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(M)(L)Small praying mantis Ingrid lured me outside with the promise of a baby praying mantis. I took photos of a few more things that caught my eye, too<eot>ASRock H61M-VS | bit-tech.net |
Click to enlargeASRock H61M-VS |
UK Price (as reviewed): £47.41 (inc VAT) |
Our bargain hunt also uncovered the H61M-VS by ASRock. It's slightly more expensive, but you get more PCB for your money. It's a super-narrow Micro-ATX motherboard, barely any bigger than the Mini-ITX MSI H61I-E35 on the previous page. It has a couple of advantages over the latter and a couple of downsides too. |
It's the cheapest LGA1155 motherboard we found with a 16x PCI-E slot. This clearly opens up a whole world of possibilities, especially as it has a 1x PC-E slot too, although being equipped with an H61 chipset, there's no CPU multiplier overclocking, even with K-series CPUs. |
However, it's just as well you're able to chuck in a graphics card because the H61M-VS has no HDMI port, which is a major drawback if you intend to keep power consumption to a minimum by using your Intel CPU's on-board graphics. |
Thankfully the layout is better than the MSI board in that the four SATA 3Gbps ports are located south of the 1x PCI-E slot, and there's plenty of room around the CPU socket. Sadly there's still no USB 3, but after updating the BIOS we did at least get Ivy Bridge support. Above you can see yet another practically vacant I/O panel, at least compared to what we're used to. |
Delving deeper into the BIOS revealed that you're actually able to tweak the CPU voltage, although only by 0.1V up or down. Still, this is better than the MSI which has zilch. While this will allow you to shave a few degrees/watts off your CPU, most Ivy Bridge Pentiums and Core i3s run so cool anyway that we've seen them running happily without fans on most tower coolers.<eot>Patent US5973395 - IC package having a single wiring sheet with a lead pattern disposed thereon - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Advanced Patent Search | Sign inAdvanced Patent SearchPatentsAn IC package is provided that has a flexible wiring sheet, including an upper portion, a lower portion and a side portion which is wound around a base member over an upper surface, side surfaces and a lower surface of the base member. An IC is loaded on an upper surface of the upper flexible wiring...http://www.google.com/patents/US5973395?utm_source=gb-gplus-sharePatent US5973395 - IC package having a single wiring sheet with a lead pattern disposed thereonPublication numberUS5973395 APublication typeGrantApplication numberUS 08/848,585Publication dateOct 26, 1999Filing dateApr 29, 1997Priority dateApr 30, 1996Fee statusPaidPublication number08848585, 848585, US 5973395 A, US 5973395A, US-A-5973395, US5973395 A, US5973395AInventorsHiroshi Odaira, Etsuji Suzuki, Hidehisa Yamazaki, Akira YonezawaOriginal AssigneeYamaichi Electronics Co., Ltd.Export CitationBiBTeX, EndNote, RefManPatent Citations (12), Referenced by (15), Classifications (26), Legal Events (4) External Links: USPTO, USPTO Assignment, EspacenetIC package having a single wiring sheet with a lead pattern disposed thereonUS 5973395 AAbstract An IC package is provided that has a flexible wiring sheet, including an upper portion, a lower portion and a side portion which is wound around a base member over an upper surface, side surfaces and a lower surface of the base member. An IC is loaded on an upper surface of the upper flexible wiring sheet covering the upper surface of the base member. The IC is connected to an electrode provided on an upper lead pattern portion laid along the upper surface of the flexible wiring sheet. The lead pattern is extended from the upper flexible wiring sheet to the lower flexible wiring sheet via the side surfaces of the flexible wiring sheet covering side surfaces of the base member. An electrode to be connected with an object is arranged on the lower lead pattern portion which is formed on the lower flexible wiring sheet, and overall the IC or an IC connection portion is sealed on the upper surface of the upper flexible wiring sheet. |
What is claimed is: 1. An integrated circuit package comprising:a base member having an upper surface, outer side surfaces, and a lower surface; a unitary wiring sheet having an upper surface, a pair of side surfaces, a pair of lower surfaces, and a pair of ends, wherein said wiring sheet is wrapped about said base member so that said upper surface of said wiring sheet overlays said upper surface of said base member, said pair of side surfaces of said wiring sheet overlay said outer side surfaces of said base member, said pair of lower surfaces of said wiring sheet overlay said lower surface of said base member, and said pair of ends of said wiring sheet face each other in a parallel opposing relation along said lower surface of said base member; upper electrodes arranged on said upper surface of said wiring sheet; lower electrodes arranged on said lower surfaces of said wiring sheet; a lead pattern disposed on said wiring sheet, said lead pattern connected between said upper electrodes and said lower electrodes, said lead pattern extending from said upper electrodes to said lower electrodes via said side surfaces of said wiring sheet; and an IC positioned on said upper surface of said wiring sheet, wherein a connection is formed between said IC and said upper electrodes. 2. The IC package of claim 1, further comprising a sealant enclosing said connection between said IC and said upper electrodes. |
DETAILED DESCRIPTION OF THE EMBODIMENTS Several embodiments of the present invention will now be described in detail with reference to the accompanying drawings which constitute a part of this specification. |
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a perspective view showing a first embodiment of an IC package, FIG. 1B is a sectional view thereof, FIG. 1C is a bottom view thereof, and FIG. 1D is a development view of a flexible wiring sheet in the IC package; |
SUMMARY OF THE INVENTION It is, therefore, an object of the present invention to provide an IC package which is simple in structure and low in manufacturing cost, without sacrificing the high density arrangement of terminals found in the BGA type IC package, for example. |
Patent CitationsCited PatentFiling datePublication dateApplicantTitleUS3641401 *Mar 10, 1971Feb 8, 1972American Lava CorpLeadless ceramic package for integrated circuitsUS3838443 *Mar 15, 1973Sep 24, 1974Westinghouse Electric CorpMicrowave power transistor chip carrierUS3908186 *Jun 20, 1974Sep 23, 1975Nippon Electric CoPackaged semiconductor device for microwave useUS3930115 *Mar 11, 1974Dec 30, 1975Philips CorpElectric component assembly comprising insulating foil bearing conductor tracksUS4376287 *Oct 29, 1980Mar 8, 1983Rca CorporationMicrowave power circuit with an active device mounted on a heat dissipating substrateUS5049978 *Sep 10, 1990Sep 17, 1991General Electric CompanyConductively enclosed hybrid integrated circuit assembly using a silicon substrateUS5081520 *May 16, 1990Jan 14, 1992Minolta Camera Kabushiki KaishaChip mounting substrate having an integral molded projection and conductive patternUS5198886 *Jan 23, 1991Mar 30, 1993U.S. Philips Corp.Semiconductor device having a clamping supportUS5362656 *Apr 15, 1994Nov 8, 1994Intel CorporationMethod of making an electronic assembly having a flexible circuit wrapped around a substrateUS5450283 *Jan 10, 1994Sep 12, 1995Motorola, Inc.Thermally enhanced semiconductor device having exposed backside and method for making the sameUS5528458 *Nov 18, 1994Jun 18, 1996Matsushita Electric Industrial Co., Ltd.Integrated circuit device and its manufacturing methodUS5581122 *Oct 25, 1994Dec 3, 1996Industrial Technology Research InstitutePackaging assembly with consolidated common voltage connections for integrated circuits* Cited by examinerReferenced byCiting PatentFiling datePublication dateApplicantTitleUS6301114 *May 20, 2000Oct 9, 2001Taiyo Yuden Co.,Ltd.Multilayered electronic part and electronic circuit module including therein the multilayered electronic partUS6369331 *Mar 29, 2000Apr 9, 2002Fujitsu LimitedPrinted circuit board for semiconductor package and method of making sameUS6380619 *Mar 31, 1999Apr 30, 2002Tdk CorporationChip-type electronic component having external electrodes that are spaced at predetermined distances from side surfaces of a ceramic substrateUS6399423 *Dec 12, 2000Jun 4, 2002Hitachi, LtdSemiconductor device an a method of manufacturing the sameUS6483184 *Feb 5, 1999Nov 19, 2002Seiko Epson CorporationSemiconductor apparatus substrate, semiconductor apparatus, and method of manufacturing thereof and electronic apparatusUS6590276Mar 29, 2002Jul 8, 2003Hitachi, Ltd.Semiconductor device and a method of manufacturing the sameUS6667193Mar 29, 2002Dec 23, 2003Hitachi, Ltd.Semiconductor device and a method of manufacturing the sameUS6897097Sep 25, 2003May 24, 2005Hitachi, Ltd.Semiconductor device and a method of manufacturing the sameUS7258549 *Feb 18, 2005Aug 21, 2007Matsushita Electric Industrial Co., Ltd.Connection member and mount assembly and production method of the sameUS7485951 *May 9, 2003Feb 3, 2009Entorian Technologies, LpModularized die stacking system and methodUS7748110Jul 18, 2007Jul 6, 2010Panasonic CorporationMethod for producing connection memberUS8064213 *Jan 27, 2005Nov 22, 2011Panasonic CorporationModule with a built-in component, and electronic device with the sameUS8159830 *Apr 17, 2009Apr 17, 2012Atmel CorporationSurface mounting chip carrier moduleUS20120056317 *Sep 9, 2010Mar 8, 2012Hon Hai Precision Industry Co., Ltd.ChipCN100524951CFeb 21, 2005Aug 5, 2009松下电器产业株式会社Connection member and mount assembly and production method of the same* Cited by examinerClassifications U.S. Classification257/692, 257/693, 257/E23.65, 257/696, 257/706International ClassificationH01L23/498, H01L23/28, H01L23/31, H01L23/12, H01L21/60, H01L23/36Cooperative ClassificationH01L24/48, H01L2924/01057, H01L2924/15311, H01L23/4985, H01L2224/48225, H01L2924/15173, H01L2924/01079, H01L23/3128, H01L2224/48227, H01L2224/48091, H01L24/73, H01L2224/73257, H01L2224/16225European ClassificationH01L23/498J, H01L23/31H2BLegal EventsDateCodeEventDescriptionMar 30, 2011FPAYFee paymentYear of fee payment: 12Mar 30, 2007FPAYFee paymentYear of fee payment: 8Mar 31, 2003FPAYFee paymentYear of fee payment: 4Apr 29, 1997ASAssignmentOwner name: YAMAICHI ELECTRONICS CO., LTD., JAPANFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SUZUKI, ETSUJI;YONEZAWA, AKIRA;YAMAZAKI, HIDEHISA;AND OTHERS;REEL/FRAME:008520/0272;SIGNING DATES FROM 19970422 TO 19970429RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services©2012 Google<eot>Posted by Maclurio at 3:40 PM |
I finally had some time to check your blog and enjoyed reading it. I am Sally's cousin Susie Bell in High Point, NC. I was born in RGS, Brasil and have wanted to know about your experiences. I have visited Recife twice with a friend from here taking my husband the first time and family for New Year's in 08 to Porto De Galinhas, Olinda and also to Rio. It's great to catch up with your family. |
Dear distant cousin SusieB, |
Mum and Dad showed us photos of their visit to see you in NC. Nice to have others with links with Brazil. Thanks for reading my blog!<eot>Vodafone Ghana Celebrates 10th Anniversary with Special Voice and Data Offers |
For GhanaiansData Deals & Bundles |
By Mfidie On Jul 11, 2018 Last updated Sep 19, 2019 |
Global telecom giant Vodafone Ghana has introduced an anniversary offer for its customers this month, as it celebrates a decade of connections in Ghana. |
For Vodafone @10, the operator is giving customers voice and data services at a flat Gh¢0.10 rate. |
For every reload worth Gh¢2 and above on voice and data, customers will also receive 10 times bonus which can be shared with family and friends; be it through Vodafone Cash reloads, scratch cards or electronic top-ups. |
The offer is expected to lure inactive customers by giving them a new sense of freshness and willingness to come on board and enjoy good things with Vodafone. |
Speaking on the company's anniversary, Yolanda Zoleka Cuba, Vodafone Ghana's CEO said, "Ten years of continued leadership and impact in Ghana's telecommunications sector is worthy of celebration and excitement. |
"This offer signifies the extreme importance of our customers to our business. |
"We continue to listen to their needs and make every effort to respond in a way that will meet their expectations. |
"A flat 10-pesewas rate for both voice and data is an industry-first and is a testament to our willingness to create an exciting future for all Ghanaians. |
"The package also caters for friends and family by giving our customers the ability to transfer the same value to two others." |
Vodafone customers can opt-in to the offer by dialling shortcode 135. Upon successful subscription, customers will automatically enjoy 10 times bonus as a gift on all reloads worth Gh¢2 and above. |
Customers can pass on the reload pin within three days to two other subscribers who can then reload the same pin for 10 times the reload value as a gift.<eot>Ryan Jones reminded of rugby's fickle fortunes - Wales Online |
Ryan Jones reminded of rugby's fickle fortunes |
Jones was boarding his fourth long-haul flight in a month from Cape Town after medics decided a scan on his head – which was banged severely in a first-minute challenge with US Eagles prop Will Johnson last weekend – must rule him out of becoming a British and Irish Lion in South Africa. |
With Halfpenny having already departed after just one appearance because of a recurrence of a thigh strain and Shanklin's shoulder dislocation meaning he never made it at all, Wales' 2009 Lions legacy is certain to be tinged with heartache no matter what unfold in the final three weeks. |
"I was looking forward to getting involved with the rest of the lads but I guess it wasn't meant to be." |
A WRU spokesman said: "We fully understand the reasons this step has been taken, but we understand how desperately sad it is for Ryan who was looking forward to the honour of representing the Lions. |
Jones will now get the chance to do what he said he was looking forward to before receiving the Lions call – rest and catch up with family and friends over the remainder of the close-season. |
That may be no bad thing given how stressful the last six months must have been for him. |
Not only has Jones been in the midst of a somewhat shambolic Ospreys campaign which reached a low point in the 43-9 Heineken Cup humiliation against Munster, he has also seen his stock diminish on the international front. |
There are question marks over his future as Wales captain in the wake not just of Alun Wyn Jones' promotion to the job for the Italy match in March, but also Jones' own patchy form which, with the emergence of Andy Powell, had punters questioning his place in the team for the first time. |
The Wales management already see the second-row forward as the heir apparent to the current skipper, but the question next season will be how quickly they see fit to elevate him. |
If Jones is to stand any chance of preserving his leadership he must return next season looking more like his old self. A summer of recuperation rather than exertion with the Lions may be just the tonic he needs.<eot>Latest Internet Explorer 9 Beta Version | Noman Ali: Gadgets, Websites, Google, Social Media and SEO |
‹ Tips, Tricks and Shortcuts |
Inside Facebook › |
September 16, 2010 Latest Internet Explorer 9 Beta Version |
IE 9 is a big release. It's a complete overhaul of whatInternet Explorer was, and Microsoft is very focused on beautifying the web. IE 9 is faster, has better support for HTML5 and CSS3, and seems better-tuned to the needs of the user than previous versions did. |
There's a lot to like about IE 9. Taking UI cues fromGoogle Chrome, Microsoft has streamlined the interface, making the browser less apparent and allowing the user to focus more on content. Likewise, the addition of pinned websites makes accessing frequently accessed bookmarks faster and adds some great features by way of jump lists. |
http://www.youtube.com/v/B7qn1Z5LswI&rel=0&color1=0xb1b1b1&color2=0xd0d0d0&hl=en_US&feature=player_embedded&fs=1 |
Tags: beta product, Internet Explorer, Microsoft Corporation, software giant, Technology_Internet, web browser |
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