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a device according to the invention is intended for application , in the majority of cases , to automatic bottling machinery of the type utilized for continuous liquid - batching processes . an automatic machine of the type is generally designed as a carousel fitted with a plurality of filler valves , which turn as one with the carousel in continuous rotation , and which in most instances receive liquid for bottling from above by way of respective control cocks . the valves utilized in such a machine ( which are known to those skilled in the art ) comprise a body 2 , the top section of which incoporates a cock regulating the flow of liquid for bottling , and the bottom section of which incorporates a tube 3 through which the liquid flows out and into the bottle . during operation of the machine , a bottle 1 is offered to the single valve and filled with liquid as the carousel rotates . bottles are conveyed into the carousel by an infeed capstan , and conveyed away from the machine by an exit capstan when full . neither the carousel nor its capstans are illustrated , since such components , like the filler valves , are known to those skilled in the art , and in any case are not central to the subject matter of the disclosure . a device according to the invention comprises a clamping medium which , in the embodiments illustrated , consists of a plate 5 which exhibits a recess 6 shaped such as to accommodate at least part of the neck of a bottle . the contour of the recess 6 is embodied with a contact surface 7 designed to mate with the external projection 4 with which the neck of a standard production bottle is provided , in most cases . the method by which the plate 5 associates with the body 2 of the valve ( to be explained in greater detail in the course of the description ) is such as to ensure that a bottle engaged by the recess 6 will be coaxially - disposed with respect to the valve tube 3 . the device further comprises actuator means which operate the clamping medium , or plate 5 , allowing it to slide in an axial direction , relative to the body 2 of the valve . the sliding motion produced occurs between a lowered position denoted a ( fig1 ) wherein the plate 5 and the bottle engaged thereby lie beneath the tube 3 , and a raised position denoted b wherein the plate 5 is brought up to the level of the tube 3 , and the tube is inserted directly into the neck of the bottle . actuator means according to the invention consist of a frame 8 embodied as a sleeve 15 , able to slide in an axial direction relative to the body 2 of the valve , and integral with two upright members 9 disposed parallel with the axis of the valve , to whose bottom ends the plate 5 is fastened . tensioning means are located between the frame 8 and the body 2 of the valve for the purpose of controlling the plate 5 , keeping it raised when in position b , and ensuring its stability when lowered in position a . in the embodiment shown in fig1 such tensioning means take the form of coil springs 12 which ensheath the two upright members 9 of the frame , whereas in the embodiment shown in fig2 the same tensioning means take the form of pressurized fluid ( compressed air in the great majority of cases ) stored in a fluid - tight chamber 13 located between frame and valve . the volume of such a chamber 13 varies in response to the sliding motion of the frame relative to the body of the valve , and will decrease progressively with passage of the plate 5 from raised position b to lowered position a , thereby compressing the fluid and causing it to work in opposition to the downward tendency of the plate 5 . 10 denotes a roller which is integral with the frame 8 and engages a cam - type guide rail 11 during the carousel &# 39 ; s rotation . the guide rail 11 remains stationary during such rotation , and contact between rail and roller brings about downward slide of the frame with respect to the body of the valve , as will become clear in the course of the description . the body of the valve further comprises an annular seal 14 against which the mouth of the bottle urges when the plate 5 is brought into raised position . the seal 14 serves to avoid any escape of gas from the bottle during filling in those processes where the liquid batched may be gassy , in which case an opening will be provided by way of which to vent air from the bottle . the tensioning means incorporated into the device tend to urge the plate 5 constantly in the direction of raised position b . with the revolving carousel set in motion , a given valve will be brought into the area of the infeed capstan , and its roller 10 will engage the stationary guide rail 11 , whereupon the entire valve will follow the profile of the guide rail as in fig1 ( the arrow indicates the direction of the valve &# 39 ; s ongoing movement ) occasioning downward movement of the plate 5 into lowered position a . with the plate in this position , the neck of a bottle 1 brought onto the carousel by the infeed capstan can enter the recess 6 offered by the clamping medium , with its external projection 4 locating on the contact surface with which the plate is provided . the carousel continues to turn , and the roller 10 separates from the guide rail 11 . the tensioning means now bring about re - ascent of the plate 5 together with the bottle engaged therein , such that the plate regains position b , and the filler tube 3 is inserted into the bottle neck . the tensioning means now serve to keep the mouth of the bottle urged against the annular seal 14 . the valve and bottle continue to rotate as one with the carousel in the position thus gained , and a set of devices ( not illustrated ) cause a cock to open , thereby permitting flow of the liquid out through the tube 3 and into the bottle . thus it comes about that the bottle is clamped and filled during rotation of the carousel . as the full bottle approaches the exit capstan , the roller 10 engages a further guide rail which , in like manner to the rail 11 located near the infeed capstan , obliges the plate 5 and the full bottle to descend , thereby separating the bottle neck from the tube 3 and permitting removal of the bottle from the carousel altogether by way of the exit capstan . it is assumed in the foregoing description and in fig1 for the purposes of illustration , that separate guide rails 11 will be installed for infeed and exit . in the event that infeed and exit capstans are located close together however , as is not infrequently the case with present - day machines , one rail only may equally well be utilized , thereby maintaining the plate 5 in lowered position a throughout its progress from exit capstan back to infeed capstan . the device thus described permits utilization of bottles having limited strength such as those fashioned from plastic , since all of the mechanical effort produced in raising the bottle and urging it against the seal 14 is discharged upon the generally tough external projection 4 with which the necks of such bottles are provided . in other words , no stress is imparted to the remainder of the bottle , which therefore will remain undistorted . it will be clear enough that the device may be utilized to considerable advantage for filling glass bottles also , particularly where fashioned from a thin type of glass . operation of the device is particularly dependable , since adoption of the cam - and - follower principle ( roller 10 and guide rail 11 ) ensures that no contact can be made between bottle neck and filler tube at the two points where bottles are fed into and conveyed away from the carousel .	1
the system described herein provides a method for solving the problems discussed above . it is based on the detection of magnetic fields generated by a special configuration of conductors that , in effect , encodes the necessary positional information . a helically twisted line is shown schematically in fig1 . the configuration is that of a “ parallel - line ” electrical transmission line that has been helically twisted with a pitch wavelength that is large compared to the spacing between the two conductors 10 and 12 . the pitch wavelength of the helical line , a constant along the line , is the characteristic “ unit of distance .” fractional parts of this distance will be “ reported ”, for example by a radio link , to determine the instantaneous position of the moving object . to create the signals that are to be detected on the moving object , the transmission line is excited by an rf current at a low to intermediate rf frequency , for example 100 khz . when these currents flow in the transmission line there will exist in its near vicinity ( for example 5 cm away in a typical maglev - related situation ) a time - varying magnetic field . as will be shown , this magnetic field will carry the necessary positional information . as represented in a cylindrical coordinate system with the mid - line of the helical twisted line as its axis , the magnetic field , oscillating at the rf frequency of its excitation , will have both radial and azimuthal components . as shown schematically in fig2 , on the moving object ( not shown ) there will be located two small - area pickup coils 20 and 22 , nested together , each having the same area and the same number of turns of wire as the other one . one coil ( 20 ) has its axis pointing toward the symmetry axis of the transmission line ( comprised of wires 10 and 12 ) and thus intercepts the radial component of the magnetic field . the other coil ( 22 ) has its axis oriented at 90 degrees to the first one , so that it intercepts the azimuthal component of the magnetic field from the helical transmission line . with the configuration as described above , the following will occur . a magnetic field varying at the rf frequency and having both azimuthal and radial components will be generated at the position of the pickup coils . fig3 and 4 are plots of the calculated relative value of these two components at a particular instant of time when the current is flowing in the positive direction in the right - hand conductor and in the negative direction in the left - hand conductor . as can be seen , the two components are both sinusoidal in form and are equal in amplitude . however the fields will be shifted in spatial phase from each other by 90 degrees . in the description below , it will be assumed that the signals detected by the pickup coils are full - wave rectified before being processed by the electronics . an alternative , which might be advantageous in some situations , would be to process the pickup loop voltages before rectification , in order to preserve faithfully all of the phase and amplitude information carried by these voltages . this alternative approach will not be discussed here , in the interests of simplifying the discussion . consider now the voltages induced in the two pickup loops by the rf magnetic fields as these loops move parallel to the direction of the axis of the transmission line . when these induced voltages are full - wave rectified the resulting signals will take the forms shown in fig5 and 6 . now , upon using electronic circuitry to take the ratio of these two signals , a signal of the type shown in fig7 will result , i . e ., there will be produced periodic “ spikes ” with a spacing corresponding exactly to a half - wavelength of the helical line . these pulses represent fiducial marks that can be used to determine the position of the coils relative to the track . note that the location of these fiducial marks is independent of the amplitude of the signal , i . e ., of the height of the detector coils above the transmission line ( except that at too great a distance the signal intensity may be too low ). to calculate the position of the object to which the nested coils are attached , a relative known starting position of the object is determined . for example , the object &# 39 ; s starting position can be known , and as the object moves along the track , the method tabulates the sum of each “ unit of distance ” which is the total distance of the object from the starting point . the sum of each “ unit of distance ” can be made from many other points , as will be appreciated by those skilled in the art , e . g ., from a gap in the transmission line , from a sudden change in the polarity of the transmission line or from a signal placed at points along the track , to name a few . while the above technique may be adequate for many situations , there are those situations where it is important to be able to directly measure the position at any point between the fiducial marks . this objective can also be accomplished by electronic processing of the detected and rectified signals . as shown in fig8 , if the electronic system evaluates the phase angle as defined by the arc tangent of the ratio of the two fields there will result a series of triangular waves between the fiducial marks as the loops move with respect to the track . the amplitude of these triangular waves at any phase position between their minimum and maximum value is linearly related to location between the marks , thus can be used to determine an accurate value of that location . the answer will be independent of the distance of the pickup coils above the helical line , as long as the signal is detectable . fig9 and 10 represent examples of the full - wave - rectified signals that would be received by orthogonal pickup loops , as calculated from the theory . for this example , the helical line was made up of two 2 mm diameter conductors , spaced apart by 10 mm . the line impedance was 635 ohms . it was assumed that the end of the transmission line was terminated in its characteristic impedance . the input end of the line was driven at a frequency of 100 khz with a peak rf current of 1 ampere , requiring therefore 350 watts of drive power . the orthogonal pickup loops were located at a distance of 50 mm from the centerline of the helical transmission line , had an area of 5 cm 2 , and had 100 turns on each coil . as can be seen , the received signals are about 25 millivolts in amplitude , a signal level that would be entirely adequate for the purpose at hand . however , because of the strong cancellation of the fields that will occur at distances large compared to a pitch wavelength , the radiated rf power from the system at distances in excess of a meter or so should be extremely small . the above two location techniques , because they depend only on the ratio of the induced voltages in the two pickup coils , permit the use of the same system for a non - interfering communication link between the track system and the moving vehicle . this communication can be effected by amplitude or frequency modulation of the exciting rf currents in the helical transmission line . this modulation will produce a signal on each pickup loop that could be detected on the moving vehicle by conventional means , without interference with the location - measuring function . in yet another embodiment , advantage is taken of the “ reciprocal ” nature of the transmission of radio frequency signals between a source and a receiver . that is , the role of the helical transmission line and the orthogonal pickup loops is reversed , as follows : the two pickup loops are excited with radio - frequency currents that differ slightly from each other in frequency . these rf currents will then induce rf voltages in the helical transmission line the relative amplitude of which will be a function of the position of the pickup loops along the transmission line . since the signals received will be at two different frequencies , it will be possible to electronically extract the necessary positional information , for example by using frequency - selective circuits followed by detection and amplitude - comparison circuits . for those situations where it is important to make the position determination as independent as possible of both vertical and lateral displacements of the orthogonal pickup loops relative to the transmission line , two pairs of pickup loops could be employed . in this case the loop pairs would be displaced laterally , one to the left , and one to the right , of a vertical line passing through the geometric center of the helical line . if now the signals from the corresponding members of the loop pairs are combined electronically so as to average their output , the resultant positional determination will now be relatively insensitive to both vertical and horizontal displacements of the pickup loop assembly relative to the helical transmission line . the present invention can thus be used to precisely determine the position of a movable or moving object on a track or relative to a point examples of moving or movable objects include various types of magnetic levitation cars . some examples of magnetic levitation systems are discussed in the following patent applications , which are incorporated herein by reference : u . s . patent application ser . no . 09 / 896 , 583 , titled : “ improved inductrack magnet configuration ,” and u . s . patent application ser . no . 09 / 896 , 579 , titled : “ improved inductrack configuration .” the foregoing description of the invention has been presented for purposes of illustration and description and is not intended to be exhaustive or to limit the invention to the precise form disclosed . many modifications and variations are possible in light of the above teaching . for example , the transmission line may comprise more than two wires . in should be understood by those skilled in the art that the present invention can be implemented with a transmission line that produces a periodic field that is extracted to obtain periodic information . each of the two coils of the nested coils may not have the same area and / or same number of turns because the difference could be compensated for electronically . more than two coils can be used in the nested coils , especially in cases where the transmission line utilizes more than two conductors , such that each coil is oriented to collect a signal from one of the conductors . the embodiments disclosed were meant only to explain the principles of the invention and its practical application to thereby enable others skilled in the art to best use the invention in various embodiments and with various modifications suited to the particular use contemplated . the scope of the invention is to be defined by the following claims .	6
the invention consists of forming a stable solution of ketoprofen in water for use in mass medicating animals and the addition of a flavoring and sweetening agent to increase palatability . first , any edible weak base such as sodium bicarbonate may be added to ketoprofen in a ratio of 10 to 1 in order to completely and rapidly solubilize the ketoprofen in cold water and produce a palatable , stable , safe solution for mass medication . a dose of 1 to 2 mg / kg provides effective relief of viral induced inflammatory processes and fevers . this allows livestock to continue eating and drinking normally and reduces the incidence of secondary diseases and the need to treat with antibiotics . second , flavoring or sweetening agents may be added to increase palatability of the end solution . any of the following agents may be used : cyclohexyl - sulfamic acid , saccharin ( o - benzosulfimide ), and aspartame ( i . e ., l - aspartyl - l - phenylalanine methyl ester ) sold as nutrasweet ® artificial sweetener , and the like , in small amounts that are sufficient to enhance the palatability . if the animals would not be adversely affected by inclusion of sugar in the formation , then sugar can be used to sweeten the solution . in actual practice , the sweetener and the flavoring are added in amounts that overcome the taste of ketoprofen . the following examples serve to illustrate the many applications of the present invention and should not be considered as limiting by any means . a 2 1000 head finishing barn site experienced an outbreak of swine influenza . both barns , which housed 150 pound finishing hogs , experienced the outbreak simultaneously . we used one barn as the treatment group and one as the control group . the treatment group was given 1 mg / pound of ketoprofen for 3 days orally through the drinking water and the control group was given a placebo of flavored sodium bicarbonate in the water . we observed the pigs until they were marketed at 260 pounds 8 to 10 weeks after the outbreak . the results of the study included an average time to market for the treatment group of 9 days less than the control group . the morbidity at the time of the outbreak was 10 percent in the treatment group and 90 percent in the control group . the mortality was 5 . 2 percent in the control group and 2 . 1 percent in the treatment group . the controls required follow - up treatment with antibiotics two weeks after the outbreak and the treatment group did not require any mass medication with antibiotics . a 500 head cattle feedlot experienced an outbreak of ibr ( infectious bovine rhinotracheitis ) a very contagious viral respiratory disease in cattle . at the time of the outbreak we divided the group in half and treated ½ with 1 mg / pound of ketoprofen orally and ½ were used as controls . the cattle were treated that same in all other respects including intranasal vaccination and antibiotic treatment as needed . the animals were followed for 4 weeks post treatment and were scored based on clinical signs , morbidity , mortality , weight gain and rate of recovery . the results were as follows : weight clinical rectal rate of group mortality morbidity gain *** score * temp . ** recovery treatment 0 % 60 % 75 . 8 # 1 . 5 102 . 3 3 days controls 2 % 92 % 31 . 5 # 3 . 5 104 . 8 11 days the results show a substantial decrease in mortality and morbidity . the animals returned to eating within 24 hours of beginning the treatment in the treatment group and the controls were off feed from 3 to 14 days . this is why the weight gains were so different . an equine client with a horse with chronic laminitis was using phenylbutazone to try to control the inflammation and pain associated with the disease . this product had to be given to the horse daily by the owner . we tried giving ketoprofen in the water at 1 mg per pound for 2 weeks to measure acceptance and intake . the results were very good . the horse readily drank the water with the medication and was less painful then when on the previous treatment . a swine client with a 10 , 000 head nursery was experiencing severe mortality due to a prrs ( porcine respiratory and reproductive syndrome ) virus outbreak . they had used antibiotics with only partial success and were seeing mortalities as high as 30 percent in the group . we divided the barn into 2 groups and began treatment at the first signs of disease with the treatment group getting ketoprofen orally for 7 days along with the same treatments as the controls for other therapy . the results were substantially reduced mortality 7 % treatment group versus 21 % in the controls . we also saw less chronic pigs in the treatment group 3 % versus 15 % in the controls .	0
fig1 and 2 show the inventive cable guide on a front derailleur . in fig1 the actuating cable is routed downwards ; and in fig2 upwards . the derailleur includes the stationary part 1 , the moveable part 2 and the parallelogram mechanism 7 , which connects the stationary part 1 to the moveable part 2 . the main components of the parallelogram mechanism 7 are the connecting arm 4 and the guide arm 13 . the connecting arm 4 is pivotably connected to the hinge pin 21 on the stationary part 1 and to the hinge pin 22 on the moveable part 2 . the guide arm 13 is pivotably connected to the hinge pin 23 on the stationary part 1 and to the hinge pin 24 on the moveable part 2 . the hinge pin 21 is arranged at a lower position than the hinge pin 23 . since the distance between the hinge pins 21 and 22 in the connecting arm and , thus , the length of the connecting arm 4 is equal to the length of the guide arm 13 , the inclination angle of the chain guide 3 , connected to the moveable part 2 , does not change when pivoting from a retracted position to an extended position . the chain guide has a passage for the chain and shifts the chain between the chain wheels at the pedal bearing . the movement of the chain guide from the retracted to the extended position is performed by a pull movement at the actuating cable 6 . the opposite movement is performed through the effect of a return spring that is disposed around the hinge pin 21 . the stationary part 1 of the derailleur is securely connected to a component of the bicycle frame . to this end , the illustrated embodiment provides a flexible clamp 20 , which is wrapped around the seat tube and which is compressed with a tightening screw and presses the seat tube support 25 on the stationary part 1 against the seat tube . an alternative possibility of fastening consists of the use of a rigid clamp with a hinge on the stationary part 1 and a direct mounting , in which the stationary part 1 is securely screwed to a soldered - on part on the seat tube by means of a screw , for example . in the assembled state the cable guide part 5 is non - rotatably connected to the connecting arm 4 , as apparent from fig3 and 4 . the hinge pin 21 is mounted on the connecting arm 4 inside the pin bosses 27 . the center region of said hinge pin runs through the stationary part 1 , and one end of said hinge pin runs through the first opening 10 on the cable guide part 5 . a rivet head 29 of the hinge pin 21 ( shown on the right in fig3 , on the left in fig4 ) and a spring lock washer 28 ( shown on the right in fig4 , and on the left side in fig3 , but covered ) secure the hinge pin in the axial direction in relation to the cable guide part 5 and the connecting arm 4 . the rivet head 29 and the spring lock washer 28 represent axially effective stops , of which their function could also be achieved with other means , such as a circumferential flange or an obliquely inserted pin . in addition to the first connection between the connecting arm 4 and the cable guide part 5 by means of the hinge pin 21 , there is a second connection due to the bolt 17 extending through cable guide part 5 and connecting arm 4 , as shown in fig5 in the disassembled state and shown in fig3 in the assembled state . the result is a secure connection between the connecting arm 4 and the cable guide part 5 . owing to the hinge pin 21 , the cable guide part 5 and the connecting arm 4 are securely attached to each other in the axial direction . the bolt 17 prevents the cable guide part 5 and the connecting arm 4 from rotating in any way in relation to each other about the hinge pin 21 . the cable clamping screw 9 in connection with the cable clamping plate 19 and the clamping projection 8 , which fits into the second opening 11 of the cable guide part 5 , form the cable clamping device 12 . the actuating cable 6 is clamped in a groove 26 on the cable clamping plate 19 and is guided to one of the openings 16 as a function of the cable guide on the derailleur . these openings 16 serve to hold the actuating cable 6 and to prevent its release from the cable guide part 5 . the cable - clamping device 12 is located on the cable guide part 5 on the side opposite the connecting arm 4 . the result is a good accessibility , and an actuating cable 6 can be easily mounted and , if desired , replaced . on the other hand , there is only a short distance between the cable clamping and the passage of the hinge pin 21 through the stationary part 1 . this distance to the bearing point on the pin boss 27 in a direction parallel to the hinge pin 21 is a function of the size of the frictional forces . consequently the conditions are optimal for supporting the forces that are generated by the tensile force of the actuating cable 6 . the frictional forces are kept low . the longitudinal axis 15 of the cable clamping screw 9 extends obliquely to the plane in which the cable guide part 5 extends . therefore , the screw head 18 comes to rest on the other side of the cable guide part 5 in relation to the cable - clamping device 12 and is readily accessible at this position for actuation with a tool . thus , the arrangement according to the invention offers a good solution for the requirement arising from the need for a larger number of design variants for the cable control actuating device . the connecting arm 4 that is relatively expensive to manufacture is adapted to the various conditions by the addition of cable guide parts 5 that can be designed in different ways . the connecting arm 4 and the cable guide part 5 are stable and rigidly connected to each other ; and the actuating cable 6 does not suffer any losses with respect to the actuating path . in addition , the design solution offers good accessibility for the installation and replacement of the actuating cable control device , because the screw head 18 of the cable clamping screw 9 is placed at a place and orientation that is optimal for the user . it should be understood that the illustrated embodiments are examples only and should not be taken as limiting the scope of the present invention . the claims should not be read as limited to the described order or elements unless stated to that effect . therefore , all embodiments that come within the scope and spirit of the following claims and equivalents thereto are claimed as the invention .	1
the invention can be more fully understood by the following examples and preparations . ir ( infrared ) absorption spectra are recorded on a perkin - elmer model 421 or 137 infrared spectrophotometer . except when specified otherwise , undiluted ( neat ) samples are used . uv ( ultraviolet ) spectra are recorded on a cary model 15 spectrophotometer . nmr ( nuclear magnetic resonance ) spectra are recorded on a varian a - 60 , a - 60d , or t - 60 spectrophotometer in deuterochloroform solutions with tetramethylsilane as an internal standard ( downfield ). mass spectra are recorded on an cec model 21 - 110b double focusing high resolution mass spectrometer on an lkb model 9 , 000 gas - chromatograph - mass spectrometer . trimethylsilyl derivatives are used , except where otherwise indicated . the a - lx solvent system used in thin layer chromatography is made up from ethyl acetate - acetic acidcyclohexane - water ( 90 : 20 : 50 : 100 ) as modified from m . hamberg and b . samuelsson , j . biol . chem . 241 , 257 ( 1966 ). silica gel chromatography , as used herein , is understood to include elution , collection of fractions , and combination of those fractions shown by tlc ( thin layer chromatography ) to contain the pure product ( i . e ., free of starting material and impurities ). melting points ( mp ) are determined on a fisher - johns or thomas - hoover melting point apparatus . z 4 is cis -- ch = ch --( ch 2 ) 2 -- cf 2 - , y 1 is trans -- ch = ch --, r 1 , r 3 , r 4 , and r 6 are hydrogen , and r 7 is n - butyl ) its methyl ester , the 11α - methyl acetals thereof or the 15 - epimers thereof . a . 2β - carboxaldehyde - 4α - hydroxy - 6α - methoxy - 3α - tetrahydropyranacetic acid γ - lactone as prepared in the s . n . 676 , 890 , example 14 , part a ( 425 mg .) is dissolved in 20 ml . of diethyl ether and the solution treated with 4 . 8 ml . of 0 . 5 m 2 - oxo - heptylidine - tri - n - butyl phosphorane in diethyl ether . after 20 min ., the reaction mixture is evaporated and the residue chromatographed on 80 g . of silica gel . the column is eluted with ethyl acetate in n - hexane ( 1 : 1 ) and fractions containing pure 3α - hydroxy - 5α - methoxy - 2β -( 3 - oxo - trans - 1octenyl )- 3α - tetrahydropyranacetic acid γ - lactone , a formula xii compound , are combined ( 524 mg .) nmr absorptions are observed at 0 . 6 - 1 . 9 , 1 . 9 - 3 . 0 , 3 , 33 , 4 . 25 , 4 . 5 - 5 . 0 , 6 . 4 , and 6 . 80 δ . infrared absorptions are observed at 2900 , 1780 , 1670 , 1160 , 1130 , 1070 , 1050 , and 1025 cm .. sup . - 1 . the mass spectrum exhibits parent peak at 296 . 1589 . silica gel tlc r f is 0 . 43 in ethyl acetate and skellysolve b ( 1 : 1 ). b . to a mixture of 2 . 18 g . of anhydrous zinc chloride and 15 ml . of 1 , 2 - dimethoxyethane under a nitrogen atmosphere is added with stirring 0 . 61 g . of sodium borohydride . the resulting mixture is then stirred at ambient temperature for 2 hr . and thereafter cooled to - 15 ° c . a solution of 1 . 17 g . of the reaction product of part a in 10 ml . of 1 , 2 - dimethoxyethane is then added dropwise over about 2 min . the mixture is then stirred at - 15 ° c . for 2 hr ., thereafter at 0 ° c . for one hr . and finally at ambient temperature for about 1 . 5 hr . the mixture is then cooled to 0 ° c . and 4 . 4 ml . of water is added dropwise , with caution ( hydrogen gas evolution ). the resulting mixture is then diluted with 75 ml . of ethyl acetate and filtered through celite . the filtrate is then washed with 30 ml . of brine and the organic layer dried over magnesium sulfate and concentrated under reduced pressure . the resulting residue ( 1 . 24 g .) is then chromatographed on 125 g . of silica gel , deactivated by addition of 25 ml . of ethyl acetate . eluting with 500 ml . of ethyl acetate and hexane ( 3 : 1 ) and 500 ml . of ethyl acetate affords 1 . 05 g . of 4α - hydroxy - 6α - methoxy - 2β -[( 3rs )- 3 - hydroxy - trans - 1 - octenyl ]- 3α - tetrahydropyranacetic acid γ - lactone ( formula xiv ). epimeric alcohols are then separated employing silica gel thin layer chromatography , eluting with menthanol and chloroform ( 1 : 19 ). alternatively , the epimeric mixture of alcohols is employed directly in succeeding parts of the present example . for the epimeric mixture , a characteristic nmr absorption is observed at 3 . 27 δ . the mass spectrum exhibits a parent peak at 370 . 2194 and other peaks at 369 , 345 , 329 , 327 , 323 , 229 , 267 , 247 , 241 , 199 , 185 , 173 , and 129 . c . to a stirred solution of 1 . 05 g . of the epimeric mixture of the reaction product of part c in 15 ml . of toluene and 10 ml . of dry tetrahydrofuran at - 78 ° c . under a nitrogen atmosphere is added 15 ml . of a 10 percent solution of diisobutylaluminum hydride in toluene over a 5 min . period . the mixture is stirred for 20 min . and thereafter a solution of 3 ml . of water and 10 ml . of tetrahydrofuran is added cautiously with vigorous stirring . the resulting mixture is allowed to warm to ambient temperature and then filtered through celite , rinsing with ethyl acetate . the filtrate is then shaken with 30 ml . of brine and the resulting mixture filtered through celite . the filtrate is then washed with brine , and concentrated under reduced pressure to yield 1 . 0 g . of a formula xv compound ; 4α - hydroxy - 6α - methoxy - 2β -[( 3rs )- 3 - hydroxy - trans - 1 - octenyl ]- 3α - tetrahydropyran acetic acid γ - lactol , and oil . silica gel tlc r f is 0 . 21 and 0 . 24 in methanol and chloroform ( 1 : 19 ). alternatively reaction product of part c is prepared directly from the reaction product of part a as follows : the reaction product of part a ( 500 mg .) is dissolved in 10 ml . of tetrahydrofuran and the solution cooled to - 78 ° c . under an argon atmosphere . this stirred solution is then treated over 30 min , with 0 . 7 ml . of diisobutylaluminum hydride , diluted to 2 . 8 ml . with toluene . the reaction mixture is then treated dropwise with 2 ml . of water and allowed to warm to ambient temperature . ethyl acetate in 0 . 25 n aqueous hydrochloric acid are added to the reaction mixture , and the mixture partitioned between organic and aqueous phases . the organic phase is washed with brine , dried over magnesium sulfate and concentrated under reduced pressure to yield 0 . 364 g . of a crude oil , the ( 3rs )- 3 - hydroxy formula xxv compound , as above . d . a mixture of 1 . 69 g . of 57 percent sodium hydride in mineral oil and 45 ml . of dry dimethylsulfoxide are stirred slowly under nitrogen at 65 °- 70 ° c . for one hr . this solution is then cooled to 15 ° c . and 9 . 0 g . of 4 , 4 - difluoro - 4 - carboxybutyltriphenphosphonium bromide is added . the resulting orange mixture is then stirred for 30 min . at ambient temperature , cooled to 15 ° c . and the solution of 1 . 0 g . of the reaction product of part c in 5 ml . of dimethyl sulfoxide is added . the resulting mixture is then stirred at ambient temperature for 2 . 5 hr . and is then cooled to 15 ° c . water is added with cooling , yielding a solution of about ph 9 . this solution is then extracted with diethyl ether to remove neutral materials . to the aqueous layer is added a suspension of 10 g . of ammonium chloride in 60 ml . of brine and the resulting mixture extracted with ethyl acetate . the ethyl acetate extract is then washed with brine , dried over magnesium sulfate , and concentrated under reduced pressure . the resulting residue ( 1 . 5 g .) is chromatographed on 100 g . of acid - washed silica gel , deactivated by addition of 20 ml . of ethyl acetate . eluting with one 1 . of ethyl acetate and hexane ( 1 : 1 ) yields 11 - deoxy - 11α - methoxy - 15 - epi - 2 , 2 - difluoro - txb 2 , and 11 - deoxy - 11α - methoxy - 2 , 2 - difluro - txb 2 . e . methyl esterification employing ethereal diazomethane , yields 2 , 2 - difluoro - 11 - deoxy - 11α - methoxy - txb 2 , methyl ester , or its 15 - epimer . f . a solution of one ml . of 85 percent aqueous phosphoric acid and 10 ml . of water is added with stirring to a solution of 220 mg . of the reaction product of part d the ( 15s )- or ( 15r )- epimer in 10 ml . of tetrahydrofuran . the resulting solution is then heated to 40 ° c . for 6 hr . and sodium chloride is thereafter added to the mixture . the resulting mixture is extracted with ethyl acetate and the ethyl acetate extract washed with brine until the aqueous layer is neutral . the organic phase is then dried over magnesium sulfate and concentrated to a residue . the residue ( 210 mg .) is then chromatographed on 20 g . of acid - washed silica gel , deactivated by addition of 4 ml . of ethyl acetate . eluting with 70 ml . of ethyl acetate and hexane ( 3 : 1 ), and 100 ml . of ethyl acetate yields the title 2 , 2 - difluoro txb 2 or its 15 - epimer respectively . g . methyl esterification , of the reaction product of part f , employing ethereal diazomethane , yields 2 , 2 - difluoro - txb 2 , methyl ester or its 15 - epimer . 13 , 14 - dihydro - txb 2 ( formula xxxii : r 1 , r 5 of the m 1 moiety , r 3 and r 4 of the l 1 moiety , and r 6 are all hydrogen , z 4 is cis -- ch = ch --( ch 2 ) 3 -- , y 1 is -- ch 2 ch 2 -- , and r 7 n - butyl ) its 11α - methylacetal , the methyl esters thereof , or the 15 - epimers thereof . a . a mixture of 4 g . of the reaction product of example 1 , part a , 800 mg . of a 5 percent palladium - on - charcoal catalyst , and 400 ml . of ethyl acetate are stirred at ambient temperature under one atmosphere of hydrogen for one hr . hydrogen uptake proceeds rapidly , and the reaction is terminated when silica gel tlc indicates the reaction is complete . the resulting mixture is then filtered through celite and washed with ethyl acetate . the filtrate is then evaporated to yield a formula xiii compound : 3α - hydroxy - 5α - methoxy - 2β -( 3 - oxo - octyl ) 3α - tetrahydropyranacetic acid γ - lactone . b . following the procedure of example 1 , parts b and c , the reaction product of example 1 , part a , is transformed to 4α - hydroxy - 6α - methoxy - 2β -[( 3rs )- 3 - hydroxyoctyl ] 3α - tetrahydropyranacetic acid γ - lactol , a formula xv compound . c . following the procedure of example 1 , part d , but employing 4 - carboxybutyltriphenylphosphonium bromide in place of 4 , 4 - difluoro - 4 - carboxybutyltriphenylphosphonium bromide there is prepared 11 - deoxy - 11α - methoxy - 15 - epi - 13 , 14 - dihydro - txb 2 or 11 - deoxy - 11α - methoxy - 13 , 14 - dihydro - txb 2 . d . following the procedure of example 1 , part e , f , and g , there are prepared the various title products of this example : 11 - deoxy - 11α - methoxy - 13 , 14 - dihydro - txb 2 , methyl ester or its 15 - epimer ; 13 , 14 - dihydro - txb 2 , or its 15 - epimer ; and 13 , 14 - dihydro - txb 2 , methyl ester or its 15 - epimer . 15 - methyl - txb 2 ( formula xxxii : r 1 , r 6 and r 3 and r 4 of the l 1 moiety are all hydrogen , r 5 of the m 1 moiety is methyl , z 4 is cis -- ch = ch --( ch 2 ) g --, y 1 is trans -- ch = ch --, and r 7 is n - butyl ) its 15 - epimer , the 11α - methylacetals thereof , or the methyl esters thereof . a . the reaction product of example 1 , part a , in tetrahydrofuran is treated with stirring at - 78 ° c . with 3 m methyl magnesium bromide in diethyl ether , added dropwise . after 2 hr ., there is added dropwise at - 78 ° c . 10 ml . of saturated aqueous ammonium chloride . the resulting mixture is then warmed to 25 ° c . and shaken with diethyl ether and water . the organic phase is then washed with brine and dried and concentrated to yield 4α - hydroxy - 6α - methoxy - 2β -[( 3rs )- 3 - methyl - 3 - hydroxy - trans - 1 - octenyl ]- 3α - tetrahydropyranacetic acid γ - lactone , a formula xiv compound . b . following the procedure of example 1 , parts b and c , the procedure of example 2 , part c and the procedure of example 1 , parts e , f , and g , successively , there are prepared the various title products : 11 - deoxy - 11α - methoxy - 15 - methyl - txb . sub . 2 , or its 15 - epimer ; 11 - deoxy - 11α - methoxy - 15 - methyl - txb 2 , methyl ester , or its 15 - epimer ; 15 - methyl - txb 2 , or its 15 - epimer ; and 15 - methyl - txb 2 , methyl ester , or its 15 - epimer . txb 1 ( formula xxxii : r 1 , r 3 and r 4 of the l 1 moiety , r 5 and r 6 are all hydrogen , z 4 is --( ch 2 ) 5 --, y 1 is trans -- ch = ch --, and r 7 is n - butyl ) its 15 - epimer , the 11α - methylacetals thereof , and the methyl esters thereof . a . a mixture of txb 2 , its 15 - epimer , the 11α - methyl - acetals thereof , or the methyl esters thereof ; a 5 percent rhodium - on - alumina catalyst ; and ethyl acetate is stirred under one atmosphere of hydrogen at 0 ° c . until substantially all the starting material has been consumed as indicated by silica gel tlc . the resulting mixture is then filtered to remove catalyst and the filtrate is concentrated under reduced pressure . the residue so obtained is then chromatographed on silica gel and fractions containing one of the respective pure title products are combined and concentrated to yield the title compound . cis - 4 , 5 - didehydro - txb 1 ( formula xxxii : r 1 , r 3 and r 4 of the l 1 moiety , r 5 of the m 1 moiety and r 6 are all hydrogen , z 4 is cis -- ch 2 -- ch = ch -( ch 2 ) 2 --, y 1 is trans -- ch = ch --, and r 7 is n - butyl ) its 15 - epimer , the 11α - methylacetals thereof , or a . a mixture of the reaction product of example 1 , part b , ( 35 . 9 g . ), 15 ml . of freshly distilled dihydropyran , and 0 . 3 g . of pyridine hydrochloride in 100 ml . of dichloromethane is stirred under a nitrogen atmosphere at about 25 ° c . for 18 hr . the resulting mixture is then diluted with cold diethyl ether and washed with ice - cold 0 . 1 n hydrochloric acid , water , 5 percent aqueous sodium bicarbonate , and brine . this solution is then dried and concentrated under reduced pressure and chromatographed yielding the thp ether of the starting material ; 6α - methoxy - 4α - hydroxy - 2β -[( 3rs )- 3 - tetrahydropyranyloxy - trans - 1 - octenyl ]- 3α - tetrahydropyranacetic acid γ - lactone , a formula xvii compound . b . the reaction product of part a above is transformed to 6α - methoxy - 4α - hydroxy - 2β -[( 3rs )- 3 - tetrahydropyranyloxy - trans - 1 - octenyl ]- 3α - tetrahydropyranacetic acid γ - lactol following the procedure of example 1 , part c . c . methyltriphenylphosphonium bromide ( 17 . 5 g .) is added to a solution of sodiodimethylsulfinylcarbanide prepared from sodium hydride ( 57 percent , 2 . 02 g .) and 75 ml . of dimethylsulfoxide at 65 ° to 70 ° c .) and cooled to 15 ° c . the resulting mixture is then stirred at 15 ° to 25 ° c . for 20 min ., and cooled to 15 ° c . to this solution is added a mixture of the reaction product of part b above ( 10 g .) in 20 ml . of dimethylsulfoxide . the resulting mixture is then stirred at about 25 ° c . for 2 . 5 hr ., and then shaken with water and 500 ml . of diethyl ether . the organic phase is then washed with water and brine , dried , and concentrated under reduced pressure . the residue is triturated with diethyl ether and then skellysolve b and filtered and the filtrate evaporated to yield a residue which is chromatographed on silica gel yielding 6α - methoxy - 4α - hydroxy - 2β -[( 3rs )- 3 - tetrahydropyranyloxy - trans - 1 - octenyl ] - 3α -( 2 &# 39 ;- propenyl )- tetrahydropyran , a formula xix compound . d . to a solution of 5 . 2 g . of the reaction product of part c above in 50 ml . of dry tetrahydrofuran at 0 ° c . under a nitrogen atmosphere is added with stirring 10 ml . of disiamylborane ( bis ( 1 , 2 - dimethylpropyl ) borane ), 1 after one hr . at 0 ° c . there is added one ml . of water and ( cautiously ) a solution of one ml . of 50 percent aqueous sodium hydroxide in 20 ml . of methanol . to this mixture is added 15 ml . of 15 percent hydrogen peroxide , maintaining the reaction temperature below 40 ° c . after stirring for one hr . at about 25 ° c ., the mixture is shaken with brine and ethyl acetate . the organic phase is then washed with brine , dried and concentrated . the residue is then taken up in xylene and then concentrated again under reduced pressure . the product is then chromatographed on silica gel yielding a formula xx product : 6α - methoxy - 4α - hydroxy - 2β -[( 3rs )- 3 - tetrahydropyranyloxy - trans - 1 - octenyl ]- 3α -( 3 - hydroxypropyl )- tetrahydropyran . e . to a solution of 21 . 3 g . of the reaction product of part d above , 190 ml . of tetrahydrofuran , and 100 ml . of hexamethyldisilizane at ambient temperature is added with stirring 25 ml . of trimethylsilyl chloride . the resulting mixture is then allowed to stand at ambient temperature until silica gel tlc indicates the formation of the bis -( trimethylsilyl ) derivative is complete . thereupon crude product is concentrated under reduced pressure and the residue diluted with 250 ml . of dry benzene . this benzene containing mixture is then filtered , the solids washed with benzene , and the filtrate and washings combined and concentrated under reduced pressure to yield a formula xxi compound : 6α - methoxy - 4α - trimethylsilyloxy - 2β -[( 3rs )- 3 - tetrahydropyranyloxy - trans - 1 - octenyl ]- 3α -( 3 - trimethylsilyloxypropyl )- tetrahydropyran . f . to a solution of 100 ml . of dry methylene chloride in 6 . 2 ml . of pyridine at 15 ° c . is added with stirring 3 . 9 g . of dried chromium trioxide . this mixture is then stirred at 20 °- 23 ° c . for 30 min . and thereafter cooled to 15 ° c . to this cooled mixture is then added a solution of 2 . 3 g . of the reaction product of part e above in 15 ml . of methylene chloride . the resulting mixture is then stirred at ambient temperature for 30 min . benzene ( 25 ml . and 3 g . of diatomaceous earth ( celite ) are added to the mixture . the resulting mixture is then filtered through a bed of diatomaceous earth ( celite ) and acid washed silica gel . the resulting solids are then washed with ethyl acetate and the filtrate and washings combined and concentrated under reduced pressure at ambient temperature to a residue which is mixed with ethyl acetate and filtered by the method described above . this second filtrate and ethyl acetate washings are then combined and concentrated under reduced pressure at about 25 ° c ., preparing the formula xxxii compound : 6α - methoxy - 4α - trimethylsilyloxy - 2β -[( 3rs )- 3 - tetrahydropyranyloxy - trans - 1 - octenyl ]- 3α -( 3 - oxopropyl )- tetrahydropyran . g . the reaction product of part f is reacted with a mixture of tetrahydrofuran , water and acetic acid ( 1 : 3 : 6 ) at 40 ° c . for four hours . thereafter the resulting mixture is diluted with purification freeze - dried , extracted with ethyl acetate , washed , dried , and concentrated to yield the formula xxxii lactol . - methoxy - cis - h . following the procedure of example 1 , part d , but employing 3 - carboxypropyltriphenylphosphonium bromide in place of 4 , 4 - difluoro - 4 - carboxybutyltriphenylphosphonium bromide the reaction product of part g is transformed to a formula xxiv compound . purificaton and separation of mixed c - 15 epimers on silica gel chromatography yields 11 - deoxy - 11α - methoxy - cis - 4 , 5 - didehydro - txb 1 . following the procedure of example 1 , parts e , f , and g , there are prepared the various title products . 5 - oxa - txb 1 ( formula xxxii : r 1 , r 3 and r 4 of the l 1 moiety , m 5 , and r 6 are all hydrogen , z 4 is ch 2 -- o --( ch 2 ) 3 --, y 1 is trans -- ch = ch --, and r 7 is n - butyl ) its 15 - epimer , the 11α - methyl acetals thereof , or methyl esters thereof . a . a mixture of the reaction product of example 5 , part a ( 6 . 3 g .) and 15 ml . of 95 percent ethanol is treated at 0 ° c ., with stirring , with a solution of sodium borohydride ( 0 . 6 g .) in 10 ml . of water . the borohydride is added over a period of about one min . the resulting mixture is then stirred at 0 ° c . for 10 min . and shaken with 20 ml . of water , 250 ml . of ethyl acetate , and 150 ml . of brine . the organic phase is then washed with brine , dried , and concentrated under reduced pressure to yield a formula xxvi compound : 5α - methoxy - 4α - hydroxy - 2β -[( 3rs )- 3 - tetrahydropyranyloxy - trans - 1 - octenyl ]- 3α -( 2 - hydroxyethyl ) tetrahydropyran . b . a solution of potassium t - butoxide ( 1 . 77 g .) in 30 ml . of tetrahydrofuran is mixed at 0 ° c ., with stirring , with a solution of 5 . 8 g . of the reaction product of part a above in 30 ml . of tetrahydrofuran . the resulting mixture is then stirred at 0 ° c . for 5 min . and thereafter 5 ml . of trimethyl ortho - 4 - bromobutyrate ( see u . s . pat . no . 3 , 864 , 387 ) is added . stirring is continued at 0 ° c . for 2 hr . and at about 25 ° c . for 16 hr . to this mixture is then added 30 ml . of dimethylformamide and 0 . 5 g . of potassium - t - butoxide . the mixture is then stirred for 20 hr . some of the solvent is then removed under reduced pressure and the residue shaken with water and diethyl ether dichloromethane ( 3 : 1 ). the organic phase is then washed with water and brine , dried , and concentrated . the residue containing the ortho ester is then dissolved in 60 ml . of methanol at 0 ° c . and treated with 15 ml . of cold water , containing 2 drops of concentrated hydrochloric acid . the resulting mixture is then stirred at 0 ° c . for 5 min . and shaken with 200 ml . of diethyl ether , 50 ml . of dichloromethane , and 200 ml . of brine . the organic phase is then washed with brine , dried , and concentrated under reduced pressure . the residue is then subjected to silica gel , separating mixed 15 - epimer and yielding 11 - deoxy - 11α - methoxy - 5 - oxa - txb 1 , methyl ester , 15 - tetrahydropyranyl ether or its 15 - epimer . c . following the procedure of example 5 , part g , the reaction product of part b is transformed to 11 - deoxy - 11α - methoxy - 5 - oxa - txb 1 , methyl ester or its 15 - epimer . d . the methyl esters of part b above are saponified by reaction with dilute aqueous alcoholic sodium hydroxide . thereafter , the sodium salt thusly prepared is acidified with dilute aqueous hydrochloric acid , yielding 11 - deoxy - 11α - methoxy - b 5 - oxa - txb 1 or its 15 - epimer . e . following the procedure of example 1 , parts f , and g , there are prepared 5 - oxa - txb 1 or its 15 - epimer or 5 - oxa - txb 1 , methyl ester or its 15 - epimer . following the procedures described in examples 1 - 6 , and selecting the appropriate reactants and starting materials , there are prepared each of the various compounds described by formula xxxii . preparation 1 : 3 , 7 - inter - m - phenylene - 3 - oxa - 16 - phenoxy - 4 , 5 , 6 , 17 , 18 , 19 , 20 - heptanor - pgf . sub . 1 . sub . α ( formula lvii : r 1 , r 3 , and r 4 or the l 1 moiety , and r 5 of the m 1 moiety are all hydrogen , z 3 is oxa , y 1 is trans -- ch = ch --, g is one , and r 7 is phenoxy ) a . 3 , 7 - inter - m - phenylene - 4 , 5 , 6 - trinor - pgf 1 . sub . α , methyl ester ( 1 g .) in 200 ml . of methanol is cooled to 0 ° c . in an ice bath . a stream of ozone generated from a conventional ozone producing apparatus is passed through the mixture until the starting material is completely consumed . thereupon the resulting ozonide is treated with dimethylsulfide , with stirring and allowed to warm to ambient temperature . the resulting product is washed and concentrated and the residue chromatographed yielding the formula lii aldehyde . about 4 . 5 g . of the formula lii aldehyde and 20 ml . of pyridine are subjected to dropwise addition of 4 g . of benzoyl chloride . the resulting mixture is then stirred at 25 ° c . for about 24 hr . the reaction mixture is then cooled to 0 ° c . and 5 ml . of water is added with stirring over about 10 min . thereafter the resulting mixture is extracted with diethyl ether and the ethereal layers are washed with sodium bisulfate , sodium bicarbonate , and brine ; dried over magnesium sulfate ; filtered ; and concentrated under reduced pressure to yield the formula liii dibenzoate . b . following the procedure of example 1 , part a , but employing dimethyl 2 - oxo - 3 - phenoxypropylphosphonate in place of dimethyl 2 - oxo - heptylphosphonate , there is prepared the formula liv product . c . following the procedure of example 1 , part b , the reaction product of part b above is transformed to the formula lvi compound . d . the reaction product of part c above in a solution of 2 percent potassium bicarbonate in methanol stirred at - 25 ° c . for 24 hr . and the resulting mixture acidified to ph 4 or 5 with sodium bisulfate and concentrated to a residue . the residue is then extracted with ethyl acetate and the ethyl acetate extracts are washed with brine and dried over anhydrous magnesium sulfate . the resulting mixture is then concentrated under vacuum and the residue chromatographed on silica gel tlc to yield pure title free acid . preparation 2 3 , 7 - inter - m - phenylene - 3 - oxa - 16 - phenoxy - 4 , 5 , 6 , 17 , 18 , 19 , 20 - heptanor - pgf . sub . 1 . sub . α , 9 , 15 - diacetate ( formula l : r 1 and r 3 and r 4 of the l 1 moiety are hydrogen , z 1 is ## str89 ## r 31 is benzoyl , y 1 is trans -- ch ═ ch --, r 5 of the m 3 moiety is methyl , r 7 is phenoxy and r 31 of the m 3 moiety is benzoyl ). a . a solution of the reaction product of preparation 1 ( 800 mg .) and 1 - butaneboronic acid ( 250 mg .) in 25 ml . of methylene chloride is heated at reflux . after 15 min . the methylene chloride is allowed to distill off slowly and fresh methylene chloride is added each time the total volume is reduced to about one - half of the original volume . after 90 min . all of the methylene chloride is removed under reduced pressure yielding the formula xli cyclic boronate of the starting material . b . to a solution of about 0 . 8 g . of the reaction product of part a above in pyridine ( 5 ml .) is added acetic anhydride ( 2 ml .). the mixture is then stirred for about 4 hr . under a nitrogen atmosphere and thereafter water ( 50 ml .) is added and the resulting mixture stirred for an additional one hr . the second resulting mixture is then extracted with ethyl acetate and the combined organic extracts are then washed , dried , and concentrated to yield the formula xlii 15 - acetate . c . the reaction product of part b above is dissolved in methanol in water ( 2 : 1 ) and a 30 percent methanolic solution of hydrogen peroxide ( about 4 equivalents per equivalent of cyclic boronate ) is added . the reaction mixture is maintained at ambient temperature , with stirring , until silica gel tlc indicates complete hydrolysis of the boronate ester . d . a solution of 0 . 60 g . of the reaction product of part c above in 70 ml . of dry acetone is cooled to - 20 ° c . thereafter 2 . 8 ml . of trimethylsilyldiethylamine is added . after 30 min . another 2 . 8 ml . of trimethylsilyldiethylamine is added . after 1 . 5 hr . the reaction mixture is cooled to - 70 ° c . and 150 ml . of cooled (- 70 ° c .) diethyl ether is added . this mixture is then cooled and poured into 100 ml . of ice cold saturated sodium bicarbonate solution and extracted three times with diethyl ether . the combined ethereal extracts are then washed with icecold saturated sodium bicarbonate and brine , dried over magnesium sulfate , and concentrated to yield the formula xlviii 11 - silylated compound . e . as described in part b above , the reaction product of part e is acylated at c - 9 , yielding the formula xlix compound . f . the formula lxix compound is then dissolved in 25 ml . of tetrahydrofuran and treated with a solution of tetra - n - butyl ammonium fluoride and tetrahydrofuran . this reaction mixture is then stirred at 65 ° c . for 2 hr . and thereafter cooled to ambient temperature . the resulting product is then concentrated and the reduced pressure , diluted with brine , and extracted with ethyl acetate . the organic extract is then washed with 2 m aqueous potassium bisulfate and brine over magnesium sulfate . concentration under reduced pressure yields the title product . preparation 3 3 , 7 - inter - m - phenylene - 3 - oxa - 16 - phenoxy - 4 , 5 , 6 , 17 , 18 , 19 , 20 - heptanor , 15 - acetate , 1 , 9 - lactone ( formula lxix : z 1 is ## str90 ## r 3 and r 4 of the l 1 moiety are hydrogen , and r 7 is phenoxy ) a . 3 , 7 - inter - m - phenylene - 3 - oxa - 4 , 5 , 6 , 17 , 18 , 19 , 20 - heptanor - pgf 1 . sub .. alpha ., 15 - acetate ( preparation 2 , part c , 35 mg . ), 39 mg . of triphenylphosphine , and 33 mg . of 2 , 2 &# 39 ;- dipyridyldisulfide in 0 . 5 ml . of dry oxygen free benzene is stirred at ambient temperature for 18 hr . the mixture is thereafter diluted with 25 ml . of benzene and heated at reflux for 24 hr . thereafter , pure product is isolated from the reaction mixture employing silica gel chromatographic separation . following the procedure of preparations 2 and 3 , each of the various pgf . sub . α - type compounds of formula xl of chart b is transformed to a pgf . sub . α - 9 , 15 - diacylate of formula l or a pgf . sub . α , 15 - acylate , 1 , 9 - lactone formula lxix . 3 , 7 - inter - m - phenylene - 3 - oxa - 16 - phenoxy - 4 , 5 , 6 , 17 , 18 , 19 , 20 - heptanor - txb 1 , methyl ester ( formula lxvi : r 1 is methyl , z 1 is ## str92 ## r 6 is hydrogen , y 1 is trans -- ch ═ ch --, r 3 and r 4 of the l 1 moiety and r 5 of the m 1 moiety are hydrogen , and r 7 is phenoxy ) a . a solution of 800 mg . of 3 , 7 - inter - m - phenylene - 3 - oxa - 16 - phenoxy - 4 , 5 , 6 , 17 , 18 , 19 , 20 - tetranor - pgf . sub . 1 . sub . α , methyl ester 9 , 15 - diacetate in 32 ml . of dry benzene is treated with 1 . 21 g . of lead - tetraacetate ( recrystallized from acetic acid and dried under reduced pressure over potassium hydroxide ) at 50 ° c . under a nitrogen atmosphere . reaction conditions are maintained for about 70 min . the resulting mixture is then filtered through celite and the filtrate washed with brine . the process of filtration is repeated and the second such filtrate is washed with brine , dried over sodium sulfate , and evaporated under reduced pressure at ambient temperature to yield { m - 2 -[( 1 &# 39 ; s )- 3 &# 39 ;- oxo - 1 &# 39 ;- hydroxypropyl ]-( 2s , 3r , 6r )- 3 , 6 - dihydroxy - 7 - phenoxy - trans - 4 - heptenephenoxy } acetic acid , methyl ester , 3 , 6 , 1 &# 39 ;- triacetate , a formula lxii compound . b . the entire crude reaction product from part a is then dissolved in 16 ml . of dry methanol , 2 . 5 ml . of trimethyl orthoformate , and 175 mg . of pyridine hydrochloride . this mixture is then stirred over a nitrogen atmosphere for about 60 hr . at ambient temperature . thereafter about 30 ml . of dry benzene is added and the methanol removed by concentration under reduced pressure . the resulting benzene - containing solution is then washed twice with brine , dried over sodium sulfate , and concentrated , yielding a residue . this residue is then chromatographed on silica gel , eluting with 50 to 75 percent ethyl acetate in hexane . fractions containing pure dimethylacetal of the reaction product of part a are combined , yielding the formula lxiii thromboxane intermediate . c . a solution of 110 mg . of sodium and 10 ml . of dry methanol is prepared under a nitrogen atmosphere and to this mixture is added a solution of 420 mg . of the reaction product of part b and 5 ml . of dry methanol . the resulting mixture is then stirred at ambient temperature for 1 . 5 hr . and thereafter 0 . 5 ml . of acetic acid is added , followed by addition of benzene . thereafter , the methanol is substantially removed by evaporation under reduced pressure . this benzene containing solution is then washed with brine , dried over sodium sulfate , and evaporated to yield a crude product shich is then chromatographed on silica gel eluting with two percent methanol and ethyl acetate . fractions containing pure { m - 2 -[( 1 &# 39 ; s )- 3 &# 39 ;- oxo - 1 &# 39 ;- hydroxypropyl ]-( 2s , 3r , 6r )- 3 , 6 - dihydroxy - 7 - phenoxy - trans - 4 - heptenephenoxy } acetic acid , methyl ester , dimethylacetal are obtained . d . a mixture of 187 mg . of the reaction product of part c under a nitrogen atmosphere is treated with a mixture of 4 ml . of acetic acid , 2 ml . of water , and 1 ml . of tetrahydrofuran for about 4 hr . thereupon , the resulting mixture is stirred at ambient temperature under vacuum for about one hr . and the mixture then freeze dried and chromatographed on silica gel eluting with one percent methanol and ethyl acetate . there is thereby obtained 3 , 7 - inter - m - phenylene - 3 - oxa - 16 - phenoxy - 4 , 5 , 6 , 17 , 18 , 19 , 20 - heptanor - 11 - deoxy - 11α - and 11β - methoxy - txb 1 , methyl ester and 3 , 7 - inter - m - phenylene - phenylene - 16 - phenoxy - 4 , 5 , 6 , 17 , 18 . 19 , 20 - heptanor - txb 1 , methyl ester . e . a solution of 300 mg . of the reaction product of part b in 5 ml of dry methanol under nitrogen is treated at room temperature with 10 ml of a sodium methoxide solution ( 120 mg . sodium dissolved in 10 ml . of methanol ) for 45 min . then 6 ml . of water is added and stirring is continued for 135 min . to hydrolyze the methyl ester . a solution of 2 . 5 ml . of 85 percent phosphoric acid in water is added and some of the methanol is removed at reduced pressure . the aqueous residue is then extracted with ethyl acetate . the extracts are dried over sodium sulfate and evaporated , yielding a free acid formula lxiv residue . f . the residue of part e is dissolved in 12 ml . of tetrahydrofuran and treated with 9 ml . of water and 1 ml . of 85 percent phosphoric acid for 4 . 5 87 hr . at room temperature for about 35 hr . thereafter the mixture is saturated with sodium chloride and extracted with ethyl acetate . the ethyl acetate extracts are then washed with brine , dried over sodium sulfate , and concentrated to a residue . this residue is then chromatographed on silica gel yielding 11 - deoxy - 11α - and 11β - methoxy 3 , 7 - inter - m - phenylene - 3 - oxa - 16 - phenoxy - 4 , 5 , 6 , 17 , 18 , 19 , 20 - tetranor - txb 1 and 3 , 7 - inter - m - phenylene - 3 - oxa - 16 - phenoxy - 4 , 5 , 6 , 17 , 18 , 19 , 20 - tetranor - txb 1 . a . a solution of the reaction product of preparation 3 is transformed to the reaction product of example 7 , part c , following the procedure of example 7 , parts a , b , and c . b . the title product is prepared following the procedure of example 7 , parts d , e , and f . 2 - decarboxy - 2 - hydroxymethyl - txb 2 ( formula z 1 is cis -- ch ═ ch --( ch 2 ) 3 -- , y 1 is trans -- ch ═ ch --, r 5 of the m 1 moiety , r 3 and r 5 of the l 1 moiety , and r 6 are all hydrogen , and r 7 is n - butyl ) 750 mg . of 11 - deoxy - 11α - methoxy - txb 2 , methyl ester , dissolved in 50 ml . of diethyl ether are reacted with 500 mg . of lithium aluminum hydride at room temperature , with stirring . when the starting material is completely consumed ( as indicated by thin layer chromatographic analysis ) one ml . of water is cautiously added . thereafter 0 . 8 ml . of 10 percent aqueous sodium hydroxide is added and the resulting mixture allowed to stir for 12 hr . thereupon magnesium sulfate is added with stirring and the stirred mixture then filtered through magnesium sulfate and evaporated to a residue , which contains pure 2 - decarboxy - 2 - hydroxymethyl - 11 - deoxy - 11α - methoxy - txb 2 . following the procedure of example 1 , part f , the reaction product of the preceding paragraph is transformed to the title product . following the procedure of example 9 , but employing each of the various 11 - deoxy - 11α - or 11β - methoxy - txb - or txb - type compounds described above , there are prepared each of the various corresponding 2 - decarboxy - 2 - hydroxymethyl - 11 - deoxy - 11α - or 11β - methoxy - txb - or txb - type products . following the procedure of example 7 or 8 , but employing corresponding pgf 2 . sub . α - type compounds in place of the starting material therein , there are prepared : 11 - deoxy - 11α - methoxy - or 11α - methoxy - txb 2 ; 13 , 14 - dihydro - txb 2 ; or their respective 15 - epimers and the methyl esters thereof . following the procedure of example 7 , but employing a corresponding pgf . sub . α starting material as described above , there are prepared 11 - deoxy - 11α - methoxy - txb 2 -, 11 - deoxy - 11β - methoxy - txb 2 -, 11 - deoxy - 11α - methoxy - txb 1 -, 11 - deoxy - 11β - methoxy - txb 1 -, txb 2 -, or txb 1 - type compounds , in free acid or methyl ester form , or the 15 - epimers thereof , which exhibit the following functional characteristics : following the procedure of example 7 or 8 , but employing corresponding starting material as described above there are prepared 11 - deoxy - 11α - methoxy - or 11β - methoxy - txb 1 - or txb 1 - type compounds , in free acid or methyl ester form , or the respective 15 - epimers thereof , which exhibit the following functional characteristics ; a . the formula xxxiv compound wherein r 34 is benzyl and r 33 is methyl ( 1 . 7 g .) dissolved in 17 ml . of toluene and 4 ml . of tetrahydrofuran is cooled under an argon atmosphere in a dry - ice acetone bath . to this cooled solution is added diisobutylaluminum hydride . the reaction is complete in about 30 min ., and the reaction mixture is thereafter treated at - 78 ° c . with 1 . 7 ml . of water ( added dropwise ) and allowed to warm to 25 ° c . the resulting mixture is then filtered and the solid washed with benzene . the combined filtrates are then washed with brine and the organic layer dried over magnesium sulfate . concentration of the solution under reduced pressure yields 1 . 71 g . of a formula xxxv residue , which solidifies on standing . silica gel tlc r f is 0 . 13 in ethyl acetate and skellysolve b ( 40 : 60 ). b . sodium hydride ( 55 percent dispersion in oil ), 2 . 9 g ., is washed with n - hexane . to the residue is added 43 ml . of dry dimethylsulfoxide and the mixture heated to 65 ° c . for 2 hr . under an argon atmosphere . a resulting dark gray mixture is then cooled to 15 ° c . and maintained at that temperature while 15 . 4 g . of 4 - carboxybutyltriphenylphosphonium bromide , dissolved 70 ml . of dry dimethylsulfoxide , is added during 15 min . the resulting mixture is then allowed to warm to 25 ° c . and stirred for one hr . the mixture is then cooled again to 15 ° c . and treated over a 10 min . period with 1 . 71 g . of the reaction product of part a above , dissolved in 13 ml . of dry dimethylsulfoxide . after one hr ., 300 mg . of water is added while maintaining the reaction temperature below 20 ° c . the resultant mixture is then extracted with diethyl ether and the aqueous layer treated with 50 g . of ammonium chloride in 100 ml . of saturated brine . the resulting mixture is then extracted with ethyl acetate and the ethyl acetate layer dried over magnesium sulfate and concentrated under reduced pressure . the residue thusly obtained is then treated with excess ethereal diazomethane . the diethyl ether is then evaporated and the residue chromatographed over 200 g . of silica gel . eluting with mixtures of ethyl acetate and skellysolve b ( 40 : 60 and 50 : 50 ), pure formula xxxvi product wherein r 1 is methyl , g is one , r 2 is hydrogen , r 33 is methyl , and r 34 is benzyl , 2 . 02 g ., is obtained . nmr absorptions are observed at 1 . 4 - 2 . 5 , 3 . 35 , 3 . 62 , 4 . 58 , 4 . 8 - 5 . 0 , 5 . 2 - 5 . 6 , and 7 . 3 δ . the mass spectrum indicates a parent peak 360 . 1929 . silica gel tlc r f is 0 . 41 in ethyl acetate and skellysolve b ( 40 : 60 ). c . the reaction product of part b ( 2 . 02 g .) is dissolved in 200 ml . of ethyl acetate . thereafter 2 g . of a 5 percent palladium - on - carbon catalyst is added and the mixture hydrogenated at 40 pounds per square inch . hydrogen uptake is monitored , and after 3 hr . an additional 2 g . of a 5 percent palladium - on - charcoal catalyst is added . hydrogenation is then allowed to continued for 16 hr . whereupon an additional 2 g . of the above catalyst is added and the reaction conditions are maintained for an additional 24 hr . at this point , silica gel tlc indicates the reaction is complete and the catalyst is removed by filtration and the solvent evaporated under vacuum yielding 1 . 51 g . of the formula xxxvii product as an oil . nmr absorptions are observed at 0 . 8 - 2 . 1 , 2 . 1 - 2 . 5 , 2 . 8 - 3 . 2 , 3 , 67 , 3 . 5 - 4 . 2 , and 4 . 8 - 5 . 0 δ . infrared absorptions are observed at 3600 , 2900 , 1740 , 1430 , 1180 , 1120 , and 1050 cm .. sup . - 1 . the mass spectrum indicates a parent peak at 417 . 2492 . silica gel tlc r f is 0 . 9 in ethyl acetate and skellysolve b ( 40 : 60 ). d . the reaction product of part c ( 1 . 51 g .) and 3 . 08 g . of dicyclohexylcarbodiimide are dissolved in 21 ml . of benzene and the resulting solution stirred at 25 ° c . under an argon atmosphere . to this solution is then added 2 . 48 g . of one m phosphoric acid in dimethylsulfoxide . after 90 min . the reaction mixture is treated with 1 . 5 g . of oxalic acid , dissolved in 3 ml . of methanol . the resulting mixture is then stirred , such stirring continuing until about 15 min . after an initial vigorous bubbling has ceased . the mixture is then filtered and the collected solids washed with benzene . the combined benzene solutions are then washed with a 5 percent sodium bicarbonate solution , dried over sodium sulfate , and evaporated under reduced pressure to yield a crude formula xxxviii aldehyde , as an oil . this oil is then dissolved in 15 ml . of diethyl ether and the resulting solution treated with 33 ml . of 0 . 3 m tri - n - butyl - 2 - oxoheptylidine phosphorane and diethyl ether . after 1 . 5 hr . the reaction mixture is diluted with diethyl ether and resulting solution is washed with one n aqueous hydrochloric acid 5 percent aqueous sodium bicarbonate , and dried over magnesium sulfate . concentration of the solution under reduced pressure yields crude 11 - deoxy - 11α - methoxy - 15 - dehydro - txb 1 , methyl ester , as an oil . this product is then chromatographed over 200 g . of silica gel , eluting with acetone and benzene ( 7 : 93 ), yielding 1 . 15 g . of pure product . silica gel tlc r f for the formula xxxviii compound is 0 . 27 in acetone and benzene ( 10 : 90 ). for the 15 - dehydro - txb 1 reaction product nmr absorptions are observed at 0 . 7 - 2 . 7 , 3 . 35 , 3 . 63 , 4 . 8 - 4 . 95 , 6 . 32 , and 6 . 85 δ . infrared absorptions are observed at 3600 , 2900 , 1740 , 1675 , 1450 , 1430 , 1360 , 1180 , 1120 , 1150 , and 1020 cm . - 1 . the mass spectrum exhibits a parent peak at 366 . 2406 . silica gel tlc r f is 0 . 32 in acetone and benzene ( 10 : 90 ). e . dry zinc chloride ( 1 . 89 g .) is added to 25 ml . of dry tetrahydrofuran , and the mixture is stirred under an argon atmosphere at ambient temperature . to this mixture is added 0 . 5 g . of sodium borohydride . after 24 hr . this mixture is cooled to - 20 ° c . and treated with 1 . 15 g . of the reaction product of part d in 10 ml . of dry tetrahydrofuran , the addition proceeding over 5 min . after 2 hr . at - 20 ° c . the reaction is allowed to warm to ambient temperature and stirred 5 additional hr . the excess reducing agent is then destroyed by the careful addition of water . the reaction mixture is then poured into methyl acetate and extracted with brine , water , 5 percent aqueous sodium bicarbonate , and again with brine . the organic layer is then dried over magnesium sulfate and concentrated under reduced pressure yielding 1 . 12 g . of crude 11 - deoxy - 11α - methoxy - txb 1 , methyl ester , and its 15 - epimer . the epimeric alcohols are then purified by silica gel chromatographed , eluting with mixtures of acetone and benzene ( 5 : 95 to 20 : 80 ). accordingly , there are obtained 479 mg . of the 15 - epi compound and 536 mg . of the ( 15s ) compound . for the 15 - epi alcohol nmr absorptions are observed at 0 . 65 - 2 . 5 , 3 . 35 , 3 . 63 , 3 . 7 - 4 . 3 , 4 . 7 - 4 . 95 , and 5 . 6 - 5 . 85 δ . the mass spectrum exhibits a parent peak 544 . 3598 . silica gel tlc r f is 0 . 19 in acetone and benzene ( 10 : 90 ). for the ( 15s ) compound nmr absorptions are identical to those observed for the 15 - epi compound . the high resolution mass spectrum exhibits a parent peak at 544 . 3608 . silica gel tlc r f is 0 . 14 in acetone and benzene ( 10 : 90 ). f . the 15 - epi reaction product of part e ( 400 mg .) in 400 ml . of 45 percent aqueous potassium hydroxide are dissolved in 12 ml . of methanol and the resulting solution stirred at ambient temperature under an argon atmosphere for 15 min . the resulting mixture is then diluted with water and saturated sodium chloride . the resulting solution is then acidified to ph 5 with 2n hydrochloric acid and extracted with ethyl acetate . the ethyl acetate extracts are then washed with brine , dried over magnesium sulfate , and evaporated under reduced pressure yielding 372 mg . of pure 11 - deoxy - 11α - methoxy - 15 - epi - txb 1 . nmr absorptions are observed 3 . 36 , 3 . 8 - 4 . 3 , 3 . 75 - 3 . 95 , and 5 . 4 - 5 . 9 δ . the mass spectrum exhibits a parent peak at 602 . 3854 . silica gel tlc r f is 0 . 14 in acetone and benzene ( 40 : 60 ) and 0 . 73 in the a - ix solvent system . g . the reaction product of part f ( 365 mg .) and 0 . 18 ml . of 85 percent phosphoric acid are dissolved in 2 . 2 ml . of tetrahydrofuran and 1 . 8 ml . of water . the resulting solution is then warmed to 40 ° c . for 10 hr . the reaction mixture is then cooled and diluted with ethyl acetate and brine . the various layers are then separated and the aqueous layer extracted with ethyl acetate . the combined ethyl acetate solutions are then washed with brine , dried over magnesium sulfate , and evaporated under reduced pressure . the resulting residue is chromatographed on 30 g . of silica gel , eluting with ethyl acetate and skellysolve b ( 75 : 25 ) and ethyl acetate , yielding 273 ml . of 15 - epi - txb 1 . infrared absorptions are observed at 3350 , 2900 , 1710 , 1370 , 1240 , 1100 , 1040 , 1070 , 1020 , and 970 cm . - 1 . the mass spectrum exhibits a parent peak at 645 . 3860 . silica gel tlc r f is 0 . 50 in a - ix solvent system . h . following the procedure of part f , 400 mg . of the reaction product of part e is transformed to 11 - deoxy - 11α - methoxy - txb 1 . the nmr absorptions are observed at 3 . 38 , 4 . 75 - 4 . 95 , and 5 . 3 - 6 . 1 δ . the mass spectrum exhibits a parent peak 602 , 3851 . silica gel tlc r f is 0 . 22 in acetone and benzene ( 40 : 60 ) and 0 . 71 in the a - ix solvent system . i . the reaction product of part 8 ( 370 mg .) is transformed to txb 1 following the procedure described in part g above . infrared absorptions are observed at 3400 , 2950 , 2875 , 1715 , 1375 , 1240 , 1110 , 1040 , 1020 , and 970 cm . - 1 . the mass spectrum exhibits a parent peak at 660 . 4087 . silica gel tlc r f is 0 . 46 in the a - ix solvent system .	2
a first embodiment , a second embodiment , a third embodiment and a fourth embodiment are described below . the present technique is not limited to these embodiments . fig1 a - 1d and fig2 a - 2d illustrate in detail a structure and a manufacturing method of a semiconductor device 50 a including a metal - insulator - metal ( mim ) capacitive element 20 a in accordance with a first embodiment . in the semiconductor device 50 a of the first embodiment , a lower electrode 5 b in the mim capacitive element 20 a may be made of a material different from a material of a wiring layer 2 . since the lower electrode 5 b and the wiring layer 2 are present at different depths in the semiconductor device 50 a , the wiring layer 2 may be formed right below the mim capacitive element 20 a . a high degree of design freedom is provided in the design of the semiconductor device 50 a . referring to fig2 d , the structure of the semiconductor device 50 a of the first embodiment is described below . the semiconductor device 50 a includes the mim capacitive element 20 a above a substrate 30 . an interlayer insulator 9 is formed to cover the substrate 30 and the mim capacitive element 20 a . the substrate 30 includes a lower interlayer insulator 1 , the wiring layer 2 , a diffusion preventing layer 3 , and a silicon dioxide ( sio 2 ) layer 4 . the lower interlayer insulator 1 is made of silicon dioxide ( sio 2 ). the wiring layer 2 is formed in the lower interlayer insulator 1 . the diffusion preventing layer 3 is formed over the lower interlayer insulator 1 and the wiring layer 2 . the silicon dioxide layer 4 is formed on the diffusion preventing layer 3 . the mim capacitive element 20 a includes an upper electrode 7 b , a dielectric layer 6 b , and the lower electrode 5 b . the lower electrode 5 b and the dielectric layer 6 b extend over the upper electrode 7 b . it is noted that a first etching stopper 8 b is formed , covering the upper electrode 7 b and the dielectric layer 6 b . a via hole 11 a is opened in the interlayer insulator 9 and the first etching stopper 8 b to establish electrical connection with the upper electrode 7 b in the mim capacitive element 20 a . a via hole 11 b is opened in the interlayer insulator 9 , the first etching stopper 8 b , and the dielectric layer 6 b to establish electrical connection with the lower electrode 5 b in the mim capacitive element 20 a . a via hole 11 c is opened in the interlayer insulator 9 , the silicon dioxide layer 4 , and the diffusion preventing layer 3 to establish electrical connection with the wiring layer 2 of the substrate 30 . a via wiring 12 a is formed by filling the via hole 11 a with a conductor into . a via wiring 12 b is formed by filling the via hole 11 b with a conductor . a via wiring 12 c is formed by filling the via hole 11 c with a conductor . the wiring layer 2 extends below the mim capacitive element 20 a . the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 are formed at different depths of the semiconductor device 50 a . the via wiring 12 a and the via hole 11 a are collectively referred to as a first contact via , the via wiring 12 b and the via hole 11 b are collectively referred to as a second contact via , and the via wiring 12 c and the via hole 11 c are collectively referred to as a third contact via . a method of manufacturing the semiconductor device 50 a of the first embodiment is described below with reference to fig1 a - 1d and fig2 a - 2d . referring to fig1 a , the diffusion preventing layer 3 made of silicon carbide ( sic ) and having a thickness of , for example , about 70 nm is deposited over the wiring layer 2 in the lower interlayer insulator 1 through a sputtering process . the wiring layer 2 is made of copper , for example . the silicon dioxide layer 4 having a thickness of , for example , about 100 nm is deposited on the diffusion preventing layer 3 through a sputtering process . a first conductive layer 5 a made of titanium nitride ( tin ) and having a thickness of , for example , about 150 nm is then deposited on the silicon dioxide layer 4 through a sputtering process . a dielectric layer 6 a made of silicon dioxide ( sio 2 ) and having a thickness of , for example , about 40 nm is deposited on the first conductive layer 5 a through a chemical vapor deposition ( cvd ) process . a second dielectric layer 7 a made of titanium nitride and having a thickness of , for example , about 100 nm is deposited on the dielectric layer 6 a through a sputtering process . referring to fig1 b , the second conductive layer 7 a is patterned through a lithographic process and an etching process to form the upper electrode 7 b . in this process , the first conductive layer 5 a and the dielectric layer 6 a extend over the upper electrode 7 b . with reference to fig1 c , a first etching stopper 8 a is formed to a thickness of 70 nm through a cvd process to cover the upper electrode 7 b and the dielectric layer 6 a . with reference to fig1 d , the first etching stopper 8 a and the dielectric layer 6 a are treated by a lithographic process and an etching process to form the lower electrode 5 b . with reference to fig2 a , a plasma sio 2 layer is formed to a thickness of , for example , about 650 nm as the interlayer insulator 9 using a silane gas to cover the silicon dioxide layer 4 , the lower electrode 5 b , the dielectric layer 6 b , and the first etching stopper 8 b . the interlayer insulator 9 is formed , for example , using one of silane gases ( sih 2 cl 2 , sih 4 , si 2 h 4 , si 2 h 6 , etc ) through , for example , a cvd process . referring to fig2 b , a via hole 10 a , a via hole 10 b , and a via hole 10 c are opened in the interlayer insulator 9 toward the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 , respectively , at the same operation through a lithographic process and an etching process . the interlayer insulator 9 and the silicon dioxide layer 4 are etched , for example , using c 4 f 6 / ar / o 2 gases containing fluorine based c 4 f 6 gas through a reactive ion etching ( rie ) process . a chamber temperature is , for example , room temperature , and the gas flow rates are , for example , 10 - 30 sccm for the c 4 f 6 gas , 100 - 300 sccm for the ar gas , and 5 - 15 sccm for the o 2 gas . gas flow rates and pressure conditions are adjusted so that the interlayer insulator 9 has an etching rate higher than that of each of the first etching stopper 8 b , the dielectric layer 6 b , and the diffusion preventing layer 3 . more specifically , gas flow rates and pressure conditions are adjusted so that each of the first etching stopper 8 b , the dielectric layer 6 b , and the diffusion preventing layer 3 has an etching rate equal to or lower than 0 . 1 times the etching rate of the interlayer insulator 9 , under the same etching condition as the etching condition applied to the interlayer insulator 9 . such an adjustment prevents the upper electrode 7 b and the lower electrode 5 b from being overetched . referring to fig2 c , the first etching stopper 8 b , the dielectric layer 6 b , and the diffusion preventing layer 3 respectively present at the bottoms of the via hole 10 a , the via hole 10 b , and the via hole 10 c are removed . these layers are etched using , for example , ch 2 f 2 / n 2 / o 2 gases containing a fluorine based ch 2 f 2 gas through the rie process . in this etching process , the chamber temperature is room temperature , and gas flow rates are , for example , 10 - 35 sccm for the ch 2 f 2 gas , 50 - 100 sccm for the n 2 gas , and 15 - 40 sccm for the o 2 gas . the via hole 11 a , the via hole 11 b , and the via hole 11 c are thus opened . referring to fig2 d , tungsten ( w ) fills the via hole 11 a , the via hole 11 b , and the via hole 11 c through a cvd process to form the via wiring 12 a , the via wiring 12 b , and the via wiring 12 c . a barrier metal formation operation is not illustrated . the semiconductor device 50 a including the mim capacitive element 20 a is thus produced . with the semiconductor device 50 a including the mim capacitive element 20 a manufactured as described above , the lower electrode 5 b is made of a material different from a material of the wiring layer 2 . the via holes are opened to the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 at the same process operation . since the first etching stopper 8 b covers the entire the mim capacitive element , each electrode may be protected from overetching and free from contact failure . since the lower electrode 5 b and the wiring layer 2 are deposited at different depths , a wiring may be formed right below the mim capacitive element 20 a . the design freedom of the semiconductor device 50 a may be increased . a second embodiment is described below with reference to fig3 a - 3c through fig5 a - 5c . fig3 a - 3c through fig5 a - 5c illustrate in detail a structure of a semiconductor device 50 b having an mim capacitive element 20 b in accordance with the second embodiment . elements identical to those described in connection with the first embodiment are designated with the same reference numerals and the discussions thereof are omitted here . the semiconductor device 50 b of the second embodiment includes a first etching stopper 8 d and the dielectric layer 6 b , both made of silicon nitride ( sin ). with this structure , a groove defect generated in a dielectric layer 6 c present beneath the upper electrode 7 b in the course of a patterning process of the upper electrode 7 b is filled with the first etching stopper 8 d that is made of the same material as the dielectric layer 6 c . more specifically , the defect of the dielectric layer 6 c is corrected . this arrangement may control a reduction in withstanding voltage of the mim capacitive element 20 b and lot - to - lot manufacturing variations in a capacitance of the mim capacitive element 20 b . a structure of the semiconductor device 50 b of the second embodiment is described below with reference to fig5 c . the semiconductor device 50 b includes the mim capacitive element 20 b on the substrate 30 . the interlayer insulator 9 is formed , covering the substrate 30 and the mim capacitive element 20 b . the mim capacitive element 20 b includes the upper electrode 7 b , a dielectric layer 6 d , and the lower electrode 5 b . the lower electrode 5 b and the dielectric layer 6 d extend over the upper electrode 7 b . the first etching stopper 8 d is formed , covering the upper electrode 7 b and the dielectric layer 6 d . the via hole 11 a is opened in the interlayer insulator 9 and the first etching stopper 8 d to establish electrical connection with the upper electrode 7 b of the mim capacitive element 20 b . the via hole 11 b is opened in the interlayer insulator 9 , the first etching stopper 8 d , and the dielectric layer 6 d to establish electrical connection with the lower electrode 5 b of the mim capacitive element 20 b . the via hole 11 c is opened in the interlayer insulator 9 , the silicon dioxide layer 4 , and the diffusion preventing layer 3 to establish electrical connection with the wiring layer 2 of the substrate 30 . the via wiring 12 a is formed by filling the via hole 11 a with a conductor . the via wiring 12 b is formed by filling the via hole 11 b with a conductor . the via wiring 12 c is formed by filling the via hole 11 c with a conductor . the wiring layer 2 extends below the mim capacitive element 20 b . the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 are formed at different depths of the semiconductor device 50 b . the via wiring 12 a and the via hole 11 a , the via wiring 12 b and the via hole 11 b , and the via wiring 12 c and the via hole 11 c are respectively collectively referred to as a contact via . a method of manufacturing the semiconductor device 50 b of the second embodiment is described below with reference to fig3 a - 3c through fig5 a - 5c . referring to fig3 a , the diffusion preventing layer 3 is deposited over the wiring layer 2 in the lower interlayer insulator 1 in the same manner as previously described with reference to fig1 a . the silicon dioxide layer 4 is deposited on the diffusion preventing layer 3 in the same manner as previously described with reference to fig1 a . the first conductive layer 5 a is then deposited on the silicon dioxide layer 4 in the same manner as previously described with reference to fig1 a . the dielectric layer 6 c made of silicon nitride ( sin ) and having a thickness of , for example , about 40 nm is deposited on the first conductive layer 5 a through a cvd process . the second conductive layer 7 a made of titanium nitride and having a thickness of , for example , about 100 nm is deposited on the dielectric layer 6 c through a sputtering process , for example . referring to fig3 b , the second conductive layer 7 a is patterned through a lithographic process and an etching process to form the upper electrode 7 b . in this process , the first conductive layer 5 a and the dielectric layer 6 a are formed to extend over the upper electrode 7 b . fig3 c is an expanded view of a contact portion denoted by the letter a between the underside of the upper electrode 7 b and the dielectric layer 6 c in fig3 b . fig3 c illustrates a groove defect that is generated in a dielectric layer 6 c present beneath the upper electrode 7 b in the course of the patterning process of the second conductive layer 7 a . such a groove defect may cause a reduction in the withstanding voltage of the mim capacitive element 20 b and lot - to - lot variations in the capacitance of the mim capacitive element 20 b . with reference to fig4 a , a first etching stopper 8 c is formed to a thickness of , for example , about 70 nm through a cvd process to cover the upper electrode 7 b and the dielectric layer 6 c . fig4 b is an expanded view of a contact portion denoted by the letter a between the underside of the upper electrode 7 b and the dielectric layer 6 c in fig4 a . as illustrated in fig4 b , the first etching stopper 8 c made of the same material of the dielectric layer 6 c may fill a groove defect that has been generated in the dielectric layer 6 c present beneath the upper electrode 7 b in the course of the patterning process of the upper electrode 7 b . the defect of the dielectric layer 6 c is thus corrected . this arrangement may control a reduction in the withstanding voltage of the mim capacitive element 20 b and lot - to - lot variations in the capacitance of the mim capacitive element 20 b . with reference to fig4 c , the first etching stopper 8 d , the dielectric layer 6 c , and the first conductive layer 5 a are treated by a lithographic process and an etching process . through this process , the first etching stopper 8 d , the dielectric layer 6 d , and the lower electrode 5 b are formed . the mim capacitive element 20 b , including the upper electrode 7 b , the dielectric layer 6 d , and the lower electrode 5 b , is thus formed . with reference to fig4 d , a sio 2 layer is formed to a thickness of , for example , about 650 nm as the interlayer insulator 9 using a silane gas to cover the silicon dioxide layer 4 , the lower electrode 5 b , the dielectric layer 6 d , and the first etching stopper 8 d in the same manner as described with reference to fig2 a . referring to fig5 a , a via hole 10 a , a via hole 10 b , and a via hole 10 c are opened in the interlayer insulator 9 and the silicon dioxide layer 4 toward the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 , respectively , at the same operation through a lithographic process and an etching process . the interlayer insulator 9 and the silicon dioxide layer 4 are etched , for example , using c 4 f 6 / ar / o 2 gases containing a fluorine based c 4 f 6 gas through an rie process . a chamber temperature is , for example , room temperature , and the gas flow rates are , for example , 10 - 30 sccm for the c 4 f 6 gas , 100 - 300 sccm for the ar gas , and 5 - 15 sccm for the o 2 gas . gas flow rates and pressure conditions are adjusted so that the interlayer insulator 9 has an etching rate higher than that of each of the first etching stopper 8 d , the dielectric layer 6 d , and the diffusion preventing layer 3 . more specifically , gas flow rates and pressure conditions are adjusted so that each of the first etching stopper 8 d , the dielectric layer 6 d , and the diffusion preventing layer 3 may have an etching rate equal to or lower than 0 . 1 times the etching rate of the interlayer insulator 9 , under the same etching condition as the etching condition applied to the interlayer insulator 9 . such an etching condition may prevent the upper electrode 7 b and the lower electrode 5 b from being overetched . referring to fig5 b , the first etching stopper 8 d , the dielectric layer 6 d , and the diffusion preventing layer 3 respectively present at the bottoms of the via hole 10 a , the via hole 10 b , and the via hole 10 c are removed . these layers are etched using , for example , ch 2 f 2 / n 2 / o 2 gases containing a fluorine based ch 2 f 2 gas through the rie process . in this etching process , the chamber temperature is , for example , room temperature , and gas flow rates are , for example , 10 - 35 sccm for the ch 2 f 2 gas , 50 - 100 sccm for the n 2 gas , and 15 - 40 sccm for the o 2 gas . the via hole 11 a , the via hole 11 b , and the via hole 11 c are thus produced . referring to fig5 c , for example , tungsten ( w ) placed to fill the via hole 11 a , the via hole 11 b , and the via hole 11 c through a cvd process to form the via wiring 12 a , the via wiring 12 b , and the via wiring 12 c in the same manner as previously described with reference to fig2 d . a barrier metal formation operation is not illustrated . the semiconductor device 50 b including the mim capacitive element 20 b is thus produced . fig6 illustrates a weibull plot relating to dielectric breakdown of the mim capacitive element 20 b of the semiconductor device 50 b . the weibull plot of fig6 illustrates a distribution of cumulative probability of the dielectric breakdown of the mim capacitive element 20 b of the semiconductor device 50 b . in fig6 , the ordinate represents the cumulative probability of the dielectric breakdown of the dielectric layer 6 d in the mim capacitive element 20 b , and the abscissa represents time ( h ) to the dielectric breakdown of the dielectric layer 6 d in the mim capacitive element 20 b . the data plot denoted by a broken line represents the distribution of the cumulative probability of dielectric breakdowns and time to the dielectric breakdowns of the mim capacitive element with a voltage as high as 20 v applied between the upper electrode and the lower electrode in the semiconductor device . in this case , the semiconductor device has no first etching stopper formed on the side wall of the upper electrode . the data plot denoted by a solid line represents the distribution of the cumulative probability of dielectric breakdown and time to the dielectric breakdown of the mim capacitive element 20 b with a voltage as high as 20 v applied between the upper electrode 7 b and the lower electrode 5 b in the semiconductor device 50 b . in this case , the semiconductor device 50 b has the first etching stopper 8 d formed on the side wall of the upper electrode 7 b . referring to fig6 , the rate of dielectric breakdown increases with time in the semiconductor device having the mim capacitive element with no first etching stopper formed on the side wall of the upper electrode . in accordance with the second embodiment , the semiconductor device 50 b having the mim capacitive element 20 b with the first etching stopper 8 d formed on the side wall of the upper electrode 7 b provides the data plot indicating the cumulative probability of block diagram generally shifted to longer life side . the gradient of the data plot sharply increases at 0 . 5 × 10 − 2 ( h ) and later . the first etching stopper 8 d formed on the side wall of the upper electrode 7 b may thus control a reduction in the withstanding voltage of the mim capacitive element 20 b and lot - to - lot manufacturing variations in the capacitance of the mim capacitive element 20 b . the first etching stopper 8 d and the dielectric layer 6 d are made of silicon nitride ( sin ) in the semiconductor device 50 b having the mim capacitive element 20 b in accordance with the second embodiment . with this structure , the groove defect generated in the dielectric layer 6 c present beneath the upper electrode 7 b in the course of the patterning process of the upper electrode 7 b is filled with the first etching stopper 8 d that is made of the same material as the dielectric layer 6 c . more specifically , the defect of the dielectric layer 6 c may be corrected . this arrangement may control a reduction in the withstanding voltage of the mim capacitive element 20 b and lot - to - lot manufacturing variations in the capacitance of the mim capacitive element 20 b . a third embodiment is described below with reference to fig7 a - 7d and fig8 a - 8d . fig7 a - 7d and fig8 a - 8d illustrate in detail a structure of a semiconductor device 50 c having an mim capacitive element 20 c in accordance with the third embodiment . in the discussion of the third embodiment , elements identical to those described in connection with the first and second embodiments are designated with the same reference numerals and the discussion thereof are omitted here . the semiconductor device 50 c of the third embodiment includes a second etching stopper 13 b and the dielectric layer 6 b . with this structure , the second etching stopper 13 b formed on the upper electrode 7 b , a first etching stopper 8 f formed on the lower electrode 5 b , and the diffusion preventing layer 3 formed on the wiring layer 2 are removed at the same operation of removing each etching stopper remaining at the bottom of each via . the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 may thus be prevented from being overetched . a good contact may thus be established when each of the via hole 11 a , the via hole 11 b , and the via hole 11 c is filled with the metal . the wiring layer 2 is arranged below the mim capacitive element 20 c . the upper electrode 7 b , the lower electrode 5 b and the wiring layer 2 are formed at different depths . a structure of the semiconductor device 50 c of the third embodiment is described below with reference to fig8 d . the semiconductor device 50 c includes the mim capacitive element 20 c on the substrate 30 . the interlayer insulator 9 is formed , covering the substrate 30 and the mim capacitive element 20 c . the mim capacitive element 20 c includes the upper electrode 7 b , the dielectric layer 6 b , and the lower electrode 5 b . the lower electrode 5 b and the dielectric layer 6 b are formed to extend over the upper electrode 7 b . the first etching stopper 8 f is formed , covering the upper electrode 7 b and the dielectric layer 6 b . the second etching stopper 13 b is formed on the upper electrode 7 b . the via hole 11 a is opened in the interlayer insulator 9 and the first etching stopper 8 f to establish electrical connection with the upper electrode 7 b of the mim capacitive element 20 c . the via hole 11 b is opened in the interlayer insulator 9 , the first etching stopper 8 f , and the dielectric layer 6 b to establish electrical connection with the lower electrode 5 b of the mim capacitive element 20 c . the via hole 11 c is opened in the interlayer insulator 9 , the silicon dioxide layer 4 , and the diffusion preventing layer 3 to establish electrical connection with the wiring layer 2 of the substrate 30 . the via wiring 12 a is formed by filling the via hole 11 a with a conductor . the via wiring 12 b is formed by filling the via hole 11 b with a conductor . the via wiring 12 c is formed by filling the via hole 11 c with a conductor . the wiring layer 2 extends below the mim capacitive element 20 b . the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 are formed at different depths in the semiconductor device 50 c . the via wiring 12 a and the via hole 11 a , the via wiring 12 b and the via hole 11 b , and the via wiring 12 c and the via hole 11 c are respectively collectively referred to as a contact via . a method of manufacturing the semiconductor device 50 c of the third embodiment is described below with reference to fig7 a - 7d and fig8 a - 8d . referring to fig7 a , the diffusion preventing layer 3 , the silicon dioxide layer 4 , the first conductive layer 5 a , the dielectric layer 6 a , the second conductive layer 7 a , and a second etching stopper 13 a are laminated in that order over the wiring layer 2 in the lower interlayer insulator 1 . the diffusion preventing layer 3 is made of silicon carbide and has a thickness of , for example , about 70 nm . the silicon dioxide layer 4 has a thickness of , for example , about 100 nm . the first conductive layer 5 a is made of titanium nitride and has a thickness of , for example , about 150 nm . the dielectric layer 6 a is made of silicon nitride and has a thickness of , for example , about 40 nm . the second conductive layer 7 a is made of titanium nitride and has a thickness of , for example , about 100 nm . the second etching stopper 13 a is made of silicon carbide and has a thickness of , for example , about 31 nm . referring to fig7 b , the second etching stopper 13 a and the second conductive layer 7 a are patterned through a lithographic process and an etching process to form the second etching stopper 13 b and the upper electrode 7 b . in this process , the first conductive layer 5 a and the dielectric layer 6 a are formed to extend over the second etching stopper 13 b and the upper electrode 7 b . referring to fig7 c , a first etching stopper 8 e made of silicon carbide is deposited to a thickness of , for example , about 47 nm through a cvd process , thereby covering the second etching stopper 13 b , the upper electrode 7 b and the dielectric layer 6 a . with reference to fig7 d , the first etching stopper 8 e , the second etching stopper 13 b , the dielectric layer 6 a , and the first conductive layer 5 a are treated by a lithographic process and an etching process . through this process , the first etching stopper 8 f , the second etching stopper 13 b , the dielectric layer 6 b , and the lower electrode 5 b are formed . the mim capacitive element 20 c , including the upper electrode 7 b , the dielectric layer 6 b , and the lower electrode 5 b , is thus formed . with reference to fig8 a , a sio 2 layer is formed to a thickness of , for example , about 650 nm as the interlayer insulator 9 using a silane gas to cover the silicon dioxide layer 4 , the lower electrode 5 b , the dielectric layer 6 b , and the first etching stopper 8 f . referring to fig8 b , the via hole 10 a , the via hole 10 b , and the via hole 10 c are opened in the interlayer insulator 9 and the silicon dioxide layer 4 respectively toward the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 at the same operation through a lithography process and an etching process in the same manner as described with reference to fig2 b . the interlayer insulator 9 and the silicon dioxide layer 4 are etched using , for example , a mixture of a c 4 f 6 gas , an ar gas and an o 2 gas in the opening operation of the via hole 10 a , the via hole 10 b , and the via hole 10 c . gas flow rates and pressure conditions are adjusted so that the interlayer insulator 9 has an etching rate higher than that of each of the first etching stopper 8 f , the dielectric layer 6 b , and the diffusion preventing layer 3 . more specifically , gas flow rates and pressure conditions are adjusted so that each of the first etching stopper 8 f , the dielectric layer 6 b , and the diffusion preventing layer 3 may have an etching rate equal to or lower than 0 . 1 times the etching rate of the interlayer insulator 9 , under the same etching condition as the etching condition applied to the interlayer insulator 9 . such an adjustment prevents the upper electrode 7 b and the lower electrode 5 b from being overetched . in the etching process , the etching rate of the silicon dioxide layer may be preferably about 65 times the etching rate of the silicon carbide layer . subsequent to the opening of via holes , the first etching stopper 8 f remaining in each of the via hole 10 a , the via hole 10 b , and the via hole 10 c is about 70 nm thick on the upper electrode 7 b and about 25 nm thick on the lower electrode 5 b . in addition to the first etching stopper 8 f , the dielectric layer 6 b made of silicon nitride and having a thickness of about 40 nm is present on the lower electrode 5 b . referring to fig8 c , the first etching stopper 8 f , the dielectric layer 6 b , and the diffusion preventing layer 3 respectively present at the bottoms of the via hole 10 a , the via hole 10 b , and the via hole 10 c are removed . these layers are etched using , for example , ch 2 f 2 / n 2 / o 2 gases containing a fluorine based ch 2 f 2 gas through the rie process . in this etching process , the chamber temperature is , for example , room temperature , and gas flow rates are , for example , 10 - 35 sccm for the ch 2 f 2 gas , 50 - 100 sccm for the n 2 gas , and 15 - 40 sccm for the o 2 gas . the via hole 11 a , the via hole 11 b , and the via hole 11 c are thus opened . if the silicon carbide layer and the silicon nitride layer are etched at the same operation using a mixture of the ch 2 f 2 gas , the o 2 gas , and the n 2 gas , the etching rate of the silicon carbide may become about 1 . 13 times the etching rate of the silicon nitride . the amounts of etch under the etching condition are 40 nm for the silicon nitride layer and 45 nm for the silicon carbide layer . the first etching stopper 8 f and the second etching stopper 13 b on the upper electrode 7 b , the first etching stopper 8 f and the dielectric layer 6 b on the lower electrode 5 b , and the diffusion preventing layer 3 on the wiring layer 2 are removed at the same operation of removing each etching stopper remaining at the bottom of each via . the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 are prevented from being overetched . a good contact is established when each via is filled with the metal . referring to fig8 d , for example , tungsten ( w ) is placed to fill the via hole 11 a , the via hole 11 b , and the via hole 11 c through a cvd process to form the via wiring 12 a , the via wiring 12 b , and the via wiring 12 c . a barrier metal formation operation is not illustrated . the semiconductor device 50 c including the mim capacitive element 20 c is thus produced . the second etching stopper 13 b is formed on the upper electrode 7 b in the semiconductor device 50 c of the third embodiment . with this structure , the second etching stopper 13 b formed on the upper electrode 7 b , the first etching stopper 8 f formed on the lower electrode 5 b , and the diffusion preventing layer 3 formed on the wiring layer 2 are removed in the removal process of the etching stopper remaining in each of the via hole 10 a , the via hole 10 b , and the via hole 10 c . the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 may be prevented from being overetched . a good contact may be established in the filling of the via hole 11 a , the via hole 11 b , and the via hole 11 c with the metal . a fourth embodiment is described below with reference to fig9 a - 9c through fig1 a - 11c . fig9 a - 9c through fig1 a - 11c illustrates in detail a structure and a manufacturing method of a semiconductor device 50 d having an mim capacitive element 20 d in accordance with the fourth embodiment . elements identical to those described in connection with the first through third embodiments are designated with the same reference numerals and the discussions thereof are omitted here . as the semiconductor device 50 b of the second embodiment , the semiconductor device 50 d of the fourth embodiment includes the first etching stopper 8 h and the dielectric layer 6 d , both made of silicon nitride ( sin ). with this structure , a groove defect generated in a dielectric layer 6 d present beneath the upper electrode 7 b in the course of a patterning process of the upper electrode 7 b is filled with the first etching stopper 8 h that is made of the same material as the dielectric layer 6 d . more specifically , the defect of the dielectric layer 6 d is corrected . this arrangement thus controls a reduction in withstanding voltage of the mim capacitive element 20 d and lot - to - lot manufacturing variations in the capacitance of the mim capacitive element 20 d . a structure of the semiconductor device 50 d of the fourth embodiment is described below with reference to fig1 c . the semiconductor device 50 d includes the mim capacitive element 20 d on the substrate 30 . the interlayer insulator 9 is formed , covering the substrate 30 and the mim capacitive element 20 d . the mim capacitive element 20 d includes the upper electrode 7 b , the dielectric layer 6 c , and the lower electrode 5 b . the lower electrode 5 b and the dielectric layer 6 d are formed to extend over the upper electrode 7 b . the first etching stopper 8 h is formed , covering the upper electrode 7 b and the dielectric layer 6 d . the second etching stopper 13 b is formed on the upper electrode 7 b . the via hole 11 a is opened in the interlayer insulator 9 and the first etching stopper 8 h to establish electrical connection with the upper electrode 7 b of the mim capacitive element 20 d . the via hole 11 b is opened in the interlayer insulator 9 , the first etching stopper 8 h , and the dielectric layer 6 b to establish electrical connection with the lower electrode 5 b of the mim capacitive element 20 d . the via hole 11 c is opened in the interlayer insulator 9 , the silicon dioxide layer 4 , and the diffusion preventing layer 3 to establish electrical connection with the wiring layer 2 of the substrate 30 . the via wiring 12 a is formed by filling the via hole 11 a with a conductor . the via wiring 12 b is formed by filling the via hole 11 b with a conductor . the via wiring 12 c is formed by filling the via hole 11 c with a conductor . the wiring layer 2 extends below the mim capacitive element 20 d . the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 are formed at different depths of the semiconductor device 50 d . the via wiring 12 a and the via hole 11 a , the via wiring 12 b and the via hole 11 b , and the via wiring 12 c and the via hole 11 c are respectively collectively referred to as a contact via . a method of manufacturing the semiconductor device 50 d of the fourth embodiment is described below with reference to fig9 a - 9c through fig1 a - 11c . referring to fig9 a , the diffusion preventing layer 3 , the silicon dioxide layer 4 , the first conductive layer 5 a , the dielectric layer 6 c , the second conductive layer 7 a , and a second etching stopper 13 a are laminated in that order over the wiring layer 2 in the lower interlayer insulator 1 . the diffusion preventing layer 3 is made of silicon carbide and has a thickness of , for example , about 70 nm . the silicon dioxide layer 4 has a thickness of , for example , about 100 nm . the first conductive layer 5 a is made of titanium nitride ( tin ) and has a thickness of , for example , about 150 nm . the dielectric layer 6 c is made of silicon nitride and has a thickness of , for example , about 40 nm . the second conductive layer 7 a is made of titanium nitride and has a thickness of , for example , about 100 nm . the second etching stopper 13 a is made of silicon nitride and has a thickness of , for example , about 48 nm . the dielectric layer 6 c and the second etching stopper 13 a are made of the same material , namely , silicon nitride . referring to fig9 b , the second conductive layer 7 a and the second etching stopper 13 a are patterned through a lithographic process and an etching process to form the upper electrode 7 b and the second etching stopper 13 b . in this process , the first conductive layer 5 a and the dielectric layer 6 c are formed to extend over the second etching stopper 13 b and the upper electrode 7 b . fig9 c is an expanded view of a contact portion denoted by the letter b between the underside of the upper electrode 7 b and the dielectric layer 6 c in fig9 b . fig9 c illustrates a groove defect that is generated in the dielectric layer 6 c present beneath the upper electrode 7 b in the course of the patterning process of the second conductive layer 7 a . such a groove defect causes a reduction in the withstanding voltage of the mim capacitive element 20 d and lot - to - lot variations in the capacitance of the mim capacitive element 20 d . with reference to fig1 a , a first etching stopper 8 g made of silicon nitride is formed to a thickness of , for example , about 43 nm to cover the upper electrode 7 b and the dielectric layer 6 c through a cvd process . fig1 b is an expanded view of a contact portion denoted by the letter b between the underside of the upper electrode 7 b and the dielectric layer 6 c in fig1 a . as illustrated in fig1 b , the first etching stopper 8 g made of the same material of the dielectric layer 6 c may fill a groove defect that has been generated in the dielectric layer 6 c generated beneath the upper electrode 7 b in the course of the patterning process of the upper electrode 7 b . the defect of the dielectric layer 6 c is thus corrected . this arrangement controls a reduction in the withstanding voltage of the mim capacitive element 20 d and lot - to - lot variations in the capacitance of the mim capacitive element 20 d . with reference to fig1 c , the first etching stopper 8 g , the dielectric layer 6 c , and the first conductive layer 5 a are treated by a lithographic process and an etching process . through this process , the first etching stopper 8 h , the dielectric layer 6 d , and the lower electrode 5 b are formed . the mim capacitive element 20 d , including the upper electrode 7 b , the dielectric layer 6 d , and the lower electrode 5 b , thus results . with reference to fig1 d , a plasma sio 2 layer is formed to a thickness of , for example , about 650 nm as the interlayer insulator 9 using a silane gas to cover the silicon dioxide layer 4 , the lower electrode 5 b , the dielectric layer 6 d , and the first etching stopper 8 h . referring to fig1 a , the via hole 10 a , the via hole 10 b , and the via hole 10 c are opened in the interlayer insulator 9 and the silicon dioxide layer 4 toward the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 , respectively , at the same operation through a lithographic process and an etching process in the same manner as described with reference to fig8 b . the interlayer insulator 9 and the silicon dioxide layer 4 are etched using , for example , a mixture of a c 4 f 6 gas , an ar gas and an o 2 gas in the opening operation of the via hole 10 a , the via hole 10 b , and the via hole 10 c . gas flow rates and pressure conditions adjusted so that the interlayer insulator 9 has an etching rate higher than that of each of the first etching stopper 8 b , the second etching stopper 13 b , the dielectric layer 6 d , and the diffusion preventing layer 3 . more specifically , gas flow rates and pressure conditions are adjusted so that each of the second etching stopper 13 b , the first etching stopper 8 b , the dielectric layer 6 d , and the diffusion preventing layer 3 may have an etching rate equal to or lower than 0 . 1 times the etching rate of the interlayer insulator 9 , under the same etching condition as the etching condition applied to the interlayer insulator 9 . such an adjustment prevents the upper electrode 7 b and the lower electrode 5 b from being overetched . in the etching process , the etching rate of the silicon dioxide layer may be preferably about 19 times the etching rate of the silicon carbide layer . subsequent to the etching process , a silicon nitride layer having a thickness of , for example , about 62 nm is present on the upper electrode 7 b and the lower electrode 5 b at each via bottom . referring to fig1 b , the first etching stopper 8 h , the second etching stopper 13 b , the dielectric layer 6 d , and the diffusion preventing layer 3 respectively present at the bottoms of the via hole 10 a , the via hole 10 b , and the via hole 10 c are removed . these layers are etched using , for example , ch 2 f 2 / n 2 / o 2 gases containing a fluorine based ch 2 f 2 gas through the rie process . in this etching process , the chamber temperature is , for example , room temperature , and gas flow rates are , for example , 10 - 35 sccm for the ch 2 f 2 gas , 50 - 100 sccm for the n 2 gas , and 15 - 40 sccm for the o 2 gas . the via hole 11 a , the via hole 11 b , and the via hole 11 c are thus opened . if the silicon carbide layer and the silicon nitride layer are etched at the same operation using , for example , a mixture of the ch 2 f 2 gas , the o 2 gas , and the n 2 gas , the etching rate of the silicon carbide may become about 1 . 13 times the etching rate of the silicon nitride . the etching stopper remaining on the upper electrode 7 b and the etching stopper remaining on the lower electrode 5 b at the via hole are silicon carbide layers having a thickness of , for example , about 70 nm under this condition . the first etching stopper 8 h and the second etching stopper 13 b on the upper electrode 7 b , the first etching stopper 8 h and the dielectric layer 6 d on the lower electrode 5 b , and the diffusion preventing layer 3 on the wiring layer 2 are removed at the same operation as the operation of removing each etching stopper remaining at the bottom of each via hole . the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 may be prevented from being overetched . a good contact is established when each via hole is filled with the metal . referring to fig1 c , for example , tungsten ( w ) is placed to fill the via hole 11 a , the via hole 11 b , and the via hole 11 c through a cvd process to form the via wiring 12 a , the via wiring 12 b , and the via wiring 12 c in the same manner as previously described with reference to fig2 d . a barrier metal formation operation is not illustrated . the semiconductor device 50 d including the mim capacitive element 20 d is thus produced . in accordance with the semiconductor device 50 d of the fourth embodiment , the second etching stopper 13 b is formed on the upper electrode 7 b . with this structure , the second etching stopper 13 b formed on the upper electrode 7 b , the first etching stopper 8 h formed on the lower electrode 5 b , and the diffusion preventing layer 3 formed on the wiring layer 2 are removed at the same operation as the operation of removing the etching stopper remaining at the bottom of each via hole . the upper electrode 7 b , the lower electrode 5 b , and the wiring layer 2 may be prevented from being overetched . a good contact may thus be established when each via hole is filled with the metal . all examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the embodiment and the concepts contributed by the inventor to furthering the art , and are to be construed as being without limitation to such specifically recited examples and conditions , nor does the organization of such examples in the specification relate to a illustrating of the superiority and inferiority of the embodiment . although the embodiments have been described in detail , it should be understood that the various changes , substitutions , and alterations could be made hereto without departing from the spirit and scope of the invention .	7
referring to fig1 a camera lens 2 held by a lens barrel mount 1 having a focusing pin 1a is adapted to move forward and backward as the lens barrel mount 1 is rotated through a suitable conventional mechanism such as a cylindrical cam and a cam follower . a shutter release button 3 in the form of a cylinder is vertically slidably fitted into a sleeve 5 at the upper end of which is securely fitted a focusing ring 4 upon which are marked focusing marks 4a and a release button lock mark 4b . at the lower end of the sleeve 5 is securely fixed a cam plate 6 having a cam groove 6a , an upright connecting arm 6b and a depending hook arm 6c . the upper end of the upright connecting arm 6a of the cam plate 6 is fitted into a groove 4c formed in the side surface of the focusing ring 4 so that the cam plate 6 may be rotated in unison with the focusing ring 4 . a connecting member 7 has a cam follower pin 8 extending from one end thereof to be fitted into the cam groove 6a of the cam plate 6 , an inversed l - shaped and bifurcated arm 7a in engagement with the focusing pin 1a of the lens barrel mount 1 , and a pointer 7b extending into a viewfinder frame 12 . when the focusing ring 4 is rotated , the cam plate 6 is also rotated through arm 6b so that the connecting member 7 is caused to slide to the right or left because the cam follower pin 8 is moved by the cam groove 6a of the cam plate 6 . therefore the lens barrel mount 1 maybe caused to rotate in the clockwise direction or counterclockwise direction to move the camera lens 2 for focusing by rotation of focusing ring 4 . in this case , the pointer 7b of the connecting member 7 indicates one of the focusing marks 11 marked in a picture frame mark 12a of the viewfinder frame 12 . more particularly , an operator rotates the focusing ring 4 in such a way that one of the focusing marks 4a may coincide with an index mark x marked on a stationary member of the camera body depending upon the distance to a subject to be photographed . thus the desired focusing may be obtained and indicated in the field of the viewfinder . when the focusing ring 4 is so rotated that the shutter release button lock mark 4b coincides with the index mark x , the shutter release button 3 is locked so that the shutter cannot be released as will be described in more detail hereinafter . the cam profile of the cam groove 6a is so designed that when the focusing ring 4 is rotated from the position shown in fig1 that is the position at which the infinity focusing mark is aligned with the index mark x , to the position at which the lock mark 4b is aligned with the index mark x , the cam groove 6a does not move the cam follower pin 8 . more particularly , the section of the cam groove 6a corresponding to the above described rotation of the focusing ring 4 is an arc of a circle whose center coincides with the axis of the cam plate 6 so that the lens 2 remains in the infinity focusing position . next the release button locking mechanism will be described hereinafter . a shutter release member 9 has a horizontally bent upper portion 9a which is made to contact the lower end of the shutter release button 3 . the shutter release member 9 is normally biased upwardly by means of a spring or the like ( not shown ) so that the release button 3 is also normally upwardly biased . the upper end portion 9a has a projection 9aa . when the release button 3 is depressed , the release member 9 is lowered against the spring or the like to release the shutter through a mechanism ( not shown ). when the focusing ring 4 is rotated to lock the shutter release button 3 , the depending hook arm 6c of the cam plate 6 is also rotated so that the hook portion 6ca is moved below the projection 9aa . therefore the downward movement of the shutter release button 3 may be prevented . according to one of the features of the present invention in this case , the depending arm 6c is also adapted to release a movable contact 10a of an on - off switch 10 for an exposure meter ( not shown ) from its stationary contact 10b so that a power source ( not shown ) of the exposure meter may be prevented from being wasted by supplying power for nothing . the second embodiment shown in fig2 is substantially similar in construction and mode of operation to the first embodiment described hereinbefore with reference to fig1 except that a focusing pin 2aa is fixed to the front end of a lens barrel 2a in parallel with the optical axis . the lens barrel 2a is then screwed into a stationary member 1b such as a helicoid ring .	6
referring now to the drawing , a pair of input terminals 2 and 4 are coupled to the base of pnp transistors 6 and 8 , respectively , the emitters of which are connected to the base of an npn transistor 10 and also through a suitable resistance 12 to the positive source of ttl power . the collectors of transistors 6 and 8 are connected together and to ground potential . the transistors 6 and 8 therefore serve as an input and - gate which , in a ram driver circuit , usually receives binary signals representing driver address and strobe . npn transistor 10 is a dual - collector dual - emitter schottky transistor , the first collector of which is connected through a suitable resistance 14 to the positive source of ttl power , and the first emitter of which is connected to the base of npn transistor 16 which serves as a phase splitter . the emitter of transistor 16 is coupled to ground through a 5k resistor 18 and to the base of an npn schottky transistor 20 , the emitter of which is connected to ground potential and the collector of which is coupled to the output terminal 22 . the collector of transistor 16 is coupled through a 5k resistance 24 to a source of mos power , as will be subsequently explained , and also to the base of an npn schottky transistor 26 . the collector of transistor 26 is coupled through a schottky diode 27 to the positive mos power source and the emitter is connected to the base of an npn schottky transistor 28 , the collector of which is coupled to the positive source of mos power and the emitter of which is connected to the output terminal 22 . the diode materially speeds the output rising toward its final v oh level . transistors 26 and 28 form a darlington pair , which , together with the transistor 20 , form what is generally referred to as an active pull - up output stage . the circuitry explained thus far comprises a basic ttl to mos driver which , except for speed advantages provided by the diode 27 and the schottky transistors , is relatively slow and inefficient . in the preferred embodiment , circuit speed and efficiency is improved as will be subsequently described . referring again to the dual - collector dual - emitter input buffer transistor 10 , the second emitter is coupled through a suitable resistance 30 to ground and also to the base of an npn transistor 32 , the emitter of which is grounded and the collector of which is connected to the base of transistor 16 , thereby providing a low impedance discharge path . the second collector of the transistor 10 is coupled to the base of an npn schottky transistor 34 , the collector of which is coupled through a resistance 36 to the positive source of ttl power and to the anode of a schottky diode 38 , the cathode of which is connected to the collector of transistor 16 . the emitter of transistor 34 is connected to the base of transistor 16 . thus , the phase splitter transistor 16 is clamped by the schottky diode 38 which prevents the saturation of transistor 16 and permits faster switching times . the base of transistor 16 is also connected to a squaring circuit comprising an npn schottky transistor 40 , the base of which is connected through a 450 ohm resistance 42 to the base of transistor 16 and the collector of which is connected through a 130 ohm resistance 44 to the base of transistor 16 . transistor 40 provides a high a . c . impedance and a low d . c . impedance between the base and emitter of the transistor 16 and greatly improves the turn - on speed of the transistor 16 . in operation , at the moment that the transistor 10 is cut off , most of the emitter current of transistor 34 is being fed into the base of transistor 16 for rapid turn - on until transistor 40 begins to turn on . after transistor 40 becomes conductive , the majority of the emitter current from transistor 34 will be applied through transistor 40 into the base of the output transistor 20 instead of through the base - collector junction of transistor 16 . this results in less stored charges in the base - collector junction of transistor 16 and enables that transistor to rapidly turn off . this turnoff speed is also aided by the initial charging current provided by the schottky diode 38 . the collector of transistor 34 is also connected to the base of an npn schottky transistor 46 , the collector of which is connected through a suitable resistance 48 to the positive mos power source and the emitter of which is coupled to ground through a series circuit comprising resistor 49 , schottky diodes 50 and 51 , and resistor 52 . the transistor 46 not only provides current to the transistors 54 and 56 , as will be described shortly , but serves as an emitter follower with a high input impedance that permits greater conduction of diode 38 and a consequent faster rise time of transistor 26 . the junction of diodes 50 and 51 is connected to the base and collector of a diode connected npn transistor 53 , the emitter of which is connected to the base of output transistor 20 . the junction of diode 51 and resistor 52 is connected to the base of an npn schottky transistor 54 , the collector of which is connected to the base of output transistor 20 and the emitter of which is connected to ground . transistor 53 is provided to prevent saturation of transistor 54 , thereby to maintain the proper threshhold level at the base of transistor 16 . without the benefit of transistor 54 , the feedback current through the base - collector junction of transistor 20 may , during a low to high transition , enter a miller capacitor control mode and require a relatively long discharge time . in the preferred embodiment , transistor 54 becomes conductive during the low to high transistion and rapidly discharges the transistor 20 to decrease the circuit turn - off time . the collector of transistor 46 is connected to the base of the pnp transistor 56 , the emitter of which is connected to the positive mos potential source and the collector of which is connected to the output terminal 22 . the collector of transistor 56 is also connected to one terminal of a 50 - microfarad capacitor 58 which , together with the transistors 56 and 28 , forms a bootstrap circuit that assists in linearizing the output rise transition and holds the output voltage level as close as possible to the positive mos potential after discharge of the capacitor 58 . as previously mentioned , a volatile mos memory must be constantly connected to a positive power source to retain its stored information . while the memory is inactive but still retaining its stored data , peripheral devices , such as the driver circuitry , should not be required to draw current from the mos power source . the preferred embodiment of the invention includes circuitry that is responsive to a shutdown in the ttl power source to shut off all mos current to the driver circuitry . as described previously , the collector of the phase splitter transistor 16 is connected through resistance 24 to the mos power source . resistor 24 is connected to the cathode of a schottky diode 60 , the anode of which is connected to the emitter of an npn transistor 62 , the collector of which is connected to the mos power source . the base of transistor 62 is coupled to the collector of a pnp transistor 64 , the emitter of which is connected to the mos power source . the base of transistor 64 is connected through a resistor 65 to the collector of an npn schottky transistor 66 , the emitter of which is grounded , and the base of which is coupled through a suitable resistance 68 to the cathode of a diode 70 . the anode of diode 70 is connected to the output of a current regulator circuit which is connected from the positive ttl power source through diode 70 and through a 1k resistance 72 to ground . although other configurations will operate satisfactorily , the current source in the preferred embodiment includes a pair of npn transistors 74 and 76 in parallel branches with resistances 78 and 80 . thus , the collector of transistor 74 is connected to the positive source and the emitter is connected through resistance 80 to the diode 70 . in the other branch , the collector of transistor 76 is connected through resistance 78 to the positive source , and the emitter is connected to the diode 70 . the base of transistor 74 is coupled to the collector of transistor 76 and the base of transistor 76 is coupled to the emitter of transistor 74 . the cathode of diode 70 is also connected through a suitable resistance 82 to the base of a schottky npn transistor 84 , the emitter of which is grounded and the collector of which is connected through a resistance 86 to the emitter of transistor 62 and to the base of a schottky npn transistor 88 . the emitter of transistor 88 is grounded and the collector is coupled through a resistance 90 to the emitter of transistor 62 . the collector of transistor 88 is also coupled to the cathode of a schottky diode 91 , the anode of which is connected to the base of transistor 26 . diode 91 serves to drain the base of transistor 26 during the short period between the time the ttl supply is shut down and the time that the transistor 62 is turned off , thereby preventing the undesired switching - on of transistor 26 and a false output pulse from transistor 28 after ttl power shut - down . in operation , when the ttl power source is shut down and the voltage level drops to approximately 3 . 4 volts , transistors 66 and 84 will become non - conductive . the cutting off of transistor 66 will similarly turn off transistor 64 and the charge stored in transistor 64 will keep transistor 62 on for a short time to supply a base current through resistance 86 to the base of transistor 88 , thereby turning on transistor 88 . transistor 88 steers all current from the diode 60 and forces the darlington transistor 26 and its associated output transistor 28 in their non - conductive state . as soon as the transistor 64 loses all of its stored charge , both transistors 64 and 62 will turn off and prevent any current flow from the mos power source into the driver circuitry . it will be noted that the shutting down of transistors 34 and 16 will result in turning off the output transistor 20 and that the output of the driver will be forced into a tri - state condition .	7
hereinafter , a power control apparatus of a construction machine according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings . referring to fig4 , the power control apparatus of a construction machine according to the exemplary embodiment of the present disclosure includes an engine 10 driving a hydraulic pump 20 , a horst power regulating unit 30 for varying a swash plate angle of the hydraulic pump 20 to vary a required horse power of the hydraulic pump 20 in response to an input horse power control signal , a pressure sensor 50 for detecting a pressure of a working fluid discharged from the hydraulic pump 20 , and a controller 60 for outputting the horse power control signal to the horse power regulating unit 30 and controlling an rpm of an engine as well . the controller 60 includes an engine control unit 61 such as an electronic control unit ( ecu ) and an equipment control unit 62 . the engine control unit 61 outputs a fuel injection amount command value to the engine 10 to control an rpm of the engine 10 . the engine control unit 61 calculates a load torque of the engine 10 from a current fuel injection amount command value and a current rpm of the engine 10 . a maximum torque of the engine for each rpm of the engine is set in the engine . thus , if a target rpm of the engine is input from a dial gauge 11 , the engine control unit 61 may calculate a maximum torque of the engine corresponding to a target rpm . the engine control unit 61 calculates an engine load ratio which is a ratio of a load torque to a maximum torque to output the engine load ratio to the equipment control unit 62 . as illustrated in fig5 , engine rpm command value for an engine load ratio for constantly maintaining an rpm of the engine 10 at an input target rpm is set in the equipment control unit 62 . here , when the target rpm is varied , the engine rpm command value for an engine load ratio is also varied . thus , the set value illustrated in fig5 is set to be different according to a magnitude of a target rpm of the engine . that is , the set values as illustrated in fig5 are set for target rpms of the engine and are stored in a memory and the equipment control unit 62 . thus , if a target rpm of the engine is input to the equipment control unit 62 , the equipment control unit 62 selects a pattern corresponding to the input target rpm from the patterns of fig5 . thereafter , the equipment control unit 62 calculates an engine rpm command value corresponding to an load ratio input from the selected pattern and outputs the calculated engine rpm command value to the engine control unit 61 . then , the engine control unit 61 calculates a fuel injection amount command value corresponding to the engine rpm command value and outputs the calculated fuel injection amount command value to the engine 10 . accordingly , an rpm of the engine is controlled . in this case , as illustrated in fig5 , as an engine load ratio increases , an engine rpm command value also increases . that is , if a load applied from the hydraulic pump 20 to the engine 10 increases , a fuel injection amount of the engine 10 increases , whereas if a load applied from the hydraulic pump 20 to the engine 10 decreases , a fuel injection amount of the engine 10 decreases . as a result , as illustrated in fig6 , an rpm of the engine 10 is always constantly maintained at a target rpm by controlling a fuel injection amount such that a torque increases according to a load ratio of the engine . hereinafter , an rpm control method of the engine having the above - mentioned construction will be described in detail . referring to fig7 , first , if an engine target rpm is set by the dial gauge 11 , the engine target rpm is transmitted to the engine control unit 61 and the equipment control unit 62 ( s 110 ). then , the engine control unit 61 calculates an engine maximum torque for the input engine target rpm , and calculates a current engine load torque ( s 120 ). thereafter , the engine control unit 61 calculates an engine load ratio ( s 130 ). the engine load ratio is calculated by the following equation 1 . if the engine load ratio is calculated , the engine control unit 61 outputs the calculated engine load ratio to the equipment control unit 62 . meanwhile , if an engine target rpm is input from the dial gauge 11 , the equipment control unit 62 selects a pattern where an engine rpm command value according to the engine load ratio illustrated in fig5 is set based on the input engine target rpm . thereafter , the equipment control unit 62 calculates an engine rpm command value corresponding to the engine load ratio output from the engine control unit 61 from the selected pattern as illustrated in fig5 . thereafter , the equipment control unit 62 outputs the calculated engine rpm command value to the engine control unit 61 . then , the engine control unit 61 calculates a fuel injection amount command value from the input engine rpm command value and outputs the calculated fuel injection amount command value to the engine 10 ( s 150 ). the power control apparatus and the power control method through a control of an rpm of an engine have been described until now , and a power control apparatus and a power control method through a control of a hydraulic pump 20 will be described hereinafter . referring to fig4 , the hydraulic pump 20 is a variable pump for varying a discharge flow rate by regulating an inclination of a swash plate 23 , and a regulator 40 for regulating the swash plate 23 is installed in the hydraulic pump 20 . the regulator 40 includes a working flow rate regulating part 41 for varying a discharge flow rate of the hydraulic pump 20 in response to a signal for a manipulation of a manipulation part 42 , a constant horse power regulating part 43 for maintaining a required horse power of the hydraulic pump 20 at a constant horse power , and a horse power regulating part 31 for regulating a required horse power of the hydraulic pump 20 . the working flow rate regulating part 41 is adapted to regulate a discharge flow rate of the hydraulic pump 20 in response to a signal corresponding to a manipulation signal of the manipulation part 42 , and increases a discharge flow rate of the hydraulic pump 20 in proportion to a magnitude of the manipulation signal of the manipulation part 42 . here , a signal corresponding to a manipulation signal of the manipulation part 42 may include a signal for any one selected from a negative control pressure which is a bypass pressure having passed through a main control valve 21 , a positive control pressure which is a pilot pressure according to a manipulation of the manipulation part 42 , and a load sensing pressure of each actuator 22 . the constant horse power regulating part 43 is adapted to regulate a discharge flow rate of the hydraulic pump 20 according to a discharge pressure of the hydraulic pump 20 and maintain a required horse power of the hydraulic pump 20 at a constant horse power . here , the constant horse power is varied by the horse power regulating part 31 . thus , the constant horse power regulating part 43 regulates a discharge flow rate of the hydraulic pump 20 according to a constant horse power line diagram in a current varied state . the horse power regulating part 31 is adapted to vary a required horse power of the hydraulic pressure 20 , and a pilot pressure discharged from a pilot pump 33 is applied to the horse power regulating part 31 . here , an electronic proportional pressure reduction valve 32 is installed between the horse power regulating part 31 and the pilot pump 33 , and an opening degree of a passage connecting the pilot pump 33 and the horse power regulating part 31 is regulated by the electronic proportional pressure reduction valve 32 . the electronic proportional pressure reduction valve 32 is regulated according to a current command value output from the equipment control unit 62 . thus , the horse power regulating part 31 varies a swash plate angle of the hydraulic pump 20 according to a current command value output from the equipment control unit 62 . in the present exemplary embodiment , the horse power regulating unit 30 is defined to include the horse power regulating part 31 and the electronic proportional pressure reduction valve 32 , and the horse power regulating part 31 and the electronic proportional pressure reduction valve 32 may be realized by one electronic proportional pressure reduction valve in contrast with the present exemplary embodiment . thus , the horse power regulating unit 30 may include the horse power regulating part 31 and the electronic proportional pressure reduction valve 32 , and may include one electronic proportional pressure reduction valve in an electronically controlled pump as well . in describing an operation of the horse power regulating unit 30 in more detail , if a high current command value ( for example , 600 ma ) is output from the equipment control unit 62 to the electronic proportional pressure reduction valve 32 , the electronic proportional pressure reduction valve 32 increases passage opening degrees of the pilot pump 33 and the horse power regulating part 31 . then , the horse power regulating part 31 regulates the swash plate angle to decrease a discharge flow rate of the hydraulic pump 20 so as to decrease a required horse power of the hydraulic pump 20 . on the contrary , if a low current command value ( for example , 200 ma ) is output to the electronic proportional pressure reduction valve 32 , the electronic proportional pressure reduction valve 32 decreases passage opening degrees of the pilot pump 33 and the horse power regulating part 31 . then , the horse power regulating part 31 regulates the swash plate angle to increase a discharge flow rate of the hydraulic pump 20 so as to increase a required horse power of the hydraulic pump 20 . the pressure sensor 50 detects a discharge pressure of the hydraulic pump 20 and transmits the detected discharge pressure to the equipment control unit 62 . the discharge pressure of the hydraulic pump 20 can be varied according to a load transferred from the actuator 22 through the main control valve 21 and may be expressed as a load pressure . the equipment control unit 62 performs the following control function in addition to the above - mentioned control of an engine rpm . the equipment control unit 62 calculates a current command value which will be output to the electronic proportional pressure reduction valve 32 and outputs the calculated current command value to the electronic proportional pressure reduction valve 32 . in more detail , a target pump requiring horse power for a load pressure pd detected by the pressure sensor 50 is set in the equipment control unit 62 as illustrated in fig8 . here , the target pump requiring horse power may be converted into a current command value output to the electronic proportional pressure reduction valve 32 . since the system of the present exemplary embodiment is a negative system by which a required horse power of the hydraulic pump 20 is increased in inverse proportion to the current command value , a current command value and a magnitude of a target pump requiring horse power are varied opposite to each other according to a load pressure pd in fig8 . as illustrated in fig9 , a pump horse power increment rate is set in the equipment control unit 62 . the pump horse power increment rate of fig9 represents a time for increasing a current pump requiring horse power of the hydraulic pump 20 to a target pump requiring horse power , and as a horse power difference value δpo between the current pump requiring horse power and the target pump requiring horse power increases , a time for increasing a pump requiring horse power is set to increase . as illustrated in fig1 , a pump requiring horse power increment rate for a selected specific increase time δt 1 is set in the equipment control unit 62 . the pump requiring horse power increment rate of fig1 is a value set for a magnitude of each increase time , and may be stored in the form of a table for increase times . if a load pressure pd is input from the pressure sensor 50 , the above - described equipment control unit 62 calculates a target pump requiring horse power from the set value of fig8 . thereafter , the equipment control unit 62 calculates a horse power difference value δpo between the current pump requiring horse power of the hydraulic pump 20 and the calculated target pump requiring horse power . the current pump requiring horse power of the hydraulic pump 20 may be calculated from the load pressure pd detected by the pressure sensor 50 and the current swash plate angle of the hydraulic pump 20 . if the horse power difference value δpo is calculated , the equipment control unit 62 calculates an increase time δt from the pump horse power increment rate of fig9 . if an increase time δt is calculated , a horse power increase rate of fig1 is calculated . if a horse power increase rate is completely calculated , the equipment control unit 62 increases the current pump requiring horse power to the target pump requiring horse power at the calculated increase rate for the calculated increase time δt . that is , the equipment control unit 62 gradually increases a required horse power of the hydraulic pump 20 to the target pump requiring horse power for a predetermined time . meanwhile , as illustrated in fig8 , when the load pressure pd detected by the pressure sensor 50 is a non - load cylinder pressure pd 1 , the target pump requiring horse power is set to a minimum horse power pomin , and when the load pressure pd is a maximum set pressure pd 2 , the target pump requiring horse power is set to a maximum horse power pomax . then , as illustrated in fig1 , the maximum set pressure pd 2 is set to be lower than or equal to a constant horse power control start point pd 2 of the maximum horse power pomax of the hydraulic pump 20 , whereby a work efficiency of a construction machine can be improved by securing a discharge flow rate of the hydraulic pump 20 as large as possible when a required horse power of the hydraulic pump 20 reaches a target pump requiring horse power . hereinafter , a power control method through a control of a hydraulic pump having the above - mentioned construction will be described in detail . referring to fig1 , first , the load pressure pd detected by the pressure sensor 50 is a non - load pressure pd 1 while a manipulation of the manipulation part 42 is not present . if a non - load pressure ( pd 1 ) signal is transmitted to the equipment control unit 62 , the equipment control unit 62 calculates the target pump requiring horse power as a minimum horse power pomin from fig8 and outputs a maximum current command value ( for example , 600 ma ) to the electronic proportional pressure reduction valve 32 . then , the electronic proportional pressure reduction valve 32 maximally opens an opening degree of a passage connecting the horse power regulating part 31 and the pilot pump 33 , and accordingly , the horse power regulating part 31 drives the hydraulic pump 20 with a minimum horse power pomin . in this state , as illustrated in fig1 , if a manipulation of the manipulation part 42 abruptly increases , a signal for the manipulation is applied to the working flow rate regulating part 41 . then , the working flow rate regulating part 41 abruptly increases a flow rate of the hydraulic pump 20 . however , since the horse power regulating part 31 drives the hydraulic pump 20 with a minimum horse power pomin even if a flow rate abruptly increases , a flow rate neither increases nor decreases abruptly as in the related art . however , in order to increase a driving force of a work apparatus , a required horse power of the hydraulic pump 20 needs to be increased by the horse power regulating part 31 . to this end , an increased load pressure pd detected by the pressure sensor 50 is input to the equipment control unit 62 , which in turn calculates a target pump requiring horse power according to the input load pressure pd from the set value of fig8 . thereafter , the equipment control unit 62 calculates a horse power difference value δpo between a current pump requiring horse power of the hydraulic pump 20 and a target pump requiring horse power , and calculates an increase time δt and an increase rate for the horse power difference valve δpo calculated from the set value illustrated in fig9 and 10 . thereafter , if the equipment control unit 62 gradually increases the current pump requiring horse power to a target pump requiring horse power calculated at an increase rate calculated for the increase time δt . in this way , as the equipment control unit 62 gradually increases the required horse power of the hydraulic pump 20 to the target pump requiring horse power calculated from the minimum horse power pomin , a hydraulic impact is not generated as illustrated in fig1 . further , as illustrated in fig1 , exhaust fumes can be minimized by preventing an abrupt decrease of an rpm of an engine and vibrations generated by a decrease of an rpm of the engine can be reduced as well . meanwhile , if an rpm of an engine decreases below a target engine rpm set by the dial gauge 11 , a work efficiency of a construction machine is lowered by performing a horse power control for minimally lowering a required horse power of the hydraulic pump 20 according to the related art , whereas a decrease of an rpm of an engine is small and a required horse power of the hydraulic pump 20 gradually increases from a minimum horse power to a target pump requiring horse power , thereby enhancing a work efficiency of a construction machine in the present exemplary embodiment . referring to fig1 , a process of increasing a horse power of the hydraulic pump 20 from a minimum horse power pomin to a target pump requiring horse power is schematically illustrated in a pressure - flow rate line diagram ( constant horse power line diagram ). referring to fig1 , the equipment control unit 62 increases a required horse power of the hydraulic pump 20 from a minimum horse power pomin to a target pump requiring horse power for an increase time δt , and the constant horse power regulating part 43 controls the hydraulic pump 20 at a constant horse power along a varied constant horse power line diagram for the increase time δt . in this way , it can be seen that as a horse power control and a constant horse power control of the hydraulic pump 20 are simultaneously performed , horse power , flow rate and load pressure are changed according to the line diagram of fig1 , thereby making it possible to prevent a hydraulic impact as illustrated in fig2 . fig1 a illustrates a boom raising speed and an engine rpm by a power control apparatus according to the related art , and fig1 b illustrates a boom raising speed and an engine rpm by a power control apparatus according to the present exemplary embodiment . referring to fig1 a , a boom raising speed abruptly increases as a flow rate and a load pressure increase abruptly . however , the engine rpm is abruptly decreased by a hydraulic impact as in region e , and accordingly , a horse power control is started to lower a required horse power of the hydraulic pump 20 to a minimum horse power . accordingly , a section where a boom raising speed decreases to the contrary is generated in region d . thus , a work efficiency of a construction machine is seriously deteriorated , and exhaust fumes and vibrations are increased . however , referring to fig1 b , in the present exemplary embodiment , an increase rate of a boom raising speed is rather low as compared with fig1 a , but a boom raising speed is not lowered in section f and an engine rpm is not significantly lowered as in section g . accordingly , a work efficiency of a construction machine can be enhanced and generation of exhaust fumes and vibrations is minimized . meanwhile , when a load pressure increases to a reference pressure so as not to be changed , a horse power control of the hydraulic pump 20 can be performed in consideration of an engine rpm . in addition , even when a load pressure is changed and thus an engine rpm is changed , a horse power control of the hydraulic pump 20 can be performed in consideration of an engine rpm . although the present disclosure has been described with reference to exemplary and preferred embodiments , workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the disclosure .	4
fig1 shows one example of a fixing unit of a copying machine . in fig1 reference numerals 1 and 3 designate a fixing roller and a pressing roller , respectively . the fixing roller incorporates a heater 2 and is turned in the direction of the arrow a . the pressing roller 3 , being in contact with the fixing roller 1 , is turned in the direction of the arrow b . an adjusting rod 5 is coupled to the rotary shaft 4 of the pressing roller 3 . the adjusting rod 5 is further coupled to an arm 7 in such a manner that the distance between the arm and the rotary shaft 4 can be adjusted with an adjusting screw 6 . the arm 7 is pivotally mounted on a rod 8 at one end and has a cam follower 9 at the other end . the cam follower 9 moves following the cam surface of an eccentric cam 10 . the cam 10 is turned in the direction of the arrow c by a drive mechanism to be described later . the arm 7 is moved up and down as indicated by the arrow d , and therefore the pressing roller 3 is moved into and out of engagement with the fixing roller 1 . now , the driving of cam 10 will be described . as shown in fig2 the cam 10 is mounted on a cam shaft 11 and is turned in the direction of the arrow c , or counterclockwise . the cam shaft 11 is rotatably mounted on the frame 12 of the fixing unit by means of bearings . a drive gear 13 for turning the cam shaft 11 in the direction of the arrow c is mounted on the cam shaft 11 . a spring clutch 14 for transmitting the power of the drive gear 13 to the shaft is mounted on the cam shaft 11 . a one - way clutch 15 is coupled to the drive gear 13 so that it is turned together with the drive gear 13 in the direction of the arrow c , or counterclockwise . the drive gear 13 is engaged with a gear 16 , which is therefore turned in the direction of the arrow d , or clockwise , by a motor ( not shown ). fig3 is a side view taken along the direction of the arrows iii -- iii in fig2 showing the spring clutch 14 . as is apparent from fig2 and 3 , the spring clutch 14 operates to couple the drive gear 13 to the cam shaft 11 with the aid of the tightening force of a spring 17 . this coupling is released by depressing either of two pawls 18 and 19 of a spring shaft in the tangential direction as shown in fig3 . the pawls 18 and 19 are energized by a pivotally operating arm 20 . the arm 20 is pivotally mounted on a rod 21 so that it is swung in the direction of the arrow e . the arm 20 has a solenoid 22 at one end . the lower end of the solenoid 22 is connected through a spring 24 to a frame 23 . before the solenoid 22 is energized , the arm 20 is maintained engaged with one of the pawls 18 , 19 . the pressing roller drive device thus constructed operates as follows : under the condition that the pressing roller 3 is contact with the fixing roller 1 as shown in fig1 the cam 10 is not yet turned , and therefore the arm 20 is in engagement with the pawl 19 as shown in fig3 . therefore , the power of the drive gear 13 is not transmitted to the cam shaft 11 , which is running idle in the direction of the arrow c , while the clutch 15 races in the direction of the arrow c . it should be noted that the one - way clutch 15 is mounted on the cam shaft 11 so that only when the clutch 15 is turned clockwise with respect to the cam shaft 11 , i . e ., in a direction opposite to the direction of the arrow c , is the clutch 15 engaged with the cam shaft . thereafter , a sensor ( not shown ) provided near the fixing roller 1 produces a signal immediately before the rear edge of an image supporting sheet passes through the nip region of the fixing roller 1 and the pressing roller 3 . by this signal , the solenoid 22 is energized , to move in the direction of the arrow f . as a result , the engaging end portion 20a of the pivotally moving arm 20 is turned downwardly about the rod 21 , thus being disengaged from the pawl 19 . thereupon , the spring clutch 14 is operated , so that the drive gear 13 is coupled to the cam shaft 11 by the tightening force of the spring 17 . in this operation , the pressing roller 3 is strongly abutted against the fixing roller 1 , and therefore the fixing roller 1 reacts upon the pressing roller 3 . as this reaction is exerted on the cam shaft 11 through the arm 7 , a force acts on the cam shaft 11 so as to allow the cam shaft 11 to turn in the direction of the arrow c by itself , while the drive gear 13 intends to turn the cam shaft 11 in the direction of the arrow c . the speed of rotation of the cam shaft 11 owing to this force is higher than that of the drive gear 13 ; i . e ., the cam shaft 11 turns faster than the drive gear 13 . in this operation , the one - way clutch 15 coupled to the drive gear 13 is turned at the same speed as that of the drive gear 13 . relatively stating , the one - way clutch 15 is turned in a direction opposite to the direction in the above - described case ; i . e ., with the cam shaft 11 fixed , the one - way clutch 15 is turned in a direction opposite to the direction of the arrow c . thus , the one - way clutch 15 is engaged with the cam shaft 11 . as a result , the one - way clutch 15 brakes the rotation of the cam shaft 11 , and therefore the cam 10 is not turned abruptly , i . e ., it starts turning slowly . on the other hand , the solenoid 22 ( fig3 ) is energized instantaneously . in addition , the solenoid 22 is pulled downwardly by the spring 24 . accordingly , the engaging end portion 20a of the arm 20 is engaged next with the pawl immediately . therefore , the cam 10 is turned through 180 ° in the direction of the arrow c and is then stopped , whereby the arm 7 is lowered , and the pressing roller 3 is thereby lowered to leave the fixing roller 1 . in the case where , in contrast to the above - described operation , the pressing roller 3 is brought into contact with the fixing roller 1 , the sensor ( not shown ) provided near the fixing roller detects when the front edge of the image supporting sheet approaches the nip region of the fixing roller 1 and the pressing roller 3 , to thereby produce a signal . in response to this signal , the solenoid is energized instantaneously , so that the front end portion 20a of the arm is disengaged from the pawl 18 or 19 . accordingly , the drive gear 13 is engaged with the cam shaft 11 , so that the latter 11 is turned in the direction of the arrow c . in this case , no force is applied to the cam shaft 11 , and therefore the cam shaft 11 is turned at the same speed as the drive gear 13 . as the one - way clutch 15 is also turned at the same speed in the direction of the arrow c , the one - way clutch 15 will not reduce the torque of the cam shaft 11 . the cam shaft 11 is turned only through 180 ° because the engaging end portion 20a of the arm 20 is immediately engaged with the next pawl 19 similarly as in the abovedescribed case . accordingly , the cam 10 is turned through only 180 ° and returned to the position as indicated in fig1 . as is apparent from the above description , according to the invention , the employment of the one - way clutch descreases the abrupt rotation of the cam shaft which may be caused in releasing the pressing roller from the fixing roller . accordingly , the pressing roller drive device of the invention is effective in preventing damage to the device and the large noise which may otherwise be caused when the cam strikes the cam follower .	6
in the drawings there is shown one example of the binding apparatus according to the invention which has , as shown in fig1 and 3 , a vertical frame plate 1 and a horizontal cylindrical case 12 which is fixed at one end thereof to the plate 1 . inside the cylindrical case 12 , there is provided a vertical article stop wall 13 , which receives and stops the inner end of an article a ( hereinafter referred to as a pack of paper money a ) inserted in the apparatus in order to be bound by a tape t and is fixedly connected to the frame plate 1 by means of a pair of supporting rods 13a . inside the cylindrical case 12 , a pair of bell crank levers 10 and 11 are provided , which are pivotally mounted on a bracket 15 by pins 10a and 11a , respectively , the bracket 15 being fixed to the outer surface of the plate 1 . on the free ends of the levers 10 and 11 within the cylindrical case 12 , pack clampers 3 and 4 are pivotally mounted by pins 3a and 4a , respectively . the clamping surface 3b of one clamper 3 has a shorter dimension in height but a longer dimension in the fore - and - aft direction , i . e ., the direction in which the pack a is inserted and extracted , than the clamping surface 4b of the other clamper 4 , whereby an extension 5 in the rearward direction is formed in the clamper 3 . the thickness t of this extension is less than that of the remaining part of the clamper 3 . the vertical stop wall 13 is formed with a u - shaped cross section as viewed in plan view . one side portion of the wall 13 has a cutout 14 so as to permit the clamper 3 to pass through the cutout 14 into a u - shaped groove 17 defined by the wall 13 . the opposite side portion is also formed with a cutout 16 which permits the clamper 4 to pass into the groove 17 . the clamper 4 is always disposed in the groove 17 . a cylindrical tape guide 7 is slidably mounted over the outer or rear end of the aforementioned case 12 and is adapted to slide telescopically over the base 12 in the axial direction or fore - and - aft direction thereof . the cylindrical tape guide 7 has a portion 7a formed integrally therewith and having a voluted tape guide passage 6 . the passage 6 opens on outerside thereof and is shaped so as to encircle the outer side of the extension 5 . pins 18 and 18a project from the cylindrical guide 7 at the sides thereof respectively . these pins 18 and 18a are engaged in yoke portions 22 and 22a , respectively , at the free ends of tape guide actuating arms 21 and 21a , the other ends of which are secured to an square shaft 20 which is rotatably received at its ends in bearing journals respectively in a pair of brackets 19 and 19a fixed to the inner surface of the frame plate 1 at lower corners thereof . to the one end of the square shaft 20 is fixed an operating lever 23 , the swinging motion of which lever 23 causes the angular shaft 20 to rotate . a pin 24 projects from the top of the case 12 . the pin 24 is slidably engaged in a slot 25 formed in the top of the cylindrical tape guide 7 in the direction of the longitudinal axis thereof , so that the cylindrical tape guide 7 can be moved over the cylindrical case 12 in parallel to the direction of a pack inserted ( direction x ) without rotating by the swinging motion of the lever 23 . another vertical plate 1a is arranged to cover the open side of the voluted tape guide passage 6 and is connected to the frame plate 1 by connecting rods 26 . the vertical plate 1a is provided with a rectangular opening 27 for inserting a pack a , the opening being shaped to be longer in height than in width as shown in fig1 . pack guiding troughs 2a and 2 are fixed to the plate 1a at the upper and the lower ends of the rectangular opening 27 , respectively . the lower trough 2 also serves to support as well as to guide a pack and is connected to a pack supporting plate 2b disposed on the inner side of the vertical plate 1a . the tape feeding - out end 9 of the voluted tape guide passage 6 is so positioned that the end t1 of the guided tape t can depend between the clamping surface 3b of one clamper 3 with the extension 5 and one side of the pack a . tape end adhering roller means 28 is provided under the voluted tape guide passage 6 . the roller means 28 comprises a rotatable shaft 29 , a larger arm 30 fixed to the shaft 29 at one end and a smaller arm 32 carrying a roller 31 at one end , the other end of the smaller arm 32 being pivotally connected to the other end of the larger arm 30 by a connecting pin 32a , around which pin 32a a coil spring 33 is disposed . the smaller arm 32 is adapted to be always biased against to a stop rod 34 . in addition , a tape cutter 35 and an adhesive feeder 36 are provided as shown in fig1 at positions suitable for their respective operations as described hereinafter . a pair of tape feeding and drawing back roller means 8 have a nip therebetween through which the tape t is passed . the tape t is drawn from a tape reel 40 . one roller of the roller means 8 is driven by a reversible motor m shown in fig1 . in the operation of the apparatus of the above described construction according to the invention , the motor m of the tape feeding and drawing back roller means 8 is operated to feed the tape t forward when a pack a is inserted through the pack guiding trough 2 of the vertical plate 1a and its leading end abuts against the vertical stop wall 13 to actuate a sensing means ( not shown ) for sending a signal to the motor m . consequently , the tape t is directed through the voluted tape guide passage 6 and encircles the pack a two times . then , the leading end t1 of the guided tape t depends from the tape feeding - out end of the passage 6 between the clamping surface 3b of the clamper 3 and one side of the pack a . the roller means 8 is adapted to stop its operation under control of a control means ( not shown ) after feeding out a required length of tape . then , the control means operates the pair of levers 10 and 11 to swing them toward each other to cause the clampers 3 and 4 to grasp the pack a from both sides as shown in fig2 . at this time , the leading end t1 of the tape t is held tightly between the extension 5 of the clamper 3 and the pack a . then , the swinging of the lever 23 causes the cylindrical tape guide 7 to move in the direction of insertion of the pack , that is , in the direction x through the movement of the shaft 20 and arms 21 and 21a , so that , as the voluted tape guide passage 6 is open at one side , the guided tape is released as a whole from the guide passage 6 and remains around the pack a in a voluted condition . the tape which has been in a loosely encircling state around the pack a and the extension 5 of the clamper 3 is thereupon wound tight a number of times around the pack a together with the extension 5 by the operation of the control means which reverses the motor m of the tape feeding and drawing back roller means 8 , as shown by arrows in fig2 . at this time , the other clamper 4 cooperates with that part of the clamper 3 other than the extension 5 thereof to grasp the leading portion of the pack a . when the pack a has been taped tightly , the tape feeding and drawing back roller means 8 is stopped by the control means . an adhesive feeder 36 is then brought near the tape wrapped around the pack a to deposit an adhesive thereon . thereafter , the tape cutter 35 is actuated to cut the tape . as shown in fig5 the rotatable shaft 29 is actuated to swing upwardly the larger arm 30 and the smaller arm 32 , whereby the pressing roller 31 carried by one end of the arm 32 raises and presses that part of the tape t which has been extending between the bottom of the pack a and the cutter 35 onto the part of the tape on which the adhesive has been deposited . thus , the adhesive sticking operation is completed . in this manner , there is formed a bound pack on the pack guiding trough , the tape t encircling the pack a number of times and binding it , and the cut end of tape t being stuck by adhesive to the leading tape portion which has been wound around the pack a . by manually drawing back the pack a on the guiding trough 2 , the extension 5 can be drawn smoothly from between the tape t and one side of the pack a . thus , the desired pack bound by the tape is obtained . while the preferred embodiment of the invention has been described above with respect to a pack of paper money as one example of an article to be bound , the invention is not limited to a pack , wad or stack of sheet material . furthermore , it will be apparent also that a specific tape , such as a vinyl tape , can be used as required for an article to be bound . the following several operations of the apparatus are all successively and automatically controlled by programming and sequence circuits in the control means . starting the tape feeding and drawing back roller means 8 when the inserted pack a abuts against the pack stop wall 13 . stopping the roller means 8 when the tape t is fed by a predetermined length such that the end t1 of tape t depends in front of the clamper 3 . slidingly retracting the cylindrical tape guide 7 after actuation of the clampers 3 and 4 . stopping the roller means 8 after the tape has been drawn back and tightened around the pack a with a desired tension . since all of these operations can be accomplished by control means known in the prior art , description of such means will be omitted . of course , means other than the tape cutter and adhesive feeder described herein can be used . thus , means wherein a tape which has adhesive deposited over its entire length and dried is pressed by a heated pressing roller 31 to fuse and stick the tape can be used . the apparatus according to the present invention as described above is constructed and arranged to bind rapidly , easily and reliably an article to be bound with the use of a tape by using simple components such as a displaceable voluted tape guide passage 6 and a pair of clampers 3 and 4 , one 3 being longer than the other 4 .	8
referring to fig1 the present method is performed at a repair workstation , generally identified by the numeral 10 . workstation 10 includes a work surface 12 on which a printed circuit board 14 is positioned . printed circuit board 14 constitutes a printed circuit board which has been tested utilizing a testing device which generates fault data so that printed circuit board 14 can be analyzed and repaired . workstation 10 further includes a computer 16 , keyboard 18 , mouse 20 , and monitors 22 and 24 . positioned above work surface 12 is an x / y positioning mechanism 28 . mounted to positioning mechanism 28 is a projection system 30 . projection system 30 is transportable by position mechanism 28 to various positions over printed circuit board 14 . projection system 30 may comprise , for example , an lcd ( liquid crystal display ) high resolution video graphics projector such as model vp800 manufactured and sold by lightware , inc . an important aspect of the present invention is that projection system 30 projects graphic repair data , such as , for example , traces , pads , components and other information directly onto the surface of printed circuit board 14 that is to be repaired . utilizing positioning mechanism 28 , the repair data can be projected by projection system 30 in exact alignment with the features of printed circuit board 14 . additionally , the colors of the projected image can be changed to provide for maximum contrast between the color of the actual printed circuit board 14 and the graphic data projected thereon . workstation 10 further includes a video camera 32 and lens assembly for capturing an image of printed circuit board 14 together with the image of the projected graphic repair data for display on monitors 22 and 24 . computer 16 also includes necessary software for determining a probable fault location . computer 16 provides the driver functions for projection system 30 , the management of computer aided repair and fault prediction software and also controls x / y position mechanism 28 . also mounted to repair workstation 10 is a microscope 34 to assist in viewing of faults on printed circuit board 14 together with the projected repair data . referring now to fig2 - 5 , the present method steps of the present invention are illustrated in block diagram format . inspection begins at step 40 . the circuit board name is selected at step 42 , and the circuit board is placed on work surface 12 at step 44 . a decision is made at step 46 to determine whether there is an error log file for the printed circuit board 14 under test . if the decision is yes , an error log is loaded at step 48 , and the serial number of the printed circuit board 14 is entered at step 50 . if the decision is no at decision block 46 , the printed circuit board failure ticket is examined at step 52 . the first test point is entered into computer 16 at step 54 , and the second test point is entered into computer 16 at step 56 . once the test points have been entered or the board &# 39 ; s serial number entered at step 50 , a decision is made at decision block 58 as to whether both test points are located in the same network ( net ) trace . if the test points are not in the same network trace , the method continues to step 110 , fig4 . if the test points are in the same network , a display is created on monitors 22 and 24 at step 60 to display that the fault or error is an open circuit . the video image of the network trace is then projected onto printed circuit board 14 using projection system 30 at step 62 . the x / y position mechanism 28 is then positioned to center the first test point at step 64 . a meter probe is positioned on the test point at step 66 . the x / y position 28 is then moved to center the second test point at step 68 . the additional meter probe is then placed on the second test point at step 70 to determine whether the network is open at step 72 . if the network trace is not open , the network continues with step 102 , fig3 . if the network trace is open , the primary board side is highlighted via projection system 30 at step 74 . through the use of arrow keys on keyboard 18 or mouse 20 , a scrolling process takes place to move x / y position mechanism 28 and projection system 30 at step 76 . microscope 34 can then be used to view the open network at steps 78 or video camera 32 together with a monitor 22 or 24 can be used view the open network . referring now to fig3 continuing from step 80 ( fig2 ), a decision is made to determine if the open network is on the primary side of the printed circuit board at step 82 . if the decision is no , the secondary side of the printed circuit board is selected at step 84 , requiring the circuit board to be turned over for positioning on work surface 12 at step 86 . the secondary side of the printed circuit board traces are highlighted by projection system 30 at step 88 . use of arrow keys on keyboard 18 or mouse 20 are utilized to scroll x / y position mechanism 28 and projection system 30 at step 90 to position the projection of the fault data over the traces and pads of printed circuit board 14 . microscope 34 may be utilized to look for an open network at step 92 . additionally and alternatively , video camera 32 can be utilized for viewing the open network at step 94 . if the decision is yes at step 82 , the next step is step 102 . a decision is then made to determine whether the open network is found on the secondary side of printed circuit board 14 at step 96 . if the decision is yes at step 96 , the next step is step 102 . if the decision is no , the arrow keys of keyboard 18 and mouse 20 are utilized to scroll x / y position mechanism 28 and projection system 30 at step 98 . the vias are probed to verify an internal open circuit at step 100 . the fault location and type of fault is logged in the error log at step 102 . a determination is made at step 104 to determine if there are any additional errors on the printed circuit board 14 under repair . if there are no additional errors , a decision is made at to whether there are additional boards with errors at step 106 . if there are no additional boards , the process terminates at block 108 . if more errors are located on the same printed circuit board 14 , at step 104 , the process returns to step 50 ( fig2 ). if there are additional boards having errors present , at step 106 , the process continues to step 44 ( fig2 ). referring now to fig4 if the decision at step 58 ( fig2 ) was no , monitor 22 or 24 displays that the error is a short at step 110 . an analysis is made at step 112 to determine the proximity between the two network traces . an inquiry is made at step 114 to determine if there is proximity on the primary side of printed circuit board 14 . the x / y position mechanism 28 and projection system 30 is positioned to the closest proximity at step 116 . the first test point trace is projected as a solid line by projection system 30 onto printed circuit board 14 at step 118 . the second test point trace is projected as a dotted line onto the surface of printed circuit board 14 by projection system 30 at step 120 . at step 122 , a circle is projected by projection system 30 around the area of proximity . a meter is utilized to verify that the network traces are shorted at step 124 . the system repair operator views the projected circle to determine the presence of a short at step 126 . microscope 34 may be also used to look for the presence of a short at step 128 . further , video camera 32 and a monitor 22 or 24 may be utilized to determine the presence of a short at step 130 . arrow keys on keyboard 18 and mouse 20 are utilized to scroll x / y position mechanism 28 at step 132 . referring now to fig5 a decision is made at step 134 to determine if the short was located . if the short was located , the process continues to step 102 ( fig3 ). if no short was detected at step 134 , a decision is made to determine whether there are additional areas of proximity on the primary side of printed circuit board 14 at step 136 . if the decision is yes , the next step is step 102 ( fig3 ). if the decision is yes at step 136 , the next closest proximity network trace is selected at step 138 . the x / y position mechanism 28 and projection system 30 is then centered on the proximity at step 140 . at step 142 , a circle is projected around the area of proximity . the projected circle is viewed to determine if a short is present at step 144 . microscope 34 may be utilized at step 146 to determine the presence of a short . video camera 32 and a monitor 20 or 22 can be utilized to determine the presence of a short at step 148 . arrow keys on keyboard 18 and mouse 20 can be utilized to scroll x / y position mechanism 28 and projection system 30 over the proximity at step 150 . a determination is then made again to determine whether the short was located at step 134 . in the event that there are no more areas of proximity on the primary side of printed circuit board 14 , at step 136 a determination is made at step 152 to determine if there are areas of proximity on the secondary side of printed circuit board 14 . if the answer is yes , circuit board 14 is turned over to expose the secondary side at step 154 . the secondary side display is selected at step 156 , and step 138 is again carried out . if the decision at step 152 is no , a meter is used to verify an internal shorted circuit at step 158 . a cursor is then moved to the location of the fault at step 160 and the process continues to step 102 ( fig3 ). it therefore can be seen that the present invention provides for a method for the analysis and repair of errors found on printed circuit boards by projecting graphic repair data directly onto the printed circuit board that is to be repaired . whereas the present invention has been described with respect to specific embodiments thereof , it will be understood that various changes and modifications will be suggested to one skilled in the art and it is intended to encompass such changes and modifications as fall within the scope of the appended claims .	7
the representation is executed schematically at least in part for simplification and for an easier comprehension . for the purpose of brevity , “ letter ” is used instead of the term “ flat article ” in the following . a franking machine 0 with an apparatus housing 01 , a contact pressure module 2 and a letter 4 in the output region ( see transport direction arrow ) is shown in fig1 . the apparatus housing 01 is composed of an upper part 011 and a lower part 012 and encloses an apparatus carrier 03 with accessories ; see also fig2 in this regard . the contact pressure module 2 is a mobile component of the lower part of the franking machine 0 . the contact pressure module housing 20 comprises an upper part 201 and a lower part 202 . the input region 02 of the franking machine 0 forms what is known as the letter thickness sluice . the letter thickness sluice 02 is bounded at the top by a shaped part 031 and at the bottom by a shaped part 2010 ; see also fig2 . the air supply to the bellows - shaped air bag 210 is interrupted when the grip 2062 of the function arm 206 is pressed ( see in this regard fig7 ), and the air bag 210 deflates . the air bag 210 sinks downward , such that a clearance from the transport belt 10 is created . the contact pressure module 2 can be extracted toward the front at the grip 2062 . a franking machine 0 with removed upper apparatus housing 011 ( see fig1 ) and removed contact pressure module 2 is shown in fig2 . in the lower apparatus housing 012 , an apparatus carrier 03 is attached in which the transport module 1 with the transport belt 10 and the printing module 3 with the print heads 31 are arranged . the contact pressure module 2 can be connected with the lower region of the franking machine mechanically via guide rods 032 and electrically via a connector bushing 033 . the contact pressure module 2 has contact pressure device 21 in a two - part housing 20 . the horizontal surface of the upper part 201 of the contact pressure module housing 20 simultaneously forms the letter travel surface in addition to the cover surface 21011 of the air bag 210 . the grip 2062 of the aforementioned function arm 206 is located in the lower part 202 of the contact pressure module housing 202 . the cover surface 21011 of the upper part 201 of the air bag 210 is lowered like a wedge in the forward region , counter to the letter travel direction ( see arrow ), and is provided with a low - friction , wear - resistant coating ( teflon ®, for example ); see also fig4 . a principle design of the contact pressure device is shown from the left ( feed side ) in section presentation ( as viewed from the feed side ) in fig2 a . a floor frame 205 , at least two tension springs 2052 and a function arm 206 , with a microswitch 2052 and a compression spring 2064 mounted thereupon , are provided inside a housing 20 of the mobile contact pressure module 2 . at one of its ends , the function arm 206 is attached to the floor frame 205 so as to be rotatable around a bearing axle 208 , and at its other end it is pressed against a stop by the spring force f 1 of the compression spring 2064 in the operationally ready state of the mobile contact pressure module 2 . the stop is formed by a rubber pad at the floor frame 205 and by a portion of the handle 2062 . in the removal - ready state of the mobile contact pressure module 2 , given a movement counter to the action of the spring force f 1 the function arm 206 can be brought out of its stop . the contact pressure device 21 has an elastic , inflatable , gas - tight shell 210 with an upper part 2101 and a lower part 2102 , as well as a middle part 2103 , wherein the middle part 2103 is attached to an upper part 201 of the housing 20 of the contact pressure module 2 . the upper part 2101 protrudes through a window opening into the upper part 201 . a floor plate 204 is mounted at the floor of the lower part 2101 of the contact pressure device 21 . the at least two tension springs 2052 are tensioned between the floor plate 204 and the floor frame 205 or the upper part 201 . the tension springs together exert an spring force f 2 on the surface of the floor plate , wherein the spring force f 2 is sufficiently large to draw said floor plate 204 onto stops 20531 ( and therefore onto the microswitch 2061 ), at least in the inserted state of the mobile contact pressure module 2 . the microswitch 2061 is activated until the spring force f 2 is greater than or equal to the sum of pre - tension f 2 pre and the resulting force effect f = δp · a , with the gas pressure difference δp between internal gas pressure and external pressure , as well as with the effective surface a of the shell , wherein the minimum contact pressure force of the contact pressure device 21 is established by the pre - tension f 2 pre of the tension springs , and wherein an elastic constant c of the tension springs is selected which is equal to the quotient of the difference δf = f 2 max − f 2 pre and the maximum deflection a max of the floor plate 204 . at the maximum spring force f 2 max , a maximum contact pressure force is achieved that leads to maximum deformation of the shell . the pre - tension f 2 pre of the tension springs can be variably selected . the maximum elastic tension f 2 max that is reached upon maximum deflection a max of the tension springs can be selected with regard to a maximum weight and / or dimension of the flat article . for example , the maximum spring force f 2 max = 14 n , the pre - tension f 2 pre = 4 n and the maximum deflection a max = 10 mm . an elastic constant c = 1 n / mm results from this for the tension springs . arranged inside a housing 20 is a circuit board 2017 with a time delay circuit . a power connector 20171 of the circuit board to supply the circuit board with an operating voltage in the inserted state of the mobile contact pressure module 2 ; a connector 20172 of the circuit board for electrical connection of an output of the time delay circuit with the contact of a motor of a pump 209 ; and a connector 20173 of the circuit board for electrical connection of an input of the time delay circuit with the contacts of the microswitch 2061 are provided , wherein the time delay circuit establishes an activation of the microswitch 2061 and outputs a time - delayed signal to the motor of the pump , but remains unpowered when the mobile contact pressure module 2 is in the removed state . it is provided that the time delay circuit is designed for a separate adjustment of the time delay of the activation delay and the deactivation delay . upon the function arm 206 being brought into a stop , the pump 209 is started with a time delay and gas is pumped into the shell of the contact pressure device 21 as long as the signal is emitted , wherein the operationally ready state of the mobile contact pressure module 2 is set with a time delay . stops 20531 are provided at a predetermined distance d from the travel surface 200 of the flat articles on the upper part 201 of the housing 20 . the activation of the microswitch 2061 is interrupted when the floor plate 204 moves away from the stops 20531 ( backwards travel in the direction of the floor of the housing ) and a minimum clearance a min from the stops is thereby exceeded ( see fig2 ). at the same time , the upper part 2101 of the elastic , inflatable , gas - tight shell 210 extends upward in the direction of a transport belt ( see fig3 ). the forwards travel of the upper part 2101 is upwardly limited by the transport belt in that the surface of the upper part 2101 arrives at a stop with the transport belt . a wear - resistant , coated cover surface 21011 on the upper part 2101 of the elastic , inflatable , gas - tight shell 210 serves as a stop surface . the coating increases the sliding capability between the stop surface and the surface of the actively driven transport belt or , respectively , of the flat article . a hose connector 2071 can be inserted into a gas intake and gas outlet opening in the floor of the lower part 2102 of the elastic , inflatable , gas - tight shell 210 and be connected via at least one hose 207 with the valve to relieve a gas overpressure . alternatively , a hose connector 2071 can be omitted if a t - part 2073 is connected at one side ( via hose 207 ) with the hose connector 2071 and at the other side directly with the hose connector 2072 . a gas outlet opening of the pump 209 is likewise connected with the t - part via a hose 207 . before achieving the operating mode , a lower edge of the microswitch 2061 lies at a minimum distance a min from the floor plate 204 , in contrast to fig2 b . a view of a principle presentation of the operating means 206 , 2062 and 20621 of the contact pressure device from the left is shown in fig2 b . due to the gas overpressure achieved in the operating mode , the floor plate 204 experiences a deflection a ; a = 3 mm is advantageously the clearance from the stops 20531 . the microswitch 2061 is no longer activated given a deflection a & gt ; a min . in the operating mode of the printing apparatus , the contact pressure module 2 cannot be removed from the printing apparatus . in this case — in the shown manner — a rocker that can be moved in rotation around a bearing axle is engaged in notches of two guide rods 032 . an engagement in notches of two guide rods already arises in principle from the german utility model de 20 2010 015 351 u1 . an opening of a ventilation valve takes place manually via the operation of the function arm 206 by means of the grip part 2062 , wherein the function arm 206 is borne such that it can rotate around the bearing axle 208 . the ventilation valve comprises a sealing surface 20621 and a hose bushing 2051 , wherein the hose bushing 2051 is arranged on one leg of the handle 2062 . upon operating the handle 2062 in the arrow direction ( white arrow ), the following three functions are executed : 2 . movement of the microswitch away , out of its operating position , whereby the pump is deactivated and the shell remains unpressurized , 3 . disengaging of retention means of the contact pressure module from the notches in the two guide rods before removal of the contact pressure module . a principle design of the printing apparatus is shown in fig2 c with the contact pressure device in section presentation , as viewed from the front side . the contact pressure device 21 has an elastic , inflatable , gas - tight shell — advantageously a bellows system filled with air . the shell has an upper part 2101 and a lower part 2102 that are connected with one another via a middle part 2103 so as to be gas - tight . a transport belt 10 — shown in simplified form — is realized as a flat transport belt , for example , and is mounted in the printing apparatus at a defined height interval h from the running surface 200 of the flat articles on the upper part 201 of the housing given a deflated bellows system , wherein the height interval is defined by the maximum possible letter thickness . from the feed side , an upper part 201 of a housing of the contact pressure module 2 has a shaped part 2010 at the mail input side , which shaped part 2010 forms a slope in the letter travel surface . a cover surface 21011 of the upper part 2101 of the bellows forms the contact pressure surface of the contact pressure device . the cover surface likewise has at the mail input side a slope on which an edge of a flat mail good runs , whereby a force is exerted on the contact pressure device 21 . in the bellows , the air pressure consequently increases ( see also fig2 a ). if the contact pressure module 2 is slid into the printing apparatus ( the manner is not shown ), the non - sloped letter travel surface of the upper part 201 lies at a fixed height interval h from the approximately parallel segment of the transport belt that is over this . in the upper part 201 , the two bellows parts 2101 , 2102 are arranged relative to another and attached with their middle part 2103 to a floor frame 205 so that a gas - tight void ( represented with a dot pattern ) arises between the upper bellows part and the lower bellows part . an opening ( which cannot be shown in this figure ) is introduced into the letter travel surface . the upper part 2102 of the bellows protrudes through this opening in the direction of the transport belt 10 . the lower part 2102 of the bellows has a hose connection 210211 with hose connector 2071 to the air inlet and outlet , and is connected with a hose ( not shown ). arranged below the lower part 2102 of the bellows is the sprung floor plate 204 with spring suspension . guide clips 2053 are curved up from the floor frame 205 . these interact with slots ( which cannot be shown in this figure ) in the floor plate 204 that serve to guide said floor plate 204 when the bellows system is moved due to gas pressure . the guide slips have shoulders that form stops 20531 in order to limit the travel upon movement of the lower part 2102 , with the movement directed toward the travel surface . in the operating mode of the printing apparatus , the contact pressure module 2 cannot be removed from the printing apparatus , as has already arisen from the german utility model de 20 2010 015 354 u1 . in this case , the u - shaped plate rocker 206 that is movable in rotation around the bearing axle ( see fig2 a ) is engaged , as arises from fig2 b . a perspective view of the contact pressure module from the upper rear left — partially in an exploded view — is shown in fig3 . both parts 201 , 202 are attached to one another by means of connection bolts 203 . openings 2021 for the guide rods 032 ( see also fig2 ) are provided on the back side of the lower part 202 . a plug 2011 as a counterpart to the connection bushing 033 is present on the back side of the upper part 201 . moreover , a box - shaped recess 2022 for the grip 2062 is introduced into the lower part 202 . the upper part of the contact pressure module 2 ( shown in fig1 ) in addition to the floor frame 205 is visible in an exploded presentation in fig4 , from the front upper left . the bellows - like air bag 210 comprises an upper part 2101 and a lower part 2102 . the sealing surface 21013 of the upper part 2101 and the sealing surface 21023 of the lower part 2102 are adapted to one another . the side parts 21012 of the upper part 2101 and the side parts 21022 of the lower part 2102 are executed in a folded manner . a hose connector 210211 protrudes from the floor surface 21021 of the lower part . the upper part 201 of the contact pressure module housing 20 ( see also fig2 ) accommodates the bellows - like air bag 210 and the floor frame 205 . a shaped part 2010 — letter thickness sluice , below — is provided at the intake region for the letters 4 . furthermore , a recess 2012 is molded for the upper part 2010 of the air bag 210 . bores 2054 to accommodate a bearing axle 208 for the function arm 206 ( see also fig6 ) are present on both sides in the floor frame 205 . the parts according to fig4 are presented in exploded form from the front lower left in fig5 . all parts are assembled with accurate fit by means of the connecting bolts 203 and the associated guide elements ( not designated in detail ) and are attached to the upper part 201 of the contact pressure module housing 20 ( shown in fig2 ). the connection between upper part 2102 and lower part 2012 of the air bag 210 is air - tight . the air bag 210 could also be a single ( unitary ) part . moreover , a support pocket 2014 for a pump 209 ( see also fig7 ) is molded into the upper part 201 . the lower part of the contact pressure module 2 ( shown in fig2 ) is presented in exploded form from the rear lower right in fig6 . it comprises the floor plate 204 , the aforementioned floor frame 205 in addition to the function arm 206 , and associated bearing axle 208 and hose 207 . dog - shaped mounts 2041 for tension springs 2052 are provided at the side angles of the floor plate 204 . an exposure 2043 for the hose connector 2071 to the hose connection 210211 at the air bag 210 ( see also fig5 ) is introduced in the middle of the floor plate 204 . the other end of the hose 207 is connected via a t - shaped hose connector 2072 with a pump 209 ( see fig7 ) whose middle part descends into a rubber elastic hose bushing 2051 . the hose bushing 2051 is grasped in a bend of the floor frame 205 . the outgoing end of the hose bushing 2051 can be sealed air - tight at the grip 2062 of the function arm 206 by means of an elbowed sealing surface 20621 . the grip 2062 is attached to a u - shaped part of the function arm 206 by means of bolts 203 . the free ends of the u - shaped part have bearing holes 2063 for a bearing axle 208 that is in turn borne in lateral bends of the floor frame 205 ( see also fig4 ). a microswitch 2061 for the activation of the pump 209 is attached to the arm of the u - shaped part at the input side of the apparatus . floor plate 204 and floor frame 205 are elastically connected with one another via the tension springs 2052 . angled guide clips 2053 in the floor frame 205 serve for defined positioning relative to one another , which guide clips 2053 dip on the one hand into slots 2042 of the floor plate 204 and on the other hand serve as a stop for said floor plate 204 . for this purpose , the guide clips 2053 have shoulders 20531 . the floor plate 204 slides on the free ends of the guide clips 2053 , whose length with the shoulders 20531 establishes the amount of travel ( stroke ). the combination of slots 2042 and guide clips 2053 requires that the air bag 210 can be displaced only in the vertical direction . the arrangement and attachment of the upper part of the contact pressure module 2 ( shown in fig2 ) together with accessories ( such as circuit board 2017 , plugs 20171 , 20172 , microswitch 2061 and pump 209 ) are visible in fig7 in the upper part of the contact pressure module housing 201 . in fig8 it is clear how the pump 209 including bearing bracket ( not designated in detail ) is attached to the upper part 201 so as to damp structure - borne sound . for this purpose , a vibration damper 2015 that prevents a sound transmission to the upper part 201 is provided in the support pocket 2014 . also for such damping , a retention angle 2016 that is firmly bolted to the upper part 201 is provided , on its end facing away , with a vibration damper 20161 that is positively and non - positively connected with the other side of the pump 209 . both pump noise and oscillation transmission from the contact pressure module housing 20 to the transport belt 10 — which can have the consequence of disadvantageous effects on the letter transport , and therefore on the print quality — are therefore prevented . the circuit board 2017 is provided with its own power connection 20171 and with an electrical connection 20172 for the pump 209 , and a connection 20173 for the microswitch 2061 . the circuit board 2017 is furthermore provided with an electronically adjustable deactivation delay for the pump 209 . in fig9 the contact pressure module 2 ( shown in fig1 ) is shown in the operationally ready state . the air bag 210 — see also fig2 — protrudes with its upper part 2101 upward until the cover surface 21011 non - positively rests on the transport belt 10 . a compression spring 2064 is borne in a support pocket 213 in the upper part 201 and rests non - positively on a bearing point 20622 on the grip 2062 of the function arm 206 , so this is always pushed back into the initial position . the grip 2062 of the function arm 206 is pivoted by the compression spring 2064 around its bearing axle 208 downward until this rests non - positively with its sealing surface 20621 on the rubber elastic hose bushing 2051 that is inserted into the floor frame 205 , and thus seals this air - tight ( see detail c ). as a result of this , the fitted hose connector 2072 is also contained in the hose bushing 2051 . the tension springs 2052 are drawn far apart from one another by the inflated air bag 210 — see detail b — until the microswitch 2061 is triggered and a clearance from the floor plate 204 exists . the deactivation signal is directed from the microswitch 2061 via the circuit board 2017 with deactivation delay to the pump 209 and deactivates said pump 209 with a time delay ( see also fig7 ). the lower part 2102 of the air bag 210 ( shown in fig5 ) rests on the floor plate 204 that , in turn , has a clearance from the shoulders 20531 at the guide clips 2053 that form the stop 20531 for travel limitation . an approximately constant contact pressure with the transport belt 10 can be achieved — even for mixed mail — with greater tolerance ( thickness and weight ) with the combination of tension springs 2052 and elastic air bag 210 . the heavier the letters that are permitted , the higher the spring constant that is selected . the contact pressure module 2 ( shown in fig1 ) in the removal - ready state is shown in fig1 . upon raising ( arrow ) the grip 2062 , the compression springs 2064 are compressed and the sealing surface 20621 assumes a clearance from the hose bushing 2051 in the floor frame 205 that is therefore open ( see detail c ). the air bag 210 ( see also fig2 ) is deflated and — with its upper part 2101 — dips so far into the upper part 201 of the contact pressure module housing 20 that the cover surface 21011 has a clearance from the transport belt 10 . the lower part 2102 of the air bag 210 is lowered until it rests on the floor plate 204 , which in turn is drawn by the tension springs 2052 along the guide clips 2053 until it rests on their shoulders 20531 . as a result of this , the trigger button ( not designated in detail ) of the microswitch 2061 is contacted to the greatest possible extent without triggering the latter . this means that the pump 209 remains deactivated . in fig1 , the contact pressure module 2 is shown before assuming operational readiness . the contact pressure module 2 is slid into the apparatus housing 01 ( see also fig1 ), and the grip 2062 of the function arm 206 is released ( and therefore free ). the spring force of the tension springs 2052 is measured so that the microswitch 2061 is triggered by the floor plate 204 , and the pump 209 is activated with delay via the circuit board 2017 after the hose bushing 2051 has been sealed by the sealing surface 20621 of the grip 2062 of the function arm 206 . the air bag 210 is inflated until operational readiness is established . if a letter 4 arrives in the intake region ( letter thickness sluice 02 shown in fig1 ) of the franking machine 0 , this initially strikes the wedge - shaped region of the cover surface 21011 and is slid by the running transport belt 10 into the contact pressure region of the air bag 210 , and after passing is ejected by the same . due to the elastic properties — elastic air bag 210 and its suspension in the form of the floor plate 204 and the tension springs 2052 — approximately the same contact pressure forces are achieved independent of the letter thickness , wherein the contact pressure force is even adjustable to the desired degree via the selection of the spring force . if letters 4 of different thickness are simultaneously located in the contact pressure region of the air bag 210 , due to its elastic properties said air bag 210 immediately adapts to these . the letters 4 of different thicknesses — thick after thin or vice versa — can follow one another at short intervals . the contact pressure device 21 has proven itself precisely when an approximately 10 mm thick mail good follows a thin mail good of approximately 0 . 1 mm thickness , wherein the letter gap can be minimal . the minimal letter gap amounts to approximately 50 mm from the following mail good . the width of the contact pressure device 21 corresponds to the width of the transport belt , and the length of the contact pressure device 21 is smaller than or equal to the length of the straight segment of the transport belt . the bellows has the advantage that an upward and downward expansion is enabled given a relative dimensional stability of its side walls . in the preceding description , a bellows has been addressed in simplified terms . however , a different suitable embodiment of a gas - tight casting that can be filled with air or with another suitable gas , which shell has a flexible contact pressure surface which can rapidly adapt its shape , should not therefore be precluded . instead of a bellows ( bellows - shaped air bag ), a flexible , inflatable , air - filled shaped part or , respectively , a shell can be used . although modifications and changes may be suggested by those skilled in the art , it is the intention of the inventors to embody within the patent warranted hereon all changes and modifications as reasonably and properly come within the scope of their contribution to the art .	1
please refer to fig2 , and 4 . the present invention is a coin - collecting mechanism 2 comprising a front panel 21 having a coin - insertion slot 11 and a coin - discharge slot 15 provided thereon , two adequately spaced side walls 22 disposed behind the front panel 21 to form therebetween a passage for coins , an inserting recess 23 formed at a proper position in mid way of the side walls 22 , a set of sensor 3 vertically movably disposed in the inserting recess 23 , a relay 28 , and a counter 6 . please refer to fig4 and 6 , the sensor 3 consists of a first oscillating coil l1 ( 31 ), a second oscillating coil l3 ( 33 ), and an inductive coil l2 ( 32 ) sandwiched between the first and the second oscillating coils l1 , l3 ( 31 , 33 ). as shown in fig6 after the inductive coil l2 is sandwiched between the oscillating coils l1 , l3 by means of a bolt threading through an upper portion thereof , a first slot way 34 having a downward opening is formed between a lower portion of the second oscillating coil l3 ( 33 ) and the inductive coil l2 , and a second slot way 35 also having a downward opening is formed between a lower portion of the first oscillating coil l1 ( 31 ) and the inductive coil l2 ( 32 ). the first slot way 34 corresponds to an backward inclined main slideway 24 which forms a lower base of the passage formed between the two side walls 22 . the second slot way 35 corresponds to a secondary slideway 25 which is a short block member disposed at one outer side of the side walls 22 in parallel to the main slideway 24 . as shown in fig3 and 4 , a locating plate 26 is fixed to one lateral side of the second oscillating coil l3 ( 33 ) to define a vertical slide path for the sensor 3 . moreover , a compression spring 27 is connected between the second oscillating coil l3 ( 33 ) and the locating plate 26 to generate a downward spring force relative to the sensor 3 . by this way , the sensor 3 can be lifted for a coin a ( 4 ) to dispose in the second slot way 35 between the sensor 3 and the secondary slideway 25 to set the specifications of coin the sensor 3 shall examine when a coin passes through the first slot way 34 between the sensor 3 and the main slideway 24 . fig7 and 10 are circuit diagrams of the present invention . from the diagram , it can be seen that after a selected coin a ( 4 ) is disposed between the second slot way 35 between the first oscillating coil l1 ( 31 ) and the inductive coil l2 ( 32 ), the sensor 3 detects a high - level output : ic , u1 , and # 5 has a low - level input , and when u1 , o / p # 7 is high , then the q1 # b is also high ; when q1 # c is low - level , i . e ., ic2 # 4 is low , then ic2 # b has a low - level output which causes q2 # b to be low , and therefore q2 is inactive ; that is , if only the second slot way 35 has a selected coin a ( 4 ) therein , the relay 28 would not be actuated to open a gate 280 for collecting coins . similarly , if a coin having first slot way 34 between the sensor 3 and the main slideway 24 , the relay 28 would not be actuated to open the gate 280 , neither , and the coin is discharged from the coin - discharge slot 15 . reversely , if a coin b ( 5 ) having the same material , shape , size , and thickness as those of the selected coin a ( 4 ) disposed in the second slot way 35 passes the first slot way 34 between the sensor 3 and the main slideway 24 , the inductive coil l2 ( 32 ) shall induce a low level putput , that is , the u1 # 5 i / p is low , and the u1 # 7 is low which causes q1 # b to be low , and therefore , q1 # c is high which causes ic2 # 4 to be high , ic2 # b to be high , causing q2 # b to be high . at this point , the q2 is actuated to bring the relay 28 to act and open the gate 280 for the coin b ( 5 ) to pass and contact the counter 6 before a game controlled by the coin - collecting mechanism can be proceeded . in brief , when there is not any selected coin a ( 4 ) disposed between the second slot way 35 and the secondary slideway 25 , the two slot ways 34 , 35 have the same inductance value and the outputs thereof are two equal voltages with different polarities . the two voltages offset with each other and therefore , the inductive output of the l2 ( 32 ) is low - level ( 0 ). however , when a selected coin a ( 4 ) enters the setting position between the second slot way 35 and the secondary slideway 25 , the inductive output of the l2 ( 32 ) is high - level ( 1 ), and the two slot ways 34 , 35 lose their balanced inductance value which disables the q2 and therefore , the relay 28 would not open the gate 280 . at this point , if any coin having specifications different from those of the coin a ( 4 ) passes the first slot way 34 , the sensor 3 shall response the same as it will do in the above - mentioned condition of unbalanced inductance values , and the disqualified coin is discharged from the coin - discharge slot 15 . on the contrary , if a qualified coin b ( 5 ) completely the same as the coin a ( 4 ) used to set the sensor 3 passes between the first slot way 34 and the main slideway 24 , the l2 ( 32 ) detects a similar outputs , and the two slot ways 34 , 35 regain a balanced inductance value . this regained balanced inductance value actuates the q2 and accordingly the relay 28 to open the gate 280 . that is , the sensor 3 can correctly and effectively examine and judge the inserted coins for their qualification . under the action of the compression spring 27 , the sensor 3 has the ability to vertically slide along the locating plate 26 . to set the sensor 3 , just slightly lift the sensor 3 and place a selected coin a ( 4 ) between the second slot way 35 and the secondary slideway 25 , or to reset the sensor 3 , just remove the old coin a ( 4 ) in the second slot way 35 and put another selected coin a ( 4 ) into the same slot way 35 . then , allow the sensor 3 to slide downward along the locating plate 26 under the recovery force of the compression spring 27 acted on the sensor 3 . as shown in fig8 when a large coin a ( 4 ) is placed in the setting position , that is , the space between the second slot way 35 and the secondary slideway 25 , the relay 28 is actuated to only allow large coins b ( 5 ) having the same specifications as the coin a ( 4 ) in the setting position to pass through the gate 280 to actuate the game . or , as shown in fig9 when a small coin a ( 4 ) is placed in the setting position , the relay 28 is actuated to only allow small coins b ( 5 ) having the same specifications as the coin a ( 4 ) in the setting position to pass through the gate 280 to actuate the game . the entire setting or resetting procedure of the sensor 3 can be easily and conveniently completed just by lifting the sensor 3 , selecting a desired coin a ( 4 ), putting the same in the setting position in the coin - collecting mechanism 2 , and let down the sensor 3 again , without any other precise adjusting operation .	6
reference will now be made in detail to exemplary embodiments , examples of which are illustrated in the accompanying drawings , wherein like reference numerals refer to the like elements throughout . exemplary embodiments are described below to explain the present disclosure by referring to the figures . according to exemplary embodiments , a divided layer structure may be adapted for each detector of a combination detector , and each layer may allow a sample of an object , detected using a binary classification device , to be passed therethrough and to be transmitted to a lower layer . the lower layer , however , may reject a sample , detected as a non - object , thereby not allowing the rejected sample to be passed through to a corresponding layer . in a specific detection process , a weight sum of the above described characteristic values may be used as a discrimination basis , and a sample may be selected through a comparison with a threshold value . in this manner , the sample may pass downwardly through each layer , and only a sample finally determined as an object may pass through every layer . according to exemplary embodiments , there is disclosed a method of detecting an object in a combination scheme of various detectors based on characteristics of a detected object and characteristics of sample detection of various detectors . hereinafter , exemplary embodiments will be described in detail with reference to fig4 to 7 . fig4 is a schematic view illustrating a method of detecting an object using a combination detector according to an exemplary embodiment . referring to fig4 , object detection is performed in a divided layer structure using a combination scheme of a haar detector and a modified census transform ( mct ) detector . here , since the haar detector has a simple structure and operates relatively rapidly , the haar detector may be applicable in an initial process , thereby rapidly removing a simple non - object sample . however , an mct detector structure may generally be used for classifying relatively complex characteristics , and thus the mct detector may be suitable for subsequent processes , and to reject a complex non - object sample allowed to pass , for example , by the haar detector . as further illustrated in fig4 , in a disposition of a multi - layer combination detector , the haar detector may use initial n - numbered layers , that is , layers ranging from an uppermost layer to an n - layer , and the mct detector may use subsequent m - numbered layers , that is , layers ranging from an ( n + 1 )- layer to an ( n + m )- layer . here , specific numerals of ‘ n ’ and ‘ m ’ may be determined by experience and detection results , and thereby a structure having the fastest speed and a superior detection effect may be selected . in this manner , the haar detector located in the initial n - numbered layers may first remove most non - object samples . the mct detector located in the subsequent m - numbered layers may remove non - object samples having a relatively complex structure and a relatively smaller number of samples . accordingly , the total number of non - object samples approaching lower layers may be reduced . however , even though an operation amount of the mct detector may be relatively great , an operation speed of an entire system may significantly increase due to the relatively fast speed of the haar detector . a method of determining the n and m is provided merely an example , and thus exemplary embodiments are not limited thereto . the n and m may equally be determined in known methods of related arts as long as a superior detection performance is satisfied using the combination detector . the combination of the haar detector and the mct detector is merely an example , and thus exemplary embodiments are not limited thereto . a person skilled in the art may replace the mct detector with a scale invariant feature transform ( sift ) detector , a non - negative matrix factorization ( nmf ) detector , and the like to form a combination detector with the haar detector , thereby performing an object detection . fig5 is a schematic view illustrating a method of detecting an object using a combination detector according to other exemplary embodiments . referring to fig5 , object detection may be performed in a divided - layer structure using the haar detector and the mct detector . characteristics of the haar detector and of the mct detector may be complementary to each other and thereby the haar detector and the mct detector may be alternatively disposed . as illustrated in fig5 , as for disposition of the multi - layer combination detector , the haar detector may be disposed sequentially downward from an uppermost layer to use odd numbered layers such as a first layer , a third layer , a fifth layer , and the like , and the mct detector may use even numbered layers such as a second layer , a fourth layer , a sixth layer , and the like . thus , the object detection may be satisfactorily performed using the complementary nature between characteristics of the haar detector and the mct detector , thereby obtaining relatively high operation efficiency . the combination of a haar detector and an mct detector is merely an example , and thus exemplary embodiments are not limited thereto . a person skilled in the art may replace the mct detector with a sift detector , an nmf detector , and the like to form a combination detector with the haar detector , thereby performing an object detection . fig6 is a schematic view illustrating a method of detecting an object using a combination detector according to still other exemplary embodiments . referring to fig6 , object detection may be performed using a combination scheme of the haar detector and the mct detector . in an embodiment , a determination as to which layer the haar detector and the mct detector are disposed in may need to be specifically made in accordance with a training process of an object to be detected . for example , a performance function , based on a detection speed and detection effect of a sample , may be set to train each of the haar detector and the mct detector . in addition , a detector in which a selection performance of each layer is relatively superior based on the training result may be selected as a detector of a corresponding layer . in a human face detection training process , a detector generally located in an upper layer may be selected as a haar detector , and a detector generally located in a lower layer may be selected as an mct detector . in particular , the mct detector may be located in the final two or three layers . the combination of a haar detector and an mct detector is provided as merely an example , and thus exemplary embodiments are not limited thereto . a person skilled in the art may replace the mct detector with a sift detector , an nmf detector , and the like to form a combination detector with the haar detector , thereby performing an object detection . fig7 is a schematic view illustrating a state where an object is detected using a plurality of viewing angles using a method of detecting an object using a combination detector according to exemplary embodiments . example embodiments described at fig4 to 6 may be directly adapted to perform simple object detection . for example , it is possible to detect a front of a human face . also , example embodiments of fig4 to 6 may be actively adapted to perform object detection with respect to relatively complex appearances of a face . more specifically , with respect to face detection with a plurality of appearances , an object detected depending on angles may be divided into a plurality of sub classes , and any one of example embodiments of fig4 and 6 may be selected for each of the plurality of sub classes , or all detection results of the plurality of sub classes may be used as a final object detection result . the above described methods may be recorded , stored , or fixed in one or more computer - readable storage media that includes program instructions to be implemented by a computer to cause a processor to execute or perform the program instructions . the media may also include , alone or in combination with the program instructions , data files , data structures , and the like . the media and program instructions may be those specially designed and constructed , or they may be of the kind well - known and available to those having skill in the computer software arts . examples of computer - readable media include magnetic media such as hard disks , floppy disks , and magnetic tape ; optical media such as cd rom disks and dvds ; magneto - optical media such as optical disks ; and hardware devices that are specially configured to store and perform program instructions , such as read - only memory ( rom ), random access memory ( ram ), flash memory , and the like . the computer - readable media may also be a distributed network , so that the program instructions are stored and executed in a distributed fashion . the program instructions may be executed by one or more processors . the computer - readable media may also be embodied in at least one application specific integrated circuit ( asic ) or field programmable gate array ( fpga ), which executes ( processes like a processor ) program instructions . examples of program instructions include both machine code , such as code produced by a compiler , and files containing higher level code that may be executed by the computer using an interpreter . the described hardware devices may be configured to act as one or more software modules in order to perform the operations and methods described above , or vice versa . the software modules may be executed on any processor , general purpose computer , or special purpose computer including a combination detector apparatus . as described above , according to exemplary embodiments , the method of detecting an object using the combination detector may overcome limitations of a conventional single detector , and actively select a detector being suitable for each layer , thereby ensuring a detection effect , and improving an operation speed . although a few exemplary embodiments have been shown and described , it would be appreciated by those skilled in the art that changes may be made in these exemplary embodiments without departing from the principles and spirit of the disclosure , the scope of which is defined in the claims and their equivalents .	6
fig1 illustrates a network of retail centers ( hereafter , collectively , “ the company ”). for illustrative purposes , only three retail centers are shown . it should be understood that the company may employ any number of retail centers . as shown in fig1 , each retail center is associated with one or more body shops . the number of body shops associated with each retail center may vary based on several factors , including geography , customer need , and quality of service . for example , a retail center that is in close geographic proximity with many body shops may become associated with several body shops . however , if customer need is low , or if the body shops do not meet standards set by the company , a retail center may only become associated with a single body shop , or no body shops . in populated areas , the company may have several retail centers . in such cases , a body shop may be in close geographic proximity to two or more retail centers . therefore , it is possible for a body shop to be associated with two or more retail centers . in one embodiment , the body shop may be evaluated on a national or regional level , and upon passing the evaluation , it will become associated with all retail centers of the company that are located within a predetermined distance . in an alternative embodiment , each retail center will evaluate the body shop . in one embodiment , the company specializes in automobile related services , such as oil changes , or general maintenance . in another embodiment , the company specializes in automobile related products , such as parts . in another embodiment one or more estimating retail locations may be established to provide estimating services ( hereafter , an “ estimating retail center ”) as a retail kiosk or free standing or in - line retail location . in yet another embodiment , the company is a general purpose retailer or wholesale club . however , it should be understood that the company may be any national , regional , or local chain of retail centers . fig2 illustrates the interaction between a customer , a retail center , and a body shop . in the illustrated embodiment , a consumer visits a retail center of the company that provides estimating services the estimating retail center employs estimating software and trained individuals to provide the consumer with a cost estimate for requested body work . if the consumer accepts the estimate , the estimating retail center further employs software to transmit the request to a participating body shop . upon receiving the request , the participating body shop may accept the request and schedule the job , or it could refuse the request . if the job is accepted , the body shop further provides an estimated time of completion . transportation of the automobile may be arranged by the body shop or by the estimating retail center . due to the company &# 39 ; s national , regional or local presence and individual store locations , the consumer would be able to have their vehicle estimated at locations more convenient and safer than where body shops are typically located due to significant zoning issues . additionally , the store hours of the company locations may be more convenient for a consumer than the store hours of body shops . one aspect of this system and method is to leverage the business assets and retail locations of the company and to provide estimating services for auto body collision , repair & amp ; painting to one or more of retail , trade , insurance and fleet customers by developing a proprietary network of one or more of independent , dealer and chain body shops that will enter into an agreement with the company to provide these services . 1 . provide estimating software . in one embodiment , the software is existing software that is generally accepted by the auto collision & amp ; painting industry and vehicle insurance providers . in an alternative embodiment , the software is written specifically for this purpose . 2 . provide training to educate current company employees or new employees hired for this purpose to develop accurate and dependable skills in estimating auto body collision repair and paint work for vehicles . 3 . provide training to educate current or new employees hired for this purpose to effectively “ sell ” these services to retail , trade , insurance and fleet customers . 4 . market these services to the retail , trade , insurance and fleet customer utilizing appropriate advertising messaging and media to each . 5 . select potential participating body shops . in one embodiment , the step of selecting potential participating body shops is performed on a national level , through a central selection center . in an alternative embodiment , the step of selecting potential participating body shops is performed on a regional level , through a regional selection center . in another alternative embodiment , the step of selecting potential participating body shops is performed on a local level , by one or more local retail centers in the company . participating body shops may display signage identifying themselves as a business partner of the company . 6 . evaluate selected potential participating body shops . as with the selection step , the step of evaluating potential participating body shops may be performed at a national , regional , or local level . in one embodiment , the potential participating body shops are evaluated using national uniform standards . in alternative embodiments , the potential participating body shops are evaluated using regional or local standards . 7 . certify potential participating body shops that pass the evaluation step . 8 . create an appropriate legal document to be used with participating body shops . this legal document will , among other things , set forth the terms and conditions , payments and other obligations to become part of the company &# 39 ; s proprietary network of body shops . 9 . develop a process for moving the vehicles for the estimating location to the participating body shop and then back to the estimating location . in one embodiment , this process may be based on existing models used by companies such as enterprise car rental , dealers , etc . 10 . utilize software to allow for real time scheduling of work to be at network stores . 11 . create a guarantee / warranty program . 1 . company locations may receive an estimating fee for each vehicle “ sold ” ( i . e ., the customer accepts the estimate and agrees to pay for the work performed .) 2 . each participating body shop pays a “ royalty ” to the company or the referring location based on the total dollar amount of the repair order . 3 . each participating body shop could be assessed a weekly or monthly fee to contribute to advertising and marketing . 4 . as the number of participating company locations increase and the amount of auto body collision & amp ; painting accepted estimates increase there may be substantial vendor opportunities ( i . e ., auto paint supply and material providers ) for marketing , training and operational funding .) as the program grows additional opportunities for revenue generation will also grow to include the formation of a buying unit that could negotiate national / regional pricing with paint , material , parts and equipment providers . since most body shops are independently owned , becoming part of the company &# 39 ; s buying program could provide substantial saving they currently do not enjoy . at the same , the company would earn revenues between the negotiated national / regional price and the price sold to the stores . additional revenues opportunities could be developed through services provided that could include training , website participation ( both internet and intranet ), participation in 20 / 20 discussion groups , business analysis tools , etc . collection issues will be avoided by having the company &# 39 ; s stores collect the estimated amount and subtract the estimating fee and royalty and remit the balance to the body shop . to the extent that the term “ includes ” or “ including ” is used in the specification or the claims , it is intended to be inclusive in a manner similar to the term “ comprising ” as that term is interpreted when employed as a transitional word in a claim . furthermore , to the extent that the term “ or ” is employed ( e . g ., a or b ) it is intended to mean “ a or b or both .” when the applicants intend to indicate “ only a or b but not both ” then the term “ only a or b but not both ” will be employed . thus , use of the term “ or ” herein is the inclusive , and not the exclusive use . see , bryan a . garner , a dictionary of modern legal usage 624 ( 2d . ed . 1995 ). also , to the extent that the terms “ in ” or “ into ” are used in the specification or the claims , it is intended to additionally mean “ on ” or “ onto .” furthermore , to the extent the term “ connect ” is used in the specification or claims , it is intended to mean not only “ directly connected to ,” but also “ indirectly connected to ” such as connected through another component or components . while the present application has been illustrated by the description of embodiments thereof , and while the embodiments have been described in considerable detail , it is not the intention of the applicants to restrict or in any way limit the scope of the appended claims to such detail . additional advantages and modifications will readily appear to those skilled in the art . therefore , the application , in its broader aspects , is not limited to the specific details , the representative apparatus , and illustrative examples shown and described . accordingly , departures may be made from such details without departing from the spirit or scope of the applicant &# 39 ; s general inventive concept .	6
some embodiments of the present invention will be described hereunder with reference to the attached drawings . referring to fig1 which shows a first embodiment , a door mirror 1 has a mirror 2 which is pivotally supported by a housing 3 whose proximal or base end 4 is supported by a base part 6 mounted on a door 5 such that the housing 3 is pivotable about a substantially vertical axis . the housing 3 has a hollow interior and is integrally molded out of a soft material having a flexibility and an elasticity , e . g ., a soft rubber or a synthetic resin such as urethane and has an opening 7 which faces rearwardly ( the right - hand side of fig1 ) of the vehicle when the housing 3 is in its normal position as illustrated . the mirror 2 is disposed in the opening 7 . the mirror 2 is supported by the housing 3 through a spherical pivot 8 , so that the mirror 2 is allowed to pivot in any direction about the pivot 8 . in addition , an actuating mechanism ( not shown in the drawings ) is accommodated in the housing 3 . by activating the mechanism by remote control from a passenger room , the mirror 2 is rotated in a desired direction . the base part 6 is integrally molded out of a soft material , e . g ., a soft rubber or a synthetic resin such as urethane , similarly as the housing 3 . the base end 4 of the housing 3 is pivotally supported at a tip end of the base part 6 through a support shaft 9 having an axis extending substantially vertically . the base end 4 of the housing 3 is shaped into a circular arc in its horizontal cross - section . the tip end of the base part 6 is provided with a sliding surface 10 which has a circular arcuate cross - section in conformance with the configuration of base end 4 so as to surround the shaft 9 while being in sliding contact with the base end 4 . the sliding surface 10 is formed such that , when the housing 3 is in its normal position as illustrated , the area of the sliding surface 10 in contact with the base end 4 is relatively large toward the front end 11 of the vehicle , indicated by the arrow , and is relatively small toward the rear end of the vehicle . in other words , the base part 6 is provided at its tip end with a surrounding extension 6a which extends around the base end 4 toward the front end 11 of the vehicle and surroundingly contacts the base end 4 in the normal position of the housing 3 . in addition , the base part 6 is hollow in its interior , and therefore the base part 6 , particularly the extension 6a , can deflect inwardly relatively easily . the operation of this embodiment will be described below . when the housing 3 is in its normal position as illustrated , it projects sidewards beyond the lateral end edge 12 of the vehicle . the housing 3 is pivoted toward the rear of the vehicle when , for example , the vehicle is parked in a relatively narrow space . at this time , the housing 3 inclines towards the rear of the vehicle while rotating around the support shaft 9 and sliding at its base end 4 on the sliding surface 10 , until the housing 3 becomes almost parallel to the side face of the vehicle body . when external force acts on the housing 3 in its normal position from the rear side of the vehicle , the extension 6a of the base part 6 and the housing 3 are deflected by each other at their abutting portions , since each of the base part 6 and the housing 3 is made of an elastic soft material , so that the housing 3 can also incline toward the front 11 of the vehicle . here , the hollow interiors of the base part 6 and the housing 3 serve to receive their deflected portions . thus , the housing 3 is allowed to pivot toward the front 11 of the vehicle owing to the formation of the housing 3 and the base part 6 out of a soft material . in consequence , even if the configuration of the housing 3 , particualrly that of a front side portion of the housing 3 , is variously changed in view of air resistance , the housing 3 is still assured its inclinability or pivotability toward the front of the vehicle , so that it is possible to increase the degree of freedom in design of the housing . accordingly , a vehicle can be equipped with a door mirror of such external appearance , for example , as more approximate to a streamline than conventional mirrors . although the whole of each of the base part 6 and the housing 3 is made of a soft material in the above - described embodiment , it may be sufficient for at least the surfaces of the base part 6 and the housing 3 to be made of a soft material . the second embodiment illustrated in fig2 and 3 show such example . more specifically , a housing 23 of a door mirror 21 is constituted by a surface member 28 being provided onto the surface of a core member 27 . a visor 29 which is made of a rigid material , e . g ., a synthetic resin or a diecast material , is mounted on that portion of the housing 23 which faces the rear of the vehicle when the housing 23 is in its normal position as shown in fig2 . the visor 29 is provided with an opening 30 which faces the vehicle rear side . the mirror 22 is disposed in the opening 30 and is supported by the housing 23 through a spherical pivot 31 , similarly as the first embodiment , so that the mirror 22 is allowed to pivot in any direction about the pivot 31 and is further operated from a remote place . in addition , the core member 27 is made of a rigid material , e . g ., a synthetic resin or a metal such as a diecast metal , while the surface member 28 is made of a soft material , e . g ., a soft rubber or a synthetic resin such as urethane which corresponds to the material forming the housing 3 and the base part 6 of the first embodiment . the base part 26 is composed of a core member 32 and a surface member 33 which is provided on the surface of the core member 32 . the core member 32 is made of a rigid material , e . g ., a synthetic resin or a metal such as a diecast metal , similar to the case of the housing 23 . the surface member 33 is made of a soft material , e . g ., a soft rubber or a synthetic resin such as urethane , similar to the surface member 28 of the housing 23 . there may be selected various techniques for providing the surface members 28 , 33 on the surfaces of the core members 27 , 32 , respectively . for example , the surface members 28 , 33 may be formed by an undercut molding process and then engaged with the core members 27 , 32 , respectively ; the surface members 28 , 33 and the core members 27 , 32 may be bonded together , respectively ; or the surface members 28 , 33 may be provided on the respective surfaces of the core members 27 , 32 by an outsert integral molding process . any of these techniques may be employed . the base end 24 of the housing 23 is pivotally supported at the tip end of the base part 26 through a support shaft 34 having an axis extending substantially vertically . the base end 24 of the housing 23 has a circular arcuate configuration in horizontal cross - section similarly to the first embodiment . the tip end of the base part 26 is provided with a sliding surface 35 which has a circular arcuate cross - section in correspondence to the tip end 24 and which is in slide contact with the tip end 24 . also , that portion of the surface member 33 which is located at the tip end of the base part 26 is provided with a surrounding extension 37 which extends around the tip end 24 toward the front 36 of the vehicle so as to surround and contact the forward side of the tip end 24 in a normal position of the housing 3 . in addition , a relief space 38 is provided inside the surface member 33 between that member 33 and the core member 32 . this relief space 38 is located at that portion of the base part 26 against which the housing 23 comes into abutment when pivoted toward the vehicle front side 36 , that is , at the extension 37 . further , a through - hole 40 for defining a relief space 39 on the inner side of the surface member 28 is provided in the core member 27 of the housing 23 at a portion of the housing 3 placed in abutment against the extension 37 when the housing 23 is pivoted toward the front 36 of the vehicle . the operation of this embodiment will be described below . when external force acts on the housing 3 , which is in its normal position as shown in fig2 from the rear side of the vehicle , the respective surface members 28 , 33 of the housing 23 and the base part 26 abut against each other and are thereby deflected , since the surface members 28 , 33 are made of soft materials having elasticity , so that the housing 23 can also pivot toward the front of the vehicle . at that moment , since the relief spaces 38 , 39 are respectively provided on the inner sides of the surface members 28 , 33 at their abutting portions , the surface members 28 , 33 deflect and flex easilly , so that it is easy for the housing 23 to pivot toward the front 36 of the vehicle . in the aforementioned two embodiments , even if a door mirror in its rearwardly inclined or pivoted state still projects outside from the lateral end edge of a vehicle body , such projecting part of the mirror has a surface formed of a soft material according to the invention , as a consequence of which any external force that may be applied to the projecting part can be absorbed by the soft material . this leads to an excellent durability and a high safety of the door mirror .	8
referring to fig2 , a gprs network 200 includes firewalls that are configured to provide a solution to the problem of unsolicited traffic reaching the ggsn 152 . the gprs network 200 is similar to a conventional gprs network , but includes additional functionality within the firewalls ( i . e ., gtp firewall 143 and gi firewall 163 ) that facilitate communication with one another at the time of tear down of gtp tunnels . gtp firewall 143 includes a communication module 147 that sends messages to and receives messages from a communication module 167 in the gi firewall 163 . the communications can be in - band ( using the conventional link between the two devices in the gprs network 200 ) or out of band ( e . g ., using an external network or signaling system ). gtp firewall 143 includes a detection module 146 . detection module 146 operates to detect the tear down of gtp tunnels between a sgsn 123 and ggsn 152 . more specifically , gtp firewall 143 detects tear down by examining the gtp tunnel teardown request and response messages passed between sgsn 123 and ggsn 152 . at tear down , gtp communication module 147 can send instructions to a tear down engine 165 in the gi firewall 163 ( via communication module 167 in gi firewall 163 ). gi firewall 163 includes tear down engine 165 and a flow table ( e . g ., a firewall session list 169 ). gi firewall 163 uses the firewall session list 169 to track the currently active firewall sessions related to active gprs users . typically the firewall session list 169 includes identifiers for the two communicating systems , such as the ip address assigned to a particular mobile station 115 and an ip address for a server on the internet 173 , along with other information , such as a firewall session identifier or policy information regarding inspection of packets associated with the firewall session . typically , the gi firewall 163 is configured to create sessions upon receipt of traffic from gprs users destined for the packet network ( e . g ., the internet ). once sessions are created , returning traffic from the packet network to the gprs users will be allowed to pass for all traffic with matching entries in the firewall session list 169 . if any traffic originating from the packet network fails to correspond to an entry in the firewall session list 169 , gi firewall 163 will deny the traffic . tear down engine 165 in the gi firewall 163 is operable to remove / delete firewall sessions associated with the torn - down gtp tunnels in its firewall session list 169 . referring to fig2 and 3 , a method is shown for communicating by a gtp firewall to a gi firewall in the gprs network 200 . gtp firewall 143 connects via a link ( i . e ., in - band or out of band ) to the gi firewall 163 and sends an initialization request to the gi firewall 163 ( step 204 ). in one implementation where the ggsn &# 39 ; s operator controls both the gi firewall 163 and the gtp firewall 143 the initialization described herein may not be required . the initialization request can include a handshake , a hello message , an acknowledgement , and / or an authentication request . a check is made to determine if a properly formatted acknowledgement signal has been returned ( step 206 ). if not , a time out loop is entered ( step 208 ). upon receipt of an acceptable acknowledgement , gtp firewall 143 thereafter waits until a tear down is detected of a gtp tunnel between the gtp and gi firewalls , respectively ( step 210 ). as described above , when a mobile station 115 attaches to a network , a gtp tunnel 135 is set up to connect an associated sgsn 123 to ggsn 152 . the gtp tunnel 135 passes through the gtp firewall 143 , enabling the gtp firewall 143 to safeguard the sgsn 123 from packets sent by untrusted ggsns . the gtp firewall 143 is operable to recognize that a new gtp tunnel 135 has been established and can monitor traffic through the new gtp tunnel 135 . at the time of tear down , the gtp firewall 143 communicates with the gi firewall 163 ( e . g ., the gtp communication module 147 communicates with the gi communication module 167 ) to signal to the gi firewall 163 that the gtp tunnel has been torn down ( step 212 ). this process repeats for each gtp tunnel tear down . referring now to fig2 and 4 , a method is shown for communicating between gi firewall to a gtp firewall in the gprs network 200 . the gi firewall 163 receives an initialization request from the gtp firewall 143 ( step 302 ). gi firewall 163 responds with a properly formatted acknowledgement signal ( e . g ., gi communication module 167 sends the acknowledgement signal to the gtp communication module 147 ) ( step 304 ). as described above , the gi firewall 163 maintains a firewall session list 169 that includes firewall session identifiers for each active firewall session . each packet can be associated with a firewall session by the packet &# 39 ; s header information . a mobile station 115 disconnecting from the network ends is the associated firewall session . when the mobile station 115 is disconnected the gtp tunnel 135 is no longer needed to send and receive packets from the sgsn 123 to the ggsn 152 and the gtp tunnel 135 can be torn down . as described above , the gtp firewall 143 detects gtp tunnel tear down . upon detecting the gtp tunnel tear down , the gtp communication module 147 can send a message to the gi firewall 163 . the message can include specific tear down instructions ( e . g ., upon receipt of the message ( step 306 ), gi firewall 163 can clear an associated firewall session from the firewall session list 169 ( step 308 )). in one implementation , the message can include a 5 tuple of information including the source ip address , source port , protocol , destination ip address and destination port associated with the traffic on a given gtp tunnel that is to be torn down . alternatively , the message can include information that can be used by the gi firewall 163 that may result in the clearing of more than one firewall session from firewall session list 169 . as discussed below , the message may contain information that is evaluated against one or more policies in order to determine an appropriate response by the gi firewall 163 . in one implementation , the gi firewall 163 clears the firewall session list 169 and invalidates the ip address associated with the appropriate mobile station . in one implementation , gi firewall 163 examines a firewall session wing &# 39 ; s hash table associated with a particular zone , and invalidates a wing &# 39 ; s source ip address , i . e ., the ip address of the mobile station . thereafter , packets that the gi firewall 163 receives associated with the invalidated firewall session can be dropped , or inspected further to determine whether the packet should be permitted into the network . in one implementation , in addition to or in lieu of messaging by the gtp firewall 143 at the time of recognition of a gtp tunnel tear down , gtp firewall 143 is configured to send a message to the gi firewall 163 if any form of network attack is detected at the gtp firewall 143 . the message content can be of the form of a notification , or an instruction so as to alert / control the gi firewall 163 so as to ensure the security of the gprs network . in one implementation , the gtp firewall 143 and gi firewall 163 use a tcp based protocol for messaging that supports tcp md5 digest option ( rfc2385 ) to provide security . the protocol can have a message format of message header + extension . the message header can indicate the message length in bytes , the message type and the transaction id . the message type can be indicated by a number , such as 1 for a handshake , 2 for a hello , 3 for a hello - ack and 4 is 5 for a clear firewall session . the transaction id can be a unique number or 0 for the hello or the handshake . in the tcp messaging implementation , the handshake message with an extension can state the message length , the message type as 1 and that the transaction id is 0 . the extension can include the version , a hello interval that the gtp firewall 143 will wait before sending the hello to the gi firewall 163 and a reserved portion . in one implementation , the hello interval cannot be zero . the handshake message is sent after the connection is first established . in addition to being sent after a connection is established , the message handshake can be sent at any time . in one implementation , the hello message has no extension , the message type is 2 and the transaction id is 0 . in one implementation , the hello acknowledgement message type is 3 and the transaction id is the same as the last known transaction id or 0 if there was no transaction . the hello acknowledgement can be used to acknowledge the last known transaction id . at the same time that the acknowledgment for a hello is sent , the gi firewall 163 can acknowledge other previously sent transactions . in one implementation the transaction id can either be random or sequential , but a certain degree of uniqueness is desirable . in one implementation , the clear firewall session message is message type 4 . the transaction id is a unique number that relates to the transaction that is to clear the firewall session . the context - id describes the anchor point of a firewall session ( s ) on gi firewall . with this protocol , the firewall session can be anchored on a security zone . to specify the firewall session that needs to be cleared , a context may be needed in addition to an ip address . when a firewall session is cleared or expired , an event log message can be logged . in one implementation , a firewall session ( i . e ., a parent firewall session ) can have children firewall sessions . in one implementation , the clearing of a parent firewall session can clear the parent &# 39 ; s children firewall sessions at the same time . in one implementation , upon detecting that a gtp tunnel is torn down , one of the gtp or the gi firewall call implement policy management that determines what action to take , as shown in fig5 . that is , rather than immediately invalidating a firewall session , one or more policies can be examined to determine an appropriate action . for example , after an event occurs , such as a mobile station 115 detaching from the network , the associated gtp tunnel can be torn down . the gtp firewall 143 is operable to detect the gtp tunnel tear down ( step 405 ). the gtp firewall 143 can determine whether the firewall session associated with the gtp tunnel 135 should be cleared by examining one or more policies ( step 413 ). if the gtp firewall 143 determines that the firewall session should be cleared ( the “ yes ” branch of step 413 ) a message can be sent to the gi firewall 163 ) requesting that the gi firewall 163 to clear the firewall session ( step 431 ). if the policy decision warrants , no message may be provided to the gi firewall 163 and the process can continue at step 405 . for example , a dropped call may be quickly reinitiated within a time out period that would not necessitate the clearing of the firewall session information . some instances of gtp tunnel tear down can be caused not by a deliberate subscriber - prompted disconnect , but rather by loss of signal or other technical breakdown . often , when a disconnect is not intended , the connection is reestablished with a short period of time , such as within two minutes . because of this possibility , the gtp firewall 143 can implement a wait and see policy and decide to leave the firewall session active ( the “ no ” branch of step 413 ). the gtp communication module 147 can wait for a predetermined period for a reconnect request to be received . if a reconnect request is not received after the period expires , the gtp communication module 147 can send a clear firewall session message to the gi firewall 163 ( step 431 ). if the mobile station attaches back onto the system within the period ( the “ yes ” branch of 422 ), the gtp firewall 143 does not send a clear firewall session message at that time . requests are allowed to pass through the network until another gtp tunnel tear down is detected . the reconnect can be through a new gtp tunnel and assigned to the same firewall session . allowing the gtp firewall 143 to implement a wait and see policy prevents an unnecessary firewall session clear and new ad firewall session request . as an alternative to the wait and see policy , the gtp firewall 143 can use other factors to decide whether the clear firewall session message should be sent to the gi firewall 163 . alternatively or additionally , the gi firewall 163 may include a policy engine that is operable to evaluate messages from the gtp firewall 143 . the policy engine can be used to determine what action to take upon receipt of notice of a gtp tunnel tear down . in another implementation , the gtp firewall 143 not only determines when a gtp tunnel has been torn down , but also can determine the information associated with packets that are in the gtp tunnel around the time of gtp tunnel tear down . the packets that are in the gtp tunnel are encapsulated to ensure proper routing to the end of the gtp tunnel . within the encapsulated packet is source and destination information that does not designate the endpoints of the gtp tunnel , but rather the mobile station &# 39 ; s ip address and the ip address of the internet server . this information can be used to determine whether particular internet servers are behaving maliciously . additionally , the information can be used by the gtp firewall 143 in determining whether a firewall session related to a gtp tunnel should be cleared from the gi &# 39 ; s firewall session list 169 . in addition to the messages described above , the gtp firewall 143 can send a hello message at any time to detect a dead connection to the gi firewall 163 . if a dead connection is detected , the connection can be re - established . the gtp firewall 143 can detect dead connections based on idle time . after a connection is re - established , all request messages without a reply can be retransmitted . the gtp and gi firewalls 143 , 163 can be separate units or can be implemented in the same unit . the protocol that is used between the gtp and gi firewalls 143 , 163 can be tcp based . this enables the system to be used with sites that do not permit udp traffic . the communication can be separate from other traffic , so that communication can be on a private network or other secured channel . the communication between the gtp and gi firewall can be udp based or other packet based mechanisms . communication between the gtp and gi firewall can be in - band , out of band , or a variation or change to the conventional communication mechanism between the devices ( e . g ., existing protocols can be adopted and modified as necessary to provide the communication specified herein between the devices ). a firewall can be partitioned into multiple virtual systems . either or both of the gi firewall 163 or gtp firewalls 143 can be within a virtual system . each virtual system is a unique security domain and can be managed by administrators who can individualize ( e . g ., including setting up address books and policies ) the security protections for the given domain . the gi firewall 163 and gtp firewall 143 can be either in the same virtual system or in different virtual systems . either or both of the firewalls can be operated in a transparent mode ( i . e ., the firewalls can be run in different modes with awareness of routing and application or not ). the gi firewall 163 and gtp firewall 143 can be within the same cluster , but on different vsd groups . a gi firewall 163 can be partitioned into multiple virtual systems . the firewalls can be run in a 1 : 1 , n : 1 active - standby or active - active redundancy configurations . a number of embodiments of the invention have been described . nevertheless , it will be understood that various modifications may be made without departing from the spirit and scope of the invention . accordingly , other embodiments are within the scope of the following claims .	7
the following detailed description provides illustration for an improved system to reduce or eliminate the possibility of erroneous data detection by means of a gain compensation mechanism . fig1 a presents a conventional agc processor 100 . in order to transmit digital data over a medium , the data must be converted into an analog signal . while the signal is being transmitted , its power may be lost . the power loss depends on the properties of the medium . when the analog signal is detected at the receiver , it is amplified by a variable amplifier 102 to compensate for power loss . the amplification can be negative or positive , and can vary between values . to analyze and recover the digital data in the analog signal the signal goes through an analog - to - digital converter ( adc ) 104 . the adc is an electronic device that converts analog signals into digital signals , which are a series of discrete numbers . once the analog signal samples have been converted , they are sent to further processing . one processing path leads to a demodulation / detection process that extracts the data from the samples . the demodulation process may involve digital filters and will usually be done by a digital signal processor . the signal also leads to further agc processing . once the signal has been converted , a collection of received signal samples is stored temporarily for a specific duration in a collection module 106 . the collection module 106 is required since the output of the adc 104 is a string or a series of raw amplitude values . the size of the collection buffer may be related to the frequency of the signal as well as the sampling rate of the adc 104 . the magnitude or power of the signal is then estimated in an estimator module 108 . the estimator module 108 is similar to a peak detector in that it finds the highest magnitude in a given sample . since the signal is now digital , the process involves searching for the highest value of the sample . the value provided in the estimator module 108 is then algebraically compared to a desired target level in a comparator module 110 . the target level can vary from system to system and may be adjusted dynamically . for example , if the highest magnitude of a sample is “ 112 ” and the desire target level is “ 150 ”, the comparator output would be − 38 . in other words , the desired target level is subtracted from the highest magnitude of the sample . it is understood that the comparison needs not be linear . once the signal has been algebraically compared , it is compared again with the values of previous comparisons in a second comparator or estimator module 112 , which essentially is used to estimate the required receiver gain for future samples . by comparing the current signal conditions with previous signal conditions , the required gain at the variable amplifier 102 can be adjusted . additionally , the gain level is stored for comparison with the next signal level in a storage module 114 . for example , the previous gain value stored in the storage module 114 was “− 51 ”, while the current calculated value from the comparator module 110 is “− 38 ”. the difference between the old value and the new value is now “ 13 ”, which means that the variable amplifier 102 needs to be adjusted by “ 13 ” units . this conventional processor 100 has a great disadvantage . the initial group of signal samples after a sudden change in signal conditions , e . g . in case of an abrupt power change in the discontinuous - transmission ( dtx ) or in fast fading conditions , are not properly compensated for the new signal conditions before being processed by demodulation and detection blocks , and thereby have a higher probability of erroneous detection . as shown in fig1 b , if a series of frames of signal are arriving , the first 100 frames ( e . g ., frames 1 - 100 ) are at an amplitude level of “ a ”, but the following frames ( e . g ., frames 101 - 200 ) rise up to a much higher level of “ 2a ” in this particular case . assuming each 100 frames are examined to estimate and correct the gain , due to the abrupt change of the power level , the conventional method can not deal with the changes appropriately , therefore asserting wrong gain control . fig2 presents an improved agc processor 200 with a feed - forward gain correction in accordance with one embodiment of the present invention . similar to the conventional processor 100 , the processor 200 has a gain controller 202 and an adc 204 . the gain controller 202 first applies gain compensation parameters to the received signals . at this moment , the gain compensation parameters are derived from the data received in the past . a collection module 206 temporarily stores received signal samples , which are not instantaneously passed over to further demodulation / detection processing blocks . once enough signal samples have been collected , the signal samples set takes two directions . as will be described in detail below , one direction leads to further demodulation / detection processing , while another direction leads to further agc processing . the magnitude or power of the signal is then estimated in an estimator module 208 , which operates in a similar fashion as the estimator module 108 . the value provided by the estimator module 208 is then algebraically compared to a desired target level in a comparator module 210 . once the signal has been algebraically compared with a target level , the result feeds into a second comparator / estimator module 212 , and it is compared again with the value of the previous gain stored in a storage module 214 . the estimator module 212 has filters included therein for producing a new gain , which is fed back to the gain controller 202 for parameter adjusting for new incoming signals . at the same time , the new gain is stored in the storage module 214 for future comparisons . additionally , the collected signal sample from block 206 goes through another process . a delay time period is intentionally introduced in a delay module 216 to compensate for the processing time taken by the agc processing from the modules 208 , 210 , and 212 . the delay module 216 is needed in order to synchronize the signal with the computed agc gain for use in a gain correction module 218 . in some situations , even if the delay time period does not perfectly match the time period needed for the processing time of the magnitude estimator 208 , the comparator module 210 , and the estimator module 212 , the finer gain control implemented by the gain correction module 218 is still an improvement upon the conventional approach because at least a part of the data currently under processing has been considered for generating the gain compensation parameters . the delay time can also be obtained by using simulation tools to more accurately estimate the duration of the processing time needed . any gain compensation parameters computed by the feedback gain control loop or the feedback gain control module ( including the modules 208 , 210 , 212 , and 214 ) based on this collection of signal samples is also used to correct the gain of the delayed signal samples , which have been gain controlled by using previous gain compensation parameters . the gain correction module 218 can deal with the gain control either in a linear domain or a log domain . if a log domain is used , some look - up tables may have to be implemented to convert data from the log domain to the linear domain . the route for extracting the data from block 206 , delaying it in the delay module 216 , and further feeding into the gain correction module 218 is referred to as the feed - forward gain control loop . contrasting with the conventional method in which a gain compensation based on a previous set of signal samples are used to process a current set of signal samples , this feed - forward gain control loop provides a finer gain compensation because the same set of signal samples are used as a base to obtain the estimated gain . in essence , this invention proposes a novel procedure in order to reduce incorrect signal gain . by adding a feed - forward gain control loop , an improved gain compensation on received signal can be achieved such as in fast changing channel conditions and / or in discontinuous transmissions . improvement to the agc performance provides an increase in valid transmissions under faster transfer rates . additionally , an improved control of the signal magnitude results in less saturation noise and more constant signal constellation . finally , probability of accurate detection of the signal samples received right after a sudden change in channel conditions is improved . one significant advantage of the embodiment of this invention is that the signal to be demodulated and detected is with a finer gain , thereby resulting in less saturation noise . this compensation is critical since demodulation and detection extract the data from the signal and pass said data to other systems . an incorrect gain in the raw values of the sampled signal could lead to false detection or erroneous data . additionally , since the flow is delayed , fast changing signals do not affect the system as the agc gain and modulation scheme gain are synchronized , thereby leading to more constant signal constellation . the above illustration provides many different embodiments or embodiments for implementing different features of the invention . specific embodiments of components and processes are described to help clarify the invention . these are , of course , merely embodiments and are not intended to limit the invention from that described in the claims . although the invention is illustrated and described herein as embodied in one or more specific examples , it is nevertheless not intended to be limited to the details shown , since various modifications and structural changes may be made therein without departing from the spirit of the invention and within the scope and range of equivalents of the claims . accordingly , it is appropriate that the appended claims be construed broadly and in a manner consistent with the scope of the invention , as set forth in the following claims .	7
the present invention will be described more detailedly with reference to the following embodiments . it is to be noted that the following descriptions of the preferred embodiments of this invention are presented herein for the purpose of illustration and description only . it is not intended to be exhaustive or to be limited to the precise form disclosed . please refer to fig3 which is a schematic diagram showing some preferred embodiments of a scanner according to the present invention . it is found that the scanner has two lens sets 321 and 322 which are mounted in specific locations so that the ratio of image distance to object distance of lens set 321 is the same as that of lens set 322 according to the lens maker &# 39 ; s equation . in this diagram , the image distance and object distance of the lens set 321 is the same as that of the lens set 322 . hence , the magnifying power of lens set 321 , defined as the ratio of image distance to object distance , is the same as that of lens set 322 . an article is placed on the scanner and is lit by a light source to generate an initial image . the initial image is divided into two sections 311 and 312 to be scanned sequentially . the light - reflecting unit 34 includes a dichroic mirror 343 and three reflective mirrors 341 , 342 , and 344 . the so - called dichroic mirror can transmit or reflect light at both sides . the reflectance and the transmittance at each side of a dichroic mirror can be modified according to the requirement of users . the first initial image section 311 is focused by the lens set 321 for generating a first focused image section , while the second initial image section 312 is focused by the other lens set 322 for generating a second focused image section . since the magnifying powers of the lens sets 321 and 322 are the same , the full image will not be distorted when these two focused image sections are combined together . there are three light shades as shown in this figure . one is a movable light shade 351 , another is a movable light shade 352 , and the other is a rotatable light shade 353 . only one of them is needed in a preferred embodiment . the light shades are defined as &# 34 ; switching unit &# 34 ; because they are used for obstructing undesired initial image sections or undesired focused image sections , or as &# 34 ; switching &# 34 ; among the lens sets to make only one initial image section reach the corresponding lens set or have only one focused image section sensed by the charge coupled device . there are three preferred embodiments shown in fig3 and they are respectively described in brief in the following paragraphs . the movable light shade 351 is selected as the switching unit . at first , the movable light shade 341 is moved to be located in front of lens set 322 so that the initial image section 312 can not be received by the lens set 322 . the initial image section 311 is focused by the lens set 321 to generate a first focused image section . the first focused image section is transmitted from the lens set 321 to the charge coupled device 33 through the reflective mirror 341 , the reflective mirror 342 , and the dichroic mirror 343 in sequence . thereafter , the first focused image section is received and converted to electronic signals by the charge coupled device 33 . second , the movable light shade 351 is moved leftwardly to be located in front of lens set 321 . the initial image section 311 is obstructed by the movable light shade 351 so that it can not be focused by the lens set 321 . the initial image section 312 is focused by the lens set 322 to generate a second focused image section . the second focused image section is transmitted to the charge coupled device 33 by way of the reflective mirror 344 and the dichroic mirror 343 in sequence . thereafter , it is converted to electronic signals by the charge coupled device 33 . at last , both of the electronic signals generated from the first and second instances will be combined together . it is noted that the optical path length of image distance plus object distance corresponding to lens set 321 is the same as that corresponding to the other lens set 322 . in this preferred embodiment , the movable light shade 351 is displaced by another movable light shade 352 mounted between the light - reflecting unit 34 and the lens sets 321 and 322 . at first , the movable light shade 352 is moved to be located in back of lens 322 so the second focused image section generated by the lens set 322 is obstructed . only the first focused image section generated by the lens set 321 can be transmitted to the charge coupled device 33 by way of the reflective mirrors 341 and 342 and dichroic mirror 343 in sequence to be converted to electronic signals . second , the movable light shade 352 is moved leftwardly to be located in back of lens set 321 . the second focused image section , but not the first focused image section , is transmitted to the charge coupled device 33 through the reflective mirror 344 and dichroic mirror 343 to be converted to electronic signals . the following steps are the same as those described in the above - mentioned preferred embodiment and will not be explained tautologically . in stead of the movable light shade 352 , the rotatable light shade 353 is equipped within the light - reflecting unit 34 . first of all , the rotatable light shade 343 is rotated to be in a vertical direction between the dichroic mirror 343 and the reflective mirror 344 to obstruct the second focused image section . the first focused image section is transmitted from the lens set 321 to the charge coupled device 33 through the light - reflecting unit 34 . thereafter , the rotatable light shade 353 is rotated to be in a horizontal direction to obstruct the first focused image section . only the second focused image section is transmitted to the charge coupled device 33 through the light - reflecting unit 34 . the other steps and the light path of image sections are already shown in the detailed description of the preceding preferred embodiments and are not illustrated again . it should be noted that the words &# 34 ; leftwardly &# 34 ;, &# 34 ; horizontal &# 34 ;, and &# 34 ; vertical &# 34 ; are not essential . they are just used for illustrating these embodiments according to the diagram . the light shades can be rotated to be in any directions when the undesired image sections are completely obstructed . moreover , the scanning sequence of the initial image sections also can be modified for the manufactures and users . the number of divided initial image sections can be increased to meet one &# 39 ; s requirement . the number from two to four is especially preferred . their operating functions are similar to those as described above . please refer to fig4 which is a schematic diagram showing another preferred embodiments of a scanner according to the present invention . the initial image is divided into three sections consisting of a left initial image section 411 , a middle initial image section 412 , and a right initial image section 413 . they are focused by the lens sets 421 , 422 , and 423 respectively for generating a left focused image section , a middle focused image section , and a right focused image section correspondingly . the light - reflecting unit 44 includes two dichroic mirrors 442 and 444 and five reflective mirrors 441 , 443 , 445 , 446 , and 447 . there are two types of applications in this diagram . one utilizes the movable light shades , and the other utilizes the rotatable light shades . the operating processes are described in brief as follows . when utilizing movable light shades , each lens set is accompanied by only one movable light shade . in other words , only one of the movable light shades 4511 and 4512 is adopted to match the lens set 421 . by the same token , only one of the movable light shades 4521 and 4522 , and only one of the movable light shades 4531 and 4532 are needed . all possible movable light shades shown in the diagram are not essential . they are shown in order to indicate all the possibilities . we suppose that the movable light shades 4511 , 4521 , and 4531 are adopted . at the first step , the movable light shade 4511 is dislodged from the lens set 421 ( hereafter called &# 34 ; non - obstructive state &# 34 ;), and other movable light shades 4521 and 4531 are provided in front of lens sets 422 and 423 ( hereafter called &# 34 ; obstructive state &# 34 ;). the left initial image section 411 is focused by the lens set 421 for generating a left focused image section , but other initial image sections 412 and 413 are obstructed . the left focused image section is transmitted from the lens set 421 to the charge coupled device 43 through the reflective mirror 441 , dichroic mirror 442 , reflective mirror 443 , and dichroic mirror 444 in sequence , and then is converted to electronic signal . at the second step , the movable light shade 4511 is moved back to the obstructive state , another movable light shade 4521 is in the non - obstructive state , and the other movable light shade 4531 keeps in the obstructive state . the middle focused image section generated by the lens set 422 responding to the middle initial image section 412 is converted to electronic signals by the charge coupled device 43 after it is transmitted through the reflective mirror 445 , the reflective mirror 446 , the dichroic mirror 442 , the reflective mirror 443 , and the dichroic mirror 444 in sequence . at the third step , the movable light shade 4511 keeps in the obstructive state , another movable light shade 4521 is moved back to the obstructive state , and the other movable light shade 4531 is in the non - obstructive state . the right initial image section 413 is focused by lens 423 to generate a right focused image section , but the other initial image sections 411 and 413 are obstructed . after the right initial image section is transmitted through the reflective mirror 447 and the dichroic mirror 444 , it is received by the charge coupled device 43 and is converted to electronic signals . all the electronic signals generated at any steps are combined together to form an entire image which will be processed later . the magnifying powers of lens sets 421 , 422 , and 423 must be the same such that the formed image is not distorted . in stead of movable light shades , two rotatable light shades 4541 and 4542 are mounted within the light - reflecting unit 44 . at first , the rotatable light shade 4541 is rotated to be in a horizontal direction between the reflective mirror 446 and the dichroic mirror 442 , and the other rotatable light shade 4542 is rotated to be in a vertical direction between the dichroic mirror 444 and the reflective mirror 447 . hence , only the left focused image section generated by the lens set 421 responding to the left initial image section 411 can be received and converted by the charge coupled device 43 . second , the rotatable light shade 4541 is rotated to be in a vertical direction between the reflective mirror 441 and the dichroic mirror 442 , and the other rotatable light shade 4542 keeps in the vertical direction between the dichroic mirror 444 and the reflective mirror 447 . hence , only the middle focused image section generated by the lens set 422 in response to the middle initial image section 412 can be received and converted by the charge coupled device 43 . at last , the rotatable light shade 4542 is rotated to be in a horizontal direction between the reflective mirror 443 and the dichroic mirror 444 . hence , only the right focused image section generated by the lens set 423 corresponding to the right initial image section 413 can be received and converted by the charge coupled device 43 . the light paths of image sections and the following steps are the same as those described in embodiment 4 . please refer to fig5 showing other preferred embodiments of the present invention . the light - reflecting unit 54 including a dichroic mirror 543 and three reflective mirrors 541 , 542 , and 544 is mounted in the light path of initial image for transmitting the initial image sections 511 and 512 to the only one lens set 52 . only one of the movable light shade 551 and the rotatable light shade 552 is required so there are two preferred embodiments shown in this diagram . the movable light shade 551 is equipped in the scanner . first of all , the movable light shade 551 is moved to be located in the light path of the second initial image section 512 so the second initial image section 512 is obstructed by the movable light shade 551 . the first initial image section 511 is transmitted to the lens set 52 through the reflective mirrors 541 , 542 and the dichroic mirror 543 in sequence , and is focused by the lens set 53 to generate a first focused image section . the first focused image section is then received by the charge coupled device 53 and is converted to electronic signals . afterward , the movable light shade 551 is moved leftward to be located in the light path of the first initial image section 511 so that the first initial image section 511 is obstructed , but not the second initial image section 512 . therefore , the second initial image section 512 is transmitted to the lens set 52 by way of the reflective mirror 544 and the dichroic mirror 543 . the second initial image section 512 is focused by the lens set 52 for generating a second focused image section . the second focused image is then converted to electronic signals by the charge coupled device 53 . all the generated electronic signals will be combined together to form a full image shown on the computer screen . it should be noted that the optical path length of the initial image sections must be the same , so the magnifying ratio of the corresponding focused image sections is the same . therefore , the obtained full image shown on the computer screen will not be distorted . if the rotatable light shade 552 is selected as the switching unit , the scanning process is described as follows . at first , the rotatable light shade 552 is rotated to be in a vertical direction between the dichroic mirror 543 and the reflective mirror 544 . thus , the second initial image section 512 is obstructed , but not the first initial image section 511 . thereafter , the first initial image section 511 is transmitted to the lens set 52 by the light - reflecting unit 54 . afterward , the rotatable light shade 552 is rotated to be in a horizontal direction between the reflective mirror 542 and the dichroic mirror 543 . the first initial image section 511 is obstructed , but not the second initial image section 512 . thereafter , the second initial image section 512 is transmitted to the lens set 52 by the light - reflecting unit 54 . the light paths of initial image sections and other steps have been shown in embodiment 6 . the number of divided initial image sections can be increased to meet one &# 39 ; s requirement , especially from two to four . their operating functions are similar to those as described above . please refer to fig6 showing other preferred embodiments of a scanner according to the present invention . the initial image is divided into three sections . a left initial image section 611 , a middle initial image section 612 , and a right initial image section 613 are required to be scanned one by one . the light - reflecting unit 64 includes two dichroic mirrors 642 and 644 and five reflective mirrors 641 , 643 , 645 , 646 , and 647 . there are two types of applications in this diagram . among these applications , one utilizes movable light shades , and the other utilizes rotatable light shades . the scanning processes are described in brief as follows . the movable light shades 6511 , 6512 , and 6513 are mounted within the light path of the initial image . at first , the movable light shade 6511 is dislodged from the light path of the left initial image section 611 ( hereafter called &# 34 ; non - obstructive state &# 34 ;), and other movable light shades 6512 and 6513 are placed in the light paths of the middle and right initial image sections 612 and 613 respectively ( hereafter called &# 34 ; obstructive state &# 34 ;). the left initial image section 611 is transmitted to the lens set 62 by way of the reflective mirror 641 , the dichroic mirror 642 , the reflective mirror 643 , and the dichroic mirror 644 in sequence . the left initial image section 611 is focused by the lens set 62 to generate a left focused image section . the left focused image section is transmitted to the charge coupled device 63 and is converted to electronic signals . second , the movable light shade 6511 is moved back to the obstructive state , another movable light shade 6512 is in the non - obstructive state , and the other movable light shade 6513 keeps in the obstructive state . the middle initial image section 612 , but not the left initial image section 611 and the right initial image section 613 , is transmitted to the lens set 62 . after being transmitted to the lens set 62 through the reflective mirror 645 , the reflective mirror 646 , the dichroic mirror 642 , the reflective mirror 643 , and the dichroic mirror 644 , the middle initial image section 612 is focused by the lens set 62 for generating a middle focused image section which will be converted to electronic signals by the charge coupled device 63 . afterward , the movable light shade 6511 keeps in the obstructive state , another movable light shade 6512 is moved back to be in the obstructive state , and the other movable light shade 6513 is in the non - obstructive state . the right initial image section 613 is transmitted to the lens set 62 by way of the reflective mirror 647 and the dichroic mirror 644 , but other initial image sections 611 and 612 are obstructed . after the right initial image section 613 is focused by the lens set 62 for generating a right focused image section , it is received by the charge coupled device 63 and is converted to electronic signals . at last , all the electronic signals generated in the first , second , and third instances will be combined together to form a full image which will be processed later . the optical path lengths of the initial image sections must be the same so that the magnifying ratio of the corresponding focused image sections will not be changed . therefore , the obtained full image is not distorted . in stead of the movable light shades , two rotatable light shades 6521 and 6522 are mounted within the light - reflecting unit 64 . at first , the rotatable light shade 6521 is rotated to be in a horizontal direction between the reflective mirror 646 and the dichroic mirror 642 , and the other rotatable light shade 6522 is rotated to be in a vertical direction between the dichroic mirror 644 and the reflective mirror 647 . hence , only the left initial image section 611 is transmitted to the lens set 62 . second , the rotatable light shade 6521 is rotated to be in a vertical direction between the reflective mirror 641 and the dichroic mirror 642 , and the other rotatable light shade 6522 keeps in the vertical direction between the dichroic mirror 644 and the reflective mirror 647 . hence , only the middle initial image section 612 can be transmitted to the lens set 62 . thereafter , the rotatable light shade 6522 is rotated to be in a horizontal direction between the reflective mirror 643 and the dichroic mirror 644 . hence , only the right initial image section 613 can be transmitted to the lens set 62 . the light paths of each image sections and other relevant steps are the same as those described in embodiment 8 and will not be explained again . the words &# 34 ; left &# 34 ;, &# 34 ; middle &# 34 ;, and &# 34 ; right &# 34 ; in the forgoing paragraphs should not be used to limit the scope of the present invention , because they are only used to illustrate the preferred embodiment more clearly . likewise , the operating sequence also can be modified to make the method more convenient for the manufacturers and users . the feature of the present invention is that the initial image is divided into more sections to be scanned in sequence . less charge coupled devices or less pixels for a charge coupled device are required for this case without reducing resolution . additional light - reflecting unit and switching unit required for the embodiment according to the present invention are relatively cheaper than the charge coupled device . therefore , the cost can be highly reduced without influencing the quality . for example , if an image of a 600 dpi ( dot per inch ) resolution is required , a charge coupled device 0f 600 dpi must be equipped in the scanner according to the prior art . however , according to the present invention , a charge coupled device of 300 dpi is sufficient when the initial image is divided into two sections . moreover , a charge coupled device of 200 dpi can provide an image data with a resolution of 600 dpi if the initial image is divided into three sections . besides , another feature of the present invention is that the optical elements such as lens sets , light - reflecting unit , and the charge coupled device are immobily fixed in the housing . the method of the present invention is to obstruct the undesired image sections substituted for capturing the desired image section . the precision of the scanner according to the present invention keeps unerring because the positions of other optical elements are not affected by rotating or moving the light shades . the other driving elements for the precision according to the present invention are not necessary so that the size and the production cost can be reduced significantly . accordingly , the present invention really conforms to the genius of modem technology . while the invention has been described in terms of what are presently considered to be the most practical and preferred embodiments , it is to be understood that the invention need not be limited to the disclosed embodiment . on the contrary , it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures .	7
before describing the present invention in detail , it is to be understood that this invention is not limited to particular drugs or drug delivery systems , as such may vary . it is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only , and is not intended to be limiting . it must be noted that , as used in this specification , the singular forms “ a ,” “ an ” and “ the ” include plural referents unless the context clearly dictates otherwise . thus , for example , reference to “ a pharmacologically active agent ” includes a combination of two or more pharmacologically active agents , and the like . in describing the present invention , the following terminology will be used in accordance with the definitions set out below . as used herein in the claim ( s ), when used in conjunction with the word “ comprising ”, the words “ a ” or “ an ” may mean one or more than one . as used herein “ another ” may mean at least a second or more . the terms “ active agent ,” “ drug ” and “ pharmacologically active agent ” are used interchangeably herein to refer to a chemical material or compound which , when administered to an organism ( human or animal ) induces a desired pharmacologic effect . included are derivatives and analogs of those compounds or classes of compounds specifically mentioned which also induce the desired pharmacologic effect . the term “ topical administration ” is used in its conventional sense to mean delivery of a topical drug or pharmacologically active agent to the skin or mucosa . “ carriers ” or “ vehicles ” as used herein refer to carrier materials suitable for drug administration . carriers and vehicles useful herein include any such materials known in the art , e . g ., any liquid , gel , solvent , liquid diluent , solubilizer , or the like , which is nontoxic and which does not interact with other components of the composition in a deleterious manner . by an “ effective ” amount of a drug or pharmacologically active agent is meant a nontoxic but sufficient amount of the drug or agent to provide the desired effect . the term “ capsaicin or capsaicins ” as used herein is intended to encompass not only the compound capsaicin , but also homocapsaicin , nordihydrocapsaicin , dihydrocapsaicin , homodihydrocapsaicin or any compounded mixture thereof ( see fig1 ). the present invention provides for certain novel pharmaceutical compositions containing ester derivatives of capsaicin and ester derivatives of myristoleic acid that are highly lipophilic . the ester of capsaicin and the ester of myristoleic acid set forth herein are enzymatically cleaved to the parent compound . thus , the pharmaceutical compositions set forth herein provide for a novel form of therapy of diseases amendable to treatment with capsaicin and esters of myristoleic acid . the combination of the ester derivatives of capsaicin and the ester of myristoleic acid of the present invention would have significant utility over capsaicin or myristoleic acid and existing derivatives currently described in the patent and scientific literature . in particular , in view of their high lipophilicity , non - irritation to the skin , significantly less burning sensation at the site of application and stability , these derivatives would be more bioavailable when administered topically compared to capsaicin or myristoleic acid . in addition , because of their stability and non - toxic nature , these agents can be made more readily available to the general public . the inventors have surprisingly and unexpectedly discovered that the ester derivatives of capsaicin in combination with the esters of myristoleic acid have therapeutic utility in treating pain in humans . these compositions thus provide for a novel form of therapy of any disease or condition wherein capsaicin or myristoleic acid is believed to be of benefit , including but not limited to , post - herpetic neuralgia , shingles ( herpes zoster ), diabetic neuropathy , postmastectomy pain syndrome , oral neuropathic pain , trigeminal neuralgia , temperomandibular joint disorders , pruritus , cluster headache , osteoarthritis , arthritis pain , rhinopathy , oral mucositis , cutaneous allergy , detrusor hyperreflexia , loin pain / hematuria syndrome , neck pain , amputation stump pain , reflex sympathetic dystrophy and pain due to skin tumor . the present invention generally pertains to pharmaceutical compositions containing a compound of formula ( ia ): wherein cap refers to collectively the capsaicins represented in fig1 and a compound of formula ( ib ): wherein mco refers to myristoleic acid represented in fig3 . in formula ia and ib , r is selected from alkyl groups of up to about 18 carbon atoms and aryl groups of up to about 18 carbon atoms and alkylene group of up to about 18 carbon atoms and an arylene group of up to about 18 carbon atoms . the alkyl , aryl and alkylene groups may be substituted or unsubstituted , branched or straight chains . in addition , r may contain heteroatoms and may be straight chained or branched . examples of suitable straight - chain alkyl groups in formula ia and ib include methyl , ethyl , propyl , butyl , hexyl , heptyl , octyl , dodecyl , 1 - pentadecyl , 1 - heptadecyl 1 - hexadecyl , 1 - octadecyl and the like groups . examples of suitable branched chain alkyl groups in formula i include isopropyl , sec - butyl , t - butyl , 2 - methylbutyl , 2 - pentyl , 3 - pentyl and the like groups . examples of suitable cyclic alkyl groups in formula ia and ib include cyclopropyl , cyclobutyl , cyclopentyl and cyclohexyl groups . examples of suitable “ alkenyl ” groups in ia and ib include vinyl ( ethenyl ), 1 - propenyl , i - butenyl , pentenyl , hexenyl , n - decenyl and c - pentenyl and the like . the groups may be substituted , generally with 1 or 2 substituents , wherein the substituents are independently selected from halo , hydroxy , alkoxy , amino , mono - and dialkylamino , nitro , carboxyl , alkoxycarbonyl , and cyano groups . by the expression “ phenalkyl groups wherein the alkyl moiety contains 1 to 3 or more carbon atoms ” is meant benzyl , phenethyl and phenylpropyl groups wherein the phenyl moiety may be substituted . when substituted , the phenyl moiety of the phenalkyl group may contain independently from 1 to 3 or more alkyl , hydroxy , alkoxy , halo , amino , mono - and dialkylamino , nitro , carboxyl , alkoxycarbonyl and cyano groups . examples of suitable “ heteroaryl ” in formula ia and ib are pyridinyl , thienyl or imidazolyl . as noted herein , the expression “ halo ” is meant in the conventional sense to include f , cl , br , and i . among the compounds represented by the general formula ia and ib , preferred compounds are such in which r is one of the following groups : methyl , ethyl , propyl , butyl , pentyl , hexyl , 1 - pentadecyl , 1 - heptadecyl , 1 - hexadecyl , 1 - octadecyl , isobutyl , methoxyethyl , ethoxyethyl , benzyl and nicotinyl . the compounds of formula ia are esters of capsacin and its analogues and compounds of ib are esters of myristoleic acid . however , information in the literature do not disclose or indicate the esters of capsaicin have any utility as prodrug forms in combination with the esters of myristoleic acid suitable for oral and topical delivery for treating diseases such as post - herpetic neuralgia , shingles ( herpes zoster ), diabetic neuropathy , postmastectomy pain syndrome , oral neuropathic pain , trigeminal neuralgia , temperomandibular joint disorders , pruritus , cluster headache , osteoarthritis , arthritis pain , rhinopathy , oral mucositis , cutaneous allergy , detrusor hyperreflexia , loin pain / hematuria syndrome , neck pain , amputation stump pain , reflex sympathetic dystrophy and pain due to skin tumor . the compounds used in the present invention can be prepared by any method known to those of ordinary skill in the art . for example , the esters of myrisoleic acid can be obtained commercially as oil , powder or wax ( ehp products inc , usa ). various methods have been described in the literature pertaining to the synthesis of a number of esters of carboxylic acids and phenols ( march &# 39 ; s advanced organic chemistry : reactions , mechanisms , and structure , 5th edition , by michael b . smith and jerry march , john wiley and sons , inc , 2001 ). one method that has been utilized for efficient preparation of the ester of capsaicin of the present invention is through dissolution of the compound in methylene dichloride . since capsaicin usp27 conatins & gt ; 95 % of capsaicins , to this solution slightly in excess of 1 . 1 mole equivalent of anhydrous triethylamine is added with stirring at room temperature . to this solution slightly in excess of 1 mole equivalent of an acid chloride is added with stirring while keeping the temperature around 25 ° c . after that , the solution was refluxed for 2 - 5 hours and stirred for 12 - 17 hours at room temperature . the reaction mixture was then washed with equal amount of water three to four times to remove the unreacted amine and its salt in a separating funnel . the organic phase was washed 3 - 4 times with dilute hydrochloric acid solution in a separating funnel to remove any amine present in the organic solution . the reaction mixture was then washed with equal amount of 10 % sodium carbonate solution three to four times to remove the unreacted acid and salts in a separating funnel . the reaction mixture was then washed with equal amount of water three to four times in a separating funnel . the organic phase was dried with anhydrous sodium sulfate overnight and the methylene dichloride was removed in a rotary evaporator under vacuum . the resultant oily or waxy material is called the ester capsaicin as all of the phenols present capsaicin is converted into the corresponding ester . certain embodiments of the present invention pertain to pharmaceutical compositions comprising the esters of capsaicins and esters of myristoleic acid set forth herein . the phrases “ pharmaceutical ,” “ pharmaceutically ,” or “ pharmacologically acceptable ” refer to molecular entities and compositions that do not produce an unacceptably adverse , allergic or other untoward reaction when administered to an animal , or human , as appropriate . as used herein , “ pharmaceutical ” includes any and all solvents , dispersion media , coatings , antibacterial and antifungal agents , isotonic and absorption delaying agents and the like . the use of such media and agents for pharmaceutical active substances is well known in the art . except insofar as any conventional media or agent is incompatible with the active ingredients , its use in the therapeutic compositions is contemplated . supplementary active ingredients to treat the disease of interest , such as other anti - cancer agents or anti - inflammatory agents , can also be incorporated into the compositions . pharmaceutical compositions of the present invention will include an effective amount of one or more of the ester derivatives of capsaicin and the ester derivatives of myristoleic acid set forth herein that are clinically determined to be useful in the treatment of the particular disease under consideration . one of ordinary skill in the art would be familiar with what type of dosage is required for treatment of the particular pathological condition that is present in the subject . no undue experimentation would be involved . when used for therapy , the compositions of the present invention are administered to subjects in therapeutically effective amounts . for example , an effective amount of the ester of capsaicin in a patient with diabetic neuropathy may be an amount that promotes the healing of the pain associated with the neuropathy . the dose will depend on the nature of the disease , the subject , the subject &# 39 ; s history , and other factors . preparation of such compositions is discussed in other parts of this specification . as discussed above , the derivatives of capsaicin set forth herein have greater lipophilicity and significantly less irritation to the skin than capsaicin . one advantage of these esters is that they can be incorporated into a cream or ointment form at a higher percentage by weight as compared to capsaicin . another advantage is that these compositions have a very low toxicity and irritation to the skin as compared to formulations of capsaicin . the compositions of the capsaicin derivatives and myristoleic acid derivatives of the present invention can be delivered by any method known to those of ordinary skill in the art . for example , the pharmaceutical compositions can be delivered by topical or oral delivery routes . compositions employing the esters of capsaicin and esters of myristoleic acid set forth herein will contain a biologically effective amount of the derivative . as used herein a biologically effective amount of a compound or composition refers to an amount effective to alter , modulate or reduce disease conditions . one of ordinary skill in the art would be familiar with methods of determining a biologically effective amount of a therapeutic agent . for example , a biologically effective amount may be about 0 . 1 mg / kg to about 50 mg / kg or greater the therapeutic combination of esters of capsaicin and esters of myristoleic acid of the present invention may be administered alone or in combination with one or more additional therapeutic esters of the present invention . in other embodiments , the therapeutic combination of ester of capsaicin and ester of myristoleic acid is administered in combination with one or more secondary forms of therapy directed to the disease or condition to be treated . these are discussed in greater detail below . additional pharmaceutical compounds may be administered in the same pharmaceutical composition , or in a separate dosage form , such as in a separate oral , intramuscular , or intravenous dosage forms taken at the same time . the therapeutic agents of the present invention may be supplied in any form known to those of ordinary skill in the art . for example , the therapeutic agent may be supplied as a liquid or as a solution . the pharmaceutical compositions may contain a preservative to prevent the growth of microorganisms . it must be chemically and physically stable under the conditions of manufacture and storage and must be preserved against the contaminating action of microorganisms , such as bacteria and fungi . the prevention of the action of microorganisms can be brought about by various antibacterial and antifungal agents , for example , parabens , chlorobutanol , phenol , sorbic acid , thimerosal , and the like . the formulations according to the invention having been described herein may influence the ordinarily skilled artesian to make similar formulations using components that will be known in the art , without departing from the invention which is claimed herein . the pharmaceutical formulations of the esters of capsaicin and esters of myristoleic acid according to the present invention offer several advantages over the existing formulations . they can be topically applied and relatively high concentrations of the esters of capsaicin can be loaded into patients with high bioavailability . thus the frequency of dosage can be reduced . thus within the spirit , the invention is related to improved formulations and methods of using the same when administering such formulations to patients . as mentioned herein above a number of excipients may be appropriate for use in the formulation which comprises the composition according to the present invention . the inclusion of excipients and the optimization of their concentration for their characteristics such as for example ease of handling or carrier agents will be understood by those ordinarily skilled in the art not to depart from the spirit of the invention as described herein and claimed herein below . following preparation of the pharmaceutical compositions of the present invention , it may be desirable to quantify the amount of the esters of capsaicin and esters of myristoleic acid in the pharmaceutical composition . methods of measuring concentration of a drug in a composition include numerous techniques that are well - known to those of skill in the art . selected examples include chromatographic techniques . there are many kinds of chromatography which may be used in the present invention : drug - specific assays , adsorption , partition , ion - exchange and molecular sieve , and many specialized techniques for using them including column , paper , thin - layer chromatography , gas chromatography , and high performance liquid chromatography ( hplc ). one of ordinary skill in the art would be familiar with these and other related techniques . certain topical formulations of the present invention may contain moisturizing agents . non - limiting examples of moisturizing agents that can be used with the compositions of the present invention include amino acids , chondroitin sulfate , diglycerin , erythritol , fructose , glucose , glycerin , glycerol polymers , glycol , 1 , 2 , 6 - hexanetriol , honey , hyaluronic acid , hydrogenated honey , hydrogenated starch hydrolysate , inositol , lactitol , maltitol , maltose , mannitol , natural moisturization factor , peg - 15 butanediol , polyglyceryl sorbitol , salts of pyrollidone carboxylic acid , potassium pca , propylene glycol , sodium glucuronate , sodium pca , sorbitol , sucrose , trehalose , urea , and xylitol . other examples include acetylated lanolin , acetylated lanolin alcohol , acrylates / c10 - 30 alkyl acrylate crosspolymer , acrylates copolymer , alanine , algae extract , aloe barbadensis , aloe - barbadensis extract , aloe barbadensis gel , althea officinalis extract , aluminum starch octenylsuccinate , aluminum stearate , apricot ( prunus armeniaca ) kernel oil , arginine , arginine aspartate , arnica montana extract , ascorbic acid , ascorbyl palmitate , aspartic acid , avocado ( persea gratissima ) oil , barium sulfate , barrier sphingolipids , butyl alcohol , beeswax , behenyl alcohol , beta - sitosterol , bht , birch ( betula alba ) bark extract , borage ( borago officinalis ) extract , 2 - bromo - 2 - nitropropane - 1 , 3 - diol , butcherbroom ( ruscus aculeatus ) extract , butylene glycol , calendula officinalis extract , calendula officinalis oil , candelilla ( euphorbia cerifera ) wax , canola oil , caprylic / capric triglyceride , cardamon ( elettaria cardamomum ) oil , carnauba ( copernicia cerifera ) wax , carrageenan ( chondrus crispus ), carrot ( daucus carota sativa ) oil , castor ( ricinus communis ) oil , ceramides , ceresin , ceteareth - 5 , ceteareth - 12 , ceteareth - 20 , cetearyl octanoate , ceteth - 20 , ceteth - 24 , cetyl acetate , cetyl octanoate , cetyl palmitate , chamomile ( anthemis nobilis ) oil , cholesterol , cholesterol esters , cholesteryl hydroxystearate , citric acid , clary ( salvia sclarea ) oil , cocoa ( theobroma cacao ) butter , coco - caprylate / caprate , coconut ( cocos nucifera ) oil , collagen , collagen amino acids , corn ( zea mays ) oil , fatty acids , decyl oleate , dextrin , diazolidinyl urea , dimethicone copolyol , dimethiconol , dioctyl adipate , dioctyl succinate , dipentaerythrityl hexacaprylate / hexacaprate , dmdm hydantoin , dna , erythritol , ethoxydiglycol , ethyl linoleate , eucalyptus globulus oil , evening primrose ( oenothera biennis ) oil , fatty acids , tructose , gelatin , geranium maculatum oil , glucosamine , glucose glutamate , glutamic acid , glycereth - 26 , glycerin , glycerol , glyceryl distearate , glyceryl hydroxystearate , glyceryl laurate , glyceryl linoleate , glyceryl myristate , glyceryl oleate , glyceryl stearate , glyceryl stearate se , glycine , glycol stearate , glycol stearate se , glycosaminoglycans , grape ( vitis vinifera ) seed oil , hazel ( corylus americana ) nut oil , hazel ( corylus avellana ) nut oil , hexylene glycol , honey , hyaluronic acid , hybrid safflower ( carthamus tinctorius ) oil , hydrogenated castor oil , hydrogenated coco - glycerides , hydrogenated coconut oil , hydrogenated lanolin , hydrogenated lecithin , hydrogenated palm glyceride , hydrogenated palm kernel oil , hydrogenated soybean oil , hydrogenated tallow glyceride , hydrogenated vegetable oil , hydrolyzed collagen , hydrolyzed elastin , hydrolyzed glycosaminoglycans , hydrolyzed keratin , hydrolyzed soy protein , hydroxylated lanolin , hydroxyproline , imidazolidinyl urea , iodopropynyl butylcarbamate , isocetyl stearate , isocetyl stearoyl stearate , isodecyl oleate , isopropyl isostearate , isopropyl lanolate , isopropyl myristate , isopropyl palmitate , isopropyl stearate , isostearamide dea , isostearic acid , isostearyl lactate , isostearyl neopentanoate , jasmine ( jasminum officinale ) oil , jojoba ( buxus chinensis ) oil , kelp , kukui ( aleurites moluccana ) nut oil , lactamide mea , laneth - 16 , laneth - 10 acetate , lanolin , lanolin acid , lanolin alcohol , lanolin oil , lanolin wax , lavender ( lavandula angustifolia ) oil , lecithin , lemon ( citrus medica limonum ) oil , linoleic acid , linolenic acid , macadamia ternifolia nut oil , magnesium stearate , magnesium sulfate , maltitol , matricaria ( chamomilla recutita ) oil , methyl glucose sesquistearate , methylsilanol pca , microcrystalline wax , mineral oil , mink oil , mortierella oil , myristyl lactate , myristyl myristate , myristyl propionate , neopentyl glycol dicaprylate / dicaprate , octyldodecanol , octyldodecyl myristate , octyldodecyl stearoyl stearate , octyl hydroxystearate , octyl palmitate , octyl salicylate , octyl stearate , oleic acid , olive ( olea europaea ) oil , orange ( citrus aurantium dulcis ) oil , palm ( elaeis guineensis ) oil , palmitic acid , pantethine , panthenol , panthenyl ethyl ether , paraffin , pca , peach ( prunus persica ) kernel oil , peanut ( arachis hypogaea ) oil , peg - 8 c12 - 18 ester , peg - 15 cocamine , peg - 150 distearate , peg - 60 glyceryl isostearate , peg - 5 glyceryl stearate , peg - 30 glyceryl stearate , peg - 7 hydrogenated castor oil , peg - 40 hydrogenated castor oil , peg - 60 hydrogenated castor oil , peg - 20 methyl glucose sesquistearate , peg40 sorbitan peroleate , peg - 5 soy sterol , peg - 10 soy sterol , peg - 2 stearate , peg - 8 stearate , peg - 20 stearate , peg - 32 stearate , peg40 stearate , peg - 50 stearate , peg - 100 stearate , peg - 150 stearate , pentadecalactone , peppermint ( mentha piperita ) oil , petrolatum , phospholipids , polyamino sugar condensate , polyglyceryl - 3 diisostearate , polyquaternium - 24 , polysorbate 20 , polysorbate 40 , polysorbate 60 , polysorbate 80 , polysorbate 85 , potassium myristate , potassium palmitate , potassium sorbate , potassium stearate , propylene glycol , propylene glycol dicaprylate / dicaprate , propylene glycol dioctanoate , propylene glycol dipelargonate , propylene glycol laurate , propylene glycol stearate , propylene glycol stearate se , pvp , pyridoxine dipalmitate , quaternium - 15 , quaternium - 18 hectorite , quaternium - 22 , retinol , retinyl palmitate , rice ( oryza sativa ) bran oil , rna , rosemary ( rosmarinus officinalis ) oil , rose oil , safflower ( carthamus tinctorius ) oil , sage ( salvia officinalis ) oil , salicylic acid , sandalwood ( santalum album ) oil , serine , serum protein , sesame ( sesamum indicum ) oil , shea butter ( butyrospermum parkii ), silk powder , sodium chondroitin sulfate , sodium dna , sodium hyaluronate , sodium lactate , sodium palmitate , sodium pca , sodium polyglutamate , sodium stearate , soluble collagen , sorbic acid , sorbitan laurate , sorbitan oleate , sorbitan palmitate , sorbitan sesquioleate , sorbitan stearate , sorbitol , soybean ( glycine soja ) oil , sphingolipids , squalane , squalene , stearamide mea - stearate , stearic acid , stearoxy dimethicone , stearoxytrimethylsilane , stearyl alcohol , stearyl glycyrrhetinate , stearyl heptanoate , stearyl stearate , sunflower ( helianthus annuus ) seed oil , sweet almond ( prunus amygdalus dulcis ) oil , synthetic beeswax , tocopherol , tocopheryl acetate , tocopheryl linoleate , tribehenin , tridecyl neopentanoate , tridecyl stearate , triethanolamine , tristearin , urea , vegetable oil , water , waxes , wheat ( triticum vulgare ) germ oil , and ylang ylang ( cananga odorata ) oil . certain topical formulations of the present invention may also contain one or more antioxidants . non - limiting examples of antioxidants that can be used with the compositions of the present invention include acetyl cysteine , ascorbic acid , ascorbic acid polypeptide , ascorbyl dipalmitate , ascorbyl methylsilanol pectinate , ascorbyl palmitate , ascorbyl stearate , bha , bht , t - butyl hydroquinone , cysteine , cysteine hcl , diamylhydroquinone , di - t - butylhydroquinone , dicetyl thiodipropionate , dioleyl tocopheryl methylsilanol , disodium ascorbyl sulfate , distearyl thiodipropionate , ditridecyl thiodipropionate , dodecyl gallate , erythorbic acid , esters of ascorbic acid , ethyl ferulate , ferulic acid , gallic acid esters , hydroquinone , isooctyl thioglycolate , kojic acid , magnesium ascorbate , magnesium ascorbyl phosphate , methylsilanol ascorbate , natural botanical anti - oxidants such as green tea or grape seed extracts , nordihydroguaiaretic acid , octyl gallate , phenylthioglycolic acid , potassium ascorbyl tocopheryl phosphate , potassium sulfite , propyl gallate , quinones , rosmarinic acid , sodium ascorbate , sodium bisulfite , sodium erythorbate , sodium metabisulfite , sodium sulfite , superoxide dismutase , sodium thioglycolate , sorbityl furfural , thiodiglycol , thiodiglycolamide , thiodiglycolic acid , thioglycolic acid , thiolactic acid , thiosalicylic acid , tocophereth - 5 , tocophereth - 10 , tocophereth - 12 , tocophereth - 18 , tocophereth - 50 , tocopherol , tocophersolan , tocopheryl acetate , tocopheryl linoleate , tocopheryl nicotinate , tocopheryl succinate , and tris ( nonylphenyl ) phosphite . as noted in other parts of this specification , there is substantial evidence that capsaicin would be beneficial in the treatment of a wide variety of pathological conditions . the term “ treat ” or “ treatment ” means that the symptoms associated with one or more conditions mentioned above are alleviated or reduced in severity or frequency and the term “ prevent ” means that subsequent occurrences of such symptoms are avoided or that the frequency between such occurrences is prolonged . conditions amenable to treatment or prevention with capsaicin are specifically detailed for post - herpetic neuralgia ( bernstein et al ., 1989 ; watson et al ., 1993 ), diabetic neuropathy ( capsaicin study group , 1992 ), postmastectomy pain syndrome ( watson and evans 1992 ; dini et al ., 1993 ), oral neuropathic pain , trigeminal neuralgia , and temperomandibular joint disorders ( epstein and marcoe , 1994 ; hersh et al ., 1994 ), cluster headache ( following intranasal application ; marks et al ., 1993 ), osteoarthritis ( mccarthy and mccarthy , 1992 ), and dermatological and cutaneous conditions ( hautkappe et al ., 1998 ). examples of pathological conditions responsive to capsaicin therapy include , but are not limited to , post - herpetic neuralgia , shingles ( herpes zoster ), diabetic neuropathy , postmastectomy pain syndrome , oral neuropathic pain , trigeminal neuralgia , temperomandibular joint disorders , pruritus , cluster headache , osteoarthritis , arthritis pain , rhinopathy , oral mucositis , cutaneous allergy , detrusor hyperreflexia , loin pain / hematuria syndrome , neck pain , amputation stump pain , reflex sympathetic dystrophy and pain due to skin tumor . examples of pathological conditions responsive to esters of myristoleic acid include , but are not limited to , arthritis pain , osteoarthritis and inflammation . it is expected that the novel pharmaceutical composition containing ester derivatives of capsaicin and ester derivatives of myristoleic acid set forth herein would be beneficial in the treatment and prevention of any of the diseases set forth above . one of ordinary skill in the art would be familiar with the many diseases and conditions that would be amenable to treatment with one or more of the ester derivatives of capsaicin set forth herein . some embodiments of the claimed methods of the present invention involve administering to the subject a secondary form of therapy in addition to one or more of the therapeutic combination of ester derivatives of capsaicin and ester derivatives of myristoleic acid set forth herein . for example , if the disease is a hyperproliferative disease , such as cancer , the secondary therapy may be a chemotherapeutic agent , radiation therapy , surgical therapy , immunotherapy , gene therapy , or other form of anticancer therapy well - known to those of ordinary skill in the art . if the disease is an inflammatory disease such as arthritis , exemplary secondary forms of therapy include non - steroidal anti - inflammatory agents , steroids and immunosuppressant therapy . in order to increase the effectiveness of the therapeutic agent disclosed herein , it may be desirable to combine the therapeutic agent of the present invention with the secondary therapeutic agent . these compositions would be provided in a combined amount effective to provide for a therapeutic response in a subject . one of ordinary skill in the art would be able to determine whether the subject demonstrated a therapeutic response . this process may involve administering the therapeutic agent of the present invention and the secondary therapeutic agent to the subject at the same time . this may be achieved by administering a single composition or pharmacological formulation that includes both agents , or by administering two distinct compositions or formulations , at the same time , wherein one composition includes the ester derivative of capsaicin and ester derivative of myristoleic acid of the present invention and the other includes the secondary agent . alternatively , the therapeutic agent of the present invention may precede or follow the treatment with the secondary agent by intervals ranging from minutes to weeks . in embodiments where the secondary agent and the ester derivatives of the present invention are separately administered , one would generally ensure that a significant period of time did not expire between the time of each delivery , such that the secondary agent and the therapeutic agent of the present invention would still be able to exert a beneficial effect on the subject . in such instances , it is contemplated that one may administer both modalities within about 24 - 48 h of each other and , more preferably , within about 12 - 24 h of each other , and even more preferably within about 30 minute - 6 h of each other . in some situations , it may be desirable to extend the time period for treatment significantly , however , where several d ( 2 , 3 , 4 , 5 , 6 or 7 ) to several wk ( 1 , 2 , 3 , 4 , 5 , 6 , 7 or 8 ) lapse between the respective administrations . various combinations may be employed , the therapeutic agent of the present invention is “ a ” and the secondary agent , such as chemotherapy , is “ b ”: administration of the compositions of the present invention to a patient will follow general protocols for the administration of therapeutic agents , such as chemotherapy where the disease to be treated is cancer . it is expected that the treatment cycles would be repeated as necessary . the following examples are included to demonstrate preferred embodiments of the invention . it should be appreciated by those of skill in the art that the techniques disclosed in the examples which follow represent techniques discovered by the inventor to function well in the practice of the invention , and thus can be considered to constitute preferred modes for its practice . however , those of skill in the art should , in light of the present disclosure , appreciate that many changes can be made in the specific embodiments which are disclosed and still obtain a like or similar result without departing from the spirit and scope of the invention . preparation of butyryl ester of capsaicin usp27 ( formula i , r ═ c 3 h 7 ) a mixture of 30 . 5 gm (˜ 0 . 1m ) of capsaicin usp27 ( hubei xiangxi chemical industry co ., ltd , china ), 16 . 7 ml ( 0 . 12m ) of anhydrous triethylamine ( spectrum chemicals ) and 200 ml of anhydrous dichloromethane was placed into a 1000 ml 2 - neck round bottomed flask . the content was covered with aluminum foil to protect it from light exposure . the flask was fitted with a condenser fitted with a moisture trap on the top and a dropwise addition funnel . the flask was kept at room temperature and 12 . 8 ml ( 0 . 12m ) of butyryl chloride was added from the funnel into the mixture slowly with stirring . after the addition , the mixture was refluxed for 3 - 6 hours and stirred for 10 - 45 hours at room temperature . the mixture was transferred into a separating funnel and washed successively with 2 × 500 ml of water , 2 × 500 ml of dilute hydrochloric acid , 2 × 500 ml of 10 % sodium bicarbonate solution and 3 × 500 ml of type water . the organic layer was separated , dried with anhydrous magnesium sulfate and the dichloromethane was removed under vacuum to produce a clear , yellow viscous oil ( 95 % of theoretical ). preparation of hexanoyl ester of capsaicn usp27 ( formula i , r ═ ch 3 —( ch 2 ) 4 ) the compound was prepared essentially as described in example 1 , using n - hexanoyl chloride instead of butyryl chloride . the product was recovered as a low melting viscous yellow oil . preparation of palmitoyl ester of capsaicn usp27 ( formula i , r ═ ch 3 —( ch 2 ) 14 ) the compound was prepared essentially as described in example 1 , using n - palmitoyl chloride instead of butyryl chloride . the product was recovered as a waxy yellow solid . preparation of a topical gel containing butyryl ester of capsaicin usp27 and cetyl myristoleate three compositions of capsaicin butyrate , shown in table 1 , each with a batch size of 500 gm of the gel , were prepared according to the following procedure . three compositions of capsaicin palmitate , shown in table 2 , each with a batch size of 500 gm of the gel , were prepared according to the following procedure . table 3 the composition for the preparation of capsules . ingredient amount i amount ii palmitoyl - capsaicin usp27 5 . 40 parts 10 . 8 parts microcrystalline cellulose 19 . 60 parts 14 . 20 parts cetyl myristoleate powder 350 . 00 parts 350 . 00 parts ( 20 % in corn starch ) ascorbyl palmitate 20 . 00 parts 20 . 00 parts silicon dioxide 2 . 50 parts 2 . 50 parts sodium lauryl sulfate 2 . 50 parts 2 . 50 parts total 400 . 00 parts 400 . 00 parts preparation i : the palmitoyl - capsaicin usp27 ( table 3 ; amount i ) is intensively milled with ten times its weight of cetyl myristoleate powder , the milled mixture is admixed with the remaining amount of the cetyl myristoleate powder , microcrystalline cellulose , ascorbyl palmitate sodium lauryl sulfate and silicon dioxide . the mixed powder is again milled and the composition is filled into 500 mg capsule in a conventional capsule loading machine . each capsule contains 5 . 40 mg of palmitoyl - capsaicin usp27 ( approximately 50 , 000 shu equivalent in each capsule ) and 70 mg of cetyl myristoleate and is an oral dosage unit composition with effective therapeutic action . preparation ii : the palmitoyl - capsaicin - usp27 ( table 3 ; amount ii ) is intensively milled with five times its weight of cetyl myristoleate powder , the milled mixture is admixed with the remaining amount of the cetyl myristoleate powder , microcrystalline cellulose , ascorbyl palmitate , sodium lauryl sulfate and silicon dioxide . the mixed powder is again milled and the composition is filled into 500 mg capsule in a conventional capsule loading machine . each capsule contains 10 . 8 mg of palmitoyl - capsaicin usp27 ( approximately 100 , 000 shu equivalent in each capsule ) and 70 mg of cetyl . myristoleate and is an oral dosage unit composition with effective therapeutic action . a 0 . 5 % of butyryl - capsaicin usp27 and 4 % cetyl myristoleate gel as described in example 4 was applied to the forearm of 10 healthy individuals twice daily for a two - week period in an outpatient clinic . no patients complained of burning , irritation , scaling or redness after the cream . patients returned to the clinic after having used the gel for two weeks for a visual inspection of the forearm area . the examining physician noted no redness , irritation or scaling in the area where the solution had been applied . treatment of pain with the topical formulation of butyryl capsaicin usp27 and cetyl myristoleate a 53 year old hispanic male has developed type 2 diabetes a year ago and has diabetic neuropathy in the feet . he was given the 0 . 5 % butyryl - capsaicin usp27 and 4 % cetyl myristoleate gel and the following is his testimony on the effectiveness of the oil for the treatment of cold sores . “ i was diagnosed with type 2 diabetes last year . i also have neuropathy in my feet . i had an ulcer on my foot and was treated by a local pediatric doctor in san antonio . my ulcer has since been cleared up . i control my diabetic ailment with a low - carb diet only , with no medication . i have also lost 40 lbs . since my diagnosis last year . i however feel pain on the bottom of my feet at times . since taking the cream by application on my feet , i have noticed much less discomfort than usual . the comfort that i noticed has lasted up to 24 hrs per - application . this cream really helps my condition and would like to let your research company to know about your product ”. a 45 year old white male developed constant pain in the finger due to dislocation and has to be injected cortisone every 3 months to alleviate the pain . he was given 1 % butyryl capsaicin usp27 and 4 % cetyl myristoleate gel for topical application . he gave the following testimony about the treatment . “ every 3 months or so , i have a cortisone shot in a finger i dislocated a few years ago . i used the 1 % gel given to me . it did a very good job for the pain and making movement a lot easier . the swelling was reduced as well as the pain . i did however , find that the product does have a tendency to get a little warm . that &# 39 ; s a good thing , other than it still transfers after hand washing , and you might get a little warm where you don &# 39 ; t need it . i feel like this product would be beneficial for people who can not or who would rather not take oral pain medication ” a 40 year old white female developed diabetic neuropathy in 2000 and was given 0 . 5 % butyryl capsaicin and 4 % cetyl myristoleate gel for treating her pain in the feet . she gave the following testimony about the treatment . “ i was diagnosed with neuropathy in 2000 . there never has been much they could do for me other than give me pain medication that &# 39 ; s addictive . at this time , i &# 39 ; m on neurontin 1800 mg a day , vicodin 5 . 6 tablets a day . diclofenac 150 mg a day , and also get injections in my feet . in the last 7 months i have had 5 different cast on my left foot . since my left foot has a cast my right foot has become worse because all of my weight has been on my right foot . i used the crème and within 30 min . i could feel the difference . later i was up walking and realized there was no pain at all . at night i don &# 39 ; t sleep well because of the pain , but i was able to go to sleep the whole night through without cramps and pain . my cast will be coming off in 8 days and i can &# 39 ; t wait to try it on my left foot ”. a 65 year old white female developed pain due to pinched nerve and was treated with the 0 . 5 % butyryl capsaicin usp27 and 4 % cetyl myristoleate gel . she gave the following testimony about the treatment . “ over a period of years , periodically a pinched nerve would occur in the left lower side of my back . this required chiropractic treatment which at times was not always successful requiring several additional treatments . after using the cream , my pain has disappeared and that was three days ago and still no pain ”. a 49 year old white male developed diabetic neuropathy in 2001 and was given 0 . 5 % butyryl capsaicin usp27 and 4 % cetyl myristoleate gel for treating his pain in the feet . he gave the following testimony about the treatment . “ i have diabetic neuropathy brought on by extreme intra - venous application of antibiotics for a six day period . since that time i have experienced unmanageable pain causing sleep depravation , anxiety with no relief on the market . prescriptions for antidepressants were given by my personal physician but to no avail now with this cream i can sleep without any disturbances . nothing on the market today could help me without the use of addicting narcotics that were marginally effective at best ”. a 62 year old white female developed neuropathy in 1975 and was given 0 . 5 % butyryl capsaicin usp27 and 4 % cetyl myristoleate gel for treating her pain in the feet . she gave the following testimony about the treatment . “ my neuropathy numbness in feet and hands first started after back surgery in 1975 my l4 and 5 were fused and some disks removed . the numbness and pain increased after surgery for a double mastectomy which was botched by a doctor inexperienced at this surgery in 1988 causing sever pain in my abdominal muscles and up my chest . in 1992 i was in the hospital for depression a new doctor prescribed percocet medication for my pain . the percocet helped but i had to take 8 a day 5 / 325 mgs with anti depression medication at the time . the pain was so overwhelming after 4 years that i decided one day to end it all and i was found by my husband on the floor . i had kept my pain a secret over the 4 years hoping it would just eventually go away and i had never told my family that i was suffering so much . i had overdosed with the percocet in an attempt to end my pain for good . i recovered some and i tried to cut back on the percocet and got down to 1 a day to prevent addiction . the increase in pain and numbness was causing me to stumble when i walked . a neurologist in 1998 suggested that i try neurontin which is used for epilepsy . i think i was taking 100 mgs 3 times a day at first then increased in 6 weeks to 200 mgs 3 times a day , when that failed we went up to 300 mgs 3 times a day . the 300 mgs was starting to help some but they had to increase to 800 mgs 5 times a day to really help my pain . this helped more than the percocet alone but i still needed to keep the percocet at reduced amounts . i fell and broke my back fusion in 2000 . new back surgery attempted to fuse my back again but in 2003 doctors had to use rods and pins to secure it . with each surgery my numbness and pain would increase . i tried water therapy and various physical therapies but nothing could relieve my pain . i have had other injuries as well , in 2002 a broken right ankle and compression fracture in my right knee and in 2003 i broke my left ankle . in october 2005 a doctor specializing in neurological disorders said the neurontin was probably weakening my bones and switched me to a generic version of the same medication and dropped the dose to 50 mgs a day . my pain increased immediately and i went through withdrawals with the smaller dose . this doctor said if the pain didn &# 39 ; t decrease i was to increase one tablet more a day each week till the end of the 4 th week and return to him . i never went back to this doctor and just increased back to 800 mgs 5 times a day to cope with the pain , burning , and itching feelings . i had to take depression medication again at this time . i tried a new topical cream just this week jul . 11 , 2006 being developed in san antonio , tex . one of my most disruptive symptoms in my feet would cause me to involuntarily jump in bed and i was beginning to feel this come on when i applied the cream to my left foot . the symptoms just stopped ! usually this symptom would last several hours to even days . i have burning sensations in both hands and up my forearm but after applying this cream i had my first relief from that burning feeling since my back surgeries in 2003 ! this cream has done more to relieve my symptoms than both percocet and neurontin has ever done for me ! i now have renewed hope to stop taking all this internal medication that is bound to hurt my liver and is weakening my bones ”.	0
in the recording system of fig1 luminance ( y ) and chroma ( c ) component signals of a color video signal are received at input terminals 10 and 12 respectively and applied to fm modulators 14 and 16 respectively . in addition the y signal is applied to horizontal sync separator 18 . modulators 14 and 16 can have a carrier frequency of , e . g ., 6 mhz and a deviation of 1 mhz . the modulated signals from modulators 14 and 16 are applied to recording amplifiers 20 and 22 respectively , while the sync signal from separator 18 is applied to recording amplifier 24 . the thus amplified signals from amplifiers 20 , 22 , and 24 are respectively applied to recording heads 26 , 28 , and 30 to respectively record y signal track 32 , c signal track 34 and tracking ( t ) signal track 38 on tape 40 . if recording heads 26 and 28 are also used for playback , head set 26 , 28 , 30 , or just heads 26 and 28 may be mounted in known manner on a bimorph , which bimorph is not energized during recording . this recording is achieved by having tape 40 describe a helical path about a rotating drum ( not shown ) and mounting heads 26 , 28 , and 30 within the drum , all as known in the art . since it is difficult to mount head 30 between heads 26 and 28 , it is forwardly displaced therefrom on the drum . in particular , its gap is displaced from the gaps of heads 26 and 28 by a distance of nλ h , wherein n is a positive integer other than zero , and λ h is the recorded wavelength of the horizontal frequency f h on tape 40 . since head velocity errors and tape stretch can cause timing errors between the tracking and the y and c signals , n should be small . further , λ h = v / f h , wherein v = scanning velocity . the selected spacing ensures that upon playback any intermodulation products between the tracking horizontal sync signal and the y or c signals occur during the horizontal blanking portions , when they are not visible . the resulting tape format has a track set 42 having a tracking track 38 completely extending between information tracks 32 and 34 , one similar set 44 of previously recorded tracks is shown . it is noted that no tracking track is disposed between sets 42 and 44 . although not shown in fig1 all tracks have an angle of 2 degrees 34 minutes with respect to the edge of 40 if smpte type - c format is used . the reproducing system is shown in fig2 . tape 40 is again helically displaced around a drum ( not shown ). tracks 32 and 34 induce signals in heads 26 and 28 respectively , which heads are now used for playback and are mounted at the end of bimorph 50 as symbolically indicated by the dotted line . it will be noted that heads 26 and 28 are shown displaced to the left with respect to tracks 32 and 34 , i . e ., there is mistracking . thus head 28 will pick up some of the tracking horizontal pulse signal in track 38 , while head 26 does not pick up the tracking signal . since the heads operate on the rate of change of flux , they cause a differentiation of the tracking pulse ; therefore the result is a dc level shift in the c signal provided by head 28 at the pulse edges of the tracking pulse . since the leading and trailing pulse edges of any given pulse go in opposite directions , the resulting dc level shifts will be in opposite directions . tracking head 30 is unused during reproduction . the signals from heads 26 and 28 are respectively applied to amplifiers 52 and 54 . the output signals from amplifiers 52 and 54 are respectively applied to fm demodulators 56 and 58 and to lpfs ( low pass filters ) 60 and 62 . the output signals from demodulators 56 and 58 respectively comprise baseband y and c signals and are further processed for display as known in the art . lpfs 60 and 62 can have a cutoff frequency of about 200 khz since the tracking signal is the 15 . 73425 khz horizontal sync signal . for other tracking signals , appropriate cutoff frequencies are appropriately chosen . as explained above , during the mistracking illustrated in fig2 head 28 is providing a tracking signal while head 26 is not . thus lpf 62 provides an output signal , while lpf 60 does not . the output signal from lpf 62 is applied to detector 66 , which can comprise a full wave rectifier so as to rectify dc level shifts going both positively and negatively . the rectified output signal from detector 66 is applied to integrator 70 , that produces a smooth dc output signal , which output signal is applied to the non - inverting input of difference amplifier 70 . the inverting input terminal of amplifier 70 receives no signal for the mistracking condition shown in fig2 . the output signal of amplifier 70 is applied to bimorph 50 with such a polarity so as to cause it to bend to the right as viewed in fig2 by a sufficient amount to cause head 28 to no longer provide a tracking signal or for the tracking signals to be equal . therefore proper tracking is obtained in a degenerative feedback manner . it will be readily seen that if a right direction mistracking occurs , head 26 will provide a tracking signal , which will be filtered by lpf 60 , full wave rectified by detector 64 , integrated by integrator 68 and then applied to the inverting input of amplifier 70 . this will cause a leftward bending action of bimorph 50 to achieve proper tracking . it will be appreciated that many other embodiments are possible within the spirit and scope of the invention . for example , more than two information tracks may be simultaneously reproduced . the tracking signal need not comprise the horizontal sync signal and can extend beyond the horizontal blanking period . further , the tracking signal track can partially overlap the information signal track . also , comparator 70 can be eliminated and the integrated signals applied to electrodes on opposite sides of bimorph 50 . still further the luminance and / or chrominance signals can be digital signals . while it is advantageous for the t recording head to precede the y and c recording heads so that the t signal does not overwrite the y and c signals , nevertheless the t recording head may follow and y and c heads . if crosstalk is tolerable , the tracking signal may occur adjacent the information signals , as for example by use of a frequency - divided subcarrier signals as the tracking signals , if the frequency of the tracking signal is outside the passband of the chroma and luminance demodulators . the width of the t track may be less than the width of the information tracks , and the information tracks themselves may be of different widths commensurate with signal - to - noise requirements . also , the width of the t recording head may be wider than the space between the y and c heads . the fm carriers present at the y and c heads , which heads follow the t head during recording , reduce by erasure the width of the t - track to exactly the spacing between the y and c tracks . this reduces accuracy requirements of both the width and lateral position of the t - head .	7
referring to fig2 a field oxide layer 12 is formed on a predetermined portion of a silicon substrate 11 , and an unshown mosfet having a source , a drain and a gate electrode is formed on a predetermined portion of the silicon substrate 11 . thereafter , a first insulating layer 14 is formed on the whole surface of the structure in such a manner that a contact hole 15 is provided for exposing a drain diffusion legion 13 , and a lower plate 16 of the storage electrode contacting the drain diffusion region 13 is formed . an upper plate 25 of the storage electrode is formed over the lower plate 16 of the storage electrode , thereby forming a storage electrode 30 having the lower plate 16 and upper plate 25 which are electrically connected to each other by means of irregularly spaced apart bars 23 having irregular shapes . bars 23 have vertical sidewalls 23a that provide increased surface area . fig3 to 9 are sectional views showing a process for manufacturing the storage electrode according to the present invention . referring to fig3 the field oxide layer 12 is formed on the silicon substrate 11 , and the mosfet ( not shown ) having the source , drain and gate electrode is formed . the first insulating layer 14 , e . g ., an oxide layer , is formed on the whole surface of the structure , and the first insulating layer 14 formed on the drain diffusion region 13 is etched to allow the storage electrode to contact the drain diffusion region 13 of the mosfet , thereby forming the contact hole 15 . then , the first conductive layer 16 for forming the lower plate of the storage electrode is deposited thereon . referring to fig4 a second insulating layer 17 , e . g ., an oxide layer of a predetermined thickness , is formed over the 30 first conductive layer 16 , and a polysilicon layer 18 having a rugged structure on its surface is deposited on the second insulating layer 17 . the polysilicon layer 18 having the rugged structure is obtained such that a polysilicon layer is deposited via a low - pressure chemical vapor deposition ( lpcvd ) by inflowing silane ( sih 4 ) under the state of 50 ˜ 500 mtorr at a temperature of 550 °˜ 600 ° c ., and is annealed in a chamber of nitrogen ( n 2 ) ambient under a pressure of below 200 mtorr for 30 minutes . also , since the thickness of the second insulating layer 17 is the height of the bar formed between the lower and upper plates of storage electrode , the thickness of the second insulating layer 17 should be properly adjusted in accordance with the required area of the storage electrode . referring to fig5 the polysilicon layer 18 having the 10 rugged structure is etched by a predetermined thickness via a dry etch to expose a predetermined upper portion of the second insulating layer 17 , and the polysilicon layer 18 of ridge portions are left . here , the polysilicon layers 18 of the ridge portions remain as islands of various shapes . referring to fig6 the second insulating layer 17 of the exposed portion is etched , using the remaining polysilicon layer 18 of the ridge portion as a mask , thereby forming an insulating layer pattern 19 with bars of various shapes . referring to fig7 a second conductive layer 20 , e . g ., a polysilicon layer having a predetermined thickness , for the upper plate of storage electrode is deposited on the whole surface of the structure , and a photoresist pattern 21 is formed thereon to be used as a storage - electrode mask . alternatively , after performing the process illustrated in fig6 the second conductive layer 20 for the upper plate of storage electrode may be formed after etching the polysilicon 18 of the ridge portions . referring to fig8 the second conductive layer 20 and the polysilicon layer 18 of the ridge portion formed on the second insulating layer pattern 19 is removed , using the photoresist pattern 21 . at this time , while etching the second conductive layer 20 , the etching may be stopped just after the upper surface of the second insulating layer pattern 19 is exposed . referring to fig9 after completely removing a portion having the photoresist pattern 21 thereon or the bar - shaped second insulating layer pattern 19 without the photoresist pattern 21 thereon through a wet etch , the remaining second conductive layer 20 and first conductive layer 16 are etched , using the photoresist pattern 14 as a mask . then , the photoresist pattern 21 is removed to form the storage electrode 30 on the lower plate thereof which is electrically connected to the upper plate via the bar - shaped second conductive layer 20 filling up the portion without the second insulating layer pattern 19 . here , the second insulating layer pattern 19 between the second conductive layer 20 and the first conductive layer 16 is etched from the exposed outer wall thereof by means of an etchant for wet - etching , and then thoroughly removed up to the inner portion . after executing the above - described process , a dielectric layer and a plate electrode are formed on the surface of the storage electrode as in a process of manufacturing a common capacitor . fig1 is a plan view showing the polysilicon layers 18 having the ridge portions remaining on the second insulating layer 17 after carrying out the process illustrated with reference to fig5 . it can be noted that the polysilicon layers 18 of the ridge portions remain as islands of various shapes . according to the present invention as described above , the irregularly spaced - apart bars having irregular shapes and vertical sidewalls are formed between the upper and lower plates of storage electrode , so that the capacity of the capacitor can be increased over that of the conventional tunnel - type storage electrode in the same area . while the present invention has been particularly shown and described with reference to particular embodiments thereof , it will be understood by those skilled in the art that various changes in form and details may be effected therein without departing from the spirit and scope of the invention as defined by the appended claims .	7
refer now to the drawings wherein depicted elements are not necessarily shown to scale and wherein like or similar elements are designated by the same reference numeral through the several views . fig1 is a well schematic of a typical prior art submersible pump system , generally denoted by the numeral 5 . a casing 12 is set in a wellbore formed into the earth 14 and a fluid producing formation 16 . perforations 18 are formed through casing 12 to facilitate the flow of fluid from producing formation 16 into casing 12 . the prior art submersible pump system 5 includes a centrifugal pump 20 and motor assembly 22 . motor assembly 22 includes an electric motor 24 and a motor protector 26 . motor protector 26 equalizes well pressure , prevents well fluid contamination of electric motor 24 and absorbs the thrust load transmitted from pump 20 . electric power is provided to electric motor 24 by an electrical cable ( not shown ). centrifugal pump 20 and motor assembly 22 are coupled to one another co - linearly within casing 12 by tubing 28 . pump 20 is positioned below wellbore fluid level 21 and conveys wellbore fluid 30 via tubing 28 to a storage facility 32 at the surface . fig2 is a well schematic of an embodiment of the non - electric drive submersible pump system of the present invention , generally denoted by the numeral 10 . pump system 10 includes a centrifugal pump 20 and a non - electric drive mechanism 34 . pump 20 and drive mechanism 34 are coupled to one another co - linearly within casing 12 by tubing 28 . drive mechanism 34 is powered by a pressurized fluid . desirably the pressurized fluid is a gas such as , but not limited to , steam , air , nitrogen or natural gas . pressurized gas is supplied to drive mechanism 34 from a surface facility 36 via a supply conduit 40 . the spent pressurized fluid may be returned to the surface via a return conduit 42 for venting , storage and / or recycling . conduits 40 and 42 may be formed by any suitable conduit such as , but not limited to , a seamless , continuous tubing such as coiled tubing . surface facility 36 is described broadly to include any necessary and desired equipment to supply a fluid at the desired pressure , volume and quality and for treatment of the gas returned from drive mechanism 34 . for example , when the pressurized gas is steam , surface facility 36 may include a steam generator and associated water treatment plant . further , in steam injection operations the steam for operating drive mechanism 34 may be slipped from a steam injection line . for receiving the returned steam , surface facility 36 may include storage tanks and / or vent lines . for compressed air , the system may include storage vessels , compressors , pumps , dehydration units and booster stations . similar equipment and facilities may be incorporated for the use of other inert gasses or natural gas available at the well site . it should be recognized that the pressurized fluid returned from drive mechanism 34 may be recycled , recirculated through drive mechanism 34 or vented . as can be seen through fig1 and 2 , the non - electric drive mechanism 34 of the present invention eliminates electric motor 24 , the electrical supply cable , motor protector 26 and the associated drawbacks of the current and prior art electrical submersible pump systems . fig3 provides a partial , cross - sectional view of an embodiment of drive mechanism 34 of the present invention . drive mechanism 34 includes a substantially cylindrical housing 44 and a fan shaft 46 connected to one or more fan sections 48 . fan shaft 46 is operationally connected to the drive shaft of pump 20 ( fig2 ). the top end 44 a is adapted for connecting to pump 20 . fan shaft 46 is mounted within housing 44 via bearings 50 to provide rotating operation and radial support of fan shaft 46 . fan sections 48 are connected along the keyed fan shaft 46 such that fan sections 48 can rotate fan shaft 46 . drive mechanism 34 may include one or more fan sections 48 . as shown in the present example , drive mechanism 34 includes three fan sections 48 a , 48 b , 48 c . fan sections 48 may each comprise a cylindrical blower fan configuration . pressurized fluid is provided to drive mechanism 34 via supply conduit 40 through one or more supply manifolds 64 . supply manifold 64 may include an orifice 66 for passing the pressurized fluid , indicated by arrows 68 , across fans 48 . in the embodiment of fig3 , a supply manifold 64 a , 64 b , 64 c is positioned proximate each fan section 48 a , 48 b , 48 c respectively . flow of pressurized fluid 68 across fan sections 48 rotates fan sections 48 and fan shaft 46 . this rotation is transmitted to connected pump 20 . the speed of rotation of fan sections 48 and fan shaft 46 may be controlled by the volume and / or pressure of fluid 68 . pressurized fluid 68 is removed from housing 44 via one or more exhaust manifolds 70 connected to return conduit 42 . although exhaust manifold 70 is shown in fig3 positioned opposite supply manifolds 64 relative to housing 44 it should be recognized that exhaust manifold 70 may be located in various positions including adjacent supply manifolds 64 , incorporated as a section of supply manifold ( s ) 64 , and at the top and / or bottom end of drive mechanism 34 . drive mechanism 34 may further include a sealed gear box 52 . the rotation of fan sections 48 a , 48 b , 48 c is transmitted to fan shaft 46 to gears 54 to reduce or amplify the rotational speed . the resultant rotational speed of gear train 56 is transmitted to drive shaft 58 . drive shaft 58 may be the shaft of pump 20 ( fig2 ) or coupled to the shaft of pump 20 . gear box 52 is sealed to prevent contamination of the gear oil and avoid premature failure of gears 54 and the bearings . thrust bearings 62 for the pumps may be in connection with drive shaft 58 . a thrust runner 60 may also be coupled with drive shaft 58 . it should be recognized that in various embodiments thrust runner 60 and thrust bearings may be connected to fan shaft 46 , for example when gear box 52 is not incorporated . it should be further recognized that fan shaft 46 is effectively the drive shaft for pump 20 when all elements are coupled . from the foregoing detailed description of specific embodiments of the invention , it should be apparent that a non - electric drive mechanism submersible pump system and more particularly a non - electric drive mechanism for a submersible pump that is novel has been disclosed . although specific embodiments of the invention have been disclosed herein in some detail , this has been done solely for the purposes of describing various features and aspects of the invention , and is not intended to be limiting with respect to the scope of the invention . it is contemplated that various substitutions , alterations , and / or modifications , including but not limited to those implementation variations which may have been suggested herein , may be made to the disclosed embodiments without departing from the spirit and scope of the invention as defined by the appended claims which follow .	5
the apparatus disclosed in fig1 and 2 corresponds to one of the embodiments shown in the aforementioned british application and comprises a coupling member 10 terminating at one end in a tapered shank 12 and at its opposite end in an annular wall 14 having a smooth end surface 16 and defining a cylindrical socket 18 . the wall 14 is provided with a pair of diametrally opposed threaded openings 20 and 22 . fitted into the opening 20 is a threaded fastening plug 24 having at its inner end a conical recess 26 and fitted into the opening 22 is a threaded fastening plug 28 terminating at its inner end in a conical projection or nose 30 . the shank 12 of the coupling member 10 is adapted to be fitted to the spindle ( not shown ) of a machine tool as is conventional . the coupling member also is adapted to be separably joined to a tool holder 32 comprising a body 34 having at one end a reduced diameter extension 36 of such size as snugly , but removably , to be accommodated in the socket 18 of the coupling member . the body 34 has an annular end surface 38 which confronts the surface 16 of the coupling member . the extension 36 has a transverse bore 40 therein in which is slideably accommodated a coupling pin 42 terminating at one end in a conical nose or projection 44 confronting the conical seat 26 and terminating at its other end in an outwardly concave , conical cavity 46 confronting the conical projection 30 . the overall length of the pin 42 is less than the diameter of the socket 18 . to assemble the tool holder 32 and the coupling member 10 , the fastening plugs 24 and 28 are turned to positions in which neither of them projects into the socket 18 , thereby enabling the extension 36 , together with the pin 42 , to be introduced to the socket 18 and positioned therein with the surfaces 16 and 38 engaging one another . the members 10 and 32 then may be rotated so as to align the pin 42 with the threaded openings 20 and 22 , and such positioning is facilitated by a locating pin 48 projecting from the socket wall 14 for accommodation in a socket 50 in the body 34 . the plugs 24 and 28 then may be rotated so as to move inwardly of their respective openings 20 and 22 and cause the conical nose 44 of the pin to seat in the conical recess 26 and the conical nose 30 to seat in the cavity 46 , thereby securely anchoring the tool holder 32 to the coupling member 10 . as is best shown in fig1 the longitudinal axis of the pin 42 and the axis through the conical recesses 26 and 46 are offset axially of the coupling member so that the engagement between the pin 42 and the plugs 24 and 28 causes the surfaces 16 and 38 to be drawn together . a coupling member constructed in accordance with the invention is shown in fig3 and 4 and designated generally by the reference character 52 . the coupling member comprises a body 54 terminating at one end in a tapered shank 56 adapted for removable reception in a socket 57 formed in a conventional machine tool spindle 58 . the opposite end of the body terminates in an annular wall or sleeve 60 forming a socket or bore 62 . the wall 60 has a radially extending , threaded opening 64 therein which communicates with the bore and , diametrally opposite the opening 64 , the inner surface of the bore 62 has an outwardly concave , conical recess 66 therein which is coaxial with the opening 64 and communicates only with the bore 62 . adapted for removable accommodation in the opening 64 is a threaded fastening plug 68 terminating at its inner end in a conical nose or projection 70 . the annular wall 60 is provided with a second threaded opening 72 in communication with the bore 62 for the removable accommodation of a threaded fastening plug 74 . the inner end 75 of the plug 74 is flat or concave so as to correspond to the curvature of the bore 62 . the openings 64 and 72 are not coaxial , but are circumferentially spaced from one another by about 140 °. the wall 60 terminates in a flat end surface 76 in which is formed an aligning bore 78 . fig4 illustrates , as an example of the versatility of the invention , the coupling member 52 coupled to the prior art tool holder 32 shown in fig1 and 2 . as indicated , the conical nose 44 of the pin 42 seats in the outwardly concave recess 66 and the plug 68 has its conical nose 70 seated in the cavity 46 of the pin 42 . the projection 50 on the tool holder 32 is accommodated in the socket 78 of the wall 60 . as disclosed in fig4 the opening 72 is occupied by the plug 74 , but the plug 74 has no function other than to close the opening 72 . the longitudinal axis of the pin 42 may be axially offset from the axis of the opening 64 and the conical seat 66 in the same manner as disclosed earlier . the assembly of the coupling member 52 and the prior art tool holder 32 corresponds to the assembly of the tool holder 32 with the coupling member 10 . the coupling member 52 thus is capable of accommodating the known tool holder 32 , even though there are differences between the known coupling member 10 and the coupling member 52 . the coupling member 52 also is capable of accommodating tool holders having coupling means that ar dissimilar to that of the tool holder 32 . one such tool holder is shown at 80 in fig3 and 5 . the tool holder 80 is similar in all respects to the prior art tool holder 32 except that the tool holder 80 has at one end a reduced diameter extension 82 provided with a pair of diametrally opposed , outwardly concave conical recesses 84 and 86 instead of the bore 42 . the extension 82 also has a third correspondingly shallow conical recess 88 formed therein and peripherally spaced from the recesses 84 and 86 . the recesses 84 , 86 , and 88 are shallow ; i . e ., their depth is much less than the diameter of the extension 82 . the axis of the recess 88 forms an angle of about 140 ° from the axis of the recess 84 . in the embodiment shown in fig3 and 5 the fastening plug 68 has its nose 70 seated in the recess 84 . a fastening plug 90 , corresponding in all respects to the plug 28 , occupies the opening 72 and has its nose 92 seated in the recess 88 . the recesses 86 and 66 are unoccupied . the tool holder 80 has an annular end surface 94 from which an aligning lug 96 extends for accommodation in the socket 78 . as is apparent from the foregoing the construction of the coupling member 52 is such as to enable it to be coupled to either of the two tool holders 32 and 80 , notwithstanding the differences between the coupling means of the tool holders . the tool holder 80 also is constructed in such manner as to enable it to be coupled not only to the coupling member 52 , but also to other coupling members having dissimilar coupling means , one example of which is the coupling member 10 . the coupling of the tool holder 80 to the prior art coupling member 10 is illustrated in fig6 wherein the extension 36 is accommodated in the socket 62 with the aligning pin 96 in the socket 78 . the fastening plug 28 occupies the opening 22 and has its nose 30 seated in the recess 86 . the plug 68 ( or one corresponding thereto ) occupies the opening 20 and has its nose 70 seated in the recess 84 . the recess 88 is unoccupied . the ability of a single coupling member to be fitted to tool holders having dissimilar coupling means and the ability of a single tool holder to be fitted to coupling members having dissimilar coupling means make possible the interchanging of tool holders and coupling members that heretofore were required to be used in paired sets only . the avoidance of having to use such paired sets enables significant economies to be realized . the disclosed embodiment is representative of the preferred form of the invention , but is intended to be illustrative rather than definitive thereof . the invention is defined in the claims .	8
the invention is described with reference to the drawing wherein numerals in the written description correspond to like - numbered elements in the figures . the drawing discloses a preferred embodiment of the invention and is not intended to limit the generally broad scope of the invention as set forth in the claims . reference is made to fig1 in which the horizontal and vertical axes are labeled x and y . this is a side view so the z - axis is not seen in this view as it is seen in fig3 . an osprey v - 22 tilt rotor aircraft 10 is in transition from vertical flight to horizontal flight . transition is accomplished by means of aircraft engine 11 which drives propellers 11 a and is tilted to provide propulsion in a direction indicated by arrow 11 b . arrow 11 b includes components along both the horizontal x - axis and the vertical y - axis . forward is labeled fwd and aft is labeled aft on aircraft 10 . the forward and aft labeling also extends to the load suspension apparatus 14 and to the load 12 . the reported suspended cargo carrying capacity for the osprey v - 22 is 10 , 000 to 15 , 000 pounds . an external cargo load suspended beneath a tilt rotor aircraft or a helicopter is susceptible to aerodynamic instability . this instability can be transmitted through the cargo suspension apparatus to the aircraft . the cargo suspension apparatus of the invention allows for aerodynamic movement of the cargo and compensation for that movement with v - shaped slings . dynamic moments are opposed and compensated in the suspension apparatus with reduced transmission of dynamic moments to the aircraft . packaged cargo load 12 is suspended from aircraft 10 by a load suspension apparatus 14 attached to the underside 16 of the aircraft fuselage 18 . load suspension apparatus 14 is joined to aircraft 10 by means of aircraft attachment slings 32 and 35 . the osprey v - 22 aircraft is exemplary of an aircraft that is sensitive to destabilizing by a suspended cargo load and therefore benefits from use of the cargo suspension frame of the invention . the invention was discovered while investigating stable suspension systems for the osprey v - 22 tilt rotor aircraft and its use with this aircraft is the best mode contemplated by the inventors . because of the enhanced load stability , use with an aircraft such as a helicopter will also enhance load stability . military aircraft ordinarily have structurally strengthened hard points in the airframe or attached to the airframe for the attachment of external loads and for ground and shipboard tie down . a hard point can be configured to mount a hook for releasable fastening of a cargo cable , cargo net , cargo sling and the like . helicopters and the v - 22 osprey aircraft have structurally strengthened hard points spaced forward and aft on the underside of the fuselage . the invention requires at least four spaced , structurally strengthened hard points . the v - 22 osprey has tie - down points attached to the airframe on the underside of the fuselage . these tie - down points are structurally strengthened hard points and are useful for attachment of the cargo suspension apparatus of the invention . helicopters also have similar tie - down points . in fig2 , load suspension apparatus 14 has an upper rigid frame 20 of rectangular configuration shown horizontally positioned just below the fuselage underside 16 . also associated with the load suspension apparatus 14 is a lower rigid frame 20 a of a similar rectangular geometrical configuration but of smaller dimensions . a lower rigid frame 20 a is shown positioned horizontally below the upper rigid frame 20 . frame 20 and frame 20 a share the general forward ( fwd ) and aft ( aft ) orientation of aircraft 10 . the forward end is defined by forward end bar 28 and forward end bar 28 a . the aft end is defined by aft end bar 30 and aft end bar 30 a . upper rigid frame 20 is formed from a pair of parallel spaced side bars 22 connected by a forward end bar 28 and an aft end bar 30 . the side bars 22 are attached to forward end bar 28 at attachment point 28 x and at opposing attachment point 28 y . the side bars 22 are attached to aft end bar 30 at attachment point 30 x and at opposing attachment point 30 y . lower rigid frame 20 a is formed from a pair of parallel spaced side bars 22 a connected by a forward end bar 28 a and an aft end bar 30 a . the lower side bars 22 a are attached to forward end bar 28 a at attachment point 28 ax and at opposing attachment point 28 ay . the side bars 22 a are attached to aft end bar 30 a at attachment point 30 ax and at opposing attachment point 30 ay . in fig2 it is clear that frame 20 and frame 20 a are geometrically similar . frame 20 a has smaller dimensions . smaller dimensions means that side bars 22 a are shorter than side bars 22 . in the alternative smaller dimensions means that forward end bar 28 a and aft end bar 30 a are shorter than forward end bar 28 and aft end bar 30 . in another alternative , smaller dimensions means that each of 22 a , 28 a and 30 a is shorter than the corresponding 22 , 28 and 30 as shown in fig2 . the lower frame 22 a forms the top of a cargo holder within which the load 12 is contained as shown in fig1 . the v - 22 osprey aircraft external fuselage length is about 57 . 33 feet and width is about 84 . 6 feet . typical dimensions for the load suspension frame of the invention for use with this aircraft are as follows : a . side bar 22 is 18 to 22 feet b . side bar 22 a is 16 feet ( for a howitzer or humvee high mobility multipurpose vehicle ) c . side bar 22 a is 20 feet ( for a cargo container ) d . forward end bar 28 is 8 to 10 feet e . forward end bar 28 a is 6 to 8 feet f . aft end bar 30 is 8 to 10 feet g . aft end bar 30 a is 6 to 8 feet h . preferred ratio of side bar 22 : forward end bar 28 is 2 . 1 : 1 i . preferred ratio of side bar 22 : side bar 22 a is 1 . 1 : 1 j . preferred ratio of forward end bar 28 : forward end bar 28 a is 1 . 1 : 1 k . distance between frame 20 and frame 20 a is 4 to 6 feet l . distance between frame 20 and aircraft underside 16 is 2 to 4 feet m . distance between forward and aft attachment points on aircraft is 26 to 27 feet n . distance between lateral attachment points on aircraft is dimensions for use with another aircraft are scaled according to the dimensions of the available hard points . a cargo holder may be attached to lower frame 20 a . in the alternative , lower frame 20 a may be integrally connected with a cargo container . in another alternative , an aerodynamically irregularly shaped load such a vehicle can be attached to lower frame 20 a with cargo straps . the optimum stability of the cargo suspension frame is achieved by limiting cargo load to dimensions less than the dimensions of the aircraft structurally strengthened hard points . materials of construction for cargo suspension frames is well known in the industry . aircraft aluminum or aerospace aluminum usually refers to 7075 aluminum , a zinc and copper alloy . aircraft aluminum also includes 6061 aluminum 6063 aluminum , 2024 aluminum and 5052 aluminum . frames are made of aircraft specification aluminum alloy brackets or tubing . the bracket or tubing material is selected to carry the weight lifted with an allowance for safety . in fig3 , three orthogonal axes are labeled x , y and z . these axes are consistent with the axes shown in fig1 and consistent with the forward ( fwd ) and aft ( aft ) labeling . in fig3 and fig4 , an elongated aircraft attachment sling 32 is mounted on the forward and aft frame end bars 28 and 30 . elongated aircraft sling 32 has a slot 34 at the upper end for reception of a hook 36 attached to a hard point on the underside 16 of aircraft 10 . elongated aircraft slings 35 are also mounted on the frame side bars 22 . each of the elongated aircraft slings 35 has a slot 34 formed in the upper end thereof for reception of a hook 36 on hook attachment bracket 38 connected by a bolt 39 to a hard point on the fuselage underside 16 . attached to the aircraft frame are four spaced structurally strengthened hard points on the fuselage underside 16 , including hook attachment brackets 38 , respectively attached to the aircraft 10 for suspension of frame 20 from the fuselage underside 16 at four locations established by the elongated aircraft slings 32 and 35 . as described above , the suspension apparatus 14 includes a lower rigid frame 20 a of a similar rectangular geometrical configuration as the upper frame 20 but of smaller dimension . that is , the corresponding members of the rectangle are shorter . lower rigid frame 20 a includes forward end bar 28 a , aft end bar 30 a and two side bars 22 a . upper rigid frame 20 includes forward end bar 28 , aft end bar 30 and two side bars 22 . the term v - shaped sling means a sling having three attachment points the three attachment points correspond with the three vertexes of a triangle . sling material usually comprises only two legs of a triangle . a third leg , as seen in fig3 need not be present . although the third leg is not present , the slings may be referred to as triangulated slings . because of the three attachment points , the visual impression is of a v - shaped or triangulated sling . in the alternative , the v - shaped sling can include the three legs of a triangle . v - shaped slings 40 , 42 , 44 and 46 are attached at a forward end to one of two corner attachment points on the upper frame 20 and at an aft end to a diagonal corner attachment point on the upper frame . the v - shaped sling is also attached at an intermediate point to the lower frame at one of two points . one point is on the same end and the opposing side on the lower frame . the other intermediate point on the lower frame is on the opposite end and non - opposing side . the lower frame 22 a is suspended from the upper frame 20 by a minimum of four flexible v - shaped slings . the v - shaped slings are connected as follows : ( a .) v - shaped sling 40 is attached at a forward end to attachment point 28 x , at an intermediate point to attachment point 28 ay and at an aft end to attachment point 30 y . ( b .) v - shaped sling 42 is attached at a forward end to attachment point 28 y , at an intermediate point to attachment point 28 ax and at an aft end to attachment point 30 x . ( c .) v - shaped sling 44 is attached at a forward end to attachment point 28 y , at an intermediate point to attachment point 30 ay and at an aft end to attachment point 30 x . ( d .) v - shaped sling 46 is attached at a forward end to attachment point 28 x , at an intermediate point to attachment point 30 ax and at an aft end to attachment point 30 y . each attachment point on the upper frame is connected to its diagonal attachment point on the upper frame with two v - shaped slings . each of the two v - shaped slings transits the load suspension apparatus 14 differently . one transit by the sling is by diagonal intermediate attachment at the same end to the opposing attachment point on the lower frame end bar . the other transit is by intermediate attachment at the opposite end to the non - opposing attachment point on the lower frame end bar . both transits form a diagonal from the upper frame to the lower frame . the result is a series of diagonal crossings between the upper frame and the lower frame . the diagonal crossings form triangles . the crossed v - shaped slings dynamically stabilize suspended loads from lateral forces in all lateral directions . inverted v - shaped slings are functionally equivalent . by virtue of the foregoing described light weight arrangement of the load suspension device 14 , increased restraint and stability is provided for the cargo load 12 . the upper rectangular frame 20 enables use of distributed structurally strengthened hard points for suspension by the aircraft attachment slings 32 and 35 from the fuselage underside 16 , while the attachments of the v - shaped slings 40 , 42 , 44 and 46 at the opposite frame ends 24 and 26 provides for enhanced stabilized suspension of the load 12 therebelow . furthermore , the configuration of the load suspension apparatus 14 allows for normal operation of the aircraft 10 when no load is attached . also , the sling attachments including hook 36 and attachment bracket 38 on the aircraft underside allow jettisoned release of the suspension slings . materials of construction of aircraft cargo slings are well known in the industry . slings are made of nylon and polyester web material in widths of 1 inch to 12 inches , typically 1 inch to 6 inches . the slings have strength in the range of 7500 lb / inch to 9800 lb / inch ( mil - w - 4088 / mil - w - 27265 ). materials are sold under trade names including nomex ®, vectran ®, cordura ®, kevlar ® and spectra ®. in the alternative , aircraft attachment slings 32 and 35 and v - shaped slings 40 , 42 , 44 and 46 may be made from conventional aircraft cargo slings , cables or ropes . means for attaching cargo slings to aluminum frames are well known and commercially available . the structurally strengthened hard points on the aircraft are equipped with releasable cargo hooks for air drop of a load . hooks are attached to the elongated aircraft attachment slings through a slot in the cargo sling . the slot is reinforced with sewing to form an eyelet . the slot may further be reinforced with metal or plastic inserts . the term hard point attachment means is intended to include hooks and all functional equivalents such as clips , eyelets and the like . the aircraft attachment slings and the v - shaped slings are fabricated by a sewing to form a sewn connection loop . other connectors including buckles , latches , and swiveling connectors are available for use with cargo slings . according to other embodiments of the invention , the rectangular configuration of the upper and lower frames 20 and 20 a may be replaced , for example , by circular , elliptical or greater than four - sided polygonal configurations . the foregoing discussion discloses and describes embodiments of the invention by way of example . one skilled in the art will readily recognize from this discussion , that various changes , modifications and variations can be made therein without departing from the spirit and scope of the invention as defined in the following claims .	1
referring to fig1 in its most general implementation , the inventive apparatus 10 to imparts to color photographic media and in particular color photographic paper a means of copyright protection . apparatus 10 is comprised of a printhead 12 , drum 14 , encoder 16 , electronic controller 18 . printhead 12 is comprised of a linear array of light sources 20 , aperture mask 28 , and lens array 32 . the linear array of light sources is composed of spaced , light emitting sources 22 such as inorganic or organic light - emitting diodes ( leds ) or laser diodes , that emit predominantly blue light in the range of wavelengths from 400 to 500 nanometers . the light emitting sources 22 are mounted on a ceramic or appropriate heat sink 24 which in turn is mounted on to a rigid metal base mount 26 . each of the light emitting sources 22 are separated from each adjacent source by at least 0 . 5 mm and preferably 1 mm . each light emitting source has a maximum linear dimension of 0 . 3 mm , and preferably less than 0 . 2 mm . as shown in more detail in fig2 the light from each light source 22 illuminates an appropriate aperture 30 , in aperture mask 28 , placed over each light source 22 . the illuminated aperture is then imaged by a lens array 32 to a light sensitive media 40 . in the preferred embodiment , lens array 32 is a gradient - index rod lens array 33 sold under the trademark selfoc ™, made by nsg america . in an alternate embodiment lens array 32 is a microlens array 35 of the type shown in fig3 . each aperture 30 in the aperture mask 28 is used to restrict the area of the emitted light that is being imaged onto the light sensitive media 40 so as to form a microspot 34 of focused light of a desired size on the media 40 . each aperture 30 is separated from each adjacent aperture by at least 0 . 5 mm and preferably 1 mm . each aperture has a maximum linear dimension of 0 . 2 mm , and preferably less than 0 . 1 mm . a center of each aperture in the aperture mask is aligned coaxially with a center of each light source . after chemical processing of the exposed media , a colored microdot is formed in the color photographic media . aperture mask 28 is separated from the linear array of light sources 20 by a gap 46 shown in fig1 - 3 . in the preferred embodiment gap 46 is at least 0 . 1 mm . gap 46 provides a reduction in the angle subtended 48 by the light passing through the aperture , thereby reducing the working numerical aperture of the imaging optics to provide a sharper image with less flare and increased depth - of - focus than would otherwise be possible . also , the aperture mask may be coated with a filter material 42 that provides spectral filtration to block unwanted wavelengths of light . filter material 42 may be placed anywhere between light sources 22 and the lens array 32 . in one embodiment filter material is a multi - layer , dielectric , interference filter , and is coated on one surface of aperture mask 28 . the separation of the light emitting sources 22 , and the concomitant separation of the apertures 30 , determines the spacing between the microspots 34 of blue light in a transverse direction i . e . across the width of the media 40 . to control the precise placement of microspots 34 in a longitudinal direction , a high resolution encoder 16 is mounted on drum 14 . the drum 14 transports media 40 . encoder pulses are counted by electronic controller 18 to generate electrical timing signals necessary to pulse the linear array of light sources 20 at a precise pulse duration at precise intervals of time . for a given radiant power emitted by the light sources 22 , the duration of the pulse ( the time that the light source is on ) is variable to obtain a desired exposure on the photographic media . the encoder 16 provides precise timing pulses irrespective of any media flutter , which enables precise location of the microdots at a desired pitch in the longitudinal direction . in some embodiments , it is desirable to keep the pitch of the microspots along the transverse and longitudinal directions the same . by controlling the light pulse duration , the radiant power output from the light emitting sources 22 , and the size of the aperture 30 , the size and intensity of the microspot is controlled . the resulting controlled exposure received by the photographic media results in a two - dimensional array of microspots of desired size and exposure to the media . after chemical processing of the media there is formed in the media colored microdots of the desired size , spacing , and optical density . one of the important attributes of the present invention is the precise placement of the microspots of focused light onto the media . after exposure and chemical processing of silver halide photosensitive media , an image subsequently recorded by an end user will contain microdots of the same spacing . this photographic print is rendered copy restrictive . when an unauthorized attempt is made to copy the print using a copy machine , for example , a digital printing station , a detection means identifies the unique pattern of microdots and prevents operation of the copy machine . an important aspect of this detection means is the performance of a fourier transform to identify the spatial frequency or frequencies of the two - dimensional pattern . without accurate positioning of the microspots of light onto the media with adequate precision and repeatability of location , as well as maintaining a constant radiant energy for all microspots for all exposed media , it would be far more difficult to develop a robust software algorithm having a high probability of detecting a pattern that identifies the media as copy restrictive when this pattern is accompanied by a complex scene imparted to the media by the end user such as a photograph . another important aspect of the present invention is maintaining an equal radiant energy to the media for all microspots . in the preferred embodiment employing leds , an aperture mask , and a selfoc ™ array , it is necessary to adjust the applied voltage to each led in order to obtain an equal energy exposing the media this is due in part to variations in the operating characteristics from one led to another , variation in the open area of the apertures from one aperture to another , and a variation in the brightness of the selfoc ™ image when the position of each micro - light source varies with respect to the spatial arrangement of the gradient - index rod lenses in the selfoc ™ linear array . another important feature of the present invention is the exposure of the media with a sparse array of microspots covering typically less than 1 % of the surface area . this is necessary to prevent an increase in the minimum optical density of the media . therefore , the duty cycle of the light sources , that is , the fraction of the time the light source is on and exposing the media is very low , typically less than 5 %. this low duty cycle provides extended operating life for the leds or laser diodes . fig4 shows an alternate embodiment of an apparatus for creating copy restrictive media comprising a collimated light source 50 , focused to a light modulator 54 , recollimated to a light distributor 58 , which distributes light to multiple optical fibers 60 . the distal ends of the optical fibers 60 are aligned into a widely spaced linear array at a common plane . light from the distal end of each of the optical fibers 60 is focused by a lens 62 . a dammann filter 64 positioned adjacent to each lens 62 forms at least two microspots 66 along a line transverse to a direction of travel of the media 40 . encoder 16 and electronic controller 18 function as described above . fig5 shows another embodiment of an apparatus for creating copy restrictive media comprising a collimated light source 50 , focused to a light modulator 54 , recollimated to a light distributor 58 , which distributes light to multiple optical fibers 60 . the distal ends of the optical fibers 60 are aligned into a widely spaced linear array at a common plane . light from the distal end of each of the optical fibers 60 is focused by a lens 62 to the media 40 to form a microspot 66 along a line transverse to the direction of travel of the media 40 . encoder 16 and electronic controller 18 function as described above . fig6 shows yet another embodiment of an apparatus for creating copy restrictive media comprising a collimated light source 50 , focused to a light modulator 54 , recollimated by a lens 56 . the collimated beam is scanned across media 40 by rotating polygon 70 . an f - theta lens 74 , located between polygon 70 and media 40 , focuses the scanning beam to microspots 66 in a direction transverse to the direction of travel of the media . driver 72 rotates polygon 70 . encoder 16 and electronic controller 18 function as described above . referring to fig7 a series of microdot patterns 80 , 82 , and 84 are shown produced by an led apparatus such as shown in fig1 . each of the specific patterns are produced by writing a unique sequence of pulses from selected leds . the microdot pattern 80 was formed by turning off leds at columns 2 , 6 , and 10 ; in line 3 and line 5 . this microdot pattern would then be repeated after line 8 . the microdot pattern produced in 82 is achieved by not exposing columns 2 , 6 and 10 . the microdot pattern in 84 is produced by turning off leds in a staggered sequence , for example column 3 in line 3 , column 4 in line 4 , etc . each of these unique microdot patterns would be placed on photograph paper sold to a particular customer , and only that customer would be given the key code to unlock copy machines to copy a photograph produced on that paper . referring to fig8 another series of microdot patterns 86 , 88 , and 90 are shown . these microdot patterns are produced by a collimated light source , such as the apparatus shown in fig4 - 6 and show some of the microdot patterns that may be produced by writing a unique sequence of pulses from the modulated light source . the arrows show the direction of travel of the media . the microdot pattern in 86 has every fourth row deleted , the pattern in 88 has every other row deleted , and the pattern in 90 has every seventh row deleted . in a similar manner , fig9 shows additional microdot patterns . microdot pattern 92 has alternate microdots in odd number rows and no microdots in even numbered rows . microdot pattern 94 is a hexagonal pattern . microdot pattern 96 illustrates an alternating pattern of two rows of regularly spaced microdots and two rows of microdots in which alternate microdots are missing . microdot pattern 98 has regularly spaced microdots in even numbered rows and a one on , one off spacing in odd numbered rows . in the preferred embodiment of the invention , the microdot pattern is formed to produce a fourier transform when scanned . this makes detection of the microdot pattern by a software algorithm easier than using other systems . a unique key code to unlock copy machines is assigned to customers . thus customers using photographic paper with a microdot pattern matching the key code will be able to copy photographs made on that paper , but other individuals will not be able to make copies . the invention has been described in detail with particular reference to certain preferred embodiments thereof , but it will be understood that variations and modifications can be effected within the spirit and scope of the invention .	7
referring now in detail to the drawing figures , wherein like reference numerals represent like parts throughout the several views , the present invention is a food press with variable grate configurations , each grate configuration having a different grate configuration , as shown in fig1 - 15 . the present food press provides the user with the ability to compress a food article , and upon selection of a grate configuration , extrude variable amounts of juice and / or variable sized / shaped segments of the food article . in a preferred embodiment , the present invention is a garlic press for compressing a clove of garlic , and upon user selection , extruding variable amounts of juice or slices of garlic . the traditional garlic press comprises only one grate configuration through which the user squeezes a clove of garlic to produce juice . the present invention provides the option of multiple grate configurations , which can be conveniently located under the plunger upon sliding a cartridge with multiple grate configurations . the desired grate configuration of the cartridge slides in a body cavity of the lower arm of the press , and then is securedly located in place by means of a stopper / locator notch . the present invention can be made of various materials , including plastics and metal . in a preferred embodiment , the press is formed of a material , or combination of materials , that are both dishwasher safe , and that can resist the force and pressure of squeezing a food item . the present invention should further be sized within the generally - accepted range of hand tools and kitchen gadgets . the present garlic press 10 is shown in an open state ( fig1 a ), and a closed state ( fig1 b ), and comprises a body 20 having an upper portion 22 pivotally connected to a lower portion 24 , a pressing plunger assembly 30 , and a grate assembly 40 . the present garlic press 10 can be utilized to provide a variety of crush , squeeze , peel , and / or grate operations for various food items , such as garlic , onions , and the like . upper and lower portions 22 , 24 may also be referred to as hand - manipulatable upper and lower arms 22 , 24 . each arm has a forward end and a rear end , and the arms 22 , 24 are pivotally connected at their respective forward ends at pivot point 26 . the arms 22 , 24 can be formed of molded metal ( preferred ) or molded plastic . in one embodiment , the arms are formed cast zinc alloy . as an alternative to cast zinc alloy , other materials typically used in the manufacture of cutlery , such as , stainless steel , aluminum , aluminum alloys , steel alloys , or other metals or alloys , may be used . the upper arm 22 is preferably of uniform u - shaped cross section along a majority of its length , having a closed rear end 22 r , and pivotally attached at its front end to the lower arm 24 via the pivot point 26 , preferably comprising a pin / rod extending through the front end of the upper arm 22 , the pin / rod being mountable in cooperating apertures on either side of the inner surface of the front end of the lower arm 24 . the lower arm 24 also is preferably of uniform u - shaped cross section along a majority of its length , having a closed rear end 24 r , and pivotally attached at its front end to the upper arm 22 via the pivot point 26 . the front end 24 f of the lower arm is provided with an insert recess 46 , which is cooperative shaped with the slidable insert 42 of the grate assembly 40 , so as to facilitate the slidable control of the insert 42 into , and out of , the lower arm 24 of the present press 10 . along the length of the body 20 , in closer proximity to the forward end than the rear end is the pressing plunger assembly 30 , comprising a pivotally mounted plunger 32 mounted on the upper arm 22 at pivot point 34 , and a pressing chamber 36 of the lower arm 24 . the pressing plunger 32 preferably has a base surface ( contacting the compressed food item ) corresponding to the cross - sectional surface of the chamber 36 . the garlic press 10 further comprises the grate assembly 40 , which in essence , provides the “ bottom ” or “ floor ” of the pressing chamber 36 . the present invention enables a user to select the type of crush and juice flow by choosing from a variety of pressing chamber 36 “ floors ”, being grate configurations 44 of the grate assembly . when a food item is positioned in the pressing chamber 36 , and the arms 22 , 24 brought together , the plunger 32 begins squeezing the food item between the base surface of the plunger 32 and the floor of the chamber 36 . fluid is extruded from the food item , which exits through the apertures of the grate configurations 44 of the grate assembly 40 , and since the configuration of the floor of the chamber 36 is variable , the user has control of the device not previously provided for in the art . in a preferred embodiment , the grate assembly 40 is a slidable insert 42 , slideable along the length of the lower arm 24 , the insert 42 provided with at least two , and more preferably a plurality , of grate configurations 44 . the slideable insert 42 is capable of sliding into the lower arm 24 via the insert recess 46 of the front end 24 f of the lower arm . the front end of the insert 42 is provided with a pull 48 , enabling relatively easy slideability to the insert 42 into and out of the lower arm 24 . the grate configurations 44 provide a plurality of different opening configurations , including a variance in the types of openings , number of openings , etc . the insert 42 of the figs . illustrates but one example , that being an insert 42 having four ( 4 ) grate configurations 44 . the present press 10 is provided with one of a variety of grate configurations by changing the orientation of the insert 42 relative the arm 24 . a particular choice of grate configuration is releasably secured by a securing assembly 50 , which in a preferred embodiment can be a combination stopper / locator notch assembly 52 formed of a stopper 54 on the insert 42 , and a notch 56 in the arm 24 , which cooperatively work together to releasably secure a chosen grate configurations 44 in place . the grate configuration 44 in one embodiment can include uniformly - shaped apertures through the entirety of the insert 42 . in another embodiment , the apertures can be frusto - conical in shape with a taper from a smaller diameter at the top surface to a larger diameter at the bottom surface of the insert . this minimizes clogging of the holes and facilitates machining of the plate during manufacture . in other embodiments , the apertures can be holes , oval shaped , square , round triangular , rectangular , odd shaped , and combinations thereof . although certain embodiments of a garlic press have been described herein in accordance with the teachings of the present disclosure , the scope of coverage of this patent is not limited thereto . on the contrary , this patent covers all embodiments of the teachings of the disclosure that fairly fall within the scope of permissible equivalents . numerous characteristics and advantages have been set forth in the foregoing description , together with details of structure and function . while the invention has been disclosed in several forms , it will be apparent to those skilled in the art that many modifications , additions , and deletions , especially in matters of shape , size , and arrangement of parts , can be made therein without departing from the spirit and scope of the invention and its equivalents as set forth in the following claims . therefore , other modifications or embodiments as may be suggested by the teachings herein are particularly reserved as they fall within the breadth and scope of the claims here appended .	0
this invention relates to solid - phase peptide synthesis of short adhesive peptides based on a mixture of hydrophobic and β - sheet stacking interactions . in one embodiment , the peptide adhesive comprises a hydrophobic segment promoting rapid aggregation . in another embodiment , the peptide adhesive forms a network of interlocking strands . the present invention contemplates designing protein adhesives at the peptide level that may be useful to design chemical reaction pathways of commercial proteins to improve adhesive performance . in another embodiment , peptide adhesives , via gelling properties , have potential application in pharmaceutical or medical area . in comparison to the embodiments described herein , the adhesive strength of a native soy protein based adhesives for plywood is in the range of 3 . 5 - 4 . 5 mpa for dry strength and 0 . 5 mpa for wet strength ( huang and sun , 2000a , b ). modified soy protein adhesive on wood has about 6 mpa dry strength and 3 . 5 mpa wet strength ( sun et al . 2004 ), which is comparable to formaldehyde - based adhesives commonly used for wood products . the present invention contemplates novel peptide embodiments comprising from between 9 to 37 amino acid residues in length designed to include a nine - residue hydrophobic core flivigsii ( h 9 ) ( seq id no : 2 ) flivi ( h 5n ) ( seq id no : 16 ) or igsii ( h 5c ) ( seq id no : 17 ). in one embodiment , these peptides are derived from the full length ivs3 transmembrane segment from the human skeletal dihydropyridine - sensitive calcium channel that forms insoluble aggregates during freeze - drying ( grove et al ., 1993 ). in one embodiment , the 9 - residue ivs3 hydrophobic core comprises tripeptides including , but not limited to , lysine residues ( k 3 ) or glutamic acid residues ( e 3 ) yielding , for example , the sequences denoted as e 3 h 9 e 3 or k 3 h 9 k 3 ( see , table 1 ). although it is not necessary to understand the mechanism of an invention , it is believed that the l - lysines improve peptide solubility by adding positive charge to the peptide at neutral ph and serve as hydrophobic residues at elevated ph . in one embodiment , a peptide adhesive comprises an amino acid sequence containing the shortened lysine analog , 2 , 3 - diaminopropionic acid ( x 3 h 9 x 3 ). in one embodiment , the lysine &# 39 ; s r - group reduces hydrophobicity at approximately ph 12 . in another embodiment , the peptide comprises two zwitterionic amino acid sequences containing both e and k including , but not limited to , e 3 h 9 k 3 and k 3 h 9 e 3 . in another embodiment , peptide adhesives comprise k 3 h 9 k 3 h 9 k 3 , including , but not limited to , ( k 3 h 9 ) 2 k 3 ( seq id no : 11 ) and ( k 3 h 9 ) 3 k 3 containing di - and tri - repeats of the k 3 h 9 sequence motifs . at the ph extremes , it is believed that these peptide adhesives have different mean residue hydrophobicities due to the different ionization state of the e 3 and k 3 or x 3 tripeptide segments . also , depending on whether these segments are located at the c - or n - terminus , the pka values for the α - carboxyl or α - amino groups might be altered . although it is not necessary to understand the mechanism of an invention , it is believed that if like residues are clustered , the pka &# 39 ; s of the terminal α - carboxyl or α - amino groups ( i . e . nh 2 - kkk or eee - coo ) will be shifted toward ph extremes while if unlike residues are clustered ( i . e . nh 2 - eee or kkk - coo ), the pka &# 39 ; s of the terminal α - carboxyl or α - amino groups will be shifted toward neutral ph . the mean hydrophobicities ( δg ave ) and net charges of the test sequences at ph 2 . 2 , 6 . 8 and 12 . 0 are shown in table 2 . table 2 presents the net charge and mean residue hydrophobicity ( δg ave in kcal / mol ) for several peptide embodiments at the different test ph values . the δg ave = σδg residue / residue number . δg residue values are taken from modified wimley - white scale ( jayasinghe et al ., 2001 ). although it is not necessary to understand the mechanism of an invention , it is believed that net charge and mean residue hydrophobicity change significantly as a function of ph values . in one embodiment , peptide adhesives comprise an altered adhesive strength at different ph values . hydrophobicity may be modified by the composition and size of acyl side chains . many amino acids comprise acyl side chains , including , but not limited to , lysine , leucine or isoleucine . the acyl side chain of the lysine contains the same number of carbons as the side chains of leucine and isoleucine . the lysine chain is linear while leucine and isoleucine are branched . the linear structure of the lysine acyl side chain would be expected to be more hydrophobic than either of leucine or isoleucine . however , the presence of the uncharged primary amine , with its partially polarizable lone pair of electrons on nitrogen and hydrogens , would generate a dipole thus decreasing the overall hydrophobicity of the amino acid . since there are no published values for the hydrophobicity of lysine at ph 12 . 0 the value for leucine was selected . based on the modified wimley - white scale ( jayasinghe et al ., 2001 ), the 2 , 3 - diaminopropionic acid residue , with its ch 2 — nh 2 side chain , should possess a δg residue value intermediate to that of alanine (— ch 3 ; − 0 . 5 kcal / mole ) and valine (— ch —( ch 3 ) 2 ; 0 . 46 kcal / mole ). taking into account the electron rich lysine nitrogen atom , at ph 12 lysine might be expected to have a value of approximately − 0 . 1 kcal / mole . in a similar manner , the hydrophobicity value of glutamine was used for glutamic acid at low ph levels . of particular note , large changes in both charge and hydrophobicity are seen for the peptides that have cationic sequences at both termini . at ph 2 . 2 , the k 3 h 9 k 3 and x 3 h 9 x 3 sequences , have a net positive charge of nearly + 7 , while at high ph the peptides charges are − 1 . at these high ph levels , the lysines and 2 , 3 - diaminopropionic acids containing peptides become significantly more hydrophobic . the peptides k 3 h 9 k 3 and x 3 h 9 x 3 at high ph have calculated mean residue hydrophobicities of 1 . 03 and 0 . 66 kcal / mole , respectively . the x 3 h 9 x 3 peptide has a lower mean residue hydrophobicity that is intermediate to that of the lysine and the glutamic acid adducted k 3 h 9 k 3 and the e 3 h 9 e 3 sequences . in one embodiment , the aforementioned flivigsii ( seq id no : 2 ) hydrophobic core , linked to the three lysine residues ( k 3 h 9 k 3 ), was used as a departure point for the alteration of the hydrophobic core length . that is to say , in select embodiments , new peptides with a hydrophobic core of 5 , 7 , 11 , and 12 amino acid residues in length were designed and synthesized ( as shown in fig1 ). these core peptides were then flanked by tripeptides of lysine . to increase the length of hydrophobic core , two hydrophobic amino acid ( valine and phenylalanine ) or three hydrophobic amino acids ( valine , isoleucine , and leucine ) were incorporated to the nine - amino acid residue hydrophobic core flivigsii ( seq id no : 2 ) and yielded peptides designated as k 3 h 11 k 3 and k 3 h 12 k 3 , respectively . in some embodiments the 11 and 12 - residue cores were derived from larger segments within the ivs3 segment . in some embodiments , the nine - amino acid residue hydrophobic core was shortened by removing two isoleucine residues , thereby , yielding a peptide denote as k 3 h 7 k 3 . in some embodiments , the five amino acid residue segments from either the c - or n terminus of h 9 were selected and synthesized . they are denoted as k 3 h 5c k 3 and k 3 h 5n k 3 , respectively ( as shown in fig1 ). in another embodiment , k 3 h 5c k 3 and k 3 h 5n k 3 were modified such that these two sequences were flanked with only two lysine residues . these sequences were designated as k 2 h 5n k 2 and k 2 h 5c k 2 , respectively . in one embodiment , kae 16 , a peptide containing alternating polar and nonpolar residues and known to adopt β - sheet structure at both neutral and high ph was also synthesized and tested . the sequences of synthesized peptides ( having hydrophobic cores of varied lengths ) along with their masses , calculated pi values , and mean hydrophobicity at ph 7 . 0 and ph 12 . 0 are presented in fig1 . the adhesive properties of these same peptides were measured at a ph of 7 . 0 and 12 . 0 ( as shown in fig6 ). the peptides , set out in fig1 , at ph 12 all showed significant increased in hydrophobicity ( more negative values ) than those at ph 7 . while it is not intended that the present invention be limited to any specific mechanism ( nor is an understanding of an underlying mechanism a prerequisite to practice the present invention ) these data may be explained by the deprotonization of the lysine residues common to all the adhesive peptides . that is to say , at ph 12 peptides with five - amino acid residue hydrophobic core k 3 h 5c k 3 and k 2h5c having the lowest mean hydrophobicity value of − 0 . 69 kcal / mol , were the most hydrophobic among the peptide prepared ; whereas kae 16 had the highest mean hydrophobicity value of + 0 . 40 kcal / mol and the least hydrophobic character . the adhesive properties of the seven synthetic peptide embodiments shown in table 1 were tested at ph values of 2 . 2 , 6 . 8 , and 12 . 0 using a hot - pressing temperature of 130 ° c . and a pressure of 1 . 4 kg / cm 2 . by measuring the adhesive or shear strength of the peptides under these conditions , the contributions of hydrophobicity and net charge to adhesive strength were ascertained . fig1 shows the shear strengths of 4 % w / w peptide solutions as a function of the ph . the anionic peptide , e 3 h 9 e 3 was insoluble at the two lower ph values thus precluding those adhesive strength analyses . at ph 12 . 0 , e 3 h 9 e 3 displayed weak adhesive properties showing shear strength of only 1 . 09 ± 0 . 21 mpa . the adhesive strength of a zwitterionic species ( i . e ., for example , k 3 h 9 e 3 ), comprising similarly charged amino terminus cationic residues and c - terminus anionic residues are only weakly adhesive at all ph values . this peptide at high ph should be strongly amphiphilic with the highly charged c - terminus (− 4 ) and the neutral hydrophobic n - terminus and hydrophobic core . other zwitterionic species ( i . e ., for example , e 3 h 9 k 3 ) which have a reduced net charge at both termini , show a similar but slightly stronger adhesive strength at ph 2 . 2 and 6 . 8 compared to k 3 h 9 e 3 . at high ph ( i . e ., for example , 12 . 0 ), the adhesive strength of e 3 h 9 k 3 was greatly enhanced , 1 . 81 ± 0 . 18 mpa . at this ph , the peptide would have a net charge of − 4 with one of the negative charges at the c - terminus of the peptide and a charge of − 3 at the n - terminus . although it is not necessary to understand the mechanism of an invention , it is believed that charge redistribution over the whole molecule reduces the amphiphilic character of the peptide and improves the adhesive properties . in one embodiment , the sequence k 3 h k 3 displays modest adhesive strength at low ph and minimal strength at neutral ph . ( fig1 ). in another embodiment , at high ph the peptide is quite hydrophobic , thereby increasing the peptide adhesive strength to approximately 3 . 05 ± 0 . 35 mpa . although it is not necessary to understand the mechanism of an invention , it is believed that ph - induced changes in mean residue hydrophobicity from 0 . 01 at ph 6 . 8 to 1 . 03 at ph 12 might play a role in increased in adhesive strength under the hot - press condition . for example , at ph 12 there is one negative charge associated with the c - terminus of the peptide . when the peptide was resynthesized as the carboxamide ( i . e ., to remove the c - terminal negative charge ) the peptide becomes completely uncharged at ph 12 . however , no difference was seen in the adhesive strength of the − 1 and 0 charge k 3 h 9 k 3 peptides . the data further suggests that as the ph increases from 2 . 2 to 6 . 8 , c - terminal carboxyl group deprotonation introduces a negative charge to the highly cationic peptide . in one embodiment , deprotonation results in a net charge of the c - terminus from + 3 to + 2 , thereby having a net decrease from + 7 to + 6 . although it is not necessary to understand the mechanism of an invention , it is believed that changes in net charge are not a factor for the reduced adhesive strength observed at neutral ph . if this were true , the peptide in the low ph solution should show weaker adhesive strength based on coulombic repulsion of the like charges . the generation of the new c - terminal negative charge at neutral ph might be introducing a small change to the secondary structure of the peptide that interferes with the packing of the peptides during the hot - press treatment . a bis - trilysine adducted sequence replaced six lysine residues with either two tri - histidines ( i . e ., for example , h 3 h 9 h 3 ; seq id no : 12 ) or two tri - arginines ( i . e ., for example , r 3 h 9 r 3 ; seq id no : 13 ). h 3 h 9 h 3 failed to produce good adhesives at the three ph values used to test the k 3 h 9 k 3 sequence . the h 3 h 9 h 3 derivative was insoluble at all ph values and the r 3 h 9 r 3 sequence was not fully ionized at ph 12 . 0 . raising the ph to a value & gt ; 14 where the guanido amine of arginine would be deprotonated did not seem commercially acceptable . two longer peptides were designed to test whether peptide length had any effect on adhesive strength . peptides ( k 3 h 9 ) 2 k 3 , 26 - residues and ( k 3 h 9 ) 3 k 3 , 37 - residues , displayed adhesive strengths of 2 . 83 ± 0 . 33 and 2 . 78 ± 0 . 30 , respectively . these two different tandem repeat sequences showed no further increase in adhesive strength over the k 3 h 9 k 3 peptide indicating that added length does not improve the adhesive properties . the adhesive strength of all peptides set out in fig1 are presented in fig6 . for this group of adhesive peptides , all adhesives prepared at ph 12 . 0 demonstrated higher adhesive strength than those prepared at ph 7 . 0 . adhesives prepared at ph 12 . 0 usually also had wood failure around 15 %, whereas those at ph 7 . 0 had a value around 5 %, suggesting that adhesives made from peptides at ph 12 . 0 had relatively strong adhesive cohesion after curing . the peptides presented in fig1 all contain lysine residues . while it is not intended that the present invention be limited to a specific mechanism , the ph - induced lysine depronation made the peptides more hydrophobic and this likely contributed to increased adhesive strength . in contrast , substituting diaminopropionic acid with a shortened (— ch 2 — nh 2 —) side chain showed little contribution of the lysines to overall adhesive strength . therefore , the length of a peptide hydrophobic core is an important factor in adhesive strength . using a nine - amino acid residue hydrophobic core as a reference point , the adhesive strength of a given peptide increases as the number of amino acid residues in the hydrophobic core increases up to a core length of eleven amino acid residues which exhibits an adhesive strength of 2 . 9 mpa . that is to say , this eleven amino acid residue hydrophobic core adhesive maxima is evidenced by the decrease in adhesive strength when the hydrophobic core is increased to twelve - amino acid residues . for peptides with shortened hydrophobic cores , as compared to flivigsii ( seq id no : 2 ), the peptide with a seven - amino acid residue - hydrophobic core showed similar adhesive strength to the peptide with a nine - amino acid residue core . adhesives from the peptide with a five - amino acid residue hydrophobic core ( k 3 h 5c k 3 ) demonstrated adhesive strength of 3 . 2 mpa . in contrast , adhesives from the peptide with the five - amino acid residue core k 3 h 5n k 3 showed an adhesive strength of 2 . 3 mpa . the adhesives from those peptides showed a 40 % difference in adhesive strength even though they have the same length of hydrophobic core . that is to say , adhesive strength is dependent on more that just the absolute length of the hydrophobic core . more specifically , the amino acid composition of the peptide appears to modulate the peptides &# 39 ; hydrophobic properties and , thereby , account for variations in adhesive strength . for example , peptide k 3 h 5c k 3 is more hydrophobic ( with low δg avg value ) and has a higher adhesive strength than peptide k 3 h 5n k 3 . these data demonstrate there is an inverse relationship between peptide hydrophobicity and adhesive strength . as described above , the peptide k 3 h 9 k 3 had the highest adhesive strength among a series of peptides , with the flivigsii ( seq id no : 2 ) hydrophobic core , synthesized with different terminal clusters . the physio - chemical properties of peptide k 3 h 9 k 3 include : i ) hydrophobicity and ii ) a stable beta sheet structure . the contribution of a peptides beta sheet structure on adhesive strength was documented as follows . the peptide kae 16 , which has a sequence containing alternation polar and nonpolar residues and known to adopt stable beta sheet structure at both ph 7 . 0 and 12 , was evaluated . peptide kae 16 gave a relatively low adhesive strength of 1 . 39 mpa at ph 12 and a even lower value of 1 . 06 mpa at ph 7 . the contribution of peptide hydrophobicity on adhesive strength was documented as follows . adhesive strength from the tested peptides at both ph 7 . 0 and ph 12 . 0 were plotted against their corresponding mean hydrophobicity and a linear regression statistical method was used to analyze these data . significantly linear negative correlation with p & lt ; 0 . 0001 and r of 0 . 80 was found between peptide adhesive strength and mean hydrophobicity ( see , fig1 ). once again , while it is not intended that the present invention be limited to any specific mechanism , these data prove that hydrophobicity accounts for 80 % of the variability in the adhesive strength for a given peptide . for peptides with a five - amino acid hydrophobic core , the adhesive strength for peptides flanked with two lysine residues showed different behavior from those flanked with three lysine residues , depending on the amino acid composition of the hydrophobic core . specifically , adhesive from peptide k 2 h 5n k 2 had adhesive strength of 2 . 73 mpa higher than that of 2 . 29 mpa from peptide k 3 h 5n k 3 . peptide k 2 h 5c k 2 showed adhesive strength of 2 . 40 mpa , which was lower than that of 3 . 24 mpa from peptide k 3 h 5c k 3 , notwithstanding the fact that these peptides have the same mean hydrophobicity value . these observations on the effect of : i ) hydrophobic core length , ii ) beta structure , iii ) hydrophobicity , iv ) flanking peptide sequences , v ) ph , and vi ) peptide solubility may be manipulated to design a peptide with a desired adhesiveness that will maximize performance within a given environment . the above data shows that , at ph 12 , lysine residues become quite hydrophobic . one potential explanation for this increased hydrophobicity involves increased van der waals forces . to test this hypothesis , a synthetic adhesive protein comprising a truncated lysine analog 2 , 3 - diaminopropionic acid ( dap ) was employed . as shown in table 2 , the x 3 h 9 x 3 peptide has an average residue hydrophobicity intermediate to that of k 3 h 9 k 3 at low and high ph values . due to the expense of making this compound , adhesive strength was tested only at ph 12 . 0 . as shown in fig1 , the 130 ° hot press adhesive strength was measured as 3 . 0 ± 0 . 29 mpa . this value is statistically identical to that for the k 3 h 9 k 3 sequence tested under identical conditions . the increased hydrophobicity seen in k 3 h 9 k 3 at elevated ph is not adding significantly to the adhesive strength of the sequence . however , this result does not eliminate the contributions of the hydrophobic core segment to both a minimum hydrophobicity threshold and the induction of β - structure . the rheological behavior of the peptides solutions was affected by ph in pure water ( table 3 ). the peptide e 3 h 9 e 3 was insoluble below and somewhat above its pi thereby preventing viscosity measurements . the viscosity was highest for all other peptides at ph values close to their calculated pis . in the case of the zwitterionic peptides ( i . e ., for example , k 3 h 9 e 3 and e 3 h 9 k 3 ), viscosities of 305 and 245 mpa · sec were recorded at ph 6 . 8 . these sequences have highly charged ends of opposite charge that could adopt antiparallel alignments that would lead to charge neutralization . the increase in viscosity for these sequences near their pi values does not appear to be related to either change in the mean residue hydrophobicity or adhesive strength . adhesive strength of e 3 h 9 k 3 , for example , reached it highest value at ph 12 , where its viscosity was at a minimum value of 20 mpa · sec . the zwitterionic peptides also show considerable viscosity at ph 2 . 2 ; a value well below their pi values . at ph 2 . 2 , k 3 h 9 e 3 and e 3 h 9 k 3 have a more amphipathic character with most of the charge found at one end of the molecule . the net charge of these molecules is 3 . 5 and 4 for k 3 h 9 e 3 and e 3 h 9 k 3 , respectively ( table 2 ). at ph 12 . 0 , the peptides have net charges of − 5 and − 4 , yet do not associate to change viscosity . it is possible that at low ph the amphipathic forms of the zwitterionic peptides adopt unique structures or conformers that promote association . the k 3 h 9 k 3 peptide displays a very different profile with regard to viscosity , hydrophobicity and adhesive strength . k 3 h 9 k 3 shows no propensity to aggregate at ph values of 2 . 2 or 6 . 8 . only at ph 12 , a value above its calculated pi of 10 . 7 , does the peptide solution become viscous . at this ph , the peptide has a net charge of − 1 and a dramatically elevated mean residue hydrophobicity of 1 . 03 . although it is not necessary to understand the mechanism of an invention , it is believed that peptide aggregation forces for this sequence is different from that seen with the zwitterionic species . only in the case of k 3 h 9 k 3 does the increase in viscosity correlate positively with an increase in hydrophobicity and adhesive strength . the adhesive strength observed for this sequence is substantially higher than that seen for either zwitterionic peptide . hot - pressing is generally used with synthetic wood glues and adhesives to increase curing rate and bonding strength . the adhesive strengths of peptides at ph 12 were measured at two hot press temperatures ( fig2 a ). these temperatures are well within the range used commercially in the production of various plywood materials . the dry shear strength of dried peptides at ph 12 at 170 ° c . are significantly increased over that seen at 130 ° c . in one embodiment , synthetic adhesive peptides selected from the group comprising e 3 h 9 k 3 , k 3 h 9 k 3 , ( k 3 h 9 ) 2 k 3 , and ( k 3 h 9 ) 3 k 3 showed increased shear strengths of 2 . 39 ± 0 . 24 , 3 . 74 ± 0 . 38 , 3 . 91 ± 0 . 33 and 4 . 15 ± 0 . 3 , respectively . press temperature is known to have marked effects on water evaporation , immobilization of adhesive molecules , and the interaction between adhesive and adherent , thereby improving the adhesive performance of the final products ( zhong et al ., 2002 , yu and deming , 1998 ; and yamamoto et al ., 2000 ). further , the adhesive strength of synthetic adhesive peptides , as contemplated by the present invention ( i . e ., for example , k 3 h 9 k 3 ) approaches that reported for isolated soy protein adhesives ( spi ) ( huang and sun , 2000a , b ). the adhesive strength of the k 3 h 9 k 3 peptide at ph 12 in d 2 o was also determined . deuterium oxide was added to try and assess the contributions of hydrogen bonding and the hydrophobic effect on the overall strength of the adhesive . the deuterium oxide had little effect on the adhesive strength , yielding a value of 2 . 7 ± 0 . 33 ( data not shown ) at a hot press temperature of 130 (° c . the minimal effect observed for the adhesive strength of k 3 h 9 k 3 in the presence of d 2 o at ph 12 suggests that neither hydrophobic interactions nor hydrogen bonding were affected to any great extent . 10 in fig2 b , the shear strengths of the peptide adhesives at ph 12 are presented after immersion in water for 48 hr . this value is termed “ wet ” shear strength and is a predictor of how glued wood products would behave after being exposed to environmental elements . e 3 h 9 e 3 and k 3 h 9 e 3 prepared at either temperature fall apart during the immersion step . e 3 h 9 k 3 showed a wet strength of 0 . 37 ± 0 . 12 which is only 15 % that of the dry 170 ° c . pressed sample . the k 3 h 9 k 3 , ( k 3 h 9 ) 2 k 3 and ( k 3 h 9 ) 3 k 3 had wet strengths of 1 . 38 ± 0 . 2 , 1 . 43 ± 0 . 06 and 1 . 38 ± 0 . 15 , respectively . these samples retained more than 33 % of the dry 170 ° c . pressed shear strength . if the wetted samples are allowed to completely dry the shear strength returns nearly to that observed prior to wetting ( data not shown ). in one embodiment , an adhesive peptide ( i . e ., for example , k 3 h 9 k ) was tested at different concentrations at 170 ° c . for changes in viscosity and shear strength . as shown in fig3 , the shear strength increased with concentrations up to a limit of approximately 3 . 7 mpa at a 4 % concentration . further increases in concentration did not improve shear strength . viscosity , on the other hand , increased at all concentrations tested . the viscosity dependence on concentration is clearly not linear . comparing the viscosity at 4 % to that measured at 2 % reveals greater than a four - fold decrease in the viscosity at half the concentration . since the technique used to measure viscosity does not yield kinetic data , it is not possible to determine the order of the aggregation process that increases viscosity . at best it appears that aggregation is not a single order process . the adhesive strength apparently plateaus at a 4 % concentration . although it is not necessary to understand the mechanism of an invention , it is believed that the relationship between increases in viscosity and increases in adhesive strength is not clear - cut . for example , from a teleological perspective , peptide aggregation should enhance adhesive strength : the greater the peptide - peptide interactions the greater the shear strength . it is further believed that , a limit might be reached where the peptides interact almost exclusively with each other , rather than the surfaces being glued . cd experiments , which actively monitor the intermolecular folding and intermolecular sheet assembly of peptide , when combined with rheology experiments , which actively monitored the self - assembly of the peptide into a gel scaffold , form a clear image of how material properties can be attributed to molecule folding and consequent assembly mechanism . schneider et al . ( 2002 ). to understand what secondary structural properties of the peptides affect adhesive strength , dilute solutions e 3 h 9 k 3 and k 3 h 9 k 3 peptides at ph 12 , were analyzed using circular dichroism ( cd ) for solution samples . dilute solutions were used to minimize light scattering that occurs with the gelled samples at higher concentrations . fig4 a shows that the e 3 h 9 k 3 peptide adopts a classical anti - parallel β - sheet structure at ph 6 . 8 and also at ph 2 . 2 , but to a lesser extent . at ph 6 . 8 this peptide is zwitterionic with a balanced − 2 at the n - and + 2 at c - termini , respectively . in an anti - parallel orientation , the oppositely charged ends can interact optimally . at ph 2 . 2 , the peptide is not zwitterionic having + 1 and + 4 charges at the n - and c - termini , respectively . at ph 12 , where the adhesive strength is at its highest , the peptide has a net negative charge of − 4 and appears to be unstructured . in the case of e 3 h 9 k 3 , beta structure in solution does not appear to be a requirement for its adhesive properties . the k 3 h 9 k 3 peptide ( fig4 b ), however , does appear to have a structural component associated with increased adhesive strength . at ph 2 . 2 and ph 6 . 8 , where the peptide is positively charged , the k 3 h 9 k 3 spectra show a predominantly random coil structure , while at ph where the peptide carries no net charge , a more β - like structure is observed . clearly , ph conditions that promote a more ordered structure , enriched in β - sheet , dramatically increase adhesive strength . nearly identical cd spectra were obtained at the three different ph values for the shortened lysine analog 2 , 4 - diaminopropionic acid containing sequence , x 3 h 9 x 3 ( data not shown ). at the low and neutral ph random structure predominated however at elevated ph β - structure was observed . it is believed that , upon drying ( removing water molecules ), the strength of the hydrogen bonds would increase due to a decrease in the concentration of competing hydrogen bond donating water molecules . increasing the temperature of k 3 h 9 k 3 ( 250 μm ) from 25 ° c . and 75 ° c ., however , did not alter the cd spectra at ph 12 ( not shown data ). the results indicate that the conformation of k 3 h 9 k 3 peptide at ph 12 is resistant to change . a strengthening of the intermolecular interactions would help stabilize the beta - like structure during the heating and pressing steps . the ftir spectra of the dry k 3 h 9 k 3 samples prepared using different temperatures and pressing conditions are seen in fig5 . all these spectra show characteristic amide i ( 1680 cm1 ), ii ( 1548 cm − 1 ), and iii ( 1206 cm − 1 ) stretches suggest the presence of an antiparallel β - sheet conformation . the result on the dried material indicate that the conformation of the k 3 h 9 k 3 peptide formed in solution at ph 12 is highly resistant to change . even at elevated temperatures and desiccation , conditions that would usually denature a peptide , the β - like structure remains intact . in one embodiment , the k 3 h 9 k 3 amide i peak is split in β sheets and appears at 1680 cm − 1 and 1633 cm − 1 but the peak at 1680 cm − 1 weakens when going from hot press conditions to room temperature when comparing preparation techniques . this result indicates that there may be less β - sheet structure in samples prepared at either room temperature or 130 ° c . without pressure . in addition , the amide ii peak appears at 1548 cm − 1 is weaker in both the 130 ° c . no pressure and room temperature prepared samples . the amide iii peak appears at 1206 cm − 1 is strongest in the hot press sample whereas the sample prepared at 130 ° c . without pressure gives a band of lesser intensity and the room temperature sample has only a weak band . this can be observed by internal ratios of intensities . this data can be seen in fig5 and table 4 . although these spectral differences do not indicate a major change in the overall structure of the peptide , they do indicate that the samples prepared by the hot press technique contain more β - like sheet conformation than the sample prepared at 130 ° c . without pressure and significantly more than samples prepared at room temperature without pressure . the same k 3 h 9 k 3 samples used in the ftir studies were analyzed by matrix assisted , laser desorption mass spectrometry . at elevated ph and temperature , the spontaneous hydrolysis of peptide bonds could occur . dried samples taken from glass slides treated with 4 % peptide solutions at ph 12 and dried at either room temperature or 130 ° c . without pressure as well as dried at 130 ° c . with pressure were dissolved in acetonitrile containing matrix and transferred to mass spectral target slides . analysis of all samples revealed intact monomer however no detectable amounts of fragmented peptide observed ( data not shown ). as shown in fig6 the k 3 h 5c k 3 sequence ( kkkigsiikkk ) ( seq id no : 18 ) has adhesive strength at ph 12 . 0 equal to or better than those sequences with larger hydrophobic cores ( i . e . h 7 - h 12 ). while the present invention is not dependent on any specific mechanism , at ph 12 the amino acid lysine looses its positive charge and becomes less water soluble ( top line in fig7 ). in loosing the positive charge , the repulsive forces are eliminated and the peptide is able to assume the beta structure . as illustrated in fig7 the charge can also be eliminated by chemically modifying the nh 2 group by the addition of acetyl ( left side reaction ) or formyl ( center reaction ) groups . for the acetylation reaction , acetic anhydride was used to directly acetylate the fully synthesized peptide . the resulting sample , “ acylated -( k 3 h 5c k 3 )”, was separated using a rp - hplc column on a beckman hplc system using the synergi 4μ , 150 × 4 . 6 mm i . d . column with a mobile phase gradient starting with 95 : 5 , water : acetonitrile containing 0 . 01 % trifluoroacetic acid and rising to 10 : 90 water : acetonitrile containing 0 . 01 % trifluoroacetic acid over 30 min at a flow rate of 1 . 0 ml / min with peak detection of 230 nm . as shown in fig8 a , the mixture of peptides derived from the direct acetylation protocol ( as outlined above ) were poorly separated . subsequent analysis using maldi - tof mass spectrometry ( see , fig8 b ) revealed the presence of numerous products with acetylation addition numbers ranging from 4 - 7 . in view of these results , an alternative synthetic scheme was devised . specifically , the peptide was resynthesized with the lysine residues already blocked via formylation ( see , fig7 ). the formyl groups were added during the actual peptide synthesis using a commercially available formylated form of amino acid lysine . by adding them to the synthesis , all of the lysines were uniformly modified . the fully synthesized formylated peptide was cleaved from the resin using trifluoroacetic acid ( 95 %) and ( 5 %) de - ionized water ; precipitated and washed several times with diethyl ether . the sample was dissolved in acetic acid and then freeze dried in a lyophilizer . the dried peptide was re dissolved in water containing 10 % acetonitrile . samples were injected into the hplc apparatus . maldi - tof mass spectrometry on these samples resolved several peaks that could be assigned to the peptide sample ( see , fig9 a and 9b ). specifically , fig9 a documents one main peak in the mixture . fig9 b shows the anticipated mass of the product is present as well . this is the preferred synthetic method for producing an uncharged k 3 h 5c k 3 molecule . having validated the isolation protocol , purified material was isolated from the crude sample by repetitive hplc runs . material was collected from a particular peak . various amounts of the peptide ( 100 μl to 300 μl at a concentration of 0 . 1 mg / ml ) were loaded onto the hplc column . the purification protocol was repeated until ˜ 10 mg of purified k 3 h 5c k 3 was isolated ( see fig1 a and 10b ). this amount was required for the structural studies that included circular dichroism ( cd ) and nuclear magnetic resonance ( nmr ). the secondary structure the k 3 h 5c k 3 sequence kkkigsiikkk ) ( seq id no : 18 ) was measured initially in water containing the dibasic buffer salt k 2 hpo 4 at ph 8 . 5 . a 3ml stock sample of peptide at ( 1 mg / 11 ml ) in 5 % acetonitrile in water . peptide samples , 100 μl , were added to a quartz cuvette along with the buffer , k 2 hpo 4 , at the following concentrations : 0 %, 0 . 01 %, 0 . 1 %, 1 %, and 5 %. given that a mixture of random folding and beta sheets folding was observed , the buffer system was subsequently switched to the monobasic buffer salt , kh 2 po 4 . two stock solutions of purified peptide at concentrations of 500 mm and 1 mm were prepared in water containing 5 % acetonitrile at ph 4 . 5 . the circular dichroism spectra revealed the presence of both random coil and beta - structure , with slightly more beta - structure observed in the monobasic solution . in view of this spectra the salt buffer switched in favor of distilled water at ph 5 . 0 . this gave predominantly beta - structure ( see , fig1 ). a peptide sample ( 1 . 4 ml ) containing 1 . 0 mm peptide — k 3 h 5c k 3 sequence ( kkkigsiikkk ) ( seq id no : 18 )— in distilled water containing 5 % acetonitrile and 10 % d 2 o was prepared for the nmr studies . the 1d proton nmr spectrum was acquired with an 11 . 75 t varian unity plus spectrometer ( varian , palo alto , calif ., usa ), operating at 499 . 96 mhz for h , with a 3 - mm triple - resonance inverse detection probe . the spectrum was recorded at 25 ° c . and the data processed by varian software vnmr 6 . 1c on a sun microsystems workstation . the h nmr spectrum is shown in fig1 . these sharp and well separated peaks indicated the peptide did not aggregate . an analysis of the cα protons reveal a downfield shifted as compared to unstructured protein standards . this downfield shift is consistent with a protein comprising a beta - structure conformation . the following values , δg ( kcal / mol ), were recorded for transfer from water to organic phase ( a measure of hydrophobicity from wimley and white hydrophobicity scale ): the present invention contemplates a rational design approach to construct a functional peptide adhesive . in one embodiment a peptide adhesive comprises the amino acid sequence kkkflivigsiikkk ( k 3 h 9 k 3 ) ( seq id no : 7 ), wherein said sequence includes a central nine amino acid hydrophobic sequence ( e . g ., similar to that found in a transmembrane segment of naturally occurring ion channel proteins ), and two flaming tri lysyl peptide segments that are hydrophilic and quite soluble at acidic and neutral ph values yet form hydrophobic viscose gels at ph 12 . in another embodiment , the adhesive peptides are made and stored under conditions where there are no adhesive properties and then converted to the adhesive form with a simple ph change . in another embodiment , the adhesive protein comprises anti - parallel beta sheets ( verified using . structural analysis at elevated ph , both in solution and in a dried adhesive suggests the presence of an anti - parallel beta sheet structure . the behavior of peptides in the absence of bulk water and treatment with higher temperatures and pressures are not well documented . clearly in the case of this adhesive peptide , structure appears to be preserved even after subjecting the peptide to these extreme conditions . although it is not necessary to understand the mechanism of the invention , it is believed that a peptide adhesive containing neutralized charged residues can form hydrophobic and hydrogen bonding interactions with itself and substrate surfaces as water is removed during the drying process . in one embodiment , the adhesive comprises an aggregated β - sheet matrix stabilized further by the presence of van der waals interactions within the hydrophobic core segment . at the two substrate surfaces , the chemical composition of the wood can form associations with the peptide adhesive and the topography ( small pores and crevices ) can fill with the gelling peptide such that the two surfaces become glued through the common gel matrix with both bonding and non bonding interactions . although it is not necessary to understand the mechanism of an invention , it is believed that , at the molecular level , there appear to be two requirements for adhesion ; 1 ) the peptide needs to be in a β - sheet conformation where h - bonds contribute to intermolecular assembly and 2 ) the requirement for a substantial number of hydrophobic amino acids with suitable side chain alkyl groups capable of forming van der waals interactions . ionic and covalent bonds do not appear to be observed for this peptide sequence . in another embodiment , the aforementioned nine amino acid hydrophobic core is lengthened with additional amino acid residues . in another embodiment the aforementioned nine amino acid hydrophobic core is shortened . in one embodiment beta sheet conformations were introduced into the adhesive peptides . in another embodiment the hydrophobicity of adhesive proteins was modulated . in one embodiment the flanking peptide sequences were varied . the following examples are intended as illustrative embodiments . it is not intended that these examples limit the invention in any manner . for this example , a nine residue hydrophobic sequence , flivigsii ( h 9 ) ( seq id no : 2 ), was used that is derived for the third transmembrane domain of subunit iv in the dihydropyridine sensitive human muscle l - type calcium channel ( ivs3 ) dpwnvfdfliigsiidvilse ( seq id no : 14 ) ( grove et al ., 1993 ). the complete 22 - residue sequence is extremely hydrophobic , and once lyophilized , it aggregates to become insoluble in virtually any solvent or mixture of solvents . a strong aggregating property is a positive factor when considering a de novo design for a protein adhesive . next , clusters of anionic - oligo glutamate ( e ), cationic - oligo lysine ( k ), or oligo 2 , 3 - diaminopropionate ( x ) residues were placed at either termini of the hydrophobic core sequence . many protein adhesive embodiments may be contemplated , comprising different numbers and combinations of the charged residues comprising motifs including , but not limited to , e 3 h 9 e 3 , k 3 h 9 e 3 , e 3 h 9 k 3 , k 3 h 9 k 3 , x 3 h 9 x 3 , k 3 h 9 k 3 h 9 k 3 and k 3 h 9 k 3 h 9 k 3 h 9 k 3 . materials : dichloromethane ( dcm ), dimethylformamide ( dmf ), ethyl ether , and n - methylpyrrolidone ( nmp ) were purchased from fisher biotech ( fair lawn , n . j . ); 1 , 2 - ethanedithiol ( edt ), n , n - diisopropylethylamine ( diea ), piperidine , and trifluoroacetric acid ( tfa ) were purchased from aldrich ( milwaukee , wis . ; ( 2 -( 1h - benzotriazol - 1 - yl ) 1 , 1 , 3 , 3 - tetramethyluronium hexafluorophosphate ) ( hbtu ) and 1 - hydroxybenzotriazole ( hobt ) were purchased from q - biogene ( carlsbad , calif . ); all protected amino acids , fmoc - glu ( tbu )- wang resin , fmoc - lys ( boc )- hmp , and hmp - amide resin were purchased from anaspec , inc ( san jose , calif .). clear - amide resin was purchased from peptide international ( louisville , ky .). all reagents were acs certified unless specified otherwise . cherry wood samples were purchased from the veneer one ( oceanside , n . y .). peptide synthesis all peptides reported in table 1 were synthesized according to the automated base - labile 9 - fluorenylmethoxycarbonyl ( fmoc ) strategy using fmoc - protected amino acids , including fmoc , boc - 2 , 3 - diaminopropionic acid ( anaspec , inc , san jose , calif .) and fmoc - glu ( tbu )- wang , fmoc - lys ( boc )- hmp , hmp - amide resins on an applied biosystems model 431 peptide synthesizer . all peptides were cleaved from the resin with simultaneous deprotected by treatment with 5 % 1 , 2 - ethanedithiol in 95 % trifluoroacetic acid for 2 h at room temperature . the cleaved peptides were washed three - times with diethyl ether and dissolved in 20 % acetonitrile in water , then lyophilized . all syntheses were characterized by matrix - assisted laser desorption time - of - flight mass spectroscopy ( maldi - tof , ms ) ( finnigan mat , san jose , calif .). all peptide samples reported in fig1 were synthesized according to the automated base - labile 9 - fluorenylmethoxycarbonyl ( fmoc ) strategy using pmoc - protected amino acids clear - amide resin on an applied biosystems model 431 peptide synthesizer . the peptides were cleaved from the resin with simultaneous deprotection by treatment with 5 % 1 , 2 - ethanedithiol in 95 % trifluoroacetic acid for 2 h at room temperature . the cleaved peptides were washed three - times with diethyl ether and dissolved in 20 % acetonitrile in water , then lyophilized . all syntheses were characterized by matrix - assisted laser desorption ionization - time of flight - m as spectroscopy ( maldi - tof - ms , finnigan mat , san jose , calif .). adhesive and specimen preparation : adhesive stocks were prepared and stirred for 1 h , and then ph of the adhesives was adjusted using either 1n sodium hydroxide or 1n hydrochloric acid . in one embodiment , a 4 % stock ( w / w ) was prepared such that when 360 μl of the adhesive was brushed onto each side of a wood sample , with a marked area of 8 cm × 20 cm , an adhesive concentration of 0 . 9 mg / cm 2 was achieved . the wood pieces were allowed to rest at room temperature for 15 min and then were assembled and pressed by using a hot press ( model 3890 auto “ m ”; carver inc ., wabash , ind .) at pressure of 1 . 4 mpa at 130 ° c . for 5 min . preparation of specimen : wood specimens for shear strength testing were prepared and tested according to astm standard method d2339 - 98 . for most experiments a 4 % ( w / w ) peptide solution was used : after stirring at room temperature for 60 min the ph was adjusted according to the ph specifications of the individual experiment . in a typical experiment a stock 20 solution of 64 mg of peptide was dissolved in 1 . 4 ml of water . the ph was adjusted using either 1 . 0 n hcl or naoh and the final volume adjusted to 1 . 6 ml . three hundred sixty milligrams of protein solution was placed on each side of a wood piece and spread on a marked area of 80 mm × 20 mm . two wood pieces were allowed to rest at room temperature for 15 min and then were assembled and press - cured using a hot press ( model 3890 auto “ m ”; carver inc ., wabash , ind .) at molding pressure of 1 . 4 mpa at 130 ° c . for 5 min . the wood specimens were preconditioned at 23 ° c . and 50 % relative humidity ( rh ) for 3 days before cutting into three pieces with a glue area of 20 mm × 20 mm . then the specimens were further conditioned for 4 days before testing for shear strength . hydrophobicity calculation hydrophobicity is represented by δg avg in kcal / mol . δg avg = δg residue / residue number . δg residue values are taken from the octanol — interface scale . given 5 there are no published values for the hydrophobicity of lysine at ph 12 . 0 , the value for leucine was selected . adhesive strength measurement : the glued and cured wood specimens for shear strength testing were prepared according to the standard test method for strength properties of adhesive in two - ply wood construction in shear by tension loading ( astm d2339 - 98 , 2002 ). the cherry wood specimens were preconditioned at 23 ° c . and 50 % relative humidity ( rh ) for 3 days , cut into three pieces with a glue area of 20 mm × 20 mm . then the samples were further conditioned for 4 days before testing for shear strength . an instron testing machine ( model 4465 , canton , mass .) with a crosshead speed of 1 . 6 mm / min was used . stress at maximum load was recorded and the shear strength was computed accordingly by dividing the bonded area . the shear strengths reported are the average values of at least five measurements each . results reported were an average of six replicates . the range for the data points is included on the graphs ( error bars ). wood failure was estimated according to standard practice for estimating the percentage of wood failure in adhesive bonded joints astm d5266 - 99 ( 20 ). the maximum load was recorded and the shear strength computed . water resistance : water resistance was measured following standard test methods for 25 resistance of adhesives to cyclic laboratory aging conditions ( astm d1183 - 96 , 2002 ) and standard test methods for effect of moisture and temperature on adhesive bonds ( astm d1151 - 00 , 2002 ). the glued wood pieces were allowed to soak in tap water at 23 ° c . for 48 h . the wet strength was obtained by testing immediately after soaking . the shear strength was tested as described above . viscosity : viscosity of peptides at different ph was measured in a brookfield rvdv - iii 5 + viscometer ( middleboro , mass .). all the measurements were taken at 2 . 5 minute intervals using 8 ml samples at ambient temperature with a spindle sc4 - 21 operating at 20 rpm . five data points were averaged for each reported value . circular dichroism spectra : the data set out in fig4 were collected according to the following protocol . the circular dichroic spectra were recorded on a j - 720 ( jasco , japan ) spectropolarinmeter with a neslab rte - 111m circulator using a 1 . 0 mm quartz cuvette from 260 to 180 nm . the spectra are an average of five scans recorded at a rate of 20 nm / min with a 0 . 2 nm step interval . for circular dichroism measurements , 1 ml samples of synthetic peptide were prepared with a different ph buffer solution . the following buffers were used : 60 mm glycine , 60 mm nacl , 40 mm hcl , ph 2 . 2 ; 50 mm glycine , 50 mm nacl , 0 . 2 mm naoh , ph 6 . 8 ; and 45 mm glycine , 45 mm nacl , 55 mm naoh , ph 12 . the final peptide concentration was 250 μm . all spectra were corrected by subtracting the baseline of the buffer solution recorded under the same condition . unless otherwise noted , spectra were recorded at room temperature . the cd absorbances were expressed as the mean residue ellipticity in units of degrees cm 2 dmol − 1 . temperatures were controlled with a refrigerated circulator bath ( neslab rte - 111m ). temperatures were controlled between 25 ° c . to 75 ° c . the data set out in fig1 were collected according to the following protocol . circular dichroic spectra were recorded on a j - 720 ( jasco , japan ) spectropolarimeter with a neslab rte 111m circulator using a 1 . 0 mm quartz cuvette from 260 - 180 nm . the spectra are an average of five scan recorded at a rate of 20 nm / min with a 0 . 2 nm step interval . for circular dichroism measurements , 1 - ml samples of synthetic peptide were prepared with different solvent concentrations . the following solvent concentrations of khpo4 : 0 %, 0 . 01 %, 0 . 1 %, 1 %, and 5 % in water . the final peptide concentration was 100 um . all spectra were corrected by subtracting the baseline of the buffer solution recorded under the same condition . unless otherwise noted , spectra were recorded at room temperature . the cd absorbances were expressed as the mean residue ellipticity in units of degree cm 2 dmol - 1 . temperatures were controlled with a refrigerated circulator bath ( neslab rte - 111m0 . temperatures were controlled between 25 and 75 degrees celsius . sample spectra were recorded immediately after the instrument was purged . infrared spectroscopy : a 4 % k 3 h 9 k 3 peptide water solution at ph 12 was applied to the ends of glass slides , 400 mm ( 20 × 20 mm ) glass slides with overall dimensions of 80 × 20 mm , and hot pressed as before at 130 ° c . higher hot press temperatures resulted in failure of the glass . the peptide showed adhesive strength of 0 . 55 mpa with glass slides compared to 3 . 05 mpa seen glued wood strips ( under identical conditions ). for ir measurements , cured glass slides were pulled apart and the dried peptide film scraped off . approximately 1 mg of dried adhesive was ground in a mortar and pestle with 10 mg predried kbr in a glove box to minimize contributions of water to the ir bands centered at around 1635 - 40 cm - 1 that can obscure or be mistaken for the amide i of β - sheet . the finely ground mixture was pressed to 5000 - 6000 lbs for 4 min in a carver laboratory press model b to produce a translucent pellet . the ir spectra were recorded on a nicolet nexus 670 ftir esp . the spectra are an average of 32 scans at 2 cm − 1 resolution . all spectra were corrected by subtracting the background . the instrument was purged every 5 min with nitrogen . sample spectra were recorded immediately after the instrument was purged .	2
anthocyanins are water soluble naturally occurred products . they are present in plants , flowers , fruits such as grapes , berries and in red wine . anthocyanins are natural pigments that appear red , purple to blue according to ph . importantly , anthocyanins act as powerful antioxidants to protect the plant from free radical induced oxidation . their antioxidant capacity could be up to 4 times higher than vitamin e . anthocyanins have also been found to have anti - imflammability , anti - angiogenic and anti - carcinogenic properties . currently anthocyanins are widely used in the food industry . two anthocyanin extracts in powder form from grape skin ( antho - g ) and bilberry ( antho - b ) respectively and a total of four concentrations were tested : the anthocyanin extract ( antho - g ) from grape skin was obtained from food ingredient solution llc as a food additive . anthocyanin content in the grape extract is about 8 %. the anthocyanin extract from bilberry ( antho - b ) was obtained from charles bowman and company and anthocyanin content in the bilberry extract is 50 %. the anthocyanin extract used was obtained as a red powder . in the preferred method the red powder was dissolved in water at appropriate concentrations . a solution of 2 . 5 % of either extract was used . the mixing formed a red aqueous solution . typically , 16 ml of the 2 . 5 % solution of either antho - g or antho - b was added to 800 g uhmwpe powder and the mixture was blended using a papenmeier shear blender . the doped powder wet mixture ( light pink depending on the concentration of anthocyanin ) was dried under nitrogen and then consolidated at 350 ° f ., with a maximum unit pressure of approximately 1000 psi ( 34 mpa ). a pinkish colored uhmwpe block in a size of 2 × 3 × 6 inches was obtained in a custom wabash 4 opening press . alternately , 0 . 4 grams of dry anthocyanin ( ortho - g or antho - b ) red powder could be blended with 800 uhmwpe powder . this will result in a similar colored uhmwpe powder as was obtained with the wet blended powder . molding would be performed as described above . the content of anthocyanin in the uhmwpe may be up to 5 % by weight and preferably 0 . 005 to 2 % by weight . the color of the uhmwpe got deeper from pink to dark red with an increase of anthocyanin content . the uhmwpe may be formed into a block by compression molding and the block with anthocyanin was gamma irradiated at an approximately 9 mrad in three steps with annealing after each step of cumulated doses . the color of the uhmwpe was visually examined and no color change was observed . gur 1020 brand uhmwpe powder per astm f 648 type i was purchased from ticona gmbh , frankfurtmain , germany . the partial size of the powder was less than 300 μm . the anthocyanin antho - g and antho - b extracts were dissolved in water in a concentration of 2 . 5 % and mixed into the uhmwpe powder using a papenmeier shear blender . the amount of the 2 . 5 % solution added to the uhmwpe powder was varied to produce either 500 ppm ( 0 . 05 % w / w ) or 250 ppm ( 0 . 025 % w / w ) of the antho - g extract or 250 or 125 ppm of the antho - b extract . the actual concentration of anthocyanin contained in each sample is shown in table 1 . after drying under nitrogen , the uhmwpe blend was then molded at 350 ° f . and with a maximum unit pressure of approximately 1000 psi ( 4 mpa ) to produce a test sample plaque in a size of 2 × 3 × 6 inches . the anthocyanin doped plaques were sequentially gamma irradiated 3 mrad for a total dose of 9 and annealed after each dose at 130 ° c . for 8 hours . test samples ( 1 mm slices ) were then machined out of the treated blocks and tested according to the astm standard methods . the density measurements were determined according to astm d1505 using density gradient column . two ( 2 ) specimens per sample were evaluated . average value and standard deviation are reported . crystallinity measurements were obtained in accordance with astm d3418 . standard testing on perkin - elmer diamond dsc was used . both heating and cooling runs were performed at 10 ° c ./ min . the peak temperature on the heating and the cooling curves determined the melting point and the crystallization temperature , respectively . the crystallinity was calculated as the heat of fusion of the test specimen divided by 287 . 3 j / g ( the heat of fusion for a perfect pe crystal ). five ( 5 ) specimens per sample were analyzed ; the average value and standard deviation are reported . a virgin gur 1020 sample was included in every run for control . the results of the analysis are shown in table 1 . the tensile test was conducted according to astm d638 ( reference 3 ), type iv with a crosshead speed set at 5 . 08 cm / min ( or 2 in / min ). a standard tensile tester ( instron 4505 ) was used . eight specimens per sample condition were tested ; the average value and standard deviation are reported for yield strength , ultimate strength and elongation . the results are shown in table 1 . physical and mechanical properties of the anthocyanin doped uhmwpe are shown in table 1 . the data indicate that addition of the anthocyanin extract resulting in either a 125 , 250 ppm ( 0 . 0125 % w / w ) or 500 ppm ( 0 . 05 % w / w ) concentration of extract in the gur 1020 did not affect the physical and mechanical properties . free radical measurements were conducted at the department of physics , the university of memphis . the experiment procedures are as follows : following machining / cutting , each sample was cleaned in ethanol and dried in a drying environment using filtered dry nitrogen . however , precut / pre - machined , cleaned and prepackaged samples are used without any additional cleaning . before measurements , the mass of each sample was recorded using a microgram scale ( ga 110 , ohaus ). the sample for measurement was placed in a high purity suprasil quartz tube of size 4 mm outer and 3 mm inner diameters , and varying between 100 and 200 mm in length ( wilmad glass ). along with each sample , a reference standard ( srm 2601 , nist ) was also placed in the tube . for free radical measurements , an x - band electron spin resonance ( esr ) spectrometer ( emx 300 , bruker ) was used . the spectrometer operates at around 9 . 7 ghz ( empty cavity frequency ), it was fitted with a multimode high - sensitive cavity ( bruker ), and was fully automated . experimental resonance frequency , which was factored into the calculation for the spectral g value ( characteristic splitting factor of a spectrum ), was automatically recorded as an operating parameter when the cavity was tuned with the tube - with - sample in place . esr signal was detected as the first derivative of the resonance absorption by setting the frequency of the magnetic field modulation and that of the signal detection at 100 khz . in general , the amplitude of modulation ( 1 - 5 g ) and that of the microwave power ( 0 . 5 - 5 . 0 mw ) were preset to obtain desired signal - to - noise ratio and to keep the detection range below saturation level of the absorption signal . for spectral discrimination , however , modulation amplitude was varied between 1 mg and 20 g , and the microwave power between 1 . 0 w and 100 mw , respectively , as needed . first - derivative absorption signal of the reference standard was also recorded at the same time without re - tuning the cavity or altering any operating parameters of the spectrometer . spectral data as well as the operating parameters are automatically recorded by a dedicated pc , and subsequent calculations or presentations were performed using a winepr program ( bruker ). using the known number of free spins in the standard , free - radical concentration ( frc ) in the sample was determined . the results are shown in table 2 . an accelerated aging test was conducted following the standard method described in astm2102 . uhmwpe without antioxidant ( reference ), which was gamma irradiated sterilized at 3 mrads in either air ( gamma - air ) or nitrogen ( n2 ) respectively , were used as references . the aged specimens were analyzed by ftir and the data are shown in table 3 . the results demonstrate that no oxidation was detected in the anthocyanin doped specimens after two weeks accelerated aging . the oxidation was found through the entire range of specimens of the two references . when the accelerated aging was extended to four weeks , there was still no oxidation detected in the anthocyanin doped sample . wear testing was conducted on the acetabular cups with an inner diameter of 32 mm , and a thickness of 5 . 9 mm . inserts were manufactured from four anthocyanin doped uhmwpe . all samples were inserted into titanium acetabular shells which are mounted to uhmwpe fixtures using titanium bone screws . appropriate diameter cocr femoral heads were mated against the inserts . a multi - station mts ( eden prairie , minn .) hip joint wear simulator was used for testing . reference uhmpe materials included : ( 1 ) undoped uhmwpe and uhmwpe doped with 500 ppm vitamin e using a powder - liquid blending process . all materials were gamma irradiated at 3 mrads and then annealed at 130 ° c . for 8 hours . this was done sequentially three times for a total of 9 mrads . the test specimens were submerged in a lubricant bath for the duration of testing . alpha calf fraction serum was used . after diluted and protein adjusted , the serum solution was 0 . 2 μm filed before use . the standard method described in astm f2025 - 06 was used for cleaning , weighing and assessing the wear loss of the acetabular inserts . the serum solution was replaced and the inserts weighed every 0 . 5 million cycles . testing was conducted for a minimum of 2 million cycles . wear rates were determined based on the weight loss of the specimens during testing . the weight loss of the specimens was corrected by fluid absorption that was done by monitoring the weight gain of the static soaked specimens . table 4 shows the wear rates of the anthocyanin doped uhmwpe after two million cycles on a hip joint stimulator . lower wear rates were seen in the uhmwpe doped with high concentrations of the anthocyanin ( antho - g 500 ppm and antho - b 250 ppm ). compared to the 500 ppm vitamin e doped uhmwpe and undoped uhmwpe that were processed and fabricated under the same conditions . the anthocyanin doped uhmwpe had lower wear rates and better wear resistance . it is well known that antioxidants will react with free radicals during the irradiation - crosslinking process ; this reduces the availability of free radicals in uhmwpe for crosslinking . however , the above results demonstrated that the addition of anthocyanin will improve wear resistance of crosslinked uhmwpe . the uhmwpe containing anthocyanin showed a lower wear rate than undoped uhmwpe that received the same irradiation crosslink and heat treatment . all uhmwpe containing anthocyanin showed significant ( p & lt ; 0 . 011 ) lower wear than that with 500 ppm vitamin e doped uhmwpe . although the invention herein has been described with reference to particular embodiments , it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention . it is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims .	2
these activators are either commercial products or can be inexpensively produced according to well - known methods of preparative inorganic chemistry . the activators are added to the aqueous hydrazine solution with a hydrazine content of the customary 10 - 25 volume percent , preferably 20 to 25 volume percent , in amounts of between 0 . 01 to 0 . 3 weight percent , preferably 0 . 05 to 0 . 1 weight percent . there is no decomposition of the activated hydrazines during storage in closed containers . the method of the invention for the removal of oxygen from water is accomplished by adding the activator - rich hydrazine solution to water from which oxygen is to be removed , with the amount of hydrazine being at least one mol . per mol . of dissolved oxygen . an excess amount of hydrazine is preferably used . the ph - range should be between 8 and 11 . although high ph - values increase the reaction velocity , a rapid reduction of oxygen is already accomplished in a ph - range of approximately 9 and there is accordingly no need for adding alkalizing substances , such as alkali hydroxide or ammonia . this is a definite advantage compared to the prior art . the temperature can be maintained in the range of 283 ° k . to 303 ° k . higher temperatures are preferable but not mandatory . it has been demonstrated of particular advantage that the activators of the invention do not lose their effectiveness over time during the removal of oxygen . corrosion tests , which were conducted over a period of three months with steel probes dipped into water containing oxygen and activated hydrazine , or hydrazine without activator , or hydrazine with organic activator , being resupplied with oxygen twice a day by injecting air , have demonstrated that there is no corrosion effect when using the activators of the invention , while comparison probes already exhibited signs of corrosion after a few days , become increasingly worse with time . because of their high reactivity , a hydrazine solution containing the activators of the invention can preferably be used as well for the removal of oxygen from gases containing oxygen , provided that the hydrazine content is adjusted to the amount of oxygen in the gas . it is thus possible to virtually completely eliminate the oxygen content of air by shaking with an activator - rich hydrazine solution in a closed container at room temperature . the mentioned characteristics are particularly desirable in those instances when unexpected air intrusion is to be compensated in closed systems . 0 . 5 to 3 g . of activator per liter was dissolved in an aqueous hydrazine solution with a content of 200 g . hydrazine per liter . from the resulting activator - rich solution , 1 ml was added to a liter of water which had been in contact with air , the water containing 5 to 6 mg of oxygen per liter . the mixture was immediately transferred to a measuring device to determine the amount of oxygen . the ph - value of the oxygen - containing water was regulated with alkali and remeasured after adding the activated hydrazine . the tests were performed at 293 ° k . the results are illustrated in table 1 . an activator - rich hydrazine solution prepared in accordance with example 1 with 1 g . of activator per liter was mixed into oxygen - containing water as described . after reduction of the dissolved oxygen , the water was gassed for 10 minutes by adding air , again provided with oxygen . this process was repeated several times . the oxygen content was determined immediately after gassing and again after a 10 minute reaction time . for comparison purposes , hydrazine solutions with organic activators and iodine were tested in the same way . the results are illustrated in table 2 . 500 ml of water was added to a closable retort , containing air with a capacity of 2 , 000 ml with 15 ml of activated hydrazine having been added to the water , and with the hydrazine containing 1 g . of activator per liter . the solution in the retort had an initial concentration of 6 g . hydrazine per liter . after closing the retort , it was shaken for one hour at room temperature . thereafter , a sample was taken from the gas phase and examined for its oxygen content , in accordance with well - known methods . the oxygen content in the remaining air dropped to 12 . 5 volume percent when using hydroquinone , to 6 . 5 volume percent when using hexaminocobalt ( iii )- chloride , to 6 volume percent when using sodium hexanitritocobalt ( iii ) and to 14 volume percent when using commercial products with organic activators . table 1______________________________________ activator o . sub . 2 - concentration concentra - following 10 min . tion ph - reaction timeactivator in g / l value in mg o . sub . 2 / l______________________________________1 . ( co ( nh . sub . 3 ). sub . 6 cl . sub . 3 0 . 5 10 . 6 3 . 3 1 . 0 10 . 6 2 . 6 1 . 6 10 . 6 1 . 8 2 . 1 10 . 6 1 . 8 2 . 7 10 . 6 1 . 72 . ( co ( nh . sub . 3 ). sub . 5 cl ) cl . sub . 2 1 . 0 10 . 6 1 . 6 1 . 0 9 . 4 3 . 03 . ( co ( nh . sub . 3 ). sub . 5 co . sub . 3 ) no . sub . 3 1 . 1 10 . 6 0 . 3 1 . 1 9 . 3 2 . 54 . na . sub . 3 ( co ( no . sub . 2 ) 6 ) 1 . 6 10 . 6 1 . 2 1 . 6 9 . 3 2 . 5 2 . 0 10 . 5 0 . 8 3 . 0 10 . 5 0 . 25 . mixture of 1 and 1 . 5 10 . 5 2 . 7 4 ratio 1 : 1 1 . 5 9 . 4 3 . 06 . iodine 0 . 02 10 . 8 4 . 3 0 . 2 10 . 8 4 . 3 1 . 0 10 . 8 4 . 37 . without -- 10 . 4 5 . 2______________________________________ table 2__________________________________________________________________________ o . sub . 2 content before o . sub . 2 content o . sub . 2 content o . sub . 2 content o . sub . 2 content o . sub . 2 content adding hydrazine following 10 min following 1st following 10 min following following 10 minactivatorph - value in mg / l reaction time gassing reaction time gassing reaction__________________________________________________________________________ time1 10 . 4 5 . 0 1 . 8 2 . 2 0 . 05 1 . 7 0 . 029 . 3 4 . 9 3 . 5 3 . 5 2 . 0 2 . 5 1 . 02 10 . 5 5 . 0 1 . 5 3 . 1 0 . 3 2 . 2 0 . 059 . 5 5 . 0 2 . 5 2 . 9 0 . 5 1 . 8 0 . 18 . 6 5 . 1 3 . 3 4 . 2 2 . 9 4 . 0 1 . 53 10 . 5 5 . 1 0 . 2 2 . 2 0 . 5 3 . 5 1 . 89 . 5 4 . 5 2 . 7 4 . 4 3 . 5 4 . 4 4 . 34 0 . 5 4 . 6 0 . 2 1 . 1 0 . 2 2 . 0 0 . 49 . 5 4 . 7 1 . 7 4 . 1 3 . 2 4 . 3 4 . 05 10 . 5 4 . 5 4 . 5 4 . 6 4 . 5 4 . 8 4 . 89 . 5 4 . 5 4 . 4 4 . 5 4 . 5 4 . 7 4 . 7__________________________________________________________________________ o . sub . 2 content o . sub . 2 content o . sub . 2 content o . sub . 2 content o . sub . 2 content o . sub . 2 content following 3rd following 10 min following following 10 min following 5th following 10 min . activatorph - value gassing reaction time 4th gassing reaction time gassing reaction__________________________________________________________________________ time1 10 . 4 1 . 5 0 . 02 2 . 1 0 . 02 2 . 0 0 . 029 . 3 2 . 2 0 . 5 2 . 2 0 . 2 2 . 2 0 . 052 10 . 5 1 . 9 0 . 02 1 . 8 0 . 02 1 . 9 0 . 029 . 5 1 . 0 0 . 02 0 . 8 0 . 02 0 . 9 0 . 028 . 6 3 . 1 0 . 3 2 . 4 0 . 1 2 . 3 0 . 13 10 . 5 4 . 4 4 . 1 4 . 7 4 . 4 4 . 3 4 . 59 . 5 4 . 5 4 . 3 4 . 4 4 . 3 4 . 4 4 . 34 10 . 5 2 . 8 3 . 3 4 . 4 4 . 2 4 . 5 4 . 49 . 5 4 . 6 4 . 4 4 . 5 4 . 3 4 . 6 4 . 45 10 . 5 4 . 9 4 . 9 5 . 1 5 . 1 5 . 1 5 . 19 . 5 4 . 8 4 . 8 5 . 0 5 . 0 5 . 1 5 . 1__________________________________________________________________________ 1 = ( co ( nh . sub . 3 ). sub . 6 ) cl . sub . 3 2 = na . sub . 3 ( co ( no . sub . 2 ). sub . 6 ) 3 = commercial product with organic activator system 4 = hydroquinone 5 = iodine	2
the copolyesters of this invention are prepared by reacting a diol component with a diacid component . the preferred copolyesters of this invention utilize phenyl hydroquinone in their diol component . in fact , the diol component utilized in making such copolyesters will contain from about 80 to about 99 mole percent phenyl hydroquinone . it is preferred for the diol component in such polyesters to contain from about 90 to about 98 mole percent phenyl hydroquinone and it is more preferred for them to contain from about 93 to about 97 mole percent phenyl hydroquinone . the diol component utilized in making the preferred copolyesters of this invention will also contain from about 1 to about 20 mole percent of at least one member selected from the group consisting of 1 , 4 - bis ( 4 - hydroxycumyl ) benzene , 1 , 3 - bis ( 4 - hydroxycumyl ) benzene , alkyl substituted 1 , 4 - bis ( 4 - hydroxycumyl ) benzene , and alkyl substituted 1 , 3 - bis ( 4 - hydroxycumyl ) benzene . such copolyesters will preferably contain from about 2 to about 10 mole percent of such diol and will more preferably contain from about 3 to about 7 mole percent of such diols . the alkyl substituted 1 , 4 - bis ( 4 - hydroxycumyl ) benzenes which can be utilized have the structural formula : ## str1 ## wherein r 1 , r 2 , r 3 , r 4 , r 5 , r 6 , r 7 and r 8 can be the same or different and represent hydrogen atoms or alkyl groups containing from 1 to 10 carbon atoms . in most cases , r 1 , r 2 , r 3 , r 4 , r 5 , r 6 , r 7 , and r 8 will represent hydrogen atoms or alkyl groups containing from 1 to 4 carbon atoms . some representative examples of such alkyl substituted 1 , 4 - bis ( 4 - hydroxycumyl ) benzenes include 1 , 4 - bis ( 2 , 3 , 5 , 6 - tetramethyl - 4 - hydroxycumyl ) benzene , 1 , 4 - bis ( 3 , 5 - dimethyl 4 - hydroxycumyl ) benzene and 1 , 4 - bis ( 3 , 4 - diethyl 4 - hydroxycumyl ) benzene . the alkyl substituted 1 , 3 - bis ( 4 - hydroxycumyl ) benzenes that can be utilized have the structural formula : ## str2 ## wherein r 1 , r 2 , r 3 , r 4 , r 5 , r 6 , r 7 , and r 8 represent hydrogen atoms or alkyl groups containing from 1 to 10 carbon atoms . in most cases , r 1 , r 2 , r 3 , r 4 , r 5 , r 6 , r 7 , and r 8 will represent hydrogen atoms or alkyl groups containing from 1 to 4 carbon atoms . some representative examples of suitable alkyl substituted 1 , 3 - bis ( 4 - hydroxycumyl ) benzenes include : 1 , 3 - bis ( 2 , 3 , 5 , 6 - tetramethyl 4 - hydroxycumyl ) benzene , 1 , 3 - bis ( 3 , 5 - dimethyl 4 - hydroxycumyl ) benzene and 1 , 3 - bis ( 3 , 5 - diethyl 4 - hydroxycumyl ) benzene . the diacid component utilized in preparing the copolyesters of this invention will contain at least about 90 mole percent terephthalic acid . the diacid component can optionally contain up to about 10 mole percent isophthalic acid . thus , the diacid component utilized in preparing the copolyesters of this invention is comprised of from about 90 to about 100 mole percent terephthalic acid and from 0 to about 10 mole percent isophthalic acid . in an alternative embodiment of the subject invention , an aromatic hydroxy acid selected from the group consisting of hydroxybenzoic acid and hydroxynaphthoic acid is utilized in conjunction with or in lieu of the phenyl hydroquinone . in such copolyesters , the mole ratio of aromatic hydroxy acid to diol is within the range of about 80 : 20 to about 99 : 1 . such copolyesters are made by polymerizing ( a ) the aromatic dihydroxy acid : ( b ) at least one diol selected from the group consisting of 1 , 4 - bis ( 4 - hydroxycumyl ) benzene , 1 , 3 - bis ( 4 - hydroxycumyl ) benzene , alkyl substituted 1 , 4 - bis ( 4 - hydroxycumyl ) benzenes , and alkyl substituted 1 , 3 - bis ( 4 - hydroxycumyl ) benzenes ; and ( c ) a diacid component which is comprised of terephthalic acid and optionally up to about 10 mole percent isophthalic acid . the copolyesters of this invention can be synthesized utilizing conventional polymerization techniques which are well known to those skilled in the art . for instance , the copolyesters of this invention can be prepared by melt diacetate polymerization , melt diphenyl ester polymerization , in situ melt polymerization , solution polymerization or interfacial polymerization . the in situ melt diacetate polymerization process is generally the preferred technique for synthesizing the copolyesters of this invention . it is generally appropriate to prepare the copolyesters of this invention utilizing the same equipment and same general procedures as are utilized by persons skilled in the art of preparing aromatic polyesters . thus , conventional temperatures , catalysts , amounts of catalysts , stabilizers and the like , are used in manners well known in the literature and art . for instance , a two step process can be utilized in preparing the aromatic copolyesters of this invention . in the first step , the diol component and diacid component can be heated to a temperature which is within the range of about 200 ° c . to about 300 ° c . under an inert gas atmosphere , such as nitrogen or a noble gas . for economic reasons , nitrogen will normally be utilized . this polymerization reaction can be carried out in the presence of appropriate catalysts such as titanium alkoxides , sodium acetate , tin acetate , and the like . in the second step , a polycondensation reaction can be carried out under a reduced pressure of less than about 0 . 5 mm of mercury ( 66 . 7 pascals ) at a temperature which is typically within the range of about 300 ° c . to about 400 ° c . the polymerization time required will vary with the amount and type of catalyst used as well as the polymerization temperature utilized . it will also depend somewhat upon the desired molecular weight of the aromatic copolyester being synthesized . the copolyesters of this invention are , of course , comprised of repeat units which are derived from the monomers ( the diol component and the diacid component ) utilzed in their preparation . for instance , a copolyester which is prepared by polymerizing phenyl hydroquinone , 4 , 4 - bis ( 4 - hydroxycumyl ) benzene , and terephthalic acid will have the structural formula : ## str3 ## wherein φ represents a phenyl group and wherein indicates that the repeat units which are derived from phenyl hydroquinone and 1 , 4 - bis ( 4 - hydroxycumyl ) benzene can be distributed throughout the polymer chain in random order . the aromatic copolyesters of this invention typically have a number average molecular weight of at least about 5 , 000 . such aromatic copolyesters generally have a number average molecular weight which is within the range of about 5 , 000 to about 100 , 000 . the aromatic copolyesters of this invention preferably have a number average molecular weight which is within the range of about 10 , 000 to about 60 , 000 . in most cases , it will be preferred for the aromatic copolyesters of this invention to have a number average molecular weight which is within the range pf about 15 , 000 to about 40 , 000 . the aromatic copolyesters of this invention can be molded into a wide variety of useful articles utilizing standard molding techniques well known to persons skilled in the art . the aromatic copolyesters of this invention can , of course , also be spun into fiber utilizing known techniques . for instance , the aromatic copolyesters of this invention can be melt spun utilizing equipment and techniques which are utilized in melt spinning pet . the filaments produced can be subjected to thermal treatment in order to further enhance the physical properties of the fibers . the fibers can then be utilized in the preparation of tire cords or reinforcements for other rubber articles such as belts or hoses . this invention is illustrated by the following examples which are merely for the purpose of illustration and are not to be regarded as limiting the scope of the invention or the manner in which it can be practiced . unless specifically indicated otherwise , parts and percentages are given by mole percent . in this experiment an aromatic copolyester was prepared utilizing an in situ melt diacetate polymerization technique . in the procedure used , a polymerization reactor was charged with 17 . 97 grams of phenyl hydroquinone , 1 . 21 grams of 1 , 4 - bis ( 4 - hydroxycumyl ) benzene , and 30 ml of acetic anhydride . the reactants were heated to 140 ° c . and the reactants were allowed to reflux for 15 minutes . acetic acid was formed by the reaction which took place and 11 . 4 ml of acetic acid was removed from the reaction mixture by distillation . residual acetic anhydride was removed from the reaction mixture by vacuum distillation . after removal of the excess acetic anhydride was completed , 16 . 61 grams of terephthalic acid was added to the reaction mixture . the polymerization reactor was heated to about 270 ° c . until 11 . 4 ml of acetic acid had been evolved . the pressure in the polymerization reactor was then gradually reduced to 0 . 1 mm of mercury ( 13 . 3 pascals ) and the temperature was increased to 350 ° c . the reaction mixture was stirred until a high melt viscosity polymer was obtained . the aromatic copolyester which was synthesized was dried and melt spun utilizing a fiber extrusion device for small polymer samples . the extrusion device forced the aromatic copolyester through a spinneret hole having a diameter of 0 . 009 inches ( 0 . 023 centimeters ) at a temperature of 350 ° c . and under a pressure of 250 lbs . per square inch ( 1 . 7 × 10 6 pascals ). the fiber extrusion device was operated at a windup speed of 265 meters per minute ( mpm ). the filament produced was determined to have an average denier of 20 , an average tenacity of 5 . 8 grams per denier , an average elongation of 2 . 2 %, and an average initial modulus of 300 grams per denier . filament samples were heat treated on a metal rack in a flowing nitrogen stream at a maximum temperature of 330 ° c . for 14 hours . it took about 4 hours to heat the filament from 25 ° c . to 330 ° c . and about 1 hour to cool the filaments from 330 ° c . back to 25 ° c . for a total treatment time of 19 hours . after this heat treatment , the filaments had an average denier of 20 , an average tenacity of 11 grams per denier , an average elongation of 4 . 4 %, and an average initial modulus of 340 grams per denier . the best filament made had a tenacity of 28 grams per denier , an initial modulus of 700 grams per denier and an elongation to break of 5 . 5 %. in this experiment , aromatic copolyesters containing various amounts of phenyl hydroquinone , 1 , 4 - bis ( 4 - hydroxycumyl ) benzene , terephthalic acid , and isophthalic acid were prepared utilizing the polymerization technique disclosed in example 1 . the aromatic copolyesters synthesized were then extruded into fibers utilizing the technique described in example 1 and compared with fibers made utilizing pet and two known anisotropic melt polyesters ( a homopolyester which was comprised of repeat units which were derived from phenyl hydroquinone and terephthalic acid and a copolyester which was comprised of repeat units which were derived from 1 , 4 - hydroxybenzoic acid and 2 , 6 - hydroxynaphthoic acid ). the tenacity , elongation and modulus of the fibers prepared is reported in table i . table i______________________________________ tenacity elongation modulusex . composition * ( gpd ) (%) ( gpd ) ______________________________________1 96 . 5 phq / 3 . 5 bhcb -- 11 4 . 4 340100t2 96 . 5 phq / 3 . 5 bhcb -- 9 . 4 5 . 2 25098 . 25t / 1 . 75i3 ** 90 phq / 10 bhcb -- 7 . 0 6 . 0 22095t / 5i4 pet 8 . 4 20 955 100 phq -- 100t 13 3 . 3 3806 40 hba / 60 hna 11 3 . 0 350______________________________________ * phq = phenyl hydroquinone bhcb = 1 , 4bis ( 4 - hydroxycumyl ) benzene t = terephthalic acid i = isophthalic acid hba = 1 , 4hydroxybenzoic acid hna = 2 , 6hydroxynaphthoic acid ** a filament made in example 3 was determined to have an elongation to break of 8 %. the diacid component utilized in preparing the aromatic copolyester of example 1 contained 96 . 5 mole percent phenyl hydroquinone and 3 . 5 mole percent 1 , 4 - bis ( 4 - hydroxycumyl ) benzene . the diacid component utilized in preparing example 1 contained 100 mole percent terephthalic acid . the diol component utilized in preparing the aromatic copolyester of example 2 contained 96 . 5 mole percent phenyl hydroquinone and 3 . 5 mole percent 1 , 4 - bis ( 4 - hydroxycumyl ) benzene . the diacid component utilized in the preparation of the aromatic copolyester of example 2 contained 98 . 25 mole percent terephthalic acid and 1 . 75 mole percent isophthalic acid . the aromatic copolyester prepared in example 3 was prepared utilizing a diol component which contained 90 mole percent phenyl hydroquinone and 10 mole percent 1 , 4 - bis ( 4 - hydroxycumyl ) benzene . the diacid component utilized in the preparation of the copolyester of example 3 contained 95 mole percent terephthalic acid and 5 mole percent isophthalic acid . the diacid component utilized in the preparation of the polyester of example 5 contained 100 mole percent phenyl hydroquinone and the diacid component utilized in the preparation of the polyester of example 5 contained 100 mole percent terephthalic acid . the hydroxyacid components utilized in example 6 were comprised of 40 mole percent 1 , 4 - hydroxybenzoic acid and 60 mole percent 2 , 6 - hydroxynaphthoic acid . as can be seen by comparing examples 1 , 2 , and 3 with example 4 , fibers which are made utilizing the aromatic copolyesters of this invention have a much higher modulus than do fibers which are made utilizing pet . in fact , the fibers made utilizing the aromatic copolyesters of this invention had a modulus which was twice as great as the modulus of fibers which were made utilizing pet . as can be seen by comparing examples 1 , 2 , and 3 with examples 5 and 6 , fibers which were made utilizing the aromatic copolyesters of this invention had a greater elongation and toughness than did fibers which were made utilizing known anisotropic melt polyesters . this means that tire cords which are made utilizing the aromatic copolyesters of this invention will have a better flex life than will tire cords which are made utilizing known anisotropic melt polyesters . these comparative experiments show that tire cords made utilizing the aromatic copolyesters of this invention will have a greater modulus than will tire cords which are made utilizing pet . such tire cords which are made utilizing the aromatic copolyesters of this invention will also have a better flex life than will tire cords which are made utilizing known anisotropic melt polyesters . for these reasons , tire cord can be made utilizing the copolyesters of this invention which have a better overall combination of properties than do tire cords which are made utilizing pet or known anisotropic melt polyesters . examples 5 and 6 were included to show that it is necessary to incorporate a small amount of 1 , 4 - bis ( 4 - hydroxycumyl ) benzene into the aromatic copolyester in order to achieve acceptable elongation . in fact , the elongation observed in examples 5 and 6 was less than that attained utilizing the copolyesters of this invention ( see examples 1 , 2 and 3 wherein an elgonation within the range of 4 . 4 % to 6 % was attained ). thus , it is necessary to include 1 , 4 - bis ( 4 - hydroxycumyl ) benzene in the diol component in order to prepare aromatic copolyesters which can be manufactured into tire cords which have improved flex life over that attained when utilizing known anisotropic melt polyesters . while certain representative embodiments have been shown for the purpose of illustrating the present invention , it will be apparent to those skilled in this art that various changes and modifications can be made therein without departing from the scope of the present invention .	3
the present invention addresses and solves problems related to the improvement of device performance for soi devices . the present invention achieves this , in part , by the partial replacement of the isolation oxide underneath and between the silicon islands by a different material . in certain embodiments of the invention , an undercutting etch is performed through the gaps between the silicon islands and the silicon layer to etch the buried oxide layer in an undercutting manner . following the etch of the buried oxide layer , a material is deposited within the gaps and the recesses formed in the buried oxide layer . the material is chosen to provide a desired amount of stress , either tensile or compressive , into the silicon islands to induce a net amount of strain in the silicon film . the strained silicon has enhanced carrier mobility , thereby improving the device performance of devices formed on the strained silicon . [ 0018 ] fig1 depicts a schematic , cross - section of a precursor for a soi device , constructed in accordance with embodiments of the present invention . the precursor includes a substrate 10 , which may be a silicon substrate , for example , on top of which is formed a buried oxide layer 12 . a silicon film , or layer 14 , is formed on the buried oxide layer 12 . the precursor may be formed in a conventional manner . in fig2 trenches 16 have been etched into the silicon layer 14 . a conventional etching technique and chemistry is employed to etch the silicon layer 14 and stop on the buried oxide layer 12 . the trenches 16 separate the soi layer 14 into silicon islands 18 . the etching performed is a conventional anisotropic etch , for example , that produces vertical sidewalls on the silicon islands 18 . the anisotropic etch may be a reactive ion etch ( rie ) that directionally etches the silicon layer 14 . the width of the silicon islands 18 is selected in accordance with conventional techniques . following the etching of the trenches 16 into the silicon layer 14 to create the islands 18 , the buried oxide layer 12 is etched with an undercutting etch process . in fig3 the results of the undercutting etch is depicted . a conventional etching technique may be performed to etch the buried oxide layer 12 . a moderately anisotropic technique may be employed such that undercutting ( as indicated at 20 ) is exhibited in the buried oxide layer 12 . hence , with the etching thus performed , recesses 22 are created within the buried oxide layer 12 . the recesses 22 include portions that are directly beneath the trenchesl 6 in the silicon oxide layer 14 , and portions that are underneath the silicon islands 18 . the etching proceeds through the trenches 16 into the buried oxide layer 12 , and the etching is allowed to proceed until the undercuts 20 are produced in the buried oxide layer 12 . an isotropic process may also be employed , or a moderately anisotropic process may be employed alternatively . the amount of undercutting may be controlled to influence the amount of strain in the silicon islands 18 . in other words , in addition to selecting the material to be deposited , the size of the recess 22 created in the buried oxide layer 12 will have an effect on the strain induced in the silicon islands . having formed the recesses 22 in the buried oxide layer 12 , and the trenches 16 between the silicon islands 18 , a new material is introduced that replaces the oxide that has been etched from the buried oxide layer 12 . a conventional deposition technique , such as plasma enhanced chemical vapor deposition ( pecvd ) may be employed to deposit the material 24 into the recesses 22 and the trenches 16 . the material is selected according to the material &# 39 ; s intrinsic properties that will affect the net amount of strain induced in the silicon islands 18 . as an exemplary material , nitride may be used to fill the recesses 22 and the gaps formed by the trenches 16 . due to its intrinsic properties , nitride provides a tensile stress in the depicted structure of fig4 . other materials may be chosen that provide different amounts of tensile stress , or a different type of stress , such as compressive stress . those of ordinary skill in the art may select the appropriate material based upon the intrinsic properties of the material to produce a desired amount and type of stress . the material 24 is planarized by a conventional planarization technique , such as chemical mechanical polishing ( cmp ), to produce the structure of fig4 . the stress provided by the replacement material 24 in the structure of fig4 induces a net amount of strain in the silicon islands 18 . this net amount of strain modifies the electrical properties of carriers in the silicon film in the silicon islands 18 . hence , the device performance of the soi devices that are subsequently formed will be improved . [ 0023 ] fig5 shows the structure of fig4 after semiconductor devices 26 are formed on the silicon islands 18 . due to the strained silicon of the silicon islands 18 , induced by the replacement material 24 in the buried oxide layer 12 and between the silicon islands 18 , there is improved channel mobility in the devices 26 so that the devices exhibit increased performance . these materials are exemplary only , as other materials may be used without departing from the spirit and the scope of the present invention . another aspect provides a method for reducing gate dielectric leakage by differential gate dielectric thicknesses . gate dielectric leakage is the most around the drain and source areas , while in the middle of the channel , it is four or five orders of magnitude less . since the tunneling is exponentially dependent on dielectric thickness , a thicker dielectric is needed at the source / drain edge to suppress gate leakage . a thin dielectric is needed elsewhere to increase gate control of the channel inversion . after annealing the extension implants , gate oxide is etched from the side in buffered hf solution that has a very controllable etch rate . a lateral etch to the edge of the extension junction is performed . next , both the gate and the silicon are oxidized at a low temperature ( e . g ., & lt ; 750 ° c . to prevent extension dopant diffusion . doped polysilicon and n + si will oxidize much faster than lightly doped p - channel . after the oxidation , 25 to 30 angstroms thick dielectric is formed over the n + regions . the thickness will drastically reduce large leakage and also reduce miller capacitance . the process follows by spacer formation , source / drain implant and silicidation . the process is depicted in fig6 and 7 . although the present invention has been described and illustrated in detail , it is to be clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation , the scope of the present invention being limited only by the terms of the appended claims .	7
fig1 shows a sectional side view of the outside of the sliding sleeve valve ( 10 ) of my invention installed in a drill hole . my valve comprises a tubular main body ( 12 ) that is threaded at both ends ( 14 ) and ( 16 ). threaded ends ( 14 ) and ( 16 ) are adapted to thread into a tube string ( 18 a ) and ( 18 b ) respectively at any position along the tube string . the tubular body has an apertured portion ( 15 ) to permit fluid communication between the drill bore annulus ( 17 ) and the centre of the tube string ( 18 ). referring to fig2 there is shown a disassembled sectional view of the tubular main body ( 12 ) of my invention . tubular body ( 12 ) is fabricated as three separate segments . there is a top segment ( 20 ), a middle segment ( 22 ) and a bottom segment ( 24 ). top segment ( 20 ) has an upper internally threaded section ( 26 ) adapted to receive a threaded end of the tube string ( 18 a ). the opposite end ( 30 ) of top segment ( 20 ) has an internally threaded section ( 32 ) adapted to receive threads ( 34 ) from the middle segment ( 22 ). middle segment ( 22 ) comprises identical upper ( 34 ) and lower ( 36 ) externally threaded portions and a middle apertured portion ( 38 ). upper ( 34 ) and lower ( 36 ) threads are adapted to receive threads from the bottom ( 30 ) of top segment ( 20 ) and the top portion ( 40 ) of bottom segment ( 24 ). bottom segment ( 24 ) comprises a top internally threaded portion ( 40 ) adapted to receive middle segment external threads ( 36 ) and a bottom - threaded portion ( 42 ) adapted to receive threads ( 44 ) of the tube string ( 18 b ). the main body ( 12 ) can be easily transported to a well site and easily threaded together onto the tubing string . referring to fig3 and specifically to fig3 a , there is shown a closing sleeve ( 46 ) of one embodiment of my invention . the closing sleeve is non - segmented hollow tube having an upper portion ( 48 ) a lower portion ( 50 ), an apertured portion ( 52 ), an upper ported portion ( 54 a ) having equalization ports ( 58 a ) and a lower ported portion ( 54 b ) having equalization ports ( 58 b ). apertures ( 56 ) are adapted to communicate with apertures ( 15 ) in the main body ( 12 ). when in communication , apertures ( 56 ) and ( 15 ) permit a flow of fluids between the annulus ( 17 ) and the production tubing string ( 18 ). equalization ports ( 58 a ) are adapted to permit fluid flow across the valve body so that pressure outside the valve body and inside the valve body are equalized before the main flow apertures ( 15 ) and ( 56 ) communicate or cease communication . this serves to reduce the pressure differential across the assembly , facilitate movement of the tool string and reduce pressure on the seals . fig3 b shows the closing sleeve in cross - section . referring now to fig4 there is shown one embodiment of my invention ( 10 ) where the closing sleeve ( 46 ) is shown positioned within the main body ( 12 ) of the valve . the valve is shown in its open configuration wherein apertures ( 15 ) of the valve body ( 12 ) are in communication with the apertures ( 56 ) of the closing sleeve ( 46 ). it is understood by those skilled in the art that the closing sleeve is controllably connected to the surface of the well by wire line or hydraulically operated tool string . referring to fig5 there is shown a detailed disassembled sectional side view of the main valve body ( 12 ) illustrating various innovative features of my invention . top segment ( 20 ), middle segment ( 22 ) and bottom segment ( 24 ) are shown in a disassembled configuration . the bottom end ( 30 ) of top segment ( 20 ) has machined into it recess ( 59 a ), shoulder ( 60 a ), threads ( 61 a ) and bevel ( 62 a ). similarly , the top end ( 40 ) of bottom segment ( 24 ) has machined into it recess ( 59 b ), shoulder ( 60 b ), threads ( 61 b ) and bevel ( 62 b ). middle segment ( 22 ) of the main body ( 12 ) has an inside surface ( 68 ) and an outside surface ( 70 ). machined into the inside surface ( 68 ) of middle segment ( 22 ) are channels ( 72 a ) and ( 72 b ). the channels ( 72 ) are identical and equally spaced above and below the fluid flow apertured section ( 15 ). machined into the outside surface ( 70 ) of middle segment ( 22 ) are channels ( 74 a ) and ( 74 b ) equally spaced above and below the fluid flow apertured section ( 15 ) with channel ( 74 a ) immediately below thread ( 63 a ) and channel ( 74 b ) immediately above thread ( 63 b ). referring now to fig6 there is shown in cross sectional view an assembled sliding sleeve valve ( 10 ) of one embodiment of my invention . closing sleeve ( 46 ) is positioned within the valve body ( 12 ). the valve is shown in a closed position so that fluid flow apertures ( 56 ) are not in communication with fluid flow apertures ( 15 ) of the main body . similarly , equalization ports ( 58 a ) are not in communication with fluid flow apertures ( 15 ) of the main body . further illustrated in fig6 is the novel triple seal configuration of my invention . as previously discussed , one operation scenario using the sliding sleeve valve involves the internal pressure in the pipe string ( 18 ) being much greater than the fluid pressure in the annulus of the bore hole ( 17 ). this causes a potential leakage pathway between the tube string ( 18 ) through closed apertures ( 56 ) and collet slots ( 102 ) along the surface ( 100 ) of the closing sleeve ( 46 ) and past the made threads ( 63 b and 61 b ) joining segments ( 22 ) and ( 24 ) and made threads ( 61 a and 63 a ) joining segments ( 20 ) and ( 22 ). in this operation scenario , triple redundancy sealing is provided as follows : a . a first ( primary ) seal in the leakage pathway along surface ( 100 ) is provided by o - ring ( 91 a ) and ( 91 b ) between the surface ( 100 ) of the closing sleeve ( 46 ) and the inside surface of recesses ( 59 a ) and ( 59 b ) of segments ( 20 ) and ( 24 ); b . a second ( secondary ) seal in the leakage pathway is provided by vee - stacks ( 80 b and 80 c ) set within recesses ( 59 a and 59 b ) respectively abutting against the top and bottom ends of segment ( 22 ). pressure on the vee seal stacks will cause the seals to butt firmly in a sealing relationship against the top and bottom ends of segment ( 22 ); c . a third ( tertiary ) seal in the leakage pathway is provided by o - ring seals ( 92 a ) and ( 92 b ) within channels ( 72 a ) and ( 72 b ) respectively to seal the leakage pathway along the outside face ( 100 ) of the closing sleeve ( 46 ) and the apertures ( 15 ). the third seal also comprises o - ring seals ( 94 a ) and ( 94 b ) within cavities ( 96 a ) and ( 96 b ) respectively to seal the threaded joints between segments ( 20 ) and ( 22 ) and segments ( 22 ) and ( 24 ); in a second operating scenario , the annulus ( 17 ) is at a greater fluid pressure than the tube string ( 18 ). the potential leakage pathway exists from the annulus into the tube string through apertures ( 15 ) and between the threaded joints of segments ( 20 ) and ( 22 ) and segments ( 22 ) and ( 24 ). in this scenario , triple redundancy sealing is provided by : a . a first ( primary ) seal in the leakage pathway is provided by o - rings ( 92 a ) and ( 92 b ) in channels ( 72 a ) and ( 72 b ) respectively , positioned between aperture ( 15 ) and the outside face ( 100 ) of closing sleeve ( 46 ) and o - rings ( 94 a ) and ( 94 b ) within cavities ( 96 a ) and ( 96 b ) respectively sealing the pathway between the threaded joints of segments ( 20 ) and ( 22 ) and segments ( 22 ) and ( 24 ); b . a second ( secondary ) seal in the leakage pathway along surface ( 100 ) is provided by o - rings ( 91 a ) and ( 91 b ) between surface ( 100 ) of the closing sleeve ( 46 ) and the inside surface of recesses ( 59 a ) and ( 59 b ) of segments ( 20 ) and ( 24 ); c . a third ( tertiary ) seal in the leakage pathway is provided by vee - stack seals ( 80 a and 80 d ) set within recesses ( 59 a ) and ( 59 b ) and abutting against shoulders ( 60 a ) and ( 60 b ) respectively sealing between surface ( 100 ) of closing sleeve ( 46 ) and the inside surface of segments ( 20 ) and ( 24 ). referring to fig7 there is shown a detailed view of vee - stack seals ( 80 a and 80 b ) in combination with o - ring seal ( 91 a ). the vee - stack seal comprises a top ( 82 a ) and bottom ( 84 a ) female adapter rings . adapter rings are may be fabricated from 4140 l - 80 stainless steel and are preferably fabricated from 9cr1mo or 13 cr stainless steel . the inside surface of the adapter rings are grooved ( 86 ) to accept vee - seal packs ( 80 a ) and ( 80 b ). preferably the vee - seal packs are made from a suitable elastomeric compound . one example is moly / carbon teflon ® seal packs . the seal packs may also be made from a combination of viton ™ and ryton ™ substances . o - ring ( 91 a ) is sandwiched between the seal packs ( 80 a ) and ( 80 b ). the o - ring is preferably a viton ® 90 duro o - ring but it may also be any of the elastomeric compounds suitable for the down hole service environment such as nitrile ™, aflas ™, kalrez ™, neoprene ™, flourosilicon or epdm . referring back to fig5 and fig6 seals ( 92 a ) and ( 92 b ) are placed within channels ( 72 a ) and ( 72 b ) respectively . seals ( 92 a ) and ( 92 b ) are preferably viton ® 90 duro o - rings . since the o - rings are made from an elastomeric material , they can be easily placed within the channels during assembly . once placed in the channel , the resiliency of the o - ring keeps it in place during assembly operations . one advantage of my invention is the fact that these o - rings may be changed to suit cold weather operations , hot well operations and varying well conditions . a typical o - ring suitable for cold weather operations may be 70 duro viton ™. seals ( 94 a ) and ( 94 b ) are placed into channels ( 74 a ) and ( 74 b ) respectively located on the outside surface of middle segment ( 22 ). once the main body ( 12 ) is assembled from its three segments , bevels ( 62 a ) and ( 62 b ) and channels ( 74 a ) and ( 74 b ) are positioned adjacent to each other to form cavities ( 96 a ) and ( 96 b ) in which seals ( 94 a ) and ( 94 b ) respectively will sit . as the top ( 20 ) and bottom ( 24 ) segments are threaded onto middle segment ( 22 ) the seals ( 94 a ) and ( 94 b ) are compressively maintained within the cavity ( 96 a ) and ( 96 b ) thus providing an effective seal against undesired fluid flow at joints ( 98 a ) and ( 98 b ). still referring to fig6 the top ( 80 a and 80 b ) and bottom ( 80 c and 80 d ) vee stack seals , seals ( 91 a ) and ( 91 b ) and seals ( 92 a ) and ( 92 b ) are in sliding contact with the outside surface ( 100 ) of closing sleeve ( 46 ). it is understood that the tolerances between the outside surface ( 100 ) of closing sleeve ( 46 ) and the inside surface of the main valve body must be within concentricity tolerances to allow the easy sliding movement of the closing sleeve within the main body of the valve while being sufficiently small to prevent seal extrusion and so that the seals will be effective in preventing undesired fluid flows along the sliding pathway . however , even small tolerances with high operating pressures may encourage an undesirable fluid flow between the closing sleeve and the main valve body between the tube string and the annulus . therefore the seals act redundantly to prevent such a fluid flow . referring to fig8 a - 8 c the valve has a first closed position , a second open position and a third equalizing position . the third equalizing position occurs between the first open position and the second closed position . referring to fig8 a , the valve is illustrated in a closed position . the fluid flow apertures ( 56 ) of the sliding sleeve ( 46 ) are not in communication with the fluid flow apertures ( 15 ) of middle segment ( 22 ) of the main body ( 12 ). seals act together to prevent undesired fluid flows across the valve body . in fig8 b , the closing sleeve is shown moved by the tool string from its closed position to its equalizing position . fluid flow apertures ( 56 ) remain non - communicative with apertures ( 15 ). equalization ports ( 58 a ) are now in communication with flow apertures ( 15 ) allowing fluid pressure to equalize across the closing sleeve before the valve is moved to an open position . as illustrated in fig8 b , the equalization ports ( 58 a and 58 b ) are substantially smaller than the flow apertures ( 56 ) and ( 15 ) in order to restrict flow . in fig8 c the closing sleeve is shown in its full open position . apertures ( 56 ) are in full communication with apertures ( 15 ) and fluid flow is permitted between the tube string and the annulus . equalization ports ( 58 b ) acts to relieve any trapped pressure in the bottom seal system . similarly , equalization ports ( 58 a ) act to relieve any trapped pressure in the top seal system . the action of equalizing pressure and relieving trapped pressure acts to reduce the instances of pressure lock during valve opening and closing operations . 1 . take top segment ( 20 ) of main body ( 12 ) and lubricate all internal surfaces of the top segment with a suitable lubricant so that the closing sleeve ( 46 ) will slide easily within the main valve body . the lubricant is preferably a high pressure , high temperature , h2s and water resistant lubricant . the threaded portion ( 30 ) should also receive lubrication . 2 . take the closing sleeve ( 46 ) and lubricate all external surfaces of the closing sleeve with the same lubricant so that it slides easily within the main body . 3 . fully insert the closing sleeve ( 46 ) into the top segment ( 20 ) of the main valve body ( 12 ). the sliding sleeve is assembled in this manner to avoid the formation of a pressure lock between the subsequently installed seals during thread make - up of the component . once the closing sleeve is fully inserted , the end ( 51 ) of the closing sleeve will abut against shoulders ( 53 ) machined into the top segment of the valve body . the bottom portion ( 57 ) of the sliding sleeve will extend outside of the top segment ( 20 ). 4 . assemble the seals ( 80 a and 80 b ) and ( 91 a ) in combination comprising the following steps : i . obtain a top ( 82 a ) and bottom ( 84 a ) adapter ring and lubricate them on all sides ; ii . obtain and lubricate a first vee - stack ( 80 a ) and place it into the top adapter ring ( 82 a ); iii . obtain an o - ring ( 91 a ), lubricate it and place it onto the first v - stack ( 80 a ); iv . obtain and lubricate a second vee - stack ( 80 b ) place it over the o - ring ( 91 a ) so that the o - ring is sandwiched between the two adjacent vee - stacks ( 80 a and 80 b ); and , v . obtain a bottom adapter ring ( 84 a ), lubricate it and place it over the second vee - stack ( 80 b ). 5 . push assembled vee stack / o - ring combination seal onto the extending portion ( 57 ) of the closing sleeve and into the top segment ( 20 ) of the valve body so that the top of adapter ring ( 82 a ) abuts shoulder ( 60 a ) and the vee - stack / o - ring combination sits in recess ( 59 a ). 6 . measure the dimension between the bottom of the installed seal pack and the bottom of the threaded portion ( 30 ) of the bottom segment . this distance should not be less than the length of the threaded portion ( 34 ) of the middle segment ( 22 ). adjust as necessary so that the seal pack will not be compressed as the middle segment is threaded on to the top segment . this avoids lateral displacement of the seal that could impede the motion of the closing sleeve through cycles of opening and closing and prematurely weaken the seal . 8 . install o - ring ( 92 ) into channels ( 72 a ) and ( 72 b ) in the middle segment ( 22 ). 9 . obtain and lubricate o - ring seals ( 96 a ) and ( 96 b ). 10 . install seals ( 96 ) onto middle segment ( 22 ) so that the rings sit in grooves ( 74 a ) and ( 74 b ). 11 . lubricate top and bottom threads and internal sliding surfaces of the middle segment . 12 . install middle segment ( 22 ) onto the extending portion ( 57 ) of the closing sleeve and makeup threads ( 61 a ) and ( 63 a ) together so that they are and tight . 13 . obtain bottom segment ( 24 ) of main body ( 12 ) and lubricate all internal surfaces . ensure that the threads ( 61 b ) are lubricated . 14 . repeat step 4 to assemble the vee - stack / o - ring combination seal ( 80 c ), ( 91 b ) and ( 80 d ). 15 . insert the vee - seal stack / o - ring combination onto the remaining extended position of the closing sleeve . 16 . measure the distance between channel ( 74 b ) and the bottom of adapter ring ( 84 b ) to ensure that it is not greater than the distance between bevel ( 62 b ) and shoulder ( 60 b ). adjust as necessary . 17 . makeup threads ( 61 b ) and ( 63 b ) together so that they are hand tight . 18 . tighten threaded connections to a torque equal to the torque used to fasten the elements of the tubing sting together . additionally , my invention provides a method for testing the integrity of the sliding sleeve valve before it is placed into the well hole comprising the following steps : 3 . fill the pressure test mandrel with water and apply at least 5 , 000 psi for a minimum of 15 minutes . no leaks are permissible . 6 . blow excess water from the inside of the sleeve using high pressure air . prior to installing the tested valve into the tube string a suitable thread compound is placed on the threads ( 26 ) and ( 42 ). although the description above contains many specifications , these should not be construed as limiting the scope of the invention but as merely providing illustrations of some of the presently preferred embodiments of this invention . thus the scope of the invention should be determined by the appended claims and their legal equivalents rather than by the examples given .	4
fig1 is a block diagram of a digital camera 1 . this digital camera 1 has an image pickup lens 2 , an image pickup unit 3 comprising a ccd equipped with color filters that separate the image signals into data of different colors , an a / d converter 4 that performs a / d conversion of the electrical signals , a signal processor 5 that performs image processing , such as white balance adjustment and gamma correction , of the digital signals obtained by means of the components described above , a first memory 6 that temporarily stores the image data that has undergone signal processing in the signal processor 5 , switches 7 including a shutter release switch , a cpu 8 that comprises a microcomputer and that controls the operations of the components and performs processing such as image data compression or expansion or pixel data interpolation , a display memory 11 that stores the image data to be displayed on the lcd display , and an lcd display unit 12 that displays the captured image or recorded image . this digital camera 1 also has a second memory 10 that records the digital image data produced by the a / d converter 4 . in this embodiment , a memory card that is detachable from the camera is used as the second memory 10 . in fig1 , a personal computer 20 is shown as the external device to which the image data recorded in the second memory 10 is output . this personal computer 20 has a data input unit 21 to which the second memory 10 is connected and that reads the image data recorded in the second memory 10 . the image data thus read is input to the personal computer 20 . this personal computer 20 performs expansion of the image data , pixel data interpolation and monitor display based on the programs stored in its memory . a ccd whose pixels are each coated with an r , g or b color filter is used . the r , g and b filters in this ccd are aligned such that g occurs in every other pixel in both the vertical arid horizontal directions and r and b are aligned so as to form lines ( a so - called bayer type array ). the alignment of the r , g and b filters is stored and processed as filter alignment data in the digital camera 1 , which will be explained in detail below . where such a ccd is used , when image information is input to the ccd , image data comprising r , g and b pixel data is obtained , as shown in fig2 , by means of the r , g and b filters located so as to correspond to individual pixels . in order to construct a color image from this image data , the pixel data is first separated into r , g and b groups . pixels that do not have data for a given color ( gray areas in fig2 , hereinafter ‘ missing pixels ’) are interpolated using pixels for which data is properly input ( white areas in fig2 ). in this embodiment , the interpolation is performed by taking an average of the data actually obtained for pixels in a 3 × 3 - pixel area surrounding the missing pixel . through this interpolation , r , g and b complete pixel data is obtained . by overlapping the r , g and b complete pixel data , one item of image data is obtained . the signal processing sequence in a digital camera 1 having the construction described above will be explained with reference to fig3 . the digital camera 1 first controls the image pickup lens 2 ( see fig1 ) in relation to the photo object , and when an image is formed on the ccd image pickup unit 3 , the input image is converted into electrical signals ( s 1 ). in step s 2 , the electrical signals are converted through a / d conversion to form digital image data based on the alignment of the r , g and b filters located so as to correspond to individual ccd pixels . the image data is then compressed if necessary ( s 3 ), and is recorded in the second memory 10 in step s 4 . this digital camera 1 simultaneously records as filter alignment data the alignment of the r , g and b filters that are located so as to correspond to the individual pixels of the ccd image pickup unit 3 . this digital camera 1 has a preview function in which the image that entered the image pickup lens 1 is immediately displayed on the built - in lcd display unit 12 when the shutter button is pressed halfway down , for example , and during data processing when this function is present , the image data is digitally converted and is immediately subjected to pixel data interpolation without being compressed , so that the sequence follows the arrow formed by the dashed line in fig3 . the compression of image data in step s 3 in fig3 will be described in detail below with reference to fig7 . in this embodiment , the captured image or recorded image is output to the built - in lcd display unit 12 of the camera 1 or to a display connected to the personal computer 20 . when this is executed , the following additional processing is performed on the digital image data recorded in the second memory 10 . the situation in which the image is output to a display connected to the personal computer 20 will first be explained . in this embodiment , the second memory 10 comprises an ic card , and consequently , the image data and filter alignment data recorded in the second memory 10 are input to the personal computer 20 by inserting this ic card into the data input unit 21 of the personal computer 20 . this personal computer 20 has a dedicated reproduction software program that enables it to ( 1 ) read the input filter alignment data as well as the image data , ( 2 ) separate the image data into data of three different colors based on this filter alignment data , and ( 3 ) perform interpolation for missing pixels . using this program , the personal computer 20 can expand the input image data if necessary ( s 10 in fig3 ) and separates the pixel data into r , g and b groups . it then can perform missing pixel interpolation in s 11 . in this case , the user may select a desired interpolation method from among different interpolation methods incorporated as programs in the computer ( the averaging method or the median method , for example ). the r , g and b complete pixel data ( s 12 ) created through the processing described above is overlaid on itself and output on the display as a single color image . a case in which the image is output to the built - in lcd display unit 12 of the camera 1 will now be explained . here , the image data and filter alignment data recorded in the second memory 10 are read , with the ic card comprising the second memory 10 connected to the camera 1 . the cpu 8 that controls the camera ( see fig1 ) expands the image data if necessary ( s 5 in fig3 ) and separates the pixel data into r , g and b groups . it then performs interpolation for the missing pixels for each color in s 6 using an interpolation method incorporated in the camera . the r , g and b complete pixel data ( s 7 ) created through this processing is overlaid on itself and output to the lcd display unit 12 ( s 8 ) as a single color image . the built - in lcd display unit 12 of the camera 1 has much fewer pixels than the ccd of the image pickup unit 3 , but since the purpose of the image display in the lcd display unit 12 is often confirmation of the image composition and color rather than close - range image viewing , it does not pose any problems for the quality of the displayed image to be slightly lower . consequently , if a simpler method is used for the pixel data interpolation method incorporated in the camera , the circuit size or program capacity may be reduced . as can be seen from the explanation given above , in the digital camera 1 of this embodiment , the digital image data obtained through a / d conversion is recorded in the second memory 10 before it is interpolated for missing pixels for each color , i . e ., r , g and b . in this second memory 10 is also recorded the alignment of the r , g and b filters that are located so as to correspond to individual ccd pixels , as filter alignment data . therefore , in this digital camera 1 , the image data and filter alignment data are read from the second memory 10 as the image is output , and based on the filter alignment data , the image data is separated into three different colors and pixel data interpolation is performed for each color , whereupon r , g and b complete pixel data is created ( see fig4 ). by means of this construction , the r , g and b complete pixel data need not be recorded in the recording medium as it is in the example of the prior art , and the amount of data recorded in the second memory 10 may accordingly be reduced . furthermore , in this embodiment , where the image data recorded in the second memory 10 is output to the personal computer 20 , the user can select an image data interpolation method from among various interpolation methods incorporated in the personal computer 20 as programs . for example , where a more sophisticated interpolation method is programmed into the personal computer 20 , the quality of the image output to the display may be improved by selecting this method . in this embodiment , the bayer type array described above is used for the alignment of the r , g and b filters located so as to correspond to individual ccd pixels . there are four types of bayer arrays , as shown in views ( a ) through ( d ) of fig5 . the 36 pixels at the upper left corner of the ccd are shown for each type of bayer array . in the digital camera 1 , the bayer array to be used is predetermined to be one of these types ( a ) through ( d ), and filter alignment data representing that bayer array is recorded in the second memory 10 together with the image data . the present invention is not limited to this approach , however , and it is possible to set the alignment of the r , g and b filters located so as to correspond to individual ccd pixels , such that it may be changed as desired . in this case , alignment data indicating that the filter alignment represents a bayer type array , as well as the type ( a ) through ( d ) that has been adopted , will be recorded as filter alignment data recorded in the second memory 10 . further , views ( a ) and ( b ) of fig6 show special r , g and b filter alignments different from the bayer type array . in this case , the data indicating the number of pixels in the x direction of the smallest block unit that is repeated from the upper left corner of the ccd and the number of pixels in the y direction of the same block unit , as well as the pixel color data beginning from the leftmost pixel of the first row , are recorded in the second memory 10 . here , r ( red ), g , ( green ), b ( blue ), c ( cyan ), m ( magenta ), and y ( yellow ) are set as color data , for example . regarding the filter alignment shown in view ( a ) of fig6 , the smallest block unit is 3 × 3 , and the block comprises rgbbrggbr in that order beginning from the leftmost pixel of the first row . therefore , the filter alignment data is expressed as x = 3 , y = 3 ; 0 , 1 , 2 , 2 , 0 , 1 , 1 , 2 , 0 , where 0 represents red , 1 represents green and 2 represents blue . regarding the filter alignment shown in view ( b ) of fig6 , the smallest block unit is 3 × 1 and the block comprises rgb in that order beginning from the leftmost pixel . therefore , the filter alignment data is expressed as x = 3 , y = 1 ; 0 , 1 , 2 . the filter alignment data is recorded in the second memory 10 together with the image data in the same way as in the previous embodiment . using this method , special alignments of r , g and b filters located so as to correspond to individual ccd pixels can be handled . the compression of the image data ( s 3 in fig3 ) will now be explained with reference to fig7 . in this embodiment , the widely used discrete cosine transformation ( dct ) method is used to perform jpeg compression . by means of this jpeg compression , compression devices and expansion devices currently in wide use can be employed and the cost may be reduced accordingly . in this embodiment , the following processing is performed during jpeg compression . as shown in fig7 , r , g and b pixel data is aligned based on the bayer type array using the image data after a / d conversion . during compression , the r , g , and b pixel data in the image data is realigned such that a block will be formed for each color . g pixels are horizontally displaced to the left such that they will form a block accounting for half the image data , and r and b pixels are collected in the upper right side and lower right side respectively while maintaining their positional relationships in the original image data , such that pixels of each color will form a block accounting for one - quarter of the image data . the method of placement of each color block is determined in advance . y data ( i . e ., brightness data ) is deemed to be the image data comprising r , g and b color , all pixels with regard to cr and cb data ( in other words , color difference data ) are deemed ‘ 0 ’, and jpeg compression is performed using a high cr and cb thinning ratio of 4 : 1 : 1 . the image data compressed in this way is recorded in the second memory 10 together with the filter alignment data . by gathering together the r , g and b pixel data during the compression of the image data in this way , the correlations between neighboring pixels may be increased so that the rate of compression may increase . in addition , since the data conversion of r , g , and b into y , cr and cb can be simplified , the required program memory capacity may be reduced . during data expansion , the data is expanded based on the jpeg standard , and the image data can be obtained by realigning the pixel data based on the filter alignment of the original image data . the signal processing sequence in a digital camera pertaining to the second embodiment of the present invention will now be explained with reference to fig8 . in this embodiment , a recording medium that records the image data and filter alignment data is mounted in a camera 21 . therefore , where the image is to be output to an external device such as a personal computer 30 , the image data and filter alignment data are output externally either by means of a cable or by infrared communication . since the data processing in this digital camera 21 ( s 21 through s 28 ) is the same as the data processing in the digital camera 1 pertaining to the first embodiment described above ( s 1 through s 8 in fig3 ), it will not be further explained here . where the image is to be output to a display connected to the personal computer 30 , the image data and filter alignment data recorded in the second memory 10 are input to the personal computer 30 using either a cable or infrared communication in this embodiment , as mentioned above . this personal computer 20 records the input image data and filter alignment data in step s 30 . while reading the recorded image data and filter alignment data as needed , it separates the image data into three different colors and performs pixel data interpolation for missing pixels ( s 31 through s 33 ) based on the filter alignment data , as in the case of the first embodiment ( s 10 through s 12 in fig3 ). the r , g and b complete pixel data created through this processing is overlaid on itself and output on the display as a single color image . the signal processing sequence in a digital camera pertaining to a third embodiment of the present invention will be explained below with reference to fig9 . in this embodiment , emphasis is placed on compatibility , such that where the image is output externally , prior to being output the digital image data is converted into a format that may be reproduced by another reproduction device . the data processing in a digital camera 41 ( s 41 through s 48 ) is the same as the data processing in the digital camera 1 pertaining to the first embodiment previously described ( s 1 through 8 in fig3 ), and accordingly will not be further explained here . when the image is output to a personal computer 50 , the digital camera 41 separates the digital image data into pixel data of the three different colors based on the filter alignment data , and after performing interpolation for the missing pixels for each color , it compresses the r , g and b complete pixel data obtained through the interpolation ( s 49 ). the complete pixel data that comprises the image is input to the personal computer 50 using either a cable or infrared communication . at the same time , the recorded filter alignment data recorded in the recording medium in the digital camera 41 is input as well . the personal computer 50 records the r , g , and b complete pixel data and filter alignment data in step s 50 . it then reads the complete pixel data it recorded and expands it ( step s 51 ). through this processing , the r , g and b complete pixel data created in the digital camera 41 is reproduced ( s 52 ) and the image may be displayed . this personal computer 50 has a dedicated software program that enables it to read the filter alignment data input together with the r , g and b complete pixel data and to detect from the complete pixel data , based on the filter alignment data , the image data prior to the performance of interpolation for missing pixels in the digital camera 41 . through this program , the personal computer 50 converts the r , g and b complete pixel data expanded in step s 51 into pixel data , including missing pixels , based on the filter alignment data , and can then perform interpolation for these missing pixels once more in step s 53 ( see fig1 ). in this case , the user can select a desired interpolation method from among the interpolation methods incorporated in the personal computer 50 as programs . thus , a simple form of interpolation might be carried out at step s 46 in the camera 41 , whereas more sophisticated interpolation techniques can be employed at step s 53 in the personal computer 50 . the r , g and b complete pixel data created through this processing is overlaid on itself and is output on the display as a single color image . in this embodiment , it is preferred that the data compression ratio in step s 49 be set as low as possible . the present invention is not limited to these embodiments explained as examples above , but may , needless to say , be improved or changed in design in various ways within the scope of the essence of the invention . as can be seen from the explanation provided above , because the digital camera of the present invention has a data control means that separates the digital image data into pixel data of three different colors based on the filter alignment data and interpolates for missing pixels for each color , as well as a display means that reproduces the image comprising complete pixel data of the three different colors obtained by the data control means , the user can confirm the image in the built - in monitor of the camera if necessary . in addition , since the digital image data after a / d conversion is recorded on a recording medium before pixel interpolation is performed for each color , to obtain r , g and b complete pixel data , the data storage capacity of the recording medium may be reduced . further , using the present invention , when the image is output to an external device , because the image data is output after it is converted into r , g and b complete pixel data , it can be easily reproduced by an external reproduction device . moreover , since the device of the present invention has a display means to reproduce the image comprising complete pixel data of three different colors obtained from the data control means , the user may confirm the image on the built - in display unit of the camera if necessary .	7
with reference to fig2 , a wafer substrate 10 is affixed to a cleaning polymer sheet or cleaning surface 12 with the cleaning polymer sheet 12 containing discrete protruding and other surface features 14 ( shown as conical or pyramidal in fig2 ). in some embodiments , these discrete protruding surface features 14 are compressible . the wafer substrate 10 is disc shaped and is made of silicon or any other material that allows processing through wafer handling equipment . in certain embodiments , the geometry is such that it is compatible with wafer handling equipment , such as , for example handling equipment sized 150 mm , 200 mm , 300 mm or 450 mm in diameter and about 0 . 022 inches to 0 . 033 inches in thickness . in some embodiments , the cleaning polymer 12 is comprised of an elastic polymer and may be an acrylic rubber , a urethane rubber , a butadiene rubber , a styrene rubber , a nitrile rubber , or silicone rubber or any other polymer that has a controlled surface tack , or surface adhesion , and does not transfer materials . referring now to fig2 , the elastic cleaning polymer 50 may be formed on the wafer base surface or substrate 48 to produce protruding surface features , e . g ., 52 , that provide offset or minimal contact with the flat surfaces 54 of the wafer handling hardware 51 until a vacuum or electrostatic force is applied . the application of predetermined force to the cleaning wafer 49 can collapse the offset features e . g ., 52 , enabling the cleaning polymer 50 to come into contact with , and matingly abut , the surface 54 of the wafer handling hardware 51 . with the release of the compression force , the resiliency of the protruding and compressible surface features , e . g ., 52 , urge them to resume their former shape , i . e ., non - compressed form , to thereby separate the elastic cleaning polymer 50 from the surface 54 of the wafer handling hardware 51 . due to the surface adhesion properties of the cleaning polymer 50 , the undesirable debris adheres to the cleaning polymer 50 and is thus removed from the flat surface 54 of the wafer handling hardware 51 . in some embodiments , wafer cleaning substrate material 50 is made of silicone , acrylic , polyurethane or any other elastic polymer that may be formed with a surface tack property between about 0 . 1 psi and 10 psi . in certain embodiments , the elastic cleaning polymer material 50 is processed to be durable under repeated handling without a reduction in surface tack . in some embodiments , the material is sufficiently processed and / or crosslinked such that transference from the cleaning surface to the wafer handling hardware 51 , wafer stage , and wafer chuck does not occur . it is to be understood , however , that materials other than polymers may be used to provide a substrate . in some embodiments , control of surface tack and material transference of the elastic cleaning polymer 50 is achieved in the polymer phase by the level of crosslinking density after processing . in a silicone embodiment , the tack of the polymer surface can be controlled by the ratio of platinum catalyst and multi - functional crosslinking resin to the long chain gum polymer in the addition cure system . some embodiments may also use a free radical curing system with the addition of peroxide curing agents in a poly - dimethylsiloxane polymer system . higher levels of catalyst and crosslinking resin result in lower surface tack polymers in the addition cure system . higher levels of peroxide curing agent result in lower surface tack polymers in the free radical cure system . low surface tack polymers will exhibit a shore a durometer level above 80 , while high surface tack polymers will exhibit a shore a durometer less than 35 . an example of each system is wacker silicones elastosil m 4670 and wacker silicones elastosil r401 / 70 . post processing to achieve desired surface tack levels and to remove free low molecular weight volatile material that may contribute to transference is completed at 200 ° c . to 300 ° c . under vacuum of 25 in . hg for 60 minutes minimum . in some embodiments , this process can serve to reduce or eliminate material off gassing according to gas chromatography testing at 150 ° c . for 60 minutes . low molecular weight volatile materials can be driven off as seen through gas chromatography testing and additional crosslinking can be achieved during the post processing cycle as seen by an increase in durometer and material hardness testing . in certain embodiments , filler materials may be added to the elastic cleaning polymer 50 to adjust the surface tack , change the color , or provide a polishing action in addition to the tack for debris collection . control of surface tack and material hardness is achieved in the polymer compound by the addition of particulate filler materials and as used in the fashion described herein . in that manner , the application of the cleaning wafer with these types of filler can accomplish abrasive cleaning through the typical contact between the elastic cleaning polymer 50 containing the added abrasive filler materials and the wafer handling equipment surfaces . in at least one embodiment , the filler material is aluminum oxide with an average particle size of 0 . 5 microns at a loading of 70 % of the total compound weight . the particle size can range from 0 . 25 micron to 25 micron and the weight % loading can vary from 5 % to 90 % of the total compound weight . the filler particle selected should have a hardness number on the mohs scale of 6 minimum . in some embodiments , the addition of filler particulate can affect shore a hardness of the compound from below 35 to above 80 as the loading level increases . in some embodiments , the electrostatic capability of the cleaning wafer 49 is enhanced with an electrostatic filler , for example a metallic composition or compound interspersed within the cleaning polymer 50 material in a fashion well known in the art . this electrostatic filler can then be urged as desired into contact with the associated structure in the wafer manufacturing and wafer handling equipment that use electrostatic force systems . in reference now to fig1 , in at least one embodiment , the thickness of the cleaning polymer sheet 38 is preferably about 0 . 001 inches to 0 . 010 inches . in some embodiments , the thickness of the cleaning polymer sheet 38 is sufficient to allow the material to deform around the burls , e . g ., 44 , and micro - burls , and collect debris , e . g ., 42 , that has accumulated around the periphery of the pin , e . g ., 40 , contact surface . typically polymer compounds that exhibit high surface tack levels , such as above 3 . 0 psi , that deform more readily with a durometer level below shore a 50 , will be used for wafer chuck pin arrays that have large pins and larger pitch between pins . typically polymer compounds that exhibit low surface tack levels , such as below 3 . 0 psi , that are less compliant , such as durometer above 50 , will be used for wafer chuck pin arrays that have small pins and small pitch between pins and therefore high pin count per surface area . referring again to fig2 , in certain embodiments , the discrete protruding surface features , e . g ., 14 , may be formed up to about 0 . 080 inches high and may be oriented on the wafer substrate 10 to ( i ) contact or avoid certain areas of wafer handling hardware ( not shown in fig2 ) and the flat stage ( not shown in fig2 ) such as vacuum ports , etc , or ( ii ) to avoid the burls on a pin chuck surface ( not shown in fig2 ). in at least one embodiment , the protruding discrete surface features , e . g ., 14 , are 0 . 020 inches high and are compression molded into or onto the surface of the cleaning material . the molding is performed with a compression plate ( not shown in fig2 ) with a cavity ( not shown in fig2 ) having the shape of the desired feature pattern and geometry . the compression plate press is typically held at 150 ° c . for 30 minutes under 1 to 5 pounds per square inch pressure to form the features . in some embodiments , an adhesive layer such as silicone or acrylic pressure sensitive adhesive ( not shown in fig2 ) bonds the cleaning polymer sheet 12 to the bare silicon wafer used as wafer substrate 10 . in some embodiments , the cleaning polymer sheet 12 extends across the wafer or wafer - like substrate surface 10 for complete coverage without any exclusion area . in certain embodiments , as needed , an edge exclusion ( not shown in fig2 ) to expose the wafer bead or protrusion , e . g ., 14 , may be incorporated . an edge exclusion can be created by laser removal of the outer one to two millimeters of the cleaning polymer sheet 12 . with reference to fig5 , a wafer substrate 10 is affixed to the cleaning polymer sheet 12 with the cleaning polymer sheet containing ring - shaped protrusion surface features , e . g ., 16 . the ring - shaped protruding features , e . g ., 16 , may be formed up to about 0 . 080 inches high from the wafer &# 39 ; s base surface and may be oriented on the wafer substrate 10 to contact features on the wafer handling hardware in order to prevent or diminish contact of the cleaning polymer sheet with certain areas of wafer handling hardware and flat stage areas , such as , for example , vacuum ports , or burls on a pin chuck surface ( not shown in fig5 ). referring now to fig7 , a wafer substrate 10 is affixed to the cleaning polymer sheet 12 with a distinct area of different surface tack 18 . the thickness of the distinct area of different surface tack 18 is substantially the same as the cleaning polymer area 12 . the tack level of the distinct area of different surface tack or variant tack area 18 is sufficient to allow the material to release from certain wafer handling equipment such as a vacuum ring ( not shown in fig7 ). the variant tack area 18 may be oriented on the wafer substrate 10 in various geometries to contact or avoid certain areas of wafer handling hardware ( not shown here ) such as , for example , vacuum ports or rings ( id .). for example , with reference now to fig2 , in some embodiments a cleaning wafer 49 comprising wafer substrate 48 , polymer cleaning surface 50 , and compressible offset surface features , e . g ., 52 , may also have : ( i ) sections of no surface tack , e . g ., 53 , on the cleaning wafer surface 50 that may come into contact with sensitive features on the opposing surface 54 of the wafer handling equipment 51 ( such as vacuum ports or rings ( not shown in fig2 )); as well as ( ii ) areas of positive tack , e . g ., 55 , on the polymer cleaning surface 50 . returning now to fig7 , the variant tack area 18 of the cleaning wafer polymer surface 12 is produced by the placement of a rigid , tack free plastic film 13 that has similar thickness to the adjacent cleaning polymer layer 18 . the rigid , tack free film 13 is bonded to the silicon wafer with an adhesive layer ( not shown in fig7 ) between the film 13 and the cleaning polymer layer 18 . in some embodiments the adhesive is a silicone or acrylic pressure sensitive adhesive . also , in some embodiments the rigid , tack free film is comprised of polyethylene terepthalate ( pet ). in some embodiments the adhesive layer ( not shown in fig7 ) is comprised of silicone or acrylic pressure sensitive adhesive . the thickness of the adhesive layer ( not shown ) can range from 0 . 0001 inches to 0 . 010 inches with the thickness in some embodiments being 0 . 003 inches . the adhesive will have an adhesion level of 1 . 5 to 2 . 5 pounds force per linear inch wide according to the pstc101 test method . in some embodiments , the adhesive is pressure sensitive ; however , the adhesive may be a non - tacky bonding adhesive such as a heat seal , sealant or thermoset adhesive comprised of silicone , acrylic , polyurethane , cyanoacrylate or any other suitable material . the cleaning polymer sheet 12 extends across the wafer or wafer - like substrate surface 10 for complete coverage without any exclusion area . if desired , the cleaning wafer substrate may have an edge exclusion or lip section ( not shown in fig7 ), to expose the wafer bead ( not shown in fig7 ). with reference to fig8 , in some embodiments , one or more chuck cleaning wafers , e . g ., 22 , may be processed , loaded into , and unloaded by , a wafer handling arm 20 , from a wafer carrier or wafer tray 24 capable of containing one or more cleaning wafers , e . g ., 22 . the wafer handling arm 20 is part of the wafer processing tool ( not shown in fig8 ). this wafer processing tool may be a photolithography tool such as a stepper or scanner . the tool may also be a chemical vapor deposition tool ( cvd ) or a plasma vapor deposition tool ( pvd ). these types of tools are supplied by companies such as applied materials , asml , canon , nikon , etc . continuing with reference to fig8 , the end effector 21 ( also e . g ., with reference to fig9 , with reference to fig1 , 70 , with reference to fig1 , 80 , with reference to fig1 , 90 , and with reference to fig1 , 100 ) of the wafer handling arm 20 is typically the device at the end of the wafer moving arm 20 that contacts the cleaning wafer 22 and secures it , in some embodiments , with a vacuum force as the wafer 22 is typically lifted and moved by the wafer handling arm 20 . in some embodiments , the wafer handling tool ( not shown in fig8 ) has a vacuum gauge ( not shown in fig8 ) that measures the strength of the vacuum seal between the cleaning wafer 22 and the wafer handling arm &# 39 ; s 20 end effector 21 . if the vacuum seal is not sufficient to hold the cleaning wafer 22 securely on the wafer handling arm 24 , the chuck cleaning wafer 22 is not moved . in some embodiments , upon being transported through the wafer handling equipment by the wafer handling arm 24 , the cleaning wafer 22 is positioned over the surface of the wafer handling stage ( not shown in fig8 ) to be cleaned and placed upon the wafer handling stage &# 39 ; s retractable ejector pins ( not shown in fig8 ). in some embodiments , the ejector pins , mounted in the wafer stage , also use a vacuum force to hold and position the chuck cleaning water 22 in place . the wafer handling equipment then handles the cleaning wafer 22 as it would a chip wafer . that is , the wafer stage &# 39 ; s ejector pins retract , placing the cleaning wafer 22 on the surface of the wafer handling equipment to be cleaned ; the cleaning wafer 22 is impelled into contact with the wafer handling equipment , impelled , for example , by vacuum , electrostatic , or mechanical forces ; the cleaning wafer 22 is then released by the forces impelling it into contact with the wafer handling component surface ( not shown in fig8 ); the wafer stage &# 39 ; s ejector pins extend and convey the cleaning wafer 22 back into a position where the end effector 21 of wafer handling arm 24 re - attaches to the cleaning wafer 22 ; and the wafer handling arm 24 removes the cleaning wafer 22 from the wafer handling component and returns it , in some embodiments , to a wafer carrier or wafer tray 24 . in some embodiments , the cleaning wafer or cleaning wafers 22 are automatically removed from the wafer carrier or wafer tray 24 by the wafer handling arm 20 and cycled through processes of the tool under normal conditions . the cleaning wafer 22 is cycled with the cleaning media typically facing down throughout the handling process so that the cleaning polymer sheet 12 ( not shown in fig8 ) may contact the flat surfaces of the handling arm 20 thereby removing loose foreign particulate matter from the handling arm surface . handling of the cleaning wafer 22 by the handling arm 20 is facilitated by the cleaning polymer surface 12 features shown in fig2 as discrete surface features 14 , also shown in fig5 as ring - shaped surface features 16 , which keep the cleaning surface 12 offset from the surfaces of the handling equipment . fig7 illustrates example variant tack areas 18 that allow processing of the cleaning wafer 22 by facilitating release from wafer handling arm 20 . since chuck cleaning wafers 22 typically exhibit surface tack properties to clean the wafer chuck ( not shown in fig8 ), the tacky cleaning surface ( 12 as showing in fig7 ) of the cleaning wafer 22 tends to adhere to the flat surfaces of an end effector 21 interfering with the release of the cleaning wafer 22 at the next station . the discrete surface features ( 14 as shown in fig2 ) of the cleaning wafer 22 are predetermined to reduce or minimize surface contact between the cleaning wafer 22 and the end effector 21 and allow the cleaning wafer 22 to release from the end effector 21 and other components of the wafer handling mechanism , for example the wafer handling arm 20 while still retaining the surface tack required for proper removal of debris from the wafer chuck ( not shown in fig8 ). in some embodiments , the surface features of the cleaning wafer 22 can be designed to reduce or minimize contact with the flat surfaces of the end effector 21 and rotational rings ( not shown in fig8 ) while still allowing the vacuum seal to occur . without a proper vacuum seal , some embodiments of the wafer handling tool ( not shown in fig8 ) will report a vacuum error and return the cleaning wafer 22 to the original loading tray 24 without processing it 22 as desired to effect cleaning . when all vacuums are pulled , full contact does place usually — at least enough to clean the tool and provide recoil . in some embodiments , end effectors ( e . g ., those referenced in fig9 through fig1 and cited in paragraph [ 0074 ] above ) are somewhat interchangeable and their design typically varies from tool to differing tool . the predetermined design of the discrete feature pattern on the chuck cleaning wafer 22 is based on the geometry and operation of the end effector 21 and , for example , rotational rings ( not shown in fig8 ). thus , in some embodiments the cleaning wafer 22 can be customized to conform to the particular geometry and operation of the particular wafer handling tool component to be cleaned by the cleaning wafer . with reference to fig9 , in some embodiments , a bronze end effector 60 has a vacuum port 64 connected to , and evacuated through , vacuum tube 66 in order to secure the cleaning wafer ( not shown in fig9 but see fig8 ) during transport . the cleaning wafer will typically contact the end effector 60 on the flat surface areas 68 . with reference to fig1 , in another embodiment , a stainless steel end effector 70 has a tip 72 contacting the center of the cleaning wafer ( not shown in fig1 ), a vacuum port 74 connected to a vacuum tube 76 , and flat areas 78 to be contacted by the cleaning wafer . while the geometry of each end effector , e . g . 70 , determines the placement of cleaning wafer surface features to facilitate cleaning and release of the cleaning wafer , the material composition of the end effector , e . g ., 70 , can affect adhesion of the tacky surface cleaning material of the cleaning wafer . the adhesion level of specific metal , plastic , or ceramic components of the end effector , e . g ., 70 , rotational chuck ( not shown in fig1 ) and main chuck ( not shown in fig1 ) can be accounted for during design of the cleaning wafer . with reference to fig1 , in another embodiment , an end effector 80 , has a tip 82 that serves to contact the center of the cleaning wafer ( not shown in fig1 ). this end effector 80 has five vacuum ports 84 that can secure the cleaning wafer during transport and cleaning of the end effector 80 if desired . with reference to fig1 , in another embodiment , a stainless steel rotational end effector 90 has a rotational arm that rotates and aligns the cleaning wafer during processing within the chip manufacturing apparatus ( not shown in fig1 ). the rotational end effector 90 contains two contact rings 92 with vacuum ports 94 to secure the cleaning wafer ( not shown in fig1 ) during operation . the rotational end effector 90 contacts the center of the cleaning wafer and vacuum secures the cleaning wafer in position on the effector 90 . with reference now to fig1 , another embodiment of a polytetrafluoroethylene or teflon rotational arm end effector 100 is similar in geometry to the stainless steel rotational end effector 90 of fig1 . this rotational arm end effector 100 contains two vacuum ports 104 in its rotating disk 102 . from these examples , it is evident that the geometry and surface feature pattern of each chuck cleaning wafer can be custom designed for surface geometry and material composition of each differing type of end effector and each wafer handling tool . with reference to fig1 , one embodiment of a flat electrostatic chuck 110 has concentric vacuum rings 112 containing vacuum ports ( not shown in fig1 ), ejector pin holes 114 , and a flat wafer contact surface 116 . a cleaning wafer ( not shown in fig1 ) is held in place on the chuck 110 by electrostatic force and upon removal of that force , the cleaning wafer &# 39 ; s compressible offset surface features ( see fig2 , and fig2 , 52 ) facilitate release through stored elastic force from compression . these compressible offset surface features are arranged to avoid contact with the vacuum rings 112 in this case . it is evident that the cleaning wafer cleaning surface features ( not shown in fig1 ) must be custom designed for each wafer handling tool , accounting for the end effector , rotational chuck , and main pin or electrostatic chuck , e . g ., 110 , while also accounting for the geometry and material compositions of each of these components . with reference to fig1 , an embodiment of a pin chuck 120 with the material composition being quartz and contains protruding pins or burls , e . g ., 122 , on the surface that contact the cleaning wafer ( not shown in fig1 ) along with vacuum ports , e . g ., 124 , bolt holes , e . g ., 126 , and ejector pins 128 . the tacky surface of the cleaning wafer contacts the pins and burls , e . g ., 122 , and is held in contact by vacuum . upon release of the vacuum , the debris on the pins is bonded to the cleaning wafer surface and removed with the cleaning wafer . as in many embodiments , the protruding surface features on the cleaning wafer are arranged to avoid contact with the pins and burls , e . g ., 122 , thus allowing flat portions of the cleaning wafer surface to contact and clean the pin array with contact being effected by the vacuum or electrostatic force that impels the cleaning wafer to the pin chuck 120 . with reference to fig1 , in at least one embodiment , the cleaning wafer 22 is positioned with its cleaning polymer side ( not shown in fig1 ) facing the flat surface 24 of the wafer handling arm 20 . when there is foreign particulate matter 25 on the flat surface 24 of the handling arm 20 and the cleaning wafer 22 is picked up by the wafer handling arm 20 for transport to a process stage , during transport the cleaning wafer 22 contacts the surface of the handling arm 20 , and the foreign particulate matter 25 then adheres to the cleaning polymer surface 22 . upon release of the cleaning wafer 22 from the handling arm 20 for the next process stage , the foreign particulate matter 25 is collected on the cleaning wafer surface 22 and carried away from the handling arm 20 . with reference to fig1 , in some embodiments , the cleaning wafer 28 with a cleaning polymer side 30 is positioned onto a wafer stage 26 . upon application of a force such as a vacuum at approximately 16 to 24 in . hg , the cleaning surface 30 of the cleaning wafer 28 makes contact with the surface of the wafer stage 26 . if there is foreign particulate matter , e . g ., 32 , present on the surface of the wafer stage 26 , then , upon release of the force holding the cleaning wafer 28 to the wafer stage 26 , the foreign particulate matter 32 adheres to the cleaning surface 30 of the cleaning wafer 28 and is thereby removed from the wafer stage 26 . in further detail , still referring to fig1 , the cleaning polymer side 30 of the cleaning wafer 30 has protruding compressible offset features ( see fig2 , and in fig2 , 52 ) designed to inhibit contact between the cleaning wafer 28 cleaning surface and the surfaces of the wafer stage 26 until a vacuum or electrostatic force is applied . once the force collapses the compressible offset features on the cleaning polymer side 30 of the cleaning wafer 30 , the tacky polymer surface or cleaning polymer side 30 contacts the surface of the wafer stage 26 to remove foreign particulates , e . g ., 32 . in the case of pin or burl chucks the compressible offset features are positioned at locations outside the pin area or in specific locations within the pitch of the pins and burls ( see fig1 , 44 , 46 ) so that the tacky cleaning surface of the cleaning polymer 30 may make contact with the pin tips to remove debris . the smooth polymer 30 is sufficiently compliant to deform around the burls and micro - burls ( see fig1 , 44 , 46 ) and collect debris that has accumulated around the periphery of the pin contact surface . in the case of a chuck with vacuum ports , grooves , or vacuum nipples ( not shown in fig1 ), the locations of the compressible offset features of the cleaning wafer 28 polymer surface 30 are placed to facilitate debris collection from within the vacuum features . with reference to fig1 , in some embodiments a cleaning wafer ( not shown in fig2 ) is constructed with a compliant cleaning polymer 38 that is capable of conforming around pins , e . g ., 40 , on a wafer pin stage 41 . the compliant cleaning polymer 38 contacts the foreign particulate matter , e . g ., 42 , on the wafer stage pins , e . g ., 40 , for collection and removal from the wafer stage pins 40 . the compliant polymer 38 may also conform around micro - burls , e . g ., 44 , on a wafer stage pins , e . g ., 40 to contact the foreign particulate matter , e . g ., 46 , for collection and removal from the wafer stage 41 . in certain embodiments , with reference now to fig1 , the compliant cleaning wafer &# 39 ; s cleaning polymer 38 conforms around the pins 40 on the wafer pin stage upon application of a vacuum force . in some embodiments , the polymer 38 is sufficiently compliant to deform around the burls or pins 40 and micro - burls , e . g ., 44 , and collect debris e . g ., 42 , 46 that has accumulated around the periphery of a pin contact surface , e . g ., 44 . the protruding compressible offset surface features ( not shown in fig1 ) the cleaning wafer ( not shown in fig1 ) placed outside of the pins , e . g ., 40 , allows the relatively smooth area of the cleaning wafer polymer 38 to contact the pin surfaces , e . g . 40 . the protruding compressible offset surface features ( not shown in fig1 ) may be placed to match locations of vacuum ports , grooves , or vacuum nipples ( not shown in fig1 ) to facilitate debris collection from within the vacuum features ( not shown in fig1 ). with reference to fig1 , in at least one embodiment , wafer handling equipment to be cleaned contains a quartz pin chuck , upon the surface of which are an array of pins , e . g ., section 8 . a . 1 . during the photolithographic manufacturing process and prior to cleaning with the cleaning wafer ( not shown in fig1 ), debris accumulates around the pins on the pin chuck surface , e . g ., visible in the higher magnification of section 8 . a . 2 . the debris is typically transported in and left on the chuck pins by the silicon process wafers ( not shown in fig1 ). immediately after contact with the cleaning wafer polymer e . g ., section 8 . a . 4 , the loose debris has been removed from the pin tip and circumference , e . g ., section 8 . a . 3 and now the residual debris that was removed from the pins resides on the surface of the cleaning polymer , e . g ., section 8 . a . 4 . in this and other embodiments , the cleaning polymer , e . g ., section 8 . a . 4 , does contact the pins and is compliant enough to conform around the pin tip and somewhat down the side , and the cleaning polymer is sufficiently tacky to bond to and remove loose debris from the chuck pins . referring now to fig2 , in some embodiments , a cleaning wafer 49 , with a cleaning polymer surface 50 on a wafer - like substrate 48 has protruding and compressible surface features , e . g ., 52 , on the cleaning polymer 50 that provide offset and limit contact between the cleaning polymer surface 50 and a wafer stage surface 54 . the elastic polymer formed on the cleaning wafer surface 50 to produce protruding and compressible features , e . g ., 52 , provides offset or minimal contact with the flat surfaces of the wafer stage 54 until a vacuum or electrostatic force is applied . once the vacuum force collapses the compressible offset features , e . g ., 52 , the tacky polymer surface 50 contacts the surface 54 of the wafer stage 51 to remove foreign particulates , e . g ., 56 . upon release of the compression force , the offset features , e . g ., 52 rebound and facilitate release from the wafer stage 51 while the foreign particulate matter 56 adheres to the cleaning polymer 50 and is removed from the wafer stage 51 . the polymeric cleaning material 50 , should have a measurable surface tack between 0 . 01 and 10 psi using standard astm based methods for collection of foreign particulate and to allow release of the cleaning material 50 from the stage surface 54 depending on stage geometry . the surface features , e . g ., 52 , are also dependent on the chuck or stage geometry . in some embodiments , features that collapse on a wafer stage , such as wafer stage 54 , to allow contact for debris collection may usually do so at less than 6 psi vacuum force . the surface tack of the cleaning material 50 is typically low enough that the cleaning wafer 49 releases from the wafer stage 51 at less than 4 . 5 psi pressure on each ejector pin ( normally at about 3 . 0 psi pressure ). in at least one method of use , the vacuum is held for a minimal period such as 5 to 15 seconds , which allows full contact of cleaning surface 50 on the wafer stage 51 to collect debris but facilitates release . a cleaning wafer can be loaded and cycled automatically in most tools but may also be loaded manually in tools with access to the main chuck such as an asml pas5500 stepper . the cleaning wafer can also be manually loaded into a plasma vapor deposition tool such as applied materials endura hp by processing in the first pre - clean chamber to control debris accumulation . while reducing cycle time of the vacuum on a pin chuck facilitates release of the cleaning polymer while retaining cleaning effectiveness the same can be accomplished on an electrostatic chuck by reducing cycle time to 5 to 15 seconds and reducing the applied voltage to 150v or less . referring now to the flowchart of fig2 in conjunction with the diagrams of fig2 and fig8 , in one embodiment of a method of implementation , the cleaning wafer 10 is securely wrapped to protect it from contamination during shipment and pre - cleaning handling . at step 200 , upon first usage of the cleaning wafer , the protective surface liner is removed and discarded . at step 202 , wafer substrate 10 may be manually loaded or loaded in an automated manner . at steps 204 and 206 , a single cleaning wafer 22 or multiple wafers 22 may be placed cleaning material side down ( or wafer side up ) in a wafer carrier 24 , wafer tray , or other wafer loading device of the desired wafer processing tool . at step 202 , the cleaning wafer 22 or cleaning wafers 22 are automatically removed from the wafer carrier 24 or wafer tray and cycled through processes of the tool under normal conditions . the cleaning wafer may be cycled with the cleaning surface 12 facing down throughout the handling process . within the tool , standard handling is facilitated by the wafer &# 39 ; s protruding surface features , e . g ., 14 , which keep the cleaning surface 12 offset from the surfaces of the handling equipment . at step 208 , wafer carrier 24 may be installed to a load port of the automated wafer processing tool . at step 210 , the wafer substrate 10 may be moved with , for example , handling hardware , end effector , or a wafer handling robot arm 20 and then unloaded . at step 212 , debris 25 is removed via vacuum of the flat contact area of the handling hardware . at step 214 , the wafer 10 is placed on wafer stage 26 , wafer chuck apply vacuum or electrostatic charge . at step 216 , the wafer may be released from the wafer state 26 or wafer chuck . similar to step 212 , at step 218 debris 25 may be removed via vacuum of the flat contact area of the handling hardware . at step 220 , wafer substrate 10 may be manually loaded or loaded in an automated manner . at step 222 , the wafer 10 is returned to wafer carrier 24 installed at the load port of the processing tool . alternatively , at step 224 the wafer 10 is returned to a single wafer tray . at step 226 , the wafer surface is inspected . thus , in some embodiments shown by way of example in fig2 , the cleaning media 12 is placed on the surface of each wafer chuck or wafer stage 26 within the automated wafer processing tool , makes near full or full surface contact through vacuum assist on a flat stage or by resting on the burls in a pin chuck for a specific dwell time , collects foreign particulate matter 25 , and is then cycled back to the wafer carrier tray 24 and subsequently unloaded . in some embodiments , the method of creating a cleaning wafer begins with the wafer handling equipment manufacturer providing details on the wafer handling components and chuck geometry of the specific equipment for which the cleaning wafer is intended . based upon the manufacturer specifications , several potential designs are prepared and prototype cleaning wafers produced . these prototype cleaning wafers have a low level of tack , for example , a level 3 on a scale from 1 to 10 for desired range of tack for a given application or tool . these prototype cleaning wafers are run through the actual machine , with each design and geometric configuration being tested for consistency of successful throughput and quantity of foreign particulate accumulated . based upon the results of the initial tests , the designs are modified and new prototype cleaning wafers are produced . these new , revised prototype cleaning wafers are then tested with increasingly higher levels of tack , determining for each design , what is the highest level of tack it can include and yet still function with acceptable consistency . the cleaning wafer that performs the best in the tests is then designated to be the cleaning wafer for that particular wafer handling equipment . in other embodiments , a cleaning wafer may be comprised of two polymer cleaning surfaces , positioned on opposite faces of the cleaning wafer . in some embodiments , a two - sided cleaning wafer is designed for use in wafer bonding equipment . wafer bonders join two or more aligned substrates to create an integrated circuit . the substrates can be joined , or bonded , using the following techniques : fusion bonding , anodic bonding , eutectic bonding , solder bonding , glass frit bonding , adhesive bonding . temporary wafer bonding is performed on thinned wafers placed on a carrier for support . this process is used mainly to manufacture 3d integrated circuits . suss microtec produces equipment that supports these bonding techniques . a two - sided cleaning wafer may be manufactured using the techniques described above , but for each side of the wafer . this can yield a cleaning wafer having predetermined surface features on both sides to clean components of bonding equipment by cycling the wafer through the equipment . two sided cleaning wafers may also be utilized to clean wafer handling equipment in other circumstances , such as when having two cleaning surfaces is advantageous to clean two or more components , at least one with one side of the cleaning wafer and another with the other side . the cleaning wafer could also similarly include other sides having such predetermined features to clean yet other components in wafer handling equipment . in other embodiments , a cleaning wafer may be designed to remove debris from areas of photolithography tools , such as reticles , mask frames , mask loading equipment , and the mask surfaces . reticles or masks contain the image of the particular circuit pattern that is projected onto the wafer surface in a stepper or scanner for example . in a manner similar to that described in the wafer process through the tool , debris can accumulate along the mask area on the handling equipment used to load and unload the mask , the frame that holds the mask , and on the mask surface . similar cleaning material with the same product attributes including surface features may also be used to remove debris from this area of the tool . the material in this case may be mounted to a surrogate mask such as a quartz block to transport the cleaning material though the tool and allow it to contact the handling surfaces to remove accumulated debris . it will also allow contact with the frame that holds the mask here if debris is present it may not allow the mask to seat properly and cause focus issues . the cleaning material may also contact the mask surface offline to remove debris before installing the mask in the photolithography process . this procedure can provide non - destructive cleaning , particularly as compared the techniques that apply solvents or manual scrubbing or abrasion that reduce the lifetime of the mask . it can thus be seen that the embodiments described above may provide many advantages . they can include in some embodiments : more efficient wafer stage cleaning with less or even no tool downtime ; less corruption of the wafer handling hardware , wafer stage , and wafer chuck during the cleaning process . while the foregoing written description enables one of ordinary skill to make and use what is considered presently to be the applicants &# 39 ; best and other modes , those of ordinary skill will understand and appreciate the existence of variations , combinations , and equivalents of the specific embodiments , methods , and examples set forth in this specification .	1
the vast majority of explosives of concern belong to one of the four following chemical categories : 1 . polynitro aromatics such as 2 , 4 , 6 - trinitrotoluene ( tnt ), 2 , 4 - dinitrotoluene ( dnt ), picric and its derivatives ; 3 . inorganic nitrates such as black powder or anfo ( a mixture of ammonium nitrate and fuel oil ); colorimetric explosives detection of these types of explosives are accomplished through the utilization of alkali - based reagents which when applied to the explosives yield a reddish color in most instances . category 4 explosives usually develop a blue color . applicant has discovered that when such explosives treated with the typical reagents existing in the known art are subjected to illumination by a laser or other light source the resultant is luminescence which increases the sensitivity gain factor from that without the luminescence by a surprising amount , up to three factors of 10 gain in sensitivity . commercial test kits are available on the market at the present time and include readily - available reagents which react with the classes of explosives typically available to terrorists and which are the subject for detection by use of the present invention . one such readily - available test kit is fully disclosed in u . s . pat . no . 5 , 296 , 380 issued mar . 22 , 1994 to yair margalit and entitled method and kit for detecting explosives and this patent by this reference is incorporated into this application in its entirety . as is therein disclosed , four different reagents a , b , c and d are utilized for application to a filter paper or similar carrier of suspected trace explosives . each of the reagents is capable of bonding with specific explosives and when such occurs produces a coloration indicative of the explosives . the resultant of the explosive with the reagent when subjected to illumination by a laser or similar light source then photoluminesces and provides enhanced sensitivity enabling very positive identification of the existence of a trace explosive . the particular reagents and the explosives for which they are designed are as follows : sulfanilamide ( 20 g ) is dissolved in a magnetically stirred mixture of dmso ( 700 ml ) and 5 % koh in 40 : 60 methanol / isopropyl alcohol ( 300 ml ); if a small amount of residue remains , the liquid phase may be decanted or filtered , prior to transfer to storage and filling ampoules . this reagent gives a pink to red or violet - red coloration with nitroaromatics such as tnt , dnt , tnb or tetryl ( sensitivity to about 5 × 10 − 4 mg ), and a yellow color with picric acid or its salts ( sensitivity 10 − 3 mg ). n -( 1 - naphthyl ) ethylenediamine ( 3 g ) is added to a magnetically stirred mixture of 85 % phosphoric acid ( 100 ml ) and twice - distilled water ( 900 ml ), followed by hydrazine sulfate ( 5 g ) and sodium thiosulfate pentahydrate ( 0 . 5 g ). ( it is presently contemplated that metabisulfite or ascorbic acid might be used additionally or in the alternative , as nitrate to nitrite ion reducing agents ). active carbon ( 1 g ) is added and stirring is continued for a further 15 minutes , after which the mixture is filtered , prior to transfer to storage and filling ampoules . this reagent gives a violet to red coloration with nitrate ester or nitramine explosives such as dynamite , hmx , smokeless powder , nitroglycerine , petn , rds , c4 and semtex . the sensitivity of this test is in the range 10 − 4 to 10 − 5 mg . to a mixture of magnetically stirred dmso ( 600 ml ) and isopropyl alcohol ( 400 ml ), there is added zinc power ( 20 g ) which had previously been finely ground in a mortar . stirring is stopped after 10 minutes . after allowing to stand for a further 10 minutes , the desired supernatant , which is a turbid grey liquid , is decanted from the residue of coarse zinc particles , and poured into a storage vessel prior to being used for filling ampoules . the thus - prepared emulsion containing zinc is very stable to light and under normal conditions ; the ampoules do not need to be colored . this reagent gives a violet - red or red coloration with nitrates and is sensitive to as little as 10 − 5 mg of nitrate . a liquid mixture is first prepared by carefully adding 95 % sulfuric acid ( 400 ml ) to a mixture of dmso ( 90 ml ), ethanol ( 100 ml ) and water ( 500 ml ). aniline sulfate ( 23 g ) is then added with stirring to the liquid mixture until a homogeneous solution is obtained . the thus - prepared reagent is poured into a storage vessel prior to being used for filling ampoules . it is very stable to light and under normal conditions ; the ampoules do not need to be colored . this reagent gives a strong blue coloration with chlorates within 10 - 20 seconds , which fades on standing ; it is sensitive to as little as 2 × 10 − 2 mg of chlorate . a blush - pink color is obtained in the presence of bromate ; perchlorate does not give a positive reaction . to perform sensitivity studies , samples of the target materials were obtained . filter paper was then spotted with a sample of the explosive of interest . thereafter a reagent of the type above - described was applied to the spot of explosive . at the same time to provide a control , a drop of the reagent was also applied to the filter paper apart from the area where the specimen of explosive existed . observation was then made of the sample to determine whether or not it assumed a desired color as described above with regard to the reagent . thereafter , the sample and the control was inserted into a compact light type box to which an appropriate laser was attached . the box included a viewing port equipped with an appropriate filter to block reflected laser light and to permit transmission of the fluorescence of interest . the laser then illuminated the sample and the control and the results were observed . the laser ( 130 mw ) was operated at 532 nm . it was observed that the sensitivity was improved by at least two orders of magnitude as compared to the normal calorimetric sensitivity . the photoluminescence detection mode does not distinguish between category 1 and category 2 explosive because photoluminescence develops only once reagent b is applied . for photoluminescence detection of category 4 explosive , reagent d is followed by reagent b , unlike in the normal colorimetric protocol . this changes the color of the product from blue to orange . the orange product , in turn , is photoluminescent under green excitation . the light source utilized to accomplish the photoluminescence must deliver the appropriate color to be absorbed by the material of concern . it is desirable that the light source be battery - operated and easy to utilize by untrained individuals in the field . there are in existence commercially available light sources such as frequency - doubled cw ( as opposed to pulsed ) nd : yag ( or nd : yvo 4 ) lasers which delivered green light at 532 nm and are battery - operated flashlight - size and operated with flashlight ease . there are also inexpensive handheld ultraviolet lamps . these can operate either in the near uv ( wavelength greater than 300 nm or deep uv wavelength less than 300 nm spectral ranges . there are turn - key uv lasers that operate at 355 nm and that may be powered from batteries . finally , the use of light - emitting diodes and flash - lamps is envisioned . the chemistries currently used in calorimetric detection of explosives mostly yield blue , pink - red , red , or red - violet test spots as above indicated in the discussion of the various reagents described in u . s . pat . no . 5 , 296 , 380 . if these colored products were photoluminescent , they would call for orange red excitation in the case of blue products and blue - green excitation in the case of the reddish products . explosive detection chemistries that respond to uv excitation also are possible in this application . emphasis is placed on photoluminescent methods that respond to green or uv excitation . the following table shows typical sensitivity gains realized for various explosives when using the photoluminescence method of the present invention . under certain circumstances involving the detection of traces of explosives in situ background color or background fluorescence may mask the detection of the explosive . it then becomes of interest to detect the explosive by time - resolved photoluminescence techniques in order to suppress the background . it has been found that by tagging of the explosive with lanthanide elements and then to use a time - resolved detection apparatus such is achieved . the lanthanide elements typically exist in compounds in the trivalent state . some of them , most notoriously europium and terbium , eu 3 + and tb 3 + , luminesce with high quantum efficiency . the most intense luminescence of the europium ion occurs at about 615 nm ( red ), arising from the transition from the upper 5 d 0 to the lower 7 f 2 state . for terbium , the corresponding states are 5 d 4 and 7 f 5 , respectively , with green luminescence at 545 nm . although the luminescence efficiencies can be high , the luminescence intensities are generally quite low because the lanthanide molar extinction coefficients ( proportional to the ion &# 39 ; s ability to absorb light ) are very low because the transitions from the ground state ( 7 f o for the europium and 7 f 6 for the terbium ion ) are both parity - and spin - forbidden . moreover , many lanthanide compounds include waters of hydration and these quench the lanthanide photoluminescence via coupling of the 0 - h vibrational overtones to the lanthanide electronic states in much the same way as molecular vibrations couple to electronic states to quench molecular fluorescence via the well - known internal conversion and intersystem crossing mechanisms . the severity of the quenching is proportional to the number of waters of hydration in the compound . it is known that very intensely luminescent lanthanide compounds can be prepared by binding to the lanthanide ion organic ligands that ( a ) occupy all binding sites of the lanthanide ion , thereby excluding waters of hydration , and ( b ) absorb well and then transfer this excitation energy to the lanthanide ion ( much more effectively than direct absorption by the lanthanide ion itself ) via the forster energy transfer process . typically , the excitation of the lanthanide ( either europium or terbium ) complex is in the ultraviolet ( to the ligand and from there to higher lanthanide states via the forster process , followed by radiationless decay within the lanthanide ion to the lower - lying emitting lanthanide excited state , followed by the lanthanide luminescence ). action by the ligand corresponding to the direct energy transfer of the excitation to the emitting state ( 579 nm for the europium and 488 nm for the terbium ) is not effective because this ( lower ) excited state does not couple well to ligand states ( on parity grounds ), hence is not readily amenable to the ligand - lanthanide energy transfer . the absorbing ligand that transfers the excitation energy to the lanthanide ion is often referred to as a sensitizing ligand . one example of such is shown as : in colorimetric detection schemes , the pertinent properties of light ( via absorption / reflection ) are color and intensity . in photoluminescence schemes , the pertinent properties of the emitted light are color and intensity as well , but there is now a third property that can be exploited , namely luminescence lifetime , the time of decay of the luminescence once the excitation ( illumination ) is shut off . lifetimes of typical molecular fluorescences are on the order of a nanosecond . phosphorescences have much longer lifetimes . the lanthanide luminescences rightly can be classified as phosphorescences , because of their long lifetimes , of millisecond order , and because the two states involved in the emission process have different spin multiplicities . the long lanthanide luminescence lifetimes permit detection in the presence of strong background fluorescence by time - resolved techniques and thus are especially interesting , not only in the forensic science context but in many other fields as well . lanthanides have nine - fold full coordination . this is easily seen by noting that common lanthanide salts are of the form lx 3 6h 2 o , where l is the trivalent lanthanide cation ( eu 3 + or tb 3 + for example ), x is a monovalent anion ( chloride or nitrate most often ), with 6 water molecules completing the coordination . the bonding of the water to the lanthanide ion , through the oxygen end of the water , is neither ionic nor of the typical covalent bonding variety of organic molecules . it has some electrostatic characteristics , namely the attraction between a charged object and an electric dipole , which is reminiscent of hydrogen bonding , and some covalent characteristics as well . many of the organic ligands useful for making highly luminescent lanthanide complexes are bidentate ( occupying two coordination sites ). thus , four such ligands only can bind to the lanthanide , leaving one free coordination site , which may remain unoccupied if the ligands are large , so that steric hindrance precludes access by water , or another kind of ligand , to this last site , or the site is occupied by a monodentate ligand . the one of most concern here is water , a notorious lanthanide luminescence quencher . one water of hydration may still be tolerable , but a larger number of waters of hydration very seriously degrades lanthanide luminescence , the quenching being proportional to the number of hydration waters . when lanthanides form coordination complexes , they show a preference for binding to oxygen , as in water , for instance . this preference may increase further when the oxygen acts as if it were a negatively charged entity , as it does in most explosives via the ubiquitous no 2 functionality . the proclivity of lanthanides for water is such that a number of lanthanide complexes that are highly luminescent are quenched once placed in the presence of water because the water displaces the sensitizing ligands . eu ( ttfa ) 4 , eu ( op ) 4 and the corresponding terbium complexes were prepared quite simply by mixing the commercially available lanthanide chloride hexahydrate salt and ttfa or op in methanol . a five - fold excess of ligand was used over the 1 : 4 lanthanide : ligand stoichiometric proportion . the resulting concentration of the complex was about 3 × 10 − 4 m . the chromatography paper spotted with the explosive was then immersed for a second or two in the methanol solution of the lanthanide complex , or was spotted with the lanthanide complex solution . when the paper was then left to dry for a minute or two with op and smokeless powder , under the deep uv excitation pertinent to op . there was observed around the intensely luminescent ( red ) region where the explosive is located a light blue - luminescent halo , which arises either from displacement of residual water from the explosive spot region via the methanol solvent or from migration of the excess op used in the formulation of the lanthanide complex . in the halo region , that water , in turn , would displace ligands from unreacted complex to quench luminescence and / or the excess op would dominate the luminescence of the halo region . thus , in the halo region the observed luminescence was that of free op ( light blue ). farther out from the halo region , intense ( red ) luminescence from unreacted lanthanide complex was seen , together with the light blue luminescence of free op due to the excess of op in the formulation of the lanthanide complex . the overall effect in this region was the observation of a pinkish red . when the sample was inspected through a band - pass filter tuned to the red europium emission ( wedge filter ), no luminescence was seen from the halo region and the explosive spot region and the region of unreacted complex showed the same intensity , at least to the level of what could visually be discerned . once the sample was subsequently rinsed in running tap water for a few seconds ( or was simply immersed briefly in water ), the result was no luminescence seen from unreacted complex . it is not necessary to let the paper dry before observation , nor is it necessary to let the paper dry for any length of time after the prior methanol spotting or immersion . thus , the procedure is quite quick . the illumination employed a hand - held uv lamp ( model uvgl - 58 , mineralite ® lamp , uvp , upland , calif .) operating in the deep uv . similar results were obtained with rdx and with the corresponding green emitting terbium complex for both explosive samples . results were similar with the corresponding ttfa complexes . with the advent of photoluminescent semiconductor nanocrystals , also referred to as quantum dots , nanoparticles or nanocomposites direct sensitization is possible . this direct sensitization is accomplished for europium via cds nanocrystals and cdse nanocrystals , mostly referred to as quantum dots ( qdots ). those qdots emitt in the orange , as needed for the requisite spectral overlap with the emitting europium state . the qdots may be used by binding to the lanthanide . however , the donor - acceptor energy transfer is not actually dependent on chemical binding . it suffices that the donor and acceptor be in close proximity . the energy transfer efficiency depends on r − 6 , where r is the distance between the donor and the acceptor . of course , chemical binding is ideal because then small r is assured . europium complexes , namely eu - ttfa ( thenoyltrifluoroacetone ) and eu - op ( ortho - phenanthroline ) were prepared in methanol solution , at a concentration of 3 millimolar . the ligands are there only to exclude the luminescence - quenching water , rather than to serve as sensitizers . the complexes were spotted ( one drop ) on an appropriate carrier . qdot ™ 585 streptavidin conjugate was obtained from quantum dot corp . this is a water suspension of the qdots , and was used as received , without the accompanying buffer solution . it was spotted directly in one drop quantity over the eu spots on the tlc plate . control eu spots and qdot spots alone were also applied as controls . the qdots respond to both uv and green excitation . under uv excitation , the luminescence ( control and other spots ) was astoundingly intense , very much more intense than that of the control eu spots . under 532 nm green excitation the qdots continued to exhibit very intense emission , whereas the eu control spots exhibited no luminescence at all , as to be expected . the qdot luminescence peaked at 590 nm with full width at half maximum of 32 . 5 nm . in terms of donor - acceptor overlap at 579 nm , one is thus still at 70 % of maximum donor luminescence intensity . however , at the eu emission wavelength , about 615 nm , one is still at 30 % of maximum qdot luminescence , which represents a very large background emission intensity if one seeks eu emission resulting from energy transfer . we thus anticipated having to employ time - resolved spectroscopy to suppress this background in order to dig out from underneath the anticipated much weaker eu luminescence . on standard luminescence spectroscopy , under the 532 nm excitation , as clearly defined shoulder at the right wavelength ( about 615 nm ) and of the right width ( about 5 nm ) was found in the overlayed spots but not in the qdot control spot ( the eu control spots not exhibiting any luminescence at all ). this represented a qdot - to - eu energy transfer yielding eu emission of intensity computed to be 4 % of the maximum qdot emission intensity . we construe this as impressive energy transfer , considering that the above - discussed r proximity between qdot and eu was not achieved by chemical binding but by merely placing drops over each other on porous substrates . it is noted that the streptavidin conjugate is a large moiety ( roughly 60 kda ) so that the proximity between the europium ion and the quantum dot itself suffers . using a simple mechanical light chopper - based apparatus , direct time - resolved visualization by eye of the characteristic red europium emission was nonetheless achieved under 532 nm excitation . no europium luminescence was found under 532 nm excitation with the chloride , op and ttfa europium compounds . under uv excitation ( 355 nm ) by laser ( 15 mw ) a sensitivity gain of an order of magnitude over the colorimetric sensitivity was achieved ( in above discussed indicate that the corresponding first - generation field device utilizing the the non - time - resolved mode ) when rdx as a typical example was tagged with eu / ttfa . the laser was actually a pulsed laser , operating at 6 khz . given the long europium luminescence lifetime , about 0 . 4 ms , however , the laser acts as if it were cw to permit the simple standard or mechanical light chopper - based time - resolved visualization . results were similar with the corresponding ttfa complexes under near - uv excitation . in the field detection scenario one places the trace explosive collecting swab , after chemical treatment ( as in the usual field - testing procedure ), in a ( small ) light tight box with ports for the light source and for a filter - equipped eye piece for viewing . the device is easy to build , compact , and not expensive ( excepting the light source ). our results with the reagents battery - operated laser mentioned earlier is practically viable . one may imagine situations in which the field detection of trace explosive is to be done in situ ( rather than by swabbing ). here , the lanthanide approach is of value in that time - resolved visualization allows the elimination of the background color or fluorescence ( when optical filtering is ineffective ). given the long luminescence lifetimes of lanthanides , this is not difficult to accomplish . the simple light chopper device accomplished this . the chopper can easily be designed to provide the appropriate triggering to a proximity - focused microchannel plate image intensifier placed at the eye piece location of the above light - tight box and the time - resolved image is seen on the phosphor screen of the image intensifier , if sensitivity higher than that of visualization by eye is desired . alternatively , an intensified ocd camera could be used . the light chopper blade would have two sets of openings , one to chop the exciting light and the other to provide the appropriate gate delay and gate width to the image intensifier via a light emitting diode ( led )— photosensor pair with associated electronics as well known in the art . in comparison with the above routine version of the device , one now has the added expense of the chopper and if desired , intensifier but it is unlikely that the time - resolved version would need to be deployed as widely as the routine version . the advent of photoluminescent nanocrystals and nanocomposites offers additional prospects in the explosives arena . here , one can foresee direct photoluminescence detection of explosive traces tagged with such nanoparticles , functionalized chemically with conjugating ligands to bind to the explosive . one would then have a nanoparticle method akin to the lanthanide method , in the above routine implementation , or in an appropriate time - resolved modality in which the mechanical light chopper would be replaced by an electro - optical modulator or in which the laser / light chopper combination would be replaced by a pulsed laser , such as a frequency - tripled nd : yvo 4 laser operating at 355 nm . such lasers have suitably short pulse widths ( commensurate with 10 − 8 - 10 − 6 s nanoparticle luminescence lifetimes ), high repetition rates ( tens of khz ), provide average powers ranging from 100 mw to watts , and operate on ordinary household current . in terms of the above lanthanide strategy , these lasers act as if they were cw , given the long lanthanide luminescence lifetimes , and would be used directly , or together with the above - discussed simple mechanical light chopper for time - resolved purposes . the powers they provide are orders of magnitude larger than what one gets from the hand - held uv lamps discussed above , hence greatly aid explosives detection sensitivity .	8
turning first to fig1 a desk top microfilm reader and work station 10 ( hereinafter referred to as reader 10 ) is illustrated . it comprises a base structure 12 having a top edge 14 , a bottom edge 16 , and side edges 18 , 20 . the base structure 12 has a top surface 22 which has a dual function of being a work area for reading , writing , or other general office work , and also functions as a projection surface with a projection screen area 23 enclosed by the dashed line . towards the top edge 14 , which is the edge furthest from the operator , there is a film housing and projection assembly 24 . there are also storage compartments 26 along the top edge 14 which can be used to store microfilm or office materials such as pens , pencils and paper clips . near side edge 18 and extending upward is a supporting arm 28 which is fastened by any one of numerous available methods , to the base structure 12 . although this preferred embodiment had the supporting arm 28 adjacent the side edge 18 , one could readily see that the supporting arm 28 could be attached near any of the side edges 18 , 20 , or near the top edge 14 . at an upper end 30 of the supporting arm 28 is a hood 32 which extends from the supporting arm 28 and over the top surface 22 . the mechanics of the fiche receiving mechanism used in the reader 10 can be best seen in fig2 and 3 . a cover 34 ( illustrated as in the closed position in fig1 ) is shown in the open position by means of pivoting it around hinge 36 . a slot 38 is exposed which is designed to receive an individual piece of microfiche or jacket 40 . a drive roller 42 mounted on drive shaft 43 is rotated to force the fiche downward . due to friction between the drive roller 42 and microfiche 40 , a driven roller 44 mounted on a driven shaft 45 is also caused to rotate . this provides stability and control for movement of the microfiche 40 . as the microfiche 40 is forced downward , it passes between glass flats 46 , 48 which are used to maintain the fiche in a predetermined location in the projection system . the microfiche 40 is then pushed by means of rollers 42 , 44 down into a curved channel 50 via the curved entrance lips 52 . the curved channel 50 has a stop 54 which determines the distance which the microfiche 40 can travel within the curved channel 50 . when a switch 56 ( fig1 ) is turned to the &# 34 ; on &# 34 ; position , power is supplied from line voltage , usually 115 volts a . c . to a motor 60 which in turn drives a fan 62 via a belt 64 . this provides cooling air for the projection system . power is also supplied to a transformer 58 ( fig5 ) which the secondary is wired to a mode switch 57 . when the cover 34 is open , an electrical circuit is completed through mode switch 57 , energizing a lamp 68 mounted in socket 70 . the lamp preferably has a dichroic reflector 72 which projects the visible light and allows the infrared or heat producing rays to pass through the reflector and away from the microfiche 40 . a heat absorbing filter 74 further &# 34 ; cools &# 34 ; the light beam by further removing infrared radiation . the light is then reflected by a first mirror 76 which preferably is a dichroic mirror which allows infrared to pass through the mirror and only reflects the visible light waves . mirror 76 is mounted on a support 78 which can be adjustable to allow for manufacturing tolerances . the visible light from lamp 68 then passes through a condensor lens 80 which concentrates the light beam as it passes through the microfiche 40 . a projection lens assembly 82 mounted in lens support 84 receives the light beam with the image and projects it onto a second mirror 86 . the image is then reflected up to a third mirror 88 mounted in the hood 32 . the image is then reflected down onto the top surface 22 , particularly into the projection screen area 23 . the supporting arm 28 could be rotatably fastened at its lower end to the base structure . this would enable the operator to rotate the arm 28 and hood 32 to any desired position . preferably detents or latches of some standard design would be utilized so that the supporting arm 28 could be locked into a predetermined projection position whereby the third mirror 88 in the hood would be in its proper alignment to project images onto the projection area 23 . it is preferred that the lens support 84 be threaded to match with mating threads on the projection lens assembly 82 whereby the projection lens 82 can be moved a small distance relative to the plane of the microfiche in the projection path for focusing . one can also see the importance of the glass flats 48 , 50 in maintaining the microfiche 40 at a fixed and constant distance from the projection lens assembly 82 for constant focusing . to assist in this , glass flats 48 , 50 have a spring loaded mechanism 51 pushing the glass flats together . when the switch 56 was first turned to the on position and with the cover 34 in the closed position , lamp 68 is in the off mode . however , additional lamps 90 are mounted in the hood 32 which are energized through mode switch 57 upon turning the switch 56 on . thus , the top surface 22 is illuminated for reading , writing , or whatever work the operator is doing . only when the cover 34 is lifted , is the projection lamp energized and the illuminating lamps 90 turned off through mode switch 57 . it is desirable that the illuminating lamps 90 be turned off in the projection mode to cut down on extraneous light striking the projected image which would greatly reduce the contrast and readability of the image . a fiche positioning assembly 92 is best seen in fig5 through 7 . in fig5 there is a thumb wheel 94 protruding up through channel 96 cut in the surface 22 . the thumb wheel 94 is mounted on a shaft 98 which in turn is part of or affixed to a movable base structure 100 . the movable base structure 100 is allowed free movement in the direction of arrow a - b as seen in fig5 . a roller carriage assembly 102 is explicitly illustrated in fig6 and 7 . a fixed base plate 104 is secured by means of a fastener 105 to the base structure 12 . there is a ball bearing structure 106 with ball bearings 108 retained by the fixed base plate 104 such that the ball bearing structure 106 can move only in the a - b direction . a sliding plate 110 is affixed to the movable base structure 100 by means of a fastener 112 and allowed to roll with bearing structure 106 . thus , one can see that the movable base structure 100 is allowed to move in the a - b direction by means of the roller carriage assembly 102 . at one end of the shaft 98 is a thumb wheel pulley 114 which has a belt 116 wrapped around it . the opposite end of the belt 116 is wrapped around drive pulley 120 via idler pulley 118 . it can be seen that drive pulley 120 is mounted on the drive shaft 43 which also has the drive roller 42 mounted thereon . thus , as thumb wheel 94 is turned , the belt 116 causes the drive pulley 120 to rotate , which causes the drive roller 42 to rotate which in turn controls the vertical movement of the microfiche 40 . in this manner , specific horizontal rows from a microfiche can be selected for projection . the particular column desired on the microfiche can likewise be selected and placed in the projection light path by moving the fiche positioning assembly 92 in the a - b direction as the rollers 42 , 44 and associated shafts are mounted on the common movable base structure 100 . the fiche receiving means can also be a fiche carriage as illustrated in u . s . pat . no . 3 , 941 , 466 incorporated herein by reference . the projection system would have to be slightly modified to accommodate horizontally held microfilm , but such modification could be done by those skilled in the art . one could also modify this particular reader to accommodate a roll film retrieval system such as illustrated in u . s . pat . no . 4 , 164 , 367 . fig8 and 9 , illustrate such a modified system in which spools of microfilm 122 are mounted on spindles 124 . the spindles 124 are connected to motors 126 which are controlled by a conventional motor controller 128 to move the film to the desired image location . there are numerous other film transport systems for roll film , some of which utilize cartridges and others which utilize cassettes . however , the particular mode of storing information on microfilm is not crucial to the operation of applicant &# 39 ; s invention . applicant &# 39 ; s invention provides a work station in which the operator has an illuminated work area which is transformed into a microfilm projection system without the operator ever going to any additional microfilm equipment . his work area is not substantially diminished and the extinguishing of the illumination lamps 90 provides sufficient darkening of the projection area to allow easy viewing of the projected images . furthermore , the optical projection path from the film housing and projection assembly 24 to the projection screen area 23 is not enclosed . thus , the operator has an unobstructed view of his office , people who he could be having a conference with , and still be retrieving and projecting images onto the projection screen area 23 . also , the operator has the capability of writing or working on the top surface 22 while he is simultaneously projecting an image into the projection screen area 23 . the movement of the operator and accessibility to other items is not restricted such as in prior microfilm readers because the projected image is not within an enclosure . thus , it is apparent , there has been provided , in accordance with the invention , a microfilm reader and work station that fully satisfies the objects , aims and advantages set forth above . while the invention has been described in conjunction with specific embodiments thereof , it is evident that many alternatives , modifications , and variations will be apparent to those skilled in the art in light of the foregoing description . accordingly , it is intended to embrace all such alternatives , modifications , and variations as fall within the spirit and broad scope of the appended claims .	6
referring to the drawings , a product 10 formed of a synthetic resin is shown in fig1 with a surface configuration having an appearance of wood . product 10 desirably is formed of fiberglass reinforced polyester resin or vinylester resin , although other synthetic resins can be used . product 10 has a front surface 12 that displays a grain pattern 14 that is relatively darker than the other portions of the surface . the product has an end 16 that displays a typical end grain appearance of wood . referring to fig2 the grain 18 in a typical piece of wood 20 is illustrated . the grain is a darker tissue in wood and is typically more porous and open than the non - grained surface 22 of the wood . the grain typically is recessed below surface 22 . different woods have different types of grain structures . woods such as mahogany , walnut , and oak , have a naturally open grain structure , whereas woods like cherry and maple are considered closed grain structures , wherein the grain is not as open and porous as the other woods . the grain portion of the wood typically is darker than the non - grained portion of the wood . fig3 illustrates a fragment of the surface of a mold 24 formed from the wood of fig2 . mold 24 comprises a surface layer 26 formed of tooling gel , which is a particularly high quality polyester gel used for manufacturing tooling for molding fiberglass products . the tooling gel has been applied to this surface of the wood in fig2 and has received an impression 28 of the grain pattern 18 of the wood . the tooling gel is backed by multiple layers of a polyester resin 30 reinforced with fiberglass 32 . a completed mold 34 incorporating the grain construction 28 described above is shown in fig4 . aside from the grain configuration and the toning and finishing process of the present invention , the products are manufactured by conventional fiberglass molding techniques . it should be understood that the fiberglass molding techniques are described herein for exemplary purposes and that other conventional molding techniques can be used advantageously in the present invention . the steps involved in performing the process of the present invention are described below in connection with specific examples of products formed by the process : a panel is formed of fiberglass reinforced polyester resin with a black walnut finish that simulates real wood by first fabricating a wood plug in the shape of the product to be formed . desirably the plug is formed of the wood finish desired , namely , black walnut . however , if black walnut is not available , a different wood with a similar grain pattern may be satisfactory . after the wood plug has been formed , the surface of the wood is sanded to the desired smoothness and is then brushed in the direction of the grain with a nylon or similar bristle brush that is relatively stiff ( a scrub brush is satisfactory ) in order to abrade the grain tissue of the wood and open the grain pores of the wood . desirably , the brushing is performed for a period of thirty ( 30 ) to sixty ( 60 ) minutes with light pressure . the brush should be stiff enough to open the grain pores but should not be so stiff that it scratches the wood . the amount of brushing is determined by the amount of grain definition desired in the finished product . other techniques for opening the grain of the wood , such as the application of acetone or paint removers , also can be employed . as indicated below , hard woods with close grains may actually require sandblasting to open the grain of the wood . after the plug has been brushed to the extent desired , the surface of the plug is sealed with a coating of boiled linseed oil . this penetrates and seals the surface of the wood and hardens the surface fibers so that they will not easily break off when a tooling resin is applied to the wood surface . after application of the boiled linseed oil , the product is allowed to cure for a period of times of six ( 6 ) to twelve ( 12 ) hours . the surface of the plug is then brushed again in order to remove the excess linseed oil from the pores of the wood . brushing for thirty ( 30 ) to sixty ( 60 ) minutes is satisfactory . boiled linseed oil is particularly desirable as a sealer for the plug , because the linseed oil dries relatively slowly . thus , after the linseed oil penetrates the wood and seals the surface , any excess linseed oil remains soft and can be removed from the grain pores by brushing . a quicker drying sealer might dry completely and fill the grain pores , reducing the depth of the grain impression available with the wood plug . after the linseed oil has been cured and the excess brushed off the plug , a conventional mold release compound is thoroughly applied to the surface of the plug prior to making a mold from the plug . because of the intricate and delicate grain pattern in the wood , it is important that the mold release compound be thoroughly and intimately applied to the surface of the wood . in the preferred practice of the present invention , macguires no . 8 mold release paste wax is applied to the wood surface with a cloth using a circular motion to wipe the wax thoroughly into all the crevices of the wood . the wax is then rubbed in a direction parallel to the grain of the wood and then the wax is brushed to remove excess wax from the wood . this process is repeated until there are ten ( 10 ) coats of wax on the wood . while a particular wax and number of times of waxing are preferred , other types of mold release waxes , such as liquids , can be used , with the objective being a wood surface that has durable mold release characteristics with no residual wax in the grain pore crevices in the wood . after the product has been thoroughly waxed with a mold release compound , a mold impression is formed from the plug by first applying a tooling gel to the surface of the wood plug . the tooling gel is a conventional pigmented resin and comes in standard colors of black and orange . these colors show imperfections better than other colors of tooling gel . a tooling gel is preferred over a conventional resin , because it is more desirable and withstands greater heat . the tooling gel is applied with a spray gun to a thickness of about 25 - 30 mils , which is standard for fiberglass mold manufacturing . the tooling gel is allowed to cure for two ( 2 ) to twelve ( 12 ) hours . after the tooling gel cures , the mold is completed using conventional fiberglass molding techniques . fiberglass mats impregnated with tooling resin are applied to the outer surface of the tooling gel until the mold has a desired thickness , generally of 1 / 4 to 3 / 4 inches , depending upon the size of the part . the mold is allowed to cure for about twenty - four ( 24 ) hours after this point in order to allow the resin to fully cure and to eliminate vapors present in the resin . the next step is to remove the mold from the wood plug and trim the edges of the mold to the size desired . if warpage is possible in the part , the mold is reinforced with wood or metal in a conventional manner . aside from the extra steps due to the intricate and delicate nature of the wood grain pattern in the wood plug , the details of manufacture of the mold are conventional fiberglass manufacturing techniques . to use the mold for manufacturing products , it is important that the mold first be treated thoroughly with a mold release compound . again , it is preferred to wax the mold several times with macguires no . 8 mold release wax . ten ( 10 ) coats are desired on the first application of the wax . the wax should be brushed between coats , although brushing is not quite as important for the mold , because the grain impression extends outwardly from the mold and is not a depression in the mold . the brushing eliminates wax build up . to insure adequate product release , it is desired to re - wax the mold at least to some extent for each part produced . one coat of wax is satisfactory . after the mold has been waxed , the product is produced in a conventional manner . a gel coat is sprayed to a thickness of about 15 mils in the mold , with the gel coat being impregnated with a base coat color that is desired . the base coat color is significant . typically , a beige or light tan color is used , and this color is typically somewhat lighter than the simulated wood color that is to be produced on the product . when black walnut and mahogany are produced , the base coat color is desirably a beige color . when oak , cherry , or maple products are produced , a light tan base coat color is used . after the gel coat with the base coat color is applied and cured for one ( 1 ) to four ( 4 ) hours ( or as is conventional in the industry ), fiberglass mats impregnated with resin are laminated to the exterior of the gel coat in a conventional manner and cured until dry . the mold is then removed from the product and the product is trimmed and the edges sanded . at this point , the product contains an accurate impression of the wood plug and its open grain structure . the next step is to apply a finish to the product that gives the product a realistic wood appearance . in order to accomplish this , a pigmented viscous paste admixed with the proper color pigments is dabbed on the surface of the product with a rag or the like and is rubbed in a circular pattern in order to work the paste into the simulated pore structure of the product . conventional stains have been found to be unsatisfactory . however , a highly desirable product is a product known as an artist oil , which is the type of oil that is used for making oil paintings . artist oils are viscous pigmented oils and come in a variety of colors that can be mixed together to produce any particular shade desired . after the artist oils are applied to the surface of the product and worked into the pores , the oils are wiped from the surface in the direction of the grain until the surface has the desired hue or shade . the extra oil worked into the simulated grain pores in the product gives the grain pores a darker color than the rest of the product and simulates to a remarkable extent the actual appearance of wood . the artist oils or pigmented paste employed in the present invention provides the toner color to the product . it is an important feature of the present invention that the artist oil be modified by the addition of a dryer compound , such as japan dryer . the artist oils may take days to dry without a dryer , but this drying time can be reduced to as little as two ( 2 ) hours with an appropriate dryer mixture . after the artist oils have cured , a protective coating is applied to the surface of the product in a conventional manner . this coating may be a clear coat of lacquer or urethane sprayed on the surface of the product . the finished coat can have a satin or gloss finish or , if it has a gloss finish , the gloss finish can be dulled by a light application of steel wool after the finish is cured . upon the completion of the finish coat , the product has a durable , wood - like finish that is virtually indistinguishable from genuine wood . to produce a wood product having a cherry or maple finish , the foregoing procedure can be modified somewhat . because of the hardness of the wood and the closed grain structure of the wood , it may be necessary to actually sandblast the wood in order to open up the grain pores . a somewhat lighter tan base coat is employed in the gel coat layer of the product and a mixture of artist oils designed to simulate cherry or maple is used . the appropriate mixture can be selected by personal preference and experience . it should be understood that the foregoing are merely exemplary embodiments of the present invention and that various changes in the steps and formulations used in the process may be made without departing from the spirit and scope of the present invention , as defined in the appended claims .	1
referring now more particularly to the accompanying drawings , the exercising equipment shown therein comprises a base 10 which is rectangular in plan and a water or other liquid receiving tube 11 upstanding from and secured to the base 10 in a central rear region thereof . an arm 12 is carried by the upper end of the tube 11 , extends across the interior of the tube and projects outwardly from the tube at opposite ends in a direction perpendicular to the axis of the tube . the arm carries two inner pulley wheels 13 and 14 mounted on axes which are secured to the arm 12 within the confines of the tube , and a pair of outer pulley wheels 15 and 16 mounted on axes which are secured to bridges 17 and 18 respectively , releasably suspended from opposite outer ends of the arm . a flexible elongated element in the form of a length of wire or string 19 extends over all four pulley wheels and has hand grips 20 and 21 releasably attached to opposite free ends . the length of wire or string 19 is looped downwardly at a position intermediate the pulley wheels 13 and 14 , the looped portion ( indicated by the reference numeral 22 ) carrying a further pulley wheel 23 , the axis of which is secured to a bridge 24 which is in turn releasably attached to a body 25 . the upper end of the tube 11 may have fitted thereto a cap ( not shown ). the body 25 which , as shown , is a non - sealing fit inside the tube 11 , comprises an open ended tubular element 26 having a stem 27 ( connected to bridge 24 ) secured coaxially thereto by a part 28 which is secured to and diametrically traverses the interior of the tubular element 26 . the stem projects outwardly from the upper end of the tubular element and is releasably attached to the bridge 24 . an apertured valve member 29 slidably supported on the outwardly projecting portion of the stem 27 so that , in use , an exerciser pulls on one or both of the hand grips 20 , 21 , thereby causing the body 25 to lift , the valve member 29 seats against the in use upper axial end of the tubular element 26 so that water can only pass through the apertures in the valve member and this applies a restraining force against upward movement of the body 25 . however , when the exerciser releases the hand grip ( s ) the body 25 will fall readily under the influence of gravity as the valve member 29 moves on the stem 27 out of contact with the tubular element 26 . three additional pulley wheels 30 , 31 and 32 , having respective bridges 33 , 34 and 35 supporting their axes , are also provided . the bridges 33 and 34 are releasably connected to opposite sides of the base 10 and the bridge 35 is releasably connected to one end of the length of wire or string 19 . an endless length of wire or string 36 extends over all three pulley wheels 30 , 31 and 32 and a pad 37 is connected to that portion of the wire or string 36 intermediate the pulley wheels 30 and 31 . this feature enables the exerciser to exercise , inter alia , his foot and leg muscles by hooking those parts of his body around the pad 37 and exerting the necessary force to lift the body 25 . a back rest 38 is connected to the tube 11 so that an exerciser may lean against it if desired . referring now to fig2 there is shown therein a modified form of the valve member body hereinbefore designated reference number 25 . the modified body is designated by reference number 40 and comprises an open ended tubular element 41 having an arcuate arm 42 which is connected at a position adjacent its opposite free ends to inner but upper diametrically opposed portions of the element 41 . the body 40 also comprises a pair of substantially semi - circular leaf - like valve members 43 and 44 each pivoted about their inner edges 45 and 46 which lie parallel to a diaameter of the element 41 and which are disposed on opposite sides of the arm 42 . at least one of the members 43 , 44 is pivoted about downturned flanges in one of at least two pairs of slots which are formed in the upper edge of the element 41 and which permit the spacing between adjacent parallel edges of the members 43 and 44 to be altered thereby adjusting the aperture defined therebetween and thus the restraining force applied to the body 40 as it undergoes upward movement . if desired , an aperture 47 may be formed in one or both members 43 , 44 . the two members 43 and 44 are resiliently connected together by two strips of elongated resilient material 48 and 49 which are respectively looped under inturned ends of the arm 42 , the strips 48 and 49 resiliently urge the two members 43 and 44 to a position in which they substantially close the upper end of the element 41 during restrained upward movement of the body . however , when the body falls downwardly under the influence of gravity , the members 43 and 44 pivot upwardly against the resilient bias because of the pressure exerted by the water in the tube 11 , thus allowing unrestrained downward movement of the body .	0
it can be deduced that a superconductive thin film to be formed according to the first embodiment of this invention has a composition represented by the following formula : wherein u , v , x , y and z are numerals satisfying the following relationships : the content of each of the metal components of the superconductive thin film obtained by the first embodiment can be determined by means of x - ray fluorescence spectroscopy ; whereas the oxygen content of the thin film can be determined by means of epma ( electron probe x - ray microanalyzer ). it can further be deduced that the crystal structure of the thin film is of rhombic system as analyzed according to x - ray diffractometry . if the elements in each component constituting the thin film are compounded at a ratio not included in the range as specified above , other phases which do not exhibit superconductivity may also be present within the thin film to be formed to deteriorate the characteristics of the thin film . next , it can be deduced that the superconductive thin film to be formed according to another embodiment of this invention has a composition represented by the following formula : wherein α represents at least one of y , la , nd , sm , eu , gd , dy , ho , er , tm , yb and lu ; and u , x , y and z are numerals satisfying the following relationships : the contents of the metal components and oxygen of the thin film can be determined in the same manner as in the first embodiment by means of fluorescent x - ray spectroscopy and epma , respectively . also , it can be deduced that the crystal structure of the thin film is of oxygen - free triple perovskite structure as analyzed by means of x - ray diffractometry . if the elements in each component constituting the thin film are compounded at a ratio not included in the range as specified above , other phases which do not exhibit superconductivity may also be present within the thin film to be formed to deteriorate the characteristics of the thin film similarly to the first embodiment of this invention . referring first to the first embodiment of this invention , description will be made in more detail by way of respective steps . first , a solution containing at least one compound selected from each of the groups a , b , c , d and e is prepared . as the compounds of the group a , at least one of lanthanum methoxide ( la ( och 3 ) 3 ), lanthanum ethoxide ( la ( oc 2 h 5 ) 3 ), lanthanum propoxide ( la ( oc 3 h 7 ) 3 ), lanthanum butoxide ( la ( oc 4 h 9 ) 3 ), lanthanum methoxyethoxide (( la ( oc 2 h 4 och 3 ) 3 ) and lanthanum ethoxyethoxide ( la ( oc 2 h 4 oc 2 h 5 ) 3 ) may be used . as the compounds of the group b , at least one of methoxide , ethoxide , propoxide , butoxide , methoxyethoxide and ethoxyethoxide of a metal selected from ba , sr and ca may be used . the compounds have functional groups of methoxy group (-- och 3 ), ethoxy group (-- oc 2 h 5 ), propoxy group (-- oc 3 h 7 ), butoxy group (-- oc 4 h 9 ), methoxyethoxy group (-- oc 2 h 4 och 3 ), ethoxyethoxy group (-- oc 2 h 4 oc 2 h 5 ), respectively . as compounds of the group c , at least one of copper methoxide ( cu ( och 3 ) 2 ), copper ethoxide ( cu ( oc 2 h 5 ) 2 ), copper propoxide ( cu ( oc 3 h 7 ) 2 ), copper butoxide ( cu ( oc 4 h 9 ) 2 ), copper methoxyethoxide ( cu ( oc 2 h 4 och 3 ) 2 ), copper ethoxyethoxide ( cu ( oc 2 h 4 oc 2 h 5 ) 2 ) may be used . as compounds of the group d , at least one of monoethanolamine , diethanolamine , triethanolamine , mono - 2 - propanolamine , di - 2 - propanolamine , acetylacetone , ethylene glycol , diethylene glycol , propylene glycol and dipropylene glycol may be used . as compounds of the group e , at least one of methanol , ethanol , propanol , butanol , methoxyethanol and ethoxyethanol may be used . the methoxyethoxide and the ethoxyethoxide as exemplified in the group a , b or c are also referred to as methoxyethylate and ethoxyethylate , respectively . the propoxide as exemplified in the above group a , b or c may be either 1 - propoxide or 2 - propoxide , and the butoxide may be any of 1 - butoxide , 2 - butoxide , isobutoxide and t - butoxide . also , the propanol as exemplified in the group e may be either 1 - propanol or 2 - propanol , and further , the butanol may be any of 1 - butanol , 2 - butanol , isobutanol and t - butanol . the compounds of the group d are used for inhibiting the metal atoms constituting the compounds in the groups a , b and c from precipitating as particulate hydroxides or oxides through hydrolysis during the processes until calcination to be described later ; whereas the compounds of the group e serve as solvents . the compounds selected from the groups d and e are desirably subjected to dehydration treatment by use of molecular sieves and the like in order to inhibit hydrolysis of the compounds of the groups a , b and c when they are mixed with the compounds of the groups d and e . one compound is usually selected from each of the groups a , c , d and e for use . although it is possible to use two or more compounds selected from each of these groups , significant difference may not substantially be observed virtually in the superconductive thin film to be obtained as a residue of calcination , since what differentiates these compounds from each other is merely the organic functional groups such as alkoxy group and alkoxyalkoxy group which are the moieties to be volatilized finally during the calcination process to be described later . thus , it involves rather inconvenience such as increase in cost due to complicated process and so on to use two or more compounds selected from each of these groups . accordingly , the subsequent procedures need not be changed if any of these compound is selected . also , significant difference may not be observed in the characteristics of the superconductive thin film to be obtained by use of any compounds selected from each of these groups . from the group b , one or more compound can be selected for use . when two or more compounds selected from this group are used , they should have a metallic moiety which is different from each other . namely , the reason is that significant difference may not substantially be obtained virtually in the superconductive thin film to be obtained as a residue of calcination , if two or more compounds which are differentiated from each other merely by the organic functional groups such as alkoxy group and alkoxyalkoxy group are used , since such groups are finally volatilized during the calcination process to be described later . the ratio of mixing the compounds selected from the groups a , b , c , d and e , which may vary slightly depending on the types of the compounds , must be in the range satisfying both of the following equations : provided that the compounds of the groups a , b , c and d are used in an amount of a mol , b mol , c mol and d mol , respectively , and that the compound of the group e is used in an amount of e liter . namely , in the range of d & lt ; 0 . 1 ×( a + b + c ), hydrolysis may not sufficiently be inhibited , whereas in the range of d & gt ; 3 ×( a + b + c ), the resulting solution comes to have an extremely increased viscosity . in either case , formation of films to be described later will be infeasible . also , in the range of [( a + b + c )/ e ]& lt ; 0 . 01 , the amount of the solvent is excessive , which is not suitable for practical uses . further , in the range of [( a + b + c )/ e ]& gt ; 3 , the compounds of the groups a , b and c remain undissolved in certain circumstances . in order to prevent more sufficiently the inconveniences in each of the above cases , the amount of these compounds are preferably in the following range : more preferably , in addition to the above condition the following equation is further satisfied respectively . if x and y are not included within the above range , other phases which do not exhibit superconductivity are also liable to be present to deteriorate sometimes the characteristics of the resulting thin film . mixing operation can be carried out by adding at one time the compounds selected from the groups a , b and c to the mixture of the compounds selected from the groups d and e ; or by preparing solutions each comprising a mixture of compounds selected from the groups d and e , added thereto a compound selected from the groups a , b and c , respectively , and then mixing predetermined amounts collected from the thus prepared solutions . it should be noted that , since there is a fear that each of the compounds selected from the groups a , b and c may undergo hydrolysis to precipitate in the form of particle depending on the level of water content in the atmosphere , i . e . moisture level , it is desired in order to prevent such phenomenon , not to allow the compounds selected from the groups a , b and c to be exposed to moisture as far as possible , and preferably the mixing operation is conducted such as in a grab box purged with dry nitrogen . however , subsequent operations can be conducted in atmospheric conditions . subsequent to the above process , a thin film of the solution prepared above is formed on a heat - resistant substrate . as the substrate , any material can be used so long as it is resistant to the calcination temperature to be described later , and metals such as gold , silver and platinum ; alloys containing at least one of gold silver and platinum as a major component ; glass materials such as e glass , s glass , etc . ; ceramics such as alumina , alumina silica , magnesia , partially stabilized zirconia , yttria stabilized zirconia , yttria , lanthania , silicon carbide , titanium carbide , silicon nitride , niobium nitride , boron nitride , alkali titanate , potassium lead silicate , strontium titanate , titanium boride , zirconium boride , etc . can be used . substrates may take any form , for example , the form of fiber , film , plate or bulk . these substrates may preferably be polished to have smooth surface , further washed to remove dusts deposited on the surface thereof , and degreased to improve wettability with the solution prepared above . as the mode of film formation , brush coating , roll coating , spray coating , dip coating where a substrate is dipped in the solution and then drawn up therefrom , etc . may be employed . the dip coating is preferred since it is simple and by it , film thickness can be adjusted easily by changing the speed of drawing up the substrate from the solution . next , the thin film of the solution formed on the substrate is dried to evaporate the compound of the group e , so that the thin film may comprise the compounds selected from each of the groups a , b , c and d . this process may be carried out at normal temperature or at a temperature adjusted in the range of about 50 ° to 100 ° c . finally , the dried film is calcined as carried on the substrate , whereby the desired superconductive thin film represented by the formula as described above can be obtained . the calcination is carried out as follows : namely , the dried thin film is placed in an oven , and then heated to the calcination temperature in an oxidative atmosphere , i . e . in air or in an environment where the oxygen concentration is controlled to 20 to 100 %. after the thin film is maintained at the temperature for a predetermined time , it is cooled to room temperature . heating rate is about 1 ° to 1 , 000 ° c ./ min . ; the calcination temperature is 350 ° to 1 , 150 ° c . ; the soaking time is about 5 to 30 minutes ; and the cooling rate is about 1 ° to 1 , 000 ° c ./ min . if the heating rate is lower than 1 ° c ./ min ., it takes too much time to be suitably employed for practical uses ; whereas if it is higher than 1 , 000 ° c ./ min ., cracks may sometimes be formed on the film . if the calcination temperature is lower than 350 ° c ., the organic components such as the compounds of the groups d and e as such and the functional groups of the compounds employed may remain within the thin film ; whereas if it is higher than 1 , 150 ° c ., the film may partially be melted or evaporated . if the cooling rate is lower than 1 ° c ./ min ., it takes too much time to be suitably employed for practical uses ; whereas if it is higher than 1 , 000 ° c ./ min ., cracks may sometimes be formed on the thin film . while the first embodiment of this invention has been described heretofore , the embodiment can basically be applied to another embodiment . namely , referring to the preparation of the solutions in another embodiment , what is different from the first embodiment is the use of the following compounds as those selected from the groups a and b of all the groups a , b , c , d and e . that is to say , as the compounds of the group a , at least one of methoxide , ethoxide , propoxide , butoxide , methoxyethoxide and ethoxyethoxide of an element selected from y , la , nd , sm , eu , gd , dy , ho , er , tm , yb and lu man be used . the compounds have functional groups of methoxy group , ethoxy group , propoxy group , butoxy group , methoxyethoxy group and ethoxyethoxy group , respectively . as the compounds of the group b , one or more of methoxide , ethoxide , propoxide , butoxide , methoxyethoxide and ethoxyethoxide of ba and / or sr may be used . the compounds have functional groups of methoxy group , ethoxy group , propoxy group , butoxy group , methoxyethoxy group and ethoxyethoxy group , respectively . the same ratio of mixing the compounds selected from each of the groups a , b , c , d and e as used in the first embodiment can also be used . however , it is preferred in this embodiment that the following ratio : is satisfied , although in the first embodiment the preferred ratio has been specified as follows : in this embodiment , the same procedures for thin film formation and drying as used in the first embodiment can be used . however , the calcination process in this embodiment is somewhat different from that of the first embodiment . to describe in detail , in this embodiment , there may be employed a heating rate of about 1 ° to 1 , 000 ° c ./ min ., a calcination temperature of 350 ° to 1 , 100 ° c . and a soaking time of about 5 to 30 minutes . referring to the cooling rate , when a cooling rate of 0 . 1 ° to 2 ° c ./ min . is used , cooling can be carried out at this rate to room temperature . however , if other cooling rates , particularly high cooling rates of about 2 ° to 1 , 000 ° c ./ min . are used , such high - speed cooling may be carried out until 500 ° c ., but the cooling rate should be reduced to 0 . 1 ° to 2 ° c ./ min . from the range of 500 ° c . to room temperature , otherwise tetragonal crystals may grow within the resulting film and the thin film may not exhibit superconductivity . however , if such phenomenon should occur , it is possible to make the thin film superconductive by heattreating it again in an oxidative atmosphere at 300 ° to 700 ° c . for 2 hours or more . in a grab box through which a dry nitrogen is passed , 0 . 018 mol of lanthanum methoxide ( la ( och 3 ) 3 ), 0 . 002 mol of barium methoxide ( ba ( och 3 ) 2 ), and 0 . 01 mol of copper methoxide ( cu ( och 3 ) 2 were metered and combined , and 0 . 03 mol of monoethanolamine and further 100 ml of methanol were added thereto . the resulting mixture was stirred by means of a stirrer for 30 minutes to prepare a solution for coating . on the other hand , 1 mm thick partially stabilized zirconia ( psz ) plate was subjected to ultrasonic cleaning successively with trichloroethylene , acetone , ethanol and pure water for three minutes , respectively , and then dried by blowing thereto a high - purity dry nitrogen . next , the above psz plate was dipped in the solution obtained above , and after one minute , it was drawn up vertically therefrom at a rate of 10 cm / min . to form a thin film of the solution on the psz plate . the solution exhibited very good film - forming properties . subsequently , the thin film thus formed was placed in a soaking oven and dried at 50 ° c . for 30 minutes . next , the dried thin film as carried on the psz plate was placed in an electric oven and heated to 1 , 130 ° c . at a heating rate of 10 ° c ./ min . and kept at that temperature for 10 minutes . then , it was cooled to room temperature at a cooling rate of 50 ° c ./ min . to provide a superconductive thin film comprising la 1 . 8 ( ba 1 ) 0 . 2 cu 1 o 4 as a single phase on the psz plate . the superconductive thin film was obtained as a black and lustrous film , and neither contaminant nor cracking was found when observed through an optical microscope at 600 power . the thin film obtained had a thickness of 20 nm , and an onset temperature of superconductive transition ( t ce ) of 42k , an end point of superconductive transition ( t ce ) of 38k , and a critical current density ( jc ) of 2 × 10 6 a / cm 2 . incidentally , t co and t ce were determined according to the following modes , respectively . to describe in detail , four au electrodes were vapordeposited at regular intervals on the thin film thus formed according to the method described in &# 34 ; low temperature technique &# 34 ; vol . 7 of &# 34 ; experimental physical engineering &# 34 ; series , p 67 , may 31 , 1977 , shunichi kobayashi , published by tokyo university , and an au wire was pasted to each electrode using a silver paste . an au / fe chromel thermocouple was bonded to the film at the center thereof , and the whole was placed in a copper sheath . subsequently , the au wire terminals of the outer pair of au electrodes formed on the surface of the film were connected to a constant current source of 0 . 01 to 10 ma , and the au wire terminals of the inner pair of the au electrode formed on the surface of the thin film and the terminals of the thermocouple were connected to different direct - read type voltmeters , respectively . the copper sheath in which the thus treated thin film is placed was dipped slowly in a liquid helium contained in a dewar flask and the values indicated by the two direct - read type voltmeters were read every moment . temperature of the thin film was calculated from the reading of the voltmeter connected to the thermocouple ; whereas the resistance of the thin film was calculated from the reading of the voltmeter connected to the au electrodes formed on the internal surface of the thin film . the data thus obtained were plotted into a temperature / resistance curve to obtain t co from this curve . on the other hand , t ce was obtained by reading the maximum value within the temperature where the reading of the voltmeter drops below 4 × 10 - 7 v . jc was determined in the following manner . to describe in detail , the same procedures following as described above until the copper sheath was dipped at a stretch in a liquid nitrogen contained in a dewar flask , after the thermocouple was removed from the thin film . subsequently , power was continuously supplied from the constant current source at an incremental preset current value of 0 . 1 a until the voltmeter connected to the inner pair of au electrodes formed on the surface of the thin film indicates a voltage . the present current value ic immediately before the voltmeter shows a voltage was read , and the read value was divided by the sectional area ( t × w , wherein t represents a thickness and w represents a width of the film ) to calculate jc . solutions comprising various compositions were prepared in the same manner as in example 1 by using different types of compounds each selected from the groups a , b , c , d and e in different amounts as shown in table 1 . thin films were formed on psz plates using the solutions prepared above in the same manner as in example 1 . the resulting thin films were determined for composition , film state and superconductivity in the same manner as in example 1 , and the results obtained are shown in table 2 . overall evaluation for the thin films is also shown in table 2 . in the overall evaluation , the mark ⊚ means excellent film - forming properties , no contaminants / no cracking in the thin film and good superconductivity ; the mark ○ means moderately good film - forming properties , no contaminants / no cracking in the thin film and good superconductivity ; and the mark δ means some difficulty in film formation , presence of some contaminants / cracking in the thin film and poor or no superconductivity . incidentally , for the purpose of finding out the influence of the calcination temperature on the thin film properties , dried thin films were formed on psz plates using the solution as prepared in example 14 in the same manner as in example 1 . the thin films as carried on the substrates were then placed in an electric oven and calcined at different calcination temperatures , respectively , wherein four standard calcination temperatures of 300 ° c ., 400 ° c ., 800 ° c . and 1 , 200 ° c . were used . the thin films obtained are listed in table 2 as example 31 , 32 , 33 and 34 , together with the states of the film . table 2__________________________________________________________________________ super - conductivity overallexample t . sub . co t . sub . ce evalu - no . composition film state ( k ) ( k ) ation__________________________________________________________________________ 2 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 39 36 ⊚ no cracking 3 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 39 38 ⊚ no cracking 4 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 42 40 ⊚ no cracking 5 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 41 39 ⊚ no cracking 6 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 38 35 ⊚ no cracking 7 la . sub . 1 . 8 ( sr . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 40 38 ⊚ no cracking 8 la . sub . 1 . 8 ( sr . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 39 37 ⊚ no cracking 9 la . sub . 1 . 8 ( ba . sub . 0 . 5 ca . sub . 0 . 5 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 42 39 ⊚ no cracking10 la . sub . 1 . 8 ( ba . sub . 0 . 5 ca . sub . 0 . 5 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 38 36 ⊚ no cracking11 la . sub . 1 . 8 ( sr . sub . 0 . 5 ca . sub . 0 . 5 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 41 36 ⊚ no cracking12 la . sub . 1 . 8 ( ba . sub . 0 . 34 ca . sub . 0 . 33 ca . sub . 0 . 33 ). sub . 0 . 2 cu . sub . 1o . sub . 4 no contaminant / 39 37 ⊚ no cracking13 la . sub . 2 cu . sub . 1 o . sub . 4 no contaminant / 38 37 ⊚ no cracking14 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 42 40 ⊚ no cracking15 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 39 36 ⊚ no cracking16 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 39 38 ○ no cracking17 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 42 40 ○ no cracking18 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 38 34 δ no cracking19 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 38 35 ⊚ no cracking20 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 40 38 ○ no cracking21 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 39 37 ○ no cracking22 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 35 32 δ no cracking23 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 42 39 ⊚ no cracking24 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 40 39 ○ no cracking25 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 38 36 ○ no cracking26 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 39 36 δ no cracking27 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 40 38 ⊚ no cracking28 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 39 36 ○ no cracking29 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 38 36 ○ no cracking30 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 35 32 δ no cracking31 -- organic compo - -- -- x nents remained32 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 39 36 ○ no cracking33 la . sub . 1 . 8 ( ba . sub . 1 ). sub . 0 . 2 cu . sub . 1 o . sub . 4 no contaminant / 39 38 ○ no cracking34 -- melted -- -- x__________________________________________________________________________ in a grab box through which a dry nitrogen is passed , 0 . 01 mol of yttrium methoxide ( y ( och 3 ) 3 ), 0 . 02 mol of barium methoxide ( ba ( och 3 ) 2 ), and 0 . 03 mol of copper methoxide ( cu ( och 3 ) 2 ) were metered and combined , and 0 . 06 mol of monoethanolamine and further 100 ml of methanol were added successively thereto . the resulting mixture was stirred by means of a stirrer for 30 minutes to prepare a solution for coating . on the other hand , 1 mm thick psz plate was subjected to ultrasonic cleaning successively with trichloroethylene , acetone , ethanol and pure water for three minutes , respectively , and then dried by blowing thereto a high - purity dry nitrogen . next , the above psz plate was dipped in the solution obtained above , and after one minute , it was drawn up vertically therefrom at a rate of 10 cm / min . to form a thin film of the solution on the psz plate . the solution exhibited very good film - forming properties . subsequently , the thin film thus formed was placed in a soaking oven and dried at 50 ° c . for 30 minutes . next , the dried thin film as carried on the psz plate was placed in an electric oven and heated to 930 ° c . at a heating rate of 10 ° c ./ min . and kept at that temperature for 10 minutes . then , it was cooled to 500 ° c . at a rate of 50 ° c ./ min . and then to room temperature at a rate of 1 ° c ./ min . to provide a superconductive thin film comprising y ( ba 1 ) 2 cu 3 o 6 . 9 as a single phase on the psz plate . neither contaminant nor cracking was found on the superconductive thin film when observed through an optical microscope at 600 power . the thin film obtained had a thickness of 45 nm , and an onset temperature of superconducting transition ( t co ) of 98k , an end point of superconducting transition ( t ce ) of 96k , and a critical current density of 5 × 10 6 a / cm 2 . solutions comprising various compositions were prepared in the same manner as in example 35 by using different types of compounds each selected from the groups a , b , c , d and e in different number of moles as shown in table 3 . films were formed on psz plates using the solutions prepared above in the same manner as in example 35 . the resulting thin films were determined for composition , film state and superconductivity in the same manner as in example 35 , and the results obtained are shown in table 4 . overall evaluation for the thin films is also shown in table 4 . in the overall evaluation , the mark ⊚ means excellent film - forming properties , no contaminants / no cracking in the thin film and good superconductivity ; the mark ○ means moderately good film - forming properties , no contaminants / no cracking in the thin film and moderately good superconductivity ; and the mark δ means some difficulty in film formation , presence of some contaminants / cracking in the thin film and poor or no superconductivity . incidentally , for the purpose of finding out the influence of the calcination temperature on the thin film properties , dried thin films were formed on psz plates using the solutions as prepared in example 54 in the same manner as in example 35 . the thin films carried on the substrates were then placed in an electric oven and calcined at different calcination temperatures , respectively , wherein four standard calcination temperatures of 300 ° c ., 400 ° c ., 800 ° c . and 1 , 200 ° c . were used . the thin films obtained are listed in table 4 as example 70 , 71 , 72 and 73 , together with the states of the film . table 4__________________________________________________________________________ super - conductivity overallexample t . sub . co t . sub . ce evalu - no . composition film state ( k ) ( k ) ation__________________________________________________________________________36 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 96 93 ⊚ no cracking37 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 95 93 ⊚ no cracking38 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 98 95 ⊚ no cracking39 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 99 94 ⊚ no cracking40 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 organic compo - 96 93 ⊚ nents remained41 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 98 93 ⊚ no cracking42 nd ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 99 95 ⊚ no cracking43 sm ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 97 92 ⊚ no cracking44 eu ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 98 93 ⊚ no cracking45 gd ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 95 92 ⊚ no cracking46 dy ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 99 95 ⊚ no cracking47 ho ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 organic compo - 96 92 ⊚ nents remained48 er ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 97 95 ⊚ no cracking49 tm ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 96 93 ⊚ no cracking50 yb ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 95 93 ⊚ no cracking51 lu ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 95 93 ⊚ no cracking52 y ( sr . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 95 92 ⊚ no cracking53 y ( ba . sub . 0 . 5 sr . sub . 0 . 5 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 97 95 ⊚ no cracking54 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 98 96 ⊚ no cracking55 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 95 92 δ no cracking56 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 organic compo - 95 93 ○ nents remained57 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 98 95 ○ no cracking58 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 99 94 ⊚ no cracking59 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 organic compo - 96 93 ⊚ nents remained60 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 97 95 ○ no cracking61 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 95 93 δ no cracking62 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 96 93 δ no cracking63 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 95 93 ○ no cracking64 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 98 95 ○ no cracking65 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 99 94 ⊚ no cracking66 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 96 93 ⊚ no cracking67 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 98 93 ○ no cracking68 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 98 95 ○ no cracking69 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 96 92 δ no cracking70 -- organic com - -- -- x pounds remained71 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 88 73 δ no cracking72 y ( ba . sub . 1 ). sub . 2 cu . sub . 3 o . sub . 6 . 9 no contaminant / 90 80 δ no cracking73 -- melted -- -- x__________________________________________________________________________	8
fig1 is an example of a typical magnetic storage system 10 . a magnetic storage system 10 comprises a disk assembly 21 , and a hard disk controller ( hdc ) 30 having a local central processing unit ( cpu ). the disk assembly has a disk driver ( hereinafter referred to as a spindle motor ) 14 which rotates a shaft 12 at high speed . a cylindrical spindle 16 is axially aligned with and is attached to the shaft 12 . one or more disks 18a and 18b are affixed to the outer surface of the spindle 16 at a predetermined spacing . when the spindle motor 14 rotates the shaft 12 , the disks 18a and 18b rotate integrally with the spindle 16 . each head 20a to 20d faces a disk surface . the access arms 22a to 22d support and position the heads 20a to 20d respectively . the access arms 22a to 22d attach to a signal transducer driver ( hereinafter referred to as an actuator ) 28 through a shaft 24 . the shaft 24 rotates to position the heads 20a to 20d over predetermined locations on the disk ( tracks ). the spindle motor 14 and actuator 28 connect to the hdc 30 , which controls the number of revolutions , speed and the like of the disks . the hdc 30 may be connected to a host . fig2 is a partial sectional view of a typical apparatus found in the prior art for affixing disks to a spindle . a clamp 60 affixes the disks 18a , 18b , and 18c to the spindle 16 using a screw 62 to press the clamp 60 against the spindle 16 . when the screws 62 are tightened , a force is applied to the disks 18a , 18b and 18c which affixes the disks to the spindle 16 . a curved portion 61 is formed in the outer peripheral surface of the clamp 60 . the curved portion 61 applies a force to the disk 18a to affix the disks . spacers 64a and 64b , sandwiched between the disks , maintain uniform disk spacing . fig3 and 4 are perspective and sectional views of a prior art clamp 60 found in a typical disk drive . fig5 is a partially enlarged view of the area surrounding an insertion hole . as shown in fig3 a plurality , six in this example , of insertion holes 66 are formed in the clamp 60 . screws are inserted into the insertion holes 66 and fastened to the spindle . small holes 67 on either side of the insertion holes 66 are provided for an assembling tool . fig4 shows the curved portion 61 of the outer peripheral edge of the clamp 60 which applies a force to the disk to affix it . the bottom of the screw head contacts the clamp 60 to press the clamp 60 . fig5 shows the contact area ( pressing area ) 68 between the screw and the clamp 60 . the entire bottom surface of the screw head contacts and applies a force to the clamp 60 . now referring to fig6 to 9 , the apparatus for affixing disks according to the preferred embodiment of the present invention is explained . fig6 is a sectional view showing the positional relationship between the disks 18a , 18b , 18c , spindle 16 , and clamp 50 when they are affixed . fig7 is a sectional view of a clamp 50 according to the preferred embodiment of the present invention . fig8 is a perspective view of a clamp 50 according to the preferred embodiment of the present invention . fig9 is a partial view of a clamp 50 showing the area surrounding insertion hole 51 according to the preferred embodiment of the present invention . in fig6 a clamp 50 has insertion hole 51 . clamp 50 is positioned so that the insertion hole 51 of the clamp 50 is aligned with the insertion hole 53 of the spindle 16 . a j - ring 55 is sandwiched between the clamp 50 and the disk 18a . when the clamp 50 is screwed to the spindle , the screws cause the clamp 50 to apply a force to the disks 18a , 18b , 18c through the j - ring 55 , thereby affixing the disks 18a , 18b , 18c to the spindle 16 . the clamping force is uniformly transmitted to the disk 18a through the j - ring 55 . the j - ring 55 is an annular member . typically , the j - ring 55 is made of aluminum if the disks are aluminum , so that the j - ring 55 and disks 18a , 18b , 18c have similar thermal linear expansion coefficients . if the disks are made of glass , the j - rings 55 are stainless steel or ceramic . spacers 54a and 54b are sandwiched between the disks 18a , 18b , 18c to maintain a uniform spacing between the disks 18a , 18b , 18c . the spacers 54 are machined with high precision , as is the j - ring , to keep the disks parallel . the spacers 54 are formed from aluminum or similar material . fig7 is a sectional view of the clamp 50 according to the present invention . insertion hole 51 is formed in the clamp 50 , and a step 59 is formed in the surface surrounding the screw insertion end of the insertion hole 51 . the step 59 is formed by reducing the thickness of the outer portion 72 of the clamp 50 . a gap is formed between the thin outer portion 72 of the clamp and the bottom of the screw head 74 when a screw is fastened through the insertion hole 51 . in fig8 a perspective view of the clamp 50 of the present invention is shown . as previously described , the inner portion 70 of the clamp is thicker than ( raised with respect to ) the outer portion 72 of the clamp . assuming that the circumference of a circle passes approximately through the center of the insertion hole 51 , the portion of the clamp inside the circle is thicker than the portion of the clamp outside the circle , thus forming a step 59 . fig9 shows a partially enlarged view of the area surrounding the insertion hole 51 . in the clamp 50 , a plurality of insertion holes 51 are formed . in a preferred embodiment , six insertion holes 51 are formed about the clamp 50 . in alternative embodiments , there may be more or less insertion holes 51 without departing from the scope of the invention . screws are inserted in the insertion holes 51 and tightened against the spindle 16 . the bottom of the screw head 74 , shown in fig8 contacts the clamp 50 surface to apply a force to the clamp 50 . in fig9 the shaded area 58 represents the contact area between the screw 62 and the clamp 50 . the bottom of the screw head 74 contacts the clamp 50 not in whole but in part to apply a force to the clamp 50 . in other words , the screw 62 contacts the clamp 50 surface only in the thick portion 70 of the clamp 50 . a gap is formed between the screw 62 and the thinner portion 72 of the clamp 50 . the fastening of the screw 62 produces a distortion in the clamp area nearest the screw &# 39 ; s center . however , because the clamp 50 has a thin outer portion 72 and the force of the screw 62 is applied only to the inner portion of the insertion hole 51 ( contact area 58 of fig9 ), the distortion in the outer portion 72 of the clamp more easily diffuses . therefore , the force applied to the j - ring 55 from the clamp 50 becomes more uniform . accordingly , disk distortion and deformation decreases . it is preferable , for stability , that approximately half of the area of the bottom of the screw head 74 contact the shaded area 58 surrounding the insertion hole 51 nearest the clamp &# 39 ; s center . fig1 and 11 show the results of a quantitative analysis of the amount of distortion of a disk between use of a clamp apparatus found in the prior art and the apparatus in accordance with the present invention . fig1 shows the inverse of curvature along the disk &# 39 ; s circumference . fig1 shows the inverse of curvature along the disk &# 39 ; s radius . the amount of distortion decreases as the inverse of curvature decreases . in both figures , the right bar represents the result obtained by the clamp according to the present invention and the left bar represents the result obtained by a typical clamp . the clamp according to the present invention has a smaller inverse of curvature than the typical clamp , thus indicating that the clamp according to the present invention has less distortion . these results are based on a measurement of interference fringes by a laser beam under the following conditions : the number of disks is 3 ; the disk material is aluminum ; and the screw torque is 3 . 5 kgf · cm . therefore , according to the present invention and as shown in fig9 and 10 , disks 18a , 18b can be affixed to a spindle 16 while reducing disk distortion and deformation . the foregoing description of the preferred embodiment of the invention has been presented for the purposes of illustration and description . it is not intended to be exhaustive or to limit the invention to the precise form disclosed . many modifications are possible in light of the above teaching . it is intended that the scope of the invention be limited not with this detailed description but rather by the claims appended hereto .	6
the disclosed device enables a user to easily rotate the angle between a ratchet head and the angle without changing tools . the device also enables rapid removal and / or exchange of the existing ratchet head for a different size or type of wrench head . the disclosed quick release ratchet head invention illustrated is comprised of an e shaped structure , having several embodiments . other methods of attachment can also be utilized that will be evident to those skilled in the art . in one embodiment , which is used for ratchets which have rotatable heads , the longest leg of the e shaped structure is the activating shaft , with the two pins being different lengths . the activating shaft can be threaded on one end and have a button with a spring between the button and the handle to maintain the e - shaped structure in adjacent the handle . the center leg or locking pin is the shortest to enable the center leg disengage , when the activating shaft is depressed , from one of the plurality of holes for rotation purposes . this allows the offset wrench to rotate while the third leg or the pivot pin remains connected between the handle and the flange of the ratchet head . once the wrench head is rotated to the desired position , the activating shaft is released , returning the locking pin to its locked position ready for use . preferably , the activating shaft is prevented from total depression by a mechanism interfering with the line of travel . two ways this can be done , but not limited to , are ( 1 ) perpendicular ball nose spring plunger or ( 2 ) a spring release pin is inserted through the side of the handle . in the second embodiment , where the ratchet wrench is a straight conventional design , the e 2 shaped structure can have an activating shaft as the longest leg and the other two legs can be of equal length in order for the simultaneous disengagement of both pins , the pivot pin and the locking pin to release the head of the ratchet quickly . in the first embodiment , illustrated in fig1 the central plate 10 of the release device 28 has three pins attached to it at a right angle . the longest pin is the activating shaft 12 that is , in this embodiment , threaded at the distal end 14 . the activating shaft 12 can be inserted into handle 16 from either the top or the underside and is a manufacturing and user preference . as described herein , the release device 28 is inserted through the bottom of the wrench receiving area 21 of the handle 16 , however this is not intended to limit the disclosure . the receiving area 21 has three corresponding channels 15 , 17 and 19 to receive the pivot pin , 26 , locking pin 24 , and activating shaft 12 , respectively . once the release device 28 is inserted through the receiving area 21 , the activating shaft 12 extends beyond the opposing side of the handle 16 . in a preferred embodiment a spring 18 can be placed over the threaded area 14 and a button 20 attached to the threaded area 14 of the activating shaft 12 , the button 20 having a threaded hole 22 dimensioned to receive the threaded activating shaft 12 . alternatively , the shaft can remain unthreaded and the button can be welded , glued , or otherwise affixed to the shaft as known in the art . it should also be noted that other designs for engaging the activating shaft with the release device can be used and will be evident to those skilled in the art . in the embodiment illustrated in fig1 and 2 is the preferable embodiment for use with the rotating , indexable wrench head as illustrated hereinafter . in this embodiment , the locking pin 24 is the shortest in length , so that when the activating shaft 12 is partially depressed , the locking pin 24 is the first pin to become disengaged from the flange 46 of the ratchet head 44 . the flange 46 of the ratchet head 44 is dimensioned to fit within the receiving notch 27 in a manner that prevents the ratchet head 44 from wobbling , but permits easy removal . the flange 46 has channels 26 a , 24 a and 12 a that are positioned and sized to receive the pivot pin 26 , locking pin 24 and activating shaft 12 respectively . the dimensioning between the shaft 46 and the receiving area 19 must be such that the interaction between parts is snug , but not a friction fit . the ratchet head 44 , including the flange 46 , is illustrated in more detail in fig1 . the depression of the activating shaft 12 enables the rotation of the head of the wrench 44 . once the desired position is reached , the activating shaft 12 is released , returning to its original position , and the ratchet head 44 is locked for use . the third pivot pin 26 has a length greater than that of the locking pin 24 and less than that of the activating shaft 12 . when the activating shaft 12 is fully depressed , the pivot pin 26 is now disengaged from the flange 46 . this allows the user to exchange or disconnect the head of the ratchet 44 quickly with a one hand operation . the ratios between the activating shaft 12 , locking pin 24 and pivot pin 26 are such that both the locking pin 24 and pivot pin 26 are released when the activating shaft 12 is fully depressed . during partial depression of the activating shaft 12 , however , the pivot pin 26 must remain within the upper receiving notch 15 a sufficient distance to ensure stability during the rotation process . thus , the proportions between the locking pin 24 and the pivot pin 26 must be such that partial depression of the activating shaft 12 removes the locking pin 24 from its channel 17 and complete depression of the activating shaft 12 further releases the pivot pin 26 from its channel 15 . since the ratchet 44 is not maintained in position by the activating shaft 12 , the ratchet 44 can be removed without removal of the activating shaft 12 . [ 0027 ] fig2 demonstrates the release device , e 1 shaped structure 28 inserted into the receiving area 21 . in the illustrated preferred embodiment , the e - shaped structure 28 is recessed into the receiving area 21 and handle 16 . [ 0028 ] fig3 illustrates the e - shaped structure 228 with the activating shaft 212 displaying a cut out 232 . the cut out 232 is a reduced diameter section of the shaft 212 that serves to stop the depression of the activating shaft 212 . the cut out 232 interacts with the spring release pin 234 , illustrated in fig4 to provide the three degrees of activating shaft 212 depression . as stated heretofore , when the wrench is in use , the activating shaft 212 is in the first , or un - depressed , stage with both the pivot pin 226 and locking pin 224 within the upper receiving channels 15 and 17 . to rotate the head 44 , the activating shaft 212 is depressed to the second stage , bringing the release pin 234 to the upper end of the cutout 232 . this releases the locking pin 224 from interaction with the upper receiving notch 15 and the head 44 . the upper part of the cut out 232 acts as a stop when it meets up with the widest part of the spring release pin 234 in fig4 . to remove the head 44 , the release pin 234 is depressed , thereby allowing the pin 234 to be aligned with the cut out 232 and enabling the activating shaft 212 to be fully depressed . the spring release pin 234 , illustrated in fig4 consists of a cap 242 , spring 240 , a threaded section 328 , cut out 236 and body 235 . as shown in fig5 and 6 , the spring release pin 234 can be inserted into the side of the handle 216 , perpendicular to the activating shaft 212 while in a slightly offset position . when the spring release pin 234 is not depressed , the body 236 serves as a stop for the activating shaft 212 , preventing full depression of the activating shaft 212 . when the spring release pin 234 is depressed and held in a depressed position , its cut out 236 will be aligned with the activating shaft 212 , allowing the activating shaft 212 to be fully depressed . this will allow the pivot pin 226 to be disengaged from flange 46 as illustrated in fig1 . the spring release pin 234 can be threaded 238 on one end to receive cap 42 , or secured to the cap 42 through any other method known in the art . a spring 240 preferably serves to return the spring release pin 234 to its original position after depressing it to remove the head 46 of the wrench 44 in fig1 . [ 0030 ] fig5 demonstrates a top view of the spring release pin 234 positioned to stop the further depression of the activating shaft 212 . as can be seen , the activating shaft 212 is stopped by the body of the shaft of the spring release pin 234 . in order for the spring release pin 234 to prevent movement of the activating shaft 212 , due to the fact that the spring release pin 234 is passing through the cut out 232 of the activating shaft 212 , the positioning between the release pin 234 and activating shaft 212 must be precise . [ 0031 ] fig6 demonstrates a top view of the spring release pin 234 being depressed into the handle 216 . as can be seen in this figure , in a depressed position the cutout 236 is moved into a position to enable the activating shaft 212 to clear the release pin 234 , to complete the depression process . [ 0032 ] fig7 a - c demonstrate a rear view of an activating shaft 112 in an alternate embodiment using a ball nose spring plunger pin 148 , where the ball 152 serves as the stopping point for the activating shaft 112 . during use , the plunger pin 148 is in the position illustrated in fig7 a . to enable the ratchet head to rotate , the activating shaft 112 is depressed to a second step , illustrated in fig7 b , wherein the ball 152 encounters the shaft step 162 . this level removes the rotating pin from the wrench head flange , enabling rotation . to remove the wrench head , the activating shaft 112 is pressed to the third step , illustrated in fig7 c . since the ball 152 has the ability to recess into the pin 148 under pressure , applying additional pressure to the activating shaft 112 will cause the ball 152 to recess into ball nose spring plunger 148 enabling full depression of the activating shaft 112 . [ 0033 ] fig8 demonstrates a bottom view of the handle 116 indicating alignment between the ball nose spring plunger pin 148 and the activating shaft 112 extending from the release device base 110 . fig9 demonstrates a side view of handle 116 showing approximate location of ball nose spring plunger pin 148 within the body of the handle 116 . the ball nose spring plunger 148 will have to be strategically placed in order to create an additional pressure point or stopping point at the precise time to enable the locking pin 124 to be removed from the holes 52 in the neck 46 of the wrench head 44 , illustrated in fig1 . [ 0034 ] fig1 demonstrates a bottom view using the spring release pin 234 system illustrated in fig3 and 4 . when the spring release pin 234 is depressed , it allows the cut out 236 to align with the activating shaft 212 . when this occurs the activating shaft 212 can be fully depressed allowing the pivot pin 226 to pass through the neck 46 of fig1 , thereby disconnecting the head 44 from the handle 16 . [ 0035 ] fig1 demonstrates a right side view of handle 16 with the spring release pin 234 being strategically located in a slightly offset perpendicular position to the activating shaft 212 . the wider part of the spring release pin 234 will pass through the cut out 232 of the activating shaft 212 . this will allow the activating shaft 212 to stop when it reaches the widest part of the shaft of spring release pin 234 . [ 0036 ] fig1 demonstrates an alternate embodiment to the above release device in an e - shaped structure 350 with the pivot pin 326 and the locking pin 324 being of the same length . this embodiment can be used with a straight conventional wrench application ( un - indexable ) or with the indexable head . in this embodiment , both the pivot pin 326 and the locking pin 324 serve to lock the head of the wrench 344 in a solid straight position . fig1 demonstrates this embodiment inserted into the wrench 316 , wherein the e - shaped structure 310 is recessed into the handle 316 . [ 0037 ] fig1 demonstrates in a preferred embodiment for the indexable ratchet head 44 wherein a cut out 54 , on the underside of the flange 46 , is provided with a plurality of holes 52 . by recessing the holes 52 , the distance of travel for the locking pins disclosed herein can be reduced , therefore enabling a quicker release for rotating of the head of the ratchet wrench 44 . the recession of the holes 52 further enables the c - shaped structure 310 of fig1 and 13 to be used , as the locking pin 324 will disengage from the recessed holes 54 prior to the pivot pin 326 being disengaged from the pivot hole 55 . when the cut out 54 is created it allows the locking pin 24 , 234 or 324 to be longer in proportion to the depth of the cut out 54 . by lengthening the locking pin 24 to be proportionately longer , equal to the depth of the cut out 54 , greater strength is provided . [ 0038 ] fig1 & amp ; 16 demonstrate some other type of wrench heads 58 and 60 that may be used with this new improved quick release design . it should be noted that the holes can be directly drilling through the wrench flange without the recess . in this embodiment , the e - shaped structure 28 of fig1 and 2 must be used . in fig1 , the activating shaft 502 has dual cut outs 512 and 514 on either side . these serve to interact with ball nose spring plunger pins 504 and 506 , each containing balls 510 and 508 . this embodiment works in the same manner as that described heretofore in conjunction with fig7 a - c . the dual ball nose spring plunger pins provide a greater resistance , which can be required in some applications . other methods of connecting the wrench head to the handle that meet the durability and rigidity criteria as set forth herein can also be incorporated .	8
male wistar rats ( p24 - 29 ; 75 - 110 g ) were used to assess the effects of the cannabinoids : thcv ( bds and pure ) and cbd on the ptz model of generalised seizures . animals were habituated to the test environment , cages , injection protocol and handling prior to experimentation . animals were housed in a room at 21 ° c . on a 12 hour light : dark cycle ( lights on 0900 ) in 50 % humidity , with free access to food and water . five 6 l perspex tanks with lids were placed on a single bench with dividers between them . closed - circuit television ( cctv ) cameras were mounted onto the dividers to observe rat behaviour . sony topica ccd cameras ( bluecherry , usa ) were linked via bnc cables to a low - noise pc via brooktree digital capture cards ( bluecherry , usa ). zoneminder ( http :// www . zoneminder . com ) software was used to monitor rats , start and end recordings and manage video files . in - house linux scripts were used to encode video files into a suitable format for further offline analysis using the observer ( noldus technologies ). a range of doses of ptz ( 50 - 100 mg / kg body weight ) were used to determine the best dose for induction of seizures ( see below ). as a result , doses of 70 and 80 mg / kg injected intra - peritoneally ( ip ; stock solution 50 mg / ml in 0 . 9 % saline ) were used to screen the cannabinoids . on the day of testing , animals received an ip injection with either the cannabinoids ( low , medium or high dose ) or a matched volume of the cannabinoids vehicle ( 1 : 1 : 18 ethanol : cremophor : 0 . 9 % w / v nacl solution ), which served as the negative control group . animals were then observed for 30 mins , after which time they received an ip injection of 70 or 80 mg / kg ptz . negative vehicle controls were performed in parallel with cannabinoid - dosed subjects . after receiving a dose of ptz , animals were observed and videoed to determine the severity of seizure and latency to several seizure behaviour types ( see in vivo analysis , below ). animals were filmed for half an hour after last sign of seizure , and then returned to their cage . animals were observed during experimental procedures , but all analysis was performed offline on recorded video files using the observer behavioural analysis software ( noldus , netherlands ). a seizure severity scoring system was used to determine the levels of seizure experienced by subjects ( pohl & amp ; mares , 1987 ). all signs of seizure were detailed for all animals . the latency ( in s ) from injection of ptz to first myoclonic jerk ( fmj ; score of 1 ), and to the animal attaining “ forelimb clonus with tonic component and body twist ” ( score of 3 . 5 ) were recorded . fmj is an indicator of the onset of seizure activity , whilst & gt ; 90 % of animals developed scores of 3 . 5 , and so is a good marker of the development of more severe seizures . data are presented as the mean ± s . e . m . within an experimental group . this is given as the median value for each experimental group based on the scoring scale below . the percentage of animals within an experimental group that died as a result of ptz - induced seizures . note that the majority of animals that developed tonic - clonic seizures ( scores of 4 and 5 ) in the thcv ( bds ) study died as a result , and that a score of 6 ( death ) automatically denotes that the animal also experienced tonic - clonic seizures . the time ( in seconds ) from the first sign of seizure ( typically fmj ) to either the last sign of seizure or , in the case of subjects that died , the time of death — separated into animals that survived and those that did not . this is given as the mean ± s . e . m . for each experimental group . differences in latencies and durations were assessed by one - way analysis of variance ( anova ) with post - hoc tukey &# 39 ; s test . p ≦ 0 . 05 was considered significant . the thcv bds comprised a whole extract of a chemovar in which thcv was the predominant cannabinoid . ( i . e . it was the major cannabinoid present in the extract , 80 % by weight of the total cannabinoid content ). thc was the second most prevalent cannabinoid , and was present in significant amounts . ( i . e . it comprised greater than 10 % by weight of the total cannabinoid content , being present at about 16 %), and there were a number of minor cannabinoids identified , each comprising less than 2 % by weight of the total cannabinoid content as measured by hplc analysis . the ratio of thcv to thc in this extract is about 5 : 1 . in fact the thcv content was 67 . 5 % by weight of the extract and the thc content was 13 . 6 % by weight of the extract , with the other identified cannabinoids in total comprising about 3 % by weight of the extract , the remaining 16 % comprising non - cannabinoids . seizures induced by a range of ptz concentrations ( 50 - 100 mg / kg ; the range present in the literature ) in rats were investigated to determine an optimal dose prior to the investigation of the cannabinoid effect . ptz doses of : 50 mg / kg and 60 mg / kg induced very little seizure - like activity ( n = 4 ); 70 mg / kg typically induced clonic seizures ( score of 3 . 5 ; 8 of 13 subjects ); 80 mg / kg regularly induced tonic - clonic seizures ( scores of 4 and 5 ; 6 of 10 subjects ). additionally , it was found that repeated dosing with ptz resulted in increased sensitivity over time ; therefore no experiments were performed on animals that had already received a dose of ptz . the effect of thcv bds on ptz - induced seizures was first assessed against a ptz dose of 70 mg / kg . as described below , this yielded a vehicle control group that did not typically experience severe seizure scores . therefore thcv bds was also screened against an 80 mg / kg dose of ptz . it was felt that the increased seizure severity experienced by vehicle control animals exposed to 80 mg / kg ptz was a more appropriate test of potential anti - convulsant activity . effect of thcv bds on moderately severe ( 70 mg / kg ) ptz - induced seizures three doses of thcv bds were assessed against a concentration of ptz known to induce moderate seizures in rats ( 70 mg / kg ; see pilot , above ). the low , medium and high doses of thcv bds used were 0 . 37 , 3 . 70 and 37 . 04 mg / kg , and yielded actual thcv doses of 0 . 25 , 2 . 5 and 25 mg / kg respectively . these doses were matched by thcv content to those being used for screening pure thcv against ptz - induced seizures . thcv bds did not have any significant effects on latency to first myoclonic jerk or on latency to attaining a severity score of 3 . 5 on the seizure severity scale ( fig1 ). it should be noted that although values for both these variables were higher for animals treated with medium and high dose thcv bds compared to control , this failed to reach significance ( p & gt ; 0 . 05 ). similarly , no significant impact on duration of seizure was seen ( fig2 ). the effects of thcv bds on seizure severity ( fig3 ) and mortality ( fig4 ) in animals that received doses of 70 mg / kg ptz did not conform to a simple pattern . no animal injected with vehicle - alone exceeded the median severity score of 3 . 5 for that group , and no animals died ( n = 10 ). in contrast , 70 mg / kg ptz induced severe tonic - clonic seizures and death in 50 % of animals injected with a low dose of thcv bds , demonstrating a median severity score of 4 . 75 . this increase in severity was not significant . however , animals injected with medium and high doses of thcv bds exhibited a lower median severity score and lower mortality rates than those exposed to low doses ( fig3 & amp ; 4 ). medium and high dose mortality rates were higher than that of the vehicle group , but not significantly so ( p & gt ; 0 . 05 ; fig4 ). however , median severity scores were the same between medium & amp ; high doses ( fig3 ). this pattern of results suggested that a further set of experiments , in which thcv bds was screened against a dose of ptz which would induce severe seizures in control ( vehicle - treated ) animals , was required . the effects of the same three doses of thcv bds on seizures induced by 80 mg / kg ptz were assessed . it is worth noting that 80 mg / kg induced significantly more severe seizures than 70 mg / kg in vehicle control groups ( p = 0 . 009 ), with median seizure severity scores of 6 and 3 . 5 respectively . thcv bds did not have a significant effect on latencies to fmj or a severity score of 3 . 5 ( fig5 ). similarly , no effect was observed on seizure durations ( fig6 ). low dose thcv bds decreased both seizure severity ( fig7 ) and mortality ( fig8 ) in animals that received doses of 80 mg / kg ptz . animals that received low thcv bds had a lower median severity score ( 3 . 5 compared to 6 ) than vehicle controls . however , this difference was not significant ( p & gt ; 0 . 5 ). the low thcv bds dose group also had a mortality rate half that of the vehicle control group ( 30 % vs 60 %). groups treated with medium and high doses of thcv bds had a lower seizure severity score of 4 . 75 ( p & gt ; 0 . 5 vs control ), and a lower mortality rate of 50 %, compared to 6 and 60 % respectively . screening of thcv bds in the ptz model did not appear to have any significant anti - or pro - convulsant effects on either moderate or severe ptz - induced seizures . however , a trend towards lower severity and mortality was seen in animals that received a low dose of thcv bds prior to induction of severe ( 80 mg / kg ptz ) seizures , compared to vehicle controls . it is possible that this effect is masked at higher doses of thcv bds by higher levels of other cannabinoid constituents ( such as thc ) present in the non - thcv content of the thcv bds . higher doses of thcv bds will contain increasing doses of non - thcv content , such as thc , which may oppose any potential positive effects of thcv . low ( 0 . 025 mg / kg ), medium ( 0 . 25 mg / kg ) and high ( 2 . 5 mg / kg ) doses of pure thcv were assessed for their effects on ptz - induced seizures . it is worth noting at this point , for comparisons to example 1 ( thcv bds ), that differing doses of pure thcv were used compared to thcv bds . see table 2 below . 80 mg / kg ptz successfully induced seizures of varying severities in animals from all 4 experimental groups ( n = 16 per group ). ptz - induced seizures led to the death of 44 % of animals that received vehicle alone . groups that received low , medium and high thcv all exhibited lower mortality rates of 41 %, 33 % and 38 % respectively ; however these values were not significantly different from that of the vehicle group ( p & gt ; 0 . 05 , binomial test ). the mean values for latency to first seizure sign , and to scores of [ 3 ] and [ 5 ] on the seizure scoring scale used , as well as the duration of seizure for surviving animals , are described in fig9 a - d . it can be seen that seizures started later , as shown by increased latency to first manifestation of seizure - like behaviour ( fig9 a ) in animals that received thcv compared to vehicle controls . the delay of onset was significant at the highest dose of thcv ( p = 0 . 02 ). a similar pattern was seen for latencies to scores of [ 3 ] and [ 5 ] ( fig9 b and 9c ) with all thcv doses exhibiting increased latencies , reaching a significant level at the highest dose of thcv ( p = 0 . 017 and 0 . 013 for [ 3 ] and [ 5 ] respectively ). it was also observed that duration of ptz - induced seizures in animals that survived the experimental period were significantly shorter after administration of the medium dose of thcv compared to vehicle controls ( fig9 d ; p = 0 . 03 ). table 3 below displays the values for median seizure severity in each experimental group . the median maximum severities and % of animals that did not experience any signs of seizure for each experimental group are given ( n = 16 for each value ). * indicates significant difference from vehicle group ( binomial significance test , p & lt ; 0 . 05 ). vehicle control animals exhibited a median seizure severity of 4 . 25 , whereas all groups which received thcv had a median severity score of 3 . 5 . this decrease was not significantly different . 12 . 5 % vehicle control animals displayed no indicators of seizure , suggesting these animals did not develop seizures after ptz administration . a significantly higher number of animals ( 33 . 3 %) displayed no signs of seizure in the group that received 0 . 25 mg / kg ( table 3 ; p = 0 . 031 ). this data suggests that the medium dose of 0 . 25 mg / kg thcv protected against the development of seizures . the effects of the high dose of thcv on latency values suggest that thcv can delay both onset and seizure development , whilst the significant effects of the medium dose on the incidence of seizure at medium ( 0 . 25 mg / kg ) thcv doses suggest a significant anticonvulsive action on ptz - induced seizures . in addition to thcv , cbd was also screened in the ptz model . the results strongly indicate that cbd ( at levels of 100 mg / kg ) in this model is anti - convulsant as it significantly decreased the mortality rate and incidence of the most severe seizures compared to vehicle control animals . pure cbd was injected intra - peritoneally ( ip ) in the standard vehicle ( 1 : 1 : 18 ethanol : cremophor : 0 . 9 % w / v nacl ) at doses of 1 , 10 and 100 mg / kg alongside animals that received vehicle alone at a matched volume ( n = 15 for each group ). 60 minutes later ptz ( 80 mg / kg , ip ) was administered . 46 . 7 % of control animals that received vehicle alone died within 30 minutes of ptz administration ( fig1 ). in contrast only 6 . 7 % ( only 1 of 15 ) of animals that received 100 mg / kg cbd died , a marked reduction that proved to be significant ( p & lt ; 0 . 001 ). additionally only 6 . 7 % of animals that received 100 mg / kg cbd experienced the most severe seizures ( score of 5 ) in comparison to 53 . 3 % of vehicle control animals , a decrease that was also significant ( p & lt ; 0 . 001 ; fig1 in vivo ). in contrast to pure thcv , no significant increases in latency of seizure development were observed . however , the marked and significant reductions indicate a striking anti - convulsant effect on ptz - induced seizures . screening and analysis of pure cbd in the ptz model at high dose ( 100 mg / kg ) of cbd on mortality levels and incidence of the most severe seizures suggests that cbd can attenuate the severity of ptz - induced seizures pure thcv was injected intra - peritoneally ( ip ) in the standard vehicle ( 1 : 1 : 18 ethanol : cremophor : 0 . 9 % w / v nacl ) at doses of 0 . 025 , 0 . 25 and 2 . 5 mg / kg alongside animals that received vehicle alone at a matched volume ( n ≧ 14 for each group ). 15 minutes later methylscopolamine ( 1 mg / kg ; to reduce peripheral muscarinic effects of pilocarpine ) was administered followed , 45 minutes later by pilocarpine ( 380 mg / kg , ip ) administration . no significant effect of thcv at any dose was observed upon latency to the onset of seizure ( p & gt ; 0 . 5 for all doses vs control ; 1 - way anova with tukey &# 39 ; s post - hoc test ). no significant change in percentage mortality vs control was seen for any thcv dose ( fig1 ). in addition thcv had no effect upon the mean maximum severity of seizure reached per animal group ( fig1 ). the percentage of animals in each group that reach a particular seizure state ( unilateral forelimb clonus , bilateral forelimb clonus , bilateral forelimb clonus with rearing and falling and tonic - clonic ) was also assessed ( fig1 a - d ). thcv caused no significant changes in the percentage of animals showing unilateral forelimb clonus , bilateral forelimb clonus or tonic - clonic seizures at any dose . interestingly , 0 . 25 mg / kg thcv caused a significant increase in the percentage of animals showing bilateral forelimb clonus with rearing and falling although this effect was not seen at any other dose . pure cbd was injected intra - peritoneally ( ip ) in the standard vehicle ( 1 : 1 : 18 ethanol : cremophor0 . 9 % w / v nacl ) at doses of 1 , 10 and 100 mg / kg alongside animals that received vehicle alone at a matched volume ( n ≧ 14 for each group ). 15 minutes later methylscopolamine ( 1 mg / kg ; to reduce peripheral muscarinic effects of pilocarpine ) was administered followed , 45 minutes later by pilocarpine ( 380 mg / kg , ip ) administration . no significant effect of cbd at any dose was observed upon latency to the onset of seizure ( p & gt ; 0 . 5 for all doses vs control ; 1 - way anova with tukey &# 39 ; s post - hoc test ). a significant increase in percentage mortality vs control was seen for the 10 mg / kg cbd dose as shown in fig1 . fig1 details that cbd had no effect upon the mean maximum severity of seizure reached per animal group . fig1 a - d detail the percentage of animals in each group that reached particular seizure states ( unilateral forelimb clonus , bilateral forelimb clonus , bilateral forelimb clonus with rearing and falling and tonic - clonic ). cbd caused significant decreases in the percentage of animals showing unilateral forelimb clonus at cbd doses & gt ; 1 mg / kg , interestingly , although no significant differences in the percentage of animals exhibiting bilateral forelimb clonus were found , the percentage of animals manifesting with bilateral forelimb clonus with rearing and falling were significantly reduces at all cbd doses & gt ; 1 mg / kg . the percentage of animals exhibiting tonic - clonic seizures was significantly reduced at cbd doses of 1 mg / kg and 100 mg / kg but not 10 mg / kg ( c . f . fig1 ). the effects of cbd upon tonic - clonic seizure events by examining the mean frequency of tonic - clonic events as is shown in fig1 . cbd caused a significant reduction in mean tonic - clonic frequency at all doses tested . cbd effects upon the mean frequency of all other seizure scores were also assessed in the same way but no significant differences vs control were found ( p & gt ; 0 . 5 for all ). the percentage duration of time spent in a tonic - clonic state compared to the total duration of the seizure period was examined ( fig1 ). cbd significantly reduced the percentage duration at doses of 1 mg / kg and 100 mg / kg but not 10 mg / kg . cbd ( 1 , 10 and 100 mg / kg ) or cbd vehicle ( 1 : 1 : 18 ethanol : cremophor : 0 . 9 % w / v nacl ) was administered i . p . to adult male wistar rats (& gt ; 250 g ). one week prior to this , animals had been surgically implanted with a cannula into the right lateral ventricle under anaesthesia . one hour after cbd administration , 150 iu penicillin was infused into the right lateral ventricle in 1 . 5 μl saline solution over one minute and seizure behaviour video recorded for two hours . following detailed examination of animal responses to penicillin alone ( using data obtained from vehicle control groups , a finalised seizure scoring scale for penicillin - induced partial seizures has been derived . the following scoring system which was derived from several existing and published scoring systems for this model , will therefore be used for analysis of drug effects upon such seizures . seven of the twelve vehicle - treated animals developed the most severe seizures ( tonic - clonic seizures without postural control ; fig1 a ), whereas , administration of 100 mg / kg cbd completely prevented development of these seizures in a significant manner ( p = 0 . 001 ). near - significant decreases in development of these seizures were observed in animals treated with 1 and 10 mg / kg cbd ( fig1 a , p = 0 . 076 for both ). the frequency with which animals experienced the most severe seizures was also significantly affected ( anova , p = 0 . 009 ; fig1 b ), with a significant decrease compared to the vehicle group at 100 mg / kg cbd ( p = 0 . 006 ) and a near - significant effect at 10 mg / kg ( p = 0 . 071 ). the effect of cbd treatment on seizure severity and animal mortality is described in fig2 a - c . a dose of 100 mg / kg cbd significantly reduced the median severity of penicillin - induced seizures compared to vehicle - treated animals ( anova p = 0 . 024 ; difference between vehicle and 100 mg / kg cbd p = 0 . 012 ; fig2 a ). interestingly , all doses of cbd ( 1 , 10 and 100 mg / kg ) significantly increased the proportion of animals that remained seizure - free ( p & lt ; 0 . 001 for all doses ; fig2 b ). finally , 100 mg / kg had a near - significant effect on mortality compared to vehicle ( p = 0 . 057 ). from these studies it would appear that both thcv ( pure ) and cbd ( pure ) show promise as an anti - epileptic for generalized seizure , particularly clonic / tonic seizure . the data generated for a thcv rich extract , containing other cannabinoids including significant amounts of thc , suggest that the thc may be countering the effect of the thcv and that a cannabinoid extract which contains thcv as a major or predominant cannabinoid , but which also contains minimal , or substantially no , thc would be desirable for treating epilepsy . furthermore the results with pure cbd suggest that an extract containing significant amounts of both thcv and cbd , but again , minimal or substantially no thc may provide an optimum combination . accordingly it may prove desirable to prepare a thcv predominant extract in which thc is selectively , and substantially , removed ( to levels of less than a few percent ). this could be mixed with a cbd rich extract ( which contains much lower levels of thc ) in which cbd is the major and predominant cannabinoid ( also with low levels of thc ) to produce an extract with clearly defined , and significant levels of both thcv and cbd , but with insignificant levels of thc . such an extract may contain other cannabinoids and the non - cannabinoid components which result from extraction , by for example , carbon dioxide as disclosed in wo04 / 016277 , which components may support an “ entourage ” effect in the endocannabinoid system . on dosage , a rat / human conversion factor (× 6 ) suggests a cbd daily dose of at least 600 mg ( and optionally between 400 mg and 800 mg ) and for thcv at least 1 . 5 mg ( medium ) to preferably at least 15 mg ( high ). where a phytocannabinoid extract is to be used , an extract with low or negligible levels of thc and therapeutically effective levels of thcv and / or cbd is desired . the data described in the examples above clearly show that although cbd shows some anti - convulsant properties in all of the three models tested , it would appear best in treating generalized or partial seizures . in contrast thcv was only effective in the ptz - model . this finding suggests that the two cannabinoids may have different mechanisms of action and that the combination may provide for more general treatments . in this regard thcv appears selective for generalized seizures , more particularly tonic - clonic seizures and cbd appears to be most effective in generalized and partial seizures . alger , b . e . ( 2006 ) not too excited ? thank your endocannabinoids . neuron , 51 , 393 - 5 . ames f r . ( 1986 ) anticonvulsant effect of cannabidiol . south african medical journal 69 : 14 . avoli , m ., louvel , j ., pumain , r . & amp ; kohling , r . ( 2005 ) cellular and molecular mechanisms of epilepsy in the human brain . prog neurobiol . bostanci , m . o . & amp ; bagirici , f . ( 2006 ) the effects of octanol on penicillin induced epileptiform activity in rats : an in vivo study . epilepsy res , 71 , 188 - 94 . brust , j . c ., ng , s . k ., hauser , a . w . & amp ; susser , m . ( 1992 ) marijuana use and the risk of new onset seizures . trans am clin climatol assoc , 103 , 176 - 81 . consroe , p . f ., wood , g . c . & amp ; buchsbaum , h . ( 1975 ) anticonvulsant nature of marihuana smoking . j . american medical association 234 306 - 307 cunha , j . m ., carlini , e . a ., pereira , a . e ., ramos , o . l ., pimentel , c ., gagliardi , r ., sanvito , w . l ., lander , n . & amp ; mechoulam , r . ( 1980 ) chronic administration of cannabidiol to healthy volunteers and epileptic patients . pharmacology , 21 , 175 - 85 . davis , j p ., & amp ; ramsey , h . h . ( 1949 ) antiepileptic action of marijuana - active substances . federation proceedings 8 284 - 285 dreifuss , f . e ., bancaud , j ., henriksen , o ., rubio - donnadieu , f . penry , j . k . & amp ; seino , m . ( 1981 ) proposal for revised clinical and electroencephalographic classification of epileptic seizures . epilepsia , 22 , 489 - 501 . ferdinand , r . f ., van der ende , j ., bongers , i ., selten , j . p ., huizink , a . & amp ; verhulst , f . c . ( 2005 ) cannabis — psychosis pathway independent of other types of psychopathology . schizophr res , 79 , 289 - 95 . fisher , r . s ., vickrey , b . g ., gibson , p ., hermann , b ., penovich , p ., scherer , a . & amp ; walker , s . ( 2000 ) the impact of epilepsy from the patient &# 39 ; s perspective i . descriptions and subjective perceptions . epilepsy res , 41 , 39 - 51 . gastaut , h . ( 1970 ) clinical and electroencephalographical classification of epileptic seizures . epilepsia , 11 , 102 - 112 . institute of medicine ( 1999 ) marijuana and medicine : assessing the science base . national academy press lutz , b . ( 2004 ) on - demand activation of the endocannabinoid system in the control of neuronal excitability and epileptiform seizures . biochem pharmacol , 68 , 1691 - 8 . mackie , k . ( 2006 ) cannabinoid receptors as therapeutic targets . annu rev pharmacol toxicol , 46 , 101 - 22 . mccormick , d . a . & amp ; contreras , d . ( 2001 ) on the cellular and network bases of epileptic seizures . annu rev physiol , 63 , 815 - 46 . merlis , j . k . ( 1970 ) proposal for an international classification of the epilepsies . epilepsia , 11 , 114 - 119 . ng et al . ( 1990 ) illicit drug use and the risk of new - onset seizures , american journal of epidemiology 132 : 47 - 57 . obay , b . d ., tasdemir , e ., tumer , c ., bilgin , h . m . & amp ; sermet , a . ( 2007 ) antiepileptic effects of ghrelin on pentylenetetrazole - induced seizures in rats . peptides , 28 , 1214 - 9 . pereira , m . b ., freitas , r . l ., assis , m . a ., silva , r . f ., fonteles , m . m ., freitas , r . m . & amp ; takahashi , r . n . ( 2007 ) study pharmacologic of the gabaergic and glutamatergic drugs on seizures and status epilepticus induced by pilocarpine in adult wistar rats . neurosci lett , 419 , 253 - 7 . rauca , c ., wiswedel , i ., zerbe , r ., keilhoff , g . & amp ; krug , m . ( 2004 ) the role of superoxide dismutase and alpha - tocopherol in the development of seizures and kindling induced by pentylenetetrazol — influence of the radical scavenger alpha - phenyl - n - tert - butyl nitrone . brain res , 1009 , 203 - 12 . sander , j . w . ( 2003 ) the epidemiology of epilepsy revisited . curr opin neurol , 16 , 165 - 70 . swann , j . w . ( 2004 ) the effects of seizures on the connectivity and circuitry of the developing brain . ment retard dev disabil res rev , 10 , 96 - 100 . trembly b . sherman m . ( 1990 ) double - blind clinical study of cannabidiol as a secondary anticonvulsant . marijuana &# 39 ; 90 international conference on cannabis and cannabinoids . kolympari , crete , jul . 8 - 11 , 1990 . wingerchuk , d . ( 2004 ) cannabis for medical purposes : cultivating science , weeding out the fiction . lancet , 364 , 315 - 6	0
the above noted and other features and advantages of the present aspects are described in , or are apparent from , the following detailed description of various exemplary aspects . fig1 is a table illustrating the composition of a typical verdete ore with respect to size distribution . verdete ore , a kind of slate that occurs in cedro de abaeté , in the state of minas gerais in brazil , is a source of potassium , which includes minerals such as biotite , muscovite and feldspars as potassium sources , as illustrated in table 1 . the potash ( k 2 o ) content in the verdete ore is about 10 %, generally in the range of 9 - 12 %. the verdete ore may be one of the silicate minerals used as a raw material in the process described herein . fig2 is a flowchart of an aspect of a process producing a thermofertiliser from potassium - bearing minerals . an exemplary aspect of a thermal treatment process is described as a method to produce a thermofertiliser based on sintering of mixtures containing phosphate mineral , potassium - bearing minerals such as , for example , verdete ore , limestone , and other water soluble potassium sources such as sylvinite and muriate of potash ( potassium chloride ) used in order to increase the potassium content in the resulting thermofertiliser . aspects of the described method increase overall nutrients extraction and improve process cost effectiveness . one of the advantages of the described aspects and the thermal treatment process proposed is the occurrence of micro fusions on the surface of particles created via a sintering step during thermal treatment , where chemical reactions take place . sodium carbonate , calcium - sodium borate , magnesium chloride or sulphate salts ( as calcium and magnesium sulphates ) can also be used to increase the potassium and phosphorous extraction from the ores and to reduce the temperature in the thermal treatment step . due to this and other advantages , the exemplary process described herein does not generate a fusion reaction , which represents an advantage compared to conventional fusion processes in terms of energy consumption , achieving about 40 % energy saving . also , the fusion step in conventional processes can generate unwanted by - products ( slags ), the generation of which is thereby prevented according to the described aspects . in addition , the mass recovery of the process according to the described aspects is generally higher than in conventional processes , and little or no solid residue is generated . according to various aspects , the method begins at s 105 , where the raw materials are ground down to a size that falls within a desired range . according to various aspects , the desired range may be between 0 . 037 mm and 2 mm . once the raw materials are ground down during s 105 , the raw materials are screened at s 110 to determine the size of the resulting materials . if the size of the resulting materials , determined at s 110 , is within a desired range , then the method continues to s 120 . if , on the other hand , the size of the raw materials determined at s 110 does not fall within the desired range , then the method returns to s 105 , where the raw materials are again subject to the step of grinding . once it has been established at s 110 that the size of the ground materials is within the desired range , then the method continues to s 120 , where the raw materials are mixed with additives and are optionally subjected to an agglomeration process , depending on the choice of the equipment used to sinter the materials during the heating step s 130 or s 150 . according to various aspects , the additives may be , for example , limestone , sylvinite and muriate of potash . according to various aspects , when the heating step s 130 is to be performed in a rotary kiln , then no previous agglomeration of the mixture of raw materials and additives may be necessary . on the other hand , when a sintering roaster is to be used during s 150 , then the raw materials and the additives may be subjected to an agglomeration step s 140 prior to the heating step s 150 , due to the use of the sintering roaster . according to various aspects , once the raw materials have been mixed at s 120 , or have been agglomerated at s 140 , the raw materials are submitted to a thermal treatment at s 130 or s 150 . according to various aspects , during the thermal treatment steps s 130 or s 150 , the heating may be performed at a temperature between about 300 ° c . and 1 , 600 ° c . alternatively , the heating may be performed at a temperature between about 850 ° c . and 1 , 300 ° c . according to various aspects , the residence time , or time of heating of the raw materials mixed with the additives at the above temperatures may be in the range of about 1 to 10 hours . according to various aspects , the time of heating of the raw materials mixed with the additives at the above temperatures may also be in the range of about 1 to 4 . 5 hours . according to various aspects , coal , oil , gas , biomass or any other energy source can be used to provide energy to the above - described heating step s 130 or s 150 . according to various aspects , when the thermal treatment at s 130 or s 150 has been completed , the method continues to s 160 , where the heated mixture of raw materials and additives may be cooled down to a lower temperature such as , for example , room temperature , or any other temperature . this cooling at s 160 may be performed using air , water or any other known cooling technique . according to various aspects , after cooling at s 160 , the process may optionally include further grinding the mixture of raw materials and additives in order to adjust the particle size of the mixture to a desired size range and / or to achieve commercial product specifications . according to various aspects , after cooling at s 160 or after grinding at s 170 , the resulting material may be screened at s 180 in order to determine whether the particle size of the treated mixture is within the desired size range . if the particle size of the treated mixture is not within the desired size range , then the method continues to s 170 for further grinding of the treated mixture until the particle size of the mixture falls within the desired size range . on the other hand , if the particle size of the treated mixture screened at s 180 is within the desired size range , then the method continues to s 190 , where the treated mixture is further mixed to include additives , for example but not limited to , micronutrients . according to various aspects , the micronutrients added to the treated mixture may include boron , manganese , copper , cobalt and molybdenum , depending upon the marketing and / or commercial or other requirements of the final product . according to various aspects , the product obtained as a result of the above - described steps may include two main nutrients : phosphorus and potassium . the resulting product may also have a better efficiency when used in acid soils because the high calcium and magnesium oxide contents , which are considered a base ( having a ph higher than 7 . 0 ), can adjust the soil acidity by decreasing or eliminating the need for using neutralizing agents . the resulting product of the above - described steps may also contain silicon , calcium and magnesium as nutrients playing an important role in obtaining and maintaining a good crop quality . according to various aspects , in order to evaluate the quality of the resulting product , the potassium and phosphorous contents in the thermofertiliser can be extracted using a citric acid solution , achieving up to about 85 - 95 % extraction . this high extraction content shows that the nutrients potassium and phosphorous have a low water solubility , which is one of the benefits of the described aspects . this characteristic promotes smaller amounts of losses via natural leaching in the ground when the product is used as , for example , a fertilizer . during the overall process of the described aspects , about 60 to 90 % of the raw material is insoluble in both water and citric acid . the insoluble materials include insoluble potassium in the form of k 2 o , for example , of verdete ore , or insoluble phosphorous in the form of p 2 o 5 from a phosphate mineral . according to various aspects , these insoluble raw materials are rendered soluble in citric acid . in addition , the raw materials that are already soluble in water have their solubility in citric acid increased and their solubility in water decreased by about 15 to 50 %. this aspect results in a final product that has a low solubility in water and a high solubility in citric acid . these qualities are generally desired in the composition of a thermofertiliser because it avoids losses of nutrients when used for agronomic purposes . according to various aspects , initial laboratory tests indicate that a composition of raw materials and additives for starting a process that can improve the solubilization of potassium may be as follows : 15 to 48 % by weight of ore such as , for example , verdete ore or any another potassium - bearing minerals , 25 to 46 % phosphate mineral , 4 to 12 % by weight potassium chloride , 10 to 22 % by weight dolomite and 4 to 15 % by weight sodium carbonate . according to various aspects , various features and advantages of the above composition include : i ) increased extraction of valuable nutrients such as potassium and phosphorous from potassium - bearing minerals , such as the verdete ore and phosphates minerals ; ii ) better deposit exploitation in the case of verdete ores deposits ; iii ) final products having high quality when used for agronomic purposes due to the low solubility in water and high solubility in citric acid ; iv ) reduced energy consumption ; v ) recovering two or more nutrients provided by the same product ; vi ) high mass recovery without generation of solid residues ; and vii ) nutrients with low water solubility but high solubility in citric acid solution having a high value to crops . the following illustrates examples of mineral compositions . a mixture containing 30 . 3 % of verdete ore ( 12 . 5 % k 2 o ), 37 . 9 % by weight of phosphate mineral ( 30 . 0 % total p 2 o 5 and 9 . 0 % p 2 o 5 soluble in 2 % aqueous citric acid solution ), 7 . 6 % by weight of muriate of potash ( kcl - 60 . 0 % k 2 o ), 15 . 1 % by weight of dolomite and 9 . 1 % by weight of soda ash ( na 2 co 3 ) heated in an oven for one hour at a constant temperature of about 1 , 100 ° c . the size distribution of all raw materials used to prepare the mixture is about 44 μm ( 0 . 044 mm ) for about 90 % of the raw materials . after the above - described heating step is performed , the mixture is cooled , weighed and analyzed for potassium and phosphorous content that is soluble in an aqueous 2 % citric acid solution . the resulting mass loss is about 17 . 7 %, and the percentages of k 2 o and p 2 o 5 soluble in the aqueous 2 % citric acid solution are about 8 . 4 % and 0 . 0 %, respectively . excluding the k 2 o and p 2 o 5 soluble in the aqueous 2 % citric acid solution in the raw materials , muriate of potash and phosphate mineral , the potassium and phosphorous extraction yields were about 59 % and 0 % respectively . k 2 o , soluble in water and which comes from the muriate of potash , has its solubility in water reduced to about 36 %, and becomes soluble only in citric acid . the phosphorous and potassium contents soluble in an aqueous solution of 2 % citric acid in the thermofertiliser are about 4 % and 8 %, respectively , or 00 - 04 - 08 ( n , p 2 o 5 and k 2 o contents ). a mixture containing 48 . 0 % of verdete ore ( 12 . 5 % k 2 o ), 40 . 0 % by weight of phosphate mineral ( 30 . 0 % total p 2 o 5 and 9 . 0 % p 2 o 5 soluble in aqueous 2 % citric acid solution ) and 12 . 0 % by weight of muriate of potash ( kcl with 60 . 0 % k 2 o ) is heated in an oven for one hour at a constant temperature of about 1 , 200 ° c . the size distribution of all raw materials used to prepare the mixture is about 44 μm ( 0 . 044 mm ) for about 90 % of the raw materials . after the heating process , the mixture is cooled , weighed and analyzed for potassium and phosphorous content that is soluble in an aqueous 2 % citric acid solution . the resulting mass loss is about 13 . 4 %, and the percentages of k 2 o and p 2 o 5 soluble in the aqueous 2 % citric acid solution are about 8 . 3 % and 10 . 8 %, respectively . excluding the k 2 o and p 2 o 5 soluble in the aqueous 2 % citric acid solution in the raw materials , muriate of potash and phosphate mineral , the potassium and phosphorous extraction yields are about 0 % and 68 %, respectively . k 2 o , soluble in water and which comes from the muriate of potash , has its solubility in water reduced to about 43 %, and becomes soluble only in citric acid . the phosphorous and potassium contents soluble in an aqueous solution of 2 % citric acid in the thermofertiliser are about 11 % and 8 % respectively , or 00 - 11 - 08 ( n , p 2 o 5 and k 2 o contents ). a mixture containing 32 . 1 % by weight of verdete ore ( 12 . 5 % k 2 o ), 40 . 1 % by weight of phosphate mineral ( 30 . 0 % total p 2 o 5 and 9 . 0 % p 2 o 5 soluble in aqueous 2 % citric acid solution ), 8 . 0 % by weight of muriate of potash ( kcl with 60 . 0 % k 2 o ), 16 . 0 % by weight of dolomite and 3 . 8 % by weight of ulexite is heated in an oven for one hour at a constant temperature of about 900 ° c . the size distribution of all raw materials used to prepare the mixture is about 44 μm ( 0 . 044 mm ) for about 90 % of the raw materials . after the heating process , the mixture is cooled , weighed and analyzed for potassium and phosphorous content that is soluble in an aqueous 2 % citric acid solution . the resulting mass loss is about 14 . 5 % and the percentages of k 2 o and p 2 o 5 soluble in an aqueous 2 % citric acid solution are about 6 . 1 % and 4 . 2 %, respectively . excluding k 2 o and p 2 o 5 soluble in the aqueous 2 % citric acid solution in the raw materials , muriate of potash and phosphate mineral , the potassium and phosphorous extraction yields are about 9 % and 0 % respectively . k 2 o , soluble in water and which comes from the muriate of potash , has its solubility in water reduced to 13 %, and became soluble only in citric acid . the phosphorous and potassium contents soluble in an aqueous solution of 2 % citric acid in the thermofertiliser are about 4 % and 6 % respectively , or 00 - 04 - 06 ( n , p 2 o 5 and k 2 o contents ). while this process has been described in conjunction with the exemplary aspects outlined above , various alternatives , modifications , variations , improvements , and / or substantial equivalents , whether known or that are or may be presently unforeseen , may become apparent to those having at least ordinary skill in the art . accordingly , the exemplary aspects , as set forth above , are intended to be illustrative , not limiting . various changes may be made without departing from the spirit and scope of the invention . therefore , the invention is intended to embrace all known or later - developed alternatives , modifications , variations , improvements , and / or substantial equivalents .	2
referring now to fig1 there is shown a medium frequency mine communication system referred to by the general reference numeral 20 . the communication system 20 comprises a portable radio 22 , a mobile vehicular radio 24 , a personal - carried radio 26 , a pager 27 , a plurality of repeaters 28 , a plurality of pager repeaters 29 , a surface base station 30 and a pager base station 31 . it is understood that there may be more or fewer than one of any of the radios 22 , 24 or 26 and of surface base station 30 , pager base station 31 or pager 27 . a plurality of transmission line electrical conductors 32 exist within a mine 34 . ( the conductors 32 may be telephone cables , ac power cable , monitor cable , rails , steel pipelines , etc .) magnetic coupling between the transmission line electrical conductors 32 in an entry way 35 enables radio signal current flow in one conductor in induce signal current flow in a nearby conductor . the portable radio 22 is installed at a working face 36 of the mine 34 directly below the transmission line electrical conductor 32 . a portable radio vertical loop antenna 38 attached to radio 22 is held in close proximity to the electrical conductor 32 by a connector 40 . the mobile vehicular radio 24 is mounted inside of a mine vehicle 42 and is connected to a vehicular horizontal tuned loop antenna 44 , mounted on the outside of vehicle 42 , via a cable 46 . the personal - carried radio 26 is a compact , battery powered transceiver designed to be mounted on a miner &# 39 ; s belt . a personal - carried vertical tuned loop antenna 47 worn by the miners , is connected to the radio 26 . the pager 27 can also be carried by a miner and would also be connected to the personal - carried vertical tuned loop antenna 47 . the plurality of repeaters 28 are transceiver units designed to receive two frequencies f2 and f3 and to transmit two frequencies f1 and f3 . the repeaters 28 are located in close physical proximity to electrical conductor 32 . the surface base station 30 includes a medium frequency transceiver capable of transmitting the frequencies f2 and f3 and receiving the frequencies f1 and f3 . base station 30 is located at the mine surface portal or at any other central dispatch or monitoring point . the surface base station 30 and the pager base station 31 are individually coupled to the plurality of transmission line electrical conductors 32 via a surface base station vertical loop antenna 49 and a pager vertical loop antenna 50 which are located in close physical proximity to conductors 32 . the pager base station 31 includes a pager transmitter 51 , a pager encoder 52 and a pager computer 53 . referring now to fig2 there is shown the portable radio 22 in more detail . the connector 40 is a nylon tie wrap which encircles the conductor 32 and the portable radio tuned loop antenna 38 holding antenna 38 in close proximity to conductor 32 . the antenna 38 is a vertical tuned loop antenna having a diameter &# 34 ; d &# 34 ; of about thirty inches , and is connected to the portable radio 22 through wire 54 . the radio 22 comprises a medium frequency ( 300 - 800 khz ) transceiver 55 , capable of receiving one frequency f1 at a receiver 56 and transmitting two frequencies f1 and f2 from a transmitter 57 ; a stand - by battery pack 58 , protected by an intrinsically safe current limiter circuit 59 ; a charging and power regulation circuit 60 ; a speaker 62 ; a squelch control knob 64 ; a noise cancelling microphone 66 , a time - out circuit 68 , and an external speaker 69 . a remote power supply unit 70 with intrinsically safe output , is connected to radio 22 through a cable 71 . under normal conditions , the portable radio 22 is mounted on a wall and serves as a stationary radio in the mine - wide communications system . in emergencies , portable radio 22 can be disconnected from the power supply unit 70 and conductor 32 and removed from its wall mount for portable use . fig3 a shows the personal - carried radio 26 and personal - carried vertical tuned loop antenna 47 in more detail . the radio 26 is a small , approximately 1 7 / 8 &# 34 ; thick × 41 / 8 &# 34 ; wide × 8 &# 34 ; tall , medium frequency transceiver capable of transmitting two frequencies , f1 and f2 , from a transmitter 80 and receiving one frequency , f1 , at a receiver 82 . the radio 26 contains a squelch control know 84 and is powered by a battery pack 86 which is equipped with an intrinsically safe current limiter circuit 88 . the personal - carried tuned loop antenna 47 is a vertical tuned loop antenna that can be worn by a miner . in the preferred embodiment , the antenna 47 is a wire loop incorporated as part of a suspender loop antenna designated by the general reference numeral 92 . the suspender loop antenna 92 is a one - piece harness comprising a pair of flexible shoulder straps 100 which loop over a miner &# 39 ; s shoulders like suspenders . a pair of cross - straps 104 run perpendicular to shoulder straps 100 , on the back of suspender loop antenna 92 ( i . e ., the pair of cross - straps 104 would be situated on the miner &# 39 ; s back ). a space &# 34 ; w &# 34 ; exists between the two cross - straps 104 . a plurality of slots 106 , on the lower ends of the shoulder straps 100 , provide a means for securing the suspender antenna 92 to a belt 107 worn around the miner &# 39 ; s waist . the belt 107 could also be permanently attached to the suspender loop antenna 92 . alternatively , the slots 106 could be any other suitable means for securing the suspender antenna 92 to the belt 107 such as a plurality of buckles , snaps or buttons . the antenna 47 is attached to the outside surface of the rectangle formed by the cross straps 104 and shoulder straps 100 . a loop antenna tuning box 108 is securely fastened to one of the shoulder straps 100 . a series tuned circuit , located inside of tuning box 108 , switches the antenna 47 between receiving and transmitting modes . a connecting wire 109 connects radio 26 to the tuning box 108 . an antenna plug 110 allows connecting wire 109 to be plugged into the tuning box 108 . the antenna plug 110 also allows radio 26 to be connected to antennas of other designs . a pair of clips 112 attached to radio 26 provide a means for attaching radio 26 to an ordinary belt worn around a miners waist . fig3 b shows an alternative embodiment of the suspender loop antenna 92 designated by the general reference numeral 114 . elements in suspender loop antenna 114 which are analogous to elements in suspenders loop antenna 92 are designated by the original number followed by a prime designation . in suspender loop antenna 114 , a pair of cross straps 104 &# 39 ; run perpendicular to shoulder straps 100 &# 39 ; on the front face of the suspender loop antenna 114 . a wire loop antenna 47 &# 39 ; is attached to the outside surface of the rectangle formed the cross straps 104 &# 39 ; and shoulder straps 100 &# 39 ;. a loop antenna tuning box 108 &# 39 ; is securely fastened to a front surface of one of the shoulder straps 100 &# 39 ;. the personal - carried radio 26 is connected to the loop antenna tuning box 108 &# 39 ; by the connecting wire 109 and the antenna plug 110 in the same manner as was described in fig3 a . similarly , a plurality of slots 106 &# 39 ; provide a means for securing suspender loop antenna 114 to a miner &# 39 ; s belt as shown in fig3 a . the embodiment depicted as suspender loop antenna 114 is useful , for example , in mine rescue operations where rescue team members carry an oxygen tank on their backs . in that situation , the oxygen tank would detune the loop antenna if it were also located on the miner &# 39 ; s back . fig4 shows the pager 27 attached to the suspender loop antenna 92 of fig3 a . the pager 27 is attached to a front surface of one of the shoulder straps 100 and comprises a receiver 116 , capable of receiving the frequency f4 , a decoder 118 and a signal light 120 . the pager 27 is powered by a battery pack 122 which is protected by an intrinsically safe circuit 124 . the pager 27 is connected to the loop antenna tuning box 108 by a connecting wire 125 and an antenna plug 126 . the antenna plug 126 allows the pager 48 to be connected to antennas of other designs . fig5 shows the mobile vehicular radio 24 in more detail . radio 24 is a medium frequency transceiver capable of receiving one frequency f1 at a receiver 130 , and transmitting two frequencies , f1 and f2 , from a transmitter 132 . a squelch control knob 134 is located on the face of radio 24 . the radio 24 is mounted inside the cab of vehicle 42 and is protected by an intrinsically safe limiter circuit , as described later herein . the cable 46 links an antenna connector 137 to the vehicular tuned loop antenna 44 . the antenna 44 is a long piece of wire fashioned into a rectangle lying horizontal to the bed of vehicle 42 . the antenna 44 encircles a plurality of steel rods 138 coming up from the bed of vehicle 42 . a pair of plywood boards 140 lie above and below antenna 44 . fig6 a shows the plurality of repeaters 28 in more detail . each repeater 28 includes an access medium frequency transceiver 150 and a local medium frequency transceiver 152 . the access transceiver 150 is capable of receiving a signal at frequency f2 at a receiver 154 , amplifying and replicating the f2 signal at the frequency f3 and transmitting the f3 signal from a transmitter 158 . the local transceiver 152 is capable of receiving a signal at frequency f3 at a receiver 166 , amplifying and replicating the f3 signal at the frequency f1 and transmitting the f1 signal from a transmitter 170 . the receiver 154 is tightly coupled to conductor 32 by a repeater vertical tuned loop antenna 174 and an antenna cable 176 which links antenna 174 to receiver 154 . the transmitter 158 is also tightly coupled to conductor 32 by a repeater vertical tuned loop antenna 180 and an antenna cable 181 which links antenna 180 to transmitter 158 . similarly , receiver 166 and transmitter 170 are tightly coupled to conductor 32 by a pair of repeater tuned loop antennas 182 and 183 respectively , and a pair of antenna cables 184 and 186 , respectively . the access transceiver 150 and the local transceiver 152 are protected by a pair of intrinsically safe ( is ) limiter circuits 192 and 196 , respectively . a pair of sealed lead acid batteries 198 and 200 are connected to the is circuits 192 and 196 , respectively . fig6 b shows one of the plurality of pager repeaters 29 . each repeater 29 includes a transceiver 201 which comprises a receiver 202 , capable of receiving the frequency f5 , and a transmitter 204 , capable of transmitting the frequency f4 . the receiver 202 is tightly coupled to the transmission line conductor 32 by a pager repeater vertical tuned loop antenna 206 and an antenna cable 208 which links antenna 206 to a receiver 202 . the transmitter 204 is also tightly coupled to the transmission line conductor 32 by a pager repeater vertical tuned loop antenna 210 and an antenna cable 212 which links antenna 210 to transmitter 204 . the transceiver 201 is powered by a sealed lead acid battery 214 which is protected by an intrinsically safe limiter circuit 216 . in the preferred embodiment of the present invention , the frequencies f1 , f2 and f3 are chosen to be 400khz , 520khz and 300khz , respectively . the basis for this choice is the empirical observation that the optimal frequency for propagating signals in underground mine transmission line electrical conductors is 300khz . this is because the attenuation rate for electromagnetic signal propagating on the transmission line electrical conductors , increases with frequency of propagation . at 300khz the attenuation rate is only 2db / 1000 ft ., whereas at 520khz , the attenuation rate is 4 - 5db / 1000 ft . additionally , for frequencies below 300khz the mine generated electrical noise increases by 6db for each &# 34 ; halving &# 34 ; of frequency . thus , 300khz represents an optimal propagation frequency . in contrast to propagation efficiency on the transmission line electrical conductors , however , remote loop antenna to transmission line coupling improves with frequency . thus , 520khz signals are more efficiently coupled between a remote antenna and a conductor than are 300khz signals . the functioning of the mine communication system 20 shown in fig1 and 5 can now be explained . the portable radio 22 , the mobile radio 24 and the personal - carried radio 26 all use their respective tuned loop antennas 38 , 44 and 47 , to magnetically induce signal current flow in nearby conductors 32 . because the antennas 38 , 44 and 47 are often four to fifteen feet from conductors 32 ( remote ), they induce only weak signal currents in conductors 32 . to increase the operating range of the system 20 , the repeaters 28 are used to receive weak radio signals , amplify the signals and then reinduce stronger current flow in the conductors 32 . for example , when communication from the mobile vehicular radio 24 is desired , a signal is transmitted at frequency f2 . this frequency allows efficient coupling between vehicular loop antenna 44 and electrical conductor 32 even when they are not physically close to each other . when the f2 signal , propagating in conductor 32 , encounters one of the repeaters 28 , the f2 signal is picked off by loop antenna 174 and relayed to receiver 154 . the f2 signal is amplified , replicated ( i . e . changed to the frequency f3 ) and retransmitted by transmitter 158 at frequency f3 . because antenna 180 is tightly coupled to conductor 32 , the f3 signal is efficiently coupled back onto conductor 32 and propagates to every repeater 28 in system 20 and to the base station 30 . at every repeater 28 , the f3 signal is received by the receiver 166 via loop antenna 182 . the f3 signal is then amplified , replicated and retransmitted at frequency f1 from transmitter 170 through loop antenna 113 back onto conductor 32 . since every mobile vehicular radio 24 , personal - carried radio 26 and portable radio 22 is always tuned to frequency f1 , they receive the signal . the radios 22 , 24 and 26 can also communicate directly with one another , at short range , without the use of repeaters 28 , by transmitting directly on frequency f1 . the base station 30 can communicate with radios 22 , 24 and 26 by transmitting a message to the repeaters 28 on frequency f2 . this message is then replicated by the repeaters 28 and transmitted to the radios 22 , 24 and 26 on frequency f1 . the base station 30 can also communicate through the repeaters 28 by transmitting on frequency f3 and receiving signals at f1 . the pager 27 functions by alerting the person wearing the pager to contact the surface . the pager computer 53 , contained within pager base station 31 , can be programmed to initiate calls , periodically , until the person wearing the pager is reached . the computer 53 would initiate the call by generating a digital code , from the pager encoder 52 , which would be modulated in a frequency shift key ( fsk ) format . the digitally coded call would then be transmitted by the pager transmitter 51 at the frequency f5 . the call is transmitted from the pager loop antenna 50 onto the transmission line electrical conductors 32 and to the pager repeaters 29 . when the f5 signal , propagating in a conductor 32 , encounters one of the repeaters 29 , the f5 signal is picked off by loop antenna 206 and relayed to receiver 202 . the f5 signal is amplified , replicated and retransmitted by transmitter 204 at frequency f4 . because antenna 210 is tightly coupled to conductor 32 , the f4 signal is coupled back onto conductor 32 . when a person wearing pager 27 and suspender loop antenna 92 comes close to a conductor 32 , the f4 signal is received by receiver 116 , decoded by decoder 118 and used to activate the signal light 120 . this alerts the pager wearer to contact the surface . once the pager wearer has contacted the surface , the pager computer 53 is instructed to cease sending calls . in the preferred embodiment , the frequencies f4 and f5 are chosen to be 450khz and 250khz , respectively . the use of tuned loop antennas ( such as antennas 38 , 44 , 47 , 174 , 180 , 182 , 183 , 49 and 50 in the present invention ) is important to the functioning of system 20 for three reasons . first , loop antennas are very effective electromagnetic couplers in both the transmitting and receiving modes . in the transmit mode , loop antennas produce high current flow in nearby conductors and loop antennas do not change inductance ( saturate ) when transmitting . additionally , loop antennas have the capability of being either tightly electromagnetically coupled to a conductor ( i . e . being coupled in close physical proximity to the conductor ) or of being remotely electromagnetically coupled to a conductor ( i . e . achieving coupling to a conductor even when the loop antenna is 1 - 20 feet away from the conductor ). second , loop antennas have the ability to couple both transmission line electrical conductors and natural waveguides . natural waveguides are formed when a layer of less conductive material ( such as coal , trong or potash ) is bounded above and below by more conductive rock . it is well known that the electrical field component of an electromagnetic wave is vertically polarized while the magnetic field component is horizontally polarized . thus , in the mine 34 , the loop antenna 38 , hanging in a vertical plane below conductor 32 , can efficiently electromagnetically couple the electrical conductor 32 and is also correctly positioned to receive the magnetic component of electromagnetic waves traveling in the natural waveguide mode in working face 36 . the importance of the natural waveguide coupling mode is that it enables communication links to be established through more than 1000 feet of solid coal and 300 feet of rock where no electrical conductors exist . because of the ability of loop antennas to couple both electrical conductors and natural wave guide modes , the portable radio 22 would have the following operating ranges in a mine 34 : ______________________________________tight coupling operating range ( conductor mode ) type of conductor range ( feet ) ______________________________________unshielded wire pair 33 , 000shielded wire pair 20 , 000______________________________________remote coupling operation rangemode distance ( feet ) ______________________________________conductor 8 , 000seam 1 , 000 ( radius ) ______________________________________ finally , the third functional advantage of loop antennas is that they are easy to install and are much less expensive than other coupling devices such as ferrite or air core torroid couplers . in field testing , it has been determined that the loop antenna 38 in fig1 can be suspended from conductor 32 using a connector 40 which can be simply a piece of nylon string . the design of the transmitters 57 , 80 , 132 , 158 , 170 and 204 in fig2 - 6 is also important to the functioning of the present invention . the transmitters 57 , 80 , 132 , 158 , 170 and 204 are designed to yield optimization of the magnetic moment of the transmitting loop antenna . the magnetic moment ( m ) is given by the equation : a = the area of the loop antenna in square meters ; and optimization of the transmitters is achieved by recognizing that for the transmitting loop antenna , m = ( p o / bw ) 1 / 2 where p o = the power dissipated in the loop , and bw = the bandwidth of the fm carrier signal . so , in a series tuned circuit , to maximize the magnetic moment , the loop bandwidth ( bw ) is made as small as possible while still being wide enough to accommodate the occupied bandwidth of the fm carrier signal . thus , in the present invention , the ratio p o / bw is seen as the electrical optimization parameter and not as just the maximum power to load resistance . the receivers 56 , 82 and 130 in fig2 and 5 have been designed to include a means for measuring the received signal to noise ( s / n ) ratio . the squelch control knobs 64 , 84 and 134 on the radios 22 , 26 and 24 are calibrated so that each click of the squelch control knob indicates a change in the s / n ratio by 10db . this feature circumvents the necessity of having radio maintenance personnel carry field strength meters to determine the high voice quality communication range ( fade margin ). the portable radio 22 , shown in fig2 serves two important functions in the mine communication system 20 . first , under normal conditions , radio 22 functions as a stationary radio transceiver in system 20 . a plurality of radios 22 would be placed in various locations in a mine 34 such as at the working face 36 and in saferooms , belt loading points and central control or communication points . the external speaker 69 provides a high volume audio capability so messages can be heard in the near vicinity of the unit . second , under emergency situations , such as a fife , explosion or cave - in , the portable radio 22 can be removed from its wall mount and carried by a miner enabling him to receive evacuation instructions and information . referring now to fig7 a , there is shown a conventionally designed intrinsically safe ( is ) battery protection circuit 220 . circuit 220 includes a wirewound resistor 222 and a fuse 224 connected in series with a battery 226 . a pair of contacts 228 and 229 provide a means for drawing current from circuit 220 . fig7 b shows an is current limiter circuit 230 of the present invention . the circuit elements enclosed within the two dashed boxes of fig7 b form a current trip circuit 232 and a redundant current trip circuit 234 . the circuit 232 includes a field effect transistor ( fet ) 236 connected in series between a node 238 and a node 240 . a branch of node 238 contains a resistor 242 , a transistor 244 and an fet 246 connected in series between node 238 and a ground 248 connected to the source terminal of fet 246 . the emitter of transistor 244 is grounded . a node 250 is located between transistor 244 and fet 246 . a resistor 252 is connected between node 250 and the gate terminal of fet 236 . a node 254 is located between transistor 244 and node 250 . a resistor 256 is connected between node 254 and a anode lead 258 which is connected to the anode of a twelve volt battery 260 . a resistor 262 is connected between node 240 and the gate terminal of fet 246 . a node 264 is located between resistor 262 and fet 246 . a resistor 266 is connected between node 264 and a ground 268 . the redundant trip circuit 2234 has an electrical structure identical to that of circuit 232 and includes a pair of fet &# 39 ; s 270 and 272 and a transistor 274 . the emitter of transistor 274 is grounded . the fet 270 is connected in series between the node 240 and a node 278 . a lead 279 is connected between a node 280 , which lies between resistor 242 and node 238 , and a node 281 . a branch of node 281 contains a resistor 282 , the transistor 274 and the fet 272 connected in series between node 281 and a ground 283 connected to the source terminal of fet 272 . a node 284 is located between transistor 274 and fet 272 . a resistor 286 is connected between node 284 and the gate terminal of fet 270 . a node 288 is located between transistor 274 and node 284 . a resistor 290 is connected between node 288 and the anode lead 258 . a resistor 292 is connected between node 278 and the gate terminal of fet 272 . a node 294 is located between resistor 292 and fet 272 . a resistor 296 is connected between node 294 and a ground 298 . the area to the right of redundant trip circuit 234 in fig7 b includes a current limiting fet 300 connected in series between the node 278 and a wire - wound inductor 302 . a feedback control operational amplifier 304 is connected to the anode lead 258 at a node 305 by an output lead 306 . a resistor 307 is connected in series between the node 305 and amplifier 304 . the amplifier 304 includes a current limit voltage comparactor 312 and a case temperature limiter 314 . an output lead 316 forms a rectangular loop 318 which is connected between comparator 312 and the node 281 . the loop 318 includes a resistor 322 connected in series between node 281 and comparator 312 . an input lead 330 of comparator 312 is connected to a grounded resistor 332 . another input lead 334 of amplifier 304 is grounded . an input lead 336 of the amplifier 304 , which includes a resistor 338 , is connected to the anode lead 258 . a node 344 is located on input lead 330 between grounded resistor 332 and comparator 312 . a lead 346 , which includes a resistor 348 , runs from node 344 to anode lead 258 . an input lead 349 connects limiter 314 with lead 346 at a node 350 . a lead 352 , which includes a resistor 354 , connects limiter 314 with anode lead 258 . a node 356 is located on lead 352 between limiter 314 and resistor 354 . a grounded heat responsive thermistor 358 , located near the current limiting fet 300 , is connected to lead 352 at node 356 . a thermal connection 359 is made between thermistor 358 and fet 300 using thermally conductive epoxy . the gate terminal of an fet 360 is connected to the lead 306 at a node 361 . the drain terminal of fet 360 is connected to the anode lead 258 at a node 362 by a lead 363 . the lead 363 includes a resistor 364 . a ground 365 is connected to the source terminal of fet 360 . an output lead 366 is connected between the limiter 314 and a node 367 lying on lead 363 . a resistor 368 is connected between the gate terminal of fet 300 and a node 369 lying on lead 366 . a grounded capacitor 372 is connected to lead 346 at a node 374 lying between node 344 and node 350 . an anode terminal 380 is located at the end of anode lead 258 furthest removed from battery 260 . a cathode terminal 382 is located at the free end of inductor 302 . the terminals 380 and 382 provide a means for connecting electronic equipment to the circuit 230 . the area to the left of current trip circuit 232 in fig7 b includes a cathode lead 384 which is connected to the cathode of battery 260 . a plurality of battery charging diodes 386 , connected in series , join cathode lead 384 at a node 388 near the cathode of battery 260 . cathode lead 384 branches at a node 390 . one branch of cathode lead 384 is connected to a sense resistor 392 . along the other branch , a precision wirewound resistor 394 is connected between node 390 and node 238 . a sense connector 396 is located at the free end of resistor 392 . a cathode charge connector 398 is located at the free end of the series of diodes 386 . an anode charge connector 400 is located on the free end of a lead 402 which connects to anode lead 258 at a node 404 near the anode of battery 260 . the functioning of the is current limiter circuit 230 of the present invention can now be explained . the current limiter circuit 230 is designed to replace the conventional is battery protection circuit 220 shown in fig7 a . the circuit 230 would be used with radios 22 and 24 and repeaters 28 of fig1 . for example , fig2 shows the portable radio 22 equipped with a battery pack 58 and an intrinsically safe limiter circuit 59 . the personal - carried radio 26 is equipped with a smaller is limiter circuit 88 having the same design as circuit 230 . the circuits 59 , 136 , 88 , 192 , 196 , 216 and 214 are needed when using the radios 22 , 24 and 26 and repeaters 28 and 29 and the pager 27 in gaseous atmospheres , such as are found in coal mines , to prevent explosions . the current trip circuit 232 , shown in fig7 b , emulates the fuse 224 of fig7 a . the feedback control operational amplifier 304 in fig7 b emulates the resistor 222 in fig7 a . the redundant trip circuit 234 of fig7 b serves as a back - up to current trip circuit 232 . the operation of current limiter circuit 230 limits the instantaneous demand current flow to an intrinsically safe level . the initial condition of the fet &# 39 ; s 236 , 270 and 300 is a low channel resistance condition of about 0 . 18 ohms . the current flow through resistor 394 produces a voltage v ( 1 ) by ohm &# 39 ; s law . the current limit voltage comparator 312 has a reference voltage v ( 2 ), which is normally greater than voltage v ( 1 ), established by the biasing resistors 348 and 332 . as long as the voltage v ( 1 ) remains less than voltage v ( 2 ), the channel resistance of fet 300 remains at the low value of about 0 . 18 ohms . however , in the event an excessive demand of current flow is caused by a fault in the equipment connected between terminals 380 and 382 or in the current limit voltage comparator 312 , the voltage v ( 1 ) rises above voltage v ( 2 ). this drives the output lead 306 to a low level causing the channel resistance of fet 300 to increase and thus limiting the current flow through fet 300 . transistor 244 then turns on causing the fet 236 channel resistance to increase . simultaneously , the fet 246 channel resistance goes to a low ohmic resistance state , for the purpose of latching fet 236 in its high resistance state , thereby permanently opening the demand current path . by opening terminals 380 and 382 , the latch condition in circuit 230 can be removed . the redundant trip circuit 234 backs up the current trip circuit 232 . to further insure the fuse - like nature of circuit 230 and to prevent overheating of the fet 300 , the heat responsive thermistor 358 is attached with thermally conductive epoxy to fet 300 at connection 359 . if fet 300 heats up , the temperature increase is transferred to thermistor 358 . whenever the temperature of thermistor 358 exceeds a limit set by v ( 2 ), the gate of fet 300 is driven to a low state , thus increasing the channel resistance of fet 300 . the function of case temperature limiter 314 is to prevent excess heat build - up in fet 300 which could cause incendiary conditions to develop . when equipment is connected across the terminals 380 and 382 , a transient demand current flows to charge capacitors in the equipment . this current is slowed down by the wire - wound inductor 302 . the energy of this current transient is limited to less than 0 . 2 millijoules . the plurality of diodes 386 and the charge connectors 388 and 400 provide a means for recharging battery 260 . the sense resistor 392 and the sense connector 396 provide a means for determining the battery charging states . initially , this is a high charge current rate followed by a flat charge rate . the design of is current limiter circuit 230 insures that a fault in any circuit ( such as a short circuit ) will not cause incinerary conditions to occur in the circuit . the entire circuit 230 is potted to prevent coal dust from accumulating on the component parts . although the present invention has been described in terms of the presently preferred embodiment , it is to be understood that such disclosure is not to be interpreted as limiting . various alterations and modifications will no doubt become apparent to those skilled in the art after having read the above disclosure . accordingly , it is intended that the appended claims be interpreted as covering all alterations and modifications as fall within the true spirit and scope of the invention .	7
the method and the device according to the present invention for the welding , in particular the repair welding of structural components , preferably of a gas turbine , are clarified in greater detail in the following . fig1 shows one preferred exemplary embodiment of a device according to the present invention for welding gas turbine components , the device being designed as a handheld laser device . in the exemplary embodiment of fig1 , a structural component 10 to be welded is placed in a welding receptacle or holding receptacle 11 . in the illustrated exemplary embodiment , structural component 10 is in the form of a gas turbine blade . laser welding is used to weld structural component 10 in holding receptacle 11 . the device according to fig1 includes a laser source 12 , the laser light produced by laser source 12 being conducted via an optical fiber 13 into the area of a processing station 14 . processing station 14 includes optical elements 15 , 16 in order to focus the laser light produced by laser source 12 and to deliver it as a precisely directed and aimed laser beam 17 to structural component 10 to be welded . the welding process may be monitored or observed using a stereomicroscope 18 assigned to processing station 14 . along the lines of the present invention , laser source 12 is operated in the so - called pulsed mode . accordingly , the laser welding is carried out in a pulsed mode , a pulsating laser beam 17 being used to weld the structural component . in this connection , the pulse duration and / or pulse shape and / or power of laser beam 17 or of laser source 12 are variably settable . welding may be carried out both in continuous - pulse operation as well as in single - pulse operation . the pulse shape , pulse duration , and the power of laser beam 17 are preferably controlled by a control device ( not shown ). this permits a very selective directing or focusing of laser beam 17 at structural component 10 , with the result that the energy introduced by laser beam 17 is precisely controllable . the heat input during the welding process using the pulsed method is very low , obviating the need for an oversized molten weld pool . by employing the pulsed laser welding method , any deformation , parts distortion , microstructural changes and cracking on structural component 10 to be welded are reduced to a minimum . the pulsed - operation laser welding method according to the present invention may be applied very advantageously to thin - walled components made of superalloys existing in directionally solidified or monocrystalline form . these structural components are , in particular , gas turbine blades . structural components of this kind are particularly sensitive during welding processes and , by employing the method according to the present invention , are able to be welded without being preheated , i . e ., in the unpreheated state . as a result , gas turbine blades are able to be repaired very reliably , safely , quickly and cost - effectively . the pulsed laser welding method according to the present invention makes it possible for worn edges of gas turbine blades to be rewelded while achieving exceptionally high contour accuracy , and for cracks in the turbine blades to be reliably closed . the device according to the present invention also includes a wire feeder 19 . wire feeder 19 advances a welding wire 20 into contact with structural component 10 to be welded . in accordance with the present invention , wire feeder 19 is controlled by the control device ( not shown ) in such a way that a wire feed rate of welding wire 20 is adapted to the pulse duration and / or pulse shape and / or power output of the pulsed laser welding method . the wire feed rate is controlled in such a way that welding wire 20 is precisely fed per welding pulse , into contact with structural component 10 to be welded . in the process , the wire feed rate is preferably set as a function of the laser power . using empirically ascertained welding parameters , which are stored in a database of the control device ( not shown ), the requisite welding parameters may be retrieved as a function of the particular damage . to enhance process reliability , the present invention provides for a cnc machine that is driven by the control device ( not shown ) to be used for feeding welding wire 20 . structural component 10 to be repaired is welded in holding receptacle 11 , preferably shielded by an inert gas atmosphere . an inert gas is introduced via an inert gas feed line 21 into holding receptacle 11 . a suitable inert gas is selected by one skilled in the art whom this technical teaching concerns , in dependence upon the materials of the structural components to be welded . a solid state laser , preferably an nd - yag solid state laser , is used as laser source 12 . this solid state laser is operated in pulsed mode and is controllable by a control device . a pulsed solid state laser is preferably used , whose average laser power output is within the range from 100 w to 500 w , the peak pulse power being between at least 6 to 10 kw . the pulse power fluctuates between 0 . 1 to 80 j , and the pulse duration is variably settable between 0 . 1 and 30 ms . the solid - state laser is optically excited ; it is preferably designed as a diode - pumped or lamp - pumped solid - state laser . the device according to the present invention as illustrated in fig1 is designed as a stationary handheld welder and , accordingly , as a handheld laser unit . thus , in the described preferred exemplary embodiment , in which a control device controls the pulse duration , pulse shape and power of laser beam 17 , as well as the wire feed for welding wire 20 , an operator merely needs to guide structural component 10 to be welded , underneath laser beam 17 , and observe the quality of the welding operation through stereomicroscope 18 . in rigid or linear applications , a triaxial system may optionally be used for feeding the structural component . besides a motor driven , controlled wire feed for welding wire 20 , it is self - evident that a manual wire feed operation is possible as well . however , the motor driven , controlled wire feed is more precise and thus preferred . the above described specific embodiment of the device according to the present invention as a stationary handheld welder is primarily suited for processing , namely for welding or repair welding relatively small gas turbine components , such as gas turbine blades . to process larger structural components or to perform welding operations directly on the gas turbine , the device according to the present invention may also be realized as a mobile welding device . a specific embodiment of this kind makes it possible for large - volume , heavy , and hard - to - reach structural components to be processed as well . in such a case , processing station 14 is mounted on an articulated arm that is movable into the area of the structural component to be welded . it is also conceivable for processing station 14 to be advanced by a multiaxis gantry - type system to the structural component to be processed . in this case , the device according to the present invention is designed as a gantry - type system . the method according to the present invention , as well as the device according to the present invention are preferably used for the welding , in particular repair welding of structural components of high - temperature - resistant superalloys having a directionally solidified or monocrystalline form . by employing the novel method , structural components of gas turbines , such as axially symmetrical components , for example seals and retaining rings , may be welded . in addition to housing parts , rotor blades , as well as guide vanes of high - pressure turbines , low - pressure turbines and compressors may be welded . all superalloy γ ′- phase materials , materials from the mcraly family , and all high - temperature alloys , as well as alloys from the nickel group or cobalt group are able to be reliably welded . examples of materials that are weldable using the method according to the present invention , include : r ′ 80 , r ′ 41 , dsr ′ 142 , r ′ n5 , r ′ n4 , pwa 1426 , pwa 1484 , pwa 1480 , marm 509 or also marm 274 . as a welding wire , primarily one is used having the same composition as the structural component to be welded . by employing the present invention , a multiplicity of advantages are attainable over the related art . thus , cracking is reduced during the welding operation and subsequently thereto . in addition , there is less distortion on the structural components due to the narrower heat - affected zone and the decreased heat input . higher strengths , as well as more finely grained weld metal may be obtained during welding , which is consistent with improved quality of the welding process . a reliable repair welding of even extremely thin - walled structural components is possible . the device according to the present invention is very versatile . on the one hand , it may be used to weld small structural components and , on the other hand , large , heavy , and not easily accessible structural components , as well . a reproducible welding quality is derived from the laser pulse control and from the wire feed control . a durable and wear - resistant weld joint is able to be produced by employing the method according to the present invention . because the composition of the structural component to be welded and that of the welding wire used as filler metal are of like kind , the weld joint formed achieves virtually the same properties as the base material and is thus less susceptible in later operation , in particular to thermal fatigue cracking , since it has the same thermal expansion coefficient as the base material .	1
deficiencies of the prior art have lead to a need to provide balun transformers that are more efficient in their design , particularly in the number of metallization layers used for their implementation without significantly adversely affecting the balun transformer performance . the solution of the present invention accomplishes this target by having the windings of the primary inductor in one metal layer and the windings of the secondary inductors in another metal layer not only vertically separated from , but also horizontally displaced from the first metal layer . the displacement reduces the capacitive coupling between the primary and secondary coils . furthermore , the implementations shown enable the use of only three or four layers of metal for a balun transformer . it should be noted that the displacement should be such that a substantial magnetic coupling between the primary and secondary inductors of the balun is still achieved to ensure the proper performance of the balun . reference is now made to fig2 through 4 where each of the three metal layers comprising a balun transformer 500 , shown in fig1 , are implemented in accordance with the disclosed invention are shown . the implementation makes use of three metal layers , metal layer 100 , metal layer 200 , and metal layer 300 . a person skilled - in - the - art will realize that it is not required that the metal layers used are consecutive metal layers , and specific choices may be made for the desired characteristics of the balun transformer , such as balun transformer 10 , including , but not limited to , the grounding of both one of the nodes , for example node 14 , of the primary inductor and the center node 24 of the secondary inductor . in fig2 , a primary coil is composed of a continuous winding 210 and ends 12 and 14 , implemented on a metal layer 100 , and designed to be pseudo - symmetrical , i . e ., essentially symmetrical , with a slight asymmetry when curving to implement an internal winding . in fig3 a secondary coil , implemented in metal layer 300 , is composed of winding segment 310 having ends 312 and 26 , winding segment 320 having ends 22 and 322 , and winding segment 330 having ends 332 and 334 . the complete coil of the secondary coil is achieved by the use of shunt 410 , connecting ends 322 and 334 of winding segments 320 and 330 respectively , and shunt 420 , connecting ends 312 and 332 of winding segments 310 and 330 respectively . the shunts are shown in fig4 . winding segments 310 , 320 and 330 of the secondary coil of fig3 have a displacement with respect to winding 110 of the primary coil of fig2 , as explained in more detail below . the displacement reduces the horizontal overlap between the primary and secondary coils and hence reduces the capacitive coupling between them . preferably the displacement is such that there is less than fifty percent overlap in the conductive paths between the windings of the secondary and the primary windings , excluding the shunts . a non - overlapping implementation is also possible as long as there is sufficient magnetic coupling between the primary and secondary inductors of the balun . in some embodiments of the disclosed invention , the input nodes of the primary inductor are physically one - hundred and eighty degrees from the outputs of the secondary inductor , further achieving symmetry . fig5 shows such an embodiment , with the center tap 24 of the secondary being connected to node 14 , typically both being grounded or coupled to a circuit common by a single connection thereto . referring now specifically to fig5 , a top view of the three metal layers comprising balun transformer 10 are shown . in one preferred embodiment , metal layer 100 is the bottom layer , metal layer 200 is the middle layer and metal layer 300 is the upper layer . in particular , the primary coil metal layer 100 would be deposited over an insulator such as silicon dioxide ( sio 2 ), for example on a substrate , typically a silicon substrate , and then patterned using conventional photolithography techniques . notably , metal layer 100 may be any one of the metal layers available for use in the device . then another sio 2 layer is deposited , followed by the depositing and patterned of another metal layer 200 to form the shunts . a further sio 2 is deposited and windows opened ( etched ) therein to expose the ends of the shunts for vias , and in the embodiment being described , an opening through the last two sio 2 layers to expose node 14 of the primary inductor . then a final metal layer is deposited and patterned , making electrical contact with the shunts the form the complete secondary winding , and providing a common connection to one primary node ( 14 ) and the center node 24 of the secondary winding . it should be further noted that it is not required that the metal layers , used in the baluns of the present invention , be consecutive metal layers . hence if a semiconductor device has available a total of seven metal layers , then if three metal layers are used for the balun , any three of the seven metal layers may be of use . by using this arrangement , the vertical distance between the primary coil and the secondary coil is further increased and therefore contributes to a reduction in the capacitive coupling between the coils . the primary coil is accessed at nodes 12 and 14 in metal layer 100 . since node 14 is connected to the center node 24 of the secondary inductor , it is further possible to access node 14 in metal layer 200 . the secondary coil ends 22 and 26 are accessed in metal layer 300 , while center node 24 of the secondary coil is accessed at end 24 in metal layer 300 , as well as through node 14 in metal layer 100 as explained above . in one alternate embodiment , the order of the layers may be reversed , namely layer 300 , then layer 200 and finally layer 199 . in another embodiment of the disclosed invention , metal layer 300 follows metal layer 100 in the vertical stack , with the last metal layer being metal layer 200 . connection between layers is achieved by the use of vias or stacked via holes which are well - known in the art . the inventors have noted that this implementation provides for minimal losses and has a narrowband balancing . typical external diameter for a balun transformer in accordance with the disclosed invention is between 200 and 800 micron . spacing between turns in the primary coil is typically 5 to 10 microns , and between turns of the secondary coil is typically 5 microns . a conduction path width of the primary inductor is typically between 10 and 20 microns and the secondary inductor path width is typically 5 microns . therefore , in a preferred embodiment of the invention , with a fifty percent overlap of the secondary with respect to the primary , only 2 . 5 micron of width , or less , of the secondary inductor will be in overlap with the windings of the primary inductor . the typical numbers provided herein are of course exemplary only , and are not intended to limit the scope of the disclosed invention . reference is now made to fig6 through 9 where each of the four metal layers comprising a balun transformer 1000 , shown in fig1 in accordance with another embodiment of the present invention are shown . this embodiment is designed to provide broadband balancing . the implementation makes use of four metal layers , metal layer 100 , metal layer 200 , metal layer 300 , and metal layer 400 . these layers are shown in fig6 through 9 . a person skilled - in - the - art will realize that it is not required that the metal layers used be consecutive metal layers , and specific choices may be made to accommodate the specific characteristics of balun transformer 1000 . the schematic of balun transformer 1000 is identical to the schematic shown for balun transformer 10 in fig1 b , and therefore node designation shall again remain the same . in fig6 , a primary coil is composed of a winding segment 610 having ends 12 and 612 , and a winding segment 620 having ends 622 and 14 . winding segments 610 and 620 are implemented in a patterned metal layer 100 . in fig8 , there is shown a shunt 810 implemented in patterned metal layer 200 . shunt 810 connects ends 612 and 622 of windings 610 and 620 respectively . by connecting winding segments 610 and 620 , shunt 810 completes an implementation of a primary coil of balun transformer 1000 , creating a pseudo - differential inductor , having only two spirals . in fig7 a secondary coil is composed of winding segment 710 having ends 22 and 712 , winding segment 720 having ends 26 and 722 , and winding segment 730 having ends 732 and 734 . segments 710 , 720 and 730 of the secondary coil of balun transformer 1000 are implemented in patterned metal layer 400 . in fig9 there are shown shunts 910 and 920 implemented in patterned metal layer 300 . shunt 910 connects ends 722 and 734 of windings 720 and 730 , and shunt 920 connects ends 712 and 732 of windings 710 and 730 . by connecting winding segments 710 , 720 and 730 , shunts 910 and 920 complete an implantation of a differential secondary coil of balun transformer 1000 , where typically center node 24 is grounded , and connected to one of the nodes of the primary coil , for example node 14 . winding segments 710 , 720 and 730 have a displacement with respect to winding segments 610 and 620 of the primary coil , as explained in more detail below . the displacement reduces the overlap between the primary and secondary coils and hence the capacitive coupling between them . preferably the displacement is such that there is less than fifty percent overlap in conductive path width between the windings of the secondary and the primary windings , excluding the shunts . a non - overlapping implementation is also possible as long as there is sufficient magnetic coupling between the primary and secondary inductors of the balun . in one embodiment of the disclosed invention , the output nodes of the primary inductor are physically one - hundred and eighty degrees from the outputs of the secondary inductor , further allowing for achieving symmetry . referring now to fig1 , the four metal layers comprising balun transformer 1000 are shown . in one preferred embodiment , metal layer 100 is the bottom layer , metal layer 200 is a first middle layer followed by metal layer 300 , and metal layer 400 is the upper layer . however , a person skilled - in - the - art would easily note that a reverse order could be used , or in fact , any order that would not cause a restriction on the connection between the different metal layers . the primary coil is accessed at ends 12 and 14 in metal layer 100 . end 14 may be further accessed via node 24 of the secondary coil , connected through shunt 24 shown in fig8 . the secondary coil ends 22 and 26 are accessed in metal layer 400 . center node 24 of the secondary coil is accessed via metal layer 200 which is also connected , for example by use of a via to node 14 in metal layer 100 . connection between layers is achieved by the use of via or stacked via holes which are well - known in the art . the fabrication process in general may be similar to that previously described . in the baluns of the present invention , each layer is separated from adjacent layers by an electrically insulative ( dielectric ) layer , preferably sio 2 , though other substrates and other electrically insulative layers could be used if desired . in that regard , silicon and sio 2 are preferred as being most compatible with integrated circuit fabrication processes . the metal layers may be of various metals , though high electrical conductivity metals are preferred , such as aluminum , gold or silver . it should be further noted that it is not required that the metal layers , used in the baluns of the present invention , be consecutive metal layers . hence if a semiconductor device has available a total of seven metal layers , then if three metal layers are used for the balun , any three of the seven metal layers may be of use . the inventors have noted that the foregoing implementation provides for minimal losses and has a broadband balancing . typical external diameter for a balun transformer in accordance with the disclosed invention is between 200 and 800 micron . spacing between winds in the primary coil are typically 5 to 10 microns , and between windings of the secondary coil are typically 5 microns . a path width of the primary inductor is typically between 10 and 20 microns and the secondary inductor is typically 5 microns . therefore , in a preferred embodiment of the invention , with a fifty percent overlap , only 2 . 5 micron of width , or less , of the secondary inductor conductive path will be in overlap with the windings of the primary inductor . again , the typical numbers provided herein are exemplary purposes only and are not intended to limit the scope of the disclosed invention . reference is now made to fig1 where a diagram of a first portion 1110 of a primary coil metal layer and a second portion 1120 - a and a third portion 1120 - b of a secondary coil metal layer are shown . the layout of the second portion and third portion is in displacement with respect to the first portion . by avoiding full coverage between the primary and secondary coils , the parasitic coupling capacity is reduced and overall performance of the balun transformer improved . this separation further allows the use of a wider first portion and therefore reduces the resistance of the primary inductor . reference is now made to fig1 where an exemplary flowchart 1200 of the process of manufacture of the balun transformers disclosed herein is shown . in one embodiment of the manufacturing process , in step s 1210 a there is created in a first metal layer an essentially pseudo - symmetrical winding . alternatively , step s 1210 b is used where there is created a first winding that is symmetrical , as explained above with respect to fig6 . in step s 1220 there is deposited a layer of non - conducting material that is an insulator between one layer of metal and another layer of metal , and has further known dielectric characteristics . therefore , when depositing another metal plate on top of the dielectric , there will be formed a parasitic capacitor , known also as a coupling capacitance , between the two layers of metal , reducing the performance of the balun . in accordance with the disclosed invention , in step s 1230 there is created a symmetrical second winding , as may be seen with respect to fig3 and 7 , the second winding being concentric with , but horizontally displaced from the turns of the first winding . in one embodiment , the overlap between the second winding and the first winding is no more than fifty percent of the conductive path width of the second winding , excluding shunts . a non - overlapping implementation is also possible as long as there is sufficient magnetic coupling between the primary and secondary inductors of the balun . in some embodiments of the disclosed invention , the output nodes of the primary inductor are physically one - hundred and eighty degrees from the outputs of the secondary inductor , further providing symmetry . in step s 1240 , shunts are created to ensure continuous conducting paths through each of the first winding and the second winding . a person skilled in the art would readily recognize that the shunts may be created at multiple metal layers and hence the specific order shown herein should not be viewed as a limitation of the invention . furthermore , it should be noted that the preferred manufacturing processes in general are well - known in the art , and are not provided herein in great detail in order to maintain clarity of the disclosed invention . also while certain preferred embodiments of the present invention have been disclosed and described herein for purposes of illustration and not for purposes of limitation , it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention . as an example , while in embodiments shown herein with respect of fig6 , 7 and 8 , where the primary inductor has two turns and the secondary inductor has three turns , other configurations may be used . for example , and without limitation to the disclosed invention , embodiments of a balun having three turns in the primary inductor and five turns in the secondary inductor , or , four turns in the primary inductor and seven turns in the secondary inductor , are also possible . the principles discussed hereinabove may be also used to design large l inductors . this way , the overlap capacitance between the different metal layers is reduced and the self - resonance frequency is not affected significantly . reference is now made to fig1 a through 13c that show a large l inductor designed in accordance with the principles of the disclosed invention . fig1 a shows a schematic drawing of the overall “ 3 - d ” inductor 1300 structure . the inductor 1300 is comprised of a top inductor 1310 , shown in fig1 b , and a bottom inductor 1320 , shown in fig1 c . the top inductor 1310 generally corresponds to the upper portion discussed above with respect of the balun . the bottom inductor 1310 generally corresponds to the lower portion discussed above with respect of the balun . in accordance with the principles of the disclosed invention the winding of the top inductor is displaced with respect to the bottom inductor , thereby reducing the overlap between the metals comprising the top inductor and the bottom inductor . the reduced overlap further accounts for the reduction in the parasitic capacitance between the windings and thereby contributing to the overall superior design over prior art solutions . the construction of a large l inductor in accordance with the principles of the disclosed invention is as follows : first the top inductor 1310 is followed from the outer winding to the inner winding . once the inner winding is reached , a pair of metal bridge segments ( not shown ) transfer the spiral windings to the bottom inductor 1320 which is now deployed from the inner winding to the outer winding , each winding being in displacement to windings of the top inductor 1310 . the bridges connect the edges 1312 and 1314 of the top inductor 1310 to the edges 1322 and 1324 of the bottom inductor 1320 respectively . the center tap is placed at the outer spiral of bottom part . the current flow is always in the same winding sense so the mutual inductance developed is in favor of the overall spiral inductance . the ports of the inductor are ports 1316 and 1318 . the center tap 1326 in the bottom inductor is in fact the center of the large l inductor . in one embodiment of the disclosed invention the overlap between the conductive paths of the top inductor and the bottom inductor does not exceed fifty percent of the width of at least one of the conductive paths . reference is now made to fig1 where a cross section 1400 , corresponding to cross section a - a from fig1 a , is shown . in the enlarged cross section it can be seen , that in accordance with the principles of the disclosed inventions , the windings of the top inductor 1310 are placed in a displacement to the windings of the bottom inductor 1320 . in one embodiment of the disclosed invention an inductor may be created using a sandwich of two metal layers , the effective thickness of the spiral is increased and , therefore , the quality factor of the device is kept as high as possible . surface 1410 is the face of the portion of the integrated circuit while surface 1420 is the back side and the substrate of the integrated circuit . while a preferred embodiment of the present invention has been disclosed and described herein for purposes of illustration and not for purposes of limitation , it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention .	7
throughout all the figures , same or corresponding elements may generally be indicated by same reference numerals . these depicted embodiments are to be understood as illustrative of the invention and not as limiting in any way . it should also be understood that the figures are not necessarily to scale and that the embodiments are sometimes illustrated by graphic symbols , phantom lines , diagrammatic representations and fragmentary views . in certain instances , details which are not necessary for an understanding of the present invention or which render other details difficult to perceive may have been omitted . turning now to the drawing , and in particular to fig1 , there is shown a top view of two streets 2 a and 2 b which intersect at an intersection 3 at right angles . the streets 2 a and 2 b are bordered on all sides by abutting buildings . the buildings 5 a , 5 b , 5 c and 5 d complicate or prevent direct line - of - sight connection between street sections formed by the streets 2 a and 2 b . altogether three motor vehicles 1 a , 1 b and 1 c are positioned on the streets 2 a and 2 b . the motor vehicles 1 a and 1 c travel in opposite directions on the street 2 a and have a direct line - of - sight connection with each other . electronic communication systems , which are part of a car - to - car communication system , are installed in all motor vehicles 1 to 1 c . these systems can operate as both transmitter and receiver for radio waves at the frequency 5 . 8 ghz . for example , the motor vehicle 1 a determines its current position and speed and transmits these data wirelessly to other road users . for this purpose , the car - to - car communication system is available in the motor vehicle 1 a which can transmit radio waves as transmitter s . a similar device operating as receiver e 1 for this electromagnetic radiation is provided in the motor vehicle 1 c . because a direct line - of - sight connection exists between the motor vehicles 1 a and 1 c , data can be transmitted directly from transmitter s to receiver e 1 via an electromagnetic radio beam r 3 . conversely , a direct line - of - sight connection does not exist between the motor vehicles 1 a and 1 b . the radio beam r 4 transmitted from the transmitter s to a receiver e of the motor vehicle 1 b cannot reach the receiver e because of the building 5 a . the direct line - of - sight propagation is interrupted by the building 5 a . however , it would be especially beneficial to exchange data between the motor vehicles 1 a and 1 b via car - to - car communication for preventing , for example , a collision between the two vehicles 1 a and 1 b at the intersection 3 . to date , such communication is not easy achievable , because the radio contact is interrupted by the building 5 a . to nevertheless enable radio contact , a reflector system in form of a reflector pyramid 4 is installed in the center of the intersection 3 , i . e . at the point of intersection of the streets 2 a and 2 b . this reflector pyramid is constructed to have a square base surface . the side faces forming the pyramid are formed by welded metal sheets capable of excellent reflection of the electromagnetic radiation of 5 . 8 ghz . as illustrated in fig2 , the reflector pyramid 4 is installed at a traffic signal 6 such that at the point of intersection of the streets 2 a and 2 b , the tip of the pyramid points vertically towards the road surface . the reflector pyramid 4 is hereby oriented such that two of its edges point in the direction of the course of the road 2 a and two of its edges in the direction of the course of the road 2 b . the electromagnetic radiation transmitted from the transmitter s in the beam direction r 1 is then incident on the reflector pyramid 4 where it is reflected at an angle a in the direction of the street 2 b . the reflected radio beam is indicated with r 2 . this beam can now be readily received by the receiver e of the motor vehicle 1 b . the radio beam r 1 is deflected by the reflector pyramid 4 so as to be incident on the receiver e as radio beam r 2 , thus enabling car - to - car communication between the motor vehicles 1 a and 1 b in spite of the absence of a line - of - sight connection . the reflector system is in particularly oriented and / or constructed so as not to return the electromagnetic waves in the direction of incidence ( as is the case with the topset ) and not to distribute the radiation uniformly in space . fig3 a to 3c show additional possible street configurations and arrangements of a reflector system . in these exemplary embodiments , the reflector system is constructed as a reflector cube , wherein the surfaces of the cube which are shown in fig3 a to 3c in a top view need not necessarily be constructed from a reflecting material . however , the perpendicular side faces of the cube are again constructed from welded metal sheets . the intersection in fig3 a is constructed as a t - intersection of two streets 2 c and 2 d . building 5 prevents direct radio communication between transmitter s and receiver e . however , the reflector cube 7 at the t - intersection point is aligned so that , according to the laws of geometric optics , the radio beam r 1 emitted by the transmitter s is able to reach the receiver e as a reflected radio beam r 2 . this enables car - to - car communication . fig3 b shows a curve 8 between the streets 2 c and 2 d , wherein a building 5 once more prevents direct radio communication between transmitter s and receiver e . the reflector cube 7 is here installed in the curve 8 on the bordering building 5 e , again enabling a 90 ° reflection of the incident electromagnetic radiation , i . e . the beams r 1 and r 2 are perpendicular to each other . fig3 c illustrates a situation where the streets 2 c and 2 d do not intersect each other at a right angle at the intersection 3 . however , by suitably mounting the reflector cube 7 , a geometric situation can be produced which allows the electromagnetic beam r 1 emitted by the transmitter s to reach the receiver e as beam r 2 after reflection at the reflector cube 7 . it is evident that with the invention , the car - to - car communication is improved particularly near intersections in densely built - up areas . fig4 shows another possible exemplary embodiment for a reflector system 9 which includes four curved convex reflector elements 10 . as illustrated in the figure , the incident beams r 1 is then reflected not only in the horizontal direction , but also in the vertical direction . when this reflector system 9 , like the reflector pyramid 4 in fig1 and 2 , is installed at a traffic signal , excellent reception of the electromagnetic radiation r 2 by the motor vehicle 1 b can be ensured both when the motor vehicle 1 b is far way from the traffic signal 6 and when the motor vehicle 1 b is close to the traffic signal . in particular , excellent reception can also be ensured even when the motor vehicle 1 b is already almost underneath the reflector system 9 on the intersection 3 . while the invention has been illustrated and described in connection with currently preferred embodiments shown and described in detail , it is not intended to be limited to the details shown since various modifications and structural changes may be made without departing in any way from the spirit and scope of the present invention . the embodiments were chosen and described in order to explain the principles of the invention and practical application to thereby enable a person skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated .	7
as shown in fig1 a lamp housing hanging arm 2 is attached to the ceiling 1 of a room in a manner which allows a lamp housing to swing or move vertically with respect thereto . the lower end of the lamp housing hanging arm 2 has the base 3a of a lamp housing supporting arm 3 attached thereto . the lamp housing 4 is tiltably attached to the lamp housing supporting arm 3 and a number of lamps 5 are concentrically arranged and supported within the lamp housing 4 in a manner such that they can be tilted in a radial direction with respect to the central axis of the lamp housing 4 . there is an opening 17 which is centrally located on a bottom wall 4a which is positioned midway down the side of and inside the lamp housing 4 . further , a sleeve 19 having a reinforcing member 18 is located inside the lamp housing 4 and on top of wall 4a , and engaging hook fitting member 20 , having holes 18a , 19a and 20a located therein , is positioned outside the lamp housing 4 , and is integrally attached to sleeve 19 and member 18 , and further , is secured to the lamp housing &# 39 ; s lamp housing bottom wall 4a at opening 17 by means of screws 21 . a wall of sleeve 19 has a stepped portion 19b receiving an outer ring of a bearing 23 located within hole 19a . further , referring to fig6 bearing 23 contacts flange 22a which is located halfway down central focus adjusting shaft 22 . a rotatable housing 24 , which is made of electrically insulating material is located on top of the flange 22a and is attached to flange 22a by screws 25 with the shaft 22 extending down through the central axis of the housing 24 and being held therein by flange 22 . the transformer mount 28 is held by shaft 22 within housing 24 and has integral therewith , a tubular portion 28 ( a ) which has a stepped portion 28 ( b ) for attaching the transformer mount 28 to the shaft 22 by means of a bearing 29 which is located within the stepped portion 28 ( b ). a step down transformer 30 is mounted on the transformer mount 28 and insulated therefrom by means of insulators 31 and 33 . transformer securing plate 32 is attached to the top portion of the transformer mount 28 by means of nut 34 , and serves to securely hold the transformer 30 thereon . there are three equally spaced legs 35 attached to the underside of the transformer mount 28 which extend through slots 36 in the bottom of housing 24 and are secured to sleeve 19 . as shown in fig7 the bottom side of housing 24 has slots 36 therein for guiding the legs 35 and permitting rotation of housing 24 with the ends of the slots operating as stops for limiting the range of rotation of housing 24 . the tips of engaging hooks 37 jut inward into hole 20 ( a ) with the hooks 37 being located within engaging hook fitting member 20 , from four directions . engaging hooks 37 have a tapered tip 37a which extends into the hole 20 ( a ) in a longitudinally transverse direction , with the remainder of the engaging hook 37 being located in a hook - setting hole 38 . the tapered tip 37a is urged into the hole 20a by a spring 39 which is held in hook - setting hole 38 by a screw 40 as shown in fig6 . as described previously , handle 26 has a ridge 26a which extends in the radial direction relative to the handle as shown in fig6 and 8 ( b ) for engaging a groove 27 , on the focus adjusting shaft 22 as shown in fig8 ( a ). the upper end of handle 26 has a tapered portion 26c which is engaged by the tapered portion 37a of hook 37 so that when the handle 26 is inserted into hole 20a the hooks 37 are compressed in against the springs 39 for latching the handle 26 and holding it securely . the handle has an annular groove 41 for receiving the hook 37 and which thereby serves to hold the handle securely on the lamp housing and connected to shaft 22 . there is also a hook disengaging member 42 which is located under the annular groove 41 for causing the engaging hooks 37 to recede into the holes 38 . the member has hand engaging portion 42a for forcing it to move upward into contact with the tapered hook portion 37a by the person using the lighting fixture for accomplishing the previously described disengaging operation . fig6 shows the flange 26b of the handle 26 and further , shows c - rings 43 and 44 serve to lock the handle receiving assembly together . there is a voltage regulator 45 located attached to the side wall of the lamp housing 4 and which has a knob 46 which is turned for stepping down the voltage of transformer 30 and thereby adjust the intensity of each of the lamps 5 . the knob is electrically connected to the terminal 47 of the transformer 30 by a cord 48 . the rotating housing 24 has a rack 12 which is attached thereto , as shown in fig5 . further , rack 12 meshes with pinion 15 , which is concentrically attached , about the pivotal axis of the lamp housing supporting arm 3 about which the lamp housing 4 is pivoted , to the inner end of focus adjusting rod 14 with focus adjusting knob 13 being attached to the other end of rod 14 outside of the lamp housing 4 . by way of example , the operation of one embodiment of the present invention will be described . before using the lighting fixture , the handle 26 is sterilized and then inserted into hole 20a of hook fitting member 20 . the hook 37 overcomes the force being exerted on it by spring 39 as a result of being engaged by tapered portion 26c of the handle , and is thereby forced into the hook setting hole 38 . as the handle 26 is further inserted , the top portion comes into contact with and is connected to focus adjusting shaft 22 as hook 37 is forced , by spring 39 , into engagement with the handle by jutting into groove 41 . by thus attaching handle 26 to the lamp housing 4 , the lamp housing 4 position and the focus of each lamp 5 can be adjusted by a mere manipulation of the handle 26 . the position of the various parts of the fixture which is controlled by handle 26 are adjusted as described above and the focus adjusting shaft 22 and the rotatable housing 24 are turned to thus cause each drive rod 11 to tilt the lamps 5 respectively , in a radial direction and thus change the focus thereof . likewise , if the illumination on the area being treated is not correctly focused , the doctor can order this assistant to turn focus adjusting knob 13 which is also used to adjust the lamps 5 . thus , as knob 13 is turned , the housing 24 is caused to turn in the same way as when handle 26 is turned , by turning the lateral focus adjusting shaft 14 and the rack and pinion 12 and 15 , so that each lamp 5 is tilted by the rods 11 in a radial direction with respect to the central axis of the lamp housing 4 . further , if the light intensity on the treated area is either insufficient or too great , the adjusting knob 46 is turned , thus lowering the terminal voltage of transformer 30 by adjusting the setting of voltage regulator 45 . if knob 46 is not sterilized , care should be taken that adjustment be done by another person other than the doctor . to remove the handle 26 from the lamp housing , the operator &# 39 ; s finger is placed on flange 26b of disengaging piece 42 to force disk 42a upward . this action forces the hook 37 into hole 38 so that handle 26 may be removed . there are various modifications which can be made to the transformer to modify the shape of the fixture . for example , the transformer may be either annular or boxlike in shape . an annular shape would allow construction of a very thin lamp housing . likewise , the transformer may be fixedly secured to the transformer housing so as to be rotatable together with the transformer housing . it is however , advisable to support the transformer in a stationary manner and thus avoid the possibility of snapping the power supply cord to the transformer . the central focus adjusting shaft can be either fixed to the center of the bottom of the transformer housing or can extend therethrough to the top of it . from the standpoint of safety however , it is desirable to support said shaft at both the bottom and the upper end of the transformer housing . with the invention as thus described , the doctor can position the lamp housing and adjust its focus himself . thus , optimum lighting for treatment of an affected area can be quickly and reliably achieved even in complicated or time consuming operations . the described feature provides the additional advantage of reducing eye fatigue in the doctor doing the treatment . further , an assistant which is normally used for the sole purpose of adjusting the lamp position and focal depth can be eliminated and thus resulting in greater efficiencies . still further , the operation of the lighting fixture is very convenient because the positioning of the lamp housing and the adjustment of the focus of each lamp can be done through manipulation of a single handle . since the transformer is housed at the center of the lamp housing , the lamp housing is well balanced and can be adjusted in a smooth and natural fashion . further , since the intensity control of the lamps is located on the side of the lamp housing , there is no requirement of sending an assistant to the wall for adjusting the intensity of the lamp . instead , the doctor can easily instruct the assistant while viewing the illuminated area . finally , the installation of a rack around the rotatable transformer housing which meshes with a pinion which is installed at the internal end of a lateral focus adjusting shaft having a focus adjusting knob on the outside of the lamp housing allows for the focal depth to be changed by a person other than the doctor . thus , two separate people can adjust the focal depth at different times while the handle which is used by the doctor for adjusting said depth is maintained in a sterilized condition throughout the treatment . having thus described the invention , the scope of the invention will be defined in the following in which :	8
the phenomena which makes this control possible is the classifying action of the pelletizing disc whereby the finished pellets raise to the top of the rolling material and form an &# 34 ; eye &# 34 ; of finished pellets just before they are discharged . the discovery which i made is that the amount of surface moisture on the finished pellets is the primary control of both pellet size and density making it possible to adjust the moisture and thereby maintain pellet quality . the surface moisture is best measured with an infra - red unit consisting of an infra - red emitter and a collector to sense the amount of rays reflected from the finished rolling pellets on the pelletizing disc . the amount of reflected rays is an indication of the average amount of surface moisture on the rolling finished pellets . the amount of surface moisture is an indication of the size of the pellets and relates to the density of the pellets . the amount of reflected rays is analyzed by the programmable controller ( computer ) in comparison to a desired moisture as represented by a set point programmed into the controller . the programmable controller ( computer ) is a microprocessor - based , single - loop process controller capable of measuring differences in the amount of reflected infra - red rays and adjusting the control functions to maintain the desired set point . the microprocessor compares the reading from the infra - red collector with the set point to determine the amount of deviation and thereby sets the rate of change which will be made to the control function . an alternate location for reading the surface moisture of the finished pellets is in the discharge chute from the pelletizing disc or on the product conveyor ; however , these locations are not as satisfactory as the location on the pelletizing disc . referring to fig1 and fig1 a numeral 1 denotes the location of a moisture sensor , of the present invention , on a rotating pelletizing disc of the construction described in my prior u . s . pat . no . 3 , 883 , 281 issued may 13 , 1975 . the infra - red moisture gage comprises a measuring head 1 including a lead sulphide detector 2 connected by a signal cable 3 to electronics 2 . now referring to fig1 a ; the measuring head 1 has a common light bulb in light source 4 that produces near - infra - red light which is reflected off the process material in varying relative strengths , depending on the amount of surface moisture in the product . this reflected light is &# 34 ; sensed &# 34 ; by the detector in the measurement head 1 . the detector optically filters the light , creating measure and reference beams . the lead sulfide detector processes the signal and the digital electronics 2 produce an output equivalent to the product moisture . the standard airsweep minimizes dust and dirt build - up on the sensor windows . the digital electronics 2 is mounted remotely and connected via two twisted pair signal cables 3 , one for the measurement signal and one for a diagnostic signal . referring to fig1 a , the moisture sensor 1 on a pelletizing disc is a two component unit . it has an infra - red sensor head and digital support electronics . the sensor head contains an infra - red emitter to generate the rays and a collector to gather the reflected rays . the reflected rays vary in relative strength depending on the amount of surface moisture on the rolling pellets . the collector optically filters the light , creating measure and reference beams . the digital support electronics converts the raw data into a 4 - 2 ma . signal for the programmable controller . the programmable controller is a microprocessor . this microprocessor is a single - loop process controller capable of measuring , displaying and controlling the pellet surface moisture between very narrow limits . the width of the control band can be adjusted as can the speed of changes and the cycle time of the readings . the spray nozzles are located , as required , to spray onto the material rolling on the face of the pelletizing disc . more specifically , fig2 b shows a control system for adding liquid to a high intensity mixer based on maintaining constant surface moisture on the pelletizing disc . this system is the same as shown in fig2 a except that the liquid from the modulated control valve discharges directly into a high intensity mixer where each particle is coated with the liquid . the liquid can be water or it can be a slurry containing a uniform amount of solids . the conditioned material is discharged directly onto a pelletizing disc where pellets are formed . this system can operate with all the moisture being added in the mixer or a constant amount of water can be sprayed on the pelletizing disc in addition to a variable amount being added to the mixer . more specifically , fig3 shows a control system for blending high moisture feed with dry powder to produce constant product from the pelletizing disc . this system has the same moisture sensor on the pelletizing disc and the same programmable controller as fig2 a and 2b , however , the 4 - 20 ma . signal from the programmable controller is utilized to control the screw speed on a screw feeder which is driven by a 3 hp electric motor . the speed of the motor is controlled by a pulse width modulated electronic variable frequency drive . the drive is to produce a 20 cycle output with a 4 ma . signal from the programmable controller and 60 cycle output with a 20 ma . signal . the dry powder is discharged into a high intensity mixer to which a feed stream of metal hydroxide filter cake containing 80 % moisture is being added . the conditioned feed from the mixer contains a uniform 40 % moisture which is required for pelletizing . the moisture sensor on the pelletizing disc maintains this moisture even if the filter cake moisture or quantity varies . at times , i have found it advantageous to utilize a high intensity mixer to condition very fine material before placing the material onto the pelletizing disc . i have also found , unexpectedly , that as shown in fig2 a and 2b the output signal from a programmable controller ( computer ) can be utilized to control a control valve to vary the amount of liquid added to this mixer and , in this manner , produce more uniform pellets from the pelletizing disc . the high intensity mixer functions best if of the type shown in my prior patent however , it can be any type of pin or plow mixer . as shown in fig3 a third method of utilizing the signal involves utilizing a high intensity mixer in conjunction with a pelletizing disc to blend a &# 34 ; high &# 34 ; moisture bearing material with a &# 34 ; dry &# 34 ; material to produce a blend which is at the proper moisture for pelletizing . in this situation , it is best to try to provide a constant flow of the &# 34 ; high &# 34 ; moisture material and vary the addition of &# 34 ; dry &# 34 ; powder to produce consistent pellets discharging from the pelletizing disc . the signal from the programmable controller ( computer ) is utilized to control the speed of a feeder which is adding the proportionate &# 34 ; dry &# 34 ; material to the high intensity mixer . while i have illustrated and described several embodiments of my invention , it will be understood that these are by way of illustration only and that various changes and modifications are contemplated in my invention within the scope of the following claims :	6
before explaining at least one embodiment of the invention in detail , it is to be understood that the invention is not limited in its application to the details of construction and the arrangement of the components set forth in the following description or illustrated in the drawing . the invention is capable of other embodiments or of being practiced or carried out in various ways . also , it is to be understood that the phraseology and terminology employed herein is for the purpose of description and should not be regarded as limiting . fig1 a is a schematic illustration of the system according to the present invention . the system 50 includes at least one signal generator 110 operatively connected to a power supply 202 and to a coil 250 . within coil 250 is an annular support 252 , preferably made from a substantially non - conducting material such as plastic . with the power supplied by power supply 202 , the signal generator 110 generates electrical impulses that are passed through coil 250 . as a result , an electromagnetic field is generated within coil 250 , and in the region surrounding coil 250 . a voltage of up to 30 volts is preferably applied . an alternative configuration of coil 250 , wound around support 252 , is provided by way of example in fig1 b . support 252 and coil 250 preferably form a self - supporting or self - standing unit , as shown , inter alia , in fig1 b . upon placing coil 250 in the vicinity of the kidney , the electromagnetic radiation , the pattern of which is determined by the form , frequency , and intensity of the signals provided to the coil , acts upon the kidney and results in the stimulation of the affected area thereof . in a preferred embodiment , shown in fig1 c , coil 250 is designed so as to fit around the torso of a patient . although it is preferable for the skin tissue in the vicinity of the kidney to be substantially enveloped by coil 250 , it is possible to place coil 250 in proximity to skin surface external to the kidney ( i . e ., without enveloping the body ) so as to expose the kidney to the electromagnetic field produced by coil 250 . a schematic wiring diagram of the device of the present invention is provided in fig2 . power supply 202 is equipped with a high voltage line 204 and a low voltage line 206 . low voltage line 206 supplies power to cpu 208 . high voltage line 204 supplies power to capacitor bank 210 , which contains a plurality of capacitors 210 a - n for delivering , upon demand , current to coil 250 so as to produce an electromagnetic field . typically , capacitor bank 210 includes at least ten capacitors . the power is preferably supplied to capacitor bank 210 via resistor 220 , which serves to slow / regulate charging to capacitor bank 210 . the current delivered from capacitor bank 210 can be conducted via line 212 and switch 214 , or via line 216 and switch 218 , to coil 250 . switches 214 and 218 , as well as switches 222 and 224 , are controlled by cpu 208 . inputs to cpu 208 include a signal pulse rate input 234 , a signal level input 236 , both of which can be pre - set or pre - programmed , and a manual input 240 for manually discharging capacitor bank 210 so as to deliver an electrical impulse to coil 250 . also inputting to cpu 208 is a signal from current indicator ( or sampler ) 242 . as shown by way of example , current indicator 242 includes branch point 228 , having a resistor 230 electrically connected to capacitor bank 210 on one side , and a second resistor 232 electrically connected to branch point 228 on the opposite side . current indicator 242 provides feedback to cpu 208 on the amount of current flowing out of capacitor bank 210 in the direction of coil 250 , information that is used by cpu 208 to control the system so as to produce an electromagnetic field having the desired properties . for example , based on the feedback provided by current indicator 242 , cpu 208 operates a switch 244 , disposed on high voltage line 204 , so as to control the charging of capacitor bank 210 . typical electromagnetic waveforms for stimulation of the kidney are presented in fig3 a and 3 b . magnetic flux density is plotted on the y axis , as a function of time . a bi - phasic waveform is provided in fig3 a ; a mono - phasic waveform is provided in fig3 b . the maximum value of the magnetic flux density , m , is 1 - 40 millitesla . more preferably , the maximum value of the magnetic flux density , m , is 5 - 40 millitesla , and most preferably , between 10 and 20 millitesla . the pulse rate is preferably 0 . 05 - 100 pulses per minute . presently , a more preferred pulse rate is 0 . 5 - 30 pulses per minute . the time between pulses , t , is less than 10 seconds , preferably less than 3 seconds . depending on the specific design and configuration of signal generator 110 , the time between pulses may be heavily dependent on the magnitude ( peak ) of the previous pulse . the device and method of the present invention appear to be most effective in treating kidney failure due to trauma . kidney failure due to trauma is acute , and is generally reversible , at least during the initial stages . without wishing to be limited by theory , it is believed that a static charge builds up within the tissues of the kidney , for reasons that are not yet fully understood . this static charge inhibits proper functioning of the kidney . as long as no significant irreversible damage has been caused to the kidney , the kidney can be stimulated into regaining normal performance by clearing the static charge within the tissues of the kidney by application of an electromagnetic field using the device and method of the present invention . a patient suffering from traumatic , acute renal failure was fitted with the device of the present invention , as shown in fig1 c . using the device , an electromagnetic field was produced in the vicinity of the kidneys , the field being characterized by a pulse rate of approximately 1 pulse per minute . samples were taken from the bloodstream of the patient immediately before initiation of the electromagnetic field , immediately following the administering of the electromagnetic pulses , and about 10 hours thereafter . the results of the blood sampling are provided in table 1 , and are presented graphically in fig4 . the concentrations of urea and creatinine in the bloodstream are known indicators of kidney performance . whereas the concentrations of other substances in the blood — glucose , potassium , sodium , and chloride , remain essentially constant , it is evident that an appreciable decrease in the urea and creatinine levels in the bloodstream has been achieved . within 20 minutes , the urea and creatinine levels decreased by about 20 %. after 10 hours , and without additional electromagnetic applications , the urea and creatinine levels decreased by an additional 10 %, indicating that the kidneys continue to regain performance well after the electromagnetic application has been terminated . although the invention has been described in conjunction with specific embodiments thereof , it is evident that many alternatives , modifications and variations ill be apparent to those skilled in the art . accordingly , it is intended to embrace all such alternatives , modifications and variations that fall within the spirit and broad scope of the appended claims . all publications , patents and patent applications mentioned in this specification are herein incorporated in their entirety by reference into the specification , to the same extent as if each individual publication , patent or patent application was specifically and individually indicated to be incorporated herein by reference . in addition , citation or identification of any reference in this application shall not be construed as an admission that such reference is available as prior art to the present invention .	0
the ensuing description provides preferred exemplary embodiment ( s ) only , and is not intended to limit the scope , applicability or configuration of the disclosure . rather , the ensuing description of the preferred exemplary embodiment ( s ) will provide those skilled in the art with an enabling description for implementing a preferred exemplary embodiment . it is understood that various changes may be made in the function and arrangement of elements without departing from the spirit and scope as set forth in the appended claims . electronic image data is the backbone of many modern engineering and entertainment applications . in these different applications , different features and image attributes are desired . for example , in engineering design applications , volumes of data and image detail are desired so that planned products can be completely designed , and so that different analysis of those products can be performed . however , this level of detail can be detrimental in other applications and the amounts of data required in a complex model can result in slower processing times and can make a model more cumbersome to work with . in such situations , as well as in other situations , it can be advantageous if the level of detail of a model or of image data can be controlled by allowing a user to remove portions of the image data and replace those removed portions with one or several surfaces . image data , also referred to herein as electronic image data , can be any data that forms an image can be received or generated . in some embodiments , image data can be formed by a scanner such as , for example , an object scanner including a 3d object scanner . this image data can be generated by the placement of an object , and specifically of a tangible object so as to be scannable by the scanner , and scanning the tangible object with the scanner . this image data output by the scanner can comprise a plurality of points located in space . in some embodiments , each of these points can correspond to a location of the tangible object as detected by the scanner . in some embodiments , these points can be linked , and in some embodiments , these points can be unlinked . fig1 depicts one embodiment of image data 100 that can be generated by a scanned image . as seen in fig1 , the image data 100 depicts a rabbit , and the image data comprises a plurality of points 102 that together define the surface of the rabbit . in fig1 , these points 102 are linked together by edges in groups of threes to form a plurality of triangles or triangular polygons or triangular surfaces 104 . with the image data received and / or generated , one of several embodiments can be used to remove portions of the image data and replace those removed portions . a first embodiment is depicted in the process 200 for generating and displaying simplified image data in fig2 . each of the steps of the process 200 and other steps of methods described herein may be performed by a system in response to an indication from a user . in some embodiments , a single indication causes the system to automatically perform one or more of the steps . the process 200 begins at block 201 , wherein the image data is received . in some embodiments , the image data can be received from , memory and in some embodiments , the image data can be received form the scanner . after the image data has been received , the process 200 proceeds to block 202 , wherein a selection of a cutting portion is received . in some embodiments , the cutting portion can identify one or several portions of the image data and / or features in the image data for removal from the image data . in some embodiments , the cutting portion can be selected by the user through a variety of methods including , for example , through the use of a selection tool and a mouse , trackpad , or the like . after the cutting portion has been received , the process 200 proceeds to block 20 , wherein the cutting portion is removed from the image data . in some embodiments , the cutting portion can be removed from the image data by identifying the portions of the image data , such as , for example , the nodes , edges , and / or surfaces within the cutting portion , and deleting those identified portions of the image data . in some embodiments , the removal of the cutting portion for the image data can create a hole 302 in a portion of the image data 300 as depicted in fig3 . after the cutting portion has been removed , the process 200 proceeds to block 206 , wherein the hole boundary is identified . as seen in fig3 , the hole 302 is surrounded by a plurality of cells 306 and the hole is defined by a boundary 308 . in some embodiments , the hole boundary is defined by the one or several nodes , edges , and / or surfaces that are directly adjacent to the hole . in some embodiments , the identification of the hole boundary can further include the determination of one or several attributes of the image data at the hole boundary . these one or several attributes can include , for example , attributes of the surface of the image data and the hole boundary including , for example , an integral of the surface at one or several points along all or portions of the hole boundary . in some embodiments , this integral can be , for example , at least one of the first , second , and third integrals at one or several points along the hole boundary . after the hole boundary has been identified , the process 200 proceeds to block 208 , wherein a fill surface is generated . in some embodiments , the fill surface can be a surface that can be placed over the hole and used to locate one a patch in the image data , which patch covers or fills the hole . after the fill surface has been generated , the process 200 proceeds to block 210 , wherein the fill surface is fit to the hole boundary . in some embodiments , this can include defining one or several boundaries of the fill surface to match the hole boundary . in some embodiments , this can further include matching one or several attributes of the fill surface to match one or several attributes of the hole boundary such as the integral of the hole boundary at one or several points along all or portions of the hole boundary or at one or several points adjacent or near the boundary . in some embodiments , this matching can eliminate discontinuities between the image data and the fill surface . in some embodiments , for example , the fill surface can be , g1 , g2 , and / or g3 continuous with the image data at all or portions of the hole boundary . after the fill surface has been fit to the hole boundary , the process 200 proceeds to block 212 , wherein a patch is applied to the fill surface , such that geometries of the patch match or lie on the fill surface . by applying the patch to the fill surface , the patch may have the same size and / or shape as the fill surface . advantageously , this can result in the patch being at least one of g1 , g2 , and g3 continuous with the image data along all or portions of the hole boundary . after the patch has been applied to the fill surface , the process 200 proceeds to block 214 , wherein the image data is re - meshed . in some embodiments , this re - meshing of the image data can include the retopologizing of the image data . this re - meshing of the image data , including the patch can result in the integration of the patch data into the re - meshed image data . in some embodiments , this re - meshing can further improve the quality of the image data by decreasing the number of points , nodes , vertices , edges , and / or surfaces in the image data . after the image data and the patch have been re - meshed , the process 200 proceeds to block 216 , wherein the image data is edited . in some embodiments , this editing of the image data can include changing an attribute of one or several of the nodes , edges , and / or surfaces , which attributes can include , for example , a location , shape , length , size , or the like . in some embodiments , the image data can be edited based on one or several inputs received from the user . after the image data has been edited , the process 200 proceeds to block 218 , wherein the image data is smoothed . in some embodiments , the image data can be smoothed via the application of one or several smoothing algorithms to the image data . these one or several smoothing algorithms can include , for example , a catmull - clark subdivision algorithm . after the image data has been smoothed , the process 200 proceeds to block 220 , wherein the image data , which is now simplified via the removal of the cutting portion , is displayed or otherwise provided to the user , and / or stored in an electronic memory . in some embodiments the simplified image data can be displayed to the user on one or several displays , screens , monitors , or the like . in some embodiments , the patch can comprise mesh data corresponding to the mesh of the image data , and thus , in some embodiments in which the image data comprises a triangular mesh as depicted in fig1 , the patch can comprise a triangular mesh . similarly , in some embodiments in which the image data comprises a polygonal quad - mesh , the patch can comprise a polygonal quad - mesh . further , in some embodiments , the size of the mesh can be configured to correspond to the size of the mesh of the image data . in some embodiments , the image data 100 includes an error produced in the scanning process , where the error includes a missing portion of the image data 100 . such an error may be similar to the hole 302 of fig3 . steps 206 through 220 may be performed on the image data 100 so as to effectively fix the error in the scanned image data 100 . with reference now to fig4 , a flowchart illustrating one embodiment of a process 400 for simplifying retopologized data is shown . the process begins at block 402 , wherein image data is received , as discussed above in step 201 of fig2 , and wherein the image data is retopologized or re - meshed . in some embodiments , after scanning the particular object , the data of the scan is retopologized to generate re - meshed image data , also referred to herein as a data mesh . retopologizing may be performed , for example , to convert polygonal data of a less desirable constitution to a more preferred state . for example , data having many small triangular faces , such as a scanned mesh generated by the scanner may be retopologized to create a data mesh having significantly fewer quadrilateral faces . brep data , subdivided data , a triangular mesh , volumetric representation data , quad - tree data , oct - tree data , or other data may also be preferably retopologized to generate the reference geometry , or a scan mesh . in some embodiments of the process of retopologizing , the process includes one or more aspects or features of the retopologizing processes discussed in u . s . application ser . no . 13 / 447 , 111 , filed apr . 13 , 2012 , which is incorporated herein by reference for all purposes . after the image data has been received and retopologized , the process proceeds to block 404 , wherein steps 202 to 212 of fig2 are performed as described above but on the data mesh . after the completion of steps 202 - 212 , the process 400 proceeds to block 406 , wherein one or several boundary errors are identified . a process 500 for identifying one or several boundary errors is shown in fig5 . this process 500 can be performed as part of block 406 . the process 500 begins at block 502 , wherein a cell 306 is selected . in some embodiments the cell can be located along the boundary of the hole on the image data side or on the patch side . in some embodiments , the selected cell is a cell that has not been previously evaluated for boundary errors . after the cell has been selected , the process 500 proceeds to decision block 504 , wherein it is determined if the selected cell overlaps other cells as is depicted in image ( a ) of fig6 . image ( a ) of fig6 , a first cell 602 including a first node 604 , a second node 606 , and a first edge 608 overlaps a second cell 612 including a first node 614 , a second node 616 , and a first edge 618 so as to create an overlap region 610 . if it is determined that the selected cell overlaps a second cell , then the process 500 proceeds to block 506 and the overlap is marked . in some embodiments , the marking of the overlap can include associating a value indicative of the overlap with the selected cell . after the overlap has been marked , or returning again to decision block 504 , if it is determined that the cell does not overlap other cells , the process 500 proceeds to decision block 508 , wherein it is determine if the selected cell violates any shape constraints . in some embodiments , for example , the connection of the patch to the image data can result in the creation of one or several abnormally shaped cells . such abnormally shaped cells are depicted in image ( a ) of fig7 , and particularly , image ( a ) of fig7 depicts a first cell 702 that is approximately square shaped , a second cell 704 that is less square shaped than the first cell 702 , a third cell 706 that is less square shaped than the second cell 704 , and a fourth cell 708 that is less square shaped than the third cell 706 . as seen in this image , due to the curvature of the hole boundary 308 , the cells 702 - 708 become progressively less square shaped . in some embodiments , the shape constraint can comprise one or several threshold value that can define between acceptably shaped cells and unacceptably shaped cells . these thresholds can relate to , for example , one or several angles , either internal or external , between edges of one cell , relative length or position of one edge of one cell with respect to one or several other edges of that one cell , or the like . in one embodiment , for example , the first , second , and third cells 702 , 704 , 706 may comply with the shape constraints , and the fourth cell 708 may violate the shape constraint . if it is determined that the selected cell does not meet the shape constraints , then the process 500 proceeds to block 510 , wherein the selected cell is marked as violating the shape constraints . in some embodiments , the marking of the overlap can include associating a value indicative of the overlap with the selected cell . after the selected cell has been marked , or returning again to decision block 508 , if it is determined that the cell does not violate the shape constraints , then the process 500 proceeds to decision block 512 , wherein it is determined if there are additional cells for evaluating . if it is determined that there are additional , unevaluated cells , then the process 500 returns to block 502 , and proceeds as outlined above . if it is determined that there are no additional cells , then the process 500 proceeds to block 514 , and continues with block 408 of fig4 . returning again to fig4 , after the one or several boundary errors are identified , the process 400 proceeds to block 408 , wherein the identified boundary errors are resolved . in the event that an overlap error is identified , the resolution of the boundary errors occurs as depicted in image ( b ) of fig6 . as seen in this image , the first node 604 of the first cell is consolidated with the first node 614 of the second cell 612 in new first node 630 , the second node 606 of the first cell 604 is consolidated with the second node 616 of the second cell 612 in new second node 632 , and the first edge 608 of the first cell 602 is consolidated with the first edge 618 of the second cell 612 in new first edge 634 . in some embodiments , this consolidation can include the movement of one or more of one or both of the first nodes 604 , 614 , the second nodes 606 , 616 , and the first edges 608 , 618 . in the event that a shape error is identified , the resolution of the boundary errors occurs as depicted in image ( b ) of fig7 . as seen in image ( a ) of fig7 , the fourth cell 708 is formed by a first node 732 , a second node 734 , a third node 736 , and a fourth node 738 . the fourth cell is further adjacent to a fifth node 740 , which is outside of the fourth cell 708 . in some embodiments , a failure of a cell to meet shape constraints can be remedied by increasing the number of nodes within the marked cell by at least one . specifically , as shown in image ( b ) of fig7 , the fourth cell 708 is redrawn to include the fifth node 740 , thereby forming a cell having five nodes and five edges , which redrawn fourth cell 708 complies with the shape constraints . after the boundary errors have been resolved , the process 500 proceeds to block 410 , and continues with steps 214 - 220 as discussed above and as depicted in fig2 . with reference now to fig8 , a flowchart illustrating one embodiment of a process 800 for simplifying retopologized data with paving is shown . the process begins at block 402 , wherein image data is received and retopologized or re - meshed as discussed above with respect to block 402 of fig4 . after the image data is received and retopologized or re - meshed , the process 800 proceeds to block 802 , wherein steps 202 to 210 of fig2 are performed as described above but on the data mesh . after the completion of steps 202 - 210 , the process 800 proceeds to block 804 , wherein the fill surface is paved via the placement of points on the fill surface to create a mesh . in some embodiments , these points can be placed to create a mesh comparable to the mesh of the image data in that , for example , the cells created via paving have approximately the same size , shape , number of nodes and / or edges , or the like . in some embodiments , paving can include identifying one or several existing nodes and / or edges and generating further nodes to connect with the one or several existing nodes to form one or several new cells . in some embodiments , these one or several nodes can be serially , one - after - another , created , and in other embodiments , at least some of these one or several nodes can be created in parallel . after the paving has been completed , or while the paving is being performed as part of determining the placement of the one or several created nodes , the process 800 proceeds to block 406 and 408 , wherein boundary errors are identified and resolved . these steps 406 , 408 can be performed as discussed above with respect to fig4 - 7 . in some embodiments , boundary errors are identified and resolved as part of the paving process . for example , after the paving process places each new node or other geometry , it can determine that a boundary error has been generated by the placement , and resolve the boundary error as discussed above before placing a next node or other geometry . after the boundary errors have been resolved , the process 800 proceeds to block 410 , and continues with steps 214 - 220 as discussed above and as depicted in fig2 . with reference now to fig9 , a configuration for a computer system 910 constructed in accordance with the present disclosure to perform the operations disclosed herein is shown . the computer system 910 can be linked to a scanner 980 , for example , via network 902 . the computer system 910 can comprise a system such as a personal computer or server computer or the like . the computer system 910 may include a network communication interface 912 that permits communications with the network 902 . the network interface can comprise a network interface card ( nic ). the computer system 910 can execute instructions to provide a computer system which performs various aspects and principles of the methods and features described herein . for example , each of the components of fig1 - 6 may be implemented by one or more of the computer systems 910 . the computer system 910 includes a central processor unit 916 ( cpu ) and a program product reader 918 for receiving a program product media and reading program instructions recorded thereon , where the instructions , when executed by the computer cause the computer to perform various aspects and principles of the methods and features described herein . the computer system also includes associated memory 920 and input / output facilities 922 , such as a display for output and a keyboard and / or mouse for input . the processor 916 of the computer system 910 can receive program instructions into the program memory of the processor . the program instructions can be received directly , such as by flashing eeprom of the processor , or can be received through the network interface 912 , such as by download from a connected device or over a wan or lan network communication . if desired , the program instructions can be stored on a computer program product 914 that is read by the computer system 910 so that the program instructions can thereafter executed . that is , the program product 914 is for use in a system such as the computer system 910 , wherein the program product comprises a tangible , non - transitory recordable media containing a program of computer - readable instructions that are executable by the device processor 904 to perform the operations described herein . the program product 914 can comprise , for example , optical program media such as cd or dvd data discs , or flash memory drives , or external memory stores , or floppy magnetic disks , and the like . a number of variations and modifications of the disclosed embodiments can also be used . specific details are given in the above description to provide a thorough understanding of the embodiments . however , it is understood that the embodiments may be practiced without these specific details . for example , well - known circuits , processes , algorithms , structures , and techniques may be shown without unnecessary detail in order to avoid obscuring the embodiments . implementation of the techniques , blocks , steps and means described above may be done in various ways . for example , these techniques , blocks , steps and means may be implemented in hardware , software , or a combination thereof . for a hardware implementation , the processing units may be implemented within one or more application specific integrated circuits ( asics ), digital signal processors ( dsps ), digital signal processing devices ( dspds ), programmable logic devices ( plds ), field programmable gate arrays ( fpgas ), processors , controllers , micro - controllers , microprocessors , other electronic units designed to perform the functions described above , and / or a combination thereof . also , it is noted that the embodiments may be described as a process which is depicted as a flowchart , a flow diagram , a swim diagram , a data flow diagram , a structure diagram , or a block diagram . although a depiction may describe the operations as a sequential process , many of the operations can be performed in parallel or concurrently . in addition , the order of the operations may be re - arranged . a process is terminated when its operations are completed , but could have additional steps not included in the figure . a process may correspond to a method , a function , a procedure , a subroutine , a subprogram , etc . when a process corresponds to a function , its termination corresponds to a return of the function to the calling function or the main function . furthermore , embodiments may be implemented by hardware , software , scripting languages , firmware , middleware , microcode , hardware description languages , and / or any combination thereof . when implemented in software , firmware , middleware , scripting language , and / or microcode , the program code or code segments to perform the necessary tasks may be stored in a machine readable medium such as a storage medium . a code segment or machine - executable instruction may represent a procedure , a function , a subprogram , a program , a routine , a subroutine , a module , a software package , a script , a class , or any combination of instructions , data structures , and / or program statements . a code segment may be coupled to another code segment or a hardware circuit by passing and / or receiving information , data , arguments , parameters , and / or memory contents . information , arguments , parameters , data , etc . may be passed , forwarded , or transmitted via any suitable means including memory sharing , message passing , token passing , network transmission , etc . for a firmware and / or software implementation , the methodologies may be implemented with modules ( e . g ., procedures , functions , and so on ) that perform the functions described herein . any machine - readable medium tangibly embodying instructions may be used in implementing the methodologies described herein . for example , software codes may be stored in a memory . memory may be implemented within the processor or external to the processor . as used herein the term “ memory ” refers to any type of long term , short term , volatile , nonvolatile , or other storage medium and is not to be limited to any particular type of memory or number of memories , or type of media upon which memory is stored . moreover , as disclosed herein , the term “ storage medium ” may represent one or more memories for storing data , including read only memory ( rom ), random access memory ( ram ), magnetic ram , core memory , magnetic disk storage mediums , optical storage mediums , flash memory devices and / or other machine readable mediums for storing information . the term “ machine - readable medium ” includes , but is not limited to portable or fixed storage devices , optical storage devices , and / or various other storage mediums capable of storing that contain or carry instruction ( s ) and / or data . while the principles of the disclosure have been described above in connection with specific apparatuses and methods , it is to be clearly understood that this description is made only by way of example and not as limitation on the scope of the disclosure .	7
the system , which is merely shown in a schematic and simplified form in fig1 , for homogenizing or emulsifying a product first of all includes a boiler 1 in a vertical orientation , which is provided with a stirrer 4 driven by a stirrer motor 2 , the rotational axis of the stirrer being the same as the vertical longitudinal axis of the boiler in this example . a pump 8 as the pump means in accordance with the invention is disposed beneath a boiler floor 6 , communicating via a conduit 10 with an homogenizer 12 , which forms the homogenization means of the invention . the pump 8 and the homogenizer 12 are in each case driven by drive motors 14 , 16 , which can be controlled ( open or closed loop ) independently of one another , the open or closed loop control being effected by a control unit 18 . on the input side , the control unit 18 is connected to measuring sensors , which are indicated by 20 and which may be pressure , temperature , particle size and / or flow quantity sensors ; these sensors may be disposed , as shown , between the pump 8 and the homogenizer 12 and additionally , where appropriate , in other locations in the system , such as downstream of the homogenizer and in the boiler . in addition , the control unit 18 receives input signals in the form of constant process settings and , where applicable , current user interventions in a manner known per se . the signal lines are indicated by dashed lines in fig1 . between the pump 8 and the homogenizer 12 , an inlet and / or outlet line 22 , which can be opened or closed with a valve 24 , branches off from the conduit 10 . the line 22 , for its part , is connected to a connection 26 with an inlet / outlet fitting ( not shown ), which can be used to withdraw sample quantities from the on - going process for example , or to introduce liquid or solid additives into the process . furthermore , the line 22 is connected to a heat exchanger 28 , so that , in the manner of a parallel circuit , a by - pass branch is formed around the homogenizer 12 , which leads via a line 30 and a fitting 32 and ends in an output line 34 of the homogenizer 12 . connected to the fitting 32 , which may , for example , be a three - way valve or a multi - way valve , is a lower return line 36 , which ends in a lower portion of the boiler 1 , and / or ( in this case , both are shown ) an upper return line 38 , which ends in an upper portion of the boiler 1 . a cleaning line 40 follows the upper return line 38 , possibly via further valves , and is connected to a cleaning sprinkler head 39 in order to perform “ cleaning in place ” ( cip ), in which a washing liquid , which is usually low - viscosity and is often aqueous , is used , and which is circulated with the pump 8 while the homogenizer 12 is running at a moderate speed or is standing still . if the homogenizer is standing still , it offers a great deal of resistance , so that the cleaning could then be performed in the by - pass . however , the homogenizer itself also has to be cleaned , and in that case it is preferred that the homogenizer should run at a moderate speed , so that it does not cause any noticeable loss of pressure or even a slight increase in pressure . it is advantageous here that , unlike the systems used in the past , no cavitation can occur in the homogenizer at elevated washing temperatures with absolute pressures close to the vapour pressure . the single arrows in the lines in fig1 indicate the direction of flow in normal operation , while the double arrow 42 indicates the infeed or removal via the connection 26 , and the double arrow 44 in line 30 and the arrow 46 point to a possible removal via the fitting 32 . depending on the operating mode , the pump 8 performs different tasks and can ideally process both products with very high viscosities and high solids contents and also products with very low viscosities , e . g . aqueous solutions . in principle , any type of pump construction is conceivable , positive - displacement pumps such as reciprocating pumps being less suitable , whereas centrifugal pumps , on the other hand , are particularly advantageous . in the design of centrifugal pump which is considered in detail in the following , the geometry of the pump impeller is preferably selected such that a moderate build - up of pressure with , for example , a maximum of 5 bar is possible . the volume flow to be delivered then corresponds to the operating mode concerned . when homogenizing more highly viscous substances , the maximum volume flow of the pump corresponds to the maximum volume flow to be processed by the homogenizer , while the pressure and volume flow during cleaning ( cip ) with a low - viscosity washing liquid corresponds to the ideal characteristic curve of the cip nozzles mounted in the cleaning head . in the context of the invention , centrifugal pumps according to the radial pump principle with central axial intake and a pump impeller geometry that allows for high to very high viscosities are particularly suitable . another reason why a radial pump is particularly suitable is that it makes it possible to allow products through at low speeds with little loss of pressure , i . e . it is “ permeable ” in the broadest sense of the word . in addition , a pump which is advantageous in the context of the invention stands out because , compared to the homogenizer , it leads to a minor shearing action of the product , i . e . it is low - shear in the broadest sense of the word . in the case of an arrangement immediately beneath the boiler floor 6 , as illustrated in fig1 , a large cross - section is available for the intake , and hardly any loss of pressure in the feed line to the pump . it is appropriate for additives in powder or liquid form to be delivered not into the pump inlet , but rather , as shown in fig1 , downstream of the pump and upstream of the homogenizer , so that the pressure loss in the intake orifice of the pump is reduced . in the event of faults in aspirating powders , this is able to prevent a powder blow - out ( backflow ) directly into the boiler , since the pump acts as a barrier to some extent . depending on the operating mode of the system , different local pressures or pressure curves are appropriate , which are illustrated by way of example in the following table . in the boiler downstream of the pump downstream of the operating mode ( upstream of the pump ) ( upstream of the homogenizer ) homogenizer maximum shear input 0 . 5 to 1 2 to 4 0 . 8 to 2 ( medium speed ) ( pressure loss line ) high shear input 0 . 2 to 0 . 5 to 1 3 to 5 0 . 6 to 1 . 5 ( very high speed ) ( pressure loss line ) aspiration 0 . 2 to 0 . 5 0 . 2 to 0 . 5 0 . 6 to 0 . 8 ( low speed ) ( pressure loss line ) cold - hot 0 . 2 to 0 . 5 0 . 2 to 0 . 5 0 . 6 to 0 . 8 ( very low speed ) ( high speed ) low shear input 1 ( atmospheric ) 2 to 3 1 ( atmospheric ) ( medium speed ) homog . standing still removal upstream of 1 ( atmospheric ) 2 to 5 1 to 2 ( atmospheric ) homog . ( very high speed ) homog . standing still by - pass via heat exchanger cip 1 ( atmospheric ) 3 to 5 3 to 5 ( characteristic curve cip ( characteristic curve nozzles ) cip nozzles ) the separate arrangement and the separate drive of the pump and the homogenizer leads , in accordance with the invention , to the advantage both that the maximum inputs of shear energy in the homogenizer are possible , without there being any risk of cavitation , since the pump can provide the necessary pressure , and that the lowest inputs of shear energy are caused , e . g . when removing shear - sensitive goods , because the pump includes a favorably shaped impeller which is designed to achieve the optimum increase in pressure with the lowest possible input of shear energy . in addition , solids and liquids can be introduced directly into the rotor - stator system , such as via the valve 24 between the pump and the homogenizer , and the same connection can also be used for removal purposes . depending on the situation in which it is being used , the homogenizer may or may not include a pump impeller stage upstream or downstream . in this way , the rotor can have a simple design if required . when feeding in additives via the fitting 24 , it may be appropriate for the pump to work at low speed and in effect merely to counterbalance the pressure loss of the pump , so that essentially the same absolute pressure exists in the boiler both upstream and downstream of the pump , which as a rule will be a technical vacuum ( such as 200 to 400 mbar ), so that this partial vacuum is also present at the valve 24 and can be used for aspiration .	1
the invention relates to semiconductor devices and methods of manufacture and , more particularly , to improved field effect transistors ( fets ) and methods of manufacturing the field effect transistors ( fets ). more specifically , the present invention is directed to methods of fabricating memory elements and more specifically zram ( zero - capacitor ram ). the devices of the present invention have enhanced body capacitance , e . g ., high capacitance from the body to other elements of the cell structure , to improve storage capacity , as well as high signal and low vt scatter . more specifically , the present invention includes a compact high - capacitance zram cell that allows a bipolar read without requiring avalanche for a large signal , as well as a finfet structure which both increases the storage capacitance and reduces the vt scatter while maintaining high density . the present invention provides several different devices , each advantageously providing a low - cost , high signal - to - noise ratio memory . for example , the devices of the present invention include : ( i ) a finfet with a storage dielectric , ( ii ) an inverted t - shaped inverter with a vertical fin region which is either fully or partially depleted , ( iii ) a segmented finfet , ( iv ) a finfet with an asymmetric charge distribution and ( v ) a finfet with an asymmetrical gate structure . fig1 - 5 show structures and methods of fabricating a device in accordance with aspects of the invention . in particular , fig1 - 5 show methods of manufacturing a semiconductor device ( finfet ) having a storage dielectric to enhance body capacitance . the finfet can be a zram ( zero - capacitor ram ) that provides a low - cost , high signal - to - noise ratio memory . in embodiments , the semiconductor device comprises , for example , a fin body with a gate dielectric on two sides of the fin body . a gate electrode is adjacent two sides of the fin body and separated from the fin body by the gate dielectric . a storage dielectric is formed remote from the gate electrode , and a storage electrode is adjacent two sides of the gate electrode and separated from the gate electrode by the storage dielectric . in embodiments , the storage electrode is electrically connected to the fin body on a top of the fin body . more specifically , fig1 shows a wafer 5 in accordance with the invention . the wafer 5 comprises a substrate carrier 10 , a buried oxide layer 12 and an active silicon layer 14 . the substrate carrier 10 can be , for example , silicon or any other known materials used for a substrate carrier . a hard mask 16 is formed on the active silicon layer 14 . the hard mask 16 can be , for example , sio 2 or si 3 n 4 . as shown in fig2 , the active silicon layer 14 and hard mask 16 are patterned using a conventional etching process such as , for example , reactive ion etching ( rie ). the conventional etching process includes , for example , a resist ( not shown ) formed on the hard mask 16 which is exposed to light to form openings . thereafter , patterns 18 are etched into the active silicon layer 14 and hard mask 16 using a conventional etchant . the patterning exposes portions of the buried oxide layer 12 , and defines one or more fin bodies 38 . fig3 represents several additional fabrication processes in accordance with aspects of the invention . by way of example , a gate electric 20 is formed over the patterned structure ( e . g ., fin body 38 formed from the patterned active silicon layer 14 and hard mask 16 ) and exposed portions of the buried oxide layer 12 . the gate dielectric 20 can be , for example , a high - k dielectric formed by a conventional deposition process . the gate dielectric 20 can range in thickness from about 8 å to 55 å , although other dimensions are also contemplated by the present invention . the gate dielectric 20 can also be a thermally grown oxide , silicon oxynitride or other gate dielectric material . these same properties can be common throughout all aspects of the invention . still referring to fig3 , a gate electrode 22 is formed on the gate dielectric 20 . the gate electrode 22 may be about 5 nm to 10 nm in thickness , although other dimensions are also contemplated by the present invention . the gate electrode 22 can be , for example , tin or tan with al to adjust the work function , or other metals or alloys known to be used for a gate electrode . these same properties can be common throughout all aspects of the invention . a storage dielectric 24 is formed on the gate electrode 22 . the storage dielectric 24 is a high quality dielectric material such as , for example , oxide . fig4 represents several additional fabrication processes in accordance with aspects of the invention . more specifically , a storage electrode 26 is formed on the storage dielectric 24 . the storage electrode 26 can be formed by a conformal deposition process to a thickness of about 5 nm to 10 nm in thickness ; although other dimensions are also contemplated by the present invention . the storage electrode 26 can be , for example , tin or other metals or alloys . the storage electrode 26 can be patterned using a conventional patterning process such as , for example , rie . after patterning , an insulating material 28 is deposited in the patterned regions , e . g ., between the fin bodies 38 . the insulating layer 28 can be , for example , silicon dioxide , although other materials are also contemplated by the present invention such as , for example , low - k dielectrics such as fluorinated sio 2 . the insulating material 28 and exposed portions of the storage electrode 26 may be planarized using , for example , a chemical mechanical polish ( cmp ). openings 32 are patterned into the fin body 38 , e . g ., gate structures 30 . more specifically , the openings 32 are patterned through the storage electrode 26 , storage dielectric 24 , gate electrode 22 , gate dielectric 20 and portions of the hard mask 16 , to expose , for example , the active silicon layer 14 of the fin body 38 . in fig5 , an insulator layer 34 is deposited on the sidewalls of the openings 32 . the insulator layer 34 can be a high - k dielectric material , although other insulating materials are also contemplated by the present invention such as , for example , sin . in embodiments , the insulator layer 34 may be different than the storage dielectric 24 and is preferably selected for its insulative and conformal properties . in embodiments , the insulator layer 34 is contemplated to be different than the storage dielectric 24 so that etching processes of the insulator layer 34 will not affect the storage dielectric 24 ( or vice versa ). a gate contact 36 is deposited in the openings 32 , contacting the active silicon layer 14 and the insulator layer 34 previously deposited on the sidewalls of the openings 32 . the gate contact 36 can be , for example , tin , tungsten or other metals or alloys known to be used for contacts . in embodiments , the gate contact 36 can also be a doped poly . fig6 - 11 show structures and methods of fabricating a device in accordance with other aspects of the invention . fig6 - 11 can represent methods of manufacturing a finfet ( zram ) that provides a low - cost , high signal - to - noise ratio memory . in embodiments , the finfet comprises , for example , an inverted - t - shaped semiconductor structure comprising a planar region doped to have at least a region which is electrically neutral and conducting , and a vertical fin region which is either fully or partially depleted . in embodiments , the gate structure covers the planar region and the vertical fin region . the gate structure further comprises an insulating dielectric in contact with the planar and vertical fin regions , and a conducting gate electrode in contact with the insulating dielectric . the insulating dielectric electrically insulates the semiconductor structure from the gate electrode . more specifically , fig6 shows a wafer 5 comprising a substrate carrier 10 , a buried oxide 12 and an active silicon layer 14 . the substrate carrier 10 can be , for example , silicon or any other known conventional carrier . a hard mask 16 is formed on the active silicon layer 14 . the hard mask 16 can be , for example , sio 2 or si 3 n 4 . as shown in fig7 , the active silicon layer 14 and hard mask 16 are patterned using a conventional etching process such as , for example , reactive ion etching ( rie ). in embodiments , the active silicon layer 14 is only partially etched to form one or more fin bodies 38 with a lower , planar portion 38 a . the lower , planar portion 38 a can act as a planar storage area beneath the fin body , self - aligned to the wordline . in fig8 , spacers 40 are formed on the lower , planar portion 38 a formed from the active silicon layer 14 , as well as on the sides of the fin body 38 . the spacers 40 can be formed using conventional conformal deposition processes . in embodiments , the spacers 40 can be a nitride material ( e . g ., si 3 n 4 ), although other materials are also contemplated by the present invention . after the formation of the spacers 40 , the exposed active silicon layer 14 ( e . g ., exposed portions of the planar region 38 a ) can be removed using conventional lithographic and etching processes , known to those of skill in the art . the etching process forms an inverted t fin body , with openings 42 formed therebetween ( which exposes portions of the buried oxide layer 12 ). in fig9 , the spacers are removed and a vertical ion implantation is performed on the active silicon layer ( e . g ., planar portion 38 a of the inverted t fin body ). the vertical ion implantation process can use p - type dopants such as , for example , boron , bf 2 , b 10 or other known p - type dopants . in embodiments , the hardmask 16 will protect the fin body 38 from the dopants . in embodiments , the dopants are activated by annealing at a high temperature , e . g ., approximately 1000 ° c . for about 1 second . as shown in fig1 , a dielectric material 20 can be deposited over ( about ) the fin body 38 and on the heavily doped planar portion 38 a of the inverted t fin body and exposed buried oxide layer 12 . in embodiments , the dielectric material 20 can be , for example , sio 2 , or high - k material such as , for example , hfsio 4 or hfo 2 , amongst other high - k materials . a gate electrode 43 is deposited on the dielectric material 20 . fig1 shows a cross sectional view of the device of fig1 , along line a - a . in embodiments , the gate electrode 43 may be planarized and patterned to form a gate “ g ”. as shown in fig1 , the patterning of the gate electrode 43 can expose portions of the underlying buried oxide layer 12 . in further embodiments , an isotropic etching process can remove a portion of the doped region under the fin body 38 . fig1 - 15 show structures and methods of fabricating a device in accordance with other aspects of the invention . in particular , fig1 - 15 show methods of manufacturing a segmented finfet device with enhanced body capacitance . the segmented finfet includes a lower portion of the gated body with a heavily doped region resulting in a high body - to - gate capacitance , i . e ., the heavily doped lower portion of the fin body adds storage capacity . in embodiments , the upper portion of the fin body is largely undoped to provide low vt - scatter values . the fully depleted undoped channel minimizes vt scatter , which is beneficial for array yield . the source / drain in the upper region of the fin body , adjacent to the low - doped regions of the body , offers low leakage to the p - doped fin body region for improved retention time and yield . in embodiments , the gate structure covers the upper and lower portions of the fin body , where a portion of the fin body is not covered by the gate structure . more specifically , fig1 shows a wafer 5 comprising a substrate carrier 10 , a buried oxide 12 and an active silicon layer 14 . the substrate carrier 10 can be , for example , silicon or any other known conventional carrier . a hard mask 16 is formed on the active silicon layer 14 . the hard mask 16 can be , for example , sio 2 or si 3 n 4 . as shown in fig1 , the active silicon layer 14 and hard mask 16 are patterned using a conventional etching process such as , for example , reactive ion etching ( rie ), to form one or more fin bodies 38 . in embodiments , the unprotected regions of the active silicon layer 14 are completely etched to expose the underlying buried oxide layer 12 . a borosilicate glass 44 is deposited on the buried oxide layer 12 , surrounding the fin body 38 . the borosilicate glass 44 is partially etched to expose an upper portion of the fin body 38 . the borosilicate glass 44 is then subjected to an annealing process , e . g ., about 500 ° c ., which out diffuses boron into the adjacent portion ( e . g ., lower portion 41 ) of the fin body 38 . in fig1 , the borosilicate glass is removed by a selective etch process . a dielectric layer 20 is deposited on the fin body 38 and buried oxide layer 12 . in embodiments , the dielectric material 20 can be , for example , sio 2 , or high - k material such as , for example , hfsio 4 or hfo 2 , amongst other high - k materials . a gate electrode 43 is then deposited on the dielectric material 20 . fig1 is a cross sectional view of fig1 , along line b - b . as shown in fig1 , in embodiments , the gate electrode 43 can be planarized and patterned to form the gate “ g ”. in embodiments , the patterning of the gate electrode 43 can expose portions of the underlying buried oxide layer 12 . in embodiments , an upper portion of the fin body 38 is subjected to an ion implantation to form the source ( s ) and drain ( d ) regions . fig1 - 18 show structures and methods of fabricating a device in accordance with aspects of the invention , starting with the structure shown in fig1 . more specifically , the semiconductor device fabricated using the methods of fig1 - 18 includes selective removal of the active silicon layer 14 below the source and drain regions . as shown in fig1 , for example , a silicon dioxide layer 46 is deposited on the structure , e . g ., encapsulating the fin body 38 . in embodiments , the silicon dioxide layer 46 can be a doped silicon dioxide . the silicon dioxide layer 46 can be etched back to expose an upper portion of the fin body 38 , e . g ., expose the source and drain regions . in fig1 , a spacer material 48 such as , for example , si 3 n 4 is conformally deposited on the fin body 38 . the silicon dioxide is removed using a selective etching process , e . g ., selective to a doped oxide . this selective etching process exposes a lower portion of the fin body 38 , e . g ., the active silicon layer 14 . the exposed lower portion of the fin body 38 is then selectively etched to partially remove the active silicon layer 14 of the fin body 38 to form an undercut 50 . the spacer material 48 and gate electrode material 43 protect the central portion of the fin body 38 from the etchant . in fig1 , the undercut is filled with a dielectric material 52 such as , for example , sio 2 , using , for example , a chemical vapor deposition . fig1 - 21 show structures and methods of fabricating a device in accordance with other aspects of the invention . fig1 - 21 can represent methods of manufacturing a semiconductor device ( finfet ) with an asymmetric charge distribution that provides enhanced body capacitance . the finfet can be a zram ( zero - capacitor ram ) that provides a low - cost , high signal - to - noise ratio memory . in embodiments , the finfet has an asymmetrically accumulated body with decreased vt - scatter ( compared to doped - body designs ). the finfet includes a gate structure covering the first and second sides of a fin body . the first side of the gate structure has an effective work function near the conduction band of the fin body and the second side of the gate structure has an effective work function near the valence band of the fin body , which serves to accumulate holes in the portions of the body which are adjacent to that portion of the gate structure having workfunction near the valence band . more specifically , fig1 shows a wafer 5 comprising a substrate carrier 10 , a buried oxide 12 and an active silicon layer 14 . the substrate carrier 10 can be , for example , silicon or any other known conventional carrier . a hard mask 16 is formed on the active silicon layer 14 . the hard mask 16 can be , for example , sio 2 or si 3 n 4 . in fig2 , the active silicon layer 14 and hard mask 16 are patterned using a conventional etching process such as , for example , reactive ion etching ( rie ), to form one or more fin bodies 38 . a dielectric layer 20 is deposited on the fin body 38 and exposed buried oxide layer 12 . the dielectric material 20 can be , for example , sio 2 , or high - k material such as , for example , hfsio 4 or hfo 2 , amongst other high - k materials . a metal layer 54 such as , for example , tin is deposited on the dielectric material 20 . a layer 56 is deposited on the metal layer 54 . in embodiments , the layer 56 can be a metal such as , for example , tan , or a metal with workfunction nearby the valence band of the fin body , such as mg . in alternative embodiments , the layer 56 may be doped via a layer of magnesium , or , alternatively , the dielectric below layer 56 may be modified with a thin layer of aluminum oxide , which introduces a fixed charge or dipoles , and modifies the flat - band voltage , or effective workfuntion of the gate stack following a rapid thermal anneal at approximately 1000 ° c . yet another alternative comprises introduction of oxygen into the exposed section of the gate , which also serves to shift the workfunction to a value nearby that of the valence band of the fin body . as shown in fig2 , the layer 56 is patterned to expose a portion of the underlying layer 54 on a side 38 b of the fin body 38 . in this patterning process , the layer 56 protects the other side 38 c of the fin body 38 . in embodiments , a work function modifying layer 58 is deposited on the fin body 38 , i . e ., on the protected portion 38 c and unprotected portion 38 b of the fin body 38 . in embodiments , the work function modifying layer 58 is deposited on the barrier metal layer 56 . in this embodiment , the modifying layer 58 induces an effective work function shift of the side 38 b of the fin body 38 . in embodiments , the modifying layer may be , for example , mg . in alternative embodiments , the work function modifying layer 58 can be a gate electrode material that is annealed at about 450 ° c . to about 500 ° c . to induce an effective work function shift of the side 38 b of the fin body 38 . the work function modifying layer 58 , as well as the dielectric layer 20 , metal layer 54 and layer 56 can be patterned to form a gate stack “ g ”. as should now be understood by those of skill in the art , due to the layer 56 , the first side of the gate structure has an effective work function near the conduction band of the fin body 38 and the second side of the gate structure has an effective work function near the valence band of the fin body 38 . fig2 shows an alternative embodiment of the invention , with an effective work function nearby the valence band . more specifically , a beginning wafer 5 comprises a substrate carrier 10 , a buried oxide 12 and an active silicon layer 14 . the substrate carrier 10 can be , for example , silicon or any other known conventional carrier . a hard mask 16 is formed on the active silicon layer 14 . the hard mask 16 can be , for example , sio 2 or si 3 n 4 . the active silicon layer 14 and hard mask 16 are patterned using a conventional etching process such as , for example , reactive ion etching ( rie ), to form one or more fin bodies 38 . a dielectric layer 20 is deposited on the fin bodies 38 and exposed buried oxide layer 12 . the dielectric material 20 can be , for example , sio 2 , or high - k material such as , for example , hfsio 4 or hfo 2 , amongst other high - k materials . a dipole forming layer such as al 2 o 3 is formed on an unprotected side 38 b of the gate structure 39 and diffused through the gate electrode metal into the dielectric layer 20 . the charge in the dielectric 20 sets ( shifts ) the effective work function to near the valance band . the other side 38 c of the fin body 38 ( gate ) has an effective work function near the conduction band . fig2 shows an asymmetrical device and methods of fabricating the device in accordance with aspects of the invention . the device of fig2 can represent a finfet , e . g ., zram that employs an asymmetric charge distribution . in embodiments , the finfet includes a heavily doped portion which provides large storage capacitance for good retention time . also , the source / drain in the side of the fin body , opposite that of a highly doped body region , offers low leakage to the p - doped fin region for improved retention time and yield . in fig2 , a wafer 5 comprises a substrate carrier 10 , a buried oxide 12 and an active silicon layer 14 . the substrate carrier 10 can be , for example , silicon or any other known conventional carrier . a hard mask 16 is formed on the active silicon layer 14 . the hard mask 16 can be , for example , sio 2 or si 3 n 4 . the active silicon layer 14 and hard mask 16 are patterned using a conventional etching process such as , for example , reactive ion etching ( rie ), to form one or more fin bodies 38 . a p - type dopant , e . g ., boron , is implanted into an unprotected side of the fin body 38 to form a p + doped region 60 . the p + doped region 60 provides a charge storage region . the other side 38 c of the fin body is nearly identical to intrinsic silicon . a dielectric layer 20 is deposited on the fin body 38 and exposed buried oxide layer 12 . the dielectric material 20 can be , for example , sio 2 , or high - k material such as , for example , hfsio 4 or hfo 2 , amongst other high - k materials . a layer ( gate electrode ) 43 such as , for example , tin is deposited on the dielectric material 20 . fig2 illustrates multiple design structures including an input design structure 920 that is preferably processed by a design process 910 . design structure 920 may be a logical simulation design structure generated and processed by design process 910 to produce a logically equivalent functional representation of a hardware device . design structure 920 may also or alternatively comprise data and / or program instructions that when processed by design process 910 , generate a functional representation of the physical structure of a hardware device . whether representing functional and / or structural design features , design structure 920 may be generated using electronic computer - aided design ( ecad ) such as implemented by a core developer / designer . when encoded on a machine - readable data transmission , gate array , or storage medium , design structure 920 may be accessed and processed by one or more hardware and / or software modules within design process 910 to simulate or otherwise functionally represent an electronic component , circuit , electronic or logic module , apparatus , device , or system such as those shown in fig1 - 23 . as such , design structure 920 may comprise files or other data structures including human and / or machine - readable source code , compiled structures , and computer - executable code structures that when processed by a design or simulation data processing system , functionally simulate or otherwise represent circuits or other levels of hardware logic design . such data structures may include hardware - description language ( hdl ) design entities or other data structures conforming to and / or compatible with lower - level hdl design languages such as verilog and vhdl , and / or higher level design languages such as c or c ++. design process 910 preferably employs and incorporates hardware and / or software modules for synthesizing , translating , or otherwise processing a design / simulation functional equivalent of the components , circuits , devices , or logic structures shown in fig1 - 23 to generate a netlist 980 which may contain design structures such as design structure 920 . netlist 980 may comprise , for example , compiled or otherwise processed data structures representing a list of wires , discrete components , logic gates , control circuits , i / o devices , models , etc . that describes the connections to other elements and circuits in an integrated circuit design . netlist 980 may be synthesized using an iterative process in which netlist 980 is resynthesized one or more times depending on design specifications and design attributes for the device . as with other design structure types described herein , netlist 980 may be recorded on a machine - readable data storage medium or programmed into a programmable gate array . the medium may be a non - volatile storage medium such as a magnetic or optical disk drive , a programmable gate array , a compact flash , or other flash memory . additionally , or in the alternative , the medium may be a system or cache memory , buffer space , or electrically or optically conductive devices and materials on which data packets may be transmitted and intermediately stored via the internet , or other networking suitable means . design process 910 may include hardware and software modules for processing a variety of input data structure types including netlist 980 . such data structure types may reside , for example , within library elements 930 and include a set of commonly used elements , circuits , and devices , including models , layouts , and symbolic representations , for a given manufacturing technology ( e . g ., different technology nodes , 32 nm , 45 nm , 90 nm , etc .). the data structure types may further include design specifications 940 , characterization data 950 , verification data 960 , design rules 970 , and test data files 985 which may include input test patterns , output test results , and other testing information . design process 910 may further include , for example , standard mechanical design processes such as stress analysis , thermal analysis , mechanical event simulation , process simulation for operations such as casting , molding , and die press forming , etc . one of ordinary skill in the art of mechanical design can appreciate the extent of possible mechanical design tools and applications used in design process 910 without deviating from the scope and spirit of the invention . design process 910 may also include modules for performing standard circuit design processes such as timing analysis , verification , design rule checking , place and route operations , etc . design process 910 employs and incorporates logic and physical design tools such as hdl compilers and simulation model build tools to process design structure 920 together with some or all of the depicted supporting data structures along with any additional mechanical design or data ( if applicable ), to generate a second design structure 990 . design structure 990 resides on a storage medium or programmable gate array in a data format used for the exchange of data of mechanical devices and structures ( e . g . information stored in an iges , dxf , parasolid xt , jt , drg , or any other suitable format for storing or rendering such mechanical design structures ). similar to design structure 920 , design structure 990 preferably comprises one or more files , data structures , or other computer - encoded data or instructions that reside on transmission or data storage media and that when processed by an ecad system generate a logically or otherwise functionally equivalent form of one or more of the embodiments of the invention shown in fig1 - 23 . in one embodiment , design structure 990 may comprise a compiled , executable hdl simulation model that functionally simulates the devices shown in fig1 - 23 . design structure 990 may also employ a data format used for the exchange of layout data of integrated circuits and / or symbolic data format ( e . g . information stored in a gdsii ( gds2 ), gl1 , oasis , map files , or any other suitable format for storing such design data structures ). design structure 990 may comprise information such as , for example , symbolic data , map files , test data files , design content files , manufacturing data , layout design attributes , wires , levels of metal , vias , shapes , data for routing through the manufacturing line , and any other data required by a manufacturer or other designer / developer to produce a device or structure as described above and shown in fig1 - 23 . design structure 990 may then proceed to a stage 995 where , for example , design structure 990 : proceeds to tape - out , is released to manufacturing , is released to a mask house , is sent to another design house , is sent back to the customer , etc . the methods as described above is used in the fabrication of integrated circuit chips . the resulting integrated circuit chips can be distributed by the fabricator in raw wafer form ( that is , as a single wafer that has multiple unpackaged chips ), as a bare die , or in a packaged form . in the latter case the chip is mounted in a single chip package ( such as a plastic carrier , with leads that are affixed to a motherboard or other higher level carrier ) or in a multichip package ( such as a ceramic carrier that has either or both surface interconnections or buried interconnections ). in any case the chip is then integrated with other chips , discrete circuit elements , and / or other signal processing devices as part of either ( a ) an intermediate product , such as a motherboard , or ( b ) an end product . the end product can be any product that includes integrated circuit chips . the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention . as used herein , the singular forms “ a ”, “ an ” and “ the ” are intended to include the plural forms as well , unless the context clearly indicates otherwise . it will be further understood that the terms “ comprises ” and / or “ comprising ,” when used in this specification , specify the presence of stated features , integers , steps , operations , elements , and / or components , but do not preclude the presence or addition of one or more other features , integers , steps , operations , elements , components , and / or groups thereof . the corresponding structures , materials , acts , and equivalents of all means or step plus function elements , if any , in the claims below are intended to include any structure , material , or act for performing the function in combination with other claimed elements as specifically claimed . the description of the present invention has been presented for purposes of illustration and description , but is not intended to be exhaustive or limited to the invention in the form disclosed . many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention . the embodiments were chosen and described in order to best explain the principles of the invention and the practical application , and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated .	7
referring to the drawings wherein like reference numerals designate corresponding parts throughout the several figures , and initially referring to fig1 the slab pattern tool 10 of the present invention comprises a drill pattern 11 that has a series of drilling holes 12 that form a guide for the drilling of a concrete slab . the drill pattern 11 is used for drilling concrete for subterranean termite treatments in concrete slabs that are contiguous to the walls of a building . the drilling holes 12 are preferably three - quarter inch ( 3 / 4 &# 34 ;) in diameter and centered at a point three and five - eighths ( 35 / 8 &# 34 ;) from the wall side 13 of the slab pattern . the adjustment footings 14 attach to a top surface 15 of the drill pattern 11 , and create an offset from the wall that the concrete slab joins . the adjustment footings 14 have a set of holes 16 that allow for adjustment from a position approximately five inches ( 5 &# 34 ;) from the wall to a position approximately twelve inches ( 12 &# 34 ;) from the wall . the adjustment footing 14 is attached to the drill pattern 11 by means of three - eighths inch ( 3 / 8 &# 34 ;) bolts 17 that go through the set of holes 16 in the adjustment footing 14 and through a set of corresponding holes 18 in the slab pattern 11 . to change the distance of the slab pattern 11 from the wall , the bolts 17 are placed in a different set of the holes 16 . the different holes on the adjustment footing are marked with distances ranging from five ( 5 ) to twelve ( 12 ) inches from the wall . the adjustment footings are attached to the slab pattern 11 by the bolts 17 and a set of wing nuts 19 that allow for easy adjustment of the footings 14 in the field . the footing of the foundation of the house usually protrudes no more than four inches ( 4 &# 34 ;) from the wall of the building . the drilling for the application of termiticide should be done at a point just beyond the footing . the adjustment footing 14 provides a fine adjustment in one inch increments from a distance of four and five - eighths inches ( 45 / 8 &# 34 ;) to eleven and five - eighths inches ( 115 / 8 &# 34 ;) measured from the wall to the center of the drilling holes 12 . this fine adjustment allows the service technician to move the slab pattern tool 10 away from the wall , if an initial drilling hits the footing of the foundation . the distance of five to twelve inches from the wall includes the width of a support leg 27 that is at the front of the adjustment footing 14 and makes contact with the wall . the support leg is preferably one ( 1 &# 34 ;) inch wide . accordingly , at the first set of holes 16 in the adjustment footing 14 , the distance from the wall to the center of the drilling hole 12 is equal to three and five - eighths inches from the center of the drilling hole to the wall side 13 of the drill pattern 11 plus one inch for the support leg 27 . the drilling holes 12 are open at one end to a drill bit removal slot 20 that goes all the way to the slotted side 21 of the drill pattern 11 . referring to fig2 a starting hole 22 is positioned on the left side of the slab pattern tool 10 . the other drilling holes 12 are color coded and spaced from twelve to eighteen inches from the starting hole 22 . a series of red labels 23 indicate a drilling hole pattern based on twelve inch centers . a series of blue labels 24 indicate a drilling hole pattern based on fourteen inch centers . purple labels 25 indicate a drilling hole pattern based on sixteen inch centers , and yellow labels 26 indicate a drilling hole pattern based on eighteen inch centers . once the starting hole has been drilled , a set stob or metal rod approximately one - hag inch diameter by three feet long should be placed in the hole through the slab pattern tool 10 to hold the tool in place while drilling the rest of the holes 12 . in fig3 the slotted side 21 of the drill pattern 11 is shown with the drill bit removal slots 20 leading to each drilling hole 12 . the drill bit removal slots 20 allow for some of the concrete dust generated from drilling to move away from the drilling hole . also , if the drill bit breaks or becomes lodged in the concrete by hitting rock or rebar , the drill bit removal slots 20 allow the slab pattern tool 10 to be removed from around the drill . the slab pattern tool 10 should be removed by lifting the tool from the wall side 13 of the drill pattern 11 up and away from the drill . fig4 shows the adjustment footing 14 in an extended position . the support leg 27 is positioned against the wall when the slab pattern tool 10 is being used . various modifications may be made of the invention without departing from the scope thereof and it is desired , therefore , that only such limitations shall be placed thereon as are imposed by the prior art and which are set forth in the appended claims .	0
we now refer to fig1 a - 1f , which includes six drawings ( fig1 a , 1b , 1c , 1d , 1e and 1f ) representing a two - part mold during six successive steps of a method for manufacturing a part made from polymer material . the mold is mounted on a press ( not shown ) having a fixed platen 1 and a movable platen 3 . the mold comprises a die 5 which is mounted on the fixed platen 1 of the press , and a punch 7 , mounted on the movable platen 3 . the die is the female ( concave ) half of the mold , while the punch is its male ( convex ) half . the mold is of the compression chamber type , which means that during its closing movement from its open position ( fig1 a , 1b , 1c and 1d ), there comes a point where the mold cavity is a closed space 9 , as shown in fig1 d . at this time , the mold is in a closed filling position . the volume of the space 9 is of course greater than that of the mold cavity , which is defined when the mold has reached the molding position , and which corresponds to the finished part . during all the closed filling positions and until the molding position ( fig1 e ), the punch 7 slides like a piston along a surface defining a compression chamber . the sealing of the mold with respect to the material flowing in the mold to produce the finished part is in principle provided at the compression chamber . in the case of the mold of fig1 a , 1b , 1c , 1d , 1e and 1f , the surface delimiting the compression chamber is created by a peripheral movable block 11 , which can take a retracted position ( fig1 a ) in the movable part 3 of the press and an advanced position ( fig1 d ). this movable block 11 , which , although drawn as a single piece may consist of several pieces , performs two functions . firstly , by its inner face 11 b , it forms the above - mentioned surface against which the punch 7 slides . to this end , a gap ( not shown ) is left between the inner surface 11 b of the movable block 11 and the punch 7 . this gap also acts as a vent , allowing gases trapped in the cavity to escape while the mold is being filled with the polymer material . secondly , by its lower face 11 a , the block 11 forms , with a blocking area having a face 13 provided on the die 5 , opposite the face 11 a of the movable block 11 , a means of blocking one or more inserts which will be described later . the movable block 11 is made in a single piece with a frame which is mounted on rams 12 carried by the punch 7 in order to move up to the blocking area 13 before the punch 7 engages by sliding in the compression chamber . in a variant not shown , the block 11 is a part separate from the frame , mounted on the lower side of the frame . the perspective views of fig2 and 4 show respectively lateral 15 , front 29 and rear 27 metal inserts , which are adapted to be placed in the mold in open position . each insert has an elongated shape which is rectilinear for the lateral 15 and rear 29 inserts of fig2 and 4 , and non - rectilinear for the front insert 27 of fig3 . as shown in fig1 b , the lateral insert 15 is positioned on the die 5 so that a portion 15 a of the insert covers face 13 of the blocking area and so that a portion 15 b of the insert is housed in the mold cavity . the portion 15 b housed in the mold cavity is a part of the insert 15 which is to be overmolded . the portion of each insert which is to be overmolded will be designated the “ overmolded portion ”. the portion 15 a covering the face 13 is a part which is intended to protrude from the molded part . this latter portion 15 a of the insert 15 will be designated the “ uncovered portion ”. as shown on fig2 , the boundary 15 c , called the overmolding limit , between portion 15 b intended to be overmolded and uncovered portion 15 a , is an imaginary line schematized by a dashed line on fig2 . the same overmolding limit 27 c exists between the uncovered 27 a and overmolded 27 b portions of the front insert 27 . the same applies with the overmolding limit 29 c of the rear insert 29 between its uncovered portion 29 a and its overmolded portion 29 c , as shown on fig3 and 4 . the overmolding limits 15 c , 27 c and 29 c extend from a first end a of each insert to an opposite end b of the insert , without leaving the insert and following approximately its edge 15 d , 27 d , 29 d which is not necessarily rectilinear . each of the inserts has special contours which are specific to the floor model to be obtained . similarly , each insert has a transverse cross - section bent at a special angle which may be different from one insert to another or from one location to another over the length of a given insert . these shape characteristics of the inserts will not be described in detail in this description . in the overmolded portions 15 b , 27 b , 29 b , each insert 15 , 27 , 29 comprises attachment holes 21 intended to be filled by the plastic material to hold the sheet metal securely , as is known by those skilled in the art . in the portion 15 a , the lateral insert 15 comprises centering holes 19 to center it in the direction of its length , i . e . the x direction ( see fig2 ). when an insert 15 is positioned in the mold with its uncovered portion 15 a between the block 11 and the blocking surface 13 , the overmolded portion 15 b of the insert 15 is in the mold cavity at a position 8 ( fig1 e ) which , in this example , is on the periphery of the cavity . while fig1 a - 1f represents only the insert 15 , the related explanations are also valid for inserts 27 and 29 . in the position 8 , the mold comprises lateral 10 ( fig1 ), front ( not shown ) and rear 30 ( see fig1 ) gadroons on the die 5 and on the punch 7 or the block 11 . the gadroons 10 , 30 are integral shapes of the mold , formed integrally with the inner wall of the die 5 or the punch 7 . the gadroons 10 , 30 are arranged to come into contact with the inserts 15 on either side , in order to hold them in a predetermined position while molding the floor , away from the walls of the cavity . each gadroon 10 , 30 , is dimensioned to come into contact with the insert 15 , 27 , 29 by its free end 32 , 33 ( fig1 ), after closing the mold , and the free end 32 , 33 coming into contact with the corresponding insert is shaped to prevent the plastic material 11 from covering the sheet metal at the free end 32 , 33 . the perspective view of fig1 shows the rear gadroon 30 in detail . the rear gadroon 30 is shaped to facilitate demolding of the floor along the z direction . in this example , the free end 33 of the gadroon ( intended to come into contact with the insert ) has a substantially trapezoidal shape whose width increases along the demolding direction z , with a base e of 1 mm to 2 mm , a draft angle of 1 degree to 3 degrees along the length l of 25 mm and an overmolding thickness h of 2 mm . as shown in fig6 , the rear gadroons 30 are mainly distributed in a repetitive arrangement 43 , for molding under a pressure of 100 bars , with inserts made from sheet steel metal of type xes ( standard nf 36 - 401 ), the thickness of the sheet metal being 0 . 67 mm . the length p of the pattern is 50 mm . each arrangement 43 comprises three gadroons 30 , two being close together , the distance e between these two close gadroons being 10 mm . the lateral gadroons 10 are shaped to facilitate demolding of the floor along the z direction . in this example , the contact end 33 of the gadroon 10 has a substantially rectangular shape whose overmolding length l is 25 mm and the width is 1 mm to 2 mm ( preferably 1 mm ). its thickness h is 2 mm . as shown in fig5 , the lateral gadroons 10 are mainly distributed in a repetitive arrangement 41 , for molding under a pressure of 100 bars , with inserts made from sheet steel metal of type xes ( standard nf 36 - 401 ), the thickness of the sheet metal being 0 . 67 mm . the length p of the pattern is 50 mm . each arrangement 41 comprises two gadroons 10 , the distance between these two gadroons 10 being from 10 mm to 15 mm . the material used for molding is a thermosetting plastic of type smc ( sheet molding compound ). it is deposited in the open mold , on the die 5 , substantially in the middle of the cavity although this is not a necessity , as a blank 17 , as is known . the step of depositing the material in the mold in open position is illustrated by fig1 c . referring to fig1 a - 1f , we will now describe six successive steps of the molding method according to the invention . in a first step , illustrated by fig1 a , the mold is in open position : the punch 7 is far away from the die 5 and the movable block 11 is retracted in the punch 7 . in a second step , illustrated by fig1 b , the front 17 , lateral 15 and rear 29 inserts are positioned on the blocking area 13 of the die 5 , with their overmolded portions 15 b , 27 b and 29 b housed in position 8 of the cavity and resting on the gadroons 10 , 30 of the die 5 . in a third step , illustrated by fig1 c , an smc sheet 17 is deposited in the middle of the cavity , on the die 5 . the second and third steps may be combined or performed in a different order . in a fourth step , not shown , the movable part 3 is brought close to the fixed part 1 , but without closing the mold , in other words without any of the parts of the upper half of the mold , namely the punch 7 and the movable block 11 , touching one of the parts of the lower half of the mold , namely the die 5 . the mold has therefore not yet reached its closed filling positions . in a fifth step , the rams 12 are actuated to lower the movable block 11 towards the blocking area 13 of the die , as illustrated by fig1 d . in so doing , face 11 a of the movable block 11 moves against the uncovered portions 15 a , 27 a and 29 a of the front 17 , lateral 15 and rear 29 inserts , firmly blocking them in position against face 13 of the blocking area . thus positioned , the movable block 11 performs its two functions : firstly , it holds the inserts in position ready to fill the mold cavity by flowing of the material 17 , and secondly it forms a compression chamber . the mold cavity , delimited by the punch 7 , the movable block 11 and the die 5 , is therefore closed , but does not yet define the shape of the part to be obtained . the mold is in closed filling position . in a sixth step , illustrated by fig1 e , the movable part 3 of the press continues its path towards the fixed part 1 . in so doing , the punch 7 continues its movement by sliding like a piston in the block 11 . the block 11 remains stationary resting against the inserts 15 , while the rams 12 move back without reducing the pressure holding the inserts . the inner face 11 b of the movable block 11 forms the lateral wall of the compression chamber against which the punch 7 slides . due to the reduction in cavity volume and the molten state of the plastic material 17 , the plastic material 17 flows into the mold cavity filling it completely , in particular covering portions 15 b , 27 b and 29 b of the inserts 15 , 27 , 29 which are housed in position 8 of the mold cavity . when the punch 7 has stopped moving , the gadroons 10 , 30 of the punch have come into in contact with the overmolded portions 15 b , 27 b , 29 b of the inserts and the mold is in the molding position . the plastic material 17 has completely filled the mold cavity , but has been prevented by the gadroons 10 , 30 from coming into contact at their positions with the overmolded portions 15 b , 27 b , 29 b of the inserts . since the block 11 is separated from the punch 7 by the rams 12 , the pressure of the block 11 on the uncovered portions 15 a , 27 a , 29 a of the inserts 15 , 27 , 29 is not disturbed by the pressure of the gadroons 10 , 30 on the overmolded portions 15 b , 27 b , 29 b of the inserts . in other words , no hyperstatism occurs . the volume of the cavity between the punch 7 , the movable block 11 and the die 5 is that of the finished part . in a seventh step , illustrated by fig1 f , the movable part 3 of the press starts to move in the mold opening direction . this time the movable block 11 remains fastened to the punch 7 and rises up with it , thereby returning the mold to the fully open position . ejectors 19 , provided in the die 5 , raise the molded floor 20 . the latter is then released and the ejectors 19 retracted , in order to start a molding cycle from the step illustrated by drawing fig1 a . since the molding direction is vertical , i . e . in the z direction , we see that that overmolded portions 15 b , 27 b of the lateral 15 and front 27 inserts are not perpendicular to the molding direction , while the overmolded portion 29 b of the rear insert 29 is horizontal , i . e . perpendicular to the molding direction . this can be seen more clearly in fig8 and 9 , illustrating respectively a sectional view of the lateral insert 15 and of the rear insert 29 . in another embodiment example not shown , the inserts are inclined relative to the molding direction . the thickness of the sheet metal of the inserts is from 0 . 7 mm to 2 mm and the thickness h of the plastic material is from 2 mm to 5 mm . fig5 and 7 show the overmolded portion 15 b in dotted lines , covered by the plastic material 17 . notches 51 are formed in the plastic material 17 by the gadroons 10 of the mold . in other words , the floor 20 has openings ( notches 51 ) leading to the inserts , in the thickness of the plastic material 17 . we can understand that the shape of a notch is complementary to the shape of a gadroon . thus , as shown on fig5 , in each area 53 of the overmolded portion 15 b which has a notch 51 complementary to a gadroon 10 , the insert 15 is not covered by the plastic material . each area 53 extends over the entire flat section of the overmolded portion 15 b of the insert , but stops in the rounded area of the insert which leads to its uncovered portion 15 a . in other words , between the flat section of the overmolded portion 15 b and up to the overmolding limit 15 c , the rounded area of the insert is covered with plastic material 52 , although the gadroon is located here . to ensure that the plastic material 52 does not detach from the rest of the floor during the lifetime of the floor , the free end 32 of the gadroon 10 may be provided with a recess which , at the boundary between the area 53 and the plastic material 52 , clearly separates the free end 32 from the rounded area of the insert , so that the plastic material layer 52 is sufficiently thick and therefore strong . the diameters of the attachment holes 21 may vary from 4 mm to 10 mm . preferably , the diameter of the attachment holes 21 a which are located between the two close gadroons 10 a and 10 b is 5 mm . the diameter of the other attachment holes is 6 mm . the distance between each close gadroon 10 a or 10 b and its neighboring gadroon is 19 mm . fig6 shows the overmolded portion 29 b and the non - overmolded portion 29 a of the rear insert 29 . the overmolded portion 29 b is covered by the plastic material 17 , except in each area 63 of the overmolded portion 29 b where there is a notch 61 complementary to a gadroon 30 . the notches 61 are formed by the rear gadroons 30 of mold which are distributed in the repetitive arrangement 43 . the diameters of the attachment holes 21 may vary from 4 mm to 10 mm . preferably , the diameter of the attachment holes 21 a which are located between the two gadroons with the same pattern 43 is 5 mm . the diameter of the other attachment holes is 6 mm . fig1 shows a sectional view of a notch 51 on the lateral insert 15 . the edge 55 of the notch 51 is substantially perpendicular to the overmolded portion 15 b of the insert 15 . we can understand that the wall of the gadroon 10 corresponding to this edge is substantially perpendicular to this overmolded portion 15 b of the insert 15 . in this embodiment , two gadroons 10 are present opposite each other on the die 5 and the punch 7 , so as to form two notches 51 on each side of the same area 53 of the insert 15 . fig1 shows a sectional view of a notch 61 on the rear insert 29 . the edge 65 of the notch 61 is inclined relative to the overmolded portion 29 b of the insert 29 , with an angle of 30 ° to 87 ° to facilitate demolding in the z direction . we can understand that the wall of the gadroon 30 corresponding to this edge is also inclined relative to the z direction . in this embodiment , two gadroons 30 are also present opposite each other on the die 5 and the punch 7 , so as to form two notches 61 on each side of the same area 63 of the insert . in another embodiment not shown , the gadroons 10 or 30 are arranged offset to each other on the die and the punch . the invention is not limited to the embodiments described and other embodiments will be clearly apparent to those skilled in the art . in particular , the shape of the gadroons may be different provided that the basic invention remains unchanged . while the process and method herein described constitute preferred embodiments of this invention , it is to be understood that the invention is not limited to this precise process and method , and that changes may be made therein without departing from the scope of the invention which is defined in the appended claims .	1
the manufacture of the adsorbents in accordance with the invention can be carried out in a manner known per se , with the matrix being firstly functionalized ( introduction of the spacer ) and then the desired colouring substance being covalently bonded via the spacer . when agarose is used as the starting material , it is reacted , for example , with epibromohydrin in an alkaline medium and the epoxide ring is opened by reaction with aqueous ammonia so that 3 - amino - 2 - hydroxypropyl - agarose is obtained ( see j . solid - phase biochem . 1 , 33 [ 1976 ]). after the reaction with the desired colouring substance excess free spacer - 3 - amino functions can be blocked , for example , by reaction with potassium cyanate ( conversion into ureido groups ). polyacrylic resins which contain free hydroxyl groups can be converted into adsorbents in accordance with the invention in an analogous manner . a starting material for a preferred resin type in accordance with the invention based on a polyacrylamide carrier matrix is an oxirane - polyacrylic resin which contains ## str2 ## groups and which is marketed under the brand name eupergit ®- c of the firm rohm pharma gmbh , darmstadt . the epoxypropyl groups of eupergit ®- c can be converted into 3 - amino - 2 - hydroxypropyl groups by treatment with aqueous ammonia . aminoeupergit which is thus - obtained can then be converted into the desired resin in accordance with the invention in a manner known per se by reaction with a reactive colouring substance , as indicated previously . especially preferred reactive colouring substances in connection with the present invention are cibacron ® blue 3g - a or f3g - a and cibacron ® brilliant red 4g - e . the following examples illustrate the manufacture of some adsorbents in accordance with the invention as well as their use in the purifications of recombinant human fibroblast interferon ( rifn - β ), whereby the relative proportions of the reaction partners are not critical and can be varied depending on the problem posed , i . e . depending on the protein or protein mixture to be purified . in this manner there can be obtained adsorbents in accordance with the invention which differ from one another in spacer or colouring substance content . the optimal proportions can be readily determined empirically by the person skilled in the art . for the purification of fibroblast interferon ( ifn - β ) an amount of about 7 - 8 μmol of cibacron ® blue per ml of gel has , for example , been shown to be very favourable , but from about 2 to up to about 15 μmol of colouring substance can be used . the purification of proteins with the resins in accordance with the invention can be carried out analogously to the chromatography of natural fibroblast interferon from human tissue on blue dextran sepharose ® which is described by friesen et al ( arch . biochem . biophys . 206 , 432 - 450 [ 1981 ]). the rifn - β crude extract used as the starting material was prepared according to the method of goeddel et al . ( nucleic acids res . 8 , 4057 - 4074 [ 1980 ]). the elution was followed with a photometer having a flow cell ( wavelength 280 nm ) and a recorder . the eluates were collected with the aid of a fraction collector and fractionated . the pure interferon solution obtained can be dialyzed against 0 . 05m sodium acetate buffer in order to remove the ethylene glycol and can be concentrated by ultrafiltration . the determination of the protein content was carried out according to the method of lowry et at . ( j . biol . chem . 193 , 265 - 275 [ 1951 ]) using serum albumin as the standard . the purity determination was carried out by means of sds - page as described by laemmli et al . ( nature 277 , 680 - 685 [ 1970 ]), with the modification that the electrophoresis was carried out under non - reducing conditions ( i . e . without the addition of 2 - mercaptoethanol ). as the protein standard marker there was used a mixture of lysozyme ( mw : 14 , 400 ), trypsin inhibitor ( mw : 21 , 500 ), carbonil anhydrase ( mw : 31 , 000 ), ovalbumin ( mw : 45 , 000 ), bovine serum albumin ( mw : 66 , 200 ) and phosphorylase b ( mw : 92 , 500 ). 50 ml of agarose gel ( sepharose ® cl - 6b ) were washed twice on a glass suction filter with about 250 ml of water , transferred into a 200 ml sulphonation flask and brought to a volume of 100 ml with water . after the addition of 8 ml of 4n naoh and 2 ml of epibromohydrin the mixture was stirred at 30 ° c . for 5 hours . the activated resin was washed neutral on the suction filter with water and transferred back into the sulphonation flask . after the addition of 100 ml of 5 % ammonia solution ( wt ./ vol .%) the mixture was stirred at room temperature overnight . the resin was then again washed neutral and brought to a volume of 100 ml with water . after the addition of 1 g of na 2 co 3 and 271 mg of cibacron ® blue 3g - a ( 7 μmol / ml of gel ) the mixture was stirred at 50 ° c . for 20 hours . the finished gel was washed colourless on the glass suction filter in sequence with in each case about 500 ml of water , methanol / water ( 1 : 1 ) and water . 250 ml of 5 % ammonia solution ( wt ./ vol .%) were placed in a 500 ml round flask . after 25 g of eupergit ® c had been added portionwise the mixture was stirred slowly with a paddle stirrer at room temperature for 6 hours . the stirring was then stopped and the supernatant was sucked off after three minutes . the resin was again suspended with 100 ml of water and after 3 minutes the supernatant was again sucked off . this procedure was repeated four times . the thus - obtained moist aminoeupergit was transferred into a 500 ml 4 - necked flask , treated with 200 ml of 0 . 2m disodium hydrogen phosphate and 688 mg of cibacron ® blue 3g - a ( 8 μmol per ml of gel ) and stirred slowly at 40 ° c . for 20 hours . the resin was then washed on a glass suction filter in sequence with in each case 500 ml of water , 0 . 01n hydrochloric acid and water . the gel was subsequently transferred back into the reaction vessel , treated with 220 ml of water and 2 . 08 g of potassium cyanate and stirred slowly at room temperature for 15 hours . the finished resin ( about 100 ml ) was finally washed on the glass suction filter in sequence with in each case 1 : 1 of water , methanol / water ( 1 : 1 ) and water . 100 ml of aminoeupergit , prepared from 25 g of eupergit ® c according to the method described in example 2 , were treated in a 500 ml flask with 200 ml of 0 . 2m disodium hydrogen phosphate and 1 . 029 g of cibacron ® brilliant red 4g - e ( 7 μmol of colouring substance per ml of gel ). the reaction mixture was stirred slowly at 40 ° c . for 15 hours . the resin was subsequently washed on the suction filter in sequence with in each case 500 ml of water . 1m potassium chloride solution , 0 . 01n hydrochloric acid and again with water . the resin was then returned to the reaction flask and stirred for about 15 hours in 200 ml of water with 2 . 08 g of potassium cyanate . the ready - for - use resin ( about 100 ml ) was washed with water , methanol / water and again with water in a manner analogous to example 2 . a column ( 2 . 6 × 4 . 7 cm ), containing 25 ml of the agarose - cibacron ® blue resin manufactured in accordance with example 1 , was equilibrated with about 200 ml of 0 . 05m phosphate buffer ( ph 7 . 2 , 1m nacl ). the column was loaded at 4 ° c . with 1050 ml of rifn - β crude extract , obtained from 28 g of deep - frozen e . coli cells in accordance with goeddel et al . ( nucleic acids res . 8 , 4057 [ 1980 ]), with a flow rate of 8 cm / hour ( ml / cm 2 / hr .). the column was subsequently washed at room temperature in succession with in each case 100 ml of phosphate buffer ( 0 . 05m , ph 7 . 2 , 1m nacl ) containing 15 and 30 vol ./ vol .%, respectively , of ethylene glycol and the interferon was eluted with phosphate buffer ( 0 . 05m , ph 7 . 2 , 1m nacl ) containing 50 vol ./ vol .% of ethylene glycol . there were obtained 2 . 2 mg of pure rifn - β ( purity & gt ; 95 % in accordance with sds - page ) in 66 ml of elution buffer . subsequently , the column was made ready for use again by washing with phosphate buffer ( 0 . 05m , ph 7 . 2 , 1m nacl ) containing 70 vol ./ vol .% of ethylene glycol . ( a ) a column ( 2 . 6 × 7 cm ), containing 37 ml of the aminoeupergit - cibacron ® blue resin manufactured in accordance with example 2 , was equilibrated with about 200 ml of 0 . 05m phosphate buffer ( ph 7 . 2 , 1m nacl ). the column was then loaded at 6 ° c . with 700 ml of rifn - β crude extract , obtained from 14 . 8 g of deep - frozen e . coli cells in accordance with goeddel et al . ( nucleic acids res . 8 , 4057 [ 1980 ]), at a flow rate of 38 cm / hr . the column was subsequently washed at room temperature in succession with 130 ml of phosphate buffer ( 0 . 05m , ph 7 . 2 , 1m nacl ) containing 15 and 30 vol ./ vol .%, respectively , of ethylene glycol as well as with 60 ml of phosphate buffer ( 0 . 05m , ph 7 . 2 , 1m nacl ) containing 30 vol ./ vol .% of ethylene glycol and the interferon was eluted with phosphate buffer ( 0 . 05m , ph 7 . 2 , 1m nacl ) containing 50 vol ./ vol .% of ethylene glycol . there were obtained 1 . 15 mg of pure rifn - β ( purity & gt ; 95 % in accordance with sds - page ) in 38 ml of elution buffer . subsequently , the column was made ready for use again by washing with phosphate buffer ( 0 . 05m , ph 7 . 2 , 1m nacl ) containing 70 vol ./ vol .% of ethylene glycol . ( b ) in a manner analogous to ( a ), a column ( 14 × 13 cm ). containing 2 l of the resin manufactured in accordance with example 2 , was loaded with 60 l of rifn - β crude extract , obtained from 2 kg of e . coli cells ( in accordance with goeddel et al . ), at a flow rate of 39 cm / hour , washed and eluted , whereby 300 mg of pure rifn - β ( purity & gt ; 95 % in accordance with sds - page ) in 2 . 3 l of elution buffer were obtained .	8
several components for a system , apparatus and method of moving a dough product from a first position to a final position using a transfer apparatus are disclosed . although the present embodiments have been described with reference to specific example embodiments , it will be evident that various modifications and changes may be made to these embodiments without departing from the broader spirit and scope of the various embodiments . the instant application is an improvement of the previous application pranoti nagarkar israni ( 2013 ) wherein a different type of transfer unit is described . the instant disclosure describes a transfer apparatus that is being used by a food making appliance to place the instantly made dough ball from a first position to a final position for further use . in the instant disclosure a transfer apparatus comprises of a processor hosting the software , an arm , a roller , a sensor and an actuator for arm and / or roller . each part is described in the following paragraphs . fig1 shows a perspective view of roller 110 . preferably , roller 110 has a plurality of grooves 140 . preferably grooves 140 extend length - wise across roller 110 . grooves 140 are shaped such that they protrude out to act as “ teeth ” to exert just enough upward pressure . the material to make the roller and the surface texturing can be done using any material or shape or surface finish just so that it prevents or minimizes the sticking of the dough ball or the food product by reducing surface area coming in contact with food product . the roller 110 has a hollow center 120 . there may be radial structural supports in form of a specific center structure 130 to the hollow cylinder as a reinforced wall to maintain rigidity , structural integrity and to make the rolling action smoother rather than jerky movements . the shape of the roller 110 may be of any geometrical shape such as cylindrical , hour glass , conical , dog bone , oblong , rod , egg shaped and a combination there of such but not limited to these . the rational is for guiding the dough ball from a first position to a final position without sticking to the roller and to follow a specific path . the roller 110 may also have a motor to control its movement and be guided by the software . it may also have a gear box and may also use the motor of the transfer apparatus . a roller may have a specific surface structure , specific shape and specific center structure , a motor to power the roller to rotate around an axis ; and software to control a speed of rotation around the axis . wherein the specific center structure is a hollow cylinder with a reinforced wall to maintain rigidity and structural integrity and wherein the specific shape is used to guide a food product in a specific trajectory . in one aspect , the specific surface has at least one of a plurality of grooves , a recessed surface , a raised surface along the length of the roller to minimize sticking of the dough product . the roller 110 may also be made up of a nonstick material . fig2 shows a perspective view of the arm 200 . the arm 200 has several components . the roller 110 , a base 220 attached to food appliance , a back support 240 and a flap 210 . roller 110 can be de - attached for easy cleaning by opening the flap 210 . arm 200 is powered by a transfer motor 260 to move a dough product such as a dough ball from a first position to a second position . preferably , arm 200 moves from the first position to the final position in an arc - like or sweeping manner . arm 200 has roller 110 . preferably roller 110 is a cylindrical drum . preferably roller 110 is connected to , and extends across the length of arm 200 . roller 110 is powered by a motor 262 such that it can rotate around an axis . preferably arm 200 has flap 210 at its outer edge . preferably , flap 210 has a surface that is flush with both arm 240 and roller 110 . when this is coupled with the sweeping motion of arm 240 , the dough product or dough ball 420 is rolled forward . flap 210 ensures that the dough product does not slide out of the sweeping trajectory or the area of the arm movement . the flap has a specific surface which comprises of at least one of a plurality of grooves , a recessed surface , a raised surface along the length of the flap to minimize sticking of the dough product . fig3 shows transfer apparatus 300 comprising of an arm 200 and the roller 110 attached to a housing 310 . a recessed space 320 is designed to receive the arm 200 in a resting condition or when the machine is nonfunctional . the groove 230 is used for securing the arm 200 to the housing 310 . the housing 310 may house the transfer motor , sensor and an actuator to control the arm 200 . fig4 shows the method in which the roller is being used to move the dough ball 420 . the dough ball 420 is being moved from first platen 440 to platen 410 for flattening . the start point ( not shown ) is the transfer base where the dough ball after being made is kept at that position . a method to transfer a dough ball 420 using arm 200 comprises of contacting the dough ball resting on a transfer station using a roller of the arm or the transfer apparatus . every flour type has unique composition and when mixed with any liquid such as milk or water and / or oil it creates a specific viscoelasticity . only at a certain range the dough ball attains optimal viscoelasticity which may be described as non - sticky , resilient and firm shaped . this optimal viscoelasticity containing dough ball 420 can be used for making flattened dough and subsequently cooked as flat bread . many steps are involved in these types of appliances and this instant invention describes one such function in which the dough ball 420 is transferred from one location to another mechanically without human intervention . the stickiness of the dough ball creates a resistance force . in another step , the resistance is determined from the dough ball using a sensor . the software residing in a processor is self - learning software and guides the sensor . a disc having plurality of lines enables counting of the lines that pass through the position and / or speed sensor to determine a position and / or speed of the arm 200 . a sensor 264 may comprise of limit switches , optical encoder etc ., but not limited to these . in another embodiment , a tangential force and a forward movement force that is required by the roller to move the dough ball is determined using the sensor data . in one step , a motor speed of the arm is controlled using software residing in a processor . fig5 a and 5b describe the following method and steps that are being taken by the arm 200 . once the resistance 580 has been determined the exertion of the tangential force 510 and the forward movement force 560 to the dough ball using the roller 110 rotating in a clockwise direction 590 and the arm in the forward or angular motion is done . in another embodiment , the dough ball or food product 420 is rolled and / or moved in an opposite direction or an anti - clock wise 540 direction forward towards the platen 440 for flattening . also the upwards movement by the roller allows the force to be applied in a specific direction . this upward movement lifts the ball slightly to be pushed forward by the anti - clock wise or opposite movement and the arm moving in an arc . this upward movement prevents the dough ball from getting stuck underneath the roller . if there is any resistance in the forward motion from the dough ball the method is rejected and a message is displayed to the user regarding the rejection due to high resistance from the dough ball . roller 110 can have dedicated software to control its speed . therefore , arm 200 and roller 110 can move at different speeds . however , the motion speed of arm 200 is related to and dependent on the rotational speed of roller 110 . software is used to control the motion speed of arm 200 so as to not be faster than the time it takes roller 110 to nudge and / or drop the dough product or else there is risk of the dough product getting stuck or getting run over . the rotational speed of roller 110 is detected by counting lines on a disc that passes through an optical sensor encoder . cleaning of these apparatus and appliances are a nightmare for all that use them . modular design of the transfer apparatus 110 has made it very convenient to clean the roller 110 by detaching the roller after removing the flap . although the present embodiments have been described with reference to specific examples embodiments , it will be evident that various modifications and changes may be made to these embodiments without departing from the broader spirit and scope of various embodiments . accordingly , the specification and drawings are to be regarded in an illustrative rather than a restrictive sense .	0
fig1 illustrates an embodiment of an inkjet printing mechanism , here shown as an inkjet printer 20 , constructed in accordance with the present invention , which may be used for printing for business reports , correspondence , desktop publishing , and the like , in an industrial , office , home or other environment . a variety of inkjet printing mechanisms are commercially available . for instance , some of the printing mechanisms that may embody the present invention include plotters , portable printing units , copiers , cameras , video printers , and facsimile machines , to name a few . for convenience the concepts of the present invention are illustrated in the environment of an inkjet printer 20 . while it is apparent that the printer components may vary from model to model , the typical inkjet printer 20 includes a chassis 22 surrounded by a housing , casing or enclosure 24 , typically of a plastic material . sheets of print media are fed through a print zone 25 by a print media handling system 26 . the print media may be any type of suitable sheet material , such as paper , card - stock , transparencies , mylar , and the like , but for convenience , the illustrated embodiment is described using paper as the print medium . the print media handling system 26 has a feed tray 28 for storing sheets of paper before printing . a series of conventional paper drive rollers ( not shown ), driven by a stepper motor 30 and drive gear assembly 32 , may be used to move the print media from tray 28 into the print zone 25 , as shown for sheet 34 , for printing . after printing , the motor 30 drives the printed sheet 34 onto a pair of retractable output drying wing members 36 . the wings 36 momentarily hold the newly printed sheet above any previously printed sheets still drying in an output tray portion 38 before retracting to the sides to drop the newly printed sheet into the output tray 38 . the media handling system 26 may include a series of adjustment mechanisms for accommodating different sizes of print media , including letter , legal , a - 4 , envelopes , etc ., such as a sliding length adjustment lever 40 , a sliding width adjustment lever 42 , and a sliding envelope feed plate 44 . the printer 20 also has a printer controller , illustrated schematically as a microprocessor 45 , that receives instructions from a host device , typically a computer , such as a personal computer ( not shown ). the printer controller 45 may also operate in response to user inputs provided through a key pad 46 located on the exterior of the casing 24 . a monitor attached to the computer host may be used to display visual information to an operator , such as the printer status or a particular program being run on the host computer . personal computers , their input devices , such as a keyboard and / or a mouse device , and monitors are all well known to those skilled in the art . a carriage guide rod 48 is supported by the chassis 22 to slideably support a dual inkjet pen carriage system 50 for travel back and forth across the print zone 25 along a scanning axis 51 . the carriage 50 is also propelled along guide rod 48 into a servicing region , as indicated generally by arrow 52 , located within the interior of the housing 24 . one suitable type of carriage support system is shown in u . s . pat . no . 5 , 366 , 305 , assigned to hewlett - packard company , the assignee of the present invention . a carriage drive gear and dc motor assembly 55 is attached to drive an endless belt 56 . the motor 55 operates in response to control signals received from the controller 45 . the belt 56 may be secured in a conventional manner to the carriage 50 to incrementally advance the carriage along guide rod 48 in response to rotation of motor 55 . to provide carriage positional feedback information to printer controller 45 , an encoder strip 58 extends along the length of the print zone 25 and over the service station area 52 . a conventional optical encoder reader may also be mounted on the back surface of printhead carriage 50 to read positional information provided by the encoder strip 58 . the manner of attaching the belt 56 to the carriage , as well as the manner providing positional feedback information via the encoder strip reader , may be accomplished in a variety of different ways known to those skilled in the art . in the print zone 25 , the media sheet 34 receives ink from an inkjet cartridge , such as a black ink cartridge 60 and / or a color ink cartridge 62 . the cartridges 60 and 62 are also often called &# 34 ; pens &# 34 ; by those in the art . the illustrated color pen 62 is a tri - color pen , although in some embodiments , a set of discrete monochrome pens may be used . while the color pen 62 may contain a pigment based ink , for the purposes of illustration , pen 62 is described as containing three dye based ink colors , such as cyan , yellow and magenta . the black ink pen 60 is illustrated herein as containing a pigment based ink . it is apparent that other types of inks may also be used in pens 60 , 62 , such as paraffin based inks , as well as hybrid or composite inks having both dye and pigment characteristics . the illustrated pens 60 , 62 each include reservoirs for storing a supply of ink therein . the pens 60 , 62 have printheads 64 , 66 respectively , each of which have an orifice plate with a plurality of nozzles formed therethrough in a manner well known to those skilled in the art . the illustrated printheads 64 , 66 are thermal inkjet printheads , although other types of printheads may be used , such as piezoelectric printheads . the printheads 64 , 66 typically include a plurality of resistors which are associated with the nozzles . upon energizing a selected resistor , a bubble of gas is formed ejecting a droplet of ink from the nozzle and onto a sheet of paper in the print zone 25 under the nozzle . the printhead resistors are selectively energized in response to firing command control signals delivered by a multi - conductor strip 68 from the controller 45 to the printhead carriage 50 . fig2 illustrates one embodiment of a printhead service station 70 that resides within the servicing region 52 of the printer enclosure 24 . the service station 70 includes a service station frame 72 that supports a rotary service station tumbler 74 . the service station tumbler 74 may be driven by a conventional gear mechanism ( not shown ) which engages a drive gear 76 of the tumbler . the tumbler 74 rotates about an axis 78 , which is substantially parallel to the carriage scanning axis 51 . the service station 70 also includes a spittoon 80 which has an upper chimney portion with an opening or mouth portion that receives ink purged or &# 34 ; spit &# 34 ; from the printheads 64 , 66 . in addition to the spitting function , the service station 70 also accommodates other printhead servicing functions , such as capping the printheads 64 , 66 during periods of inactivity , wiping the printheads to remove accumulated waste ink and debris , and / or priming the printheads . these various servicing mechanisms may be located along the periphery of tumbler 74 . illustrative of these different servicing devices , the service station 70 is shown with a sled 82 in position to support black and color printhead priming caps 84 , 86 , which are used to prime the respective black and color printheads 64 , 66 . for instance , the priming sled 82 may have one or more upright arms 88 , which are rotated through operation of gear 76 into contact with the printhead carriage 50 to bring the priming caps 84 , 86 into contact with the printheads 64 , 66 for priming . the service station 70 also includes a blotting and scraping mechanism 90 , which advantageously has two scrapper arms 92 , 94 to clean printhead wipers located along another portion the tumbler 74 . the assembly 90 also has a pair of blotter pads 96 , 98 which engage the priming caps 84 , 86 to blot them clean after a priming operation . it is apparent to those skilled in the art that a variety of other mechanisms may be used to provide the printhead servicing functions of priming , wiping and capping , in place of the tumbler mechanism 74 illustrated in fig2 . indeed , a variety of different servicing mechanisms are installed in commercially available inkjet printing mechanisms , many of which may be suitably substituted for the servicing mechanism of tumbler 74 . fig3 illustrates a first embodiment of a trap door spittoon system 100 constructed in accordance with the present invention . here , we see the chimney of spittoon 80 has been fitted with a trap door 102 . the trap door 102 is pivoted to the spittoon by a hinge member 104 for rotation about a hinge axis 105 . the trap door 102 has a contacting pin or actuator arm 106 which extends upwardly from the upper surface of door 102 . the arm 106 is contacted by a portion of the pen 60 , and / or the carriage 50 ( not shown ), as the carriage moves the pen along the scanning axis 51 into a spitting position over spittoon 80 . contact with arm 106 forces the trap door 102 downwardly to open the spittoon for receiving ink purged from the printheads 64 , 66 , although only pen 60 is shown in fig3 . when the pens 60 , 62 leave the spittoon area 80 , a biasing member , such as a torsional spring member 108 located along hinge 104 , forces the door 102 into a closed position , as indicated by arrow 109 . the closed door 102 contains at least a portion of the spit - generated within the spittoon 80 . fig4 illustrates a second embodiment of a trap door spittoon system 110 constructed in accordance with the present invention . in system 110 , the spittoon 80 is covered by a trap door 112 . the trap door 112 is pivotally attached to the chimney of spittoon 80 using a hinge member 114 , which rotates about a hinge axis 115 . in this embodiment , a contacting pin or actuating arm 116 extends upwardly from an upper surface of door 112 to contact either the pens 60 , 62 or the carriage 50 ( for clarity , only pen 60 is shown ). as the pens 60 , 62 move over the spittoon 80 , the door 112 is rotated away from the upper portion of the spittoon , to allow the purged ink to be received through the spittoon chimney . following the spitting operation , the carriage moves the pens 60 , 62 from the spitting position , and door 112 is returned to cover the spittoon 80 under a biasing force provided by a bias member , such as a torsional spring member 118 . under the force of spring 118 , the trap door 112 rotates , as indicated by arrow 119 , to a closed position that traps ink aerosol satellites generated during purging inside the spittoon . fig5 shows a third embodiment of a trap door spittoon system 120 constructed in accordance with the present invention . in system 120 , the spittoon 80 is covered by a sliding trap door 122 . the trap door 122 rides in a pair of slots 124 , 125 formed within the chimney walls of spittoon 80 . the trap door 122 moves translationally to slide open when the pens 60 , 62 and / or the carriage 50 engage a contact pin or actuating arm 126 , although for clarity only pen 60 is shown engaging arm 126 . after the spitting operation , the carriage moves the pens 60 , 62 from the spitting position , and door 122 slides over the open spittoon mouth under the urging force of a bias member , such as a spring member 128 . the spring 128 draws the door 122 back over the chimney entrance to isolate the floating ink aerosol satellites inside the spittoon , preventing their continued migration to undesirable surfaces both inside and outside the casing 24 . thus , in operation the door 122 slides translationally back and forth in directions indicated by arrow 129 . fig6 shows a fourth embodiment of a trap door spittoon system 140 constructed in accordance with the present invention . in system 140 , the spittoon 80 is covered by a sliding trap door 142 . the trap door 142 rides in a pair of curved slots 144 , 145 formed within the chimney walls of spittoon 80 . the trap door 142 may be constructed of a flexible member , or a series of segments joined together to form a structure which functions in the manner of the traditional roll - top desk . the trap door 142 slides open when the pens 60 , 62 and / or the carriage 50 engage a contact pin or actuating arm 146 ( only pen 60 is shown for clarity ). after the spitting operation , the carriage moves the pens 60 , 62 from the spitting position , and the roll - top door 142 slides over the open spittoon mouth under the urging force of a bias member , such as a spring member 148 . thus , in operation the door 142 opens and closes the chimney mouth by sliding in directions indicated by arrow 149 . it is clear that other embodiments may be used to implement the concepts of the trap door spittoon system in accordance with the present invention , although the preferred alternative embodiments are illustrated . for instance , the pivoting trap doors 102 , 112 are opened through pivoting action about either of two axes which are orthogonal to the scanning axis 51 , here illustrated as located at axis 105 and axis 115 , respectively . in the alternate sliding embodiments , the motion of the trap door 122 is parallel to the scanning axis 51 , that is in the direction indicated by arrow 129 as the door slides open and closed . in contrast , the roll - top door 142 moves in directions both parallel and orthogonal to the scanning axis 51 , as indicated by arrow 149 . in another example , other trap door mechanism may be used in addition to the single trap doors illustrated , such as two door members , or multi - segmented doors , which may be arranged in an aperture configuration , for instance . the spring 148 illustrates a compression spring , whereas the spring 128 of fig5 is a tension spring . it is apparent to those skilled in the art , that a compression spring may also be employed in the straight sliding door system 120 of fig5 to push , rather than pull door 122 closed , by merely changing the location of the spring with respect to the chimney walls . for example , the spring 128 shown in fig5 may be replaced by a compression spring located between the trap door 122 and the opposite wall , that is the wall shown toward the right in fig5 . the same is true of the location of the spring force applied in the roll - top door system 140 of fig6 which may pull , rather than push the door 142 closed . it is also apparent that other types of biasing mechanism may be substituted for the illustrated springs . indeed , the doors may be closed by movement of the carriage 50 , through a camming engagement with the doors , for instance . in such an alternate embodiment , the actuating arms 106 , 116 , 126 , 146 may act as cam followers to engage a cam structure on the carriage 50 , or a cam structure may be formed on the doors 102 , 112 , 122 , 142 and actuated by a cam follower on the carriage 50 to open and / or close the doors . it is also apparent that a separate motor may also be used to drive the trap doors , although the preferred embodiment is to have the carriage operate the doors . by actuating the spittoon trap doors 102 , 112 , 122 , 142 with the carriage 50 , and / or the pens 60 , 62 , no additional mechanisms or servo motors are required to implement the preferred trap door system of aerosol control into currently available inkjet printing mechanisms . however , it is apparent that servo motors and the like may be incorporated into a printing mechanism if desired to open and close the trap doors 102 , 112 , 122 , 142 . for instance , such a servo mechanism or motor may operate the trap doors in response to a control signal sent by the printer controller 45 , which receives positional information about the carriage 50 , as described above with respect to the encoder strip 58 . indeed , operation of the tumbler 74 may be used to open and close the trap door , for example by locating a trap door actuator for selective engagement with a portion of the tumbler . the instant closing of the spittoon doors 102 , 112 , 122 , 142 as the printhead carriage 50 moves the pens 60 , 62 away from the spittoon region advantageously traps any spit - generated ink aerosol within the spittoon 80 . capturing the airborne floating ink satellites within the enclosed region of spittoon 80 then isolates their further movement , and allows the aerosol to eventually collect and coalesce on the interior walls of the spittoon . thus , this immediate capturing of the inkjet aerosol created during spitting advantageously isolates the aerosol from contaminating other components within the printer .	1
fig1 illustrates components of an exemplary wireless communication system . a mobile switching center 102 communicates with base stations 104 a - 104 k ( only one connection shown ). the base stations 104 a - 104 k ( generally 104 ) broadcasts data to and receives data from mobile stations 106 within cells 108 a - 108 k ( generally 108 ). the cell 108 is a geographic region , roughly hexagonal , having a radius of up to 35 kilometers or possibly more . a mobile station 106 is capable of receiving data from and transmitting data to a base station 104 . in one embodiment , the mobile station 106 receives and transmits data according to the code division multiple access ( cdma ) standard . cdma is a communication standard permitting mobile users of wireless communication devices to exchange data over a telephone system wherein radio signals carry data to and from the wireless devices . under the cdma standard , additional cells 108 a , 108 c , 108 d , and 108 e adjacent to the cell 108 b permit mobile stations 106 to cross cell boundaries without interrupting communications . this is so because base stations 104 a , 104 c , 104 d , and 104 e in adjacent cells assume the task of transmitting and receiving data for the mobile stations 106 . the mobile switching center 102 coordinates all communication to and from mobile stations 106 in a multi - cell region . thus , the mobile switching center 102 may communicate with many base stations 104 . mobile stations 106 may move about freely within the cell 108 while communicating either voice or data . mobile stations 106 not in active communication with other telephone system users may , nevertheless , scan base station 104 transmissions in the cell 108 to detect any telephone calls or paging messages directed to the mobile station 106 . one example of such a mobile station 106 is a cellular telephone used by a pedestrian who , expecting a telephone call , powers on the cellular telephone while walking in the cell 108 . the cellular telephone scans certain frequencies ( frequencies known to be used by cdma ) to synchronize communication with the base station 104 . the cellular telephone then registers with the mobile switching center 102 to make itself known as an active user within the cdma network . when detecting a call , the cellular telephone scans data frames broadcast by the base station 104 to detect any telephone calls or paging messages directed to the cellular telephone . in this call detection mode , the cellular telephone receives , stores and examines paging message data , and determines whether the data contains a mobile station identifier matching an identifier of the cellular telephone . if a match is detected , the cellular telephone establishes a call with the mobile switching center 102 via the base station 104 . if no match is detected , the cellular telephone enters an idle state for a predetermined period of time , then exits the idle state to receive another transmission of paging message data . when attempting to place a call , the mobile station 106 sends a connection request to the base station 104 . if a traffic channel is available , the mobile station 106 connects to the base station and transmits the call information along the traffic channel . however , if no traffic channel is available , the mobile station 106 waits a predetermined amount of time and then attempts to reconnect . fig2 illustrates the process 200 used by a mobile station 106 under the current cdma standard after an initial attempt to connect has failed . the process 200 begins at a start state 205 . proceeding to state 210 , the mobile station 106 initializes a reconnect timer and waits for the time out . under the is - 707 standard , the timer is initialized at approximately four seconds . after the timer has elapsed , the process 200 proceeds to state 215 and again attempts to connect to the base station 104 . proceeding to state 220 , the mobile station 106 determines whether service with the base station 104 has been connected or rejected , or if the mobile station 106 was unable to communicate with the base station 104 . if the connection with the base station 104 is successful , the mobile station 106 proceeds along the yes branch and the connection process terminates in end state 250 . returning to state 220 , if the connection with the base station 104 is unsuccessful , the mobile station 106 proceeds along the no branch to state 225 where the mobile station 106 determines whether the timer is at the maximum allowable value . if the timer is at the maximum value , the mobile station 106 proceeds along the yes branch to state 235 , where the mobile station waits for the timer to time out . returning to state 220 , if the time is not at the maximum value , the mobile station 106 proceeds along the no branch to state 230 , where the value of the time is quadrupled . after quadrupling the timer value , the mobile station proceeds to state 235 to wait for the timer to time out . after the timer expires in state 235 , the mobile station 106 proceeds to state 240 and attempts to reconnect to the base station 104 . if the connection with the base station 104 is successful , the mobile station 106 proceeds along the yes branch and the connection process terminates in end state 250 . returning to state 245 , if the connection with the base station 104 is unsuccessful , the mobile station 106 proceeds along the no branch to state 225 where the mobile station 106 again determines whether the timer is at the maximum allowable value . every time the mobile station 106 unsuccessfully attempts connection with the base station 104 , the mobile station 106 quadruples the wait timer until a maximum value is met . after time out of the wait timer , the mobile station reattempts connection with the base station 104 . an example of a series of mobile stations 106 attempting to communicate with the base station 104 according to the existing is - 95 standard will now be described . one scenario in which reconnection collision is likely is when multiple mobile stations 106 attempt to communicate with the base station at approximately the same time . this may occur , for example , after the base station 104 broadcasts an alert message to all the mobile stations 106 . other examples may be when the mobile stations 106 are programmed to communicate with the base station 104 at a predetermined time or after a predetermined event . for example , if ten mobile stations 106 simultaneously attempt to connect to one available channel of the base station 104 , only one of the mobile stations 106 can successfully connect . the other nine mobile stations 106 then initialize their respective reconnection timers at four seconds . because each of the mobile stations 106 initialize the reconnection timers at approximately the same time , the timers will time out at approximately the same time . thus , all nine of the mobile stations 106 attempt to reconnect at the same time , causing further reconnection collision . at this time , the mobile stations 106 quadruple the value of the reconnection timers . however , because each timer is set for four seconds , after quadrupling , each timer is set for sixteen seconds . once again , the reconnection timers time out at approximately the same time and all of the mobile stations 106 again attempt to reconnect at the same time . this process repeats and the reconnection timer value quadruples to 64 seconds . however , time out of each of the mobile stations 106 occurs at the same time , and the mobile stations 106 again attempt to simultaneously reconnect to the base station 104 , thereby causing further reconnection collision . meanwhile , during the 64 seconds the timer is counting , it is possible the base station 104 is available . this process repeats , quadrupling the reconnection timer until a maximum value is reached ( approximately 4096 seconds ) and until all the mobile stations 106 eventually communicate with the base station 104 . the present invention attempts to reduce the reconnection collision rate and unsuccessful reconnection attempts by intelligently assigning reconnection times to the mobile stations 106 . rather than simply incrementing a set value as in the current standard , the present invention processes data relevant to the connection process and determines a reconnection time for each mobile station 106 based on that data . according to the present invention , when insufficient resources are available to support all the mobile station 106 connection requests , the base station 104 collects data on resource capability , client connects pending , timing and amount of data on pending and active connects , or any other factor that may influence reconnect collision or resource contention . the base station 104 may either transmit this data to each mobile station 106 or use the data to calculate a reconnection time for each mobile station 106 . if the mobile station 106 receives the data , the mobile station 106 may use the data to calculate a new reconnection time . fig3 illustrates a process 300 used by a base station 104 under the present invention after an initial attempt to connect has failed . the process 300 begins at a start state 305 . proceeding to state 310 , the base station 104 collects data from the mobile stations 106 and the memory of the base station 104 . as stated above , this data may include resource capability , client connects pending , timing and amount of data on pending and active connects , or any other factor that may influence reconnect collision . typically , the base station 104 has knowledge of the resource capacity , the active connections , and the recent connection requests . the base station may collect additional information from each mobile station 106 such as the expected duration of the connection and the priority of the request . proceeding to state 315 , the base station 104 processes the data and determines an appropriate reconnection timing pattern for each mobile station 106 . in determining the reconnection timings , the base station 104 balances , among other factors , the contention on the resource used to request connections , the contention of requests for packet data service resources , the probability of idle packet data service resources when mobile stations 106 are waiting to connect , and varying quality of service requirements by the mobile stations 106 ( for example , a mobile station 106 transmitting data may require a different quality connection than a mobile station 106 transmitting only voice communications ). by balancing the multiple factors , the base station 104 assigns reconnection times to each of the mobile stations 106 . proceeding to state 320 , the base station 104 transmits the reconnection data and / or the reconnection timing instructions to the mobile stations 106 . if only the reconnection timing instructions are transmitted , the mobile stations 106 are assigned a new reconnection time . if only the reconnection data is transmitted , the mobile stations 106 can calculate their own reconnection times based on the data . if both the reconnection timing instructions and the reconnection data are transmitted , the mobile station 106 may either accept the base station 104 recommendation for reconnection timing or calculate a new reconnection time . the process 300 then terminates in end state 325 . fig4 illustrates a process 400 used by a mobile station 106 under the present invention after an initial attempt to connect to the base station 104 has failed . the process 400 begins at a start state 405 . proceeding to state 410 , the mobile station 106 receives the reconnection data and / or the reconnection timing instructions from the base station 104 . proceeding to state 415 , the mobile station determines if the base station 104 provided suggested reconnection timing instructions . as stated above , the base station 104 may calculate desired reconnection timing instructions from the reconnection timing data , or may simply send the reconnection timing data to the mobile stations . if the base station 104 provided reconnection timing instructions , the process 400 proceeds along the yes branch to state 425 and determines whether to accept the timing instructions . the mobile station 106 may either accept the timing instructions from the base station or may reject the instructions . in an alternative embodiment of the invention , the mobile station 106 may be required to accept the instructions of the base station 104 . if the mobile station 106 accepts the timing instructions from the base station 104 , then the process 400 proceeds along the yes branch to state 430 . returning to state 425 , if the mobile station rejects the timing instructions from the base station 104 , the process 400 proceeds along the no branch to state 420 . returning to state 415 , if the base station 415 did not provide timing instructions , the process 400 proceeds along the no branch to state 420 . in state 420 , the mobile station 106 processes the reconnection data provided by the base station 104 and determines an appropriate reconnection timing pattern . in determining the reconnection timings , the mobile station 106 balances , among other factors , the recommended wait time if provided , the number of mobile stations refused since the last granted connection , the ratio of client requested resources that were refused , or use of a delay indicator that is an index into a delay timeout table . the delay timeout table can be predefined , downloaded , or updated by the base station 104 . the delay indicator can also indicate the expected rate or duration when a resource is available . by balancing the multiple factors , the mobile station 106 can select an appropriate reconnection time . after the reconnection time is established , the process 400 proceeds to state 430 . in state 430 , the mobile station 106 waits for the reconnection timer to time out or for the specific reconnection time to be reached . after the timer has elapsed , the process 400 proceeds to state 435 and again attempts to connect to the base station 104 . proceeding to state 440 , the mobile station 106 determines whether service with the base station 104 has been connected or rejected , or if the mobile station 106 was unable to connect with the base station 104 . if the connection with the base station 104 is successful , the mobile station 106 proceeds along the yes branch and the connection process terminates in end state 445 . returning to state 440 , if the connection with the base station 104 is unsuccessful , the mobile station 106 proceeds along the no branch to state 415 where the mobile station 106 repeats the process of obtaining a new reconnection time until successfully connected to the base station 104 . when determining the reconnection timing , a base station 104 may process data including the mobile station 106 identifier , the time of the first resource request ( t o ), the time of the most recent resource request ( t r ), the most recent reconnect indication that the base station 104 sent to the mobile station 106 ( t i ), the time of assignment of a resource ( t a ), and the expected duration of an assignment of a resource ( t d ). if the mobile station 106 is pending on the resource , then the expected assignment of the resource is at the next reconnect attempt ( t a = t r + t i ). otherwise , the time of assignment t a is known . therefore , the base station 104 can compute an expected completion time ( t c = t a + t d ). if all of the resources are in use , the base station 104 can compute an expected time until a resource is expected to be free ( t m = min ( t c − t ), where t is the current time ). the base station 104 may also assign a reconnect time to a mobile station 106 expecting a resource to be free at a particular time . if the resource becomes available early , the base station 104 may reject any intervening requests for that resource to favor the assigned mobile station 106 . an example of the present invention is a scenario in a cdma 2000 system where many mobile stations 106 need to use the limited resources of a base station 104 . the base station 104 can determine the loading on the paging channels , the access channels , and any supplemental channels . the base station 104 can also approximate how long each mobile station 106 may remain connected . the base station 104 uses this information to determine the earliest expected time that a mobile station 106 could be reconnected and may assign a reconnection time as appropriate . for example , a base station 104 may have no available resources but expects that a single resource will become available in approximately 30 seconds while the other resources are expected to be in use for a longer period of time . if a first mobile station 106 requests a connection for 60 seconds and a second mobile station 106 requests a connection after the first mobile station 106 . the base station 104 may send a reconnection indication of 1 second to the first mobile station 106 and a reconnection indication of 61 seconds to the second mobile station 106 . therefore , the second mobile station 106 would attempt to reconnect after the first mobile station 106 is expected to be finished with the resource . numerous variations and modifications of the invention will become readily apparent to those skilled in the art . accordingly , the invention may be embodied in other specific forms without departing from its spirit or essential characteristics . the detailed embodiment is to be considered in all respects only as illustrative and not restrictive and the scope of the invention is , therefore , indicated by the appended claims rather than by the foregoing description . all changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope .	7
fig1 illustrates a type h tightlock coupler 100 in accordance with a conventional approach . type h tightlock coupler 100 comprises a shank 110 , a head 112 , a knuckle 114 , and a knuckle pivot pin 116 . knuckle 114 is coupled to head 112 by pivot pin 116 on the knuckle - arm side 120 of head 112 , opposite a guard arm side 122 . knuckle 114 may pivot generally about knuckle pivot pin 116 such that knuckle 114 may close ( as illustrated ) and open ( not illustrated ) in order to couple and decouple adjacent rail cars , respectively . type h tightlock coupler 100 comprises a channel 132 . channel 132 is located at the opposite end of shank 110 from head 112 . channel 132 may be used to facilitate coupling type h tightlock coupler 100 to other components , including , for example a radial connector , a yoke , a coupler carrier , draft gear , and / or a centering device . type h tightlock coupler 100 may be distinguished from a type e or type f coupler , or other couplers by the dimensional contour of coupler head 112 , which is set forth by the mechanical committee of standard coupler manufacturers . the contour of head 112 allows a reduction in slack , e . g . the amount of free movement of a particular car . reducing slack between adjacent cars allows type h tightlock couplers to be used in applications where a rail operator may desire particular performance indicators . for example , type h tightlock couplers may be used to couple passenger cars in order to reduce objectionable shocks and / or noise often attributed to couplers . type h tightlock coupler 100 may include a variety of other components not visible in this illustration . for example , type h tightlock coupler 100 may include a lock that is operable to prevent knuckle 114 from opening during transit or during rest . in various embodiments , type h tightlock couplers may include a lock lift assembly , which includes one or more components operable to lift the lock within a chamber in the coupler head . moving the lock within the chamber may allow the knuckle to move and thus couple or decouple an adjacent car . conventional type h tightlock couplers typically employ bottom operating lock lift assemblies . fig2 illustrates a cut - away view of a conventional type h tightlock coupler . type h tightlock coupler 200 comprises a coupler head 212 . coupler head 212 comprises a chamber 234 , an upper surface 224 and a back surface 226 . chamber 234 is formed in part by the interior surfaces of upper surface 224 and back surface 226 . as is illustrated , the transition from upper surface 224 to back surface 226 includes a sloped portion . chamber 234 has a corresponding , sloped interior surface . other conventional couplers , such as type e and type f couplers , have coupler heads and interior chambers that differ from the illustrated type h tightlock coupler in various regards . type e and type f couplers , for example , include a generally more rectangular coupler head and , as a result , the transition between an upper surface and a back surface is more angular . correspondingly , an interior chamber in a type e or type f coupler is more rectangular as well . similar to conventional type h tightlock couplers , type e and type f couplers often employ bottom operating lock lift assemblies . certain type e and type f couplers may alternately employ a top operating lock lift assembly . the geometry of the type e and type f coupler heads facilitates the application of a top operating lock lift assembly in that the generally flat upper surface of these couplers easily allows for a channel necessary for a top operating lock lift assembly . additionally , the angular dimensions of the head more easily allow for the inclusion of an anti - creep shelf . an anti - creep shelf is a surface that extends into an interior chamber of a coupler head that may prevent inadvertent movement of a lock lift assembly by limiting movement of one or more components of the assembly . conventional wisdom holds that type h tightlock couplers are ill - suited for top operating lock lift assemblies because the sloped dimensions of the type h tightlock coupler head make inclusion of a top channel and an anti - creep shelf within an interior chamber difficult and / or impossible . however , contrary to conventional wisdom , the teachings of the disclosure recognize that it is possible to use a top operating configuration with a type h tightlock coupler . fig3 through 7 illustrate this new approach . in various embodiments , a type h tightlock coupler may be configured to include a channel into an interior chamber and an anti - creep shelf within the interior chamber , as well as components for a lock lift assembly that include a surface or surfaces to interface with the anti - creep shelf . departing from the traditional method and employing a top operating type h tightlock coupler may reduce risks of wear and / or damage to the lock lift assembly , may reduce failure rates and / or improve operation of the lock lift assembly , may reduce manufacturing and / or maintenance costs , may reduce risk of injury and / or death to rail industry personnel involved with the coupling and decoupling of rail cars , and may provide additional or alternative benefits . fig3 illustrates a type h tightlock coupler in accordance with particular embodiments of the disclosure and includes an exploded view of a type h tightlock coupler 300 . type h tightlock coupler 300 comprises a shank 310 , a head 312 , a knuckle thrower 313 , a knuckle 314 , a knuckle tail 315 , a knuckle pivot pin 316 , a wear plate 318 , a lock 340 , a link 350 , and a plug 360 . type h tightlock coupler also comprises a channel 330 , a channel 332 , and a chamber 334 . channel 330 is located on an upper surface 324 of head 312 and forms an opening into chamber 334 . when coupler 300 is in use , upper side 324 faces skyward . when type h tightlock coupler 300 is constructed , lock 340 is positioned essentially behind knuckle 314 within chamber 334 . link 350 and plug 360 together comprise a top operating lock lift assembly that is operable to lift lock 340 within chamber 334 . plug 360 is coupled to link 350 and link 350 is coupled to lock 340 . to operate the top operating lock lift assembly when type h tightlock coupler 300 is constructed , plug 360 , which is partially fitted within channel 330 , is lifted upward from upper surface 324 causing link 350 to move upward from within chamber 334 into channel 330 , which in turn , causes lock 340 to move upward within chamber 334 . lifting lock 340 within chamber 334 may cause knuckle thrower 313 to throw knuckle 314 open . in various embodiments , type h tightlock coupler 300 may comprise additional components . for example , in various embodiments , coupler 300 may also include an operating mechanism that is operable to lift plug 360 upward within channel 330 so as to operate the lock lift assembly . suitable operating mechanisms may comprise levers , rods , and / or a variety of other components . in various embodiments , the operating mechanism may be operated mechanically , electronically , or by hand . in particular embodiments , the operating mechanism may be intended to be operated mechanically or electronically , and may also be operated by hand . fig4 a and 4b illustrate another type h tightlock coupler in accordance with particular embodiments of the disclosure . fig4 a illustrates a cut - away view of a type h tightlock coupler 400 that comprises a head 412 , a knuckle 414 , a knuckle arm side 420 , a guard arm side 422 , a top surface 424 , an anti - creep shelf 425 , a channel 430 , and a chamber 434 . type h tightlock coupler 400 further comprises a lock 440 with a lock bar 445 , and a top operating lock lift assembly , which includes a link 450 , a link hook 452 , a link channel 456 , a plug 460 , a plug ledge 462 , and a plug pin 464 . accordingly , inside chamber 434 at the bottom of link 450 , link 450 is coupled to lock 440 by hooking link hook 452 to lock bar 445 . at the top of link 450 , link 450 is also coupled to plug 460 by virtue of plug pin 464 , which is inserted in link channel 456 . as illustrated , lock 440 and the lock lift assembly are illustrated in the closed or locked position . in the locked position , knuckle 414 is closed such that it will not decouple from an adjacent car if coupled or couple with an adjacent car if decoupled . in the locked position , lock 440 is located between one side of a knuckle tail 415 and an interior wall ( not illustrated ) of chamber 434 on the guard arm side 422 . in various embodiments , lock 440 may be supported or seated partly on a support ledge of the knuckle tail and partly on a knuckle thrower ( not illustrated ). in the locked position , plug 460 rests in part on upper surface 424 and extends through channel 430 into chamber 434 . anti - creep shelf 425 extends from the sloped portion of the interior surface of chamber 434 into chamber 434 and includes a bottom surface that is generally horizontal . in various embodiments , the anti - creep shelf may extend only from the top surface of chamber 434 or only from the back surface of chamber 434 . in certain embodiments , anti - creep shelf 425 may or may not have any edges within chamber 434 and it may be larger or smaller than illustrated . plug ledge 462 includes a generally horizontal surface that , in locked position , is opposite the bottom surface of anti - creep shelf 425 . in the locked position , plug 460 may not be accidently pulled upward or bounce upward through channel 430 due to oscillations attributable to jostling , bumpiness , or other disturbances encountered during rail transit . should type h tightlock coupler 400 encounter , for example , a bump during transit , plug 460 may be prevented from moving upward through channel 430 because plug ledge 462 will move upward and make contact with anti - creep shelf 425 , which in turn prevents further upward movement of plug 460 . in particular embodiments , a longitudinal axis of channel 430 may be angled with respect to a line perpendicular to top surface 424 . for example , as illustrated , channel 430 may angle slightly away from anti - creep shelf 425 and towards knuckle 414 . when a generally upward force is exerted on plug 460 , the angle of channel 430 may facilitate movement of plug 460 through channel 530 such that plug ledge 462 does not come into contact ( or minimizes contact ) with anti - creep shelf 425 . fig4 b illustrates another view of type h tightlock coupler 400 and includes a lock slot 444 and a link ledge 454 . link 450 comprises hook 452 ( not illustrated ) located at the bottom of link 450 and link ledge 454 located at the top of link 450 . link 450 is coupled to lock 440 by hook 452 . in particular , when link 450 moves upward within chamber 434 , hook 452 hooks , or catches , bar 445 within lock slot 444 located in the back of lock 440 and pulls lock 440 upward as well . link ledge 454 is a generally horizontal surface that , in locked position , is opposite the bottom surface of anti - creep shelf 425 . in this position , link 450 may not be accidently pulled upward or bounce upward through channel 430 ( not illustrated ) due to oscillations of a rail car as described above with respect to plug 460 . link 450 is also coupled to plug 460 via plug pin 464 . the bottom portion of plug 460 includes a channel or hole ( not illustrated ) that is adjacent to link channel 456 . plug pin 464 is inserted through these openings so as to couple link 450 and plug 460 . in various embodiments , link 450 and plug 460 may be coupled together in any suitable fashion . in some embodiments , plug pin 464 may be integral with plug 460 . in certain embodiments , link 450 and plug 460 may be one contiguous or jointed component . further , in particular embodiments , plug 460 may be slotted , such that the bottom portion of plug 460 is configured to receive the upper portion of link 450 and is adjacent to both sides of the upper portion of link 450 . as described here , when top operating type h tightlock coupler 400 is in a locked configuration , both plug ledge 462 ( not illustrated ) and link ledge 454 may come into contact with anti - creep shelf 425 in order to prevent the upward movement of the lock lift assembly , which could move the lock from a locked position to a lockset or unlock position . reducing the likelihood of inadvertently moving the lock into the lockset or unlock position may decrease or eliminate the chance of accidental and / or unanticipated decoupling of adjacent rail cars . the risk of unintended movement of the lock lift assembly may be further reduced by virtue of the location of the top operating configuration . for example , the coupler head may shield the plug from debris and other agents present on certain rail tracks that would otherwise have the potential to strike and / or move the plug . fig5 illustrates another type h tightlock coupler in accordance with particular embodiments of the disclosure . fig5 illustrates type h tightlock coupler 500 that comprises a coupler head 512 , a knuckle 514 , an anti - creep shelf 525 , a guide rib 529 , a channel 530 , a chamber 534 , a lock 540 , a link 550 , and a plug 560 . lock 540 comprises an upper lock body portion 542 , a lock bar 545 , a fulcrum 546 ( partially illustrated ), a leg portion 548 , and a lock set seat 549 . link 550 comprises a hook 552 , a link ledge 554 , and a channel 556 . plug 560 comprises a plug ledge 562 and a plug pin 564 . lock 540 , as illustrated , is in an unlocked or open position . in the unlocked position , plug 560 has been pulled fully and link 550 has been pulled partially through channel 530 . in order to pull plug 560 through channel 530 without engaging plug ledge 562 with anti - creep shelf 525 as described in conjunction with fig4 , plug 560 is pulled upward out of channel 530 . in various embodiments , the hole located at the top of plug 560 is not centered over channel 530 ( see fig4 a ), thus , when a generally upward force is exerted via this hole in plug 560 , plug 560 will move through channel 530 such that plug ledge 562 does not come into contact with anti - creep shelf 525 . as plug 560 moves upward through channel 530 , plug pin 564 will move from the bottom to the top of channel 556 in link 550 . this movement causes link 550 to shift from a generally angled position with respect to plug 560 to a less angled , more in - line position , which allows link 550 to move through channel 530 with limited or no contact between link ledge 554 and anti - creep shelf 425 . because link 550 is coupled to lock 540 by lock bar 545 , the upward force that moves plug 560 and link 550 through channel 530 also moves lock 540 upward within chamber 534 . guide rib 529 extends into chamber 534 from the knuckle side wall , starting at the top wall of chamber 534 and extending downward toward the bottom of the chamber . guide rib 529 serves to limit lateral displacement of lock 540 in chamber 534 during its upward and downward travel . in the unlocked position , upper lock body portion 542 is located in the upper - most portion of chamber 534 . in this position , fulcrum 546 engages with a shoulder of a front wall of chamber 534 . the continued application of an upward force causes lock 540 to rotate about fulcrum 546 , driving leg portion 548 rearward in chamber 534 . this shift in orientation of lock 540 also shifts the orientation of link 560 . in particular , as lock 540 rotates about its fulcrum 546 , lock bar 545 pushes hook 552 rearward in chamber 534 , which may cause link 550 to pivot about plug pin 564 , such that link ledge 554 moves away from plug ledge 562 . in contrast , as discussed in conjunction with fig4 , when link ledge 554 and plug ledge 562 are located inside chamber 534 , the ledges may be aligned and / or may both operate to prevent unintended movement of the lock lift assembly by engaging with anti - creep wall . in various embodiments , plug 560 , link 550 , and lock 540 may be coupled and / or configured in any suitable way such that lock 540 may be pulled upward and out of lock position . in addition to the lock and unlock position described above , lock 540 may also be positioned in a lock set position ( not illustrated ). in the lock set position , upper body portion 542 is located at a mid - point within chamber 534 , e . g ., between its locked and unlocked position . lock set seat 549 rests on a top surface of a knuckle thrower ( not illustrated ). knuckle 514 may revolve about a knuckle pin ( not illustrated ) such that knuckle 514 may swing into an open position , for example , when a nose , or front , of an adjacent , coupled knuckle exerts a forward pull as its corresponding rail car pulls away . when lock 540 is moved from the lock set position to the unlock position by an upward force exerted by link 550 , leg 548 engages the knuckle thrower and causes it to rotate . this rotation produces movement of knuckle 514 about the knuckle pin into the open position , so as to allow for decoupling of an adjacent car . conversely , in various embodiments , when knuckle 514 moves from an open to a closed position , lock 540 will drop due to gravity from the unlocked or lock set position to the lock position and lock knuckle 514 in place as described in conjunction with fig4 a and 4b . utilizing a top operating lock lift assembly in a type h tightlock coupler may improve coupling and decoupling by reducing the incidence of malfunctioning components and / or by reducing the time required to move a lock into a desired position . in addition , utilizing a top operating lock lift assembly may be more convenient for rail personnel or other operators who are in a corresponding rail car . a bottom operating assembly , in contrast , may require personnel to exit the rail car in order to access the assembly . fig6 a and 6b illustrate a lock in accordance with particular embodiments of the disclosure . lock 600 comprises an upper body portion 642 and a leg portion 648 . upper body portion 642 comprises back portions 643 , a slot 644 , a lock bar 645 , and a fulcrum 646 . leg 648 comprises a protrusion 647 and a lock set seat 649 . to work with a top operating lock lift assembly for a type h tightlock coupler , lock 600 must be modified from the locks conventionally used in type h tightlock couplers . in particular , lock 600 is modified to include slot 644 and lock bar 645 . slot 644 is an open channel formed between back portions 643 . within slot 644 , lock bar 645 extends from one back portion 643 to another back portion 643 . as discussed in conjunction with fig4 a , 4b , and 5 , lock bar 645 is configured to allow a hook to couple a lock lift assembly to lock 600 . in various embodiments , the slot may omit the bar and alternately include a surface operable to receive and couple a link hook . in certain embodiments , the slot may occupy a greater or lesser portion of the upper body portion of lock 600 . other features of lock 600 may facilitate improved and / or optimal deployment of the top operating lock lift assembly . for example , fulcrum 646 allows for additional pivoting by lock 600 and / or the link coupled to lock 600 . protrusion 647 allows lock 600 to rest on a knuckle thrower during lock set as described in conjunction with fig5 . in certain embodiments , lock 600 may include additional or alternate features . in various embodiments , lock 600 may be further modified to alter or improve its performance within a type h tightlock coupler with a top operating configuration . fig7 a and 7b illustrate a link in accordance with particular embodiments of the disclosure . link 700 comprises a hook 752 , a link ledge 754 , and a channel 756 . channel 756 includes generally circular portions 757 and 759 , and a joining portion 758 . to work with a top operating lock lift assembly for a type h tightlock coupler , link 700 had to be modified from the links conventionally used in type h tightlock couplers . in particular , the dimensions of link 700 were altered . for example , in certain embodiments , the length of link 700 was reduced in comparison to type e and type f links in order to allow use within a chamber of a type h tightlock coupler . hook 752 allows link to couple and to lift a lock as described in conjunction with fig4 a , 4b , 5 , 6a and 6b . link ledge 754 may engage with an anti - creep shelf within a coupler head to reduce the chance of inadvertent lock lift assembly operation and / or resulting decoupling . channel 756 is operable to receive a pin in order to couple link 700 with a plug as discussed in conjunction with fig3 , 4 a , 4 b , and 5 . channel 756 is an irregular shape and includes two generally circular portions 757 and 759 connected by a joining portion 758 . channel 756 permits link 700 to move about a coupling pin within a lock lift assembly . for example , when link 700 is in lock position , the coupling pin is located in portion 757 . as a plug in the lock lift assembly moves upward , the coupling pin will move from portion 757 to portion 758 and then to portion 759 . the movement of the coupling pin within channel 756 allows lock 700 to move from a generally angled position with respect to the plug in the lock lift assembly , to a generally less angled , more in - line position . this movement helps to ensure that link ledge 754 does not engage with the anti - creep shelf within the coupler head . this additional mobility may also increase various other performance characteristics in a type h tightlock coupler with a top operating configuration . in various embodiments , any or all of these three portions are sized sufficiently to receive a pin for coupling . in certain embodiments , channel 756 may be any suitable size or shape . in certain embodiments , link 700 may include additional or alternate features . in various embodiments , lock 700 may be further modified to alter or improve its performance within a type h tightlock coupler with a top operating configuration . contrary to conventional thinking , this disclosure evidences that it is possible to overcome the challenges associated with deploying a top operating lock lift assembly within a type h tightlock coupler . despite the sloped dimensions of the type h coupler head , it is possible to include a channel for top operating components and an anti - creep shelf . further , it is possible to modify various components of a type h coupler , in particular a plug , link , and / or lock , in order to utilize a top operating configuration . technical advantages of using a top operating type h tightlock coupler may include reduced risk of wear and / or damage to the lock lift assembly , reduced failure rates and / or improved operation of the lock lift assembly , reduced manufacturing and / or maintenance costs , reduced risk of injury and / or death to rail industry personnel involved with the coupling and decoupling of rail cars , or other advantages . additional and / or alternative advantages may include various direct or indirect economic benefits , for example reduced worker compensation costs , various reputational benefits associated with a smoother , quieter , or more enjoyable ride for passengers , and / or various logistical benefits associated with more reliable coupling and decoupling of rail cars , and in particular , passenger rail cars . top operating type h tightlock couplers may also satisfy rail industry demand based on safety concerns and convenience interests for a top operating system that does not require rail personnel to dismount a rail car to operate the system . although the present invention has been described in detail with reference to particular embodiments , it should be understood that various other changes , substitutions , and alterations may be made hereto without departing from the spirit and scope of the present invention . for example , although particular embodiments of the disclosure have been described with reference to a number of elements included within a top operating type h tightlock coupler , these elements may be combined , rearranged or positioned in order to accommodate particular requirements or needs . for instance , the anti - creep shelf may be larger or smaller or situated at any suitable location within the chamber of the coupler head . in particular embodiments , the coupling between various components such as the plug and link or link and lock may be configured differently . further , in certain embodiments , the lock lift assembly may be configured differently within the chamber of the coupler head . various embodiments contemplate great flexibility in the arrangement of the lock lift assembly and other components .	1
a wind energy installation which is intended to carry out the method according to the invention has a substructure which is in the form of a tower 1 and has a machine house 2 fitted to it . most of the major components of the wind energy installation are arranged in or on this substructure . a rotor 3 is arranged on one end face of the machine house 2 , such that it can rotate by means of a rotor shaft 50 . via this rotor shaft 50 , the rotor 3 drives a generator 5 arranged in the machine house 2 , possibly via a gearbox . the generator 5 may be in various forms , and may be a dc generator , a single - phase generator or a three - phase generator . furthermore , it may be a synchronous machine or an asynchronous machine , with a single or double feed . the generator 5 is preferably in the form of a double - fed asynchronous machine . the generator 5 is connected to an electrical supply grid system 9 via a converter 7 and connecting lines which are not illustrated in any more detail . furthermore , a control device 6 is provided , and controls the operation of the wind energy installation . a measurement device 23 is provided in order to determine the electrical power output . the measured electrical power is preferably the real power p , since this is a better measure than the volt - amperes or the wattless component of the power actually produced by the wind energy installation . however , it is also possible to provide for the electrical energy output to be used rather than the power . this has the advantage that integration is carried out automatically in the case of measurements over a relatively long time period . the meter that is provided in any case for the energy output in the wind energy installation ( kilowatt - hours meter ) can expediently be used for this purpose . this not only saves a separate sensor but automatically results in integration of the power signal , thus reducing undesirable noise in the measurement signal . it is also possible to use other parameters which represent a measure of the energy or power output from the rotor / generator system . in particular , it is possible to use the mechanical torque emitted from the rotor or the electrical torque produced by the generator , which can be used for formation of the efficiency measure , with or without rotation - speed assessment , depending on the operating range . the design of the control device 6 is illustrated schematically in fig3 . the measurement device 23 for the electrical power output is connected to an analog / digital converter 61 . this is designed to convert the signals supplied from the measurement device 23 to data in a data record at regular , variable time intervals . the data record is transmitted via a connecting line to a central control unit 60 . the central control unit 60 has a microprocessor 62 for running the control and operating programs that are required for operation of the wind energy installation . a memory 64 is also connected to the central control unit 60 . the generator 5 and the converter 7 are connected to outputs of the central control unit 60 . furthermore , a blade angle adjustment device 4 is connected to one output of the central control unit 60 , and this will be explained in more detail in the following text . the blade angle adjustment device 4 is used to adjust the pitch angle a of the rotor blades 31 . as is illustrated in fig2 , the angle a is the angle included between a representative profile chord 39 of the rotor blade 31 and the rotation plane of the rotor , the normal to which is defined by the rotor shaft 50 . fig2 shows a view of the blade tip 32 of one of the rotor blades 31 illustrated in fig3 . the profile chord 39 connects the leading edge 35 , which is located in the front area , to the trailing edge 34 of the rotor blade 31 . the rotor blade 31 is anchored in the hub 4 by its blade root 33 . the rotor blade 31 is twisted , such that the profile chord results in a pitch angle which becomes continuously greater starting from the blade tip 32 to the blade root 33 . the blade root 33 preferably has a circular shape in the area of the hub 4 , so that the rotor blade 31 can be pivoted about the center point of the circle . the blade adjustment device 4 has a drive motor 40 , which is arranged in the tip of the hub 4 and on whose power - output shaft an angle gearbox is arranged , comprising a large gearwheel 41 and a pinion 42 . the pinion 42 engages in a circumferential tooth system which interacts with the blade root 33 . this means that the rotor blade 31 can be pivoted on operation of the drive motor 40 , as is symbolized by the double - headed arrow 49 illustrated in fig2 . the procedure for the method according to the invention will now be explained , with reference to fig4 a . the wind energy installation is initialized at the start 100 of the method . this means that interval limit values are set , old data is deleted from memories and , apart from this , the wind energy installation is prepared for operation in a manner known per se . initial steps for the invention during the initialization process 102 are the starting of a timer t and the definition of an operating value α b for a parameter to be optimized as a first value , with which operation will be started . this value can be defined in a manner known per se , as would be done in a wind energy installation without using the method according to the invention . after initialization , the optimization process 104 according to the invention can commence . reference is now made to fig5 . starting from the operating value α b an upper and a lower interval limit value α u and α l , respectively , are each set in a first step 110 , by adding an initial stress value α off to the operating value α b , or subtracting it from the operating value α b . a sample counter i is set to zero . one of the two interval limit values is then set at the start of a cycle , the interval limit value α l in the illustrated exemplary embodiment ( step 112 ). the rotor blades 31 are set to a first value α ( i )= α l by means of the adjustment device 4 . the wind energy installation is then operated using this pitch angle ( step 114 ). in this case , the control device 6 uses the measurement device 23 to record the electrical energy output over a specific time period , possibly as well as other parameters . the measurement vector z ( α l ) determined in this way is stored , after a / d conversion ( if necessary ) as a data record d l ( i ) in the memory 64 ( step 116 ). in the next step 118 , the pitch angle α ( i ) is changed to the upper interval limit value α u , and the wind energy installation is operated with this changed pitch angle ( step 120 ). as before , a measurement vector is formed from data from the measurement device 23 and possibly from other parameters , and is stored in the memory 64 , to be precise as a data record for the upper value d u ( i ) ( step 122 ). this completes a sampling process with alternate operation of the wind energy installation using the upper and the lower interval limit value . in order to complete the process , the sample counter i is now incremented by one step ( step 124 ). if the number of samples taken in this way is less than a predetermined limit n , then samples are once again taken from the step 112 until the number of samples is equal to the preselectable value n ( step 126 ). by way of example , the values of n are in the range between 100 and 100 000 , and a range between 1 000 and 10 000 has been particularly proven . the number is preferably variable , for example as a function of the variance of the parameters included in the data records . the time period over which a sample is taken is expediently chosen as a function of the parameter under consideration . in the illustrated exemplary embodiment , using the pitch angle α , the time duration is expediently between 10 and 120 seconds . if a torque characteristic is used as the parameter , the time period is expediently between 30 seconds and 10 minutes , and for control parameters it is expediently between 10 seconds and 10 minutes . for more dynamic variables , such as converter parameters , a shorter time period is preferable , for example of between 10 milliseconds and 30 seconds . the choice of this time period is based on the knowledge that it is preferably chosen until non - stationary effect are eliminated , such as those caused by inertia of the air flow ( dynamic wake ). after completion of the sampling process , the evaluation process starts with step 128 . the data records contained in the memory 64 for the lower and upper pitch angles d l ( i ) and d u ( i ) are called up and evaluated for all ( i ) from 0 to n − 1 . the evaluation process may relate to all of the elements in the data record , or else only to some of them . in the first - mentioned case , the individual elements are expediently linked by means of weighting coefficients to form a scalar variable . in the second - mentioned case , the calculation is carried out using the magnitude directly . the quality measure may be a complex , multiple - parameter , non - linear function . however , a simple quality measure may also be provided , for whose formation there is no need to use all of the stored individual values . a quality measure such as this has the advantage that it can be formed continuously while the sampling cycle is being carried out . the measured values are in this case processed directly in order to form the quality measure . this has the advantage that there is no need to store the measured values . one example of a quality measure such as this is a value sum , for example for the energy fed into the grid system from a wind energy installation during one cycle , with the wind energy installation being operated in the region of the optimum tip - speed ratio . the energy values are integrated separately on the basis of the interval limit values ; this can be done continuously during the measurement , so that there is no need for storage . in order to determine whether the wind energy installation is actually being operated in the region of the optimum tip - speed ratio while the samples are being taken , an operating - mode detector 22 is expediently provided . this is designed to use the rotation speed of the rotor 3 to determine whether the installation is being operated in this range . the detector 22 is expediently in the form of a threshold - value switch , having a lower rotation speed limit and an upper rotation speed limit , between which the operating range of optimum tip - speed ratio is located . the detector 22 does not necessarily need to use the rotation speed as an input signal , and the electrical power output from the wind energy installation can also be used for determination purposes . however , an appropriate status signal for the operating mode is also frequently already available in the machine control system 6 . it is then sufficient to read this signal . there is then no need for any separate sensors . the detector 22 ensures that the only measured values which are used as samples for the statistical processes are those in which the wind energy installation has been operated in the region of the optimum tip - speed ratio . if this is not the case , then the sample is invalid , and cannot be used . it is rejected and the sampling process is repeated . further simplifications of the method according to the invention are possible . for example , the measurement device 23 , the a / d converter 61 and the memory 64 do not necessarily need to be provided . the measure for the electromechanical quantity and , possibly , the other parameters that are used are frequently available in any case from the operating control system for the wind energy installation , to be precise in many cases already in the form of mean values , as well . there is then no need for any separate measurement and storage . the parameters can be further - processed directly using the method according to the invention . at the end of step 128 , values g l and g u are produced as quality measures for the two interval limit values . a check is carried out in a next step 130 to determine whether the two quality measures g u and g l are of equal magnitude ( with a tolerance ε ), or not . if they are not equal , a check is carried out to determine which of the two interval limit values has the better associated quality measure . if the upper interval limit value has achieved the better quality measure , the operating value α b is incremented by the step width δ ( step 134 ). if the lower interval limit value has achieved the better quality measure , then the operating value α b is decremented by the step width δ ( step 136 ). after a backward jump 137 , the process starts once again with the step 110 , and is continued until an optimum value is finally achieved . this is determined by comparison of the two quality measures in step 130 . in the event of a positive result , the optimization process has been successful , and a changeover is made to control operation 138 . the optimization process thus reaches its end 140 . the rest of the procedure is then as illustrated in fig4 a . returning now to fig4 a again , the wind energy installation is operated using the optimum value determined in this way ( step 108 ). this is continued ( return path 109 ) until a variable repetition time t w has elapsed ( step 106 ). this is followed by a backward jump 107 in order to carry out the optimization process ( 104 ) again . the wait for a predeterminable repetition time to have elapsed in step 106 does not need to be the only criterion for repetition of the optimization process 104 according to the invention . further criteria can alternatively or additionally be provided ( see fig4 b ). for example , fig4 b shows an extended form ( step 106 ′) according to which an investigation is additionally carried out into significant changes in one of the parameters used , for example the electrical power . if a limit value μ which can be preset is exceeded , then a backward jump 107 is also made even if the repetition time has not yet elapsed . the invention is not restricted to the exemplary embodiment illustrated in fig5 . various variations of the optimization process according to the invention are feasible . by way of example , fig6 illustrates two mutually independent variations . the first relates to variation of the interval limit values during the iteration . in contrast to the situation in step 134 , the operating value α b and thus the two interval limit values are not shifted in step 134 ′, but new interval limit values are fixed directly , and are each incremented by the step value δ . the second variation relates to a change in the interval width . this can be done , for example in the manner illustrated in step 134 ′. the lower interval limit value α l is increased by the step value δ without being changed . the upper interval limit value α u is , however , not increased by the same amount , but the magnitude is reduced by a reduction value δ . in this case , δ may also have the same value as δ , that is to say the upper interval limit value would remain unchanged . the interval defined by the two start values is therefore reduced by the reduction value δ so that the method according to the invention converges more rapidly . in a corresponding manner , in step 135 ′, the upper interval limit value is reduced by the step value δ without being changed ; while the lower interval limit value α l is reduced only by δ - δ . it is self - evident that , in this variant , the interval limit values are not initialized once again in step 110 . in a corresponding manner , it is alternatively also possible to provide for the scatter value α off to be reduced by half the reduction value δ / 2 . this likewise results in a reduction in the interval by the reduction value δ . a predictor is preferably used in order to define the step values δ and , if appropriate , δ . as is illustrated in fig7 , two predictor functions φ and ψ are used for this purpose in step 131 on the basis of the determined values for the quality measure , as well as the interval limit values , if appropriate also including the data records contained in the memory 64 . the step value δ and the reduction value δ can be matched to the respective circumstances with the aid of the predictor functions . it is also possible to provide for the step value δ and the reduction value δ to be determined on the basis of characteristics or of look - up tables , instead of by the use of a predictor . this has the advantage that empirical values relating to the choice of the step values δ and the reduction values δ can be taken into account at the start and end of the optimization process according to the invention . furthermore , this offers the advantage of simple calculation . if appropriate , it is thus possible to use higher step values at the start of the method , in order to achieve faster convergence , while smaller step values are used later on , in order to achieve greater accuracy .	5
in fig1 and 1a a complete liquid processing system is disclosed . the liquid processing system is more specifically disclosed as a boiler 10 having water 11 to a normal level 12 . the boiler 10 has as part of its structure a liquid reservoir means 14 with the liquid reservoir means including an orifice 15 to restrict the flow of water from said boiler 10 when an electric drain means 16 is activated . the electric drain means 16 is made up of a valve 17 and an operator 18 which is connected by conductors 20 and 21 to the electrically portion of the system disclosed in fig1 a . the valve 17 drains water at 22 and this water can be disposed of either through a conventional drain or can be returned to the boiler 10 by means of a pump ( not shown ). disposed in the top of the liquid reservoir means 14 is an insulating member 23 with a probe 24 that extends into the water 11 . the probe 24 is connected by conductor 25 to the level sensor system 27 . the outer case of the liquid reservoir means 14 is connected by conductor 26 to the liquid level sensor system 27 , and the probe 24 along with the level sensor system 27 form a conventional type of resistive water probe liquid level or water level sensor used in many boiler installations . as will be explained in some detail later , when the valve 17 is opened in response to the actuator 18 , water drains from the liquid reservoir 14 at a relatively rapid rate without having but a minimal effect on the water 11 in the boiler 10 . as soon as the probe 24 clears the water at level 30 , the level sensor system 27 responds and the electric actuator 18 closes the valve 17 . at this point , the water 11 seeks its normal level 12 completing the circuit through the probe 24 once again . the manner in which this cycling is accomplished and is utilized will be brought out after fig1 a is described in detail . electric power is supplied at 31 to a pair of conductors 32 and 33 to the level sensor system 27 and a controller 34 that is closed when the liquid processing system is to be initiated , as when a fuel burner is to be ignited for the boiler 10 . the liquid level sensor system 27 has for its output a relay 40 which includes normally closed contact means 41 and normally open contact means 42 . with water connecting the probe 24 and the conductor 26 , the level sensor system 27 keeps the relay 40 energized . a further relay 50 including a normally open pair of contacts 51 and a normally open pair of contacts 52 , along with a normally closed pair of contacts 53 completes electric circuitry to a pair of conductors 60 and 61 which are connected to a fuel burner system 62 . the relay 50 and its contacts form a latching type of switching means . the fuel burner system 62 completes the liquid processing system in the case of a boiler . it will be noted that upon the closure of switch 34 , that a circuit is completed through the relay contacts 53 to the electric drain means 16 . the electric drain means 16 immediately causes the valve 17 to open draining water from the liquid reservoir means 14 . as soon as the water level reaches the level 30 , a circuit is interrupted between the probe 24 and the conductor 26 which causes the liquid level sensor system 27 to deenergize the relay 40 . the relay 40 closes the contacts 41 and opens the contacts 42 . the contacts 41 , immediately upon closing , energize the relay 50 . the relay 50 has a latching means of contacts 51 which latches the relay 50 into an energized condition . at this same time the electric drain means 16 is deenergized by the contacts 53 opening and the latching circuit is prepared to energize the fuel burner system 62 by the contacts 52 closing . once this sequence of events occurs , the valve 17 has closed due to the opening of the contacts 53 and the water level in the water reservoir 14 rises to complete a circuit between the probe 24 and the conductor 26 . this causes the liquid level sensor system 27 to energize the relay 40 thereby opening contacts 41 ( which is now paralleled by the closed contacts 51 ) and closing the contacts 42 . this completes an energizing control circuit means for the fuel burner system 62 , and the fuel burner can then start its normal operation . it can thus be seen that before the fuel burner system 62 can be initiated , the water in the liquid reservoir means 14 must drop below the end of the probe 24 and return to complete a circuit through the probe 24 to cycle the relay contacts of the relays 40 and 50 in such a manner as to latch in the relays in a complete circuit to the fuel burner system 62 . in the event that insufficient water is present at the initial startup , or during the burner operation the relay 40 is deenergized which will energize the relay 50 but will hold open the circuit at contacts 42 . the present system requires that the fluid be cycled at each startup with a complete electric circuit from the probe 24 to the conductor 26 , to the point of breaking that circuit , and than reestablishing that circuit before the relays 40 and 50 will cycle in order to complete an electric circuit through the contacts 42 and 52 to the fuel burner system 62 . it can thus be seen that a liquid processing system has been provided that verifies at the beginning of each cycle that the liquid or water for the system is present and is at a proper level . in fig1 and 1a a system utilizing the very simplest and very common water sensing probe has been disclosed . the type of water sensor is not material to the present invention . the type of cycle and sequence of contact means is essential . while the contact means have been shown as relay contacts , it is possible that parts of the circuit 1a could be replaced by solid state switching means without departing from the spirit of the inventive cycle required to verify the presence of liquid prior to the beginning of the processing of that liquid in the system . in fig2 a second type of liquid level or water level sensor is disclosed . the liquid reservoir means 14 is again disclosed containing a liquid but in this case a float means 70 operating a switch means 71 is disclosed . the switch means 71 contains the normally closed contact means 41 and the normally open contact means 42 and could be wired directly into the circuit disclosed in fig1 a . a conductor 72 is the common conductor 72 of fig1 a while conductor 73 is the conductor 73 of fig1 a between the contacts 41 and the relay means 50 , and the conductor 74 is the conductor between the contacts 42 and 52 . therefore , in the case of the float type mechanism of fig2 the liquid level sensing system 27 and the relay 40 would be replaced by the simple float operated switch means 71 having the same contact means 41 and 42 as disclosed in fig1 a . it thus becomes apparent that any type of liquid level or water level sensing means which has normally open contacts and normally closed contacts can be used with the present invention and that the invention resides , therefore , in the sequence of operation of the elements as disclosed in fig1 and 1a . in fig3 a liquid processing system is disclosed wherein the need for the liquid reservoir means 14 of fig1 is disposed of , and wherein the type of sensor used is an inherently safe type of sensor . an inherently safe type of sensor 75 is disclosed and is of the type fully explained in u . s . pat . no . 4 , 027 , 172 and entitled &# 34 ; resistive fluid detecting means &# 34 ;. this earlier filed application on an inherently safe fluid sensor is assigned to the assignee of the present invention . the inherently safe sensor 75 can detect the absence of a fluid and can also detect a short circuit across the sensor &# 39 ; s elements which simulate the presence of fluid . by being able to differentiate between these two different conditions , the sensor 75 is inherently safe and will sense the liquid 76 in the system undergoing processing in container 77 . the inherently safe system , comprising sensor 75 and amplifier 84 is connected by conductors 80 and 81 to the source of power 31 on conductors 32 and 33 of a circuit very similar to that disclosed in fig1 a . once again a control switch 34 has been disclosed which supplies power to the balance of the system . the inherently safe sensor 75 has three conductors 82 , 83 and 86 between the sensor 75 and the amplifier 84 . a pair of normally open relay contacts 85 are placed in conductor 82 so that the amplifier 84 can be made to believe that a low liquid level is present in container 77 when the contacts 85 are open . in the system of fig3 no liquid reservoir means and drain are provided but the low liquid condition is simulated by the opening of the contacts 85 , as will be explained in more detail below . the amplifier 84 has an output relay 90 . the relay 90 has contact means 41 and 42 in the same manner that the liquid level sensing system 27 and its relay 40 had contact means 41 and 42 . once again , the relay 50 and its normally open contacts 51 along with the normally open contacts 52 are provided . also , operated by relay 50 are the normally open pair of contacts 85 . the circuit again has conductors 60 and 61 which are connected to a liquid processing system element 91 that is initiated after the level of the liquid has been established as being safe . the operation of fig3 is as follows . with the switch 34 open , the amplifier means 84 is caused to believe that the liquid 76 is below its proper level in the container 77 by contacts 85 being open . this causes the relay 90 to be deenergized by the amplifier means 84 and the contact means 41 and 42 are thereby as shown . the contact means 41 of the relay 90 are closed while the contact means 42 are open . upon closing switch 34 , the closed contacts 41 energize the relay 50 which immediately latches itself in by means of the contacts 51 . the contacts 52 then also close but since the contacts 42 are open , the power is not applied to the system element 91 of the liquid processing system . the closing of relay 50 , however , closes contacts 85 . upon the contacts 85 closing , the amplifier means 84 will sense fluid if fluid is present at the safe sensor 75 at a level that has been preestablished by the insertion of the safe sensor 75 . this will immediately cause the amplifier means 84 to energize the relay 90 at which time the contact means 41 opens and contact means 42 will close . since the contacts 52 have been latched into a closed state , power will be available on conductor 60 and 61 to energize the system element 91 of the liquid processing system . in the disclosure of fig3 the inherently safe sensor 75 is used as a means of checking the electronics in the amplifier 84 by simulating the absence of liquid due to the open contact 85 each time the system is called on to operate . if the simulated low liquid level is sensed and the contact 85 closes , the amplifier means 84 is allowed to pull - in the relay 90 thereby completing the energizing circuit for the balance of the process . with the arrangement of fig3 it is unnecessary to dump or dispose of any of the liquid contained in the processing system and could be highly advantageous in systems that do not use water but use some other , more expensive or more difficulty handled liquid . the system , however , provides a very simple safe start check of the amplifier used in a liquid level system wherein the inherently safe sensor 75 is used . in the present application three possible approaches to the unique sequence of verifying the level of a liquid have been disclosed . this technique of operation could be applied to numerous physical embodiments and the applicant has shown only three such embodiments . the scope of the present invention is , however , limited solely by the scope of the appended claims .	6
the cultivar ‘ red dragon ’ has not been observed under all possible environmental conditions . the phenotype may vary somewhat with variations in environment such as temperature and light intensity , without , however , any variance in genotype . the aforementioned photographs and following observations and measurements describe plants grown in corvallis , oreg . under commercial practice outdoors in the field during the fall , winter , and spring . plants used for the photographs and description were about four years old . in the following description , color references are made to the royal horticultural society colour chart , 1966 edition , except where general terms of ordinary dictionary significance are used . female , or seed , parent .— corylus avellana selection osu 487 . 055 , not patented . male , or pollen , parent .— corylus avellana selection osu 367 . 039 , not patented . type .— rooted suckers . time to initiate roots .— about 30 days at 20 ° c . time to produce a rooted young plant .— about six months at 22 ° c . root description .— fine to thick ; freely branching ; creamy white in color . type .— whip grafting . time to budbreak on the scions .— about 14 days at 25 ° c . time to produce a grafted plant .— about six months at 25 ° c . general appearance .— perennial shrub . outwardly spreading plant habit . growth and branching habit .— freely branching ; about 15 lateral branches develop per plant . pinching , i . e ., removal of the terminal apices , enhances branching with lateral branches potentially forming at every node . strong and moderately vigorous growth habit . stems twisting or “ contorted .” plant height .— about 2 meters . plant diameter or spread .— about 2 meters . lateral branch description .— length : about 15 cm . diameter : about 5 mm . internode length : about 1 . 3 cm . texture : smooth , glabrous . strength : strong . color , immature : 178a . color , mature : 137a . arrangement .— alternate , simple . length .— about 12 cm . width .— about 10 cm . shape .— oblong to ovate . apex .— obtuse to acute . base .— cordate . margin .— serrate . texture , upper and lower surfaces .— slightly pubescent . venation pattern .— pinnate . color .— developing foliage , upper and lower surfaces : 187a . fully expanded foliage , upper surface : spring and summer , 183b ; late summer and fall , 137a . fully expanded foliage , lower surface : spring and summer , 178a ; late summer and fall , 137a . venation , upper surface : spring and summer , 183b ; late summer and fall , 137a . venation , lower surface : spring and summer , 178a ; late summer and fall , 138b . petiole .— length : about 1 cm . diameter : about 2 . 5 mm . texture , upper and lower surfaces : pubescent . color , upper surface : spring and summer , 183b ; late summer and fall , 137a . color , lower surface : spring and summer , 178a ; late summer and fall , 138b flower description : male inflorescences are catkins , color prior to elongation 176b . female inflorescence style color 183b . disease / pathogen / pest resistance : plants of the new corylus are resistant to eastern filbert blight caused by the fungus anisogramma anomala ( peck ) e . muller . plants of the new corylus are moderately susceptible to bud mites ( phytoptus avellanae nal .) as are plants of ‘ contorta .’ temperature tolerance : plants of the new corylus have been observed to tolerate temperatures from about - 10 ° c . to about 38 ° c . in the field in corvallis , oreg . trees of ‘ red dragon ’ set a moderate number of catkins ( rating = 2 . 3 ) which is less than ‘ contorta ’ ( rating = 3 . 2 ) but more than other contorted selections . the catkins elongate in late winter with ‘ contorta .’‘ red dragon ’ has incompatibility alleles s 6 and s 26 as determined by fluorescence microscopy . both alleles are expressed in the females , but only s 6 is expressed in the pollen because of dominance . female inflorescences of ‘ red dragon ’ also emerge late in the season , with ‘ contorta .’ ‘ red dragon ’ trees will set a few nuts if its stigmas receive compatible pollen while receptive . the nuts are small , slightly long and compressed . the nuts are borne in clusters of one or two in husks equal in length to the nuts . pollen of the red - leaf cultivars ‘ rode zeller ’ and ‘ fusco rubra ’ expresses s 6 and , thus , is incompatible . ‘ contorta ’ ( s 5 s 10 ) is reciprocally compatible with ‘ red dragon .’ dna was extracted from several contorted seedlings and amplified by pcr . random amplified polymorphic dna ( rapd ) markers ubc 152 - 800 and ubc 268 - 580 , which flank the ‘ gasaway ’ resistance gene , are present in ‘ red dragon .’ rapd marker aa12 - 850 , which co - segregates with resistance , is also present . scions were collected from ‘ red dragon ’ and several other contorted selections and three trees of each were grafted to rooted layers of corylus avellana . the shoot tips of the grafted trees were inoculated in the greenhouse with a spore suspension of anisogramma anomala and then held under high humidity . the three inoculated trees of ‘ red dragon ’ remained free of disease , while those of other selections in the same test developed cankers . the lack of cankers confirmed the results of the rapd markers and indicates complete resistance to eastern filbert blight . notably , no trees have been lost to bacterial blight caused by xanthomonas campestris pv . corylina , however susceptibility to the disease has not been rigorously tested . susceptibility to big bud mite ( primarily phytoptus avellanae nal .) was rated after leaf fall once per year for three years . the scale was from 1 ( no blasted buds ) to 5 ( many blasted buds ). the average bud mite rating for ‘ red dragon ’ ( 3 . 2 ) is slightly higher than for ‘ contorta ’ ( 2 . 6 ), but the difference is not significant at p = 0 . 05 . the nursery trade does not consider bud mite to be a serious problem for ‘ contorta .’ therefore , bud mite should also not be a serious problem for ‘ red dragon .’ fingerprinting with simple sequence repeat ( ssr ) markers was also performed . a panel of simple sequence repeat marker loci for hazelnut has been developed . using primers designed for each ssr locus , hazelnut dna was amplified by pcr as described ( bassil et al . ( 2005 ) j . amer . soc . hort . sci ., 130 : 543 - 549 ). the sequences of the primers are provided in table 1 . forward primers were fluorescently labeled with fam , hex , or ned , and the size of the amplified fragment was determined by capillary electrophoresis on an abi 3100 instrument ( applied biosystems ; foster city , calif .). 93 ssr loci were used to amplify 32 hazelnut genotypes . microsatellite markers in hazelnut are described in bassil et al . ( j . amer . soc . hort . sci . ( 2005 ) 130 : 543 - 549 ), bassil et al . ( acta horticulturae ( 2005 ) 686 : 105 - 110 ), boccacci et al . ( mol . ecol . notes ( 2005 ) 5 : 934 - 937 ), boccacci et al . ( genome ( 2006 ) 49 : 598 - 611 ), and mehlenbacher et al . ( genome ( 2005 ) 49 : 122 - 133 ). the disclosure of each of the above citations is incorporated by reference herein . shown for each microsatellite marker locus are the sequence of the forward and reverse primers , the repeat motif , the range of sizes generated , the annealing temperature , and the sequence identifiers . a ( gaa ) 7 gga ( gaa ) 2 n 21 ( gaa ) 2 att ( gaa ) 4 n 15 ( gaa ) 3 . the allele sizes at 26 loci that distinguish 12 hazelnut genotypes are presented below ( table 2 ). osu 217 . 094 is a red leaf seedling of ‘ contorta ,’ and its pollen parent is believed to be ‘ rode zeller .’ dna of six contorted red leaf selections ( two selections of the ‘ red majestic ,’ ‘ red dragon ,’ osu 897 . 046 , osu 897 . 071 and osu 897 . 082 ) was also amplified . ‘ red majestic ’ plants from spring meadow and from klehm are clearly different , as they have different alleles at 19 of the 26 loci . notably , ‘ red dragon ’ is different from both clones of ‘ red majestic ’ and from all other genotypes in table 2 . indeed , ‘ red dragon ’ was found to exhibit different allele sizes at certain loci that allowed for it to be distinguish from other hazelnut genotypes such as ‘ contorta ’ and ‘ red majestic .’	0
hereinafter reference will now be made in detail to various embodiments of the present disclosure , examples of which are illustrated in the accompanying drawings and described below . while the disclosure will be described in conjunction with embodiments , it will be understood that present description is not intended to limit the disclosure to those embodiments . on the contrary , the disclosure is intended to cover not only the embodiments , but also various alternatives , modifications , equivalents and other embodiments , which may be included within the spirit and scope of the disclosure as defined by the appended claims . the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure . as used herein , the singular forms “ a ,” “ an ,” and “ the ” are intended to include the plural forms as well , unless the context clearly indicates otherwise . it will be further understood that the terms “ comprises ” and / or “ comprising ,” when used in this specification , specify the presence of stated features , integers , steps , operations , elements , and / or components , but do not preclude the presence or addition of one or more other features , integers , steps , operations , elements , components , and / or groups thereof . as used herein , the term “ and / or ” includes any and all combinations of one or more of the associated listed items . it is understood that the term “ vehicle ” or “ vehicular ” or other similar term as used herein is inclusive of motor vehicles in general such as passenger automobiles including sports utility vehicles ( suv ), buses , trucks , various commercial vehicles , watercraft including a variety of boats and ships , aircraft , and the like , and includes hybrid vehicles , electric vehicles , plug - in hybrid electric vehicles , hydrogen - powered vehicles and other alternative fuel vehicles ( e . g ., fuels derived from resources other than petroleum ). as referred to herein , a hybrid vehicle is a vehicle that has two or more sources of power , for example both gasoline - powered and electric - powered vehicles . additionally , it is understood that one or more of the below methods , or aspects thereof , may be executed by at least one controller . the term “ controller ” may refer to a hardware device that includes a memory and a processor . the memory is configured to store program instructions , and the processor is specifically programmed to execute the program instructions to perform one or more processes which are described further below . moreover , it is understood that the below methods may be executed by an apparatus comprising the controller in conjunction with one or more other components , as would be appreciated by a person of ordinary skill in the art . furthermore , the controller of the present disclosure may be embodied as non - transitory computer readable media on a computer readable medium containing executable program instructions executed by a processor , controller or the like . examples of the computer readable mediums include , but are not limited to , rom , ram , compact disc ( cd )- roms , magnetic tapes , floppy disks , flash drives , smart cards and optical data storage devices . the computer readable recording medium can also be distributed in network coupled computer systems so that the computer readable media is stored and executed in a distributed fashion , e . g ., by a telematics server or a controller area network ( can ). as illustrated in fig1 , an air cleaning system for a vehicle according to embodiments of the present disclosure includes an air purification button 11 and an air conditioning system . the air purification button 11 can be operated by a driver or other user in order to generate operation signals for cleaning / purifying air in a vehicle interior . the air purification button 11 may be provided on an instrument panel at the front of the vehicle interior so as to be easily operated by the driver or the user . notably , while the present disclosure refers to an air purification “ button ,” it should be understood that the button is merely one exemplary input device , and the air purification button 11 can encompass any input device suitable for receiving an “ on / off ” input from a user , including , but not limited to , a switch , a lever , a dial , and the like . the air conditioning system includes an intake door 23 which allows air inside or outside of a vehicle to be selectively introduced thereinto , and selectively opens and closes an inside air inlet for the introduction of inside air or an outside air inlet for the introduction of outside air , a blower 24 which generates suction force and blowing force so as to blow inside or outside air introduced through the inlet opened by the intake door 23 , a high - efficiency air filter 25 of an air conditioner which passes the introduced inside or outside air therethrough so as to filter foreign substances such as fine dust , an evaporator 22 of the air conditioner which is supplied with a refrigerant from a compressor 29 of the air conditioner so as to cool the air introduced by the blower 24 , a defrost vent ( not shown ) configured to discharge air toward a window glass ( alternatively referred to herein as , simply , a “ window ”), a defrost door 21 which opens and closes the defrost vent , etc . furthermore , the air conditioning system includes an automatic defog sensor ( ads ) 12 which detects a relative humidity around the window , a cluster ionizer 26 which generates ions to sterilize and deodorize air by suppressing bacteria and mold , and a controller 10 which controls the intake door 23 , the defrost door 21 , the compressor 29 and evaporator 22 of the air conditioner , the blower 24 , etc ., depending on detection signals from the ads 12 . the ads 12 is a fog detection unit which may detect fog and moisture on the window glass by detecting the relative humidity of the vehicle window glass . the intake door 23 , the defrost door 21 , the compressor 29 and evaporator 22 of the air conditioner , and the blower 24 are operated depending on the relative humidity of the window glass detected by the ads 12 , and thus moisture / fog on the window glass may be automatically removed . that is , when the ads 12 is operated , the intake door 23 , the defrost door 21 , the compressor 29 and evaporator 22 of the air conditioner , and the blower 24 are operated , without separate operation by the user , by the controller 10 receiving signals from the ads 12 , thereby enabling moisture / fog on the window glass to be removed . the controller 10 may determine whether it is necessary to operate a defogging unit 27 which includes multiple components ( e . g ., the intake door , the defrost door , the compressor and evaporator of the air conditioner , the blower , etc .) for removing fog on the vehicle window glass using the ads 12 . in addition , the air conditioning system includes a defrost mode switch 13 which may manually operate the defogging unit 27 for removing fog on the window glass . when the defrost mode switch 13 is turned on by the manual operation of the user , who determines that moisture in the vehicle interior and on the window glass needs to be removed , the intake door 23 , the defrost door 21 , the compressor 29 and evaporator 22 of the air conditioner , and the blower 24 are operated by the controller 10 receiving signals from the defrost mode switch 13 , thereby enabling fog on the window glass to be removed . the defrost mode switch 13 is provided , for example , on the instrument panel . the cluster ionizer 26 is installed in a passage , in which air filtered by the high - efficiency air filter 25 provided in the air conditioner is blown and moved , and generates and releases anions and cations to sterilize and deodorize air to suppress bacteria and mold . when the air purification button 11 is turned on , the controller 10 controls the operation of an inside air purification unit 28 , which includes components ( e . g ., the intake door , the air conditioner , the blower , the cluster ionizer , etc .) for cleaning / purifying air in the vehicle interior , and simultaneously determines whether to operate the defogging unit 27 for removing moisture in the vehicle interior and fog ( or moisture ) on the window glass , based on detection signals received from the ads 12 or the defrost mode switch 13 so as to control the operation of the components for removing fog and moisture . hereinafter , an air cleaning method according to embodiments of the present disclosure will be described with reference to fig2 and 3 based on the above configuration . as illustrated in fig2 , in the air conditioning system , when the user turns on the air purification button 11 , the intake door 23 is controlled to be operated in an inside air mode , in response to the signals of the controller 10 , so as to block outside air from being introduced into the vehicle interior , the blower 24 is operated to circulate inside air ( i . e ., air in the vehicle interior ), the air conditioner is operated such that the high - efficiency air filter 25 filters foreign substances such as fine dust in air passing therethrough , and the cluster ionizer 26 is operated to sterilize air and suppress mold . that is , since the air conditioning system is switched to be operated in the inside air mode in which the intake door 23 blocks the introduction of outside air , only inside air is introduced into the vehicle and is circulated by the blower 24 . in this case , foreign substances are filtered while the circulated inside air passes through the air filter 25 . when the air conditioner is operated , the compressor 29 is operated in order to supply a refrigerant to the evaporator 22 . when the defogging unit 27 is then operated , the evaporator 22 reduces an amount of saturated water vapor in air in the process of cooling the air using the refrigerant supplied thereto , thereby performing a dehumidification function . in addition , foreign substances may be filtered from air by the moisture adhering to the evaporator 22 . hereinafter , the air cleaning method according to embodiments of the present disclosure will be described in more detail with reference to fig3 . as illustrated in fig3 , when the air purification button 11 is first turned on , the controller 10 first determines whether the defrost mode switch 13 is operated and the ads 12 is operated for the detection of fog . when the defrost mode switch 13 is determined to be operated or the ads 12 is determined to detect fog on the vehicle window glass , the air conditioning system is operated and maintained in an operation mode that precedes an air cleaning mode in which the inside air purification unit 28 is operated , i . e ., in a current mode by the controller 10 , and the controller 10 again determines whether the defrost mode switch 13 is to be operated and the ads 12 is to be operated for the detection of fog . here , the ads 12 is determined to detect fog on the window glass only when it detects a relative humidity equal to or higher than a predetermined critical value . this determination is performed by the controller 10 receiving signals from the ads 12 . in addition , when it is determined that the defrost mode switch 13 is not operated and that the ads 12 does not detect fog on the vehicle window glass , the controller 10 operates the inside air purification unit 28 , which includes the air filter 25 of the air conditioner , the blower 24 , the intake door 23 , the cluster ionizer 26 , etc ., to remove contaminants such as fine dust and mold from air in the vehicle interior , and simultaneously operate the compressor 29 of the air conditioner for supplying a refrigerant to the evaporator 22 so as to prepare for the operation of the defogging unit 27 during the operation of the inside air purification unit 28 . when a condition that the air conditioning system is switched to a defogging mode from the air cleaning mode in order to remove contaminants from air in the vehicle interior is satisfied , the operation of the inside air purification unit 28 is stopped and the defogging unit 27 is operated so as to remove moisture generated on the window glass and simultaneously suppress the generation of moisture on the window glass . in this case , in the state in which the intake door 23 is operated in an outside air mode and the defrost door 21 is opened in the defogging unit 27 , outside air introduced by the suction force of the blower 24 is cooled by the evaporator 22 and is then moved to the window glass through the defrost door 21 by the blowing force of the blower 24 . when the moisture generated on the window glass is removed , the operation of the defogging unit 27 is stopped , and the air conditioning system re - enters the air cleaning mode , according to the result of another determination of whether the defrost mode switch 13 is operated and the ads 12 is operated for the detection of fog , to perform the air purification function by the inside air purification unit 28 . in other words , when it is determined that the defrost mode switch 13 is not operated and the ads 12 does not detect fog on the vehicle window glass after the operation of the defogging unit 27 is completed , the controller 10 resumes the operation of the inside air purification unit 28 , the operation of which has stopped . the controller 10 determines that the moisture generated on the window is removed when the ads 12 detects a relative humidity equal to or higher than the predetermined critical value , and stops the operation of the defogging unit 27 . when a condition for cancellation of the air cleaning mode occurs while the inside air purification unit 28 enters and is operated in the air cleaning mode , the operation of the inside air purification unit 28 is stopped . the condition for cancellation of the air cleaning mode is satisfied when the defrost mode switch 13 is turned on , the mode of the intake door 23 is switched to an outside air mode by an inside / outside air mode switch provided on the instrument panel , the mode of the air conditioning system is switched to an auto mode , the air conditioning system is turned off , the air conditioner is turned off , etc . when the condition for cancellation of the air cleaning mode is satisfied , the inside air purification unit 28 of the air conditioning system is operated according to a manual operation condition . as such , it is possible to perform the air cleaning function in order to remove contaminants from air in the vehicle interior using the air conditioning system which is mounted in the vehicle , and to simultaneously perform the defog mode for moisture removal when there is the possibility of generation of moisture ( i . e ., fog ) on the window due to the lengthy operation of the inside air mode for cleaning air , thereby enabling the air cleaning mode to be maintained for a long time without the concern about fog generation in the vehicle interior . in addition , since the air cleaning mode is maintained for a long period of time , it is possible to further increase interior cleaning efficiency and performance . as is apparent from the above description , in accordance with an air cleaning system and method for a vehicle of the present disclosure , it is possible to effectively remove fine dust from the air in a vehicle interior using an inside air purification unit when intended by a user , and to simultaneously lower the indoor humidity of a vehicle by the operation of a defogging unit , when there is a concern about fog generation in the vehicle interior due to the driving of the vehicle for a long time , so as to remove and prevent fog on a vehicle glass . in addition , fine dust can be continually collected by resuming the operation of the inside air purification unit after the operation of the defogging unit is completed . as a result , the performance of fine dust removal can be increased by operating the inside air purification unit for a long period of time without a concern about reduced efficiency of operation due to fog generation . in addition , since the present disclosure uses an automatic air conditioning system , including a cluster ionizer , an ads , etc ., as the air conditioning system which is previously mounted in the vehicle , fine dust can be effectively removed from the vehicle interior without an unnecessary increase in costs . the disclosure has been described hereinabove in detail with reference to embodiments thereof . however , it will be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the disclosure , the scope of which is defined in the appended claims and their equivalents .	1
the description herein will be with particular reference to coating transparencies , but it should be apparent that the invention is not limited to any particular type of coating or product , but has applicability to sputter coating in general . the transparencies with which the present invention may be practiced include curved or flat sheets of glass and / or plastic . the coating may be metal or metal oxides . an example of an indium oxide coating method and apparatus suitable for use in conjunction with the present invention are disclosed in u . s . patent no . 3 , 907 , 660 ( gillery ), the disclosure of which is hereby incorporated by reference . referring to fig1 a substrate 10 is shown resting on a fixture 11 which may be formed of a metal sheet with the center cut out in approximately the outline of the substrate 10 but with slightly smaller dimensions so as to support the substrate around its periphery . if the substrate is curved , the fixture 11 may also be provided with a corresponding curvature . although the elements of the coating apparatus of fig1 are shown with a horizontal orientation , a sloped orientation is also used . the fixture 11 is designed to provide exposure of the substrate to heating elements 12 below the fixture . the heating elements 12 may be electric resistance heating elements and serve to maintain the substrate 10 at the proper temperature for sputter coating . on the opposite side of the substrate from the heating elements is a cathode assembly 13 mounted for reciprocation over the substrate by way of wheels 14 and rails 15 . relative motion between the cathode assembly and the substrate permits a larger area to be sputter coated than with a stationary arrangement . although not preferred , the cathode could remain stationary while the substrate is moved . the cathode assembly 13 carries a cathode target of the metal that is to be sputtered as well as an anode . the present invention may be used with or without magnetic ( magnetron ) enhanced sputtering . the entire apparatus of fig1 is enclosed within a vacuum chamber ( not shown ) during sputtering . in fig1 a mask 20 in accordance with the present invention is shown mounted on the fixture 11 by means of brackets 21 . the mask 20 could be made of any material that can withstand the temperature and chemical conditions of the sputtering operation , and is preferably metal due to its rigidity at the temperatures involved and ease of working . suitable metals for the mask include stainless steel , copper , and titanium , and other metals may also be suitable . the mask 20 is spaced from the substrate 10 , the distance of the spacing varying in accordance with the sharpness of the image of the mask that is to be reproduced in the coating deposited on the substrate . in some cases it may be desired to create a sharply focussed line between thickly and thinly coated areas , in which case the mask is spaced a relatively small distance from the surface of the substrate . in other cases a less distinct gradient may be desired , and the mask is spaced relatively farther from the substrate . the invention is not inherently limited to any particular range of spacings , examples of spacings that have been employed successfully range from 3 / 4 inch to 2 inches . several examples of material from which the mask 20 may be fabricated are depicted in fig2 - 4 . the mask 20 in fig2 is comprised of expanded metal mesh , a material which is advantageously rigid but readily bendable for contouring to the shape of curved substrates . expanded metal mesh is available with openings in a variety of sizes . the choice of opening size will be influenced by the spacing of the mask from the substrate and the pattern effect that is desired . the invention is not limited to any particular opening size , but examples of opening sizes that have been used range from approximately 1 / 4 by 1 / 2 inch up to 1 by 2 inches . the amount of open space depends upon the effect desired , but in general it is preferred that the base material of the mask have at least about forty percent of its area open . an expanded metal mesh that has been found suitable has a thickness of 16 gauge , but other thicknesses may also be suitable . the mask 20 &# 39 ; in fig3 takes the form of screen or wire cloth . in fig4 the mask 20 &# 34 ; is a perforated sheet . the considerations regarding spacing and openness discussed above in connection with the expanded metal mesh embodiment apply as well to the alternative materials for the mask . the openings in the perforated sheet of fig4 are shown as being circular , but could be square or any other shape . referring now to fig5 there is illustrated an example of a composite mask in place over a substrate 10 in which the base of the mask 20 is a material having a regular pattern of openings , but which has been modified to increase the openness in some areas and to decrease the openness in other areas . some areas of the substrate are not masked at all . other regions have enlarged openings 22 created by cutting away small portions of the mesh . to decrease the size of the openings , another layer of mesh 23 is placed onto the mask 20 with the openings out of alignment . the misalignment may be to varying degrees , and the added piece of mesh 23 may have the same or different sized openings as the base mesh 20 . therefore , a wide variety of blockage can be achieved by means of the additional layer of mesh . for areas where maximum masking is required , a solid sheet 24 may be placed onto the base mask 20 . by manipulating these variables of the mesh mask , a great deal of versatility in controlling deposition of gradient coatings is available . the invention has been described in connection with particular embodiments in order to disclose the best mode of the invention , but it should be understood that other variations and modifications as are known to those of skill in the art may be resorted to without departing from the invention as defined by the claims that follow .	2
now , embodiments of this invention will be described in the following order . 1 . a description of an outline construction of the circuit pattern forming device and a description of a control system for the device . 2 . a description of a material used in the circuit pattern fabrication . [ 1 . outline construction of the circuit pattern forming device and the construction of the control system ] first , as one embodiment of this invention , let us explain an outline construction of the circuit pattern forming device used to form a circuit pattern made up of an insulating pattern and a conductive pattern formed on a substrate . fig1 is a perspective view schematically showing an outline construction of the circuit pattern forming device in this embodiment . the circuit pattern forming device shown here has a carriage 109 that reciprocally travels in the scan direction ( x direction ) and a stage 103 on which a substrate 1 , to be formed with a circuit pattern , is mounted . in this carriage , a liquid ejection head 2 for ejecting an insulation pattern forming solution onto the substrate 1 and a liquid ejection head 3 for ejecting a conductive pattern forming solution are arranged side by side in the x direction . also mounted on the carriage are two tanks ( not shown ) that supply the insulation pattern forming solution to the liquid ejection heads 2 , 3 , respectively . each liquid ejection head has arranged , in a direction crossing the scan direction ( x direction ), a large number of nozzles to eject the liquid supplied from the associated tank . these nozzles form a nozzle array . this nozzle arrays should preferably extend in a y direction perpendicular to the scan direction . each head may have two or more nozzle arrays . the liquid ejection heads 2 , 3 are repetitively scanned over the substrate , while ejecting the conductive pattern solution and the insulating pattern solution onto the substrate to form a circuit pattern . while , in the above description , the liquid ejection head is moved over the substrate , the effect of this invention can also be produced by holding the head stationary and moving the substrate . a carriage ( cr ) linear motor 101 is provided as a power source to cause the carriage 109 to execute forward and backward scans . as a means for moving the substrate 1 in the y direction , the stage 103 and a line and feed ( lf ) linear motor 102 , which drives the stage , are provided . the lf linear motor 102 is rigidly secured to a bed 108 , so that the upper surface of the stage 103 carrying the substrate 1 can be kept parallel to the upper surface of the bed 108 at all times , if the stage 103 is moved . the cr linear motor 101 is secured to highly rigid bases 104 , 105 erected on the bed 108 . the carriage 109 reciprocally moves in the main scan direction ( x direction ) along an upper surface of the bed , i . e ., a stage surface . the cr linear motor 101 and the lf linear motor 102 each incorporate a linear encoder 111 , 112 and an origin sensor 106 , 107 . the outputs of the linear encoder 111 , 112 and the origin sensor 106 , 107 are used as a servo control input for driving the linear motors . further , the linear encoder 111 on the carriage side is used to generate a solution ejection timing . the encoder has a resolution of 0 . 5 μm , high enough to form circuit patterns several tens of μm wide . though not shown here , the circuit pattern forming device has a raise / lower mechanism that finely moves the carriage up or down in a direction ( z direction ) perpendicular to the upper surface of the stage 103 . this raise / lower mechanism can adjust a gap between the carriage and the upper surface of the substrate or the circuit pattern formed on the substrate . further , the circuit pattern forming device of this embodiment is connected with a personal computer ( not shown ) as a host device . based on figure information ( circuit pattern forming information ) sent from this personal computer , the circuit pattern forming device moves the stage 103 to a predetermined position by the lf linear motor 102 and scans the carriage 109 by the cr linear motor 101 , while ejecting the conductive pattern forming solution or insulating pattern forming solution from the head onto a predetermined position on the substrate to form a conductive pattern or an insulating pattern . at this time , if the nozzle array length as measured in the y direction is shorter than the length of the substrate 1 as measured in the y direction , when the drawing operation of the head in the first scan is completed , the substrate 1 is moved a nozzle array length in the y direction by the lf linear motor 102 , and the head is again scanned to perform drawing . by repeating this scan ( drawing ) of the liquid ejection head and the feeding substrate 1 , one layer of a predetermined conductive pattern or an insulating pattern can be formed in the entire circuit pattern forming area of the substrate 1 . of course , if the length of the circuit pattern forming area is shorter than the head , one layer of a circuit pattern can be completely drawn by the first scan of the liquid ejection head . then , the pattern forming operation is repeated on the entire circuit pattern forming area , forming the conductive pattern or insulating pattern of a predetermined thickness . details of the drawing operation to obtain a desired thickness of pattern will be described later in the discussion of : [ 3 . description of a pattern forming method ]. to form a circuit pattern on the substrate by the circuit pattern forming device and to complete a printed circuit board , a fixing process is required , which evaporates the solvent in the solutions drawn on the substrate 1 to fix the circuit pattern on the substrate . thus , a drying device is necessary , in addition to the circuit pattern forming device . next , a control system of the circuit pattern forming device of this embodiment will be explained . fig2 is a block diagram schematically showing an overall configuration of a control system in the circuit pattern forming device of this embodiment . a mechanical unit 46 includes the cr linear motor 101 for moving , in the main scan direction , the carriage 109 carrying the liquid ejection heads 2 , 3 , and also , the lf linear motor 102 for transporting the stage 103 carrying the substrate 1 . a main control unit 44 is a central part of the control system that controls the entire circuit pattern forming device of this embodiment , including the liquid ejection head and the mechanical unit 46 . the main control unit 44 has a cpu , a rom , in which operation programs are stored , and a work ram that allows reading and writing of a variety of data . the main control unit 44 outputs a control signal to the mechanical unit 46 , to perform a mechanical control , for example , on the movement of the carriage 109 and stage 103 . it also transfers signals to and from a head control unit 42 , a memory control unit 50 and a drawing position signal generation unit 41 , to control the operation of the liquid ejection head 2 . an i / f unit 47 is an interface between the personal computer ( not shown ) and the circuit pattern forming device . the i / f unit 47 receives a command and circuit pattern drawing data ( circuit pattern forming data ) from a host device , such as the personal computer . the memory control unit 50 transfers the command from the i / f unit 47 to the main control unit 44 and , under the control of the main control unit 44 , generates an address signal and a draw timing , to put the circuit pattern drawing data into a buffer memory 45 . further , the main control unit 44 analyzes the command received from the i / f unit 47 and , according to the result of the analysis , sets drawing conditions , such as a drawing speed and a drawing resolution . then , based on the drawing conditions , the main control unit 44 controls the mechanical unit 46 and the drawing position signal generation unit 41 , to execute the drawing operation under the predetermined conditions . further , the circuit pattern drawing data received from the personal computer ( not shown ) is stored in the buffer memory 45 or a temporary memory , and then transferred to the head control unit 42 by the control of the memory control unit 40 that has received the command from the main control unit 44 . in synchronism with the drawing position signal output from the drawing position signal generation unit 41 , the head control unit 42 drives individual nozzles of the liquid ejection head , to draw a circuit pattern according to the circuit pattern drawing data transferred from the buffer memory 45 . the substrate 1 used in this embodiment basically is shaped like a film , a sheet or a plate , with a planar surface . when forming a circuit pattern layer , the pattern fixing is facilitated by evaporating the solvent . therefore , it is particularly preferable that the substrate have good heat resistance . other than the planar image , the substrate may have a curved shape , as long as a circuit pattern can be formed by the liquid ejection method . the substrate may use the following materials : thermoplastic resin films , such as polyester film , aromatic polyamide film and polyamide film , cloths and non - woven fabric of glass fibers , polyester fibers and aromatic polyamide fibers impregnated with thermoplastic resin and epoxy resin and then , hardened and shaped like a sheet , and a glass epoxy laminated plate used for ordinary printed circuit boards . for conductivity , the conductive pattern forming solution generally includes metal particles , such as al , ag and sno 2 . the metal particles preferably have diameters in a range of several tens to several hundreds of nm , in terms of uniformity and stability of circuit patterns . the solution includes water and a water - soluble organic solvent and other components , such as a viscosity adjusting agent , a ph adjusting agent , an antiseptic , a surfactant , and an antioxidant , as necessary . the insulating pattern forming solution preferably includes insulating particles of silica , alumina , calcium carbonate and magnesium carbonate . other materials can also be used , if they exhibit an insulating capability . a liquid medium includes water . it is also possible to mix a water - soluble organic solvent and other additives , such as a viscosity adjusting agent , a ph adjusting agent , an antiseptic , various kinds of surfactant , an antioxidant , and an evaporation accelerator , as necessary . after a circuit pattern has been drawn with the solution , it is dried , to evaporate the solvent . further , all the patterns after being drawn and dried are sintered , to form a highly conductive printed circuit board with metal particles forming metal connections . next , a first embodiment of the circuit pattern forming method according to this invention will be explained , by referring to fig3 and fig4 a - 4f . fig3 is a flow chart showing a pattern forming process in the first embodiment . fig4 a - 4f are schematic diagrams showing a process of drawing conductive and insulating patterns , fig4 a - 4e representing states in which a drawn pattern is dried and a solvent evaporated , and fig4 f representing a state in which the circuit pattern , after being sintered , is completed . in this embodiment , a circuit pattern of one integral layer , as shown in fig4 f , is constructed of four divided layers , each of which is formed in a separate pattern drawing process , as shown in fig4 e . that is , one pattern drawing operation , which is identical to one scan of the head , forms one divided layer among the four to be formed . thus , to form all four of the divided layers , equivalent to one integral layer of the circuit pattern , requires four drawing operations . in step s 1 of fig3 , the number of pattern drawing operations required to form a pattern of a desired thickness by repetitively applying the pattern forming solution to the same position is determined . the number of pattern drawing operations of repetitively applying the conductive pattern forming solution is equal to the number of pattern drawing operations of repetitively applying the insulating pattern forming solution . in step s 2 , the liquid ejection head scans once over the entire conductive pattern forming area on the substrate , while ejecting the conductive pattern forming solution onto the substrate 10 , to form a conductive pattern 11 , which is then dried , as shown in fig4 a . since the pattern drawing operation is executed as the head is scanned toward the right in fig4 a , a satellite 12 lands to the right side of the conductive pattern 11 . next , in step s 3 , the insulating pattern forming solution is ejected to where the conductive pattern 11 is not drawn , to form an insulating pattern 13 , which is then dried . the insulating pattern 13 drawn in this manner covers the satellite 12 of the conductive pattern forming solution that has previously landed . during the insulating pattern drawing operation , a satellite of the insulating pattern forming solution lands , as with the conductive pattern drawing operation . this satellite , however , does not cause any problem in the circuit operation and is , therefore , not shown . next , in step s 4 , a check is made to see if the number of pattern drawing operations has reached a predetermined number . if the predetermined number is not yet reached , the process returns to step s 2 and the processing of step s 2 and step s 3 is repeated . at the current stage , since only the first of the four drawing operations is finished , the processing of the subsequent operations will be explained . after returning to step s 2 , the conductive pattern is drawn a second time and dried . this state is shown in fig4 c . the second conductive pattern is drawn over the first conductive pattern 11 , and a satellite 14 , formed during the second operation , lands , not on the satellite 12 that was formed during the first operation , but on the insulating pattern 13 drawn at step s 3 . then , as shown in fig4 d , step s 3 is again executed to draw and to dry the second insulating pattern , as with the first insulating pattern . then , as shown in fig4 e , when the number of drawing operations in step s 2 and step s 3 has reached a predetermined total number of four , step s 4 checks if all of the patterns are completely drawn . if so , the pattern drawing process is ended . as a final step , the printed substrate is baked in a separate baking device to cause fine metal particles used as the conductive fine particles in the conductive pattern forming solution to make solid metal connections . as a result , a printed circuit board is formed , as shown in fig4 f . in the insulating pattern 16 , conductive satellites 17 are present . however , since the drawing of the conductive pattern and the drawing of the insulating pattern are alternated , the conductive satellites are covered with the insulating pattern forming solution . therefore , the satellites are kept out of touch with one another , thus , forming a good circuit pattern , which prevents the conductive patterns 15 from undesirably getting short - circuited . it is desired that the conductive pattern 15 and the insulating pattern 16 on the completed printed circuit board be flat . to this end , the pattern forming solution must be chosen so that the conductive pattern and the insulating pattern , after being drawn once and burned , have equal thicknesses . in practice , since a priority is given to the conductive pattern having a desired thickness in terms of conductivity and allowable current , a shrinkage factor of the insulating particles used in the insulating pattern forming solution is preferably almost equal to that of the metal particles used to form the conductive pattern . next , the second embodiment of this invention will be described . the first embodiment has taken up an example case in which the drawing of the insulating pattern and the drawing of the conductive pattern are alternated every scan . in the second embodiment , a case will be described in which the drawing of the conductive pattern is performed continuously in the direction of lamination , to the extent that the satellites do not pose any short - circuit problem . fig5 is a flow chart showing a drawing procedure in the circuit pattern forming method of the second embodiment . fig6 a - 6f are schematic diagrams showing a process of drawing conductive and insulating patterns on a substrate . fig6 a - 6e illustrate a drawn pattern that is dried to evaporate a solvent . fig6 f shows a completed circuit pattern after being baked . step s 11 determines the number of pattern drawing operations required to form a pattern to a desired thickness , the pattern drawing operations involving , respectively , drawing the conductive patterns over the previously drawn one by scanning the head . the desired pattern thickness is set to an appropriate one by considering the conductivity and allowable current . an example case of this embodiment that follows assumes that the conductive pattern of a desired thickness comprises four divided layers , which are drawn by four drawing operations in four head scans . in step s 12 , of the number of drawing operations ( scan ) determined by step s 11 , the number of pattern drawing operations , which are performed continuously in drawing the conductive pattern and the insulating pattern , is determined . the method of determining the number of drawing operations in a continuous drawing layer for a conductive pattern involves checking beforehand the amount of satellites that is actually produced in one drawing operation of the conductive pattern , and determining the maximum number of drawing operations in the continuous drawing session that does not cause any pattern short - circuit by the satellites produced in these drawing operations getting connected together . the amount of satellites produced changes depending on various conditions as described above , so it is important that the number of drawing operations be determined so as to prevent short - circuits from occurring , even if a somewhat greater amount of satellites than expected is produced . in this embodiment , the following description assumes that the conductive pattern is drawn by performing two drawing operations continuously . next , how many of the divided insulating pattern layers is to be drawn continuously or the number of continuous drawing operations is determined . it is desired that the finally formed conductive pattern and insulating pattern are uniform in height . to this end , it is necessary to draw the insulating pattern , so that the thickness of the insulating pattern after being burned is almost equal to the thickness of the conductive pattern that was drawn two times in a row and burned . when , for example , fine insulating particles , with their shrinkage factor almost equal to that of fine metal particles , are used , let us consider a case wherein an amount of insulating particles contained in one droplet of an insulating pattern forming solution is two times that of the metal particles . in this case , the thickness of the insulating pattern formed by one insulating pattern drawing operation is equal to the thickness of the conductive pattern obtained by performing two drawing operations continuously . conversely , when the amount of insulating fine particles contained in one droplet is less than the amount of metal fine particles , two or more drawing operations are required . this embodiment uses the conductive and insulating pattern forming solutions , which have almost the same coagulation factors and almost the same amount of particles contained in one droplet . it is assumed that two insulating pattern drawing operations are performed continuously , the same number as that of conductive pattern drawing operations performed in a row . this invention , however , is not limited to these conditions . in step s 13 , the conductive pattern is drawn the number of times that was determined in step s 12 . fig6 a shows a first divided layer ( formed by the first drawing operation ) of the conductive pattern that is to be completed by two successive drawing operations . a conductive pattern 21 is drawn on a substrate 20 . since the scan direction of the head is toward the right , a satellite 22 lands on the right side of the conductive pattern 21 . next , the second divided layer ( formed by the second drawing operation ), which is drawn and dried , is shown in fig6 b . a second conductive pattern is formed over the first conductive pattern 21 . a satellite 23 formed during the second drawing operation lands on the substrate 20 , but often does not overlap the satellite 22 that has landed during the first drawing operation . next , in step s 14 , at locations where the conductive pattern 21 is not drawn , two divided lasers of the insulating pattern are similarly drawn by two successive drawing operations . fig6 c shows two divided layers of insulating pattern drawn in two drawing operations and dried . the satellites 22 , 23 that have landed in previous operations are now completely covered with the insulating pattern 24 . next , in step s 15 , a check is made to see if the pattern drawing operation has been executed a predetermined number of times . if that number is not yet reached , the process returns to step s 13 to repeat the processing of step s 13 and step s 14 . at the current stage , only two of the four conductive pattern drawing operations have been performed , so the subsequent processing will be explained below . returning from step s 15 to step s 13 , the third and fourth divided layers ( formed by the third and fourth drawing operations ), of the conductive pattern , are drawn in two successive drawing operations and dried . this is shown in fig6 d . these layers are formed over the already drawn conductive pattern 21 . satellites 25 , formed in these drawing operations , land on the insulating pattern 24 drawn in step s 14 . then , as shown in fig6 e , the insulating pattern is drawn in two successive operations and dried in the same way as described above . then , when the number of conductive pattern drawing operations reaches a predetermined number ( a total of four drawing operations ), step s 15 decides that all pattern drawing operations are finished , and ends the pattern drawing process . as a final step , the substrate drawn with circuit patterns is baked to form a printed circuit board , as shown in fig6 f . as shown in this figure , in the insulating pattern 27 , to the right of the conductive pattern 26 , a plurality of satellites 28 , formed during the two successive drawing operations , are situated close to each other at two locations . however , they are not close enough to short - circuit the conductive patterns 26 and , thus , good circuit patterns can be formed . further , in this embodiment , since two scans are performed successively and then dried , the printed circuit board can be completed in a shorter time than when the layers are dried after each drawing operation , as in the first embodiment . fig7 is a flow chart showing a pattern drawing procedure in the circuit pattern forming method in a third embodiment of this invention . fig8 a - 8h are schematic diagrams showing a process of drawing conductive and insulating patterns . fig8 a - 8g illustrate a circuit pattern drawn and dried to evaporate a solvent , and fig8 h shows a completed circuit pattern after being burned . this third embodiment not only can be applied to a case wherein one layer of a circuit pattern is formed over an insulating substrate , but also , to a case wherein a circuit pattern is formed over a conductive substrate . further , this embodiment is also applicable to a case in which another pattern is formed over an already formed circuit pattern , i . e ., a so - called multilayered substrate is formed . here , an example case will be explained in which a second layer of circuit pattern is formed in the multilayered substrate . as shown in fig8 a to 8g , the circuit pattern p 2 of a second layer is formed over circuit pattern p 1 of a first layer , made up of a conductive pattern 51 and an insulating pattern 52 , both formed on a substrate 50 . the circuit pattern p 1 of a first layer shown in fig8 a to fig8 g may be formed in any way , not limited to the method of this invention . in this embodiment , an example case is described in which , as shown in fig8 g , the circuit pattern ( p 2 ) of the second layer is formed by dividing it into four layers and drawing them in four drawing operations , and the layer of the insulating pattern is also formed by dividing it into five layers and drawing them in five drawing operations . in this embodiment , the number of times that a pattern forming solution is repetitively applied to the same position ( the number of layers into which the second layer is to be divided ), to form circuit pattern p 2 of the second layer to a desired thickness , is determined . that is , step s 21 determines the number of layers into which the second layer is to be divided ( the number of times that the conductive pattern is drawn ). here , the conductive pattern layer is divided into four layers , which are then drawn in four drawing operations to produce a desired thickness of circuit pattern p 2 . the following step s 22 determines the number of layers into which the insulating pattern is to be divided ( the number of drawing operations ). the number of insulating pattern drawing operations is one more than the number of conductive pattern drawing operations determined by step s 21 . therefore , the number of insulating pattern drawing operations in this embodiment is five . in step s 23 , as shown in fig8 b , one divided layer of an insulating pattern 31 is drawn ( one time ) over the circuit pattern p 1 of a first layer of fig8 a and then dried . next , step s 24 draws one divided layer of conductive pattern 32 ( one time ) and dries it , as shown in fig8 c . since the head scan direction is toward the right , satellites 33 land on the right side of the conductive pattern 32 . in the next step , step s 25 , one divided layer of insulating pattern is again drawn ( one time ) and dried , as shown in fig8 d . with the insulating pattern 34 drawn , the satellites 33 that have landed in the preceding step are covered with the insulating pattern 34 . next , step s 26 checks if the number of pattern drawing operations has reached a predetermined number . if the predetermined number is not yet reached , the process returns to step s 24 to repeat the processing of step s 24 and step s 25 . at the current stage , since only one of the four conductive pattern drawing operations is finished , the process repeats step s 24 to step s 25 . fig8 e shows a second divided layer of conductive pattern drawn and dried in step s 24 , again . satellites 35 , produced during this conductive pattern drawing operation , land on the previously drawn insulating pattern 34 , and not on the satellites 33 that landed during the first drawing operation . then , in step s 25 , again , an insulating pattern is drawn and dried , as shown in fig8 f . after this , the above step s 24 and step s 25 are similarly repeated . then , as shown in fig8 g , when the number of times that the conductive pattern has been drawn reaches four , and the number of times that the divided insulating pattern has been drawn reaches five , step s 26 decides that all pattern drawing operations are completed , terminating the drawing process . as a final step , the substrate with drawn circuit patterns is baked in a baking device , to form a printed circuit board , as shown in fig8 h . the conductive satellites 38 are present in the insulating pattern 37 . in the pattern of the second layer formed in this embodiment , the insulating pattern is drawn prior to the drawing of the conductive pattern , and the drawing of the insulating pattern is alternated with the drawing of the conductive pattern . therefore , the satellites 38 that land during each conductive pattern drawing operation do not contact each other , preventing the conductive pattern 51 in the first layer and the conductive pattern 36 in the second layer from getting short - circuited undesirably . this makes it possible to form a good circuit pattern . it is preferred that the conductive pattern 36 and the insulating pattern 37 on the completed print circuit board be flat on the same plane , with no height difference . to meet this requirement , it is necessary in this embodiment to select pattern forming solutions in such a manner that a conductive pattern and an insulating pattern , when formed and baked , have the same thicknesses , with the conductive pattern being formed by dividing it into four layers , and drawing them in four drawing operations , and with the insulating pattern being formed by dividing it into five layers and drawing them in five drawing operations . in practice , since priority is given to the conductive pattern being set to a desired thickness in terms of conductivity and allowable current , it is preferable to select an insulating pattern forming solution according to the thickness of the conductive pattern . that is , it is preferred that the insulating particles used in the insulating pattern forming solution have a shrinkage factor almost equal to that of metal particles used in the conductive pattern forming solution , and that the amount of insulating particles contained in one droplet be set to be about 20 % less than that of the metal particles . in the first embodiment described above , divided layers of a circuit pattern have been described to be formed by drawing a conductive pattern of one scan followed by the drawing of an insulating pattern of one scan . in this embodiment , as shown in fig1 , a conductive pattern and an insulating pattern are formed in the same scan by taking advantage of the configuration of the device in which a conductive head and an insulation head are arranged side by side . descriptions of those portions similar to the above embodiments are omitted . fig9 a - 9k are schematic views showing a process of drawing conductive and insulating patterns on a substrate 60 . fig9 a - 9j show a pattern drawn and dried to evaporate a solvent , and fig9 k shows a completed circuit pattern after baking . in the fourth embodiment , a circuit pattern similar to that of the first embodiment is formed . one complete layer of a circuit pattern in its final form shown in fig9 k is , in the drawing process , divided into four layers , which are formed individually , as shown in fig9 j . that is , each of the four layers making up the circuit pattern is formed by one scan of the head or one drawing operation . thus , to form all of the four layers that combine to form one complete layer of the circuit pattern requires four drawing operations . first , as shown in fig9 a , a first scan forms an insulating pattern 61 , corresponding to the first divided layer of the circuit pattern , by ejecting droplets 2 d of an insulating solution from the insulation head . then , as shown in fig9 b , as the conduction head 3 scans over a conductive pattern forming area on the substrate 60 , the head 3 ejects droplets 3 d of a conductive solution to form a conductive pattern 62 on the substrate 60 . because the head draws the conductive pattern as it scans toward the right in the figure , satellites 3 s of the conductive liquid land on the right side of the conductive pattern 62 . when an insulating pattern is drawn , satellites of the insulating solution also land , as in the case with the conductive pattern drawing operation . however , because these satellite do not pose any problem in the circuit operation , they are not shown in the figure . then , as shown in fig9 c , when the insulation head 2 scans over the insulating pattern forming area on the substrate , the head 2 ejects droplets 2 d of the insulating solution to form an insulating pattern 63 on the substrate . by drawing the insulating pattern 63 as described above , the satellites 3 s of the conductive solution that have landed during the previous drawing operation are covered with the insulating pattern 63 . similarly , as shown in fig9 d , 9 e and 9 f , a conductive pattern 64 and an insulating pattern 65 are formed . an operation up to this step is performed by one scan of the head , and this operation forms one of the four divided layers that combine to form a complete layer of the circuit pattern . a fixing process based on drawing may be performed by warming the substrate 60 at any desired time or every scan . next , in a process shown in fig9 g , 9 h and 91 , a second scan of the head forms a second divided layer of the four divided layers making up the one complete layer of the circuit pattern . in this operation , too , the conductive satellites 3 s are covered with insulating patterns 68 , 70 . as shown in fig9 j , when the number of times that the head performs the drawing operation reaches a predetermined number of four , it is decided that all patterns have been completely drawn , terminating the pattern drawing operation . then , as shown in fig9 k , the substrate formed with circuit patterns is baked in a separate baking device , causing metal particles contained as conductive particles in the conductive pattern forming solution to form metal connections . now , the fabrication of circuit patterns is complete . in all of the above embodiment , although the drawing operation has been described to be performed in only one of the forward and backward scans of the head , this invention can also be applied to a configuration in which the drawing operation is performed in both directions . the present invention has been described in detail with respect to preferred embodiments , and it will now be apparent from the foregoing to those skilled in the art that changes and modifications may be made without departing from the invention in its broader aspect , and it is the intention , therefore , in the appended claims , to cover all such changes .	7
turning to fig1 and 2 , a condensate pump 10 is shown comprising a tank ( or reservoir ) 12 , a base 26 , and a centrifugal pump 28 with an integrated electric motor 40 . the tank 12 and the base 26 are molded as a single part . the base 26 houses the centrifugal pump 28 and the integrated electric motor 40 below the tank 12 . as shown in fig1 and 2 , the tank 12 is generally rectangular in shape and has a tank bottom 14 , a tank top 16 , a tank front 17 , a tank back 18 , and tank sides 20 . the tank 12 has a tank inlet 22 in the tank top 16 for receiving liquid , such as condensate water from an hvac system . the tank 12 has a tank outlet 24 ( fig1 ) in the bottom 14 of the tank 12 that is generally rectangular in shape . the centrifugal pump 28 with the integrated electric motor 40 is fastened by means of screws 48 to the underside of the bottom 14 of the tank 12 . with reference to fig1 - 16 , the centrifugal pump 28 comprises a volute - shaped impeller housing 30 with a pump inlet 32 ( fig1 ) in the center of the volute - shaped housing 30 and a pump outlet 34 at the periphery of the volute - shaped housing 30 . an impeller 36 with impeller blades 38 is mounted for rotation within the volute - shaped impeller housing 30 ( fig1 ). the integrated electric motor 40 drives the impeller 36 . the tank outlet 24 ( fig1 ) and the pump inlet 32 are connected together by means of a funnel 42 ( fig1 ). the funnel 42 has a large top opening 44 that is connected to the tank outlet 24 ( fig1 ). the funnel 42 at its opposite end has a small opening 46 that is connected to the pump inlet 32 of the volute - shaped impeller housing 30 ( fig1 and 15 ). the funnel 42 has a substantially vertical side 56 and a facing angled side 58 ( fig1 and 15 ). the facing angled side 58 directs the flow of water into the volute - shaped impeller housing in a direction counter to the rotation of the impeller thereby inhibiting gas from being trapped at the pump inlet 32 . the volute - shaped impeller housing 30 , the pump inlet 32 , the pump outlet 34 , and the funnel 42 can all be molded as a single piece . with reference to fig1 - 16 , the pump outlet 34 from the periphery of the volute - shaped impeller housing 30 is positioned coaxially within the funnel 42 and extends upwardly through the tank outlet 24 into the tank 12 ( fig1 ). the pump outlet 34 is connected to an outlet connector 50 by means of a transition tube 54 and a check valve 52 ( fig1 ). the outlet connector 50 is connected to tubing ( not shown ) for carrying the condensate water away to a disposal location . the positioning of the funnel 42 above of the pump inlet 32 in combination with the gravity fed condensate water from the tank 12 reduces the amount of air bubbles that are sucked into the volute - shaped impeller housing 30 through the pump inlet 32 . the large opening 44 of the funnel 42 allows air bubbles near the pump inlet 32 to bubble up through the funnel 42 and escape into the condensate water in the tank 12 . consequently , the chances of the centrifugal pump 28 becoming airlock or cavitating are substantially reduced . in order to control the operation of the electric motor 40 and therefore the centrifugal pump 28 , a capacitive liquid level sensor 100 is positioned externally to the tank 12 and a pump sensor terminal 110 ( fig1 ) is positioned adjacent the pump inlet 32 . both the capacitive liquid level sensor 100 and the pump sensor terminal 110 are connected to a control circuit 112 ( fig2 a and 20b ) for controlling the operation of the motor 40 , the operation of water level display leds 114 ( fig1 , 20 a , and 20 b ), and the operation of an hvac shutoff relay 128 ( fig2 a and 20b ). as shown in fig8 , 11 , and 17 , 18 , 19 , 20 a , and 20 b . the pump sensor terminal 110 ( fig1 ) is positioned adjacent the pump inlet 32 and is connected to the control circuit 112 by means of a collector line 120 . the capacitive sensor 100 comprises a circuit board 102 that is positioned externally to one of the tank sides 20 and extends along the majority of the height of the tank 12 . a shield foil 104 ( fig1 ) covers the side of the circuit board 102 that faces away from the tank 12 . the foil shield 104 may be continuous or patterned in order to adjust the value of the capacitance at sensor foils 106 and 108 . the shield foil 104 is connected to the circuit ground to minimize electromagnetic noise and interference from external sources . in order to provide additional shielding against electromagnetic noise interference from external sources , guard ring circuits , such as guard ring circuits 160 and 162 shown in fig2 and 22 , may be employed to lower the impedance of the shield foil 104 . the operation of the guard ring circuits 160 and 162 will be described in greater detail below . with reference to fig1 , 20 a , and 20 b , one or more sensor foils , such as first ( lower ) sensor foil 106 and second ( upper ) sensor foil 108 cover the other side of the circuit board 102 that faces the tank side 20 . the sensor foils 106 and 108 each represent a capacitance plate of a capacitor for which the liquid inside the tank 12 forms part of the capacitor &# 39 ; s dielectric . consequently , as the liquid inside the tank 12 rises and falls , the capacitance value of the sensor foils increases and decreases thereby providing a representation of the level of the liquid inside the tank 12 . in the embodiment of the capacitive sensor 100 shown in fig1 , 18 , 19 , 20 a , and 20 b , the sensor foils 106 and 108 are configured in a hexagonal pattern with the individual hexagonal foils in the first foil 106 interconnected by foil connector lines 116 and the individual hexagonal foils in the second foil 108 interconnected by foil connector lines 118 ( fig2 a and 20b ). as can be seen with reference to fig8 , 17 , and 18 , the first foil 106 extends from a position near the bottom 14 of the tank 12 to a gap 124 positioned about halfway up the height of the tank 12 . after the gap 124 , the second foil 108 extends from the gap 124 to near the top 16 of the tank 12 . as the liquid in the tank 12 rises above the bottom 14 of the tank 12 , the dielectric value for the first sensor foil 106 changes , and as a result , the capacitance value for the first sensor foil 106 changes accordingly ( while the capacitance value for the second sensor 108 remains substantially constant ). once the liquid in the tank 12 bridges the gap 124 and then engages the second foil 108 , the discontinuity between the first foil 106 and the second foil 108 is recognized by the control circuit 112 so that the halfway reference point of the tank is established and used as a calibration point for the control circuit 112 . as the liquid in the tank 12 continues to rise along the height of the second foil 108 , the capacitance value for the second foil 108 continues to change accordingly ( while the capacitance value for the first sensor 106 remains substantially constant ). in addition to establishing the calibration point by means of the gap 124 between the sensor foils 106 and 108 , the calibration point positioned between the top and the bottom of the tank can also be established by mechanical means such as having a tank wall thickness below the calibration point greater than the tank wall thickness above the calibration point or vice versa . because the wall of the tank represents part of the dielectric that also includes the liquid in the tank , an abrupt change in the tank wall thickness serves to establish an abrupt change in capacitance value , the calibration point , when the water in the tank reaches the transition point between the thick wall of the tank and the thinner wall of the tank . turning to fig2 a and 20b , the control circuit 112 controls the operation of the pump motor 40 , the liquid level display leds 114 , an alarm 126 , and the hvac shutoff relay 128 . the functions of the control circuit 112 are implemented by a microprocessor 130 . the inputs to the control circuit 112 include the first sensor foil line 132 , the second sensor foil line 134 , and the collector line 120 . each of the lines 132 , 134 , and 120 connects a capacitance value for the first sensor foil 106 , the second sensor foil 108 , and the pump sensor terminal 110 to the control circuit 112 . in order to determine the capacitance value for the first sensor foil 106 , the second sensor foil 108 , and the pump sensor terminal 110 , the microprocessor 130 has a drive pin 136 that drives a first foil input pin 138 through an rc timing circuit that includes the capacitance value of the first sensor foil 106 . the microprocessor drive pin 136 also drives a second foil input pin 140 through an rc timing circuit that includes the capacitance value of the second sensor foil 108 . likewise , the microprocessor drive pin 136 drives a pump sensor input pin 142 through an rc timing circuit that includes the capacitance value of the pump sensor terminal 110 . particularly , when the microprocessor 130 initiates a sense cycle , the microprocessor 130 starts a counter for each of the input pins 138 , 140 , and 142 , and then the microprocessor 130 begins driving each of the input pins 138 , 140 , and 142 positively through their respective rc timing circuits . once each of the input pins 138 , 140 , and 142 reaches a predetermined threshold value its respective counter is suspended . once all of the input pins 138 , 140 , and 142 have reached their respective predetermined threshold values , the microprocessor drive pin 136 reverses polarity and begins discharging the capacitance in the rc timing circuits . at the same time , each of the counters resumes counting . when each of the input pins 138 , 140 , and 142 reaches a zero value , each of the counters is stopped . the count on each of the counters is thereby proportional to the capacitance value for the first sensor foil 106 , the second sensor foil 108 , and the pump sensor terminal 110 , which is in turn indicative of the level of the liquid in the tank 12 . the charge / discharge sequence is employed to minimize any residual dc build up on the capacitance plates or in the circuit components . while the microprocessor 130 can determine the capacitance value for the first sensor foil 106 ( input pin 138 ), the second sensor foil 108 ( input pin 140 ), and the pump sensor terminal 110 ( input pin 142 ) in parallel fashion as described above , the microprocessor 130 can also determine the capacitance value for the first sensor foil 106 ( input pin 138 ), the second sensor foil 108 ( input pin 140 ), and the pump sensor terminal 110 ( input pin 142 ) in serial fashion . in the serial sensing case , the input pins that are not being sensed are driven to ground and act as an additional shields and ground references for the capacitance plate attached to the input pin that is being sensed . further , in the serially sensing case , sensing the capacitance values for the first sensor foil 106 ( input pin 138 ), the second sensor foil 108 ( input pin 140 ), and the pump sensor terminal 110 ( input pin 142 ) requires only a single counter implemented by software in microprocessor 130 . based on the level of the liquid in the tank 12 , the microprocessor activates the liquid level display leds using a multiplex scheme to give a visual indication of the liquid level in the tank 12 . further , when the liquid in the tank reaches a certain height , the microprocessor 130 starts the motor 40 in order to empty the tank 12 . the microprocessor 130 also controls the speed of the motor 40 by varying the pulse width of a speed control signal line 146 to the mosfet speed control switch 144 . once the level of the liquid in the tank 12 drops below a predetermined level , the microprocessor 130 shuts off the motor 40 until the next pumping cycle is required to empty the tank 12 . if the level of liquid in the tank 12 rises above a certain predetermined emergency level , the microprocessor 130 can control the operation of an hvac shutoff relay 128 to stop the hvac system and thereby cut off further flow of condensate water into the tank 12 . at the same time , the microprocessor 30 can trigger the alarm 126 . in the circumstance where the condensate pump 10 has not received any condensate water for an extended period of time and where all of the condensate water in the tank 12 and in the volute - shaped impeller housing 30 has evaporated , the air within the dried out volute - shaped impeller housing 30 may be trapped by the initial reintroduction of condensate water into the pump inlet 32 . the microprocessor 130 determines that the volute impeller housing 30 has dried out by reference to the capacitance value of the pump sensor terminal 110 . once the microprocessor 130 has determined that the volute impeller housing 30 is dry and that air bubbles may be present inside the volute - shaped impeller housing 30 , the microprocessor 130 initiates a priming mode startup for the motor 40 . in the priming mode , the motor 40 is rapidly turn on and off by the microprocessor 130 in an attempt to dislodge air bubbles that may be attached to the impeller blades 38 of the impeller 36 ( fig1 ). turning to fig2 and 22 , guard ring circuits 160 and 162 serve to shield the sensor foils , such as sensor foil 106 , from electromagnetic noise and interference . as previously described , the sensor foils , such as sensor foil 106 , are driven positively and negatively by the drive pin 136 of microprocessor 130 . with respect to guard ring circuit 160 shown in fig2 , an inverting amplifier 150 drives the shield foil 104 with an opposite polarity to that of the charging voltage of drive pin 136 . the capacitance between shield foil 104 and sensor foil 106 then becomes the capacitor of an integrator . by adjusting the capacitance between the shield foil 104 and the sensor foil 106 , interfering signals superimposed on the sensor foil 106 may be canceled . the guard ring circuit 162 shown in fig2 , has an operational amplifier 152 connected as a voltage follower . in this voltage follower configuration , leakage currents that might flow to or from the sensor foil 106 are nullified by the surrounding shield foil 104 , which is driven to the same electrical potential as the sensor foil 106 . while this invention has been described with reference to preferred embodiments thereof , it is to be understood that variations and modifications can be affected within the spirit and scope of the invention as described herein and as described in the appended claims .	5
all of the illustrated individual parts of the heat exchanger are composed of metal , preferably of aluminum or aluminum alloys , which is expediently coated with a solder layer . the individual parts , such as flat tubes 1 , fins 4 , tube bases 5 , collecting tanks 6 and side parts 30 , are produced from metal sheets , though it is not excluded that for example the flat tubes 1 could also be produced as drawn tubes . the flat tubes 1 have an approximately rectangular cross section , it however being possible for the narrow sides 2 to also be arched outward slightly . in the embodiment shown , the inner inserts are situated in the flat tubes 1 . the flat tubes 1 are then stacked with fins 4 in order to form a flat - tube / fin block . tube bases 5 are placed on the ends of the flat tubes 1 , with the ends of the flat tubes 1 being situated in openings 21 of the tube bases 5 , where a sealed soldered connection is later formed . the collecting tanks 6 are then placed on , specifically , as can be seen in particular from fig4 , with the projections 11 at the edges 10 of the collecting tanks 6 thereby being inserted into those edge regions of the flat tubes 1 which are formed by the narrow sides 2 , which protrude slightly beyond the edges 20 of the tube base 5 , of the flat tubes 1 . preferably situated at the edge of the openings 21 in the tube bases 5 are rim holes ( not illustrated ) which preferably point away from the collecting tank 6 , so that the flat tube ends do not protrude inward in order to ensure a low loss of pressure of the medium flowing into the flat tubes 1 . webs 22 are provided between the openings 21 in the tube bases 5 . the webs 22 can be of profiled design in order to increase their stiffness . finally , the side parts 30 are placed on , which side parts 30 at the same time close off the end - side openings 60 of the collecting tanks 6 . for this purpose , the side parts 30 have , at their ends , in each case one cup - shaped closure piece which fits into the opening 60 . the side parts 30 are provisionally fixed , and hold the individual parts of the heat exchanger together , by means of deformable retaining elements 61 which engage into a slot 62 of the side parts . in said form , the heat exchanger is substantially prepared for carrying out the cab hard soldering process . all the connections are produced in one working operation in the soldering furnace . the shape of the projections 11 is expediently matched to the contour of the flat tubes 1 which is provided in the region of the narrow sides 2 , so that both the insertion is facilitated and also sealed soldered connections are provided . certain production tolerances are also absorbed in this way . the spacing of the projections 11 at the edge of the collecting tanks 6 corresponds to the spacing of the flat tubes 1 in the row or with the height of the fins 4 arranged between the flat tubes 1 . here , certain tolerances must be permissible which can however be compensated by the expedient shape of the projections 11 ( see the description of fig1 and 16 further below ). the collecting tanks 6 are of particularly production - friendly , simple configuration . only two bends are necessary in order to form the two longitudinal walls and a transverse wall . connecting pipes 70 , for example , can be easily produced by means of shaping processes . particularly production - friendly tube bases 5 are also to be used , which are manufactured from endless band and need merely be cut to the appropriate length , because said tube bases do not have any bent edges at their end sides . accordingly , no expensive drawing tools are required . it is expedient to make reference here to fig4 and 5 . it can be seen in said figures that a lug 100 , which is comparable to the projections 11 , is provided at the edge 10 of the collecting tank 6 . said lug 100 interacts with the corresponding cut - out 101 at the edge 20 of the tube base 5 and ensures sealed soldered connections there . it can also be seen from fig5 that the openings 21 in the tube base 5 extend into the edge 20 , as indicated by the reference symbol 22 . the tube bases 5 can therefore , during assembly , also be pushed transversely with respect to their longitudinal direction , or in the direction of the wide sides 3 of the flat tube ends , onto said flat tube ends . in the prior art , a movement in the longitudinal direction of the flat tubes is required for this purpose . this is referred to as “ drawing on ” the tube bases . fig3 and 6 in particular show , in a view of one of the side parts 30 , that there are no lateral protrusions of the tube bases 5 beyond the flat - tube / fin block . the width of the side parts 30 corresponds approximately to the dimension of the wide sides 3 of the flat tubes 1 . it is also to be pointed out that the heat exchanger according to the invention permits relatively easy access from the outside to connections which are critical in soldering terms . critical connections of said type are the flat - tube / tube - base connections . should leakages be present there after the soldering process is carried out , the corresponding points can , by virtue of being largely accessible , be easily aftertreated and eliminated in a second soldering process . in heat exchangers of the prior art , it is often not possible to do this , resulting in high rejection rates . fig7 schematically shows one individual flat tube 1 , specifically in a view of the flat tube end . flat tubes 1 of said type are provided in desired numbers in the heat exchanger . two projections 11 extend into each flat tube 1 . the penetration depth need only be a few millimeters ; 10 - 15 mm is more than enough . it would practically be even less . it is self - evident that the one projection 11 is situated on the one edge of the collecting tank 6 and the other projection 11 is situated on the opposite , other edge 10 of the collecting tank 6 . the projections 11 bear tightly from the inside against the narrow sides 2 of the flat tubes 1 . situated in the flat tubes 1 is an inner insert 80 , as is typical in particular for charge air coolers which are impinged on by cooling air . in other applications , an inner insert is dispensed with entirely . it is practically often difficult to insert the inner inserts 80 into the flat tubes 1 in such a way that the least possible bypass is generated in the region of the narrow sides 2 for the charge air flowing through , which has an adverse effect on the heat transfer . as shown in fig7 , the projections 11 have a favorable effect on the reduction of the disadvantageous bypass , which is a further advantage of the invention . the small gaps in the corners of the flat tubes 1 are caused by the illustration . they are in practice not present or are securely closed off in the soldering process . said gaps will also level out as the projections 11 are inserted , since the projections 11 hold the two wide sides 3 under a certain tension in the direction of the arrow . fig8 and 9 now show an alternative design in which the projections 11 are arranged on the tube bases 5 . in said case , the tube bases 5 must be drawn on in the tube longitudinal direction , with the projections 11 simultaneously being inserted into the flat tube ends 1 . thereafter , the collecting tanks 6 and the side parts 30 are placed on and mounted . single - part collecting tanks 6 have been provided at least in the exemplary embodiment which is shown in fig1 - 14 . it is however provided in any case that the collecting tanks 6 also comprise the tube bases 5 , so that therefore no classic tube bases are provided as separate parts , as can be gathered from said figures . the collecting tank 6 has a base section 106 from which extend two bent walls 107 of the collecting tank 6 . the walls 107 are shaped and can be connected by means of a longitudinal weld seam ( not shown ) in order to form the collecting tank 6 . provided in the base section 106 are receiving openings 21 for the flat tube ends , wherein the spacings of the flat tubes 1 should accordingly correspond to the spacings of the receiving openings 21 . a very prominent feature is that the receiving openings 21 extend into the walls 107 , that is to say they extend slightly beyond the bent edge of the walls 107 on the base section 106 , as can be seen sufficiently clearly from fig1 at reference symbol 22 . in the exemplary embodiments shown , in each case one strip ( additional part ) 110 is situated on all the walls 107 of the two collecting tanks 6 . at the walls 107 of the one collecting tank 6 , the strips 110 have been formed with additional functions such as for example with retaining functions 90 for accessories ( not illustrated ). it is not strictly necessary to provide strips 110 on all the walls 107 . it is advantageous to provide a trip 110 in particular whenever additional functions 70 are to be carried out . in the present exemplary embodiment , it would be fundamentally entirely possible to dispense with those narrow strips 110 at the walls 107 of the left - hand collecting tank 6 which do not provide any additional function , and for this purpose to provide there the solution described above , that is to say , there , the projections 11 would be arranged directly on the walls 107 of the collecting tank 6 , and tube bases would be provided as individual parts , as shown in the figures . a further advantage of the strip 110 can be gathered from fig1 . it can be seen in said figure that the strip 110 , which is formed with the stated additional functions , can also contribute to the strength of the collecting tank 6 . it can be seen in fig1 that the strip 110 extends over a considerable part of the wall 107 of the collecting tank and is soldered to said wall 107 . it is possible from fig1 and 14 to more clearly see the design of the strip 110 with regard to the projections 11 which are arranged thereon at intervals . the projections 11 can be provided with a contour which serves to facilitate the sliding of said projections 11 into the flat tubes 1 . between the projections 11 , which are first projections 11 , are situated in each case second projections 12 . as can be seen , in each case one second projection 12 has been arranged between two first projections 11 . the second projections 12 cause a counteracting moment of the strip 110 which could otherwise , when the first projections 11 are situated in the flat tube ends , seek to stick out away from the wall 107 , which is undesirable . since the second projections 12 bear in each case against the fins 4 from the outside , this is prevented or at least counteracted . it can also be seen from fig1 and 14 that it is advantageous to form a hook 13 at the ends of the strip 110 , which hook 13 is suitable to fixedly hold the side part 30 against the outer fin 4 . this assists in holding the entire heat exchanger together before soldering . in addition , this also suppresses the abovementioned “ sticking out ” of the strip 110 from the wall 107 . in addition , it is also possible in this way to dispense with the brackets , shown in fig1 at positions 61 and 62 , which are intended to retain the side parts 30 in the end - side openings 60 of the collecting tank 6 , which is also advantageous in production terms . fig1 shows a detail with only one projection 11 . the projections 11 have been designed in the manner of incisors 111 . length tolerances in the flat tubes which are in the range from +/− 1 . 0 mm can be better absorbed in this way . sharp edges 112 have been formed on said projections 11 , which sharp edges 112 also extend in the radii , that is to say in the region of the transition from the projection 11 into the wall of the collecting tank 6 or of the additional part or of the tube base . as the projections 11 are inserted into the flat tube ends , the sharp edges 112 cut said ends of those flat tubes which are in the upper length tolerance range open slightly and “ crumple ” said ends around slightly . this can be clearly seen in fig1 at k . the central tube there is slightly longer than the two other tubes . the sharp edge of the projection 11 is produced for example by means of cold shaping . the thickness difference between the projections 11 and the wall of the flat tubes assists said process . the wall of the collecting tank 6 , from which the projections 11 are for example formed , can be approximately 1 . 0 - 2 . 0 mm thick , while the thickness of the wall of the flat tubes can be in the range from 0 . 05 - 0 . 25 mm . overall , the invention accordingly provides an innovative product which , compared to the prior art , leaves little to be desired .	8
mounting system 100 for mounting a flat panel electronic display 102 , and optionally a peripheral device such as a dvd player 104 , on a wall 106 is depicted generally in fig1 and 1a . mounting system 100 generally includes wall brackets 108 , 110 , cross - supports 112 , display interface brackets 114 , 116 , and shelf assembly 118 . as depicted generally in fig2 - 13 , wall brackets 108 , 110 , are substantially identical and each generally includes mirror image guide members 120 , 122 , carrier assembly 124 , and end caps 126 , 128 . each guide member 120 , 122 , includes wall interface flange 130 with guide flange 132 projecting perpendicularly therefrom . each wall interface flange 130 has an upper 134 and a lower 136 end portion , each defining an elongate rounded notch 138 . when inwardly extending portions 140 , 142 , of guide member 120 are registered and mated with inwardly extending portions 140 , 142 , of guide member 122 , the guide flanges 132 of guide members 120 , 122 , are spaced apart , and the rounded notches 138 of end portions 134 , 136 , define an elongate aperture in each . each guide flange 132 defines a pair of elongate slots 144 , 146 . carrier assembly 124 generally includes mirror image body plates 148 , 150 , a pair of floating connection structures in the form of spherical bearing assemblies 152 , and coupling members 154 , 156 . each body plate 148 , 150 , defines a pair of cross - support apertures 158 , 160 , surrounded by fastener holes 162 , 164 . spherical bearing assembly 152 generally includes mirror image housing halves 166 , 168 , and bearing 170 . each housing half 166 , 168 , defines aperture 172 having an inwardly oriented spherical inner surface 174 conforming to outer surface 176 of bearing 170 . housing halves 166 , 168 , are mated , with inner surface 178 of housing half 166 confronting inner surface 180 of housing half 168 and apertures 172 registered to define housing 182 . bearing 170 is captured in apertures 172 with outer surface 176 confronting inner surfaces 174 . coupling members 154 , 156 , each generally include end flange 184 defining threaded aperture 186 , and projecting legs 188 , 190 . end caps 126 , 128 , each define a horizontally oriented elongate aperture 192 and a vertically oriented aperture 194 . coupling members 154 , 156 , are received between ends 196 , 198 , respectively of body plates 148 , 150 . spherical bearing assemblies 152 are also received between body plates 148 , 150 , the bearing 170 of each registered with one of cross - support apertures 158 , 160 . fasteners 200 extend through fastener holes 162 , 164 , 202 , 204 , and corresponding fastener holes 206 in housing halves 166 , 168 , and fastener holes 208 in coupling members 154 , 156 , from each side of carrier assembly 124 to secure the assembly together . carrier assembly 124 is received between guide flanges 132 of guide members 120 , 122 , as depicted in fig2 . guide pins 210 , 212 , respectively extend through elongate slots 144 , 146 , and apertures 214 in end caps 126 , 128 . carrier assembly 124 is thus vertically slidable between guide members 120 , 122 , guided by guide pins 210 , 212 , in slots 144 , 146 . end caps 126 , 128 , are received on upper and lower end portions 134 , 136 , of guide members 120 , 122 , and are secured in place with fasteners ( not depicted ) extending through apertures 216 . a height adjustment control in the form of vertical position adjustment screw 218 extends through vertically oriented aperture 194 in end cap 126 and threads into threaded aperture 186 . as vertical position adjustment screw 218 is rotated , carrier assembly 124 slides between guide members 120 , 122 . in an alternative embodiment depicted in fig2 a , guide members 120 , 122 , have end flanges 120 a , 120 b , 122 a , 122 b , respectively , and are connected with end connectors 126 a , 128 a , respectively . cosmetic caps ( not depicted ) may be fitted over end connectors 126 a , 128 b , for aesthetic purposes if desired . in another alternative embodiment depicted in fig4 , wall brackets 108 , 110 , are coupled in a single unit with upper and lower frame members 600 , 602 , respectively . mirror image display interface brackets 114 , 116 , are generally depicted in fig1 - 26 , each generally including display interface member 220 , hook plates 222 , and optionally one or both of upper latch assembly 224 , and lower latch assembly 226 . display interface member 220 generally includes display interface channel portion 228 with guide flange portion 230 extending perpendicularly thereto . display interface channel portion defines a plurality of apertures , some of which may be rounded 232 , and some of which may be elongate 234 , for receiving fasteners to attach flat panel electronic display 102 on display receiving surface 236 . guide flange portion 230 defines guide structures 237 in the form of slots 238 , 240 . although depicted as slots , it will be appreciated that guide structures 237 may also be configured as other structures fulfilling the same purpose , such as for example , channels , grooves , recesses , ridges , cam surfaces , or the like . further , it will be appreciated that guide structures 237 may be arcuate , angular , or straight in shape . guide flange portion 230 further defines friction slot 242 . each hook plate 222 defines guide structures 244 , configured as slots 246 , 248 . upper end 250 defines upper hook 252 , while lower end 254 defines lower hook 256 . again , although depicted as slots , it will be appreciated that guide structures 244 may also be configured as other structures fulfilling the same purpose , such as for example , channels , grooves , recesses , ridges , cam surfaces , or the like . further , it will be appreciated that guide structures 244 may be arcuate , angular , or straight in shape . as depicted in fig1 , 16 , and 21 , upper end 250 may farther define latch guide slot 258 and latch adjustment aperture 260 . as depicted in fig2 - 26 , lower end 254 may further define latch guides 262 , 264 , and spring pin guide 266 . friction screw aperture 268 extends through hook plate 222 intermediate slots 246 , 248 . as depicted in fig1 and 19 , upper latch assembly 224 generally includes latch plate 270 , guide 272 , guide retainer 274 , and fastener 276 . latch plate 270 defines geared aperture 278 and guide slot 280 . shank portion 282 of guide 272 extends through latch guide slots 258 of both hook plates 222 and guide slot 280 of latch plate 270 . guide 272 is retained with guide retainer 274 and fastener 276 . geared aperture 278 is registered with latch adjustment aperture 260 of each hook plate 222 . teeth 282 in geared aperture 278 may be configured to mesh with the tip of a standard phillips screwdriver . lower latch assembly 226 as depicted in fig2 - 26 generally includes latch plate 284 , spring 286 , and spring slide 288 . latch plate 284 defines spring aperture 290 and guide pin apertures 292 . spring slide 288 is received in spring aperture 290 with notches 294 engaged with opposite sides . one end of spring 286 is received over tab 296 with the opposite end bearing on spring slide 288 . guide pins 298 are received in each of apertures 292 and are retained in position with retainers 300 . latch plate 284 is received between lower ends 254 of hook plates 222 , with lateral ends 302 of spring slide 288 projecting through spring pin guides 266 , and the outer ends of guide pins 298 received in latch guides 262 , 264 . guide pin 304 extends through slot 238 and the guide slots 246 of both hook plates 222 , while guide pin 306 extends through slot 240 and guide slots 248 of both hook plates 222 . each guide pin 304 , 306 , is retained on each side with a retainer 308 . friction screw 310 extends through friction slot 242 and friction screw aperture 268 in each of hook plates 222 and is secured with knob 312 . friction washers 314 are positioned on each side between guide flange portion 230 and hook plate 222 . during installation , wall brackets 108 , 110 , are mounted at a desired position on wall 106 with fasteners 316 through elongate apertures 192 in end caps 126 , 128 , as depicted in fig2 , preferably into a load bearing member of wall 106 such as a stud . wall brackets 108 , 110 , are preferably mounted at substantially the same height h from floor 318 so as to minimize the amount of adjustment needed . it will be appreciated that elongate apertures 192 enable the top and bottom of each of wall brackets 108 , 110 , to be shifted laterally before fasteners 316 are tightened in order to ensure proper vertical alignment . once fasteners 316 are tightened , cross - supports 112 may be inserted through the horizontally registered spherical bearings of the wall brackets 108 , 110 . cross - supports 112 are freely slidable through bearings 170 . if not initially registered , horizontally corresponding bearings 170 of wall brackets 108 , 110 , can be brought into registry by operating vertical position adjustment screws 218 on one or both of wall brackets 108 , 110 , thereby causing carrier assemblies 124 to move vertically . with cross - supports 112 in place , vertical position adjustment screws 218 can also be operated so as to raise or lower the height of cross - supports 112 above floor 318 , to level cross - supports 112 , or to otherwise adjust the orientation of cross - supports 112 relative to other structures in the room such as comers or furniture . in embodiments of the invention , the carrier assembly 124 of each wall bracket 108 , 110 , is independently capable of between ½ to 2 inches of vertical travel . spherical bearing assemblies 152 enable cross - supports 112 to be oriented out of perpendicular with the carrier assemblies 124 , thereby enabling independent shifting of carrier assemblies 124 without binding . for example , as depicted in fig4 a , cross - supports 112 may be adjusted to parallel a ceiling 320 that is not parallel with floor 318 . as depicted , the ends of upper cross - support 112 are both the same distance h 1 below ceiling 320 , while the ends of lower cross - support 112 , which is parallel with the upper cross - support , are at differing distances h 3 , h 4 , above floor 318 . when an electronic display 102 is coupled with cross supports 112 , the top and bottom edges of the electronic display 102 will be parallel with ceiling 320 . in another example depicted in fig4 b , mount 100 may be installed such that wall brackets 108 , 110 , are skewed or at differing distances h 5 , h 6 , above floor 318 . carrier assembly 124 of each wall bracket 108 , 110 , can be independently adjusted so that the ends of cross supports 112 are located a uniform distance from ceiling 320 or floor 318 . when an electronic display 102 is coupled with cross - supports 112 , the top and bottom edges of the electronic display 102 will be parallel with ceiling 320 and floor 318 . with cross - supports 112 inserted through bearings 170 of wall brackets 108 , 110 , end caps 320 may be inserted in each end of cross - supports 112 to prevent cross - supports 112 from being withdrawn . in embodiments of the invention , cross - supports 112 are laterally slidable within bearings 170 even with end caps 320 in place so as to enable a wider range of lateral positioning relative to wall brackets 108 , 110 . for example , as depicted in fig4 , cross - supports 112 may be shifted to one side or the other , such that mount 100 can be located wherever necessary on wall 106 to ensure fastening to studs or other support structure within wall 106 . as also depicted in fig4 , the ability to laterally shift cross - supports 112 may also facilitate the assemblage of multi display arrays of electronic display devices 102 . displays 102 can be positioned relative to each other without the necessity of ensuring uniform lateral spacing of mounts 100 . display interface brackets 114 , 116 , may be then attached to the back of display 102 with fasteners through apertures 232 , 234 . the plurality of round apertures 232 and the elongate apertures 234 enable brackets 114 , 116 , to be attached at a variety of vertical positions on the back of display 102 . display 102 with display interface brackets 114 , 116 , attached may then be coupled with cross - supports 112 by hooking upper hook 252 of each bracket 114 , 116 , over the top cross - support 112 and lower hook 256 of each bracket 114 , 116 over the bottom cross - support 112 . if brackets 114 , 116 , are equipped with upper latch assembly 224 , the latch assembly 224 may be engaged by inserting a phillips screwdriver through aperture 260 , engaging the tip of the screwdriver with teeth 282 , and rotating the screwdriver . as the screwdriver rotates , guide 272 slides in guide slots 258 and tip 324 of latch plate 270 is urged around cross - support 112 to close the latch . disengagement is the reverse of engagement if brackets 114 , 116 , are equipped with lower latch assembly 226 , tip 326 of latch plate 284 encounters bottom cross - support 112 as lower hook 256 is engaged . latch plate 284 rotates against the bias provided by spring 286 with pins 298 sliding in guides 262 , 264 , and spring slide 288 sliding in guides 266 . once sufficient clearance exists between tip 326 and upper edge 328 of lower hook 256 to enable passage of cross - support 112 , the bias of spring 286 urges latch plate 284 to snap back into position with lower hook 256 engaged around cross - support 112 . disengagement is accomplished by pulling outward on the bottom of display 102 with sufficient force to overcome the bias of spring 286 , thereby causing latch plate 284 to rotate in the opposite direction . with display 102 coupled to cross - supports 112 , the tilt position of the display may then be adjusted as depicted in fig2 . with knob 312 loosened so as to reduce friction , display 102 may be tilted to a desired position by pulling the top of the display away , or pushing the top of the display toward , wall 106 . guide pin 304 slides or rolls in slot 238 and the guide slots 246 of both hook plates 222 , while guide pin 306 slides or rolls in slot 240 and guide slots 248 of both hook plates 222 to enable tilting . because of the orientation of slots 238 , 240 , and guide slots 246 , 248 , display 102 pivots about a horizontal pivot axis x - x extending through the display 102 forward a distance y of the display receiving surface 236 and down a distance z from a horizontal midline b - b of the display 102 . with this configuration , display 102 is tiltable in either direction with a minimum of effort and tends to remain in position even with knob 312 loose . once a desired tilt position is reached , however , knobs 312 may be tightened to apply frictional resistance to hold display 102 in the tilt position . further teachings relating to the optimal orientation of guide slots 238 , 240 , may be found in pct application no . pct / us2008 / 000117 , hereby fully incorporated herein by reference . shelf assembly 118 is depicted in fig2 - 31 and generally includes hook assemblies 322 , slide 324 , shelf support 326 and shelf 328 . hook assembly 322 generally includes uprights 330 , hook portion 332 and cross - member 334 . slide 324 generally includes channels 336 and cross - member 338 . each of channels 336 defines a plurality of elongate apertures 340 . shelf support 326 generally includes lateral members 342 and back plane 344 . as depicted in fig1 a , hook portion 332 hooks over cross - support 112 to suspend shelf assembly 118 from the mount . uprights 330 are coupled to slide 324 with fasteners extending through elongate apertures 340 . with these fasteners loosened , uprights 330 are slidable relative to slide 324 to adjust height h 1 of cross - member 112 above shelf 328 . shelf 328 may be made from transparent material such as glass , or from opaque materials , depending on the aesthetic effects desired . an alternative embodiment of a shelf assembly 346 is depicted in fig3 - 38 . shelf assembly 346 generally includes extrusion 348 , shelf support 350 and hook assembly 352 . extrusion 348 may be , for example , an aluminum extrusion having a cross - section as depicted in fig3 . shelf support 350 generally includes a pair of channels 354 connected with a back plane coupler 356 . shelf support 350 is attached to extrusion 348 with fastener 358 . hook assembly 352 generally includes coupler 360 and hooks 362 . hooks 362 may be equipped with a latch assembly similar to previously described upper latch assembly 224 . hook assembly 352 is attached to extrusion 348 with fasteners 364 . it will be appreciated that hook assembly 352 may be attached at any desired location along extrusion 348 in order to adjust the position of a shelf resting on shelf support 350 relative to cross - supports 112 . in use , hooks 362 are engaged over cross - support 112 in a similar fashion as for the hooks of shelf assembly 118 as previously described . accessory attachment 366 as depicted in fig3 - 36 may be used to attach various accessories and peripheral devices , such as speaker 368 to mounting system 100 . accessory attachment 366 generally includes extrusion 370 , hook assembly 372 and device interface 374 . extrusion 370 may be , for example , an aluminum extrusion having a cross - section as depicted in fig3 . hook assembly 372 is attached to extrusion 370 with fasteners 376 . it will be appreciated that hook assembly 372 may be attached at any desired location along extrusion 370 in order to adjust the position of device interface 374 and an attached device relative to cross - supports 112 . device interface 374 generally includes channel 378 and couplers 380 . couplers 380 are attached to channel 378 with fasteners 382 extending through slot 384 such that couplers 380 are selectively slidable along channel 378 . each coupler 380 defines an aperture 386 for receiving a fastener ( not depicted ) to attach a desired device such as speaker 368 . in use , hook assembly 372 is engaged over cross - support 112 as depicted in fig3 to suspend the accessory attachment 366 from mounting system 100 . in fig4 there is depicted a non - height adjustable version of a mount 604 . mount 604 generally includes frame 606 having a pair of forwardly projecting flanges 608 , 610 . cross - supports 112 are received through apertures in each of flanges 608 , 610 , with bearing halves 612 on each side of the flange . cross - supports 112 are laterally slidable as in the vertically adjustable version depicted in fig4 , thereby enabling a greater range of positioning for mount 604 on wall 106 . it will be appreciated that mount 604 can be used alone in applications where height adjustability is not needed . it will also be appreciated that mount 604 can be used with one or more of mounts 100 to form multi - element arrays where some of the display elements are to be fixed in position and other elements of the array are to be tiltable or height adjustable . in a further embodiment of the invention , speakers may be laterally attached so as to project on each side of the electronic display using speaker attachments 388 as depicted in fig3 - 41 . each speaker attachment 388 generally includes interface channel 390 , rods 392 and coupler 394 . small end 396 of coupler 394 is received in the end of cross - support 112 . coupler 394 defines central bore 398 which slidably receives rod 392 . each rod 392 is coupled to channel 388 . channel 388 defines slot 400 for receiving fasteners ( not depicted ) to attach a speaker to the channel . it will be appreciated that mount 100 and components thereof can be effectively distributed by packaging one or more of the described mount components in kit form along with user instructions 500 for assembling and attaching mount 100 to a wall 106 , coupling display 102 to mount 100 and adjusting the position of cross - supports 112 and the tilt position of display interface brackets 114 , 116 , in order to position display 102 as desired . user instructions 500 may be provided in printed form as depicted in fig1 a , or in other formats such as video , cd or dvd . the embodiments above are intended to be illustrative and not limiting . additional embodiments are encompassed within the scope of the claims . although the present invention has been described with reference to particular embodiments , those skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention . for purposes of interpreting the claims for the present invention , it is expressly intended that the provisions of section 112 , sixth paragraph of 35 u . s . c . are not to be invoked unless the specific terms “ means for ” or “ step for ” are recited in a claim .	8
referring to fig1 - 4 , a utility lighter 10 according to the present invention comprises a housing 12 and a lighter tube 14 . the housing 12 contains a trigger 24 , a safety switch 26 , a fuel container 28 , a fuel valve 30 , a piezo - electric element 32 , a safety latch 34 , and a fuel lever 36 . the lighter tube 14 contains an ignition mechanism 16 , a burner 18 , a gas flow tube 20 and ignition wires 22 . certain components of the lighter 10 , specifically the fuel container 28 , the fuel valve 30 and the piezo - electric element 32 are well - known in the art . accordingly , those of ordinary skill in the art will recognize that such components may be selected as desired and suited for the particular design to be employed in the practice of the present invention . other components of the lighter 10 , such as the housing 12 , the trigger 24 , the safety switch 26 , the safety latch 34 , and the fuel lever 36 are preferably fabricated with a material having sufficient stiffness to permit operation of the lighter 10 without undue flexure . suitable materials are familiar to those of ordinary skill in the art and may be selected accordingly . the housing 12 may be formed to provide a “ pistol ”- like form or any other ergonomically desirable shape . the housing 12 includes a stop 38 to position and support the piezo - electric element 32 , and a safety latch pivot 42 to engage the safety latch 34 . the internal features may be integrally formed from the material of the housing 12 or otherwise affixed within the housing . referring to fig4 , the trigger 24 is positioned within the housing 12 so as to allow the trigger 24 to slide back and forth within the housing 12 , as indicated by arrow 60 . the piezo - electric element 32 is positioned and secured within the housing 12 and between the stop 38 and the trigger 24 . the piezo - electric element 32 is positioned such that when the trigger 24 is pulled or drawn towards the peizo - electric element 32 in the direction indicated by arrow 60 , the piezo - electric element 32 is sandwiched between the stop 38 and the trigger 24 , thereby activating the spring - loaded mechanism of the piezo - electric element 32 . upon activation , the piezo - electric element 32 generates a brief high - voltage electrical charge that is discharged through the ignition wires 22 and to the ignition mechanism 16 at the burner 18 . when the trigger 24 is released , the spring - loaded mechanism of the piezo - electric element 32 urges the trigger 24 into its original position . the fuel container 28 is positioned and secured within the housing 12 . the fuel valve 30 is affixed to the fuel container 28 such that it is positioned proximate to the trigger 24 . the fuel valve 30 may include a flame height adjuster 31 , which may be rotated by means of an adjustment lever 33 to allow the user to vary the flow of fuel emanating from the lighter 10 and , hence , the intensity of the flame provided by the lighter 10 . the fuel lever 36 is positioned so as to engage the fuel valve 30 and the trigger 24 , such that when the trigger 24 is pulled in the direction indicated by arrow 60 , the lever 36 rotates as indicated by arrows 66 a and 66 b , pulling the fuel valve 30 forward ( i . e ., in the opposite direction of the motion of the trigger 24 ), and opening the valve 30 . upon opening of the valve 30 , fuel flows through the gas flow tube 20 to the burner 18 . thus , it can be seen that activation of the trigger 24 acts to simultaneously open the fuel valve 30 and operate the piezo - electric element 32 . in this manner , fuel is released only in the presence of the spark generated by the piezo - electric element 32 , ensuring that the fuel will be ignited and substantially reducing or eliminating the risk of venting unburnt fuel to the atmosphere . moreover , when the trigger 24 is released , the trigger 24 is urged back into the “ off ” position by the piezo - electric element 32 , as described above , which also has the effect of closing the fuel valve 30 . referring to fig2 and 3 , the safety switch 26 is positioned on and protrudes through the housing 12 . the safety switch 26 is preferably located proximate to and on the opposite side of the lighter 10 from the trigger 24 to allow the user &# 39 ; s thumb to be used to activate the safety switch 26 ( by urging the switch 26 in the direction indicated by arrow 62 ) prior to or simultaneously activating the trigger 24 with the index finger . a spring 27 is positioned within the safety switch 26 and engages the housing 12 to urge the safety switch 26 back into its original position when released . the safety latch 34 is positioned within the housing 12 and is mounted on the safety lever pivot 42 . a spring 44 biases the latch 34 in the desired position locked position . the latch 34 is positioned to engage the safety switch 26 and the trigger 24 such that when the safety switch 26 is engaged by the user in the direction indicated by arrow 62 , the latch 34 is rotated about the pivot 42 in the direction indicated by arrow 64 and disengaged from the trigger 24 , thereby allowing the trigger 24 to be operated in the manner described above . when the safety switch 26 is not engaged , the spring 44 biases the latch 34 such that the latch is rotated downward into the trigger 24 and a catch 48 on the latch 34 engages a corresponding catch 49 on the trigger 24 , fixing the trigger 24 in place . in short , release of the safety latch 34 acts only to release the trigger 24 and does not open fuel valve 30 or activate piezoelectric element 32 . thus , unlike safety mechanisms of the prior art , activation of the safety switch of the present invention does not permit the release of unburnt fuel . moreover , because the activation of the trigger 24 ( which is only possible when the safety switch 26 has been activated ) simultaneously opens the fuel valve 30 and triggers the piezo - electric element 32 , igniting the flame , the flame is ignited by the activation of the trigger , preventing the release of unburnt gas . in addition , the safety switch 26 may be released once the flame is ignited without extinguishing the flame . this is because the release of the safety switch 26 releases the latch 34 , which is then urged against the top of the trigger 24 ( as shown in ghosted lines in fig4 ) by the spring 44 . the latch 34 does not interfere with the flow of fuel or otherwise inhibit the flow of fuel . this allows the user to release the safety switch 26 and employ only the user &# 39 ; s index finger to maintain a flame , a more comfortable and ergonomically efficient position for the user &# 39 ; s hand . once the trigger 24 is released , it is urged into the “ off ” position by the piezo - electric element 32 . as the trigger 24 returns to the “ off ” position , the latch 34 is urged against the trigger 24 and re - engages catch 49 to lock the trigger 24 in place . referring to fig5 - 8 , an alternative embodiment of a utility lighter 110 according to the present invention comprises a housing 112 and a lighter tube 114 . the housing 112 contains a trigger 124 , a safety switch 126 , a fuel container 128 , a fuel valve 130 , a piezo - electric element 132 , a safety latch 134 , and a fuel lever 136 . the lighter tube 114 contains an ignition mechanism 116 , a burner 118 , a gas flow tube 120 and ignition wires 122 . certain components of the lighter 110 , specifically the fuel container 128 , the fuel valve 130 and the piezo - electric element 132 are well - known in the art . accordingly , those of ordinary skill in the art will recognize that such components may be selected as desired and suited for the particular design to be employed in the practice of the present invention . other components of the lighter 110 , such as the housing 112 , the trigger 124 , the safety switch 126 , the safety latch 134 , and the fuel lever 136 are preferably fabricated with a material having sufficient stiffness to permit operation of the lighter 110 without undue flexure . suitable materials are familiar to those of ordinary skill in the art and may be selected accordingly . the housing 112 may be formed to provide a “ pistol ”- like form or any other ergonomically desirable shape . the housing 112 includes a stop 138 to position and support the piezo - electric element , a fuel lever pivot 140 to engage the fuel lever 136 , and a safety latch pivot 142 to engage the safety latch 134 . the internal features may be integrally formed from the material of the housing 112 or otherwise affixed within the housing . referring to fig8 , the trigger 124 is positioned within in the housing 112 so as to allow the trigger 124 to slide back and forth within the housing 112 , as indicated by arrow 160 . the piezo - electric element 132 is positioned and secured within the housing 112 and between the stop 138 and the trigger 124 . the piezo - electric element 132 is positioned such that when the trigger 124 is pulled or drawn towards the piezo - electric element 132 in the direction indicated by arrow 160 , the piezo - electric element 132 is sandwiched between the stop 138 and the trigger 124 , thereby activating the spring - loaded mechanism of the piezo - electric element 132 . upon activation , the piezo - electric element generates a brief high - voltage electrical charge that is discharged through the ignition wires 122 and to the ignition mechanism 116 at the burner 118 . when the trigger 124 is released , the spring - loaded mechanism of the piezo - electric element 132 urges the trigger 124 into its original position . the fuel container 128 is positioned and secured within the housing 112 . the fuel valve 130 is affixed to the fuel container 128 such that it is positioned proximate to the trigger 124 . the fuel valve 130 may include a flame height adjuster 131 , which may be rotated by means of an adjustment lever 133 to allow the user to vary the flow of fuel emanating from the lighter 110 and , hence , the intensity of the flame provided by the lighter 110 . the fuel lever 136 is positioned so as to engage the fuel valve 130 , the fuel lever pivot 140 , and the trigger 124 , such that when the trigger 124 is pulled in the direction indicated by arrow 160 , the lever 136 rotates around the pivot 140 as indicated by arrows 166 a and 166 b , pulling the fuel valve 130 forward ( i . e ., in the opposite direction of the motion of the trigger 124 ), and opening the valve 130 . upon opening of the valve 130 , fuel flows through the gas flow tube 120 to the burner 118 . notably , the fuel lever 136 may comprise a yoke - shaped lever straddling the piezo - electric element 132 . in this manner , the fuel lever 136 may contact and engage the trigger 124 in a region proximate to where the piezo - electric element 132 engages the trigger . consequently , the force required to activate the trigger 124 and ignite lighter 110 may be concentrated in the same region of the trigger . it has been found that this arrangement permits the trigger 124 to be operated smoothly and efficiently with little excess effort or discomfort to the user . thus , it can be seen that activation of the trigger 124 acts to simultaneously open the fuel valve 130 and operate the piezo - electric element 132 . in this manner , fuel is released only in the presence of the spark generated by the piezo - electric element 132 , ensuring that the fuel will be ignited and substantially reducing or eliminating the risk of venting unburnt fuel to the atmosphere . referring to fig6 and 7 , the safety switch 126 is positioned on and protrudes through the housing 112 . the safety switch 126 is preferably located proximate to and on the opposite side of the lighter 110 from the trigger 124 to allow the user &# 39 ; s thumb to be used to activate the safety switch 126 ( by urging the switch 126 in the direction indicated by arrow 162 ) prior to or simultaneously activating the trigger 124 with the index finger . a spring 127 is positioned within the safety switch 126 and engages the housing 112 to urge the safety switch 126 back into its original position when released . the safety latch 134 is positioned within the housing 112 and is mounted on the safety lever pivot 142 . a spring 144 biases the latch 134 in the desired position locked position . the latch 134 is positioned to engage the safety switch 126 and the trigger 124 such that when the safety switch 126 is engaged by the user in the direction indicated by arrow 162 , the latch 134 is rotated about the pivot 142 in the direction indicated by arrow 164 and disengaged from the trigger 124 , thereby allowing the trigger 124 to be operated in the manner described above . when the safety switch 126 is not engaged , the spring 144 biases the latch 134 such that the latch is rotated downward into the trigger 124 and a catch 148 on the latch 134 engages a corresponding catch 149 on the trigger 124 , fixing the trigger 124 in place . in short , release of the safety latch 134 acts only to release the trigger 124 and does not open fuel valve 130 or activate piezo - electric element 132 . thus , unlike safety mechanisms of the prior art , activation of the safety switch of the present invention does not permit the release of unburnt fuel . moreover , because the activation of the trigger 124 ( which is only possible when the safety switch 126 has been activated ) simultaneously opens the fuel valve 130 and triggers the piezo - electric element 132 , igniting the flame , the flame is ignited by the activation of the trigger , preventing the release of unburnt gas . in addition , the safety switch 126 may be released once the flame is ignited without extinguishing the flame . this is because the release of the safety switch 126 releases the latch 134 , which is then urged against the top of the trigger 124 ( as shown in ghosted lines in fig8 ) by the spring 144 . the latch 134 does not interfere with the flow of fuel or otherwise inhibit the flow of fuel . this allows the user to release the safety switch 126 and employ only the user &# 39 ; s index finger to maintain a flame , a more comfortable and ergonomically efficient position for the user &# 39 ; s hand . once the trigger 124 is released , it is urged into the “ off ” position by the piezo - electric element 132 . as the trigger 124 returns to the “ off ” position , the latch 134 is urged against the trigger 124 and re - engages catch 149 to lock the trigger 124 in place . it is also to be appreciated that the foregoing description of the invention has been presented for purposes of illustration and explanation and is not intended to limit the invention to the precise manner of practice herein . it is to be appreciated therefore , that changes may be made by those skilled in the art without departing from the spirit of the invention and that the scope of the invention should be interpreted with respect to the following claims .	5
described below is a system and method for computing system administration using an abstract configuration model . throughout the description , for the purposes of explanation , numerous specific details are set forth in order to provide a thorough understanding of the present invention . it will be apparent , however , to one skilled in the art that the present invention may be practiced without some of these specific details . in other instances , well - known structures and devices are shown in block diagram form to avoid obscuring the underlying principles of the present invention . note that in this detailed description , references to “ one embodiment ” or “ an embodiment ” mean that the feature being referred to is included in at least one embodiment of the invention . moreover , separate references to “ one embodiment ” in this description do not necessarily refer to the same embodiment ; however , neither are such embodiments mutually exclusive , unless so stated , and except as will be readily apparent to those skilled in the art . thus , the invention can include any variety of combinations and / or integrations of the embodiments described herein . as described in the background , previous systems , configurations where completely system dependent . for example , the number of cpus and memory available , os , vm , type , etc . were known prior to starting the system and statically and redundantly distributed across the system or cluster . each node was manually , individually configured with this static system dependent information . fig2 illustrates one embodiment of a model to abstractly configure an entire cluster ( multiple systems ) or portions of the cluster dynamically . this model is broken into several different levels of abstraction 219 , 221 , 223 , 225 , and 227 , with each level offering a different level of abstractness . the order of 219 , 221 , 223 , 225 , and 227 goes from the highest level of abstraction ( 219 ) to the lowest level ( 227 ). additionally , each level of lower abstraction inherits the properties of the level higher than it unless the lower level overwrites the higher level . for example , level 223 inherits the properties of level 221 unless a conflict exists . if a conflict exists , the properties of level 223 control . in an embodiment , the files at each level are written in xml . a configuration is a collection of settings ( properties ) that determine the j2ee engine behavior . a configuration of the engine that is level based for allows for greater usability and flexibility . as the smallest entity for configuration is the instance ( no explicit configuration for separate server nodes is available and all the nodes inside an instance are configured identically ) the structure of the configuration settings on all the configuration levels is the same and represents the instance configuration settings . the actual configuration structure of the engine in the database is complicated so it is generally not a good ideal to let the users ( service manager , administration tools , offline configuration tools ) work directly with it . a configuration abstraction layer provides an api which ( 1 ) exposes the settings at each configuration level to be accessed in the right access mode ( read / write ) and ( 2 ) hides the real representation and paths of the settings in the database . further changes on the structure or paths won &# 39 ; t affect the users because will be handled by the abstraction layer . the basic level 219 is the highest level of abstraction . as will be discussed later , the properties at the basic level 219 are used to help define different physical machines of a multiple systems . the basic instance 201 defines the basic structure of an instance configuration for the entire system or multiple systems . the definitions of the basic instance 201 are name - value property pairs that are common to each system . the number of cpus , amount of memory , location of a java installation , number of nodes , instance type , thread count , etc . are examples of the names of the pairs . these are configuration constants and are also system parameters . these system parameters are installation dependent and system dependent and may be used as constants in the parameterized values . they are evaluated at runtime depending on the actual system resources of each machine and installation configuration of each instance . however , while the name is defined the value is not defined . this value is defined upon installation and is system specific . the definitions from this instance are applied system wide and generally are not subject to change by an end - user . as will be described later , these settings are common for and inherited by the other configuration levels . all the levels down the inheritance chain get this structure and all the settings already defined from their parent configuration . if there is nothing more changed in the settings on some configuration level the data ( settings / properties ) it keeps is just the same as the data in its parent level . effectively the current configuration level is just linked to its parent level and “ sees ” all the settings defined on the parent level . if there are any changes in the settings of the current level , only these changes are described and written in the level , all the ones that are not changed are still received from the parent via inheritance . a specific system is described at the system level 221 . at this level , a customized basic instance 203 may add system level settings not covered by the basic instance 201 or change existing settings from the basic instance 201 . for example , additional name - value pairs may be added and / or the value portion of the basic structure 201 changed . a system may include multiple physical machines , instances , and nodes as illustrated by fig1 . changes made at this level are available globally to the entire system . for example , a change at this level will affect every physical machine 101 , 115 of system 129 . deployable configuration templates for different instance types may be included in the multiple instance ( sometimes referred to as the default template ) level 223 . at this level 223 , multiple instance definitions on the same system may be defined and / or reconfigured using configuration templates . these configuration templates contain pre - defined instance configurations for specific use cases and scenarios like portal 209 , batch processing , minimal 205 , j2ee developer 207 , etc . the settings provided at this level are common for the scenario , for the optimal execution of the engine in this scenario , and , in one embodiment , cannot be changed by end users with configuration tools . for example , the number of threads dedicated for http request processing may be different for different scenarios . while a system may have different types of instances , instances of a single type are normally identically configured . for example , with respect to fig1 , the j2ee instances are configured identically . however , if , for example both instances from the same type are running on different machines and one of the machines is really slow or hosts other resource consuming programs it is may be beneficial to change the default configuration and let the engine use only part of the system resources . additionally , each container node ( j2ee , etc .) has one vm . each template of a type is inheritable by the subsequent instances and / or customized configuration template assigned to it . a configuration template does not usually contain any system dependent information ( like number of cpus ) and is therefore system independent . the system dependant information is used in parameterized settings allowing the system to be configured independent from the system resources / jvm / os . when the engine is started all the parameters are substituted at runtime with the specific values for each machine environment ( to be described in detail below ). a configuration template may contain one or more of the following configuration information : ( 1 ) an instance layout contains the configuration about the number of server nodes running on this instance . the instance layout may be configured via a simple arithmetic property which specifies the number of server nodes . thus , the instance layout dynamically adapts itself to the environment on which the instance is running . in a high - end environment an instance will consist of a higher amount of server nodes whereas in a low - end environment ( e . g . developer pc ) only one server node is usually running on the instance . ; ( 2 ) a virtual machine ( vm ) configuration contains the vm memory settings and the vm parameters . these settings are again specified in a system independent way via parameterized and computed configuration entries . for . example , the maximum heap size may be configured as an arithmetic expression dependent on the amount of physical memory and the number of server nodes running on this instance . ; ( 3 ) a kernel configuration contains the system independent properties of the manager components of the engine . system dependent settings are abstracted via parameterized and computed settings ( parameterized and computed settings will be described in detail below ). ; ( 4 ) service settings contain the system independent service properties of each service component which is part of the installation . system dependent settings are abstracted via parameterized and computed settings . ; ( 5 ) an application configuration contains the system independent application configuration of each application which is part of the installation . ; ( 6 ) a cluster file system configuration contains the system independent configuration of the components which are deployed into the file system . the bootstrap process is responsible for synchronizing this configuration ( together with the components itself ) to the file system . during the synchronization , a configuration manager transparently substitutes dynamic settings . ; ( 7 ) a runtime filter configuration contains the configuration for enabling and disabling components according to the use case / scenario the template belongs to . as discussed above , the abstract configuration model utilizes configuration templates to pre - define and simplify the configuration of a system . in one embodiment , a configuration template is represented by a single xml file , which is parsed during deployment and its content gets fitted into a dedicated configuration level ( level 223 ). the template may bring in the following information and override the originally deployed values : modified kernel / services properties , modified application properties , modified vm parameters , modified startup filters , number of nodes , instance type , and / or system information centralization settings . in general , the installation that deploys a template contains many more components than those which are actually used in a specific use case and scenario . the components which are not needed are disabled and those which are needed are enabled via the runtime filter configuration . in a j2ee developer template 207 , for example , the runtime filter configuration may disable everything except those components which are needed in a j2ee developer scenario . the minimal template 205 is used during instance installation and contains elements needed in order to run a central configuration manager which selects and sets the specific use case template for the instance to be configured . this configuration manager may be a j2ee engine service . customized scenario templates 211 are in the customized level 225 . the template 211 adds or changes settings from what is defined in a configuration template or templates of the system level 223 . in an embodiment , the relation between the default scenario based templates and the customized templates is 1 : 1 . in other words , there is a single customized configuration template 211 corresponding to minimal 205 and a single customized configuration template 211 corresponding to j2ee development 207 . changes are visible in all the instances that inherit from this customized template 211 . exemplary uses include the need for customizing additional engine components . changes on the instance level 227 are made the instance configurations : 213 , 215 , 217 . there may be one or more customized configuration templates associated with each configuration template of level 223 . a customized configuration template for a specific scenario template is created when an instance of this scenario template is to be created . initially , the customized template is a link to its parent scenario template , i . e . inherits all the settings of the scenario template . for example , the customized configuration template 211 may inherit from the minimal 205 , j2ee development 207 , and / or portal 209 . it is possible this template to be to not need custom changes for the lifetime of the engine . however , if at some point the user needs to make a change in the settings ( for example , to add a debug vm parameter or to change some service property ) and this change should be effective for all the instances that belong to this scenario template , this change may be done in the customized template . in one embodiment , these changes are done only manually through configuration tools . the result of the change is a locally written setting ( name , value pair ) for this customized template ( all other settings will be still inherited from the hierarchy ). finally , the configuration of specific instance 213 , 215 , 217 is finalized at the instance level 227 . this is the lowest level in the hierarchy ( the least abstract ). the settings at the level concern only single instance . the instance settings are gathered from all the levels above having in mind the rule that if there are settings with local values on a certain level they ( the local values ) are used instead of the inherited ones . on this configuration level are the real / final settings that are used to configure the instance resources and behavior . the changes may be made with configuration tools and are local for the instance ( changes to not propagate up to a higher level of abstraction ). for example number of nodes could be configured to 1 although the machine has 3 cpus and the default value is 2 * cpu_count . specific system parameters ( such as the number of cpus or amount of memory available ) are propagated through the configuration model beginning at the basic instance customized , with each subsequent level further defining the details of the instance to be created . in an embodiment , system parameters included in a component separate from the instance . levels 221 , 225 , and 227 make up the custom system configuration . these are the levels where changes can generally be done on the fly by an end user . on the other hand , levels 219 and 223 contain configuration settings common for the engine and common for specific scenarios and are propagated as is and are not normally alterable with custom values . the system configuration contains the configuration of the instances of a deployed system . an instance is assigned to a use case and scenario which is to be executed by the instance during runtime . for example , the system may be a developer system or a server , which are different use cases . configuration changes on the level of the custom layer 225 are visible across all instances , which are assigned to the same configuration template . if a setting for a particular instance or instances needs to be changed , the configuration change is done on the instance level 227 . in rare cases , there may be the need to change a setting not only on the level of one usage ( for one template ), but for the whole system and thus for all usages which are activated in the system . in this case , the configuration change is to be done on the level of the basic instance customized 203 level 221 because that will be propagated throughout the entire system as all instances inherit there configuration from the basic instance customized 203 configuration and thus a configuration change on this level is visible globally ( as long as the setting is not locally overwritten ). the above described templates and configurations may be stored in a local ( to the physical system ) and / or remote configuration database . in an embodiment , they are stored in a tree structure . of course it should be understood that other levels of abstraction may be added or some of the levels illustrated in fig2 may be removed without departing from the principles discussed above . additionally , the specific configurations or templates at a particular level are illustrative and not exhaustive . the abstract model of fig2 provides for inheritance between levels of abstraction . the information at the highest level of abstraction 219 is passed to the levels below it ( 221 , 223 , 225 , 227 ). the system level 221 therefore inherits the configuration settings of level 219 . likewise , level 223 inherits the configurations of levels 219 and 221 ; level 225 inherits the configurations of levels 219 , 221 , and 223 ; and level 225 inherits the configurations of levels 219 , 221 , 223 , and 225 . the semantics of this configuration inheritance scheme applied to the case of lower level of abstraction , configuration b ( for example , customized configuration template 211 ) derived from a higher level of abstraction , configuration a ( for example , portal 209 ), are described below . configuration content , which does not locally exist in configuration b , but which is available in a will be inherited and thus is visible to configuration b . in an embodiment , the lower level of abstraction controls if there is a conflict between levels . for example , the local content of configuration b has priority over inherited content from configuration a . accordingly , when content settings are overwritten in configuration b , the overwritten local content ( and not the inherited content from configuration a ) will be visible in configuration b . in an embodiment , the properties of the higher level of abstract are saved before being overwritten by the lower level content . this allows for an easier transition back to an initial state . the contents of a configuration ( including configuration entries , files , sub - configurations ) are subject to inheritance . the inheritance relationship is assigned to the whole configuration sub - tree ( not to one configuration node only ). this means , a local sub - configuration of configuration b ( e . g . b / sub ) has implicitly an inheritance relationship to the according sub - configuration of configuration a ( e . g . a / sub ). in an embodiment , this is true in the case where the corresponding sub - configuration in a does not exist . of course , depending upon the overall model configuration , certain of these contents may be excluded from inheritance . fig3 illustrates an embodiment of the top level of a default template . at this top level 301 , the template the instance layout is defined . this includes an name for the instance 303 being installed . additionally , the top level may include the number of nodes 305 of the instance ( as described above , this could be done using parameterized values , computed values , or value links ) and the type of instance 307 ( for example , j2ee , jms , etc .). of coures , the principles of the default template may be applied to other templates . fig4 illustrates an a more detailed embodiment of the types of content that a default template may describe . generically , a template may define parameters for one or more of the following : filters 401 , virtual machines ( vms ) 403 , and / or component configuraitons 405 . for greater flexibilty , vm settings are divided by vm - vendor and platform ( operating system ( os )). this division allows for parameters to be specified for any os / vm ( all oss and all vms ) combination ; for any os , but for a particular vm ; or for a particular vm / os combination . fig5 illustrates an exemplary vm 403 setup for a default template . as discussed above , multiple vendors 501 , 503 and general parameters 505 , 507 may be defined under the vm portion of a template . because there are numerous choices for vendors ( sap , microsoft , ibm , sun , etc .) it is important to allow for the broadest number of cases to be available to the template for dynamic system configuration . for example , it is desirable to have a template cover microsoft and sap products in a large enterprise environment where both are used extensively . of course , even a single vendor may have several different platforms ( oss ) that could be deployed . microsoft alone has several different operating systems in use today and will have even more in the future . accordingly , a vendor may have multiple platforms 509 , 511 described in the vm portion of the template . several different parameter value levels may be included under the vm portion of a template . at the broadest level , “ global ” virtual machine parameters such as 505 , 507 are visible ( inheritable ) and used from any vm / os combination , unless overridden at a more detailed level . the visibility of a property specified at that level is “ all vms ” and “ all oss ”. for example , the global vm parameters 505 , 507 , 521 are applicable to any vendor 501 , 503 and their particular platforms such as platforms 509 , 511 of vendor_ 1 501 . under the vm vendor level , a particular property is visible ( inheritable ) and used only on a particular vm vendor , but still on all platforms it runs on , unless overridden at a local level there . the visibility of a property specified at this level is “ particular vm ” and “ all oss ”. for example , the parameters 517 , 519 , 525 apply to any of vendor_l &# 39 ; s 501 ( particular vm vendor ) platforms 509 , 511 ( all oss under vendor_ 1 501 ) unless overridden by more specific parameters . parameters 515 , 521 , and 507 are examples of parameters that would override the vendor global parameters 517 , 525 , 519 with respect to platform_ 1 509 . under the platform level a particular property is visible ( inheritable ) and used only on a particular vm and on a particular platform . it overrides any values of this property , specified at a more generic level . the visibility of a property specified at that level is “ particular vm ”, “ particular os ”. for example , the parameters 513 , 515 , 523 are specific to platform_ 1 509 ( particular os ) which is specific to vendor_ 1 501 ( particular vm ). a parameter represents a single java parameter of any type . each parameter may have attributes such as name , type , value , disabled , and description . the type is selected from one of the java parameter groups above . disabled specifies whether the current setting should be visible ( or used by ) more concrete ( less abstract ) configuration levels or not . value specifies a local value used when overriding inherited values . the description describes what the template sets and / or why . in one embodiment , vm java parameters are divided into separate groups as shown in fig5 instead of being grouped together as in the prior art . since configurations may be inherited , if the java parameters were stored in one single property , all child configurations would hide the parameters of their parents , as the child completely overwrites its parent &# 39 ; s property . accordingly , in the single configuration scenario , if the parent &# 39 ; s property changed , there would be no way of propagating that change to the child . additionally , there would be no way to define relations between parameters using parameterized values or to define different parameters for each platform and vm vendor combination . the memory group parameters ( for example , 513 , 517 , 505 ) include name - value pairs ( name and number ) such as heap size ( initial and maximum ) and permanent memory size ( new and maximum ). these pairings may be parameterized , calculated , or contain value links as described above . the system properties group parameters ( for example , 523 , 525 , 521 ) includes name - value pairs ( name and path ) such as the security policy and cobra information . the additional properties group parameters ( for example , 515 , 519 , 507 ) include garbage collection ( gc ) parameters . garbage collection is the java mechanism for removing unused objects from memory . properties are generally inheritable as described above . additionally , properties from the system and additional groups may be disabled . this disablement is propagated down the inheritance chain . in one embodiment , the original value ( s ) are preserved so that the property can be re - enabled . as will be discussed later , runtime filters are used to start or stop components and therefore help define a system . the filters are represented as start / stop rules . in one embodiment , each of the rules has the same structure and attributes . the order in which the filters are evaluated is important , since it may change the complete startup semantics . each filter can be either in the stop list or in the start list . a first component matching a stop filter will be stopped unless another component that refers the first component is set to be started by a subsequent filter rule . likewise , a first component matching a start filter will be started unless another component that refers the first component is set to be stopped by a subsequent filter rule . a filter at a lower level of abstraction will overrule the filter at a higher level of abstraction . fig7 illustrates an exemplary filter portion 401 for a default template . each filter tag 701 , 703 represents one particular rule for filtering components . each configuration level may have several or no filters present . it can match one or several components , or not match components at all , depending on the specified filter fields and the deployed components . the filter tag may have several attributes such as action ( start or stop ), component type ( library , service , interface , or application ), component name , and component provider name . a template allows properties of of a deployed engine component to be set . different types of engine components may be set such as applications , managers , services , etc . fig8 illustrates an exemplary component configuration portion 405 of a default template . each type of component ( manager 801 , 811 ; service 803 , 813 ; or application 805 , 815 , interface , etc .) may be further described by one or more properties . every component property is described as a property tag containing value and name attributes . the name attribute specifies the name of the property to be changed . the value attribute represents the actual property value you want to specify . additional attributes may also be described . for example , a secure attribute indicates whether the property must be encrypted or not ; a parameterized attribute indicates whether the property can contain parameterized value and must be passed through a substitution routine ; a computed attribute indicates whether the value must be passed through an expression calculator when evaluating or left as it is ; a contains link attribute indicates whether a link should be evaluated out of the parameter value ; a final attribute forces that a particular property to be unchangeable by a lower level of abstraction ; and / or a description attribute contains the description of the particularly added property . addtionally , one may choose to explain inside why this particular value was entered configuration component . fig9 illustrates an exemplary default template file . this particular template 901 is called “ test ” and is of the instance type j2ee . the definitions of the filters of the template begin at 903 . the first filter is a “ stop ” filter that is applicable to components of any name , provider , or type . it will stop all components from starting . the second filter is “ start ” filter that overrules a portion of the first filter . this starts the “ jms_provider ” service component made by sap . com . filters will be described in greater detail later . the definitions of the vm parameters of the template are defined beginning at 905 . for this particular configuration of an instance , the vendor is sun and one platform is “ ntintel .” for this platform the maximum heap size is 512 mb . for other sun platforms , the maximum heap size is 1024 mb . for other vendors , the maximum heap size is 2048 mb . the configuration section is begins at 907 . the manager is named “ servicemanager ” and two properties are set for it . the service is named “ jms_provider ” and is supplied by sap . com . finally , a system information property is defined for a timeout value . previous systems were statically configured . as discussed previously , this approach required tedious maintenance of nodes and detailed knowledge of the computing system that was to be deployed . dynamic configuration uses parameterized settings , computed settings , and value links to configure a system . parameterized settings are used instead of static values for system dependent configuration . these settings are resolvable by simple parameter substitution instead of being duplicated in each instance during runtime or prior to runtime . parameterized settings are system parameters such as cpu count , os type ( name , 32 / 64 bit , etc . ), memory , etc . these parameters may be transparently ( from the user &# 39 ; s viewpoint ) substituted during runtime . in an embodiment , parameterized settings are stored in a system profile . computed settings are simple arithmetic expressions usually containing system parameters from the system profile . during runtime , the parameters are transparently substituted and the arithmetic expression is evaluated . computed settings may be used when a simple parameter substitution is not sufficient , but instead the value needs to be calculated out of specific system parameters ( such as cache sizes , heap size , etc .) for example , the number of nodes in an instance may be cpu dependent . a computed setting such as “ number of nodes = 2 * cpu number ” allows for a dynamic number of nodes based on the cpu count , instead of “ hard coding ” this number in the system , which may change at a later point in time . value links contain a link to other settings . these may be used when a setting depends on another setting which is stored somewhere else . during runtime a value link is transparently resolved and substituted . in one embodiment , settings containing value links may be combined with the feature of computed values . because of this dynamic configuration approach ( since configuration templates may contain the system dependencies in a dynamic way ( via parameterized and computed settings )), there is no need to overwrite these settings in the actual instance configuration . the system dependent configuration dynamically adapts itself to the actual system environment . therefore , the engine runtime itself does not need any additional configuration . it is already functional without overwriting any settings inherited from the configuration template . system installation provides delivered system database content including j2ee configuration templates ( these are the scenario based templates that are meant to be deployed ). furthermore , the installation provides the file system environment for each physical machine . instance installation provides the file system environment of the instance and prepares the instance within the configuration database . when installing an application instance , the instance installation itself does not know the particular usage of the instance because of inheritance . as described earlier , in an embodiment , the central configuration manager is a tool which runs within a j2ee engine . the central configuration manages the configuration of system landscapes via corresponding configuration templates . the scope of a configuration template managed by the central configuration is not only one instance or a group of instances of one system , but a landscape of several systems . in one embodiment , the j2ee engine configuration templates are available as archive files ( such as sdas ). these files are deployed into the j2ee engine before installing and configuring j2ee instances . the central configuration uses the j2ee configuration templates during instance configuration by assigning the instance configuration to the appropriate j2ee configuration template and generates a custom template for this j2ee configuration template and assigns the instances to it . during installation of an application instance , the usage of the instance is not known . therefore , during installation , an application instance is configured via the “ minimal instance ” 205 configuration template . the minimal instance configuration is sufficient to run the central configuration . the central configuration is used to configure the instance for the specific usage . during this configuration , the instance configuration ( within the configuration database ) is assigned to the j2ee configuration template according to the particular usage of the instance . the central configuration uses the api ( the configuration abstraction layer api ) provided by the engine runtime in order to assign the instance configuration to the particular configuration template . if this is the first instance within the system assigned to the selected usage template , a custom configuration is created for the selected configuration template . the custom configuration is derived from the selected configuration template and the instance configuration is derived from the custom configuration . as the configuration templates provided within the j2ee engine are system independent ( by configuring the system dependent settings via parameterized and arithmetic expressions ) most of the settings are already correct and do not need to be touched during instance configuration again . this holds especially for instance layout , vm configuration , kernel configuration and several system dependent application and service settings . nevertheless , there might be the need for customizing additional engine components . an instance is essentially configured by traversing through the different levels of abstraction ( for example , highest to lowest ) until the specific instance is configured . each level inherits the values of its parent and may overwrite these values and therefore allows for the further customization of the properties / values . fig6 illustrates an exemplary embodiment of a method to configure an instance . at 601 , the properties of the basic instance are acquired . this defines the basic structure of an instance configuration for the entire system or multiple systems . at 603 , the properties of the basic instance inherited and the properties / values of the basic instance customized are applied to the inherited basic instance . as discussed earlier , this provides for further customization as the basic instance customized provides a lower level of detail than the basic instance . of course , the properties / values from the basic instance customized take priority ( overwrite ) over the properties of the basic instance . the properties / values from the properties of the basic instance customized are inherited and the properties / values of the default template for the specific use case and scenario deployed are applied to the inherited basic instance customized at 605 . again , these values further narrow the values that have already been defined / refined by the basic instance and the basic instance customized . the properties of the default template inherited are inherited and the properties / values of the customized configuration template are applied to the inherited customized configuration template at 607 . again , these values further narrow the values that have already been defined / refined by the basic instance , the basic instance customized , and the default template . finally , the properties / values of the customized configuration template are inherited and the properties / values of the configuration of the instance itself are applied to the inherited properties / values at 609 . again , these values further narrow the values that have already been defined / refined by the basic instance , the basic instance customized , the default template , and the customized configuration template . as discussed above , certain of these properties / values for the various levels of abstraction are adjustable during runtime and others are preferably not . end - users and developers have different needs with respect to what components should be available to use and / or modify . generally , it is best to hide certain components from the all but expert end - users to prevent modifications that would decrease the performance of the system . through the use of filters , individual or sets of components may be started or stopped . generally these filters are applied during startup , however , in an embodiment filters may be evaluated at anytime . the filters may be stored locally using local memory and / or persisted in a database . in one embodiment , filters may also be disabled . as described earlier , a filter is a template which describes a set of rules for starting or stopping . filters are definable at each of the abstract levels 221 , 223 , 225 , and 227 . the combination of these levels creates a set of rules for starting or stopping components in the system . in one embodiment , the filters from all the levels are collected in a list and are resolved from the top to the bottom . unlike all the other settings in which the local value overwrites the inherited one , for filtering this is not quite true because all the values are combined and evaluated together . of course , if there are contradicting filters in the different levels the most bottom ( less abstract ) one will be executed . in an embodiment , the filters are simply evaluated from the lowest level of abstraction to the highest level but if there is a conflict between levels of abstraction , the lowest level still controls . additionally , more than one filter may be present for each level of abstraction . these filters may be predefined ( before system deployment ) and changed after deployment . filters are not necessarily tied to any single syntax , however , filters generally include at least the following attributes : action to be performed ( start or stop a component ); component type ( for example , service , library , interface , application ); vendor name ; and component name . the type attribute specifies the type of the component which this particular filter works on . the component name attribute specifies the name of the component which this particular filter works on . and the vendor name attribute specifies the name of the component provider . for start or stop , all components that match the rule are marked for starting or stopping respectively , including dependents . in at least one syntax , at least the wildcard characters * and ? may be used for to define at least one of the information in the syntax . the wildcard character * is open - ended . for example , “ sap ” means that the filter applies to anything that begins with “ sap ” and “” means that the filter applies to everything . the wildcard character ? may be used as a place holder . for example , “ s ? p ” means that any string that begins with a “ s ” and ends with a “ p ” and is three characters long is covered by the filter . in one embodiment , the filter syntax is the following : “ action : component_type : vendor : name ”. fig1 illustrates the use of exemplary filters in a model system . at the default level 221 , filter 1001 is defined as “ start :::”. this filter turns on all components of every vendor in the system . at the next level of abstraction 223 , the filter 1003 is defined as “ stop : application ::”. as this creates a conflict with filter 1001 , this filter overrides the filter 1001 and causes any application to be stopped . every other component type will still be started . the filter 1005 , at level 225 , is defined as “ stop : services :: dsr ”. this filter stops any service , by any vendor , with the name “ dsr .” the services that depend on the dsr service will also be stopped . all other services will be started . finally , at level 227 , filter 1007 is defined as “ start : application : microsoft : program 1 ” and “ start : service : s ? p : dsr ”( this is not on the figure ). this filter overrides all other proceeding filters with respect to applications made by microsoft and named “ program 1 ”. it also overrides services made by any company that begins with the character “ s ” and ends in character “ p ” ( and is three characters long ) and is named “ dsr ”. at this point , all applications not made by microsoft named “ program 1 ” are stopped ; all services named “ dsr ” not made by vendors complying with “ s ? p ” are stopped ; and every other component is started . the complete filter may be built during runtime . this allows for changes to the filter to be updated “ on - the - fly ” to the system . this is advantageous if a bug is discovered in a component and the component needs to be turned off for a period of time without disrupting the rest of the system . in an embodiment , the filter is constructed by building and evaluating a graph . the graph is constructed by placing all components at a root level and mapping dependencies . it is evaluated by walking ( traversing ) the hard references between components ( a hard reference indicating dependence ) and applying each rule to all components according to their dependencies . fig1 illustrates an exemplary graph at a root level . this graph includes four components : comp_a 1101 , comp_b 1103 , comp_c 1105 , and comp_d 1107 . comp_a 1101 has hard references to all of the other components ( it is dependent upon all of the components ) and comp_c 1105 has a hard reference to comp_d 1107 ( comp_c 1105 is dependent upon comp_d 1007 ). in this figure , if comp_c 1105 is started by a filter , comp_d 1107 ( and only comp_d 1107 ) must be started before ( or at the same time as ) comp_c 1105 . because comp_a 1101 depends on comp_b 1103 and all others , each component must start first ( or at the same time ) to start comp_a 1101 . stopping of individual components is done in a similar manner according to dependencies . in prior systems , properties of software and hardware components in a system were specifically crafted to a particular system and setup . for example , a system configured with a java vm for microsoft xp professional os running on a system with two cpus and 1024 mb of memory would have properties crafted for that exact configuration ( and no other ). this information would be stored at a specific path in the system and would only be relevant for that particular configuration . in other words , it was tied completely with that system . with an abstract configuration model , this may not be efficient if the system configuration could change or be ported to a different system . fig1 illustrates an embodiment of configuration using abstract system information . with this abstract system information configuration , an individual component 1201 does not necessarily need to know that path ( location ) of other components 1205 in the system . instead , the components 1201 , 1205 of the system use a system information module 1203 as an informational proxy . this system information configuration allows for the location of a particular property to be abstracted instead of hard coded to the system in each node . for example “ number of nodes ” is not be taken directly found in each instance , but instead is referenced from instances within the system to the system information object . for example , component_ 1 1201 does not need to know where in the structure that component_ 1205 is located . it only needs to know that a value that it needs may be obtained from system information 1203 . because dynamic configuration is able to use parameterized settings instead of static values for system dependent configuration , settings containing a link to other settings ( for example , a value link ) may be used for cases where a setting is dependent upon another setting which is stored somewhere else . during runtime the value link is transparently resolved and substituted . with the parameterized value , computed settings may be evaluated . with the system informaiton object forward compatibility is easier to achieve because all that need to be updated is the system information configuration . for example , if the location or value of a property is changed only the system information object 1203 needs to be changed and not each instance . this will not affect all the components that refer the property , because they use the value provided by system information instead of directly referencing the component which the property belongs to . the system information module 1203 may be a property sheet object ( or equivalent ). a property sheet is a configuration that stores property like name - value pairs such as system parameters , global constants , etc . a property sheet may also include paths to specific components . in one embodiment , a system information property sheet with initial properties exposed in the system ( like maximum heap size , number of nodes , and number of threads ) is created before all the components of the system become functional . additional properties can be exposed by template deployment at runtime as described above . the cluster file system ( cfs ) is used for deploying a single file system ( fs ) archive in multiple file systems in a cluster . the cfs serves as a repository for the files deployed on the cluster . a bootstrap synchronizes the cfs components in the fs of the cluster elements . previous j2ee engine versions stored the information in the fs archives only on the file systems of the cluster nodes . many times the data on the fs was deleted and it could be restored only by redeployment . additionally , the proper archive had to be found and deployed . all of this led to extended down - time for the system . fig1 illustrates an exemplary file synchronization using bootstrap configuration . each system of the cluster 1337 ( system_ 1 1301 and system_ 2 1335 ) contains a physical machine 1303 , 1329 each having multiple instances 1305 , 1307 , 1317 , and 1319 ; bootstraps per instance 1309 , 1311 , 1321 , 1323 ; and local file systems per instance 1313 , 1315 , 1325 , and 1327 . of course it should be understood that a system could have only one physical machine with varying instance or bootstrap numbers , etc . in an embodiment , there is a single bootstrap per physical machine . in another embodiment , there is a bootstrap per instance and / or file system . each local file system 1313 , 1315 , 1325 , and 1327 includes a local cache / index that includes checksums and / or version numbers of the archives deployed locally . a database 1333 includes a global cache / index that includes checksums , version numbers , and paths of the archives deployed in the system 1301 . of course it should be understood that more than one database could store all or part of this information . a cfs container 1331 includes a global counter that is incremented each time an archive is deployed in the system 1301 and archives to be deployed or already deployed . fig1 illustrates an embodiment of a method for using a bootstrap to synchronize a local file system with a cfs and database . at 1401 , at least one archive is deployed in a local system . in one embodiment , the file system associated with that archive does not note the checksum and / or version number of this archive . in an alternative embodiment , the file system associated with that archive notes the checksum and / or version number of this archive . for example , if an archive is deployed in system_ 1 1301 , on physical machine 1303 , in instance 1309 , the file system &# 39 ; s 1313 local cache reflects this deployment . at 1403 , a database index is configured ( or updated ) to include the checksums , version numbers , and / or path of the archive deployed in the system . the contents of the deployed cfs archive are also stored in the database . upon a change made in the system ( database or cfs ), the bootstrap associated with the change compares the cache indexes its file system and the database for cfs differences at 1405 . depending on the results of the comparison , changes to the file system are made at 1407 to synchronize the file system with the cfs and database . if the bootstrap cannot read or process the data stored in the database , the cfs component may not properly download into the file system . if there is new component in the database and there is no information for this component on the file system , then the component will be downloaded to the local file system and the local cache / index updated . if the cfs component was deleted from the database , then it will also be deleted from the file system . if there is a component in the database that has newer version or different content compared to the component with the same name on the file system , the bootstrap will update the content of the file system with this updated cfs . if the component on the database is in different directory than the one on the file system , the bootstrap will move the content of the cfs archive in the directory specified in the database . processes taught by the discussion above may be performed with program code such as machine - executable instructions that cause a machine that executes these instructions to perform certain functions . in this context , a “ machine ” may be a machine that converts intermediate form ( or “ abstract ”) instructions into processor specific instructions ( e . g ., an abstract execution environment such as a “ virtual machine ” ( e . g ., a java virtual machine ), an interpreter , a common language runtime , a high - level language virtual machine , etc . )), and / or , electronic circuitry disposed on a semiconductor chip ( e . g ., “ logic circuitry ” implemented with transistors ) designed to execute instructions such as a general - purpose processor and / or a special - purpose processor . processes taught by the discussion above may also be performed by ( in the alternative to a machine or in combination with a machine ) electronic circuitry designed to perform the processes ( or a portion thereof ) without the execution of program code . it is believed that processes taught by the discussion above may also be described in source level program code in various object - orientated or non - object - orientated computer programming languages ( e . g ., java , c #, vb , python , c , c ++, j #, apl , cobol , fortran , pascal , perl , etc .) supported by various software development frameworks ( e . g ., microsoft corporation &# 39 ; s net , mono , java , oracle corporation &# 39 ; s fusion etc .). the source level program code may be converted into an intermediate form of program code ( such as java byte code , microsoft intermediate language , etc .) that is understandable to an abstract execution environment ( e . g ., a java virtual machine , a common language runtime , a high - level language virtual machine , an interpreter , etc .). according to various approaches the abstract execution environment may convert the intermediate form program code into processor specific code by , 1 ) compiling the intermediate form program code ( e . g ., at run - time ( e . g ., a jit compiler )), 2 ) interpreting the intermediate form program code , or 3 ) a combination of compiling the intermediate form program code at run - time and interpreting the intermediate form program code . abstract execution environments may run on various operating systems ( such as unix , linux , microsoft operating systems including the windows family , apple computers operating systems including macos x , sun / solaris , os / 2 , novell , etc .). an article of manufacture may be used to store program code . an article of manufacture that stores program code may be embodied as , but is not limited to , one or more memories ( e . g ., one or more flash memories , random access memories ( static , dynamic or other )), optical disks , cd - roms , dvd roms , eproms , eeproms , magnetic or optical cards or other type of machine - readable media suitable for storing electronic instructions . program code may also be downloaded from a remote computer ( e . g ., a server ) to a requesting computer ( e . g ., a client ) by way of data signals embodied in a propagation medium ( e . g ., via a communication link ( e . g ., a network connection )). fig1 shows an embodiment of a computing system ( e . g ., a computer ). the exemplary computing system of fig1 includes : 1 ) one or more processors 1501 ; 2 ) a memory control hub ( mch ) 1502 ; 3 ) a system memory 1503 ( of which different types exist such as ddr ram , edo ram , etc ,); 4 ) a cache 1504 ; 5 ) an i / o control hub ( ich ) 1505 ; 6 ) a graphics processor 1506 ; 7 ) a display / screen 1507 ( of which different types exist such as cathode ray tube ( crt ), thin film transistor ( tft ), liquid crystal display ( lcd ), dpl , etc . ; 8 ) one or more i / o devices 1508 . the one or more processors 1501 execute instructions in order to perform whatever software routines the computing system implements . the instructions frequently involve some sort of operation performed upon data . both data and instructions are stored in system memory 1503 and cache 1504 . cache 1504 is typically designed to have shorter latency times than system memory 1503 . for example , cache 1504 might be integrated onto the same silicon chip ( s ) as the processor ( s ) and / or constructed with faster sram cells whilst system memory 1503 might be constructed with slower dram cells . by tending to store more frequently used instructions and data in the cache 1504 as opposed to the system memory 1503 , the overall performance efficiency of the computing system improves . system memory 1503 is deliberately made available to other components within the computing system . for example , the data received from various interfaces to the computing system ( e . g ., keyboard and mouse , printer port , lan port , modem port , etc .) or retrieved from an internal storage element of the computing system ( e . g ., hard disk drive ) are often temporarily queued into system memory 1503 prior to their being operated upon by the one or more processor ( s ) 1501 in the implementation of a software program . similarly , data that a software program determines should be sent from the computing system to an outside entity through one of the computing system interfaces , or stored into an internal storage element , is often temporarily queued in system memory 1503 prior to its being transmitted or stored . the ich 1505 is responsible for ensuring that such data is properly passed between the system memory 1503 and its appropriate corresponding computing system interface ( and internal storage device if the computing system is so designed ). the mch 1502 is responsible for managing the various contending requests for system memory 1503 access amongst the processor ( s ) 1501 , interfaces and internal storage elements that may proximately arise in time with respect to one another . one or more i / o devices 1508 are also implemented in a typical computing system . i / o devices generally are responsible for transferring data to and / or from the computing system ( e . g ., a networking adapter ); or , for large scale non - volatile storage within the computing system ( e . g ., hard disk drive ). ich 1505 has bidirectional point - to - point links between itself and the observed i / o devices 1508 . in the foregoing specification , the invention has been described with reference to specific exemplary embodiments thereof . it will , however , be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention as set forth in the appended claims . the specification and drawings are , accordingly , to be regarded in an illustrative rather than a restrictive sense .	6
now , a first embodiment of a semiconductor integrated circuit device according to the present invention will be described with reference to fig1 to 3 . fig1 is a circuit diagram showing a portion to which the present invention is applied . numeral 45 designates a bonding pad , which is supplied with an input signal voltage from outside the semiconductor integrated circuit device . electrostatic energies of high levels ( charges ) are liable to be applied to the bonding pad 45 by various causes . numeral 40 indicates the input gate of the first stage of an internal circuit . the input gate 40 is composed of an n - channel mos transistor 41 and a p - channel mos transistor 42 . the respective drain regions of the n - and p - channel mos transistors 41 and 42 are connected in common , and the common output thereof is connected to the internal circuit ( not shown ) through a terminal 43 . both the gate electrodes of the mos transistors 41 and 42 are connected to one end of a protective resistor 44 . the source regions of the n - and p - channel mos transistors 41 and 42 are respectively connected to the ground potential v ss ( o v ) and a power source potential v cc (+ 5 v ). the other end of the protective resistor 44 is connected to the input bonding pad 45 . a protective element 46 of a misfet structure is connected to the input bonding pad 45 , namely , the other end side of the protective resistor 44 . the source region and gate electrode of the protective element 46 made up of an n - channel mos transistor are both connected to the ground potential v ss . one of two semiconductor regions , which are the source and drain regions of the n - channel mos transistor 46 , has a large area and is connected to the bonding pad 45 as well as the other end of the protective resistor 44 . that is , the excessive energy having entered the bonding pad 45 is first applied to the one semiconductor region of the n - channel mos transistor 46 . the protective element 46 needs to have its one terminal connected between the protective resistor 44 and the bonding pad 45 . in such construction , the abnormal energy ( charges ) applied to the bonding pad 45 is dispersed and then discharged into a semiconductor substrate through the junction portion of the one semiconductor region of the n - channel mos transistor 46 and the surface portion of the semiconductor substrate underlying the gate electrode . in order to describe this operation of the present invention more in detail , reference will be had to a plan view and a sectional structural view respectively shown in fig2 and fig3 . fig3 is the sectional view taken and seen along line x -- x in fig2 . in fig2 insulator films 57 and 64 are omitted . in both the figures , the protective resistor illustrated in fig1 is formed of a semiconductor region 54 . in fig2 and 3 , numeral 50 designates a semiconductor substrate which is made of a p - type silicon single crystal . the n - channel mos transistor 46 which is the protective element , and the protective resistor 44 are formed in an active region which is surrounded with a thick field insulator film ( sio 2 film ) 51 . the n - channel mos transistor 46 is formed of n + - type semiconductor regions 52 and 53 being the drain and source regions , the gate insulator film 57 and the gate electrode 58 . the protective resistor 44 is formed of the n + - type semiconductor region 54 as stated above . the gate insulator film 57 and the gate electrode 58 are respectively made of a silicon oxide film and a polycrystalline silicon film . the n + - type semiconductor region 52 , which is the source or drain of the n - channel mos transistor 46 , is connected through contact holes 61 to the input bonding pad 45 made of aluminum . the input bonding pad 45 is connected through a contact hole 63 to one end side of the n + - type semiconductor region 54 which is the protective resistor . shown at numeral 64 is an interlayer insulator film which is made of psg ( phosphosilicate glass ) or the like . in addition , the source or drain 53 of the n - channel mos transistor 46 is connected through contact holes 65 to an aluminum wiring 66 which serves to supply the ground potential being a reference potential . the gate electrode 58 of the n - channel mos transistor 46 is further connected to the wiring 66 through a contact hole 67 . the other end side of the n + - type semiconductor region 54 being the protective resistor , and an aluminum wiring 68 are connected through a contact hole 69 . the wiring 68 is connected to the gate electrodes of the mosfets 41 and 42 . in the embodiment which employs the protective element formed of the n - channel mos transistor 46 , the area of one semiconductor region 52 needs to be comparatively large . although the details will be discussed later , this applies also to a type which employs protective elements formed of complementary mos transistors . in the ensuing description , that semiconductor region of the mosfet being the protective element which is connected to the bonding pad shall be called the &# 34 ; drain region &# 34 ; for the sake of convenience . how the area of the drain region and the voltage applied to the input bonding pad affect the electrostatic destruction voltage of the p - n junction between the drain region and the semiconductor substrate was experimentally investigated , and the results are shown in fig7 . in fig7 the axis abscissas represents the area (× 10 3 μm 2 ) of the drain region , while the axis of ordinates represents the voltage ( v ) applied to the input bonding pad . mark o indicates the voltage at which the p - n junction between the drain region 52 of the n - channel mos transistor 46 and the semiconductor substrate 50 was electrostatically destroyed . it is seen that the n - channel mos transistors have the electrostatic destruction voltages of values approximately indicated by a broken line in accordance with the drain areas . it is accordingly understood that , in order to attain an electrostatic destruction voltage of at least 300 v by way of example , the area of the drain region may be approximately 2000 μm 2 or more in the n - channel mos transistor . by affording such area of the drain region , the charges from the bonding pad are dispersed , and simultaneously , the region in which the surface breakdown arises can be rendered long , so that the electrostatic destruction voltage can be enhanced . a second embodiment will be described with reference to fig4 to 6 . the second embodiment is an example of a semiconductor device which employs protective elements formed of complementary mos transistors . that is , the second embodiment is such that a protective element 47 formed of a p - channel mos transistor is added to the first embodiment . accordingly , portions having the same functions as in the first embodiment are assigned the same symbols and shall not be repeatedly explained . two protective elements 46 and 47 having the misfet structure are connected to an input bonding pad 45 , namely , the other end side of a protective resistor 44 . the source region , gate electrode and p - well region of the protective element 46 formed of an n - channel mos transistor are all connected to the ground potential v ss , while the source region and gate electrode of the protective element 47 formed of a p - channel mos transistor , and a semiconductor substrate are all connected to a power source potential v cc . the respective drain regions of the n - and p - channel mos transistors 46 and 47 , which are semiconductor regions having comparatively large areas , are connected in common and then connected to the bonding pad 45 as well as the other end of the protective resistor 44 . in such construction , abnormal energy ( charges ) applied to the bonding pad 45 is dispersed and discharged into the well region and the semiconductor substrate through the junction portions of the drain regions of the n - and p - channel mos transistors 46 and 47 and the surface portions of the semiconductor substrate and the well region underlying the gate electrodes of both the mos transistors . in order to describe this operation of the present invention more in detail , reference will be had to a plan view and a sectional structural view respectively shown in fig5 and fig6 . the sectional structural view of fig6 is taken and seen along line y -- y in fig5 . an insulator film 64 is omitted from fig5 . the protective resistor illustrated in fig4 is formed of a semiconductor region . referring to fig5 and 6 , the n - channel mos transistor 46 and the p - channel mos transistor 47 are arranged on both the sides of the input bonding pad 45 . the drain regions of the p - and n - channel mos transistors 47 and 46 are connected to the bonding pad 45 , and each drain region is divided in two in this embodiment . more specifically , the n - channel mos transistor 46 has first and second n + - type drain regions 83 and 84 . the regions 83 and 84 are respectively connected to an aluminum wiring 81 through contact holes 85 and 86 , and the wiring 81 is connected to the bonding pad 45 similarly made of aluminum . on the other hand , the p - channel mos transistor 47 has first and second p + - type drain regions 87 and 88 . the regions 87 and 88 are respectively connected to an aluminum wiring 82 through contact holes 89 and 90 . the wiring 82 is connected to the bonding pad 45 . each of the gate electrodes 95 and 96 of the respective mos transistors 46 and 47 , which are made of polycrystalline silicon , is formed in the shape of letter u in order to render the drain regions large in area without lowering the density of integration of the semiconductor device . numerals 91 and 92 indicate an wiring for applying the ground potential of a reference potential and an wiring for applying the power source voltage , respectively . the respective wiring 91 and 92 are connected to the n + - type source region 78 of the n - channel mos transistor 46 and the p + - type source region 79 of the p - channel mos transistor 47 through contact holes 93 and 94 . the gate electrodes 95 and 96 , which are formed on the surface parts of the semiconductor substrate between the drain regions and the source regions , are respectively connected to the corresponding wiring 91 and 92 through contact holes 97 and 98 . the n + - type semiconductor region 54 which is the protective resistor 44 is connected with the input bonding pad 45 through the contact holes 86 . in addition , numeral 99 indicates the n - type silicon semiconductor substrate , and numeral 100 the p - type well region . in the layout of fig5 the drain region 83 of the n - channel mos transistor 46 and the drain region 87 of the p - channel mos transistor 47 should preferably be spaced a predetermined distance in order to prevent latch - up . although the semiconductor region 54 has been used as the protective resistor 44 in each of the first and second embodiments , a polycrystalline silicon resistor may be similarly used without any hindrance . in the case of employing the protective elements formed of the complementary mos transistors , the areas of the n + - type drain regions 83 and 84 and the p + - type drain regions 87 and 88 need to be large . how the areas of the drain regions and the voltage applied to the input bonding pad affect the electrostatic destruction voltages of the p - n junctions between the drain regions and the semiconductor substrate and well region , will be described with reference to fig7 . the voltage at which the p - n junction between the n + - type drain region 83 or 84 and the p - type well region 100 was electrostatically destroyed , is substantially equal to a value indicated by mark o in fig7 . such voltages are somewhat different depending upon the difference of the impurity concentrations of the p - - type well region 100 and the p - type semiconductor substrate 50 of the first embodiment . indicated by mark x is the voltage at which the p - n junction between the p + - type drain region 87 or 88 of the p - channel mos transistor 47 and the n - - type semiconductor substrate 99 was electrostatically destroyed . it is seen that the p - channel mos transistors have the electrostatic breakdown voltages of values approximately indicated by a solid line in accordance with the drain areas . it is accordingly understood that , in order to attain an electrostatic breakdown voltage of at least 300 v by way of example , the drain area may be approximately 2000 μm 2 or more in the n - channel mos transistor , while it may be approximately 1500 μm 2 or more in the p - channel mos transistor . the reason why the area may be smaller in the p - channel mosfet , will be that the slope of the impurity concentration distribution is gentler owing to the higher diffusion coefficient of boron . in the second embodiment , the n - and p - channel mos transistors may respectively have the drain regions ( the semiconductor regions connected to the input bonding pad ) whose areas are at least 2000 μm 2 and 1500 μm 2 . by affording such areas , the charges from the bonding pad are dispersed , and simultaneously , the lengths of the regions in which the surface breakdown arises can be increased , so that the electrostatic destruction voltages can be enhanced . in the second embodiment , in order to realize the drain region of the large area without lowering the density of integration , each gate electrode is put into the shape of letter u , and the bisected drain regions are arranged on both the sides ( two sides opposing to each other ) of the corresponding source region in a manner to sandwich the gate electrode therebetween . ( 1 ) one semiconductor region of a protective element formed of a misfet is connected directly to a bonding pad , and the area of this semiconductor region is rendered comparatively large , so that charges can be dispersed and then discharged into a semiconductor substrate or a well region from the junction portion of the protective element formed of the misfet and from the portion thereof in which breakdown arises . therefore , the electrostatic destruction voltage of an input protective circuit is enhanced . ( 2 ) in case of employing a resistor made of a semiconductor region as a protective resistor , even when the junction depth of this semiconductor region is shallow , a semiconductor device of high density of integration is produced because it is protected by the protective element formed of the misfet for the reason stated above . likewise , the thermal fusion of a resistor made of polycrystalline silicon can be checked , which brings forth the effect that low - resistance polycrystalline silicon owing to silicidation can be readily realized . ( 3 ) since the large - area semiconductor region of the protective element formed of the misfet is connected between the protective resistor and the bonding pad , the fusion of the protective resistor or the destruction of the junction can be prevented when an excessive current or an excessive voltage has entered . while , in the above , the invention made by the inventor has been concretely described in conjunction with embodiments , it is needless to say that the present invention is not restricted to the foregoing embodiments , but that it can be variously modified within a scope not departing from the purport thereof . for example , an internal circuit may well be a circuit which includes an n - channel misfet or a bipolar transistor and a misfet . an input protective resistor may well be made of polycrystalline silicon . a bonding pad may be in any shape as long as it is a terminal to which a voltage is applied from outside an ic chip . a fixed voltage to be applied to the gate electrode of a misfet being a protective element may well differ from a fixed voltage to be applied to a region which is either a source or drain region which is not connected to the bonding pad . the present invention can be extensively utilized for a semiconductor device employing a mis element and an integrated circuit employing mis elements , and is effective especially when applied to products of high densities of integration .	7
the paint for the golf ball used for the present invention comprises internally - crosslinked polymer gel fine particles . the polymer gel fine particles can be obtained by polymerizing monomers using art - known methods ; i . e . emulsion polymerization , dispersion polymerization , suspension polymerization , and the like . the polymer gel fine particles of the present invention must be internally - crosslinked , and internal - crosslinking is enabled by employing polyfunctional monomers partly included in a monomer formulation used for polymerization . specific examples of monofunctional monomers which form polymer gel fine particles include acrylic monomers , such as methyl ( meth ) acrylate and ethyl ( meth ) acrylate ; styrenes , such as styrene , α - methyl styrene , and the like . examples of polyfunctional monomers include monomers having at least two polymerizable unsaturated double bonds excepting diene monomer , such as ethyleneglycol di ( meth ) arylate , neopentylglycol di ( meth ) acrylate , trimethylolpropane ti ( meth ) acrylate , propyleneglycol di ( meth ) arylate , 1 , 6 - hexanediol di ( meth ) acrylate , divinyl benzene , trivinyl benzene and the like . the reason why the diene monomer is excluded is that the diene monomer is generally acted in polymerization reaction as monofunctional monomer although it has two double bonds , -- ch ═ ch -- ch ═ ch --. for the internally - crosslinked polymer gel fine particles used for the present invention , acryl - styrene copolymer resin is more preferable . each of the gel fine particles preferably has at least a void therein because of excellent dispersibility . because of the presence of voids , polymer gel fine particles provide comparatively small specific gravity , which is preferably in the range of 0 . 9 to 1 . 2 . the internally - crosslinked polymer gel fine particles preferably have a particle size of 25 μm or less , more preferably 5 μm or less , which provides particularly good coating performance . a lower limit of the particle size of the gel fine particles is 0 . 01 μm . it is very difficult to obtain the particle size of less than 0 . 01 μm . when the gel fine particles are used for clear paint , they preferably have a particle size of not more than 1 μm , more preferably not more than 0 . 3 μm , from the viewpoint of appearance having good gloss retention . an example of polymer gel fine particles includes powder type plastic pigment commercially available from dainippon ink & amp ; chemicals co ., ltd . as grandoll pp - 2000s . the polymer fine particles are preferably contained in an amount of 0 . 1 to 5 % by weight based on a dry weight of the paint , for providing excellent sagging prevention effects . for clear paint , 0 . 5 - 2 % by weight of the polymer gel fine particles based on a dry weight of the paint particularly provides excellent appearance and good sagging prevention effects . for the paint used for the present invention , epoxy - based paint , acryl - based paint and urethane - based paint can be exemplified , but the urethane - based paint is most preferable . the urethane - base paint preferably comprises an active hydrogen - containing polymer , such as polyester - polyol and polyether - polyol as a major component and an isocyanate compound as a curing agent . the isocyanate compound preferably includes 1 , 6 - hexamethylene diisocyanate modified material ( biuret , trimethylolpropane modified one , trimerized one , etc . ), tolylene diisocyanate modified material and the like . if the paint is an enamel paint , a coloring agent , particularly white pigment ( for example , titanium oxide ) is contained . the amount is suitably 45 - 60 % by weight , preferably 50 to 55 % by weight , based on a solid content of the paint . when the amount is smaller than 40 % by weight , opacifying power of coating becomes inferior . when it exceeds 60 % by weight , physical properties of the coating become inferior . in the case of a clear paint , a coloring agent is basically not contained . in the paint , various additives , curing catalysts , and diluents may be contained in addition to the above components . examples of additives include ultraviolet inhibitors , flowing agents , sealing pigments , and fluorescent agent or fluorescent brighteners . an amount of these additives is 0 . 1 - 10 % by weight based on the solid content of the coating . the fluorescent agent or fluorescent brightener formulated in the paint may be those generally known and used in golf balls . representative examples of the fluorescent agents and brighteners are 2 , 5 - bis - 5 &# 39 ;- t - butylbenzoxazolyl ( 2 )! thiophene ( commercially available from japan ciba geigy co ., ltd . as yubitex ob ), 7 -( 2h - naphthol -( 1 , 2 - d )- triazol - 2 - y1 )- 3 - phenylcusline ( commercially available from sandz co . as leucopure egm ), biazoline derivative ( commercially available from morbey chemical corporation as phorwhite k - 2002 ), oxazoles ( commercially available from sumitomo chemical industries co . as whitefluar hcs , pcs , and b ), and a fluorescent brightener ( available from hoechst japan co ., ltd , as hostalux kcb ). the fluorescent agent and brightener may be contained in an amount of 0 . 005 - 1 . 0 % by weight based on a solid content of the coating . the diluents used for the paint include ketones such as acetone , methyl ethyl ketone , and the like ; aromatic hydrocarbons such as toluene , xylene , and the like ; esters such as ethyl acetate , and the like . an amount of the diluent is not specifically limited but is 30 - 80 % by weight . the paint may be coated at a thickness of 5 - 70 μm per one coating . if it is thinner than 5 μm , no significant difference is found in suppression of paint sagging whether the fine particles of the present invention are used or not , while if it is thicker than 70 μm , sagging of the paint increases , nearly eliminating the effects achieved by the fine particles . the golf ball body may be a one - piece ball obtained by vulcanizing and molding a rubber composition comprising cis - 1 , 4 - polybutadiene rubber . it also may be a two - piece ball which is fabricated by vulcanizing a rubber composition comprising cis - 1 , 4 - polybutadiene rubber to form a solid core , which is then covered with an ionomer cover . in addition , the golf ball body may be a thread - wound ball comprising a thread wound core to which a cover layer mainly composed of transpolyisoprene is provided . for coating methods , examples include air gun coating or electrostatic coating , and the like , but they are not limited to them . to explain the golf ball coating process , in general , after coating the enamel paint , the golf ball is transfer - marked using a transfer foil , etc . comprising the resin chosen from a group consisting of polyamide resin , acrylic resin , and urethane resin , as well as nitrocellulose as major resin , and then , is coated with a clear paint for finish . these processes are publicly known with respect to the golf ball manufacturing . it is also possible to use a method in which the enamel paint is not coated but the clear paint only is applied . in this invention , it is preferable to use enamel paint and clear paint , both of which provide features of this invention . according to the present invention , sagging of the paint after coating can be suppressed , offering a coated golf ball having original flying characteristics of dimple shapes maintained . the present invention will be described further in detail with reference to the following examples ; however , these examples are not construed to limit the scope of the invention . using the following paints , two - piece golf balls comprising a solid core and an ionomer resin cover covering the solid core were coated . the coating method , coating weight , and coating process are shown as follows : two - package clear paint ( main component : polyester polyol ; curing agent ( hexamethylene diisocyanate ( hdi )); solid content about 30 %; viscosity : about 15 cps ). urethane - based two - package white enamel paint containing titanium oxide ( white pigment ) ( main component : polyester polyol ; curing agent ( hexamethylene diisocyanate ( hdi )); solid content about 50 %; viscosity : about 200 cps ). to both of the above paints , internally - crosslinked polymer gel fine particles or inorganic silica powders chosen from a to f below were formulated . table 1 shows selection and amount . ( a , b , and c are commercially available as mg - 100 - s , and d and e as pp - 207s , all from dainippon ink and chemicals co ., ltd .) using a bell type electrostatic coating machine , the paint was uniformly applied to golf balls . the paint was applied so that the weight of the paint adhering to golf balls becomes 80 mg / cm 2 ( paint i ) and 180 mg / cm 2 ( paint ii ) in dry weight , respectively . in examples 1 - 6 , comparative example 1 and reference examples 1 and 2 , golf ball bodies were coated with white enamel paint then stamped with a polyamide resin transfer foil , followed by coating with clear paint . in example 7 and comparative example 4 , golf ball bodies were coated with enamel paint and then coated with clear paint . in comparative example 4 , golf ball bodies were coated with clear paint before coating with enamel paint . table 1__________________________________________________________________________ ( experimental results ) flying characteristicsadditives appearance trajectory concentra - dimple paint elevation paintno . type tion ( wt %) luster shape layer total carry angle adhesion paint__________________________________________________________________________examples1 b 1 ∘ ∘ ∘ 249 . 2 13 . 5 ∘ i2 c 1 ∘ ∘ ∘ 249 . 7 13 . 3 ∘ i3 d 1 ∘ ∘ ∘ 250 . 6 13 . 3 ∘ i4 e 0 . 4 ∘ ∘ ∘ 250 . 1 13 . 4 ∘ i5 e 1 ∘ ∘ ∘ 251 . 4 13 . 2 ∘ i6 e 4 ∘ ∘ ∘ 250 . 9 13 . 2 ∘ i7 e 1 ∘ ∘ ∘ 250 . 9 13 . 3 ∘ ii__________________________________________________________________________comparative examples1 f 1 x δ δ 244 . 3 13 . 9 δ i2 -- -- ∘ x x 240 . 5 14 . 3 ∘ i3 -- -- -- -- -- 251 . 0 13 . 1 -- i4 -- -- ∘ δ δ 244 . 1 13 . 8 -- ii__________________________________________________________________________reference examples1 a 1 δ δ δ 243 . 8 13 . 8 δ i2 e 6 x ∘ ∘ 249 . 6 13 . 2 δ i__________________________________________________________________________ 2 . paint layer thickness : dimples at three locations were extracted for each ball at random and the paint layer at sections 1 - 4 were evaluated as follows based on mean ratio ( min . paint layer / max . paint layer ). 3 . flying characteristics : by a swing machine available from true temper company using a driver , golf balls were hit at a club head speed of 45 m / sec and the total carry and launch angle were measured . 4 . paint adhesion : by the swing machine of true temper company using a driver , golf balls were hit at a club head speed of 45 m / sec after being junk in water for a week and the paint peeling condition was checked . δ : peeling which can be determined with a magnifier ( x10 ) is found .	0
[ 0048 ] fig1 illustrates a prior - art poseable miniature figurine with poseable joints , while fig2 - 15 illustrate a toy action figure with manipulating stem and selectably articulateable joints according to the present invention . referring first to fig1 a prior - art miniature figurine 10 with moveable joints is shown to comprise a miniature three - dimensional model which resembles a human being , having a head 11 , torso 12 , right and left upper arms 13 r , 13 l , forearms 14 r , 14 l , hands 15 r , 15 l , pelvis 16 , upper legs 17 r , 17 l , lower legs 18 r , 18 l , and feet 19 r , 19 l . as shown in fig1 poseable miniature figurine 10 includes a plurality of joints of different types that enable relative movement between pairs of body members . each of these joints has relatively moving surfaces between which substantial frictional forces exist . this arrangement enables body parts or members to be moved into a desired disposition or “ posed ,” relative to one another , the frictional forces between joint members retaining the pose chosen for the figurine by a person who has manipulated the figurine members . thus , as shown in fig1 miniature figurine 10 includes shoulder rotator joints 21 r , 21 l between torso 12 and right and left upper arms 13 r , 13 l , respectively . each shoulder rotator joint 21 r , 21 l includes a headed pin 31 having a generally horizontally disposed shank 32 and head 33 rotatable in a socket ( not shown ) within torso 12 . the outer lateral end 34 of each rotator joint 21 r , 21 l terminates in a shoulder boss 34 r , 34 l , each of which holds a pivot pin 35 r , 35 l . the latter pivot pins are disposed transversely to the axes of inner shoulder rotator joint pins 31 r , 31 l . also , the upper end portion of each upper arm 13 r , 13 l has formed in the upper transverse end face thereof a centrally located , rectangularly shaped , axially inwardly disposed slot 13 sr , 13 sl which bifurcates the upper end portion into front and rear tabs 131 r , 131 l . slots 13 sr , 13 sl receive therewithin shoulder bosses 34 r , 34 l which are pivotably held therewithin by pivot pins 35 r , 35 l . the foregoing elements comprise shoulder swivel joints 22 r , 22 l which enable upper arms 13 r , 13 l to be pivoted around an axis perpendicular to that of an inner shoulder rotator joint pin , i . e ., in a vertical plane for right upper arm 13 r , as shown in fig1 and in a plane perpendicular to the paper for left upper arm 13 l positioned as shown in fig1 . the lower portion of right and left upper arms 13 r , 13 l of poseable figurine 10 are rotatable upon their respective longitudinal axes with respect to upper portions of the upper arms 13 r , 12 l by means of joints 23 r , 23 l , each having a longitudinally disposed pivot axis 36 r , 36 l . poseable miniature figurine 10 also includes elbow joints 24 r , 24 l , which permit pivotable motion of forearms 14 r , 14 l within the plane of upper arms 13 l , 13 r , respectively . as shown in fig1 poseable miniature figurine 10 is also provided with a pelvic joint 25 that enables pivotable motion of pelvis 16 relative to torso 12 , along an axis generally corresponding to the spine of the miniature figure . pelvic joint 25 includes a fore and aft disposed upper anchor pin 40 , which is encircled by an endless elastic band 41 . the lower end of endless elastic band 41 is twisted 90 degrees , stretched taut , and held within the upstanding hook portion 42 of a laterally disposed leg support bar 43 . leg support bar 43 has ball ends 44 r , 44 l on opposite lateral ends thereof , and is fitted with a groin arch 45 which depends downwardly from pelvis 16 . ball ends 44 r , 44 l fit within sockets 46 r , 46 l provided in the upper ends of upper legs 17 r , 17 l respectively , the respective ball and socket combinations comprising universal joints 26 r , 26 l which permit movement of the upper legs relative to the pelvis . miniature figurine 11 also includes knee joints 27 r , 27 l which enable pivotable motion in a plane of each lower leg 18 r , 18 l with respect to upper legs 17 r , 17 l , respectively . each lower leg 18 r , 18 l is terminated at the lower end thereof by a foot 19 r , 19 l . fig2 - 15 illustrate an example embodiment of a three - dimensional toy action figure 50 with manipulating stem and selectably articulatable joints according to the present invention . example embodiment 50 includes a three - dimensional figurine 51 depicting a bicyclist , which is movably attached to a miniature toy model 52 of a bicycle . bicycle 52 is of conventional design , including a frame 53 , front and rear wheels 54 and 55 , drive sprocket wheel 56 , and right and left crank arms 57 r , 57 l which have foot pedals 58 r , 58 l pivotably attached to the outer ends thereof . toy bicycle 52 also includes an upstanding seat post 59 terminated at the upper end thereof by a seat or saddle 60 . bicycle 52 also includes a front fork 61 which holds a front axle 62 at its lower end . the upper portion of fork 61 is pivotably held within a head tube 63 , and has a stem 64 which protrudes upwardly of the head tube . stem 64 has attached to the upper end thereof a pair of laterally and transversely disposed right and left handlebars 65 r , 65 l , terminated at the outer ends thereof by right and left handle grips 66 r , 66 l . as shown in fig3 a , bicycle 51 may optionally be provided with a pair of right and left front axle extension tubes 67 r , 67 l , which protrude laterally outwardly of front wheel 54 . referring now to fig3 a - 3 f in addition to fig2 bicyclist figurine 51 according to the present invention may be seen to comprise a miniature figurine which resembles a human being , having a head 71 , torso 72 , right and left upper arms 73 r , 73 l , forearms 74 r , 74 l , hands 75 r , 75 l , pelvis 76 , upper legs or thighs 77 r , 77 l , lower legs 78 r , 78 l , and feet 79 r , 79 l . as shown in fig2 - 3 f , and as is described in detail below , bicyclist figurine 51 has a plurality of joints of different types that enable pairs of body members connected by individual joints to be moved relative to one another . these joints are selectably articulatable , i . e ., some being of a type which is fixed , or movable with difficulty , and others being of a type which enables relatively free movement between other pairs of body members . moreover , toy bicyclist figurine 51 includes structural elements which limit the degree of angular excursion between certain pairs of body members . thus , some of the joints of figurine 51 are constructed so as to have substantial frictional forces exerted between relatively moving surfaces of the joints . this arrangement enables certain pairs of body parts or members connected by this type of joint to be moved into a desired fixed disposition relative to one another , frictional forces between joint components retaining the disposition chosen for the figurines , simulating , for example , a bicyclist on a bicycle . optionally , joints of this type may be immobilized , by adhesives or locking members , for example , or body members connected by such joints may be fabricated as unitary structures affording no enablement of relative movement between those body members . bicyclist figurine 51 also includes certain joints which enable free relative movement between certain other pairs of body members . thus , as may be seen best by referring to fig3 c , bicyclist figurine 51 has a pair of right and left elbow joints 84 r , 84 l , which join right and left upper arms 73 r , 73 l to right and left forearms 74 r , 74 l . elbow joints 84 r , 84 l are so constructed as to maintain forearms 74 r , 74 l bent only slightly with respect to upper arms 73 r , 73 l , as shown in fig2 and 3b . thus , joints 84 r , 84 l may include in combination flanges 85 r , 85 l formed by reduced thickness , upper ends of forearms 74 r , 74 l , the flanges having flat longitudinally disposed bearing surface 86 r , 86 l which bear against similarly shaped bearing surfaces 87 r , 87 l of flanges 88 r , 88 l , formed by reduced thickness lower ends 87 r , 87 l of upper arms 73 r , 73 l . a pair of rivets 89 r , 89 l disposed transversely through flange ends 85 r , 85 l , and 87 r , 87 l function as pivot pins enabling pivotable relative motion between each forearm 74 r , 74 l and upper arm 73 r , 73 l . rivets 89 r , 89 l have rounded heads 90 r , 90 l , flared ends 91 r , 91 l , which are secured sufficiently tightly against the outer surface of the forearms and upper arms to cause bearing surfaces 86 r , 86 l to press sufficiently tightly against bearing surfaces 88 r , 88 l as to enable pivotable , but frictionally retarded movement between each upper arm and forearm . referring still to fig3 c , figurine 51 may be seen to include shoulder rotator joints 100 r , 100 l which connect the upper ends of upper arms 73 r , 73 l to torso 72 . each shoulder rotator joint 100 r , 100 l includes a headed pin 101 r , 101 l having a generally horizontally disposed shank 102 r , 102 l and a head 103 r , 103 l , rotatable in a socket 104 r , 104 l . the outer lateral end 105 r , 105 l of each shoulder rotator joint 100 r , 100 l terminates in a shoulder boss 106 r , 106 l , each of which holds a pivot pin 107 r , 107 l . the latter pivot pines are disposed transversely to the axes of inner shoulder rotator joint pins 101 r , 101 l . also the upper end portion of each upper arm 73 r , 73 l has formed in the upper transverse end face 108 r , 108 l thereof a centrally located , rectangularly shaped , axially inwardly disposed slot 109 r , which bifurcates the upper end portion of the arm into front and rear tabs 110 r , 110 l , 111 r , 111 l . slots 109 r , 109 l receive therewithin shoulder bosses 106 r , 106 l which are pivotably held therewithin by pivot pins 107 r , 107 l . the foregoing elements comprise shoulder swivel joints 82 r , 82 l which enable upper arms 73 r , 73 l to be pivoted around an axis perpendicular to that of the inner should rotator joint pin , i . e ., in a plane perpendicular to the paper for left , upper arm 73 l positioned as shown in fig2 c . although not necessary for the functioning of bicyclist figurine 51 on bicycle 52 , the figurine may be provided with such joints which may be required for similar figurines combined with different vehicles and / or performing different physical activities , thus enabling different figurines to be manufactured using many of the same manufacturing steps . thus , as shown in fig3 c , each upper arm 73 r , 73 l of bicyclist figurine 51 may be segmented into upper and lower portions 112 r , 113 l , respectively , the upper and lower portions being joined by a coaxially disposed axle pin 114 r , 114 l , forming upper arm rotator joints 83 r , 83 l that enable the upper and lower portions of the upper arm to be rotated relative to one another about a common longitudinal axis . referring now primarily to fig3 b , it may be seen that bicyclist action figurine 51 is provided with a pelvic joint 115 that enables pivotable motion of pelvis 76 relative to torso 72 , along an axis generally corresponding to the spine of the figurine . pelvic joint 115 includes a fore and aft disposed upper anchor pin 116 which is encircled by an endless elastic band 117 , preferably made from a durable elastomeric material such as synthetic rubber . the lower end of elastic band 117 is twisted 90 degrees , and held within the upstanding hook portion 119 of a laterally disposed leg support rod 118 . leg support rod 118 has ball ends 120 r , 120 l on opposite lateral ends thereof , and is fitted within a groin arch 121 which depends downwardly from pelvis 76 . ball ends 120 r , 120 l of leg support rod 118 fit loosely within sockets 121 r , 121 l provided in the upper ends of upper legs 77 r , 77 l , respectively , the ball and socket combinations comprising universal joints 122 r , 122 l which enable the upper legs to swivel relative to the pelvis . bicyclist figuring 51 includes knee joints 123 r , 123 l which enable pivotable motion in a plane of each lower leg 78 r , 78 l with respect to an upper leg or thigh 77 r , 77 l , respectively . thus , as shown in fig3 b and 3 d - 3 g , the lower end 124 r , 124 l of each thigh 77 r , 77 l has formed therein an axially upwardly protruding , generally rectangularly - shaped slot 125 r , 125 l . slot 125 r , 125 l forms in each lower thigh - end 124 r , 124 l thin inner and outer web 126 r , 126 l , 127 r , 127 l having a generally semicircular planview shape . each inner and outer web pair 126 r - 127 r , 126 l - 127 l , combined with slots 125 r , 125 l between the web pair members , functions as a clevis 128 r , 128 l . thus , as shown in fig3 b and 3 d - 3 f , slot 125 r , 125 l of each clevis 128 r , 128 l receives therewithin a generally semicircular - shaped boss 129 r , 129 l which protrudes upwardly from the upper end 130 r , 130 l of lower leg 78 r , 78 l . boss 129 r , 129 l is held within slot 125 r , 125 l by a knee joint pivot pin 131 r , 131 l which is fixed at opposite lateral ends thereof in laterally aligned bores 132 r , 132 l , and 133 r , 133 l provided through inner and outer clevis webs 126 r , 126 l and 127 r , 127 l , the knee joint pivot pin passing through a bore 134 r , 134 l which extends transversely through upper leg boss 129 r , 129 l , thus forming knee joints 123 r , 123 l . referring now to fig3 f , it may be seen that knee joints 123 r , 123 l enable lower leg 78 r , 78 l , to be pivoted or bent rearwardly until the upper rear margin 136 r , 136 l of the calf 137 r , 137 l of the leg abuts lower rear margin 138 r , 138 l of thigh 77 r , 77 l . as shown in fig3 d , lower left leg 78 l may be pivoted forwardly until the upper transverse edge wall 129 l of a “ shin bone ” 140 l abuts a lower front margin 141 l of thigh 77 l . on the other hand , right hand knee joint 123 r is so constructed as to limit forward pivotable motion of lower right leg 78 r relative to thigh 77 r . thus , as shown in fig3 b and 3 e - 3 g , lower right leg 78 r of figurine 51 is provided with a bar or rigid strap 142 which is affixed to the front surface or shin 143 of the lower right leg , and may therefore be referred to as a “ shin guard ”. shin guard 142 protrudes above shin bone 140 r , and has a transversely disposed upper , edge wall 144 . thus , as shown in fig3 g , forward motion of lower right leg 78 r relative to thigh 77 r is limited by abutting contact of upper transverse edge wall 144 of shin guard 142 with lower front margin 141 r of the right thigh . as shown in fig3 g , the addition of shin guard 142 limits the allowable forward motion of lower right leg 78 r relative to right thigh 77 r to an amount less than that of left lower leg 78 l relative to left thigh 77 l , i . e ., to an amount which prevents the right lower leg from being fully aligned with or straightened with respect to the right thigh . therefore , when torso 72 and right thigh 77 r are bent forward relative to pelvis 76 and right and left lower legs 78 r , 78 l , as shown in fig1 , right hand knee joint 123 r is prevented from being fully straightened by the action of shin guard 142 . this arrangement results in realistic motion of figurine 51 as action fig5 is maneuvered as shown in fig8 - 12 . referring again to fig2 and 3b , it may be seen that action figure 50 s provided with a manipulating stem 145 . in the embodiment 50 of an action figure shown in fig2 and 3b , manipulating stem 145 includes a stiff spring wire 146 which has a downwardly protruding lower end 147 which is held within a bore 148 that extends perpendicularly downwardly into head 71 of figurine 51 . as shown in the figures , bore 148 is preferably laterally and longitudinally centered with respect to head 71 . manipulating stem 145 also includes a finger grip which may be readily grasped between the thumb and fingers of a person , particularly a child . the finger grip facilitates rotation of the stem about its longitudinal axis , to thereby rotate the action figure along an axis generally parallel to the spine of the action figurine , as well as facilitating pivoting the figure in a vertical plane , and translating the action figure vertically and / or horizontally . an embodiment 149 of a finger grip shown in fig2 and 3b comprises essentially a longitudinally elongated cylinder 150 having a diameter of about { fraction ( 3 / 16 )} in . and a length of about ¾ in . inch . cylinder 150 has a bore 151 which extends perpendicularly upwardly from lower transverse face 152 of the cylinder , the bore receiving the upwardly protruding upper end 153 of spring wire 146 . preferably , the upper end of finger grip cylinder 150 is enlarged to help secure it within the grasp of a person , as for example , by being provided with an upper end flange 154 . as shown in fig2 stem ring wire 146 preferably has formed therein a planar loop 155 . loop 155 is of the appropriate diameter , e . g ., about ⅝ inch , to insertably receive a person &# 39 ; s finger tip . this construction enables figurine 51 and vehicle 52 to be orbited in full or partial circles around the finger tip , as shown in fig4 and 5 . also , with stem wire 146 made of spring wire , loop 155 functions as a spring which enables figurine 51 and vehicle 52 to flex somewhat relative to finger grip 149 as action figure 50 is manipulated . fig4 - 12 illustrate how action figurine 50 according to the present invention , provided with selectably articulateable joints and a manipulating stem , are manipulated by the hand of a person to cause the figurine to realistically simulate motion of a human body in performing certain physical activities , which for the example embodiment shown in the figures and described above are activities associated with operation of a bicycle . referring first to fig4 and 8 , it may be seen that grasping manipulating stem 145 between the thumb and a finger of a person , and pulling upwardly on the manipulating stem , causes bicyclist figurine 51 of action figurine 50 to transition between a seated position on bicycle 52 , as shown in fig4 to a standing position , as shown in fig8 . in making this transition between a seated and standing position , right and left upper arms 73 r , 73 l of bicyclist 51 rotate downwardly on inner shoulder rotator joints 100 r , 100 l , and right and left hands 75 r , 75 l rotate forward or counterclockwise as viewed from the left - hand side of the bicyclist , on handlebar grips 66 r , 66 l . also during this transition , right and lower legs 78 r , 78 l rotate forwardly to a more nearly straight position relative to thighs 77 r , 77 l on knee joints 123 r 123 l . [ 0067 ] fig9 illustrates the effects of rotating manipulating stem 145 ninety degrees clockwise between the thumb and forefinger , causing bicyclist 51 and bicycle 52 of action figure 50 to rotate ninety degrees to the right , as if to change course in that direction . [ 0068 ] fig1 illustrates the effects of tilting manipulating stem 145 of action figure 50 rearwardly in a vertical midplane through action figurine 50 . this action causes torso 72 of bicyclist 51 to tilt forward to a position generally horizontal and more parallel to the frame 53 of bicycle 52 . during this maneuver , right and left upper arms 73 r , 73 l of bicyclist 51 rotate upwardly away from torso 72 on inner shoulder rotator joints 100 r , 100 l , and right and left hands 75 r , 75 l rotate rearwardly or clockwise as viewed from the left - hand side of the bicyclist , on handlebar grips 66 r , 66 l . also during this maneuver , lower legs 78 r , 78 l rotate forwardly to a still more nearly straightened position relative to thighs 77 r , 77 l on knee joints 123 r , 123 l . in this case , however , straightening of right knee joint 123 r is limited by shin guard 142 , thus resulting in figurine 51 assuming a life - like position , in which the right knee joint does not become “ locked up .” [ 0069 ] fig1 illustrates the effects of tilting manipulating stem 145 of action figure 50 forwardly in a vertical midplane through the action figure . this action causes torso 72 of bicyclist 51 to tilt rearward on pelvic joint 115 to a position generally horizontal and more generally perpendicular to frame 53 of bicycle 52 . during this maneuver , right and left upper arms 77 r , 77 l of bicyclist 51 rotate downwardly towards torso 72 on inner shoulder rotator joints 100 r , 100 l , and right and left hands 75 r , 75 l rotate forwardly or upwardly with respect to handlebars 65 r , 65 l on handlebar grips 66 r , 66 l . also during this maneuver , thighs 77 r , 77 l and lower legs 78 r , 78 l rotate rearwardly to a more nearly bent position relative to torso 72 , on pelvic ball joints 122 r , 122 l , and knee joints 123 r , 123 l . [ 0070 ] fig1 is a view of an alternate embodiment 50 a of action figure 50 , in which a manipulating stem 145 a is attached to bicyclist 51 a so that it protrudes generally perpendicularly outwardly from the back of the bicyclist , midway between the shoulder blades . [ 0071 ] fig1 is a fragmentary view of a second alternate embodiment 50 b of action figure 50 , which includes a modified manipulating stem 145 b having a straight spring wire 146 b , terminated at the upper end thereof by a straight cylindrical finger grip 149 b . [ 0072 ] fig1 is a fragmentary view of a third alternate embodiment 50 c of action figure 50 , which includes a modified manipulated stem 145 c having a straight spring wire 146 c and a straight cylindrical finger grip 149 c , terminated at the upper end thereof by a knob 156 . [ 0073 ] fig1 is a fragmentary view of a fourth alternate embodiment 50 d of action figure 50 , which includes a modified manipulating stem 145 d , terminated at the upper end thereof by a straight cylindrical finger grip 149 d . as shown in fig1 , modified manipulating stem 145 d protrudes from the back of bicyclist 51 d , but could alternatively be attached to the head of the bicyclist .	0
deuterium ( d or 2 h ) is a stable , non - radioactive isotope of hydrogen and has an atomic weight of 2 . 0144 . hydrogen naturally occurs as a mixture of the isotopes 1 h ( hydrogen or protium ), d ( 2 h or deuterium ), and t ( 3 h or tritium ). the natural abundance of deuterium is 0 . 015 %. one of ordinary skill in the art recognizes that in all chemical compounds with a h atom , the h atom actually represents a mixture of h and d , with about 0 . 015 % being d . thus , compounds with a level of deuterium that has been enriched to be greater than its natural abundance of 0 . 015 %, should be considered unnatural and , as a result , novel over their non - enriched counterparts . all percentages given for the amount of deuterium present are mole percentages . it can be quite difficult in the laboratory to achieve 100 % deuteration at any one site of a lab scale amount of compound ( e . g ., milligram or greater ). when 100 % deuteration is recited or a deuterium atom is specifically shown in a structure , it is assumed that a small percentage of hydrogen may still be present . deuterium - enriched can be achieved by either exchanging protons with deuterium or by synthesizing the molecule with enriched starting materials . the present invention provides deuterium - enriched tolterodine or a pharmaceutically acceptable salt thereof . there are twenty hydrogen atoms in the tolterodine portion of tolterodine as show by variables r 1 - r 31 in formula i below . the hydrogens present on tolterodine have different capacities for exchange with deuterium . hydrogen atom r 1 is easily exchangeable under physiological conditions and , if replaced by a deuterium atom , it is expected that it will readily exchange for a proton after administration to a patient . the remaining hydrogen atoms are not easily exchangeable and may be incorporated by the use of deuterated starting materials or intermediates during the construction of tolterodine . the present invention is based on increasing the amount of deuterium present in tolterodine above its natural abundance . this increasing is called enrichment or deuterium - enrichment . if not specifically noted , the percentage of enrichment refers to the percentage of deuterium present in the compound , mixture of compounds , or composition . examples of the amount of enrichment include from about 0 . 5 , 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 12 , 16 , 21 , 25 , 29 , 33 , 37 , 42 , 46 , 50 , 54 , 58 , 63 , 67 , 71 , 75 , 79 , 84 , 88 , 92 , 96 , to about 100 mol %. since there are 31 hydrogens in tolterodine , replacement of a single hydrogen atom with deuterium would result in a molecule with about 3 % deuterium enrichment . in order to achieve enrichment less than about 3 %, but above the natural abundance , only partial deuteration of one site is required . thus , less than about 3 % enrichment would still refer to deuterium - enriched tolterodine . with the natural abundance of deuterium being 0 . 015 %, one would expect that for approximately every 6 , 667 molecules of tolterodine ( 1 / 0 . 00015 = 6 , 667 ), there is one naturally occurring molecule with one deuterium present . since tolterodine has positions , one would roughly expect that for approximately every 206 , 677 molecules of tolterodine ( 31 × 6 , 667 ), all 31 different , naturally occurring , mono - deuterated tolterodines would be present . this approximation is a rough estimate as it doesn &# 39 ; t take into account the different exchange rates of the hydrogen atoms on tolterodine . for naturally occurring molecules with more than one deuterium , the numbers become vastly larger . in view of this natural abundance , the present invention , in an embodiment , relates to an amount of an deuterium enriched compound , whereby the enrichment recited will be more than naturally occurring deuterated molecules . in view of the natural abundance of deuterium - enriched tolterodine , the present invention also relates to isolated or purified deuterium - enriched tolterodine . the isolated or purified deuterium - enriched tolterodine is a group of molecules whose deuterium levels are above the naturally occurring levels ( e . g ., 3 %). the isolated or purified deuterium - enriched tolterodine can be obtained by techniques known to those of skill in the art ( e . g ., see the syntheses described below ). the present invention also relates to compositions comprising deuterium - enriched tolterodine . the compositions require the presence of deuterium - enriched tolterodine which is greater than its natural abundance . for example , the compositions of the present invention can comprise ( a ) a μg of a deuterium - enriched tolterodine ; ( b ) a mg of a deuterium - enriched tolterodine ; and , ( c ) a gram of a deuterium - enriched tolterodine . in an embodiment , the present invention provides an amount of a novel deuterium - enriched tolterodine . examples of amounts include , but are not limited to ( a ) at least 0 . 01 , 0 . 02 , 0 . 03 , 0 . 04 , 0 . 05 , 0 . 1 , 0 . 2 , 0 . 3 , 0 . 4 , 0 . 5 , to 1 mole , ( b ) at least 0 . 1 moles , and ( c ) at least 1 mole of the compound . the present amounts also cover lab - scale ( e . g ., gram scale ), kilo - lab scale ( e . g ., kilogram scale ), and industrial or commercial scale ( e . g ., multi - kilogram or above scale ) quantities as these will be more useful in the actual manufacture of a pharmaceutical . industrial / commercial scale refers to the amount of product that would be produced in a batch that was designed for clinical testing , formulation , sale / distribution to the public , etc . in another embodiment , the present invention provides a novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof . wherein r 1 - r 31 are independently selected from h and d ; and the abundance of deuterium in r 1 - r 31 is at least 3 %. the abundance can also be ( a ) at least 6 %, ( b ) at least 13 %, ( c ) at least 19 %, ( d ) at least 26 %, ( e ) at least 32 %, ( f ) at least 39 %, ( g ) at least 45 %, ( h ) at least 52 %, ( i ) at least 58 %, ( j ) at least 65 %, ( k ) at least 71 %, ( l ) at least 77 %, ( m ) at least 84 %, ( n ) at least 90 %, ( o ) at least 97 %, and ( p ) 100 %. in another embodiment , the present invention provides a novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 1 is at least 100 %. in another embodiment , the present invention provides a novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 2 - r 31 is at least 3 %. the abundance can also be ( a ) at least 7 %, ( b ) at least 13 %, ( c ) at least 20 %, ( d ) at least 27 %, ( e ) at least 33 %, ( f ) at least 40 %, ( g ) at least 47 %, ( h ) at least 53 %, ( i ) at least 60 %, ( j ) at least 67 %, ( k ) at least 73 %, ( l ) at least 80 %, ( m ) at least 87 %, ( n ) at least 93 %, and ( o ) 100 %. in another embodiment , the present invention provides a novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 2 - r 4 is at least 33 %. the abundance can also be ( a ) at least 67 %, and ( b ) 100 %. in another embodiment , the present invention provides a novel , deuterium enriched compound of formula i , wherein the abundance of deuterium in r 5 - r 7 is at least 33 %. the abundance can also be ( a ) at least 67 %, and ( b ) 100 %. in another embodiment , the present invention provides a novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 8 - r 12 is at least 20 %. the abundance can also be ( a ) at least 40 %, ( b ) at least 60 %, ( c ) at least 80 %, and ( d ) 100 %. in another embodiment , the present invention provides a novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 13 - r 17 is at least 20 %. the abundance can also be ( a ) at least 40 %, ( b ) at least 60 %, ( c ) at least 80 %, and ( d ) 100 %. in another embodiment , the present invention provides a novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 18 - r 31 is at least 7 %. the abundance can also be ( a ) at least 14 %, ( b ) at least 21 %, ( c ) at least 29 %, ( d ) at least 36 %, ( e ) at least 43 %, ( f ) at least 50 %, ( g ) at least 57 %, ( h ) at least 64 %, ( i ) at least 71 %, ( j ) at least 79 %, ( k ) at least 86 %, ( l ) at least 93 %, and ( m ) 100 %. in another embodiment , the present invention provides an isolated novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof . wherein r 1 - r 31 are independently selected from h and d ; and the abundance of deuterium in r 1 - r 31 is at least 3 %. the abundance can also be ( a ) at least 6 %, ( b ) at least 13 %, ( c ) at least 19 %, ( d ) at least 26 %, ( e ) at least 32 %, ( f ) at least 39 %, ( g ) at least 45 %, ( h ) at least 52 %, ( i ) at least 58 %, ( j ) at least 65 %, ( k ) at least 71 %, ( l ) at least 77 %, ( m ) at least 84 %, ( n ) at least 90 %, ( o ) at least 97 %, and ( p ) 100 %. in another embodiment , the present invention provides an isolated novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 1 is at least 100 %. in another embodiment , the present invention provides an isolated novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 2 - r 31 is at least 3 %. the abundance can also be ( a ) at least 7 %, ( b ) at least 13 %, ( c ) at least 20 %, ( d ) at least 27 %, ( e ) at least 33 %, ( f ) at least 40 %, ( g ) at least 47 %, ( h ) at least 53 %, ( i ) at least 60 %, ( j ) at least 67 %, ( k ) at least 73 %, ( l ) at least 80 %, ( m ) at least 87 %, ( n ) at least 93 %, and ( o ) 100 %. in another embodiment , the present invention provides an isolated novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 2 - r 4 is at least 33 %. the abundance can also be ( a ) at least 67 %, and ( b ) 100 %. in another embodiment , the present invention provides an isolated novel , deuterium enriched compound of formula i , wherein the abundance of deuterium in r 5 - r 7 is at least 33 %. the abundance can also be ( a ) at least 67 %, and ( b ) 100 %. in another embodiment , the present invention provides an isolated novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 8 - r 12 is at least 20 %. the abundance can also be ( a ) at least 40 %, ( b ) at least 60 %, ( c ) at least 80 %, and ( d ) 100 %. in another embodiment , the present invention provides an isolated novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 13 - r 17 is at least 20 %. the abundance can also be ( a ) at least 40 %, ( b ) at least 60 %, ( c ) at least 80 %, and ( d ) 100 %. in another embodiment , the present invention provides an isolated novel , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 18 - r 31 is at least 7 %. the abundance can also be ( a ) at least 14 %, ( b ) at least 21 %, ( c ) at least 29 %, ( d ) at least 36 %, ( e ) at least 43 %, ( f ) at least 50 %, ( g ) at least 57 %, ( h ) at least 64 %, ( i ) at least 71 %, ( j ) at least 79 %, ( k ) at least 86 %, ( l ) at least 93 %, and ( m ) 100 %. in another embodiment , the present invention provides novel mixture of deuterium enriched compounds of formula i or a pharmaceutically acceptable salt thereof wherein r 1 - r 31 are independently selected from h and d ; and the abundance of deuterium in r 1 - r 31 is at least 3 %. the abundance can also be ( a ) at least 6 %, ( b ) at least 13 %, ( c ) at least 19 %, ( d ) at least 26 %, ( e ) at least 32 %, ( f ) at least 39 %, ( g ) at least 45 %, ( h ) at least 52 %, ( i ) at least 58 %, ( j ) at least 65 %, ( k ) at least 71 %, ( l ) at least 77 %, ( m ) at least 84 %, ( n ) at least 90 %, ( o ) at least 97 %, and ( p ) 100 %. in another embodiment , the present invention provides a novel mixture of , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 1 is at least 100 %. in another embodiment , the present invention provides a novel mixture of , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 2 - r 31 is at least 3 %. the abundance can also be ( a ) at least 7 %, ( b ) at least 13 %, ( c ) at least 20 %, ( d ) at least 27 %, ( e ) at least 33 %, ( f ) at least 40 %, ( g ) at least 47 %, ( h ) at least 53 %, ( i ) at least 60 %, ( j ) at least 67 %, ( k ) at least 73 %, ( l ) at least 80 %, ( m ) at least 87 %, ( n ) at least 93 %, and ( o ) 100 %. in another embodiment , the present invention provides a novel mixture of , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 2 - r 4 is at least 33 %. the abundance can also be ( a ) at least 67 %, and ( b ) 100 %. in another embodiment , the present invention provides a novel mixture of , deuterium enriched compound of formula i , wherein the abundance of deuterium in r 5 - r 7 is at least 33 %. the abundance can also be ( a ) at least 67 %, and ( b ) 100 %. in another embodiment , the present invention provides a novel mixture of , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 8 - r 12 is at least 20 %. the abundance can also be ( a ) at least 40 %, ( b ) at least 60 %, ( c ) at least 80 %, and ( d ) 100 %. in another embodiment , the present invention provides a novel mixture of , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 13 - r 17 is at least 20 %. the abundance can also be ( a ) at least 40 %, ( b ) at least 60 %, ( c ) at least 80 %, and ( d ) 100 %. in another embodiment , the present invention provides a novel mixture of , deuterium enriched compound of formula i or a pharmaceutically acceptable salt thereof , wherein the abundance of deuterium in r 18 - r 31 is at least 7 %. the abundance can also be ( a ) at least 14 %, ( b ) at least 21 %, ( c ) at least 29 %, ( d ) at least 36 %, ( e ) at least 43 %, ( f ) at least 50 %, ( g ) at least 57 %, ( h ) at least 64 %, ( i ) at least 71 %, ( j ) at least 79 %, ( k ) at least 86 %, ( l ) at least 93 %, and ( m ) 100 %. in another embodiment , the present invention provides novel pharmaceutical compositions , comprising : a pharmaceutically acceptable carrier and a therapeutically effective amount of a deuterium - enriched compound of the present invention . in another embodiment , the present invention provides a novel method for treating urinary incontinence comprising : administering to a patient in need thereof a therapeutically effective amount of a deuterium - enriched compound of the present invention . in another embodiment , the present invention provides an amount of a deuterium - enriched compound of the present invention as described above for use in therapy . in another embodiment , the present invention provides the use of an amount of a deuterium - enriched compound of the present invention for the manufacture of a medicament ( e . g ., for the treatment of urinary incontinence ). the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof . this invention encompasses all combinations of preferred aspects of the invention noted herein . it is understood that any and all embodiments of the present invention may be taken in conjunction with any other embodiment or embodiments to describe additional more preferred embodiments . it is also to be understood that each individual element of the preferred embodiments is intended to be taken individually as its own independent preferred embodiment . furthermore , any element of an embodiment is meant to be combined with any and all other elements from any embodiment to describe an additional embodiment . the examples provided in the definitions present in this application are non - inclusive unless otherwise stated . they include but are not limited to the recited examples . the compounds of the present invention may have asymmetric centers . compounds of the present invention containing an asymmetrically substituted atom may be isolated in optically active or racemic forms . it is well known in the art how to prepare optically active forms , such as by resolution of racemic forms or by synthesis from optically active starting materials . all processes used to prepare compounds of the present invention and intermediates made therein are considered to be part of the present invention . all tautomers of shown or described compounds are also considered to be part of the present invention . “ host ” preferably refers to a human . it also includes other mammals including the equine , porcine , bovine , feline , and canine families . “ treating ” or “ treatment ” covers the treatment of a disease - state in a mammal , and includes : ( a ) preventing the disease - state from occurring in a mammal , in particular , when such mammal is predisposed to the disease - state but has not yet been diagnosed as having it ; ( b ) inhibiting the disease - state , e . g ., arresting it development ; and / or ( c ) relieving the disease - state , e . g ., causing regression of the disease state until a desired endpoint is reached . treating also includes the amelioration of a symptom of a disease ( e . g ., lessen the pain or discomfort ), wherein such amelioration may or may not be directly affecting the disease ( e . g ., cause , transmission , expression , etc .). “ therapeutically effective amount ” includes an amount of a compound of the present invention that is effective when administered alone or in combination to treat the desired condition or disorder . “ therapeutically effective amount ” includes an amount of the combination of compounds claimed that is effective to treat the desired condition or disorder . the combination of compounds is preferably a synergistic combination . synergy , as described , for example , by chou and talalay , adv . enzyme regul . 1984 , 22 : 27 - 55 , occurs when the effect of the compounds when administered in combination is greater than the additive effect of the compounds when administered alone as a single agent . in general , a synergistic effect is most clearly demonstrated at sub - optimal concentrations of the compounds . synergy can be in terms of lower cytotoxicity , increased antiviral effect , or some other beneficial effect of the combination compared with the individual components . “ pharmaceutically acceptable salts ” refer to derivatives of the disclosed compounds wherein the parent compound is modified by making acid or base salts thereof . examples of pharmaceutically acceptable salts include , but are not limited to , mineral or organic acid salts of the basic residues . the pharmaceutically acceptable salts include the conventional quaternary ammonium salts of the parent compound formed , for example , from non - toxic inorganic or organic acids . for example , such conventional non - toxic salts include , but are not limited to , those derived from inorganic and organic acids selected from 1 , 2 - ethanedisulfonic , 2 - acetoxybenzoic , 2 - hydroxyethanesulfonic , acetic , ascorbic , benzenesulfonic , benzoic , bicarbonic , carbonic , citric , edetic , ethane disulfonic , ethane sulfonic , fumaric , glucoheptonic , gluconic , glutamic , glycolic , glycollyarsanilic , hexylresorcinic , hydrabamic , hydrobromic , hydrochloric , hydroiodide , hydroxymaleic , hydroxynaphthoic , isethionic , lactic , lactobionic , lauryl sulfonic , maleic , malic , mandelic , methanesulfonic , napsylic , nitric , oxalic , pamoic , pantothenic , phenylacetic , phosphoric , polygalacturonic , propionic , salicyclic , stearic , subacetic , succinic , sulfamic , sulfanilic , sulfuric , tannic , tartaric , and toluenesulfonic . scheme 1 shows a route to tolterodine ( hedberg , et al ., adv . synth . catal . 2005 , 347 , 662 - 666 ). scheme 2 shows how various deuterated starting materials and intermediates from scheme 1 can be accessed and used to make deuterated tolterodine analogs . a person skilled in the art of organic synthesis will recognize that these reactions and these materials may be used in various combinations to access a variety of deuterated tolterodines . equation ( 1 ) shows how 2 ′- bromo - 4 ′- methylacetophenone 2 from scheme 1 can be made . starting with toluene , selective bromination gives 1 ( kohn , et al ., monatsh . chem . 1912 , 33 , 923 - 928 ), which may be acylated to give 2 ( sugimoto , et al ., chem . pharm . bull . 1985 , 33 , 2809 - 2820 ). if known deuterated forms of toluene are used instead , compounds such as 3 and 4 result , as shown in equations ( 2 ) and ( 3 ). if 3 is used in the chemistry of scheme 1 , tolterodine with r 5 - r 7 = d results . if 4 is used in the chemistry of scheme 1 , tolterodine with r 2 - r 7 = d results . if the known deuterated benzaldehyde 5 is used in the chemistry of scheme 1 , 2 produces 6 results , as shown in equation ( 4 ). if 5 is used in the chemistry of scheme 1 , tolterodine with r 8 - r 12 = d results . if bd 3 · thf is used as the reducing agent in scheme 1 , 7 can be converted to 8 , as shown in equation ( 5 ). if 8 is used in the chemistry of scheme 1 , tolterodine with r 13 = d results . exchange of the protons next to the carbonyl group in 9 produces 10 , as shown in equation ( 6 ). if 6 is used in the chemistry of scheme 1 , tolterodine with r 14 - r 15 = d results . the use of liald 4 rather than lialh 4 in the chemistry of scheme 1 allows the conversion of 11 to 12 as shown in equation ( 7 ). if 12 is used in the chemistry of scheme 1 , tolterodine with r 16 - r 17 = d results . if the known deuterated diisopropylamines 13 - 15 are used in the chemistry of scheme 1 , the amines 16 - 18 result , as shown in equation ( 8 ). if 16 is used in the chemistry of scheme 1 , tolterodine with r 18 - r 31 = d results . if 17 is used in the chemistry of scheme 1 , tolterodine with r 18 - r 20 + r 22 - r 27 + r 29 - r 31 = d results . if 18 is used in the chemistry of scheme 1 , tolterodine with r 21 + r 28 = d results . table 1 provides compounds that are representative examples of the present invention . when one of r 1 - r 25 is present , it is selected from h or d . table 2 provides compounds that are representative examples of the present invention . where h is shown , it represents naturally abundant hydrogen . numerous modifications and variations of the present invention are possible in light of the above teachings . it is therefore to be understood that within the scope of the appended claims , the invention may be practiced otherwise that as specifically described herein .	2
embodiment modes of the present invention will be explained hereinafter with reference to the accompanying drawings . however , it is to be easily understood that various changes and modifications will be apparent to those skilled in the art . therefore , unless such changes and modifications depart from the purport and the scope of the present invention , they should be construed as being included therein . note that , according to the present invention , among a pair of electrodes of a light - emitting element , an electrode that serves as an anode refers to an electrode that can obtain light emission in applying a higher voltage to this electrode , and an electrode that serves as a cathode refers to an electrode that can obtain light emission in applying a lower voltage to this electrode . this embodiment mode will explain an organometallic complex of the present invention . organometallic complexes represented by structural formulas ( 6 ) to ( 84 ) can be given as one mode of the present invention . however , the present invention is not limited to the description here . each of the organometallic complexes of the present invention described above emits phosphorescence . therefore , by using an organometallic complex of the present invention as a light - emitting substance , a light - emitting element having high internal quantum efficiency and luminous efficiency can be manufactured . in addition , an organometallic complex generally has poor heat resistance . however , an organometallic complex of the present invention emits phosphoresce and is superior in heat resistance . a mode of a light - emitting element in which an organometallic complex of the present invention is used as a light - emitting substance will be explained with reference to fig1 . fig1 shows a light - emitting element having a light - emitting layer 113 between a first electrode 101 and a second electrode 102 . then , the light - emitting layer 113 contains an organometallic complex according to the present invention having a structure represented by any of general formulas ( g1 ), ( g3 ), ( g5 ), ( g7 ), ( g9 ), and ( g11 ), or an organometallic complex according to the present invention represented by any of general formulas ( g2 ), ( g4 ), ( g6 ), ( g8 ), ( g10 ), and ( g12 ). in addition to the light - emitting layer 113 , a hole - injecting layer 111 , a hole - transporting layer 112 , an electron - transporting layer 114 , an electron - injecting layer 115 , a hole - blocking layer 121 , or the like is provided between the first electrode 101 and the second electrode 102 . these layers are stacked so that holes are injected from the first electrode 101 side and electrons are injected from the second electrode 102 side when a voltage is applied so that the potential of the first electrode 101 gets higher than that of the second electrode 102 . here , the hole - blocking layer is a layer having a function of preventing the holes injected from the first electrode 101 side from penetrating the light - emitting layer 113 to the other electrode side , and a function of preventing excitation energy generated in the light - emitting layer from moving to other layer from the light - emitting layer , as well as transporting the holes to the light - emitting layer . as shown in fig1 , the hole - blocking layer is provided between the light - emitting layer 113 and the electron - transporting layer 114 , which can prevent the holes from penetrating . in such a light - emitting element , the holes injected from the first electrode 101 side and the electrons injected from the second electrode 102 side are recombined in the light - emitting layer 113 , and the organometallic complex is made into an excitation state . an organometallic complex in an excited state emits light upon returning to a ground state . thus , an organometallic complex according to the present invention serves as a light - emitting substance . by using an organometallic complex according to the present invention as a light - emitting substance , a light - emitting element having high internal quantum efficiency and luminous efficiency can be manufactured . further , since an organometallic complex according to the present invention is superior in heat resistance , a light - emitting element using such an organometallic complex as a light - emitting substance is superior in heat stability . consequently , a high - reliable light - emitting element can be obtained . here , the light - emitting layer 113 is a layer containing an organometallic complex according to the present invention . the light - emitting layer 113 may be a layer formed only of an organometallic complex according to the present invention . however , when concentration quenching occurs , it is preferable to foul ). a layer in which an organometallic complex ( a guest ) is mixed to be dispersed in a layer ( a host ) formed of a substance having an energy gap larger than that of an organometallic complex . by containing an organometallic complex according to the present invention in the light - emitting layer 113 by being dispersed , light emission can be prevented from being quenched due to the concentration . here , the energy gap refers to an energy gap between the lumo level and the homo level . by using an organometallic complex according to the present invention for the light - emitting layer 113 , a high - efficient light - emitting element whose wavelength band is green to blue light can be obtained . the substance to be used for dispersing an organometallic complex according to the present invention is not particularly limited , and a carbazole derivative such as 4 , 4 ′- bis ( n - carbazolyl ) biphenyl ( abbreviation : cbp ) or 4 , 4 ′, 4 ″- tris ( n - carbazolyl ) triphenylamine ( abbreviation : tcta ); a metal complex such as bis [ 2 -( 2 - hydroxyphenyl ) pyridinato ] zinc ( abbreviation : znpp 2 ), bis [ 2 -( 2 - hydroxyphenyl ) benzoxazolate ] zinc ( abbreviation : znbox ); or the like is preferable in addition to an arylamine derivative such as 1 , 1 - bis [ 4 -( n , n - diphenylamino ) phenyl ] cyclohexane ( tpac ). one or more of these substances are preferably selected to be mixed so that an organometallic complex according to the present invention is dispersed . a layer where a plurality of compounds is thus mixed can be formed with the use of a co - evaporation method . here , co - evaporation refers to an evaporation method in which raw materials are respectively vaporized from a plurality of evaporation sources provided in one treatment chamber , and the vaporized materials are mixed in a gas - phase state to be deposited over a subject . note that the light - emitting layer 113 can be formed by a droplet - discharging method instead of an evaporation method . by using a droplet - discharging method , a raw material of a predetermined amount can be discharged at a predetermined place ; therefore , the cost of a raw material can be reduced . in addition , the first electrode 101 and the second electrode 102 are not particularly limited and can be formed using gold ( au ), platinum ( pt ), nickel ( ni ), tungsten ( w ), chromium ( cr ), molybdenum ( mo ), iron ( fe ), cobalt ( co ), copper ( cu ), palladium ( pd ), or the like as well as indium tin oxide ( ito ), indium tin oxide containing silicon oxide , or indium oxide formed by using a target mixed with 2 wt . % to 20 wt . % of zinc oxide . moreover , in addition to aluminum , an alloy of magnesium and silver , an alloy of aluminum and lithium , or the like can also be used in forming the first electrode 101 . note that a method for forming the first electrode 101 and the second electrode 102 is not particularly limited and , for example , a sputtering method , an evaporation method , or the like can be used . note that it is preferable to form either the first electrode 101 or the second electrode 102 , or both by using indium tin oxide or the like or by depositing silver , aluminum , or the like to have a thickness of several nm to several 10 nm so that emitted light can be extracted to outside . moreover , the hole - transporting layer 112 may be provided between the first electrode 101 and the light - emitting layer 113 as shown in fig1 . here , the hole - transporting layer 112 is a layer having a function of transporting the holes injected from the first electrode 101 side to the light - emitting layer 113 . by providing the hole - transporting layer 112 in such a manner , the distance between the first electrode 101 and the light - emitting layer 113 can be larger . consequently , light emission can be prevented from being quenched due to metal contained in the first electrode 101 . the hole - transporting layer 112 is preferable to be formed using a substance having high hole transportability and particularly preferable to be formed using a substance having hole mobility of 1 × 10 − 6 cm 2 / vs or more . note that the substance having high hole transportability indicates a substance having higher mobility of holes than that of electrons , where a value of a ratio of hole mobility to electron mobility (= hole mobility / electron mobility ) is more than 100 . the following can be given as a specific example of a substance that can be used to form the hole - transporting layer 112 : 4 , 4 ′- bis [ n -( 1 - naphtyl )- n - phenylamino ] biphenyl ( abbreviation : npb ); 4 , 4 ′- bis [ n -( 3 - methylphenyl )- n - phenylamino ] biphenyl ( abbreviation : tpd ); 4 , 4 ′, 4 ″- tris ( n , n - diphenylamino ) triphenylamine ( abbreviation : tdata ); 4 , 4 ′, 4 41 - tris [ n -( 3 - methylphenyl )- n - phenylamino ] triphenylamine ( abbreviation : mtdata ); 4 , 4 ′- bis { n -[ 4 -( n , n - di - m - tolylamino ) phenyl ]- n - phenylamino } biphenyl ( abbreviation : dntpd ); 1 , 3 , 5 - tris [ n , n - di ( m - tolyl ) amino ] benzene ( abbreviation : m - mtdab ); 4 , 4 ′, 4 ″- tris ( n - carbazolyl ) triphenylamine ( abbreviation : tcta ); phthalocyanine ( abbreviation : h 2 pc ); copper phthalocyanine ( abbreviation : cupc ); vanadylphthalocyanine ( abbreviation : vopc ); and the like . in addition , the hole - transporting layer 112 may also be a multilayer where two or more layers formed of the above substances are combined . further , the electron - transporting layer 114 may be provided between the second electrode 102 and the light - emitting layer 113 as shown in fig1 . here , the electron - transporting layer 114 is a layer having a function of transporting the electrons injected from the second electrode 102 side to the light - emitting layer 113 . by providing the electron - transporting layer 114 in such a manner , the distance between the second electrode 102 and the light - emitting layer 113 can be larger . consequently , light emission can be prevented from being quenched due to metal contained in the second electrode 102 . the electron - transporting layer 114 is preferable to be formed using a substance having high electron transportability and particularly preferable to be formed using a substance having electron mobility of 1 × 10 − 6 cm 2 / vs or more . note that the substance having high hole transportability refers to a substance having higher mobility of electrons than that of holes , where , preferably , a value of a ratio of electron mobility to hole mobility (= electron mobility / hole mobility ) is more than 100 . the following can be given as a specific example of a substance that can be used to form the electron - transporting layer 114 : 2 -( 4 - biphenylyl )- 5 -( 4 - tert - buthylphenyl )- 1 , 3 , 4 - oxadiazole ( abbreviation : pbd ); 1 , 3 - bis [ 5 -( p - tert - buthylphenyl )- 1 , 3 , 4 - oxadiazole - 2 - yl ] benzene ( abbreviation : oxd - 7 ); 3 -( 4 - tert - buthylphenyl )- 4 - phenyl - 5 -( 4 - biphenylyl )- 1 , 2 , 4 - triazole ( abbreviation : taz ); 3 -( 4 - tert - buthylphenyl )- 4 -( 4 - ethylphenyl )- 5 -( 4 - biphenylyl )- 1 , 2 , 4 - triazole ( abbreviation : p - ettaz ); bathophenanthroline ( abbreviation : bphen ); bathocuproin ( abbreviation : bcp ); 4 , 4 - bis ( 5 - methylbenzoxazol - 2 - yl ) stilbene ( abbreviation : bzos ); and the like as well as a metal complex such as tris ( 8 - quinolinolato ) aluminum ( abbreviation : alq 3 ); tris ( 4 - methyl - 8 - quinolinolato ) aluminum ( abbreviation : almq 3 ); bis ( 10 - hydroxybenzo [ h ]- quinolinato ) berylium ( abbreviation : bebq 2 ); bis ( 2 - methyl - 8 - quinolinolato )- 4 - phenylphenolate - aluminum ( abbreviation : balq ); bis [ 2 -( 2 - hydroxyphenyl ) benzoxazolate ] zinc ( abbreviation : zn ( box ) 2 ); and bis [ 2 -( 2 - hydroxyphenyl ) benzothiazorato ] zinc ( abbreviation : zn ( btz ) 2 ). in addition , the electron - transporting layer 114 may also be a multilayer where two or more layers formed of the above substances are combined . note that the hole - transporting layer 112 and the electron - transporting layer 114 may be each formed by using a bipolar substance in addition to the above substances . the bipolar substance refers to the following substance : when mobility of either carrier of an electron or a hole is compared with mobility of the other carrier , a value of a ratio of one carrier mobility to the other carrier mobility is 100 or less , preferably 10 or less . as for the bipolar substance , for example , 2 , 3 - bis ( 4 - diphenylaminophenyl ) quinoxaline ( abbreviation : tpaqn ); 2 , 3 - bis { 4 -[ n -( 1 - naphthyl )- n - phenylamino ] phenyl }- dibenzo [ f , h ] quinoxaline ( abbreviation : npadibzqn ); and the like can be given . it is preferable to particularly use a substance of which hole and electron mobility are each 1 × 10 − 6 cm 2 / vs or more in the bipolar substance . in addition , the hole - transporting layer 112 and the electron - transporting layer 114 may be formed by using the same bipolar substance . furthermore , the hole - injecting layer 111 may be provided between the first electrode 101 and the hole - transporting layer 112 as shown in fig1 . the hole - injecting layer 111 is a layer having a function of assisting holes to be injected to the hole - transporting layer 112 from the first electrode 101 . by providing the hole - injecting layer 111 , ionization potential difference between the first electrode 101 and the hole - transporting layer 112 is relieved ; thus , holes are easily injected . the hole - injecting layer 111 is preferably formed using a substance of which ionization potential is lower than that of a substance forming the hole - transporting layer 112 and higher than that of a substance forming the first electrode 101 or using a substance of which energy band curves by being provided as a thin film of 1 nm to 2 nm between the hole - transporting layer 112 and the first electrode 101 . in other words , the hole - injecting layer 111 can be formed by selecting such a substance of which ionization potential is relatively lower than that of the hole - transporting layer 112 . as for a specific example of a substance that can be used to form the hole - injecting layer 111 , a phthalocyanine - based compound such as phthalocyanine ( abbreviation : h 2 pc ) or copper phthalocyanine ( cupc ), a high molecular material such as poly ( ethylenedioxythiophene )/ poly ( styrenesulfonic acid ) solution ( pedot / pss ), and the like can be given . note that , in a case of forming the hole - injecting layer 111 with these substances , it is preferable to form the first electrode 101 using a substance having a high work function such as indium tin oxide . in addition , the electron - injecting layer 115 may be provided between the second electrode 102 and the electron - transporting layer 114 as shown in fig1 . here , the electron - injecting layer 115 is a layer having a function of assisting electrons to be injected to the electron - transporting layer 114 from the second electrode 102 . by providing the electron - injecting layer 115 , electron affinity difference between the second electrode 102 and the electron - transporting layer 114 is relieved ; thus , electrons are easily injected . the electron - injecting layer 115 is preferably formed using a substance of which electron affinity is higher than that of a substance forming the electron - transporting layer 114 and lower than that of a substance forming the second electrode 102 or using a substance of which energy band curves by being provided as a thin film of 1 nm to 2 nm between the electron - transporting layer 114 and the second electrode 102 . in other words , the electron - injecting layer 115 can be formed by selecting a substance having relatively higher electron affinity than that of the electron - transporting layer 114 . the following can be given as a specific example of a substance that can be used to form the electron - injecting layer 115 : inorganic material such as alkaline metal , alkaline earth metal , fluoride of alkaline metal , fluoride of alkaline earth metal , oxide of alkaline metal , or oxide of alkaline earth metal . in addition to the inorganic material , a substance that can be used to form the electron - transporting layer 114 such as bphen , bcp , p - ettaz , taz , or bzos can also be used as a substance for forming the electron - injecting layer 115 by selecting a substance of which electron affinity is higher than that of a substance for forming the electron - transporting layer 114 from these substances . note that , in a case of forming the electron - injecting layer 115 with these substances , it is preferable to form the first electrode 101 using a substance having a low work function such as aluminum . in a light - emitting element according to the present invention described above , each of the hole - injecting layer 111 , the hole - transporting layer 112 , the light - emitting layer 113 , the electron - transporting layer 114 , and the electron - injecting layer 115 may be formed by any of an evaporation method , an ink jet method , a coating method , and the like . in addition , the first electrode 101 or the second electrode 102 may be formed by any of a sputtering method , an evaporation method , and the like . moreover , a hole - generating layer may be provided instead of the hole - injecting layer 111 or an electron - generating layer may be provided instead of the electron - injecting layer 115 . by providing a hole - generating layer or an electron - generating layer , a light - emitting element where there is extremely small voltage increase depending on a thickness of the layers can be manufactured . here , the hole - generating layer is a layer for generating holes . the hole - generating layer can be formed by mixing at least one substance selected from a substance having higher mobility of holes than that of electrons and a bipolar substance with a substance that shows electron acceptability to these substances . here , as for the substance having higher mobility of holes than that of electrons , the same substance as the substance that can be used to form the hole - transporting layer 112 can be used . moreover , as for the bipolar substance , the above bipolar substance such as tpaqn can be used . it is preferable to particularly use a substance having a triphenylamine structure in a skeleton among the substance having higher mobility of holes than that of electrons and the bipolar substance . holes can be generated more easily by using the substance having a triphenylamine structure in a skeleton . further , as for the substance that shows electron acceptability , it is preferable to use metal oxide such as molybdenum oxide , vanadium oxide , ruthenium oxide , or rhenium oxide . further , the electron - generating layer is a layer for generating electrons . the electron - generating layer can be formed by mixing at least one substance selected from a substance having higher mobility of electrons than that of holes and a bipolar substance with a substance that shows electron - donating properties to these substances . here , as for the substance having higher mobility of electrons than that of holes , the same substance as the substance that can be used to form the electron - transporting layer 114 can be used . moreover , as for the bipolar substance , the above bipolar substance such as tpaqn can be used . further , as for the substance that shows electron - donating properties , a substance selected from an alkaline metal group and an alkaline earth metal group , specifically lithium ( li ), calcium ( ca ), sodium ( na ), potassium ( k ), magnesium ( mg ), or the like can be used . in addition , at least one substance of alkaline metal oxide , alkaline earth metal oxide , alkaline metal nitride , alkaline earth metal nitride , and the like , specifically lithium oxide ( li 2 o ), calcium oxide ( cao ), sodium oxide ( na 2 o ), potassium oxide ( k 2 o ), and magnesium oxide ( mgo ) can also be used as the substance that shows electron - donating properties . moreover , alkaline metal fluoride or alkaline earth metal fluoride , specifically fluoride such as lithium fluoride ( lif ), cesium fluoride ( csf ), or calcium fluoride ( caf 2 ) can also be used as the substance that shows electron - donating properties . note that , in the light - emitting element according to the present invention as described above , it is arbitrary whether to provide other layers that are different from a light - emitting layer , specifically , a hole - injecting layer , a hole - transporting layer , an electron - transporting layer , an electron - injecting layer , or the like , and it is preferably selected by a practitioner of the present invention . however , when a hole - transporting layer or an electron - transporting layer is provided , an advantageous effect of reducing the generation of quenching due to metal contained in an electrode , a hole - injecting layer , an electron - injecting layer , or the like can be obtained . in addition , an advantageous effect that electrons or holes can be efficiently injected from an electrode can be obtained by providing an electron - injecting layer , a hole - injecting layer , or the like . a light - emitting element according to the present invention using an organometallic complex according to the present invention as a light - emitting substance can emit light efficiently ; therefore , light can be emitted with a few amount of current . therefore , a light - emitting device according to the present invention using a light - emitting element according to the present invention as a pixel operates with low power consumption . this embodiment mode will explain a circuit configuration and a driving method of a light - emitting device having a display function with reference to fig2 to 5 . fig2 is an overhead schematic view of a light - emitting device according to this embodiment mode . in fig2 , a pixel portion 211 , a signal line driver circuit 212 , a writing scanning line driver circuit 213 , and an erasing scanning line driver circuit 214 are provided over a substrate 200 . each of the signal line driver circuit 212 , the writing scanning line driver circuit 213 , and the erasing scanning line driver circuit 214 is connected to an fpc ( flexible printed circuit ) 203 that is an external input terminal through a group of wirings . in addition , each of the signal line driver circuit 212 , the writing scanning line driver circuit 213 , and the erasing scanning line driver circuit 214 receives signals such as a video signal , a clock signal , a start signal , and a reset signal from the fpc 6503 . moreover , a printed wiring board ( pwb ) 204 is attached to the fpc 203 . note that it is not always necessary to provide the driver circuit portion over one substrate over which the pixel portion 211 is provided as described above . for example , the driver circuit portion may be provided outside the substrate by using a tcp that has an ic chip over an fpc over which a wiring pattern is formed . in the pixel portion 211 , a plurality of signal lines extending in columns is arranged in rows , current - supply lines are arranged to line in rows , and a plurality of scanning lines extending in rows is arranged to line in columns further , in the pixel portion 211 , a plurality of circuits each including a light - emitting element is arranged . fig3 is a diagram showing a circuit for operating one pixel . the circuit shown in fig3 includes a first transistor 301 , a second transistor 302 , and a light - emitting element 303 . each of the first transistor 301 and the second transistor 302 is a three - terminal element including a gate electrode , a drain region , and a source region , and including a channel region between the drain region and the source region . here , a source region and a drain region are switched with each other in accordance with a structure , operating conditions , or the like of a transistor ; therefore , it is difficult to identify which one is the source region or the drain region . consequently , regions that serve as a source or a drain are respectively referred to as a first electrode of a transistor and a second electrode of a transistor in this embodiment mode . a scanning line 311 and a writing scanning line driver circuit 313 are provided so as to be electrically connected or unconnected by a switch 318 , the scanning line 311 and an erasing scanning line driver circuit 314 are provided so as to be electrically connected or unconnected by a switch 319 , and a signal line 312 is provided so as to be electrically connected to either a signal line driver circuit 315 or a power source 316 by a switch 320 . further , the first transistor 301 has a gate electrically connected to the scanning line 311 , a first electrode electrically connected to the signal line 312 , and a second electrode electrically connected to a gate electrode of the second transistor 302 . the second transistor 302 has a first electrode electrically connected to a power supply line 317 and a second electrode electrically connected to one electrode included in the light - emitting element 303 . note that the switch 318 may be included in the writing scanning line driver circuit 313 , the switch 319 may be included in the erasing scanning line driver circuit 314 , and the switch 320 may be included in the signal line driver circuit 315 . note that a capacitor element may be provided between the gate of the second transistor 302 and the power supply line . in addition , arrangement of a transistor , a light - emitting element , and the like in a pixel is not particularly limited . for example , arrangement shown in a top view of fig4 can be employed . in fig4 , a first transistor 401 has a first electrode connected to a signal line 404 and a second electrode connected to a gate electrode of a second transistor 402 . in addition , the second transistor 402 has a first electrode connected to a power supply line 405 and a second electrode connected an electrode 406 of a light - emitting element . part of a scanning line 403 serves as a gate electrode of the first transistor 401 . a region 407 where a gate wiring of the second transistor 402 is overlapped with the power supply line 405 serves as a capacitor element . next , a driving method will be explained . fig5 is a diagram explaining operation per frame with time . in fig5 , the horizontal direction indicates passage of time , and the vertical direction indicates ordinal numbers of scanning lines . when a light - emitting device according to the present invention is used to display images , rewrite operation and display operation for a screen are repeated in a display period . although the number of rewrites is not particularly limited , it is preferable that the number of rewrites be about 60 times per second so as not to make an image viewer recognize flickers . here , a period for which rewrite operation and display operation are performed for a screen ( one frame ) is referred to as one frame period . as shown in fig5 , one frame is divided into four sub - frames 501 , 502 , 503 , and 504 respectively including writing periods 501 a , 502 a , 503 a , and 504 a and retention periods 501 b , 502 b , 503 b , and 504 b . in the retention period , a light - emitting element to which a signal for emitting light is given is made to be in an emitting state . the ratio of the length of the retention period in each sub - frame is first sub - frame 501 to second sub - frame 502 to third sub - frame 503 to fourth sub - frame 504 is 2 3 : 2 2 : 2 1 : 2 0 = 8 : 4 : 2 : 1 . this makes 4 - bit gradation possible . however , the number of bits or the number of gradations is not limited to that described here . for example , eight sub - frames may be provided so as to perform 8 - bit gradation . operation in one frame will be explained . first , in the sub - frame 501 , writing operation is sequentially performed for each of the first row to the last row . accordingly , the start time of the writing period 501 a is different depending on the row . when the writing period 501 a is completed , the row is sequentially moved into the retention period 501 b . in the retention period 501 b , a light - emitting element to which a signal for emitting light is given is made to be in an emitting state . in addition , when the retention period 501 b is completed , the row is sequentially moved into the next sub - frame 502 , and writing operation is sequentially performed for each of the first row to the last row as in the case of the sub - frame 501 . the operation described above is repeated to complete the retention period 504 b of the sub - frame 504 . when the operation in the sub - frame 504 is completed , the row is moved into the next frame . thus , the total of time for which light is emitted in each sub - frame is emission time for each light - emitting element in one frame . by varying this emission time with respect to each light - emitting element to have various combinations in one pixel , various different display colors in luminosity and chromaticity can be made . as in the sub - frame 504 , when forcible termination of a retention period of a row for which writing is already completed to move into the retention time is required before writing for the last row is completed , it is preferable that an erasing period 504 c is provided after the retention period 504 b and a row is controlled so as to be in a non - emitting state forcibly . in addition , the row made to be in the non - emitting state forcibly is kept the non - emitting state for a certain period ( this period is referred to as a non - emission period 504 d ). then , immediately after the writing period 504 a of the last row is completed , the rows are sequentially moved into the next writing period ( or the next frame ), starting from the first row . this makes it possible to prevent the writing period 504 a of the sub - frame 504 from overlapping with the writing period of the next sub - frame . although the sub - frames 501 to 504 are arranged in the order of retention period from longest to shortest in this embodiment mode , the arrangement as in this embodiment mode is not always necessary . for example , the sub - frames 501 to 504 may be arranged in the order of retention period from shortest to longest , or may be arranged in random order . in addition , the sub - frames may be divided further into a plurality of frames . in other words , scanning of the gate signal lines may be performed more than once while giving the same image signal . now , operation of the circuit shown in fig3 in a writing period and an erasing period will be explained . first , operation in a writing period will be explained . in the writing period , the n - th ( n is a natural number ) scanning line 311 is electrically connected to the writing scanning line driver circuit 313 through the switch 318 , and unconnected to the erasing scanning line driver circuit 314 . in addition , the signal line 312 is electrically connected to the signal line driver circuit 315 through the switch 320 . in this case , a signal is inputted into the gate of the first transistor 301 connected to the n - th ( n is a natural number ) scanning line 311 to turn on the first transistor 301 . then , at this moment , image signals are inputted simultaneously into the first to last signal lines 312 . note that the image signals inputted from the respective signal lines 312 are independent of each other . the image signal inputted from each of the signal lines 312 is inputted into the gate electrode of the second transistor 302 through the first transistor 301 connected to the signal line 312 . at this moment , whether the light - emitting element 303 emits light or not depends on the signal inputted into the second transistor 302 . for example , when the second transistor 302 is a p - channel type , the light - emitting element 303 is made to emit light by inputting a low level signal to the gate electrode of the second transistor 302 . on the other hand , when the second transistor 302 is an n - channel type , the light - emitting element 303 is made to emit light by inputting a high level signal to the gate electrode of the second transistor 302 . next , operation in an erasing period will be explained . in the erasing period , the n - th ( n is a natural number ) scanning line 311 is electrically connected to the erasing scanning line driver circuit 314 through the switch 319 and unconnected to the wiring scanning line driver circuit 313 . in addition , the signal line 312 is electrically connected to the power source 316 through the switch 320 . in this case , a signal is inputted into the gate of the first transistor 301 connected to the n - th ( n is a natural number ) scanning line 311 to turn on the first transistor 301 . then , at this moment , erasing signals are inputted simultaneously into the first to last signal lines 312 . the erasing signal inputted from each of the signal lines 312 is inputted into the gate electrode of the second transistor 302 through the first transistor 301 connected to the signal line 312 . at this moment , current supply from the power supply line 317 to the light - emitting element 303 is blocked in accordance with the signal inputted into the second transistor 302 . then , the light - emitting element 303 is forcibly made to be in a non - emitting state . for example , when the second transistor 302 is a p - channel type , the light - emitting element 303 is made to emit no light by inputting a high level signal to the gate electrode of the second transistor 302 . on the other hand , when the second transistor 302 is an n - channel type , the light - emitting element 303 is made to emit no light by inputting a low level signal to the gate electrode of the second transistor 302 . note that , as for the n - th row ( n is a natural number ), signals for erasing are inputted by the operation as described above in an erasing period . however , as described above , the other row ( referred to as the m - th row ( m is a natural number )) may be in a writing period while the n - th row is in an erasing period . in such a case , it is necessary to input a signal for erasing into the n - th row and input a signal for writing into the m - th row by using the same source signal line . therefore , operation explained below is preferable . immediately after the n - th light - emitting element 303 is made to emit no light by the operation in the erasing period explained above , the scanning line 311 and the erasing scanning line driver circuit 314 are made to be unconnected to each other , and the switch 320 is switched to connect the signal line 312 and the signal line driver circuit 315 . then , in addition to connecting the signal line 312 to the signal line driver circuit 315 , the scanning line 311 is connected to the writing scanning line driver circuit 313 . then , a signal is inputted selectively into the m - th signal line from the writing scanning line driver circuit 313 to turn on the first transistor 301 , and signals for writing are inputted into the first to last signal lines 312 from the signal line driver circuit 315 . this signal makes the m - th light - emitting element 303 is made to be in an emitting or non - emitting state . immediately after the writing period for the m - th row is completed as described above , an erasing period for the ( n + 1 )- th row is started . for that purpose , the scanning line 311 and the writing scanning line driver circuit 313 are made to be unconnected to each other , and the switch 320 is switched to connect the signal line 312 to the power source 316 . further , the scanning line 311 , which is unconnected to the writing scanning line driver circuit 313 , is made to be connected to the erasing scanning line driver circuit 314 . then , a signal is inputted selectively into the ( n + 1 )- th scanning line 311 from the erasing scanning line driver circuit 314 to turn on the first transistor 301 , and an erasing signal is inputted from the power source 316 . immediately after the erasing period for the ( n + 1 )- th row is thus completed , a writing period for the m - th row is started . hereinafter , an erasing period and a writing period may be repeated in the same way until an erasing period for the last row is completed . although this embodiment mode explains the mode in which the writing period for the m - th row is provided between the erasing period for the n - th row and the erasing period for the ( n + 1 )- th row , the present invention is not limited thereto . the writing period for the m - th row may be provided between an erasing period for ( n − 1 )- th row and an erasing period for n - th row . in addition , in this embodiment mode , the operation in which the erasing scanning line driver circuit 314 and one scanning line 311 are made to be unconnected to each other and the writing scanning line driver circuit 313 and the other gate scanning line 311 are made to be connected to each other is repeated as the non - emission period 504 d is provided in the sub - frame 504 . this type of operation may be performed in a frame in which a non - emission period is not particularly provided . one mode of a cross - sectional view of a light - emitting device including a light - emitting element according to the present invention will be explained with reference to fig6 a to 6c . in each of fig6 a to 6c , a rectangular portion surrounded by a dotted line is a transistor 11 provided for driving a light - emitting element 12 according to the present invention . the light - emitting element 12 is a light - emitting element according to the present invention , which has a layer 15 in which a layer for generating holes , a layer for generating electrons , and a layer containing a light - emitting substance are stacked between a first electrode 13 and a second electrode 14 . a drain of the transistor 11 and the first electrode 13 are electrically connected to each other by a wiring 17 running through a first interlayer insulating film 16 ( 16 a , 16 b , and 16 c ). in addition , the light - emitting element 12 is separated by a partition layer 18 from another light - emitting element provided adjacently . a light - emitting device having such a structure according to the present invention is provided over a substrate 10 in this embodiment mode . note that the transistor 11 shown in each of fig6 a to 6c is a top - gate tft in which a gate electrode is provided on the opposite side of a substrate as a center from a semiconductor layer . however , the structure of the transistor 11 is not particularly limited . for example , a bottom - gate type may also be used . in the case of a bottom - gate tft , a tft where a protective film is formed over a semiconductor layer that forms a channel ( a channel - protected type ) may be employed , or a tft where part of a semiconductor layer that forms a channel is concave ( a channel - etched type ) may be employed . in addition , a semiconductor layer for forming the transistor 11 may be either crystalline or amorphous , or alternatively , may be microcrystal or the like . the following will describe a microcrystal semiconductor . the microcrystal semiconductor is a semiconductor that has an intermediate structure between amorphous and crystalline ( such as single - crystal or polycrystalline ) structures and has a third state that is stable in terms of free energy , which includes a crystalline region that has short range order and lattice distortion . further , a crystal grain from 0 . 5 to 20 nm is included in at least a region in a film . raman spectrum of the microcrystal semiconductor is shifted to a lower wavenumber side less than 520 cm − 1 . the diffraction peaks of ( 111 ) and ( 220 ), which are believed to be derived from silicon crystal lattice , are observed in the microcrystal semiconductor by the x - ray diffraction . the microcrystal semiconductor contains hydrogen or halogen of at least 1 atomic % or more for terminating dangling bonds . the microcrystal semiconductor is formed by glow discharge decomposition with a gas such as sih 4 , si 2 h 6 , sih 2 cl 2 , sihcl 3 , sicl 4 , or sif 4 ( using plasma cvd ). each of these gases may also be diluted with h 2 , or a mixture of h 2 and one or more of rare gas elements of he , ar , kr , and ne . the dilution ratio is set to be in the range of 1 : 2 to 1 : 1 , 000 . the pressure is set to be approximately in the range of 0 . 1 to 133 pa . the power frequency is set to be 1 to 120 mhz , preferably , 13 to 60 mhz . the substrate heating temperature is set to be 300 ° c . or less , preferably , 100 to 250 ° c . as for impurity elements contained in the film , each concentration of impurities for atmospheric constituents such as oxygen , nitrogen , and carbon is preferably set to be 1 × 10 20 / cm 3 or less . in particular , the oxygen concentration is set to be 5 × 10 19 / cm 3 or less , preferably , 1 × 10 19 / cm 3 or less . moreover , specific examples of crystalline semiconductors for the semiconductor layer include single - crystal or polycrystalline silicon and silicon - germanium , which may be formed by laser crystallization or may be formed by crystallization with solid - phase growth using an element such as nickel . in a case of using an amorphous substance , for example , amorphous silicon to form the semiconductor layer , it is preferable that the light - emitting device have a circuit in which the transistor 11 and the other transistor ( a transistor forming the circuit for driving the light - emitting element ) are all n - channel transistors . other than that case , the light - emitting device may have a circuit including one of an n - channel transistor and a p - channel transistor or may have a circuit including both an n - channel transistor and a p - channel transistor . further , the first interlayer insulating film 16 may be a multilayer as shown in fig6 a , 6 b , and 6 c , or may be a single layer . note that the first interlayer insulating film 16 a includes an inorganic material such as silicon oxide or silicon nitride , and the first interlayer insulating film 16 b includes a substance with self - flatness such as acrylic , siloxane ( note that a siloxane resin corresponds to a resin including a si — o — si bond . siloxane has a framework structure formed by the bond between silicon ( si ) and oxygen ( o ). as a substituent , an organic group including at least hydrogen ( for example , an alkyl group or an aromatic hydrocarbon group ) is used . as a substituent , a fluoro group may also be used , or an organic group including at least hydrogen and a fluoro group may also be used . ), or silicon oxide that can be formed by being coated . furthermore , the first interlayer insulating film 16 c has a silicon nitride film containing argon ( ar ). note that the substances included in the respective layers are not particularly limited ; therefore , substances other than the substances mentioned here may be used . moreover , a layer including a substance other than these substances may be combined . in such a manner , both an inorganic material and an organic material , or one of an inorganic material and an organic material may be used to form the first interlayer insulating film 16 . as for the partition layer 18 , it is preferable that an edge portion have a shape varying continuously in curvature radius . in addition , acrylic , siloxane , resist , silicon oxide , or the like is used to form the partition layer 18 . either an inorganic material or an organic material , or both may be used to form the partition layer 18 . in each of fig6 a and 6c , only the first interlayer insulating film 16 is provided between the transistor 11 and the light - emitting element 12 . however , as shown in fig6 b , a second interlayer insulating film 19 ( 19 a and 19 b ) may be provided in addition to the first interlayer insulating film 16 ( 16 a and 16 b ). in the light - emitting device shown in fig6 b , the first electrode 13 is connected to the wiring 17 through the second interlayer insulating film 19 . the second interlayer insulating film 19 may be a multilayer or a single layer in the same way as the first interlayer insulating film 16 . the second interlayer insulating film 19 a includes a substance with self - flatness such as acrylic , siloxane , or silicon oxide that can be formed by being coated . in addition , the second interlayer insulating film 19 b has a silicon nitride film including argon ( ar ). the substances included in the respective layers are not particularly limited ; therefore , substances other than the substances mentioned here may be used . moreover , a layer including a substance other than these substances may be combined . in such a manner , both an inorganic material and an organic material , or one of an inorganic material and an organic material may be used to form the second interlayer insulating film 19 . in the light - emitting element 12 , in a case where both the first electrode 13 and the second electrode 14 are formed by using a light - transmitting substance , emitted light can be extracted from both the first electrode 13 side and the second electrode 14 side as indicated by outline arrows of fig6 a . in a case where only the second electrode 14 is formed by using a light - transmitting material , emitted light can be extracted from only the second electrode 14 side as indicated by an outline arrow of fig6 b . in this case , it is preferable that the first electrode 13 include a highly reflective material or that a film composed of a highly reflective material ( a reflective film ) be provided below the first electrode 13 . in a case where only the first electrode 13 is formed by using a light - transmitting substance , emitted light can be extracted from only the first electrode 13 side as indicated by an outline arrow of fig6 c . in this case , it is preferable that the second electrode 14 include a highly reflective material or that a reflective film be provided above the second electrode 14 . in addition , the layer 15 may be stacked so that the light - emitting element 12 operates when a voltage is applied so that the potential of the second electrode 14 gets higher than the potential of the first electrode 13 , or the layer 15 may be stacked so that the light - emitting element 12 operates when a voltage is applied so that the potential of the second electrode 14 gets lower than the potential of the first electrode 13 . the transistor 11 is an n - channel transistor in the former case , and the transistor 11 is a p - channel transistor in the latter case . as described above , an active light - emitting device in which driving of a light - emitting element is controlled by a transistor is explained in this embodiment mode . however , without limitation to an active light - emitting device , the present invention may be applied to a passive light - emitting device . fig7 shows a perspective view of a passive light - emitting device to which the present invention is applied . in fig7 , a layer 705 where a layer containing a light - emitting substance , a layer for generating electrons , and a layer for generating holes are sequentially stacked is provided between an electrode 702 and an electrode 706 over a substrate 701 . the end of the electrode 702 is covered with an insulating layer 703 . a partition layer 704 is provided over the insulating layer 703 . the nearer the sidewall of the partition layer is to a substrate surface , the narrower the distance between one sidewall and the other sidewall is to have inclination . in other words , a cross section of the partition layer 704 in a minor axis is a trapezoid , in which the lower base ( a base in the same direction as the face direction of the insulating layer 703 and in contact with the insulating layer 703 ) is shorter than the upper base ( a base in the same direction as the face of the insulating layer 703 and not in contact with the insulating layer 703 ). accordingly , defectiveness of a light - emitting element due to static electricity or the like can be prevented by providing the partition layer 704 . in addition , a passive light - emitting device can also be driven with low power consumption by including a light - emitting element according to the present invention that is operated with a low drive voltage . since a light - emitting element according to the present invention using an organometallic complex according to the present invention as a light - emitting substance emits light efficiently , active and passive light - emitting devices according to the present invention each using a light - emitting element according to the present invention as a pixel operate with low power consumption . note that , in the case of the active light - emitting device , a light - emitting element having high luminous efficiency can be obtained by using an organometallic complex according to the present invention for g ( green ) or b ( blue ), and using a known phosphorescent material for r ( red ) among pixels of r ( red ), g ( green ), and b ( blue ). therefore , the active light - emitting device according to the present invention using this light - emitting element as a pixel can operate with low power consumption . since a light - emitting device including a light - emitting element according to the present invention can operate with low power consumption , an electronic device with low power consumption can be obtained by the present invention . each of fig8 a to 8c shows one embodiment of an electronic device mounted with a light - emitting device to which the present invention is applied . fig8 a is a computer manufactured by applying the present invention , which includes a main body 5521 , a housing 5522 , a display portion 5523 , a keyboard 5524 , and the like . a light - emitting device where light - emitting elements using , as a light - emitting substance the organometallic complex according to the present invention , which is explained in embodiment modes 1 and 2 , are arranged in matrix is incorporated into the display portion 5523 . in such a manner , the personal computer can be completed by incorporating a light - emitting device having a light - emitting element containing the organometallic complex according to the present invention as the display portion . since the display portion of such a personal computer can emit light efficiently , power consumption can be reduced . fig8 b is a telephone hand set manufactured by applying the present invention , in which a main body 5552 includes a display portion 5551 , an audio output portion 5554 , an audio input portion 5555 , operation switches 5556 and 5557 , an antenna 5553 , and the like . a light - emitting device where light - emitting elements using , as a light - emitting substance the organometallic complex according to the present invention , which is explained in embodiment modes 1 and 2 , are arranged in matrix is incorporated into the display portion 5551 . in such a manner , the telephone hand set can be completed by incorporating a light - emitting device having a light - emitting element containing the organometallic complex according to the present invention as the display portion . since the display portion of such a telephone hand set can emit light efficiently , power consumption can be reduced . fig8 c is a television receiver manufactured by applying the present invention , which includes a display portion 5531 , a housing 5532 , speakers 5533 , and the like . a light - emitting device where light - emitting elements using , as a light - emitting substance the organometallic complex according to the present invention , which is explained in embodiment modes 1 and 2 , are arranged in matrix is incorporated into the display portion 5531 . in such a manner , the television receiver can be completed by incorporating a light - emitting device having a light - emitting element containing an organometallic complex according to the present invention as the display portion . since the display portion of such a television receiver can emit light efficiently , power consumption can be reduced . as described above , a light - emitting device according to the present invention is extremely suitable to be used as the display portions of various kinds of electronic devices . note that , although this embodiment mode describes a personal computer , a telephone hand set , and the like , a light - emitting device having a light - emitting element according to the present invention may also be mounted on a navigation device , a camera , or the like . a synthesis method of an organometallic complex according to the present invention represented by a structural formula ( 13 ) ( name : bis [ 3 , 5 - bis ( 4 - tert - butylphenyl )- 4 - phenyl - 1 , 2 , 4 - triazolato ]( picolinato ) iridium ( iii ), abbreviation : [ ir ( t - butaz ) 2 ( pic )]) will be explained . first , with a mixture of 30 ml of 2 - ethoxyethanol and 10 ml of water as a solvent , 2 . 59 g of the ligand h ( t - butaz )( 3 , 5 - bis ( 4 - tert - butyl - phenyl )- 4 - phenyl -[ 1 , 2 , 4 ] triazole ) [ manufactured by h . w . sands . corp .] and 0 . 76 g of iridium chloride ( ircl 3 . h 2 o ) were mixed , and held at reflux in a nitrogen atmosphere for 14 hours to obtain a dinuclear complex [ ir ( t - butaz ) 2 cl ] 2 ( yellow powder , yield : 53 %). a synthetic scheme ( a - 1 ) according to synthesis of step 1 is shown below . [ step 2 : synthesis of organometallic complex ( abbreviation : [ ir ( t - butaz ) 2 ( pic )]) according to the present invention ] further , with 20 ml of dichloromethane as a solvent , 0 . 60 g of the above obtained [ ir ( t - butaz ) 2 cl ] 2 , 0 . 28 g of picolinic acid ( hpic ) were mixed , and held at reflux in a nitrogen atmosphere for 18 hours . a reaction solution is concentrated and dried , and recrystallized with chloroform to obtain an organometallic complex ir ( t - butaz ) 2 ( pic ) according to the present invention ( a yellow crystal , yield : 72 %). a synthetic scheme ( a - 2 ) according to synthesis of step 2 is shown below . a result of mass spectroscopy of the obtained compound is shown below . a result of nuclear magnetic resonance spectrometry ( 1 h - nmr ) of the obtained compound is shown below . in addition , fig9 shows a chart of 1 h - nmr . 1 h - nmr . δ ( cdcl 3 ): 8 . 32 ( d , 1h ), 7 . 96 ( d , 1h ), 7 . 81 ( td , 1h ), 7 . 59 ( m , 9h ), 7 . 44 ( m , 2h ), 7 . 35 - 7 . 17 ( m , 8h ), 6 . 82 ( d , 1h ), 6 . 67 ( m , 2h ), 6 . 57 ( dd , 1h ), 6 . 27 - 6 . 20 ( m , 2h ), 1 . 26 ( s , 9h ), 1 . 24 ( s , 9h ), 1 . 16 ( s , 9h ), 1 . 12 ( s , 9h ). in addition , measurement of the thermal decomposition temperature t d of the obtained organometallic complex ir ( t - butaz ) 2 ( pic ) according to the present invention was performed by a thermogravimetry / differential thermal analysis simultaneous measurement system ( manufactured by seiko instruments inc ., tg / dta - 320 ) to find t d = 410 ° c . ; thus , it was found that the organometallic complex ir ( t - butaz ) 2 ( pic ) according to the present invention shows favorable heat resistance . moreover , fig1 shows a measurement result at a room temperature of ( a ) an absorption spectrum and ( b ) an emission spectrum ( pl ) of ir ( t - butaz ) 2 ( pic ) in dichloromethane . in fig1 , the horizontal axis indicates a wavelength ( nm ), and the vertical axis indicates intensity of absorption and light emission ( an arbitrary unit ). as is apparent from fig1 , the organometallic complex ir ( t - butaz ) 2 ( pic ) according to the present invention has absorption peaks at 318 nm ( sh ), 348 nm ( sh ), 382 nm , and 450 nm ( sh ), and has emission peak at 509 nm and emitted green light . in addition , light emission derived from the compound is hardly observed when a dichloromethane solution of the organometallic complex ir ( t - butaz ) 2 ( pic ) according to the present invention is irradiated with light to dissolve oxygen , while light emission is observed in a case of dissolving argon , thereby showing the same tendency as a substance generating phosphorescence . accordingly , it can be confirmed that light emission derived from ir ( t - butaz ) 2 ( pic ) is phosphorescence . this synthesis example 2 will explain a synthesis method of an organometallic complex according to the present invention represented by a structural formula 15 ( name : bis [ 3 , 5 - bis ( 4 - tert - butylphenyl )- 4 - phenyl - 1 , 2 , 4 - triazolato ][ tetrakis ( 1 - pyrazolyl ) borato ] iridium ( iii ), abbreviation : [ ir ( t - butaz ) 2 ( bpz 4 )]). [ step 1 : synthesis of an organometalliccomplex ( abbreviation : [ ir ( t - butaz ) 2 ( bpz 4 )]) according to the present invention ] first , 1 . 14 g of the dinuclear complex [ ir ( t - butaz ) 2 cl ] 2 obtained in step 1 of synthesis example 1 was suspended in 40 ml of dichloromethane . then , a solution , in which 0 . 36 g of silver trifluoromethanesulfonate was dissolved in 40 ml of a methanol solvent , was dropped to the suspension solution . then , suspension solution was stirred at room temperature for 2 hours and further centrifuged . a supernant solution obtained by the centrifugation was divided by decantation to be concentrated and dried . next , the solid obtained by being concentrated and dried was mixed with 0 . 61 g of tetrakis ( 1 - pyrazolyl ) borate potassium salt ( manufactured by acros organics ) by using 30 ml of acetonitrile as a solvent . then , the mixed solution was held at reflux in a nitrogen atmosphere for 20 hours to obtain a yellow powder ( yield : 47 %). a synthetic scheme ( a - 2 ′) of this synthesis is shown below . the obtained yellow powder was analyzed by nuclear magnetic resonance spectroscopy ( 1 h - nmr ) and the product was identified as [ ir ( t - butaz ) 2 ( bpz 4 )] represented by the structural formula ( 15 ) which is one of the organometallic complexes of the present invention . the result was as follows . in addition , fig1 shows a chart of 1 h - nmr . 1 h - nmr . δ ( cdcl 3 ): 7 . 86 ( m , 1h ), 7 . 74 ( m , 4h ), 7 . 67 - 7 . 58 ( m , 14h ), 7 . 46 ( d , 4h ), 7 . 37 ( d , 2h ), 6 . 66 ( m , 3h ), 6 . 57 ( dd , 2h ), 6 . 35 ( m , 1h ), 6 . 22 - 6 . 19 ( m , 5h ), 1 . 34 ( s , 18h ), 1 . 08 ( s , 18h ). moreover , fig1 shows a measurement result at a room temperature of ( a ) an absorption spectrum and ( b ) an emission spectrum ( pl ) of ir ( t - butaz ) 2 ( bpz 4 ) in dichloromethane . in fig1 , the horizontal axis indicates a wavelength ( nm ), and the vertical axis indicates intensity of absorption and light emission ( an arbitrary unit ). as is apparent from fig1 , the organometallic complex ir ( t - butaz ) 2 ( bpz 4 ) according to the present invention has absorption peaks at 366 nm , 325 nm ( sh ), and 450 nm , and has emission peaks at 458 nm and 489 nm and emitted light blue light . this synthesis example 3 will explain a synthesis method of an organometallic complex according to the present invention represented by a structural formula ( 55 ) ( name : bis ( 2 , 5 - diphenyl - 1 , 3 , 4 - oxadiazolato )( picolinato ) iridium ( iii ), abbreviation : [ ir ( poda ) 2 ( pic )]). [ step 1 : synthesis of dinuclear complex ([ ir ( poda ) 2 cl )] 2 ] first , 1 . 37 g ( 6 . 15 mmol ) of 2 , 5 - diphenyl - 1 , 3 , 4 - oxaziazole and 0 . 5 g ( 1 . 67 mmol ) of iridium chloride - monohydrate were put into a 100 ml three - necked flask , and 30 ml of 2 - ethoxyethanol and 10 ml of water were further added . then , heating was performed at 100 ° c . for 15 hours . after reaction , 0 . 45 g ( yield : 40 %) of a yellow solid , which was the intended object , was obtained by filtering with a membrane filter . a synthetic scheme ( b - 1 ) according to the synthesis of step 1 is shown below . [ step 2 : synthesis of organometallic complex ( abbreviation : [ ir ( poda ) 2 ( pic )]) according to the present invention ] 0 . 45 g ( 0 . 336 mmol ) of [ ir ( poda ) 2 cl ] 2 obtained in step 1 , 0 . 10 g ( 0 . 839 mmol ) of picolinic acid , and 0 . 36 g ( 3 . 36 mmol ) of sodium carbonate were put into a 100 ml three - necked flask , and 30 ml of 2 - ethoxyethanol was further added . then , heating was performed at 140 ° c . for 15 hours . after reaction , the solution was washed with water , a water layer was extracted with chloroform , and the obtained chloroform solution was washed along with the organic layer using saturated saline , and thereafter dried with magnesium sulfate . a substance obtained by being filtered and concentrated was purified by silica gel column chromatography ( ethyl acetate ) and recrystallized by chloroform and hexane . then , 0 . 27 g ( yield : 54 %) of a yellow solid , which was the intended object , was obtained . a synthetic scheme ( b - 2 ) according to the synthesis of step 2 is shown below . in addition , measurement of the thermal decomposition temperature t d of the obtained organometallic complex ir ( poda ) 2 ( pic ) according to the present invention was performed by a thermogravimetry / differential thermal analysis simultaneous measurement system ( manufactured by seiko instruments inc ., tg / dta - 320 ) to find that the organometallic complex was decomposed completely at 440 ° c . accordingly , it was found that the organometallic complex ir ( poda ) 2 ( pic ) according to the present invention shows favorable heat resistance . moreover , fig1 shows a measurement result at a room temperature of ( a ) an absorption spectrum and ( b ) an emission spectrum ( pl ) of ir ( poda ) 2 ( pic ) in dichloromethane . in fig1 , the horizontal axis indicates a wavelength ( nm ), and the vertical axis indicates intensity of absorption and light emission ( an arbitrary unit ). as is apparent from fig1 , the organometallic complex ir ( poda ) 2 ( pic ) according to the present invention has absorption peaks at 330 nm ( sh ), 360 nm ( sh ), 400 nm ( sh ), and 420 nm ( sh ), and has emission peak at 506 nm and emitted green light . in addition , light emission derived from the compound is hardly observed when a dichloromethane solution of the organometallic complex ir ( poda ) 2 ( pic ) according to the present invention is irradiated with light for substituting for oxygen ( oxygen substitution ), while light emission is observed in a case of substituting for argon ( argon substitution ), thereby showing the same tendency as a substance generating phosphorescence . accordingly , it can be confirmed that light emission derived from ir ( poda ) 2 ( pic ) is phosphorescence . the present application is based on japanese patent application serial no . 2005 - 303730 filed on oct . 18 , 2005 in japanese patent office , the entire contents of which are hereby incorporated by reference .	7
fig1 depicts one embodiment of an infrastructure environment in which to deploy the present invention . an underlying digital cellular wireless network system 100 in this environment may be a 3 . 5g network such as hsdpa / umts ( high speed downlink packet access / universal mobile telephone system ). other possible digital cellular wireless network systems would include , without limitation , all other forms of 2 . 5g ( e . g ., gprs , edge , etc . ), 3 g ( e . g ., td - scdma , cdma2000 , etc . ), 3 . 5g and future generations of packet - switched cellular wireless technologies . because the underlying digital cellular wireless network system 100 supports packet - switching capabilities , it is able to implement an ip - based network that supports tcp / ip based communications by digital picture frame 110 . additionally , the digital cellular wireless network system 100 also supports text messaging services such as sms ( short message service ) 140 . the digital cellular wireless network system 100 may also provide the digital picture frame 110 access to the internet 115 through its ip - based network capabilities . by obtaining an ip address from the underlying digital wireless network system 100 , the digital picture frame 110 is able to communicate through the digital cellular wireless network system 100 through the internet 115 and ultimately to a server 120 that hosts a digital photo management service in accordance with the present invention . in addition to communicating with the digital picture frame 110 , such a server 120 may also serve web pages to an end user using an internet connected terminal with a web browser such as 125 ( e . g ., laptop , personal computer , etc .) in order to provide access to the user &# 39 ; s personal account on the server 120 . the server 120 may also be coupled to a user photo database 130 in order to store users &# 39 ; digital photos at a centrally accessible location and an sms gateway 135 in order to send sms messages to the digital picture frame 110 . as used hereinafter , the term and reference number “ server 120 ” may be used generally to refer to the server side capabilities ( as opposed to the client side capabilities ) and therefore may include functionality resident in the database 130 and sms gateway 135 as the context requires . fig2 depicts a component architecture of the digital picture frame 110 in accordance with the present invention . like other typical digital picture frames , digital picture frame 110 comprises a hardware layer 200 that includes a digital display 205 such as an lcd display , a microprocessor 210 and ram memory 215 that are used to control photo display functionality and features , and storage memory 220 such as flash memory used to store an operating system , applications as well as the user &# 39 ; s digital photos . unlike typical digital picture frames , the hardware layer 200 of digital picture frame 110 also contains a cellular network component that enables it to receive sms messages from the digital cellular wireless network system 100 and utilize the data network portion ( e . g ., tcp / ip ) of the digital cellular wireless network system 100 to communicate with the server 120 . for example , digital picture frame 110 may include a cellular network communication component 225 that comprises a digital signal processor 230 to handle signal compression and decompression , microprocessor 235 and memory 240 components to deal with command and control signaling with cellular base stations in the network 100 and to generally coordinate cellular communication activities , and rf component 245 to handle the hundreds of fm channels used to communicate with the network 100 , an antenna 250 , and rf amplifiers 255 to handle signals in and out of the antenna . in order to receive sms messages , the frame 110 will also be allocated a unique sms number ( e . g ., assigned by a telecommunications carrier ) similar to a phone number to which sms messages can be sent by the server 120 . such an sms number may be , for example , assigned by inserting a sim card into the network communication component 225 of the frame 110 . the network communication component 225 may communicate with the operating system 260 which contains a file system sub - layer 265 . an application layer 270 on top of the operating system 260 contains those applications needed to display the photos onto the display 205 and provide the various other features of the frame 110 . for example , an application used to display photos on the digital display 205 may interact with the file system sub - layer 265 to access digital photos stored in the file system . additionally , the present invention envisions a client application 275 that resides in the application layer 270 that receives and executes instructions received from the server 120 via the network communication component 225 . this client application 275 interacts with the frame 110 at the file system layer 265 by adding or removing digital photos to or from the file system 265 . in one embodiment , the client application 275 continuously runs in the background and listens for sms messages sent from the server 120 to the digital picture frame 110 through the sms gateway 135 . in alternative embodiments , the client application 275 may register itself to receive notification from the operating system 250 that sms messages intended for it have arrived ( e . g ., similar to the “ push registry ” known in mobile device operating systems ). when such sms messages arrive , the operating system 260 then launches the client application 275 to consume the sms message . as previously discussed , the client application 275 may primarily be a passive application that interacts with the file system 265 of the digital picture frame 110 only after receiving specific instructions from the server 120 . in one embodiment , the component architecture of the server 120 and user terminal 125 may be similar to those described in u . s . patent application ser . no . 11 / 674 , 081 , filed feb . 12 , 2007 , entitled “ method and system for a hosted mobile management service architecture ” ( hereinafter “ parent application ”), which is hereby incorporated by reference ( see , e . g ., fig2 therein ). in such an embodiment , the digital picture frame 110 is treated similarly to a mobile device in the parent application and the client application 275 is treated similarly as the thin client application in the parent application . such an embodiment may be able to simultaneously support both mobile devices as described in the parent application as well as digital picture frames as described herein . however , those with ordinary skill in the art will also recognize that a “ standalone ” architecture of the server 120 may also be made just for the digital picture frame 110 without support for other mobile devices . such a standalone architecture would obviate the need for an application actions database as described in the parent application since the only functionality / application supported by client application 275 would be the manipulation of digital photos on the frame 110 ( as opposed to additional applications for music , for example , as described in the parent application ). those with ordinary skill in the art will recognize that the hardware and logical components set forth in fig2 are merely exemplary and that other components and configurations that provide substantially similar functionality to that of the logical components in fig2 can be used consistent with the spirit and scope of the invention . for example , while portions of the network communication component 220 are set logically apart from the other parts of the digital frame 110 in fig2 , those with ordinary skill in the art will recognize that such separation is for logical discussion purposes only and that actual code implementations of the foregoing may not necessarily utilize such logical distinctions . for example , rather than having a microprocessor 210 and ram memory 215 and a separate microprocessor 235 and memory 240 components in network communication component 220 , a single microprocessor and ram memory may support general digital frame photo display functionality as well as wireless network functionality . similarly , those with ordinary in the art will recognize that various components may be implemented either in hardware or software depending upon the embodiment . fig3 depicts one embodiment of a web page that may be served by a web server of the server 120 to a web browser at the user terminal 125 to provide the user the ability to view digital photos accessible by the server 120 and on the digital picture frame 110 . the selection panel 305 of web browser view 300 provides a view of all the digital photos that the user has stored in the user photo database 130 ( otherwise known as “ main library ” in the navigation panel 310 ). the “ picture frame ” selection 315 of the navigational panel 310 has been highlighted and therefore the main panel 320 of the web browser view 300 displays all the photos that also reside on digital picture frame 110 . such photos may also be managed and indicated by the frame checkbox 325 . in the embodiment of fig3 , a third party online photo site is also integrated into the web page at 330 such that the photos stored at the online photo provider are accessible ( e . g ., via a web service protocol such as rest , for example ) and displayed as the main library . in such an embodiment , server 120 may not need a user photo database 130 to store photos ( i . e ., server 120 simply accesses photos stored at the user &# 39 ; s third party online photo site ). the number assigned to digital picture frame 110 for receiving sms messages or other “ out of band ” messages through the cellular network 100 is displayed at 335 . to manage his digital photos , the user may easily drag and drop digital photos displayed in selection panel 305 into libraries , albums or the trash icon as set forth in navigational panel 315 . alternatively , the user may drag and drop digital photos from the main panel 320 into the icons in the selection panel 305 or may simply select the frame checkboxes such as 325 to add or remove digital photos to and from digital picture frame 110 . in the embodiment of fig3 , changes to the digital photos made by the user on the web browser 300 are captured and tracked in the aggregate by the server 120 until the user completes his session and presses the “ update frame ” button 340 , whereby the server 120 communicates with the client application 275 to propagate the additions , removals and modifications of digital photos and albums to the digital picture frame 110 . in alternative embodiments , each separate change made by the user in real time may trigger a separate communication between the server 120 and the client application 275 to propagate the change to the digital picture frame 110 . those with ordinary skill in the art will recognize that fig3 is merely exemplary of numerous ways to display digital photos stored on the server 120 and digital picture frame 110 that remain consistent with the spirit and scope of the present invention . for example , while fig3 only depicts a standalone user interface solely for communication with digital picture frame 110 , those with ordinary skill in the art will recognize that other types of user data can be similarly stored , managed and viewed including videos , ringtones , images , games , wallpaper and pim data . for example , an icon similar to 315 could be added to the selection panel 340 of photo user interface of fig3 in the parent application to provide access to digital picture frame 110 through the more general mobile device hosted mobile management platform detailed in the parent application . fig4 depicts a communication protocol among the client application 275 in digital picture frame 110 , server 120 , and the user during a photo management session conducted by the user through a web browser at the user terminal 125 . initially , the user logs into his user account on the server &# 39 ; s 120 web site though the web browser 250 ( step 400 ). due to the user &# 39 ; s prior registration of the frame 110 with the server 120 ( as further detailed below ), server 120 , by accessing the user &# 39 ; s account data , may have knowledge of the cellular or sms number assigned to the digital picture frame 110 ( e . g ., in order to receive sms messages ). server 120 is then able to serve web pages to the user &# 39 ; s web browser that reflect a current view of what digital photos are accessible through the server ( e . g ., through a third party online photo site such as 330 in fig3 or as saved in user photo database 130 ) as well as what photos are currently residing on the digital picture frame 110 ( steps 405 and 410 ). while the user makes various modifications to the digital photos through the web pages , for example , as previously discussed in conjunction with fig3 ( step 415 ), the server 120 records the number and type of actions ( e . g ., add photo , remove photo , add album , remove album , add photo to album , remove photo from album , etc .) needed to be performed on the digital picture frame 110 ( step 420 ). once the user has completed his session on the web page , the server 120 generates an aggregate list of file system operation instructions needed for each action made by the user during the session ( step 425 ). depending upon the particular embodiment , server 120 initiates communication with the digital picture frame 110 by transmitting an sms message via the sms gateway 135 to the sms number on which the client application 275 is listening ( step 430 ). the sms message may include the ip address of the server 120 and a session identifier ( e . g ., session number ) used by the server 120 to keep track of the particular communication session between it and the client application 275 . as previously discussed , depending upon the embodiment , for example , upon receiving the sms message , the client application 275 may either be launched by the digital picture frame &# 39 ; s 110 push registry or may directly receive the sms message as a continually running background application that listens for messages on the specified sms port . the client application 275 may then extract the ip address of the server 120 from the sms message and establish a tcp connection with the server 120 by connecting to the ip address and identifying itself through the session identifier ( step 435 ). those with ordinary skill in the art will recognize that other types of network communication protocols other than tcp may be used without departing from the spirit of the invention including http and other ip based network protocols . similarly , out of band channels other than sms may be utilized in step 430 . once the tcp connection is established , the server 120 may transmit to the client application 275 the file system operation instructions ( and accompanying data for photos , etc .) to be performed by the client application 275 on the digital picture frame &# 39 ; s file system 265 in order to reflect the changes made by the user to the web browser 250 ( steps 440 to 445 ). those with ordinary skill in the art will recognize other exemplary communication protocols among the frame 110 , server 120 , and user that remain consistent with the spirit and scope of the present invention . for example , an initial “ updating handshake ” between server 120 and frame 110 similar to that detailed in fig4 ( steps 405 to 430 ) in the parent application can be incorporated into the communication protocol described herein in order to provide the user &# 39 ; s web browser with an updated view of modifications to the photos made directly through the interface of the frame 110 itself . similarly , in some embodiments , client application 275 residing on the frame 110 may be capable of communicating with the operating system 260 to dynamically control and change the current display status of the frame 110 ( i . e ., as the user may similar do by navigating the user interface of the frame 110 through buttons and menus ). in such embodiments , server 120 may be able to transmit more complex instructions ( i . e ., other than just file system operations instructions ) to the frame 110 in step 440 and the client application 275 may then be able to control the operation of the frame 110 in a richer fashion than adding and deleting photos and albums to the file system 265 ( e . g ., edit slide show characteristics , change current album display selection , etc .). similar to fig6 of the parent application , prior to using the services offered by server 120 , a user possessing digital picture frame 110 may need to register with the server 120 . in particular , the sms number of the frame may be registered by the user such that the server 120 can send the initiating sms message in step 430 to the frame 110 . in one particular scenario , for example , a purchaser of the frame 110 may desire to send the frame to a relative as a gift but maintain the ability to remotely manipulate the photos through the purchaser &# 39 ; s own account on server 120 . the sms number of the frame may be provided as a slip included in the packaging of the frame or as a sticker or label on the back of the frame . in other embodiments , the purchaser may be able to purchase a sim card containing the sms number , register the sms number of the sim card with server 120 prior to sending the sim card together with the frame as the gift . while the present invention has been primarily described photos as the main media that are managed by the server 120 and displayed by the frame 110 , those of ordinary skill in the art will recognize that alternative media and embodiments may be implemented without departing from the spirit and scope of the claimed invention . as previously discussed , other forms of media and data such as video and music may also be managed on the frame 110 through a web - enabled server in accordance with the techniques described herein . similarly , while the present invention has been focused on digital picture frames , those with ordinary skill in the art will recognize the system and methods disclosed herein can also be applied to other network devices that have limited user interfaces , similar to digital picture frames . for example , a similar system may be implemented with respect to a car audio system in order to transfer music onto such a system . those of ordinary skill in the art will additionally recognize that the control logic and data stored and used by the various software components as described in the foregoing specification are merely illustrative and may be redistributed various other software components and databases in alternative but functionally equivalent designs , including the removal of certain software components and / or databases , without departing from the scope or spirit of the described embodiments . for example and without limitation , the present invention has been described using tcp / ip based connections , but those of ordinary skill in the art will recognize that other packet based protocols , either on layered on top of tcp / ip , such http , or as an alternative to tcp / ip may also be used to establish data transfer sessions . terminology used in the foregoing description is for the purpose of describing the particular versions or embodiments only , and is not intended to limit the scope of the present invention which will be limited only by the appended claims . as used herein and in the appended claims , the singular forms “ a ,” “ an ,” and “ the ” include plural references unless the context clearly dictates otherwise . similarly , the words “ for example ,” “ such as ,” “ include ,” “ includes ” and “ including ” when used herein shall be deemed in each case to be followed by the words “ without limitation .” unless defined otherwise herein , all technical and scientific terms used herein have the same meanings as commonly understood by one of ordinary skill in the art . all publications mentioned herein are incorporated by reference . nothing herein is to be construed as an admission that the embodiments disclosed herein are not entitled to antedate such disclosure by virtue of prior invention . thus , various modifications , additions and substitutions and the like can be made without departing from the spirit of the invention and these are therefore considered to be within the scope of the invention as defined in the following claims .	6
fig1 illustrates an optical system 100 , such as a projection system , that includes a wavelength dependent aperture stop 110 , in accordance with an embodiment of the present invention . optical system 100 includes a light source 102 that produces polychromatic light along optical axis 103 . the light source 102 may be a number of light emitting diodes ( leds ), as illustrated in fig1 , which emit , e . g ., red , green and blue light , which are combined with appropriate optics ( not shown ). alternatively , a single led that emits white light , e . g ., through phosphor conversion , may be used . other light sources may be used with the present invention if desired . as illustrated in fig1 , the light from the light source 102 is transmitted through ( or reflected from ) an object 101 , such as a micro - display , where the projection system optics consisting of lenses 104 , aperture 110 and lenses 106 , image 101 image of the object 101 on the screen or viewing plane 108 . aperture 110 is positioned at the aperture stop of the optical system consisting of projection optics 104 and 106 . it should be understood that the optical system 100 shown in fig1 is one example of an optical system with which the wavelength dependent aperture stop 110 may be used . except for the wavelength dependent aperture stop 110 , the general operation of an optical system , such as that shown in fig1 , is readily understood in the art . if desired , the wavelength dependent aperture stop 110 may be used with other optical systems as would be understood by those skilled in the art in light of the present disclosure . the use of the wavelength dependent aperture stop 110 enables the diameter of the aperture through which light is transmitted to vary as a function of wavelength . thus , with the focal length defined by the lens systems and the use of different diameter apertures for different wavelengths , the optical system 100 has different f - stops for different wavelengths of light . by way of example , a smaller f - stop may be used for the wavelengths of light for which a higher throughput is desired , e . g ., where the wavelengths are produced by a weak light source or where additional brightness is desired for the wavelengths . consequently , larger numerical aperture rays pass through the optical system , increasing the etendue of the system . as is known in the art , etendue is an optical extent of the light passing through an optical system ( proportional to the product of the image area and the numerical aperture ) and for an etendue limiting optical system , the f # ( inversely proportional to the numerical aperture stop ) is an indication of the limiting etendue , or the amount of light that can be handled by an optical system ; a larger etendue generally corresponds to a brighter optical system . thus , according to an embodiment of the present invention , the f - stop , i . e ., throughput , for different wavelengths of light , or the etendue of the optical system can be optimized for different wavelengths , e . g ., based on the different power transfer requirements . moreover , based on the numerical aperture for each wavelength , the new color dependent error functions can be used to optimize the optical system in terms of image quality and aberrations . fig2 a and 2b illustrate a wavelength dependent aperture stop 110 , in accordance with an embodiment of the present invention , in a plan view and a cross - sectional view ( along lines a - a of fig2 a ), respectively . aperture stop 110 includes a transparent plate 112 that is covered with two ring shaped transmission filters 114 and 116 and an opaque film 118 , where the filters 114 and 116 , e . g ., thin film coatings that are appropriately deposited on plate 112 . the inner diameter of transmission filter 114 defines a circular aperture 115 through which all wavelengths of light may pass . the inner diameter of transmission filter 116 defines a circular aperture 117 and the inner diameter of opaque film 118 defines a circular aperture 119 . the circular apertures 115 , 117 , and 119 are configured to be concentric . in operation , aperture 115 ( in fig2 a and 2b ) permits all desired wavelengths of light to pass through , while ring shaped transmission filters 114 and 116 permit only specific ranges of wavelengths to pass through and opaque member 118 does not permit any light to pass through . it should be understood that other wavelength dependent aperture constructions may be used if desired . by way of example , other embodiments may have multiple wavelength dependent apertures where the filters are more narrow band filters for specific wavelength ranges of the light . in another embodiment , the aperture boundaries could present a more gradual variation of the filter transmission over the wavelength , e . g ., using a varying transmission filter , rather than an abrupt boundary between different wavelength transmission functions . for example , as shown in fig3 a , an aperture stop 200 may include a varying transmission filter 202 that provides a gradually diminishing aperture diameter that is dependent on the wavelength of the light and an opaque member 204 that passes no light . moreover , the wavelength dependent aperture stop may be produced using alternative configurations . for example , fig3 b illustrates , in cross - sectional view , an aperture stop 210 that is formed with overlapping transmission filters 214 , 216 and an opaque member 218 , thereby obviating the need for a transparent plate 102 and providing at least one aperture opening with a transmission function that is a product of two or more overlapping color filters . the transmission filters 214 , 216 , and opaque member may partially or fully overlap . in one embodiment , transmission filters 214 , 216 and opaque member 218 have concentric circular apertures 215 , 217 , and 219 , respectively . with such as configuration , transmission filters 214 and 216 will have ring shapes resulting in the plan view shown in fig2 a . other possible configurations to produce wavelength dependent aperture stop will be clear to those skilled in the art in light of the present disclosure . fig4 graphically illustrates the operation of wavelength dependent aperture stop 110 , in which transmission filter 114 blocks blue light and transmit both green and red light , while transmission filter 116 blocks red and blue light and pass only green light , and opaque element 118 blocks the red , green and blue light . accordingly , green light will pass through aperture 115 and transmission filters 114 and 116 and , therefore , has an f - stop defined by the diameter of aperture 119 in the opaque film 118 . red light will only pass through aperture 115 and only transmission filter 114 and , therefore , has an f - stop defined by the diameter of aperture 117 in transmission filter 116 . blue light will pass through only aperture 115 and , therefore , has an f - stop defined by diameter of aperture 115 . in such an embodiment , green light has a smaller f - stop , and therefore greater throughput , than red or blue light , while red light has a smaller f - stop than blue light . the particular design of aperture stop 110 may depend on the requirement of the optical system , e . g ., the power transfer requirements of the light sources and / or the required chromatic final image quality . thus , transmission filters 114 and 116 may transmit any desired range of wavelengths . moreover , if desired , fewer or additional transmission filters may be used with the wavelength dependent aperture stop . for example , only a single transmission filter may be used , e . g ., transmission filter 114 , with the opaque element . in such a configuration , the single transmission filter may transmit one range of wavelengths , e . g ., green light or green and red light , while the remaining wavelengths of light are transmitted only through the unfiltered aperture , i . e ., aperture 115 . in another embodiment , additional transmission filters may be used for smaller ranges of wavelengths , e . g ., additional transmission filters may be used to provide different sized apertures for different colors , such as blue , cyan , green , amber and red . although the present invention is illustrated in connection with specific embodiments for instructional purposes , the present invention is not limited thereto . various adaptations and modifications may be made without departing from the scope of the invention . therefore , the spirit and scope of the appended claims should not be limited to the foregoing description .	6
the alkyl substituted poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ) according to the present invention can be obtained by reacting an alkyl substituted 5 , 5 &# 39 ;- dihalogenated 2 , 2 &# 39 ;- bipyridine , with an equimolar amount or excess of a zero - valent nickel compound added thereto in an organic solvent , followed by dehalogenation . a preferable reaction temperature ranges between room temperature and boiling point of the solvent . the reaction completes within about 1 - 48 hours . as the above organic solvent , toluene , tetrahydrofuran or the like can be employed . the zero - valent nickel compound withdraws halogens from halogenated aromatic compounds and causes a coupling reaction between the aromatic groups [ for example , see &# 34 ; synthesis &# 34 ;, p . 736 ( 1984 )]. this reaction is represented by the following equation ( 18 ): wherein ar and ar &# 39 ; represent an aromatic group , x represents a halogen atom , l represents a neutral ligand and hence nil m represents a zero - valent nickel compound . accordingly , if an aromatic compound having two halogens in the molecule , such as alkyl substituted 5 , 5 &# 39 ;- dihalogenated - 2 , 2 &# 39 ;- bipyridine , is reacted with an equimolar or excess of a zero - valent nickel compound , the polymer of the present invention can be obtained by the dehalogenation polycondensation reaction shown in the following equations ( 19 ) and ( 20 ): ## str13 ## represents an alkyl substituted 5 , 5 &# 39 ;- dihalogenated - 2 , 2 &# 39 ;- bipyridine , r and r &# 39 ; are h or an alkyl group having not less than 1 carbon atom , however , at least one of r and r &# 39 ; represents a long chain alkyl group having not less than 3 carbon atoms and , where x is a halogen . in the above - described reaction , as the zero - valent nickel compound , those synthesized in a reaction system , so to speak , in situ , immediately before conducting a polymerization reaction can be used directly . alternatively , preliminarily synthesized and isolated ones also can be used . such a zero - valent nickel compound is , for example , a nickel complex produced by a reduction reaction or a ligand interchange reaction in the presence of a neutral ligand . as a typical example of the neutral ligand , mention may be made of 1 , 5 - cyclooctadiene , 2 , 2 &# 39 ;- bipyridine , triphenylphosphine or the like . alternatively , the alkyl substituted poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ) can be obtained by another process wherein the alkyl substituted 5 , 5 &# 39 ;- dihalogenated - 2 , 2 &# 39 ;- bipyridine shown in the above chemical formula ( 17 ) undergoes a dehalogenation reaction when it is subjected to an electrochemical reduction reaction in the presence of a divalent nickel compound . namely , when a divalent nickel compound is electrochemically reduced in an electrolytic cell , a zero - valent nickel compound is produced by the reaction shown in the following chemical formula ( 22 ). accordingly , when an aromatic compound having two halogens in the molecule , namely , an alkyl substituted 5 , 5 &# 39 ;- dihalogeanted - 2 , 2 &# 39 ;- bipyridine is electrochemically reduced in the presence of a divalent nickel compound , the polymer of this invention can be obtained according to the reaction shown in the chemical formula ( 22 ) and the reactions shown in the following formulae ( 23 )-( 25 ) consequently taking place , wherein the ni . sup .) l m producing in the reaction system is involved . ## str14 ## represents an alkyl substituted 5 , 5 &# 39 ;- dihalogenated - 2 , 2 &# 39 ;- bipyridine , r and r &# 39 ; are h or an alkyl group having not less than 1 carbon atom , however , at least one of r and r &# 39 ; represents a long chain alkyl group having not less than 3 carbon atoms and , where x is a halogen . the electrolysis may be conducted generally in the following conditions : namely , polar solvents , such as n , n - dimethylformamide and acetonitrile are , used as the solvent salts , such as tetraethylammonium perchlorate and tetraethylammonium tetrafluoroborate as , the supporting electrolytic salt are dissolved to prepare an electrolyte and electrodes , such as a platinum electrode , ito transparent electrode and graphite electrode are employed as the electrode . the alkyl substituted 5 , 5 &# 39 ;- dihalogenated - 2 , 2 &# 39 ;- bipyridine and divalent nickel complex are dissolved in the electrolyte and the elector - chemical reduction is conducted at a reduction potential of the divalent nickel complex , for example , at - 1 . 7 v vs ag / ag + in the case of tris ( 2 , 2 - bipyridine ) nickel ( iii ) salt . moreover , in another method , alkyl substituted poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ) having the chemical formula ( 8 ) may be manufactured by subjecting alkyl substituted 5 , 5 &# 39 ;- dihalogeanted - 2 , 2 &# 39 ;- bipyridine to a dehalogenation polycondensation reaction by using magnesium or zinc in the presence of a divalent nickel compound . in other words , zero - valent nickel compound may be prepared by a reducing reaction with magnesium or zinc and the polymerization reaction is eventually expressed as shown in the formula ( 27 ). ## str15 ## therefore , the polymer having the chemical formula 8 can be obtained by reducing an alkyl substituted 5 , 5 &# 39 ;- dihalogenated - 2 , 2 &# 39 ;- bipyridine , with an equimolar amount or excess of a mg or zn in the presence of a divalent nickel compound , as shown in the formula ( 22 ) and followed by the formulae ( 19 )-( 21 ). the above nickel compounds which have been synthesized and isolated prior to the polymerization reaction can be used . alternatively , those synthesized from nickel or a nickel compound in an electrolytic cell can be used directly as they are in the cell . as such a nickel compound , mention may be made of , for example , tris ( 2 , 2 &# 39 ;- bipyridine ) nickel ( ii ) dibromide [ ni ( bpy ) 3 ] br 2 , dibromobis ( triphenylphosphine ) nickel ( ii ) [ ni ( pph 3 ) 2 ] br 2 or the like . there is no limit to these polymerization reaction conditions , however , from a point of raising a yield and molecular weight , it is preferable that polymerization is carried out in substantial no water and no oxygen conditions . the present invention will be explained more concretely and detailedly by way of example hereinafter . next , it will be explained the metal coordinating function of the polymer of the present invention . in general , pyridine and 2 , 2 &# 39 ;- bipyridine are chelate ligands that can be coordinated with a metal element via a pair of unpaired electrons of nitrogen in the ring . coordinating ability and stability of coordinated product of 2 , 2 &# 39 ;- bipyridine are greater than those of pyridine . polyalkylpyridine includes a head - to - tail unit and head - to - head ( tail - to - tail ) unit , and mainly consisted of head - to - tail unit . this means that the polyalkylpyridine is a ligand of the pyridine - type and therefore , the coordinating ability with a metal ion is generally low . on the other hand , alkyl substituted poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ) consists only of head - to - head ( tail - to - tail ) unit and is classified into a bipyridine - type ligand . accordingly , this polymer has a coordinating ability with a medallion , etc . and can perform a function as a polymer ligand to a metal element . the polymer of the present invention coordinated with a metal element is especially useful as a conductive polymer catalyst . 0 . 99 g of a bis ( 1 , 5 - cyclooctadiene ) nickel complex ( ni ( cod ) 2 ) ( 3 . 6 mmol ) was dissolved in 30 ml of n , n - dimethylformamide ( hereinafter referred to as &# 34 ; dmf &# 34 ;), and 0 . 56 g of 2 , 2 &# 39 ;- bipyridine ( bpy ) ( 3 . 6 mmol ) and 0 . 39 g of 1 , 5 - cyclooctadiene ( cod ) ( 3 . 6 mmol ) were added thereto . to this solution was dropped 1 . 45 g of 6 , 6 &# 39 ;- dihexyl - 5 , 5 &# 39 ;- dibromo - 2 , 2 &# 39 ;- bipyridine ( 3 . 0 mol ) dissolved in 20 ml of a dmf solution , thereafter reacted at a reaction temperature of 60 ° c . for 49 hours , and polymerized . as a polymerization proceeds , there was produced an ocher - colored precipitate of an alkyl substituted poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ) polymer . after completion of the reaction , the precipitate was filtered and recovered , and washed with the use of the following materials ( a ) to ( e ) several times , and the polymer was refined . ( a ) ammonia water ( 29 %), ( b ) methyl alcohol , ( c ) a warm aqueous solution of sodium ethylenediaminetetraacetic acid ( prepared to ph = 3 ), ( d ) warm water and ( e ) methyl alcohol . after washed , the precipitate was vacuum - dried to obtain 0 . 40 g of ocher - colored powder of alkyl substituted poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ). a yield of the polymer was 80 %. the infrared absorption spectrum of this polymer is shown in fig1 . there is observed absorption derived from c -- h stretching vibration of a pyridine ring at 3030 cm - 1 , c -- h stretching vibration by a side chain hexyl group at 2850 - 2950 cm - 1 , skeletal vibration of a pyridine ring and deformation vibration of a side chain methylene group at 1580 , 1530 , 1460 and 1420 cm - 1 , and c -- h out - of - plane deformation vibration of a pyridine ring at 830 cm - 1 . moreover , fig2 shows 1 h - nmr in cdcl 3 of the polymer . there is observed absorption derived from a side chain hexyl group at δ = 0 . 8 - 3 . 0 ppm ( inside standard : tetramethylsilane ) and hydrogen of a pyridine ring at δ = 7 . 6 - 8 . 5 ppm . an area ratio of respective peaks was about 13 : 2 . moreover , element analysis values of the obtained polymer were 81 . 0 % of carbon , 8 . 8 % of hydrogen , 8 . 7 % of nitrogen and 0 . 0 % of bromine . the result of the infrared absorption spectrum 1 h - nmr and element analysis supports that the polymer has the following structure . ## str16 ## where , n shows a degree of polymerization . poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ) was only soluble in formic acid as an organic solvent , while the above polymer has a long - chain alkyl group as a side chain , so that it was soluble in not only formic acid but also general organic solvents shown below . that is , the polymer was soluble in chloroform ( solubility of about 300 mg / ml ), tetrahydrofuran ( thf ) ( solubility of about 300 mg / ml ), benzene ( solubility of about 300 mg / ml ), toluene ( solubility of about 300 mg / ml ), cresol and n - methylpyrrolidone ( nmp ), and partly soluble in diethyl ether . a cast film was tried to prepare from a formic acid solution of poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ), but a strong film could not be obtained , while a cast film was prepared from said solution of the present polymer , and a strong and ocher - colored free standing film was obtained . when a molecular weight of this polymer was measured in a formic acid solution by a light scattering method , a weight - average molecular weight was 37000 ( degree of polymerization 110 ) which was higher than the weight - average molecular weight 3200 ( degree of polymerization 21 ) of poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ). moreover , in case of measuring the molecular weight , even when a chloroform solution was used as solvent instead of formic acid , the weight - average molecular weight observed in chloroform was substantially the same as that observed in formic acid . the ultraviolet visible absorption spectrum of said polymer showed a sharp π - π * transition absorption peak at about 350 nm in a formic acid solution and at about 320 nm in either one of a chloroform , thf , benzene , toluene or nmp solution . moreover , said polymer showed a high thermal stability . as a result of thermogravimetric analysis under nitrogen , weight reduction was observed from the proximity of 300 ° c . and was about 45 % at 900 ° c . a chloroform solution of the poly ( 6 , 6 &# 39 ;- dihexyl - 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ) obtained in example 1 was applied onto a platinum plate , and chloroform was removed to prepare a film of the polymer . with respect to this polymer film , cyclic voltammogram was measured in an acetonitrile solution containing 0 . 1 mol / l of [( c 2 h 5 ) 4 n ][ clo 4 ]. as a result , it was found in the polymer that a cation is doped ( n - type doping ) for ag / ag + at about - 2 . 5 v , and developed at about - 2 . 4 v ( potential for ag / ag + ) in sweeping in the reverse direction . in case of doping , the color of the polymer film was changed from ocher to deep red orange , and in case of dedoping , discoloration went by contraries . thus , the present polymer is possible to be electrochemically reduced , that is , electrochemical n - type doping , and together with doping , electrochromic property was shown . it is shown from the above that the present polymer represents n - type conductive character and is usable as battery electrode material and electrochromic element material . a formic acid solution and a chloroform solution of poly ( 6 , 6 &# 39 ;- dihexyl - 2 , 2 &# 39 ;- bipydine - 5 , 5 &# 39 ;- diyl ) obtained in the example 1 were prepared . the polymer was contained in each solution in a concentration of 2 . 0 × 10 - 5 mol / l of its unit structure . fluorescence spectra were measured about the solutions at an excitation wavelength of 310 nm . as a result , luminescence was observed at 420 nm in the formic acid solution and at 360 nm in the chloroform solution . as described above , the polymer is capable of radiating fluorescence . therefore , the polymer may be utilized as a material for an electroluminescence device . 15 mg of alkyl substituted poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ) obtained in example 1 was added to 5 ml of toluene solution of 10 mg of ni ( cod ) 2 , and the resulting solution was subjected to a reaction at 30 ° c . to obtain a nickel complex . before the addition of alkyl substituted poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ), the color of the toluene solution was yellow and after the addition , color of the solution changed from yellow to dark green as time passed . also , the color change of the solution was examined by a uv - visible spectrophotometer and the absorption peak was observed around 600 - 650 nm due to the formation of nickel complex . further , it was found that the absorption peak at 600 - 650 nm gradually increased with the reaction time . with respect to the reactions with other transition - metal compounds , it is observed the color change characteristic of complex formation when a complex was formed . accordingly , it is understood that the polymer of the present invention is easily coordinated with a metal element and functions as a polymer ligand . an alkyl substituted poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ) ( 30 mg ) obtained in example 1 was reacted with the material having the ability of quaternize the pyridine ring ( for example , ( ch 3 o ) 2 so 2 , ch 3 i and the like ) to obtain the quaternized material . the obtained polymer was complete soluble to the polar solvent such as methanol , ethanol and the like . 2 . 4 g of 6 , 6 &# 39 ;- dihexyl - 5 , 5 &# 39 ;- dibromo - 2 , 2 &# 39 ;- bipyridine ( 5 . 0 mmol ) was dissolved into 15 ml of tetrahydrofuran ( thf ), 0 . 13 g of a piece of metal magnesium ( 5 . 5 mmol ) was added into the resulting solution . after the solution was heated and refluxed for 10 hours , dichlor [ 1 , 2 - bis ( diphenylphosphino ) ethane ] nickel ( ii ) nicl 2 ( dpe ) 5 mg , 0 . 01 mmol ) was added into the heated solution , which was then heated and refluxed for 13 hours . after the reaction was completed , the reaction solution was poured into diluted hydrochloric acid containing ices , the resulting mixture was neutralized by adding water containing na 2 co 3 . the polymer was recovered by filtration and was washed with water and ether , and further washed with warm water solution containing ethylenediaminetetraacetic acid disodium salt . the resulting polymer was then vacuum dried and 0 . 50 g of alkyl substituted poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 &# 39 ;- diyl ) was obtained . the yield of the polymer was 60 %. 2 . 4 g of 6 , 6 &# 39 ;- dihexyl - 5 , 5 &# 39 ;- dibromo - 2 , 2 &# 39 ;- bipyridine ( 5 . 0 mmol ) was dissolved into 5 ml of hexamethylphosphoric triamide ( hmpa ), a powder of zinc ( 0 . 98 g , 15 mmol ) was added into the resulting solution which was then heated to 100 ° c . then , 60 mg of dibromo [ 1 , 2 - bis ( diphenylphosphino ) ethane ] nickel ( ii ) nibr 2 ( dpe ) 0 . 1 mmol ) was added into the heated solution and reacted at 140 ° c . for 17 hours . after the reaction was completed , the reaction solution was poured into diluted hydrochloric acid containing ices , the resulting mixture was alkalified by adding ammonia water and the polymer was recovered by filtration . the above polymer was washed with methyl alcohol , water solution containing ethylenediamine tetraacetic acid disodium salt and then vacuum dried . 0 . 40 g of alkyl substituted poly ( 2 , 2 &# 39 ;- bipydine - 5 , 5 &# 39 ;- diyl ) was obtained . 0 . 3 mmol of 6 , 6 &# 39 ;- dihexyl - 5 , 5 &# 39 ;- dibromo - 2 , 2 &# 39 ;- bipyridine , 0 . 15 mmol of tris ( 2 , 2 &# 39 ;- bipyridine ) nickel ( ii ) bromide ([ ni ( bpy ) 3 ] br 2 ) and 3 . 75 mmol of tetraethylammonium perchrolate ([( c 2 h 5 ) 4 n ][ clo 4 ]) were dissolved into n , n - dimethylformamide to prepare an electrolytic solution . this solution was filled into an electrolytic bath in which a platinum plate ( 1 . 33 2 cm = 2 cm 2 ) was arranged as a cathode , a platinum plate ( 1 . 33 2 cm = 2 cm 2 ) was arranged as a anode and a silver electrode was arranged as a reference electrode . then , an electrolytic polymerization was carried out at a polymerization temperature of 60 ° c ., at an electrolytic potential of - 1 . 7 v ( the potential was for ag / ag + which is same in the following description ) and for 16 hours to provide a film consisting of a ocher - colored polymer on the anode . this crude polymer was collected and purified using the following substances ( a ) to ( e ) by washing the polymer with the substances ( a ) to ( e ) in the following order , the crude polymer was washed several times by each substance . ( a ) water containing ammonia ( 29 %), ( b ) methyl alcohol , ( c ) warm water solution containing ethylene - diaminetetraacetic acid disodium salt ( its ph was 3 ), ( d ), warm water , ( e ) methyl alcohol . after the above washing step , the polymer was vacuum dried and ocher - colored alkyl substituted poly ( 2 , 2 &# 39 ;- bipyridine - 5 , 5 - diyl ) was obtained .	2
referring to fig1 , a covering 10 for an architectural opening is shown including a headrail 12 having end caps 14 and 16 at opposite ends of the headrail and with a roller 18 ( fig3 b ) interiorly of the headrail that is horizontally disposed and supports a top edge of a flexible fabric shade material 20 having a ballast 22 along the lower edge . the fabric material can be any flexible material adapted to be rolled around a roller , but the material illustrated has a backing sheet 24 to which is attached a plurality of horizontally disposed vertically spaced loops of material 26 simulating a roman shade . at the right end of the headrail ( even though it could be anywhere along the length of the headrail ), a remote sensor 28 , which might be rf or ir for operating a reversible motor 30 ( fig4 ) carried within the headrail from a remote location , is seen incorporated into the headrail . fig2 shows the drive system for the present invention which is mounted on the end cap 16 at the right end of the headrail as seen in fig1 with the end cap having an inwardly directed mounting shaft 32 seen in fig3 a with a mounting ring 34 on its distal end . the mounting ring has a plurality of radiating longitudinally extending fins 36 and diametrically opposed catch tabs 38 which are beveled for a purpose to be described hereafter . a mounting hub 40 with longitudinally - extending radiating ribs 42 and an end plate 44 is rotatably seated on the mounting shaft for a purpose to be described hereafter . the drive unit , as seen in fig3 a , includes a two - piece housing 46 having identical components 46 a and 46 b which might be made of a slightly flexible but substantially rigid plastic material that when assembled is substantially cylindrical in configuration and defines an internal cylindrical cavity 48 ( fig6 a ). the end of the housing adjacent to the right end cap 16 has diametrically opposed longitudinally extending flexible arms 50 having rectangular holes 52 therethrough that can be slid over the beveled catch tabs 38 until the tabs project into the holes of the flexible arms so that the housing 46 is releasably secured to the mounting ring 34 and prevented from rotation by receipt of the catch tabs in the holes of the flexible arms . releasable catches 54 are also provided in surfaces of the two components 46 a and 46 b of the housing and fasteners 56 can further be used to positively secure the two components of the housing together . projecting from the distal end of the housing 46 is a drive shaft 58 ( fig4 ) which is operatively connected to a drive disk or coupler 60 which is reversibly rotatable by the reversible motor 30 and a gear - reduction unit 62 of which the drive shaft forms a part . the motor / gear - reduction unit is positioned horizontally within the housing as possibly seen best in fig4 with the reversible motor being axially aligned with the gear - reduction unit . the drive shaft 58 can be seen to be of non - circular cross - section . three longitudinally - extending pins 64 are also circumferentially spaced around the drive shaft at the distal end of the gear - reduction unit with the pins serving a function to be described hereafter . at opposite ends of the motor / gear - reduction unit 30 / 62 , as best seen in fig4 , 6 a and 6 b , front 66 and rear 68 motor mounts or bushings are provided . the front motor mount or bushing is made of a resilient material that is relatively soft in comparison to the motor / gear - reduction unit and further is of generally circular transverse cross - section with the diameter of the cross - section being slightly greater than the diameter of the motor / gear - reduction unit . the outer diameter of the front motor mount is substantially commensurate with the diameter of the internal cylindrical cavity 48 of the housing 46 when it is assembled so that the housing circumferentially engages the resilient front motor mount and is thereby maintained in a slightly spaced relationship from the motor / gear - reduction unit . the front motor mount preferably has a durometer rating in the range of 50 a to 70 a with a preferred rating of 64 a . a motor rotated timing pin 70 extends axially from the opposite or rear end of the motor / gear - reduction unit 30 / 62 from the drive shaft 58 and passes through the rear motor mount 68 . the motor / gear - reduction unit has an axial substantially oblong , non - circular extension 72 supported in the rear motor mount so that the motor / gear - reduction unit is supported at this end by the rear motor mount and at the opposite end by the three circumferentially spaced longitudinally extending pins 64 , which support the front motor mount 66 . the rear motor mount 68 is a two - piece motor mount having an internal hard and rigid component 73 and an external relatively soft component 75 . the hard component includes a main body 77 having a substantially ovular or otherwise non - circular recess 79 in a front surface thereof which correlates in size and cross - sectional shape to the axial extension 72 . at the top and bottom of the main body are identical diametrically opposed fingers 81 of generally trapezoidal cross - section having a rearwardly opening seat 83 also of generally trapezoidal cross section adapted to receive and be keyed to the relatively soft component of the rear motor mount as will be described hereafter . the hard component is thereby received on the non - circular axial extension 72 of the motor / gear - reduction unit so that it is nonrotatable relative thereto . the relatively soft component 75 of the rear motor mount 68 is one piece having an outer partially segmented substantially cylindrical wall 85 with the segments of the wall being diametrically opposed and forming a gap 87 therebetween adapted to slidably receive the hard component 73 . in order to key the hard inner component to the relatively soft outer component , each segment of the outer component has an inwardly directed rib 89 of substantially trapezoidal transverse cross - section , which defines a generally v - shaped slot 91 on opposite sides of the rib so that the rib can be received in a corresponding rearwardly opening seat 83 of the hard inner component . in this manner , the hard component can be slid into the open left end of the outer component until a plate 93 at the end of each substantially trapezoidal seat engages the end of the outer component which positively positions the hard component relative to and within the outer component . as can also be appreciated , the relatively soft outer component also has a longitudinally - extending groove 95 in the top and bottom surface with those grooves receiving inwardly directed lugs 97 ( fig4 , 6 b and 10 ) formed on the inner surface along the longitudinal top and bottom center of the upper and lower housing components 46 a and 46 b respectively so that when the outer component of the rear motor mount is seated within the housing 46 , the entire rear motor mount is prevented from rotating relative to the motor / gear - reduction unit . the outer segmented cylindrical wall 85 of the outer component is also divided into two axially related half segments 85 a and 85 b with the rear segment 85 b being of slightly smaller diameter than the front segment to assist in mounting the rear motor mount within the housing 46 . a passage 99 also extends through the rear segment to receive the shaft 70 of the motor / gear - reduction unit . as mentioned , the inner component 73 is rigid and hard and can be made of plastic or metal . the outer relatively soft component 75 would preferably be of a plastic material having a durometer rating in the range of 30 a to 50 a with the most preferable durometer rating being 38 a . having the relatively hard component fitted within and cooperating with the relatively soft outer component , a resistance to rotation of the motor relative to the housing 46 is obtained while still absorbing any vibration , which create noise in operation of the motor . it has also been found that static electricity will build up when the shade material 20 of a covering 10 incorporating the present invention passes into and out of the headrail 12 for the covering . that static electricity can adversely effect the operation of the motor 30 . to shield or insulate the motor from any such static electricity , a sleeve 101 ( fig4 ) made of a flexible heat - shrink plastic material is shrunk around the housing 46 for the motor / gear - reduction unit 30 / 62 which provides a static electricity barrier to prevent malfunctioning of the motor . the hub 40 ( fig3 a ) consists generally of a cylindrical body having the longitudinally - extending circumferentially spaced ribs 42 and the end plate 44 at the proximal end thereof . the hub also has longitudinally - extending and radially inwardly directed grooves 80 which slidably receive the fins 36 of the mounting ring 34 as the hub is advanced past the mounting ring into a seated position on the mounting shaft 32 where it is free to rotate . the hub further includes inwardly directed longitudinally - extending grooves 82 adapted to slidably receive the catch tabs 38 of the mounting ring so the hub can be slid over and past the mounting ring . it will therefore be appreciated that the mounting shaft 32 and mounting ring 34 are rigidly mounted on the end cap 16 with the hub 40 being rotatably mounted on the mounting shaft . the housing 46 is mounted on the mounting ring and secured thereto with the locking engagement of the flexible arms 50 with the catch tabs 38 . the housing , therefore , projects axially along the length of the headrail 12 so that the drive disk 60 at the distal end of the housing and the housing itself are positioned for receipt within the roller 18 as will be described hereafter with the drive disk being operatively engaged with the roller in supporting relationship to effect reversible rotation thereof via energy provided by the motor 30 . the opposite or left end of the roller is rotatably supported on the left end cap 14 in a conventional manner , which is not illustrated . the headrail 12 , which is probably best viewed in fig3 b , has a relatively flat back wall 84 , a flat top wall 86 , and an arcuate front wall 88 . the back wall has a pair of guide channels 90 each of l - shaped cross - section adapted to slidably receive and retain a battery pack 92 for providing energy to the motor 30 . the battery pack includes a pair of longitudinally - extending batteries 94 that are supported on a bracket 96 having guide arms 98 for slidable receipt in the channels 90 so that the battery pack can be slid into position and will remain in position on the rear wall of the headrail so as to be out of sight . at one end of the bracket 96 , an electrical connector 100 protrudes from the battery pack and is adapted to receive an electrical connector on a flat wire conductor 102 seen for example in fig3 a and 9 , which is operatively connected to the motor in a manner to be described hereafter . a control module 104 is also slidably mounted on the back wall 84 of the headrail in the same manner as the battery pack as is probably seen best in fig3 b . the control module is operatively connected to other components of the covering for controlling its operation as will be explained later . it is of importance to note that control modules for remotely operable retractable coverings for architectural openings have typically been mounted inside a head rail adjacent to an end cap and in this position the width of the fabric had to be limited relative to the overall length of the head rail as the control module itself prevented positioning the edge of the fabric closely adjacent to the end cap . by mounting the control module on the back wall of the head rail as in the present invention , the width of the fabric can be made to be substantially commensurate with the length of the head rail as the lateral edges of the fabric can be positioned closely adjacent to the end caps . making the width of the fabric substantially commensurate with the length of the head rail allows the fabric to cover a greater portion of the architectural opening than is otherwise permissible with a given length of head rail . referring again to fig4 , at the distal end of the motor / gear - reduction unit 30 / 62 , the front motor mount 66 , as mentioned previously , is positioned and has holes 106 in its proximal end adapted to receive the three longitudinally - extending circumferentially spaced pins 64 . these holes can be seen , for example , in fig7 and 8 and become slightly ovular in cross - section ( fig8 ) when stretched so that the circular cross - section of the pins can move relative to the motor / gear - reduction unit in a circumferential direction a small amount within the holes . this helps to absorb vibration when the motor is energized or de - energized , as will become more clear hereafter . the front motor mount 66 further includes a large centered axial passage 108 that receives an interconnect 110 as seen best possibly in fig4 with the interconnect having a proximal shaft 112 extending through the front motor mount and being secured thereto with a snap ring 114 . the proximal shaft has an axial hole 116 ( fig6 a ) that receives the non - circular drive shaft 58 of the motor / gear - reduction unit 30 / 62 with the transverse configuration of the drive shaft and the hole 116 being the same and in the disclosed embodiment of d - shape . in this manner , the rotation of the drive shaft is transferred to the interconnect . the interconnect further includes a flat abutment plate 118 adapted to abut against the proximal face of the drive disk 60 and a pair of forwardly and longitudinally extending support legs 120 that are receivable in diametrically opposed passages 122 through the drive disk . the support legs have an enlarged cap 124 on their end so that the resilient drive disk can be inserted onto the interconnect and retained in position . the drive disk further includes a pair of diametrically opposed radially opening grooves 126 of generally trapezoidal transverse cross - section with these grooves adapted to cooperate with the roller 18 as will be explained hereafter in transferring rotation from the motor drive shaft to the roller . the interconnect 110 is preferably made of a material that is rigid enough to transfer torque from the drive shaft 58 to the drive disk 60 . while some plastics would be suitable , metals have been found desirable with zinc being the preferred metal . as mentioned , the drive disk is made of a resilient and relatively soft material having a durometer rating preferably in the range of 55 a to 65 a so that there is enough rigidity in the disk to drive the roller while providing a cushioned interface between the drive shaft and the roller . accordingly , through the soft drive disk vibrations of the relatively hard motor 30 and its drive shaft 58 are reduced significantly while the interconnect and drive disk have enough rigidity to acceptably transfer torque from the drive shaft to the roller . the front 66 and rear 68 motor mounts are also made of resilient , relatively soft materials , as mentioned previously , with the durometer rating of the front motor mount being preferably in the range of 50 a to 70 a while the durometer rating of the outer portion of the rear motor mount is preferably in the range of 30 a to 50 a . fig6 a is a longitudinal section through the roller 18 showing the motor / gear - reduction unit 30 / 62 , the front motor mount 66 , the interconnect 110 , the drive disk 60 , and the roller 18 , which is operatively engaged with the drive disk . the roller , which is possibly best seen in fig3 b , is generally cylindrical in configuration having a radially inwardly directed longitudinally - extending projection 128 that is adapted to be received in one of the diametrically opposed grooves 126 in the drive disk . this assures a unitary rotation of the roller with the drive disk and with the motor . referring again to fig7 and 8 , as mentioned previously , the front motor mount 66 has the holes 106 for receiving the circumferentially spaced pins 64 , which are circular in cross - section , and this relationship between the pins and the motor mount provide a system for absorbing vibration that might otherwise exist when the motor is energized and de - energized . fig7 shows the pins in the holes when the motor is not being driven , and fig8 shows the pins shifted to one side of the holes , which become distorted into an ovular shape when the motor is driven in one direction , and it can thereby be seen that that movement is absorbed and cushioned as the pins shift relative to the holes in which they are received . the operation of the covering is best appreciated by reference to fig9 where various components of the covering are shown diagrammatically along with their interconnection . it will first be appreciated that the battery pack 92 mounted on the back wall 84 of the headrail 12 is connected with a flat cable 130 to one end of the control module 104 , which is also mounted on the back wall of the headrail . the control module on an opposite end is connected both to the remote sensor 28 by one flat cable 132 and to an electrical mounting plate 134 with the flat cable 102 , which is also seen in fig6 b . the flat cable 102 going to the electrical mounting plate is electrically connected through the plate to a pair of electrical wires 136 connected to the motor 30 with one of those wires being seen in fig6 b . the electrical plate also interconnects the control module with a timing arm 138 mounted on the end of the rotatable timing pin 70 , which rotates with the motor so that the timing arm intercepts a signal in a conventional manner to count rotations of the timing pin so that any covering having this operating system can be preset through its control module to extend or retract a predetermined amount to cover or uncover an architectural opening in which the covering is mounted depending upon the number of rotations of the timing pin . such systems are commonly known in the art and , accordingly , a further description thereof is not deemed necessary . with the control system as shown in fig9 , it will be appreciated that information received by the sensor 28 , either from a remote control ( not shown ) or through a manual switch 140 provided on the remote sensor , can be transmitted to the control module 104 which is energized by the battery pack 92 . that information is used to drive the motor 30 and its gear - reduction unit 62 in one direction or another , which not only rotates the roller 18 about which the fabric 20 for the covering is wrapped or unwrapped , but also counts the rotations of the roller so that the covering can be extended a predetermined amount from the roller to precisely cover the architectural opening in which the covering is mounted . it will be appreciated from the above that the motor - drive system utilized in the covering of the present invention has been designed to minimize vibration that creates noise during operation of the electric motor . there are two distinct shock - absorbing components of the motor drive system with one of those components being the drive disk 60 , and the other the front 66 and rear 68 motor mounts . considerable effort has been given to arriving upon the most desirable durometer rating for these components of the system , as simply making the components harder for better torque transfer or softer for more sound absorption was found not to be the full answer . rather , various durometer combinations for the components were determined to fall in the ranges mentioned previously , which generated a decibel output of approximately 58 decibels , which was a level found to be acceptable and superior to prior art systems . although the present invention has been described with a certain degree of particularity , it is understood the disclosure has been made by way of example , and changes in detail or structure may be made without departing from the spirit of the invention as defined in the appended claims .	7
fig1 illustrates a typical device which can be fabricated according to the invention . in this example , the device is an optical subassembly , 10 , which includes a substrate , 11 , such as silicon , which supports the various components . the substrate , 11 , is typically cut to a size of 2 . 5 mm × 3 . 5 mm and is approx . 35 mils thick . the semiconductor laser , 12 , is mounted on the top surface of the substrate along with a pin photodiode , 14 , which acts as a back face monitor , and a spherical lens , 13 , which is mounted in a cavity , 18 , in the substrate , the lens focusing the light from the laser , 12 . metallization , e . g ., 15 , is also formed on the surface of the substrate to provide electrical connection to the laser , 12 , and photodiode , 14 , through wires or ribbons , 16 and 17 , respectively . ( for more details on the laser module , see , for example , u . s . patent application of anigbo , ser . no . 08 / 764960 , filed dec . 22 , 1995 .) in accordance with a feature of the invention , as illustrated in fig2 - 4 , a tray , or carrier , 20 , is provided . the tray or carrier , 20 , typically comprises a base of metal material , 25 , which includes an array of cavities , e . g ., 21 , formed in a major surface . in this example , the cavities are cylindrical , but they can be any convenient shape . the cavities are sized so that individual modules , e . g ., 10 , can be inserted into each cavity , e . g ., 21 , and remain essentially stationary therein during subsequent processing . in this example , the carrier includes five rows of ten cavities to process 50 modules at a time . of course , any number of cavities could be employed . a cover , 26 , typically made of plastic , is provided over the base , 25 , in order to keep the devices in place . the cover , 26 , includes an array of apertures , e . g ., 27 , which are aligned over corresponding cavities , e . g ., 21 , in the base . the carrier also includes on its base or cover an identifying marker , 22 , which in this example is a bar code , but could be a standard alphabetic and / or numeric sequence , or any type of marker which can be used to identify the carrier . rather than provide identifying markers for each device , the devices , 10 , are identified according to their position in the carrier , 20 . thus , for example , device , 10 , is in position 1 in the carrier ., while a device , 23 , adjacent thereto would be in position 2 , etc . advantageously , the base of the carrier , 20 , is made of a material which provides protection from electrostatic discharge , such as aluminum . the carrier , 20 , with the devices positioned therein was then processed in accordance with the flow diagram illustrated in fig5 . at the first station , illustrated by block , 51 , the laser , 12 , and photodiode , 14 , were bonded to the optical subassembly , 10 , and the ribbons , 16 and 17 of fig1 were bonded to the laser and photodiode , 12 and 14 , respectively by use of a standard industry automatic wire bonder employing ultrasonic and thermosonic wedge bonding on a heated work stage . a visual inspection of the devices was then performed and any devices which were not properly bonded were indicated as failures in the manufacturing database so that no further tests were performed on the failed devices . the results of this first visual inspection were transmitted to a database server , 58 , where the data for device testing was stored , by means of a link , 59 , such as an intranet . at the next station , illustrated by block 52 , the devices in the carrier undergo an accelerated aging in order to determine the expected lifetime of each device . product code results and testing parametric data results were transmitted to the server , 58 , and the database server , 58 , was updated as to the pass / fail status of each device . at the next station , illustrated by block , 53 , the devices in the carrier which maintained a pass status from the previous stations underwent standard light - current - voltage ( liv ) and wavelength testing where a current was sent through each device and light output , current voltages and wavelengths were measured . testing was done one device at a time from the carrier . again , product code results and data from the liv tests were sent to the central database in the server , 58 , so that the status of each device could be updated , i . e ., which devices in the carrier conformed to the product code specifications . the carrier was then sent to one of three test stations depending upon what type of laser was included in the devices in the carrier . carriers including lasers intended for analog applications , e . g ., analog lasers , were sent to the analog test station , illustrated by block , 54 . there , each device in the carrier , was tested for its analog characteristics . carriers including digital lasers , were sent to the digital test station , 55 , where the devices were tested for their high frequency properties . carriers including devices with electrooptic modulators were sent to the eml test station , 56 , where the devices were tested for their high frequency and wavelength characteristics . again , in order to save time , the test stations only test devices which have passed the testing in a previous test station , i . e ., those positions in the carrier which have a &# 34 ; pass &# 34 ; in the data base stored in server , 58 . after the carrier had undergone one of the tests at station 54 , 55 , or 56 , it was transported to a sorting station , illustrated by block , 57 . there , each device was removed from the carrier and sorted according to the results from the combination of tests . this can be done robotically in response to the database stored in the server , 58 , which communicates to the station , 57 , over link 60 . the server compares the results for each device to the product specifications to determine which category it should be sorted into . only if the device fit within the product specifications for all tests was it categorized under that product code . the devices were then placed in a plastic carrier for further processing according to the sorting and testing operations . any device which did not fall within a product specification was discarded . while the invention has been illustrated in a process employing an assembly station , 51 , and two testing stations , 53 and either 54 , 55 , or 56 , it will be appreciated that the invention is not so limited . it can be employed , for example , with any number of testing stations , including one and can be useful with or without an assembly station .	7
the making and using of various example illustrative arrangements that incorporate aspects of the present application are discussed in detail below . it should be appreciated , however , that the illustrative examples disclosed provide many applicable inventive concepts that can be embodied in a wide variety of specific contexts . the specific examples and arrangements discussed are merely illustrative of specific ways to make and use the various arrangements , and the examples described do not limit the scope of the specification , nor do they limit the scope of the appended claims . for example , when the term “ coupled ” is used herein to describe the relationships between elements , the term as used in the specification and the appended claims is to be interpreted broadly , and while the term “ coupled ” includes “ connected ”, the term “ coupled ” is not to be limited to “ connected ” or “ directly connected ” but instead the term “ coupled ” may include connections made with intervening elements , and additional elements and various connections may be used between any elements that are described as “ coupled .” aspects of the present application provide methods for creating variable frame rate ( vfr ) produced content with current and future frame rates encoded in the content . other aspects of this application disclose methods that enable a video display device to directly display the vfr video stream at multiple frame rates while eliminating or reducing visual artifacts . additional aspects include apparatus arrangements to implement the methods for directly displaying variable frame rate video content with reduced or free from visual artifacts . fig2 depicts a block diagram of a video display system incorporating aspects of the present application . in fig2 , in system 300 digital video data 310 with frame rate fr and future frame rate fr + data is presented to a digital video display system 320 . within the digital video display system 320 the digital video data 310 is coupled to video processing logic 330 that includes a frame rate detection block 322 . the frame rate detection block 322 is coupled to a processor 328 . the video processing logic 330 is coupled to a frame buffer 326 . the frame buffer 326 is coupled to the display hardware 340 . the processor 328 is coupled to two or more timing control buffers ( tcb ) 324 , 325 . the tcb 324 , 325 are coupled to the display hardware 340 . the frame rate detection block 322 is depicted as a separate block from the processor 328 , however in another example arrangement that forms additional aspects of the present application , the frame rate detection could be implemented as a software configuration executed in the processor 328 . for example , instructions stored in a memory or within an on - board memory within the processor 328 could cause processor 328 to perform the frame rate detection shown as block 322 . in operation , the frame rate detection block 322 receives digital video data 310 including the frame rate ( fr ) and future frame rate ( fr +) within the data as ancillary ( anc ) data and can update the processor 328 with the measured frame rate , the current frame rate data ( fr ) and the future frame rate data ( fr +). the processor 328 can be configured to use the anc data fr and fr + to compute the necessary values required by the display hardware 340 , and store them in the primary tcb 324 and secondary tcb 325 . the data in the frame buffer 326 is displayed on the display hardware 340 using the information stored in tcb 324 . if the processor 328 detects a change in frame rate from the previous frame rate , a “ swap ” event occurs . in this event , tcb 325 becomes the active tcb and the data in the frame buffer 326 is displayed on the display hardware 340 using the information stored in tcb 325 . at this point , tcb 325 becomes the primary tcb and tcb 324 becomes the secondary tcb . the ability of the digital video display system 320 to switch to pre - loaded frame rate timing parameters on a specific frame boundary enables the digital video display system to display multiple frame rate video while still reducing or eliminating visual artifacts which otherwise would be seen by the viewer . the image display device can be any display device compatible with digital video data presented in frames , for example , the image display device can be an led , lcd or plasma tv or monitor , a dlp tv or monitor , an lcd , lcos or dlp projector , a dlp cinema ® projector , or the like . illumination sources in the image display device can include laser , laser - phosphor , led or lamp . color wheels can be used or alternatively dedicated color illumination sources such as red , green and blue leds can be used . one or more spatial light modulators can be used to reflect or transmit the image based on the image data . digital micro - mirror devices ( dmds ) can be used as the spatial light modulators . the variable frame rate arrangements of the present application can be used in systems incorporating a variety of display technologies . table 1 illustrates a non - limiting example of fr and fr + data within digital video data 310 assembled from three video sources having frame rates of 24 fps , 60 fps and 96 fps . in table 1 , the sequence illustrates the display of 500 video frames recorded with variable frame rate information . at frame 1 , the current frame rate is shown as 24 fps , with the future frame rate indicated as 96 fps . the frame rate remains at 24 fps for the next 199 frames , then , at frame 200 , the current frame rate is changed to 96 fps . the change in the current frame rate field to the previous future frame rate indicates that this frame is the boundary frame , this frame is the first frame to be displayed at the new frame rate ( 96 ) and a swap event is indicated at this frame . in table 1 , the frame rate then remains at 96 fps , which is now the current frame rate , with a future frame rate at 60 fps , until frame 300 fps , when the current frame rate is suddenly 60 fps . again , the change in the current frame rate identifies the frame when the display is to start displaying the frames at 60 fps , and a swap event is indicated . at a swap event , the timing control buffer that is currently being used is swapped with the timing control buffer that contains the future frame configuration . the timing control buffers then change roles , and instantly the display starts displaying the images at the new current frame rate . the timing control buffer that contains the configuration for the previous frame rate is now available to receive the future frame rate configuration . an aspect of the arrangements of the present application is that the latency of the display system can be accounted for . the future frame rate information is available to the display system well ahead of the switch to displaying at that future frame rate . in this manner , the system can instantly start to display the images at the new frame rate without any frames being displayed at an incorrect frame rate . as a result no artifacts due to the change in frame rate are visible to the viewer . this is in sharp contrast to the prior known systems where the frame rate is detected from the digital video data while the images are already being displayed , thus the images will be incorrectly displayed for a time long enough for the prior system to determine the new frame rate , creating visible artifacts . the arrangements presented herein as aspects of the present application overcome the deficiencies of the prior known approaches . table 2 illustrates in one non - limiting example a method of the present application with the encoding of fr and fr + into a digital video stream 310 using a format that is compatible with the current smpte method 291m for providing ancillary data in a video stream . as shown in table 2 , the current frame rate , and the future frame rate , can be presented as part of the digital video data in a manner compatible with existing standards . in this way the arrangements of the present application for providing variable frame rate information for direct display can be implemented without the need for creating new standards and with existing equipment for producing video content . in alternative arrangements that are also contemplated as additional aspects of the present application , the current frame rate and future frame rate information can be provided in other manners including being embedded in the video data , for example , or being transmitted on a separate communications channel or signal . table 2 illustrates an arrangement for providing the current frame rate and future frame rate that is compatible with current video standards , but the arrangements of the present application are not limited to this example approach . fig3 depicts a block diagram of a video display system incorporating aspects of the present application . in fig3 , system 500 includes digital video data 510 with current frame rate fr and multiple future frame rates fr ++ data that is presented to a digital video display system 520 . within the digital video display system 520 the digital video data 510 is coupled to video processing logic 530 that includes a frame rate detection block 522 . the frame rate detection block 522 is coupled to a processor 528 . the video processing logic 530 is coupled to a frame buffer 526 . the frame buffer 526 is coupled to the display hardware 540 . the processor 528 is coupled to timing control buffers ( tcb ) 524 , 525 through n . the tcb 524 , 525 , through n are coupled to the display hardware 540 . in operation , the frame rate detection block 522 receives digital video data 510 including the frame rate ( fr ) and multiple future frame rates ( fr ++) within the data as ancillary ( anc ) data and can update the processor 528 with the measured frame rate , the current frame rate data ( fr ) and the future frame rate data ( fr ++). the processor 528 can be configured to use the anc data fr and fr ++ to compute the necessary values required by the display hardware 540 , and store them in the primary tcb 524 , the secondary tcb 525 and any other tcbs through n . the data in the frame buffer 526 is displayed using the information in tcb 524 . if the processor 528 detects a change in frame rate from the previous frame rate , an “ index ” event occurs . in this event , the processor 528 identifies a tcb , 525 through n , to be active and the data in the frame buffer 526 will be displayed using the information in the current active tcb . the ability of the digital video display system 520 to switch to pre - loaded timing parameters on a frame boundary enables the digital video display system 520 to directly display video content with varying frame rates while reducing or eliminating visual artifacts which otherwise may be seen by the viewer . in the arrangement of fig5 , a variety of n timing control buffers 524 , 525 - n are provided , each containing parameters required to display images at a different frame rate . in this manner the future frame rate data is stored in a buffer for each of the supported frame rates , enabling the image display device to instantly change to any of the supported frame rates on a specific frame boundary and to instantly display the images at the multiple frame rates without visible artifacts appearing due to the frame rate change . fig4 illustrates in a flowchart a method for creating variable frame rate produced video content incorporating aspects of the present application . the method 600 begins at step 610 , “ variable frame rate video data ”. at step 612 , the method finds position information for all variable frame rate changes . at step 614 , the method continues by processing the digital video data to embed the ancillary data anc with the current frame rate fr and the future frame rate ( s ) fr +(+) embedded in at least some of the digital video data . in one example arrangement , ancillary data is provided for each frame of digital video data . in another alternative example arrangement , at least some of the video frames include ancillary data , while between new frames that include ancillary data , the system can continue using the last frame rate update as the variable frame rate information . at step 616 the produced content is provided including the current frame rate and the future frame rate information embedded within it . an important feature of the arrangements of the present application is that the system latency in making frame changes can be accounted for . because the ancillary data enables the transmission of the future frame rate information for many frames prior to the “ swap ” event , the system can easily store the configuration data needed to make the variable frame rate switch on a frame boundary . in this manner the system is able to instantly switch to the new frame rate on the selected frame boundary and the arrangements described above also enable an easy detection of the particular frame where the produced content begins at the new frame rate . visible artifacts will not be displayed as the system changes frame rates when the various arrangements of the present application are utilized . the video content can be produced at high frame rates when the content includes fast motion , while slower changing content can be produced at slower frame rates . the use of the arrangements described above thus enables an optimization of the video content for frame rate , selection of the appropriate frame rate for the content being displayed at a particular moment in the video content can be made and the frame rate can be dynamically changed while the image displayed is yet free from visible artifacts . fig5 illustrates in a flowchart a method to display variable frame rate produced video content incorporating additional aspects of the present application . the method 800 starts at step 810 , “ video frame received ”, waiting for the next frame of video data . when video data is received , it is tested in step 812 to see if it contains ancillary data ( anc ) that contains frame rate information . if the condition is false , testing continues at step 814 where the frame rate is measured and compared to the previously measured rate . if the new frame rate is the same as the previous , then processing returns to step 810 waiting for the next frame of video data . if the new frame rate is not the same as the previous , then values for a new tcb are generated and a new tcb is loaded in step 816 . once the new tcb is loaded , the display hardware is told to “ swap ” and start using the new tcb in step 818 , and the processing returns to step 810 waiting for the next frame of video data . if this condition in step 812 is true , then the current frame rate in the ancillary data is compared to the current frame rate received in previous frames to see if they differ in step 820 . if this condition is true , the current frame rate for this frame is different than the previous current frame rate , then the display hardware is told to “ swap ” and start using a new tcb that had been previously loaded in step 822 . processing then returns to step 810 waiting for the next frame of video data . if the current frame rate for this frame is not different ( it is the same ) as the previous current frame rate , then the future frame rate ( s ) data is compared to the future frame rate ( s ) from the previously received frame to see if they differ in step 824 . if this condition is true , the future frame rate ( s ) for this frame is / are different than the previous future frame rate ( s ), then values for new tcb ( s ) are generated and new tcb ( s ) are loaded in step 826 . processing then returns to step 810 waiting for the next frame of video data . a feature of the present application relates to step 824 where multiple future frame data may be embedded in the digital video stream . having more than 1 future frame rate allows for transitions between frame rates so frequently that only having a single future frame rate would not be sufficient to get the timing control buffer ( tcb ) filled before the transition . while having a single duplicate timing control buffer allows for a “ swap ” between buffers , having 3 or more buffers would call for an “ index ” to point to a specific timing control buffer . however the index is an alternative arrangement and the present application is not limited to this arrangement , a two buffer system can also be used with a simple swap between them as is described above . various modifications can also be made in the order of steps and in the number of steps to form additional novel arrangements that incorporate aspects of the present application , and these modifications will form additional alternative arrangements that are contemplated by the inventor as part of the present application and which fall within the scope of the appended claims . although the example illustrative arrangements have been described in detail , it should be understood that various changes , substitutions and alterations can be made herein without departing from the spirit and scope of the present application as defined by the appended claims . moreover , the scope of the present application is not intended to be limited to the particular illustrative example arrangement of the process , machine , manufacture , and composition of matter means , methods and steps described in this specification . as one of ordinary skill in the art will readily appreciate from the disclosure , processes , machines , manufacture , compositions of matter , means , methods or steps , presently existing or later to be developed , that perform substantially the same function or achieve substantially the same result as the corresponding example arrangements described herein may be utilized according to the illustrative arrangements presented and alternative arrangements described , suggested or disclosed . accordingly , the appended claims are intended to include within their scope such processes , machines , manufacture , compositions of matter , means , methods , or steps .	6
one currently representative and important application of the present invention is the provision of appliances which are designed for use in a kitchen . a system or appliance suitable for this ( and other ) applications of the invention is illustrated in fig1 and identified by reference character 20 . how appliance 20 functions in each of these modes is described above in that section of this specification entitled summary of the invention . the major components of system 20 are : an integrated unit ( or module ) 22 , a remote control 24 , and a laser readable disk 26 . as mentioned above , disk 26 may be a conventional cd or other optically readable disk from which an appliance user can retrieve information on an available task or subject . examples only are video 1 . 1 , video 2 . 0 , dvd , and cdi disks . the illustrated system 20 also has an optional keyboard 28 . this keyboard is employed by a system user with system 20 in its internet mode of operation in sending e - mail messages , to reach web sites which cannot be accessed by clicking on a link on a home page 30 ( see fig1 ) of controlled context , and to carry out other functions as described in copending application ser . no . 09 / 465 , 671 filed dec . 17 , 1999 . integrated unit 22 includes a television unit 32 which has a crt ( cathode ray tube ) with a screen 33 ( or a led or other display ) and a video compact disc player 34 ( or other player for laser readable disk ) both housed in the same cabinet 36 . conventional onboard controls 38 for television 32 are located on the front panel 40 and the right - hand side panel 42 of cabinet 36 , and onboard controls 44 for the disc player 34 are also located on front cabinet panel 40 . a conventional tray - type loader 46 ( see fig3 a ) is used to load disc 26 into player 34 . the operating components of integrated unit 22 and ancillary items activated in different operating modes of system 20 are depicted schematically in fig2 a , and 3 b and collectively identified by reference character 56 . these components include a mode selection register 58 and a video / audio switch 59 , both activate when a particular one of the system 20 operating modes is selected to channel the input available in the selected mode to the screen 33 of system 20 and to speakers 60 of that system . as a single example , when the television mode is selected , a connection to a source for a television signal such as an antenna , a cable , and / or a vcr is made through switch 59 . other components controlled by operating system 56 , in this case , in the security mode of operation , are incorporated in an entry module identified by reference character 62 in fig3 a . these components include a microphone 64 , a speaker 66 , and an electrically operated door latch 68 . optionally located at the same entryway ( not shown ) as module 62 is a camera 70 which is designed to display an image of a person at the entryway on crt screen 33 . the operation of a system of the same character as the one disclosed herein is copending application ser . no . 09 / 116 , 285 filed jul . 16 , 1998 . other major components of the complement 56 of operating components , located interface board 72 , are listed below along with the function of each component . also included in , on operatively associated with interface board 72 , are the following additional components : it was pointed out above that appliance 20 can transmit and receive data via a telephone line and cell phone linkups . the telephone line is shown in fig3 a and identified by reference character 99 . as shown in fig3 a , system 20 also has a usb port 100 as well as links ( or connections ) ( 102 , 104 , and 106 ) for transmitting appropriately formatted data to a printer and to video and audio devices which are not components of the appliance . appliance 20 preferably also has an ethernet port 108 . this : ( 1 ) allows appliance 20 to be networked to compatible appliances and ( 2 ) allows the appliance to be connected to the internet via dsl or other broad bandwidth link . the television , cd , appliance , security / monitor , and internet modes of operation may be selected by the user of system 20 with push button controls 110 , 112 , 114 , 116 , and 118 of remote control 24 ( see fig4 ). referring now especially fig2 electronic video / audio switch 59 is shown in the interest of clarity . this switch has five positions labeled 1 - 5 . the pressing of one of the five mode switches 110 , 112 , 114 , 116 , or 118 causes a corresponding number — shown in the following table — to be placed in selection register 58 . video switch 59 is almost instantaneously set to the number in selection register 58 , causing appliance 20 to operate in the selected mode . this use of a mode selection register and a video / audio switch to make visual and audio information available to screen 32 and speakers 98 from the appropriate source in each of the five modes of operation of appliance 20 as shown in fig2 is an important feature . this arrangement allows for almost instantaneous switching from one mode of operation to another , which is important to the appliance user who would typically be frustrated if an appreciable amount of time were required to switch from one operating mode to another . remote control 24 also has a numerical keypad 120 with push buttons { circle around ( 1 )} through { circle around ( 6 )} and two groups of push buttons respectively identified by reference characters 122 and 124 . the push buttons of group 122 are employed in the television mode of operation . they function in the same manner as the similar designated controls of a conventional television set . the pause , rev , and fwd buttons 126 , 128 , and 130 of group 124 are employed in the cd mode of operation in the same manner as their conventional cd player counterparts . considering then buttons in group 124 , home button 132 returns the system user to the beginning of a disk and thus to the beginning of its content in the cd mode of operation for system 20 . in the internet mode of operation , this button returns the user to a home page such as the one identified by reference character 30 in fig1 . stop button 134 is employed in the same manner as its conventional counterpart in the cd mode of operation . in the internet mode of operation , this button is used to stop an operation in progress — for example , the downloading of a file from the internet . previous and next buttons 136 and 138 are used in the cd mode of operation for the purposes described in the &# 39 ; 947 application ; and the remaining buttons in group 124 are employed in the internet mode of operation , again for the purposes described in the &# 39 ; 947 application . up , down , left , and right buttons 139 a . . . d are used with appliance 20 in its internet mode of operation to move a cursor 139 e ( see fig1 ) around screen 33 . go button 139 f is pressed to “ click on ” and select an option reached by cursor 139 e . also available with appliance 20 in its internet mode of operation are scroll up and scroll down buttons 139 g and 139 h and options button 139 i . the scroll up and scroll down buttons are employed if a page of information is too large to fit on screen 33 . these buttons allow the appliance user to move the page up ( or down ) to bring the wanted part of the page into view on screen 33 . keyboard 28 ( see fig1 and 4a ) has both character and function keys . the character keys — collectively identified by reference character 140 — may be those constituting a conventional qwerty key set . the function keys include conventional tab , caps lock , shift , control , alt , escape , delete , space , enter , and backspace keys 141 . . . 158 as well as an on / off key 160 . additional function keys of the illustrated , exemplary keyboard 28 include mode switches ( or buttons ) appliance , television ( tv ), internet ( net ), and buttons 162 . . . 168 and a key block 170 which includes security monitor , talk , and unlock buttons 172 , 174 , and 176 . mode keys 162 . . . 168 are employed to operate appliance 20 in a selected one of its appliance , tv , internet , and cd modes . the talk and unlock buttons 172 . . . 176 in set 170 are employed with appliance 20 in its security / monitor mode of operation to talk to a person at the entryway and to unlock a door at the entryway . specifically , pressing button { circle around ( 1 )} on remote control keypad 120 or the like numbered button on keyboard 28 ( on a like numbered onboard control ) allows the appliance user to talk to a person ( or persons ) at the entryway . pressing button { circle around ( 2 )} disengages lock 68 ( fig2 ), allows the person or persons at the entryway to enter . this just described mode of operation of appliance 20 is entered when the door bell rings . pressing security / monitor mode switch 172 turns on a camera in a monitored area — for example , an entryway or a baby &# 39 ; s nursery . operation of an appliance of the character disclosed herein in a security / monitor mode is described in detail in copending application ser . no . 09 / 115 , 825 . keyboard 28 also has a number of other function keys collectively identified by reference character 178 . these keys are labeled and they have the same functions as the like number buttons on remote control 24 . when a character or function key on keyboard 28 is pressed , a coded electrical signal unique to the selected character or function is generated and converted to a correspondingly coded ir signal which is transmitted to appliance module 22 . the ir signals are generated by led &# 39 ; s mounted at the two end walls 184 and 186 and the back wall 188 of the keyboard . these led &# 39 ; s are represented in fig1 by arrows 190 , 192 , and 194 . consequently , and because the signals are in the ir range , a usable signal will be transmitted to appliance 20 essentially without regard to the angle through which keyboard 28 might be rotated relative to the infrared radiation receiver 84 of the appliance 20 . keyboards of the character described above are disclosed in copending provisional patent application no . 60 / 115 , 006 filed jan . 6 , 1999 and in copending patent application ser . no . 09 / 465 , 671 filed dec . 17 , 1999 . it was pointed out above that appliance 20 may be used in its cd mode to retrieve information from a laser readable disk . specifically , remote control 24 ( or keyboard 28 ) is employed to navigate through a hierarchical array of menus written to the disk to retrieve information on a selected subject or task from compact disc 26 and to display that information on the screen 33 of integrated unit 22 . appliance 20 can be configured to display either an introductory video 203 or a top level menu 204 when the cd mode of operation of appliance 20 is selected . information is reached by making choices . specifically , appliance 20 may be programmed to bring up either an introductory video 203 or a top level menu 204 when the cd mode of appliance 20 is selected . in either case , the appliance user selects a numbered choice from the top level menu , bringing up a second level menu , 206 , also with numbered choices . this process is continued until the information of interest — typically in the form of a video clip — is reached and displayed on screen 33 . in the representative scenario depicted in fig6 the appliance user can navigate from top level menu 204 downwardly through second level menu 206 and a third level menu 208 to reach information of interest ( screens 210 in fig9 and 212 in fig1 ). a specific example involves the retrieval of information on stocking a pantry from laser readable disk 26 . the top level menu 204 is shown in fig7 . the user selects { circle around ( 1 )} from this menu , bringing up second level menu 206 ( fig8 ). from this menu , the user selects { circle around ( 1 )}. this brings up the wanted information — screen 210 , fig9 and screen 212 , fig1 . in this particular example only a second level menu is accessed to retrieve the wanted information . in other instances , the wanted information may be reached directly from the top level menu 204 or from a third or lower level menu . remote control 24 , keyboard 28 , or onboard controls 38 may be used to navigate chart 202 . scroll buttons 139 h ( remote 24 , fig4 ) or 209 ( keyboard 28 , fig4 a ) or a button of that character ( not specifically shown ) in the complement 38 of onboard controls can be used to move from the first screen of information 210 to the second screen 212 . restart , back , and next ( or fwd ) buttons as described above can be used to navigate up and down the navigation chart and to return ( in this typical case ) to top level menu 204 . additional information on the just - described method of retrieving information from a laser readable disk of the character disclosed herein may be found in u . s . pat . no . 5 , 724 , 102 issued mar . 8 , 1998 . this unique feature is another one which makes system 20 easy and convenient to use and therefore acceptable to a person without technical training or inclination and with only the instruction provided by an introductory video 212 ( see fig6 ). the remote control 28 also has the following buttons 130 and 128 employed in the cd mode of operation in retrieving selected items of information from an appropriately coded disk as follows : in the appliance mode of operation , gsm module 88 establishes telephonic communication between appliance 20 and a remote repair / service facility . messages regarding problems in an appliance monitored by appliance 20 are conveyed in this manner to the remote facility . in the internet mode of operation of system 20 , the user can navigate through linked web site pages to information of interest . a representative set of link pages is shown in fig1 , 13 and 14 and identifiably by reference character 214 . details of the illustrated hierarchy — which among other things , allows one to order groceries online — and the steps employed to reach this goal by navigation through the levels of the hierarchy with remote control 24 are described in the &# 39 ; 947 application except that the choices on the web site pages are numbered so that they can be selected with correspondingly numbered buttons in the numerical keypad 120 of remote control 24 . as suggested above , remote control 24 can be used to jump from the home page of an appropriate web site to the other web site pages . fig1 shows how this is accomplished in one representative application of the present invention . remote control 24 , keyboard 28 , on onboard controls 38 can be employed to log onto and navigate ( or browse ) the internet . first , the system user logs onto the internet by pressing the internet button 118 on remote control 24 ( or net button 166 on keyboard 28 ). this opens or brings up the home page 30 of the web site ( see fig1 and 12 ). next , the user presses numbered button { circle around ( 1 )} in the numerical keypad 120 of the remote control 24 . this builds a new url , bringing up a new web page 216 ( see fig1 ). if a number is not pressed , the operation will simply time out and return the user to home page 30 in fig1 . from web page 216 in fig1 , the system user can jump to yet another page — e . g ., the page identified in fig1 by reference character 218 — by pushing a different one of the ten numbered buttons in the numerical keypad 120 , here push button { circle around ( 6 )}. in this instance , if a second numbered button is not pressed , the operation will again time out with the system user being returned to web page 216 . in one implementation , this sequence of steps can be repeated ( if they are available ) to bring up a maximum of ten sequentially linked pages . this limit is imposed by the number of buttons on the remote control keypad 120 and the desirability of avoiding the need to press more than one numbered button to initiate a particular action . in another implementation , this sequence of steps can be repeated indefinitely as shown in fig1 - 14 , as system 20 builds a url based on the home page 30 in fig1 , any previously selected web pages , and the last numbered button pressed by the user that corresponds to one of the web page options displayed in association with a respective number on the currently selected web page ( i . e ., options 1 - 4 on home page 30 in fig1 , options 1 - 7 on web page 216 in fig1 , or options 1 - 6 on web page 218 in fig1 ). continuing , it may be that a link selected by the system user leads to a page or web site not which is not linked to one of the web site pages 30 , 216 , or 218 . if this happens , the operation times out ; and the connection to the internet is closed . if the link is available , the system user is instead returned to the last web site page , and the user can press a numbered button to bring up another web page . alternatively , if the user of appliance 20 wishes to visit a web site not linked directly or indirectly to home page 30 , the user simply uses keyboard 28 to type the url of the wanted web site and presses go button 220 ( fig4 a ) to jump to the web site . other linked sites can be reached by using up , down , left , and right buttons 222 . . . 228 place cursor 139 e ( fig1 ) on a selected link and then pressing the go button 230 to bring up the selected link . another important feature of the present invention is that appliances embodying the principles of the present invention allow the system user return to where he was in a particular operating mode if he switches from that mode to another mode ( or series of modes ) and then back to the first mode . this additional novel , and important , operating feature invention is depicted in graphic form in fig5 and elaborated upon in the following table : the foregoing is not to be interpreted to mean that novel and important advantage of appliance 20 ( and other appliances involving the principles of the present invention ) can be obtained only if operation is switched from a first to a second mode and then back to the first mode . the appliance will operate as described no matter how many mode changes are made before the exited mode is reentered . it is also to be understood that , to meet the needs of a particular market , one or more of the five operating modes of system 20 can be disabled . disabled modes can be enabled as disclosed in copending provisional application no . 60 / 115 , 008 filed jan . 6 , 1999 , which is hereby incorporated by reference . the following patent documents referred to above are hereby incorporated in this disclosure by reference thereto : as will be apparent to the reader , the invention may be embodied in specific forms in addition to those discussed above without departing from the spirit or essential characteristics thereof . the present embodiments are therefore to be considered in all respects as illustrative and not restrictive , the scope of the invention being indicated by the appended claims rather than by the foregoing description ; and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein .	7
fig1 shows a side elevation of the corner region of a reusable container made of plastic material , where the shorter side wall , which is only partly represented in the figure , is indicated by the reference number 1 . the reference number 2 designates a handling opening in the side wall 1 , while the longitudinal side wall adjacent at the corner is indicated by 3 . the side wall 1 is part of a reusable container that usually consists of a bottom , which is not shown here , and four side walls that are foldably attached thereto , where in the illustrated embodiment the shorter side wall is designated by 1 the longer side wall by 3 . the side walls are arranged in such a way as to be situated opposite each other ( not shown ) and can be folded in the direction of the container bottom , where the opposite shorter side walls 1 are first folded inwards in the direction of the container bottom , after which the opposite longitudinal side walls 3 are folded in the direction of the bottom , so that the shorter side walls 1 come to lie on the bottom , while the longitudinal side walls 3 come to lie on the shorter side walls that have been collapsed onto the bottom . in the upright position of the side walls illustrated by fig1 to 3 , in which the container is ready to be filled with merchandise , the side walls are locked to each other in the corner region . to this end , pressure levers 4 are arranged or formed on the shorter side walls , in each case in the corner region and / or at the two edges of the shorter side walls . the pressure lever 4 , which can be seen in fig1 , is provided with a gripping or pressure part 5 , which serves to operate the lever , i . e . to release two adjacent side walls . a portion of a hand , the thumb for example , is placed on this gripping part 5 in order to press the pressure lever 4 inwards , as will be described in greater detail further on . in the illustrated embodiment , the pressure lever 4 is connected with the side wall by means of two spaced webs or ribs 6 connected to the side wall and is further provided with a tongue 7 that continues the gripping part 5 in the direction of the corner region and at its end , as can be seen in fig3 , is provided with a projecting locking hook designated by the reference number 8 . due to the fact that the gripping part 5 is joined to the side wall by means of at least two webs 6 , it is as it were freely contained in a recess or opening 9 in the side wall , the opening being essentially shaped so as to be complementary to the outer edge of the gripping part 5 , which it follows with a clearance slot . due to this free arrangement of the gripping part 5 within the opening 9 and due to the web - like attachment of the pressure lever to the side wall 1 , the gripping part 5 can be pressed inwards in the direction of the arrow f , which causes the pressure lever to rotate inwards about the articulation point of the two webs 6 on the side wall 1 , as indicated by the swiveling direction s in fig3 . the articulation point of the webs 6 is here indicated by 10 ( fig1 ). consequently , the front edge 11 of the tongue 7 comes to exert pressure on a tongue - shaped locking catch , here indicated by 12 , that is formed on the longitudinal side wall 3 ( fig3 ). this tongue - like locking catch 12 , which can also be seen in greater detail especially in fig4 and 7 , is such as to be provided on both sides with a clearance slot 13 with respect to the longitudinal side wall 3 and in the illustrated embodiment is integrally attached to the longitudinal side wall 3 at 14 . the reference number 14 here serves as an articulation point about which the tongue - like locking catch 12 can be pressed outwards in the direction of the arrow g from the position shown in fig3 . as can be seen from fig3 and 7 , the tongue - like locking catch 12 is provided with a shoulder 14 a that runs inwards , especially obliquely inwards , and terminates with a locking strip 15 , the forward free end of the locking catch 12 being situated further outwards than this locking strip 15 . the tongue - like locking catch 12 , which projects forward and is free within the side wall , is elastic in the manner of a spring and capable of being pressed in the direction of the arrow g about the articulation point 14 , i . e . its joint with the side wall 3 , but , as soon as the pressure is removed , will spring elastically inwards and , more precisely , back into the position illustrated by fig3 , in which the locking strip 15 is situated further inwards with respect to the reusable container . the degree of the elasticity and / or the spring effect is essentially determined by the thickness and the width of the locking catch 12 and / or the design of the articulation point 14 . in this connection , the springy locking catch 12 has its spring effect preferably set in such a manner that , as it were , it can be pressed outwards in the direction g even by hand , albeit with a certain pressure . this makes it possible for the spring characteristic and / or the elasticity to be determined and set by means of appropriate dimensioning of the locking catch 12 . as a result thereof , one obtains a very advantageous interaction between the pressure lever and the tongue - like locking catch 12 . when the reusable container with its upright side walls is to be collapsed , the reusable container is gripped with the body of the hand at the two corner regions , i . e . to the left and the right of the shorter side , pressing , for example , with the thumb on the gripping part 5 , so that the pressure lever becomes pressed in the direction f and therefore swiveled inwards in the direction of the arrow s . consequently , the forward edge 11 of the pressure lever will press against the locking catch 12 and , more precisely , in the embodiment here illustrated immediately behind the projecting locking strip 15 , so that the locking catch 12 will be pressed outwards in the direction of the arrow g , thus allowing the side wall 1 , to be rotated along line f and therefore be collapsed . once the side wall 1 has been folded down in the direction of the container bottom , the locking catch 12 springs back into its original position and the side wall 3 can be folded without further problems in the direction of the container bottom and will come to lie on the shorter side wall 1 . when the reusable container has to be prepared for service , the two longitudinal side walls 3 are first pulled or folded upwards , after which the two shorter side walls 1 are folded upwards , which causes the closure hooks 8 to come into contact with the tongue - like locking catch 12 and , since they slide along the oblique parts 16 , the elastic locking catch 12 will be swiveled about the articulation point 14 in the direction of the arrow g until the locking hook 8 eventually snaps and / or grips behind the free and hook - shaped end 17 of the locking catch 12 , which will cause the locking catch 12 to spring inwards , in the direction opposite to the arrow g . the locking position as shown in fig3 is thus reached . the release and the locking are obtained in a simple manner by hand and , more precisely , by means of an almost automatic movement of the hand with the folding or collapsing of the container and / or the uprighting of the side walls without any other action having to be taken . a very rapid and simple release and locking is thus obtained , which is made possible by the interaction between the elastically operated pressure lever and the locking catches 12 made to project inwards by the oblique sliding plane 16 and the catch 11 , where the locking catch 12 becomes correspondingly displaced in the direction of the arrow g and given its elastic return capacity , will thereafter always spring back into its initial or rest position and thus assure a safe and stable locked joint with the hook of the pressure lever . unlike what happens in the case of conventional containers , where comparable locking hooks and / or locking catches in the longitudinal side walls are stiff and / or substantially rigid and the release becomes very difficult , because each individual closing hook has to be bent away by applying considerable pressure , which can lead to the destruction of the closure mechanism , according to the invention it is possible to perform the release and locking process in a very simple manner . the pressure lever acts almost as an instruction leaflet for the release movement , because one will be automatically led to press with the thumb on the gripping part 5 when one wants to collapse the side wall 1 , so that the swiveling of the release mechanism is initiated by the pressing in and / or out of the locking catch 12 in the direction of the arrow g . it is self - evident that by means of appropriately designed stop strips on the enveloping edge 18 of the longitudinal side wall 3 , the raised shorter side wall 1 is maintained in its upright position , i . e . cannot be pressed outwards beyond its upright position . but such stop strips form part of the prior art , so that — with a view to simplifying the representation — there is no need here either to describe them or to show them on the drawings . in fig2 , there can be seen the opening 19 within which the freely projecting locking catch 12 is provided . as an alternative to designing both the pressure lever and the locking catch 12 as integral parts of their respective side walls , as here shown , they may also be designed as separate components and then attached to the respective side walls 1 and 3 by means of clipping , plugging or the like . in particular , it will also be advantageous if these components are made to have some other color , which further enhances their signaling effect as a release element . fig9 to 11 illustrate a further embodiment of a comparable locking device , though only parts of the side walls 1 and 3 are actually shown . identical components in these figures are always indicated by the same reference numbers . fig1 illustrates how the pressure lever 4 is integrally joined to the side wall , more precisely , by means of the narrow strips or webs 6 , which — as shown in fig1 — may also be designed as a shallow u - section . in place of the u - shaped design , however , it is also possible to provide two narrowly spaced rib - like webs or also several webs . the structure of the pressure lever 4 and the locking catch 12 is illustrated particularly well by the section view of fig1 . in the representation of fig1 the pressure lever 4 is provided with a slight elevation or curvature 20 as the gripping part onto which the thumb has to be placed when operating to release the side wall . as an element that triggers the release , the front edge 11 is designed at the free end of a web 24 that projects at right angles from the tongue 7 and projects into the interior of the container , so that the release element acts in the manner of a lever on the locking catch 12 , which , following a slight pressure exerted on the pressure lever 4 , will be pressed in the direction of the arrow g , so that the side wall 1 can be folded inwards , passing the sufficiently deflected locking catch on the way . due to the lever advantage , this can be done by exerting only a small force . when the pressure lever 4 is pressed in the direction f , the front edge 11 will accordingly be pressed against the part — here indicated by 21 — of the locking catch that is set back with respect to the locking strip 15 , so that the tongue - like locking catch 12 is pressed outwards in the direction g and , more precisely in the direction of the opening 19 . consequently , the side wall 1 can be folded inwards in the direction of the arrow f and onto the container bottom . when the side wall 1 is raised , the opposite edge 22 of the pressure lever will run along the oblique surface 16 of the locking catch 12 , which surface projects in the manner of a ramp , so that the locking catch 12 will be pressed back into the opening 19 , after which the side wall 1 can be brought into its upright position . as soon as the front edge 22 has run past the locking catch 12 , the locking catch will spring back inwards and , more precisely , in the direction opposite to the arrow g , so that the interlocking is obtained by means of the engagement of the tongue 7 with the locking hook provided at the free end of the tongue - like locking catch 12 . by means of appropriate design of the thickness of the articulation point 14 , the length of the tongues and the pressure lever , it is possible to determine the release force and also the elastic characteristics , where the conditions within the interlock have to be so matched to each other that especially the locking catches 12 are preferably designed so as to spring elastically forward in such a manner that even manually they can easily be pressed into the opening 19 and yet oppose sufficient resistance to confer an adequate return capacity upon them , so that they will jump back into the position shown in fig1 in which the side walls are stably interlocked . according to the embodiment illustrated by fig1 , which represents an enlarged view of the detail indicated by the dotted circle of fig1 , the value of the locking force can be set by designing the front face 25 of the locking catch 12 with a back taper , the back taper being obtained by means of an oblique position of the front face 25 . in the illustrated embodiment the back taper angle α amounts to 12 ° and , in particular , may lie in the range between 3 and 20 °, preferably between 5 and 15 °. the opposite face 26 is designed in a corresponding manner and , more precisely , to be complementary with the front face 25 , i . e . with a similar back taper angle . this design does not exert any negative effects on the release , i . e . the unlocking , rather , the locking catch can be easily swiveled into the opening 19 when the pressure lever is operated , so that an easy release is obtained . due to the back taper , however , the locking force will be very considerable , so that unintentional opening without operating the pressure lever is not possible .	1
referring more particularly to the drawing wherein like characters of reference designate like parts throughout the several views , there is shown in fig1 a microwave oven 10 including an oven cavity 12 having a microwave oven mixer 14 which may be positioned therein through a door ( not shown ). the oven cavity is supplied with microwave oven energy from a magnetron 16 via a waveguide 18 . while the magnetron 16 may generate energy at any desired frequency , a frequency of about 2 . 45 kmh is particularly suitable . the cathode of magnetron 16 is supplied with filament heater power and anode voltage power at a voltage of , for example , 4000 volts from a high - voltage power supply 22 by suitable wiring while the anode of the magnetron 16 is ground . as is known in the art , the microwave oven further comprises a left opposing side wall 24 , a right opposing side wall 26 , a floor 28 , and a back wall 30 . in the cavity is a mode stirrer 20 for distributing microwave energy . in addition , fig1 shows the microwave oven mixer 14 in the operating position in a microwave oven 10 over a turntable 32 . the microwave oven mixer 14 contains a vertical mixing shaft 34 which extends downward into a cooking utensil 40 or container . the cooking utensil 40 rotates during the heating process causing food 42 to be mixed . this mixing process will be explained in further detail herein . referring now to fig2 there is shown side view of the microwave oven mixer 14 shown in fig1 . the microwave oven mixer 14 has a horizontal shaft 50 or arm which is attached to a left end suction cup 60 and to a right end suction cup 62 . although shaft 50 is shown in a horizontal orientation , shaft 50 could be oriented with an incline . the horizontal shaft 50 is made up of a left arm section 52 which telescopically surrounds a right arm section 54 . between the left arm section 52 and the right arm section 54 is a telescopic adjuster 56 . this telescopic adjuster 56 allows the horizontal shaft 50 to extend outward to enable the left end suction cup 60 and the right end suction cup 62 to make contact with walls 24 and 26 . once the suction cups 60 and 62 are extended , the telescopic adjuster 56 can be rotated to lock the left arm 52 and right arm 54 in place . located near the center of the horizontal shaft 50 is an adjustable support 58 . this adjustable support 58 allows the horizontal shaft 50 to support a vertical mixer shaft 34 . further , this adjustable support allows the vertical mixer shaft 34 to be raised or lowered . the adjustable support 58 holds the vertical mixer shaft 34 in a fixed position perpendicular to horizontal shaft 50 . the support 58 prevents the rotation of the vertical mixer shaft 34 . the vertical mixer shaft 34 extends downwardly and at its base connects to a removable mixing blade 76 or paddle . mixing blade 76 and shaft 34 are positioned to be inserted into the food 42 to be stirred . this mixing blade 76 would then mix the food 42 , the details of which will be explained later herein . referring now to fig3 there is an alternate embodiment of the downwardly extending shaft 34 shown in fig2 . this microwave oven mixer 14 contains the same elements as the mixer 14 shown in fig2 with the exception of mixing blade 76 . in place of the blade 76 is a closed loop end 78 . the closed loop end 78 makes contact with the food 42 in a container 40 . food 42 is mixed by contact with this closed loop end 78 , the details of which will be explained later herein . referring to fig4 an alternate embodiment of the microwave oven mixer 14 in a microwave oven cavity 12 with a built - in turntable 32 is shown . the microwave oven mixer 14 contains a support block 80 attached to horizontal shaft 50 . this support block 80 is secured to the back wall 30 of the oven 10 . the horizontal shaft 50 extends from support block 80 to the center of the oven cavity 12 and the center of the built - in turntable 32 . a verticle mixer shaft 34 extends downwardly into a bowl or cooking utensil 10 on turntable 32 . mixing blade 76 is attached to the end of the shaft 34 . mixing blade 76 is located within the utensil 40 . the actual mixing occurs when the turntable 32 rotates a container 40 holding food 42 . the food 42 then flows across blade 76 which is stationary , and mixes the food 42 . this mixing occurs while food 42 is being heated by microwave energy . the mixing blade 76 is easily detachable from the end of the shaft 34 . mixing blade 76 may be replaced with a variety of different blades for different applications and food types . the vertical mixing shaft 34 may be adjusted in a vertical direction . this vertical placement of the shaft 34 is controlled by lock screw 72 . another lock screw 82 secures the horizontal shaft 50 to support block 80 . referring to fig5 an alternative embodiment of mixer 14 is shown attached to a portable turntable 32 located within the microwave oven cavity 12 . a section unit 90 is attached to the base 94 of the turntable 32 . a vertical support shaft 100 is positioned next to the moving element of the turntable 32 on section unit 90 . the vertical support shaft 100 is secured to base 94 by a lock screw 92 or other type device . a mounting block 110 is located above the vertical support shaft 100 . this mounting block 110 has a hole in it . block 110 fits over the vertical support shaft 100 and can be moved up and down on the support shaft 100 . the mounting block 110 is secured to the vertical support shaft 100 by means of a locking screw 102 . mounting block 110 also attaches to horizontal shaft 50 . a horizontal shaft 50 is located directly over the turntable 32 . the mixer shaft 34 and the other components in fig5 function in the same ways as the like components , as described with reference to fig4 . fig6 is , a side view looking directly into microwave oven cavity . fig6 shows an added feature which will allow automatic vertical action of the mixing blade 76 to take place . in place of the vertical support shaft 100 is a hollow tube 200 . within the hollow tube 200 is a vertical upper cammed shaft 210 connected to a horizontal shaft 50 . also within hollow tube 200 and below upper cammed shaft 210 is a lower or rotating cammed shaft 220 . engraved on cammed shaft 220 is pin follower 228 . the surface of upper end of the rotating cammed shaft 220 matches the surface of lower end of the upper cammed shaft 210 . these shafts 210 and 220 touch near the bottom of the hollow tube 200 . in the side of the top of the hollow tube 200 is vertical slot 216 . a pin 218 is inserted through tube slot 216 into upper cammed shaft 210 , preventing rotation of upper cammed shaft 210 . pin 218 allows cammed shaft 210 to move only in a vertical direction . the hollow support tube 200 has a quadrant removed at 86 opposite the center of a drive wheel 230 . this allows the periphery 226 of the drive wheel to come in contact with drive surface 228 . the drive wheel 230 rotates on a permanently centered drive wheel shaft 240 and is in direct contact with rotating turntable 32 . a band of silicone or other similar material could be used on the outside diameter of the drive wheel 230 to ensure good contact to both turntable 32 and periphery 226 . the base of the turntable 32 is extended to support the drive wheel shaft 240 and the vertical hollow tube 200 . drive wheel 230 could also be geared at its follower 226 to ensure more positive action . here , periphery 226 is knurled to allow rotating cammed shaft 220 better contact with drive wheel 230 . a bearing 222 could be provided beneath the rotating cammed shaft 220 to allow smoother turning of the rotating cammed shaft 220 . when the turntable 32 rotates , it will turn drive wheel 230 which will turn the lower rotating cammed shaft 220 . the cammed end of shaft 210 rests on top of the cammed end of shaft 220 . rotating cammed shaft 220 , moves the upper cammed shaft 210 up and down through distance &# 34 ; x &# 34 ;. the mixing blade 76 travels up and down by the same amount that the upper cammed shaft 210 travels . movement of the blade 76 will further enhance the mixing action . the material used for all the mixing attachments shown should be transparent to microwave energy . in some cases , metal materials could be used ; however , each part should be evaluated on an individual basis for proper material choice , and designed for proper interaction with the microwave energy to which it would be exposed . this concludes the description of the preferred embodiments . a reading of by those skilled in the art will bring to mind many modifications and alternatives without departing from the spirit and scope of the invention . accordingly , it is intended that the invention only be limited by the following claims .	8
with reference to fig1 and 2 , a piece of multifunctional peripheral equipment 1 embodying the invention functions as a fax machine , a scanner , a copier , a video printer and another printer . the equipment 1 is fitted with an ink jet printer 26 for multicolored print . the printer 26 is a serial printer , which includes a print head unit 65 . the unit 65 is mounted on a carriage 66 , which can move in the direction a and the opposite direction . as shown in fig1 the equipment 1 includes a body 2 in the form of a box . a control panel 3 is mounted on the top of a front portion of the body 2 . the panel 3 has numeric buttons 3 a , a start button 3 b and other buttons or keys , which can be pushed for various operations . by manipulating some of the buttons , it is possible to set the present time as stated later . the panel 3 has a liquid crystal display 6 formed near its rear , which shows the setting of the equipment 1 , an operation message or the like , as the occasion demands . while the equipment 1 is standing by , the display 6 shows the present time . the equipment 1 also includes an original inlet 4 formed in the rear of the display 6 and an original outlet 9 formed under or below the control panel 3 . fax or copying originals can be stacked in the inlet 4 , from which they can be fed into the equipment body 2 . the originals can be scanned in the equipment 1 , and then be discharged into the outlet 9 , where they can be stacked . the equipment 1 further includes a cassette holder 5 formed in the rear of the original inlet 4 and a sheet outlet 10 formed under the original outlet 9 . the holder 5 can hold a sheet cassette ( not shown ), in which recording sheets are stacked . a recording sheet p can be fed from the cassette , and then be printed by the printer 26 . the printed sheet p can be discharged through the outlet 10 . adjacently on the left ( right in fig1 ) of and below the sheet outlet 10 , a video signal input terminal 7 is provided , which can be connected with a video camera . the image data output in the form of video signals from the camera can be sent into the equipment 1 , and then be printed by the printer 26 . the printer 26 includes a frame 63 , by which a horizontal platen roller 61 is supported rotatably to feed a recording sheet p perpendicularly to it . the roller 61 is parallel with a guide rod 62 , which is fixed to the frame 63 . the carriage 66 is supported slidably on the rod 62 , and can be moved along it by a timing belt 70 , which extends between a driving pulley 68 and a driven pulley 69 . the driving pulley 68 can be rotated by a carriage motor 67 , which is supported by the frame 63 near the left ( right in fig2 ) end of the frame . the print head unit 65 includes four print heads , and holds ink tanks 65 a , 65 b , 65 c and 65 d . the tanks 65 a - 65 d are filled with black , cyan , magenta and yellow inks , respectively , and each connected to one of the heads . each of the heads has a number of nozzles , through which ink can be ejected . the tanks 65 a - 65 d can be fitted to and removed from the unit 65 individually . when one or some of the tanks 65 a - 65 d are short of ink , only it or they can be replaced . the print head unit 65 is fitted with a thermister 29 a near the print heads . the thermister 29 a is part of a temperature detecting circuit 29 ( fig3 ). the thermister 29 a converts the temperature around the print heads into a value of electric resistance , and outputs the value to the circuit 29 . near the right ( left in fig2 ) end of the frame 63 , a recovery mechanism ( an apparatus for purging the print heads ) 71 is mounted on the frame 63 to recover normal ejection of ink . the mechanism 71 includes a suction cap 72 , which can cap all the print heads at a time to close all their nozzles . fixed to the back of the cap 72 is one end of a bar 73 for moving the cap 72 toward and away from the print head unit 65 . a lever 74 includes a cylindrical or circular portion in slidable contact with the other end of the bar 73 . when the lever 74 moves in the direction b from its position shown in fig2 the cap 72 moves forward with the bar 73 . after the carriage 66 moves to its position shown with two - dot chain lines in fig2 the movement of the lever 74 in the direction b causes the cap 72 to cap the heads of the unit 65 . the lever 74 can be moved in the direction b and the opposite direction by a cam 76 , which can be turned by a motor 75 . the recovery mechanism 71 includes a suction pump ( not shown ) for suction through a suction tube 77 , which is connected to the suction cap 72 . the pump can be driven by the cam 76 . with the cap 72 capping the print heads , the pump operation sucks ink out of the nozzles of the heads to recover normal ejection of ink . herein , a series of suction ( recovery ) actions for recovery of ink ejection is referred to as purging or purges . with reference to fig3 the equipment 1 includes a facsimile unit fu and a printer unit pu , which are interconnected through an interface 30 . the fax unit fu includes a cpu 11 , a rom 12 , a ram 13 , an eeprom 14 , a network control unit ( ncu ) 15 , a modem 16 , an encoder 17 , a decoder 18 , a scanner 19 , the control panel 3 , the lcd 6 , the video signal input terminal 7 , an original sensor 8 , a timing circuit 28 and the temperature detecting circuit 29 . these components are interconnected through a facsimile control circuit 20 . on the basis of signals transmitted and received through the ncu 15 , the cpu 11 controls the components connected to the fax controller 20 , and implements fax operation etc . the rom 12 stores the control programs to be executed by the equipment 1 . the stored programs cannot be altered . the ram 13 can store data , which can be altered . the eeprom 14 is a nonvolatile memory . the data stored in this memory can be altered , and is retained even after the power switch of the equipment 1 is turned off . the eeprom 14 includes a purge time memory 14 a , a purge interval memory 14 b , a high temperature counter 14 c and a low temperature counter 14 d . the purge time memory 14 a stores the time ( including the date ) at which the preceding purge was carried out . just after the nozzles are purged , the present time clocked by the timer 28 is written in the memory 14 a . the purge interval memory 14 b stores the regular interval at which the nozzles should be purged . for normal temperature between 10 and 35 centigrade around the print head unit 65 , this memory 14 b stores an initial value of five days as the purge interval . for abnormal temperature below 10 centigrade or above 35 centigrade around the print heads , the memory 14 b stores a value of three days as the interval . just after the nozzles are purged , the memory 14 b is reset for the initial value of five days . thereafter , if the temperature around the heads is and keeps abnormal , the content of the memory 14 b is changed to three days . once this content is changed to three days , it is not reset for the initial value of five days , even if the temperature returns to normal , until the nozzles are purged next . the purge interval and the abnormal temperatures might be determined suitably depending on ink type etc ., and might not be limited to the foregoing values and ranges . the high temperature counter 14 c stores the frequency of detection of abnormal temperature above 35 centigrade . the temperature detector 29 detects the temperature around the print heads , every time a process for changing the purge interval ( fig4 ) is carried out in the printer unit pu . if the detector 29 detects a temperature above 35 centigrade , the count of this counter 14 c increments by one . if this count exceeds twenty - four ( 24 ), the value of the purge interval memory 14 b is changed from five days to three days . this shortens the purge interval . just after the nozzles are purged , the count of the counter 14 c is cleared . the low temperature counter 14 d stores the frequency of detection of abnormal temperature below 10 centigrade . if a temperature below 10 centigrade is detected in the purge interval change process ( fig4 ), the count of this counter 14 d increments by one . if this count exceeds twenty - four ( 24 ), the value of the purge interval memory 14 b is changed from five days to three days . this shortens the purge interval . just after the nozzles are purged , the count of the counter 14 d is cleared as zero ( 0 ). the ncu 15 is connected through a telephone line 52 to another fax machine 51 . the ncu 15 can send a dial signal to the line 52 , and respond to a call signal from this line . the modem 16 can modulate and demodulate image data . the modulated data is transmitted through the ncu 15 to the fax machine 51 . the modem 16 can transmit and receive procedural signals for transmission control . the scanner 19 scans an original fed from the original inlet 4 into the equipment 1 . the encoder 17 encodes the image data from the scanner 19 etc . to compress them . the decoder 18 decodes the facsimile data received by the equipment 1 and other coded data . the original sensor 8 determines if an original is placed in the original inlet 4 . the timer 28 clocks the present time , and includes a battery 28 a to keep clocking the time even after the power switch of the equipment 1 is turned off . the timer 28 can be initialized through the control panel 3 . while the equipment 1 is standing by , the present time clocked by the timer 28 is output to the lcd 6 , which then functions as a clock display . just after the nozzles are purged , the present time is read out from the timer 28 by the printer unit pu , and written in the purge time memory 14 a . the temperature detector 29 detects the temperature around the print heads . as stated already , the thermister 29 a of the detector 29 converts the temperature into a value of electric resistance . on the basis of this value , the detector 29 outputs the temperature as digital data . the printer unit pu includes a cpu 21 , a rom 22 , a ram 23 , an interface 24 for a personal computer , a character generator 25 and the printer 26 . these components are interconnected through a printer control circuit 27 . the rom 22 stores the program of the purge interval change process ( fig4 ) and the program of a purge process ( fig5 ), which can be carried out in the printer unit pu . the rom 22 also stores the control programs to be executed by the cpu 21 . the ram 23 includes work memories , which can be referred to and updated when the cpu 21 executes programs . the ram 23 also includes a print memory for storing print data . the interface 24 for a personal computer may be a centronics ( parallel ) interface . the interface 24 is connected through a cable 54 to a personal computer 53 as the central unit of the recovery apparatus . the equipment 1 can transmit data to and receive data from the computer 53 through the cable 54 . the character generator 25 stores print characters and other vector fonts . in the main process of the printer unit pu , the purge interval change process is carried out regularly once an hour . this changing process can change the value of the purge interval memory 14 b , depending on the temperature around the print heads . with reference to fig4 the purge interval change process includes reading out the temperature measured by the temperature detector 29 ( s 1 ). this reading step is carried out when the power switch of the equipment 1 is turned on , or when one hour has passed after the preceding interval changing process . if this temperature is above 35 centigrade ( s 2 : yes ), the count of the high temperature counter 14 c increments by one ( s 3 ). if the count of the high temperature counter 14 c exceeds twenty - four ( 24 ) ( s 4 : yes ), it may be considered that the temperature was above 35 centigrade substantially for at least 24 hours . then , the value of the purge interval memory 14 b is changed from the initial value of five days to three days ( s 8 ). this makes the purge interval shorter than normal by two days . then , the process ends . if the count of the high temperature counter 14 c is 24 or less ( s 4 : no ), the process ends without changing the value of the purge interval memory 14 b . in this case , the purge interval is not changed to avoid too frequent purges , because it is considered that temporary abnormality of temperature does not affect the ejection of ink substantially . if the temperature is below 10 centigrade ( s 2 : no , s 5 : yes ), the count of the low temperature counter 14 d increments by one ( s 6 ). if the count of the low temperature counter 14 d exceeds 24 ( s 7 : yes ), it may be considered that the temperature was below 10 centigrade substantially for at least 24 hours . then , the value of the purge interval memory 14 b is changed from the initial value of five days to three days ( s 8 ). then , the process ends . if the count of the low temperature counter 14 d is 24 or less ( s 7 : no ), the process ends without changing the value of the purge interval memory 14 b . if the temperature ranges between 10 and 35 centigrade ( s 2 : no , s 5 : no ), it is normal . then , the process ends without changing the value of the purge interval memory 14 b and the counts of the counters 14 c and 14 d . the purge process is carried out in the printer unit pu before a printing process is carried out . the printing process is carried out when the equipment 1 prints data received by fax , data input from the computer 53 , or the like . with reference to fig5 the purge process includes calculating the elapsed time which has passed after the preceding purge ( s 11 ). the elapsed time is calculated from the present time read out from the timer 28 and the time read out from the purge time memory 14 a . as already stated , this memory 14 a stores the time at which the preceding purge was carried out . the calculated time is compared with the value of the purge interval memory 14 b , ( s 12 ). as a result of the comparison , if the elapsed time is equal to or shorter than the time stored in the purge interval memory 14 b ( s 12 : no ), it is judged that ink can be ejected normally . then , the purge process ends without purging the print heads . after this process ends , the printing process is carried out . because ink can be ejected in good condition , no defective print occurs . if the elapsed time is longer than the time stored in the purge interval memory 14 b ( s 12 : yes ), ink may be ejected defectively . then , the recovery mechanism 71 is operated to purge the nozzles ( s 13 ). after the nozzles are purged , the present time is read out from the timer 28 and written in the purge time memory 14 a ( s 14 ). next , the counts of the counters 14 c and 14 d are cleared ( s 15 ). further , the purge interval memory 14 b is reset for the initial value of five days ( s 16 ). thereafter , the purge process end . after this process ends , the printing process is carried out . because the purge process has restored the ejection of ink to normal , no defective print occurs . as stated above , the purge interval is changed suitably depending on the temperature around the print heads . it is therefore possible to purge the nozzles at a suitable time . this prevents the nozzles from being purged at too long interval , which may cause defective print . this also prevents the nozzles from being purged at too short interval , which accelerates the consumption of ink . as also stated , the suction cap 72 ( fig2 ) can close all the nozzles of the print heads at a time . it is therefore possible to purge all the nozzles at a time . it is considered that , if a long time has passed after the preceding purge , the nozzles are clogged substantially equally . by purging the nozzles at a time , it is possible to carry out the purge process before the printing process efficiently in a short time . the invention has been explained hereinbefore with reference to the preferred embodiment , but is not limited to it . obviously , various improvements and / or modifications may be made without departing from the spirit of the invention . as stated already , the suction cap 72 can cap the print heads at a time for suction for them all at a time . otherwise , the heads might be capped individually . as also stated , the purge time memory 14 a stores the time at which the preceding purge was carried out , and the purge interval memory 14 b stores the purge interval . the elapsed time is calculated from the present time clocked by the timer 28 and the time stored in the purge time memory 14 a . if the elapsed time is longer than the time stored in the purge interval memory 14 b , the nozzles are purged . another purge process embodying the invention includes storing the initial value of five days in the purge interval memory 14 b after purging the nozzles . in accordance with the timing of the timer 28 , the stored value is decreased . when this value is decreased to zero , it is inhibited from decreasing further , and the nozzles are purged . in this case , if the abnormal temperature below 10 centigrade or above 35 centigrade is detected 24 times , two days are subtracted from the value of the purge interval memory 14 b . if the result of the subtraction is a minus , it is replaced with zero .	1
aquatic bait blocks are 3 ounce to 16 ounce blocks of any desired shape and dimension . preference is for a 3 × 4 × 1 inch rectangular block . the bait blocks are formed by combining blends of liquid ingredients and dry ingredients . the liquid phase includes by weight condensed fish solubles , 5 - 25 %, and liquid molasses , 10 - 50 %. the dry ingredients by weight are ground peanut hulls , 0 - 35 %; ground limestone or salt , 0 - 35 %; dolomitic lime ( kemidol oxide ), 10 - 30 %; and water 0 - 14 %. formulas one and two are example formulas . formula three is for the production of white blocks which is advantageous with certain aquatic species . the bait block differs only in ingredient mix to the previously described blocks . the dry ingredients are monosodium phosphate , 10 - 60 %, and calcium oxide 3 - 15 %. liquid ingredients are water , 10 - 50 %, and condensed fish solubles 1 - 15 %. ______________________________________ percentformula # 1 # 2 # 3______________________________________ground corn -- 14 -- ground peanut hulls 13 -- -- limestone 18 -- -- monosodium phosphate -- -- 50dolomitic lime 18 25 -- calcium oxide -- -- 5condensed fish solubles 20 15 15molasses 25 46 -- water 6 -- 30______________________________________ there are alternative ingredients for condensed fish solubles and molasses . any animal by - products may replace condensed fish solubles . these may include fish meal , fish by - products , crustacean by - products , fish oil , meat by - products and poultry by - products . molasses may include any sugar - based product in liquid or dry state . mixtures of refined sugars and water may be used to replace molasses . when using molasseslike products in a dry state , water is added at 5 % to 10 % of the formula . normally , the cured product has about 9 % to about 12 % water . however , the amount of added water can advantageously be in the range of about 5 % to about 14 % and the total water content before curing is of the order of about 15 % to about 40 %. when molasses equivalents are employed , it is advantageous to maintain a degree brix of the same order as that of molasses . a value of at least 79 . 5 % brix is needed for either liquid molasses or blends of water and sugars or water and dried molasses . several additives may be used to enhance the attractant nature of natural ingredients . these are anise oil , monosodium glutamate , monosodium aspartate , potassium aspartate , l - lysine hydrochloride and glycine . fat may be added to the mix at 0 % to 5 % of the formula . fat may be advantageous to further control the rate of degradation by reducing the rate at which water penetrates the block . dolomitic lime is a blend of calcium oxide ( 58 %), magnesium oxide ( 38 %) and other mineral impurities . dolomitic lime is produced by heating dolomite ore in a kiln . the heat converts the calcium carbonate and magnesium carbonate to their oxide forms . calcium oxide can replace dolomitic lime in a range of 3 - 10 %. the ingredients are mixed in two phases in a continuous flow production system as shown in the attached drawing . the dolomitic lime and other dry ingredients are fed separately and blended in the dry mixer for 5 - 20 seconds . this dry mix is then mixed with the liquid ingredients in the wet mixer and discharged from the wet mixer into the filling machine . the filler dispenses the wet mix into cube trays at a rate of 30 - 90 pounds per minute . the filled cube trays are then stacked for cooling and later loaded into cardboard boxes . the boxes are advantageously wax - coated to protect from exposure to moisture . for optimum results , the combined mixing and filling time should not exceed 5 minutes . the blocks cure at ambient temperature in 6 to 24 hours resulting in a block having a water degradability time for 18 - 96 hours . the set - up time and rate of reaction can be varied by the level of dolomite lime relative to the level of sugar - based ingredient and added water . degradation time is a function of hardness and texture related to the ratios of the ingredients . the use of dolomitic lime or kemidol oxide provides an advantageous uniqueness to this molasses block technology . dolomitic lime is less reactive than calcium oxide . the slower reaction of dolomitic lime with sugar - based compounds provides for better control of mixing and curing time . this allows for a greater margin of error in the addition of the calcium oxide source without dramatically affecting the mixing time , curing time or block hardness . in the specific practice of the invention , and referring to the drawing , the dry feed ingredients are provided in a hopper 10 and delivered through a feeder 11 to a horizontally disposed dry mixer 12 . in analogous fashion , the chemical hardener , viz ., dolomitic lime or kemidol oxide in the illustration given is provided from a hopper 13 and introduced into the mixer 12 via a feeder 14 . after mixing is substantially complete , the dry mix is advantageously transferred to a wet mixer 15 which has a number of inlet ports . the ports 16 , 17 , 18 and 19 are advantageously used for molasses , condensed fish solubles , fat and water as required . after the wet mixing is complete , the product is delivered to a filler 20 from which cubes are developed in the trays carried by the conveyor belt 21 . while in the foregoing specification a detailed description of an embodiment of the invention , has been set down for the purpose of illustration , many variations in the details herein given may be made by those skilled in the art without departing from the spirit and scope of the invention .	8
referring now in more detail to the drawings , in which like numerals refer to like parts throughout the several views , fig1 shows a disk drive 10 in accordance the present invention . this invention is described with specific reference to a disk drive that electromagnetically stores and accesses information . however , this invention should also be understood as applicable to other types of disk drives that employ a sensor in close proximity with a rotating media disk to access that disk . as shown in fig1 the disk drive 10 comprises a plurality of vertically stacked media disks 12 in spaced apart relation with one another . preferably , the disk drive 10 comprises six media disks 12 . it will be understood by those skilled in the art , however , that the disk drive 10 may comprise a different number of media disks 12 and still fall within the scope of the present invention . the media disks 12 are mounted along their spindle 14 which defines a longitudinal axis for a cylinder having the media disks as circular sections thereof . preferably , the spindle 14 is comprised entirely of aluminum . a mounting collar 16 secures each media disk 12 in fixed relation to the spindle 14 . the spindle 14 is , at its top end , as shown in fig1 journaled within a free turning bearing 17 . the bearing 17 is recessed into a top 26 of the disk drive 10 . the bottom end of spindle 14 is connected to a motor mounting collar 19 of a motor 18 . the motor 18 is recessed in a bottom plate 28 of the disk drive 10 . each media disk 12 is concentricity bounded by a spacer ring 20 having a predetermined thickness . thus , the preferred embodiment of the present invention comprises six spacer rings 20 that each bound an associated media disk 12 . the spacer rings 20 are each a predetermined spacing distance greater in thickness than the media disks 12 . thus , structures that abut the spacer rings 20 are held in spaced apart relation with the thinner media disk 12 disposed therein . fig1 a is a detail of fig1 wherein it can be seen that the predetermined spacing distance ( sd ) is the difference between the thickness of spacer ring 20 and media disk 12 . therefore 0 . 5 sd , i . e ., one half the spacing distance , is the separation between a head mount disk 22 and the surface of media disk 12 upon which the heads write and from which they read . the spacer rings 20 are separated from one another by abutting head mount disks 22 . thus , the preferred disk drive 10 of the present invention comprises five head mount disk 22 disposed between the six spacer rings 20 . additionally , a head mount disk 22 is disposed above the uppermost spacer ring 20 and below the lowermost spacer ring 20 . as is explained in greater detail herein below , each of the head mount disk 22 has a plurality of electromagnetic heads ( not show in fig1 ) etched therein on each side of the head disk that faces the right surface of one of media disks 12 . one of the principal advantages of the present invention lies in the selection of a material for the head mount disk that is an appropriate substrate for fabrication of the necessary semiconductor circuitry for addressing individual heads as well as fabrication of the heads themselves by a ten micron etching process . this provides positioning of the heads spatial on the surfaces of head mount disk 22 and assures that the heads all lie in a single plane on the surface of the head mount disk . by employing this process of fabrication , the head to media spacing is determined by the predetermined spacing distance established by the difference between the thickness of spacer rings 20 and media disks 12 . the heads of the head mount disks 22 are retained a selected distance above the media disks 12 by the predetermined spacing distance of the spacer rings 20 . the uppermost head mount disk 22 and the lowermost head mount disk 22 are each separated by a spacer 70 from the top 26 and the bottom 28 of the disk drive 10 , respectively . a pair of securing pins 24 connect the head mount disks 22 in fixed relation with the spacer rings 20 and the spacers 70 . together , the spacer rings 20 , the head mount disks 22 , the spacers 70 along with the top 26 and the bottom 28 of the disk drive operate to seal the disk drive 10 from outside contamination . next , various components of the disk drive 10 of the preferred embodiment will be described . as shown by fig2 the media disk 12 is circular in shape with two parallel faces , 32a and 32b . the media disk 12 has a diameter d m , which is 3 . 907 inches in the preferred embodiment . this diameter is preferred because the resulting disk is not so large that the extremities droop and are in danger of striking a head mount disk 22 but is large enough to provide an ample area for storing information . it will be understood by those skilled in the art , however , that the diameter of the media disk can be varied within the scope of the present invention . the media disk of the preferred embodiment has a nominal thickness as shown as dimension t m . in the preferred embodiment this is 0 . 186 inches . an orifice 34 for mounting the media disk 12 to the spindle 14 is disposed at a center of the media disk 12 . the orifice 34 has a diameter of 0 . 772 inches . the media disk 12 comprises a ceramic substrate 30 coated at each of the parallel faces 32 with a magnetic film 36 . the ceramic substrate 30 may be aluminum oxide , or other materials that are non - conductive , have a low thermal coefficient , and have a modulus of elasticity that is typical of media disks . the magnetic film 36 is ferric in nature and is applied to the ceramic substrate 30 by standard sputter thinfilm deposition methods . the magnetic film 36 is deposited to a standard thickness and provides a medium that can be formatted into a plurality of concentric tracks ( not shown ) for storing information . each of the parallel faces 32 of the media disk comprises 1024 tracks with 144 sectors per track and 1042 kilobytes ( kb ) per sector . thus , each media disk 12 has approximately 307 megabytes ( mb ) of storage capacity . the preferred disk drive 10 that includes six media disks 12 , then , has approximately 1 , 843 megabytes ( mb ) of storage capacity . information storage on media disk 12 is accomplished in the same way as it is in conventional high density disk drives . the position of each head defines one of a plurality of concentric tracks on the media disk underlying the head . a particular angular position from a predetermined starting point for a track , various bit positions are defined logically by a timing circuitry running in synchronism with the rotation of the media disks . the various tracks are divided angularly into sectors , sectors being the smallest segment of information that can be read or written in a single operation . the bits of the sector are written by exciting the coil of the head associated with the track with a pattern of pulses of alternating polarity using conventional rll coding to store ones or zeros at desired positions within the bit sequence of the sector . as shown in fig3 the spacer ring 20 is annular in shape with an outside diameter d m , which is 5 . 321 inches in the preferred embodiment and an inside diameter d ih , which is 4 . 307 inches . thus , when a media disk 12 is disposed inside the spacer ring 20 , a gap of 0 . 2 inches exists between the circumferencal edge of the media disk 12 and the inside surface 21 of the spacer ring 20 . a pair of openings 40 are disposed at opposite ends of the spacer ring 20 for engagement with the securing pins 24 . preferably , the spacer ring 20 is of unitary construction comprising polymers , plexiglass , ceramics , non - ferric metals or a combination of these materials . it will be understood by those skilled in the art , however , that the spacer ring 20 may be formed , for example , by a plurality of distinct supports spaced at select intervals around the media disk . it will further be understood by those skilled in the art that a plurality of annulis can be used to form the spacer ring 20 , or part of the spacer ring 20 . the spacer ring 20 has opposite edges 38a and 38b and a predetermined housing thickness t h defined there between . the predetermined housing thickness t h is between 12 micro - inches ( 0 . 000012 inch ) and 24 micro - inches ( 0 . 000024 inch ) greater than the thickness of the media disk 12 . in the preferred embodiment , the predetermined housing thickness t h is 0 . 18602 inch , which is 20 micro - inches ( 0 . 00002 inch ) greater than the thickness of the media disk . that difference in thickness is a predetermined spacing distance in the preferred embodiment . due to the predetermined spacing distance , the face 32a of the media disk 12 is spaced apart from a plane of the edge 38a of the spacer ring 20 when the media disk 12 is disposed within the spacer ring 20 . similarly , the edge 32b of the media disk is spaced apart from a plane of the second edge 38b of the spacer ring 20 . as shown in fig4 the head mount disk 22 is circular in shape with opposite substantially planer surfaces 35 . because the head mount disks 22 abut the spacer rings 20 , the substantially planer surfaces 35 are retained a selected distance above or below the media disks 12 . thus , the substantially planer surfaces 35 cannot impact the media disk 12 . the selected distance between each surface 35 and media disk 12 is determined by the predetermined spacing distance . specifically , the selected distance is half the spacing distance because the media disks 12 are each vertically centered in the spacer rings 20 . thus , in the preferred embodiment , the selected distance between each substantially planer surface 35 and an opposing face 32 of a media disk 12 is 10 micro - inches ( 0 . 00001 inch ). the circular shape is preferred because the resulting head mount disk 22 extends across the entire 360 degrees of arc of an opposed media disk 12 . those skilled in the art will understand , however , that the shape of the head mount disk 22 may be varied within the scope of the present invention . the head mount disk 22 has a diameter d hm and a thickness t hm . in the preferred embodiment , the diameter d hm is 5 . 047 inches and the thickness t hm is 0 . 063 inches . this diameter is preferred because the outer ends of the resulting disk overlap the spacer ring 20 . it will be understood by those skilled in the art , however , that the diameter of the head mount disk can be varied within the scope of the present invention . an orifice 42 is disposed at a center of the head mount disk 22 . the orifice 42 has a diameter of 1 . 871 inches in the preferred embodiment . a pair of openings 40 are disposed at opposite ends of the head mount disk 22 for engagement with the securing pins 24 . the head mount disk 22 comprises a substrate 44 that can be constructed polymer , plexiglass , ceramic or non - ferric metal , such as aluminum . it is preferred , however , that the substrate of the head mount disk 22 be a ceramic that is the same as that of the media disk 12 because , in such a case , both disks will necessarily have the same thermal coefficient of expansion . those skilled in the art will understand that the same result can be achieved by constructing the head mount disk 22 and the media disk 12 of different substrate materials that nevertheless have the same , or substantially similar , thermal coefficients of expansion . because the head mount disks 22 and the media disks 12 have the same , or a substantially similar , thermal coefficients of expansion , they expand and contract as a unit . as a result , the surface mounted heads 47 of the head mount disks 22 move together with tracks of the media disks 12 in response to temperature variations . therefore , the heads 47 remain accurately positioned over the tracks of the media disk 12 despite temperature variations . a head assembly 45 is etched in the ceramic substrate 44 on each surface 35 disposed toward a media disk 12 . thus , the five head mount disks 22 disposed between the six spacer rings 20 ( fig1 ) have head assemblies 45 surface mounted onto both substantially planer surfaces 35 . the upper and lowermost head mount disks 22 , however , have a head assembly 45 etched into only one of surfaces 35 . because the head assemblies 45 are flush to the surface 35 of head mount disk 22 , the head assemblies 45 are retained the selected distance of 0 . 001 inch from opposing faces 32 of media disks 12 . each head assembly 45 comprises a plurality of heads 46 and demultiplexer circuits 48 . fig6 is a detailed drawing of a portion of head mount disk 22 shown in fig5 . as may be appreciated from viewing fig5 and 6 together , each head assembly includes fourteen one - of - 64 demultiplexer chips 48 , each which is associated with a radially extending spoke comprising 64 read / write heads . each of demultiplexers 48 is a one of 64 demultiplexer fabricated using complementary oxide metal semiconductors ( cmos ) technology and ten micron thick film techniques . one of 64 demultiplexer chips , the fabrication thereof , is well known to those skilled in the art . as best shown in fig6 each of the 64 output lines from demultiplexers 48 is connected to one head 46 via one of lines 54 . there are 14 spokes and 14 demultiplexers chips on each side of head mount disk 22 for a total of 896 read / write heads . as illustrated in fig5 it is considered preferable to fabricate the demultiplexers in clusters and route sense lines 54 through separate layers of the substrate of disk 22 . however , the radially extending spokes of heads 46 can be distributed angularly around surface 35 of disk 22 in any manner desired . there may be situations in which it will be preferable to dispose demultiplexers chips 48 between spokes of heads 46 for easier interconnection . it is basically a trade off between the routing of metalization layers required to connect the demultiplexer chips to the heads and the number of layers required to connect the inputs to the demultiplexers to an external connection ( not shown ) to a disk controller . because of the high density of the heads in the preferred embodiment and the limitations of photo reproducible patent specification drawings , it may not be clear from the accompanying drawing figures that each of heads 46 is disposed at a different radial distance from the center of disk 22 . however , in the preferred embodiment this is the case and each of heads 46 on one of the fourteen spokes of a head assembly 45 is offset so as to be disposed of the unique radial distance from the center of disk 22 , thus defining one and only one track on its associated media disk . while not shown in the drawings , the physical interconnection between a disk drive controller and the head mount disk are accomplished with 16 line ribbon cable . metallized contacts to precision pin drilled terminals filled with 2k to 8k gold constitute the preferred apparatus for connecting the head mount disk to a conventional disk controller circuit . fig7 shows a partial detail of a typical read / write head control circuit . each head has a coil 56 fabricated as a part thereof connected to lines 54 and the emitter of phototransister 68 which forms a part of an optical isolator 64 . during a write operation , the source of encoding pulses ( not shown ) is connected to line 54 and current pulses are passed through coil 58 to write a sector on the associated track . photo diode 66 is controlled by six input nand gate 62 which thus decodes the particular one head of the 64 on each spoke for reading or writing . during read operations a sense amplifier is connected between terminals 54 and 54 &# 39 ; and the data constituting a sector of the associated track is read from the media disk in a conventional manner . in operation , the motor 18 rotates the spindle 14 and thus the media disk 12 at 3600 to 7400 revolutions per minute ( rpm ). thus , the media disks 12 complete a rotation every milliseconds . turning next to fig8 a and 8b , an additional inventive aspect of the preferred embodiment is illustrated . in principle , this aspect of the present invention could be applied to more conventional disk drives . however , there are physical aspects of embodiments of the present invention that make it a particularly suitable environment for a variable pulse with clocking arrangement as is used in the preferred embodiment . fig8 a illustrates the physical principle involved . as is always the case with rotating media with spiral information tracks or radially disposed information tracks , the linear speed of the media under the transducer increases as the distance from the center of the rotating media increases . therefore , considering fundamental principles , more information can be stored on outer tracks than on inner tracks for a specified angular segment of the media since a greater linear distance is available . as most rotating media , conventional disk drives have employed the expedient of a constant bits per unit angle for storage , irrespective of the radial location of the tracks in which information is stored . in order to take full advantage of the capability of the media , the preferred embodiment of the present invention employs an arrangement in which the information storing portion of the surface of media disk 12 is divided into a plurality of areas defined by radial distance from the center of the disk . the goal is to maintain the number of information bits per unit arc length of the tracks at nominally a constant . turning to fig8 a , line 71 shows the innermost track on the disk at r 1 . radial line 72 shows a track 75 at radius r 2 from the center , r 2 being twice of the length of r 1 . for tracks line at this radial distances between r 1 and r 2 , the basic bit clocking rate is employed and thus the minimum arc length per bit allocation is determined by the basic bit rate , the rotational speed of the disk , and the distance r 1 . for tracks lying on or outside radius r 2 , the bit clock speed is double . therefore , twice as much information per physical track is packed onto the outer tracks of the disk . from the relationship of r 1 , r 2 , it will be apparent that the arc length per bit is the same for the tracks lined at the respective radii . the preferred embodiment thus defines multiple logical tracks lying in the same physical track for conventional decoding techniques in which a constant number of sectors per track , with the sectors having a constant number of bits , are employed in the addressing scheme for the disk drive . fig8 b illustrates in principle the timing circuitry employed for writing a sector to the media disk illustrated in fig8 a . line 80 carries a bit clocking signal at twice the basic bit rate , the basic bit rate being that employed for the inner tracks of the disk . this signal is provided to one input 81 of a multiplexer 82 . the signal on line 80 is also provided as an input to a divide by two flip flop 85 , the output of which appears on line 86 connected to a second input 87 of multiplexer 82 . an inner / outer control line 88 is connected to a select input 89 of multiplexer 82 to control whether the signal at input 81 on the signal at input 87 is provided as an output on line 90 to a shift input 91 of a sector buffer 92 into which data to be written to a sector has been placed . the source of data is line 95 shown as coming from a disk controller ( not illustrated ). the output of the sector buffer is shifted out on line 96 under the control of the signal at shift input 91 in a conventional manner . the signal on line 88 is generated by simply decoding high order address bits for the tracks , i . e ., from the head demultiplexers . therefore , when the outer tracks are selected , the b input 81 is connected to shift input 91 of buffer 92 so that the data pulse width is of haft the duration that they are when data is written to the inner tracks . however , the arc length of travel along the surface of media disk 12 stays substantially the same since an outer track is twice the distance from a corresponding inner track . it should be understood that while this aspect of the present invention is illustrated with the media disk divided into two segments with a two to one ratio of pulse widths , that other subdivisions of the disks and other relationships pulse widths may be employed so long as the pulse width is shortened as the radial distance from the center of the media disk 12 increases . the foregoing description of the preferred embodiment provides the advantages described and fulfills the above - described needs . however , those skilled in the art will appreciate that the rapidly rotating , closely spaced , large surface areas of the media disks and head mount disks will create significant forces from the phenomenon of wind shear on both the disks and the bearings of the preferred embodiment . while it is believed the same are not necessarily debilitating , it may be more economical to manufacture a design subject to less wind shear . this consideration has lead to the invention of the alternate embodiment described herein and shown in fig9 a and 9b . in this embodiment , head to media disk spacing is reduced to zero by providing a plurality of small closely spaced lash heads that extend above or below ( depending on the relative orientation of the disks ) the head mount disk to contact the media disk . since the total contact area between the lash heads and the media disks is a small fraction of the total area of the head mount disk , the wind shear is significantly reduced in this embodiment . in the alternate embodiment of the present invention , shown by fig9 a and 9b , a head mount disk 22 &# 39 ; comprises a plurality of lash heads 46 &# 39 ; that extend to make contact with a media disk 12 &# 39 ;. the media disk 12 &# 39 ; of this embodiment is the same as the media disk 12 of the first embodiment except that it is preferably 3 . 0 inches in diameter . the head mound disk 22 &# 39 ; and a spacer ring 20 &# 39 ; are proportionally sized to accommodate the smaller media disk 12 &# 39 ;. the lash heads 46 &# 39 ; are radially disposed on the head mount disk 22 &# 39 ; such that each head 46 &# 39 ; is a unique radial distance from the center of the disk 22 &# 39 ; and defines one and only one track on its associated media disk . in the preferred embodiment , the head mount disk 22 &# 39 ; has 1024 lash heads 46 &# 39 ; per side . thus , the head mount disk 22 &# 39 ; configures 1024 tracks per side of an associated media disk 12 &# 39 ;. each track includes 144 sectors with 1042 kb per sector . as a result , each media disk 12 &# 39 ; has approximately 307 mb of storage capacity , which is the same as that of the larger media disk 12 in the first embodiment . the same storage capacity is achieved on the smaller media disk 12 &# 39 ; by spacing the tracks closer together , which is possible in this embodiment due to the lack of space between the lash heads 46 &# 39 ; and the media disk 12 &# 39 ;. because the lash heads 46 &# 39 ; extend to make contact with the media disk 12 &# 39 ;, the head mount disk 22 &# 39 ; may be spaced further from the media disk 12 &# 39 ; than in the first embodiment . as a result , this embodiment is preferred for many applications in which wind shear between rapidly rotating media disks and closely spaced head mount disks is a concern . fig9 a is a cut away fragmentary view of a disk drive of this embodiment , in which the distances are greatly exaggerated such that it can be seen that the predetermined spacing distance ( sd &# 39 ;) is the difference between the thickness of spacer ring 20 &# 39 ; and media disk 12 &# 39 ;. therefore 0 . 5 sd &# 39 ;, i . e ., one half the spacing distance , is the separation between a head mount disk 22 &# 39 ; and the surface of media disk 12 &# 39 ; upon which the heads write and from which they read . the separation between the head mount disk 22 &# 39 ; and the media disk 12 &# 39 ; is between 0 . 010 and 0 . 014 inches . thus , the spacer ring 20 &# 39 ; is between 0 . 020 and 0 . 028 inches greater in thickness than the media disk 12 &# 39 ;. in the preferred embodiment , the separation between the head mount disk 22 &# 39 ; and the media disk 12 &# 39 ; is 0 . 012 inches . as a result , the predetermined housing thickness is 0 . 024 inches greater in thickness than the media disk 12 &# 39 ;, which is 0 . 186 inches thick , for a total thickness of 0 . 210 inches in the preferred embodiment . as shown best by fig9 b , in which the distances are greatly exaggerated in order that the details may be clearly represented , each lash head 46 &# 39 ; comprises a cylinder 102 extending from the head mount disk 22 &# 39 ;. the cylinder extends from the head mount disk 22 &# 39 ; at an angle . o slashed . from a perpendicular in the direction of travel of the media disk 12 &# 39 ;. the angle of . o slashed . is preferably between 10 and 30 degrees . the cylinder 102 can be made of ferric metals , stainless steel , polymer with ferric pregnation , or other materials that produces a magnetic field by induction . the cylinder 102 extends a length of l e from the head mount disk 22 &# 39 ;. the length l e is sufficient to produce a slight flex in the cylinder 102 when abutted against the surface of the media disk 12 &# 39 ;. that flex biases the cylinder 102 toward the media disk 12 &# 39 ; to ensure constant contact between the cylinder 102 and the media disk 12 &# 39 ;. thus , the cylinder 102 should be made of materials that have a flexible nature . in the preferred embodiment , the cylinder 102 is plug gauge wire that is 0 . 001 +/- 0 . 0005 inches in diameter and 0 . 045 inches in total length . the cylinder 102 wire is preferably made of a standard boron / neodium mix that is typical in standard read / write heads . of that length , the wire extends 0 . 015 inches , i . e . l e , from the head mount disk 22 &# 39 ; at an angle , i . e . . o slashed ., of 20 degrees . thus , for a separation of 0 . 012 inches between the head mound disk 22 &# 39 ; and the media disk 12 &# 39 ;, the wire is 0 . 0012 inches longer than necessary to make contact with the media disk 12 &# 39 ;, which creates a slight flex in the wire . the cylinder 102 is wrapped by a pair of interwrapped coils 104 wired in opposing polarity . in the preferred embodiment , the coils 104 are made of 88 gauge copper wire with a standard polymer installation coating . the lash head 46 &# 39 ; is connected to a read / write head control circuit and , from there , to a demultiplexer as described above for the first embodiment . the remaining feature of this embodiment are the same as those for the first embodiment . from the foregoing description of the preferred embodiments and the several alternatives , other alternative constructions of the present invention may suggest themselves to those skilled in the art . therefore , the scope of the present invention is to be limited only by the claims below and equivalents thereof .	6
fig1 and 2 show an intraocular lens 11 which comprises a circular optic 13 and fixation members 15 and 17 . the optic 13 may be constructed of rigid biocompatible materials , such as polymehtylmethacrylate ( pmma ), or flexible , deformable materials , such as silicones , deformable acrylic polymeric materials , hydrogels and the like which enable the optic to be rolled or folded for insertion through a small incision into the eye . in this embodiment , the fixation members 15 and 17 are fine hair - like strands or filaments which are attached to the optic 13 using conventional techniques . the fixation members 15 and 17 may be constructed of a suitable polymeric material , such as pmma or polypropylene . alternatively , the fixation members 15 and 17 may be integral with the optic 13 . the optic 13 and the fixation members 15 and 17 may be of any desired configuration , and the configurations illustrated are purely illustrative . the optic 13 has a central zone 18 , inner and outer annular near zones 20 and 22 and annular far zones 24 and 26 . in this embodiment , the central zone 18 is circular . the annular zones 20 - 26 circumscribe the central zone 18 , and are concentric and coaxial with the optic 13 . the zones 18 - 26 are used in describing the vision correction power of the optic 13 , and they are arbitrarily defined . thus , the peripheries of the zones 18 - 26 and the number of zones may be selected as desired . however to facilitate describing the optic 13 , the peripheries of the annular zones 20 - 26 are considered to be the major zero crossings in fig5 . although the boundaries of the zones 18 - 26 are indicated by phantom lines in fig1 it should be understood that the optic 13 has no such lines in any of its surfaces and that these lines constitute reference lines which define the zones . in the embodiment of fig2 the optic 13 has a convex anterior surface 28 and a planar posterior surface 30 ; however , these configurations are merely illustrative . although the vision correction power may be placed on either of the surfaces 28 or 30 , in this embodiment , the anterior surface 28 is appropriately shaped to provide the desired vision correction powers . fig5 shows a preferred manner in which the vision correction power of the optic 13 varies from the center or optical axis 32 of the optic to the circular outer periphery 34 of the optic . a preferred power distribution curve for a corneal inlay ( corneal inlay lens ) may be similar , or identical , to the curve of fig5 . in fig5 the vertical or “ y ” axis represents the variation in diopter power of the optic 13 from the baseline or far vision correction power , and the “ x ” or horizontal axis shows the distance outwardly , the radial distance , from the optical axis 32 , for example , in millimeters . thus , the zero - diopter or baseline power of fig5 is the power required for far vision for an iol . the power variation shown in fig5 is applicable to any radial plane passing through the optic axis 32 . in other words , the power at any given radial distance from the optical axis 32 is the same . the central zone 18 extends from the optical axis 32 to a circular periphery 36 , the inner annular far zone 24 is considered as extending from the periphery 36 to a circular periphery 38 , inner annular near zone 20 is considered as extending from the periphery 38 to a circular periphery 40 , the outer annular far zone 26 is considered as extending from the periphery 40 to the circular periphery 42 , and the outer annular near zone 22 is considered as extending from a periphery 42 to a circular periphery 44 . the annular zone 27 extends from the periphery 44 radially outwardly to the outer periphery 34 of the optic 13 . as shown in fig5 the vision correction power crosses the “ x ” axis or baseline at the peripheries 36 , 38 , 40 , 42 and 44 . as shown in fig5 the vision correction power varies progressively and continuously from the baseline diopter power at the optical axis 32 to an apex 48 and then decreases continuously and progressively from the apex 48 back to the baseline diopter correction at periphery 36 . the apex 48 is closer , in terms of radial distance , to the optical axis 32 than to the periphery 36 . as illustrated , apex 48 is located away from the optical axis 32 about 30 % of the total radial distance between the optical axis and the circular periphery 36 . the vision correction power then decreases continuously and progressively to a negative diopter power at a periphery 50 . the negative diopter power at the periphery 50 is of less power than is required for far vision and may be considered as a far , far vision correction power . from the periphery 50 , the vision correction power increases continuously and progressively through the periphery 38 into the inner annular near zone 20 . of course , the diopters shown on the ordinate in fig5 are merely exemplary , and the actual correction provided will vary with the prescription needs of the patient . within the inner annular near zone 20 , the vision correction power varies continuously and progressively from the periphery 38 to an inner end 52 of a plateau 54 . the vision correction power at plateau 54 is considered substantially constant although some variation may occur . the plateau 54 has an outer end 56 . at outer end 56 , the vision correction power begins a relatively rapid , in terms of diopters changed per unit of radial distance on the optic 13 , progressive and continuous decrease to point 58 which has a diopter power equal to about 60 % of the average diopter power of plateau 54 . the radial width of plateau 54 is equal to about 65 % of the radial width , or distance along the y - axis in fig5 between points 52 and 58 . the vision correction power decreases less rapidly ( relative to the rate of power decline between points 56 and 58 ), continuously and progressively from point 58 back to the periphery 40 at the baseline . with continued reference to fig5 the vision correction power from periphery 40 continuously and progressively decreases to point 60 in far zone 26 . from point 60 the vision correction power continuously and progressively increases to apex 62 . the vision correction power then decreases to point 64 at which the vision correction power is equal to that at point 60 . the vision correction power continues to decrease continuously and progressively to point 66 and then increases continuously and progressively to periphery 42 . in far zone 26 , apex 62 is located radially closer to point 60 then to point 64 . in particular , point 62 is located about 30 % of the radial distance from point 60 relative to the total radial distance between points 60 and 64 . in the outer annular near zone 22 , the vision correction power increases continuously and progressively from the periphery 42 to the inner end 68 of plateau 70 . the vision correction power at plateau 70 , which is relatively narrow , increases progressively from inner end 68 to outer end 72 of plateau 70 . from the outer end 72 , the vision correction power decreases continuously and progressively to periphery 44 . the vision correction power remains substantially constant at or about the baseline diopter power from periphery 44 to the periphery 34 of optic 13 . the outer near zone 22 includes plateau 70 with progressively increasing optical powers . these increasing powers in plateau 70 , together with the relative narrowness of outer near zone 22 is believed to be effective to diffuse the halo caused by passing light to the outer near zone 22 . by way of comparison and to further illustrate the present invention , fig4 shows the manner in which the vision correction power of a prior art multifocal optic varies from the optical axis of the optic . the zones of the prior art optic in fig4 which correspond to zones of optic 13 in fig5 are identified by the same reference numeral with the addition of the letter “ a ”. with reference to fig4 the prior art optic , referred to as 13 a , has the same baseline diopter power as does optic 13 . the central zone 18 a extends from the optical axis 32 a to a circular periphery 36 a . the inner annular far zone 24 a is considered as extending from the periphery 26 a to the circular periphery 38 a , the inner annular near zone 20 a is considered as extending from the periphery 38 a to the circular periphery 40 a . the outer annular far zone 26 a is considered as extending from the periphery 40 a to the circular periphery 42 a and the outer annular near zone 22 a is considered as extending from the periphery 42 a to a circular periphery 44 a . as shown in fig4 the vision correction power includes major crossings of the “ x ” axis or baseline at the peripheries 36 a , 38 a , 40 a , 42 a and 44 a . the crossings of the baseline within outer far zone 26 a are not considered major . regarding the differences between the vision correction power of optic 13 relative to the vision correction power of optic 13 a , reference is first made to central zones 18 and 18 a . the primary difference between central zones 18 and 18 a relates to the positioning of the apexes 48 and 48 a . in particular , as noted above , apex 48 is located radially closer to the central axis 32 than to periphery 36 . this is contrasted to the positioning of apex 48 a which is located closer to the periphery 36 a than to the central axis 32 a . this difference is believed to is provide optic 13 ( and iol 11 ) with enhanced performance in viewing near objects , relative to such performance of optic 13 a . another substantial difference between optic 13 and optic 13 a relates to inner annular near zones 20 and 20 a . thus , whereas inner annular near zone 20 a of optic 13 a includes a plateau 54 a which has a substantially constant optical power throughout , plateau 54 is relatively abbreviated and zone 20 includes a region between outer end 56 of plateau 54 and periphery 58 which has a progressively and continuously decreasing optical power . the configuration of inner annular near zone 20 relative to inner annular near zone 20 a is believed to reduce the apparent or perceived size of the halo caused by passing light to the near zone 20 relative to the halo caused by passing light to the zone 20 a . a further substantial distinction between optics 13 and 13 a relates to the variation in vision correction power in outer far zones 26 and 26 a . thus , whereas zone 26 a is only slightly varied in vision correction power relative to the baseline diopter power . the vision correction power in zone 26 includes substantially reduced optical powers , as described previously . the vision correction power of zone 26 is believed to provide increased vision performance in viewing distant objects in dim light or night time relative to the performance obtained with zone 26 a . an additional substantial difference between optic 13 and optic 13 a relates to the outer annular near zones 22 and 22 a . specifically , zone 22 is substantially radially more narrow or smaller than is zone 22 a . in addition , zone 22 a has a relatively wide plateau 70 a which includes a substantially constant optical power . in contrast , the plateau 70 of zone 22 includes progressively increasing vision correction powers . optic 13 with zone 22 diffuses or makes less apparent the halo caused by passing light to zone 22 relative to the halo caused by passing light to zone 22 a of optic 13 a . as a further illustration of the differences between the optic 13 and optic 13 a , reference is made to fig6 and 7 which are schematic illustrations of a distant object viewed during night time conditions using optic 13 a and optic 13 , respectively . referring to fig6 viewing the distant object during night time with optic 13 a provides a central image , a halo extending away from the central image and additional random light scattering extending radially beyond the halo . referring to fig7 viewing the distant object during night time with optic 13 provides a central image of higher quality than in fig6 . in addition , the halo in fig7 extending away from the central image is substantially smaller or reduced in size . further , substantially no light scattering beyond the halo is apparent radially outwardly from the halo is apparent in fig7 . overall , the image provided by optic 13 ( fig7 ) is superior to the image provided by optic 13 a ( fig6 ). fig3 a and 8 show a contact lens 111 constructed in accordance with the teachings of this invention . the contact lens 111 is sized and configured to be carried or worn on a surface of the eye . optically , the contact lens 111 may be substantially identical to the optic 13 of fig1 and 5 in all respects not shown or described herein . portions of the figures relating to the contact lens 111 which correspond to portions of the figures relating to the intraocular lens 11 are designated by corresponding reference numerals increased by 100 . optically , the contact lens 111 has a central zone 118 , annular near zones 120 and 122 , annular far zones 124 and 126 and outer peripheral zone 127 which correspond , respectively , to the zones 18 - 27 of the intraocular lens 11 . in general , the magnitude of the vision correction powers , relative to the baseline diopter power , is reduced in the contact lens 111 relative to the magnitude of the vision correction powers in the optic 13 of iol 11 . the contact lens 111 has a convex anterior surface 128 and a posterior surface 130 which is concave and configured to the desired shape of the eye of the wearer . of course , the corrective powers could be provided on the posterior surface 130 , if desired . optically , the contact lens 111 is very similar to the optic 13 of intraocular lens 11 . the primary difference between the optic 13 and the contact lens 111 relates to the configuration of the inner near zone 120 . specifically , with reference to fig8 inner near zone 120 includes a plateau 154 having an inner end 152 and an inner region 68 which has a substantially constant vision correction power . however , the region 70 of plateau 154 extending radially outwardly from inner region 68 includes vision correction powers which increase continuously and progressively to apex 72 . the vision correction power radially outwardly from apex 72 decreases continuously and progressively to point 158 . thereafter , the vision correction power decreases continuously and progressively toward the baseline diopter power . the vision correction power at point 158 is approximately 60 % of the vision correction power at the apex 72 . in addition , the apex 72 is located away from inner end 152 about 70 % of the total radial distance between point 152 and point 158 . the above - noted configuration of inner near zone 120 reduces the size of the halo caused by passing light to zone 120 relative to the halo caused by passing light to a similar inner near zone which has a substantially constant vision correction power across the entire distance from point 152 to point 158 . fig9 shows an alternate iol 211 constructed in accordance with the teachings of the present invention . except as expressly described herein , iol 211 is similar to iol 11 . portions of iol 211 which correspond to portions of iol 11 are designated by the corresponding reference numerals increased by 200 . with reference to fig9 the major difference between iol 11 and iol 211 relates to the configuration of outer far zone 226 . specifically , outer far zone 226 begins at circular periphery 240 and decreases continuously and progressively to apex 88 which is located substantially equal radial distances from periphery 240 and circular periphery 242 . from apex 88 , the vision correction power increases continuously and progressively to the periphery 242 . outer far zone 226 is effective to enhance the performance characteristics of the lens when viewing a distant object in dim light or at night time . in addition , outer far zone 226 , or an outer far zone configured similarly to outer far zone 226 can be included in place of either outer far zone 26 in optic 13 of intraocular lens 11 or in place of an outer far zone of a contact lens , such as outer far zone 126 of contact lens 111 . the present multifocal ophthalmic lenses provide substantial benefits , such as image quality when viewing a distant object in dim light or night time . the present lenses mitigate against the halos which are apparent or perceived as a result of causing light to pass to the outer near zone or zones of such lenses , relative to lenses including an outer near zone or zones which have substantially constant vision correction powers . moreover , the present enhanced lenses can be cost effectively produced using conventional and well known techniques . thus , the present lenses provide substantial benefits with few or no significant adverse effects . while this invention has been described with respect to various specific examples and embodiments , it is to be understood that the invention is not limited thereto and that it can be variously practiced within the scope of the following claims .	0
turning now to the drawings , indicated generally at 10 is a setting tool constructed in accordance with the present invention . a well tool or packer 12 is mounted on the lower end of the setting tool . an adapter mandrel 14 is substantially cylindrically shaped and includes threads 16 for threadably engaging the setting tool and packer combination to an adapter of a tubing string ( although a string of drill pipe will work equally well ) for lowering into a well bore . as will be explained in detail herein , setting tool 10 is constructed to set packer 12 in a well bore responsive to pressurization of the tubing string . thereafter , the tool may be lowered onto the packer , as desired , to provide fluid communication between the well bore beneath the packer and the tubing string . adapter mandrel 14 includes a second set of threads 18 at the lower end thereof . threads 18 are threadably engaged with internal threads on a coupling 19 . the coupling 19 connects adapter 14 to a cylindrically shaped piston case 20 via threads 22 . the piston case includes a bore 24 which permits fluid communication between the interior and the exterior of the case . the lower end of the piston case is threadably engaged to an upper annular joining nipple 26 via threads 28 . the joining nipple includes a radially outer surface 30 and a radially inner surface 32 . an annular ring 34 is formed about the circumference of surface 32 . an o - ring 35 provides a sealing surface about the radial inner side of ring 34 . o - rings 36 , 38 provide a fluid - tight seal between the juncture of nipple 26 with piston case 20 and between the juncture of the nipple with a lower piston case 40 , respectively . the lower piston case is joined to nipple 26 via threads 42 . piston case 40 is substantially identical to piston case 20 and includes a bore 44 like bore 24 in piston case 20 . the lower end of piston case 40 is threadably engaged via threads 46 with a lower annular joining nipple 48 . nipple 48 is substantially identical to joining nipple 26 and includes an annular ring 50 like ring 34 in nipple 26 . adapter mandrel 14 , coupling 19 , piston case 20 , joining nipple 26 , piston case 40 , and joining nipple 48 , all comprise the upper portion of what is referred to herein as a first tubular portion . these components provide a generally cylindrical outer sleeve which is attached via adapter mandrel 14 to the tubing string adapter . description will now be made of components which make up the upper part of what is referred to herein as a second tubular portion . the second tubular portion includes an upper sleeve 52 , such being cylindrically shaped and further being in sealing engagement , via an o - ring 54 , with the lower radially inner surface of coupling 19 . the lower end of upper sleeve 52 includes a widened diameter portion 56 such being in threaded engagement with an upper piston 58 via threads 60 . the upper piston is generally annularly shaped and includes an o - ring 62 for sealing the radially outer surface of the piston to the radially inner surface of piston case 20 . threads 64 formed about the lower portion of upper piston 58 engage the piston to a middle sleeve 66 . the middle sleeve includes a bore 68 . bore 68 provides fluid communication between the interior of middle sleeve 66 and an annular chamber 69 formed between upper joining nipple 26 and upper piston 58 . a set screw 70 is received within a threaded bore in upper piston 58 and abuts against the radially outer surface of middle sleeve 66 to fix the position of the upper piston with respect to the middle sleeve . middle sleeve 66 includes at its lower end a widened diameter portion 72 including threads 74 for engaging a lower piston 76 . the lower piston is substantially identical to piston 58 . the lower piston is threadably engaged via threads 78 to a lower sleeve 80 . the upper and lower pistons are referred to herein as piston means . lower sleeve 80 includes a bore 82 formed between its interior and exterior surfaces . bore 82 provides fluid communication between the interior of sleeve 80 ( and hence the tubing string connected to adapter mandrel 14 ) and an annular chamber 84 formed between lower nipple 48 and lower piston 76 . lower joining nipple 48 is threadably engaged via threads 86 with a substantially cylindrical setting sleeve body 88 . the setting sleeve body includes a bore 90 between its interior and exterior , such being formed beneath threads 86 . setting sleeve 88 also includes an annular ridge 92 formed about the radially inner surface of the setting sleeve body . the annular ridge includes a substantially cylindrical surface 94 formed at the top of the ridge about the circumference thereof . the lower end of setting sleeve body 88 includes threads 96 and an o - ring 98 for sealingly connecting the setting sleeve body to a substantially cylindrical setting sleeve 100 . a set screw 102 is received within a threaded bore formed through the setting sleeve body beneath threads 96 . the set screw abuts against the radially outer surface of setting sleeve 100 to fix the relative positions of the setting sleeve body and the setting sleeve . setting sleeve 100 includes an annular chamfer 104 formed about the circumference of the setting sleeve at its lower end . chamfer 104 is referred to herein as anchor engagement means . the above - described upper portion of the first tubular assembly ( shown in fig1 a and 1b ) continues downwardly to include setting sleeve body 88 and setting sleeve 100 . thus , the first tubular portion , beginning with coupling 19 and upper piston case 20 and extending downwardly to setting sleeve 100 , is substantially cylindrical and is fixedly mounted on the tubing string ( not shown ) via adapter mandrel 14 . what is referred to herein as a second tubular portion includes at its upper end , upper sleeve 52 and extends downwardly to include middle sleeve 66 and lower sleeve 80 . continuing the description of the second tubular portion , in fig1 c , the lower end of lower sleeve 80 includes a widened diameter portion 106 . portion 106 includes a counterbore 108 which provides fluid communication between the interior of sleeve 80 and its exterior at the lower end thereof . threads 110 provide threaded engagement between portion 106 of the lower sleeve and a flapper valve housing 112 . the flapper valve housing includes an annular upper portion 114 . portion 114 includes a circular bore 116 , such being of the same diameter as counterbore 108 and communicating therewith . a vertical slot 118 is formed on one side of bore 116 . a bore 120 is formed between slot 118 and the radially outer surface of upper portion 114 . a lower annular portion 122 of flapper valve housing 112 includes a circular bore 124 which permits fluid communication between a radially inner portion 126 of setting sleeve body 88 and the interior of the flapper valve housing . the surface of bore 124 is denoted by numeral 128 . a flapper valve 130 includes a circular valve body 132 . an annular seal 134 is mounted on the lower side of valve body 132 . a mounting tab 136 extends from the rear end of valve body 132 and is received within slot 118 . the mounting tab includes a hole through which a post 138 extends . post 138 is fixedly received within bores ( not shown ) formed on either side of circular bore 116 . thus , flapper valve 130 pivots about post 138 . a spring 140 biases the flapper valve downwardly . a mandrel case 142 is substantially cylindrically shaped and is threadably engaged with the lower end of the flapper valve housing via threads 144 . mandrel case 142 includes an annular channel 146 formed in the radially outer surface of the mandrel case about its circumference . an o - ring 148 is received within the channel . an annular space 150 is formed between mandrel case 142 and setting sleeve body 88 . another annular space 152 is formed between the mandrel case and setting sleeve 100 . spaces 150 , 152 are in fluid communication with each other . the lower end of mandrel case 142 includes a counterbore 154 . the lower end is threadably engaged via threads 156 to a lock ring housing 158 . the lock ring housing is of annular shape and includes an annular upward facing shoulder 160 about the interior of the housing . an annular space 162 is formed between the radially outer surface of lock ring housing 158 and the radially inner surface of setting sleeve 100 . an o - ring 164 , also referred to herein as sealing means , provides a seal between the lock ring housing and the radially inner surface of the setting sleeve at the lower end of space 162 . a bore 166 provides fluid communication between space 162 and the interior of lock ring housing 158 . a lock ring 168 , also referred to herein as mandrel lock means , includes a plurality of arcuate segments , one of which is segment 170 . the segments are constrained from vertical movement between the lower end of mandrel case 142 and shoulder 160 on the lock ring housing . the segments are all biased radially inwardly by an o - ring 172 disposed about the radially outer side of the segments . a coupling ring support 174 is generally cylindrically shaped and is threadably engaged via threads 176 to the lower end of lock ring housing 158 . support 174 includes an annular upper end 159 . the coupling ring support includes an upward facing shoulder 178 for maintaining a coupling ring 180 between shoulder 178 and the lower end of lock ring housing 158 . the coupling ring is attached to a generally cylindrically shaped tension sleeve 182 , also referred to herein as shearable means , via threads 183 . tension sleeve 182 provides a connection between setting tool 10 and packer 12 . the lower end of tension sleeve 182 is threadably engaged to a generally cylindrical conduit or packer mandrel 184 substantially contained within the packer . the setting tool includes a mandrel 186 , which extends from just beneath flapper valve 130 into packer mandrel 184 . the mandrel is generally cylindrically shaped and has its top end sealed against annular seal 134 of the flapper valve . an o - ring 188 provides sealing engagement between the radially outer surface of the mandrel and the radially inner surface of flapper valve housing 112 . an annular piston or collar 185 is formed about the radially outer circumference of the mandrel . a second o - ring 190 seals the collar between its radially outer surface and the radially inner surface of mandrel case 142 . an annular hydraulic chamber 189 is formed beneath collar 185 . the top of collar 185 includes an upward facing annular shoulder 192 . a bore 194 is formed through the mandrel to provide fluid communication between the mandrel interior and exterior . the mandrel includes an annular portion 195 having an upward facing shoulder 196 in fig1 d . shoulder 196 is annular in shape and is formed about the circumference of the mandrel . an o - ring 198 seals the mandrel about its circumference between the radially outer surface of the mandrel and the radially inner surface of coupling ring support 174 . at its lower end , mandrel 186 includes a reduced diameter portion 200 and at the very lower end of the mandrel , an annular chamfer 202 . packer 12 includes a conventional split ring 203 which , in the condition shown in fig1 e , maintains slips 204 , 206 in an upper position as shown . slips such as slips 204 , 206 are suspended from an annular lock ring housing 207 . a conventional wedge 208 is provided to force slips 204 , 206 , respectively , outward as the slips move downward relative to the wedges . elastomeric packers 212 are confined about packer mandrel 184 between upper wedge 208 and a lower wedge 214 . the lower wedge coacts with slips such as lower slips 218 , 220 in a conventional manner to force the slips outwardly to engage the sides of the well bore . a cylindrical sliding valve sleeve 222 is closely received within the lower end of packer mandrel 184 . the valve sleeve includes a pair of ports 224 , 226 which , when the valve sleeve is in its lowermost position as shown , are aligned with a pair of ports 228 , 230 in packer mandrel 184 . valve sleeve 222 includes upwardly extending fingers 232 , 234 which , in the condition shown in fig1 f , are engaged against reduced diameter portion 200 of mandrel 186 . fingers such as fingers 232 , 234 include interior downward directed shoulders 236 , 238 formed on the upper portion thereof . a lower annular shoulder 240 on mandrel 186 defines the lower end of reduced diameter portion 200 . an annular groove 242 is formed about the radially inner surface of packer mandrel 184 above fingers 232 , 234 . in operation , tool 10 and packer 12 are connected to a tubing string via adapter mandrel 14 at the surface of a well bore . the tool and the packer are in the configuration as shown in fig1 a -- 1f . mandrel 186 is in its upper position having shoulder 192 abutted against the lower end of flapper valve housing 112 . the lower end of the flapper valve housing prevents the mandrel from moving any further upwardly . annular shoulder 202 at the lower end of mandrel 186 is pressed against sliding valve 222 to maintain the valve in its lowermost position thus aligning ports 228 , 224 and ports 226 , 230 to permit fluid communication between the well bore and the mandrel . upper slips 204 , 206 and lower slips 218 , 220 are maintained in their radially innermost position as shown in fig1 e and 1f . as the tubing string is lowered into the well bore , fluid enters the packer and setting tool via ports 224 , 228 and ports 226 , 230 . the fluid fills mandrel 186 and forces flapper valve 130 upwardly off the top of the stinger to permit filling of the tubing . when the depth is reached at which it is desired to set the packer in the well bore , lowering of the tubing is stopped . at this point , the fluid in the tubing is pressurized by applying pump pressure to the tubing at the top of the well bore . as the fluid pressure in the tubing increases , fluid is pumped into chambers 69 , 84 via bores 68 , 82 , respectively . as the pressure in the chambers increases , fluid pressure acting upwardly on upper piston 58 and on lower piston 76 causes upward movement of the second tubular portion , such including upper sleeve 52 , middle sleeve 66 , lower sleeve 80 , flapper valve housing 112 , mandrel case 142 , lock ring housing 158 , coupling ring support 174 , and coupling ring 180 . it is noted that upward movement of coupling ring 180 likewise moves tension ring 182 upwardly and hence the packer , to which the tension ring is attached . as application of fluid pressure continues , the packer moves upwardly so that chamfer 104 on the lower end of setting sleeve 100 engages lock ring 203 on the packer . chamfer 104 descends into the radially inner side of the lock ring , thus causing spreading of the ring to permit the setting sleeve to push lock ring housing 207 and hence slips 204 , 206 downwardly . such downward motion causes engagement of slips 204 , 206 with the side of the well bore . continued upward movement of the second tubular portion pulls lower slips 218 , 220 over lower wedge 214 , thus forcing lower slips 218 , 220 outwardly into engagement with the sides of the well bore . packer 12 is at this point set in the well bore . during such upward movement of the second or inner tubular portion , mandrel 186 is maintained in its upper position by fluid pressure from the tubing communicated to hydraulic chamber 189 beneath mandrel collar 185 as follows : fluid flows from the tubing through inner sleeve 80 , counterbore 108 , slot 118 and bore 124 to the annular space between lower portion 122 of the flapper valve housing and setting sleeve body 88 . from there , fluid passes downwardly to annular space 150 since there are no o - rings or other seals to prevent transmission of fluid pressure from bore 124 to annular space 150 . as will be recalled , annular space 150 communicates with space 152 which in turn communicates with annular space 162 . bore 166 permits pressure transmission to the interior of the lock ring housing and from thence upwardly through counterbore 154 into hydraulic chamber 189 . it will be seen that when the hydraulic chamber is pressurized , such pressure acts to force mandrel collar 185 upwardly to maintain it against the lower part of flapper valve housing 112 . continued pressurization after setting of the upper and lower slips causes further upward movement of the second tubular portion and mandrel 186 . it can be seen that the interior of mandrel 186 is not pressurized due to the sealing of the flapper valve over the top of the mandrel . continued pressurization ultimately breaks tension sleeve 182 thus separating the tool from the packer . during upward movement of the second tubular portion and of mandrel 186 , sliding valve 222 is lifted upwardly when shoulder 240 on the mandrel engages shoulders 236 , 238 on the valve fingers and lifts the valve upwardly until the upper portion of the fingers are received within annular groove 242 , thus locking the valve in its upper closed position . continued upward movement of mandrel 186 lifts the mandrel away from the fingers leaving the valve locked in its closed position . as mandrel case 142 moves upwardly , o - ring 148 ultimately seals against surface 94 on ridge 92 . thus , the pressurized fluid in hydraulic chamber 189 is sealed off from the pressurized fluid in the tubing . immediately after sealing of o - ring 148 against surface 94 , continued pressurization of the tubing string lifts the first tubular portion enough to raise seal 164 above the top of setting sleeve 100 . this breaks the seal between the pressurized fluid in hydraulic chamber 189 and the fluid in the well bore . the pressurized fluid in the hydraulic chamber passes from the chamber through bore 166 and annular space 162 into the bore fluid ( since o - ring 164 is no longer sealingly engaged against the radially inner surface of setting sleeve 100 ). such depressurization of the hydraulic chamber permits downward movement of mandrel 186 . the pressurized fluid in the tubing ( and in counterbore 108 ) applies downward pressure to the top of flapper valve 130 . once hydraulic chamber 189 is depressurized , the downward acting pressure on the flapper valve causes mandrel 186 to begin downward movement . once the seal between the top of the mandrel and seal 134 in the flapper valve is broken , pressurized fluid from the tubing may enter mandrel 186 . when such fluid enters the mandrel , it is transmitted via bore 194 to the annular space above mandrel collar 185 thus further forcing the mandrel downwardly . downward movement of the mandrel continues until shoulder 196 passes locking ring 170 . further downward movement of the mandrel is prevented by engagement of annular portion 195 with shoulder 159 . lock ring 168 acting against shoulder 196 prevents upward movement of the stinger . thus , the mandrel is substantially locked in its lower position . as mandrel 186 moves downwardly , chamfer 202 at the lower end of the mandrel abuts against sliding valve 222 to move it from its upper closed position back to its lower open position as shown in fig1 f . thus , the packer is set in the well , the tension sleeve connecting the packer to tool 10 is broken , mandrel 186 is locked in its lower position , and sliding valve 222 is in its lowermost open position . operations as desired may proceed , e . g ., fluid may be withdrawn from the bore beneath the packer and / or fluid injected into the bore beneath the packer . thereafter , if it is desired to seal off the bore beneath the packer , the tubing string is raised thus lifting mandrel 186 and hence moving sliding valve 222 to its upper closed position . if it is desired to again open the valve , the tubing string may again be lowered thus abutting the lower end of mandrel 186 against the sliding valve to open it for further operations . it is to be appreciated that additions and / or modifications to the preferred embodiment disclosed herein may be made without departing from the spirit of the invention as defined in the following claims .	4
the underwater salvage attachment device is shown in fig1 and is comprised of a hollow elongated body 10 for insertion into a predrilled hole having a shackle 12 attached to a concentric collar 14 supported on the exterior surface of hollow body 10 . the device is held in place by a plurality of extendable lugs 16 which are forced outward after insertion into a predrilled hole by spike 18 . a conical end cap 22 , attached to the end of the hollow body 10 , aids in alignment and insertion in the predrilled hole . the hollow body 10 is preferably constructed of stainless steel and has a helical threaded portion extending from the end adjacent to the shackle to near the extendable lugs 16 . the external threaded portion mates with internal threads on collar 14 . the extendable lugs 16 may be of any suitable shape , preferably cylindrical , and are seated in apertures at the interior end of the hollow body 10 . an expansion type snap ring 24 holds the extendable lugs 16 flush with the exterior surface of the hollow body 10 and is seated in a groove in the hollow body aligned with slots in the extendable lugs 16 . the interior end of the lugs 16 have tapered portions 34 terminating in a shoulder 40 which limits the amount of extension of the lugs . preferably there are four of the extendable lugs 16 equally spaced around the hollow body 10 . the lugs 16 are forced outward by spike 18 fitted inside of the hollow body 10 . the outward force is supplied by tapered end 38 of spike 18 , engaging the tapered portion 34 of lugs 16 . the lugs 16 ride upward on the spike to the neck portion 36 when the spike is completely engaged . the lugs 16 may be held in the extended position by an interference fit between taper 34 and neck 36 . conically tapered end cap 22 screws onto machine threads at the end of hollow body 10 . aperture 46 in end cap 22 permits the spike 18 to be driven outward for removal of the attachment device for reuse . a plastic end plug 32 seals the internal area of the hollow body 10 from the outside environment after lubrication and assembly of the spike 18 and tapered lugs 16 . the end plug 32 is sufficiently thin to permit piercing by spike 18 . shackle 12 is attached by pins 28 , which are force - fitted into the collar 14 with shackle 12 free to rotate . the shackle 12 may be attached to the collar before or after the collar is threaded on hollow body 10 . a scalloped handle 20 is attached to the end of the hollow body 10 by a plurality of screws 30 after the shackle - collar assembly has been mounted on the body 10 . the handle 20 provides a grip for holding the body 10 while tightening the collar 14 against a bulkhead after attachment to a sunken object . the handle 20 also serves the additional purpose of providing a flange for retention of the collar 14 . during assembly , lugs 16 and spike 18 are fully lubricated and plastic cap plug 32 inserted to prevent moisture and dirt from entering the interior lubricated areas . after assembly , a bolt 42 ( see fig2 ) is inserted in a hole through spike 18 and hollow body 10 and held in place by a cotter pin 44 . this bolt 42 acts as a safety device to prevent the spike 18 from being pushed inward prior to any anticipated use of the device . with the bolt 42 in place , the user knows the device is ready for use . the cotter pin 44 and bolt 42 are removed prior to a diver taking the device underwater for use . if desired , a second hole in spike 18 can be provided for reinsertion of the bolt 42 after the device has been attached , in order to prevent the spike 18 from working out of the hollow body 10 . in operation , the device is inserted in a predrilled hole and the spike 18 driven in to force lugs 16 outward and hold them in place via flat neck portion 36 . the collar 14 is then tightened down against the object by gripping handle 20 and turning the shackle 12 or vice versa . a variation of the embodiment shown in fig1 is illustrated in fig3 . in this figure , the hollow body 10 is substantially the same with the shackle 12 attached to collar 14 threaded on the body in the same manner . scalloped handle 20 is also fitted on the hollow body 10 as before . however , in this embodiment two interlocking lugs 46 ( see fig4 ) are extended by the action of a shaft comprised of lug driver arm 48 attached to a threaded rod 50 . the threaded rod 50 ia attached to the driver arm 48 by a nipple 54 seated in a socket 52 and held in place by pins 56 . this permits driver arm 48 to move in or out when rod 50 is rotated clockwise or counter - clockwise , respectively . hex head nut 58 attached to the exterior end of rod 50 facilitates rotation with a wrench . the lugs 46 are shown in their extended position with lug driver arm 48 fully seated . the lugs 46 are extended and retracted by the action of pin 62 in oppositely angled slots 60 in each of the lugs 46 ( fig4 a ). the pin 62 is press fitted in a hole in the end of driver arm 48 ( see fig4 ) and slides freely in slots 60 . the lugs 46 are retracted by rotating hex nut 58 counter - clockwise until pin 62 reaches the full extent of its travel to the right in slots 60 . the lugs 46 will then be flush with the outside surface of hollow body 10 and the threaded rod will extend a distance outward from the end of the body . a conically tapered end cap 64 is attached to the end of the hollow body 10 as before , except that it has no aperture . in operation , the device is inserted in a predrilled hole with lugs 46 fully retracted . the hex nut 58 is then rotated clockwise , moving the driver arm 48 to the left , causing lugs 46 to be extended . after the lugs 46 are fully extended ( i . e ., pin 62 full seated in slots 60 ), the collar 14 is tightened down on the hull by gripping handle 20 and turning shackle 12 as before . the advantage of this embodiment is that the lugs may be retracted and the device removed more readily while still providing a great strength to weight ratio . a third embodiment is illustrated in fig5 in which only the lug end of the body is shown for clarity . in this embodiment , the body 10 has exterior threads but is not hollow as before . the collar 14 and shackle 12 are mounted on the body 10 as in the first two embodiments . also , scalloped handle 20 is attached to body 10 in the same manner . however , in this embodiment , the extendable lugs are provided by a rotatable plate 66 , attached to the end of the body 10 by a pin 68 . a spring 70 , attached to plate 66 , retains it in the extended position . when rotated 90 ° clockwise ( see fig5 ), the edges 72 are flush with the exterior surface of body 10 . with plate 66 in this position , notch 74 in plate 66 provides clearance for spring retaining pin 76 , which acts as a stop . in operation , the device is inserted in a predrilled hole with rotatable plate 66 held in the closed position ( i . e ., lugs retracted ). when the device is fully inserted in the predrilled hole , the spring 70 automatically rotates the lug plate 66 counter - clockwise to the extended lug position . the collar 14 is then tightened down as before . this embodiment is more readily adapted for diver manipulation and is quicker to attach but is not as preferred because it does not provide the great strength of the previous embodiments . a fourth embodiment is illustrated in fig7 in which only the end of the body 10 containing the extendable lugs is shown , since the shackle and collar on the opposite end are the same as before . the body 10 is solid and has a tapered conical tip 78 and a rectangular slot 80 ( fig8 ) passing through the body . the lugs 82 and 84 have a cam surface tapered outward so that when installed they are flush with the external surface of the body at 86 . the lugs 82 and 84 are held in place by retaining pins 88 and 90 engaging slots 92 and 94 ( fig9 ). springs 96 and 98 fitted into holes between the lugs 82 and 84 maintain the lugs in the open ( i . e ., extended ) position . the lugs 82 and 84 are constructed as shown in fig1 so that they can intermesh when the salvage device is being inserted in a hole and a force is being applied to the tapered cam surface of the lugs 82 and 84 . in operation , this latter embodiment is inserted in a predrilled hole with the tapered conical portion 78 guiding the device into the hole . the lugs 82 and 84 are compressed by the action of the hole on the tapered cam surfaces until they are flush with the surface of the body and the device can pass through the hole . when it is fully inserted , the springs 96 and 98 force the lugs 82 and 84 outward , locking the device in the predrilled hole . the collar 14 and shackle 12 are then tightened down against the hull as before . this latter embodiment has the advantage of being the easiest to manipulate by an underwater diver , and it is especially useful in confined situations . the strength to weight ratio is not as great as the first two embodiments and it is not retractable as is the embodiment of fig3 . thus , there has been disclosed a variety of underwater salvage attachment devices which are advantageous in that they are relatively simple to manipulate while still providing a high strength to weight ratio . various alternatives will become apparent to those skilled in the art . for example , a single spring could be substituted for the two springs in the embodiment of fig9 . however , it is not as desirable since it may not provide the uniform expansion that the two - spring configuration does . obviously , many modifications and variations of the present invention are possible in light of the above teachings . it is therefore to be understood that within the scope of the appended claims the invention may be practiced otherwise than as specifically described .	1
the following relates to an exemplary embodiment of a rotary hydraulic damper assembly used in conjunction with a pivoting stowage bin , such as those typically found on commercial aircraft . it will be readily apparent , however , that numerous other variations and modifications are possible that generally embody the inventive concepts described herein . moreover , it will also be readily apparent that these concepts may also be similarly applied to other related fields of endeavor . during the course of discussion , certain terms such as “ distal ”, “ proximal ”, “ inner ”, “ outer ”, “ lateral ”, “ internal ” and “ external ”, among others are used for purposes of providing a suitable frame of reference in regard to the accompanying drawings . these terms are not intended to be overly limiting of the inventive concepts described herein , however , unless otherwise specifically indicated . in addition , the accompanying drawings are intended to convey the inventive concepts more readily , but the drawings themselves are not drawn necessarily to scale and should not be relied upon in that regard . for purposes of background , a prior art stowage bin is shown according to fig1 to which the rotary hydraulic damper described herein can be applied . the stowage bin 20 includes a bin bucket 24 , which is hingably connected at a pair of opposing lateral ends to a stationary bin housing 28 . other suitable pivoting stowage bin assemblies having different bin bucket configurations are described by way of example , in u . s . patent application publication no . 2011 / 0253837a1 , the relevant contents of which are herein incorporated by reference . the bin housing 28 is fixedly attached to the aircraft frame at each lateral end in order to form respective bin walls wherein the lateral walls of the bin bucket 24 are pivotally attached through a mounting arrangement to respective parallel walls of the stationary housing , therein providing the pivot location for the stowage bin 20 . when assembled , the interior of the bin bucket 24 and bin housing 28 combine to define an enclosure 32 wherein the bin bucket further includes an exterior latch 31 to enable the stowage bin 20 to be selectively opened and closed by a user . in use , the bin bucket 24 is released from a latched position ( not shown in this view ) by the latch 31 and caused to pivot through an attached mounting arrangement relative to the stationary housing 28 to an open position , as shown , presenting the enclosure 32 for either placement or removing of luggage ( not shown ). additional details of exemplary stowage bins are provided in the above cross - referenced publication . according to the present exemplary embodiment and referring to fig2 and 3 , a pair of rotary hydraulic dampers 40 are attached to each end of a stowage bin , such as the one shown by way of example according to fig1 , wherein each of the dampers 40 are disposed along the pivot axis of the stowage bin in a mounting arrangement between the bin bucket 24 , fig1 , and the stationary bin housing 28 , fig1 . for purposes of this discussion , only a single rotary hydraulic damper 40 is described and shown herein and in which the remaining damper is essentially a mirror image thereof in terms of its structure , functionality and mounting arrangement . it should be noted , however , that in an alternative embodiment , a single rotary hinge damper could be provided in lieu of separate rotary hydraulic dampers at each opposing lateral end of the stowage bin 20 . the rotary hydraulic damper 40 according to this embodiment and shown in assembled form in fig2 and 3 is defined by a distal end 42 that is attachable to the stationary bin housing 28 , fig1 , using a mounting flange 46 and an opposing proximal end 48 that is separately connectable to the pivoting bin bucket 24 , fig1 , using a set of circumferentially spaced keys 52 , as described in greater detail in a later section . the relative positioning of the damper 40 according to this embodiment is based upon a stowage bin design that includes a pivoting bin 24 , fig1 , forming the interior member relative to an exterior bin housing 28 , fig1 . it will be readily apparent that the relative distal and proximal ends 42 , 48 of the hydraulic rotary damper 40 can be reversed , for example , depending on the structure of the pivoting stowage bin for purposes of mounting . as shown in fig4 and 5 , the rotary hydraulic damper 40 is essentially a two - part structure comprising a damper body 56 having an interior cavity that is sized to receive a rotor 60 that is mounted for rotation therein . the damper body 56 according to this embodiment includes the mounting flange 46 at a distal end or side thereof , wherein the mounting flange includes a plurality of circumferentially spaced slots 64 disposed along an outer radial portion 68 thereof , as well as a center opening 72 . an open - ended cylindrical sleeve portion 76 extending axially from a rear side of the mounting flange 46 defines the interior cavity of the damper body 56 , which is hollow with the exception of a pair of diametrically opposed and substantially wedge - shaped vanes 80 , each tapering inwardly from the interior diameter of the sleeve portion 76 to the center opening 72 of the mounting flange 46 . the exterior surface 84 of the sleeve portion 76 of the damper body 56 is substantially cylindrical with the exception of a stop lug 88 formed as an axial extension of the outer radial portion 68 of the mounting flange 46 and in which the outer radial portion extends radially outward from the exterior diameter of the cylindrical sleeve portion 76 . still referring to fig4 and 5 , the rotor 60 according to this embodiment is sized for engagement within the open - ended cylindrical sleeve portion 76 of the damper body 56 . the rear or proximal end of the rotor 60 is defined by a circular plate 90 having the set of circumferentially disposed keys 52 formed thereon , as well as having a center opening 94 . each of the keys 52 are substantially wedge - shaped and are disposed at an intermediate radius from a center opening 94 . the front side or end of the rotor 60 includes an axially extending cored center section 98 as well as a pair of radially extending vanes 102 , the vanes tapering outwardly from the cored center section 98 to an outer radius that is substantially equal to that of the rear circular plate 90 . the rotor 60 is inserted into the open - ended sleeve portion 76 of the damper body 56 such that the cored center section 98 extends between the diametrically opposed vanes 80 of the damper body 56 and in which the vanes 102 of the rotor 60 are fitted between the vanes 80 of the damper body 56 , therein defining a set of variably sized hydraulic chambers . this set of chambers varies in number between two and four hydraulic chambers , depending on the position of the rotor vanes 102 . it will be readily apparent that the overall number and shapes of the vanes 80 , 102 utilized can be suitably configured as needed . the cored center section 98 further includes a corresponding number of small lateral openings or orifices defined therein , each axially and radially spaced apart . according to this specific embodiment , two ( 2 ) pairs of openings are defined , including a pair of first openings or orifices 108 and a spaced pair of second openings 112 . each of the defined orifices 108 , 112 is configured in relation to a defined interior hydraulic chamber of the damper 40 . in terms of the present drawings , only single openings of each pair 108 , 112 are depicted in fig4 and 5 . when assembled , a pair of seal members 118 , 113 , such as elastomeric o - rings , provide sealing interface between respective outer and inner interior flange surfaces of the rotor 60 and damper body 56 , as shown most clearly in an assembled condition in fig1 . according to this embodiment , a manifold 116 is sized to be slidingly fitted within the cored center section 98 of the assembled rotor 60 . as shown in fig9 , the manifold 116 is defined by a substantially cylindrical body member having a plurality of grooves 120 , 122 that receive sealing members 119 , 121 , fig4 , as well as a set of lateral openings 123 , 125 disposed within adjacent grooves 129 , 131 , the openings being aligned with the openings 108 , 110 of the damper 40 when the rotor is rotated within the damper body 56 . a valve element 124 is axially disposed within the subchamber that is defined by the interior of the manifold along with a bias spring 128 operative associated with the valve element as described in a later section . the manifold 116 is fixedly maintained by a retainer member 130 that is mounted through the center opening 72 of the damper body 56 from the distal side . the retainer member 130 includes a threaded distal portion 134 that is configured and sized to engage an internally threaded end 117 of the manifold 116 , thereby retaining the components of the herein described damper assembly . the distal side of the herein described damper body 56 further includes a pair of small openings 138 extending into the defined cavities and permitting the inclusion of fill plugs 140 to enable a quantity of suitable hydraulic fluid ( not shown ) to be added to the defined interior hydraulic chambers following assembly of the damper 40 . referring to fig6 and in terms of mounting the herein described rotary hydraulic damper 40 to the pivoting bin , aligned openings ( not shown ) are provided in each of the bin bucket 24 , fig1 , and the bin housing 28 , fig1 , along the pivot axis . a pivoting mounting plate 150 is fixedly attached to the bin bucket 24 , fig1 . the mounting plate 150 according to this embodiment includes a rear mounting bracket 154 having a plurality of circumferentially spaced mounting holes 158 along an outer radial portion 162 , and an axially extending and open - ended receiving portion 166 which is substantially cylindrical in configuration and defined by an interior diameter that is sized to correspondingly mate with the exterior diameter of the sleeve portion 76 of the damper body 56 . the mounting plate 150 further includes a set of features configured to engage the keys 52 on the proximal side of the rotor 60 . according to this embodiment , three ( 3 ) keys 155 are utilized , each of the keys being substantially wedge - shaped and symmetrically disposed about at an intermediate radial distance from the center of the bracket 154 and wherein a spacer 170 is introduced into the receiving portion 166 thereof . in this embodiment , the spacer 170 and corresponding keys 155 on the front side of the mounting bracket 150 combine to form a set of keyways that engage the keys 52 of the rotor 60 . the spacer 170 is preferably elastomeric in order to take up manufacturing tolerances and also provide manufacturing gap alignment and minimize rattling or vibratory effects on the pivoting bin . the mounting flange 46 of the damper body 56 is fixedly attached to the bin housing 28 , fig1 , using fasteners ( not shown ) secured through the mounting slots 64 formed on the outer radial portion 68 and the bin housing 28 , fig1 , respectively . when assembled , the damper body 56 extends through an opening ( not shown ) of the stationary bin housing 28 , fig1 , such that the outer diameter of the damper body is secured within the inner diameter of the opening . as the pivoting bin bucket 24 , fig1 , rotates , the mounting plate engagement with the keys 52 causes the rotor 60 to rotate with the bin bucket 24 , fig1 , and within the interior of the damper body 56 while the damper body remains stationarily mounted to the bin housing 28 , fig1 . referring to fig7 and 8 , the receiving portion 162 of the pivoting mounting plate 150 further includes a slot 174 that is cut axially from an outer surface over a circumferential section thereof . the purpose of this slot 174 is to provide a mechanical stop for the bin bucket 24 . that is and as the pivoting bin 24 , fig1 , is pivoted on opening , the mounting plate and attached rotor are caused to rotate between the positions shown in fig7 and 8 until the stop lug 88 encounters the end of the slot 174 . referring to fig9 - 11 , discussion is herein made of the flow control ( weight compensating ) valve used in accordance with this exemplary embodiment . as previously noted , the central cored section 98 of the herein described rotary hydraulic damper 40 includes a first set of holes 108 and an adjacent second set of holes 112 , each spaced to provide high pressure and low pressure regions in terms of movement of contained hydraulic fluid through the defined hydraulic chambers within the damper . according to this embodiment , and as the bin bucket 24 , fig1 , is opened , the bucket is caused to pivot about the pivot axis , thereby causing the rotor 60 to rotate based on the keyed connection to the pivoting bin mounting plate 150 . relative movement of the rotor vanes 102 within the damper 40 therefore causes contained hydraulic fluid to be moved under high pressure through the inlet holes 108 of the cored section 98 towards the opposing low pressure regions or chambers thereof and into the subchamber defined by the interior of the manifold 116 , in which fluid is caused to enter the subchamber as fluid flows through holes 108 and into holes 123 via the exterior groove 129 along a defined first fluid flow path . the interposed valve element 124 is biased by the axially disposed spring 128 against that of the moving fluid in regard to the inlet holes 123 . as the hydraulic fluid pushes against the force of the biased spring 128 based on a pressure gradient developed as the fluid flows through an intermediate orifice 126 in the valve element 124 , the valve element 124 is moved towards the outlet orifices 125 , and partially cuts off fluid flow through the outlet orifices 125 , substantially creating a constant rate of fluid flow irrespective of the force applied due to the compensating effect of the spring 128 . details as to the theory of this specific valve are provided in u . s . pat . no . 7 , 967 , 116 , the entire contents of which are herein incorporated by reference . during opening of the bin bucket 24 and once the hydraulic fluid flows through the outlet orifices 125 , this fluid flows into the groove 131 of the manifold 116 and then exits through the holes 112 into the low pressure region created by the rotor vanes 102 and stator vanes 80 . the preceding description relates to a central axial positioning of the flow control valve for purposes of this exemplary embodiment . however , there are alternative configurations that could easily be realized . for example , separate flow control valves employing the preceding principles could be positioned in relation to each of the rotor vanes or stator vanes . in addition , modifications can be optionally included due to the spring loaded nature of the herein - described flow control valve and the accessibility of the manifold 116 . for example , an adjustment feature ( not shown ) can be added so adjustments can be made to the preload of the spring 128 to change the flow rate of fluid through the valve , thereby changing the opening rate of the bin bucket 24 . in addition , adjustments can be made mechanically to the herein described system regarding the return path of fluid , for example , allowing additional fluid to flow to make closing the bin bucket easier . when closing the bin bucket 24 , the rotor 60 will rotate in the opposite direction causing fluid within the damper to flow in the direct opposite direction . additional fluid flow can be created through the use of a check valve , which opens when closing the bin . this additional fluid flow causes the damper to create less resistance to movement , thus making it easier to close the bin bucket 24 . an embodiment of this valve is shown in fig1 . as fluid flows into hole 112 and into the groove 131 of the manifold 116 , fluid can flow through the annular area 132 and force the sealing member 121 to move away from the annular area 132 . cylindrical sections 133 , fig9 , cut away from the wall in the manifold 116 prevent the sealing member 121 from sealing against the wall and thus allows fluid to flow under the sealing member 121 , through the cylindrical sections 133 into groove 129 and then exiting through the openings 108 formed in the damper and into the low pressure region created by the rotor vanes 102 and stator vanes 80 . additional details concerning various linear versions of the preceding valve structure are provided in previously incorporated u . s . pat . no . 7 , 967 , 116 . by attaching the rotary hydraulic damper in the manner described herein and along the pivot axis of the stowage bin 20 , fig1 , such as by distributing the torque loads away by eliminating the traditional splined shaft common to most dampers , the major components of the damper can be suitably manufactured from lightweight and more inexpensive materials , such as moldable plastics . as a result , manufacturing costs are significantly reduced . in addition , the removal of a splined shaft from the center of the herein described damper permits the inclusion of the load compensating valve without significant impact to the footprint . as a result , additional functionality is provided to the herein described assembly . although exemplary embodiments have been described herein , it will be readily apparent that there are numerous variations and modifications that could be further employed in the furtherance of the inventive concepts described herein and according to the following claims .	1
aspects of the invention include a “ simulated secondary gain model ”. this model involves a “ target ” test or tests to be verified or improved for false positive errors , a group of subjects who have been screened not to have the disease being detected by the diagnostic test , a group of patients known to have the disease being detected , a secondary gain “ prize ” ( provided to the subject or subjects most able to produce false positive results on the test or tests being evaluated ) which is of significant value to the subjects such that they will give their best effort , and a group of test readers who are blinded to the identity of the test subjects . aspects of the invention also include that the false positive rate , true positive rate , false negative rate , true negative rate , sensitivity , specificity , positive predictive value , and negative predictive value are calculated for the target test using the above methodology . this is produced by having the “ blinded readers ” ( who are blind to which subjects actually have the disease and which are in a simulated secondary gain environment ) score each test as “ normal ” or abnormal ”. while the idea of a false negative rate for a diagnostic test is not new , the concept is anchored in the idea of detecting disease , namely that a false positive would result if a diagnostic test indicated the presence of disease in a patient without disease . while the diagnostic tests being evaluated by this invention can detect disease and as such must have high sensitivity and specificity for a disease state , they must also have another property which allows them to be impervious or nearly impervious to conscious deception . for the purposes of this discussion , this property will be called the “ malingering false positive ” rate . so while a diagnostic test may have a very low disease false positive rate allowing it to rarely show positive when the disease is not present , it may have a very poor “ malingering false positive ” rate , making it easy to fake a positive result by a motivated patient . while this is not meant to limit the scope of this invention , both disease false / true positive / negative rates as well as malingering false / true positive / negative rates are reported for each test evaluated by the invention . these rates form the basis of the feedback loop which allows the diagnostic test to evolve to achieve better accuracy in both a medical and legal setting . aspects of the invention also include a simulated secondary gain environment that promotes the fraudulent testing behavior which can be seen in a legal setting with monetary gain . the key idea behind secondary gain as described by the legal , medical , and insurance communities is that a patient stands to gain attention , money , or both from successfully convincing others ( including his health care providers , family , and friends ) that he or she is sick ( when no or minimal illness is actually present ). this culminates in the court room or legal setting where there is an insurer , business , or individual defendant who must compensate the injured individual based on the degree of injuries , income loss , and / or disability that has been described by various medical providers . while many studies have been carried out with subjects who are trying to manipulate diagnostic test results ( cite ), none have been carried out in a simulated secondary gain environment where subjects are substantially rewarded for their feigned diagnostic testing results ( malingering false positives ). aspects of the invention also include a significant reward for fraudulent behavior which leads to a malingering false positive result . for this to be the case , a significant prize must be provided to the subject in the diagnostic testing group who is the most successful in producing a false positive test . in order for this testing environment to produce the highest likelihood of false positives , the prize must be must be meaningful to the individual . for example , a $ 100 prize might have little value to someone earning $ 100 , 000 a year , but to a blue collar worker who earns $ 15 an hour , it may be a suitable incentive to want to work hard to manipulate diagnostic tests to show an injury . as a result , while not meant to limit the scope of this invention , the subjects are asked through questionnaire or interview about what would be a meaningful prize . it is believed that a prize equal to several days pay for several hours of testing ( or a 400 - 500 % premium ) is enough to produce simulated secondary gain behavior . aspects of the invention also include that disease and malingering status are blinded to readers of the tests . in other words , the test readers are unaware if a test being read was performed on a normal patient without the disease , a patient known to have the disease , or a subject placed in a simulated secondary gain environment incented to fake a positive test result . in this way , the data generated by the blinded readers can produce both disease and malingering sensitivity and specificity . as an example , if out of 10 tests for the simulated secondary gain group , one were read by the blinded readers as negative , and one was read as positive , the malingering false positive rate for that test is 10 %. aspects of the invention also include that various diagnostic tests may either be read as positive or negative , but some may also be read as producing an obviously deceptive result . for example , a negative result for a diagnostic test may at times appear quite different than a test being manipulated by an incented subject in a simulated secondary gain trial . aspects of the invention also include that a feedback system is utilized to improve test performance to reduce malingering false positive rates . as an example not meant to limit the scope of this invention , a simulated secondary gain trial with 5 subjects evaluating 3 tests may show by blinded reading that one of the tests produces a malingering false positive rate of 30 %. this would be considered unacceptably high and would initiate a feedback loop whereby the test results would be analyzed to either change key parts of how the test is read as abnormal or deceptive , change the actual test parameters to further reduce the malingering false positive rate , or drop the test from the diagnostic testing suite as a valid test in a medical - legal environment . as discussed , aspects of this invention include that the outcome of any simulated secondary gain evaluation of a diagnostic test can only be : a . the test has a acceptably low false positive rate and needs no further versions to reduce that rate b . the test parameters need to be altered or its interpretation altered to further reduce the malingering false positive rate c . the test can &# 39 ; t be repaired to produce an acceptable malingering false positive rate and should not be used in a medical legal environment . if the test were deemed repairable , then the new version of either or both of the test reading methodology or the test parameters could be placed back into the same simulated secondary gain environment to test the hypothesis that the repaired version will further reduce the malingering false positive rate . using this constant feedback loop , it is expected that many tests will evolve to reduce their malingering false positive rate . aspects of the invention also include that once a subject is able to simulate a false positive in a simulated secondary gain environment , that same subject and other random subjects should be used to reevaluate the repaired test for its malingering false positive rate . certainly , if a subject posses certain skills , mental attributes , or physical attributes that makes him or her able to simulate a malingering false positive , then the altered test must be able to become impervious to that same subject ( assuming it &# 39 ; s malingering false positive rate is still unacceptably high ). aspects of the invention also include software which will be updated based on the feedback system described above , wherein the test parameters and test reading methodology will evolve to minimize the malingering false positive rate . this software can provide normal , abnormal , or deceptive test readings or can merely transmit or print a report that can be read by a healthcare professional . one implementation of this software could use the world wide web or a portal methodology whereby the software is continuously updated based on the data obtained from ongoing simulated secondary gain trials . the following definitions are provided to facilitate understanding of certain terms used frequently herein and are not meant to limit the scope of the present disclosure . “ malingering ” refers to the act of consciously deceiving healthcare professionals or others about disease severity or status . in other words , a conscious simulation of an illness ( with no organic pathology present ) used to avoid an unpleasant situation or for personal gain . “ secondary gain ” refers to the external gain derived from any illness , such as personal attention and service , monetary gains , disability benefits , and release from unpleasant responsibilities . “ malingering false positive ” refers to a positive diagnostic test result produced by a subject without the disease who is in a simulated secondary gain environment . “ simulated secondary gain environment ” refers to a testing setting where a group of subjects are given a script where they are to feign an injury or illness and are given a significant prize if they are able to produce a false positive test result . “ target test ” refers to a diagnostic test that is placed through simulated secondary gain trials to reduce its false positive rates in a medical legal setting . “ subjects ” refers to patients or actors who undergo diagnostic testing during a trial . “ trial ” refers to a group of subjects who undergo diagnostic testing for the purpose of calibrating the test , validating the test , or subjecting the test to a simulated secondary gain model to determine its malingering false positive rate	6
the novel features of the present invention are incorporated and illustrated in fig1 a , 1 b , 1 c and fig8 . in general , the present invention is shown generally as a “ seamless ” washable garment 20 . it is an improvement over prior garments for both men and women whether they are classified as underwear , shaping garments , hosiery , athletic garments , or ready - to - wear . a person 28 is wearing the garment 20 and comprises numbers 21 through 70 . for purposes of clarity , like reference numerals are used where appropriate . the garment 20 is comprised of a torso portion 23 having a waistband 22 with a top 56 and a stitching line 58 , a front portion 24 , and a back portion 26 . further , the garment 20 contains a pair of leg portions of the garment 39 that are connected at a perforated line 30 and extend downwardly to the feet 49 of the person 28 wearing the garment 20 . a region of the angle formed by the junction of the legs or crotch 32 and an inner part of the leg 40 is covered by a knit sewn in leg panel 38 . knit sewn in leg panel 38 is comprised of a crotch portion of sewn in panel 34 , and an inner leg portion of knit sewn in leg panel 36 that will be further described in fig5 , fig6 , and fig7 . a front leg panel seam 42 connects the knit sewn in leg panel 38 to the torso portion of the garment 23 and to the leg portion of the garment 39 which in total forms garment 20 . alternating five rows of jersey stitches 44 and five rows of diamond - patterned stitches 46 are above the hem seam 48 that help hold the garment in place . first and second leg openings of the hem 50 a and sob respectively allow for an opening for the foot 49 . an important aspect of this invention is to provide the garment with the knit sewn in leg panel 38 , which is generally shown in fig1 a , 1 b , 1 c and fig8 , that eliminates an inner thigh seam , as being disposed of crotch portion 34 and an inner leg portion of knit sewn in leg panel 36 . knit sewn in leg panel 38 is sewn into garment 20 so as to overlay the inner part of leg 40 and crotch 32 of the person 28 . the relative position of knit sewn in leg panel 38 is to cover the inner part of the leg 40 and is comprised of yarns that have stretch , wicking , friction reduction and antibacterial , antifungal , and or antimicrobial characteristics and will be further described in fig5 , fig6 and fig7 . the criteria for wicking yarns or fibers are as follows : tactel ®, a type of wicking yarn is used on the inside of the plated area and tactel ®, cotton , polyester , viscose , and or wool , for example , would be utilized on the outside of the plated areas . or , a yarn or fiber with a higher dpf , denier per filament , is plated on the inside of a fabric , and a yarn or fiber with a lower dpf , is plated on the outside of a surface of a fabric . the higher dpf material has fatter , larger filaments and the lower dpf material has more smaller , thinner filaments . as a result the moisture on the inside of a person &# 39 ; s skin is wicked away by the material with the larger dpf to the surface of the fabric with the lower dpf . the surface of the wetted area on exterior surface of the garment is greater than the surface of the wetted area on the inside . the result is that a person &# 39 ; s skin stays dry . another method of producing wicking would be to plate fibers or yarns with different shapes together . for example , if moisture is on a person &# 39 ; s skin , it will wick from a surface comprised of yarns or fibers that has few “ lobes ” or “ clover leafed ” shapes into a surface which is comprised of yarns or fibers that have many “ lobes ” or “ clover leafed ” shapes . the surface of the wetted area on the exterior surface of the garment is greater than the surface of the wetted area on the inside . the result is that a person &# 39 ; s skin stays dry . fig1 b is a representation of both the front and back views of fig1 a that are identical . fig1 c is a side view of the garment as shown in fig1 . fig2 represents a circular knit tube 52 out of which the seamless garment 20 is constructed . it is comprised of a top of circular knit tube 54 , a top of the folded over waistband 56 , and a waistband seam 58 . a bottom of the circular knit tube 60 is folded up to hem seam 48 to form the first and second leg openings of hem 50 a and sob respectively . alternating five rows of jersey stitches 44 and five rows of diamond - patterned stitches 46 are above the hem seam 48 that helps hold the garment in place but are at the manufacturers discretion and can be omitted or an alternative method for hemming the garment can be used . fig3 represents the front and back views of the circular knit tube 52 showing the front and back center cut lines that are identical 62 , that forms the leg portion 39 of the seamless garment 20 shown in a perspective view in fig4 . fig4 is a perspective view of cut circular knit tube in fig3 showing the torso portion 23 and leg portions 39 of the garment 20 . the torso portion 23 shows a folded over waistband 22 with a top 56 and a seam 58 . the leg portions 39 have bottoms of the circular knit tube 60 a and 60 b which are folded up to hem seams 48 a and 48 b to form the first and second leg openings of hem 50 a and sob respectively after the knit sewn in leg panel 38 has been sewn in place . this will be further explained in fig5 . there is a crotch area 32 in between the leg portions of the garment 39 . alternating five rows of jersey stitches 44 and five rows of diamond - patterned stitches 46 are above the hem seam 48 , which help hold the garment in place . the circular knit tube sides represented by 52 a and 52 b are for sewing purposes and are to be attached to sides of knit sewn in leg panel 38 a and 38 b to form the front and back leg panel seams 42 that are identical to form garment 20 . fig5 is an enlarged detail of knit sewn in panel 38 in fig1 a , 1 b , 1 c and fig8 . the inner leg portion of knit sewn in leg panel 36 consists of a lower portion from an area from the ankle to above the knee 36 a , and an upper portion from above the knee to the crotch area 36 b . the crotch portion of sewn in panel 34 is smaller due to increased tension of the stitches in the crotch area 32 . the tapering shape of the sewn in leg panel is dependent on the length of the garment but designed to cover an area of the inner part of the leg 40 . together both the inner leg portion of sewn in leg panel 36 and crotch portion 34 comprise the knit sewn in leg panel 38 . section lines 6 - 6 represent cross sections through the plated yarns in the upper portion of inner leg portion of the knit sewn in panel from an area above the knee to crotch 36 b and will be further described in fig6 . section lines 7 - 7 represent cross sections through the plated yarns in the crotch portion of the knit sewn in panel 34 and will be further described in fig7 . hem seam 48 a and 48 b and the bottoms of the sewn in leg panel 64 a and 64 b form the first and second leg openings of the hem 50 a and sob . when the sides of sewn in knit panel 38 a and 38 b are sewn into the cut circular knit tube sides 52 a and 52 b the garment 20 is hemmed on the hem seams 48 a and 48 b . fig6 is an enlargement of a cross section taken through section lines 6 - 6 in fig5 . an outer friction reducing yarn or fiber 66 is plated , ( a knit fabric which has one kind of yarn on the face while another type is found on the back of the goods ), over an inner wicking yarn or fiber 68 . the placement of the yarns can also be accomplished by cutting the knit sewn in leg panel 34 from a woven double - faced fabric . the antifriction yarn is on the exterior of the garment and the wicking face is on the interior of the garment . an illustrative example of the friction reducing yarn may take the form of dupont &# 39 ; s ® teflon ®, silicone , graphite , kynar % o boron , polypropylene , polyethylene , and goretex ®. an illustrative example of a wicking yarn may take the form of dupont &# 39 ; s ® coolmax ® and aquator ® fibers . the resulting knit fabric that makes up the knit sewn in leg panel 38 that is worn against the person &# 39 ; s 28 skin . the wicking yarn 68 can be chemically treated to be antibacterial , antifungal , and bacteriostatic . to save the manufacturer money , the friction reducing yarn 66 can be plated on one side of the upper portion of the inner leg portion of the sewn in panel 38 to save money for the consumers without losing a decrease in function for the wearer . fig7 a is an enlargement of a cross section taken through section lines 7 - 7 in fig5 . an outer antibacterial , antifungal or bacteriostatic yarn or fiber 70 is plated over an inner wicking yarn or fiber 68 . an illustrative example of the antibacterial , antifungal , and bacteriostatic yarn or fiber is merrill &# 39 ; s skin life ®. the resulting knit fabric which makes up the crotch portion of sewn in panel 34 in knit sewn in leg panel 38 is worn against the person &# 39 ; s 28 skin . the wicking yarns or fibers can be chemically treated to be antibacterial . antifungal or bacteriostatic and the antibacterial , antifungal , and bacteriostatic yarn eliminated to save money . fig7 b is an alternate method of construction for the cross section taken through section lines 7 - 7 on fig5 . an antibacterial , antifungal or bacteriostatic yarn or fiber 70 is knit with an inner wicking yarn or fiber 68 . these two yarns are then plated with an outer friction reducing yarn or fiber 66 . an illustrative example of the antibacterial , antifungal , and bacteriostatic yarn or fiber is merrill &# 39 ; s skin life ®. the resulting knit fabric which makes up the crotch portion of sewn in panel 34 in knit sewn in leg panel 38 is worn against the person &# 39 ; s 28 skin . the wicking yarns or fibers can be chemically treated to be antibacterial , antifungal , and bacteriostatic and the antibacterial , antifungal , and bacteriostatic yarn eliminated to save money . a perspective view of the sewn in leg panel 38 in fig1 a , 1 b , and 1 c is represented in fig8 . it is achieved by sewing the cut circular knit tube in fig4 to the knit sewn in leg panel 38 in fig5 . side 52 a of the cut circular knit tube 52 is sewn to side 38 a of the knit sewn in leg panel 38 and side 52 b of the cut circular knit tube 52 is sewn to side 38 b of the knit sewn in leg panel 38 to form seams 42 that are identical front and back . the garment is finished when the first and second leg openings of hem 50 a and sob are hemmed . this is accomplished by turning up the bottom of circular knit tube 60 , 60 a and 60 b , and the bottoms of sewn in leg panel 64 a and 64 b and sewn on the hem seam 48 . a first and second leg opening of hem 50 a and sob are thus formed . a detail of leg stitches and a leg opening of hem 50 is shown in fig9 . fig9 is an enlarged detail of leg stitches and hem in fig1 a , 1 b , 1 c and fig8 . five rows of jersey stitches 44 and five rows of diamond patterned stitches 46 alternate and help hold the garment 20 in place . the stitches are not necessary for the function of the garment and are at the manufacturer &# 39 ; s discretion . the lower portion of the inner leg panel from the ankle to above the knee 36 a covers the inner part of the leg 40 at the leg panel seam 42 . the hem seam 48 creates the leg openings of the hem 50 . an additional embodiment is shown in fig1 . in this case the garment 120 is shown as a “ cut and sew ” garment with a “ cut and sew ” sewn in leg panel 138 . the novel features of the “ cut and sew ” example of the present invention are incorporated and illustrated in fig1 , 11 a , 11 b , 12 , 13 , 14 , and 15 . in general , the present invention is shown generally as a “ cut and sew ” washable garment 120 . it is an improvement over prior garments for both men and women whether they are classified as underwear , shaping garments , hosiery or as athletic garments . a person 128 is wearing the garment 120 and comprises numbers 122 through 170 . for purposes of clarity , like reference numerals are used where appropriate . the garment 120 is comprised of a torso portion 123 having a waistband 122 with a top 156 and a stitching line 158 , a front portion 124 , and a back portion 126 . further , the garment 120 contains a pair of leg portions of the garment 139 that are connected at a perforated line 130 and extend downwardly to the foot 148 of the person 128 wearing the garment 120 . a region of the angle formed by the junction of the legs or crotch 132 and inner parts of the leg 140 is covered by a “ cut and sew ” sewn in leg panel 138 . “ cut and sew ” sewn in leg panel 138 is comprised of a crotch portion of sewn in panel 134 and an inner leg portion of the “ cut and sew ” sewn in panel 136 that will be further described in fig1 . the garment 120 has a torso center front and back seams 127 a and 127 b respectively . a front and back leg panel seams 142 a and 142 b respectively connects the “ cut and sew ” sewn in leg panel 138 to the torso portion of the garment 123 and to the leg portion of the garment 139 a and 139 b , right and left respectively , which in total forms garment 120 . leg openings of hem 146 are formed when the hem of the pattern pieces of the garment 162 and the hem of “ cut and sew ” sewn in panel 164 and stitched to the hem seam 144 . an important aspect of this invention is to provide the garment with the “ cut and sew ” sewn in leg panel 138 , that eliminates the need for an inner thigh seam , which is generally shown in fig1 as being disposed of crotch portion 134 and an inner leg portion of sewn in panel 136 . “ cut and sew ” sewn in leg panel 138 is sewn into garment 120 so as to overlay the inner part of leg 140 and crotch 132 of the person 128 . the relative position of the “ cut and sew ” sewn in leg panel 138 is to cover the inner part of the leg 140 and is comprised of materials that have stretch , wicking , friction reduction , and antibacterial or antimicrobial characteristics and will be further described in fig1 . fig1 a and fig1 b are a representation of the front and back views of the pattern pieces used to construct the “ cut and sew ” garment 120 in fig1 and fig1 that are identical . the front of the pattern piece 150 of “ cut and sew ” garment 120 and the back of the pattern piece 152 of “ cut and sew ” garment 120 are comprised of “ cut and sew ” pattern piece top , 154 a and 154 b , representing front and back respectively . top of folded over waistband , 156 a and 156 b , representing front and back respectively and the waistband seam , 158 a and 158 b ; representing front and back respectively , comprise the waistband . both the right pattern piece fig1 a and the left pattern piece fig1 b have front and back sides to them . the fronts of the pattern pieces 124 of “ cut and sew ” garment 150 are comprised of two portions , the torso front portion of pattern pieces 124 a and the leg front portions of pattern pieces 124 b . the backs of the pattern pieces 126 of “ cut and sew ” garment 152 are comprised of two portions , the torso back portions of pattern pieces 126 a and leg back portions of pattern pieces 126 b . both pattern pieces have a hem seam 144 , a leg opening of hem 146 , and a bottom of pattern pieces , 160 a and 160 b , representing front and back respectively . sewn together front and back pattern pieces without the sewn in leg panel 125 is represented in fig1 . the garment is comprised of the same elements that are contained in fig1 a and fig1 b . the only additional components are torso center front and back seam , 127 a and 127 b respectively . the front seam 127 a holds the front portions of pattern pieces 124 a together . the torso center back seam 127 b hold the back portion of pattern pieces 126 a together . a perspective view of the sewn together front and back pattern pieces without the sewn in leg panel 125 is represented in fig1 . it is achieved by sewing the front portions of pattern pieces , 124 a and 124 a of fig1 a and fig1 b respectively together at the torso center front 127 a as well as the back portion of pattern pieces 126 a and 126 b respectively to form the torso center back seam 127 b . in this view the folded over waistband 122 , 122 a and 122 b representing front and back respectively , is created when the top of folded over waist and 156 a and 154 b , representing front and back respectively , is folded over and is sewn down on the waistband seam , 158 a and 158 b representing front and back respectively . the torso portion of garment 123 and the leg portions of the garment 139 a and 139 b , right and left respectively , comprise the “ cut and sew ” garment 121 . the front leg openings 124 b and the back leg openings 126 b are the areas the “ cut and sew ” sewn in leg panel 138 is to be attached . the other parts are identical to those previously described in fig1 a and fig1 b . fig1 is an enlarged detail of “ cut and sew ” sewn in panel 138 in fig1 , and fig1 . the inner leg portion of sewn in panel 136 consists of a lower portion from an area above the ankle to the knee 136 a and an upper portion from above the knee to the crotch area 136 b that are stitched together at seam 168 . the crotch portion of sewn in panel 134 connects the leg portions of the “ cut and sew ” sewn in panels 136 . the upper portion from above the knee to the crotch area 136 b is sewn to the crotch panel 134 by the seams represented by 170 . together both the inner leg portion of the “ cut and sew ” panel 136 and crotch portion 134 comprise the “ cut and sew ” sewn in leg panel 138 the sides of which are represented by 138 a and 138 b for sewing purposes . the tapering shape of the sewn in leg panel is dependent on the length of the garment but designed to cover an area of the inner part of the leg 140 and eliminates an inner thigh seam . the panel sections from the ankle to above the knee 136 a are comprised of the same material as the body of the garment and are connected to an upper portion from above the knee to the crotch area 136 b by a seam 168 . the seam 170 holds the upper portion of “ cut and sew ” leg panel 136 b to the crotch portion of the panel 134 . the panel sections from above the knee to the crotch area 136 b are comprised of a knit plated or knit double - faced fabric that wicks on the inside and is slick on the exterior of the garment . the slickness of the exterior reduces friction between the legs for the wearer . the crotch portion of sewn in panel 134 is comprised of a wicking material that is treated with an anti - bacterial , antifungal and or bacteriostatic chemical to reduce infections and odors for the wearer . or , it is plated as well , with a wicking fiber on the inside and an anti - bacterial , antifungal or bacteriostatic fabric on the outside . in both the upper portions from above the knee to the crotch area 136 b and the crotch panel 134 the wicking yarns can be chemically treated to be antibacterial , antifungal , and bacteriostatic . to save money for the manufacturer , the friction reducing yarn can be plated on one side only of the upper portion from above the knee to the crotch area 136 b to save money for the manufacturer and the consumer without loosing a decrease in function for the wearer . the hem seam of “ cut and sew ” panel 162 , leg opening of “ cut and sew ” sewn in panel 164 and bottom of “ cut and sew ” sewn in leg panel 166 finish the sewn in leg panel 138 . a perspective view of the sewn in leg panel 138 in fig1 is represented in fig1 . it contains all of the elements as in fig1 . the garment 120 is made by sewing together front and back pattern pieces shown in fig1 to the sewn in leg panel shown in fig1 . leg front portions of pattern pieces 124 b of the sewn together front and back pattern pieces without the “ cut and sew ” sewn in leg panel 125 are sewn to side 138 a of the “ cut and sew ” sewn in leg panel 138 . leg back portions of pattern pieces 126 b of the sewn together front and back pattern pieces without the “ cut and sew ” sewn in leg panel 125 are sewn to side 138 b of the “ cut and sew ” sewn in leg panel 138 . this forms the front and back leg panel seams 142 . the garment is finished when the bottoms of pattern pieces 160 and the bottom of “ cut and sew ” sewn in leg panel 164 are turned up and sewn down on the hem seam 144 and on the hem seam of “ cut and sew ” sewn in leg panel 162 to create the leg opening of hem 146 . the knit sewn in leg panel 38 and the “ cut and sew ” sewn in leg panel 138 can be made part of any type of garment whether it is seamless or “ cut and sew ” and there are various possibilities regarding the design of the garments that can utilize the sewn in leg panel 138 whether of a knit or “ cut and sew ” construction . some examples of the types of garments that can utilize the knit seamless sewn in leg panel are represented in fig1 a - 16c . unless stated otherwise they contain the elements as in fig1 - a , 1 - b 1 - c , and 10 previously identified . a three - quarter view of a maternity seamless garment worn by a woman , with a waistline 22 in the midriff area , and is below the knee length is represented in fig1 a . a three - quarter view of a seamless garment worn by a man with a natural waistline 22 , is an above the knee length , has a separate sewn on waistband 35 , and a fly front closure 25 is represented in fig1 b . a three - quarter view of a seamless garment worn by a woman with a plated turtleneck styled collar 21 has been added to the garment that is the same construction as the knit sewn in leg panel 38 , a turtleneck seam 74 , long sleeves 29 attached to the garment 20 by a armhole seam 72 and front zipper closure 27 is represented in fig1 c . a plated underarm gusset 37 has been added to the garment that is the same construction as the knit sewn in leg panel 38 comprised of the chemically treated antibacterial or antimicrobial wicking and friction reduction yarns or fibers . the “ cut and sew ” sewn in leg panel 138 can also be utilized in “ cut and sew ” garments as represented in fig1 a and 17b . unless stated otherwise they contain the elements in fig1 and 15 previously identified . a three - quarter view of a “ cut and sew ” garment worn by a woman with a waistline 22 in the “ bikini ” position , is ankle length , and has an oblique below the knee seam 168 detail on the “ cut and sew ” sewn in leg panel 138 is represented in fig1 a . a three - quarter view of a “ cut and sew ” garment worn by a woman with a natural waistline , and is a boy cut length with a separate sewn on waistband 35 is represented in fig1 b . the fig1 a - 17b illustrate the point that the knit sewn in leg panel 38 and the “ cut and sew ” leg panel 138 can be sewn into any type of garment whether classified as underwear , shaping garments , athletic or ready - to - wear . two methods can be utilized to construct them . the first method is to knit a antibacterial , antifungal and or bacteriostatic yarn or fibers 70 with an inner wicking yarn or fiber 68 together with a friction reducing yarn or fiber 66 so that the wicking / antibacterial , antifungal , antimicrobial layer is against the skin and the friction reducing yarn or fiber is on the outer surface of the garment 120 . the second method is to knit the wicking yarn or fiber 68 together with a friction reducing yarn or fiber 66 so that the wicking layer is against the skin and the friction reducing yarn or fiber is on the outer surface of the garment 120 . the wicking yarns can then be chemically treated to be antibacterial , antifungal , and or bacteriostatic . garments can have any style of waistband whether a folded over waistband 22 or separate sewn on waistband 35 . the placement of the waistband determines the “ design style ” of the garment . examples of waistband 22 or separate sewn on waistband 35 placement include “ bikini ”, “ tanga ”, “ french cut ”, “ midriff style ”, “ american ”, “ natural ”, “ japanese ” or any placement variation thereof . if the garment 20 is “ seamless ” and has a waistband 22 , it can be knit into the garment 20 , folded over and hemmed . the waistband 22 can also be knit into the garment with a different type of stitch construction and the top edge of the waistband 22 can be finished on the knitting machine . if the garment 20 is a “ cut and sew ” type the waistband 22 is folded over and sewn down forming a casing . this type of waistband 22 may or may not contain elastic or any other type of stretch materials . on both types of garment 20 , “ seamless ” and “ cut and sew ”, the waistband can also be sewn on separately . when a separate sewn on waistband 35 is sewn on it can also be made of elastic or any other type of stretch material . the garment 20 can also be constructed as a full bodysuit , see fig1 c , and the waistband 22 can be omitted altogether . the garment 20 can have any type of identifying label sewn onto the back of the waistband 22 . if the garment 20 is “ seamless ” and has a waistband 22 , it can be knit into the waistband 22 . identifying information can be heat sealed onto the waistband 22 . the garments 20 and 120 can be any length , “ boy cut ”, “ mid - thigh ”, “ three - quarter thigh ”, “ above the knee ”, “ below the knee ”, “ capri ”, “ flood ”, “ midi ”, “ ankle ”, or any variation of the length up or down the leg . the garments 20 and 120 can also be manufactured without legs , for example as a “ thong ”, and any other version thereof , and only contain the unique features of the crotch portion of knit sewn in panel 34 and the crotch portion of “ cut and sew ” sewn in leg panel 134 . to help prevent the garment 20 from riding up the leg , in the knit “ seamless ” construction , five rows of jersey stitches 44 and five rows of diamond - patterned stitches 46 can be incorporated into the garment 20 but are not mandatory . the type of stitches at the hemline can be changed at the manufacturer &# 39 ; s discretion to prevent the garment from riding up or down the leg . the alternating five rows of jersey stitches 44 and five rows of diamond - patterned stitches 46 are not mandatory for the function of the garment . other types of materials , such as a silicone strip , may also be added to the inside of the hems 48 and 144 to prevent them from riding up at the manufacturers discretion . the “ cut and sew ” versions of the garment 120 do not contain these stitches . first and second leg opening 50 a and sob respectively of hem 50 can have any detailing the manufacture wishes to incorporate into the garment 120 to hold the garment in place such as a strip of silicone . other types of seam placement such as princess seams on the torso portion of the garment 23 are also at the manufacturer &# 39 ; s discretion and will not affect the function of the knit sewn in leg panel 38 or the “ cut and sew ” sewn in leg panel 138 . the shape of the knit sewn in leg panel 38 , that eliminates the need for an inner thigh seam , can be long and rectangular , short and rectangular , hourglass , tapered or not depending on the length of the garment 20 . in a “ seamless ” version of garment 20 the crotch portion of sewn in panel 24 may be made narrower to form the hourglass shape by increasing the tension on the stitches in the crotch portion of the sewn in panel 24 . on an ankle length version of garment 20 , the hem 50 , can be made narrower . this can be accomplished by increasing the tension in the stitches at the hem 50 . cutting the lower portion of the inner leg portion of the knit sewn in leg panel from an area from the ankle to above the knee in a tapered fashion out of knit tubular fabric will also accomplish a tapered effect . if the knit sewn in leg panel 38 is knit as a separate piece , and is not cut from a long tubular piece of fabric , the number of stitches may be increased or decreased , as the pattern requires achieving the desired shape . the shape of the knit sewn in leg panel 38 will vary depending on the size and length of the garment 20 but the pattern should always be cut to cover the part of leg and crotch of body 40 to be functional . it can be cut to cover an area larger than the inner part of leg and crotch of body however if the manufacturer wishes . regarding the “ cut and sew ” sewn in leg panel 138 required for a “ cut and sew ” garment , once again , the pattern piece is cut in a tapered hourglass shape for an ankle length version of garment 20 . the shape of the sewn in leg panel 138 will vary depending on the size and length of the garment 120 but the pattern should always be cut to cover the part of leg and crotch of body 140 to be functional . it can be cut to cover an area larger than the inner part of leg and crotch of body 140 however if the manufacturer wishes . another embodiment of the present invention is incorporated and illustrated in fig1 a - 19e . in general , the present invention in fig1 a and 18b is shown generally as a pair of washable pantyhose with plated inner thigh area , plated crotch and plated bottom and sides of foot or garment 220 . it is an improvement over prior pantyhose . a person 228 is wearing the garment 220 and comprises numbers 220 through 250 . for purposes of clarity , like reference numerals are used where appropriate . the garment 220 is comprised of a torso portion 223 having a waistband 222 , with a top of folded over waistband 248 , a seam of folded over waistband 250 , a front portion 224 , and a back portion 226 . torso center front and back seams , 227 a and 227 b respectively , hold the two torso portions of the pantyhose 223 together . further , the garment 220 contains a pair of leg portions of the garment 239 that are connected at a perforated line 230 and extend downwardly to the plated bottom and sides of foot 244 of the person 228 wearing the garment 220 . the plated bottom and sides of foot 244 has a toe seam 245 . a plated crotch gusset 236 , which will be further described , in fig1 d and fig1 e , covers a region of the angle formed by the junction of the legs or crotch 232 . a plated knit inner thigh leg area 242 , of the garment 220 , and a plated crotch gusset 236 , covers an inner part of the leg 240 . plated inner thigh knit leg area 242 is adjacent to a plated crotch gusset 236 that will be further described in fig1 d and fig1 e . an important aspect of this invention is to provide the garment with the plated knit inner thigh leg area 242 , and plated crotch gusset 236 , which is generally shown in fig1 a , 18 b . plated knit inner thigh leg area 242 , is knit into garment 220 so as to overlay the inner part of leg 240 of the person 228 . the relative position of plated knit inner thigh leg area 242 , is to cover the inner part of the leg 240 and is comprised of yarns that have stretch , wicking , antibacterial or antimicrobial , and friction reduction properties . this will be further described in fig1 b and fig1 g . the plated crotch gusset 236 is comprised of fibers that have wicking and antibacterial or antimicrobial characteristics and or friction - reducing properties will be further described in fig1 e , and fig1 f . tactel ®, a type of wicking yarn is used on the inside of the plated area and tactel ®, cotton , polyester , viscose , and or wool , for example , would be utilized on the outside of the plated areas . or , a yarn or fiber with a higher dpf , denier per filament , is plated on the inside of a fabric , and a yarn or fiber with a lower dpf , is plated on the outside of a surface of a fabric . the higher dpf material has fatter , larger filaments and the lower dpf material has more smaller , thinner filaments . as a result the moisture on the inside of a person &# 39 ; s skin is wicked away by the material with the larger dpf to the surface of the fabric with the lower dpf . the surface of the wetted area on exterior surface of the garment is greater than the surface of the wetted area on the inside . the result is that a person &# 39 ; s skin stays dry . another method of producing wicking would be to plate fibers or yarns with different shapes together . for example , if moisture is on a person &# 39 ; s skin , it will wick from an surface comprised of yarns or fibers that has few “ lobes ” or “ clover leafed ” shapes into a surface which is comprised of yarns or fibers that have many “ lobes ” or “ clover leafed ” shapes . the surface of the wetted area on exterior surface of the garment is greater than the surface of the wetted area on the inside . the result is that a person &# 39 ; s skin stays dry . fig1 b is a perspective view of garment 220 in fig1 a showing the torso portion 223 and leg portions 239 of the garment 220 . the torso portion 223 shows a folded over waistband 222 with a top 248 and a seam 250 . the leg portions 239 have a plated bottom and sides of foot 244 and a toe seam 245 . the front portions of the garment 224 are sewn together at the torso center front seam 227 a and the back portions of garment 226 is sewn together at the torso center back seam 227 b . there is a plated crotch gusset 236 in a region of the angle formed by the junction of the legs or crotch 232 . this will be further explained in fig1 e and 19f . a plated knit inner thigh leg area 242 . in the garment 220 covers the inner portion of the leg 240 . this will be further explained in fig1 b and 19g . the plated bottom and sides of foot 244 and the toe seam 245 complete the garment . fig1 a is a representation of the circular knit tubes 252 out of which the pantyhose garment 220 is constructed . they are comprised of a circular knit tube tops 246 , tops of the folded over waistband 248 , and waistband seam placement 250 b that form the waistband 222 . the outer sides of knit tubes forming pantyhose garment 254 , and the inner side of knit tubes 256 , comprises the tubes . a portion of the tube is knit in a plated manner and creates a plated knit inner thigh leg area 242 . this plated knit inner thigh leg area 242 . is designed to cover the inner part of leg 240 . a cross section through the plated knit inner thigh leg area 242 and plated bottom and sides of foot 244 is represented by lines 19 b - 19 b and will be further explained in fig1 b and 19g . an area of the bottom of the knit tube is knit in a reinforced manner and forms the plated bottom and sides of foot 244 when the toe seam 245 is stitched . fig1 b is an enlarged detail of the plated inner thigh sections 19 b - 19 b and plated bottom and sides of foot 19 b - 19 b . an outer “ bright ” yarn or friction reducing yarn 238 is plated over an inner wicking yarn or fiber 243 . the resulting knit fabric that makes up the plated knit inner thigh leg area 242 and the plated bottom and sides of foot 244 . is worn against the person &# 39 ; s 228 skin . the wicking yarn can be chemically treated to be antibacterial , antifungal or bacteriostatic . fig1 g is an alternative method of constructing the cross section taken through section lines 19 b - 19 b in fig1 a . an antibacterial , antifungal or bacteriostatic yarn or fiber 241 is knit together with a wicking yarn or fiber 243 to form the inner layer and plated with an outer “ bright ” yarn or friction reducing yarn . the resulting knit fabric that makes up the plated knit inner thigh leg area 242 and the plated bottom and sides of foot 244 is worn against the person &# 39 ; s 228 skin . should the manufacturer wish the wicking yarns or fibers can be chemically treated to be antibacterial , antifungal or bacteriostatic . in this case the antibacterial , antifungal or bacteriostatic yarn or fiber 241 can be omitted to reduce costs . fig1 c is identical to fig1 a with the exception that the inner side of knit tube forming pantyhose garment with the cut edges of knit tubes , 256 a the front , and 256 b the back , respectively are shown . fig1 d is a perspective view of the two leg panels that have been sewn together forming the torso center front and back seams , 227 a and 227 b respectively . the toes have been sewn forming the toe seam 245 . all other parts are identical to those previously identified . the plated crotch gusset 236 is shown separately and has not been sewn in and a cross section represented by lines 19 e - 19 e will be further explained in fig1 e . to finish the pantyhose garment 220 , a hole is burned into the crotch 232 area of the garment 220 , and then the plated crotch gusset 236 is stitched into the hole . to garment 220 may be “ boarded ” to obtain a pair of pantyhose in the shape of a person &# 39 ; s 228 leg or not , and is at the discretion of the manufacturer . fig1 e is an enlargement of a cross section taken through section lines 19 e - 19 e in fig1 d . an outer antibacterial , antifungal or bacteriostatic yarn or fiber 241 is plated over an inner wicking yarn or fiber 243 . the resulting knit fabric that makes up the platted crotch gusset 236 is worn against the person &# 39 ; s 228 skin . should the manufacturer wish the wicking yarns or fibers can be chemically treated to be antibacterial , antifungal or bacteriostatic . in this case the outer antibacterial , antifungal or bacteriostatic yarn or fiber 241 can be omitted to reduce costs . fig1 f is an alternative method of constructing the cross section taken through section lines 19 e - 19 e in fig1 d . an antibacterial , antifungal or bacteriostatic yarn or fiber 241 is knit together with a wicking yarn or fiber 243 to form the inner layer and plated with an outer “ bright ” yarn or friction reducing yarn . the resulting knit fabric that makes up the platted crotch gusset 236 is worn against the person &# 39 ; s 228 skin . should the manufacturer wish the wicking yarns or fibers can be chemically treated to be antibacterial , antifungal or bacteriostatic . in this case the antibacterial , antifungal or bacteriostatic yarn or fiber 241 can be omitted to reduce costs . another embodiment of the present invention is incorporated and illustrated in fig2 a - 20d . in general , the present invention in fig2 a and 20c is shown generally as a washable below the knee garment with plated inner thigh area or garment 320 . it is an improvement over prior garments . a person 328 is wearing the garment 320 and comprises numbers 320 through 345 . for purposes of clarity , like reference numerals are used where appropriate . the garment 320 is comprised of a torso portion 323 having a waistband 322 , with a top of folded over waistband 325 , a hem of folded over waistband 329 , a front portion 324 , and a back portion 326 . torso center front and back seams , 327 a and 327 b respectively , hold the two torso portions of the garment 320 together . further , the garment 320 contains a pair of leg portions of the garment 339 that are connected at a perforated line 330 and extend downwardly . a plated crotch gusset 334 , which will be further described , in fig2 c and fig2 d , covers a region of the angle formed by the junction of the legs or crotch 332 . an inner part of the leg 340 is covered by a plated knit inner thigh leg area 335 , and a plated crotch gusset 334 . plated inner thigh knit leg area 336 will be further described in fig2 a and fig2 b . a hem seam 338 and the bottom of folded edge of hem 340 finish the garment . an important aspect of this invention is to provide the garment with the plated knit inner thigh area 336 , a plated crotch gusset 334 , and which is generally shown in fig2 a , 20 b . the garment 320 is constructed in the same way as the pantyhose garment 220 , thus avoiding seams in the inner part of leg 345 . the plated knit inner thigh leg area of garment 336 is knit into garment 320 so as to overlay the inner part of leg 345 of the person 328 . the relative position of plated knit inner thigh leg area of garment 336 is to cover the inner part of leg 345 and is comprised of yarns that have stretch , wicking , antibacterial , antifungal and or antimicrobial , and friction reduction properties . this will be further described in fig2 b . the plated crotch gusset 334 is comprised of fibers that have wicking and antibacterial , antifungal or antimicrobial characteristics and will be further described in fig2 c . fig2 b is an enlarged detail of the plated inner thigh sections 20 b - 20 b . an outer “ bright ” yarn or friction reducing yarn 344 is plated over an inner wicking yarn or fiber 342 . the resulting knit fabric that makes up the plated knit inner thigh leg area 336 is worn against the person &# 39 ; s 328 skin . the wicking yarn can be chemically treated to be antibacterial , antifungal or bacteriostatic . or , it can be knit with yarns or fibers that are antibacterial , antifungal or bacteriostatic together with the outer “ bright ” yarn or friction reducing yarn 344 so that the wicking / antibacterial , antifungal , bacteriostatic layer is against the skin 328 and the outer “ bright yarn or friction reducing yarn 344 is on the outer surface of the garment . fig2 c is an enlargement of a cross section taken through section lines 20 c - 20 c of the plated crotch gusset 334 . an outer antibacterial , antifungal or bacteriostatic yarn or fiber 346 is plated over an inner wicking yarn or fiber 342 . the resulting knit fabric that makes up the platted crotch gusset 334 is worn against the person &# 39 ; s 328 skin . should the manufacturer wish the wicking yarns or fibers can be chemically treated to be antibacterial , antifungal or bacteriostatic . in this case the outer antibacterial , antifungal or bacteriostatic yarn or fiber 346 can be omitted to reduce costs . an outer “ bright ” yarn of friction reducing yarn 344 may or may not be used in place of the outer antimicrobial , antifungal or antibacterial yarns or fibers . fig2 d is an alternative method of constructing the cross section taken through section lines 20 c - 20 c in fig2 d . an antibacterial , antifungal or bacteriostatic yarn or fiber 241 is knit together with an inner wicking yarn or fiber 243 to form the inner layer and plated with an outer “ bright ” yarn or friction reducing yarn 238 . the resulting knit fabric that makes up the platted crotch gusset 236 is worn against the person &# 39 ; s 228 skin . should the manufacturer wish the wicking yarns or fibers can be chemically treated to be antibacterial , antifungal or bacteriostatic . in this case the antibacterial , antifungal or bacteriostatic yarn or fiber 241 can be omitted to reduce costs . fig2 , fig2 , fig2 and fig2 represent additional embodiments of garments that have wicking , antibacterial / antifungal / bacteriostatic and low friction properties . these garments have areas of inner wicking yarn 342 and outer “ bright ” yarn or friction reducing yarn 344 which are represented by the hatch marks . in these examples the inner friction yarn is treated with an antibacterial , antifungal or bacteriostatic chemicals . antibacterial , antifungal or bacteriostatic fibers can also be incorporated with the inner wicking yarn 342 when plating the material . the plating of these yarns in areas where there is moisture , heat and friction of skin rubbing against skin is very important in the reduction of intertrigo for the wearer of the garments . affected areas can include areas between and below the breasts as in fig2 is a plated brassiere , which may be plated in its entirety or in only affected areas , including between and / or below the breasts . as is conventional , the brassiere includes two breast supporting portions , which may optionally include a pair of cups ; the breast supporting portions are connected by a fabric bridge ; and a thorax - encircling band is united with the fabric bridge , and optionally one or more straps . affected areas can also include below the abdomen , between the ribs and under the gut as in fig2 , below the gut , in the crotch , and between the thighs as in fig2 , and under the armholes and around the neck as in fig2 . all of these treated areas may be included singularly or in addition to other treated areas of a garment . all of these treated areas , represented by the hatch marks , can have the areas of inner wicking yarn 342 , antibacterial / antifungal / bacteriostatic yarns 346 , that are plated with an outer “ bright ” yarn or friction reducing yarn 344 . the manufacturer is not limited to plating the designated areas exclusively . the garments may be plated in their entirety . the area with the hatch marks should consist of an inner wicking yarn 342 layer and an outer “ bright ” yarn or friction reducing yarn 344 . the antimicrobial , antifungal or antibacterial yarns or fibers can be knit with the inner wicking yarn 342 or the inner wicking yarn 342 can be chemically treated with antimicrobial , antifungal or antibacterial chemicals . the method to make these garments can either be “ cut and sew ”, utilizing either wovens or knits , or knit , using circular or flat knitting techniques . the knits may be constructed with seams in a “ cut and sew ” fashion or knit in a circular method to produce a seamless circular knit tube from which “ seamless ” knit garments are formed . it is understood that the invention is not limited to human apparel . the invention can also be used in pet apparel , and the like . it is also understood that the invention is not restricted to the detailed description of the invention , which may be modified without departure from the accompanying claims . from the description above , a number of advantages of my knit plated areas become evident : ( a ) the portions of the panel from below the knee or above the knee to the crotch , i . e ., the upper portion of the leg panels from above the knee to the crotch area , 36 b , 136 b , and the plated knit inner thigh leg area 242 eliminates the need for an inner thigh seam and thus irritation for the wearer , and consists of wicking fibers that have a plated outer friction reducing yarn or fiber , wick moisture away from a person &# 39 ; s skin and reduce friction between a person &# 39 ; s legs . ( b ) the wicking . the combination of these yarns helps the skin stay dry , and help reduce the possibility of infections and concomitant odors . or , the wicking yarns or fibers are plated with an antibacterial , antifungal , and bacteriostatic yarns or fibers on the inside of the garment and the friction reducing yarns or fibers are plated on the outside of the garment . ( c ) should the manufacturer wish , the antibacterial , antifungal , and bacteriostatic yarns or fibers can be eliminated in all of the areas previously described examples and the wicking fibers can be treated chemically with antibacterial , antifungal , and bacteriostatic chemicals to help eliminate odors and infections . ( d ) should the manufacturer wish the friction reducing yarns on the knit sewn in leg panel could be eliminated on one side to reduce costs . friction reducing yarns are very expensive when compared to other yarn costs , sometimes ten times as much . the function of the friction reduction is not reduced for the wearer of the garment when one side is plated . since friction reducing yarns typically retain heat it is preferable that they be eliminated on one side . ( e ) the panels and gussets , whether knit sewn in leg panel 38 , the “ cut and sew ” leg panel 138 , and the plated crotch gusset 236 with the plated knit inner thigh panel 242 , or any other type of panel with the previously described construction can be sewn or plated into any type of garment including ones not mentioned here with the sole purpose of reducing moisture , friction and bacteria or fungus or yeast for the wearer . it is up to the manufacturer to choose the type of garment to sew or plate the panels into . ( f ) the panels or plated areas can be utilized by both genders and are not age specific . they can be utilized in the manufacture of any type of articles of apparel where wicking , friction reduction , and antibacterial , antifungal , and bacteriostatic properties are needed . ( g ) the panel or plated areas &# 39 ; shapes can be tailored to accommodate the various types of garments manufactured and can be made larger or smaller as size determines as long as the affected areas are covered . ( h ) the panels or plated areas can be used independently of a wicking and antimicrobial and bacteriostatic gusset should the manufacturer wish . ( i ) all comparable parts of the garments are interchangeable , for example , the knit sewn in leg panel 38 can be utilized on a “ cut and sew ” garment and the “ cut and sew ” leg panel 138 can be utilized in a seamless garment should the manufacturer wish . ( j ) the knit plated panels and areas in the legwear or hosiery can be used on any type of hosiery or legwear whether it is sheer , semi - opaque , opaque , non - control , control , a shaper , or any other type . it may also be utilized with any type of pattern such as lace , geometric , stripes , dots , or any other one the manufacturer wishes to utilize . ( k ) the combination of the yarns helps the skin stay dry and without irritation from rubbing . intertrigo is a red , moist irritation or friction in the following areas of a person ; the groin and inner thigh area of people whose thighs rub together , between and under the breasts , between the ribs , under the gut , under the arm , in skin folds between the ribs and around the neck . the moist irritated skin can be infected with yeast , fungus and bacteria . the antibacterial , antifungal , and bacteriostatic yarns or chemical treatment of the fibers helps reduce infection . these types of embodiments of the wicking , friction reduction and antibacterial , antifungal , and bacteriostatic yarn or chemicals , reduce intertrigo for the wearers . ( l ) the garments contain panels or plated areas that are knit , thus providing superior fit over a woven garment with plated panels or areas . knit conform more to the body and move with it when compared to a woven garment with plated areas or panels . knitting is a very different process than weaving and is preferred for a garment that fits closely to the body that is curved . ( m ) two criteria for ensuring wicking are utilized that will ensure that the skin stays dry . the first method included yarns or fibers with a higher dpf , denier per filament , is plated on the inside of a fabric , and a yarn or fiber with a lower dpf , is plated on the outside of a surface of a fabric . the second method of using fibers or yarns with different shapes where there are fewer shapes on the yarns or fibers next to the skin in comparison to the number of shapes on the yarns or fibers on the outside surface of the material . both methods insure that the surface of the wetted area on exterior surface of the garment is greater than the surface of the wetted area on the inside . the result is that a person &# 39 ; s skin stays dry . although the description above contains many specificities , these should not be construed as limiting the scope of the invention but as merely providing illustrations of some of the presently preferred embodiments of this invention . for example , the gusset can have other shapes such as oval , trapezoidal , triangular , etc . the inner leg panels or plated areas can have other shapes , such as oval , trapezoidal , etc as long as the inner thigh area is covered . the seams can be flat locked , french seamed ; simulated french seamed , double - stitched , flat - felled , hairline , double - stitched , over edge - stitched , topstitched , double topstitched , lapped , tucked , etc . the style lines for the seam placement in the “ cut and sew ” garment &# 39 ; s “ cut and sew ” sewn in leg panel can be placed either above the knee or below it in any area to the ankle and can be horizontal or oblique . all parts of the garment including the inner leg panels , crotch areas , and gussets may contain a stretch fiber for memory and shape retention . an illustrative example of the spandex type of yarn may take the form of dupont &# 39 ; s ® lycra ® brand spandex or bayer &# 39 ; s ® and dorlastan ®, each of which are made from elastic fibers . the spandex fiber can be covered , wrapped , with other fibers - natural or man - made - and is often used in this form in hosiery , narrow fabrics and wovens for ready - to - wear . the spandex can be covered in five ways : single - covered , double - covered , corespun , interlaced or air - covered and core - twisted as the manufacturer wishes . the knits can be warp knits , such as a raschel knit , or a tricot knit , and is ideal but not limited to bodywear and active sportswear . circular knits , such as jersey knits , are ideal for bodywear , sportswear , and hosiery . in hosiery and ready to wear , where circular knitting machines are utilized such as a santoni ® machines , the spandex can also be “ laid in ” between rows of knitting , or knitted into every stitch , the latter producing superb fit and uniformity in the stitches . the amount of spandex can range from as little as 1 % to as much as 30 % for shapewear . the bodies of the garments may be made of many materials whether man - made or natural or any and all blends of man - made fibers and synthetics . they include cotton , wool , silk , leather , linen , vinyl , model , nylon - polyamides and polyamide co - polymers , lycra ® spandex in different filament configurations , orion , polyvinylidene fluoride , such as knar ® polyester , for example , polyethylene terepthalate , glycol modified polyesters , such as petg ®, kodura ®, rayon , orion cellulosic fiber blends , and the like , as well as blends of the above . the choice of materials to make the bodies of the garment out of is left to the discretion of the manufacturer . closures may be zippers , velcro ®, buttons , snaps or any other type of closure the manufacturer wishes to utilize . the fly closure may be made in any design as the manufacturer wishes . thus the scope of the invention should be determined by the appended claims and their legal equivalents , rather than by the examples given .	8
referring initially to fig1 - 3 and 5 of the drawings the tandem apparatus of this invention is generally illustrated by reference numeral 1 . the tandem apparatus 1 is characterized by a frame 3 , which is typically shaped by cylinder mounts 6 and end frame members 4 , spanning side frame members 5 , as illustrated . a pair of front rod driving members 11 include a pair of parallel hydraulic cylinders 12 , each having a front end 11 a and cylinder mount flanges 15 , secured to one of the cylinder mounts 6 of the frame 3 , typically using mount bolts 18 , as illustrated . a pair of rear rod driving members 56 are disposed opposite the front rod driving members 11 in the frame 3 and include a second set of parallel hydraulic cylinders 12 , mounted to the second cylinder mount 6 using additional mount bolts 18 . each of the four hydraulic cylinders 12 includes a piston 19 ( fig5 ), having a piston rod 20 which extends through the front end 11 a of the front rod driving members 11 and the rear rod driving members 56 , respectively . the piston rod 20 of the hydraulic cylinders 12 in the front rod driving members 11 are each connected to a common front yoke 84 , which mounts a single gripping element 25 , as further illustrated in fig1 . similarly , the piston rods 20 of the hydraulic cylinders 12 in the rear rod driving members 56 are each connected to a common rear yoke 85 , which mounts a second gripping element 25 . it will be appreciated from a consideration of fig1 - 3 that the gripping elements 25 are in alignment to receive a pull rod 40 or a pull cable ( not illustrated ), as desired . one end of the pull rod 40 is attached to the front end of a bursting and stored energy head 43 , illustrated in phantom in fig1 . the opposite end of the pull rod 40 extends through aligned rod or cable openings 4 a in the end frame members 4 ( fig1 ) and through the respective aligned gripping elements 25 . in the case of a pull cable ( not illustrated ) the free end of the cable may be gathered on a cable take - up drum ( not illustrated ), as desired . referring to fig2 and 8 - 12 of the drawings , the tandem apparatus 1 is illustrated in alternating push or pull configurations . referring initially to fig2 the gripping element 25 which is attached to the front yoke 84 served by the parallel hydraulic cylinders 12 in the dual front rod driving members 11 is illustrated as engaging the pull rod 40 , while the gripping element 25 mounted on the rear yoke 85 and served by the dual , parallel hydraulic cylinders 12 in the rear rod driving members 56 , is released from the pull rod 40 . as the parallel piston rods 20 in each of the hydraulic cylinders 12 of the front rod driving members 11 extend , the pull rod is advanced in the direction of the arrows in fig2 throughout the full stroke of the piston rods 20 . when this stroke is complete , the gripping element 25 in the front rod driving members 11 releases its grip from the pull rod 40 and the gripping element 25 in the rear rod driving members 56 grips the pull rod 40 , as the piston rods 20 in the corresponding hydraulic cylinders 12 retract and continue the forward movement of the pull rod or cable 40 in the direction of the arrow , throughout the full stroke of the piston rods 20 , as illustrated in fig3 . the sequence continues in order to advance the pull rod or cable 40 and pull or push the bursting head ( not illustrated ) through a pipe to be broken , as hereinafter further described . sequential gripping of the rod 40 by the respective gripping elements 25 is effected by contact between the unidirectional teeth 27 b shaped in the respective wedges 27 , as illustrated in fig8 and 12 of the drawings . the respective sets of teeth 27 b grip the rod 40 as each gripping element 25 is forced in the direction of the arrows in sequence by the respective hydraulic cylinders 12 as described above with respect to fig2 and 3 of the drawings . the degree of force applied by the teeth 27 b on the rod 40 is determined by the tension in the gripping element spring 35 ( fig8 ) or the rubber washers 38 ( fig1 ). reverse non - gripping movement of the respective gripping elements 25 on the pull rod 40 is facilitated since the rod 40 motion is opposite the unidirectional orientation of the respective teeth 27 b in the corresponding wedges 27 ( fig2 , 8 and 12 ). referring now to fig4 of the drawings it will be appreciated by those skilled in the art that the tandem apparatus 1 illustrated in fig1 can be vertically oriented for operation in a manhole structure 88 , ( illustrated in phantom ) typically in the orientation detailed in my u . s . patent application ser . no . 10 / 234 , 216 , filed sep . 4 , 2002 , now u . s . pat . no . 6 , 672 , 802 . accordingly , the frame 3 can be attached to the vertically - oriented pulley mount 89 ( illustrated in phantom ) that is inserted in the base or bottom of the manhole structure 88 and the apparatus includes a bottom pulley 93 , secured to the pulley mount 89 at the bottom of the manhole structure 88 . accordingly , a pull cable 40 a ( illustrated in phantom ) extends around the bottom pulley 93 , horizontally to a bursting and stored energy head 43 , also illustrated in phantom , and upwardly , parallel to the pulley mount 89 , through the aligned gripping elements 25 , to a cable drum 89 a ( illustrated in phantom ) designed to take up the slack in the pull cable 40 a during the operation of the vertically - oriented tandem apparatus 1 . a top pulley 95 is fitted to the top end of the pulley mount 89 to align the pull cable 40 a with the cable drum 89 a , as further illustrated in fig4 . accordingly , operation of the tandem apparatus 1 in the manner heretofore described with respect to fig2 and 3 and the pull rod 40 , facilitates progressive extension of the pull cable 40 a upwardly for spooling on the cable drum 89 a and causes the bursting and stored energy head 43 to extend through and break the pipe 83 . as further heretofore described , a hammer 41 ( illustrated in phantom ) is used in association with the bursting and stored energy head 43 and the tension in the pull cable 40 a to advance the bursting and stored energy head 43 through the pipe 83 as the bursting and stored energy head 43 approaches the bottom of the manhole structure 88 . operation of the tandem apparatus 1 illustrated in fig1 - 4 of the drawings is effected by tandem , selectively alternating or simultaneous operation of the hydraulic cylinders 12 in the manner illustrated in fig5 - 7 of the drawings . referring initially to fig5 and 6 , pressurized hydraulic fluid ( not illustrated ) is introduced into the fluid chambers 14 of each of the parallel sets of hydraulic cylinders 12 in the front rod - driving members 11 and the rear rod driving members 56 , through the respective front hydraulic fluid port 22 ( fig5 ). the hydraulic fluid applies pressure to the piston 19 to facilitate rearward displacement of the piston 19 in the fluid chamber 14 in the direction of the arrow . this action causes rearward extension of the piston rod 20 through the front end 11 a , sealed by the front end o - rings 11 b , and the end plate 13 , sealed by the end plate o - rings 17 , respectively , in the hydraulic cylinders 12 . reverse operation of the hydraulic cylinder 12 by entry of the hydraulic fluid into the rear hydraulic cylinder fluid port 22 a ( fig5 ) effects a reverse movement of the piston 19 and the piston rods 20 in each of the hydraulic cylinders 12 , in operation of the tandem apparatus 1 . as illustrated in fig7 the tandem apparatus 1 is typically operated by means of a hydraulic fluid system that includes a hydraulic pump 96 a , that pumps hydraulic fluid from a hydraulic fluid tank 96 , initially through a hydraulic feed line 97 , to the hydraulic cylinders 12 of the front rod driving members 11 , as illustrated in fig5 and described above . this hydraulic feed effects extension of the corresponding front yoke 84 and associated gripping element 25 in the direction of the arrows . hydraulic fluid also flows from the front rod driving members 11 hydraulic cylinders 12 , to the dual hydraulic cylinders 12 of the rear rod driving 56 members , to extend the rear yoke 85 and the corresponding gripping element 25 in non - gripping sequence . the fluid then flows back into the hydraulic fluid tank 96 through the hydraulic fluid return line 99 . the hydraulic fluid flow is then reversed to reverse the operation of the tandem apparatus described above . referring now to fig8 - 11 of the drawings , in a preferred embodiment of the invention the two gripping elements 25 that receive the pull rod 40 or the pull cable 40 a are each characterized by a cylindrical adaptor housing 26 , having a cone - shaped internal top surface that houses three correspondingly - tapered wedges 27 ( illustrated in phantom ), each fitted with a set of unidirectional teeth 27 b and a threaded wedge hole 27 a in the top thereof , as illustrated in fig8 and 12 . a mount flange 28 encircles the adaptor housing 26 at the top thereof and a pair of diametrically - opposed mount flange slots 28 a are provided in the mount flange 28 , for purposes which will be hereinafter described . a rod or cable opening 29 is also provided in the centers of the cone - shaped wedges 27 at the point of convergence of the wedges 27 and the teeth 27 b , as illustrated in fig9 for receiving a pull rod 40 or a pull cable 40 a ( illustrated in phantom in fig8 and 12 ). the pull rod 40 or pull cable 40 a also extends through the center of a gripping element spring 35 , interposed between a bottom compression plate 37 , positioned directly above the wedges 27 , and a top compression plate 34 , as further illustrated in fig8 of the drawings . the top compression plate 34 includes three threaded stabilizing bolts 36 , each having stabilizing bolt nuts 36 a threaded thereon above the top compression plate 34 , but normally not touching it . the bottom ends of each of the stabilizing bolts 36 are threaded into the corresponding threaded wedge hole 27 a of a corresponding wedge 27 , as further illustrated in fig8 . the top compression plate 34 is positioned on top of the gripping element spring 35 by means of two t - bolts 32 , the t - bolt heads 32 c of which are removably seated in corresponding mount flange slots 28 a , provided in the mount flange 28 . a top nut 32 a , threaded on the upper end of each of the t - bolts 32 , maintains a desired degree of tension in the gripping element spring 35 . a bottom nut 32 b is also threaded on each of the t - bolts 32 , between the top compression plate 34 and the bottom compression plate 37 , and a washer 33 is welded to each t - bolt 32 , about one - eighth of an inch above the mount flange 28 , to facilitate removal of the t - bolt heads 32 c from the corresponding mount flange slots 28 a . accordingly , it will be appreciated from a consideration of fig8 that a desired degree of tension can be applied to the gripping element spring 35 by adjusting the respective top nuts 32 a on the corresponding t - bolts 32 and compressing the gripping element spring 35 between the top compression plate 34 and the bottom compression plate 37 . this tension is also applied to the respective wedges 27 disposed beneath the bottom compression plate 37 , to force the wedges 27 inwardly and downwardly along the cone - shaped interior wall of the adaptor housing 26 , and engage the respective teeth 27 b with the pull cable 40 a . as further illustrated in fig1 and 8 - 11 , a housing mount 30 is mounted on each of the front yokes 84 and rear yoke 85 and is extended around a corresponding housing flange 31 , attached to the adaptor housing 26 , as illustrated in fig8 and 11 of the drawings . the housing mount 30 serves to removably secure each gripping element 25 in position on the respective front yoke 84 and rear yoke 85 of the tandem rod and cable pulling apparatus 1 , as further illustrated in fig1 of the drawings . referring now to fig1 of the drawings , in an alternative preferred embodiment of the gripping elements of the tandem apparatus 1 , each gripping element 25 may be constructed using one or more rubber washers 38 interposed between the top compression plate 34 and the bottom compression plate 37 , in place of the gripping element spring 35 illustrated in fig8 . the purpose of the rubber washers 38 , like the gripping element spring 35 , is to exert pressure on the bottom compression plate 37 and thus , the wedges 27 , by tightening or loosening the respective top nuts 32 a on the corresponding t - bolts 32 , to exert the desired degree of force on the respective wedges 27 . referring to fig1 of the drawings a preferred bursting and stored energy head 43 is illustrated for use in the tandem apparatus 1 of this invention . the bursting and stored energy head 43 includes a cylindrical bursting head housing 43 a , fitted into a wedge sleeve 45 , having an expander or pipe bursting wedge 44 and knives 44 a on the end thereof . the wedge sleeve 45 is attached to a replacement pipe 82 , typically by means of suitable pipe connectors 46 , such as lag screws , such that the replacement pipe 82 is continuously pulled forward by advancement of the bursting and stored energy head 43 , responsive to the tension applied to the pull rod 40 ( or a pull cable , not illustrated ), in the manner hereinafter described . an end plate 47 is provided in the forward end of the bursting and stored energy head housing 43 adjacent to the expander wedge 44 and a rubber disc 48 is positioned adjacent to the end plate 47 , as further illustrated in fig1 . a front plate washer 49 is positioned against the rubber disc 48 , such that the rubber disc 48 is interposed between the end plate 47 and the front plate washer 49 and a rear plate washer 50 is slidably disposed inside the bursting head housing 43 a and is attached to the extending end of the pull rod 40 ( or the pull cable ), as the case may require . a front spring 51 is interposed between the rear plate washer 50 and the front plate washer 49 and a spring stop 53 a is typically secured to the rear plate washer 50 and extends inside the coils of the front spring 51 , to limit the tension applied to the front spring 51 and thus extend the life of the front spring 51 , as the free end of the spring stop 53 a contacts the front plate washer 49 , upon extreme tensioning of the front spring 51 . as further illustrated in fig1 , a rear spring 51 a is positioned in the interior of the bursting and stored energy head housing 43 a , rearwardly of the front spring 51 and is maintained in this position by a rear spring washer 52 , seated on a rear spring rod 51 b and maintained in position by a nut 42 . the opposite end of the rear spring rod 51 b is secured to a hammer 41 by means of a hammer pin 41 a , and a rear spring seat 53 receives the opposite end of the rear spring 51 a from the rear spring washer 52 . a tapered hammer seat 42 a is shaped in the bursting head housing 43 a rearwardly of the rear spring seat 53 and corresponds in shape to the tapered end of the hammer 41 , as further illustrated in fig1 . in operation , and referring again to the drawings , the tandem apparatus 1 is used to pull a bursting and stored energy head 43 through a pipe 83 and break the pipe 83 into pipe fragments 83 a using a pull rod 40 or a pull cable 40 a , as follows . the pull rod 40 or the pull cable 40 a is extended through the rod or cable openings 29 of the aligned gripping elements 25 , as illustrated in fig1 - 3 and 12 of the drawings , after extension through the rod or cable openings 4 a provided in the end frame members 4 , as further illustrated in fig1 . one end of the pull rod 4 is attached to a bursting and stored energy head 43 , as illustrated in phantom in fig1 and in fig1 . in a preferred embodiment of the invention , the pull rod 40 is secured to the bursting and stored energy head 43 illustrated in fig1 by projecting the pull rod 40 through the center opening located in the expander wedge 44 , and then through corresponding , aligned openings ( not illustrated ) provided in the end plate 47 , rubber disc 48 , and front plate washer 49 . the pull rod 40 is further extended through the interior of the front spring 51 and the spring stop 53 a and finally through the rear plate washer 50 , where it is attached by a bolt or any suitable means as further illustrated in fig1 . under circumstances where a cable ( not illustrated ) is used instead of the pull rod 40 for coupling to the bursting and energy head 43 , a segment of the pull rod 40 may be installed on the rear plate washer 50 in the manner described above and the cable attached to the extending end of the pull rod 40 by an i - bolt or other suitable means . when the pull rod 40 is extended through the aligned gripping elements 25 as illustrated in fig1 of the drawings , the pull rod 40 projects through the rod or cable openings 29 provided in the respective wedges 27 and through either the gripping element spring 35 illustrated in fig8 or a corresponding opening ( not illustrated ) provided in the rubber washers 38 , as illustrated in fig1 . in each case , the teeth 27 b of the wedges 27 in each of the gripping elements 25 are pressed against the pull rod 40 by operation of the bias in either the gripping element spring 35 illustrated in fig8 or the rubber washers 38 , illustrated in fig1 . the tandem apparatus 1 illustrated in fig1 - 3 and fig7 is now ready for operation to pull the bursting and stored energy head 43 through the pipe 83 and locate the replacement pipe 82 in the place of the pipe 83 , as illustrated in fig1 . accordingly , the tandem apparatus 1 is operated as heretofore described with respect to fig5 and 7 to incrementally force the pull rod 40 through the tandem apparatus 1 and pull the bursting and stored energy head 43 through the pipe 83 to break the pipe 83 and replace it with the replacement pipe 82 . referring again to fig1 of the drawings , as tension or force is applied to the pull rod 40 , the front spring 51 is compressed in the bursting and stored energy head 43 . additional force applied to the pull rod 40 also compresses the rubber disc 48 , as the spring stop 53 a contacts the front plate washer 99 that overlays the rubber disc 48 . this compression causes the rubber disc 48 to enlarge and seal the bursting head housing 43 a against the intrusion of water and debris in the pipe 83 . while the front spring 51 is so compressed , the hammer 41 is operated to strike the hammer seat 42 a in the bursting head housing 43 a , using the tension in the rear spring 51 a , which is also compressed as the hammer 41 is withdrawn from the hammer seat 42 a , for striking . successive hammer strikes , coupled with the forward forces created by the tension in the front spring 51 and the rear spring 51 b , enhance the progress of the bursting and stored energy head 43 through the pipe 83 . it will be appreciated from a consideration of fig1 - 3 of the drawings that under circumstances where a pull rod 40 is used to operate the bursting and stored energy head 43 , the front driving members 11 and the rear driving members 56 can be operated intermittently and alternatively as described above , by engaging one respective set of hydraulic cylinders 12 at a time in the exertion of pressure on the pull rod 40 . in another mode , all hydraulic cylinders 12 can be operated simultaneously in a common pulling direction to exert even greater force on the pull rod 40 , when one of the gripping elements 25 is reversed in the corresponding housing mount 30 . in the latter case , under circumstances where the bursting and stored energy head 43 encounters an exceptionally resistant structure such as a concrete casement , timber , valve or the like , the tandem apparatus 1 can be manipulated to facilitate a common pulling of both the front rod driving members 11 and the rear rod driving members 56 together , with both of the gripping elements 25 engaging the pull rod 40 simultaneously to achieve this result . however , it is understood that while the strength and pulling force on the pull rod 40 is doubled in this configuration , the speed of advancement of the bursting and stored energy head 43 is only half as fast as the advancement in the intermittent and alternative sequence described above . it will be further appreciated by a consideration of fig1 - 3 of the drawings that under circumstances where the pull rod 40 is utilized in the tandem apparatus 1 , the operating end of the pull rod 40 can be attached to the rear of the bursting and stored energy head 43 in any suitable manner , to push the bursting and stored energy head 43 through the pipe 83 , instead of pulling it , as described above . furthermore , while oppositely - disposed sets of the hydraulic cylinders 12 are preferred for operating the tandem apparatus , additional hydraulic cylinders 12 can be attached to the respective front yoke 84 and rear yoke 85 ( fig1 ), as deemed necessary and convenient . moreover , while a hydraulic system is preferred as described above , in some applications a pneumatic system may be used , wherein the fluid - operated cylinders are typically operated by air pressure . accordingly , while the preferred embodiments of the invention have been described above , it will be recognized and understood that various modifications may be made in the invention and the appended claims are intended to cover all such modifications which may fall within the spirit and scope of the invention .	5
the following description will illustrate the invention using an exemplary wideband code division multiple access ( w - cdma ) communications system environment . it should be understood , however , that the invention is not limited to use in any particular communications system environment . the invention is instead more generally applicable to any communications system environment in which it is desirable to provide low - noise amplifier with a bypass switch topology . fig1 illustrates a block diagram of a wideband code division multiple access ( w - cdma ) receiver in which a low - noise amplifier with a bypass switch topology according to an embodiment of the invention may be employed . as shown , the w - cdma receiver architecture in fig1 includes an antenna 100 , a system switch 102 , a duplexer 104 , a surface acoustic wave ( saw ) filter 106 and a receiver integrated circuit ( ic ) 108 . the receiver ic 108 includes a bypassable low - noise amplifier ( lna 1 ) 110 , a low - noise amplifier ( lna 2 ) 112 , a quadrature divide - by - 2 module 114 , mixers 116 - i ( in phase ) and 116 - q ( quadrature phase ), basesband variable gain amplifiers ( vgas ) 118 - i and 118 - q , channel select filters 120 - i and 120 - q , basesband vgas 122 - i and 122 - q , and a serial digital interface 124 . since the focus of the invention is on a switched - gain or bypassable low - noise amplifier ( e . g ., lna 1 ) and since the other components in the receiver architecture shown in fig1 are well known in the communications art , a detailed description of these other components will not be provided herein . while other switched - gain lnas have been proposed ( e . g ., see the background section above ), one major disadvantage of most of these existing designs is that the lna circuit consumes power in the bypass mode . for those existing lna designs that do not consume power in the bypass mode , typically one or more circuit elements ( e . g ., inductor ) must be added to ensure impedance matching in the bypass mode . however , the addition of such elements increases the circuit size considerably , and may also increase the impedance tuning complexity of the circuit . thus , a key problem that the invention solves is the implementation of a bypassable lna which is matched input and output to 50 ohms in both the high - gain mode and bypass mode , and which consumes no current in the bypass mode . having such an lna allows the overall receiver power consumption to be optimized against the received signal strength , resulting in reduced total power consumption . this , in turn , leads to increased battery life for handsets using this type of lna . a schematic diagram illustrating a bipolar complementary metal oxide semiconductor ( bicmos ) low - noise amplifier with a bypass switch topology according to an embodiment of the invention is shown in fig2 . the functional core of lna 200 includes a common emitter bipolar transistor ( q 1 ) with inductive degeneration ( ldegen ), an on - chip output matching network including lm and cm , and an on - chip bias generator gen including digital control circuitry to control the gain or bypass mode of the circuit . such a bias and logic module may be generally referred to as a controller . one of ordinary skill in the art will realize various implementations of such a controller given the functional descriptions provided herein . the input matching network to the lna can be implemented either on or off chip , and includes at least of a series inductor ( loff ) and potentially an additional shunt capacitor ( coff ). bypassing of the lna is realized with switches m 1 and m 2 , where switch m 2 bypasses the series capacitor in the output matching network , while switch m 1 bypasses the entire amplifier . additionally , so that the bypass switches do not dissipate power or add noise , the supply ( vcc ) is turned off in the bypass mode ( this function could also be realized by placing a large direct current blocking capacitor in series with m 2 ). this multiplexing function is realized through transistors m 3 and m 4 . it is to be appreciated that bipolar transistor q 1 includes collector , base and emitter terminals ( depicted in the figures using typical circuit drawing convention ) that are respectively connected to other elements in the lna circuit as shown . m 1 through m 4 ( and mt and mb in fig3 to be described below ) are field effect transistors including respective source , gate and drain terminals ( depicted in the figures using typical circuit drawing convention ) that are respectively connected to other elements in the lna circuit as shown . note that the novel bypass switch topology can be utilized with either bicmos or cmos technologies . a representative schematic of a cmos version is shown in fig3 , where a cascode including transistors mb and mt is used in place of the common - emitter q 1 . in both representations of the circuit , inputs x 1 and x 2 select the state of the lna to be in either one of three gain modes ( for this particular example ) or in the bypass mode . a key to the inventive design is utilizing a two - transistor bypass switch . in high - gain mode , byp = 0 , transistors m 1 and m 2 are off , and the lna signal is amplified by q 1 . in bypass mode , byp = 1 , transistors m 1 and m 2 are on , transistor q 1 is turned off ( its base is pulled to ground , and the bias generator gen is turned off ), and the signal is routed directly from the input to the output . since q 1 and the bias generator circuits are turned off , the lna consumes no power in bypass mode . while the inventive topology is particularly suitable for use in lnas with integrated output matching networks , the topology can be applied to lnas with off - chip matching networks by using an extra pad in the design ( i . e ., lm and cm are off - chip , while m 1 and m 2 are on chip ; thus , both the drain and source nodes of m 2 have to be connected to pads ). the advantage of the two - transistor switch topology is that the constraints placed by the bypass condition on the allowable input and output matching networks are lessened considerably , thereby allowing the circuit to easily meet matching criteria in both high - gain and bypass modes , as well as meeting gain , noise , and linearity criteria . ideally , the amplifier design should be optimized only for the high - gain mode , with the bypass mode not constraining the design at all . the topology presented in fig2 effectively realizes this , decoupling the bypass and high - gain modes . a small - signal equivalent circuit of the novel bypass network is shown in fig4 a . in this schematic , rsw is the mos switch resistance , while cin , cout , and ccol are the total parasitic capacitances at the input base , output , and collector nodes , respectively . this network can be simplified to that shown in fig4 b by assuming that the switch impedance is low ( i . e ., rsw -& gt ; 0 ); thus , cm is shorted out , while all of the on - chip parasitic capacitance can be lumped together into ctot , which is now in parallel with lm . the entire on - chip portion of the lna then behaves as a single parallel resonant circuit . realizing the 50 - ohm match therefore involves the tuning of this parallel resonant circuit together with the input matching network . the tuning of the parallel resonant circuit is realized by scaling the sizes of the bypass transistors . a small - signal equivalent circuit of the lna when operated in a high - gain mode is shown in fig5 , in order to demonstrate the decoupling of the high - gain and bypass modes from a matching perspective . the input matching network may be designed by selecting ldegen such that the real part of the input impedance looking into the base of the transistor is in the range of 30 to 50 ohms ( gm / cbe * ldegen ). then , the input match is completed by selecting lin and cin to transform the impedance looking into the base ( the real part arising from ldegen , the imaginary part arising cbc and ldegen , and both the real and imaginary contributions from the miller effect on cbc ). the output matching network may be designed by selecting a suitably high lm such that the lna provides enough gain , and then choosing cm to bring the output match to close to 50 ohms . for both the input and output match , the only contributions from the bypass switches is from their parasitics ( lumped into cb , cout , and ccol ). thus , the designer is free to choose the input and output match independent of bypass considerations . the simulated performance of the bypassable lna with the novel bypass switch topology is shown in fig6 , fig7 , and fig8 . this lna is optimized for operation in the 2110 - 2170 megahertz ( mhz ) frequency band , though the bypass switch topology presented here is not frequency - band specific . fig6 shows the simulated gain , or s 21 , of the lna in the high - gain and bypass modes . in high gain , the lna exhibits 14 db of gain ; while in bypass mode , the lna exhibits 4 db of loss . once again , the lna consumes no current in the bypass mode . fig7 shows the simulated s 11 on a smith chart for the bypassable lna . for reference , a circle corresponding to a vswr = 1 . 9 : 1 ( equivalent to s 11 =− 10 db ) is also shown . all points inside this circle would have a vswr & lt ; 1 . 9 : 1 ( or s 11 & lt ;− 10 db ), which is the typical input and output matching requirement for the lna . from this plot , it can be seen that the lna is well - matched to 50 ohms . the simulated s 11 is − 25 db in the high - gain mode and − 19 db in the bypass mode . fig8 shows the simulated s 22 on a smith chart for the bypassable lna . once again , a vswr = 1 . 9 : 1 circle is included for reference . the simulated s 22 is − 15 db in the high - gain mode and − 11 db in the bypass mode . these three figures demonstrate the correct operation of the bypassable lna . advantageously , as is evident from the principles of the invention described herein , an lna circuit of the invention does not consume power in the bypass mode . further , an lna circuit of the invention implements a single - stage topology , thus avoiding reduced linearity attributable to multi - stage topologies . also , the novel bypass switch topology of the invention differs from existing lna architectures in that , from an impedance standpoint , the 50 - ohm load impedance is not modified by the output matching network in the bypass mode . rather , the entire on - chip lna may behave as a single parallel resonant circuit in parallel with the 50 - ohm load . still further , the inventive solution is much simpler to implement as compared to existing design approaches , thereby reducing the overall time required in the design process . also , the decoupling of the bypass and high - gain modes from a matching perspective means that for some situations , it now becomes possible to realize a given gain for a given matching requirement in both high - gain and bypass modes . it is to be appreciated that while specific circuit embodiments of the methodologies of the invention have been provided and explained above , at least a portion of such inventive amplifier design approaches may be implemented , for example , by one or more digital signal processors with associated memory , application specific integrated circuit ( s ), one or more appropriately programmed general purpose digital computers with associated memory . one of ordinary skill in the art will contemplate various other ways of implementing the invention . although illustrative embodiments of the present invention have been described herein with reference to the accompanying drawings , it is to be understood that the invention is not limited to those precise embodiments , and that various other changes and modifications may be made by one skilled in the art without departing from the scope or spirit of the invention .	7
[ 0031 ] fig1 is a schematic pictorial illustration of a system 20 for symbolic model checking , in accordance with a preferred embodiment of the present invention . system 20 typically comprises a model processor 22 , typically a general - purpose computer workstation running suitable model checking software , under the control of a user 24 , typically a design or verification engineer . the software may be downloaded to processor 22 in electronic form , over a network , for example , or it may be supplied on tangible media , such as cd - rom or non - volatile memory . processor 22 receives a hardware implementation model 26 of a target system or device 30 in development , which may refer to the entire system or device or to a sub - unit , such as a circuit or functional block . user 24 prepares a specification of properties 28 for use in model checking of model 26 , and selects initial and target states of the model . system 20 analyzes the model , using methods described in detail hereinbelow , to find disjoint multiple traces between the initial and target states . [ 0032 ] fig2 is a graph that schematically illustrates a binary decision diagram ( bdd ) 34 , as is known in the art . bdd 34 is presented here as an aid in understanding the operation of preferred embodiments of the present invention . the theory of bdds is described , for example , by bryant , in “ graph - based algorithms for boolean function manipulation ,” ieee transactions on computers c - 35 : 8 ( 1986 ), which is incorporated herein by reference . bdds are widely used in the model checking art and are useful in implementing the present invention . the principles of the present invention may also be implemented using other methods known in the art for representing state variables , however , and the present invention is in no - way limited to the bdd - based methods described hereinbelow . bdd 34 is a directed acyclic graph representing a boolean function , in this case ( a 3 b c ) ( a b d ) ( c d ). the bdd comprises a plurality of nodes 36 , 38 , each representing one boolean variable . node 36 is the root node . the value of the function when the variable at a given node has the value zero is found by taking a left branch 40 from the node , while the value when the variable has the value one is found by taking a right branch 42 . thus , for example , to find the value of the function when a = b = c = d = 0 , we traverse bdd 34 starting from root node 36 . taking left branch 40 brings us to node c , and taking the left branch again brings us to a leaf with value zero . therefore , the value of the function for a = b = c = d = 0 is zero . reference is now made to fig3 and 4 , which illustrate a method for finding disjoint multiple counterexample traces , in accordance with a preferred embodiment of the present invention . fig3 is a schematic representation of a state space 48 of model 26 , providing a conceptual view of the operation of the method . fig4 is a flow chart that schematically illustrates the method itself . design exploration begins from a set 50 of initial states , labeled s0 , which are typically specified by user 24 . at an iteration step 60 , processor 22 applies an image operation ( using the nextstateimage ( ) function at line 6 in table i ) to map s 0 into a “ donut ” 52 of states s 1 . subsequent iterations map each donut s j into a successive donut s j + 1 . referring back to table i , at line 7 , states reached previously are removed from the set included in the new donut , so that each donut is uniquely characterized by the minimal number j of iterations of the transition relation that are required to reach the states in the donut . for simplicity , it is assumed here that all of the donuts are saved as the iterations through step 60 proceed . when large numbers of states are involved , however , saving all of these donuts can be excessively costly in terms of memory requirements . therefore , in many cases it is preferable to save the donuts only intermittently ( say one donut in every n successive donuts ), and then to recompute the donuts subsequently when they are needed for finding counterexample traces . this method of memory conservation is described further in the above - mentioned patent application entitled “ time - memory tradeoff control in counterexample production .” as each new donut 52 is computed , it is checked against a definition of target states 54 , at an intersection checking step 62 ( corresponding to line 3 in table i ). as noted above , the target states are typically characterized by a predefined formula ag ( p ) ( or p ) being false on these states . as long as no intersection is found , processor 22 checks to determine whether the entire reachable state space of the model has been explored , at a state exhaustion step 64 . if there are no more states to reach , processor 22 reports that the formula ag ( p ) is true on model 56 ( line 11 in table i ), and returns no counterexample traces , at a traceless return step 66 . otherwise , the processor iterates again through step 60 to find the next donut , and the process is repeated . when an intersection region 56 is found between target states 54 and one of donuts 52 ( s 9 in the example of fig3 ), processor 22 proceeds to find a counterexample trace 58 , at a first trace finding step 68 . methods for finding a single counterexample are well known in the art . table ii below lists an exemplary method , which begins following line 13 in the listing of table i : table ii finding a counterexample 14 k = i ; 15 print “ formula is false in the model , failed at cycle k ”; 16 bad = new ∩ error ; 17 while ( i ≧ 0 ) { 18 ce i = choose one state from bad ; 19 if ( i & gt ; 0 ) bad = pred ( ce i ) ∩ s i − 1 ; 20 i = i − 1 ; 21 } 22 print “ first counter example is :” ce o ... ce k ; here the function “ pred ( ce i )” finds , for each “ bad ” state along the trace , a predecessor state in the preceding donut that would be mapped to the bad state by the image operation described above . the set of predecessor states ce 0 . . . ce k from initial states 50 to intersection region 56 constitutes a counterexample trace . whereas methods of model checking known in the art stop at this point , in preferred embodiments of the present invention , processor 22 continues to find additional counterexample traces . the states on each new trace are preferably chosen so as to maximize a distance between the states on the new trace from those on the previous trace or traces , as described in detail hereinbelow . alternatively , the states on each new trace could be chosen at random , although this choice might lead to the traces being bunched in a certain part of state space 48 , thus affording less insight to user 24 . both of these alternative criteria differ from methods of constructing counterexamples known in the art , in which for a given bdd ordering of the system variables , the choice of candidate states is deterministic . returning to the method of fig4 in order to find traces that range over as much of the relevant state space as possible , the states in each trace that is found are collected in a set p , at a state collection step 70 . then , each new trace is constructed , at a next trace step 72 , in such a way as to maximize a distance between each new state in the new trace and the states in p . this procedure continues until the desired number of traces have been generated . [ 0041 ] fig5 is a flow chart that schematically shows details of constructing one of traces 58 at next trace step 72 , in accordance with a preferred embodiment of the present invention . this step corresponds roughly to the loop of lines 17 - 20 in table ii . the method begins with selection of a reachable target state , i . e ., a state in intersection region 56 , at a target choice step 80 . processor 22 evaluates a set of candidate predecessor states , at a predecessor finding step 82 . these are the states in the previous donut s j − 1 from which the current state is reachable . the states in the previous donut may simply be recalled from memory for this purpose , based on the donut of states identified previously at step 60 , or the donut may be reconstructed if it was not saved . processor 22 chooses a state from the previous donut s j − 1 for addition to the path , at a state selection step 84 . the new state is chosen so as to maximize its distance from the states in the set of states p on the paths chosen earlier . preferably , the distance is defined as the average of a hamming distance between the chosen state and each of the states in p , which are maintained in the form of a bdd . a preferred method for finding the state at maximum distance from p is listed in table iii below . the processor checks , at a completion checking step 86 , whether the path has reached a state in so . if so , the trace is complete , and the procedure terminates . otherwise , iteration continues through steps 82 and 84 , as described above . table iii presents a procedure for finding a state s in a set of states q that is as far as possible from the states in a given set p . preferably , a reduced , ordered bdd representation of p and q is used , as is known in the art , in which the variables in each bdd have an order that does not change in the course of computations . based on this order , each variable belongs to a level in the bdd , which increases monotonically from the root up to the leaves . the procedure of table iii uses a function find_diff_state ( p , q ) to operate recursively on the bdd representations of p and q . the function compares the levels of p and q at each iteration , and branches depending on the relative levels . in this manner , the procedure recursively builds an output state having the form of a “ shoestring ,” with exactly one non - zero descendent at each level . the recursion begins from the root of the bdd , and works up through the levels to the leaves . at each level , the above function checks which branch will give the more distant state and returns a “ suffix ” of a state that includes the current level . upon reaching the leaves , the recursion stops . thus , at each iteration , if level ( q )& lt ; level ( p ), we find states state 0 and state 1 on the left and right branches of q , respectively , compare their distances dist 0 and dist 1 from p , and choose the state that is the more distant . the chosen state is returned , extended by the current level of q . if level ( q )& gt ; level ( p ), we find states state 0 and state 1 in q that are respectively far from the left and right branches of p , and return the chosen state as before , this time extended by the level of p . if the levels of p and q are equal , a new bdd pp is computed using the or_bdd operator , which returns the disjunction of the left and right branches of p : pp =( p → left ) ( p → right ). we then recursively find states in q → left and q → right that are distant from pp , and choose the more distant of the two states . if both of these q states are in pp ( i . e ., at zero distance ), we find a state in q → left that is far from p → left , and another state in q → right that is far from p → right , and choose the more distant of these two states . when the new trace 58 has been completely defined in this manner , the corresponding state s is added to p by disjunction of the corresponding bdds . table iii selection of distant state 1 function find_diff_state ( p , q ) { 2 if ( isleaf ( p ) & amp ;& amp ; isleaf ( q ) { 3 if ( p = zero ) & amp ;& amp ; ( q = one ) { 4 return ( one , 1 ); 5 else 6 return ( zero , 0 ); 7 } 8 } 9 if ( level ( q ) & lt ; level ( p )) { 10 ( state 0 , dist 0 ) = find_diff_state ( p , q → left ); 11 ( state 1 , dist 1 ) = find_diff_state ( p , q → right ) 12 if ( dist 0 & gt ; dist 1 ) 13 return ( new_bdd ( level ( q ), state 0 , zero ), dist 0 ); 14 else 15 return ( new_bdd ( level ( q ), zero , state 1 ), dist 1 ); 16 } 17 } 18 if ( level ( q ) & gt ; level ( p )) { 19 ( state 0 , dist 0 ) = find_diff_state ( p → left , q ); 20 if dist 0 & gt ; 0 dist 0 ++; 21 ( state 1 , dist 1 ) = find_diff_state ( p → right , q ); 22 if dist 1 & gt ; 0 dist 1 ++; 23 if ( dist 0 & gt ; dist 1 ) { 24 return ( new_bdd ( level ( p ) , state 0 , zero ), dist 0 ); 25 else 26 return ( new_bdd ( level ( p ), zero , state 1 ), dist 1 ); 27 } 28 } 29 if ( level ( q ) = level ( p )) { 30 pp = or_bdd ( p → left , p → right ); 31 ( state 0 , dist 0 ) = find_diff_state ( pp , q → left ); 32 ( state 1 , dist 1 ) = find_diff_state ( pp , q → right ); 33 if ( dist 0 = 0 and dist 1 = 0 ) { 34 ( state 0 , dist 0 ) = find_diff_state ( p → left , q → left ); 35 ( state 1 , dist 1 ) = find_diff_state ( p → right , q → right ); 36 } 37 if ( dist 0 & gt ; dist 1 ) { 38 return ( new_bdd ( level ( p ), state 0 , zero ), dist 0 ); 39 else 40 return ( new_bdd ( level ( p ), zero , state 1 ), dist 1 ); 41 } 42 } 43 } although the preferred embodiments described hereinabove make use of on - the - fly model checking ( and are thus limited to testing formulas of the type ag ( p )), the implementation of the present invention is in no way limited to this context . the principles of the present invention may be applied to find disjoint multiple traces in the state space of substantially any model that can be defined in terms of ctl formulas . it will thus be appreciated that the preferred embodiments described above are cited by way of example , and that the present invention is not limited to what has been particularly shown and described hereinabove . rather , the scope of the present invention includes both combinations and subcombinations of the various features described hereinabove , as well as variations and modifications thereof which would occur to persons skilled in the art upon reading the foregoing description and which are not disclosed in the prior art .	6
the dvb - c2 standard is the next generation digital cable transmission system being developed by the dvb project . the dvb - c2 standard uses aspects of the dvb - t2 terrestrial transmission standard as much as possible . as a result , ofdm modulation will be adopted as well as the coding technique ( bch + ldpc ) specified in dvb - t2 standard . however , it must be noted that dvb - t2 standard is designed for use in the terrestrial wireless channel while the dvb - c2 standard is designed for use in the cable channel . cable channels differ from wireless channels because the cable channel is a high quality , high signal - to - noise ratio ( snr ) channel with only a few weak echoes and because the wireless spectrum assigned for tv broadcasting is generally defined by a governmental agency , such as the federal communications commission ( fcc ), while the spectrum of the cable networks can be used with somewhat fewer limitations . consequently , the signal frame structure and preambles used in dvb - t2 may not be suitable to be used in dvb - c2 standard . the principles described herein allow an fec frame header to be detected under noisy channel conditions with minimal receiver complexity . the data transmitted according to the dvb - c2 standard is contained in data slice packets . data slice packets are formed from one or two fec frame cells . these data slice packets can either be data slice type 1 or data slice type 2 . data slice type 1 packets only transmit the fec frame data and use a pointer within the level 1 signaling part 2 to detect their start . data slice type 2 packets carry a 16 - bit fec frame header that allows for synchronization to the data slice packets without further information being transmitted . this header carries information regarding the modulation , coding parameters , plp ( physical layer pipe ) identifiers , and number of fec frames ( one or two ) following the header . encoding of the header information must ensure that the header can be properly synchronized and decoded . simulation results have shown that use of rm ( 32 , 16 ) code with bpsk ( binary phase shift keying ) modulation can achieve error free results for fec header signaling at 10 db snr in additive white gaussian noise ( awgn ) channels . majority decoding has very low complexity leading to simple decoders as well . in the dvb - c2 standard , in order to support acm or vcm over each fec frame , a fec frame header is attached to each fec frame . the fec frame structure is shown in fig1 . each fec - coded frame is quadrature amplitude modulation ( qam ) modulated with different order and coding rate . these two important parameters are carried in the fec frame header that precedes each fec frame . the fec frame header contains 16 signaling bits as described below : 5 . header change indicator or parity check bit — 1 bit : when the bit is header change indicator , the value of “ 1 ” indicates the first 4 parts of the fec header of next fec frame will be modified while the value of “ 0 ” indicates no change . the receiver will know if the bit is the header change indicator or parity check bit based on layer - 1 signaling . the signaling bits are protected by rm code which can be decoded with a low - complexity majority - logic decoding method . the rm ( 32 , 16 ) code is selected and thus 16 message bits are coded into 32 codeword bits . a prbs ( pseudo - random binary sequence ) of length 32 is embedded in the fec frame header structure prior to modulation to enable frame header detection in the receiver . an example of a 32 - bit prbs bit is f8261d92 in hex notation . this prbs is generated using a generating polynomial of x 11 + x 2 + 1 . two frame header structures with different length are designed in at least one implementation in this description . the frame header structure with shorter length ( 16 symbols ) is provided for use in a high snr environment . in one embodiment of the present principles , in order to improve detection of the fec frame header , data portions employing 16 - qam and 64 - qam data symbols are used with 32 - symbol headers , and 16 - symbol headers otherwise ( high - snr case ). one bit in the l1 signaling bits is used to indicate header type . the fec frame header is modulated differently depending on the modulation of the data slice portion . when the data symbols are modulated with 16 - qam and 64 - qam modulation , the fec header can be modulated using offset bpsk and otherwise modulated with 16 - qam . the 32 - symbol header is reliable when the signal - to - noise ratio ( snr ) is above 10 db , and the 16 - symbol header is reliable when the snr is above 20 db . use of both 32 - symbol and 16 - symbol headers in plps can be used to improve detection . however , in order to improve symbol header decoding at snr of 10 db , 32 - symbol and 16 - symbol headers are not used simultaneously in the same data slice within one dvb - c2 frame . fig1 shows an fec frame structure which has different modulation being used for consecutive data portions . under the present principles , the modulation employed for each fec frame header would depend on the modulation employed by the corresponding data portion . in some cases , a 32 - symbol fec frame header would be employed and in other cases , the 16 - symbol header would be used . a conceptual framework for generating a 32 - symbol fec frame header is shown in fig2 . under the present principles , this 32 - symbol header is used when the plp data portion is modulated with 16 - qam or 64 - qam data symbols . the 16 signaling bits are coded using rm ( 32 , 16 ) code . the resulting 32 codeword bits are modulated by offset bpsk in a modulator using a 32 - bit prbs . in one embodiment of the present principles , the rm ( 32 , 16 ) codeword undergoes a 1 - bit cyclic shift and is exclusive - ored with the 32 - bit prbs bits to form a sequence which is used to indicate the use of in - phase or quadrature bpsk . for example , when a bit of the exclusive - or sequence is equal to 1 , in - phase bpsk is used to modulate the 32 bits generated by the rm ( 32 , 16 ) encoder . when a bit of the exclusive - or sequence is equal to 0 , quadrature bpsk is used to modulate the 32 bits generated by the rm ( 32 , 16 ) encoder . a conceptual framework for generation of this type of 32 - symbol fec frame header is shown in fig5 . an apparatus for generating a 16 - symbol fec frame header is shown in fig3 . the 16 signaling bits are coded by rm ( 32 , 16 ) code . the resulting 32 codeword bits and 32 prbs bits are 16 - qam modulated into 16 symbols by a 16 - qam modulator after every two codeword bits are paired with two prbs bits . each 16 - qam symbol is produced from two codeword bits in the two most significant bits and two prbs bits in the two least significant bits . the two codeword bits determine the quadrant and the two prbs bits determine the position in the quadrant . in another exemplary embodiment of a 16 - qam symbol , the two most significant bits carry the codeword bits and the two least significant bits carry the prbs bits . in another embodiment of the present principles , the rm ( 32 , 16 ) codeword undergoes a 2 - bit cyclic shift and is then exclusive - ored with the 32 - bit prbs bits . each two bits of the exclusive - or sequence are used as the two least significant bits of a symbol codeword . the two most significant bits of the symbol codeword are the two bits from the rm ( 32 , 16 ) encoder output . the two - bit cyclic shift ensures that the adjacent symbol also carries information of the two codeword bits in the current symbol to achieve diversity . the four - bit symbol codeword is modulated with 16 - qam to form 16 16 - qam symbols from each set of 16 signaling bits . the conceptual framework for generation of the 16 - symbol headers using this principle is shown in fig6 . in another preferred embodiment of the present principles , the 32 - symbol header is modified using the 1 - bit cyclic shift as described above , and the 16 - symbol header is modified as described previously above so that both types of headers can be used , although not in the same data slice within a dvb - c2 frame . a bit in the l1 signaling data indicates the type of fec frame header used in the type 2 frame header . fig7 illustrates the method 700 for encoding the fec header information under the present principles . fec encoding is performed in step 710 , using for example , rm ( 32 , 16 ) coding . processing of the fec encoded bits is performed in step 720 and depends upon the type of modulation that the header bits will undergo . processing step 720 performs cyclic bit shifting of the rm encoded bits , followed by an exclusive - or operation . the amount of the shift depends upon the type modulation used for the header bits . for the case of offset bpsk modulation , a one - bit cyclic shift of the rm encoded bits is performed , followed by an exclusive - or of the shifted bits with a 32 - bit prbs . in the case of the 16 - qam modulation , two bits of the rm encoded bits are paired with two bits of the shifted rm bits exclusively - ored with two of the prbs bits . modulation with a pseudo - random binary sequence is then performed in step 730 . under one embodiment of the present principles , step 730 uses offset bpsk with the one - bit cyclic shift to create 32 symbols for the fec header signaling bits when the data symbols in the physical layer pipe ( plp ) use 16 - qam or 64 - qam modulation . otherwise , step 730 uses 16 - qam modulation with a 2 - bit cyclic shift and creates 16 symbols for the 16 signaling bits of the fec frame header when it is determined that the 16 symbol header is used , for example , when the data symbols in the plp use 256 - qam , 1k - qam , or 4k - qam modulation . fig8 illustrates an apparatus 800 for encoding the fec header information under the principles described herein . header information is received at the input of encoder 810 . after encoding , using for example rm ( 32 , 16 ) encoding , the output is sent to the input of processor 820 , and then to modulator 830 where the fec encoded header information is modulated with a pseudo - random binary sequence , using the appropriate modulation as described in method 700 and incorporating the principles described herein . processor 820 performs cyclic bit shifting of the rm encoded bits , followed by an exclusive - or operation . the amount of the shift depends upon the type of modulation used for the header bits . for the case of offset bpsk modulation , a one - bit cyclic shift of the rm encoded bits is performed , followed by an exclusive - or of the shifted bits with a 32 - bit prbs . in the case of the 16 - qam modulation , two bits of the rm encoded bits are paired with two bits of the shifted rm bits exclusively - ored with two of the prbs bits . based on the prbs embedded in the fec frame header under the present principles and the use of rm ( 32 , 16 ) coding , the detection of the fec frame header is performed by a two step method . the first step is the correlation of the transmitted prbs and received bit - stream . let pn ( n ), n = 0 , 1 , . . . , 31 be the transmitted 32 - bit prbs . the correlation with a given index i is given by r pn ⁡ ( i ) = ∑ n = 0 31 ⁢ pn ⁡ ( n ) · y ⁡ ( i + n ) ( 1 ) where y ( n ) is the received binary stream for prbs . note that the correlation of two binary streams is computed by substituting 1 and 0 to 1 and − 1 and then performing correlation . also note that if the prbs is the only feature used for fec frame header detection , the estimated fec frame header position is given by i o = arg ⁢ max i ⁢ r pn ⁡ ( i ) ( 2 ) the second step is based on the rm ( 32 , 16 ) code structure . although the rm ( 32 , 16 ) code is not a first order reed - muller code , its codeword does not have a symmetric structure . however , during the majority - logic decoding process , after the first layer decoding , the modified codeword has a symmetry structure . this can be explained as follows : the codewords of rm ( 32 , 16 ) code are linear combinations of 16 rows of the generator matrix shown in fig4 . x =( m 0 , m 1 , . . . , m 15 ) g . ( 3 ) the majority - logic decoding consists of 3 stages . the last 10 bits , ( m 6 , m 7 , . . . , m 15 ), are decoded from the received code vector r =( r 0 , r 1 , . . . , r 15 ) in the first stage . these 10 bits are removed from r to form a modified code vector . assume r ( 1 ) =( r 0 ( 1 ) , r 1 ( 1 ) , . . . , r 31 ( 1 ) ) is the modified received vector r ( 1 ) = r −( 0 , . . . , 0 , m 6 , m 7 , . . . , m 15 ) g . ( 4 ) let x ( 1 ) =( x 0 ( 1 ) , x 1 ( 1 ) , . . . , x 31 ( 1 ) ) be its corresponding transmitted modified code vector . it can be seen that x ( 1 ) is a linear combination of the first 6 rows of the generator matrix of rm ( 32 , 16 ) code as shown in fig4 . it can be easily verified that x ( 1 ) has a symmetric structure . the sub - code vectors ( x 0 ( 1 ) , x 1 ( 1 ) , . . . , x 15 ( 1 ) ) and ( x 16 ( 1 ) , x 17 ( 1 ) , . . . , x 31 ( 1 ) ) are either the same or flipped . this kind of symmetry happens in sub - code vectors ( x 0 ( 1 ) , x 1 ( 1 ) , . . . , x 7 ( 1 ) ) and ( x 8 ( 1 ) , x 9 ( 1 ) , . . . , x 15 ( 1 ) ), ( x 16 ( 1 ) , x 17 ( 1 ) , . . . , x 23 ( 1 ) ) and ( x 24 ( 1 ) , x 25 ( 1 ) , . . . , x 31 ( 1 ) ), ( x 0 ( 1 ) , x 1 ( 1 ) , x 2 ( 1 ) , x 3 ( 1 ) ) and ( x 4 ( 1 ) , x 5 ( 1 ) , x 6 ( 1 ) , x 7 ( 1 ) ), and so on . let r ( 1 ) ( i )=( r 0 ( 1 ) ( i ), r 1 ( 1 ) ( i ), . . . , r 1 ( 1 ) ( i )) be the received modified code vector which has index i as the starting position of fec frame header . the rm autocorrelation of the received modified code vector is given by r rm ⁡ ( i , k ) = ∑ m = 0 2 k - 1 ⁢ ∑ n = 0 2 4 - k - 1 ⁢ r m ⁣ · 2 5 - k + n ( 1 ) ⁡ ( i ) · r m · 2 5 - k + 2 4 - k + n ( 1 ) ⁡ ( i ) ( 5 ) where k from 0 to 4 is an index for 5 symmetric structures embedded in x ( 1 ) . in addition , define the rm symmetry measure as t rm ⁡ ( i ) = ∑ k = 0 4 ⁢  r rm ⁡ ( i , k )  2 . ( 6 ) note that the rm symmetry measure can be computed for k = 0 only to reduce complexity . the conceptual framework for detection of 32 - symbol fec frame headers is similar to the conceptual framework for detection of 16 - symbol fec frame . the method 900 is shown in fig9 . one difference is in demodulating the information bits , step 930 . for the 32 - symbol fec header , the bit stream for prbs correlation is decoded by comparing the amplitudes of real part and imaginary part of the received signal . for the 16 - symbol fec header , the bit stream is from the 2 lsb of 16 - qam demodulator . a 32 - bit prbs correlation is then performed . the further rm correlation measure is performed only for those index i for which r rm ( i ) is greater than a threshold . this threshold is adjustable in the receiver . the decision statistic of the frame header detection is given by t = 5 ·\| r pn ( i )\| 2 + 4 · t rm ( i ) ( 7 ) another variation for frame header detection is that the estimated frame header position is given by fig1 shows an apparatus 1000 for decoding and demodulating the fec frame headers under the present principles . receiver 1010 receives the digital cable television information including the fec frame header symbols and the l1 signaling information that indicates the type of modulation used for the header . header decoder 1020 determines the header modulation and forwards this information , along with header symbols to demodulator 1030 , which performs the appropriate demodulation for the 16 - symbol header or the 32 - symbol header . we thus provide one or more implementations having particular features and aspects . however , features and aspects of described implementations may also be adapted for other implementations . although implementations described herein may be described in a particular context , such descriptions should in no way be taken as limiting the features and concepts to such implementations or contexts . the present description illustrates the present principles as applied to the 16 - bit header of dvb - c2 as an example . it will thus be appreciated that those skilled in the art will be able to devise various arrangements that , although not explicitly described or shown herein , embody the present principles and are included within its spirit and scope . the present principles are equally applicable to header information of different lengths with appropriate modification of the methods and apparatus of the present invention . the implementations described herein may be implemented in , for example , a method or process , an apparatus , or a software program . even if only discussed in the context of a single form of implementation ( for example , discussed only as a method ), the implementation or features discussed may also be implemented in other forms ( for example , an apparatus or program ). an apparatus may be implemented in , for example , appropriate hardware , software , and firmware . the methods may be implemented in , for example , an apparatus such as , for example , a computer or other processing device . additionally , the methods may be implemented by instructions being performed by a processing device or other apparatus , and such instructions may be stored on a computer readable medium such as , for example , a cd , or other computer readable storage device , or an integrated circuit . further , a computer readable medium may store the data values produced by an implementation . as should be evident to one of skill in the art , implementations may also produce a signal formatted to carry information that may be , for example , stored or transmitted . the information may include , for example , instructions for performing a method , or data produced by one of the described implementations . additionally , many implementations may be implemented in one or more of an encoder , a pre - processor to an encoder , a decoder , or a post - processor to a decoder . the implementations described or contemplated may be used in a variety of different applications and products . some examples of applications or products include set - top boxes , cell phones , personal digital assistants ( pdas ), televisions , personal recording devices ( for example , dvrs ( digital video recorders ), computers running recording software , vhs recording devices ), camcorders , streaming of data over the internet or other communication links , and video - on - demand . further , other implementations are contemplated by this specification . for example , additional implementations may be created by combining , deleting , modifying , or supplementing various features of the disclosed implementations . all examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the present principles and the concepts contributed by the inventor ( s ) to furthering the art , and are to be construed as being without limitation to such specifically recited examples and conditions . other hardware , conventional and / or custom , may also be included . similarly , any switches shown in the figures are conceptual only . their function may be carried out through the operation of program logic , through dedicated logic , through the interaction of program control and dedicated logic , or even manually , the particular technique being selectable by the implementer as more specifically understood from the context . reference in the specification to “ one embodiment ” or “ an embodiment ” of the present principles , as well as other variations thereof , means that a particular feature , structure , characteristic , and so forth described in connection with the embodiment is included in at least one embodiment of the present principles . thus , the appearances of the phrase “ in one embodiment ” or “ in an embodiment ”, as well any other variations , appearing in various places throughout the specification are not necessarily all referring to the same embodiment .	7

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