area that is substantially similar to the proximal end126and the medial portion125. Thus, there is a generally, or a substantially, smooth transition between the punch124and the ram body122. The cam follower assembly150is disposed at, and coupled to, the proximal end126of the ram body122. Further, in an exemplary embodiment, the ram body122is generally hollow. That is, the ram body122defines a cavity130. The distal end128of the ram body122includes a passage129that is in fluid communication with the cavity130. Further, if a punch124is used, the punch124also includes an axially extending passage127. That is, the passage129of the ram body122(and, if included, the punch passage127) extends from the axial surface of the distal end128of the ram body122to the cavity130. The cavity130is selectively in fluid communication with a pressure assembly (discussed below). The pressure assembly is structured to, and does, generate a positive and/or a negative fluid pressure. As is known, the cavity130of the ram body122is selectively in fluid communication with a negative fluid pressure when the ram body122is moving forward (i.e., away from the ram drive assembly300). In this configuration, a negative fluid pressure biases the cup/blank toward the ram body122and/or punch124. When the ram body122is moving backward (i.e., toward the ram drive assembly300), a positive pressure helps to remove the now formed can body from the ram body122/punch124. As the ram body122is one of the longer elements of the forming assembly16, as used herein, the longitudinal axis L of the ram body122is also the longitudinal axis of the forming assembly16. Referring toFIGS.4,5and7A-7D, the cam follower assembly150of the moving assembly44of a forming assembly16includes a slider152and a number of cam follower members154(two are shown in the example). In an exemplary embodiment, the slider152includes a slider body160, a lower frame portion162extending downward from the slider body160, and an upper frame portion164extending upward from the slider body160. In the example illustrated, slider body160is disposed generally parallel to the plane of the first surface22of the mounting assembly body18, i.e., generally horizontally as shown. The lower frame portion162of the slider body160includes a first member162A extending downward generally from at or near a first edge160A of slider body16, a second member162B extending downward generally from at or near a second edge160B of slider body160opposite the first edge160A, and a third member162C extending between the first and second members162A and162B and spaced a distance below slider body160. In the example shown inFIG.7D, the third member162C extends generally horizontally, parallel to the slider body160, between first and second members162A and162B. Each of the first, second, and third members162A-162C may be formed integrally as portions of a single unitary member, such as shown in the example ofFIG.7D, or alternatively may be formed as separately and then coupled together via any suitable method (e.g., bolts, welding, etc.). The upper frame portion164of the slider body160includes a first member164A extending upward generally from at or near the first edge160A of slider body160, a second member164B extending upward generally from at or near the second edge160B of slider body160, and a third member164C extending between the first and second members164A and164B and spaced a distance above slider body160. Each of the first, second, and third members164A-164C may be formed integrally as portions of a single unitary member, such as shown in the example ofFIG.7D, or alternatively may be formed as separately and then coupled together via any suitable method (e.g., bolts, welding, etc.). Continuing to refer toFIGS.7A and7D, the cam follower assembly150further includes a cam follower bearing assembly165having a number of hydrostatic/hydrodynamic bearing pads166which are positioned and structured to engage with corresponding, cooperatively positioned, bearing members167provided as part(s) of stationary assembly42. Each bearing member167includes a bearing surface168upon which each bearing pad166is positioned and structured to slide. A hydrostatic/hydrodynamic bearing assembly is discussed in detail in U.S. Pat. No. 10,137,490 and the disclosure of the hydrostatic/hydrodynamic bearing assembly therein is incorporated herein by reference. Each bearing pad166includes a recessed bearing pocket169(two of which,169A and169C, are numbered inFIG.7D) that is structured to generally house a pressurized supply of oil or other suitable bearing fluid (not shown) provided therein (as discussed further below). Prior art drive assemblies, such as drive assembly2previously discussed in regard toFIG.1exert vertical forces on ram bodies, such as ram body7B, that must be addressed/managed by bearings that generally completely surround the ram body. Such vertical forces can result in ram “droop” However, unlike such prior art arrangements, arrangements utilizing a cam drive such as described herein are generally only subjected to moderate lateral forces and are not subjected to any meaningful vertical forces. Hence, the cam follower bearing assembly165is of unique design as compared to known arrangements. In the example illustrated inFIGS.7A-7D, the cam follower bearing assembly165includes three generally planar hydrostatic/hydrodynamic bearing pads166: a first bearing pad166A coupled, directly coupled, or fixed to an outward facing face of first member164A; a second bearing pad166B coupled, directly coupled, or fixed to an outward facing face of second member164B (i.e., facing in the opposite direction from first bearing pad166A); and a third bearing pad166C coupled, directly coupled, or fixed to an upward facing face of third member164C. In such example, the cam follower bearing assembly165also includes three bearing members167A,167B and167C, respectively having bearing surfaces168A,168B and168C. More particularly, the first bearing member167A is fixedly coupled to the stationary assembly base50of the forming assembly16such that the bearing surface168A thereof is positioned outward, above, and parallel to the longitudinal axis L of the ram body122of the forming assembly16, and generally perpendicular to the stationary assembly base50. The second bearing member167B is fixedly coupled to the stationary assembly base50of the forming assembly16such that the bearing surface168B thereof is positioned outward, above, and parallel to the longitudinal axis L of the ram body122of the forming assembly16; generally perpendicular to the stationary assembly base50, and facing the bearing surface168A of the first bearing member167A. The third bearing member167C is fixedly coupled to the stationary assembly base50of the forming assembly16such that the bearing surface168C thereof is positioned directly above and parallel to the longitudinal axis L of the ram body122of the forming assembly16, generally parallel to the stationary assembly base50, and perpendicular to each of the bearing surfaces168A and168B of the first bearing member167A and the second bearing member167B. Accordingly, as can be readily appreciated from the sectional view ofFIG.7C, the three bearing members167A-167C are positioned so as to form a downward opening channel (with the bearing surfaces168A-168C facing inward) that is disposed about the upper frame portion164of the slider body160and the outward facing bearings pads166A-166C thereof. In one exemplary embodiment in accordance with the disclosed concept, each of the bearing surfaces168A-168C are ground to a 4-8 micron surface finish and parallelism and squareness within 0.0002″. As previously discussed, the ram body122is generally hollow and defines the cavity130therein that is selectively in fluid communication with a pressure assembly. Such communication between a pressure assembly (not shown) and cavity130of ram body122is provided via a flexible conduit or hose170that extends between a lower rotary seal170A that is coupled to mounting assembly body18or any other suitable fixed location for connection to the aforementioned pressure assembly, and an upper rotary seal170B that is coupled to the lower frame portion162of the slider body160. The upper rotary seal170B is in fluid communication with the cavity130of the ram body via any suitable conduit arrangement provided as a part of cam follower assembly150. A shock absorber arrangement171is provided about hose170to minimize hose whipping resulting from the reciprocating movement of cam follower assembly150. As also previously discussed, each bearing pad166includes a recessed bearing pocket169that is structured to generally house a pressurized supply of oil or other suitable bearing fluid (not shown) provided therein. Such supply of oil or other suitable bearing fluid is provided in a similar manner as the conductive pressure arrangement just described. In other words, the supply of oil or other suitable bearing fluid is provided to a second upper rotary seal172B (seeFIGS.7B and7C) that is coupled to the lower frame portion162of the slider body160. The supply is provided via a hose coupled to a second lower rotary seal (neither of which are shown) positioned similarly to hose and lower rotary seal170and170A (and shock absorber arrangement171) that is coupled to a suitable source of the supply (also not shown). The supply of oil or other suitable bearing fluid is communicated from the second upper rotary seal172B to the recessed bearing pocket169of each of the number of bearing pads166A,166B,166C via any suitable conduit arrangement provided as a part of cam follower assembly150connected to an inlet173(seeFIG.7D) provided in each bearing pocket169. In one exemplary embodiment in accordance with the disclosed concept, an oil flow is injected into a manifold (not numbered) at a pressure of approximately 1000 psi. From the aforementioned manifold the oil flow is fed to each bearing pad166A,166B,166C. The oil flow is controlled by leejets (i.e., calibrated orifices). It is to be appreciated that such arrangement of bearing pads166A,166B,166C, corresponding bearing surfaces168A,168B,168C, and oil flow results in an oil film between the corresponding bearing pads166A,166B,166C and bearing surfaces168A,168B,168C that prevents any metal to metal contact and thus provides for smooth sliding of cam follower assembly150along bearing members167A,167B,167C and thus smooth translations relative to the stationary assembly base50of the forming assembly16. Referring now toFIG.5, the slider body160includes a number of passages (not collectively numbered) defined therethrough. The passages include a number of cam follower mounting passages, two shown174and175. If there are two cam follower mounting passages174,175, the cam follower mounting passages174,175are disposed generally along a line that, when the forming assembly16is coupled to the mounting assembly14, is generally a radial line extending outward from the passage20of the mounting assembly body18and aligned above the longitudinal axis L of the ram body122of forming assembly16. Another passage defined through slider body160is an alignment pin passage178positioned generally adjacent the end of slider body160opposite ram body122. The cam follower members154are structured to be, and are, operatively engaged by the cam330of the ram drive assembly300. Stated alternately, the cam330is structured to be, and is, operatively coupled to the cam follower members154of the moving assembly44of each forming assembly16and is, therefore, operatively coupled to each ram assembly120and/or forming assembly16. In one embodiment, not shown, the cam follower members154are rigid bearings. In the embodiment shown inFIGS.2-6and7A-7D, the cam follower members154are roller bearings180(hereinafter, and as used herein, the “cam follower roller bearings”180). As shown, and in an exemplary embodiment, each cam follower roller bearing includes an axle184and a wheel186(seeFIG.5). Further, and in an exemplary embodiment, one of the cam follower roller bearings180includes an eccentric bushing187. The eccentric bushing187includes a hollow tubular body188that is structured to fit within cam follower mounting passage175(or alternatively passage174). The tubular body188has a generally cylindrical outer surface190having a first center (not numbered), and, a generally cylindrical outer surface192having a second center (not numbered). The first and second centers noted in the prior sentence are not aligned. That is, the first and second centers noted above are offset from each other. In this configuration, the eccentric bushing187includes a portion with a maximum thickness, hereinafter the “thicker” side188′ of the eccentric bushing187, and, a portion with a minimum thickness, hereinafter the “thinner” side188″ of the eccentric bushing187. Further, the eccentric bushing187includes an orientation tab194that extends generally radially from the outer surface190of the tubular body188. In this configuration, the eccentric bushing187is structured to, and does, move the associated roller bearing wheel186between a spaced, first position and a close, second position, as discussed below. Thus, as used herein, a “forming assembly”16includes at least a die pack56, a domer58, and a ram body122. Further, a “forming assembly”16selectively includes additional elements such as, but not limited to, a ram guide assembly52and a redraw assembly200. A forming assembly16is assembled as follows. The ram guide assembly52, the redraw assembly200, and the die pack56are coupled, directly coupled, or fixed to the base planar member60, i.e., the stationary assembly base50. The domer58is coupled, directly coupled, or fixed to the domer support70, i.e., which, as previously discussed, is coupled to, or formed as a unitary portion of, the stationary assembly base50. Generally, the ram guide assembly52is disposed closest to the passage20of the mounting assembly body18. The redraw assembly200is disposed adjacent the ram guide assembly52. The die pack56is disposed adjacent the ram guide assembly52with the cup feed assembly108disposed between the redraw assembly200and the die pack56. Further, as noted above, the stripper assembly106is disposed at the distal end104of the forming passage100of the die pack56. Finally, the domer58is spaced from the die pack56and/or stripper assembly106. That is, the domer58(or stripper assembly106) is spaced from the die pack56by a distance that is at least the length of a can body and, as shown, a distance that is greater than at least the length of a can body. In one embodiment, and in the configuration described above, the stationary assembly42of the forming assembly16is complete. The moving assembly44of the forming assembly16is assembled as follows. The proximal end126of the ram body122is coupled, directly coupled, or fixed to the slider152of the cam follower assembly150. As shown, and in an exemplary embodiment, the proximal end126of the ram body122is coupled to the lower frame portion162of the slider body160. The punch124is disposed over and coupled, directly coupled, or fixed to the distal end128of the ram body122. In this configuration, the longitudinal axis L of the ram body122is generally, or substantially, aligned with the longitudinal axis of the passage81, the redraw assembly200, and the forming passage100of the die pack56. Further, the longitudinal axis L of the ram body122is generally, or substantially, aligned with the vertex116of the domed surface114of the domer body112. That is, if the longitudinal axis L of the ram body122were extended, it would pass through, or be immediately adjacent the vertex116of the domed surface114of the domer body112. In this configuration, and in one embodiment, the forming assembly16is complete. Further, as noted above, the forming assembly16is a “unified” assembly. Further, it is understood that as the forming assembly16is assembled, the various elements are positioned to be in proper alignment, as is known in the art. That is, for example, the ram body122is adjusted/repositioned until the longitudinal axis L of the ram body122is generally, or substantially, aligned with the longitudinal axis of the passage81of the housing80of the ram guide assembly52and the longitudinal axis of the forming passage100of the die pack56. As the forming assembly16is a “unified” assembly, the elements thereof remain aligned with each other. That is, when the forming assembly16is removed from the mounting assembly14, the elements thereof are not separated. As such, the elements of the forming assembly16do not have to be adjusted so as to be in alignment each time the forming assembly16is installed. A forming assembly16that maintains the alignment of the elements, i.e., wherein the elements of the stationary assembly42and the moving assembly44are not separated, during an installation is, as used herein, an “aligned” unified forming assembly16. A unified forming assembly16or an aligned unified forming assembly16solves the problem(s) noted above. As shown inFIGS.2-3, the ram drive assembly300of bodymaker10is structured to, and does, move the moving assembly44of the forming assembly16, i.e., the ram assembly120or the ram body122, between a retracted (i.e., toward the ram drive assembly300), first position, wherein the ram body122is not disposed in the forming passage100and the distal end128of the ram body122is spaced from an associated die pack56, and, an extended (i.e., away from the ram drive assembly300), second position wherein the ram body122is disposed in the forming passage100and the distal end128of the ram body122is adjacent an associated domer58. The ram drive assembly300, as detailed below, does not include either a crank, a swing arm, and/or pivoting connecting rods. This solves the problem(s) noted above. Referring toFIG.3, the ram drive assembly300includes a motor310and a cam330that is rotated around a prime axis of rotation330by the motor310. The motor310includes a rotating output shaft312. In an exemplary embodiment, the motor310is disposed below the mounting assembly body18within the enclosed space30defined by housing28. As shown, a primary axle314is generally disposed within the hollow mounting assembly enclosed space30and rotatable about prime axis333. The motor output shaft312is operatively coupled to the primary axle314, e.g., by a gear box315. As such, the primary axle314is also identified herein as a part of the motor310. The primary axle314includes an elongated axle body316having an upper, first end318and a lower, second end (not numbered) coupled to the gear box315. The lower second end of axle body316may be selectively coupled to the gear box315via a suitable clutch arrangement that provides for axle body316to be selectively engaged or disengaged from the gear box315, and thus motor310. The first end318of the axle body316extends through the passage20of the mounting assembly body18. The first end318of the axle body316is structured to be, and is, coupled to the cam body332. A brake arrangement319(e.g., a disk brake or other suitable arrangement) is positioned along primary axle314for selectively bringing rotation about prime axis333of primary axle314and cam body332to a controlled and timely stop. The cam330of the ram drive assembly300includes a body332defining, or having, a number of cooperative cam surfaces334,336, (two shown) and identified herein as the inner, first cam surface334and the outer, second cam surface336. The cam330/cam body332is structured to, and does, impart a reciprocal motion to each forming assembly16and, in an exemplary embodiment, to each moving assembly44and/or ram assembly120. Further it is noted that, as discussed below, the cam330moves while each forming assembly16is mounted on the mounting assembly14. That is, the cam330is dynamic and each forming assembly16is statically mounted. Thus, the cam body332is a “dynamic cam body”. This solves the problems noted above. Alternatively, the cam body332could be fixed or held in a steady state with each forming assembly16moving thereabout. In such arrangement, cam body332would be a “steady state cam body”. Further, in an exemplary embodiment, the cam330/cam body332is structured to, and does, generate a “smooth ironing action” in the distal end128of the ram body122/punch124as the ram body122/punch124moves through the die pack56. As used herein, a “smooth ironing action” means that the construct that supports the cup, which is typically the distal end128of the ram body122or punch124, is not being accelerated or decelerated as the construct that supports the cup passes through the die pack56. In an exemplary embodiment, the cam body332includes cooperative cam surfaces334,336, discussed below, having a substantially constant velocity cam profile, discussed below. The cam surfaces334,336with a constant velocity cam profile cause the distal end128of the ram body122or punch124to move at a substantially constant velocity, i.e., no acceleration or deceleration, as the distal end128of the ram body122or punch124pass through the die pack56. Thus, such a cam330/cam body332is structured to, and does, generate a “smooth ironing action.” This solves the problem(s) noted above. Further, in an exemplary embodiment, the components (i.e., the ram assembly120and cam follower assembly150) of the moving assembly44of the forming assembly16are of low mass. Use of such a low mass moving assembly44with a cam330having dwell portions (and thus zero acceleration and, consequently, zero inertial forces and deformations) at the travel extremes results in zero or essentially zero deformations in moving assembly44and components thereof at virtually any operating speed. Hence, once the position of ram assembly120is adjusted for optimum doming position, such positioning will not change with the production speed. This solves the problem(s) above. Further, in an exemplary embodiment, the cam330/cam body332is structured to be, and is, a “direct operative coupling element.” As used herein, a “direct operative coupling element” means an element that is structured to be directly coupled to both the construct that generates motion and the ram assembly of a bodymaker. In the embodiment above, the construct that generates motion is the motor310. To be “directly coupled” to a construct that generates motion, as used herein, means that an element is directly coupled to a motor output shaft or a mounting on a motor output shaft. As used herein, a “mounting” for a motor output shaft is a construct that rotates with the motor output shaft and which has a body that is disposed substantially symmetrically about the motor output shaft. That is, for example, the crank of a prior art bodymaker is, typically, “directly coupled” to a motor output shaft; the crank, however, does not have a body that is disposed substantially symmetrically about the motor output shaft; thus, as used herein, a crank is not a “mounting.” Further, as used herein, the “ram assembly” means the elements that move with, and substantially parallel to, a ram body path of travel. That is, for example, in the prior art arrangement such as shown inFIG.1, both the carriage7A and the second connecting rod6B both move with the ram body7B, but the second connecting rod6B does not move with, and substantially parallel to, the ram body7B path of travel. Thus, the second connecting rod6B, and similar elements, are not part of the “ram assembly.” Thus, as described above, the prior art multi-element linkage, i.e., crank4/swing arm5/first connecting rod6A/second connecting rod6B, does not, and cannot, be a “direct operative coupling element.” That is, such a linkage is not a single element and such a linkage is not directly coupled” to a motor output shaft. Thus, the cam330/cam body332that is structured to be, and is, a “direct operative coupling element” solves the problem(s) noted above. In one embodiment, the cam body332is a generally solid, unitary, planar with an axially extending hub337(FIG.3) and a ridge338extending about the cam body332axis of rotation (i.e., prime axis333). In another embodiment such as shown inFIG.13, the cam body332′ is a two-part assembly, an outer ring332A′ disposed about an inner section332B′. Outer ring332A′ and inner section332B′ may be formed from different materials and one or both of outer ring332A′ and332B′ may have one or more apertures or open sections defined therein or thereby to lighten such sections and thus reduce the moment of inertia of such cam330′. Referring again toFIG.3, the cam body hub337defines a coupling passage339. In an exemplary embodiment, the coupling passage339is tapered and narrows from bottom to top (e.g., seeFIG.3). In an exemplary embodiment, the first end318of the axle body316is structured to be, and is, coupled to the cam body332at the coupling passage339. As shown, the cam body ridge338, in an exemplary embodiment, extends about the perimeter of the cam body332. As shown inFIG.2, when viewed from above, the ridge338of the cam body332is not substantially circular, as discussed in detail below; that is, the ridge338does not have a substantially consistent radius R relative to the axis of rotation (i.e., prime axis333) of the cam body332, but instead is varied in a predetermined manner to create desired movement of the moving assembly44. The overall variation in the radius R (i.e., the difference between the minimum and maximum value of the radius R, which is equal to the stroke of the ram assembly120) is dependent on the height of the can body being produced. In an exemplary embodiment, a stroke of 22″ is used to manufacture cans up to 6.5″ tall/long. As used herein, a generally planar cam body332having a ridge338extending about the perimeter of the cam body332is a “disk cam.” In this embodiment, the ridge338includes the inner, first cam surface334and the outer, second cam surface336. Further, in an exemplary embodiment, the radial width W (FIG.5) of the cam body ridge338is generally, or substantially, consistent. That is, the distance between the first cam surface334and the second cam surface336is generally, or substantially, consistent. Further, in an exemplary embodiment, the cam body332includes a number of alignment passages344disposed adjacent the cam body ridge338, the purpose of which is discussed below. In another example embodiment, such as shown inFIGS.10and11, a bodymaker10B utilizing a “barrel” cam330B is shown. The bodymaker10B is of a similar arrangement as the bodymaker10previously discussed in conjunction withFIGS.2-6except the bodymaker10B only includes two forming assemblies16and includes a ram drive assembly300B that includes/utilizes the “barrel” cam330B instead of a disk cam. Hereinafter, and in relation to the barrel cam330B, reference numbers similar to the embodiment shown inFIGS.2-6will be used, but the reference numbers will include the letter “B.” In this embodiment, the cam body332B is generally cylindrical and includes a groove (not shown) or a ridge (as shown)338B disposed thereabout on a cylindrical surface (not numbered) of the cam body332B. The ridge338B extends generally axially while also forming a loop about the cylindrical cam body332B. In this configuration, the cam body332B, i.e., the ridge338B thereon, defines a generally axial first cam surface334B and a generally axial second cam surface336B. It is understood that, where the ridge338B reverses direction, the ridge338B extends generally circumferentially around the cam body332B rather than axially along the cam body332B. In this embodiment, the opposing sides of the ridge338B are the cooperative cam surfaces334B,336B. It is noted that a ram drive assembly300including, or consisting of, these elements does not include pivotal couplings. This solves the problem(s) stated above. In either of such example arrangements, the cooperative cam surfaces334,336or334B,336B are structured to, and do, operatively engage each cam follower assembly150. In the embodiment shown inFIGS.2-6, the cam follower assembly150includes two cam follower members154, i.e., roller bearings180, also identified herein as first cam follower member156and second cam follower member158. The first cam follower member156is disposed adjacent the first cam surface334. That is, the wheel186of the first cam follower member156is disposed adjacent to the first cam surface334. The second cam follower member158is disposed adjacent the second cam surface336. That is, the wheel186of the second cam follower member158is disposed adjacent to the second cam surface336. Thus, in such embodiment, the first and second cam follower members156,158“sandwich” the cam body ridge338. That is, the first and second cam follower members156,158are disposed on opposite sides of the cam body ridge338. In an exemplary embodiment with a barrel cam having a groove instead of a ridge334B, there is a single cam follower member which is structured to be, and is, disposed in the groove. Further, as shown inFIGS.10and11, in an exemplary embodiment, the bodymaker10B has a barrel cam330B that includes two separate barrel cams330B′,330B″ that are coupled, directly coupled, or fixed to the output shaft312B of a motor310B. It is understood that, in an exemplary embodiment, each barrel cam330B′,330B″ is structured to be, and is, operatively coupled to a respective forming assembly16, such as previously discussed in regard toFIGS.2-6. Thus, in an embodiment with a single barrel cam330B and two forming assemblies16, such as shown inFIGS.10and11, the bodymaker10B produces two can bodies per cycle. Although only two forming assemblies16are shown inFIGS.10and11being used in conjunction with barrel cam330B, it is to be appreciated that more than two forming assemblies may be employed without varying from the scope of the present concepts. For example, additional forming assemblies16may be provided with the respective cam follower assemblies150thereof positioned to engage the338B at generally any point around the barrel cam330B (i.e., in addition to, or instead of only at the top as shown inFIGS.10and11). As an example, when viewed generally along the prime axis of rotation333B of barrel cam330B, an arrangement utilizing twelve forming assemblies150spaced equally about the circumference of the barrel cam330B would generally resemble the positioning of the twelve hour indicators on the face of a traditional clock. As described above, each forming assembly16is coupled, directly coupled, or fixed to the mounting assembly14. Thus, each forming assembly16is disposed at a fixed location adjacent the cam body332. Further, relative to each forming assembly16, the cam body ridge338moves radially outwardly and radially inwardly as the cam body332rotates. It is understood that as the radius of the cam body ridge338decreases, the first cam surface340operatively engages a first cam follower member156. Conversely, when as the radius of the cam body ridge338increases, the second cam surface342operatively engages a second cam follower member158. It is understood that as one cam surface340,342operatively engages a cam follower member156,158, the other cam surface340,342does not operatively engage a cam follower member156,158. That is, only one cam surface340,342operatively engages a cam follower member156,158at a time. As the cam follower assembly150is coupled, directly coupled, or fixed to the forming assembly moving assembly ram assembly120, the cam330is structured to, and does, pull the ram body122radially inwardly as the first cam surface334operatively engages a first cam follower member156. Conversely, the cam330is structured to, and does, push the ram body122radially outwardly as the second cam surface336operatively engages a second cam follower member158. That is, as used herein, a cam surface/cam profile is a cam surface that “operatively engages” a cam follower, or constructs coupled to a cam follower, when the cam follower moves relative to the cam surface/cam profile and/or when the cam surface/cam profile moves relative to the cam follower. As shown inFIG.12, the cooperative cam surfaces334,336, i.e., first cam surface334and second cam surface336, are divided into “portions.” That is, the cam surfaces334,336include, or define, a number of drive portions350,352(two shown). As used herein, a “drive” portion of a cam surface means that the cam surface is structured to move another element or assembly. In an exemplary embodiment, the cam surface drive portions350,352include a forward or forming stroke portion350and a rearward or return stroke portion352. That is, as used herein, a “forward stroke” portion350is an alternate name for a drive portion that causes a cam follower150(as well as constructs coupled to the cam follower150such as, but not limited to, the ram body122) to move toward an associated domer58. Further, as used herein, a “rearward stroke” portion352is an alternate name for a drive portion that causes a cam follower150(or constructs coupled to the cam follower150such as, but not limited to, the ram body122) to move away from an associated domer58. As described above, the operative engagement of the second cam surface336with the second cam follower member158causes the moving assembly44of the forming assembly16, including the ram body122, to move radially outwardly. Thus, a portion of the second cam surface336wherein the radius is “increasing” as the cam body332moves is a cooperative cam surface forward stroke portion350. Conversely, the operative engagement of the first cam surface334with the first cam follower member156causes the moving assembly44of the forming assembly16, including the ram body122, to move radially inwardly. Thus, a portion of the first cam surface340wherein the radius is “decreasing” as the cam body332moves is a cooperative cam surface rearward stroke portion352. As noted above, only one of first cam surface334or second cam surface336operatively engages a cam follower member156,158at a time. As used herein, however, the opposed cam surfaces334,336are identified by the same portion name. That is, the portion of the first cam surface334opposed to the second cam surface forward stroke portion350is also identified as the “forward stroke portion350” even though the first cam surface334does not operatively engage the first cam follower member156at the forward stroke portion350. Stated alternately, and further to the definition above, i.e., as used herein, a “forward stroke portion”350of associated first cam surface334and second cam surface336, means a portion of the cooperative cam surfaces334,336wherein at least one of the cooperative cam surfaces334,336operatively engages, directly or indirectly, a ram body122and causes that ram body122to move toward an associated domer58. Conversely, and further to the definition above, i.e., as used herein, a “rearward stroke portion”352of associated cooperative first cam surface334and second cam surface336means a portion of the cooperative cam surfaces334,336wherein at least one of the cooperative cam surfaces334,336operatively engages, directly or indirectly, a ram body122and causes that ram body122to move away from an associated domer58. Further, it is understood that as the cam body332rotates, the cooperative cam surface drive portions350,352operatively engage a cam follower member156,158. Thus, each cooperative cam surface drive portion350,352(or alternatively the cam body cooperative cam surface forward stroke portion350and the cam body cooperative cam surface rearward stroke portion352) has a beginning/upstream, first end350U,352U and an ending/downstream, second end350D,352D. That is, as the cam body332rotates, the cooperative cam surface drive portion first end350U,352U initially operatively engages a cam follower member156,158. As the cam body332rotates further, the cooperative cam surface drive portion second end350D,352D passes by a cam follower member156,158. When this occurs, the cam follower member156,158is no longer disposed at that cooperative cam surface drive portion350,352. The nomenclature of [reference number]U and [reference number]D shall be used herein with each cam surface portion to identify the upstream, first end and downstream, second end of the named portion. For example, as discussed below, the cooperative cam surfaces334,336also include, or define, a first dwell portion360′. Thus, the upstream/first end of the first dwell portion360′ is identified as “first dwell portion first end360′U.” It is noted that the pitch (radial change relative to circumferential change) of the cam body ridge338, and therefore the cooperative first cam surface334and second cam surface336, determines whether the cam follower member156,158, and therefore the ram body122, moves at a generally, or substantially, constant velocity, is accelerating/decelerating (and/or the rate of acceleration/deceleration), or is substantially stationary. That is, as a simplified example (exemplary elements not shown), it is assumed that a ram must move forward (toward a domer) three inches. Further, it is assumed that the cam body cooperative cam surface forward stroke portion extends over an arc of ninety degrees (90°). For this exemplary configuration, the radius of the cooperative cam surfaces and more specifically the second cam surface, increases three inches over the ninety degrees (90°) of the cam body cooperative cam surface forward stroke portion. That is, the movement of the ram body is proportional to the radius of the cooperative cam surfaces. Thus, when the radius of the cooperative cam surfaces increases an inch, the ram moves forward an inch. Further, as noted and in an exemplary embodiment, the cooperative cam surface drive portion350(or alternatively the cam body cooperative cam surface forward stroke portion350) have a substantially constant velocity cam profile, i.e., a shape structured to impart a substantially constant velocity to the element/assembly that is operatively engaged by the cam surface. In the example above (exemplary elements not shown), wherein the radius of the cooperative cam surfaces and more specifically the second cam surface, increases three inches over the ninety degrees (90°), an increase in the radius of one inch every 30° would produce a substantially constant velocity in the ram. A cam body ridge338, and therefore the cooperative first cam surface334and second cam surface336, which operatively engages a cam follower (or constructs coupled to the cam follower such as, but not limited to, the ram body122) and which has a pitch that is structured to, and does, produce a substantially constant velocity in the cam follower (or constructs coupled thereto) has, as used herein, a “substantially constant velocity cam profile.” In an exemplary embodiment, at least one of, or both, the cooperative cam surface forward stroke portion350and the cooperative cam surface rearward stroke portion352have a substantially constant velocity cam profile. Further, in an exemplary embodiment, the cooperative cam surface forward stroke portion350extends over an arc of about one hundred eighty three and one half degrees (183.5°) and the cooperative cam surface rearward stroke portion352extends over an arc of about one hundred and forty three degrees (143.0°). In an exemplary embodiment, the cooperative cam surfaces334,336also include, or define, a number of dwell portions360′,360″ (two shown) and identified herein as the first dwell portion360′ and the second dwell portion360″. As used herein, a “dwell portion”360′,360″ of the associated cooperative first cam surface334and second cam surface336, means a portion of the cooperative cam surfaces334,336wherein neither of the cooperative cam surfaces334,336operatively engages a cam follower (or constructs coupled to the cam follower such as, but not limited to, the ram body122). Thus, the ram body122is generally stationary and does not move toward or away from an associated domer58. In an exemplary embodiment, and at a cooperative cam surface dwell portion360′,360″, the radius of the cam body ridge338, and therefore the cooperative first cam surface334and second cam surface336, does not substantially increase or decrease. Thus, the cam body ridge338, and therefore the cooperative first cam surface334and second cam surface336, do not operatively engage a cam follower member154(or constructs coupled to the cam follower member154such as, but not limited to, the ram body122). As used herein, a cam surface that does not operatively engage a cam follower member154has a “no velocity cam profile.” That is, a “no velocity cam profile” means that cooperative cam surfaces334,336do not cause a cam follower (or constructs coupled to the cam follower such as, but not limited to, the ram body122) to move toward or away from an associated domer58. Thus, the cooperative cam surface dwell portions360′,360″ have a “no velocity cam profile.” However, to maintain consistent terminology, hereinafter the first dwell portion360′ and the second dwell portion360″ will be said to “engage” or “operatively engage” the moving assembly44of a forming assembly16(or elements thereof such as, but not limited to, the cam follower members154). It is understood that while the terms “engage” or “operatively engage” are used, the first dwell portion360′ and the second dwell portion360″ do not actually cause the moving assembly44(or elements thereof such as, but not limited to, the cam follower members154) to move. That is, with respect to the first dwell portion360′ and the second dwell portion360″ only, and as used herein, the terms “engage” and “operatively engage” do not have the meanings set forth above and instead mean that the first dwell portion360′ and the second dwell portion360″ are directly coupled to the cam follower assembly150. In an exemplary embodiment, no cooperative cam surface dwell portion360′,360″ extends over an arc greater than thirty degrees (30°). As used herein, the existence of cooperative cam surface dwell portions360′,360″ extending over an arc no greater than thirty degrees does not mean that the cam body ridge338has a generally, or substantially, consistent radius relative to the cam body332axis of rotation. That is, so long as the cooperative cam surface dwell portions360′,360″ extend over an arc no greater than thirty degrees, the cam body ridge338does not have a generally, or substantially, consistent radius relative to the cam body332axis of rotation. In an exemplary embodiment, at least one cam body cooperative cam surface dwell portion360′,360″ is disposed between at least one of the cam body cooperative cam surface forward stroke portion350and the cam body cooperative cam surface rearward stroke portion352, or, the cam body cooperative cam surface rearward stroke portion352and the cam body cooperative cam surface forward stroke portion350. In another exemplary embodiment, each cooperative cam surface dwell portion360′,360″ is disposed between cam body cooperative cam surface drive portions350,352. That is, there is a cooperative cam surface first dwell portion360′ disposed between the forward stroke portion second end350D and the rearward stroke portion first end352U, and, a cooperative cam surface second dwell portion360″ disposed between the rearward stroke portion second end352D and the forward stroke portion first end350U. In an exemplary embodiment, the cooperative cam surface first dwell portion360′ extends over an arc of about three and one half degrees (3.5°) and the cooperative cam surface second dwell portion360″ extends over an arc of about thirty degrees (30°). In an exemplary embodiment, the cooperative cam surfaces334,336also include, or define, a number of portions370,372(two shown), hereinafter identified as the acceleration portion370and the deceleration portion372. The acceleration portion370and the deceleration portion372each have an “acceleration profile.” As used herein, an “acceleration profile” means that the cam body ridge338, and therefore the cooperative first cam surface334and second cam surface336, operatively engages a cam follower (or constructs coupled to the cam follower such as, but not limited to, the ram body122) and produce a changing velocity in a ram body122. That is, an “acceleration profile” means that the cam body ridge338, and therefore the cooperative first cam surface334and second cam surface336has/have a pitch that is structured to, and does, produce a changing velocity in a cam follower (or constructs coupled to the cam follower such as, but not limited to, the ram body122) when the cam surface operatively engages the cam follower. Thus, the surface portions370,372either cause a ram body122to increase or decrease its velocity. That is, deceleration of a ram body's122velocity is, stated alternately, acceleration in a direction opposite the velocity of the ram body122. In an exemplary embodiment such as illustrated inFIG.12, the cooperative cam surface acceleration portion370and deceleration portion372are disposed between the cooperative cam surface drive portions350,352and the cooperative cam surface dwell portions360′,360″. That is, starting at the end of dwell portion360″ associated with the ram body122being in the first position (i.e., furthest from the domer58), and moving sequentially about the cam surfaces334,336, the portions are in this order: the acceleration portion370(which causes an acceleration of the ram body122toward the domer58), a constant speed portion350, the deceleration portion372(which causes a deceleration to no velocity), the first dwell portion360′, the varying speed portion352which is of varying speed, and the second dwell portion360″. The acceleration portion370, the constant speed portion350, and the deceleration portion372make up the forming stroke, whereas the varying speed portion352makes up the return stroke. In an exemplary embodiment such as shown inFIG.12, the acceleration portion370extends over an arc of about thirty three degrees (33°) and the deceleration portion372extends over an arc of about thirty three and one half degrees (33.5°). Thus, as shown inFIG.12, and in an exemplary embodiment, the cooperative first cam surface334and second cam surface336, are divided into the following portions which extend sequentially over the identified arcs. Acceleration portion 3700° to 33°Constant speed portion 35033° to 150°Deceleration portion 372150° to 183.5°First dwell portion 360’183.5° to 187°Varying speed portion 352187° to 330°Second dwell portion 360”330° to 360° For a cam330such as described above,FIG.12Ashows the position or displacement of a punch124relative to the first position and relative to the cam330, as described above, as the cam330rotates.FIG.12Bshows the velocity of a ram assembly120/punch124as the cam330rotates.FIG.12Cshows the acceleration (or deceleration) of a ram assembly120/punch124as the cam330rotates. When a forming assembly16is coupled, directly coupled, or fixed to the mounting assembly14, the cam body ridge338is disposed between the first cam follower member156and the second cam follower member158. That is, as noted above, the wheel186of the first cam follower member156is disposed adjacent to the first cam surface334, and, the wheel186of the second cam follower member158is disposed adjacent to the second cam surface336. Thus, when the cam330, i.e., cam body332, rotates, and when the radius of the cam body ridge338is “decreasing” as described above, the first cam surface334operatively engages the first cam follower member156. Conversely, when the cam330, i.e., cam body332, rotates, and when the radius of the cam body ridge338is “increasing” as described above, the second cam surface336operatively engages the second cam follower member158. The operative engagement of the first and second cam follower members156,158by the cooperative cam surfaces334,336cause the cam follower assembly150and the elements coupled thereto, i.e., the ram assembly120, to move. That is, the operative engagement of the first and second cam follower members156,158by the cooperative cam surfaces334,336cause the moving assembly44of the forming assembly16to move. Thus, the motion of the moving assembly44of a forming assembly16sequentially occurs as follows. Initially, the moving assembly44is in the first position. When the first and second cam follower members156,158are at the second dwell portion360″, the moving assembly44(including the ram body122and the punch124) does/do not move. As the moving elements of the moving assembly44do not suddenly, or instantly, reverse directions, the moving assembly44does not substantially vibrate. This solves the problem(s) noted above. That is, the second cooperative cam surface dwell portion360″ solves the problem(s) noted above. Further, at this time, a cup is moved into position at the mouth of the die pack56. As the cam330, i.e., cam body332, rotates, the first cooperative cam surface acceleration portion370engages the first and second cam follower members156,158which causes the moving assembly44(including the ram body122and the punch124) to accelerate and move toward the associated domer58. As the cam330, i.e., cam body332, continues to rotate, the cooperative cam surface forward stroke portion350engages the first and second cam follower members156,158which causes the moving assembly44(including the ram body122and the punch124) to move toward the associated domer58at a substantially constant velocity. This solves the problem(s) noted above. That is, the cooperative cam surface forward stroke portion350solves the problem(s) noted above. As the cam330, i.e., cam body332, continues to rotate, the deceleration portion372engages the first and second cam follower members156,158which causes the moving assembly44(including the ram body122and the punch124) to decelerate, i.e., accelerate in a direction opposite the velocity, to no velocity. As the cam330, i.e., cam body332, continues to rotate, the first cooperative cam surface dwell portion360′ engages the first and second cam follower members156,158which causes the moving assembly44(including the ram body122and the punch124) to be maintained in the second position. That is, as the moving elements of the moving assembly44do not suddenly, or instantly, reverse directions, the moving assembly44does not substantially vibrate. The lack of motion/acceleration when the moving assembly44is in the second position solves the problem(s) noted above. That is, the first cooperative cam surface dwell portion360′ solves the problem(s) noted above. Moreover, because the moving assembly44dwells in the second position (and in the first position, as discussed below) prior to reversing the direction of the motion, the moving assembly44is not subject to “whiplash.” This, in turn, means that the elements of the moving assembly44are not subject to elongation as described above. Stated alternately, and as used herein, a ram drive assembly300that is structured to, and does, avoid “whiplash” in any element operatively engaged thereby is a “steady state” drive assembly. Similarly, a cam330, or a cam body332, that is structured to, and does, avoid “whiplash” in any element that is operatively engaged by the cam330, or a cam body332, is a “steady state” cam330, or cam body332. This solves the problem(s) noted above. As the cam330, i.e., cam body332, continues to rotate, the cooperative cam surface rearward stroke portion352engages the first and second cam follower members156,158which causes the moving assembly44(including the ram body122and the punch124) to move with a motion generally low in acceleration, pressure angle, and vibrations. This solves the problem(s) noted above. That is, the cooperative cam surface rearward stroke portion352solves the problem(s) noted above. As the cam330, i.e., cam body332, continues to rotate, the second cooperative cam surface dwell portion360″ again engages the first and second cam follower members156,158as the cycle begins again. It is understood that each time the cam body322rotates 360 degrees, i.e., and as used herein, one “cycle” of the bodymaker10, a forming assembly16makes a can body. As noted above in conjunction withFIG.5, one cam follower mounting passage175includes an eccentric bushing187with the orientation tab194. The eccentric bushing187is structured to, and does, allow the cam follower assembly150to move between two configurations. That is, when the eccentric bushing187is disposed so that the thinner side188″ is disposed closer to the mounting assembly body passage20, the distance between the cam follower members154is at a maximum. This is the first configuration of the cam follower assembly150. In this configuration, the distance between the cam follower members154is greater than the radial width W of the cam body ridge338. Thus, as described below, the forming assembly16is able to be moved in a direction generally normal to the plane of the cam body332without contacting the cam body ridge338. That is, when the cam body332is disposed so that the plane of the cam body332is generally horizontal, and when the cam follower assembly150is in the first configuration, the forming assembly16is able to be lifted, or lowered (e.g., via a suitable overhead lift mechanism), relative to the cam body332without the cam follower assembly150contacting, or substantially contacting, the cam body ridge338. It is understood that when the forming assembly moving assembly cam follower assembly150is in the first configuration, the cam follower roller bearing eccentric bushing orientation tab194is fixed via any suitable arrangement (e.g., a radial recess). Thus, the eccentric bushing187is not able to rotate within the mounting passage175. Conversely, when the eccentric bushing187is disposed so that the thicker side188″ is disposed closer to the mounting assembly body passage20(such as shown inFIG.5), the distance between the cam follower members154is at a minimum. This is the second configuration of the forming assembly moving assembly cam follower assembly150. In this configuration, the distance between the cam follower members154is generally, or substantially, the same as the radial width W of the cam body ridge338. This is the operational configuration of the cam follower assembly150. In this configuration, any radial change in the position of the cam body ridge338, i.e., the associated cooperative cam surfaces334,336, or, first cam surface340and second cam surface342, causes the cooperative cam surfaces334,336to operatively engage the cam follower assembly150. In this configuration, the bodymaker10solves the problem(s) stated above. That is, for example, the ram drive assembly300is a “direct” ram drive assembly300, as that term is defined above. That is, the ram drive assembly300is structured to, and does, convert a rotational motion (from the motor output shaft312) to a reciprocal motion (of the ram body122) without a pivoting construct such as, but not limited to, a swing arm. This solves the problem(s) noted above. It is further noted that a bodymaker10as described above with a disk cam330has a configuration unlike known bodymakers. As noted above, each ram body122has a longitudinal axis L. Further, the cam body332axis of rotation is a “prime axis of rotation” for the bodymaker ram drive assembly300, as that term is defined above. Thus, the cam body332axis of rotation is also identified herein as the “ram drive assembly prime axis of rotation333.” As described above, each ram body longitudinal axis L extends generally radially relative to the ram drive assembly prime axis of rotation333(e.g., seeFIG.2). That is, the ram body longitudinal axes L are generally disposed in a plane and are radially offset about the ram drive assembly prime axis of rotation333. In an exemplary embodiment, the forming assemblies16are generally evenly disposed about the ram drive assembly prime axis of rotation333. That is, for “N” number of forming assemblies16, the forming assemblies16are disposed about 360°/N degrees apart. In an exemplary embodiment, there are two or more forming assemblies16disposed about the ram drive assembly prime axis of rotation333. That is, in an exemplary embodiment, the number of forming assemblies16includes between two and ten forming assemblies16. Further, in an exemplary embodiment, the number of forming assemblies16includes one of two forming assemblies16, four forming assemblies16, six forming assemblies16, eight forming assemblies16or ten forming assemblies16. Further, in an exemplary embodiment, when there is an even number of forming assemblies16, each forming assembly16may be disposed generally in opposition to another forming assembly16across the ram drive assembly prime axis of rotation333(i.e., positioned generally 180° about the prime axis333). However, it is to be appreciated that the drive arrangements as described herein allow for the forming assemblies16to be positioned in other configurations that are not in opposition to each other across the ram drive assembly prime axis of rotation333(i.e., positioned other than 180° with respect to each other). For example, in one exemplary embodiment, a bodymaker10includes only two forming assemblies16positioned only 45° apart about the prime axis333. In another example, a bodymaker10includes only two forming assemblies16positioned only 36° apart about the prime axis333. Further, it is to be appreciated that the angular spacing between adjacent forming assemblies16of a bodymaker10may differ among pairs of forming assemblies16within the bodymaker10. As an example, without limitation, a bodymaker10having three forming assemblies16may have two of the forming assemblies16positioned 90° apart about the prime axis333, with the third forming assembly spaced 135° about the prime axis333relative to each of the other two forming assemblies16. In any of these configurations, the ram drive assembly300is a “single source/[X]-output ram drive assembly,” as that term is defined above. That is, for example, if the forming system12includes three forming assemblies16, the ram drive assembly300is a single source/3-output ram drive assembly. Thus, for a forming system12including one of four, five, six, seven, eight, nine or ten forming assemblies16, the ram drive assembly300is a single source/4-output ram drive assembly, a single source/5-output ram drive assembly, a single source/6-output ram drive assembly, a single source/7-output ram drive assembly, a single source/8-output ram drive assembly, a single source/9-output ram drive assembly, a single source/10-output ram drive assembly, respectively. An embodiment with eight forming assemblies16is shown inFIG.13. In an exemplary embodiment, the forming system12includes four forming assemblies16. As shown inFIG.2, the four forming assemblies16are disposed about, or substantially, ninety degrees apart about the prime axis333of the ram drive assembly300. Further, in this configuration, the forming assemblies16are “asymmetrical forming assemblies.” That is, in this configuration, the forming elements do not move substantially in opposition to each other. In an embodiment such as shown inFIG.11wherein the bodymaker is a barrel cam330B, the axis of rotation of the cam body332B defines a prime axis of rotation333B. In this embodiment, however, the longitudinal axis L of each ram body122extends generally parallel to the prime axis of rotation333B of the barrel cam330B. Another aspect of the motion of the ram assembly120, i.e., the ram body122, caused by operative engagement by a cam330of a ram drive assembly300as described above is that no two ram bodies are in the same “medial position” at one time. That is, for example, no two ram bodies122are disposed with the punch124entering the die pack56associated therewith at the same time. It is noted, however, that two ram bodies122are, in certain configurations, disposed with the punch124in die pack56associated therewith at the same time. That is, for example, the forming system12with the cam330in a specific orientation may have one ram body122with the punch124at the upstream end of the die pack56associated therewith while another ram body122has the punch124disposed at the downstream end of the die pack56associated therewith. When the forming assemblies16are “asymmetrical forming assemblies,” the power needed, i.e., the size/power of the motor310is reduced because no ram assemblies120are disposed at the same time in a location that generates the maximum resistance. This solves the problem(s) noted above. Further, the bodymaker10, i.e., the ram drive assembly300, as described above is structured to, and selectively does, operate with less than the full set of forming assemblies. That is, the bodymaker10as described above has a number of forming assemblies16. Whatever the maximum number of forming assemblies16associated with a specific bodymaker10is, as used herein, a “full set” of forming assemblies16. For example, in an embodiment wherein the maximum number of forming assemblies16is four, the “full set” of forming assemblies16means four forming assemblies16. Unlike prior art bodymakers which needed to balance the loads created by the forming assemblies16, the present bodymaker10is structured to, and, when required, does, operate with less than a “full set” of forming assemblies16. For example, in an embodiment wherein the “full set” of forming assemblies16means four forming assemblies16, the bodymaker10, i.e., the ram drive assembly300, is structured to, and does, operate with three, two, or one forming assemblies16. This solves the problem(s) noted above. Stated alternately, the bodymaker10is structured to, and when required does, operate with fewer than all forming assemblies operatively coupled to the drive assembly. That is, unlike a prior art bodymaker having two forming assemblies coupled to a crank, the use of a cam330eliminates the need for the drive assembly to be balanced. Thus, for example, if one of four forming assemblies16needs repaired, the defective forming assembly16is disengaged from the drive assembly300and then the remaining three forming assemblies16are put back into operation. As used herein, a bodymaker drive assembly300that is structured to operate with less than all forming assemblies16engaged thereby is a “limited load” drive assembly300. Use of a limited load drive assembly300solves the problem(s) noted above. In an exemplary embodiment, such as shown inFIGS.3,4and6, the mounting assembly14further includes a number of forming assembly positioning assemblies400. There is one positioning assembly400associated with each forming assembly16. When the mounting assembly body18is disposed in a generally horizontal plane, each positioning assembly400is substantially disposed below the mounting assembly body18. Each forming assembly positioning assembly400is structured to, and does, move (and in this configuration lift/lower) a forming assembly16. That is, each forming assembly positioning assembly400is structured to, and does, move a forming assembly16among a first (non-operational) position, such as shown inFIG.6, wherein the forming assembly16is spaced from an associated mounting assembly planar body upper surface recess34(i.e., is above an associated mounting assembly planar body upper surface recess34), and a second (operational) position such as shown inFIG.4, wherein the forming assembly16is disposed within an associated mounting assembly planar body upper surface recess34. In the illustrated exemplary embodiment, each positioning assembly400includes a fluid pressure source402and a number of actuators404coupled thereto via fluid conduits406. The fluid pressure source402may be any suitable source of pneumatic or hydraulic pressure (e.g., without limitation an air compressor, an hydraulic pump, a supply line from a remote pressure source, etc.). Each actuator may be a suitable pneumatic or hydraulic actuator coupled to the corresponding suitable pressure source via flexible or rigid conduits406. Control of movement of each actuator404may be provided via any suitable control arrangement (not numbered). Alternatively, each positioning assembly may utilize electric actuators powered by a suitable source of electrical power and controlled by a suitable controller. Additionally, each positioning assembly400may include one or more suitable locking mechanisms (not numbered, e.g., mechanical and/or electromagnetic arrangements) for securing each forming assembly16to mounting assembly14. It is to be understood that, when a forming assembly16is being moved between the first and second positions, and when the forming assembly16is in the first (non-operational) position, the cam follower assembly150is in the first (widely spaced) configuration previously discussed. Further, when the forming assembly16is in the second (operational) position, the cam follower assembly150is in the second (closely spaced) configuration previously discussed. When the mounting assembly planar body upper surface recesses34are “machined” recesses34, each forming assembly16is automatically positioned as the forming assembly16is moved into the machined mounting assembly planar body upper surface recess34. Alternatively, after a forming assembly16is disposed in a mounting assembly planar body upper surface recess34, a user brings the forming assembly16into the proper alignment by passing guide pins39through the associated guide pin passages36,68. Further, a guide pin39is temporarily disposed in the alignment pin passage178of the slider152of the cam follower assembly150and the alignment passage344of the cam330. Use of the guide pins39brings each forming assembly16into proper alignment with the cam330. It is again noted that each forming assembly16is, in an exemplary embodiment, an aligned, unitary forming assembly16; thus, the elements with each forming assembly16do not require further alignment. This solves the problem(s) noted above. In one embodiment, the bodymaker10includes a single forming assembly16. In another embodiment, the bodymaker10includes a plurality of forming assemblies16. In another embodiment, the bodymaker10includes an even number of forming assemblies16. Thus, in an exemplary embodiment, the number of forming assemblies includes one of a single forming assembly16, two forming assemblies16, four forming assemblies16, six forming assemblies16, eight forming assemblies16or ten forming assemblies16. Further, and as described above, with forming assemblies16disposed about the cam body332axis of rotation, the longitudinal axes of the forming assemblies16extend generally, or substantially, radially relative to the cam320axis of rotation. Further, in a configuration disclosed above wherein the bodymaker10includes more than two forming assemblies16, the bodymaker10produces more than two can bodies per cycle. This solves the problem(s) noted above. That is, for example, in an embodiment with four forming assemblies16, the bodymaker10produces four can bodies per cycle. Moreover, with a cam330rotating at 320 r.p.m., the bodymaker10with four forming assemblies16, or alternately, the forming system12with four forming assemblies16, produces one of a large number of can bodies per minute, a very large number of can bodies per minute, or an exceedingly large number of can bodies per minute. As used herein, a “large” number of can bodies per minute means more than 1,280 can bodies per minute. As used herein, a “very large” number of can bodies per minute means more than 1,440 can bodies per minute. As used herein, an “exceedingly large” number of can bodies per minute means more than 1,600 can bodies per minute. A bodymaker10that produces any of a large number of can bodies per minute, a very large number of can bodies per minute, or an exceedingly large number of can bodies per minute solves the problem(s) noted above. Further, the can bodymaker10as described above occupies a “reduced” floor space as compared to conventional bodymakers. As used herein, the term “floor space” includes the space bound by the perimeter of the elements extending from the bodymaker. For example,FIG.13shows an overhead view of a layout of a bodymaker10′ in accordance with an exemplary embodiment of the disclosed concept having eight forming assemblies16and related machinery (e.g., trimmers). Such layout occupies/requires a floor space having dimensions of about D1′×D2′. In such example both D1′ and D2′ are 366 inches. Hence, the overall floor space occupied/required by such layout is 133,956 in2or about 930 ft2. In comparison,FIG.14shows a layout of eight prior art bodymakers1(i.e., the number of prior art bodymakers1needed to achieve the same or similar output as bodymaker10′ ofFIG.13) and related machinery. Such layout occupies/requires a floor space having dimensions of about D1×D2. In such example D1 is 885.5 inches and D2 is 432 inches. Hence, the overall floor space occupied/required by such layout is 382,536 in2or about 2,656 ft2, almost three times the floor space as the bodymaker10′ in accordance with the disclosed concept. As a bodymaker in accordance with the disclosed concept provides for similar output while requiring a lesser or “reduced” floor space such bodymaker occupies a “reduced” floor space as compared to conventional bodymakers. In addition to saving floor space, it is to be appreciated that bodymakers in accordance with the disclosed concept require less energy to produce an equivalent amount of can bodies as compared to conventional arrangements. As an example, a conventional single head bodymaker requires a 75 HP motor. A recently released two head unit also requires 75 HP, and a four head unit requires 300 HP. In stark contrast, a four head (i.e., four forming assembly16) bodymaker in accordance with the disclosed concept requires only a single 30 HP hp motor. Hence for the same can body output, a bodymaker in accordance with the disclosed concept provides significant energy savings. Further, conventional bodymakers require flywheels of considerable mass to supply the energy needed to form a can due to their forming/drive arrangement(s). In contrast, bodymakers in accordance with the disclosed concept do not require such flywheels because of the low mass of the forming assembly as well as the profile available due to the use of the disk cam (i.e., zero acceleration portions at the end of the strokes and, consequently, zero inertia forces and deformations). While specific embodiments of the invention have been described in detail, it will be appreciated by those skilled in the art that various modifications and alternatives to those details could be developed in light of the overall teachings of the disclosure. Accordingly, the particular arrangements disclosed are meant to be illustrative only and not limiting as to the scope of invention which is to be given the full breadth of the claims appended and any and all equivalents thereof. | 116,888 |
11858027 | DETAILED DESCRIPTION Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The meaning and scope of the terms should be clear; in the event, however of any latent ambiguity, definitions provided herein take precedent over any dictionary or extrinsic definition. Preferred methods and materials are described below, although methods and materials similar or equivalent to those described herein can be used in practice or testing of the present disclosure. All publications, patent applications, patents and other references mentioned herein are incorporated by reference in their entirety. The materials, methods, and examples disclosed herein are illustrative only and not intended to be limiting. The terms “comprise(s),” “include(s),” “having,” “has,” “can,” “contain(s),” and variants thereof, as used herein, are intended to be open-ended transitional phrases, terms, or words that do not preclude the possibility of additional acts or structures. The singular forms “a,” “and” and “the” include plural references unless the context clearly dictates otherwise. Unless otherwise required by context, singular terms shall include pluralities and plural terms shall include the singular. The present disclosure also contemplates other embodiments “comprising,” “consisting of” and “consisting essentially of,” the embodiments or elements presented herein, whether explicitly set forth or not. For the recitation of numeric ranges herein, each intervening number there between with the same degree of precision is explicitly contemplated. For example, for the range of 6-9, the numbers 7 and 8 are contemplated in addition to 6 and 9, and for the range 6.0-7.0, the number 6.0, 6.1, 6.2, 6.3, 6.4, 6.5, 6.6, 6.7, 6.8, 6.9, and 7.0 are explicitly contemplated. “About” and “approximately” are used to provide flexibility to a numerical range endpoint by providing that a given value may be “slightly above” or “slightly below” the endpoint without affecting the desired result. In the foregoing description of preferred embodiments, specific terminology has been resorted to for the sake of clarity. However, the invention is not intended to be limited to the specific terms so selected, and it is to be understood that each specific term includes all technical equivalents which operate in a similar manner to accomplish a similar technical purpose. Terms such as “top” and “bottom”, “front” and “rear”, “inner” and “outer”, “above”, “below”, “upper”, “lower”, “vertical”, “horizontal”, “upright” and the like are used as words of convenience to provide reference points. Conventional electronic enclosures have a single climate control unit (CCU) mounted to the door or the wall side of the enclosure. However, this conventional design creates a single point of failure such that when failure of the CCU occurs, heat is trapped inside the enclosure resulting in a rise in temperature and possible shut down or damage to the equipment. Conventional approaches to remedying the single point of failure to is add a secondary CCU or emergency vent fan on the opposite wall of the enclosure for redundancy. However, installing a secondary CCU or emergency vent on the opposite wall of the enclosure is not always possible due to interference with the equipment contained within the enclosure. Furthermore, conventional approaches to retrofit an existing installation to add a secondary CCU or emergency vent fan is costly because of the time and tools necessary to add an additional cutout to the enclosure. With reference toFIG.1, a climate control system10includes a heat exchanger assembly14and an auxiliary air vent assembly18(e.g., a mount) coupled to an enclosure22(e.g., an enclosure-of-interest, a computer and electronic equipment enclosure, a commercial or residential building). In the illustrated embodiment, the auxiliary air vent assembly18is positioned between the heat exchanger assembly14and the enclosure22. In other words, the heat exchanger assembly14abuts (e.g., directly contacts) the auxiliary air vent assembly18and the auxiliary air vent assembly18abuts the enclosure22. The auxiliary air vent assembly18mounts in between the heat exchanger assembly14and the enclosure22. In the illustrated embodiment, the auxiliary air vent assembly18is coupled to the enclosure22and the heat exchanger assembly14. In other words, the auxiliary air vent assembly18(e.g., the mount) is configured to couple the heat exchanger assembly14to the enclosure22. As described herein, embodiments of the heat exchanger assembly14, the auxiliary air vent assembly18, and systems of the present disclosure can be mounted to the enclosure22to reduce heat load generated within the enclosure22(e.g., heat load generated by computer or electrical equipment) while providing back-up cooling redundancy. With reference toFIG.2, the enclosure22includes cutouts26A,26B to place the heat exchanger assembly14in fluid communication (e.g., configured for the flow of a fluid) with the enclosure22. Advantageously, the auxiliary air vent assembly18also utilizes the same cutouts26A,26B formed in the enclosure22to place the auxiliary air vent assembly18in fluid communication with the enclosure22. In other words, the auxiliary air vent assembly18does not require additional cutouts be formed in the enclosure22beyond those cutouts already being utilized by the heat exchanger assembly14(e.g., cutouts26A,26B). As such, an existing enclosure with a heat exchanger assembly coupled thereto can be easily retrofitted by positioning and mounting the auxiliary air vent assembly between the heat exchanger assembly and the enclosure—without the need for creating additional cutouts in the enclosure. With continued reference toFIGS.1-2, the heat exchanger assembly14includes a housing30with an external air inlet34and an external air outlet38on a first side42, and an internal air inlet46, and an internal air outlet50on a second side54, opposite the first side42. In some embodiments, the air inlets34,46and the air outlets38,50are covered with a grate or mesh material. In some embodiments, the heat exchanger assembly14includes a passive heat exchanger positioned within the housing30. In some embodiments, the heat exchanger assembly14includes a first fan positioned at the internal air inlet46configured to create an internal airflow through the housing30from the internal air inlet46to the internal air outlet50; and a second fan positioned at the external air inlet34configured to create an external airflow through the housing30from the external air inlet34to the external air outlet38. In some embodiments, the external airflow is isolated from the internal airflow by a dividing wall positioned within the housing. In some embodiments, the dividing wall facilitates the separation of an external airflow path from an internal airflow path to prevent contamination of the internal environment of the enclosure with dust, debris, dirt, salt, precipitation, and the like, from the environment outside of the enclosure. Examples of such heat exchanger assemblies are described in U.S. patent application Ser. No. 17/434,120, filed Aug. 26, 2021, which is incorporated herein in its entirety. In other embodiments, the heat exchanger assembly14includes an air conditioner (e.g., an active cooling assembly, active cooling CCU). With reference toFIGS.3-5, the auxiliary air vent assembly18(e.g., the mount) includes a rim58made of square tubing (e.g., a square tube rim). The rim58at least partially defines an internal air inlet region62(corresponding to the internal air inlet46) and an internal air outlet region66(corresponding to the internal air outlet50). In the illustrated embodiment, the rim58defines at least a portion of the perimeter of the internal air inlet region62and the internal air outlet region66. In some embodiments, a divider70is coupled to the rim58and is positioned between the internal air inlet region62and the internal air outlet region66. With reference toFIG.2, the internal air inlet46of the heat exchanger assembly14is in fluid communication with the internal air inlet region62. In the illustrated embodiment, the internal air inlet region62is positioned between the internal air inlet46and the enclosure22. Likewise, the internal air outlet50of the heat exchanger assembly14is in fluid communication with the internal air outlet region66. In the illustrated embodiment, the internal air outlet region66is positioned between the internal air outlet50and the enclosure22. In the illustrated embodiment, the rim58at least partially surrounds the internal air inlet46and the internal air outlet50of the housing30. In other words, the internal air inlet46and the internal air outlet50of the heat exchanger assembly14are positioned within (e.g., partially enclosed by) the rim58. In some embodiments, the rim58extends out beyond the housing30when mounted on the enclosure22. With continued reference toFIG.2, the rim58includes a first mount surface74and a second mount surface78, opposite the first mount surface74. In some embodiments, the mount surfaces74,78are planar parallel surfaces. In the illustrated embodiment, the heat exchanger assembly14abuts (e.g., directly contacts) the first mount surface74. In the illustrated embodiment, the second mount surface78abuts (e.g., directly contacts) the enclosure22. With continued reference toFIGS.4and5, the rim58includes an outer portion82(e.g., outward facing surfaces86A,86B,86C) extending between the first mount surface74and the second mount surface78, and an inner portion90(e.g., inward facing surfaces94A,94B,94C) extending between the first mount surface74and the second mount surface78. In the illustrated embodiment, the outer portion82includes three outward facing surfaces86A,86B,86C and the inner portion90includes three inward facing surfaces94A,94B,94C. In other embodiments, the outer and inner portions82,90include any number of outward or inward facing surfaces. With reference toFIG.5, the rim58includes a passageway98(e.g., an air passageway). In the illustrated embodiment, the rim58is a hollow square tube (square tubing) that defines the internal air passageway98along the entire length of the rim58. In the illustrated embodiment, the air passageway98is “U”-shaped. With continued reference toFIG.5, apertures102A-102D and106A-106B are formed in the rim58. As described in further detail herein, in some embodiments, the apertures are laser cut into the square tube, exposing the internal air passageway. The rim58includes the apertures102A-102D (e.g., the inward facing apertures) formed on the inner portion90of the rim58and the apertures106A-106B (e.g., the outward facing apertures) formed on the outer portion82of the rim58. In the illustrated embodiment, the apertures102A-102D and106A-106B connect to the air passageway98. The apertures102A-102D are in fluid communication with the internal air inlet region62and the air passageway98. The apertures106A-106B are in fluid communication with the air passageway98and ambient atmosphere (e.g., the environment). As such, the air passageway98extends between the inward facing apertures102A-102D and the outward facing apertures106A-106B. For example, the aperture102A is in fluid communication with the internal air inlet region62, the aperture106A is in fluid communication with ambient atmosphere, and the air passageway98extends between the first aperture102A and the second aperture106A. In some embodiments, the outward facing apertures106A-106B are positioned vertically lower than the inward facing apertures102A-102D. In other words, as viewed from the frame of reference ofFIG.3, the apertures102A-102D are positioned above the apertures106A-106B. In the illustrated embodiment, the divider70is positioned between (e.g., positioned vertically between) the inward facing apertures102A-102D and the outward facing apertures106A-106B. In the illustrated embodiment, there are two outward facing apertures: the aperture106A formed on the outward surface86A (FIG.8B) and the aperture106B formed on the outward surface86C (FIG.8A). In the illustrated embodiment, there are four inward facing apertures: the aperture102A formed on the inward surface94A (FIG.8A), the apertures102B,102C formed on the inward surface94B (FIG.8A), and the aperture106D formed on the inward surface94C (FIG.8B). In other embodiments, the rim58includes at least one inward facing aperture and at least one outward facing aperture. With reference toFIG.4, the auxiliary air vent assembly18further includes a fan housing110coupled to the rim58. In the illustrated embodiment, the fan housing110is coupled to between the inward facing surfaces94A,94C. The fan housing110includes a fan inlet114, a fan outlet118, and a fan (or fans)122is positioned within the fan housing110. The fan outlet118is in fluid communication with the internal air outlet region66of the auxiliary air vent assembly18. With reference toFIG.6, a damper126is positioned at the fan outlet118. In some embodiments, the damper126is pivotably coupled to the rim58or the fan housing110and is configured to pivot open in response to pressure generated in the fan housing110by the fans122. For example, when the fans122are deenergized, the damper126is in a closed position and closes (e.g., blocks) the fan outlet118. When the fans122are energized, pressure builds up in the fan housing110and causes the damper126to pivot to an open position, where the fan outlet118is opened and placed in fluid communication with the internal air outlet region66(and the enclosure22). In other embodiments, the damper126is positioned relative to the fan outlet118and then fixed relative to the fan housing110or rim58via a fastener or weld. With reference toFIG.1, with the heat exchanger assembly14coupled to the auxiliary air vent assembly18, the external air inlet34is positioned between (e.g., vertically between) the external air outlet38and the fan inlet114(as viewed from the frame of reference ofFIG.1). In other words, the fan inlet114is positioned below the external air inlet34. In the illustrated embodiment, the fan inlet114and the first mount surface74of the rim58are co-planar. As such, the fan inlet114is oriented in the same direction as the external air inlet34and the external air outlet38of the heat exchanger assembly14. In operation, with reference toFIGS.2and3, the auxiliary air vent assembly18provides an auxiliary (e.g., back-up or redundant) means for cooling the enclosure22. For example, when or if the heat exchanger assembly14is faulty, not operating, not operating properly, or not operating efficiently; the auxiliary air vent assembly18permits hot air to escape the enclosure22and replaces the hot air with cooler ambient air. In the illustrated embodiment, warm air from the enclosure22travels through the cutout26A into the internal air inlet region62. Instead of passing through the heat exchanger assembly14, the warm air (illustrated with red arrows inFIG.3) in the internal air inlet region62travels through the inward facing apertures102A-102D, through the passageway98, and exhausts out the outward facing apertures106A-106B. In other words, the warm air from the enclosure22vents through the passageway98and out the apertures106A-106B. At the same time, the fans122draw cooler ambient air in from the fan inlet114and pressurize the fan housing110. The cool ambient air in the fan housing110travels through the fan outlet118and pass the damper126into the internal air outlet region66(illustrated with blue arrows inFIG.3). The cool air in the internal air outlet region66then enters the enclosure22via the cutout26B. As described herein, the auxiliary air vent assembly18has the several advantages. First, the auxiliary air vent assembly18provides back-up cooling capability for the enclosure22if the heat exchanger assembly14fails or otherwise becomes ineffective. Second, there is a reduced cost of installation because there are no cutout changes in the enclosure22required for mounting the auxiliary air vent assembly18. Third, there is no interference with the electrical equipment contained within the enclosure22during or after installation of the auxiliary air vent assembly18. In other words, the auxiliary air vent assembly18is mounted on an external surface of the enclosure22and does not extend into the enclosure22. Embodiments of the present disclosure also include methods of manufacturing a mount (e.g., the auxiliary air vent assembly18or portions thereof) for coupling a heat exchanger assembly (e.g., the heat exchanger assembly14) to an enclosure (e.g., the enclosure22). With reference toFIG.9, a method130of manufacturing a mount for a heat exchanger assembly is illustrated. The rim58of the auxiliary air vent assembly18is a laser cut and welded square tube design, whereas conventional vent solutions are typically fabricated with sheet metal. As described herein, the rim58is a single square tube that has apertures (e.g., the apertures102A-102D,106A-106B) laser cut therein (FIGS.7A and7B) and then the rim58is formed (bent) into a “U” shape (FIGS.8A and8B). Advantageously, the method130simplifies fabrication and minimizes the number of components required for the auxiliary air vent assembly18. In addition, the rim58advantageously has improved water tightness and sealing from the elements because the rim58is formed from a single square tube component. The method130includes STEP134of providing a square tube154(e.g., a single straight square tube) with the internal passageway98defined therein. The square tube154includes four external surfaces158A,158B,158C,158D. With reference toFIGS.7A and7B, STEP138of the method130includes forming apertures (e.g., the inward facing apertures102A-102D) in a first surface158A of the square tube154, and STEP142includes forming apertures (e.g., the outward facing apertures106A-106B) in a second surface158B of the square tube154. In the illustrated embodiment, the second surface158B is opposite the first surface158A. The internal passageway98places the apertures106A-106D on the first surface158A and the apertures102A-102B on the second surface158B in fluid communication with each other. The method130further includes STEP146of forming a first relief162A and a second relief162B in the square tube154. In the illustrated embodiment, the first relief162A and the second relief162B are formed in the first surface158A, the third surface158C, and the fourth surface158D. In the illustrated embodiment, the first relief162A is positioned between the aperture102A and the aperture102B, and the second relief162B is positioned between the aperture102C and the aperture102D (FIG.7A). In some embodiments, forming of the apertures102A-102D,106A-106B and reliefs162A,162B of STEPS138,142, and146are performed with laser cutting. With reference toFIGS.8A and8B, the method130further includes STEP150of bending the square tube154at the first relief162A to form a first corner166A and bending the square tube154at the second relief162B to form a second corner166B. In some embodiments, after bending, the square tube154is “U” or “C” shaped. The bending steps (e.g., STEP150) transforms the first external surface158A into the inner portion90with three inward facing surface94A-94C and transforms the second external surface158B into an outer portion82with three outward facing surface86A-86C. In other words, in response to bending the square tube154, the straight square tube becomes U-shaped, the first surface158A becomes a plurality of inward facing surfaces94A-94C, and the second surface158B becomes a plurality of outward facing surfaces86A-86C. As such, the method130transforms the square tube154into the rim58. In some embodiments, the method130further includes coupling a divider (e.g., the divider70) to the first surface158A the square tube154(e.g., the inner portion90, the inward facing surface94A-94C). In the illustrated embodiment, the divider70is coupled to the inward facing surface94A and the inward facing surface94C. In some embodiments, the method130further includes coupling a fan module (e.g., the fan housing110, etc.) to the first surface158A the square tube154(e.g., the inner portion90, the inward facing surface94A-94C). In some embodiments, coupling the divider and/or the fan module to the square tube154is done with welding (e.g., TIG welding, laser welding, etc.). In the illustrated embodiment, the method130is described as a series of sequential steps. In some embodiments, the order in which the steps are performed is modified or done simultaneously with another step. It will be readily apparent to those skilled in the art that other suitable modifications. It is understood that the foregoing detailed description and accompanying examples are merely illustrative and are not to be taken as limitations upon the scope of the disclosure, which is defined solely by the appended claims and their equivalents. Various changes and modifications to the disclosed embodiments will be apparent to those skilled in the art. Such changes and modifications of the disclosure may be made without departing from the spirit and scope thereof. | 21,271 |
11858028 | DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS While the invention may be susceptible to embodiment in different forms, there is shown in the drawings, and herein will be described in detail, specific embodiments with the understanding that the present disclosure is to be considered an exemplification of the principles of the invention, and is not intended to limit the invention to that as illustrated and described herein. A first embodiment of the invention is illustrated inFIGS.1-22; a second embodiment of the invention is illustrated inFIGS.23-26and29-33; alternative pivot mechanisms are illustrated inFIGS.27and28; and the circuit for the invention is illustrated inFIGS.34-39. As best shown inFIGS.1and2, a conduit bender20generally includes a frame22, a shoe24rotatably mounted to the frame22, a motor26for providing rotational force to the shoe24, a main roller assembly28, an auxiliary roller assembly30, a roller positioning assembly32and a microprocessor61. The shoe24, the main roller assembly28, the auxiliary roller assembly30and the roller positioning assembly32are cantilevered on the frame22as described herein. The microprocessor61is provided within the frame22and is configured to control a motor which rotates the shoe24to perform the bending operation as will be described herein. As shown, the conduit bender20is mounted to a base31which includes a pair of lead wheels33(one of which is shown inFIG.1) and a pair of rear wheels35which are used to transport the conduit bender20from one location to the next. Of course, the conduit bender20is not required to be mounted to the movable base31. A braking assembly used to prevent rotation of the rear wheels35is described in connection with the second embodiment of the conduit bender400. It is to be understood that this braking mechanism can be utilized in connection with the base31as well. As will be described herein, the conduit bender20is pivotally mounted to the base31and therefore can be pivoted between a vertical position as shown inFIG.1(i.e. a position in which the conduit is bent in a vertical plane) and a horizontal position (i.e. a position in which the conduit is bent in a horizontal plane, “a table-top” configuration). Thus, in describing the conduit bender20, the terms “up” or “upper” and “down” or “lower” will be used with reference to the orientation of the conduit bender20shown inFIG.1. The term “inner” will generally be used to refer to the direction shown by the arrow37, and the term “outer” will be used to refer to the direction shown by the arrow39. The term “lead” will generally refer to the direction the conduit is advanced by the conduit bender20as shown by the arrow38, and the term “rear” will generally refer to the direction from which the conduit is taken as shown by the arrow41. It is to be understood however, that these references and directions are provided in order to more easily describe the invention and are not intended to limit the invention. The frame22is formed of a first portion22′ shown inFIGS.1and3and a second portion22″ shown inFIG.1. As shown inFIG.3, the first portion22′ of the frame22is provided by a single weldment and includes a base42, a shoe shaft44, an upper support shaft46, a lower support shaft48, a lead support shaft50, a roller assembly positioning shaft51, a rear support shaft53, and a support member assembly52. The shafts44,46,48,50,51,53are attached to the frame22in a cantilevered manner, such that an end of each shaft44,46,48,50,51,53is secured to the frame22and the opposite end of each shaft44,46,48,50,51,53is free. The support shafts46,48,50,53support the main roller assembly28and provide a resistive force for bending the conduit. The second portion22″ forms a generally enclosed box having apertures which align with the shoe shaft44to allow the shoe shaft44to pass therethrough. The shafts46,48,50,51,53extend below the second portion22″ of the frame22. Frame face23is provided by the second portion22″. An inner end of the shoe24is positioned proximate the frame face23. The frame face23extends in a plane perpendicular to the shoe shaft44. Frame back25is provided opposite the frame face23and a frame bottom27generally extends from the frame face23to the frame back25. The frame base42includes first and second generally triangularly-shaped plates54,56spaced from one another by a lower spacer45and an upper spacer/hoist bar47. Each plate54,56includes a first surface54a,56aand an opposite second surface54b,56b. The first surfaces54a,56aof the first and second plates54,56face each other. The plates54,56include aligned shoe shaft apertures through which the shoe shaft44extends, aligned upper support shaft apertures through which the upper support shaft46extends, aligned lower support shaft apertures through which the lower support shaft48extends, aligned lead support shaft apertures through which the lead support shaft50extends, and aligned rear support shaft apertures through which the rear support shaft53extends. The shoe shaft44, the upper support shaft46, the lower support shaft48, the lead support shaft50, the roller assembly positioning shaft51, and the rear support shaft53extend beyond the second surface56bof the second plate56. As best shown inFIGS.3-5, the support member assembly52is mounted on the frame22by the upper support shaft46, the lower support shaft48, and the roller assembly positioning shaft51. The support member assembly52includes a guide wall60and a plurality of support members62a-62ewhich are spaced apart from each other along the upper and lower support shafts46,48. The guide wall60is formed of a plate which is generally rectangularly shaped having a front, rear, top and bottom edges. The guide wall60includes an upper support shaft aperture64, a lower support shaft aperture66, a lead guide path70, a rear guide path72, and a roller assembly positioning shaft aperture74which are spaced apart from each other. The upper support shaft aperture64and the lower support shaft aperture66are vertically aligned with each other and are proximate to the rear edge of the guide wall60. The rear guide path72is spaced upwardly from the upper support shaft aperture64and extends horizontally from proximate the rear edge toward the front edge. The lead guide path70extends from the top edge of the guide wall60proximate to the front edge of the guide wall60, and extends downwardly and rearwardly. The lead guide path70is curved. The roller assembly positioning shaft aperture74is positioned proximate to the corner provided by the front edge and the bottom edge. The upper support shaft aperture64receives the upper support shaft46therethrough; the lower support shaft aperture66receives the lower support shaft48therethrough; and the roller assembly positioning shaft aperture74receives the roller assembly positioning shaft51. The guide wall60is positioned proximate the second surface56bof the second plate56of the frame22. The lead and rear guide paths70,72assist in positioning the main roller assembly28in either the up or down position as will be described herein. The guide wall60further includes a lead mounting bar aperture69and a rear mounting bar aperture71which are spaced apart from each other and from the other apertures/paths64,66,70,72,74. The lead mounting bar aperture69is positioned between the roller assembly positioning shaft aperture74and the vertically aligned upper and lower support shaft apertures64,66. The rear mounting bar aperture71is positioned proximate the rear edge and between the vertically aligned upper and lower support shaft apertures64,66. The first support member62a, second support member62b, third support member62c, fourth support member62dand fifth support member62eare each similarly shaped. Each support member62a-62eis a plate generally shaped as a right triangle having an upper guide surface86, a lead surface83and a rear surface85. Each support member62a-62eincludes an upper support shaft aperture76, a lower support shaft aperture78, a lead lever switch mounting bar aperture82, and a rear lever switch mounting bar aperture84. As best shown inFIGS.4and5, the upper support shaft46of the frame22extends through the upper support shaft apertures76of the support members62a-62e; the lower support shaft48of the frame extends through the lower support shaft apertures78of the support members62a-62e; a lead mounting bar88extends through the lead mounting bar apertures82of the support members62a-62e; and a rear mounting bar90extends through the rear mounting bar apertures84of the support members62a-62e. As best shown inFIG.5, an outermost portion46aof the upper support shaft46and an outermost portion48aof the lower support shaft48extend outwardly of the fifth support member62e. The first support member62ais spaced outwardly from the guide wall60to accommodate rollers of the main roller assembly28as will be described herein. The second support member62bis spaced from the first support member62aand the third support member62cis spaced from the second support member62bto accommodate rollers of the main roller assembly28as will be described herein. The fourth support member62dis spaced from the third support member62cand the fifth support member62eis spaced from the fourth support member62dto accommodate rollers of the roller assembly28as will be described herein. The lead mounting bar88extends through the lead mounting bar apertures82of the first, second, third, fourth and fifth support members62a-62eand through the lead mounting bar aperture69of the guide wall60. The lead mounting bar88is fixed at its ends to the guide wall60and to the fifth support member62e. The rear mounting bar90extends through the rear mounting bar apertures84of the first, second, third, fourth, and fifth support members62a-62eand through the rear mounting bar aperture71of the guide wall60. The rear mounting bar90is fixed at its ends to the guide wall60and to the fifth support member62e. As best shown inFIG.5, a first lever switch92is mounted to the lead and rear mounting bars88,90and is positioned between the guide wall60and the first support member62a. A second lever switch94is mounted to the lead and rear mounting bars88,90and is positioned between the second and third support members62b,62c. A third lever switch96is mounted to the lead and rear mounting bars88,90and is positioned between the fourth and fifth support members62d,62e. Each of the lever switches92,94,96is in electrical communication with the microprocessor61as will be described herein. An inner spring mount91is positioned between the second and third support member62b,62cproximate the upper leading ends thereof. An outer spring mount93is positioned between fourth and fifth support members62d,62eproximate the upper leading ends thereof. A plurality of lever assemblies98a,98b,98care mounted on the upper support shaft46of the frame22. The first lever assembly98aincludes a lever tube100aand a lever102afixed thereto as best shown inFIG.6, and a stop bar106a, as shown inFIG.5. The lever tube100ais cylindrically-shaped and defines an upper shaft passageway107a. The lever102aincludes a lower gripping portion108a, an intermediate elbow portion110a, and an upper arm portion112a. The lower gripping portion108aincludes first extension114aand second extension116awhich extends around a portion of the outer surface of the lever tube100a. The second extension116aterminates in an end surface117a. An aperture118ais provided proximate a leading end of the first extension114aand a stop bar aperture120is provided proximate the rear end of the first extension114a. The elbow portion110aextends between the lower gripping portion108aand the upper arm portion112aand is generally S-shaped. The arm portion112aof the lever assembly98aextends upwardly from the elbow portion110aand includes a lower end122aand an upper end124a. The arm portion112adefines an axis126aabout which the upper arm portion112ais twisted. The arm portion112ais twisted so as to provide a ninety-degree rotation of the upper end124aof the arm portion112arelative to the lower end122aof the arm portion112a. An arc-shaped end surface128ais provided at the upper end124aof the arm portion112a. Alternatively, a roller (not shown) may be provided instead of the upper twisted arm portion112a. A first lever spring104ahas an end attached to the first extension114athrough the aperture118a, is wrapped around a portion of the lever tube100a, and an opposite end attached to the lead mounting bar88. The first lever spring104aprovides a rotational force to the lever tube100aand lever102ato urge the lever102ato an upright position. The first lever tube100ais positioned on the upper support shaft46of the frame22between the guide wall60and the first support member62a. The first lever tube100aand lever102arotate about the upper support shaft46. As shown inFIGS.4and5, the first stop bar106ais positioned through the stop bar aperture120a. The first stop bar106aabuts the rear surface85of the first support member62ato prevent the first lever102afrom rotating beyond the upright position as shown inFIGS.4and5. The second lever assembly98bis positioned on the upper support shaft46of the frame22and between the second and third support members62b,62c. As best shown inFIG.7, the second lever assembly98bincludes a lever tube100b(which is shorter than the lever tube100a) and a lever102bfixed to the lever tube100b. As shown inFIG.5, the second lever assembly98balso includes a lever spring104band a stop bar106b. The lever tube100bis cylindrically-shaped and defines an upper shaft passageway107b. The lever102bincludes a lower gripping portion108b, an intermediate elbow portion110b, and an upper arm112b. The lower gripping portion108bincludes first extension114band second extension116bwhich extends around a portion of the outer surface of the lever tube100b. The second extension116bterminates at an end surface117b. A spring aperture118bis provided proximate a leading end of the first extension114b. The elbow portion110bextends upwardly from the lower portion108bto the upper arm112band is generally planar. A stop bar aperture120bis provided proximate the lower end of the elbow portion110b. The arm112bof the lever98bextends upwardly from the elbow portion110band includes a lower end122band an upper end124b. The arm112bdefines an axis126babout which the upper arm112bis twisted. The arm112bis twisted so as to provide a ninety-degree rotation of the upper end124bof the arm112brelative to the lower end122bof the arm112b. An arc-shaped end surface128bis provided at the upper end124bof the arm112b. Alternatively, a roller (not shown) may be provided instead of the upper twisted arm112b. The second lever tube100bis positioned on the upper support shaft46of the frame22and between the second support member62band the third support member62c. The second lever tube100band lever102brotate about the upper support shaft46. A rear end of the second lever spring104bis attached to the second lever102bthrough the spring aperture118band a leading end of the first lever spring104bis attached to the inner spring mount91of the support member assembly52. The second lever spring104bprovides a rotational force to the lever tube100band lever102bto urge the lever102bto an upright position. The second stop bar106bis positioned through the stop bar aperture120band abuts the rear surfaces85of the second and third support member62b,62cto prevent the second lever102bfrom rotating beyond the upright position as shown inFIGS.4and5. The third lever assembly98cincludes a lever tube100cand a lever102cfixed thereto, a lever spring104cand a stop bar106c. The structure of the third lever102cand the lever tube100cof the third lever assembly98care identical to the lever102band lever tube100bof the second lever assembly98bas shown inFIG.7and therefore, the specifics are not repeated herein. Elements of the lever tube100cand lever102care designated inFIG.7with the suffix “c”. A roller (not shown) may be provided instead of the upper twisted arm portion112c. The lever tube100cis positioned on the upper support shaft46of the frame22between the fourth support member62dand the fifth support member62e. The lever tube100cand the lever102crotate about the upper support shaft46. A rear end of a third lever spring104cis attached to the lever102cthrough a spring aperture118cand a leading end of the third lever spring104cis attached to the outer spring mount93of the support member assembly52. The third lever spring104cprovides a rotational force to the lever tube100cand lever102cof the third lever assembly98cto urge the third lever102cto an upright position. The third stop bar106cis positioned through the stop bar aperture120cand abuts rear surfaces85of the fourth and fifth support members62d,62eto prevent the third lever102cfrom rotating beyond the upright position as shown inFIGS.4and5. As best shown inFIGS.2,8and13, the shoe24is generally cylindrically-shaped. A central passageway21is provided through the axial center of the shoe24. The generally cylindrically-shaped shoe24includes a first portion132which is used to bend rigid or IMC type conduit, and a second portion134which is used to bend EMT type conduit. The first portion132of the shoe24includes a set of four arc-shaped channels136a-dalong the outer circumference of the shoe24. The second portion134of the shoe24includes a set of four arc-shaped channels138a-dalong the outer circumference of the shoe24. Each channel136a-dof the first set is aligned with a corresponding channel138a-dof the second set. The channels136a-dof the first set provide leading ends140and trailing ends142, and the channels138a-dof the second set provide leading ends144and trailing ends146. The innermost channel136aof the first portion132is proximate the frame22, and the innermost channel138aof the second portion134is proximate the frame22, and are preferably configured to receive conduit having an outer diameter of two inches. The channel136bof the first portion132proximate to the innermost channel136aand the channel138bof the second portion134proximate to the innermost channel138anext closest to the frame22are preferably configured to receive conduit having an outer diameter of one and one-half inches. The channel136cof the first portion132proximate to the channel136band the channel138cof the second portion134proximate to the channel138bare preferably configured to receive conduit having an outer diameter of one and one-quarter inches. The outermost channel136dof the first set and the outermost channel138dof the second set are preferably configured to receive conduit having an outer diameter of one inch. A first gripping member148, seeFIG.13, is mounted proximate the leading ends140of the first set of channels136a-d, and a second gripping member150is mounted proximate the leading ends144of the second set of channels138a-d. The leading ending140of each channel136a-136dof the first set is spaced approximately forty-five degrees from the trailing end146of each corresponding channel138a-138dof the second set138to provide a gap147. A base143of the first gripping member148is positioned within the gap147. The leading end144of each channel138a-138dof the second set is spaced approximately forty-five degrees from the trailing end142of each corresponding channel136a-136dof the first set to provide a gap149. A base145of the second gripping member150is positioned within the gap149. The gripping members148,150associated with the first and second portions132,134of the shoe24are similarly-formed. The second gripping member150is best shown inFIGS.1and13. The second gripping member150includes a plurality of hooks154a-154dand the first gripping member148includes a plurality of hooks152a-152d. Each hook154a-dis generally associated with a channel138a-d. The first hook154ais generally outwardly bent. The first hook154ais aligned with the first channel138aand is configured to grip a conduit having an outer diameter of two inches. The second hook154bis generally inwardly bent. The second hook154bis aligned with the channel138band is configured to grip a conduit having an outer diameter of one and one-half inches. The third hook154cis outwardly bent. The third hook154cis aligned with the third channel138cand is configured to grip a conduit having an outer diameter of one and one-quarter inches. The fourth hook154dis generally outwardly bent. The fourth hook154dis aligned with the fourth channel138dand is configured to grip a conduit having an outer diameter of one inch. Each hook152a-d(seeFIG.8) of the first gripping member148is generally associated with a channel136a-dof the first portion132of the shoe24. The first hook152ais generally outwardly bent. The first hook152ais aligned with the first channel136aand is configured to grip a conduit having an outer diameter of two inches. The second hook152bis generally inwardly bent. The second hook152bis aligned with the channel136band is configured to grip a conduit having an outer diameter of one and one-half inches. The third hook152cis outwardly bent. The third hook152cis aligned with the third channel136cand is configured to grip a conduit having an outer diameter of one and one-quarter inches. The fourth hook152dis generally outwardly bent. The fourth hook152dis aligned with the fourth channel136dand is configured to grip a conduit having an outer diameter of one inch. As best shown inFIG.13, a shoe sleeve131is fixed to a toothed gear133. The toothed gear133is mounted within the second portion22″ of the frame22and the shoe sleeve131extends outwardly through an aperture in the second portion22″. The shoe shaft44extends through a central passageway in the gear133and through the shoe sleeve131. The shoe24is then mounted to the shoe sleeve131by passing the shoe sleeve131through the central passageway21of the shoe24. The shoe24is secured to the shoe sleeve131by a collar129and locking pin130(seeFIG.8). The shoe sleeve131, gear133and shoe24are mounted to the shoe shaft44of the frame22and are rotated relative to the fixed shoe shaft44in response to activation of the motor26connected to the gear133, so as to bend a conduit mounted to the shoe24as will be described herein. A magnet43(seeFIG.3) is mounted within the shoe shaft44. A sensor135(seeFIG.13) such as, for example, an absolute encoder, is mounted within the shoe sleeve131. Using the magnetic field provided by the magnet43, the absolute encoder135provides a determination as to the degree to which the shoe sleeve131, along with the shoe24, has been rotated relative to the shoe shaft44. The absolute encoder135is in electrical communication with microprocessor61and provides shoe position information to the microprocessor61. For example, if prior to beginning the bend operation the first portion132of the shoe24is positioned proximate the main roller assembly28, the sensor135will provide a signal to the absolute encoder135that the shoe24is positioned for bending IMC or rigid type conduit. On the other hand, if prior to beginning the bend operation, the shoe24along with the shoe sleeve131have been rotated relative to the shoe shaft44such that the second portion134of the shoe24is positioned proximate the roller assembly28, the absolute encoder135will provide a signal to the microprocessor61indicating that the shoe24is positioned for bending EMT type conduit. Although the combination of a magnet43and an absolute encoder135have been described to determine the position of the shoe24relative to the frame22, it is to be understood that a variety of switches can be used can be used to detect the position of the shoe24relative to the frame22. For example, an optical switch could be used wherein a light source provided on the shoe24, or shoe sleeve131provides a signal detected by an optical sensor on the frame22to determine the position of the shoe24relative to the frame22. As shown inFIGS.4and5, the main roller assembly28includes a plurality of rollers156a-c. An innermost set of rollers156ais provided proximate the frame22, an intermediate set of rollers156bis provided outwardly of the inner most set of rollers156a, and an outermost set of rollers156cis provided outwardly of the intermediate set of rollers156b. The innermost set of rollers156ais supported by an inner support plate158and an outer support plate160. The intermediate set of rollers156bis supported by an inner support plate162and an outer support plate164. The outermost set of rollers156cis supported by an inner support plate166and an outer support plate168. Each plate158,160,162,164,166,168includes a roller positioning shaft aperture therethrough proximate the leading ends of the plates158,160,162,164,166,168. A lead guide rod178extends through the roller positioning shaft apertures aperture of each plate158,160,162,164,166,168. As best shown inFIG.5, the innermost set of rollers156aincludes a lead roller170, an intermediate roller172, and a rear roller174. Each roller170,172,174is rotatably mounted between the inner support plate158and the outer support plate160. The lead roller170is positioned proximate the leading ends of the inner and outer support plates158,160and is mounted on a lead roller shaft; the rear roller174is positioned proximate rear ends of the inner and outer support plates158,160and is mounted on a rear guide rod176; and the intermediate roller172is positioned between the lead roller170and the rear roller174and is mounted on an intermediate roller shaft. Each roller170,172,174includes an arcuate surface which is configured to receive a conduit having a diameter of two inches. The intermediate set of rollers156bincludes a lead roller180and a rear roller182. Each roller180,182is rotatably mounted between the inner support plate162and the outer support plate164. The lead roller180is positioned proximate the leading ends of the inner and outer support plates162,164and is mounted on a lead roller shaft; the rear roller182is positioned proximate rear ends of the inner and outer support plates162,164and is mounted on a rear roller shaft. Each roller180,182includes an arcuate surface which is configured to receive a conduit having a diameter of one and one-half inches. A rear guide rod184extends from the inner plate162to the outer plate164proximate the rear ends thereof and below the rear roller190. The rear guide rod184rests on the upper guide surfaces86of second and third support members62b,62c. The outermost set of rollers156cincludes a lead roller188and a rear roller190. Each roller188,190is rotatably mounted between the inner support plate166and the outer support plate168. The lead roller188is positioned proximate the leading ends of the inner and outer support plates166,168and is mounted on a lead roller shaft; the rear roller190is positioned proximate rear ends of the inner and outer support plates166,168and is mounted on a rear roller shaft. Each roller188,190includes an arcuate surface which is configured to receive a conduit having a diameter of one and one-quarter inches. A rear guide rod192extends from the inner plate166to the outer plate168proximate the rear ends thereof and below the rear roller190. The rear guide rod192rests on the upper guide surfaces86of fourth and fifth support members62d,62e. The auxiliary roller assembly30is best shown inFIGS.4,5and8. The auxiliary roller assembly30is provided proximate the main roller assembly28. The auxiliary roller assembly30includes oblong-shaped first and second support members200,202spaced by a cylindrically-shaped spacer204and fixed thereto. The first and second support members200,202include rounded upper and lower ends. An upper shaft passageway is provided through the first and second support members200,202. The upper shaft46of the frame22is positioned within the upper shaft passageways of the first and second support members200,202and through the spacer204. An arc shaped abutment surface206is provided proximate the lower end of each support member200,202. An auxiliary roller208is mounted between the first and second members200,202proximate upper ends of the first and second members200,202. A cylindrically-shaped supplemental spacer210having an upper support shaft passageway therethrough is provided between the fifth support member62eof the frame22and the first support member200of the auxiliary roller assembly30to maintain proper positioning of the auxiliary roller assembly30relative to the fifth support member62eand main roller assembly28. A locking pin212is provided to maintain the auxiliary roller assembly30on the upper support shaft46of the frame22. The roller positioning assembly32is shown inFIGS.10and14. The roller positioning assembly32includes an outer sleeve214, an inner sleeve220, and a positioning ring201. The cylindrically-shaped outer sleeve214defines a central passageway216. A plurality of arms218extend from the outer sleeve214. The cylindrically-shaped inner sleeve220includes an inner end220aand an outer end220b. The inner sleeve220further includes a first eccentric bushing203, and a second eccentric bushing205. The first eccentric bushing203is provided at the inner end220aof the inner sleeve220. The second eccentric bushing205is spaced from the first eccentric bushing203. First and second diametrically opposed locking pins207extend through the first eccentric bushing203. As best shown inFIGS.14and15, the positioning ring201includes an outer cylindrically-shaped wall209and an inner generally cylindrically-shaped wall211. The outer wall209includes a first planar surface215, a second planar surface217, and a circumferential surface219. A number of positioning apertures221extend from the first surface215to the second surface217. The outer wall209and the inner wall211have a uniform thickness. The inner wall211is concentric and is positioned within the outer wall209. The inner wall211includes a first planar surface223and a second planar surface229. The inner wall211further includes a first receiving notch231and a second receiving notch233. The cylindrically-shaped inner sleeve220is positioned within the roller assembly positioning shaft51and extends therefrom in a cantilevered fashion. The inner end220aof the inner sleeve220extends beyond the second surface54bof the first plate54of the frame22. The positioning ring201is mounted to the inner end220aof the inner sleeve220such that the second planar surface217of the positioning ring201is placed proximate the second surface54bof the first plate54of the frame base42. In addition, the locking pins207of the inner sleeve220are positioned within the receiving notches231,233of the positioning ring201. The first eccentric bushing203, therefore, is positioned within the inner wall211of the positioning ring201. The second eccentric bushing205is positioned within the roller assembly positioning shaft51. The eccentric bushings of the inner sleeve220along with the concentrically shaped positioning ring201provide for height adjustment of the roller assembly28as will be described herein. The inner sleeve220is cantilevered such that the outer end220bextends beyond the positioning shaft51of the frame base42and receives the outer sleeve214. The arms218of the outer sleeve214are spaced along the length of the outer sleeve214. When mounted, a first or innermost arm218ais positioned proximate the inner support plate158of the roller assembly28; a second arm218bis positioned between the outer support plate160and the inner plate162of the roller assembly28; a third arm218cis positioned between the outer plate164and the inner plate166cof the roller assembly28; and a fourth arm218dis positioned proximate the outer plate168of the roller assembly28. Each arm218a-218dis generally tear-drop shaped with a rounded narrow upper end and a rounded wide lower end. The central passageway216extends through the lower end of each arm218. A roller positioning guide shaft aperture224is provided through the upper end of each arm218and is aligned with the roller positioning shaft apertures of each plate158,160,162,164,166,168. The lead guide rod178which extends through the roller positioning shaft apertures of the plates158,160,162,164,166,168also extends through the roller positioning guide shaft apertures224of each arm218. A portion of the lead guide rod178extends outwardly of the fourth arm218dto which a handle228is mounted. The handle228provides for rotation of the roller positioning assembly32from an up or forward position as shown inFIGS.4and11to a down or rearward position as shown inFIGS.8and12. As shown inFIG.18, movement of the roller assembly28is guided by shaft177and the lead guide path70. The shaft177(seeFIG.18) extends inwardly of the inner support plate158and is seated within the lead guide path70. When the main roller assembly28is moved relative to the frame22, the shaft177translates along lead guide path70. A cam assembly159which is known in the art, engages the shaft177to hold the shaft177and main roller assembly into an up position as will be described herein. The cam assembly159includes a cam250, a pivot pin252, and a cam spring254(seeFIG.5). The cam250is generally bell-shaped. The cam250includes a first side surface256, a second side surface258, an arcuate holding surface260, and a protrusion262. The cam250is rotatably mounted to the guide wall60via the pivot pin252. A first end of the spring254is attached to a spring pin261and a second end of the spring254is attached to a lower portion of the cam250. As noted above and as shown inFIG.5, the rear guide rod176extends through the rear roller174. A first portion176aof the rear guide rod176extends toward the guide wall60and is seated within the rear guide path72of the guide wall60. A second portion176bof the rear guide rod176extends over and rests upon the upper guide surface86of the support member62a. A roller positioning spring225is shown inFIGS.5and11. Attachment of the roller positioning spring225is not illustrated inFIG.11. A first end225aof the spring225is attached to the roller positioning assembly32and as shown inFIG.5, a second end225bof the spring225is attached to band227positioned around the lower support shaft48of the frame22. The force of the spring225pulls the roller positioning assembly32generally downward and rearward to place the main roller assembly28in the down position. In order to place the main roller assembly28in the up position, the operator must pull upwardly and forwardly on the handle228against the force of the spring225to place the main roller assembly28in the up position. A roller positioning switch226is also illustrated inFIGS.11and12. The roller positioning switch226is mounted to the guide wall60and is in electrical communication with the microprocessor61. When the roller positioning assembly32is in the down position, as shown inFIG.12, the roller positioning assembly32contacts an arm of the roller positioning switch226, providing a signal to the microprocessor61that the roller positioning assembly32together with the main roller assembly28is in the down position. When the roller positioning assembly32is in the up position, as shown inFIG.11, the roller positioning assembly32is no longer in contact with the arm of the roller positioning switch226and therefore the roller positioning switch226provides a signal to the microprocessor61that the roller positioning assembly32together with the main roller assembly28are in the up position. As best illustrated inFIG.9, conduit passageways are provided between the shoe24and roller assembly28. When the first portion132of the shoe24is positioned proximate the roller assembly28, the conduit passageways are provided between the first portion132of the shoe24and the roller assembly28. When the second portion134of the shoe24is positioned proximate the roller assembly28, the conduit passageways are provided between the second portion134of the shoe24and the roller assembly28. More specifically, a two-inch conduit passage213ais provided between the innermost channels136a/138aof the shoe24and the innermost set of rollers156aof the roller assembly28; a one and one-half inch conduit passage213bis provided between the channels136b/138bof the shoe24and the intermediate set of roller156bof the roller assembly28; a one and one-quarter inch conduit passage213cis provided between the channels136c/138cof the shoe24and the outermost set of rollers156cof the roller assembly; and a one inch conduit passage213dis provided between the channels136d/138dof the shoe24and auxiliary roller208of the auxiliary roller assembly30. Portions of the electronic circuit associated with the conduit bender20are illustrated inFIGS.34-40. As shown inFIG.40, the circuit699generally includes an auto-sensing portion697which provides information about the characteristics of the conduit to be bent and a feedback portion695which provides feedback information to achieve bending accuracy. The auto-sensing portion697of the circuit699includes the absolute encoder135(seeFIG.13), an ABS encoder interface700(seeFIG.34), the conduit size and roller positioning sensor circuit702(seeFIG.35), the microprocessor61, and a flash memory704(seeFIGS.36and37). Portions61a,61b, and61cof the microprocessor61are shown inFIGS.36a-cand portions61dand61eof the microprocessor61are shown inFIG.37.FIG.37further illustrates electrical connections between portions61dand61eof the microprocessor61and the flash memory704. As discussed above, the absolute encoder135is mounted within the shoe sleeve131. The absolute encoder135is preferably an AEAT-6012 type absolute encoder. Connection between the microprocessor61and the absolute encoder135is provided by the ABS encoder interface700shown inFIG.34. A length of wire is provided along the shoe sleeve131to connect the absolute encoder135to the J18 connector of the interface700. The interface700includes leveling circuit including transistor Q14to translate the 3.3V ENC CSn signal720from the microprocessor61(see portion61billustrated inFIG.36b) to the 5V signal required by the absolute encoder135. The interface700also includes leveling circuit including transistor Q15to translate the 3.3V ENC_CLK signal722from the microprocessor61to the 5V signal required by the absolute encoder135. Capacitors C107, C109, C111of the interface700are provided to reduce the noise on the signal lines thereby preventing false signals from the absolute encoder135. Interface700further includes element U10to provide power to the absolute encoder135. U10is controlled by the ENC_PWR CTRL signal724from the microprocessor61(see portion61cillustrated inFIG.36c). Resistor R117and capacitor C126provide an RC delay circuit to delay power-on of the encoder135to ensure that the absolute encoder135will not power up until after the microprocessor61is ready. In order to simplify the assembly process, the absolute encoder135may be mounted with any orientation on the shoe sleeve131. Upon initially powering the conduit bender20on, the system is moved into the factory “zero” or initial setting. In this “zero” initial setting, a unique combination of keys is entered and an initial value is provided by signal ENC_DATA signal726from the encoder135to the microprocessor61(see portion61billustrated in FIG.36b). This initial value of the signal ENC_DATA signal726is stored in the flash memory704on the control board. The absolute encoder135continuously provides the ENC_DATA signal726to the microprocessor61. A comparison between the value of the ENC_DATA signal726to the initial value of the ENC_DATA signal stored in the flash memory allows a precise position of the shoe24relative to the shoe shaft44to be determined at any given time. The conduit size and roller positioning sensor circuit702illustrated inFIG.35provides an interface between the controller and microprocessor61and the lever switches92,94,96discussed above. The circuit702includes a conduit size connector J14 and surrounding components. The conduit size connector J14 includes inputs3,5,6, associated with switches92,94, and96. Signal COND_SIZE2734and signal COND_SIZE6736are not currently associated with switches on the conduit bender20, however, additional inputs4and8of the connector J14 are provided should the opportunity arise for including additional signals to be provided to the microprocessor61upon modification of the invention. Input7of the connector J14 is associated with the roller positioning switch226and provides the roller positioning signal COND_SIZE5738to the microprocessor61(see portion61b). This COND_SIZE5signal738provides an indication to the controller as to whether the main roller assembly28is in an up position or in a down position and thus indicates to the microprocessor61what type of conduit has been placed in the conduit bender20for the bending operation. The inputs of the connector J14 are consistently monitored by the microprocessor61to determine the size of conduit placed in the conduit bender20and to determine the type of conduit placed in the bender. Noise suppression circuit is provided in connection with the signals728-738to prevent the transmission of switch bouncing signals to the microprocessor61. A motor control signal711, such as for example, a pulse width modulator (PWM) signal, controls the motor26and thus controls rotation of the shoe24. To make a bend in a conduit, the microprocessor61utilizes the information received from the user regarding the desired bend to be made and the information from the auto-sensing portion of the circuit699regarding the characteristics of the conduit to be bent, in order to determine the degree to which the shoe24is to be rotated, i.e. the stop position/location of the shoe24, to achieve the desired bend. As the shoe24approaches the stop position, the PWM signal711is adjusted to gradually reduce the power delivered to the motor26, thereby gradually reducing the speed at which the shoe24is rotated until eventually the rotation of the shoe24is stopped. Because rotation of the shoe24is stopped gradually, no mechanical brake is needed to stop rotation of the shoe24. As noted above, the feedback portion695of the circuit699provides feedback regarding the bending operation. Key components of the feedback portion695of the circuit699include a VBUS sensing circuit708(seeFIG.38), a current sensing circuit710(seeFIG.39), and the microprocessor61. The VBUS sensing circuit708is illustrated inFIG.38and provides a measure of the voltage consumed by the motor26. A bridge rectifier provides voltages at BUS+ and BUS−. The VBUS sensing circuit708includes an op-amp U1A and associated components for translating the voltage levels at BUS+ and BUS− down to an acceptable level to be provided to the microprocessor61at VBUS MEAS. The signal VBUS MEAS740is a measure of the voltage consumed by the motor26. The signal VBUS MEAS740is provided to an analog-to-digital input pin of the microprocessor61(see61a) wherein the signal is converted to a digital value which is then translated by the microprocessor61to a known value. The current sensing circuit710includes component CS1for translation of the bus voltage down to an acceptable level to be provided to the microprocessor61at CURRENTA LEG. The signal CURRENTA LEG750is a measure of the current consumed by the motor26. The signal CURRENTA LEG750is provided to an analog-to-digital input pin of the microprocessor61(see61a) wherein the signal is converted to a digital value which is then translated by the microprocessor61to a known value. The microprocessor61then utilizes the known value derived from the signal VBUS MEAS740and the known value derived from the signal CURRENTA LEG750to determine the power consumed by the motor26. The microprocessor61continuously monitors the signals VBUS MEAS740and CURRENT A LEG750. By monitoring the power consumption, adjustment can be made to the PWM signal to control the bending operation. For example, if the signal CURRENTA LEG750indicates that current consumption is too high (i.e. indicating that the amperage rating for the conduit bender application may be exceeded), the microprocessor61is utilized to adjust the PWM signal and to lower the speed of the motor26thereby avoiding the possibility of exceeding the amperage rating of the conduit bender20. The feedback portion695of the circuit699also provides the ability to provide a precise bend to the conduit. For example, although conduits of the same type (e.g. EMT, rigid or IMC) are presumed to have the same rigidity, the rigidity of each conduit generally falls within a range of rigidities. Thus, one piece of EMT conduit may bend more easily than another piece of EMT conduit. Although a PWM signal711can be provided to the motor26based upon the presumed rigidity, if the actual rigidity of the conduit varies from the presumed rigidity, the bend provided to the conduit will be either insufficient or too great. The feedback portion of the circuit699allows the bending operation to be adjusted to account for fluxuations in rigidity. By monitoring the power consumed by the motor26through the signals VBUS MEAS740and CURRENTA LEG750, the PWM signal711can be adjusted. For example, if the power consumption is greater than anticipated, indicating that the rigidity of the conduit is greater than anticipated, the PWM signal711can be adjusted to increase the degree to which the motor26will rotate the shoe24, to account for the additional spring back which will be experienced by the conduit. Thus, in addition to using the PWM signal711to eliminate the need for a mechanical brake, the feedback portion695provides additional information to adjust the PWM signal711to more precisely stop rotation of the shoe based upon the physical characteristics of the conduit placed in the bender. Use of the conduit bender20begins by determining which portion132,134of the shoe24will be used for bending the conduit. If the conduit to be bent is IMC or rigid type conduit, the first portion132of the shoe24is positioned to receive the conduit. If the conduit to be bent is EMT type conduit, the second portion134of the shoe24is positioned to receive the conduit to be bent. In order to more easily identify which shoe portion132or134is associated with IMC or rigid type conduit and which shoe portion132,134is associated with EMT type conduit, color coding can be provided on the gripping members148,150. The color coding provides a visual indication as to the type of conduit that each portion of the shoe24is used to bend. For example, the gripping member148associated with the first portion132of the shoe24and therefore associated with IMC and rigid type conduit can be made green, and the gripping member150associated with the second portion134of the shoe24and therefore associated with EMT type conduit can be made silver. FIG.8shows an example of a rigid type conduit18to be bent. As shown inFIG.8, the shoe24has been rotated relative to the shaft44of the frame22in order to position the first portion132of the shoe24proximate the main roller assembly28. With the shoe24properly positioned, the relative positions of the magnet43and the absolute encoder135provide a signal to the microprocessor61indicating that the conduit to be bent is either IMC type or rigid type conduit. Prior to bending conduit18, if desired, the operator can adjust the height of the inner sleeve220. This adjustment is sometimes referred to as “squeeze adjustment”. To adjust the height of the inner sleeve220, the operator rotates the positioning ring201and joined inner sleeve220to an appropriate position and locks the positioning ring201and inner sleeve220into position relative to the frame base42by inserting a fastener through a threaded positioning aperture221aligned with the threaded hole in the frame22. Due to the interaction of the eccentrically shaped bushing203and the concentrically shaped inner wall211of the ring201, upon rotation of the inner sleeve220and positioning ring201, the height of the inner sleeve220relative to the shoe shaft44changes as illustrated inFIGS.15-17.FIG.15illustrates the inner sleeve220at a minimum height, i.e. with the greatest distance between the inner sleeve220and the shoe shaft44.FIG.16illustrates the inner sleeve220at a medium height; andFIG.17illustrates the inner sleeve220at a maximum height (i.e. with the minimum distance between the inner sleeve220and the shoe shaft44). By varying the height of the inner sleeve220, excessively high resistive loads can be reduced. Correct positioning of the inner sleeve220results in correct positioning of the roller assembly28relative to the shoe shaft44. The adjustment provided by the positioning ring201allows the operator to compensate for manufacturing variances in the conduit bender20and/or the conduit to be bent. The roller positioning assembly32generally begins in the down position which places the main roller assembly28also in a down position. Next, the operator determines if the main roller assembly28is to be lifted to an upward position. As noted earlier,FIG.8illustrates use of the conduit bender20to bend a rigid type conduit. When bending rigid type conduit, additional support rollers are not needed to bend the conduit18and therefore the main roller assembly28is left in the downward position as shown inFIGS.8and12. As best shown inFIG.12, in this down position, the lead guide rod178which supports the handle228of the roller positioning assembly32, is positioned proximate the lead surfaces83of the support members62a-62e. In addition, with the main roller assembly28in the down position, the roller positioning assembly32contacts an arm of the roller positioning switch226. The roller positioning switch226is in electrical communication with the microprocessor61and provides a signal COND_SIZE5738to the microprocessor61indicating that the main roller assembly28is in the down position, thereby indicating that the type of conduit to be bent is rigid type conduit. Once the roller assembly28has been properly positioned, next as shown inFIG.8, the operator aligns a conduit18with the appropriately sized conduit passage213between the first portion132of the shoe24and the roller assembly28. Because the conduit18has a two-inch diameter, the conduit18is therefore aligned with the two-inch conduit passage213aprovided by the first channel136aof the first portion132of the shoe24and the innermost set of rollers156aof the roller assembly28. With the conduit18aligned with channel136aof the shoe24and the innermost set of rollers156a, the conduit18will also be aligned between the guide wall60and the first support member62aof the support member assembly52. With the conduit18properly positioned, the side wall of the conduit18will contact the arc-shaped end surface128aof the lever102a. Contact between the conduit18and the lever102acauses the lever102ato rotate about the upper support shaft46. As the lever102ais rotated, the end surface117aof the second extension116aof the lever102acontacts the arm of the lever switch92. Contact between the end surface117aof the lever102awith the arm of the lever switch92, activates the lever switch92, causing a signal COND_SIZE1728to be provided to the microprocessor61providing an indication that the conduit18to be bent has a diameter of two inches. Contact between the end surface117cof the lever102cwith the arm of the lever switch96is illustrated inFIG.11. The conduit18is moved forward within the path defined by the channels136aand the set of rollers156a. When the conduit18has been advanced sufficiently forward to position the portion of the conduit18at which a bend is be made proximate the shoe24, the leading portion of the conduit18is engaged with the first hook152aof the gripping member148. The operator utilizes an input device to indicate the degrees to which the conduit18is to be bent and this information is provided to the microprocessor61. The operator is not required to provide information regarding the characteristics of the conduit18to be bent. Rather, this information regarding the characteristics of the conduit to be bent is obtained by the auto-sensing portion697of the circuit699. In particular, with the first portion of the bender shoe24positioned proximate the roller assembly28, the absolute encoder135provides signal ENC_DATA signal726to the microprocessor61, identifying the conduit type as IMC or rigid; with the roller assembly28positioned in the down position, roller positioning switch226provides a signal COND_SIZE5738to the microprocessor61indicating that the type of conduit to be bent is rigid type conduit; and with the conduit18placed within the conduit passage213activation of the switch92provides a signal, COND_SIZE1728to the microprocessor61providing an indication that the conduit18to be bent has a diameter of two inches. Thus, the microprocessor61has all of the conduit characteristic information needed to determine how long and at what speed the motor26is to be run in order to provide the appropriate degree of rotation to the shoe24to achieve the desired bend. Thus, without requiring the operator to use look-up tables and without requiring the operator to set dials and/or switches, the microprocessor61receives an indication as to the type and diameter of the conduit to be bent. All that is required by the operator is to position the appropriate first or second portion132,134of the shoe24next to the roller assembly28, to position the conduit18within the appropriate channel136/138of the shoe24, and finally to place the roller assembly28in the up or down position as needed. Each of the steps must be carried out by the operator in order to perform a bending operation and therefore no additional steps are required in order to provide the microprocessor61with the information necessary to conduct the bend operation. With the conduit18in place, the operator activates the motor26to begin the bend operation. Activation of the motor26causes the shoe24to rotate via gear133, and the conduit18which is gripped by the gripping member148is advanced forward as it is bent around the shoe24. The two-inch conduit18is bent along the channel136aof the first portion132of the shoe24. The rear roller174of the innermost set of rollers156aprovides a resistive force for the bending operation. If the main roller assembly28was placed in the up position for bending, the rear roller174, the intermediate roller172and the lead roller170would also provide a resistive force for the bending operation. When the shoe24has been rotated to the degree determined by the microprocessor61, the motor26is stopped and rotation of the shoe24is completed. As the shoe24is rotated the feedback portion of the circuit699of the conduit bender20provides signals VBUS MEAS740and CURRENTA LEG750to the microprocessor61. As noted above, the microprocessor61is configured to utilize these signals740,750to determine the power consumption of the motor26. Utilizing this information, the microprocessor61is configured to adjust the PWM signal to adjust the power provided to the motor in order to increase or decrease the speed of the motor. Adjustment of the PWM signal, therefore, can account for variances in conduit rigidity/elasticity. As the end of the bend operation is approaching, the speed of the motor26is gradually decreased, allowing the shoe rotation to stop at the precise end of bending operation without the use of a mechanical brake. Bending of an IMC type conduit is illustrated inFIG.11. The bend operation illustrated inFIG.11begins by determining which portion of the shoe24is to be used for bending the conduit16. Because the conduit16is an IMC type conduit, the operator locates the first portion132of the shoe24by identifying the first gripping member148which has been coded with the color green and positions the first portion132of the shoe24proximate the main roller assembly28. With the shoe24properly positioned, the relative positions of the magnet43and the absolute encoder135provide a signal ENC_DATA signal726to the microprocessor61indicating that the conduit to be bent is one of either IMC type or rigid type conduit. Bending of an IMC type conduit requires the use of additional roller support as illustrated inFIG.11. The operator grasps the handle228of the roller positioning assembly32and lifts the main roller assembly28to the upward position to provide additional support rollers for the bending operation. As the roller positioning assembly32is rotated from the down position shown inFIG.12to the up position shown inFIG.11, the first portion176aof the rear guide rod176extending within the rear guide path72of the guide wall60moves forward within the rear guide path72. In addition, as the main roller assembly28is moved from the downward position shown inFIG.12to the upward position shown inFIG.11, the shaft177travels along the lead guide path70and interacts with the cam250as shown inFIGS.18to22. More specifically, the main roller assembly28begins in the down position with the shaft177positioned at the bottom of the lead guide path70as shown inFIG.18. In this rest position, the cam250is positioned such that the first side surface256extends approximately across the lead guide path70and the protrusion262extends to a position approximately equivalent to the 8:00 position on a clock. As handle228is rotated in a counter-clockwise direction, the roller assembly28is lifted, the shaft177begins to move up the lead guide path70and will encounter the cam250as shown inFIG.19and the cam250will rotate in a clockwise direction. Once the shaft177has moved beyond the first side surface256of the cam250, the cam250will begin to rotate counter-clockwise and the arcuate holding surface260of the cam and/or the protrusion262will engage the shaft177. With the shaft177and the cam250so engaged, as illustrated inFIG.20, the main roller assembly28will be secured in the “up” position, preventing the roller assembly28from retracting downward. When the main roller assembly28is in the up position, the lead guide rod178, which runs through arms218of the roller positioning assembly32and through the plates158,160,162,164,166,168of the main roller assembly28, is positioned on top of the upper guide surfaces of the support members62a-62e. With the main roller assembly28in the up position, the roller positioning assembly32does not contact the arm of the roller positioning switch226. Because no contact is made with the roller positioning switch226, the signal COND_SIZE5738is not provided to the microprocessor61. As a result, the state of the main roller assembly28is known to the microprocessor61to be in the up position, thereby indicating that the type of conduit to be bent is IMC type conduit. Next, the operator aligns the conduit16with the appropriately sized channel136of the shoe24. As shown inFIG.11, the conduit16has a one and one-quarter inch diameter and is therefore aligned with the third channel136cof the first portion132of the shoe24. With the conduit16aligned with channel136cof the shoe24, the conduit16will also be aligned with the outermost set of rollers156cof the main roller assembly28and between the fourth and fifth support members62d,62eof the support member assembly52. With the conduit16positioned within the channel136c, the side wall of the conduit16will contact the arc-shaped end surface128cof the lever102c. Contact between the conduit16and the lever102ccauses the lever102cto rotate about the upper support shaft46. As the lever102cis rotated, the end surface117cof the second extension116cof the lever102ccontacts the arm of the lever switch96. Contact between the end surface117cof the lever102cwith the arm of the lever switch96causes a signal COND_SIZE4732to be provided by the lever switch96to the microprocessor61providing an indication that the conduit16to be bent has a diameter of one and one-quarter inches. The conduit16is then moved forward within the path defined by the channel136cand the set of rollers156c. When the conduit16has been advanced sufficiently forward to position the portion of the conduit16at which a bend is be made proximate the shoe24, a leading portion of the conduit16is engaged with the third hook152cof the gripping member148. Thus, without requiring the operator to use look-up tables and without requiring the operator to set dials and/or switches, the microprocessor61receives an indication as to the type and size of the conduit16to be bent. All that is required by the operator is to position the shoe24for bending, to position the conduit16within the appropriate channel136cof the shoe24, and to place the main roller assembly28in the up position. Each of these steps must be carried out by the operator in order to perform a bending operation and therefore no additional steps are required in order to provide the microprocessor61with the conduit characteristic information necessary to determine the degree to which the shoe24is to be rotated to perform the bend operation. Based upon the information received from the absolute encoder135, the lever switch96, and the roller positioning switch226, the microprocessor61is configured to determine the degree to which the shoe24will be rotated during the bend operation. With the conduit16in place, the operator activates the motor26to begin the bend operation. Upon activation of the motor26, the shoe24will rotate via gear133and the conduit16, which is gripped by the gripping member148, is bent along the channel136cof the first portion132of the shoe24. The rear roller190and the lead roller188of the outermost set of rollers156cprovide a resistive force for the bending operation. Similar to the bending operation for the conduit18described above, during the bending operation, the feedback portion695of the circuit699provides the signals VBUS MEAS740and CURRENT A LEG750to the microprocessor61. The microprocessor61utilizes these signals to determine power consumption of the motor26. The microprocessor61adjusts the PWM signal711based upon the feedback information to determine the stop point for the bend operation. When the bend operation is complete, the PWM signal711is terminated to stop rotation of the shoe24. After the shoe24has been rotated to bend the conduit16,18, the conduit16,18is removed from the conduit bender20. Upon removal of the conduit16,18, any lever switch92,94,96which had been previously rotated in a rearward direction is returned to the upright position as a result of the force provided by the lever springs104a,104b,104c. Upon completion of the bend, if the operator wishes to lower the main roller assembly28, the handle228is again rotated in the counter-clockwise direction moving the shaft177further up the lead guide path70. As the shaft177moves further up the lead guide path70the cam250rotates in a clockwise direction until the shaft177clears the protrusion262of the cam250. Upon clearing the protrusion262, the cam250will begin to rotate counter-clockwise and the shaft177will reach the upper end of the lead guide path70. Once the shaft177has cleared the protrusion262of the cam250, the cam250will rotate clockwise until it again reaches the rest position with the protrusion262positioned at approximately 8:00 as shown inFIG.21. The handle228is then rotated in the clockwise direction. As the handle228is rotated the shaft177will move down the lead guide path70and will abut the second side surface258of the cam250causing the cam to rotate in a counter clockwise direction as shown inFIG.22. The shaft177will continue to move down the lead guide path70until it reaches the lower end of the lead guide path70. As the shaft177moves downward, the cam250will continue to rotate in a counterclockwise direction until the shaft177clears the second side surface258and the protrusion262. Once the shaft177has cleared the cam250, the cam250will return to its rest position as shown inFIG.18. Use of the conduit bender20to bend one-inch diameter conduit varies from the bending processes described above as follows. If the operator wants to bend a conduit having a diameter of one inch, the operator first positions the appropriate portion132,134of the shoe24proximate the main roller assembly28. With the shoe24properly positioned, the operator then aligns the one-inch conduit with the outermost channel (either136dor138d) of the shoe24. Upon aligning the conduit with the outermost channel (either136dor138d), the conduit will rest upon the roller208of the auxiliary roller assembly30. The operator then moves the conduit forward until the conduit is appropriately gripped by either the outermost hook152dof the gripping member148or the outermost hook154dof the gripping member150. When the conduit is properly positioned, the operator activates the motor26to begin rotating the shoe24. The microprocessor61determines the degree to which the shoe24is to be rotated based upon information received from the absolute encoder135, the lever switches92,94,96, and the roller positioning switch226. When a one-inch conduit is bent, the microprocessor61will receive the signal from the absolute encoder135which identifies the one-inch conduit as either IMC or Rigid or as EMT. A lever switch92,94,96is not associated with the outermost channel136dor138dof the shoe24, therefore if the microprocessor61does not receive an indication that one of the switches92,94or96has been activated, the microprocessor61is configured to recognize that a one-inch conduit is to be bent. When bending one-inch sized conduit, the roller positioning assembly32is not utilized and thus, no indication is provided as to whether IMC or Rigid type conduit is to be bent by the conduit bender400. The feedback portion of the circuit699described above, however, provides the necessary information. By monitoring the power consumption of the motor26, the rigidity of the conduit can be detected, and the PWM signal can be adjusted as required to adjust the power delivered to the motor26. As described, lever switches92,94, and96are respectively associated with two inch, one and one-half inch, and one and one-quarter inch conduits and no lever switch is associated with one-inch conduits. Thus, only three lever switches are needed to properly identify four sizes of conduit. Although in the embodiment shown, no lever switch is associated with one-inch conduits, it is to be understood that any one of the conduit sizes could be chosen as the conduit size which does not have a lever switch associated with it. For example, lever switches could be associated with one and one-half inch, one and one-quarter inch and one-inch conduits and no lever switch would be necessary in connection with two-inch conduits. A pivoting assembly300for pivoting the frame22and the components of the conduit bender20mounted thereon is provided between the base31and the frame22. The assembly300permits the shoe24to be mounted in the vertical position shown inFIG.1, or rotated to a horizontal position, wherein the shoe24is perpendicular to the position shown inFIG.1(i.e. the tabletop configuration). Pivoting between the horizontal and vertical positions will be described in connection with the second embodiment of the conduit bender400. It is to be understood that pivoting of the conduit bender20occurs in the same manner as pivoting of the conduit bender400. A handle302is attached to the frame22to facilitate pivoting the frame22and the components of the conduit bender20relative to the base31between the horizontal and vertical positions. The handle302can also be utilized when rolling the conduit bender20on the wheels33,35to transport the conduit bender20to a new location. The unitary construction of the first portion22′ of the frame22provides fixed relative positions of the shoe shaft44, the upper support shaft46, the lower support shaft48, and the lead support shaft50, thereby providing fixed relative positions of the shoe24and the roller assembly28, for example. This fixed position, allows for greater control and consistency in bending the conduit, as this dimension does not vary. In contrast, benders which provide roller assemblies mounted to a base member separate from the frame which supports the shoe shaft, may be subject to variation in the dimension between the shoe shaft and the roller assemblies. This variation may occur, for example, as a result of transporting the bender. If, for example, as the bender is transported between locations, the base member is jarred, an altered dimension between the shoe shaft and the roller assembly may result which in turn effects the bending operation. A second embodiment of the conduit bender400is illustrated inFIGS.23-26and29-33. The conduit bender400is similar to the conduit bender20except as described herein. Similar to the conduit bender20, the conduit bender400generally includes a frame402, a shoe404mounted on a shoe shaft444, a main roller assembly406, an auxiliary roller assembly408and a roller positioning assembly410. The frame402includes a frame base418. The shoe404, the main roller assembly406, the auxiliary roller assembly408, and the roller positioning assembly410are cantilevered on the frame402. The conduit bender400utilizes electronic circuit identical to the electronic circuit699associated with the conduit bender20. The auxiliary roller assembly408of the conduit bender400varies from the auxiliary roller assembly30of the conduit bender20. As best shown inFIG.26, the auxiliary roller assembly408of the conduit bender400includes a first plate407, a second plate409, a first support roller411, a second support roller413, and a handle451. A pair of upper support shaft apertures445is provided proximate the center of the first and second plates407,409. A first pair of lower support shaft apertures447aand a second pair of lower support shaft apertures447bare spaced from opposite ends of the first and second plates407,409. The upper support shaft446extends through the pair of upper support shaft apertures445. The auxiliary roller assembly408is positioned so as to position the lower support shaft448through either the first or second pair of lower support shaft apertures447a,447b. As shown inFIG.26, the lower support shaft448is positioned within the first pair of lower support shaft apertures447aand the second support roller413is positioned proximate the shoe404to provide a resistive force for the bending operation. The handle451is positioned between the first plate407and the second plate409and provides a location for the user to grip the conduit bender400when transporting the conduit bender400between locations. A retaining pin449is provided at the outer end of the upper support shaft446to secure the auxiliary roller assembly408to the frame402. Upon removal of the retaining pin449, the roller assembly408can be dismounted from the frame402by sliding the assembly408off the free ends of the upper and lower support shafts446,448. Once removed from the upper and lower support shafts446,448, the roller assembly408is inverted, and the handle451is placed between the first and second plates407,409proximate the second pair of lower support shaft apertures447bto remount the assembly408, the upper support shaft446is again positioned within pair of upper support shaft apertures445and the lower support shaft448in positioned within the second pair of lower support shaft apertures447b. When the lower support shaft448extends through the second pair of lower support shaft apertures447b, the first support roller411is positioned proximate the shoe404to provide a restive force for the bending operation. When the support roller411is positioned proximate the shoe404, the angle at which the conduit is positioned for bending is different than the angle at which the conduit is positioned for bending when the support roller413is positioned proximate the shoe404. Preferably, a difference of three degrees is provided between the angles provided by the rollers411and413. The different angles provide proper positioning of different types of conduit. For example, one of the support rollers411,413is placed proximate the shoe404for bending rigid type conduit and the other roller411,413is placed proximate the shoe404for bending IMC type conduit. As discussed above with respect to the conduit bender20, the feedback portion695of the circuit699is utilized to monitor power consumption of the motor26. By monitoring the power consumption of the motor26, the PWM signal711can be adjusted accordingly to provide the appropriate bend to the one-inch conduit, regardless of the type of conduit inserted in the bender. The conduit bender400is mounted to a base412. The base412includes a pair of lead wheels414and a pair of rear wheels416which allow the conduit bender400to be transported easily between locations. The conduit bender400includes a pivoting assembly420. As best illustrated inFIGS.23-25, the pivoting assembly420is generally provided by a shaft receptacle422, a detent bracket428, a locking pin452, a release handle430, and a detent adjustment stop432each of which are mounted to the base412and a pivot shaft424and an index plate426each of which are mounted to the conduit bender400. The pivot shaft424is cylindrically-shaped and is fixed to the frame402. The pivot shaft424defines pivot axis443. Preferably the pivot shaft424includes a first end positioned between first and second plates54,56of the frame base418, and an opposite free end424b. As best shown inFIG.24, the index plate426extends perpendicular to the pivot shaft424and is fixedly attached to the pivot shaft424. The index plate426is generally planar and semi-circularly shaped. As best shown inFIG.26, the index plate426includes first and second locking apertures434,436spaced from an outer edge of the index plate426. An angle of approximately 120 degrees extends between the first and second locking holes434,436. The shaft receptacle422is secured to the base412. The shaft receptacle422is generally tubular-shaped and includes an upper end (not shown) and lower end422b. As illustrated inFIG.25, the shaft receptacle422, defines a pivot axis aligned with the pivot axis443of the pivot shaft424. The pivot axis443intersects with a plane425which is perpendicular to the axis447defined by the shoe shaft444when the conduit bender400is in a horizontal bending position. As illustrated inFIG.23, the pivot axis443also intersects with a plane425perpendicular to the shoe shaft axis447, when the conduit bender400is in a vertical bending position. As shown inFIG.25, the pivot axis443is provided at an angle of approximately 45 degrees angle relative to the perpendicular plane425. The detent bracket428is rotatably mounted at an upper end of the shaft receptacle422. The detent bracket428includes a recess440which receives the detent adjustment stop432. The generally rectangularly-shaped detent adjustment stop432extends perpendicularly from the outer surface of the shaft receptacle422and is permanently affixed thereto. Interaction between the recess440and the detent adjustment stop432limits rotation of the detent bracket428relative to the shaft receptacle422. This limited rotation allows for fine tune adjustment of the position of the detent bracket428, and thus the position of locking pin452relative to the shaft receptacle422to ensure proper alignment between the conduit bender400and the base412despite manufacturing tolerances. Set screws438, one of which is shown, fix the position of the detent bracket428relative to the shaft receptacle422. A locking pin sleeve442extends from the detent bracket428. The locking pin452is positioned within the locking pin sleeve442and the release handle430is fixed to an upper end of the locking pin452. The locking pin452is slidably mounted within the locking pin sleeve442. A spring (not shown) is provided to bias the locking pin452towards the index plate426. When the locking pin452is aligned with a locking aperture434,436of the index plate426, the locking pin452extends through the aligned locking aperture434,436of the index plate426to lock the position of the conduit bender400relative to the base412. To pivot the conduit bender400from the vertical position as shown inFIG.23to horizontal position shown inFIG.25, the user begins by pulling on the handle430to disengage the locking pin452from the second locking aperture436. With the pin452disengaged, the pivot shaft424of the conduit bender400(along with the conduit bender400) is free to rotate within the shaft receptacle422. The conduit bender400is rotated approximately 120 degrees until the shoe axis447is vertically positioned as shown inFIG.25and the locking pin452is aligned with the first locking aperture434. When the locking pin452is aligned with the first locking aperture434, the user releases the handle430and the locking pin452slides within the sleeve442under the action of the spring until the locking pin452extends through the first locking aperture434of the index plate426to fix the position of the conduit bender400relative to the base412. FIGS.27a-27cprovide a simplified illustration of the conduit bender400, the base412and the pivot shaft424to illustrate the pivoting motion of the conduit bender400relative to the base412. As shown inFIG.27athe conduit bender400is positioned above a base412. The conduit bender400includes a shoe404mounted on a shoe shaft defined by axis447proximate a frame face423. The pivot shaft424defines a pivot axis443. Frame back421is provided opposite the frame face423. Frame bottom427extends between frame face423and frame back421. A frame top429is provided opposite the frame bottom427. A rear frame side431is provided which is perpendicular to the frame face423and the frame back421. A frame side433is provided opposite the frame side431. The base412includes an outer surface462, and inner surface464opposite to the outer surface462, a rear surface466perpendicular to the outer and inner surfaces462,464, and an upper surface468perpendicular to the outer, inner and rear surfaces462,464,466. A centrally positioned pivot axis477is illustrated inFIG.27shown in phantom lines. This centrally positioned pivot axis477illustrates the typical location of a pivot axis for a conduit bender having two shoes wherein the center of gravity of the conduit bender is provided at a position proximate the center of the frame402. The centrally positioned pivot axis477generally extends parallel to a plane perpendicular to the shoe shaft444(i.e. a plane parallel to the frame face423). The centrally positioned pivot axis477also generally extends parallel to the frame bottom427. The conduit bender400, however, provides a single shoe404mounted to the frame402. The center of gravity of the conduit bender400, therefore is not located at or near the center of the frame402. An angled pivot shaft424provides a pivotal connection between the frame402and the base412and defines a pivot axis443. More specifically, the pivot axis443extends generally at an angle of 45 degrees from the frame back421to the frame face423, at an angle of 45 degrees from the frame bottom427; and at an angle of 45 degrees from side431to side433. The pivot axis443extends at an angle of 45 degrees relative to the surface468of the base412. As the conduit bender400is rotated, the conduit bender400moves through the intermediate position illustrated inFIG.27bto the position illustrated inFIG.27c. Upon completion of the pivot, as shown inFIG.27c, frame face423along with the shoe404of the conduit bender400will be facing upward, the side431of the conduit bender400will be aligned with the inner surface464of the base412, and the frame back421of the conduit bender400will be proximate the upper surface468of the base412. Rotation of the conduit bender400as illustrated inFIGS.27a-27cresults in the conduit bender400being rotated about the pivot axis443one hundred twenty degrees. Rotation of the conduit bender400on the angled pivot axis443allows the pivot load bearing area to be located where it will not interfere with the conduit bending process and at the same time the pivot axis443is positioned close to the center of gravity of the conduit bender400. Therefore, the effort needed to pivot the conduit bender400between the horizontal and vertical positions is reduced. Similar toFIGS.27a-27c,FIGS.28a-28cillustrate a simplified version of the conduit bender400and the base412. InFIGS.28a-28c, the pivot shaft424′ is positioned at an alternate location and an alternative pivoting motion of the conduit bender400relative to the base412is illustrated. The angled pivot shaft424′ extends from the frame back421of the conduit bender400and at an angle of approximately 45 degrees relative to the frame back421. The angled pivot shaft424′ extends from an edge at the intersection of the frame back421and the frame bottom427. The pivot shaft424′ defines a pivot axis443′. As the conduit bender400is rotated, the conduit bender400moves through the intermediate position illustrated inFIG.28bto the position illustrated inFIG.28c. Upon completion of the pivot, as shown inFIG.28c, the frame face423of the conduit bender400with the shoe404attached thereto will be facing upward; the frame side433of the bender will be aligned with the rear surface466of the base412, and the frame bottom427of the bender will be aligned with the inner surface464of the base412. Rotation of the conduit bender400about the axis443′ as illustrated inFIGS.28a-28cresults in rotation of the conduit bender400approximately one hundred eighty degrees about the axis443′. Rotation of the bender on the angled axis443′ allows the pivot load bearing area to be located where it will not interfere with the conduit bending process and at the same time the pivot axis443′ is positioned close to the center of gravity of the conduit bender400. Therefore, the effort needed to pivot the conduit bender400between the horizontal and vertical positions is reduced. As best illustrated inFIGS.29-31, the conduit bender400is mounted to a base412including a pair of smaller swiveling lead wheels414and a pair of larger rear wheels416mounted on a common axle417. The wheels414,416allow for easy mobility of the conduit bender400to desired locations for the bending operation. A brake assembly500is provided to prevent inadvertent rolling of the conduit bender400and the base412. The brake assembly500includes first and second receptacles502, a brake bar503, a bracket506and an actuation lever508. As best shown inFIGS.29-31, the first and second receptacles502extend rearwardly from the base412. The receptacles502are generally cylindrically-shaped and include closed forward ends502aand open rearward ends502b. Preferably, a spring504is provided in each receptacle502proximate the forward end502a. The brake bar503includes a central portion503aand first and second wheel engaging portions503b. The brake bar503is positioned in approximately the same horizontal plane as the wheel axle510. The central portion503aof the brake bar503is spaced from the wheel axle510and is spaced from the base412. The wheel engaging portions503bare offset from the central portion503aand are positioned rearwardly of the wheels416. First and second cylindrically-shaped shafts512extend from lead surfaces505of the wheel engaging portions503b. The shafts512are aligned with the receptacles502such that the first shaft512is slidably engaged with the first receptacle502and second shaft512is slidably engaged with the second receptacle502. The springs504, the receptacles502and the shafts512provide a piston-like action to bias the brake bar503in a rearward direction leaving clearance between the circumferential surface of the wheels416and the lead surface505of the wheel engaging portions503bof the brake bar503. Although, the brake assembly500has been described with the receptacles502extending from the base412and shafts512extending from the brake bar503, it is to be understood a similar piston-like action can be achieved with the shafts512extending from the base412and the receptacles502extending from the brake bar503. The actuation lever508includes a generally V-shaped push plate514, a generally diamond shaped support plate516, and a cylindrically-shaped cam518. The push plate514provides a generally vertically positioned wall having a first pushing surface514aand a second pushing surface514b. The support plate516is positioned generally horizontally and extends from a lower end of the push plate514. An aperture is provided through the support plate516. The cylindrically-shaped cam518extends downwardly from the support plate516. The cam518includes an upper end and a lower end. A passageway520is provided through the cam518and extends from the upper end to the lower end. The cam518is aligned with the support plate516such that the aperture through the support plate516is aligned with the aperture through the cam518. The push plate514, support plate516and cam518are rigidly connected. As best illustrated inFIG.29, the bracket506is generally U-shaped and includes a base portion506a, an upper arm506band a lower arm506c. The base portion506ais secured to the base412such that the upper and lower arms506b,506cextend rearwardly. Bolt apertures are provided at the free ends of the upper and lower arms506b,506c. The central portion503aof the brake bar503is positioned between the upper and lower arms506b,506cand proximate the base portion506aof the bracket506. The actuation lever508is positioned between the upper and lower arms506b,506cof the bracket506such that the support plate516is positioned under the upper free arm506band the lower end of the cam518rests on the lower arm506cof the bracket506. A bolt524extends through the bolt aperture of the upper arm506b, through the aperture of the support plate516, through the cam passageway520, and through the bolt aperture of the lower arm506cof the bracket506. The bolt524provides an axis about which the actuation lever508rotates. A hex nut522is attached to a lower end of the bolt524to secure the actuation lever508to the base412while allowing the actuation lever508to rotate about the bolt524. As best shown inFIG.30, the bolt524is not centrally positioned within the support plate passage and the cam passageway520but rather is offset to provide an eccentric cam. A released state of the brake assembly500is illustrated inFIG.31. In this released state, the brake bar503is pushed rearward due to the action of the springs504, thereby providing clearance between the wheel engaging portions503bof the brake bar503and the circumferential surface of the wheels416. To actuate the brake assembly500, the user places a foot on the second pushing surface514bof the push plate514and rotates the actuation lever508about the bolt524to the position shown inFIG.30. As the user rotates the actuation lever508, the outer surface of the cylindrically shaped cam518pushes on the brake bar503to move the brake bar503forward. As the brake bar503is moved forward, the shafts512slide within the receptacles502to compress the springs504and the cam518rotates about the bolt524. Upon rotating the push plate514beyond a central location as shown inFIG.31, the cam518will be engaged with the brake bar503and the brake bar503will be engaged with the wheels416, such that the wheels416will be prevented from rotating. The brake bar503will be held in this locked position until the brake assembly500is released. Optionally, a wear pad526may be provided between the cam518and the brake bar503to prevent excessive wear on the cam518. To release the brake assembly500, the operator places a foot on the first pushing surface514aand rotates the actuation lever508about the bolt524to the position shown inFIG.31. As the actuation lever508is rotated the springs504will be allowed to expand, pushing the brake bar503rearward. As the brake bar503is pushed rearward, the wheel engaging portions503bof the brake bar503are no longer engaged with the circumferential surface of the wheels416, allowing the wheels416to once again rotate. The brake assembly500can therefore be actuated on both wheels416upon a single actuation by the operator. Furthermore, the brake assembly500does not extend beyond inner and outer sides of the base412and therefore additional clearance is not required for the brake assembly500. As shown inFIG.23, the conduit bender400includes a plurality of lever assemblies498a,498b,498c. The lever assemblies598a,598b,598care mounted in a manner identical to the lever assemblies98a,98b,98cand perform the same function as the lever assemblies98a,98b,98c. The first lever assembly598aincludes a lever tube600aand a lever602afixed thereto as best shown inFIG.32, and a stop bar606a. The lever tube600ais cylindrically-shaped and defines an upper shaft passageway607a. The lever602aincludes a lower gripping portion608a, an intermediate elbow portion610a, and an upper arm portion612a. The lower gripping portion608aincludes first extension614aand second extension616awhich extends around a portion of the outer surface of the lever tube600a. The second extension616aterminates in an end surface. An aperture618ais provided proximate a leading end of the first extension614aand a stop bar aperture is provided proximate the rear end of the first extension614a. The elbow portion610aextends between the lower gripping portion608aand the upper arm portion612aand is generally S-shaped. The upper arm portion612aof the lever assembly498aextends upwardly from the elbow portion610aand includes a lower end622aand an upper end624a. A pair of rollers628ais provided at the upper end624aof the upper arm portion612a. A first lever spring604ahas an end attached to the first extension614athrough the aperture618a, is wrapped around the lever tube600a, and an opposite end attached to the lead mounting bar. The first lever spring604aprovides a rotational force to the lever tube600aand lever602ato urge the lever602ato an upright position. The first lever tube600ais positioned on an upper support shaft of the frame402and, as noted above, operates similar to the first lever102aof the conduit bender20of the first embodiment of the invention. As best shown inFIG.33, the second lever assembly598bincludes a lever tube600b(which is shorter than the lever tube600a) and a lever602bfixed to the lever tube600b. The second lever assembly598balso includes a lever spring (not shown) and a stop bar606b. The lever tube600bis cylindrically-shaped and defines an upper shaft passageway607b. The lever602bincludes a lower gripping portion608b, an intermediate elbow portion610b, and an upper arm portion612b. The lower gripping portion608bincludes first extension614band second extension616bwhich extends around a portion of the outer surface of the lever tube600b. The second extension616bterminates at an end surface (not shown). A spring aperture618bis provided proximate a leading end of the first extension614b. The elbow portion610bextends upwardly from the lower portion608bto the upper arm portion612band is generally planar. A stop bar aperture (not shown) is provided proximate the lower end of the elbow portion610b. The upper arm portion612bof the lever assembly598bextends upwardly from the elbow portion610band includes a lower end622band an upper end624b. A pair of rollers628bis provided at the upper end624bof the upper arm portion612b. The second lever tube600bis positioned on the upper support shaft of the frame402and as noted above second lever assembly598boperates in a manner similar to the second lever assembly98bof the first embodiment. The third lever assembly598cincludes a lever tube600cand a lever602cattached thereto. The structure of the third lever602cis identical to the structure of the second lever602band therefore, the specifics are not repeated herein. Elements of the lever tube600cand lever602care designated inFIG.33with the suffix “c”. The third lever tube600cis positioned on the upper support shaft of the frame402and as noted above the third lever assembly598coperates in a manner similar to the third lever assembly98cof the first embodiment. As the conduit is aligned with the appropriately sized conduit passageway of the conduit bender400, the sidewall of the conduit will engage the appropriate pair of rollers628a,628bor628cof the levers602a,602bor602c. If, for example, contact is provided between the conduit and pair of rollers628a, this contact will cause the lever602ato rotate about the upper support shaft. Rotation of the lever602a,602b,602cwill result in a signal being provided to the microprocessor61in the same manner as described in connection with the bender of the first embodiment. As with the first embodiment of the invention, the frame base418of the conduit bender400is provided by a unitary member and therefore provides a fixed position of the shoe404relative to the roller positioning assembly410to provide more precise control over the bending operation. While preferred embodiments of the present invention are shown and described, it is envisioned that those skilled in the art may devise various modifications of the present invention without departing from the spirit and scope of the appended claims. | 93,178 |
11858029 | DETAILED DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention will be hereinafter described using the drawings.FIG.1(a)illustrates a processed product (hereinafter, to be referred to as “wire processed product”)100A of a round metallic wire100processed using a round metallic wire processing apparatus1(refer toFIG.3) according to one embodiment of the present invention. The wire processed product100A is used as, for example, a power line of a motor or the like as indicated in Japanese Patent Application Laid-open No. 2014-128095 and Japanese Patent Application Laid-open No. 2017-55486, and formed in a three-dimensional shape to include connecting portions101,101to be connected to terminals or the like at both end portions, a plurality of bent portions102,102, and straight portions103,103between them. Then, in any portion of the wire processed product100A, in this embodiment, in a range of the straight portion103in the vicinity of the middle of the entire length, a cross-section non-circular portion105having a non-circular cross-sectional shape in a diameter direction (a direction orthogonal to a longitudinal direction (axial center direction) of the round metallic wire100) of the round metallic wire100is formed. A shape of the cross-section non-circular portion105is formed in a rectangle having four flat surfaces105ato105don an outer peripheral surface as illustrated inFIG.1(b)in this embodiment. Note that this shape of the cross-section non-circular portion105will be further described later. The wire processed product100A is set in a metal mold, and a resin member200is integrated by insert molding (refer toFIG.2(a)). At this time, as illustrated inFIG.2(b), the resin member200is integrated closely around the cross-section non-circular portion105. The cross-section non-circular portion105has the four flat surfaces105ato105d, which eliminates the occurrence of relative rotation between them and the resin member200closely covering their peripheries. As a result, the wire processed product100A of the round metallic wire100gets rid of being rotated and displaced in an axial direction at the time of fastening with the terminal of the motor or the like or by action of external vibrations, or the like. Note that as indicated in Japanese Patent Application Laid-open No. 2014-128095 and Japanese Patent Application Laid-open No. 2017-55486, for example, in a case of being used for a three-phase motor or the like, it is naturally possible to have a structure in which the three wire processed products100A of the round metallic wires100are subjected to insert molding together and covered with the common resin member200to thereby prevent a mutual displacement. Next, a processing method and a processing apparatus for the round metallic wire100used as described above will be described.FIG.3schematically illustrates a schematic configuration of the round metallic wire processing apparatus1, andFIG.4andFIG.5each schematically illustrate each of processing machines for each processing step. As illustrated in these figures, the round metallic wire processing apparatus1of this embodiment includes a straightening machine10, a cross-section non-circular portion forming machine20, a bending machine30, and a cutting machine40. The straightening machine10includes, for example, a plurality of straightening rollers11disposed to be opposed, as illustrated inFIG.4andFIG.5. The round metallic wire100targeted for processing is formed of a cross-section circular solid wire having a surface covered with enamel and made of metal such as copper, and provided as a coiled material wound in a coil shape. The straightening machine10is provided to correct its winding tendency caused by being wound in a coil shape. Here, in the wire processed product100A illustrated inFIG.1, end portions serve as the connecting portions101,101, and a film of enamel is removed from these connecting portions101,101. The enamel film is removed after the straightening by, for example, shaving the surface, using chemicals, or the like. A cross-section non-circular portion forming machine20forms a predetermined portion of the round metallic wire100processed linearly by the straightening machine10in a non-circular shape in the cross-sectional shape in the diameter direction of the round metallic wire100. A concrete structure of the cross-section non-circular portion forming machine20is not limited, but for example, is constituted of a pressing machine having pressing portions21which sandwiches the round metallic wire100on both sides along the diameter direction as illustrated inFIG.4andFIG.5. A facing surface21afacing the round metallic wire100on the pressing portion21has a shape roughly fitted to an abutting surface31aof a wire holding portion31of the bending machine30which separates from and approaches the round metallic wire100(refer toFIG.6(a), (b)). Concretely, for example, the wire holding portion31has at least the two abutting surfaces31aon the round metallic wire100, and at least one surface of them is formed of a flat surface, and hence at least one of the pressing surfaces21aof the pressing portions21is also formed in a flat surface. In this embodiment, both the facing surfaces21a,21aof the pressing portions21,21on both 180-degree opposed sides of the cross-section non-circular portion forming machine20are formed as the flat surfaces. Accordingly, when these pressing portions21,21approach each other, one pair of the opposing flat surfaces105a,105cserving as the cross-section non-circular portion105are formed, and next, by turning the round metallic wire100by 90 degrees centered at an axial center and making the pressing portions21,21approach each other again, the other pair of the opposing flat surfaces105b,105dare formed, and the cross-section non-circular portion105having a substantially rectangular cross section in the diameter direction is formed. However, the cross-sectional shape of the cross-section non-circular portion105is applicable unless circular, and for example, the flat surface may be formed only on one surface, or the flat surfaces may be formed only on two opposing surfaces. They may be formed on three or five surfaces or more. However, the closer the cross-sectional shape is to a circle, the more likely relative rotation between the cross-section non-circular portion105and the wire holding portion31of the bending machine230and the relative rotation, when the resin member200illustrated inFIG.2is molded integrally, between the two are to occur, and hence the flat surfaces are preferably set to eight surfaces or less. In addition to this, a modified cross section partially having any depression or projection such as a cross-section square or triangle is also applicable. In any case, these surfaces may each be in a shape having at least one flat surface capable of surface contact with the abutting surface31aof the wire holding portion31of the bending machine30. Having at least one flat surface causes the abutting surface31aof the wire holding portion31of the bending machine30to come into surface contact therewith, and thereby the round metallic wire100can be prevented from rotating centered at the axial center at the time of bending. As the bending machine30, for example, the one provided with the wire holding portion (chuck)31at a tip of a three-dimensionally movable robot arm32as illustrated inFIG.6(a), the one having the wire holding portion31provided with a pair of opposing plates capable of separating from and approaching each other (corresponding to a portion in which work in a press die is held) as illustrated inFIG.6(b), or the like can be used. In each of these wire holding portions31, at least one surface (the two opposing surfaces in this embodiment) on which the round metallic wire100is held is set as the flat surface. Accordingly, as long as the round metallic wire100on which the flat surfaces105ato105dare formed by the cross-section non-circular portion forming machine20is set in each of these wire holding portions31, the round metallic wire100does not rotate centered at the axial center despite having a cross-section circular shape in portions expect the cross-section non-circular portion105. InFIG.6(a), the bending machine30has the wire holding portion (chuck)31and a working portion (not illustrated) which comes into contact with the round metallic wire100, and either or both of these move three-dimensionally, and thereby the round metallic wire100is bent at a predetermined angle in a predetermined direction, or the like, and the round metallic wire100is processed in a predetermined three-dimensional shape to design specifications. InFIG.6(b), for example, the round metallic wire100is held between a pair of the abutting surfaces31a,31aof the wire holding portion31formed of the two plates, and a portion protruding from the wire holding portion31is approached from any direction by and brought into contact with a processing tool33(refer to “bending step” inFIG.4andFIG.5) to be thereby processed in a predetermined shape. Then, by varying the directions of the round metallic wire100or using the one capable of approaching it from different directions as the processing tool, the three-dimensional shape is imparted. Note that a concrete structure of the bending machine30is not limited at all as long as the round metallic wire100can be subjected to bending. The cutting machine40cuts the round metallic wire100in a predetermined length in accordance with the design specifications. As long as the round metallic wire100can be cut, its structure is not limited at all. In this embodiment, a cutting machine control unit50which automatically operates the cutting machine40is included (refer toFIG.3). The cutting machine control unit50controls the cutting machine40so as to perform cutting operation in the predetermined length in accordance with the beforehand set design specifications. The cutting machine control unit50only needs to control a cutting length, and in this embodiment, moreover, timing of operating the cutting machine40can also be automatically controlled. Specifically, the round metallic wire100is straightened by the above-described straightening machine10, and thereafter at either timing before being transferred to the cross-section non-circular portion forming machine20(the state inFIG.4) or timing before being transferred to the bending machine30after the formation of the cross-section non-circular portion105(the state inFIG.5), the cutting machine40is operated to cut the round metallic wire100in the predetermined length. The timing of cutting by using the cutting machine40can be optionally set depending on the kind of the three-dimensional shape to be imparted to the round metallic wire100, the required dimensional accuracy, and the like. As illustrated inFIG.4, cutting after the straightening makes, even when the cross-section non-circular portion105is formed in any position of end portions and a middle portion, its positioning easy, and also makes handling of the bending thereafter easy. Further, cutting after the bending sometimes also causes deformation due to a shock at the time of cutting, but the prior cutting eliminates such a possibility as described above. As illustrated inFIG.5, cutting before the bending after the formation of the cross-section non-circular portion105makes it easy to perform the bending, but makes the positioning of the formation position of the cross-section non-circular portion105more difficult than that in cutting prior thereto since the cross-section non-circular portion105is formed while keeping the round metallic wire100long. On one hand, by forming the cross-section non-circular portion105, a size in a long direction is sometimes somewhat affected by a deformation in the diameter direction. Further, the cutting after the bending sometimes causes the deformation as described above. Thus, when the dimensional accuracy is required more strictly, or the like, the round metallic wire100is also considered to be kept long until the formation of the cross-section non-circular portion105and cut before the bending. Next, one example of a method for processing the round metallic wire100will be described based onFIG.4andFIG.7. In the processing method of this embodiment, as described above, the material provided in a coil shape is transferred to the straightening machine10of the round metallic wire processing apparatus1to be linearly corrected (S1inFIG.7). Thereafter, in accordance with specifications of the wire processed product100A, an enamel cover is peeled for each predetermined distance so that the connecting ends101,101to the terminals or the like at attachment positions are formed. Next, for example, the linearly corrected round metallic wire100is cut in a predetermined length by the cutting machine40(S2inFIG.7). The advantage such that cutting at this time makes handling of later processing easy is as described above. Subsequently, the round metallic wire100cut in the predetermined length is transferred to the cross-section non-circular portion forming machine20to form the cross-section non-circular portion105(S3inFIG.7). The cross-section non-circular portion105is formed in at least one position. The cross-section non-circular portion105is provided to prevent movement in a rotation direction when held by the wire holding portion31in the bending machine30, and in varying the portion held by the wire holding portion31, using a plurality of the bending machines30, or the like, corresponding thereto, the cross-section non-circular portions105can be formed in a plurality of positions. Next, the cross-section non-circular portion105is held by the wire holding portion31of the bending machine30, and a three-dimensional shape in accordance with the design specifications is imparted (S4inFIG.7). At this time, when the plurality of bending machines30are used, it is possible to in the initial bending machine30, hold the cross-section non-circular portion105in a certain predetermined position in the wire holding portion31and perform the bending, and thereafter in the next bending machine30, hold the cross-section non-circular portion105formed in a different position therefrom in the wire holding portion31and perform the bending, for example. This completes the wire processed product100A. Note that the timing of the cutting step is thus not limited to before the formation of the cross-section non-circular portion after the correction, but as illustrated inFIG.5, is also applicable to after the formation of the cross-section non-circular portion as described above.FIG.8is a flowchart illustrating one example of processing steps in that case, and after the correction step (S5inFIG.8), the cross-section non-circular portion is formed (S6inFIG.8), cutting is thereafter performed (S7inFIG.8), and the bending step is performed (S8inFIG.8) to obtain the wire processed product100A. According to this embodiment, with respect to the round metallic wire100, the cross-section non-circular portion105is formed before the bending. Therefore, by holding the cross-section non-circular portion105in the wire holding portion31, the bending can be performed, which allows the prevention of the movement in the rotation direction centered at the axial center at the time of bending, or the like, resulting in enabling an increase of bending accuracy. Further, making a holding position of the wire holding portion31stable reduces variations in processing accuracy among products. Further, the round metallic wire100is transferred between the machines by feed rollers (not illustrated), and after the formation of the cross-section non-circular portion105, a slide with respect to the feed rollers is suppressed, which also enables suppression of a deterioration of the processing accuracy caused by variations in feed rate. Further, when dimensions of the processed wire processed product100A are measured using an optical microscope, a visible outline of the cross-section non-circular portion105, in particular, a surface processed in the flat surface is easy to observe. That is, in a circular cross section, it is difficult to focus on a tangent of the circular cross section when it is observed by the optical microscope, which sometimes affects dimensional measurement accuracy, but according to this embodiment, it becomes easy to focus on the visible outline of the flat surface or the like, which increases the dimensional measurement accuracy. Next, when to use the wire processed product100A of this embodiment as, for example, a power distribution component, it is integrated with the resin member200which functions as a rotation stopper for an attachment portion, or the like, the resin member200is integrated with the cross-section non-circular portion105by the insert molding (S10) to obtain a power distribution component300(refer toFIG.2), as illustrated inFIG.9. The obtained power distribution component300does not rotate mutually since the resin member200is integrated with the cross-section non-circular portion105. According to the present invention, the cross-section non-circular portion is not required to be formed by additional processing after completing the wire processed product as conventionally formed, and it is possible to prevent an influence on dimensional accuracy and a deformation accompanying the additional processing. According to the above, the wire processed product100A and the power distribution component300of the round metallic wire100obtained by the present invention are particularly suitable for uses requiring high dimensional accuracy, accuracy of form, and the like despite an inexpensive round wire as compared with a square wire. | 17,787 |
11858030 | DETAILED DESCRIPTION OF THE INVENTION It was surprisingly found that, with the addition of the CH-acidic compounds with the following structural element (group) —C(═O)—CH2—C(═O)— to an aqueous or alcohol-containing, preferably aqueous, sizing composition, the quality of the sized cores and molds can be permanently improved, and for example a storage stability of the cores and molds of several days can be easily achieved. All compounds are suitable that have at least one CH2group that is surrounded by carbonyl carbon atoms (C═O). The CH-acidic compounds used according to the invention are therefore β-dicarbonyl compounds (1,3-dicarbonyl compounds) having one or more of the following group(s): —C(═O)—CH2—C(═O)— Particularly preferably, the group has the following structure: R1C(═O)—CH2—C(═O)—O— (I) in whichR1is H,a C1 to C18 hydrocarbon, preferably a C1 to C12 hydrocarbon or —CH2—X, wherein X is a group which contains, along with hydrogen atoms, 1 to 18 carbon atoms, in particular 1 to 12 carbon atoms, and particularly preferably 1 to 8 carbon atoms, and 1 to 3 oxygen atoms; oxygen can be contained, for example, in the form of ether groups, or —O—Y, wherein Y=X (with the above meaning), or H. According to one embodiment, R1is not bound by an oxygen atom to the carbonyl carbon atom. Examples of R1are H, alkyl, alkenyl, aryl, alkylaryl or alkenylaryl groups. The β-dicarbonyl compounds have in particular the following structure: in whichR1has the above meaning, and in particular is a C1 to C18 hydrocarbon, preferably a C1 to C12 hydrocarbon, andR2is H,a C1 to C18 hydrocarbon, preferably a C1 to C12 hydrocarbon, wherein possibly 1 to 3 oxygen atoms can be contained in the hydrocarbon, in the form of ether groups, for example. Examples of R2are alkyl, alkenyl, aryl, alkoxy, alkenyloxy or aryloxy groups. It is likewise possible that the β-dicarbonyl compound is one which has multiple β-dicarbonyl groups (I), for example 2 to 4, in particular those according to the formula (II) which are linked via R2and thus have multiple CH-acidic groups in the molecule (see for example CAS 22208-25-9). CH acidity is the tendency of a compound to donate the hydrogen atom bonded to a carbon atom as a proton and therefore act formally as an acid. Unsubstituted alkanes have high pKa values (for example, approximately 50 for ethane). However, if the carbon atom is bonded to strongly electrophilic groups such as carbonyls (in an ester, ketone or aldehyde) at the α-position relative to these groups, then the particularly pronounced negative inductive effect ensures that the CH bond at the α carbon atom is more polarized and the proton can be cleaved off more easily. According to the present invention, the pKa value of the CH-acidic CH2group is preferably less than 15, in particular 5 to 12 (in each case at 298 K and with reference to the donation of the first proton, pKa1). β-keto esters are particularly preferred. The following β-keto esters are given as examples:methyl acetoacetate (acetoacetic acid methyl ester, 3-oxobutanoic acid methyl ester—CAS: 105-45-2), ethyl acetoacetate (acetoacetic acid ethyl ester, 3-oxobutanoic acid ethyl ester—CAS: 141-97-9), isopropyl acetoacetate (isopropyl 3-oxobutanoate—CAS: 542-08-5), isobutyl acetoacetate (CAS: 7779-75-1), t-butyl acetoacetate (CAS: 1694-31-1), benzyl acetoacetate (CAS: 5396-89-4), dodecyl acetoacetate (CAS: 52406-22-1), ethyl benzoylacetate (CAS: 94-02-0), 2-methoxyethyl acetoacetate (CAS: 22502-03-0), 2-(acetoacetoxy)ethyl methacrylate (CAS: 21282-97-3), methyl 4-methyl-3-oxopentanoate (CAS: 42558-54-3) and propane-1,1,1-triyltrimethyl tris(acetoacetate)/(2-ethyl-2-(hydroxymethyl)-1,3-propanedioltriacetoacetate (CAS: 22208-25-9). Malonic acid, malonic acid mono- and diesters of alcohols with a C-chain of C1 to C18, methyl acetoacetate, ethyl acetoacetate, benzyl acetoacetate, dodecyl acetoacetate, ethyl benzoylacetate, 2-methoxyethyl acetoacetate, 2-(acetoacetoxy)ethyl methacrylate and propane-1,1,1-triyltrimethyl tris(acetoacetate) are preferred. Methyl acetoacetate, ethyl acetoacetate and propane-1,1,1-triyltrimethyl tris(acetoacetate) are particularly preferred. Methyl acetoacetate and ethyl acetoacetate are most preferred. Mixtures of these are also possible. β-dicarbonyl compounds (II) containing nitrogen are also suitable. Examples in this case are:N-methyl acetoacetamide (CAS: 20306-75-6), N,N-dimethyl acetoacetamide (CAS: 2044-64-6) and N,N-diethyl acetoacetamide (CAS: 2235-46-3). The sizing composition has for, example, a pH of 6 to 10, preferably 6.5 to 8.5 (at 298 K). The overall amount of the CH-acidic compounds relative to the size in the marketable and/or usable state, i.e., independent of the dilution, is 0.1 to 10% by weight, preferably 0.5 to 8% by weight, particularly preferably 0.5 to 7% by weight, and most preferably 0.7-5% by weight or also 0.8-3% by weight. The CH-acidic compound can be contained in the finished, delivered sizing composition, or added during the optional dilution process for producing the ready-to-use sizing composition. The addition of the CH-acidic compound changes the other known size properties only slightly to not at all. Other characteristic parameters of the sizing composition can be adjusted depending on the desired use of the sizing composition, for example as a primer coat or as a topcoat, and the desired layer thickness of the coating produced from the sizing composition. The carrier liquid can consist partially or completely of water. The carrier liquid is the component that can evaporate at 160° C. and normal pressure (1013 mbar) and is therefore in the present case by definition that which is not the solid content. The carrier liquid contains more than 50% by weight, preferably 75% by weight, in particular more than 80% by weight, if applicable more than 95% by weight water. The other components of the carrier liquid can be organic solvents. Suitable solvents are alcohols including polyalcohols and polyether alcohols. Examples of alcohols are ethanol, n-propanol, isopropanol, n-butanol, glycols, glycol monoether and glycol monoester. The solid content of the ready-to-use sizing composition is preferably adjusted to be within a range of 10 to 70% by weight, or respectively in the marketable form (before dilution) in particular 30 to 80% by weight. The sizing composition comprises at least 20% by weight carrier liquid, preferably more than 40% by weight. Therefore the sizing composition according to the invention comprises at least one refractory base material that is powdered before being added to the sizing composition. The refractory base material serves to close the pores in a casting mold against the penetration of the liquid metal. Moreover, thermal insulation between the casting mold and liquid metal is achieved by the refractory base material. In particular, materials are suitable as refractory base materials that have a melting point which lies at least 200° C. above the temperature of the liquid metal to be cast (at least more than 900° C.) and, independent of this, does not engage in any reaction with the metal if at all possible. For example, pyrophyllite, mica, zirconium silicate, andalusite, fireclay, iron oxide, kyanite, bauxite, olivine, aluminum oxide, quartz, talcum, calcined kaolins (metakaolin) and/or graphite alone or as mixtures thereof can be used as the refractory base materials (for the size). For the clay, the D10 percent passing for the grain size can preferably be 0.01 μm to 5 μm, more preferably 0.01 μm to 1 μm, particularly preferably 0.01 μm to 0.2 μm. Preferably, the clay can have a D01 percent passing for the grain size of 0.001 μm to 0.2 μm, more preferably 0.001 μm to 0.1 μm, and particularly preferably 0.001 μm to 0.05 μm. For mica, the D90 percent passing can preferably be 100 μm to 300 μm, more preferably 150 μm to 250 μm, and particularly preferably 200 μm to 250 μm. Preferably, the D50 percent passing for mica can be 45 μm to 125 μm, more preferably 63 μm to 125 μm, and particularly preferably 75 μm to 125 μm. Preferably, the D10 percent passing can have a grain size of 1 μm to 63 μm, more preferably 5 μm to 45 μm, and particularly preferably 10 μm to 45 μm. Preferably, the D01 percent passing can be 0.1 μm to 10 μm, more preferably 0.5 μm to 10 μm, particularly preferably 1 μm to 5 μm. Moreover, the grain size of other refractory materials is not especially restricted; any routine grain sizes from 1 μm to 300 μm, particularly preferably 1 μm to 280 μm, can be used. The grain size distribution of the individual solid components of the sizing composition can be determined using the D90, D50, D10 and D01 percent passing. These are a measure of the particle size distribution. In this case, the D90, D50, D10, or respectively D01 percent passing designate the portions in 90%, 50%, 10%, or respectively 1% of the particles that are smaller than the designated diameter. Given a D10 value of for example 5 μm, 10% of the particles have a diameter less than 5 μm. The grain size and the D90, D50, D10 and D01 percent passing can be determined by means of laser diffraction granulometry according to ISO13320. The percent passing is indicated based on volume. With nonspherical particles, a hypothetical spherical grain size is calculated, and the corresponding diameter is used as the basis. The grain size is accordingly equivalent to the calculated diameter. The particle diameter and its distribution are determined by laser refraction in a water/isopropanol mixture, wherein the suspension is (only) maintained by stirring, using a Horiba LA-960 laser light scattering spectrometer by Retsch based on static laser light scattering (according to DIN/ISO 13320) while using the Fraunhofer model for evaluation. In so doing, the grain size is chosen so that a stable structure arises in the coating and the sizing composition can for example be distributed easily on the wall of the casting mold with a spray device. The portion of the refractory base material relative to the solid portion of the sizing composition is preferably selected to be greater than 65% by weight, preferably greater than 70% by weight, and particularly preferably greater than 80% by weight. The sizing composition according to the invention can comprise at least one suspension agent according to one embodiment. The suspension agent causes an elevation in the viscosity of the size so that the solid components of the sizing composition do not sink in the suspension, or only sink to a slight extent. To elevate the viscosity, both organic as well as inorganic materials or mixtures of these materials can be used. Swellable layer silicates that are capable of incorporating water between the layers can be contained as the suspension agent; preferably, the swellable layer silicate consisting of attapulgite (palygorskite), serpentines, kaolins, smectites (such as saponite, montmorillonite, beidellite and nontronite), vermiculite, illite, spiolite, synthetic lithium magnesium layer silicate, LAPONITE® RD and mixtures thereof can be selected; attapulgite (palygorskite), serpentines, smectites (such as saponite, beidellite and nontronite), vermiculite, illite, spiolite, synthetic lithium magnesium layer silicate, LAPONITE® RD and mixtures thereof are particularly preferable; the swellable layer silicate can particularly preferably be attapulgite. Alternatively or in addition, organic thickeners can also be selected as the suspension agent since they can dry sufficiently after the protective coating has been applied for them to scarcely release any water upon contacting the liquid metal. Swellable polymers such as carboxymethyl, methyl, ethyl, hydroxyethyl and hydroxypropyl cellulose, mucilages, polyvinyl alcohols, polyvinyl pyrrolidone, pectin, gelatins, agar agar, polypeptides and/or alginates are for example possible as the organic suspension agent. The portion of inorganic suspension agents relative to the overall sizing composition is preferably selected to be 0.1 to 5% by weight, preferably 0.5 to 3% by weight, and particularly preferably 1 to 2% by weight. The portion of organic suspension agent relative to the overall sizing composition is preferably selected to be 0.01 to 1% by weight, preferably 0.01 to 0.5% by weight, and particularly preferably 0.01 to 0.1% by weight. The sizing composition can, for example, comprise the combination of certain clays as contents of the sizes, which also function as the suspension agent. Particularly suitable as the clay materials, a combination of the following is used:a) 1 to 4 parts by weight, in particular 1 to 2.2 parts by weight palygorskite,b) 1 to 4 parts by weight, in particular 1 to 2.2 parts by weight hectorite, andc) 1 to 4 parts by weight, in particular 1 to 2.2 parts by weight sodium bentonite(each relative to each other), in particular at a weight ratio of palygorskite to hectorite of 1 to 0.8-1.2, and a ratio of palygorskite to hectorite together to sodium bentonite of 1 to 0.8-1.2. The overall content of the above clays in the sizing composition is 0.1 to 4.0% by weight, preferably 0.5 to 3.0% by weight, and particularly preferably 1.0 to 2.0% by weight relative to the solid content of the sizing composition. According to a preferred embodiment, a sizing composition is used comprising a solid component that comprises a clay and mica, wherein the clay comprises 50 to 90% by weight kaolinite and 5 to 35% by weight montmorillonite, wherein the sizing composition comprises 5 to 50 parts by weight clay relative to the solid component. According to a preferred embodiment, the sizing composition according to the invention comprises at least one binder as an additional component. The binder allows the sizing composition, or respectively the protective film produced from the sizing composition, to adhere better to the wall of the casting mold. Moreover, the binder increases the mechanical stability of the size coating so that less erosion from the effect of the liquid metal is observed. Preferably, the binder cures irreversibly so that an abrasion-resistant coating is obtained. Particularly preferred are binders that do not resoften upon contact with humidity. Clays, in particular bentonite and/or kaolin, can for example be used as binders. Other suitable binders are for example starches, dextrin, peptides, polyvinyl alcohol, polyvinyl acetate copolymers, polyacrylic acid, polystyrene, polyvinyl acetate polyacrylate dispersions, and mixtures thereof. The portion of the binder is preferably selected to be within a range of 0.1 to 20% by weight, particularly preferably 0.5 to 5% by weight, and most preferably 0.2 to 2% by weight relative to the solid content of the sizing composition. According to another preferred embodiment, the sizing composition contains a portion of graphite. This supports the formation of lamellar carbon at the boundary surface between the cast piece and casting mold. The portion of the graphite is preferably selected to be within a range of 0 to 30% by weight, preferably 1 to 25% by weight, and particularly preferably 1 to 20% by weight relative to the solid content of the sizing composition. In casting iron, graphite has a favorable effect on the surface quality of the cast piece. Anionic and non-anionic surfactants, particularly those with an HLB value of at least 7, can be used as a wetting agent. One example of such a wetting agent is dioctyl disodium sulfosuccinate. The wetting agent is preferably used in an amount of 0.01 to 1% by weight, preferably 0.05 to 0.3% by weight, relative to the ready-to-use sizing composition. Defoaming agents, or also termed anti-foaming agents, can be used to prevent foam formation in the production of the sizing composition or when applying the same. Foam formation during the application of the sizing composition can lead to an uneven layer thickness and to holes in the coating. Silicone oil or mineral oil can for example be used as the defoaming agent. Preferably, the defoaming agent is contained in an amount of 0.01 to 1% by weight, preferably 0.05 to 0.3% by weight, relative to the ready-to-use sizing composition. In the sizing composition according to the invention, routine pigments and dyes may be used if applicable. These are added in order to achieve a different contrast, for example between different layers, or respectively to bring about a stronger separating effect of the sizes from the casting. Examples of pigments are red and yellow iron oxide as well as graphite. Examples of dyes are commercially available dyes such as the Luconyl® color series by BASF SE. The dyes and pigments are preferably contained in an amount of 0.01 to 10% by weight, preferably 0.1 to 5% by weight, relative to the solid content of the sizing composition. According to another embodiment, the sizing composition contains a biocide to prevent bacterial infestation and thus to prevent a negative influence on the rheology and binding force of the binder. This is particularly preferred when the carrier liquid contained in the sizing composition is essentially made of water relative to the weight, i.e., the sizing composition according to the invention is provided in the form of a so-called water size. Examples of suitable biocides are formaldehyde, formaldehyde separators, 2-methyl-4-isothiazolin-3-one (MIT), 5-chloro-2-methyl-4-isothiazolin-3-one (CIT), 1,2-benzisothiazolin-3-one (BIT), and biocidally active substances containing bromine and nitrile groups. The biocides are normally used in an amount of 10 to 1000 ppm, preferably 50 to 500 ppm relative to the weight of the ready-to-use sizing composition. The sizing composition according to the invention can be produced by taking water and, by using a high-shearing agitator, solubilizing a clay therein acting as a suspension agent. Then the refractory base material, pigments (if present) and dyes (if present) are stirred in until a homogeneous mixture arises. Finally, wetting agents (if present), anti-foaming agents (if present), biocides (if present), binders (if present) and the CH-acidic compound(s) are stirred in. The sizing composition according to the invention can be produced and marketed as a sizing composition that is formulated to be ready-to-use. The sizing composition according to the invention can however also be produced and marketed in a concentrated form. In this case, to provide a ready-to-use sizing composition, the amount of the (additional) carrier liquid that is needed to adjust the desired viscosity and density of the sizing composition is added. Moreover, the sizing composition according to the invention can also be provided and marketed in the form of a kit, wherein for example the solid components, the CH-acidic compound(s) and the solvent component are adjacent in separate containers or the CH-acidic compound(s) is part of the solvent component. The solid components can be provided as a powdered solid mixture in a separate container. Other liquid components that may be used such as for example binders, wetting agents, humectant/defoaming agents, pigments, dyes and biocides can also be present in this kit in a separate container. The solvent component can either comprise the additional components that may be used, for example in a common container, or they can be present in a separate container apart from other optional components. It is also possible to apply several layers of size, namely either the same size in several layers in order to produce the desired layer thickness, or different sizes, wherein the size with the CH-acidic compounds preferably forms the last coating. The dry layer thickness of the topcoat is for example 0.01 mm to 1 mm, preferably 0.05 mm to 0.8 mm, more preferably 0.1 mm to 0.6 mm, and most preferably 0.2 mm to 0.3 mm. The dry layer thickness of the coating is determined either by measuring the dimensions of bending bars before and after sizing (dry) with a micrometer screw (preferably), or by measuring using the wet layer thickness gauge. The layer thickness can for example be determined with the gauge by scratching away the coating using the end marks of the gauge until the subsurface appears. The layer thickness can then be read from the markings on the teeth. Instead, the wet layer thickness can also be measured in a matte state according to DIN EN ISO 2808. The sizing compositions according to the invention are suitable for coating casting molds. The expression “casting mold” used here includes all types of bodies that are needed to produce a cast piece such as cores, molds and permanent molds. The use according to the invention of the sizing compositions also includes partially coating casting molds. The mold material mixtures for producing the casting molds comprise at least:a refractory mold base material,a binder, or respectively binder system, andif applicable one or more mold material additives. The refractory mold base materials are a suitable refractory mold base material or a mixture of multiple materials of this type, predominantly comprising quartz sand, wherein the quartz sand can be present as new sand or regenerated old sand or any mixture of the two. With the lost foam or full mold method, foamed polystyrene, or respectively copolymers consisting of polystyrene and methacrylate models, are coated with a refractory size which is then dried in a furnace or microwaves. In this case, the size also serves to build up a separation layer between the metal that has been poured in and the sand as background stabilization. CH-acidic compounds can also be added to these layers in order to reduce the formaldehyde emissions during casting. Conventional, known materials and their mixtures can be used as a refractory mold c for the production of casting molds. Suitable examples are quartz sand, zircon sand or chrome ore sand, olivine, vermiculite, bauxite, fireclay and so-called artificial mold base materials, i.e., mold base materials that were shaped spherically, or approximately spherically (such as ellipsoidal) by industrial processes of forming. Examples of this are glass beads, glass granulate or artificial, spherical, ceramic sands—so-called Cerabeads® as well as Spherichrome®, SphereOX® or “Car-boaccucast” and hollow microspheres, such as hollow aluminum silicate spheres (so-called microspheres) which can be isolated as a component of fly ash among other things. Mixtures of the mold base materials mentioned are also possible. Materials that have a high melting point (melting temperature) are considered to be a mold material, or respectively refractory mold base material. Preferably, the melting point of the refractory mold base material is greater than 600° C., preferably greater than 900° C., particularly preferably greater than 1200° C., and especially preferably greater than 1500° C. The refractory mold base material preferably comprises more than 70% by weight, in particular more than 80% by weight, particularly preferably more than 85% by weight, of the mold material mixture. The average diameter of the refractory mold base materials generally lies between 80 μm and 600 μm, preferably between 100 μm and 550 μm and particularly preferably between 130 μm and 500 μm. The particle size can be determined for example by passing through a sieve in accordance with DIN ISO 3310. There is a particular preference for particle shapes with the greatest linear extension to the smallest linear extension (at a right angle with respect to one another and in each case for all directions in space) having a ratio of 1:1 to 1:5 or 1:1 to 1:3, i.e. those which are, for example, not fibrous. The refractory mold base material is preferably in a free-flowing state, in particular in order to be able to process the mold material mixture according to the invention in conventional core shooters. Various inorganic and organic binder systems can be used as binding agents. The following methods and their associated binders can be cited as examples: PU cold-box methodTwo-component binder comprising a polyol (ben-zyl ether resin) and a polyisocyanate component,curing: gaseous tertiary aminePU no-bake processTwo-component binder comprising a polyol (ben-zyl ether resin) and a polyisocyanate component,curing: liquid amineResol CO2methodHighly alkaline phenol resols containing a boroncompound, curing CO2Resol ester methodHighly alkaline resolsALPHASET ™ method: Curing: liquid esterBETASET ™ curing: gaseous methyl formiateHot-box methodResols, furan resins, urea resins or mixed resins,curing: latent acids plus the effect of heatWarm-box methodFuran resins, curing: latent acid plus the effect ofheatInorganic methodBinder based on silicate, curing: by the effect ofheat or CO2Shell sand methodNovolac, curing: Hexamethylene triamine andcuring: latent acids plus the effect of heatNo-bake methodResols, furan resins or mixed resins, acid curingEpoxy SO2methodMixture of epoxy resins and acrylates, SO2added for curingISOMAX ™A mixture of cold-box epoxy-acrylate hybridbinder and epoxy SO2process, curing: gaseoustertiary amine (for example, according to U.S.Pat. No. 5,880,175) Binders are preferred from the group of PU cold box, PU no bake, Resol CO2−, Betaset or Epoxy SO2methods. The binders are added to the mold base material. The base material mixture may contain additional substances such as mold material additives like anti-veining additives. Any of the aforementioned binding agents can be used as a binder in an amount of approximately 0.4% by weight to approximately 7% by weight, preferably from approximately 0.5% by weight to approximately 6% by weight and particularly preferably from approximately 0.5% by weight to approximately 5% by weight, with reference in each case to the mold material mixture. To produce the mold material mixture, first the components of the binder system can be combined and then added to the refractory mold base material. However, it is also possible to add the components of the binder to the refractory mold base material at the same time or sequentially in any order. Conventional methods can be used to achieve a uniform mixture of the components in the mold material mixture. Experimental partAll percentages refer to percent by weightThe following were used:Supplier: ASK-Chemicals GmbH:ECOCURE ™ 30 BG 5:benzyl ether resin in estersECOCURE ™ 60 BG 5:polymeric MDI in aromatic solventsECOCURE ™ BLUE 30 HE 1:benzyl ether resin in estersECOCURE ™ BLUE 60 HE 1:polymeric MDI in alkylbenzeneCATALYST 706dimethyl propylamineMIRATEC ™ MB 522water-based sizeMIRATEC ™ TS 505water-based sizeVELVACOAT ™ AC 501alcohol-based sizeNOVANOL ™ 165alkaline phenol resol resin for theResol/CO2methodEthyl acetoacetate (EAA), supplied by Sigma AldrichPropane-1,1,1-triyltrimethyl tris(acetoacetate) (AATMP) - supplied by Sigma AldrichDiethyl malonate (MEE), supplied by Sigma Aldrich2-(cetoacetoxy)ethyl methacrylate (AAEMA), supplied by Sigma AldrichDBE - a mixture of dimethyl succinate, dimethyl glutarate and dimethyl adipate (supplied by Chemoxy)Ethylene urea (EHS) - supplied by BASF SEAdditive X - a mixture of sawdust, coke dust and phenol resin The symbols ®, or respectively ™ are used in each case to indicate registered trademarks at least for Germany and/or the USA for the corresponding owners. In the text below, ®, or respectively ™ will not be used for the sake of brevity, and in this respect reference is made herewith to the table above. Production of the Sizes: The CH-acidic compounds listed in the table of results, or respectively the comparative substances, were stirred into the commercially available MIRATEC MB 522 (or respectively another size, see tables of results) while stirring. The MIRATEC MB 522 obtained in a delivered state (or respectively another size, see tables of results) was adjusted to a viscosity suited for the application using tap water (Ford beaker 4 mm, flow time 11-13 sec.), and the CH-acidic compound, or respectively the comparative substances, was stirred in dropwise over 10 minutes while stirring. Cold Box Method: Determining Strength in N/cm2 In a Hobart mixer, a sand mixture consisting of quartz sand H 32, plus 0.60% ECOCURE 30 BG 5, or respectively ECOCURE BLUE 30 HE 1 (in each case individually for examples A1 to B25) and 0.60% ECOCURE 60 BG 5, or respectively ECOCURE BLUE 60 HE 1 (in each case individually for examples A1 to B25) was mixed until homogeneous over two minutes. This sand mixture was transferred to a Roeper H 1 core shooter and two cores with dimensions (l×w×h) of 220 mm×22.4 mm×22.4 mm were each shot with a 4 bar shooting pressure into the mold by compressed air. The sand was cured with CATALYST 706 (0.5 ml, 10 second gassing time at a 2 bar flushing pressure). After curing, the core was removed and a 10-minute-old core was dipped into the stirred sizing composition for 4 seconds to determine the size resilience. After waiting for 30 minutes at room temperature, the pair of cores was dried after sizing for 30 minutes at 150° C. in a circulating air dryer. The cooled cores were then stored at room temperature (20-25° C.) and in a closed box in a steam-saturated atmosphere (98% relative humidity, RH for short) for x hours (h). After the time periods defined in the tables of results, a pair of cores was removed and the bending strength was determined using the Multiserw device (by Morek). TABLE 1ComparisonA 1A 2A 3Added to sizeNone2% DBE2% EHS24 h 98% RH250251248According to the inventionB 1B 2B 3B 4B 5Added to size1% EAA2% EAA3% EAA4% EAA5% EAA24 h 98% RH265268286295310 Table 1 shows the strengths in N/cm2of sized cores that were produced with the binder system ECOCURE 30 BG 5/ECOCURE 60 BG 5. The size is MIRATEC MB522 that was unmodified, or modified with substances according to the invention or not according to the invention. TABLE 2ComparisonA 1A 2A 3Added to sizeNone2% DBE2% EHS24 h 98% RH250251248According to the inventionB 6B 7B 8B 9B 10Added to size1%2%1%2%2%AATMPAATMPAAEMAAAEMAMEE24 h 98% RH293313327335318 Table 2 shows the strengths in N/cm2of sized cores that were produced with the binder system ECOCURE 30 BG 5/ECOCURE 60 BG 5. The size is MIRATEC MB522 that was unmodified, or modified with substances according to the invention or not according to the invention. TABLE 3ComparisonA 4A 5A 6Added to sizeNone2% DBE2% EHS96 h 98% RH297296282According to the inventionB 11B 12B 13B 14B 15Added to size1% EAA2% EAA3% EAA4% EAA5% EAA96 h 98% RH308315327335342 Table 3 shows the strengths in N/cm2of sized cores that were produced with the binder system ECOCURE BLUE 30 HE 1/ECOCURE BLUE 60 HE 1. The size is MIRATEC MB522 that was unmodified, or modified with substances according to the invention or not according to the invention. TABLE 4ComparisonA 4A 5A 6Added to sizeNone2% DBE2% EHS96 h 98% RH297296282According to the inventionB 16B 17B 18B 19B 20Added to size1%2%1%2%2%AATMPAATMPAAEMAAAEMAMEE96 h 98% RH329340322337329 Table 4 shows the strengths in N/cm2of sized cores that were produced with the binder system ECOCURE BLUE 30 HE 1/ECOCURE BLUE 60 HE 1. The size is MIRATEC MB522 that was unmodified, or modified with substances according to the invention or not according to the invention. TABLE 5ComparisonA 7A 8A 9Added to sizeNone2% DBE2% EHS96 h 98% RH285288275According to the inventionB 21B 22B 23B 24B 25Added to size1% EAA2% EAA3% EAA4% EAA5% EAA96 h 98% RH304312328338349 Table 5 shows the strengths in N/cm2of sized cores that were produced with the binder system ECOCURE BLUE 30 HE 1/ECOCURE BLUE 60 HE 1. The size is MIRATEC TS 505 which was unmodified, or modified with substances according to the invention or not according to the invention. Resol/CO2Method: Determining Strength in N/Cm2 A sand mixture consisting of quartz sand H 32 plus 2.5% Novanol 165 was mixed in a Hobart mixer for 2 minutes. This sand mixture was transferred to a Roeper H 1 core shooter and two cores with dimensions (l×w×h) of 220 mm×22.4 mm×22.4 mm were each shot with a 4 bar shooting pressure into the mold by compressed air. The sand was cured with CO2gas (30 sec gassing time at a 2 bar flushing pressure). After curing, the core was removed and a 60-minute-old core was dipped in the sizing composition for 4 seconds to determine the size resilience. After waiting for 30 minutes at room temperature, the pair of cores was dried after sizing for 30 minutes at 150° C. in a circulating air dryer. The cooled cores were then stored at room temperature (20-25° C.) and in a closed box in a steam-saturated atmosphere (98% relative humidity—RH for short) for x hours (h). After specific periods of time, a pair of cores was removed and the bending strength was determined using the Multiserw device (by Morek). Alcohol Size VELVACOAT AC 501: After curing, the core was removed and a 60-minute-old core was dipped in the stirred size VELVACOAT AC 501, or respectively in the VELVACOAT AC 501 modified with CH-acidic substances, to determine the size resilience. After the alcohol was evaporated at room temperature, the pair of cores was stored in a closed box in a steam-saturated atmosphere (98% relative humidity, RH for short) for x hours (h). After specific periods of time, a pair of cores was removed and the bending strength was determined using the Multiserw device (by Morek). TABLE 6According toComparisonthe inventionA 10A 11A 12B 26B 27Added to sizeNone1% DBE1% EHS1% EAA1% AATMP24 h 98% RH8275789011348 h 98% RH80767290109120 h 98% RH81726591107 Table 6 shows the strengths in N/cm2of sized cores that were produced using the binder system NOVANOL 165. The size is MIRATEC MB 522 which was unmodified, or modified with substances according to the invention or not according to the invention. TABLE 7ComparisonAccording to the inventionA 13B 28B 29Added to sizeNone1% EAA1% AATMP24 h 98% RH59727748 h 98% RH617074120 h 98% RH616475 Table 7 shows the strengths in N/cm2of sized cores that were produced using the binder system NOVANOL 165. The size is VELVACOAT AC 501, which was unmodified, or modified with substances according to the invention or not according to the invention. From the tables, can be seen that the CH-acidic compounds increase the moisture stability of sized cores. Measuring Formaldehyde Emissions Producing the Test Specimens Using the CB Method: In a Hobart mixer, a sand mixture consisting of quartz sand H 32, plus 3% additive X, plus 1.0% ECOCURE 30 BG 5 and 1.0% ECOCURE 60 BG 5 (partially modified with a CH-acidic compound as a comparison) was mixed until homogeneous over two minutes. The CH-acidic compound was stirred fresh into ECOCURE 60 BG 5 and used directly for the sand mixture. This sand mixture was transferred to a Roeper H 1 core shooter and two round cores with a dimension (H×D) of 50 mm×50 mm were each shot into the mold with a shooting pressure of 4 bar using compressed air. The sand was cured with CATALYST 706 (1.0 ml, 10 second gassing time at a 2 bar flushing pressure). Sizing Process: The CH-acidic compounds listed in the table of results were stirred into the commercially available MIRATEC MB 522 while stirring. The MIRATEC MB 522 obtained in the delivered state was adjusted to a viscosity suited for the application using tap water (Ford beaker 4 mm, flow time 11-13 sec.), and the CH-acidic compound was stirred in dropwise over 10 minutes while stirring. A 30-minute-old round core was completely dipped in the size to be tested so that the size layer completely covered the core surface which corresponds to a wet size application of approximately 7.5 g. Measuring Setup: 14 round cores (core weight of approximately 2.1 kg) were stacked in a muffle furnace preheated to 175° C. so that the oven space was filled to the maximum. The core arrangement was chosen so that the cores do not touch each other at the side surfaces and were stacked in two layers in a cross bracing. After filling, the air was continuously sucked out of the furnace with a GS 312 Desaga pump (ventilation through the front furnace door, pump output of 3 liters/min), and the exhaust air was guided through three water-filled and ice-cooled washing bottles. The air was guided through the washing bottles over 90 minutes at a furnace temperature of 173-177° C. Then the formaldehyde content in the three combined washing bottles was measured photometrically using a photometer acetyl acetonate method (analogous to VDI 3862 page 6: 2004-02) at 412 nm, and the measured value of mg formaldehyde per kg core weight was calculated. TABLE 8ComparisonA 20A 21A 22A 23Added to ECOCURE 60 BG 5None2.5%8.5%2.5%EAAEAAAATMPFormaldehyde emissions in12.58.92.18.6mg/kgg CH-acidic compound per 1400.5251.780.525round cores Table 8 shows the formaldehyde emissions of different comparative systems. All of the examples listed here were sized with unmodified MIRATEC MB 522. The ECOCURE 60 BG 5 used as part of the binder component for the cores was partly modified with a CH-acidic compound. TABLE 9According to the inventionB 30B 31B 32Added to MIRATEC MB 5225% EAA5% MEE1% EAAFormaldehyde emissions in0.534.20.85mg/kgg CH-acidic compound per5.255.251.0514 round cores Table 9 shows the formaldehyde emissions of systems according to the invention. All cores were produced with the binder system ECOCURE 30 BG 5/ECOCURE 60 BG 5. The size MIRATEC MB 522 was modified corresponding to the information. Tables 8 and 9 show that the effectiveness of a formaldehyde reducer applied on the size is much more effective than when the CH-acidic compound is introduced through the mold material binder (in particular examples A22 to B32 that permit a direct comparison through the applied amount of EAA). Tables 8 and 9 show that the formaldehyde emissions can be reduced much more effectively when the CH-acidic compound is introduced through the size than in comparison to adding it through the mold material mixture, or respectively a binder component. This is clearly revealed in particular in examples A22 and B32; even though in example B32 much less CH-acidic compounds were introduced, the effect on formaldehyde reduction is much more significant. | 38,268 |
11858031 | InFIGS.1-5:1integral multi-way valve,2sprue,3runner,4(41-42,42-1to42-5) ingate,5riser,61(62) main valve opening part of sand core,63-67inner oil passage part of sand core,71-72exhaust passage at position of main valve opening,73conformal exhaust hole. DETAILED DESCRIPTION OF THE EMBODIMENTS Further description will be made below in conjunction with drawings and specific embodiments. The inventive concept of the present disclosure is: a plurality of ingates on a plurality of layers, a plurality of runners connecting the ingates on each layer, and a sprue connecting the plurality of runners are determined at first according to structural parameters of an integral multi-way valve to be cast, and an integral sand mold is printed by using the 3D printing technology to realize a multi-layer composite casting method and a corresponding casting system, which can disperse the influence of gravity and scouring force and the like in the liquid filling process, reduce casting defects such as broken sand core, internal defective fins and curved main valve openings, realize rapid casting and at the same time ensure quality stability of the formed valve. The present disclosure provides a multi-layer composite casting method adopting a side-pouring mode and a corresponding casting system. The multi-layer composite casting method can disperse and balance the influence of gravity and scouring force and the like in the liquid filling process and reduce casting defects such as broken sand core, internal defective fins and curved main valve openings. Moreover, the 3D-printed sand mold is an integral sand mold, there is no bonding gap inside the sand mold, the sand mold has good consistency, the surface quality and quality stability of a valve body casting after completion of pouring can be ensured, and at the same time the integral hydraulic valve can be rapidly casted and is suitable for batch and standardized manufacturing, can better support rapid replacement of large integral hydraulic multi-way valve products, greatly reduce trial production costs, shorten trial production cycles, and further realize industrial application of the sand mold 3D printing technology. The current embodiment is a method of casting an integral multi-way valve based on 3D printing, including:obtaining structural parameters of a valve to be cast;obtaining a valve body height L of the valve to be cast by taking a direction vertical to an axial direction of a main valve opening as a height direction;obtaining the number of layers of ingates according to the valve body height L;obtaining positions of ingates on each layer according to the structural parameters of the valve to be cast, so that all ingates are located on the same side of the valve to be cast;arranging ingate models with corresponding layers and positions according to the structural parameters of the valve to be cast;respectively arranging runner models connecting ingates corresponding to the ingates on each layer;arranging a riser model and a sprue model connecting the runners;creating a sand core model to be subjected to 3D printing, and a sand mold model comprising the ingates, runners, a sprue and a riser according to the structural parameters of the valve to be cast, the ingate models, the runner models, the sprue model and the riser model;performing 3D printing according to the sand mold model and the sand core model to obtain the sand mold and sand core of the valve to be cast; andperforming pouring by using the sand mold and sand core obtained from 3D printing to obtain an integral valve body. The present disclosure provides a multi-layer composite casting method using a side-pouring mode, which can disperse and balance the influence of gravity and scouring force and the like in the liquid filling process; moreover, the 3D-printed sand mold is an integral sand mold, there is no bonding gap inside the sand mold, the surface quality of a valve body casting after completion of pouring can be ensured, and at the same time the integral hydraulic valve can be rapidly casted and is suitable for batch and standardized manufacturing. The following embodiments specifically introduce the method of casting an integral multi-way valve by taking the valve to be cast being an integral hydraulic multi-way valve as an example. In some embodiments, after the structural parameters of the valve to be cast are determined, a body model1of the integral multi-way valve to be cast may be generated to facilitate more intuitive arrangement of positions of the ingates, the runners, the sprue, the risers, etc., as shown inFIGS.1and2. The method of casting an integral multi-way valve further includes: arranging a through-type exhaust passage in a part of the sand core corresponding to the main valve opening; arranging a conformal exhaust hole in a corresponding part of the sand core corresponding to other valve opening other than the main valve opening and configured to be connected to a sand mold periphery. That is, the path of the exhaust holes is disposed along the central path of the valve openings. The arrangement of the exhaust passage and the exhaust holes can improve the exhaust efficiency of the integral sand core, as shown inFIG.5. A 3D sand mold printing process is selected for sand core printing according to the weight of the valve to be cast: if the weight of the valve to be cast is less than or equal to 50 kg, a selective laser sintering technology or a binder jet printing technology is used for sand core 3D printing; if the weight of the valve to be cast is more than 50 kg, the binder jet printing technology is used for sand core 3D printing. Cases such as reduction of broken sand core can be further ensured. Before pouring, the sand mold obtained by 3D printing is dip coated with zircon powder paint, and then dried. Herein, the zircon powder paint with a Baume degree between 40 and 60 is used for dip coating for not more than 3 times, the drying temperature is 100-180° C., and the drying time is set to be 1-1.5 h. As for an integral hydraulic multi-way valve, when pouring, nodular cast iron is used for pouring, the pouring temperature is 1350-1400° C., and the thermal insulation time after pouring is more than or equal to 8 h. The number of layers N of the ingates is determined according to the valve body height L: dividing the valve body height L by a preset height interval L0taking 100 mm here, and approximately rounding the result obtained to obtain the number of layers N. Approximate rounding may be rounding-off approximation, or may be an integer part of the quotient. Referring toFIG.4, different ingates located on the same layer can be disposed at different heights to meet other structural requirements, such as evading structural positions that are not suitable for being directly scoured, including inner oil passages of the sand mold, thus it can ensure that the oil passage part of the sand core will not be directly scoured in the liquid filling process, and casting defects such as broken cores and fins due to the impact of molten iron in the casting process can be reduced. The embodiment of the present disclosure further provides a system of casting an integral multi-way valve, including a sand mold body, a sprue2, runners3, ingates4and risers5. A direction vertical to an axial direction of a main valve opening part of the sand core is taken as a height direction of a sand mold body. The sprue2, the runners3and the ingates4are disposed on one side of the sand mold body; a plurality of runners are disposed along the height direction of the sand mold body, a plurality of ingates are provided in the extension direction of the runners, and the runners are connected to a sand mold body through the plurality of ingates; the plurality of runners are respectively connected to the sprue, and the risers5are disposed on the top of the sand mold body. The embodiment below will introduce the system of casting an integral multi-way valve as shown inFIGS.1-5in detail. The number of the runners is set to be a result value obtained by approximately rounding the result obtained by dividing the valve body height L by a preset height interval L0=100 mm, for example, in the embodiment as shown inFIGS.1-5, the number of layers of the runners is 2. All the ingates connected to a single runner have at least two heights, and each ingate is disposed away from inner oil passages of the sand mold. A through-type exhaust passage is disposed in a part of the sand core corresponding to the main valve opening. Parts of the sand core corresponding to other valve openings other than the main valve opening and connected to the sand mold periphery are each provided with a conformal exhaust hole. A plurality of risers are provided; all the ingates are disposed on a lateral part of one side of the sand mold parallel to the axial direction of the main valve opening. That is, the side where the ingates are located is not the top surface or bottom surface of the sand mold. That is, referring toFIGS.1to5, the casting system in the current embodiment is a multi-layer composite casting system, using a side-pouring mode, wherein the main valve opening is horizontally disposed to determine a gravity pouring direction, the valve body height L in the gravity pouring direction is measured, the number of layers of the ingates is determined by taking N=L/100 and rounding off N to obtain an integer value, and as shown inFIG.2, the two layers of ingates are41and42respectively. The ingates4are arranged on a side of the poured sand mold, the number of ingates on a single layer is not less than 3 between the two layers of main valve openings61and62, as shown inFIG.4, they are42-1to42-5, and the total number is 5. The heights of different ingates can be different. The ingates evade adjacent inner oil passages such as63to67to ensure that the oil passage parts of the sand core are not directly scoured in the mold filling process of metal liquid, and reduce casting defects such as broken cores and fins due to the impact of molten iron in the casting process. The risers5are disposed in a conformal manner without considering the draft angle, it can be set as square or round, as shown inFIG.2, it is set as square, which can better perform feeding inside parts without considering the complexity of manufacturing riser bushes. Different from the traditional sand-shooting core manufacturing process, the present disclosure adopts the 3D printing process to manufacture the integral sand mold, and there is no bonding gap inside the sand mold, as shown inFIG.5; the wall thickness of the sand mold periphery is more than or equal to 25 mm, and all parts of the sand core corresponding to main valve openings are provided with through-type exhaust passages for exhausting, as shown by71and72inFIG.5; and parts of the sand core corresponding to other valve openings connected with the sand mold periphery are each provided with a conformal exhaust hole, as shown by73inFIG.5, so that the exhaust efficiency of the integral sand core is improved. The casting system works with a special casting process: the zircon powder paint with a Baume degree set between 40 and 60 is used for dip coating for not more than 3 times, the drying temperature of the sand core is 100-180° C., and the drying time is set to be 1-1.5 h. Nodular cast iron is used for rapid pouring of the integral hydraulic multi-way valve, the pouring temperature is controlled between 1350 and 1400° C., and the thermal insulation time after pouring is more than or equal to 8 h. Using the casting method and the casting system of the present disclosure to cast the integral multi-way valve has at least one of the following advantages: Good quality of internal structure. The inner oil passages of the valve body have curved and complicated features. In traditional casting, the sand mold is formed by bonding separated parts, and casting defects such as fins are likely to occur. The present disclosure realizes integrated manufacturing of a sand mold mould, avoids internal bonding of the sand mold, reduces the number of positions of casting defects, and can ultimately improve the casting quality. High success rate. The success rate of casting the hydraulic multi-way valve by using the sand mold 3D printing technology is generally low in the market. The present disclosure proposes the composite casting system, the number of internal flow passages and the number of layers can be reasonably set according to the specific structural size of the valve body, which effectively reduces the impact of heat flow on the sand core in pouring process and further improves the casting success rate. Further improved heat-resistant strength of the sand core. Ceramsite sand is selected as raw sand for sand core 3D printing, so that the heat-resistant strength of the sand cores is improved; and the ceramsite sand works with special zircon powder paint, thus further improving the heat-resistant strength of the 3D-printed sand cores and solving the key problem that insufficient strength of the 3D-printed sand cores leads to a low casting success rate. High flexibility. Based on the 3D printing process, regardless of the complexity of a structure to be printed, the riser form, the riser position and the structural form of the casting system can be designed in a conformal manner to achieve targeted design, without considering the difficulty of sand mold manufacturing, and the design flexibility is significantly improved. The above description is merely preferred embodiments of the present disclosure. It should be noted that various improvements and variations may also be made for those of ordinary skill in the art without departing from the technical principles of the present disclosure, and these improvements and variations also should be contemplated as being within the protection scope of the present disclosure. | 13,982 |
11858032 | DETAILED DESCRIPTION The present invention is further described in conjunction with the drawings. Referring toFIG.1andFIG.2, the present invention provides a high-temperature alloy pressure casting mold for impellers and guide vanes. The high-temperature alloy pressure casting mold comprises a casting main pipe, a lower casting pipe and forming steel mold assemblies; and a plurality of forming steel mold assemblies2surround the casting main pipe1, the casting main pipe1is provided with a pressure device, the bottom of the casting main pipe1is connected to a casting gate at the bottom of each forming steel mold assembly2by means of the lower casting pipe3, the casting main pipe1comprises a steel jacket11and a ceramic layer12, the ceramic layer12is attached to an inner surface of the steel jacket11, the lower casting pipe3comprises a steel pipe31and a ceramic pipe32, and the steel pipe31is sheathed outside the ceramic pipe32. In the present invention, a volume Φ of the casting gate is 130×400 mm3, a maximum wall thickness of an impeller and guide vane casting is 51 mm, and the volume of the casting gate is greater than a local volume of any part of the impeller and guide vane casting. Liquid steel at the casting gate has a temperature always higher than that of the impeller and guide vane casting during casting, so that the pressure can be transmitted by liquid until all inner parts of the impeller and guide vane casting are crystallized. In the present invention, the forming steel mold assembly2comprises a plurality of forming steel molds21, the forming steel mold21comprises an upper steel mold211, a lower steel mold212and a core213, surfaces of the upper steel mold211and the lower steel mold212are coated with a zircon powder coating, and the upper steel mold211and the lower steel mold212are internally provided with the core213. Taking 18 impeller and guide vane castings as an example, there are three forming steel mold assemblies2and six formed steel molds21. In order to facilitate rapid cooling, a cooling water circulation pipe is provided on the forming steel mold21. The core213is internally provided with a metal support which plays a supporting role and can be used repeatedly. The pressure device is a pressure column4located on the top of the casting main pipe1. A high-temperature alloy pressure casting process for impellers and guide vanes is used for preparing an impeller and guide vane casting according to the following steps: step 1: injecting liquid steel into the casting main pipe in the middle of the mold at a casting temperature of 1470° C.-1520° C., keeping metal inclusions in the liquid steel suspending on a liquid surface of the liquid steel instead of entering the forming steel molds21, and maintaining a height difference between the liquid surface of the liquid steel and the top of an inner surface of the forming steel mold at 120 mm-400 mm to enable the liquid steel to be injected into the forming steel molds faster; Step 2: pressurizing the casting main pipe so that the liquid steel in the casting main pipe flows into the lower casting pipe and flows into each forming steel mold from bottom to top through the casting gate; and a process of pressurizing the casting main pipe is to increase the pressure from 100 kg to 10000 kg at a constant speed in 3-4 min so as to reduce the weight of the riser, ensure that metal cutting surface layer inside the casting has no shrinkage cavity, eliminate the need of repair welding of the impeller and guide vane casting, and improve the casting quality to meet the needs of various industries; Step 3: transferring the pressure obtained by the casting main pipe to the liquid steel in the forming steel mold by liquid during crystallization of the liquid steel in the forming steel mold, so that the liquid steel fills an inner cavity of the forming steel mold; during the crystallization of the liquid steel in the forming steel mold, water cooling can be carried out; and when the temperature of the core drops to 1300° C., the core can be subject to water cooling so as to improve production capacity and protect the mold; Step 4: waiting 3-5 min to allow the liquid steel in the forming steel mold to crystallize and form the impeller and guide vane casting, with the liquid steel at the casting gate being in liquid state; Step 5: filling shrinkage cavities with the liquid steel at the casting gate to form risers; and Step 6: cooling and demolding the impeller and guide vane casting. When the weight of the liquid steel is 1420 kg, totally 18 impeller and guide vane castings are formed. According to test, the present invention began to produce 28 ml shrinkage cavities at 26 s after casting, and produced a total of 760 shrinkage cavities with a total weight of about 527 g after 3 min. The volume Φ of the casting gate is 130×400 m3, and the liquid steel at the casting gate is about 37 kg. The total liquid steel required for feeding the shrinkage cavities of 18 impeller and guide vane castings is 527 g×18 (about 9.5 kg), which greatly reduces the weight of the riser, thus improving the process yield to more than 85%. The provision of the ceramic layer12, the ceramic pipe32and zircon powder coating enable the casting mold to adapt to the high-temperature alloy casting above 1400° C. The present invention can realize the forming of 18 impellers and guide vanes at a time, which improves the production efficiency. The pressure supply design of the pressure casting main pipe reduces risers and shrinkage cavities, improves the casting quality, improves the process yield to more than 85%, and reduces the production cost. | 5,667 |
11858033 | DETAILED DESCRIPTION In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the present invention. The disclosed embodiments may be practiced without these specific details. In other instances, well-known methods, procedures, components, or structures may not have been described in detail so as not to obscure the present invention. The dimensions of some of the elements may be exaggerated relative to other elements for clarity or several physical components may be included in one functional block or element. Further, sometimes reference numerals may be repeated among the drawings to indicate corresponding or analogous elements. Moreover, some of the parts depicted in the drawings may be combined into a single function. The invention is not limited in its application to the details of construction and the arrangement of the components set forth in the following description or illustrated in the drawings. The invention is capable of other embodiments or of being practiced or carried out in various ways. Also, it is to be understood that the phraseology and terminology employed herein are for the purpose of description and should not be regarded as limiting. Certain features of the invention that are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the invention that are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable sub-combination. In accordance withFIG.1, a porous plug removal and installation system10is shown and outlined further in the following description. The system10includes a porous plug handler12. The handler12includes a mast14disposed at the end of the handler12. The mast14is rotatably connected to an extendable boom16. The boom16is pivotably connected to a rotatable beam18, which is rotatably mounted to a base20that may be fixed in place to the plant floor or other stationary surface. The system10is capable of both installing a porous plug into a corresponding port of a ladle L, whereby grout surrounding the plug will harden, and is also capable of removing a previously installed plug from the ladle. In one aspect, the base20may be slidable and lockable along a rail system25, such that the system10may be moved away from the ladle L to a storage area or the like, or may be moved to another ladle in an adjacent area. In another aspect, the base20may be bolted or otherwise fixed in place to the floor of the work site. The handler12is configured to be moveable relative to the ladle L and may be controlled by a person P to reliably install a porous plug11in the port of the ladle L, or else automated as outlined further in the following description. The handler12is adjustable via pivoting and rotation of its components to align a porous plug11with ports located at various locations, depending on the size and type of ladle L being used. The handler12is shown in more detail inFIG.2. As can be understood from this figure, the mast14may take the form of a slider mast. The mast14may be rotatably coupled to the extendable boom16via a first right angle bracket22and a second right angle bracket24. The first bracket22is coupled to the middle of the mast14via a mast swing gearbox26, allowing the mast14to rotate 360 degrees relative to the first bracket22. The second bracket24is coupled to the end of the extendable boom via a mast tilt gearbox28. This allows the second bracket24to rotate 360 degrees relative to the end of the extendable boom16(and therefore also allowing the mast14to rotate 360 degrees around the end of the boom16). The first bracket22and the second bracket24are coupled via a middle tilt gearbox30, allowing the first bracket to rotate 360 degrees relative to the second bracket24. Thus, as is evident, via actuation of the various gearboxes, the position and orientation of the slider mast14can be adjusted to accommodate various positioning demands. In addition to the angular orientation afforded by the various gearboxes, the extendable boom16allows for further positioning of the mast14. The extendable boom16includes a boom extend cylinder32for extending the boom16and a boom lift cylinder34for lifting and lowering the boom relative to the rotatable beam18. The beam18is coupled to the base20via boom slew gearbox36, allowing the beam18and the boom16coupled thereto to pivot about the base up to 360 degrees. However, the necessary range of pivoting for the operations disclosed herein may not be as high as 360 degrees. In one aspect, the swing or slew range of the handler12and the boom16may be about 140 degrees. However, this range shall not be interpreted as limiting. The base20may include a hydraulic tank38, a hydraulic pump and electric motor module40, and an electrical control enclosure42. A hydraulic control valve bank44may also be disposed on the base20for controlling the various hydraulic mechanisms of the handler12. With continued reference toFIG.2, the slider mast14at the end of the handler12may include a porous plug11, a rotatable hydraulic drive46and a jaw gripper48. The hydraulic drive46is configured to rotate the porous plug11once inserted into the port in a controlled manner. The jaw gripper48may comprise a cylinder configured to grip and clamp a pipe attached to the plug11to control the rotation and translation of the plug11. The mast14further includes a pair of rails50along which a slider mast52can be hydraulically controlled translationally to slide the plug11in the direction of the orientation of the mast14and into the port in the ladle L. FIGS.3A-Dprovides multiple views of the handler12in different orientations and positions of the mast14and boom16in accordance with the components described above. The top view ofFIG.3Aof the handler12illustrates 360 degree rotation of the mast14via the mast swing gearbox26. The front view ofFIG.3Bof the handler12illustrates 360 degrees of rotation of the mast14via the mast tilt gear box28.FIG.3Cshows one side view of the handler12and illustrates 360 degrees of rotation of the mast14via middle tilt gear box30. It will be appreciated that 360 rotation via one gearbox may not be possible in some positions of the boom16and the other gearboxes. FIG.3Dshows another side view of the handler12and illustrates the boom16in different elevated positions (both lifted and lowered) as well as an extended position. An extended position of the boom16is also shown. In each of the positions shown, the mast14may be adjusted via middle tilt gearbox30to remain generally horizontal. Similar adjustments to the mast14may be made via mast swing gear box26when the boom16is pivoted, or in a slewed position, via boom slew gearbox36, such that the mast14may be aligned normal or perpendicular to the ladle L and aligned with typical port axis. In this regard, one example of a boom swing range is illustrated inFIG.4.FIG.4illustrates a top view of the handler12, with an exemplary swing range illustrated at about 140 degrees. The boom is illustrated in a nominal position, with the range extending about 90 degrees to the right and 50 degrees to the left. The mast14is shown parallel to the boom16, and normal to the face of the ladle L such that the porous plug11may be inserted in the direction of the ladle L. If the boom16swings to the left or right, the mast14may corresponding swing in the opposite direction to accommodate, such that the mast14will remain normal to the ladle L. The above-described boom swing range, however, may be greater. For example, the boom16may be pivoted or slewed up to 140 degrees to the right or left from the nominal position depending on the aspects of the plant in which the system is installed. In another aspect, the boom16could be arranged to pivot even beyond the 140 degrees to the right or left, Thus, the mast14may be raised and lowered, shifted left to right, and extended toward and away from the ladle L based on movement of the various interconnected components of the handler12, and can remain oriented in a desired direction of insertion for the plug11. When aligned in the desired position and orientation, the mast14may mate with the ladle L, such that the porous plug11may be inserted in a controlled and predictable manner into the port, and held in place, such that the grout around the plug11can set and hold the plug11in place as intended. With reference toFIGS.5A-5E, the mast14is illustrated, in part, to show its alignment with the port on the ladle L. The mast14includes a front plate54, shown inFIG.5A, which includes pins54a, and54bdisposed at the center of the upper and lower edges of front plate54. The pins54a,54bextend generally vertically up/down from the front plate54, and provide a locating feature for the mast14. In particular, the pins54a,54bare sized and configured to be received a corresponding structure that is attached to the ladle L. FIG.5AandFIG.5Cillustrate detailed views of ports60and62of the ladle L, seen in the front view ofFIG.5Dand the perspective view ofFIG.5E. Port60is disposed at approximately “2 o'clock” on the bottom face of the ladle L, with port62disposed at about “8 o'clock” on the bottom of the ladle L. In this aspect, the ports are about 180 degrees apart, or diametrically opposed relative to the central axis of the ladle L. It will be appreciated that these particular locations are one example, and that different ladle configurations can include fewer ports, more ports, and/or ports located in different locations on the bottom face of the ladle L. It will also be appreciated that throughout the figures the ladle L is shown on its side, such that the bottom face of the ladle L is presented to the handler12and such that the porous plug11may be inserted horizontally toward the ports of the ladle L. In the illustrated arrangement, with ports60and62being diametrically opposed, the ladle L, if rotated on its side in the opposite direction from vertical would result in ports60and62appearing similar when viewing the bottom face, with one at 2 o'clock and the other at 8 o'clock, but reversed. Port62would be at 2 o'clock and port60would be at 8 o'clock. FIG.5Aillustrates the mast14and front plate54axially aligned with the port60. In this illustration, ladle L includes a locating plate64welded or otherwise secured to the bottom face of the ladle L. The locating plate64defines a notch, into which the pin54b(at the bottom of front plate54in this example) may be received to align the mast14with the port60.FIG.5Csimilarly illustrates a locating plate66welded or otherwise secured to the bottom face of the ladle L, with the locating plate66defining a notch sized and configured to receive pin54awhen the mast is aligned with port62, as shown in the cross-section ofFIG.5B. In one aspect, the locating plates64and66are multiple plates of similar shape welded on top of each other to increase thickness. As shown, locating plate64is at the bottom of the port60and locating plate66is at the top of the port62. It will be appreciated that the locating plates64,66could both be at the top or at the bottom. Similarly, the pins54a,54bcould be in the form of a single pin and/or located at various points on the front plate54, with the locating plates similarly located in a corresponding position on the ports of the ladle L. In another aspect, multiple locating plates can be disposed around a single port, such that plates are disposed at both the top and the bottom of the port. In the case of the ladle L being rotated to its side in the opposite direction, as described above, the arrangement where one of the locating plates64,66is above its corresponding port and the other locating plate64,66is below its corresponding locating port would be similarly arranged, due to the illustrated 180 degree symmetry. During the installation process of the porous plug11, the mast14can therefore be adjusted in its position to be aligned with the desired port (60or62as shown inFIG.5D) of the ladle L. With the mast14aligned, the mast can be advanced axially/horizontally toward the port on the ladle L, with the pin of the front plate54being received in the locating plate of the port, confirming that the mast14is aligned with the port in the desired position. Thus, when the porous plug11is inserted into the port, the grout around the outside of the plug11can be generally consistently provided between the plug11and the inner wall of the port. FIG.6illustrates an end view of the system10and the handler12, with the mast14in position between the ports60and62, and not aligned with either port60. To align with the port60on the upper right, the mast14may be raised from its illustrated position via the boom16being tilted upward. The mast14may also be shifted to the right via rotatable beam18. The mast14can be tilted downward via middle tilt gearbox30to counteract the upward tilt of the boom18. Similarly, the mast14may be rotated to the left via mast swing gearbox26to counteract the shift to the right by the beam18. To reach port62instead, similar opposite movements (relative to those described immediately above) can be performed. It will be appreciated that similar movement combinations may be made to reach other potential port locations. In one aspect, the handler12can be tared to a predetermined reference location on the ladle L relative to known predetermined positions of the ports (such as ports60and62). The system10may include a controller (such as a computer having a processor and non-transitory computer readable medium) that can be configured to automatically move the mast14from its nominal position or tared position to the predetermined known location of the ports. The operator person P may fine tune the location of the mast14via manual control, if necessary. The operator person P may also move the mast14manually without using a controller with predetermined programmed movements, if desired. FIG.7illustrates a position corresponding to that shown inFIG.6, and further illustrates the extendable boom16in a retracted position, and with the mast14shown in a nominal position thereof with the porous plug11not yet extended from the mast14. Once aligned with one of the ports on the ladle L, the mast14(and the slider thereof) may be actuated to move the porous plug11from left to right inFIG.7. FIG.7further illustrates that as boom18is tilted upward, mast14can be tilted downward. To bring mast14closer to the ladle L or the port(s) thereof, extendable boom18may be extended. When tilted, such extension of the boom18will further raise the mast14. Accordingly, as the boom is extended toward the ladle L, the boom may correspondingly be lowered slightly (and the mast14tilted upward) to align the mast14with the port, and ultimately bring the front face54of the mast14into engagement with the port (and the locating features of the port). The above described system10and handler12have been described with reference to the porous plug11being held in the mast14such that it can be introduced toward and into the port of the ladle L. However, the system10is also configured to easily load a porous plug11without substantial manual labor. FIGS.8A-Cillustrate the handler12in position to load a porous plug11from a crate39or specially configured crate/shelf37, in which a plurality of plugs11are arranged vertically and pointed downwardly in the crate39or are arranged horizontally in the crate/shelf37. In a vertical storage orientation, the pipe extends upwardly from the plug11, and is presented for being received and secured by the mast14, which again may be done in an automated fashion.FIGS.8A-Cillustrates multiple views of the handler12in a position to receive the porous plug11in its vertical orientation. In another aspect, shown inFIG.8C, the horizontally aligned crate/shelf37is disposed on the platform, and the mast14may be arranged horizontally to align with the stored plugs11. It will be appreciated that other storage orientations and locations may be used, with the mast14being moved and/or oriented about and along multiple axes to align with an retrieve/secure the plugs11. For example, the crate or rack may be disposed on a platform adjacent the handler12. The mast14may be swung to the left and rotated and pivoted such that the front plate54is at the bottom of the vertically oriented mast14. The mast14may be lowered down onto the upwardly projected pipe that is attached to the plug11. The pipe can be received in the jaw gripper48, which can be hydraulically or otherwise actuated to automatically grip the pipe. Pipes may be various diameters and lengths and be received and gripped by the jaw gripper48. In another aspect, the plugs11may be oriented horizontally or at an angle, with the mast14being oriented at a corresponding angle to receive the pipe of the plug11. Plugs11may also be moved into another installation position via a magnetic clamp or other transport mechanism to ease manual movement of the plug11. In another aspect, a magnetic clamp and crane may be used to transport a plug11and lower it into the mast14, with the mast oriented in an opposite vertical orientation to receive the plug11from above. With the plug11grasped by the mast14and the jaw gripper48thereof, the plug11may then be rotated and coated with a castable grout mix. The plug11may be rotated by hydraulic drive46or manually, and thickness may be adjusted or tailored with an angled scraper, if desired. This operation may also form part of an automated process. The angled scraper used for applying and shaping the grout may be a fixed feature or a removable feature. Once the grout is applied, the mast14may be moved to the desired position axially aligned with the port of the ladle L, as described above. The porous plug11may then be driven into the port of the ladle L, such as with up to 1000 lbs of force. The plug11may be pushed into the port to a uniform depth as desired by the operator. Following insertion of the plug11, the jaw gripper48will release the rod, and the mast14may be retracted from the ladle L. The handler12may return to the nominal position shown inFIGS.7and8following installation of the plug11. Alternatively, following installation of the plug11, the handler12may be manipulated to grab another plug11from the crate or rack. In one aspect, the handler12may include a storage position or rest position, shown inFIGS.9A-C. In this position, the handler12has a generally compact footprint, and is pivoted away from the ladle L. The boom16may be retracted and rotate to the right from the nominal position via the beam18. The mast14may be oriented vertically to reduce the footprint of the handler12on the plant floor. The handler12can be moved out of its storage or rest position when necessary for the next plug11removal and/or installation. The handler12has been described generally for the installation of the plug11. However, it will be appreciated that the handler12can also be used for plug11removal, with the handler12gripping the pipe of a spent plug11and retracting the plug11away from the ladle L via manipulation of the position of the handler12after gripping the plug11. More particularly, removal of the plug may include a general reversal of the steps described above for installation. The jaw gripper48can be positioned relative to the port and pipe of the installed plug11, which is surrounded by grout at the interface between the plug11and the port of the ladle L. The jaw gripper48may be controlled to securely grasp the pipe of the porous plug11. The plug11may be rotated via rotation of the jaw gripper48to break the grout and break the plug11loose from the port of the ladle L. The slider mast may be retracted away from the port, thereby retracting and pulling the plug11out of the port. The mast14may be disconnected or otherwise removed away from the ladle, via the interconnected linkages of the system, including the gearboxes, boom, etc. The mast14may be positioned in a retracted positon where the plug11can be released from the jaw gripper48. In one approach, similar to the loading of the plug into the mast14, the mast14may be positioned vertically and the plug11may be released from the jaw gripper48and disposed of with the aid of gravity into a container or the like. The mast14need not be positioned perfectly vertical of course to allow for disposal of the plug11with the aid of gravity, such that the mast14could also be oriented at an angle downward with the end of the plug11pointing down. In one aspect, the jaw gripper48may include an associate coolant outlet for introducing coolant into the hollow pipe of the plug11while the plug11is held in the jaw gripper48. The end of the pipe may include threading or other attachment mechanism, and the coolant pipe may have a corresponding attachment mechanism arranged to convey coolant into the pipe. Prior to rotation of the plug11by the jaw gripper48, coolant may be introduced into the pipe, thereby causing the hot grout to crack or otherwise weaken, which may reduce the level of rotational force necessary to break the plug11free from the port of the ladle L. The coolant may be in a gas form, and may be blown into the interior of the pipe toward the plug, thereby cooling the plug and the adjacent grout. This rapid cooling cannot be tolerated by the hot hardened grout, thereby leading to the rapid shrinking, cracking, and weakening and easing the removal of the plug11from the ladle L. With reference now toFIGS.10A-D, an alternative mast114is provided for controlled alignment with the one of the ports on the ladle L. Reference numbers in this embodiment are similar to those described above increased by “100.” It will be appreciated that in some instances the components may be effectively the same, even with different reference numbers, and the various descriptions above are equally applicable unless otherwise noted. The mast114includes a front plate154, shown inFIG.10B, which includes a locating or indexing bracket155, which may be referred to as mast bracket155, fixed to the mast114and front plate154and disposed below the mast114and front plate154, extending rearward and away from the ladle L. Mast bracket155also extends across the mast114, and may have a width approximately the same as the mast114. The mast bracket155includes at least one depending flange or lug155athat extends downward from a generally horizontal base portion. The lug155a(which may be a pair of spaced apart lugs or an elongate projection) includes downwardly facing concave recess155b, configured to receive and/or to be placed upon a corresponding rod, bar, or the like for the purpose of indexing/locating the mast114with one of the ports of the ladle L. The ladle L may include a ladle bracket157configured to be coupled with the mast bracket155during aligned of the mast114with the port of the ladle L. The ladle bracket157may include a bar157athat extends generally laterally/horizontally across the bottom face of the ladle L that is presented to the mast114. When the mast114is aligned with the port of the ladle L and brought to the correct position, the bar157ais generally parallel to the front plate154and rearward of the front plate154. The bar157amay in this positioned be aligned with and received within the concave recess155band may support the end of the mast114when the mast114is correctly positioned relative to the port of the ladle L. The mast bracket155may be attached to the mast via bolts, welding, or other mechanical fastening approaches. The ladle bracket157may likewise be fixed to the bottom of the ladle L in the desired position relative to the ports of the ladle L. In one example, the ladle bracket157is welded to the bottom of the ladle L in the desired position. In another example, the ladle bracket157may be removably secured to the bottom of the ladle L via bolts or the like. A common hole pattern may be used for the ladle bracket157and or the ladle L to allow the ladle bracket157to be located in alternative locations relative to the port, or to allow for the ladle bracket157to be changed out and replaced with a different sized ladle bracket157(or in the event of damage requiring replacement). The position of the ladle bracket157on the ladle relative to the port may be determined based on the size and arrangement of the mast114and mast bracket155. It will be appreciated that the specific arrangement with regarding to specific lengths and relative distances may be selected to permit the mast114to be positioned as desired relative to the port of the ladle L. Similar to the use of locating plates64and66, the ladle L may include two ladle brackets157. FIG.10Dillustrates ports160and162of the ladle L, withFIGS.10A and10Cproviding detailed views. Port160is disposed at approximately “2 o'clock” on the bottom face of the ladle L, with port162disposed at about “8 o'clock” on the bottom of the ladle L. In this aspect, the ports are about 180 degrees apart, or diametrically opposed relative to the central axis of the ladle L. It will be appreciated that these particular locations are one example, and that different ladle configurations can include fewer ports, more ports, and/or ports located in different locations on the bottom face of the ladle L. It will also be appreciated that throughout the figures the ladle L is shown on its side, such that the bottom face of the ladle L is presented to the handler12and such that the porous plug11may be inserted horizontally toward the ports of the ladle L. In the illustrated arrangement, with ports160and162being diametrically opposed, the ladle L, if rotated on its side in the opposite direction from vertical would result in ports160and162appearing similar when viewing the bottom face, with one at 2 o'clock and the other at 8 o'clock, but reversed. Port162would be at 2 o'clock and port160would be at 8 o'clock. FIG.10Aillustrates the mast114and front plate154axially aligned with the port160. In this illustration, ladle L includes ladle bracket157welded or otherwise secured to the bottom face of the ladle L. The ladle bracket157has the bar157adisposed below port160to align and support the mast a14 relative to the port160.FIG.10Csimilarly illustrates a ladle bracket157welded or otherwise secured to the bottom face of the ladle L, with the ladle bracket157disposed above port162. Thus, as shown, ladle bracket157is at the bottom of the port160and ladle bracket157is at the top of the port162. It will be appreciated that the ladle brackets157could both be at the top or at the bottom. In another aspect, multiple ladle brackets157can be disposed around a single port, such that plates are disposed at both the top and the bottom of the port. The ladle brackets157could also be arranged to the side of the ports while still performing their indexing function. In the case of the ladle L being rotated to its side in the opposite direction, as described above, the arrangement where one of the ladle bracket157is above its corresponding port and the other locating is below its corresponding port would be similarly arranged, due to the illustrated 180 degree symmetry. The ladle bracket157provides added functionality during the use of the system. For example, during insertion of the plug11or retraction of the plug11, reaction forces form the plug/ladle in the axial/insertion/removal direction may act on the interconnected parts of the system, including but not limited to the gearboxes26,30,28, brackets22,24, boom16, and boom extend cylinder32. Because the bar157ais positively located within the recess155b, the reaction forces react on the mast114and ladle L, rather than the components supporting the mast114, thereby increasing the life of these components and reducing the possibility of fatigue or other damages on the various linkages. Each of the following terms written in singular grammatical form: “a”, “an”, and the”, as used herein, means “at least one”, or “one or more”. Use of the phrase One or more” herein does not alter this intended meaning of “a”, “an”, or “the”. Accordingly, the terms “a”, “an”, and “the”, as used herein, may also refer to, and encompass, a plurality of the stated entity or object, unless otherwise specifically defined or stated herein, or, unless the context clearly dictates otherwise. For example, the phrases: “a unit”, “a device”, “an assembly”, “a mechanism”, “a component, “an element”, and “a step or procedure”, as used herein, may also refer to, and encompass, a plurality of units, a plurality of devices, a plurality of assemblies, a plurality of mechanisms, a plurality of components, a plurality of elements, and, a plurality of steps or procedures, respectively. Each of the following terms: “includes”, “including”, “has”, “having”, “comprises”, and “comprising”, and, their linguistic/grammatical variants, derivatives, or/and conjugates, as used herein, means “including, but not limited to”, and is to be taken as specifying the stated components), feature(s), characteristic(s), parameter(s), integer(s), or step(s), and does not preclude addition of one or more additional components), feature(s), characteristic(s), parameter(s), integer(s), step(s), or groups thereof. Each of these terms is considered equivalent in meaning to the phrase “consisting essentially of. Each of the phrases “consisting of and “consists of,” as used herein, means “including and limited to.” The phrase “consisting essentially of,” as used herein, means that the stated entity or item (system, system unit, system sub-unit device, assembly, sub-assembly, mechanism, structure, component element or, peripheral equipment utility, accessory, or material, method or process, step or procedure, sub-step or sub-procedure), which is an entirety or part of an exemplary embodiment of the disclosed invention, or/and which is used for implementing an exemplary embodiment of the disclosed invention, may include at least one additional feature or characteristic being a system unit system sub-unit device, assembly, sub-assembly, mechanism, structure, component or element or, peripheral equipment utility, accessory, or material, step or procedure, sub-step or sub-procedure, but only if each such additional feature or characteristic does not materially alter the basic novel and inventive characteristics or special technical features, of the claimed item. The term “method,” as used herein, refers to steps, procedures, manners, means, or/and techniques, for accomplishing a given task including, but not limited to, those steps, procedures, manners, means, or/and techniques, either known to, or readily developed from known steps, procedures, manners, means, or/and techniques, by practitioners in the relevant field(s) of the disclosed invention. Terms of approximation, such as the terms about, substantially, approximately, etc., as used herein, refers to ±10% of the stated numerical value. “Generally polygonal” means that the shape has flat surfaces, as with a polygon, but may have rounded corners connecting these surfaces. The phrase “operatively connected,” as used herein, equivalently refers to the corresponding synonymous phrases “operatively joined”, and “operatively attached,” where the operative connection, operative joint or operative attachment, is according to a physical, or/and electrical, or/and electronic, or/and mechanical, or/and electro-mechanical, manner or nature, involving various types and kinds of hardware or/and software equipment and components. It is to be fully understood that certain aspects, characteristics, and features, of the invention, which are, for clarity, illustratively described and presented in the context or format of a plurality of separate embodiments, may also be illustratively described and presented in any suitable combination or sub-combination in the context or format of a single embodiment. Conversely, various aspects, characteristics, and features, of the invention which are illustratively described and presented in combination or sub-combination in the context or format of a single embodiment may also be illustratively described and presented in the context or format of a plurality of separate embodiments. | 32,356 |
11858034 | REFERENCE NUMERALS 1: casting and outputting system;10: casting machine;11: disc body;20: transfer device;30: special fixture;40: cooling tank;50: collection device;60: waste plate rack;70: flexible element. DETAILED DESCRIPTION Embodiments of the present disclosure are described in detail below, examples of which are illustrated in the drawings. The same or similar elements are denoted by same reference numerals in different drawings unless indicated otherwise. The embodiments described herein with reference to drawings are explanatory, and only used to understand the present disclosure. The embodiments shall not be construed to limit the present disclosure. A casting and outputting system1according to some embodiments of the present disclosure will be described below with reference to the accompanying drawings. The casting and outputting system1has small footprint, flexible layout, low failure rate, high intelligence and high stability, and the anode plate has good cooling effect, small deformation and less oxidation. As shown inFIG.1toFIG.3, the casting and outputting system1according to some embodiments of the present disclosure includes a casting machine10, a transfer device20, a special fixture30, a cooling tank40, a collection device50and a waste plate rack60. Specifically, the casting machine10has a rotatable disc body11, and the disc body11has a casting position X and a plate taking position Y. The transfer device20is arranged in front of the plate taking position Y of the disc body11. The special fixture30is connected to an execution end of the transfer device20. The cooling tank40and the waste plate rack60are arranged near the transfer device20, respectively. The collection device50is arranged near the cooling tank40and the transfer device20. The transfer device20is configured to drive the special fixture30to take out anode plates cast on the disc body11, place a qualified one of the anode plates in the cooling tank40, place an unqualified one of the anode plates on the waste plate rack60, lift the anode plate cooled in the cooling tank40, and place the cooled anode plate on the collection device50for stacking. In this way, by using the transfer device20, a chain conveyor, a lifting mechanism and other moving devices arranged in the tank in the related art may be eliminated, such that the structure is simplified, the anode plate has good cooling effect, small deformation, less oxidation, and improved quality. Moreover, since the transfer device20is a mature standardized product, which has high degree of intelligence, low failure rate, and less equipment maintenance. In addition, the number and position of the cooling tanks40, the collection devices50and the waste plate racks60may be adjusted modularly according to different sites and functional requirements, leading to more flexible arrangement and smaller space occupation compared with a traditional extractor. For example, the cooling tank40, the collection device50and the waste plate rack60may be located in a movement zone Z around the execution end of the transfer device20, and be conveniently adjusted in terms of quantity, placement position and placement angle as required to adapt to different site requirements and make a forklift travel more smoothly. According to the casting and outputting system1in some embodiments of the present application, the anode plate may be transferred reliably, and the equipment may have reduced space occupation, low failure rate and less maintenance cost. In some embodiments of the present disclosure, as shown inFIG.2, the special fixture30is flexibly connected to the transfer device20. For example, a flexible element70is arranged between the transfer device20and the special fixture30, such that the special fixture30is rotatable with respect to the transfer device20, thereby flexibly adapting to change in a position of the anode plate to be gripped within an error range. At the same time, the special fixture30performs a function of automatically centering the gripped anode plates, which improves the plate gripping reliability and the plate placing accuracy. In some embodiments of the present disclosure, as shown inFIG.2, a rotation angle between a connection flange of the transfer device20and a connection flange of the special fixture30ranges from 0° to 5°. In some embodiments of the present disclosure, as shown inFIG.1, a plurality of cooling tanks40are provided, and are spaced apart from each other. In this way, a plurality of the anode plates may be cooled simultaneously. In some embodiments of the present disclosure, as shown inFIG.1, the plurality of cooling tanks40are arranged in multiple rows on opposite sides of the transfer device20, a plurality of collection devices50are provided, and each row of the cooling tanks40corresponds to at least one of the collection devices50. For example, each row of the cooling tanks40is arranged on one of opposite sides of the transfer device20, and each row of the cooling tanks40corresponds to one of the collection devices50. The waste plate rack60is arranged between two collection devices50, resulting in a relatively compact structure and easy operation of the transfer device20. In some embodiments of the present disclosure, as shown inFIG.3, a plurality of disc bodies11are provided, each of the disc bodies11is provided with one cooling tank40, and the cooling tank40is provided with at least three anode plates spaced apart from each other. In this way, by placing a plurality of anode plates in the cooling tank40at intervals, the cooling effect may be ensured. Further, each anode plate is vertically arranged in the cooling tank40. In some embodiments of the present disclosure, as shown inFIG.1, a plurality of disc bodies11are provided, each of the disc bodies11is provided with a plurality of cooling tanks40, and each of the cooling tanks40is provided with one anode plate. In this way, a plurality of anode plates may be cooled at the same time, and the cooling effect of each anode plate is good. Further, the anode plate is horizontally or obliquely arranged in the cooling tank40to enhance the cooling effect. In some embodiments of the present disclosure, as shown inFIG.1andFIG.3, a plurality of disc bodies11are provided in one-to-one correspondence with a plurality of transfer devices20. Some specific embodiments according to the present disclosure will be described in detail below with reference to the accompanying drawings. Embodiment 1 As shown inFIG.1, in this embodiment, a transfer device20is arranged in front of a plate taking position Y of a disc body11. The transfer device20is a mechanical arm with a plurality of independent single-degree-of-freedom joints, which is a mature standardized product, and has high degree of intelligence, low failure rate, and less equipment maintenance. A special fixture30grips an anode plate in a manner of “waist holding”, that is, a middle part of a body of the anode plate is clamped by clamping arms provided on both sides of the anode plate, so as to ensure the stable gripping of the anode plate. Each disc body11is provided with four cooling tanks40, and the four cooling tanks40are respectively arranged on two sides of the transfer device20. Further, the four cooling tanks40are independent from each other, and each cooling tank40may be provided with at most one anode plate in any period of time, that is, each cooling tank40contains one anode plate cooling station. The four cooling tanks40may be configured to cool the anode plates alternately. After continuous and stable production of the casting machine10is achieved, the cooling time of the individual anode plates may be substantially the same, resulting in more stable cooling effect of the anode plate compared with a chain conveyor in a traditional tank where the cooling time of individual anode plates decreases one by one. In this way, in this embodiment, the four cooling tanks40are not provided with any moving parts, and the structure is simple, the cost of spare parts is low. It could be understood that the greater the number of the cooling tanks40, and the longer the cooling time of each anode plate, the better the cooling effect. In this embodiment, two collection devices50are respectively arranged outside the above four cooling tanks40and are independent from each other, and are configured to receive the cooled anode plates transferred by the transfer device20and the special fixture30from the individual cooling tanks40one by one. After the anode plates are collected and stacked, a whole stack of anode plates are taken away by a forklift. It could be understood that the greater the number of the collection devices50, the stronger the storage capacity, the less the dependence on the timeliness of forklift operation, and the more stable the system. At the same time, individual cooling tanks40and individual collection devices50are independent from each other, such that even if a certain device fails, other devices may also continue to run, and the equipment has high stability. Each disc body11is provided with one waste plate rack60, and the waste plate rack60is arranged between the above-mentioned two collection devices50for receiving unqualified anode plates transferred by the transfer device20and the special fixture30from the disc body11. In this way, the four cooling tanks40, the two collection devices50and the waste plate rack60are all arranged within a movement zone Z of the transfer device20. A working process of the casting and outputting system1according to this embodiment will be described below with reference toFIG.1. Assuming that each cooling station has no anode plates at the beginning, an anode plate A, an anode plate B, an anode plate C, . . . are respectively outputted in sequence from the plate taking position Y of the disc body11. S1: The transfer device20and the special fixture30grip the anode plate A from the plate position Y of the disc body11, and transfer it to a cooling tank40on the lower left side for cooling. S2: The transfer device20and the special fixture30grip a next anode plate B from the plate position Y of the disc body11, and transfer it to a cooling tank40on the lower right side for cooling. S3: The transfer device20and the special fixture30grip a next anode plate C from the plate position Y of the disc body11, and transfer it to a cooling tank40on the upper left side for cooling. S4: The transfer device20and the special fixture30grip the cooled anode plate A in the cooling tank40on the lower left side, and transfer it to a collection device50on the left side for stacking. S5: The transfer device20and the special fixture30grip a next anode plate D from the plate position Y of the disc body11, and transfer it to a cooling tank40on the upper right side for cooling. S6: The transfer device20and the special fixture30grip the cooled anode plate B in the cooling tank40on the lower right side, and transfer it to a collection device50on the right side for stacking. S7: As above, the transfer device20and the special fixture30alternately place the anode plates from the disc body11in individual cooling tanks for cooling, and transfer the cooled anode plates to the collection device50at a corresponding side. S8: If the anode plate from the plate taking position Y of the disc body11is unqualified, the transfer device20and the special fixture30directly grip the unqualified anode plate to place it on a waste plate rack60. S9: When the number of the anode plates stacked by the two collection devices50reaches a preset value, the whole stack of the anode plates is taken away by a forklift. S10: When the number of waste anode plates in the waste plate rack60reaches a preset value, the whole stack of waste anode plates is taken away by a forklift. Embodiment 2 As shown inFIG.3, in this embodiment, a transfer device20is arranged in front of a plate taking position Y of a disc body11. The transfer device20is a mechanical arm with a plurality of independent single-degree-of-freedom joints, which is a mature standardized product, and has high degree of intelligence, low failure rate, and less equipment maintenance. A special fixture30grips an anode plate in a manner of “lug gripping”, that is, the anode plate is gripped by lifting lugs on both sides of the anode plate through hooks provided on both sides of the anode plate. Each disc body11is provided with one cooling tank40, and the cooling tank40is provided with at least three anode plate cooling stations. The anode plates are alternately placed in the three anode plate cooling stations by the transfer device20for cooling. After continuous and stable production of the casting machine10is achieved, the cooling time of the individual anode plates may be substantially the same, resulting in more stable cooling effect of the anode plate compared with a chain conveyor in a traditional tank where the cooling time of individual anode plates decreases one by one. At the same time, the cooling tank40is provided with a simple carrier, which may support the lugs on both sides of the anode plate. That is, there are no moving parts in the cooling tank40, which has a simple structure and low cost of spare parts. It could be understood that the greater the number of the cooling stations in the cooling tank40, and the longer the cooling time of each anode plate, the better the cooling effect. In this embodiment, a collection device50is arranged outside each cooling tank40to receive the cooled anode plates transferred from the cooling tank40by the transfer device20and the special fixture30one by one. In this way, a whole stack of anode plates may be taken away by a forklift after the anode plates are stacked. Each disc body11is provided with one waste plate rack60, and the waste plate rack60is arranged outside the transfer device20. For example, the waste plate rack60and the cooling tank40are respectively located on the left and right sides of the transfer device20for receiving unqualified anode plates transferred from the disc body11by the transfer device20and the special fixture30. Other structures and operations of the casting and outputting system1according to some embodiments of the present disclosure are known to those skilled in the art, and will not be described in detail here. In the specification, it is to be understood that terms such as “central,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise” “axial,” “radial,” and “circumferential” should be construed to refer to the orientation as shown in the drawings under discussion. These relative terms are for convenience of description and do not require that the present disclosure be constructed or operated in a particular orientation, and thus cannot be construed to limit the present disclosure. In addition, terms such as “first” and “second” are used herein for the purpose of description and are not intended to indicate or imply relative importance or to imply the number of indicated technical features. Thus, the feature defined with “first” and “second” may comprise one or more of this feature. In the description of the present disclosure, “a plurality of” means two or more than two, unless specified otherwise. In the description of the present disclosure, “first feature” or “second feature” may include one or more of the feature. A structure in which the first feature is “above” or “under” the second feature may include an embodiment where the first feature and the second feature are in direct contact, and may also include an embodiment where the first feature and the second feature are not in direct contact but are in contact through another feature between them. A structure in which the first feature is “above”, “over” or “on” the second feature includes an embodiment where the first feature is directly above and obliquely above the second feature, or simply means that the first feature is at a height larger than the second feature. In the present disclosure, unless specified or limited otherwise, the terms “mounted,” “connected,” “coupled,” and the like are used broadly, and may be, for example, fixed connections, detachable connections, or integral connections; may also be mechanical or electrical connections; may also be direct connections or indirect connections via intervening structures; and may also be inner communications of two elements, which can be understood by those skilled in the art according to specific situations. Reference throughout this specification to “an embodiment,” “some embodiments,” “a specific example,” “an example,” or “some examples,” means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. Thus, the appearances of the phrases in various places throughout this specification are not necessarily referring to the same embodiment or example of the present disclosure. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples. Although explanatory embodiments have been shown and described, it would be appreciated by those skilled in the art that changes, alternatives, variations and modifications can be made in the embodiments without departing from principles and scope of the present disclosure. The scope of the present disclosure is defined by claims and equivalents thereof. | 17,718 |
11858035 | BEST MODE Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The embodiments are provided as example for those skilled in the art to be able to more clearly understand the spirit of the present disclosure. Accordingly, the present disclosure is not limited to the embodiments and may be achieved in other ways. Also, in the drawings, lengths, thicknesses, etc. of layers and regions may be exaggerated for convenient description. Throughout the drawings, the same reference numerals will refer to the same or like parts. FIG.1is a sectional view illustrating a semi-solid high pressure casting equipment having an electromagnetic vibration stirring device according to an embodiment of the present disclosure;FIG.2is an enlarged view of the section X ofFIG.1;FIG.3is a perspective view illustrating the electromagnetic vibration stirring device of the semi-solid high pressure casting equipment according to the embodiment of the present disclosure;FIG.4is a perspective view illustrating a magnetic field generating unit illustrated inFIG.3;FIG.5is a perspective view illustrating a section of an electromagnet coil of the magnetic field generating unit according to the embodiment of the present disclosure; andFIG.6illustrates images illustrating a molten metal to which a magnetic field has been applied using the electromagnetic vibration stirring device of the semi-solid high pressure casting equipment according to the embodiment of the present disclosure. Referring toFIGS.1to6, the semi-solid high pressure casting equipment10includes an upper mold12, a lower mold14, a sleeve16for injecting a molten metal A into the molds, and a plunger18. After the molten metal A is injected into the sleeve16having a cylindrical hollow portion, the plunger18pressurizes the molten metal A injected into the sleeve16while moving inside the sleeve16, causing the molten metal A to be forced into the mold. The molten metal A forced into a molding region between the upper mold12and the lower mold14is allowed to solidify for a predetermined period of time, and the casting operation is completed to produce a casting. The electromagnetic vibration stirring device100of the semi-solid high pressure casting equipment10according to the embodiment of the present disclosure is coupled to an outer peripheral surface of the sleeve16and is configured to control the structure of a semi-solid molten metal A by applying electromagnetic vibration to the molten metal A to suppress the generation of dendrites. In detail, the electromagnetic vibration stirring device100includes a casing110and the magnetic field generating unit120. The casing110has a ring shape and includes an inner wall112into which the sleeve is inserted and an outer wall114spaced apart from the inner wall112. In addition, to protect the magnetic field generating unit120located inside the casing110from outside, the casing110has a structure in which both upper and lower portions of the region between the inner wall112and the outer wall114are sealed. The casing110is made of a non-magnetic material so as not to interfere with a magnetic field generated by the magnetic field generating unit120. The magnetic field generating unit120is located between the inner wall112and the outer wall114of the casing110, and includes a plurality of electromagnets120radially arranged at equal intervals around the sleeve16in a circumferential direction of the sleeve16, each electromagnet120including a core122and a coil124surrounding the core122. The magnetic field generating unit120generates a magnetic field by applying a current to the electromagnets120in a clockwise or counterclockwise direction. The magnetic field causes each portion of the semi-solid molten metal A to be sequentially vibrated by the magnetic field along the circumferential direction of the sleeve16. When the magnetic flux of the magnetic field generated by the magnetic field generating unit120applies an impact to the inside of the molten metal A, a portion of the molten metal A is vibrated in a vertical direction, so that intermittent vibrational stirring in the vertical direction is achieved rather than rotational stirring. Therefore, without a rotational flow accompanied by turbulence with the semi-solid molten metal A, a vibrational flow accompanied by vibration of the molten metal A is generated, so that the microstructure of the semi-solid molten metal A is controlled by intermittent vibration of the molten metal A caused by the magnetic field impact. This prevents external air that may be introduced during rotational stirring by an electromagnetic field. The magnetic field generating unit120generates a magnetic field by applying a current to a pair of opposed electromagnets or a pair of non-adjacent electromagnets in the clockwise or counterclockwise direction. In detail, the magnetic field generating unit120generates a magnetic field sequentially in the circumferential direction by each pair of opposed electromagnets or each pair of non-adjacent electromagnets. For example, a pair of electromagnets124-1and124-4, a pair of electromagnets124-2and124-5, and a pair of electromagnets124-3and124-6generate respective magnetic fields by sequentially receiving a current in the counterclockwise direction. Alternatively, a pair of electromagnets124-1and124-3, a pair of electromagnets124-2and124-4, and a pair of electromagnets124-3and124-5generate respective magnetic fields by sequentially receiving a current in the counterclockwise direction. Therefore, the structure of the semi-solid molten metal A in the sleeve16is controlled by periodically applying vibration to the molten metal A. In other words, by applying a current to each pair of opposed electromagnets of the magnetic field generating unit120in accordance with the sequence of (a), (b), and (c) ofFIG.6, each magnetic field is sequentially generated around the semi-solid molten metal A. When a current is applied to a pair of opposed electromagnets located as illustrated in (a) for a predetermined period of time, the molten metal A is subjected to an impact of the generated magnetic field and vibrated as indicated by the arrowsWhen a current is then applied to a pair of opposed electromagnets located as illustrated in (b) for a predetermined period of time, the molten metal A is subjected to an impact of the generated magnetic field and vibrated as indicated by the arrowsIn other words, as the magnetic flux of the magnetic field applies an impact to the inside of the molten metal A as indicated by the arrowsanda portion of the molten metal A is stirred as it is vibrated, rather than rotated, intermittently and periodically in the vertical direction. In addition, as each magnetic field is sequentially applied along the circumferential direction of the sleeve16in the clockwise or counterclockwise direction, the molten metal A in the sleeve16is periodically vibrated and stirred more uniformly, so that the microstructure of the molten metal A is controlled. Furthermore, when a current is applied to the opposed electromagnets or the non-adjacent electromagnets for less than 0.5 seconds, rotational stirring may occur. To prevent the occurrence of this rotational stirring, it is preferable that a magnetic field is generated by applying a current for equal to or more than 0.5 seconds. In this case, it is preferable that one cycle has a time period of less than 20 seconds to efficiently apply a uniform magnetic force to the entire molten metal A. As described above, in the case of the casting method based on simultaneous application to the opposed or non- adjacent electromagnets of the plurality of electromagnets, a vibrational flow accompanied by vibration of the semi-solid molten metal A is achieved even when a magnetic field is generated, without a rotational flow accompanied by turbulence within the molten metal A. Therefore, the microstructure of the molten metal A is controlled by the vibration of the molten metal A caused by the magnetic field impact, thereby preventing external air that may be introduced during rotational stirring by the electromagnetic field. In addition, the amount of air contained in a billet is minimized and the generation and dispersion of nuclei are promoted, so that dendrite structures are refined and spheroidized, thereby minimizing the formation of internal voids. As a result, it is possible to produce a casting with a more stable quality compared to conventional microstructure control based on rotation. Similar to the casting method based on simultaneous application to the opposed or non-adjacent electromagnets of the plurality of electromagnets, a current is periodically applied to three electromagnets124-1,124-3, and124-5, a vibratory stirring effect may also be achieved. The electromagnets of the magnetic field generating unit120are arranged such that the respective cores122of the electromagnets are located perpendicular to the central axis of the sleeve16. In this case, the magnetic flux of the magnetic field generated by the magnetic field generating unit120and the sleeve16are located perpendicular to each other. Therefore, as an impact is applied to the molten metal A in the direction of the magnetic flux as illustrated inFIG.6, the molten metal A is vibrated and the microstructure thereof is controlled thereby. The magnetic field generating unit120includes a cooling channel124aformed in the coil124of each of the electromagnets. Therefore, cooling oil or cooling water flows directly along the inside of the coil124, thereby reducing the heat generated by the coil124even in the presence of a large magnetic field of equal to or greater than 400 Gauss. As a result, a magnetic field is generated without disconnection of the coil124, making it possible to continuously control the microstructure of the semi-solid molten metal A. The cooling channel124aformed inside the coil124is connected to an external cooling channel130to continuously receive cooling oil or cooling water, and the cooling oil or cooling water heated by absorbing the heat of the coil124is discharged to outside through the external cooling channel130. In addition, the magnetic field generating unit120generates a magnetic field of 500 to 1000 Gauss with respect to a center region of the sleeve16and applies a magnetic field impact to the molten metal A located in the sleeve16to control the microstructure. The magnetic field generating unit120includes the cores122radially arranged at equal intervals of 60 degree angles110on an inner surface of the outer wall114of the casing110. The respective coils124are coupled to the respective cores122by insertion fitting. Therefore, the coils124are detached and replaced at the end of their lifespan, thereby reducing equipment replacement costs. For insertion fitting, each of the plurality of electromagnets has an open structure. The sleeve16is made of HK40 steel or ceramic. The sleeve16made of a non-magnetic material such as HK40 steel or ceramic hardly absorbs a magnetic field even when a strong magnetic field is generated by the magnetic field generating unit120and minimizes a reaction such as vibration of the sleeve16. Therefore, in the case of the sleeve16made of a non-magnetic material, the microstructure of the molten metal A in the sleeve16is controlled, while the sleeve16does not interfere with the strength of the magnetic field generated by the magnetic field generating unit120. As a result, it is possible to produce a high-quality casting. As illustrated in the section X ofFIG.1, the electromagnetic vibration stirring device100of the semi-solid high pressure casting equipment10is located at a lower end or lower portion of the lower mold14of the semi-solid high pressure casting equipment10and is coupled to a lower portion of the sleeve16. Therefore, the electromagnetic vibration stirring device100is little affected by an impact on the upper mold12and the lower mold14during the manufacture of the casting, thereby protecting the magnetic field generating unit120against the impact. Hereinafter, the electromagnetic vibration stirring device of the semi-solid high pressure casting equipment according to the present disclosure will be described with reference to the following experimental examples. However, the following experimental examples are only illustrative and are not intended to limit the scope of the present disclosure. Crucible Manufacturing And Magnetic Field Measurement Area Setting For a vibration stirring experiment for the electromagnetic vibration stirring device of the semi-solid high pressure casting equipment according to the present disclosure, a crucible was manufactured using SUS304. The crucible was manufactured to have an upper diameter of 120 mm, a lower diameter of 72.5 mm, and a height of 260 mm. To compare magnetic field intensities for respective positions on the crucible, as illustrated inFIG.7, a vertical central axis of the crucible was set to X, a vertical axis passing through the crucible wall was set to Z (60 mm away from X), and a vertical axis at the 1/2 point between X and Z was set to Y. In addition, a horizontal central axis of the crucible was set to C, a horizontal axis passing through the top surface of the crucible was set to A, and a horizontal axis passing through the bottom surface of the crucible was set to E, a 1/2 horizontal axis between A and C was set to B (60 mm away upward from C), and a 1/2 horizontal axis between C and E was set to D (60 mm away downward from C). In addition, a central point where the horizontal central axis C and the vertical central axis X of the crucible meet was set to a, and a point where the horizontal central axis C and the vertical axis Y meet was set to β. Experimental Example 1—Magnetic Field Strength As Function Of Position On Crucible According To Applied Magnetic Field To measure a magnetic field strength as a function of a position on the crucible, currents of 20 A, 40 A, 60 A, 80 A, and 120 A were applied to the magnetic field generating unit of the electromagnetic vibration stirring device according to the embodiment of the present disclosure. After the magnetic field generating unit was placed on the outside of the crucible as illustrated inFIG.7, each of the currents was simultaneously applied to opposed electromagnets for 0.5 second. At this time, the application of the current was repeated periodically in the clockwise direction every 0.5 seconds, and the magnetic field strength was measured at points where the vertical axes X, Y, and Z and the horizontal axes A, B, C, D, and E meet. Experimental Example 2—Magnetic Field Strength 1 As Function Of Position On Crucible According To Magnetic Field Application Method In the same manner as in Experimental Example 1, a magnetic field was generated according to each current, after which a magnetic field strength as a function of a position on the crucible was measured. The measurement of the magnetic field strength was performed by applying each current to a pair of opposed electromagnets for 0.5 second and then to a next pair of opposed electromagnets located clockwise of the previous pair for 0.5 second. Experimental Example 3—Magnetic Field Strength 2 As Function Of Position On Crucible According To Magnetic Field Application Method The same procedure was performed as in Experimental Example 2, except that each current was applied to a pair of non-adjacent electromagnets in the counter clockwise direction. Experimental Example 4—Magnetic Field Strength 3 As Function Of Position On Crucible According To Magnetic Field Application Method The same procedure was performed as in Experimental Example 2, except that each current was applied to a pair of adjacent electromagnets in the counter clockwise direction. Experimental Example 5—Magnetic Field Strength 4 As Function Of Position On Crucible According To Magnetic Field Application Method In the same manner as in Experimental Example 1, a magnetic field was generated according to each current, after which a magnetic field strength as a function of a position on the crucible was measured. The measurement of the magnetic field strength was performed by sequentially applying each current to individual electromagnets in the counter clockwise direction. Experimental Example 6—Magnetic Field Strength 5 As Function Of Position On Crucible According To Magnetic Field Application Method In the same manner as in Experimental Example 1, a magnetic field was generated according to each current, after which a magnetic field strength as a function of a position on the crucible was measured. The measurement of the magnetic field strength was performed by randomly applying each current to individual electromagnets. Experimental Example 7—Magnetic Field Strength In Presence Or Absence Of Sleeve To compare magnetic field intensities in the presence or absence of the sleeve, each current was simultaneously applied to opposed electromagnets for 0.5 second both in the presence and in the absence of the sleeve made of HK40 steel. A magnetic field strength as a function of a position on the crucible was measured by periodically repeating the application of the current in the clockwise direction. Experimental Example 8—Cooling rate of molten metal as function of strength of applied magnetic field After placing the molten metal in the electromagnetic vibration stirring device according to the embodiment of the present disclosure, currents of 40 A, 60 A, 80 A, and 120 A were applied to the magnetic field generating unit in such a manner that each of the currents was simultaneously applied to opposed electromagnets for 0.5 second in the clockwise direction. A change in temperature per minute of the molten metal at the points α and β ofFIG.7was measured, and a deviation of a cooling rate of the molten metal was obtained. Result 1—Magnetic Field Strength As Function Of Position On Crucible According To Applied Magnetic Field FIG.8illustrates graphs illustrating a magnetic field strength as a function of a vertical position on the crucible according to applied currents, in which the magnetic field strength is measured at a center region, a 1/4 region, and an edge region of the crucible illustrated inFIG.7in a plane. InFIG.8, the results of Experimental Example 1 are illustrated. Referring toFIG.8, in the case of the center region of the crucible corresponding to the regions of the axes X and Y, as illustrated in (a) and (b), when the current strength was increased, i.e., when the strength of an applied magnetic field was increased, the magnetic field was increased in the regions of the axes B, C, and D inside the crucible. However, in the case of the crucible wall, as illustrated in (c), the strength of an applied magnetic field was larger than that of the regions of the axes X and Y, while the formation of the magnetic field is unstable as it goes from the center to the edge. Result 2—Magnetic Field Strength As Function Of Position On Crucible According To Magnetic Field Application Method FIG.9illustrates graphs illustrating a change in the magnetic field strength as a function of the vertical position on the crucible according to an electromagnet application method, in which the magnetic field strength is measured at the center region of the crucible in the plane;FIG.10illustrates graphs illustrating a change in the magnetic field strength as a function of the vertical position on the crucible according to the electromagnet application method, in which the magnetic field strength is measured at the 1/4 region of the crucible in the plane;FIG.11illustrates graphs illustrating a change in the magnetic field strength as a function of the vertical position on the crucible according to the electromagnet application method, in which the magnetic field strength is measured at the edge region of the crucible in the plane. InFIGS.9,10, and11, the results of Experimental Examples 2 to 6 are illustrated. In each figure, (a), (b), (c), (d), and (e) illustrate the change in the magnetic field strength of the regions of the horizontal axes A, B, C, D, and E, respectively. In the case of the vertical axes X and Y, a magnetic field in the case of simultaneous application to opposed electromagnets was the largest, and a magnetic field in the case of simultaneous application to non-adjacent electromagnets was the second largest. In addition, a magnetic field in the case of simultaneous application was larger than that in the case of independent application. In the case of simultaneous application to adjacent electromagnets, the magnetic field was canceled, indicating that the magnetic field was reduced compared to other simultaneous application methods. However, in the case of the vertical axis Z, i.e., the edge region, a magnetic field in the case of simultaneous application to adjacent electromagnets was the largest. This may indicate that the effect of an electric field due to the current in two adjacent cores and coils was stronger than that of the magnetic field due to the magnetic flux. In the vicinity of the two adjacent cores, electromagnetic forces generated from the cores are combined. Therefore, in the case of simultaneous application to adjacent electromagnets, a strongest electromagnetic force is generated at the edge region where electromagnetic forces generated from the adjacent electromagnets are combined to form a larger force, while a weakest electromagnetic force is generated at the center region and 1/4 regions. Result 3—Magnetic Field Strength In Presence Or Absence Of Sleeve The results of Experimental Example 7 are illustrated in Table 1 below. TABLE 1AppliedXYZcurrent (A)408012040801204080120AAbsence114222313118248335114220324Presence112198340128217328118248335BAbsence238466680271559859256486832Presence224456699271527767271559859CAbsence286508751370662972356659887Presence304533755352578930370662972DAbsence230417660265495708252540737Presence223411594243430660265495708 As can be seen in Table 1, the sleeve made of a non-magnetic material had little influence on a magnetic field generated by the magnetic field generating unit. That is, the sleeve made of a non-magnetic material could transmit a magnetic field to the molten metal in the sleeve without causing a reduction in the magnetic field strength or a deformation of the magnetic field generated by the magnetic field generating unit. Result 4—Cooling Rate Of Molten Metal As Function Of Strength Of Applied Magnetic Field FIG.12is a graph illustrating a cooling rate of a molten metal as a function of a strength of an applied magnetic field and a deviation of the cooling rate. InFIG.12, the results of Experimental Example 8 are illustrated. Referring toFIG.12, as the strength of the magnetic field increased after the application of the magnetic field, the deviation of the cooling rate for each position of the molten metal decreased. This indicates that as the strength of the applied magnetic field increased, the distribution in temperature of the molten metal became more uniform. The point α illustrated inFIG.7corresponds to (c) ofFIG.9, and the point β illustrated inFIG.7corresponds to (c) ofFIG.10. At these points, as illustratedFIGS.9and the magnetic field strength was in the range of 500 to 1000 Gauss. In addition, as illustrated inFIG.12, the cooling rate was in the range of 2.8 to 3.3° C./min, and the deviation of the cooling rate was in the range of 0.01 to 0.12. The peripheral regions of the points α and βillustrated inFIG.7correspond to (b) to (d) ofFIGS.9and Therefore, referring to the description of Result4andFIGS.9and10, when each pair of opposed electromagnets or each pair of non-adjacent electromagnets sequentially generates a magnetic field in the circumferential direction, a magnetic field in the range of 500 to 1000 Gauss was generated effectively at a relatively low current. In the case of the magnetic field in the range of 500 to 1000 Gauss, a current in the range of 80 to 120 A was applied. From all the results, when each pair of opposed electromagnets or each pair of non-adjacent electromagnets sequentially generated the magnetic field in the circumferential direction, or the magnetic field in the range of 500 to 1000 Gauss was generated, or the current in the range of 80 to 120 A was applied, an effective magnetic field could be generated at a relatively low current, the distribution in temperature of the molten metal could become uniform, and vibrational stirring of the semi-solid molten metal could be effectively performed. While the present disclosure has been described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the technical idea and scope of the present disclosure and such changes and modifications belong to the claims of the present disclosure. | 25,078 |
11858036 | DETAILED DESCRIPTION Turning now to the Figures, where the purpose is to describe preferred embodiments of the invention and not to limit same,FIGS.1-3Ashow a system10for transferring molten metal M into mold20. System10includes a furnace1A that can retain molten metal M, which includes a holding furnace1A, a vessel12, mold20, and a pump22. Using heating elements (not shown in the figures), furnace1A is raised to a temperature sufficient to maintain the metal therein (usually aluminum or zinc) in a molten state. The level of molten metal M in holding furnace1A and in at least part of vessel12changes as metal is added or removed to furnace1A, as can be seen inFIG.2. Furnace1A includes a furnace wall2having an archway3. Archway3allows molten metal M to flow into vessel12from holding furnace1A. In this embodiment, furnace1A and vessel12are in fluid communication, so when the level of molten metal in furnace1A rises, the level also rises in at least part of vessel12. It most preferably rises and falls in first chamber16, described below, as the level of molten metal rises or falls in furnace1A. This can be seen inFIG.2. Dividing wall14separates vessel12into at least two chambers, a pump well (or first chamber)16and a skim well (or second chamber)18, and any suitable structure for this purpose may be used as dividing wall14. As shown in this embodiment, dividing wall14has an opening14A and an optional overflow spillway14B (best seen inFIG.3), which is a notch or cut out in the upper edge of dividing wall14. Overflow spillway14B is any structure suitable to allow molten metal to flow from second chamber18, past dividing wall14, and into first chamber16and, if used, overflow spillway14B may be positioned at any suitable location on wall14. The purpose of optional overflow spillway14B is to prevent molten metal from overflowing the second chamber18, by allowing molten metal in second chamber18to flow back into first chamber16. Optional overflow spillway14B would not be utilized during normal operation of system10and is to be used as a safeguard if the level of molten metal in second chamber18improperly rises to too high a level. At least part of dividing wall14has a height H1(best seen inFIG.2A), which is the height at which, if exceeded by molten metal in second chamber18, molten metal flows past the portion of dividing wall14at height H1and back into first chamber16. In the embodiment shown inFIGS.1-3A, overflow spillway14B has a height H1and the rest of dividing wall14has a height greater than H1. Alternatively, dividing wall14may not have an overflow spillway, in which case all of dividing wall14could have a height H1, or dividing wall14may have an opening with a lower edge positioned at height H1, in which case molten metal could flow through the opening if the level of molten metal in second chamber18exceeded H1. H1should exceed the highest level of molten metal in first chamber16during normal operation. Second chamber18has a portion18A, which has a height H2, wherein H2is greater than at least H3, H4, and H5, described below. Second chamber18also has an opening18B (as can be best seen inFIG.2A) so during normal operation molten metal pumped into second chamber18at least partially fills mold20. Dividing wall14may also have a first opening14A that is located at a depth such that first opening14A is submerged within the molten metal during normal usage, and first opening14A is preferably near or at the bottom of dividing wall14. First opening14A preferably has an area of between 6 in.2and 24 in.2, but could be any suitable size. Further, dividing wall14need not have an opening if a transfer pump were used to transfer molten metal from first chamber16, over the top of wall14, and into second chamber18. Dividing wall14may also include more than one opening between first chamber16and second chamber18and first opening14A (or the more than one opening) could be positioned at any suitable location(s) in dividing wall14and be of any size(s) or shape(s) to enable molten metal to pass from first chamber16into second chamber18, and to at least partially fill mold20. Mold20is any structure or device for receiving molten metal from vessel12, in which the molten metal is ultimately cast into a usable form. Mold20may be either an open or enclosed structure of any suitable dimension or length, and may receive any suitable amount of molten metal, such as any amount between 500-5,000 lbs. Mold20may be positioned horizontally as shown, or be at any suitable orientation and be of any suitable size and shape. The inside of top24′ of mold20is preferably at a height H5, which is most preferably beneath height H2and above height H3. The mold20has an inside surface of bottom22′ at a height H4that is above height H3of second opening19. Conduit1000is a passageway preferably formed of ceramic, such as silicon dioxide, that connects second chamber18to mold20and places them in fluid communication with one another. Conduit1000has a first end1002, a second end1004, an outer wall1006, an inner wall1008, and a cavity1010. First end1002can be connected to second chamber18, and second end1004can be connected to feed opening28′ of mold20, in any suitable manner, such as by using cement. Conduit1000is preferably surrounded by an insulation1012. Molten metal pump22may be any device or structure capable of pumping or otherwise conveying molten metal, and may be a transfer, circulation or gas-release pump. Pump22is preferably a circulation pump (most preferred) or gas-release pump that generates a flow of molten metal from first chamber16to second chamber18through first opening14A. Pump22generally includes a motor24surrounded by a cooling shroud26, a superstructure28, support posts30and a base32. Some pumps that may be used with the invention are shown in U.S. Pat. Nos. 5,203,681, 6,123,523 and 6,354,964 to Cooper, and pending U.S. application Ser. No. 10/773,101 to Cooper. Molten metal pump22can be a constant speed pump, but is most preferably a variable speed pump. Its speed can be varied depending on the amount of molten metal in a structure such as a ladle or launder, as discussed below. If pump22is a circulation pump or gas-release pump, it is preferably (but not necessarily) at least partially received in opening14A in order to at least partially block opening14A in order to maintain a relatively stable level of molten metal in second chamber18during normal operation and to allow the level in second chamber18to rise independently of the level in first chamber16. Utilizing this system the movement of molten metal from one chamber to another and from the second chamber into a launder does not involve raising molten metal above the molten metal surface. As shown, part of base32(preferably the discharge portion of the base) is received in opening14A. Further, pump22may communicate with another structure, such as a metal-transfer conduit, that leads to and is received partially or fully in opening14A. Although it is preferred that the pump base, or communicating structure such as a metal-transfer conduit, be received in opening14A, all that is necessary for the invention to function is that the operation of the pump increases and maintains the level of molten metal in second chamber18so that the molten metal ultimately moves out of chamber18and into another structure. For example, the base of pump22may be positioned so that its discharge is not received in opening14A, but is close enough to opening14A that the operation of the pump raises the level of molten metal in second chamber18independent of the level in chamber16and causes molten metal to move out of second chamber18and into another structure. A sealant, such as cement (which is known to those skilled in the art), may be used to seal base32into opening14A, although it is preferred that a sealant not be used. Pump22is preferably a variable speed pump and its speed is increased or decreased according to the amount of molten metal in a structure, such as second chamber18, mold20and/or200. For example, if molten metal is being added to mold20, the amount of molten metal in the mold can be measured, a scale that measures the combined weight of the mold and the molten metal inside the mold or a laser to measure the surface level of molten metal in the mold. When the amount of molten metal in the mold is relatively low, pump22can be manually or automatically adjusted to operate at a relatively fast speed to raise the level of molten metal in second chamber18and cause molten metal to flow quickly out of second chamber18and ultimately into the mold20. When the amount of molten metal in the mold reaches a certain amount, that is detected and pump22is automatically or manually slowed and eventually stopped to prevent overflow of the mold. Utilizing system10, as pump22pumps molten metal from first chamber16into second chamber18, the level of molten metal in chamber18rises. When the level of molten metal M in second chamber18exceeds H3, the molten metal begins to flow out of opening18B and into the conduit1000. When the molten metal in chamber18exceeds level H4molten metal flows into the bottom22′ of mold20through feed opening28′. As the level of molten metal rises in chamber18to level H5, the cavity26′ of mold20eventually fills with molten metal. The level of molten metal in mold20may not be exactly the same as the level in second chamber18at all times because of different relative pressures of moving molten metal in chamber18versus moving it through conduit1000and into mold20. The pumping can then be adjusted to maintain a constant level of molten metal in conduit1000and mold20. Over a period, a solid metal skin forms at the bottom of the mold20between mold20and conduit1000. The pumping can then be reduced or stopped so molten metal retreats from second end1004of conduit1000. Mold20can be moved away from conduit1000when the molten metal inside mold20is sufficiently solid. Once pump22is turned off, the respective levels of molten metal level in chambers16and18essentially equalize. Alternatively, the speed of pump22could be reduced to a relatively low speed to keep the level of molten metal in second chamber18relatively constant. To fill another mold, pump22is simply turned on again and operated as described above. In this manner molds, can be filled efficiently with less turbulence and lags wherein there is too little molten metal in the system. Alternatively, as shown inFIGS.9-10, a pump22could be juxtaposed the first end1002of conduit1000, so molten metal exiting the pump outlet moves into the conduit1000through opening14A and moves into mold20through end1004of conduit1000. In this embodiment, the pumping force moves molten metal into the conduit1000and into the mold20. Therefore, the level of molten metal in the vessel in which pump22is positioned can be lower than mold20. In another embodiment, chamber18may have a stop wall that prevents molten metal from rising in the chamber18above a certain level. As the pump moves molten metal from chamber16into chamber18, the pressure in chamber18increases and molten metal moves into mold20through conduit1000. The Figures show the mold20being filled from the bottom. Mold20(or any mold according to this disclosure) could be filled from the side, preferably at the bottom of a side. The mold should be filled in such a way that there is little or no turbulence, and a solid metal skin can form between the mold and the conduit, so the mold with solid metal inside can be moved with no or little molten metal spilling from the space between the mold and the conduit. A system according to the invention could also include one or more pumps in addition to pump22, in which case the additional pump(s) may circulate molten metal within first chamber16and/or second chamber18, or from chamber16to chamber18, and/or may release gas into the molten metal first in first chamber16or second chamber18. For example, first chamber16could include pump22and a second pump, such as a circulation pump or gas-release pump, to circulate and/or release gas into molten metal M. A system according to this disclosure could also be operated with a transfer pump, although a pump with a submerged discharge, such as a circulation pump or gas-release pump, is preferred since either would be less likely to create turbulence and dross in second chamber18, and neither raises the molten metal above the surface of the molten metal bath nor has the other drawbacks associated with transfer pumps. If a transfer pump were used to move molten metal from first chamber16, over dividing wall14, and into second chamber18, there would be no need for opening14A in dividing wall14, although an opening could still be provided and used in conjunction with an additional circulation or gas-release pump. As previously described, regardless of what type of pump is used to move molten metal from first chamber16to second chamber18, molten metal would ultimately move out of chamber18and into a mold, such as mold20, when the level of molten metal in second chamber18exceeds H4. Another advantage of a system according to the invention is that a single pump could simultaneously feed molten metal to multiple (i.e., a plurality) of molds. The system shown includes a single pump22that causes molten metal to move from first chamber16into second chamber18, where it finally passes out of second chamber18and into either one or more molds20. FIGS.4-7show an alternative system100in accordance with the invention, which is in all aspects the same as system10except that system100includes a control system (not shown) and device58to detect the amount of molten metal M within a mold. The control system may or may not be used with a system according to the invention and can vary the speed of, and/or turn off and on, molten metal pump22in accordance with a parameter of molten metal M within a structure (such a structure could be a mold20, first chamber16, and/or the second chamber18). For example, if the parameter were the amount of molten metal in a mold, when the amount of molten metal M within the mold is low, the control system could cause the speed of molten metal pump22to increase to pump molten metal M at a greater flow rate to raise the level in second chamber18and ultimately fill the mold. As the level of the molten metal within the mold increases, the control system could cause the speed of molten metal pump22to decrease and to pump molten metal M at a lesser flow rate, thereby ultimately decreasing the flow of molten metal into the mold. The control system could be used to stop the operation of molten metal pump22when the amount of molten metal within a structure, such as the mold, reached a given value, such as weight, or if a problem was detected. The control system could also start pump22based on a given parameter. One or more devices58may be used to measure one or more parameters of molten metal M, such as the depth, weight, level and/or volume, in any structure or in multiple structures. Device58may be located at any position and more than one device58may be used. Device58may be a laser, float, scale to measure weight, a sound or ultrasound sensor, or a pressure sensor. Device58is shown as a laser to measure the level of molten metal inFIGS.4-5. The control system may provide proportional control, such that the speed of molten metal pump22is proportional to the amount of molten metal within a structure, such as mold20. FIG.7shows a control panel70that may be used with a control system. Control panel70includes an “auto/man” (also called an auto/manual) control72that can be used to choose between automatic and manual control. A “device on” button74allows a user to turn device58on and off. An optional “metal depth” indicator76allows an operator to determine the depth of the molten metal as measured by device58. An emergency on/off button78allows an operator to stop metal pump22. An optional RPM indicator80allows an operator to determine the number of revolutions per minute of a predetermined shaft of molten metal pump22. An AMPS indicator82allows the operator to determine an electric current to the motor of molten metal pump22. A start button84allows an operator user to start molten metal pump22, and a stop button84allows a user to stop molten metal pump22. A speed control86can override the automatic control system (if being utilized) and allows an operator to increase or decrease the speed of the molten metal pump. A cooling air button88allows an operator to direct cooling air to the pump motor. Some non-limiting examples of this disclosure are as follows: Example 1 A system for placing molten aluminum into a mold, the system comprising: (a) a vessel having a first chamber and a second chamber; a dividing wall separating the first chamber and the second chamber, the dividing wall having a first height H1and a first opening below the first height H1; wherein the second chamber has an outer wall comprising a second opening having a second height H2that is above the first opening; (b) a molten metal pump in the first chamber; (c) a mold outside of the vessel and above the second opening, the mold having a cavity, a bottom surface at a fourth height H4, a top surface with a fifth height H5, and a mold opening in communication with the cavity; and (d) a conduit leading from the second opening in the outer wall of the second chamber to the mold opening; wherein when the pump is operated it moves molten metal from the first chamber through the first opening and into the second chamber, and through the conduit and into the mold cavity. Example 2 The system of example 1, wherein the molten metal pump is a circulation pump. Example 3 The system of example 1, wherein the molten metal pump is a gas-release pump. Example 4 The system of example 1, wherein the molten metal pump has a pump housing with an outlet, and the outlet is positioned 6″ or less from the opening. Example 5 The system of example 1, wherein a bracket is connected to the dividing wall and the bracket is also connected to the molten metal pump and configured to maintain the molten metal pump in position in the first chamber. Example 6 The system of example 5, wherein the molten metal pump has a superstructure that is a metal platform, and the bracket is connected to the superstructure. Example 7 The system of example 1, wherein the vessel that includes the first chamber and the second chamber is a reverberatory furnace. Example 8 The system of example 1, wherein the pumping is stopped after a solid metal skin has formed. Example 9 The system of example 1, wherein the mold is moved after the solid metal skin has formed. Example 10 The system of example 1, wherein the first opening is between 6 in2and 24 in2. Example 11 The system of example 1, wherein the molten metal pump has a pump housing with an outlet, and the outlet is positioned at least partially in the opening. Example 12 The system of example 1, wherein the mold is comprised of ceramic. Example 13 The system of example 1, wherein the mold is comprised of silicon carbide. Example 14 The system of example 1, wherein there is no structure between the second chamber and the conduit. Example 15 The system of example 1, wherein the conduit is comprised of ceramic. Example 16 The system of example 1, wherein the conduit is comprised of silicon carbide. Example 17 The system of example 15, wherein there is no structure between the conduit and the mold. Example 18 The system of example 1 that includes a second molten metal pump in the second chamber. Example 19 The system of example 5, wherein the dividing wall has an upper edge and the bracket is on the upper edge. Example 20 The system of example 5, wherein the molten metal pump has a superstructure that is a metal platform, and the bracket is connected to the superstructure. Example 21 A system for transferring molten metal to a mold, the system comprising: (a) a vessel configured to hold molten metal; (b) a conduit in fluid communication with the vessel; (c) a molten metal pump in the vessel and an uptake chamber leading to an outlet that is at or above a mold; and (d) a conduit connecting the vessel to a mold. Example 22 The system of example 21, wherein the molten metal pump is a circulation pump. Example 23 The system of example 21, wherein the molten metal pump is a gas-release pump. Example 24 The system of example 21, wherein the conduit has an inner cross-sectional area of between 6 in2and 24 in2. Example 25 The system of example 21, wherein the molten metal pump has a housing and an outlet, and the outlet is positioned 6″ or less from a first end of the conduit. Example 26 The system of example 21, wherein a bracket is connected to a wall and the bracket is also connected to the molten metal pump and configured to maintain the molten metal pump in position relative the first end of the conduit. Example 27 The system of example 21, wherein the conduit is comprised of ceramic. Example 28 The system of example 21, wherein the conduit is comprised of silicon carbide. Example 29 The system of example 21, wherein the conduit is covered by an insulator. Example 30 The system of example 21, wherein there is no structure between the vessel and the conduit. Example 31 The system of example 21, wherein the mold is comprised of ceramic. Example 32 The system of example 31, wherein the mold is comprised of silicon carbide. Example 33 The system of example 26, wherein the dividing wall has an upper edge and the bracket is on the upper edge. Example 34 The system of example 26, wherein the molten metal pump has a superstructure that is a metal platform, and the bracket is connected to the superstructure. Example 35 The system of example 1, wherein the pump is a variable speed pump. Example 36 A method for placing molten aluminum into a mold utilizing a system comprising: (a) a vessel having a first chamber and a second chamber; a dividing wall separating the first chamber and the second chamber, the dividing wall having a first height H1and a first opening below the first height H1; wherein the second chamber has an outer wall comprising a second opening having a second height H2that is above the first opening; (b) a molten metal pump in the first chamber; (c) a mold outside of the vessel and above the second opening, the mold having a cavity, a bottom surface at a fourth height H4, a top surface with a fifth height H5, and a mold opening in communication with the cavity; and (d) a conduit leading from the second opening in the outer wall of the second chamber to the mold opening; wherein the method comprises the following steps: (a) operating the pump to move molten metal from the first chamber through the dividing wall and into the second chamber; (b) operating the pump until the mold is at least partially filled with molten metal; and (c) allowing a skin to form over the mold opening, wherein the skin is sufficiently durable so as to prevent the flow of molten metal out of the cavity through the mold opening. Example 37 The method of example 36, wherein the pumping is not continuous. Example 38 The method of example 36, wherein the pumping is performed by a transfer pump. Example 39 The method of example 36, wherein the dividing wall includes an opening positioned below H1. Example 40 The method of example 36, wherein the pumping is performed by a circulation pump. Example 41 The method of example 36, wherein the pumping is performed by a gas-release pump. Example 42 The method of example 36 further comprising the step of measuring an amount of molten metal within one or more of the vessel and the mold. Example 43 The method of example 42 that further comprises the step of adjusting the speed of the molten metal pump in response to the measured amount. Example 44 The system of example 1, wherein the molten metal pump has a base configured to be received partially in the first opening of the dividing wall. Example 45 The method of example 21, wherein the pump has a pump base and a discharge, and the dividing wall has an opening to permit molten metal to be pumped from the first chamber through the first opening and into the second chamber, the discharge being aligned with the first opening so that at least some of the molten metal exiting the discharge passes through the first opening. Example 46 The method of example 1 that further comprises the step of adjusting the speed of the pumping according to the amount of molten metal in the mold. Example 47 The method of example 1 that further comprises the step of adjusting the speed of the pumping according to the amount of molten metal in the vessel. Having thus described different embodiments of the invention, other variations and embodiments that do not depart from the spirit thereof will become apparent to those skilled in the art. The scope of the present invention is thus not limited to any particular embodiment, but is instead set forth in the appended claims and the legal equivalents thereof. Unless expressly stated in the written description or claims, the steps of any method recited in the claims may be performed in any order capable of yielding the desired product or result. | 25,387 |
11858037 | DETAILED DESCRIPTION Turning now to the figures, wherein the purpose is to describe an embodiment of this disclosure and not to limit same, a smart molten metal pump system10can include a molten metal circulation pump, gas-injection (or gas-release) pump, or transfer pump. Currently, most molten metal pumps use a variable frequency drive (“VFD”) to control the speed of the pump. An operator controls the pump speed based on observing various operating parameters. A smart pump system10as disclosed uses a program logic controller (“PLC” or “controller”)170and human machine interface (“HMI”) for additional functionality and feedback. It optionally utilizes SCADA (supervisory control and data acquisition) hardware/software with a GE IFIX75tag for remote monitoring of the pump22, such as from an office at an aluminum processing facility. A computer500for accessing and monitoring data received by the controller170, and/or controlling the pump22, may be located at an operator's location, such as at an office at the processing facility. The controller170may also be accessible by a hand-held device510such as a cellular phone. Further, the controller170may also be accessible by a computer520at the pump manufacturer's facility. Any suitable wired or wireless connection between a computer500, hand-held device510, manufacturer's computer520, and the controller, such as an Ethernet connection, may be utilized. The pump's operational and input information can also be stored over time for troubleshooting: the pump22, the vessel in which the pump22operates, other vessels, and/or the operational system and method used at the processing facility in which the pump22is located. The measured inputs (or “inputs”) to the controller170are one or more of: (1) the molten metal temperature in one or more vessels (such as the furnace pump well, a launder and/or a ladle); (2) the depth (or level) of the molten metal in one or more of the afore-mentioned vessels, which could be measured in any suitable manner, such as by a laser measuring device or float; (3) the vibration of the pump22, or of a pump component (such as the drive shaft42or rotor100), by a vibration sensor at any suitable location on the pump; (4) the weight of molten metal in a structure, such as a mold or ladle; and (5) pump speed, pump load, and other information. The controller170may also include the date the pump22was installed and maintenance history for the pump22. The controller170may control the speed of the pump22, turn the pump22on, turn the pump22off, and/or send a signal to an operator, based on one or more of the measured inputs. For example, if shaft42breaks, a vibration sensor would detect it and turn the pump22off. The controller170can also be programmed to develop a relationship between two or more of the inputs, e.g., two or more of: temperature of the molten metal, level of the molten metal, vibration, speed of the pump, and pump load. When a furnace or other vessel is charging (which means adding solid aluminum to the molten metal in a vessel), or when the molten metal temperature is relatively low or dropping in a vessel, the pump22should generally run faster to increase the solid metal melt rate and/or molten metal mixing rate. The pump22can be slowed when the measured temperature is proper and/or a vessel is not being charged with solid aluminum. Utilizing a slower speed when a higher speed is not necessary increases the life of pump components such as the rotor shaft42and rotor100. Some benefits of the teachings of this disclosure are one or more of: (1) increased production from an existing molten metal processing vessel; (2) increased solid metal melting efficiency; (3) more uniform temperature distribution in a vessel; (4) longer component life for the pump; and (5) less time required of a human operator. Thermocouples in the drawings are designated by the letter “T” followed by a numeral. Vibration sensors are designated by the letter “V” followed by a numeral. Molten metal level detectors are designated by the letter “D” followed by a numeral. Scales are designated by the letter “W” followed by a numeral. Referring now to the drawings where the purpose is to illustrate and describe non-limiting embodiments of this disclosure,FIG.1shows system10having a molten metal pump22that includes a rotor (also called an “impeller”)100. Pump22may be positioned in molten metal M in a pump well, which may be part of the open well of a reverberatory furnace. Exemplary Molten Metal Pump The components of exemplary pump22, including rotor100, that are exposed to the molten metal are preferably formed of structural refractory materials, which are resistant to degradation in the molten metal. Pump22can be any structure or device for pumping or otherwise conveying molten metal, and may be an axial pump having an axial, rather than tangential, discharge. Molten metal pump22can be a constant speed pump but is most preferably a variable speed pump. Its speed can be varied depending on any of one or more of the amount or temperature, of molten metal in a structure, such as a furnace, ladle or launder, or whether solid metal scrap must be melted, or the pump vibration, or of other inputs to controller170. Preferred pump22has a pump base (also called a “casing” or “housing”)24for being submersed in a molten metal bath. Pump base24preferably includes a generally nonvolute pump chamber26, such as a cylindrical pump chamber or what has been called a “cut” volute, although pump base24may have any suitable shape pump chamber, including a volute-shaped pump chamber. Pump chamber26may be constructed to have only one opening, either in its top or bottom, if a tangential discharge is used, since only one opening is required to introduce molten metal to enter pump chamber26. Generally, pump chamber26has two coaxial openings of the same diameter and usually one is blocked by a flow blocking plate mounted on the bottom of, or formed as part of, rotor100. As shown, pump chamber26includes a top opening28, bottom opening29, and wall31. Base24, in this embodiment, further includes a tangential discharge30in fluid communication with pump chamber26. A preferred base24has sides112,114,116,118and120and a top surface110. The invention is not limited to any particular type or configuration of base, however. A pump base used with the invention could be of any suitable size, design or configuration. The top portion of wall31is machined to receive a bearing surface, which (in this Figure) is not yet mounted to wall31. The bearing surface is typically comprised of ceramic and cemented to wall31. One or more support post receiving bores126are formed in base24and are for receiving support posts34. As shown inFIG.2, pump base24can have a stepped surface40defined at the periphery of pump chamber26at inlet28and a stepped surface40A defined at the periphery of inlet29. Stepped surface40preferably receives a bearing ring member60and stepped surface40A preferably received a bearing ring member60A. Each bearing member60,60A is preferably comprised of silicon carbide, although any suitable material may be used. The outer diameter of members60,60A varies with the size of the pump, as will be understood by those skilled in the art. Bearing members60,60A each has a preferred thickness of 1″. Preferably, bearing ring member60is provided at inlet28and bearing ring member60A is provided at inlet29, respectively, of pump base24. Alternatively, bearing ring members60,60A need not be used. In the preferred embodiment, bottom bearing ring member60A includes an inner perimeter, or first bearing surface,62A, that aligns with a second bearing surface and guides rotor100as described herein. It is most preferred that a bearing surface with one or more grooves, such as the surface on bearing member150described herein be utilized. Additionally, rotor100may include a bearing ring, bearing pin or bearing members, such as the ones disclosed in U.S. Pat. No. 6,093,000 to Cooper One or more support posts34connect pump base24to a superstructure36of pump22thus connecting superstructure36to pump base24. In a preferred embodiment, post clamps35secure support posts34to superstructure36. Any suitable structure or structures capable of connecting superstructure36to pump base24may be used. Additionally, pump22could be constructed so there is no physical connection between the base and the superstructure. The motor, drive shaft and rotor could be suspended without a superstructure, and there need not be a pump base. A motor40, which can be any structure, system or device suitable for driving pump22, but is preferably an electric or pneumatic motor, is positioned on superstructure36and is connected to a first end of a drive shaft42. Motor40preferably is at least partially surrounded by a cooling shroud41. Some pumps that may be used with the invention are shown in U.S. Pat. Nos. 5,203,681, 6,123,523, and 6,354,964 to Cooper. A drive shaft42can be any structure suitable for connecting motor40to rotor100, and for rotating rotor100. Drive shaft42preferably comprises a motor shaft42A coupled by a coupling43to a rotor shaft44. The motor shaft42A has a first end and a second end, wherein the first end of the motor shaft42A is connected to motor40and the second end of the motor shaft42A is connected to coupling43. Rotor shaft44has a first end44A and a second end44B, wherein the first end44A is connected to the coupling43and the second end44B is connected to rotor100. One preferred rotor100is sized to fit through both openings28and29, although it could be of any suitable shape or size suitable to be used in a molten metal pump. The preferred dimensions of rotor100will depend upon the size of pump22because the size of a rotor invention varies with the size of the pump and on manufacturer's specifications. Rotor100can be comprised of a single material, such as graphite or ceramic, or can be comprised of different materials. For example, inlet structure104may be comprised of ceramic and the displacement structure102may be comprised of graphite, or vice versa. Any part or all of rotor100may also include a protective coating. As rotor100is rotated by drive shaft42, displacement structure102and inlet structure104rotate. Thus, in the preferred embodiment, rotor blades102A,102B and102C and inlets106A,106B and106C rotate as a unit. Exemplary System Turning toFIGS.4-8, an exemplary smart pump system10′ for moving molten metal M onto a raised structure20, such as a launder, as shown. This exemplary system10′ includes a furnace1that can retain molten metal M, which in this embodiment includes a holding furnace1A, a vessel12, raised structure20, and pump22. Vessel12is divided by a dividing wall14to separate vessel12into at least a first chamber16and a second chamber18. Pump22generates a stream of molten metal from first chamber16into second chamber18. In system10′, pump22is preferably a circulation pump (most preferred) or gas-release pump that generates a flow of molten metal from first chamber16to second chamber18through an opening14A. Using heating elements (not shown in the figures), furnace1is raised to a temperature sufficient to maintain the metal therein (usually aluminum or zinc) in a molten state. The level of molten metal M in holding furnace1A and in at least part of vessel12changes as metal is added or removed to furnace1A, as can be seen inFIG.2. For explanation, furnace1includes a furnace wall2having an archway3. Archway3allows molten metal M to flow into vessel12from holding furnace1A. In this embodiment, furnace1A and vessel12are in fluid communication, so when the level of molten metal in furnace1A rises, the level of molten metal also rises in at least part of vessel12. It most preferably rises and falls in first chamber16, described below, as the level of molten metal rises or falls in furnace1A. This can be seen inFIG.5. As previously mentioned, dividing wall14separates vessel12into at least two chambers, a pump well (or first chamber)16and a skim well (or second chamber)18, and any suitable structure for this purpose may be used as dividing wall14. As shown in this embodiment, dividing wall14has planar sides, a top edge, an opening14A, and an optional overflow spillway14B (best seen inFIG.6), which is a notch or cut out in the upper edge of dividing wall14. Overflow spillway14B is any structure suitable to allow molten metal to flow from second chamber18, past dividing wall14, and into first chamber16and, if used, overflow spillway14B may be positioned at any suitable location on wall14. The purpose of optional overflow spillway14B is to prevent molten metal from overflowing the second chamber18, or a launder20in communication with second chamber18(if a launder is used with the invention), by allowing molten metal in second chamber18to flow back into first chamber16. Optional overflow spillway14B would not be utilized during normal operation of system10and is to be used as a safeguard if the level of molten metal in second chamber18improperly rises to too high a level. In the embodiment shown inFIGS.4-8, overflow spillway14B has a height H1and the rest of dividing wall14has a height greater than H1. Alternatively, dividing wall14may not have an overflow spillway, in which case all of dividing wall14could have a height H1, or dividing wall14may have an opening with a lower edge positioned at height H1, in which case molten metal could flow through the opening if the level of molten metal in second chamber18exceeded H1. H1should exceed the highest level of molten metal in first chamber16during normal operation. Second chamber18has a portion18A, which has a height H2, wherein H2is less than H1(as can be best seen inFIG.7) so during normal operation molten metal pumped into second chamber18flows past wall18A and out of second chamber18rather than flowing back over dividing wall14and into first chamber16. Dividing wall14may also have an opening14A that is located at a depth such that opening14A is submerged within the molten metal during normal usage. Opening14A preferably has an area of between 6 in.2and 24 in.2but could be any suitable size. The opening14A is preferably entirely below the level that is 50% of the height, or 40% of the height, or 30% of the height, or 20% of the height, of dividing wall14. Further, dividing wall14need not have an opening if a transfer pump were used to transfer molten metal from first chamber16, over the top of wall14, and into second chamber18as described below. Dividing wall14may also include more than one opening between first chamber16and second chamber18, and opening14A (or the more than one opening) could be positioned at any suitable location(s) in dividing wall14and be of any size(s) or shape(s) to enable molten metal to pass from first chamber16into second chamber18. Utilizing system10, as pump22pumps molten metal from first chamber16into second chamber18, the level of molten metal in chamber18rises. A system according to this disclosure could also include one or more pumps in addition to pump22, in which case the additional pump(s) may circulate molten metal within first chamber16and/or second chamber18, or from chamber16to chamber18, and/or may release gas into the molten metal first in first chamber16or second chamber18. For example, first chamber16could include pump22and a second pump, such as a circulation pump or gas-release pump, to circulate and/or release gas into molten metal M. If pump22is a circulation pump or gas-release pump, it may include a snout on the pump base that is at least partially received in opening14A in order to help maintain a relatively stable level of molten metal in second chamber18during normal operation and to allow the level in second chamber18to rise independently of the level in first chamber16. The snout could be connected in opening14A to form a tight seal. As shown inFIGS.4-8, raised structure20in this embodiment is a launder. If raised structure20is a launder, it may be either an open or enclosed channel, trough or conduit, and may be of any suitable dimension or length, such as one to four feet long, or as much as 100 feet long or longer. The launder may be completely horizontal or may slope gently upward or downward. The launder may have one or more taps (not shown), i.e., small openings stopped by removable plugs. Each tap, when unstopped, allows molten metal to flow through the tap into a ladle, ingot mold, or other structure. The launder may additionally or alternatively be serviced by robots or cast machines capable of removing molten metal M from the launder. In this embodiment, launder20has a first end20A and a second end20B. An optional stop may be included in a launder20juxtaposed the second end20B. If launder20has a stop, the stop can be opened to allow molten metal to flow past end20B or closed to help prevent molten metal from flowing past end20B. FIG.8shows an alternate system10′ that is in all respects the same as system10except that it has a shorter, downward, sloping launder20′, wall18A′ past which molten metal moves when it exits second chamber18, and it fills a ladle52. Exemplary Smart Pump/System Features An exemplary smart pump system10or10′ according to this disclosure includes pump22, and a controller170for controlling the speed of the pump, and further includes one or more of: (1) one or more thermocouples (which could be any device for measuring temperature) to measure molten metal temperature at one or more locations; (2) one or more devices (referred to herein sometimes as a “depth device”), such as a laser or float, to measure the depth (or level) of molten metal in one or more structures; and (3) one or more vibration sensors, such as an accelerometer(s), to measure vibration of the pump and/or one or more pump components, such as the rotor100and/or rotor shaft44. The controller170receives a measured input (or “input” or “communication”) from one or more of: (a) the thermocouple(s) about the temperature of the molten metal at one or more locations; (b) the depth device(s) about the depth (or level) of the molten metal at one or more locations; and (c) the vibration sensor(s) about the vibration of the pump, and/or of one or more pump components. The controller may also receive input about one or more of: the pump speed, pump load, the length of time the pump has been operating, prior maintenance performed on the pump, and the weight of molten metal in structures, such as a launder, mold, or other vessel. The controller can analyze the one or more inputs to turn the pump on, to vary the speed of the pump, to turn the pump off, and/or send messages to an operator. The thermocouple(s) is preferably configured to be positioned at a location in which it is under the surface of the molten metal when the molten metal pump is operating. The thermocouple may be positioned in a support post, pump base, rotor, or rotor shaft of the molten metal pump and housed so that it is not directly exposed to molten metal. As shown in the example in the Figures, there is a thermocouple T1mounted in a support post34, a thermocouple T2mounted in base24, a thermocouple T3mounted in rotor100, a thermocouple T4positioned in second chamber18, a thermocouple T5positioned in vessel1, and a thermocouple T6positioned in a side wall of launder20. Controller170may receive input from one or more of these thermocouples, and/or from one or more other thermocouples positioned at different locations. The system10may also include one or more depth devices. As shown in the example, there is a depth device D1on the pump superstructure36that measures the depth (or level) of molten metal in the vessel (which for D1is the level of molten metal in first chamber16) in which molten metal pump22is positioned. A depth device D2is positioned above launder20and may be mounted on a side wall of launder20and measures the level of molten metal in the launder20. A depth device D3is positioned above vessel1and may be mounted on a side wall of vessel1and measures the level of molten metal in vessel1. A depth device D4is above ladle52and measures the level of molten metal in ladle52. Controller170may receive input from one or more of the depth devices, and/or from other depth devices positioned at different locations. The system10may also include one or more vibration sensors. A vibration sensor, which may be an accelerometer, V1is shown in this example as being positioned on drive shaft44. A vibration sensor V2is shown as being positioned in rotor100. Controller170may receive input from one or more of the vibration sensors, and/or from other vibration sensor(s) positioned at different locations. The system may also include one or more weight sensors, which may be scales, to measure the weight of molten metal in one or more structures. In the example shown, there is a weight sensor W1that measures the weight of molten metal in ladle52. A weight sensor W2measures the weight of molten metal in molds52′ on a fill line. Controller170may receive input from one or more of the weight sensor(s), and/or from weight sensor(s) positioned at different locations. All the pump information can optionally be shared to a user's computer500or hand-held electronic device510, so the user can view it at his/her office, at home, or any remote location. The pump operational and input information can also be stored over time, for troubleshooting the pump, the vessel in which the pump operates, and/or the operational system and method used at the processing facility. In addition, software can make it possible for a computer520at the pump manufacturer to remotely access the controller170in order to troubleshoot or modify the operation of pump22. Exemplary Controller FIGS.10-13show a controller,170which could function with any system according to this disclosure. The controller170may be positioned on the superstructure36or be remote to the pump22and communicate through a wired or wireless connection with the pump and sensors described herein. The controller170may vary the speed of, and/or turn off and on, molten metal pump22, or send a message to an operator, in accordance with any of the inputs. For example, if the input was the amount of molten metal in a ladle (as measured by any device, such as a scale or laser), when the amount of molten metal M within the ladle is low, the controller170could cause the speed of molten metal pump22to increase to pump molten metal M at a greater flow rate to fill the ladle. As the level of the molten metal within the ladle increased, the controller could cause the speed of molten metal pump22to decrease and to pump molten metal M at a lesser flow rate, thereby decreasing the flow of molten metal into the ladle. The controller170could be used to stop the operation of molten metal pump22should the amount of the molten metal within a structure, such as a ladle, reach a given value or if a problem were detected. The control system could also start pump22based on a given input. The controller may provide proportional control, such that the speed of molten metal pump22is proportional, or varied, according to one or more of: (1) the amount (or level) of molten metal within one or more vessels; (2) the temperature of molten metal within one or more vessels; (3) the amount of solid aluminum being added to one or more vessels; (4) the weight of molten metal in one or more vessels; (5) the vibration of the pump of one or more pump components, (6) the pump speed; and (7) the pump load. The controller could be customized to provide a smooth, even flow of molten metal to one or more structures such as one or more ladles or ingot molds with minimal turbulence and little chance of overflow. FIG.13shows a control panel70that may be used with a controller. Controller170includes an “auto/man” (also called an auto/manual) control172that can be used to choose between automatic and manual control. A “device on” button174allows a user to turn any sensors or inputs on and off. An optional “metal depth” indicator176allows an operator to determine the depth of the molten metal as measured by the depth devices. An emergency on/off button178allows an operator to stop metal pump22. An optional RPM indicator180allows an operator to determine the number of revolutions per minute of rotor100of molten metal pump22. An AMPS indicator182allows the operator to determine an electric current to the motor of molten metal pump22. A start button184allows an operator user to start molten metal pump22, and a stop button185allows a user to stop molten metal pump22. A speed control186can override the automatic controller170(if being utilized) and allows an operator to increase or decrease the speed of the molten metal pump22. A cooling air button190allows an operator to direct cooling air to the pump motor. Some non-limiting examples of this disclosure are as follow: Example 1: A molten metal pump system comprising:a controller for controlling the speed of the pump;a thermocouple positioned in one of the base, support post, rotor, or rotor shaft, wherein the thermocouple is configured to measure the temperature of molten metal in which the pump is positioned and communicate the temperature to the controller;a laser mounted on the superstructure, the laser configured to measure the depth of molten metal in the vessel and to communicate the depth to the controller;wherein the controller varies the speed of the pump based on the temperature of the molten metal and the depth of the molten metal in the vessel. Example 2: The molten metal pump system of example 1 that comprises a circulation pump. Example 3: The molten metal pump system of example 1 that comprises a gas-release pump. Example 4: The molten metal pump system of example 1 that comprises a gas-release pump that releases gas directly into the pump chamber. Example 5: The molten metal pump system of example 1 that comprises a transfer pump. Example 6: The molten metal pump system of example 1 that comprises a transfer pump that has a riser tube comprising a first end connected to the pump base and a second end connected to a launder. Example 7: The molten metal pump system of example 1 that further comprises a vibration sensor on one or more of the rotor shaft, the superstructure, and the rotor, wherein the vibration sensor is configured to detect vibration and communicate the vibration to the controller. Example 8: The molten metal pump system of example 7, wherein the controller is programmed with a maximum vibration level and the controller is configured to turn off the molten metal pump system if the maximum vibration level is exceeded. Example 9: The molten metal pump system of any of examples 1-8, wherein the controller is remote to the pump. Example 10: The molten metal pump system of any of examples 1-8, wherein the controller is on a superstructure of the pump. Example 11: The molten metal pump system of any of examples 1-10, wherein the thermocouple is in an enclosed box that is configured to be positioned beneath the molten metal when the molten metal pump system is positioned in a molten metal bath, so the thermocouple does not contact the molten metal. Example 12: The molten metal pump system of any of examples 1-11, wherein there is an insulating material between the superstructure and the laser. Example 13: The molten metal pump system of any of examples 1-12, wherein the thermocouple is positioned in the vessel and is remote from the pump. Example 14: The molten metal pump system of any of examples 1-13, wherein the communication from the thermocouple to the controller is wireless. Example 15: The molten metal pump system of any of examples 1-14, wherein the communication from the laser to the controller is wireless. Example 16: The molten metal pump system of example 7, wherein the communication from the vibration sensor to the controller is wireless. Example 17: The molten metal pump system of example 1 that further comprises a display that shows one or more of: a measured temperature of the molten metal, a measured depth of the molten metal, a vibration level of the molten metal pump, a load on the pump, and a speed of the molten metal pump. Example 18: The molten metal pump system of any of examples 1-17, wherein the controller comprises a memory that stores an operational history of the molten metal pump. Example 19: The molten metal pump system of any of examples 1-18, wherein the controller can be accessed from a remote location. Example 20: The molten metal pump system of example 19, wherein the controller can be re-programmed from the remote location. Example 21: The molten metal pump system of example 7 or 16, wherein the vibration sensor is an accelerometer. Example 22: The molten metal pump system of any of examples 1-21, wherein there is an insulating material configured to be between the superstructure and a molten metal bath when the molten metal pump is in a molten metal bath. Example 23: The molten metal pump system of any of examples 1-22, wherein the controller: varies the speed of the pump, turns off the pump, and/or sends a message to a monitor or operator, based on (a) the temperature of the molten metal, (b) the depth of the molten metal, and/or (c) the vibration of the pump. Example 24: The molten metal pump system of any of examples 1-23, wherein the controller is further configured to receive one or more of the pump speed and pump load and wherein the controller: varies the speed of the pump, turns off the pump, and/or sends a message to a monitor or operator, based on (a) the temperature of the molten metal, (b) the depth of the molten metal measured, (c) the speed of the pump, and/or (d) the pump load. Example 25: The molten metal pump system of any of examples 1-24 that further comprises a second thermocouple in the vessel and remote to the pump, the second thermocouple being in communication with the controller. Example 26: The molten metal pump system of any of examples 1-25 that further comprises a second depth device mounted and configured so as to measure the depth of molten metal in a second vessel, the second depth device being in communication with the controller. Example 27: The molten metal pump system of any of examples 1-26 that further comprises a scale that measures the weight of molten metal in a structure and communicates the weight to the controller. Example 28: The molten metal pump system of any of examples 1-27 that further comprises a second vibration sensor on or in a pump structure that does not include the vibration sensor. Example 29: The molten metal pump system of example 26, wherein the second vessel is a ladle, a launder, a mold, or a reverberatory furnace. Example 30: The molten metal pump system of example 27, wherein the structure is a ladle or a mold. Example 31: The molten metal pump system of example 28, wherein the vibration sensor is on the pump shaft and the second vibration sensor is in the rotor. Having thus described different embodiments of the invention, other variations and embodiments that do not depart from the spirit thereof will become apparent to those skilled in the art. The scope of the present invention is thus not limited to any particular embodiment, but is instead set forth in the appended claims and the legal equivalents thereof. Unless expressly stated in the written description or claims, the steps of any method recited in the claims may be performed in any order capable of yielding the desired product or result. | 31,649 |
11858038 | DESCRIPTION OF THE PREFERRED EMBODIMENTS For the additive manufacture of a component1, composite particles2are provided in a process step S1. The composite particles2each comprise metallic and/or vitreous and/or ceramic substrate particles3which adhere to one another by means of a two-phase binder4. The two-phase binder4in turn comprises an additive5in the form of a plasticizer, which can be dissolved by means of a solvent6, and a thermoplastic polymer7, which is insoluble in the solvent6. The composite particles2have a fluidity or flowability defined by a Hausner factor HRin accordance with VDI Guideline VDI 3405 sheet 1 (version: October 2013), wherein the Hausner factor HRis such that: 1≤HR≤1.5, in particular 1≤HR≤1.4, in particular 1≤HR≤1.3. Furthermore, the composite particles2in each case have a minimum dimension Aminand a maximum dimension Amax. At least 80%, in particular at least 90%, in particular at least 95%, of a volume-based, cumulative distribution Q3of the composite particles2obeys: 0.005 mm≤Amax≤0.3 mm, in particular 0.008 mm≤Amax≤0.2 mm, in particular 0.01 mm≤Amax≤0.1 mm. The volume-based, cumulative distribution Q3of the composite particles2as a function of a dimension A is shown by way of example inFIG.5. Furthermore, the composite particles2are substantially spherical, so that at least 80%, in particular at least 90%, in particular at least 95%, of a volume-based, cumulative distribution of the composite particles2obeys: 0.6≤Amin/Amax≤1, in particular 0.7≤Amin/Amax≤1, in particular 0.8≤Amin/Amax≤1. The substrate particles3are in each case present in a proportion of from 40% by volume to 70% by volume, in particular from 45% by volume to 65% by volume, in particular from 50% by volume to 60% by volume, in the composite particles2. The substrate particles3in each case have a maximum dimension Bmax, wherein at least 80%, in particular at least 90%, in particular at least 95%, of a volume-based, cumulative distribution of the substrate particles3obeys: 1 μm≤Bmax≤50 μm, in particular 5 μm≤Bmax≤40 μm, in particular 10 μm≤Bmax≤30 μm. The substrate particles3are held together by the two-phase binder4and thus form the pulverulent composite particles2. The binder4has a melt viscosity of from 10° Pa·s to 106Pa·s, in particular from 10° Pa·s to 105Pa·s, in particular from 10° Pa·s to 104Pa·s at a temperature which is at least 10° C. above a temperature TS, wherein the temperature TSis in the case of an amorphous structure of the binder4the glass transition temperature and in the case of a partially crystalline binder4is the crystallite melting temperature of the binder4. The determination of the melt viscosity is carried out in accordance with DIN EN ISO 3219 (version: October 1994) and in particular at a shear rate selected from the group consisting of 1.00 s−1, 2.50 s−1, 5.00 s−1, 10.0 s−1, 25.0 s−1, 50.0 s−1and 100 s−1. The indicated values of the melt viscosity apply, in particular, at a shear rate of 1.00 s−1. In the two-phase binder4, the thermoplastic polymer7is present in a proportion of from 10% by weight to 70% by weight, in particular from 15% by weight to 50% by weight, in particular from 20% by weight to 40% by weight, and the plasticizer5is present in a proportion of from 30% by weight to 90% by weight, in particular from 50% by weight to 85% by weight, in particular from 60% by weight to 80% by weight. The binder4can optionally contain additional additives. The thermoplastic polymer7is selected from the group consisting of polycondensates, polymerizates, polyadducts and thermoplastic elastomers. The plasticizer5is an ester of an aromatic hydroxybenzoic acid, preferably a fatty alcohol ester of p-hydroxybenzoic acid, with a length of the carbon chain preferably being in the range C12-C26, in particular in the range C18-C22. The plasticizer5serves to adjust the melt viscosity and the rheological properties of the binder4. The composite particles2are, for example, produced by subjecting a suspension composed of the substrate particles3and an alcoholic medium in which the binder4has been dissolved to spray drying. The composite particles2are provided by means of an apparatus8for the additive manufacture of a shaped part9. For this purpose, the apparatus8has a base body10which has a flat surface11running in a horizontal x direction and in a horizontal y direction. A reservoir recess12is formed in the base body10and together with a plate13which can be moved in a vertical z direction gives a reservoir space14for the composite particles2. The reservoir space14is open in the direction of the surface11. The composite particles2are provided in the reservoir space14. The pulverulent composite particles2are also referred to as feedstock powder. The x, y and z directions form a Cartesian coordinate system. Next to the reservoir recess12in the x direction there is a construction recess15provided in the base body10. The construction recess15extends in the x direction and the y direction and defines a construction field. A construction base body16which can be moved in the z direction is arranged in the construction recess15. The construction base body16is preferably configured as construction platform. The construction recess15and the construction base body16bound a construction space17which is open in the direction of the surface11. In a process step S2, a first layer L1of composite particles2is applied to the construction base body16by means of an application device18. The application device18is arranged above the surface11in the z direction and conveys composite particles2provided into the construction space17. For this purpose, the application device18has, for example, a doctor blade19which extends in the y direction and can be moved in the x direction along the surface11. To apply the first layer L1, the plate13is firstly moved in the z direction so that a desired amount of the composite particles2is present above the surface11. The doctor blade19is subsequently moved in the x direction so that the doctor blade19carries along the composite particles2located above the surface11and conveys them into the construction space17and distributes them uniformly there. The movement of the plate13, the doctor blade19and the construction base body16is controlled by means of a control device20. The first layer L1is applied in a thickness D which is determined by the distance of the construction base body16from the surface11. In a process step S3, the binder4of the composite particles2in the first layer L1is selectively melted, so that a first shaped part layer F1is formed. The first layer L1is closest to the surface11in this process step and forms a construction region. The construction region is heated to a temperature TBby means of heating elements23. The temperature TBin the construction region is such that: 20° C.≤TB≤TS, in particular 20° C.≤TB≤120° C., in particular 25° C.≤TB≤100° C., in particular 30° C.≤TB≤80° C. TSis in the case of an amorphous structure of the binder4the glass transition temperature or in the case of a partially crystalline or crystalline structure of the binder4the highest crystallite melting temperature of the binder4. The selective melting is carried out by means of electromagnetic radiation R, in particular by mean of laser radiation. The electromagnetic radiation R is generated by means of an electromagnetic radiation source21and directed by means of a mirror device22onto the construction field. The mirror device22allows the electromagnetic radiation R striking the construction field to be moved in the x direction and the y direction. To produce the first shaped part layer F1, the electromagnetic radiation R is moved in the x direction and/or the y direction according to the shaped part9to be produced. The electromagnetic radiation R melts the binder4, so that the binder4spreads between the substrate particles3and on solidification forms the solid first shaped part layer F1. In a process step S4, a further layer L2of composite particles2is applied in the above-described manner to the previously applied layer L1. For this purpose, the plate13is moved in the z direction so that a desired amount of composite particles2is present above the surface11and can be transported by means of the application device18to the construction space17. To apply the layer L2, the construction base body16is lowered by the thickness D in the z direction, so that the composite particles2can be distributed uniformly and homogeneously on top of the previously applied layer L1. In a process step S5, the binder4of the composite particles2in the layer L2are selectively melted in the above-described manner by means of the electromagnetic radiation R, so that a further shaped part layer F2is produced. The molten binder4spreads between the substrate particles3and holds these together after solidification of the binder4. The thickness D of the applied layers L1, L2is such that: 0.05 mm≤D≤0.3 mm, in particular 0.07 mm≤D≤0.25 mm, in particular 0.09 mm≤D≤0.2 mm. The process steps S4and S5are repeated until the shaped part9has been additively manufactured in the desired way. InFIG.3, three layers L1, L2and Lnand three shaped part layers F1, F2and Fnwhere n=3 are depicted by way of example. As an alternative, it is possible for a layer or a plurality of layers of composite particles2firstly to be applied before the binder4is melted by means of the electromagnetic radiation R and a solid first shaped part layer F1is formed. The shaped part9is in this case arranged on at least one layer which has not been melted. In a process step S6, the shaped part9is taken out from the composite particles2which have not been melted and out of the construction space17and cleaned. The shaped part9is also referred to as green part. In a process step S7, the shaped part9is subjected to chemical binder removal. For this purpose, the shaped part9is dipped into a vessel24filled with the solvent6. This is shown inFIG.6. Acetone, for example, serves as solvent6. The solvent6dissolves the plasticizer5out from the shaped part9, while the thermoplastic polymer7is insoluble and remains in the shaped part9. The shaped part9acquires a microporous structure as a result of the removal of the plasticizer5. The solvent6has a temperature TL. The temperature TLis such that: 20° C.≤TL≤100° C., in particular 25° C.≤TL≤80° C., in particular 30° C.≤TL≤60° C. From 30% to 100%, in particular from 50% to 90%, in particular from 60% to 80%, of the plasticizer5is removed from the shaped part9by means of the solvent6. After the chemical binder removal, the shaped part9is also referred to as brown part. After a time Δt0, the chemical binder removal is stopped and the shaped part9is taken from the solvent6. The time Δt0is dependent on the component geometry and in particular is proportional to the square of the wall thickness of the shaped part9. In a process step S8, the shaped part9is, after the chemical binder removal, subjected to thermal binder removal and subsequently sintered in a process step S9. The thermal binder removal and the sintering are carried out by means of a heating device under inert gas atmosphere or in a reducing atmosphere or in the high vacuum. To effect thermal binder removal, the shaped part9is brought to a first temperature T1. The first temperature T1is such that: 300° C.≤T1≤900° C., in particular 400° C.≤T1≤800° C., in particular 550° C.≤T1≤750° C. In the thermal binder removal, the binder4, i.e. the thermoplastic polymer7and optionally residual plasticizer5, is burnt out from the shaped part9at the first temperature T1and the binder4is thus thermally removed. Here, the substrate particles3partly form sintering necks, so that the shaped part9is held together despite removal of the thermoplastic polymer7. Owing to the microporous structure of the shaped part9, thermal binder removal occurs quickly and uniformly. The thermal removal of the binder4is carried out over a time Δt1. The time Δt1is dependent on the component geometry and in particular is proportional to the square of the wall thickness of the component1to be produced. The time Δt1is preferably selected so that at least 95%, in particular at least 99%, in particular at least 99.9% of the binder4is removed. The shaped part9is subsequently brought, in the process step S9, to a second temperature T2which is higher than the first temperature T1. Sintering of the shaped part9occurs at the temperature T2. The second temperature T2is such that: 600° C.≤T2≤2400° C., in particular 800° C.≤T2≤2200° C., in particular 1100° C.≤T2≤2000° C. Sintering is carried out for a time Δt2. The time Δt2is dependent on the component geometry and in particular is proportional to the square of the wall thickness of the component1to be produced. The time Δt2is preferably so long that no relevant change in a porosity of the component1can be achieved by subsequent further sintering. The sintering is preferably carried out until the porosity P obeys: 0.01≤P≤0.15, in particular 0.03≤P≤0.12, in particular 0.05≤P≤0.09. After sintering, at least 90%, in particular at least 95%, in particular at least 99.9%, of the binder4has been removed from the shaped part9. The additively manufactured component1is present after sintering. The component1is, dependent on the use of metallic and/or vitreous and/or ceramic substrate particles3, composed of metal and/or glass and/or ceramic. In an interior25of the component, the component1has closed pores26. At a component surface27, the component1has open pores28. The component1has a microporous structure which is such that at least 80%, in particular at least 85%, in particular 90%, of the pores26,28have a maximum dimension dmaxin the range from 1 μm to 100 μm, in particular from 10 μm to 80 μm, in particular from 20 μm to 60 μm. The component1has a porosity P which is defined as the ratio of a pore volume to a component volume. The component volume comprises the material volume and the volumes of the closed pores26. The porosity P is such that: 0.01≤P≤0.15, in particular 0.03≤P≤0.12, in particular 0.05≤P≤0.09. Owing to their shape, the open pores28at the component surface27at least partly form undercuts29. For example, the open pores28have a droplet-like shape extending from the component surface27, so that these pores widen in the direction of the interior25of the component and form the undercuts29. Owing to the open pores28, the component surface27has a surface roughness rZ. The surface roughness rZis such that: 5 μm≤rZ≤200 μm, in particular 10 μm≤rZ≤120 μm, in particular 15 μm≤rZ≤100 μm. The surface roughness rZis defined in accordance with DIN EN ISO 4287 (version: October 1998) and is measured by the profile method in accordance with DIN EN ISO 4288 (version: April 1998). While specific embodiments of the invention have been shown and described in detail to illustrate the application of the principles of the invention, it will be understood that the invention may be embodied otherwise without departing from such principles. | 15,068 |
11858039 | DETAILED DESCRIPTION This specification describes methods for fabricating multi-material composite structures using colloidal metal-based ink, formed from metal powder, and direct ink writing method. The colloidal metal ink includes rheological and viscoelastic properties (e.g., shear-thinning behavior, viscosity, storage modulus, or yield strength) for use with a direct ink writing (or printing) process to produce multi-material (e.g., metal-ceramic) composite parts with custom structural architecture at ambient conditions. The colloidal metal ink can include a silica-based binder. The silica-based binder can serve as an adhesive to hold the grains in the metal matrix of the printing powder under ambient conditions. In some implementations, the metal-ceramic composite structure includes a copper-graphene composite structure. In some implementations, the metal-ceramic composite structure includes a copper-iron composite structure. The described approach forms a colloidal metal ink suitable for the direct ink printing process with a shear-thinning behavior and a desired apparent viscosity, which facilitates the extrusion of the ink through a printing nozzle without high printing pressure. In addition, the colloidal metal ink has appropriate viscoelastic properties (e.g., high storage modulus and yield strength) that allow the deposited ink layer to maintain its filamentary shape after extrusion from the printing nozzle. Using the direct ink writing process allows the printing process to be a separate step from the post-processing step (e.g., a fusion of metal powder by sintering) which enables the opportunity for 3D printing of multi-material metal parts. FIG.1is a schematic view of an example of direct ink printing equipment100including a 3D printed composite structure102. The direct ink printing method is an extrusion-based process that offers rapid fabrication of complex structures by deposition of colloidal inks in a layer-by-layer approach. The layer-by-layer approach allows the printing of 3D structures with improved properties and functionality. The direct ink printing method can be compatible with a wide range of materials such as polymers, ceramics, metals, composites, and combinations thereof. The direct ink printing method uses 3D printer100(e.g., Hyrel3D 30M system), at room temperature, to fabricate 3D composite structures102by depositing colloidal metal-based ink104. The 3D printer100includes a cold flow syringe head106(e.g., SDS-30 Extruder) to extrude the ink104layer-by-layer and form the 3D composite structure102at ambient conditions. The 3D printer100is attached to a pressure controller108via an air pressure pipe110that pressurizes the syringe head106to deposit the ink104. The ink104is deposited on a substrate112(e.g., rubber-lined glass plate) that facilitates ease of post structure removal from the print bed. The substrate112is placed on a moving stage114that can move in x, y, and z-directions. Prior to printing, the user uses software (e.g., Slic3r based on a G-code script) to generate a specific printing job. The printing job can include a print pattern and geometry, layer height, extrusion width, printing speed, and printing orientation. The display screen116shows the printing job in progress. In operation, a multilayer deposition such as the composite structure102can include loading the ink104then printing layer-by-layer until the final layer is deposited. In some implementations, the composite structure102is a copper composite structure. In some implementations, the composite structure102is a metal-ceramic composite structure such as a copper-graphene composite structure. In some implementations, the composite structure102is a metal-ceramic composite structure such as a copper-iron composite structure. FIGS.2A-2Cshow methods136,164, and190for fabricating various composite structures144,170, and194. As illustrated, in method136a pure copper composite structure144is printed using the direct ink writing method. Copper is a widely used material in many applications due to its excellent properties such as malleability, high corrosion resistance, and excellent electrical and thermal conductivities. However, the printing of pure copper using common printing techniques (e.g., selective laser melting (SLM), selective electron beam melting (SEBM), direct laser fabrication (DLF), and laser metal deposition (LMD)) can be a challenge because copper can cause thermal issues due to its high conductivity and optical reflectivity leading to delamination, layer curling during printing, and final part failure. Method136demonstrates printing of pure copper structure144initially by designing a viscoelastic ink with rheological characteristics suitable for the direct ink printing process. The design of the viscoelastic ink includes combining proper ratios of copper powder (available from Sigma-Aldrich, USA) and a binding agent—laponite (or layered synthetic nanoclay with chemical formulation Si8Mg5.45Li0.4O24Na0.7 available from BYK, USA). Then the solid constituents (i.e., the metal powder and the binding agent) and water were mixed with Planetary Centrifugal Mixer (AR 230, Thinky, USA, Inc.) at a speed of 2000 revolutions per minute (rpm) for 4 minutes (138). Three 440-type stainless steel balls, ¼-inch in diameter, were used during the mixing of the ink to create a uniform ink solution. To achieve a high-resolution 3D printing green part of the copper composite structure, the metal ink needs to uniformly extrude through the nozzle without cutoff and particle jamming during the printing process. The binding agent (e.g., laponite) prevents particle jamming in the nozzle and the separation of metal and water under pressure. The uniform ink solution was loaded in a 30-milliliter (mL) syringe (e.g., Luer-lock) and vibrated to remove air bubbles before printing and prevent discontinuity in the printed layer. Smooth-flow tapered tips (e.g., Nordson EFD) were used to reduce the effect of clogging and printing discontinuity during the dispensing of the ink through the syringe. The printer 3D is triggered and printing of the copper part layer-by-layer is initiated at ambient conditions (140). After printing, the structure was stored at room temperature until the water evaporates to obtain a robust structure. Once the water evaporates fully the copper composite structure is taken to a sintering station (e.g., an oven) and sintered at the right temperature and environment depending on the metal powder under sintering (142). For example, in this method, the copper-based structure144is sintered at 950° C. to reach a fully copper part. As illustrated, the metal ink printing procedure (140) of the copper composite structure144is fully separated from the sintering step (142) of the copper composite structure144. The resulting structure of the printing step (140) is called a part in a green state which requires sintering to fuse the metal particles together and create a fully dense part144. Creating a viscoelastic ink that includes properties adequate for use in the direct ink printing method is an important step in fabricating printed composite structures at ambient conditions. In this example, the copper composite structure144was printed using a 1.6 mm tapered nozzle, with a 2.5 cm length, 2.5 cm width, 2 cm height, and approximately 40 layers. Using the described approach multi-material composite structures can also be printed. Methods164and190show steps for printing copper-iron composite structure170and copper-graphite composite structure194. Methods164and190follow the same steps described in reference to method136. The exception is preparing and mixing two different inks and loading the inks into two different syringes. In some implementations, the method164uses more than two inks for example three, four, five, six, ten, and more. In method164, a copper-based ink and an iron-based ink were prepared using the steps described in reference to method136. The copper-based ink was loaded in a first syringe and the iron-based ink was loaded in the second syringed. As illustrated, the two syringes print in an alternating fashion where the first syringe takes a turn to print a first copper layer then it stops and the second syringe takes a turn to print the second iron layer and the process continues till the final part is created (168). In method190, the steps are the same as those described in reference to method164except the second syringe is loaded with a graphene-based ink. As illustrated, the two syringes print in an alternating fashion where the first syringe takes a turn to print a first copper layer then it stops and the second syringe takes a turn to print the second graphene layer and the process continues till the final part is created (192). The described methods136,164, and190show the possibility of printing copper-based dense composite structures which is not attainable using other printing methods. FIGS.3A-3Fare scanning electron micrographs (SEMs)214,234,254,274, and294with an elemental map314of the printed copper structure144using the method136described in reference toFIG.2A. Scanning electron microscopy (SEM) (e.g., FEI Quanta 400) with 20 kV accelerating voltage was used to observe the morphology of the printed copper structure144. The SEM images214,234,254,274, and294of the printed copper structure144show uniform distribution and bonding of the particles in different magnification. SEM image234shows a polished (top part) and an unpolished (bottom part) of the printed copper surface. SEM images254,274, and294show grain size of copper particles between 10 and 20 microns and high-quality fusing of the particles together after sintering. The fusing of the particles together is also a result of the presence of the silica-based binding agent. Using an energy-dispersive (EDS) detector an elemental map distribution314confirmed the presence of the silica-based binding agent in the final printed copper part144. The presence of silicon elements shown with map314corresponds to the nanoclay in the printed part. The overlay of silica (Si), which is the main element of nanoclay, indicates the uniform distribution of nanoclay in the copper ink. The nanoclay binds to the copper particles and keeps them together yielding a self-supporting solid structure. The nanoclay remains among the copper particles even after sintering. The selection of the right binding agent plays an important role in the performance of the final product and the rheological properties of the printing ink. FIGS.4A-4Eare charts334,354,374,394, and395showing the overall properties of a copper-based ink and a printed copper structure144. Charts334and354illustrate the rheological properties of an unmodified copper-based ink (i.e., without a binding agent) and a copper-based ink (i.e., with a binding agent) as described earlier in reference toFIG.2. The rheological properties were measured using a Couette geometry rheometer with a stress-strain controller (e.g., MCR 302, available from Anton Parr, Austria). Flow and viscosity curves for both inks were obtained with strain-rate controlled measurements at shear rates between 100 s and 0.001 s. Oscillatory amplitude sweeps were performed at an angular frequency of 1 Hz with a strain between 0.01 and 10%. Chart334shows that the viscosity of the modified copper-based ink (i.e., with a binding agent) is two orders of magnitude greater than the viscosity of the unmodified copper-based ink (i.e., without a binding agent) which also shows a shear-thinning behavior. The unmodified and modified copper-based inks have a viscosity of 1.75 Pa-s and 1.28 Pa-s at the shear rate of 100 s−1, respectively. At a lower shear rate (˜1 s−1), the unmodified copper ink displays a viscosity of ˜43 Pa-s while the modified copper ink shows a viscosity of ˜322 Pa-s, which is approximately seven times higher than the viscosity of the unmodified ink. Chart354shows the storage and loss modulus of both inks as a function of oscillatory strain. The modified copper-based ink has a relatively higher storage modulus compared to the unmodified copper-based ink. The higher storage modulus allows the printed structures to maintain their structural integrity right after printing. For copper layers to be printed on top of one another the copper ink should have a large storage modulus to retain the filamentary shape after extrusion from the nozzle and tolerate the weight of the top layer without deformation. The modified copper ink exhibits a significantly higher storage modulus (G′) than a loss modulus. The addition of the binding agent in the modified copper-based ink gives a storage modulus of around 17.9 kPa at a low strain of 0.1% and a loss modulus of 1.1 kPa. A loss tangent (tan δ) measurement is an additional evaluation parameter used for the viscoelastic analysis of materials and the comparison between viscous and elastic material behavior. The loss tangent (tan δ) measurement is the relative dissipation or the ratio of G″/G′, related by a phase angle. For the modified copper-based ink, the loss tangent value is less than unity at low oscillation strain, indicating a more solid-like (or elastic) response of the ink and thus it facilitates the filamentary shape retention while exiting the printing nozzle. The printed copper structure144is also evaluated for the amount of density it retains as printed with respect to its theoretical density (e.g., between 77 and 88%). Using current methods for printing copper where selective sintering burns the binding agent result in printed copper parts with low density. The sintered copper parts are porous and have a density lower than the theoretical density of copper (e.g., between 77 and 88%). Using direct ink printing with adequate ink as described can result in pure copper printed structure with increased density and reduced porosity. In this example, the relative density of the printed copper structure144, using the described approach, is measured at 94.25% after sintering based on ASTM B923 standards. The 94.25% relative density is based on a theoretical value of 8.96 gcm-3. In some implementations, the relative density of the printed copper structure is determined based on the grain size of the copper powder used. As illustrated in chart374, structural characterization using X-ray diffraction (XRD) shows a matching pick pattern for the 3D printed copper structure144and the copper powder used before printing to make the ink. The matching patterns indicate that the printing and the sintering steps do not affect the structure and the properties of the final part. The printed copper structure144also shows improved electrical properties. The electrical conductivity of the copper structure is an important element for many applications such as electrical circuits, heating elements, and electrodes. As illustrated inFIG.4D, chart394shows electrical resistance measurements of the printed copper structure144under heating at different temperatures. For example, the resistivity of the 3D printed copper structure144was measured approximately 2×10−6Ωcm at room temperature which is relatively close to the resistivity measured 1.72×10−6Ωcm of a bulk copper sample. The resistivity measurements indicate that the conductivity of the printed copper structures using the direct ink writing method has 86% conductivity based on the International Annealed Copper Standards guidelines. The small reduction (approximately 14%) in electrical conductivity of the printed copper part is a result of the presence of the binding agent. The binding agents are usually insulating materials and can act as potential barriers in the electronic conduction path of the final printed parts. However, the selection of the right binder is what makes printing of multi-material composite structures possible. Chart395shows the mechanical performance (stress-strain curve) of printed copper structures with different geometric shapes such as cylindrical and rectangular. For example, to reduce the geometric effect on the printed copper part a cylindrical shape with a height to diameter ratio of 1.35 was printed and tested under uniaxial test. The resulting stress-strain curve is divided into three regions: elastic region (with a linear region strain of less than 5%), plastic region (with a strain between 5 and 15%), and densification region or increased density region (with a strain of greater than 15%). The printed copper structure is porous so it is densified like a foam under a high strain test. Additionally, the printing path direction can have a significant effect on the mechanical properties of the final printed part. Chart395shows the high mechanical performance of the printed copper structure when the force is applied perpendicular to the direction of the printing path. In this example, the printed copper structure under the perpendicular test has a rectangular shape with dimensions 10×10×15 mm. FIGS.5A-5Gare scanning electron micrographs414and434with elemental maps454,474,494,514showing topography and mechanical performance534of a printed copper-iron composite structure170using method164(direct ink writing technique). SEM images414and434of the printed copper-iron composite structure170show a formation of robust interface bonding415between copper and iron at different magnifications which is not attainable using other printing methods. Elemental maps454,474,494,514in the vicinity of the copper-iron show the presence of copper (Cu), iron (Fe), magnesium (Mg), and silica (Si) intensity in the same region. This indicates that a string bonding interface forms between copper and iron but each printed layer still maintains structural integrity with its own properties due to the presence of a binder that remains in the final printed part170even after sintering at 1000° C. is completed. Using the described approach with adequate ink allows printing of multi-material structures with performance improvements in user-definable locations. For example, building a multilayer copper-iron composite structure includes alternating layers of a soft material (e.g., copper) and a hard material (e.g., iron) which provide a better combination of strength, hardness, corrosion resistance, and ductility than each individual material alone. The direct ink printing method allows the printing of composite structures with defined properties at a target location based on the application. The materials that create the composite structure include metals powders with a similar range of sintering temperatures to prevent a thermal mismatch between the printed layers. In some implementations, the materials include different sintering temperatures but the grain size of the powder and the sintering conditions are adjusted to achieve a robust final printed composite part. The uniaxial compression test on copper-iron composite structure170also shows high interface strength between the two materials. Chart534shows compression test was applied parallel to the Cu—Fe interface. The stress-strain curve under compression test indicates that the copper-iron composite structure170has an elastic region of 2.5% strain and reaches a yield point above 100 MPa. The results in chart534show that copper-iron composite structure170has similar behavior to that of pure copper and strong interface bonding that does not detach during the mechanical test of the printed part. The uniaxial compressive and tensile tests for all parts were performed at ambient temperature using a universal testing machine (Instron ElectroPlus model E3000, USA). The uniaxial testing includes positioning of all samples between two crossheads and compressed at a constant rate of 2 mm-s−1. At least five samples of the same kind were tested for consistency of the data. FIGS.6A-6Eare SEM images554,574,594,614, and chart634showing comparative behavior and topography of a printed copper structure144vs. printed copper-graphene composite structure194. As illustrated in chart634, the tensile stress-strain curve indicates that the printed copper-graphene composite structure194is more ductile compared to the printed copper structure144. The SEM images594and614show uniform grain distribution in the printed copper-graphene composite structure194which is a sign of good ductility compared to the SEM images554and574showing sharp edges analogous to plastic deformation and reduced ductility of the printed copper sample144. The presence of an adequate binding agent facilitates printing of ductile copper-graphene composite structure194. In this example, 3% by weight of the binder was added to the printing graphene ink. FIGS.7A-7Dare visual images654(before the test),674(after test front view), and694(after test back view) showing the behavior of a printed copper-graphene composite structure194under axial loading test. Images674and694show cracks along the copper-graphene interface line and some perpendicular to the interface. The perpendicular crack indicates the high strength of the copper-graphene interface bonding. This is the advantage of the described method of printing composite structures that include dissimilar materials such as copper and graphene as in practice only welding techniques are to bond two dissimilar materials. The hardness test also confirms the strength of the interface bonding between two different materials using the direct ink printing method. FIG.8is a chart714showing hardness of various printed structures. The hardness of the annealed Cu sample, annealed Fe sample, printed Cu sample, printed Fe sample, printed copper-graphene (Cu-Gr) sample, and the interface of printed Cu—Fe sample was measured. The hardness of the printed Cu—Fe sample and Cu-Gr sample was measured using the Vickers hardness method and compared with the rest of the samples. Chart714shows an average hardness of the printed Cu sample to be approximately 60 HV compared to the pure annealed Cu sample that shows hardness between 42 and 50 HV. This behavior can be explained by the Hall-Pitch effect which states when the material is under plastic deformation the dislocation will move through the material. The grain boundary in the material can be viewed as a barrier and most of the dislocation will situate in the grain boundaries increasing the strength of the material. For example, a material with a smaller grain size will have more grain boundaries in the microstructure. Therefore, the travel of the dislocation is reduced and the material strength is increased. In this example, the grain size of the printed copper samples is between 18 μm and 25 μm and the grain size of the annealed copper sample is 100 μm so the printed samples have higher strength. Similarly, the printed Fe samples have higher hardness compared to annealed pure Fe samples as the annealed Fe samples have larger grains. The printed copper-graphene sample shows the highest hardness of approximately 160 HV compared to the rest of the samples. This can be due to various aspects of material science but mainly the presence of graphene plays a critical role in preventing dislocation. The Cu—Fe interface also shows a high hardness of approximately 110 HV, which is a result of the sintering step. While this specification contains many specific implementation details, these should not be construed as limitations on the scope of what may be claimed, but rather as descriptions of features that may be specific to particular implementations. Features that are described in this specification in the context of separate implementations can also be implemented, in combination, in a single implementation. Conversely, various features that are described in the context of a single implementation can also be implemented in multiple implementations, separately, or in any suitable sub-combination. Moreover, although previously described features may be described as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can, in some cases, be excised from the combination, and the claimed combination may be directed to a sub-combination or variation of a sub-combination. Particular implementations of the subject matter have been described. Other implementations, alterations, and permutations of the described implementations are within the scope of the following claims as will be apparent to those skilled in the art. While operations are depicted in the drawings or claims in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed (some operations may be considered optional), to achieve desirable results. | 24,793 |
11858040 | DETAILED DESCRIPTION OF THE EMBODIMENTS Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The present disclosure may be implemented in various different forms, and is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present disclosure, and the same reference numerals are assigned to the same or similar elements throughout the specification. FIG.1illustrates a configuration of the 3D printing system according to an example embodiment of the present disclosure, andFIG.2is an enlarged view of part A inFIG.1. A 3D printing system1according to an example embodiment of the present disclosure may be a system for forming a 3D object by melting a base material using a laser. The 3D printing system1may include an apparatus for inspecting the printing quality of an object to be 3D printed, that is, a 3D printing object4using, a femtosecond laser beam having a high spatial measurement resolution during a 3D printing process. Referring toFIG.1, the 3D printing system1may include a laser source20, a base material source30, a focus lens40, a nozzle50, a femtosecond laser source60, a first beam splitter71, a time delay unit76, an electric/acoustic optical modulator80, a second beam splitter94, a photo detector92, a lock-in amplifier90, and a control unit100. Here, as an example, the 3D printing system1may be a DED type 3D printing system capable of forming a 3D object by melting metal powder with a laser. The laser source20, the base material source30, the focus lens40, and the nozzle50may form a general DED type 3D printer10. However, the 3D printer10that can be applied to the 3D printing system1according to an embodiment of the present disclosure is not limited to the DED type. Any 3D printer capable of forming a molten pool of metal can be applied as a part to the 3D printing system1according to the present disclosure. In addition, the 3D printing system1may include the femtosecond laser source60provided coaxially with the DED type 3D printer10. That is, the femtosecond laser source60may be disposed coaxially with the laser source20. Here, the coaxial disposition means that related components are arranged so that a plurality of laser beams share the same optical path. For example, the coaxial disposition means that the optical path is shared by separating and transmitting the laser beam by a beam splitter, a dichroic mirror, or a filter. Accordingly, it is possible to continuously measure an ultrasonic wave with respect to the printing object4without controlling the positions of the laser source20and the femtosecond laser source60. In addition, the femtosecond laser source60, the first beam splitter71, the time delay unit76, the electric/acoustic optical modulator80, the photo detector92, the amplifier90, and the control unit100may form a measuring apparatus capable of inspecting the printing quality of the 3D printing object using a femtosecond laser beam during the 3D printing process according to an example embodiment. In this case, the apparatus for inspecting the 3D printing quality may include an optical means for forming an optical path. Accordingly, the 3D printing system1may include the 3D printer10and the apparatus that inspects the printing quality of the printing object using the femtosecond laser beam during the 3D printing process. The laser source20may generate a printing laser beam22onto the 3D printing object4. The printing laser beam22irradiated from the laser source20may pass through the first and second reflection mirrors24and26and the focus lens40in turn and be irradiated onto the printing object4. At this time, the laser beam22irradiated from the laser source20may pass through the nozzle50for supplying the base material while being irradiated to a molten pool2. Here, the laser beam22of the laser source20may have a wavelength band of 1.07 μm or less. InFIG.1, the laser source20may be disposed spatially apart from the femtosecond laser source60. Since the laser source20is not disposed in a straight line with the nozzle50, optical means such as a first reflection mirror24and a second reflection mirror26may be provided in order for the laser source20and the femtosecond laser source60to be coaxially disposed. The first reflection mirror24may reflect the printing laser beam22from the laser source20toward the femtosecond laser source60. In addition, the second reflection mirror26may reflect the printing laser beam22reflected by the first reflection mirror24toward the printing object4. However, the optical means for forming the optical path of the printing laser beam22is not limited thereto, and may be changed according to the positions of the laser source20and the femtosecond laser source60or the optical path thereof. The base material supplied from the base material source30may be supplied to the nozzle50in the form of, for example, metal powder or metal wire through a separate supply pipe32. To supply the base material to the printing object4, a base material movement path formed in the nozzle50may be in parallel to or obliquely to the path through which the printing laser beam22passes. The base material supplied to the printing object4may be melted by the laser beam from the laser source20to form the molten pool2on the printing object4. The femtosecond laser source60may generate a femtosecond laser beam62to inspect a state of the printing object4. As an example, the femtosecond laser source60may generate the femtosecond laser beam62with a repetition frequency of 40 MHz. In this case, the femtosecond laser beam62may have a wavelength different from that of the printing laser beam22. For example, the femtosecond laser beam62may have a wavelength band of 515 nm or less. Here, the femtosecond laser beam62may be used for estimating physical properties of the printing object4and detecting defects of the printing object4. Physical properties of the printing object4may include Young's modulus and residual stress. In addition, defects of the printing object4may include cracks, voids, and porosity. In this case, physical property estimation and defect detection may be performed based on a pulse-echo technique or a pitch-catch technique, as described later. In addition, ultrasonic measurement with the femtosecond laser beam62may be performed using a pump-probe technique. To this end, the femtosecond laser beam62may be divided into a pump laser beam62aand a probe laser beam62b. In practice, the pump laser beam62amay be defined as an output of the electric/acoustic optical modulator80, and the probe laser beam62bmay be defined as an output of the time delay unit76. In this case, the pump laser beam62amay excite the printing object4. The probe laser beam62bmay be used for ultrasonic measurement to inspect the state of the printing object4using a time delay of the probe laser beam62bwith the pump laser beam62a. Here, the pump laser beam62amay generate ultrasonic waves at the level of THz at an excitation point. Through this, it is possible to inspect minute defects at the level of nm. For example, when the printing object4is a steel material, a wavelength of the elastic wave generated from the steel material may be 10 nm according to the following equation. λ=vf≈5000ms0.5THz=10nm(1) The first beam splitter71may be disposed on the path of the femtosecond laser beam62irradiated from the femtosecond laser source60. The first beam splitter71may separate the femtosecond laser beam62generated by the femtosecond laser source60into a first femtosecond laser beam and a second femtosecond laser beam. The first femtosecond laser beam may be modulated into the pump laser beam62awhile passing through the electric/acoustic optical modulator80. The second femtosecond laser beam may pass through the time delay unit76to be output as the probe laser beam62b. In this case, the femtosecond laser beam62transmitted through the first beam splitter71may be the probe laser beam62b, and the beam separated by the first beam splitter71may be the pump laser beam62a. However, the optical path configuration of the pump laser beam62aand the probe laser beam62bis not limited thereto, and may be configured in various ways. For example, the optical paths of the pump laser beam62aand the probe laser beam62bmay be configured opposite to that ofFIG.1. To configure the optical path of the pump laser beam62a, a third reflection mirror72, a fourth reflection mirror73, and a fifth reflection mirror74may be provided. Here, the third reflection mirror72may be disposed between the first beam splitter71and the electric/acoustic optical modulator80. In this case, the third reflection minor72may reflect the femtosecond laser beam62separated by the first beam splitter71toward the electric/acoustic optical modulator80. The fourth reflection mirror73may be disposed between the electric/acoustic optical modulator80and the fifth reflection minor74. In this case, the fourth reflection mirror73may reflect the pump laser beam62aoutput from the electric/acoustic optical modulator80toward the fifth reflection mirror74. The fifth reflection mirror74may be disposed between the fourth reflection mirror73and the second beam splitter94. In this case, the fifth reflection minor74may reflect the reflected pump laser beam62atoward the second beam splitter94or the nozzle50. In addition, the second reflection minor26may allow the pump laser beam62ato transmit itself. Accordingly, the pump laser beam62aand the probe laser bean62bseparated by the first beam splitter71may be coaxially arranged with the laser beam22for the 3D printing and applied to the printing object4. However, the optical means for forming the optical path of the pump laser beam62ais not limited thereto, and may be changed according to the positions of the laser source20and the femtosecond laser source60or the optical path thereof. The time delay unit76may delay the second femtosecond laser beam that has passed through the first beam splitter71to be output as the probe laser beam62b. In this case, the time delay unit76may adjust the length of the optical path of the probe laser beam62b. That is, the time delay unit76may include a plurality of reflection mirrors to adjust the length of the optical path. Here, a high sample frequency may be obtained by controlling the time delay between the pump laser beam62aand the probe laser beam62b. For example, the minimum displacement of the optical path length may be 0.1 μm. This delay corresponds to a sample frequency of 3 PHz according to the following equation. As a result, it is possible to measure in real time with high resolution, and thus control precision and quality of the 3D printing process can be improved. fs,max=vlightΔdmin≈3×108ms0.1μm=3PHz(2) The time delay unit76may delay the femtosecond laser beam62to form a substantial probe laser beam62b. Here, the probe laser beam62bmay have the same wavelength as the femtosecond laser beam62. As an example, the probe laser beam62bmay have a wavelength band of 515 nm or less. In order to form an optical path of the probe laser beam62band to adjust the optical path length of the time delay unit76, a sixth reflection mirror75and a seventh reflection mirror77may be provided. The sixth reflection mirror75may be disposed between the first beam splitter71and the time delay unit76. In this case, the sixth reflection mirror75may reflect the femtosecond laser beam62through the first beam splitter71toward the time delay unit76. The seventh reflection mirror77may be disposed between the time delay unit76and the nozzle50. In this case, the seventh reflection mirror77may reflect the probe laser beam62b, which is the time-delayed femtosecond laser beam62, output from the time delay unit76toward the second beam splitter94or the nozzle50. In addition, each of the second reflection mirror26and the fifth reflection mirror74may allow the probe laser beam62bto transmit itself. Accordingly, the probe laser beam62bseparated by the first beam splitter71may be formed coaxially with the pump laser beam62aand the printing laser beam22. However, the optical means for forming the optical path of the probe laser beam62bis not limited thereto, and may be changed according to the positions of the laser source20and the femtosecond laser source60or the optical paths thereof. The electric/acoustic optical modulator80may modulate the first femtosecond laser beam separated by the first beam splitter71into the pump laser beam62a. Here, the electrical/acoustic optical modulator80may be an acousto-optic modulator (AOM) or an electro-optic modulator (EOM). For example, the electric/acoustic optical modulator80may perform pulse picking of the femtosecond laser beam62from the femtosecond laser source60at a modulation frequency f0. The electro/acoustic optical modulator80may modulate the femtosecond laser beam62into a substantial pump laser beam62a. Here, the pump laser beam62amay have a wavelength different from that of the printing laser beam22. For example, the pump laser beam62amay have a wavelength band of 257 nm or less. The second beam splitter94may be disposed on the coaxial path of the printing laser beam22, the pump laser beam62a, and the probe laser beam62b. The second beam splitter94may allow the printing laser beam22, the pump laser beam62a, and the probe laser beam62bto pass through the nozzle50. As shown inFIG.2, the printing laser beam22and the femtosecond laser beam62may be separated by at least a certain distance L2to be irradiated onto the printing object4. Here, the femtosecond laser beam62may include the pump laser beam62aand the probe laser beam62b. Optionally, the femtosecond laser beam62may include only the probe laser beam62b, as described later with reference toFIGS.5and6. At this time, the molten pool2may be formed on the printing object4to be printed by the laser beam22for printing. The molten pool2may be formed with a constant width L1according to the energy of the printing laser beam22. For example, the width L1of the molten pool2may be about 500 μm. In addition, the femtosecond laser beam62may be irradiated to the solidified area of the molten printing object4by the printing laser beam22. That is, the distance L2between the printing laser beam22and the femtosecond laser beam62may be a distance from the molten pool2formed by the printing laser beam22to the solidified area. For example, the distance L2may be about 1.5 mm to 2.5 mm. In this case, the printing object4may be formed as a three-dimensional object by stacking a plurality of layers. InFIG.2for describing this example embodiment, it is illustrated that the printing object4is formed of a first layer6, a second layer7and a third layer8, and the molten pool2is formed in the first layer6and the second layer7. The probe laser beam62bmay be incident on and then reflected from the printing object4. The second beam splitter94may reflect the probe laser beam62breflected from the printing object4toward the photo detector92in order to inspect the state of the printing object4. The photo detector92may detect the probe laser beam62breflected by the printing object4. That is, the photo detector92may convert the received probe laser beam62binto an electric signal. As an example, the photo detector92may be a photodiode. The lock-in amplifier90may detect an amplitude and a phase of the output signal from the photo detector92. For this, the lock-in amplifier90may remove noises included in the output signal. Here, the detected amplitude and phase may be used for estimating the physical properties of the printing object4and detecting defects of the printing object4. FIG.7is a diagram for describing measurement of a moving printing object in the 3D printing system according to an embodiment of the present disclosure. The pulse duration of the femtosecond laser beam62is very short. For example, when the maximum repetition rate of the femtosecond laser beam62is, for example, 40 MHz and the scan speed of the 3D printing system1is, for example, 10 mm/s, the pulse interval is 0.25 nm as shown in the following equation. 140×10-6s×10mms=0.25nm(3) Here, in the case of the piezoelectric-based delay line in the 3D printing system1, the time taken to move to the next delay line position is approximately 1 μs. The time required to measure, for example, 100 samples in the time window of the 3D printing system1is 102.5 μs as shown in the following equation. (1μs+102.5140×10-6s)×100=102.5μs(4) Accordingly, the 3D printing system1may move 1.025 μm as shown in the following equation, while the femtosecond laser beam62moves during the measurement time required. 102.5μs×100 mm/s=1.025μs(5) As shown inFIG.7, under the assumption that the average physical properties and characteristic values are estimated in the 1.025 μm section, the measurement signal may be used to estimate physical properties such as the average elastic modulus of the target section and the thickness of the printing object4. Accordingly, the ultrasonic measurement using the femtosecond laser beam62can ignore the influence of movement of the printing object4compared to the conventional laser-based measurement techniques. FIG.8is a diagram for describing modulation of the femtosecond laser beam in the 3D printing system according to an embodiment of the present disclosure, andFIG.9is a view showing the pump laser beam and the probe laser beam inFIG.8. In the case of using the femtosecond laser beam, the measured effective signal may be greatly influenced by environmental noises because the signal strength is relatively small. To minimize the influence due to the noises, an example embodiment of the present disclosure modulates the pump laser beam62aby an acousto-optic modulator (AOM) or an electro-optic modulator (EOM), so that a signal can be transmitted at a predetermined frequency. At this time, the signal can be effectively measured by the lock-in amplifier90. As shown inFIG.8, by the AOM or EOM, the laser pulse may be (a) pulse-peaked or (b) pulse-modulated. The pump laser beam62amodulated in this way may allow useful ultrasonic information to be transmitted through a carrier frequency. As shown inFIG.9, the pump laser beam62amay be pulse-peaked. Here, the pulse peaking rate may be the modulation frequency f0. The probe laser beam62breflected by the printing object4may have a shorter pulse interval than the pump laser beam62a. FIG.10illustrates a detailed configuration of the lock-in amplifier shown inFIG.1. The lock-in amplifier90can demodulate amplitude and phase information from a response signal even in an environment of extreme noises. Referring toFIG.10, the lock-in amplifier90may include a demodulator96and a low pass filter98. The lock-in amplifier90may receive an output signal (a PD signal) of the photo detector92as an input signal, and a reference signal of a modulation frequency f0. The reference signal may have a phase difference from the PD signal corresponding to a time delay between the pump laser beam62aand the probe laser beam62b. The demodulator96may demodulate the output signal (PD signal) of the photo detector92with the reference signal of f0. The low pass filter98may pass a low frequency band of a signal demodulated by the demodulator96. The low pass filter98may remove noise in a high frequency band. Accordingly, the lock-in amplifier90may extract accurate amplitude and phase information of the detected signal. The control unit100may analyze the amplitude and phase information of the output signal from the lock-in amplifier90to inspect the printing quality of the printing object4. The printing quality inspection may be an inspection including physical property estimation and defect detection, and may be performed using a pulse-echo technique or a pitch-catch technique, as described later. Hereinafter, a method of inspecting printing quality using the control unit100will be described. In an example embodiment, inspecting the printing quality of the 3D printing object may include estimating physical properties of the printing object4and detecting defects such as cracks, voids, etc. in the printing object4. In the table below, items for the printing quality inspection that may be performed by the 3D printing system1are briefly classified. However, the table below is only presented to aid understanding of the present disclosure, and the present disclosure should not be construed as being limited by the table presented below. TABLE 1ItemClassificationDescriptionPrintingEstimationThicknessUse time difference betweenqualityof physicalof printingreflection waves from surfaceinspectionpropertyobjectand floorModulus ofDetect change in ultrasonicelasticitypropagation speedResidualDetect change in ultrasonicstresspropagation speedEtc.DetectionInternalDetect additional reflectedof defectvoidwaveSurfaceDetect nonlinearity ofcrackoutput signalEtc. FIG.3is a flow chart of a method of inspecting the printing quality of the 3D printing object according to an embodiment of the present disclosure. As shown inFIG.3, the printing quality inspection method according to an embodiment of the present disclosure may be performed using the control unit100of the 3D printing system1. The quality inspection method may include the steps of: irradiating a laser beam from a femtosecond laser source (S10), separating the generated laser beam into a pump laser beam and a probe laser beam (S20), generating ultrasonic waves by irradiating the laser beam for the 3D printing, that is, the printing laser beam or the pump laser beam to the printing object (S30), irradiating the probe laser beam to the printing object (S40), detecting the probe laser beam reflected by the printing object (S50), and analyzing the probe laser beam to inspect the printing quality of the printing object (S60). In the 3D printing system1according to an example embodiment, firstly a femtosecond laser beam may be irradiated from the femtosecond laser source60disposed coaxially with the 3D printing laser source30(S10). The irradiated femtosecond laser beam62may be divided into the pump laser beam62aand the probe laser beam62bby the first beam splitter71(S20). In an example embodiment, ultrasonic waves may be generated by exciting the printing object4using the pump laser beam62aseparated from the femtosecond laser beam62. In another example embodiment, in addition to the pump laser beam62a, the laser beam22for 3D printing may be irradiated onto the printing object4to generate ultrasonic waves (S30). Next, the probe laser beam62bseparated from the femtosecond laser beam62is used to measure the ultrasonic waves generated on the printing object4by the pump laser beam62aor the printing laser beam22(S40). In this case, a pulse-echo method or a pitch-catch method may be used for the measurement of ultrasonic waves. That is, the pulse-echo method and the pitch-catch method may be selectively applied according to the positional relationship between the irradiation location of the laser beams62aand22for ultrasonic excitation and the irradiation location of the probe laser beam62bfor ultrasonic measurement. The two methods do not have a superior or inferior relationship to each other, and can be appropriately selected according to the inspection object or inspection environment. Hereinafter, the steps of generating ultrasonic waves for each method (S30), irradiating the probe laser beam62b, detecting the probe laser beam62b(S50), and analyzing the same (S60) will be described. The table below is a table that summarizes the description to be described below, and that briefly classifies physical properties that can be estimated using the pulse-echo and pitch-catch methods among ultrasonic measurement methods and defects that can be detected. However, Table 2 below is also only presented to aid understanding of the present disclosure, and the present disclosure should not be construed as being limited by Table 2 presented below. TABLE 2MethodClassificationDescriptionMeasurementPulse-echoThickness ofUse time difference betweenof ultrasoundtechniqueprintingreflection waves fromwaveobjectsurface and floorModulus of1. Use time differenceelasticitybetween reflection wavesfrom surface and floor2. Detect change in ultrasonicpropagation speedInternalDetect additional reflectedvoidwavesEtc.Pitch-catchModulus ofDetect change in ultrasonictechniqueelasticitypropagation speedResidualDetect change in ultrasonicstresspropagation speedSurfaceDetect nonlinearity ofcrackoutput signalEtc. In an example embodiment, the 3D printing system1may use a pulse-echo technique to inspect the printing quality of the printing object4. FIG.4illustrates an example configuration of the printing laser beam and the femtosecond laser beam when the pulse-echo technique is used in the 3D printing system1.FIG.11illustrates an analysis an output signal due to a surface reflected wave St and a bottom reflected wave Sr of the printing object4as an example of pulse-echo signal analysis. In more detail, referring toFIG.4, the pump laser beam62aand the probe laser beam62bmay be irradiated onto a region of the printing object4which is spaced apart from the printing laser beam22by a predetermined distance L2. That is, the pump laser beam62aand the probe laser beam62bmay be irradiated onto the same spot of the printing object4. In an example embodiment, the pump laser beam62aand the probe laser beam62bmay be irradiated within a solidified region of the printing object4. In this case, the pump laser beam62amay be for generating ultrasonic waves by exciting the printing object4. The probe laser beam62bmay be for measuring ultrasonic waves to inspect the state of the printing object4. That is, according to the pulse-echo technique, the printing object4may be ultrasonically excited by the femtosecond laser beam (pump laser beam62a), and the ultrasonic wave generated in the printing object4by the excitation may be is measure using the femtosecond laser beam (probe laser beam62b). The probe laser beam62birradiated for the ultrasonic measurement may be reflected by the printing object4and then detected through the photo detector92(S50). At this time, referring toFIG.11, the photodetector92may measure both an output signal caused by the surface reflected wave St of the printing object4and an output signal caused by the bottom reflected wave Sr of the printing object4. Next, in an example embodiment, the 3D printing system1may inspect the printing quality of the object4to be printed by analyzing the measured output signal (S60). In the measured signals, there may occur a time difference between the output signal caused by the surface reflected wave St and the output single caused by the bottom reflected wave Sr. The control unit100may estimate physical properties such as a thickness and an elastic modulus of the printing object4by analyzing the time difference. In an example embodiment, prior to estimating the above-described physical property of the printing object, an artificial neural network model may be first constructed for analyzing a correlation between the physical property and the time difference and estimating the physical property such as an elastic modulus, etc. of the printing object. To this end, data regarding the time difference between the output signals due to the surface reflected wave St and the bottom reflected wave Sr under the above-described physical property may be collected for machine-learning. In addition, the control unit100repeatedly learns the collected data using a machine-learning algorithm, thereby obtaining an artificial neural network model capable of analyzing the correlation between the physical property of the printing object4and the time difference of the output signals. In addition, in an example embodiment, the control unit100may detect a change in the propagation speed of ultrasonic waves generated in the printing object4through the pulse-echo technique to estimate the physical property of the printing object. In more detail, the propagation speed of ultrasonic waves in the printing object4may be affected by physical properties including elastic modulus, residual stress, etc. As a result, a phase difference occurs in the output signals obtained through the ultrasonic measurement according to the physical properties of the printing object4. The control unit100may analyze such a phase difference to find out the elastic modulus of the printing object4. To this end, in an example embodiment, the control unit100may analyze a correlation between the elastic modulus and the phase difference. As an example, the control unit100may be configured to repeatedly learn a plurality of data to estimate an elastic modulus value according to a phase difference, and form an artificial neural network model based on the accumulated data. In an example embodiment, the control unit100may detect a defect in the printing object4by detecting an output signal due to an additional reflected wave Sr′ through the pulse-echo technique. In more detail, when there is no defect in the printing object4, the pump laser beam62airradiated to the printing object4may generate only the reflected wave St reflected by the surface of the printing object4and the reflected wave Sr reflected by the bottom surface of the printing object4. However, as shown inFIG.11, when a defect such as a void exists inside the printing object4, the pump laser beam62airradiated to the printing object4may generate an additional reflected wave due to the void Sr′. In other words, when additional reflected waves Sr′ other than the normal reflected waves St and Sr are detected, it can be estimated that there is an internal void of the printing object4. Meanwhile, in an example embodiment that utilizes high-speed measurement of the femtosecond laser beam, when measuring the probe laser beam62bto measure ultrasonic waves in the printing object4, the entire measurement may not be performed. That is, it may be possible to selectively measure a part of the reflected wave signal or only a part of the phase difference. Through this partial measurement, data measurement time can be drastically reduced. This enables real-time ultrasonic measurement during the 3D printing process. In an example embodiment, the 3D printing system1may use the pitch-catch technique to inspect the printing quality of the printing object4. FIG.5illustrates an example configuration of the printing laser beam and the femtosecond laser beam when the pitch-catch technique is used in the 3D printing system.FIG.6illustrates another example configuration of the printing laser beam and the femtosecond laser beam when the pitch-catch technique is used in the 3D printing system.FIG.12illustrates, as an example of the pitch-catch technique signal analysis, an analysis of an output signal according to a symmetric mode S0and an asymmetric mode A0of an ultrasonic wave.FIG.13illustrates, as an example of the pitch-catch technique signal analysis, an example of nonlinear modulation (fa) which is generated due to surface crack of the printing object when simultaneously applying low-frequency (f1) and high-frequency (f2) ultrasonic waves to the printing object for excitation. In more detail, referring toFIG.4, the pump laser beam62amay be irradiated at the same spot as the printing laser beam22. The probe laser beam62bmay be irradiated onto the printing object4at a spot spaced apart from the printing laser beam22or the pump laser beam62aby a predetermined distance L2. As an example, the probe laser beam62bmay be irradiated onto the solidified region of the printing object4. Here, the pump laser beam62amay be used to excite the printing object4to generate ultrasonic waves. The probe laser beam62bmay be for measuring ultrasonic waves to inspect the state of the printing object4. Referring toFIG.6, as another example of the pitch-catch technique, the 3D printing system1may not use the pump laser beam62a. That is, the printing object4may be excited using the printing laser beam22instead of the pump laser beam62ato generate ultrasonic waves. In this case, the probe laser beam62bmay be irradiated onto the printing object4by being spaced apart from the printing laser beam22by the predetermined distance L2. As an example, the probe laser beam62bmay be irradiated onto the solidified region of the printing object4. Here, the probe laser beam62bmay be for measuring ultrasonic waves so that the state of the printing object4can be inspected. Even in the pitch-catch technique, the probe laser beam62breflected from the printing object4may be detected by the photo detector92(S50). Through this, an output signal due to ultrasonic waves propagated through the printing object4can be measured. It goes without saying that the quality of the printing object4may be inspected by analyzing the measured output signal (S60). In an example embodiment, the 3D printing system1may detect a change in the propagation speed of ultrasonic waves generated in the printing object4using the pitch-catch technique to estimate physical properties of the printing object4. As described above, the propagation speed of ultrasonic waves in the printing object4is affected by the physical properties of the printing object4. That is, referring toFIG.12, the propagation speed of ultrasonic wave varies according to the physical properties of the printing object4. Accordingly, the arrival times of the symmetric mode S0and the asymmetric mode A0of ultrasonic waves under the pitch-catch technique may be also changed. In an example embodiment, the propagation speed of ultrasonic waves may be analyzed by measuring the arrival times of the ultrasonic waves in the symmetric mode S0and the asymmetric mode A0. Through this analysis, physical properties such as elastic modulus, residual stress, etc. can be estimated. In estimating the physical properties, it goes without saying that correlation analysis using an artificial neural network model may be used, similar to the above-described physical property estimation. In an example embodiment, when the pitch-catch technique is applied, a phase difference may occur in an output signal obtained through ultrasonic measurement due to a change in the propagation speed of the ultrasonic wave according to the physical properties. By analyzing the phase difference, the control unit100may detect a change in the propagation speed of the ultrasonic wave and finally estimate physical properties such as the elastic modulus and the residual stress. Even at this time, the control unit100may be configured to construct the aforementioned artificial neural network model in order to analyze the correlation between the physical properties and the phase difference. Meanwhile, in an example embodiment, the 3D printing system1may detect a defect in the printing object4through the pitch-catch technique. For example, the control unit100may detect a defect in the printing object4by detecting nonlinearity of an output signal obtained through ultrasonic detection. In more detail, referring toFIG.13, when the printing object4which has a crack on its surface is excited by the ultrasonic waves of a low frequency f1and a high frequency f2simultaneously, nonlinear frequency modulation (fa) may be generated at the sum frequency and difference frequency of the low frequency f1and the high frequency f2. In an example embodiment, the 3D printing system1may simultaneously excite the printing object4at the low-frequency f1and the high-frequency f2ultrasonic waves with the pump laser beam62aor the printing laser beam22, respectively and then detect the nonlinear modulation fausing the control unit100, thereby early detecting defects such as surface crack of the printing object4. As described above, the present disclosure can perform the printing quality inspection including estimating physical properties and detecting defects in real time during the 3D printing process. This enables disposing of any defected product early in the printing process, thereby improving the efficiency of the 3D printing process. That is, since the 3D printing system can feedback control the 3D printing process in real time, product quality and the efficiency of the 3D printing system1can be improved. The foregoing is illustrative of example embodiments and is not to be construed as limiting thereof. Although a few example embodiments have been described, those skilled in the art will readily appreciate that many modifications are possible in the example embodiments without materially departing from the novel teachings and advantages of the present disclosure. Accordingly, all such modifications are intended to be included within the scope of the present disclosure as defined in the claims. | 36,987 |
11858041 | Throughout the drawings, identical reference numbers designate similar, but not necessarily identical, elements. DETAILED DESCRIPTION Sintering is a heat treatment process often used to improve mechanical and other properties of “green” state objects or parts produced by different manufacturing methods such as binder jet 3D printing and MIM (metal injection molding) processes. A green object is an object whose material is in a weakly bound state, such as weakly bonded powder material before it has been sintered or fired. Sintering processes expose “green” objects to high temperatures for predetermined periods of time. Time-temperature profiles for sintering processes are generally determined based on experimentation with properties including the material type, material density, wall thickness, and total mass and general thermal load of the green objects to be sintered. Such profiles are designed to control the heating and cooling cycles of the sintering process so that the green objects within a furnace are exposed to the proper sintering temperature for the correct amount of time that will bring the objects to a sintering endpoint or completion. However, determining such time-temperature profiles can be costly due to, for example, variations in thermal properties of different materials, variations in total thermal mass between different sintering runs, variations in thermocouple calibration, and so on. In addition, the time-temperature profiles merely provide an indirect method for estimating when a sintering endpoint will be reached. Therefore, controlling sintering cycles based on predetermined time-temperature profiles can result in suboptimal quality among the sintered objects within a given sintering furnace load. In some examples, a sintering furnace can be loaded with green objects and programmed with a particular time-temperature profile to control the heating and cooling cycle of the furnace. The time-temperature profile for a given furnace load is generally determined through trial and error based on the expected thermal load of the green objects to be sintered, which considers the mass of the load as well as the dimensional and material characteristics of the objects, as noted above. However, a furnace load can include green objects with varying characteristics, such as objects that have different thermal loads and/or different sizes, shapes, and thicknesses. In some 3D printing processes, such as binder jetting, for example, there can be a significant degree of variability among the green objects that are produced within different printing batches or within the same printing batch. Therefore, the profiles for controlling sintering cycle times are often developed to accommodate the worst-case scenario. Worst-case scenarios can be determined based on green objects that are expected to have the greatest thermal loads, the thickest object sections, and/or the types of metal powder materials that call for the longest furnace sintering times. Because sintering cycle times are usually developed to accommodate green objects that represent such worst-case scenarios, other green objects within a same furnace load are often exposed to longer sintering times that can extend well beyond their sintering endpoints. Extended sintering times can result in over-sintering of some objects and can degrade the quality and performance of the sintered objects, as well as increase the costs associated with operating the sintering furnace, including additional time, energy, and furnace wear and tear. As noted above, during the sintering process green objects are brought up to an appropriate sintering temperature for predetermined periods of time to achieve the sintering endpoint or completion. Sintering temperatures are generally some percentage of the melting point temperature of the metal material being sintered. For example, sintering temperatures can be on the order of 70%-90% of the melting point. Measuring and monitoring furnace temperatures to ensure that the correct sintering temperature is reached and sustained at the center of the furnace “hot zone” can be challenging and costly. One method for monitoring temperature in a sintering furnace involves the use of thermocouples, which can add significant cost to the sintering process. Thermocouples are application specific devices because they have to be matched with the process gas and the temperatures being used for sintering the green object materials within a furnace load. In addition, thermocouples are typically located on the outside of the thermal mass cluster and are ideally routed to the center of the furnace hot zone to provide the most accurate temperature information. Furthermore, it should be noted that even when thermocouples can be used to provide accurate temperature monitoring and control over predetermined time periods, such accurate implementation of time-temperature profiles is not a definitive method for determining when a sintering endpoint has been reached. Rather, such accurate control provides at best, an indirect method for estimating when the sintering endpoint has been reached. As a result, sintering times are often extended to ensure that the worst-case objects in a furnace load reach a sintering endpoint which, as noted above, can cause over-sintering of some objects within the furnace load. Accordingly, an example sintering system and methods described herein improve the accuracy of sintering cycle times by enabling electrical measurement of a green object during a sintering process. Wire conductors can be used to provide a voltage across a token green object being sintered in a furnace. electric current flow through a token green object being sintered in a furnace. The wires enable an electrical measurement (e.g., a total impedance measurement) of the green object during the sintering. The electrical measurement can provide information about the densification of the green object, for example, by comparing the measurement value with a target value that represents a degree of densification. The target value can be experimentally determined, for example, to correspond with a degree of densification that indicates the sintering is complete, or has reached an endpoint. When the electrical measurement value reaches the target value, the system can determine that sintering of the token green object and other green objects being sintered is complete. In some examples, the system can use the rate of change of a measured electrical value to determine when the sintering of green objects is complete. Based on determining that the sintering of green objects is complete, the system can control the sintering cycle, for example, by initiating a furnace cool down phase. A furnace cool down phase might include, for example, turning off furnace heating elements and passively allowing the furnace to cool down, or turning off the furnace heating elements and actively cooling the furnace with an active air flow or water flow system. As a green object densifies during sintering, an electrical characteristic of the green object can change. For example, during sintering the impedance of a green object can decrease to a degree that is inversely proportional to about the same degree that the density increases. Thus, the densification of a green object can be observed indirectly by measuring its impedance which decreases as the green object densifies and shrinks geometrically. As used herein, impedance refers to total impedance. Total impedance measurements include both real (ohmic) and complex (imaginary) components, so an impedance measurement can therefore provide a measure of impedance, capacitance, and/or inductance. Many powder metal materials have a density of about 80% after a binder burnout. During sintering of a green object, an example density of 80% can increase, for example, to 98%. Such an increase in density can result in a reduction in impedance on the order of 18% (i.e., (1/0.98−1/0.80)/(1/0.80)=−18%). This is a significant change in impedance that is readily measurable. In some examples, a token green object can be positioned on a support structure in a sintering furnace. Electrical conductors/wires leading into the furnace can include electrical contacts attached at their distal ends. The electrical contacts at the distal ends of the wires are held in the furnace at a fixed position by the support structure. The fixed position of the electrical contacts can be such that the contacts are flush with (i.e., level with) the surface of the support structure on which the token green object is to be positioned, or the contacts can be proud of (i.e., raised above) the surface of the support structure on which the token green object is to be positioned. Such fixed positioning of the electrical contacts enables a token green object being held on the support structure to remain in contact with the electrical contacts during sintering. Outside of the furnace, an impedance meter can be operably coupled to the proximal ends of the electrical wires. As used herein, an impedance meter can refer to any appropriate meter or analyzer capable of measuring impedance parameters such as capacitance, inductance and impedance. Therefore, an impedance meter may include devices such as an LCR meter, an impedance analyzer, a network analyzer, and so on. Such devices are generally capable of measuring phase-sensitive voltage-to-current ratio which provides fundamental impedance values such as absolute impedance and phase, along with the real and imaginary parts of the impedance. An impedance meter generally comprises an AC voltage source to apply an AC voltage across the token green object, and a current meter (ammeter) to measure the current induced through the object by the applied voltage. The impedance meter converts the applied voltage and the measured current into an impedance value of the measured object. In some examples, an instrument system operably coupled to the proximal ends of the electrical wires can comprise a separate voltage source and digital multimeter. In different examples, varying arrangements of electrical wires and contact electrodes can be used to contact a token green object and provide electrical measurements. For example, arrangements of two wires, three wires, and four wires can be used to provide electrical measurements with varying degrees of accuracy. In a particular example, a sintering system includes a support structure in a sintering furnace to support a token green object during a sintering process. The system includes wires installed into the furnace and through the support structure to contact the object. An impedance meter is operatively coupled to the wires to determine impedance of the object during the sintering process. In some examples, a controller can compare the impedance of the object with a predetermined target impedance and determine a sintering endpoint when the impedance reaches the target impedance. In another example, a method of sintering includes heating a sintering furnace to a sintering temperature during a sintering process. The method includes measuring electrical impedance across a token green object in the furnace during the sintering process, and determining a sintering endpoint when the impedance reaches a target impedance. The method further includes initiating a furnace cool down phase based on determining the sintering endpoint. In another example, a sintering furnace includes a shelf insertable into the furnace to support green objects during a sintering process. The green objects include a token green object that is representative of the green objects. The sintering furnace includes wires operatively coupled to an impedance meter that is to apply an AC voltage across the token green object and measure impedance across the token green object. In the furnace, a support structure is disposed on the shelf to support the token green object and the wires so that electrodes at ends of the wires maintain contact with the token green object throughout the sintering process. The furnace can include a controller to compare the measured impedance with a target impedance and initiate a furnace cool down phase when the measured impedance reaches the target impedance. FIG.1shows a block diagram of an example sintering furnace system100suitable for determining the endpoint of a sintering process and providing accurate sintering cycle times based on electrical measurements of a green object. The system100includes an example sintering furnace102, an impedance meter104, a controller106, and electrical wires or conductors108operably coupled to the impedance meter104. The electrical wires108can apply an AC voltage from the impedance meter104across a token green object114(FIG.2) being sintered in the furnace102, as well as take electrical measurements of the token green object during sintering.FIG.1includes an enlarged view110of an example furnace rack112that can support green objects inside the furnace102during a sintering process.FIG.2shows an additional view of the example furnace rack112that has been loaded with an example token green object114and other example green objects116for sintering. An example controller106can include various components (not shown) to enable communication with, and control of, components of the example sintering system100, such as the sintering furnace102and the impedance meter104. Controller106can analyze and compare information and data received from the various components to make determinations and initiate system functions based on such analysis and comparison. Components of the controller106can include, for example, a processor (CPU), a memory, various discrete electronic components, and an ASIC (application specific integrated circuit). A memory can comprise non-transitory, machine-readable (e.g., computer/processor-readable) media that can store information in the form of machine-readable coded program instructions, data structures, program instruction modules, and other data and/or instructions executable by a processor. Stored information can include, for example, experimentally determined target value data to be used to analyze and compare electrical measurements and other information that can be sensed and received from the impedance meter104, the sintering furnace102, and other components of system100. Referring generally toFIGS.1and2, the example sintering furnace102is sometimes referred to as a “hot wall” design where electric heating elements118or other heating sources are located inside the furnace102between a layer of insulation120and the furnace retort wall122. The retort wall122can be made from different materials including a refractory metal, ceramic, quartz, or other materials capable of withstanding high temperatures. Peak sintering temperatures in the furnace can depend on the type of material being sintered, with an example range of such temperatures reaching as high as between 1100° C. to 1400° C. In an example sintering process, once the green objects114,116(sometimes referred to as the “load” or “furnace load”) are loaded into the furnace on the rack112, the controller106can activate the heating elements118to begin heating the retort122. The retort122can conduct or radiate the heat to the objects within the furnace. In some examples, gas from a supply (not shown) can be introduced into the furnace atmosphere during a sintering process. For example, a flow of gas can be provided through a furnace inlet124formed in the door126or lid of the furnace102. Gas lines (not shown) can be routed through the frame128of the furnace rack112to gas inlet ports (not shown) formed in the frame. The gas inlet ports can deliver gas into the furnace retort122to flow over green objects114,116, positioned on the shelves130of the furnace rack112. In some examples, a sintering process can include a binder burnout phase where binder material (e.g., plastics) within the green objects is broken down by high temperatures, and the broken down components of the binder material are removed by the gas as it flows across the objects. The binder burnout phase can occur at lower temperatures during the earlier part of the sintering process. For example, the binder burnout phase can occur as the temperature within the furnace reaches approximately 400° C., which happens well before the furnace temperature increases up to sintering temperatures that exceed 1000° C. A variety of gases can be introduced into the furnace including, for example, hydrogen, nitrogen, and argon. Hydrogen gas is often introduced to serve as a reducing agent that helps keep the powder metal particles in the green objects114,116, from oxidizing, and removes other contaminants. The hydrogen reduction process helps the surfaces of the metal particles remain metallic which improves the strength of bonds that are created between particles during sintering. In some examples, a fan (not shown) can be provided to circulate the atmosphere in the furnace102. Generally, however, the pressure of gas flowing into the furnace retort122can push the atmosphere within the retort122out of the furnace, for example, through an outlet132located in the door126of the furnace102. The atmosphere being pushed out of the furnace through the outlet132generally comprises gas, along with different elements being carried within the gas, such as the broken down components of the binder material, and the contaminants and water vapor that are generated by a hydrogen reduction process. In the examples shown inFIGS.1and2, the electrical wires108installed in the furnace102comprise four electrical wires108. In other examples, the electrical wires108may comprise alternate arrangements of wires, such as three wires or two wires, as discussed in more detail herein below. The use of fewer wires108reduces the accuracy of electrical measurements taken of a token green object114during sintering, as discussed in more detail below. An electrical wire108comprises a material that is tolerant of the high temperature sintering environment, such as tungsten, platinum, Molybdenum, and stainless steel. While the electrical wires108are shown entering the furnace102through a furnace inlet124formed in the door126or lid of the furnace102, and traveling generally through the frame128and a shelf130of the furnace rack112, they can be installed in the furnace in other ways. For example, the electrical wires108may enter the furnace through a side wall of the furnace. The flexibility and thin profile of the electrical wires108permits installation into the furnace without the use of a window or gap in the furnace wall through which excessive heat would otherwise escape during the high temperature sintering process. The electrical wires108therefore enable the application of an AC voltage to a token green object inside the furnace as well as enabling electrical measurement to be taken inside the furnace, without hindering the heating function of the sintering furnace. Referring toFIGS.1and2, the proximal ends134of the electrical wires108remain outside of the furnace102and are operably coupled to the impedance meter104. The distal ends136of the electrical wires108can include contact electrodes138that can be held in a stationary position within the furnace by a support structure140. The support structure140can be affixed to a shelf130within the furnace at a location near the center of the retort122in the area of the furnace hot zone. The support structure140can be made of a material that does not soften at high temperatures (e.g., the sintering temperature), such as Zirconia or Alumina, for example. As shown inFIG.2, the example support structure140can hold a token green object114in a position adjacent to the fixed contact electrodes138at the distal ends140of the electrical wires108such that the token green object114is in physical and electrical contact with the contact electrodes138. This arrangement is better illustrated inFIGS.3A,3B, and3C, which show enlarged views of a portion of the example support structure140with a token green object118resting on a surface142of the structure140. As shown inFIGS.3A and3B, the contact electrodes138can be flush or level with the surface142of the support structure140to enable physical and electrical contact between the token green object114and the electrodes138. In other examples, as shown inFIG.3C, the contact electrodes138can be proud of, or elevated above the surface142of the support structure140which can help to improve physical and electrical contact between the electrodes138and the token green object114. The support structure140shown herein, for example atFIGS.2,3A,3B,3C,4A, and4B, is provided by way of an example and is not intended to indicate any limitation as to the size, shape, or other characteristics of such a structure. This is because features of the support structure140, such as its size and shape, can depend in part on the size and shape of the token green object114that it will be supporting during a sintering process. Therefore, in other examples the support structure140can have different sizes and shapes in order to accommodate different token green objects114having different sizes and shapes. FIGS.4A and4Bshow enlarged partial views of an example support structure140disposed on a furnace shelf130and supporting a token green object114both before and after undergoing densification in a sintering process. In this example arrangement comprising four electrical wires108, four corresponding electrodes138coupled at the distal ends136of the wires108provide physical and electrical contact with the token green object114. In an example operation to take an electrical measurement of the token green object114, the impedance meter104can apply a small AC voltage across the object114and then measure the current induced through the object114. The impedance meter104can then divide the applied voltage by the measured current to determine the impedance of the token green object114. The example token green object114comprises a sacrificial object that can be produced in the same manufacturing process batch as the other green objects116being sintered within the same furnace load as the token object114, as shown inFIG.2. As noted above,FIG.2shows an example of a furnace rack112loaded with objects that include both a token green object114and a number of other green objects116that are to be sintered in a same sintering process. The token object114can be produced in a same manufacturing process as the other green objects116, such as in the same 3D binder jetting process or the same MIM process. The token object114is therefore materially and mechanically representative of the other green objects116. For example, both the token object114and the green objects116can comprise the same type of powder metal material having the same material density and particle sizes. In addition, both the token object114and the green objects116will have had the same binder material added during the manufacturing process, and both will have been exposed to the same processing steps during manufacturing. In a 3D binder jetting process, for example, both the token object114and the other green objects116will undergo the same procedures such as powder layering, binder jetting, and radiation exposure using the same powder metal materials, the same binder liquid, the same binder liquid droplet sizes, the same radiation intensity, and so on. Because the token green object114and the other green objects116comprise the same type of powder material with the same density and particle sizes, they behave in the same or similar manner during the sintering process. That is, during sintering, the green objects116undergo the same material densification and dimensional contraction as the token object114which is being electrically monitored. While the token object114may not be the same shape or size as the other green objects116, the token object114can be designed to match the average wall thickness of the green objects116to be sintered. Regardless, however, the sintering time of green objects does not change significantly based on the relative thickness or size of the objects. Rather, the main factors that determine sintering times are the density of the object, the material type, and the particle size distribution of the material. The object thickness and size are of less significance in affecting sintering times because the time constants for heat transfer are smaller than the time constants for sintering. Thus, the time to heat both a small and large object, or a thin and thick object, is mostly insignificant in comparison to the time it takes the objects to begin densification during the sintering process. Therefore, the sintering time for a smaller object such as a token object114, is very close to the sintering time for a larger object such as the other green objects116shown inFIG.2. Consequently, dimensional changes in the token object114that occur during sintering can be used to indicate corresponding changes in the other green objects116throughout the sintering process, including indicating the point when the sintering process reaches an endpoint. Referring again generally toFIG.4A, when a token green object114is first loaded onto the support structure140(FIG.4A), its shape and size are in a non-densified state. The geometry of the object114can remain in this state during part of a sintering process, such as during the burnout phase, but the object begins to densify and shrink at some point after the furnace102reaches the sintering temperature. During a binder burnout phase, for example, when the furnace can reach temperatures on the order of 400° C., the size and shape of the object114will remain generally unchanged, because the object114will not yet be densifying. As shown inFIG.4B, the token green object114has undergone a sintering process and has densified (i.e. shrunk), causing one end of the object114to move down the surface142of the support structure140, as indicated by the direction arrow144shown inFIGS.4A and4B. As the object114densifies, however, it remains in physical and electrical contact with the contact electrodes138being held in place by the support structure140. As noted above, an increasing density in the object114has the general effect of reducing the impedance in the object114. The decrease in impedance is generally due to an increase in the number-density of free electrons that corresponds with the increase in density. Thus, as the object114shrinks during sintering, its impedance decreases. The impedance of the token green object114can be measured in a number of ways, using different arrangements of electrical wires for applying AC voltage across the object114and taking electrical measurements, as noted above. FIG.5shows an example of a 4-wire impedance measurement circuit146suitable for measuring the impedance (ZT) of a token green object114during a sintering process. The 4-wire circuit ofFIG.5corresponds with the 4-wire arrangement of system100discussed above and shown inFIGS.1,2,4A, and4B. Impedance measurement circuits generally include an impedance meter104, and they can be arranged as 2-wire measurement circuits, 3-wire measurement circuits, or 4-wire measurement circuits, such as the 4-wire circuit146shown inFIG.5. The accuracy of impedance measurement circuits decreases as the number of wires used decreases. Thus, the 4-wire circuit is more accurate than both the 3-wire circuit and 2-wire circuit, and the 3-wire circuit is more accurate that the 2-wire circuit. The impedance meter104in such circuits generally operates by providing a small, known AC voltage from a voltage source148, to be applied across an impedance (Z) being measured. The impedance meter104then measures the current (I) through the impedance Z with a current meter150within the impedance meter. The impedance meter then calculates the value of the impedance Z using the applied voltage and the measured current. Referring primarily toFIG.5, but also toFIGS.4A and4B, the example 4-wire impedance measurement circuit146includes an impedance meter104and an outer or first set152of two wires to apply an AC voltage from the voltage source148within the impedance meter across the impedance ZTbeing measured (i.e., the impedance of the token green object114). The 4-wire measurement circuit146also includes an inner or second set154of two wires as sensing wires to sense the current (I) through the impedance ZTof the token green object114that can be measured by a current meter150within the impedance meter. The impedance meter104can then calculate the value of ZTusing the applied voltage and measured current. In different examples, the controller106(FIG.1) can analyze information from the impedance meter104during a sintering process to determine when the token green object114and other green objects116have reached a sintering endpoint. In one example, the controller106can obtain the value of impedance ZTmeasured by the impedance meter104during sintering, and compare it with a predetermined target impedance value that is experimentally known to correspond with the point at which the token green object114will have reached the sintering endpoint. As noted above, the electrical impedance of a green object decreases to a degree that is inversely proportional to about the same degree that the density increases. Thus, as the token green object114densifies and shrinks during sintering from a non-densified state as inFIG.4Ato a densified state as inFIG.4B, for example, the decreasing impedance ZTmeasured across the object can be used to indirectly observe the degree of densification that has occurred. When the impedance ZTreaches the predetermined target impedance value, the controller106can determine that the token green object114and other green objects116have reached the sintering endpoint. The controller106can then control the sintering cycle, for example, by initiating a furnace cool down phase. In some examples, the controller106can analyze information from the impedance meter104during a sintering process to determine a measured rate of change of the impedance ZTmeasured across the token green object114. The controller106can compare the rate of change of the measured impedance ZTwith a predetermined target rate of change of impedance that is experimentally known to correspond with the point at which the token green object114will have reached the sintering endpoint. When the rate of change of the measured impedance ZTreaches the target rate of change of impedance, the controller106can determine that the token green object114and other green objects116have reached the sintering endpoint, and can initiate a furnace cool down phase. In some examples, different electrical parameters of a token green object114can be measured during sintering and compared to target electrical parameter values to determine when the token green object114and other green objects116have reached a sintering endpoint. Examples of such electrical parameters can include resistance, imaginary impedance, capacitance, inductance, conductance, admittance, and conductivity. FIGS.6A and6Bshow enlarged partial views of an example support structure140disposed on a furnace shelf130and supporting a token green object114both before and after undergoing densification in a sintering process. The support structure140shown inFIGS.6A and6Bis arranged to facilitate wires108and electrodes136of a 2-wire impedance measurement circuit for measuring the impedance (ZT) of a token green object114during a sintering process.FIG.6Cshows an example of a 2-wire impedance measurement circuit156that may be implemented with a support structure140as inFIGS.6A and6B, and that is suitable for measuring the impedance (ZT) of a token green object114during a sintering process. In a similar manner as discussed above with regard toFIGS.4A and4B, when a token green object114is first loaded onto the support structure140as inFIG.6A, its shape and size are in a non-densified state. The geometry of the object114can remain in this state during part of a sintering process, such as during the burnout phase, but the object begins to densify and shrink at some point after the furnace102reaches the sintering temperature. As shown inFIG.6B, the token green object114has undergone a sintering process and has densified (i.e. shrunk), causing one end of the object114to move down the surface142of the support structure140, as indicated by the direction arrow144. As the object114densifies, it remains in physical and electrical contact with the two contact electrodes138being held in place by the support structure140. As the object114densifies, its decreasing electrical impedance ZTcan be measured by the example 2-wire impedance measurement circuit156ofFIG.6C. The example 2-wire impedance measurement circuit156ofFIG.6Cincludes an impedance meter104and two wires108to deliver a small AC voltage from an AC voltage source148in the impedance meter across the impedance ZTbeing measured (i.e., the impedance of the token green object114). In the 2-wire measurement circuit156, the same two wires108that apply the AC voltage also act as sensing wires to sense the current (I) through the impedance ZTof the token green object114that can be measured by a current meter150within the impedance meter. During a sintering process, the impedance meter104can be controlled to provide the AC voltage, measure the current (I) through the object114, and calculate the value of ZT. FIGS.7A and7Bshow enlarged partial views of an example support structure140disposed on a furnace shelf130and supporting a token green object114both before and after undergoing densification in a sintering process. The support structure140shown inFIGS.7A and7Bis arranged to facilitate wires108and electrodes136of a 3-wire impedance measurement circuit for measuring the impedance (ZT) of a token green object114during a sintering process.FIG.7Cshows an example of a 3-wire impedance measurement circuit158that may be implemented with a support structure140as inFIGS.7A and7B, and that is suitable for measuring the impedance (ZT) of a token green object114during a sintering process. In a similar manner as discussed above with regard toFIGS.4A and4B, when a token green object114is first loaded onto the support structure140as inFIG.7A, its shape and size are in a non-densified state. The geometry of the object114can remain in this state during part of a sintering process, such as during the burnout phase, but the object begins to densify and shrink at some point after the furnace102reaches the sintering temperature. As shown inFIG.7B, the token green object114has undergone a sintering process and has densified (i.e. shrunk), causing one end of the object114to move down the surface142of the support structure140, as indicated by the direction arrow144. As the object114densifies, it remains in physical and electrical contact with the three contact electrodes138being held in place by the support structure140. As the object114densifies, its decreasing electrical impedance ZTcan be measured by the example 3-wire impedance measurement circuit158ofFIG.7C. The example 3-wire impedance measurement circuit158ofFIG.7Cincludes an impedance meter104and a set of two wires160to provide an AC voltage from a voltage source148in the impedance meter across the impedance ZTbeing measured (i.e., the impedance of the token green object114). In the 3-wire measurement circuit158, a different set of two wires162act as sensing wires to sense the current (I) through the impedance ZTof the token green object114that can be measured by a current meter150within the impedance meter. As shown inFIG.7C, one of the wires108of circuit158is shared between both the sets of wires160and162. During a sintering process, the impedance meter104can be controlled to provide the AC voltage, measure the current (I) the object114, and calculate the value of ZT. As discussed above with regard to the example 4-wire impedance measurement circuit146ofFIG.5, in different examples, the controller106(FIG.1) can analyze information from the impedance meter104of a 2-wire circuit156(FIG.6C) and a 3 wire circuit158(FIG.7C) during a sintering process to determine when the token green object114and other green objects116have reached a sintering endpoint. Thus, the controller106can obtain the value of impedance ZTmeasured by the impedance meter104during sintering, and compare it with a predetermined target impedance value that is experimentally known to correspond with the point at which the token green object114will have reached the sintering endpoint. When the impedance ZTreaches the predetermined target impedance value, the controller106can determine that the token green object114and other green objects116have reached the sintering endpoint. The controller106can then control the sintering cycle, for example, by initiating a furnace cool down phase. In other examples, the controller106can analyze information from the impedance meter104of a 2-wire circuit156(FIG.6C) and a 3 wire circuit158(FIG.7C) during a sintering process to determine a measured rate of change of the impedance ZTmeasured across the token green object114. The controller106can compare the rate of change of the measured impedance ZTwith a predetermined target rate of change of impedance that is experimentally known to correspond with the point at which the token green object114will have reached the sintering endpoint. When the rate of change of the measured impedance ZTreaches the target rate of change of impedance, the controller106can determine that the token green object114and other green objects116have reached the sintering endpoint, and can initiate a furnace cool down phase. Referring now toFIGS.5,6C, and7C, each impedance ZWshown in respective circuits146,156, and158, represents the inherent impedance in the associated wires108and electrodes138coupled at the distal ends136of the wires108, as well as other couplings (not shown). The impedance ZWis shown inFIGS.5,6C, and7C, to help illustrate how the 4-wire impedance measurement circuit146provides a more accurate measure of the impedance ZTthan the 2-wire and 3-wire impedance measurement circuits. In general, when measuring for the impedance ZTin each of the example circuits146,156,158, the impedance meter104measures the total impedance along the path of a wire108. This measurement includes a series combination of ZWplus ZTplus ZW. Thus, the value of such a measurement for ZTcan be too high. Depending on the wires108, electrodes138, and other connections, the inherent impedance ZWcan cause a significant error in the measurement of ZT. In the example 2-wire circuit156ofFIG.6C, the error caused by the inherent impedance ZWis not avoidable. In the example 4-wire circuit146ofFIG.5, when measuring for the impedance ZT, error caused by the inherent impedance ZWcan be mostly avoided. In the 4-wire circuit146ofFIG.5, there are separate sets of dedicated wires152and154. The set of wires152is for applying AC voltage across the impedance ZTto be measured, and the set of wires154is for measuring the current (I) through the impedance ZT. In the 4-wire circuit146, it does not matter if there is inherent impedance ZWin the wires108and electrodes136, because the voltage source148provides the same voltage that does not vary as current passes through any of the impedances ZWor ZT. Because there is a separate set154of wires108to measure the current (I) through the impedance ZT, the impedance in this set154of wires108does not affect the current measurement. In the example 3-wire circuit158ofFIG.7C, when measuring for the impedance ZT, some of the error caused by the inherent impedance ZWcan be avoided. In the 3-wire circuit158ofFIG.7C, there are separate sets of wires160and162, but each set shares the lower wire108with impedance ZW3as shown in the circuit158. Using internal switching, the impedance meter104can measure the impedance in the upper part of the circuit that includes ZW1and ZW2, as well as the impedance in the lower part of the circuit that includes ZW2and ZW3. The impedance meter can divide the upper measurement by two to get an average of the impedances ZW1and ZW2, and then use that average as the impedance for ZW3when it measures the lower part of the circuit158. The 3-wire circuit158can be accurate if the impedances ZW1, ZW2, and ZW3, are equal or very close in value. FIGS.8and9are flow diagrams showing example methods,800and900, of sintering. Method900comprises an extension of method800and thereby incorporates additional details of method800. The methods are associated with examples discussed above with regard toFIGS.1-7, and details of the operations shown in the methods can be found in the related discussion of such examples. The operations of the methods may be embodied as programming instructions stored on a memory of a controller106and executable on controller106. Referring now to the flow diagram ofFIG.8, an example method of sintering,800, begins at block802with heating a sintering furnace to a sintering temperature during a sintering process. The method includes measuring electrical impedance across a token green object in the furnace during the sintering process (804), and determining a sintering endpoint when the impedance reaches a target impedance (806). The method can further include initiating a furnace cool down phase based on determining the sintering endpoint (808). Referring to the flow diagram ofFIG.9, another example method of sintering,900, begins at block902with heating a sintering furnace to a sintering temperature during a sintering process. The method includes measuring electrical impedance across a token green object in the furnace during the sintering process (904). In some examples, measuring electrical impedance can include applying an AC voltage across the token green object, measuring current through the object, and calculating the impedance from the applied voltage and the measured current. In some examples, applying voltage and measuring current can include, respectively, applying voltage through two wires operatively coupled to the object, and measuring current through the two wires (906). In other examples, applying voltage and measuring current can include, respectively, applying voltage through a first set of two wires operatively coupled to the object, and measuring current through a second set of two wires operatively coupled to the object (908). In other examples, applying voltage and measuring current can include, respectively, applying voltage through first and third wires operatively coupled to the object, and measuring current through a second wire and the third wire operatively coupled to the object (910). The method further includes determining a sintering endpoint when the measured impedance reaches a target impedance (912), and initiating a furnace cool down phase based on determining the sintering endpoint (914). | 43,124 |
11858042 | To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the drawings. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION Aspects of the present disclosure provide apparatuses, methods, processing systems, and computer-readable mediums for determining optimal process parameters for additive manufacturing processes. As above, manual discovery of optimal process parameters is a challenging if not intractable problem. Setting such process parameters generally involves making changes to machine control code that may span thousands, tens of thousands, or even more lines of code. Simply finding the right line of code to modify in hopes of correcting a manufacturing issue can be significantly challenging, much less finding and making detailed modifications to any number of lines of control code. Further, a single change to line of machine control code may have interactions with other control codes, and therefore may create knock-on effects that must be dealt with subsequently. Because such process parameters can significantly affect characteristics of a built part, which can in-turn affect its performance and, for example, safety in use, it is critical to determine optimal process parameters for additive manufacturing. One approach for improving process parameter determination is through closed-loop control of the additive manufacturing process based on sensor feedback. For example, if a certain temperature of a laser metal deposition melt-pool is desired through the manufacturing process, a temperature sensor can continually measure the melt-pool temperature and dynamically adjust laser power to adjust the temperature up and down during the processing. While closed-loop control offers many benefits over conventional “guess and check” approaches for determining process parameters for additive manufacturing, it may not always be an available approach. For example, for building certain parts according to certification requirements, closed-loop control of the manufacturing process may not be allowed. At least one rationale behind such a limitation is that to meet the certification requirements, which may be intended to guarantee part quality, safety, etc., the manufacturing process should be repeatable according to established, provable, and consistent process parameters. Deviation from those process parameters may suggest some manufacturing issue that should prevent the part from being used in a critical application, such as a safety application. Accordingly, aspects described herein relate to using closed-loop control of an additive manufacturing process to determine optimal process parameters for an open-loop control mode. For example, a test part may be built using an initial set of process parameters with closed-loop control activated during the build process. During the build, the closed-loop control may modify various process parameters from their original values based on sensor feedback. These variations may then be analyzed after a build and used to modify the initial set of process parameters to generate an improved set of process parameters. This process may be performed iteratively, if necessary, to ultimately discover optimal process parameters. The optimal process parameters may then replace the initial set of process parameters and be used in an open-loop additive manufacturing control mode, which may comply with certification rules and protocols for manufacturing certain types of parts. Beneficially, aspects described herein lead to improved additive manufacturing processes that are repeatable, which in-turn lead to higher quality, more durable, more reliable, safer, and certifiable parts. Further, significantly less material and energy is wasted in pursuit of such improved process parameters compared to conventional guess and check methods. Example Additive Manufacturing System FIG.1depicts an example of an additive manufacturing system100, which may be configured to perform various aspects described herein. In this example, additive manufacturing system100includes a user interface102. User interface102may be, for example, a graphical user interface comprising hardware and software controls for controlling additive manufacturing system100. In some examples, user interface102may be integral with additive manufacturing system100while in other examples user interface102may be remote from additive manufacturing system100(e.g., on a remote computer such as a server computer, desktop or laptop computer, or a personal electronic device, such as a smartphone, tablet computer, or a smart wearable device, to name a few examples). Additive manufacturing system100also includes a control system104. In this example, control system104is in data communication with user interface102as well as directed energy source106, material delivery system108, gas delivery system110, process motion system112, sensors114, sensors116, build surface motion system124, and cooling system132. In other examples, control system104may be in data communication with further elements of additive manufacturing system100, which are not depicted in this example. Further, in other examples, control system104may be in data communication with fewer elements of additive manufacturing system100, such as where another embodiment of an additive manufacturing system includes fewer elements compared to the example ofFIG.1. Control system104may include hardware and software for controlling various aspects of additive manufacturing system100. For example, control system104may include one or more processors, memories, data storages, physical interfaces, software interfaces, software programs, firmwares, and other aspects in order to coordinate and control the various elements of additive manufacturing system100. In some examples, control system104may include network connectivity to various aspects of additive manufacturing system100as well as to external networks, such as the Internet and other networks, such as local area networks (LANs) and wide area networks (WANs). In some examples, control system104may be a purpose-built logic board, microcontroller, field programmable gate array (FPGA), or the like, while in other examples control system104may be implemented by a general purpose computer with specific software components for controlling the various aspects of additive manufacturing system100. Control system104may generally interpret commands received from user interface102and thereafter cause appropriate control signals to be transmitted to other aspects of additive manufacturing system100. For example, a user may input data representing a part to be processed using additive manufacturing system100into user interface102and control system104may act upon that input to cause additive manufacturing system100to process the part. In some examples, control system104may compile and execute machine control codes, such as G-code data, that causes aspects of additive manufacturing machine100to operate. For example, the machine control codes may cause process motion system112or build surface motion system124to move to specific positions and at specific speeds. As another example, the machine control codes may cause directed energy source106, material delivery system108, gas delivery system110, or cooling system132to activate or deactivate at specific times, locations, or based on specific conditions, such as operating conditions, sensor readings, and the like. Further, the machine control codes may modulate the operation (e.g., via a settable operational parameter) of the aforementioned aspects of additive manufacturing machine100, such as by increasing or decreasing the power of directed energy source106, increasing or decreasing the flow rate of material delivery system108or gas delivery system110, increasing or decreasing the working distance of deposition element120, increasing or decreasing a scan speed of deposition element120, increasing or decreasing amount of cooling by cooling system132, etc., based on time, location, and/or conditions, such as operating conditions, sensor readings, and the like. Process motion system112may move elements of additive manufacturing system100to specified positions. For example, process motion system112may position deposition element120at a specified distance from a part layer122being manufactured, or move deposition element120along a preprogrammed path to build up a three-dimensional part. Additive manufacturing system100may include various sensors to monitor and to help control aspects of a manufacturing process through active feedback. In some embodiments, sensors114may be connected to process motion system112such that the sensors are configured to move with process motion system112. For example, sensors114may include one or more temperature sensor, distance sensors, optical sensors (e.g., camera or video sensors), profilometers (e.g., optical, laser, and others), acoustic sensors, material flow sensors, and other sensors, each of which may be configured to provide operational data during processing by additive manufacturing system100. For example, temperature sensors may provide point temperature measurements, temperature gradients, heat maps, etc. In some embodiments, a temperature sensor of sensors114may be any sort of sensor capable of measuring temperature to an object. In some examples, the temperature sensor114may include a contact-based sensor, such as a thermocouple, while in others, the temperature sensor may be a contact-less sensor, such as a photo or laser-based sensor. One or more temperature sensors may provide various types of temperature data back to control system104, for example, to provide data for closed-loop control of directed energy source106, gas delivery system110, cooling system132, and process motion system112(e.g., to control a scan speed of deposition element120and/or working distance of deposition element120). In some embodiments, sensors114may include various forms of optical sensors (e.g., image and/or camera sensors), such as a visible spectrum optical sensor, or a non-visible spectrum (e.g., infrared) optical sensor. In some examples, the same sensor may be able to provide data in multiple spectrums. Further, additive manufacturing system100may include optics that allow for directing, changing (e.g., zoom), and focusing a field of view of an optical sensor. Optical sensors may generally provide various types of image data, including infrared heat data, back to control system104, for example, to provide data for closed-loop control of directed energy source106, gas delivery system110, cooling system132, and process motion system112(e.g., to control a scan speed of deposition element120and/or working distance of deposition element120). For example, an infrared-based optical sensors (e.g., an infrared image sensor) may be used to view heat distributions and gradients in part layers122. As another example, an infrared-based optical sensor may be used to measure process area (e.g., melt-pool) size, position, geometry, and the like. In some embodiments, various sensors, such as image sensors and contactless temperature and distance sensors, may be configured to sense an active processing area136, such as a melt-pool created by deposition element120. For example, a boresight camera or other sensor may be configured with optics that allow for “looking” down the directed energy axis (e.g., axis of beam134) towards the part being manufactured, such as by using turning mirrors, one-way mirrors, and other optical elements. Directed energy source106may provide any suitable form of directed energy, such as a laser beam (e.g., from a fiber laser) or an electron beam generator, which is capable of melting a manufacturing material, such as a metal powder. Directed energy source106may interact with directed energy guides118in order to, for example, direct or focus a particular type of directed energy. For example, directed energy guides118may comprise one or more optical elements, such as mirrors, lenses, filters, and the like, configured to focus a directed energy beam (e.g., laser beam) at a specific focal point (e.g., active processing area136) and to control the size of the focal point. In this way, the actual creation of the directed energy beam by directed energy source106may be located remote from the manipulation and focusing of the directed energy by directed energy guides118. In some embodiments, directed energy source106may also be used to remove material from a manufactured part, such as by ablation. Further, directed energy source106may also be used to perform hardening and surface polishing. These are just some examples, and others are possible. Material delivery system108may supply building material, such as a powder or wire, to deposition element120. In some examples, material delivery system108may be a remote reservoir including one or more types of raw material (e.g., different types of metal) to be used by additive manufacturing system100. Material delivery system108may be configured to provide one or more materials simultaneously to deposition element120, such that multiple materials (e.g., metal alloys) may be deposited in part layers122(e.g., forming hybrid material layers). Deposition element120may be connected with material delivery system108and may direct material, such as powder, towards a focal point of directed energy beam134. In this way, material delivery system108may help control the amount of material that is additively manufactured at a particular point in time. Deposition element120may include nozzles, apertures, and other features for directing material, such as metal powder, towards a manufacturing surface, such as a build surface or previously deposited material layer. In some examples, deposition element120may have controllable characteristics, such as controllable nozzle aperture sizes. In some embodiments, deposition element120may be a nozzle assembly or deposition head of a directed energy deposition machine, such as a laser metal deposition machine. Laser metal deposition is a laser-based additive manufacturing process in which metal structures are built up on a substrate or metal layers and structures are applied to existing components (e.g., cladding) in layers. In laser metal deposition, a laser generates a molten pool (or melt-pool) on an existing surface into which metal powder is directed through a nozzle in a deposition head (e.g., using a carrier gas). The powder melts and bonds with the base material in the molten pool thereby forming new layers and ultimately structures additively. Gas delivery system110may be connected with deposition element120to provide propulsive force to the material provided by material delivery system108, such as by use of carrier gas. In some examples, gas delivery system110may modulate the gas flow rate to control material (e.g., powder) flow through deposition element120and/or to provide cooling effect during the manufacturing process. Gas delivery system110may include feeds for a plurality of gas flows, such as carrier gas (as described above) as well as shield gas and auxiliary gas flows, such as directed actively cooled gas flows. Gas delivery system110may also include feeds for different types of gases so that, for example, different gases may be used for carrier gases, shield gases and auxiliary gases. Gas delivery system110may further be configured to provide different gas flows at different rates under the control of control system104. Gas delivery system110may also be connected with cooling system132, which may actively cool any of the gas aforementioned gas flows (e.g., carrier, shield, and auxiliary). Cooling system132may be configured to apply different amounts of cooling to different gases under the control of control system104. Notably, while directed energy source106, material delivery system108, gas delivery system110, sensors114, sensors116, directed energy guides118, and deposition element120are shown in an example configuration inFIG.1, other configurations are possible. Process motion system112may control the positioning of one or more aspects of additive manufacturing system100, such as sensors114, sensors116, and deposition element120. In some examples, process motion system112may be movable in one or more degrees of freedom (e.g., three to six degrees of freedom). For example, process motion system112may move and rotate deposition element120in and about the X, Y, and Z axes during the manufacturing of part layers122. For example, rotation about the X axis may be referred to as the ‘A’ axis, rotation about the Y axis may be referred to as the ‘B’ axis, and rotation about the Z axis may be referred to as the ‘C’ axis. Though not depicted, in various embodiments, process motion system112may include cooling elements, such as cooling tubes, fins, channels, lines, and the like. In some embodiments, cooling system132may be configured to actively control the temperature of (e.g., to cool) process motion system112, or parts thereof, such as sensors114. Build surface motion system124may control the positioning of, for example, a build surface upon which part layers122are manufactured. In some examples, build surface motion system124may be movable in and about one or more degrees of freedom. For example, build surface motion system124may move and rotate the build surface in and about the X, Y, and Z axes during the manufacturing of part layers122. In some examples, the build surface may be referred to as a build plate or build substrate. Build surface motion system124may also comprise sensors116, which may include, for example, load sensors, temperature sensors (e.g., a substrate temperature sensor), position sensors, and other sensors that may provide useful information to control system104. For example, a temperature sensor within build surface motion system may cause control system104to increase cooling via cooling system132, or to decrease power to a directed energy source, and the like. Though not depicted, in various embodiments, build surface motion system124may include cooling elements, such as cooling tubes, fins, channels, and the like. In some embodiments, cooling system132may be configured to actively control the temperature of (e.g., to cool) build surface motion system124, or parts thereof, such as a substrate of build surface motion system124. Cooling system132may be any sort of active cooling system, such as refrigeration system, a vortex cooler, evaporative gas cooling system, heat pump, and others. Active cooling generally refers to taking an input coolant medium (e.g., fluid or gas) and extracting heat from that coolant medium such that the output coolant medium has a lowered temperature. Computer-Aided Design (CAD) software126may be used to design a digital representation of a part to be manufactured, such as a 3D model. CAD software126may be used to create 3D design models in standard data formats, such as DXF, STP, IGS, STL, and others. While shown separate from additive manufacturing system100inFIG.1, in some examples CAD software126may be integrated with additive manufacturing system100. Slicing software130may be used to “slice” a 3D design model into a plurality of slices or design layers. Such slices or design layers may be used for the layer-by-layer additive manufacturing of parts using, for example, additive manufacturing system100. Computer-Aided Manufacturing (CAM) software128may be used to create machine control codes, for example, G-Code, for the control of additive manufacturing system100. For example, CAM software128may create code in order to direct additive manufacturing system100to deposit a material layer along a 2D plane, such as a build surface, in order to build or process a part. Building layers on multiple 2D planes creates 3D structures and surface. For example, as shown inFIG.1, part layers122are manufactured on (e.g., deposited on, formed on, processed on, etc.) build surface motion system124using process motion system112and deposition element120. In some cases, the slicing of a part model may not be planar, in which case additive manufacturing system100may be configured to deposit material on non-planar surfaces (e.g., on 3D surfaces). In some examples, one or more of CAD software126, CAM software128, and Slicing Software130may be combined into a single piece or suite of software. For example, CAD or CAM software may have an integrated slicing function. Additive manufacturing system100may generally be operated in an open-loop or closed-loop control mode (e.g., as controlled by control system104). For example, in an open-loop control mode, additive manufacturing system100may rely directly on process parameters in a build file comprising machine control codes (e.g., G-codes) to operate its various aspects, including process motion system112, build surface motion system124, directed energy source106, material delivery system108, gas delivery system110, cooling system132, and other aspects not shown but otherwise described herein. In an open-loop control mode, data from sensors (e.g., sensors114and sensors116) may be recorded, but not used for control of additive manufacturing system100. By contrast, in a closed-loop control mode, additive manufacturing system100may rely on process parameters in a build file comprising machine control codes as well as active sensor feedback (e.g., sensors114and sensors116) to operate its various aspects, including process motion system112, build surface motion system124, directed energy source106, material delivery system108, gas delivery system110, cooling system132, and other aspects not shown but otherwise described herein. Thus, initial process parameters in a build file may be overridden during the build process based on sensor data, various thresholds, and the like. Process Parameter Optimization for Additive Manufacturing FIG.2depicts an example process parameter optimization component202. In the depicted example, parameter optimization component202includes various illustrative sub-components to more clearly demonstrate various aspects of parameter optimization component202's operation. However, note that in other embodiments, parameter optimization component202may include the same functionalities as described herein regardless of the existence of specific sub-components. Further, process parameter optimization component202is depicted as a sub-component of control system104, but in other embodiments it may be a standalone component configured to work in conjunction with control system104. In this example, parameter optimization component202includes a data capture component203. Data capture component203may generally be configured to control the capture of data from any aspect of additive manufacturing system100, as described above with respect toFIG.1. In some embodiments, data capture component203may store captured data in build log files214. Build (or process) log files214may generally include data regarding the operation of any of the components of additive manufacturing system100, as described above with respect toFIG.1. For example, build log files214may include parameters, measurements, time-stamps, and other data regarding the operation of process motion system112, build surface motion system124, directed energy source106, material delivery system108, gas delivery system110, cooling system132, and other aspects not shown but otherwise described herein. Data capture component203may be configured to control, for example, when data is captured from various aspects of additive manufacturing system100, as well as the resolution of that data (e.g., the frequency of data sampling in samples/second or Hz). For example, data capture component203may be configured to disable data capture when additive manufacturing system100is not depositing material, but enable data capture when additive manufacturing system is depositing material. Similarly, data capture component203may be configured to turn on and off sensors based on which aspects of additive manufacturing system100are active. Further, in some embodiments, data capture component203may be configured to vary the rate of data capture based on, for example, the complexity or geometry of the underlying layer being built. By way of example, a data capture rate for a straight line of deposited material may be lower than another data capture rate for a complex or sharp curve. As another example, the data capture rate may be scaled based on the speed of movement of an aspect of additive manufacturing system100, such as the speed of process motion system112and/or build surface motion system124. By controlling various aspects of data capture based on operating conditions, data capture component203may significantly reduce the amount of data storage needed during a build. This is especially important where additive manufacturing builds can take significant periods of time leading to significantly large build log files. In this example, parameter optimization component202further includes a closed-loop control analyzer component204configured to identify differences between initial process parameters (e.g.,212) and actual process parameters used during a build process using closed-loop control. The actual process parameters may be stored, for example, in build log files214by data capture component203. For example, consider the following set of initial parameters and closed-loop control parameters for controlling a laser's power over a portion of a build path in a given layer: TABLE 1Initial ProcessClosed-LoopCommand DescriptionParametersParametersPosition process motionG00 X1 Y1G00 X1 Y1system at coordinates (1,1)Enable laser (M03)M03 S255M03 S205and set power level (S)Move process motionG01 X500G01 X500system (G01) toY1 F500Y1 F500coordinates(X, Y) at speed (F)Disable laser (M05)M05 S0M05 S0and set power (S) As depicted in Table 1, an initial set of process parameters may include enabling a laser and setting it to a max power setting (e.g., where the power settings are between S0-S255 in this example). However, during closed-loop control, the laser power parameter was modified to S205(e.g., the laser power was reduced). The laser power may have been reduced, for example, based on a temperature reading indicating that a melt-pool was getting too hot. The melt-pool getting too hot may have otherwise negatively affected the part quality using the initial process parameters212. Closed-loop control analyzer component204may detect the differences between initial process parameters (e.g.,212) and closed-loop control parameters stored in build log files214, such as by comparing lines of build code with initial process parameters (describing what an additive manufacturing machine was originally set to do) to lines of build log files (describing what the additive manufacturing machine actually did do). Note that closed-loop control analyzer may overcome a conventional challenge with trying to update process parameters manually. Because a build file may include thousands, tens of thousands, or even more lines of build code, generally without detailed reference to what specific aspect of a part is being built by a particular line of code, it is impractical if not impossible to perform this step by manual, human analysis. The sheer number of pairwise comparisons makes the job extremely complex and computationally intensive, and thus is not suitable for human analysis and manipulation. Once differences between initial process parameters and actual process parameters (e.g., based on closed-loop control), such as those stored in build log files214, are established by closed-loop control analyzer component204, threshold detection component206may determine whether a detected difference is significant enough to modify the initial process parameter for future builds (e.g., by modifying a process parameter in a build file). For example, threshold detection component206may use one or more threshold rules to determine whether each detected difference should be committed as a modified process parameters216. In some embodiments, there may be process parameter-specific threshold rules, such as a threshold rule for laser power, a different threshold rule for scan rate, a further threshold rule for powder feed rate, and so on. Returning to the example of Table 1, consider that a laser power threshold for process parameter modification is +/−5%. Because in this example the initial process parameter was 255 and the closed-loop control parameter was 205, then the change is negative 20%, which triggers a modification to the process parameter (e.g., a change to one or more lines in a build file), which may be stored in modified process parameters216subject to further considerations, described below. In this example, parameter optimization component202further includes a build quality component208. In some cases, whether an initial process parameter modified by a closed-loop control mode of control system104is ultimately committed to an updated build file as a modified process parameter (e.g.,216) may depend on whether the build resulting from the closed-loop control mode is of sufficient quality. In some embodiments, a determined build quality may require manual feedback of an operator, such as an inspection followed by a data entry provided to the build quality component208. In other cases, the determined build quality may be based on an automated analysis of the built part performed by aspects of additive manufacturing system100. For example, a laser profilometer of sensors114may provide a quality score based on the similarity of the built part to the underlying model. This similarity may be compared then to thresholds to determine if the similarity is sufficient to accept the modified process parameters. In either case, e.g., manual or automated build quality analysis, having a sufficient build quality may act as a gate to whether one or more process parameters modified by a closed-loop control mode become modified process parameters (e.g.,216) for a future build (e.g., integrated into a future build file). Returning to the example above in Table 1, assuming that the resulting build was of sufficient quality, then the new laser power parameter S205may be stored as a modified process parameter216that is used in future builds of the same part. Note that build quality component208may further be used to determine the quality of a build using an open-loop control mode. For example, after modifying certain process parameters, another build may be performed using open-loop control mode by control system104and the resulting build may be analyzed using build quality component208to confirm that the modified process parameters work well in an open-loop control mode. This may be useful when certifying builds and build processes. In this example, parameter optimization component202further includes an open-loop parameter modification component210, which may be configured to provide an interface for modifying initial process parameters based on closed-loop control feedback. For example, open-loop parameter modification component210may present all potential process parameter modifications as determined by closed-loop control analyzer component204to a user in order to determine which modifications should be committed. In some embodiments, open-loop parameter modification component210may pre-process and/or filter potential process parameter modifications based on those that meet threshold tests determined by threshold detection component206, and/or those that meet build quality thresholds as determined by build quality component208, to name a few examples. Further, open-loop parameter modification component210may be configured to control the granularity of the change to a process parameter, such as whether the change applies to a portion of a layer, an entire layer, or a set of layers, or even across an entire model. Various process parameters may be treated differently in terms of the scope of their change within a build file. For example, a material flow rate may be changed for an entire build file, while a laser power may be modified for particular layers, or even particular portions of layers. Many other examples exist. The changes may also be subject to limitations, such as maximum and minimum values, which may relate to additive manufacturing machine capabilities, material limitations, and the like. Further yet, open-loop parameter modification component210may allow for manual changes to process parameters to be entered by a user based on review of data or even “live” during a build process based on observation of a build process. Open-loop parameter modification component210may further include settings for affecting how a process parameter is modified based on feedback data and/or user input. For example, open-loop parameter modification component210may include modification or change rate parameters configured to adjust the speed of modification to avoid parameter oscillation (e.g., where one change in a first direction leads to another change in an opposite direction). Returning to the example above in Table 1, if a rate change parameter for laser power was set to 50% of the determined difference in the parameter, then the modified process parameter may be set to 230 instead of 205 since 50% of the difference of 50 is 25. As another example, assuming that a process parameter is changed multiple times across a build layer (or a portion of a build layer), open-loop parameter modification component210may choose an ending parameter of the layer (or portion of the build layer), or a median or average of the process parameter over the layer (or portion of the build layer), in order to determine a modified process parameter. Such a determination may further be subject to a modification rate parameter, such as described above. In some embodiment, open-loop parameter modification component210may ultimately be the arbiter of which potential process parameter changes are committed as modified process parameters (e.g.,216) and integrated into modified build files. FIG.3depicts an example process flow300for optimizing process parameters for additive manufacturing. In one example, flow300may be implemented by parameter optimization component202ofFIG.2. Flow300begins at step302with performing a build (e.g., using an additive manufacturing apparatus, such as additive manufacturing apparatus100ofFIG.1) using a closed-loop control mode and initial process parameters. For example, the initial process parameters may be in a build file, such as a G-code file configured to control the additive manufacturing machine to build a part. Flow300then proceeds to step304where it is determined if any initial process parameters have been modified during the closed-loop control mode build. For example, closed-loop control analyzer component204may be used to analyze build log files214as described with respect toFIG.2. If at step304, no initial process parameters are modified by the closed-loop control mode, then process304moves to step310where the build file may be committed (e.g., finalized for production of a part). In some cases, step310may involve confirming that the build file produces a part according to defined characteristics. If at step304, one or more initial process parameters are modified by the closed-loop control mode, the flow300proceeds to step306where it is determined whether to commit the changes to the initial process parameters to a modified build file. For example, the determination may be based on parameter deviation thresholds (e.g., determined by threshold detection component206ofFIG.2), build quality characteristics (e.g., determined by build quality component208ofFIG.2), and/or other operator feedback (e.g., determined by open-loop parameter modification component210ofFIG.2). If changes to initial process parameters are committed at step306, thereby creating modified process parameters (e.g.,216ofFIG.2), flow300may return to step302to perform another build in closed-loop control mode. In this example, flow300may be configured to iterate until the process parameters converge and are no longer requiring committed changes (e.g., via step306). In an alternative example, after committing changes to initial process parameters at step306, flow300may proceed to step308. This option may be based on, for example, the changes to initial process parameters being below a threshold amount change (despite being significant enough to warrant a committed change). As another example, this option may be based on an operator override to stop the system from continuing to iterate. As yet another example, this option may be based on reaching a number of build iterations. Other examples are possible. If changes to initial process parameters are not committed at step306, such as if the changes are below a threshold for commitment, flow300proceeds to step308. Here, using a threshold to avoid committing small changes may help the process300to converge on a final set of process parameters, and to avoid oscillation in parameters caused by small variations in processing that do not negatively affect overall build quality. At step308, another build process is performed in an open-loop control mode using process parameters, which may include one or more modified process parameters per step306. The build may thereafter be confirmed to be of sufficient quality (or to meet other characteristics) such that a build file using process parameters (which may include one or more modified process parameters) may be committed at step310. Thereafter, the committed build file maybe used for production of further parts, and may also be certified for part production using the open-loop control mode. Example Method for Optimizing Process Parameters for Additive Manufacturing FIG.4depicts an example method400for optimizing process parameters for additive manufacturing. In one example, method400may be implemented by parameter optimization component202ofFIG.2. Method400begins at step402with determining a change to at least one process parameter of a plurality of process parameters while additively manufacturing a first part using an additive manufacturing apparatus according to a build file comprising machine code defining the plurality of process parameters. For example, a change may be determined by closed-loop control analyzer204ofFIG.2. As described above, additively manufacturing the first part is performed in a closed-loop control mode. In some embodiments, determining the change to the at least one process parameter of the plurality of process parameters includes receiving sensor data from a sensor while additively manufacturing the first part; and determining the change based on the sensor data. In such embodiments, the closed-loop control mode may be based at least in part on the sensor data. In various embodiments, the sensor comprises one or more of a melt-pool temperature sensor, a melt-pool size sensor, a layer height sensor, a powder flow (or material feed rate) sensor; a working distance sensor (e.g., configured to measure a distance between a deposition head and a current deposition surface), an image sensor; a substrate temperature sensor; or an acoustic sensor. In some embodiments, determining the change to the at least one process parameter of the plurality of process parameters comprises receiving the change via a user interface of the additive manufacturing apparatus. For example, a user may input a change while observing the build process or based on review of data from a build process. In some embodiments, determining the change to the at least one process parameter of the plurality of process parameters comprises determining a plurality of incremental changes to the at least one process parameter and determining the change to the at least one process parameter based on an average value or median value of the plurality of incremental changes. In some embodiments, wherein determining the change to the at least one process parameter of the plurality of process parameters comprises determining a plurality of incremental changes to the at least one process parameter and determining the change to the at least one process parameter based on a value of the last incremental change of the plurality of incremental changes. In some embodiments, the change is associated with a single layer of the build file. In other embodiments, the change may be associated with a portion of a layer, such as a particular deposition line or path segment (which may be referred to as an intra-layer change). In further embodiments, the change may be associated with a subset of layers of a build file (e.g., a multi-layer change), or an entire build file (e.g. a model-level change). Method400then proceeds to step404with modifying the build file based on the determined change to the at least one process parameter to generate a modified build file. For example, as described above, modified process parameter may be stored (e.g., in216ofFIG.2) and integrated into modified build files. In some embodiments, modifying the build file based on the determined change to the at least one process parameter comprises averaging a value of the changed at least one process parameter with an initial value of the at least one process parameter. In some embodiments, modifying the build file based on the determined change to the at least one process parameter comprises modifying one or more machine codes in the build file based on the determined change. Method400then proceeds to step406with additively manufacturing a second part using the additive manufacturing apparatus according to the modified build file. Note here that additively manufacturing the “second part” merely indicates a further part is performed in an open-loop control mode. As described above with respect toFIG.3, it is possible that several parts are manufactured in a closed-loop control mode (e.g., step306inFIG.3) while the set of process parameters converges to a final set. In some embodiments, method400further includes recording the change to the at least one process parameter in a process log file. In some embodiments, method400further includes presenting the process log file in a user interface and indicating in the user interface the change to the at least one process parameter in a process log file, such as in user interface102of additive manufacturing system100ofFIG.1. In some embodiment, the at least one process parameter comprises one or more of: a laser power, a scan rate, a material flow rate (e.g., a powder flow rate), or a working distance. Other examples, as described herein, are also possible. In some embodiment, the additive manufacturing apparatus comprises a laser metal deposition apparatus, such as described with respect to the additive manufacturing system100ofFIG.1. Example Clauses Implementation examples are described in the following numbered clauses: Clause 1: A method for optimizing process parameters for additive manufacturing, comprising: determining a change to at least one process parameter of a plurality of process parameters while additively manufacturing a first part using an additive manufacturing apparatus according to a build file comprising machine code defining the plurality of process parameters; modifying the build file based on the determined change to the at least one process parameter to generate a modified build file; and additively manufacturing a second part using the additive manufacturing apparatus according to the modified build file, wherein: additively manufacturing the first part is performed in a closed-loop control mode, and additively manufacturing the second part is performed in an open-loop control mode. Clause 2: The method of Clause 1, wherein determining the change to the at least one process parameter of the plurality of process parameters comprises: receiving sensor data from a sensor while additively manufacturing the first part; and determining the change based on the sensor data, wherein the closed-loop control mode is based at least in part on the sensor data. Clause 3: The method of Clause 2, wherein the sensor comprises one of: a melt-pool temperature sensor; a melt-pool size sensor; a layer height sensor; a working distance sensor; a powder flow sensor; an image sensor; a substrate temperature sensor; or an acoustic sensor. Clause 4: The method of any one of Clauses 1-3, wherein determining the change to the at least one process parameter of the plurality of process parameters comprises receiving the change via a user interface of the additive manufacturing apparatus. Clause 5: The method of any one of Clauses 1-4, wherein modifying the build file based on the determined change to the at least one process parameter comprises averaging a value of the changed at least one process parameter with an initial value of the at least one process parameter. Clause 6: The method of any one of Clauses 1-5, wherein determining the change to the at least one process parameter of the plurality of process parameters comprises determining a plurality of incremental changes to the at least one process parameter and determining the change to the at least one process parameter based on an average value or median value of the plurality of incremental changes. Clause 7: The method of any one of Clauses 1-6, wherein determining the change to the at least one process parameter of the plurality of process parameters comprises determining a plurality of incremental changes to the at least one process parameter and determining the change to the at least one process parameter based on a value of a last incremental change of the plurality of incremental changes. Clause 8: The method of any one of Clauses 1-7, wherein the change is associated with a single layer of the build file. Clause 9: The method of any one of Clauses 1-7, wherein the change is associated with only a portion of a single layer of the build file. Clause 10: The method of any one of Clauses 1-9, further comprising: recording the change to the at least one process parameter in a process log file; presenting the process log file in a user interface; and indicating in the user interface the change to the at least one process parameter in the process log file. Clause 11: The method of any one of Clauses 1-10, wherein the at least one process parameter comprises a laser power. Clause 12: The method of any one of Clauses 1-10, wherein the at least one process parameter comprises a scan rate. Clause 13: The method of any one of Clauses 1-10, wherein the at least one process parameter comprises a material flow rate. Clause 14: The method of any one of Clauses 1-13, wherein modifying the build file based on the determined change to the at least one process parameter comprises modifying one or more machine codes in the build file based on the determined change. Clause 15: The method of any one of Clauses 1-14, wherein the additive manufacturing apparatus comprises a laser metal deposition apparatus. Clause 16: A processing system, comprising: a memory comprising computer-executable instructions; and one or more processors configured to execute the computer-executable instructions and cause the processing system to perform a method in accordance with any one of Clauses 1-15. Clause 17: A processing system, comprising means for performing a method in accordance with any one of Clauses 1-15. Clause 18: A non-transitory computer-readable medium comprising computer-executable instructions that, when executed by one or more processors of a processing system, cause the processing system to perform a method in accordance with any one of Clauses 1-15. Clause 19: A computer program product embodied on a computer-readable storage medium comprising code for performing a method in accordance with any one of Clauses 1-15. ADDITIONAL CONSIDERATIONS The preceding description is provided to enable any person skilled in the art to practice the various embodiments described herein. The examples discussed herein are not limiting of the scope, applicability, or embodiments set forth in the claims. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments. For example, changes may be made in the function and arrangement of elements discussed without departing from the scope of the disclosure. Various examples may omit, substitute, or add various procedures or components as appropriate. For instance, the methods described may be performed in an order different from that described, and various steps may be added, omitted, or combined. Also, features described with respect to some examples may be combined in some other examples. For example, an apparatus may be implemented or a method may be practiced using any number of the aspects set forth herein. In addition, the scope of the disclosure is intended to cover such an apparatus or method that is practiced using other structure, functionality, or structure and functionality in addition to, or other than, the various aspects of the disclosure set forth herein. It should be understood that any aspect of the disclosure disclosed herein may be embodied by one or more elements of a claim. As used herein, a phrase referring to “at least one of” a list of items refers to any combination of those items, including single members. As an example, “at least one of: a, b, or c” is intended to cover a, b, c, a-b, a-c, b-c, and a-b-c, as well as any combination with multiples of the same element (e.g., a-a, a-a-a, a-a-b, a-a-c, a-b-b, a-c-c, b-b, b-b-b, b-b-c, c-c, and c-c-c or any other ordering of a, b, and c). As used herein, the term “determining” encompasses a wide variety of actions. For example, “determining” may include calculating, computing, processing, deriving, investigating, looking up (e.g., looking up in a table, a database or another data structure), ascertaining and the like. Also, “determining” may include receiving (e.g., receiving information), accessing (e.g., accessing data in a memory) and the like. Also, “determining” may include resolving, selecting, choosing, establishing and the like. The methods disclosed herein comprise one or more steps or actions for achieving the methods. The method steps and/or actions may be interchanged with one another without departing from the scope of the claims. In other words, unless a specific order of steps or actions is specified, the order and/or use of specific steps and/or actions may be modified without departing from the scope of the claims. Further, the various operations of methods described above may be performed by any suitable means capable of performing the corresponding functions. The means may include various hardware and/or software component(s) and/or module(s), including, but not limited to a circuit, an application specific integrated circuit (ASIC), or processor. Generally, where there are operations illustrated in figures, those operations may have corresponding counterpart means-plus-function components with similar numbering. The following claims are not intended to be limited to the embodiments shown herein, but are to be accorded the full scope consistent with the language of the claims. Within a claim, reference to an element in the singular is not intended to mean “one and only one” unless specifically so stated, but rather “one or more.” Unless specifically stated otherwise, the term “some” refers to one or more. No claim element is to be construed under the provisions of 35 U.S.C. § 112(f) unless the element is expressly recited using the phrase “means for” or, in the case of a method claim, the element is recited using the phrase “step for.” All structural and functional equivalents to the elements of the various aspects described throughout this disclosure that are known or later come to be known to those of ordinary skill in the art are expressly incorporated herein by reference and are intended to be encompassed by the claims. Moreover, nothing disclosed herein is intended to be dedicated to the public regardless of whether such disclosure is explicitly recited in the claims. | 52,674 |
11858043 | DETAILED DESCRIPTION OF THE INVENTION A description of example embodiments of the invention follows. Described herein are embodiments of a variable metallurgy property (VMP) system for generating a user-adjustable profile of thermal processing parameters. The VMP may generate, based on metallurgical characteristics and other materials properties provided by the user, a profile for each of one or more thermal processing parameters. The properties may include, for example, microstructures and chemistries (e.g., carbon content), among others described in more detail herein. In some embodiments, the VMP system may direct the processing system to develop a particular outcome with respect to the resulting process cycle and materials properties, based on a set of parameters provided by the user. The set of parameters may be a part or parts to be processed according to a default set of conditions. The VMP system may permit the user to adjust the default set of conditions to suit the users requirements, then direct the processing system to develop a particular outcome with respect to the resulting process cycle and materials properties, based on the adjusted default conditions. In some embodiments, the VMP system may facilitate an interactive process setup procedure that guides the user to develop a particular outcome with respect to the resulting process cycle and materials properties. The VMP system may operate within an additive manufacturing system100as shown inFIG.1A. Such an example additive manufacturing system100may include a printing subsystem102, one or more post-processing subsystems104and a furnace subsystem. A build box subsystem108may convey110one or more objects being fabricated through the fabrication process, communicating112with the different subsystems as the object(s) proceed through the fabrication process. It should be understood that although a build box subsystem108, which is relevant to a binder-jet printing subsystem, is shown in the example system ofFIG.1A, the described embodiments may be used with other types of printer subsystems. It should also be understood that at one or more of the post-processing subsystems104and for the furnace subsystem106, the object(s) being fabricated may be removed from the build box subsystem108to accomplish the processing associated with those subsystems. A control subsystem114may communicate with each of the subsystems, providing those subsystems with information necessary to accomplish the associated processing steps, and to monitor and control the processing steps. The thermal processing parameter profiles described herein may define a particular parameter characteristic with respect to another variable, such as time, furnace temperature, atmosphere characteristics, or other relevant variables. FIG.1Billustrates an example embodiment of a VMP system120configured to operate within an additive manufacturing system100. Although the additive manufacturing comprises the subsystems shown inFIG.1A, only a subset of the subsystems is shown inFIG.1B. A user interface122may receive materials properties206from the user, and provide the materials properties124to the VMP system120in a format suitable for the VMP system120. In other embodiments, the user interface122may convey the materials properties124to the control system110, and the control system provides the formatted materials properties to the VMP system120. The VMP system120may communicate with the furnace subsystem106to ascertain one or more thermal processes126associated with the furnace106. The VMP system120may identify one or more object characteristics210associated with an object130. The object characteristic(s)128may be provided to the VMP system120by the control system110. In other embodiments, the object characteristic(s)128may be provided from another source, for example through the user interface122or from the build box subsystem108from which the object originated. The VMP system120may determine a thermal processing parameter profile132corresponding to each of the thermal processes126, based on the one or more object characteristics128and the one or more materials properties124. The VMP system120may provide the thermal processing parameter profile132to the furnace subsystem106. FIGS.1C and1Dillustrate an example process workflow according to the invention.FIG.1Cdepicts the processing job setup workflow, andFIG.1Ddepicts the job execution workflow. FIG.1C, which depicts the job execution workflow, begins with the user determining which part or parts140are to be fabricated. The user, employing VMP system-associated software running on a computing device142(e.g., general purpose desktop or laptop computer or workstation) carries out the job setup procedure. Through a graphical user interface (GUI)144instantiated on the computing device142, the user selects one or more appropriate part IDs corresponding to the part(s)140. The user further selects the furnace type and other furnace parameters through the GUI144, and any other parameters associated with the part(s) processing cycle. The VMP system evaluates146the part(s) with respect to the selected furnace characteristics and the other characteristics provided by the user. The VMP system may evaluate, for example, the total part(s) mass for the job based on part-related information stored in a database associated with the VMP system, to determine certain processing parameters required and whether or not the furnace is capable of performing the desired processing cycle. As part of this evaluation, the VMP system may request additional information from the user, either through data entry fields or through a menu of suggested choices. Once the VMP system has generated a processing profile, the VMP system presents148a job summary150to the user through the GUI144of the computing device142or other presentation facility associated with the VMP system. The VMP system may provide the user with an opportunity to modify and/or approve the processing job. Once the user is satisfied with the job summary, the VMP system may store152the corresponding job processing profile in a database or other storage system that is available to the furnace subsystems. FIG.1D, which depicts the job execution workflow, begins with the user selecting160, at the furnace subsystem162, a processing job164that was created in the procedure ofFIG.1C. Once a processing job164is selected, the furnace subsystem162may evaluate166the processing profile associated with the processing job164to determine if appropriate gas species, gas volumes, and other resources are available. For example, the furnace subsystem162may determine if tanks containing gas species appropriate for the processing job164are connected to the furnace subsystem162. If such tanks are not connected, the furnace subsystem162may prompt the user to acquire and connect appropriate resources. As another example, the furnace subsystem162may determine if enough of the required gas species is available to complete the processing job164. If sufficient quantities of the gas are not available, the furnace subsystem162may prompt the user to ensure that sufficient quantities of the gas species are available. For example, the furnace subsystem162may inform the user that the user must hot-swap gas reservoirs before the gas runs out, otherwise the furnace will go into “hold” at 200° below peak temperature. The furnace subsystem may162inform the user that a countdown will be presented during which the hot-swap must be performed, otherwise the furnace subsystem162may end the processing job. Once such notifications have been presented, the furnace subsystem162may prompt the user for an instruction to proceed. The user may then start168the processing job164at the furnace subsystem162. The furnace subsystem162may then begin executing the processing job, while providing the user with processing status information170so that the user may monitor172the job status. The processing status information170may be a graphically-based function of time, as shown inFIG.1D, or it may be textual readout in tabular or other suitable form, or combinations thereof, or other known techniques for presenting such processing status information. In an example embodiment, an object may be printed from 4140 alloy nominal feedstock steel, using a printing subsystem of an additive manufacturing system. The user of the additive manufacturing system may select, for example, a particular (alloying) element content (e.g., carbon content) of the constituent 4140 alloy steel to be present in the steel after thermal processing. The VMP system may evaluate the desired carbon content input from the user and generates therefrom one or more thermal processing parameter profiles to produce a desired carburization/decarburization effect, and provides the thermal processing parameter profile(s) to the thermal processing furnace subsystem. In one example embodiment, a thermal processing parameter profile may comprise controlling one or more of (i) the gas flow rate, (ii) gas species and (iii) chamber pressure, within the furnace subsystem. As used herein, the “chamber pressure” refers to the internal atmosphere pressure within the processing chamber of the furnace subsystem. The specific carbon content control technique to be manipulated by the VMP system may depend on the type of furnace being employed. For example, in a graphite chamber with insulation, the VMP system may control carbon content by varying one or more of gas flow rate, chamber pressure, and furnace load. For a tube furnace, in the absence of a carbon source, the VMP system may control carbon content of the part being processed by varying a methane (CH4) gas flow upon cooling. Adjusting the carbon content of the 4140 alloy steel may produce a very wide range of ductility and/or hardness to the user for alloy steels. In one embodiment, the user may provide ductility and/or hardness as a desired property, the VMP system determines the required carbon content to achieve the desired ductility and/or hardness, and the VMP system produces a thermal processing parameter profile to the furnace subsystem that produces the determined carbon content of the printed object(s). The carbon content of the printed object can be altered by furnace load (i.e., the total mass and/or cross-sectional thickness of parts placed in the furnace) as well as gas flow rate, chamber pressure and/or gas species to allow a predefined carbon potential atmosphere to be maintained in the workspace. A carbon potential probe would interface with the software to adjust gas flows and other process parameters to maintain the desired carbon potential. This is due to the effect of binder amount on carburizing potential of thermal process. Furnace load and gas flow rate, chamber pressure and/or gas species are thus example thermal processing parameters that the VMP system may determine and provide to the furnace subsystem to adjust the final microstructure, while keeping all the other profiles of furnace parameters (e.g., temperature, time, etc.) constant. In an alternative embodiment, the carbon potential may be controlled by storing carbon-containing binder products (e.g., products (hydrocarbons) resulting from thermal de-binding), such that the binder products can be released later in the sinter cycle to add carbon potential to the local atmosphere. The binder hydrocarbon products may be stored in a binder trap associated with the sintering furnace. A valve that controls a path from the binder trap to the sintering furnace may be opened to expose the de-binding products to the sintering furnace atmosphere. In some embodiments, the de-binding products may be heated to encourage the contribution of the de-binding product to the carbon potential of the sintering furnace atmosphere. This use of the de-binding product may allow an increase of the carbon potential without relying solely on the introduction of a carburizing process gas. Further, desired carbon potentials may not be achievable with an explosion-proof methane mixture of process gas, so de-binding product may be used in conjunction with such a methane mixture of process gas (or other such explosion-proof mixtures) to boost the carbon potential to required levels. For the production of certain high carbon tool steels, there is a trade-off between densification and carbon content, such that the process cannot achieve both high densification and high carbon content with a given set of parameters. In one embodiment, a part may be densified first, at the expense of decarburizing the part, and then the de-binding hydrocarbon products may be used as a carburizing agent in a post-sintering carburizing heat treatment. In an example embodiment, the VMP system may provide furnace load recommendations to the furnace user, so that the user can manually adjust the furnace load. In other embodiments, the furnace subsystem may automatically adjust the furnace load based on a furnace load parameter profile communicated to it by the VMP system. In an example embodiment, the user may select (e.g., thorough a user interface to the system) particular parts to be processed, and the VMP system may determine the total mass and/or cross-sectional thickness of objects to be sintered in in a particular thermal processing run, based on the user selections, along with specified material properties and/or desired microstructure. The VMP system may then determine, based on the entered total mass and/or cross-sectional thickness of the objects and desired microstructure for a particular production run, the gas flow rate, chamber pressure and/or gas species needed to achieve that microstructure in that particular production additive manufacturing run. In some embodiments, the user interface may, in addition to a selection of one or more particular parts, as described above, comprise one or more advanced menu selections for providing additional levels of detail to the metallurgical processing. One example menu is presented below. In an embodiment, a user may access this example menu by selecting an “ADVANCED 1” button image on the user interface, although other selection facilities may be used:1—fine pearlite+ferrite2—coarse pearlite+ferrite3—full bainite4—bainite+ferrite5—bainite+pearlite+ferrite6—martensite6—martensite+pearlite The user may select a subsequent menu, as presented in the example below, which provides the user with selections of additional processing parameters:1—Hardness2—Case hardened3—Ductility4—TRS (Transverse Rupture Strength) Selection of one of the above-referenced subsequent menu items may prompt the user for additional information. For example, if the user selects 1, hardness, the user may be presented with a coarse set of choices, e.g., “hard,” “medium,” and “soft.” Alternatively, the user may be presented with a range of symbols (e.g., numbers), where one end of the range is designated as “hardest” and the other end of the range is designated as “softest.” In some embodiments, the user may be presented with an input field, and prompted to enter a number within a hardness range. As another example, if the user selects “2—Case hardened” from the subsequent menu, the user may be presented with a “yes/no” choice. If the user selects “yes,” the user may be presented with the following example choices for submitting additional information:1—Case depth2—Case hardness3—Core hardness In some embodiments, the VMP system may accept a transverse rupture strength (TRS) input from the user. FIG.2Aillustrates an example user interface that depicts a materials selection menu. For this example, the 4140 materials all have the same material content, whether it is Bainite, Pearlite-Ferrite, or Ferrite; the final materials all depend on the treatment within the furnace subsystem. Further, the resulting microstructures are dependent on the cooling control within the furnace subassembly (i.e., how quickly the object is cooled). In other embodiments, the user interface may comprise one or more various graphical user interface (GUI) controls known in the art that may facilitate a user's selection of a part (or parts) and the user's input of materials properties. For example, the user interface may comprise a GUI showing one or more slide controls that each traverses a range of a materials property (e.g., a range of carbon content) such that the user manipulates the slide control to select a particular materials property value. The VMP system modifies the fabrication recipe to produce the selected result. As another example, the GUI may show a two-dimensional space defined by a pair of orthogonal axes (i.e., an X axis and a Y axis), each axis representing a range of a material property. The user identifies two parameters (e.g., a first key characteristic and a second key characteristic) by selecting a point within the area, and the VMP system modifies the fabrication recipe to produce a result that corresponds to the selected parameters. Alternatively, the GUI may provide for user entry of parameters through a three-dimensional space defined by three orthogonal axes, or a set of two or more such two or three dimensional spaces. The VMP system may produce process parameter profiles as a function of the input materials properties, based on a fixed mapping. In such cases, the VMP system may employ a look-up table (LUT), implemented in local memory, to accomplish the mapping. The contents of the LUT may be generated empirically, based on part analysis feedback data from test process runs or actual production process runs. The contents of the LUT may alternatively be generated analytically according to formulae based on established materials theory. Alternatively, the VMP system may produce the process parameter profiles analytically, in real-time or near real-time, by a processor executing instruction code that evaluates the input materials properties according to formulae based on established materials theory. In some embodiments, the VMP system may produce the thermal processing parameter profiles according to a combination of LUT implementation and real-time/near real time analytical processing. The VMP system may include a “Super User Mode,” which allows a user to tailor a process parameter profile according to specific result requirements. The VMP system may evaluate the tailored parameter profile to determine if the resulting parameter combination represents an impossible scenario or represents a parameter combination that could pose a hardware failure, a failure of the material being processed, or both. The VMP system may unconditionally preclude certain such tailored parameter profiles, for example when the associated parameters would lead to an impossible scenario or hardware failure. The VMP may notify the user that the precluded parameter profile will not be run, and may provide the user with reasons and/or justification for the preclusion. In some cases, for example when the tailored parameter profile may lead to material failure, the VMP system may conditionally preclude the profile. In such cases, the user may be notified of the conditional preclusion, and may be given an override option. The VMP system may also provide the user with a rationale for the conditional preclusion, with which the user may use to guide a potential override decision. Other process parameters (or parameter profiles) may additionally (or alternatively) be provided in a profile to the furnace subsystem. For example, the oxygen content in the gas flow may be varied for processing titanium-based alloys to provide variations in hardness vs. ductility of the object material. In this case, the PaO2(equilibrium oxygen partial pressure) is monitored by the VMP system rather than carbon potential. The VMP system may receive processing data from sensors associated with the furnace (e.g., carbon potential probe, or oxygen probe), to monitor processing conditions during the processing run with respect to the active parameter profile. An example VMP system may provide thermal processing parameter profiles to produce hardening oxide and/or nitride layers on a material such as titanium or aluminum. Anodized aluminum is just a thick layer of aluminum oxide or aluminum nitride. For example, the VMP system may facilitate a carbo-nitride processing of a part or parts by formulating a process to add a specific gas (e.g., CH4+NH3) applied to the part(s) at an ideal temperature. The internal structure of the sintering furnace may comprise one of several different types, or combinations thereof. For example, the sintering furnace internal structure may comprise (i) graphite retort, (ii) carbon retort, (iii) refractory metal retort, or (iv) ceramic retort, among others, or combinations thereof. The use of a carbon, refractory metal or ceramic retort may be used for processing reactive metals such as aluminum and titanium, which cannot be processed in a graphite retort in addition to tightly controlling oxygen in the sintering environment. Nesting a refractory metal or ceramic retort into the graphite retort makes it possible to process reactive metals in the same furnace equipment that would otherwise be used for processing non-reactive metals. An example VMP system may provide thermal processing parameter profiles to the thermal processing furnace subsystem that define a particular cool-down rate. For example, one cool down rate may be defined for banite, and a slower cool down rate may be defined for ferrite+pearlite. A user would thus provide materials properties input of either “banite” or “ferrite+pearlite” using an input technique described herein, and the VMP system would generate process parameter profiles to the furnace that specify the appropriate cool down rate. The VMP system may present a continuous cooling transformation (CCT) diagram to the user, depicting various transformation products for different cooling rates. In one embodiment, the CCT diagram may depict a cooling curve and resulting transformation products for parameters input by the user. In another embodiment, user may select a particular cooling rate curve on the CCT diagram, through the GUI, in order to specify a desired product result.FIG.2Bshows an example CCT diagram that the VMP system may present to the user. InFIG.2B, “F” denotes ferrite, “P” denotes pearlite, “B” denotes Bainite, and “M” denotes martensite. The “s” subscript denotes start temperature and the “f” subscript denotes final temperature. An example VMP system may provide thermal processing parameter profiles to the thermal processing furnace subsystem that adjust thermal processing parameters such as the internal furnace atmosphere, vacuum level and the furnace loading, to selectively harden/carburize the parts. Certain parts may only require a selected region to be hardened (e.g., the teeth of a gear), but require other regions of the part maintain ductility (e.g., thin sections that are prone to embrittlement when too hard/carburized). Embodiments of the print subsystem may print a thin barrier layer (also referred to as a stop-off layer) on selected surfaces to prevent carburization of those selected surfaces, resulting in selective carburizing. For some embodiments, the dominating factor in final carbon content may be incomplete de-binding. In such an embodiment, the sections under the thin stop-off may pick up carbon due to prolonged exposure to carbon from the binder and become harder selectively. Thus selectively distributing the stop-off may facilitate the thermal processing of functionally gradient steel. Similar techniques of distributing stop-off material may alternatively be used for oxygen hardening of titanium to facilitate the thermal processing of functionally gradient titanium. Similar techniques may apply to other processes, for example for processing titanium with oxygen hardening. Since certain final material properties may be dependent on how the material is exposed to gas flow during processing, the VMP system may determine gas deflection characteristics needed to produce a particular metallurgical outcome regarding properties of the material. Accordingly, the VMP system may direct certain gas channeling structures to be printed on the part, in the vicinity of the part, or both.FIGS.3A and3Billustrate examples of two such channeling architectures. FIG.3Aillustrates a focusing structure302, which collects a gas flow304and channels the gas flow304into a focused gas flow306, directed to a particular region308of part310being processed. FIG.3Billustrates a deflection structure320, which deflects and channels a gas flow322into a deflected gas flow324, directed around a part326being processed. FIGS.3A and3Bare intended to provide examples types of gas flow channeling that may be used to control material properties during processing, and are not intended to be limiting. Other such channeling structures may be used alternatively or in addition to those described inFIGS.3A and3B. Software controlled vacuum levels, at specific thermal zones, may be used to produce a controlled surface enrichment of liquid phase-based materials, for example tungsten carbide and cobalt (WC+Co), tungsten carbide and nickel (WC+Ni), and titanium carbide and Nickel (TiC+Ni). Such a software-controlled process may facilitate enhanced secondary operations such as brazing, or application of surface coatings to the base matrix. Printed objects, after thermal processing and while cooling, can be exposed to reactive gas species which can be supplied through a hot-swap gas cylinders. For example, these reactive gasses can provide a case-carburization which will yield a carbon content gradient from part surface to center. Two example objects402,404, which have been so exposed to reactive gas, are shown inFIG.4A. If the example objects402,404are cross-sectioned, as shown inFIGS.4B and4C, the inner core will be still soft, ductile with high toughness. The outer layer is known as the case, which gives a harder and wear resistant surface. The processing can be such that the outer surface has a high corrosion resistance. The depth of this case-carburized layer or carbonstricted layer can be made to vary and may be controlled by a software based processing system or other control technique.FIG.4Cillustrates carbon percentage (bottom trace and left side of graph) and hardness (top trace and right side of graph) across the cross-sectional view. As can be seen, the carbon percentage and hardness decrease from the outer portion of the object toward the core portion of the object. An object may be “decarburized” by implementing the carburization process described above in reverse. Decarburizing an object requires exposing the object to reactive gases such as oxygen or hydrogen. The reactive gases combine with carbon in the object, primarily at the surface of the object to result in a reverse carbon gradient (i.e., carbon content increases with distance from the object surface into the object core. In some embodiments, decarburizing may be accomplished by changing the H2/H2O ratio in the surface atmosphere. The H2/H2O ratio may be reduced by introducing moisture into the sintering atmosphere (by, for example, spraying water), which will make the sintering atmosphere suitable for decarburizing. Similarly, carburizing, boriding or nitriding gases can be introduced into the sintering atmosphere at critical temperatures to modify the chemistry, or surface chemistry, of the part. An embodiment may facilitate a user adding surface modifications for parts up-front, either at the setup procedure as described with respect to example embodiment ofFIG.1C, or prior to starting the job as described with respect to the example embodiment ofFIG.1D. Embodiments may require that the first part having a surface modification implemented defines the processing cycle, such that subsequent parts modified (either surface modifications or non-surface modifications) will be conditional on the first part's processing profile. In other words, if a part modification subsequent to the first part modification would conflict with the first part modification, the VMP system may notify the user of the conflict and may preclude such subsequent modifications, so as to prevent the fabrication of defective parts in a scenario that requires multiple parts nested in a build box. Embodiments of the VMP system may facilitate certain ancillary processing procedures being accomplished during the primary thermal processing cycle. For example, the VMP system may facilitate one or more of annealing, aging, tempering, stress-relieving and spheroidizing (a heat treatment for iron-based alloys to convert the alloys into ductile and machinable alloys) of a part or parts being processed within the additive manufacturing system. This step requires an additional type of austenitizing furnace and a water or oil quenching step after sintering is completed, and before these heat treatments can be done in the sintering furnace. After the sintering cycle is over and the part is completely solid, the part may be austenitized and quenched using another type of furnace and quenching equipment. After austenitizing and quenching is done, the solid part can be put back in the furnace for one or more of the software-programmed heat treatments that are listed above. The type, temperature and the duration of these heat treatments (annealing, aging, tempering, etc.) may be pre-programmed in the software using an algorithm that is a function of at least one of (a) the material, (b) required final hardness/toughness and (c) the thickest section of the part. FIG.5is a diagram of an example internal structure of a processing system500that may be used to implement one or more of the embodiments herein. Each processing system500contains a system bus502, where a bus is a set of hardware lines used for data transfer among the components of a computer or processing system. The system bus502is essentially a shared conduit that connects different components of a processing system (e.g., processor, disk storage, memory, input/output ports, network ports, etc.) that enables the transfer of information between the components. Attached to the system bus502is a user I/O device interface504for connecting various input and output devices (e.g., keyboard, mouse, displays, printers, speakers, etc.) to the processing system500. A network interface506allows the computer to connect to various other devices attached to a network508. Memory510provides volatile and non-volatile storage for information such as computer software instructions used to implement one or more of the embodiments of the present invention described herein, for data generated internally and for data received from sources external to the processing system500. A central processor unit512is also attached to the system bus502and provides for the execution of computer instructions stored in memory510. The system may also include support electronics/logic514, and a communications interface516. The communications interface516may comprise the interface to the user interface204, the interface to the furnace subsystem106, or the interface to the control subsystem110, as described with reference toFIG.2A. In one embodiment, the information stored in memory510may comprise a computer program product, such that the memory510may comprise a non-transitory computer-readable medium (e.g., a removable storage medium such as one or more DVD-ROM's, CD-ROM's, diskettes, tapes, etc.) that provides at least a portion of the software instructions for the invention system. The computer program product can be installed by any suitable software installation procedure, as is well known in the art. In another embodiment, at least a portion of the software instructions may also be downloaded over a cable communication and/or wireless connection. One example embodiment of a method of generating a user-adjustable thermal processing parameter profile for use by a sintering furnace is shown inFIG.6. The method may comprise receiving602, through a user interface, one or more materials properties provided by a user. The method may further comprise communicating604with a furnace to ascertain one or more thermal processes associated with the furnace, and identifying606one or more part characteristics associated with a part to be processed by furnace. The process may further comprise determining608a thermal processing parameter profile of at least one thermal processing parameter corresponding to each of the thermal processes, based on (i) the one or more part characteristics and (ii) the one or more materials properties, the thermal processing parameter profile characterizing a cycle of the one or more thermal processes. It will be apparent that one or more embodiments described herein may be implemented in many different forms of software and hardware. Software code and/or specialized hardware used to implement embodiments described herein is not limiting of the embodiments of the invention described herein. Thus, the operation and behavior of embodiments are described without reference to specific software code and/or specialized hardware—it being understood that one would be able to design software and/or hardware to implement the embodiments based on the description herein. Further, certain embodiments of the example embodiments described herein may be implemented as logic that performs one or more functions. This logic may be hardware-based, software-based, or a combination of hardware-based and software-based. Some or all of the logic may be stored on one or more tangible, non-transitory, computer-readable storage media and may include computer-executable instructions that may be executed by a controller or processor. The computer-executable instructions may include instructions that implement one or more embodiments of the invention. The tangible, non-transitory, computer-readable storage media may be volatile or non-volatile and may include, for example, flash memories, dynamic memories, removable disks, and non-removable disks. While this invention has been particularly shown and described with references to example embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention encompassed by the appended claims. | 34,559 |
11858044 | DESCRIPTION OF SPECIFIC EMBODIMENTS OF THE INVENTION The present invention, in some embodiments thereof, relates to a manufacturing method based on 3D printing and, more particularly, but not exclusively, to three 3D printing with layers of powdered material. According to some embodiments of the present invention, there is provided a 3D printing system and method for concurrently building a plurality of objects on separate building trays. According to some exemplary embodiments, the printing system includes a plurality of stations each of which perform a different task for building a layer, more than one building tray, a controlled circular drive that advances each of the building trays to each of the different stations repeatedly until the layers of each of the 3D object are completed. According to some exemplary embodiments, the stations include a 3D mask printer for printing a mask, a powder dispenser for dispensing a dose of powder, a powder spreader for applying a layer of powdered material and a process compaction unit for compacting a layer. Optionally, the powder dispenser and powder spreader functionality are integrated in a single station. Optionally, the system may include additional or alternative stations, e.g. process sintering station for sintering a layer and a milling (or grinding) station for removing an upper surface of a layer. Preferably manufacturing time is reduced by occupying more than one station with a building tray during the layer building procedure. According to some exemplary embodiments, the a 3D mask printer station includes a direct inkjet printing head that deposits material based on mask pattern data. Typically, the mask pattern data is generated by a computer aided design (CAD) software program or the like. Typically, the 3D mask printer station includes access to memory for storing mask data for each of the objects being printed on the plurality of building trays. In some exemplary embodiments, a controller controls alternating between providing mask data to the inject printer for each of the plurality of building trays during the layer building process. In some exemplary embodiments, the system additionally includes a second final compaction unit and a furnace sintering unit for compacting and then sintering the multiple layers at the termination of the layer building process. Optionally, more than one building tray may be compacted and/or sintered at a time. According to some exemplary embodiments the 3D mask printer is a photopolymer 3D printer, e.g. a PolyJet™ printer provided by Stratasys in Eden Prairie, Minnesota, United States. In some exemplary embodiments, the mask printer includes inkjet printing heads assembled on a scanning printing block that moves over the building tray to scan the layer during printing, while the building tray remains stationary. In some embodiments, the entire mask of the specific layer may be printed in a single pass. In some exemplary embodiments, the compaction unit is a die compaction unit including walls that surround a building tray and a layer of powder spread on it and maintains a footprint of the layers. In some exemplary embodiments, the compaction strength applied in the compaction process is defined to provide permanent deformation of the powder layer, e.g. press the powder particles past its elastic state and into its plastic state. In some exemplary embodiments, the powder material is aluminum. Optionally, other metals or alternatively ceramic material is used as the building material, e.g. the powder. Optionally, the powder is a mix of a plurality of materials. Building with aluminum is known to be advantageous due to its light weight, heat and electricity conduction, and its relative resistance to corrosion. In some exemplary embodiments, the printing system is configured to concurrently print different objects on different building trays. Optionally, the different objects that are concurrently printed are formed with different powder material. In addition, the material used to print the mask on the powder may also be different for each of the building trays. Further, the compaction, e.g. duration, force and temperature during compaction applied to each building tray may be tailored for each object being printed. Before explaining at least one embodiment of the invention in detail, it is to be understood that the invention is not necessarily limited in its application to the details of construction and the arrangement of the components and/or methods set forth in the following description and/or illustrated in the drawings and/or the Examples. The invention is capable of other embodiments or of being practiced or carried out in various ways. Referring now to the drawings,FIG.1shows a simplified block diagram of an exemplary 3D printing system in accordance with some embodiments of the present invention. A 3D printing system100is integrated on a working platform500. According to some embodiments of the present invention, working platform500includes a rail250on which more than one building tray, e.g. building tray201,202,203and204are advanced through a plurality of stations for printing object151,152,153and154respectively one layer at a time. In some exemplary embodiments, objects151,152,153and154are identical objects. Alternatively, one or more of objects151,152,153and154differ in shape, size or material and 3D printing system100may repeatedly adjusts parameters to accommodate concurrently printing different objects in a layer-wise manner. Typically, the building process is defined such that a first layer for each of objects151,152,153and154is printed and subsequently a second layer for each of objects151,152,153and154is printed and this process continues until all the layers for objects151,152,153and154are printed. According to some exemplary embodiments, a motor260rotates about its axis265and advances trays201,202,203and204along circular rail250. In some exemplary embodiments, rail250is supported on a linear stage providing motion along a vertical direction (Z-axis) for adjusting height of trays201,202,203and204, e.g. lowering trays201,202,203as each new layer is added. In some exemplary embodiments, each tray is associated with its own Z carriage that provides Z axis motion capability for a particular tray. As the tray advances from station to station, its Z carriage adjusts itself to a desired Z height. In some other exemplary embodiments, a Z axis linear stage is positioned at each station and the rail advances the trays from one Z axis linear stage to another. Optionally, a handshaking process occurs between each Z axis linear stage and the tray that is received on the linear stage once a rotational angular step is completed. The hand shaking may provide accurate and stiff mounting of each tray in its Z axis stage. By individually adjusting height of each station, the system may concurrently build different objects with different layer thicknesses or different materials. According to some embodiments of the present invention, working platform500includes a printing platform station30(a 3D printer station), for printing a mask on each of trays201,202,203and204according to a mask pattern for each object, a powder dispensing station10for dispensing a powder layer on each of trays201,202,203and204, a powder spreading station20for spreading a layer of dispensed powder on each tray, and a process compacting station40for compacting the layer of powder on each of trays201,202,203and204. Typically for each layer, trays201,202,203and204advance to each of the stations and then that trays repeat the process until all the layers have been printed. The order of the stations is typically defined by the building process. In some exemplary embodiments, a layer is formed by first printing a mask, spreading powder over the mask and then compressing the layer. Alternatively, a powder layer may be spread, the powder may be compacted and then a mask may be printed on the compacted powder. Optionally, additional stations may be included and/or a different order for forming a layer may be defined. Typically, stations10,20,30and40are positioned on working platform500in the order that they are operated so that the trays may be advanced in one direction to form a complete layer. According to some embodiments of the present invention, a controller600controls operation of 3D printing system100and coordinates operation of each of the stations and movement of trays201,202,203on rail250. Typically, controller600includes and/or is associated with memory and processing ability. In some exemplary embodiments, a station, e.g. station10,20,30or40may adjust its operational parameters based on identifying a specific tray. Optionally, at the end of the layer building process, objects151,152,153and154may be advanced or positioned in second compacting station60for final compaction and then to sintering station70for sintering. Compaction for objects151,152,153and154in second compacting station60may be performed simultaneously or consecutively. During the sintering process, the objects typically solidify. Optionally, inert gas source510is a source of nitrogen. Optionally, sintering station70and second compaction station60are stand alone stations that are separate from working platform500. Optionally, objects151,152,153and154are manually positioned into sintering station70and optionally second compaction station60and not by rail250. Optionally, each of second compaction station60and sintering station70have a dedicated controller for operating the respective station. Reference is now made toFIGS.2A,2B,2C and2Dshowing simplified schematic drawings of an exemplary 3D printing system shown in progressive building steps in accordance with some embodiments of the present invention. In one exemplary embodiment, during a first building step (shown inFIG.2A), a station10may be occupied with tray201, a station20may be occupied with tray202, station30may be occupied with tray203and a station40may be occupied with tray204. When printing the first layer, only station10may be activated during this step of the cycle (the first cycle), while stations20,30and40may be on standby. During subsequent cycles, all of stations10,20,30and40may be operated concurrently, each for performing its defined task. Optionally, a number of stations may exceed a number of trays and one or more stations may not be activated in these subsequent cycles. At the termination of activity of the activated stations, rail250may advance the trays in for example a clockwise direction to a subsequent step. In a second step (shown inFIG.2B), a station10may be occupied with tray204, a station20may be occupied with tray201, station30may be occupied with tray202and a station40may be occupied with tray203. Each of stations10and20may be operated concurrently for performing its defined task during the first cycle while stations30and40may be idle. At the termination of activity of the activated stations, rail250may advance the trays in for example a clockwise direction to a subsequent step. In a third step (shown inFIG.2C), a station10may be occupied with tray203, a station20may be occupied with tray204, station30may be occupied with tray201and a station40may be occupied with tray202. Each of stations10,20and30may be operated concurrently for performing its defined task while station40may remain idle. At the termination of activity of the activated stations, rail250may advance the trays to a subsequent step. In a forth step (shown inFIG.2D), a station10may be occupied with tray202, a station20may be occupied with tray203, station30may be occupied with tray204and a station40may be occupied with tray201. Each of stations10,20,30and40may be operated concurrently for performing its defined task. At the termination of activity of the activated stations, rail250may advance the trays to begin a new cycle. Optionally, at this step tray201completed a fully cycle and a first layer is completed in tray201while layers in trays202,203and204have not been completed. According to some exemplary embodiments, rail250may return trays201,202,203and204to the position shown inFIG.2Ain either a clockwise or counter clockwise direction. Starting again from the position shown inFIG.2Aand the steps described inFIGS.2A,2B,2C and2Dmay be repeated to form an additional layer. In the subsequent cycles, all the stations may are typically operated concurrently to form each of the subsequent layers. This process may continue until all the layers for each of the objects151,152,153and154are built. In some exemplary embodiments, some of the objects may include more layers than others. In such cases, the stations may remain idle when a completed object is occupying the station. Alternatively, the cyclic process of the system may be paused and a tray including a completed model may be removed or replaced with a vacant tray to allow concurrently building a new model using new data. In some exemplary embodiments, a tray advances in one direction, e.g. clockwise or counter clockwise when advancing from the first step to the last step and then may be advanced in an opposite direction before repeating a cycle. By turning rail250in an opposite direction at the end of a cycle, tangling or excessive twisting of cables may be avoided. According to some exemplary embodiments, each station reads an identity on the tray while being occupied and may adjust its parameters to the particular object being built on the tray. Parameters that may be adjusted may include, the powder material dispensed, the volume dispensed, height of the roller while spreading the powder, the mask pattern, the material used for the mask pattern, and the compacting parameters. Typically, each station may decide to operate or remain idle during a cycle based on the identity read on the tray. Reference is now made toFIG.3showing a simplified flow chart of an exemplary method for constructing an object by 3D printing in accordance with some embodiments of the present invention. Typically, the trays are advanced from one station to the next in a cyclic fashion (block305). Typically, in the first position, a first tray is stationed in a first station, a second tray in the second station, a third station in the third station and so on. During a first cycle, e.g. for the first layer, only stations occupied by trays that already passed the first station are activated. In subsequent cycles all stations may be activated concurrently as required. Optionally, in response to advancing the trays, the trays positioned in a station are identified (block305). In some exemplary embodiments, identification is used to adjust working parameters of a station for the object being built in a particular tray (block320). Identification may be used to determine when to activate the station or what station to activate (block330). When all the stations terminated their activity, all the trays are advanced to the next station (block340). When the first tray is in the last station, all the trays are advanced to their first position and the process is repeated to build an additional layer. This process continues until all the layers are built. The circular configuration described in reference toFIGS.1-3may be preferable when an operation period of each of the stations has roughly a same duration. Reference is now made toFIGS.4A,4B,4C and4Dshowing simplified schematic drawings of another exemplary 3D printing system in different stages of operation in accordance with some embodiments of the present invention. In some exemplary embodiments, an operation period of one of the processing stations is significantly longer than operations periods of other stations. Typically, it is the operation period of the digital printer in the mask printing station30that is significantly longer than operation periods of each of the other processing stations, e.g. powder dispensing station10, powder spreading station20, and compacting station40. For example a length of the mask printing period may be roughly the same as a sum of all the other stations together (dispensing, spreading and compaction). Increasing the speed of the digital printer, e.g. by adding additional inkjet print heads to the digital printer may be costly and complex. According to some exemplary embodiments, a working platform501may concurrently operate with two trays, e.g. tray201and tray202. The working platform may include a first rail251carrying one of the trays and associated with printing station30(slow operating station) and a second rail251carrying the other tray associated with the other stations, e.g. powder dispensing station10, powder spreading station20and compaction station40. A switching arm connected to a first handshake station271at one end and a second handshake station272at an opposite end may transfer trays between rail251and rail252. Referring now toFIG.4A, while object152completes processes in each of stations10,20and40a second tray201receives a mask layer in printing station30. Referring now toFIG.4B, after the process in each of the stations10,20and40is completed, tray202is shifted with rail252to a handshake station272. When the printing process is ended, tray201is shifted with rail251to a handshake station271. Referring now toFIG.4C, when both tray201and tray201are in the handshake stations, a switching arm connected to a motor270rotates and places tray201on rail252and tray202on rail251. Referring now toFIG.4D, the trays are now advanced to the relative stations for completing processing of a layer and/or for forming an additional layer. This process is repeated until all the layers are built. The system shown for example inFIG.4Amay be less complex and physically more compact than the system shown inFIG.1and may be particularly suited for a system including a printing station that requires a longer operation duration than other stations in the system. Objects on two different building trays may be manufactured concurrently which may approximately double the production as compared to prior art systems that operate with only one tray. Reference is now made toFIG.5showing a simplified flow chart of another exemplary method for concurrently constructing layers of a plurality of objects by 3D printing in accordance with some embodiments of the present invention. According to some exemplary embodiments, a first tray is advanced to the printing station (block505) and a mask is printed on the tray. While the printing is taking place, a second tray is advanced to each of the other stations (block510), e.g. the powder dispensing station, the powder spreading station and the compaction station. In some exemplary embodiments, the second tray may complete the processes in each of the other stations in substantially a same time period in which a mask is printed on the first tray. Once the mask for a layer is completed on the first tray and the other processes for a layer is completed on the second tray, a position of the first tray and second tray is switched (block515). Based on the switching, the second tray may be advance to the printing station to receive a mask for a new layer (block520) and the first tray is advanced to each of the other stations to receive raw material for a new layer (block525). The first tray and second tray may be switched again (block530) and the process described in blocks505,510,515,520,525and530may be repeated until all the layers are built in each of the first and second tray. If an object in one of the trays is completed with less layers than in the other tray, that object may be removed and a new object may be started in its place while the object with more layers is being completed. Reference is now made toFIG.6showing a simplified block diagram of a cyclic building process for building layers of an object in accordance with some embodiments of the present invention. According to some exemplary embodiments, each layer of an object is formed by passing through a plurality of stations in a 3D printing system. Optionally, each layer may be formed in a plurality of steps including printing a mask pattern (block350), dispensing a powder of the mask pattern (block360), spreading the powder over the building tray (block370) and compacting the layer (block380). This process is repeated until all the layers are built. Typically, each of object151in tray201, object152in tray202and object153in tray203concurrently undergo this cyclic pattern with a phase shift between them. For example, while object151in tray201is being compacted, powder is spread for object152in tray202, and powder is dispensed for object153on tray204. Optionally, one or more trays are idle at given periods of time. Reference is now made toFIG.7showing a simplified schematic drawing of an exemplary 3D printing system in accordance with some embodiments of the present invention. According to some embodiments of the present invention, printing platform station30includes a direct inkjet printing head35that deposits material32based on a generated mask pattern data39. Typically, the mask pattern is defined by mask data39that is typically stored in memory. Typically, the mask data is generated by a computer aided design (CAD) software program or the like. Typically, the mask data includes data for all the objects concurrently being printed. When different objects are printed in the different trays, data39may typically include a file for each object. Alternatively, when a plurality of the same objects is being concurrently printed data39may include only a single file. In some exemplary embodiments, printing head35is movable and printer controller37together with system controller600controls the movement of printing head35and timing for depositing material32. Typically a curing unit33cures the deposited material. Typically, tray200is stationary during printing and printing head35and curing unit33is supported by an X, Y or XY stage for moving printing head35and curing unit33in one or more directions. Typically, printing head35includes an array of nozzles through which material is selectively deposited. Optionally, printing head35includes a plurality of different material that may be selectively deposited based on data39. Reference is now made toFIG.8showing a simplified block diagram of powder dispensing station in accordance with some embodiments of the present invention. Typically, powder dispensing station10includes a container12storing powder55, an auger14for extracting a defined quantity and/or volume of powder55through a tube16and onto tray201(or alternatively, tray202or203). In some exemplary embodiments, the defined volume is adjusted over the course of the building process based on feedback from system100and/or controller600. Optionally, the defined volume is adjusted based on the tray occupying the dispensing station. Optionally, more powder51is selectively deposited in one tray, e.g. tray201as compared to the other trays, e.g. trays202and203. In some exemplary embodiments, powder dispensing station10is adapted to deliver aluminum powder. In other exemplary embodiments, other metals, alloys and/or materials are stored and delivered by powder dispensing station10. Optionally, container12includes a plurality of components that are stored separately or mixed. Optionally, container12includes a mechanism for mixing contents stored. In some exemplary embodiments, the type of material dispensed depends on the tray that is currently occupying the dispensing station. Reference is now made toFIG.9showing a simplified block diagram of powder spreading station in accordance with some embodiments of the present invention. Typically, spreading station20includes a motorized roller25rotatably mounted on an axle24. In some exemplary embodiments, a linear drive22engages axle24and moves across the layer for spreading an even layer of powder. In some exemplary embodiments, a height of tray201(or202or203) is adjusted, e.g. moved up/down with a Z stage in order to obtain a defined layer thickness. In some exemplary embodiments, a powder layer of about 150 μm thick, e.g. 50 μm to 200 μm thick is spread with roller25. In some exemplary embodiments, a thickness of a layer after compaction is monitored and a height of tray201is adjusted to alter a thickness of a current layer to compensate for drifts in layer thicknesses of one or more previous layers. In some exemplary embodiments, roller25extends substantially over an entire length of tray201and only one pass of the roller is required to spread the powder. Optionally, roller25is held at a height above tray201and is lowered with a Z elevator as required for spreading. Reference is now made toFIGS.10A and10Bshowing simplified schematic drawings of an exemplary compacting station in a released and compressed state respectively in accordance with some embodiments of the present invention. Optionally, a layer300is compacted after spreading a powder layer over a mask layer. According to some embodiments of the present invention, the compaction station generates a die per layer. According to some embodiments of the present invention, the compaction station includes a piston42that is operative to provide the compaction pressure for compacting layer300. According to some embodiments of the present invention, during compaction, piston42is raised through a bore49and optionally pushes rod42A in working platform500or rail250and lifts building tray201towards surface45positioned above tray201. Optionally, the addition of rod42A reduces the distance that piston42is required to move to achieve the compaction. Optionally, once layer300makes contact with surface45walls43close in around the layer300to maintain a constant footprint of the layer300during compaction. In some exemplary embodiments, tray201is secured to one or more linear guides41that ride along linear bearings46as piston42elevates and/or lowers tray201. Optionally, tray201is lifted against one or more compression springs47. In some exemplary embodiments, gravitational force as well as springs47provide for lowering piston42after compacting layer300. Typically, the pressure applied by compaction station40provides for removing air and bringing powder in layer300past its elastic state so that permanent deformation of the layer is achieved. Optionally, the compaction provides for increasing the relative density of the layer. In some exemplary embodiments, upper surface45is heated, e.g. pre-heated with a heating element44during compaction and warm die compaction is performed. When heating surface45, layer300can reach its plastic and/or permanent deformation state with less pressure applied on the layer. Typically, the pressure and temperature applied is defined based on the material of the powder and the thickness of layer300. Optionally, each of trays201,202,203and204receive different material and may be compacted with a defined temperature, compaction force and duration based on the material and the object size and shape. In some exemplary embodiments, e.g. when aluminum powder is used, the compaction is operative to break up the oxide layer, e.g. the alumina on the powdered particles. Typically, exposing the aluminum promotes direct engagement between aluminum particles of the powdered material and improves bonding of the particles during sintering. According to some embodiments of the present invention, height of the object, e.g. height of one or more layers of the object as it is being built, is detected, determined and/or sensed at the compaction station. Optionally, a height of tray200while pressed against surface45is detected. According to some embodiments of the present invention, controller600(FIG.1) monitors the height and/or the change in height and provides input to powder dispensing station when adjustments in layer thicknesses are required to compensate for a drift from a desired height and/or change in height. In some exemplary embodiments, controller600uses one or more lookup tables stored in memory or mathematical formula to control adjustments in layer thicknesses. Different adjustments may be made for the different trays. In some exemplary embodiments, one or more stations along a path of precision stage are supported on rails250extending along the path and/or by one or more bridges, e.g. bridge47positioned over working platform500. In some exemplary embodiments, compacting station40includes a piston42positioned below working platform500that is operated to raise tray201with rod42A toward a flattening surface45positioned above tray201or other surface as is described in further detail herein below. Reference is now made toFIG.11showing a simplified flow chart of an exemplary method for forming an object based on 3D printing in accordance with some embodiments of the present invention. According to some exemplary embodiments, once the building layer process is complete, the built layers are removed from the automated stage (bloc405) and compacted again at optionally a higher pressure, temperature and/or longer duration (bock410). Compaction of the built layers in all the trays may be performed concurrently. In some exemplary embodiments, the final compaction is at a pressure of between 150-300 MPa, in aluminum case e.g. 250 MPa or a temperature below 430° C. Optionally, the layers are compacted for an extended duration of time, e.g. 2-6 minutes. Typically, the compaction is die compaction so that only the Z-axis is compacted during the process. After compaction, sintering is typically applied (block415). Optionally, the built layers in all the trays are sintered simultaneously. In some exemplary embodiments, sintering is applied in a plurality of stages. Optionally at a first stage, the built layers are heated at relatively low temperature, e.g. below 400° C. over a first duration, e.g. 20-180 minutes. In case of the use of aluminum powder and some other metals like stainless steel, this step may require an inert environment of Nitrogen. Typically, the mask pattern is burned at this stage, mainly due to the oxygen contained in the polymer. At a second stage the temperature may be raised, e.g. 450° C. and this temperature may be maintained for a second duration, e.g. 0-30 minutes. Rising and cooling may be at defined rate, e.g. 10° C./min. At a third stage, the temperature may be raised again, e.g. 570-630° C. (in case of aluminum powder, depending on the alloy in use) and this temperature may be maintained for a third duration, e.g. 60-120 minutes. In case of aluminum powder—all these steps may be processed in an inert environment. After sintering and cooling, the object may be extracted from the block of layers. The terms “comprises”, “comprising”, “includes”, “including”, “having” and their conjugates mean “including but not limited to”. The term “consisting of” means “including and limited to”. The term “consisting essentially of” means that the composition, method or structure may include additional ingredients, steps and/or parts, but only if the additional ingredients, steps and/or parts do not materially alter the basic and novel characteristics of the claimed composition, method or structure. It is appreciated that certain features of the invention, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the invention, which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable sub-combination or as suitable in any other described embodiment of the invention. Certain features described in the context of various embodiments are not to be considered essential features of those embodiments, unless the embodiment is inoperative without those elements. | 31,908 |
11858045 | (a) ofFIG.2is a schematic view of the backscattered electron image shown inFIG.1. (b) ofFIG.2is an enlarged view of a portion of the schematic view shown in (a) ofFIG.2. FIG.3shows backscattered electron images that were obtained by observing a sample, which had been polished so that it became possible to observe a material structure of a Fe-based sintered body in accordance with an embodiment of the present invention. (a) ofFIG.3shows a backscattered electron image of a surface of the sample, and (b) ofFIG.3shows a backscattered electron image obtained by observing a cross section of the sample. (a) ofFIG.4is a diagram of examples of X-ray diffraction patterns of powder samples, which had been prepared at sintering temperatures in a range of 1273 K to 1423 K. (b) ofFIG.4is an enlarged view of portions at a diffraction angle 2θ of approximately 35° in the X-ray diffraction patterns shown in (a) ofFIG.4above. (c) ofFIG.4is an enlarged view of portions at a diffraction angle 2θ of approximately 45° in the X-ray diffraction patterns shown in (a) ofFIG.4above. (a) ofFIG.5is a diagram showing points in a backscattered electron image of a sample prepared at a sintering temperature of 1373 K, which points were subjected to local WDX analysis. (b) ofFIG.5is a diagram showing results of composition analysis at eight points which were subjected to the WDX analysis. FIG.6is a table showing test results of respective samples in a First Example and a Comparative Examples together. (a) ofFIG.7is a diagram of examples of X-ray diffraction patterns of powder samples, which had been prepared under conditions where the sintering temperature was 1373 K and the holding time was substantially 0 seconds to 600 seconds. (b) ofFIG.7is an enlarged view of portions at a diffraction angle 2θ of approximately 35° in the X-ray diffraction patterns as shown in (a) ofFIG.7above. (c) ofFIG.7is an enlarged view of portions at a diffraction angle 2θ of approximately 45° in the X-ray diffraction patterns as shown in (a) ofFIG.7above. FIG.8is a table showing test results of respective samples in a Second Example together. (a) ofFIG.9is a backscattered electron image which was obtained by observing, with aid of an electron microscope, a material structure of a sample which had been prepared at a pure Fe:TiB2ratio of 80:20 in mass ratio. (b) ofFIG.9is a table which shows test results of the sample together. DESCRIPTION OF EMBODIMENTS The following description will discuss embodiments of the present invention in more detail with reference to drawings. Note that the following description is intended to make the gist of the invention better understood, and does not limit the invention unless otherwise specified. Also note that a numerical range “A to B” herein means “not less than A and not more than B” unless otherwise specified in the present specification. The following will briefly describe findings of the present invention, prior to a detailed description of a Fe-based sintered body and a method of producing the Fe-based sintered body in accordance with embodiments of the present invention. BRIEF OVERVIEW OF FINDINGS OF INVENTION In general, an alloy tool steel (e.g., SKD61) achieves a desired performance, by (i) containing a certain chemical component(s) and (ii) having undergone various heat treatments. For example, a variety of microstructures are formed in such a steel. Those microstructures act to improve hardness of the steel and at the same time, impedes thermal conductivity. Usually, as hardness of a substance increases, electron conductivity and phonon conductivity of the substance become lower. This results in an inferior thermal conductivity of the substance. Patent Literature 1 discloses a technique for improving thermal conductivity of a tool steel at room temperature, by (i) reducing contents of carbon and chromium in a steel matrix and (ii) increasing phonon conductivity of a carbide which is a dispersed phase. However, an internal structure of steel may vary in many ways due to great influence of component composition, heat treatment, and various other conditions. Therefore, it is not easy to stably control the internal structure of steel to a desired state. The inventors of the present application have tried to create a material which has both of a high hardness and a high thermal conductivity and which makes it possible to improve production stability, by taking an approach different from a conventional approach. As a result of diligent studies, the inventors have found that in a case where a Fe-based sintered body is produced by sintering a mixed powder of pure iron (Fe) and titanium boride (TiB2), the Fe-based sintered body exhibits the following properties under regulated sintering conditions. That is, non-equilibrium reactions in microregions are caused by sintering under a condition capable of supplying carbon (C) and under regulated conditions. As a result, a hard phase containing TiC is formed in a Fe-based sintered body. The hard phase can be obtained in a suitably and finely dispersed state in a Fe matrix. Further, the Fe matrix not only has a network-like structure (net-like structure) but also contains αFe, and can suitably function as a heat conduction path. Note that in general, when cementite (Fe3C) is generated in a material structure, the material structure may have a lowered thermal conductivity. In this respect, a Fe-based sintered body in accordance with an aspect of the present invention is produced by using, as a raw material, an iron which has a low carbon content. Meanwhile, in a production process of the Fe-based sintered body, when TiB2is decomposed, it is more likely that Ti and C are combined to generate TiC than Fe and C are combined to generate cementite. Therefore, the present Fe-based sintered body makes it possible to suppress generation of cementite during production of the Fe-based sintered body, and also makes it possible to reduce a cementite content. From the above facts, the inventors of the present application obtained the findings that it is possible to obtain a Fe-based sintered body which exhibits both of a high hardness and a high thermal conductivity. <Fe-Based Sintered Body> The following description will discuss a Fe-based sintered body in accordance with an embodiment of the present invention, with reference toFIGS.1to5. Note that a method of producing the Fe-based sintered body in accordance with the present embodiment will be described in detail later.FIG.1is a backscattered electron image which was obtained by observing, with aid of an electron microscope, an internal structure (material structure) of the Fe-based sintered body in accordance with the present embodiment. As shown inFIG.1, the Fe-based sintered body in accordance with the present embodiment includes a matrix (base)1containing Fe as a main component, and a dispersed phase containing various phases. The Fe-based sintered body of the present embodiment is generally formed (produced) by sintering mixed powder of Fe and TiB2under a condition capable of supplying C, as described above. The dispersed phase thus includes a particulate phase (first sub-phase)2containing TiB2, which is a raw material, and a hard phase4containing fine TiC which is generated by a reaction between TiB2and C. Moreover, the dispersed phase further includes a by-product phase (second sub-phase)3containing Fe2B generated by a reaction between Fe and B which is supplied from TiB2. The following will describe the material structure of the Fe-based sintered body in accordance with the present embodiment in more detail, with reference toFIG.2. (a) ofFIG.2is a schematic view of the backscattered electron image shown inFIG.1. (b) ofFIG.2is an enlarged view of a portion of the above schematic diagram. Note that inFIG.2, the matrix1is represented as a region which is in a lightest color (white), while the particulate phase2is represented as a region which is in a darkest color (black). Further, the by-product phase3is represented as a region in a color which is slightly darker (pale gray) than that of the matrix1, while the hard phase4is represented as a region in a color between the color of the by-product phase3and the color of the particulate phase2in terms of darkness (dark gray). (Matrix1) As shown in (a) ofFIG.2, the matrix1is a phase which accounts for a largest proportion in the Fe-based sintered body. The matrix1is formed in a network shape. In a case where, for example, the Fe-based sintered body as a whole is 100 parts by weight, the matrix1accounts for preferably not less than 75% by mass, and more preferably not less than 60% by mass and not more than 80% by mass in the Fe-based sintered body. Further, the matrix1is a phase containing Fe as a main component. The matrix1contains Fe at a concentration of not less than 99 atomic percent (hereinafter, expressed as at %), and preferably not less than 99.9 at %. The matrix1contains αFe. It is preferable that most of the matrix1be made of αFe. In a case where C atoms is present in the form of a solid solution in αFe, the αFe containing C atoms in the form of a solid solution is also referred to as a ferrite phase. The network shape means, for example, that a continuous phase is formed in a net-like shape when the material structure is viewed in plane (when a cross section is observed) as shown in (a) ofFIG.2. The net-like structure of the matrix1has gaps in a net. In the gaps, the particulate phase2, the by-product phase3, and the hard phase4are scattered like islands, so that an island-like composite structure of the Fe-based sintered body is formed. Further, since the matrix1is polycrystalline, there is a crystal grain boundary in the network-like structure (net-like structure). Since the Fe-based sintered body is formed by sintering, there may be some voids in the matrix1. The matrix1may have a concentration distribution and/or may have a plurality of phases. Such a matrix1is excellent in thermal conductivity. Note that in practice, the matrix1has the network-like structure in a three-dimensional space although (a) ofFIG.2is a schematic view of the material structure viewed in plane. In the Fe-based sintered body in accordance with the present embodiment, the matrix1can function as a continuous path (thermal conduction path) effective for thermal conduction. Further, the matrix1may have a cementite content of not more than 5% by mass, and preferably not more than 1% by mass. The matrix1may have an αFe content of not less than 70% by mass, or not less than 60% by mass and not more than 80% by mass. Further, αFe may be in a ferrite phase, and a two-phase structure of the ferrite phase and cementite may be a layered structure. In addition, it is preferable that cementite, which is likely to hinder heat conduction, be in a localized state. The matrix1may satisfy at least one of the following conditions: the content of Cu is not more than 0.1% by mass; and the content of Si is not more than 0.1% by mass. Further, the matrix1may contain another impurity. However, such an impurity may act to, for example, lower a thermal conductivity or promote generation of a carbide. Therefore, it is preferable that the matrix1be produced so as to have a low impurity content. (Particulate Phase2) The particulate phase2is present as a phase which is derived from the TiB2powder used in producing the Fe-based sintered body. Remaining part of the TiB2powder after a sintering reaction becomes the particulate phase2. Accordingly, the particulate phase2is present, in the Fe-based sintered body, at a proportion which varies depending on conditions of the sintering reaction. Therefore, the proportion of the particulate phase2present is not particularly limited. The particulate phase2present accounts for, for example, a proportion of not less than 10% by mass in the Fe-based sintered body. Preferably, the particulate phase2present accounts for a proportion of not less than 15% by mass and not more than 20% by mass. Since the particulate phase2has a hardness which is higher than that of the matrix1, the particulate phase2improves the hardness of the Fe-based sintered body. (By-Product Phase3) The by-product phase3is a phase containing Fe2B generated by a reaction between Fe and B which is supplied from TiB2. In other words, the by-product phase3is a phase containing Fe2B generated, as a by-product, by decomposition of TiB2in a reaction in which TiC is generated, during the sintering reaction. It is clear from (a) ofFIG.2that the by-product phase3is formed at spots where the TiB2powder, which is a raw material, probably has originally existed. In addition, it is clear from (a) ofFIG.2that the hard phase4, which will be described below, is formed in the vicinity of the by-product phase3and the particulate phase2. Since the by-product phase3has a hardness which is higher than that of the matrix1, the by-product phase3improves the hardness of the Fe-based sintered body. (Hard Phase4) The following will describe the hard phase4, with reference to (b) ofFIG.2which shows the enlarged view of the portion of the backscattered electron image. As shown in (b) ofFIG.2, the hard phase4in accordance with the present embodiment has a ring shape or a ring-like shape as a characteristic shape. In the present specification, the ring shape or the ring-like shape is used to mean not only a perfectly-round shape but also a distorted circular shape (shape irregularly curved in a circumferential direction) as in an example shown in (b) ofFIG.2. In addition, the hard phase4may be a continuous ring (closed circle) which has no end in the circumferential direction, as in the example shown in (b) ofFIG.2, or may be a ring that is partially open. In other words, the hard phase4may have a shape which extends from one end to the other end. The hard phase4has a width L of not more than 1.0 μm, preferably not more than 0.4 μm, and more preferably not less than 0.2 μm and not more than 0.4 μm, in a direction perpendicular to the circumferential direction. The width L can be measured as follows. That is, first, specified as shown in (b) ofFIG.2is, for example, a border between the region (dark gray region) of the hard phase4and a region of another phase (e.g., the matrix1or the by-product phase3) in the backscattered electron image. In the direction perpendicular to the circumferential direction of the hard phase4, it is possible to measure the width L of the hard phase4on the basis of the border which has been specified. For example, the width L of one hard phase4can be an average value obtained by measuring widths at a plurality of positions of that one hard phase4. The hard phase4can be also referred to as a finely dispersed phase in the matrix. Note that as shown in (a) ofFIG.2, the hard phase4may be in various shapes, and may be in a string shape. In a case where the hard phase4is in a string shape, it is only necessary that the above-mentioned condition is satisfied by the width L of the hard phase4in a direction perpendicular to a longitudinal direction (a direction extending from one end to the other end) of the hard phase4. The hard phase4contains TiC, which is known to be excellent in hardness. Therefore, the Fe-based sintered body in the present embodiment can have a significantly improved hardness, by including the hard phase4. Further, the matrix1functions as a heat conduction path, as described above. Consequently, the Fe-based sintered body in the present embodiment can have both of a high hardness and a high thermal conductivity. The hard phase4is formed by a non-equilibrium reaction during a sintering reaction. The non-equilibrium reaction occurs, in minute regions, between the TiB2powder and C which is supplied by diffusion from a periphery to an inside of a green compact. Therefore, the Fe-based sintered body in accordance with the present embodiment can be stably produced, as compared to, for example, a case where an alloy tool steel is produced while a material structure of steel is controlled. Specifically, the Fe-based sintered body in accordance with an aspect of the present invention has a hardness of not less than 300 HV (Vickers hardness) and a thermal conductivity of not less than 30 W/(m·K). Note that the hardness of not less than 300 HV can be roughly converted into Rockwell hardness and expressed as not less than 30 HRC (the conversion equation will be described later). Note that the Fe-based sintered body may have a difference in hardness between a surface portion which is exposed to outside and an inside portion which is present closer to a center as compared to the surface portion. In the Fe-based sintered body in accordance with an aspect of the present invention, the hardness at the surface portion tends to be higher than that of the inside portion closer to the center, due to a reaction during sintering as described later. In the present specification, the term “hardness” means the hardness of the surface portion unless otherwise specified. What is important as a characteristic (material characteristic) of the Fe-based sintered body is the hardness of the surface portion. The Fe-based sintered body in accordance with an aspect of the present invention may have a hardness of not less than 400 HV (40 HRC), or not less than 525 HV (50 HRC). The Fe-based sintered body in accordance with an aspect of the present invention may have a thermal conductivity of not less than 40 W/(m·K), not less than 45 W/(m·K), or not less than 50 W/(m·K). In the present specification, the term “thermal conductivity” means a thermal conductivity at room temperature unless otherwise specified. The Fe-based sintered body in accordance with an aspect of the present invention has a hardness of not less than 525 HV (50 HRC) and a thermal conductivity of not less than 40 W/(m·K). <Method of Producing Fe-Based Sintered Body> The following description will discuss in detail a method of producing the Fe-based sintered body of the present embodiment. (Raw Materials) As raw materials of the Fe-based sintered body, Fe fine powder and TiB2fine powder are used. Although these fine powders are not particularly limited in shape, these fine powders are preferably microscopic powders so that it is possible to obtain a mixed powder in which these fine powders are uniformly mixed in a powder mixing step (described later). For example, the Fe fine powder may have an average particle size of not more than 10 μm, and preferably not less than 3 μm and not more than 5 μm. Meanwhile, for example, the TiB2fine powder may have an average particle size of not more than 5 μm or less, and preferably not less than 2 μm and not more than 3 μm. The Fe fine powder is preferably a pure iron fine powder having a carbon density of not more than 0.1% by mass. The TiB2fine powder may be a commercially available TiB2fine powder of a typical purity. (Molding Step) In a molding step, first, the Fe fine powder and the TiB2fine powder are uniformly mixed (mixing step). In this mixing step, it is only necessary to uniformly mix these powders, and specifically how to mix the powders is not particularly limited. For example, the powders may be mixed by using a ball mill. It is preferable that the powders be mixed by using a planetary ball mill. Further, in the mixing step, the powders may be subjected to wet mixing in which ethanol or the like is added, or subjected to dry mixing. When the powders are subjected to wet mixing, a drying step is carried out for volatilization of ethanol or the like used. There is no particular limitation on a specific drying method in the drying step. Next, in the molding step, the mixed powder, in which the Fe fine powder and the TiB2fine powder are mixed together at a desired ratio (amount ratio), is molded (pressure-molded), so that a compact is obtained. There is no particular limitation on density of the compact thus obtained and on molding pressure. Note that in a sintering step described later, sintering may be carried out while the mixed powder is being molded (while the molding step is being carried out). (Sintering Step) In the sintering step in the present embodiment, sintering is carried out by heating and applying pressure at the same time. As a method of carrying out such sintering, it is possible to select and apply as appropriate a conventionally known solid phase sintering method. However, it is required to appropriately adjust sintering conditions (temperature, pressure, and atmosphere) so that the above-described Fe-based sintered body can be obtained. In the sintering step, for example, the pressure is applied by using a pressure member which is made of graphite. This causes C derived from the pressure member to enter the compact when sintering is carried out. Therefore, C is supplied to a reaction field where a sintering reaction occurs, so that finer TiC is generated by that reaction between TiB2and C. More specifically, the following reaction occurs in the sintering step. That is, first, the TiB2fine powder, which is a raw material, is at least partially decomposed. At the same time, particles of the Fe fine powder are fused to each other. This results in formation of a network-like matrix which contains Fe as a main component and which also contains Ti. Then, Ti derived from the TiB2fine powder reacts with C which is derived from the pressure member or the like (which may be C originally present in Fe). This reaction generates TiC which is finely dispersed in the matrix1. Further, a temperature for the sintering is a temperature at which the matrix includes αFe and at which γFe is unlikely to be generated. The “temperature at which γFe is unlikely to be generated” refers to a temperature at which γFe is not likely to be generated during the sintering step under control of various electric discharge sintering conditions including a local temperature. Then, in the sintering step, C is mainly consumed to generate TiC. This allows the Fe-based sintered body to be produced while generation of cementite is suppressed. The method of producing the Fe-based sintered body in the present embodiment includes the sintering step in which such a reaction occurs. In order to cause the above reaction, the sintering step is carried out at a temperature of not lower than 1323 K and at a pressure of not lower than 15 MPa. The above temperature is a sintering temperature which is set in a sintering device. In other words, the above temperature is a highest achievable temperature in the sintering step. The above temperature is preferably not lower than 1373 K, and more preferably not lower than 1423 K. Further, it is preferable that the above temperature be not lower than 1323 K and not higher than 1447 K. This is because at such a temperature, Fe and Fe2B are prevented from reacting with each other and from forming a liquid phase. The above pressure is preferably not lower than 15 MPa and not higher than 90 MPa. In the sintering step, there is no particular limitation on a temperature increasing rate, but the temperature increasing rate may be, for example, 100 K/min. The highest achievable temperature may be kept for a period of time (holding time) of substantially 0 seconds, or longer than 0 seconds and not longer than 600 seconds. Further, in the sintering step, it is preferable to use an electric discharge sintering method. The electric discharge sintering method is a method in which (i) electric current is applied between a formwork and a sinter material (powder) with which the formwork is filled and (ii) a sintering reaction is caused to occur by using heat (Joule heat) which is generated by electric current application. The electric discharge sintering method is carried out by using an electric discharge sintering machine. The electric discharge sintering machine carries out electric discharge sintering, while a material to be sintered (compact or powder) is covered by a graphite cylindrical die and a graphite punch such that the pressure is applied to the material by the graphite punch. The electric discharge sintering machine may carry out electric discharge sintering by application of pulse electric current or continuous electric current. The electric current to be applied only needs to be an electric current under a condition where a voltage of not less than a critical voltage is applied to the material to be sintered. Use of the electric discharge sintering method makes it possible to uniformly increase the temperature of the material to be sintered, so that a uniform and high-quality Fe-based sintered body can be obtained. It should be noted here that in general, the sintering reaction is considered to proceed sufficiently at a temperature of approximately 1000 K, in a case where electric discharge sintering is carried out for producing a metal-based (e.g., Fe-based) sintered body. However, in a case where the sintering temperature is approximately 1000 K, the Fe-based sintered body of the present embodiment cannot be obtained because the hard phase4containing TiC is not generated at that temperature. As a result of diligent studies, the inventors of the present application have found that: in a case where the above-described sintering conditions (i.e., a temperature of not less than 1323 K and a pressure of not less than 15 MPa) are employed, the hard phase4containing TiC is generated and the Fe-based sintered body has an improved hardness though a mechanism for this is not completely clarified. The inventors have arrived at the present invention on the basis of such findings. Note that in the sintering step, it is not necessary that a material of the punch etc. is graphite. If such is the case, sintering can be carried out after the compact has its surface coated with graphite or impregnated with C. It is alternatively possible to sinter a compact having a surface to which carbon powder is adhered. In the above-described electric discharge sintering method, operations are relatively easy, and the temperature and pressure in sintering can be controlled in a relatively stable manner. This makes it easy to stably produce the Fe-based sintered body. (Post-Step) The method of producing the Fe-based sintered body may include the step of polishing and cleaning a surface of a sintered body after the sintering step. FIG.3shows an example of a result of observing a surface and a cross-section of the Fe-based sintered body in accordance with an aspect of the present invention, which Fe-based sintered body is produced by the above-described steps.FIG.3shows backscattered electron images that were obtained by observing a sample, which had been polished so that it became possible to observe a material structure of the Fe-based sintered body in accordance with an embodiment of the present invention. (a) ofFIG.3shows a backscattered electron image of the surface of the sample, and (b) ofFIG.3shows a backscattered electron image obtained by observing the cross section of the sample. It is clear from (a) and (b) ofFIG.3that the Fe-based sintered body has the island-like composite structure (seeFIG.2) formed as described above. It is also clear that the hard phase4is formed inside (in the cross section of the sample of) the Fe-based sintered body. (Hot Press Die) Note that the Fe-based sintered body of the present embodiment may be used for production of a hot press die. The present invention encompasses the hot press die which is produced by using the Fe-based sintered body of the present embodiment. (Variations) In the method of producing the Fe-based sintered body in accordance with an aspect of the present invention, a calcination step may or may not be included between the molding step and the sintering step described later. When the method includes the calcination step, fine carbon particles are added to the Fe fine powder and the TiB2fine powder and mixed together, and a resultant mixed powder is molded so that a compact is obtained. Then, the calcination step is carried out by using the compact. The Fe-based sintered body in accordance with an aspect of the present invention may be produced by steps including the calcination step. EXAMPLES The following description will discuss the Fe-based sintered body in accordance with an aspect of the present invention in more detail, with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples. First Example (Sample Preparation) Pure Fe fine powder having an average particle size in a range of 3 μm to 5 μm and TiB2fine powder having an average particle size in a range of 2 μm to 3 μm were dry-mixed at 100 rpm for 1 hour by using a planetary ball mill. A pure Fe:TiB2ratio was 80:20 in mass ratio (70:30 in volume ratio). In a container of the planetary ball mill, ceramic balls (balls) were provided such that an amount of the ceramic balls was 150 g per 15 g of the above powders to be mixed. Then, mixing was carried out. After the above dry mixing, 15 ml to 20 ml of ethanol was added in the container of the planetary ball mill, and wet mixing was carried out for 3 hours. After this wet mixing, a resultant slurry was naturally dried, so that a mixed powder was obtained. Then, the mixed powder thus obtained was loaded into a graphite framework of an electric discharge sintering machine. While pressure was applied by using a graphite punch, electric current was applied at the same time as heating, so that electric discharge sintering was carried out. The sintering temperature (maximum achievable temperature) was set at 1273 K to 1423 K, and the pressure was set at 50 MPa. The temperature increasing rate was set to 100 k/min, and the holding time at the maximum achievable temperature was set to substantially 0 seconds. After sintering, a resultant sample was taken out from the electric discharge sintering machine, and polished. After this polishing, the sample was subjected to X-ray diffraction measurement, electron microscopy, thermal conductivity measurement, density measurement, and a hardness test. (X-Ray Diffraction Measurement) The sample was ground so as to be a powder sample, and the powder sample was subjected to X-ray diffraction measurement. As an applied X-ray, Cu Kα ray was used.FIG.4shows measurement results. (a) ofFIG.4is a diagram of examples of X-ray diffraction patterns obtained by subjecting powder samples, which had been prepared at sintering temperatures in a range of 1273 K to 1423 K, to powder X-ray diffraction measurement with use of an X-ray diffraction device. (b) ofFIG.4is an enlarged view of portions at a diffraction angle 2θ of approximately 35° in the X-ray diffraction patterns. (c) ofFIG.4is an enlarged view of portions at a diffraction angle 2θ of approximately 45° in the X-ray diffraction patterns. InFIG.4, diffraction peaks of TiB2are marked with circles, diffraction peaks of αFe are marked with triangles, diffraction peaks of Fe2B are marked with squares, and diffraction peaks of TiC are marked with diamonds. As shown in (b) ofFIG.4, no clear peaks of TiC and Fe2B are found for the sample prepared at a sintering temperature of 1273 K. This means that in this sample, TiC is not generated. On the other hand, clear diffraction peaks of TiC and Fe2B were observed for the samples prepared at sintering temperatures of 1323 K, 1373 K, and 1423 K. It is also clear from the diffraction patterns shown in (c) ofFIG.4that Fe2B diffraction peaks are observed for the samples prepared at the sintering temperatures of 1323 K, 1373 K, and 1423 K. (Electron Microscopy) Each of the samples was subjected to electron microscopy of a sample surface and a sample cross section. The sample surface is a surface that was exposed as a result of polishing a portion that had been in contact with the graphite punch during the electric discharge sintering. The sample cross section is a portion which had been inside the Fe-based sintered body and which was exposed as a result of polishing a cut surface obtained by cutting a sintered body after sintering. Backscattered electron images of the sample surface and the sample cross section were captured, and the sample surface and the sample cross section were subjected to composition analysis by wavelength dispersive X-ray analysis (WDX). In addition, concentrations of TiB2at the sample surface and at the sample cross section were measured by WDX. As a result, it was found that a higher sintering temperature resulted in a lower TiB2concentration at each of the sample surface and the sample cross section (seeFIG.6, which will be described later). Further, the sample surface of the sample prepared at a sintering temperature of 1373 K was subjected to local WDX analysis.FIG.5shows results of the local WDX analysis. (a) ofFIG.5is a diagram showing points in a backscattered electron image of the sample, which points were subjected to the local WDX analysis. (b) ofFIG.5is a diagram showing results of composition analysis at eight points which were subjected to the WDX analysis. It is clear from (a) and (b) ofFIG.5that TiC is present together with the matrix1containing Fe as a main component, at points (1) to (3) at each of which a ring-shaped hard phase4is observed. It is also clear that TiB2is present at points (4) and (5) where the particulate phase2in a darker color (black) is observed. Further, it is clear that Fe2B is present at points (6) and (7) where the by-product phase3is observed, and at point (8) where the matrix1is observed, the sample was substantially entirely made of Fe. (Thermal Conductivity Measurement, Density Measurement, and Hardness Test) The thermal conductivity measurement was carried out by a steady-state method (a method of measuring a thermal conductivity by giving a steady-state temperature gradient to a sample to be measured). That is, one end of the sample to be measured was set to a high temperature and the other end of the sample was set to a low temperature. Then, temperatures at respective points in the sample were measured, so that a thermal conductivity was obtained. Density measurement was carried out by using the Archimedes method. A relative density was determined by dividing, by a theoretical density, a density which had been measured according to the Archimedes method. The hardness test was carried out for the sample surface and an inside of the sample, by the Vickers hardness test. In the hardness test, a test force was set to 30 kg and a retention time was 10 seconds. (Results) FIG.6shows results of the above-described tests together. Note that the thermal conductivity and the Vickers hardness are shown together with errors which were obtained by carrying out more than one measurement. The errors are the standard deviation. Note that Vickers hardness (HV) can be converted into Rockwell hardness (HRC) by using the following conversion equations. (i) Cases where the Vickers hardness is not less than 520 HV; HRC=(100×HV−15100)/(HV+223) (ii) Cases where the Vickers hardness is not less than 200 HV and less than 520 HV; HRC=(100×HV−13700)/(HV+223). In Comparative Example 1 in which the sintering temperature is 1273 K, the thermal conductivity is approximately 44 W/(m·K) and the Vickers hardness is approximately 220 HV. In a sample of Comparative Example 1, no TiC is generated in a material structure, and there is no hard phase4which increases the hardness. Thus, although the sample of Comparative Example 1 exhibits a high thermal conductivity due to thermal conductivity provided by the matrix1, the hardness of this sample is inadequate. In contrast, it is clear that in Examples 1 to 3 in each of which the sintering temperature is in a range of 1323 K to 1423 K, the hardness improves as the sintering temperature increases. In terms of the thermal conductivity, Examples 1 and 2 are slightly inferior to Comparative Example 1. Although the reason for this is not clear, it is inferred that it may be one factor that Ti and C are in the form of a solid solution in the matrix1. As the sintering temperature increases, TiC is more easily formed since diffusion of Ti and C is promoted. It is also clear from each of the results of Examples 1 to 3 that as the sintering temperature increases, TiB2concentrations at the sample surface and inside the sample decrease. It is considered that a larger decrease in TiB2concentration after sintering results in a larger amount of TiC generated. Further, as the sintering temperature increased, the density and the relative density increased. It is clear from the First Example that an aspect of the present invention makes it possible to more stably produce a Fe-based sintered body which has both of a high hardness and a high thermal conductivity. Second Example In the First Example, samples were prepared at different sintering temperatures in a range from 1273 K to 1423 K, respectively, while the holding time at the maximum achievable temperature was substantially 0 seconds. On the other hand, in the Second Example, samples were prepared by setting the holding time at the maximum achievable temperature to substantially 0 seconds, 300 seconds, and 600 seconds, respectively, while the sintering temperature was kept at 1373 K. The samples were prepared under the same conditions as those in the First Example described above, except that the sintering temperature was set to 1373 K and the holding time at the maximum achievable temperature was set to substantially 0 seconds, 300 seconds, and 600 seconds. Further, various tests were carried out as in the First Example described above. FIG.7shows results of X-ray diffraction measurement. (a) ofFIG.7is a diagram of examples of X-ray diffraction patterns obtained by subjecting powder samples, which had been prepared under conditions where the sintering temperature was 1373 K and the holding time was substantially 0 seconds to 600 seconds, to powder X-ray diffraction measurement with use of an X-ray diffraction device. (b) ofFIG.7is an enlarged view of portions at a diffraction angle 2θ of approximately 35° in the X-ray diffraction patterns. (c) ofFIG.7is an enlarged view of portions at a diffraction angle 2θ of approximately 45° in the X-ray diffraction patterns. InFIG.7, correspondence between various marks and materials is same as that described above with reference toFIG.4. As shown in (b) inFIG.7, as the holding time increased, diffraction peak intensity of TiC increased. In addition, as shown in (c) ofFIG.7, as the holding time increased, diffraction peak intensity of Fe2B increased. FIG.8shows results of the various tests together. Note that the thermal conductivity and the Vickers hardness are shown together with errors which were obtained by carrying out more than one measurement. It is clear from the results of Examples 4 to 6 in which the holding times are substantially 0 seconds, 300 seconds, and 600 seconds, respectively, that as the holding time increases, the thermal conductivity and the hardness significantly improve. Further, as the holding time increased, the density and the relative density increased. As described above, a Fe-based sintered body in accordance with an aspect of the present invention can have an improved thermal conductivity and an improved hardness by increasing the sintering temperature and increasing the holding time. In other words, the thermal conductivity and the hardness can be controlled in a relatively simple manner by controlling sintering conditions. Therefore, it is clear that an aspect of the present invention makes it possible to more stably produce a Fe-based sintered body which has both of a high hardness and a high thermal conductivity. Third Example In the First and Second Examples, the samples were each prepared by setting the pure Fe:TiB2ratio to 80:20 in mass ratio. On the other hand, in the Third Example, a sample was prepared by setting the pure Fe:TiB2ratio to 87:13 in mass ratio (Example 7). Meanwhile, the sintering temperature was set to 1373 K, and the holding time at the maximum achievable temperature was set to 600 seconds. Except for these conditions, the sample was prepared under the same conditions as those in the First Example described above. Further, various tests were carried out as in the First Example described above. FIG.9shows results thus obtained. (a) ofFIG.9is a backscattered electron image which was obtained by observing, with aid of an electron microscope, a material structure of the sample prepared. (b) ofFIG.9is a table which shows test results of the sample together. As shown in (a) ofFIG.9, the sample of the Third Example has a matrix1, a particulate phase2, a by-product phase3and a hard phase4, as in the First and Second Examples. Further, as shown in (b) ofFIG.9, it is possible to obtain a Fe-based sintered body which has both of a high hardness and a high thermal conductivity, also under conditions of the Third Example. Note that the following is clear from a comparison between the Third Example and Example 6 of the Second Example (seeFIG.8). That is, a larger amount of TiB2introduced results in an improved hardness and an improved thermal conductivity. Accordingly, the Fe-based sintered body in accordance with an aspect of the present invention makes it possible to relatively easily control the thermal conductivity and the hardness, by controlling a ratio of raw materials (pure Fe:TiB2ratio) to be introduced. Therefore, it is clear that an aspect of the present invention makes it possible to more stably produce a Fe-based sintered body which has both of a high hardness and a high thermal conductivity. ADDITIONAL MATTERS The present invention is not limited to the description of the embodiments above, but may be altered in various ways by a skilled person within the scope of the claims. The present invention encompasses, in its technical scope, any embodiment based on an appropriate combination of technical means disclosed in the above description. REFERENCE SIGNS LIST 1matrix2particulate phase (first sub-phase)3by-product phase (second sub-phase)4hard phase | 42,251 |
11858046 | DETAILED DESCRIPTION OF THE INVENTION A description of example embodiments of the invention follows. Metal powders can be formed by reducing a metal halide with a molten reducing metal in a sealed reaction vessel that is free of added oxygen and water. A vortex can be established in the molten reducing metal, and the metal halide is introduced into the vortex, typically through a hopper and feed tube. Following this procedure, the molten reducing metal remains in a stoichiometric excess to the metal halide. Metal powders and a salt can be produced, which are first separated from the unreacted reducing metal. Next, the metal powder is separated from the salt, and then the metal powder is recovered. The reducing metal includes a Group I or Group II metal. Three variables exhibit a high degree of influence on powder particle size: the temperature at which the reaction occurs, the relative concentration of the metal halide to the concentration of the reducing metal, and the melting point of the produced metal or alloy powder. Typically, the metal powder particle size is proportional to these variables according to Formula (1), where T is the temperature in Kelvin: MetalPowderParticleSizeα[[ConcentrationofMetalHalideConcentrationofReducingMetal]T13(1) In view of the Formula (1), reaction conditions that favor the production of smaller particles include a lower temperature and a low concentration of metal halide relative to the concentration of the reducing metal. Without wishing to be bound by theory, the process of particle and aggregate formation parallels standard particle flame synthesis processes. Thus, when a primary particle or cluster encounters another cluster, they stick together to form an aggregate that tends to have an open structure, provided the conditions (temperature and particle density) permit continued aggregation. Thus, smaller aggregates are produced when the concentration of the metal halide is lower because the metal powder particles that form are more dispersed in the reducing metal, and therefore the metal powder particles are less likely to physically interact and form aggregates. Finally, the particles are large and cool enough that the aggregates freeze. Additionally, at higher temperatures the particles are stickier so they coalesce for longer. Therefore, the primary particles are larger and have a smaller surface area. At higher concentrations, the particles can collide and coalesce more rapidly before they cool, again leading to larger primary particles and lower surface area. As described herein, reacting a metal halide with a molten reducing metal while subjecting the molten reducing metal to a vortex can yield particles that are highly pure and provide improved flow properties. Preferably, the reactions occur under conditions that remain constant or bounded by a limited range of temperatures and stoichiometry. The methods described herein typically involve four steps. First, the metal halide is reduced by the reducing metal to produce metal particles. Second, the remaining, unreacted reducing metal is removed from the metal particles. Third, the salt byproduct is removed. Fourth, the metal powder particles are recovered. Metal Halide Reduction In a first step, the metal halide is reduced to a metal powder and a salt is produced as a byproduct. Metal halides can be reacted with a stoichiometric excess of a reducing metal. Metal halides that can be reacted include halides of tantalum, nickel, aluminum, zirconium, vanadium, tin, titanium, silicon, niobium, and hafnium. Typically, the metal halide is a metal chloride. The reducing metal includes a Group I or Group II metal. For example, the reducing metal can be sodium, potassium, magnesium, calcium, or mixtures thereof. Example reductions include: TaCl5 reduced by sodium; TaCl5 reduced by a mixture of sodium and potassium; HfCl4 reduced by a mixture of sodium and potassium; a mixture of TaCl5 and NiCl2 reduced by a mixture of sodium and potassium; AlCl3 reduced by sodium; ZrCl4 reduced by sodium; VCl4 reduced by sodium; SnCl4 reduced by sodium; TiCl4 reduced by sodium; and SiCl4 reduced by sodium. Subhalides (e.g., halides of lower oxidation states of the metal elements that contain less halide (e.g., TiCl2 or TiCl3) than its common halide (e.g., TiCl4)), including subchlorides, can also be reduced in the same manner, for example, titanium, zirconium, or tin subchlorides. An example reduction reaction proceeds according to Equation (2): TaCl5(s)+5Na(l)→Ta(s)+5NaCl(s) (2) In order to generate the reaction, the reducing metal is heated to a temperature above its melting point and below its boiling point in a sealed reaction vessel that is free of added oxygen and water. Higher temperatures can lead to the generation of reducing metal vapors that must be controlled. For example, when the reducing metal is sodium, more typical reaction temperatures are from 150° C. to 350° C., though temperatures up to 850° C. are possible. FIG.1Ais a schematic illustration of a sealed reaction chamber180suitable for conducting the metal halide reduction reaction. The reduction reaction condition occurs in a reaction vessel110, which can be formed of steel. The reaction vessel110can have a lip115that can facilitate the placement of a lid120on top of the reaction vessel110. Typically, the reaction vessel110is cylindrical. A mixer150having a mixing blade155creates a vortex or turbulent mixing conditions in the molten reducing metal160. A variety of commercially available mixers adapted with a variety of impeller blades can be used. For example, a 70 Watt IKA mixer (IKA Works, Inc.) and a Cowles-type blade (supplied by, e.g., INDCO, Inc.) can be used to establish turbulent mixing. Preferably, the mixer is operated so that the tip speed of the blade is about 4000 to about 6000 feet per minute, although mixing at tip speeds down to 1000 feet per minute can be sufficient. In a commercial scale operation, the RPM at which the mixer is operated can decrease as the length of the mixer blade increases. A countervailing factor is that the required tip speed increases as the diameter of the reactor increase. The reaction vessel110can provide the heat necessary to melt the reducing metal160. Metal halide130can be fed into the reaction vessel110via a hopper140. The hopper140can have a feed tube145that can control the deposition of the metal halide130such that it is deposited into the vortex of the molten reducing metal160. The metal halide130can be introduced into the reaction vessel110in the space above the vortex of the molten reducing metal160, as indicated inFIGS.1A and1B, or it can be introduced directly under the surface of the molten reducing metal160. Since the metal halide130is added to a reservoir of reducing metal160, the reducing metal160is present in an instantaneous stoichiometric excess. In other words, by feeding the metal halide130to the reducing metal160at a steady rate, the instantaneous stoichiometry of the reactants is such that the reducing metal160is present in a stoichiometric excess. Typically, the reducing metal160is present in an overall stoichiometric excess as well. Metal halides130are typically added until the reducing metal become stiff and the vortex collapses. For example, metal halides can be added up to about 40% by weight of the metal halide relative to the reducing metal. In some cases, the reducing metal is present in an overall stoichiometric excess of 5 to 1. In some cases, the reducing metal is present in an overall stoichiometric excess of 10 to 1. In some instances, the reducing metal160is heated between approximately 150° C. and approximately 350° C., which can permit partial consumption of the reducing metal160. In other instances, the reducing metal160can be heated as high as approximately 850° C. When the reducing metal160is heated to a higher temperature, a greater percentage of the reducing metal160is consumed in the reaction because if the byproduct halide salt becomes molten, the vortex can be preserved to higher levels of metal halide loading. When heating the reducing metal to a higher temperature, it is necessary to ensure that the mixer150, mixer blade155, reaction vessel110, and other components can withstand the elevated temperatures. After the metal halide130has been added to the molten reducing metal160, a metal powder, a salt byproduct, and excess reducing metal remain. FIG.1Bis a schematic illustration of another sealed reaction chamber180suitable for conducting the metal halide reduction reaction. The reaction chamber ofFIG.1Bis similar to that ofFIG.1A, except that the reaction vessel112includes a port170at the bottom of the reaction vessel112. The port170can be a freeze plugging valve. One advantage of using the reaction vessel ofFIG.1Bis that the reaction vessel112does not need to be tipped over in order to empty the contents. The sealed, reaction chamber180can be an airtight glovebox. An airtight glovebox can be constructed largely of glass plates attached to a metal frame. A glovebox permits an operator to manipulate objects within the glovebox while maintaining an inert reaction environment. The reaction chamber depicted inFIGS.1A and1Bcan be a bench-top glovebox, or it can be a larger glovebox suitable for pilot scale operations, in which case it may have work stations where several operators can access the interior of the glovebox. The reaction chamber can also be large enough to house industrial- or commercial-scale reaction vessels. For commercial scale production, an airtight vessel having automated loading and unloading can be used. Recycling of Excess Reducing Metal In a second step, the excess unreacted reducing metal is separated so that it can preferably be reused in another reduction reaction. The excess reducing metal can be as much as 50% by weight, or more in some cases, of the starting amount of reducing metal. Therefore, recovery and reuse of the reducing metal are important economic considerations. As illustrated inFIG.2, the excess reducing metal160, along with the metal powder and salt formed during the first step, can be decanted into a bakeout vessel210. The bakeout vessel210can have a lip215that can facilitate the placement of a lid220on top of the bakeout vessel210. The bakeout vessel210can have one or more ports230,235that can be used to remove material from the bakeout vessel210. Preferably, the ports230,235are adjustable so that they can extend to differing depths within the bakeout vessel210. Preferably, the ports230,235are formed of a non-conducting ceramic in order to reduce long-range electron mediated reduction. To recover the reducing metal, the bakeout vessel can be heated to just above the melting point of the salt formed as a reaction byproduct. For example, when the metal halide is titanium chloride and the reducing metal is sodium, the salt produced is sodium chloride, which has a melting point of approximately 801° C. In this example, the bakeout vessel210can be heated to just above 801° C., which is just above the melting point of sodium chloride. At this temperature, the sodium chloride salt begins to melt and separate from the reducing metal, thereby creating a salt bath240and a molten reducing metal phase260. A small amount of the sodium dissolves in the molten sodium chloride salt (approximately 2 molar % at 801° C.). The salt bath phase240includes the metal powder245created by reducing the metal halide130. A first port230can use used to siphon out the bulk of the excess molten reducing metal260by applying a negative relative pressure in a capture tank. This molten reducing metal260that has been siphoned off can be captured in a capture tank and reused. The bakeout temperature can be adjusted by adding other salts and creating an eutectic system. For example, a 52:48 mix of calcium chloride and sodium chloride melts at approximately 500° C. Thus, the bakeout can occur in a lower temperature range (e.g., where stainless steel can be used instead of more expensive metals). By operating at a lower temperature, the surface area of the resulting metal powder can also be increased since a higher temperature leads to increased sintering. Care should be exercised to determine the boundary between the molten reducing metal and the salt so that only the molten reducing metal is removed. Typically, it is not possible to siphon off all of the excess molten reducing metal260. For example, there may be a layer of reducing metal260that is a few millimeters thick that remains after siphoning. Alternatively, or in addition, the excess molten reducing metal can be poured off (decanted). Alternatively, or in addition, residual reducing metal can be reacted with an alcohol, such as methanol. Once the reducing metal layer has been removed, the remaining reducing metal can be reacted with an anhydrous chloride, such as anhydrous hydrogen chloride (HCl) or chlorine gas (Cl2). However, the hydrochloric acid can attack the metal particles that have been formed. In order to protect the metal particles, a salt can be added to the bakeout vessel210either prior to or after pouring the molten reducing metal, salt, and metal powder into the bakeout vessel210. Typically, the salt added is the same salt formed during the reduction of the metal halide by the reducing metal. The salt produced in the neutralization reaction typically fills the voids in the metal, and chlorides can therefore attack the metal. By providing a layer of molten salt, direct contact between the halides and the metal can be reduced. Thus, the chloride tends to neutralize the free sodium, which has valence electrons having a long mean free path in the molten salt. The resulting product is a metal powder at least partially encapsulated in salt. The salt tends to have a glass-like appearance because it was melted and cooled. Salt Removal In a third step, the salt is removed. Metal powder having a higher surface area is generally less dense and contains more salt in narrower voids. In a first method of removing the excess salt from the metal particles, the metal particles encapsulated in salt are washed with water. Preferably, the metal particles encapsulated in salt are transferred to a new vessel prior to the water wash in order to prevent oxidation of the bakeout vessel. Frequently, the metal particles are washed in serial batches in a metal beaker or other metal container so that the concentration of salt is less than 1 ppm. An example reaction for removing excess salt is Equation (3), after which the liquids and dissolved solids are removed: Ta(s)+5NaCl(s)+2H2O(I)→Ta(s)+5NaCl(aq)+2H2O(I) (3) In a second method of removing the excess salt from the metal particles, the salt can be evaporated. One method of evaporating the salt is by sweeping an inert gas, such as argon, through the chamber at a temperature close to or above the melting point of the salt, such that the salt has an adequate vapor pressure to permit it to be removed in a reasonable time. The salt vaporizes, leaving behind the metal particles. The procedure can be conducted within a rotary furnace, which can limit the formation of a sponge from the metal particles. Preferably, the inert gas can be recycled. In a third method of removing the excess salt from the metal particles, ultrafiltration can be used to remove excess salts. One such system is provided by Koch Membranes. Metal Powder Recovery In a fourth step, the metal particles are recovered and can be subsequently dried if desired. For examples, the particles can be dried in a vacuum oven. After drying the metal particles can be collected and recovered as a free flowing powder. When the metal powder is exposed to air, it can be highly flammable, and its dust can be explosive. Thus, it must be handled with care, and preferably in an inert atmosphere, until the powder has been consolidated into a desired final form or else until the powder surface has been passivated by controlled exposure to oxygen. Example 1—Halide Powder Feed Test Instrumentation Setup A powder trickler was used for all halide powder trials to feed the reactant powders to a beaker containing alkali metal(s). This powder feeder consists of an adjustable hopper, discharge tube, stand, and 2-speed control pad. All reactant powders flowed readily through the tube given the vibration frequency at hand, except the TaCl5 and NiCl2 50/50 powder blend. This powder blend packed tightly inside both the tube and the hopper base. As a result, remaining powder was fed to the reaction beaker using a “hand-add” approach with a spatula for the TaCl5 and NiCl2 50/50 blend. All tests utilized an IKA 70 Watt mixer with the capability of producing speeds from 60 to 2000 rpm. A stainless steel, 1.20 inch diameter, turbine impeller blade was utilized for the first two tests performed, TaCl5 in excess sodium. All subsequent tests were performed using a stainless steel, 1.65 inch diameter, Cowles blade impeller to improve the incorporation of the reactant powder in the alkali metal. Even though the mixer maximum capacity was specified as 2000 rpm maximum, the mixer was utilized at speeds as high as 2135 rpm in the powder feed tests. A stainless steel 2000 mL beaker was implemented as the reaction vessel for all tests. A lid was constructed for trial 3 with 3 ports for the mixer impeller, powder feed tube, and alkali metal temperature thermocouple (TE-0111A). The lid eliminated a large amount of dusting within the glovebox while allowing for the reactant powder to be fed down into the alkali metal via a vertical feed tube. The 4th and 5th trials used a similar lid with a reduced diameter port to further minimize dusting to the glovebox. FIG.3is a P&ID of the test setup. The stainless steel beaker, V-0100, contained the alkali reducing metal. The reaction beaker was maintained at 200°−250° C. using a heater band (controlled via TC-0111) and a hot plate (controlled via TC-0110). The variation in alkali metal temperature was based upon the reactivity of the halide powder during each trial via physical observation. Halide powders were pre-weighed using scale WI-0120 and fed from the powder feeder, F-0125, to V-0100 in 5-10 gram increments. Argon was fed from an argon supply Dewar to the glovebox at a flow rate of 110 standard cubic feet per hour (scfh). Argon pressure was regulated down to 20-30 psig. The glovebox oxygen and moisture content was recorded prior to the start of each trial. Before any halide powders were exposed to the glovebox internals, the blower was de-energized and the purifier was isolated in an effort to preserve the integrity of the purifier. With the purifier isolated from the system, oxygen content was not accurately displayed on the glovebox control panel because the oxygen sensor was also sensitive to chlorides, and therefore provided an inaccurate reading due to the presence of chloride vapors in the glovebox. A vacuum filtration system was incorporated for the trials using NaK. This system consists of a filtration separation vessel, V-0134, that contains a 10 micron screen inserted within a stainless steel cup to retain the solids. A catch vessel (flask), V-0135, was used to prevent any filtered NaK carry-over and to protect the vacuum pump, PU-0130. This vacuum filtration set-up was also used to perform the methanol wash steps within product recovery when NaK was utilized. Test Procedure and Results A first experiment was conducted to assess the minimum reaction temperature and mixing parameters. In this first experiment, an inert atmosphere having as little oxygen and moisture as possible was established in the glovebox. The hot plate and heater bands were energized and set to 200° C. Once the alkali metal was up to temperature, a pinch test was performed by adding a small amount of reactant powder to the alkali metal. The pinch test must be performed with the lid removed from the vessel to observe for signs of reaction (such as a change in color or the generation of smoke). If no sign of reaction was observed at 200° C., then the temperature was increased in increments of 50° C. and the pinch test was repeated until a reaction was observed. All reactions were performed at 250° C. or less. The halide powders were manually weighed in 5-10 gram increments before being added to the hopper. Powder was fed from the hopper to the vessel, with pauses in feeding when smoking was observed. When the reaction step was completed, the mixer, heater band, and hot plate were de-energized to allow for the system to cool before the start of product recovery. A total of five experiments was performed; two utilized TaCl5 and molten sodium, whereas the remaining three reacted TaCl5, HfCl4, and a 50/50 (wt. %) mix of TaCl5 and NiCl2, each with NaK alloy. A consolidation of the test results displaying the amount of fed halide powder, the amount of alkali metal used, and the final amount of collected product after vacuum drying can be viewed for each test in Table 1 below. TABLE 1Reactant Charges and Fractional Yield SummaryChargedFractional YieldFed HalideAlkaliRecovered(actual/theoreticalTestPowder (g)Metal (g)Product (g)product)1. TaCl5in0.5090.000.0519.8%Excess Na2. TaCl5in19.15957.000.505.2%Excess Na3. TaCl5in41.16748.0013.6065.4%Excess NaK4. HfCl4in23.78718.709.8074.0%Excess NaK5. TaCl5/NiCl219.26728.405.2056.4%in Excess NaK At the start of Test 5, NiCl2 showed no sign of reaction at 200° C. when performing a pinch test; however, a reaction was visible at 250° C. Therefore, Test 5 was performed at 250° C. The 50/50 wt. % NiCl2/TaCl5 (Test 5) powder mix tightly packed within the hopper feed tube, as well as the base of the hopper, multiple times. As a result, approximately half of the feed was added to the NaK-containing vessel manually using a spatula. For the first two trials utilizing sodium, filtration took place in the reaction beaker, with the second test using a removable screen (<500 mesh) placed within the vessel. Material was scraped from the reaction vessel (and screen for the second test) before adding methanol to react residual sodium held up within the product. The reaction products were centrifuged for 0.5-2.0 hours at 3000 rpm and decanted, and a second methanol wash was repeated, followed by a de-ionized water wash to passivate the tantalum product. A second de-ionized water wash was performed using nitric acid to achieve a solution with a pH of 2. After decanting, the sample was then vacuum dried overnight at 95° C. For the trials performed with NaK, the vacuum filtration system in the glovebox was utilized to remove the excess NaK from the reacted product. Two methanol washes were performed to react any NaK held up with the product, and vacuum filtration was used to remove excess solvent within the product cake. As with the first two tests, methanol washing was followed by a de-ionized water wash in the glovebox to passivate the product followed by centrifugation at 3000 rpm for 30 minutes and decanting. A total of five or six water washes were performed before the product was vacuum dried overnight at 85-95° C. Each test performed with NaK utilized varying deionized (DI) water solutions based on the product isoelectric points. Table 2 describes the pH of the solutions used for water washing as well as the number of washes performed. Solution pH was adjusted using nitric acid or sodium hydroxide. TABLE 2Water Wash Criteria for Products Generated Using NaK.DI Water WashNo. of PerformedTestSolution pHWashes3. TaCl5in Excess2-36NaK4. HfCl4in Excess76NaK5. TaCl5/NiCl2inHalf at 2.50-3.05Half at 10-11Excess NaK Other observations include the following: Significant dusting was observed in the glovebox for Tests 1 and 2, which were performed with an open lid. The rotation of the mixer shaft can create argon currents that disperse some of the powder feed. Dusting was observed again for Test 3, but dusting significantly decreased so that very little was observed for Tests 4 and 5, which utilized a lid. When draining excess sodium from the product in Test 2, it was difficult to determine if the sodium drained through the inner mesh strainer assembly or if a hole was present in the mesh. Furthermore, some dark material (most likely product Tantalum) was removed with the excess sodium, and caught in the <500 mesh strainer. Sufficient mixing was established with the mixer running at 1625-1675 rpms in Test 3; however, once powder addition began, the mixing speed was increased to 1750 rpms to maintain a good vortex and surface movement. The hafnium tetrachloride powder used in Test 4 was denser and chunkier than the tantalum pentachloride previously used. Larger HfCl4 chunks appeared to sink in the NaK with no visible signs of reaction, whereas the loose, fine powder generated smoke and changed in color from white to black upon contact with NaK. The HfCl4 powder was filtered to remove these larger chunks prior to feeding the hopper and starting the reaction. At the start of Test 5, NiCl2 showed no sign of reaction at 200° C. when performing a pinch test; however, a reaction was visible at 250° C. Therefore, Test 5 was performed at 250° C. The 50/50 wt. % NiCl2/TaCl5 powder mix tightly packed within the hopper feed tube, as well as the base of the hopper, multiple times. As a result, approximately half of the feed was added to the NaK-containing vessel manually using a spatula. The amount of fed halide powder used in the last, fifth trial is a best estimate due to losing approximately 0.86 g when the feed tube on the lid assembly plugged during the feeding process. Salt Concentration Test A salt concentration test was performed to assess the quantity of metal halides that can be added while maintaining a vortex. A total of 797.17 grams of sodium were used, and a total of 477.69 g NaCl were added over the course of the trial. The first five salt charges were added in increments of 10 g, and all subsequent charges were fed in 25 g increments. After feeding 154.88 g of NaCl, a white-grey film skimmed over the surface of the sodium and surface motion was halted. When increasing the mixer speed from 1611 to 1750 RPMs, surface motion resumed in pockets. At a mixing speed of 1950 rpms, swirling became visible, but a vortex was still not observed. At 2008 rpms, an off-centered vortex developed to the left of the mixer shaft. Once NaCl addition reached 399.74 g, surface movement again ceased, but regenerated after four minutes of no movement. After adding 424.74 g of NaCl, movement again ceased, but was re-initiated by probing the surface with a flat blade. The salt feed was stopped at 477.69 g, after changes in fluid density and viscosity were observed and surface mixing no longer occurred. Conclusions All tests demonstrated that the halide powder-alkali metal reactions can be performed at 200° C. except for NiCl2, which should be reacted with alkali metals at 250° C. A dispersion of sodium and sodium chloride can have approximately 33 to 37 wt. % salt before changes in fluid density and viscosity were observed and surface mixing no longer occurred. Example 2—Halide Powder and Liquid Initiation Test Instrumentation Setup A second set of experiments was conducted to verify the reactivity of various powder and liquid halides with sodium metal. All tests were performed in a glovebox, inerted with Argon to eliminate oxygen and moisture from the atmosphere. Powder halide transfer: Aluminum Chloride and Zirconium (IV) Chloride powders were transferred into weighing dishes using a microspatula. The powders were then poured into the reaction cups from the weighing dishes. Liquid halide transfer: Vanadium (IV) Chloride, Tin (IV) Chloride, Titanium (IV) Chloride, and Silicon Tetrachloride were transferred into the reaction cups using 1 mL syringes. For each liquid halide, a volume of 0.1 mL was transferred into a syringe. The syringes were then placed in the glovebox. The syringes were then used to inject drops of each liquid halide into a reaction cup containing molten sodium metal. Reaction vessel: Stainless steel 2.5 oz cups were implemented as the reaction vessels for all tests. When not in use, stainless steel foil was placed on top of each reaction cup. FIG.4is a P&ID of the test setup. Each stainless steel cup, V-0100 through V-0600 contained sodium metal. The reaction cups were maintained at 240-260° C. using a hot plate (manually controlled via TC-0110). Halide powders were pre-weighed using scale WI-0120 and poured into V-0100 and V-0200. The scale used to weigh the powder halides only displays increments of 0.1 grams; therefore, the amount of halide powders added to each reaction cup was known to be less than 0.1 grams. Halide liquids were injected into the reactions cups using 1 mL syringes. Because of the limited dexterity in the glovebox and hazards associated with handling syringe needles, the liquid halides were transferred from storage bottles into syringes under the fume hood. The syringes were then placed in the glovebox. For each halide liquid, 0.1 mL or less was injected into the reaction cups V-0300 through V-0600. The setup for the liquid halides was the same with the exception that four reaction cups were used instead of two. Argon was fed from an argon supply Dewar to the glovebox at a flow rate of 65-70 scfh. Argon pressure was regulated down to 20-30 psig. The glovebox oxygen and moisture content was recorded prior to the start of each trial. Before any halide powders were exposed to the glovebox internals, the blower was de-energized and the purifier was isolated in an effort to preserve the integrity of the purifier. With the purifier isolated from the system, oxygen content was not accurately displayed on the glovebox control panel. Test Procedure and Results Each test began with equipment set-up in the glovebox, and establishing an inert atmosphere. The hot plate was energized and set to 250° C. In order to reach and maintain a sodium temperature of 250° C., the hot plate was set between 350° C. and 400° C. Once the sodium metal was up to temperature, the halides were added to the reactions cups one at a time. The tests were performed with the lid (foil) removed from the cup to observe signs of reaction (such as a change in color or the generation of smoke). If no sign of reaction was observed at 250° C., then the temperature was increased in increments of 50° C. and the test was repeated until a reaction was observed. All reactions were performed at 250° C. in order to establish a safe minimum temperature. Two experiments with halide powders were performed utilizing powdered AlCl3 and ZrCl4 reacted with molten sodium. Table 3 lists the consolidated test results displaying the amount of halide powder added, the amount of sodium metal used, the reaction temperature, and any observations during the reaction. TABLE 3Halide Powder Reaction ResultsHalideChargedPowderSodiumReactionTestAdded (g)Metal (g)Temp (C.)Observations6. AlCl3in<0.19.7245Color changeExcess Nato dark gray7. ZrCl4in<0.19.9250Color changeExcess Nato dark gray Other observations from the test include the following: ZrCl4 did not react as immediately as AlCl3. Four experiments were performed utilizing liquid VCl4, SnCl4, TiCl4, and SiCl4 reacted with molten sodium. Table 4 lists the consolidated test results displaying the amount of halide liquid added, the amount of sodium metal used, the reaction temperature, and any observations during the reaction. TABLE 4Halide Reaction ResultsHalideChargedLiquidSodiumReactionTestAdded (mL)Metal (g)Temp (C.)Observations8. VCl4in0.110.0245Color change toExcess Nablack.Temperatureincrease of 3° C.9. SnCl4in0.039.9256Color change toExcess Nadark grayBlue flameSome SnCl4evaporation10. TiCl4in0.0210.0251Color change toExcess NablackSome TiC14evaporation11. SiCl4in0.0810.1251SiCl4mostlyExcess Naevaporated onsodium surfaceColor change todark gray Other observations from the tests include the following: After transfer into the syringes, fuming out of the end of the needle was noticed with VCl4, SnCl4, and TiCl4. In the case of SnCl4 and TiCl4, fuming stopped once the needles were inserted into rubber stoppers. In the case of VCl4, fuming continued for 2 minutes after the needle was inserted into the rubber stopper. There was some pressure build up with the VCl4 syringe. Some VCl4 was released from the syringe when the stopper was removed from the end of the needle while in the glovebox. TiCl4 changed from clear to yellow while in the syringe. There appeared to be more oxide on the sodium surface for the SiCl4 reaction which could have resulted in the majority of the SiCl4 laying on the surface and slowly evaporating instead of reacting. SiCl4 is also more volatile than the other liquid halides tested. Conclusions AlCl3, ZrCl4, VCl4, SnCl4, TiCl4, and SiCl4 all react with sodium at approximately 250° C. There is potentially some evaporation when the liquid halides are introduced to sodium at 250° C. Example 3—Metal Powder Characterization Particle flow can be measured according to a standardized protocol, such as by using a Hall flow meter according ASTM International Standard B213. Molecular content of the metal powders produced by the methods described herein can be determined using LECO testers. For example, nitrogen and oxygen content can be tested with LECO Model TC436DR. Carbon and sulfur content can be tested with LECO Model CS444LS. Nitrogen, oxygen, and hydrogen content can be tested with LECO Model TCH600. Purity can be assess by glow discharge mass spectrometry or inductively coupled plasma mass spectrometry. Example 4—Titanium Powder 140 g of sodium metal was melted and brought to 250° C. in an Inconel reactor vessel. The sodium was then stirred using a Cowles blade mixer rotating at 2200-2300 rpm. Liquid titanium chloride (from Sigma Aldrich) was fed over approximately 1 hour into the stirred sodium, until 60 g of titanium chloride had been added, at which point the reaction was stopped by turning off the feed so that titanium chloride is no longer added to the reaction vessel. At the end of the reaction, the vortex in the sodium had substantially disappeared. Once the reaction was completed, the reactor vessel was sealed, transferred to a furnace, and heated to 825° C. for four hours to reduce the surface area of the titanium metal produced in the reaction. After the high temperature treatment, the unreacted sodium was removed from the reaction products and the titanium powder, coated in salt, was washed in water to remove the coating of sodium chloride encapsulating the metal. Washing continued until washwater conductivity fell below 2 microsiemens. The recovered titanium powder was dried overnight in a vacuum oven at 100° C. The titanium powder thus produced was analyzed by inductively coupled plasma mass spectrometry (ICP-MS) and LECO instruments, and was found to contain below 150 ppm iron, below 300 ppm total transition metals, and below 3000 ppm oxygen. The results demonstrate that the titanium powder falls within purity limits as described in UNS No. R50550. FIGS.5A and5Bare scanning electron microscope images of the recovered titanium powder. Visual assessment of SEM images showed particle agglomerates predominantly in the 50 micron range, with primary structure mainly at 3-5 microns. Example 5—Hafnium Metal 113 g of sodium metal was melted and brought to 250° C. in an Inconel reactor vessel. The sodium was then stirred using a Cowles blade mixer rotating at 2000-2500 rpm. Powdered hafnium chloride (from Areva) was pulse-fed over approximately 1 hour into the stirred sodium, until 82 g of hafnium chloride had been added, at which point the reaction was halted. At the end of the reaction, the vortex in the sodium had substantially disappeared and the reactor temperature had increased to 301° C. Once the reaction was completed, the reactor vessel was sealed, transferred to a furnace, and heated to 825° C. for four hours to reduce the surface area of the hafnium metal produced in the reaction. During this process step, unreacted sodium was removed from the hafnium metal to leave a hafnium-sodium chloride composite. The hafnium and sodium chloride mixture was then transferred to a vacuum furnace and heated under vacuum to 2300° C., held at that temperature for one hour, and then cooled. This removed the sodium chloride and produced a button of solid hafnium. The hafnium button was analyzed via glow discharge mass spectrometry (GDMS) and found to have 26 ppm oxygen content, 1690 ppm zirconium, and less than 150 ppm total transition metals. The results demonstrate the production of a low oxygen hafnium metal produced directly from hafnium powder consolidation. Example 6—Titanium-Aluminum 120 g of a 55% aluminum, 45% titanium powder (measured by metal content) was first prepared, by adding aluminum chloride powder (from Strem Chemical) to an aluminum-titanium chloride Ziegler Natta catalyst powder (also from Strem Chemical). Next, 140 g of sodium metal was placed in an Inconel reactor and heated to 250° C. Over approximately 2 hours, 94 g of the titanium-aluminum chloride powder mix was pulse fed into the sodium, which was continuously stirred by a Cowles blade mixer at between 1600 and 2500 rpm. Powder addition continued until the mixer could no longer maintain a vortex in the sodium. At the end of the reaction the sodium temperature had increased to 292° C. The Inconel reactor was then sealed, transferred to a furnace, and heated to 900° C. for 1 hour. After this step, the unreacted sodium was removed and the metal powder washed to remove its salt coating. Washing continued until the wash water conductivity fell below 2 microsiemens. Finally, the powder was dried in a vacuum over for 24 hours. The titanium-aluminum metal thus produced was found by ICPMS analysis to contain below 1000 ppm iron and below 1500 ppm total transition metals. Example 7—Titanium-Aluminum-Vanadium First, 120 g of a titanium-aluminum-vanadium chloride mixture was prepared, by mixing liquid titanium chloride (from Sigma Aldrich), aluminum chloride powder (from Strem Chemical) and liquid vanadium chloride (from Acros Organics). The mixture was stirred constantly to maintain a dispersion of the aluminum chloride. Next, 140 g of sodium metal was heated to 250° C. in an Inconel vessel and stirred by a Cowles blade mixer at speeds ranging from 1000 rpm initially, to 2500 rpm as the reaction progressed. The chloride mixture was pumped into the reactor until 74 g had been added, over approximately 90 minutes. The reaction stopped when the vortex in the sodium could no longer be maintained. The reactor vessel was then sealed and transferred to a furnace, brought to 825° C. and held at that temperature for approximately one hour before being allowed to cool. The recovered product was then washed to remove the sodium chloride coating the metal powder, and the powder was dried in a vacuum oven at 100 C for 24 hours. Analysis of the metal powder using ICPMS showed the product contained under 50 ppm iron and under 150 ppm total transition metals. The results demonstrate that the titanium powder falls within the purity limits as described in UNS No. R56400. INCORPORATION BY REFERENCE The relevant teachings of all patents, published applications and references cited herein are hereby incorporated herein by reference. EQUIVALENTS While this invention has been particularly shown and described with references to example embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention encompassed by the appended claims. | 39,887 |
11858047 | DETAILED DESCRIPTION OF THE EMBODIMENTS The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure is thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout. The present disclosure is further described in detail below in combination with the drawings and the embodiments. It should be noted that the embodiments described below are intended to facilitate the understanding of the present disclosure and do not limit the disclosure in any way. The present disclosure provides a preparation method of a metal powder material, which includes the following steps: S1, an alloy sheet is provided, wherein the composition of the alloy sheet is MaNb, M is selected from at least one of Mg, Ca, Li, Na, K, Ba, Al, Co, Cu, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, N is selected from at least one of W, Cr, Mo, V, Ta, Nb, Zr, Hf, and Ti, and a and b represent the atomic percentage content of the corresponding element, and 0.1%≤b≤45%, a+b=100%; the microstructure of the alloy sheet is composed of a matrix phase with component M and a dispersive particle phase with component N; S2, the alloy sheet is reacted with an acid solution, so that the matrix phase with component M reacts with H+ of the acid solution to become metal ions to enter the solution, and the dispersive particle phase with component N is separated, and the metal N powder material is obtained. In step S1, the alloy composition has a specific proportion. The principle is to ensure that the microstructure of the alloy sheet is composed of the matrix phase with component M and the dispersive particle phase with component N. Preferably, 0.1%≤b≤35%. The alloy sheet is obtained by the following steps:metal raw materials are weighed according to a ratio;a metal melt is obtained by fully melting the metal raw materials;the metal melt is prepared into the alloy sheet by a rapid solidification method. Wherein, the rapid solidification method is not limited, can be the casting method, the melt spinning method, and the melt extraction method. The particle size and the shape of the resulting metal powder material are basically consistent with those of the dispersive particle phase of the metal N in the alloy. The particle size of the dispersive particle phase of the metal N is related to the solidification rate of the metal melt in the preparation process. Generally speaking, the particle size of the dispersive particle phase is negatively correlated with the cooling rate of the metal melt, that is, the larger the solidification rate of the metal melt is, the smaller the particle size of the dispersive particle phase is. The solidification rate of the metal melt can be 0.1 K/s˜107K/s; the particle size of the dispersive particle phase of the metal N may be 2 nm˜500 μm. Preferably, the solidification rate of the metal melt is 0.1 K/s˜106K/s; the particle size of the dispersive particle phase of the metal N may be 2 nm˜300 μm. The particle shape of the dispersive particle phase of the metal N is not limited, and can include at least one of the dendrite shape, spherical shape, subsphaeroidal shape, square, pie, and bar shape. When the particle shape is the bar shape, the size of the particle refers to the diameter of the cross section of the bar. The thickness of the alloy sheet is not limited, and is preferably 5 μm˜5 mm in order to be more conducive to acid reaction. The width and the length of the alloy sheet are not limited, for example, the width may be 0.2 mm˜2 m, and the length may be 1 mm˜103m. In step S2, the acid solution is a solution containing H+. The H+ in the acid solution reacts with the metal M. The acid in the acid solution may be at least one of sulfuric acid, hydrochloric acid, nitric acid, perchloric acid, phosphoric acid, acetic acid, oxalic acid, formic acid, carbonic acid, gluconic acid, oleic acid, and polyacrylic acid, and the solvent in the acid solution is water, ethanol, methanol or a mixture of the three in any proportion. Preferably, the acid in the acid solution can be at least one of sulfuric acid, hydrochloric acid, nitric acid, perchloric acid, phosphoric acid, acetic acid and oxalic acid. The reason for the optimal selection of the solvent is that the presence of ethanol and methanol is conducive to the dispersion of the metal powder material which is not easy to aggregate. In addition, the rapid evaporation rate of ethanol and methanol is also conducive to the subsequent drying process and the recovery of salt. The concentration of the acid in the acid solution is not limited, as long as the acid can react with the metal M and basically retain N. The reaction time is not limited, and the reaction temperature is not limited. The molar concentration of the acid in the acid solution may be 0.001 mol/L˜10 mol/L. The reaction time can be 0.1 min˜300 min, and the reaction temperature can be 0° C.˜100° C. Further, after step S2, the following steps can be performed: the obtained metal N powder material is screened, and then is subjected to plasma spheroidization treatment, and finally the metal N powder material with different particle sizes and of the spherical shape is obtained. The screened powder material can be spheroidized by plasma spheroidization treatment. The particle size of the metal N powder material with different particle sizes and of the spherical shape is 2 nm˜500 μm. The preparation method of the metal powder material has the following advantages: First, when preparing the alloy sheet, the metal M and metal N of the specific category are selected to make the alloy melt composed of the metal M and metal N form two separate phases during the cooling process, that is, the matrix phase composed of the metal M and the dispersive particle phase composed of the metal N. This kind of structure is conducive to the subsequent reaction with the acid solution, during which the matrix phase of the metal M becomes ions and enters the solution, and the dispersive particle phase of the metal N is separated from the alloy to finally obtain the metal N powder material. Second, the metal M with higher chemical activity is selected, and the metal M can react with H+ in the acid solution to become ions to enter the solution. The metal N with lower chemical activity is selected, and by selecting the appropriate reaction conditions, the metal N almost does not react with H+ in the selected acid solution. Therefore, the metal M is removed from the alloy by the acid solution, and the metal N powder material is finally obtained. This method is low in cost and simple in operation, and can be used to prepare many kinds of metal powder materials of different shapes and at the nanometer scale, the submicron scale and the micron scale. This metal powder material has a good application prospect in the fields of catalysis, powder metallurgy and 3D printing. Further illustration is conducted through each embodiment. Embodiment 1 This embodiment provides a preparation method of submicron V powder, which includes the following steps: (1) the alloy with the formula of Ca9.85V1.5was selected, the raw materials were weighed according to the formula, and the Ca9.85V1.5alloy was obtained after electric arc melting. The alloy was remelted by arc heating and then the Ca9.85V1.5alloy sheet with the size of 1 mm×2 mm×10 mm was prepared by means of copper mold suction casting (the cooling rate was about 500 K/s). The alloy structure consisted of a matrix phase composed of Ca and a submicron (100 nm˜1 m) dispersive particle phase composed of V. (2) at room temperature, 0.2 g of the Ca9.85V1.5alloy sheet prepared in step (1) was immersed into 50 mL of an aqueous sulfuric acid solution with the concentration of 0.1 mol/L. During the reaction process, the matrix composed of the active element Ca reacted with the acid and entered the solution, while the submicron subsphaeroidal V particles that did not react with the acid were gradually separated and dispersed from the matrix. After 5 min, the obtained subsphaeroidal V particles were separated from the solution. After being washed and dried, the submicron V powder was obtained, and the size of each V particle ranged from 100 nm˜1 μm. Embodiment 2 This embodiment provides a preparation method for submicron NbV alloy powder, which includes the following steps: (1) the alloy with the formula of Y98(Nb50V50)2was selected, the raw materials were weighed according to the formula, and the Y98(Nb50V50)2alloy was obtained after electric arc melting. The alloy was remelted by arc heating and then the Y98(Nb50V50)2alloy sheet with the size of 1 mm×2 mm×10 mm was prepared by means of copper mold suction casting (the cooling rate was about 500 K/s). The alloy structure consisted of a matrix composed of Y and a submicron (100 nm˜1 μm) dispersive particle phase composed of NbV. (2) at room temperature, 0.2 g of the Y98(Nb50V50)2alloy sheet prepared in step (1) was immersed into 50 mL of an aqueous sulfuric acid solution with the concentration of 0.1 mol/L. During the reaction process, the matrix composed of the active element Y reacted with the acid and entered the solution, while the submicron subsphaeroidal NbV alloy particles that did not react with the acid were gradually separated and dispersed from the matrix. After 10 min, the obtained subsphaeroidal NbV alloy particles were separated from the solution. After being washed and dried, the submicron NbV alloy powder was obtained, and the size of each NbV alloy particle ranged from 100 nm˜1 μm. Embodiment 3 This embodiment provides a preparation method for micron Hf powder, which includes the following steps: (1) the alloy with the formula of (Gd60Co25Al15)75Hf25was selected, the raw materials were weighed according to the formula, and the (Gd60Co25Al15)75Hf25alloy was obtained after electric arc melting. The alloy was remelted by induction heating and poured into a copper mold with an internal chamber having the cross section size of 3 mm×6 mm, and was then casted with the cooling rate of about 100 K/s to prepare an alloy sheet with the size of 3 mm×6 mm×30 mm, and the alloy structure included the matrix composed of the elements Gd, Co and Al and the dispersive dendrite particles composed of Hf, and the size of a single dendrite particle ranged from 1 μm˜20 μm. (2) at room temperature, 0.5 g of the (Gd60Co25Al15)75Hf25alloy sheet prepared in step (1) was immersed into 100 mL of an aqueous hydrochloric acid solution with the concentration of 0.5 mol/L. During the reaction process, the matrix composed of the highly active elements Gd, Co and Al reacted with the hydrochloric acid and entered the solution, while the dendrite Hf particles that did not react with the hydrochloric acid were gradually separated and dispersed from the matrix. After 20 min, the obtained dendrite Hf particles were separated from the solution. After being washed and dried, the micron dendrite Hf powder was obtained, and the size of a single dendrite particle ranged from 1 μm˜20 μm. The obtained powder material was tested by stereoscan. As can be seen fromFIG.1, the powder particles were of the dendrite shape. Embodiment 4 This embodiment provides the preparation of spherical micron Hf powder, which includes the following steps: (1) the alloy with the formula of (Gd60Co25Al15)75Hf25was selected, the raw materials were weighed according to the formula, and the (Gd60Co25Al15)75Hf25alloy was obtained after electric arc melting. The alloy was remelted by induction heating and poured into a copper mold with an internal chamber having the cross section size of 3 mm×6 mm, and was then casted with the cooling rate of about 100 K/s to prepare an alloy sheet with the size of 3 mm×6 mm×60 mm, and the alloy structure included the matrix composed of elements Gd, Co and Al and the dispersive dendrite particles composed of Hf, and the size of a single dendrite particle ranged from 1 μm˜20 μm. (2) at room temperature, 10 g of (Gd60Co25Al15)75Hf25alloy sheet prepared in step (1) was immersed into 500 mL of an aqueous hydrochloric acid solution with the concentration of 1 mol/L. During the reaction process, the matrix composed of the highly active elements Gd, Co and Al reacted with the hydrochloric acid and entered into the solution, while the dendrite Hf particles that did not react with hydrochloric acid were gradually separated and dispersed from the matrix. After 20 min, the dendrite Hf particles were separated from the solution. After being washed and dried, the micron dendrite Hf powder was obtained, and the size of a single dendrite particle ranged from 1 μm˜20 μm, as showed in FIG.1. (3) 0.5 kg of the micron dendrite Hf powder prepared by step (2) was collected and screened through sieves of 1000 mesh, 2000 mesh and 8000 mesh to obtain graded dendrite Hf powder with dendrite particle sizes of >13 μm, 13 μm˜6.5 μm, 6.5 μm˜1.6 μm and <1.6 μm, respectively. The dendrite Hf powder with dendrite particle sizes of 13 μm˜6.5 μm and 6.5 μm˜1.6 μm was selected, and the spherical Hf powder with particle sizes of 13 μm˜6.5 μm and 6.5 μm˜1.6 μm was prepared through mature plasma spheroidization technology. Embodiment 5 This embodiment provides a preparation method of nanometer Zr powder, which includes the following steps: (1) the alloy with the formula of Gd80Zr20was selected, the raw materials were weighed according to the formula, and the Gd80Zr20alloy was obtained after electric arc melting. The alloy was remelted by induction heating to prepare a Gd80Zr20alloy strip with the thickness of about 300 μm and the width of 3 μm by using the method of copper roller melt-spinning. The alloy structure included the matrix composed of Gd and the dispersive particle phase composed of Zr. The shape of the dispersive particle phase can be the spherical shape, the subsphaeroidal shape, and the bar shape with a length-diameter ratio of 20:1˜1.5:1. The diameter of a single particle ranged from 10 nm˜120 nm. (2) at room temperature, 0.5 g of the solution Gd80Zr20alloy strip prepared in step (1) was immersed into 100 mL of an aqueous hydrochloric acid solution with the concentration of 0.5 mol/L. During the reaction process, the matrix composed of the active element Gd reacted with the hydrochloric acid and entered the solution, while the Zr particles of different shapes that did not react with hydrochloric acid were gradually separated and dispersed from the matrix. After 20 min, the Zr nanoparticles of different shapes were separated from the solution. After being washed and dried, the Zr nanoparticles of the spherical shape, the subsphaeroidal shape, and the bar shape with a length-diameter ratio of 20:1˜1.5:1 were obtained. The diameter of a single particle ranged from 10 nm˜120 nm. The obtained powder material was tested by stereoscan, and the results were shown inFIG.2andFIG.3. As can be seen fromFIG.2andFIG.3, most of the Zr nanoparticles were bar shaped and a few were spherical. Embodiment 6 This embodiment provides the preparation of spherical nanometer Zr powder, which includes the following steps: (1) the alloy with the formula of Gd80Zr20was selected, the raw materials were weighed according to the formula, and the Gd80Zr20alloy was obtained after electric arc melting. The alloy was remelted by induction heating to prepare a Gd80Zr20alloy strip with the thickness of about 300 μm and the width of 3 μm by using the method of copper roller melt-spinning. The alloy structure included the matrix composed of Gd and the dispersive particle phase composed of Zr. The shape of the dispersive particle phase can be the spherical shape, the subsphaeroidal shape, and the bar shape with a length-diameter ratio of 20:1˜1.5:1. The diameter of a single particle ranged from 10 nm˜120 nm. (2) at room temperature, 0.5 g of the Gd80Zr20alloy strip prepared in step (1) was immersed into 100 mL of an aqueous nitric acid solution with the concentration of 0.5 mol/L. During the reaction process, the matrix composed of the active element Gd reacted with the nitric acid and entered the solution, while the Zr particles of different shapes that did not react with nitric acid were gradually separated and dispersed from the matrix. After 20 min, the Zr nanoparticles of different shapes were separated from the solution. After being washed and dried, the Zr nanoparticles of the spherical shape, the subsphaeroidal shape, and the bar shape with a length-diameter ratio of 20:1˜1.5:1 were obtained. The diameter of a single particle ranged from 10 nm˜120 nm. (3) 0.2 kg of the nano powder prepared by step (2) was collected, and spherical nano Zr powder with the particle size ranging from 10 nm˜200 nm was further prepared by mature plasma spheroidization technology. The technical features of the above embodiments may be arbitrarily combined. For the purpose of conciseness of depiction, all possible combinations of the technical features of the above embodiments have not been described. However, as long as there is no contradiction between the combinations of these technical features, they shall be considered to be within the scope of the description. The above embodiments only express several embodiments of the disclosure, and their descriptions are more specific and detailed, but they cannot be understood as a limitation on the scope of the present disclosure. It should be noted that for the ordinary skilled in the field, a number of variations and improvements can be made on the premise of not deviating from the concept of the disclosure, which all fall within the scope of protection of the disclosure. Therefore, the scope of protection of the present disclosure shall be subject to the attached claims. The foregoing description of the exemplary embodiments of the present invention has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to explain the principles of the invention and their practical application so as to activate others skilled in the art to utilize the invention and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present invention pertains without departing from its spirit and scope. Accordingly, the scope of the present invention is defined by the appended claims rather than the foregoing description and the exemplary embodiments described therein. | 19,131 |
11858048 | DETAILED DESCRIPTION OF THE EMBODIMENTS The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure is thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout. The present disclosure is further described in detail below in combination with the drawings and the embodiments. It should be noted that the embodiments described below are intended to facilitate the understanding of the present disclosure and do not limit the disclosure in any way. The present disclosure provides a preparation method of a metal powder material, which includes the following steps: S1, an alloy sheet is provided, wherein the composition of the alloy sheet is MaNb, M is selected from at least one of Mg, Ca, Li, Na, K, Ba, Al, Co, Cu, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu, N is selected from at least one of W, Cr, Mo, V, Ta, Nb, Zr, Hf, and Ti, and a and b represent the atomic percentage content of the corresponding element, and 0.1%≤b≤45%, a+b=100%; the microstructure of the alloy sheet is composed of a matrix phase with component M and a dispersive particle phase with component N; S2, the alloy sheet is reacted with an acid solution, so that the matrix phase with component M reacts with H+ of the acid solution to become metal ions to enter the solution, and the dispersive particle phase with component N is separated, and the metal N powder material is obtained. In step S1, the alloy composition has a specific proportion. The principle is to ensure that the microstructure of the alloy sheet is composed of the matrix phase with component M and the dispersive particle phase with component N. Preferably, 0.1%≤b≤35%. The alloy sheet is obtained by the following steps:metal raw materials are weighed according to a ratio;a metal melt is obtained by fully melting the metal raw materials;the metal melt is prepared into the alloy sheet by a rapid solidification method. Wherein, the rapid solidification method is not limited, can be the casting method, the melt spinning method, and the melt extraction method. The particle size and the shape of the resulting metal powder material are basically consistent with those of the dispersive particle phase of the metal N in the alloy. The particle size of the dispersive particle phase of the metal N is related to the solidification rate of the metal melt in the preparation process. Generally speaking, the particle size of the dispersive particle phase is negatively correlated with the cooling rate of the metal melt, that is, the larger the solidification rate of the metal melt is, the smaller the particle size of the dispersive particle phase is. The solidification rate of the metal melt can be 0.1K/s˜107K/s; the particle size of the dispersive particle phase of the metal N may be 2 nm˜500 μm. Preferably, the solidification rate of the metal melt is 0.1K/s˜106K/s; the particle size of the dispersive particle phase of the metal N may be 2 nm˜300 μm. The particle shape of the dispersive particle phase of the metal N is not limited, and can include at least one of the dendrite shape, spherical shape, subsphaeroidal shape, square, pie, and bar shape. When the particle shape is the bar shape, the size of the particle refers to the diameter of the cross section of the bar. The thickness of the alloy sheet is not limited, and is preferably 5 μm˜5 mm in order to be more conducive to acid reaction. The width and the length of the alloy sheet are not limited, for example, the width may be 0.2 mm˜2 m, and the length may be 1 mm˜103m. In step S2, the acid solution is a solution containing H+. The H+ in the acid solution reacts with the metal M. The acid in the acid solution may be at least one of sulfuric acid, hydrochloric acid, nitric acid, perchloric acid, phosphoric acid, acetic acid, oxalic acid, formic acid, carbonic acid, gluconic acid, oleic acid, and polyacrylic acid, and the solvent in the acid solution is water, ethanol, methanol or a mixture of the three in any proportion. Preferably, the acid in the acid solution can be at least one of sulfuric acid, hydrochloric acid, nitric acid, perchloric acid, phosphoric acid, acetic acid and oxalic acid. The reason for the optimal selection of the solvent is that the presence of ethanol and methanol is conducive to the dispersion of the metal powder material which is not easy to aggregate. In addition, the rapid evaporation rate of ethanol and methanol is also conducive to the subsequent drying process and the recovery of salt. The concentration of the acid in the acid solution is not limited, as long as the acid can react with the metal M and basically retain N. The reaction time is not limited, and the reaction temperature is not limited. The molar concentration of the acid in the acid solution may be 0.001 mol/L˜10 mol/L. The reaction time can be 0.1 min˜300 min, and the reaction temperature can be 0° C.˜100° C. Further, after step S2, the following steps can be performed: the obtained metal N powder material is screened, and then is subjected to plasma spheroidization treatment, and finally the metal N powder material with different particle sizes and of the spherical shape is obtained. The screened powder material can be spheroidized by plasma spheroidization treatment. The particle size of the metal N powder material with different particle sizes and of the spherical shape is 2 nm˜500 μm. The preparation method of the metal powder material has the following advantages: First, when preparing the alloy sheet, the metal M and metal N of the specific category are selected to make the alloy melt composed of the metal M and metal N form two separate phases during the cooling process, that is, the matrix phase composed of the metal M and the dispersive particle phase composed of the metal N. This kind of structure is conducive to the subsequent reaction with the acid solution, during which the matrix phase of the metal M becomes ions and enters the solution, and the dispersive particle phase of the metal N is separated from the alloy to finally obtain the metal N powder material. Second, the metal M with higher chemical activity is selected, and the metal M can react with H+ in the acid solution to become ions to enter the solution. The metal N with lower chemical activity is selected, and by selecting the appropriate reaction conditions, the metal N almost does not react with H+ in the selected acid solution. Therefore, the metal M is removed from the alloy by the acid solution, and the metal N powder material is finally obtained. This method is low in cost and simple in operation, and can be used to prepare many kinds of metal powder materials of different shapes and at the nanometer scale, the submicron scale and the micron scale. This metal powder material has a good application prospect in the fields of catalysis, powder metallurgy and 3D printing. Further illustration is conducted through each embodiment. Embodiment 1 This embodiment provides a preparation method of submicron V powder, which includes the following steps: (1) the alloy with the formula of Ca98.5V1.5was selected, the raw materials were weighed according to the formula, and the Ca98.5V1.5alloy was obtained after electric arc melting. The alloy was remelted by arc heating and then the Ca98.5V1.5alloy sheet with the size of 1 mm×2 mm×10 mm was prepared by means of copper mold suction casting (the cooling rate was about 500K/s). The alloy structure consisted of a matrix phase composed of Ca and a submicron (100 nm˜1 μm) dispersive particle phase composed of V. (2) at room temperature, 0.2 g of the Ca98.5V1.5alloy sheet prepared in step (1) was immersed into 50 mL of an aqueous sulfuric acid solution with the concentration of 0.1 mol/L. During the reaction process, the matrix composed of the active element Ca reacted with the acid and entered the solution, while the submicron subsphaeroidal V particles that did not react with the acid were gradually separated and dispersed from the matrix. After 5 min, the obtained subsphaeroidal V particles were separated from the solution. After being washed and dried, the submicron V powder was obtained, and the size of each V particle ranged from 100 nm˜1 μm. Embodiment 2 This embodiment provides a preparation method for submicron NbV alloy powder, which includes the following steps: (1) the alloy with the formula of Y98(Nb50V50)2was selected, the raw materials were weighed according to the formula, and the Y98(Nb50V50)2alloy was obtained after electric arc melting. The alloy was remelted by arc heating and then the (Nb50V50)2alloy sheet with the size of 1 mm×2 mm×10 mm was prepared by means of copper mold suction casting (the cooling rate was about 500K/s). The alloy structure consisted of a matrix composed of Y and a submicron (100 nm˜1 μm) dispersive particle phase composed of NbV. (2) at room temperature, 0.2 g of the Y98(Nb50V50)2alloy sheet prepared in step (1) was immersed into 50 mL of an aqueous sulfuric acid solution with the concentration of 0.1 mol/L. During the reaction process, the matrix composed of the active element Y reacted with the acid and entered the solution, while the submicron subsphaeroidal NbV alloy particles that did not react with the acid were gradually separated and dispersed from the matrix. After 10 min, the obtained subsphaeroidal NbV alloy particles were separated from the solution. After being washed and dried, the submicron NbV alloy powder was obtained, and the size of each NbV alloy particle ranged from 100 nm˜1 μm. Embodiment 3 This embodiment provides a preparation method for micron Hf powder, which includes the following steps: (1) the alloy with the formula of (Gd60Co25Al15)75Hf25was selected, the raw materials were weighed according to the formula, and the (Gd60Co25Al15)75Hf25alloy was obtained after electric arc melting. The alloy was remelted by induction heating and poured into a copper mold with an internal chamber having the cross section size of 3 mm×6 mm, and was then casted with the cooling rate of about 100K/s to prepare an alloy sheet with the size of 3 mm×6 mm×30 mm, and the alloy structure included the matrix composed of the elements Gd, Co and Al and the dispersive dendrite particles composed of Hf, and the size of a single dendrite particle ranged from 1 μm˜20 μm. (2) at room temperature, 0.5 g of the (Gd60Co25Al15)75Hf25alloy sheet prepared in step (1) was immersed into 100 mL of an aqueous hydrochloric acid solution with the concentration of 0.5 mol/L. During the reaction process, the matrix composed of the highly active elements Gd, Co and Al reacted with the hydrochloric acid and entered the solution, while the dendrite Hf particles that did not react with the hydrochloric acid were gradually separated and dispersed from the matrix. After 20 min, the obtained dendrite Hf particles were separated from the solution. After being washed and dried, the micron dendrite Hf powder was obtained, and the size of a single dendrite particle ranged from 1 μm˜20 μm. The obtained powder material was tested by stereoscan. As can be seen fromFIG.1, the powder particles were of the dendrite shape. Embodiment 4 This embodiment provides the preparation of spherical micron Hf powder, which includes the following steps: (1) the alloy with the formula of (Gd60Co25Al15)75Hf25was selected, the raw materials were weighed according to the formula, and the (Gd60Co25Al15)75Hf25alloy was obtained after electric arc melting. The alloy was remelted by induction heating and poured into a copper mold with an internal chamber having the cross section size of 3 mm×6 mm, and was then casted with the cooling rate of about 100K/s to prepare an alloy sheet with the size of 3 mm×6 mm×60 mm, and the alloy structure included the matrix composed of elements Gd, Co and Al and the dispersive dendrite particles composed of Hf, andnd the size of a single dendrite particle ranged from 1 μm˜20 μm. (2) at room temperature, 10 g of (Gd60Co25Al15)75Hf25alloy sheet prepared in step (1) was immersed into 500 mL of an aqueous hydrochloric acid solution with the concentration of 1 mol/L. During the reaction process, the matrix composed of the highly active elements Gd, Co and Al reacted with the hydrochloric acid and entered into the solution, while the dendrite Hf particles that did not react with hydrochloric acid were gradually separated and dispersed from the matrix. After 20 min, the dendrite Hf particles were separated from the solution. After being washed and dried, the micron dendrite Hf powder was obtained, and the size of a single dendrite particle ranged from 1 μm˜20 μm, as showed inFIG.1. (3) 0.5 kg of the micron dendrite Hf powder prepared by step (2) was collected and screened through sieves of 1000 mesh, 2000 mesh and 8000 mesh to obtain graded dendrite Hf powder with dendrite particle sizes of >13 μm, 13 μm˜6.5 μm, 6.5 μm˜1.6 μm and <1.6 μm, respectively. The dendrite Hf powder with dendrite particle sizes of 13 μm˜6.5 μm and 6.5 μm˜1.6 μm was selected, and the spherical Hf powder with particle sizes of 13 μm˜6.5 μm and 6.5 μm˜1.6 μm was prepared through mature plasma spheroidization technology. Embodiment 5 This embodiment provides a preparation method of nanometer Zr powder, which includes the following steps: (1) the alloy with the formula of Gd80Zr20was selected, the raw materials were weighed according to the formula, and the Gd80Zr20alloy was obtained after electric arc melting. The alloy was remelted by induction heating to prepare a Gd80Zr20alloy strip with the thickness of about 300 μm and the width of 3 μm by using the method of copper roller melt-spinning. The alloy structure included the matrix composed of Gd and the dispersive particle phase composed of Zr. The shape of the dispersive particle phase can be the spherical shape, the subsphaeroidal shape, and the bar shape with a length-diameter ratio of 20:1˜1.5:1. The diameter of a single particle ranged from 10 nm˜120 nm. (2) at room temperature, 0.5 g of the solution Gd80Zr20alloy strip prepared in step (1) was immersed into 100 mL of an aqueous hydrochloric acid solution with the concentration of 0.5 mol/L. During the reaction process, the matrix composed of the active element Gd reacted with the hydrochloric acid and entered the solution, while the Zr particles of different shapes that did not react with hydrochloric acid were gradually separated and dispersed from the matrix. After 20 min, the Zr nanoparticles of different shapes were separated from the solution. After being washed and dried, the Zr nanoparticles of the spherical shape, the subsphaeroidal shape, and the bar shape with a length-diameter ratio of 20:1˜1.5:1 were obtained. The diameter of a single particle ranged from 10 nm˜120 nm. The obtained powder material was tested by stereoscan, and the results were shown inFIG.2andFIG.3. As can be seen fromFIG.2andFIG.3, most of the Zr nanoparticles were bar shaped and a few were spherical. Embodiment 6 This embodiment provides the preparation of spherical nanometer Zr powder, which includes the following steps: (1) the alloy with the formula of Gd80Zr20was selected, the raw materials were weighed according to the formula, and the Gd80Zr20alloy was obtained after electric arc melting. The alloy was remelted by induction heating to prepare a Gd80Zr20alloy strip with the thickness of about 300 μm and the width of 3 μm by using the method of copper roller melt-spinning. The alloy structure included the matrix composed of Gd and the dispersive particle phase composed of Zr. The shape of the dispersive particle phase can be the spherical shape, the subsphaeroidal shape, and the bar shape with a length-diameter ratio of 20:1˜1.5:1. The diameter of a single particle ranged from 10 nm˜120 nm. (2) at room temperature, 0.5 g of the Gd80Zr20alloy strip prepared in step (1) was immersed into 100 mL of an aqueous nitric acid solution with the concentration of 0.5 mol/L. During the reaction process, the matrix composed of the active element Gd reacted with the nitric acid and entered the solution, while the Zr particles of different shapes that did not react with nitric acid were gradually separated and dispersed from the matrix. After 20 min, the Zr nanoparticles of different shapes were separated from the solution. After being washed and dried, the Zr nanoparticles of the spherical shape, the subsphaeroidal shape, and the bar shape with a length-diameter ratio of 20:1˜1.5:1 were obtained. The diameter of a single particle ranged from 10 nm˜120 nm. (3) 0.2 kg of the nano powder prepared by step (2) was collected, and spherical nano Zr powder with the particle size ranging from 10 nm˜200 nm was further prepared by mature plasma spheroidization technology. The technical features of the above embodiments may be arbitrarily combined. For the purpose of conciseness of depiction, all possible combinations of the technical features of the above embodiments have not been described. However, as long as there is no contradiction between the combinations of these technical features, they shall be considered to be within the scope of the description. The above embodiments only express several embodiments of the disclosure, and their descriptions are more specific and detailed, but they cannot be understood as a limitation on the scope of the present disclosure. It should be noted that for the ordinary skilled in the field, a number of variations and improvements can be made on the premise of not deviating from the concept of the disclosure, which all fall within the scope of protection of the disclosure. Therefore, the scope of protection of the present disclosure shall be subject to the attached claims. The foregoing description of the exemplary embodiments of the present invention has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to explain the principles of the invention and their practical application so as to activate others skilled in the art to utilize the invention and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present invention pertains without departing from its spirit and scope. Accordingly, the scope of the present invention is defined by the appended claims rather than the foregoing description and the exemplary embodiments described therein. | 19,125 |
11858049 | DETAILED DESCRIPTION Problem to be Solved by the Present Disclosure Recently, a demand for cost reduction has grown more intense, and tools having a long service life have been requested even in, for example, the high-efficiency processing of a difficult-to-cut material such as a titanium alloy or a nickel alloy. Thus, an objective of the present disclosure is to provide a cemented carbide enabling the extension of service lives of tools in the case of being used as tool materials and a tool containing the same. Advantageous Effect of the Present Disclosure A tool containing the cemented carbide of the present disclosure is capable of having a long tool service life. DESCRIPTION OF EMBODIMENTS First, embodiments of the present disclosure will be listed and described(1) A cemented carbide of the present disclosure is a cemented carbide composed of a first hard phase, a second hard phase and a binder phase,in which the first hard phase is composed of tungsten carbide particles,the second hard phase is composed of at least one first compound selected from the group consisting of TiNbC, TiNbN and TiNbCN,the second hard phase has an average particle diameter of no more than 0.1 μm,the second hard phase has a dispersity of no more than 0.7,a content of the second hard phase is no less than 0.1 vol % and no more than 15 vol %,the binder phase contains at least one first element selected from the group consisting of iron, cobalt and nickel, anda content of the binder phase is no less than 0.1 vol % and no more than 20 vol %. A tool containing the cemented carbide of the present disclosure is capable of having a long tool service life.(2) In a 24.9 μm×18.8 μm rectangular measurement visual field set in an image after a binarization treatment of a backscattered electron image that is obtained by capturing a cross section of the cemented carbide with a scanning electron microscope, the number of the second hard phases is preferably no less than 30. In such a case, the adhesion resistance of the cemented carbide is improved.(3) The second hard phase preferably has an average particle diameter of no less than 0.01 μm and no more than 0.08 μm. In such a case, the adhesion resistance of the cemented carbide is improved.(4) The second hard phase preferably has a dispersity of no more than 0.4. In such a case, the adhesion resistance of the cemented carbide is improved.(5) The dispersity is a standard deviation of an area of each Voronoi cell in a Voronoi diagram that is obtained by performing a Voronoi partition with a center of gravity of the second hard phase as a generator, andthe Voronoi diagram is obtained by extracting the second hard phases in a backscattered electron image obtained by capturing a cross section of the cemented carbide with a scanning electron microscope, setting a 24.9 μm×18.8 μm rectangular measurement visual field in an image after a binarization treatment of the backscattered electron image, performing Voronoi partitions with centers of gravity of the extracted second hard phases as generators and calculating Voronoi cells of all of the generators. (6) A cemented carbide of the present disclosure is a cemented carbide composed of a first hard phase, a third hard phase and a binder phase,in which the first hard phase is composed of tungsten carbide particles,the third hard phase is composed of at least one second compound selected from the group consisting of TiTaC, TiTaN and TiTaCN,the third hard phase has an average particle diameter of no more than 0.1 μm,the third hard phase has a dispersity of no more than 0.7,a content of the third hard phase is no less than 0.1 vol % and no more than 15 vol %,the binder phase contains at least one first element selected from the group consisting of iron, cobalt and nickel, anda content of the binder phase is no less than 0.1 vol % and no more than 20 vol %. A tool containing the cemented carbide of the present disclosure is capable of having a long tool service life.(7) A tool of the present disclosure is a tool containing the cemented carbide. The tool of the present disclosure is capable of having a long tool service life. DETAILS OF EMBODIMENTS OF PRESENT DISCLOSURE A numerical expression in the form of “A to B” herein means the upper limit and lower limit of a range (that is, no less than A and no more than B), and, when a unit is not put after A but put after B only, the unit of A and the unit of B are the same. When a compound or the like is herein represented by a chemical formula, the atomic proportion, unless particularly limited, should include all conventionally-known atomic proportions and not be necessarily limited only to atomic proportions within the stoichiometric range. For example, in the case of “TiNbC”, the proportion of the numbers of atoms composing TiNbC include all conventionally-known atomic proportions. When a pressure is herein specified, the pressure means a pressure based on atmospheric pressure unless particularly limited. In the development of a tool having a long service life even in the high-efficiency processing of a difficult-to-cut material, the present inventors produced a tool for which a conventional cemented carbide was used and performed high-efficiency processing on a difficult-to-cut material. As a result, it was found that, in the tool for which a conventional cemented carbide was used, adhesion of a work material on the tool caused by the processing makes the tool service life reached. This is presumed to be because the adhesion degrades the defect resistance or the dimensional accuracy. Therefore, the present inventors developed a cemented carbide with attention particularly paid to the adhesion resistance of tools and afforded the cemented carbide of the present disclosure and a tool containing the same. Hereinafter, specific examples of the cemented carbide of the present disclosure and a tool containing the same will be described with reference to the drawings. In the drawings of the present disclosure, the same reference sign indicates the same portions or equivalent portions. In addition, dimensional relationships of lengths, widths, thicknesses, depths and die like have been modified as appropriate in order for the clarification and simplification of the drawings and do not necessarily indicate actual dimensional relationships. Embodiment 1: Cemented Carbide (1) A cemented carbide of an embodiment of the present disclosure thereinafter, also referred to as “Embodiment 1”) is a cemented carbide composed of a first hard phase, a second hard phase and a binder phase,in which the first hard phase is composed of tungsten carbide particles,the second hard phase is composed of at least one first compound selected from the group consisting of TiNbC, TiNbN and TiNbCN,the second hard phase has an average particle diameter of no more than 0.1 μm,the second hard phase has a dispersity of no more than 0.7,the content of the second hard phase is no less than 0.1 vol % and no more than 15 vol %,the binder phase contains at least one first element selected from the group consisting of iron, cobalt and nickel, andthe content of the binder phase is no less than 0.1 vol % and no more than 20 vol %. A tool containing the cemented carbide of the present disclosure is capable of having a long tool service life. This is presumed to be because the cemented carbide has excellent adhesion resistance. <Composition of Cemented Carbide> The cemented carbide of Embodiment 1 is composed of a first hard phase, a second hard phase and a binder phase. The cemented carbide may also contain an impurity as long as the effect of the present disclosure is not impaired. That is, the cemented carbide may consist of a first hard phase, a second hard phase, a binder phase and an impurity. Examples of the impurity include iron (Fe), molybdenum (Mo), calcium (Ca), silicon (Si) and sulfur (S). The content of the impurity in the cemented carbide (in a case where two or more kinds of impurities are contained, the total content thereof) is preferably no less than 0 mass % and less than 0.1 mass %. The content of the impurity in the cemented carbide is measured by inductively coupled plasma emission spectroscope (measuring instrument “ICPS-8100” (trademark) by Shimadzu Corporation). In Embodiment 1, the lower limit of the content of the first hard phase in the cemented carbide can be set to no less than 65 vol %, no less than 70 vol %, no less than 75 vol % or no less than 80 vol %. The upper limit of the content of the first hard phase in the cemented carbide can be set to no more than 99.8 vol %, no more than 99 vol %, no more than 98 vol % or no more than 97 vol %. The content of the first hard phase in the cemented carbide can be set to no less than 65 vol % and no more than 99 vol %, no less than 70 vol % and no more than 99.8 vol %, no less than 75 vol % and no more than 99.8 vol %, no less than 80 vol % and no more than 99.8 vol %, no less than 65 vol % and no more than 99 vol %, no less than 70 vol % and no more than 99 vol %, no less than 75 vol % and no more than 99 vol %, no less than 80 vol % and no more than 99 vol %, no less than 65 vol % and no more than 98 vol %, no less than 70 vol % and no more than 98 vol %, no less than 75 vol % and no more than 98 vol %, no less than 80 vol % and no more than 98 vol %, no less than 65 vol % and no more than 97 vol %, no less than 70 vol % and no more than 97 vol %, no less than 75 vol % and no more than 97 vol % or no less than 80 vol % and no more than 97 vol %. In Embodiment 1, the content of the second hard phase in the cemented carbide is no less than 0.1 vol % and no more than 15 vol %. In such a case, the adhesion resistance of the cemented carbide is improved. The lower limit of the content of the second hard phase in the cemented carbide can be set to no less than 0.10 vol %, no less than 0.2 vol %, no less than 0.5 vol % or no less than 1 vol %. The upper limit of the content of the second hard phase in the cemented carbide can be set to no more than 15 vol %, no more than 14 vol %, no more than 12 vol % or no more than 10 vol %. The content of the second hard phase in the cemented carbide can be set to no less than 0.10 vol % and no more than 15 vol %, no less than 0.2 vol % and no more than 15 vol %, no less than 0.5 vol % and no more than 15 vol %, no less than 1 vol % and no more than 15 vol %, no less than 0.10 vol % and no more than 14 vol %, no less than 0.2 vol % and no more than 14 vol %, no less than 0.5 vol % and no more than 14 vol %, no less than 1 vol % and no more than 14 vol %, no less than 0.10 vol % and no more than 12 vol %, no less than 0.2 vol % and no more than 12 vol %, no less than 0.5 vol % and no more than 12 vol %, no less than 1 vol % and no more than 12 vol %, no less than 0.10 vol % and no more than 10 vol %, no less than 0.2 vol % and no more than 10 vol %, no less than 0.5 vol % and no more than 10 vol % or no less than 1 vol % and no more than 10 vol %. In Embodiment 1, the content of the binder phase in the cemented carbide is no less than 0.1 vol % and no more than 20 vol %. In such a case, the strength of the cemented carbide is improved. The lower limit of the content of the binder phase in the cemented carbide can be set to no less than 0.10 vol %, no less than 0.3 vol %, no less than 0.5 vol % or no less than 1 vol %. The upper limit of the content of the binder phase in the cemented carbide can be set to no more than 20 vol %, no more than 18 vol %, no more than 16 vol % or no more than 14 vol % The content of the binder phase in the cemented carbide can be set to no less than 0.10 vol % and no more than 20 vol %, no less than 0.3 vol % and no more than 20 vol %, no less than 0.5 vol % and no more than 20 vol %, no less than 1 vol % and no more than 20 vol %, no less than 0.10 vol % and no more than 18 vol %, no less than 0.3 vol % n and no more than 18 vol %, no less than 0.5 vol % and no more than 18 vol %, no less than 1 vol % and no more than 18 vol %, no less than 0.10 vol % and no more than 16 vol %, no less than 0.3 vol % and no more than 16 vol %, no less than 0.5 vol % and no more than 16 vol %, no less than 1 vol % and no more than 16 vol %, no less than 0.10 vol % and no more than 14 vol %, no less than 0.3 vol % and no more than 14 vol %, no less than 0.5 vol % and no more than 14 vol % or no less than 1 vol % and no more than 14 vol %. A method for measuring the content of the first hard phase, the content of the second hard phase and the content of the binder phase in the cemented carbide is as described below.(A1) The cemented carbide is cut at any position to expose a cross section. The cross section is mirror-like finished with a CROSS SECTION POLISHER (manufactured by JEOL Ltd.).(B1) The mirror-like finished surface of the cemented carbide is analyzed using scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM-EDX) (device: Gemini 450 (trademark) manufactured by Carl Zeiss AG), and elements that are contained in the cemented carbide are specified.(C1) The mirror-like finished surface of the cemented carbide is captured with a scanning electron microscope (SEM) to obtain a backscattered electron image. The captured region of the captured image is set to the central portion of the cross section of the cemented carbide, that is, a position where a portion having properties clearly different from those of the bulk portion, such as a vicinity of the surface of the cemented carbide, is not included (a position where all of the captured region becomes the bulk portion of the cemented carbide). The observation magnification is 5000 times. The measurement conditions are an accelerating voltage of 3 kV, a current value of 2 nA and a working distance (WD) of 5 mm.(D1) The captured region of the (C1) is analyzed using an energy dispersive X-ray spectrometer with a scanning electron microscope (SEM-EDX), the distribution of the elements specified in the (B1) in the captured region is specified, and an element mapping image is obtained.(E1) The back scattered electron image obtained in the (C1) is loaded onto a computer, and a binarization treatment is performed using image analysis software (OpenCV, SciPy). The binarization treatment is performed such that, among the first hard phase, the second hard phase and the binder phase in the backscattered electron image, only the second hard phase is extracted. The binarization threshold varies with contrast and is thus set for each image. An example of the backscattered electron image of the cemented carbide of the present embodiment is shown inFIG.1. InFIG.1, white regions correspond to the first hard phase, gray regions correspond to the binder phase and black regions correspond to the second hard phase. The binarization threshold is set such that only the black regions are exposed in the backscattered electron image.(F1) The element mapping image obtained in the (D1) and the binarized image obtained in the (E1) are overlapped, thereby specifying the presence region of each of the first hard phase, the second hard phase and the binder phase on the binarized image. Specifically, regions which are shown in white on the binarized image and in which tungsten (W) and carbon (C) are present on the element mapping image correspond to the presence regions of the first hard phase. Regions which are shown in black on the binarized image and in which titanium (Ti), niobium (Nb) and one or both of carbon (C) and nitrogen (N) are present on the element mapping image correspond to the presence regions of the second hard phase. Regions which are shown in white on the binarized image and in which at least one element selected from the group consisting of iron, cobalt and nickel is present on the element mapping image correspond to the presence regions of the binder phase.(G1) One 24.9 μm×18.8 μm rectangular measurement visual field is set in the binarized image after the binarization treatment. The area percentage of each of the first hard phase, the second hard phase and the binder phase is measured with respect to the area of the entire measurement region as a denominator using the image analysis software.(H1) The measurement of the (G1) is performed in five measurement visual fields that do not overlap one another. In the present specification, the average of the area percentages of the first hard phase in the five measurement visual fields corresponds to the content (vol %) of the first hard phase in the cemented carbide, the average of the area percentages of the second hard phase in the five measurement visual fields corresponds to the content (vol %) of the second hard phase in the cemented carbide, and the average of the area percentages of the binder phase in the five measurement visual fields corresponds to the content (vol %) of the binder phase in the cemented carbide. It was confirmed from the measurement on the same specimen by the applicant that, even when any cutting spot was set on the cross section of the cemented carbide, any captured region that is described in the (C1) was set on the cross section, any five measurement visual fields that are described in die (H1) were set, and the content of the first hard phase, the content of the second hard phase and the content of the binder phase in the cemented carbide were measured a plurality of times according to the above-described procedure, variations in the measurement results were small, and, even when any cutting spot was set on the cross section of the cemented carbide, any captured region on the backscattered electron image was set, and any measurement visual fields were set, the measurement results were not arbitrary. <First Hard Phase> <<Composition>> In Embodiment 1, the first hard phase is composed of tungsten carbide particles (hereinafter, also referred to as “WC particles”). The tungsten carbide particles (hereinafter, also referred to as “WC particles”) are particles made of tungsten carbide. The first hard phase may contain iron (Fe), molybdenum (Mo), calcium (Ca), silicon (Si), sulfur (S) and the like in the WC particles or together with the WC particles as long as the effect of the present disclosure is not impaired. The content of iron (Fe), molybdenum (Mo), calcium (Ca), silicon (Si) and sulfur (S) in the first hard phase (in a case where two or more thereof are contained, the total content thereof) is preferably no less than 0 mass % and less than 0.1 mass %. The content of iron (Fe), molybdenum (Mo), calcium (Ca), silicon (Si) and sulfur (S) in the first hard phase is measured by ICP emission spectroscopy <<Average Particle Diameter>> The lower limit of the average particle diameter of the tungsten carbide particles in Embodiment 1 is preferably no less than 0.2 μm or no less than 0.4 μm. The upper limit of the average particle diameter of the tungsten carbide particles is preferably no more than 3.0 μm or no more than 2.5 μm. The average particle diameter of the tungsten carbide particles is preferably no less than 0.2 μm and no more than 3.0 μm, no less than 0.4 μm and no more than 3.0 μm, no less than 0.2 μm and no more than 2.5 μm or less or no less than 0.4 μm and no more than 2.5 μm In such a case, the cemented carbide has high hardness, and the wear resistance of a tool containing the cemented carbide is improved. In addition, the tool can have excellent breakage resistance. In the present specification, the average particle diameter of the tungsten carbide particles means D50 (an equivalent circle diameter at which the cumulative number-based frequency reaches 50%, median diameter D50) of equal area equivalent circle diameters (Heywood diameters) of the tungsten carbide particles. A method for measuring the average particle diameter of the tungsten carbide particles is as described below.(A2) A presence region of the first hard phase (corresponding to the tungsten carbide particles) is specified on the binarized image by the same method as the (A1) to (F1) of the method for measuring the content of the first hard phase, the content of the second hard phase and the content of the binder phase in the cemented carbide.(B2) One 24.9 μm×18.8 μm rectangular measurement visual field is set in the binarized image. The outer edge of each tungsten carbide particle in the measurement visual field is specified using the image analysis software, and the equivalent circle diameter (Heywood diameter: equal area equivalent circle diameter) of each tungsten carbide particle is calculated.(C2) D50 of the equal area equivalent circle diameters of the tungsten carbide particles is calculated based on all of the tungsten carbide particles in the measurement visual field. It was confirmed from the measurement on the same specimen by the applicant that, even when any cutting spot was set on the cross section of the cemented carbide, any captured region that is described in the (C1) was set on the cross section, any measurement visual field that is described in the (B2) was set, and the average particle diameter of the tungsten carbide particles was measured a plurality of times according to the above-described procedure, a variation in the measurement results was small, and, even when any cutting spot was set on the cross section of the cemented carbide, any captured region on the captured image was set, and any measurement visual fields were set, the measurement results are not arbitrary. <Second Hard Phase> <<Composition>> In Embodiment 1, the second hard phase is composed of at least one first compound selected from the group consisting of TiNbC, TiNbN and TiNbCN. In such a case, the adhesion resistance of the cemented carbide is improved. The second hard phase is not limited to pure TiNbC, TiNbN and TiNbCN and may contain, in addition to the above-described compounds, a metallic element such as tungsten (W), chromium (Cr) or cobalt (Co) to an extent that the effect of the present disclosure is not impaired. The total content of W, Cr and Co in the second hard phase is preferably no less than 0 mass % and less than 0.1 mass %. The contents of W, Cr and Co in the second hard phase are measured by ICP emission spectroscopy. The second hard phase is preferably composed of a plurality of crystal grains. Examples of the crystal grains that are included in the second hard phase include TiNbC particles, TiNbN particles, TiNbCN particles and particles made of two or more first compounds selected from the group consisting of TiNbC. TiNbN and TiNbCN. The second hard phase may be composed of crystal grains all having the same composition. For example, the second hard phase may be composed of TiNbC particles. The second hard phase may be composed of TiNbN particles. The second hard phase may be composed of TiNbCN particles. The second hard phase may be composed of particles made of two or more first compounds selected from the group consisting of TiNbC, TiNbN and TiNbCN The second hard phase may be composed of crystal grains having two or more different compositions. For example, the second hard phase may be composed of two or more kinds of crystal grains selected from the group consisting of TiNbC particles. TiNbN panicles, TiNbCN particles and particles made of two or more first compounds selected from the group consisting of TiNbC, TiNbN and TiNbCN. The second hard phase may be composed of TiNbC particles, TiNbN particles and TiNbCN particles. A method for measuring the composition of the second hard phase is as described below.(A3) The cemented carbide is sliced at any position using an ion slicer (device: IB09060CIS (trademark) manufactured by JEOL Ltd.) to produce a sample having a thickness of 30 to 100 nm. The accelerating voltage of the ion slicer is 6 kV in the slicing process and 2 kV in the finishing process.(B3) The sample is observed with a scanning electron microscope (STEM) (device: JFM-ARM300F (trademark) manufactured by JEOL Ltd.) at 50000 times to obtain a high-angle annular dark field scanning transmission electron microscope (STEM-HAADF) image. The captured region of the STEM-HAADF image is set to the central portion of the sample, that is, a position where a portion having properties clearly different from those of the bulk portion, such as a vicinity of the surface of the cemented carbide, is not included (a position where all of the captured region becomes the bulk portion of the cemented carbide). Regarding the measurement condition, the accelerating voltage is 200 kV.FIG.2is an example of the STEM-HAADF image of the cemented carbide of Embodiment 1.(C3) Next, element mapping analysis is performed on the STEM-HAADF image with EDX in STEM to obtain an element mapping image. A region in which titanium (Ti), niobium (Nb) and one or both of carbon (C) and nitrogen (N) are present on the element mapping image is specified as the second hard phase, and the composition of the second hard phase is specified. When the second hard phase is composed of a plurality of crystal grains, the composition is specified for each crystal grain.FIG.3is an element mapping image of the cemented carbide of Embodiment 1 in the same measurement visual field inFIG.1. In the lower left part ofFIG.3, two second hard phases (crystal grains) composed of TiNbN are confirmed. In the slightly upper right part from the center inFIG.3, one second hard phase (crystal grains) composed of TiNbN and TiNbC is confirmed. In the slightly lower part from the center inFIG.3, one second hard phase (crystal grains) composed of TiNbCN is confirmed. It was confirmed from the measurement on the same specimen by the applicant that, even when any cutting spot was set on the cross section of the cemented carbide, any captured region of the STEM-HAADF image was set on the sample, and the composition of the second hard phase was measured a plurality of times according to the above-described procedure, a variation in the measurement result was small, and, even when any cutting spot was set on the cross section of the cemented carbide, and any captured region of the STEM-HAADF image was set, the measurement result was not arbitrary. In the second hard phase, the lower limit of the ratio of niobium to the sum of titanium and niobium in terms of the number of atoms (hereinafter, also referred to as “Nb ratio”) may be set to no less than 0.03, no less than 0.04 or no less than 0.05. The upper limit of the Nb ratio may be set to no more than 0.48, no more than 0.46, no more than 0.44 or no more than 0.42. The Nb ratio may be set to no less than 0.03 and no more than 0.48, no less than 0.04 and no more than 0.48, no less than 0.05 and no more than 0.48, no less than 0.03 and no more than 0.46, no less than 0.04 and no more than 0.46, no less than 0.05 and no more than 0.46, no less than 0.03 and no more than 0.44, no less than 0.04 and no more than 0.44, no less than 0.05 and no more than 0.44, no less than 0.03 and no more than 0.42, no less than 0.04 and no more than 0.42 or no less than 0.05 and no more than 0.42. In such a case, the second hard phase can be finely dispersed in the cemented carbide, and the adhesion resistance of the cemented carbide is improved. In the present specification, the ratio of niobium to the sum of titanium and niobium in terms of the number of atoms in the second hard phase means the average of the ratios (Nb ratios) of niobium to the sum of titanium and niobium in terms of the number of atoms in all of the second hard phases that are included in the cemented carbide. The Nb ratio is obtained by the following procedure A 24.9 μm×18.8 μm rectangular measurement visual field is set in the element mapping image of the (C3). Based on all of the second hard phases that are observed in the measurement visual field, the compositions of the second hard phases are measured, and the ratios (Nb ratios) of niobium to the sum of titanium and niobium in terms of the number of atoms are calculated. The Nb ratios are obtained in five measurement visual fields that do not overlap one another In the present specification, the average of the compositions of all of the second hard phases in the five measurement visual fields corresponds to the composition of all of the second hard phases in the cemented carbide. In the present specification, the average of the Nb ratios in the five measurement visual fields corresponds to the Nb ratio in the cemented carbide. It was confirmed from the measurement on the same specimen by the applicant that, even when any cutting spot was set on the cross section of the cemented carbide, any captured region of the STEM-HAADF image was set on the sample, and the average of the Nb ratios in all of the second hard phases was measured a plurality of times according to the above-described procedure, a variation in the measurement result was small, and, even when any cutting spot was set on the cross section of the cemented carbide, and any captured region of the STEM-HAADF image was set, the measurement result was not arbitrary. <<Average Particle Diameter>> In Embodiment 1, the second hard phase has an average particle diameter of no more than 0.1 μm In such a case, the adhesion resistance of the cemented carbide is improved. In addition, the second hard phase is less likely to act as a starting point of fracture, and the breakage resistance of a tool containing the cemented carbide is improved. The lower limit of the average particle diameter of the second hard phase is preferably no less than 0.002 μm, no less than 0.01 μm, no less than 0.02 μm or no less than 0.03 μm. The upper limit of the average particle diameter of the second hard phase is no more than 0.1 μm, and is preferably no more than 0.00 μm, no more than 0.08 μm, no more than 0.07 μm or no more than 0.06 μm. The average particle diameter of the second hard phase is preferably no less than 0.01 μm and no more than 0.1 μm, no less than 0.02 μm and no more than 0.1 μm, no less than 0.03 μm and no more than 0.1 μm, no less than 0.01 μm and no more than 0.09 μm, no less than 0.02 μm and no more than 0.09 μm, no less than 0.03 μm and no more than 0.09 μm, no less than 0.01 μm and no more than 0.08 μm, no less than 0.02 μm and no more than 0.08 μm, no less than 0.03 μm and no more than 0.08 μm, no less than 0.01 μm and no more than 0.07 μm, no less than 0.02 μm and no more than 0.07 μm, no less than 0.03 μm and no more than 0.07 μm, no less than 0.01 μm and no more than 0.06 μm, no less than 0.02 μm and no more than 0.06 μm or no less than 0.03 μm and no more than 0.06 μm. In such a case, the tool service life is further improved. In the present specification, the average particle diameter of the second hard phase means D50 (an equivalent circle diameter at which the cumulative number-based frequency reaches 50%, median diameter D50) of equal area equivalent circle diameters (Heywood diameters) of a plurality of crystal grains that are included in the second hard phase. A method for measuring the average particle diameter of the second hard phase is as described below.(A3) A presence region of the second hard phase is specified on the binarized image by the same method as the (A1) to (F1) of the method for measuring the content of the first hard phase, the content of the second hard phase and the content of the binder phase in the cemented carbide.(B3) One 24.9 μm×18.8 μm rectangular measurement visual field is set in the binarized image The outer edge of each second hard phase in the measurement visual field is specified using the image analysis software, and the equivalent circle diameter (Heywood diameter: equal area equivalent circle diameter) of each second hard phase is calculated.(C3) Based on all of the second hard phases in the measurement visual field, D50 of the equal area equivalent circle diameters of the second hard phases is calculated. It was confirmed from the measurement on the same specimen by the applicant that, even when any cutting spot was set on the cross section of the cemented carbide, any captured region that is described in the (C1) was set on the cross section, any measurement visual field that is described in the (B3) was set, and the average particle diameter of the tungsten carbide particles was measured a plurality of times according to the above-described procedure, a variation in the measurement results was small, and, even when any cutting spot was set on the cross section of the cemented carbide, any captured region on the captured image was set, and any measurement visual fields were set, the measurement results are not arbitrary. <<Dispersity>> In Embodiment 1, the second hard phase has a dispersity of no more than 0.7. In such a case, the structure of the cemented carbide becomes homogeneous, and the cemented carbide is capable of having excellent adhesion resistance The upper limit of the dispersity of the second hard phase is no more than 0.7, and is preferably no more than 0.70, no more than 0.69, no more than 0.68, no more than 0.65, no more than 0.60, no more than 0.55 or no more than 0.40 The lower limit of the dispersity of the second hard phase is not particularly limited, but is preferably, for example, no less than 0 or no less than 0.1. The dispersity of the second hard phase is preferably no less than 0 and no more than 0.7, no less than 0 and no more than 0.70, no less than 0 and no more than 0.69, no less than 0 and no more than 0.68, no less than 0 and no more than 0.65, no less than 0 and no more than 0.60, no less than 0 and no more than 0.55, no less than 0 and no more than 0.40, no less than 0.1 and no more than 0.7, no less than 0.1 and no more than 0.70, no less than 0.1 and no more than 0.69, no less than 0.1 and no more than 0.68, no less than 0.1 and no more than 0.65, no less than 0.1 and no more than 0.60, no less than 0.1 and no more than 0.55 or no less than 0.1 and no more than 0.40. In the present specification, the dispersity or the second hard phase is measured using a Voronoi diagram. A specific measurement method is as described below.(A4) A binarization treatment is performed on a backscattered electron image of a mirror-like finished surface of the cemented carbide by the same method as the (A1), (C1) and (E1) in the methods for measuring the content of the first hard phase, the content of the second hard phase and the content of the binder phase of the cemented carbide to obtain a binarized image on which only the second hard phase has been extracted.(B4) One 24.9 μm×18.8 μm rectangular measurement region is set in the binarized image In the measurement region, the position of the center of gravity of each second hard phase is derived using the image processing software. The obtained coordinate of the center of gravity is regarded as a generator, a Voronoi partition is performed and Voronoi cells of all generators are derived to produce a Voronoi diagram. The Voronoi cell is a region surrounded by Voronoi boundaries that are each generated by partitioning a space between two adjacent generators with a perpendicular bisector when a plurality of generators is disposed on the same plane. A Voronoi diagram produced based on the backscattered electron image shown inFIG.1is shown inFIG.4. InFIG.4, small black circles indicate the centers of gravity of the second hard phases, line segments indicate perpendicular bisectors between two adjacent generators, and regions surrounded by the perpendicular bisectors indicate Voronoi cells.(C4) For all of the Voronoi cells in the measurement region, the Voronoi area (μm2) of each cell is derived using the image processing software Here, the Voronoi cell in the measurement region means a Voronoi cell that is fully present in the measurement region. Therefore, when a part of a Voronoi cell is present outside the measurement region, the Voronoi cell is not regarded as a Voronoi cell in the measurement region. A standard deviation σ of all of the Voronoi areas in the measurement region is derived. In the present specification, the standard deviation σ is derived.(D4) The standard deviation σ is derived in five measurement regions that do not overlap one another. In the present specification, the average of the standard deviations σ in the five measurement regions corresponds to the dispersity of the second hard phase in the cemented carbide. It was confirmed from the measurement on the same specimen by the applicant that, even when any cutting spot was set on the cross section of the cemented carbide, any measurement region described in the (B4) was set on the sample, and the dispersity of the second hard phase was measured a plurality of times according to the above-described procedure, a variation in the measurement result was small, and, even when any cutting spot was set on the cross section of the cemented carbide, and any captured region of the captured image was set, the measurement result was not arbitrary. <Binder Phase>> <<Composition>> In Embodiment 1, the binder phase contains at least one first element selected from the group consisting of iron, cobalt and nickel. The content of the first element in the binder phase (in a case where the first element is composed of two or more elements, the total content thereof) is preferably no less than 90 mass % and no more than 100 mass %, no less than 95 mass % and no more than 100 mass %, no less than 98 mass % and no more than 100 mass % or 100 mass %. The content of the first element in the binder phase is measured by ICP emission spectroscopy. The binder phase may contain, in addition to the first element, tungsten (W), chromium (Cr), vanadium (V), titanium (Ti), niobium (Nb), tantalum (Ta) or the like. <Manufacturing Method> The cemented carbide of Embodiment 1 can be produced by, for example, the following method. Raw material powders are prepared. As raw materials of the first hard phase and the second hard phase, a tungsten carbide (WC) powder, a tungsten trioxide (WO3) powder, a titanium oxide (TiO2) powder and a niobium oxide (Nb2O5) powder are prepared. The use of the tungsten trioxide (WO3) powder makes it possible to make WC particles in the cemented carbide fine. Examples of a raw material of the binder phase include an iron (Fe) powder, a cobalt (Cu) powder and a nickel (Ni) powder. Examples of a grain growth inhibitor include a chromium carbide (Cr3C2) powder and a vanadium carbide (VC) powder. The average particle diameter of the tungsten carbide (WC) powder can be set to no less than 0.1 μm and no more than 3.5 μm. The average particle diameter of the WC powder is measured by the Fischer method or the BET method. The average particle diameter of the tungsten trioxide (WO3) powder can be set to no less than 0.1 μm and no more than 3 gnu. The average particle diameter of the titanium oxide (TiO2) powder can be set to no less than 0.001 μm and no more than 1 μm The average particle diameter of the niobium oxide (Nb2O5) powder can be set to no less than 0.001 μm and no more than 1 μm. The average particle diameter of the iron (Fe) powder can be set to no less than 0.1 μm and no more than 5 μm. The average particle diameter of the cobalt (Co) powder can be set to no less than 0.1 μm and no more than 5 μm. The average particle diameter of the nickel (Ni) powder can be set to no less than 0.1 μm and no more than 5 μm. The average particle diameter of the raw material powder means the number-based median diameter d50 of the sphere equivalent diameters of the raw material powders. The average particle diameter of the raw material powder is measured using a particle size distribution measuring instrument (trade name MT3300EX) manufactured by MicrotracBEL Corp. Next, the raw material powders are mixed together to obtain a powder mixture. An attritor or a ball mill can be used for the mixing. The mixing time in the attritor can be set to no shorter than three hours and no longer than 20 hours. The mixing time in the ball mill can be set to no shorter than three hours and no longer than 72 hours. Next, the powder mixture is molded into a desired shape to afford a compact. A molding method and molding conditions do not particularly matter as long as ordinary method and conditions are adopted Next, the compact is put into a sintering furnace, and the temperature is raised up to 1200° C. in a vacuum Subsequently, the temperature is raised from 1200° C. up to 1350° C. in a N2gas atmosphere at a pressure of 8 to 40 kPa Subsequently, the compact is sintered by being held in the N2gas atmosphere at a pressure of 12 to 40 kPa and 1350° C. for 30 to 60 minutes Next, a sinter hot isostatic pressing (s-HIP) treatment is performed on the sintered body. For example, a temperature of 1330° C. to 1365° C. and a pressure of 3 to 10 MPa are applied to the sintered body for 60 minutes using an Ar gas as a pressure medium. Next, the sintered body after the s-HIP treatment is quenched to room temperature in an Ar gas at a pressure of 400 kPaG to afford a cemented carbide. Embodiment 2: Cemented Carbide (2) A cemented carbide of an embodiment of the present disclosure (hereinafter, also referred to as “Embodiment 2”) is a cemented carbide composed of a first hard phase, a third hard phase and a binder phase.in which the first hard phase is composed of tungsten carbide particles,the third hard phase is composed of at least one second compound selected from the group consisting of TiTaC, TiTaN and TiTaCN,the third hard phase has an average particle diameter of no more than 0.1 μm.the third hard phase has a dispersity of no more than 0.7,a content of the third hard phase is no less than 0.1 vol % and no more than 15 vol %,the binder phase contains at least one first element selected from the group consisting of iron, cobalt and nickel, andthe content of the binder phase is no less than 0.1 vol % and no more than 20 vol %. The cemented carbide of Embodiment 2 can be configured in the same manner as the cemented carbide of Embodiment 1 except that the second hard phase of the cemented carbide of Embodiment 1 is changed to the third hard phase. Hereinafter, the third hard phase and a manufacturing method will be described. <Third lard Phase> <<Composition>> In Embodiment 1, the third hard phase is composed of at least one second compound selected from the group consisting of TiTaC, TiTaN and TiTaCN. In such a case, the adhesion resistance of the cemented carbide is improved. The third hard phase is not limited to pure TiTaC, TiTaN and TiTaCN and may contain, a metallic element such as tungsten (W), chromium (Cr) or cobalt (Co) to an extent that the effect of the present disclosure is not impaired The total content of W, Cr and Co in the third hard phase is preferably no less than 0 mass % and less than 0.1 mass %. The content of W, Cr and Co in the third hard phase is measured by ICP emission spectroscopy. The third hard phase is preferably composed of a plurality of crystal grains. Examples of the crystal grains that are included in the third hard phase include TiTaC particles, TiTaN particles, TiTaCN particles and particles composed of two or more second compounds selected from the group consisting of TiTaC, TiTaN and TiTaCN. The third hard phase may be composed of crystal grains all having the same composition For example, the third hard phase may be composed of TiTaC particles. The third hard phase may be composed of TiTaN particles. The third hard phase may be composed of TiTaCN particles The third hard phase may be composed of particles made of two or more second compounds selected from the group consisting of TiTaC, TiTaN and TiTaCN. The third hard phase may be composed of crystal grains having two or more different compositions. For example, the third hard phase may be composed of two or more kinds of crystal grains selected from the group consisting of TiTaC particles. TiTaN particles. TiTaCN particles and particles made of two or more second compounds selected from the group consisting of TiTaC, TiTaN and TiTaCN. The third hard phase may be composed of TiTaC particles, TiTaN particles and TiTaCN particles A method for measuring the composition of the third hard phase can be performed according to the method for measuring the composition of the second hard phase described in Embodiment 1 and thus will not be described repeatedly. FIG.5is an example of a STEM-HAADF image of the cemented carbide of Embodiment 2.FIG.6is an element mapping image of the cemented carbide of Embodiment 2 in the same measurement visual field inFIG.5. In the slightly right part from the center inFIG.6, one third hard phase (crystal grains) composed of TiTaC and TiTaCN is confirmed. In the lower part ofFIG.6, one third hard phase (crystal grains) composed of TiTaN is confirmed. It was confirmed from the measurement on the same specimen by the applicant that, even when any cutting spot was set on the cross section of the cemented carbide, any captured region of the STEM-HAADF image was set on the sample, and the composition attic third hard phase was measured a plurality of times according to the method for measuring the composition of the second hard phase described in Embodiment 1, a variation in the measurement result was small, and, even when any cutting spot was set on the cross section of the cemented carbide, and any captured region of the STEM-HAADF image was set, the measurement result was not arbitrary. In the third hard phase, the lower limit of the ratio of tantalum to the sum of titanium and tantalum in terms of the number of atoms (hereinafter, also referred to as “Ta ratio”) may be set to no less than 0.03, no less than 0.04 or no less than 0.05. The upper limit of the Ta ratio may be set to no more than 0.48, no more than 0.46, no more than 0.44 or no more than 042. The Ta ratio may be set to no less than 0.03 and no more than 0.48, no less than 0.04 and no more than 0.48, no less than 0.05 and no more than 0.48, no less than 0.03 and no more than 0.46, no less than 0.04 and no more than 0.46, no less than 0.05 and no more than 0.46, no less than 0.03 and no more than 0.44, no less than 0.04 and no more than 0.44, no less than 0.05 and no more than 0.44, no less than 0.03 and no more than 0.42, no less than 0.04 and no more than 0.42 or no less than 0.05 and no more than 0.42. In such a case, the second hard phase can be finely dispersed in the cemented carbide, and the adhesion resistance of the cemented carbide is improved. In the present specification, the ratio of tantalum to the sum of titanium and tantalum in terms of the number of atoms in the third hard phase means the average of the ratios (Ta ratios) of tantalum to the sum of titanium and tantalum in terms of the number of atoms in the third hard phases that are included in the cemented carbide. The Ta ratio is obtained by the following procedure. A 24.9 μm×18.8 μm rectangular measurement visual field is set in the element mapping image of the (C3). Based on all of the third hard phases that are observed in the measurement visual field, the compositions of the third hard phases are measured, and the ratios (Ta ratios) of tantalum to the sum of titanium and tantalum in terms of the number of atoms are calculated The Ta ratios are obtained in five measurement visual fields that do not overlap one another. In the present specification, the average of the compositions of all of the third hard phases in the five measurement visual fields corresponds to the composition of all of the third hard phases in the cemented carbide. In the present specification, the average of the Ta ratios in the five measurement visual fields corresponds to the Ta ratio in the cemented carbide. It was confirmed from the measurement on the same specimen by the applicant that, even when an cutting spot was set on the cross section of the cemented carbide, any captured region of the STEM-HAADF image was set on the sample, and the average of the Ta ratios in all of the third hard phases was measured a plurality of times according to the above-described procedure, a variation in the measurement result was small, and, even when any cutting spot was set on the cross section of the cemented carbide, and any captured region of the SEEM-HAADF image was set, the measurement result was not arbitrary. <Manufacturing Method> A method for manufacturing the cemented carbide of Embodiment 2 can be the same as the method for manufacturing the cemented carbide of Embodiment 1 except that, in the method for manufacturing the cemented carbide of Embodiment 1, as the raw material powder, the niobium oxide (Nb2O5) powder is changed to a tantalum oxide (Ta2O5) powder. Embodiment 3: Tool A tool of one embodiment of the present disclosure (hereinafter, also referred to as “Embodiment 3”) is a cutting tool containing the cemented carbide described in Embodiment 1 or Embodiment 2 The tool is also capable of having excellent adhesion resistance in addition to the mechanical strength that the cemented carbide intrinsically has. The tool preferably contains the cemented carbide of Embodiment 1 or Embodiment 2 at least in a part that is involved in cutting. The part that is involved in cutting means a region that is no more than μm distant from the blade edge. As the tool, a drill, a micro drill, an end mill, a blade edge-replaceable cutting tip for a drill, a blade edge-replaceable cutting tip for an end mill, a throw-away tip for milling, a throw-away tip for turning, a metal saw, a gear cutting tool, a reamer, a tap, a cutting tool, a wear-resistant tool, a tool for friction stir welding and the like can be exemplified. [Addendum 1] In the cemented carbide of Embodiment 2, in a 24.9 μm×18.8 μm rectangular measurement visual field set in an image after a binarization treatment of a backscattered electron image that is obtained by capturing a cross section of the cemented carbide with a scanning electron microscope, the number of the third hard phases is preferably no less than 30. In such a case, the adhesion resistance of the cemented carbide is improved. [Addendum 2] The third hard phase preferably has an average particle diameter of no less than 0.01 μm and no more than 0.08 μm. In such a case, the adhesion resistance of the cemented carbide is improved. [Addendum 3] The third hard phase preferably has a dispersity of no more than 0.4. In such a case, the adhesion resistance of the cemented carbide is improved EXAMPLES The present embodiments will be more specifically described using Examples. However, the present embodiments are not limited to these Examples. [Production of Cemented Carbide] <Specimen 1 to Specimen 37 and Specimen 1-1 to Specimen 1-15> As raw materials, tungsten carbide (WC) powders, a tungsten trioxide (WO3) powder, a chromium carbide (Cr3C2) powder, a titanium oxide (TiO2) powder, a niobium oxide (Nb2O5) powder, a tantalum oxide (Ta2O5) powder, a cobalt (Co) powder and a nickel (Ni) powder were prepared. As the WC powders, a tungsten carbide powder “WC02NR” (average particle diameter: 0.10 to 0.14 μm, equivalent particle diameter by the BET methyl). “WC04NR” (average particle diameter: 0.45 to 0.49 μm, average particle diameter by the Fischer method) and “WC25S” (average particle diameter 2.4 to 3.2 μm, measured using a particle size distribution measuring instrument (trade name: MT3300EX) manufactured by MicrotracBEL Corp.), all of which were manufactured by A.L.M.T. Corp. were used. The average particle diameter of the WO3powder is 1.5 μm, the average particle diameter of the Cr3C2powder is 1.5 μm, the average particle diameter of the TiO2powder is 0.01 μm, the average particle diameter of the Nb2O5powder is 0.05 μm, the average particle diameter of the Ta2O5powder is 0.05 μm, the average particle diameter of the Co powder is 1 μm, and the average particle diameter of the Ni powder is 1 μm The average particle diameters of the raw material powders are values measured using the particle size distribution measuring instrument (trade name: MT3300EX) manufactured by MicrotracBEL Corp. The raw material powders were mixed at proportions shown in the “raw material powders” column of Table 1 to Table 3 to afford powder mixtures. For example, in Specimen 1, 100 mass % of the powder mixture contains 52.0 mass % of the WC powder (WC04NR). 34.7 mass % of the WO3powder, 1.0 mass % of the Cr3C2powder, 0.27 mass % of the TiO2powder, 0.07 mass % of the Nb2O5powder and 12.0 mass % of the Co powder. For the mixing, an author was used. The inking time in the attritor is 10 hours. The obtained powder mixtures were molded by pressing to afford compacts having a round bar shape with a diameter of ϕ3.5 mm. For specimens other than Specimen 1-1, sintered bodies were afforded by the following method. The compacts were put into a sintering furnace, and the temperature was raised up to 1200° C. in a vacuum. The temperature rise rate was set to 10° C./minute. Subsequently, the temperature was raised from 1200° C. up to 1350° C. in a N2gas atmosphere at pressures shown in the “pressure” columns for “step 1” in Table 1 to Table 3 Subsequently, the compacts were sintered by being held in the N2gas atmosphere at pressures shown in the “pressure” columns for “step 2” in Table 1 to Table 3 at a temperature of 1350° C. for times shown in the “time” columns for “step 2” to afford sintered bodies. For example, for Specimen 1, the temperature was raised up to 1200° C. in a vacuum Subsequently, the temperature was raised from 1200° C. up to 1350° C. in a N2gas atmosphere at a pressure of 40 kPa Subsequently, the compact was sintered by being held in the N2gas atmosphere at a pressure of 12 kPa and a temperature of 1350° C. for 30 minutes to afford a sintered body For Specimen 1-1, a sintered body was afforded by the following method. The compact was put into a sintering furnace, and the temperature was raised up to 1200° C. in a vacuum. The temperature rise rate was set to 10° C./minute. Subsequently, the temperature was raised from 1200° C. up to 1350° C. in a vacuum (expressed as “sac sintering” in Table 3). Subsequently, the compact was sintered by being held in the vacuum at a temperature of 1350° C. for the time shown in the “time” column for “step 2” (expressed as “vac sintering” in Table 3) to afford a sintered body. On the obtained sintered bodies, s-HIP treatments were performed. Specifically, temperatures and pressures shown in the “temperature” and “pressure” columns for “s-HIP” step in Table 1 to Table 3 were applied to the sintered bodies for 60 minutes using an At gas as a pressure medium. For example, for Specimen 1, 1350° C. and a pressure of 7 MPaG were applied for 60 minutes using an Ar gas as the pressure medium. Subsequently, the sintered body after the s-HIP treatment was quenched to room temperature in the Ar gas at a pressure of 400 kPaG to afford a cemented carbide. <Specimen 1-13> A cemented carbide was produced by the same method as for Specimen No. 5 of Examples of PTL 2 (Japanese Patent Laying-Open No. 2012-251242). <Specimen 1-14> A cemented carbide was produced by the same method as for Example 1 of PTL 4 (Japanese Patent laying-Open No. 2016-98393). [Production of Tools] Round bars made of the obtained cemented carbides were processed to produce end mills having a diameter of ϕ3.0 mm. TABLE 1Raw material powder (mass %)Step 1Step 2s-HIP stepSpecimenWC04WC02PressurePressureTimePressureTemperatureNoNRNRWC25SWO3Cr3C2TiO2Nb2O5Ta2O5CoNi(kPa)(kPa)(min)(MPa)(º C.)152.00——34.661.000.270.07—12.00—40123071350252.09——34.721.000.150.04—12.00—12406071350352.00——34.671.000.280.06—12.00—8126071350451.00——34.001.001.840.16—12.00—12126071330551.46——34.311.001.170.06—12.00—12126071365651.52——34.341.000.760.38—12.00—121260101350751.27——34.181.000.980.57—12.00—12126031350852.18——34.791.000.020.01—12.00—12126071350950.62——33.741.001.980.66——12.001212607135010—51.90—34.601.000.380.13—12.00—1212607135011——52.6535.10—0.190.06—12.00—121260713501251.75——34.501.000.730.02—12.00—121260713501351.71——34.471.000.440.38—12.00—121260713501452.00——34.661.000.270.07—12.00—401230713501552.18——34.791.000.020.01—12.00—121260713501651.00——34.001.001.840.16—0.10—121260713301751.00——34.001.001.840.16—12.30—121260713301851.90——34.601.000.40—0.0912.00—121260713501951.89——34.591.000.46—0.0612.00—12406071350 TABLE 2Raw material powder (mass %)Step 1Step 2s-HIP stepSpecimenWC04WC02PressurePressureTimePressureTemperatureNoNRNRWC25SWO3Cr3C7TiO2Nb2O5Ta2O5CoNi(kPa)(kPa)(min)(MPa)(º C.)2051.80——34.541.000.56—0.1012.00—81260713502151.95——34.631.000.34—0.0712.00—121260713302251.89——34.601.000.43—0.0812.00—121260713652351.92——34.611.000.42—0.0512.00—1212601013502451.88——34.591.000.48—0.0512.00—121260313502552.17——34.781.000.04—0.0112.00—121260713502651.32——34.211.001.02—0.44—12.001212607135027—51.62—34.411.000.64—0.3312.00—1212607135028——52.1534.760.000.65—0.4412.00—121260713502951.81——34.541.000.62—0.0312.00—121260713503051.90——34.601.000.26—0.2412.00—121260713503159.09——39.391.000.34—0.070.10—121260713303251.77——34.511.000.34—0.0712.30—121260713303351.90——34.601.000.400.09—12.00—121260713503451.90——34.601.000.40—0.0912.00—121260713503551.92——34.611.000.39—0.0912.00—121260713503651.90——34.601.000.43—0.0712.00—121260713503751.90——34.601.000.43—0.0712.00—12126071350 TABLE 3Raw material powder (mass %)Step 1Step 2s-HIP stepSpecimenWC04WC02PressurePressureTimePressureTemperatureNoNRNRWC25SWO3Cr3C2TiO2Nb2O5Ta2O5CoNi(kPa)(kPa)(min)(MPa)(º C.)1-151.88——34.591.000.430.11—12.00—vacvac6071350sinteringsintering1-251.71——34.481.000.580.23—12.00—1160713501-351.19——34.131.001.170.50—12.00—121260713501-452.18——34.791.000.020.01—12.00—121260713501-559.10——39.401.000.400.10———121260713501-651.23——34.161.000.520.09—13.00—121260713501-751.89——34.601.000.42—0.0912.00—121260713501-851.93——34.621.000.37—0.0912.00—121260713501-951.31——34.211.001.38—0.1112.00—121260713501-1052.00——34.671.000.02—0.3012.00—121260713501-1159.19——39.461.000.34—0.01——121260713501-1251.37——34.241.000.32—0.0713.00—121260713501-13Conditions described in patent—TiNbCN—10.00—Conditions described in patent5 vol %1-14Conditions described in patent—1.10——10.00—Conditions described in patent1-1551.90——34.601.000.40—0.0912.00—12126071350 [Evaluation] <Cemented Carbide> <<Composition of Cemented Carbide>> For the cemented carbide of each specimen, the contents (vol %) of the first hard phase, the second hard phase, or the third hard phase and the binder phase were measured. A specific measurement method is as described in Embodiment 1. The results are shown in the “vol %” columns for “first hard phase”, the “vol %” columns for “second hard phase/third hard phase” and the “vol %” columns for “binder phase” for “cemented carbide” in Table 4 to Table 6. <<Average Particle Diameter of Tungsten Carbide Particles>> For the cemented carbide of each specimen, the average particle diameter of tungsten carbide particles in the first hard phase was measured. A specific measurement method is as described in Embodiment 1. The results are shown in the “average particle diameter (μm)” columns for “first hard phase” in Table 4 to Table 6. <<Composition of Second Hard Phase or Third Hard Phase>> For the cemented carbide of each specimen, the composition of the second hard phase or the third hard phase was measured. A specific measurement method is as described in Embodiment 1. The results are shown in the “composition” columns for “second hard phase/third hard phase” in Table 4 to Table 6. When “TiNbC, TiNbN, TiNbCN” is shown in the “composition” column, it is indicated that the cemented carbide includes the second hard phase and the second hard phase includes TiNbC particles, TiNbN particles, TiNbCN particles and two or more kinds of first compounds selected from the group consisting of TiNbC, TiNbN and TiNbCN. When “TiNbC” is shown in the “composition” column, it is indicated that the second hard phase is composed of TiNbC particles. When “TiTaC, TiTaN, TiTaCN” is shown in the “composition” column, it is indicated that the cemented carbide includes the third hard phase and the third hard phase includes TiTaC particles, TiTaN particles, TiTaCN particles and two or more kinds of second compounds selected from the group consisting of TiTaC, TiTaN and TiTaCN. When “TiTaC” is shown in the “composition” column, it is indicated that the third hard phase is composed of TiTaC particles. “-” in the “composition” column indicates that neither the second hard phase nor the third hard phase is present. <<Nb Ratio and Ta Ratio>> For the cemented carbide of each specimen, the ratio of niobium to the sum of titanium and niobium in teams of the number of atoms in the second hard phase (Nb ratio) or the ratio of tantalum to the sum of titanium and tantalum in terms of the number of atoms in the third hard phase (Ta ratio) were derived based on the composition measured above. The results are shown in the “Nb ratio/Ta ratio” columns for “second hard phaser/third hard phase” in Table 4 to Table 6. <<Average Particle Diameter of Second Hard Phase or Third Hard Phase>> For the cemented carbide of each specimen, the average particle diameter of the second hard phase or the third hard phase was measured. A specific measurement method is as described in Embodiment 1 The results are shown in the “average particle diameter (μm)” columns for “second hard phase/third hard phase” in Table 4 to Table 6. <<Dispersity of Second Hard Phase or Third Hard Phase>> For the cemented carbide of each specimen, the dispersity of the second hard phase or the third hard phase was measured. A specific measurement method is as described in Embodiment 1. The results are shown in the “dispersity” columns for “second hard phase/third hard phase” in Table 4 to Table 6. <<Number of Second Hard Phases or Third Hard Phases>> For the cemented carbide of each specimen, the number of the second hard phases or the third hard phases in a 24.9 μm×18.8 μm rectangular measurement visual field was measured. A specific measurement method is as described in Embodiment 1. The results are shown in the “number” columns for “second hard phase/third hard phase” in Table 4 to Table 6. <Tool> <<Adhesion Resistance Test>> The side surface of a 64 titanium alloy (Ti-6Al-4V) was processed using the end mill of each specimen. Regarding the processing conditions, the cutting velocity Vc was set to 150 m/min, the table feed F was set to 0.1 mm/min, the depth of cut (axial direction) ap was set to 2.0 mm, and the width of cut (radial direction) ae was set to 0.5 mm. Three end mills were processed The processing conditions correspond to the high-efficiency processing of a difficult-to-cut material. When the length of cut reached 180 m, the blade edge of the end mill was observed with a scanning electron microscope, and the area of the blade edge to which a deposit was attached was measured by image analysis. Specifically, the area was measured by the following procedure The blade edge of the end mill is captured with a scanning electron microscope (SEM) in a rake face direction to obtain a backscattered electron image. The observation magnification is 5000 times. The measurement conditions are an accelerating voltage of 3 kV, a current value of 2 nA and a working distance (WD) of 5 mm. An example of the backscattered electron image is shown inFIG.7. InFIG.7, a dark dray region indicated by the reference signal5, which is attached to a blade edge3, is a deposit. The captured region with the SEM is analyzed using SEM-EDX, titanium mapping is performed on the captured region, and the component of the deposit is identified. The area (mm2) of the blade edge to which the deposit has been attached is measured using image analysis software (OpenCV, SciPy) The average values of the areas of the blade edges to which the deposit has been attached in the three end mills are shown in the “adhesion resistance” column for “tool” in Tables 4 to Table 6. It is indicated that, as the area becomes smaller, the adhesion resistance becomes superior The expression “30 m, defect” in the “adhesion resistance” column indicates that a defect was caused in the tool when the tool was cut 30 m. <<Wear Resistance Test>> A cutting test was performed using the end mill of each specimen under the same conditions as for the above-described adhesion resistance test. The length of cut was measured when the wear loss of the flank face reached 0.2 mm. The average values of the lengths of cut in the three end mills are shown in the “tool service life” columns for “tool” in Table 4 to Table 6. It is indicated that, as the length of cut becomes longer, the tool service life becomes longer TABLE 4Cemented carbideToolFirst hard phaseSecond hard phase/third hard phaseCutting testAverageNbAverageToolparticleratio/particleBinder phaseserviceSpecimenVoldiameterTadiameterVolAdhesionlifeNo.%(μm)Vol %Compositionratio(μm)DispersityNumber%Compositionresistance(m)179.60.521.3TiNbC, TiNbN, TiNbCN0.200.0020.3313219.1Co0.03250280.10.480.8TiNbC, TiNbN, TiNbCN0.230.1000.294119.1Co0.02230379.40.531.5TiNbC, TiNbN, TiNbCN0.170.0800.284219.1Co0.03240469.90.4811.0TiNbC, TiNbN, TiNbCN0.080.0600.169219.1Co0.04240574.50.496.4TiNbC, TiNbN, TiNbCN0.050.0500.6336519.1Co0.03230675.00.505.9TiNbC, TiNbN, TiNbCN0.330.0400.145719.1Co0.03230772.60.518.3TiNbC, TiNbN, TiNbCN0.370.0400.7029519.1Co0.02240880.80.550.1TiNbC, TiNbN, TiNbCN0.270.0900.454019.1Co0.04220965.90.4315.0TiNbC, TiNbN, TiNbCN0.250.0400.5118819.1Ni0.042701078.50.202.4TiNbC, TiNbN, TiNbCN0.250.0500.547419.1Co0.022801179.82.901.1TiNbC, TiNbN, TiNbCN0.230.0500.604919.1Co0.032101277.20.513.7TiNbC, TiNbN, TiNbCN0.030.0800.528619.1Co0.032101376.80.554.1TiNbC, TiNbN, TiNbCN0.460.1000.305519.1Co0.032501479.60.521.3TiNbC, TiNbN, TiNbCN0.200.0100.315619.1Co0.042401580.80.550.1TiNbC, TiNbN, TiNbCN0.270.0900.504019.1Co0.052101688.80.4811.0TiNbC, TiNbN, TiNbCN0.080.0600.16920.18Co0.012901769.20.4811.0TiNbC, TiNbN, TiNbCN0.080.0600.169219.8Co0.09200 TABLE 5Cemented carbideToolFirst hard phaseSecond hard phase/third hard phaseCutting testAverageNbAverageToolparticleratio/particleBinder phaseserviceSpecimenVoldiameterVolTadiameterVolAdhesionlifeNo.%(μm)%Compositionratio(μm)DispersityNumber%Compositionresistance(m)1877.90.473.0TiTaC, TiTaN, TiTaCN0.190.1000.214419.1Co0.022401977.70.483.2TiTaC, TiTaN, TiTaCN0.110.1000.184319.1Co0.042302076.40.464.5TiTaC, TiTaN, TiTaCN0.150.0800.194919.1Co0.032302178.60.542.3TiTaC, TiTaN, TiTaCN0.170.0500.164319.1Co0.022402277.80.513.1TiTaC, TiTaN, TiTaCN0.150.0400.6313519.1Co0.042302378.20.472.7TiTaC, TiTaN, TiTaCN0.100.0600.144219.1Co0.022302477.60.523.3TiTaC, TiTaN, TiTaCN0.100.0700.7011619.1Co0.042402580.80.560.12TiTaC, TiTaN, TiTaCN0.220.0700.654019.1Co0.042202666.90.4414.0TiTaC, TiTaN, TiTaCN0.300.0300.5520219.1Ni0.022702773.10.207.8TiTaC, TiTaN, TiTaCN0.340.0300.4138119.1Co0.022802871.73.009.2TiTaC, TiTaN, TiTaCN0.400.0400.3834619.1Co0.032102976.50.494.4TiTaC, TiTaN, TiTaCN0.040.0500.338219.1Co0.032103077.90.503.0TiTaC, TiTaN, TiTaCN0.480.0400.275619.1Co0.032503197.50.542.3TiTaC, TiTaN, TiTaCN0.170.0500.10410.18Co0.012903277.90.542.3TiTaC, TiTaN, TiTaCN0.170.0500.20019.8Co0.092003377.90.473.0TiNbC, TiNbN, TiNbCN0.190.1000.213019.1Co0.022003477.90.473.0TiTaC, TiTaN, TiTaCN0.190.1000.213019.1Co0.02200 TABLE 6Cemented carbideToolFirst hard phaseSecond hard phase/third hard phaseCutting testAverageNbAverageToolparticleratio/particleBinder phaseserviceSpecimenVoldiameterVolTadiameterVolAdhesionlifeNo.%(μm)%Compositionratio(μm)DispersityNumber%Compositionresistance(m)3578.10.452.8TiTaC, TiTaN, TiTaCN0.180.0900.072719.1Co0.022003677.90.443.0TiTaC, TiTaN, TiTaCN0.140.0800.423019.1Co0.032003777.90.433.0TiTaC, TiTaN, TiTaCN0.140.0800.383019.1Co0.012301-177.60.523.3TiNbC0.200.1500.385019.1Co0.121401-274.90.506.0TiNbC, TiNbN, TiNbCN0.280.0700.7936119.1Co0.111601-363.90.6017.0TiNbC, TiNbN, TiNbCN0.300.0060.459819.1Co0.101701-480.90.530.1TiNbC, TiNbN, TiNbCN0.400.0700.284019.1Co0.121201-597.00.543.0TiNbC, TiNbN, TiNbCN0.200.0900.32500—30 m,30Defect1-674.00.574.0TiNbC, TiNbN, TiNbCN0.150.0400.4512122.0Co120 m,120Defect1-777.80.583.1TiTaC0.180.1500.405019.1Co0.131501-878.10.552.8TiTaC, TiTaN, TiTaCN0.230.0300.8221619.1Co0.151301-963.90.4917.0TiTaC, TiTaN, TiTaCN0.180.0500.604219.1Co0.101701-1080.90.480.05TiTaC, TiTaN, TiTaCN0.180.0700.534019.1Co0.121201-1197.70.492.3TiTaC, TiTaN, TiTaCN0.170.0800.38500—30 m,30Defect1-1276.10.551.9TiTaC, TiTaN, TiTaCN0.120.1000.404622.00Co120 m,120Defect1-1369.00.4215.6TiWNbCN—0.2200.933315.4Co0.24901-1487.00.403.0TiCN—0 0300.8525710.0Co0.151201-1577.90.473.0TiTaC, TiTaN, TiTaCN0.190.1200.212119.1Co0.02100 <Discussion> The cemented carbides and the tools of Specimen 1 to Specimen 37 correspond to the examples. The cemented carbides and the tools of Specimen 1-1 to Specimen 1-15 correspond to comparative examples. It was confirmed that, in the tools of Specimen 1 to Specimen 37 (examples), compared with the tools of Specimen 1-1 to Specimen 1-15 (comparative examples), the adhesion resistance was excellent and the tool service lives were long in the high-efficiency processing of a difficult-to-cut material. The embodiments and Examples of the present disclosure have been described as described above, and originally, appropriate combinations or various modifications of the configurations of individual embodiments and Examples described above are also planned. The embodiments and Examples disclosed this time shall be considered to be exemplary in all aspects and to limit nothing. The scope of the present invention is shown not by the above-described embodiments and Examples but by the claims and is intended to include equivalent meaning to the claims and all modifications within the scope. REFERENCE SIGNS LIST 3: Blade edge;5: Deposit | 69,961 |
11858050 | DETAILED DESCRIPTION Referring to the drawings, a detailed description will be given below of a preferred embodiment of a cutting insert according to the present invention (seeFIG.1and the like). The following will first describe an outline of a cutting insert10to be used to cut a work (material to be cut)100, and then describe a characteristic portion of the cutting insert10according to the present invention (seeFIG.1and the like). It is assumed that, in the following description, for the sake of convenience, wording “a low region” and “a middle region” is used. The “low region” refers to cutting in a state where an amount of cutting is relatively small or to a range of a cutting edge or a breaker projection to be used for such cutting, while the “middle region” refers to cutting in a state where the amount of cutting is larger or to a range of the cutting edge or the breaker projection to be used for such cutting. Outline of Cutting Insert The cutting insert10illustrated inFIG.1and the like is configured as an insert that is mounted on a body (illustration of which is omitted) of a cutting tool by being 180° rotated around a central axis AX1passing through a center of an upper surface17and perpendicular to a lower surface19to allow each of a pair of cutting edges20to be used (seeFIG.1,FIG.3, and the like). In a center portion of the cutting insert10, a screw hole18through which a mounting screw (illustration of which is omitted) is to pass is formed to extend through the upper surface17and the lower surface19(seeFIG.2,FIG.3, and the like). When the cutting insert10is to be mounted on the body, the lower surface19functions as a mounting surface to be brought into contact with the body. The cutting insert10in the present embodiment includes the upper surface17serving as a first end surface facing in an upward direction along the central axis AX1inFIG.1, the lower surface19serving as a second end surface facing in a downward direction opposite to the upward direction, and a peripheral side surface15including a first peripheral side surface portion11, a second peripheral side surface portion12, a third peripheral side surface portion13, and a fourth peripheral side surface portion14and connecting the upper surface17and the lower surface19. Each of these first peripheral side surface portion11, second peripheral side surface portion12, third peripheral side surface portion13, and fourth peripheral side surface portion14is formed to be inclined to have an overhanging shape (seeFIG.4) such that an area of the lower surface19is smaller than that of the upper surface17(seeFIG.4) and thereby serve as a flank for each of the cutting edges20(seeFIG.4,FIG.5, and the like). Note that, as described above, the cutting insert10in the present embodiment has a symmetrical shape which allows the cutting insert10to be used by being 180° rotated around the central axis AX1. Accordingly, shapes or structures of corner portions36, the cutting edges20, and the like described below apply to any pair of members having a symmetrical shape unless otherwise specified. In top view (seeFIG.3), the upper surface17has a rhomboidal shape (diamond shape) including a pair of substantially parallel side ridge portions. For the sake of convenience, it is assumed that one of directions (each referred to as a “longitudinal direction” in the present specification) in which the longer one of two diagonals of the rhomboidal shape extends is a first direction D1, another of the directions is a third direction D3, one of directions (each referred to as a “lateral direction” in the present specification) in which the shorter one of the diagonals extends is a second direction D2, and another of the directions is a fourth direction D4(seeFIG.1,FIG.3, and the like). In the first and third directions D1and D3of the cutting insert10, the respective corner portions36are formed (seeFIG.2and the like). Note that, to show the shape and structure of the cutting insert10described in the present embodiment when viewed sideways, a view obtained by viewing the cutting insert10in a direction perpendicular to one of the cutting edges20(to the longitudinal direction thereof) (an example of such a direction is denoted by a reference sign D5for the sake of convenience inFIG.3and the like) is considered to be easier to understand than a view obtained by viewing the cutting insert10along the lateral direction (i.e., a view obtained by viewing the cutting insert10in the second direction D2or the fourth direction D4). In the present specification, for the sake of convenience, a view obtained by thus viewing the cutting insert10along the direction D5is referred to as a sideview view, and such sideview views are illustrated in some of the drawings (seeFIG.7andFIG.9). At an intersecting edge (side ridge portion)16between the peripheral side surface15and the upper surface17, the cutting edges20each including a main cutting edge21and a corner cutting edge25are formed (seeFIG.1and the like). The corner cutting edge25is formed in the corner portion36described above. The main cutting edge21is formed to be continued to the corner cutting edge25(seeFIG.2and the like). On the upper surface17, a projecting portion40including a first breaker projection (first projection)41and a second breaker projection (second projection)42is formed to extend from the corner portion36toward the central axis AX1(seeFIG.15,FIG.16, and the like). The first breaker projection41is formed at a position close to the corner portion36to have an elongated shape extending along the longitudinal direction (seeFIG.6,FIG.16, and the like). The first breaker projection41is formed to have a top surface41uhaving a height increasing from the corner portion36toward the central axis AX1along the longitudinal direction (see the portion indicated by the right-up arrow inFIG.7) to reach a peak point41p, while being gently inclined, and then gradually decreasing with distance from the peak point41ptoward the central axis AX1(seeFIG.7). The first breaker projection41is also formed such that the peak point41pis higher than a cutting edge25tof the corner cutting edge25(seeFIG.7). The first breaker projection41having such a shape contributes to securing a space (a so-called pocket-like space) for allowing chip (denoted by a reference numeral101inFIG.14A) to flow between the first breaker projection41and the cutting edge20and to inhibiting over-restraint. Generation of the chip101starts at the first breaker projection41as a portion closest to the corner cutting edge25under any condition even in the low region or in the middle region. A more specific description will be given of the foregoing (seeFIG.7and the like). In general, when a rake angle is excessively increased, the chip101goes into a deeper portion along a rake surface of a rake portion50of concern. In the present specification, bumping of the chip101onto the first breaker projection41in such a state is referred to as the “over-restraint”. An increased restraining force is advantageous in terms of finely cutting the chip101, but it can also be said that such a form forcibly deforms the chip101against a natural flow of the chip101and removes the chip101from the work (material to be cut)100. Consequently, in some cases, scratches, burrs, and the like are more likely to be formed on a machined surface. It can also be said that, as long as the projection-type breaker is provided so as to cut the chip, such a problem cannot be avoided to some extent but, in a product in which the corner portion36has a sharp rake angle, blockage/over-restraint of the chip101may actually occur to result in a rough surface. In the present embodiment, to solve the problem in view of such a situation, it is intended to reduce an angle difference between a gradient (angular degree) θ1of a first inclination S1and the rake angle of the rake portion50, and therefore it can be said that the portion of concern is flatter. It can also be said that the height of the first breaker projection41is reduced after the peak (after the peak point41pis passed) similarly because, as the height of the projection viewed from a cutting edge cross section is larger, the chip101is excessively strongly restrained. Note that, when an optimum rake angle is set for the portion provided with the first inclination S1, the portion of concern can be flattened. The second breaker projection42is formed to be continued to the first breaker projection41. The second breaker projection42in the present embodiment has a top surface42uinclined from the first breaker projection41to be higher with approach to the central axis AX1, and also has a first-level wall surface42aand a second-level wall surface42b(seeFIG.2,FIG.15, and the like). The top surface42umay include a rather streamlined portion having a gently increasing height or may also include a multi-level wall surface. The first-level wall surface42ais used mainly as a guide which restrains the chip101, while the second-level wall surface42bis formed so as to secure a pocket for allowing the chip101to flow, though not directly greatly contributing to cutting performance. The first-level wall surface42aand the second-level wall surface42bare basically configured in a two-level structure to allow a space that is not excessively large to be formed so as to guide the chip101formed in a helical shape. In the present embodiment, the first-level wall surface42ais configured so as to serve mainly as the guide, while the second-level wall surface42bhas an appropriately spacious configuration (with a larger space). The first-level wall surface42ais formed as a wall surface that functions particularly when cutting is performed with the middle region. The first-level wall surface42amay also include a multi-level wall surface, but is more preferably configured to have a gently varying streamlined shape. The first-level wall surface42ain the present embodiment includes a wall surface formed to rise from the rake portion50toward the top surface42u, and is formed to function particularly as the guide that restrains the chip101resulting from cutting by the main cutting edge21particularly when the cutting is performed with the middle region (seeFIG.1and the like). The first-level wall surface42ain the present embodiment is formed such that a space (chip pocket) having such an appropriate size and an appropriate shape as to allow the chip101to smoothly flow rearward (in a direction away from the corner portion36) is formed between the first-level wall surface42aand the rake portion50so as to, e.g., gradually decrease in size with distance from the corner portion36. The first-level wall surface42athus configured guides (helps) the chip101such that the chip101smoothly flows particularly when cutting is performed with the middle region, and may further achieve an effect of inhibiting the chip from being tangled as a result of being swung (seeFIG.14Aand the like) or the like. The second-level wall surface42bis formed as a wall surface that functions to guide the chip101extending over the first-level wall surface42aand allow the chip101to smoothly flow. If an extremely long chip pocket is left on a middle region side, when the long helical chip101is generated, the pocket may result in a case where the chip101cannot successfully be processed, and is swung to be tangled. Therefore, the present embodiment assumes such a case and allows the chip101extending over the first-level wall surface42ato be processed with the second-level wall surface42b. Between the projecting portion40and the cutting edge20, the rake portion50is formed (seeFIG.2,FIG.6, and the like). The rake portion50is a portion which functions as a rake surface for the cutting edge20during cutting (seeFIG.10andFIG.12), and is formed so as to have a predetermined rake angle. The rake angle of the rake portion50can be defined as an angle of the rake portion50of concern with respect to a horizontal surface (surface parallel to the upper surface17and the lower surface19) in a cross section perpendicular to the cutting edge20. In the present embodiment, the rake portion50is formed such that the angular degree of the rake angle increases gradually (step by step and continuously) with distance from the corner portion36(in other words, a very slight twist is added to the rake surface). The rake portion50of the cutting insert10in the present embodiment also has a shape in which the angular degree of the rake angle increases with distance from the corner portion36and no longer increases after a deepest portion20d(seeFIG.5) of the cutting edge20is reached. The rake portion50is formed to have a flat surface in the vicinity of the corner portion36. The flatness mentioned herein does not mean complete flatness, but means a certain degree of flatness which allows the chip101to more smoothly flow during cutting. In other words, particularly when the rake angle is provided and the first breaker projection41is formed in the vicinity of the corner portion36, at least projections and depressions are formed, and accordingly complete flatness is not achieved in a strict sense of meaning. It is to be noted therein that, as a surface in the vicinity of the corner portion36is flatter, the chip101is allowed to more smoothly flow, and a certain degree of flatness which allows at least smoother flowing of the chip101is achieved (seeFIG.8and the like). In other words, the rake surface included in the rake portion50is a composite surface formed by the gradients (θ1and θ2) of an inclination S and the rake angle. The cutting insert10in the present embodiment has a structure in which the corner portion36has the rake angle, and the rake angle continuously varies though little by little even when attention is focused only on the range of the first inclination S1. Therefore, the surface in the vicinity of the corner portion36is formed to be flat, though not completely flat in a strict sense of meaning. In other words, when the chip101is to be finely cut, the rake angle is preferably set slightly sharper, but an excessively sharp rake angle results in over-restraint, and accordingly balance is important from this viewpoint. The cutting edge20is provided with the inclination (inclined portion) S such that a cutting edge height (which refers to a distance from the surface parallel to the lower surface19to the cutting edge20and is denoted by a reference sign H in the figure) gradually decreases with distance from the corner cutting edge25(seeFIG.7,FIG.9, and the like). The inclination S in the cutting insert10in the present embodiment includes the first inclination S1beginning at an intermediate point in the corner cutting edge25and a second inclination S2continued to the first inclination S1and having the gradient θ2larger than the gradient θ1of the first inclination S1(seeFIG.9and the like). The first inclination S1beginning at the intermediate point in the corner cutting edge25serves to withdraw the chip101particularly when cutting is performed with the low region (with a low-depth-of-cut) toward the first breaker projection41at an early stage. With the inclination S, the cutting edge20is inclined/sloped, and the chip101flows along the rake surface extending along the cutting edge20. At this time, the chip101is encouraged to be curled (upwardly curled) along the arrow illustrated inFIG.11to come into contact with the first breaker projection41with which the chip101has recently come into contact. In the cutting insert10in the present embodiment, it is avoided as much as possible to give, to the chip101, a factor that causes excessive curving of the chip101, and allowing the chip101to flow in a stable helical state is prioritized over cutting of the chip101to implement smooth discharge of the chip101. In the cutting insert10provided with the inclination S as described above, the rake portion50in the vicinity of the corner portion36may also be such that the rake angle thereof is formed according to the gradient of the first inclination S1. The rake angle and the gradient are not particularly limited to specific numerical values, but is it possible to, e.g., set the gradient θ1of the first inclination S1to 5° and similarly set the rake angle of the rake portion50in the vicinity of the corner portion36to 5°. For example, when the rake angle is set excessively sharp, an upward curve due to the inclination S and a lateral curve due to the rake angle are added up, and consequently the chip101may be less likely to flow smoothly. In such a case, the chip101is more likely to get stuck, and the chip101shaped like having been forcibly torn off is likely to be generated. As a result, quality of the machined surface deteriorates in the form of a torn surface/cloudy surface. In this regard, in the cutting insert10in the present embodiment having a structure as described above, the rake portion50(in the vicinity of the corner portion36) prevents the chip101from being strongly curved as much as possible and, at an early stage, the chip101is allowed to flow smoothly in a given direction toward the first breaker projection41. In other words, it is not preferable to extremely curve the chip101and, in this respect, it can be said that the cutting insert10in the present embodiment has a structure focused on allowing the chip101to smoothly flow over the rake surface. Outline of Characteristic Features of Cutting Insert The following will describe an outline of characteristic features of the cutting insert10in the present embodiment thus configured, together with how the present inventors have conceived of the characteristic features, matters taken into consideration, and the like. In performing cutting using the cutting insert10, there are improvement requirements related to the chip101resulting from external turning/the low region (minute cutting) using an automatic lathe. Accordingly, in view of the above, a shape that brings the projection (first projection) as close as possible to the corner cutting edge was examined. However, it was proved that the shape caused such effects as an excessively reduced breaker width and curving of the chip101at a sharp (large) rake angle to result in a situation where, particularly in the middle region having a relatively large rake angle, so-called over-constraint was observed and affected the machined surface. In other words, in a situation where the chip101got stuck, there was a strong tendency toward forcible curving and cutting of the chip101generated from the work (material to be cut)100in a machined region, which resulted in an image as if the chip101was forcibly torn off. As a result, a rough surface/cloudy surface was observed, and it was considered that a phenomenon of degraded quality of the machined surface was likely to occur. In view of this, the present embodiment adopts a design that prioritizes discharge performance of the chip101in the low region. Specifically, (i) to promote upward curling (due to the inclination S with which the cutting edge20is provided, both the cutting edge height H and the rake surface lower with distance from the corner portion36, and accordingly an effect of causing the chip101to move in an upward direction over a paper sheet withFIG.10and have a helically long cylindrical shape as illustrated inFIG.14Ais achieved), the cutting edge20is provided with the inclination (inclined portion) S and (ii) to promote the curling (i.e., to withdraw the chip toward the first breaker projection41), a position where the inclination S begins is set in the corner portion36. In addition, from the results of various comparison tests, it was found that, as the rake angle of the rake portion50and the gradient of the inclination S were brought closer to each other, flow performance of the chip101in the low region was smoother and therefore, by providing a structure in which the gradient of the inclination S and the rake angle have substantially equal values, the chip101is allowed to flow smoothly from the rake surface of the corner portion36toward the first breaker projection41, while being prevented from having an extremely curved shape. However, the first breaker projection41is prevented from being excessively high, and is shaped to control the chip101by using only a leading end thereof (the portion of the cutting insert10in which the first breaker projection41is formed) as much as possible. It is preferable that a cross section of the first breaker projection41also has a gentle shape. The first breaker projection41has a shape in which the height thereof gradually decreases with the inclination S of the cutting insert10to allow the space (chip pocket) when the chip101flows to be formed. Another request for the cutting insert10is to solve a problem of a large number of burrs/chattering formed in semi-finishing of stainless steel. In this regard, the design that prioritizes the discharge performance of the chip101in the low region as described above is adopted, and also an effective cutting edge (in the cutting insert10in the present embodiment, the effective cutting edge has a range extending until the main cutting edge20reaches the deepest portion (denoted by the reference sign20dinFIG.5) is extended in a side view (seeFIG.5) or a sideview view (seeFIG.9) so as to allow machining to be performed also with the middle region. At this time, to lower cutting resistance during cutting with the middle region, the rake portion50having the rake angle larger in the middle region than in the lower region is configured to be able to inhibit the burrs/chattering. For the inclination also, the second inclination S2having a depth larger (an inclination larger) than that of the first inclination (first-level inclination in the low region) S1is formed. The second inclination S2thus formed further promotes curling (upward curling) along the arrow illustrated inFIG.13. In addition, by setting the gradient θ2of the second inclination S2larger than the rake angle (of the rake portion50in the portion of concern), it is possible to improve the cutting performance and provide a structure in which anti-chattering performance is improved, formation of burrs is inhibited, and the cutting resistance is reduced. In addition, particularly for the middle region, the second breaker projection42is formed to have a cross section having a two-level shape. It can also be considered to provide the second breaker projection42with a structure in which the second breaker projection42has a height lowering along the inclination S, similarly to the first breaker projection41. However, in such a case, the chip pocket is excessively large to possibly cause a problem that the wide chip101is exhausted, while being swung, under high-depth-of-cut/low-feed-rate conditions or the like to cause unstable chip flow/generation, which is the same as that encountered by the conventional cutting insert. In view of this, the present embodiment forms the second breaker projection42, while thoughtfully intending to provide a structure in which the chip pocket is relative narrowed in the middle region, unlike in the low region. The second breaker projection42is provided with a multi-level configuration in which the first-level wall surface42ais mainly used to form a space that is not excessively large so as to serve as a guide for the helically generated chip101, and the second-level wall surface42bis provided with a shape having an appropriately enlarged space to secure the chip pocket, while achieving the discharge performance of the chip101. These achieve the effect of allowing the rather long chip101having a stably helical shape to be discharged (seeFIG.14A). Meanwhile, in the case of the conventional cutting insert in which such an effect is not achieved, a helical portion has no problem when the chip101starts to come out but, when the chip pocket is large and has a high degree of freedom, the chip101is swung during machining and more likely to be extended and tangled (seeFIG.14B). Particularly when the cutting insert is used for the automatic lathe, a ratio of an amount of feeding to an amount of cutting is extremely lower than that for a general-purpose lathe, and accordingly such a phenomenon is likely to occur (in the case of the general-purpose lathe, the ratio of the amount of feeding increases to thicken the chip101. In such a situation, the chip pocket is narrow and more likely to be clogged to lead to chipping or the like). Therefore, in view of such a problem, in the present embodiment, the chip pocket is limited to a degree in the middle region, and a structure is provided in which the first-level wall surface42aof the second breaker projection42is used as a guide to allow the chip101to flow. The cutting insert10having such characteristic features as described above in the present embodiment allows a wide region including the low region (fine finishing) to the middle region (medium cutting) to be covered with a single insert. In other words, a structure is provided which is particularly appropriate for finishing (low-depth-of-cut/low-feed-rate machining) and also has a so-called expanded application range so as to allow quality cutting to be carried out even when cutting is performed with a high-depth-of-cut. This is achieved by further expanding the application range on a high-depth-of-cut side particularly by providing the first breaker projection41having the structure that inhibits over-restraint, while securing the space for allowing the chip101to flow as described above, further providing the second breaker projection42having the two-level structure focusing on the guiding of the chip101, and adjusting the slant (inclination) of the cutting edge20(i.e., setting different gradients for the first breaker projection41and the second breaker42). This is also achieved by gradually varying the rake angle of the rake portion50and thereby reducing the cutting resistance to allow the application range to be further expanded. Thus, the effect of the so-called optimized projecting portion40(the first breaker projection41and the second breaker projection42) is also additionally achieved to implement smooth chip generation/discharge without involving over-restraint. Note that the embodiment described above is an example of preferred implementation of the present invention, but is not limited thereto. Various modifications can be made within a scope not departing from the gist of the present invention. The present invention is preferably applied to a cutting insert for cutting (mainly turning). | 26,639 |
11858051 | DETAILED DESCRIPTION The following description is intended to convey a thorough understanding of the embodiments described by providing a number of specific embodiments and details involving A-frame foundations used to support single-axis solar trackers. It should be appreciated, however, that the present invention is not limited to these specific embodiments and details, which are exemplary only. It is further understood that one possessing ordinary skill in the art in light of known systems and methods, would appreciate the use of the invention for its intended purpose. Turning now to the drawing figures,FIGS.2A through2Dshow different views of a passive locking chuck for a rotary screw anchor driver according to various embodiments of the invention. For ease of illustration, the machine supporting the rotary driver has been intentionally omitted from this disclosure. As seen in the aforementioned co-pending patent application Ser. No. 16/416,052, such a machine may have an articulating mast supporting a rotary driver on a carriage that is operable to move along the mast to driver screw anchors into the ground along specific driving axes. The mast may also support a drilling tool, such as a hydraulic drifter, that actuates a drill rod along the same axes, through the rotary driver and the screw anchor, to assist with screw anchor embedment. With continued reference to the figures, chuck100has an upper end with mounting surface110which, as shown, may include several threaded openings to receive bolts that attach the chuck to the rotating output of the rotary driver. Opening112extends all the way through main body102, providing a channel through the body that gives clearance for the drill rod to pass through. The lower end of chuck100has a fixed, open ring103, visible for example in2B, that receives driving coupler13of a foundation component such as screw anchor10. As seen inFIG.2B, fixed ring103is has a series of recesses that extend up into opening112that are evenly distributed around the inner surface of the ring. These recesses may extend a couple of inches into main body102of the chuck. These recesses terminate at a top portion of movable inner ring104concealed within main body102, directly above fixed ring103. Movable inner ring104has the same pattern of recesses on its inner surface, but unlike fixed ring103, provides an upper surface that limits the depth of penetration of coupler13into the chuck. When the respective recesses in movable inner ring104are aligned with the ones built into fixed ring103, driving coupler13of the foundation component10can be inserted all the way in until the teeth or other driving features14contact the top surface of movable inner ring104. As shown inFIGS.2A-2D, a series of threaded ball detents108are distributed around body102of chuck100and extend through the body until they contact reciprocal surfaces formed in the outer surface of movable ring104to hold it at either, (1) the first angular orientation, where the recesses in the ring are aligned with the recesses in the opening, or (2) the second angular orientation, where the recesses in inner ring104are offset from the recesses in fixed outer ring103. In various embodiments, 10 to 20-degrees of angular displacement may separate the first orientation from the second orientation. The outer surface of movable inner ring104has a series of rounded projections105separated by circular surfaces of smaller diameter. In the drawings, three ball detents108sit at the end of threaded posts and are screwed into main body102of the chuck until the spring-loaded balls contact inner movable ring104. It should be appreciated that more or fewer than three may be used. In various embodiments, small half or partial-spherical recesses such as recesses109shown inFIG.2Dmay be formed on inner ring104's outer surface to receive and capture ball detents108at the first orientation and at the second orientation and to hold it into place until it is acted on by a twisting force such as the resistance to rotation from the ground or a human operator loading a screw anchor and twisting it to reposition the inner ring. FIG.2Cshows a bottom view of movable inner ring103with the chuck removed for clarity. The outer surface of ring103is generally circular with evenly spaced portions removed to narrow the outer diameter. Removal at these areas leaves six sections of reduced diameter and six corresponding sections of relatively greater diameter. Although if milled, this is typically done in a destructive process, the portions of larger diameter may be thought of as projections. In various embodiments, ball detents108will engage portions of the outer surface of inner ring104that have relatively narrower diameter. In various embodiments, partial spherical indents109are formed in the outer surface so that that detents will “lock” the ring in place as it rotated from one orientation to the other. They may be unlocked when a twisting force is applied to the screw anchor but will not unlock merely from the weight of the anchor or motion of the rotary driver in air as the machine mast is oriented to the correct driving axis. FIG.2Dis a partial cut away view from the topside with a portion of the chuck removed to reveal the geometries of the inner surface of fixed ring103and outer surface of movable inner ring104. The fixed ring103recesses formed in it that receive the portions of relatively larger diameter on movable ring104. The relatively narrower diameter sections on the inner surface of fixed ring103function as stops for movable ring104, limiting the extent of its angular movement. In various embodiments, this may be limited to approximately 10-20-degrees, and preferably to the extent that maximizes the misalignment between the recesses in the chuck and the recesses in the ring, a shown, for example, inFIG.4B. The particular number of teeth in the screw anchor and corresponding recesses in fixed ring103and movable ring104are design choices and are not intended to limit the various embodiments of the disclosure. FIGS.3Aand B show the upper end of exemplary screw anchor10ofFIG.1, including driving coupler13, in greater detail;FIG.3Ais a perspective view while3B is a top view looking down. In various embodiments, driving coupler13is a single casting that is welded or otherwise attached to the upper end of tube11to make screw anchor10. In various embodiments, coupler13has a recess at its lower end that receives the upper end of tube11to make screw anchor10. A series of driving features14, shown as teeth in the figures, are distributed evenly around the perimeter of the coupler13. Those teeth fit into corresponding recesses cut into fixed ring103and movable inner ring104until they top out against narrower top surface of inner ring104when the coupler end of screw anchor10is inserted into fixed open ring103in the chuck. Connecting portion15of coupler13extends further into channel112through the center of main body102. In various embodiments, connecting portion15may have a curved profile and include a series of channels circumscribing its surface to provide voids for a section of tubular steel making up the upper portion of the truss leg to be deformed into when a crimping operation is performed at the overlapping portion of the upper leg. Turning toFIGS.4A and4B, these figures show two views looking into the chuck on the bottom side; in4A respective recesses formed in the movable ring104and fixed ring103are aligned, whereas in4B these recesses are offset. As discussed herein, aligning the respective recesses allows the coupler at the driving end of a foundation component, such as screw anchor10shown inFIG.1, to be inserted into the. Once coupler13tops out against the top of inner ring104, that is, when surface14A hits the top of movable inner ring104, the operator twists the screw anchor to move inner ring104from the first angular orientation to the second orientation (i.e., 10 to 20-degrees difference), thereby “locking” the anchor in the chuck to prevent it from falling out under the force of gravity before driving begins. Connecting portion15of coupler13preferably fits up into the narrower channel112in the center of the chuck and does not receive any forces from the rotary driver during operation of the rotary driving other than incidental contact from the drill rod.FIG.4Bshows the same view as4A, looking into the bottom of chuck100after inner ring104has been rotated to the second orientation. For ease of illustration, the screw anchor itself has been omitted from the figure so that the offset between the recesses of fixed ring103and movable ring104inside the chuck may be clearly seen. At this orientation, the space between recesses formed in the chuck, which act as projections, bear against the bottom surface of the teeth (e.g., surface opposing surface14A), preventing it from sliding out of the chuck. As discussed herein, when the anchor is acted on by a twisting force, such as when it begins penetrating the soil and encounters resistance to rotation, inner ring104will be forced back to the aligned position so that the anchor and chuck are no longer “locked” together. As a result, when driving is complete, the rotary driver, and by extension, passive locking chuck100, may be pulled straight up (i.e., opposite to the axis of the driven screw anchor) without disturbing its embedment. FIG.5is a flow chart detailing the steps of exemplary method200for driving a screw anchor with the passive locking chuck attached to a rotary driver according to various embodiments of the invention. Method200begins at step205where a screw anchor or other elongated foundation component is loaded into the chuck. As discussed herein, this may consist of inserting the upper, driving end of the screw anchor into the open chuck so that the teeth or other driving features circumscribing the driving coupler are received into the chuck until they top out against the movable inner ring captured within the chuck. Then, at step210, the operator twists the anchor about is axis so that the movable inner ring moves from the first orientation where it is aligned with the fixed ring built into the chuck, to the second orientation where it is offset from the fixed ring, thereby “locking” the driving coupler, and by extension the screw anchor or other foundation component into the chuck. The driving operation begins at step215where the machine rotary driver is actuated to commence the driving operation. As discussed in the previously mentioned application Ser. No. 16/416,052, this may involve the machine's automated control system applying a combination of torque and downforce to the head of the foundation component via contact between the rotary driver's chuck and the driving coupler to drive it into the ground until it reaches the desired embedment depth. As described herein, when the lower end of the foundation component or screw anchor hits the ground and encounters rotational resistance, the movable ring will revert back to the first orientation, aligning the recesses in the ring with those in the chuck and continuing thereafter to apply the fully rotational force to the teeth on the head of the anchor, leaving the screw anchor pressed against and engaged with but unlocked from the chuck. Torque and downforce continue to be applied until the component reaches the target embedment depth. Once the target depth is reached, because the chuck and screw anchor are mechanically unlocked, at step220, the rotary driver is retracted by pulling it straight up the driving axis, that is the opposite direction it traveled to embed the screw anchor, without requiring any counterrotation or other manual decoupling, and without pulling up or otherwise disturbing the driven screw anchor. Alternatively, if the driver encounters a refusal that cannot be mitigated in-situ, the operator may merely reverse the direction of rotation causing the movable inner ring to rotate to the locked position once again so that counterrotation along with upward pressure will uninstall the anchor causing it counterrotate out of the ground. Once it has cleared the ground, an operator may simply twist it back in the opposite direction to remove it or simply allow it to fall from the chuck under the force of gravity. The embodiments of the present inventions are not to be limited in scope by the specific embodiments described herein. Indeed, various modifications of the embodiments of the present inventions, in addition to those described herein, will be apparent to those of ordinary skill in the art from the foregoing description and accompanying drawings. Thus, such modifications are intended to fall within the scope of the following appended claims. Further, although some of the embodiments of the present invention have been described herein in the context of a particular implementation in a particular environment for a particular purpose, those of ordinary skill in the art will recognize that its usefulness is not limited thereto and that the embodiments of the present inventions can be beneficially implemented in any number of environments for any number of purposes. Accordingly, the claims set forth below should be construed in view of the full breath and spirit of the embodiments of the present inventions as disclosed herein. | 13,369 |
11858052 | DETAILED DESCRIPTION Aspects of the present disclosure will now be described more fully with reference to the accompanying drawings. The different devices disclosed herein can, however, be realized in many different forms and should not be construed as being limited to the aspects set forth herein. Like numbers in the drawings refer to like elements throughout. The terminology used herein is for describing aspects of the disclosure only and is not intended to limit the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. With reference toFIG.1andFIG.2,FIG.2being a partial side section view ofFIG.1, there is a core drill unit1comprising a motor unit2, a gear unit3, a front handle30and a rear handle31formed in a rear housing part32, where the rear handle31comprises a power switch33. The core drill unit1further comprises a drill shaft14that extends along a second longitudinal axis15and comprises a tool holder16that is adapted to hold a tool. The tool holder is in the form of a spindle shaft. FIG.3shows a perspective view of the gear unit3,FIG.4shows a cut-open section perspective view of a part of the assembled gear unit3and motor unit2,FIG.5shows a first perspective view of a motor unit2,FIG.6shows a second perspective view of the motor unit2, andFIG.7shows a perspective view of an assembled gear unit3and motor unit2. With reference also toFIG.3-FIG.7, the motor unit2comprises an electric motor4and a motor drive shaft5that extends along a first longitudinal axis6from the electric motor4and protrudes out of a motor unit housing7via a motor exit aperture8in a housing end part9of the motor unit housing7. The motor drive shaft5comprises a drive shaft gear10. The gear unit3comprises a gear unit housing18with a gear unit cavity11that in turn comprises at least one cavity gear12,13,41,42,43, where the drive shaft gear10is adapted to mate with a cavity gear12that at least indirectly is adapted to propel the drill shaft14. This means that the drive shaft gear10is adapted to mate with a cavity gear that directly or indirectly, i.e. via at least another cavity gear, is adapted to propel the drill shaft14. In this example, there is a first gear shaft14and a second gear shaft28, where the first gear shaft14corresponds to the drill shaft14. An incoming gear12is attached to the second gear shaft28and is adapted to mate with the drive shaft gear10. Outgoing gears13,43are attached to the first gear shaft14and are adapted to be coupled to the incoming gear12by means of intermediate gears41,42, where the outgoing gears13,43are attached to the drill shaft14. More in detail, a first intermediate gear41and a second intermediate gear42are attached to the second gear shaft28, and are brought into rotation when the second gear shaft28is brought into rotation by the drive shaft gear10propelling the incoming gear12. In the above context, a gear being attached to a shaft means that the gear is rotationally engaged to that shaft and is adapted to rotate together with that shaft. For a first gear position, as illustrated inFIG.4, the first intermediate gear41mates with, and engages, a first outgoing gear13, where the first outgoing gear13then is adapted to bring the first gear shaft14into rotation, while a second outgoing gear43is in an idle state, not engaging any gear. For a second gear position, the outgoing gears13,43are shifted along the second longitudinal axis15such that the second intermediate gear42mates with, and engages, the second outgoing gear43where the second outgoing gear43then is adapted to bring the first gear shaft14into rotation, while the first outgoing gear13is in an idle state, not engaging any gear. Shifting between the gear positions is enabled by means of a shift lever44that makes the outgoing gears13,43move along the first gear shaft14, along the second longitudinal axis15, while being rotationally engaged with the first gear shaft14. According to some aspects, the incoming gear12is constituted by a drive wheel and a slip clutch wheel. Many other gear configurations are possible with more or less gears. It is conceivable that the drive shaft gear10is adapted to mate with, and directly propel, the incoming gear12. According to some aspects, the incoming gear12is in the form of a spline that is received in a gear that is adapted to receive the spline. Such a gear may according to some aspects be constituted by the outgoing gear such that there is a straight power transfer where the longitudinal axes6,15coincide. The housing end part9comprises a wall part17arranged transversally to the longitudinal axes6,15and is adapted to close the gear unit cavity11and to separate the electric motor4from the gear unit cavity11. In other words, the motor unit housing7comprises the only wall part that separates the gear unit cavity11and the electric motor4, the gear unit housing18being open towards the wall part17. This means that the gear unit3does not comprise any wall part facing the motor unit housing7, reducing the number of parts and material needed. This results in a drill unit1which has a reduced size and weight which leads to reduced manufacture cost. Furthermore, the reduced size is due to a reduced length along the longitudinal axes6,15, which means that the motor drive shaft5has a reduced length which lowers the risk of bending of the motor drive shaft. The unit housing18and the motor unit housing7together are comprised in a drill tool main housing7,18, according to some aspects the drill tool main housing7,18is attached to the rear housing part32which for example mainly can be formed in a plastic material. According to some aspects, the gear unit cavity11accommodates a liquid, such as lubricating oil or grease, and the wall part17of the motor unit housing together with the gear unit cavity11being arranged to encapsulate said liquid. For example, such a liquid can be gear oil or something more viscous such as gear grease, and is used as lubrication for lubricating moving parts within the gear unit. According to some aspects, the housing end part9comprises a circumferentially running sealing flange21that extends from the wall part17towards and into the gear unit cavity11parallel to the longitudinal axes6,15, such that the sealing flange21and the gear unit cavity11overlap in a direction perpendicular to the longitudinal axes6,15. The sealing flange21and the gear unit housing18have corresponding surfaces34,35that are parallel to, and circumvent, the longitudinal axes6,15. The surfaces34,35having complementary shapes where they abut each other. The sealing flange21has a flange surface34that is a radially outer surface, and the gear unit housing18has a housing surface35that is a radially inner surface. In this way, the sealing flange21and the gear unit housing18form a seal which is desirable since the gear unit cavity11can be filled with gear oil that should be contained within the gear unit cavity11. In this context, it should be noted that apart from the advantages mentioned above, the single wall part17results in that the thermal conductivity between the motor unit2and the gear unit3is improved, where, according to some aspects, the gear oil can absorb some of the heat generated by the electric motor4. Furthermore, the abutting surfaces34,35provide an increased stability. According to some aspects, the surfaces34,35follow non-cylindrical shapes around the longitudinal axes6,15. This means that the surfaces34,35can follow the general cross-sectional shape of the drill unit at the intersection between the motor unit2and the gear unit3. According to some aspects, the sealing flange21comprises a circumferentially running slot19that is adapted to receive a sealing gasket20that is adapted to function as a seal between the gear unit housing18and the motor unit housing7. In this way, an improved sealing between the motor unit2and the gear unit3is obtained. In this example, the sealing gasket20is an O-ring, other types of sealing gaskets are of course conceivable. Alternatively, the circumferentially running slot19that is adapted to receive the sealing gasket20can be formed at another part. For example, the gear unit housing18and the motor unit housing7comprise corresponding flange surfaces36,37which run perpendicular to the longitudinal axes6,15and which are adapted to abut each other, where the circumferentially running slot that is adapted to receive the sealing gasket can be formed in any one of these flange surfaces36,37. The sealing gasket can be an O-ring or a flat gasket. According to some aspects, the motor unit housing7is attached to the gear unit housing18with fastening means29a,29bwhere, according to some aspects, these fastening means29a,29brun via the flange surfaces36,37. The fastening means29a,29bcan for example be constituted by screws or bolts. According to some aspects, the fastening means29a,29bengage the gear unit housing18and the motor unit housing7at a position radially outward of the sealing flange14. According to some aspects, the housing end part9comprises a circumferentially running first supporting flange22that extends from the wall part17towards and into the gear unit cavity11parallel with the first longitudinal axis6, perpendicular to the extension of the wall part17, where the first supporting flange22has a radial extension that encompasses the first longitudinal axis6. The first supporting flange22comprises the motor exit aperture8and holds a bearing arrangement23and a radial seal49for the motor drive shaft5, where the motor drive shaft5extends through the first supporting flange22. This provides support for the motor drive shaft5and accommodation for the bearing arrangement23. Furthermore, by means of the present disclosure where only one wall part17separates the gear unit cavity11and the electric motor4, only one bearing arrangement is required for the motor drive shaft5at the transition from the motor unit2into the gear unit3. As mentioned previously, the motor drive shaft5has a reduced length which lowers the risk of bending of the motor drive shaft, where the length in question runs from the bearing arrangement23to the end of the drive shaft gear10. According to some aspects, the housing end part9comprises at least one circumferentially running further supporting flange24,25that extends from the wall part17towards and into the gear unit cavity11along an axis parallel with the first longitudinal axis6, where each further supporting flange24,25holds a corresponding bearing arrangement26,27adapted to receive and support a corresponding gear shaft14,28that is attached to a corresponding gear in the gear unit3. In this example there is a first gear shaft14that corresponds to the drill shaft and a second gear shaft28, where the first gear shaft14is rotationally engaged with the outgoing gears13,43, and the second gear shaft28is rotationally engaged with the incoming gear12that in turn is adapted to mate with the drive shaft gear10as described previously. A first supporting flange24comprises a first bearing arrangement26that is adapted to receive the first gear shaft14, and a second supporting flange25holds a second bearing arrangement27that is adapted to receive the second gear shaft28. In this manner, the gear shafts14,28are securely fixed and journaled by means of the bearing arrangement26,27. The gear shafts14,28are securely fixed and journaled in the gear unit3as well, as shown for the first gear shaft14, the drill shaft14, inFIG.2where the drill shaft14extends via a drill shaft bearing arrangement38. The supporting flanges22,24,25thus have radially inner surfaces that are adapted to receive another part I the form of the motor drive shaft5and the gear shafts14,28. In this context, a flange holding a bearing arrangement means that the flange is adapted to comprise a seat for the bearing arrangement According to some aspects, the sealing flange21circumvents the supporting flanges22,24,25, and preferably supporting ridges45,46,47,48run between the supporting flanges22,24,25and the sealing flange21. According to some aspects, the supporting flanges22,24,25mainly have a cylindrical shape and may have common wall parts. The present disclosure is not limited to the above, but may vary freely within the scope of the appended claims. For example, the electric motor4is powered by a battery40. Such a battery is preferably rechargeable. According to some aspects, drill tool1comprises a fan39for guiding cooling air towards the motor unit2, wherein the cooling air is arranged to be guided to at least one side of the motor unit housing7, said side being different from the side of the motor unit comprising the wall part18, such that the motor unit2is directly cooled by a liquid, such as lubricating oil or grease, on one external side and by cooling air on at least one other external side. This provides for an efficient motor unit cooling by means of both air. For example, the cooling fan39is driven by the electric motor4and located on a side of the motor unit2opposite the side of the motor unit2engaging the gear unit cavity11. InFIG.1, arrows A1, A2(not all arrows are indicated) illustrate cooling air flow. Cooling air is led past the motor4, along sides of the motor4and parallel to the first longitudinal axis6, in particular past cooling flanges50comprised in the motor housing7, and past the battery40. The cooling air is guided by means of channels in the rear housing part32. In this example, the motor unit2is closed, i.e. no cooling air flows into the motor housing7, and heat generated by means of the motor4is mainly dissipated by means of the cooling flanges50. The gear unit3is furthermore adapted to conduct heat away from the motor unit2, where this heat transfer is enhanced by means of the fact that the motor unit housing7comprises the only wall part that separates the gear unit cavity11and the electric motor4. The term bearing arrangement can comprise any type of bearing, for example a ball bearing or a needle bearing. In the examples above, the housing end part9comprises the circumferentially running sealing flange21that extends from the wall part17towards and into the gear unit cavity11. According to some aspects, it is conceivable that, instead, the gear unit housing18comprises the circumferentially running sealing flange that extends into the housing end part9. | 14,486 |
11858053 | DETAILED DESCRIPTION FIG.1shows a portion of a cutting tool10according to the invention in a perspective view. The cutting tool10is suitable for the rotational machining of workpieces made of metal. More specifically, the cutting tool10is a twist drill. The cutting tool10has a cutting tip12with two main cutting edges14, which in particular extend parallel to one another. The cutting tool10also has a chisel edge16, which connects the main cutting edges14. When machining a workpiece, the main cutting edges14take over the actual drilling process and cut the material of a machined workpiece. The chisel edge16has a scraping effect and increases the required working pressure on the cutting tool10. The cutting tool10also comprises two flutes18for evacuating metal chips away from the cutting tip12. The cutting tool10further comprises two guide bevels20. The guide bevels20are used to guide the cutting tool10when machining a workpiece in a produced bore. The guide bevels20in particular serve to improve a concentricity of the cutting tool10. In addition, the cutting tool10comprises two cooling channels22, to transport coolant to the cutting tip12or to the main cutting edge14. Adjacent to the main cutting edge14, the cutting tool10has a free surface24, which is also referred to as the main free surface. There is also a flank face26, which adjoins the main cutting edge14radially to the outside and can be regarded as a secondary free surface. The main cutting edge14thereby merges into an edge28of the flank face26, in particular into an edge28which, viewed in the direction of rotation of the cutting tool10, is located in the front. This edge28can be curved, in particular curved convexly. In addition to the main cutting edge14, the guide bevel20and a back-milling30extend into the flank face26as well. As can be seen inFIG.1, the flank face26is at least approximately L-shaped. Starting from the main cutting edge14, a flank angle of the flank face26increases in a radially outward direction. More specifically, the flank angle increases along the edge28. In other words, the flank angle26increases in the direction toward a cutting corner32. The cutting tool10consequently has more clearance when machining a workpiece, which reduces the wear on the cutting tool10and extends the service life of the cutting tool10. The flank angle in particular increases continuously. FIG.2additionally shows the cutting tool10ofFIG.1in a lateral view. The alignment of the flank face26is explained in more detail with the aid ofFIGS.3and4. FIG.3shows a partial section through the cutting tool10along the Line A-A ofFIG.2. The section A-A extends through an end point34of the edge28, which is closest to the cutting tip12. FIG.4shows a partial section through the cutting tool10along the Line B-B ofFIG.2. Section B-B extends through the flank face26below the edge28. A comparison ofFIGS.3and4shows that, starting from an end point34of the edge28, the flank angle increases from a value α1to a value α2. The flank angle increases at least 2°, for example, in particular at least 4°, for example from 8° to 12°. The sectional plane in which the flank angle is measured is perpendicular or approximately perpendicular to the longitudinal axis of the cutting tool10. The flank angle is measured in the sectional plane relative to a perpendicular that extends perpendicular to a surface of the flute18at the transition from the flute18to the flank face26or the guide bevel20. FIG.5additionally shows a further partial view of the cutting tool in the area of the flank face26. This view illustrates the increase of the flank angle from a value α1 to a value α2. Since the flank face26slopes away radially outward, the flank angle does not only increase when viewed in radial direction, but also when viewed in axial direction. A corner radius, which extends between the cutting corner32and the end point34, is preferably not tangent to the periphery and to the free surface24. FIGS.6to8illustrate the effective flank angle, which is measured in a section perpendicular to the main cutting edge14. FIG.6shows a partial view of the cutting tool10in the area of the main cutting edge14. FIGS.7and8respectively show a section perpendicular to the main cutting edge14along the Line C-C or D-D inFIG.6. The flank angle can also be measured in the section perpendicular to the main cutting edge14, whereby, here too, the flank angle increases along the main cutting edge14from radially inside to radially outside, in particular in the direction toward the cutting corner32. The angle β1, which is measured in the section along Line C-C, is in particular greater than the angle β2, which is measured in the section along Line D-D. As can be seen from the previous description, there are various ways of measuring the flank angle. In any case, the flank angle increases from radially inside to radially outside. | 4,929 |
11858054 | DETAILED DESCRIPTION The combination tool3illustrated inFIGS.4-6has a clamping end11, by means of which the combination tool can be clamped in a chuck of a tool spindle2, wherein the tool spindle2can be rotationally driven by an electric motor. The electric motor is controlled by a control unit. The control unit also controls another electric motor for driving the workpiece spindle5. The workpiece spindle5features a chuck10, in which a workpiece gear1to be machined is clamped. The control unit is designed in such a way that the tool spindle2and the workpiece spindle5are driven synchronously. The combination tool3features a skiving wheel4, by means of which the blank in the form of a workpiece gear can be provided with an internal gearing6in a skiving process as described in DE 10 2008 037 514 A1. To this end, the tool spindle2and the workpiece spindle5are driven synchronously in such a way that the cutting teeth of the skiving wheel4penetrate into the tooth gaps of the gearing6being produced. In this case, the axis of the tool spindle2is aligned relative to the axis of the workpiece spindle5at an axial intersection angle α. In this context,FIGS.1and2show a first machining step, in which the advance takes place in the axial direction of the workpiece spindle5such that a spur gearing is produced. A relative rotation is superimposed on the advance motion when a helical gearing is produced. Externally geared workpiece gears1can also be produced analogously. The cutting teeth of the skiving wheel4point away from the clamping end11in the direction toward the free end of the combination tool3, which is formed by a pin12. The diameter of the pin12is smaller than the diameter of the skiving wheel4. The pin12is rigidly connected to the skiving wheel4and carries multiple fly cutters8that respectively feature a cutting edge9. During a rotation of the combination tool3about its rotational axis, the cutting edges9revolve about the axis of the combination tool3illustrated in the figure along an envelope. The envelope, within which the cutting edges9revolve, has a smaller diameter than the cutting teeth of the skiving wheel4. In the exemplary embodiment, the tooth machining tool7arranged on the free end of the combination tool3is a tool for respectively producing grooves or undercuts. To this end, the tooth flank machining tool7illustrated inFIG.3is moved into a machining position. In this case, the axis of the workpiece spindle5extends parallel to the axis of the tool spindle2. The second machining step illustrated inFIG.3is carried out after the first machining step illustrated inFIGS.1and2, but the workpiece gear1is in the meantime not removed from the chuck and the combination tool3is in the meantime not removed from the tool spindle2. The combination tool3and the workpiece gear1remain in their respective clamping positions. In the machining step illustrated inFIG.3, the tool spindle2and the workpiece spindle5are likewise driven synchronously, but with a different speed ratio, such that grooves or undercuts are machined into the tooth flanks of the gearing produced in the first machining step. In this case, the advance takes place in the radial direction of the workpiece spindle5. In an exemplary embodiment that is illustrated inFIG.7, the tooth flank machining tool may consist of a scarping tool for sloping the end faces of the teeth, which were previously produced in the first step. The preceding explanations serve for elucidating all inventions that are included in this application and respectively enhance the prior art independently with at least the following combinations of characteristics, namely: A method, which is characterized in that the tooth machining tool7and the skiving wheel4are rigidly connected to one another and form a combination tool3, and in that the combination tool3remains connected to the tool spindle2and the workpiece gear1remains connected to the workpiece spindle5between the two steps. A method, which is characterized in that merely the position of the tool spindle2relative to the workpiece spindle5and the speed ratio of the two spindles2,5are changed between the two steps. A method, which is characterized in that the tooth machining tool7is a scarping tool, an undercutting tool, a grooving tool or a universal milling or boring tool (FIG.7). A method, which is characterized in that the tooth machining tool7is a fly cutter with one or more cutting edges, which revolve along a cutting envelope. A combination tool, which is characterized in that a skiving wheel4is rigidly connected to a tooth machining tool7. A combination tool, which is characterized in that the tooth machining tool7carries a fly cutter8with at least one cutting edge9. A combination tool, which is characterized in that the skiving wheel4is arranged between the tooth machining tool7and a clamping end11of the combination tool3. A combination tool, which is characterized in that the tooth machining tool7is assigned to the free end of the combination tool3, which lies opposite of the clamping end11. All disclosed characteristics are essential to the invention (individually, but also in combination with one another). The disclosure content of the associated/attached priority documents (copy of the priority application) is hereby fully incorporated into the disclosure of this application, namely also for the purpose of integrating characteristics of these documents into claims of the present application. The characteristic features of the dependent claims characterize independent inventive enhancements of the prior art, particularly in order to submit divisional applications on the basis of these claims. | 5,703 |
11858055 | DETAILED DESCRIPTION Aspects and embodiments of the present disclosure will now be discussed with reference to the accompanying figures. Further aspects and embodiments will be apparent to those skilled in the art. FIG.2schematically shows a cutting electrode head50for an electrical discharge machining (EDM) device. The cutting electrode head50comprises a housing52. The housing52comprises an cutting surface74arranged to oppose a workpiece in use. A recess72is formed in the cutting surface74. A cutting electrode54is supported in the housing52and arranged to move along an electrode axis C within the recess72, in the directions indicated by double-headed arrow D, i.e. up or down the page inFIG.2. The cutting electrode54is movable between a retracted position and an extended, cutting position. The cutting electrode54is shown in its retracted position inFIG.2. The cutting electrode54has a contact surface64at a proximal end for contacting an actuator, as will be described below, and a tip62at an opposing distal end. The cutting electrode head50further comprises an actuator assembly56. The actuator assembly56comprises a non-movable part, comprising an electrically insulating sleeve58attached to the housing52. The sleeve58may comprise a plastics material, for example. The actuator assembly further comprises an electrically-conductive actuator. In this example the actuator comprises a hollow copper tube60supported within the non-movable part58, and arranged to slide relative to the non-movable part (and hence, relative to the housing52) along a movement axis E, in the directions indicated by double-headed arrow F, i.e. left or right along the page inFIG.2. In the example shown inFIG.2, the movement axis E is disposed at 90° to the electrode axis C. However, in other examples different angles may be used, e.g. 80°, 75°, 60°, 45°, etc. The actuator of the actuator assembly56further comprises a profiled engagement portion66attached to the hollow copper tube60. In this example, the profiled engagement portion66comprises an electrically conductive material and is integrally formed with the hollow copper tube60. However, in other examples, the profiled engagement portion66may be supported on an end of the tube. The profiled engagement portion66comprises a cam surface68that engages the contact surface64of the cutting electrode54. The cam surface68is angled with respect to the movement axis E such that there is a linear cam arrangement defined between the cam surface68and the contact surface64. In particular, the actuator60serves as a cam, and the cam surface68engages the contact surface64of the cutting electrode54which serves as a follower. The cam surface68comprises a plurality of engagement points that sequentially decrease in position along the electrode axis C away from the tip62of the cutting electrode54. The plurality of engagement points are sequentially spaced along a length of the profiled engagement portion66in the movement axis E direction towards a distal end of the profiled engagement portion66. As the actuator (hollow copper tube60and profiled engagement portion66) of the actuator assembly56is moved relative to the housing52, the cam surface68causes the cutting electrode54to move in the directions indicated by double-headed arrow D along the electrode axis C. InFIG.2, the cutting electrode54is shown in an initial, retracted position. The cutting electrode54is resiliently biased into this retracted position by a spring70acting between the cutting electrode54and the housing or a component fixed to the housing. As the actuator of the actuator assembly56is moved relative to the housing52, the cutting electrode54is urged against the resilient bias into an extended position for cutting. FIG.3schematically shows the cutting electrode head50ofFIG.2, with the cutting electrode54in its extended position for cutting. In the extended position, the cutting electrode projects into the recess72formed in the cutting surface74of the housing52. In this position, a potential difference is applied between the cutting electrode54and a workpiece pressed flush against the cutting surface74to cause an electrical spark to be formed between the tip62of the cutting electrode54and the workpiece when a dielectric is present between the tip62and the workpiece. A rear surface76of the housing52is disposed opposite the cutting surface74. A total depth of the cutting electrode head50can be measured between the cutting surface74and the rear surface76along the electrode axis C. The total depth of the cutting electrode head50can be made less than the total depth of cutting electrode heads in the prior art, because the actuator assembly56is arranged to extend along a movement axis E disposed at an angle to the electrode axis C. The total depth is minimised by arranging the actuator assembly to extend along a movement axis E that is perpendicular to the electrode axis C, as shown inFIGS.2and3. In the example shown inFIGS.2and3, an electrical connection is formed between the cutting electrode54and the actuator at the interface between the contact surface64of the cutting electrode54and the engagement surface68of the profiled engagement portion66. A further electrical connection is formed at the attachment point between the profiled engagement portion66and the hollow copper tube60. Therefore, a potential difference can be applied between the tip62of the cutting electrode54and the workpiece by applying a voltage (e.g. via an EDM device) between the workpiece and the hollow copper tube60. In other examples, the profiled engagement portion66may be non-conducting, or may not be relied upon to form an electrical contact between the contact surface64and the hollow copper tube. In such examples, a separate wired connection may be provided between the cutting electrode54and either the profiled engagement portion66or the hollow copper tube60. In such examples, the cutting electrode54may comprise a non-conducting contact surface64. For example, the cutting electrode54may comprise an electrode element electrically coupled via a wired connection as described above, and supported by a non-conductive carriage which defines the contact surface64for engaging the engagement surface68. The cutting electrode head50further includes a dielectric circuit78to circulate a dielectric through the cutting electrode head50in use. In the example shown inFIGS.2and3the dielectric circuit78is configured to circulate deionised water through the cutting head, but it will be apparent that other dielectrics could be used in other examples. The dielectric circuit78comprises a dielectric feed tube80and a dielectric return tube82. In use, dielectric is supplied within the hollow copper tube60as indicated by arrow G. The supplied dielectric enters the dielectric feed tube80through an interface84. As the hollow copper tube60is moveable, the interface84is arranged to provide a sliding connection between the dielectric feed tube80and the hollow copper tube60. In other examples, the interface84may be fixed, and the dielectric feed tube80may be flexible and/or extendable to accommodate movement of the hollow copper tube60. The supplied dielectric is discharged from the dielectric feed tube80at a dielectric supply port86in a side of the recess72. The dielectric then performs its functions as part of the EDM cutting process. Used dielectric enters the dielectric return tube82through a dielectric return port88in a side of the recess72. The used dielectric is discharged from the dielectric return tube82into the plastic tube58of the actuator assembly56through an interface90. As the plastic tube58is a non-movable part of the actuator assembly56, the interface90does not need to accommodate movement between the dielectric return tube82and the plastic tube58. Used dielectric leaves the cutting electrode head50via the plastic tube58as indicated by arrows H. In order to provide a firm and leak-free seal between the cutting surface74of the housing52and the workpiece, an O-ring seal92is provided on the cutting surface74around an opening of the recess72. In other examples, a seal could be integrated into the cutting surface74. In contrast to prior art cutting electrode heads, the cutting electrode head50of the present disclosure may easily be positioned flush against the workpiece with cutting electrode54still in its retracted position. This has the advantage that a leak-free engagement can be established between the cutting surface74and the workpiece before dielectric is circulated through the dielectric circuit78. This prevents the leakage of dielectric from the recess72into the surrounding environment, and so the cutting electrode head50may be used in applications that were previously unsuitable for EDM cutting using prior art EDM devices (e.g. in gas turbine engines, where there may be a strict requirement that no fluid be released into the surrounding environment). FIG.4schematically shows a kit according to an embodiment of the present disclosure. The kit comprises the cutting electrode head ofFIG.2and an insert94. Like reference numerals have been retained to indicate the same components. In applications where the cutting electrode head50is to be used to remove an element such as a bolt head (e.g. from within a gas turbine engine), the insert94can be inserted into the recess72as shown. The insert94comprises a wall portion having an interior surface that defines an aperture through the insert94and an exterior surface that cooperates with and fits within an inner surface of the recess72. The aperture may be shaped to match the shape of the element (such as a bolt head) to be cut. This reduces the amount of dielectric needed to perform an EDM cutting process, by effectively reducing the interior volume defined by the recess72, and also beneficially provides a positive location of the bolt head to be cut within the cutting electrode head50. In the aerospace industry, a wide variety of fasteners are used that have various shapes and forms for the head of the fastener. Therefore, where the cutting electrode head50is to be used in aerospace applications, a kit of parts may be provided comprising the electrode cutting head50and a plurality of inserts, each of the inserts having an aperture shape that corresponds to the shape of a respective fastener head, e.g. circular, square, hex, double hex, etc. It will be apparent that similar inserts could be provided for use in any industry or for any set of fastener heads. The cutting electrode head50of the present disclosure may be readily attached to a drive train of existing EDM devices by attaching the copper tube60to the EDM device drive train using a standard connector.FIGS.5a-cschematically show the steps of a method of retrofitting a handheld EDM device in accordance with an embodiment of the disclosure. Like reference numerals fromFIGS.1to4have been retained to indicate the same components. FIG.5aschematically shows a prior art EDM device100comprising a drive train102. The drive train102is configured to move towards and away from the EDM device100along a movement axis X. A bolt12of the prior art cutting electrode head10described above with reference toFIG.1is attached to the drive train102. In this arrangement, an electrode22of the prior art cutting head10is configured to extend along an electrode axis that is coaxial with the movement axis X. InFIG.5b, the bolt12has been removed from the drive train102to remove the prior art cutting electrode head10from the EDM device100. InFIG.5cthe hollow copper tube60of the cutting electrode head50has been attached to the drive train102using a standard connector. A cutting electrode54of the cutting electrode head50extends along an electrode axis Z when the drive train102extends towards or away from the EDM device102. This simple retrofit operation will effectively alter the ‘cutting angle’ (i.e. the angle of the electrode axis Z relative to the movement axis X) of the EDM device100from 0° to the movement axis X to 90° to the movement axis X, with no further modification to the EDM device100being necessary. Dielectric that was previously provided along the central aperture through the bolt12and cutting electrode22in the prior art cutting electrode head10will instead be provided to the interior of the hollow copper tube60. It will be understood that the disclosure is not limited to the embodiments above-described and various modifications and improvements can be made without departing from the concepts described herein. Except where mutually exclusive, any of the features may be employed separately or in combination with any other features and the disclosure extends to and includes all combinations and sub-combinations of one or more features described herein. For example, while the disclosure has been described with reference to an dielectric, in some examples the dielectric could be substituted with an electrolyte fluid. In the example shown inFIGS.2and3, the profiled engagement portion66is partially wedge shaped, such that the engagement surface68comprises a plurality of engagement points that vary continuously and linearly in the electrode axis C direction as a function of an axial position on the profiled engagement portion66along the movement axis E. However, other shapes are also envisaged for the profiled engagement portion66, e.g. concave/convex curved shapes, stepped shapes etc. In the example shown inFIGS.2and3, the profiled engagement portion66is formed of a solid piece of copper that is of circular cross-sectional shape at the point at which it attaches to the hollow copper tube60, but presents a substantially planar engagement surface68. However, any suitable material and cross-sectional shape may be used in practice. In some examples, the profiled engagement portion66may be hollow. In the example shown inFIGS.2and3, the cutting electrode54is moved from its retracted position to its extended position by movement of the movable part of the actuator assembly56into the cutting electrode head50. However, by appropriate shaping of the profiled engagement portion66, the cutting electrode54could alternatively be moved from its retracted position to its extended position by movement out the movable part of the actuator assembly56out of the cutting electrode head50, e.g. using a reversed wedge shape. | 14,397 |
11858056 | DETAILED DESCRIPTION OF THE INVENTION Hereinafter, a laser processing apparatus3according to an embodiment of the present invention will be described with reference to the drawings. FIG.1is a diagram showing a configuration of a laser processing system1. The laser processing system1includes a leveler device2that removes waviness of a workpiece W which is a plate material fed from a roll-shaped coil material C and linearly straightens the workpiece W, and a laser processing apparatus3for cutting the workpiece W linearly straightened by the leveler device2with a laser beam. The workpiece W is, for example, a plate material made of an aluminum alloy or a steel plate; however, the present invention is not intended to be limited thereto. The leveler device2includes a plurality of upper rollers21provided on the upper side in the vertical direction with respect to the workpiece W to be fed from the coil material C (in the example ofFIG.1, three pieces), and a plurality of lower rollers22provided across the workpiece W with respect to these upper rollers21(in the example ofFIG.1, four pieces). The rotation axes of the upper rollers21and the rotation axes of the lower rollers22are provided parallel to one another. These lower rollers22and upper rollers21are provided alternately along the feeding direction of the workpiece W. The leveler device2extends the workpiece W fed from the coil material C to be flat by the plurality of upper rollers21and the plurality of lower rollers22, thereby removing the waviness of the plate material and linearly straightening the workpiece W. The workpiece W straightened linearly by the leveler device2is fed to the laser processing apparatus3. FIG.2is a perspective view showing a schematic configuration of a laser processing apparatus3. The laser processing apparatus3includes a conveying device4for conveying the workpiece W along a conveying direction Fy, a laser head H for generating a laser beam and irradiating the workpiece W with the laser beam, a head driving mechanism5for moving the laser head H above the workpiece W fed along the conveying direction Fy, and a dust collector6for collecting a spatter caused by irradiating the workpiece W with the laser beam. The conveying device4is a belt conveyor, and includes a plurality of belt rollers41,42,43, and44which are rotatable about an axis parallel to a width direction Fx orthogonal to the conveying direction Fy (only four rollers are illustrated inFIG.2), an endless strip-shaped belt45stretched over these belt rollers41to44, and a roller driving device (not shown) for feeding the belt45to the downstream side along the conveying direction Fy by rotating any of the plurality of belt rollers41to44(for example, the first belt roller41). The first to fourth belt rollers41to44are provided in this order from the upstream side to the downstream side along the conveying direction Fy. Between the second belt roller42and the third belt roller43, a dust collecting box60to be described later is provided. Furthermore, the belt45is stretched over the first to fourth belt rollers41to44so as to avoid the dust collecting box60. Furthermore, the second belt roller42and the third belt roller43are slidable to the downstream side or to the upstream side along the conveying direction Fy together with the dust collecting box60by a box driving mechanism to be described later. The head driving mechanism5includes an X-axis rail51extending along the width direction Fx above the belt45, and a Y-axis rail52extending along the conveying direction Fy at the side portion of the belt45. The X-axis rail51slidably supports the laser head H along its extending direction (i.e., the width direction Fx). The Y-axis rail52slidably supports the X-axis rail51along its extending direction (i.e., the conveying direction Fy). This allows the head driving mechanism5to move the laser head H along the conveying direction Fy and the width direction Fx above the workpiece W conveyed by the conveying device4. The dust collector6includes a box-shaped dust collecting box60extending along the width direction Fx, and a box driving mechanism (not shown) for moving the dust collecting box60along the conveying direction Fy. The dust collecting box60is provided between the second belt roller42and the third belt roller43below the workpiece W. A rectangular opening61extending along the width direction Fx in a plan view is provided above the dust collecting box60. The spatter caused by irradiating the workpiece W with a laser beam from the laser head H is collected in the dust collecting box60through the opening61. The spatter collected in the dust collecting box60is appropriately discharged from a discharge unit63provided on a side cover62. The box driving mechanism moves the dust collecting box60, the second belt roller42, and the third belt roller43to follow the movement of the laser head H along the conveying direction Fy, such that the opening61of the dust collecting box60is disposed directly below the laser head H. FIG.3is a plan view of the dust collecting box60from the workpiece W side. As shown inFIG.3, in a plan view, the opening61of the dust collecting box60has a rectangular shape, and includes an upstream-side opening edge64extending along the width direction Fx, and a downstream-side opening edge65extending along the width direction Fx on the downstream side of the upstream-side opening edge64in the conveying direction Fy. The upstream-side opening edge64includes a plurality of disk-shaped non-contact support pads7(in the example ofFIG.3, seven pieces) in a plan view, the plurality of support rollers pairs8(in the example ofFIG.3, six sets) made by a pair of an outer support roller81and an inner support roller82, and a rectangular upstream cover66extending along the width direction Fx in a plan view. In the upstream-side opening edge64, one non-contact support pad7and the pair of the support rollers8are provided in rows and alternately along the width direction Fx. It should be noted thatFIG.3shows a case in which one non-contact support pad7and the pair of the support rollers8are provided alternately along the width direction Fx in the upstream-side opening edge64; however, the present invention is not intended to be limited thereto. Two or more of the non-contact support pads7and two or more sets of the support roller pairs8may be provided alternately along the width direction Fx in the upstream side opening edge64. The downstream-side opening edge65includes a plurality of disk-shaped non-contact support pads7(in the example ofFIG.3, seven pieces) in a plan view, a plurality of the pairs of the support rollers8(in the example ofFIG.3, six sets), and a rectangular downstream cover67extending along the width direction Fx in a plan view. In the downstream-side opening edge65, one non-contact support pad7and a pair of the support rollers8are provided in rows and alternately along the width direction Fx. It should be noted thatFIG.3shows a case in which one non-contact support pad7and the pair of the support rollers8are provided alternately along the width direction Fx in the downstream-side opening edge65; however, the present invention is not intended to be limited thereto. Two or more of the non-contact support pads7and two or more sets of the support rollers8may be provided alternately along the width direction Fx in the downstream-side opening edge65. FIG.4is a cross-sectional view taken along a line IV-IV intersecting the pair of the support rollers8inFIG.3. The dust collecting box60is substantially U-shaped in cross-sectional view. At the upstream-side opening edge64of the dust collecting box60, the outer support roller81and the inner support roller82that are each rotatable about the axis parallel to the width direction Fx (seeFIG.3) are provided in parallel in this order along the conveying direction Fy from the upstream side to the downstream side. Furthermore, at the downstream-side opening edge65of the dust collecting box60, the inner support roller82and the outer support roller81that are each rotatable about the axis parallel to the width direction Fx are provided in parallel in this order along the conveying direction Fy from the upstream side to the downstream side. At the upstream cover66, a plurality of upstream-side roller windows66awhich are each a substantially rectangular opening in a plan view are provided at predetermined intervals along the width direction Fx (in the example ofFIG.3, six pieces). Furthermore, as shown inFIG.4, a portion of the outer peripheral surface of the total of six sets of the outer support rollers81and the inner support rollers82provided at the upstream-side opening edge64is exposed to the side of the workpiece W through these upstream-side roller windows66a. In other words, a portion of the outer peripheral surface of the outer support rollers81and the inner support rollers82protrudes from the upper surface of the upstream cover66to the side of the workpiece W. Therefore, the lower surface of the workpiece W conveyed along the conveying direction Fy by the conveying device4is brought into contact with the outer peripheral surfaces of these outer support rollers81and the inner support rollers82. Furthermore, as shown inFIGS.3and4, the end of the upstream side and the end of the downstream side along the conveying direction Fy of the upstream cover66are slightly bent downwards in the vertical direction, respectively. Therefore, the peripheries of the plurality of sets of the outer support rollers81and the inner support rollers82provided on the upstream side opening edge64are covered by the upstream cover66. Furthermore, as shown inFIG.4, a counter roller9which is rotatable about the axis parallel to the outer support roller61is provided between the outer support roller81of the upstream-side opening edge64and the second belt roller42. The outer peripheral surface of the counter roller9is in contact with the belt45and the outer support roller81. Therefore, a part of the power for conveying the workpiece W along the conveying direction Fy in the conveying device4as a belt conveyor is transmitted to the outer support roller81via the counter roller9. This allows the outer support roller81to rotate in synchronization with the conveying operation of the workpiece W by the conveying device4. It should be noted thatFIG.4illustrates a case in which the outer peripheral surface of the counter roller9is in contact with the belt45; however, the present invention is not intended to be limited thereto. The outer peripheral surface of the counter roller9may be in contact with the outer peripheral surface of the second belt roller42. At the downstream cover67, a plurality of downstream-side roller windows67a, which are each a substantially rectangular opening in a plan view, are provided at predetermined intervals along the width direction Fx (in the example ofFIG.3, six pieces). Furthermore, as shown inFIG.4, a portion of the outer peripheral surface of the total 6 sets of the outer support rollers81and the inner support rollers82provided at the downstream-side opening edge65is exposed to the side of the workpiece W through these downstream side roller windows67a. In other words, a portion of the outer peripheral surface of the outer support roller81and the inner support roller82protrudes from the upper surface of the downstream cover67to the side of the workpiece W. Therefore, the lower surface of the workpiece W conveyed along the conveying direction Fy by the conveying device4is brought into contact with the outer peripheral surfaces of these outer support roller81and the inner support roller82. Furthermore, as shown inFIGS.3and4, the end of the upstream side and the end of the downstream side along the conveying direction Fy of the downstream cover67are slightly bent down in the vertical direction, respectively. Therefore, the peripheries of the plurality of sets of the outer support rollers81and the inner support roller82provided at the downstream-side opening edge65are covered by the downstream cover67. Furthermore, as shown inFIG.4, the counter roller9which is rotatable about the axis parallel to the outer support roller81is provided between the outer support roller81of the downstream-side opening edge65and the third belt roller43. The outer peripheral surface of the counter roller9is in contact with the belt45and the outer support roller81. Therefore, a portion of the power for conveying the workpiece W along the conveying direction Fy in the conveying device4as a belt conveyor is transmitted to the outer support roller81via the counter roller9. This allows the outer support roller81to rotate in synchronization with the conveying operation of the workpiece W by the conveying device4. It should be noted thatFIG.4illustrates a case in which the outer peripheral surface of the counter roller9is in contact with the belt45; however, the present invention is not intended to be limited thereto. The outer peripheral surface of the counter roller9may be in contact with the outer peripheral surface of the third belt roller43. FIG.5is a cross-sectional view taken along the line V-V intersecting the non-contact support pad7inFIG.3. The disk-shaped non-contact support pad7in a plan view is respectively provided at the upstream-side opening edge64and the downstream-side opening edge65of the dust collecting box60. FIG.6Ais a perspective view of the non-contact support pad7from a side of a suction surface71.FIG.6Bis a cross-sectional view of the non-contact support pad7along the line VI-VI inFIG.6A. The non-contact support pad7has a cylindrical shape. An annular groove73in a plan view is provided at an outer peripheral edge72of the suction surface71of the non-contact support pad7. A plurality of nozzle holes74(in the example ofFIG.6A, four) are provided in the groove73. An air supply hole76to which an air pump (not shown) is connected is provided at substantially the center of the bottom surface75opposite to the suction surface71of the non-contact support pad7. Furthermore, as shown inFIG.6B, an air flow path77for communicating the air supply hole76and the plurality of nozzle holes74is provided inside the non-contact support pad7. Therefore, in the non-contact support pad7, when supplying air compressed by the air pump to the air supply hole76, the swirling flow of air extending radially outward as indicated by a broken line arrow inFIG.6Ais generated from the plurality of nozzle holes74provided in the groove73of the suction surface71. Therefore, when the workpiece W exists on the side of the suction surface71, a negative pressure is generated between the suction surface71and the workpiece W by the Bernoulli effect, and the workpiece W is sucked toward the suction surface71by the negative pressure. As described above, the non-contact support pad7utilizes the negative pressure generated between the lower surface of the workpiece W and the suction surface71when the swirling flow of air from the nozzle hole74is ejected, thereby suctioning the lower surface of the workpiece W toward the suction surface71, and supporting the workpiece W without bringing the lower surface of the workpiece W and the suction surface71into contact with each other. FIG.7is an enlarged view of the upstream-side opening edge64and the upstream cover66ofFIG.5. It should be noted that the configurations of the downstream-side opening edge65and the downstream cover67are substantially the same as inFIG.4, and thus, illustration and a detailed description thereof will be omitted. As shown inFIG.7, the peripheries of the plurality of non-contact support pads7provided at the upstream-side opening edge64are covered by the upstream cover66. Furthermore, at the upstream cover66, a plurality of upstream-side support pad windows66b(in the example ofFIG.3, seven), which are each a disk-shaped opening in a plan view, is provided at predetermined intervals along the width direction Fx. The suction surface71of the plurality of non-contact support pads7provided at the upstream-side opening edge64is visible through the upstream-side support pad window66bfrom the side of the workpiece W. The inner diameter of these upstream-side support pad windows66bis slightly smaller than the outer diameter of the non-contact support pad7. Therefore, the upstream cover66covers a portion of the outer peripheral edge72of the non-contact support pad7. As described above, the portion of the outer peripheral surface of the outer support roller81and the inner support roller82protrudes from the upper surface of the upstream cover66to the side of the workpiece W, while the suction surface71of the non-contact support pad7is buried from the upper surface of the upstream cover66. As shown inFIG.7, a gap69is provided between the outer peripheral edge72of the non-contact support pad7and the lower surface of the upstream cover66. FIG.8is a view of the lower surface of the upstream cover66seen from the side of the non-contact support pad7. As shown inFIG.8, a plurality of grooves66cextending radially about the suction surface of the non-contact support pad7are provided at the peripheral edge of the upstream-side support pad window66bof the lower surface of the upstream cover66. Next, a description will be given of a procedure for cutting the workpiece W by the laser head H while removing the waviness of the workpiece W in the laser processing apparatus3as described above. First, when supplying compressed air to the air supply hole76of the non-contact support pad7, the swirling flow of air extending radially outward from the nozzle hole74provided in the suction surface71is generated. As shown schematically by a broken line arrow inFIG.7, the swirling flow of air flows into the gap69(refer toFIG.7) provided between the lower surface of the workpiece W and the upper surface of the upstream cover66(or the downstream cover67), and between the outer peripheral edge72of the non-contact support pad7and the upstream cover66(or the downstream cover67), a result of which the negative pressure is generated between the suction surface71and the lower surface of the workpiece W. Furthermore, when the negative pressure is generated between the suction surface71and the lower surface of the workpiece W, the lower surface of the workpiece W is sucked toward the suction surface71, following which the lower surface of the workpiece W is pressed against the outer peripheral surfaces of the outer support roller81and the inner support roller82, a result of which the waviness of the workpiece W is removed. Therefore, with the laser processing apparatus3, by irradiating a laser beam from the laser head H while removing the waviness of the workpiece W using the non-contact support pad7as described above, it is possible to cut the workpiece W with high accuracy. The laser processing apparatus3according to the present embodiment has the following effects. (1) The laser processing apparatus3includes: the conveying device4that conveys the workpiece W; the head driving mechanism5that moves the laser head H above the workpiece W; the dust collecting box60that moves below the workpiece W and follows the laser head H such that the dust collecting box60is disposed directly below the laser head H, and the outer support roller81and the inner support roller82that are provided at the opening61of the dust collecting box60and is rotatable around an axis parallel to the width direction Fx. With such a configuration, when moving the dust collecting box60along the conveying direction Fy, the support rollers81and82support the workpiece W while rolling on the lower surface of the workpiece W. Therefore, it is possible to prevent the damage on the lower surface of the workpiece W. Furthermore, the laser processing apparatus3further includes the counter roller9that rotates the outer support roller81in synchronization with a conveying operation of the workpiece W by the conveying device4. With such a configuration, even when reversing the moving direction of the dust collecting box60while conveying the workpiece W along the conveying direction Fy by the conveying device4, the outer support roller81no longer keeps rolling due to inertia in the original moving direction. Therefore, it is possible to prevent dislocation of the workpiece W in contact with the outer support roller81. With such a configuration, it is possible to perform cutting processing with a laser beam irradiated from the laser head H with good precision. (2) In the laser processing apparatus3, a belt conveyor is used as the conveying device4conveying the workpiece W, and the counter roller9transmits motive power of the belt conveyor to the outer support roller61. With such a configuration, it is possible to rotate the outer support roller81in synchronization with the conveying operation of the workpiece W without adding any actuator for driving the outer support roller81. (3) In the laser processing apparatus3, the counter roller9that is rotatable around the axis parallel to the width direction Fx, and of which an outer peripheral surface is in contact with the belt rollers41to44or the belt45and the outer support rollers81transmits the motive power of the belt conveyor to the outer support roller81. With such a configuration, it is possible to prevent the dislocation of the workpiece W when reversing the moving direction of the dust collecting box60with a simple configuration. (4) In the laser processing apparatus3, one or more of the support rollers81and82and one or more of the non-contact support pads7are provided alternately along the width direction Fx at each of the upstream-side opening edge64and the downstream-side opening edge65of the dust collecting box60. When the plurality of non-contact support pads7are provided at both the upstream-side opening edge64and the downstream-side opening edge65of the dust collecting box60as described above, the lower surface of the workpiece W is pressed against the outer peripheral surfaces of the support rollers81and82. Therefore, while the waviness of the portion of the workpiece W to which the laser beam is irradiated is removed, the dislocation of the workpiece W when reversing the moving direction of the dust collecting box60becomes significant. In this regard, in the laser processing apparatus3, the counter roller9causes the outer support roller81to rotate in synchronization with the conveying operation of the plate material by the conveying device4as described above. With such a configuration, it is possible to prevent dislocation of the workpiece W when reversing the moving direction of the dust collecting box60while removing the waviness of the workpiece W. Therefore, according to the laser processing apparatus3, it is possible to quickly move the laser head H and the dust collecting box60while conveying the workpiece W. While an embodiment of the present invention has been described above, the present invention is not intended to be limited thereto. Within the spirit of the present invention, the configuration of detailed parts may be changed as appropriate. For example, in the above embodiment, the case has been described in which the counter roller9is used as a power transmission mechanism for transmitting the power of the conveying device4as a belt conveyor to the upstream-side support roller81; however, the present invention is not limited thereto. The power transmission mechanism is not limited to the counter roller9, and may be configured by combining components such as a shaft and a belt. Furthermore, for example, in the above embodiment, the case has been described in which the counter roller9is used as a driving mechanism for rotating the upstream-side support roller81in synchronization with the conveying operation of the workpiece W by the conveying device4; however, the present invention is not limited thereto. For example, an actuator for rotating the upstream-side support roller81may be provided to drive this actuator in synchronization with the conveying operation by the conveying device4, thereby rotating the upstream-side support roller81in synchronization with the conveying operation of the workpiece W by the conveying device4. | 24,285 |
11858057 | DESCRIPTION OF SPECIFIC EMBODIMENTS OF THE INVENTION With reference to the mentionedFIGS.1,2, the electronic welding machine, which is particularly useful for carrying out repairs on metal vehicle bodywork, as well as for extracting and flattening dents in sheet metal, comprises a machine unit10with a handle12near which at least one button13is positioned to activate the machine. Inside the machine unit10, which includes the handle12, there is a rechargeable battery11, for example a lithium-polymer accumulator, which allows the machine to be powered without the need to use the mains power supply; the rechargeable battery11can also be of the extractable type. The machine unit10comprises:at least one first rod14, constrained, in a sliding fashion (according to the direction of the arrows F inFIG.2), with one end and by means of a first elastic element19, to a terminal15of the machine unit10, which has, at the opposite free end, a ground electrode or tip16that comes into contact with a metal portion or sheet metal to create the electrical circuit,and at least one second rod17, which is also constrained in a sliding fashion (according to the direction of the arrows F inFIG.2), with one end and by means of a second elastic element19, to the terminal15of the machine unit10, which has, at the opposite free end, a welding electrode or tip18which can be replaced if necessary in favour of fixing the repair accessories (eyelets, hooks, etc.). The elastic elements19are compression loaded and are adapted to counteract the sliding of the rods14,17towards the inside of the machine unit10. The ground electrode16is preferably made of copper, while the welding electrode18preferably comprises a tip made of copper, iron or a slot holder accessory. The ground electrodes or tips16and welding electrodes or tips18are constrained to the relative rods14and17in a removable or permanent fashion. The ground rods14and welding rods17are both directly connected to a microprocessor electronic circuit20, which in turn is directly connected to the rechargeable battery11of the machine for its power supply. Moreover, the microprocessor electronic circuit20is directly connected to an electronic device21for controlling the welding power and energy; the electronic control device21is associated with a digital panel22, installed on board the machine and available to a user to select the amount of energy and/or power, the duration of welding and the thickness of the sheet metal to be treated. The ground rods14and welding rods17are partly housed in corresponding housings or guides of the terminal15and are arranged parallel to each other and facing each other at a certain distance. Furthermore, as mentioned, they slide elastically and axially in their respective housings, compared to the machine unit10, as well as independently of each other. In order to insulate the ground rod14from the machine unit10, the aforementioned ground rod14slides in an insulating pipe with high thermal resistance, inserted in the relevant housing or guide, and in addition, the ground electrode or tip16is housed inside an insulating flange. The welding rod17has preferably a polygonal section and is inserted in a guide bush, with a housing having shape corresponding to the section of the rod17, with anti-rotation function to carry out the traction operations and at the end of the cycle, detach the welding tip18from the metal portion on which it is working. According to the present invention, it is also possible to directly exploit the blowback mass of the machine unit10, which also includes the weight of the rechargeable batteries11on board the machine, by elastically acting on the rods14,17in order to shape the sheet metal and/or carry out the necessary traction operations. In particular, according to the present invention, the traction operation can be carried out directly with the tip18, which, thanks to the use of the springs19, constitutes the traction element of the sheet metal during the repair. When the springs19are loaded, they provide the necessary push to increase the effect of the blowback mass represented by the entire tool complete with rechargeable battery11. Finally, the absence of long power supply cables is a considerable advantage from the point of view of energy efficiency, compared to similar products of the traditional type, since the current of 1,000 to 2,000 amperes flows from the battery11through the control device21only on the terminals of the rods14,17, as well as on the tips16,18and on the tip of the metal portion to be melted, which is the welding resistance of the electrical circuit inFIG.2; such a short current path, without long wiring, consequently results in a truly minimal dissipation. Further innovative and advantageous features of the invention are the fact that it is possible to use only one tool (the welding gun) rather than a tack welding machine wired with an external generator (thus drastically reducing the overall dimensions and structural and functional complexity of the equipment) and to carry out up to 750 welding points and more (in any case sufficient to carry out the most common types of repairs on bodywork sheet metal) independently, by simply using the built-in rechargeable battery11and without the need to connect the machine to the mains power supply. The characteristics of the electronic resistance welding machine for sheet metal repair, which is the object of this invention, are clear from the description provided, as are its advantages. They are represented in particular by:control of the resistance tacking (welding) power;use of a self-powered microprocessor electronic circuit to control the functions of the welding machine;use of rechargeable batteries;use of cushioned rods that favour the tacking and drawing action of the sheet metal;the machine does not need a power supply;operating autonomy of up to 750 welding spots and more;drastic reduction of overall dimensions, compared to the known art;lightweight structure (less than 3 kg), compared to the known art and by virtue of the advantages achieved;energy efficiency due to the absence of long power cables. The invention as it is conceived is susceptible to numerous modifications and variants, all falling within the scope of protection of the appended claims. Moreover, all the details can be replaced by other technically-equivalent elements; in practice, the materials used, as well as the shapes and dimensions, can be varied according to the contingent requirements and the prior art. Where the constructional and technical characteristics mentioned in the following claims are followed by signs or reference numbers, the signs or reference numbers have been used only with the aim of increasing the intelligibility of the claims themselves and, consequently, they do not constitute in any way a limitation to the interpretation of each element identified, purely by way of example, by the signs or reference numerals. | 6,998 |
11858058 | The embodiments, examples and alternatives of the preceding paragraphs, the claims, or the following description and drawings, including any of their various aspects or respective individual features, may be taken independently or in any combination. Features described in connection with one embodiment are applicable to all embodiments, unless such features are incompatible. Like reference numbers and designations in the various drawings indicate like elements. DETAILED DESCRIPTION A welding station10is schematically illustrated inFIG.1. One example station10includes a load fixture12that establishes the position of workpieces14at the entrance to the welding station10. The welding station10includes a robot18, which may be enclosed by a perimeter fence16for safety. Workpiece14may be placed into the load fixture12by an operator or automation. The robot18may retrieve workpiece14from the load fixture12using robot end of arm tooling20that holds the workpiece in the desired orientation and configuration. A welding gun22is mounted to a base24and spot welds the workpiece14, for example. The welding gun station is commonly employed within robot cells for both spot and projection welding. Such robot cells employ one or more material handling robots to manipulate the workpiece(s) instead of the heavy resistance welding gun. This enables the use of smaller, more agile, and less expensive robots to automate the process. This robot cell configuration is also useful when the process involves multiple resistance welding guns that may be different sizes, configurations, or orientations. Or it may enable the robot to manipulate a workpiece between a number of stations employing different processes necessary to complete an assembly. Processes could for example include metal working, coating application, arc welding, fastener welding, assembly, and inspection. The fence16can provide isolation between the robot cell and the electrode maintenance station including a maintenance tool assembly26for removing, installing and/or dressing the welding gun electrodes. This barrier would prevent the process on one side from affecting the other. It would therefore permit operations such as manual electrode maintenance or replacing the electrode dispensers to occur without interrupting the robot cycle. A maintenance tool assembly26is mounted to the base24. Periodically, the welding gun22may be pivoted in a rotational path R to bring the welding “electrodes”, “tips” or “caps” of the welding gun24to the maintenance tool assembly26for replacement and/or dressing. While it is possible in alternative configurations to pivot the welding gun to position the electrodes for extraction or replacement, the disclosed configuration illustrated employs a simple longitudinal translation T to move the tools. This improves the repeatability, control, and sensing of the welding gun pivot operation. It keeps the welding gun stationary during the maintenance operation so there is little chance of accidental collisions or unintended motion while in the electrode maintenance position. Referring toFIGS.1-3, the maintenance tool assembly26includes a cap extractor28and cap dispenser30including first and second cap dispensers30A,30B. A cap dresser32is provided at an end of the maintenance tool assembly26opposite the cap extractor28such that the cap dispenser30is arranged therebetween. The described resistance welding gun is for resistance spot welding but aspects of the configuration could be applied to projection welding equipment used to affix components such as fasteners or spacers. Generally, a typical sequence would be to present the electrode caps to the tip dressing station on a regular basis. The frequency depends on the welding conditions but may be for example every 10, 25 or 100 welds. At that time the tip dresser would use cutters or forming tools to clean or restore the profile of the electrode cap tip so welding consistency can be maintained. After a number of these tip dressing cycles have been performed, it is necessary to replace the electrode cap with a new one. The replacement frequency may relate to the number of tip dressing cycles, a physical attribute such as electrode cap length, a welding performance indicator such as excessive or insufficient welding current, or feedback of weld discontinuities. A conventional dressing station is included for periodic light cleaning and shaping of the electrode face(s). When dressing of the electrode is no longer appropriate, an electrode extractor and electrode dispenser can be employed to replace the electrode(s). The resistance spot welding gun station is configured to facilitate the required electrode maintenance so there is minimal impact on production throughput. Electrode maintenance is frequently performed during the time the industrial robot is executing material handling (i.e., retrieving workpieces or delivering the completed weldment to the unload station) or another function such as in-line inspection. The described robotic welding cell module permits maintenance to be performed entirely manually, or with automation. The electrode maintenance tools are modular in nature so the system can be reconfigured depending on the business priorities and financial analysis. The disclosed resistance welding gun is mounted on a pivot unit assembly that enables the welding electrodes to be presented to a location away from the production area. The pivot is operated by a pneumatic cylinder that rotates the welding gun between hard position stops. The pivot could also be operated by a servo drive or other mechanical or electrical system that facilitates accurate positioning of the welding electrodes. The resistance welding electrodes can be serviced when the robot is being utilized to perform the workpiece manipulation. This reduces the possibility the robot cell throughput will be affected by the electrode maintenance operation. The number and position of maintenance tools can be established to suit the anticipated electrode maintenance frequency, production rate, or resistance welding cell configuration. The station could include no maintenance tools to start, where the pivoting mechanism is used alone to present the welding electrodes outside of the robot cell for manual maintenance or replacement. An automatic electrode cap dressing tool could be added for regular lightly cleaning and profiling of the welding face. Additional tooling stations could be added to provide the capability to reshape the welding face or to remove and replace a worn out electrode. The maintenance tools are outside of the production space, which can improve access to the electrode maintenance tools for servicing (e.g., emptying chips from the dresser or reloading cap dispenser), put the electrode maintenance tools in a location that is safer or more accessible to the personnel that are necessary to maintain them, permit a configuration that allows servicing of the electrode maintenance tools while the welding equipment is performing a production sequence, and ensure the production cell is not contaminated with errant machining chips, coolant, or electrode caps. Referring toFIG.2, the welding gun22includes first and second arms52,54carrying first and second electrode adapters40,42, respectively. An electrode cap44is mounted on each of the first and second electrode adapters40,42. The caps44may be identical or could have different sizes and shapes to suit the welding conditions. The base24is supported by a pedestal46arranged within the work area. The welding gun22is supported with respect to the base24by a pivot48that is rotated between first and second positions by a pivot cylinder50. The first and second positions may be 180° from one another. The welding gun is shown in the working position inFIG.2. The spot welding gun is moved clear of the welding area by a simple and reliable pivoting motion, that also positions the welding electrodes within reach of the integrated electrode maintenance tools. At least part of the time required for the off-line electrode maintenance process can be conducted while the robot continues to perform a material handling function. Referring toFIGS.2and3, the cap extractor28, cap dispenser30, and cap dresser32are mounted to a plate38that is carried by a platform34. The plate38is slideably mounted to the base24, which may include numerous members secured to one another. This translation stage puts the desired maintenance tool in the required position to service the electrode(s), which may include lifting the tool between a lowered and raised position to service the lower and upper electrode respectively. The maintenance tool assembly26translates along a longitudinal direction T (FIG.3) between numerous positions to place the components of the maintenance tool assembly26in the desired position with respect to the caps44. The maintenance tool assembly26may also move in a vertical direction L (FIG.3) to lift and lower the maintenance tool assembly with respect to the caps44during maintenance. Because one electrode extractor can be used to remove either electrode cap, the translation stage incorporates the vertical lift so either the upper or lower electrode cap can be aligned with the electrode extractor. A bin58collects the used, extracted caps44. FIGS.4A-4Dillustrate various positions of the maintenance tool assembly26with respect to the welding gun. Either or both of the first and second arms52,54of the welding gun52may open and close with respect to one another. In one example, one of the arms is fixed and the other arm articulates to open and close about the workpiece during welding operations. In another example, the first and second arms may both open and close about the workpiece. The maintenance tool assembly26lifts or lowers the maintenance tools with respect to the cap44and its relative position on the first and second arms52,54. InFIG.4A, one of the caps44is inserted into the cap extractor28. The cap44is rotated with respect to its electrode which breaks the cap44free from the welding gun. With the cap extractor28disengaged from the cap44(by raising or lowering the maintenance tool assembly26), the cap44may be released by the cap extractor28, dropping the cap into the bin58. Referring toFIGS.4B and4C, the electrode adapter40,42without its cap44may be inserted into one of the cap dispensers30A,30B of the cap dispenser30. The first and second electrode adapters40,42are closed about the new cap to seat the cap firmly on the electrode in an interference fit. Both the caps44can be removed from the first and second electrode adapters40,42by the cap extractor28before installing new caps using the cap dispensers30A,30B. Alternatively, the cap may be removed from one electrode adapter40,42by the cap extractor and a cap installed onto it before repeating the process for the other electrode. The new caps may be dressed by the cap dresser32, as shown inFIG.4D. In the example, the caps are dressed simultaneously by closing the first and second electrodes about an aperture of the cap dresser32. The cap dresser32may also be used to periodically dress used caps before the need to replace the caps44. A control system60is schematically shown inFIG.5. The system60includes an air source62that selectively supplies compressed air to various components via control valve66that are operated by a controller64. The air source62supplies to a cap extractor cylinder68of the cap extractor28, a maintenance tool assembly lift cylinder70, and translate cylinder72of the maintenance tool assembly26and the welding gun pivot cylinder50. Other types of actuators may be used instead of air cylinders, if desired. The first and second cap sensors74,76(also shown inFIGS.6-8) may be used to detect the presence or absence of a cap44during the maintenance procedure. One or more cap presence detectors78may be used with the first and second cap dispensers30A,30B to detect an improper orientation and fault of a cap44within the cap dispenser30(FIG.18). The motor80of the cap dresser32is operated by the controller64. Additionally, the controller64may also be used to control and monitor the welding gun22during various welding gun operations, as indicated in block82, including tracking when the welding gun is in need of tip maintenance. Referring toFIGS.6-9, the platform34is slideably supportive with respect to the base24by a slide assembly86. The translate cylinder72moves the platform34with respect to the base24and the welding gun22supported thereon between various discrete longitudinal positions (shown inFIGS.4A-4D) to align the desired components of the maintenance tool assembly26with respect to the electrodes and/or caps. The plate38is supported with respect to the platform34by guide posts88. A lift cylinder70is arranged laterally between guide posts88and vertically between the platform34and plate38. The lift cylinder70raises and lowers the maintenance tool components to their desired positions. The first and second cap sensors74,76may be used to detect the presence of a cap44subsequent to extraction by the cap extractor28and installation of a new cap by the first and second cap dispensers30A,30B. If a cap is absent when one should be installed or present when it should have been removed, a fault is indicated. The cap extractor28is illustrated in more detail inFIGS.10-12. The extractor cylinder68includes a cylinder body90housing a piston. The cylinder body is secured to a mounting plate92. A rod94is connected to the piston within the cylinder body90and extends through the mounting plate92to a clevis96. The extractor cylinder68is mounted to a housing100by spaced apart pivot pins102, which enables the extractor cylinder68to articulate with respect to the housing100during operation. The housing100may include multiple housing portions100A-100D, collectively referred to as “the housing100.” The housing100includes apertures106for receiving the end of an electrode adapter40,42with its cap44. Ends of collars108are arranged with the apertures106, and wave springs114are arranged concentrically about each collar108. A pair of spaced apart disks110have a recess that receives one side of the wave springs114. First and second arms116,118are carried by the disks110. The first arm116has a hole128that receives a pin98securing the clevis96to the first arm116. The second arm118has an end124that is received in a channel122of the first arm. The first and second arms116and118are pivotably secured with respect to one another by a spacer112that spaces the disks110with respect to one another and ensures that they rotate together with respect to the housing100. Another spacer112is received within a slot120in the second arm118. In the example, three spacers112are circumferentially spaced with respect to one another and rotationally affix the disks110to one another. A biasing spring126interconnects the first and second arms116,118to urge them toward one another, in turn, bringing complementary teeth134toward one another to engage the cap44. A stop130provided on the housing portion100A limits the travel of the second arm118during rotation via a stop pin132carried thereon. The wave springs114enable the disks110to float within the housing100better ensuring alignment with the teeth134and the cap44. That is, there is some flexibility provided by the wave springs114to enable the disk110and the associated first and second arms116,118to float both laterally and vertically. Thus, absolute precise alignment between the caps and the cap extractor28is not required for effective cap extraction. The extraction jaw mechanism floats in a plane normal to the center axis of the jaws. This allows the central axis of the extractor jaws to move, if required, to be coincident with the axis of the electrode taper. This prevents a binding force between the taper surfaces that could otherwise be created during rotation when the two axis are not aligned. Increased surface friction due to binding may inhibit axial movement necessary to separate the electrode from the adapter. Such position variation may arise from inaccuracy of the positioner or by bending or deflection of the welding gun or its components. When the electrode is positioned by automation or an industrial robot, the electrode could be misaligned with the cap electrode extractor due to position teaching inaccuracy, positioning repeatability deviation, or deflection within the mechanical system. The jaw mechanism floats in the direction of the taper axis. This permits the strain in the electrode and adapter tapers to aid in releasing the taper engagement. The intimate engagement of the tapers is maintained by stress on the material, which causes one or both of the components to deform. A female electrode cap taper for example will expand (stretch) slightly as its taper is engaged over the male taper of the electrode cap adapter. This strain applies a force on the two taper surfaces to lock them together. On a common ¾″ (19 mm) diameter female electrode, the distance between initial engagement and locking of the tapers may be 1/16″ (1.5 mm). Mounting of the extractor jaw mechanism between the wave springs114provides the electrode cap the freedom to move in the direction of the taper axis. By permitting this movement, when the electrode cap is rotated to break the static friction between taper surfaces, the strain on the taper helps to urge the tapers apart. This ensures the electrode is consistently released from the adapter. Since the cap extractor28is accessible from either side it is not necessary to change the welding gun orientation for a single tool to extract either the upper or lower electrode. First, second, and third positions of the cap extractor are respectively illustrated inFIGS.13A-13C. For better visualization, inFIG.13A, the arcs A1and A2illustrate the path along which the pin98and stop pin132move during cap extraction. The spacer112interconnecting first and second arms116,118move along a circular path C with the rotation of the disks110. The “+” along these paths indicate the elements position in the first, second and third positions. Referring toFIG.13A, the extractor cylinder68is shown with the piston in a fully retracted position such that the first and second arm116,118are maximally spaced with respect to one another to better facilitate accommodating the cap into the cap extractor. In this position, the stop pin132engages the stop130. Once the cap44has been positioned between the teeth134, the extractor cylinder68begins to close from the first position shown inFIG.13Ato the second position shown inFIG.13B, which more tightly clamps the teeth134about the cap44. In this second position, the stop pin132is spaced from the stop130. Referring toFIG.13C, the extractor cylinder68is actuated to a fully extended position in which the first and second arms116,118are further closed about the cap, finally releasing the cap44from its electrode adapter40,42. In this third position, the second arm118may engage one of the spacers112, which was located between the first and second arms. Subsequently, the extractor cylinder68is retracted, which returns the first and second arms116,118to the first position shown inFIG.13A. In this position, once the electrode adapter40,42has been moved with respect to the cap44, the cap will simply drop into the bin58beneath. The technique employed for extracting the electrode caps is simply a twisting motion to break the friction of the engaged tapers. When the cylinder advances, the serrated jaws of the extractor bite into the electrode cap to impart the rotation. The configuration of the jaw mechanism enables it to center to the electrode adapter taper, thereby ensuring the applied force is consistent even pressure on the serrations. Prior to the cylinder reaching the limit of rod extension, the cap will have been freed. When the cylinder retracts and the jaws reach the hard stops they will separate and allow the electrode cap to fall into the container provided. If cooling water is released when the cap is removed, it will also be captured by the bin58. The first and second cap dispensers30A,30B are illustrated in more detail inFIG.14. In the example, the first cap dispenser30A is in identical construction with respect to the second cap dispenser, only their orientation is different. Thus, the second cap dispenser30B will be explained in further detail in connection withFIGS.15A-17. The process of installing a new cap is as simple as closing the welding gun onto the electrode cap. After the friction fit tapers engage, opening the welding gun easily overcomes the sliding friction between electrode caps to remove the electrode cap from the dispenser. As soon as the space occupied by the electrode cap is clear another electrode cap will move towards the outlet. The cap dispenser is configured for off-line refilling and quick exchange. The dispenser can be made to a standard length or the length necessary to accommodate the number of electrode caps required between the standard service intervals. The dispenser is easily removed from its holder by pulling the spring-loaded catch137. The dispenser is easily serviced in a similar fashion by pulling the spring-loaded catch137. There is no cumbersome on-line dispenser loading or replacement process required so dispensers can be loaded off line. This also has the added advantage of easily enabling different electrode caps to be installed in the dispenser when required by a different workpiece or welding condition. A sleeve136slideably receives a drawer138that houses the caps44. The drawer138includes a ramp140that selectively cooperates with a pin144carried by an end cap142mounted to the sleeve. The pin144may be spring loaded to bias the pin144inward to engage the ramp140when the drawer is fully inserted and seated with respect to the sleeve136. Alternatively, the pin144may be threadingly moved into and out of an engagement with respect to the ramp140. The dispenser is easy to load since the tray can be fully opened or partially opened for filling, depending on which method is easiest for a particular size and geometry of welding electrode. Electrode caps are urged towards the outlet of the dispenser by a follower, which is pulled by a constant force spring. A spring assembly146is mounted to the sleeve136to urge a slide block156located within the drawer138in a direction that forces the caps44to a position beneath an aperture162in a plate160. In an example, the spring assembly146includes a spring housing148having first and second housing portions148A,148B. The spring housing148receives a drum150rotatable about a roller pin152that secures the housing portions148A,148B to one another. A clock spring154is affixed to the drum150at one end and to the slide block156at an opposite end by a fastener158. The clock spring154wraps about the drum150in a normally biased position. Thus, the slide block156is pulled leftward as illustrated inFIG.17to push the stack of caps44toward the aperture162. The presence of the cap at the outlet is verified by a sensor, which confirms the straight side of the electrode cap skirt is tight against the stop. A through beam light sensor is provided to ensure there is a properly oriented electrode cap at the discharge point. A fiber optic through-beam light sensor is referenced, but other sensors can be employed. The sensor has the secondary function of verifying there is an electrode cap in the dispenser since the follower is configured so it will not operate or activate the electrode cap detection sensor. Referring toFIG.18, the drawer138includes a hole164that may cooperate with the cap presence detector78, which may be a laser. If a cap44is oriented improperly such that the hole164is obstructed, a fault condition may be indicated requiring the cap dispenser to be serviced. The disclosed arrangement uses a simple mechanical system to pivot the welding gun to move the electrodes out of the work area of the welding cell. Stand-alone electrode maintenance tools and simple translation stages achieve a total solution that is easy to expand, more economical, and easier to maintain. Because the maintenance tools do not have a footprint within the robot envelope, they do not affect or require any of the reach of the robot. The maintenance tools are not exposed to the hazards and contamination found within the welding cell. The robot cell is not exposed to the hazards and contamination that may occur at the maintenance tools. The maintenance tools may be made accessible for service while the robot is cycling. The maintenance tools are moved to defined positions so there is no requirement for position variation compensation schemes, such as spring centered slides, which can contribute to erratic machining results in the prior art due to chattering. Movement in the plane perpendicular to the taper axis minimizes the possibility a side force could be applied to the taper surfaces, which could inhibit the taper separation. Movement in the direction of the taper axis ensures the tapers can separate without the need for external force or movement. The design includes a simple round orifice that is less sensitive to electrode geometry variation such as the diameter or surface condition of the electrode cap. It also does not rely on the accessible surface of the taper or of electrode. The design is much simpler than others which employ shafts, gears, cams, and motors. This reduces the cost and improves the operational reliability. The linear dispensers can be made to accommodate a variety of electrode cap sizes. Spring loaded pins are employed to latch the linear dispenser into its holder and to retain the drawer in the closed position. Therefore, the functions of filling and replacing the dispenser may be easy accomplished independently. Filling may be performed off line if desired. During filling, the dispenser can be held at an orientation that best exploits gravity to aid the process. The length of the exposed opening during loading can also be coordinated to minimize the opportunity for electrodes to tip over, if their geometry predisposes them to do so. The action of closing of the dispenser, applies spring pressure that will be used to urge the cap electrodes towards the opening. Replacement of the dispenser can be performed to minimize interaction time or for convenience. It can also be done to change the electrode geometry if a changeover is performed to enable the robot cell to produce different weldments. It should also be understood that although a particular component arrangement is disclosed in the illustrated embodiment, other arrangements will benefit herefrom. Although particular step sequences are shown, described, and claimed, it should be understood that steps may be performed in any order, separated or combined unless otherwise indicated and will still benefit from the present invention. Although the different examples have specific components shown in the illustrations, embodiments of this invention are not limited to those particular combinations. It is possible to use some of the components or features from one of the examples in combination with features or components from another one of the examples. Although an example embodiment has been disclosed, a worker of ordinary skill in this art would recognize that certain modifications would come within the scope of the claims. For that reason, the following claims should be studied to determine their true scope and content. | 27,639 |
11858059 | The drawings are not intended to be limiting in any way, and it is contemplated that various embodiments of the present disclosure may be carried out in a variety of other ways, including those not necessarily depicted in the drawings. The accompanying drawings incorporated in and forming a part of the specification illustrate several aspects of the present disclosure, and together with the descriptions serve to explain the principles and concepts of the present disclosure; it being understood, however, that the present disclosure is not limited to the precise arrangements shown. DETAILED DESCRIPTION The following description and embodiments of the present disclosure should not be used to limit the scope of the present disclosure. Other examples, features, aspects, embodiments, and advantages of the present disclosure will become apparent to those skilled in the art from the following description. As will be realized, the present disclosure may contemplate alternate embodiments than those exemplary embodiments specifically discussed herein without departing from the scope of the present disclosure. Accordingly, the drawings and descriptions should be regarded as illustrative in nature and not restrictive. Because it may be desirable to maintain clean weld wheel surfaces, a weld wheel cleaning system and method is provided. Such a weld wheel cleaning system may include abrasive wheel cleaners that rotate relative to each weld wheel with a force sufficient to clean the wheels. The debris from the cleaning operation may be removed by a vacuum system. While the weld wheel cleaning system and method is discussed in more detail below with respect to a continuous steel coating line, the weld wheel cleaning system and method can be used with any weld wheel for any resistive welding process. FIG.1shows an example of a continuous steel coating line (10) comprising an uncoiler (11), a welder (12), an entry accumulator (13), a furnace (14), a pot (15), a cooling tower (16), an exit accumulator (17), and a coiler (18). In the illustrated embodiment, a cold rolled coil of steel is unrolled by the uncoiler (11) at the entry of the coating line (10). The steel then threads through a welder (12), as best seen inFIG.2, where a tail end (2a) of one coil (2) is joined to a head end (4a) of another coil (4) to form a steel strip (6) to maintain the continuous operation of the coating line (10). Referring back toFIG.1, following the welder (12), the steel strip (6) can travel through an entry accumulator (13) where multiple loops of steel can be lengthened and/or shortened so that the process continues uninterrupted while the coils are joined together. The steel strip (6) may then be heated in a furnace (14) and travel into a pot (15) where it receives a coating of protective material, such as aluminum, zinc, etc. The steel strip (6) may then proceed through a cooling tower (16) to cool the coating. After cooling, the steel strip (6) is then sent through an exit accumulator (17) and then recoiled by the coiler (18) in the illustrated embodiment. Other suitable configurations for processing the steel will be apparent to one with ordinary skill in the art in view of the teachings herein. Referring toFIG.3, the welder (12) in the illustrated embodiment is an electric resistance welder comprising two pairs of weld wheels (20). While a first leading pair of weld wheels (20) is shown positioned in front of a trailing pair of weld wheels (20), any suitable number of weld wheel pairs (20) can be used. Each pair of weld wheels (20) comprises an upper weld wheel (24) and a lower weld wheel (22) aligned below the upper weld wheel (24) along a longitudinal axis A, as shown inFIGS.4and5. The weld wheels (22,24) may have a radius between about 5 and about 6 inches and a thickness of about 0.625 inches, but other suitable dimensions can be used. The weld wheels (22,24) can further have a curved working surface (25,27) along the circumference of each weld wheel (22,24), where the weld wheel (22,24) contacts the material to be welded, with a radius of about 2 inches, but other suitable dimensions can be used. The weld wheels (22,24) can be made from copper or any other suitable conductive material. As best seen inFIG.4, the lower weld wheel (22) is positioned on a lower arbor (26) such that the arbor (26) is configured to apply an upward force to the lower weld wheel (22), rotate the lower weld wheel (22), and apply a current to the lower weld wheel (22). The upper weld wheel (24) is positioned on an upper arbor (28) such that the arbor (28) is configured to apply a downward force to the upper weld wheel (24), rotate the upper weld wheel (24), and apply a current to the upper weld wheel (24). The current may be between about 16,000 and about 17,000 amps with a weld wheel force approaching about 2,000 kg, but other suitable amounts can be used. The overlapping ends of the steel strips (2a,4a) can thereby be positioned between the working surfaces (25,27) of the pair of weld wheels (20), as best seen inFIG.5, such that the steel strips (2a,4a) are compressed between the pair of weld wheels (20). In the illustrated embodiment, the lower arbor (26) rotates the lower weld wheel (22) clockwise and the upper arbor (28) rotates the upper weld wheel (24) counterclockwise to thereby translate the pair of weld wheels (20) along the steel strips (2a,4a) to form a weld, as shown inFIG.4. In other versions, the pair of weld wheels (20) may rotate in any suitable direction to translate the pair of weld wheels (20). Accordingly, heat generated from the resistivity of the steel strips (2a,4a) to the electricity and the application of force applied by the pair of weld wheels (20) along their working surfaces (25,27) generally results in coalescence at the weld joint to weld the steel strips (2a,4a) together. Temperatures at the contact interface between the weld wheels (22,24) and the steel strips (2a,4a) may exceed about 2,000° F., but other suitable temperatures can be used. Still other suitable configurations for welder (12) will be apparent to one with ordinary skill in the art in view of the teachings herein. The combination of high heat and high pressure may result in the deterioration of the weld wheels (22,24) because a layer of Fe-oxide coating, and other debris, associated with the welding process may become embedded into the working surfaces (25,27) of the weld wheels (22,24). The thickness of the oxide layer may not be uniform and may increase with each weld. For instance, an example of a weld wheel having a layer of embedded material is shown inFIGS.6-7. A cross-section of a layer of embedded material is shown inFIGS.8-9. For instance, the embedded layer in the illustrated embodiment has a thickness of about 0.0007 inches on the surface of the weld wheel and is further embedded about 0.003 inches into the weld wheel. This embedded layer comprises Fe-oxide at the surface of the weld wheel, as shown at Spectrum3inFIG.9, as well as some nodules of chromium and silicon, as shown at Spectrum1and2inFIG.9. This non-uniform layer of embedded material may thereby inhibit the contact of the working surfaces (25,27) of the weld wheels (22,24) with the steel (2a,4a) such that it may degrade the quality of subsequent welds. Therefore, it may be desirable to clean the working surfaces (25,27) of the weld wheels (22,24) with a weld wheel cleaning system (60) to remove the layer of embedded material without the need to resurface and/or change the weld wheels (22,24). Referring toFIGS.10-12, such a weld wheel cleaning system (60) is provided comprising at least one cleaner (50) and a vacuum (40). Each cleaner (50) comprises an abrasive material (52) positioned on an outer surface of the cleaner (50). The abrasive material (52) can include a wire brush or a deburring wheel with a grade sufficient to remove embedded material from the working surfaces (25,27) of the weld wheels (22,24). For instance, a Scotch-Brite EXL Deburring Wheel having a fine or medium finish made by 3M can be used. Other suitable abrasive materials (52) will be apparent to one with ordinary skill in the art in view of the teachings herein. Each cleaner (50) is then positioned on a support (56) such that the abrasive material (52) is adjacent to the working surfaces (25,27) of the weld wheels (22,24). While two cleaners (50) are shown inFIG.10positioned adjacent to each weld wheel (22,24) in a pair of weld wheels (20), any suitable number of cleaners (50) can be used. In the illustrated embodiment ofFIG.11, one cleaner (50) is shown to clean a lower trailing weld wheel of a welder (12). In some other versions, one cleaner (50) can be positioned between the weld wheels (22,24) to clean both weld wheels (22,24). Any other suitable number of cleaners (50) can be used. The support (56) in the illustrated embodiment is mounted on an arm (59) that can be pivoted to selectively position the cleaner (50) adjacent to the weld wheel (22,24). The cleaner (50) can be operated by an actuator (58), such as an air motor, an electrical motor, or any other suitable mechanical actuator. Accordingly, the cleaner (50) can rotate on the support (56) relative to the weld wheel (22,24) to clean the working surfaces (25,27) of the weld wheel (22,24). The cleaner (50) is thereby adjustable to clean weld wheels (22,24) of varying diameters. In some versions, both the cleaner (50) and the weld wheel (22,24) are rotated during the cleaning process. In some other versions, the weld wheel (22,24) is stationary while the cleaner (50) is rotated or the cleaner (50) is stationary while the weld wheel (22,24) is rotated. Additionally or alternatively, the cleaner (50) can translate or oscillate relative to the weld wheel (22,24). Still other suitable configurations for the cleaner (50) will be apparent to one with ordinary skill in the art. As shown inFIG.10, a vacuum (40) is used to remove debris generated by the cleaning process of the weld wheel cleaning system (60). In the illustrated embodiment, a vacuum tube (44) extends from the vacuum (40) such that an inlet of the vacuum tube (44) is adjacent to the area where the cleaner (50) abuts the working surface (25,27) of the weld wheel (22,24). While the illustrated embodiment shows two vacuum tubes (44) at each cleaner (50), any other suitable number of vacuum tubes (44) can be used. In some versions, this cleaning area is contained by a flexible, conforming enclosure (46). Accordingly, debris removed from the weld wheels (22,24) is suctioned through the vacuum tube (44) by the vacuum (40). Other suitable configurations for the vacuum (40) will be apparent to one with ordinary skill in the art in view of the teachings herein. The weld wheel cleaning system (60) can thereby be used to clean and/or remove the Fe-oxide layer and any other debris from welding from the working surfaces (25,27) of the weld wheels (22,24). This weld wheel cleaning system (60) can be used in line without the need to remove the weld wheels (22,24) from the welder (12), saving on downtime of the coating line (10). In some versions, the weld wheel cleaning system (60) is insulated from the ground to allow the option of cleaning while welding without shunting the weld current. In some other versions, the weld wheel cleaning system (60) is operated during the existing weld wheel resurfacing operation. As shown inFIG.10, the conditioning operation comprises weld wheels (22,24) rotating with the application of force against a non-driven reconditioning roll (30). The cleaning system (60) can be installed on a welder (12) with minimal installation modifications and positioned such that it does not impede weld wheel (22,24) changes and/or the reconditioning roll (30), and/or such that the cleaning system (60) can be easily serviced. To perform a cleaning, the cleaning system (60) can be operated to position the abrasive material (52) of a cleaner (50) adjacent to the working surface (25,27) of a weld wheel (22,24) by adjusting the arm (59) as shown inFIGS.11and12. For instance, the arm (59) may be translated and/or pivoted manually and/or automatically by an arm motor. Such an arm motor can be an air cylinder or any other suitable motor to provide sufficient force of the cleaner (50) against the weld wheel (22,24). Once the cleaner (50) of the cleaning system (60) is in the desired position, the actuator (58) of the cleaning system (60) can be started to rotate the cleaner (50) relative to the weld wheel (22,24). Accordingly, the abrasive material (52) of the cleaner (50) sufficiently cleans and/or removes the Fe-oxide layer and any other debris from welding from the working surfaces (25,27) of the weld wheels (22,24). An example of a clean weld wheel (22,24) is shown inFIG.13. During this cleaning process, the vacuum (40) can be activated to suction removed debris through the vacuum tube (44). The cleaning system (60) may thereby be activated for a selected time to sufficiently clean the weld wheels (22,24), such as less than about 1 minute, or any other suitable amount of time. Once cleaning is completed, the actuator (58) can be turned off to stop rotation of the cleaner (50) and the arm (59) can be pivoted to move the cleaner (50) away from the weld wheel (22,24). Other suitable configurations for operating the cleaning system (60) will be apparent to one with ordinary skill in the art in view of the teachings herein. For instance, this cleaning process can then be repeated on the same weld wheel (22,24) and/or a different weld wheel (22,24) of the welder (12). In some versions, the cleaning process is performed after each weld. In some other versions, the cleaning process is performed after more than one weld, such as five welds, ten welds, or any other suitable number of welds. In some versions, the abrasive force of the cleaner (50) against each weld wheel (22,24) and/or the rotational speed of the cleaner (50) is adjustable. The cleaning system (60) may thereby remove about 1/1000 of an inch of material from the working surface (25,27) of a weld wheel (22,24), which is less than the resurfacing process that typically removes between about ⅜ inch and about ½ inch from the working surface (25,27) of a weld wheel (22,24). The cleaning system (60) may further provide an Ra of about 32 micro-inches at the working surface (25,27) of the weld wheel (22,24), which is smoother than the resurfacing process that typically provides an Ra of about 125 micro-inches. Accordingly, the cleaning system (60) may prolong the cleanliness and/or integrity of the working surfaces (25,27) of the weld wheels (22,24). This may allow a weld wheel (22,24) to perform more welds, reducing the need for resurfacing and/or frequent weld wheel (22,24) changes to save time and/or reduce costs. EXAMPLE Weld testing confirmed that both the existing weld code for welding light gauge Bake Hardenable (BH) materials and an alternative weld code being considered resulted in rapid degradation of the upper and lower trailing weld wheels, after 5 test welds. The surfaces of the weld wheels were degraded to the point that acceptable production welds could no longer be achieved. Subsequently, six test welds were produced on 0.64 mm BH grade steel with a tensile strength of about 250 MPa. Typically, after 5 welds the surfaces of the trailing weld wheels are degraded to the point of not being able to produce acceptable welds. Therefore, for these six test welds, a hand held, electric powered, rotating wire brush was used to clean the upper and lower trailing wheels after each weld. Inter-weld cleaning was terminated after the 6thweld. Subsequent to the termination of cleaning, another five welds were produced and the aforementioned condition of the weld wheel surfaces were not capable of producing acceptable production welds. This test proved that inter-weld cleaning of the trailing weld wheel surfaces is capable of extending the number of acceptable welds that can be produced, thereby eliminating the potential for line speed reductions, risk of producing unacceptable welds, and prolonging the intervals between trailing weld wheel changes. Having shown and described various embodiments of the present invention, further adaptations of the methods and systems described herein may be accomplished by appropriate modifications by one of ordinary skill in the art without departing from the scope of the present invention. Several of such potential modifications have been mentioned, and others will be apparent to those skilled in the art. For instance, the examples, embodiments, geometrics, materials, dimensions, ratios, steps, and the like discussed above are illustrative and are not required. Accordingly, the scope of the present invention should be considered in terms of any claims that may be presented and is understood not to be limited to the details of structure and operation shown and described in the specification and drawings. | 17,028 |
11858060 | DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. The same or equivalent elements are denoted by the same reference signs throughout the drawings, and repeated descriptions of these elements will not be given. In the drawings, some elements may be selectively shown to illustrate the present invention while the other elements are omitted from the figure. The present invention is not limited to the embodiments described below. Embodiment 1 A friction stir spot welder according to Embodiment 1 is adapted to weld workpieces through softening induced by friction heat, the workpieces including first and second workpieces stacked in the presence of a sealant applied to a region of contact between the first and second workpieces, the friction stir spot welder including: a pin in the form of a solid circular cylinder; a shoulder in the form of a hollow circular cylinder, the shoulder having an interior in which the pin is inserted; a rotary actuator that rotates the pin and the shoulder about an axis coinciding with a central axis of the pin; a clamp in the form of a hollow circular cylinder, the clamp having an interior in which the pin and the shoulder are inserted; an advancement/withdrawal actuator that advances and withdraws the pin, the shoulder, and the clamp along the axis; and a controller, the controller being configured to: (B) drive the rotary actuator and the advancement/withdrawal actuator to cause the pin to press the workpieces while rotating; (C) after performing the pressing (B) for a first predetermined time, drive the rotary actuator and the advancement/withdrawal actuator to cause the pin and the shoulder to press the workpieces while rotating; and (D) after performing the pressing (C) for a second predetermined time, drive the rotary actuator and the advancement/withdrawal actuator to cause the pin and/or the shoulder to plunge into a weld region of the workpieces while rotating and stir the weld region to weld the workpieces together. In the friction stir spot welder according to Embodiment 1, the controller may be configured to, in the plunging (D): (D3) drive the rotary actuator and the advancement/withdrawal actuator to cause the shoulder to plunge into the weld region while rotating; and (D4) after the plunging (D3), drive the rotary actuator and the advancement/withdrawal actuator to retract the shoulder out of the weld region and cause the pin to plunge into the weld region while rotating. In the friction stir spot welder according to Embodiment 1, the controller may be configured to, in the pressing (B), control the advancement/withdrawal actuator to place a distal end of the pin on an upper surface of the stack of the workpieces. In the friction stir spot welder according to Embodiment 1, the controller may be configured to, in the pressing (C), control the advancement/withdrawal actuator to place respective distal ends of the pin and the shoulder on an upper surface of the stack of the workpieces. An example of the friction stir spot welder according to Embodiment 1 will now be described in detail with reference to the drawings. Configuration of Friction Stir Spot Welder FIG.1is a schematic diagram illustrating the general configuration of the friction stir spot welder according to Embodiment 1. The up-down direction indicated inFIG.1is that defined with respect to the friction stir spot welder. As shown inFIG.1, the friction stir spot welder50according to Embodiment 1 includes a pin11, a shoulder12, a tool holder52, an advancement/withdrawal actuator53, a clamp13, a backing support55, a backing56, and a rotary actuator57. The pin11, shoulder12, tool holder52, advancement/withdrawal actuator53, clamp13, and rotary actuator57are mounted to an upper end portion of the backing support55embodied in the form of a C-gun (C-frame). The backing56is mounted to a lower end portion of the backing support55. The pin11, shoulder12, clamp13, and backing56are mounted to the backing support55in such a manner that the assembly of the pin11, shoulder12, and clamp13is opposed to the backing56. Workpieces60to be welded are placed between the assembly of the pin11, shoulder12, and clamp13and the backing56. The pin11, shoulder12, and clamp13are secured to the tool holder52which is made up of a rotary tool holder521and a clamp holder522. Specifically, the pin11and shoulder12are secured to the rotary tool holder521, and the clamp13is secured to the clamp holder522with a clamp actuator41interposed therebetween. The rotary tool holder521is supported by the clamp holder522with the rotary actuator57interposed therebetween. The clamp actuator41is embodied in the form of a spring mechanism. The pin11, shoulder12, and clamp13are advanced and withdrawn in the up-down direction by the advancement/withdrawal actuator53which is made up of a pin actuator531and a shoulder actuator532. The pin11is in the form of a solid circular cylinder and supported by the rotary tool holder521, although the details of this supporting are not shown inFIG.1. The pin11is driven by the rotary actuator57to rotate about an axis Xr (rotational axis) coinciding with the central axis of the pin11, and is driven by the pin actuator531to make an advancement movement or a withdrawal movement in the direction indicated by the arrow P1, namely in the direction of the axis Xr (the up-down direction inFIG.1). The pin actuator531may be embodied in any form capable of allowing the pin11to exert a welding pressure. For example, a mechanism employing gas pressure, hydraulic pressure, or a servomotor can be suitably used as the pin actuator531. The shoulder12is in the form of a hollow circular cylinder with a hollow interior and supported by the rotary tool holder521. The pin11is inserted in the hollow interior of the shoulder12. In other words, the shoulder12is disposed to surround the outer circumferential surface of the pin11. The shoulder12is driven by the rotary actuator57to rotate about the axis Xr about which the pin11also rotates, and is driven by the shoulder actuator532to make an advancement movement or a withdrawal movement in the direction indicated by the arrow P2, namely in the direction of the axis Xr. The shoulder actuator532may be embodied in any form capable of allowing the shoulder12to exert a welding pressure. For example, a mechanism employing gas pressure, hydraulic pressure, or a servomotor can be suitably used as the shoulder actuator532. In the present embodiment, as described above, the pin11and shoulder12(rotary tools) are both supported by the same rotary tool holder521, and driven by the rotary actuator57to rotate together about the axis Xr. Additionally, the pin11and shoulder12are respectively driven by the pin actuator531and shoulder actuator532to make an advancement movement or a withdrawal movement in the direction of the axis Xr. Although in Embodiment 1 the pin11is capable of making an advancement movement or a withdrawal movement alone or in conjunction with an advancement movement or a withdrawal movement of the shoulder12, the pin11and shoulder12may be advanceable and withdrawable independently of each other. The clamp13, like the shoulder12, is in the form of a hollow circular cylinder with a hollow interior and disposed to have its central axis coinciding with the axis Xr. The shoulder12is inserted in the hollow interior of the clamp13. Thus, the shoulder12in the form of a hollow circular cylinder is disposed to surround the outer circumferential surface of the pin11, and the clamp13in the form of a hollow circular cylinder is disposed to surround the outer circumferential surface of the shoulder12. In other words, the clamp13, shoulder12, and pin11are coaxially arranged to form a nested structure. The clamp13presses one surface (front surface) of the stack of the workpieces60. In Embodiment 1, as previously stated, the clamp13is supported by the clamp holder522with the clamp actuator41interposed therebetween. The clamp actuator41biases the clamp13toward the backing56. The clamp13(and the clamp actuator and holder41and522) is driven by the shoulder actuator532to make an advancement movement or a withdrawal movement in the direction indicated by the arrow P3(which is the same as the directions indicated by the arrows P1and P2). Although in Embodiment 1 the clamp actuator41is embodied in the form of a spring mechanism, the clamp actuator41is not limited to this form. The clamp actuator41may be embodied in any form capable of biasing the clamp13or allowing the clamp13to exert a welding pressure. For example, a mechanism employing gas pressure, hydraulic pressure, or a servomotor can be suitably used as the claim actuator41. The pin11, shoulder12, and clamp13have distal end surfaces11a,12a, and13a. The pin11, shoulder12, and clamp13are driven by the advancement/withdrawal actuator53to make an advancement movement, so that the distal end surfaces11a,12a, and13acome into contact with the front surface of the stack of the workpieces60(the weld region of the workpieces60) and press the workpieces60. In Embodiment 1, the backing56has a flat surface (support surface56a) adapted to contact with the other surface (back surface) of the stack of the workpieces60which are in the form of a flat plate, and supports the workpieces60by the support surface56a. The backing56is not limited to a particular form and may be embodied in any form capable of supporting the workpieces60in a manner appropriate for the friction stir spot welding. The backing56may be removable from the backing support55and replaceable with another backing56; that is, backings56with different shapes may be prepared, and the backing56used may be changed depending on the type of the workpieces60. The details of the forms of the pin11, shoulder12, tool holder52, advancement/withdrawal actuator53, clamp13, backing support55, and rotary actuator57in Embodiment 1 are not limited to those described above, and various forms well known in the field of friction stir welding can be suitably employed. For example, the pin actuator531and shoulder actuator532may be embodied in the form of a motor or gear mechanism well known in the field of friction stir welding. Although in Embodiment 1 the backing support55is embodied in the form of a C-gun, the backing support55is not limited to this form. The backing support55may be embodied in any form capable of supporting the pin11, shoulder12, and clamp13in a manner permitting advancement and withdrawal movements of the pin11, shoulder12, and clamp13and capable of supporting the backing56in a position where the backing56is opposed to the pin11, shoulder12, and clamp13. Further, the friction stir spot welder50according to Embodiment 1 is designed to be mounted on a robotic device for friction stir spot welding (this robot is not shown in the drawings). Specifically, the backing support55is mounted on the distal end of the arm of the robotic device. Thus, the backing support55may be considered a component of the robotic device for friction stir spot welding. The robotic device for friction stir spot welding which includes the backing support55and arm is not limited to a particular form, and various forms of robots such as articulated robots which are well known in the field of friction stir welding can be suitably employed. The friction stir spot welder50(including the backing support55) is not limited to being applied to robotic devices for friction stir spot welding, but can be suitably applied also to well known processing tools such as NC machine tools, large-sized C-frames, and automatic riveters. The friction stir spot welder50according to Embodiment 1 may be embodied in a form where two or more robots place the backing56of the friction stir spot welder50in face-to-face relationship with the other elements of the friction stir spot welder50. Further, the friction stir spot welder50may be embodied in a form where the workpieces60are hand-held workpieces or where a robot is used as a positioner for the workpieces60, provided that friction stir spot welding of the workpieces60can be performed stably. [Control Configuration of Friction Stir Spot Welder] Hereinafter, the control configuration of the friction stir spot welder50according to Embodiment 1 will be described in detail with reference toFIG.2. FIG.2is a block diagram schematically illustrating the control configuration of the friction stir spot welder ofFIG.1. As shown inFIG.2, the friction stir spot welder50includes a controller51, a storage31, and an input receiver32. The storage31retrievably stores various kinds of data. The storage31is embodied in the form of a well known storage device such as a memory or hard disk. The storage31need not consist of a single device, but may be constituted by a plurality of storage devices (such as by a random access memory and a hard disk drive). When, for example, the controller51is embodied in the form of a microcomputer, at least part of the storage31may be embodied in the form of an internal memory of the microcomputer, or the storage31may be embodied in the form of a memory independent of the microcomputer. It should be appreciated that the storage31may store data in a manner permitting retrieval of the data by an entity other than the controller51or may be a writable storage into which the controller51or any other entity can write data. The input receiver32is a device for enabling input of various parameters related to the control of friction stir spot welding and other data to the controller51, and is embodied in the form of a well known device such as a keyboard, a touch panel, or a set of button switches. In Embodiment 1, at least data regarding the factors related to the welding of the workpieces60, such as the thickness and material of the workpieces60, can be input through the input receiver32. The controller51is configured to control the components (devices) constituting the friction stir spot welder50. Specifically, the controller51controls the pin actuator531and shoulder actuator532constituting the advancement/withdrawal actuator53, and further controls the rotary actuator57. Thus, switching between advancement and withdrawal movements of the pin11, shoulder12, and clamp13can be controlled, and the distal end locations, movement speeds, and movement directions of the pin11, shoulder12, and clamp13can be controlled during advancement and withdrawal movements. Additionally, the pressing forces with which the pin11, shoulder12, and clamp13press the workpieces60can be controlled. The rotational speeds of the pin11and shoulder12can also be controlled. The controller51is not limited to a particular form. In Embodiment 1, the controller51is embodied in the form of a microcomputer and includes a CPU. The controller51is configured such that the CPU retrieves and executes a predetermined control program stored in the storage31and thereby performs processing related to the operation of the advancement/withdrawal actuator53and rotary actuator57. The controller51need not consist of a single controller, but may be constituted by a set of controllers cooperative with each other to carry out the control of the friction stir spot welder50. Operation (Operating Method) of Friction Stir Spot Welder Hereinafter, the operation of the friction stir spot welder50according to Embodiment 1 will be described in detail with reference toFIGS.3,4A,4B, and4C.FIGS.4A,4B, and4Cdepict an example where the workpieces60used are two metal plates61and62, a sealant63is applied to the upper surface of the metal plate62(the surface to be brought into contact with the metal plate61), and the metal plates61and62are stacked and joined by spot welding. FIG.3is a flowchart illustrating an example of the operation of the friction stir spot welder according to Embodiment 1.FIGS.4A,4B, and4Care process diagrams schematically illustrating examples of the steps of friction stir spot welding performed by the friction stir spot welder ofFIG.1. InFIGS.4A,4B, and4C, some parts of the friction stir spot welder are omitted. The arrows r indicate the rotational directions of the pin11and shoulder12, and the block arrows F indicate the directions of the forces exerted on the metal plates61and62. Although a force is exerted on the metal plates61and62also from the backing56, the force from the backing56is omitted inFIGS.4A,4B, and4Cfor convenience of illustration. To clearly distinguish between the pin11and the clamp13, the shoulder12is shaded. First, as shown inFIG.4A, the metal plate (second workpiece)62is placed on the upper surface of the backing56, and the sealant63is applied to the metal plate62. The sealant63may be a sealing material or an adhesive. The sealant63used may be, for example, a natural rubber, a synthetic rubber such as a polysulfide synthetic rubber, silicone rubber, or fluorine rubber, or a synthetic resin such as a tetrafluoroethylene rubber resin. Next, the metal plate (first workpiece)61is placed on the upper surface of the metal plate62so that the sealant63is sandwiched between the plates (step (1)). Subsequently, the controller51carries out a preliminary operation (operation for pushing out part of the sealant63). Specifically, as shown inFIGS.3and4A, the controller51drives the advancement/withdrawal actuator53to cause the clamp13to press the front surface60cof the stack of the workpieces60with a predetermined pressing force (step S101; step (A)). The pressing force of the clamp13can be freely set and is predetermined by means such as experimentation. The pressing force may be, for example, from 2000 to 15000 N, and is set to a suitable level according to the inner and outer diameters of the clamp13and the thickness of the workpieces60. Under the action of the pressing force of the clamp13, part of the sealant63comes out of the periphery of the stack of the workpieces60. Next, the controller51drives the rotary actuator57and advancement/withdrawal actuator53(pin actuator531) to cause the pin11to press the front surface60cof the stack of the workpieces60(the upper surface of the metal plate61) with a first pressing force P1for a first predetermined time while rotating (step S102; step (B)). The first pressing force can be freely set and is predetermined by means such as experimentation. The first pressing force may be, for example, from 2000 to 15000 N, and is set to a suitable level according to the diameter of the pin11and the thickness of the workpieces60. The rotational speed of the pin11is also predetermined and may be, for example, from 500 to 3000 rpm. The first predetermined time is also predetermined by means such as experimentation and may be, for example, from 1 to 10 seconds. Although in Embodiment 1 the rotary actuator57is adapted to rotate the pin11and shoulder12together, the rotary actuator57may be adapted to rotate the pin11and shoulder12individually. During the above step, the pin11and backing56sandwich the metal plate61, sealant63, and metal plate62. In this state, the pin11presses the front surface60cof the stack of the workpieces60while rotating, so that friction heat is generated between the distal end surface11aof the pin11and the workpieces60. Transfer of the generated friction heat leads to heating of that portion (and its vicinity) of the sealant63which overlaps the distal end surface11aof the pin11when viewed in the vertical direction, thus decreasing the viscosity of the overlapping portion and its vicinity of the sealant63. In consequence, the portion (and its vicinity) of the sealant63which overlaps the distal end surface11aof the pin11when viewed in the vertical direction is pushed outward from the initial location, and part of the sealant63comes out of the periphery of the stack of the workpieces60. Subsequently, the controller51drives the rotary actuator57and advancement/withdrawal actuator53to cause the pin11and shoulder12to press the front surface60cof the stack of the workpieces60with a second pressing force for a second predetermined time while rotating (step S103; step (C)). Specifically, the controller51drives the shoulder actuator532to cause the shoulder12to press the front surface60cof the stack of the workpieces60while rotating. During this step, the controller51controls the pin actuator531to cause the distal end surface11aof the pin11to be on the front surface60cof the stack of the workpieces60. The second pressing force can be freely set and is predetermined by means such as experimentation. The second pressing force may be, for example, from 2000 to 15000 N, and is set to a suitable level according to the inner and outer diameters of the shoulder12and the thickness of the workpieces60. The rotational speed of the shoulder12is also predetermined and may be, for example, from 500 to 3000 rpm. The second predetermined time is also predetermined by means such as experimentation and may be, for example, from 1 to 10 seconds. The second pressing force may be set greater than the first pressing force. During the above step, the assembly of the pin11and shoulder12and the backing56sandwich the metal plate61, sealant63, and metal plate62. In this state, the pin11and shoulder12press the front surface60cof the stack of the workpieces60while rotating, so that friction heat is generated between the workpieces60and the distal end surfaces11aand12aof the pin11and shoulder12. Transfer of the generated friction heat leads to heating of that portion (and its vicinity) of the sealant63which overlaps the distal end surfaces11aand12aof the pin11and shoulder12when viewed in the vertical direction, thus decreasing the viscosity of the overlapping portion and its vicinity of the sealant63. In consequence, the portion (and its vicinity) of the sealant63which overlaps the distal end surfaces11aand12aof the pin11and shoulder12when viewed in the vertical direction is pushed outward from the initial location, and part of the sealant63comes out of the periphery of the stack of the workpieces60. The part of the sealant63remains around the periphery of the stack of the workpieces60and seals the welded surfaces of the workpieces60. Subsequently, the controller51drives the rotary actuator57and advancement/withdrawal actuator53to cause the pin11and shoulder12to press the front surface60cof the stack of the workpieces60with a third pressing force for a third predetermined time while rotating (step (2); step S104). The third pressing force can be freely set and is predetermined by means such as experimentation. The third pressing force may be, for example, from 2000 to 15000 N, and is set to a suitable level according to the diameter of the pin11, the inner and outer diameters of the shoulder12, and the thickness of the workpieces60. The rotational speed of the pin11and shoulder12is also predetermined and may be, for example, from 500 to 3000 rpm. The third predetermined time is also predetermined by means such as experimentation and may be, for example, from 3 to 10 seconds. The third pressing force may be set greater than the first pressing force. During this step, since both the pin11and shoulder12make no advancement or withdrawal movement, “preheating” of the front surface60cof the stack of the workpieces60is effected by the pin11and shoulder12. Thus, the metal material in that region of the metal plate61which is in contact with the pin11and shoulder12is heated by friction and softened to form a plastic flow portion60ain the vicinity of the front surface60cof the stack of the workpieces60. Subsequently, the controller51controls the advancement/withdrawal actuator53to cause the pin11or shoulder12to perform predetermined actions (step S105), after which the controller51ends the program. Specifically, the controller51controls the advancement/withdrawal actuator53according to a predetermined control program stored in the storage31. This control of the advancement/withdrawal actuator53by the controller51is preferably carried out in such a manner that the absolute value of a tool average location Tx is small. Denoting the area of the distal end surface of the pin11by Ap, the area of the distal end surface of the shoulder12by As, the plunge depth of the pin11by Pp, and the plunge depth of the shoulder12by Ps, the tool average location Tx is defined by the following equation (I). Ap·Pp+As·Ps=Tx(I) The control of the advancement/withdrawal actuator53is more preferably carried out in such a manner that the tool average location Tx is zero. The details of the control for achieving a small absolute value of the tool average location Tx are disclosed in Japanese Laid-Open Patent Application Publication No. 2012-196682 and will therefore not be described herein. The controller51controls the advancement/withdrawal actuator53to withdraw the pin11from the front surface60cof the stack of the workpieces60and cause the shoulder12to penetrate (plunge) into the stack of the workpieces60from the front surface60c(see step (D1) ofFIG.4B). Specifically, the controller51drives the pin actuator531to cause the pin11to move away from the workpieces60or drives the shoulder actuator532to cause the shoulder12to move toward the workpieces60. These movements lead to the softened portion of the metal material being extended from the upper metal plate61to the lower metal plate62, resulting in an increase in volume of the plastic flow portion60a. Further, the softened metal material in the plastic flow portion60ais pushed away by the shoulder12and flows from a region directly below the shoulder12to a region directly below the pin11, with the result that the pin11is withdrawn and lifted relative to the shoulder12. Subsequently, the controller51drives the pin actuator531to cause the pin11to move toward the workpieces60or drives the shoulder actuator532to cause the shoulder12to move away from the workpieces60. Thus, the pin11is advanced toward the metal plate61, while the shoulder12is withdrawn from the metal plate61(see step (D2) ofFIG.4C). Step (D2) need not be carried out if satisfactory reshaping of the front surface60cof the metal plate61can be achieved by step (3) described later. When proceeding from step (D1) to step (D2) and then to step (3), the controller51controls the advancement/withdrawal actuator53to retract the pin11slowly. It should be noted that during retraction movements of the pin11and shoulder12, the welding pressures exerted by the distal ends of the pin11and shoulder12are maintained (see the arrows F in step (D1) ofFIG.4Band the arrows F in step (D2) ofFIG.4C). Thus, when the shoulder12is retracted, the rotation and pressing pressure of the pin11are maintained, so that the softened metal material in the plastic flow portion60aflows from the region directly below the pin11to the region directly below the shoulder12(a depression formed by plunging of the shoulder12). When the pin11is retracted, the rotation and pressing pressure of the shoulder12are maintained, so that the softened metal material in the plastic flow portion60aflows from the region directly below the shoulder12to the region directly below the pin11(a depression formed by plunging of the pin11). Next, the controller51controls the advancement/withdrawal actuator53to place the pin11and shoulder12in a position where there is no or little level difference between the distal end surfaces11aand12a, namely where the distal end surfaces11aand12aare flush with each other (see step (3) ofFIG.4C). In consequence, the front surface60cof the stack of the workpieces60is reshaped into a generally flat surface substantially free of any depression. Subsequently, the controller51controls the advancement/withdrawal actuator53to move the pin11, shoulder12, and clamp13away from the workpieces60and then controls the rotary actuator57to stop the rotation of the pin11and shoulder12, thereby ending the series of friction stir spot welding steps, namely the steps of welding the workpieces60(see step (4) ofFIG.4C). Thus, the metal plates61and62are released from the rotational force (and pressing force) exerted by the pin11and shoulder12contacting with the metal plates61and62, and the plastic flow portion60aextending over both of the metal plates61and62ceases the plastic flow and forms into a weld60b. In the above manner, the two metal plates61and62are joined (welded) at the weld60b. The sealant63cures after a given period of time, and thus the welded surfaces of the metal plates61and62are sealed by the cured sealant63. In the friction stir spot welder50according to Embodiment 1, as described above, the controller51is configured to drive the rotary actuator57and advancement/withdrawal actuator53to cause the pin11to press the front surface60cof the stack of the workpieces60while rotating (step (B)). The pressing with rotation generates friction heat between the distal end surface11aof the pin11and the workpieces60. Transfer of the generated friction heat leads to heating of that portion (and its vicinity) of the sealant63which overlaps the distal end surface11aof the pin11when viewed in the vertical direction, thus decreasing the viscosity of the overlapping portion and its vicinity of the sealant63. In consequence, the portion (and its vicinity) of the sealant63which overlaps the distal end surface11aof the pin11when viewed in the vertical direction is pushed outward from the initial location, and part of the sealant63comes out of the periphery of the stack of the workpieces60. As such, when the plastic flow portion60ais formed by rotation of the pin11and shoulder12, entry (mixing) of the sealant63into the plastic flow portion60acan be reduced, and consequently high weld quality can be achieved. With the use of the friction stir spot welder50according to Embodiment 1, adhesion of the sealant63to the pin11can be reduced since entry (mixing) of the sealant63into the plastic flow portion60acan be reduced. Thus, when welding of workpieces60is performed in succession, the distal end surface11aof the pin11can reliably press the front surface60cof the stack of the workpieces60. Additionally, adhesion of the sealant63to the front surface60cof the stack of the workpieces60can be reduced, and this also contributes to achieving high weld quality. Further, in the friction stir spot welder50according to Embodiment 1, the controller51is configured to drive the rotary actuator57and advancement/withdrawal actuator53to cause the pin11and shoulder12to press the front surface60cof the stack of the workpieces60while rotating (step (C)). The pressing with rotation generates friction heat between the workpieces60and the distal end surfaces11aand12aof the pin11and shoulder12. Transfer of the generated friction heat leads to heating of that portion (and its vicinity) of the sealant63which overlaps the distal end surfaces11aand12aof the pin11and shoulder12when viewed in the vertical direction, thus decreasing the viscosity of the overlapping portion and its vicinity of the sealant63. In consequence, the portion (and its vicinity) of the sealant63which overlaps the distal end surfaces11aand12aof the pin11and shoulder12when viewed in the vertical direction is pushed outward from the initial location, and part of the sealant63comes out of the periphery of the stack of the workpieces60. The part of the sealant63remains around the periphery of the stack of the workpieces60and seals the welded surfaces of the workpieces60. As such, when the plastic flow portion60ais formed by rotation of the pin11and shoulder12, entry (mixing) of the sealant63into the plastic flow portion60acan be reduced, and consequently high weld quality can be achieved. With the use of the friction stir spot welder50according to Embodiment 1, adhesion of the sealant63to the pin11and/or shoulder12can be reduced since entry (mixing) of the sealant63into the plastic flow portion60acan be reduced. Thus, when welding of workpieces60is performed in succession, the distal end surface of the pin11and/or the distal end surface of the shoulder12can reliably press the front surface60cof the stack of the workpieces60. Additionally, adhesion of the sealant63to the front surface60cof the stack of the workpieces60can be reduced, and this also contributes to achieving high weld quality. In the friction stir spot welder50according to Embodiment 1, the controller51is configured to control the rotary actuator57and advancement/withdrawal actuator53to first cause the pin11to press the workpieces60while rotating and then cause the pin11and shoulder12to press the workpieces60while rotating. However, the controller51is not limited to this configuration. The controller51may be configured to drive the rotary actuator57and advancement/withdrawal actuator53to, from the first, cause the pin11and shoulder12to press the workpieces60while rotating. Embodiment 2 A friction stir spot welder according to Embodiment 2 is based on the friction stir spot welder according to Embodiment 1, and the controller in Embodiment 2 is configured to, in step (D): (D1) drive the rotary actuator and advancement/withdrawal actuator to cause the pin to plunge into the weld region while rotating; and (D2) after the plunging (D1), drive the rotary actuator and advancement/withdrawal actuator to retract the pin out of the weld region and cause the shoulder to plunge into the weld region while rotating. Hereinafter, an example of the friction stir spot welder according to Embodiment 2 will be described in detail with reference to the drawings. The basic configuration of the friction stir spot welder according to Embodiment 2 is the same as that of the friction stir spot welder according to Embodiment 1 and will therefore not be described below. Operation (Operating Method) of Friction Stir Spot Welder FIGS.5A,5B, and5Care process diagrams schematically illustrating examples of the steps of friction stir spot welding performed by the friction stir spot welder according to Embodiment 2. InFIGS.5A,5B, and5C, some parts of the friction stir spot welder are omitted. The arrows r indicate the rotational directions of the pin11and shoulder12, and the block arrows F indicate the directions of the forces exerted on the metal plates61and62. Although a force is exerted on the metal plates61and62also from the backing56, the force from the backing56is omitted inFIGS.5A,5B, and5Cfor convenience of illustration. To clearly distinguish between the pin11and the clamp13, the shoulder12is shaded. As seen fromFIGS.5A to5C, the operation of the friction stir spot welder50according to Embodiment 2 is basically the same as that of the friction stir spot welder50according to Embodiment 1, and differs in that steps (D3) and step (D4) are performed instead of steps (D1) and (D2). Specifically, after step (2), the controller51drives the pin actuator531to cause the pin11to move toward the workpieces60or drives the shoulder actuator532to cause the shoulder12to move away from the workpieces60(step (D3) ofFIG.5B). Thus, the pin11is advanced toward the metal plate61, while the shoulder12is withdrawn from the metal plate61. These movements lead to the softened portion of the metal material being extended from the upper metal plate61to the lower metal plate62, resulting in an increase in volume of the plastic flow portion60a. Further, the softened metal material in the plastic flow portion60ais pushed away by the pin11and flows from a region directly below the pin11to a region directly below the shoulder12, with the result that the shoulder12is withdrawn and lifted relative to the pin11. Subsequently, the controller51drives the pin actuator531to cause the pin11to move away from the workpieces60or drives the shoulder actuator532to cause the shoulder12to move toward the workpieces60(step (D4) ofFIG.5C). Thus, the shoulder12is advanced toward the metal plate61, while the pin11is withdrawn from the metal plate61. During these movements, the softened metal material in the plastic flow portion60aflows from the region directly below the pin11to the region directly below the shoulder12(a depression formed by plunging of the shoulder12). Next, the controller51controls the advancement/withdrawal actuator53to place the pin11and shoulder12in a position where there is no or little level difference between the distal end surfaces11aand12a(see step (3) ofFIG.5C). After that, the controller51controls the advancement/withdrawal actuator53to move the pin11, shoulder12, and clamp13away from the workpieces60and then controls the rotary actuator57to stop the rotation of the pin11and shoulder12(see step (4) ofFIG.5C), thereby ending the program. The friction stir spot welder50according to Embodiment 2, which is configured as described above, can offer the same benefits as the friction stir spot welder50according to Embodiment 1. Many modifications and other embodiments of the present invention will be apparent to those skilled in the art from the foregoing description. Accordingly, the foregoing description is to be construed as illustrative only, and is provided for the purpose of teaching those skilled in the art the best mode for carrying out the invention. The details of the structure and/or function may be varied substantially without departing from the scope of the invention. The invention can be implemented in various forms by appropriately combining the constituting elements disclosed in the embodiments described above. INDUSTRIAL APPLICABILITY The friction stir spot welder and operating method thereof according to the present invention are capable of achieving high weld quality even when used to weld workpieces in the presence of a sealant applied between the workpieces, and are therefore useful. REFERENCE SIGNS LIST 11pin11adistal end surface12shoulder12adistal end surface13clamp13adistal end surface31storage32input receiver41clamp actuator50friction stir spot welder51controller52tool holder53advancement/withdrawal actuator55support56backing56asupport surface57rotary actuator60workpiece60aplastic flow portion60bweld60cfront surface61metal plate62metal plate63sealant521rotary tool holder522clamp holder531pin actuator532shoulder actuatorXr axis | 38,280 |
11858061 | DETAILED DESCRIPTION The present disclosure is described with particular embodiments and references to figures, but the disclosure is not limited thereby. The drawings or figures described are only schematic and are not limiting. In the context of this document, the terms “first” and “second” are used only to differentiate between the various elements and do not imply any order between these elements. The reference signs do not limit the scope of the disclosure, but when included in the claims. In the figures, identical or similar elements may bear the same references. FIG.1shows tooling1according to one embodiment of the disclosure. It comprises a fixed jaw30comprising a central part31, two arms32substantially parallel to each other and a fixed jaw body40. The central part31and the arms32are arranged together to form a “U” shape in a cross-sectional view of the fixed jaw. In a preferred embodiment, the distance d between the arms32is smaller than the length of the arms32, giving an elongated appearance to the tooling1. Typically, the length of the arms32is at least twice of d. The central part31of the fixed jaw may be discontinuous. The fixed jaw body40occupies a space between the two arms32that is approximately half the length of the arms32. The fixed jaw body40is coupled to the arms32at its lateral sides and, possibly, coupled to the central part31at its lower portion. The fixed jaw body40is preferably arranged obliquely with respect to the arm32. The fixed jaw body40has a bore42. This bore42corresponds to a recess in the depth of the fixed jaw body40. The entrance to this recess is preferably machined in such a way as to define bearing surfaces41. During the welding operation of a blade10on a rotor element20, the bore42is provided to receive, preferably entirely, the functional part13of the blade10. The shape of the bore42preferably mimics the shape of the functional part13of the blade10so as to minimize the size of the recess while ensuring non-contact containment of the functional part13of the blade10. The entrance to the bore42is preferably machined to define bearing surfaces41intended for coming into contact with a part of the blade10known as the platform12. Preferably, there are three planar bearing surfaces41intended for coming into contact with three lateral faces14of a parallelepiped platform12of the blade10. Even more preferably, the platform12is a rectangular parallelepiped. Thus, in this preferred embodiment, the bearing surfaces41are in contact with part of the perimeter of the platform12of the blade10. Furthermore, the plane of each bearing surface41is preferably perpendicular to the plane of linear or, preferably, orbital motion of the friction weld in such case. Preferably, the movable jaw50is arranged to translate only along the arms32. In a preferred embodiment, the arms32comprise grooves33parallel to the arms32. These grooves33are preferably provided to receive lateral edges52of the movable jaw50to improve the sliding. The movable jaw50comprises a movable bearing surface51, preferably parallel to the fixed jaw body40and thus oblique with respect to the arms32when the fixed jaw body40is itself oblique with respect to the arms32. Preferably, the movable bearing surface51remains parallel to the fixed jaw body40when the movable jaw50slides. When the blade10is positioned in the fixed jaw body40(the functional part13in the bore42and the platform in contact with the bearing surfaces41according to a preferred embodiment), the movable jaw50is arranged to move towards the fixed jaw body40so that the movable bearing surface51come into contact with a face14of the platform12of the blade10. Preferably, the entire perimeter of the platform12is in contact with either the bearing surface41or the movable bearing surface51. More preferably, three flat bearing surfaces41are intended to come into contact with three lateral faces14of a parallelepipedic platform12, then the movable bearing surface51, which is flat, is intended to come into contact with the fourth face14of the platform12. Preferably, the movable bearing surface51is perpendicular to the plane of the linear or orbital movement of the friction welding. Optionally, the movable bearing surface51has a texture, obtained by machining for example, to increase the coefficient of static friction between the movable bearing surface51and a face14of the blade10. Preferably, the movable jaw50comprises a reinforcement portion53contiguous to the two lateral edges52and preferably perpendicular to the two lateral edges52, so that the reinforcement portion53is parallel to the movable bearing surface51. In this latter configuration, the movable bearing surface51is coupled to one end of the lateral edges52and the reinforcement portion53is coupled to the other end of the lateral edges52. In such a preferred embodiment, the movable bearing surface51, the lateral edges52and the reinforcement portion53define an opening in the movable jaw50. The tooling1of the disclosure comprises pressure means70for moving the movable jaw50and for pressing for example a platform12of a blade10between the movable jaw50and the fixed jaw40. The pressure means70ensures the tightening and loosening of the blade10in the tooling. Typically, during the tightening action of an element10to be welded (blade10for example), under the effect of the pressure means70, the movable bearing surface51exerts a force on the platform12of the blade10against the support surface41which is opposite the movable bearing surface51. The platform12is retained firmly by tightening two parallel faces14of the platform12. Preferably, the pressure means70are electric, pneumatic or hydraulic cylinders71which can develop either a force directly applied to the movable jaw50, or a torque which through a screw will be transformed into a force on the movable jaw50. The cylinders71are for example two or four in number and are preferably located at the ends of the arms32of the fixed jaw30. The arms32of the fixed jaw30are preferably arranged in such a way that the cylinders71are integrated into the tooling1. In the configuration with two cylinders71, each of them applies a force on either side of the movable jaw50so that if one cylinder71pushes the movable jaw50then the other cylinder71pulls it. In the configuration with four cylinders71, they preferably work in pairs, two that push the movable jaw50and two that pull it in order to double the transmitted force. The force is transmitted between each cylinder71and the movable jaw50by means of a piston72. The pistons72are preferably arranged so as to transmit a force strictly parallel to the arms32. Preferably, the cylinders71are controlled by a control unit. This control unit can itself be controlled by an algorithm so as to automate the procedure for tightening and loosening the blade10in the tooling1. Thus, the tightening force, the cycle time between the tightening and loosening and other parameters relevant to the welding operation can be pre-programmed and then transmitted to the control unit. FIG.2shows the tooling1, according to an embodiment identical to that shown inFIG.1, in which there is a blade10to be welded and other blades10′ already welded. The distance d between the arms32of the fixed jaw30and the depth of the tooling1are sufficient to completely accommodate a blade10. The orientation of the arms32of the tooling1allows to simultaneously contain a plurality of blades10aligned on the drum20. The configuration of the tooling1is such that the already welded blades10′ can be contained within the tooling1without contact with it. The blade10to be welded is contained between the fixed jaw body40and the movable jaw50. The adjacent (already welded) blade10′ which is on the side of the movable jaw50is preferably contained without contact in the opening described by the movable bearing surface51, the lateral edges52and the reinforcement portion53of the movable jaw50. Preferably, the portion that comprises the movable bearing surface51and the reinforcement portion53have an identical thickness. In normal use of the tooling1for welding a blade10to a drum20, the platform12of the blade10is preferably parallel to the central part31and located at the upper end of the arms32(the central part31being located at the lower end of the arms32), the functional part13of the blade10is preferably contained between the arms32and the assembly portion15is preferably located outside the tooling1. FIG.3illustrates the manner in which the tooling1, the vibrating plate60and a drum20are arranged during the welding operation according to a preferred embodiment of the disclosure. Typically, the drum20of a low-pressure compressor of a turbomachine consists of a plurality of stages, each comprising a row of blades10. As a stage of the drum20is circular, the blades10are aligned along the stage. Thus, when welding a blade10to a drum stage20, the arms32of the tooling1are arranged in a direction tangential to the drum stage20so that the row of blades10can be contained between the arms32. The assembly portion15faces the drum20and the functional portion13leaks from it. Preferably, the tooling1is coupled to the vibrating plate60by means of pins61. The pins61are attached to the lower part of the tooling1, preferably to the central part31, and are intended to be received by holes62in the vibrating plate60upon coupling. The vibrating plate60is itself coupled to a friction welding machine. The vibrating plate60is arranged to provide tangential vibration relative to the drum20but also allows the tooling1to be moved away from and towards the drum20, preferably in an automated manner. Once the blade10is tightened in the tooling1, the vibrating plate60can move the blade10towards the drum20so as to bring them into contact. When the welding is complete and the blade10is tightened, the tooling1is moved away from the drum20and releases the welded blade10. FIG.4shows a portion of a drum20to which a blade10is welded in one embodiment. The platform12serves essentially as a means of gripping and positioning the blade10in a plane parallel to the plane of orbital or linear motion. Preferably, the assembly portion15, which corresponds to a protrusion under the platform12is intended to be welded to the drum20. This assembly portion15comprises an assembly surface11intended to be brought into contact with an assembly surface21belonging to an assembly portion22of the drum20. The assembly portion22of the drum20also corresponds to a protrusion of the receiving area on the outer wall23of the drum20. In summary, the disclosure may be described as follows. A tooling1for holding a blade10during friction welding thereof to a rotor element20of a turbomachine of an aircraft and comprising:a fixed jaw30comprising:a central part31;two arms32separated by a distance d for receiving at least a portion of the blade10;a fixed jaw body40comprising bearing surfaces41and a bore42for receiving at least a portion of the blade10, the bearing surfaces41being intended to come into contact with the blade10;a movable jaw50comprising a movable bearing surface51for coming into contact with the blade10;pressure means70for moving the movable jaw50towards the fixed jaw body40for pressing the blade10. | 11,271 |
11858062 | DETAILED DESCRIPTION OF THE INVENTION FIG.1Ais a top elevational view of a portable friction welding system10illustrative of a new generation of systems with automation features for effectively allowing tradesmen of ordinary skill of the welding art to efficiently and consistently produce high quality welds. In this example, portable fiction welding tool12receives pneumatic power at input14to drive an air mortar, thrust system and control elements of tool12which rotate a fixture16, seeFIG.1B, while thrust against a substrate18. Considerable thrust must be applied at the intersection of the fixture and the substrate and adequate control of this thrust this is an important component of a successful weld. Here this accomplished by a clamp system20of the prior art, with a concave disk22sealing against substrate18with a vacuum drawn through a vacuum line24. With clamp system20locked against substrate18, reactive forces are effectively passed to the substrate and thrust force and advancement of fixture16into substrate18can be controlled by tool12. Portable friction welding system10ofFIGS.1A and1B, including prior art clamp system20, works well for the single shot installation where one fixture will mount the desired equipment, e.g., placing anodes to cathodically protect the substrate. Yet many operations require the installation of equipment having multiple holes through their base to accept externally threaded studs. A pad eye28inFIG.2is illustrative of such applications. Pad eye28includes a base30, swivel32and a load loop34. Pad eyes are frequently installed where heavy equipment must be lifted or retrieved and base30must be securely attached to substrate18. Holes can be drilled through the substrate and bolts and washers can accomplish this secure connection in some applications. But this is time consuming at best and it may be required or at least very desirable to make this connection without putting holes through the substrate. Friction welding studs to the substrate would be an ideal solution as it is secure, doesn't compromise the integrity of the substrate and, once set up, a connection takes only seconds to bond. The installation of such equipment would require providing an array of studs16with precise spacing that will align with mounting holes36. However, the size of the footprint of the clamp and a need for repeated and precise clamp placement are problematic where tightly spaced and precisely located fixtures are required. For instance, common industrial pad eye28presents base30with holes36about a circumference that requires spacing much closer than the radius of concave disk22of clamp system20. Thus, after the first stud16is installed, it interferes with the footprint of clamp system20and portable friction welding system10ofFIGS.1A and1Bcannot align with the next required location for stud installation. FIG.3illustrates another portable fusion welding system10, but with a clamp system20A of the prior art that accommodates close stud placement, albeit in a very cumbersome way. In this embodiment, the top of concave disk22is a strainer plate40providing a plurality of closely spaced tapped ports or holes44, each of which is configured to receive installation of the portable friction welding tool12or be sealed by a plug42. The periphery or outer ring46of concave disk22bears a gasket seal50disposed to engage the substrate when a vacuum is applied, but is otherwise temporally secured to the substrate, e.g., by magnates (not shown), absent a vacuum. One of the plugs42is unscrewed from the tapped hole into which it is received and tool12is installed in that location. With tool12filling tapped hole42A through strainer plate40and the other tapped holes filled by plugs42, strainer plate40is effectively sealed and a vacuum can be drawn through vacuum hose24at quick disconnect48. This may be monitored through a vacuum gage52. Under the application of a vacuum, clamp system20A can resist the reactive forces as necessary for portable friction welding tool12to friction weld a stud in place at that location, with pneumatic input from power input14to drive the air motor and hydraulic input driving an internal ram (not shown) to supply the thrust. After that, vacuum is released and portable friction welding tool12is disconnected and removed from strainer plate40. That plug is replaced, and another stud may be inserted into the portable friction welding tool, the next plug is removed, and the tool is installed at that location. Stud patterns with both close and precise placement may be accomplished through repeating this whole process. However, fully detaching the tool, loading a new fixture in the detached tool, sealing the last tapped hole44used with a plug42, opening a new tapped hole by removing the plug42at the next desired location, relocating and reattaching the portable friction welding system at the new location, installing the next fixture at that new location, through each fixture installation in the array, remains quite cumbersome. And some applications such as those involving underwater diving operations in current or low visibility conditions can seriously exacerbate these in what is already a problematic process. FIG.4Aillustrates a portable friction welding system10B constructed in accordance with one embodiment of the present invention and is configured for underwater deployment facilitated with neutral or near neutral buoyancy to portable friction welding tool12by virtue of buoyancy device60. In this embodiment, the buoyancy device includes a jacket of syntactic foam62with exterior containment stops at64and anchor bolts66link the expansive exterior containment stops64to the body of portable friction welding tool12. The expanse of exterior containment stops may be conveniently provided by the facing surface of handles68secured to buoyancy device60through anchoring bolts66. Clamp system20C ofFIG.4Aillustrates the present invention with four key components, a clamp base70securable to substrate18, a traveling tool mount72, an index system74interacting with traveling tool mount72and clamp base70and an articulated fixture loading system76. As will be set out in further detail throughout the specification, the present invention is a multi-position clamp facilitating the precise placement of an array of multiple fixtures from one engagement of clamp base70to substrate18and using that connection to index multiple fixture installations without disengaging and removing portable friction welding tool12from clamp base70for relocation or for reloading successive fixtures. Clamp base70has multiple windows88through which portable friction welding tool12may reach through clamp base70for fixture16to reach substrate18. FIGS.4B and4Cillustrate these key components of clamp system20C in the context of this particular embodiment. Portable friction welding tool12and its surrounding buoyancy device60have been omitted from these illustrations for the sake of clarity. In this embodiment, traveling tool mount72is provided by pivot plate78which includes provisions, e.g., tool mount holes80, for receiving portable fiction welding tool12. InFIG.4B, index system74includes rotating lug84, rotation bolt86, bearing block90, bearing block hold fast91, captivated bolt92, and multiple tapped holes93which serve as index positions to receive bolt92at preselected positions around the periphery of clamp base70. Here are the index system further includes the versatility of adjustments in the diameter of the precision fixture placement pattern by engaging a different pattern position hole, e.g., moving pivot bolt96from pattern position hole98A to98B (with a corresponding shift of captivated bolt92from tapped holes93of hold down position100A to100B) allows one clamp system20C to install multiple diameter patterns. This provides index capabilities in a polar reference system of preset angles and radius options. Articulated fixture loading system76utilizes the hold down aspects bearing block90, bearing block hold fast91, captivated bolt92and pivot bolt to rotatively engage pivot plate78to rotating lug84. Arrows102inFIG.4Cindicate the freedom of rotation of indexing system74through the engagement of rotation bolt86with clamp base70and rotating lug84to move from one fixture position, e.g. at first tapped hole93A, for the next, e.g., second tapped hole93B, each position indexed from the initial placement of clamp base70. And arrow106illustrates the optional freedom to adjust the diameter of the pattern. Similarly, arrow104indicates the hinged movement of pivot plate78through its connection to rotating lug84which allows the pivot plat to flip up and permit convenient access to load successive fixtures. In an alternate embodiment, rotation bolt86is replaced with a stud86A installed on clamp base70and rotative log84is rotatively secured through washer86C and lock nut86B. CompareFIG.9A. FIGS.5A-5Fset out the steps of practicing one illustrative use the present invention. Clamp base70it is installed at the desired target site of substrate18inFIG.5A, aligning fixture placement in the pattern with access windows88. In this embodiment client base70is secured by a continuous vacuum drawn through vacuum line24connected the clamp base at vacuum hose quick disconnect48. Gaskets50A seal the periphery and the access windows of clamp base70against substrate18. It is convenient to assemble buoyancy device60about portable frictional welding tool12and attach pivot and rotation hardware assembly112to the portable fiction welding tool on the surface. SeeFIG.5B. The rotation lug84, pivot bolt96, bearing block90and captured bolt92are also conveniently connected to pivot plate78on the surface and this complete assembly is brought by the diver to clamp base70where it is attached using only rotation bolt86through which it is secured in a rotatable engagement. Vacuum line24has been omitted from vacuum line quick disconnect48in these drawings for the purposes of clarity. Alternatively, the assembled portable friction welding system12/clamp system20can be brought as a unit to attach to the substrate, e.g., in stud/lock nut engagement of rotating lug84disclosed inFIG.9A. FIG.5Cillustrates portable friction welding system10C ready to shoot at weld fixture16to substrate18. Captivated lock down bolt92has been tightened to secure traveling mount72, indexing system74, articulated fixture loading system76and the attached portable friction welding tool12to clamp base70. The initial fixture16A has been installed inFIG.5Dand articulated fixture loading system76, here the release of captivated hold down bolt92and the pivoting of the pivot plate78about pivot bolt96, swings portable friction welding tool12up to disengage from fixture16A initially installed to the substrate and allows access to install a second fixture16B in collet110of friction welding tool12. Note that portable friction welding tool12does not need to be disengaged from its connection to clamp base70in order to reload another fixture for installation into the pattern. Whether by rotation bolt86(visible inFIG.5D) or stud86and lock nut86(visible inFIG.9A), the connection of rotation lug84to clamp base70is maintained loose enough to allow rotation to the next fixture position in the pattern as the as pivot plate is swung over. See arrow102ofFIG.5E. Captivated hold down bolt92is tightened into tapped hole93in clamp base70to finish advancement to the next indexed location and portable friction welding system10C is ready to friction weld the next fixture in the pattern. This process is repeated, all without having to disengage and remove the portable friction welding tool12from the reference position of clamp base70secured to substrate18until the pattern is complete. SeeFIG.5Fwith a complete pattern of fixtures16A-16D. Portable friction welding tool12, with pivot and rotation hardware112is then disengaged from the clamp base. And clamp base70may be removed and reengaged at a new position with substrate18if further fixture patterns are to be installed. Clamp base70in theFIG.5series and in various other illustrative embodiments have been horizontally deployed on top of substrate18. However, the substrate may be vertical or may be horizontal and accessed from beneath or anything in between. Orientation of pivot and rotation hardware112should bear in mind the full effective weight and mass of the hardware and mounted tool12, together with buoyancy provision60, if any. For example, in a vertical clamp base attachment, it may be desired that the portable friction welding tool pivot down to a resting position prior to installing the next fixture16. Alternatively, a neutrally buoyant combination of tool12, hardware assembly112and buoyancy device60will have a slight net buoyancy upon pivoting as some of the hardware is support by the clamp base after installation. Here pivoting up would be a stable option. Other circumstances may find it suitable to pivot in a horizontal plane. Those of ordinary skill in the art and having access to the present disclosure may adjust the components to achieve desirable handling characteristics appropriate to the circumstances. The engagement of a fixture16such as for an externally threaded stud or an internally threaded boss within collet110is necessarily one of relatively tight tolerances. Lifting through an immediate pivoting action to disengage from the first fixture16A before loading a second fixture16B causes an arching motion that can present challenges in disengagement. SeeFIG.5D. FIGS.6A-6Cpresent an alternate embodiment that provides the freedom of motion to start with a lift aligned with the axis of fixture16to clear the collet/fixture engagement before pivot plate78starts the pivoting (see arrow104inFIG.6C). that provides access for loading the next fixture into collet110. (SeeFIG.5C.) Returning toFIGS.6A-6C, the portable friction welding tool has been removed for the sake of clarity in these illustrations. Again, a rotation bolt86secures the indexing and fixture loading system111, here pivot and rotation hardware assembly112, to clamp base70. This hardware comprises pivot plate78with bearing block90and captivated lock down bolt92on one end and pivotable engagement to rotation lug84on the other end. Here that engagement includes pivot bolt96passing through a vertically elongated reception114in at the pivoting base of pivot plate78. SeeFIG.6B. Returning toFIG.6A, retaining pin116passes through pin passage118(SeeFIG.6A) in rotation lug84and through the very bottom of elongated reception114. Thus, inFIG.6A, with pin116in place and passing through the lowest position of elongated reception slot114and the hold down captivated bolt92engaged, pivot and rotation hardware112is in position to undertake a friction weld. CompareFIG.6Bwith pin116pulled, hold down captivated bolt92disengaged, and a vertical lift (see arrows108) given to separate the collet from the installed fixture (not shown). Thereafter, pivot plate78can be pivoted to gain access to load the next fixture (not shown) as the pivot and rotation hardware assembly is illustrated inFIG.6C. It should also be noted that the quality of the resulting weld can be served by controlling the amount of preloading thrust of fixture16against substrate18by controlling tolerances in connection of rotating lug84to clamp base20and tightening bearing block90against the clamp base. FIGS.7A-7Dillustrate yet another embodiment for the pivot and rotation hardware assembly, here combining vertical lift provisions with multiple diameter pattern capabilities.FIG.7Ais an exploded perspective view of the pivot and rotation assembly112andFIG.7Bwhich illustrates the components assembled in the short diameter pattern position. A key feature of this embodiment is twin vertically elongated reception slots114A and114B. Ease of use may also be facilitated by other features ofFIGS.7A and7Bincluding replacing pivot bolt96of the last embodiment with a pivot pin96A and replacing hold down captivated bolt92of the last embodiment with hand screw92A.FIGS.7C and7Dshould be compared as short and long radius pattern settings with pivot pin96A engaging elongated reception slots114A and114B, respectively. Retaining pins116engage the base of the respective elongated receptions for locking down the pivot end of pivot plate78. Set screws or bearing block hold fast screws91anchor bearing block90to pivot plate78, preventing rotation of the bearing block with the turning of captivated bolt92A such that turning the handle advanced the bolt through captured nut95. Further, it should be appreciated that though rotating block84is illustrated with ears84A and84B which receive the end of pivot plate78therebetween, other embodiments of this connection are possible, e.g., providing a single ear on the rotating lug, but split the end of the pivot plate to engage on either side of the rotating lug. The simple pin adjustment of this embodiment is much easier than disengaging portable friction welding tool12from one position on pivot plate78to reattach at another to change the radius of the pattern. The efficiency of pin adjustments is particularly advantageous in shooting patterns for applications that require two rows of fixtures in an inner and outer ring pattern. FIGS.8A and8Bare close ups of rotating lugs and pivot plate engagements for embodiments that utilize twin pins, preferably disposed on a single handle, which run in tracks in an extension of rotating lug84A. A pin116, not shown, through passage118through rotating lug84A and pivot plate78can secure that end of the pivot plate in its lowest position, ready to shoot a fixture. Thereafter, pin116can be removed. And twin pins96A and96B (which replace pivot bolt96of prior embodiments) which engage the base of pivot plate78and slide through engagement in track120of rotating lug84. Constrained by the track, translation of pins96A and96B define the orientation of pivot plate78. In these arrangements, the pivot plate is not only given the freedom to lift away from the substrate axially aligned with the fixture to clear the fixture/collet engagement, it is constrained to do so. These embodiments differ in thatFIG.8Aconstrains the twin pins to track together and inFIG.8Bthey track together until a tight radius in the track makes pin96A act as a pivot point as pin96B orbits to a resting place. See arrow104. Compare the second, raised position illustrated in dotted outline. Dual radius configurations can be deployed with the addition of a second track. FIG.8Cis a double pin96A and96B, conveniently sharing a common handle96C. Captured, spring loaded balls96D may engage radial grooves in pivot plate78to help retain the pins in place. The embodiments ofFIGS.9A-9Dalso address alternate constrained lift design in close up illustrations of engagements of pins within rotating lugs. In many of the illustrative examples the multi-position clamp is secured on top of a horizontal substrate and the lift is than vertically away from the substrate and the clamp base attached thereto. However, it should be understood that the substrate, and thereby the clamp base, can be in any orientation and the “lift” is away from the clamp base and not necessarily vertically and directed against gravity. In the embodiments ofFIGS.9A-9D, the movement is very clearly a two-step operation rather than one fluid movement. It is lift away from the clamp base (not shown) and then pivot plate78(not shown) driven by a camming action of pin96E traveling in secondary track122while fixedly secured to pivot plate78. CompareFIG.8A. In the illustrated embodiments of thisFIG.9series, pins96E and96F are not symmetrical. SeeFIG.9Billustrating a combined pin embodiment96C. Returning toFIG.9A, pin96E has the width “c” to track with pin96F through a primary track120as if was twin pins, but at the end of the vertical rise, pin96F becomes the pivot point and pin96E rotates into a secondary track122which, at thickness “b”, is too narrow for pin96F to have entered. SeeFIG.9C. It may be desirable to provide a tight radius “r” likeFIG.8Bsuch that pivot pin96F comes to a stable landing position96J at the end of primary track120before rotation (see arrow104) of pin96E which is then in position96G and ready for rotation into secondary tracks122as illustrate with position96H advancing toward position96I. FIG.9Dis an adaptation of the embodiment ofFIG.9Awith side tracks122A and122B off of tracks120A and120B, respectively, providing a choice of two different patterns for installing fixtures. Spacing “x” that accommodates a desired change in radius for an alternative pattern, may prove insufficient to accommodate similarly oriented side tracks. In this case it may be desirable to change the orientation of side tracks122A and122B, as illustrated here. It should be appreciated that although pins are shown in both of the alternate track sets, one can be used at a time, mounting through the pivot plate (not shown). Moving from one track to the other then can involve flipping the dual pin system by turning handle96C 180 degrees. Refer also toFIG.9B. FIGS.10A and10Billustrate the use of a pry bar130configuration to facilitate the vertical lift withFIG.10Billustrating the application of the pry bar with the embodiment ofFIGS.7A-7D, applying force “f” (see arrow128) to lift pivot plate78after retaining pin116(not shown) has been withdrawn and hold down captivated bolt92A has been released. RecallFIG.6C. Alternatively, it should be appreciated that pry bar130may be incorporated into pivot and rotation hardware assembly112to facilitate a leveraged lift opportunity. The rotation hardware assembly ofFIG.11introduces the added feature of a drop down shroud system132. Shrouds140are used to extend portable friction welding into hazardous environments and more generally, shrouds are well known for bathing welding operations in inert gas such argon to purge explosive mixtures from the immediate location and to hold both fuel and oxygen away. And in underwater applications, shrouds can be mitigate concerns of an excessive quench rate of friction welding in contact with water. However, the shroud dimensions best usable through windows88in clamp base70make it difficult to manage loading fixtures. Shroud system132includes a yoke134hingedly connected beneath pivot plate78through hinges136and can be secured by a latch138. Further, a shroud engagement seat142presented through yoke134engages shroud140in sealing communication with the base of portable friction welding tool12(not shown). Engagement seat142may be as simple as a press fit engagement, or may be more involved, e.g. a quarter turn engagement accessible from below the yoke. Even though friction welding is known for its very tightly localized and quickly dissipating heating effect, shroud materials should be selected for adequate heat resistance (especially for tight fitting shrouds.) One readily available option may be metal bellows designed for high heat applications. After pivot arm78is lifted (see arrow108) and pivoted (see arrow104) about its connection to rotating lug84, shroud drop down system132is used. Shroud system132allows efficient use of a shroud, in tight quarters, easily bringing the shroud out of the way for loading fixtures (see arrow144) and easily returning it to position once the fixture is loaded. That the system is never separated from the portable friction welding system during operation facilitates rapid, sure placement and prevents to loss of components. FIGS.12A-12Fillustrate another multi-position clamp system20D for use with portable friction welding tool12as an alternate embodiment of the present invention.FIGS.12A and12Bare perspective views of clamp system20D from above and below, respectively, andFIGS.12C,12D and12Eare elevational views of the end, front and top of the clamp system, respectively. Here clamp base70B is provided with an indexable framework200connected with legs202to a plurality of feet204. These feet may be part of any number of hold down systems, including, but not limited to, individual vacuum pads cooperating through a common vacuum line; individual magnets; or high-friction pads in combination with chain or strap clamps, c-clamp fasteners or other mechanical constraints. Connecting legs202to feet204through an articulated joint206and affording an adjustment system208, e.g., hand tightened knobs engaging threads on the exterior of legs202, afford versatility for engaging an uneven or even non-planar substrate. In this illustrative embodiment, framework200comprises a pair of beams210, each connected to a pair of legs202, and a pair of rails212, each attached at its ends to one of beams210. Traveling mount72A receives portable friction welding tool12through an articulated fixture loading system76A and is disposed to slide on rails212between indexed positions for shooting a precise pattern of fixtures, e.g., guided by markings or detents along one of rails212. Once in position, hand tightened knobs214are tightened to secure that indexed position with the rail. See particularlyFIGS.12E and12F. FIG.12Fillustrates articulated fixture loading system76A comprising a lug84A fixedly secured to travelling mount72A and pivotally engaging one end of pivot plate78through a pivot bolt96. The other end of the pivot plate receives a bearing block90and a hand tightenable captivated bolt92A which is releasably securable to traveling mount72A. The discussion of earlier embodiments may be generally referenced for working the mechanism of this embodiment to facilitate loading successive fixtures without disconnecting portable friction welding tool12from clamp base20D. However, as the movement of traveling mount72A in the sliding engagement with rails212serves to move from one indexed position to another, the rotation illustrated, e.g., inFIG.4Cby arrow102for angular displacement or ability to shift the radius as indicated by arrow106in that figure are not necessary for this embodiment. The forgoing components and configuration can efficiently provide a precise straight-line or x-axis pattern. However, the ability to reposition rails212between indexed positions along beams210, e.g., with slides220releasably securable with hand tightening knobs222can add greater versatility by enabling indexed location on both a transverse and longitudinal adjustment, i.e., an indexable x-y pattern from a single clamp base position. The framework of this embodiment is afforded multiple adjustment features to accommodate a wide variety of conditions and the square frame components allow interchangeability to easily construct a suitably sized frame to accommodate a wide range of patterns. Another feature of framework200is that it defines a plane and fixtures within the pattern will be orthogonal to this plane and parallel to each other, even if the substrate is irregular or curved. This avoids splayed fixture installation and the attendant challenges to install equipment thereon. If substrate irregularities and curvature are sufficient, provisions may be made in the tool/traveling mount interface or in the connection of the traveling mount to the rails212to provide adjustment orthogonal to the x-y plane, i.e., in the z-axis. Yet another aspect of this alternate embodiment is the inclusion of a shroud140in a sealing relationship with the front of portable friction welding tool12and extending through base clamp20D toward the substrate while isolating the collet and fixture. Use in hazardous environments with a potential presence of explosive gases may be facilitated by providing a source of inert gas to purge the immediate, isolated fixture installation site of both explosive gas and oxygen. While this may be an application of the embodiment ofFIG.11, the shroud deployed in this clamp base is not constrained to fit in windows88as in various other illustrative embodiments in this application for a clamp base. This affords an opportunity to enlarge the diameter of the shroud and may afford access for installing fixtures with shroud140mounted directly to the front of portable friction welding tool12. Or another alternative would be mounting the shroud to depend from traveling mount72A while providing a sufficient seal from tool12to shroud140. It is to be understood that the apparatus and methods described herein may be implemented in various forms and those skilled at the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention as defined by the patent claims. The detailed description describes several distinct embodiments and it will be understood that not all of that detail, while exemplary, is essential to the claimed invention. Thus, other modifications, changes and substitutions are intended to the foregoing disclosure and in some instances some features of the invention will be employed without a corresponding use of other features. Accordingly, it is appropriate for the patent claims be construed broadly and in a manner consistent with the spirit and scope of the invention herein. Further, those skilled in the art, given the benefit of this disclosure, may adapt portable friction welding precise patterns to systems with other pneumatic, hydraulic and electrical drives without departing from the scope of this aspect of the present invention and may apply the present invention to all manners of clamp base attachment systems where a precise pattern of fixtures is required—whether vacuum, magnetic, chain, strap, multiple foot, c-clamps, other or combination. | 29,758 |
11858063 | DETAILED DESCRIPTION Reference will now be made in detail to embodiments of processes for laser processing transparent workpieces, such as glass workpieces, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts. According to one or more embodiments described herein, a transparent workpiece may be laser processed to form a contour in the transparent workpiece that comprises a series of defects along a line of intended separation for separating the transparent workpiece into two or more separated articles. Each of the defects comprise a defect angle of greater than 10 such that, after separation of the transparent workpiece along the contour, the resultant separated articles comprise an angled edge having an edge angle of greater than 10°. Defects may be formed in a transparent workpiece using a low diffracting beam, such as a quasi-non-diffracting beam, focused into a laser beam focal line. Using current methods, diffraction and divergence of extended focus laser beams (e.g., quasi-non-diffracting beams) increases when the beam is directed into the transparent workpiece at increased angles relative to normal incidence (e.g., angles greater than 10° from normal incidence) and as such, it is difficult to form a series of high angle defects to facilitate the separation of transparent workpieces into separated articles having angled edges. For example, using previous laser processing techniques, when a laser beam enters a transparent workpiece with an angled, curved, or stepped face, aberrations are introduced into the beam. For Bessel beams, these aberrations result in a large decrease of peak beam intensity as the beam travels inside the transparent workpiece, diminishing the quality or even preventing the formation of high angle defects. While not intending to be limited by theory, peak beam intensity decreases because, in conventional angled cutting, the central lobe of a standard Bessel beam splits into multiple lobes and thus the peak intensity of any of the split lobes is less than the peak intensity of the central lobe of a non-aberrated Bessel beam. While still not intending to be limited by theory, aberrations also lead to a decrease in the Rayleigh range of the beam. Thus, improved methods of laser processing transparent workpieces are desired. Accordingly, the methods described herein use angled laser beam focal lines that are phase altered such that the laser beam focal lines exhibit minimal divergence along the length of the laser beam focal line within the transparent workpiece to form a contour of high angled defects and facilitate the formation of separated articles having angled edges. The methods are described herein with specific references to the appended drawings. As used herein, “laser processing” comprises directing a laser beam onto and/or into a transparent workpiece. In some embodiments, laser processing further comprises translating the laser beam relative to the transparent workpiece or translating the transparent workpiece relative to the laser beam, for example, along a contour line or other pathway. Examples of laser processing include using a laser beam to form a contour comprising a series of defects that extend into the transparent workpiece and/or using an infrared laser beam to heat the transparent workpiece. Laser processing may separate the transparent workpiece along one or more desired lines of separation. However, in some embodiments, additional non-laser steps, such as applying mechanical force, may be utilized to separate the transparent workpiece along one or more desired lines of separation. As used herein, the “angular spectrum” of a laser beam refers to the distribution of the Fourier spectrum of the laser beam in the spatial frequency domain. In particular, the angular spectrum represents a group of plane waves whose summation recreates the original beam. The angular spectrum may also be referred to as the spatial-frequency distribution of the laser beam. As used herein, “beam spot” refers to a cross section of a laser beam (e.g., a beam cross section) at the impingement location of the laser beam at an impingement surface of a transparent workpiece, i.e., the surface of a transparent workpiece upon which the laser beam is first incident. The beam spot is the cross-section at the impingement location. In the embodiments described herein, the beam spot is sometimes referred to as being “axisymmetric” or “non-axisymmetric.” As used herein, axisymmetric refers to a shape that is symmetric, or appears the same, for any arbitrary rotation angle made about a central axis, and “non-axisymmetric” refers to a shape that is not symmetric for any arbitrary rotation angle made about a central axis. The rotation axis (e.g., the central axis) is most often taken as being the optical axis (axis of propagation) of the laser beam, which is the axis extending in the beam propagation direction, which is referred to herein as the z-direction. As used herein, “upstream” and “downstream” refer to the relative position of two locations or components along a beam pathway with respect to a beam source. For example, a first component is upstream from a second component if the first component is closer to the beam source along the path traversed by the laser beam than the second component and a first position (location) is upstream from a second position (location) if the first position (location) is closer to the beam source along the path traversed by the laser beam than the second position (location). As used herein, “laser beam focal line,” refers to a pattern of interacting (e.g., crossing) light rays of a laser beam that forms a focal region elongated in the beam propagation direction. In conventional laser processing, a laser beam is tightly focused to a focal point. The focal point is the point of maximum intensity of the laser beam and is situated at a focal plane in a transparent workpiece. In the elongated focal region of a focal line, in contrast, the region of maximum intensity of the laser beam extends beyond a point to a line aligned with the beam propagation direction. A focal line is formed by converging light rays that intersect (e.g., cross) to form a continuous series of focal points aligned with the beam propagation direction. The laser beam focal lines described herein are formed using a quasi-non-diffracting beam, mathematically defined in detail below. As used herein, “contour line,” corresponds to the set of intersection points of the laser beam with the incident (impingement) surface of the transparent workpiece resulting from relative motion of the laser beam and the transparent workpiece. A contour line can be linear, angled, polygonal or curved in shape. A contour line can be closed (i.e. defining an enclosed region on the surface of the transparent workpiece) or open (i.e. not defining an enclosed region on the surface of the transparent workpiece). The contour line represents a boundary along which separation of the transparent workpiece into two or more parts is facilitated. Separation occurs spontaneously or with the assistance of external thermal or mechanical energy. As used herein, “contour,” refers to a set of defects in a transparent workpiece formed by a laser beam through relative motion of a laser beam and the transparent workpiece along a contour line. The defects are spaced apart along the contour line and are wholly contained within the interior of the transparent workpiece and/or extend through one or more surfaces into the interior of the transparent workpiece. Defects may also extend through the entire thickness of the transparent workpiece. Separation of the transparent workpiece occurs by connecting defects along the contour, such as, for example, through propagation of a crack. As used herein, a “defect” refers to a region of a transparent workpiece that has been modified by a laser beam focal line. Defects include regions of a transparent workpiece having a modified refractive index relative to surrounding unmodified regions of the transparent workpiece. Common defects include structurally modified regions such as void spaces, cracks, scratches, flaws, holes, perforations, densifications, or other deformities in the transparent workpiece produced by a laser beam focal line. Defects may also be referred to, in various embodiments herein, as defect lines or damage tracks. A defect or damage track is formed through interaction of a laser beam focal line with the transparent workpiece. As described more fully below, the laser beam focal line is produced by a pulsed laser. A defect at a particular location along the contour line is formed from a focal line produced by a single laser pulse at the particular location, by a pulse burst of sub-pulses at the particular location, or by multiple laser pulses at the particular location. Relative motion of the laser beam and transparent workpiece along the contour line results in multiple defects that form a contour. The phrase “transparent workpiece,” as used herein, means a workpiece formed from glass, glass-ceramic or other material which is transparent, where the term “transparent,” as used herein, means that the workpiece has a linear optical absorption of less than 20% per mm of material depth for the specified pulsed laser wavelength. In embodiments, the transparent workpiece has a linear optical absorption less than 10% per mm of material depth for the specified pulsed laser wavelength, or such as less than 1% per mm of material depth for the specified pulsed laser wavelength. Unless otherwise specified, the transparent workpiece has a linear optical absorption of less than about 20% per mm of material depth. The transparent workpiece may have a depth (e.g., thickness) of from about 50 microns (μm) to about 10 mm (such as from about 100 μm to about 5 mm, or from about 0.5 mm to about 3 mm). Transparent workpieces may comprise glass workpieces formed from glass compositions, such as borosilicate glass, soda-lime glass, aluminosilicate glass, alkali aluminosilicate, alkaline earth aluminosilicate glass, alkaline earth boro-aluminosilicate glass, fused silica, or crystalline materials such as sapphire, silicon, gallium arsenide, or combinations thereof. In some embodiments the transparent workpiece may be strengthened via thermal tempering before or after laser processing the transparent workpiece. In some embodiments, the glass may be ion-exchangeable or ion exchanged, such that the glass composition can undergo ion-exchange or has undergone ion-exchange for glass strengthening before or after laser processing the transparent workpiece. For example, the transparent workpiece may comprise ion exchanged or ion exchangeable glass, such as Corning Gorilla® Glass available from Corning Incorporated of Corning, N.Y. (e.g., code 2318, code 2319, and code 2320). Further, these ion exchangeable or ion exchanged glasses may have coefficients of thermal expansion (CTE) of from about 6 ppm/° C. to about 10 ppm/° C. Other example transparent workpieces may comprise EAGLE XG® and CORNING LOTUS™ available from Corning Incorporated of Corning, N.Y. Moreover, the transparent workpiece may comprise other components which are transparent to the wavelength of the laser, for example, glass ceramics or crystals such as sapphire or zinc selenide. In an ion exchange process, ions in a surface layer of the transparent workpiece are replaced by larger ions having the same valence or oxidation state, for example, by partially or fully submerging the transparent workpiece in an ion exchange bath. Replacing smaller ions with larger ions causes a layer of compressive stress to extend from one or more surfaces of the transparent workpiece to a certain depth within the transparent workpiece, referred to as the depth of layer. The compressive stresses are balanced by a layer of tensile stresses (referred to as central tension) such that the net stress in the glass sheet is zero. The formation of compressive stresses at the surface of the glass sheet makes the glass strong and resistant to mechanical damage and, as such, mitigates catastrophic failure of the glass sheet for flaws which do not extend through the depth of layer. In some embodiments, smaller sodium ions in the surface layer of the transparent workpiece are exchanged with larger potassium ions. In some embodiments, the ions in the surface layer and the larger ions are monovalent alkali metal cations, such as Li+ (when present in the glass), Na+, K+, Rb+, and Cs+. Alternatively, monovalent cations in the surface layer may be replaced with monovalent cations other than alkali metal cations, such as Ag+, Tl+, Cu+, or the like. As used herein, the term “quasi-non-diffracting beam” is used to describe a laser beam having low beam divergence as mathematically described below. In particular, the laser beam used to form a contour of defects in the embodiments described herein. The laser beam has an intensity distribution I(X, Y, Z), where Z is the beam propagation direction of the laser beam, and X and Y are directions orthogonal to the beam propagation direction, as depicted in the figures. The X-direction and Y-direction may also be referred to as cross-sectional directions and the X-Y plane may be referred to as a cross-sectional plane. The coordinates and directions X, Y, and Z are also referred to herein as x, y, and z; respectively. The intensity distribution of the laser beam in a cross-sectional plane may be referred to as a cross-sectional intensity distribution. The quasi-non-diffracting laser beam may be formed by impinging a diffracting laser beam (such as a Gaussian beam) into, onto, and/or thorough a phase-altering optical element, such as an adaptive phase-altering optical element (e.g., a spatial light modulator, an adaptive phase plate, a deformable mirror, or the like), a static phase-altering optical element (e.g., a static phase plate, an aspheric optical element, such as an axicon, or the like), to modify the phase of the beam, to reduce beam divergence, and to increase Rayleigh range, as mathematically defined below. Example quasi-non-diffracting beams include Gauss-Bessel beams, Airy beams, Weber beams, and Bessel beams. Furthermore, optical assemblies that include a phase-altering optical element are described in more detail below. Without intending to be limited by theory, beam divergence refers to the rate of enlargement of the beam cross section in the direction of beam propagation (i.e., the Z direction). One example of a beam cross section discussed herein is a beam spot114of a laser beam112projected onto a transparent workpiece160(FIG.1A). Diffraction is one factor that leads to divergence of laser beams. Other factors include focusing or defocusing caused by the optical systems forming the laser beams or refraction and scattering at interfaces. Laser beams for forming the defects of the contours are formed from laser beam focal lines. Laser beam focal lines have low divergence and weak diffraction. The divergence of the laser beam is characterized by the Rayleigh range ZR, which is related to the variance σ2of the intensity distribution and beam propagation factor M2of the laser beam. In the discussion that follows, formulas will be presented using a Cartesian coordinate system. Corresponding expressions for other coordinate systems are obtainable using mathematical techniques known to those of skill in the art. Additional information on beam divergence can be found in the articles entitled “New Developments in Laser Resonators” by A. E. Siegman in SPIE Symposium Series Vol. 1224, p. 2 (1990) and “M2factor of Bessel-Gauss beams” by R. Borghi and M. Santarsiero in Optics Letters, Vol. 22(5), 262 (1997), the disclosures of which are incorporated herein by reference in their entirety. Additional information can also be found in the international standards ISO 11146-1:2005(E) entitled “Lasers and laser-related equipment-Test methods for laser beam widths, divergence angles and beam propagation ratios—Part 1: Stigmatic and simple astigmatic beams”, ISO 11146-2:2005(E) entitled “Lasers and laser-related equipment—Test methods for laser beam widths, divergence angles and beam propagation ratios—Part 2: General astigmatic beams”, and ISO 11146-3:2004(E) entitled “Lasers and laser-related equipment-Test methods for laser beam widths, divergence angles and beam propagation ratios—Part 3: Intrinsic and geometrical laser beam classification, propagation and details of test methods”, the disclosures of which are incorporated herein by reference in their entirety. The spatial coordinates of the centroid of the intensity profile of the laser beam having a time-averaged intensity profile I(x, y, z) are given by the following expressions: x¯(z)=∫-∞∞∫-∞∞xI(x,y,z)dxdy∫-∞∞∫-∞∞l(x,y,z)dxdy(1)y¯(z)=∫-∞∞∫-∞∞yI(x,y,z)dxdy∫-∞∞∫-∞∞I(x,y,z)dxdy(2) These are also known as the first moments of the Wigner distribution and are described in Section 3.5 of ISO 11146-2:2005(E). Their measurement is described in Section 7 of ISO 11146-2:2005(E). Variance is a measure of the width, in the cross-sectional (X-Y) plane, of the intensity distribution of the laser beam as a function of position z in the direction of beam propagation (Z-direction). For an arbitrary laser beam, variance in the X-direction may differ from variance in the Y-direction. We let σx2(z) and σy2(z) represent the variances in the X-direction and Y-direction, respectively. Of particular interest are the variances in the near field and far field limits. We let σ0x2(z) and σ0y2(z) represent variances in the X-direction and Y-direction, respectively, in the near field limit, and we let σ∞x2(z) and σ∞y2(z) represent variances in the X-direction and Y-direction, respectively, in the far field limit. For a laser beam having a time-averaged intensity profile I(x, y, z) with Fourier transform Ĩ(vx, vy) (where vxand vyare spatial frequencies in the X-direction and Y-direction, respectively), the near field and far field variances in the X-direction and Y-direction are given by the following expressions: σ0x2(z)=∫-∞∞∫-∞∞x2I(x,y,z)dxdy∫-∞∞∫-∞∞I(x,y,z)dxdy(3)σ0y2(z)=∫-∞∞∫-∞∞y2I(x,y,z)dxdy∫-∞∞∫-∞∞I(x,y,z)dxdy(4)σ∞x2=∫-∞∞∫-∞∞vx2I˜(vx,vy)dvxdvy∫-∞∞∫-∞∞I˜(vx,vy)dvxdvy(5)σ∞y2=∫-∞∞∫-∞∞vy2I˜(vx,vy)dvxdvy∫-∞∞∫-∞∞I˜(vx,vy)dvxdvy(6) The variance quantities σ0x2(z), σ0y2(z), σ∞x2, and σ∞y2are also known as the diagonal elements of the Wigner distribution (see ISO 11146-2:2005(E)). These variances can be quantified for an experimental laser beam using the measurement techniques described in Section 7 of ISO 11146-2:2005(E). In brief, the measurement uses a linear unsaturated pixelated detector to measure I(x, y) over a finite spatial region that approximates the infinite integration area of the integral equations which define the variances and the centroid coordinates. The appropriate extent of the measurement area, background subtraction and the detector pixel resolution are determined by the convergence of an iterative measurement procedure described in Section 7 of ISO 11146-2:2005(E). The numerical values of the expressions given by equations 1-6 are calculated numerically from the array of intensity values as measured by the pixelated detector. Through the Fourier transform relationship between the transverse amplitude profile ũ(x, y, z) for an arbitrary optical beam (where I(x, y, z)≡|ũ(x, y, z)|2) and the angular spectrum (often referred to as the spatial frequency distribution) {tilde over (P)}(vx, vy, z) for an arbitrary optical beam (where Ĩ(vx, vy)≡|{tilde over (P)}(vx, vy, z)|2), it can be shown that: σx2(z)=σ0x2(z0x)+λ2σ∞x2(z−z0x)2(7) σy2(z)=σ0y2(z0y)+λ2σ∞y2(z−z0y)2(8) In equations (7) and (8), σ0x2(z0x) and σ0y2(z0y) are minimum values of σ0x2(z) and σ0y2(z), which occur at waist positions z0xand z0yin the x-direction and y-direction, respectively, and λ is the wavelength of the laser beam. Equations (7) and (8) indicate that σx2(z) and σy2(z) increase quadratically with z in either direction from the minimum values associated with the waist position of the laser beam (e.g., the waist portion of the laser beam focal line). Further, in the embodiments described herein comprising a beam spot114that is axisymmetric and thereby comprises an axisymmetric intensity distribution I(x,y), σ0x2(z)=σy2(z) and in the embodiments described herein comprising a beam spot114that is non-axisymmetric and thereby comprises a non-axisymmetric intensity distribution I(x,y), σ0x(z)#σy2(z), i.e., σx2(z)<σy2(z) or σx2(z)>σy2(z). Equations (7) and (8) can be rewritten in terms of a beam propagation factor M2, where separate beam propagations factors Mx2and My2for the x-direction and the y-direction are defined as: Mx2≡4πσ0xσ∞x(9) My2≡4πσ0yσ∞y(10) Rearrangement of Equations (9) and (10) and substitution into Equations (7) and (8) yields: σx2(z)=σ0x2(z0x)+λ2Mx4(4πσ0x)2(z-z0x)2(11)σy2(z)=σ0y2(z0y)+λ2My4(4πσ0y)2(z-z0y)2(12) which can be rewritten as: σx2(z)=σ0x2(z0x)[1+(z-z0x)2ZRx2](13)σy2(z)=σ0y2(z0y)[1+(z-z0y)2ZRy2](14) where the Rayleigh ranges ZRxand ZRyin the x-direction and y-direction, respectively, are given by: ZRx=4πσ0x2Mx2λ(15)ZRy=4πσ0y2My2λ(16) The Rayleigh range corresponds to the distance (relative to the position of the beam waist as defined in Section 3.12 of ISO 11146-1:2005(E)) over which the variance of the laser beam doubles (relative to the variance at the position of the beam waist) and is a measure of the divergence of the cross-sectional area of the laser beam. Further, in the embodiments described herein comprising a beam spot114that is axisymmetric and thereby comprises an axisymmetric intensity distribution I(x,y), ZRx=ZRyand in the embodiments described herein comprising a beam spot114that is non-axisymmetric and thereby comprises a non-axisymmetric intensity distribution I(x,y), ZRx≠ZRy, i.e., ZRx<ZRyor ZRx>ZRy. The Rayleigh range can also be observed as the distance along the beam axis at which the optical intensity decays to one half of its value observed at the beam waist location (location of maximum intensity). Laser beams with large Rayleigh ranges have low divergence and expand more slowly with distance in the beam propagation direction than laser beams with small Rayleigh ranges. The formulas above can be applied to any laser beam (not just Gaussian beams) by using the intensity profile I(x, y, z) that describes the laser beam. In the case of the TEM00mode of a Gaussian beam, the intensity profile is given by: I(x,y)=π2woe-2(x2+y2)wo2(17) where wois the radius (defined as the radius at which beam intensity decreases to 1/e2of the peak beam intensity of the beam at a beam waist position zo. From Equation (17) and the above formulas, we obtain the following results for a TEM00Gaussian beam: σ0x2=σ0y2=wo24(18)σ∞x2=σ∞y2=14π2wo2(19)Mx2=4πσ0xσ∞x=1(20)My2=4πσ0yσ∞y=1(21)ZRx=4πσ0x2Mx2λ=πw02λ(22)ZRy=4πσ0y2My2λ=πw02λ(23)w2(z)=w02+λ2(πw0)2(z-z0)2=w02[1+(z-z0)2ZR2](24) where ZR=ZRx=ZRy. For Gaussian beams, it is further noted that M2=Mx2=My2=1. Beam cross section is characterized by shape and dimensions. The dimensions of the beam cross section are characterized by a spot size of the beam. For a Gaussian beam, spot size is frequently defined as the radial extent at which the intensity of the beam decreases to 1/e2of its maximum value, denoted in Equation (17) as w0. The maximum intensity of a Gaussian beam occurs at the center (x=0 and y=0 (Cartesian) or r=0 (cylindrical)) of the intensity distribution and radial extent used to determine spot size is measured relative to the center. Beams with axisymmetric (i.e. rotationally symmetric around the beam propagation axis Z) cross sections can be characterized by a single dimension or spot size that is measured at the beam waist location as specified in Section 3.12 of ISO 11146-1:2005(E). For a Gaussian beam, Equation (17) shows that spot size is equal to wo, which from Equation (18) corresponds to 2σ0xor 2σ0y. For an axisymmetric beam having an axisymmetric cross section, such as a circular cross section, σ0x=σ0y. Thus, for axisymmetric beams, the cross section dimension may be characterized with a single spot size parameter, where wo=2σ0. Spot size can be similarly defined for non-axisymmetric beam cross sections where, unlike an axisymmetric beam, σ0x≠σ0y. Thus, when the spot size of the beam is non-axisymmetric, it is necessary to characterize the cross-sectional dimensions of a non-axisymmetric beam with two spot size parameters: woxand woyin the x-direction and y-direction, respectively, where wox=2σ0x(25) woy=2σ0y(26) Further, the lack of axial (i.e. arbitrary rotation angle) symmetry for a non-axisymmetric beam means that the results of a calculation of values of σ0xand σ0ywill depend on the choice of orientation of the X-axis and Y-axis. ISO 11146-1:2005(E) refers to these reference axes as the principal axes of the power density distribution (Section 3.3-3.5) and in the following discussion we will assume that the X and Y axes are aligned with these principal axes. Further, an angle ϕ about which the X-axis and Y-axis may be rotated in the cross-sectional plane (e.g., an angle of the X-axis and Y-axis relative to reference positions for the X-axis and Y-axis, respectively) may be used to define minimum (wo,min) and maximum values (wo,max) of the spot size parameters for a non-axisymmetric beam: wo,min=2σ0,min(27) wo,max=2σ0,max(28) where 2σ0,min=2σ0x(ϕmin,x)=2σ0y(ϕmin,y) and 2σ0,max=2σ0x(ϕmax,x) 2σ0y(ϕmax,y) The magnitude of the axial asymmetry of the beam cross section can be quantified by the aspect ratio, where the aspect ratio is defined as the ratio of wo,maxto wo,min. An axisymmetric beam cross section has an aspect ratio of 1.0, while elliptical and other non-axisymmetric beam cross sections have aspect ratios greater than 1.0, for example, greater than 1.1, greater than 1.2, greater than 1.3, greater than 1.4, greater than 1.5, greater than 1.6, greater than 1.7, greater than 1.8, greater than 1.9, greater than 2.0, greater than 3.0, greater than 5.0, greater than 10.0, or the like To promote uniformity of defects in a transparent workpiece along the beam propagation direction (e.g. depth dimension of the transparent workpiece), a laser beam having low divergence may be used. In one or more embodiments, laser beams having low divergence may be utilized for forming defects. As noted above, divergence can be characterized by the Rayleigh range. For non-axisymmetric beams, Rayleigh ranges for the principal axes X and Y are defined by Equations (15) and (16) for the X-direction and Y-direction, respectively, where it can be shown that for any real beam, Mx2>1 and My2>1 and where σ0x2and σ0y2are determined by the intensity distribution of the laser beam. For symmetric beams, Rayleigh range is the same in the X-direction and Y-direction and is expressed by Equation (22) or Equation (23). Low divergence correlates with large values of the Rayleigh range and weak diffraction of the laser beam. Beams with Gaussian intensity profiles may be less preferred for laser processing to form defects because, when focused to the small enough spot sizes (such as spot sizes in the range of microns, such as about 1-5 μm or about 1-10 μm) needed to achieve laser pulse energies sufficient to modify materials such as glass, they are highly diffracting and diverge significantly over short propagation distances. To achieve low divergence, it is desirable to control or optimize the intensity distribution of the pulsed laser beam to reduce diffraction. Pulsed laser beams may be non-diffracting or weakly diffracting. Weakly diffracting laser beams include quasi-non-diffracting laser beams. Representative weakly diffracting laser beams include Bessel beams, Gauss-Bessel beams, Airy beams, Weber beams, and Mathieu beams. For non-axisymmetric beams, the Rayleigh ranges ZRxand ZRyare unequal. Equations (15) and (16) indicate that ZRxand ZRydepend on σ0xand σ0y, respectively, and above we noted that the values of σ0xand σ0ydepend on the orientation of the X-axis and Y-axis. The values of ZRxand ZRywill accordingly vary, and each will have a minimum value and a maximum value that correspond to the principal axes, with the minimum value of ZRxbeing denoted as ZRx,minand the minimum value of of ZRybeing denoted ZRy,minfor an arbitrary beam profile ZRx,minand ZRy,mincan be shown to be given by ZRx,min=4πσ0,min2Mx2λ(29) and ZRy,min=4πσ0,min2My2λ(30) Since divergence of the laser beam occurs over a shorter distance in the direction having the smallest Rayleigh range, the intensity distribution of the laser beam used to form defects may be controlled so that the minimum values of ZRxand ZRy(or for axisymmetric beams, the value of ZR) are as large as possible. Since the minimum value ZRx,minof ZRxand the minimum value ZRy,minof ZRydiffer for a non-axisymmetric beam, a laser beam112may be used with an intensity distribution that makes the smaller of ZRx,minand ZRy,minas large as possible when forming damage regions. In different embodiments, the smaller of ZRx,minand ZRy,min(or for axisymmetric beams, the value of ZR) is greater than or equal to 50 μm, greater than or equal to 100 μm, greater than or equal to 200 μm, greater than or equal to 300 μm, greater than or equal to 500 μm, greater than or equal to 1 mm, greater than or equal to 2 mm, greater than or equal to 3 mm, greater than or equal to 5 mm, in the range from 50 μm to 10 mm, in the range from 100 μm to 5 mm, in the range from 200 μm to 4 mm, in the range from 300 μm to 2 mm, or the like. The values and ranges for the smaller of ZRx,minand ZRy,min(or for axisymmetric beams, the value of ZR) specified herein are achievable for different wavelengths to which the workpiece is transparent through adjustment of the spot size parameter wo,mindefined in Equation (27). In different embodiments, the spot size parameter wo,minis greater than or equal to 0.25 μm, greater than or equal to 0.50 μm, greater than or equal to 0.75 μm, greater than or equal to 1.0 μm, greater than or equal to 2.0 μm, greater than or equal to 3.0 μm, greater than or equal to 5.0 μm, in the range from 0.25 μm to 10 μm, in the range from 0.25 μm to 5.0 μm, in the range from 0.25 μm to 2.5 μm, in the range from 0.50 μm to 10 μm, in the range from 0.50 μm to 5.0 μm, in the range from 0.50 μm to 2.5 μm, in the range from 0.75 μm to 10 μm, in the range from 0.75 μm to 5.0 μm, in the range from 0.75 μm to 2.5 μm, or the like. Non-diffracting or quasi-non-diffracting beams generally have complicated intensity profiles, such as those that decrease non-monotonically vs. radius. By analogy to a Gaussian beam, an effective spot size wo,effcan be defined for non-axisymmetric beams as the shortest radial distance, in any direction, from the radial position of the maximum intensity (r=0) at which the intensity decreases to 1/e2of the maximum intensity. Further, for axisymmetric beams wo,effis the radial distance from the radial position of the maximum intensity (r=0) at which the intensity decreases to 1/e2of the maximum intensity. A criterion for Rayleigh range based on the effective spot size wo,efffor non-axisymmetric beams or the spot size w for axisymmetric beams can be specified as non-diffracting or quasi non-diffracting beams for forming damage regions using equation (31) for non-axisymmetric beams of equation (32) for axisymmetric beams, below: SmallerofZRx,min,ZRy,min>FDπw0,eff2λ(31)ZR>FDπw02λ(32) where FDis a dimensionless divergence factor having a value of at least 10, at least 50, at least 100, at least 250, at least 500, at least 1000, in the range from about 10 to about 2000, in the range from about 50 to about 1500, in the range from about 100 to about 1000. By comparing Equation (31) to Equation (22) or (23), one can see that for a non-diffracting or quasi non-diffracting beam the distance, Smaller of ZRx,min, ZRy,minin Equation (31), over which the effective beam size doubles, is FDtimes the distance expected if a typical Gaussian beam profile were used. The dimensionless divergence factor FDprovides a criterion for determining whether or not a laser beam is quasi-non-diffracting. As used herein, the laser beam112is considered quasi-non-diffracting if the characteristics of the laser beam satisfy Equation (31) or Equation (32) with a value of FD≥10. As the value of FDincreases, the laser beam112approaches a more nearly perfect non-diffracting state. Moreover, it should be understood that Equation (32) is merely a simplification of Equation (31) and as such, Equation (31) mathematically describes the dimensionless divergence factor FDfor both axisymmetric and non-axisymmetric pulsed laser beams. Referring now toFIGS.1A-1C, an example transparent workpiece160is schematically depicted undergoing laser processing according to the methods described herein. In particular,FIGS.1A-1Cschematically depict directing a laser beam112that is output by a beam source110, such as a Gaussian beam source, and oriented along a beam pathway111into the transparent workpiece160at a beam propagation angle θbpsuch that a portion of the laser beam112directed into the transparent workpiece160comprises a laser beam focal line113that is not orthogonal to an impingement surface162of the transparent workpiece160and instead comprises an internal beam angle θbi. The laser beam112forms a beam spot114projected onto the impingement surface162of the transparent workpiece160, which further comprises an opposite surface164and an edge surface166extending between the impingement surface162and the opposite surface164. The laser beam focal line113generates an induced absorption within the transparent workpiece160to produce a defect172within the transparent workpiece160. Because the laser beam focal line113comprises an internal beam angle θbi, the defect172formed by induced absorption comprises a defect angle θdequal to or about equal to the internal beam angle θbi. In other words, the defects172formed in the embodiments described herein comprise angled defects, where “angled” refers to an angular deviation from the direction normal to the impingement surface162at impingement location115. Laser beam focal line113is correspondingly angled. Moreover, the laser beam112is phase modified by a phase-altering optical element120. When the laser beam112impinges the impingement surface162of the transparent workpiece160at a beam propagation angle θbp, the laser beam112forms a laser beam focal line113having an internal beam angle θbi. Furthermore, because of the phase modification applied by the phase-altering optical element120, when the laser beam focal line113has an internal beam angle θbigreater than 10°, the laser beam focal line113exhibits quasi-non-diffracting character (as mathematically defined above in Eqs. (31) and (32)) within the transparent workpiece160. Referring now toFIG.1C, each of the beam propagation angle θbp, the internal beam angle θbi, and the defect angle θdare measured relative to a plane orthogonal to the impingement surface162at an impingement location115(i.e., the orthogonal plane106). The impingement location115is a specific location on the impingement surface162where the laser beam112is first incident to and initially contacts the impingement surface162. When the laser beam112(including the laser beam focal line113) and the transparent workpiece160are translated relative to one another, the impingement location115changes such that, when the impingement surface162comprises a variable topography, the orthogonal plane106may change. Further, the beam propagation angle θbpcomprises the average angle of light rays of the laser beam112impinging the impingement surface162relative to the orthogonal plane106. As shown inFIG.1C, the laser beam112impinging the impingement surface162includes a maximum beam propagation angle θbmax, which is the angle of the light rays of the laser beam112having the largest angle at the impingement surface162relative to the orthogonal plane106, and a minimum beam propagation angle θbmin, which is the angle of the light rays of the laser beam112having the smallest angle at the impingement surface162relative the orthogonal plane106. In some embodiments, as shown inFIGS.1A and1C, the laser beam112may be focused into the laser beam focal line113using a lens132, which is an aspheric lens. In embodiments, the laser beam focal line113may further include a plurality of rays. Each individual ray of the plurality of rays may have the same phase, ϕ, when converging to form the circular angular spectrum within the transparent workpiece. While a single lens132is depicted inFIGS.1A and1C, some embodiments may include a lens assembly130including a first lens131and a second lens132, and repetitions thereof (FIGS.2A and2B) to focus the laser beam112into the laser beam focal line113. Other standard optical elements (e.g. prisms, beam splitters etc.) may also be included in lens assembly130. As depicted inFIG.1C, the laser beam112may comprise an annular shape when impinging the lens132. While the lens132is depicted focusing the laser beam112into the laser beam focal line113inFIG.1A, other embodiments may use the phase-altering optical element120, which modifies the phase of the laser beam112, to also focus the laser beam112into the laser beam focal line113, as depicted inFIG.1B(i.e., to both phase modify and focus the laser beam112). The laser beam focal line113may have a length in a range of from about 0.1 mm to about 100 mm or in a range of from about 0.1 mm to about 10 mm. Various embodiments may be configured to have a laser beam focal line113with a length1of about 0.1 mm, about 0.2 mm, about 0.3 mm, about 0.4 mm, about 0.5 mm, about 0.7 mm, about 1 mm, about 2 mm, about 3 mm, about 4 mm, or about 5 mm e.g., from about 0.5 mm to about 5 mm. In operation, the laser processing depicted inFIGS.1A-1Cfurther includes translating at least one of the laser beam focal line113and the transparent workpiece160relative to each other in a translation direction101along a contour line165(i.e., a line of desired separation) to form a plurality of defects172. The plurality of defects172form a contour170, which may be used to separate the transparent workpiece160into a plurality of separated articles260′,360′,460′ (FIGS.8B,9B,10B). The defects172may extend, for example, through the depth (i.e., the thickness) of the transparent workpiece160. Referring now toFIGS.2A and2B, an optical assembly100for producing the laser beam112that is phase modified such that it forms the laser beam focal line113having an internal beam angle θbigreater than 100 in the transparent workpiece160and having a quasi-non-diffracting character in the transparent workpiece160using the phase-altering optical element120is schematically depicted. The optical assembly100includes the beam source110that outputs the laser beam112, the phase-altering optical element120, and, in some embodiments, a lens assembly130. The beam source110may comprise any known or yet to be developed beam source110configured to output laser beams112, for example, pulsed laser beams or continuous wave laser beams. In some embodiments, the beam source110may output a laser beam112comprising a wavelength of, for example, 1064 nm, 1030 nm, 532 nm, 530 nm, 355 nm, 343 nm, or 266 nm, or 215 nm. The laser beam112used to form defects172in the transparent workpiece160may be well suited for materials that are transparent to the selected laser wavelength and the transparent workpiece160may be positioned such that the laser beam112output by the beam source110irradiates the transparent workpiece160, for example, after impinging the phase-altering optical element120and thereafter, the lens assembly130. Further, the beam pathway111may extend from the beam source110to the transparent workpiece160such that when the beam source110outputs the laser beam112, laser beam traverses (or propagates along) the beam pathway111. In the embodiment depicted inFIGS.2A and2B, the lens assembly130comprises two sets of lenses, each set comprising the first lens131positioned upstream the second lens132. The first lens131may collimate the laser beam112within a collimation space134between the first lens131and the second lens132and the second lens132may focus the laser beam112. Further, the most downstream positioned second lens132of the lens assembly130may focus the laser beam112into the transparent workpiece160, which may be positioned at an imaging plane104of this second lens132. In some embodiments, the first lens131and the second lens132each comprise plano-convex lenses. When the first lens131and the second lens132each comprise plano-convex lenses, the curvature of the first lens131and the second lens132may each be oriented toward the collimation space134. In other embodiments, the first lens131may comprise other collimating lenses and the second lens132may comprise a meniscus lens, an asphere, or another higher-order corrected focusing lens. In operation, the lens assembly130may control the position of the laser beam focal line113along the beam pathway111. Further, the lens assembly130may comprise an8F lens assembly, as depicted inFIGS.2A and2B, a 4F lens assembly comprising a single set of first and second lenses131,132, or any other known or yet to be developed lens assembly130for focusing the laser beam112into the laser beam focal line113. Moreover, it should be understood that some embodiments may not include the lens assembly130and instead, the phase-altering optical element120may focus the laser beam112into the laser beam focal line113. Referring still toFIGS.2A and2B, the phase-altering optical element120is positioned within the beam pathway111between the beam source110and the transparent workpiece160, in particular, between the beam source110and the lens assembly130such that the laser beam112impinges the phase-altering optical element120before the laser beam112is focused into the laser beam focal line113and directed into the transparent workpiece160. In some embodiments, as shown inFIG.2A, the beam source110is positioned such that the beam pathway111is redirected by the phase-altering optical element120and the laser beam112reflects off the phase-altering optical element120when the laser beam112impinges the phase-altering optical element120. In this embodiment, the phase-altering optical element120may comprise an adaptive phase-altering optical element122, such as a spatial light modulator, a deformable mirror, an adaptive phase plate, or any other optical element configured to actively alter a change in phase applied by the optical element to the laser beam112. In other embodiments, as shown inFIG.2B, the beam source is110is positioned such that the beam pathway111extends through the phase-altering optical element120and the laser beam112traverses the phase-altering optical element120when the laser beam112impinges the phase-altering optical element120. In this embodiment, the phase-altering optical element120may comprise a static phase-altering optical element123, such as an aspheric optical element or a static phase plate. One aspheric optical element used in embodiments described herein is an oblong axicon. Thus, in some embodiments, the phase-altering optical element120is a refractive optical element and in other embodiments, the phase-altering optical element120is a reflective optical element. In some embodiments, after the laser beam112impinges a phase-altering optical element120, each individual ray of the plurality of rays of the laser beam112may have a different angle relative to the excidence surface of phase-altering optical element120, varying based on azimuthal angle at a given radial position. As used herein “excidence surface” refers to the surface of phase-altering optical element120from which a ray propagates to a position downstream of the phase-altering optical element120. In embodiments in which laser beam112is directed in the downstream direction without passing through phase-altering element120(e.g.FIG.2A), the excidence surface corresponds to the surface of incidence. In embodiments in which a laser beam112is directed in the downstream direction after passing through phase-altering optical element120(e.g.FIG.2B), the excidence surface corresponds to the downstream surface of phase-altering optical element120.) Excidence surface may also be referred to herein as the exit surface of phase-altering optical element120. As used herein, “azimuthal angle” of a ray refers to angular position of the point of intersection of the ray with the excidence surface of phase-altering element120. InFIGS.2A and2B, for example, the excidence surface of phase-altering element120coincides with an XY plane and the intersection of beam propagation direction Z with the XY plane defines a reference point in the XY plane about which radial position and azimuthal angle are defined. Radial position is distance from the reference point and corresponds to distance from the Z-axis. Azimuthal angle extends from 0° to 360° for one revolution in the XY plane about the reference point. The direction in the XY plane corresponding to an azimuthal angle of 0° is arbitrary and can, for example, be selected to correspond to the X-direction. The ray angle is the angle of the ray relative to a normal from the excidence surface. Azimuthal variation of the ray angle occurs, for example, when the phase-altering optical element is an egg-shaped axicon (described below). In such embodiments, multiple rays, originating with different ray angles from different radial positions of the excidence surface of the phase-altering optical element, converge to form a particular point along the laser beam focal line113. Because of the difference in radial position, the optical path lengths of the individual rays converging to (or intersecting at) a particular point along the laser beam focal line113differ. As used throughout this disclosure, the term “optical path length” refers to the distance between the excidence surface of the phase-altering optical element120and the laser beam focal line113. This difference in optical path length leads to a difference in phase of the different rays converging to a particular point along the laser beam focal line113and this difference in phase leads to destructive interference that diminishes the intensity of the laser beam focal line113, thus inhibiting formation of defects and compromising the ability use the laser beam focal line113to cut and the separate transparent workpiece160. Therefore, in order for the laser beam112at the laser beam focal line113to exhibit a quasi-non-diffracting character, each individual ray of the plurality of rays within the laser beam focal line113must have the same phase, ϕ, when converging to form the angular spectrum, as previously stated. To correct the phase of the plurality of rays converging to a particular point along the laser beam focal line113, in embodiments, a phase correction may be applied to the phase-altering optical element120. The phase correction may be constant with regards to radial distance (position), but may vary with azimuthal position (angle). This allows the phase correction to correct the phase of individual rays of the plurality of rays, such that rays that converge and intersect at a particular point along the laser beam focal line113have the same phase, ϕ. This is necessary in order to forma laser beam focal line113exhibiting a quasi-non-diffracting character without destructive interference and without affecting the shape of the angular spectrum formed by the intersecting rays. Without intending to be bound by theory, this may result in a small, high-intensity, symmetrical (or almost symmetrical) quasi-non-diffracting beam. If the phase correction were not applied by the phase-altering optical element120when forming the quasi-non-diffracting beam, the laser beam focal line113within the transparent workpiece160would be aberrated. In embodiments, a phase-aberrated laser beam focal line may have lower intensity, may have a larger cross-section, and/or may be asymmetrical. As such, a phase-aberrated laser beam focal line may be incapable of forming a defect in a glass substrate, or may perform worse than a laser beam focal line113as disclosed herein where the phase correction was applied. To develop the phase correction, a vectorized form of Snell's law is used: s→2=n1n2[N→(-N→×s1→)]-N→1-(n1n2)2(N→×s1→)·(N→×s1→)(33) where {right arrow over (s1)} is the direction (relative to a normal to the impingement surface162) of an individual ray in the transparent workpiece160, {right arrow over (s2)} is the direction (relative to a normal to the impingement surface162) of an individual ray in air (or other medium immediately upstream of impingement surface162), n1is the refractive index of the transparent workpiece160, n2is the refractive index of air (or other medium immediately upstream of impingement surface162), and {right arrow over (N)} is the orthogonal plane106relative to the impingement surface162. After refraction of the rays at the impingement surface162, the polar angle (angle of refraction of the ray into transparent workpiece160, equivalent to θbi) of each individual ray will vary based on the azimuthal angle of the ray at impingement surface162, and the incoming laser beam112after passing through (or being reflected from) the phase-altering optical element120may no longer be radially symmetric about a central or principal axis of the phase-altering optical element120. The propagation direction of the laser beam refracted into the transparent workpiece160at the impingement surface162will be angled with respect to the direction of incidence at impingement surface162as expressed below: θCoM=sin-1(n1n2sin(θsurf))(34) where θsurfis the angle between the direction of incidence of the laser beam and the impingement surface162and θCoMis the polar angle (θbi), which defines the direction of beam propagation (and also defines the principal optical axis) in transparent workpiece160. To determine the phase correction, a laser beam focal line113oriented at a particular angle θbiis conceptualized inside the transparent workpiece160. The conceptualized laser beam focal line consists of a series of focal points, each of which corresponds to an intersection of a plurality of phase-matched converging rays emanating from the exit surface of the phase-altering optical element120as described above. Each ray of the conceptualized laser beam focal line propagates with a direction {right arrow over (s1)} in the transparent workpiece160and can be traced back from the conceptualized laser beam focal line within the transparent workpiece160through the impingement surface162to the medium immediately upstream of impingement surface162. Equation (33) can be used determine the direction {right arrow over (s2)} for each ray in the medium immediately upstream of impingement surface162necessary to produce the conceptualized laser beam focal line. The direction {right arrow over (s2)} defines the position (azimuthal and radial) of the point of origin of each ray from the exit surface of the phase-altering optical element120and the angle θrefof each ray relative to the normal of the exit surface of the phase-altering optical element120. From θref, the phase imparted to laser beam112at each point of the exit surface of phase-altering optical element120(e.g. phase mask150shown inFIG.3B) can be determined from equation (35), where ϕeggrepresents the phase mask defined for the phase-altering optical element120, k0represents the wavenumber of the beam in air (or other medium between the phase-altering optical element120and impingement surface162), and ρ represents the distance from the center of the phase mask in radial coordinates: ϕegg=k0ρ tan(θref) (35) The correction embodied in phase mask ϕeggis sufficient to produce rays which all have the same polar angle with respect to the primary optical axis within the workpiece. This means that the beam within the workpiece will have a circular angular spectrum similar to that of a unaberrated Bessel beam. These rays will intersect on the laser beam focal line113when the impingement surface162is placed at the focal point of the lens132(or the most downstream focal point of lens assembly130). In this situation, laser beam focal line113initiates at impingement surface162. While rays will intersect in the focal line with the same polar angle, path length differences due to different lengths traveled in air and the glass workpiece may cause aberrated foci to form. Additionally, it may be desirable to move the transparent workpiece160along the Z-direction and impingement surface162away from the focal point of the lens132. In such embodiments, additional aberrations due to the path length difference will reduce the maximum intensity of the laser beam focal line113. To then develop a phase correction for θref, first, an offset ζ is chosen that represents the distance from the focal point of the lens132(where an optical conjugate image of the phase mask is formed) to the impingement surface162of the transparent workpiece160. Then, a phase correction may be added on ϕeggto correct for the phase shift induced by the path length difference for each ray. To find this correction, the optical distance, OD, accounting for the refractive index, is first found for each ray, using equation 33 to account for refraction at the impingement surface162: OD=ngdg+nada(36) where dgrepresents the distance for each ray from a point on the laser beam focal line113to its intersection with the impingement surface162, and darepresents the distance for each ray from the impingement surface162to the conjugate image plane of the phase mask at the focal point of the lens132. OD will then be an array of the optical distance traveled for each ray from the point where it intersects to form the laser beam focal line113to the conjugate image plane of the phase mask. dgand damay be found using a simple geometric intersection of a line and a plane, along with equation (33) to determine the change in each ray's direction at the impingement surface. The phase offset in radians for each individual ray is given by the distance traveled multiplied by the wavenumber k0, where k0=2π/λ: ϕOD=k0*OD(37) Since OD is an array, ϕODwill represent an array consisting of the phase correction for each ray in a bundle of rays starting from points along the laser beam focal line113. The resolution of ϕODmay be controlled by changing the number of rays in the bundle. Additionally, a linear or cubic interpolation function may be used along with the final spatial location of each ray to create a smooth phase mask. Therefore, a corrected phase mask ϕmaskfor phase-altering optical element120may be created with the following formula: ϕmask=ϕegg−ϕOD(37) In operation, impinging the laser beam112on the phase-altering optical element120alters the phase of the laser beam112and when directed into the transparent workpiece160at a beam propagation angle θbp, a portion of the laser beam112comprising the laser beam focal line113within the transparent workpiece160comprises an internal beam angle θbiof greater than 10° and comprises a quasi-non-diffracting character within the transparent workpiece160. For example, the internal beam angle θbimay be from 10° to 40°, such as 10° to 35°, 15° to 40°, 20° to 40°, or the like, for example, 110, 12°, 13°, 14°, 15°, 16°, 17, 18°, 19°, 20°, 21°, 22°, 23°, 24°, 25°, 26°, 27°, 28°, 29°, 30°, 31°, 32°, 33° 34°, 35°, 36°, 37° 38°, 39° or the like. In embodiments, after impinging the laser beam112on the phase-altering optical element120, a portion of the laser beam focal line113may extend outside of the transparent workpiece160, forming an external laser beam focal line117situated in the free space above (upstream) the transparent workpiece160(FIG.1). For example, the external laser beam focal line117may extend at least 0.01 mm, at least 0.02 mm, at least 0.03 mm, at least 0.05 mm, at least 0.07 mm, at least 0.1 mm, at least 0.2 mm, at least 0.3 mm, at least 0.5 mm, or at least 1 mm above (upstream) the transparent workpiece. While not intending to be limited by theory, after the laser beam112has been phase modified by the phase-altering optical element120, the external laser beam focal line117comprises a circular or approximately circular angular spectrum and the laser beam focal line113within transparent workpiece160comprises a circular or approximately circular angular spectrum. Each of the external laser beam focal line117and laser beam focal line113within transparent workpiece160has a Rayleigh defined by a divergence factor FDgreater than or equal to 10. In embodiments, the laser beam112is aberrated (that is, has a non-circular angular spectrum) when the laser beam is upstream from the formation of the external laser beam focal line117or the transparent workpiece160, and upon refraction of the laser beam112at the impingement surface162of the transparent workpiece160, the laser beam112exhibits a quasi-non-diffracting character with minimal to no aberrations within the transparent workpiece160(that is, the laser beam focal line113within transparent workpiece160has a circular or approximately circular angular spectrum). Moreover, while the laser beam focal lines113depicted in the figures extend from the impingement surface162to the opposite surface164, this merely illustrates one possible disposition of the laser beam focal line113in and near the transparent workpiece160. In particular, it should be understood that a portion of the laser beam focal line113may extend outside of the transparent workpiece160, for example, above (upstream) the impingement surface162, beyond (downstream) the opposite surface164, beyond the edge surface166, or combinations thereof. Further, when a portion of the laser beam focal line113extends outside of the transparent workpiece160, that external portion of the laser beam focal line113comprises an external focal line angle which, due to Snell's law, is greater than the internal beam angle θbi. Moreover, it should be understood that the laser beam focal line113may start at a location within the transparent workpiece160(e.g., between the impingement surface162and the opposite surface164) and end at a location within the transparent workpiece160(e.g., between the impingement surface162and the opposite surface164). As stated previously, the external laser beam focal line117may comprise a circular or approximately circular angular spectrum and the laser beam focal line113may also comprise a circular or approximately circular angular spectrum within the transparent workpiece160. For the laser beam112to have a circular angular spectrum in both free space (i.e. for the external laser beam focal line117to have a circular angular spectrum) and a circular angular spectrum within the transparent workpiece160(i.e. for the laser beam focal line113to have a circular angular spectrum within the transparent workpiece160), two different phase shifts must be applied to separate portions of the laser beam112. In embodiments, one phase shift, referred to here as a “circular phase shift,” would result in a circular angular spectrum in free space and an oblong angular spectrum within the transparent workpiece160. In embodiments, another phase shift, referred to here as an “oblong phase shift,” would result in an oblong angular spectrum in free space and would result in a circular angular spectrum within the transparent workpiece160. In embodiments, the circular phase shift may be similar to a phase imparted by a circular axicon, and the oblong phase shift may be similar to a phase imparted by an oblong axicon. FIG.3Adepicts an example of oblong angular spectrum140, which may be applied by the phase-altering optical element120to the laser beam112to insure that the laser beam focal line113exhibits essentially aberration-free character at a particular internal beam angle θbigreater than or equal to 100 and a particular spacing between the focal plane of lens132and impingement surface162. The oblong angular spectrum140is designed to correct for aberrations that occur when an angled beam refracts at impingement surface162as well as to correct for aberrations resulting from the path length differences described above. In particular, the embodiment shown inFIG.3Adepicts an oblong angular spectrum140comprising an axis of symmetry142extending from a first axis end144having a first radius of curvature to a second axis end146having a second radius of curvature. Further, the first radius of curvature (i.e., the radius of curvature at the first axis end144) is different than the second radius of curvature (i.e., the radius of curvature at the second axis end146). In other words, the shape of the oblong angular spectrum140is roughly the combination of two different ellipses (or ovals) differing in curvature, and is colloquially referred to herein as an “egg shape.” In addition, the oblong angular spectrum140includes a major axis148(sometimes referred to as a “long axis”) and a minor axis149(sometimes referred to as a “short axis”), where the major axis148is coincident with the axis of symmetry142. FIG.3Bdepicts a phase mask150that may be used by the phase-altering optical element120to phase alter the laser beam112to produce the angular spectrum140shown inFIG.3A. As shown inFIG.3B, the phase mask150of the laser beam112comprises a plurality of phase rings152each inducing a phase shift extending from 0 to 2π, where the phase mask has an x-axis of about 400 pixels and a y-axis of about 300 pixels. Further, the phase rings152in the portion of the phase mask150where x is greater than about 60 pixels and x is less than about 350 pixels each comprise a circular shape similar to a circular angular spectrum. The phase rings152in the portions of the phase mask150where x is less than about 60 pixels and x is greater than about 350 pixels each comprise an oblong shape similar to the oblong angular spectrum140. Indeed, each phase ring152in the portions of the phase mask150where x is less than about 60 pixels and x is greater than about 350 pixels comprises an axis of symmetry extending from a first axis end having a first radius of curvature to a second axis end having a second radius of curvature, where the first radius of curvature is different than the second radius of curvature. However, unlike the oblong angular spectrum140, the minor axis of each phase ring152of the phase mask150is coincident with the axis of symmetry of each phase ring152, instead of the major axis. Without intending to be limited by theory, the oblong angular spectrum140depicted inFIG.3Ais indicative of the particular phase alteration applied to the laser beam112to facilitate the formation of a laser beam focal line113that exhibits quasi-non-diffracting character within the transparent workpiece160after the laser beam112is directed at a high beam propagation angle θbiinto an impingement surface162, which is planar. The oblong angular spectrum140is shaped such that, when the laser beam112(e.g., the laser beam focal line113) is refracted at the impingement surface162(e.g., at the air-glass interface formed at the impingement surface162), the laser beam112within the transparent workpiece160(e.g., the laser beam focal line113) comprises a circular or approximately circular angular spectrum. That is, refraction of the laser beam112having the oblong angular spectrum140at the impingement surface162transforms the angular spectrum of the laser beam112to a less oblong, more circular shape within the transparent workpiece160. For example, in some embodiments, the laser beam112within the transparent workpiece160(e.g., the laser beam focal line113) may have an angular spectrum that has a first radius of curvature and a second radius of curvature, similar to the oblong angular spectrum140; however the angular spectrum of the laser beam112within the transparent workpiece160is more circular (e.g., less oblong) than the oblong angular spectrum140such that a difference between the first radius of curvature and the second radius of curvature of the angular spectrum of the laser beam112within the transparent workpiece160is less than a difference between the first radius of curvature and the second radius of curvature of the oblong angular spectrum140of the laser beam incident to the impingement surface162of the transparent workpiece160. Referring again toFIG.2A, in some embodiments, the phase-altering optical element120may comprise an adaptive phase-altering optical element122which applies a phase alteration to the laser beam112. The adaptive phase-altering optical element122may be communicatively coupled to a controller121, for example, using one or more communications pathways105, which may comprise any pathway for providing power signals, control signals, or the like, such as optical fiber, electrical wire, wireless protocols, or the like. In operation, the controller121may provide control signals to the adaptive phase-altering optical element122to control the specific phase alteration (e.g., modulation, phase mask, or the like) applied by the adaptive phase-altering optical element122, such that the adaptive phase-altering optical element122applies a specific phase alteration to the laser beam112, for example, based on a phase function. In some embodiments, the adaptive phase-altering optical element122comprises a spatial light modulator, which is a transmissive or reflective device that may spatially modulate the amplitude and/or the phase of a laser beam112in at least one dimension, for example, using a phase mask, such as the phase mask150ofFIG.3B. In operation, the spatial light modulator may apply a selective, configurable phase alteration to the laser beam based on control signals from the controller121. In some embodiments, the adaptive phase-altering optical element122comprises a deformable mirror, which is a mirror whose surface can be deformed in response to control signals, such as control signals from the controller121, to alter the wavefront of the laser beam112, which may alter the phase of the laser beam112. For example, a deformable mirror may be configured to apply a phase mask, such as the phase mask150. Further, in some embodiments, the adaptive phase-altering optical element122comprises an adaptive phase plate, which is a phase plate (or phase plate assembly) that can apply selective and controllable phase alteration to the laser beam112in response to control signals, such as control signals from the controller121. For example, the adaptive phase plate may be two or more phase plates moveable relative to one another (based on control signals from the controller121) to alter the phase change they apply to the laser beam112based on their relative positioning. As shown inFIG.2B, in some embodiments, the phase-altering optical element120comprises a static phase-altering optical element123, such as an oblong axicon124, which is depicted in more detail inFIGS.4A and4B. In particular,FIG.4Adepicts a front view of the oblong axicon124andFIG.4Bshows a side view of the oblong axicon124. The oblong axicon124comprises a base portion125and a conical portion126extending from the base portion125. The base portion125comprises an oblong perimeter127having an axis of symmetry128extending from a first axis end129ato a second axis end129b. At the first axis end129a, the oblong perimeter127comprises a first radius of curvature and at the second axis end129b, the oblong perimeter127comprises a second radius of curvature, which is different from the first radius of curvature. In addition, the oblong axicon124comprises a major axis138and a minor axis136. In operation, when the laser beam112traverses the oblong axicon124, the phase alteration applied to the laser beam112results in the laser beam112comprising the oblong angular spectrum140. Moreover, as depicted inFIGS.3A and4A, the shape of the oblong perimeter127of the oblong axicon124corresponds with the oblong angular spectrum140. However, unlike the oblong angular spectrum140, the minor axis136of the oblong perimeter127, instead of the major axis138, is coincident with the axis of symmetry128of the oblong perimeter127of the oblong axicon124. While a single phase-altering optical element120is depicted inFIGS.2A and2B, other embodiments may comprise multiple phase-altering optical elements120, for example, one phase-altering optical element configured to transform the laser beam into a quasi-non-diffracting beam and another phase-altering optical element configured to form the oblong angular spectrum140. While not intending to be limited by theory, it should be understood that Snell's law imposes some limitations on the maximum internal beam angle θbiof the laser beam focal line113formed using the above described techniques. Snell's law is mathematically defined as θ2=sin-1(n1sinθ1n2) where θ1is the angle of an incident light ray in a first medium (e.g., air), θ2is the angle of the ray in a second medium (e.g., the transparent workpiece160), n1is the index of refraction of the first medium (e.g., air, which comprises an index of refraction of about 1), and n2is the index of refraction of the second medium (e.g., the transparent workpiece160, which may comprise about 1.45 in embodiments in which the transparent workpiece160comprises glass). The angles θ1and θ2are measured relative to the normal to the surface of incidence (e.g. impingement surface162) of the light ray. Snell's law provides a fundamental limit on the angle of light (e.g. internal beam angle θbi) that can be achieved within the transparent workpiece160. This limit is the critical angle of the transparent workpiece160. It should be understood that, for a transparent workpiece160comprising another material besides glass, the critical angle would vary based on the index of refraction of that particular material. When the transparent workpiece160comprises glass having an index of refraction of 1.45, the critical angle is about 43.6°. The critical angle is also the internal angle a light ray would take if it contacted the glass with an almost 90° incidence. Thus, Snell's Law limits the internal beam angle θbiof the laser beam focal line113. Furthermore, as depicted inFIG.1C, the laser beam112may comprise a cone shape when it impinges the impingement surface162of the transparent workpiece160, as the laser beam112comprises the maximum beam propagation angle θbmaxand the minimum beam propagation angle θbmin. In some embodiments, the difference between the maximum beam propagation angle θbmaxand the minimum beam propagation angle θbmin(i.e., a cone angle) is a range of 5° to 30°. As an example, if the laser beam112impinges the impingement surface162of the transparent workpiece160with a cone angle of 10°, the maximum internal beam angle θbiof the laser beam focal line113inside the transparent workpiece160would be 33.6°, assuming light could be incident to the transparent workpiece160up to 90°. While not intending to be limited by theory, some reflection of the laser beam112may occur at the impingement surface162of the transparent workpiece160. For example, the reflection of a light ray impinging the impingement surface162at 90° relative to normal the impingement location115will be 100% for both S-polarization and P-polarization and the reflection of a light ray impinging the impingement surface162at angles less than 90 degrees relative to normal the impingement location115will be less than 100% of S-polarization and P-polarization. While the laser beam112may comprise P-polarized light or S-polarized light, P-polarized light may reduce loss due to reflection. For example, at 85 degrees, the reflectance for S-polarized light is 73%, and reflectance for P-polarized light is 49%. In operation, the beam source110, the phase-altering optical element120, or an additional optical component, such as a polarizer, may be used to S-polarize or P-polarize the laser beam112. While still not intending to be limited by theory, if the magnitude of light intensity around the angular spectrum of the laser beam focal line113within the transparent workpiece160is non-uniform, the laser beam focal line113retains a circular angular spectrum and a quasi-non-diffracting character within the transparent workpiece160. However, non-uniform magnitude of light intensity around the angular spectrum of the laser beam focal line113within the transparent workpiece160caused by reflection may be compensated for by launching the laser beam112(i.e., launching the laser beam112from the beam source110) with a non-uniform intensity, where the non-uniform intensity is configured to become uniform around the angular spectrum once the light is refracted at the impingement surface162and enters the transparent workpiece160. Example non-uniform intensity beams that may be used (and then converted into a quasi-non-diffracting beam with an oblong or otherwise non-uniform angular spectrum by the phase-altering optical element120) include an elliptical-Gaussian beam, a top hat beam, or another beam having an arbitrary intensity profile. Referring now toFIGS.1A, and5A-7C, in embodiments, the laser beam may comprise at least a first set of rays510and a second set of rays520, where each first set of rays510and second set of rays520is independently modified by different portions of the phase mask or phase-altering optical element120. In embodiments, the first set of rays510or second set of rays520may be obstructed with an optical blocking element such as610A-C. The optical blocking element may be a blank area in the phase mask150(as shown in black inFIGS.6A-6C) or may be a physical opaque component positioned along the beam pathway111downstream the phase mask (e.g. optional optical blocking element610shown inFIG.2A) or positioned on a lens132(not shown). In embodiments where a refractive optical element is used, the optical blocking element may be a section of the refractive optical element that is flat or diverging. In embodiments, the first set of rays510and the second set of rays520may form segments540A and550A, as shown inFIG.5A. For example, the first set of rays510may define a first segment540A (an exemplary segment having an annular shape) of the laser beam112and the second set of rays520may define a second segment550A (an exemplary segment having a circular shape) of the laser beam112. In embodiments, an average radius r2of the second segment550A may be less than an average radius r1of the first segment540A, meaning that the second segment550A is positioned within the first segment540A. In other embodiments, as shown inFIG.5B, the average radius r2of the second segment550B (an annular segment defined by the second set of rays520) may be greater than the average radius r1of the first segment540B (a circular segment defined by the first set of rays510), meaning that the first segment540B is positioned within the second segment550B. In embodiments, the first set of rays510may comprise a portion of the second set of rays520, or the second set of rays520may comprise a portion of the first set of rays510. The optical blocking element need not be in the shape of a circular annulus or a circular area as shown inFIGS.6A-C. Instead, the optical blocking element may be an oblong annulus, an oblong shape, an ‘egg’ shape or some combination thereof. Additionally, the optical blocking element may be any other shape. In embodiments, to calculate the required length of r1, r2, and r3, the origin of each ray traced from the laser beam focal line may be noted in the array Zoriginwhen the phase corrections are calculated. This may, for example, be recorded as a depth below or above the impingement surface162, or as the Z-coordinate of each ray's origin point. The radii r1, r2, and r3will then be isocurves of Zorigin. Zoriginmay be used directly or interpolated using each ray's final position on the phase mask. The optical blocking element610A-C may be used to block the second set of rays520(as shown inFIGS.5A and6A), or to block the first set of rays510(as shown inFIGS.5B and6B). Referring toFIGS.5A,6A, and7Aspecifically, in embodiments where the average radius r2of the second segment550A is less than an average radius r1of the first segment540A and the phase mask150A is applied, which obstructs the second set of rays520with the optical blocking element610A, the first set of rays510may form a first portion113A1of the laser beam focal line113. The first portion113A1of the laser beam focal line113begins at an origin point710within the transparent workpiece160. As used throughout this disclosure, the term “origin point” refers to the origin of the region of induced absorption for at least a portion of the laser beam focal line113. The region of induced absorption controls the location and length of the defect formed by the processes disclosed herein. Therefore, the “origin point” as defined herein, may ultimately be the origin point for at least a portion of the defect within the transparent workpiece160. For a fixed position of workpiece160relative to a fixed optical system, the position of origin point710is controlled by the diameter of the optical blocking element610A; a larger diameter positions origin point710further away from impingement surface162. The second set of rays520may be configured by phase-altering optical element120such that, if unobstructed, the second set of rays520would form a second portion113B1of the laser beam focal line113extending from impingement surface162up to the origin point710in a beam propagation direction. In embodiments, the first portion113A1of the laser beam focal line113formed by the first set of rays510may comprise an internal focal line angle α1of from 0° to 10° or from 170° to 180° relative to the orthogonal plane106relative to the opposite surface164. If blocking element610A were removed, laser beam focal line113A and laser beam focal line113B1would form simultaneously. In embodiments where the average radius r2of the second segment550A is less than an average radius r1of the first segment540A and the phase mask150B is applied, which obstructs the first set of rays510with the optical blocking element610B, the second set of rays520may form a second portion113B1of the laser beam focal line113extending up to the origin point710in a direction defined by internal focal line angle β1. Laser beam focal line113B1may initiate at, upstream of or downstream of impingement surface162. The size of the opening of optical blocking element610B controls the length of the laser beam focal line113B1; a larger opening leads to a longer laser beam focal line113B1. The laser beam focal line113B1may comprise an internal focal line angle β1of greater than 10° and less than 80° or of greater than 100° and less than 170° relative to the orthogonal plane106relative to the impingement surface162. Referring toFIGS.5B,6B, and7Bspecifically, in other embodiments, the first set of rays510may define a first segment540B of the laser beam112and the second set of rays may520define a second segment550B of the laser beam112, where an average radius r2of the second segment550B may be greater than an average radius r1of the first segment540B, meaning that the first segment540B is positioned within the second segment550B. In embodiments where the average radius r2of the second segment550B is greater than an average radius r1of the first segment540B and the phase mask150B is applied, which obstructs the second set of rays520with the optical blocking element610B, the first set of rays510may form a laser beam focal line113A2that extends from, upstream from, or downstream from impingement surface162to a termination point720within the transparent workpiece160. As used throughout this disclosure, the term “termination point” refers to the termination point of the region of induced absorption for at least a portion of the laser beam focal line113. Similar to the origin point previously described, the “termination point” as defined herein, may ultimately be the termination point for at least a portion of the defect within the transparent workpiece160. The second set of rays520may be configured by phase-altering optical element120such that, if unobstructed, the second set of rays520would form a second portion113B2of the laser beam focal line113that extends beyond the termination point720in a direction defined by internal focal line angle β2. If blocking element610B were removed, laser beam focal line113A2and laser beam focal line113B2would form simultaneously. In embodiments, the first portion113A2of the laser beam focal line113formed by the first set of rays510may comprise an internal focal line angle α2of from 0° to 10° or from 170° to 180° relative to the orthogonal plane106relative to the impingement surface162. In embodiments where an average radius r2of the second segment550B is greater than an average radius r1of the first segment540B and the phase mask150A is applied, which obstructs the first set of rays510with the optical blocking element610A, the second set of rays520may form a second portion113B2of the laser beam focal line113extending beyond the termination point720in a direction defined by internal focal line angle β2. Laser beam focal line113B2may extend partway to, all the way to, or beyond opposite surface164. The laser beam focal line113B2may comprise an internal focal line angle β2of greater than 100 and less than 80° or of greater than 100° and less than 170° relative to the orthogonal plane106relative to the impingement surface164. Referring toFIGS.5C,6A-C, and7C specifically, the laser beam112may comprise a first set of rays510, a second set of rays520, and a third set of rays530, as shown inFIG.5C. In embodiments, the first set of rays510, the second set of rays520, the third set of rays530, or combinations thereof may be obstructed with an optical blocking element, including, but not limited to, the example optical blocking elements610A-C. It is contemplated that more than three optical blocking elements may be used, and that the optical blocking elements may be of any shape. In embodiments, the first set of rays510, the second set of rays520, and the third set of rays530may form a first segment540C (an exemplary circular segment), a second segment550C (an exemplary annular segment), and a third segment560C (an exemplary annular segment), respectively, as shown inFIG.5C. In embodiments, an average radius r1of the first segment540C may be less than an average radius r2of the second segment550C, and the average radius r2of the second segment550C may be less than an average radius r3of the third segment560C. This means that the first segment540C is positioned within the second segment550C, and the second segment550C is positioned within the third segment560C. In embodiments, the second set of rays520may comprise a portion of the third set of rays530, or the third set of rays530may comprise a portion of the second set of rays520. Continuing to refer toFIGS.5C,6A-C, and7C specifically, in embodiments, the first set of rays510may be configured by phase-altering optical element120such that, if unobstructed, the first set of rays510form a first portion113A3of the laser beam focal line113that terminates at a termination point720. The second set of rays520may be configured by phase-altering optical element120such that, if unobstructed, the second set of rays520form a second portion113B3of the laser beam focal line113that extends beyond the termination point720in a beam propagation direction and terminates at a second termination point730within the transparent workpiece160. The third set of rays530may be configured by phase-altering optical element120such that, if unobstructed, the third set of rays530form a third portion113C of the laser beam focal line113extending beyond the second termination point730in a beam propagation direction. The laser beam focal line113A3may comprise an internal focal line angle a of greater than 10° and less than 80° or of greater than 100° and less than 170° relative to the orthogonal plane106relative to the impingement surface162. The laser beam focal line113B3may comprise an internal focal line angle β3of greater than 0° and less than 10° or of greater than 170° and less than 180° relative to the orthogonal plane106relative to the impingement surface162. The laser beam focal line113C may comprise an internal focal line angle γ of greater than 10° and less than 80° or of greater than 100° and less than 170° relative to the orthogonal plane106relative to the impingement surface162. Referring now toFIGS.1A through4B, laser beams112may be used to form high angle defects172in the transparent workpiece160when the impingement surface162comprises a planar topography. However, in other embodiments, the impingement surface162may comprise a non-planar topography, such as a surface having a curved topography, a jagged topography, or an arbitrary, non-planar topography. When the impingement surface162comprises a non-planar topography, the phase-altering optical element120may apply a phase alteration to the laser beam112such that the laser beam112upstream and/or incident the impingement surface162(such as in free space) comprises a non-circular angular spectrum corresponding with the non-planar topography such that the portion of the laser beam focal line113within the transparent workpiece comprises a circular angular spectrum and exhibits a quasi-non-diffracting character. As one example, when the impingement surface162is a consistent, non-planar surface (such as a consistent, curved surface) the phase alteration may be applied by the adaptive phase-altering optical element122or the static phase-altering optical element123. For example, the phase alteration may be applied by a static phase-altering optical element123comprising a non-circular axicon having a base portion and a conical portion extending from the base portion, where the base portion comprises a non-circular perimeter such that the phase alteration applied to the laser beam112by the non-circular axicon forms a non-circular angular spectrum corresponding with the consistent, curved topography of the impingement surface162such that the portion of the laser beam focal line113within the transparent workpiece160comprises a circular angular spectrum, exhibits a quasi-non-diffracting character, and has phase-matched intersecting rays at each position along its length. In some embodiments, the impingement surface162comprises a non-planar topography that is not consistent. For example, the impingement surface162may comprise a “variable topography,” which, as used herein, refers to a surface having at least two local topographies that comprise an angular difference of 10% or more, where “local topography” refers to the shape of a surface of the transparent workpiece160, such as the impingement surface162, at a specific location on the surface. When the impingement surface162comprises a variable topography, the adaptive phase-altering optical element122may apply a phase alteration to the laser beam112such that the laser beam112upstream and/or incident the impingement surface162(such as in free space) comprises an arbitrary non-circular angular spectrum corresponding with the local topography at the impingement location115such that the portion of the laser beam focal line113within the transparent workpiece160comprises a circular angular spectrum, exhibits a quasi-non-diffracting character, and has phase-matched intersecting rays at each position along its length. In particular, the controller121may provide control signals to the adaptive phase-altering optical element122to apply a phase alteration to the laser beam112, such that the laser beam112comprises a non-circular angular spectrum. Moreover, the controller121may apply different phase functions over time to the adaptive phase-altering optical element122. In particular, the controller121may actively alter the phase function applied by the adaptive phase-altering optical element122. Referring again toFIGS.1A-4B, in operation, the laser beam112may be translated relative to the transparent workpiece160(e.g., in the translation direction101) along the contour line165to form the plurality of defects172of the contour170. Directing or localizing the laser beam112into the transparent workpiece160generates an induced absorption within the transparent workpiece160and deposits enough energy to break chemical bonds in the transparent workpiece160at spaced locations along the contour line165to form the defects172, each comprising a defect angle θdthat is greater than 10°. According to one or more embodiments, the laser beam112may be translated across the transparent workpiece160by motion of the transparent workpiece160(e.g., motion of a translation stage190coupled to the transparent workpiece160, as shown inFIGS.2A and2B), motion of the laser beam112(e.g., motion of the laser beam focal line113), or motion of both the transparent workpiece160and the laser beam focal line113. Furthermore, when the impingement surface162of the transparent workpiece160comprises a variable topography, the laser beam112may be translated along the contour line165from a first impingement location comprising a first local topography to a second impingement location comprising a second local topography, and thereafter to a plurality of additional impingement locations, each comprising local topographies, some or all of which may be distinct from one another. Laser processing a transparent workpiece160having an impingement surface162with variable topography may comprise directing the laser beam112into the transparent workpiece160at the first impingement location after applying a first phase alteration to the laser beam112using the adaptive phase-altering optical element122(such as the spatial light modulator) such that the laser beam112would comprise a first non-circular angular spectrum in free space, translating the laser beam112from the first impingement location to the second impingement location, and directing the laser beam112into the transparent workpiece160at the second impingement location after applying a second phase alteration to the laser beam112using the adaptive phase-altering optical element122such that the laser beam112would comprise a second non-circular angular spectrum in free space. The first phase alteration and the first non-circular angular spectrum correspond with the first local topography at the first impingement location such that the portion of the laser beam112directed into the transparent workpiece160at the first impingement location at a beam propagation angle θbpcomprises a laser beam focal line113having an internal beam angle of greater than 10° while being quasi non-diffracting and having phase-matched intersecting rays at each position along its length. Similarly, the second phase alteration corresponds with the second local topography such that the portion of the laser beam112directed into the transparent workpiece160at the second impingement location at a beam propagation angle θbp comprises a laser beam focal line113having an internal beam angle of greater than 10° while being quasi non-diffracting and having phase-matched intersecting rays at each position along its length. Thus, the laser beam focal line113forms a first defect having a defect angle θdthat is greater than 10° and a second defect having a defect angle θdthat is greater than 10°. Referring again toFIG.2A, the optical assembly100may further comprise an imaging system192configured to generate image data of the impingement surface162. In some embodiments, the imaging system192may comprise one or more cameras, physical surface probes, laser rangefinders, interferometric systems, wavefront sensors, or the like. The imaging system192is communicatively coupled to the controller121such that the imaging system192may send image data of the impingement surface162to the controller121, and the controller121may instruct the adaptive phase-altering optical element122to apply specific phase alterations to the laser beam112corresponding with the local topography of impingement locations on the impingement surface162. Thus, laser processing a transparent workpiece160having an impingement surface162with variable topography may further comprise imaging the impingement surface162using the imaging system192to generate image data of the impingement surface162. Using this image data, the imaging system192, the controller121, or another computing device may determine the local topography of the first impingement location and the local topography of the second impingement location and determine the particular phase alterations that will form a high angle, quasi-non-diffracting laser beam focal line113in the transparent workpiece160that have phase-matched intersecting rays at each position along its length. The method further comprises instructing the adaptive phase-altering optical element122, using the controller121, to apply the first phase alteration when directing the laser beam112into the impingement surface162at the first impingement location and apply the second phase alteration when direction the laser beam112into the impingement surface162at the second location. Further, the image data may be used to determine the topography of some or all of impingement surface162, thereby determining a plurality of local topographies of a plurality of impingement locations. Referring again toFIGS.1A-4B, the defects172may generally be spaced apart from one another by a distance along the contour170of from about 0.1 μm to about 500 μm, for example, about 1 μm to about 200 μm, about 2 μm to about 100 μm, about 5 μm to about 20 μm, or the like. For example, suitable spacing between the defects172may be from about 0.1 μm to about 50 μm, such as from about 5 μm to about 15 μm, from about 5 μm to about 12 μm, from about 7 μm to about 15 μm, or from about 7 μm to about 12 μm for the TFT/display glass compositions. In some embodiments, a spacing between adjacent defects172may be about 50 μm or less, 45 μm or less, 40 μm or less, 35 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, 15 μm or less, 10 μm or less, or the like. As illustrated inFIGS.1A and1, the plurality of defects172of the contour170extend into the transparent workpiece160and establish a path for crack propagation for separation of the transparent workpiece160into separate portions along the contour170. Forming the contour170comprises translating the laser beam112relative to the transparent workpiece160(e.g., in the translation direction101) along the contour line165to form the plurality of defects172of the contour170. According to one or more embodiments, the laser beam112may be translated across the transparent workpiece160by motion of the transparent workpiece160, motion of the laser beam112(e.g., motion of the laser beam focal line113), or motion of both the transparent workpiece160and the laser beam112, for example, using one or more translation stages190(FIGS.2A and2B). By translating the laser beam focal line113relative to the transparent workpiece160, the plurality of defects172may be formed in the transparent workpiece160, wherein each of the plurality of defects172comprises a defect angle θdthat is greater than 10°. Suitable laser wavelengths for forming defects172are wavelengths at which the combined losses of linear absorption and scattering by the transparent workpiece160are sufficiently low. In embodiments, the combined losses due to linear absorption and scattering by the transparent workpiece160at the wavelength are less than 20%/mm, or less than 15%/mm, or less than 10%/mm, or less than 5%/mm, or less than 1%/mm, where the dimension “/mm” means per millimeter of distance within the transparent workpiece160in the beam propagation direction of the laser beam112(e.g., the Z direction). Representative wavelengths for many glass workpieces include fundamental and harmonic wavelengths of Nd3+(e.g. Nd3+:YAG or Nd3+:YVO4having fundamental wavelength near 1064 nm and higher order harmonic wavelengths near 532 nm, 355 nm, and 266 nm). Other wavelengths in the ultraviolet, visible, and infrared portions of the spectrum that satisfy the combined linear absorption and scattering loss requirement for a given substrate material can also be used. In operation, the laser beam112output by the beam source110may create multi-photon absorption (MPA) in the transparent workpiece160. MPA is the simultaneous absorption of two or more photons of identical or different frequencies that excites a molecule from one state (usually the ground state) to a higher energy electronic state (i.e., ionization). The energy difference between the involved lower and upper states of the molecule is equal to the sum of the energies of the involved photons. MPA, also called induced absorption, can be a second-order or third-order process (or higher order), for example, that is several orders of magnitude weaker than linear absorption. It differs from linear absorption in that the strength of second-order induced absorption may be proportional to the square of the light intensity, for example, and thus it is a nonlinear optical process. The perforation step that creates the contour170(FIGS.1A and1B) may utilize the beam source110(e.g., a pulsed beam source such as an ultra-short pulse laser) in combination with the phase-altering optical element120, the first lens131, and the second lens132, to irradiate the transparent workpiece160and generate the laser beam focal line113. The laser beam focal line113comprises a quasi-non-diffracting beam, such as a Gauss-Bessel beam or Bessel beam, as defined above, and may fully or partially perforate the transparent workpiece160to form defects172, each comprising a defect angle θdthat is greater than 10°, in the transparent workpiece160, which may form the contour170. In embodiments in which the laser beam112comprises a pulsed laser beam, the pulse duration of the individual pulses is in a range of from about 1 femtosecond to about 200 picoseconds, such as from about 1 picosecond to about 100 picoseconds, 5 picoseconds to about 20 picoseconds, or the like, and the repetition rate of the individual pulses may be in a range from about 1 kHz to 4 MHz, such as in a range from about 10 kHz to about 3 MHz, or from about 10 kHz to about 650 kHz. Referring now toFIGS.8A and8B, in addition to a single pulse operation at the aforementioned individual pulse repetition rates, in embodiments comprising a pulsed laser beam, the pulses may be produced in pulse bursts500of two sub-pulses500A or more (such as, for example, 3 sub-pulses, 4 sub-pulses, 5 sub-pulses, 10 sub-pulses, 15 sub-pulses, 20 sub-pulses, or more per pulse burst, such as from 1 to 30 sub-pulses per pulse burst500, or from 5 to 20 sub-pulses per pulse burst500). While not intending to be limited by theory, a pulse burst is a short and fast grouping of sub-pulses that creates an optical energy interaction with the material (i.e. MPA in the material of the transparent workpiece160) on a time scale not easily accessible using a single-pulse operation. While still not intending to be limited by theory, the energy within a pulse burst (i.e. a group of pulses) is conserved. As an illustrative example, for a pulse burst having an energy of 100 μJ/burst and 2 sub-pulses, the 100 μJ/burst energy is split between the 2 pulses for an average energy of 50 μJ per sub-pulse and for a pulse burst having an energy of 100 μJ/burst and 10 sub-pulses, the 100 μJ/burst is split amongst the 10 sub-pulses for an average energy of 10 μJ per sub-pulse. Further, the energy distribution among the sub-pulses of a pulse burst does not need to be uniform. In fact, in some instances, the energy distribution among the sub-pulses of a pulse burst is in the form of an exponential decay, where the first sub-pulse of the pulse burst contains the most energy, the second sub-pulse of the pulse burst contains slightly less energy, the third sub-pulse of the pulse burst contains even less energy, and so on. However, other energy distributions within an individual pulse burst are also possible, where the exact energy of each sub-pulse can be tailored to effect different amounts of modification to the transparent workpiece160. While still not intending to be limited by theory, when the defects172of the one or more contours170are formed with pulse bursts having at least two sub-pulses, the force necessary to separate the transparent workpiece160along the contour170(i.e. the maximum break resistance) is reduced compared to the maximum break resistance of a contour170with the same spacing between adjacent defects172in an identical transparent workpiece160that is formed using a single pulse laser. For example, the maximum break resistance of a contour170formed using a single pulse is at least two times greater than the maximum break resistance of a contour170formed using a pulse burst having 2 or more sub-pulses. Further, the difference in maximum break resistance between a contour170formed using a single pulse and a contour170formed using a pulse burst having 2 sub-pulses is greater than the difference in maximum break resistance between a contour170formed using a pulse burst having 2 sub-pulses and a pulse burst having 3 sub-pulses. Thus, pulse bursts may be used to form contours170that separate easier than contours170formed using a single pulse laser. Referring still toFIGS.8A and8B, the sub-pulses500A within the pulse burst500may be separated by a duration that is in a range from about 1 nsec to about 50 nsec, for example, from about 10 nsec to about 30 nsec, such as about 20 nsec. In other embodiments, the sub-pulses500A within the pulse burst500may be separated by a duration of up to 100 psec (for example, 0.1 psec, 5 psec, 10 psec, 15 psec, 18 psec, 20 psec, 22 psec, 25 psec, 30 psec, 50 psec, 75 psec, or any range therebetween). For a given laser, the time separation Tp(FIG.8B) between adjacent sub-pulses500A within a pulse burst500may be relatively uniform (e.g., within about 10% of one another). For example, in some embodiments, each sub-pulse500A within a pulse burst500is separated in time from the subsequent sub-pulse by about 20 nsec (50 MHz). Further, the time between each pulse burst500may be from about 0.25 microseconds to about 1000 microseconds, e.g., from about 1 microsecond to about 10 microseconds, or from about 3 microseconds to about 8 microseconds. In some of the exemplary embodiments of the beam source110described herein, the time separation Tb(FIG.6B) is about 5 microseconds for the beam source110outputting a laser beam112comprising a burst repetition rate of about 200 kHz. The laser burst repetition rate is related to the time Tbbetween the first pulse in a burst to the first pulse in the subsequent burst (laser burst repetition rate=1/Tb). In some embodiments, the laser burst repetition rate may be in a range of from about 1 kHz to about 4 MHz. In embodiments, the laser burst repetition rates may be, for example, in a range of from about 10 kHz to 650 kHz. The time Tbbetween the first pulse in each burst to the first pulse in the subsequent burst may be from about 0.25 microsecond (4 MHz burst repetition rate) to about 1000 microseconds (1 kHz burst repetition rate), for example from about 0.5 microseconds (2 MHz burst repetition rate) to about 40 microseconds (25 kHz burst repetition rate), or from about 2 microseconds (500 kHz burst repetition rate) to about 20 microseconds (50 k Hz burst repetition rate). The exact timing, pulse duration, and burst repetition rate may vary depending on the laser design, but short pulses (Td<20 psec and, in some embodiments, Td≤15 psec) of high intensity have been shown to work particularly well. The burst repetition rate may be in a range of from about 1 kHz to about 2 MHz, such as from about 1 kHz to about 200 kHz. Bursting or producing pulse bursts500is a type of laser operation where the emission of sub-pulses500A is not in a uniform and steady stream but rather in tight clusters of pulse bursts500. The pulse burst laser beam may have a wavelength selected based on the material of the transparent workpiece160being operated on such that the material of the transparent workpiece160is substantially transparent at the wavelength. The average laser power per burst measured at the material may be at least about 40 μJ per mm of thickness of material. For example, in embodiments, the average laser power per burst may be from about 40 μJ/mm to about 2500 μJ/mm, or from about 500 μJ/mm to about 2250 μJ/mm. In a specific example, for 0.5 mm to 0.7 mm thick Corning EAGLE XG® transparent workpiece, pulse bursts of from about 300 μJ to about 600 μJ may cut and/or separate the workpiece, which corresponds to an exemplary range of about 428 μJ/mm to about 1200 μJ/mm (i.e., 300 μJ/0.7 mm for 0.7 mm EAGLE XG® glass and 600 μJ/0.5 mm for a 0.5 mm EAGLE XG® glass). The energy required to modify the transparent workpiece160is the pulse energy, which may be described in terms of pules burst energy (i.e., the energy contained within a pulse burst500where each pulse burst500contains a series of sub-pulses500A), or in terms of the energy contained within a single laser pulse (many of which may comprise a burst). The pulse energy (for example, pulse burst energy) may be from about 25 μJ to about 750 μJ, e.g., from about 50 μJ to about 500 μJ, or from about 50 μJ to about 250 μJ. For some glass compositions, the pulse energy (e.g., pulse burst energy) may be from about 100 μJ to about 250 μJ. However, for display or TFT glass compositions, the pulse energy (e.g., pulse burst energy) may be higher (e.g., from about 300 μJ to about 500 μJ, or from about 400 μJ to about 600 μJ, depending on the specific glass composition of the transparent workpiece160). The portion of the laser beam112directed into the transparent workpiece160may comprise a persistent intensity homogeneity. As used herein, the term “persistent intensity homogeneity” means that an intensity of the laser beam at any discrete point throughout the portion of the laser beam directed into the transparent workpiece does not vary by more than 50% from the intensity of the laser beam at any second discrete point throughout the portion of the laser beam directed into the transparent workpiece. In the embodiments described in this disclosure, the persistent intensity homogeneity of the laser beam throughout the portion of the laser beam directed into the transparent workpiece is such that, for a discrete point throughout the portion of the laser beam directed into the transparent workpiece, the extrema (i.e., the minimum or maximum) of the intensity of the laser beam is greater than or equal to about 50% and less than or equal to about 150% of the intensity of the laser beam at any second discrete point throughout the portion of the laser beam directed into the transparent workpiece. An example intensity distribution of the laser beam focal line113over distance is shown inFIG.8C. Without intending to be bound by theory, it may be beneficial to place the impingement surface162of the transparent workpiece160greater than or equal to 0.05 mm, greater than or equal to 0.08 mm, greater than or equal to 0.10 mm, greater than or equal to 0.12 mm, greater than or equal to 0.15 mm, greater than or equal to 0.18 mm, or greater than or equal to 0.20 mm downstream the formation of the laser beam focal line113, such that the laser beam focal line113comprises an external laser beam focal line117as previously described. Placing the impingement surface162of the transparent workpiece160downstream from the formation of the laser beam focal line113may result in a greater laser beam112intensity at the impingement surface162, ensuring that the internal defect plane connects with the impingement surface162. Additionally, to ensure that the laser beam focal line113exhibits a quasi-non-diffracting character in the free space upstream the impingement surface162of the transparent workpiece160, the external laser beam focal line117may comprise a circular or approximately circular angular spectrum as previously described. While not intending to be limited by theory, the use of a laser beam112comprising a pulsed laser beam capable of generating pulse bursts is advantageous for cutting or modifying transparent materials, for example glass (e.g., the transparent workpiece160). In contrast with the use of single pulses spaced apart in time by the repetition rate of the single-pulsed laser, the use of a burst sequence that spreads the pulse energy over a rapid sequence of pulses within the burst allows access to larger timescales of high intensity interaction with the material than is possible with single-pulse lasers. The use of pulse bursts (as opposed to a single pulse operation) increases the size (e.g., the cross-sectional size) of the defects172, which facilitates the connection of adjacent defects172when separating transparent workpiece160along the one or more contours170, thereby minimizing unintended crack formation. Further, using a pulse burst to form defects172increases the randomness of the orientation of cracks extending outward from each defect172into the bulk material of the transparent workpiece160such that individual cracks extending outward from defects172do not influence or otherwise bias the separation of the contour170such that separation of the defects172follows the contour170, minimizing the formation of unintended cracks. Referring again toFIGS.2A and2B, the optical assembly100may be configured to further alter the laser beam112such that a cross-section of the laser beam112at the impingement surface162of the transparent workpiece160is non-axisymmetric and thus a cross-section of the laser beam focal line113is non-axisymmetric, for example, using the methods and systems described in U.S. Published Patent Application No. 20180093941A1, hereby incorporated by reference in its entirety. For example, the beam spot114formed by the laser beam focal line113at the impingement surface162the transparent workpiece160may comprise a non-axisymmetric beam spot having a long axis and a short axis such that the defects172formed using this laser beam focal line113comprise a central defect region formed at the intersection of the long axis and the short axis and one or more radial arms formed in the direction of the long axis These defects172are formed using a laser beam focal line113having a non-axisymmetric beam spot oriented such that the long axis of the beam spot114extends along the contour line165thereby forming defects172with radial arms that extend along the contour line165. By controlling the laser beam focal line113such that the direction of the radial arms of each defect172extends along the contour line165, crack propagation may be better controlled. In embodiments in which the phase-altering optical element120comprises the adaptive phase-altering optical element122, a laser beam focal line113with a cross-section that is non-axisymmetric may be formed by altering the phase modulation applied by the adaptive phase-altering optical element122. Further, as described in described in U.S. Published Patent Application No. 20180093941A1, in embodiments in which the phase-altering optical element120comprises a static phase-altering optical element123(e.g., the oblong axicon124), the laser beam focal line113with a cross-section that is non-axisymmetric may be formed by positioning the axicon offset in a radial direction from the beam pathway111, blocking a portion of the laser beam112, or decohering a portion of the laser beam using a phase delay plate. Referring again toFIGS.1A-4B, in some embodiments, the transparent workpiece160may be further acted upon in a subsequent separating step to induce separation of the transparent workpiece160along the contour170to form a separated transparent article comprising an angled edge (FIGS.9A-11B). The subsequent separating step may include using mechanical force, thermal stress induced force, or a chemical etchant to propagate a crack along the contour170. The thermal source, such as an infrared laser beam, may be used to create thermal stress and thereby separate the transparent workpiece160along the contour170. Separating the transparent workpiece160may include directing an infrared laser beam at the contour170to induce thermal stress to propagate a crack along the contour170. In some embodiments, the infrared laser beam may be used to initiate separation and then the separation may be finished mechanically. Without being bound by theory, the infrared laser is a controlled heat source that rapidly increases the temperature of the transparent workpiece160at or near the contour170. This rapid heating may build compressive stress in the transparent workpiece160on or adjacent to the contour170. Since the area of the heated glass surface is relatively small compared to the overall surface area of the transparent workpiece160, the heated area cools relatively rapidly. The resultant temperature gradient induces tensile stress in the transparent workpiece160sufficient to propagate a crack along the contour170and through the depth of the transparent workpiece160, resulting in full separation of the transparent workpiece160along the contour170. Without being bound by theory, it is believed that the tensile stress may be caused by expansion of the glass (i.e., changed density) in portions of the workpiece with higher local temperature. Suitable infrared lasers to create thermal stress in glass would typically have wavelengths that are readily absorbed by glass, typically having wavelengths ranging from 1.2 μm to 13 μm, for example, a range of 4 μm to 12 μm. Further, the power of the infrared laser beam may be from about 10 W to about 1000 W, for example 100 W, 250 W, 500 W, 750 W, or the like. Moreover, the 1/e2beam diameter of the infrared laser beam may be about 20 mm or less, for example, 15 mm, 12 mm, 10 mm, 8 mm, 5 mm, 2 mm, or less. In operation, a larger 1/e2beam diameter of the infrared laser beam may facilitate faster laser processing and more power while a smaller 1/e2beam diameter of the infrared laser beam may facilitate high precision separation by limiting damage to portions of the transparent workpiece160near the contour170. Example infrared lasers include a carbon dioxide laser (a “CO2laser”), a carbon monoxide laser (a “CO laser”), a solid state laser, a laser diode, or combinations thereof. In other embodiments, stress present in the transparent workpiece160, depending on the type, depth, and material properties (e.g., absorption, CTE, stress, composition, etc.) may cause spontaneous separation along the contour170without further heating or mechanical separation steps. For example, when the transparent workpiece160comprises a strengthened glass substrate (e.g., an ion-exchanged or thermally tempered glass substrate), the formation of the contour170may induce crack propagation along the contour170to separate the transparent workpiece160. Referring now toFIGS.9A-11Bexample transparent workpieces260,360,460and resultant separated articles260′,360′,460′ formed from these transparent workpieces using the methods and systems described herein are schematically depicted. As one example,FIG.9Adepicts a schematic side view of a transparent workpiece260with a plurality of defects272each having a defect angle θdthat is greater than 10°. The plurality of defects272(i.e., a contour of these defects272) may be separated to form one or more separated articles260′ each comprising an angled edge261, as shown inFIG.9B. As another example,FIG.10Adepicts a schematic side view of a transparent workpiece360comprising a plurality of defects, including a first defect372aand a second defect372b. The plurality of defects comprise a curved contour formed along a curved contour line. Both the first defect372aand the second defect372bextend radially inward, for example, from an impingement surface362(i.e., the top surface depicted inFIG.10A) to an opposite surface364(i.e., the bottom surface depicted inFIG.10B). Thus, at the impingement surface362, the first defect372aand the second defect372bare spaced apart from one another by a first spacing distance DS1and at the opposite surface364, the first defect372aand the second defect372bare spaced apart from one another by a second spacing distance DS2, which is smaller than the first spacing distance DS1. In embodiments in which the curved contour line is circular, the first spacing distance DS1is the diameter of the closed contour line at the impingement surface and the second spacing distance DS2is the diameter of the closed contour line at the opposite surface. As shown inFIG.10B, the closed contour of defects may be separated to form a separated article360′ having a conical hole363defined by an angled edge361. For example, the closed contour of defects may be separated to form the separated article360′ having the conical hole363using a chemical etching process. Referring still toFIGS.10A and10B, the curved contour of defects may be formed by rotating the laser beam112about the beam pathway111while translating the transparent workpiece160and the laser beam112relative to one another such that the defects retain a radially inward directionality relative to the curved contour line along the curved contour. Further, it should be understood that while the defects are depicted as being directed radially inward relative to the curved contour line, in other embodiments, the defects may be directed radially outward, for example, by rotation of the laser beam112about the beam pathway111. As another example,FIG.11Adepicts a schematic side view of a transparent workpiece460comprising a plurality of defects472, including a first defect472a, a second defect472b, and a third defect472c. The first defect472aextends from an impingement surface462to a first end of the second defect472b, the second defect472bextends from an end of the first defect472ato an end of the third defect472c, and the third defect472cextends from a second end of the second defect472bto the edge surface466. The first defect472amay be formed by directing the laser beam focal line113, at an angle, from the impingement surface462to the edge surface466, the second defect472bmay be formed by directing the laser beam focal line113from the end of the first defect472ato the end of the third defect472c, and the third defect472cmay be formed by directing the laser beam focal line113, at an angle, from the opposite surface464to the edge surface466. Further, the first defect472amay be part of a plurality of first defects472athat from a first contour, the second defect472bmay be part of a plurality of second defects472bthat form a second contour, and the third defect472cmay be part of a plurality of third defects472cthat form a third contour. In operation, the first contour of first defects472a, the second contour of second defects472b, and the third contour of third defects472cmay be separated using the embodiments describe herein to form a separated article460′ having chamfered edge468, as depicted inFIG.11B. EXAMPLES A transparent workpiece was passed under a pulsed laser beam with a wavelength of 1064 nm, pulse energy 200 to 800 μJ, a repetition rate of 60 kHz, and a pulse width of 10 ps. The laser had a variable burst-mode, capable of creating a burst of laser pulses with 12.5 ns spacing between each pulse in the burst. The number of pulses in a burst could be varied from 1 to 20. The pulsed laser beam was reflected off a spatial light modulator to add the phase of a specially-shaped axicon. The laser beam was then passed through four lenses in a telescopic configuration with a total demagnification of about 20× to form a laser beam focal line that contacted the transparent workpiece. The last lens (i.e., the most downstream lens) had a numerical aperture of about 0.4. To perforate and cut a sample, the transparent workpiece was tilted 40° with respect to the beam propagation direction and moved in the Y direction with a speed such that there was an 8-μm pitch between each pulse. The 40° tilt resulted in an internal focal line angle of 26° inside the glass substrate due to refraction. The beam was passed over the sample three times to form a C-chamfer (of the type shown inFIG.11A). For the first pass, the transparent workpiece was tilted at 40° with respect to the beam propagation direction. For the second pass, the transparent workpiece was tilted at 0° with respect to the beam propagation direction. For the third pass, the transparent workpiece was tilted at −40° with respect to the beam propagation direction. Care was taken to ensure that the bottom portion of the damage was made first, followed by the middle portion, and lastly the top portion, to ensure that beams do not have to pass through a previous damage plane; scattering from these planes can result in reduced sample damage.FIG.12is an image of the cross section of a glass piece damaged in this way. After damage, the transparent workpiece was separated by applying mechanical and thermal stresses to the glass (to produce a separated part of the type shown inFIG.11B).FIG.13shows an image of a C-chamfer made using this method, andFIG.14shows its surface profile. Aspect 1 of the description is: A method for processing a transparent workpiece, the method comprising: directing a laser beam oriented along a beam pathway into the transparent workpiece, the transparent workpiece having an impingement surface, the laser beam passing through the impingement surface at an impingement location to enter the transparent workpiece,wherein:a portion of the laser beam directed into the transparent workpiece produces a laser beam focal line in the transparent workpiece and generates an induced absorption to produce a defect within the transparent workpiece, the laser beam focal line comprising:a wavelength λ;a spot size wo;a Rayleigh range ZRthat is greater than FDπwo2λ, where FDis a dimensionless divergence factor comprising a value of 10 or greater;an internal focal line angle of greater than 10° relative to a plane orthogonal to the impingement surface at the impingement location;a circular angular spectrum within the transparent workpiece; anda length defined by a series of points, each of the points being formed from a plurality of intersecting rays from the laser beam, the intersecting rays being matched in phase. Aspect 2 of the description is: The method of Aspect 1, wherein the portion of the laser beam directed into the transparent workpiece comprises a persistent intensity homogeneity. Aspect 3 of the description is: The method of Aspect 1 or 2, wherein a portion of the laser beam focal line extends outside of the transparent workpiece, forming an external laser beam focal line above the transparent workpiece. Aspect 4 of the description is: The method of Aspect 3, wherein the external laser beam focal line extends at least 0.01 mm above the transparent workpiece along a plane orthogonal to the transparent workpiece. Aspect 5 of the description is: The method of Aspect 3 or 4, wherein the external laser beam focal line comprises an external focal line angle, which is greater than the internal focal line angle. Aspect 6 of the description is: The method of any of Aspects 3-5, wherein the external laser beam focal line comprises a circular angular spectrum. Aspect 7 of the description is: The method of any of Aspects 1-6, further comprising impinging the laser beam onto a phase-altering optical element positioned upstream of the impingement surface, the phase-altering optical element applying a phase alteration to the laser beam. Aspect 8 of the description is: The method of Aspect 7, wherein the laser beam comprises a first set of rays and a second set of rays, and the method further comprises obstructing the second set of rays with an optical blocking element. Aspect 9 of the description is: The method of Aspect 8, wherein the first set of rays define a first annular segment of the laser beam and the second set of rays define a second annular segment of the laser beam. Aspect 10 of the description is: The method of Aspect 9, wherein: an average radius of the second annular segment is less than an average radius of the first annular segment; andthe first set of rays forms at least a portion of the laser beam focal line that begins at an origin point within the transparent workpiece and the second set of rays are aligned such that, if unobstructed, the second set of rays would form at least a portion of the laser beam focal line extending to the origin point in a beam propagation direction. Aspect 11 of the description is: The method of Aspect 10, wherein: the method further comprises obstructing the first set of rays with the optical blocking element;the portion of the laser beam focal line formed by the first set of rays comprises an internal focal line angle of from 0° to 10° or from 170° to 180° relative to the plane orthogonal to the impingement surface; andthe portion of the laser beam focal line formed by the second set of rays comprises an internal focal line angle of greater than 10° and less than 80° or of greater than 100° and less than 170° relative to the plane orthogonal to the impingement surface. Aspect 12 of the description is: The method of Aspect 9, wherein: an average radius of the first annular segment is less than an average radius of the second annular segment; andthe first set of rays forms at least a portion of the laser beam focal line that terminates at a termination point within the transparent workpiece and the second set of rays are aligned such that, if unobstructed, the second set of rays would form at least a portion of the laser beam focal line extending beyond the termination point in a beam propagation direction. Aspect 13 of the description is: The method of Aspect 12, wherein: the method further comprises obstructing the first set of rays with the optical blocking element;the portion of the laser beam focal line formed by the first set of rays comprises an internal focal line angle of from 0° to 10° or from 170° to 180° relative to the plane orthogonal to the impingement surface; andthe portion of the laser beam focal line formed by the second set of rays comprises an internal focal line angle of greater than 10° and less than 80° or of greater than 100° and less than 170° relative to the plane orthogonal to the impingement surface. Aspect 14 of the description is: The method of Aspect 7, wherein the laser beam with phase alteration comprises a first set of rays and a second set of rays, the first set of rays forming a first portion of the laser beam focal line in the transparent workpiece. Aspect 15 of the description is: The method of Aspect 14, wherein the second set of rays forms a second portion of the laser beam focal line in the transparent workpiece, the second portion of the laser beam focal line having an internal focal line angle that differs from the internal focal line angle of the first portion of the laser beam focal line. Aspect 16 of the description is: The method of Aspect 15, wherein the laser beam with phase alteration comprises a third set of rays, the third set of rays forms a third portion of the laser beam focal line in the transparent workpiece, the third portion of the laser beam focal line having an internal focal line angle that differs from the internal focal line angle of the second portion of the laser beam focal line and the internal focal line angle of the first portion of the laser beam focal line. Aspect 17 of the description is: The method of Aspect 7, wherein the laser beam with phase alteration has a first phase, the first phase produced by the phase-altering optical element in a first configuration, the method further comprising transforming the phase-altering optical element to a second configuration, the second configuration producing a laser beam with a second phase alteration. Aspect 18 of the description is: The method of Aspect 17, wherein the first configuration comprises a first phase mask and the second configuration comprises a second phase mask. Aspect 19 of the description is: The method of Aspect 17 or 18, wherein the transforming comprises repositioning the phase-altering optical element. Aspect 20 of the description is: The method of Aspect 7, wherein the phase altering optical element comprises a static phase altering optical element. Aspect 21 of the description is: The method of Aspect 20, wherein: the static phase altering optical element comprises an oblong axicon having a base portion and a conical portion extending from the base portion; andthe base portion comprises an oblong perimeter having an axis of symmetry extending from a first axis end, having a first radius of curvature, to a second axis end, having a second radius of curvature, where the first radius of curvature of the base portion and the second radius of curvature of the base portion are different. Aspect 22 of the description is: The method of Aspect 7, wherein the phase altering optical element comprises an adaptive phase altering optical element. Aspect 23 of the description is: The method of Aspect 22, wherein the adaptive phase altering optical element comprises a spatial light modulator, a deformable mirror, or an adaptive phase plate. Aspect 24 of the description is: The method of any of Aspects 1-23, wherein the defect comprises a defect angle within the transparent workpiece of greater than 10° relative to a plane orthogonal to the impingement surface at the impingement location. Aspect 25 of the description is: The method of any of Aspects 1-24, wherein the internal focal line angle is from greater than 10° to 40°. Aspect 26 of the description is: The method of any of Aspects 1-24, wherein the internal focal line angle is from 15 to 40°. Aspect 27 of the description is: The method of any of Aspects 1-24, wherein the internal focal line angle is from 20 to 40°. Aspect 28 of the description is: The method of any of Aspects 1-27, further comprising translating at least one of the transparent workpiece and the laser beam relative to each other along a contour line to form a contour comprising a plurality of defects. Aspect 29 of the description is: The method of Aspect 28, wherein the contour line comprises a curved contour line, the contour comprises a curved contour, and the method further comprises rotating the laser beam while translating at least one of the transparent workpiece and the laser beam relative to each other along the curved contour line such that each defect of the plurality of defects is directed radially inward or radially outward relative the curved contour line. Aspect 30 of the description is: The method of Aspect 29, wherein the curved contour line comprises a closed curved contour line and the curved contour comprises a closed curved contour. Aspect 31 of the description is: The method of any of Aspects 28-30, further comprising applying a stress to the contour to separate the transparent workpiece along the contour. Aspect 32 of the description is: The method of Aspect 31, wherein the stress comprises a thermal stress, a mechanical stress, or a combination thereof. Aspect 33 of the description is: The method of any of Aspects 1-32, wherein the laser beam comprises a pulsed laser beam output by a beam source that produces pulse bursts comprising 2 sub-pulses per pulse burst or more. Aspect 34 of the description is: The method of any of Aspects 1-33, wherein the dimensionless divergence factor FDcomprises a value of from about 10 to about 2000. Aspect 35 of the description is: The method of any of Aspects 1-34, wherein a spacing between adjacent defects is about 50 μm or less. Aspect 36 of the description is: The method of any of Aspects 1-35, wherein the impingement surface comprises a non-planar topography. Aspect 37 of the description is: The method of any of Aspects 1-36, wherein the laser beam focal line intersects the impingement surface. For the purposes of describing and defining the present inventive technology, it is noted that reference herein to a variable being a “function” of a parameter or another variable is not intended to denote that the variable is exclusively a function of the listed parameter or variable. Rather, reference herein to a variable that is a “function” of a listed parameter is intended to be open ended such that the variable may be a function of a single parameter or a plurality of parameters. As used herein, the term “about” means that amounts, sizes, formulations, parameters, and other quantities and characteristics are not and need not be exact, but may be approximate and/or larger or smaller, as desired, reflecting tolerances, conversion factors, rounding off, measurement error and the like, and other factors known to those of skill in the art. When the term “about” is used in describing a value or an end-point of a range, the specific value or end-point referred to is included. Whether or not a numerical value or end-point of a range in the specification recites “about,” two embodiments are described: one modified by “about,” and one not modified by “about.” It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint. Directional terms as used herein—for example up, down, right, left, front, back, top, bottom—are made only with reference to the figures as drawn and are not intended to imply absolute orientation. Unless otherwise expressly stated, it is in no way intended that any method set forth herein be construed as requiring that its steps be performed in a specific order, nor that with any apparatus specific orientations be required. Accordingly, where a method claim does not actually recite an order to be followed by its steps, or that any apparatus claim does not actually recite an order or orientation to individual components, or it is not otherwise specifically stated in the claims or description that the steps are to be limited to a specific order, or that a specific order or orientation to components of an apparatus is not recited, it is in no way intended that an order or orientation be inferred, in any respect. This holds for any possible non-express basis for interpretation, including: matters of logic with respect to arrangement of steps, operational flow, order of components, or orientation of components; plain meaning derived from grammatical organization or punctuation, and; the number or type of embodiments described in the specification. As used herein, the singular forms “a,” “an” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a” component includes aspects having two or more such components, unless the context clearly indicates otherwise. It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments described herein without departing from the spirit and scope of the claimed subject matter. Thus it is intended that the specification cover the modifications and variations of the various embodiments described herein provided such modification and variations come within the scope of the appended claims and their equivalents. | 136,212 |
11858064 | The figures are not necessarily to scale. Where appropriate, similar or identical reference numbers are used to refer to similar or identical components. DETAILED DESCRIPTION The present disclosure describes systems and methods for planning a path for forming a part by additive manufacturing techniques as well as controlling an additive manufacturing system to form the part. An additive manufacturing system may employ sensor data and three-dimensional models in conjunction with one or more welding-type processes to build up the part. Additive manufacturing is any of various processes in which material is joined or solidified under computer control to create a three-dimensional object, with material being added together in a layered fashion. Additive manufacturing systems may employ various welding-type processes, including: arc welding processes including gas metal arc welding (“GMAW”) (including reciprocating wire feed GMAW (“RWF-GMAW”), alternating current gas metal are welding, and pulsed GMAW (“P-GMAW”)), gas tungsten arc welding with wire (“GTAW”), plasma arc welding with wire, plasma arc welding with powder, and submerged arc welding with wire or strip electrode; and non-arc welding-type processes such as laser welding with wire, laser welding with powder, and laser cladding. Some additive manufacturing systems may employ a laser system to generate a laser beam focused on a weld puddle, and an arc welding process to provide a material to build up the part. Additive manufacturing processes may also utilize various material forms, for example wire and powder of various geometries and compositions. Additive manufacturing builds a three-dimensional object from a computer-aided design (CAD) model or Additive Manufacturing File Format (AMF) file, usually by successively adding material (e.g., an electrode wire or) layer by layer. Conventional systems that employ multiple techniques to create additive manufactured parts may require an operator to determine a path for manufacturing the part. An operator may be required to determine which additive manufacturing process and associated parameters to use for the various features of the part to be manufactured. A system that could receive a three-dimensional model of the part to be manufactured and plan a path for forming the part based on the three-dimensional model, the available additive manufacturing tools and processes, and the motion capabilities of the additive manufacturing system, is therefore desirable. Disclosed additive manufacturing systems include a plurality of additive manufacturing tools configured to perform a plurality of additive manufacturing processes; a processing circuit; and a machine readable storage device including machine readable instructions which, when executed, cause the processing circuit to: receive a model of a part to be manufactured; receive information indicating the plurality of additive manufacturing processes; determine a sequence to manufacture the part based on the model of the part and the plurality of additive manufacturing processes; and control the plurality of additive manufacturing tools to manufacture the part according to the sequence. In some example additive manufacturing systems, the sequence includes manufacturing each of a plurality of features of the part to be manufactured via one of the plurality of additive manufacturing processes. In some example additive manufacturing systems, the plurality of additive manufacturing processes includes at least two of gas metal arc welding, pulsed gas metal arc welding, reciprocating gas metal arc welding, gas tungsten arc welding, submerged are welding, plasma arc welding, and laser welding. In some example additive manufacturing systems, the instructions cause the processing circuit to determine a material form and a deposition rate for each of a plurality of features of the part to be manufactured, and the sequence is determined based on the determined material form and deposition rate for each of the plurality of features to be formed via the sequence. In some example additive manufacturing systems, the sequence includes causing the processing circuit to: control a first tool to perform a first process to manufacture a first feature of the part to be manufactured; and control a second tool to perform a second process to manufacture a second feature of the part to be manufactured. In some example additive manufacturing systems, the sequence includes causing the processing circuit to: control a first tool to perform a first process to manufacture a first feature of the part to be manufactured using a first material form; and control a second tool to perform a second process to manufacture a second feature of the part to be manufactured using a second material form. Some example additive manufacturing systems further include a motion system configured to: move at least one of the first part to be manufactured relative to the plurality of additive manufacturing tools; or move the plurality of additive manufacturing tools relative to the first part to be manufactured. In some example additive manufacturing systems, the instructions further cause the processing circuit to receive information indicating abilities of the motion system, and the sequence is determined in part based on the abilities of the motion system. In some example additive manufacturing systems, the motion system is configured to adjust a position or orientation of the part to be manufactured. In some example additive manufacturing systems, the sequence includes causing the processing circuit to: control a first tool to perform a first process to manufacture a first feature of a plurality of features of the part to be manufactured; control the motion system to adjust at least one of the position or the orientation of the part to be manufactured after manufacturing the first feature; and control a second tool to perform a second process to manufacture a second feature of the plurality of features of the part to be manufactured. In some example additive manufacturing systems, the part to be manufactured is manufactured onto an existing part. In some example additive manufacturing systems, the instructions further cause the processing circuit to receive information indicating a cost of each of the plurality of additive manufacturing processes, and the sequence is determined in part based on the cost of each of the plurality of additive manufacturing processes. Disclosed methods of manufacturing a part include: receiving a three-dimensional model of a first part to be manufactured by an additive manufacturing system, the additive manufacturing system including a plurality of additive manufacturing tools configured to perform a plurality of additive manufacturing processes; receiving information indicating the plurality of additive manufacturing processes the plurality of additive manufacturing tools are configured to perform; determining a sequence to manufacture the part based on the three-dimensional model and the plurality of additive manufacturing processes; and manufacturing the first part according to the sequence. In some example methods of manufacturing a part, the sequence includes manufacturing each of a plurality of features of the first part via one of the available additive manufacturing processes. Some example methods of manufacturing a part further include: controlling a first tool to perform a first process to manufacture a first feature of a plurality of features of the part to be manufactured and controlling a second tool to perform a second process to manufacture a second feature of the plurality of features of the part to be manufactured. In some example methods of manufacturing a part, the additive manufacturing system includes a motion system configured to adjust a position or orientation of the part to be manufactured, and the sequence includes: controlling a first tool to perform a first process to manufacture a first feature of a plurality of features of the part to be manufactured; adjusting at least one of the position or the orientation of the part to be manufactured after manufacturing the first feature; and controlling a second tool to perform a second process to manufacture a second feature of the plurality of features of the part to be manufactured. In some example methods of manufacturing a part, the part to be manufactured is formed onto an existing part. Some example methods of manufacturing a part further include: receiving information indicating a cost of each of the plurality of additive manufacturing processes, and the sequence is determined in part based on the cost of each of the available additive manufacturing processes. Disclosed systems for planning a manufacturing process to be performed by an additive manufacturing system include: a processing circuit; and a machine readable storage device including machine readable instructions which, when executed, cause the processing circuit to: receive a three-dimensional model of a first part to be manufactured by the additive manufacturing system; receive information indicating a selection of available additive manufacturing processes of the additive manufacturing system; receive information indicating abilities of a motion system of the additive manufacturing system; and determine a sequence to manufacture the first part based on the three-dimensional model of the part, the abilities of the motion system, and the available additive manufacturing processes. FIG.1illustrates an example arc welding system100for performing welding operations to create objects by additive manufacturing techniques. As shown in the arc welding system ofFIG.1, a power supply10and a wire feeder12are coupled via conductors or conduits14. In the illustrated example, the power supply10is separate from the wire feeder12, such that the wire feeder may be positioned at some distance from the power supply near a welding location. However, in some examples the wire feeder may be integrated with the power supply10. In such cases, the conduits14would be internal to the system. In examples in which the wire feeder12is separate from the power supply10, terminals are typically provided on the power supply and on the wire feeder12to allow the conductors or conduits to be coupled to the systems so as to allow for power and gas to be provided to the wire feeder12from the power supply10, and to allow data to be exchanged between the two devices. The system is configured to provide wire, power and shielding gas to an additive manufacturing tool or welding torch16. The tool16may be of many different types, and may allow for the feed of a welding wire42(e.g., an electrode wire) and gas to a location adjacent to a substrate or platform18upon which a part78that includes layers82is to be formed by the deposition of welding wire42, which in some examples may be metal droplets80. A second conductor is run to the welding workpiece so as to complete an electrical circuit between the power supply and the workpiece. A robotic system84may adjust the position or the orientation of the substrate or platform18. The welding system is configured for data settings to be selected by the operator and/or a welding sequence, such as via an operator interface20provided on the power supply10. The operator interface20will typically be incorporated into a front faceplate of the power supply10, and may allow for selection of settings such as the weld process, the type of wire to be used, voltage and current settings, and so forth. In particular, the system is configured to allow for welding with various steels, aluminums, or other welding wire that is channeled through the tool16. Further, the system is configured to employ welding wires with a variety of cross-sectional geometries (e.g., circular (including solid and tubular), substantially flat, triangular, etc.). These weld settings are communicated to a control circuit22within the power supply. The system may be particularly adapted to implement welding regimes configured for certain electrode types. Additionally or alternatively, process instructions for additive manufacturing can be provided via a weld sequence program, such as stored on a memory accessible to a processor/control circuit22associated with the power supply10. In such a case, the sequencer can employ stored information (e.g., associated with a desired product configuration and/or process, including historical data), and/or customizable by a user. In some examples, as explained in more detail below, weld sequences may be determined by control circuitry of the system100based on the capabilities of the system100and the three-dimensional model of the part. The stored information can be used to control operation of the system100to facilitate formation of the part78, such as by controlling a power output from the power supply10, wire feeder motors48,54, robotic system72, robotic system84, etc. The control circuit22, described in greater detail below, operates to control generation of welding power output that is supplied to the welding wire42for carrying out the desired additive manufacturing operation. As illustrated, the control circuit22may be adapted to regulate a pulsed metal inert gas (“MIG”) welding regime that promotes short circuit transfer of molten metal to the substrate18in order to build up multiple layers82of the part78, without adding excessive energy to the part78or the welding wire42. In “short circuit” modes, droplets of molten material form on the welding wire42under the influence of heating by the welding arc, and these are periodically transferred to the part78by contact or short circuits between the welding wire42and droplets80and the layers82. In this manner, the system and/or the control circuit22controls formation of the part78by adjusting one or more operational characteristics of the system during the additive manufacturing process. The operational characteristics may include, but are not limited to, wire feeder speed, wire feeder direction, travel speed, power output, process mode, deposition path, deposition sequence, torch angle, etc. Additionally, a sensor(s)70can measure operational parameters associated with operation of the system (e.g., current, voltage, inductance, phase, power, inductance, speed, acceleration, orientation, position, etc.). The sensed operational characteristic (e.g., voltage, current, temperature, shape, speed, etc.) can be provided to the control circuit22or other controller (e.g., control circuit32, a controller associated with the robotic system72, etc.) to further control the additive manufacturing process. Power from the power supply is applied to the wire electrode42, typically by a welding cable52. Similarly, shielding gas is fed through the wire feeder and the welding cable52. During welding operations, the welding wire42is advanced through a jacket of the welding cable52towards the tool16. Within the tool16, a second wire feeder motor53comprises rollers54may be provided with an associated drive roller, which can be regulated to provide the desired wire feed speed and/or direction. A robotic system72can be employed to regulate movement and position of the tool16in accordance with the control circuits22,32, as well as information from sensor(s)70, for example. Similarly, a robotic system84can be employed to regulate movement and position of the platform18, in accordance with the control circuits22,32, as well as information from sensor(s)70. In examples, the robotic system72and the robotic system84may be in communication with the power supply10, the wire feeder12and/or the tool16via one or more cables75and77. Thus, power and/or information can be provided and/or exchanged via cable75to control the additive manufacturing process. In particular, the robotic system72can employ one or more arms74having one or more actuators76(e.g., servo motors, joints, etc.). In this way, the robotic system72can command fine control of the attached tool16in six degrees of freedom during the welding operation, including travel speed, tool location, distance from the part78, etc. The robotic system72may include one or more sensors to sense operational characteristics, which can be communicated with the control circuits22,32to further facilitate formation of the part78. Similarly, the robotic system84can employ one or more arms79having one or more actuators81(e.g., servo motors, joints, etc.). In this way, the robotic system84can command fine control of the platform18in six degrees of freedom during the additive manufacturing process. In some examples, the control circuits22,32may provide a signal to the wire feeder12, the power supply10, the robotic system72, and or the robotic system84to enable the additive manufacturing process to be started and stopped in accordance with a particular part design. That is, upon initiation of the process, gas flow may begin, wire may advance, and power may be applied to the welding cable52and through the tool16to the advancing welding wire42. A workpiece cable and clamp58allow for closing an electrical circuit from the power supply through the welding torch, the electrode (wire), and the part78for maintaining the welding arc during the operation. The present arc welding system allows for control of successive voltage and/or current levels and/or pulse durations based on previous current and duration measurements so as to control the promotion, occurrence, duration, and interruption of short circuit events between the welding wire electrode and the advancing weld puddle. In particular, current peaks in waveforms are regulated based on one or more preceding short circuit events, or aspects of the short circuit events, such as its duration. The control circuit22is coupled to power conversion circuit24. This power conversion circuit24is adapted to create the output power, such as pulsed waveforms applied to the welding wire42at the tool16. Various power conversion circuits may be employed, including choppers, boost circuitry, buck circuitry, inverters, converters, and so forth. The configuration of such circuitry may be of types generally known in the art in and of itself. The power conversion circuit24is coupled to a source of electrical power as indicated by arrow26. The power applied to the power conversion circuit24may originate in the power grid, although other sources of power may also be used, such as power generated by an engine-driven generator, batteries, fuel cells or other alternative sources. The power supply illustrated inFIG.1may also include an interface circuit28configured to allow the control circuit22to exchange signals with the wire feeder12. The wire feeder12includes a complimentary interface circuit30that is coupled to the interface circuit28. In some examples, multi-pin interfaces may be provided on both components and a multi-conductor cable run between the interface circuit to allow for such information as wire feed speeds, processes, selected currents, voltages or power levels, and so forth to be set on either the power supply10, the wire feeder12, or both. The wire feeder12also includes control circuit32coupled to the interface circuit30. As described below, the control circuit32allows for wire feed speeds to be controlled in accordance with operator selections or stored or determined sequence instructions, and permits these settings to be fed back to the power supply via the interface circuit. The control circuit32is coupled to an operator interface34on the wire feeder that allows selection of one or more welding parameters, particularly wire feed speed. The operator interface may also allow for selection of such weld parameters as the process, the type of wire utilized, current, voltage or power settings, and so forth. The control circuit32may also be coupled to gas control valving36which regulates the flow of shielding gas to the torch. In general, such gas is provided at the time of welding, and may be turned on immediately preceding the weld and for a short time following the weld. The gas applied to the gas control valving36may be provided in the form of pressurized bottles, as represented by reference numeral38. The wire feeder12includes components for feeding wire to the welding tool16and thereby to the welding application, under the control of control circuit32. For example, one or more spools of welding wire40are housed in the wire feeder. Welding wire42is unspooled from the spools and is progressively fed to the tool16. The spool may be associated with a clutch44that disengages the spool when wire is to be fed to the tool. The clutch44may also be regulated to maintain a minimum friction level to avoid free spinning of the spool40. The first wire feeder motor46may be provided within a housing48that engages with wire feed rollers47to push wire from the wire feeder12towards the tool16. In the example ofFIG.1, a moveable buffer60can include a first portion62and a second portion64, where at least one of the first and second portions are configured to move relative the other portion in response to a change in the amount of welding wire42between a first wire feeder motor46and a second wire feeder motor53. A sensor66(e.g., one or more sensors) is configured to sense relative movement or displacement between the first and second portions and provide sensor data to control circuit (e.g., control circuit22,32) to adjust a speed and/or direction of the welding wire42in response. In practice, at least one of the rollers47is mechanically coupled to the motor and is rotated by the motor to drive the wire from the wire feeder, while the mating roller is biased towards the wire to maintain good contact between the two rollers and the wire. Some systems may include multiple rollers of this type. A tachometer50or other sensor may be provided for detecting the speed of the first wire feeder motor46, the rollers47, or any other associated component so as to provide an indication of the actual wire feed speed. Signals from the tachometer are fed back to the control circuit32, such as for continued or periodic monitoring, calibration, etc. In some examples, the system includes a wire spool motor for rotating the wire feeding device, which can be similarly adjusted to increase or decrease the amount of wire between wire feeder motors. Other system arrangements and input schemes may also be implemented. For example, the welding wire may be fed from a bulk storage container (e.g., a drum) or from one or more spools outside of the wire feeder. Similarly, the wire may be fed from a “spool gun,” in which the spool is mounted on or near the welding torch. As noted herein, the wire feed speed settings may be input via the operator input34on the wire feeder or on the operator interface20of the power supply, or both. In systems having wire feed speed adjustments on the welding torch, this may be the input used for the setting. As illustrated inFIG.1, in some examples, the system100may employ a laser to add heat to facilitate melting of a material (e.g., electrode wire42) in the weld puddle to build up a layered part as disclosed with respect to the systems and methods provided herein. As shown, a laser system61is provided, connected to the power supply10to supply power from the power conversion circuit24and send and receive information to and from the control circuit22. The laser system61controls a laser generator63to generate a laser beam65for application to one or more layers82of the part78. The laser system61is configured to cooperate with the welding tool16to and control system72to ensure a desired stability is present in an arc, for example, in a GMAW process using a Titanium wire. The laser system61may communicate with the control circuit22via the interface circuit28. Although described with respect to an arc welding-type system, the disclosed system may be implemented in conjunction with a variety of technologies to conduct additive manufacturing processes. In one example, additive manufacturing may employ a laser without the use of a welding arc to melt a material to build up a layered part in a manner similar to the systems and methods disclosed herein. Although described with respect to creating a new part, in some examples, the system100may manufacture a part onto an existing part. For example, a blade of a propeller may be manufactured onto an existing propeller hub via the system100. FIG.2illustrates a block diagram of an example additive manufacturing system200including a plurality of additive manufacturing tools. For example, one of the additive manufacturing tools is the arc welding system100ofFIG.1. The additive manufacturing system200also includes a second arc welding system210, which includes a power supply212, a wire feeder214, a robotic system216, and a welding-type tool218. As illustrated, the welding-type tool16of the first additive manufacturing system100may be a GMAW type welding tool, and the welding-type tool218of the second additive manufacturing system may be a second GMAW type welding tool. The first GMAW type welding tool16may be configured to perform a RWF-GMAW type process, and the second GMAW type welding tool218may be configured to perform a P-GMAW type welding process. Although described with respect toFIGS.1and2as GMAW type welding tools, welding tools16and218can be any type of welding-type tool to perform any type of welding-type process. The additive manufacturing system200includes a third welding-type system220. The third welding-type system220includes a power supply222, a wire feeder and/or a powder feeder224, a robotic system226, and a welding-type tool228. The welding-type tool228may be a laser welding-type tool. The additive manufacturing system200also includes a platform18for holding a part to be manufactured and a robotic system84for adjusting the position and or orientation of the platform18, and therefore the part being manufactured. Although illustrated as separate power supplies10,212, and222, in some examples, the welding-type systems100,210, and220may share a single power supply. Likewise, in some examples, two of the welding-type systems100,210, and or220may share a single power supply. Although illustrated as three welding-type systems100,210, and220, in some examples the additive manufacturing systems may include more or less additive manufacturing type systems and/or tools. In some examples, additive manufacturing systems may also include plastic deposition tools. Some additive manufacturing systems may include various types of other arc welding and/or non-arc welding-type tools. Although illustrated as separate robotic systems72,216,226, and84, a given robotic system72,216,226, or84could be shared with one or more processes and/or tools (16,218,228,18). For example, a robotic system (72,216,226, or84) may implement a tool changing scheme in which one robotic system can be used with multiple tools16,218, and/or228. In some examples, two or more robotic systems72,216,226, or84share hardware. A control circuit202plans and controls the operation of the additive manufacturing system200. The control circuit202may be one or both of the control circuits22,32, configured to function in a system of the type illustrated inFIG.1. The control circuit202may also be or include a control circuit of the power supplies212,222, or the wire feeders214or224. The control circuit202may also be located at an external computing device, for example, the control circuit202may be an application on an external computing device (or a cloud computing device). The control circuit202has data connectivity to each of the welding-type systems,100,210, and220of the additive manufacturing system200as well as the robotic system84. As explained in more detail below, the control circuit202may receive information about the manufacturing capabilities of each of the welding systems100,210, and220of the additive manufacturing system200, the abilities of the robotic system84, as well as a three-dimensional model of a part to be manufactured. The three-dimensional model may include information regarding conditions to form each feature, for example the material that each feature should be made from. Information about the manufacturing capabilities of each of the welding systems100,210, and220may include a deposition rate, a material form used, a cost to use the system, and/or level of precision. Based on information from the three-dimensional model, i.e., the geometry and material for each feature of the part to be manufactured, and the abilities of the additive manufacturing system, the control circuit202then plans a sequence of actions to manufacture the part using the welding-type systems100,210,220of the additive manufacturing system200. The control circuit202may then command the additive manufacturing system200to manufacture the part via the planned sequence of actions. FIG.3illustrates example control circuit202ofFIG.2, such as one or both of control circuits22or32ofFIG.1. The control circuit202is configured to function in an additive manufacturing system200of the type illustrated inFIG.2. The overall circuitry may include the operator interfaces20and34and/or interface circuits28and30. For example, the various interfaces can provide communication of operational parameters, including user input and networked information via network interface83, as well as information from downstream components such as a wire feeder, a welding torch/tool, and various sensors and/or actuators. The control circuit202includes a processing circuit85which itself may include one or more application-specific or general purpose processors. The processing circuit85may be further configured to carry out welding sequences such as corresponding to formation of a particular additive manufacturing part. The processing circuit85can receive information regarding the part from a database88stored in a memory circuit86(e.g., a three-dimensional model of the part), and/or receive the information from a networked computer and/or a user input. Based on the information, the processing circuit85can plan, control and/or coordinate actions of the system components by making computations for implementation of an additive manufacturing process. The various models and inputs can be correlated based on a number of variables of the additive manufacturing process. For example, geometric features of the three-dimensional model may correspond to a point in time and/or space associated with the process and/or part. For instance, a first or base layer of the part may correspond with an earlier time than a later applied layer. The welding sequence can also be synced to the models, to ensure that the welding operation is adjusted to correspond to the requirements of the models. In an example, the processing circuit85may determine the parameters to manufacture a feature or region of a part based on the three-dimensional model of the part. Based on the information from the three-dimensional model of the part associated with the region, the processing circuit85may determine which of the additive manufacturing tools100,210, or220, to use, and may adjust an operational characteristic of one or more components of the system (e.g., the power supply10,212,222, the wire feeder12,214,224, the robotic system72,216,226,84, etc.) based on the information. In this manner, the system controls formation and application of each feature of the part, including the welding-type system (100,210,220) and application tool (16,218,228), the location of the feature, the amount of power and/or heat associated with the application, speed and direction of the application tool (16,218,228), wire feed speed and/or direction, and the position and/or orientation of the platform18holding the part. In some examples, the sensor70includes a laser sensor101configured to scan the part periodically or continuously during the additive manufacturing process. This scan can be fed back to the processing circuit85to compare with the three-dimensional model, to either ensure that the part being formed conforms to the three-dimensional model, and/or to identify variations. Based on the comparison, the processing circuit85can adjust one or more operational characteristics of the additive manufacturing system200to facilitate formation of the part. Additionally or alternatively, sensor70may include an infrared sensor102, an ultrasound sensor104, a mechanical sensor106, or a thermal sensor108, an optical sensor110, to name but a few. Similarly, sensor data from the various sensors can be fed back to the processing circuit85for analysis and control of operational characteristics. By coordinating control of the various systems, the part may include finer detail with fewer negative effects associated with conventional metal deposition techniques. The control circuit202controls the various robotic systems72,216,226,84of the additive manufacturing system200. The control circuit202, which may include a robotic system control90and/or robotic interface circuit92, which can be integrated with one or more components of the circuitry, such as control circuits22,32. The robotic system control90or robotic interface circuit is in communication with the robotic systems72,216,226,84and the processing circuit85, as well as the memory circuit86. In some examples, two or more welding-type tools and/or processes share a single robotic system (72,216,226, or84) and therefore may share a robotic motor arm, (76,217,227,79), for example via a tool changing scheme. The robotic control system90is configured to control operation of the robotic arm motors76,217,227,79. In this way, the location and/or orientation of the tools16,218,228as well as the position and/or orientation of the platform18are controlled in coordination with data provided by sensors, models, inputs, etc. As a result, geometric features of the part are formed by control of multiple variables that contribute to creation of the part. Additionally or alternatively, one or more of the interfaces (e.g., interface circuits28,30; operator interfaces20,34) can provide information corresponding to operational parameters of the system. In this example, operational parameter information can be provided by one or more of the wire feeder motors, such as current draw, voltage, power, inductance, wire feed speed, wire feed acceleration, wire feeder motor angle, torque, position, etc., which can be analyzed by the processing circuit85to indirectly determine one or more operational characteristics. This process can be implemented in conjunction with the sensors70and/or66or without to achieve a similar result. In some examples, the processing circuit85includes a timer, a speed sensor, or other sensor that may provide information regarding the additive manufacturing process(es), such as the amount of wire consumed, an estimate of the anticipated progress for the manufacturing process, etc. Additionally or alternatively, the control circuit202can be configured to monitor and/or adjust a power output characteristic (e.g., current, voltage, power, phase, etc.) associated with the power supplies10,212,222. The processing circuit85is further configured to control the laser system61and laser generator63. The processing circuit85provides control signals to the laser system61to adjust in response to information corresponding to an amount of wire between the two wire feeder motors. In particular, the sensors70can monitor one or more characteristics of the laser system, the arc welding tool16, the power supply output, and/or the part78(e.g., the weld puddle size, shape, temperature, location of the electrode wire and/or the cathode spot on the weld puddle, etc.), and provide data to the processing circuit85for analysis and determination. The processing circuit85will also be associated with memory circuitry86which may consist of one or more types of permanent and temporary data storage, such as for providing the welding sequences implemented, storing the three-dimensional models, storing operational characteristics, storing weld settings, storing error logs, etc. The adjustment of the operational characteristics can be made by reference and/or comparison to historical data from preceding additive manufacturing operations, which can also be stored on memory circuit86. For instance, adjustment may be made on the basis of stored data based on an historical analysis of a similar additive manufacturing operation. The historical data can correspond to, for example, operational parameters, other sensor data, a user input, as well as data related to trend analysis, threshold values, profiles associated with a particular mode of operation, etc., and can be stored in a comparison chart, list, library, etc., accessible to the processing circuit85. Such an analysis can be performed via one or more machine learning and/or artificial intelligence techniques to inform and/or update the sequence determination. FIG.4illustrates a method400of planning a sequence for forming a part using an additive manufacturing system including multiple welding-type systems, for example, the systems described with respect toFIGS.1-3. In block402, the control circuit202receives a three-dimensional model of a part to be manufactured. The three-dimensional model may include information regarding the overall geometry of the part to be manufactured, including the geometries and materials of the various features of the part. At block402, the control circuit202may also receive information regarding the abilities of the additive manufacturing system, for example the available welding-type systems and available welding-type processes. At block404, the control circuit202determines the number of features that make up the part based on the three-dimensional model. In some examples, the three-dimensional model may have labeled features or layers which the control circuit202may use to determine the number of features. In some examples, the control circuit202may perform image processing (for example, edge detection) to determine each feature of the part to be manufactured. At block406, the control circuit202determines the geometric size of each feature. The geometric size may correspond to a volume of the feature, or a length, height, or width of the feature. In some examples, the geometric size may correspond to the smallest of the length, width, or height of the feature in order to determine the level of precision required to manufacture the feature of the part. At block408, the control circuit202initiates a loop to determine characteristics of each feature for determining the additive manufacturing tool and/or material form to use to manufacture each feature. The loop includes blocks410-426. At block410, the control circuit202compares the determined size of the feature to a first threshold. For example, the first threshold may be 3 millimeters. If the size of the feature is less than the first threshold (block410), then at block412the control circuit202determines that the feature will be formed using laser welding with powder. The control circuit202then checks at block424whether each feature of the part to be manufactured has been assigned an additive manufacturing tool and process that will be used to form the feature. If each feature has not been assigned an additive manufacturing tool and process that will be used to form the feature (block424), then the control circuit202returns to block408. If each feature has been assigned an additive manufacturing tool and process that will be used to form the feature (block424), then the control circuit202proceeds to block426. At block410, if the control circuit202determines that the geometric size of the feature is greater than the first threshold, then at block414the control circuit202compares the geometric size of the feature to a second threshold. For example, the second threshold may be 6 millimeters. If the geometric size is less than the second threshold (block414), then at block416the control circuit202determines that the feature will be formed using laser welding with wire. The control circuit202then proceeds to block424. If the control circuit202determines that the geometric size of the feature is greater than the second threshold (block414), then the control circuit202compares the geometric size of the feature to a third threshold at block418. For example, the third threshold may be 10 millimeters. If the control circuit202determines that the geometric size of the feature is less than the third threshold (block418), then at block420the control circuit202determines that the feature will be formed using RWF-GMAW. The control circuit202then proceeds to block424. If the control circuit202determines that the geometric size of the feature is not less than the third threshold, then at block422the control circuit202determines that the feature will be formed using P-GMAW. The control circuit202then proceeds to block424. At block424, if each feature has not been assigned an additive manufacturing tool and process that will be used to form the feature, then the control circuit202returns to block408. If each feature has been assigned an additive manufacturing tool and process that will be used to form the feature (block424), then the control circuit202proceeds to block426. At block426, the control circuit202determines a sequence to manufacture the part based on geometric location of the feature on the part, the additive manufacturing tool and process assigned to each feature, the overall geometry of the part, a desired deposition rate and material form with which to manufacture the feature, and the robotic systems of the additive manufacturing system. The control circuit202may also select a sequence to minimize the time to manufacture the part and/or the cost to manufacture the part. The control circuit202selects a sequence for manufacturing the features that is physically possible. For example, features on the main build axis may be formed before periphery features such that the periphery features are physically supported by the main build axis. As another example, interior features of a part are formed before an exterior encasing the interior is closed. For example a channel within a cylinder would be formed before the cylinder is closed and it would no longer be possible to form the channel. After determining the sequence for manufacturing the part using the additive manufacturing system, the control circuit202may control the additive manufacturing system to manufacture the part using the determined sequence. FIG.5illustrates a method500of planning a path for forming a feature of a part using an additive manufacturing system including multiple welding-type systems, for example, the systems described with respect toFIGS.1-3. Once the control circuit202has determined which welding-type process a feature will be formed by, for example via method400ofFIG.4, method500ofFIG.5may be used by the control circuit202to plan the path for forming each feature. At block502, the control circuit202receives information regarding whether the additive manufacturing system can manipulate the part being manufactured. For example, the control circuit202determines whether a motion system of the additive manufacturing system200includes a robotic system84capable of manipulating the position and/orientation of the part. At block504, the control circuit202determines if the feature is located on the main build axis of the part to be manufactured. If the control circuit202determines that the feature is on the main build axis (block504), then the control circuit202proceeds to block506. If the control circuit202determines that the feature is not on the main build axis (block504), then the control circuit202proceeds to block514. At block506, the control circuit202determines whether motion of the welding-type tool performing the welding-type process could be minimized by also manipulating the part. If motion of the welding-type tool performing the welding-type process could be minimized by also manipulating the part (block506), then the control circuit202proceeds to block508. If motion of the welding-type tool performing the welding-type process cannot be minimized by also manipulating the part (block506), then the control circuit202proceeds to block510. At block508, the control circuit202determines whether the additive manufacturing system is capable of manipulating the part, based on the information received in block502. If the manufacturing system is not capable of manipulating the part (block508), then the control circuit202proceeds to block510. If the manufacturing system is capable of manipulating the part (block508), then at block512the control circuit202determines a path to create the feature by manipulating the position and/or orientation of both the part and the welding-type tool performing the welding-type process. At block510, the control circuit202determines a path to create the feature by manipulating the position and/or orientation of the welding-type tool performing the welding-type process. At block514(after determining at block504that the feature is not on the main build axis), the control circuit202determines whether the additive manufacturing system is capable of manipulating the part, based on the information received in block502. If the manufacturing system is not capable of manipulating the part (block514), then the control circuit202proceeds to block518. If the manufacturing system is capable of manipulating the part (block514), then at block516, the control circuit202determines a path to create the feature by manipulating the position and/or orientation of both the part and the welding-type tool performing the welding-type process. For example, the control circuit202determines a path to create the feature with the part at an appropriate angle to create the feature. At block518(after determining at block514that the additive manufacturing system is not capable of manipulating the part), the control circuit202determines whether the feature can be created with the part at a flat or horizontal orientation. If the feature can be formed out of a horizontal orientation (block518), then at block520, the control circuit202determines a path to create the feature at a horizontal orientation by manipulating the position and/or orientation of the welding-type tool performing the welding-type process. If the feature cannot be formed at a horizontal orientation (block518), then at block522the control circuit202determines that the additive manufacturing system200is not capable of creating the feature, and may signal an alert to an operator. In some examples, an operator may physically manipulate the orientation and/or position of the part in order to manufacture the feature of the part in response to the alert. As utilized herein the terms “circuits” and “circuitry” refer to physical electronic components (i.e. hardware) and any software and/or firmware (“code”) which may configure the hardware, be executed by the hardware, and or otherwise be associated with the hardware. As used herein, for example, a particular processor and memory may comprise a first “circuit” when executing a first one or more lines of code and may comprise a second “circuit” when executing a second one or more lines of code. As utilized herein, “and/or” means any one or more of the items in the list joined by “and/or”. As an example, “x and/or y” means any element of the three-element set {(x), (y), (x, y)}. In other words, “x and/or y” means “one or both of x and y”. As another example, “x, y, and/or z” means any element of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, “x, y and/or z” means “one or more of x, y and z”. As utilized herein, the term “exemplary” means serving as a non-limiting example, instance, or illustration. As utilized herein, the terms “e.g.,” and “for example” set off lists of one or more non-limiting examples, instances, or illustrations. As utilized herein, circuitry is “operable” to perform a function whenever the circuitry comprises the necessary hardware and code (if any is necessary) to perform the function, regardless of whether performance of the function is disabled or not enabled (e.g., by a user-configurable setting, factory trim, etc.). As used herein, the term “controller” or “control circuit” includes digital and/or analog circuit, discrete or integrated circuit, microprocessors, DSPs, FPGAs, etc., and/or software, hardware and firmware, located on one or more boards, used to control all or part of a welding-type system or a device such as a power supply, power source, engine or generator. As used herein, the term “periodic” and/or “cyclical” welding process and/or output includes welding output that may be characterized as a series of periods and/or cycles, wherein each cycle may be the same, similar or different. As used herein, the term “wire feeder” includes the motor or mechanism that drives the wire, the mounting for the wire, and controls related thereto, and associated hardware and software. Welding-type system, as used herein, includes any device capable of supplying power suitable for welding, plasma cutting, induction heating, CAC-A and/or hot wire welding/preheating (including laser welding and laser cladding), including inverters, converters, choppers, resonant power supplies, quasi-resonant power supplies, etc., as well as control circuitry and other ancillary circuitry associated therewith. As used herein, the term “welding-type power” refers to power suitable for welding, plasma cutting, induction heating, CAC-A and/or hot wire welding/preheating (including laser welding and laser cladding). As used herein, the term “welding-type power supply” refers to any device capable of, when power is applied thereto, supplying welding, plasma cutting, induction heating, CAC-A and/or hot wire welding/preheating (including laser welding and laser cladding) power, including but not limited to inverters, converters, resonant power supplies, quasi-resonant power supplies, and the like, as well as control circuit and other ancillary circuit associated therewith. As used herein, the term “pulse welding” includes welding with output power that is generally pulsed, at a controllable frequency, between a greater peak and a lesser background, and pulse welding is performed in an arc state. As used herein, the term “periodic” and/or “cyclical” welding process and/or output includes welding output that may be characterized as a series of periods and/or cycles, wherein each cycle may be the same, similar or different. As used herein, the term “energy storage device” is any device that stores energy, such as, for example, a battery, a supercapacitor, etc. As used herein, the term “memory” includes volatile and non-volatile memory, and can be arrays, databases, lists, etc. As used herein, the term “torch” or “welding-type tool” can include a hand-held or robotic welding torch, gun, or other device used to create the welding arc. As used herein, the term “welding mode” or “welding operation” is the type of process or output used, such as CC, CV, pulse, MIG, TIG, spray, short circuit, etc. As used herein, the term “boost converter” is a converter used in a circuit that boosts a voltage. For example, a boost converter can be a type of step-up converter, such as a DC-to-DC power converter that steps up voltage while stepping down current from its input (e.g., from the energy storage device) to its output (e.g., a load and/or attached power bus). It is a type of switched mode power supply. As used herein, the term “buck converter” (e.g., a step-down converter) refers to a power converter which steps down voltage (e.g., while stepping up current) from its input to its output. The present methods and systems may be realized in hardware, software, and/or a combination of hardware and software. Example implementations include an application specific integrated circuit and/or a programmable control circuit. While the present method and/or system has been described with reference to certain implementations, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the present method and/or system. For example, block and/or components of disclosed examples may be combined, divided, re-arranged, and/or otherwise modified. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from its scope. Therefore, the present method and/or system are not limited to the particular implementations disclosed. Instead, the present method and/or system will include all implementations falling within the scope of the appended claims, both literally and under the doctrine of equivalents. | 53,110 |
11858065 | DESCRIPTION OF EMBODIMENTS The disclosure is better understood with reference to the following drawings and description. The elements in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the disclosure. Moreover, in the figures, like-referenced numerals may be designated to corresponding parts throughout the different views. Furthermore, unless otherwise stated, additional elements may intervene or be added after an output pulsed laser beam. A narrower pulse width laser beam having a fixed energy output, a sharper rise time at a leading edge of the pulse, such as a substantially square wave pulse shape may provide a higher shocking pressure on the surface of a part in laser shock peening. Likewise, a substantially square wave pulse shape may allow a more uniform energy distribution for laser bond inspection in composite structures. A pulsed laser beam generated by a diode pumped solid-state laser (DPSSL) oscillator has a fixed mode of operation which cannot be varied arbitrarily to generate laser beams with other pulse shapes or pulse widths for different applications. For a laser system to generate different pulse widths or different pulse shapes, one or more elements may be added externally to modify the beam pulse widths, sometimes, the laser system may need to be shut down altogether in order to change to a different laser source, thus increasing downtime to operations. There is a need for developing a flexible laser system that can be configured to perform both laser shock peening (LSP) operations and laser bond inspection (LBI) for composite structures, where the laser system is compact, lightweight, and capable of delivering sufficient pulse energy for both LSP and LBI operations. This problem may be solved by replacing the DPSSL oscillator with an integrated fiber laser front-end102as shown inFIG.1. More specifically,FIG.1discloses a schematic diagram of a flexible laser system100which can generate arbitrary pulsed laser beams for use in laser shock peening process and for use in laser bond inspection process. The system100is operative to produce and output a pulsed laser beam to a target part101for laser shock peening or for laser bond inspection. The laser system100for pulsed laser beam generation may include at least an integrated fiber laser front-end102, a first optical isolator114and a second optical isolator120, a Pockels cell104, a polarizer117, an optical filter112, multi-staged amplifiers106and a beam delivery device122. The laser system100may also include feedback paths from a sampled output beam152f(seeFIG.3B) and from sampled output beam126aat a beam delivery device (122) sent to a controller140. InFIG.1, the integrated fiber laser front-end102may be configured by the controller140to generate and output a pre-amplified first pulsed laser beam108. The first pulsed laser beam108may have predefined beam characteristics corresponding to a setting selection (e.g., based on a look up table LUT141) of the controller140, wherein the predefined beam characteristics may include: a beam frequency, a first energy, a pulse modulation frequency, a first spatial profile including a first beam diameter, a pulse shape (which may be Gaussian shape (seeFIGS.4A and6), a square pulse shape (seeFIGS.4B to4D) or an arbitrary pulse shape (seeFIGS.5A,5C)) and a first temporal profile having a pulse width PW1. In an example, the first pulsed laser beam108may be a monochromatic frequency Gaussian shaped pulsed laser beam (seeFIG.4A) having a wavelength of 1053 nm, wherein the pulse modulation frequency may be between 1-20 Hz, the first energy may be 10 mJ 20 ns, the pulse width PW1may be between 100 ps (picosecond) to 500 ns (nanosecond). The first optical isolator114may prevent beam reflections in an opposite direction to protect the integrated fiber laser front-end102. A pair of Pockels cell104and polarizer117may be disposed between the first optical isolator114and the optical filter112, wherein the pair of Pockels cell104and polarizer117may be configured to perform nanosecond-duration switching on the first pulsed laser beam108, by allowing or preventing the first pulsed laser beam108from exiting the Pockels cell104, wherein an exit beam is the modified first beam110having the modified pulse width (PW2) with the second temporal profile. In an implementation, the Pockels cell104may include a crystal material containing one of: barium borate (BBO) or potassium dideuterium phosphate (KD*P). In a case where the Pockels cell104including the crystal material containing dideuterium phosphate (KD*P), the Pockels cell104may further be configured to perform pulse slicing (seeFIG.6) of a leading edge portion656(alternately pulse slicing both the leading edge656and the falling edge660) of the first beam108to output the modified first beam110having the modified pulse width662(PW2seeFIG.6) of less than 12 nanosecond (typically 5-12 nanoseconds) with the second temporal profile. In an implementation (seeFIGS.7-8), the modified first beam110output from the Pockels cell104and polarizer117pair may have a first diameter d1and wings sections (878) and the optical filter112may include: a beam expander766configured to expand the modified first beam110to a diameter d2, which is greater than the first diameter d1; and an apodizer768configured to receive the expanded first beam or the expanded modified first beam770from the beam expander766, to remove the wing portions878to output the second beam118having a second spatial profile with a flat top881without the wing portions878. An optical filter112may be configured to modify the (pre-amplified) modified first beam110to output a second beam118having a second energy and a second spatial profile (flat top Gaussian shaped pulse, seeFIG.8). A multi-stage post amplifier106may be configured to output an output beam126after beam energy post amplifications and beam profile modifications. The multi-stage amplifier106may include at least a first stage901(seeFIG.9) configured to post-amplify and modify the second beam118to output a third beam915having a third energy and a third temporal profile; and a second stage902configured to post-amplify and modify the third beam915to output a fourth beam941having a fourth energy and a fourth temporal profile, wherein the fourth beam941substantially maintains the pulse width (PW1) within the defined tolerance. In an implementation, the multi-stage amplifier106may further include: a third stage903configured to amplify and modify the fourth beam941to output a fifth beam959having a fifth energy and a fifth temporal profile; and a fourth stage904configured to amplify and modify the fifth beam959to output a sixth beam or an output beam126having a sixth energy and a sixth temporal profile. In an implementation (seeFIG.10), the output beam126from the multi-stage amplifier106to a beam delivery device122may have near field values and measurements, and the laser beam delivery device122may include a vacuum relay imaging module (VRIM)1091configured to maintain the near field values and the measurements of the output beam126and to deliver the output beam126to the target part101. The system100may include a feedback mechanism to monitor beam characteristics for beam stability (such as pulse widths, beam diameter, energy level, etc.) and to adjust certain beam settings (such as bias voltage setting, Pockels cell bias voltage, amplifier gain, etc.) in order to ensure that the pulsed laser beam operates within a prescribed performance matrix. In an implementation, a beam detector130(including a photodetector and a high speed oscilloscope131) may be coupled to one or a combination of the integrated fiber laser front-end102and a beam delivery device122disposed after the multi-stage amplifier106, for monitoring one or a combination of: a pulse shape, a beam pulse width, a beam diameter, and an energy level. In an example of the feedback mechanism, a feedback signal152f(seeFIG.3B) may be from a sampled signal152foutput by the temporal pulse shaper152to be sent back to the controller140. If a magnitude of the error signal152fexceeds a defined error range, the error signal152fmay cause the controller140to perform one or a combination of the following in the integrated fiber laser front-end102: (a) configure a modulator bias control (MBC) circuitry154to modulate a CW laser beam151ato output a first pulsed laser beam152awith a defined pulse shape with a defined pulse width PW1, (b) configure a RF generator153to output an electrical pulse153a(seeFIG.5A) to produce an optical pulse ramp or a defined rise time (seeFIGS.5B,5C) according to the setting selection of the LUT141. In another example, a feedback signal126bmay be sampled from an output signal at the beam delivery device122and fed to the beam detector130to generate an error signal128to be sent back to the controller140. If a magnitude of the error signal128exceeds a defined error range, the error signal128may cause the controller140to perform one or a combination of the following: (c) configure the Pockels cell104to switch on or off, or to adjust the modified pulse width (PW2) by an amount145to stay within the defined tolerance; and (d) configure the multi-stage amplifier106with a correction gain signal146to adjust one or a combination of the beam energy amplifications and the beam profile modifications to stay within a defined output energy level and a defined beam profile according to the setting selection of the LUT141. FIG.2is a schematic diagram of the integrated fiber laser front-end102for arbitrary pulsed laser beam generation as shown inFIG.1. The integrated fiber laser front-end102may include an integrated oscillator/pulse shaper150(seeFIG.3A) and a multi-stage preamplifier155.FIG.3Ais an external view of an integrated oscillator/pulse shaper150as shown inFIG.2.FIG.3Bis an example of a schematic of the integrated oscillator/pulse shaper150. As shown inFIG.3B, the integrated oscillator/pulse shaper150may be a ModBox Pulse Shaper manufactured by iXblue, with a model number ModBox-FE-1053 nm-60 dB. The integrated fiber laser front-end102may include an integrated oscillator/pulse shaper150(seeFIG.3A) and a multi-stage preamplifier155. The integrated oscillator/pulse shaper150further includes: a master oscillator151which outputs a monochromatic frequency continuous wave (CW) laser beam151aat a first output energy level to a temporal pulse shaper152which in response to an electrical pulse153afrom an arbitrary wave radio frequency (RF) generator153and a direct current (DC) bias voltage154afrom an automatic modulator bias control (MBC) circuitry154, modulates the CW laser beam151ato output the first pulsed laser beam152awith the pulse width PW1according to the pulse width setting selection of the controller140through a main out port A. Refer toFIG.3B, as mentioned, the sampled signal152fmay be output through a monitor output port B. In an embodiment, the sampled signal152fmay be used as a feedback signal to monitor and adjust the controller to140to maintain the beam characteristics of the first pulsed laser beam152asuch as the pulse shape, the pulse width PW1and the energy output to stay within a defined stability or tolerance as set by the manufacturer. FIG.2also discloses a multi-stage pre-amplifier155which may be disposed at an output of the integrated oscillator/pulse shaper150to perform pre-amplification of the first pulsed laser beam152ato output the pre-amplified first pulsed laser beam110prior to the post amplification. A first optical isolator114amay be disposed between the output of the integrated oscillator/pulse shaper150and the multi-stage pre-amplifier155. In an example, a first Faraday rotator (FR1)134amay be disposed between the first optical isolator114aand a first portion of the multi-stage pre-amplifier (136a,136b), wherein the FR1performs a double pass on the first pulsed laser beam152aby first rotating the FR1134ato allow a forward pass of the first pulsed laser beam152ato be first pre-amplified by the first portion of the multi-stage pre-amplifier (136a,136b) to a first pre-amplified beam152b, and second rotating the FR1134ato allow a reverse pass (i.e., in opposite direction) of a second pre-amplified beam152c, which is after the first pre-amplified beam152bis being reflected by mirror138aand then passing through the first portion of the multi-stage pre-amplifier (136a,136b) to be second pre-amplified in a reversed direction to be the second pre-amplified beam152c. In practice, the second pre-amplified beam152cmay be reflected by a mirror132ato be received by a first Pockels cell104a, followed by a second isolator114b, wherein the first Pockels cell104aoperates as a first optical switch to synchronize at an exact time the received second pre-amplified beam152carrives for a subsequent amplification, and the second optical isolator114bprotects the first Pockets cell104afrom damages due to reflection (i.e., reverse transmission). The subsequent amplification includes passing the second pre-amplified beam152cthrough a second Faraday rotator (FR2)134bdisposed between the second optical isolator134band a second portion of the multi-stage pre-amplifier (136c,136d), wherein the FR2134bperforms a double pass on the second pre-amplified beam152cby first rotating the second Faraday rotator (FR2)134bto allow a forward pass of the second pre-amplified beam152cto be third pre-amplified by the second portion of the multi-stage pre-amplifier (136c,136d) to a third pre-amplified beam152d, and second rotating the FR2134bto allow a reverse pass (i.e., in opposite direction) of a fourth pre-amplified beam152e, which is after the third pre-amplified beam152dis being reflected by mirror138band then passing through the second portion of the multi-stage pre-amplifier (136c,136d) to be fourth pre-amplified in a reversed direction to be the fourth pre-amplified beam152e. The fourth pre-amplified beam152eis received by a second Pockels cell104bfollowed by a third isolator114c, wherein the second Pockels cell104boperates as a second optical switch to synchronize with the first Pockels cell104aat an exact time the received fourth pre-amplified beam152earrives for an output or for subsequent amplification. The third optical isolator114cprotects the second Pockets cell104bfrom damages due to reflection (i.e., transmission in reverse direction), wherein the fourth pre-amplified beam152emay exit through the third isolator114cas the pre-amplified first pulsed laser beam110having the predefined beam characteristics corresponding to the pulse width setting selection of the controller140. An example of the first temporal profile may include a user defined pulse width between 100 ps (picosecond) (seeFIG.4A) to 500 ns (nanosecond), with a rise time as low as 40 ps, and the first spatial profile may exhibit anyone of a square wave pulse shape (seeFIGS.4B to4D), a Gaussian shape (seeFIG.4A,6), and any user defined arbitrary pulse shape. In practice, the first pulsed laser beam may be modulated with a user defined discrete repetition rate between 1 to 20 Hz. FIGS.5A to5Cdepicts some examples of parameters that control generation of arbitrary pulses by the pulse-shaped frontend as shown inFIG.2. The parameters may include the electrical pulse153a(seeFIG.5A), an optical pulse ramp or a rise time (seeFIGS.5B,5C). FIG.4Adepicts a Gaussian shaped pulse beam108generated by the integrated fiber laser front-end102as shown inFIG.1. In this example, the pre-amplified first pulsed laser beam108may have the predefined beam characteristics corresponding to the a Gaussian shaped pulse beam108according to the setting selection of the controller140. In a case when the Gaussian shaped first pulsed laser beam108may have a slower rise time of more than 15 ns, a rising edge of the Gaussian shaped first pulsed laser beam108may be pulse sliced to a by the Pockels cell104containing the crystal material dideuterium phosphate (KD*P) to output the modified first beam110having the modified pulse width662(PW2seeFIG.6) of less than 12 nanosecond (typically 5-12 nanoseconds) with the second temporal profile. FIG.7is a schematic diagram of the Gaussian shaped first pulse laser beam110passing through an optical filter. More specifically, the Gaussian shaped first pulsed beam110may have a first diameter d1and wings sections (878). The optical filter112may include: a beam expander766configured to expand the Gaussian shaped first pulsed beam110to a diameter d2, which is greater than the first diameter d1; and an apodizer768configured to receive an expanded first beam or an expanded modified first beam770from the beam expander766, to remove the wing portions878to output a second beam118having a flat top shaped881without the wing portions878. By increasing the diameter d1of the Gaussian shaped first pulsed beam110with the beam expander766, the expanded modified first beam770may overfill an aperture772on the beam shaping element768. In one embodiment, the beam shaping element768is an apodizer. An apodizer768may include an aperture772with a grit blasted or serrated edge774. By expanding the Gaussian shaped first pulsed beam110with the beam expander766and overfilling the apodizer768with the expanded modified first beam770, wing portions of the expanded modified first beam770may be removed to further modify the Gaussian shaped first pulsed beam110with the first spatial profile to the second beam118having a second spatial profile with a more flat-top, top-hat shaped appearance while the first temporal profile remains substantially unchanged. Other beam shaping devices may be used for beam shaping element768. In another embodiment, a pi shaper (πshaper®), manufactured by AdlOptica Optical Systems GmbH of Berlin, Germany, is used as the beam shaping element768to produce a flat-top (or pi-shaped) second beam118. A beam shaping element may be used to create a substantially top-hat shaped, flat-top beam from the beam center portion876. After removing the wing sections878, the rounded portion880of the substantially top-hat shaped, flat-top beam may continue to flatten, as approximated by the dashed line881, as the second beam118with the flat-top center portion876passes through the multi-stage post-amplifier106. With reference toFIG.1, the second beam118having a second energy, a second temporal profile, and a second spatial profile may be output from the optical filter112and input into the multi-stage post-amplifier106for amplification of the second beam118. The multi-stage post-amplifier106may output an output beam126which has been post-amplified and modified. In the embodiment which the Gaussian shaped first pulsed beam110output from the integrated fiber front-end102has a first energy, a first beam diameter d1, a first temporal profile, and a first spatial profile, while the modified and post-amplified output beam126output from the multi-stage post-amplifier106has an energy greater than the first energy, a beam diameter d2greater than the first beam diameter d1, a temporal profile different than the first temporal profile, and a spatial profile which is different than the first spatial profile. With reference toFIG.9, an example multi-stage post-amplifier106is illustrated. As illustrated inFIG.9, the multi-stage post-amplifier has four post-amplification stages901,902,903, and904. As shown here, the second beam118may enter the first post-amplifier stage901, and a modified and post-amplified output beam126may be output from the fourth post-amplifier stage904. The second beam118may be input into the input905on the first amplifier stage901, and passed through the optical isolator907. From the optical isolator907, the second beam118may pass further through a vacuum relay imaging module (VRIM)909that focuses the second beam118, and then re-collimates the second beam118to an increased diameter d3, before outputting a collimated beam911to an amplifier module913. The amplifier module913may post-amplify the collimated beam911and output a post-amplified third beam915to a first amplifier stage output917. An optical isolator907may function similarly to the optical isolator114or120described above. The optical isolator907may be a Faraday isolator that transmits the second beam118in a forward direction of travel while blocking backscattered light and other backward directed energy from the second beam118. In one embodiment, the optical isolator907is used to protect the previously described components of the laser system100from backward directed energy from the second beam118after the second beam118passes through the optical isolator907. The optical isolator907may provide for a passage of the second beam118with a beam diameter of up to about 8 mm. The second beam118may pass through the isolator907and be input into the vacuum relay imaging module (VRIM)909. The VRIM909may focus and re-collimate the second beam118, and output the collimated beam911. The VRIM909may include a first lens921, a vacuum tube923, and a second lens925. The second beam118enters the VRIM909and passes through the first lens921which passes the second beam118through focus near the center of the inside of the vacuum tube923. As the second beam118exits the vacuum tube923, the second beam118is re-collimated by the second lens925. The collimated beam911is output from the VRIM909with a decreased beam intensity and a third beam diameter d3greater than the second beam diameter d2of the pulsed laser second beam118. The VRIM909relays the second beam118into a larger third diameter d3collimated beam911. The vacuum tube923is used to prevent the air breakdown of the second beam118at the point of focus. The air breakdown of the second beam118would result in a loss of beam quality and beam energy. The VRIM909may preserve a spatial profile of the second beam118, while increasing the size of the second beam118to optimally fill the gain medium927of the amplifier module913. Optimally filling the gain medium927optimizes the amplification of the collimated beam911by the amplifier module913. The beam911enters into the gain medium927of the amplifier module913. The amplifier module913includes the gain medium927and a pump source929. The pump source optically pumps the beam911as it passes through the gain medium927. The gain medium927may be a Nd:YLF crystal laser rod pumped by a laser diode array929. As the beam911passes through the rod927, the beam911is post-amplified and is output as an post-amplified third beam915. In one embodiment, the laser rod927is about 5 mm in diameter. In another embodiment, the laser rod927is about 4-6 mm in diameter. In another embodiment, the laser rod927is about 3-7 mm in diameter. The gain medium927may have a fill factor of about 80%—that is, about 80% of the gain medium area will be filled by the beam911. Generally, a gain medium with a larger fill factor will have a higher gain, and more energy stored within the gain medium may be extracted. In one embodiment, the rod927has a fill factor of 85%. The first amplifier stage901with the amplifier module913may serve as a small amplifier to post-amplify the energy of a second beam118input at the input905and output the post-amplified third beam915at the output917. In the given example, the post-amplified beam915may have a third energy of about 40 mJ to 100 mJ, a third beam diameter d3of about 4.5 mm, a third temporal profile, and a third spatial profile. The post-amplified third beam915may be input into an input931on the second amplifier stage902. The second amplifier stage902may be similar to the first amplifier stage901and include a VRIM933, and an amplifier module935having a gain medium937, and a pump source939. A post-amplified beam941may be output from the amplifier module935to a second amplifier stage output943. The VRIM933may be similar in operation to the VRIM909and include lenses and a vacuum tube to focus the amplified beam915, re-collimate the third beam915, and output a collimated beam945. The VRIM933prevents the breakdown of the post-amplified beam915, and increases a diameter d3of the post-amplified third beam915to increase the fill factor of the collimated beam945on the gain medium937. Lenses of the VRIM933may be of a larger diameter than the lenses921and923in the VRIM909(i.e., a beam with a higher energy and larger beam diameter, for example the post-amplified beam915, may utilize larger diameter lenses), and the lengths of a vacuum tube in the VRIM933may be longer than the tube923in the VRIM909. Generally, the lens size for a VRIM and a length of a vacuum tube in a VRIM increase with an increase in the beam energy and beam diameter. The VRIM933may relay image the post-amplified beam915into the collimated beam945with a diameter to provide the gain medium937with a fill factor of about 80% to 85%. The amplifier module935, similar to the amplifier module913described above, may include a gain medium937and a pump source939. The beam945may pass through the gain medium937as the gain medium937is pumped by pump source939, so as to post-amplify the beam945, before the beam945is output from the amplifier module935as the post-amplified fourth beam941. The gain medium937may be a Nd:YLF crystal laser rod pumped by a laser diode array939. In one embodiment, the laser rod937is about 9 mm in diameter. In another embodiment, the laser rod937is about 8-10 mm in diameter. In another embodiment, the laser rod937is about 7-11 mm in diameter. The second amplifier stage902with the amplifier module935may serve as a small amplifier to post-amplify the energy of a third beam915input at the input931and output the post-amplified fourth beam941at the output943. In the given example, the post-amplified fourth beam941may have a fourth energy of about 1 J, a fourth beam diameter d4of about 8.1 mm, a fourth temporal profile, and a fourth spatial profile. As shown inFIG.9, the amplifier stages901and902may operate in the small signal gain regime, which may further sharpen the leading edge of the temporal profile of a beam through gain sharpening. The pulse width of the beam may also narrow as the beam passes through these amplifier stages. The post-amplified fourth beam941may be input into an input947on the third amplifier stage903. The third amplifier stage903may be similar to the previous amplifier stages901and902and include an optical isolator949, a VRIM951, and amplifier module953having a gain medium955, and a pump source957. A post-amplified fifth beam959may be output from the amplifier module953to a third amplifier stage output961. The optical isolator949may be similar in operation to the optical isolator907described above. In one embodiment, the optical isolator949is configured to provide passage for the post-amplified fourth beam941having a diameter up to about 12 mm. The VRIM951may be similar in operation to the VRIMs909and933described above, including lenses and a vacuum tube to focus the post-amplified fourth beam941, re-collimate the post-amplified fourth beam941, and output a collimated beam963. The VRIM951prevents a breakdown of the post-amplified fourth beam941after the post-amplified fourth beam941is focused, and re-collimates the fourth beam941to increase the diameter of the post-amplified fourth beam941to increase the fill factor of the collimated beam963on the gain medium955. The lenses of the VRIM951may be of a larger diameter than the lenses in the VRIMs909and933, and the length of the vacuum tube in VRIM951may be longer than the vacuum tubes in the VRIMs909and933. The VRIM951may relay image the post-amplified fourth beam941into the collimated beam963with a diameter to provide the gain medium955with a fill factor of about 80% to 85%. The amplifier module953, similar to the amplifier modules913and935described above, may include a gain medium955and a pump source957. The collimated beam963may pass through the gain medium955as the gain medium955is pumped by the pump source957to post-amplify the beam963, before the beam963is output from the amplifier module953as the post-amplified beam959. The gain medium955may be a Nd:YLF crystal laser rod pumped by a laser diode array957. In one embodiment, the laser rod955is about 15 mm in diameter. In another embodiment, the laser rod955is about 14-18 mm in diameter. In another embodiment, the laser rod955is about 12-18 mm in diameter. The third amplifier stage903with the amplifier module953may serve as a small amplifier to post-amplify an energy of a beam input at the input947and output the fifth post-amplified beam959at the output961. In the given example, the post-amplified beam959may have a fifth energy of about 4.3 J, a fifth beam diameter d5of about 13.5 mm, a fifth temporal profile, and a fifth spatial profile. The post-amplified fifth beam959may be input into an input965on the fourth amplifier stage904. The fourth amplifier stage904may be similar to the previous amplifier stages901,902, and903, and include a VRIM967, a waveplate969, and an amplifier module971having a gain medium973and a pump source975. An post-amplified output beam126may be output from the amplifier module971to a fourth amplifier stage output977. The VRIM967may be similar in operation to the VRIMs909,933, and951described above, including lenses and a vacuum tube to focus the post-amplified fifth beam959, re-collimate the post-amplified fifth beam959, and output a collimated beam979. The VRIM967prevents the breakdown of the post-amplified fifth beam959, and re-collimates the post-amplified fifth beam959to increase the diameter of the post-amplified fifth beam959, so as to increase the fill factor of the output beam979on the gain medium973. The lenses of the VRIM967may be of a larger diameter than lenses in the VRIMs909,933, and951, and the length of the vacuum tube in VRIM967may be longer than the tubes in the VRIMs909,933, and951. The VRIM967may relay image the post-amplified fifth beam959into the collimated beam979with a diameter to provide the gain medium973with a fill factor of about 80% to 85%. The amplifier module971, similar to the amplifier modules913,935, and953described above, may include a gain medium973and a pump source975. The collimated beam979may pass through the gain medium973as the gain medium973is pumped by the pump source975to post-amplify the beam979, which is output from the amplifier module971as the post-amplified output beam126. The gain medium973may be a Nd:YLF crystal laser rod pumped by a laser diode array975. In one embodiment, the laser rod973is about 25 mm in diameter. The fourth amplifier stage904with the amplifier module971may serve as an amplifier to post-amplify an energy of a beam input at the input965and output the post-amplified output beam126at the output977. In one embodiment, the fourth amplifier stage904includes one amplifier module971. In another embodiment, the fourth amplifier stage904includes one or more amplifier modules971. In the given example, the post-amplified output beam126may have a sixth energy of about 7 J to 13 J, a sixth beam diameter d6of about 20 mm to 25 mm, a sixth temporal profile, and a sixth spatial profile. The post-amplified output beam126output from the multi-staged post-amplifier106may be a modified and post-amplified beam. Characteristics of a beam moving through the amplifier106may change due to the amplification of the beam. For example, as a beam is post-amplified, the beam diameter may be increased by the optical elements in the multi-staged post-amplifier106to more efficiently fill each gain medium (e.g., laser rod), which may provide the most optimally post-amplified laser output from the gain media, while also fully utilizing the capabilities of certain components within the multi-staged post-amplifier106. The beam diameter may increase as a beam passes through the multi-staged post-amplifier106so as to match a gain medium size (e.g., rod diameter), for example, the rods927,937,955, and973used in the respective amplifier stages901,902,903, and904. As the beam energy is increased throughout the multi-staged post-amplifier106, a risk of damage to the optical components within the multi-staged post-amplifier106increases if the beam diameter remains too small. The power density on the gain media may be kept below the damage thresholds by increasing the beam size as the beam energy increases. Other characteristics of beam moving through the multi-staged post-amplifier106may change due to the amplification of the beam. For example, the leading edge of a beam's temporal profile may be sharpened as a beam is post-amplified. As shown inFIG.1, the controller104may be used to control the timing of amplifier modules913,935,953, and971, as shown inFIG.9. Specifically, the controller104may control when the pump source in an amplifier module pumps the gain medium in the amplifier module to optimize the amplification of a beam passing through the gain medium. In this way, the post-amplification of a beam passing through an amplifier module may be controlled. With reference toFIG.1, an optical isolator120may be used after the output beam126is output from the multi-staged post-amplifier106to prevent the output beam126from interacting with the prior optical components of the laser system100once the output beam126passes through the optical isolator120. For example, once the output beam126passes through the optical isolator120, the optical isolator120prevents backscattered light from the output beam126from interacting with any of the prior optical components from the integrated fiber laser front-end102to the multi-staged post-amplifier106in the system100. In one embodiment, the optical isolator120is a Faraday isolator and may allow the passage of the beam126having a diameter up to about 35 mm. Additional elements may be used with the laser system100to deliver a modified and post-amplified laser output beam126to the target part101for laser shock peening (LSP) applications. The output beam126may pass through the optical isolator120and to the beam delivery device122for delivery to a target part101alone, or a target part101contained in the peening cell124. As illustrated inFIG.10, the laser beam delivery device122may include one or more mirrors1081, one or more optical cables1083, and a multi-axis articulating arm1085. A laser beam delivery device122may include focusing optics1087to focus a larger sized output beam126into a smaller spot size of about 2-3 mm for use in LSP applications. In one embodiment, a focusing optic1087of laser beam delivery device122focuses and adjusts a spot size of the output beam126to between about 3 mm and 8 mm. The laser beam delivery device122may also include additional safety features such as a shutter1089to block the output beam126from entering the laser beam delivery device122, unless the delivery device122is positioned to deliver the beam126to the target part101or peening cell124. Additional VRIM assemblies1091may be used with the laser beam delivery device122to maintain near filed values and measurements of the modified and post-amplified output beam126output from the amplifier106. In one embodiment, a VRIM1091is used to relay image the beam126to the target part101. The laser peening cell124may contain the target part101to be laser shock peened. A robotic handling1093system may be adapted to manipulate the laser beam delivery device122to change the position of the laser beam delivery device, and thus the position of the output beam126output from the delivery device122to the target part101. A robotic handling1093system may also be used to introduce parts to and from the laser peening cell124. The laser peening cell124may provide a light-tight environment to confine dangerous laser light from the output beam126within the laser peening cell124. The laser peening cell124may be equipped with additional options like lighting, an air filtration system, and evacuation system for removing effluent and debris produced during LSP processing, and an interface1095(i.e., entry/exit) for a robot1093to move parts into and out of the laser peening cell124, as well as other safety systems. In one embodiment, the laser peening cell124may be sized at dimensions of about 4.5 m×4.5 m×3.0 m (height) to allow a robot1093to manipulate larger target parts therein. A laser peening cell124may include a target isolation system1096, for example, an optical isolator, to prevent laser energy backscattered from the target part101from entering into the delivery device122or other optical elements of the apparatus. In one embodiment, the laser peening cell124may include an opaque overlay applicator1097to apply an opaque overlay to the target part101, and a transparent overlay applicator1099to apply a transparent overlay to the target part101. An opaque overlay and a transparent overlay may be applied to the target part101such that the post-amplified and modified beam126contacts the opaque and transparent overlays on the target part101during the LSP process. In one embodiment, the near-field values of the modified and post-amplified beam126include an energy of about 7 to 13 J, a pulse width of up to about 16 ns, an average power of 200 W, and a spot size of at least 3 mm. In this embodiment, the modified and post-amplified beam126with these parameters is produced by the laser system100at a repetition rate of 20 Hz. In another embodiment, the near-field values of the modified and post-amplified beam126include an energy of about 5 J to about 10 J, and average power of about 5 W to about 200 W, a beam uniformity of less than about 0.2 (20%), and a beam focused to a spot size of about 3 mm to about 8 mm. In this embodiment, the oscillator102of the laser system100may produce a beam with a beam quality of less than about 1.3 M2 out of the oscillator, and a beam having these parameters and the initial beam quality may be produced with a variable repetition rate between about 1 Hz and 20 Hz, for example, optionally variable “on the fly,” depending on a surface of the target part101. In another embodiment, a working distance of about 5-10 m between the final focusing optic1087and the target part101is possible. A large working distance may adequately distance the optical components of the laser system100from debris and effluent produced during the LSP processes. Embodiments described herein may use robotic controls, control systems, and instruction sets stored on a computer readable medium, that when executed, may perform exampled methods described herein. For example, a robot may be used for manipulating a target part and directing a pulsed laser beam to different locations on a target part. A robot may be used to move target parts in and out of a laser peening cell for LSP. A robot may move parts in batches for efficient LSP processing. Robots may interface with a control system to manipulate parts for LSP processes—that is, a robot may control positioning of a part such that a part may be positioned to receive both a transparent overlay, and a laser pulse for LSP. A robot arm may reposition the same part for subsequent LSP targets on the part. In one embodiment, a robot repositions a part for subsequent LSP targets at a rate of about 20 Hz. In another embodiment, a robot has a position repeatability accuracy of less than about 0.2 mm. Additionally, a robot may be used to interact with a tool or sensor to generate feedback for a system adjustment or calibration. As shown inFIG.10, a robot such as a robotic arm1093may be equipped with the components of the beam delivery device122, such that the robot1093and the beam delivery device122may be repositioned relative to a stationary part101, to deliver a laser pulse to the target part101for laser shock peening. In this way, a robot may either control the position of the target part101relative to the output beam126, or control the position of the output beam126relative to the target part101. An apparatus for use in LSP processes may interface with one or more controllers for controlling functions of the apparatus. Controllers may either automatically make calibrations or adjustments, or there may be a user interface for a user to interface with the control of the apparatus. For automatic control, various sensors may be employed to collect various beam parameters as beams progress through the apparatus. Sensor readings may either be collected in real time, or collected at intervals and used as feedback for apparatus control. For example, temperature measurements may be taken within the apparatus at regular intervals to ensure that the apparatus is working within specified temperature ranges. A pulse energy, pulse width, and spatial profile of one or more pulses may be measured and monitored, and when measured values fall outside of a user-selected range, a control system may adjust components of the apparatus so that measured values may fall within a user-selected range. Data related to laser beam parameters may be taken from inside the apparatus, and from a beam delivery path (e.g. as a fraction reflection from an optical component or leakage of energy through a mirror). Data may be taken periodically and cross-calibrated to target data to ensure that LSP process conditions are within user-selected tolerances. Beam position and spot sized may be determined with a camera positioned in the beam path with very tight tolerances. A camera may be used to capture a beam image, and parameters extracted from a beam image may be compared with ideal parameters. For example, if a beam position is not centered as indicated by an ideal position parameter, a mirror may be automatically adjusted to move a beam closer to the position defined by the ideal parameters. Adjusting a moving a beam may be done in small increments and it may take several measurements and adjustments until a beam is positioned as defined by ideal position parameters. A camera may also be used to measure a spot area and spot size. A controller may automatically adjust a lens to adjust a target lens to set a spot size. While not exhaustive or limiting, a control system used with an apparatus for use in LSP processes may be used to/for: configure and monitor an eDrive/oscillator (e.g. timing, pump current); configure and monitor timing generator; control and monitor laser safety; control and monitor laser output; control and monitor laser temperature (e.g. enclosure temperature, cooling water temperature, etc.); control output energy via adjustments to laser-head timings; control of overlay application; control and monitoring of final focusing lens; control and monitoring of final turning mirror; integration with an outside control system such as a robot; to store the configurations of components in the apparatus; store data collected by the apparatus for later processing; and to control access to the apparatus (e.g., limit apparatus access to authorized users). While not exhaustive or limiting, sensor components of a control system used with an apparatus for LSP processes may sense and monitor: pulse width, pulse energy, a beam spatial profile, diode voltage, pump current, enclosure temperature, cooling water temperature, laser safety systems, and the health of the apparatus. A control system, as described herein, may be used to automatically adjust: laser head timings; final focusing-lens position; final tuning-mirror position; overlay application timing; cooling system operation; and data collection. A control system may automatically adjust the energy of an output laser beam. A control system may automatically adjust diode voltage. Diode current may be controlled automatically by an eDrive. The method may further include repeatedly adjusting by an open loop or by a feedback loop mechanism, the parameters of the laser by adjusting the final focusing lens, adjusting the position of a mirror in a laser beam delivery device, and adjusting a pulse slicer, and re-measuring the spot size, the beam position, and the pulse width until the spot size, the beam position, and the pulse width are within a tolerance of the user-defined spot size, beam position, and pulse width. In an implementation (seeFIG.10), the output beam126from the multi-stage post amplifier106may pass through another optical isolator120to protect reflection to the multi-stage post amplifier106with an output beam126asubstantially identical to the output beam126, is delivered to a beam delivery device122which may have near field values and measurements. The laser beam delivery device122may include a vacuum relay imaging module (VRIM)1091configured to maintain the near field values and the measurements of the output beam126aand to deliver the output beam126ato the target part101. The output beam126amay be delivered to the target124through optical waveguides and reflectors to perform high power laser shock peening operations on a metallic surface. Alternately, the beam delivery system122may be replaced with a single optical fiber or a bundle of optical fibers to deliver lower power pulsed laser beam for laser bond inspection operations on composite structures. The laser system100may include a feedback mechanism by monitoring the predefined beam characteristics (such as beam frequency, pulse modulation frequency, pulse widths, energy level, etc.) through a sampled signal126bto ensure output beam consistency from pulse to pulse. In an implementation, a beam detector130(including a photodetector and a high speed oscilloscope131) may be coupled to the beam delivery device122disposed after the multi-stage post-amplifier106for monitoring the sampled signal126bon one or a combination of: beam pulse shape, beam pulse width, beam diameter, and beam energy level. The beam detector130may generate an error signal128from sampling signal126bto be sent back as a feedback signal to the controller140. If a magnitude of the error signal128exceeds a defined error range, the error signal128may cause the controller140to perform one or a combination of the following: output a correction electrical pulse signal153afrom the arbitrary wave RF generator153and a correction DC bias voltage154afrom the automatic modulator bias control (MBC) circuitry to the temporal pulse shaper152to counter the pulse width error signal until the pulse width (PW1) stays within the defined tolerance according to the selection setting; and configure one or both of the multi-stage pre-amplifier155and the multi-stage post-amplifier106with a correction gain signal146to adjust one or a combination of the beam energy amplifications and the beam profile modifications to stay within a defined output energy level and a defined beam profile for laser shock peening (LSP) and for laser bond inspection (LBI). In implementation, the laser system100may be compact, lightweight, flexible enough to be configured to perform both LSP and LBI operations without changing laser sources or any of the components already in the laser system100. The LBI application may interrogate a strength of bonded joints (i.e., an interface or a junction bonded between two different parts or different material layers) in a non-destructive fashion. LBI may also detect the presence of weak bonded regions in adhesive bonds between different materials layers that can lead to bond failure. FIG.11Aillustrates an example of applying a pulsed laser beam to interrogate a bonding region in a composite structure in a laser bond inspection (LBI). The composite structure1100may be formed by at least two separate layers (1102,1104) bonded together by an adhesive at a bond interface1106. For example, the first layer1102and the second layer1104may each be composite layers of a same composite material, or may be composite layers of different composite materials. Alternately, the first layer1102and the second layer1104may each be layers of non-composite materials, or a combination of a layer of composite material and a layer of non-composite material. Examples of composite materials may comprise any one of: carbon-fiber-reinforced-polymer (CFRP), epoxy graphite fiber or any materials which are of composite nature. Examples of non-composite materials may comprise anyone of: radio frequency (RF) wave absorptive material, thermal protective coating, a dielectric material, metal, alloys, metallic coated films, or any materials which are of non-composite nature. Yet in another example, the composite structure1100may be formed by three separate layer (1102,1104,1108) having respective bond interfaces (1106,1110). Referring toFIG.11A, a pulsed laser beam1116from the laser system100may form a beam size region1120directed to a top surface1101of the composite structure1100to interrogate an integrity of a bonding region1106A having similar beam size region1120at the bond interface1106. Although not shown inFIG.11Afor clarity sake (but shown inFIG.1B), it is customary in LBI that the top surface1101of at least the beam size region1120may be masked with an adhesive tape1112(preferably black color maximum light absorption), upon which water1114may be injected through a nozzle (not shown) which is proximal to an inspection head while pulsed laser beams1116are applied through a layer of water1114onto a surface of the tape1112. FIG.11Billustrates a sectional view A-A′ of the interrogation of the bonding region1106A in the composite structure1100, as shown inFIG.11A. Pulsed laser beam1116may travel through the water1114which on one hand being transparent to the pulsed laser beam1116, yet the water1114on the other hand may function as a tamp to contain and to apply hydrostatic pressure to an energy path of the to the beam size region1120, in order that the pulsed laser beam1116heats up and partially evaporates the material of adhesive tape1112at the beam size region1120to trigger an explosion of plasma to generate a compressive acoustic shock wave1117, which propagates through the composite materials of the first layer1102, the bonding region1106A and through the composite materials of the second layer1104until reaching a back free surface1110(i.e., terminal surface of the composite structure1100) of the second layer1104(last layer) which bounces back an acoustic wave as a reflected response1118to travel in an opposite direction through the second layer1104, the interface1106and the first layer1102which emerges the surface1101to be detected by an electromagnetic acoustic transducer (EMAT) sensor for evaluation of the integrity of the bonding region1106A at the interface1106. For a composite structure1100having more than two layers (such as having a third layer1108or more), the LBI method in likewise interrogate the bond integrity of all the intervening interfaces (i.e.,1106,1110) between the first layer1102and the last layer1108. Although water1114is described as a preferred transparent medium (for minimal cleanup effort) to the laser beam may be injected onto the surface of the adhesive tape1112, other transparent liquids such as mineral oils or liquids transparent with sufficiently high specific gravity may also be used. It should be mentioned that different composite materials with different thicknesses and different adhesives may exhibit a wide range of response in LBI, a baseline calibration test is therefore carried out and stored into a database for reference prior to conducting an actual interrogation of the bonding region1106A. A baseline calibration may follow a low-high-low energy level calibration sequence on a representative composite sample part to establish an upper limit of energy level that breaks the bonding interface. For example, a representative composite sample part may initially be interrogated by the pulsed laser beam1116at an initial low energy level of a defined energy per pulse over a defined pulse width for a defined number of pulses. The energy level of the pulsed laser beam1116may be adjusted higher and higher through raising one or a combination of an intensity and a pulse width. The reflected response is monitored by the EMAT sensor in the inspection head which is displayed as a trace on a scope to record the reflected response until reaching the energy level sufficient to break the adhesive bond to establish an energy threshold as shown on the trace output by the EMAT sensor. Afterwards, a low energy level may be resumed to compare the prior traces at a low energy level. A broken adhesive bond at the interface may show a difference on the reflected trace on the EMAT sensor. Once the energy level of a bond breakdown threshold is identified, an actual composite structure1100may be tested at an energy level at a certain percentages below the threshold energy (such as at 50% of the threshold) to allow a safety margin before reaching a destructive energy level while ensuring bond integrity is sufficient. FIG.12is a flow diagram of pulsed laser beam generation and adjustment method1200for laser shock peening or laser bond inspection on a target part by the laser system100. In step1202, generating or adjusting an arbitrary pulse shape laser beam to predefined beam characteristics according to a user defined selection setting. The generation of the first pulsed laser beam102with the predefined beam characteristics may be under a control of the controller140. In an example, the controller140may be a universal controller having at least a processor (PROC148) which executes codes of an algorithm stored in a memory (MEM147) to trigger the electrical pulse153afrom the arbitrary wave RF generator153and the DC bias voltage154afrom the automatic modulator bias control (MBC) circuitry, to modulate the CW laser beam151ato output the first pulsed laser beam152awith the pulse width PW1according to the pulse width setting selection. In steps1204and1206, the energy level of the output beam126amay be adjusted through configuring one or both of the multi-stage pre-amplifier155and the multi-stage post-amplifier106with a correction gain signal146to adjust one or a combination of the beam energy amplifications and the beam profile modifications to stay within a defined output energy level and a defined beam profile for laser shock peening (LSP) and for laser bond inspection (LBI) in step1208. In step1210, the controller140may also receive a feedback signal128generated from the sampled signal126bwhich monitors the beam characteristics of the output beam126aat the beam delivery122. The feedback signal128may be realized as a correction electrical pulse signal153ato adjust the arbitrary wave RF generator153and the DC bias voltage154afrom the automatic modulator bias control (MBC) circuitry which cause the temporal pulse shaper152to modulate the CW laser beam151ato adjust the pulse shape, the pulse width PW1and the pulse modulation frequency by an opposite amount to counter the magnitude of the error signal128until the first pulsed laser beam yields the setting selection of the controller. Unless specifically stated to the contrary, the numerical parameters set forth in the specification, including the attached claims, are approximations that may vary depending on the desired properties sought to be obtained according to the example embodiments. At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Furthermore, while the systems, methods, and apparatuses have been illustrated by describing example embodiments, and while the example embodiments have been described and illustrated in considerable detail, it is not the intention of the applicants to restrict, or in any way limit, the scope of the appended claims to such detail if such detail is not recited in the claims. It is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing the systems, methods, and apparatuses. With the benefit of this application, additional advantages and modifications will readily appear to those skilled in the art. Therefore, the invention, in its broader aspects, is not limited to the specific details and illustrative example and example embodiments shown and described. Accordingly, departures may be made from such details without departing from the spirit or scope of the general inventive concept. Thus, this application is intended to embrace alterations, modifications, and variations that fall within the scope of the appended claims. The preceding description is not meant to limit the scope of the invention. Rather, the scope of the invention is to be determined by the appended claims and their equivalents. As used in the specification and the claims, the singular forms “a,” “an,” and “the” include the plural. Furthermore, to the extent that the term “or” is employed in the claims (e.g., A or B) it is intended to mean “A or B or both.” When the applicants intend to indicate “only A or B, but not both,” then the term “only A or B but not both” will be employed. Similarly, when the applicants intend to indicate “one and only one” of A, B, or C, the applicants will employ the phrase “one and only one.” Also, to the extent that the terms “in” or “into” are used in the specification or the claims, it is intended to additionally mean “on” or “onto.” To the extent that the term “selectively” is used in the specification or the claims, it is intended to refer to a condition of a component wherein a user of the apparatus may activate or deactivate the feature or function of the component as is necessary or desired in use of the apparatus. To the extent that the term “operatively connected” is used in the specification or the claims, it is intended to mean that the identified components are connected in a way to perform a designated function. Finally, where the term “about” is used in conjunction with a number, it is intended to include ±10% of the number. In other words, “about 10” may mean from 9 to 11. | 58,521 |
11858066 | DETAILED DESCRIPTION OF THE INVENTION The laser processing machine11shown onFIG.1to3is a laser cutting machine with a laser cutting head12as the laser processing head. The laser processing machine11further encompasses a dust collection space15, which is covered by a support grate16. The support grate16defines a support plane A for supporting a workpiece8to be processed. The support grate16encompasses several grate elements17that are parallel to each other and spaced apart from each other. The laser cutting head12is arranged on a bridge14. In order to position the laser cutting head12relative to the workpiece8, the latter can be moved along the bridge14as well as with this bridge14into a moving direction (double arrow22) of the laser cutting head12. The energy is supplied to the laser cutting head12via the flexible feeder13, also referred to as supply chain. Further provided are a fluid supply device21and a fluid removal device31, which are designed to generate a fluid flow27running parallel to the grate elements17of the support grate16under the support plane A of the support grate16, and to remove flue gas28and dust, for example. The fluid removal device31encompasses a suction tube32, in which a negative pressure prevails. Alternatively or additionally, at least one ventilator can be provided, which generates a negative pressure in the area of the fluid removal device31. The fluid supply device21can be moved parallel with the laser processing head12in a displacement direction of the latter. In the embodiment shown onFIG.1, the fluid supply device21is to this end situated on the bridge14, on which the laser processing head12is also located. The fluid supply device21exhibits several nozzles23arranged one next to the other, which are situated on a shared line. The nozzles23are located under the support plane A of the support grate16. Each nozzle23is replaceably arranged in the fluid supply device21, and adjustable in its alignment relative to the fluid supply device21or the support plane A of the support grate16(seeFIG.4). The supplied fluid is a gas, advantageously air. The air is blown in pulsed. The air is supplied via the supply line25to the fluid supply device21, and routed in the latter to the nozzles23via the supply channel26. For example, the supply channel26can here incorporate valves, so as to supply individual nozzles23with the fluid or separate them from the latter. The laser processing machine11further exhibits a fluid regulating device29for regulating the fluid pressure and/or fluid flow rate. The fluid supply device36shown onFIG.6is designed similarly to the fluid supply device21, but situated on a separate guide (here the guide rail38). The fluid supply device36can be moved along the support grate16, advantageously together with the laser processing head12. The fluid supply device51can be adjusted relative to the support plane A of the support grate16in the direction of the double arrow37, e.g., swiveled or moved. Provided in the laser processing machine41according toFIG.5are two fluid supply devices51, which are situated opposite each other and can be moved synchronously with each other. For example, the fluid supply devices51are each designed similarly to the fluid supply device21described above. Each fluid supply device51can be swiveled around a respective swiveling axis52, and hence can be aligned relative to the support plane A of the support grate16. Pressurized air is used as the fluid, and provided by a compressor56of the laser processing machine41. Further provided for each fluid supply device51is a respective flap-shaped protective device58. Each protective device58can be separately actuated, and is pushed in front of the respective fluid supply device51for at least partially protecting against residue of the latter that accumulates during the processing operation. The fluid removal device51is centrally located in the dust collection space15. However, this dust collection space15could also be divided into several separate segments, wherein a separate fluid removal device is then advantageously situated in each of the segments. To support the formation of a directed flow, the or each fluid removal device can also be positioned on the side of the dust collection space15lying opposite the supply device, and preferably aligned parallel thereto. In the fluid supply device71shown onFIG.7, the nozzle73is mounted in an advantageously elastic mounting body, e.g., one made out of an elastomer, in or on the fluid supply device71. While supplying the fluid, the nozzle73can move in several degrees of freedom. In the embodiment shown onFIG.8, the several nozzles83of the fluid supply device81arranged one next to the other are each spaced apart a distance a less than the distance C between the grate elements77of the support grate75. Provided in the embodiment according toFIG.9are two fluid supply devices91and96, which are situated one opposite the other and offset relative to each other. The nozzles93of the fluid supply device91and nozzles98of the fluid supply device96are arranged in such a way that opposing flows are present between the grate elements17of the support grate16. The fluid supply devices91and96are preferably moved synchronously with each other in this example. FIG.10depicts nozzles23configured to be fed by a fluid supply line and arranged on shared line for lateral displacement22which brings the nozzles23past brushes102, themselves appropriately mounted on a conventional mount108. In operation, as the nozzles are brought past the brushes, the brushes sweep away any debris formed on the nozzles. Reference List8Workpiece11Laser processingmachine12Laser processinghead13Flexible feeder14Bridge15Dust collectionspace16Support grate17Grate element21Fluid supply device22Double arrow23Nozzle25Supply line26Supply channel27Fluid flow28Flue gas31Fluid removaldevice32Suction tube36Fluid supply device37Double arrow38Guide41Laser processingmachine51Fluid supply device52Swiveling axis56Compressor58Protective device61Fluid removaldevice71Fluid supply device72Storage body73Nozzle76Support grate77Grate element81Fluid supply device83Nozzle91Fluid supply device93Nozzle96Fluid supply device98NozzleASupport plane for16CDistance for 77aDistance for 83 | 6,286 |
11858067 | Repeat use of reference characters in the present specification and drawings is intended to represent the same or analogous features or elements of the present disclosure. DETAILED DESCRIPTION Reference now will be made in detail to exemplary embodiments of the presently disclosed subject matter, one or more examples of which are illustrated in the drawings. Each example is provided by way of explanation and should not be interpreted as limiting the present disclosure. In fact, it will be apparent to those skilled in the art that various modifications and variations can be made in the present disclosure without departing from the scope or spirit of the present disclosure. For instance, features illustrated or described as part of one embodiment can be used with another embodiment to yield a still further embodiment. Thus, it is intended that the present disclosure covers such modifications and variations as come within the scope of the appended claims and their equivalents. It is understood that terms such as “top”, “bottom”, “outward”, “inward”, and the like are words of convenience and are not to be construed as limiting terms. As used herein, the terms “first”, “second”, and “third” may be used interchangeably to distinguish one component from another and are not intended to signify location or importance of the individual components. The terms “a” and “an” do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item. Here and throughout the specification and claims, range limitations are combined and interchanged, and such ranges are identified and include all the sub-ranges contained therein unless context or language indicates otherwise. For example, all ranges disclosed herein are inclusive of the endpoints, and the endpoints are independently combinable with each other. Approximating language, as used herein throughout the specification and claims, is applied to modify any quantitative representation that could permissibly vary without resulting in a change in the basic function to which it is related. Accordingly, a value modified by a term or terms, such as “about”, “approximately”, and “substantially”, are not to be limited to the precise value specified. In at least some instances, the approximating language may correspond to the precision of an instrument for measuring the value, or the precision of the methods or machines for constructing or manufacturing the components and/or systems. As described in detail below, exemplary embodiments of the present subject matter involve the use of additive manufacturing machines or methods. As used herein, the terms “additively manufactured” or “additive manufacturing techniques or processes” refer generally to manufacturing processes wherein successive layers of material(s) are provided on each other to “build-up,” layer-by-layer, a three-dimensional component. The successive layers generally fuse together to form a monolithic component which may have a variety of integral sub-components. As used herein, the term “near net shape” refers to an additively printed feature that has an as-printed shape that is very close to the final “net” shape. A near net shape component may undergo surface finishing such as polishing, buffing, and the like, but does not require heaving machining so as to achieve a final “net” shape. By way of example, a near net shape may differ from a final net shape by about 1,500 microns or less, such as about 1,000 μm or less, such as about 500 μm or less, or such as about 100 μm or less or such as about 50 μm or less or such as about 25 μm or less. Although additive manufacturing technology is described herein as enabling fabrication of complex objects by building objects point-by-point, layer-by-layer, typically in a vertical direction, other methods of fabrication are possible and within the scope of the present subject matter. For example, although the discussion herein refers to the addition of material to form successive layers, one skilled in the art will appreciate that the methods and structures disclosed herein may be practiced with any additive manufacturing technique or manufacturing technology. For example, embodiments of the present invention may use layer-additive processes, layer-subtractive processes, or hybrid processes. Suitable additive manufacturing techniques in accordance with the present disclosure include, for example, Fused Deposition Modeling (FDM), Selective Laser Sintering (SLS), 3D printing such as by inkjets and laserjets, Sterolithography (SLA), Direct Selective Laser Sintering (DSLS), Electron Beam Sintering (EBS), Electron Beam Melting (EBM), Laser Engineered Net Shaping (LENS), Laser Net Shape Manufacturing (LNSM), Direct Metal Deposition (DMD), Digital Light Processing (DLP), Direct Selective Laser Melting (DSLM), Selective Laser Melting (SLM), Direct Metal Laser Melting (DMLM), and other known processes. In addition to using a direct metal laser sintering (DMLS) or direct metal laser melting (DMLM) process where an energy source is used to selectively sinter or melt portions of a layer of powder, it should be appreciated that according to alternative embodiments, the additive manufacturing process may be a “binder jetting” process. In this regard, binder jetting involves successively depositing layers of additive powder in a similar manner as described above. However, instead of using an energy source to generate an energy beam to selectively melt or fuse the additive powders, binder jetting involves selectively depositing a liquid binding agent onto each layer of powder. The liquid binding agent may be, for example, a photo-curable polymer or another liquid bonding agent. Other suitable additive manufacturing methods and variants are intended to be within the scope of the present subject matter. The additive manufacturing processes described herein may be used for forming components using any suitable material. For example, the material may be plastic, metal, concrete, ceramic, polymer, epoxy, photopolymer resin, or any other suitable material that may be in solid, liquid, powder, sheet material, wire, or any other suitable form. More specifically, according to exemplary embodiments of the present subject matter, the additively manufactured components described herein may be formed in part, in whole, or in some combination of materials including but not limited to pure metals, nickel alloys, chrome alloys, titanium, titanium alloys, magnesium, magnesium alloys, aluminum, aluminum alloys, iron, iron alloys, stainless steel, and nickel or cobalt based superalloys (e.g., those available under the name Inconel® available from Special Metals Corporation). These materials are examples of materials suitable for use in the additive manufacturing processes described herein and may be generally referred to as “additive materials.” In addition, one skilled in the art will appreciate that a variety of materials and methods for bonding those materials may be used and are contemplated as within the scope of the present disclosure. As used herein, references to “fusing” may refer to any suitable process for creating a bonded layer of any of the above materials. For example, if an object is made from polymer, fusing may refer to creating a thermoset bond between polymer materials. If the object is epoxy, the bond may be formed by a crosslinking process. If the material is ceramic, the bond may be formed by a sintering process. If the material is powdered metal, the bond may be formed by a melting or sintering process. One skilled in the art will appreciate that other methods of fusing materials to make a component by additive manufacturing are possible, and the presently disclosed subject matter may be practiced with those methods. In addition, the additive manufacturing process disclosed herein allows a single component to be formed from multiple materials. Thus, the components described herein may be formed from any suitable mixtures of the above materials. For example, a component may include multiple layers, segments, or parts that are formed using different materials, processes, and/or on different additive manufacturing machines. In this manner, components may be constructed which have different materials and material properties for meeting the demands of any particular application. In addition, although the components described herein are constructed entirely by additive manufacturing processes, it should be appreciated that in alternate embodiments, all or a portion of these components may be formed via casting, machining, and/or any other suitable manufacturing process. Indeed, any suitable combination of materials and manufacturing methods may be used to form these components. An exemplary additive manufacturing process will now be described. Additive manufacturing processes fabricate components using three-dimensional (3D) information, for example a three-dimensional computer model, of the component. Accordingly, a three-dimensional design model of the component may be defined prior to manufacturing. In this regard, a model or prototype of the component may be scanned to determine the three-dimensional information of the component. As another example, a model of the component may be constructed using a suitable computer aided design (CAD) program to define the three-dimensional design model of the component. The design model may include 3D numeric coordinates of the entire configuration of the component including both external and internal surfaces of the component. For example, the design model may define the body, the surface, and/or internal passageways such as openings, support structures, etc. In one exemplary embodiment, the three-dimensional design model is converted into a plurality of slices or segments, e.g., along a central (e.g., vertical) axis of the component or any other suitable axis. Each slice may define a thin cross section of the component for a predetermined height of the slice. The plurality of successive cross-sectional slices together form the 3D component. The component is then “built-up” slice-by-slice, or layer-by-layer, until finished. In this manner, the components described herein may be fabricated using the additive process, or more specifically each layer is successively formed, e.g., by fusing or polymerizing a plastic using laser energy or heat or by sintering or melting metal powder. For example, a particular type of additive manufacturing process may use an energy beam, for example, an electron beam or electromagnetic radiation such as a laser beam, to sinter or melt a powder material. Any suitable laser and laser parameters may be used, including considerations with respect to power, laser beam spot size, and scanning velocity. The build material may be formed by any suitable powder or material selected for enhanced strength, durability, and useful life, particularly at high temperatures. Each successive layer may be, for example, between about 10 μm and 200 μm, although the thickness may be selected based on any number of parameters and may be any suitable size according to alternative embodiments. Therefore, utilizing the additive formation methods described above, the components described herein may have cross sections as thin as one thickness of an associated powder layer, e.g., 10 μm, utilized during the additive formation process. In addition, utilizing an additive process, the surface finish and features of the components may vary as need depending on the application. For example, the surface finish may be adjusted (e.g., made smoother or rougher) by selecting appropriate laser scan parameters (e.g., laser power, scan speed, laser focal spot size, etc.) during the additive process, especially in the periphery of a cross-sectional layer which corresponds to the part surface. For example, a rougher finish may be achieved by increasing laser scan speed or decreasing the size of the melt pool formed, and a smoother finish may be achieved by decreasing laser scan speed or increasing the size of the melt pool formed. The scanning pattern and/or laser power can also be changed to change the surface finish in a selected area. After fabrication of the component is complete, various post-processing procedures may be applied to the component. For example, post processing procedures may include removal of excess powder by, for example, blowing or vacuuming. Other post processing procedures may include a stress relief process. Additionally, thermal, mechanical, and/or chemical post processing procedures can be used to finish the part to achieve a desired strength, surface finish, and other component properties or features. Notably, in exemplary embodiments, several aspects and features of the present subject matter were previously not possible due to manufacturing restraints. However, the present inventors have advantageously utilized current advances in additive manufacturing techniques to improve various components and the method of additively manufacturing such components. While the present disclosure is not limited to the use of additive manufacturing to form these components generally, additive manufacturing does provide a variety of manufacturing advantages, including ease of manufacturing, reduced cost, greater accuracy, etc. Also, the additive manufacturing methods described above enable much more complex and intricate shapes and contours of the components described herein to be formed with a very high level of precision. For example, such components may include thin additively manufactured layers, cross sectional features, and component contours. In addition, the additive manufacturing process enables the manufacture of a single component having different materials such that different portions of the component may exhibit different performance characteristics. The successive, additive nature of the manufacturing process enables the construction of these novel features. As a result, components formed using the methods described herein may exhibit improved performance and reliability. The present disclosure generally provides additive manufacturing machines, systems, and methods configured to additively print on pre-existing workpieces. The pre-existing workpieces may include new workpieces as well as workpieces being repaired, rebuilt, or upgraded. In one aspect, build plate clamping-assemblies are provided that may be configured to align a build plate with coordinates of an additive manufacturing system with a high degree of precision and accuracy. The presently disclosed build plates may include sockets configured to fit within a socket-receiving recess with a tolerance selected to allow for thermal expansion during an additive manufacturing process, while still providing a highly precise and accurate locking engagement. For example, using the presently disclosed build plate-clamping assemblies, a build plate may be lockingly engaged with a work station within a tolerance of from about 10 micrometers to about 50 micrometers, such as from about 20 μm to about 30 μm, such as about 50 μm or less, such as about 35 μm or less, such as about 25 μm or less, or such as about 15 μm or less. Exemplary build plate-clamping assemblies may include one or more lock-pins extending from a build plate-receiving surface of a work station. The one or more lock-pins may include one or more detents such as detent balls, which may be radially extensible so as to lockingly engage with one or more sockets of a build plate. The lock-pins may be pneumatically actuated so as to allow for quickly engaging and disengaging the build plate with the build plate-receiving surface. Alternatively, the lock-pins can be actuated using any desirable motive force, including an electrical actuator such as a piezoelectric switch, or a manual actuator such as a set screw. The lock-pins may lockingly engage with the corresponding sockets of the build plate with sufficient accuracy and precision so as to align the build plate and/or one or more workpieces secured to the build plate to coordinates of the additive manufacturing system, including coordinates of a vision system and/or coordinates of an additive manufacturing machine. With the build plate and/or the one or more workpieces aligned to such coordinates, a vision system and an additive manufacturing machine may work in concert with one another, using the vision system to obtain digital representations of the workpieces, and using the additive manufacturing machine to additively print extension segments on the workpieces according to print commands generated based on the digital representations of the workpieces obtained from the vision system. For example, the digital representations may include the respective workpiece-interfaces of the workpieces, and the print commands may be configured to cause the additive manufacturing machine to additively print extension segments on the workpiece-interfaces so as to provide near net shape components. The presently disclosed lock-pins may include flushing channels configured to allow a fluid to flush debris such as powder from the lock-pin, such as through one or more lock-pin apertures and/or one or more flushing apertures. The flushing channel provide for self-cleaning of the lock-pins so as to avoid powder from the additive manufacturing system from interfering with the operation of the lock-pins or prematurely wearing or damaging the various components that make up the build plate-clamping assembly. The presently disclosed build plate-clamping assemblies, systems, and methods described herein allow for additively printing on the workpiece-interfaces of a plurality of workpieces simultaneously or concurrently as part of the same build. Among other advantages, such build plate-clamping assemblies may provide for improved productivity and reduced labor and time consumed when rebuilding workpieces. Additionally, alignment of the build plate and/or the one or more workpieces to additive manufacturing system coordinates facilitates production of near net shape components when additively printing extension segments on a plurality of workpieces. Exemplary embodiments of an additive manufacturing system100are shown inFIG.1. An exemplary additive manufacturing system100includes a vision system102, an additive manufacturing machine104, and a control system106operably configured to control the vision system102and/or the additive manufacturing machine104. The vision system102and the additive manufacturing machine104may be provided as a single, integrated unit or as separate stand-alone units. The vision system102and the additive manufacturing machine104may be operably coupled with one another via a communication interface utilizing wired or wireless communication lines, which may provide a direct connection between the vision system102and the additive manufacturing machine104. The control system106may include one or more control systems106. For example, a single control system106may be operably configured to control operations of the vision system102and the additive manufacturing machine104, or separate control systems106may be operably configured to respectively control the vision system102and the additive manufacturing machine104. A control system106may be realized as part of the vision system102, as part of the additive manufacturing machine104, and/or as a stand-alone unit provided separately from the vision system102and/or the additive manufacturing machine104. A control system106may be operably coupled with the vision system102and/or the additive manufacturing machine104via a communication interface utilizing wired or wireless communication lines, which may provide a direct connection between the control system106and the vision system102and/or between the control system106and the additive manufacturing machine104. An exemplary additive manufacturing system100may optionally include a user interface108and/or a management system110. In some embodiments, a first control system106may generate one or more print commands and/or transmit the one or more print commands to a second control system106, and the second control system106may cause the additive manufacturing machine104to additively print the extension segments based at least in part on the print commands. The first control system106may be realized as part of a vision system102, and/or the second control system106may be realized as part of the additive manufacturing machine104. Alternatively, or in addition, the first control system106and/or the second control system106may be realized stand-alone units separate from the vision system102and/or the additive manufacturing machine104. The vision system102may include any suitable camera or cameras112or other machine vision device that may be operably configured to obtain image data that includes a digital representation of one or more fields of view114. Such a digital representation may sometimes be referred to as a digital image or an image; however, it will be appreciated that the present disclosure may be practiced without rendering such a digital representation in human-visible form. Nevertheless, in some embodiments, a human-visible image corresponding to a field of view114may be displayed on the user interface108based at least in part on such a digital representation of one or more fields of view114. The vision system102allows the additive manufacturing system100to obtain information pertaining to one or more workpieces116onto which one or more extension segments may be respectively additively printed. In particular, the vision system102allows the one or more workpieces116to be located and defined so that the additive manufacturing machine104may be instructed to print one or more extension segments on a corresponding one or more workpieces116with suitably high accuracy and precision. The one or more workpieces116may be secured to a build plate118with a workpiece-interface (e.g. a top surface)120of the respective workpieces116aligned to a build plane122. The build plate118may be secured to a vision system-work station124with one or more vision system-lock-pins126. The one or more vision system-lock-pins126may be configured according to the present disclosure so as to position the build plate118on the vision system-work station124with sufficiently high accuracy and precision. The one or more cameras112of the vision system102may be configured to obtain two-dimensional or three-dimensional image data, including a two-dimensional digital representation of a field of view114and/or a three-dimensional digital representation of a field of view114. Alignment of the workpiece-interfaces120with the build plane122allows the one or more cameras112to obtain higher quality images. For example, the one or more cameras112may have a focal length adjusted or adjustable to the build plane122. With the workpiece-interface120of one or more workpieces116aligned to the build plane122, the one or more cameras may readily obtain digital images of the workpiece-interfaces120. The one or more cameras112may include a field of view114that that encompasses all or a portion of the one or more workpieces116secured to the build plate118. For example, a single field of view114may be wide enough to encompass a plurality of workpieces116, such as each of a plurality of workpieces secured to a build plate118. Alternatively, a field of view114may more narrowly focus on an individual workpiece116such that digital representations of respective workpieces116are obtained separately. It will be appreciated that separately obtained digital images may be stitched together to obtain a digital representation of a plurality of workpieces116. In some embodiments, the camera112may include a collimated lens configured to provide a flat focal plane, such that workpieces or portions thereof located towards the periphery of the field of view114are not distorted. Additionally, or in the alternative, the vision system102may utilize a distortion correction algorithm to address any such distortion. Image data obtained by the vision system102, including a digital representation of one or more workpieces116may be transmitted to the control system106. The control system106may be configured to determine a workpiece-interface120of each of a plurality of workpieces116from one or more digital representations of one or more fields of view114having been captured by the vision system102, and then determine one or more coordinates of the workpiece-interface120of respective ones of the plurality of workpieces116. Based on the one or more digital representations, the control system106may generate one or more print commands, which may be transmitted to an additive manufacturing machine104such that the additive manufacturing machine104may additively print a plurality of extension segments on respective ones of the plurality of workpieces116. The one or more print commands may be configured to additively print a plurality of extension segments with each respective one of the plurality of extension segments being located on the workpiece-interface120of a corresponding workpiece116. The additive manufacturing machine104may utilize any desired additive manufacturing technology. In an exemplary embodiment, the additive manufacturing machine may utilize a powder bed fusion (PBF) technology, such as direct metal laser melting (DMLM), electron beam melting (EBM), selective laser melting (SLM), directed metal laser sintering (DMLS), or selective laser sintering (SLS). The additive manufacturing machine104may include any such additive manufacturing technology, or any other suitable additive manufacturing technology may also be used. By way of example, using a powder bed fusion technology, respective ones of a plurality of extension segments may be additively printed on corresponding respective ones of a plurality of workpieces116in a layer-by-layer manner by melting or fusing a layer of powder material to the workpiece-interface120. In some embodiments, a component may be additively printed by melting or fusing a single layer of powered material to the workpiece-interface120. Additionally, or in the alternative, subsequent layers of powder material may be sequentially melted or fused to one another. Still referring toFIG.1, an exemplary additive manufacturing machine104includes a powder supply chamber128that contains a supply of powder130, and a build chamber132. A build plate118having one or more workpieces116secured thereto may be positioned in the build chamber132, where the workpieces116may be additively printed in a layer-by-layer manner. The powder supply chamber128includes a powder piston134which elevates a powder floor136during operation of the system100. As the powder floor136elevates, a portion of the powder130is forced out of the powder supply chamber128. A recoater138, such as a roller or a blade, pushes some of the powder130across a work surface140and onto an additive manufacturing-work station142. The build plate118may be secured to the additive manufacturing-work station142with one or more additive manufacturing machine-lock-pins144. The one or more additive manufacturing machine-lock-pins144may be configured according to the present disclosure so as to position the build plate118on the additive manufacturing-work station142and/or within the build chamber132with sufficiently high accuracy and precision. The workpieces116may be secured to the build plate118prior to securing the build plate118to the additive manufacturing-work station142. The recoater138fills the build chamber132with powder130and then sequentially distributes thin layers of powder130across a build plane122near the top of the workpieces116to additively print sequential layers of the workpieces116. For example, the thin layers of powder130may be about 10 to 100 microns thick, such as about 20 to 80 μm thick, such as about 40 to 60 μm thick, or such as about 20 to 50 μm thick, or such as about 10 to 30 μm thick. The build plane122represents a plane corresponding to a next layer of the workpieces116to be formed from the powder130. To form a layer of an extension segment on the workpiece116(e.g., an interface layer or a subsequent layer), an energy source146directs an energy beam148such as a laser or an electron beam onto the thin layer of powder130along the build plane122to melt or fuse the powder130to the top of the workpieces116(e.g., to melt or fuse a layer to the workpiece-interfaces120and/or melt or fuse subsequent layers thereto). A scanner150controls the path of the beam so as to melt or fuse only the portions of the powder130layer that are to become melted or fused to the workpieces116. Typically, with a DMLM, EBM, or SLM system, the powder130is fully melted, with respective layers being melted or re-melted with respective passes of the energy beam148. Conversely, with DMLS, or SLS systems, layers of powder130are sintered, fusing particles of powder130with one another generally without reaching the melting point of the powder130. After a layer of powder130is melted or fused to the workpieces116, a build piston152gradually lowers the additive manufacturing-work station142by an increment, defining a next build plane122for a next layer of powder130and the recoater138to distributes the next layer of powder130across the build plane122. Sequential layers of powder130may be melted or fused to the workpieces116in this manner until the additive printing process is complete. Now referring toFIGS.2and3, an exemplary build plate-clamping assembly will be described. An exemplary build plate-clamping assembly includes a work station200, such as the work station shown inFIG.2. An exemplary build plate-clamping assembly may additionally include a build plate118corresponding to the work station, such as shown inFIG.3. The work station200shown inFIG.2may depict a vision system-work station124and/or an additive manufacturing-work station142. As shown inFIG.2, an exemplary work station200includes a build plate-receiving surface202, and one or more lock-pins204extending from the build plate-receiving surface202of the work station200. The one or more lock-pins204include one or more detents206such as detent balls or other locking elements extensible radially from the respective lock-pin204. The use of one or more lock-pins204that include detents206advantageously allow for the build plate118to be secured to the build-plate receiving surface202, while also allowing for the build plate118to be aligned laterally, vertically, and rotationally with respect to the build-plate-receiving surface202. While two lock-pins204are shown inFIG.2, it will be appreciated that the depicted embodiment is provided by way of example and not to be limiting. In fact, any desired number of lock-pins204may be provided without departing from the spirit and scope of the present disclosure, such as, for example, at least one lock-pin204, at least two lock-pins204, at least three lock-pins204, or at least four lock-pins204. Additionally, while the lock-pins depicted inFIG.2include a plurality of detents206, it will be appreciated that the number of detents206depicted is provided by way of example and not to be limiting. Various embodiments of a lock-pin204may include any desired number of detents206without departing from the spirit and scope of the present disclosure, including, for example, at least one detent206, at least two detents206, at least three detents206, or at least four detents206. The number of lock-pins204and/or the number of detents206may be selected, for example, to increase the hold-down or security with which the build plate118is secured to the build-plate. In addition to the lock-pins204, the build plate-receiving surface202may include other features that may help align a build plate118with the build plate-receiving surface202, such as grooves, notches, ridges, pins, recesses, and so forth which may be configured to mate with corresponding features of the build plate118. Such other features may be configured to provide vertical, lateral, and/or rotational alignment of the build plate118with the build plate-receiving surface202. Now referring toFIG.3, various aspects of an exemplary build plate118will be described. A build plate118may include one or more features corresponding to the build plate-receiving surface202of the work station200, so as to allow the build plate118to be clamped to the work station200at least in part by one or more lock-pins204. As shown inFIG.3, an exemplary build plate118includes one or more sockets300configured and arranged about the build plate118so as to correspond to one or more lock-pins204of the work station200. A socket300may define an integral, seamless portion of the build plate118. Alternatively, as shown, a socket300may installed in a socket-receiving recess302in the build plate, such as with an interference fit. The interference fit may be sized so as to allow the socket300to float within the socket-receiving recess302with a tolerance selected to allow for thermal expansion during an additive manufacturing process. In an alternative embodiment, the socket300may be fixed to the build plate118and the lock-pins204may be allowed to float, for example, so as to similarly allow for thermal expansion during an additive manufacturing process. Regardless of whether a socket300defines an integral, seamless portion of the build plate118or is installed in a socket-receiving recess302, the socket300may include an inside surface304defining an engagement surface configured to allow the lock-pin to lockingly engage with the socket300. The engagement surface may extend across all or a portion of the inside surface302of the socket300, and through a portion of the build plate118or entirely through the build plate118. In some embodiments, the engagement surface may include one or more recesses corresponding to respective ones of the detents206, so as to provide rotational alignment of the build plate118with the build plate-receiving surface202. In this way, a single lock-pin204may provide both lateral alignment and rotational alignment of the build plate118with the build plate-receiving surface202. In some embodiments, a variety differently configured sockets300may be interchangeably installed in a socket-receiving recess302. For example, differently configured sockets300may be provided so as to accommodate differently configured lock-pins204. While two sockets300are shown inFIG.3, it will be appreciated that the depicted embodiment is provided by way of example and not to be limiting. In fact, any desired number of sockets300may be provided without departing from the spirit and scope of the present disclosure, such as, for example, at least one socket300, at least two sockets300, at least three sockets300, or at least four sockets300. The number of sockets300, however, will typically correspond in number to at least the number of lock-pins204provided on a build plate-receiving surface202of a work station200. However, in some embodiments, the number of sockets300may exceed the number of lock-pins204provided on a build plate-receiving surface202of a work station200. In some embodiments, a plurality of build plate-receiving surfaces202may be defined on a work station200, such that the work station200may receive may receive a plurality of build plates118, and/or such that the work station200may receive a variety of different build plates118, such as build plates118that differ in respect of the number and/or configuration of sockets300. Still referring toFIG.3, in some embodiments, when the sockets300are installed in a socket-receiving recess302, the build plate118may additionally include one or more socket bolt-receiving bores306intersecting a socket-receiving recess302. The one or more socket bolt-receiving bores306may be configured to receive a socket locking-bolt308, and such as socket locking-bolt308may be insertable therein such as by a threaded fit and/or an interference fit. The socket300may be lockingly engageable with the build plate118(e.g., with the socket-receiving recess302) at least in part by one or more socket bolts308having been inserted into corresponding socket bolt-receiving bores306. For example, an outside surface of a socket300may include a socket bolt-engaging channel310disposed about at least a portion of the outer surface of the socket300. The location of the socket bolt-engaging channel310may be selected to align with the socket bolt-receiving bore306intersecting the socket-receiving recess302, such that the socket locking-bolt308may lockingly engage with the socket bolt-engaging channel310. In an exemplary embodiment, a build plate118may include a first a socket bolt-receiving bore306intersecting a first side of a socket-receiving recess302and a second a socket bolt-receiving bore306intersecting a second side of the socket-receiving recess302. The first socket bolt-receiving bore306may be configured to receive a first socket locking-bolt308insertable therein, and the second socket bolt-receiving bore306may be configured to receive a second socket locking-bolt308insertable therein. The first socket bolt-receiving bore306and the second socket bolt-receiving bore306may align with a socket bolt-engaging channel310on the outside surface of the socket300. The socket300may be lockingly engageable with the build plate118at least in part by the first socket locking-bolt308having been inserted into the first socket bolt-receiving bore306and engaging with the socket bolt-engaging channel310and/or the second socket locking-bolt308having been inserted into the second socket bolt-receiving bore306and engaging with the socket bolt-engaging channel310. Now referring toFIG.4, further aspects of an exemplary lock-pin204will be described. As shown, an exemplary lock-pin204may include a hollow pin body400a piston402disposed within the hollow pin body400, such as within an axial piston pathway404configured and arranged to receive the piston402. The piston402may be axially movable so as to actuate and retract one or more detents206. The piston402may be axially movable from a retracted position located axially distal from the one or more detents206to an actuated position located axially proximal to the one or more detents206. The one or more detents206may be extensible radially from the respective lock-pin204through corresponding detent-apertures406in the hollow pin body400responsive to the piston402having been axially moved to the actuated position. The piston402may be actuable by any desired means, including a mechanical piston402actuable by a mechanical lever or the like, a pneumatic piston402actuable by a pneumatic fluid, a hydraulic piston402actuable by a hydraulic fluid, a magnetic piston402actuable by a magnetic source such as an electromagnet, and so forth. In some embodiments, a lock-pin204may include a wedging element408disposed within the hollow pin body400between the piston402and the one or more detents206. The one or more wedging elements408may have a sloped or curved surface that slidably translates an axial movement410of the piston402to a radial movement (e.g., a radial extension and/or a radial retraction)412of the one or more detents206. For example, the one or more wedging elements408may radially extend the one or more detents206responsive to the piston402having been axially moved to the actuated position. The one or more detents206may have any desired shape suitable for extending radially from the detent-apertures406through radial movement412responsive to slidably translating movement of a wedging element408. The one or more wedging elements408may have any desired shape that provides a suitably sloped or curved surface that slidably translates an axial movement410of the piston402to a radial movement412of the one or more detents206. As shown inFIG.4, the detents206and the wedging element408both have a spherical shape. However, it will be appreciated that a detent206and/or a wedging element408may be configured according to other suitable shapes, including frustoconical shapes and polyhedral shapes. In some embodiments, the wedging element408may be an integral part of the piston402, or the wedging element408may be omitted and the piston402may slidably translate axial movement410to a radial movement412of the one or more detents206. The spherical shaped detents206and the spherical shaped wedging element408may be desirable, however, so as to reduce friction between and allow the one or more detents206and/or the one or more wedging elements408to rotate freely within the hollow pin body400, against the detent-apertures406, and/or against the engagement surface of the socket300. A detent-aperture406may provide an opening of sufficient size to allow a detent206to radially extend partially therethrough such that the detent206may lockingly engage with the engagement surface. A cross-sectional width of a detent-aperture406may be less than a cross-sectional width of a detent206so as to prevent the detent206from falling out of the detent-aperture406. Referring now toFIGS.5A-5C, further aspects of a build plate-clamping assembly500will be described. As shown inFIGS.5A-5C, an exemplary build-plate clamping assembly500may include a work station200having a build plate-receiving surface202, and one or more lock-pins204extending from the build plate-receiving surface202of the work station200. The one or more lock-pins204may include a hollow pin body400, a piston402disposed within the hollow pin body400. The piston is axially movable from a retracted position502to an actuated position504, such that the piston402may actuate one or more detents206of respective ones of the one or more lock-pins204. The one or more detents206may be radially extensible through respective ones of a plurality of detent-apertures406in the hollow pin body400responsive to the piston402having been axially moved to the actuated position504. The build-plate clamping assembly500may additionally include a build plate118configured to be clamped to the work station200at least in part by the one or more lock-pins204. The build plate118may include one or more sockets300that have an inside surface304defining an engagement surface506for the one or more detents206to lockingly engage the respective one of the one or more lock-pins204with the corresponding one of the one or more sockets300. In some embodiments, the engagement surface506may include an undercut, notch, groove, chamfer, or the like configured to lockingly engage the one or more detents206. To lockingly engage a build plate118with a build plate-receiving surface202of a work station200, the build plate118may be positioned onto the build plate-receiving surface202, with the one or more lock-pins204fitting into a corresponding socket300. The build plate-clamping assembly500may include a fluid system508configured to actuate the one or more lock-pins204. The fluid system may include a fluid source510, which may include a fluid reservoir, a pump, and/or a compressor. The fluid source510may contain a fluid512, such as a pneumatic fluid or a hydraulic fluid. A piston402of a lock-pin204may be actuable by the fluid512, which may be supplied to a distal end of the piston402, which may be in fluid communication with the fluid source510via one or more piston fluid supply lines514. In some embodiments, a fluid supply valve516may be positioned at the one or more fluid supply lines. The fluid supply valve516may be movable to an open position to actuate the piston402, moving the piston to the actuated position504, and the fluid supply valve516may be movable to a closed position to retract the piston, moving the piston to the retracted position502. The fluid source510may also supply fluid512to the flushing channel414, such as via one or more flushing fluid supply lines518. Optionally, a flushing fluid supply valve520may be positioned at the one or more fluid supply lines518so as to activate and deactivate a flow of fluid512to the flushing channel414. In some embodiments, at least a portion of the one or more flushing fluid supply lines518may define a pathway through a hollow pin body400of a lock-pin204. The flushing channel414and the pathway of the flushing fluid supply line518through the hollow pin body400may be configured to align and thereby fluidly communicate with one another when the piston402moves to a retracted position502and/or when the piston402moves to an actuated position504. In some embodiments, fluid communication between the flushing channel414and the flushing fluid supply line518may be established when the piston402moves to a retracted position502, such that debris may be flushed from the lock-pin204when the piston402moves to the retracted position502. For example, fluid512flow through the flushing channel414may be activated when removing a build plate118from a work station200. In this way, the fluid512flowing through the flushing channel414may prevent debris such as powder130from falling into the lock-pin204when removing the build plate118and/or the fluid512may flush any such debris from the lock-pin204that may otherwise accumulate in and/or around the lock-pin204. FIG.5Bshows a build plate118lockingly engaged with a build plate-receiving surface202of a work station200. The fluid supply valve516is in an open position allowing fluid512to move a plurality of pistons402to an actuated position504. The pistons402move a respective wedging element408disposed within the hollow pin body400of the lock-pin204between the piston and the plurality of detents206. The wedging element408includes a sloped or curved surface configured to allow the wedging element408to slidably translates an axial movement410of the piston402to a radial extension of a plurality of detents206responsive to the piston402having been axially moved to the actuated position504. The plurality of detents206extend radially from corresponding detent-apertures406, thereby lockingly engaging with the engagement surface506of the sockets300corresponding to the respective lock-pins204. Any suitable piston402may be utilized, including a spring acting piston402, a spring return piston402, and/or a spring extend piston402. In an exemplary embodiment, the piston402may be a spring extend piston402, which advantageously prevents the piston402from retracting in the event of a loss in air pressure. FIG.5Cshows a build plate118situated on the build plate-receiving surface202of a work station200, with fluid supply valve516in a closed position allowing the plurality of pistons402to move to a retracted position502. With the pistons402moved to the retracted position502, the wedging element408and the detents206may retract into the hollow body of the piston402, thereby disengaging the detents206from the engagement surface506of sockets300corresponding to the respective lock-pins204. With the detents206disengaged from the engagement surface506, the build plate118may be removed from the build plate-receiving surface202. Referring again toFIG.4, in some embodiments, a lock-pin204may include a flushing channel414defining a pathway for a fluid512to flow from a fluid source510and discharge from the hollow pin body400so as to flush debris from the lock-pin204. The flushing channel414may be formed within the piston402and/or the hollow pin body400of the lock-pin204. In some embodiments, the flushing channel414may traverse helically along the piston402and/or the flushing channel414may traverse helically along the inner surface of the hollow piston body400. While a single flushing channel414is shown, it will be appreciated that any number of flushing channels414may be provided, such as at least one flushing channel, at least two flushing channels, and so forth, without departing from the spirit and scope of the present disclosure. One or more flushing channels414may be in fluid communication with the plurality of detent-apertures406so as to allow the fluid512to flush debris such as powder130from the lock-pin204through the plurality of detent-apertures406. Additionally, or in the alternative, a lock-pin204may include one or more flushing apertures416disposed about the hollow pin body400. The one or more flushing apertures416may be in fluid communication with the one or more flushing channels414so as to allow the fluid512to flush debris such as powder130from the lock-pin204. An exemplary flushing pathway418may discharge through one or more flushing apertures416disposed at a proximal end420of the hollow pin body400. Another exemplary flushing pathway422may additionally or alternatively discharge through a plurality of flushing apertures416disposed about at least one of the plurality of detent-apertures406. The flushing channels414may be utilized before, during, and/or after lockingly engaging a build plate118at a work station200(e.g., before, during, and/or after the plurality of detents206have lockingly engaged the lock-pin204with the socket300). Referring now toFIGS.6A and6B, an exemplary workpiece-assembly600that includes a plurality of workpieces116secured to a build plate118is shown. The build plate118may be configured to align the workpieces116to respective registration points602. The registration points602may be mapped to a coordinate system, and the build plate-clamping assembly500may be configured to lockingly engage a build plate118to a build plate-receiving surface202of a work station such as a vision system-work station124or an additive manufacturing-work station142, so as to align the build plate118to the coordinate system such that the workpieces116may be aligned to the respective registration points602.FIG.6Ashows a workpiece-assembly600that includes a plurality of workpieces116secured to a build plate118. A build plate-clamping assembly500may be used to facilitate additively printing an extension segment606on a workpiece116, including additively printing respective ones of a plurality of extension segments606on respective ones of a plurality of workpieces116as part of a single build. In some embodiments, a build plate-clamping assembly500may be configured to align the workpieces116to respective registration points602so as to facilitate image capture by the vision system102, so as to facilitate alignment of CAD models with the workpieces116(e.g., so that extension segments606as defined by a CAD model may be properly additively printed on the workpieces116), and/or so as to facilitate operability of the additive manufacturing machine104. The arrangement depicted inFIG.6Areflects a point in time prior to additively printing extension segments onto the workpiece-interfaces120. A build plate-clamping assembly500may be configured to lockingly engage a build plate118on a vision system-work station124with one or more vision system-lock-pins126, so as to align the build plate118to vision system-coordinates. The plurality of workpieces116may be secured to the build plate118, as shown inFIG.6A, either before or after the build plate118is lockingly engaged with the build plate-receiving surface202of the vision system-work station124. The vision system102may obtain one or more digital representations of a workpiece-interface120of each of a plurality of workpieces116secured to the build plate118, with the workpieces116may be aligned to the respective registration points602. The digital representations may be obtained using one or more cameras112of the vison system102. The one or more cameras may be configured to provide one or more fields of view114that include the workpiece-interface120of each of the plurality of workpieces116secured to the build plate118. The arrangement depicted inFIG.6Bshows the workpiece-assembly600ofFIG.6Abut reflecting a point in time after an additive printing process. The build plate-clamping assembly500may be configured to lockingly engage the build plate118on an additive manufacturing-work station142with one or more additive manufacturing machine-lock-pins144, so as to align the build plate118to manufacturing machine-coordinates. As shown inFIG.6B, the additive manufacturing machine104may form a plurality of components604by performing an additive printing process configured to additively print respective ones of a plurality of extension segments606onto respective ones of the plurality of workpieces116. In addition to the build plate-clamping assembly500, the build plate118and/or workpiece-assembly600shown inFIGS.6A and6Bmay include additional features that facilitate additively printing an extension segment606on a workpiece116, including additively printing respective ones of a plurality of extension segments606on respective ones of a plurality of workpieces116as part of a single build. In some embodiments, such additional features may further align the workpieces116to respective registration points602so as to facilitate image capture by the vision system102, so as to facilitate alignment of CAD models with the workpieces116(e.g., so that extension segments606as defined by a CAD model may be properly additively printed on the workpieces116), and/or so as to facilitate operability of the additive manufacturing machine104. By way of example, as shown inFIGS.6A and6B, such additional features of an exemplary workpiece-assembly600and/or build plate118may include one or more workpiece bays608. Each of the one or more workpiece bays608may include one or more workpiece docks610. The one or more workpiece bays608may additionally include one or more clamping mechanisms612which operate to secure one or more workpieces116to the build plate118. The one or more workpiece docks610may be configured to receive one or more workpiece shoes614, and the one or more workpiece shoes614may be respectively configured to receive a workpiece116. The one or more clamping mechanisms612may be configured to clamp the workpiece shoes614in position within the corresponding workpiece docks610. A workpiece dock610and/or a workpiece shoe614may include one or more biasing members (not shown) configured to exert a biasing force (e.g., an upward or vertical biasing force) between the workpiece shoe614and the build plate118such as the bottom of the workpiece dock610. The biasing members may include one or more springs, one or more magnet pairs (e.g. permanent magnets or electromagnets), one or more piezoelectric actuator, or the like operable to exert such a biasing force. The biasing force exerted by the biasing members biases the workpiece shoe614so as to allow the workpiece-interfaces120(e.g., the top surfaces of the workpieces116) to be aligned with one another. By way of example, an alignment plate (not shown) may be placed on top of the workpieces116so as to partially compress the biasing members and bring the workpiece-interfaces120(e.g., the top surfaces of the workpieces116) into alignment with one another. In some embodiments, elevating blocks (not shown) may be placed between the build plate118and the alignment plate (not shown) to assist in positioning the alignment plate on top of the workpieces116at a desired height. With the workpiece-interfaces120aligned with one another, the clamping mechanism612may be tightened so as to secure the workpieces116to the build plate118. The workpiece-assembly600shown inFIGS.6A and6Bmay hold any number of workpieces116. As one example, the workpiece-assembly600shown may hold up to 20 workpieces116. As another example, a workpiece-assembly600may be configured to hold from 2 to 100 workpieces116, or more, such as from 2 to 20 workpieces116, such as from 10 to 20 workpieces116, such as from 20 to 60 workpieces116, such as from 25 to 75 workpieces116, such as from 40 to 50 workpieces116, such as from 50 to 100 workpieces116, such as from 5 to 75 workpieces116, such as from 75 to 100 workpieces116, such as at least 2 workpieces116, such as at least 10 workpieces116, such as at least 20 workpieces116, such as at least 40 workpieces116, such as at least 60 workpieces116, or such as at least 80 workpieces116. In some embodiments, for example, when the workpieces116are airfoils such as compressor blades or turbine blades of a turbomachine, the workpiece-assembly600may be configured to hold a number of blades that corresponds to the number of blades in one or more stages of the compressor and/or turbine, as applicable. In this way, all of the blades of a given one or more stages of a turbine and/or compressor may be kept together and extension segments606may be additively printed thereon in one single build. It will be appreciated that the workpiece-assembly600and build plate118reflect one exemplary embodiment, which is provided by way of example and not to be limiting. Various other embodiments of a workpiece-assembly600and/or build plate118are contemplated which may also allow for the workpieces116to be secured with suitable positioning and alignment, all of which are within the spirit and scope of the present disclosure. Now turning toFIGS.7A-7C, exemplary methods of aligning a build plate118to coordinates of an additive manufacturing system100(FIG.7A), exemplary methods of working on workpieces at multiple work stations (FIG.7B), and exemplary methods of additively printing extension segments606on a plurality of workpieces116(FIG.7C) will be described. As shown inFIG.7A, an exemplary method700of aligning a build plate118to coordinates of an additive manufacturing system100may include, at step702, placing a build plate118on a work station200having a build plate-receiving surface202and a lock-pin204extending from the build plate-receiving surface202. The lock-pin204may include a hollow pin body400, a piston402disposed within the hollow pin body400such that the piston402is axially movable from a retracted position502to an actuated position504, and a plurality of detents206that are radially extensible through respective ones of a plurality of detent-apertures406in the hollow pin body400responsive to the piston402having been axially moved to the actuated position504. The build plate118may include a socket300having an inside surface304defining an engagement surface506for the plurality of detents206to lockingly engage the lock-pin204with the socket300. The exemplary method700may further include, at step704, actuating the piston402so as to lockingly engage the lock-pin204with the socket300. In some embodiments, the lock-pin204may include a flushing channel414configured to flush debris from the lock-pin204, and the exemplary method700may optionally include, at step706, flushing debris from the lock-pin204. The step706of flushing debris from the lock-pin204may be performed before, during, and/or after, step702. Additionally, or alternatively, step706may be performed before, during, and/or after, step704. Now referring toFIG.7B, an exemplary method720of working on workpieces at multiple work stations will be described. As shown inFIG.7B, an exemplary method720may include, at step722, lockingly engaging a build plate118at a first work station200; at step724, performing a first work-step on a plurality of workpieces116secured to the build plate118; at step726, releasing the build plate118from the first work station200; at step728, lockingly engaging the build plate118at a second work station200; and at step730, performing a second work-step on the plurality of workpieces116secured to the build plate118. The first work station200may include a first lock-pin204extending from a first build plate-receiving surface202, and the build plate118may include a socket300configured to lockingly engage with the first lock-pin204. The second work station200may include a second lock-pin204extending from a second build plate-receiving surface202, and the socket300of the build plate118may be configured to lockingly engage with the second lock-pin204. In some embodiments, at step724, the first work-step may include obtaining with a vision system102, one or more digital representations of a workpiece-interface120of each of the plurality of workpieces116. Additionally, or in the alternative, at step730, the second work-step may include additively printing on the workpiece-interfaces120of the plurality of workpieces116. In other embodiments, at step724, the first work-step may include preparing a workpiece-interface120on the plurality of workpieces116. Additionally, or in the alternative, at step730, the second work-step may include obtaining with a vision system102, one or more digital representations of the workpiece-interfaces120of the plurality of workpieces116. Preparing a workpiece-interface120on the plurality of workpieces116may include subjecting workpieces116to a subtractive modification so as to provide a workpiece-interface120thereon. This may include cutting, grinding, machining, electrical-discharge machining, brushing, etching, polishing, or otherwise substantively modifying a workpiece116so as to provide a workpiece-interface120thereon. The subtractive modification may include removing a subtraction portion (not shown) so as to provide a workpiece-interface120. The subtractive modification may include removing at least a portion of a surface of the workpiece116that has been worn or damaged. For example, the workpiece116may include artifacts (not shown), such as microcracks, pits, abrasions, defects, foreign material, depositions, imperfections, and the like. Such artifacts may commonly appear on the top surface of a compressor or turbine blade as a result of the extreme conditions to which such blades are subjected. The subtractive modification may additionally or alternatively be performed so as to improve bonding between the workpiece116and an extension segment606additively printed thereon. In still further embodiments, an exemplary method720may optionally include, at step732, releasing the build plate118from the second work station200; at step734, lockingly engaging the build plate118at a third work station200; and at step736, performing a third work-step on the plurality of workpieces116secured to the build plate118. The third work station200may include a third lock-pin204extending from a third build plate-receiving surface202, and the socket300of the build plate118may be configured to lockingly engage with the third lock-pin204. By way of example, the third work-step may include additively printing on the workpiece-interfaces120of the plurality of workpieces116. Referring still toFIG.7B, in some embodiments, the first lock-pin204may include a first flushing channel414configured to flush debris from the first lock-pin204, and an exemplary method720may optionally include, at step738, flushing debris from the first lock-pin204before, during, and/or after lockingly engaging the build plate118at the first work station200at step722. Additionally, or in the alternative, the second lock-pin204may include a second flushing channel414configured to flush debris from the second lock-pin204, and an exemplary method720may optionally include, at step740, flushing debris from the second lock-pin204before, during, and/or after lockingly engaging the build plate118at the second work station200at step728. Further additionally, or in the alternative, the third lock-pin204may include a third flushing channel414configured to flush debris from the third lock-pin204, and an exemplary method720may optionally include, at step742, flushing debris from the third lock-pin204before, during, and/or after lockingly engaging the build plate118at the third work station200at step734. Now referring toFIG.7C, an exemplary method750of additively printing extension segments606on a plurality of workpieces116will be described. As shown inFIG.7C, an exemplary method750may include, at step752, lockingly engaging a build plate118on a first work station200associated with a vision system102, such as a vision system-work station124. The first work station200may have a first build plate-receiving surface202and a first lock-pin204extending from the first build plate-receiving surface202. The first lock-pin204may have a first plurality of radially extensible detents206. The build plate118may have a socket300with an inside surface304defining an engagement surface506for the first plurality of radially extensible detents206to lockingly engage the first lock-pin204with the socket300. The exemplary method750may further include, at step754, obtaining with a vision system102, one or more digital representations of a workpiece-interface120of each of a plurality of workpieces116secured to the build plate118. The digital representations may be obtained using a vision system102that has one or more cameras112providing one or more fields of view114that include the workpiece-interface120of each of the plurality of workpieces116secured to the build plate118. The one or more cameras112may include a field of view114that includes all of the workpiece interfaces120, or the one or more cameras112may be moved, adjusted, articulates, or the like so as to bring various workpiece interfaces120into the field of view114. Still referring toFIG.7C, an exemplary method750may further include, at step756, releasing the build plate118from the first work station200, and at step758, lockingly engaging the build plate118on a second work station200associated with an additive manufacturing machine104, such as an additive manufacturing-work station142. The second work station200may have a second build plate-receiving surface202and a second lock-pin204extending from the second build plate-receiving surface202, such as an additive manufacturing machine-lock-pin144. The second lock-pin204may have a second plurality of radially extensible detents206. The inside surface304of the socket300of the build plate118may similarly define an engagement surface506for the second plurality of radially extensible detents206to lockingly engage the second lock-pin204with the socket300. For example, a vision system-work station124including one or more vision system-lock-pins126may be coordinately configured with an additive manufacturing-work station142having one or more additive manufacturing machine-lock-pins144. In this way, a build plate118may be lockingly engaged with the build plate-receiving surface202of the vision system-work station124for purposes of obtaining with one or more digital representations of a workpiece-interface120of each of a plurality of workpieces116secured to the build plate118, and then the build plate118may be lockingly engaged with the build plate-receiving surface202of the additive manufacturing-work station142for purposes of additively printing extension segments606on the workpiece-interfaces120of the plurality of workpieces116. In some embodiments, the first lock-pin204may align the build plate118to vision system-coordinates when the first lock-pin204lockingly engages the engagement surface506of the build plate118. Additionally, or in the alternative, the second lock-pin204may align the build plate118to additive manufacturing machine-coordinates when the second lock-pin204lockingly engages the engagement surface506of the build plate118. Further to the exemplary method750of additively printing extension segments606on a plurality of workpieces116, at step760, the method750may include transmitting to the additive manufacturing machine104, one or more print commands configured to additively print the plurality of extension segments606, and at step762, the method750may include additively printing the plurality of extension segments606on the workpiece-interfaces120of the plurality of workpieces116. The one or more print commands may be generated based at least in part on the one or more digital representations obtained using the vision system102, and the plurality of extension segments606may be additively printed with each respective one of the plurality of extension segments606being located on the workpiece-interface120of a corresponding respective one of the plurality of workpieces116. Now referring toFIG.8, further features of an additive manufacturing system100will be described. As shown inFIG.8, an exemplary additive manufacturing system100may include a control system106. An exemplary control system106includes a controller800communicatively coupled with a vision system102and/or an additive manufacturing machine104. The controller800may also be communicatively coupled with a user interface108and/or a management system110. The controller800may include one or more computing devices802, which may be located locally or remotely relative to the additive vision system102and/or the additive manufacturing machine104. The one or more computing devices802may include one or more processors804and one or more memory devices806. The one or more processors804may include any suitable processing device, such as a microprocessor, microcontroller, integrated circuit, logic device, and/or other suitable processing device. The one or more memory devices806may include one or more computer-readable media, including but not limited to non-transitory computer-readable media, RAM, ROM, hard drives, flash drives, and/or other memory devices. The one or more memory devices806may store information accessible by the one or more processors804, including machine-executable instructions808that can be executed by the one or more processors804. The instructions808may include any set of instructions which when executed by the one or more processors804cause the one or more processors804to perform operations. In some embodiments, the instructions808may be configured to cause the one or more processors804to perform operations for which the controller800and/or the one or more computing devices802are configured. Such operations may include controlling the vision system102and/or the additive manufacturing machine104, including, for example, causing the vision system102to capture a digital representation of a field of view114that includes a workpiece-interface120of one or more workpieces116, generating one or more print commands based at least in part on the one or more digital representations of the one or more fields of view114, and causing the additive manufacturing machine104to additively print respective ones of the plurality of extension segments606on corresponding respective ones of the plurality of workpieces116. For example, such instructions808may include one or more print commands, which, when executed by an additive manufacturing machine104, cause an additive-manufacturing tool to be oriented with respect to a toolpath that includes a plurality of toolpath coordinates and to additively print at certain portions of the toolpath so as to additively print a layer of the plurality of extension segments606. The layer of the plurality of extension segments606may correspond to a slice of an extension segment-CAD model. Such operations may additionally or alternatively include calibrating an additive manufacturing system100. Such operations may further additionally or alternatively include receiving inputs from the vision system102, the additive manufacturing machine104, the user interface108, and/or the management system110. Such operations may additionally or alternatively include controlling the vision system102and/or the additive manufacturing machine104based at least in part on the inputs. Such operations may be carried out according to control commands provided by a control model810. As examples, exemplary control models810may include one or more control models810configured to determine a workpiece-interface120of each of a plurality of workpieces116from one or more digital representations of one or more fields of view114; one or more control models810configured to determine and/or generate an extension segment-CAD model based at least in part on the one or more digital representations of the one or more fields of view114; and/or one or more control models810configured to slice an extension segment-CAD model into a plurality of slices and/or to determine or generate a toolpath and an additive printing area for each of the plurality of slices. The machine-executable instructions808can be software written in any suitable programming language or can be implemented in hardware. Additionally, and/or alternatively, the instructions808can be executed in logically and/or virtually separate threads on processors804. The memory devices806may store data812accessible by the one or more processors804. The data812can include current or real-time data, past data, or a combination thereof. The data812may be stored in a data library814. As examples, the data812may include data associated with or generated by additive manufacturing system100, including data812associated with or generated by a controller800, the vision system102, the additive manufacturing machine104, the user interface108, the management system110, and/or a computing device802. The data812may also include other data sets, parameters, outputs, information, associated with an additive manufacturing system100, such as those associated with the vision system102, the additive manufacturing machine104, the user interface108, and/or the management system110. The one or more computing devices802may also include a communication interface816, which may be used for communications with a communications network818via wired or wireless communication lines820. The communication interface816may include any suitable components for interfacing with one or more network(s), including for example, transmitters, receivers, ports, controllers, antennas, and/or other suitable components. The communication interface816may allow the computing device802to communicate with the vision system102, the additive manufacturing machine104. The communication network818may include, for example, a local area network (LAN), a wide area network (WAN), SATCOM network, VHF network, a HF network, a Wi-Fi network, a WiMAX network, a gatelink network, and/or any other suitable communications network for transmitting messages to and/or from the controller800across the communication lines820. The communication lines820of communication network818may include a data bus or a combination of wired and/or wireless communication links. The communication interface816may additionally or alternatively allow the computing device802to communicate with a user interface108and/or a management system110. The management system110, which may include a server822and/or a data warehouse824. As an example, at least a portion of the data812may be stored in the data warehouse824, and the server822may be configured to transmit data812from the data warehouse824to the computing device802, and/or to receive data812from the computing device802and to store the received data812in the data warehouse824for further purposes. The server822and/or the data warehouse824may be implemented as part of a control system106. This written description uses exemplary embodiments to describe the presently disclosed subject matter, including the best mode, and also to enable any person skilled in the art to practice such subject matter, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the presently disclosed subject matter is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they include structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims. | 75,756 |
11858068 | To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the drawings. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION Aspects of the present disclosure provide improved laser metal deposition (LMD) assemblies, such as LMD heads or “deposition heads”. Powder nozzles come in various designs. For example, in a coaxial powder nozzle, the powder flows directly into the laser beam assisted and protected by a carrier gas, which may be an inert gas, such as argon, nitrogen, helium, or a blend of such gases. In some cases, the powder flows through a conically shaped outlet with an annular gap, while in others the powder flows through multiple outlets. A conically shaped nozzle may be constructed by a coaxially mounted inner and outer cone creating a defined offset between the two. In case of multiple outlets, the powder flows through channels inside the nozzle. An off-axis powder nozzle, by contrast, feeds the powder in a lateral position to the laser beam. The relative movement of a deposition head and work piece may be performed, for example, by a multi-axis robot or gantry system. There are a variety of ways to control the relative positioning of the work piece and the deposition head. For example, the substrate and the deposition head may move simultaneously or the substrate moves and tilts while the deposition head holds at a fixed position or moves in only one dimension. An improved deposition head that addresses the issues with conventional designs may include one or more of the following features. First, the improved deposition head may include inlets and outlets (e.g., for powder, coolant, gases, etc.) positioned within the outer diameter of the body and facing downward (i.e., in the same general direction as the powder nozzle outlet). In some cases, the powder inlets may be at an acute angle with respect to the primary axis/laser axis. For example, the powder inlets may be within +/−65 degrees of the primary axis/laser axis (or any particular sub-range within that range, such as 15-50 degrees). This configuration of inlets and outlets protects against laser reflections, which may damage the hoses or lines leading to the inlets and from the outlets, as well as anything travelling in them (such as powder). Further, this configuration of inlets minimizes the diameter of the deposition head so that it may be used in tighter spaces. In particular, this configuration provides for a relatively smaller deposition head for a given laser power level as compared to conventional designs. In one embodiment, an improved deposition head includes four angled powder inlets, one shield gas inlet, one auxiliary gas inlet (e.g., for shield gas or cooling gas), one coolant inlet, and one coolant outlet. The deposition head may also include an auxiliary gas outlet that enables customizable gas flows through use of various auxiliary gas nozzles. Second, the improved deposition head may include helical powder channels within the body of the deposition head, which provide improved (e.g., more even) distribution of the powder supply to powder distribution channels. In particular, the helical powder channels impart lateral velocity into the powder, which improves the distribution of powder across the powder distribution channels. Further, the helical powder channels may increase the laminar (i.e., smooth) flow throughout the powder flow circuit within the deposition head. The laminar flow reduces the chances of turbulence, such as eddies, which may lead to unpredictable powder delivery rates and thus lower quality deposition. Such a powder flow circuit design results in two-phase (i.e., gas and powder) flow that nearly matches the flow of single phase (gas only) flow through the deposition head. Third, the improved deposition head may include angled powder distribution channels (i.e., angled relative to the primary axis/laser axis) to reduce outer nozzle wear. Angling the powder distribution channels towards the laser spot/melt pool along their extent, may beneficially reduce the angle of impact of the powder exiting the powder distribution channels on the outer nozzle. In addition to reducing the wear on the nozzle, there is less turbulence created by the powder flow “bouncing” between outer and inner nozzles. The sharper angles in conventional deposition head designs leads to wear on the nozzles because the angle of impact with the nozzle is more severe, in much the same way that sandblasting removes material. Fourth, the improved deposition head may include a clamping mechanism for ease of assembly, maintenance, and modular nozzle changes. In some embodiments, the clamping mechanism is one of a mechanical, electromechanical, pneumatic, hydraulic or magnetic mechanism. The clamping element coupled with a modular nozzle design reduces the parts required to change nozzle sizes and styles and enables automated nozzle changes (e.g., controlled by electronic machinery and not humans). Fifth, the improved deposition head may include an adjustable axial hard-stop for ease of adjustability and reassembly. Because the deposition head sets the powder focus independently of optics that set the laser focus, and which in some examples are not in the deposition head, it is necessary to adjust the axial position of the deposition head so that the powder focus and laser focus converge. This ensures efficient processing of powder. Further, as discussed above, it may be desirable to remove a deposition head for maintenance or to change between deposition heads. The hard-stop ensures that each time the deposition head is attached to the additive manufacturing machine, it returns to a precise axial location that guarantees a precise powder focus. Sixth, the improved deposition head may include external (i.e., external to the powder flow) cooling elements that further enhance cooling and eliminate the possibility of powder-coolant contamination as the coolant flows externally around the nozzle while the powder flows internally to the nozzle. For example, the deposition head may include a coolant sleeve with internal liquid coolant channels that remove heat from an outer nozzle of the deposition head. Seventh, the improved deposition head may include an auxiliary gas nozzle that directs auxiliary gas (e.g., a cooling gas) towards a processing area. The auxiliary gas nozzle may be modular so that different auxiliary gas flows are achievable with the same deposition nozzle. Eighth, the improved deposition head may be constructed from materials with relatively high thermal conductivity, such as copper-based alloys, which makes the deposition head more robust to the high temperature environment near the melt pool. In some embodiments, such as for low mass and low power applications, aluminum may be a suitable alternative. Notably, the aforementioned features are only some of the improvements that are evident from the remaining disclosure herein. Example Improved Laser Metal Deposition (LMD) Assembly FIG.1depicts a view of an improved laser metal deposition (LMD) assembly100including an improved LMD deposition head132. Deposition head132includes powder inlets118, which in this embodiment enter main body122both within lateral extent136of main body122and at an approximately 45 degree angle relative to the primary axis/laser axis138of deposition assembly100. In other embodiments, the angle may be another acute angle relative to the primary axis/laser axis138, such as an angle within the range of +/−65 degrees of the primary axis/laser axis138. The arrangement of the powder inlets118inboard of lateral extent136of main body122allows for a smaller overall lateral extent, which allows deposition assembly100to be usable in smaller spaces. Thus, deposition head132is more versatile compared to less compact, conventional designs. Further, angled powder inlets118reduce the angle of the turn necessary for powder hoses112to turn parallel with the primary axis138after exiting powder inlets118. This arrangement allows the connection of powder hoses112with minimal if any protrusion from lateral extent136of deposition head132. As described above, this greatly reduces the chance of a laser reflection damaging the powder hoses112or their content. Further, the arrangement of the powder inlets118at an angle relative to the primary axis138induces a lateral velocity in the powder flow, which contributes to better distribution of powder across the powder distribution channels (not depicted inFIG.1) in deposition head132. Though not depicted inFIG.1, main body122includes powder flow channels that connect between powder inlets118and a powder flow guide disposed within nozzle seat124(which is discussed in more detail below). In some embodiments, these main body powder flow channels are helical, while in others they maintain the same or a similar angle as the entry angle of the powder inlets118while traversing main body122towards the powder flow guide. In other embodiments, powder inlets118may be substantially parallel to primary axis/laser axis138, but lead to powder flow channels within main body122which are angled or bent (e.g. helical) relative to primary axis/laser axis138. In such cases, while the inlet itself would not impart lateral velocity, the powder flow channels within main body122would still create the lateral velocity. Deposition head132includes coolant inlet and outlet120in main body portion122. In this embodiment, either may serve as the inlet and the other the outlet. As with the powder inlets118, the coolant inlet and outlet120are within lateral extent136of deposition head132, and in particular within a volume recessed into deposition head132and between powder inlets118. As above, this placement helps to shield the coolant lines114from any damaging laser reflections and also reduces the overall lateral extent of LMD assembly100. Note that in this embodiment, coolant inlet and outlet120comprise quick hose connection barbs. In other embodiments, other sorts of connection points may be used to connect with coolant lines114. Though not depicted inFIG.1, on the opposite side of main body122, two more inlets are installed in a substantially similar location (i.e., inboard of lateral extent136of deposition head132and within a volume recessed into main body122. In some embodiments, these additional inlets can be used for shield gas and for cooling gas. Shield gas is normally used to shield the melt pool and ensure no foreign artifacts or corrosion occurs. The cooling gas can be used to help cool the area around the melt pool to avoid deformities in the part being manufactured. The main body122of deposition head132is connected to a lower body portion124, which may also be referred to as nozzle seat124via clamping mechanisms116. In this embodiment, the clamping mechanisms116are manual, mechanical clamps that serve to fix together main body122and nozzle seat124. Clamping mechanisms116ease the changing of parts, such as nozzle assembly140, which makes maintenance and modular part changes efficient. In other embodiments, clamping mechanisms116may be electromechanical, pneumatic, hydraulic or magnetic clamping mechanisms, which may allow for automated changing of nozzle assemblies, such as nozzle assembly140. Nozzle seat124is connected to a coolant sleeve126, which provides for cooling of elements of nozzle assembly140, such as outer nozzle128and an inner nozzle (which is not depicted inFIG.1). Coolant sleeve126is connected to auxiliary gas cap134. In some embodiments, auxiliary gas cap134prevents additional gas flows from exiting gas flow channels within nozzle assembly140(not depicted inFIG.1). Further, auxiliary gas cap134can protect internal O-rings (not depicted inFIG.1) that interface between outer nozzle128and coolant sleeve126from damage (e.g., from laser reflections or manufacturing process debris). Outer nozzle128is one of two coaxial nozzles that direct powder flow towards a focal point of laser102. Outer nozzle128includes outer nozzle tool channel130, which allows for a tool to rotate outer nozzle128in order to install or uninstall outer nozzle128. Deposition head132is connected to extension tube108, which includes axial hard stop110. Extension tube108allows for proper axial location of deposition head132based on the focal point of laser102, which is set by optics outside of LMD assembly100. In other embodiments, extension tubes of different lengths can be installed to work with different optics setups. Axial hard stop110is affixed to extension tube108, for example, via a clamping force, but is movable to different locations along extension tube108. As explained above, axial hard stop110can be moved to a specific location and locked into place so that a specific height of deposition head132relative to other aspects of an LMD machine (e.g., the deposition head articulation equipment) can be set easily and reliable each time LMD assembly100is installed. Once installed, axial hard stop110will interface with axial adjustment clamp106, which clamps around extension tube108to hold LMD assembly100to other aspects of an LMD machine, such as an automated or otherwise controllable deposition head positioning system. In this way, the deposition head132can easily be moved and can be reliable reinstalled in an exact location such that the powder focal point set by nozzle assembly140corresponds with the laser focal point set by optics that are external to LMD assembly100. Note that inFIG.1, axial hard stop110is shown separated from axial adjustment clamp106in order to demonstrate its movable nature. When in use, axial hard stop110would abut axial adjustment clamp106. In other embodiments, positioning of LMD assembly100may be accomplished by other attachment mechanisms other than axial adjustment clamp106. For example, extension tube108may include threaded connections to other portions of the LMD machine. As yet another example, a rack and pinion mechanism, or set screw could provide axial adjustment of LMD assembly100. The depicted example is just one attachment mechanism, and others are possible. Also depicted inFIG.1is a X-Y adjustment stage104. The adjustment stage allows adjustment in the X and Y dimensions so that a powder cone being deposited from nozzle assembly140is perfectly aligned with a focal point of laser beam102. In other embodiments, such adjustment may be performed via optical elements (not depicted) that affect the laser beam focal point. FIG.2depicts a ninety degrees rotated view (around primary axis138) of LMD assembly100as depicted and described with respect toFIG.1. From this angle, it is clear that the coolant inlet and outlet120and the shield gas and cooling gas inlets are recessed within lateral extent136of main body122. Based on this placement, coolant inlet and outlet120and the shield gas and cooling gas inlets are completely protected from laser reflections, debris, etc. Note that inFIG.2, the various hoses leading to the various inlets and outlets are omitted. FIG.3depicts a cross-sectional view of aspects of LMD assembly100fromFIGS.1and2. Nozzle assembly140inFIG.3includes powder flow guide302, which includes helical powder flow channels318(depicted with broken lines). Helical powder flow channels318maintain the lateral velocity of the powder flow after entering the powder flow inlets (not depicted inFIG.3) in main body122. Helical powder flow channels318lead to a powder mixing chamber312(or volume or channel) where the powder flows converge into a contiguous volume before feeding into angled powder distribution channels304. Powder flow guide302also includes a plurality of O-ring channels316or grooves for sealing with nozzle seat124. As depicted and described with respect toFIGS.1and2, deposition head132may include a plurality of powder inlets, which then lead to helical powder flow channels318and then to powder mixing chamber312. In some cases, all powder inlets receive the same type of powder material, in which case helical powder flow channels318and powder mixing chamber312ensure even distribution of powder in the carrier gas flow so that the volume of powder delivered to powder cone310(and ultimately to the melt pool) is steady and consistent. When the powder inlets receive different powder materials, helical powder flow channels318and powder mixing chamber312further ensure even distribution and good mixing of the different materials prior to being delivered to powder cone310(and ultimately to the melt pool). Maintaining the lateral velocity of the powder flows into powder mixing chamber312substantially improves distribution consistency and mixing as compared to designs that have linear (i.e., relatively straight) flows of powder from entry into the deposition head to outlet from the deposition head. After powder flows into mixing chamber312via carrier gas, the powder then flows into powder distribution channels304. Again, the lateral velocity of the powder in mixing chamber312ensures an even distribution of powder to the plurality of powder distribution channels304. In this embodiment, powder distribution channels304are angled relative to the primary axis/laser axis138. In this example, the angling is slight and in other embodiments the angling may be more significant. The angle of powder distribution channels304presents the powder flow to the conically shaped powder outlet channel308(formed between inner nozzle306and outer nozzle128) at a less severe angle than if the powder distribution channels304were parallel to primary axis138. In this way, the powder flow is less abrasive to outer nozzle128as it exits the angled powder distribution channels304. Inner nozzle306is coaxial with outer nozzle128. Notably, the conical powder outlet channel308formed between inner nozzle306and outer nozzle128directs powder into a powder cone310for processing. In this embodiment, the angle of conical powder outlet channel308relative to primary axis138is different than the angle of the outer, angled surface322of outer nozzle128with respect to primary axis138. Outer nozzle128includes O-ring channels320for seating outer nozzle128against coolant sleeve126. The physical interface (i.e., contact) between coolant sleeve and outer nozzle128allows for heat transfer away from outer nozzle128, which is subject to the most heat from the laser metal deposition process (both in ambient heating and laser reflections). In some embodiments, outer nozzle128is made of highly conductive materials (e.g., copper or aluminum alloys) so that even the small surface area interface between coolant sleeve126and outer nozzle128allows for effective heat transfer away from outer nozzle128with a relatively compact coolant sleeve126. FIG.3also shows auxiliary gas cap134connected to coolant sleeve126via connecting members314. Connecting members could be, for example, screws, dowels, or other known mechanical connecting means. FIG.4depicts a portion of a nozzle assembly, such as described with respect toFIGS.1-3. The depicted portion of the nozzle assembly includes an inner nozzle406mounted coaxially with outer nozzle404, thereby forming a conical powder channel408. Powder flowing through the conical powder channel408(e.g., in a carrier gas) exits through an annular gap and forms a powder cone410which converges at a powder focal point in melt pool412. Laser beam402similarly converges at a focal point in melt pool412. In this embodiment, shield gas flows through the laser beam channel414towards melt pool412. However, due to the installation of auxiliary gas cap416, no auxiliary gas (e.g., shield gas or cooling gas) is directed towards melt pool412other than the carrier gas carrying the powder through conical powder channel408and the shield gas flowing through laser beam channel414. FIG.5depicts a portion of a nozzle assembly with an auxiliary gas nozzle516. Like inFIG.4, the depicted portion of the nozzle assembly includes an inner nozzle506mounted coaxially with outer nozzle504, thereby forming a conical powder channel508. Powder flowing through the conical powder channel508exits through an annular gap and forms a powder cone510which converges at a powder focal point in melt pool512. Laser beam502similarly converges at a focal point in melt pool512. Like inFIG.4, shield gas flows through the laser beam channel514towards melt pool512. Additionally an auxiliary gas flow520, such as shield gas or cooling gas, is directed towards melt pool512. In this embodiment, the auxiliary gas channel518is formed between outer nozzle504and a coaxially mounted auxiliary gas nozzle516, which may be affixed to the coolant sleeve instead of an auxiliary gas cap (such as auxiliary gas cap134inFIG.1). In this example, the auxiliary gas flow520is narrowly “focused” to direct the auxiliary gas520around a periphery of melt pool512. For example, the auxiliary gas520may strike the part being manufactured in a concentric circular pattern around, but not within melt pool512. As depicted, the auxiliary gas520flow may “bend” as it leaves the auxiliary gas channel518and becomes influenced by other flows, such as the shield gas flow, convective flows from the melt pool, etc. The auxiliary gas flow520may be used to further shield the melt pool512or to actively cool the part being manufactured, or both. Importantly, the rate and temperature of the auxiliary gas flow520may be controlled independently from the carrier gas flow through conical powder channel508and the shield gas flow through laser channel514. FIG.6depicts a portion of a nozzle assembly with another auxiliary gas nozzle616. Like inFIGS.4and5, the depicted portion of the nozzle assembly includes an inner nozzle606mounted coaxially with outer nozzle604, thereby forming a conical powder channel608. As above, powder flowing through the conical powder channel608exits through an annular gap and forms a powder cone610which converges at a powder focal point in melt pool612. Laser beam602similarly converges at a focal point in melt pool612. Like inFIGS.4and5, shield gas flows through the laser beam channel614towards melt pool612. Additionally, like inFIG.5, an auxiliary gas flow620, such as shield gas or cooling gas, is directed around melt pool612. In this embodiment, the auxiliary gas channel618is formed between outer nozzle604and a coaxially mounted auxiliary gas nozzle616, which may be affixed to the coolant sleeve instead of an auxiliary gas cap (such as auxiliary gas cap134inFIG.1). In this example, the auxiliary gas flow620is widely “focused” to direct the auxiliary gas620in a broad area around melt pool612. For example, the auxiliary gas620may strike the part being manufactured in broader circular pattern around melt pool612. As above, the auxiliary gas flow620may be used to further shield the melt pool612or to actively cool the part being manufactured, or both. And here again, the rate and temperature of the auxiliary gas flow620may be controlled independently from the carrier gas flow through conical powder channel608and the shield gas flow through laser channel614. Notably,FIGS.5and6depict just two examples of auxiliary gas nozzles, but many other designs are possible. In general, an auxiliary gas nozzle may be designed to shape the auxiliary gas flow in a manner best fit for a particular application. FIG.7is an isometric view of LMD assembly100, as depicted and described with respect toFIGS.1-3. FIG.8is a view of LMD assembly100, as depicted and described with respect toFIGS.1-3, with nozzle assembly140separated from main body122. In this case, clamping mechanisms116have been released to, for example, service nozzle assembly140or to change nozzle assembly140for another modular nozzle assembly. Nozzle seat124includes clamp retainers802, which interface with clamping mechanisms116. Clamp retainers802may be different in other embodiments where clamping mechanisms116are of a different type (such as an electromechanical, pneumatic, hydraulic or magnetic mechanism). FIG.8also depicts flow guide302seated within nozzle seat124, as depicted in the cross-sectional view ofFIG.3. FIG.9depicts a view of aspects of a nozzle assembly. Specifically, powder flow guide302is depicted connected with inner nozzle306. In this embodiment, inner nozzle306is threaded into an internal diameter of flow guide302. Helical powder flow channels318are depicted in broken lines within powder flow guide302. Further, powder distribution channels are depicted. As inFIG.3, here powder distribution channels304are at an angle of approximately 5 degrees relative to the primary/laser axis138. In other examples, the powder distribution channels304may be set at any angle in the range+/−45 degrees with respect to the primary/laser axis138. In some embodiments, the angle of powder distribution channels304could be larger, such as equal to the angle of inner nozzle's outer angled surface relative to the primary/laser axis138. FIG.10depicts an exploded view of aspects of a nozzle assembly. Starting from one side, powder flow guide302, which includes helical powder flow channels318, seats within nozzle seat124. Nozzle seat124includes a threaded outer portion1002for engaging with a threaded inner portion (not visible inFIG.10) of outer nozzle128. Notably, a threaded connection between nozzle seat124and outer nozzle128is just one possible way of coupling the two elements, and others are possible. Nozzle seat124also includes a threaded inner portion1004for engaging with a threaded outer portion1022of inner nozzle306. Here again, a threaded connection between nozzle seat124and inner nozzle306is just one possible way of coupling the two elements, and others are possible. Nozzle seat124also includes powder distribution channels304as described above with respect toFIG.3. Nozzle seat124also includes coolant channels1006and1008of which one may serve as an inlet and one may serve as an outlet. Coolant channels1006and1008correspond with coolant connection ports1010and1012in coolant sleeve126, and allow coolant flowing in from the main body of a nozzle assembly through nozzle seat124to reach coolant sleeve126. Either of coolant connection ports1010and1012can act as a coolant entry port while the other acts as a coolant outlet port. Nozzle seat124further includes auxiliary gas channel1014, which corresponds with auxiliary gas port1016in coolant sleeve126. Auxiliary gas port1016is in turn connected to auxiliary gas outlet1018via coolant sleeve126. In some examples, coolant sleeve126may have a cooling effect on auxiliary gas as it flows through coolant sleeve126. In the example depicted inFIG.10, the auxiliary gas outlet1018is blocked by auxiliary gas cap134, as described with respect toFIG.4. However, in other embodiments, such as described withFIGS.5and6, auxiliary gas outlet1018may feed into a gas nozzle that directs the auxiliary gas around the processing area (e.g., around a melt pool). Outer nozzle128includes O-ring channels1020, which allow for sealing with coolant sleeve126, as described above with respect toFIG.3. FIG.11depicts another exploded view of aspects of a nozzle assembly. Starting from one side, powder flow guide302, which includes helical powder flow channels318, seats within nozzle seat124. Nozzle seat124also includes powder distribution channels304as described above with respect toFIG.3. As above, nozzle seat124includes coolant flow channels1006and1008of which one may serve as an inlet and one may serve as an outlet. Coolant flow channels1006and1008correspond with coolant connection ports1010and1012in coolant sleeve126, and allow coolant flowing in from the main body of a nozzle assembly through nozzle seat124to reach coolant sleeve126. Nozzle seat further includes auxiliary gas channel1014, which corresponds with auxiliary gas port1016in coolant sleeve126. Auxiliary gas port1016is in turn connected to an auxiliary gas outlet (not visible inFIG.11) via coolant sleeve126. In the example depicted inFIG.11, the auxiliary gas outlet is blocked by auxiliary gas cap134, and in particular by an auxiliary gas seal1028in auxiliary gas cap134. However, in other embodiments, such as described withFIGS.5and6, the auxiliary gas outlet may feed into a gas cap that directs the auxiliary gas around the processing area (e.g., around a melt pool). Nozzle seat124further includes shield gas channel1024, which feeds shield gas into the laser channel via shield gas outlet1026. As above, outer nozzle128includes O-ring channels1020, which allow for sealing with coolant sleeve126, as described above with respect toFIG.3. Example Additive Manufacturing System FIG.12depicts an example of an additive manufacturing system1200. Additive manufacturing system1200includes a user interface1202. User interface1202may be, for example, a graphical user interface comprising hardware and software controls for controlling additive manufacturing system1200. In some examples, user interface1202may be integral with additive manufacturing system1200while in other examples user interface1202may be remote from additive manufacturing system1200(e.g., on a remote computer such as a laptop computer or a personal electronic device). Additive manufacturing system1200also includes a control system1204. In this example, control system1204is in data communication with user interface1202as well as directed energy source1206, material feed1208, gas feed1210, distance sensor1214, process motion system1212, tooling1216, and build surface motion system1224. In other examples, control system1204may be in data communication with further elements of additive manufacturing system1200. Control system1204may include hardware and software for controlling various aspects of additive manufacturing system1200. For example, control system1204may include one or more: processors, data storages, physical interfaces, software interfaces, software programs, firmwares, and other aspects in order to coordinate and control the various aspects of additive manufacturing system1200. In some examples, control system1204may include network connectivity to various aspects of additive manufacturing system1200as well as to external networks, such as the Internet and other networks, such as local area networks (LANs) and wide area networks (WANs). In some examples, control system1204may be a purpose-built logic board, while in other examples control system1204may be implemented by a generic computer with specific software components for controlling the various aspects of additive manufacturing system1200. The data connections shown between control system1204and other aspects of additive manufacturing system1200are exemplary only, and other implementations are possible. Control system1204may interpret commands received from user interface1202and thereafter cause appropriate control signals to be transmitted to other aspects of additive manufacturing system1200. For example, a user may input data representing a part to be manufactured using additive manufacturing system1200into user interface1202and control system1204may act upon that input to cause additive manufacturing system1200to manufacture the part. In some examples, control system1204may compile and execute machine control codes, such as G-code data, that causes aspects of additive manufacturing machine1200to operate. For example, the machine control codes may cause process motion system1212or build surface motion system1224to move to specific positions and at specific speeds. As another example, the machine control codes may cause directed energy source1206, material feed1208, gas feed1210, or tooling1216to activate or deactivate. Further, the machine control codes may modulate the operation of the aforementioned aspects of additive manufacturing machine1200, such as by increasing or decreasing the power of directed energy source1206, increasing or decreasing the flow rate of material feed1208or gas feed1210, increasing or decreasing the speed of tooling1216, etc. Process motion system1212may move elements of additive manufacturing system1200to exact positions. For example, process motion system1212may position deposition element1220at an exact distance from a part layer1222being manufactured. Similarly, process motion system1212may position tooling1216precisely to perform fine tooling operations on a part layer1222. Further, process motion system1212may position distance sensor1214precisely and provide a known reference location for distance measurements to one or more points on a part layer1222. Process motion system1212may also report current positioning of elements of additive manufacturing system1200to control system1204for use in providing feedback during the additive manufacturing process. Directed energy source1206may provide any suitable form of directed energy, such as a laser beam (e.g., from a fiber laser) or an electron beam generator, which is capable of melting a manufacturing material, such as a metal powder. Directed energy source1206may interact with directed energy guides1218in order to, for example, direct or focus a particular type of directed energy. For example, directed energy guides1218may comprise one or more optical elements, such as mirrors, lenses, filters, and the like, configured to focus a laser beam at a specific focal point and to control the size of the focused laser point. In this way, the actual creation of the laser energy by directed energy source1206may be located remote from the manipulation and focus of the laser energy by directed energy guides1218. Directed energy source1206may also be used to remove material from a manufactured part, such as by ablation. Material feed1208may supply building material, such as a powder, to deposition element1220. In some examples, material feed1208may be a remote reservoir including one or more types of raw material (e.g., different types of metal) to be used by additive manufacturing system1200. Deposition element1220may be connected with material feed1208and may direct material, such as powder, towards a focal point of directed energy source1206. In this way, deposition element1220may control the amount of material that is additively manufactured at a particular point in time. Deposition element may include nozzles, apertures, and other features for directing material, such as metal powder, towards a manufacturing surface, such as a build surface or previously deposited material layer. In some examples, deposition element1220may have controllable characteristics, such as controllable nozzle aperture sizes. In some examples, deposition element1220may be a nozzle assembly or deposition head of a laser metal deposition machine. Gas feed1210may be connected with deposition element1220to provide propulsive force to the material provided by material feed1208. In some examples, gas feed1210may modulate the gas flow rate to control material (e.g., powder) flow through deposition element1220and/or to provide cooling effect during the manufacturing process. Distance sensor1214may be any sort of sensor capable of measuring distance to an object. In some examples, distance sensor1214may be an optical distance sensor, such as a laser distance sensor. In other examples, distance sensor1214may be an acoustic distance sensor, such as an ultrasonic sensor. In yet other examples, distance sensor1214may be an electromagnetic distance sensor or a contact-based distance sensor. Tooling1216may be any form of machine tool, such as a tool for cutting, grinding, milling, lathing, etc. In the example depicted inFIG.12, Tooling1216may be moved into place by process motion system1212. In other examples, tooling1216may be separate from, for example, deposition element1220and distance sensor1214but likewise controllable by control system1204. Notably, while directed energy source1206, material feed1208, gas feed1210, directed energy guides1218, distance sensor1214, tooling1216, and deposition element1220are shown in an example configuration inFIG.12, other configurations are possible. Process motion system1212may control the positioning of one or more aspects of additive manufacturing system1200, such as distance sensor1214, deposition element1220, and tooling1216. In some examples, process motion system1212may be movable in one or more degrees of freedom. For example, process motion system1212may move and rotate deposition element1220, distance sensor1214, and tooling1216in and about the X, Y, and Z axes during the manufacturing of part layers1222. Build surface motion system1224may control the positioning of, for example, a build surface upon which part layers1222are manufactured. In some examples, build surface motion system1224may be movable in one or more degrees of freedom. For example, build surface motion system1224may move and rotate the build surface in and about the X, Y, and Z axes during the manufacturing of part layers1222. In some examples, the build surface may be referred to as a build plate or build substrate. Computer-Aided Design (CAD) software1226may be used to design a digital representation of a part to be manufactured, such as a 3D model. CAD software1226may be used to create 3D design models in standard data formats, such as DXF, STP, IGS, STL, and others. While shown separate from additive manufacturing system1200inFIG.12, in some examples CAD software1226may be integrated with additive manufacturing system1200. Slicing software1230may be used to “slice” a 3D design model into a plurality of slices or design layers. Such slices or design layers may be used for the layer-by-layer additive manufacturing of parts using, for example, additive manufacturing system1200. Computer-Aided Manufacturing (CAM) software1228may control machinery, such as machine tools, for use in manufacturing parts. CAM software1228may be used to create machine control codes, for example, G-Code or LAMPS codes as described further below, for the control of machine tools, such as tooling1216, or deposition tools, such as deposition element1220. For example, CAM software may create code in order to direct a manufacturing system, such as additive manufacturing system1200, to deposit a material layer along a 2D plane, such as a build surface, in order to build a part. For example, as shown inFIG.12, part layers1222are manufactured on (e.g., deposited on, formed on, etc.) build surface motion system1224using process motion system1212and deposition element1220. In some examples, one or more of CAD software1226, CAM software1228, and Slicing Software1230may be combined into a single piece or suite of software. For example, CAD or CAM software may have an integrated slicing function. The preceding description is provided to enable any person skilled in the art to practice the various embodiments described herein. The examples discussed herein are not limiting of the scope, applicability, or embodiments set forth in the claims. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments. For example, changes may be made in the function and arrangement of elements discussed without departing from the scope of the disclosure. Various examples may omit, substitute, or add various procedures or components as appropriate. For instance, the methods described may be performed in an order different from that described, and various steps may be added, omitted, or combined. Also, features described with respect to some examples may be combined in some other examples. For example, an apparatus may be implemented or a method may be practiced using any number of the aspects set forth herein. In addition, the scope of the disclosure is intended to cover such an apparatus or method that is practiced using other structure, functionality, or structure and functionality in addition to, or other than, the various aspects of the disclosure set forth herein. It should be understood that any aspect of the disclosure disclosed herein may be embodied by one or more elements of a claim. As used herein, the word “exemplary” means “serving as an example, instance, or illustration.” Any aspect described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects. As used herein, a phrase referring to “at least one of” a list of items refers to any combination of those items, including single members. As an example, “at least one of: a, b, or c” is intended to cover a, b, c, a-b, a-c, b-c, and a-b-c, as well as any combination with multiples of the same element (e.g., a-a, a-a-a, a-a-b, a-a-c, a-b-b, a-c-c, b-b, b-b-b, b-b-c, c-c, and c-c-c or any other ordering of a, b, and c). The following claims are not intended to be limited to the embodiments shown herein, but are to be accorded the full scope consistent with the language of the claims. Within a claim, reference to an element in the singular is not intended to mean “one and only one” unless specifically so stated, but rather “one or more.” Unless specifically stated otherwise, the term “some” refers to one or more. No claim element is to be construed under the provisions of 35 U.S.C. § 112(f) unless the element is expressly recited using the phrase “means for” or, in the case of a method claim, the element is recited using the phrase “step for.” All structural and functional equivalents to the elements of the various aspects described throughout this disclosure that are known or later come to be known to those of ordinary skill in the art are expressly incorporated herein by reference and are intended to be encompassed by the claims. Moreover, nothing disclosed herein is intended to be dedicated to the public regardless of whether such disclosure is explicitly recited in the claims. | 42,072 |
11858069 | Like parts are indicated by the same numerals/signs in the various figures. DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS FIGS.1a-1dshow a first embodiment of a hollow profile1and the steps to be taken to provide a profile1such as shown inFIG.1dwhich is able to be bent from an unbent condition (seeFIGS.1a-1d,2b) to a predetermined curvature of the profile in a bent condition (seeFIG.2a). As shown the elongate hollow profile1has four sides3,5,7,9which in a cross-section form a rectangle, in particular a square. The elongate profile1extends in a longitudinal direction between a first end11and a second end13. Between the first end11and the second end13the elongate profile1has been cut by a cutting tool (not shown) providing seven identical cutting lines14in a first side3and a second side5of the profile1and seven identical cutting lines15in a second side5and a third side7of the profile1. The cutting lines14,15form fourteen cutting patterns, i.e. seven cutting patterns in the first side3and the second side5of the profile1, and seven cutting patterns in the second side5and the third side7of the profile1. A pair of cutting lines14,15is formed by two opposing cutting lines which provide one profile section17. The profile1has seven profile sections17in total. The profile sections17define the predetermined curvature of the profile1in a bent condition (seeFIG.2a). Depending on the desired end curvature of the profile more or less profile sections can be provided. Further, it is possible that the profile sections in one single profile are not identical (not shown) to provide a specific curvature or twisted state of the profile. The profile1further comprises separation sections20provided by the cutting tool (not shown). InFIG.1aan enlarged view identified with A is shown separately to show the profile portion17comprising the separation section20in more detail. The enlarged view identified with B shows a second embodiment of the separation section20′. The profile section17is provided by the pair of cutting lines14,15, wherein the separation section20is provided between the two cutting patterns provided by the two cutting lines14,15. The profile1comprises seven pairs of cutting lines14,15. Each pair has a first cutting line14and a second cutting line15, wherein, after cutting, the first cutting line14and the second cutting15line are unconnected to each other. Further, the first cutting line14and the second cutting line15provide corresponding cutting patterns in a first side3of the profile1and in an opposing third side7of the profile1. The ends of the pairs of cutting lines14,15are located in the second side5of the profile in such a way that the separation sections20are located in a row in the longitudinal direction of the profile1between the ends of the pairs of cutting lines14,15such that the seven frangible separation sections20can be broken in a single step. The portions of the cutting lines14,15located in the second side5of the profile1extend in a direction substantially perpendicular to the longitudinal direction of the elongate profile1. The separation section20comprises two parallel frangible lines16a,16bprovided by the cutting tool, wherein each frangible line16a,16bextends between the ends of each cutting line14,15. Each frangible line16a,16bextends in the longitudinal direction of the profile1. The frangible lines16a,16bhave the same length. The parallel frangible lines16a,16bprovide a predictable and consistent breaking pattern in the profile1such that the frangible separation section20is broken without any other parts of the profile1. The profile section17′ as shown in the enlarged view B is provided by a single cutting line18. The cutting line18has a first end18aand a second end18b, wherein the separation section20′ in the profile1is provided between the first18aand the second end18bof the cutting line18. The separation section20′ comprises a perforation22. The first18aand the second end18bof the cutting line18are located on one virtual line with the perforation22to provide a predictable break-line disconnecting the profile section17′ from the profile1. Instead of a single perforation as shown in enlarged view B, it is also possible to use a number of perforations (not shown) to provide a separation section. Further, it is possible that the separation section (not shown) is provided without perforations22or frangible lines16a,16b. For example, the separation section (not shown) can be provided by a minimal distance between the ends of the two opposing cutting lines14,15in the second side5, or by a minimal distance between the ends18a,18bof the cutting line18. Such a minimal distance is for example less than 10 mm or preferably less than 5 mm. As indicated by the arrows I inFIG.1bit is also possible to provide additional cuts (not shown) between a single cutting line14,15,16. These additional cuts facilitate the removal step of the disconnected profile sections17,17′. These cuts break each profile section17,17′ in smaller pieces which can be removed from the profile1more easily, and prevent that disconnected profile sections17,17′ remain stuck in the profile1. The separation section20,20′ is frangible. In an unbroken state of the separation section the at least one profile section17,17′ is connected to the profile1and in a broken state of the separation section20,20′ the at least one profile section17,17′ is disconnected from the profile1such that it is possible to remove the profile section17,17from the profile1. The seven frangible separation sections20,20′ of the profile1can be broken in one single step, for example by using a tool35(seeFIGS.1band1c) comprising a number of sharp points36for breaking the separation sections20,20′. After disconnecting the seven profile sections17,17′ from the profile1by the tool35and simultaneously or consecutive removing the seven profile sections17,17′ from the profile1, it is possible to bend the profile1. The bendable profile is shown inFIG.1d. By bending the first end11of the profile1towards the second end13of the profile1and/or vice versa a bent profile1can be obtained as shown inFIG.2a. TheFIGS.3a-8cshow a number of profiles51;101;151;201;251;301in an unbent condition and in a bent and/or twisted condition. The profiles51;101;151;201;251;301have different cutting lines providing different shaped cutting patterns and different shaped (and removed) profile sections for bending or twisting the profiles51;101;151;201;251;301in a predetermined curvature and/or predetermined twisted state. In theFIGS.3a-7band8cthe profiles51;101;151;201;251;301are shown after removing the profile sections from the profile by means of a frangible separation section configured for example as shown with the enlarged views A and B inFIG.1a. The removed profile sections have been identified with reference signs17;67;117;167;217a,217b;267a,267binFIGS.2b-7a.FIGS.8aand8bshow a profile301having a single (frangible) profile section317. InFIG.8athe profile section317is shown in an unbroken state, wherein the profile section317is connected to the profile1by means of the separation section320,320′.FIG.8bshows the profile section317in a broken and removed state, such that the profile301can be bent.FIG.8cshows the profile301in a bent condition. The profile301is configured to bend the first end311towards and against and on the second end313of the profile301. FIGS.1d-5bshow cutting lines providing corresponding/identical cutting patterns and identical removed profile sections17;67;117;167in each of the profiles1;51;101;151shown. The tongue-recess configuration195;245of the profiles151;201shown inFIGS.5a-6bprovides an additional locking function against undesired twisting in a direction around the virtual center axis of the profile151;201. As shown inFIGS.6aand6bor inFIGS.7aand7bthe geometry of the profile sections in the profile201;251, see for example removed profile section220a;270aand220b;270b, differ with respect to each other to create the desired curvature and/or the desired twist in the bent and twisted profile201;251(FIGS.6band7b). FIG.9a-dshow a seventh embodiment of the profile351. Like the second embodiment of the profile51shown inFIGS.3aand3b, the profile351has at least one cutting line provided in four sides of the hollow profile5;351to provide a profile51with the (removed) profile sections67or a profile351with a single profile section367. TheFIGS.9band9cshow two embodiments of a frangible separation section370;370located between the ends of the cutting line36. The frangible separation section370comprises a single frangible line366. The frangible separation section370′ comprises a perforation370′. An operator can disconnect and remove the frangible separation section370;370′ by hand or with a tool (a hand tool such as screw driver) before bending the profile351to its curvature determined by the geometry of the removed single profile section367.FIGS.10and11a-11bshow an assembly500;550comprising the profile351shown inFIGS.9a-9dand a pair of fixating elements540;590. The profile351is provided with a hole352. After bending the profile351to its predetermined curvature the fixating elements540;590are used to fixate the bent profile as shown for example inFIG.11b. The fixating elements540use a fastener (not shown inFIGS.10-11b) through the hole352and the holes541to connect the upper portion360aof the profile between the fixating elements540and one or two fasteners through holes543,545to connect the lower portion360bof the profile351to the fixating elements540. The at least one fastener for fixating the lower portion360bwill be drilled through the wall of the profile351. The fixating elements590also use a fastener through the hole352and the holes591to connect the upper portion360aof the profile between the fixating elements590after bending the profile351. End portions593of the fixating elements590opposite to end portions provided with a hole591are welded to the lower portion360bbefore bending the profile351. FIG.12a-22show various further embodiments of an assembly600;650;700;750;800;850;900;950using as a basis the profile1shown inFIG.1din combination with various fixating elements640,640′;690;740;790;840;890;940;990;1040;1090;1040. For fixating the various fixating elements640,640′;690;740;790;840;890;940;990;1040;1090;1040the profile1can be provided with holes2a,2b;2a′,2b′;2a″,2a″ for fasteners642;692;992or openings2a′″,2b′″ or without any holes/openings. The various fixating elements shown inFIGS.12a-22for fixating the desired curved shape of the profile1can be grouped as follows:curved fixation plate(s)640,640′;690;740;790;990connected to or to be connected on outer wall(s) of the profile1by fasteners or by a welding process;welds840;890;940provided by a welding process on at least the fourth side9of the profile1which side9forms an inner side of bend of the curved profile1;a support element1040;1090;1140for connecting a first upper portion10aof the profile1located between the bent portion22of the profile1and the first end11of the profile1with a second portion10bof the profile1located between the bent portion22of the profile1and the second end13of the profile1. The support element is a linear profile section1040as shown inFIG.20or a rope/cable1090as shown inFIG.21connected by means of the openings2a′″,2b′″ to the profile1, or a plate1140provided with connection flanges1141a;1141bon its ends to be connected to the first10aand second portion10bof the profile1as shown inFIG.22. In practise, it is preferred that at least one end portion of the fixating element640;690;990;1040;1090;1140is fixated or attached to the profile1before bending the profile, whereas a second end portion of the fixating element640;690;990;1040;1090;1140is fixated after bending the profile1. FIG.23a-cshow an eight embodiment of a hollow profile401. The profile401has a profile section417. The profile section417is not provided in the middle of the elongate profile between its ends411,413as shown in theFIGS.1a-22, but the profile section417is provided adjacent the end411of the profile401. The single profile section417is provided by two cutting lines414,415. Each cutting line414,415has an end414a,415alocated close to the middle of the unbent profile and an end414b,415blocated in the end411of the profile401. The ends414a,415aof the two cutting lines414,415are located a minimal distance d away from each other. This minimal distance d is for example 1-10 mm, more preferably 1-5 mm. The frangible separation section420of the profile401is the profile wall portion between the ends414a,415b. In an unbroken state of the separation section420the at least one profile section417is connected to the profile401and in a broken state of the separation section420the profile section417is disconnected from the profile for removing the profile section417from the profile.FIG.23bshows the step of removing the disconnected profile section417from the profile401. After removing profile section417, it is possible to bend the first end411of the profile towards the second end413such that the (remaining of the) first end is positioned on a section of the profile cut by the cutting lines414,415. FIGS.24and25show further embodiments of the profile451;501which has two sides453,455;503,505which extend perpendicular to each other. The at least one cutting line for providing one of the removed profile sections467is provided in the two sides453,455of the profile451. The at least one cutting line for providing one of the removed profile sections517is provided in a single side505of the profile501. The profile (not shown) may also have three sides around its longitudinal axis, for example forming a U-shape in cross-section or a triangle in cross-section, with two or three edges, wherein the at least one cutting line is provided in at least two sides of the profile. The profile can be made of metal, wood, plastic, ceramic, and/or composites including fibre reinforced composites. An elongate hollow profile extending in a longitudinal direction and having a first end and a second end, wherein the profile comprises at least three sides forming at least three edges extending in a longitudinal direction, wherein the profile has been cut by a cutting tool providing at least one cutting line forming a cutting pattern for at least one profile section to be removed from the profile, wherein after removal of the at least one profile section from the profile the first end of the profile is bendable towards the second end of the profile and/or vice versa, wherein the at least one cutting line has been cut in all the sides of the profile. Preferably, this cutting line has been cut through all the edges of the profile. Preferably, the profile has four sides which in a cross-section form a rectangle/a square. Such a profile can be combined with the features disclosed in this specification such as for example but not limited to the frangible separation section as disclosed in this document. | 15,018 |
11858070 | DETAILED DESCRIPTION OF THE DISCLOSURE For the purposes of illustration only, and not to limit the generality, the present disclosure will now be described in detail with reference to the accompanying figures. This disclosure is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the drawings. The principles set forth in this disclosure are capable of other embodiments and of being practiced or carried out in various ways. Also, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. Any references to examples, embodiments, components, elements or acts of the systems and methods herein referred to in the singular may also embrace embodiments including a plurality, and any references in plural to any embodiment, component, element or act herein may also embrace embodiments including only a singularity. References in the singular or plural form are not intended to limit the presently disclosed systems or methods, their components, acts, or elements. The use herein of “including,” “comprising,” “having,” “containing,” “involving,” and variations thereof is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. References to “or” may be construed as inclusive so that any terms described using “or” may indicate any of a single, more than one, and all of the described terms. In addition, in the event of inconsistent usages of terms between this document and documents incorporated herein by reference, the term usage in the incorporated reference is supplementary to that of this document; for irreconcilable inconsistencies, the term usage in this document controls. The present disclosure is directed to sensing not only the temperature of the material to be deposited, but also the temperature of the electronic substrate upon which the material is to be deposited. For example, it is well-known in the SMT assembly industry that the electronic substrate in a dispenser is often preheated before deposition of underfill materials. Typical applications utilize what is known as a pre-heat “chuck” (an area or zone for heating an electronic substrate to a pre-determined temperature), before the electronic substrate is transported into a dispense zone to receive the material to be dispensed. A problem with the preheat zone is that there is typically only one feedback sensor to measure the temperature of the entire pre-heat chuck, which is typically 330 mm×250 mm. This feedback from a single sensor generally senses the temperature at one location, and the result is assumed to represent the temperature for the entire pre-heat zone, and does not necessarily reflect the actual temperature of a specific location of interest, for example the temperature of a critical component. Furthermore, without feedback of the actual temperature of specific location of the electronic substrate, the time allocated to pre-heat the electronic substrate is often selected to ensure that at least a sufficient time has passed for the temperature of the electronic substrate to stabilize. This may mean that valuable time is wasted waiting for an excessively long “sufficient” time period. Embodiments of the present disclosure include a non-contact sensor positioned above the electronic substrate on the pre-heat chuck to confirm that the electronic substrate is indeed at the proper temperature before proceeding with the dispensing operation, without the need to wait longer than necessary to ensure that the electronic substrate is up to temperature. By mounting the non-contact temperature sensor over a particular location on the electronic substrate, the actual temperature of a critical location can be measured. Furthermore, by mounting the sensor to the dispensing unit (or other mechanism, such as a vision probe in a printer) that can move in the X-axis and the Y-axis directions over the electronic substrate, the temperature of any specific spot can be measured. The sensor also may be mounted on a mechanism that moves towards and away from the target of the temperature measurement or the target can move in the X-axis, the Y-axis, and the Z-axis directions relative to the sensor. Such a configuration permits the effective spot size of the sensor to be adjusted or tailored to the needs of the application. For example, the sensor may be mounted on a vertical stage, and oriented to look down at an electronic substrate. By moving the vertical stage and sensor lower and thus closer to the electronic substrate, the temperature of a smaller localized spot may be measured. By moving the vertical stage and the sensor up and thus further from the electronic substrate, the temperature to be measured may effectively be averaged over a larger area. This can also be achieved by moving the target relative to the sensor to specific locations and to achieve specific spot sizes. Such an arrangement permits the sensing of a temperature averaged over a controllable size region in which the size of the sensing area may be optimized for the application requirements. Thus, by mounting the sensor to a Z-axis stage which is in turn mounted to an X-Y positioning system, for example from a pump mounting bracket, both the location and the size of the spot can be controlled. By implementing the principles of the present disclosure, a deposition system can monitor the temperature of the materials to be dispensed by the piece of equipment, as well as the temperature of critical locations on the electronic substrate upon which the material is to be dispensed, ensuring that all the participants in the deposition process are at the desired temperature. Each of these measured temperatures may be utilized to confirm that process variables are within a preset range prior to proceeding with the deposition process. Additionally (or perhaps alternatively), these measurements may be shared or stored for data collection purposes, such as Statistical Process Control (SPC), wherein the quality or yield of a process may be correlated with measured variables in a process, for the purposes of process optimization. For purposes of illustration, embodiments of the present disclosure will now be described with reference to a dispensing system, generally indicated at10, according to one embodiment of the present disclosure. Referring toFIG.1, the dispensing system10is used to dispense a viscous material (e.g., an adhesive, encapsulent, epoxy, solder paste, underfill material, etc.) or a semi-viscous material (e.g., soldering flux, etc.) onto an electronic substrate12, such as a printed circuit board (“PCB”) or semiconductor wafer. The dispensing system10may alternatively be used in other applications, such as for applying automotive gasketing material or in certain medical applications or for applying conductive inks. It should be understood that references to viscous or semi-viscous materials, as used herein, are exemplary and intended to be non-limiting. The dispensing system10includes several dispensing units, for example, first and second dispensing units, generally indicated at14and16, respectively, and a controller18to control the operation of the dispensing system. It should be understood that dispensing units also may be referred to herein as dispensing pumps and/or dispensing heads. Although two dispensing units are shown, it should be understood that more than two dispensing units may be employed. The dispensing system10may also include a frame20having a base or support22for supporting the electronic substrate12, a dispensing unit gantry24movably coupled to the frame20for supporting and moving the dispensing units14,16, and a weight measurement device or weigh scale26for weighing dispensed quantities of the viscous material, for example, as part of a calibration procedure, and providing weight data to the controller18. A conveyor system (not shown) or other transfer mechanism, such as a walking beam, may be used in the dispensing system10to control loading and unloading of electronic substrates to and from the dispensing system. The gantry24can be moved using motors under the control of the controller18to position the dispensing units14,16at predetermined locations over the electronic substrate. The dispensing system10may include a display unit28connected to the controller18for displaying various information to an operator. There may be an optional second controller for controlling the dispensing units. Also, each dispensing unit14,16can be configured with a Z axis sensor to detect a height at which the dispensing unit is disposed above the electronic substrate12or above a feature mounted on the electronic substrate. The Z axis sensor is coupled to the controller18to relay information obtained by the sensor to the controller. Prior to performing a dispensing operation, as described above, the electronic substrate, e.g., the printed circuit board, must be aligned or otherwise in registration with a dispensing unit of the dispensing system. The dispensing system further includes a vision system30, which, in one embodiment, is coupled to a vision system gantry32movably coupled to the frame20for supporting and moving the vision system. In another embodiment, the vision system30may be provided on the dispensing unit gantry24. As described, the vision system30is employed to verify the location of landmarks, known as fiducials, or components on the electronic substrate. Once located, the controller can be programmed to manipulate the movement of one or more of the dispensing units14,16to dispense material on the electronic substrate. In one embodiment, the dispense operation is controlled by the controller18, which may include a computer system configured to control material dispensing units. In another embodiment, the controller18may be manipulated by the operator. The controller18is configured to manipulate the movement of the vision system gantry32to move the vision system so as to obtain one or more images of the electronic substrate12. The controller18further is configured to manipulate the movement of the dispensing unit gantry24to move the dispensing units14,16to perform dispensing operations. Referring toFIG.2, a dispensing system is generally indicated at200. As shown, the dispensing system200includes a dispense station, generally indicated at202, a pre-heat station, generally indicated at204, provided upstream before the dispense station, and a post-heat station, generally indicated at206, provided downstream after the dispense station. The pre-heat station204defines a pre-heat zone, the dispense station202defines a dispense zone, and the post-heat station206defines a post-heat zone of the dispensing system200. A conveyor208is provided to move an electronic substrate, such as substrate12, from the pre-heat station204to the dispense station202and to the post-heat station206(left-to-right inFIG.2). As shown, the conveyor208includes two lanes208A,208B to enable substrates to enter the dispense station more efficiently and at a greater rate. The pre-heat station204is configured to heat the electronic substrate to an acceptable temperature for dispensing at the dispense station. The pre-heat station204can be configured to increase the temperature of the electronic substrate between a range of 20° C. to 200° C. The post-heat station206is configured to reduce the temperature of the electronic substrate prior to being passed along to another processing station downstream from the dispensing system200. As with the pre-heat station204, the post-heat station can be configured to reduce the temperature of the electronic substrate between a range of 20° C. to 200° C. In one embodiment, the pre-heat station204and the post-heat station206can be part of the dispensing system200that includes the dispense station202. In another embodiment, the dispensing system200can be configured to include the dispense station202only, and the pre-heat station204and/or the post-heat station206can be separate units that are assembled with the dispensing system, with the conveyor208extending through all three stations. The pre-heat station204includes an adjustable bracket, generally indicated at210, that is mounted on the conveyor208in an elevated position over the lanes208A,208B of the conveyor. As shown, the adjustable bracket210is positioned over the electronic substrate as the electronic substrate travels along the lanes208A,208B of the conveyor208through the pre-heat station204. For each lane208A,208B, an infrared sensor212is mounted on the adjustable bracket210and is positioned to be directed toward the electronic substrate as the electronic substrate travels under the adjustable bracket and the infrared sensor on the lane of the conveyor. The adjustable bracket210of the pre-heat station204can be configured to move each infrared sensor212in the X-axis, Y-axis and Z-axis directions. In one embodiment, the adjustable bracket210includes a first rail member214that extends over lane208A and a second rail member216that extends over lane208B. The first rail member214includes a first support member218that is configured to ride along a track formed in the first rail member. A first thumb screw220is provided to secure the first support member218to the first rail member214to lock the first support member in place. The infrared sensor212is mounted on a free end of the first support member218. Similarly, the second rail member216includes a second support member222that is configured to ride along a track or slot formed in the second rail member. A second thumb224screw is provided to secure the second support member222to the second rail member216to lock the second support member in place. The infrared sensor212is mounted on a free end of the second support member222. The locations of the infrared sensors212can be adjusted by unlocking the thumb screws220,224and moving the respective first and second support members218,222to desired locations. For each lane208A,208B, by mounting the infrared sensor212over a particular location of the electronic substrate as the electronic substrate travels along the lane, the actual temperature of a critical location of the electronic substrate can be measured. The adjustable bracket210is configured to move each infrared sensor212towards and away from the target of the temperature measurement in the Z-axis direction and to position the infrared sensor in the X-axis and the Y-axis directions. Such a configuration permits the effective spot size of the infrared sensor to be adjusted or tailored to the needs of the application. As mentioned above, the infrared sensor212can be oriented to look down at the electronic substrate. By manipulating the adjustable bracket210to lower the infrared sensor212closer to the electronic substrate, the temperature of a smaller localized spot may be measured. Conversely, by manipulating the adjustable bracket210to raise the infrared sensor212away from the electronic substrate, the temperature of a larger spot may be measured, thereby effectively being averaged over a larger area. Such a configuration enables the sensing of a temperature averaged over a controllable size region in which the size of the sensing area may be optimized for the application requirements. Similarly, the post-heat station206includes an adjustable bracket, generally indicated at230, which is identical to adjustable bracket210of the pre-heat station204, and is mounted on the conveyor208in an elevated position over the electronic substrate, such as electronic substrate212, as the electronic substrate travels along the lanes208A,208B of the conveyor through the post-heat station. For each lane208A,208B, an infrared sensor212, which is identical to the infrared sensors used in the pre-heat station204, is mounted on the adjustable bracket230and is positioned to be directed toward the electronic substrate as the electronic substrate travels under the adjustable bracket and the infrared sensor. The adjustable bracket230of the post-heat station206can be configured to move each infrared sensor212in the X-axis, Y-axis and Z-axis directions. As mentioned, in one embodiment, the adjustable bracket230is identical to adjustable bracket210, and includes a third rail member234that extends over lane208A and a fourth rail member236that extends over lane208B. The third rail member234includes a third support member238that is configured to ride along a track or slot formed in the third rail member. A third thumb screw240is provided to secure the third support member238to the third rail member234to lock the third support member in place. The infrared sensor212is mounted on a free end of the third support member238. Similarly, the fourth rail member236includes a fourth support member242that is configured to ride along a track formed in the fourth rail member. A fourth thumb screw244is provided to secure the fourth support member242to the fourth rail member236to lock the fourth support member in place. The infrared sensor212is mounted on a free end of the fourth support member242. The locations of the infrared sensors212can be adjusted by unlocking the third and fourth thumb screws240,244and moving the third support member238and the fourth support member242to desired locations. In one embodiment, the dispense station202further includes an infrared sensor212mounted on a carriage250that supports a dispensing unit252or on the dispensing unit directly. Thus, the infrared sensor212is moved by the gantry in the X-axis, Y-axis and Z-axis directions. The infrared sensor212can be operated to ensure that the electronic substrate as it is positioned within the dispense station202on lane208A or208B of the conveyor208is at a suitable temperature for dispensing. As described above with respect to the pre-heat station204and the post-heat station206, the dispense station can be configured to increase, maintain and/or decrease the temperature of the electronic substrate between 20° C. and 200° C. Alternatively, in another embodiment, the infrared sensor212can be mounted on the vision system gantry, such as the vision system gantry32of dispensing system10, to move the infrared sensor in the X-axis, Y-axis and Z-axis directions. As with dispensing system10, the dispensing system200can include more than one dispensing unit, with the infrared sensor212being mounted on one of the dispensing units. Thus, infrared sensing is used for non-contact temperature tracking over components on the electronic substrate carried by the conveyor. Temperature sensing enables the operator to monitor and record the temperature of the substrate in each process zone (up to six) within the machine. Pre-heat and post-heat dispense zones use the infrared sensors mounted to the adjustable brackets in which the infrared sensors are positioned and locked in place. The dispense zone(s) uses the infrared sensor mounted to the carriage and/or the dispensing unit so the configuration is flexible as to the location as set in the process program. For each process zone, the operator selects a target temperature and tolerance range that the product needs to reach in order to be considered “ready.” “Ready” can mean that the product can move to the next conveyor zone or if in the dispense zone “ready” for the dispense process to begin. The other objective is to keep the substrate in the “ready” state, so when at temperature the machine automatically adjusts heat settings to keep the product within the desired tolerance range. Referring toFIG.3, which shows graphic user interface or GUI300, infrared or IR sensing for electronic substrate temperature can be configured for all three zones, i.e., the pre-heat zone, the dispense zone, and the post-heat zone, through dedicated software. Within these zones, IR sensing is achieved with the non-contact heat sensors and electronic substrate clamping and can be configured for both single and dual-lane machine through execution software. Referring toFIG.4, which shows GUI400, both pre-heat and post-heat sensing can be configured with non-contact heat sensing. The dispense station configuration includes an option to enable IR sensing. The operator can program temperature settings for each program individually under a temperature tab while creating a new process program. The operator checks option “Use Temperature Settings from Process Program” to override the temperature settings from the machine configuration under the temperature tab. An alarm status changes from “Using Machine Config Parameters” to “Using Process Program Parameters.” If a process required heat, then a “Heat Required” option can be checked to ensure no process program running without proper heat. The software can be configured to issue an alarm in this case. Referring toFIG.5, which shows GUI500, a maximum temperature limit for IR sensing is 100° C. for all three zones, i.e., the pre-heat zone, the dispense zone, and the post-heat zone. The operator has an option to enable IR sensing ON/OFF for each zone within the process program. Default values for “Min. Temperature,” “Max. Temperature,” “Soak Time,” “Timeout” and “Polling Rate” are displayed for each zone, which are represented in Table 1. TABLE 1Min. Temp.Minimum electronic substrate temperaturerequired for pre heat, dispense and postheat zoneMax. Temp.Maximum electronic substrate temperaturerequired for pre heat,dispense and post heat zoneSoak TimeTime spent to maintain electronic substratetemperature within range before transferringto next zone. Once soak time expiredand next zone free electronic substratewill be transferred to the next station(for pre heat/post heat).TimeoutTimeout occurs if the electronic substratetemperature does not fall within theprogrammed temperature range with theprogrammed time limit. Benchmark willalarm if Timeout happens.Polling RateHow often the IR sensor reads the electronicsubstrate temperature Referring toFIG.6, which shows GUI600, if IR sensing is disabled for the pre-heat and/or post-heat zones, then the heating chucks associated with these zones should be heated up with a timer. A pre-heat and/or post-heat duration timer is initiated to heat the chucks. Once the timer expires, cycle station air should be switched back and forth ON/OFF based on values entered. The actual readings for the IR sensors are displayed real-time on the GUI through a data display panel as well as being a traceable MES function desired behavior of electronic substrate handling in each zone as explained below. In the pre-heat and/or post-heat zones, the process includes receiving an electronic substrate and start heating. Once at minimum temperature, a soak time is started. While soaking or waiting to move, heat is cycled ON/OFF when the temperature hits a minimum or maximum predesignated temperature. Once the soak time has expired and the next zone is free, the electronic substrate is moved, and if the electronic substrate does not get in range before timeout time expires, then an alarm is triggered. For recovery, the steps are retry, abort, or release to next zone. During an error state, if the operator does not perform any error recovery, the electronic substrate may heat up and reaches the maximum temperature value. To avoid this effect, the software is configured to post an alarm, pause the machine, cycle the station air and keep measuring the electronic substrate temperature until the operator performs error recovery. In the dispense zone, the process includes receiving the electronic substrate and measuring a temperature of the electronic substrate. If not within range, heating is started until within range before timeout expires. Measuring the temperature is continued until within range. If within range, processing is started right away. At an end of the dispense cycle, the electronic substrate is moved to a next station as soon as possible. During error state, if the operator does not perform any error recovery, the electronic substrate may heat up and reach a maximum temperature value. To avoid this effect, the software is configured to turn off station air, post an alarm, pause the machine, and keep measuring the electronic substrate temperature until the operator perform error recovery. The process program can have multiple IR sense commands, and IR sensing is batched with dispense pass. The ability to sense electronic substrate temperature multiple times within dispense pass. There will only be a minimum temperature (no maximum temperature). When an IR sense command is actuated, dispensing is suspended until a minimum temperature is reached. The alarm time applies to each IR sense command as with pre-heat and post-heat sensing. The infrared temperature sense command can be programmed at a desired electronic substrate location multiple times within the same process program on the electronic substrate. A chuck temperature, IR sensing state timer, electronic substrate temperature, IR sensing state (ramping, soaking, maintaining), station air ON/OFF are listed on a data display for easy process monitoring. Station air light on data display turns green when ON and turns red when OFF. The status is displayed only when process program is running. Referring toFIG.7, which shows GUI700, when IR sensing is enabled, the timer tells the duration of the IR sensing state (i.e. how long the temperature ramps up, soaking or maintaining). The timer resets when the state changes. Different states of IR sensing are shown in Table 2 TABLE 2RampingElectronic substrate arrived at the stationand the electronic substratetemperature is ramping up/down.SoakingPerform soaking for desired soak time.Cycle AirMaintaining electronic substrate temperature.Cycle the station air ON/OFF.CompletedIR sensing operation is completed.Electronic substrate is transferred to thenext station (for preheat/post heat)Next command is ready to be executed(for dispense zone)Electronic substrate is transferred to thenext station (for dispense zonewith ″maintain heat″) Referring toFIG.8, which shows GUI800, when “Maintain Temp” is selected by the operator, the IR sensor continue to read the temperature and maintain the temperature within minimum and maximum by cycling the air. It acts the same as pre/post heat stations do presently. Generally, when the electronic substrate comes into the pre heat zone, IR sensing state changes as follows: Ramping→Soaking→Completed→Maintaining. Referring toFIG.9, process900includes ensuring that the temperature is maintained until the next station is free to accept electronic substrate. As shown, a determination is made at902as to whether a downstream station is free to accept an electronic substrate. If yes, then the IR sense command is complete at904and the operation ends. If no, then the temperature is detected at906by a non-contact sensor, and a determination is made at906as to whether the temperature is within a predetermined range. If yes, the process goes back to whether a downstream station is free to accept an electronic substrate. If no, air is cycled ON/OFF at910until the process goes back to whether a downstream station is free to accept an electronic substrate. Referring toFIG.10, which shows GUI1000, the operator should place the IR sense command in the main process program if “maintain temperature” is required. If the IR sense command is located inside a call, this feature can be ignored. When using “pass,” the operator should assign the last pass to the IR sense command. Referring toFIG.11, which shows GUI1100, when idle, all heat is powered off. The operator can choose to power off all heat which includes chucks and needle heating based on programmed time in minutes. This functionality lies under a temperature tab in a machine configuration and works only in a dispense AUTOMATIC MODE. The operator can also check option to disable the power off heat function during production run. Referring toFIG.12, which shows GUI1200, at start-up, heat controllers are powered on. If the operator checks this option , then heat controllers which includes up to six chucks and two needle heaters will be powered on after startup. All heaters will start ramping up as left enabled by the operator during last machine shut down only after server startup. If somehow the server startup is not automatic, then heat controllers will not power on. In that case an operator must manually start the server to power on the heat controllers. This functionality lies under the temperature tab in the machine configuration and works in all dispense modes. In one embodiment, a distance that the non-contact sensor is spaced from the electronic substrate depends on the type of non-contact sensor selected. For example, for one type of sensor, the sensor can be spaced from the electronic substrate a distance of 1 millimeters (mm) to 100 mm. In one embodiment, a sensing spot size generated by the non-contact sensor corresponds to a spacing of the non-contact sensor from the electronic substrate. Thus, by increasing a distance of the spacing of the non-contact sensor from the electronic substrate, the sensing spot size is increased. Accordingly, a range for use within the print head assembly of embodiments of the present disclosure is a distance of 1 mm to 100 mm. In one embodiment, a distance of 25 mm is selected. The non-contact sensor is configured to detect a temperature of the electronic substrate to confirm whether the temperature is correct for the particular application, using criteria pre-determined by a user setup process in which the operator of the dispensing system inputs settings for the dispensing system before a dispense operation. The non-contact sensor is connected to the controller, and is configured to immediately notify the operator if the electronic substrate is not ready for deposition. Additionally, temperature data of the electronic substrate or multiple electronic substrates can be collected by the controller. The data collected can be fed back to the dispensing system for additional actions, or it can be sent to a data collection system, such as downstream machines or either internal or remote statistical processing. In certain embodiments, the non-contact sensor is an infrared sensor to detect the temperature of the electronic substrate. The infrared sensor is an electronic sensor that is configured to measure infrared light that radiates from an object positioned in a field of view of the sensor. Objects having a temperature above absolute zero emit heat in the form of radiation. In a certain embodiment, the infrared sensor is a T-GAGE™ M18T Series Infrared Temperature Sensor offered by Banner Engineering Corporation of Minneapolis, Minnesota. The T-GAGE™ sensor is a passive, non-contact, temperature-based, sensor that is used to detect an object's temperature within a sensing window and output a proportional voltage or current, depending on the configuration of the sensor. A non-contact sensor, such as non-contact sensor, positioned above the electronic substrate on the pre-heat chuck can be utilized to confirm that the electronic substrate is indeed at the proper temperature before proceeding with the dispensing operation, without the need to wait longer than necessary to ensure that components of the system are at an adequate temperature. By mounting the non-contact sensor over a particular location on the electronic substrate, the actual temperature of a critical location can be measured. Furthermore, by mounting the sensor to the dispensing unit (or other mechanism, such as a vision probe in a printer) that can move in the x-axis and y-axis directions over the electronic substrate, the temperature of any specific spot can be measure within the dispense station. The non-contact sensor also may be mounted on a mechanism that moves towards and away from the target of the temperature measurement or the target can move in the x-axis, y-axis and z-axis directions relative to the sensor. Such a configuration permits the effective spot size of the sensor to be adjusted or tailored to the needs of the application. For example, the non-contact sensor may be mounted on a vertical stage, and oriented to look down at an electronic substrate. By moving the vertical stage and sensor lower and thus closer to the electronic substrate, the temperature of a smaller localized spot may be measured. By moving the vertical stage and sensor up and thus further from the electronic substrate, the temperature to be measured may effectively be averaged over a larger area. This can also be achieved by moving the target relative to the sensor to specific locations and to achieve specific spot sizes. Such arrangements permit the sensing of a temperature averaged over a controllable size region, wherein the size of the sensing area may be optimized for the application requirements. Thus, by mounting the sensor to a Z stage, which is in turn mounted to an X-Y positioning system, both the location and the size of the spot can be controlled. Additionally (or perhaps alternatively), measurements may be shared or stored for data collection purposes, such as statistical process control (SPC), wherein the quality or yield of a process may be correlated with measured variables in a process, for the purposes of process optimization. In another embodiment of the present disclosure, an infrared non-contact temperature sensor is used to provide temperature feedback of the electronic substrate temperature as part of a temperature regulation system. In particular, when an electronic substrate has reached a desired target temperature, commonly referred to as a set-point temperature, the temperature control system turns off the heat to the electronic substrate. Subsequently, when the temperature drops below a low temperature limit, the temperature control system turns the heat on. In some embodiments, the operation of turning the heat on or off may entail enabling or disabling power to the heaters. In other embodiments, this operation may entail enabling or disabling a heat transfer mechanism. For example, in one embodiment of the present invention, air is circulated past a heated surface and then to the substrate. When the airflow is enabled, the transfer of heat from the heater to the substrate is enhanced. When the airflow is disabled, the transfer of heat from the heater to the substrate is inhibited. This simple limit-cycle approach may provide sufficient temperature control accuracy for many applications. In other embodiments of the present disclosure, an infrared non-contact temperature sensor is used to provide temperature feedback of the electronic substrate temperature as part of a closed-loop temperature control system. In such a system, the controller uses the measured temperature and the desired set-point temperature as inputs to a control algorithm. The algorithm may also have proportional control of the heater, which provides the ability to not just enable or disable heat, but rather to enable the heater at a number of smaller steps between full on or full off. In one embodiment of the present disclosure, a digital proportional/integral/derivative controller, commonly referred to as a PID controller, uses the output of a PID algorithm, through Pulse-Width Modulation (PWM) means to vary the on/off duty cycle of a heater. This combination of a PID controller and digital proportional control of the heater can achieve temperature regulation that may be more precise and more closely regulated that that achieved with a limit cycle regulator. Having thus described several aspects of at least one embodiment of this disclosure, it is to be appreciated various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure, and are intended to be within the spirit and scope of the disclosure. Accordingly, the foregoing description and drawings are by way of example only. | 36,192 |
11858071 | DETAILED DESCRIPTION The present invention is described in more detail below. In the present specification, “%” used for indicating a solder alloy composition is “mass %” unless otherwise specified. 1. Solder Alloy (1) Ag: 2.5 to 3.7% Ag can avoid an increase in melting temperature if its content is close to a SnAgCu eutectic composition. It also enables precipitation strengthening of a solder alloy because Ag3Sn is precipitated in granular form. If the Ag content is less than 2.5%, the melting temperature of the solder alloy increases due to hypoeutectic SnAgCu. In addition, strength is not improved since the amount of the compounds precipitated is small. In terms of the lower limit, the Ag content is 2.5% or more, preferably 2.8% or more, and more preferably 2.9% or more. On the other hand, if the Ag content exceeds 3.7%, the melting temperature of the solder alloy increases due to hypereutectic SnAgCu. In addition, coarse Ag3Sn precipitates in a plate-like form, resulting in deteriorated strength. In terms of the upper limit, the Ag content is 3.7% or less, preferably 3.2% or less, and more preferably 3.1% or less. (2) Cu: 0.25 to 0.95% The closer both Cu and Ag contents are to the SnAgCu eutectic composition, the lower the melting temperature of the solder alloy. If the Cu content is less than 0.25%, the melting temperature of the solder alloy increases due to hypoeutectic SnAgCu. In terms of the lower limit, the Cu content is 0.25% or more, preferably 0.45% or more, and more preferably 0.55% or more. On the other hand, if the Cu content exceeds 0.95%, tensile strength and shear strength are reduced due to a large amount of Sn and Cu compounds precipitated. As the Cu content further increases, the melting temperature of the solder alloy increases due to hypereutectic SnAgCu in addition to the deterioration of strength. In terms of the upper limit, the Cu content is 0.95% or less, preferably 0.80% or less, and more preferably 0.70% or less. (3) Bi: 3.0 to 3.9% Bi can avoid the increase in melting temperature and also improves the strength of the solder alloy by solid solution strengthening of Sn. If the Bi content is less than 3.0%, the strength is not sufficiently improved since the solid solution amount of Bi is small. In addition, the melting temperature of the solder alloy is not lowered. In terms of the lower limit, the Bi content is 3.0% or more, preferably 3.1% or more, and more preferably 3.2% or more. On the other hand, if the Bi content exceeds 3.9%, the solidus temperature lowers due to eutectic SnBi precipitated. Furthermore, Bi may segregate to grain boundaries, resulting in deterioration of strength of the solder alloy. In terms of the upper limit, the Bi content is 3.9% or less, preferably 3.8% or less, more preferably 3.7% or less, and further preferably 3.4% or less. (4) In: 0.5 to 2.3% In can avoid the increase in melting temperature and also improves the strength of the solder alloy by solid solution strengthening of Sn. If the In content is less than 0.5%, the strength is not sufficiently improved since the solid solution amount of In is small. In addition, the melting temperature of the solder alloy is not lowered. In terms of the lower limit, the In content is 0.5% or more, preferably 0.7% or more, more preferably 0.9% or more, and even more preferably 1.0% or more. On the other hand, if the In content exceeds 2.3%, molten solder is easily oxidized, and thus generation of voids cannot be suppressed. In addition, an oxide film thereof becomes thicker, resulting in poor mountability. Furthermore, the melting temperature becomes too low. In terms of the upper limit, the In content is 2.3% or less, preferably 1.5% or less, and more preferably 1.3% or less. (5) Relations (1) and (2) 8.1≤Ag+2Cu+Bi+In ≤11.5 Relation (1) 1.00≤(Bi+In)/Ag≤1.66 Relation (2) Ag, Cu, Bi, and In in the relations (1) and (2) each represent the contents (mass %) thereof in the alloy composition. The solder alloy according to the present invention contains appropriate amounts of additive elements by satisfying the relation (1), and thus the melting temperature is in a proper range. These additive elements constituting the solder alloy according to the present invention affect tensile strength and shear strength since all of them contribute to Sn. In contributes to the solid solution strengthening of Sn, although addition of large amounts of In may cause voids and an increase in the thickness of an oxide film. For this reason, the relation (1) needs to be satisfied indirectly to suppress the generation of voids and reduce the thickness of the oxide film. Therefore, the relation (1) is a relational expression that must be satisfied in order to exhibit the effect of the present invention. Note that the coefficient of Cu in the relation (1) is doubled. In the solder alloy according to the present invention, this tends to significantly affect various properties of the solder alloy if the Cu content changes even slightly. For example, focusing on the melting temperature, when the amount of increase or decrease in the Cu content is the same as the amount of increase or decrease in the content of any other element, Cu is estimated to change the melting temperature at least twice larger than the other element. The solder alloy according to the present invention can also exhibit higher strength by satisfying the relation (2). Ag is a precipitation strengthening element, while Bi and In are solution strengthening elements. If the content of a solution strengthening element is too large, the element may exist in excess because the element content exceeds the solid solution limit, and may cause segregation of Bi or deformation of the solder alloy. On the other hand, if the content of the precipitation strengthening element is too large, the strength rather decreases due to a large amount of the compound precipitated. The solder alloy according to the present invention can therefore strengthen Sn in a well-balanced manner by satisfying relation (2), although each element has an optimum content range as described above. These relations are obtained by the interdependence of the constituent elements. This is because an alloy is an integrated object formed by combination of all constituent elements, and the constituent elements influence each other. Thus, the solder alloy according to the present invention, which is adjusted to the optimum content of each constituent element and further satisfies the relations (1) and (2), is set to a range where the interdependence of the constituent elements is fully considered. Accordingly, in the second soldering of step soldering, the solder alloy according to the present invention can simultaneously satisfy optimum melting temperature, high tensile and shear strength, suppression of void generation, and thin oxide films. In terms of the lower limit, the relation (1) is 8.1 or more, preferably 8.2 or more, more preferably 8.3 or more, further preferably 8.4 or more, particularly preferably 8.5 or more, and most preferably 8.6 or more. In terms of the upper limit, the relation (1) is preferably 11.5 or less, more preferably 9.3 or less, further preferably 9.1 or less, even further preferably 8.9 or less, particularly preferably 8.8 or less, and most preferably 8.7 or less. In terms of the lower limit, the relation (2) is 1.00 or more, preferably 1.14 or more, more preferably 1.23 or more, even further preferably 1.28 or more, particularly preferably 1.30 or more, and most preferably 1.31 or more, and may be 1.33 or more and 1.35 or more. In terms of the upper limit, the relation (2) is 1.66 or less, preferably 1.64 or less, more preferably 1.63 or less, further preferably 1.62 or less, even further preferably 1.57 or less, particularly preferably 1.50 or less, and most preferably 1.45 or less, and may be 1.42 or less and 1.40 or less. (6) Balance: Sn The balance of the solder alloy according to the present invention is Sn. The solder alloy may contain unavoidable impurities besides the elements described above. Even when the solder alloy contains unavoidable impurities, this inclusion does not affect the effects described above. The solder alloy according to the present invention preferably does not contain Co and Ni because they increase the melting temperature. (7) Relation (3) 4.48≤Ag×Cu×Bi×In ≤7.7 Relation (3) Ag, Cu, Bi, and In in the relation (3) each represent the contents (mass %) thereof in the alloy composition. The relation (3) is a relational consideration for the balance among additive elements, and the embodiment satisfying the relation (3) is preferable. The relation (3) is highly interdependent on each element because it is multiplied by the content of each element, and the overall balance of the solder alloy is maintained at a high level when the relation (3) is satisfied. Accordingly, it is preferred in terms of the further optimum of melting temperature, further improvement tensile and shear strength, further suppression of void generation, and further thinning of oxide films. In terms of the lower limit, the relation (3) is preferably 4.48 or more, more preferably 4.70 or more, further preferably 4.75 or more, particularly preferably 4.82 or more, most preferably 5.28 or more, and may be 5.76 or more, 6.27 or more, 6.50 or more, and 6.51 or more. In terms of the upper limit, the relation (3) is preferably 7.7 or less, more preferably 7.17 or less, further preferably 7.14 or less, even further preferably 6.94 or less, and most preferably 6.72 or less. (8) Melting Temperature of Solder Alloy The solder alloy according to the present invention are preferably used for the second soldering when soldering is performed twice, for example, by step soldering. In such a use, the melting temperature of the solder alloy used for the second time is preferably lower than the solidus temperature of the solder alloy used for the first time. For example, in the case of using a Sn-10Sb solder alloy that melts at a melting temperature of 245° C. in the first soldering, a sufficient temperature margin is considered for the use of components with large heat capacity. The melting temperature of the solder alloy according to the present invention is preferably 211 to 220° C. and particularly preferably 211 to 214° C. The solidus temperature of the solder alloy according to the present invention should be in a temperature range where a temperature difference between the melting temperature and the solidus temperature is not too large, and the mountability of the component does not deteriorate, due to leaching, misalignment, reoxidation, generation of voids or the like. The solidus temperature of the solder alloy according to the present invention is preferably 198° C. or more, more preferably 200° C. or more, further preferably 203° C. or more, and particularly preferably 204° C. or more. The upper limit of the solidus temperature of the solder alloy according to the present invention is not particularly limited, but may be 211° C. or less. 2. Solder Paste The solder paste according to the present invention is a mixture of a solder powder containing the solder alloy having the alloy composition described above and a flux. The flux used in the present invention is not particularly limited as long as it is suitable for soldering by a conventional method. Accordingly, a commonly used rosin, an organic acid, an activator, and a solvent may be blended as appropriate for use. In the present invention, a blending ratio of a metal powder component to a flux component is not particularly limited, but preferably the metal powder component is 80 to 90 mass % while the flux component is 10 to 20 mass %. 3. Solder Ball The solder alloy according to the present invention can be used as a solder ball. The solder ball according to the present invention is used for forming bumps on electrodes and substrates of semiconductor packages such as BGA (ball grid array). The diameter of the solder ball according to the present invention is preferably in the range of 1 to 1000 μm. The solder ball can be manufactured by a general solder ball manufacturing method. 4. Solder Preform The shape of the solder preform according to the present invention is not limited and it can be used in the form of a plate, a ring, a cylinder, a ribbon, a square, a disc, a washer, a chip, a wire, or the like. The solder preform may internally contain high-melting metal grains (e.g., Ni or Cu grains and alloy powder mainly composed of Ni or Cu) whose melting point is higher than that of the solder alloy and which are easily wetted by the molten solder. 5. Solder Joint The solder joint according to the present invention is suitably used for joining at least two or more members to be joined. The members to be joined are, for example, a circuit element, a substrate, an electronic component, a printed circuit board, an insulating substrate, a heat sink, a lead frame, a semiconductor using electrode terminals, etc., as well as a power module and an inverter product, and are not particularly limited as long as they are electrically connected using the solder alloy according to the present invention. 6. Other The solder alloy according to the present invention enables a low α-ray alloy to be produced by using a low α-ray material as a raw material therefor. When such a low α-ray-alloy is used for forming solder bumps in the periphery of a memory, soft errors can be suppressed. EXAMPLES The present invention will be described by the following Examples, but the present invention is not limited to the following Examples. In order to demonstrate the effects of the present invention, melting temperature, tensile strength, shear strength, void area ratio, and thickness of an oxide film were measured using the solder alloy listed in Table 1. (1) Melting Temperature For solder alloys having alloy compositions each listed in Table 1, each temperature was determined from a DSC curve. The DSC curve was obtained by DSC (model: EXSTAR 6000) manufactured by Hitachi High-Tech Science Corporation by increasing the temperature at 5° C./min in the atmosphere. The liquidus temperature was determined from the obtained DSC curve and used as the melting temperature. The solidus temperature was also evaluated from the DSC curve. When the melting temperature is 211 to 214° C., the temperature margin was sufficient for the second soldering in step soldering and thus was evaluated as “Excellent”. When the melting temperature is 215 to 220° C., it was evaluated as “Good” since there was no problem in practical use. When the temperature was less than 211° C. and exceeds 220° C., it was evaluated as “Poor”. When the solidus temperature was 204 to 211° C., it was evaluated as “Excellent”. When the solidus temperature was 198 to 203° C., it was evaluated as “Good”. When the temperature was less than 204° C. and exceeds 211° C., it was evaluated as “Poor”. (2) Tensile Strength The tensile strength was measured in accordance with JIS Z 3198-2. Each of the solder alloys listed in Table 1 was cast into a mold to produce a specimen with a gauge length of 30 mm and a diameter of 8 mm. The produced specimen was pulled by Type 5966 manufactured by Instron Corporation at room temperature at a stroke of 6 mm/min to measure the strength upon fracture of the specimen. In the present invention, when the tensile strength was 67 MPa or more, it was evaluated as “Excellent” because of its sufficient strength. When the tensile strength was less than 67 MPa and 63 MPa or more, it was evaluated as “Good” since there was no problem in practical use. When the tensile strength was less than 63 MPa, it was evaluated as “Poor”. (3) Shear Strength Solder alloy powders having the solder alloy compositions listed in Table 1 with an average particle size of 20 μm were produced, and the produced solder alloy powders were mixed with a known rosin flux in a ratio of 89 mass % to 11 mass % to produce a solder paste of each solder alloy. The solder paste was printed on a Cu-electrode in a printed circuit board (material: FR-4) having a thickness of 0.8 mm with a metal mask having a thickness of 120 μm, and a chip resistor component was mounted with a mounter, and reflow soldering was performed at a maximum temperature of 235° C. and a holding time of 60 seconds to produce a test substrate. The shear strength (N) of this test substrate was measured by a shear strength measuring device (STR-1000 manufactured by RHESCA Corporation) under a condition of 6 mm/min. When the shear strength was 67 N or more, it was judged to be at a level of sufficient shear strength and evaluated as “Excellent”. When the shear strength was more than 63 N and 66 N or less, it was judged to be at a level capable of being used practically without any problem and evaluated as “Good”. When the shear strength was less than 62 N, it was evaluated as “Poor”. (4) Void Area Ratio As to the test substrate produced in “Shear Strength”, the X-ray plane image with 30-fold magnification was displayed on a monitor using a TOSMICRON-6090FP manufactured by Toshiba FA System Engineering Co., Ltd., and voids were detected from the displayed image to determine an area ratio thereof. The image analysis software used for the detection was Scandium, manufactured by Soft imaging system. Because the contrast between the voids and the other parts on the image is different, they can be identified using image analysis, and the measurement was performed by detecting only the voids. When the measured void area ratio was 3.2% or less of the silicon chip area, the void was evaluated as “Excellent”; when the void area ratio was more than 3.2% and 4.1% or less, the void was evaluated as “Good”: and when the void area ratio was more than 4.1%, the void was evaluated as “Poor”. (5) Thickness of Oxide Film The solder alloys listed in Table 1 were processed into ribbon-shaped preforms having a thickness of 0.1 mm, cut into 10 mm square preforms, and subjected to heat treatment in a thermostatic bath at 150° C. for 120 minutes. The oxide film thickness of the obtained preforms was measured by FE-AES (Field Emission Auger Electron Spectroscopy) to measure the thickness of the oxide film. The film thickness of the oxide film was measured with the following device under the following conditions. Note that a measured value of the thickness of the oxide film was obtained in terms of SiO2. When the thickness of the oxide film was 1.8 nm or less, it was evaluated as “Excellent” since formation of the oxide film was sufficiently suppressed. When the thickness of the oxide film was more than 1.8 nm and 2.8 nm or less, it was evaluated as “Good” since the film could be mounted without any problem. When the thickness of the oxide film was more than 2.8 nm, it was evaluated as “Poor”. Measuring device: scanning FE-Auger Electron Spectroscopic Analyzer manufactured by ULVAC-PHI, INC. Measuring conditions: 10 kV of Beam Voltage; 10 nA of Sample Current (The measuring method of sputtered depth by using an Ar ion gun is based on ISO/TR 15969) Evaluation results are shown in Tables 1 and 2. TABLE 1Solder Composition (mass %)MeltingRelationRelationRelationtemperatureSnAgCuBiInOther(1)(2)(3)(° C.)Ex. 1Bal.2.50.803.20.90—8.201.645.76ExcellentEx. 2Bal.2.80.703.21.00—8.401.506.27ExcellentEx. 3Bal.2.90.703.21.00—8.501.456.50ExcellentEx. 4Bal.3.00.703.21.00—8.601.406.72ExcellentEx. 5Bal.3.10.703.21.00—8.701.356.94ExcellentEx. 6Bal.3.20.703.21.00—8.801.317.17ExcellentEx. 7Bal.3.70.703.21.00—9.301.148.29GoodEx. 8Bal.3.00.253.21.50—8.201.573.60GoodEx. 9Bal.3.00.453.21.10—8.201.434.75ExcellentEx. 10Bal.3.00.553.21.00—8.301.405.28ExcellentEx. 11Bal.3.00.953.21.00—9.101.409.12GoodEx. 12Bal.3.00.703.01.00—8.401.336.30ExcellentEx. 13Bal.3.00.703.11.00—8.501.376.51ExcellentEx. 14Bal.3.00.703.41.00—8.801.477.14ExcellentEx. 15Bal.3.00.703.91.00—9.301.638.19ExcellentEx. 16Bal.3.00.753.20.50—8.201.233.60GoodEx. 17Bal.3.00.703.20.70—8.301.304.70ExcellentEx. 18Bal.3.00.703.21.30—8.901.508.74GoodEx. 19Bal.3.20.703.02.30—9.901.6615.46ExcellentEx. 20Bal.3.70.903.82.20—11.501.6227.84GoodEx. 21Bal.3.00.453.21.00—8.101.404.32GoodEx. 22Bal.3.70.653.10.60—8.701.004.47ExcellentSolidusTensileShearThickness oftemperaturestrengthstrengthoxide filmTotal(° C.)(MPa)(Mpa)Void(nm)evaluationEx. 1ExcellentExcellentExcellentExcellentExcellentExcellentEx. 2ExcellentExcellentExcellentExcellentExcellentExcellentEx. 3ExcellentExcellentExcellentExcellentExcellentExcellentEx. 4ExcellentExcellentExcellentExcellentExcellentExcellentEx. 5ExcellentExcellentExcellentExcellentExcellentExcellentEx. 6ExcellentExcellentExcellentExcellentExcellentExcellentEx. 7GoodExcellentExcellentGoodGoodGoodEx. 8ExcellentExcellentExcellentGoodGoodGoodEx. 9ExcellentExcellentExcellentExcellentExcellentExcellentEx. 10ExcellentExcellentExcellentExcellentExcellentExcellentEx. 11ExcellentExcellentExcellentGoodGoodGoodEx. 12ExcellentExcellentExcellentExcellentExcellentExcellentEx. 13ExcellentExcellentExcellentExcellentExcellentExcellentEx. 14ExcellentExcellentExcellentExcellentExcellentExcellentEx. 15GoodExcellentExcellentGoodGoodGoodEx. 16ExcellentGoodGoodExcellentExcellentGoodEx. 17ExcellentExcellentExcellentExcellentExcellentExcellentEx. 18GoodExcellentExcellentGoodGoodGoodEx. 19GoodExcellentExcellentGoodGoodGoodEx. 20GoodExcellentExcellentGoodGoodGoodEx. 21ExcellentExcellentExcellentExcellentExcellentGoodEx. 22ExcellentGoodGoodExcellentExcellentGoodEx = Example TABLE 2Solder Composition (mass %)MeltingRelationRelationRelationtemperatureSnAgCuBiInOther(1)(2)(3)(° C.)Comp.Bal.2.40.953.10.70—8.101.584.95PoorEx. 1Comp.Bal.3.90.703.21.10—9.601.109.61PoorEx. 2Comp.Bal.3.00.203.21.50—8.101.572.88PoorEx. 3Comp.Bal.3.01.03.01.0—9.001.339.00GoodEx. 4Comp.Bal.3.01.03.00.8—8.801.277.20GoodEx. 5Comp.Bal.3.02.03.21.011.201.4019.20PoorEx. 6Comp.Bal.3.50.800.56.00—11.601.868.40PoorEx. 7Comp.Bal.3.00.702.52.00—8.901.5010.50PoorEx. 8Comp.Bal.3.10.504.11.00—9.201.656.36PoorEx. 9Comp.Bal.3.00.503.00.25—7.251.081.13PoorEx. 10Comp.Bal.3.00.803.20.30—8.101.172.30PoorEx. 11Comp.Bal.3.00.703.03.00—10.402.0018.90PoorEx. 12Comp.Bal.3.00.503.01.00—8.001.334.50PoorEx. 13Comp.Bal.3.70.953.92.20—11.701.6530.16PoorEx. 14Comp.Bal.3.70.703.00.50—8.600.953.89GoodEx. 15Comp.Bal.2.50.703.22.00—9.102.0811.20GoodEx. 16Comp.Bal.3.00.703.01.00Ni: 0.18.401.336.30PoorEx. 17Comp.Bal.3.00.703.01.00Co: 0.18.401.336.30PoorEx. 18SolidusTensileShearThickness oftemperaturestrengthstrengthoxide filmTotal(° C.)(MPa)(Mpa)Void(nm)evaluationComp.PoorPoorPoorExcellentExcellentPoorEx. 1Comp.PoorPoorPoorGoodGoodPoorEx. 2Comp.PoorGoodGoodGoodGoodPoorEx. 3Comp.GoodPoorPoorGoodGoodPoorEx. 4Comp.GoodPoorPoorExcellentExcellentPoorEx. 5Comp.PoorPoorPoorGoodGoodPoorEx. 6Comp.PoorPoorPoorPoorPoorPoorEx. 7Comp.PoorPoorPoorGoodGoodPoorEx. 8Comp.PoorPoorPoorGoodGoodPoorEx. 9Comp.PoorPoorPoorGoodGoodPoorEx. 10Comp.PoorPoorPoorGoodGoodPoorEx. 11Comp.PoorPoorPoorPoorPoorPoorEx. 12Comp.PoorGoodGoodGoodGoodPoorEx. 13Comp.PoorPoorPoorPoorPoorPoorEx. 14Comp.GoodPoorPoorExcellentExcellentPoorEx. 15Comp.GoodPoorPoorGoodPoorPoorEx. 16Comp.ExcellentGoodGoodPoorGoodPoorEx. 17Comp.ExcellentGoodGoodPoorGoodPoorEx. 18Comp. Ex. = Comparative ExampleThe underline indicates that it does not fall within the scope of the present invention. As is clear from Table 1, Examples 1 to 22 each have Ag, Cu, Bi, and In contents within the scope of the present invention and also satisfy the relations (1) and (2). For this reason, it was clear that the melting temperature was low enough to allow soldering by step soldering, the tensile strength and shear strength were high, the void area ratio was low, and the thickness of the oxide film was thin. Particularly, it was clear that Examples 1 to 6, 9, 10, 12 to 14, and 17, which satisfy the relation (3), had even higher tensile strength and shear strength, suppressed the void generation, and had thinner oxide films. On the other hand, Comparative Examples 1 and 2 were inferior in strength due to inappropriate Ag contents, which caused the melting temperatures to fall outside the desired ranges. In Comparative Example 3, the Cu content was low, resulting in an increase in melting temperature. In Comparative Examples 4 and 5, the Cu contents were high, resulting in inferior strength. In Comparative Example 6, the Cu content was too high, resulting in inferior strength and high melting temperature. Comparative Example 7 were inferior in all results due to low Bi content, high In content, and furthermore, not satisfying the relations (1) and (2). In Comparative Example 8, the Bi content was low, resulting in inferior strength and high melting temperature. In Comparative Example 9, the Bi content was high, resulting in inferior strength and low melting temperature. Comparative Example 10 had a low In content and did not satisfy the relation (1), resulting in an increase in melting temperature and inferior strength. In Comparative Example 11, the In content was low, resulting in a further increase in melting temperature and inferior strength. Comparative Example 12 was inferior in all results due to high In content and not satisfying the relation (2). Comparative Examples 13 and 14 did not satisfy the relation (1), resulting in inappropriate melting temperatures. Particularly, Comparative Example 14 exceeded the upper limit of the relation (1), resulting in an inappropriate melting temperature, as well as the other results were all inferior. Comparative Examples 15 and 16 did not satisfy the relation (2), resulting in inferior strength. Particularly, Comparative Example 16 exceeded the upper limit of the relation (2), resulting in thicker oxide film in addition to inferior strength. Comparative Examples 17 and 18 contained Ni or Co, resulting in high melting temperatures and increased void area ratios. | 25,949 |
11858072 | DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail. The term “substantially” used herein means to include a range in consideration of manufacturing tolerances, assembly variations, and the like, unless otherwise explicitly described. The expression “a to b” used herein for the description of the numerical range means a or more and b or less unless otherwise specified. For example, “1% to 5% by mass” means “1% by mass or more and 5% by mass or less”. In the present specification, a content of c with respect to a total mass of d means the content of c in 100% by mass of d. <Flux> A flux according to the present embodiment contains a rosin methyl ester in which the flux is a solid or solid-like flux at 25° C., and is used for an inside of a flux-cored solder or an exterior of a flux-coated solder. Accordingly, it is possible to suppress crackability of a flux residue while maintaining a function of the flux in the related art. In particular, it is possible to effectively suppress cracking of the flux residue due to physical impact during transportation or the like. [Component] Hereinafter, each component contained in the flux will be described. The flux of the present embodiment contains a rosin methyl ester (a). The rosin methyl ester (a) means a methyl ester product obtained by esterifying resin acid forming rosin with a methyl alcohol. Although the rosin methyl ester (a) is a liquid at 25° C., it has high compatibility with the rosin and is difficult to volatilize, and therefore, the rosin methyl ester (a) remains in the flux residue of the flux containing the rosin methyl ester (a). As a result, an effect of suppressing occurrence of cracks in the flux residue can be obtained. Since the rosin methyl ester (a) is a rosin modified product, it is also excellent in that it does not adversely affect properties necessary for the flux such as wettability. Examples of the resin acid forming rosin obtained by a rosin methyl esterification can include dihydroabietic acid, tetrahydroabietic acid, and dehydroabietic acid, in addition to abietic acid. In addition, examples of the rosin as a raw material can include a raw material rosin such as a gum rosin, a wood rosin, and a tall oil rosin, and a derivative obtained from the raw material rosin. Examples of the derivative can include a purified rosin, a hydrogenated rosin, a disproportionated rosin, a polymerized rosin, and an α, β unsaturated carboxylic acid-modified product (an acrylated rosin, a maleated rosin, a fumarated rosin, or the like), as well as a purified product of the polymerized rosin, a hydride, and a disproportionated product, and a purified product of the α, β unsaturated carboxylic acid-modified product, a hydride, and a disproportionated product. The derivative can be used alone or in combination of two or more. Among them, the hydrogenated rosin is preferably used. Examples of commercially available a hydrogenated rosin methyl ester can include “Foralyn 5020-F” (produced by Eastman Chemical Company) and “M-HDR” (produced by MARUZEN CHEMICAL TRADING CO., LTD). A content of the rosin methyl ester (a) is preferably 0.5% to 20% by mass, and more preferably 3.0% to 18% by mass with respect to the total mass of the flux of the present embodiment. When the content of the rosin methyl ester (a) is equal to or less than the upper limit described above, it is easy to suppress occurrence of cracks in the flux residue while maintaining the wettability. On the other hand, when the content of the rosin methyl ester (a) is equal to or more than the lower limit described above, it is easy to process for applications to the inside of the flux-cored solder or the exterior of the flux-coated solder. According to the findings of the present inventors, when only a rosin (b) esterified with alcohols other than methyl alcohol is used, the cracks cannot be efficiently suppressed from occurring in the flux residue because the flux is not a liquid due to the excessively large molecular weight of the esterified rosin. However, the flux of the present embodiment may contain the rosin (b) esterified with alcohols other than methyl alcohol. In this case, a content of the rosin (b) esterified with alcohols other than methyl alcohol is, for example, preferably 0.1% to 30% by mass, and more preferably 1% to 20% by mass with respect to the total mass of the flux of the present embodiment. The flux of the present embodiment may further contain an unesterified rosin (c), that is, nonesterified rosin. As a result, the solid or solid-like flux can be easily obtained and the processability of the flux-cored solder and flux-coated solder can be improved, and furthermore, the effect of suppressing occurrence of cracks in the flux residue can be obtained while maintaining the wettability of the rosin methyl ester (a). The content (mass) of the rosin methyl ester (a) with respect to a content (mass) of the unesterified rosin (c) is, for example, preferably 0.01 or more, and more preferably 0.02 or more from the viewpoint of obtaining stable crackability of the residue. On the other hand, the upper limit of the content of the rosin methyl ester (a) with respect to the content of the unesterified rosin (c) is not particularly limited, but is preferably 0.5 or less, for example. The unesterified rosin (c) means a rosin obtained by not esterifying resin acid forming rosin, and examples of the rosin can include rosin used for the above-described rosin methyl ester (a). The content of the unesterified rosin (c) is preferably 40% to 98.9% by mass, and more preferably 50% to 97.0% by mass with respect to the total mass of the flux of the present embodiment. When the content of the unesterified rosin (c) is equal to or less than the upper limit described above, it is easy to process for applications to the inside of the flux-cored solder or the exterior of the flux-coated solder. On the other hand, when the content of the unesterified rosin (c) is equal to or more than the lower limit described above, it is easy to suppress occurrence of cracks in the flux residue. The flux of the present embodiment may further contain a resin other than the rosin resin. Examples of the resin other than the rosin resin can include one or two or more kinds selected from a terpene resin, a modified terpene resin, a terpene phenol resin, a modified terpene phenol resin, a styrene resin, a modified styrene resin, a xylene resin, and modified xylene resin. As the modified terpene resin, an aromatic-modified terpene resin, a hydrogenated terpene resin, a hydrogenated aromatic-modified terpene resin, and the like can be used. As the modified terpene phenol resin, a hydrogenated terpene phenol resin, and the like can be used. As the modified styrene resin, a styrene acrylic resin, a styrene-maleic acid resin, and the like can be used. As the modified xylene resin, a phenol-modified xylene resin, an alkylphenol-modified xylene resin, a phenol-modified resol-type xylene resin, a polyol-modified xylene resin, a polyoxyethylene-added xylene resin, and the like can be used. The flux of the present embodiment may further contain an activator in addition to the resin in order to improve solderability. As the activator, an organic acid activator, an amine activator, an amine hydrohalogonic acid salt activator, an organic halogen compound activator, and the like can be used. As the organic acid activator, adipic acid, azelaic acid, eicosandioic acid, citric acid, glycolic acid, succinic acid, salicylic acid, diglycolic acid, dipicolinic acid, dibutylaniline diglycolic acid, suberic acid, sebacic acid, thioglycol acid, terephthalic acid, dodecanedioic acid, parahydroxyphenylacetic acid, picolinic acid, phenylsuccinic acid, phthalic acid, fumaric acid, maleic acid, malonic acid, lauric acid, benzoic acid, tartaric acid, tris(2-carboxyethyl) isocyanurate, glycine, 1,3-cyclohexanedicarboxylic acid, 2,2-bis(hydroxymethyl)propionic acid, 2,2-bis (hydrozymethyl) butanoic acid, 2,3-dihydroxybenzoic acid, 2,4-diethylglutaric acid, 2-quinolinecarboxylic acid, 3-hydroxybenzoic acid, malic acid, p-anisic acid, stearic acid, 12-hydroxystearic acid, oleic acid, linoleic acid, linolenic acid, dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, and the like can be used. As the amine activator, an aliphatic amine, an aromatic amine, an amino alcohol, an imidazole, a benzotriazole, an amino acid, a guanidine, a hydrazide, and the like can be used. Examples of the aliphatic amine can include dimethylamine, ethyiamine, l-aminopropane, isopropylamine, trimethylamine, allylamine, n-butylamine, diethylamine, sec-butylamine, tert-butylamine, N,N-dimethylethylamine, isobutylamine, and cyclohexylamine. Examples of the aromatic amine can include aniline, N-methylaniline, diphenylamine, N-isopropylaniline, and p-isopropylamine. Examples of the amino alcohol can include 2-aminoethanol, 2-(ethylamino)ethanol, diethanolamine, diisopropanolamine, triethanolamine, N-butyldiethanolamine, triisopropanolamine, N,N-bis(2-hydroxyethyl)-N-cyclohexylamine, N,N,N′, N′-tetrakis-(2-hydroxypropyl)ethylenediamine, and N,N,N′,N″,N″-pentakis (2-hydroxypropyl) diethylenetriamine. Examples of the imidazole can include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2′-methylimidazolyl-(1′)]-ethyl-s-triazine, 2,4-diamino-6-[2′-undecylimidazolyl-(1′)]-ethyl-s-triazine, 2,4-diamino-6-[2′-ethyl-4′-methylimidazolyl-(1′)]-ethyl-s-triazine, a 2,4-diamino-6-[2′-methylimidazolyl-(1′)]-ethyl-s-triazineisocyanuric acid adduct, a 2-phenylimidazoleisocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, 2,4-diamino-6-vinyl-s-triazine, a 2,4-diamino-6-vinyl-s-triazineisocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, an epoxyimidazole adduct, 2-methylbenzimidazole, 2-octylbenzimidazole, 2-pentylbenzoimidazole, 2-(1-ethylpentyl)benzimidazole, 2-nonylbenzimidazole, 2-(4-thiazolyl)benzimidazole, and benzimidazole. Examples of the benzotriazole can include 2-(2′-hydroxy-5′-methylphenyl)benzotriazole, 2-(2′-hydroxy-3′-tert-butyl-5′-methylphenyl)-5-chlorobenzotriazole, 2-(2′-hydroxy-3′,5′-di-tert-amylphenyl)benzotriazole, 2-(2′-hydroxy-5′-tert-octylphenyl)benzotriazole, 2,2′-methylenebis[6-(2H-benzotriazol-2-yl)-4-tert-octylphenol], 6-(2-benzotriazolyl)-4-tert-octyl-6′-tert-butyl-4′-methyl-2,2′-methylenebisphenol, 1,2,3-benzotriazole, 1-[N,N-bis (2-ethylhexyl)aminomethyl]benzotriazole, carboxybenzotriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]methylbenzotriazole, 2,2′-[[(methyl-1H-benzotriazole-1-yl)methyl]imino]bisethanol, a 1,2,3-benzotriazole sodium salt aqueous solution, 1-(1′,2′-dicarboxyethyl)benzotriazole, 1-(2,3-dicarboxypropyl)benzotriazole, 1-[(2-ethylhexylamino)methyl]benzotriazole, 2,6-bis[(1H-benzotriazole-1-yl)methyl]-4-methylphenol, and 5-methylbenzotriazole. Examples of the amino acid can include alanine, arginine. asparagine, aspartic acid, cysteine hydrochloride, glutamine, glutamic acid, glycine, histidine, isoleucine, leucine, lysine monohydrochloride, methionine, phenylalanine, proline, serine, threonine, tryptophan, tyrosine, valine, β-alanine, γ-aminobutyric acid, δ-aminovaieric acid, ε-aminohexanoic acid, ε-caprolactam, and 7-aminoheptanoic acid. Examples of the guanidine can include carbodihydrazide, malonic acid dihydrazide, succinate dihydrazide, adipic dihydrazide, 1,3-bis(hydrazinocarbonoethyl)-5-isopropylhydrandine, sebacic acid dihydrazide, dodecanedioic acid dihydrazide, 7,11-octadecadien-1,18-dicarbohydrazide, and isophthalic dihydrazide. Examples of the hydrazide can include dicyandiamide, 1,3-diphenylguanidine, and 1,3-di-o-tolylguanidine. As the amine hydrohalogenic acid salt activator, a hydrohalogenic acid salt (salt, of HF, HCl, KBr, or HI) of the amine compound described above as the amine activator can be used. Examples of the amine hydrohalogenic acid salt can include stearylamine hydrochloride, diethylaniline hydrochloride, diethanolaraine hydrochloride, 2-ethylhezylamine hydrobromide, pyridine hydrobromide, isopropylamine hydrobromide, cyciohexylamine hydrobromide, diethylamine hydrobromide, monoethylamine hydrobromide, 1,3-diphenylguanidine hydrobromide dimethylamine hydrobromide, dimethylamine hydrochloride, rosinamine hydrobromide, 2-ethylhexylamine hydrochloride, isopropylamine hydrochloride, cyclohexylamine hydrochloride, 2-pipecholine hydrobromide, 1,3-diphenylguanidine hydrochloride, dimethylbenzylamine hydrochloride, hydrazine hydrate hydrobromide, dimethylcyclohexylamine hydrochloride, trinonylamine hydrobromide, diethylaniline hydrobromide, 2-diethylaminoethanol hydrobromide, 2-diethylaminoethanol hydrochloride, ammonium chloride, diallylamine hydrochloride, diailylamine hydrobromide, monoethylamine hydrochloride, monoethylamine hydrobromide, diethylamine hydrochloride, trietnylamine hydrobromide, triethylamine hydrochloride, hydrazine monohydrochloride, hydrazine dihydrochloride, hydrazine monohydrobromide, hydrazine dihydrobromide, pyridine hydrochloride, aniline hydrobromide, butylamine hydrochloride, hexylamine hydrochloride, n-octylaraine hydrochloride, dodecylamine hydrochloride, dimethylcyclohexylamine hydrobromide, ethylenediamine dihydrobromide, rosinamine hydrobromide, 2-phenylimidazole hydrobromide, 4-benzylpyridine hydrobromate, L-glutamic acid hydrochloride, N-methylmorpholine hydrochloride, betaine hydrochloride, 2-pipecholine hydroiodide, cyclohexylamine hydroiodide, 1,3-diphenylguanidine hydrofluorate, diethylamine hydrofluorate, 2-ethylhexylamine hydrofluoride, cyclohexylamine hydrofluoride, ethylamine hydrofluoride, rosinamine hydrofluoride, cyclohexylamine tetrafluoroborate, and dicyclohexylamine tetrafluoroborate. As the organic halogen compound activator, trans-2,3-dibromo-2-butene-1,4-diol, 2,3-dibromo-1,4-butanediol, 2,3-dibromo-1-propanol, 2,3-dichlore-1-propanol, 1,1,2,2-tetrabromoethane, 2,2,2-tribromoethanol, pentabromoethane, carbon tetrabromide, 2,2-bis(bromomethyl)-1,3-propanediol, meso-2,3-Dibromo-succinic, chloroalkane, a chlorinated fatty acid ester, n-hexadecyltrimethylammonium bromide, triallyl isocyanurate hexabromide, 2,2-bis[3,5-dibromo-4-[2,3-dibromopropoxy)phenyl]propane, bis(3,5-dibromo-4-(2,3-dibromopropoxy)phenyl]sulfone, ethylenebispentabroraobenzene, 2-chloromethyloxirane, HET acid, HET anhydride, brominated bisphenol A epoxy resin, and the like can be used. A content of the activator is, for example, preferably 0.1% to 40% by mass, and more preferably 1% to 30% by mass with respect to the total mass of the flux of the present embodiment. When the content of the activator is equal to or less than the upper limit described above, it is possible to suppress corrosion of the flux residue after soldering, reduction in insulation resistance, and the like. On the other hand, when the content of the activator is equal to or more than the lower limit described above, wettability and antioxidant performance can be obtained. As for the content of each activator with respect to the total mass of the flux of the present embodiment, for example, the organic acid activator is preferably 0% to 30% by mass, the amine activator is preferably 0% to 10% by mass, and the total amount of the amine hydrohalogenic acid salt activator and the organic halogen compound activator is preferably 0% to 20% by mass, respectively. The flux of the present embodiment can further contain one or two or more kinds selected from a solvent, a phosphoric ester, a silicone, and a surfactant. As the solvent, various glycol ether solvents and the like, for example, phenyl glycol, hexylene glycol, hexyl diglycol, and the like can be used. A content of the solvent is, for example, preferably 0% to 13% by mass, and more preferably 0% to 10% by mass with respect to the total mass of the flux of the present embodiment. When the content of the solvent is equal to or less than the upper limit described above, good processability is obtained. As the phosphoric ester, methyl acid phosphate, ethyl acid phosphate, isopropyl acid phosphate, monobutyl acid phosphate, butyl acid phosphate, dibutyl acid phosphate, butoxyethyl acid phosphate, 2-ethylhexyl acid phosphate, bis(2-ethylhexyl)phosphate, monoisodecyl acid phosphate, isodecyl acid phosphate, lauryl acid phosphate, isotridecyl acid phosphate, stearyl acid phosphate, oleyl acid phosphate, beef tallow phosphate, coconut oil phosphate, isostearyl acid phosphate, alkyl acid phosphate, tetracosyl acid phosphate, ethyleneglycol acid phosphate, 2-hydroxyethyl methacrylate acid phosphate, dibutyl pyrophosphate acid phosphate, mono-2-ethylhexyl (2-Ethylhexyl)phosphonate, an alkyl (alkyl)phosphonate, and the like can be used. A content of the phosphoric ester is, for example, preferably 0% to 10% by mass, and more preferably 0% to 2% by mass with respect to the total mass of the flux of the present embodiment. When the content of the phosphoric ester is equal to or less the upper limit described above, good processability is exerted. As the silicone, a dimethyl silicone oil, a cyclic silicone oil, a methylphenyl silicone oil, a methyl hydrogen silicone oil, a higher fatty acid-modified silicone oil, an alkyl-modified silicone oil, an alkyl-aralkyl-modified silicone oil, an amino-modified silicone oil, an epoxy-modified silicone oil, a polyether-modified silicone oil, an alkyl polyether-modified silicone oil, a carbinol-modified silicone oil, and the like can be used. A content of the silicone is, for example, preferably 0% to 10% by mass, and more preferably 0% to 2% by mass with respect to the total mass of the flux of the present embodiment. When the content of the silicone is equal to or less than the upper limit described above, good processability is exerted. As the surfactant, a polyoxyalkylene alkylamine, a polyoxyethylene alkylamine, a polyoxypropylene alkylamine, a polyoxyethylene polyoxypropylene alkylamine, a polyoxyalkylene alkylamide, a polyoxyethylene alkylamide, a polyoxypropylene alkylamide, a polyoxyethylene polyoxypropylene alkylamide, a polyoxyalkylene alkyl ether, a polyoxyethylene alkyl ether, a polyoxypropylene alkyl ether, a polyoxyethylene polyoxypropylene alkyl ether, a polyoxyalkylene alkyl ester, a polyoxyethylene alkyl ester, a polyoxypropylene alkyl ester, a polyoxyethylene polyoxypropylene alkyl ester, a polyoxyalkylene glyceryl ether, polyoxyethylene glyceryl ether, polyoxypropylene glyceryl ether, polyoxyethylene polyoxypropylene glyceryl ether, a polyoxyalkylene diglyceryl ether, polyoxyethylene diglyceryl ether, polyoxypropylene diglyceryl ether, polyoxyethylene polyoxypropylene diglyceryl ether, a polyoxyalkylene polyglyceryl ether, polyoxyethylene polyglyceryl ether, polyoxypropylene polyglyceryl ether, polyoxyethylene polyoxypropylene polyglyceryl ether, a glycerin fatty acid ester, a diglycerin fatty acid ester, a polyglycerin fatty acid ester, a sorbitan fatty acid ester, a sucrose fatty acid ester, and the like can be used. A content of the surfactant is, for example, preferably 0% to 5% by mass with respect to the total mass of the flux of the present embodiment. When the content of the surfactant is equal to or less than the upper limit described above, an effect of improving detergency is exerted without impairing solderability. [Property] The flux of the present embodiment is a solid or solid-like flux at 25° C. That is, the solid or solid-like flux means that it has no fluidity when left on a horizontal plane at 25° C. under atmospheric pressure. In addition, the solid-like flux includes a flux in which a part thereof has fluidity by applying a physical stress from the outside at 25° C. Specifically, a viscosity of the solid-like flux measured with a rheometer as described later may be defined as a viscosity η1at 25° C. equal to or more than a lower limit as described later. On the other hand, for example, the flux naturally having fluidity or deformed due to its own weight without applying the stress from the outside does not correspond to the solid or solid-like flux at 25° C., the flux being left on the horizontal at 25° C. Specifically, when a sample, which is prepared into a columnar shape (diameter: φ5 mm, height: 5 mm, and weight: about 0.1 g) using the flux, naturally has fluidity or is deformed on the horizontal plane at 25° C. under atmospheric pressure without applying the physical stress from the outside, it may be determined that the flux does not correspond to the solid or solid-like flux. When the flux according to the present embodiment is a solid or solid-like flux at 25° C., good processability is obtained, and the flux is provided to be suitable for the application to the inside of the flux-cored solder or the exterior of the flux-coated solder. In order to make the flux of the present embodiment solid or solid-like at 25° C., the solid or solid-like flux can be obtained by a known method such as adding a solid resin in addition to the rosin methyl ester, controlling the amount of solvent, or using the additive, can be used. The flux of the present embodiment has a softening point of, for example, preferably 28° C. to 100° C., and more preferably 30° C. to 90° C. When a melting point of the flux is equal to or more than the lower limit described above, good processability is obtained, and the flux suitable for the application to the inside of the flux-cored solder or the exterior of the flux-coated solder is obtained. On the other hand, the upper limit of the melting point of the flux is not particularly limited, but for example, the flux can be easily prepared by setting the melting point of the flux to be equal to or lower than the above upper limit. The melting point of the flux can be measured based on the measurement of the softening point of JIS K 5902-1969. The flux of the present embodiment has a viscosity η1at 25° C. of, for example, preferably 3,200 Pa·s or higher, and more preferably 3,500 Pa·s or higher, the viscosity η1at 25° C. being measured 5 minutes after the start of rotation at 6 Hz using a rheometer. When the viscosity η1is equal to or more than the lower limit described above, good processability is obtained. In addition, since the higher the viscosity %, the more solid-like the flux, the upper limit thereof is not particularly limited. As the rheometer, for example, Thermo Scientific HAAKE MARS III (registered trademark) can be used. A rheometer having parallel flat plates without grooves on surfaces thereof is used. A flux sample is sandwiched between the parallel flat plates and deformed to narrow a space between the parallel flat plates while heating about 100° C., thereby forming a thin sample of about 0.5 mm. As for the thin sample after stopping the heating and cooling it to 25° C., the viscosity η1at 25° C., which is measured 5 minutes after the start of rotation at 6 Hz, is measured using the rheometer. [Application] The flux of the present embodiment is provided for the application to the inside of the flux-cored solder or the exterior of the flux-coated solder. That is, the flux of the present embodiment is used to coat an outer surface of a solder alloy filled into a solder alloy or molded into a predetermined shape. The solder in which the flux is filled into the solder alloy is also called a “cored solder”. Therefore, as the flux of the present embodiment, the solid or solid-like flux at 25° C. is required in terms of processability. If the flux is in a liquid state, it is difficult to process the flux-cored solder or the flux-coated solder (process the flux-cored solder or the flux-coated solder to an arbitrary size and shape). [Preparation and Processing Method of Flux] The flux of the present embodiment is prepared by heating and mixing a rosin methyl ester and any component by a known method. In addition, a method of manufacturing the flux-cored solder includes, for example, a step of filling the solder with the above-described flux. An example of the filling method can include a known method such as an extrusion method. More specifically, in the extrusion method, a raw material is injected into a mold having a large diameter and cooled with cooling water from outside to prepare a mother billet. Thereafter, the mold is reduced to have a smaller diameter (about 50 mmφ) to perform extrusion molding, and the mold is reduced to have a diameter (about 10 mmφ in general) to perform extrusion molding with an extrusion molding machine, such that a linear flux-cored solder can be obtained. Here, since the flux according to the present embodiment is the solid or solid-like flux at 25° C., it is possible to suppress the flux from being ejected when cooling in an extruding step, thereby obtaining good processability. In other words, if the flux is a liquid at 25° C., when the flux is cooled in the extruding step, the flux is ejected from the solder, resulting in a problem that workers and the like are exposed to danger due to the ejected flux or a manufacturing device of the mother billet or surroundings thereof is contaminated due to the ejected flux. As a result, processing of the flux-cored solder cannot be performed. Further, the method of manufacturing a flux-coated solder includes, for example, a step of coating a surface of the solder with the above-described flux to form a coating layer (flux-coating layer). Specifically, an example of the coating method can include a known method such as a dipping method. The flux-cored solder includes a solder alloy and the flux filled into the solder alloy. By way of example, the preferred flux-cored solder may have at least one or two or more core portions formed of the flux at a center portion thereof. Specifically, by way of example, the linear flux-cored solder may have a core formed of the flux at the center or near the center of a wire portion formed of the solder alloy along an axial direction thereof. The flux-coated solder includes a solder alloy and the flux for coating an outside of the solder alloy. By way of example, the preferred flux-coated solder may have a coating layer formed of the flux and coating at least a part or the entire surface of a core portion formed of the solder alloy. Specifically, a linear flux-coated solder may have a wire portion formed of a solder alloy and a coating layer formed of the flux and coating the entire surface of the wire portion in a circumferential direction. Examples of shapes of the flux-cored solder and the flux-coated solder can include a columnar shape such as a pellet, a disk, a ring, a chip, a ball, and a cylinder such as a column, in addition to a linear shape. A composition of the solder alloy can be a known composition of the solder alloy. Specific examples thereof can include a Sn—Ag alloy, a Sn—Cu alloy, a Sn—Ag—Cu alloy, a Sn—In alloy, a Sn—Pb alloy, a Sn—Bi alloy, and a Sn—Ag—Cu—Bi alloy, as well as an alloy obtained by adding Ag, Cu, In, Ni, Co, Sb, Ge, P, Fe, Zn, Ga, or the like to the compositions of the above-described alloys. Further, the flux-cored solder has a mass ratio of the solder alloy to the flux (solder:flux) is, for example, preferably 99.3:0.2 to 93.5:6.5, and more preferably 98.5:1.5 to 95.5:4.5. Further, the flux-coated solder has a mass ratio of the solder alloy to the flux (solder:flux) is, for example, preferably 99.7:0.3 to 85:15, and more preferably 99.4:0.6 to 97:3. Members such as electronic devices can be joined by using the flux-cored solder or flux-coated solder prepared in this way. The embodiments of the present invention have been described. However, the embodiments are merely examples of the present invention, and various constituents other than the above can be employed. In addition, the present invention is not limited to the abovementioned embodiment, and alterations, improvements, and the like within a scope that can achieve the object of the invention are included in the present invention. Hereinafter, examples of reference aspects will be additionally described. 1. A flux containing a rosin methyl ester, in which the flux is a solid or solid-like flux at 25° C., and is used for an inside of a flux-cored solder or an exterior of a flux-coated solder. 2. The flux according to 1., in which the rosin methyl ester is one or two or more methyl ester products selected from a natural rosin, a hydrogenated rosin, a polymerized rosin, a disproportionated rosin, an acid-modified rosin, a hydrogenated polymerized rosin, and a hydrogenated acid-modified rosin. 3. The flux according to 1. or 2., in which the flux has a softening point of 28° C. to 100° C. 4. The flux according to any one of 1. to 3., in which the rosin methyl ester is a liquid at 25° C. 5. The flux according to any one of 1. to 4., further containing unesterified rosin. 6. The flux according to 5., in which the content of the rosin methyl ester is 0.01 or more and 0.5 or less with respect to the content of the unesterified rosin. 7. The flux according to any one of 1. to 6., in which a viscosity η1at 25° C. is 3,200 Pa·s or higher, the viscosity η1at 25° C. being measured 5 minutes after a start of rotation at 6 Hz using a rheometer. 8. The flux according to any one of 1. to 7., further containing an activator. 9. The flux according to any one of 1. to 8., in which a content of a solvent is 13% by mass or less. 10. A flux-cored solder containing the flux according to any one of 1. to 9. inside thereof. 11. A flux-coated solder using the flux according to any one of 1. to 9. for an exterior thereof. 12. A soldering method including performing soldering with the flux according to any one of 1. to 9. 13. A method of manufacturing a flux-cored solder including a step of filling a solder with the flux according to any one of 1. to 9. 14. A method of manufacturing a flux-coated solder including a step of coating a surface of a solder with the flux according to any one of 1. to 9. to form a coating layer. EXAMPLES Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited to the description of these Examples. Examples and Comparative Examples 1) Flux Each component was mixed in compositions shown in Tables 1 to 4 to obtain a flux. The following measurements and evaluations were performed using the obtained flux. Measurement of Viscosity A state of the flux at 25° C. was observed to determine whether or not the flux is a solid or solid-like flux. Specifically, a person skilled in the art in handling of the flux left a sample of the flux, which is prepared into a columnar shape (diameter: φ5 mm, height: 5 mm, and weight: 0.1 g), on a horizontal plane at an environmental temperature of 25° C. under atmospheric pressure so that a stress is not applied from the outside, and visually observed the presence or absence of rapid fluidity (deformation). When the flux is not a solid or solid-like flux, the flux was sandwiched between plates of a rheometer (Thermo Scientific HAAKE MAPS III (registered trademark)), and then the plates rotated at 6 Hz, thereby measuring a viscosity η1 measured 5 minutes after the start of the rotation. Specifically, the following measurement conditions were adopted. First, a rheometer having parallel flat plates without grooves on surfaces thereof was used. Subsequently, the flux sample was sandwiched between the parallel flat plates (disposable plates, diameter: 25 mm and model number: KNX2159) and deformed to narrow a space between the parallel flat plates while heating about 100° C., thereby forming a 0.5 mm thin sample. Thereafter, as for the thin sample after stopping the heating and cooling it to 25° C., the plates rotated at 6 Hz thereby measuring the viscosity η1 at 25° C. which was measured 5 minutes after the start of the rotation at 6 Hz using the rheometer. A measurement limit was set to 3,500 Pa·s due to a risk of damage to the measuring device. Measurement of Softening Point A softening point of the flux was measured according to JIS K 5902 5.3 and evaluated according to the following criteria. B: 30° C. or higher D: Lower than 30° C. 2) Flux-Cored Solder and Flux-Coated Solder Next, a flux-cored solder and a flux-coated solder were prepared using the obtained flux. Each procedure will be described. Preparation of Flux-Cored Solder (Examples 1 to 46 and Comparative Examples 1 to 4) The solder having compositions shown in Tables 1 to 4 and a flux-cored solder (diameter: 1.0 mm) were prepared by an extrusion method using the flux described above. Manufacturing was performed so that a mass ratio of a solder alloy to the flux is 97:3. The flux-cored solder of Example 43 (Sn—Bi composition) had an outer diameter of 1.0 mm and a hollow portion (flux part) diameter of 0.38 mm, and the flux-cored solders of other Examples and Comparative Examples had an outer diameter of 1.0 mm and a hollow portion (flux part) diameter of 0.42 mm. Preparation of Flux-Coated Solder (Example 47) A wire solder having a diameter of 1.0 mm was prepared using the solder having the compositions shown in Tables 1 to 4, and the flux was coated by a dipping method to prepare a flux-coated solder. 3) Evaluation The following evaluations were made for the flux-cored solder and the flux-coated solder. The results are shown in Tables 1 to 4. Processability In the preparing procedure of 2) described above, processability when preparing the flux-cored solder and the flux-coated solder was evaluated according to criteria shown below. B: Preparation of the flux-cored solder and the flux-coated solder could be prepared in a safe manner. D: Processing could not be performed without securing safety because the flux was not a solid or solid-like flux. Wettability Wettability was measured according to JIS Z 3197 8.3.1.1 and evaluated according to the following criteria. <Criteria> B: 70% or more D: Less than 70% Test could not be performed Crackability of Flux Residue The flux-cored solder or the flux-coated solder was placed on a center portion of a 0.3 g copper plate (size: 30×30×0.3 mm) and heated to a temperature which is 35° C. higher than a melting point of the solder alloy for 5 seconds to wet spread the solder. Then, the solder was stored at room temperature and cooled to form flux residues on the copper plate, thereby obtaining a sample. Next, five obtained samples were dropped from 100 cm high, and observation of whether the flux residues were peeled off from the copper plate was performed. Further, all five samples in which no flux residues were peeled off were dropped again from the same height to observe the peeling off of the residues, thereby performing the evaluation according to the following criteria. A: No residues were peeled off even in the second drop test. B: No residues were peeled off in the first drop test, but one or more residues were peeled off in the second drop test. C: One to four residues were peeled off in the first drop test. D: All five residues were peeled off in the first drop test. Experiment could not be performed (because it is not possible to manufacture the flux-cored solder) TABLE 1Example 1Example 2Example 3Example 4Rosin(a)Hydrogenated5513rosin methyl ester(b)Rosin ester5Polymerized rosin ester5Hydrogenated rosin ester5(c)Natural rosin10Polymerized rosin15Hydrogenated rosin15739290Acid-modified rosin15Hydrogenatedpolymerized rosin13Hydrogenated acid-10modified rosinDisproportionated rosin10ActivatorOrganicGlutaric acidacidAdipic acid1111Stearic acid12-Hydroxystearic acidAmineCUREZOL C11Z (imidazole)2-Phenylimidazole2222DiphenylguanidineAmine2PI. HBrhydrohalogenicDiphenylguanidine HBr2222acid2-Pipecoline HBrsaltN,N-diethylaniline · HBr saltHalogen2,2,2-Tribromoethanol2222n-DBBDtra-DBBDTetrabromoethaneTetrabromobutaneTriallyl isocyanuratehexabromideOthersSolventHexyl diglycolSiliconeSilicone oilPolymerPolyflow No. 90Phosphoric(Isodecyl acid phosphate)esterTotal100100100100(a)/(c)0.0570.0680.0110.033PropertySoftening pointBBBBViscosity (Pa · s)3500350035003500Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistanceAABAProcessability (suitable forBBBBapplication)WettabilityBBBBExample 5Example 6Example 7Rosin(a)Hydrogenated rosin5810methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosinPolymerized rosinHydrogenated rosin888583Acid-modified rosinHydrogenatedpolymerized rosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganicGlutaric acidacidAdipic acid111Stearic acid12-Hydroxystearic acidAmineCUREZOL C11Z (imidazole)2-Phenylimidazole222DiphenylguanidineAmine2PI. HBrhydrohalogenicDiphenylguanidine HBr222acid2-Pipecoline HBrsaltN,N-diethylaniline · HBr saltHalogen2,2,2-Tribromoethanol222n-DBBDtra-DBBDTetrabromoethaneTetrabromobutaneTriallyl isocyanurate hexabromideOthersSolventHexyl diglycolSiliconeSilicone oilPolymerPolyflow No. 90Phosphoric(Isodecyl acid phosphate)esterTotal100100100(a)/(c)0.0570.0940.120PropertySoftening pointBBBViscosity (Pa · s)350035003500Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistanceAAAProcessability (suitable forBBBapplication)WettabilityBBBExample 8Example 9Example 10Rosin(a)Hydrogenated rosin152020methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosinPolymerized rosinHydrogenated rosin787350Acid-modified rosinHydrogenatedpolymerizedrosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganic acidGlutaric acid2Adipic acid112Stearic acid1012-Hydroxystearic acid10AmineCUREZOL C11Z2(imidazole)2-Phenylimidazole22DiphenylguanidineAmine2PI. HBrhydrohalogenicDiphenylguanidine HBr222acid salt2-Pipecoline HBrN,N-diethylaniline · HBr saltHalogen2,2,2-Tribromoethanol222n-DBBDtra-DBBDTetrabromoethaneTetrabromobutaneTriallyl isocyanuratehexabromideOthersSolventHexyl diglycolSiliconeSilicone oilPolymerPolyflow No. 90Phosphoric(Isodecyl acid phosphate)esterTotal100100100(a)/(c)0.1920.2740.400PropertySoftening pointBBBViscosity (Pa · s)350035003500Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistanceAAAProcessability (suitable forBBBapplication)WettabilityBBBExample 11Example 12Example 13Rosin(a)Hydrogenated rosin158methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosinPolymerized rosinHydrogenated rosin98.96590Acid-modified rosinHydrogenatedpolymerizedrosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganic acidGlutaric acid0.122Adipic acid2Stearic acid1012-Hydroxystearic acid10AmineCUREZOL C11Z (imidazole)22-PhenylimidazoleDiphenylguanidineAmine2PI. HBr2hydrohalogenicDiphenylguanidine HBracid salt2-Pipecoline HBrN,N-diethylaniline · HBr saltHalogen2,2,2-Tribromoethanol2n-DBBDtra-DBBDTetrabromoethaneTetrabromobutaneTriallyl isocyanuratehexabromideOthersSolventHexyl diglycolSiliconeSilicone oilPolymerPolyflow No. 90Phosphoric(Isodecyl acid phosphate)esterTotal100100100(a)/(c)0.0100.0770.089PropertySoftening pointBBBViscosity (Pa · s)350035003500Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistanceBAAProcessability (suitable forBBBapplication)WettabilityBBB TABLE 2Example 14Example 15Example 16Example 17Rosin(a)Hydrogenated rosin8888methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosinPolymerized rosinHydrogenated rosin90909090Acid-modified rosinHydrogenatedpolymerized rosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganic acidGlutaric acidAdipic acid2Stearic acid212-Hydroxystearic acid2AmineCUREZOL C11Z (imidazole)22-PhenylimidazoleDiphenylguanidineAmine2PI. HBrhydrohalogenicDiphenylguanidine HBracid salt2-Pipecoline HBrN,N-diethylaniline · HBr saltHalogen2,2,2-Tribromoethanoln-DBBDtra-DBBDTetrabromoethaneTetrabromobutaneTriallyl isocyanurate hexabromideOthersSolventHexyl diglycolSiliconeSilicone oilPolymerPolyflow No. 90Phosphoric(Isodecyl acid phosphate)esterTotal100100100100(a)/(c)0.0890.0890.0890.089PropertySoftening pointBBBBViscosity (Pa · s)3500350035003500Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistanceAAAAProcessability (suitable forBBBBapplication)WettabilityBBBBExample 18Example 19Example 20Rosin(a)Hydrogenated rosin888methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosinPolymerized rosinHydrogenated rosin909090Acid-modified rosinHydrogenatedpolymerized rosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganic acidGlutaric acidAdipic acidStearic acid12-Hydroxystearic acidAmineCUREZOL C11Z (imidazole)2-Phenylimidazole2Diphenylguanidine2Amine2PI. HBr2hydrohalogenicDiphenylguanidine HBracid salt2-Pipecoline HBrN,N-diethylaniline · HBr saltHalogen2,2,2-Tribromoethanoln-DBBDtra-DBBDTetrabromoethaneTetrabromobutaneTriallyl isocyanurate hexabromideOthersSolventHexyl diglycolSiliconeSilicone oilPolymerPolyflow No. 90Phosphoric(Isodecyl acid phosphate)esterTotal100100100(a)/(c)0.0890.0890.089PropertySoftening pointBBBViscosity (Pa · s)350035003500Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistanceAAAProcessability (suitable forBBBapplication)WettabilityBBBExample 21Example 22Example 23Rosin(a)Hydrogenated rosin888methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosinPolymerized rosinHydrogenated rosin909090Acid-modified rosinHydrogenatedpolymerized rosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganic acidGlutaric acidAdipic acidStearic acid12-Hydroxystearic acidAmineCUREZOL C11Z (imidazole)2-PhenylimidazoleDiphenylguanidineAmine2PI. HBrhydrohalogenicDiphenylguanidine HBr2acid salt2-Pipecoline HBr2N,N-diethylaniline · HBr salt2Halogen2,2,2-Tribromoethanoln-DBBDtra-DBBDTetrabromoethaneTetrabromobutaneTriallyl isocyanuratehexabromideOthersSolventHexyl diglycolSiliconeSilicone oilPolymerPolyflow No. 90Phosphoric(Isodecyl acid phosphate)esterTotal100100100(a)/(c)0.0890.0890.089PropertySoftening pointBBBViscosity (Pa · s)350035003500Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistanceAAAProcessability (suitable forBBBapplication)WettabilityBBBExample 24Example 25Example 26Rosin(a)Hydrogenated rosin888methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosinPolymerized rosinHydrogenated rosin909090Acid-modified rosinHydrogenatedpolymerized rosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganic acidGlutaric acidAdipic acidStearic acid12-Hydroxystearic acidAmineCUREZOL C11Z (imidazole)2-PhenylimidazoleDiphenylguanidineAmine2PI. HBrhydrohalogenicDiphenylguanidine HBracid salt2-Pipecoline HBrN,N-diethylaniline · HBr saltHalogen2,2,2-Tribromoethanol2n-DBBD2tra-DBBD2TetrabromoethaneTetrabromobutaneTriallyl isocyanurate hexabromideOthersSolventHexyl diglycolSiliconeSilicone oilPolymerPolyflow No. 90Phosphoric(Isodecyl acid phosphate)esterTotal100100100(a)/(c)0.0890.0890.089PropertySoftening pointBBBViscosity (Pa · s)350035003500Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistanceAAAProcessability (suitable forBBBapplication)WettabilityBBB TABLE 3Example 27Example 28Example 29Example 30Rosin(a)Hydrogenated rosin8883methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosinPolymerized rosinHydrogenated rosin90909087.5Acid-modified rosinHydrogenatedpolymerized rosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganic acidGlutaric acidAdipic acid1Stearic acid12-Hydroxystearic acidAmineCUREZOL C11Z (imidazole)2-PhenylimidazoleDiphenylguanidine2Amine2PI. HBrhydrohalogenicDiphenylguanidine HBr0.5acid salt2-Pipecoline HBrN,N-diethylaniline · HBr saltHalogen2,2,2-Tribromoethanoln-DBBDtra-DBBD6Tetrabromoethane2Tetrabromobutane2Triallyl isocyanurate hexabromide2OthersSolventHexyl diglycolSiliconeSilicone oilPolymerPolyflow No. 90Phosphoric(Isodecyl acid phosphate)esterTotal100100100100(a)/(c)0.0890.0890.0890.034PropertySoftening pointBBBBViscosity (Pa · s)3500350035003500Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistanceAAAAProcessability (suitable forBBBBapplication)WettabilityBBBBExample 31Example 32Example 33Rosin(a)Hydrogenated rosin335methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosinPolymerized rosinHydrogenated rosin889085.5Acid-modified rosinHydrogenatedpolymerized rosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganic acidGlutaric acid1Adipic acid11Stearic acid12-Hydroxystearic acidAmineCUREZOL C11Z (imidazole)22-Phenylimidazole2Diphenylguanidine2Amine2PI. HBr2hydrohalogenicDiphenylguanidine HBr0.5acid salt2-Pipecoline HBrN,N-diethylaniline · HBr salt2Halogen2,2,2-Tribromoethanol22n-DBBD2tra-DBBD6TetrabromoethaneTetrabromobutaneTriallyl isocyanurate hexabromideOthersSolventHexyl diglycolSiliconeSilicone oilPolymerPolyflow No. 90Phosphoric(Isodecyl acid phosphate)esterTotal100100100(a)/(c)0.0340.0330.058PropertySoftening pointBBBViscosity (Pa · s)350035003500Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistanceAAAProcessability (suitable forBBBapplication)WettabilityBBBExample 34Example 35Example 36Rosin(a)Hydrogenated rosin551methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosinPolymerized rosinHydrogenated rosin868882Acid-modified rosinHydrogenatedpolymerized rosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganic acidGlutaric acid11Adipic acid11Stearic acid112-Hydroxystearic acid1AmineCUREZOL C11Z (imidazole)212-Phenylimidazole21Diphenylguanidine1Amine2PI. HBr21hydrohalogenicDiphenylguanidine HBr1acid salt2-Pipecoline HBr1N,N-diethylaniline · HBr salt21Halogen2,2,2-Tribromoethanol221n-DBBD21tra-DBBD1Tetrabromoethane1Tetrabromobutane1Triallyl isocyanurate hexabromide1OthersSolventHexyl diglycolSiliconeSilicone oilPolymerPolyflow No. 90Phosphoric(Isodecyl acid phosphate)esterTotal100100100(a)/(c)0.0580.0570.012PropertySoftening pointBBBViscosity (Pa · s)350035003500Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistanceAABProcessability (suitable for application)BBBWettabilityBBBExample 37Example 38Example 39Rosin(a)Hydrogenated rosin755methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosinPolymerized rosinHydrogenated rosin707887Acid-modified rosinHydrogenatedpolymerized rosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganic acidGlutaric acid1Adipic acid111Stearic acid112-Hydroxystearic acid1AmineCUREZOL C11Z (imidazole)12-Phenylimidazole122Diphenylguanidine1Amine2PI. HBr1hydrohalogenicDiphenylguanidine HBr122acid salt2-Pipecoline HBr1N,N-diethylaniline · HBr salt1Halogen2,2,2-Tribromoethanol122n-DBBD1tra-DBBD1Tetrabromoethane1Tetrabromobutane1Triallyl isocyanurate hexabromide1OthersSolventHexyl diglycol310SiliconeSilicone oil11PolymerPolyflow No. 901Phosphoric(Isodecyl acid phosphate)1esterTotal100100100(a)/(c)0.1000.0640.057PropertySoftening pointBBBViscosity (Pa · s)350035003500Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistanceAAAProcessability (suitable forBBBapplication)WettabilityBBB TABLE 4Example 40Example 41Example 42Example 43Rosin(a)Hydrogenated rosin5555methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosinPolymerized rosinHydrogenated rosin87878088Acid-modified rosinHydrogenatedpolymerized rosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganic acidGlutaric acidAdipic acid1111Stearic acid12-Hydroxystearic acidAmineCUREZOL C11Z (imidazole)2-Phenylimidazole2222DiphenylguanidineAmine2PI. HBrhydrohalogenicDiphenylguanidine HBr2222acid salt2-Pipecoline HBrN,N-diethylaniline · HBr saltHalogen2,2,2-Tribromoethanol2222n-DBBDtra-DBBDTetrabromoethaneTetrabromobutaneTriallyl isocyanurate hexabromideOthersSolventHexyl diglycol5SiliconeSilicone oil1PolymerPolyflow No. 9011Phosphoric(Isodecyl acid phosphate)11esterTotal100100100100(a)/(c)0.0570.0570.0630.057PropertySoftening pointBBBBViscosity (Pa · s)3500350035003500Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuSn—BiEvaluationResidue crack resistanceAAAAProcessability (suitable forBBBBapplication)WettabilityBBBBExampleExample 4445Example 46Example 47Rosin(a)Hydrogenated rosin550.520methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosin92.5Polymerized rosinHydrogenated rosin888873Acid-modified rosinHydrogenatedpolymerized rosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganic acidGlutaric acidAdipic acid1111Stearic acid12-Hydroxystearic acidAmineCUREZOL C11Z (imidazole)2-Phenylimidazole2222DiphenylguanidineAmine2PI. HBrhydrohalogenicDiphenylguanidine HBr2222acid salt2-Pipecoline HBrN,N-diethylaniline · HBr saltHalogen2,2,2-Tribromoethanol2222n-DBBDtra-DBBDTetrabromoethaneTetrabromobutaneTriallyl isocyanurate hexabromideOthersSolventHexyl diglycolSiliconeSilicone oilPolymerPolyflow No. 90Phosphoric(Isodecyl acid phosphate)esterTotal100100100100(a)/(c)0.0570.0570.0050.274PropertySoftening pointBBBBViscosity (Pa · s)3500350035003500Solder processingSolder compositionSn—CuSn—AgSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistanceAACAProcessability (suitable forBBBBapplication)WettabilityBBBBComparativeComparativeComparativeComparativeExample 1Example 2Example 3Example 4Rosin(a)Hydrogenated rosin3009020methyl ester(b)Rosin esterPolymerized rosin esterHydrogenated rosin ester(c)Natural rosinPolymerized rosinHydrogenated rosinAcid-modified rosinHydrogenatedpolymerized6093049rosinHydrogenated acid-modified rosinDisproportionated rosinActivatorOrganicGlutaric acid1031acidAdipic acid11Stearic acid312-Hydroxystearic acidAmineCUREZOL C11Z (imidazole)2-Phenylimidazole22DiphenylguanidineAmine2PI. HBrhydrohalogenicDiphenylguanidine HBr22acid2-Pipecoline HBrsaltN,N-diethylaniline · HBr saltHalogen2,2,2-Tribromoethanol22n-DBBDtra-DBBDTetrabromoethaneTetrabromobutaneTriallyl isocyanuratehexabromideOthersSolventHexyl diglycolSiliconeSilicone oilPolymerPolyflow No. 90Phosphoric(Isodecyl acid phosphate)esterTotal100100100100(a)/(c)0.3680.0000.408PropertySoftening pointDBDDViscosity (Pa · s)2800350072400Solder processingSolder compositionSn—Ag—CuSn—Ag—CuSn—Ag—CuSn—Ag—CuEvaluationResidue crack resistance—D——Processability (suitable forDBDDapplication)Wettability—B—— This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2020-059856, filed Mar. 30, 2020, the entire contents of which are incorporated herein by reference. | 51,522 |
11858073 | DETAILED DESCRIPTION FIG.1illustrates an exemplary welding, cutting or heating power supply10, which functions to power and control a welding, cutting or heating operation in accordance with aspects of the present disclosure. The power supply unit10in the illustrated embodiment contains a control panel12through which a user may control the supply of materials, such as power, gas flow, and so forth, to the welding, cutting or heating operation through knobs14or other panel components. The power supply10contains ports16, which may communicatively couple the power supply10to other system components, such as a torch, a work lead, a wall power outlet, and so forth. The portability of the unit10depends on a set of wheels18, which enable the user to easily move the power supply unit10to the location of a workpiece. FIG.2is a circuit diagram illustrating one embodiment of an output power control circuit20of the welding power supply10in accordance with aspects of the present disclosure. The power control circuit20converts an unregulated DC input to a regulated AC output as needed for the welding, cutting or heating operation being performed. For instance, typical submerged arc welding (SAW) operations may require a regulated high current square wave output of several hundreds of amperes. However, primary power sources, such as a wall outlet, provide an unregulated AC output that is insufficient for a SAW operation. Therefore, it is now recognized that circuitry must convert the output of the primary power source to an output suitable for the welding, cutting or heating operation being performed. In operation, the power control circuit20illustrated inFIG.2efficiently converts unregulated DC inputs to a first capacitor22from the primary power supply to regulated AC outputs for the welding, cutting or heating operation. In the following discussion, the power control circuit20illustrated inFIG.2may be broken up into legs and sides for explanatory purposes. However, one skilled in the art would understand that the components of the circuit20may be arranged and/or grouped differently while retaining the overall function of the circuit20. A pulse width modulation (PWM) leg24modulates current received from the first capacitor22such that the received unregulated DC current is converted to a regulated DC current. The PWM leg24includes a first transistor26and a first diode28coupled in parallel, a second transistor30and a second diode32coupled in parallel, an inductor34, and a first terminal36of an output38. The first transistor26and the first diode28may be positioned in between a first node40and a second node42. As illustrated inFIG.2, the first node40may be located such that it is positioned on a first outer edge41of the circuit20. The second node42is located below the first outer edge41of the circuit20but above a second outer edge43of the circuit20. The second transistor30and the second diode32may be positioned in between the second node42and a third node44, which may be located such that it is positioned on the second outer edge43of the circuit20. The inductor34may be positioned in between the second node42and the first terminal36of the output38and parallel to the first outer edge41and the second outer edge43of the circuit20. The PWM leg24alternates switching of the first transistor26or the second transistor30to increase or decrease current at the output38as dictated by the demands of the welding or plasma cutting operation. In some embodiments, the first transistor26, the second diode32, and the inductor34may be configured to function as a buck converter. Similarly, in some embodiments, the second transistor30, the first diode28, and the inductor34may be configured to function as a buck converter, transferring energy from an input to an output by storing and subsequently releasing energy in the inductor34. Taken together, the first transistor26, the first diode28, the second transistor30, the second diode32, and the inductor34may function as a bidirectional buck converter, which converts the DC voltage across the first capacitor22to a regulated DC current in the inductor34. A steering leg46, which includes a third transistor48and a third diode50coupled in parallel and a fourth transistor52and a fourth diode54coupled in parallel, forms a half bridge inverter that determines the direction of current flow through the inductor34. The steering leg46is positioned between the first outer edge41and the second outer edge43of the circuit20. During operation, the steering leg46facilitates current flow either from right to left through the inductor34or from left to right through the inductor34by turning the third transistor48and the fourth transistor52on and off. The third transistor48and the third diode50may be positioned in between the first node40and a fourth node56. The fourth transistor52and the fourth diode54may be positioned in between the fourth node56and the third node44such that they exist in series with the first node40, which is positioned on the first outer edge41of the circuit20, and the fourth node56, which is positioned in between the first outer edge41of the circuit20and the second outer edge43of the circuit20. A second terminal58of the output38extending from the fourth node56in parallel with the first outer edge41and the second outer edge43of the circuit20may be configured to receive current from the steering leg46. An output clamp leg59includes a second capacitor60that is configured to function as an output clamp circuit, which suppresses the energy in a parasitic output inductance of the welding or cutting cables during polarity reversal. The output clamp leg59is positioned between and connects the first outer edge41and the second outer edge43of the circuit20. In some embodiments, the capacity of the second capacitor60is much less than the capacity of the first capacitor22. In some embodiments, the peak current in the second capacitor60during polarity reversal may be the current in the inductor34and the parasitic output inductance of the welding or cutting cables. An input leg61includes the first capacitor22and a blocking diode62arranged in series. As illustrated inFIG.2, the blocking diode62may be positioned on the first outer edge41of the circuit20and the first capacitor22may be positioned in between the first outer edge41and the second outer edge43of the circuit20. The input leg61is positioned between the first outer edge41and the second outer edge43of the circuit20. The first capacitor22is configured to receive power from a primary power source that may include a line frequency step down transformer and a rectifier. The transformer may be single phase or three phase and may output 50 Hz or 60 Hz. The transformer may have multiple primary taps to accommodate multiple input voltages. The blocking diode62allows the second capacitor60to resonate with the series combination of the inductor34and the parasitic output inductance during polarity reversal as described in more detail below. FIG.3is a circuit diagram illustrating an exemplary embodiment of the output power control circuit20with a current flow64established from left to right through the inductor34(i.e. state1). To establish the left to right current flow64through the inductor34, the fourth transistor52is turned on, and the first transistor26is pulse width modulated to regulate the magnitude of the current through the inductor34. The forward path of current64originates from the first capacitor22and flows through the blocking diode62, the first node40, the first transistor26, the inductor34, the first terminal36of the output38, the output38, the second terminal58of the output38, the fourth node56, the fourth transistor52, the third node44and back to the first capacitor22. When the pulse width modulation of the first transistor26dictates that it is off, a freewheel current path66, as illustrated inFIG.4, is established to allow the magnitude of the current flowing through the inductor34to decrease (i.e. state2). The freewheel current path66flows from left to right through the inductor34and is through the second diode32, the second node42, the inductor34, the first terminal36of the output38, the output38, the second terminal58of the output38, the fourth node56, the fourth transistor52, and the third node44. The second transistor30, the first diode28, the third diode50, and the third transistor48are not used when DC current is flowing from left to right through the inductor34. FIG.5is a circuit diagram illustrating an exemplary embodiment of the output power control circuit20with a current flow68established from right to left through the inductor34(i.e. state5). To establish the right to left current flow68through the inductor34, the third transistor48is turned on, and the second transistor30is pulse width modulated to regulate the magnitude of the current through the inductor34. The forward path of current68originates from the first capacitor22and flows through the blocking diode62, the first node40, the third transistor48, the second terminal58of the output38, the output38, the first terminal36of the output38, the inductor34the second node42, the second transistor30, the third node44and back to the first capacitor22. When the pulse width modulation of the second transistor30dictates that it is off, a freewheel current path70, as illustrated inFIG.6, is established to allow the magnitude of the current flowing through the inductor34to decrease (i.e. state6). The freewheel current path70flows from right to left through the inductor34and is through the first diode28, the first node40, the third transistor48, the fourth node56, the second terminal58of the output38, the output38, the first terminal36of the output38, the inductor34, and the second node42. The first transistor26, the second diode32, the third diode50, and the fourth diode54are not used when DC current is flowing from right to left through the inductor34. In some embodiments, once current flow has been established either in the left to right current path64or in the right to left current path68through the inductor34, the direction of the current flow may be reversed. For instance, if current flow has been established in the left to right current path64through the inductor34, the direction of the current flow can be reversed by turning all the transistors26,30,48,52off. A first intermediate current flow path72illustrated inFIG.7is established wherein the current continues to flow from left to right through the inductor34(i.e. state3). The first intermediate current flow path72flows from the inductor34through the first terminal36of the output38, the output38, the second terminal of the output58, the fourth node56, the third diode50, the first node40, the second capacitor60, the third node44, the second diode30, and the second node42. The inductor34releases the energy it stored during the left to right current flow64, charging the second capacitor60to a voltage greater than the voltage of the first capacitor22, at which point the blocking diode62begins to block. The second transistor30and the third transistor48are turned on to allow the second capacitor to unload its energy back into the output load38and the inductor34after the current in the inductor34reaches zero. When the current in the inductor34reaches zero, the voltage on the second capacitor60is at an upper limit. Subsequently, the energy built up in the second capacitor60will begin to discharge, reversing the direction of the current flow and establishing a current flow path74from right to left through the inductor34, as illustrated inFIG.8(i.e. state4). Since the second transistor30and the third transistor48have been turned on, current will flow from the second capacitor60through the first node40, the third transistor48, the fourth node56, the second terminal of the output58, the output38, the first terminal of the output36, the inductor34, the second transistor30, and the third node44. When the voltage on the second capacitor60discharges to the voltage on the first capacitor22, current flow will be established through the inductor34from right to left at approximately the same magnitude as prior to polarity reversal, slightly reduced by circuit losses. Subsequently, the third transistor48remains on and the second transistor30is pulse width modulated to regulate the current flow through the inductor34and reestablish the current path from right to left as previously shown inFIG.5. Once current flow has been reestablished in the right to left current path68through the inductor34, the direction of the current flow can be reversed by turning all the transistors26,30,48,52off. A first intermediate current flow path76illustrated inFIG.9is established wherein the current continues to flow from right to left through the inductor34(i.e. state7). The first intermediate current flow path76flows from the inductor34through the second node42, the first diode28, the first node40, the second capacitor60, the third node44, the fourth diode54, the fourth node56, the second terminal58of the output38, the output38, and the first terminal of the output36. The inductor34releases the energy it stored during the right to left current flow68, charging the second capacitor60to a voltage greater than the voltage of the first capacitor22, at which point the blocking diode62begins to block. The first transistor26and the fourth transistor52are turned on to allow the second capacitor to unload its energy back into the output load38and the inductor34after the current in the inductor34reaches zero. When the current in the inductor34reaches zero, the voltage on the second capacitor60is at an upper limit. Subsequently, the energy built up in the second capacitor60will begin to discharge, reversing the direction of the current flow and establishing a current flow path78from left to right through the inductor34, as illustrated inFIG.10(i.e. state8). Since the first transistor26and the fourth transistor52have been turned on, current will flow from the second capacitor60through the first node40, the first transistor26, the second node42, the inductor34, the first terminal of the output36, the output38, the second terminal of the output58, the fourth node56, the fourth transistor52, and the third node44. When the voltage on the second capacitor60discharges to the voltage on the first capacitor22, current flow will be established through the inductor34from left to right at approximately the same magnitude as prior to polarity reversal, slightly reduced by circuit losses. Subsequently, the fourth transistor52remains on and the first transistor26is pulse width modulated to regulate the current flow through the inductor34and reestablish the current path from left to right as previously shown inFIG.3. FIGS.11A and11Billustrate exemplary current and voltage waveforms generated during control circuit operation. In particular,FIGS.11A and11Billustrate an inductor current waveform80, a second capacitor voltage waveform82, a first transistor voltage waveform84, a second transistor voltage waveform86, a third transistor voltage waveform88, and a fourth transistor voltage waveform90. From an initial time92to a later time94, the circuit20is switching between state1and state2to maintain the current at the output38at1000A flowing from left to right through the inductor34as previously described with respect toFIGS.3-4. The fourth transistor52is on in both states1and2while the first transistor26is on in state1and off in state2. A current at the output38appears to be a constant1000A but is actually increasing a few amps in state1and decreasing a few amps in state2. From a time94to a later time96, the circuit20remains exclusively in state2, the fourth transistor52is the only transistor on, and the current at the output38is decreasing. At the time96, the fourth transistor52is turned off, and the circuit20is in state3as previously described with respect toFIG.7. The second transistor30and the third transistor48are turned on in state3even though the current flow path is through the second diode32and the third diode50. During state3, the current at the output38rapidly decreases while the voltage on the second capacitor60increases. Subsequently, at a later time98, the current at the output38reverses, and the voltage on the second capacitor60is at an upper limit. At the time98, the circuit20enters state4, as previously described with respect toFIG.8. The current at the output38increases rapidly through the second capacitor60, the second transistor30, and the third transistor48. The voltage on the second capacitor60begins to decrease. Subsequently, at an approximate later time100, the current at the output38has reversed and is flowing from right to left through the inductor34. The voltage on the second capacitor60has reached its initial condition. From the approximate time100to an approximate time102, the circuit20is in state5, as previously described with respect toFIG.5. The second transistor30and the third transistor48are on, and the current at the output38increases. At the time102, the current at the output38has reached1000A and is flowing from right to left through the inductor34. The circuit20is switching between states5and6to maintain the output current at1000A as previously described with respect toFIGS.5-6. The second transistor30is on in state5while the current at the output is increasing a few amps. From a time104to a later time106, the circuit20is in state6as previously described with respect toFIG.6. The third transistor48is on, the second transistor30is off, and the current at the output is decreasing a few amps. At the time106, the third transistor48turns off, and the circuit is in state7as previously described with respect toFIG.9. The first transistor26and the fourth transistor52turn on in state7even though the current flow is through the first diode28and the fourth diode54. During state7, the current at the output38rapidly decreases, while the voltage on the second capacitor60increases. At an approximate later time108, the current at the output38reverses, and the voltage on the second capacitor60is at an upper limit. At the time108, the circuit20enters state8as previously described with respect toFIG.10. The current at the output increases rapidly through the second capacitor60, the first transistor26, and the fourth transistor52. The voltage on the second capacitor60begins to decrease. At an approximate time110, the current at the output38has reversed, and current flow is from left to right through the inductor34while the voltage on the second capacitor60has reached its initial condition. From the approximate time110to an approximate time112, the circuit20returns to state1, wherein the first transistor26and the fourth transistor52are on, and the current at the output38increases. At the approximate time112, the current at the output38has reached1000A flowing from left to right through the inductor34, and the circuit20is switching between states1and2to maintain the output current at1000A. In the illustrated exemplary operation, the above described sequence of states repeats for the next 10 mS cycle (i.e. 100 Hz frequency) of current at the output38. FIG.12is a circuit diagram illustrating a further embodiment of the output power control circuit20ofFIG.2. It is well known to those skilled in the art that certain welding processes, such as AC GTAW, require a voltage of approximately 200 volts or more during polarity reversal to maintain current flow and prevent arc rectification. Other process, such as AC SAW, may not require this high voltage during polarity reversal, and the embodiment of the output power control circuit20illustrated inFIG.12may be used. In such processes, the output clamp leg59, which includes the second capacitor60that is configured to function as the output clamp circuit59in the embodiment illustrated inFIG.2, may be eliminated from the output power control circuit20. Additionally, if the capacitor60is eliminated from the output clamp circuit20, then the blocking diode62, which was part of the input leg61inFIG.2, is no longer required. Accordingly, in the illustrated embodiment, the output current flows through the capacitor22of the input leg61during polarity reversal, and the output voltage is clamped to the voltage on capacitor22. While only certain features of the present disclosure have been illustrated and described herein, many modifications and changes will occur to those skilled in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the present disclosure. | 20,722 |
11858074 | DETAILED DESCRIPTION Hereinafter, embodiments of a medical apparatus remanufacturing method will be described with reference to the accompanying drawings. Note that the embodiments of the medical apparatus remanufacturing method are not limited to the embodiments described below. In the drawings, same reference signs are attached to the same components. Schematic Configuration of Treatment Tool FIG.1is a view illustrating a treatment tool1according to the present embodiment. The treatment tool1corresponds to the medical apparatus. The treatment tool1applies ultrasound energy and radio-frequency energy to a site to be treated (hereinafter, referred to as a target site) in a biological tissue, thereby treating the target site. Here, the treatment typically means coagulation and incision of the target site. As illustrated inFIG.1, the treatment tool1includes a housing2, an ultrasound probe3, and an ultrasound transducer4. FIG.2is a view illustrating the housing2. Specifically,FIG.2is a cross-sectional view of the housing2cut by a plane passing through a central axis Ax of the ultrasound probe3. The plane corresponds to a boundary surface between first and second housings5and6.FIG.3is a cross-sectional view of the housing2taken along line III-III illustrated inFIG.2.FIG.4is a cross-sectional view of the housing2taken along line IV-IV illustrated inFIG.2.FIG.5is a cross-sectional view of the housing2taken along line V-V illustrated inFIG.2. In the following, one side running along the central axis Ax of the ultrasound probe3will be referred to as a distal end side Ar1(FIGS.1and2), while the other side will be referred to as a proximal end side Ar2(FIGS.1and2). The housing2is formed with two members, a first housing5and a second housing6, as illustrated inFIGS.2to5. The housing2is built by assembling the first and second housings5and6to each other. In an assembled state where the first and second housings5and6are assembled to each other, a channel21(FIGS.2to4) penetrating along the central axis Ax (FIGS.1to5) of the ultrasound probe3is provided. That is, the housing2has a tubular shape. On an outer edge side of the inner surface of the first housing5, a plurality (five in the present embodiment) of bosses51having columnar shapes are individually formed to protrude toward the second housing6side, as illustrated inFIGS.2to5. In contrast, at individual positions facing the plurality of bosses51on the inner surface of the second housing6, press-fitted portions60are formed to individually protrude toward the first housing5side, as illustrated inFIGS.2to5. In addition, each of the press-fitted portions60has a boss hole61having a circular shape in plan view and extending from the distal end toward the proximal end so as to be used as a hole into which the boss51is press-fitted. That is, the press-fitted portion60is a recess having a fitting surface that fits with the boss51. That is, the assembled state in which the first and second housings5and6are assembled to each other is formed by press-fitting the bosses51into the boss holes61, individually. The relationship between a first thermal expansion coefficient of the first housing5(boss51) and a second thermal expansion coefficient of the second housing6(press-fitted portion60) described above is set to the relationship: First thermal expansion coefficient <Second thermal expansion coefficient. Furthermore, the relationship between a first thermal conductivity of the first housing5(boss51) and a second thermal conductivity of the second housing6(press-fitted portion60) is set to the relationship: First thermal conductivity <Second thermal conductivity. Here, examples of the resin material having a high thermal expansion coefficient include polyethylene (heat resistant temperature: 70° C. to 90° C.), polypropylene (heat resistant temperature: 100° C. to 140° C.), Acrylonitrile Butadiene Styrene (ABS) resin (heat resistant temperature: 70° C. to 100° C.). In contrast, examples of the resin material having a low thermal expansion coefficient include polycarbonate (heat resistant temperature: 120° C. to 130° C.), polytetrafluoroethylene (heat resistant temperature: 260° C.), and polysulfone (heat resistant temperature: 150° C.) Moreover, examples of the resin material having high thermal conductivity include polysulfone, and polyethylene. In contrast, examples of the resin material having low thermal conductivity include polycarbonate, PTFE, ABS, and polypropylene. Therefore, for example, using polycarbonate for forming the first housing5and using polyethylene for forming the second housing6will make it possible to satisfy the two relations regarding the thermal expansion coefficient and the thermal conductivity described above. Furthermore, as illustrated inFIG.1or2, the housing2includes a plurality of (three in the present embodiment) switches7. The plurality of switches7is individually provided so as to be exposed to the outside of the housing2to receive an output start operation by the practitioner. Here, as illustrated inFIG.1, the treatment tool1is electrically connected to a control device100via an electric cable C. In addition, the switch7outputs an operation signal corresponding to the output start operation to the control device100via the electric cable C. The ultrasound probe3, formed of a conductive material, has an elongate shape extending along the central axis Ax. The ultrasound probe3is mounted in the channel21of the housing2in a state where an end of the distal end side Ar1is exposed to the outside. Note that the ultrasound probe3cannot be removed from the housing2unless the housing2is divided into the first and second housings5and6. Furthermore, the ultrasound probe3is connected, at an end on the proximal end side Ar2, to a bolt-tightened Langevin transducer (BLT) included in the ultrasound transducer4. Subsequently, the ultrasound probe3transmits the ultrasound vibration generated by the BLT from the end on the proximal end side Ar2to the end on the distal end side Ar1. In the present embodiment, the ultrasound vibration is a longitudinal vibration that vibrates in the direction along the central axis Ax. At this time, the end of the ultrasound probe3on the distal end side Ar1vibrates with a desired amplitude by the longitudinal vibration. The ultrasound transducer4is to be inserted into the channel21from the proximal end side Ar2of the housing2and configured to be detachable from the housing2. Although not specifically illustrated, the ultrasound transducer4includes a BLT that generates ultrasound vibration in accordance with the supply of AC power. The treatment tool1described above operates as follows. A practitioner holds the treatment tool1by hand and brings the end of the ultrasound probe3on the distal end side Ar1into contact with a target site. Thereafter, the practitioner presses the switch7. Subsequently, the control device100executes the following control according to the operation signal from the switch7. The control device100supplies a radio-frequency current between the ultrasound probe3and an indifferent electrode (not illustrated) attached to the surface of the subject. Accordingly, a radio-frequency current flows through the target site. In other words, radio-frequency energy is applied to the target site. Furthermore, the control device100supplies the AC power to the BLT included in the ultrasound transducer4at substantially the same time as the supply of the radio-frequency current between the ultrasound probe3and the indifferent electrode, thereby providing the BLT with ultrasound vibration. Subsequently, ultrasound vibration is applied to the target site from the end of the ultrasound probe3on the distal end side Ar1. In other words, ultrasound energy is applied to the target site. Accordingly, a radio-frequency current flows through the target site, leading to generation of Joule heat. Furthermore, the longitudinal vibration of the ultrasound probe3generates frictional heat between the end of the ultrasound probe3on the distal end side Ar1and the target site. This makes it possible to achieve incision with coagulation in the target site. As described above, the treatment tool1according to the present embodiment has the functions of both the ultrasound treatment tool and the monopolar treatment tool. Method of Remanufacturing Treatment Tool Next, a method of remanufacturing the above-described treatment tool1will be described. The method of remanufacturing the treatment tool1corresponds to the medical apparatus remanufacturing method. FIG.6is a flowchart illustrating a method of remanufacturing the treatment tool1. An operator collects the used treatment tool1after treating the target site. Subsequently, the operator disassembles the collected treatment tool1as described below (step S1). FIG.7is a view illustrating step S1. For convenience of description,FIG.7simply illustrates portions joined to each other by the boss51and the boss hole61, as the first and second housings5and6. First, the operator releases the assembled state of the first and second housings5and6, and divides the housing2into two members, the first and second housings5and6. Specifically, the operator places the treatment tool1on a heating plate in a posture in which the second housing6comes at a lower portion and the first housing5at an upper portion. This allows the second housing6(press-fitted portion60) to be heated from the outer surface side by the heat from the heating plate, as illustrated inFIG.7(temperature changing step). In the present embodiment, the temperature used for heating the second housing6is lower than the heat resistant temperature of the second housing6. Accordingly, the boss hole61radially expands in direction D1(FIG.7) by thermal expansion. That is, the contact surface pressure between the boss51and the boss hole61decreases. Thereafter, the operator removes the boss51from the boss hole61to divide the housing2into two members, the first and second housings5and6(releasing step). The operator then removes the ultrasound probe3from the housing2. After step S1, the operator cleans and sterilizes the ultrasound probe3removed from the housing2(step S2). Specifically, cleaning of the ultrasound probe3is performed using a brush or the like to remove large stains attached to the ultrasound probe3. Thereafter, in order to remove pathogenic microorganisms derived from blood, body fluid, mucosa, or the like, ultrasound cleaning of the ultrasound probe3is performed using one of cleaning solutions including a cleaning solution containing isopropanol, a proteolytic enzyme detergent, or alcohol. Note that the cleaning solution is not limited to the above-described cleaning solution, and other cleaning solution may be adopted or a disinfecting liquid may be contained. Furthermore, in the sterilization of the ultrasound probe3, one of high-pressure steam sterilization, ethylene oxide gas sterilization, or hydrogen peroxide gas low-temperature sterilization is used in order to remove pathogenic microorganisms or the like derived from blood, body fluid, mucosa, or the like. After step S2, the operator assembles a new treatment tool1(step S3: assembling step). Specifically, the operator reuses the first and second housings5and6divided into two members in step S1. Subsequently, the operator inserts the ultrasound probe3cleaned and sterilized in step S2between the first and second housings5and6, and presses the boss51into the boss hole61to newly assemble the new treatment tool1. After step S3, the operator inspects and tests (step S4) the treatment tool1newly assembled in step S2. Specifically, examples of the inspection and test of the treatment tool1include various verification tests such as biocompatibility, cleaning validation, performance, ethylene oxide gas (EOG) sterilization residue test, bioburden resistance test, comparative resistance of sterilization, and viable cell count test. Here, regarding the performance, verification is performed to verify that the newly formed treatment tool1has the same effectiveness and safety as the original product. After step S4, the operator sequentially performs packaging (step S5), box-packing (step S6), sterilization (step S7: sterilization step) and shipment (step S8) of the treatment tool1verified to have the same effectiveness and safety as the original product by the inspection and test in step S4. Here, in step S7, a sterilization treatment using a sterilizing gas such as ethylene oxide gas or propylene oxide gas is applied to the treatment tool1box-packed in step S6. Steps S1to S8described above are executed to achieve remanufacturing of the treatment tool1. The present embodiment described above achieves the following effects. In the method of remanufacturing the treatment tool1according to the present embodiment, the second housing6(press-fitted portion60) is heated in step S1. Subsequently, the boss hole61radially expands due to thermal expansion. That is, the contact surface pressure between the boss51and the boss hole61decreases. Therefore, the operator can disassemble the housing2without causing a damage in the housing2and can reuse the housing2when remanufacturing the treatment tool1. Meanwhile, if the first thermal expansion coefficient of the first housing5(boss51) was high (for example, higher than the second thermal expansion coefficient of the second housing6), the boss51would thermally expand due to the heat transferred from the second housing6in the radially expanding direction in step S1, similar to the boss hole61. This would make it difficult to reduce the contact surface pressure between the boss51and the boss hole61. Fortunately however, the method of remanufacturing the treatment tool1according to the present embodiment heats, in step S1, the second housing6(the press-fitted portion60) having a thermal expansion coefficient higher than that of the first housing5(boss51). Therefore, even when the boss51thermally expands due to the heat transferred from the second housing6, the thermal expansion amount can be suppressed. That is, it is possible to easily decrease the contact surface pressure between the boss51and the boss hole61. In particular, the second thermal conductivity of the second housing6(press-fitted portion60) is higher than the first thermal conductivity of the first housing5(boss51). Therefore, the second housing6can be quickly heated to the target temperature. Furthermore, heat transfer from the second housing6(press-fitted portion60) to the boss51can be suppressed. That is, it is possible to suppress thermal expansion in the radially expanding direction of the boss51. FIG.8is a view corresponding toFIG.7, illustrating another exemplary embodiment. A housing2A (second housing6A) according to the exemplary embodiment shown in inFIG.8is only different from the second housing6of the above-described embodiment shown inFIG.7in that a hole62is formed, as illustrated inFIG.8. As illustrated inFIG.8, the hole62penetrates from the outer surface of the second housing6A to the distal end of the press-fitted portion60. In the present embodiment, the hole62is provided in plurality at positions close to the boss hole61, at positions surrounding the boss hole61. Subsequently, in the present embodiment, in step S1, the operator sends a hot fluid such as hot air from the outer surface of the second housing6A to flow into the hole62, thereby heating the second housing6A (press-fitted portion60). In the present embodiment, the temperature for heating the second housing6A is lower than the heat resistant temperature of the second housing6A, similarly to the above-described embodiment. The present embodiment described above achieves the following effect in addition to effects similar to those of the embodiment described above. In the present embodiment, in step S1, the second housing6A (press-fitted portion60) is heated through the hole62extending from the outer surface of the second housing6A toward the press-fitted portion60. This makes it possible to intensively heat the press-fitted portion60in the second housing6A. That is, it is possible, in executing the step S1, to avoid an adverse effect caused by heating sites of the treatment tool1other than the press-fitted portion60. In the present embodiment, an additional hole may be further provided in the second housing6A to allow the hot fluid flowing into the hole62to flow out of the housing2A. FIG.9is a view corresponding toFIG.7, illustrating another exemplary embodiment. While the second housing6(press-fitted portion60) is heated in step S1in the above-described embodiment, it is also allowable to further perform cooling of the first housing5(boss51). At this time, it is also allowable to form a hole52on the first housing5described in the above-described embodiment, like a housing2B (first housing5B) according to the present embodiment illustrated inFIG.9. As illustrated inFIG.9, the hole52penetrates from the outer surface of the first housing5B to the distal end of the boss51. Subsequently, in the present embodiment, the operator sends, in step S1, a hot fluid such as hot air from the outer surface of the second housing6A to flow into the hole62, thereby heating the second housing6A (press-fitted portion60), similarly to the above-described embodiment shown inFIG.8. At the same time, the operator cools the first housing5B (boss51) by injecting a cooling fluid such as cooling air into the hole52from the outer surface of the first housing5B. Subsequently, the boss hole61radially expands due to thermal expansion. In contrast, the boss51radially shrinks due to contraction accompanying cooling. The present embodiment described above achieves the following effect in addition to effects similar to those of the embodiments illustrated inFIGS.7and8and described above. In the present embodiment, the second housing6A (press-fitted portion60) is heated and the first housing5B (boss51) is cooled in step S1. Subsequently, the boss hole61radially expands due to thermal expansion. Furthermore, the boss51radially shrinks due to contraction accompanying cooling. This makes it possible to effectively decrease the contact surface pressure between the boss51and the boss hole61. Furthermore, in the present embodiment, step S1cools the first housing5B (boss51) through the hole52extending inward from the outer surface of the first housing5B. This makes it possible to intensively cool the site in the first housing5B where the boss51is provided. That is, it is possible, in executing the step S1, to avoid an adverse effect caused by cooling sites of the treatment tool1other than the portion where the boss51is provided. In the present embodiment, an additional hole may be further provided in the second housing6A to allow the hot fluid flowing into the hole62to flow out of the housing2B. Similarly, the first housing5B may be further provided with a hole for allowing the cooling fluid flowing into the hole52to flow out of the housing2B. Furthermore, while step S1in the present embodiment heats the second housing6A (press-fitted portion60) while cooling the first housing5B (boss51), the disclosure is not limited to this. It is also allowable to execute only cooling of the first housing5B (boss51) without heating the second housing6A (press-fitted portion60). FIGS.10and11are views corresponding toFIG.7, illustrating another exemplary embodiment. In the embodiment described above, in step S1, the contact surface pressure between the boss51and the boss hole61is decreased by the thermal expansion of the boss hole61. However, the disclosure is not limited to this, and creep deformation of the boss51may be used to decrease the contact surface pressure. Specifically, the operator heats the first housing5(boss51) to the heat resistant temperature or higher in step S1. This increases the strain rate of creep deformation in the boss51in the radially shrinking direction D2(FIGS.10and11). This decreases the contact surface pressure between the boss51and the boss hole61. At this time, it is also allowable to form a hole63on the second housing6described in the above-described embodiment, like the housing2C (second housing6C) according to the present embodiment illustrated inFIG.10or11. As illustrated inFIG.10or11, the hole63penetrates from the outer surface of the second housing6C to the inner circumferential surface of the boss hole61. More specifically, the hole63extends in a direction orthogonal to the longitudinal direction from the proximal end to the distal end on the boss51while exposing a part of an outer circumferential surface of the boss51to the outside of the housing2C. The hole63may be formed at the proximal end side of the boss51as illustrated inFIG.10or at the distal end side of the boss51as illustrated inFIG.11. Subsequently, in the present embodiment, in step S1, the operator sends a hot fluid such as hot air from the outer surface of the second housing6C to flow into the hole63, thereby heating the boss51. Even in a case where the contact surface pressure between the boss51and the boss hole61is decreased by using the creep deformation of the boss51as in the present embodiment described above, it is possible to achieve an effect similar to that of the above-described embodiment. Furthermore, in the present embodiment, in step S1, the first housing5(boss51) is heated through the hole63extending inward from the outer surface of the second housing6C. This makes it possible to intensively heat the boss51. That is, it is possible, in executing the step S1, to avoid an adverse effect caused by heating sites of the treatment tool1other than the boss51. In the present embodiment, an additional hole may be further provided in the first housing5or the second housing6C to allow the hot fluid flowing into the hole63to flow out of the housing2C. It is also allowable in the present embodiment to decrease the contact surface pressure between the boss51and the boss hole61by using the creep deformation of the boss hole61. That is, in step S1, the second housing6C (press-fitted portion60) is heated to the heat resistant temperature or higher. This increases the strain rate of creep deformation in the boss hole61in the radially expanding direction. This decreases the contact surface pressure between the boss51and the boss hole61. FIGS.12A and12Bare views illustrating another exemplary embodiment. Specifically,FIG.12Acorresponds toFIG.7.FIG.12Bis a cross-sectional view of a boss51D cut by a plane orthogonal to the longitudinal direction from the proximal end to the distal end of the boss51D. A housing2D (first housing5D) according to the present embodiment is only different from the above-described embodiment in that the boss51has a modified configuration, as illustrated inFIGS.12A and12B. Specifically, the boss51D according to the present embodiment includes a boss body53aand an adjusting member (portion or surface portion)53b, as illustrated inFIGS.12A and12B. The boss body53ahas the same shape as the boss51described in the above-described embodiment. As illustrated inFIGS.12A and12B, the adjusting member53bis provided over the entire outer circumferential surface of the boss body51aso as to form an outer circumferential surface of the boss51D. That is, the adjusting member53bcomes in contact with the inner circumferential surface of the boss hole61in a state where the boss51D is press-fitted into the boss hole61. Examples of materials for the adjusting member53binclude resin materials such as polyamide (heat resistant temperature: 80° C. to 140° C.), polymethylmethacrylate (heat resistant temperature: 70° C. to 90° C.), polyethylene, polyvinyl alcohol (heat resistant temperature: 40° C. to 80° C.) In the present embodiment, in step S1, the operator heats the first housing5D (boss51D) to the heat resistant temperature of the adjusting member53bor higher. This increases the strain rate in creep deformation (thermal deformation) in the radially shrinking direction in the adjusting member53b. This decreases the contact surface pressure between the boss51D and the boss hole61. The present embodiment described above achieves the following effect in addition to effects similar to those of the embodiment described above. In the present embodiment, the contact surface pressure between the boss51D and the boss hole61is decreased by using the creep deformation of the adjusting member53b. That is, since there is no need to use the creep deformation of the boss body53a, it is possible to improve the degree of freedom in selecting the material forming portions other than the adjusting member53bin the first housing5D. In the present embodiment, the adjusting member (portion)53bneed not necessarily be formed on the outer circumferential surface of the boss51D, and may be formed on the inner circumferential surface of the boss hole61. In addition, the configuration of the exemplary embodiments described above, such as that illustrated inFIGS.10and11, may be combined with the present embodiment. FIGS.13A to13Care views illustrating another exemplary embodiment. Specifically,FIGS.13A to13Care cross-sectional views of portions of housings2E to2G according to the present embodiment that are joined to each other by bosses51,51E, and51G and the boss holes61and61F, which are respectively cut by a plane orthogonal to the longitudinal direction of the bosses51,51E, and51G. While the above-described embodiment has the boss51formed in a columnar shape and the boss hole61formed in a circular shape in plan view, the disclosure is not limited to this. For example, as illustrated as the housing2E (first housing5E) according to the present embodiment illustrated inFIG.13A, it is allowable to adopt the boss51E having a hexagonal cross section. In addition, for example, as illustrated as the housing2F (second housing6F) according to the present embodiment illustrated inFIG.13B, it is allowable to adopt the boss hole61F having a hexagonal shape in plan view. Furthermore, for example, as illustrated as the housing2G (first housing5G) according to the present embodiment illustrated inFIG.13C, it is allowable to adopt the boss51G having a cross-shaped cross section. The present embodiment described above achieves the following effect in addition to effects similar to those of the embodiment described above. In the present embodiment, a flow channel PA that allows passage of the fluid is provided between the outer circumferential surface of the boss51,51E, or51G and the inner circumferential surface of the boss hole61or61F, extending in the longitudinal direction running from the proximal end to the distal end of the boss51,51E, or51G. Therefore, in step S7, the sterilizing gas flows into the boss hole61or61F through the flow channel PA. That is, the sterilization treatment using the sterilizing gas can be appropriately executed. Furthermore, in the present embodiment, it is possible to reduce the contact area between the outer circumferential surface of the bosses51,51E, or51G and the inner circumferential surface of the boss holes61or61F. This makes it possible, in step S1, to suppress the heat transfer from the second housing6or6F (press-fitted portion60) to the boss51,51E, or51G. That is, it is possible to suppress thermal expansion in the radially expanding direction of the boss51,51E, or51G. In addition, the configurations of the exemplary embodiments described above, such as those illustrated inFIGS.7to12B, may be combined with the present embodiment. Here, when the configuration of the embodiment shown inFIGS.12A and12Bdescribed above is combined with the present embodiment (FIGS.13A-13B), the adjusting member (portion)53bis preferably provided at a site where the outer circumferential surfaces of the bosses51,51E, or51G comes in contact with the boss hole61or61F. FIGS.14A and14Bviews illustrating another exemplary embodiment. Specifically,FIG.14Acorresponds toFIG.7.FIG.14Bis a cross-sectional view of a boss51H cut by a plane orthogonal to the longitudinal direction running from the proximal end to the distal end of the boss51H. A housing2H (first housing5H) according to the present embodiment is only different from the above-described embodiment in that the boss51has a modified configuration, as illustrated inFIGS.14A and14B. Specifically, the boss51H according to the present embodiment includes a boss body54aand an adjusting member (portion)54b, as illustrated inFIGS.14A and14B. A boss body54ahas the same outer shape as the boss51described in the above-described embodiment. Subsequently, as illustrated inFIGS.14A and14B, the boss body54ahas a cutout54cthat extends from the distal end toward the proximal end side of the boss body54ato divide the boss body54ainto two members in the radial direction. The adjusting member54bis embedded in the cutout54c, as illustrated inFIGS.14A and14B. The adjusting member54bcan be formed by employing the material same as the material of the adjusting member53bdescribed above with respect to the embodiment shown inFIGS.12A and12B. In the present embodiment, in step S1, the operator heats the first housing5H (boss51H) to the heat resistant temperature of the adjusting member54bor higher. This increases the strain rate in creep deformation (thermal deformation) in the radially shrinking direction in the adjusting member54b. That is, the boss body54adivided into two members by the cutout54cis inclined in a direction in which the boss body54aapproaches in the radial direction. This decreases the contact surface pressure between the boss51H and the boss hole61. The present embodiment described above achieves the effects similar to those of the embodiments described above, including the embodiments shown inFIGS.7,12A, and12B. In addition, the configuration of the embodiments described above, such as the embodiment illustrated inFIGS.10and11, may be combined with the present embodiment. FIG.15is a view corresponding toFIG.7, illustrating another exemplary embodiment. Although the boss51is integrally formed with the first housing5in the above-described embodiment, the disclosure is not limited to this. As illustrated inFIG.15, a housing2I (first housing5I) according to the present embodiment includes a first housing body55and a boss51I. The first housing body55is different from the first housing5described in the above-described embodiment in that the boss51is omitted and a press-fitting hole56into which the boss51I is press-fitted is formed at the formation position of the boss51. The boss51I is formed of a metal material. That is, the thermal expansion coefficient of the boss51I is lower than that of the first housing body55and the second housing6(press-fitted portion60). Furthermore, the boss51I is press-fitted into the press-fitting hole56. In addition, the boss51I is press-fitted into the boss hole61when the first and second housings5I and6are assembled to each other. Even in a case where the boss51I is provided separately from the first housing body55as in the present embodiment described above, it is possible to achieve an effect similar to that of the above-described embodiment. In addition, the configurations of any of the embodiments described above, such as those shown inFIGS.7to14B, may be combined with the present embodiment. Hereinabove, the aspects of the disclosure has been described, but the disclosure is not limited to the exemplary embodiments described above. The above-described embodiments adopt the treatment tool1as the medical apparatus according to the disclosure. The disclosure is not limited to this, and another medical apparatus may be adopted as the medical apparatus according to the disclosure. While the above-described embodiments have a configuration in which the treatment tool1applies both ultrasound energy and radio-frequency energy to the target site, the disclosure is not limited to this. For example, the treatment tool1may be configured to apply ultrasound energy alone to the target site. Furthermore, the treatment tool1may be configured to apply radio-frequency energy alone to the target site. Furthermore, the treatment tool1may be configured to transfer heat from a heater to the target site to treat the target site. According to the medical apparatus remanufacturing method, it is possible to disassemble the housing without causing a damage in the housing and possible to reuse the housing. Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the disclosure in its broader aspects is not limited to the specific details and representative embodiments shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. | 32,990 |
11858075 | Corresponding reference characters indicate corresponding parts throughout the several views. The exemplifications set out herein illustrate various embodiments of the invention, in one form, and such exemplifications are not to be construed as limiting the scope of the invention in any manner. DETAILED DESCRIPTION Numerous specific details are set forth to provide a thorough understanding of the overall structure, function, manufacture, and use of the embodiments as described in the specification and illustrated in the accompanying drawings. Well-known operations, components, and elements have not been described in detail so as not to obscure the embodiments described in the specification. The reader will understand that the embodiments described and illustrated herein are non-limiting examples, and thus it can be appreciated that the specific structural and functional details disclosed herein may be representative and illustrative. Variations and changes thereto may be made without departing from the scope of the claims. A heat pipe is a hermetically sealed, two-phase heat transfer component used to transfer heat from a primary side (evaporator section) to a secondary side (condenser section).FIG.1, as an example, illustrates a heat pipe100comprising the aforementioned evaporator section102and condenser section106, along with an adiabatic section104extending therebetween. The heat pipe100further includes a working fluid (such as water, liquid potassium, sodium, or alkali metal) and a wick108. In operation, the working fluid is configured to absorb heat in the evaporator section102and vaporize. The saturated vapor, carrying latent heat of vaporization, flows towards the condenser section106through the adiabatic section104. In the condenser section106, the vapor condenses into a liquid pool110and gives off its latent heat. The condensed liquid is then returned to the evaporator section102through the wick108by capillary action. The aforementioned flow path of the working fluid is illustrated by segmented arrows inFIG.1. The phase change processes and two-phase flow circulation continues as long as the temperature gradient between the evaporator and condenser sections is maintained. Due to the very high heat transfer coefficients for boiling and condensation, heat pipes are highly effective thermal conductors. In nuclear systems, heat pipes are utilized by placing the evaporator section of the heat pipe within the reactor core containing nuclear fuel and the condenser section is placed near heat exchangers. The nuclear fuel vaporizes the working fluid and heat exchangers absorb the latent heat at the condenser section. Example heat pipes in nuclear applications are described in U.S. Pat. Nos. 5,684,848, 6,768,781, and U.S. Patent Application Publication No. 2016/0027536, all of which are hereby incorporated by reference herein in their entireties. Another example use for heat pipes in nuclear systems is with micro-reactors, which are nuclear reactors that generate less than 10 MWe and are capable of being deployed for remote applications. These micro-reactors can be packaged in relatively small containers, operate without active involvement of personnel, and operate without refueling/replacement for a longer period than conventional nuclear power plants. One such micro-reactor is the eVinci Micro Reactor system, designed by Westinghouse Electric Company. The eVinci system is a heat pipe cooled reactor power system that utilizes heat pipes to act as passive heat removal devices that efficiently move thermal energy out of the reactor core to heat exchangers. The heat pipes used in the micro-reactors experience extreme operating temperatures (>850° C.) and requires an internal wick that is made from materials that can withstand these temperatures and are compatible with the working fluid. This wick can be constructed from a wire mesh that is rolled and diffusion bonded together into a tube-like structure. The wick tube allows for the working fluid within the heat pipe to pass through it radially (such as after the latent heat is given off and the working fluid is absorbed by the wick) and along its axis (transferring the working fluid back toward the evaporator section with capillary action) while remaining rigid. Manufacturing a wick for insertion into a heat pipe requires a highly complex and detailed process. At a very high level, a wick is manufactured from a piece of wire mesh that is wrapped around a mandrel made from a metal tube and expandable bladder. A hydroforming device is used to mechanically deform and bond the wick together into the desired shape prior to diffusion bonding. Example hydroforming devices are described in U.S. Patent Application Publication Ser. No. 16/853,270 and U.S. Provisional Patent Application No. 63/012,725, which are hereby incorporated by reference in their entireties herein. Once bonded, the wick is diffusion bonded together in an oven at vacuum levels while maintaining the wick in a compressed state, and then removing materials used to hold the wick in the compressed state during diffusion bonding. An example method for wick forming is described in U.S. Pat. No. 3,964,902, which is hereby incorporated by reference in its entirety herein. Currently a method is used to place ends on either side of the wick using a crimp and die process, described in U.S. Provisional Patent Application No. 62/979,822, which is hereby incorporated by reference in its entirety herein. In operation, making 48″ wicks has become a standard practice which can be done with existing equipment. However, moving a 48″ rolled wick into the hydroformer requires multiple people and does not lend itself to full production length of −22′. In view of the foregoing, it would desirable to form full production length wicks, such as 22′ wicks, from wicks made by standard practices (i.e., 48″ wicks), such as by joining wicks axially end to end. This would allow for manufacturing of short wicks and then joining them in a mechanical fashion to create a production length wick. This operation would eliminate the complexities that arise in making 22′ long wicks. Currently a lab grade clean space is required that is longer than the wick. An ultrasonic cleaning trough is required that can hold the wick material prior to forming. For a 48″ wick, the metal mesh is rolled along its short length and placed into the current cleaner. For a 22′ long wick, however, this proves to be difficult to roll in the short axis due to the material being 5.5 times longer. Therefore, the tighter rolled mesh may not be properly cleaned leading to detrimental or failed heat pipe performance. A system and process that connects shorter wicks would allow for production of any length required utilizing the simplicity of shorter wick manufacturing. Currently short wicks can be rolled and hydroformed quickly (under 2 hours). Therefore, multiple short wicks can be manufactured, tested, and quality tested to make the full length wick. In joining two wicks, the seam therebetween must be able to pass a bubble test. The bubble test is an indication of wick performance. Pressure is slowly applied within the wick using inert gas while submerged in deionized water. The higher the pressure that the wick can hold, the better the performance within the heat pipe. This seam must be as pressure resistant as the rest of the wick. Accordingly, the manner in wick the wicks are joined must be low profile such that they do not constrict the flow during operation—gas in the center of the wick and liquid between the outer surface of the wick and the inner surface of the heat pipe tube. Referring now toFIG.2, a method200for forming a wick assembly is provided, according to at least one aspect of the present disclosure. In various embodiments, the method200comprises positioning202an inner ring in a first wick. In one aspect, referring toFIG.3, an inner ring302and a first wick304are provided. The inner ring302defines an outer diameter and the first wick304defines an inner diameter. In some embodiments, the inner diameter of the first wick304is substantially the same as the outer diameter of the inner ring302. Accordingly, insertion of the inner ring302within the first wick304results in a tight friction fit therebetween. In various other embodiments, the outer diameter of the inner ring302can be less than the inner diameter of the first wick304to allow the inner ring302to easily move within the first wick304. In various embodiments, the first wick304and the inner ring302can be made of similar materials. In various other embodiments, the first wick304and the inner ring302can be made of dissimilar materials. In various embodiments, the method200further comprises positioning204the inner ring in a second wick. In one aspect, referring toFIG.5, a second wick306is provided that defines an inner diameter. In some embodiments, the inner diameter of the second wick306is substantially the same as the outer diameter of the inner ring302. Accordingly, insertion of the inner ring302within the second wick306results in a tight friction fit therebetween. In various other embodiments, the outer diameter of the inner ring302can be less than the inner diameter of the second wick306to allow the inner ring302to easily move within the second wick306. In various embodiments, the inner diameter of the second wick306is substantially the same as the inner diameter of the first wick304. In various other embodiments, the inner diameter of the second wick306is different than the inner diameter of the first wick304. In various embodiments, insertion of the inner ring302within the second wick306occurs after the inner ring302has been inserted within the first wick304. In various other embodiments, insertion of the inner ring302within the second wick306occurs at substantially the same time as inserting the inner ring302within the first wick304. In various embodiments, the inner ring302is inserted into the first wick304and the second wick306such that approximately half of the outer surface area of the inner ring302is covered by the first wick304and approximately half of the outer surface area of the inner ring302is covered by the second wick306, as is shown inFIG.4. In various other embodiments, the inner ring302is positioned in one of the wicks304,306more than the other. In one embodiment, the inner ring302is positioned such that 75% of the outer surface area of the inner ring302is covered by the first wick304and the remaining 25% of the outer surface area of the inner ring302is covered by the second wick306. In various embodiments, the inner ring302is made from a 3D printing manufacturing process to allow for any suitable size wick to be made. In one aspect, the 3D printed inner ring comprises a 3D printed stainless steel inner ring that has a porosity similar to one or both of the first wick304and the second wick306. In various embodiments, the method200further includes abutting206an end of the first wick with an end of the second wick. In one aspect, referring toFIG.5, the end305of the first wick304abuts the end307of the second wick such that the inner ring302is entirely covered by the first wick304and the second wick306. In some embodiments, the end305of the first wick defines an edge that is perpendicular to the length of the first wick304and the end307of the second wick306defines an edge that is perpendicular to the length of the second wick306. Accordingly, abutting the ends305,307of the first wick304and the second wick306comprises abutting the perpendicular edges of the first wick304and the second wick306together, resulting in a circumferential seal about the inner ring302. In some embodiments, the end305of the first wick304defines first fingers and the end307of the second wick306defines second fingers. Accordingly, abutting the ends305,307of the first wick304and the second wick306comprises interlacing the first fingers of the first wick304with the second fingers of the second wick306. In various embodiments, the abutting206step is omitted such that a gap is defined between the end305of the first wick304and the end307of the second wick306, leaving a portion of the inner ring302exposed. In various embodiments, the method200further includes positioning208an outer ring about a portion of the first wick and a portion of the second wick. In one aspect, referring toFIG.5, an outer ring308is positioned about a portion of the first wick304and a portion of the second wick306such that the first wick304, the second wick306, and the inner ring302are captured by the outer ring308. In various embodiments, the length of the inner ring302and the length of the outer ring308are identical. In various other embodiments, the length of the inner ring302is greater than the length of the outer ring308. In various embodiments, the length of the outer ring308is greater than the length of the inner ring302. In one aspect, the outer ring308defines inner diameter, the first wick304defines an outer diameter, and the second wick306defines an outer diameter. In various embodiments, the inner diameter of the outer ring308, the outer diameter of the first wick304, and the outer diameter of the second wick306are substantially the same. Accordingly, positioning the outer ring308about the first wick304and the second wick306results in a tight friction fit therebetween. In various other embodiments, the inner diameter of the outer ring308can be greater than the outer diameter of the first wick304and the outer diameter of the second wick306, allowing the outer ring308to easily move along the lengths of the first wick304and the second wick306. In various embodiments, the outer ring308can be positioned about the first wick304and the second wick306such that the first portion of the first wick304and the second portion of the second wick306captured by the outer ring308is identical, as seen inFIG.5. In various other embodiments, the outer ring308can be positioned about the first wick304and the second wick306such that the first portion of the first wick304and the second portion of the second wick306captured by the outer ring is different. In various embodiments, the inner ring302and the outer ring308cooperatively function to define the junction between the first wick304and the second wick306, as explained in more detail below. In various embodiments, the outer ring308is made from a 3D printing manufacturing process to allow for any suitable size wick to be made. In one aspect, the 3D printed outer ring comprises a 3D printed stainless steel outer ring that has a porosity similar to one or both of the first wick304and the second wick306. In various embodiments, the method200further includes positioning210a mandrel within the inner ring. Referring toFIG.6, a mandrel310is provided that is positionable within the inner ring302by driving a head312of the mandrel310through an open end of the first wick304with a bar314extending therefrom. In various other embodiments, the mandrel310can be positioned within the inner ring302by driving the head312of the mandrel310through an open end of the second wick306with the bar314. In various embodiments, the head312of the mandrel310can be comprised of a material that is sufficiently rigid to maintain its shape when the wick assembly is being defined, as explained in more detail below. In one embodiment, the mandrel310can be comprised of stainless steel. In various embodiments, the mandrel310is polished to reduce friction when inserting the head312of the mandrel310into the inner ring302. In various embodiments, the head312of the mandrel310defines an outer diameter that corresponds to the inside diameter of the wick assembly, as described in more detail below. Accordingly, the shape of the head312of the mandrel310defines the final shape of the inner ring302, the first wick304, the second wick306, and the outer ring308, as explained in more detail below. In various embodiments, the head312of the mandrel310defines a circular shape. In various other embodiments, the head312of the mandrel310defines an oval shape, a star shape, a square shape, a rectangular shape, or any other suitable shape for use in a heat pipe, as desired. In various embodiments, the head312of the mandrel310is adjustable such that the head312can be positioned within inner rings302of varying sizes. In one embodiment, the head312of the mandrel310comprises a tube expander that enables the head312of the mandrel310to be varied by size by a user. In some embodiments, the head312of the mandrel310comprises an expandable, or inflatable, head that can transition between an unexpanded state and an expanded state. As the head transitions toward the expanded state, the head can compress the inner ring302against the first wick304and the second wick306. In various embodiments, the method200further includes positioning212a die about the outer ring. In one aspect, referring toFIG.7, a die316is provided that defines an inner diameter that is substantially the same as the outer diameter of the outer ring308. In various other embodiments, the inner diameter of the die316can be greater than the outer diameter of the outer ring308. In various embodiments, the die316can include a first, top clam shell318defining a first recess319and a bottom, second clam shell320defining a second recess321which cooperative function to define the inner diameter of the die316. In some embodiments, the first clam shell318is pivotably coupled to the second clam shell320such that the first clam shell318can pivot between an open configuration and a closed configuration. In the open configuration, the die316can receive the outer ring308, inner ring302, first wick304, and second wick306, within the first recess319or the second recess321. In the closed configuration, the die316can maintain the outer ring308, inner ring302, first wick304, and second wick306within the die316. In some other embodiments, the first clam shell318is separate from the second clam shell320, i.e., not fixedly attached thereto such that the first clam shell318is translatable independent of the second clam shell320. In one aspect, in the closed configuration, the first recess319and the second recess321define a shape that is identical to the shape of the head312of the mandrel310. Accordingly the first recess319, the second recess321, and the head312of the mandrel310cooperate to define the final shape of the wick assembly. In various embodiments, the method200further includes applying214a force to the die to form the wick assembly. In one aspect, applying a force, such as a compressive force F, to the die316swags the outer ring308into the inner ring302and compresses the first wick304and the second wick306therebetween, crimping the outer ring308, inner ring302, the first wick304, and the second wick306together, forming the wick assembly. The head312of the mandrel310applies a repulsive force against the compressive force F to define the final shape of the junction of the wick assembly. In one aspect, the head312of the mandrel310ensures that an even amount of compression is applied by the die316. In various other embodiments, the method200does not include positioning212a die about the outer ring and applying214a force to the force to form the wick assembly. Rather, as discussed above, the mandrel can include an expandable, or inflatable, head that can transition toward an expanded state to apply a force to the inner ring. In such embodiments, the expandable, or inflatable, head applies a sufficient force to form with wick assembly with the inner ring302, the first wick304, and the second wick306. In various other embodiments, the method can collectively include the positioning212and force applying214steps, while also applying the force to the inner ring302with the expandable, or inflatable, head. Accordingly, the die and expandable, or inflatable, head can cooperatively apply forces to the inner ring302, first wick304, and second wick304to form the wick assembly. After the compressive force F is applied by the die316to the wick assembly, the wick assembly can be removed from the die316and the mandrel310can be withdrawn out of the wick assembly. Through prototyping, the inventor discovered that the outer ring308has a certain amount of spring back after compression, which enables the mandrel310to be slide out of the wick assembly after compression. The aforementioned method200can then be repeated as many times as necessary to continue to add additional wicks to the wick assembly and increase the final length thereof. As referenced above, full production length wicks are 22′. According, in one embodiment, the foregoing method200can be performed five times using 48″ wicks and then once more using a 24″ wick to build a 22′ wick that includes five junction points. Once the final length of the wick assembly has been achieved using the foregoing method, the wick assembly can be diffusion bonded using any suitable diffusion bonding method to fuse the first wick304, the second wick306, the inner ring302, and the outer ring308at each junction point together. The fused wick assembly can be then be positioned within a heat pipe. In various embodiments, the first wick304and the second wick306have identical characteristics to one another, such as length, material, porosity, diameter, or any other suitable characteristic associated with wicks as described elsewhere herein. In various other embodiments, the first wick304and the second wick306have at least one differing characteristic from one another. Accordingly, the foregoing method200enables to user to create wick assemblies that have varying characteristics along the length thereof. For instance, in some embodiments, the first wick304includes a first porosity and the second wick306includes a second porosity different than the first porosity. Accordingly, a wick assembly can be creating using the first wick304and the second wick306such that the wick assembly has a varying porosity along the axis of the wick assembly, and therefore, a varying porosity along the axis of the heat pipe. In various embodiments, the inner ring302and the outer ring308extend linearly such that adjacent wicks are joined together to form a linearly-extending wick assembly. In various other embodiments, the inner ring302and the outer ring308can extend radially such that the adjacent wicks are joined together to form a radially-extending wick assembly. Accordingly, the foregoing method200enables a user to produce a wick assembly that can be positioned in a curved heat pipe as opposed to a straight extending heat pipe. Various aspects of the subject matter described herein are set out in the following examples. Example 1—A method of forming a wick assembly, the method comprising positioning an inner ring in a first wick, positioning the inner ring in a second wick, abutting an end of the first wick with an end of the second wick, positioning an outer ring about a portion of the first wick and a portion of the second wick, positioning a mandrel within the inner ring, positioning a die about the outer ring, and applying a force to the die, wherein the force couples the outer ring, the inner ring, the first wick, and the second wick together to form the wick assembly. Example 2—The method of Example 1, further comprising removing the mandrel from the wick assembly. Example 3—The method of Examples 1 or 2, further comprising removing the die from the wick assembly. Example 4—The method of Example 3, further comprising diffusion bonding the wick assembly. Example 5—The method of any one of Examples 1-4, further comprising defining a first edge at the end of the first wick, wherein the first edge is perpendicular to the length of the first wick and defining a second edge at the end of the second wick, wherein the second edge is perpendicular to the length of the second wick, wherein abutting the end of the first wick with the end of the second wick comprises abutting the first edge at the end of the first wick with the second edge at the end of the second wick. Example 6—The method of any one of Examples 1-4, further comprising defining first fingers at the end of the first wick and defining second fingers at the end of the second wick, wherein abutting the end of the first wick with the end of the second wick comprises interlacing the first fingers with the second fingers. Example 7—A method of preparing a heat pipe, the method comprising forming a wick assembly, diffusion bonding the wick assembly, and positioning the diffusion bonded wick assembly in the heat pipe. Forming the wick assembly comprises positioning an inner ring in a first wick, positioning the inner ring in a second wick, positioning an outer ring about a portion of the first wick and a portion of the second wick, positioning a die about the outer ring, and applying a force to the die, wherein the force couples the outer ring, the inner ring, the first wick, and the second wick together to form the wick assembly. Example 8—The method of Example 7, further comprising positioning a mandrel within inner ring prior to applying the force to the die. Example 9—The method of Example 8, further comprising removing the mandrel from the wick assembly after applying the force to the die. Example 10—The method of any one of Examples 7-9, wherein forming the wick assembly further comprises abutting an end of the first wick with an end of the second wick. Example 11—The method of Example 10, further comprising defining a first edge at the end of the first wick, wherein the first edge is perpendicular to the length of the first wick and defining a second edge at the end of the second wick, wherein the second edge is perpendicular to the length of the second wick, wherein abutting the end of the first wick with the end of the second wick comprises abutting the first edge at the end of the first wick with the second edge at the end of the second wick. Example 12—The method of Example 10, further comprising defining first fingers at the end of the first wick and defining second fingers at the end of the second wick, wherein abutting the end of the first wick with the end of the second wick comprises interlacing the first fingers with the second fingers. Example 13—A method of forming a wick assembly, the method comprising positioning an inner ring in a first wick comprising a first characteristic, positioning the inner ring in a second wick comprising a second characteristic, wherein the second characteristic is different than the first characteristic, abutting an end of the first wick with an end of the second wick, positioning an outer ring about a portion of the first wick and a portion of the second wick, positioning a mandrel within the inner ring, positioning a die about the outer ring, and applying a force to the die, wherein the force couples the outer ring, the inner ring, the first wick, and the second wick together to form the wick assembly. Example 14—The method of Example 13, wherein the first characteristic comprises a material of the first wick and the second characteristic comprises a material of the second wick. Example 15—The method of Examples 13 or 14, wherein the first characteristic comprises a length of the first wick and the second characteristic comprises a length of the second wick. Example 16—The method of any one of Examples 13-15, wherein the first characteristic comprises a porosity of the first wick and the second characteristic comprises a porosity of the second wick. Example 17—The method of any one of Examples 13-16, further comprising removing the die from the wick assembly. Example 18—The method of Example 17, further comprising diffusion bonding the wick assembly. Example 19—The method of any one of Examples 13-18, further comprising defining a first edge at the end of the first wick, wherein the first edge is perpendicular to the length of the first wick and defining a second edge at the end of the second wick, wherein the second edge is perpendicular to the length of the second wick, wherein abutting the end of the first wick with the end of the second wick comprises abutting the first edge at the end of the first wick with the second edge at the end of the second wick. Example 20—The method of any one of Examples 13-18, further comprising defining first fingers at the end of the first wick and defining second fingers at the end of the second wick, wherein abutting the end of the first wick with the end of the second wick comprises interlacing the first fingers with the second fingers. One or more components may be referred to herein as “configured to,” “configurable to,” “operable/operative to,” “adapted/adaptable,” “able to,” “conformable/conformed to,” etc. Those skilled in the art will recognize that “configured to” can generally encompass active-state components and/or inactive-state components and/or standby-state components, unless context requires otherwise. Those skilled in the art will recognize that, in general, terms used herein, and especially in the appended claims (e.g., bodies of the appended claims) are generally intended as “open” terms (e.g., the term “including” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “includes” should be interpreted as “includes but is not limited to,” etc.). It will be further understood by those within the art that if a specific number of an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation no such intent is present. For example, as an aid to understanding, the following appended claims may contain usage of the introductory phrases “at least one” and “one or more” to introduce claim recitations. However, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim recitation to claims containing only one such recitation, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an” (e.g., “a” and/or “an” should typically be interpreted to mean “at least one” or “one or more”); the same holds true for the use of definite articles used to introduce claim recitations. In addition, even if a specific number of an introduced claim recitation is explicitly recited, those skilled in the art will recognize that such recitation should typically be interpreted to mean at least the recited number (e.g., the bare recitation of “two recitations,” without other modifiers, typically means at least two recitations, or two or more recitations). Furthermore, in those instances where a convention analogous to “at least one of A, B, and C, etc.” is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., “a system having at least one of A, B, and C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). In those instances where a convention analogous to “at least one of A, B, or C, etc.” is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., “a system having at least one of A, B, or C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). It will be further understood by those within the art that typically a disjunctive word and/or phrase presenting two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms unless context dictates otherwise. For example, the phrase “A or B” will be typically understood to include the possibilities of “A” or “B” or “A and B.” With respect to the appended claims, those skilled in the art will appreciate that recited operations therein may generally be performed in any order. Also, although various operational flow diagrams are presented in a sequence(s), it should be understood that the various operations may be performed in other orders than those which are illustrated, or may be performed concurrently. Examples of such alternate orderings may include overlapping, interleaved, interrupted, reordered, incremental, preparatory, supplemental, simultaneous, reverse, or other variant orderings, unless context dictates otherwise. Furthermore, terms like “responsive to,” “related to,” or other past-tense adjectives are generally not intended to exclude such variants, unless context dictates otherwise. It is worthy to note that any reference to “one aspect,” “an aspect,” “an exemplification,” “one exemplification,” and the like means that a particular feature, structure, or characteristic described in connection with the aspect is included in at least one aspect. Thus, appearances of the phrases “in one aspect,” “in an aspect,” “in an exemplification,” and “in one exemplification” in various places throughout the specification are not necessarily all referring to the same aspect. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more aspects. Any patent application, patent, non-patent publication, or other disclosure material referred to in this specification and/or listed in any Application Data Sheet is incorporated by reference herein, to the extent that the incorporated materials is not inconsistent herewith. As such, and to the extent necessary, the disclosure as explicitly set forth herein supersedes any conflicting material incorporated herein by reference. Any material, or portion thereof, that is said to be incorporated by reference herein, but which conflicts with existing definitions, statements, or other disclosure material set forth herein will only be incorporated to the extent that no conflict arises between that incorporated material and the existing disclosure material. The terms “comprise” (and any form of comprise, such as “comprises” and “comprising”), “have” (and any form of have, such as “has” and “having”), “include” (and any form of include, such as “includes” and “including”) and “contain” (and any form of contain, such as “contains” and “containing”) are open-ended linking verbs. As a result, a system that “comprises,” “has,” “includes” or “contains” one or more elements possesses those one or more elements, but is not limited to possessing only those one or more elements. Likewise, an element of a system, device, or apparatus that “comprises,” “has,” “includes” or “contains” one or more features possesses those one or more features, but is not limited to possessing only those one or more features. The term “substantially”, “about”, or “approximately” as used in the present disclosure, unless otherwise specified, means an acceptable error for a particular value as determined by one of ordinary skill in the art, which depends in part on how the value is measured or determined. In certain embodiments, the term “substantially”, “about”, or “approximately” means within 1, 2, 3, or 4 standard deviations. In certain embodiments, the term “substantially”, “about”, or “approximately” means within 50%, 20%, 15%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, 0.5%, or 0.05% of a given value or range. In summary, numerous benefits have been described which result from employing the concepts described herein. The foregoing description of the one or more forms has been presented for purposes of illustration and description. It is not intended to be exhaustive or limiting to the precise form disclosed. Modifications or variations are possible in light of the above teachings. The one or more forms were chosen and described in order to illustrate principles and practical application to thereby enable one of ordinary skill in the art to utilize the various forms and with various modifications as are suited to the particular use contemplated. It is intended that the claims submitted herewith define the overall scope. | 36,454 |
11858076 | The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. DETAILED DESCRIPTION The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features. Hereinafter, a fastening apparatus and a method of operating the fastening apparatus according to some forms of the present disclosure will be described with reference to drawings. FIG.1is a perspective view illustrating an entire structure of a fastening apparatus according to one form of the present disclosure, andFIG.2is a perspective view illustrating structures fastening tools, a first movement mechanism, and a second movement mechanism of the fastening apparatus according to some forms of the present disclosure.FIG.3is a perspective view illustrating an example of the structure of the first movement mechanism of the fastening apparatus according to another form of the present disclosure, andFIG.4is a perspective view illustrating an example of the structure of the second movement mechanism of the fastening apparatus according to one form of the present disclosure. As illustrated inFIGS.1and2, a fastening apparatus10may include a plurality of fastening tools100. For example, the plurality of fastening tools100may be a plurality of nut runners.FIGS.1and2illustrate that the eight fastening tools100are provided on the fastening apparatus10. However, the number of fastening tools100is not limited thereto. According to the present disclosure, the fastening apparatus10may move in a vertical direction and a horizontal direction. In more detail, referring toFIGS.3and4, the fastening apparatus10may include first movement mechanisms200configured to rotate the fastening tools100in a circumferential direction “A”, second movement mechanisms300configured to rectilinearly move the fastening tools100in a radial direction “B”, and a third movement mechanism400configured to rectilinearly move the fastening tools100in a vertical direction (i.e., an upward/downward direction). Referring toFIG.3, the first movement mechanism200may include a closed-curve guide unit210that has a closed-curve shape and provides a route along which the fastening tool100(seeFIG.2) rotates in the circumferential direction A. As illustrated inFIGS.2and3, the closed-curve guide unit210may have a circular shape. In this case, a gear portion210amay be provided at one side of the closed-curve guide unit210, and a pinion gear220may engage with the gear portion210a. Therefore, when the pinion gear220rotates, the pinion gear220may move in the circumferential direction A along the closed-curve guide unit210by means of the engagement between the gear portion210aand the pinion gear220. In this case, the fastening tool100may be connected to a lower portion of the first movement mechanism200. In this case, when the pinion gear220rotates, the fastening tool100may also rotate in the circumferential direction A along the closed-curve guide unit210. Meanwhile,FIG.3illustrates that the gear portion210ais provided on a radial outer surface of the closed-curve guide unit210and the pinion gear220is also provided to face the radial outer surface of the closed-curve guide unit210. However, instead, the gear portion210amay be provided on a radial inner surface of the closed-curve guide unit210, and the pinion gear220may also be provided to face the radial inner surface of the closed-curve guide unit210. Meanwhile, the first movement mechanism200may further include a first power unit230configured to provide power to rotate the pinion gear220. Meanwhile, a rotational speed of the first power unit230may be relatively higher than a rotational speed required for the pinion gear220. In this case, the rotational speed needs to be reduced before the power of the first power unit230is transmitted to the pinion gear220. To this end, a speed reducer (not illustrated) may be provided in a power transmission path between the first power unit230and the pinion gear220. In particular, according to the present disclosure, the speed reducer may be provided in the pinion gear220. That is, the pinion gear220and the speed reducer may have an integrated structure. This is advantageous because a separate space for providing the pinion gear220is not additionally required. Meanwhile, the plurality of first movement mechanisms200may be provided, and the number of first movement mechanisms200may be equal to the number of fastening tools100. Therefore, the plurality of first movement mechanisms200and the plurality of fastening tools100may correspond to one another in a one-to-one manner. In this case, the movements of the plurality of fastening tools100in the circumferential direction A may be individually performed. Meanwhile, according to the present disclosure, the plurality of closed-curve guide units210may be provided. In more particularly, the plurality of closed-curve guide units210may have a concentric structure having the same central axis.FIG.2illustrates that the two closed-curve guide units210each having a circular shape are disposed to have the concentric structure, one side of the fastening tool100is coupled to one of the two closed-curve guide units210which has a large outer diameter, and the other side of the fastening tool100is coupled to the other of the two closed-curve guide units210which has a small outer diameter. According to the present disclosure, it is possible to solve a problem of deformation of the first movement mechanism200including the closed-curve guide units210caused by weights of the fastening tools100or loads applied to the fastening tools100while the fastening tools100move in the circumferential direction A. In particular, as described below, according to the present disclosure, the fastening tool100may be moved in the circumferential direction A by force applied by a person during a teaching process of the fastening apparatus10. If the single closed-curve guide unit210is provided, there may occur a problem in that the closed-curve guide unit210is distorted during the teaching process of the fastening apparatus10. However, according to the present disclosure, the plurality of closed-curve guide units210having the concentric structure may be coupled to the fastening tools100, respectively, such that overall rigidity of the closed-curve guide units210may be improved, thereby solving the problem of deformation of the first movement mechanism200. Meanwhile, referring toFIG.4, the second movement mechanism300may include a screw unit310extending in the radial direction B and configured to rotate so that the fastening tool100(seeFIG.2) rectilinearly moves in the radial direction B. In this case, the screw unit310may have a screw structure, and a horizontal movement unit320engages with the screw structure. Therefore, when the screw unit310rotates about a central axis of the screw unit310, the horizontal movement unit320engaging with the screw structure may rectilinearly move in the radial direction B. In this case, the fastening tool100may be connected to one side of the second movement mechanism300. In more detail, the fastening tool100may be coupled to one side of the horizontal movement unit320. In this case, as the screw unit310rotates, the fastening tool100may also rectilinearly move in the radial direction B along with the horizontal movement unit320. Meanwhile, the second movement mechanism300may further include a second power unit330configured to provide power to rotate the screw unit310. Meanwhile, the plurality of second movement mechanisms300may be provided, and the number of second movement mechanisms300may be equal to the number of fastening tools100. Therefore, the plurality of second movement mechanisms300and the plurality of fastening tools100may correspond to one another in a one-to-one manner. Therefore, the movements of the plurality of fastening tools100in the radial direction B may also be performed individually. Next, referring toFIG.4, the second movement mechanism300may further include a horizontal guide unit340coupled to the horizontal movement unit320in order to define a route along which the fastening tool100(seeFIG.2) rectilinearly moves in the radial direction B. That is, the horizontal guide unit340is configured to define a predetermined route so that the horizontal movement unit320may rectilinearly moves along the predetermined route when the horizontal movement unit320is rectilinearly moved by the rotation of the screw unit310. Therefore, as illustrated inFIG.4, a direction in which the horizontal guide unit340extends may be in parallel with a direction in which the screw unit310extends. In this case, according to the present disclosure, the plurality of horizontal movement units320and the plurality of horizontal guide units340may be provided, and the horizontal movement units320may be coupled to the plurality of horizontal guide units340, respectively.FIG.4illustrates that the two horizontal guide units340are provided in a row in the radial direction B and provided such that one end portion of the horizontal guide unit provided outside in the radial direction B and one end portion of the horizontal guide unit provided inside in the radial direction B meet together, and the horizontal movement units320are coupled to the two horizontal guide units340, respectively. According to the present disclosure, it is possible to solve a problem of deformation of the second movement mechanism300including the horizontal guide units340caused by weights of the fastening tools100or loads applied to the fastening tools100while the fastening tools100move in the radial direction A. In particular, as described below, according to the present disclosure, the fastening tool100may be moved in the radial direction B by force applied by a person during the teaching process of the fastening apparatus10. If the single horizontal guide unit340and the single horizontal movement unit320are provided, there may occur a problem in that the horizontal guide unit340is distorted during the teaching process of the fastening apparatus10. However, according to the present disclosure, the plurality of horizontal guide units340is provided in a row in the radial direction B, and the plurality of horizontal movement units320coupled to the plurality of horizontal guide units340may be coupled to the fastening tools100, respectively, such that the overall rigidity of the horizontal guide units340may be improved, thereby solving the problem of deformation of the second movement mechanism300. Meanwhile, as illustrated inFIG.4, the plurality of horizontal guide units340are provided in a row in the radial direction B, a stepped portion D may be provided in a region in which the plurality of horizontal guide units340meets together. Meanwhile, referring toFIG.1, the third movement mechanism400may include a vertical guide unit410extending in a vertical direction C and configured to define a route along which the fastening tool100rectilinearly moves in the vertical direction C. In this case, a vertical movement unit420may be provided at one side of the vertical guide unit410, and the vertical movement unit420may move in the vertical direction C along the vertical guide unit410. In this case, the fastening tools100may be connected to one side of the third movement mechanism400. In this case, as the vertical movement unit420rectilinearly moves in the vertical direction C along the vertical guide unit410, the plurality of fastening tools100may also rectilinearly move in the vertical direction C. Meanwhile, unlike the first movement mechanisms200and the second movement mechanisms300, the single third movement mechanism400may be provided. In more detail, the single third movement mechanism400may simultaneously move the plurality of fastening tools100in the vertical direction C. For example, the third movement mechanism400may include a connection body unit430connected to the vertical movement unit420and configured to fix the plurality of fastening tools100. When the connection body unit430moves along with the movement of the vertical movement unit420, the plurality of fastening tools100may also rectilinearly move simultaneously in the vertical direction C. Meanwhile, according to the present disclosure, the fastening apparatus10or the fastening tools100may be moved by force applied by a person during the teaching process of the fastening apparatus10. In more detail, with the force applied by the person, the fastening apparatus10may be moved in the vertical direction C along the vertical guide unit410, and the plurality of fastening tools100may be moved in the circumferential direction A along the closed-curve guide units210, respectively, and moved in the radial direction B along the horizontal guide units340, respectively. In this case, a magnitude of external force (i.e., the force applied by the person) required to move each of the fastening tools100in the circumferential direction A or the radial direction B may be 40 N to 60 N. For example, the configuration in which the external force required to move the fastening tool100in the circumferential direction A or the radial direction B is 50 N may mean that a minimum value of the external force required to move the fastening tool100in the circumferential direction A or the radial direction B is 50 N. If the external force required to move the fastening tool100in the circumferential direction A or the radial direction B is lower than 40 N, the fastening tool100may be moved by external impact or the like against a user's intention. In contrast, if the external force required to move the fastening tool100in the circumferential direction A or the radial direction B is higher than 60 N, an operating force applied by the person may be significantly low during the teaching process of the fastening apparatus10. Meanwhile, as illustrated inFIG.1, the fastening apparatus10may further include a display500configured to display visual information in order to enable the person to control the operations of the fastening apparatus10or the fastening tools100and store information on the positions of the fastening tools100. Hereinafter, a method of operating the fastening apparatus according to the present disclosure will be described. The method of operating the fastening apparatus according to the present disclosure may include a fastening apparatus preparing step of preparing the fastening apparatus10including the n fastening tool100. For example, the fastening apparatus10may include the eight fastening tools100. In addition, the method of operating the fastening apparatus according to the present disclosure may include a first workpiece disposing step of disposing a first workpiece including m fastening holes at one side of the fastening apparatus10. In this case, according to the present disclosure, m may be larger than n. For example, the first workpiece may include a total of twenty-two fastening holes. Meanwhile, the method of operating the fastening apparatus according to the present disclosure may further include a first fastening tool disposing step of disposing each of the n fastening tools100above any one of the m fastening holes. For example, when the eight fastening tools and the twenty-two fastening holes are provided, the eight fastening tools100may be disposed above the eight fastening holes among the twenty-two fastening holes, respectively, in the first fastening tool disposing step. In addition, the method of operating the fastening apparatus according to the present disclosure may further include a first storage step of storing, in a control unit, positions of the n fastening tools100disposed in the above-mentioned first fastening tool disposing step. For example, when the eight fastening tools and the twenty-two fastening holes are provided, the positions of the eight fastening tools100disposed in the first fastening tool disposing step may be stored in the control unit in the first storage step. The information on the positions of the fastening tools100stored in the first storage step may be loaded in the following fastening operation step using the fastening tools, and the fastening tools100may move to the portions above the fastening holes on the basis of the loaded information. Therefore, after the information is stored, the fastening operation of the fastening apparatus may be automatically performed on the fastening holes. As described above, m may be larger than n. That is, the number of fastening holes provided in the first workpiece may be larger than the number of fastening tools100provided in the fastening apparatus10. Therefore, in a case in which the first fastening tool disposing step and the first storage step are performed only once, the fastening operations of the fastening tools100cannot be performed, in the fastening operation step later, on the fastening holes above which the fastening tools100are not disposed in the first fastening tool disposing step, among the plurality of fastening holes provided in the first workpiece. Therefore, according to the present disclosure, the plurality of first fastening tool disposing steps and the plurality of first storage steps may be alternately performed. In more detail, the first fastening tool disposing steps and the first storage steps may be performed [m/n]+1 times, respectively. In this case, [m/n] means a maximum integer that does not exceed m/n. For example, when the eight fastening tools and the twenty-two fastening holes are provided, the first fastening tool disposing steps and the first storage steps may be alternately performed [22/8]+1 times, that is, three times, respectively. In this case, in the first fastening tool disposing step which is performed second or subsequently, the fastening tools100may be disposed above the fastening holes above which the fastening tools100have not been disposed in the first fastening tool disposing step which has been performed first among the plurality of first fastening tool disposing steps. Further, in the first storage step which is performed second or subsequently, the information on the positions of the fastening tools100may be stored. As a result, in the later fastening operation step, the fastening operation may be automatically performed on all the fastening holes provided in the first workpiece. Meanwhile, according to the present disclosure, in the first fastening tool disposing step, the fastening apparatus10including the fastening tools100may be moved primarily in the vertical direction, and then the fastening tools100of the fastening apparatus10may be moved in the horizontal direction. In this case, the primary movement of the fastening apparatus10in the vertical direction may be performed by the third movement mechanism400(seeFIG.1), and the movements of the fastening apparatus10in the horizontal direction may be performed by the first movement mechanisms200(seeFIG.3) and the second movement mechanisms300(seeFIG.4). Therefore, in the first fastening tool disposing step, the n fastening tools100may be simultaneously moved in the vertical direction primarily. In contrast, in the first fastening tool disposing step, the n fastening tools100may be sequentially moved in the horizontal direction. In more detail, the movements of the plurality of fastening tools100in the circumferential direction A and the movements of the plurality of fastening tools100in the radial direction B may be independently performed by the first movement mechanisms200and the second movement mechanisms300, respectively. In this case, according to the exemplary form of the present disclosure, in the first fastening tool disposing step, the fastening tool100may be moved in the circumferential direction A, and then moved in the radial direction B. However, on the contrary, according to another exemplary form of the present disclosure, in the first fastening tool disposing step, the fastening tool100may be moved in the radial direction B, and then moved in the circumferential direction A. Meanwhile, the method of operating the fastening apparatus according to the present disclosure may further include after the first storage step, a second workpiece disposing step of disposing a second workpiece including p fastening holes at one side of the fastening apparatus10, a second fastening tool disposing step of disposing each of the n fastening tools100above any one of the p fastening holes, and a second storage step of storing, in the control unit, positions of the n fastening tools100in the second fastening tool disposing step. In this case, p may be larger than n. In addition, according to the present disclosure, in a case in which the first workpiece and the second workpiece are workpieces identical in type to each other, the information stored in the control unit in the first storage step may be removed from the control unit after the second storage step. That is, in the case in which the first workpiece and the second workpiece are the workpieces identical in type to each other, the information stored in the control unit in the first storage step may be replaced with the information stored in the control unit in the second storage step. Therefore, according to the present disclosure, when it is desired to change the information, which has been previously stored in the control unit in respect to the positions of the fastening holes formed in the workpiece, to new information, the second fastening tool disposing steps and the second storage steps are alternately performed, thereby easily changing the information on the positions of the fastening holes formed in the workpiece. Therefore, it is possible to shorten the time it takes to perform the teaching process of the fastening apparatus10for performing the fastening operation. In contrast, according to the present disclosure, in a case in which the first workpiece and the second workpiece are workpieces different in type from each other, the information stored in the control unit in the first storage step and the information stored in the control unit in the second storage step may coexist in the control unit after the second storage step. Therefore, according to the present disclosure, the information on positions of fastening holes of various types of workpieces may be stored in the control unit, it is possible to perform the fastening operations on various types of workpieces using the single fastening apparatus. In particular, the fastening apparatus according to the present disclosure may independently perform not only the movement in the vertical direction, but also the movement in the circumferential direction and the movement in the radial direction, and as a result, the fastening apparatus may effectively perform the fastening operations on various types of workpieces. Meanwhile, according to the present disclosure, the first fastening tool disposing step may further include moving the fastening tool100of the fastening apparatus10in the horizontal direction and then secondarily moving the fastening apparatus10in the vertical direction. Therefore, the first fastening tool disposing step may sequentially include (i) primarily moving the fastening apparatus10in the vertical direction, (ii) moving the fastening tool100in the horizontal direction, and (iii) secondarily moving the fastening apparatus10in the vertical direction. In more detail, the step (iii) may be the step of secondarily moving the fastening apparatus10in the vertically downward direction. In addition, the step (i) may be the step of primarily moving the fastening apparatus10in the vertical direction so that the fastening tool100of the fastening apparatus10and the fastening hole provided in the first workpiece are spaced apart from each other at a predetermined interval, and the step (iii) may be the step of secondarily moving the fastening apparatus10later in the vertically downward direction so that the fastening tool100of the fastening apparatus10is adjacent to the fastening hole to the extent that the fastening tool100may perform the fastening operation on the fastening hole provided in the first workpiece. For example, in the step (i), the vertical interval between the fastening tool100and the fastening hole may be about 5 mm. Meanwhile, the contents described regarding the first fastening tool disposing step may also be equally applied to the second fastening tool disposing step. That is, according to the present disclosure, the second fastening tool disposing step may sequentially include (i) primarily moving the fastening apparatus10in the vertical direction, (ii) moving the fastening tool100in the horizontal direction, and (iii) secondarily moving the fastening apparatus10in the vertical direction. In more detail, the step (iii) may be the step of secondarily moving the fastening apparatus10in the vertically downward direction. In addition, the step (i) may be the step of primarily moving the fastening apparatus10in the vertical direction so that the fastening tool100of the fastening apparatus10and the fastening hole provided in the second workpiece are spaced apart from each other at a predetermined interval, and the step (iii) may be the step of secondarily moving the fastening apparatus10later in the vertically downward direction so that the fastening tool100of the fastening apparatus10is adjacent to the fastening hole to the extent that the fastening tool100may perform the fastening operation on the fastening hole provided in the first workpiece. For example, in the step (i), the vertical interval between the fastening tool100and the fastening hole may be about 5 mm. Meanwhile, the method of operating the fastening apparatus according to the present disclosure may further include after the first storage step, a fastening performing step of performing the fastening operation on the m fastening holes provided in the first workpiece by loading the information stored in the control unit in the first storage step, using the n fastening tools100, and using fasteners such as nuts. In more detail, in the fastening performing step, the fastening apparatus10or the fastening tool100may be moved on the basis of the information stored in the first storage step in respect to the positions of the fastening holes, and then the fastening operation may be performed on the fastening hole by each of the fastening tools100. In this case, since the number of fastening holes is larger than the number of fastening tools as described above, the process of moving the fastening tools100to the fastening holes, on which the fastening operations have not been performed, may be additionally required after the first fastening operations of the fastening tools100are performed on the fastening holes. In this case, according to the present disclosure, in the fastening performing step, when each of the n fastening tools100performs the fastening operation on any one of the m fastening holes provided in the first workpiece and then moves to another fastening hole, the movement time it takes for one of the n fastening tools to move may be equal to the movement time it takes for the other fastening tools to move. In this case, it is possible to remove difference in movement time between the fastening tools in accordance with movement distances of the fastening tools when the fastening tools move to other fastening holes after performing the fastening operation on some fastening holes. As a result, it is possible to minimize the time it takes to perform the fastening operation. For example, the movement time may be one second. FIG.5is a perspective view illustrating an example of the display provided on the control unit of the fastening apparatus according to the present disclosure. A process of manipulating the display in accordance with the method of operating the fastening apparatus according to the present disclosure will be described below with reference toFIG.5. According to the present disclosure, the first workpiece is selected, and then the type of the first workpiece is selected in ‘TYPE SELECTION’ on the display. In this case, in a case in which the type of the first workpiece is a type already stored in the control unit, for example, in a case in which the first workpiece is a new U oil pan, ‘NEW U OIL PAN’ is selected on the display. In contrast, in a case in which the type of the first workpiece is a type which is not stored in the control unit, a blank box is selected in ‘TYPE SELECTION. Hereinafter, the case in which the first workpiece is the ‘new U oil pan’ will be mainly described. After the type of the first workpiece is selected in ‘TYPE SELECTION’ and the first workpiece is disposed at one side of the fastening apparatus, each of the plurality of fastening tools is positioned above any one of the plurality of fastening holes. In this case, the movement of the fastening tool may be performed as a user selects each column positioned below ‘STORE TARGET’ inFIG.5and then directly inputs coordinates of the position, or the movement of the fastening tool may be performed as a person applies force directly to the fastening tool. In particular, the movement of the fastening apparatus in the vertical direction may be performed by adjusting the time for which ‘Z JOG +’ or ‘Z JOG −’ is pushed on the display illustrated inFIG.5. Thereafter, ‘ENTER DATA’ is selected to store the current position of the fastening tool, that is, the position of the fastening hole to be fastened later during the fastening process. In this case, the current position of the fastening tool may be stored after ‘#1’ is selected on the display. In this case, ‘#1’ means the fastening holes which constitute a ‘first group’ among the fastening holes of the first workpiece. Since the number of fastening holes is larger than the number of fastening tools as described above, the process of storing the positions of the fastening holes of the first workpiece needs to be performed several times. Therefore, afterwards, the plurality of fastening tools is moved so that the plurality of fastening tools is positioned above the fastening holes above which the fastening tools have not been positioned in the previous step, among the plurality of fastening holes. Further, ‘ENTER DATE’ is selected again to store the current position of the fastening tool, that is, the position of the fastening hole to be fastened later during the fastening process. In this case, the current position of the fastening tool may be stored after ‘#2’ is selected on the display. In this case, ‘#2’ means the fastening holes which constitute a ‘second group’ among the fastening holes of the second workpiece. The above-mentioned storage processes may be repeated in accordance with the number of fastening holes. For example, in the case in which the number of fastening tools is eight and the number of fastening holes is twenty-two, the above-mentioned processes may be repeated until ‘#3’ is selected and the current position of the fastening tool is stored. In addition, in a case in which the number of fastening tools is eight and even ‘#5’ may be selected as illustrated inFIG.5, the positions of the fastening tool with respect to a total of forty fastening holes may be stored in the control unit. The present disclosure has been described with reference to the limited exemplary forms and the drawings, but the present disclosure is not limited thereto. The described exemplary forms may be carried out in various forms by those skilled in the art to which the present disclosure pertains within the technical spirit of the present disclosure. | 31,913 |
11858077 | DETAILED DESCRIPTION The following detailed description is merely exemplary in nature and is not intended to limit the application and uses. Furthermore, there is no intention to be bound by any expressed or implied theory presented in the preceding technical field, background, brief summary or the following detailed description. FIG.1represents a cross-sectional view of a handheld alignment tool100configured for use in aligning components of planetary gear sets during assembly of the planetary gear sets. The alignment tool100includes a body110having a first end122, a second end124oppositely disposed the first end122. Interior surfaces126of the body110define a cavity within the body110between the first end122and the second end124. An opening in the first end122of the body110provided access to the cavity therein. In this example, the body110is configured as a handle configured to be gripped by a user. However, in various examples a separate handle may be fixed relative to the body110. An elongated pin112extends outwardly from the first end122of the body110. The pin112includes a distal end120that defines a tip of the pin112and a proximal end121opposite the distal end120that is located adjacent to or within the body110. The tip may have various shapes, such as, but not limited to, a rounded shape as represented in the figures. The proximal end121of the pin112is in a fixed relationship with and/or fixed directly to a sliding member114. The sliding member114is located and retained within the cavity of the body110and configured to slide within the cavity between the first end122and the second end124of the body110. A biasing member118is located within the cavity of the body110and configured to apply a biasing force on the sliding member114in a direction from the second end124of the body110toward the first end122of the body110along the longitudinal axis130of the pin112. The biasing member118may include, for example, a preloaded spring. Since the sliding member114is located between the pin112and the biasing member118and in contact therewith, forces applied to the sliding member114are transferred between the biasing member118and the pin112. Specifically, the biasing force is applied from the biasing member118to the pin112through the sliding member114, and any forces applied to the tip of the pin112are applied to the biasing member118through the sliding member114. Notably, with this arrangement, the pin112is configured to retract into the body110in response to a force being applied to the tip in a direction along a longitudinal axis130of the pin112in a direction from the distal end120towards the proximal end121thereof, that is, opposite the direction of and greater in magnitude of the biasing force. FIG.1represents the alignment tool100in an initial state, wherein the pin112is fully extended from the body110. In this initial state, the biasing force applied by the biasing member118causes the sliding member114to be located in a furthest position within the cavity toward the first end122of the body110. Application of sufficient force to the tip of the pin112that is in excess of the biasing force causes the biasing member118to compress, the sliding member114to slide in a direction toward the second end124of the body110, and at least a portion of the pin112to retract within the cavity (FIG.4). If the force on the tip of the pin112is released or reduced to a magnitude that is less than the magnitude of the biasing force, than the biasing member118will expand, the sliding member114will slide in a direction toward the first end122of the body110, and at least a portion of the pin112will extend from the cavity. In some examples, the alignment tool100includes one or more markings configured to promote ease of use of the tool, especially for monitoring the pin112for retract into the cavity. In some examples, a portion or an entirety of the body110is sufficiently transparent such that the sliding member114and/or the retracted portions of the pin112within the cavity are viewable from an exterior of the body110. Alternatively, or in addition to the above, alignment tool100may include at least one marking on the elongated pin112that may be observed to note retraction of the pin112. For example,FIGS.3and4represent a first marking132located on a transparent portion of the body110and a second marking134located on exterior surfaces of the pin112. The markings may indicate various relevant parameters. In various examples, the marking(s) may be indicative of contact between the tip of the pin112and another article. In various examples, the marking(s) may be indicative of application of a force to the tip of the elongated pin112that is in excess of a predetermined threshold force. In various examples, the alignment tool100may be configured to reduce the likelihood of damaging articles contacted with the tip thereof. In such examples, the predetermined threshold force may be indicative of a minimum force likely to damage such articles. Alternatively, the alignment tool100may be configured such that the biasing force is less than the predetermined threshold force likely to damage the articles upon contact by the tip therewith while the elongated pin112is fully retracted. In such examples, the pin112could fully retract into the body110prior to achieving the predetermined threshold force. In various examples, the alignment tool100may include a stopper member116configured to limit insertion of the pin112. The stopper member116may have various structures. In some examples, the stopper member116is configured to physically contact a portion of differential to limit insertion of the pin112. In the example ofFIGS.1-4, the stopper member116is fixed to the first end122of the body110. The stopper member116includes a hole and the pin112extends through the hole such that the stopper member116surrounds a portion of the pin112. As represented inFIG.3, a distal end128of the stopper member116contacts a surface of a differential subsequent to the pin112fully passing the components to be aligned and prior to the distal end120of the pin112contacting a surface of the differential located past the components to be aligned. As noted previously, the alignment tool100is configured for use in aligning components of planetary gear sets during manual assembly thereof.FIGS.2-4illustrate use of the alignment tool100for assembling certain components of a planetary gear set of a differential for a vehicle. Further, inFIG.5a flowchart provides a method300for assembling the planetary gear set using the alignment tool100in accordance with exemplary examples. As can be appreciated in light of the disclosure, use of the alignment tool100is not limited to the specific application represented inFIGS.2-4, and the alignment tool100may be used for assembling planetary gear sets for a variety of systems and may have various structures and components. In addition, the order of operation within the method300is not limited to the sequential execution as illustrated inFIG.5, but may be performed in one or more varying orders as applicable and in accordance with the present disclosure. Once fully assembled, the differential includes a housing210. An end214of the housing210functions as a carrier for a planetary gear set. Specifically, the end214of the housing210rotatably supports a set of pinion gears216supported on pins217secured to the housing210. A ring gear220and a sun gear (not shown) are intermeshed with the pinion gears216. A plurality of washers226,228are located between the pinion gears216and the end214. The ring gear220surrounds the pinion gears216and is connected for common rotation with a stationary element230, such as a housing of a transmission of a vehicle. The sun gear may be connected to an input or output shaft. During assembly, the individual pinion gears216are arranged in an assembly215with the plurality of washers226,228and inserted into the housing210in their respective locations. Once in their respective locations, the alignment tool100may be used to ensure the pinion gears216and the plurality of washers226,228are properly aligned, as described in more detail below. After completion of the alignment, the pinion gears216may be each secured with the aforementioned pins. Although the assembly215is represented in this example as include a total of four washers, two in the first set of washers226and two in the second set of washers228, it should be understood that the first set of washers26and the second set of washers228may include fewer or more washers, such as one washer, three washers, four washers, etc., and that such washers may have identical or different structures. As such, the method300may start at310. At312, the method300may include providing the differential in a partially assembled state, that is, without the pinion gears216installed in the housing210. For convenience, each of the pinion gears216will be referred to as having a first end, a second end, and a bore extending between the first end and the second end. At314, the method300may include providing an assembly of a first of the pinion gears216, a plurality of pinion needle rollers227within the bore of the pinion gears216, and at least a first set of the plurality of washers226adjacent to the first end of the first pinion gear216and at least a second set of the plurality of washers228adjacent to the second end of the first pinion gear216. The plurality of washers226,228each include holes that, while arranged in the aforementioned assembly, are preferably aligned with bore of the first pinion gear216. At316, the method300may include inserting the assembly into the cavity of the housing210such that the bore of the first pinion gear216(having the pinion needle rollers227arranged in a tubular pattern along inner surfaces of the bore), the holes of the first set of washers226, and the holes of the second set of washers226all align with a mounting hole232of the housing210. At318, the method300may include inserting the pin112of the alignment tool100through the mounting hole232, through the holes of the first set of washers226, into the bore of the first pinion gear216between the pinion needle rollers227, and through the holes of the second set of washers228. During insertion of the pin112, the pin112is configured to align the first set of washers226, the first pinion gear216, the pinion needle rollers227, and the second set of washers228to a tolerance sufficient for operation of the planetary gear set upon completion of the assembly thereof. To this end, the tip of the pin112may be rounded (as shown) or otherwise configured to promote lateral movement of any of the first set of washers226, the first pinion gear216, the pinion needle rollers227, and the second set of washers228that may be offset from proper alignment. The diameter of the pin112is sized to match the inner diameters of the first set of washers228, the bore of the first pinion gear216with the pinion needle rollers227therein, and/or the second set of washers228at least to an extent necessary to provide the desired alignment tolerance. However, if any one of the first set of washers226, the first pinion gear216, the pinion needle rollers227, and the second set of washers228are offset to an extent that insertion of the pin112is impeded, the pin112is configured to retract into the body110upon application of a sufficient force applied by the user. At320, the method300may include determining whether the pin112retracts into the body110during insertion of the pin112. In various examples, determining retraction of the pin112may be performed by visually monitoring for retraction of the pin112into the body110of the alignment tool100via a transparent portion of the body110. In such examples, the retraction of the pin112may be compared to the first marking132located on the transparent portion of the body110. In various examples, determining retraction of the pin112may be performed by observing the second marking134located on the pin112, for example, relative to another portion of the alignment tool100. If the pin112retracts at all or retracts by predetermined dimension, the method300may include, at322, removing the pin112from the mounting hole232and rearranging the first set of washers226, the first pinion gear216, the pinion needle rollers227, and the second set of washers228to realign the bore of the first pinion gear216with the pinion needle rollers227therein and the holes of the first set of washers226and the second set of washers228. Thereafter, steps318and320may be repeated until proper alignment has been achieved. In various examples, the method300may include continuing to insert the pin112of the alignment tool100through the mounting hole232and into the bore of the first pinion gear216until contact occurs between an exterior surface of the housing210and the stopper member116of the alignment tool100. If, at320, the pin112does not retract at all or does not retract by the predetermined dimension, the method300may include, at324, removing the pin112from the mounting hole232and completing the assembly of the differential. The method300may end at326. The alignment tool100and the method300provide various benefits over certain existing systems and methods. For example, assembly of planetary gear sets with fixed tools (i.e., that do not retract) may cause unintended forces to be applied to misaligned components, such as one or more of the pinion gears216, the pinion needle rollers227, the first set of washers226, or the second set of washers228. The alignment tool100provides the capability of aligning components without application of unintended forces thereto by ensuring that the pin112retracts relative to the body110in response to contact by the distal end120with a surface. As such, the alignment tool100and the method300effectuate an improvement in the technical field of planetary gear set assembly. While at least one exemplary embodiment has been presented in the foregoing detailed description, it should be appreciated that a vast number of variations exist. It should also be appreciated that the exemplary embodiment or exemplary embodiments are only examples, and are not intended to limit the scope, applicability, or configuration of the disclosure in any way. Rather, the foregoing detailed description will provide those skilled in the art with a convenient road map for implementing the exemplary embodiment or exemplary embodiments. It should be understood that various changes can be made in the function and arrangement of elements without departing from the scope of the disclosure as set forth in the appended claims and the legal equivalents thereof. | 14,701 |
11858078 | DETAILED DESCRIPTION The present disclosure can be understood more readily by reference to the following detailed description, examples, drawings, and claims, and the previous and following description. However, before the present devices, systems, and/or methods are disclosed and described, it is to be understood that this disclosure is not limited to the specific devices, systems, and/or methods disclosed unless otherwise specified, and, as such, can, of course, vary. It is also to be understood that the terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting. The following description is provided as an enabling teaching of the present devices, systems, and/or methods in its best, currently known aspect. To this end, those skilled in the relevant art will recognize and appreciate that many changes can be made to the various aspects of the present devices, systems, and/or methods described herein, while still obtaining the beneficial results of the present disclosure. It will also be apparent that some of the desired benefits of the present disclosure can be obtained by selecting some of the features of the present disclosure without utilizing other features. Accordingly, those who work in the art will recognize that many modifications and adaptations to the present disclosure are possible and can even be desirable in certain circumstances and are a part of the present disclosure. Thus, the following description is provided as illustrative of the principles of the present disclosure and not in limitation thereof. As used throughout, the singular forms “a,” “an” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “an element” can include two or more such elements unless the context indicates otherwise. Ranges can be expressed herein as from “about” one particular value, and/or to “about” another particular value. When such a range is expressed, another aspect includes from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent “about,” it will be understood that the particular value forms another aspect. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint. For purposes of the current disclosure, a material property or dimension measuring about X or substantially X on a particular measurement scale measures within a range between X plus an industry-standard upper tolerance for the specified measurement and X minus an industry-standard lower tolerance for the specified measurement. Because tolerances can vary between different materials, processes and between different models, the tolerance for a particular measurement of a particular component can fall within a range of tolerances. As used herein, the terms “optional” or “optionally” mean that the subsequently described event or circumstance can or cannot occur, and that the description includes instances where said event or circumstance occurs and instances where it does not. The word “or” as used herein means any one member of a particular list and also includes any combination of members of that list. Further, one should note that conditional language, such as, among others, “can,” “could,” “might,” or “may,” unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain aspects include, while other aspects do not include, certain features, elements and/or steps. Thus, such conditional language is not generally intended to imply that features, elements and/or steps are in any way required for one or more particular aspects or that one or more particular aspects necessarily include logic for deciding, with or without user input or prompting, whether these features, elements and/or steps are included or are to be performed in any particular aspect. Disclosed are components that can be used to perform the disclosed methods and systems. These and other components are disclosed herein, and it is understood that when combinations, subsets, interactions, groups, etc. of these components are disclosed that while specific reference of each various individual and collective combinations and permutations of these may not be explicitly disclosed, each is specifically contemplated and described herein, for all methods and systems. This applies to all aspects of this application including, but not limited to, steps in disclosed methods. Thus, if there are a variety of additional steps that can be performed it is understood that each of these additional steps can be performed with any specific aspect or combination of aspects of the disclosed methods. Disclosed in the present application is a disk stack repair insert for a disk stack and associated methods, systems, devices, and various apparatus. Example aspects of the disk stack can comprise a plurality of replacement disk segments arranged in series and at least one pin extending through the plurality of replacement disk segments. It would be understood by one of skill in the art that the disclosed disk stack repair insert is described in but a few exemplary aspects among many. No particular terminology or description should be considered limiting on the disclosure or the scope of any claims issuing therefrom. FIG.1Aillustrates a first aspect of a disk stack100according to the present disclosure. According to example aspects, the disk stack100can be utilized within a fluid system. For example, the disk stack100can be coupled with a valve (not shown) and can be configured reduce the pressure of a fluid (e.g., a gas such as steam, a liquid such as water, etc.) as it flows through fluid passageways175formed in the disk stack100, as described in further detail below. As shown, the disk stack100can comprise a plurality of original disks110stacked in series to define a substantially cylindrical structure. For example, the original disks110can be stacked in a substantially vertical arrangement, relative to the orientation shown. In some aspects, each of the original disks110can joined to adjacent original disks110by a brazing process, for example. Brazing can comprise inserting a filler material between a pair of adjacent original disks110and allowing the filler material to cool therebetween, coupling the adjacent original disks110together. In other aspects, however, adjacent original disks110can be coupled together by any other suitable fasteners, such as, for example, welding, bolts, screws, or the like. Furthermore, the disk stack100can comprise a plurality of fastener openings130configured to receive fasteners (not shown) for coupling the disk stack100to the valve or other element of the fluid system. Example aspects of the disk stack100can define a top end132(e.g., a plugged end102) and a bottom end134(e.g., an inlet end104), relative to the orientation shown, and can define a height H1. In the present aspect, the disk stack100can comprise a top disk cap140positioned at the top end132thereof, which can define a substantially smooth upper disk cap surface142. Furthermore, the disk stack100can comprise a bottom disk cap144positioned at the bottom end134thereof, which can define a substantially smooth lower disk cap surface (not shown). The plurality of original disks110can be stacked between the top disk cap140and bottom disk cap144, as shown. According to example aspects, each of the original disks110can be substantially flat and can define an upper disk surface212(shown inFIG.2) and a lower disk surface214(shown inFIG.2). Each of the original disks110can further define a substantially circular outer edge116and a substantially circular inner edge118. In example aspects, the inner edges118of the original disks110can each define an original disk bore120formed through the original disk110. As such, when the original disks110are arranged in series, as shown, the plurality of original disk bores120can define an elongated vertical disk stack inner bore150formed through a center of the disk stack100from the top end132to the bottom end134, such that the top end132can define an open top end132and the bottom end134can define an open bottom end134. As shown, a disk stack axis152can extend centrally through the disk stack inner bore150. In some aspects, the original disk bores120of the original disks110can be formed therethrough before the original disks110are assembled together to define the disk stack100. However, in other aspects, the original disks110may not comprise the original disk bores120when joined together to define the disk stack100, and the disk stack inner bore150of the disk stack100can be drilled through the assembled original disks110of the disk stack100. According to example aspects, the circular inner edges118of the original disks110can define an inner surface160of the disk stack100, as shown. The inner surface160can be substantially cylindrical in shape and can define an inner diameter D1and an inner circumference of the disk stack100. Furthermore, the circular outer edges116of the original disks110can define an outer surface170of the disk stack100, as shown. The outer surface170can be substantially cylindrical in shape and can define an outer diameter D2that can be greater than the inner diameter D1of the disk stack100and an outer circumference that can be greater than the inner circumference of the disk stack100. Furthermore, according to various example aspects, the original disks110can be formed from a metal material, such as, for example, stainless steel. In other aspects, the original disks110can comprise any other suitably durable material known in the art, including, but not limited to, an Inconel® alloy, such as Inconel® 718, Inconel® 625, or Inconel® 440. According to example aspects, grooves165(shown inFIG.1B) can be machined into each of the original disks110, which, when the original disks110are stacked as shown, can define the fluid passageways175in the disk stack100. For example, in the present aspect, the grooves165can define a first groove pattern620(shown inFIG.6) formed on the upper disk surface212of each of the original disks110and a second groove pattern720(shown inFIG.7) formed on the lower disk surface214of each of the original disks110. According to various example aspects, the first and second groove patterns620,720can be formed on the corresponding original disks110by electrical discharge machining (EDM); however, in other aspects, the grooves165can be formed by any other suitable type of machining, including, but not limited to, milling, casting, additive manufacturing (i.e., 3D printing), and the like. The original disks100can be stacked such that the upper disk surface212of each original disk110abuts the lower disk surface214of an adjacent original disk110. As such, each of the first groove patterns620can be configured to abut an adjacent second groove pattern720to define one or more of the fluid passageways175therebetween. In the present aspect, a plurality of fluid passageways175can be formed between adjacent pairs of original disks110. Each of the fluid passageways175can extend from the inner surface160of the disk stack100to the outer surface170of the disk stack100and can define one or more bends and/or turns, such as, for example, a series of 90° turns. According to example aspects, fluid can enter the disk stack inner bore150through the inlet end104of the disk stack100. The fluid can then flow into the fluid passageways175at passageway inlet openings176formed at the inner surface160of the disk stack100and can flow out of the fluid passageways175at passageway outlet openings178at the outer surface170of the disk stack100. In one example aspect of a fluid passageway175, a first groove of the first groove pattern620of a first original disk110acan define the passageway inlet opening176of the fluid passageway175. Fluid can flow into the first groove of the first original disk110aand can be guided around a turn or bend into a second groove of the second groove pattern720of an adjacent second original disk110b. The fluid can then be guided around another turn or bend into a third groove of the first groove pattern620of the first original disk110a, and so on, until the fluid exits the fluid passageway175through the corresponding passageway outlet opening178. As the fluid is dispersed into the fluid passageways175and moves through series of turns defined therein, the velocity and pressure of the fluid can be reduced, as described in further detail below. Referring toFIG.1B, a valve assembly180comprising the disk stack100can have the disk stack100mounted therein, such that one end of the disk stack100, such as the inlet end104(e.g., the bottom end134), faces an inlet184of the valve assembly180. The other end of the disk stack100, such as the plugged end102(e.g., the top end132), can be, in some aspects, plugged with a movable plug190that can move through the disk stack inner bore150to control fluid flow from the inlet184of the valve assembly into the disk stack100to the fluid passageways175by selectively covering and uncovering the passageway inlet openings176of the fluid passageways175as the plug190moves within the disk stack inner bore150. Fluid can then exit the fluid passageways175through the passageway outlet openings178formed at the outer surface170of the disk stack100to an outlet182of the valve assembly180. As the fluid moves through the fluid passageways175from the disk stack inner bore150to the outer surface170, both the fluid and its energy can be dissipated such that an exit pressure of the fluid upon exiting the disk stack100can be less than an entrance pressure of the fluid upon entering the disk stack100. For example, in one aspect, fluid can enter the disk stack100at an entrance pressure of about 3000 psi and can exit the disk stack100at an exit pressure between about 250 and 300 psi. The lower pressure fluid exiting the disk stack100can then be suitable for use in lower pressure applications, thereby protecting downstream valves and other fluid system infrastructure. In other aspects, fluid can enter the disk stack100at another entrance pressure and can exit at another exit pressure, provided the exit pressure is less than the entrance pressure. In other example aspects, the grooves165and fluid passageways175may be alternatively formed. For example, in a first alternate aspect, some or all of the fluid passageways175may defined in a single original disk110, as opposed to being defined between a pair of the adjacent original disks110, as shown in the present aspect. In other aspects, some or all of the fluid passageways175can vary in shape and/or length. Furthermore, the number of fluid passageways175formed in the disk stack100can vary, and the number of fluid passageways175may even vary between the original disks110. In still other aspects, not all of the original disks110of the disk stack100define the grooves165fluid passageways175. As such, it can be seen that the configuration of fluid passageways can be varied in different aspects of the disk stack100to provide the desired reduction in velocity and pressure of fluid flowing therethrough. In some instances, the high entrance pressure of the fluid upon entering the disk stack100can undesirably damage the disk stack100. For example,FIG.2illustrates the disk stack100comprising a damaged region220caused by high-pressure and high-temperature fluid. As shown, the damaged region220can define a defect230, such as a hole232, extending from the inner surface160of the disk stack100to the outer surface170(shown inFIG.1A). The original disks110damaged by the defect230can be considered affected disks240. In example aspects, the defect230can mar the grooves165formed in the original disks110, and thus can interrupt the fluid passageways175and can reduce the effectiveness of the disk stack100at decreasing the pressure of the fluid traveling therethrough, such as by blocking some of the fluid passageways175. In other aspects, the defect230may not extend fully through the disk stack100from the inner surface160to the outer surface170, but can still damage the grooves165formed in the original disks110and interrupt the fluid passageways175formed by the grooves165. As such, the disk stack100must be repaired or replaced to continue effective operation. FIG.3illustrates an example method for removing the damaged region220from the disk stack100so that the disk stack100can be repaired. The damaged region220can be removed from the disk stack100by first cutting around the damaged region220and then removing the material within the cut. For example, as shown, in one aspect, the cut can be formed by a tool310, such as, for example, a drill312. In other aspects, the cut can be formed by any other suitable cutting methods. In the present aspect, the tool310can engage the disk stack100at the outer surface170thereof and can cut fully through the disk stack100to the inner surface160(shown inFIG.1A). The tool310can then be moved around a periphery of the damaged region220to drill an encircling cut320entirely around the hole232or other defect230. For example, the tool310can be manually moved by a human operator or can be automatically moved by a machine, or can be operated in any other suitable fashion. As such, the affected disks240can comprise any original disk110damaged by the defect230and/or that is cut by the drill312. The encircling cut320can define a removable section330of the disk stack100comprising the entire damaged region220, which can be removed from the disk stack100. For example, the removable section330can be removed manually, by a machine, or in any other suitable fashion. In some aspects, a clearance can be provided between the hole232or other defect230and the encircling cut320to ensure that the entire defect230, including damage that may not be visible, is encompassed within the removable section330. In one aspect, damage that may not be visible can include, for example, weakened areas of the disk stack100surrounding the defect230. For example, in a particular aspect wherein the hole232or other defect230can generally define a length of about 4 inches, the removable section330can define a length of about 8 inches, providing a clearance of about 2 inches on either side of the hole232. As shown inFIG.4, an insert opening410can be formed in the disk stack100where the removable section330(shown inFIG.3) has been removed. Example aspects of the insert opening410can be defined by a pair of opposing boundary sidewalls412, an upper boundary wall414, and a lower boundary wall416, as shown. According to example aspects, the affected disks240can terminate at the boundary sidewalls412. Optionally, as shown in the present aspect, the encircling cut320(shown inFIG.3) can be made such that the boundary sidewalls412are solid and do not intersect any of the grooves165(shown inFIG.1B) formed in the affected disks240. As shown, in the present aspect, the upper boundary wall414can be formed by the top disk cap140. Moreover, in the present aspect, the lower boundary wall416can be formed by the upper disk surface212(shown inFIG.2) of an uppermost one of the original disks110c. As such, the lower boundary wall416can define the first groove pattern620(shown inFIG.6). According to example aspects, the insert opening410can be configured to receive a disk stack repair insert800(shown inFIG.8) therein to repair the disk stack100and restore the fluid passageways175of the affected disks240to their original configuration, as will be described in further detail below. In some aspects, as shown, the boundary wall(s)412can define a substantially smooth surface, which can allow for easy insertion of the disk stack repair insert800into the insert opening410and sealing of disk stack repair insert800with the disk stack100, as will also be described in further detail below. In some aspects, the size (e.g., length, width, etc.) of the insert opening410can be a function of the size of the disk stack100. For example, in the present aspect, the length of the insert opening410can be about ⅓ of the length of the disk stack100. That is to say, an arc length of the insert opening410at the inner surface160of the disk stack100can be about ⅓ of the inner circumference of the disk stack100. Furthermore, an arc length of the insert opening410at the outer surface170of the disk stack100can be about ⅓ of the outer circumference of the disk stack100. Moreover, in the present aspect, a height H2of the insert opening410can be about ⅙ of the height H1(shown inFIG.1A) of the disk stack100. For example, in one aspect, the disk stack100can comprise thirty six original disks110, six of which can be affected disks240. The height H2of the insert opening410can span the six affected disks240. As such, aspects wherein the size of the insert opening410is a function of the size of the disk stack100can make it easy to determine the size the disk stack repair insert800needed to fit seamlessly within the insert opening410. However, in other aspects, the size of the insert opening410may not be a function of the size of the disk stack100, and the dimensions of the insert opening410can simply be measured to determine the size of the disk stack repair insert800needed. FIG.5illustrates an example aspect of a replacement disk, for example, a primary replacement disk510. Similar to the original disks110(shown inFIG.1A), example aspects of the primary replacement disk510can define a lower replacement disk surface714(shown inFIG.7) and an upper replacement disk surface512. The primary replacement disk510can further define a substantially circular cross-sectional shape and a replacement disk bore516formed through a center thereof. In example aspects, the primary replacement disk510can be formed from a metal material, such as, for example, stainless steel. However, in other aspects, the primary replacement disk510can be formed from any other suitably durable material. Furthermore, in some aspects, the primary replacement disk510can be formed from the same material as the original disks110of the disk stack100(shown inFIG.1A), while in other aspects, the primary replacement disk510can be formed from a different material. As shown, example aspects of the primary replacement disk510can define a primary replacement disk outer diameter D4and a primary replacement disk outer circumference that can be larger than the outer diameter D2and outer circumference of the disk stack100, respectively. The primary replacement disk510can also define a primary replacement disk inner diameter D3and a primary replacement disk inner circumference that can be smaller than the inner diameter D1and inner circumference of the disk stack100, respectively. In other aspects however, the primary replacement disk inner and outer diameters D3,D4and circumference can be about equal to the inner and outer diameters D1,D2and circumference of the disk stack100, respectively. As shown inFIG.6, the grooves165can be machined into the primary replacement disk510in the same manner that the grooves165were machined into the original disks110(shown inFIG.1A), for example, by electrical discharge machining. For example, in the present aspect, the first groove pattern620can be machined into the upper replacement disk surface512and the second groove pattern720(shown inFIG.7) can be machined into the lower replacement disk surface714(shown inFIG.7). As such, the grooves165formed in the primary replacement disk(s)510can match the grooves165formed in the original disks110of the disk stack100(shown inFIG.1A). That is to say, in the present aspect, the first groove pattern620formed in the upper replacement disk surface512of the primary replacement disk510can match the first groove pattern620formed in the upper disk surface212(shown inFIG.2) of each original disk110, and the second groove pattern720formed in the lower replacement disk surface714of the primary replacement disk510can match the second groove pattern720formed in the lower disk surface214(shown inFIG.2) of each original disk110. In other aspects, the primary replacement disk510can define any other suitable groove pattern, and may or may not be configured to match the grooves165formed in the original disks110. Furthermore, as shown, the primary replacement disk510can be sectioned into a plurality of primary replacement disk segments612. For example, in the present aspect, because the length of the insert opening410(shown inFIG.4) in the disk stack100is about ⅓ the length of the disk stack100, the primary replacement disk510can be sectioned into thirds, i.e., into three primary replacement disk segments612. As such, each of the primary replacement disk segments612can be dimensioned lengthwise to fit seamlessly within the insert opening410, as will be described in further detail below. However, in other aspects, the primary replacement disk510can be sectioned into more or fewer primary replacement disk segments612as needed, depending upon the size of the insert opening410within which the primary replacement disk segments612will be received. According to the present aspect, the three primary replacement disk segments612can be configured to fix three of the affected disks240(shown inFIG.2). Moreover, the primary replacement disk510can be sectioned into the primary replacement disk segments612at locations that do not intersect the grooves165formed in the primary replacement disk510. As such, as shown, a pair of opposing edges614a,bof each of the primary replacement disk segments612can be configured such that they are solid and do not intersect the grooves165formed therein. That is to say, the first groove pattern620formed in the upper replacement disk surface512and the second groove pattern720(shown inFIG.7) formed in the lower replacement disk surface714(shown inFIG.7) of each of the primary replacement disk segments612do not intersect with, and therefore are not interrupted by, the opposing edges614a,bof the corresponding primary replacement disk segment612. Furthermore, as described above, the boundary sidewalls412(shown inFIG.4) of the insert opening410(shown inFIG.4) can be configured such that they do not intersect any of the grooves165formed in the affected disks240(shown inFIG.2). This configuration can eliminate the difficulty of having to align grooves165at the edges614a,bof the replacement disks612with grooves165at the boundary sidewalls412. In other aspects, however, there may not be a primary replacement disk510that is sectioned into the primary replacement disk segments612; rather, each of the primary replacement disk segments612can be formed independently from one another by any suitable manufacturing process, including, but not limited to, casting, 3D printing, and the like. Moreover, according to example aspects, one or more alignment holes630can be formed through each of the three primary replacement disk segments612, as shown. For example, in the present aspect, each of the primary replacement disk segments612can comprise five alignment holes630a—e equally spaced apart generally along an arcuate centerline640of the corresponding primary replacement disk segment612. However, other aspects of the primary replacement disk segments612can define more or fewer alignment holes630therethrough. Furthermore, in other aspects, some or all of the alignment holes630may not be oriented at the arcuate centerline640of the corresponding primary replacement disk segment612and/or may not be equally spaced. Referring toFIG.7, as shown, a secondary replacement disk710can also be provided. The secondary replacement disk710can be substantially similar to the primary replacement disk510, defining the first groove pattern620(shown inFIG.6) on the upper replacement disk surface512thereof and defining the second groove pattern720on the lower replacement disk surface714thereof. As such, the grooves165of the secondary replacement disk710can match the grooves165of each original disk110. As shown, the secondary replacement disk710can be sectioned into three secondary replacement disk segments712, and each of the secondary replacement disk segments712can define the alignment holes630arranged in the same manner as the alignment holes630of the primary replacement disk segments612. The plurality of primary replacement disk segments612and secondary replacement disk segments712can be stacked in series and joined together to form the disk stack repair insert800(shown inFIG.8). According to example aspects, the primary replacement disk segments612and secondary replacement disk segments712can be stacked in the same arrangement as the original disks110of the disk stack100, wherein each of the upper replacement disk surfaces512defining the first groove pattern620can abut a lower replacement disk surface714defining the second groove pattern720of an adjacent primary or secondary replacement disk segment612,712. As such, in this configuration, the stacking arrangement of the disk stack repair insert800(shown inFIG.8) can be configured to correspond with the stacking arrangement of the disk stack100(shown inFIG.1A), and the fluid passageways175can be defined between the adjacent pairs of replacement disk segments612,712as described above. In the present aspect, the three primary replacement disk segments612can be stacked together first, followed by the three secondary replacement disk segments712. In other aspects, the primary and secondary replacement disk segments can be stacked together in any other suitable configuration. Furthermore, as many replacement disk segments as needed can be stacked together to replicate the removable section330(shown inFIG.3) that has been removed from the disk stack100, such that the resulting disk stack repair insert800can fit seamlessly within the insert opening410(shown inFIG.4). According to example aspects, when stacked in configuration described above, the alignment holes630of each primary and secondary replacement disk segment612,712can align with the corresponding alignment holes630of the other primary and secondary replacement disk segments612,712. For example, all of the alignment holes630acan be in alignment, all of the alignment holes630bcan be in alignment, and so on. Moreover, according to example aspects, an alignment pin730can be received through each set of corresponding alignment holes630to properly orient the primary and secondary replacement disk segments612,712in the stacked configuration. In some aspects, the alignment pins730can be inserted through the corresponding alignment holes630as the primary and secondary replacement disk segments612,712are being stacked, as shown. However, in other aspects, the alignment pins730can be inserted through the corresponding alignment holes630after the primary and secondary replacement disk segments612,712are oriented in the stacked configuration. According to example aspects, the alignment holes630can be positioned on the replacement disk segments612,712between the grooves165to avoid interruption of the fluid passageways175formed therebetween and to ensure continuous contact of the replacement disk segments612,712with the alignment pins730. FIG.8illustrates the assembled disk stack repair insert800. Once that primary and secondary replacement disk segments612,712, along with any other replacement disk segments needed, have been stacked to replicate the removable section330(shown inFIG.3), each of the primary and secondary replacement disk segments612,712can be coupled to the adjacent primary and secondary replacement disk segments612,712to secure the primary and secondary replacement disk segments612,712in the stacked configuration. For example, the primary and secondary replacement disk segments612,712segments can be joined together by welding820, as shown, or by any other suitable fastener, including mechanical fasteners, such as bolts, screws, and the like. Moreover, in example aspects, as shown, some or all of the primary and/or secondary replacement disk segments612,712can be coupled to the alignment pins730passing through the corresponding alignment holes630. For example, as shown in the present aspect, the primary and secondary replacement disk segments712can be coupled to the alignment pins730by welding830, or any other suitable fastener. When the primary and secondary replacement disk segments612,712are stacked together and secured in the stacked orientation, the primary and secondary replacement disk segments612,712can together define the disk stack repair insert800. According to example aspects, the disk stack repair insert800can define an arcuate inner insert surface802and an arcuate outer insert surface804, as shown. Fluid can be configured to flow through the fluid passageways175(shown inFIG.1) formed between the adjacent replacement disk segments612,712from the inner insert surface802of disk stack repair insert800to the outer insert surface804. FIG.9illustrates the disk stack repair insert800partially inserted into the insert opening410of the disk stack100. According to example aspects, the size and shape of the disk stack repair insert800can be substantially similar to the size and shape of the removable section330(shown inFIG.3), such that the disk stack repair insert800can fit snugly and seamlessly within the insert opening410. Moreover, as shown, the number of primary and secondary replacement disk segments612,712combined (as well as additional replacement disk segments, if necessary) can correspond to the number of affected disks240. According to example aspects, the upper replacement disk surface512of each replacement disk segment612,712can be configured to laterally align with the upper disk surface212of a corresponding one of the affected disks240to continue the first groove pattern620uninterrupted. Furthermore, the lower replacement disk surface714of each replacement disk segment612,712can be configured to laterally align with the lower disk surfaces214of a corresponding one of the affected disks240to continue the second groove pattern720(shown inFIG.7) uninterrupted. As such, with the disk stack repair insert800positioned in the insert opening410, the replacement disk segments612,712can re-define the original fluid passageways175(shown inFIG.1A) of the disk stack100that were interrupted by the defect230(shown inFIG.2) and by the removal of the removable section330. For example, as shown, a lowermost one of the replacement disk segments612acan be configured to laterally align with a lowermost one of the affected disks240a. As such, the lower replacement disk surface714of the lowermost replacement disk segment612can confront the lower boundary wall416of the insert opening410(e.g., the upper disk surface212of the uppermost original disk110c). Thus, the first groove pattern620of the uppermost original disk110ccan confront the second groove pattern of the lowermost replacement disk segment612ato re-define the original fluid pathways175therebetween. Referring toFIG.10, as described above, the inner circumference of the primary replacement disk510(shown inFIG.5) can be smaller than the inner circumference of the disk stack100and the outer circumference of the primary replacement disk510can be greater than the outer circumference of the disk stack100. The secondary replacement disk710can be substantially the same in size as the primary replacement disk510, and thus can also define an inner circumference and an outer circumference that can be smaller and larger, respectively, than the inner circumference and outer circumference of the disk stack100. As such, according to example aspects, when the disk stack repair insert800is fully received within the insert opening410(shown inFIG.4), as illustrated, the inner insert surface802(shown inFIG.8) of the disk stack repair insert800can extend radially inward beyond the inner surface160of the disk stack100, relative to the disk stack axis152, and the outer insert surface804of the disk stack repair insert800can extend radially outward beyond the outer surface170of the disk stack100, relative to the disk stack axis152. As shown inFIGS.11and12, the inner and outer insert surfaces802,804of the disk stack repair insert800can then be machined down (for example, sanded), such that the inner and outer circumferences of the primary and secondary replacement disk segments612,712can match the inner and outer circumferences of the disk stack100. As such, the disk stack repair insert800can be completely flush with the disk stack100. Once machined to be flush with the disk stack100, the disk stack repair insert800can then be secured to the disk stack100, for example, by welding1110, or by any other suitable fastening methods. One should note that conditional language, such as, among others, “can,” “could,” “might,” or “may,” unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments include, while other embodiments do not include, certain features, elements and/or steps. Thus, such conditional language is not generally intended to imply that features, elements and/or steps are in any way required for one or more particular embodiments or that one or more particular embodiments necessarily include logic for deciding, with or without user input or prompting, whether these features, elements and/or steps are included or are to be performed in any particular embodiment. It should be emphasized that the above-described embodiments are merely possible examples of implementations, merely set forth for a clear understanding of the principles of the present disclosure. Any process descriptions or blocks in flow diagrams should be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps in the process, and alternate implementations are included in which functions may not be included or executed at all, may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present disclosure. Many variations and modifications may be made to the above-described embodiment(s) without departing substantially from the spirit and principles of the present disclosure. Further, the scope of the present disclosure is intended to cover any and all combinations and sub-combinations of all elements, features, and aspects discussed above. All such modifications and variations are intended to be included herein within the scope of the present disclosure, and all possible claims to individual aspects or combinations of elements or steps are intended to be supported by the present disclosure. | 39,096 |
11858079 | DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS The features of the present novel invention are set forth with particularity in the appended claims. The invention, together with further objects and advantages thereof, may best be understood by reference to the following description taken in conjunction with the accompanying drawings. A method and apparatus for repairing a casting in a cold metal repair process includes a plurality of drilling fixtures which facilitate the creation of one or more lock receiving recesses positioned generally transverse to the casting material crack. The lock receiving recesses are formed of two circular bore combinations having “medium-sized” and “large” circular portions to maximize strength. The large circular portions slightly overlap each other in line. The medium circular portions surround the large portions, each spaced from the other, defining pinch points and contact areas. A single or plurality of correspondingly configured metal locks are inserted into the lock receiving recesses to provide transverse drawing and strengthening of the casting material portions on each side of the crack thereby adding additional strength to the repair. A plurality of threaded bores formed along the remainder of the casting crack in overlapping spacing which receive a corresponding plurality of stitching pins. The stitching pin has a conical shoulder formed on the opposite end of a threaded shaft and a break off drive head is coupled to the conical shoulder by a twist-off groove structure. When the stitching pins are inserted into their respective threaded bores, the thread portions facilitate threading the stitching pins into the correspondingly tapped bores using a special tap. The conical shoulder portions are operative to seat against the uppermost threads of the threaded bores to prevent further advancement into the threaded bores. The threaded stitching pins employ a variable pitch double hook thread pattern providing instant interlock with the threads of the receiving bores. FIG.1sets forth a novel metal stitching fastener which defines a stitching pin200that is designed to be installed into a crack or joint between two separate pieces so as to create a mechanical connection that can remove a crack completely, create a liquid and gas tight seal without the use of welding that has proven to be severely detrimental to the life of the part whether it be cast iron, cast aluminum, cast or fabricated steel or copper based alloys where welding cannot be performed. As shown inFIG.1, hex drive head1is oriented at the upper end with threads2helically wound around shank5and extending to the opposite end. The drive head and threads are separated by break-off groove3, shoulder4. The installation of said stitching pin200includes slightly overlapping the stitching pins200thereby not leaving any spaces between the pins as demonstrated inFIG.24along with the reinforcing locks defined below. FIG.2is a cross section of the threaded shank5and shoulder angle11of said stitching pin ofFIG.1. It shows details of this unique and novel thread pattern for the purpose of utilizing interlocking threads with radiuses found on all inside15,16and outside18corners for the purpose of increasing the strength of the threads while producing an instant interlock with the surrounding metal. As the shoulder angle11contacts the surface around the opening of the drilled and tapped hole during installation (FIG.24), forward rotation is halted and the drive head1shears off at breakoff groove3when the torque limit is met. Tap contour threads is radiused like Pin200. The radiuses of the threads intentionally have no sharp angles or edges therefore providing more metal to metal contact in the tapped hole for increased strength and fluid seal with no stress points on the fastener or the matching threaded hole created by a threaded cutting tap300(FIG.24). Prior inventions have weaknesses due to the sharp edges within the threads that are common wherein shear loads often result in cracks and a shortened life of the fastener and or part. Thread root12is located between inside corners15and16which are adjacent to thread tooth flanks13and14. Outside radiused corners18are strategically located between flanks13and14, and thread crest inside radius17. The threaded portion is matched to a special tap300shown inFIG.24of the same geometries with close fit and manufacturing tolerances to maximize metal to metal contact. Thus, a fluid tight seal is provided by the radii while reducing stress and increasing strength. FIG.3sets forth a view of a metal lock10designed in accordance with the present invention with center lobes21through24and outer lobes25through34. The purpose of the lobes is to provide an interference, high-friction fit thereby preventing separation of the sides of the wall where a crack had formed. The biggest role played by the lock is to replace the strength of the base metal lost due to a crack. Cracks are caused by accidents and often occur during normal operation. Repairing cracked machinery parts saves money, lost operating revenue and jobs. The interference, high-friction fit can be implemented dimensionally. FIG.4sets forth a perspective view of the metal lock10ofFIG.3showing the side walls35through38of the center four interconnected circular lobes21through24and the smaller lobe side walls of only lobes40through46of outer lobes25-34of lock10. The side walls of the locks are produced in various thicknesses to produce a very strong locking member that will be installed into a drilled the lock receiving recess60(FIGS.5and6of almost “matching” geometry. FIG.5sets forth areas50through58that define the shape of the surrounding metal walls of metal274following the precise drilling process which define lock10receiving recess60precisely drilled utilizing drill fixtures shown inFIG.8throughFIG.23. The fit of lock10is an interference, high friction difference to close the crack. FIG.6sets forth a metal material274such as a cast iron, steel or other metal with a lock receiving hole pattern drilled into it defining the lock receiving recess60. Also shown are the lock first contact areas where the lock10, is pre-loaded as it is driven into the receiving hole pattern. Contact areas61through70on the left-hand side and71through80on the right-hand side indicate where the metal lock10makes first contact with the drilled the lock receiving recess60. These contact points apply the drawing forces required to pull the sides opposite the crack270towards each other when considering that lock10is manufactured to be shorter than the precision receiving bore60. The pulling force,231,232acts to pre-stress the lock10as it is driven into the lock receiving recess60to keep the repair tight. FIG.7reveals the lock10is in the lock receiving recess60drilled centered and approximately at a right angle to the completed installation of stitching pins200filling crack270completely.FIG.7also highlights the pinch points262within the drilled walls of the lock receiving recess60having a width smaller than the diameter of round lobe portions265of outer lobes25-34. These pinch-points262provide an instant interlock for the lobes265when the lock10is driven into the lock receiving recess60. This instant invention accomplishes multi-axis interlocking grip into the surrounding metal274which has never been accomplished before in the art of metal stitching to repair cracks in metal274. This instant invention will interlock with the surrounding metal not only over the length of the lock10but also especially at the ends and along the sides of the lock10. This allows the lock10to be interlocked with the surrounding metal on all sides providing a significantly better attachment with the surrounding metal. The distances from the center of the lock10adjacent to the crack as shown as270inFIG.6, ends25,26,33, and34(FIG.3). Moreover, overlap of central lobes22and23is less than21, and22,23and24. This means interference pressure increases going to the center and crack270along contact areas61through80and pinch points262is shorter than the lock receiving recess60ofFIG.6measuring from its center to each end. The difference in length between said lock10and the lock receiving recess60is small but enough to never apply a spreading force to the crack270or prior stitched repair. Pinch points262are chords of a circle of outer lobes25-34parallel to the lock long axis. As perFIG.6, These chords are pulling the lock10to close the crack even if pinch points262are above the lock1. FIG.8sets forth a perspective of the pilot hole drill fixture85perched over the material274to be located over the stitched repair7using the line83scribed into the side of the drill fixture. A first pilot hole can be drilled through the fixture into metal274with drill bit84. FIG.9sets forth a perspective view showing the location of the pilot hole drilling fixture85rotated 180 degrees prior to insertion of the locating pin71into the drilled hole70. Following the insertion of the locating pin81into hole370, hole380is drilled through the fixture with drill bit84. FIG.10sets forth a perspective view of drill fixture locating guide86with channels82cut into the bottom side leaving4corners83that will rest on the metal part274to be repaired during the remaining drilling process. Channels82provides a route for the drill chips to move away from the bottom of the drill fixture86preventing a buildup of drill chips that in prior designs had the ability to lift the fixture from the surface and cause excess heat and wear to the drill fixture. Pilot holes370and380are tapped to accept bolts87to secure the drill fixture locating guide onto the surface of metal piece274. FIG.11shows drill fixture locating guide86bolted firmly to the surface with bolts87 FIG.12sets forth a perspective assembly preview of the drill guide88perched over the installed drill fixture locating guide86; FIG.13sets forth a perspective view of the present invention showing the right-angle drill platform plate mounting holes90and the first drill guide88secured in place with set screws101 FIG.14sets forth a perspective view of the drill right-angle drill plate91mounted to the drill fixture locating guide86with bolts92and jacking bolts94installed to prevent deflection of the mounting plate when a magnetic base drill motor is attached to the right angle drill mounting plate91to drive the drill bits with when necessary. FIG.15sets forth a drill bit98perched over the right angle drill plate91to drill the first hole for the lock receiving hole pattern, forming the lock receiving recess60, (FIG.7) FIG.16sets forth a view of a dowel pin99ready to be installed into the first hole102drilled inFIG.15to maintain a precision location of the fixture to the newly drilled hole. FIG.17shows a second dowel pin103ready to be inserted through the drill guide into hole101. FIG.18sets forth the continuation of drilling all remaining 12 same sized holes through the drill guide into the base metal and finishing this first series of holes forming the lock receiving recess60. FIG.19shows the final drill guide105with holes106drilled through it to accept the last and large size drill bit. FIG.20shows the final drill guide105secured in place with set screws101and ready to receive large drill bit107to finish the drilling of the remaining four larger holes to connect all other holes together and completing the lock receiving recess60so the lock10can be hammered into place. FIG.21sets forth a view of the completed lock hole pattern forming the lock receiving recess60across the repaired crack. FIG.22sets forth a view of lock10ready to be driven into the lock receiving recess60. FIG.23sets forth a view of screws108ready to be screwed into threaded holes370and380to block them off and seal them permanently. FIG.24shows a perspective view of a semi completed repair process in progress and tap300which forms the threads in the crack270. | 11,993 |
11858080 | DETAILED DESCRIPTION OF THE INVENTION In the figures, a table2has a circular, planar table surface4, as is common for rotary indexing tables. In the first exemplary embodiment ofFIG.1, the table surface4is shown without any parts, such as workpieces or the like, mounted thereon. In the second exemplary embodiment ofFIG.2, exemplary pieces of equipment6are shown on the table surface4. In both exemplary embodiments ofFIG.1andFIG.2, the table2forms a structural unit with an assigned stationary table unit8, on which the table2is rotatably mounted by a bearing10formed by a roller bearing unit of the standard type. In both exemplary embodiments, the table unit8forms a type of outer housing having mainly circular cylindrical outer wall parts. The structural unit, comprising the table2and the table unit8, forms an exchange component which, although it may be of different construction, can be fixed to one and the same base component in the form of a stand component12. In this respect,FIGS.1and2show different constructions for the table2together with the table unit8, which differ mainly in the type of clamping between the table2and the table unit8. The stand component12has a circular cylindrical hollow body14. At its bottom end in the figures, the hollow body14has a foot part16, which has the form of a flange that widens or extends radially outwards. The hollow body14forms the rotary guide for a shaft18, which defines the axis of rotation for the table2. The upper end of shaft18forms an interface20, with which the exchange component can be coupled. In this example, asFIG.1shows, for this purpose bolts22are provided for a bolted connection to the table2at the bottom of the table surface4. A rotary encoder24is arranged at the bottom of the foot part16and interacts with an extension26of the shaft18to determine its rotational position, and thus, the rotational position of the table2. In the rotary guide, formed by the hollow body14and in which the shaft18is guidably supported with and without roller bearings28, there is a rotary distributor for lubricating fluid and other media, which are beneficial to the seal. The rotary distributor has, along the outside of the shaft18between the rolling bearings28, a rotary seal30, in this case a Zurcon seal, which is interrupted by supply grooves. Furthermore, a variant having gap seals and bearing instead of contact seals can be used. Starting from a feed point (not shown), to which the lubricant or other medium is routed via a supply line32, the lubricant or other medium is distributed along the seal30via the lubrication grooves and/or supply grooves. The circular cylindrical outer circumference of the hollow body14of the stand component12forms a guide surface34, along which the table unit8together with the assigned table2as an exchange component can be put on the base component formed by the stand component12. As shown inFIG.1, in the mounted position, an inner collar38, projecting radially inwards, of an inner housing part36of the table unit8rests against the top surface of the flange-shaped base part16of the stand component12. An end sided outer flange40of the inner housing part36forms the support for a bottom part42of the outer housing formed by the table unit8. An inner circumferential surface of the table2is guided, sealed by a sealing ring46, at the upper end area of the guide surface34of the hollow cylinder14. Bolts48,50and52are used to connect the table2to a shell part54, which as an outer rotor encompasses a coil winding56, which is fixed to the housing bottom part42using bolts58. Also feasible with an internal rotor. This arrangement forms the electric drive motor of the table2. The main difference between the exchange component shown inFIG.1and the exchange component shown inFIG.2is the construction of the clamping device. In the example ofFIG.1, a plurality of equally formed clamping units60are arranged at equal distances from each other on a circular line concentric to the shaft18. Two clamping units60are visible inFIG.1. Every clamping unit60has a stationary device body62attached to the inner wall of the housing shell formed by the table unit8. More specifically, the device body62is located in an area below the inner bearing part64of the bearing10, which is fixed to the underside of the table surface4using bolts66. In the area between the underside of the inner bearing part64and the device body62there are, from top to bottom, a stationary compression ring68connected to the table unit8, an intermediate ring70and a lamellar pack72. The intermediate ring70, which is connected to the table2by the bolts48, can be rotated relative to the stationary compression ring68. The lamellar pack72is formed by a stacked sequence of disks in the manner of clutch plates. The pack72comprises a succession of stationary lamellas, connected to the stationary compression ring68by bolts74, and comprises movable lamellas, connected to the movable intermediate ring70by bolts not shown. Every device body62has a hydraulically actuated piston76. The end face of piston76acan be used to load and press the lamellar pack72against the compression ring68and the intermediate ring70, establishing a frictional engagement between the lamellas, by which the compression ring68and the intermediate ring70are fixed non-rotatable to each other. InFIG.2, components that functionally match those of the example ofFIG.1are designated by the same reference numerals as inFIG.1. In the example ofFIG.1the circumferential surface76of the table2is set back radially inwards relative to the outer circumference78of the table unit8. In the example ofFIG.2the circumferential I surface76of the table2and the outer circumference78of the table unit8are radially flush with each other. In the example ofFIG.1, a coaxial hollow cylinder80is provided at the underside of the foot part16, with the hollow cylinder80encompassing the rotary encoder24and with hollow cylinder80having the port82for the lubricant supply or media supply to the conduit32. In theFIG.2example, this hollow cylinder80is omitted as an optional component in the example ofFIG.2. In all other respects, however, the stand component12fully matches that of the example ofFIG.1as far as its function as a base component, on which exchange components comprising the table2together with the table unit8of different constructions can be placed, is concerned. The difference is mainly in the arrangement and construction of the clamping device, the position of the bearing10below the clamping device and the construction of the electric motor, for which the shell part62, connected to the table2, is not arranged as an outer rotor on the outside of the coil winding56, but as an inner rotor on the inside of the coil winding56. The clamping units84, which are hydraulically actuated like the clamping units60ofFIG.1, are arranged between a circumferential area86of the table2, adjacent to the table surface4, and a clamping surface88, extending in a radial plane and formed by an end surface in a recess in the outer wall of the housing of the table unit8. The clamping units84comprise a spreader body90having an internal pressure chamber92. By supplying pressure to the pressure chamber92, the spreader body90can be hydraulically spread and generates a clamping force acting between the circumferential area86of the table2and the stationary clamping surface88on the table unit8to form a frictional connection for fixing the relative rotational position. As shown inFIG.2, the bearing10is arranged below the clamping units84. InFIG.1, the inner bearing part64is fixed to the table2using bolts66. While various embodiments have been chosen to illustrate the invention, it will be understood by those skilled in the art that various changes and modifications can be made therein without departing from the scope of the invention as defined in the claims. | 7,908 |
11858082 | DETAILED DESCRIPTION A first embodiment of the present disclosure will be described with reference toFIGS.1to17. A cutting machine1according to the present embodiment is a sliding miter saw. As shown inFIG.1, the cutting machine1includes a base2, a turntable4, and a machine body10. The base2is placed on, for example, a table or a floor. The turntable4receives a workpiece. The turntable4is located on and supported by the base2. The machine body10is installed on the turntable4. The machine body10rotatably supports a substantially disc-shaped cutting tool11. The cutting tool11is called a tipped saw blade. A user in front of the cutting machine1performs cutting. In the example below, the vertical and lateral directions of components and structures are defined as viewed from the user. The front and the rear of the components and the structures are defined as the front being closer to the user. The direction in which an LED72emits light, or more specifically, the direction in which a radiated ray L is applied is denoted with P, and the direction opposite to this direction is denoted with Q. The upstream position in the rotation direction of the cutting tool or the thickness direction of an LED substrate is denoted with T, and the downstream position in the rotation direction or the thickness direction is denoted with U. The P-Q direction and the T-U direction are orthogonal to each other. As shown inFIG.1, the turntable4is substantially circular in a plan view. The turntable4includes a table upper surface4alocated horizontally. The turntable4includes a rotation shaft2alocated at a substantially circular center. The turntable4is horizontally rotatable with respect to the base2around the rotation shaft2a. Sub-tables3are attached to the left and right sides of the base2. The sub-tables3are located on the left and right sides of the turntable4, and have upper surfaces level with the table upper surface4a.The turntable4includes a table extension5. The table extension5extends along the side surface of the cutting tool11. The table upper surface4aand the upper surface of the table extension5include a cutting edge plate5athat extends horizontally. The cutting edge plate5ahas a cut groove5bin the middle. The groove5bextends along the side surface of the cutting tool11. As shown inFIGS.1and4, a positioning fence6is located on the turntable4. The positioning fence6is a wall extending laterally and upward. The positioning fence6has a positioning surface6athat stands erect as its front surface. The positioning surface6ais located on the vertical plane including the rotation shaft2aof the turntable4. A workpiece W on the table upper surface4ais placed into contact with the positioning surface6ato be fixed in position in the front-rear direction. As shown inFIGS.1and4, an arc-shaped miter scale plate7is located in a substantially semicircular area on the front portion of the base2. The miter scale plate7extends horizontally below the table upper surface4a.The miter scale plate7has multiple positioning recesses7b.Each positioning recess7bis a groove extending radially. The positioning recesses7bare arranged at predetermined angular intervals in the circumferential direction of the miter scale plate7. The positioning recesses7bcan receive the tip of a positioning pin52as described later. The miter scale plate7is fixed to the base2with fixing screws7a.The fixing screws7aare received in slits in the base2. The angle between the positioning fence6and the cutting tool11can be finely adjusted by unscrewing the fixing screws7aand moving the miter scale plate7laterally. For example, the angle between the positioning fence6and the cutting tool11can be adjusted to be precisely perpendicular to each other while the positioning pin52is received in the positioning recess7bpositioned at right angles to the positioning pin52. This adjustment is mainly performed during production. As shown inFIG.4, a body support arm40is located behind the turntable4. The body support arm40extends substantially upward. The body support arm40includes a lateral tilt support shaft40aextending in the front-rear direction. The body support arm40is supported to be laterally tiltable with respect to an arm supporter4bin the turntable4about the lateral tilt support shaft40a. Two long slide bars41are located at an upper portion of the body support arm40. The slide bars41extend horizontally and parallel to the side surface of the cutting tool11. The two slide bars41extend parallel to each other in the vertical direction. The slide bars41support a slide base42. The slide base42is slidable in the front-rear direction. The slide base42slides in the front-rear direction to allow the cutting tool11to cut a workpiece W having a wide width in the front-rear direction placed on the turntable4. The machine body10includes a vertical swing support shaft10aextending laterally. The machine body10is vertically swingable with respect to the slide base42about the vertical swing support shaft10a. As shown inFIG.3, the cutting tool11is integrally attached to an output shaft23. The output shaft23extends laterally and is rotatably supported by the machine body10. The cutting tool11is attached to the output shaft23with a fixing screw14with the rotation center held between an outer flange15and an inner flange16. As shown inFIG.1, the machine body10includes a stationary cover12and a movable cover13. The stationary cover12and the movable cover13cover the periphery of the cutting tool11. The stationary cover12covers the upper half of the cutting tool11. An outlined arrow12aindicating the rotation direction of the cutting tool11is indicated on the left side of the stationary cover12. The movable cover13can cover the lower half of the cutting tool11. The movable cover13rotates in cooperation with a vertical swing of the machine body10to open or close the lower half of the cutting tool11. When the machine body10is swung upward, the movable cover13rotates in a closing direction (clockwise inFIG.1). Thus, the lower half of the cutting tool11is covered. When the machine body10is swung downward, the movable cover13rotates in an opening direction (counterclockwise inFIG.1). Thus, the lower half of the cutting tool11is exposed. As shown inFIG.3, the movable cover13is integrally formed from a resin material with high light transmittance. The resin material is, for example, transparent polycarbonate. The movable cover13has a through-hole13a.The through-hole13acircumferentially extends in the circumferential side surface and through the movable cover13. As shown inFIGS.2and4, a dust-collection guide17is located at the lower rear of the stationary cover12. The dust-collection guide17has an opening at the front and has a substantially C-shaped cross section. The dust-collection guide17reduces chips resulting from cutting the workpiece W being scattered to the rear, left, or right of the cutting tool11. The dust-collection guide17has an upper portion connected to a dust-collection hose17a. The dust-collection hose17aextends rightward from the rear portion of the machine body10. A rear dust-collection port18is located in front of the body support arm40. The rear dust-collection port18is tubular and has an opening at the front. The rear dust-collection port18reduces chips being scattered to the rear of the dust-collection guide17. The dust-collection guide17is continuous with the dust-collection hose17a. The rear dust-collection port18is continuous with a dust-collection hose18a.The dust-collection hoses17aand18aare connected to a dust collector installed separately from the cutting machine1. This structure can transport chips scattered around the dust-collection guide17and the rear dust-collection port18to the dust collector through the dust-collection hoses17aand18a. As shown inFIGS.2and3, the machine body10includes a motor housing20on the right of the stationary cover12. The motor housing20has a substantially cylindrical shape extending upward and rightward toward the rear when the machine body10is at a top dead center. On the rear right end face, the motor housing20has an inlet20athat can take in outside air. The machine body10accommodates an electric motor21. The electric motor21is, for example, a direct-current (DC) brushless motor. As shown inFIG.3, a gear housing22is located between the motor housing20and the stationary cover12in the lateral direction. The motor housing20and the gear housing22are internally continuous with each other. Power from the electric motor21is transmitted to the output shaft23while being reduced via a reduction gear train accommodated in the gear housing22. Thus, in response to driving of the electric motor21, the cutting tool11attached to the output shaft23rotates about the output shaft23. As shown inFIG.2, the gear housing22has an outlet20bat a rear portion. When the electric motor21is driven, a fan attached to a motor shaft rotates. Thus, cooling air flows inside the motor housing20from the inlet20atoward the outlet20b.The cooling air cools the electric motor21. As shown inFIG.2, a controller housing27with a rectangular box shape is located on the machine body10. The controller housing27accommodates a controller28. The controller28includes a shallow, substantially rectangular prism case, and a control substrate accommodated in the case and molded with resin. The controller28mainly includes, for example, a control circuit, a driving circuit, and an auto-stop circuit for controlling the operation of the electric motor21. The control circuit includes a microcomputer that transmits control signals to the electric motor21based on the position information about a rotor of the electric motor21. The driving circuit includes a field-effect transistor (FET) that switches the current from the electric motor21based on the control signals received from the control circuit. The auto-stop circuit disconnects the power supply to the electric motor21to avoid overdischarge or overcharge in accordance with the detection result of the state of a battery pack26as described later. As shown inFIG.2, the machine body10includes a battery mount25in a rear portion of the motor housing20. The mount surface of the battery mount25extends in a direction substantially perpendicular to the longitudinal direction of the motor housing20. The battery mount25receives the battery pack26with a substantially rectangular box shape in a detachable manner through sliding. The battery pack26is, for example, a lithium ion battery with an output voltage of 36 V. The battery pack26is detachable from the battery mount25and is repeatedly rechargeable by a separately prepared recharger. The battery pack26is also usable as a power source for another rechargeable power tool such as a screwdriver or an electric drill. As shown inFIG.3, a handle unit30is located at an upper front of the machine body10. The handle unit30is located on the right of the stationary cover12. The handle unit30includes an operation handle31. The operation handle31has a loop shape extending in the lateral direction. A switch lever32is located on the inner circumference of the operation handle31. The user grasping the operation handle31can pull the switch lever32with fingers hooked around the switch lever32. Pulling the switch lever32activates the electric motor21. A lock-off button33is located at an upper portion of the operation handle31. Pressing the lock-off button33allows the user to pull the switch lever32. This avoids unintended activation of the electric motor21. As shown inFIG.3, an illuminator switch34is located on the surface nearer the inner circumference of the operation handle31and facing the switch lever32. Pressing the illuminator switch34turns on or off LEDs72(refer toFIG.4) in an illuminator60at an upper front of the stationary cover12. The illuminator60will be described in detail later. As shown inFIGS.1and4, a turntable fixing unit45is located in a lower portion of the table extension5. A grip unit46is located in front of the table extension5. The grip unit46has an uneven circumference to facilitate gripping and rotating with a user. The user grips the grip unit46and horizontally rotates the turntable4with respect to the base2. A fixing rod47extends from the grip unit46to the inner rear of the table extension5. The fixing rod47is supported through screw engagement inside the table extension5. Rotating the grip unit46about the fixing rod47displaces the fixing rod47in the front-rear direction. Displacing the fixing rod47rearward locks the turntable4onto the base2at a predetermined miter angle. Displacing the fixing rod47frontward unlocks the turntable4from the base2. As shown inFIGS.1and4, a positive lock unit50is located in a lower portion of the table extension5. The positive lock unit50includes an unlock lever51and a positioning pin52. The unlock lever51is located in a front portion of the table extension5and at the upper rear of the grip unit46. The positioning pin52is coupled with the unlock lever51and extends into the inner rear of the table extension5. The positioning pin52is located on substantially the same level as the miter scale plate7. The positioning pin52is normally urged rearward. The rear end of the positioning pin52urged rearward is receivable in the positioning recesses7b.The turntable4rotated horizontally by gripping the grip unit46causes the positioning pin52to move into any of the multiple positioning recesses7b.Thus, the turntable4is fixed in position at a predetermined miter angle corresponding to the positioning recess7b.Pressing the unlock lever51displaces the positioning pin52forward against the urging force. The rear end of the positioning pin52is thus disengaged from the positioning recess7b. As shown inFIGS.4and5, the illuminator60is located in the upper front portion of the stationary cover12on the inner circumference. The illuminator60includes two LEDs72serving as light sources, a substrate71, and an illuminator cover70. The two LEDs72are located on the substrate71. The illuminator cover70supports the substrate71and is attached to the stationary cover12. The illuminator60includes a lens coupler61. The lens coupler61changes the illumination direction of the LEDs72. The illuminator60is located radially outward from the cutting tool11and emits light toward the cutting tool11. The illuminator cover70extends in the circumferential direction of the stationary cover12along the circumferential surface of the stationary cover12. The illuminator cover70has a through-hole70b.The through-hole70bextends through the illuminator cover70in the radial direction of the stationary cover12. A fastening bolt70ais received in the through-hole70band is fastened to a threaded hole12bin the stationary cover12. Thus, the illuminator cover70is attached to the stationary cover12. As shown inFIGS.5,7, and9, the substrate71is a rectangular plate formed from aluminum. The substrate71receives the two LEDs72and an LED controller71a.The LED controller71aturns on or off the two LEDs72based on a command signal transmitted from the controller28(refer toFIG.2). At the center portion, the substrate71has a through-hole71bthat extends through the substrate71in the thickness direction. The illuminator cover70has a threaded hole70con the inner circumference. The threaded hole70cextends in the radial direction of the stationary cover12. A fastening bolt71dis received in the through-hole71band fastened to the threaded hole70c.Thus, the substrate71is attached to the illuminator cover70. As shown inFIG.8, two lenses62are coupled to form a single lens coupler61. The lens coupler61includes three legs67. Each leg67includes a columnar pillar67b.The substrate71has three through-holes71cin a front portion. The through-holes71cextend through the substrate71in the thickness direction. The pillars67bare received in the through-holes71c.The end of each pillar67bis swaged (or rivetted) on the rear side (upper side) of the substrate71and radially enlarged to form an enlarged-diameter portion67c. With the enlarged-diameter portion67c,the lens coupler61cannot be removed from the substrate71(refer toFIG.16). Thus, the lens coupler61is attached to the substrate71. As shown inFIG.10, the illuminator60includes the two LEDs72and the two lenses62. The two LEDs72include a first light source72aand a second light source72b. The two lenses62include a first lens62aand a second lens62b.A first light source center72cof the first light source72ais located on the right of an imaginary plane extending from a right side surface11aof the cutting tool11. A second light source center72dof the second light source72bis located on the left of an imaginary plane extending from a left side surface11bof the cutting tool11. The first light source72aand the second light source72bare located at the same position in the front-rear direction. The first lens62ais centered on a first center axis73. The first center axis73includes the first light source center72cand is perpendicular to the surface of the first light source72a.The second lens62bis centered on a second center axis74. The second center axis74includes the second light source center72dand is perpendicular to the surface of the second light source72b.The first center axis73and the second center axis74extend in the same direction. As shown inFIGS.11to14, the second lens62bis laterally symmetrical with the first lens62a.One of the similar structures of the first lens62aand the second lens62bwill be described in detail below. The first lens62ahas a substantially conical shape with a diameter increasing from an incidence surface64toward an emission surface65. A first incidence surface64dand a first emission surface65dof the first lens62aeach have an arc-shaped circumference centered on the first center axis73. A second incidence surface64eand a second emission surface65eof the second lens62beach have an arc-shaped circumference centered on the second center axis74. As shown inFIGS.13and15, the first lens62ahas a flat substrate contact surface63at the end face of the incidence surface64. The substrate contact surface63is in contact with the surface of the substrate71. The incidence surface64includes the first incidence surface64dnearer the first lens62aand the second incidence surface64enearer the second lens62b.The first incidence surface64dhas an incidence surface recess64arecessed from the substrate contact surface63in the axial direction of the first center axis73. The incidence surface recess64ahas a substantially cylindrical shape centered on the first center axis73. The first light source72ais accommodated in the incidence surface recess64awith the first light source center72con the first center axis73. The substrate71placed into contact with the substrate contact surface63closes the incidence surface recess64aaccommodating the first light source72a. As shown inFIG.15, the second light source72bis accommodated in the incidence surface recess64anearer the second lens62bwith the second light source center72dlocated on the second center axis74. The substrate71placed into contact with the substrate contact surface63closes the incidence surface recess64aaccommodating the second light source72b.The incidence surface recess (first incidence surface recess)64anearer the first lens62aand the incidence surface recess (second incidence surface recess)64anearer the second lens62bare separated by the substrate contact surface63between them. As shown inFIG.15, the incidence surface recess64ahas a side surface64bat least partially having a spherical shape centered on the first light source center72c.In other words, the side surface64bat least partially has, in a cross section including the first center axis73, an arc shape centered on the first light source center72c.The arc-shaped cross section of the side surface64bis mostly located below the surface of the first light source72a. The incidence surface recess64ahas a spherical protrusion64con its bottom surface. The spherical protrusion64chas a convex shape centered on the first center axis73and protruding toward the first light source72a.The incidence surface recess64a,the side surface64b,and the spherical protrusion64care included in the incidence surface64through which light from the LEDs72enters the lenses62. As shown inFIG.14, the emission surface65includes the first emission surface65dnearer the first lens62aand the second emission surface65enearer the second lens62b. The first emission surface65dincludes an arc-shaped first circumference65fcentered on the first center axis73. A first outermost portion65hon the first circumference65fis located farthest from and at a first distance r1from the first center axis73. Any point on the arc-shaped first circumference65fcorresponds to the first outermost portion65h. The second emission surface65ehas an arc-shaped second circumference65gcentered on the second center axis74. A second outermost portion65ion the second circumference65gis located farthest from and at a second distance r2from the second center axis74. Any point on the arc-shaped second circumference65gcorresponds to the second outermost portion65i. As shown inFIG.14, a distance r3between the first center axis73and the second center axis74is shorter than the sum of the first distance r1and the second distance r2. When viewed in the direction of the first center axis73, the first emission surface65dand the second emission surface65eform a shape including the two arc shapes partially overlapping at the center. The first circumference65fand the second circumference65gcross each other at their ends. The first circumference65fhas an arc shape centered on the first center axis73with a central angle A1. The second circumference65ghas an arc shape centered on the second center axis74with the central angle A1. The central angle A1is greater than 180° and less than 360°. As shown inFIGS.14and15, the first lens62ahas an emission surface protrusion65b.The emission surface protrusion65bprotrudes in the axial direction of the first center axis73at a position radially inward from the first circumference65f.The emission surface protrusion65bhas a substantially cylindrical shape centered on the first center axis73. The outer circumferential surface of the emission surface protrusion65bhas a substantially spherical shape centered on a predetermined point on the first center axis73. The inner circumferential surface of the emission surface protrusion65bextends in the axial direction of the first center axis73. The first lens62ahas a center recess65c.The center recess65cis recessed in the axial direction of the first center axis73at a position radially inward from the emission surface protrusion65b.The center recess65chas a cylindrical shape centered on the first center axis73when viewed in the axial direction of the first center axis73. In other words, the center recess65cis centered on the axis of the emission surface protrusion65b.The bottom surface of the center recess65cis perpendicular to the first center axis73. As shown inFIGS.14and15, the first lens62ahas an arc-shaped recess65a.The arc-shaped recess65ais recessed in the axial direction of the first center axis73between the first circumference65fand the emission surface protrusion65b.The arc-shaped recess65ais centered on the first center axis73when viewed in the axial direction of the first center axis73. The arc-shaped recess65asurrounds the circumference of the emission surface protrusion65b.The emission surface protrusion65b,the center recess65c,and the arc-shaped recess65aare included in an emission surface65through which light from the LEDs72is emitted. As shown inFIGS.12and15, the first lens62ahas a substantially conical circumferential surface66. The circumferential surface66connects the circumference of the substrate contact surface63with the first circumference65f.The circumferential surface66includes an outer reflection surface66athat reflects light inside the first lens62ain the first lens62a.The outer reflection surface66ahas a diameter that is centered on the first center axis. The diameter increases from the first incidence surface64dtoward the first emission surface65d.The outer reflection surface66ahas a convex shape protruding outward in a cross section including the first center axis73. In a cross section taken perpendicular to the first center axis73, as shown inFIG.17, the outer reflection surface66ais an arc-shaped circumference that is a cross-sectional arc66b.In a cross section taken at any position between the first incidence surface64dand the first emission surface65d(refer toFIG.15), the cross-sectional arc66bhas an arc shape centered on the first center axis73with a central angle A2. The central angle A2is greater than 180° and less than 360°. As shown inFIG.15, light from the second light source center72dof the second light source72benters the lens62through the bottom surface of the incidence surface recess64a,the side surface64b,or the spherical protrusion64c.Light incident through the spherical protrusion64cis refracted in the axial direction of the second center axis74. The light is then emitted directly in the axial direction of the second center axis74from the bottom surface of the center recess65c.Light incident through the bottom surface of the incidence surface recess64ais refracted twice, or more specifically, at the bottom surface of the incidence surface recess64aand at the outer circumferential surface of the emission surface protrusion65b.The light is emitted through the outer circumferential surface of the emission surface protrusion65bin the axial direction of the second center axis74. Light incident through the side surface64btravels in the direction normal to the side surface64band is reflected from the outer reflection surface66ain the axial direction of the second center axis74. The light is then directly emitted in the axial direction of the second center axis74from the arc-shaped recess65aor an area between the arc-shaped recess65aand the second circumference65g.Thus, the light from the second emission surface65eis aligned in the axial direction of the second center axis74. Similarly, light from the first light source72aemitted through the first emission surface65dis also aligned in the axial direction of the first center axis73. As shown inFIGS.12and14, each leg67includes an externally extending portion67a.The externally extending portion67aextends from the first circumference65for the second circumference65glaterally from the lenses62. Each pillar67bextends from the distal end of the externally extending portion67ain a direction from the emission surface65toward the incidence surface64. Thus, the legs67are located outside the path of light passing through the lenses62. As shown inFIG.4, light emitted through the emission surface65(refer toFIG.15) of the lens coupler61is applied to the cutting tool11from above. When the machine body10is at a top dead center, a radiated ray L is inclined slightly rearward while traveling downward. In a horizontal imaginary plane S including the bottom end of the cutting tool11, the radiated ray L passes in front of a point immediately below the output shaft23of the cutting tool11. As shown inFIG.6, the machine body10is swung downward at a predetermined angle K from the top dead center to a predetermined position between the top dead center and the bottom dead center to move the bottom end of the cutting tool11nearer the workpiece W. At this time, in the imaginary plane S, the radiated ray L moves nearer the point immediately below the output shaft23of the cutting tool11, and passes closely in front of the point immediately below the output shaft23. The imaginary plane S is parallel to the upper surface of the workpiece W and is the same plane as the upper surface of the workpiece W when the bottom end of the cutting tool11comes into contact with the upper surface of the workpiece W. As shown inFIG.4, the cutting machine1includes the machine body10including the disc-shaped cutting tool11, and the illuminator60that emits light from the radially outer portion of the cutting tool11toward the cutting tool11. As shown inFIG.10, the illuminator60includes the first light source72aand the second light source72blocated across an imaginary plane including the cutting tool11, and the first lens62aand the second lens62b.As shown inFIG.15, the first lens62aincludes the first incidence surface64don which light from the first light source72ais incident, and the first emission surface65dthrough which light is emitted. The second lens62bincludes the second incidence surface64eon which light from the second light source72bis incident, and the second emission surface65ethrough which light is emitted. As shown inFIG.14, the first emission surface65dhas the first outermost portion65hlocated farthest and at the first distance r1from the first center axis73including the first light source center72cof the first light source72aand perpendicular to the first light source72a.The second emission surface65ehas the second outermost portion65ilocated farthest and at the second distance r2from the second center axis74including the second light source center72dof the second light source72band perpendicular to the second light source72b.The distance r3between the first center axis73and the second center axis74is shorter than the sum of the first distance r1and the second distance r2. Thus, light from the first light source72apasses the first lens62aand is emitted through the first emission surface65d.Light from the second light source72bpasses the second lens62band is emitted through the second emission surface65e.The distance r3between the first center axis73and the second center axis74is shorter than the sum of the first distance r1and the second distance r2, and the first emission surface65dand the second emission surface65eare located close to each other. Thus, the first emission surface65dis nearer the right side surface11aof the cutting tool11. The second emission surface65eis nearer the left side surface11bof the cutting tool11. The workpiece W is placed opposite to the illuminator with the cutting tool11in between. This structure reduces light emitted through the first emission surface65dand the second emission surface65etraveling between the cutting tool11and the workpiece W. This structure can thus clearly cast the shadow of the cutting tool11on the surface of the workpiece W. The first lens62aand the second lens62bare included in a single component of the lens coupler61as shown inFIG.11. The single lens coupler61alone is attached to the illuminator60, thus shortening the distance between the first light source72aand the second light source72band also facilitating the attachment to the illuminator60. As shown inFIG.14, the first emission surface65dincludes the arc-shaped first circumference65fcentered on the first center axis73and having a length extending over a range exceeding 180°. The second emission surface65eincludes the arc-shaped second circumference65gcentered on the second center axis74and having the length extending over a range exceeding 180°. The first circumference65fand the second circumference65gcross each other. Thus, light emitted through the first emission surface65dhas less brightness unevenness in the circumferential direction of the first emission surface65d.Light emitted through the second emission surface65ehas less brightness unevenness in the circumferential direction of the second emission surface65e.Thus, an area on the surface of the workpiece W illuminated has less brightness unevenness. This structure can clearly cast the shadow of the cutting tool11on the workpiece W. This structure can also reduce the distance between the first center axis73and the second center axis74. Thus, the distance between the first light source72aand the second light source72bcan be reduced while the lenses62retain the shapes to clearly cast the shadow of the cutting tool11on the workpiece W. As shown inFIG.15, the first lens62ahas the outer reflection surface66athat reflects, toward the first emission surface65d,light incident through the first incidence surface64dand passing through the first lens62a.The outer reflection surface66ahas a convex shape separated farther from the first center axis73nearer the first emission surface65dfrom the first incidence surface64d,and curved outward in the cross section including the first center axis73. Thus, light traveling from the first incidence surface64dthrough the first lens62aand out of the first lens62acan be directed toward the first emission surface65dat the outer reflection surface66a.This structure can reduce an optical loss. This structure can also align the direction of light emitted through the first emission surface65dand thus reduce uneven brightness of the illuminating light. As shown inFIG.15, the outer reflection surface66ahas the cross-sectional arc66bcentered on the first center axis73and having a length extending over a range exceeding 180° at any position from the first incidence surface64dto the first emission surface65d(refer toFIG.17). Thus, the distance between the first light source72aand the second light source72bcan be reduced while the lenses62retain the shapes to reduce uneven brightness of the illuminating light. As shown inFIGS.13and15, the first lens62ahas the incidence surface recess64aon the first incidence surface64dand the spherical protrusion64cprotruding toward the first light source72afrom the bottom surface of the incidence surface recess64a.The incidence surface recess64acan thus reduce the thickness of the first lens62ain the axial direction of the first center axis73. The spherical protrusion64ccan refract the light in the axial direction of the first center axis73without excessively increasing the thickness of the first lens62a. As shown inFIG.15, the side surface64bof the incidence surface recess64aat least partially has an arc shape concentric with the first light source72ain a cross section including the first center axis73. Thus, light that passes a portion of the side surface64bwith an arc-shaped cross section travels in a direction substantially normal to the side surface64b.Thus, light refraction is reduced in the portion of the side surface64bwith an arc-shaped cross section. The light can thus be evenly emitted through the first emission surface65d. As shown inFIG.15, the first lens62ahas the incidence surface recess64aon the first incidence surface64d.The incidence surface recess64ais closed with the substrate71to which the first light source72ais attached. The second lens62bincludes the incidence surface recess64aon the second incidence surface64e.The incidence surface recess64anearer the second lens62bis closed with the substrate71to which the second light source72bis attached and separated from the incidence surface recess64anearer the first lens62a.This structure can reduce a loss of light from the first light source72aor the second light source72b.This structure can also reduce interference between light from the first light source72aand light from the second light source72b.Thus, light can be efficiently emitted through the first and second emission surfaces65dand65e. As shown inFIGS.14and15, the first lens62ahas the emission surface protrusion65bthat protrudes at a position inward from the circumference of the first emission surface65dand has a cylindrical shape on the inner circumference and the shape of a partial sphere on the outer circumference. The emission surface protrusion65bcan thus refract light emitted through the emission surface protrusion65bin the extension direction of the first center axis73. Thus, light emitted through the first emission surface65dis aligned and can cast a clear shadow on the surface of the workpiece W. As shown inFIGS.14and15, the first lens62ahas the cylindrical emission surface protrusion65b.The first lens62ahas the center recess65cat the axial center of the emission surface protrusion65b.This structure can reduce the thickness of the first lens62awithout changing the direction of light emitted through the first emission surface65d.The illuminator60can thus have a smaller size. As shown inFIGS.14and15, the first emission surface65dof the first lens62ahas the arc-shaped recess65asurrounding the circumference of the emission surface protrusion65b.This structure can thus reduce the thickness of the first lens62ain a relatively wide area between the emission surface protrusion65band the first circumference65fwithout changing the direction of light emitted through the first emission surface65d.Thus, the illuminator60can have a smaller size and weight. As shown inFIGS.14and16, the first lens62aincludes the legs67extending sideward from the first circumference65fof the first emission surface65d.This structure can reduce leakage of light passing through the first lens62afrom the legs67and thus reduce a loss of light from the first light source72a. As shown inFIG.4, the machine body10is vertically swingable about the vertical swing support shaft10awith respect to the base2that receives the workpiece W. When the machine body10is at a top dead center, the illuminator60illuminates a front position farther from the vertical swing support shaft10athan the position immediately below the output shaft23of the cutting tool11in the horizontal imaginary plane S including the bottom end of the cutting tool11and corresponding to the upper surface of the workpiece W. This structure can cast a shadow of the cutting tool11at a position easily viewable from the user in front of the cutting machine1. A second embodiment of the present disclosure will now be described with reference toFIGS.18to22. A cutting machine80according to the second embodiment includes a lens coupler82in an illuminator81shown inFIG.18, instead of the lens coupler61in the illuminator60shown inFIG.11. The lens coupler82is a single component with two lenses83, or more specifically, a first lens83aand a second lens83bconnected together. The lens coupler82includes three legs88. Each leg88includes a columnar pillar88breceivable in the corresponding through-hole71c(refer toFIG.8) in the substrate71. As shown inFIG.22, the first lens83ais centered on a first center axis89. The first center axis89includes the first light source center72cand is perpendicular to the surface of the first light source72a.The second lens83bis centered on a second center axis90. The second center axis90includes the second light source center72dand is perpendicular to the surface of the second light source72b.The first and second center axes89and90extend in the same direction. The first light source72aand the second light source72bare located with respect to the substrate71and the cutting tool11(refer toFIG.10) in the same positional relationship as in the cutting machine1according to the first embodiment. The second lens83bis laterally symmetrical with the first lens83a.One of the structures of the first lens83aand the second lens83bsimilar to each other will be described in detail below. As shown inFIGS.18and22, the first lens83ahas a substantially conical shape with a diameter increasing from an incidence surface85toward an emission surface86. A first incidence surface85cand a first emission surface86aof the first lens83aeach have an arc-shaped circumference centered on the first center axis89. A second incidence surface85dand a second emission surface86bof the second lens83beach have an arc-shaped circumference centered on the second center axis90. As shown inFIGS.19and22, the first lens83ahas a flat substrate contact surface84at the end face of the incidence surface85. The substrate contact surface84is in contact with the surface of the substrate71. The incidence surface85includes the first incidence surface85cnearer the first lens83aand the second incidence surface85dnearer the second lens83b.The first incidence surface85cincludes an incidence surface recess85arecessed from the substrate contact surface84in the axial direction of the first center axis89. The incidence surface recess85ahas a substantially cylindrical shape centered on the first center axis89. The first light source72ais accommodated in the incidence surface recess85awith the first light source center72con the first center axis89. As shown inFIG.22, the second light source72bis accommodated in the incidence surface recess85anearer the second lens83bwith the second light source center72dlocated on the second center axis90. The substrate71placed into contact with the substrate contact surface84closes the two incidence surface recesses85aeach accommodating the first light source72aor the second light source72b.The incidence surface recess (first incidence surface recess)85anearer the first lens83aand the incidence surface recess (second incidence surface recess)85anearer the second lens83bare separated by the substrate contact surface84between them. As shown inFIG.22, a side surface85bof the incidence surface recess85aat least partially has an arc shape centered on the first light source center72cin a cross section including the first center axis89. The arc-shaped cross section of the side surface85bis mostly located below the surface of the first light source72a.The bottom surface of the incidence surface recess85ahas the shape of a spherical protrusion centered on the first center axis89and protruding toward the first light source72a.The incidence surface recess85aand the side surface85bare included in the incidence surface85through which light from the LEDs72enters the lenses83. As shown inFIG.21, the emission surface86includes the first emission surface86anearer the first lens83aand the second emission surface86bnearer the second lens83b. The first emission surface86aincludes an arc-shaped first circumference86dcentered on the first center axis89. A first outermost portion86fon the first circumference86dis located farthest from and at a first distance r1from the first center axis89. The second emission surface86bincludes an arc-shaped second circumference86ecentered on the second center axis90. A second outermost portion86gon the second circumference86eis located farthest from and at a second distance r2from the second center axis90. Any point on the arc-shaped first circumference86dand the arc-shaped second circumference86ecorresponds to the first outermost portion86fand the second outermost portion86g. As shown inFIG.21, a distance r3between the first center axis89and the second center axis90is shorter than the sum of the first distance r1and the second distance r2. When viewed in the direction of the first center axis89, the first and second emission surfaces86aand86bhas a shape including two arc shapes partially overlapping at the center. The first circumference86dand the second circumference86ecross each other at their ends. The first circumference86dhas an arc shape centered on the first center axis89with a central angle A1. The second circumference86ehas an arc shape centered on the second center axis90with the central angle A1. The central angle A1is greater than 180° and less than 360°. As shown inFIGS.18and22, the first lens83ahas an emission surface protrusion86c.The emission surface protrusion86cprotrudes in the axial direction of the first center axis89at a position radially inward from the first circumference86d.The emission surface protrusion86chas a spherical shape centered on a predetermined point on the first center axis89. The emission surface protrusion86cis included in the emission surface86through which light from the LEDs72is emitted. As shown inFIGS.18and22, the first lens83ahas a substantially conical circumferential surface87. The circumferential surface87connects the circumference of the substrate contact surface84with the first circumference86d.The circumferential surface87includes an outer reflection surface87athat reflects light inside the first lens83a.The outer reflection surface87ahas a diameter that is centered on the first center axis and increases from the first incidence surface85ctoward the first emission surface86a.The outer reflection surface87ahas a convex shape protruding outward in a cross section including the first center axis89. The outer reflection surface87ahas an arc-shaped circumference that is a cross-sectional arc87bin a cross section perpendicular to the first center axis89. The cross-sectional arc87bhas the same shape as the cross-sectional arc66bshown inFIG.17. As shown inFIG.22, light from the second light source center72dof the second light source72benters the lens83through the bottom surface of the incidence surface recess85aor the side surface85b.Light incident through the bottom surface of the incidence surface recess85ais refracted twice, or more specifically, at the bottom surface of the incidence surface recess85aand at the outer circumferential surface of the emission surface protrusion86c.The light is emitted through the outer circumferential surface of the emission surface protrusion86cin the axial direction of the second center axis90. Light incident through the side surface85btravels in the direction normal to the side surface85band is reflected from the outer reflection surface87ain the axial direction of the second center axis90. The light is then directly emitted in the axial direction of the second center axis90from an area between the emission surface protrusion86cand the second circumference86e. Thus, the light emitted through the second emission surface86bis aligned in the axial direction of the second center axis90. Similarly, light from the first light source72aemitted through the first emission surface86ais also aligned in the axial direction of the first center axis89. As shown inFIGS.19and20, the legs88each include a flat externally extending portion88a.The externally extending portion88aextends from the substrate contact surface84laterally from the lenses83. Each pillar88bextends upward from the externally extending portion88a.Thus, the legs88are located outside the path of light passing through the lenses83. The cutting machines1and80according to the embodiments described above may be modified in various manners. In the above embodiments, the lens coupler61or82has the circular first emission surface65dor86aand the second emission surface65eor86bwhen viewed in the axial direction of the first center axis73or89. In some embodiments, the lens coupler may have first and second emission surfaces with, for example, an elliptic shape or an oblong shape including two semicircles and a rectangle connected together when viewed in the axial direction of the first center axis73or89. In the above embodiments, the first lens62aand the second lens62bare included in a single component, and the first lens83aand the second lens83bare included in a single component. In some embodiments, the first lens and the second lens may be separate components. The first lens and the second lens may have different shapes. In the above embodiments, the first center axis73and the second center axis74are parallel to each other, and the first center axis89and the second center axis90are parallel to each other. In some embodiments, for example, the first and second center axes may extend toward the cutting tool11to cross each other. The first light source center72cand the second light source center72dmay be at the luminescence centers with the highest brightness, instead of the geometric centers of the first light source72aand the second light source72b.In the above embodiments, the first center axis73or89and the second center axis74or90extend perpendicular to the surfaces of the first light source72aand the second light source72b.The positional relationship between the first light source72aand the second light source72b,the first center axis73or89, and the second center axis74or90are not limited to this. For example, the structure with the first center axis perpendicular to the first light source includes the structure including the first light source having the main illumination direction parallel to the first center axis. In some embodiments, for example, the structure with the first center axis perpendicular to the first light source includes the positional relationship between the first light source and the first center axis with light emitted parallel to the first center axis from any position on the first emission surface. In the above embodiments, the lens62has the emission surface65with a larger area than the incidence surface64. In some embodiments, the lens may have the emission surface with a smaller area than the incidence surface. The outer reflection surface66aor87a,the spherical protrusion64c,or the emission surface protrusion65bor86cmay have a cross section with, instead of an arc of a perfect circle, any curved shape including an ellipse, a parabola, and a spindle shape. For example, a lamp may be used, instead of an LED. The present disclosure is not limited to a sliding miter saw and is also applicable to a tabletop or portable miter saw without a function of sliding a machine body. REFERENCE SIGNS LIST 1cutting machine (first embodiment)2base2arotation shaft3sub-table4turntable4atable upper surface4barm supporter5table extension5acutting edge plate5bgroove6positioning fence6apositioning surface7miter scale plate7afixing screw7bpositioning recess10machine body10avertical swing support shaft11cutting tool11aright side surface11bleft side surface12stationary cover12aarrow12bthreaded hole13movable cover13athrough-hole14fixing screw15outer flange16inner flange17dust-collection guide17adust-collection hose18rear dust-collection port18adust-collection hose20motor housing20ainlet20boutlet21electric motor22gear housing23output shaft25battery mount26battery pack27controller housing28controller30handle unit31operation handle32switch lever33lock-off button34illuminator switch40body support arm40alateral tilt support shaft41slide bar42slide base45turntable fixing mechanism46grip unit47fixing rod50positive lock unit51unlock lever52positioning pin60illuminator61lens coupler62lens62afirst lens62bsecond lens63substrate contact surface64incidence surface64aincidence surface recess (first incidence surface recess, second incidence surface recess)64bside surface64cspherical protrusion64dfirst incidence surface64esecond incidence surface65emission surface65aarc-shaped recess65bemission surface protrusion65ccenter recess65dfirst emission surface65esecond emission surface65ffirst circumference65gsecond circumference65hfirst outermost portion65isecond outermost portion66circumferential surface66aouter reflection surface66bcross-sectional arc67leg67aexternally extending portion67bpillar67cenlarged-diameter portion70illuminator cover70afastening bolt70bthrough-hole70cthreaded hole71substrate71aLED controller71b,71cthrough-hole71dfastening bolt72LED (light source)72afirst light source72bsecond light source72cfirst light source center72dsecond light source center73first center axis74second center axis80cutting machine (second embodiment)81illuminator82lens coupler83lens83afirst lens83bsecond lens84substrate contact surface85incidence surface85aincidence surface recess (spherical protrusion, first incidence surface recess, second incidence surface recess)85bside surface85cfirst incidence surface85dsecond incidence surface86emission surface86afirst emission surface86bsecond emission surface86cemission surface protrusion86dfirst circumference86esecond circumference86ffirst outermost portion86gsecond outermost portion87circumferential surface87aouter reflection surface87bcross-sectional arc88leg88aexternally extending portion88bpillar89first center axis90second center axisW workpieceS imaginary planeL radiated rayA1, A2central angler1first distancer2second distancer3distance (between first center axis and second center axis)K predetermined angle | 52,012 |
11858083 | DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS OF THE INVENTION The present invention may be described herein in terms of various components. It should be appreciated that such components may be realized by any number of structural materials and components configured to perform the specified functions. For example, the present invention may be practiced in any number of dental contexts and the exemplary embodiments relating to positioning dental material blanks in a manufacturing apparatus are merely a few of the exemplary applications for the invention. For example, the principles, features and methods discussed may be applied to any crown and bridge restorative dentistry or prosthetic dentistry application. In accordance with various aspects of the present invention, a generic dental blank Positioning device is provided to allow an easy, repeatable and accurate placement of a dental blank in a holder of a manufacturing apparatus. Dental blanks may be made in a unique shape for a certain manufacturing device or made in a generic universal shape (for instance, in approximately 98.5 mm diameter) and in various thicknesses. In the case a blank requires to be positioned multiple times in the holder of a manufacturing device, the blank may be designed or later modified with one or more notches or other geometrical features to have a unique position in the holder of the manufacturing device. The notches may mate with the holder directly or indirectly. To avoid unique combinations of blank and holder and to reduce the manufacturing costs of a blank, a generic blank positioning device is provided that may be used on all generically-shaped blank. Other material blanks, as exemplified inFIGS.6c-f, may be incorporated with customized aspects as desired for other unexpected synergies in positioning the material blanks in blank holders. In accordance with an exemplary embodiment, the blank positioning device may be made of a variety of materials commonly known in the industry like steel or plastics. Other materials known in the arts to interact without dental prosthetic materials are well within the scope of this invention. For example, with reference to an exemplary embodiment illustrated inFIG.1a,FIG.1bandFIG.1c, the blank positioning device2may be clamped around the dental blank by tightening the bold and nut3. The bold and nut may serve at least two purposes: first to clamp the positioning device2around the blank1and second to create the index feature3. Other clamping mechanisms or assemblies known in the arts to stabilize, grasp, or otherwise provide a handle to an object are well within the scope of the invention. As further explored inFIGS.6c-f, other tools for handling grooved or rimmed objects may be available within the scope of this invention. With reference to an exemplary embodiment illustrated inFIG.2aandFIG.2b, positioning device2may be clamped around the dental blank1and positioned in the holder4. This position is further illustrated inFIG.3aandFIG.3b, with index feature3interacting with blank holder4at index position5. According to inventive methods, the dental blank1with the mounted positioning device2may be removed from the holder4and placed back in the holder at a later stage at the same position. The unique index position5can be later located accurately by touching or seating the index feature3to the holder4at the index position5. In other embodiments of the invention, the index feature may be held at a set distance or otherwise indirectly positioned at a set relationship from the index position rather than directly touching. In still other embodiments, the holder4may have multiple chambers for secondary securement/locking. With reference to an exemplary embodiment illustrated inFIGS.4aand4b, the positioning device2may be secured about the blank1utilizing a shrink fit method and material. In other embodiments the positioning device2may be secured by use of a material-appropriate glue as understood in the arts, depending upon the type of material blank. An exemplary embodiment of index feature3as seen inFIG.4bmay create an index position5with the blank holder4. The index feature or element3is shown as having an abutment element that extends towards an internal wall of a chamber of the blank holder4, or the index receiving feature. In alternative designs, the abutment element may resemble any number of geometric configurations, having linear or curved portions. For example, with reference to an exemplary embodiment illustrated inFIG.5athrough5d, the index feature3may resemble a pin securing into a chamber in blank holder4. In this embodiment, the positioning device2comprises an arm extending distally from the blank1so that it may be held above or supra the blank holder4. Index feature or element3in this embodiment then extends downward from the positioning device2into a generally complementary chamber or index receiving feature of the blank holder4, securing and recording the position of the blank for future reference and later modifications of the material blank that would benefit from consistent positioning. For instance, CAD CAM or other software that automates a milling process of the material blank for multiple layers of a dental prosthesis may be improved by the ability to begin with a set position of the material blank. In alternative embodiments within the scope of the invention, the positioning device, indexing element, and index receiving chamber may vary from that depicted in illustrations, having a scope that includes structures of alternative geometric and volumetric configurations having linear or curved portions that may seat downward or upward into a chamber of the holder4. For example, with reference to an exemplary embodiment illustrated inFIGS.6a-fas alternative embodiments of how the positioning device2may be positioned around the dental blank1are depicted.FIG.6a-fillustrates different embodiments of how the positioning device2may fit about the dental blank1. Positioning device2is shown as being flush to the material blank1as seen in6aand6b. The material blank1in this embodiment may meet the positioning device without modification, so standard shaped blanks are available for implementation in the inventive device and method of using thereof. In an alternative embodiment of the invention for the relationship of the positioning device to the material blank,FIGS.6c-6ddepict a material blank1that has been modified to include a groove into which the positioning device2may mate. Material blank1may be manufactured to have a groove or other concave indentation, or as part of an after-market modification. Other variations of this embodiment are within the scope of the invention, such as an indentation into the blank that includes any type of geometric shapes, including linear and curved, and complementary structures on the positioning device2. In still another alternative embodiment of the invention regarding the relationship of the positioning device to the material blank, the material blank1may include an external element such as a rim as depicted inFIG.6eandFIG.6f. Material blank1may be manufactured to have an external element or it may have one added as part of an after-market modification. Other variations of this embodiment are within the scope of the invention, such as an external element that includes any type of geometric shapes including linear and curved, and complementary structures on the positioning device2. The positioning device2may be secured to the blank1by a bold and nut assembly, shrink fit, friction fit, glued, or other methods known in the arts to secure to a prosthetic material. Other methods of detachably affixing positioning device to blank, not illustrated, are within the scope of the invention. As illustrated inFIGS.6c-f, the position to the blank may be in a notch, flush or on a rim of either the material blank, the positioning device, or a combination thereof. | 7,965 |
11858084 | DETAILED DESCRIPTION OF THE INVENTION InFIG.1, which shows the exemplary embodiment of the invented tool turret, a base body1can be connected to a machine tool (not shown). The base body1has a circular cylindrical central part3concentric to a turret axis, on which a tool disk5is rotatably installed around the turret axis. On the outer circumference, the tool disk5has twelve work stations7, five of which are visible in the plan view ofFIG.1. To each of work station, a holder9intended for receiving a machining tool can be detachably immobilized. Of the holders9, of which seven are visible inFIG.1, only one holder9, which is in the central working position inFIG.1and marked11, is equipped with a machining tool13. InFIG.2, which shows the tool disk5in a central cross-section having a radial sectional plane, the working position11is in the “3 o'clock” position, relative to the orientation of the drawing sheet ofFIG.2, As inFIG.1, the holder9located in the working position11is equipped with a machining tool13in the form of a milling tool. As inFIG.1, the other holders9are not shown equipped with machining tools13for the sake of clarity of the drawing, and inFIG.2, as well as inFIG.3, the holders9are schematically simplified. The design of the holders9is described in more detail below with reference toFIGS.7and8. The tool turret has a direct drive in the form of an electric motor15integrated into the tool disk5. The electric motor15drives a drive shaft17, which not only provides the tool drive for a rotating machining tool13, but also the drive for the automatic tool changing processes. For this purpose, the electric motor15can be controlled in terms of speed, direction of rotation and angle of rotation increments. The drive shaft17can be axially displaced between a disengaged position and an engaged position by a sliding clutch19, the details of which can be more clearly seen inFIGS.2aand3a. The drive shaft17is pretensioned by a compression spring21for movement into the engaged position. AsFIGS.2aand3ashow, the sliding clutch19has a pressure chamber23for hydraulic actuation, which, when supplied with pressure by the hydraulic system of the tool turret, moves the drive shaft17in conjunction with its bearing unit25against the force of the pressure spring21into the disengaged position shown to the left in the figures. In the disengaged position shown, the second clutch end27opposite the sliding clutch19is in clutch engagement with a pivoted dihedron29, as shown best inFIG.2b, which is used to re-disengage the clutch end27when the drive shaft17assumes the engaged position. The rotatory dihedron29, which is in the “9 o'clock” position, i.e. in the tool changing position in relation to the orientation ofFIGS.2and3, causes, as explained below, the closing and opening of a bayonet fitting immobilizing the relevant holder9by turning. The holders9are attached to the individual work stations7by clamping devices fixed on the tool disk5, each formed by a clamping ring31, the design of which is most clearly shown inFIGS.4to6. As shown, the clamping ring31has a shell part33, which forms the receiving housing for the holder9to be immobilized, as well as an outer ring35, which surrounds the shell part33at the input end for the individual holder9. The outer ring35has an external thread38, as shown inFIGS.2aand3a, which is used to bolt it to the tool disk5such that the outer ring35forms the stationary part of the clamping ring31. For a hydraulically actuated clamping procedure, a hydraulic chamber37(seeFIG.4) is formed in shell part33. The chamber pressure of hydraulic chamber37can be adjusted via a hydraulic piston39, which can be actuated by an actuating device. It has a set screw41having a hexagon head43. The chamber pressure in the hydraulic chamber37increased by turning the set screw41clockwise causes a displacement of the shell part33relative to the stationary outer ring35, to the right inFIG.4. By three immobilization projections45, which protrude radially inwards on the inside of the receiving space of the shell part33, a clamping operation is effected via a bayonet fitting formed between the shell part33and the holder9. AsFIGS.7and8show, the holder9has longitudinal guides46to form the bayonet fitting on a shaft part42. Shaft part42can be received in the receiving space of the shell part33and surrounds a spindle shaft55of the holder9. Through longitudinal guides46, the immobilization projections45penetrate when the holder9is inserted into the receiving space and reach a position above the holding surfaces48of the shaft part42when the holder9is turned, such that a closed bayonet fitting is formed by the immobilization parts45and the holding surfaces48and the hydraulic clamping force is effective between the immobilization parts45and holding surfaces48. The clamping movement of the shell part33, which is executed using a short stroke length, counteracts the effect of a leaf spring ring47, which is fastened to the opening edge of the shell part33by bolts49and is supported on the outer ring35by lugs51projecting radially outward. When the chamber pressure in the hydraulic chamber37is reduced by turning the set screw41counterclockwise, the shell part33is then returned from the clamping position, i.e. the immobilization projections45no longer bear tightly against the holding surfaces48and the bayonet fitting formed can be released again by turning the holder9. As mentioned above,FIGS.2and3show the drive shaft17in the disengaged state. For the drive of the machining tool13of the holder9immobilized in the working position inFIGS.2and2a, the drive shaft17moved into the engaged position with the assigned clutch end comes into clutch engagement with a clutch part53of the spindle shaft55of the relevant holder9. Starting from the tool disk5equipped with holder9, the tool changing process, in which the machining tool13of the holder9, which is in the working position11shown inFIGS.2and2a, is to be exchanged, is performed in several stages. The tool disk5is swiveled clockwise by 12° when the drive shaft17is in the disengaged position such that the hexagon socket59at the clutch end of the drive shaft17is in alignment with the hexagon head43of the set screw41of the assigned clamping device31. By depressurizing the pressure chamber23of the sliding clutch19, the compression spring21moves the drive shaft17into the engaged position resulting in the hexagon socket59at the clutch end of the drive shaft17engaging with the hexagon head43of the set screw41in a clutch manner. By turning the drive shaft17in the opposite direction, the set screw41is turned counterclockwise, reducing the chamber pressure in the hydraulic chamber37, and in that way the clamping force of the tensioning device31is released with the aid of the restoring force of the spring ring47. The holder9is now secured without hydraulic clamping force solely by the bayonet fitting formed between the immobilization projections45of the clamping ring31and the holding surfaces48of the holder9. Using the sliding clutch19, the drive shaft17is now again moved into the disengaged position against the force of the pressure spring21, and the tool disk5is swiveled clockwise until the holder9to be exchanged is in the change position58, i.e. in the “9 o'clock” position. As shown most clearly inFIG.2b, in this position the lateral arms of the dihedron29extend into the space between side walls61, which protrude in the form of partial cylinders at the inner end face of the shell part33of the clamping ring31, cf.FIGS.4to6. When the drive shaft17is disengaged, it is in clutch engagement with the clutch end27facing the dihedron29and the dihedron29. A robot accesses this holder9to be changed via gripping grooves63(FIGS.7and8), which are located on the holder9. The bayonet fittings45,48are now unlocked by turning the drive shaft17by 120°, i.e. then the robot can remove the holder9. The robot places the holder9in a magazine and picks up the holder9of the new tool13to be used and positions this holder9in the change position58. The dihedron29is used to close the bayonet fitting again by turning the shell part33by approximately 120°. The robot then unlocks the holder9. By turning the tool disk5, the holder9having the tool13to be used is swiveled into the adjusting position57, in which the facing clutch end of the drive shaft17is flush with the set screw41of the clamping ring31. By transferring the drive shaft17into the engaged position, the holders9of the new tool13can now be hydraulically clamped by turning the set screw41clockwise, along the lines of the loosening process. After transferring the drive shaft17to the disengaged position, the tool disk5can swivel the exchanged holder9back to the working position11, thereby completing the tool changing process and the drive shaft17can be moved to the engaged position to drive the exchanged machining tool13. While one embodiment has been chosen to illustrate the invention, it will be understood by those skilled in the art that various changes and modifications can be made therein without departing from the scope of the invention as defined in the claims. | 9,178 |
11858085 | DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS An exemplary embodiment according to the present application is shown inFIGS.1-15. The exemplary embodiment illustrates a power tool, in particular, a cordless random orbit sander (ROS)10. The sander10of the exemplary embodiment is a random orbit sander. The sander10is powered by a removable and rechargeable battery pack100. The sander10is turned on and off by a switch11. As is well known, the sander10rotates a platen200in a random orbit to remove materials. The sander10of the present exemplary embodiment is a random orbit sander, but in other exemplary embodiments the sander could be a different type of sander, such as an orbit sander, a detail sander or a quarter-sheet sander. As shown, the sander10further includes a dust chute130which directs dust into a dust bag135for collection. The housing20of the sander10is comprised of three housing parts including a first housing part/first side part30, a second housing part/second side part40and a third housing part/top housing part50. The three housing parts are each made of plastic and are assembled together by screws. The three housing parts30,40and50can be seen throughout the drawings and are shown in exploded views inFIGS.10and11. The housing parts30,40,50come together to form a battery receptacle portion60. As will be appreciated, the battery receptacle portion60receives a removable battery pack100which powers the sander10. Internals of the sander are shown inFIGS.8and9, in which the first side part30and the top housing part50have been removed. As shown inFIGS.8and9, a motor80rotates an output shaft81which rotates a fan83and the sanding platen200. A bearing82supports the output shaft81. The platen200receives the output shaft81in an eccentric manner so that the platen200moves in an orbital motion when driven by the motor80. As shown inFIG.5, the battery receptacle portion60includes a first rail42and a second rail51. It also includes an electrical connection section62which includes a number of electrical connectors63. The electrical connectors63engage electrical connectors from the battery pack100so that the pack100can provide power to the motor80. The first rail42is made up of a rail section31from the first housing part30and a rail section41from the second housing part40. The second rail51is formed from the top housing part50. As seen, the rails42and51are generally perpendicular to a rotational axis of the motor80. They also run horizontally when the sander10is placed on a flat horizontal surface. Additionally, the electrical connector section62is sandwiched between the second housing part40and the top housing part50. The three part construction of the sander housing20allows for an efficient design, assembly and for construction of the rails42and51. As can be appreciated, in order to assemble the sander20, various parts such as the motor80can be inserted into the second housing part40. After that, the first housing part30and the second housing part40are connected to one another to secure the motor80therebetween. Bringing the first housing part30and the second housing part40together forms the first rail42out of the rail section31from the first housing part30and the rail section41from the second housing part40. The electrical connector section62is inserted into the second housing part40at the slot65shown inFIG.7.FIG.7shows the housing parts30and40without the electrical connector section62, which allows the slot65to be seen. After the electrical connector section62is inserted into the slot65, the top housing part50is then connected to the first and second housing parts30,40to provide the second rail51and to secure the electrical connector62. Some of the above steps may be done in various orders or configurations. For example, one or more of the motor80, bearing82, fan83and other parts may be inserted into the first housing part30instead of the second housing part40so long as they can be clamped between the two housing parts30,40. Additionally, the electrical connector section62may be inserted before or after the first housing part30and the second housing part40are connected. The three-part housing construction of the exemplary embodiment may have several advantages. For example, clamping operations in more than one direction can be performed. That is, the motor80can be held between the first and second housing sections30,40. Due to its location and the construction of the housing20, the electrical connection section62cannot is not clamped between the first and second housing sections30,40. However, the electrical connection section62can be held between the second housing section40and the top housing section50. Particularly, the electrical connection section62can be inserted into the second housing part40from a vertical direction. The top housing section50can then be assembled onto the first and second housing parts30,40from the vertical direction to hold the electrical connection section62in place. As will be appreciated, the exemplary embodiment of the present application allows for multiple clamping or holding operations between housing parts to take place. For example, the motor80can be held between the first and second housing parts30,40in a first operation in a first direction and the electrical connection section62can be held between the top housing part50and the second housing part. The battery pack100for powering the sander10is shown in further detail inFIGS.12-15.FIG.12is a perspective view of the pack100.FIG.13is a perspective view of the pack100with a lower part of the pack housing201removed.FIG.14is a side view of the pack100with a lower part of the pack housing201removed.FIG.15is a top view of the pack100with the pack housing201removed. The power tool battery pack100includes a set of rechargeable battery cells220disposed in a housing201. The housing201includes guide rails104for engaging the rails42and51of the sander housing20. The rails104slide between the rails42,51and the rest of the sander housing20and the rails42,51guide the battery pack100into place and prevent it from moving away from the motor80area of the housing20. The battery pack100includes a latch105for securing the battery pack100in place. The latch105is biased upwardly by a spring (not shown) and the latch105can be moved by depression of the latch actuator106, which may be integral with the latch105. A battery pack with guide rails such as those shown these figures is more fully shown and described in U.S. Pat. No. 6,729,413, which is incorporated herein by reference in its entirety. The battery pack100also includes a connection section103through which the battery pack100can make connection with the sander10. The connection section includes four openings111,112,113and114. FIGS.13-15each have at least part of the battery pack housing201removed. As shown, the pack100includes a plurality of rechargeable battery cells220. A cradle16(FIG.14) sits over the battery cells220and a printed circuit board (PCB)140(FIG.15) is connected to the cradle16. The PCB140is in electrical connection with the battery cells220. Electric connectors121,122,123and124are mounted on the PCB140and connect with power tools through the connection section103, specifically openings111,112,113and114shown inFIG.12. The electrical connecters serve as terminals for the battery pack100. Connector121may serve as a negative terminal; connector122may be a temperature terminal which relays information related to a temperature of the battery pack; connector123may be an ID terminal which relays information related to identifying the pack and connector124may be a positive terminal. The battery pack100electrically connects with the sander10at the battery pack electrical connector section62. The electrical connector section62includes three electrical connectors63. The electrical connectors63connect with the positive, negative and temperature terminals121,124and122of the battery pack10. The ID terminal123of the battery pack100is used when charging the battery pack100. The battery pack100may be charged by a separate battery pack charger (not shown). While the invention has been described by way of exemplary embodiments, it is understood that the words which have been used herein are words of description, rather than words of limitation. Changes may be made within the purview of the appended claims, without departing from the scope and spirit of the invention in its broader aspects. | 8,472 |
11858086 | DETAILED DESCRIPTION The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly. In some instances, a chemical-mechanical polishing (CMP) tool may utilize a slurry to planarize a semiconductor device. For example, a CMP tool may utilize an abrasive and corrosive chemical slurry (e.g., commonly a colloid) in conjunction with a polishing pad and retaining ring, typically of a greater diameter than the semiconductor device, when planarizing the semiconductor device. Different slurries may be required when planarizing different layers of a semiconductor device due to different materials being utilized with different layers. The average number slurry generations required for semiconductor processing has increased dramatically over time. Current techniques require between seven and forty days to modify a slurry tool for a different slurry, which negatively impacts a semiconductor processing schedule. Such current techniques produce slurries with a quality error of between thirty and one-hundred and seventy parts per million (ppm) of contamination, resulting in differences in the quality of the slurry provided for semiconductor processes. Thus, current techniques produce imprecise and inconsistent slurries, and are unable to meet slurry requirements for a large quantity of advanced semiconductor processes. According to some implementations described herein, a high-throughput, precise semiconductor slurry blending tool may generate high quality slurries that meet slurry requirements for a large quantity of advanced semiconductor processes. For example, the high-throughput, precise semiconductor slurry blending tool may include a blending tank to receive and blend one or more materials into a slurry, and at least one inlet pipe connected to the blending tank and to provide the one or more materials to the blending tank. The at least one inlet pipe may vertically enter the blending tank and may not contact the blending tank. The high-throughput, precise semiconductor slurry blending tool may include a blending pump partially provided within the blending tank and to blend the one or more materials into the slurry, and an outlet pipe connected to the blending pump and to remove the slurry from the blending tank. In this way, the high-throughput, precise semiconductor slurry blending tool may generate high quality slurries that meet slurry requirements for a large quantity of advanced semiconductor processes. For example, the high-throughput, precise semiconductor slurry blending tool may produce high quality slurries (e.g., with a quality error of seventeen ppm of contamination), and may only require one day to modify a semiconductor slurry blending tool for a different slurry. This may significantly reduce cycle times associated with a semiconductor processing schedule (e.g., by two-hundred and thirty days over the course of a year), and may result in significant cost savings each year. Furthermore, the high-throughput, precise semiconductor slurry blending tool may improve flexibility of slurry blending by dynamically adjusting a blending recipe and measuring a difference in raw material quality. FIGS.1A and1Bare diagrams100of a semiconductor slurry blending tool described herein. As shown inFIG.1A, the semiconductor slurry blending tool may include a blending tank110, legs120, a support base130, reinforced support feet140, inlet pipes150, a blending pump160, and a tank level sensor bracket170. Blending tank110may include a tank to receive and store materials that are blended to make slurries. Blending tank110may be sized and shaped depending on required volumes of slurries to be produced by the semiconductor slurry blending tool. For example, blending tank110may be sized to store two-hundred and fifty (250) liters or more of a slurry or materials to make the slurry. Blending tank110may be cylindrical in shape to aid in the blending process, but may be other shapes, such as box-shaped, spherical, and/or the like. In some implementations, blending tank110is constructed of a material or materials that are resistant to abrasion and/or corrosion caused by a slurry and/or materials to make the slurry. For example, blending tank110may be constructed of polyvinyl chloride (PVC), chlorinated PVC (CPVC), polyvinylidene difluoride (PVDF), polypropylene, polyethylene, and/or the like. In some implementations, blending tank110includes walls with thicknesses that provide a rigid structure capable storing and/or blending more than two-hundred and fifty (250) liters of materials. Legs120may connect to blending tank110and support base130and may support blending tank110on support base130. Three or more legs120may be connected to a bottom surface of blending tank110and to a top surface of support base130(e.g., via connectors, such as screws, bolts, welding, glue, and/or the like). In some implementations, legs120are constructed of a material or materials that are rigid enough to support a weight of blending tank110as well as a weight of the slurry or materials provided in blending tank110. For example, legs120may be constructed of a material or materials (e.g., steel, aluminum, and/or the like) capable of supporting a weight of more than two-hundred (200) kilograms. Support base130may connect to legs120and may support blending tank110and legs120. As shown, support base130may be rectangular or box-shaped, but may be other shapes, such as cylindrical. In some implementations, support base130is constructed of a material or materials that are rigid enough to support a weight of blending tank110as well as a weight of the slurry or materials provided in blending tank110. For example, support base130may be constructed of a material or materials (e.g., steel, aluminum, concrete, and/or the like) capable of supporting a weight of more than two-hundred (200) kilograms. In some implementations, support base130includes a scale to measure weights of slurries and/or materials to make slurries stored in blending tank110. The scale may enable accurate measurements of materials provided to blending tank110and/or slurries generated by blending tank110. Alternatively, the scale may be provided separately from support base130. Reinforced support feet140may connect to support base130and may support blending tank110, legs120, and support base130. Three or more reinforced support feet140may be connected to a bottom surface of support base130(e.g., via connectors, such as screws, bolts, welding, glue, and/or the like). In some implementations, reinforced support feet140are constructed of a material or materials that are rigid enough to support a weight of blending tank110, a weight of the slurry or materials provided in blending tank110, a weight of legs120, and a weight of support base130. For example, reinforced support feet140may be constructed of a material or materials (e.g., steel, aluminum, and/or the like) capable of supporting a weight of more than two-hundred (200) kilograms. In some implementations, when support base130includes the scale, reinforced support feet140are connected at particular positions under support base130to ensure that the scale provides accurate measurements of materials provided to blending tank110and/or slurries generated by blending tank110. Inlet pipes150may be provided through the top surface of blending tank110and may provide the materials (e.g., water, abrasive chemical materials, corrosive chemical materials, and/or the like) to make slurries to blending tank110. In some implementations, two or more inlet pipes150are provided through the top surface of blending tank110. In some implementations, inlet pipes150are constructed of a material or materials that are resistant to abrasion and/or corrosion caused by the materials to make the slurry. For example, inlet pipes150may be constructed of PVC, CPVC, PVDF, polypropylene, polyethylene, and/or the like. In some implementations, inlet pipes150include walls with thicknesses that provide a rigid structure capable of handling pressurized provision of the materials to blending tank110. Further details of inlet pipes150are described below in connection withFIGS.1B and2B. Blending pump160may connect to the bottom surface of blending tank110and may be partially provided within an interior of blending tank110. Blending pump160may mechanically stir materials provided to blending tank110to ensure a homogenous blend of a slurry. Blending pump160may transfer the slurry to a reservoir for storage and/or to a CMP tool for utilization. In some implementations, blending pump160is constructed of a material or materials that are resistant to abrasion and/or corrosion caused by the materials to make the slurry. For example, blending pump160may be constructed of PVC, CPVC, PVDF, polypropylene, polyethylene, and/or the like. Further details of blending pump are described below in connection withFIGS.1B,2A, and3B. Tank level sensor bracket170may be spaced apart from outer walls of blending tank110and may retain multiple tank level sensors that measure a level of materials or slurry provided in blending tank110. In some implementations, tank level sensor bracket170is constructed of a material or materials that are rigid enough to support weights of the multiple tank level sensors. For example, tank level sensor bracket170may be constructed of steel, aluminum, plastic, and/or the like. Further details of tank level sensor bracket170and the multiple tank level sensors are described below in connection withFIG.3A. FIG.1Bprovides a cutaway view of an interior of blending tank110. As shown, blending tank110may be cylindrical in shape and may include openings180provided through a top of blending tank110. Openings180may be provided to receive inlet pipes150within blending tank110. As further shown inFIG.1B, inlet pipes150may extend through openings180and into the interior of blending tank110. A portion of blending pump160may also extend into the interior of blending tank110. The portion of blending pump160extending into blending tank110may be utilized to mechanically stir materials provided to blending tank110. As indicated above,FIGS.1A and1Bare provided merely as one or more examples. Other examples may differ from what is described with regard toFIGS.1A and1B. FIGS.2A and2Bare further diagrams200of portions of the semiconductor slurry blending tool described herein. As shown inFIG.2A, blending pump160may connect with an outlet pipe210. Outlet pipe210may provide a slurry from blending tank110to a reservoir for storage and/or to a CMP tool for utilization. In some implementations, outlet pipe210is constructed of a material or materials that are resistant to abrasion and/or corrosion caused by the slurry. For example, outlet pipe210may be constructed of PVC, CPVC, PVDF, polypropylene, polyethylene, and/or the like. In some implementations, outlet pipe210includes a wall with a thickness that provides a rigid structure capable of handling pressurized provision of the slurry to the reservoir or the CMP tool. As shown by reference number220, outlet pipe210may be constructed of a material that has undergone a stress relief heat treatment. Stress relief heat treatment includes heating outlet pipe210to a glass transition temperature in order to cause stress molecular lattices between plastics to rearrange to release stress from outlet pipe210. This may prevent damage to outlet210caused by the slurry exiting blending tank110. As further shown inFIG.2A, another outlet pipe230may connect with outlet pipe210via a single point of connection240. Outlet pipe230may provide a slurry from blending tank110to a reservoir for storage and/or to a CMP tool for utilization. In some implementations, outlet pipe230is constructed of a material or materials that are resistant to abrasion and/or corrosion caused by the slurry. For example, outlet pipe230may be constructed of PVC, CPVC, PVDF, polypropylene, polyethylene, and/or the like. In some implementations, outlet pipe230includes a wall with a thickness that provides a rigid structure capable of handling pressurized provision of the slurry to the reservoir or the CMP tool. In some implementations, outlet pipe230is constructed of a material that has undergone a stress relief heat treatment to prevent damage to outlet pipe230cause by the slurry exiting blending tank110. The single point of connection240(e.g., via an elbow connector) may relieve stress in outlet pipe210and/or outlet pipe230relative to current slurry tool configurations, which may extend a useful life of outlet pipe210and/or outlet pipe230and may prevent damage to outlet pipe210and/or outlet pipe230caused by the slurry. As shown inFIG.2B, and by reference number250, inlet pipes150may vertically enter blending tank110through openings180and may vertically extend into the interior of blending tank110. In some implementations, openings180are sized so that inlet pipes150do not contact blending tank110, as indicated by reference number260. Providing inlet pipes150vertically into blending tank110, without contacting blending tank110, may relieve stress in inlet pipes150relative to current slurry tool configurations, which may extend useful lives of inlet pipes150. As further shown inFIG.2B, and by reference number270, inlet pipes150may be associated with pressure relief devices that connect to material inlet valves with driving air source pipes. Adding the pressure relief devices to the driving air source pipes of material inlet valves improves speeds of operations of the material inlet valves, prevents feeding errors caused by delayed closings of the material inlet valves, controls provision of the materials to blending tank110, and/or the like. As indicated above,FIGS.2A and2Bare provided merely as one or more examples. Other examples may differ from what is described with regard toFIGS.2A and2B. FIGS.3A and3Bare further diagrams300of portions of the semiconductor slurry blending tool described herein. As shown inFIG.3A, tank level sensor bracket170may be provided adjacent to blending tank110, and may retain multiple tank level sensors310. Tank level sensors310may include sensors that measure a level of materials or slurry provided in blending tank110. For example, tank level sensors310may include optical sensors that capture images of the wall of blending tank110and the materials or slurry provided in blending tank110. In such an arrangement, the wall of blending tank110may be transparent or partially transparent so that the level of the materials or the slurry provided in blending tank110may be seen through the wall and captured by the optical sensors. As further shown inFIG.3A, and by reference number320, tank level sensor bracket170and tank level sensors310may not contact the wall of blending tank110. Preventing tank level sensors310from contacting the wall of blending tank110may relieve stress in signal wires of tank level sensors310relative to current slurry tool configurations, which may prevent damage to the signal wires. Furthermore, blending tank110and tank level sensors310may be protected from damage that may occur when tank level sensors310contact the wall of blending tank110. For example, if tank level sensors310contact the wall of blending tank110, movement of blending tank110may cause tank level sensors310to rub against and possibly damage the wall of blending tank110and/or tank level sensors310. As shown inFIG.3B, blending pump160may connect with blending tank110, outlet pipe210, and outlet pipe230, as described above. As further shown inFIG.3B, and by reference number330, a cycle for blending pump160may start after all the slurry materials are provided to blending tank110by inlet pipes150. Preventing blending pump160from starting until inlet pipes150provide all of the slurry materials to blending tank110may reduce vibration in the semiconductor slurry blending tool relative to current slurry tool configurations. Preventing blending pump160from starting until inlet pipes150provide all of the slurry materials to blending tank110may also improve a quality of the slurry. For example, if blending of the materials in blending tank110occurs when there is a disproportionate quantity of materials in blending tank110would impact the quality of the slurry relative to waiting until all of the materials are received in blending tank110(e.g., a proportionate quantity of materials). As indicated above,FIGS.3A and3Bare provided merely as one or more examples. Other examples may differ from what is described with regard toFIGS.3A and3B. FIGS.4A and4Bare diagrams400of example tables associated with the semiconductor slurry blending tool described herein. As shown inFIG.4A, and by table410, the semiconductor slurry blending tool may include several improved designs (e.g., relative current slurry tool configurations) that address influence factors (e.g., problems, such as piping stress, sensor signal cable stress, vibration, structural load bearing, feeding control, and/or the like) and improve an accuracy of weight measurement (e.g., by the scale of support base130) of slurries generated by the semiconductor slurry blending tool. For example, outlet pipe230may connect with outlet pipe210via a single point of connection, as indicated by reference number240inFIG.2A. The single point of connection may relieve stress in outlet pipe210and/or outlet pipe230and may improve an accuracy of weight measurement by ±10 grams. As further shown in table410, outlet pipe210may be constructed of a material that has undergone a stress relief heat treatment, as described above in connection withFIG.2A. Stress relief heat treatment may cause stress molecular lattices between plastics to rearrange to release stress from outlet pipe210, and may improve an accuracy of weight measurement by ±10 grams. Inlet pipes150may vertically enter blending tank110through openings180and may vertically extend into the interior of blending tank110, as described above in connection withFIG.2B. Providing inlet pipes150vertically into blending tank110may relieve stress in inlet pipes150and may improve an accuracy of weight measurement by ±5 grams. Openings180may be sized so that inlet pipes150do not contact blending tank110, as further described above in connection withFIG.2B. Preventing inlet pipes150from contacting blending tank110may relieve stress in inlet pipes150and may improve an accuracy of weight measurement by ±5 grams. As further shown in table410, tank level sensor bracket170may prevent tank level sensors310from contacting a wall of blending tank110, as described above in connection withFIG.3A. Preventing tank level sensors310from contacting the wall of blending tank110may relieve stress in signal wires of tank level sensors310and may improve an accuracy of weight measurement by ±3 grams. A cycle for blending pump160may start after all the slurry materials are provided to blending tank110by inlet pipes150, as described above in connection withFIG.3B. Preventing blending pump160from starting until inlet pipes150provide all of the slurry materials to blending tank110may reduce vibration in the semiconductor slurry blending tool and may improve an accuracy of weight measurement by ±50 grams. As further shown in table410, reinforced support feet140may connect to support base130and may support blending tank110, legs120, and support base130, as described above in connection withFIG.1A. Providing reinforced support feet140may improve structural load bearing of the semiconductor slurry blending tool and may improve an accuracy of weight measurement by ±20 grams. Inlet pipes150may be associated with the pressure relief devices that connect to the material inlet valves with the driving air source pipes. Adding the pressure relief devices to the driving air source pipes of material inlet valves improves speeds of operations of the material inlet valves, prevents feeding errors caused by delayed closings of the material inlet valves, controls provision of the materials to blending tank110, and/or the like. Adding the pressure relief devices to the driving air source pipes of material inlet valves may improve an accuracy of weight measurement by ±50 grams. As shown inFIG.4B, and by table420, a linear measurement of materials or slurries provided in the semiconductor slurry blending tool may include providing increasing standard weights (in kilograms) of the materials or the slurries in blending tank110, determining measurement weights (in kilograms) of the materials or the slurries in blending110(e.g., with the scale of support base130), and calculating differences (in grams) between the standard weights and the measurement weights. As shown by table420, the standard weights and measurements weights are nearly identical, with a largest measurement error of 3 grams. Thus, the semiconductor slurry blending tool provides much more accurate measurements of the materials or the slurries in blending tank110relative to current slurry tool configurations. As further shown inFIG.4B, and by table430, a reproducibility measurement of materials or slurries provided in the semiconductor slurry blending tool may include providing a standard weight (e.g., 50 kilograms) of the materials or the slurries in blending tank110, determining measurement weights (e.g., in kilograms) of the materials or the slurries in blending tank110(e.g., with the scale of support base130) six times, and calculating differences (in grams) between the standard weights and the measurement weights. As shown by table430, the standard weight and the repeated measurements weights are nearly identical, with a largest measurement error of 2.5 grams (e.g., which is equivalent to a quality error of 17 ppm of contamination) and a standard deviation of 1.2 grams. Thus, the semiconductor slurry blending tool provides much more accurate measurements of the materials or the slurries in blending tank110relative to current slurry tool configurations. As indicated above,FIGS.4A and4Bare provided merely as one or more examples. Other examples may differ from what is described with regard toFIGS.4A and4B. FIG.5is a diagram of example components of a device500. Device500may correspond to the semiconductor slurry blending tool. In some implementations, the semiconductor slurry blending tool may include one or more devices500and/or one or more components of device500. As shown inFIG.5, device500may include a bus510, a processor520, a memory530, a storage component540, an input component550, an output component560, and a communication interface570. Bus510includes a component that permits communication among the components of device500. Processor520is implemented in hardware, firmware, or a combination of hardware and software. Processor520is a central processing unit (CPU), a graphics processing unit (GPU), an accelerated processing unit (APU), a microprocessor, a microcontroller, a digital signal processor (DSP), a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), or another type of processing component. In some implementations, processor520includes one or more processors capable of being programmed to perform a function. Memory530includes a random access memory (RAM), a read only memory (ROM), and/or another type of dynamic or static storage device (e.g., a flash memory, a magnetic memory, and/or an optical memory) that stores information and/or instructions for use by processor520. Storage component540stores information and/or software related to the operation and use of device500. For example, storage component540may include a hard disk (e.g., a magnetic disk, an optical disk, a magneto-optic disk, and/or a solid state disk), a compact disc (CD), a digital versatile disc (DVD), a floppy disk, a cartridge, a magnetic tape, and/or another type of non-transitory computer-readable medium, along with a corresponding drive. Input component550includes a component that permits device500to receive information, such as via user input (e.g., a touch screen display, a keyboard, a keypad, a mouse, a button, a switch, and/or a microphone). Additionally, or alternatively, input component550may include a sensor for sensing information (e.g., a global positioning system (GPS) component, an accelerometer, a gyroscope, and/or an actuator). Output component560includes a component that provides output information from device500(e.g., a display, a speaker, and/or one or more LEDs). Communication interface570includes a transceiver-like component (e.g., a transceiver and/or a separate receiver and transmitter) that enables device500to communicate with other devices, such as via a wired connection, a wireless connection, or a combination of wired and wireless connections. Communication interface570may permit device500to receive information from another device and/or provide information to another device. For example, communication interface570may include an Ethernet interface, an optical interface, a coaxial interface, an infrared interface, an RF interface, a universal serial bus (USB) interface, a wireless local area interface, a cellular network interface, and/or the like. Device500may perform one or more processes described herein. Device500may perform these processes based on processor520executing software instructions stored by a non-transitory computer-readable medium, such as memory530and/or storage component540. A computer-readable medium is defined herein as a non-transitory memory device. A memory device includes memory space within a single physical storage device or memory space spread across multiple physical storage devices. Software instructions may be read into memory530and/or storage component540from another computer-readable medium or from another device via communication interface570. When executed, software instructions stored in memory530and/or storage component540may cause processor520to perform one or more processes described herein. Additionally, or alternatively, hardwired circuitry may be used in place of or in combination with software instructions to perform one or more processes described herein. Thus, implementations described herein are not limited to any specific combination of hardware circuitry and software. The number and arrangement of components shown inFIG.5are provided as an example. In practice, device500may include additional components, fewer components, different components, or differently arranged components than those shown inFIG.5. Additionally, or alternatively, a set of components (e.g., one or more components) of device500may perform one or more functions described as being performed by another set of components of device500. FIG.6is a flow chart of an example process600for generating a semiconductor slurry with a high-throughput, precise semiconductor slurry blending tool. In some implementations, one or more process blocks ofFIG.6may be performed by a semiconductor slurry blending tool (e.g., the semiconductor slurry blending tool ofFIGS.1A-3B). In some implementations, one or more process blocks ofFIG.6may be performed by another device or a group of devices separate from or including the semiconductor slurry blending tool. Additionally, or alternatively, one or more process blocks ofFIG.6may be performed by one or more components of a device500, such as processor520, memory530, storage component540, input component550, output component560, communication interface570, and/or the like. As shown inFIG.6, process600may include receiving one or more materials in a blending tank via at least one inlet pipe connected to the blending tank, wherein the at least one inlet pipe vertically enters the blending tank and does not contact the blending tank (block610). For example, the semiconductor slurry blending tool may receive one or more materials in a blending tank via at least one inlet pipe connected to the blending tank, as described above. As further shown inFIG.6, process600may include blending the one or more materials in the blending tank into the slurry with a blending pump that is partially provided within the blending tank, wherein the blending pump prevents blending of the one or more materials into the slurry until after the one or more materials are provided to the blending tank (block620). For example, the semiconductor slurry blending tool may blend the one or more materials in the blending tank into the slurry with a blending pump that is partially provided within the blending tank, as described above. As further shown inFIG.6, process600may include removing the slurry from the blending tank with a single outlet pipe connected to the blending pump (block630). For example, the semiconductor slurry blending tool may remove the slurry from the blending tank with a single outlet pipe connected to the blending pump, as described above. Process600may include additional implementations, such as any single implementation or any combination of implementations described below and/or in connection with one or more other processes described elsewhere herein. In a first implementation, process600includes controlling the receiving of the one or more materials in the blending tank with a pressure relief device associated with the at least one inlet pipe. In a second implementation, alone or in combination with the first implementation, the blending tank is supported by a support base with reinforced feet. In a third implementation, alone or in combination with one or more of the first and second implementations, process600includes measuring a level of the slurry or the one or more materials in the blending tank with one or more tank level sensors connected to a tank level sensor bracket, wherein the tank level sensor bracket and the one or more is tanking level sensors are provided adjacent to an exterior sidewall of the blending tank and do not contact the exterior sidewall of the blending tank. In a fourth implementation, alone or in combination with one or more of the first through third implementations, the single outlet pipe includes a stress relief heat treated plastic. In a fifth implementation, alone or in combination with one or more of the first through fourth implementations, process600includes providing the slurry to a semiconductor chemical-mechanical polishing tool. In a sixth implementation, alone or in combination with one or more of the first through fifth implementations, the slurry is associated with a maximum measurement error of less than three grams. In a seventh implementation, alone or in combination with one or more of the first through sixth implementations, the slurry is associated with a reproducibility error of less than two and half grams. AlthoughFIG.6shows example blocks of process600, in some implementations, process600may include additional blocks, fewer blocks, different blocks, or differently arranged blocks than those depicted inFIG.6. Additionally, or alternatively, two or more of the blocks of process600may be performed in parallel. In this way, the high-throughput, precise semiconductor slurry blending tool may generate high quality slurries that meet slurry requirements for a large quantity of advanced semiconductor processes. For example, the high-throughput, precise semiconductor slurry blending tool may produce high quality slurries (e.g., with a quality error of seventeen ppm of contamination), and may only require one day to modify a semiconductor slurry blending tool for a different slurry. This may significantly reduce cycle times associated with a semiconductor processing schedule (e.g., by two-hundred and thirty days), and may result in significant cost savings each year. Furthermore, the high-throughput, precise semiconductor slurry blending tool may improve flexibility of slurry blending by dynamically adjusting a blending recipe and measuring a difference in raw material quality. As described in greater detail above, some implementations described herein provide a slurry blending tool. The slurry blending tool may include a blending tank to receive and blend one or more materials into a slurry, and at least one inlet pipe connected to the blending tank and to provide the one or more materials to the blending tank. The at least one inlet pipe may vertically enter the blending tank and may not contact the blending tank. The slurry blending tool may include a blending pump partially provided within the blending tank and to blend the one or more materials into the slurry, and an outlet pipe connected to the blending pump and to remove the slurry from the blending tank. As described in greater detail above, some implementations described herein provide a method of making a slurry. The method may include receiving one or more materials in a blending tank via at least one inlet pipe connected to the blending tank, where the at least one inlet pipe may vertically enter the blending tank and may not contact the blending tank. The method may include blending the one or more materials in the blending tank into the slurry with a blending pump that is partially provided within the blending tank, where the blending pump may prevent blending of the one or more materials into the slurry until after the one or more materials are provided to the blending tank. The method may include removing the slurry from the blending tank with a single outlet pipe connected to the blending pump. As described in greater detail above, some implementations described herein provide a slurry blending tool. The slurry blending tool may include a blending tank to receive and blend one or more materials into a slurry, and a support base with reinforced feet to support the blending tank. The slurry blending tool may include at least one inlet pipe connected to the blending tank and to provide the one or more materials to the blending tank. The at least one inlet pipe may vertically enter the blending tank and may not contact the blending tank. The at least one inlet pipe may be associated with a pressure relief device to control provision of the one or more materials to the blending tank. The slurry blending tool may include a blending pump partially provided within the blending tank and to blend the one or more materials into the slurry. The blending pump may prevent blending of the one or more materials into the slurry until after the one or more materials are provided to the blending tank. The slurry blending tool may include an outlet pipe connected to the blending pump, where the outlet pipe may provide a single point of connection from the blending pump to remove the slurry from the blending tank, and where the outlet pipe may include a stress relief heat treated plastic. The slurry blending toll may include a tank level sensor bracket, and one or more tank level sensors connected to the tank level sensor bracket and to measure a level of the slurry or the one or more materials in the blending tank. The tank level sensor bracket and the one or more tank level sensors may be provided adjacent to an exterior sidewall of the blending tank and may not contact the exterior sidewall of the blending ta The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that those skilled in the art may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure. | 37,465 |
11858087 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT 1 Configuration of Grinding Apparatus A grinding apparatus1depicted inFIG.1is a grinding apparatus that grinds a workpiece17by using a grinding unit3. A configuration of the grinding apparatus1will be described in the following. As depicted inFIG.1, the grinding apparatus1includes a base10extended in a Y-axis direction. A chuck table2is disposed on the base10. The chuck table2includes a sucking portion20and a frame body21that supports the sucking portion20. An upper surface of the sucking portion20is a holding surface200on which the workpiece17is held. An upper surface210of the frame body21is formed so as to be flush with the holding surface200. The chuck table2is supported by a bottomed tubular casing24. A rotating mechanism25connected to the chuck table2is disposed inside the casing24. The rotating mechanism25can rotate the chuck table2about a rotational axis26in a Z-axis direction. A suction source27is connected to the sucking portion20. A suction force is transmitted to the holding surface200, which is the upper surface of the sucking portion20, by actuating the suction source27. For example, when the suction source27is actuated in a state in which the workpiece17is mounted on the holding surface200, the workpiece17can be sucked and held by the holding surface200. An internal base100is disposed inside the base10. A horizontal moving mechanism6is disposed on the internal base100. The horizontal moving mechanism6includes a ball screw60having a rotational axis65in the Y-axis direction, a pair of guide rails61arranged in parallel with the ball screw60, a motor62that is coupled to the ball screw60and rotates the ball screw60about the rotational axis65; and a movable plate63that has an internal nut screwed onto the ball screw60, and has a bottom portion in sliding contact with the guide rails61. The casing24is supported on the movable plate63. In the horizontal moving mechanism6, when the motor62rotates the ball screw60about the rotational axis65, the movable plate63moves in the Y-axis direction while being guided by the guide rails61. As the movable plate63moves in the Y-axis direction, the casing24supported by the movable plate63and the chuck table2supported by the casing24integrally move in the Y-axis direction. A cover22and bellows23coupled to the cover22so as to be capable of expansion and contraction are arranged on the periphery of the chuck table2. When the chuck table2moves in the Y-axis direction, the cover22moves in the Y-axis direction together with the chuck table2, and the bellows23expand or contract. A column11is erected on a +Y direction side of the base10. A grinding feed mechanism4that vertically moves the grinding unit3in the Z-axis direction as a direction perpendicular to the holding surface200is disposed on a side surface on a −Y direction side of the column11. The grinding unit3includes a spindle30having a rotational axis35in the Z-axis direction, a housing31that rotatably supports the spindle30, a spindle motor32that rotationally drives the spindle30about the rotational axis35, a mount33coupled to a lower end of the spindle30, and a grinding wheel34detachably fitted to a lower surface of the mount33. The grinding wheel34includes a base341and a plurality of grinding stones340in a substantially rectangular parallelepipedic shape which grinding stones are arranged annularly on a lower surface of the base341. Lower surfaces3400of the grinding stones340are a grinding surface that comes into contact with the workpiece17. When the spindle30is rotated by using the spindle motor32, the mount33connected to the spindle30and the grinding wheel34fitted to the lower surface of the mount33rotate integrally. The grinding feed mechanism4includes a ball screw40having a rotational axis45in the Z-axis direction, a pair of guide rails41arranged in parallel with the ball screw40, a Z-axis motor42that rotates the ball screw40about the rotational axis45in the Z-axis direction, an encoder92for detecting the rotational angle of the Z-axis motor42, a raising and lowering plate43that has an internal nut screwed onto the ball screw40and that has a side portion in sliding contact with the guide rails41, and a holder44that is coupled to the raising and lowering plate43and that supports the grinding unit3. When the ball screw40is driven by the Z-axis motor42and thereby the ball screw40rotates about the rotational axis45, the raising and lowering plate43correspondingly moves vertically in the Z-axis direction while guided by the guide rails41, and the grinding unit3held by the holder44correspondingly moves in the Z-axis direction as a direction perpendicular to the holding surface200. A recording medium36is provided to the side surface of the base341of the grinding wheel34. The recording medium36is, for example, a sticker on which a bar code such as one-dimensional code or the like is printed. The recording medium36is affixed to the side surface of the base341. A thickness of the base341is recorded on the recording medium36. That is, information including information regarding the thickness of the base341is recorded on the recording medium36. The grinding apparatus1includes a reading unit70that reads the thickness of the base341which thickness is recorded on the recording medium36. The reading unit70is, for example, a bar code reader that reads the above-described one-dimensional code or the like. The grinding apparatus1includes a base thickness storage unit71that stores the thickness of the base341which thickness is read by the reading unit70. The base thickness storage unit71is connected to the reading unit70. The information regarding the thickness of the base341which is read by the reading unit70is transmitted to the base thickness storage unit71and is stored in the base thickness storage unit71. The grinding apparatus1includes a control unit8that controls various operations of the grinding apparatus1. A detecting unit5that comes into contact with each of the lower surface3400of a grinding stone340and a fitting surface330of the mount33, and detects the lower surface3400of the grinding stone340and the fitting surface330of the mount33is disposed on the cover22and on a side of the chuck table2. The detecting unit5includes a cylinder51, a table50provided such that a lower portion thereof is housed in the cylinder51and an upper portion thereof projects upward from the cylinder51, and a sensor52disposed inside the cylinder51. The table50is provided onto the cylinder51disposed on the cover22so as to be able to come into contact with the grinding stone340or the base341when the grinding unit3is lowered in a −Z direction. The sensor52in the present embodiment is a transmissive type photoelectric sensor. As depicted inFIG.2, the sensor52includes a light emitting portion520and a light receiving portion521. During operation of the grinding apparatus1, light continuing to be emitted from the light emitting portion520travels in a straight line along a detection line522. and is received by the light receiving portion521. As depicted inFIG.1, a signal transmitting unit56is connected to the sensor52. When the light emitted from the light emitting portion520ceases to be received by the light receiving portion521, a detection signal is transmitted from the signal transmitting unit56to the control unit8. As depicted inFIG.1andFIG.2, the cylinder51of the detecting unit5is connected to an air source55via a relief valve53and a valve54. The table50is biased in a +Z direction by the cylinder51pressurized by feeding the cylinder51with an air produced by the air source55. The table50is positioned at an upper limit position in a state in which no pressing force is applied to the table50from above. When the air inside the cylinder51is pressurized by pushing the table50from above, and thereby the pressure of the air inside the cylinder51becomes a pressure equal to or higher than a predetermined pressure, the relief valve53is opened as appropriate, and the air supplied from the air source55into the cylinder51is exhausted to a space outside the cylinder51, so that the pressure applied to the inside of the cylinder51is held constant. As depicted inFIG.1, the raising and lowering plate43is provided with a height measuring unit90that moves together with the raising and lowering plate43and measures the height position in the Z-axis direction of the grinding unit3. In addition, the guide rails41are provided with a scale91having graduations. The height measuring unit90reads a value (graduation) on the scale91. The height position of the grinding unit3moved in the Z-axis direction by the grinding feed mechanism4is thereby measured. Incidentally, the height position of the grinding unit3may be measured on the basis of a height signal (signal indicating the height position of the grinding unit3) output from the encoder92detecting the rotational angle of the Z-axis motor42. The control unit8includes a fitting surface height storage section80. The fitting surface height storage section80has a function of storing the height of the grinding unit3when the grinding unit3is lowered by the grinding feed mechanism4and the detecting unit5detects the fitting surface330of the mount33. The control unit8includes a grindstone lower surface height storage section81. The grindstone lower surface height storage section81has a function of storing the height of the grinding unit3when the grinding unit3is lowered by the grinding feed mechanism4and the detecting unit5detects the lower surface3400of the grinding stone340after the grinding wheel34is fitted to the mount33. The control unit8includes a grindstone remaining amount calculating section82. The grindstone remaining amount calculating section82has a function of calculating a remaining amount of the grinding stone340by subtracting the thickness of the base341which thickness is stored in the base thickness storage unit71from a difference between the height stored in the fitting surface height storage section80and the height stored in the grindstone lower surface height storage section81. 2 Operation of Grinding Apparatus Description will be made of operation when the grinding apparatus1grinds the workpiece17. In this case, first, an operator or the control unit8makes the workpiece17sucked and held on the holding surface200of the chuck table2depicted inFIG.1. Thereafter, the control unit8positions the chuck table2below the grinding unit3by the horizontal moving mechanism6. Next, the control unit8rotates the workpiece17held on the holding surface200by rotating the chuck table2about the rotational axis26by the rotating mechanism25, and rotates the grinding stones340about the rotational axis35by using the spindle motor32. In this state, the control unit8lowers the grinding unit3in the −Z direction by using the grinding feed mechanism4. The lower surfaces3400of the grinding stones340thereby come into contact with an upper surface170of the workpiece17. From this state, the control unit8further lowers the grinding stones340in the −Z direction. The workpiece17is thereby ground by the grinding stones340. When the workpiece17is ground to a predetermined thickness, the control unit8ends the grinding processing on the workpiece17. Such grinding wears the lower surfaces3400of the grinding stones340, and reduces an amount of projection (remaining amount) of the grinding stones340from a lower surface3410of the base341. The grinding wheel34is therefore replaced with a new one immediately before the remaining amount of the grinding stones340disappears. Accordingly, in the grinding apparatus1, the control unit8performs processing of recognizing the remaining amount of the grinding stones340by using the detecting unit5in appropriate timing. Incidentally, such processing is performed also when the grinding wheel34is replaced with a new one. In the following, description will be made of operation when the grinding apparatus1recognizes the remaining amount of the grinding stones340. In order to recognize the remaining amount of the grinding stones340, the control unit8reads the thickness of the base341which is recorded on the recording medium36by using the reading unit70when the grinding wheel34is fitted to the mount33. The read thickness of the base341is stored in the base thickness storage unit71. In addition, in a state in which the grinding wheel34is not fitted to the mount33, the control unit8lowers the grinding unit3in the −Z direction by the grinding feed mechanism4, and detects the fitting surface330of the mount33of the grinding unit3by using the detecting unit5. Then, the control unit8stores, in the fitting surface height storage section80, the height of the grinding unit3when the fitting surface330of the mount33is detected. Specifically, as depicted inFIG.2, the control unit8first positions a contact surface500of the table50of the detecting unit5below the mount33by moving the movable plate63in the Y-axis direction by the horizontal moving mechanism6. Next, as depicted inFIG.3, the control unit8lowers the grinding unit3in the −Z direction by the grinding feed mechanism4, and thereby makes the fitting surface330of the mount33and the contact surface500of the table50come into contact with each other. In this state, the control unit8further lowers the mount33in the −Z direction by the grinding feed mechanism4, and depresses the table50downward by the fitting surface330of the mount33. Then, as depicted inFIG.4, when the lower surface501of the table50is depressed to the position of the detection line522of the sensor52, the light emitted from the light emitting portion520of the sensor52is interrupted by the table50, and ceases to be received by the light receiving portion521. At a moment at which the light ceases to be received by the light receiving portion521, a detection signal to the effect that the fitting surface330of the mount33is detected is transmitted from the signal transmitting unit56of the detecting unit5to the control unit8. At this time, air is exhausted via the relief valve53connected to the inside of the cylinder51so that the depression of the table50does not raise the pressure applied to the inside of the cylinder51. The inside of the cylinder51is thereby maintained at a substantially constant pressure. Consequently, a force in the +Z direction which force is applied from the contact surface500of the table50to the fitting surface330of the mount33is held substantially constant. An excellent measurement can therefore be performed. Incidentally, when the recognition of the remaining amount of the grinding stones340is not performed, the air inside the cylinder51is exhausted, so that the table50is lowered to a lowest position, and the contact surface500of the table50is positioned below the holding surface200. Then, when the control unit8receives the detection signal to the effect that the fitting surface330of the mount33is detected, the control unit8stops the lowering of the grinding unit3by controlling the grinding feed mechanism4. In addition, the control unit8recognizes, as a first height Z1of the grinding unit3, the value of the scale91read by the height measuring unit90when the detection signal is received, and stores the first height Z1in the fitting surface height storage section80. Incidentally, the measurement of the height position of the grinding unit3when the fitting surface330of the mount33is detected is performed at a time of replacement of a spindle unit or the like. That is, the measurement does not always need to be performed when the grinding wheel34is replaced. Incidentally, the grinding apparatus1recognizes, in advance, a difference between the height of the contact surface500of the table50and the height of the holding surface200when the lower surface501of the table50of the detecting unit5is depressed to the position of the detection line522of the sensor52. Thereafter, the control unit8raises the grinding unit3by the grinding feed mechanism4, and thereby separates the grinding wheel34from the table50. Thereafter, the operator fits the grinding wheel34to the mount33. Next, the control unit8lowers the grinding unit3in the −Z direction by the grinding feed mechanism4, and detects the lower surface3400of a grinding stone340by using the detecting unit5. Then, the control unit8stores, in the grindstone lower surface height storage section81, the height of the grinding unit3when the lower surface3400of the grinding stone340is detected. Specifically, as depicted inFIG.5, the control unit8first positions the contact surface500of the table50of the detecting unit5below the grinding stone340by moving the movable plate63in the Y-axis direction by the horizontal moving mechanism6. Next, as depicted inFIG.6, the control unit8lowers the grinding unit3in the −Z direction by the grinding feed mechanism4, and thereby makes the lower surface3400of the grinding stone340and the contact surface500of the table50come into contact with each other. In this state, the control unit8further lowers the grinding stone340in the −Z direction by the grinding feed mechanism4, and depresses the table50downward by the lower surface3400of the grinding stone340. Then, as depicted inFIG.7, when the lower surface501of the table50is depressed to the position of the detection line522of the sensor52, the light emitted from the light emitting portion520of the sensor52is interrupted by the table50, and ceases to be received by the light receiving portion521. At a moment at which the light ceases to be received by the light receiving portion521, a detection signal to the effect that the lower surface3400of the grinding stone340is detected is transmitted from the signal transmitting unit56of the detecting unit5to the control unit8. Then, when the control unit8receives the detection signal to the effect that the lower surface3400of the grinding stone340is detected, the control unit8stops the lowering of the grinding unit3by controlling the grinding feed mechanism4. In addition, the control unit8recognizes, as a second height Z2of the grinding unit3, the value of the scale91read by the height measuring unit90when the detection signal is received, and stores the second height Z2in the grindstone lower surface height storage section81. Next, the grindstone remaining amount calculating section82calculates a difference between the first height Z1stored in the fitting surface height storage section80and the second height Z2stored in the grindstone lower surface height storage section81as a distance R from the lower surface3400of the grinding stone340to the fitting surface330of the mount33. Thereafter, the grindstone remaining amount calculating section82obtains the remaining amount of the grinding stone340by subtracting the thickness of the base341which thickness is stored in the base thickness storage unit71from the difference between the first height Z1and the second height Z2, that is, the distance R from the lower surface3400of the grinding stone340to the fitting surface330of the mount33. As described above, the grinding apparatus1stores the thickness of the base341in the base thickness storage unit71, and calculates the remaining amount of the grinding stone340by subtracting the stored thickness of the base341from the distance R from the lower surface3400of the grinding stone340to the fitting surface330of the mount33. Hence, a measurement using a vernier caliper as in the past or the like becomes unnecessary, and the remaining amount of the grinding stone can be recognized properly. In addition, even when the thickness of the base341varies, the remaining amount of the grinding stone340can be calculated excellently. It is further possible to check whether there is a difference between an actual remaining amount of the grinding stone340used to a certain extent and the calculated and recognized remaining amount of the grinding stone340. Incidentally, the control unit8may display the value of the calculated remaining amount of the grinding stone340on a display not depicted, which display is provided to the grinding apparatus1. In this case, the operator can easily grasp the remaining amount of the grinding stone340, and therefore appropriately determine whether or not to replace the grinding wheel34. In addition, the control unit8may be configured to notify the operator that the grinding wheel34is to be replaced by, for example, sounding an alarm sound when the calculated remaining amount of the grinding stone340is smaller than a predetermined value. Incidentally, the detecting unit5may include an acoustic emission (AE) sensor having a contact57at an upper end of the table50as depicted inFIG.8, in place of the sensor52as a transmissive photoelectric sensor depicted inFIG.2, for example. In a case where the AE sensor is used, in detecting the lower surface3400of the grinding stone340, for example, at a moment at which the lower surface3400of the grinding stone340and an upper surface570of the contact57of the AE sensor come into contact with each other, the lower surface3400of the grinding stone340is detected, and a detection signal to the effect that the lower surface3400of the grinding stone340is detected is transmitted from the signal transmitting unit56of the detecting unit5to the control unit8. When the AE sensor is used, the grinding stone340does not need to be lowered by the grinding feed mechanism4after the upper surface570of the contact57of the AE sensor and the lower surface3400of the grinding stone340come into contact with each other. Hence, a time taken to calculate the remaining amount of the grinding stone340can be shortened. In addition, as depicted inFIG.9, the detecting unit5may include a bottomed cylinder58that houses the table50and that has an upper portion opened, and a spring59surrounded by the bottomed cylinder58. The spring59has one end connected to the lower surface501of the table50and has another end fixed to an internal bottom portion of the bottomed cylinder58. The table50can be biased upward by using the spring59without a pressure generating mechanism such as the air source55or the like being provided to the grinding apparatus1. It is therefore possible to reduce the size of the grinding apparatus1as a whole, and reduce cost for generating the pressure. In addition, the configuration depicted inFIG.9may be provided with a proximity sensor that detects the lower surface501of the lowered table50. In addition, with the configuration depicted inFIG.9, the cylinder51of the detecting unit5is disposed at a position such that the grinding stones340can avoid coming into contact with the table50when the grinding processing is performed. The cylinder51is, for example, disposed at a position shifted in a −Y direction from the position depicted inFIG.1. In addition, in the present embodiment, the cylinder51of the detecting unit5is disposed on the cover22. In regard to this, the cylinder51of the detecting unit5may be disposed on the movable plate63, and the cylinder51and the table50may project from the cover22. It is to be noted that the recording medium36is not limited to the above-described one-dimensional code and may, for example, be a two-dimensional code or an RFID. In addition, the recording medium36is not limited to being affixed to the side surface of the base341as a sticker and may be directly included in the side surface of the base341by laser marking or the like. The recording medium36may be, for example, printed on an inspection table for the grinding wheel34. In addition, in a case where the measurement of the height of the grinding unit3is performed on the basis of a height signal output from the encoder92, the fitting surface height storage section80and the grindstone lower surface height storage section81, for example, receive height signals from the encoder92, and the height difference is calculated on the basis of the height signals. Incidentally, as depicted inFIG.1, the grinding apparatus1may include a thickness measuring unit75that measures a thickness of the workpiece17. The thickness measuring unit75includes a holding surface height measuring instrument751that measures the height of the holding surface200and an upper surface height measuring instrument752that measures the height of the upper surface170of the workpiece17. A difference between the value of the holding surface height measuring instrument751and the value of the upper surface height measuring instrument752is calculated as the thickness of the workpiece17. The control unit8stores the height position of the grinding unit3when the grinding of the workpiece17is completed, and recognizes the height position of the grinding unit3at which height position the lower surfaces3400of the grinding stones340are in contact with the holding surface200by subtracting the thickness of the workpiece17after the grinding from the height position of the grinding unit3when the grinding of the workpiece17is completed. The control unit8can, for example, obtain the remaining amount of the grinding stone340by subtracting, from this height position, the height position of the grinding unit3when the fitting surface330of the mount33is in contact with the holding surface200, which height position is recognized in advance, and the thickness of the base341of the grinding wheel34which thickness is stored in the base thickness storage unit71. That is, the control unit8can recognize the remaining amount of the grinding stone340by measuring the thickness of the workpiece17at a time of the completion of the grinding. A generally called setup that sets the origin of the grinding stone340at a time of grinding the workpiece17by the grinding apparatus1recognizes the height position of the grinding unit3when the grinding stones340are brought into contact with the holding surface200of the chuck table2by lowering the grinding unit3by the grinding feed mechanism4. In the present embodiment, the setup that recognizes the height position of the grinding unit3at which height position the lower surfaces3400of the grinding stones340are in contact with the holding surface200is completed by calculating the remaining amount of the grinding stones340. Further, also in a case of dressing the grinding stones340, the lower surfaces3400of the grinding stones340are brought into contact with a dressing board held on the chuck table2or a sub-table not depicted by lowering the grinding unit3by the grinding feed mechanism4. It is therefore possible to perform, as a series of operations, the dressing of the lower surfaces3400of the grinding stones340, measurement of a thickness of the dressing board by the thickness measuring unit75, and the recognition of the remaining amount of the grinding stone340by using the height position of the grinding unit3which height position is recognized by the recognition of the height position of the grinding unit3by the scale91. The present invention is not limited to the details of the above described preferred embodiment. The scope of the invention is defined by the appended claim and all changes and modifications as fall inside the equivalence of the scope of the claim are therefore to be embraced by the invention. | 27,270 |
11858088 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment according to the aspect of the present invention will be described with reference to the accompanying drawings.FIG.1is a perspective view of a major part of a polishing apparatus2. An X-axis direction, a Y-axis direction, and a Z-axis direction each illustrated inFIG.1are orthogonal to each other. For example, the Z-axis direction is a vertical direction and the X-Y plane is a horizontal plane. The polishing apparatus2of the present embodiment is part of one piece of a processing apparatus (polishing-and-grinding apparatus) including a rough grinding apparatus and a finish grinding apparatus. However, the polishing apparatus2may be a processing apparatus that executes polishing without executing grinding. The polishing apparatus2has a chuck table4with a circular plate shape. The chuck table4has a circular plate-shaped frame body6formed of a non-porous ceramic. The frame body6in the present embodiment is formed of non-porous alumina and has Vickers hardness of 1597 HV. A recess part (not illustrated) with a circular plate shape is formed in the frame body6and a circular plate-shaped porous plate8formed of a porous ceramic is fixed to this recess part. The porous plate8in the present embodiment is formed of porous alumina and has Vickers hardness of 681 HV. An upper surface8aof the porous plate8in the present embodiment has a protrusion shape in which the central part slightly protrudes in comparison with the outer circumferential part. An upper surface6aof the frame body6and the upper surface8aof the porous plate8are substantially flush with each other and configure a holding surface4a. When the polishing apparatus2is a processing apparatus that executes polishing without executing grinding, the upper surface8aof the porous plate8may be substantially flat. A predetermined flow path is formed in the frame body6. A suction source (not illustrated) such as an ejector is connected to one end of the predetermined flow path and the other end of the predetermined flow path is exposed to the recess part. A negative pressure generated by the suction source is transmitted to the upper surface8aof the porous plate8through the predetermined flow path. A wafer11disposed on the holding surface4ais sucked and held by the holding surface4aby using this negative pressure. The wafer11is formed of silicon (Si), for example. However, there is no limit on a material, a shape, a structure, a size, and so forth of the wafer11. For example, the wafer11may be formed of a semiconductor material or the like other than silicon, composed of gallium nitride (GaN), silicon carbide (SiC), or the like. A protective tape13that has substantially the same diameter as the wafer11and is made of a resin is stuck to a front surface11aof the wafer11in order to reduce damage to the side of the front surface11a. A ring-shaped rotating base10ais fixed to the lower part of the chuck table4. At the upper part of the rotating base10a, plural movable components (not illustrated) each composed of an air cylinder, a movable shaft of a screw type, and so forth are disposed along the circumferential direction of the rotating base10a. The plural movable components each support the chuck table4and the tilt of the chuck table4is adjusted through extension and retraction of the movable components. For example, the tilt of the chuck table4is adjusted to cause part of the holding surface4ato become substantially horizontal to the X-Y plane. The part of the holding surface4athat has become substantially horizontal to the X-Y plane is covered by a polishing pad20to be described later. The rotating base10ais rotatably supported by a fixed base10b. A driven gear10cis formed in the outer circumferential side surface of the rotating base10aand a drive gear10ecoupled to a motor10dmeshes with the driven gear10c. When the drive gear10eis rotated, the chuck table4rotates around a predetermined rotation axis10fat approximately 10 rpm to 300 rpm. The rotating base10a, the fixed base10b, the driven gear10c, the motor10d, the drive gear10e, and so forth configure a rotation mechanism10that rotates the chuck table4. A polishing unit12is disposed over the chuck table4. The polishing unit12has a spindle housing14with a circular cylindrical shape. Part of a spindle16with a circular column shape is rotatably housed in the spindle housing14. The spindle16is disposed along the Z-axis direction and a rotational drive source (not illustrated) such as a motor is disposed at the upper end part of the spindle16. The lower end part of the spindle16protrudes downward relative to the spindle housing14. At the upper end part of the spindle16, the polishing pad20with a circular plate shape is mounted with the interposition of a mount18with a circular plate shape. The polishing pad20includes a base part with a circular plate shape. A pad part that gets contact with the wafer11is fixed to one surface of the base part. The pad part in the present embodiment does not have fixed abrasive grains and is formed of a predetermined material. The predetermined material is, for example, a rigid foam material such as rigid polyurethane foam or nonwoven fabric obtained by impregnating nonwoven fabric made of polyester with urethane. The mount18and the polishing pad20have substantially the same diameter and through-holes18aand20aare formed therein in such a manner as to penetrate a center of each circle. A flow path16aof slurry22aformed in the spindle16is connected to the respective through-holes18aand20a. The slurry22ais, for example, an alkaline aqueous solution containing abrasive grains made of silica (silicon oxide, SiO2). However, the material of the abrasive grains may be green carbon (GC), diamond, alumina (aluminum oxide, Al2O3), ceria (cerium oxide, CeO2), cubic boron nitride (cBN), or silicon carbide (SiC). Furthermore, an acidic aqueous solution is used instead of the alkaline aqueous solution in some cases. The slurry22ais supplied from a slurry supply unit22to the through-holes18aand20avia the flow path16a. The slurry supply unit22includes a storage tank (not illustrated) in which the slurry22ais stored and a pump (not illustrated) for supplying the slurry22afrom the storage tank to the flow path16a. A holding component24is fixed to the outer circumferential part of the spindle housing14. The holding component24is fixed to a Z-axis moving plate26. The Z-axis moving plate26is slidably attached to a pair of guide rails28disposed substantially in parallel to the Z-axis direction. A ball screw30is disposed substantially in parallel to the Z-axis direction between the pair of guide rails28. The ball screw30is rotatably coupled to a nut part (not illustrated) disposed on the Z-axis moving plate26. A stepping motor32is coupled to the upper end part of the ball screw30. The ball screw30is rotated by the stepping motor32, and the Z-axis moving plate26moves along the Z-axis direction. The holding component24, the Z-axis moving plate26, the pair of guide rails28, the ball screw30, the stepping motor32, and so forth configure a Z-axis movement unit34that adjusts a height position of the polishing unit12. The Z-axis movement unit34is fixed to a moving block2athat can move in the X-axis direction by an X-axis movement mechanism (not illustrated) of a ball screw system. On one side in the X-axis direction relative to the moving block2a, a support column2bfixed to a base (not illustrated) is disposed. A cleaning unit40for cleaning the holding surface4ais disposed on the support column2b. The cleaning unit40is disposed over the chuck table4. The cleaning unit40has a positioning unit42. The positioning unit42has a pair of guide rails44whose position is fixed relative to the support column2b. A Z-axis moving plate46is slidably attached to the pair of guide rails44. A nut part (not illustrated) is disposed on the Z-axis moving plate46. To this nut part, a ball screw48disposed substantially in parallel to the Z-axis direction between the pair of guide rails44is rotatably coupled. A stepping motor50is coupled to the upper end part of the ball screw48. When the ball screw48is rotated by the stepping motor50, the Z-axis moving plate46moves along the Z-axis direction. A cleaning abrasive stone holder52is fixed to the side of the front surface of the Z-axis moving plate46(one side in the Y-axis direction). To the cleaning abrasive stone holder52, a cleaning abrasive stone54that has hardness lower than that of the holding surface4aand has a rectangular parallelepiped shape (for example, vertical length 24 mm, horizontal length 46 mm, height 28 mm) is fixed. The cleaning abrasive stone54has hardness of 680 HV or lower in Vickers hardness, for example. The cleaning abrasive stone54in the present embodiment is a PVA abrasive stone in which abrasive grains (grit number that indicates the grain size of the abrasive grains is #3000) made of cerium oxide are fixed by using PVA as a binder. The PVA abrasive stone has elasticity attributed to pores continuously formed in the binder and has Vickers hardness of 34 HV, for example. However, the cleaning abrasive stone54is not limited only to the PVA abrasive stone. The cleaning abrasive stone54may be a rubber abrasive stone in which abrasive grains of ceria, silica, alumina, or the like are fixed by vulcanized rubber as long as the Vickers hardness is equal to or lower than 680 HV. When the cleaning abrasive stone54that is sufficiently soft compared with the holding surface4ais used and the holding surface4ais brought into contact with the cleaning abrasive stone54as above, the slurry22athat adheres to the outer circumferential part of the holding surface4acan be removed without changing the evenness of the height of the holding surface4a. However, although the Vickers hardness is equal to or lower than 680 HV, it is impossible to remove the slurry22awith a sponge such as an urethane sponge commercially available for home use because the sponge is too soft. Therefore, the Vickers hardness of the cleaning abrasive stone54is set to preferably 10 HV or higher, more preferably 20 HV or higher, and further preferably 30 HV or higher. Furthermore, even when the Vickers hardness is equal to or lower than 680 HV, the Vickers hardness of the cleaning abrasive stone54is set to preferably 600 HV or lower, more preferably 300 HV or lower, and further preferably 100 HV or lower in order to reduce the amount of polishing of the holding surface4aas much as possible. Here, with reference toFIG.2, a structure of the cleaning abrasive stone holder52will be described in more detail.FIG.2is a partially sectional side view of the cleaning abrasive stone holder52. The cleaning abrasive stone holder52has a bracket56with an L-shape in side view. The bracket56has a first straight line part fixed to the front surface side of the Z-axis moving plate46by bolts58. At one end part of the first straight line part, a second straight line part is disposed in such a manner as to be orthogonal to the first straight line part. An upper plate60is fixed by a bolt (not illustrated) to the lower surface of the second straight line part in the bracket56fixed to the Z-axis moving plate46. A through-hole60ais formed in the upper plate60and a shaft part62with a circular column shape is slidably inserted in the through-hole60a. A circular plate-shaped head part62ahaving a larger diameter than the through-hole60ais fixed to the upper end part of the shaft part62. The head part62ais disposed on the upper side relative to the upper plate60and therefore the shaft part62is supported by the upper plate60. A circular plate-shaped support part62bhaving a larger diameter than the shaft part62is fixed to the vicinity of the lower end part of the shaft part62. Between an upper surface62cof the support part62band a lower surface60bof the upper plate60, a helical compression spring (elastic component)64made of a metal is disposed around the outer circumferential part of the shaft part62. Although the helical compression spring64is used in the present embodiment, a spring, rubber, or the like in another form may be used as long as a restoring force can be exerted. A lower plate66is fixed to the lower surface of the support part62b. The upper end part of a first plate part68ais fixed to one side of the lower plate66in the Y-axis direction. Furthermore, on the other side in the Y-axis direction, a second plate part68bis fixed to the first plate part68awith the interposition of plural bolts70. The first plate part68aand the second plate part68bclamp the above-described cleaning abrasive stone54in the Y-axis direction. The cleaning abrasive stone54is fixed by the lower plate66, the first plate part68a, and the second plate part68bin such a manner that the upper part thereof is in contact with the lower surface of the lower plate66and the lower part thereof protrudes downward relative to the first plate part68aand the second plate part68b. The position of the cleaning abrasive stone54in the X-Y plane direction corresponds to one place on the outer circumferential part of the holding surface4a. By moving the cleaning abrasive stone54along the Z-axis direction by the positioning unit42, the cleaning abrasive stone54is positioned to a cleaning position (seeFIG.3) at which the cleaning abrasive stone54gets contact with the holding surface4aand an evacuation position (seeFIG.1) at which the cleaning abrasive stone54is separate from the holding surface4a. As illustrated inFIG.1, a nozzle72that supplies cleaning water such as purified water to the contact region between the cleaning abrasive stone54and the holding surface4ais disposed under the cleaning abrasive stone holder52. A cleaning water supply unit (not illustrated) having a tank, a pump, and so forth is connected to the nozzle72through a predetermined flow path. Operation of the cleaning unit40including the nozzle72is controlled by a control unit (not illustrated). The control unit also controls operation of the rotation mechanism10, the rotational drive source disposed in the spindle housing14, the slurry supply unit22, the Z-axis movement unit34, and so forth. The control unit is configured by a computer including a processor (processing device) typified by a central processing unit (CPU), a main storing device such as a dynamic random access memory (DRAM), and an auxiliary storing device such as a flash memory, for example. Software including a predetermined program is stored in the auxiliary storing device. Functions of the control unit are implemented by causing the processing device and so forth to operate according to this software. Next, with reference toFIG.2andFIG.3, polishing of the wafer11, removal of the slurry22athat adheres to the outer circumferential part of the holding surface4a, and so forth will be described. First, in the state in which the polishing unit12has been evacuated from directly above the holding surface4aby the moving block2aand the cleaning abrasive stone54has been moved to the evacuation position, the wafer11is carried in to the holding surface4aby a conveying unit that is not illustrated in the diagram, with a back surface11bof the wafer11exposed upward (carrying-in step). After the carrying-in step, the side of the front surface11aof the wafer11is sucked and held by the holding surface4a(holding step). After the holding step, the polishing unit12is moved by the moving block2ato cause part of the polishing unit12to cover the holding surface4a. Thereafter, while the chuck table4and the polishing pad20are rotated in a predetermined direction and the polishing unit12is lowered at a predetermined polishing feed rate, the slurry22ais supplied from the slurry supply unit22to at least one of the wafer11and the polishing pad20. In this manner, the back surface11bis polished by the polishing pad20while the wafer11is pressed with a predetermined pressing force (polishing step). The wafer11thinned to a predetermined thickness by the polishing step is carried out from the holding surface4aby the conveying unit that is not illustrated in the diagram (carrying-out step). After the carrying-out step, due to movement of the slurry22asupplied in the polishing step on the basis of a centrifugal force and so forth, the slurry22aadheres to the outer circumferential part of the holding surface4a(seeFIG.3). The slurry22amainly adheres to the upper surface6aof the frame body6that is not covered by the wafer11. However, the slurry22aadheres to the outer circumferential part of the upper surface8adue to the negative pressure generated at the upper surface8aof the porous plate8, and so forth, in some cases. In the present embodiment, the slurry22athat adheres to the outer circumferential part of the holding surface4ais removed by using the cleaning unit40(cleaning step). At the time of cleaning, the chuck table4is rotated at a predetermined speed while the cleaning water is supplied from the nozzle72to the outer circumferential part of the holding surface4aat a predetermined flow rate (for example, 2 (1/min)). Subsequently, the cleaning abrasive stone54is lowered by the positioning unit42and is moved to the cleaning position. In this manner, a lower surface54agets contact with part of the upper surface6aof the frame body6and part of the upper surface8aof the porous plate8(seeFIG.3).FIG.3is a diagram illustrating the state in which the cleaning abrasive stone54is brought into contact with the holding surface4a. At this time, the position of the cleaning abrasive stone holder52in the Z-axis direction is adjusted to cause the lower surface54a(seeFIG.2) of the cleaning abrasive stone54to become lower than the holding surface4aby, for example, 6 mm. In this manner, the cleaning abrasive stone54is pressed against the holding surface4awith a certain pressure by a restoring force from the helical compression spring64. In the cleaning step, the slurry22ais scraped off by the cleaning abrasive stone54. In addition, the slurry22ascraped off is caused to drop to the outside of the holding surface4aby using the cleaning water that flows outward in the radial direction of the holding surface4adue to the centrifugal force. In this manner, the slurry22athat adheres to the outer circumferential part of the holding surface4acan be substantially all removed. In the present embodiment, because the hardness of the cleaning abrasive stone54is lower than that of the holding surface4a, the cleaning abrasive stone54can remove the slurry22awithout changing the evenness of the height of the holding surface4a. Therefore, lowering of the evenness of the height of the holding surface4acan be suppressed in comparison with the case of polishing the holding surface4aby a polishing tool such as a leveling stone. After the cleaning step, a return to the carrying-in step is made and the second wafer11is polished. In this manner, the polishing of the wafer11and the cleaning of the holding surface4aare alternately executed. Next, an experiment result in the case in which plural wafers11have been polished one by one by the polishing apparatus2will be described.FIG.4Ais a graph illustrating the thickness of the outer circumferential part of the wafer11in the case in which two-fluid cleaning has been executed for the outer circumferential part of the holding surface4ain the cleaning step (that is, the holding surface4ahas been cleaned by cleaning water atomized by using compressed air) and the plural wafers11have been polished. In contrast,FIG.4Bis a graph illustrating the thickness of the outer circumferential part of the wafer11in the case in which the outer circumferential part of the holding surface4ahas been cleaned by using the above-described cleaning unit40in the cleaning step and the plural wafers11have been polished. InFIG.4AandFIG.4B, an abscissa axis indicates a position (mm) on the wafer11in a radial direction and an ordinate axis indicates a thickness (μm) of the wafer11. Furthermore, white circles indicate the first wafer11, and circles including dots indicate the 50th wafer11, and black circles indicate the 100th wafer11. In the experiment illustrated inFIG.4A, after the first wafer11has been polished, the two-fluid cleaning has been executed for the outer circumferential part of the holding surface4aand subsequently the second wafer11has been polished. Thereafter, the two-fluid cleaning has been executed for the outer circumferential part of the holding surface4aand the third wafer11has been polished. In this manner, the hundred wafers11have been polished. Furthermore, in the experiment illustrated inFIG.4B, after the first wafer11has been polished, the outer circumferential part of the holding surface4ahas been cleaned with the cleaning abrasive stone54. Subsequently, the second wafer11has been polished and thereafter the outer circumferential part of the holding surface4ahas been cleaned with the cleaning abrasive stone54. In this manner, the hundred wafers11have been polished. As illustrated inFIG.4A, in the case of executing the two-fluid cleaning for the outer circumferential part of the holding surface4a, the slurry22athat adhered to the outer circumferential part of the holding surface4ahas been not sufficiently removed. Therefore, the outer circumferential part of the wafer11has been raised by the slurry22athat remained. Due to this, the amount of polishing of the outer circumferential part of the wafer11became large compared with the amount of polishing of the central part. Therefore, the outer circumferential part of the wafer11became thin compared with the central part of the wafer11. In particular, as is apparent in the 100th wafer11, the flatness of the wafer11deteriorated at the outer circumferential part of the wafer11. In contrast, as illustrated inFIG.4B, in the case of executing the cleaning step, the flatness of the wafer11did not deteriorate even in the 100th wafer11. As above, it has become clear that lowering of the evenness of the height of the holding surface4acan be suppressed by removing the slurry22athat adheres to the outer circumferential part of the holding surface4aby using the cleaning abrasive stone54. The present invention is not limited to the details of the above described preferred embodiment. The scope of the invention is defined by the appended claims and all changes and modifications as fall within the equivalence of the scope of the claims are therefore to be embraced by the invention. Structures, methods, and so forth according to the above-described embodiment can be carried out with appropriate changes without departing from the range of the object of the present invention. | 22,748 |
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