BACKGROUND The present inventive concepts relate to solid state drives (SSDs), and more particularly, to SSD memory cache occupancy prediction for reducing I/Os, reducing wear, and improving performance.\",\n \"The number of modern devices that include SSDs is increasing at a significant pace.\",\n \"With the rapid expansion of Internet-enabled devices, computer server farms, mobile devices, high-speed networks, and the like, SSDs are becoming a crucial backbone storage technology that enables a broad range of innovative applications.\",\n \"To increase capacity and performance, some attempts have been made to group SSDs into shared arrays.\",\n \"But a host device or agent that interacts with a shared SSD array has limited knowledge of the state of the various SSDs.\",\n \"In particular, the state of the cache within an SSD, which may be a volatile memory such as a dynamic random access memory (DRAM), is not exposed to any external device (e.g., host agent).\",\n \"Because of such opaqueness, current approaches for interacting with an SSD array are relatively less efficient than they otherwise could be.\",\n \"For example, if a first write occurs to a particular logical memory address, such first write will be directed to a first SSD.\",\n \"Then, if a second write occurs to the same particular logical memory address, conventional approaches may send the second write to a different SSD, and then invalidate the contents written to the first SSD.\",\n \"This requires multiple I/Os to the non-volatile memory of different SSDs, thereby reducing performance.\",\n \"Embodiments of the present inventive concept address these and other limitations in the prior art.\"\n ],\n [\n \" BRIEF SUMMARY Embodiments of the inventive concept include a solid state drive (SSD) shared array memory cache system.\",\n \"The system can include a plurality of SSD modules each including a non-volatile memory section, a cache, and a prediction agent generator logic section.\",\n \"The system can include a host agent communicatively coupled to the plurality of SSD modules, the host agent including an occupancy prediction logic section configured to receive one or more prediction agents from the prediction agent generator logic section of each of the SSD modules, and to predict content occupancy of the cache based at least on the one or more prediction agents.\",\n \"Embodiment of the inventive concept can include a computer-implemented method for predicting solid state drive (SSD) memory cache occupancy and for reducing I/Os in an SSD shared array.\",\n \"The method can include processing, by a host agent, write requests to a particular logical memory address.\",\n \"For example, the method can include processing, by the host agent, a first write request including first data content associated with a particular logical memory address.\",\n \"The method can include processing, by the host agent, a second write request including second data content associated with the particular logical memory address.\",\n \"The method can include predicting content occupancy of a cache of a particular SSD from among a plurality of shared SSDs.\",\n \"The method can include determining whether a location in the cache of the particular SSD is probably logically contiguous to the particular logical memory address based on the prediction.\",\n \"Embodiments of the inventive concept can include a solid state drive (SSD).\",\n \"The SSD can include a non-volatile memory section, a cache coupled to the non-volatile memory section, and a prediction agent generator logic section coupled to the cache and configured to generate one or more prediction agents to predict content occupancy of the cache.\",\n \"The prediction agent generator logic section can be configured to transfer the one or more prediction agents to a host agent that is separate from the SSD.\",\n \"The prediction agent generator logic section can include one or more bloom filters, and can be configured to generate one or more bloom filter vectors based at least on the one or more bloom filters.\",\n \"The one or more bloom filter vectors can include the one or more prediction agents.\",\n \"The prediction agent generator logic section can periodically broadcast, among other techniques described below, the one or more bloom filter vectors including the one or more prediction agents to the host agent that is separate from the SSD.\"\n ],\n [\n \"RELATED APPLICATION DATA This application is a continuation of U.S. patent application Ser.\",\n \"No.\",\n \"14/813,070, filed Jul.\",\n \"29, 2015, which claims the benefit of U.S. Patent Application Ser.\",\n \"No.\",\n \"62/082,601, filed Nov. 20, 2014, which is hereby incorporated by reference.\",\n \"BACKGROUND The present inventive concepts relate to solid state drives (SSDs), and more particularly, to SSD memory cache occupancy prediction for reducing I/Os, reducing wear, and improving performance.\",\n \"The number of modern devices that include SSDs is increasing at a significant pace.\",\n \"With the rapid expansion of Internet-enabled devices, computer server farms, mobile devices, high-speed networks, and the like, SSDs are becoming a crucial backbone storage technology that enables a broad range of innovative applications.\",\n \"To increase capacity and performance, some attempts have been made to group SSDs into shared arrays.\",\n \"But a host device or agent that interacts with a shared SSD array has limited knowledge of the state of the various SSDs.\",\n \"In particular, the state of the cache within an SSD, which may be a volatile memory such as a dynamic random access memory (DRAM), is not exposed to any external device (e.g., host agent).\",\n \"Because of such opaqueness, current approaches for interacting with an SSD array are relatively less efficient than they otherwise could be.\",\n \"For example, if a first write occurs to a particular logical memory address, such first write will be directed to a first SSD.\",\n \"Then, if a second write occurs to the same particular logical memory address, conventional approaches may send the second write to a different SSD, and then invalidate the contents written to the first SSD.\",\n \"This requires multiple I/Os to the non-volatile memory of different SSDs, thereby reducing performance.\",\n \"Embodiments of the present inventive concept address these and other limitations in the prior art.\",\n \"BRIEF SUMMARY Embodiments of the inventive concept include a solid state drive (SSD) shared array memory cache system.\",\n \"The system can include a plurality of SSD modules each including a non-volatile memory section, a cache, and a prediction agent generator logic section.\",\n \"The system can include a host agent communicatively coupled to the plurality of SSD modules, the host agent including an occupancy prediction logic section configured to receive one or more prediction agents from the prediction agent generator logic section of each of the SSD modules, and to predict content occupancy of the cache based at least on the one or more prediction agents.\",\n \"Embodiment of the inventive concept can include a computer-implemented method for predicting solid state drive (SSD) memory cache occupancy and for reducing I/Os in an SSD shared array.\",\n \"The method can include processing, by a host agent, write requests to a particular logical memory address.\",\n \"For example, the method can include processing, by the host agent, a first write request including first data content associated with a particular logical memory address.\",\n \"The method can include processing, by the host agent, a second write request including second data content associated with the particular logical memory address.\",\n \"The method can include predicting content occupancy of a cache of a particular SSD from among a plurality of shared SSDs.\",\n \"The method can include determining whether a location in the cache of the particular SSD is probably logically contiguous to the particular logical memory address based on the prediction.\",\n \"Embodiments of the inventive concept can include a solid state drive (SSD).\",\n \"The SSD can include a non-volatile memory section, a cache coupled to the non-volatile memory section, and a prediction agent generator logic section coupled to the cache and configured to generate one or more prediction agents to predict content occupancy of the cache.\",\n \"The prediction agent generator logic section can be configured to transfer the one or more prediction agents to a host agent that is separate from the SSD.\",\n \"The prediction agent generator logic section can include one or more bloom filters, and can be configured to generate one or more bloom filter vectors based at least on the one or more bloom filters.\",\n \"The one or more bloom filter vectors can include the one or more prediction agents.\",\n \"The prediction agent generator logic section can periodically broadcast, among other techniques described below, the one or more bloom filter vectors including the one or more prediction agents to the host agent that is separate from the SSD.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The foregoing and additional features and advantages of the present inventive principles will become more readily apparent from the following detailed description, made with reference to the accompanying figures, in which: FIG.\",\n \"1 is an example block diagram of an SSD shared array memory cache system including a host agent and a shared SSD array in accordance with embodiments of the inventive concept.\",\n \"FIG.\",\n \"2 is an example block diagram of an SSD from among the shared SSD array of FIG.\",\n \"1 in accordance with embodiments of the inventive concept.\",\n \"FIG.\",\n \"3 is an example block diagram of the SSD shared array memory cache system of FIG.\",\n \"1 including additional detailed aspects of the system in accordance with embodiments of the inventive concept.\",\n \"FIG.\",\n \"4 illustrates a flow diagram including a technique for redirecting I/Os to different SSDs in the shared SSD array based on the prediction of memory cache occupancy in an SSD in accordance with embodiments of the inventive concept.\",\n \"FIG.\",\n \"5 illustrates a flow diagram including a technique for generating memory cache prediction agents associated with an SSD in accordance with embodiments of the inventive concept.\",\n \"FIG.\",\n \"6 is another example block diagram of an SSD shared array memory cache system in accordance with embodiments of the inventive concept.\",\n \"FIG.\",\n \"7 is a block diagram of a computing system including the host agent and the SSD shared array of FIG.\",\n \"1.DETAILED DESCRIPTION Reference will now be made in detail to embodiments of the inventive concept, examples of which are illustrated in the accompanying drawings.\",\n \"In the following detailed description, numerous specific details are set forth to enable a thorough understanding of the inventive concept.\",\n \"It should be understood, however, that persons having ordinary skill in the art may practice the inventive concept without these specific details.\",\n \"In other instances, well-known methods, procedures, components, circuits, and networks have not been described in detail so as not to unnecessarily obscure aspects of the embodiments.\",\n \"It will be understood that, although the terms first, second, etc.\",\n \"may be used herein to describe various elements, these elements should not be limited by these terms.\",\n \"These terms are only used to distinguish one element from another.\",\n \"For example, a first hashed key could be termed a second hashed key, and, similarly, a second hashed key could be termed a first hashed key, without departing from the scope of the inventive concept.\",\n \"The terminology used in the description of the inventive concept herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the inventive concept.\",\n \"As used in the description of the inventive concept and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.\",\n \"It will also be understood that the term “and/or” as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.\",\n \"It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.\",\n \"The components and features of the drawings are not necessarily drawn to scale.\",\n \"Embodiments of the inventive concept include systems, devices, and techniques for predicting contents of a cache of an SSD.\",\n \"Some embodiments include a mechanism for transferring information about data content within the cache to an external agent such as a host.\",\n \"The external agent can query the SSD for one or more prediction agents, such as bloom filter vector information, when needed, i.e., on demand.\",\n \"Alternatively or in addition, the SSD can periodically broadcast the one or more prediction agents so that the external agent can have information about the data content of the SSD's cache.\",\n \"Alternatively or in addition, instead of transferring complete bloom filter vector information, the SSD can transfer updates without transferring the entirety of the vector information, thereby reducing overhead.\",\n \"The external agent can re-direct writes based on the predicted cache content.\",\n \"Moreover, the external agent can coalesce multiple write requests that would have otherwise been sent to different SSDs into a single I/O that is sent to a particular SSD.\",\n \"Such coalescing can be accomplished by re-direction of write requests to addresses that are adjacent to cached addresses, as further described in detail below.\",\n \"Successive writes to a cached address, and a reduction in the number of I/Os, results in an increase in performance and an overall increase in endurance of the shared SSD array.\",\n \"FIG.\",\n \"1 is an example block diagram of an SSD shared array memory cache system 100 including a host agent 105 and a shared SSD array 125 in accordance with embodiments of the inventive concept.\",\n \"The shared SSD array 125 can include multiple SSD modules (e.g., 130, 140, and 150).\",\n \"Each of the SSD modules can include a non-volatile memory section (e.g., 136, 146, and 156, respectively), a cache (e.g., 132, 142, and 152, respectively), and a prediction agent generator logic section (e.g., 134, 144, and 154, respectively).\",\n \"It will be understood that the host agent 105 need not reside on a “host” per se, but can be separate from the host, upstream of the SSD shared array 125, and/or part of the shared SSD array 125.The host agent 105 can be communicatively coupled to the shared SSD array 125 via a high-speed bus and/or fabric 120.For example, the high-speed bus and/or fabric 120 can be a Peripheral Component Interconnect Express (PCIe) bus or fabric, an Ethernet based fabric, a universal serial bus (USB), a Fibre Channel (FC) bus or fabric, or the like.\",\n \"It will be understood that any suitable kind of high-speed bus and/or fabric can be used in connection with the various embodiments of the inventive concept disclosed herein.\",\n \"The host agent 105 can include an occupancy prediction logic section 110 and an I/O re-direction section 115.The occupancy prediction logic section 110 can receive one or more prediction agents from the various prediction agent generator logic sections (e.g., 134, 144, and 154) of each of the corresponding SSD modules (e.g., 130, 140, and 150, respectively), as further described in detail below.\",\n \"The occupancy prediction logic section 110 can store bloom filter vectors 305 (of FIG.\",\n \"3, below) from the various SSDs of the shared SSD array 125.The occupancy prediction logic section 110 can predict content occupancy of the various caches (e.g., 132, 142, and 152, respectively) based at least on the one or more prediction agents, as also further described in detail below.\",\n \"The I/O re-direction section 115 can generate, forward, re-direct, and/or coalesce write requests to the shared SSD array 125, as also further described in detail below.\",\n \"FIG.\",\n \"2 is an example block diagram of an SSD 130 from among the SSDs of the shared SSD array 125 of FIG.\",\n \"1 in accordance with embodiments of the inventive concept.\",\n \"The prediction agent generator logic section 134 can include one or more bloom filters 205.The prediction agent generator logic section 134 can generate one or more bloom filter vectors 210 based at least on the one or more bloom filters 205.Each of the one or more bloom filter vectors 210 can include one or more prediction agents (e.g., 1st, 2nd, through Nth prediction agents).\",\n \"The prediction agents can be determined based at least on one or more hash functions of the one or more bloom filters 205.The one or more prediction agents can predict the presence of an address and/or data contents in the cache.\",\n \"The one or more bloom filters 205 can be used to determine whether an address and/or data contents may be present in the cache.\",\n \"Moreover, the one or more bloom filters 205 can be used to definitively determine that a particular address and/or data contents are not present in the cache.\",\n \"The prediction agent generator logic section 134 can periodically broadcast the one or more bloom filter vectors 210 including the one or more prediction agents.\",\n \"Alternatively or in addition, the host agent 105 can periodically query the prediction agent generator logic section 134 for the one or more bloom filter vectors 210 including the one or more prediction agents.\",\n \"Alternatively or in addition, the prediction agent generator logic section 134 can provide an update (e.g., 215) to the one or more bloom filter vectors 210, and to transfer the update 215 without transferring the entirety of the one or more bloom filter vectors 210.The SSD 130 can receive write requests (e.g., 230), which can include data content (e.g., ‘C1’) and an address (e.g., ‘A’).\",\n \"The cache 132 of the SSD 130 can store the data content ‘C1’ at an arbitrary location in the cache 132, along with one or more other write requests that are logically contiguous with the address ‘A,’ as further described in detail below.\",\n \"FIG.\",\n \"3 is an example block diagram of the SSD shared array memory cache system 100 of FIG.\",\n \"1 including additional detailed aspects of the system 100 in accordance with embodiments of the inventive concept.\",\n \"The host agent 105 can process a first write request 230 including first data content ‘C1’ associated with a particular logical memory address ‘A.’ The host agent 105 can send the first write request 230 having the first data content ‘C1’ associated with the particular logical memory address ‘A’ to a particular one of the SSD modules (e.g., 130).\",\n \"The particular one of the SSD modules 130 can store the first data content ‘C1’ associated with the first write request 230 at a location 320 in the cache 132 that is determined by cache replacement logic 235 when the request 230 is inserted in the cache 132.The occupancy prediction logic section 110 can predict the presence of an address in the cache 132 that is logically contiguous (e.g., at address A+1) with the particular logical memory address ‘A.’ The host agent 105 can process a write request (e.g., 330) having data content ‘C2’ associated with a particular logical memory address ‘A.’ The host agent 105 can include an I/O re-direction section 115.The I/O re-direction section 115 can re-direct the write request 330 having the data content ‘C2’ to the cache 132 that has a logically contiguous address in it.\",\n \"In other words, the I/O re-direction section 115 can change the write request 330 having the address ‘A’ to a re-directed write request 310 to be stored contiguous to the address ‘A+1.’ Put differently, instead of sending the write request 330 to the SSD 150 for storage at the logical address ‘A’ of the cache 152 as shown at 315, the I/O re-direction section 115 can cause the write request 330 to be re-directed to the SSD 130 for storage contiguous to the logical address ‘A+1’ of the cache 132.The I/O re-direction section 115 can send the redirected write request 310 having the data content ‘C2’ to the particular one of the SSD modules 130.The particular one of the SSD modules 130 can store the data content ‘C2’ associated with the redirected write request 310 at the location 325 in the cache 132 that is logically contiguous with the location 320 in the cache 132 that is associated with the particular logical memory address ‘A.’ The I/O re-direction section 115 and/or the cache (e.g., 132) can coalesce the first write request 230 and the redirected second write request 310 into a single I/O (e.g., 340), and send the single I/O 340 to the non-volatile memory 136 (of FIG.\",\n \"1).\",\n \"Such coalescing reduces the number of I/Os between the caches of the SSDs and the respective non-volatile memories, thereby increasing the endurance of the shared SSD array 125.FIG.\",\n \"4 illustrates a flow diagram 400 including a technique for redirecting I/Os to different SSDs in the shared SSD array based on the prediction of memory cache occupancy in an SSD in accordance with embodiments of the inventive concept.\",\n \"The technique can include a computer-implemented method for predicting solid state drive (SSD) memory cache occupancy and for reducing I/Os in an SSD shared array.\",\n \"For example, the technique can begin at 405 where a first write request (e.g., 230 of FIG.\",\n \"2) including first data content (e.g., ‘C1’) associated with a particular logical memory address (e.g., ‘A’) can be processed, by a host agent (e.g., 105).\",\n \"At 410, a second write request (e.g., 330 of FIG.\",\n \"3) including second data content (e.g., ‘C2’) associated with a particular logical memory address (e.g., ‘A+1’) can be processed, by the host agent (e.g., 105 of FIG.\",\n \"1).\",\n \"At 415, content occupancy of a cache (e.g., 132 of FIG.\",\n \"1) of a particular SSD (e.g., 130 of FIG.\",\n \"1) from among a plurality of shared SSDs (e.g., 125 of FIG.\",\n \"1) can be predicted.\",\n \"A determination can be made at 420 whether 1) an address (e.g., ‘A+1’) exists in the cache of a particular SSD and/or 2) whether an address that is contiguous to ‘A+1’ (e.g., ‘A’ or ‘A+2’) exists in the cache of a particular SSD.\",\n \"Determining whether or not an address is probably logically contiguous with another can be based on determining whether a probability exceeds a predefined probability threshold.\",\n \"If YES, meaning that an either an address in the cache of the particular SSD is probably logically contiguous to the particular memory address (e.g., ‘A+1’) based on the prediction, or the address (e.g., ‘A+1’) exists in the cache of a particular SSD, or both, then the flow can proceed to 425, where the second write request (e.g., 330 of FIG.\",\n \"3) having the second data content (e.g., ‘C2’) can be redirected, by a re-direction section (e.g., 115 of FIG.\",\n \"1) of the host agent (e.g., 105 of FIG.\",\n \"1), to the cache (e.g., 132 of FIG.\",\n \"1) of the particular SSD (e.g., 130 of FIG.\",\n \"1) responsive to determining that an address exists in the cache (e.g., 132 of FIG.\",\n \"1) of the particular SSD (e.g., 130 of FIG.\",\n \"1) that is probably logically contiguous to the particular logical memory address (e.g., ‘A+1’).\",\n \"At 430, the I/O re-direction section (e.g., 115 of FIG.\",\n \"1) can coalesce the first write request (e.g., 230 of FIG.\",\n \"2) and the second re-directed write request (e.g., 310 of FIG.\",\n \"3) into a single I/O (e.g., 340 of FIG.\",\n \"3).\",\n \"The I/O re-direction section can send the single I/O including the first write request and the second write request to the particular non-volatile memory (e.g., 136 of FIG.\",\n \"1).\",\n \"The particular SSD 130 can store the first content (e.g., ‘C1’) of the first write request (e.g., 230 of FIG.\",\n \"2) at the particular logical memory address (e.g., ‘A’) of the cache (e.g., 132 of FIG.\",\n \"1) of the particular SSD (e.g., 130).\",\n \"Also, the particular SSD 130 can store the second content (e.g., ‘C2’) of the second re-directed write request (e.g., 310 of FIG.\",\n \"3) at the location (e.g., 325 of FIG.\",\n \"3) in the cache (e.g., 132 of FIG.\",\n \"1) of the particular SSD (e.g., 130 of FIG.\",\n \"1).\",\n \"In other words, the first content C1 and the second content C2 can be stored in logically contiguous space within the cache of the particular SSD.\",\n \"Otherwise, if NO, meaning that an address in the cache of the particular SSD is probably not logically contiguous to the particular memory address ‘A’ based on the prediction, the flow can proceed to 440, where the host agent (e.g., 105 of FIG.\",\n \"1) can send the first write request (e.g., 230) including the first data content (e.g., ‘C1’) to the particular SSD (e.g., 130 of FIG.\",\n \"1), after which the host agent (e.g., 105 of FIG.\",\n \"1) can send, at 445, the second write request (e.g., 330 of FIG.\",\n \"3) including the second data content (e.g., ‘C2’) to a second SSD (e.g., 150 of FIG.\",\n \"1).\",\n \"The host agent (e.g., 105 of FIG.\",\n \"1) can then cause, at 450, the first content (e.g., ‘C1’) in the cache (e.g., 132 of FIG.\",\n \"1) of the particular SSD (e.g., 130 of FIG.\",\n \"1) to be invalidated.\",\n \"It will be understood that the steps need not occur in the illustrated order, but rather, can occur in a different order and/or with intervening steps.\",\n \"FIG.\",\n \"5 illustrates a flow diagram 500 including a technique for generating memory cache prediction agents associated with an SSD in accordance with embodiments of the inventive concept.\",\n \"The technique can begin at 505, where a prediction agent generator logic section (e.g., 134 of FIG.\",\n \"1) can generate one or more bloom filter vectors (e.g., 210 of FIG.\",\n \"2) associated with the cache (e.g., 132) of the particular SSD (e.g., 130) based at least on one or more bloom filters (e.g., 205 of FIG.\",\n \"2).\",\n \"The host agent (e.g., 105 of FIG.\",\n \"1) can receive the one or more bloom filter vectors (e.g., 210 of FIG.\",\n \"2).\",\n \"The occupancy prediction logic section (e.g., 110 of FIG.\",\n \"1) can predict the content occupancy of the cache (e.g., 132 of FIG.\",\n \"1) of the particular SSD (e.g., 130 of FIG.\",\n \"1) based at least on the one or more bloom filter vectors (e.g., 210 of FIG.\",\n \"2).\",\n \"The flow can proceed along one or more of three paths 510, 515, and 520.For example, at 510, the prediction agent generator logic section (e.g., 134 of FIG.\",\n \"1) can periodically broadcast the one or more bloom filter vectors (e.g., 210 of FIG.\",\n \"2) to the host agent (e.g., 105 of FIG.\",\n \"1).\",\n \"At 515, the host agent (e.g., 105 of FIG.\",\n \"1) can periodically query the prediction agent generator logic section (e.g., 134 of FIG.\",\n \"1) for the one or more bloom filter vectors (e.g., 210 of FIG.\",\n \"2).\",\n \"At 520, the prediction agent generator logic section (e.g., 134 of FIG.\",\n \"1) can provide an update (e.g., 215 of FIG.\",\n \"2) to the one or more bloom filter vectors (e.g., 210 of FIG.\",\n \"2).\",\n \"The prediction agent generator logic section (e.g., 134 of FIG.\",\n \"1) can transfer the update (e.g., 215 of FIG.\",\n \"2) to the host agent (e.g., 105 of FIG.\",\n \"1) without transferring the entirety of the one or more bloom filter vectors (e.g., 210 of FIG.\",\n \"2), thereby conserving bandwidth.\",\n \"It will be understood that the steps need not occur in the illustrated order, but rather, can occur in a different order and/or with intervening steps.\",\n \"FIG.\",\n \"6 is another example block diagram of an SSD shared array memory cache system 600 including a host agent 105 and a shared SSD array 125 in accordance with embodiments of the inventive concept.\",\n \"The host agent 105 can correspond to the host agent described in detail above, and therefore, a detailed description is not repeated.\",\n \"The host agent 105 can be in communication with the shared SSD array 125 via the communication means 605.The communication means 605 can include a processor-to-processor link such as QuickPath Interconnect (QPI).\",\n \"The communication means 605 can include an I/O link such as peripheral component interconnect express (PCIe).\",\n \"The communication means 605 can include a storage link such as serial attached small computer system interface (SAS), an Ethernet link or protocol, a USB interface, a Fibre Channel interface, or the like.\",\n \"The communication means 605 can include a link protocol.\",\n \"The link protocol can be packetized.\",\n \"The link protocol can include a wormhole routing protocol.\",\n \"The host agent 105 can have separate protocol generators, link-layers, and/or controllers.\",\n \"It will be understood that the communication means 605 can include any suitable kind of computer interface and/or link protocol.\",\n \"FIG.\",\n \"7 is a block diagram of a computing system 700 including the host agent 105 and the SSD shared array 125 of FIG.\",\n \"1.The computing system 700 can include a clock 710, a random access memory (RAM) 715, a user interface 720, a modem 725 such as a baseband chipset, a solid state drive/disk (SSD) 740, and/or a processor 735, any or all of which may be electrically coupled to a system bus 705.The host agent 105 can correspond to that described in detail above, and as set forth herein, and may also be electrically coupled to the system bus 705.The host agent 705 can include or otherwise interface with the SSD shared array 125, the clock 710, the random access memory (RAM) 715, the user interface 720, the modem 725, the solid state drive/disk (SSD) 740, and/or the processor 735.The SSD shared array 125 can include any set of N SSDs that can be managed together, within the same or different machines, and/or as part of an array.\",\n \"The connection from the host agent 105 to the SSDs 125 can be through an Intel Quickpath Interconnect (QPI) link, a PCIe link, an Ethernet network link, or the like.\",\n \"The following discussion is intended to provide a brief, general description of a suitable machine or machines in which certain aspects of the inventive concept can be implemented.\",\n \"Typically, the machine or machines include a system bus to which is attached processors, memory, e.g., random access memory (RAM), read-only memory (ROM), or other state preserving medium, storage devices, a video interface, and input/output interface ports.\",\n \"The machine or machines can be controlled, at least in part, by input from conventional input devices, such as keyboards, mice, etc., as well as by directives received from another machine, interaction with a virtual reality (VR) environment, biometric feedback, or other input signal.\",\n \"As used herein, the term “machine” is intended to broadly encompass a single machine, a virtual machine, or a system of communicatively coupled machines, virtual machines, or devices operating together.\",\n \"Exemplary machines include computing devices such as personal computers, workstations, servers, portable computers, handheld devices, telephones, tablets, etc., as well as transportation devices, such as private or public transportation, e.g., automobiles, trains, cabs, etc.\",\n \"The machine or machines can include embedded controllers, such as programmable or non-programmable logic devices or arrays, Application Specific Integrated Circuits (ASICs), embedded computers, smart cards, and the like.\",\n \"The machine or machines can utilize one or more connections to one or more remote machines, such as through a network interface, modem, or other communicative coupling.\",\n \"Machines can be interconnected by way of a physical and/or logical network, such as an intranet, the Internet, local area networks, wide area networks, etc.\",\n \"One skilled in the art will appreciate that network communication can utilize various wired and/or wireless short range or long range carriers and protocols, including radio frequency (RF), satellite, microwave, Institute of Electrical and Electronics Engineers (IEEE) 545.11, Bluetooth®, optical, infrared, cable, laser, etc.\",\n \"Embodiments of the present inventive concept can be described by reference to or in conjunction with associated data including functions, procedures, data structures, application programs, etc.\",\n \"which when accessed by a machine results in the machine performing tasks or defining abstract data types or low-level hardware contexts.\",\n \"Associated data can be stored in, for example, the volatile and/or non-volatile memory, e.g., RAM, ROM, etc., or in other storage devices and their associated storage media, including hard-drives, floppy-disks, optical storage, tapes, flash memory, memory sticks, digital video disks, biological storage, etc.\",\n \"Associated data can be delivered over transmission environments, including the physical and/or logical network, in the form of packets, serial data, parallel data, propagated signals, etc., and can be used in a compressed or encrypted format.\",\n \"Associated data can be used in a distributed environment, and stored locally and/or remotely for machine access.\",\n \"Having described and illustrated the principles of the inventive concept with reference to illustrated embodiments, it will be recognized that the illustrated embodiments can be modified in arrangement and detail without departing from such principles, and can be combined in any desired manner.\",\n \"And although the foregoing discussion has focused on particular embodiments, other configurations are contemplated.\",\n \"In particular, even though expressions such as “according to an embodiment of the inventive concept” or the like are used herein, these phrases are meant to generally reference embodiment possibilities, and are not intended to limit the inventive concept to particular embodiment configurations.\",\n \"As used herein, these terms can reference the same or different embodiments that are combinable into other embodiments.\",\n \"Embodiments of the inventive concept may include a non-transitory machine-readable medium comprising instructions executable by one or more processors, the instructions comprising instructions to perform the elements of the inventive concepts as described herein.\",\n \"The foregoing illustrative embodiments are not to be construed as limiting the inventive concept thereof.\",\n \"Although a few embodiments have been described, those skilled in the art will readily appreciate that many modifications are possible to those embodiments without materially departing from the novel teachings and advantages of the present disclosure.\",\n \"Accordingly, all such modifications are intended to be included within the scope of this inventive concept as defined in the claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870849"}}},{"rowIdx":4493658,"cells":{"text":{"kind":"list like","value":[["MICROWAVE ABLATION CATHETER, HANDLE, AND SYSTEM","A handle for longitudinal movement of a first tubular member over a second tubular member includes a handle body, a nose cone, a locking mechanism, and a retraction control.","The nose cone has a sleeve and an outer wall that define a control channel therebetween.","The nose cone is moveable over the handle body between extended and retracted positions.","The locking mechanism has locked and unlocked positions for selectively fixing the nose cone in the extended and retracted positions.","A finger of the retraction control is positioned within the control channel of the nose cone.","The retraction control has first and second positions relative to the nose cone for transitioning the locking mechanism between the locked and unlocked position and for moving the nose cone between the extended and retracted positions."],["1-20.","(canceled) 21.A handle for longitudinal movement of a first tubular member over a second tubular member, the handle comprising: a handle body defining a slot; a nose cone movable over the handle body between an extended position and a retracted position; a locking pin disposed within and biased out of the slot of the handle body, the locking pin having a locked position in which the nose cone and the handle body are fixed relative to one another and an unlocked position in which the nose cone is movable over the handle body between the extended position and the retracted position.","22.The handle according to claim 21, wherein the locking pin includes a retention plate that retains the locking pin within the slot.","23.The handle according to claim 21, wherein the nose cone has a sleeve and an outer wall that define a control channel therebetween.","24.The handle according to claim 23, wherein the sleeve of the nose cone defines first and second openings, wherein when the nose cone is in the extended position and the locking pin is in the locked position, the locking pin is disposed within the first opening, and wherein when the nose cone is in the retracted position and the locking pin is in the locked position, the locking pin is disposed within the second opening.","25.The handle according to claim 21, further comprising a retraction control having a finger positioned within the nose cone, the retraction control having first and second positions relative to the nose cone, the retraction control configured to transition the locking pin between the locked and unlocked positions and to move the nose cone over the handle body between the extended and retracted positions.","26.The handle according to claim 25, wherein when the nose cone is in the extended position and the retraction control is in the first position, the locking pin is in the locked position such that the nose cone is fixed in the extended position.","27.The handle according to claim 25, wherein when the nose cone is in the extended position and the retraction control is in the second position, the locking mechanism is in the unlocked position such that the nose cone is movable over to the handle body.","28.The handle according to claim 27, wherein when the nose cone reaches the retracted position, the locking pin transitions to the locked position to fix the nose cone in the retracted position.","29.The handle according to claim 25, wherein when the nose cone is in the retracted position and the retraction control is in the second position, the locking pin is in the locked position such that the nose cone is fixed in the extended position.","30.The handle according to claim 25, wherein when the nose cone is in the retracted position and the retraction control is in the first position, the locking pin is in the unlocked position such that the nose cone is movable relative to the handle body 31.The handle according to claim 30, wherein when the nose cone reaches the extended position, the locking pin transitions to the locked position to fix the nose cone in the extended position.","32.The handle according to claim 25, wherein the second position of the retraction control is proximal to the first position of the retraction control.","33.A handle for longitudinal movement of a first tubular member over a second member, the handle comprising: a housing body defining a proximal portion of a through passage of the handle and a nut recess; and an adjustment nut received within the nut recess which longitudinally fixes the adjustment nut relative to the housing body, the adjustment nut being configured to longitudinally fix the second member relative to the housing body.","34.The handle according to claim 33, wherein the adjustment nut is configured to adjust a length of the second member extending from the housing body.","35.The handle according to claim 34, wherein the adjustment nut includes threads that are configured to cooperate with threads of the second member to allow fine adjustment of a length of the second member extending from the housing body.","36.The handle according to claim 33, further comprising a nose cone defining a distal portion of the through passage which is in communication with the proximal portion of the through passage, the nose cone longitudinally movable over the housing body between an extended position and a retracted position.","37.The handle according to claim 36, wherein the nose cone is configured to move the first tubular member which is coupled to the nose cone over to the second member fixed to the housing body."],[" BACKGROUND "],[" SUMMARY In an aspect of the present disclosure, a handle for longitudinal movement of a first tubular member over a second tubular member includes a handle body, a nose cone, a locking mechanism, and a retraction control.","The nose cone has a sleeve and an outer wall defining a control channel therebetween.","The nose cone is moveable over the handle body between extended and retracted positions.","The locking mechanism has locked and unlocked positions for selectively fixing the nose cone in the extended and retracted positions.","The retraction control includes a finger positioned within the control channel of the nose cone and has first and second positions relative to the nose cone for transitioning the locking mechanism between the locked and unlocked positions and for moving the nose cone between the extended and retracted positions.","In aspects, when the nose cone is in the extended position and the retraction control is in the first position, the locking mechanism is in the locked position to fix the nose cone in the extended position.","In some aspects, when the nose cone is in the extended position and the retraction control is in the second position, the locking mechanism is in the unlocked position such that the nose cone is moveable relative to the handle body.","When the nose cone reaches the retracted position, the locking mechanism transitions to the locked position to fix the nose cone in the retracted position.","In certain aspects, when the nose cone is in the retracted position and the retraction control is in the second position, the locking mechanism is in the locked position to fix the nose cone in the extended position.","In particular aspects, when the nose cone is in the retracted position and the retraction control is in the first position, the locking mechanism is in the unlocked position such that the nose cone is moveable relative to the handle body.","When the nose cone reaches the extended position, the locking mechanism may transition to the locked position to fix the nose cone in the extended position.","In aspects, the second position of the retraction control is proximal to the first position of the retraction control.","The locking mechanism may be disposed within a slot defined in the housing body.","The locking mechanism may include a locking pin that has a retention plate.","The locking pin may be biased out of the slot defined in the housing body such that the retention plate retains the locking pin within the slot.","The sleeve of the nose cone may define first and second openings such that when the nose cone is in the extended position and the locking pin is in the locked position, the locking pin is disposed within the first opening.","In addition, when the nose cone is in the retracted position and the locking pin is in the locked position, the locking pin may be disposed within the second opening.","In another aspect of the present disclosure, a surgical system includes an extended working channel having proximal and distal ends, a handle defining a through passage, a retraction control, and a catheter assembly disposed within the through passage of the handle.","The handle includes a housing body defining a proximal portion of the through passage, a nose cone coupled to the proximal end of the extended working channel, a locking mechanism, and a retraction control.","The nose cone has a sleeve and an outer wall defining a control channel therebetween.","The nose cone defines a distal portion of the through passage in communication with the extended working channel.","The nose cone is longitudinally moveable over the housing body between extended and retracted positions.","The locking mechanism has locked and unlocked positions for selectively fixing the nose cone in the extended and retracted positions.","The retraction control includes a finger positioned within the control channel of the nose cone.","The retraction control has first and second positions relative to the nose cone for transitioning the locking mechanism between the locked and unlocked positions and for moving the nose cone between the extended and retracted positions.","The catheter assembly includes a catheter hub positioned within the proximal portion of the through passage and an ablation probe extending from the catheter hub through the nose cone of the handle and through the extended working channel.","The ablation probe has a distal end that is disposed within the extended working channel when the handle is in the extend position and that is position positioned distal to the distal end of the extended working channel when the handle is in the retracted position.","In aspects, the catheter hub combines coolant tubes and an antenna into the ablation probe.","The catheter hub may include an adjustment nut that is positioned over an outer surface of the catheter hub.","The housing portion may define a nut recess for receiving the adjustment nut to longitudinally fix the ablation probe to the housing portion.","The adjustment nut is threaded to cooperate with threads on the outer surface of the catheter hub to allow fine adjustment of the length of the ablation probe relative to the housing portion.","The distal end of the ablation probe may be positioned within the distal end of the extended working channel when the nose cone is in the extended position.","The distal end of the ablation probe may be positioned distal to the distal end of the extended working channel when the nose cone is in the retracted position.","In another aspect of the present disclosure, a method of assembly of a surgical system includes positioning a catheter assembly within a half of a first portion of a passage defined within a first half of a housing body of a handle, securing a second half of the housing body of the handle to the first half of the housing body with the catheter assembly that is positioned in a half of the first portion of the passage defined within the second half of the housing body to form the housing body, sliding a nose cone of the handle over a distal portion of the housing body, and inserting a finger of a retraction control within a control channel defined between a sleeve and outer wall of the nose cone.","The nose cone defines a second portion of the passage that receives a probe of the catheter assembly therethrough.","In aspects, the positioning of the catheter assembly within the first half of the first portion of the passage that is defined within the first half of the housing body includes position an adjustment nut within a nut recess defined in the housing body to adjust the length of the probe extending distally from the housing body.","The method may further include rotating the adjustment nut about a threaded portion of the catheter hub to fix the length of the probe that extends distally from the housing body.","Securing the second half of the housing body to the first half of the housing body may prevent adjustment of the length of the probe extending distally from the housing body during use of the surgical system.","In another aspect of the present disclosure, a support system includes a rail, a lower support, and an instrument support.","The rail has upper and lower ends that define a longitudinal axis therebetween.","The lower support is configured to receive a portion of a bronchoscope and to selectively fix the bronchoscope relative to the rail.","The instrument support is slidably disposed on the rail and is selectively lockable to the rail.","The instrument support is configured to releasably couple to a surgical instrument inserted through the bronchoscope to fix the position of a portion of the surgical instrument relative to the bronchoscope.","In aspects, the instrument support includes a clamp arm and a clamp arm collar.","The clamp arm collar may be slidably disposed over the rail.","The clamp arm may include instrument fingers that extend from the clamp arm collar.","The instrument fingers may define an instrument passage that is configured to releasably couple to the surgical instrument.","The instrument support may include a locking arm that has a locking cam.","The clamp arm collar may include a camming surface and the locking cam may be configured to compress the camming surface of the clamp arm collar against the rail when the locking arm is in the locked position to lock the instrument support to the rail.","In the locked position, the instrument support may be radially locked relative to the rail.","In some aspects, the lower support defines a rail opening that is configured to receive the lower end of the rail.","The support system may include a collar positioned within the rail opening that includes a threaded portion.","The support system may include a securement member that is threaded over the threaded portion of the collar to compress the collar over the lower end of the rail to fix the rail to the lower support.","In certain aspects, the lower support includes a pair of support fingers that extend orthogonally from the rail.","The support fingers may define a support opening therebetween.","The support fingers may be configured to compress the support opening about the bronchoscope to fix the lower support relative to the bronchoscope.","In another aspect of the present disclosure, a surgical system includes a bronchoscope, an extended working channel that extends through the bronchoscope, an elongated surgical instrument that is inserted through the extended working channel, and a support system for supporting the elongated surgical instrument relative to the bronchoscope.","The support system includes a rail, a lower support, and an instrument support.","The rail has upper and lower ends that define a longitudinal axis therebetween.","The lower support is fixed to the lower end of the rail and to the bronchoscope to fix the rail to the bronchoscope.","The instrument support is slidably disposed on the rail and is selectively lockable to the rail.","The instrument support is releasably coupled to a first portion of the elongated surgical instrument to fix the position of the first portion of the elongated surgical instrument relative to the bronchoscope.","In aspects, a second portion of the elongated surgical instrument is moveable relative to the bronchoscope.","The second portion of the elongated surgical instrument may be fixed to a proximal end of the extended working channel such that the extended working channel is moveable relative to the bronchoscope and the first portion of the elongated surgical instrument.","The first portion of the elongated surgical instrument includes an ablation probe that extends through the second portion of the elongated surgical instrument and the extended working channel.","In some aspects, the extended working channel includes a telescopic extended working channel handle that is fixed to the bronchoscope.","When the telescopic extended working channel handle is manipulated, the bronchoscope and the elongated surgical instrument that is fixed to the bronchoscope by the support system move in concert with the telescopic extended working channel handle.","In another aspect of the present disclosure, a method of positioning an elongated surgical instrument adjacent targeted tissue includes inserting the elongated surgical instrument into an extended working channel, securing a support system to the bronchoscope, coupling a portion of the elongated surgical instrument to the support system to fix the portion of the elongated surgical instrument to the bronchoscope, and manipulating a portion of the extended working channel such that the bronchoscope, the elongated surgical instrument, and the support system move in concert with the portion of the extended working channel.","The elongated surgical instrument may have a locatable guide adjacent a distal end thereof.","The extended working channel passes through a bronchoscope positioned in an airway of a patient.","In aspects, manipulating a portion of the extended working channel includes manipulating a telescopic extended working channel handle of the extended working channel that is connected to the bronchoscope.","In some aspects, securing the support system to the bronchoscope may include fixing a lower support of the support system to a portion of the bronchoscope.","Securing the support system to the bronchoscope may include inserting a lower end of a rail of the support system into the lower support.","In certain aspects, coupling a portion of the elongated surgical instrument to the support system includes coupling the portion of the elongated surgical instrument in an instrument support of the support system.","The method may include locking the instrument support to a rail of the support system to fix the portion of the elongated surgical instrument relative to the bronchoscope.","Further, to the extent consistent, any of the aspects described herein may be used in conjunction with any or all of the other aspects described herein."],["CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser.","No.","14/479,482, filed Sep. 8, 2014, which claims the benefit of, and priority to, U.S.","Provisional Patent Application Ser.","Nos.","61/874,881, filed Sep. 6, 2013; 61/974,611, filed Apr.","3, 2014; and 62/041,424, filed Aug. 25, 2014.The entire contents of each of the above applications are hereby incorporated herein by reference.","BACKGROUND 1.Technical Field The present disclosure relates to surgical instruments and, more specifically, to handles for moving an outer tubular member relative to an inner tubular member inserted therethrough.","2.Discussion of Related Art A common interventional procedure in the field of pulmonary medicine is bronchoscopy, in which a bronchoscope is inserted into the airways through the patient's nose or mouth.","The structure of a bronchoscope generally includes a long, thin, flexible tube that typically contains three elements: an illumination assembly for illuminating the region distal to the bronchoscope's tip via an optical fiber connected to an external light source; an imaging assembly for delivering back a video image from the bronchoscope's distal tip; and a lumen or working channel through which instruments may be inserted, including but not limited to placement (e.g., guide wires), diagnostic (e.g., biopsy tools) and therapeutic (e.g., treatment catheters or laser, cryogenic, radio frequency, or microwave tissue treatment probes) instruments.","The distal tip of a bronchoscope is steerable.","Rotating a lever placed at the handle of the bronchoscope actuates a steering mechanism that deflects the tip in one or more directions.","Bronchoscopies are performed by pulmonologists, also known as bronchoscopists, and are used routinely in the diagnosis and treatment of conditions such as lung cancer, airway stenosis, and emphysema.","Bronchoscopies are typically performed by a staff of at least two persons: the bronchoscopist and at least one assistant, usually a nurse.","During a typical procedure, the bronchoscopist holds the bronchoscope handle with one hand and the bronchoscope tube with the other hand.","The bronchoscopist manipulates the distal tip of the bronchoscope inside the lung by rotating a deflection lever and by pushing and pulling the tube.","Once the tip is brought to a target, an instrument can be inserted into the working channel to perform a diagnostic or therapeutic procedure.","During insertion and operation of the instruments, the distal tip of the bronchoscope should be held steady at the target.","Two hands are needed to secure the bronchoscope in place and one to two more hands are needed for inserting and actuating the instrument.","Generally, the bronchoscopist releases the bronchoscope to insert and actuate the instrument.","Performing a procedure that requires two people is generally more expensive and the potential for error is increased.","Hence, it is desirable to modify a procedure so that it may be performed with one or two hands, if possible.","Additionally, because all of the instruments used with a bronchoscope are necessarily long and slender, the instruments do not retain shape when unsupported.","Thus, inserting an instrument into a bronchoscope can be difficult or impossible to do quickly with one hand.","While this problem can be addressed easily by holding the end of the sheath in one hand and the instrument in another, this would again require additional free hands during performance of the procedure.","During particular procedures (e.g., microwave ablation and biopsy) a catheter or extended working channel may be inserted through a working channel to enable navigation to sites too remote and having luminal diameters too small for the bronchoscope.","An instrument may be inserted through the catheter or extended working channel in order to perform a biopsy or ablation procedure.","Current systems and methodologies for extending the surgical instrument from the catheter or retracting the catheter from the placement of the surgical instrument require at least two people to manipulate all the elements of the system including the bronchoscope.","Accordingly, there is a need for an apparatus that would facilitate one-handed actuation of the catheter and surgical instrument leaving one hand to manipulate the bronchoscope.","In addition, there is a need for a support for use with a bronchoscope that would facilitate operation of a bronchoscope and associated tools by a single practitioner.","It would also be advantageous to provide a support for the probe and the catheter to allow a single practitioner to manipulate a catheter, a probe, and a bronchoscope during the procedure.","SUMMARY In an aspect of the present disclosure, a handle for longitudinal movement of a first tubular member over a second tubular member includes a handle body, a nose cone, a locking mechanism, and a retraction control.","The nose cone has a sleeve and an outer wall defining a control channel therebetween.","The nose cone is moveable over the handle body between extended and retracted positions.","The locking mechanism has locked and unlocked positions for selectively fixing the nose cone in the extended and retracted positions.","The retraction control includes a finger positioned within the control channel of the nose cone and has first and second positions relative to the nose cone for transitioning the locking mechanism between the locked and unlocked positions and for moving the nose cone between the extended and retracted positions.","In aspects, when the nose cone is in the extended position and the retraction control is in the first position, the locking mechanism is in the locked position to fix the nose cone in the extended position.","In some aspects, when the nose cone is in the extended position and the retraction control is in the second position, the locking mechanism is in the unlocked position such that the nose cone is moveable relative to the handle body.","When the nose cone reaches the retracted position, the locking mechanism transitions to the locked position to fix the nose cone in the retracted position.","In certain aspects, when the nose cone is in the retracted position and the retraction control is in the second position, the locking mechanism is in the locked position to fix the nose cone in the extended position.","In particular aspects, when the nose cone is in the retracted position and the retraction control is in the first position, the locking mechanism is in the unlocked position such that the nose cone is moveable relative to the handle body.","When the nose cone reaches the extended position, the locking mechanism may transition to the locked position to fix the nose cone in the extended position.","In aspects, the second position of the retraction control is proximal to the first position of the retraction control.","The locking mechanism may be disposed within a slot defined in the housing body.","The locking mechanism may include a locking pin that has a retention plate.","The locking pin may be biased out of the slot defined in the housing body such that the retention plate retains the locking pin within the slot.","The sleeve of the nose cone may define first and second openings such that when the nose cone is in the extended position and the locking pin is in the locked position, the locking pin is disposed within the first opening.","In addition, when the nose cone is in the retracted position and the locking pin is in the locked position, the locking pin may be disposed within the second opening.","In another aspect of the present disclosure, a surgical system includes an extended working channel having proximal and distal ends, a handle defining a through passage, a retraction control, and a catheter assembly disposed within the through passage of the handle.","The handle includes a housing body defining a proximal portion of the through passage, a nose cone coupled to the proximal end of the extended working channel, a locking mechanism, and a retraction control.","The nose cone has a sleeve and an outer wall defining a control channel therebetween.","The nose cone defines a distal portion of the through passage in communication with the extended working channel.","The nose cone is longitudinally moveable over the housing body between extended and retracted positions.","The locking mechanism has locked and unlocked positions for selectively fixing the nose cone in the extended and retracted positions.","The retraction control includes a finger positioned within the control channel of the nose cone.","The retraction control has first and second positions relative to the nose cone for transitioning the locking mechanism between the locked and unlocked positions and for moving the nose cone between the extended and retracted positions.","The catheter assembly includes a catheter hub positioned within the proximal portion of the through passage and an ablation probe extending from the catheter hub through the nose cone of the handle and through the extended working channel.","The ablation probe has a distal end that is disposed within the extended working channel when the handle is in the extend position and that is position positioned distal to the distal end of the extended working channel when the handle is in the retracted position.","In aspects, the catheter hub combines coolant tubes and an antenna into the ablation probe.","The catheter hub may include an adjustment nut that is positioned over an outer surface of the catheter hub.","The housing portion may define a nut recess for receiving the adjustment nut to longitudinally fix the ablation probe to the housing portion.","The adjustment nut is threaded to cooperate with threads on the outer surface of the catheter hub to allow fine adjustment of the length of the ablation probe relative to the housing portion.","The distal end of the ablation probe may be positioned within the distal end of the extended working channel when the nose cone is in the extended position.","The distal end of the ablation probe may be positioned distal to the distal end of the extended working channel when the nose cone is in the retracted position.","In another aspect of the present disclosure, a method of assembly of a surgical system includes positioning a catheter assembly within a half of a first portion of a passage defined within a first half of a housing body of a handle, securing a second half of the housing body of the handle to the first half of the housing body with the catheter assembly that is positioned in a half of the first portion of the passage defined within the second half of the housing body to form the housing body, sliding a nose cone of the handle over a distal portion of the housing body, and inserting a finger of a retraction control within a control channel defined between a sleeve and outer wall of the nose cone.","The nose cone defines a second portion of the passage that receives a probe of the catheter assembly therethrough.","In aspects, the positioning of the catheter assembly within the first half of the first portion of the passage that is defined within the first half of the housing body includes position an adjustment nut within a nut recess defined in the housing body to adjust the length of the probe extending distally from the housing body.","The method may further include rotating the adjustment nut about a threaded portion of the catheter hub to fix the length of the probe that extends distally from the housing body.","Securing the second half of the housing body to the first half of the housing body may prevent adjustment of the length of the probe extending distally from the housing body during use of the surgical system.","In another aspect of the present disclosure, a support system includes a rail, a lower support, and an instrument support.","The rail has upper and lower ends that define a longitudinal axis therebetween.","The lower support is configured to receive a portion of a bronchoscope and to selectively fix the bronchoscope relative to the rail.","The instrument support is slidably disposed on the rail and is selectively lockable to the rail.","The instrument support is configured to releasably couple to a surgical instrument inserted through the bronchoscope to fix the position of a portion of the surgical instrument relative to the bronchoscope.","In aspects, the instrument support includes a clamp arm and a clamp arm collar.","The clamp arm collar may be slidably disposed over the rail.","The clamp arm may include instrument fingers that extend from the clamp arm collar.","The instrument fingers may define an instrument passage that is configured to releasably couple to the surgical instrument.","The instrument support may include a locking arm that has a locking cam.","The clamp arm collar may include a camming surface and the locking cam may be configured to compress the camming surface of the clamp arm collar against the rail when the locking arm is in the locked position to lock the instrument support to the rail.","In the locked position, the instrument support may be radially locked relative to the rail.","In some aspects, the lower support defines a rail opening that is configured to receive the lower end of the rail.","The support system may include a collar positioned within the rail opening that includes a threaded portion.","The support system may include a securement member that is threaded over the threaded portion of the collar to compress the collar over the lower end of the rail to fix the rail to the lower support.","In certain aspects, the lower support includes a pair of support fingers that extend orthogonally from the rail.","The support fingers may define a support opening therebetween.","The support fingers may be configured to compress the support opening about the bronchoscope to fix the lower support relative to the bronchoscope.","In another aspect of the present disclosure, a surgical system includes a bronchoscope, an extended working channel that extends through the bronchoscope, an elongated surgical instrument that is inserted through the extended working channel, and a support system for supporting the elongated surgical instrument relative to the bronchoscope.","The support system includes a rail, a lower support, and an instrument support.","The rail has upper and lower ends that define a longitudinal axis therebetween.","The lower support is fixed to the lower end of the rail and to the bronchoscope to fix the rail to the bronchoscope.","The instrument support is slidably disposed on the rail and is selectively lockable to the rail.","The instrument support is releasably coupled to a first portion of the elongated surgical instrument to fix the position of the first portion of the elongated surgical instrument relative to the bronchoscope.","In aspects, a second portion of the elongated surgical instrument is moveable relative to the bronchoscope.","The second portion of the elongated surgical instrument may be fixed to a proximal end of the extended working channel such that the extended working channel is moveable relative to the bronchoscope and the first portion of the elongated surgical instrument.","The first portion of the elongated surgical instrument includes an ablation probe that extends through the second portion of the elongated surgical instrument and the extended working channel.","In some aspects, the extended working channel includes a telescopic extended working channel handle that is fixed to the bronchoscope.","When the telescopic extended working channel handle is manipulated, the bronchoscope and the elongated surgical instrument that is fixed to the bronchoscope by the support system move in concert with the telescopic extended working channel handle.","In another aspect of the present disclosure, a method of positioning an elongated surgical instrument adjacent targeted tissue includes inserting the elongated surgical instrument into an extended working channel, securing a support system to the bronchoscope, coupling a portion of the elongated surgical instrument to the support system to fix the portion of the elongated surgical instrument to the bronchoscope, and manipulating a portion of the extended working channel such that the bronchoscope, the elongated surgical instrument, and the support system move in concert with the portion of the extended working channel.","The elongated surgical instrument may have a locatable guide adjacent a distal end thereof.","The extended working channel passes through a bronchoscope positioned in an airway of a patient.","In aspects, manipulating a portion of the extended working channel includes manipulating a telescopic extended working channel handle of the extended working channel that is connected to the bronchoscope.","In some aspects, securing the support system to the bronchoscope may include fixing a lower support of the support system to a portion of the bronchoscope.","Securing the support system to the bronchoscope may include inserting a lower end of a rail of the support system into the lower support.","In certain aspects, coupling a portion of the elongated surgical instrument to the support system includes coupling the portion of the elongated surgical instrument in an instrument support of the support system.","The method may include locking the instrument support to a rail of the support system to fix the portion of the elongated surgical instrument relative to the bronchoscope.","Further, to the extent consistent, any of the aspects described herein may be used in conjunction with any or all of the other aspects described herein.","BRIEF DESCRIPTION OF THE DRAWINGS Various aspects of the present disclosure are described hereinbelow with reference to the drawings, which are incorporated in and constitute a part of this specification, wherein: FIG.","1 is a perspective view of an exemplary surgical system including a retraction handle and a rail system in accordance with the present disclosure; FIG.","2 is a perspective view of the retraction handle of FIG.","1; FIG.","3 is an exploded perspective view showing the components of the retraction handle of FIG.","1; FIG.","3A is a cross-sectional view taken along the section line 3A-3A shown in FIG.","3; FIG.","4 is a longitudinal cross-sectional view of the retraction handle of FIG.","1 taken along the longitudinal axis thereof; FIG.","5 is an enlarged view of the indicated area of detail of FIG.","4; FIG.","6 is a longitudinal cross-sectional view of the retraction handle with the retraction control in a second position and the nose cone in an extended position; FIG.","7 is an enlarged view of the indicated area of detail of FIG.","6; FIG.","8 is a longitudinal cross-sectional view of the retraction handle with the retraction control in the second position and the nose cone in the retracted position; FIG.","9 is an enlarged view of the indicated area of detail of FIG.","8; FIG.","10 is a longitudinal cross-sectional view of the retraction handle with the retraction control in the first position and the nose cone in the retracted position; FIG.","11 is an enlarged view of the indicated area of detail of FIG.","10; FIG.","12 is a perspective view of a distal end of the catheter of FIG.","2; FIG.","13 is a perspective view of the distal end of the catheter of FIG.","12 when the retraction handle is in the retracted position; FIG.","14 is an enlarged view of the indicated area of detail of FIG.","1; FIG.","15 is a side cross-sectional view of taken along the section line 15-15 of FIG.","14; FIG.","16 is an enlarged view of the indicated area of detail of FIG.","1; FIG.","17 is a top view of a device support taken along the line 17-17 FIG.","16 illustrating a locking arm in an unlocked position; FIG.","18 is a top view of a device support taken along the line 18-18 of FIG.","16 illustrating a locking arm in a locked position; FIG.","19 is a perspective view of the surgical system of FIG.","1 in use with an electromagnetic navigation system 400 provided in accordance with the present disclosure; FIGS.","20A-20C are side views of distal ends of instruments that may be used with the surgical system of FIG.","1 FIG.","21 is a perspective view of another rail system provided in accordance with the present disclosure; FIG.","22 is an enlarge perspective view of the area of detail indicated in FIG.","21; FIG.","23 is a cross-sectional view taken along the section line 23-23 of FIG.","22; FIG.","24 is a perspective view of the lower support of FIG.","22 with the support arm in an open configuration positioned about a portion of a bronchoscope; FIG.","25 is a perspective view of the lower support of FIG.","24 with the portion of the bronchoscope removed; FIG.","26 is a cross-sectional view taken along the section line 26-26 of FIG.","21 illustrating the instrument support in an unlocked configuration; FIG.","27 is a cross-sectional view of the instrument support of FIG.","27 in a locked configuration; and FIG.","28 is a perspective view of the rail system of FIG.","21 with another instrument support provided in accordance with the present disclosure.","DETAILED DESCRIPTION According to aspects of the present disclosure, a support system mounts to a bronchoscope to support instruments inserted through and associated with the bronchoscope.","In one embodiment, the support system is configured to separately support a retraction handle and a catheter inserted through the retraction handle and the bronchoscope.","The retraction handle is coupled to an extended working channel that passes through the bronchoscope and into the anatomy of a patient.","The catheter is inserted through the extended working channel to a position adjacent targeted tissue.","When the catheter is positioned adjacent the targeted tissue, the retraction handle is moved to a retracted position to expose the distal end of the catheter adjacent the targeted tissue such that the catheter can treat the targeted tissue.","The retraction handle may be moved to the retracted position with one hand of a clinician as detailed herein.","Embodiments of the present disclosure are now described in detail with reference to the drawings in which like reference numerals designate identical or corresponding elements in each of the several views.","As used herein, the term “clinician” refers to a doctor, a nurse, or any other care provider and may include support personnel.","Throughout this description, the term “proximal” refers to the portion of the device or component thereof that is closest to the clinician and the term “distal” refers to the portion of the device or component thereof that is farthest from the clinician.","Referring now to FIG.","1, a surgical system 10 includes a bronchoscope 11, a telescopic extended working channel (EWC) handle 15, an ablation catheter assembly 100, including a cable 18, a probe 19, a retraction handle 20, and a connector 21 for connection to an energy source such as a microwave generator (not shown).","A portion 18a of the cable 18 may extend from the connector 21 to a coolant source (not shown) for providing a cooling fluid to the ablation catheter assembly 100.FIG.","1 also depicts a rail system 300 including a support rail 312 supported on the bronchoscope 11 by a lower support member 320 and includes a device support 330 that supports the retraction handle 20 as detailed below.","The support rail 312 may include an additional a device support 330 that supports the cable 18 above the retraction handle 20.The rail system 300 is disclosed in greater detail below.","The telescopic EWC handle 15 connects to the bronchoscope 11 and is in communication with an EWC 96, formed internally therein, such that instruments passed through the telescopic EWC handle 15 pass through the EWC 96.The proximal end 16 of the telescopic EWC handle 15 includes a mating feature that is engaged by the retraction handle 20.The retraction handle 20 mates with the proximal end 16 of the telescopic EWC handle 15 (FIG.","1) enabling movement of the EWC 96 relative to the ablation probe 19, as described below.","The retraction handle 20 may include an engagement feature 27 (FIG.","2) for engaging the mating feature of the proximal end 16 of the telescopic EWC handle 15.The engagement feature 27 may be a clip that is received within an opening defined in the proximal end 16 of the telescopic EWC handle 15.With reference to FIGS.","2 and 3, the ablation catheter assembly 100 includes an ablation probe 19 and a catheter hub 180 positioned within a through passage 23 (FIG.","4) formed in the retraction handle 20.The ablation probe 19 extends distally from the catheter hub 180, through the telescopic EWC handle 15 (FIG.","1) and the EWC 96 formed internal therein, and to a distal end 96a (FIGS.","12 and 13) of the EWC 96.The catheter hub 180 includes coolant channels 183 and a connector 186 enabling electrical connection of cable 18 with an antenna 187, described below.","One of the coolant channels 183a is an inflow channel and the other coolant channel 183b is an outflow channel.","The coolant channels 183a, 183b, the connector 186, and the antenna 187 are coupled together within the catheter hub 180 into the ablation probe 19.With particular reference to FIG.","3A, the ablation probe 19 includes a microwave antenna 82 electrically connected to cable 18 and sized be received within an outer sheath 84 of the ablation probe 19.An inner sheath 86 is formed within the outer sheath 84 and surrounds the microwave antenna 82, the inner sheath 86 separates the interior of the ablation probe 19 into inflow and outflow coolant paths 83a and 83b such that coolant flows through the inflow channel 183a, along the microwave antenna 82 in the inflow coolant path 83a to a distal end of the ablation probe 19, and returns via the outflow coolant path 83b separating the inner sheath 86 from the outer sheath 84 to the outflow channel 183b.","In this manner the ablation probe 19, and more particularly the microwave antenna 82, is actively cooled.","Examples of microwave antenna construction may be found in commonly assigned U.S. patent application Ser.","No.","13/835,283 entitled “Microwave Energy-Device and System,” and Ser.","No.","13/836,519 entitled “Microwave Ablation Catheter and Method of Utilizing Same,” the entire contents of each is incorporated herein by reference.","Referring back to FIG.","3, the catheter hub 180 includes a threaded portion 189 adjacent a distal end thereof.","The threaded portion 189 receives an adjustment nut 182 that adjusts the length of the ablation probe 19 extending from the retraction handle 20.The adjustment nut 182 may be used by the manufacturer of the retraction handle 20 to finely adjust the length of the ablation probe 19 extending from the retraction handle 20 when the retraction handle 20 is assembled over the cable 18.Such an adjustment mechanism may allow the manufacturer to employ increased tolerances in the length of the ablation probe 19 during manufacture and to finely adjust the length of the ablation probe 19 during assembly.","It will be appreciated that once the retraction handle 20 is assembled over the catheter hub 180, the adjustment nut 182 is not accessible by a clinician using the retraction handle 20 (i.e., once the length of the ablation probe 19 is set during assembly, the length of the ablation probe is fixed).","With additional reference to FIG.","4, the retraction handle 20 includes a nose cone 22, a retraction control 24, a sleeve 124 (FIG.","3), a handle body 26, a spindle cap 28, and a locking mechanism 30.The components of the retraction handle 20 (e.g., the nose cone 22, the retraction control 24, the handle body 26, and the spindle cap 28) may be rotatable relative to one another to allow the components to rotate without applying a rotational force to the cable 18 or the EWC 96.The handle body 26 includes first and second body sections 131, 132 (FIG.","3) that are secured together to define a second portion 23b (FIG.","4) of the through passage 23 therethrough.","As shown in FIG.","3, the distal end of the handle body 26 defines a ring groove 133 in an outer surface thereof that receives a ring 134 that secures the first and second body sections 131, 132 together.","The distal end of the handle body 26 is received in the first portion 23a of the through passage 23 defined by the nose cone 22.The second portion 23b of the through passage 23 defined by the handle body 26 includes a nut recess 135 that is positioned adjacent a distal end thereof and a cable recess 136 that is positioned adjacent a proximal end thereof.","The outer surface of the handle body 26 includes mating tabs 137 positioned at a proximal end thereof.","The spindle cap 28 is disposed over the proximal end of the handle body 26 and includes retention tabs 29 that engage the mating tabs 137 of the handle body to secure the spindle cap 28 to the handle body 26 and to secure the proximal end of the first and second body sections 131, 132 together.","Referring to FIGS.","4 and 5, the nose cone 22 defines an outer wall 122 and receives a sleeve 124.The sleeve 124 defines a first portion 23a of a through passage 23 that receives the handle body 26 and a portion of the probe 19 therewithin.","The outer wall 122 of nose cone 22 and the sleeve 124 define a control channel 123 therebetween that slidably receives the retraction control 24.The distal end of the control channel 123 includes a control stop 125 that may limit the proximal displacement of the retraction control 24 relative to the nose cone 22.The sleeve 124 includes a first opening 126 and a second opening 128 positioned distal to the first opening 126.The sleeve 124 may optionally define a slot 127 in communication with the first and second openings 126, 128 parallel to the longitudinal axis.","The sleeve 124 includes a retention ring 129a disposed about the inner wall 124 adjacent a proximal end thereof that prevents the retention control 24 from disengaging the sleeve 124 of (i.e., sliding proximally off of the sleeve 124).","The sleeve 124 is formed separately from the nose cone 22 and joined thereto by a distal retention ring 129b.","It is also within the scope of this disclosure that the sleeve 124 may be integrally formed with the nose cone 22.The retraction control 24 includes a proximal flange 141 and a distal finger 145 extending therefrom.","The proximal flange 141 includes an inner angled surface 142 and a shoulder 143.The distal finger 145 includes a ramped surface 146 adjacent the inner wall 124 of the nose cone 22.The distal finger 145 is positioned over the inner wall 124 of the nose cone 22 such that the distal finger 145 is disposed substantially between the sleeve 124 and the outer wall 122 of the nose cone 22.Referring in particular to FIG.","4, a locking mechanism 30 selectively locks the nose cone 22 in each of an extended position and a retracted position as detailed below.","The outer surface of the handle body 26 defines pin slots 138 positioned adjacent a distal end thereof which may be positioned proximal to the nut recess 135.The locking mechanism 30 includes a locking pin 32 disposed within each of the pin slots 138 and a pin biasing member 37 supported within each of the pin slots 138 between a respective locking pin 32 and the housing body 26.Each locking pin 32 includes a shaft 33, a retention plate 34, and a locking surface 35 and is disposed substantially within a respective pin slot 138.The shaft 33 may pass through the pin biasing member 37.Each pin biasing member 37 engages the retention plate 34 of a respective locking pin 32 to urge the respective locking pin 32 out of pin slot 138.The locking pins 32 are moveable between a locked position and an unlocked position.","In the locked position, the locking surface 35 of the locking pin 32 protrudes from the pin slot 138 and through one of the first and second openings 126, 128 of the sleeve 124.In the locked position, the retention plate 34 engages the inner surface of the sleeve 124 adjacent one of the first and second openings 126, 128 to prevent the locking pin 32 from passing entirely through the first or second openings 126, 128.In the unlocked position, the locking pin 32 is moved towards the longitudinal axis of the handle 20 against the pin biasing member 37 such that the locking surface 35 of the locking pin 32 is deflected within the inner surface of the sleeve 124.In the unlocked position (FIG.","6), the locking surface 35 of the locking pin 32 is engaged by the inner surface of sleeve 124 between the first and second openings 126, 128.When the locking pins 32 are in the locked position and positioned to protruded through the first openings 126 (FIGS.","4 and 5), the nose cone 22 is in the extended position.","When the locking pins 32 are in the locked position and positioned to protrude through the second openings 128 (FIGS.","7 and 8), the nose cone 22 is in the retracted position.","The retraction control 24 engages the locking surface 35 of the locking pins 32 to move the locking pins 32 from the locked position to the unlocked position to permit the nose cone 22 to move between the extended and retracted positions as detailed below.","Referring to FIGS.","4-9, the retraction control 24 moves the nose cone 22 along the longitudinal axis from an extended position (FIG.","4) to a retracted position (FIG.","8).","It will be appreciated that the extended and retracted positions refer to the location of the distal end 96a of the EWC 96 relative to the distal end 19a of the probe 19 as shown in FIGS.","12 and 13.In FIGS.","4 and 12, the EWC 96 is extended beyond the distal end 19a of the probe 19, and in FIGS.","5 and 13 the EWC 96 is retracted, exposing the distal end 19a of probe 19.In part this orientation of movement is necessary when, as shown in FIG.","1, the housing body 26 of handle 20 is secured to the rail system 300 by device supports 330.The retraction control 24 has a first position (FIG.","4) relative to the nose cone 22 such that the retraction control 24 (i.e., the distal finger 145) is positioned over the second openings 128 formed in the sleeve 124 leaving the first openings 126 unobstructed and a second position (FIG.","6) relative to the nose cone 22 such that the retraction control 24 (i.e., the proximal flange 141) is positioned proximal to the first openings 126 leaving the second openings 128 unobstructed.","Initially referring to FIGS.","4 and 5, the nose cone 22 is in the extended position, the retraction control 24 in a first position relative to the nose cone 22, and the locking pins 32 are in the locked position within the first openings 126.Referring now to FIGS.","6 and 7, the nose cone 22 remains in the extended position and the retraction control 24 is moved to the second position relative to the nose cone 22 that is proximal to the first position.","As the retraction control 24 is moved to the second position, the inner angled surface 142 of the proximal flange 141 engages the locking surface 35 of the locking pins 32 to move the locking pins 32 from the locked position to the unlocked position.","When the locking pins 32 are in the unlocked position, the nose cone 22 is free to move towards the retracted position (FIG.","8).","With reference to FIGS.","8 and 9, additional retraction of the retraction control 24 stops when the inner angled surface 142 of the retraction control 24 engages retention ring 129a fixed to the inner wall 124 stopping the movement of the nose cone 22 proximally over the housing body 26.As the nose cone 22 is retracted, the retraction control 24 remains in the second position relative to the nose cone 22 and the locking surface 35 of the locking pins 32 slide along the inner surface of the sleeve 124 between the first and second openings 126, 128.When the nose cone 22 reaches the retracted position (FIG.","8), the locking surface 35 of the locking pins 32, being urged by the pin biasing members 37, extend through the second openings 128 such that the locking pins 32 are in the locked position to fix the nose cone 22 in the retracted position.","Now with reference to FIGS.","4, 5, and 8-11, the movement of the nose cone 22 from the retracted position (FIG.","8) to the extended position (FIG.","4) will be described in accordance with the present disclosure.","Referring initially to FIGS.","8 and 9, the nose cone 22 is in the retracted position, the retraction control 24 is in the second position, and the locking pins 32 are disposed in the locked position within the second openings 128 formed in the sleeve 124.With particular reference to FIGS.","10 and 11, the nose cone 22 remains in the retracted position as the retraction control 24 is moved to the first position relative to the nose cone 22 to unlock the locking pins 32.When the retraction control 24 is moved from the second position to the first position, the ramp 146 of the distal finger 145 engages the locking surface 35 of the locking pins 32 to move the locking pins 32 against the pin biasing member 37 and towards the unlocked position.","The distal finger 145 engages the control stop 125 to limit the distal translation of the retraction control 24 relative to the nose cone 22.Additionally or alternatively, the shoulder 143 of the proximal flange 141 may engage the proximal end of the outer wall 122 to limit the distal translation of the retraction control 24 relative to the nose cone 22.Referring back to FIGS.","4 and 5, continued distal movement of the retraction control 24 moves the nose cone 22 distally relative to the housing body 26 to move the nose cone 22 to the extended position.","The distal finger 145 may engage the control stop 125 or the shoulder 143 of the proximal flange 141 may engage the proximal end of the outer wall 122 to move the nose cone 22 to the extended position.","As the nose cone 22 is extended, the retraction control 24 remains in the first position relative to the nose cone 22 and the locking surface 35 of the locking pins 32 slide along the inner surface of the sleeve 124 between the first and second openings 126, 128.When the nose cone 22 reaches the extended position, the locking surface 35 of the locking pins 32, being urged by the pin biasing members 37, extend through the first openings 126 such that the locking pins 32 are in the locked position to fix the nose cone 22 in the extended position.","With reference to FIGS.","1 and 14-18, the rail system 300 mounts to a bronchoscope (e.g., bronchoscope 11) to support instruments inserted through and associated with the bronchoscope (e.g., ablation catheter assembly 100).","The rail system 300 is configured to separately support each instrument inserted through the bronchoscope and associated cabling, where necessary.","While the rail system 300 detailed herein is described for use with a bronchoscope and associated instruments, it is contemplated that the support system may be used with other devices and associated instruments.","Referring now to FIGS.","1, 14, and 15, the rail system 300 includes a rail 312, a lower support 320, and a device support 330.The lower support 320 includes a support body 322 that mounts to a bronchoscope 11 to support the rail 312.The rail 312 has a lower end 316 and an upper end 318 and defines a longitudinal axis therebetween.","The support body 322 includes support fingers 324 and defines a rail opening 327 that is sized and configured to receive the lower end 314 of the rail 312.The support fingers 324 extend from the rail opening 327 in a direction orthogonal to the rail opening 327 and around a portion of the bronchoscope 11.The support fingers 324 define a support opening 323 therebetween that mates with the portion of the bronchoscope 11.Each support finger 324 defines a through locking hole 325 aligned with the locking hole of the other finger 324.A locking member 326 is inserted through the locking holes 325 to compress the support opening 323 about the portion of the bronchoscope 11 which secures the support body 322 to the bronchoscope 11.It is contemplated that the support opening 323 may compress about the telescopic EWC handle 15.With reference to FIGS.","14 and 15, a collar 316 is disposed over the lower end 314 of the rail 312 and within the rail opening 327.The rail opening 327 and the collar 316 may be threadably coupled to one another.","A thread portion of the collar 316 extends from the rail opening 327.A securement member 317 is threaded over the threaded portion of the collar 316 extending from the rail opening 327.The securement member 317 radially compresses the collar 316 against the rail 312 to secure the rail 312 within the rail opening 317.It is also contemplated that the distal end 314 of the rail 312 may be threaded and configured to thread directly into the lower support 320 without the collar 316.In such embodiments, the securement member 317 may be a lock nut to The rail 312 extends vertically from the lower support 320 towards the upper end 318.The rail 312 may be fully supported by the lower support 320 or a support (not shown) may be releasably coupled adjacent the upper end 318 to provide additional support to the rail 312.The rail 312 may be constructed of any suitable material including, but not limited to, surgical steel, fiberglass, and plastic.","Referring to FIGS.","16-18, one or more device supports 330 are positioned along the rail 312 and configured to support instruments (e.g., handle 20, cable 18 of ablation catheter 100) inserted through the bronchoscope 11.The device support 330 includes a clamp arm 331 having a clamp arm collar 332, which defines a rail passage 333 therethrough.","The clamp arm collar 332 is sized and configured to slide over the rail 312 in an unlocked configuration and to engage the rail 312 in a locked configuration to fix the device support 330 in position along the rail 312.In the unlocked configuration the rail passage 333 is sized and configured to freely slide over the rail 312 and in the locked configuration the rail passage 333 is sized and configured to engage the rail 312.In the locked configuration, the device support 330 may be longitudinally and/or radially fixed to the rail 312.The device support 330 includes instrument fingers 334 extending from the clamp arm collar 332 in a direction orthogonal to the longitudinal axis of the rail 312.The instrument fingers 334 define an instrument passage 335 therebetween that is sized and configured to releasably couple to and to support an instrument (e.g., handle 20, ablation catheter assembly 18).","The device support 330 further includes a locking arm 336 that transitions the clamp arm collar 332 between the locked and unlocked configurations.","The locking arm 336 includes a locking arm collar 337 that is disposed over a portion of the clamp arm collar 332 and includes a locking cam 338.The locking cam 338 extends from the locking arm collar 337 substantially parallel to the longitudinal axis of the rail 312 and towards the clamp arm 331.A portion of the clamp arm collar 332 includes a radial camming surface 339.The camming surface 339 forms a radial ramp such that as the locking arm 336 is rotated from an unlocked position (FIG.","17) towards a locked position (FIG.","18), the locking cam 338 engages the camming surface 339 to compress the clamp arm collar 332 towards the locked position.","The locking cam 337 may engage the clamp arm 331 in one of the locked or unlocked positions of the locking arm 336 to prevent the locking arm 36 from excessive rotation about the clamp arm collar 332 and to provide indicia (e.g., tactile, visual, or audible indicia) that the device support 330 is in the locked or unlocked position.","In embodiments, the locking arm collar 337 may include two locking cams 338 radially disposed about the locking arm collar 337 about 180° apart as shown in FIGS.","17 and 18.One of the locking cams 337 may engage the clamp arm 331 in the locked configuration and the other of the locking cams may engage the clamp arm 331 in the unlocked configuration to prevent the locking arm 336 from excessive rotation about the clamp arm collar 332 and to provide indicia (e.g., tactile, visual, or audible indicia) that the device support 330 is in the locked and unlocked configuration.","In use, the support fingers 324 of the lower support are slid over a portion of the bronchoscope 11 such that the portion of the bronchoscope 11 is positioned within the opening 323.A locking member 326 is inserted through the locking holes 325 of the support fingers 324 and tightened to lock the lower support 320 to the bronchoscope 11.The lower end 314 of the rail 312 is inserted into the rail opening 327 defined in the lower support 320.The lower end 314 may be inserted into the collar 316 disposed within the rail opening 327.The securement member 317 is tightened over the threaded portion of the collar 316 to secure the rail 312 to the lower support 320.The upper end 318 of the rail 312 may be coupled to a support (not shown) to provide additional support to the bronchoscope 11.It is contemplated that the support may be a support stand supported on from the floor, a support hanging from a ceiling, or a support extending from a wall.","A catheter (e.g., ablation catheter assembly 100) is then inserted through the telescopic EWC handle 15 and the EWC 96.A proximal end of the ablation catheter assembly 100 may include a catheter collar (not shown) positioned on the outer surface of the cable 18 for engagement with a device support 330 or the device support 330 may clamp directly to an outer surface of the cable 18, as shown.","A first device support 330 is positioned along the rail 312 such that the instrument passage 335 of the first device support 330 is adjacent a portion of ablation catheter assembly 100 (e.g., the catheter collar or the cable 18).","The portion of the ablation catheter assembly 100 is then coupled to the clamp arm 332 by urging the portion of ablation catheter assembly 100 into the instrument passage 335.The first device support 330 is then locked in position on the rail 312 by moving the lock arm 336 of the first device support 330 to the locked position.","When the portion of the ablation catheter assembly 100 is secured within the instrument passage 335 with the device support 330 in the locked configuration, the portion of the ablation catheter assembly 100 is supported by the first device support 330.It is contemplated that the first device support 330 may be locked prior to urging the portion of the ablation catheter assembly 100 into the instrument passage 435.With reference to FIG.","19, an electromagnetic navigation (EMN) system 400 is provided in accordance with the present disclosure.","FIG.","19 also depicts the ablation catheter assembly 100, the cable 18 (which connects on one end to a microwave generator (not shown) and on the other end to) the handle 20, and the rail system 300 of FIG.","1 for use with the EMN system 400.One such EMN system is the ELECTROMAGNETIC NAVIGATION BRONCHOSCOPY® system currently sold by Covidien LP.","Among other tasks that may be performed using the EMN system 400 are planning a pathway to target tissue, navigating a catheter guide assembly to the target tissue, deploying an instrument adjacent or into the target tissue to treat or capture the target tissue, digitally marking the location of the target tissue in a data file related to the planned pathway, and placing one or more echogenic markers at or around the target tissue.","The EMN system 400 generally includes an operating table 410 configured to support a patient; the bronchoscope 11 configured for insertion through the patient's mouth and/or nose into the patient's airways; a tracking system 470 including a tracking module 472, a plurality of reference sensors 474, and an electromagnetic field generator 476; and a workstation 480 including software and/or hardware used to facilitate pathway planning, identification of target tissue, navigation to target tissue, and digitally marking the biopsy location.","Before an ablation procedure can be performed, a locatable guide (LG) catheter 492, including an electromagnetic (EM) sensor 494, is inserted into the telescopic handle 15, and connected to rail system 300.Upon insertion into the telescopic EWC handle 15, the LG catheter 492 enters the EWC 96 and is locked into position such that the sensor 494 is positioned slightly beyond the distal end 96a of the EWC 96 during placement of the EWC 96.The location of the EM sensor 494, and thus the distal end 96a of the EWC 96, within an electromagnetic field generated by the electromagnetic field generator 476 can be derived by the tracking module 472, and the workstation 480.During insertion and placement of the distal end 96a of the EWC 96, the telescopic EWC handle 15 and the LG catheter 492 inserted therein can be manipulated by rotation and compression to steer and position the LG catheter 492.An example of a similar catheter guide assembly is currently marketed and sold by Covidien LP under the name EDGE™ Procedure Kits.","For a more detailed description of the use of the catheter guide assembly reference is made to commonly-owned U.S.","Provisional Patent Application Ser.","No.","62/020,240 filed on Jul.","2, 2014 and entitled System and Method for Navigating within the Lung, the entire contents of which are hereby incorporated by reference.","Once the LG catheter 492 and EM Sensor 494 are navigated to a target within the patient, the LG catheter 492 is removed from the EWC 96, bronchoscope 11, and telescopic EWC handle 15, and an ablation catheter system 100 may be inserted to treat the tissue at the target.","When the EWC 96 is positioned, the bronchoscope 11 is held steady as the LG catheter 492 and the EM sensor 494 are withdrawn from the EWC 96 and the ablation catheter assembly 100 is inserted through the EWC 96 until the distal end 19a of the ablation probe 19 is adjacent the distal end of the EWC 96.In this configuration the ablation catheter assembly 100, handle 20, and rail system 300 have substantially the orientation depicted in FIG.","1.The handle 20 is then manipulated to retract and extend the EWC 96 as detailed above to permit the clinician to treat the target.","The ablation catheter assembly 100 is then withdrawn from the EWC 96 permitting additional instruments to be inserted through the EWC 96, the EWC 96 to be relocated to another target, or the EWC 96 to be removed from the airway of the patient.","In one embodiment, the EM sensor 494 may be disposed on a distal end 19a the ablation probe 19.During insertion and positioning of the ablation probe 19 and EM sensor 494, the handle 20 is in the extended position (FIG.","4) such that the distal end 19a of the ablation probe 19 is substantially within the EWC 96 as shown in FIG.","12.In addition, ablation probe 19 and the handle 20 may be secured to the bronchoscope 11 with the rail system 300, as detailed above, such that as a clinician manipulates the telescopic EWC handle 15, the ablation probe 19c and the handle 20 move in concert together with the telescopic EWC handle 15 permitting one-handed manipulation of the bronchoscope 11, the telescopic EWC handle 15, the ablation catheter assembly 18, and the handle 20.When the EM sensor 494 is positioned adjacent the target, the handle 20 is moved to the retracted position (FIG.","10) to retract the EWC 96 such that the distal end 19a of the ablation probe 19 is exposed as shown in FIG.","13.With the distal end 19a of the ablation probe 19 exposed, the ablation probe 19 may be activated to treat the target.","After the target is treated, the handle 20 is returned to the extended position such that the distal end 19a of the ablation probe 19 is substantially within the EWC 96 (FIG.","12).","The ablation catheter assembly 100 may then be removed from the EWC 96 leaving the distal end of the EWC 96 adjacent the target.","Additional instruments may then be passed through the EWC 96 to treat the target, the EWC 96 may be relocated to another target, or the EWC 96 may also be removed from the airway of the patient.","As described above, the rail system 300 and EMN system 400 may be used in combination with an LG catheter 492 or an ablation catheter 100.However, other instruments may also benefit from the rail system 300.Examples of additional instruments that may be inserted through the EWC 96 to treat and/or sample the target are shown in FIGS.","20A-20C, depicting biopsy forceps 670, a biopsy brush 675, and a biopsy needle 680.As shown in FIG.","20, each instrument includes an EM sensor 494 disposed thereon in accordance with the present disclosure, however, instruments without EM sensors 494 may also be employed without departing from the scope of the present disclosure.","A proximal end of the instruments 670, 675, 680 may include a handle 20 similar in construction to what is shown in FIGS.","1-11, enabling the retraction and extension of the EWC 96.Referring to FIGS.","21-27, another rail system 500 is provided in accordance with the present disclosure and includes a rail 512, a lower support 520, and a device support 530.The rail system 500 is similar in structure and function to the rail system 300 detailed above, as such only the differences will be detailed herein for reasons of brevity.","The lower support 520 includes a support body 522 that is coupled to a lower or distal end 514 of the rail 512 and defines a rail opening 529 (FIG.","23) that receives the lower end of the rail 512 therein.","The lower support 520 may include a collar 516 positioned in or adjacent to the rail opening 529 that engages an outer surface of the rail 512 to secure the lower support 520 to the rail 512.The support body 522 of the lower support 520 extends from the rail opening 529 to a support arm 524 that has a clamped configuration (FIGS.","22 and 23) and an open configuration (FIGS.","24 and 25).","The support arm 524 and the support body 522 define a support opening 523 that is configured to receive and clamp to a bronchoscope 11 (FIG.","1) using a bronchoscope adapter 511 to secure the lower support 520 to the bronchoscope 11.The bronchoscope adapter 511 may be threaded to a working channel port on the bronchoscope 11 as is known in the art.","The support arm 524 pivots about a pivot pin 528 to transition between the clamped and open configurations thereof.","The support arm 524 includes a clip 526 and the support body 522 defines a clip detent 525 (FIG.","25) that is configured to selectively receive the clip 526 to secure the support arm 524 in the clamped configuration.","The clip 526 may provide tactile feedback when the clip 526 is secured in the clip detent 525.The bronchoscope adapter 511 may include an annular ring 511a and the inner surface of the support opening 523 may define an annular groove 527 that is sized to receive the annular ring 511a to longitudinally fix the lower support 520 to the bronchoscope adapter 511 when the support arm 524 is in the clamped configuration.","It is contemplated that the cooperation of the annular ring 511a and the annular groove 527 may assist in aligning the lower support 520 with the bronchoscope 11 (FIG.","1).","It is also contemplated that the annular ring 511a and the annular groove 527 may only be defined along a portion of the support opening 23.In such embodiments, the cooperation of the annular ring 511a and the annular groove 527 may radially fix the lower support 520 to the bronchoscope adapter 511.With particular reference to FIGS.","26 and 27, the device support 530 includes a support collar 532 slidably disposed over the rail 512, instrument fingers 534 extending therefrom, and a locking mechanism 540 disposed therein.","The locking mechanism 540 includes a locking arm 541 having locking cams 542.The locking arm 541 is pivoted between an unlocked position (FIG.","26) and a locked position (FIG.","27) to actuate the locking mechanism 540 between an unlocked configuration and a locked configuration.","It will be appreciated that the locking arm 541 includes a passage that permits support collar 532 and the locking mechanism 540 to slide on the rail without engaging the rail 512 when the locking arm 541 is in the unlocked position.","As shown, the locking mechanism 540 has upper and lower mechanisms that are substantially similar to one another and function in concert with one another; however, it is contemplated the locking mechanism 540 may only include either the upper or lower mechanism or that the each of the upper and lower mechanisms may be independently actuated.","The locking mechanism 540 further includes an outer member 544 and an inner member 548 coaxially positioned with one another about the rail 512.The outer member 544 and the inner member 548 are moveable relative to one another between an unlocked position (FIG.","26) and a locked position (FIG.","27).","The outer member 544 may be biased towards the unlocked position by a biasing member 546.The outer member 544 includes a camming surface 549 that is engaged by the locking cam 542 of the locking arm 541.To fix the device support 530 to the rail 512, the locking arm 541 is pivoted from the unlocked position (FIG.","26) to a locked position (FIG.","27).","As the locking arm 541 is pivoted, the locking cams 542 cam the outer member 544 against the biasing member 546 and over the inner member 548 such that inner angled surfaces of the outer member 544 engage outer angled surfaces of the inner member 548 such that the inner member 548 is radially compressed into the rail 512 to engage the rail 512.It is contemplated that the inner member 548 may include teeth 548a that engage the rail 512 to fix the inner member 548 to the rail 512.The inner member 548 is coupled to the support collar 532 such that when the inner member 548 is fixed to the rail 512, the support collar 532 and thus the device support 530 is fixed to the rail 512.It is contemplated that the inner member 548 may be integrally formed with the support collar 532.As described above, the rail system 500 may include device support 530.However, other device supports may be used in combination with the rail system 500 which are configured to support a variety of instruments inserted through the EWC 96.For example, as shown in FIG.","28 an additional device support 550 is illustrated in use with rail system 500.The device support 550 includes a support collar 532 and instrument fingers 554 extending therefrom.","The instrument fingers 554 are substantially similar to the instrument fingers 354 detailed above with respect to device support 330.While the use of the handle 20 and the rail system 300, 500 are detailed herein for use in the airway of a patient, it is contemplated that the handle 20 and/or the rail system 300 may be used in a variety of surgical procedures utilizing elongated surgical instruments with extended working channels.","For example, the handle 20 and or rail system 300, 500 may be used to stabilize a guide wire or catheter during various endovascular procedures such as cardiac interventions, general vascular interventional procedures, cerebral interventions, etc.","These procedures may include, but are not limited to, balloon dilations, stent placements, percutaneous valve replacement, percutaneous valve repair, pacing lead placement, cardiac ablation procedures, and electrical mapping procedures.","While several embodiments of the disclosure have been shown in the drawings, it is not intended that the disclosure be limited thereto, as it is intended that the disclosure be as broad in scope as the art will allow and that the specification be read likewise.","Any combination of the above embodiments is also envisioned and is within the scope of the appended claims.","Therefore, the above description should not be construed as limiting, but merely as exemplifications of particular embodiments.","Those skilled in the art will envision other modifications within the scope and spirit of the claims appended hereto."]],"string":"[\n [\n \"MICROWAVE ABLATION CATHETER, HANDLE, AND SYSTEM\",\n \"A handle for longitudinal movement of a first tubular member over a second tubular member includes a handle body, a nose cone, a locking mechanism, and a retraction control.\",\n \"The nose cone has a sleeve and an outer wall that define a control channel therebetween.\",\n \"The nose cone is moveable over the handle body between extended and retracted positions.\",\n \"The locking mechanism has locked and unlocked positions for selectively fixing the nose cone in the extended and retracted positions.\",\n \"A finger of the retraction control is positioned within the control channel of the nose cone.\",\n \"The retraction control has first and second positions relative to the nose cone for transitioning the locking mechanism between the locked and unlocked position and for moving the nose cone between the extended and retracted positions.\"\n ],\n [\n \"1-20.\",\n \"(canceled) 21.A handle for longitudinal movement of a first tubular member over a second tubular member, the handle comprising: a handle body defining a slot; a nose cone movable over the handle body between an extended position and a retracted position; a locking pin disposed within and biased out of the slot of the handle body, the locking pin having a locked position in which the nose cone and the handle body are fixed relative to one another and an unlocked position in which the nose cone is movable over the handle body between the extended position and the retracted position.\",\n \"22.The handle according to claim 21, wherein the locking pin includes a retention plate that retains the locking pin within the slot.\",\n \"23.The handle according to claim 21, wherein the nose cone has a sleeve and an outer wall that define a control channel therebetween.\",\n \"24.The handle according to claim 23, wherein the sleeve of the nose cone defines first and second openings, wherein when the nose cone is in the extended position and the locking pin is in the locked position, the locking pin is disposed within the first opening, and wherein when the nose cone is in the retracted position and the locking pin is in the locked position, the locking pin is disposed within the second opening.\",\n \"25.The handle according to claim 21, further comprising a retraction control having a finger positioned within the nose cone, the retraction control having first and second positions relative to the nose cone, the retraction control configured to transition the locking pin between the locked and unlocked positions and to move the nose cone over the handle body between the extended and retracted positions.\",\n \"26.The handle according to claim 25, wherein when the nose cone is in the extended position and the retraction control is in the first position, the locking pin is in the locked position such that the nose cone is fixed in the extended position.\",\n \"27.The handle according to claim 25, wherein when the nose cone is in the extended position and the retraction control is in the second position, the locking mechanism is in the unlocked position such that the nose cone is movable over to the handle body.\",\n \"28.The handle according to claim 27, wherein when the nose cone reaches the retracted position, the locking pin transitions to the locked position to fix the nose cone in the retracted position.\",\n \"29.The handle according to claim 25, wherein when the nose cone is in the retracted position and the retraction control is in the second position, the locking pin is in the locked position such that the nose cone is fixed in the extended position.\",\n \"30.The handle according to claim 25, wherein when the nose cone is in the retracted position and the retraction control is in the first position, the locking pin is in the unlocked position such that the nose cone is movable relative to the handle body 31.The handle according to claim 30, wherein when the nose cone reaches the extended position, the locking pin transitions to the locked position to fix the nose cone in the extended position.\",\n \"32.The handle according to claim 25, wherein the second position of the retraction control is proximal to the first position of the retraction control.\",\n \"33.A handle for longitudinal movement of a first tubular member over a second member, the handle comprising: a housing body defining a proximal portion of a through passage of the handle and a nut recess; and an adjustment nut received within the nut recess which longitudinally fixes the adjustment nut relative to the housing body, the adjustment nut being configured to longitudinally fix the second member relative to the housing body.\",\n \"34.The handle according to claim 33, wherein the adjustment nut is configured to adjust a length of the second member extending from the housing body.\",\n \"35.The handle according to claim 34, wherein the adjustment nut includes threads that are configured to cooperate with threads of the second member to allow fine adjustment of a length of the second member extending from the housing body.\",\n \"36.The handle according to claim 33, further comprising a nose cone defining a distal portion of the through passage which is in communication with the proximal portion of the through passage, the nose cone longitudinally movable over the housing body between an extended position and a retracted position.\",\n \"37.The handle according to claim 36, wherein the nose cone is configured to move the first tubular member which is coupled to the nose cone over to the second member fixed to the housing body.\"\n ],\n [\n \" BACKGROUND \"\n ],\n [\n \" SUMMARY In an aspect of the present disclosure, a handle for longitudinal movement of a first tubular member over a second tubular member includes a handle body, a nose cone, a locking mechanism, and a retraction control.\",\n \"The nose cone has a sleeve and an outer wall defining a control channel therebetween.\",\n \"The nose cone is moveable over the handle body between extended and retracted positions.\",\n \"The locking mechanism has locked and unlocked positions for selectively fixing the nose cone in the extended and retracted positions.\",\n \"The retraction control includes a finger positioned within the control channel of the nose cone and has first and second positions relative to the nose cone for transitioning the locking mechanism between the locked and unlocked positions and for moving the nose cone between the extended and retracted positions.\",\n \"In aspects, when the nose cone is in the extended position and the retraction control is in the first position, the locking mechanism is in the locked position to fix the nose cone in the extended position.\",\n \"In some aspects, when the nose cone is in the extended position and the retraction control is in the second position, the locking mechanism is in the unlocked position such that the nose cone is moveable relative to the handle body.\",\n \"When the nose cone reaches the retracted position, the locking mechanism transitions to the locked position to fix the nose cone in the retracted position.\",\n \"In certain aspects, when the nose cone is in the retracted position and the retraction control is in the second position, the locking mechanism is in the locked position to fix the nose cone in the extended position.\",\n \"In particular aspects, when the nose cone is in the retracted position and the retraction control is in the first position, the locking mechanism is in the unlocked position such that the nose cone is moveable relative to the handle body.\",\n \"When the nose cone reaches the extended position, the locking mechanism may transition to the locked position to fix the nose cone in the extended position.\",\n \"In aspects, the second position of the retraction control is proximal to the first position of the retraction control.\",\n \"The locking mechanism may be disposed within a slot defined in the housing body.\",\n \"The locking mechanism may include a locking pin that has a retention plate.\",\n \"The locking pin may be biased out of the slot defined in the housing body such that the retention plate retains the locking pin within the slot.\",\n \"The sleeve of the nose cone may define first and second openings such that when the nose cone is in the extended position and the locking pin is in the locked position, the locking pin is disposed within the first opening.\",\n \"In addition, when the nose cone is in the retracted position and the locking pin is in the locked position, the locking pin may be disposed within the second opening.\",\n \"In another aspect of the present disclosure, a surgical system includes an extended working channel having proximal and distal ends, a handle defining a through passage, a retraction control, and a catheter assembly disposed within the through passage of the handle.\",\n \"The handle includes a housing body defining a proximal portion of the through passage, a nose cone coupled to the proximal end of the extended working channel, a locking mechanism, and a retraction control.\",\n \"The nose cone has a sleeve and an outer wall defining a control channel therebetween.\",\n \"The nose cone defines a distal portion of the through passage in communication with the extended working channel.\",\n \"The nose cone is longitudinally moveable over the housing body between extended and retracted positions.\",\n \"The locking mechanism has locked and unlocked positions for selectively fixing the nose cone in the extended and retracted positions.\",\n \"The retraction control includes a finger positioned within the control channel of the nose cone.\",\n \"The retraction control has first and second positions relative to the nose cone for transitioning the locking mechanism between the locked and unlocked positions and for moving the nose cone between the extended and retracted positions.\",\n \"The catheter assembly includes a catheter hub positioned within the proximal portion of the through passage and an ablation probe extending from the catheter hub through the nose cone of the handle and through the extended working channel.\",\n \"The ablation probe has a distal end that is disposed within the extended working channel when the handle is in the extend position and that is position positioned distal to the distal end of the extended working channel when the handle is in the retracted position.\",\n \"In aspects, the catheter hub combines coolant tubes and an antenna into the ablation probe.\",\n \"The catheter hub may include an adjustment nut that is positioned over an outer surface of the catheter hub.\",\n \"The housing portion may define a nut recess for receiving the adjustment nut to longitudinally fix the ablation probe to the housing portion.\",\n \"The adjustment nut is threaded to cooperate with threads on the outer surface of the catheter hub to allow fine adjustment of the length of the ablation probe relative to the housing portion.\",\n \"The distal end of the ablation probe may be positioned within the distal end of the extended working channel when the nose cone is in the extended position.\",\n \"The distal end of the ablation probe may be positioned distal to the distal end of the extended working channel when the nose cone is in the retracted position.\",\n \"In another aspect of the present disclosure, a method of assembly of a surgical system includes positioning a catheter assembly within a half of a first portion of a passage defined within a first half of a housing body of a handle, securing a second half of the housing body of the handle to the first half of the housing body with the catheter assembly that is positioned in a half of the first portion of the passage defined within the second half of the housing body to form the housing body, sliding a nose cone of the handle over a distal portion of the housing body, and inserting a finger of a retraction control within a control channel defined between a sleeve and outer wall of the nose cone.\",\n \"The nose cone defines a second portion of the passage that receives a probe of the catheter assembly therethrough.\",\n \"In aspects, the positioning of the catheter assembly within the first half of the first portion of the passage that is defined within the first half of the housing body includes position an adjustment nut within a nut recess defined in the housing body to adjust the length of the probe extending distally from the housing body.\",\n \"The method may further include rotating the adjustment nut about a threaded portion of the catheter hub to fix the length of the probe that extends distally from the housing body.\",\n \"Securing the second half of the housing body to the first half of the housing body may prevent adjustment of the length of the probe extending distally from the housing body during use of the surgical system.\",\n \"In another aspect of the present disclosure, a support system includes a rail, a lower support, and an instrument support.\",\n \"The rail has upper and lower ends that define a longitudinal axis therebetween.\",\n \"The lower support is configured to receive a portion of a bronchoscope and to selectively fix the bronchoscope relative to the rail.\",\n \"The instrument support is slidably disposed on the rail and is selectively lockable to the rail.\",\n \"The instrument support is configured to releasably couple to a surgical instrument inserted through the bronchoscope to fix the position of a portion of the surgical instrument relative to the bronchoscope.\",\n \"In aspects, the instrument support includes a clamp arm and a clamp arm collar.\",\n \"The clamp arm collar may be slidably disposed over the rail.\",\n \"The clamp arm may include instrument fingers that extend from the clamp arm collar.\",\n \"The instrument fingers may define an instrument passage that is configured to releasably couple to the surgical instrument.\",\n \"The instrument support may include a locking arm that has a locking cam.\",\n \"The clamp arm collar may include a camming surface and the locking cam may be configured to compress the camming surface of the clamp arm collar against the rail when the locking arm is in the locked position to lock the instrument support to the rail.\",\n \"In the locked position, the instrument support may be radially locked relative to the rail.\",\n \"In some aspects, the lower support defines a rail opening that is configured to receive the lower end of the rail.\",\n \"The support system may include a collar positioned within the rail opening that includes a threaded portion.\",\n \"The support system may include a securement member that is threaded over the threaded portion of the collar to compress the collar over the lower end of the rail to fix the rail to the lower support.\",\n \"In certain aspects, the lower support includes a pair of support fingers that extend orthogonally from the rail.\",\n \"The support fingers may define a support opening therebetween.\",\n \"The support fingers may be configured to compress the support opening about the bronchoscope to fix the lower support relative to the bronchoscope.\",\n \"In another aspect of the present disclosure, a surgical system includes a bronchoscope, an extended working channel that extends through the bronchoscope, an elongated surgical instrument that is inserted through the extended working channel, and a support system for supporting the elongated surgical instrument relative to the bronchoscope.\",\n \"The support system includes a rail, a lower support, and an instrument support.\",\n \"The rail has upper and lower ends that define a longitudinal axis therebetween.\",\n \"The lower support is fixed to the lower end of the rail and to the bronchoscope to fix the rail to the bronchoscope.\",\n \"The instrument support is slidably disposed on the rail and is selectively lockable to the rail.\",\n \"The instrument support is releasably coupled to a first portion of the elongated surgical instrument to fix the position of the first portion of the elongated surgical instrument relative to the bronchoscope.\",\n \"In aspects, a second portion of the elongated surgical instrument is moveable relative to the bronchoscope.\",\n \"The second portion of the elongated surgical instrument may be fixed to a proximal end of the extended working channel such that the extended working channel is moveable relative to the bronchoscope and the first portion of the elongated surgical instrument.\",\n \"The first portion of the elongated surgical instrument includes an ablation probe that extends through the second portion of the elongated surgical instrument and the extended working channel.\",\n \"In some aspects, the extended working channel includes a telescopic extended working channel handle that is fixed to the bronchoscope.\",\n \"When the telescopic extended working channel handle is manipulated, the bronchoscope and the elongated surgical instrument that is fixed to the bronchoscope by the support system move in concert with the telescopic extended working channel handle.\",\n \"In another aspect of the present disclosure, a method of positioning an elongated surgical instrument adjacent targeted tissue includes inserting the elongated surgical instrument into an extended working channel, securing a support system to the bronchoscope, coupling a portion of the elongated surgical instrument to the support system to fix the portion of the elongated surgical instrument to the bronchoscope, and manipulating a portion of the extended working channel such that the bronchoscope, the elongated surgical instrument, and the support system move in concert with the portion of the extended working channel.\",\n \"The elongated surgical instrument may have a locatable guide adjacent a distal end thereof.\",\n \"The extended working channel passes through a bronchoscope positioned in an airway of a patient.\",\n \"In aspects, manipulating a portion of the extended working channel includes manipulating a telescopic extended working channel handle of the extended working channel that is connected to the bronchoscope.\",\n \"In some aspects, securing the support system to the bronchoscope may include fixing a lower support of the support system to a portion of the bronchoscope.\",\n \"Securing the support system to the bronchoscope may include inserting a lower end of a rail of the support system into the lower support.\",\n \"In certain aspects, coupling a portion of the elongated surgical instrument to the support system includes coupling the portion of the elongated surgical instrument in an instrument support of the support system.\",\n \"The method may include locking the instrument support to a rail of the support system to fix the portion of the elongated surgical instrument relative to the bronchoscope.\",\n \"Further, to the extent consistent, any of the aspects described herein may be used in conjunction with any or all of the other aspects described herein.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser.\",\n \"No.\",\n \"14/479,482, filed Sep. 8, 2014, which claims the benefit of, and priority to, U.S.\",\n \"Provisional Patent Application Ser.\",\n \"Nos.\",\n \"61/874,881, filed Sep. 6, 2013; 61/974,611, filed Apr.\",\n \"3, 2014; and 62/041,424, filed Aug. 25, 2014.The entire contents of each of the above applications are hereby incorporated herein by reference.\",\n \"BACKGROUND 1.Technical Field The present disclosure relates to surgical instruments and, more specifically, to handles for moving an outer tubular member relative to an inner tubular member inserted therethrough.\",\n \"2.Discussion of Related Art A common interventional procedure in the field of pulmonary medicine is bronchoscopy, in which a bronchoscope is inserted into the airways through the patient's nose or mouth.\",\n \"The structure of a bronchoscope generally includes a long, thin, flexible tube that typically contains three elements: an illumination assembly for illuminating the region distal to the bronchoscope's tip via an optical fiber connected to an external light source; an imaging assembly for delivering back a video image from the bronchoscope's distal tip; and a lumen or working channel through which instruments may be inserted, including but not limited to placement (e.g., guide wires), diagnostic (e.g., biopsy tools) and therapeutic (e.g., treatment catheters or laser, cryogenic, radio frequency, or microwave tissue treatment probes) instruments.\",\n \"The distal tip of a bronchoscope is steerable.\",\n \"Rotating a lever placed at the handle of the bronchoscope actuates a steering mechanism that deflects the tip in one or more directions.\",\n \"Bronchoscopies are performed by pulmonologists, also known as bronchoscopists, and are used routinely in the diagnosis and treatment of conditions such as lung cancer, airway stenosis, and emphysema.\",\n \"Bronchoscopies are typically performed by a staff of at least two persons: the bronchoscopist and at least one assistant, usually a nurse.\",\n \"During a typical procedure, the bronchoscopist holds the bronchoscope handle with one hand and the bronchoscope tube with the other hand.\",\n \"The bronchoscopist manipulates the distal tip of the bronchoscope inside the lung by rotating a deflection lever and by pushing and pulling the tube.\",\n \"Once the tip is brought to a target, an instrument can be inserted into the working channel to perform a diagnostic or therapeutic procedure.\",\n \"During insertion and operation of the instruments, the distal tip of the bronchoscope should be held steady at the target.\",\n \"Two hands are needed to secure the bronchoscope in place and one to two more hands are needed for inserting and actuating the instrument.\",\n \"Generally, the bronchoscopist releases the bronchoscope to insert and actuate the instrument.\",\n \"Performing a procedure that requires two people is generally more expensive and the potential for error is increased.\",\n \"Hence, it is desirable to modify a procedure so that it may be performed with one or two hands, if possible.\",\n \"Additionally, because all of the instruments used with a bronchoscope are necessarily long and slender, the instruments do not retain shape when unsupported.\",\n \"Thus, inserting an instrument into a bronchoscope can be difficult or impossible to do quickly with one hand.\",\n \"While this problem can be addressed easily by holding the end of the sheath in one hand and the instrument in another, this would again require additional free hands during performance of the procedure.\",\n \"During particular procedures (e.g., microwave ablation and biopsy) a catheter or extended working channel may be inserted through a working channel to enable navigation to sites too remote and having luminal diameters too small for the bronchoscope.\",\n \"An instrument may be inserted through the catheter or extended working channel in order to perform a biopsy or ablation procedure.\",\n \"Current systems and methodologies for extending the surgical instrument from the catheter or retracting the catheter from the placement of the surgical instrument require at least two people to manipulate all the elements of the system including the bronchoscope.\",\n \"Accordingly, there is a need for an apparatus that would facilitate one-handed actuation of the catheter and surgical instrument leaving one hand to manipulate the bronchoscope.\",\n \"In addition, there is a need for a support for use with a bronchoscope that would facilitate operation of a bronchoscope and associated tools by a single practitioner.\",\n \"It would also be advantageous to provide a support for the probe and the catheter to allow a single practitioner to manipulate a catheter, a probe, and a bronchoscope during the procedure.\",\n \"SUMMARY In an aspect of the present disclosure, a handle for longitudinal movement of a first tubular member over a second tubular member includes a handle body, a nose cone, a locking mechanism, and a retraction control.\",\n \"The nose cone has a sleeve and an outer wall defining a control channel therebetween.\",\n \"The nose cone is moveable over the handle body between extended and retracted positions.\",\n \"The locking mechanism has locked and unlocked positions for selectively fixing the nose cone in the extended and retracted positions.\",\n \"The retraction control includes a finger positioned within the control channel of the nose cone and has first and second positions relative to the nose cone for transitioning the locking mechanism between the locked and unlocked positions and for moving the nose cone between the extended and retracted positions.\",\n \"In aspects, when the nose cone is in the extended position and the retraction control is in the first position, the locking mechanism is in the locked position to fix the nose cone in the extended position.\",\n \"In some aspects, when the nose cone is in the extended position and the retraction control is in the second position, the locking mechanism is in the unlocked position such that the nose cone is moveable relative to the handle body.\",\n \"When the nose cone reaches the retracted position, the locking mechanism transitions to the locked position to fix the nose cone in the retracted position.\",\n \"In certain aspects, when the nose cone is in the retracted position and the retraction control is in the second position, the locking mechanism is in the locked position to fix the nose cone in the extended position.\",\n \"In particular aspects, when the nose cone is in the retracted position and the retraction control is in the first position, the locking mechanism is in the unlocked position such that the nose cone is moveable relative to the handle body.\",\n \"When the nose cone reaches the extended position, the locking mechanism may transition to the locked position to fix the nose cone in the extended position.\",\n \"In aspects, the second position of the retraction control is proximal to the first position of the retraction control.\",\n \"The locking mechanism may be disposed within a slot defined in the housing body.\",\n \"The locking mechanism may include a locking pin that has a retention plate.\",\n \"The locking pin may be biased out of the slot defined in the housing body such that the retention plate retains the locking pin within the slot.\",\n \"The sleeve of the nose cone may define first and second openings such that when the nose cone is in the extended position and the locking pin is in the locked position, the locking pin is disposed within the first opening.\",\n \"In addition, when the nose cone is in the retracted position and the locking pin is in the locked position, the locking pin may be disposed within the second opening.\",\n \"In another aspect of the present disclosure, a surgical system includes an extended working channel having proximal and distal ends, a handle defining a through passage, a retraction control, and a catheter assembly disposed within the through passage of the handle.\",\n \"The handle includes a housing body defining a proximal portion of the through passage, a nose cone coupled to the proximal end of the extended working channel, a locking mechanism, and a retraction control.\",\n \"The nose cone has a sleeve and an outer wall defining a control channel therebetween.\",\n \"The nose cone defines a distal portion of the through passage in communication with the extended working channel.\",\n \"The nose cone is longitudinally moveable over the housing body between extended and retracted positions.\",\n \"The locking mechanism has locked and unlocked positions for selectively fixing the nose cone in the extended and retracted positions.\",\n \"The retraction control includes a finger positioned within the control channel of the nose cone.\",\n \"The retraction control has first and second positions relative to the nose cone for transitioning the locking mechanism between the locked and unlocked positions and for moving the nose cone between the extended and retracted positions.\",\n \"The catheter assembly includes a catheter hub positioned within the proximal portion of the through passage and an ablation probe extending from the catheter hub through the nose cone of the handle and through the extended working channel.\",\n \"The ablation probe has a distal end that is disposed within the extended working channel when the handle is in the extend position and that is position positioned distal to the distal end of the extended working channel when the handle is in the retracted position.\",\n \"In aspects, the catheter hub combines coolant tubes and an antenna into the ablation probe.\",\n \"The catheter hub may include an adjustment nut that is positioned over an outer surface of the catheter hub.\",\n \"The housing portion may define a nut recess for receiving the adjustment nut to longitudinally fix the ablation probe to the housing portion.\",\n \"The adjustment nut is threaded to cooperate with threads on the outer surface of the catheter hub to allow fine adjustment of the length of the ablation probe relative to the housing portion.\",\n \"The distal end of the ablation probe may be positioned within the distal end of the extended working channel when the nose cone is in the extended position.\",\n \"The distal end of the ablation probe may be positioned distal to the distal end of the extended working channel when the nose cone is in the retracted position.\",\n \"In another aspect of the present disclosure, a method of assembly of a surgical system includes positioning a catheter assembly within a half of a first portion of a passage defined within a first half of a housing body of a handle, securing a second half of the housing body of the handle to the first half of the housing body with the catheter assembly that is positioned in a half of the first portion of the passage defined within the second half of the housing body to form the housing body, sliding a nose cone of the handle over a distal portion of the housing body, and inserting a finger of a retraction control within a control channel defined between a sleeve and outer wall of the nose cone.\",\n \"The nose cone defines a second portion of the passage that receives a probe of the catheter assembly therethrough.\",\n \"In aspects, the positioning of the catheter assembly within the first half of the first portion of the passage that is defined within the first half of the housing body includes position an adjustment nut within a nut recess defined in the housing body to adjust the length of the probe extending distally from the housing body.\",\n \"The method may further include rotating the adjustment nut about a threaded portion of the catheter hub to fix the length of the probe that extends distally from the housing body.\",\n \"Securing the second half of the housing body to the first half of the housing body may prevent adjustment of the length of the probe extending distally from the housing body during use of the surgical system.\",\n \"In another aspect of the present disclosure, a support system includes a rail, a lower support, and an instrument support.\",\n \"The rail has upper and lower ends that define a longitudinal axis therebetween.\",\n \"The lower support is configured to receive a portion of a bronchoscope and to selectively fix the bronchoscope relative to the rail.\",\n \"The instrument support is slidably disposed on the rail and is selectively lockable to the rail.\",\n \"The instrument support is configured to releasably couple to a surgical instrument inserted through the bronchoscope to fix the position of a portion of the surgical instrument relative to the bronchoscope.\",\n \"In aspects, the instrument support includes a clamp arm and a clamp arm collar.\",\n \"The clamp arm collar may be slidably disposed over the rail.\",\n \"The clamp arm may include instrument fingers that extend from the clamp arm collar.\",\n \"The instrument fingers may define an instrument passage that is configured to releasably couple to the surgical instrument.\",\n \"The instrument support may include a locking arm that has a locking cam.\",\n \"The clamp arm collar may include a camming surface and the locking cam may be configured to compress the camming surface of the clamp arm collar against the rail when the locking arm is in the locked position to lock the instrument support to the rail.\",\n \"In the locked position, the instrument support may be radially locked relative to the rail.\",\n \"In some aspects, the lower support defines a rail opening that is configured to receive the lower end of the rail.\",\n \"The support system may include a collar positioned within the rail opening that includes a threaded portion.\",\n \"The support system may include a securement member that is threaded over the threaded portion of the collar to compress the collar over the lower end of the rail to fix the rail to the lower support.\",\n \"In certain aspects, the lower support includes a pair of support fingers that extend orthogonally from the rail.\",\n \"The support fingers may define a support opening therebetween.\",\n \"The support fingers may be configured to compress the support opening about the bronchoscope to fix the lower support relative to the bronchoscope.\",\n \"In another aspect of the present disclosure, a surgical system includes a bronchoscope, an extended working channel that extends through the bronchoscope, an elongated surgical instrument that is inserted through the extended working channel, and a support system for supporting the elongated surgical instrument relative to the bronchoscope.\",\n \"The support system includes a rail, a lower support, and an instrument support.\",\n \"The rail has upper and lower ends that define a longitudinal axis therebetween.\",\n \"The lower support is fixed to the lower end of the rail and to the bronchoscope to fix the rail to the bronchoscope.\",\n \"The instrument support is slidably disposed on the rail and is selectively lockable to the rail.\",\n \"The instrument support is releasably coupled to a first portion of the elongated surgical instrument to fix the position of the first portion of the elongated surgical instrument relative to the bronchoscope.\",\n \"In aspects, a second portion of the elongated surgical instrument is moveable relative to the bronchoscope.\",\n \"The second portion of the elongated surgical instrument may be fixed to a proximal end of the extended working channel such that the extended working channel is moveable relative to the bronchoscope and the first portion of the elongated surgical instrument.\",\n \"The first portion of the elongated surgical instrument includes an ablation probe that extends through the second portion of the elongated surgical instrument and the extended working channel.\",\n \"In some aspects, the extended working channel includes a telescopic extended working channel handle that is fixed to the bronchoscope.\",\n \"When the telescopic extended working channel handle is manipulated, the bronchoscope and the elongated surgical instrument that is fixed to the bronchoscope by the support system move in concert with the telescopic extended working channel handle.\",\n \"In another aspect of the present disclosure, a method of positioning an elongated surgical instrument adjacent targeted tissue includes inserting the elongated surgical instrument into an extended working channel, securing a support system to the bronchoscope, coupling a portion of the elongated surgical instrument to the support system to fix the portion of the elongated surgical instrument to the bronchoscope, and manipulating a portion of the extended working channel such that the bronchoscope, the elongated surgical instrument, and the support system move in concert with the portion of the extended working channel.\",\n \"The elongated surgical instrument may have a locatable guide adjacent a distal end thereof.\",\n \"The extended working channel passes through a bronchoscope positioned in an airway of a patient.\",\n \"In aspects, manipulating a portion of the extended working channel includes manipulating a telescopic extended working channel handle of the extended working channel that is connected to the bronchoscope.\",\n \"In some aspects, securing the support system to the bronchoscope may include fixing a lower support of the support system to a portion of the bronchoscope.\",\n \"Securing the support system to the bronchoscope may include inserting a lower end of a rail of the support system into the lower support.\",\n \"In certain aspects, coupling a portion of the elongated surgical instrument to the support system includes coupling the portion of the elongated surgical instrument in an instrument support of the support system.\",\n \"The method may include locking the instrument support to a rail of the support system to fix the portion of the elongated surgical instrument relative to the bronchoscope.\",\n \"Further, to the extent consistent, any of the aspects described herein may be used in conjunction with any or all of the other aspects described herein.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS Various aspects of the present disclosure are described hereinbelow with reference to the drawings, which are incorporated in and constitute a part of this specification, wherein: FIG.\",\n \"1 is a perspective view of an exemplary surgical system including a retraction handle and a rail system in accordance with the present disclosure; FIG.\",\n \"2 is a perspective view of the retraction handle of FIG.\",\n \"1; FIG.\",\n \"3 is an exploded perspective view showing the components of the retraction handle of FIG.\",\n \"1; FIG.\",\n \"3A is a cross-sectional view taken along the section line 3A-3A shown in FIG.\",\n \"3; FIG.\",\n \"4 is a longitudinal cross-sectional view of the retraction handle of FIG.\",\n \"1 taken along the longitudinal axis thereof; FIG.\",\n \"5 is an enlarged view of the indicated area of detail of FIG.\",\n \"4; FIG.\",\n \"6 is a longitudinal cross-sectional view of the retraction handle with the retraction control in a second position and the nose cone in an extended position; FIG.\",\n \"7 is an enlarged view of the indicated area of detail of FIG.\",\n \"6; FIG.\",\n \"8 is a longitudinal cross-sectional view of the retraction handle with the retraction control in the second position and the nose cone in the retracted position; FIG.\",\n \"9 is an enlarged view of the indicated area of detail of FIG.\",\n \"8; FIG.\",\n \"10 is a longitudinal cross-sectional view of the retraction handle with the retraction control in the first position and the nose cone in the retracted position; FIG.\",\n \"11 is an enlarged view of the indicated area of detail of FIG.\",\n \"10; FIG.\",\n \"12 is a perspective view of a distal end of the catheter of FIG.\",\n \"2; FIG.\",\n \"13 is a perspective view of the distal end of the catheter of FIG.\",\n \"12 when the retraction handle is in the retracted position; FIG.\",\n \"14 is an enlarged view of the indicated area of detail of FIG.\",\n \"1; FIG.\",\n \"15 is a side cross-sectional view of taken along the section line 15-15 of FIG.\",\n \"14; FIG.\",\n \"16 is an enlarged view of the indicated area of detail of FIG.\",\n \"1; FIG.\",\n \"17 is a top view of a device support taken along the line 17-17 FIG.\",\n \"16 illustrating a locking arm in an unlocked position; FIG.\",\n \"18 is a top view of a device support taken along the line 18-18 of FIG.\",\n \"16 illustrating a locking arm in a locked position; FIG.\",\n \"19 is a perspective view of the surgical system of FIG.\",\n \"1 in use with an electromagnetic navigation system 400 provided in accordance with the present disclosure; FIGS.\",\n \"20A-20C are side views of distal ends of instruments that may be used with the surgical system of FIG.\",\n \"1 FIG.\",\n \"21 is a perspective view of another rail system provided in accordance with the present disclosure; FIG.\",\n \"22 is an enlarge perspective view of the area of detail indicated in FIG.\",\n \"21; FIG.\",\n \"23 is a cross-sectional view taken along the section line 23-23 of FIG.\",\n \"22; FIG.\",\n \"24 is a perspective view of the lower support of FIG.\",\n \"22 with the support arm in an open configuration positioned about a portion of a bronchoscope; FIG.\",\n \"25 is a perspective view of the lower support of FIG.\",\n \"24 with the portion of the bronchoscope removed; FIG.\",\n \"26 is a cross-sectional view taken along the section line 26-26 of FIG.\",\n \"21 illustrating the instrument support in an unlocked configuration; FIG.\",\n \"27 is a cross-sectional view of the instrument support of FIG.\",\n \"27 in a locked configuration; and FIG.\",\n \"28 is a perspective view of the rail system of FIG.\",\n \"21 with another instrument support provided in accordance with the present disclosure.\",\n \"DETAILED DESCRIPTION According to aspects of the present disclosure, a support system mounts to a bronchoscope to support instruments inserted through and associated with the bronchoscope.\",\n \"In one embodiment, the support system is configured to separately support a retraction handle and a catheter inserted through the retraction handle and the bronchoscope.\",\n \"The retraction handle is coupled to an extended working channel that passes through the bronchoscope and into the anatomy of a patient.\",\n \"The catheter is inserted through the extended working channel to a position adjacent targeted tissue.\",\n \"When the catheter is positioned adjacent the targeted tissue, the retraction handle is moved to a retracted position to expose the distal end of the catheter adjacent the targeted tissue such that the catheter can treat the targeted tissue.\",\n \"The retraction handle may be moved to the retracted position with one hand of a clinician as detailed herein.\",\n \"Embodiments of the present disclosure are now described in detail with reference to the drawings in which like reference numerals designate identical or corresponding elements in each of the several views.\",\n \"As used herein, the term “clinician” refers to a doctor, a nurse, or any other care provider and may include support personnel.\",\n \"Throughout this description, the term “proximal” refers to the portion of the device or component thereof that is closest to the clinician and the term “distal” refers to the portion of the device or component thereof that is farthest from the clinician.\",\n \"Referring now to FIG.\",\n \"1, a surgical system 10 includes a bronchoscope 11, a telescopic extended working channel (EWC) handle 15, an ablation catheter assembly 100, including a cable 18, a probe 19, a retraction handle 20, and a connector 21 for connection to an energy source such as a microwave generator (not shown).\",\n \"A portion 18a of the cable 18 may extend from the connector 21 to a coolant source (not shown) for providing a cooling fluid to the ablation catheter assembly 100.FIG.\",\n \"1 also depicts a rail system 300 including a support rail 312 supported on the bronchoscope 11 by a lower support member 320 and includes a device support 330 that supports the retraction handle 20 as detailed below.\",\n \"The support rail 312 may include an additional a device support 330 that supports the cable 18 above the retraction handle 20.The rail system 300 is disclosed in greater detail below.\",\n \"The telescopic EWC handle 15 connects to the bronchoscope 11 and is in communication with an EWC 96, formed internally therein, such that instruments passed through the telescopic EWC handle 15 pass through the EWC 96.The proximal end 16 of the telescopic EWC handle 15 includes a mating feature that is engaged by the retraction handle 20.The retraction handle 20 mates with the proximal end 16 of the telescopic EWC handle 15 (FIG.\",\n \"1) enabling movement of the EWC 96 relative to the ablation probe 19, as described below.\",\n \"The retraction handle 20 may include an engagement feature 27 (FIG.\",\n \"2) for engaging the mating feature of the proximal end 16 of the telescopic EWC handle 15.The engagement feature 27 may be a clip that is received within an opening defined in the proximal end 16 of the telescopic EWC handle 15.With reference to FIGS.\",\n \"2 and 3, the ablation catheter assembly 100 includes an ablation probe 19 and a catheter hub 180 positioned within a through passage 23 (FIG.\",\n \"4) formed in the retraction handle 20.The ablation probe 19 extends distally from the catheter hub 180, through the telescopic EWC handle 15 (FIG.\",\n \"1) and the EWC 96 formed internal therein, and to a distal end 96a (FIGS.\",\n \"12 and 13) of the EWC 96.The catheter hub 180 includes coolant channels 183 and a connector 186 enabling electrical connection of cable 18 with an antenna 187, described below.\",\n \"One of the coolant channels 183a is an inflow channel and the other coolant channel 183b is an outflow channel.\",\n \"The coolant channels 183a, 183b, the connector 186, and the antenna 187 are coupled together within the catheter hub 180 into the ablation probe 19.With particular reference to FIG.\",\n \"3A, the ablation probe 19 includes a microwave antenna 82 electrically connected to cable 18 and sized be received within an outer sheath 84 of the ablation probe 19.An inner sheath 86 is formed within the outer sheath 84 and surrounds the microwave antenna 82, the inner sheath 86 separates the interior of the ablation probe 19 into inflow and outflow coolant paths 83a and 83b such that coolant flows through the inflow channel 183a, along the microwave antenna 82 in the inflow coolant path 83a to a distal end of the ablation probe 19, and returns via the outflow coolant path 83b separating the inner sheath 86 from the outer sheath 84 to the outflow channel 183b.\",\n \"In this manner the ablation probe 19, and more particularly the microwave antenna 82, is actively cooled.\",\n \"Examples of microwave antenna construction may be found in commonly assigned U.S. patent application Ser.\",\n \"No.\",\n \"13/835,283 entitled “Microwave Energy-Device and System,” and Ser.\",\n \"No.\",\n \"13/836,519 entitled “Microwave Ablation Catheter and Method of Utilizing Same,” the entire contents of each is incorporated herein by reference.\",\n \"Referring back to FIG.\",\n \"3, the catheter hub 180 includes a threaded portion 189 adjacent a distal end thereof.\",\n \"The threaded portion 189 receives an adjustment nut 182 that adjusts the length of the ablation probe 19 extending from the retraction handle 20.The adjustment nut 182 may be used by the manufacturer of the retraction handle 20 to finely adjust the length of the ablation probe 19 extending from the retraction handle 20 when the retraction handle 20 is assembled over the cable 18.Such an adjustment mechanism may allow the manufacturer to employ increased tolerances in the length of the ablation probe 19 during manufacture and to finely adjust the length of the ablation probe 19 during assembly.\",\n \"It will be appreciated that once the retraction handle 20 is assembled over the catheter hub 180, the adjustment nut 182 is not accessible by a clinician using the retraction handle 20 (i.e., once the length of the ablation probe 19 is set during assembly, the length of the ablation probe is fixed).\",\n \"With additional reference to FIG.\",\n \"4, the retraction handle 20 includes a nose cone 22, a retraction control 24, a sleeve 124 (FIG.\",\n \"3), a handle body 26, a spindle cap 28, and a locking mechanism 30.The components of the retraction handle 20 (e.g., the nose cone 22, the retraction control 24, the handle body 26, and the spindle cap 28) may be rotatable relative to one another to allow the components to rotate without applying a rotational force to the cable 18 or the EWC 96.The handle body 26 includes first and second body sections 131, 132 (FIG.\",\n \"3) that are secured together to define a second portion 23b (FIG.\",\n \"4) of the through passage 23 therethrough.\",\n \"As shown in FIG.\",\n \"3, the distal end of the handle body 26 defines a ring groove 133 in an outer surface thereof that receives a ring 134 that secures the first and second body sections 131, 132 together.\",\n \"The distal end of the handle body 26 is received in the first portion 23a of the through passage 23 defined by the nose cone 22.The second portion 23b of the through passage 23 defined by the handle body 26 includes a nut recess 135 that is positioned adjacent a distal end thereof and a cable recess 136 that is positioned adjacent a proximal end thereof.\",\n \"The outer surface of the handle body 26 includes mating tabs 137 positioned at a proximal end thereof.\",\n \"The spindle cap 28 is disposed over the proximal end of the handle body 26 and includes retention tabs 29 that engage the mating tabs 137 of the handle body to secure the spindle cap 28 to the handle body 26 and to secure the proximal end of the first and second body sections 131, 132 together.\",\n \"Referring to FIGS.\",\n \"4 and 5, the nose cone 22 defines an outer wall 122 and receives a sleeve 124.The sleeve 124 defines a first portion 23a of a through passage 23 that receives the handle body 26 and a portion of the probe 19 therewithin.\",\n \"The outer wall 122 of nose cone 22 and the sleeve 124 define a control channel 123 therebetween that slidably receives the retraction control 24.The distal end of the control channel 123 includes a control stop 125 that may limit the proximal displacement of the retraction control 24 relative to the nose cone 22.The sleeve 124 includes a first opening 126 and a second opening 128 positioned distal to the first opening 126.The sleeve 124 may optionally define a slot 127 in communication with the first and second openings 126, 128 parallel to the longitudinal axis.\",\n \"The sleeve 124 includes a retention ring 129a disposed about the inner wall 124 adjacent a proximal end thereof that prevents the retention control 24 from disengaging the sleeve 124 of (i.e., sliding proximally off of the sleeve 124).\",\n \"The sleeve 124 is formed separately from the nose cone 22 and joined thereto by a distal retention ring 129b.\",\n \"It is also within the scope of this disclosure that the sleeve 124 may be integrally formed with the nose cone 22.The retraction control 24 includes a proximal flange 141 and a distal finger 145 extending therefrom.\",\n \"The proximal flange 141 includes an inner angled surface 142 and a shoulder 143.The distal finger 145 includes a ramped surface 146 adjacent the inner wall 124 of the nose cone 22.The distal finger 145 is positioned over the inner wall 124 of the nose cone 22 such that the distal finger 145 is disposed substantially between the sleeve 124 and the outer wall 122 of the nose cone 22.Referring in particular to FIG.\",\n \"4, a locking mechanism 30 selectively locks the nose cone 22 in each of an extended position and a retracted position as detailed below.\",\n \"The outer surface of the handle body 26 defines pin slots 138 positioned adjacent a distal end thereof which may be positioned proximal to the nut recess 135.The locking mechanism 30 includes a locking pin 32 disposed within each of the pin slots 138 and a pin biasing member 37 supported within each of the pin slots 138 between a respective locking pin 32 and the housing body 26.Each locking pin 32 includes a shaft 33, a retention plate 34, and a locking surface 35 and is disposed substantially within a respective pin slot 138.The shaft 33 may pass through the pin biasing member 37.Each pin biasing member 37 engages the retention plate 34 of a respective locking pin 32 to urge the respective locking pin 32 out of pin slot 138.The locking pins 32 are moveable between a locked position and an unlocked position.\",\n \"In the locked position, the locking surface 35 of the locking pin 32 protrudes from the pin slot 138 and through one of the first and second openings 126, 128 of the sleeve 124.In the locked position, the retention plate 34 engages the inner surface of the sleeve 124 adjacent one of the first and second openings 126, 128 to prevent the locking pin 32 from passing entirely through the first or second openings 126, 128.In the unlocked position, the locking pin 32 is moved towards the longitudinal axis of the handle 20 against the pin biasing member 37 such that the locking surface 35 of the locking pin 32 is deflected within the inner surface of the sleeve 124.In the unlocked position (FIG.\",\n \"6), the locking surface 35 of the locking pin 32 is engaged by the inner surface of sleeve 124 between the first and second openings 126, 128.When the locking pins 32 are in the locked position and positioned to protruded through the first openings 126 (FIGS.\",\n \"4 and 5), the nose cone 22 is in the extended position.\",\n \"When the locking pins 32 are in the locked position and positioned to protrude through the second openings 128 (FIGS.\",\n \"7 and 8), the nose cone 22 is in the retracted position.\",\n \"The retraction control 24 engages the locking surface 35 of the locking pins 32 to move the locking pins 32 from the locked position to the unlocked position to permit the nose cone 22 to move between the extended and retracted positions as detailed below.\",\n \"Referring to FIGS.\",\n \"4-9, the retraction control 24 moves the nose cone 22 along the longitudinal axis from an extended position (FIG.\",\n \"4) to a retracted position (FIG.\",\n \"8).\",\n \"It will be appreciated that the extended and retracted positions refer to the location of the distal end 96a of the EWC 96 relative to the distal end 19a of the probe 19 as shown in FIGS.\",\n \"12 and 13.In FIGS.\",\n \"4 and 12, the EWC 96 is extended beyond the distal end 19a of the probe 19, and in FIGS.\",\n \"5 and 13 the EWC 96 is retracted, exposing the distal end 19a of probe 19.In part this orientation of movement is necessary when, as shown in FIG.\",\n \"1, the housing body 26 of handle 20 is secured to the rail system 300 by device supports 330.The retraction control 24 has a first position (FIG.\",\n \"4) relative to the nose cone 22 such that the retraction control 24 (i.e., the distal finger 145) is positioned over the second openings 128 formed in the sleeve 124 leaving the first openings 126 unobstructed and a second position (FIG.\",\n \"6) relative to the nose cone 22 such that the retraction control 24 (i.e., the proximal flange 141) is positioned proximal to the first openings 126 leaving the second openings 128 unobstructed.\",\n \"Initially referring to FIGS.\",\n \"4 and 5, the nose cone 22 is in the extended position, the retraction control 24 in a first position relative to the nose cone 22, and the locking pins 32 are in the locked position within the first openings 126.Referring now to FIGS.\",\n \"6 and 7, the nose cone 22 remains in the extended position and the retraction control 24 is moved to the second position relative to the nose cone 22 that is proximal to the first position.\",\n \"As the retraction control 24 is moved to the second position, the inner angled surface 142 of the proximal flange 141 engages the locking surface 35 of the locking pins 32 to move the locking pins 32 from the locked position to the unlocked position.\",\n \"When the locking pins 32 are in the unlocked position, the nose cone 22 is free to move towards the retracted position (FIG.\",\n \"8).\",\n \"With reference to FIGS.\",\n \"8 and 9, additional retraction of the retraction control 24 stops when the inner angled surface 142 of the retraction control 24 engages retention ring 129a fixed to the inner wall 124 stopping the movement of the nose cone 22 proximally over the housing body 26.As the nose cone 22 is retracted, the retraction control 24 remains in the second position relative to the nose cone 22 and the locking surface 35 of the locking pins 32 slide along the inner surface of the sleeve 124 between the first and second openings 126, 128.When the nose cone 22 reaches the retracted position (FIG.\",\n \"8), the locking surface 35 of the locking pins 32, being urged by the pin biasing members 37, extend through the second openings 128 such that the locking pins 32 are in the locked position to fix the nose cone 22 in the retracted position.\",\n \"Now with reference to FIGS.\",\n \"4, 5, and 8-11, the movement of the nose cone 22 from the retracted position (FIG.\",\n \"8) to the extended position (FIG.\",\n \"4) will be described in accordance with the present disclosure.\",\n \"Referring initially to FIGS.\",\n \"8 and 9, the nose cone 22 is in the retracted position, the retraction control 24 is in the second position, and the locking pins 32 are disposed in the locked position within the second openings 128 formed in the sleeve 124.With particular reference to FIGS.\",\n \"10 and 11, the nose cone 22 remains in the retracted position as the retraction control 24 is moved to the first position relative to the nose cone 22 to unlock the locking pins 32.When the retraction control 24 is moved from the second position to the first position, the ramp 146 of the distal finger 145 engages the locking surface 35 of the locking pins 32 to move the locking pins 32 against the pin biasing member 37 and towards the unlocked position.\",\n \"The distal finger 145 engages the control stop 125 to limit the distal translation of the retraction control 24 relative to the nose cone 22.Additionally or alternatively, the shoulder 143 of the proximal flange 141 may engage the proximal end of the outer wall 122 to limit the distal translation of the retraction control 24 relative to the nose cone 22.Referring back to FIGS.\",\n \"4 and 5, continued distal movement of the retraction control 24 moves the nose cone 22 distally relative to the housing body 26 to move the nose cone 22 to the extended position.\",\n \"The distal finger 145 may engage the control stop 125 or the shoulder 143 of the proximal flange 141 may engage the proximal end of the outer wall 122 to move the nose cone 22 to the extended position.\",\n \"As the nose cone 22 is extended, the retraction control 24 remains in the first position relative to the nose cone 22 and the locking surface 35 of the locking pins 32 slide along the inner surface of the sleeve 124 between the first and second openings 126, 128.When the nose cone 22 reaches the extended position, the locking surface 35 of the locking pins 32, being urged by the pin biasing members 37, extend through the first openings 126 such that the locking pins 32 are in the locked position to fix the nose cone 22 in the extended position.\",\n \"With reference to FIGS.\",\n \"1 and 14-18, the rail system 300 mounts to a bronchoscope (e.g., bronchoscope 11) to support instruments inserted through and associated with the bronchoscope (e.g., ablation catheter assembly 100).\",\n \"The rail system 300 is configured to separately support each instrument inserted through the bronchoscope and associated cabling, where necessary.\",\n \"While the rail system 300 detailed herein is described for use with a bronchoscope and associated instruments, it is contemplated that the support system may be used with other devices and associated instruments.\",\n \"Referring now to FIGS.\",\n \"1, 14, and 15, the rail system 300 includes a rail 312, a lower support 320, and a device support 330.The lower support 320 includes a support body 322 that mounts to a bronchoscope 11 to support the rail 312.The rail 312 has a lower end 316 and an upper end 318 and defines a longitudinal axis therebetween.\",\n \"The support body 322 includes support fingers 324 and defines a rail opening 327 that is sized and configured to receive the lower end 314 of the rail 312.The support fingers 324 extend from the rail opening 327 in a direction orthogonal to the rail opening 327 and around a portion of the bronchoscope 11.The support fingers 324 define a support opening 323 therebetween that mates with the portion of the bronchoscope 11.Each support finger 324 defines a through locking hole 325 aligned with the locking hole of the other finger 324.A locking member 326 is inserted through the locking holes 325 to compress the support opening 323 about the portion of the bronchoscope 11 which secures the support body 322 to the bronchoscope 11.It is contemplated that the support opening 323 may compress about the telescopic EWC handle 15.With reference to FIGS.\",\n \"14 and 15, a collar 316 is disposed over the lower end 314 of the rail 312 and within the rail opening 327.The rail opening 327 and the collar 316 may be threadably coupled to one another.\",\n \"A thread portion of the collar 316 extends from the rail opening 327.A securement member 317 is threaded over the threaded portion of the collar 316 extending from the rail opening 327.The securement member 317 radially compresses the collar 316 against the rail 312 to secure the rail 312 within the rail opening 317.It is also contemplated that the distal end 314 of the rail 312 may be threaded and configured to thread directly into the lower support 320 without the collar 316.In such embodiments, the securement member 317 may be a lock nut to The rail 312 extends vertically from the lower support 320 towards the upper end 318.The rail 312 may be fully supported by the lower support 320 or a support (not shown) may be releasably coupled adjacent the upper end 318 to provide additional support to the rail 312.The rail 312 may be constructed of any suitable material including, but not limited to, surgical steel, fiberglass, and plastic.\",\n \"Referring to FIGS.\",\n \"16-18, one or more device supports 330 are positioned along the rail 312 and configured to support instruments (e.g., handle 20, cable 18 of ablation catheter 100) inserted through the bronchoscope 11.The device support 330 includes a clamp arm 331 having a clamp arm collar 332, which defines a rail passage 333 therethrough.\",\n \"The clamp arm collar 332 is sized and configured to slide over the rail 312 in an unlocked configuration and to engage the rail 312 in a locked configuration to fix the device support 330 in position along the rail 312.In the unlocked configuration the rail passage 333 is sized and configured to freely slide over the rail 312 and in the locked configuration the rail passage 333 is sized and configured to engage the rail 312.In the locked configuration, the device support 330 may be longitudinally and/or radially fixed to the rail 312.The device support 330 includes instrument fingers 334 extending from the clamp arm collar 332 in a direction orthogonal to the longitudinal axis of the rail 312.The instrument fingers 334 define an instrument passage 335 therebetween that is sized and configured to releasably couple to and to support an instrument (e.g., handle 20, ablation catheter assembly 18).\",\n \"The device support 330 further includes a locking arm 336 that transitions the clamp arm collar 332 between the locked and unlocked configurations.\",\n \"The locking arm 336 includes a locking arm collar 337 that is disposed over a portion of the clamp arm collar 332 and includes a locking cam 338.The locking cam 338 extends from the locking arm collar 337 substantially parallel to the longitudinal axis of the rail 312 and towards the clamp arm 331.A portion of the clamp arm collar 332 includes a radial camming surface 339.The camming surface 339 forms a radial ramp such that as the locking arm 336 is rotated from an unlocked position (FIG.\",\n \"17) towards a locked position (FIG.\",\n \"18), the locking cam 338 engages the camming surface 339 to compress the clamp arm collar 332 towards the locked position.\",\n \"The locking cam 337 may engage the clamp arm 331 in one of the locked or unlocked positions of the locking arm 336 to prevent the locking arm 36 from excessive rotation about the clamp arm collar 332 and to provide indicia (e.g., tactile, visual, or audible indicia) that the device support 330 is in the locked or unlocked position.\",\n \"In embodiments, the locking arm collar 337 may include two locking cams 338 radially disposed about the locking arm collar 337 about 180° apart as shown in FIGS.\",\n \"17 and 18.One of the locking cams 337 may engage the clamp arm 331 in the locked configuration and the other of the locking cams may engage the clamp arm 331 in the unlocked configuration to prevent the locking arm 336 from excessive rotation about the clamp arm collar 332 and to provide indicia (e.g., tactile, visual, or audible indicia) that the device support 330 is in the locked and unlocked configuration.\",\n \"In use, the support fingers 324 of the lower support are slid over a portion of the bronchoscope 11 such that the portion of the bronchoscope 11 is positioned within the opening 323.A locking member 326 is inserted through the locking holes 325 of the support fingers 324 and tightened to lock the lower support 320 to the bronchoscope 11.The lower end 314 of the rail 312 is inserted into the rail opening 327 defined in the lower support 320.The lower end 314 may be inserted into the collar 316 disposed within the rail opening 327.The securement member 317 is tightened over the threaded portion of the collar 316 to secure the rail 312 to the lower support 320.The upper end 318 of the rail 312 may be coupled to a support (not shown) to provide additional support to the bronchoscope 11.It is contemplated that the support may be a support stand supported on from the floor, a support hanging from a ceiling, or a support extending from a wall.\",\n \"A catheter (e.g., ablation catheter assembly 100) is then inserted through the telescopic EWC handle 15 and the EWC 96.A proximal end of the ablation catheter assembly 100 may include a catheter collar (not shown) positioned on the outer surface of the cable 18 for engagement with a device support 330 or the device support 330 may clamp directly to an outer surface of the cable 18, as shown.\",\n \"A first device support 330 is positioned along the rail 312 such that the instrument passage 335 of the first device support 330 is adjacent a portion of ablation catheter assembly 100 (e.g., the catheter collar or the cable 18).\",\n \"The portion of the ablation catheter assembly 100 is then coupled to the clamp arm 332 by urging the portion of ablation catheter assembly 100 into the instrument passage 335.The first device support 330 is then locked in position on the rail 312 by moving the lock arm 336 of the first device support 330 to the locked position.\",\n \"When the portion of the ablation catheter assembly 100 is secured within the instrument passage 335 with the device support 330 in the locked configuration, the portion of the ablation catheter assembly 100 is supported by the first device support 330.It is contemplated that the first device support 330 may be locked prior to urging the portion of the ablation catheter assembly 100 into the instrument passage 435.With reference to FIG.\",\n \"19, an electromagnetic navigation (EMN) system 400 is provided in accordance with the present disclosure.\",\n \"FIG.\",\n \"19 also depicts the ablation catheter assembly 100, the cable 18 (which connects on one end to a microwave generator (not shown) and on the other end to) the handle 20, and the rail system 300 of FIG.\",\n \"1 for use with the EMN system 400.One such EMN system is the ELECTROMAGNETIC NAVIGATION BRONCHOSCOPY® system currently sold by Covidien LP.\",\n \"Among other tasks that may be performed using the EMN system 400 are planning a pathway to target tissue, navigating a catheter guide assembly to the target tissue, deploying an instrument adjacent or into the target tissue to treat or capture the target tissue, digitally marking the location of the target tissue in a data file related to the planned pathway, and placing one or more echogenic markers at or around the target tissue.\",\n \"The EMN system 400 generally includes an operating table 410 configured to support a patient; the bronchoscope 11 configured for insertion through the patient's mouth and/or nose into the patient's airways; a tracking system 470 including a tracking module 472, a plurality of reference sensors 474, and an electromagnetic field generator 476; and a workstation 480 including software and/or hardware used to facilitate pathway planning, identification of target tissue, navigation to target tissue, and digitally marking the biopsy location.\",\n \"Before an ablation procedure can be performed, a locatable guide (LG) catheter 492, including an electromagnetic (EM) sensor 494, is inserted into the telescopic handle 15, and connected to rail system 300.Upon insertion into the telescopic EWC handle 15, the LG catheter 492 enters the EWC 96 and is locked into position such that the sensor 494 is positioned slightly beyond the distal end 96a of the EWC 96 during placement of the EWC 96.The location of the EM sensor 494, and thus the distal end 96a of the EWC 96, within an electromagnetic field generated by the electromagnetic field generator 476 can be derived by the tracking module 472, and the workstation 480.During insertion and placement of the distal end 96a of the EWC 96, the telescopic EWC handle 15 and the LG catheter 492 inserted therein can be manipulated by rotation and compression to steer and position the LG catheter 492.An example of a similar catheter guide assembly is currently marketed and sold by Covidien LP under the name EDGE™ Procedure Kits.\",\n \"For a more detailed description of the use of the catheter guide assembly reference is made to commonly-owned U.S.\",\n \"Provisional Patent Application Ser.\",\n \"No.\",\n \"62/020,240 filed on Jul.\",\n \"2, 2014 and entitled System and Method for Navigating within the Lung, the entire contents of which are hereby incorporated by reference.\",\n \"Once the LG catheter 492 and EM Sensor 494 are navigated to a target within the patient, the LG catheter 492 is removed from the EWC 96, bronchoscope 11, and telescopic EWC handle 15, and an ablation catheter system 100 may be inserted to treat the tissue at the target.\",\n \"When the EWC 96 is positioned, the bronchoscope 11 is held steady as the LG catheter 492 and the EM sensor 494 are withdrawn from the EWC 96 and the ablation catheter assembly 100 is inserted through the EWC 96 until the distal end 19a of the ablation probe 19 is adjacent the distal end of the EWC 96.In this configuration the ablation catheter assembly 100, handle 20, and rail system 300 have substantially the orientation depicted in FIG.\",\n \"1.The handle 20 is then manipulated to retract and extend the EWC 96 as detailed above to permit the clinician to treat the target.\",\n \"The ablation catheter assembly 100 is then withdrawn from the EWC 96 permitting additional instruments to be inserted through the EWC 96, the EWC 96 to be relocated to another target, or the EWC 96 to be removed from the airway of the patient.\",\n \"In one embodiment, the EM sensor 494 may be disposed on a distal end 19a the ablation probe 19.During insertion and positioning of the ablation probe 19 and EM sensor 494, the handle 20 is in the extended position (FIG.\",\n \"4) such that the distal end 19a of the ablation probe 19 is substantially within the EWC 96 as shown in FIG.\",\n \"12.In addition, ablation probe 19 and the handle 20 may be secured to the bronchoscope 11 with the rail system 300, as detailed above, such that as a clinician manipulates the telescopic EWC handle 15, the ablation probe 19c and the handle 20 move in concert together with the telescopic EWC handle 15 permitting one-handed manipulation of the bronchoscope 11, the telescopic EWC handle 15, the ablation catheter assembly 18, and the handle 20.When the EM sensor 494 is positioned adjacent the target, the handle 20 is moved to the retracted position (FIG.\",\n \"10) to retract the EWC 96 such that the distal end 19a of the ablation probe 19 is exposed as shown in FIG.\",\n \"13.With the distal end 19a of the ablation probe 19 exposed, the ablation probe 19 may be activated to treat the target.\",\n \"After the target is treated, the handle 20 is returned to the extended position such that the distal end 19a of the ablation probe 19 is substantially within the EWC 96 (FIG.\",\n \"12).\",\n \"The ablation catheter assembly 100 may then be removed from the EWC 96 leaving the distal end of the EWC 96 adjacent the target.\",\n \"Additional instruments may then be passed through the EWC 96 to treat the target, the EWC 96 may be relocated to another target, or the EWC 96 may also be removed from the airway of the patient.\",\n \"As described above, the rail system 300 and EMN system 400 may be used in combination with an LG catheter 492 or an ablation catheter 100.However, other instruments may also benefit from the rail system 300.Examples of additional instruments that may be inserted through the EWC 96 to treat and/or sample the target are shown in FIGS.\",\n \"20A-20C, depicting biopsy forceps 670, a biopsy brush 675, and a biopsy needle 680.As shown in FIG.\",\n \"20, each instrument includes an EM sensor 494 disposed thereon in accordance with the present disclosure, however, instruments without EM sensors 494 may also be employed without departing from the scope of the present disclosure.\",\n \"A proximal end of the instruments 670, 675, 680 may include a handle 20 similar in construction to what is shown in FIGS.\",\n \"1-11, enabling the retraction and extension of the EWC 96.Referring to FIGS.\",\n \"21-27, another rail system 500 is provided in accordance with the present disclosure and includes a rail 512, a lower support 520, and a device support 530.The rail system 500 is similar in structure and function to the rail system 300 detailed above, as such only the differences will be detailed herein for reasons of brevity.\",\n \"The lower support 520 includes a support body 522 that is coupled to a lower or distal end 514 of the rail 512 and defines a rail opening 529 (FIG.\",\n \"23) that receives the lower end of the rail 512 therein.\",\n \"The lower support 520 may include a collar 516 positioned in or adjacent to the rail opening 529 that engages an outer surface of the rail 512 to secure the lower support 520 to the rail 512.The support body 522 of the lower support 520 extends from the rail opening 529 to a support arm 524 that has a clamped configuration (FIGS.\",\n \"22 and 23) and an open configuration (FIGS.\",\n \"24 and 25).\",\n \"The support arm 524 and the support body 522 define a support opening 523 that is configured to receive and clamp to a bronchoscope 11 (FIG.\",\n \"1) using a bronchoscope adapter 511 to secure the lower support 520 to the bronchoscope 11.The bronchoscope adapter 511 may be threaded to a working channel port on the bronchoscope 11 as is known in the art.\",\n \"The support arm 524 pivots about a pivot pin 528 to transition between the clamped and open configurations thereof.\",\n \"The support arm 524 includes a clip 526 and the support body 522 defines a clip detent 525 (FIG.\",\n \"25) that is configured to selectively receive the clip 526 to secure the support arm 524 in the clamped configuration.\",\n \"The clip 526 may provide tactile feedback when the clip 526 is secured in the clip detent 525.The bronchoscope adapter 511 may include an annular ring 511a and the inner surface of the support opening 523 may define an annular groove 527 that is sized to receive the annular ring 511a to longitudinally fix the lower support 520 to the bronchoscope adapter 511 when the support arm 524 is in the clamped configuration.\",\n \"It is contemplated that the cooperation of the annular ring 511a and the annular groove 527 may assist in aligning the lower support 520 with the bronchoscope 11 (FIG.\",\n \"1).\",\n \"It is also contemplated that the annular ring 511a and the annular groove 527 may only be defined along a portion of the support opening 23.In such embodiments, the cooperation of the annular ring 511a and the annular groove 527 may radially fix the lower support 520 to the bronchoscope adapter 511.With particular reference to FIGS.\",\n \"26 and 27, the device support 530 includes a support collar 532 slidably disposed over the rail 512, instrument fingers 534 extending therefrom, and a locking mechanism 540 disposed therein.\",\n \"The locking mechanism 540 includes a locking arm 541 having locking cams 542.The locking arm 541 is pivoted between an unlocked position (FIG.\",\n \"26) and a locked position (FIG.\",\n \"27) to actuate the locking mechanism 540 between an unlocked configuration and a locked configuration.\",\n \"It will be appreciated that the locking arm 541 includes a passage that permits support collar 532 and the locking mechanism 540 to slide on the rail without engaging the rail 512 when the locking arm 541 is in the unlocked position.\",\n \"As shown, the locking mechanism 540 has upper and lower mechanisms that are substantially similar to one another and function in concert with one another; however, it is contemplated the locking mechanism 540 may only include either the upper or lower mechanism or that the each of the upper and lower mechanisms may be independently actuated.\",\n \"The locking mechanism 540 further includes an outer member 544 and an inner member 548 coaxially positioned with one another about the rail 512.The outer member 544 and the inner member 548 are moveable relative to one another between an unlocked position (FIG.\",\n \"26) and a locked position (FIG.\",\n \"27).\",\n \"The outer member 544 may be biased towards the unlocked position by a biasing member 546.The outer member 544 includes a camming surface 549 that is engaged by the locking cam 542 of the locking arm 541.To fix the device support 530 to the rail 512, the locking arm 541 is pivoted from the unlocked position (FIG.\",\n \"26) to a locked position (FIG.\",\n \"27).\",\n \"As the locking arm 541 is pivoted, the locking cams 542 cam the outer member 544 against the biasing member 546 and over the inner member 548 such that inner angled surfaces of the outer member 544 engage outer angled surfaces of the inner member 548 such that the inner member 548 is radially compressed into the rail 512 to engage the rail 512.It is contemplated that the inner member 548 may include teeth 548a that engage the rail 512 to fix the inner member 548 to the rail 512.The inner member 548 is coupled to the support collar 532 such that when the inner member 548 is fixed to the rail 512, the support collar 532 and thus the device support 530 is fixed to the rail 512.It is contemplated that the inner member 548 may be integrally formed with the support collar 532.As described above, the rail system 500 may include device support 530.However, other device supports may be used in combination with the rail system 500 which are configured to support a variety of instruments inserted through the EWC 96.For example, as shown in FIG.\",\n \"28 an additional device support 550 is illustrated in use with rail system 500.The device support 550 includes a support collar 532 and instrument fingers 554 extending therefrom.\",\n \"The instrument fingers 554 are substantially similar to the instrument fingers 354 detailed above with respect to device support 330.While the use of the handle 20 and the rail system 300, 500 are detailed herein for use in the airway of a patient, it is contemplated that the handle 20 and/or the rail system 300 may be used in a variety of surgical procedures utilizing elongated surgical instruments with extended working channels.\",\n \"For example, the handle 20 and or rail system 300, 500 may be used to stabilize a guide wire or catheter during various endovascular procedures such as cardiac interventions, general vascular interventional procedures, cerebral interventions, etc.\",\n \"These procedures may include, but are not limited to, balloon dilations, stent placements, percutaneous valve replacement, percutaneous valve repair, pacing lead placement, cardiac ablation procedures, and electrical mapping procedures.\",\n \"While several embodiments of the disclosure have been shown in the drawings, it is not intended that the disclosure be limited thereto, as it is intended that the disclosure be as broad in scope as the art will allow and that the specification be read likewise.\",\n \"Any combination of the above embodiments is also envisioned and is within the scope of the appended claims.\",\n \"Therefore, the above description should not be construed as limiting, but merely as exemplifications of particular embodiments.\",\n \"Those skilled in the art will envision other modifications within the scope and spirit of the claims appended hereto.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870850"}}},{"rowIdx":4493659,"cells":{"text":{"kind":"list like","value":[["FREE LAYER, MEGNETORESISTIVE CELL, AND MEGNETORESISTIVE RANDOM ACESS MEMORY DEVICE HAVING LOW BORON CONCENTRATION REGION AND HIGH BORON CONCENTRATION REGION, AND METHODS OF FABRICATING THE SAME","A method of forming a magnetoresistive memory device includes forming a ferromagnetic layer, forming a tunneling barrier layer on the ferromagnetic layer, forming a first preliminary free magnetic layer (free layer) containing boron (B) on the tunneling barrier layer, forming a first buffer layer on the first preliminary free layer, performing a first annealing process to transition the first preliminary free layer to form a second preliminary free layer and the first buffer layer to form a first boride layer, performing an etching process to remove the first boride layer, forming a second buffer layer on the second preliminary free layer, performing a second annealing process to transition the second preliminary free layer to form a free layer and the second buffer layer to form a second boride layer, and performing an oxidation process to transition the second boride layer to an oxide layer."],["1.A magnetoresistive memory device, comprising: a magnetoresistive cell disposed on a lower electrode; and an upper electrode disposed on the magnetoresistive cell, wherein the magnetoresistive cell comprises: a ferromagnetic layer; a tunneling barrier layer disposed on the ferromagnetic layer; a free magnetic layer disposed on the tunneling barrier layer; an oxide layer disposed on the free magnetic layer; and a capping layer disposed on the oxide layer, and wherein the free magnetic layer comprises: a first region having a relatively low concentration of boron (B) and disposed in the free magnetic layer to be close to the tunneling barrier layer; and a second region having a relatively high concentration of boron (B) and disposed in the free magnetic layer to be far from the tunneling barrier layer.","2.The magnetoresistive memory device of claim 2, wherein the first region includes a cobalt iron (CoFe) alloy, and the second region includes an iron boron (FeB) compound.","3.The magnetoresistive memory device of claim 2, wherein the first region is thicker than the second region.","4.The magnetoresistive memory device of claim 2, wherein the first region and the second region have a gradually gradated concentration of boron (B).","5.The magnetoresistive memory device of claim 2, wherein the oxide layer includes any one of tantalum oxide (TaO), titanium oxide (TiO) and magnesium oxide (MgO).","6.The magnetoresistive memory device of claim 2, wherein the oxide layer includes boron (B).","7.The magnetoresistive memory device of claim 6, wherein a concentration of boron (B) in the oxide layer is greater than a concentration of boron (B) in the first region.","8.The magnetoresistive memory device of claim 2, wherein the ferromagnetic layer includes a seed layer, a pinning layer disposed on the seed layer, an anti-ferromagnetic layer disposed on the pinning layer, and a pinned layer disposed on the anti-ferromagnetic layer.","9.The magnetoresistive memory device of claim 8, wherein the seed layer includes tantalum (Ta), ruthenium (Ru) or iridium (Ir).","10.The magnetoresistive memory device of claim 8, wherein the pinning layer includes any one of a cobalt platinum (CoPt) layer, a cobalt palladium (CoPd) layer, an alloy layer of cobalt platinum (CoPt) and cobalt palladium (CoPd), and a multilayer in which a cobalt platinum (CoPt) layer and a cobalt palladium (CoPd) layer are stacked.","11.A magnetoresistive memory device, comprising: a magnetoresistive cell disposed on a lower electrode; and an upper electrode disposed on the magnetoresistive cell, wherein the magnetoresistive cell comprises: a ferromagnetic layer; a tunneling barrier layer disposed on the ferromagnetic layer; a free magnetic layer disposed on the tunneling barrier layer; an oxide layer including boron (B) and disposed on the free magnetic layer; and a capping layer disposed on the oxide layer, and wherein the free magnetic layer has a gradually gradated concentration of boron (B) from a lower portion having a relatively low concentration of boron (B) to an upper portion having a relatively high concentration of boron (B).","12.The magnetoresistive memory device of claim 11, further comprising: a gate structure disposed on a substrate; a source area disposed in the substrate at a first side of the gate structure; a source contact plug disposed on the source area; a source interconnection disposed on the source contact plug; a drain area disposed in the substrate at a second side of the gate structure; a drain contact plug disposed on the drain area; and a drain pad disposed on the drain contact plug, wherein the lower electrode is disposed on the drain pad.","13.The magnetoresistive memory device of claim 12, wherein the source interconnection has a horizontally-extending line shape, and the drain pad has a circular or polygonal shape in a top view.","14.The magnetoresistive memory device of claim 12, wherein the source interconnection and the drain pad are formed at substantially the same level.","15.The magnetoresistive memory device of claim 11, wherein the lower portion of the free layer includes boron-free cobalt iron (CoFe) layer, the upper portion of the free layer includes cobalt iron boron (CoFeB) layer, and the oxide layer includes tantalum boron oxide (TaBO).","16.A magnetoresistive memory cell, comprising a ferromagnetic layer, the ferromagnetic layer comprising a first surface and a second surface that is opposite the first surface of the ferromagnetic layer; a tunnel barrier layer on the ferromagnetic layer, the tunnel barrier comprising a first surface and a second surface that is opposite the first surface of the tunnel barrier layer, the first surface of the tunnel barrier layer being proximate to the second surface of the ferromagnetic layer; and a free magnetic layer on the tunnel barrier layer, the free magnetic layer comprising a first surface and a second surface that is opposite the first surface of the free magnetic layer, the first surface of the free magnetic layer being proximate to the second surface of the tunnel barrier layer, the free magnetic layer further comprising a first region that is proximate to the second surface of the tunnel barrier layer and a second region that is distal to the second surface of the tunnel barrier layer, and the first region comprising a concentration of boron that is less that a concentration of boron of the second region.","17.The magnetoresistive memory cell of claim 16, wherein the first region is substantially free of boron.","18.The magnetoresistive memory cell of claim 16, wherein the first region includes a cobalt iron (CoFe) alloy, and the second region includes a cobalt iron boron (CoFeB) compound.","19.The magnetoresistive memory cell of claim 16, wherein a thickness of the first region is greater than a thickness of the second region.","20.The magnetoresistive memory cell of claim 16, wherein the magnetoresistive memory cell is part of a magnetoresistive random access memory."],[" BACKGROUND Embodiments disclosed herein relate to a magnetoresistive memory device, and, more specifically, a free layer, a magnetoresistive cell, and a magnetoresistive memory device including a region having a relatively low concentration of boron (B) and a region having a relatively high concentration of boron (B), and methods of fabricating the same."],[" SUMMARY Embodiments disclosed herein provide a free layer including a region having a relatively low concentration of boron (B) and a region having a relatively high concentration of boron (B), and a magnetoresistive cell having the free layer and a magnetoresistive memory device having the free layer.","Embodiments disclosed herein provide a free layer including a substantially boron-free region and a boron-containing region, and a magnetoresistive cell having the free layer and a magnetoresistive memory device having the free layer.","Embodiments disclosed herein provide methods of fabricating a free layer including a region having a relatively low concentration of boron (B) and a region having a relatively high concentration of boron (B), and methods of fabricating a magnetoresistive cell having the free layer and fabricating a magnetoresistive memory device having the free layer.","Embodiments disclosed herein provide methods of fabricating a free layer including a substantially boron-free region and a boron-containing region, and methods of fabricating a magnetoresistive cell having the free layer, and fabricating a magnetoresistive memory device having the free layer.","Embodiments disclosed herein provide methods of fabricating a free layer having a gradated concentration of boron (B), and methods of fabricating a magnetoresistive cell having the free layer, and fabricating a magnetoresistive memory device having the free layer.","The technical features of the embodiments disclosed herein are not limited to the above disclosure; other features and advantages may become apparent to those of ordinary skill in the art based on the following descriptions.","In accordance with an aspect of the subject matter disclosed herein, a method of forming a magnetoresistive memory device includes forming a magnetic layer, forming a tunneling barrier layer on the magnetic layer, forming a first preliminary free magnetic layer (free layer) containing boron (B) on the tunneling barrier layer, forming a first buffer layer on the first preliminary free layer, performing a first annealing process to transition the first preliminary free layer to form a second preliminary free layer and the first buffer layer to form a first boride layer, performing an etching process to remove the first boride layer, forming a second buffer layer on the second preliminary free layer, performing a second annealing process to transition the second preliminary free layer to form a free layer and the second buffer layer to form a second boride layer, and performing an oxidation process to transition the second boride layer to an oxide layer.","In accordance with another aspect of the subject matter disclosed herein, a method of forming a magnetoresistive memory device includes forming a magnetic layer, forming a tunneling barrier layer on the magnetic layer, forming a first preliminary free magnetic layer (free layer) containing boron (B) on the tunneling barrier layer, forming a first buffer layer on the first preliminary free layer, performing a first annealing process to transition the first preliminary free layer to form a second preliminary free layer and the first buffer layer to form a first boride layer, performing a first etching process to remove the first boride layer, forming a second buffer layer on the second preliminary free layer, performing a second annealing process to transition the second preliminary free layer to form a free layer and the second buffer layer to form a second boride layer, performing a second etching process to remove the second boride layer, and forming an oxide layer on the free layer.","In accordance with still another aspect of the subject matter disclosed herein, a magnetoresistive memory device includes a magnetoresistive cell disposed on a lower electrode and an upper electrode disposed on the magnetoresistive cell.","The magnetoresistive cell includes a magnetic layer, a tunneling barrier layer disposed on the magnetic layer, a free magnetic layer (free layer) disposed on the tunneling barrier layer, an oxide layer disposed on the free layer, and a capping layer disposed on the oxide layer.","The free layer includes a first region having a relatively low concentration of boron (B) and disposed to be close to the tunneling barrier layer and a second region having a relatively high concentration of boron (B) and disposed to be far from the tunneling barrier layer.","In accordance with still another aspect of the subject matter disclosed herein, a magnetoresistive memory device includes a magnetoresistive cell disposed on a lower electrode, and an upper electrode disposed on the magnetoresistive cell.","The magnetoresistive cell includes a magnetic layer, a tunneling barrier layer disposed on the magnetic layer, a free magnetic layer (free layer) disposed on the tunneling barrier layer, an oxide layer including boron (B) and disposed on the free layer, and a capping layer disposed on the oxide layer.","The free layer has a gradually gradated concentration of boron (B) from a lower portion having a relatively low concentration of boron (B) to an upper portion having a relatively high concentration of boron (B).","In accordance with an aspect of the subject matter disclosed herein, a magnetoresistive memory cell comprises: a ferromagnetic layer in which the ferromagnetic layer comprises a first surface and a second surface that is opposite the first surface of the ferromagnetic layer; a tunnel barrier layer on the ferromagnetic layer in which the tunnel barrier comprises a first surface and a second surface that is opposite the first surface of the tunnel barrier layer and in which the first surface of the tunnel barrier layer is proximate to the second surface of the ferromagnetic layer; and a free magnetic layer on the tunnel barrier layer in which the free magnetic layer comprises a first surface and a second surface that is opposite the first surface of the free magnetic layer, in which the first surface of the free magnetic layer is proximate to the second surface of the tunnel barrier layer, in which the free magnetic layer further comprises a first region that is proximate to the second surface of the tunnel barrier layer and a second region that is distal to the second surface of the tunnel barrier layer, and in which the first region comprises a concentration of boron that is less that a concentration of boron of the second region.","In accordance with an aspect of the subject matter disclosed herein, a method of forming a magnetoresistive memory device comprises: forming a ferromagnetic layer in which the ferromagnetic layer comprising a first surface and a second surface that is opposite the first surface of the ferromagnetic layer; forming a tunnel barrier layer on the ferromagnetic layer in which the tunnel barrier comprises a first surface and a second surface that is opposite the first surface of the tunnel barrier layer, in which the first surface of the tunnel barrier layer is proximate to the second surface of the ferromagnetic layer; and forming a free magnetic layer on the tunnel barrier layer in which the free magnetic layer comprises a first surface and a second surface that is opposite the first surface of the free magnetic layer, in which the first surface of the free magnetic layer is proximate to the second surface of the tunnel barrier layer, the free magnetic layer further comprises a first region that is proximate to the second surface of the tunnel barrier layer and a second region that is distal to the second surface of the tunnel barrier layer, and in which the first region comprises a concentration of boron that is less that a concentration of boron of the second region.","Details of other embodiments are included in the detailed description and drawings."],["CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. patent application Ser.","No.","15/157,399, filed on May 17, 2016, which claims priority under 35 U.S.C.","§ 119 to Korean Patent Application No.","10-2015-0181836 filed on Sep. 17, 2015, the disclosure of which is hereby incorporated by reference in its entirety.","BACKGROUND Embodiments disclosed herein relate to a magnetoresistive memory device, and, more specifically, a free layer, a magnetoresistive cell, and a magnetoresistive memory device including a region having a relatively low concentration of boron (B) and a region having a relatively high concentration of boron (B), and methods of fabricating the same.","DESCRIPTION OF RELATED ART Magnetoresistive random access memory (MRAM) devices, in particular, spin transfer torque MRAM (STT-MRAM) devices, are being spotlighted as a next-generation memory to replace dynamic random access memory (DRAM) devices because MRAM devices are operated at a low current level, enable random access, and have non-volatile characteristics.","Present technical challenges associated with the MRAM devices include preserving data for a long time and reducing power consumption.","It is known that retention characteristics for preserving data for a long time become better as a magnetization direction of a free magnetic layer (free layer) is verticalized, or made more vertical.","However, in order to reduce power consumption, it is advantageous for the magnetization direction of the free layer to be horizontal to so that the direction of the magnetization of the free layer changes, or switches, at a low current level.","The magnetization direction of the free layer may be changed based on a concentration of boron (B) in the free layer.","According to various embodiments of the subject matter disclosed herein, the free layer may include regions having different concentrations of boron (B).","Accordingly, data retention characteristics may be improved, and power consumption may be reduced.","SUMMARY Embodiments disclosed herein provide a free layer including a region having a relatively low concentration of boron (B) and a region having a relatively high concentration of boron (B), and a magnetoresistive cell having the free layer and a magnetoresistive memory device having the free layer.","Embodiments disclosed herein provide a free layer including a substantially boron-free region and a boron-containing region, and a magnetoresistive cell having the free layer and a magnetoresistive memory device having the free layer.","Embodiments disclosed herein provide methods of fabricating a free layer including a region having a relatively low concentration of boron (B) and a region having a relatively high concentration of boron (B), and methods of fabricating a magnetoresistive cell having the free layer and fabricating a magnetoresistive memory device having the free layer.","Embodiments disclosed herein provide methods of fabricating a free layer including a substantially boron-free region and a boron-containing region, and methods of fabricating a magnetoresistive cell having the free layer, and fabricating a magnetoresistive memory device having the free layer.","Embodiments disclosed herein provide methods of fabricating a free layer having a gradated concentration of boron (B), and methods of fabricating a magnetoresistive cell having the free layer, and fabricating a magnetoresistive memory device having the free layer.","The technical features of the embodiments disclosed herein are not limited to the above disclosure; other features and advantages may become apparent to those of ordinary skill in the art based on the following descriptions.","In accordance with an aspect of the subject matter disclosed herein, a method of forming a magnetoresistive memory device includes forming a magnetic layer, forming a tunneling barrier layer on the magnetic layer, forming a first preliminary free magnetic layer (free layer) containing boron (B) on the tunneling barrier layer, forming a first buffer layer on the first preliminary free layer, performing a first annealing process to transition the first preliminary free layer to form a second preliminary free layer and the first buffer layer to form a first boride layer, performing an etching process to remove the first boride layer, forming a second buffer layer on the second preliminary free layer, performing a second annealing process to transition the second preliminary free layer to form a free layer and the second buffer layer to form a second boride layer, and performing an oxidation process to transition the second boride layer to an oxide layer.","In accordance with another aspect of the subject matter disclosed herein, a method of forming a magnetoresistive memory device includes forming a magnetic layer, forming a tunneling barrier layer on the magnetic layer, forming a first preliminary free magnetic layer (free layer) containing boron (B) on the tunneling barrier layer, forming a first buffer layer on the first preliminary free layer, performing a first annealing process to transition the first preliminary free layer to form a second preliminary free layer and the first buffer layer to form a first boride layer, performing a first etching process to remove the first boride layer, forming a second buffer layer on the second preliminary free layer, performing a second annealing process to transition the second preliminary free layer to form a free layer and the second buffer layer to form a second boride layer, performing a second etching process to remove the second boride layer, and forming an oxide layer on the free layer.","In accordance with still another aspect of the subject matter disclosed herein, a magnetoresistive memory device includes a magnetoresistive cell disposed on a lower electrode and an upper electrode disposed on the magnetoresistive cell.","The magnetoresistive cell includes a magnetic layer, a tunneling barrier layer disposed on the magnetic layer, a free magnetic layer (free layer) disposed on the tunneling barrier layer, an oxide layer disposed on the free layer, and a capping layer disposed on the oxide layer.","The free layer includes a first region having a relatively low concentration of boron (B) and disposed to be close to the tunneling barrier layer and a second region having a relatively high concentration of boron (B) and disposed to be far from the tunneling barrier layer.","In accordance with still another aspect of the subject matter disclosed herein, a magnetoresistive memory device includes a magnetoresistive cell disposed on a lower electrode, and an upper electrode disposed on the magnetoresistive cell.","The magnetoresistive cell includes a magnetic layer, a tunneling barrier layer disposed on the magnetic layer, a free magnetic layer (free layer) disposed on the tunneling barrier layer, an oxide layer including boron (B) and disposed on the free layer, and a capping layer disposed on the oxide layer.","The free layer has a gradually gradated concentration of boron (B) from a lower portion having a relatively low concentration of boron (B) to an upper portion having a relatively high concentration of boron (B).","In accordance with an aspect of the subject matter disclosed herein, a magnetoresistive memory cell comprises: a ferromagnetic layer in which the ferromagnetic layer comprises a first surface and a second surface that is opposite the first surface of the ferromagnetic layer; a tunnel barrier layer on the ferromagnetic layer in which the tunnel barrier comprises a first surface and a second surface that is opposite the first surface of the tunnel barrier layer and in which the first surface of the tunnel barrier layer is proximate to the second surface of the ferromagnetic layer; and a free magnetic layer on the tunnel barrier layer in which the free magnetic layer comprises a first surface and a second surface that is opposite the first surface of the free magnetic layer, in which the first surface of the free magnetic layer is proximate to the second surface of the tunnel barrier layer, in which the free magnetic layer further comprises a first region that is proximate to the second surface of the tunnel barrier layer and a second region that is distal to the second surface of the tunnel barrier layer, and in which the first region comprises a concentration of boron that is less that a concentration of boron of the second region.","In accordance with an aspect of the subject matter disclosed herein, a method of forming a magnetoresistive memory device comprises: forming a ferromagnetic layer in which the ferromagnetic layer comprising a first surface and a second surface that is opposite the first surface of the ferromagnetic layer; forming a tunnel barrier layer on the ferromagnetic layer in which the tunnel barrier comprises a first surface and a second surface that is opposite the first surface of the tunnel barrier layer, in which the first surface of the tunnel barrier layer is proximate to the second surface of the ferromagnetic layer; and forming a free magnetic layer on the tunnel barrier layer in which the free magnetic layer comprises a first surface and a second surface that is opposite the first surface of the free magnetic layer, in which the first surface of the free magnetic layer is proximate to the second surface of the tunnel barrier layer, the free magnetic layer further comprises a first region that is proximate to the second surface of the tunnel barrier layer and a second region that is distal to the second surface of the tunnel barrier layer, and in which the first region comprises a concentration of boron that is less that a concentration of boron of the second region.","Details of other embodiments are included in the detailed description and drawings.","BRIEF DESCRIPTION OF THE DRAWINGS The foregoing and other features and advantages of the subject matter disclosed herein will be apparent from the more particular description of example embodiments, as illustrated in the accompanying drawings in which like reference numerals denote the same respective parts throughout the different views.","The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the subject matter disclosed herein.","In the drawings: FIG.","1 is an equivalent circuit diagram of a unit cell of a magnetoresistive random access memory (MRAM) in accordance with the subject matter disclosed herein; FIGS.","2A and 2B are vertical cross-sectional views schematically illustrating MRAM devices 200A and 200B in accordance with embodiments disclosed herein; FIGS.","3A and 3B are vertical cross-sectional views conceptually illustrating free layers 130A and 130B with regard to the concentration of boron (B) in accordance with various embodiments disclosed herein; FIGS.","4A and 4B conceptually illustrate magnetization directions of the free layers 130A and 130B of magnetoresistive cells 100A and 100B in accordance with various embodiments disclosed herein; FIGS.","5A to 5P are vertical cross-sectional views for schematically describing a method of fabricating an MRAM in accordance with the subject matter disclosed herein; FIG.","6 shows a flow diagram for a process 600 of fabricating an MRAM in accordance with the subject matter disclosed herein; FIG.","7 illustrates a method of fabricating an MRAM in accordance with an extended embodiment disclosed herein; FIG.","8 is a block diagram schematically depicting components that may include one or more magnetoresistive cells formed according to the subject matter disclosed herein; and FIG.","9 is a block diagram schematically depicting an electronic system that includes one or more magnetoresistive memory cells according to the subject matter disclosed herein.","DETAILED DESCRIPTION OF THE EMBODIMENTS Various embodiments will now be described more fully with reference to the accompanying drawings in which some embodiments are shown.","The subject matter disclosed herein may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein.","Rather, these embodiments are disclosed so that this disclosure is thorough and complete and fully conveys the subject matter disclosed herein to those skilled in the art.","Accordingly, all such modifications are intended to be included within the scope of the claimed subject matter.","The terminology used herein to describe the disclosed embodiments is not intended to limit the scope of the claimed subject matter.","The use herein of a singular form should not preclude the presence of more than one referent.","In other words, elements of the disclosed embodiments referred to in the singular form may number one or more, unless the context clearly indicates otherwise.","It shall be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including,” when used herein, specify the presence of stated elements, components, steps, operations, and/or devices, but do not preclude the presence or addition of one or more other elements, components, steps, operations, and/or devices.","Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper,” and the like may be used herein to describe the relationship of one element or feature to another, as illustrated in the drawings.","It shall be understood that such descriptions are intended to encompass different orientations in use or operation in addition to orientations depicted in the drawings.","For example, if a device is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features.","Thus, the term “below” is intended to mean both above and below depending upon overall device orientation.","Additionally, references to a direction that is referred to a vertical direction may refer to a direction in a figure that is parallel or substantially parallel to a direction from the bottom of the figure to the top of the figure.","Similarly, references to a direction that is referred to a horizontal direction may refer to a direction in a figure that is parallel or substantially parallel to a direction from left to right in the figure.","Embodiments are described herein with reference to cross-sectional views and/or planar views that are schematic illustrations of idealized embodiments and intermediate structures.","In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity.","As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected.","Thus, embodiments should not be construed as limited to the particular shapes of regions illustrated herein, but are to include deviations in shapes that result, for example, from manufacturing variations.","For example, an etched region illustrated as a rectangle will, typically, have rounded or curved features.","Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the claimed subject matter.","Like numerals refer to like elements throughout the specification.","Accordingly, the same numerals and similar numerals may be described with reference to other drawings, even if not specifically described in a corresponding drawing.","Further, when a numeral is not marked in a drawing, the numeral may be described with reference to other drawings.","FIG.","1 is an equivalent circuit diagram of a unit cell of a magnetoresistive random access memory (MRAM) in accordance with an embodiment of the subject matter disclosed herein.","Referring to FIG.","1, an MRAM in accordance with an embodiment may include a source line SL, a switching device Sw, a word line WL, a variable resistor Rv, and a bit line BL.","The switching device Sw may include a transistor.","When a voltage is applied to the word line WL to turn the switching device Sw on, a current may be supplied to the bit line BL from the source line SL via the variable resistor Rv.","Based on a resistance value of the variable resistor Rv, the amount of current supplied to the bit line BL may change.","Here, the amount of current may indicate a logic “1” or a logic “0”.","The variable resistor Rv, for example, a magnetoresistive cell, may have either a high resistance state or a low resistance state based on the amount of current supplied from the source line SL.","FIGS.","2A and 2B respectively are vertical cross-sectional views schematically illustrating MRAMs 200A and 200B in accordance with embodiments disclosed herein.","Referring to FIG.","2A, the MRAM 200A in accordance with an embodiment may include an isolation region 12 defining an active region 11 in a substrate 10, a gate structure 25 formed on the active region 11 of the substrate 10, a source interconnection 50, a lower electrode 56, a magnetoresistive cell 100A, an upper electrode 60, and a bit line 70.The gate structure 25 may include a gate insulating layer 26 formed directly on a surface of the active region 11, a gate electrode 27 disposed on the gate insulating layer 26, a gate capping layer 28 disposed on the gate electrode 27, and gate spacers 29 formed on side surfaces of the gate insulating layer 26, the gate electrode 27 and the gate capping layer 28.The gate insulating layer 26 may include silicon oxide (SiO2) or a metal oxide, such as, but not limited to, hafnium oxide (HfO).","The gate electrode 27 may include a conductive material, such as silicon, a metal, a metal alloy and/or a metal silicide.","The gate capping layer 28 may include an insulating material, such as silicon nitride (SiN), that is denser and more solid than silicon oxide (SiO2).","The gate spacers 29 may include silicon nitride (SiN), silicon boron nitride (SiBN), and/or silicon carbon nitride (SiCN).","A source area 21 and a drain area 22 may be disposed in the substrate 10 at both sides of the gate structure 25.The source area 21 and the drain area 22 may include a dopant, such as boron (B), phosphorous (P), and/or arsenic (As), to have conductivity.","The MRAM 200A may further include a lower interlayer insulating layer 31 covering the gate structure 25.The lower interlayer insulating layer 31 may include silicon oxide (SiO2).","The structure formed by the gate structure 25, the source area 21 and the drain area 22 may correspond to the switching device Sw depicted in FIG.","1.The MRAM 200A may further include a source contact plug 41 connected to the source area 21 by passing vertically through the lower interlayer insulating layer 31 and a drain contact plug 42 connected to the drain area 22 by passing vertically through the lower interlayer insulating layer 31.The source contact plug 41 and the drain contact plug 42 may include a conductive material, such as silicon, a metal, a metal alloy, and/or a metal silicide.","The source contact plug 41 and the drain contact plug 42 may have substantially pillar shapes.","Upper surfaces of the lower interlayer insulating layer 31, the source contact plug 41, and the drain contact plug 42 may be coplanar or substantially coplanar.","The source interconnection 50 may be disposed on the source contact plug 41 and the lower interlayer insulating layer 31.The source interconnection 50 may extend substantially horizontally and may substantially have a line shape in a top view.","The source interconnection 50 may include a conductive material, such as silicon, a metal, a metal alloy, and/or a metal silicide.","The MRAM 200A may further include a lower electrode pad 55 disposed on the drain contact plug 42.The lower electrode pad 55 may have substantially a circular, a tetragonal, or a polygonal shape in a top view.","The lower electrode pad 55 may be disposed at substantially the same level as the source interconnection 50.The lower electrode pad 55 may also include a conductive material, such as silicon, a metal, a metal alloy, and/or a metal silicide.","The lower electrode pad 55 may include substantially the same material as the source interconnection 50.The MRAM 200A may further include an intermediate interlayer insulating layer 32 covering the source interconnection 50 and the lower electrode pad 55.The intermediate interlayer insulating layer 32 may include silicon oxide (SiO2) and/or silicon nitride (SiN).","The lower electrode 56 may be connected to the lower electrode pad 55 by passing in a vertical direction through the intermediate interlayer insulating layer 32.The lower electrode 56 may have substantially a pillar shape.","The lower electrode 56 may include a conductive material, such as silicon, a metal, a metal alloy, and/or a metal silicide.","The magnetoresistive cell 100A may be disposed on the lower electrode 56 and the intermediate interlayer insulating layer 32.The magnetoresistive cell 100A may include a ferromagnetic layer 110, a tunneling barrier layer 120, a free magnetic layer (free layer) 130, an oxide layer 140, a capping layer 150 and a hardmask 160.In other embodiments, one of the capping layer 150 or the hardmask 160 may be omitted.","The ferromagnetic layer 110 may include a seed layer 111, a pinning layer 112, a synthetic anti-ferromagnetic (SAF) layer 113 and a pinned layer 114.The seed layer 111 may provide crystallinity or a crystal orientation for the pinning layer 112.The seed layer 111 may include a tantalum (Ta) layer and/or a ruthenium (Ru) layer.","For example, the seed layer 111 may be formed as a double layer that includes a lower tantalum (Ta) layer and an upper ruthenium (Ru) layer disposed on the lower tantalum (Ta) layer.","Alternatively, the seed layer 111 may be formed of only a tantalum (Ta) layer or a ruthenium (Ru) layer.","The pinning layer 112 may include a cobalt platinum (CoPt) or cobalt palladium (CoPd) based alloy, or a laminate of cobalt platinum (CoPt) and cobalt palladium (CoPd).","The SAF layer 113 may include an anti-ferromagnetic metal, such as ruthenium (Ru).","The pinned layer 114 may include a cobalt iron (CoFe) based material.","For example, the pinned layer 114 may include cobalt iron boron (CoFeB).","In other embodiments, the pinned layer 114 may include a CoFeB/Ta/CoFeB multilayer.","In still other embodiments, the pinned layer 114 may include a Co/B/CoFeB multilayer or a Co/W/CoFeB/W/CoFeB multilayer.","The tunneling barrier layer 120 may include magnesium oxide (MgO).","For example, the tunneling barrier layer 120 may be formed by depositing magnesium (Mg) on the pinned layer 114, and oxidizing the deposited magnesium (Mg).","The free magnetic layer (free layer) 130 may include one of a CoFe layer, a CoFeB layer, a CoFe/CoFeB multilayer, a CoFeB/W/CoFeB multilayer, and a CoFe/W/CoFeB multilayer.","For example, a lower portion of the free layer 130 may include a CoFe layer containing a very low concentration of boron (B) or a substantially boron-free CoFe layer, and an upper portion of the free layer 130 may include a CoFeB layer.","That is, a concentration of boron in the upper portion of the free layer 130 may be different from a concentration of boron in the lower portion of the free layer 130.For example, the lower portion of the free layer 130 may have a relatively low concentration of boron (B), and the upper portion of the free layer 130 may have a relatively high concentration of boron (B).","In some embodiments, the lower portion of the free layer 130 may be a substantially boron-free region.","In other embodiments, the lower portion of the free layer 130 may have a relatively high concentration of boron (B), and the upper portion of the free layer 130 may have a relatively low concentration of boron (B).","In some embodiments, the upper portion of the free layer 130 may be a substantially boron-free region.","Additionally, a free layer 130 having low concentration of boron (B) may have a crystallized state, and a free layer 130 having high concentration of boron (B) may have an amorphous state.","The oxide layer 140 may include tantalum oxide (TaO), zirconium oxide (ZrO), titanium oxide (TiO), vanadium oxide (VO), yttrium oxide (YO), scandium oxide (ScO), molybdenum oxide (MoO) and/or magnesium oxide (MgO).","In some embodiments, the oxide layer 140 may include a borated oxide.","For example, the oxide layer 140 may include tantalum boron oxide (TaBO), zirconium boron oxide (ZrBO), titanium boron oxide (TiBO), vanadium boron oxide (VBO), yttrium boron oxide (YBO), scandium boron oxide (ScBO), molybdenum boron oxide (MoBO), magnesium boron oxide (MgBO), cobalt boron oxide (CoBO), cobalt iron boron oxide ((CoFe)BO), or other various metal boron oxides.","For example, the oxide layer 140 may include a metal having a lower boride-forming energy than that of cobalt (Co) and/or iron (Fe).","The capping layer 150 may include a metal, such as tantalum (Ta) or ruthenium (Ru).","The hardmask 160 may include a metal such as tungsten (W), an alloy and/or a metal compound.","The MRAM 200A may further include a liner 170 surrounding side surfaces of the magnetoresistive cell 100A.","The liner 170 may also be conformally formed on the intermediate interlayer insulating layer 32.The liner 170 may include a metal oxide, such as aluminum oxide (Al2O3) or silicon nitride (SiN).","The MRAM 200A may further include an upper interlayer insulating layer 33 surrounding the magnetoresistive cell 100A.","The upper interlayer insulating layer 33 may include silicon oxide (SiO2).","The upper electrode 60 may be in contact with upper and side surfaces of the hardmask 160 by passing in a substantially vertical direction through the upper interlayer insulating layer 33 and an upper portion of a side surface of the capping layer 150.The upper electrode 60 may include an upper electrode barrier layer 61 and an upper electrode plug 65.The upper electrode barrier layer 61 may include titanium (Ti), tantalum (Ta), titanium nitride (TiN), tantalum nitride (TaN) and/or another barrier metal or metal compound.","The upper electrode plug 65 may include a metal, such as tungsten (W) or copper (Cu).","The bit line 70 may be disposed to be in contact with the upper electrode 60 on the upper interlayer insulating layer 33.The bit line 70 may extend substantially horizontally.","The bit line 70 may include a bit line barrier layer 71 in direct contact with the upper electrode 60, and a bit line interconnection 75 disposed on the bit line barrier layer 71.The bit line barrier layer 71 may include titanium (Ti), tantalum (Ta), titanium nitride (TiN), tantalum nitride (TaN) and/or another barrier metal or metal compound.","The bit line interconnection 75 may include a metal, such as tungsten (W) or copper (Cu).","Referring to FIG.","2B, the MRAM 200B in accordance with an embodiment disclosed herein may include a magnetoresistive cell 100B in which the hardmask 160 is omitted as compared to the MRAM 200A illustrated in FIG.","2A.","FIGS.","3A and 3B respectively depict vertical cross-sectional views conceptually illustrating free layers 130A and 130B with respect to a concentration of boron (B) in accordance with various embodiments disclosed herein.","The free layers 130A and 130B may correspond to the free layers 130 depicted in FIGS.","2A and 2B.","Referring to FIG.","3A, the free layer 130A in accordance with an embodiment disclosed herein may include a lower free layer 130L having a relatively low concentration of boron (B) and an upper free layer 130U having a relatively high concentration of boron (B).","The lower free layer 130L may be thicker (in a vertical direction in FIG.","3A) than the upper free layer 130U.","The lower free layer 130L may be a substantially boron-free layer.","For example, the lower free layer 130L may include a CoFe layer, whereas the upper free layer 130U may include a CoFeB layer.","Referring to FIG.","3B, the free layer 130B in accordance with an embodiment disclosed herein may include a multilayer of free layers 130L, 130M and 130U.","For example, the free layer 130B may include a lower free layer 130L, an intermediate free layer 130M and an upper free layer 130U.","A concentration of boron (B) in the lower free layer 130L may be relatively low, a concentration of boron (B) in the upper free layer 130U may be relatively high, and a concentration of boron (B) in the intermediate free layer 130M may be between the concentration of boron (B) in the lower free layer 130L and the concentration of boron (B) in the upper free layer 130U.","In one embodiment, the lower free layer 130L may be a substantially boron-free layer.","In some embodiments, the free layer 130B may be formed by more layers each having different concentrations of boron (B) than depicted in FIG.","3B.","Referring again to FIGS.","3A and 3B, the free layers 130A and 130B in accordance with various embodiments disclosed herein may have concentrations of boron (B) that gradually or continuous increase through the free layers 130A and 130B.","For example, the dashed boundary lines depicted between the lower free layer 130L, the intermediate free layer 130M and the upper free layer 130U may be hypothetical.","The embodiments disclosed herein that are described with reference to FIGS.","3A and 3B, show that the free layers 130A and 130B may have different characteristics according to different concentrations of boron (B).","In some embodiments, the free layers 130A and 130B may each be formed in to have more layers than depicted in FIGS.","3A and 3B.","FIGS.","4A and 4B respectively depict conceptual magnetization directions of the respective areas, or layers, forming free layers 130A and 130B of magnetoresistive cells 100A and 100B in accordance with various embodiments disclosed herein.","A magnetization direction of each area, or layer, of the free layers 130A and 130B may be conceptually depicted using arrows, as shown in FIGS.","4A and 4B.","According to the embodiments disclosed herein, a magnetization direction of the pinned layer 114 is considered to be vertical or substantially vertical.","Referring to FIG.","4A, the free layer 130A of the magnetoresistive cell 100A in accordance with an embodiment disclosed herein may include a lower portion L having a vertical magnetization direction and an upper portion U having a magnetization direction that is oblique, or inclined, to a vertical magnetization direction.","For example, the lower portion L and the upper portion U of FIG.","4A may respectively correspond to the lower free layer 130L and the upper free layer 130U of FIG.","3A.","Based on the concentration of boron (B), the magnetization directions of the respective layers of the free layer 130A may be different.","More specifically, as the concentration of boron (B) decreases, the magnetization direction may become vertically oriented, and as the concentration of boron (B) increases, the magnetization direction may become more inclined with respect to the vertical (i.e., tending to become horizontally oriented).","That is, as the concentration of boron (B) decreases, the direction of magnetization of a layer may become oriented in a substantially vertical direction (i.e., in a direction that is substantially parallel to a direction from bottom to top in FIG.","4A), and as the concentration of boron (B) increases, the direction of magnetization may become more inclined with respect to the vertical direction (i.e., in a direction that is tending to become more horizontal and more parallel to a direction from right to left in FIG.","4A) Accordingly, the lower portion L may be a region including a relatively low concentration of boron (B), and the upper portion U may be a region including a relatively high concentration of boron (B).","For example, the lower portion L may be a substantially boron-free region, and the upper portion U may comprise a relatively high concentration of boron (B).","In one embodiment, the lower portion L may include a CoFe layer, and the upper portion U may include a CoFeB layer.","In other words, the lower portion L may be a relatively more crystallized region, whereas the upper portion U may be a relatively less crystallized region.","In FIG.","4A(A), the magnetization directions of the layers forming the free layer 130A are conceptually depicted for the situation in which the free layer 130A is in a low-resistance state.","In FIG.","4A(B), the magnetization directions of the layers forming the free layer 130A are conceptually depicted for the situation in which the free layer 130A is in a high resistance state.","Referring to FIG.","4A(A), if the magnetization directions of the layers forming the free layer 130A are the same as the magnetization direction of the pinned layer 114, the free layer 130A may be in a low-resistance state.","Referring to FIG.","4A(B), if the magnetization directions of the layers forming the free layer 130A are opposite to the magnetization direction of the pinned layer 114, the free layer 130A may be in a high-resistance state.","Accordingly, depending on the magnetization direction of the free layer 130A with respect to the magnetization direction of the pinned layer 114, the magnetoresistive cell 100A may have a logic “1” state or a logic “0” state.","As the magnetization direction of a layer forming the free layer 130A becomes vertical, the magnetization direction of that layer may be hard to change.","For example, when the magnetization direction of the lower portion L of the free layer 130A is vertical, retention characteristics of the lower portion L of the free layer 130A may be improved.","As the magnetization direction of a layer forming the free layer 130A become more horizontal, damping characteristics, that is, switching characteristics, of the free layer 130A may be improved, or made easier.","That is, as the magnetization direction of a layer forming the free layer 130A become horizontal, the magnetization direction of the layer may more easily change.","For example, the magnetization direction of the upper portion U of the free layer 130A, which has a relatively higher concentration of boron (B), may be easily switched, or changed, by a relatively small current.","Accordingly, the free layer 130A of the magnetoresistive cell 100A in accordance with an embodiment disclosed herein may have two magnetization directions in which each layer of the free layer 130A comprises correspondingly different concentrations of boron (B).","Accordingly, retention characteristics or switching characteristics may be excellent in comparison to the case in which a free layer of a magnetoresistive cell has a single (horizontal) magnetization direction.","If the free layer 130A has only one magnetization direction, switching characteristics may be poor if retention characteristics are good or, on the other hand, retention characteristics may be poor if switching characteristics are good.","Thus, if all of the magnetization directions of the free layer 130A are oblique with respect to a vertical direction (i.e., tending toward horizontal), the switching characteristics may be good, but the retention characteristics may be poor because the collective magnetization directions of the layers forming the free layer 130A are easily changed by a small current.","Additionally, if all of the magnetization directions of the layers forming the free layer 130A are vertical, the retention characteristics may be good, but the switching characteristics may be poor because the collective magnetization directions of the layers forming the free layer 130A are hard to change.","Accordingly, the free layer 130A in accordance with an embodiment disclosed herein may have superior retention characteristics in comparison to a free layer that has magnetization directions that are all in a direction that is oblique to a vertical direction, and may have superior switching characteristics in comparison to a free layer that has magnetization directions that are all in a vertical direction.","Referring to FIG.","4B, the free layer 130B of the magnetoresistive cell 100B in accordance with an embodiment disclosed herein may include a lower portion L having a vertical magnetization direction, an intermediate portion M having a slightly inclined magnetization direction, and an upper portion U having a heavily inclined magnetization direction.","For example, the lower portion L, the intermediate portion M, and the upper portion U may respectively correspond to the lower free layer 130L, the intermediate free layer 130M, and the upper free layer 130U depicted in FIG.","3B.","In FIG.","4B(A), the magnetization directions of the layers forming the free layer 130B are conceptually depicted for a situation in which the free layer 130B is in a low-resistance.","In FIG.","4B(B), the magnetization directions of the layers forming the free layer 130B are conceptually depicted for a situation in which the free layer 130B is in a high-resistance state.","Based on differences in the concentration of boron (B), the magnetization directions of the layers forming the free layer 130B may be different.","More specifically, the lower portion L, which has a relatively low concentration of boron (B) (for example, a substantially boron-free region), may have a vertical magnetization direction.","The intermediate portion M, which has an intermediate concentration of boron (B), may have a slightly inclined magnetization direction.","The upper portion U, which has a relatively high concentration of boron (B), may have a more significant inclined magnetization direction than the inclination of the magnetization direction of the intermediate portion M. The embodiments disclosed herein that are described with reference to FIGS.","4A and 4B, show that the magnetization directions of the free layers 130A and 130B may be set based on different concentrations of boron (B).","FIGS.","5A to 5P are vertical cross-sectional views for schematically describing a method of fabricating an MRAM in accordance with an embodiment of the subject matter disclosed herein.","FIG.","6 shows a flow diagram for a process 600 of fabricating an MRAM in accordance with the subject matter disclosed herein.","At operation 601, a switching device Sw may be formed on a substrate 10.Referring to FIG.","5A, the method of fabricating the MRAM in accordance with an embodiment disclosed herein may include forming an isolation region 12 defining an active region 11 on a substrate 10 using well-known techniques.","A gate structure 25 is formed on the active region 11 using well-known techniques.","A source area 21 and a drain area 22 are formed using well-known techniques in the active region 11 at both sides of the gate structure 25.A lower interlayer insulating layer 31 covering the gate structure 25 is formed using well-known techniques.","The substrate 10 may include a silicon wafer, a silicon-on-insulator (SOI) wafer or a semiconductor wafer having an epitaxial growth layer such as SiGe.","The isolation region 12 may include an insulating material, such as silicon oxide and/or silicon nitride, that fills a trench 12t.","The gate structure 25 may include a gate insulating layer 26 directly formed on the substrate 10 using well-known techniques.","A gate electrode 27 may be formed on the gate insulating layer 26 using well-known techniques.","A gate capping layer 28 is formed on the gate electrode 27 using well-known techniques.","Gate spacers 29 are formed using well-known techniques on side surfaces of the gate insulating layer 26, the gate electrode 27 and the gate capping layer 28.The gate insulating layer 26 may include oxidized silicon and/or a metal oxide.","The gate electrode 27 may include a conductive material, such as polysilicon, a metal, a metal alloy and/or a metal silicide.","The gate capping layer 28 and the gate spacers 29 may include silicon nitride, silicon oxynitride and/or silicon oxide.","The source area 21 and the drain area 22 may be formed using well-known techniques adjacent to both sides of the gate structure 25.The source area 21 and the drain area 22 may include a dopant, such as boron (B), phosphorous (P), and/or arsenic (As).","A lower interlayer insulating layer 31 may be formed using well-known techniques on the gate structure 25, the source area 21 and the drain area 22.The lower interlayer insulation layer 31 may include silicon oxide, such as tetraethylorthosilicate (TEOS) or high density plasma (HDP) oxide.","At operation 602 in FIG.","6, source and drain contact plugs 41 and 42, a source interconnection 50 and a lower electrode pad 55 may be formed.","Referring to FIG.","5B, the method may further include forming a source contact plug 41 in contact with the source area 21 by passing vertically through the lower interlayer insulating layer 31 using well-known techniques.","A drain contact plug 42 may be formed in contact with the drain area 22 by passing vertically the lower interlayer insulating layer 31 using well-known techniques.","A source interconnection 50 may be formed on the source contact plug 41 using well-known techniques.","A lower electrode pad 55 may be formed on the drain contact plug 42 using well-known techniques.","The source contact plug 41 and the drain contact plug 42 may include a conductive material, such as polysilicon, a metal, a metal alloy and/or a metal silicide.","The method may include performing a planarization process, such as chemical mechanical polishing (CMP), until upper surfaces of the lower interlayer insulating layer 31, the source contact plug 41, and the drain contact plug 42 are coplanar or substantially coplanar.","The source interconnection 50 and the lower electrode pad 55 may include a conductive material, such as polysilicon, a metal, a metal alloy and/or a metal silicide.","The source interconnection 50 may have a horizontally-extending line shape (i.e., in a direction substantially parallel to a direction into FIG.","5B.","The lower electrode pad 55 may have a circular or polygonal shape in a top view.","At operation 603 in FIG.","6, a lower electrode 56 may be formed.","Referring to FIG.","5C, the method may include forming an intermediate interlayer insulating layer 32 covering the source interconnection 50 and the lower electrode pad 55 using well-known techniques.","A lower electrode 56 may be formed using well-known techniques that is electrically connected to the lower electrode pad 55 by passing through the intermediate interlayer insulating layer 32 in substantially a vertical direction.","The intermediate interlayer insulating layer 32 may include an insulating material, for example, silicon oxide such as TEOS or HDP oxide.","The lower electrode 56 may include a conductive material, such as polysilicon, a metal, a metal alloy and/or a metal silicide.","The method may include performing a planarization process, such as CMP, until upper surfaces of the intermediate interlayer insulating layer 32 and the lower electrode 56 are coplanar or substantially coplanar.","At operation 604 in FIG.","6, layers for a ferromagnetic layer 110 may be formed.","Referring to FIG.","5D, the method may include forming a ferromagnetic layer 110 on the lower electrode 56 and the intermediate interlayer insulating layer 32 using well-known techniques.","The formation of the ferromagnetic layer 110 may include using well-known techniques to form a seed layer 111, a pinning layer 112 on the seed layer 111, an SAF layer 113 on the pinning layer 112, and a pinned layer 114 on the SAF layer 113.The seed layer 111 may include a tantalum (Ta) layer and/or ruthenium (Ru) layer.","The seed layer 111, for example, may be formed in a single layer that includes tantalum (Ta) or ruthenium (Ru), or a double layer that includes a lower tantalum (Ta) layer and an upper ruthenium (Ru) layer disposed on the lower tantalum (Ta) layer.","The pinning layer 112 may include a CoPt layer, a CoPd layer, an alloy layer of CoPt and CoPd, and/or a multilayer in which CoPt layers and CoPd layers are alternately stacked.","The SAF layer 113 may include an anti-ferromagnetic metal, such as ruthenium (Ru).","The pinned layer 114 may include a CoFe-based material.","For example, the pinned layer 114 may include CoFeB.","In other embodiments, the pinned layer 114 may include a CoFeB/Ta/CoFeB multilayer.","In still other embodiments, the pinned layer 114 may include a Co/B/CoFeB multilayer or a Co/W/CoFeB/W/CoFeB multilayer.","The formation of the seed layer 111, the pinning layer 112, the SAF layer 113, and the pinned layer 114 may include performing a well-known physical vapor deposition (PVD) process, such as sputtering.","In other embodiments, the pinning layer 112 may be formed by a metallic organic chemical vapor deposition (MOCVD) process.","At operation 605 in FIG.","6, a tunnel barrier layer 120 and a first preliminary free layer 131 may be formed.","Referring to FIG.","5E, the method may include forming a tunneling barrier layer 120 on the ferromagnetic layer 110, forming a first preliminary free layer 131 on the tunneling barrier layer 120, and forming a first buffer layer 141 on the first preliminary free layer 131 using well-known techniques.","The tunneling barrier layer 120 may include magnesium oxide (MgO).","More specifically, the tunneling barrier layer 120 may be formed by a magnesium (Mg) layer on the ferromagnetic layer 110 by performing a well-known deposition process, and oxidizing the magnesium (Mg) layer by performing a well-known oxidation process.","The first preliminary free layer 131 may include a CoFeB single layer, or a CoFeB/W/CoFeB multilayer.","The first preliminary free layer 131 may be formed by a well-known PVD process, such as sputtering.","The first buffer layer 141 may include a material having a lower boride-forming energy than that of cobalt (Co) or iron (Fe).","For example, the first buffer layer 141 may include any one of tantalum (Ta), hafnium (HD, zirconium (Zr), titanium (Ti), vanadium (V), yttrium (Y), scandium (Sc), molybdenum (Mo), and magnesium (Mg).","According to an embodiment, the first buffer layer 141 may include tantalum (Ta).","The first buffer layer 141 may be formed to have a thickness (in a vertical direction in FIG.","5E) that is capable of adequately absorbing boron atoms in the first preliminary free layer 131.For example, the first buffer layer 141 may have a thickness of several atomic layers, that is, several Ångstroms or several tens of nanometers.","In other embodiments, the first buffer layer 141 may be formed in such a manner that atoms forming the first buffer layer 141 are implanted or absorbed in the first preliminary free layer 131 or formed to have a single atomic layer.","At operation 606 in FIG.","6, a first annealing process may be performed.","Referring to FIG.","5F, the method may include performing a first annealing process so that boron (B) in the first preliminary free layer 131 is absorbed and diffused into the first buffer layer 141.Accordingly, the first buffer layer 141 may transition into a first boride layer 141a, and the first preliminary free layer 131 may transition into a second preliminary free layer 132 having a lower concentration of boron (B) than the first preliminary free layer 131.The first boride layer 141a may include a material of the first buffer layer 141 and boron (B).","For example, the first boride layer 141a may include tantalum boron (TaB), zirconium boron (ZrB), titanium boron (TiB), vanadium boron (VB), yttrium boron (YB), scandium boron (ScB), molybdenum boron (MoB), magnesium boron (MgB), cobalt boron (CoB), cobalt iron boron (CoFeB), or various other metal boride layers.","The boron (B) concentration in the second preliminary free layer 132 may be gradated.","That is, the concentration of boron (B) in the second preliminary free layer 132 may change from a relatively low concentration in a lower portion and a relatively higher concentration in an upper portion.","For example, a lower portion L of the second preliminary free layer 132 may have a relatively low concentration of boron (B), and an upper portion U of the second preliminary free layer 132 may have a relatively high concentration of boron (B).","The first annealing process may include heating the first preliminary free layer 131 to about 250 to about 500° C. under an atmospheric pressure or a vacuum.","The first annealing process may include a rapidly thermal anneal (RTA) process using a halogen lamp.","The first annealing process may be performed for about 10 to about 600 seconds.","As the temperature of annealing increases, the annealing time may correspondingly decrease, and as the temperature of annealing decreases, the annealing time may correspondingly increase.","The first annealing process may be performed at a temperature that is lower than a melting point of the first buffer layer 141.At operation 607 in FIG.","6, the first boride layer 141a may be removed.","Referring to FIG.","5G, the method may include removing the first boride layer 141a by performing an etching process.","The etching process may include a physical sputtering etching process using argon (Ar) or the like.","Referring to FIGS.","5F and 5G, the process of forming the first buffer layer 141, the first annealing process, and the etching process may be performed repeatedly.","For example, the method may include repeatedly performing the processes described with reference to FIGS.","5F and 5G until the concentration of boron (B) in the first preliminary free layer 131 is reduced to a desired level.","As the processes are repeated, the concentration of boron (B) in the lower portion L of the first preliminary free layer 131 may be gradually reduced to near zero, and the concentration of boron (B) in the upper portion U of the first preliminary free layer 131 also may be gradually reduced while being maintained at a higher boron (B) concentration level than the concentration of boron (B) in the lower portion L of the first preliminary free layer 131.At operation 608 in FIG.","6, a second buffer layer 142 may be formed on the second preliminary free layer 132.Referring to FIG.","5H, the method may include forming second buffer layer 142 on the second preliminary free layer 132.The first buffer layer 141 may include a material having a lower boride-forming energy than that of cobalt (Co) or iron (Fe).","For example, the second buffer layer 142 may include the same material as the first buffer layer 141.At operation 609 in FIG.","6, a second annealing process may be performed.","Referring to FIG.","5I, the method may include performing a second annealing process that additionally diffuses boron (B) in the second preliminary free layer 132 into the second buffer layer 142.Accordingly, the second buffer layer 142 may transition into a second boride layer 142a, and the second preliminary free layer 132 may transition into a free layer 130.The second annealing process may be performed similar to the first annealing process.","The second boride layer 142a may include the same material as the first boride layer 141a.","At operation 610, an oxidation process may be formed.","Referring to FIG.","5J, the method may include performing an oxidation process to transition the second boride layer 142a into an oxide layer 140.The oxidation process may include naturally oxidizing the second boride layer 142a by appropriately flowing O2 gas in a chamber at room temperature.","When heating the second boride layer 142a or flowing oxide radicals (O*) in the chamber, the second boride layer 142a may be very rapidly oxidized.","Accordingly, the oxidation process may include a natural oxidation process so that the second boride layer 142a is slowly oxidized.","Additionally, in order to control an oxidation rate, an inert gas such as helium (He), neon (Ne), argon (Ar), or xenon (Xe), or a nitrogen (N2) gas may flow into the chamber simultaneously with the oxygen (O2) gas.","The oxide layer 140 may include the materials in the first and second buffer layers 141 and 142 and an oxide.","For example, the oxide layer 140 may include tantalum oxide (TaO), zirconium oxide (ZrO), titanium oxide (TiO), vanadium oxide (VO), yttrium oxide (YO), scandium oxide (ScO), molybdenum oxide (MoO), magnesium oxide (MgO), cobalt oxide (CoO), cobalt iron oxide (CoFeO), or other various metal oxides.","In some embodiments, the oxide layer 140 may further include boron (B).","For example, the oxide layer 140 may include tantalum boron oxide (TaBO), zirconium boron oxide (ZrBO), titanium boron oxide (TiBO), vanadium boron oxide (VBO), yttrium boron oxide (YBO), scandium boron oxide (ScBO), molybdenum boron oxide (MoBO), magnesium boron oxide (MgBO), cobalt boron oxide (CoBO), cobalt iron boron oxide ((CoFe)BO), or other various metal boron oxide.","At operation 611, a capping layer 150 may be formed on the oxide layer 140.Referring to FIG.","5K, the method may include forming a capping layer 150 on the oxide layer 140.The capping layer 150 may include a metal, such as tantalum (Ta).","The capping layer 150 may be formed by performing a well-known PVD process, such as sputtering.","At operation 612, a hardmask 160 is formed on the capping layer 150.Referring to FIG.","5L, the method may include forming a hardmask 160 on the capping layer 150 using a well-known technique.","The hardmask 160 may include tantalum (T), titanium (Ti), ruthenium (Ru), and/or another metal.","At operation 613, magnetoresistive cells 100 may be formed.","Referring to FIG.","5M, the method may include using a well-known etching technique to form a magnetoresistive cell 100 by etching the capping layer 150, the free layer 130, the tunneling barrier layer 120, and the ferromagnetic layer 110 using the hardmask 160 as an etch mask.","The hardmask 160 may remain on the capping layer 150.In other embodiments, the hardmask 160 may be removed.","At operation 614, a liner 170 may be formed surrounding the magnetoresistive cells 100.Referring to FIG.","5N, the method may include forming a liner 170 conformally surrounding the magnetoresistive cell 100 using a well-known technique.","An upper interlayer insulating layer 33 may be formed covering the magnetoresistive cell 100 and the liner 170 using a well-known technique.","The liner 170 may be conformally formed on upper and side surfaces of the magnetoresistive cell and an upper surface of the intermediate interlayer insulating layer 32.The liner 170 may include a metal oxide, such as aluminum oxide (Al2O3) or silicon nitride (SiN).","The upper interlayer insulating layer 33 may include silicon oxide (SiO2).","At operation 615, an upper electrode hole 60H may be formed.","Referring to FIG.","5O, the method may include forming using a well-known technique an upper electrode hole 60H that exposes the hardmask 160 of the magnetoresistive cell 100 that passes substantially vertically through the upper interlayer insulating layer 33 and the liner 170.The upper electrode hole 60H may expose upper and side surfaces of the hardmask 160.The upper electrode hole 60H may partially expose a side surface of the capping layer 150.A diameter, or horizontal width, of the upper electrode hole 60H may be greater than a horizontal width or a horizontal length of an upper surface of the hardmask 160 of the magnetoresistive cell 100.At operation 616, an upper electrode plug 65 may be formed.","Referring to FIG.","5P, the method may include conformally forming an upper electrode barrier layer 61 on sidewalls of the upper electrode hole 60H and the upper surface of the hardmask 160 using a well-known technique.","An upper electrode plug 65 may be formed using a well-known technique that fills the upper electrode hole 60H in the upper electrode barrier layer 61.The upper electrode barrier layer 61 may include titanium (Ti), tantalum (Ta), titanium nitride (TiN), tantalum nitride (TaN) or another barrier metal or metal compound.","The upper electrode plug 65 may include a metal, such as tungsten (W) or copper (Cu).","Next, referring again to FIGS.","2A and 3A, the method may include forming a bit line 70 on the upper electrode 60 and the upper interlayer insulating layer 33 using a well-known technique.","The formation of the bit line 70 may include conformally forming a bit line barrier layer 71 and forming a bit line interconnection 75 on the bit line barrier layer 71.The bit line barrier layer 71 may include titanium (Ti), tantalum (Ta), titanium nitride (TiN), tantalum nitride (TaN), or another barrier metal or metal compound.","The bit line interconnection 75 may include a metal, such as tungsten (W) or copper (Cu).","FIG.","6 illustrates a method of fabricating an MRAM in accordance with another embodiment disclosed herein.","Referring to FIG.","6, the method of fabricating the MRAM in accordance with an embodiment disclosed herein may include forming the first buffer layer 141 on the first preliminary free layer 131 by performing the processes described with reference to FIGS.","5A to 5E.","Additionally, boron (B) atoms may be diffused in the first and second preliminary free layers 131 and 132 into the first and second buffer layers 141 and 142 to form the free layer 130B, as depicted in FIG.","3B, by repeatedly performing the processes described with reference to FIGS.","5F to 5I.","In an embodiment, a third buffer layer and a third preliminary free layer may temporarily be formed.","Next, the method may include performing the processes described with reference to FIGS.","5J to 5P, and forming a bit line 70 on the upper electrode 60 and the upper interlayer insulating layer 33, referring again to FIGS.","2A and 3B.","FIG.","8 is a block diagram schematically depicting components that may include one or more magnetoresistive cells formed according to the subject matter disclosed herein.","In detail, the electronic circuit board 1200 may include a microprocessor 1230 disposed on a circuit board 1225, a main storage circuit 1235 and a supplementary storage circuit 1240 that communicate with the microprocessor 1230, an input signal processing circuit 1245 that transfers a command to the microprocessor 1230, an output signal processing circuit 1250 that receives a command from the microprocessor 1230, and a communication signal processing unit 1255 that exchanges an electrical signal with other circuit boards.","It may be understood that each of arrows refers to a path through an electrical signal is transferred.","The microprocessor 1230 may receive and process various electrical signals to output a result of the processing and may control the other elements of the electronic circuit board 1200.It may be understood that the microprocessor 1230 is, for example, a central processing unit (CPU) and a main control unit (MCU).","The main storage circuit 1235 may temporarily store data, which is always or frequently required by the microprocessor 1230, before-processing data, and after-processing data.","The main storage circuit 1235 may need a fast response, and thus may be configured with a semiconductor memory chip.","In detail, the main storage circuit 1235 may be a semiconductor memory called a cache.","The main storage circuit 1235 may be configured with static random access memory (SRAM), dynamic random access memory (DRAM), resistive random access memory (RRAM), a magnetoresistive random access memory (MRAM) and application semiconductor memories thereof (for example, a utilized RAM, a ferro-electric RAM, a fast cycle RAM, a phase changeable RAM, a magnetic RAM, and/or the like) or may be configured with other semiconductor memories.","In one embodiment, the main storage circuit 1235 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.","Additionally, the main storage circuit 1235 may include a random access memory (RAM) irrespective of volatility/non-volatility capabilities.","In the present embodiment, the main storage circuit 1235 may include one or more semiconductor chips, semiconductor packages, or semiconductor modules according to the exemplary embodiments.","The supplementary storage circuit 1240 may be a large-capacity storage element and may be configured with a nonvolatile semiconductor memory, such as flash memory or the like, or a hard disk drive using a magnetic field.","Alternatively, the supplementary storage circuit 1240 may be configured with a compact disk drive using light.","Although the supplementary storage circuit 1240 does not need a fast speed in comparison with the main storage circuit 1235, the supplementary storage circuit 1240 may be applied to a case of needing to store large-scale data.","The supplementary storage circuit 1240 may include a nonvolatile storage element irrespective of random/nonrandom capabilities.","In one embodiment, the supplementary storage circuit 1240 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.","The input signal processing circuit 1245 may convert an external command into an electrical signal or may transfer an electrical signal, transferred from the outside, to the microprocessor 1230.A command or an electrical signal transferred from the outside may be an operation command, an electrical signal that is to be processed, or data that are to be stored.","The input signal processing circuit 1245 may be a terminal signal processing circuit that processes a signal transmitted from a keyboard, a mouse, a touch pad, an image recognition device, or various sensors, an image signal processing circuit that processes an image signal transferred from a scanner or a camera, various sensors, an input signal interface, or the like.","The output signal processing circuit 1250 may be an element for transmitting an electrical signal, generated through processing by the microprocessor 1230, to the outside.","For example, the output signal processing circuit 1250 may be a graphic card, an image processor, an optical converter, a beam panel card, one of various functional interface circuits, or the like.","The communication circuit 1255 may be an element for directly exchanging an electrical signal with other electronic systems or other circuit boards without undergoing the input signal processing circuit 1245 or the output signal processing circuit 1250.For example, the communication circuit 1255 may include a modem, a LAN card, various interfaces, and/or the like of a personal computer (PC) system.","The communication circuit 1255 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.","FIG.","9 is a block diagram schematically depicting an electronic system 1300 that includes one or more magnetoresistive memory cells according to the subject matter disclosed herein.","In detail, the electronic system 1300 according to an embodiment may include a control unit 1365, an input unit 1370, an output unit 1375, and a storage unit 1380.Also, the electronic system 1300 may further include a communication unit 1385 and/or an operation unit 1390.The control unit 1365 may overall control the electronic system 1300 and elements.","The control unit 1365 may be understood as a CPU or a central control unit, and may include the electronic circuit board 1200 (see FIG.","8).","Also, the control unit 1365 may include a semiconductor device that may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.","The input unit 1370 may transfer an electrical command signal to the control unit 1365.The input unit 1370 may be a keyboard, a keypad, a touch pad, an image recognizer such as a scanner, or various input sensors.","The input unit 1370 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.","The output unit 1375 may receive the electrical command signal from the control unit 1365 to output a result of processing by the electronic system 1300.The output unit 1375 may be a monitor, a printer, a beam irradiator, or one of various mechanical devices.","The output unit 1375 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.","The storage unit 1380 may be an element for temporarily or permanently storing an electrical signal, which is to be processed by the control unit 1165, and an electrical signal generated through processing by the control unit 1165.The storage unit 1380 may be physically or electrically connected or coupled to the control unit 1365.The storage unit 1380 may be a semiconductor memory, a magnetic storage device such as a hard disk or the like, an optical storage device such as a compact disk or the like, a server having a data storing function, or the like.","Also, the storage unit 1380 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.","The communication unit 1385 may receive an electrical command signal from the control unit 1365 and may transfer the electrical command signal to another electronic system, or may receive an electrical command signal from the other electronic system.","The communication unit 1385 may be a modem, a wired transmission/reception device, such as an LAN card, a wireless transmission/reception device such as a Wibro interface, an infrared port, or the like.","Also, the communication unit 1385 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.","The operation unit 1390 may perform a physical or mechanical operation according to a command of the control unit 1365.For example, the operation unit 1390 may be an element, which performs a mechanical operation, such as a plotter, an indicator, an up/down operation, or the like.","The electronic system 1300 according to an exemplary embodiment may include a computer, a network server, a networking printer, or a scanner, a wireless controller, a mobile communication terminal, an exchanger, an electronic device performs a programmed operation, and/or the like.","Moreover, the electronic system 1300 may be applied to mobile phones, MP3 players, navigation devices, portable multimedia players (PMPs), solid state disks (SSDs), household appliances, etc.","As set forth above, since a magnetoresistive cell and an MRAM in accordance with embodiments disclosed herein include an oxide layer containing boron (B) on a free layer, physical characteristics of the free layer may be maintained and/or improved.","Additionally, a method of forming a free layer, a magnetoresistive cell, and an MRAM in accordance with embodiments disclosed herein may include forming a preliminary free magnetic layer that includes boron (B), and forming a free layer magnetic layer by removing boron (B) from the preliminary free layer.","Accordingly, the resulting free layer may include both a crystallized and substantially boron-free region, and an amorphous and boron-containing region.","Further, the method of forming a free layer, a magnetoresistive cell, and an MRAM in accordance with the embodiments disclosed herein may include forming a preliminary free magnetic layer that includes boron (B), forming a buffer layer absorbing boron (B) on the preliminary free magnetic layer, and forming an oxide layer by oxidizing the boron-absorbed buffer layer.","Accordingly, the process of forming the free layer, the magnetoresistive cell, and an MRAM and the magnetoresistive cell formed thereby may have excellent characteristics.","The foregoing was for illustration of the embodiments only and is not to be construed as limiting thereof.","Although a few embodiments have been described, those skilled in the art will readily appreciate that many modifications are possible without materially departing from the novel teachings and advantages."]],"string":"[\n [\n \"FREE LAYER, MEGNETORESISTIVE CELL, AND MEGNETORESISTIVE RANDOM ACESS MEMORY DEVICE HAVING LOW BORON CONCENTRATION REGION AND HIGH BORON CONCENTRATION REGION, AND METHODS OF FABRICATING THE SAME\",\n \"A method of forming a magnetoresistive memory device includes forming a ferromagnetic layer, forming a tunneling barrier layer on the ferromagnetic layer, forming a first preliminary free magnetic layer (free layer) containing boron (B) on the tunneling barrier layer, forming a first buffer layer on the first preliminary free layer, performing a first annealing process to transition the first preliminary free layer to form a second preliminary free layer and the first buffer layer to form a first boride layer, performing an etching process to remove the first boride layer, forming a second buffer layer on the second preliminary free layer, performing a second annealing process to transition the second preliminary free layer to form a free layer and the second buffer layer to form a second boride layer, and performing an oxidation process to transition the second boride layer to an oxide layer.\"\n ],\n [\n \"1.A magnetoresistive memory device, comprising: a magnetoresistive cell disposed on a lower electrode; and an upper electrode disposed on the magnetoresistive cell, wherein the magnetoresistive cell comprises: a ferromagnetic layer; a tunneling barrier layer disposed on the ferromagnetic layer; a free magnetic layer disposed on the tunneling barrier layer; an oxide layer disposed on the free magnetic layer; and a capping layer disposed on the oxide layer, and wherein the free magnetic layer comprises: a first region having a relatively low concentration of boron (B) and disposed in the free magnetic layer to be close to the tunneling barrier layer; and a second region having a relatively high concentration of boron (B) and disposed in the free magnetic layer to be far from the tunneling barrier layer.\",\n \"2.The magnetoresistive memory device of claim 2, wherein the first region includes a cobalt iron (CoFe) alloy, and the second region includes an iron boron (FeB) compound.\",\n \"3.The magnetoresistive memory device of claim 2, wherein the first region is thicker than the second region.\",\n \"4.The magnetoresistive memory device of claim 2, wherein the first region and the second region have a gradually gradated concentration of boron (B).\",\n \"5.The magnetoresistive memory device of claim 2, wherein the oxide layer includes any one of tantalum oxide (TaO), titanium oxide (TiO) and magnesium oxide (MgO).\",\n \"6.The magnetoresistive memory device of claim 2, wherein the oxide layer includes boron (B).\",\n \"7.The magnetoresistive memory device of claim 6, wherein a concentration of boron (B) in the oxide layer is greater than a concentration of boron (B) in the first region.\",\n \"8.The magnetoresistive memory device of claim 2, wherein the ferromagnetic layer includes a seed layer, a pinning layer disposed on the seed layer, an anti-ferromagnetic layer disposed on the pinning layer, and a pinned layer disposed on the anti-ferromagnetic layer.\",\n \"9.The magnetoresistive memory device of claim 8, wherein the seed layer includes tantalum (Ta), ruthenium (Ru) or iridium (Ir).\",\n \"10.The magnetoresistive memory device of claim 8, wherein the pinning layer includes any one of a cobalt platinum (CoPt) layer, a cobalt palladium (CoPd) layer, an alloy layer of cobalt platinum (CoPt) and cobalt palladium (CoPd), and a multilayer in which a cobalt platinum (CoPt) layer and a cobalt palladium (CoPd) layer are stacked.\",\n \"11.A magnetoresistive memory device, comprising: a magnetoresistive cell disposed on a lower electrode; and an upper electrode disposed on the magnetoresistive cell, wherein the magnetoresistive cell comprises: a ferromagnetic layer; a tunneling barrier layer disposed on the ferromagnetic layer; a free magnetic layer disposed on the tunneling barrier layer; an oxide layer including boron (B) and disposed on the free magnetic layer; and a capping layer disposed on the oxide layer, and wherein the free magnetic layer has a gradually gradated concentration of boron (B) from a lower portion having a relatively low concentration of boron (B) to an upper portion having a relatively high concentration of boron (B).\",\n \"12.The magnetoresistive memory device of claim 11, further comprising: a gate structure disposed on a substrate; a source area disposed in the substrate at a first side of the gate structure; a source contact plug disposed on the source area; a source interconnection disposed on the source contact plug; a drain area disposed in the substrate at a second side of the gate structure; a drain contact plug disposed on the drain area; and a drain pad disposed on the drain contact plug, wherein the lower electrode is disposed on the drain pad.\",\n \"13.The magnetoresistive memory device of claim 12, wherein the source interconnection has a horizontally-extending line shape, and the drain pad has a circular or polygonal shape in a top view.\",\n \"14.The magnetoresistive memory device of claim 12, wherein the source interconnection and the drain pad are formed at substantially the same level.\",\n \"15.The magnetoresistive memory device of claim 11, wherein the lower portion of the free layer includes boron-free cobalt iron (CoFe) layer, the upper portion of the free layer includes cobalt iron boron (CoFeB) layer, and the oxide layer includes tantalum boron oxide (TaBO).\",\n \"16.A magnetoresistive memory cell, comprising a ferromagnetic layer, the ferromagnetic layer comprising a first surface and a second surface that is opposite the first surface of the ferromagnetic layer; a tunnel barrier layer on the ferromagnetic layer, the tunnel barrier comprising a first surface and a second surface that is opposite the first surface of the tunnel barrier layer, the first surface of the tunnel barrier layer being proximate to the second surface of the ferromagnetic layer; and a free magnetic layer on the tunnel barrier layer, the free magnetic layer comprising a first surface and a second surface that is opposite the first surface of the free magnetic layer, the first surface of the free magnetic layer being proximate to the second surface of the tunnel barrier layer, the free magnetic layer further comprising a first region that is proximate to the second surface of the tunnel barrier layer and a second region that is distal to the second surface of the tunnel barrier layer, and the first region comprising a concentration of boron that is less that a concentration of boron of the second region.\",\n \"17.The magnetoresistive memory cell of claim 16, wherein the first region is substantially free of boron.\",\n \"18.The magnetoresistive memory cell of claim 16, wherein the first region includes a cobalt iron (CoFe) alloy, and the second region includes a cobalt iron boron (CoFeB) compound.\",\n \"19.The magnetoresistive memory cell of claim 16, wherein a thickness of the first region is greater than a thickness of the second region.\",\n \"20.The magnetoresistive memory cell of claim 16, wherein the magnetoresistive memory cell is part of a magnetoresistive random access memory.\"\n ],\n [\n \" BACKGROUND Embodiments disclosed herein relate to a magnetoresistive memory device, and, more specifically, a free layer, a magnetoresistive cell, and a magnetoresistive memory device including a region having a relatively low concentration of boron (B) and a region having a relatively high concentration of boron (B), and methods of fabricating the same.\"\n ],\n [\n \" SUMMARY Embodiments disclosed herein provide a free layer including a region having a relatively low concentration of boron (B) and a region having a relatively high concentration of boron (B), and a magnetoresistive cell having the free layer and a magnetoresistive memory device having the free layer.\",\n \"Embodiments disclosed herein provide a free layer including a substantially boron-free region and a boron-containing region, and a magnetoresistive cell having the free layer and a magnetoresistive memory device having the free layer.\",\n \"Embodiments disclosed herein provide methods of fabricating a free layer including a region having a relatively low concentration of boron (B) and a region having a relatively high concentration of boron (B), and methods of fabricating a magnetoresistive cell having the free layer and fabricating a magnetoresistive memory device having the free layer.\",\n \"Embodiments disclosed herein provide methods of fabricating a free layer including a substantially boron-free region and a boron-containing region, and methods of fabricating a magnetoresistive cell having the free layer, and fabricating a magnetoresistive memory device having the free layer.\",\n \"Embodiments disclosed herein provide methods of fabricating a free layer having a gradated concentration of boron (B), and methods of fabricating a magnetoresistive cell having the free layer, and fabricating a magnetoresistive memory device having the free layer.\",\n \"The technical features of the embodiments disclosed herein are not limited to the above disclosure; other features and advantages may become apparent to those of ordinary skill in the art based on the following descriptions.\",\n \"In accordance with an aspect of the subject matter disclosed herein, a method of forming a magnetoresistive memory device includes forming a magnetic layer, forming a tunneling barrier layer on the magnetic layer, forming a first preliminary free magnetic layer (free layer) containing boron (B) on the tunneling barrier layer, forming a first buffer layer on the first preliminary free layer, performing a first annealing process to transition the first preliminary free layer to form a second preliminary free layer and the first buffer layer to form a first boride layer, performing an etching process to remove the first boride layer, forming a second buffer layer on the second preliminary free layer, performing a second annealing process to transition the second preliminary free layer to form a free layer and the second buffer layer to form a second boride layer, and performing an oxidation process to transition the second boride layer to an oxide layer.\",\n \"In accordance with another aspect of the subject matter disclosed herein, a method of forming a magnetoresistive memory device includes forming a magnetic layer, forming a tunneling barrier layer on the magnetic layer, forming a first preliminary free magnetic layer (free layer) containing boron (B) on the tunneling barrier layer, forming a first buffer layer on the first preliminary free layer, performing a first annealing process to transition the first preliminary free layer to form a second preliminary free layer and the first buffer layer to form a first boride layer, performing a first etching process to remove the first boride layer, forming a second buffer layer on the second preliminary free layer, performing a second annealing process to transition the second preliminary free layer to form a free layer and the second buffer layer to form a second boride layer, performing a second etching process to remove the second boride layer, and forming an oxide layer on the free layer.\",\n \"In accordance with still another aspect of the subject matter disclosed herein, a magnetoresistive memory device includes a magnetoresistive cell disposed on a lower electrode and an upper electrode disposed on the magnetoresistive cell.\",\n \"The magnetoresistive cell includes a magnetic layer, a tunneling barrier layer disposed on the magnetic layer, a free magnetic layer (free layer) disposed on the tunneling barrier layer, an oxide layer disposed on the free layer, and a capping layer disposed on the oxide layer.\",\n \"The free layer includes a first region having a relatively low concentration of boron (B) and disposed to be close to the tunneling barrier layer and a second region having a relatively high concentration of boron (B) and disposed to be far from the tunneling barrier layer.\",\n \"In accordance with still another aspect of the subject matter disclosed herein, a magnetoresistive memory device includes a magnetoresistive cell disposed on a lower electrode, and an upper electrode disposed on the magnetoresistive cell.\",\n \"The magnetoresistive cell includes a magnetic layer, a tunneling barrier layer disposed on the magnetic layer, a free magnetic layer (free layer) disposed on the tunneling barrier layer, an oxide layer including boron (B) and disposed on the free layer, and a capping layer disposed on the oxide layer.\",\n \"The free layer has a gradually gradated concentration of boron (B) from a lower portion having a relatively low concentration of boron (B) to an upper portion having a relatively high concentration of boron (B).\",\n \"In accordance with an aspect of the subject matter disclosed herein, a magnetoresistive memory cell comprises: a ferromagnetic layer in which the ferromagnetic layer comprises a first surface and a second surface that is opposite the first surface of the ferromagnetic layer; a tunnel barrier layer on the ferromagnetic layer in which the tunnel barrier comprises a first surface and a second surface that is opposite the first surface of the tunnel barrier layer and in which the first surface of the tunnel barrier layer is proximate to the second surface of the ferromagnetic layer; and a free magnetic layer on the tunnel barrier layer in which the free magnetic layer comprises a first surface and a second surface that is opposite the first surface of the free magnetic layer, in which the first surface of the free magnetic layer is proximate to the second surface of the tunnel barrier layer, in which the free magnetic layer further comprises a first region that is proximate to the second surface of the tunnel barrier layer and a second region that is distal to the second surface of the tunnel barrier layer, and in which the first region comprises a concentration of boron that is less that a concentration of boron of the second region.\",\n \"In accordance with an aspect of the subject matter disclosed herein, a method of forming a magnetoresistive memory device comprises: forming a ferromagnetic layer in which the ferromagnetic layer comprising a first surface and a second surface that is opposite the first surface of the ferromagnetic layer; forming a tunnel barrier layer on the ferromagnetic layer in which the tunnel barrier comprises a first surface and a second surface that is opposite the first surface of the tunnel barrier layer, in which the first surface of the tunnel barrier layer is proximate to the second surface of the ferromagnetic layer; and forming a free magnetic layer on the tunnel barrier layer in which the free magnetic layer comprises a first surface and a second surface that is opposite the first surface of the free magnetic layer, in which the first surface of the free magnetic layer is proximate to the second surface of the tunnel barrier layer, the free magnetic layer further comprises a first region that is proximate to the second surface of the tunnel barrier layer and a second region that is distal to the second surface of the tunnel barrier layer, and in which the first region comprises a concentration of boron that is less that a concentration of boron of the second region.\",\n \"Details of other embodiments are included in the detailed description and drawings.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. patent application Ser.\",\n \"No.\",\n \"15/157,399, filed on May 17, 2016, which claims priority under 35 U.S.C.\",\n \"§ 119 to Korean Patent Application No.\",\n \"10-2015-0181836 filed on Sep. 17, 2015, the disclosure of which is hereby incorporated by reference in its entirety.\",\n \"BACKGROUND Embodiments disclosed herein relate to a magnetoresistive memory device, and, more specifically, a free layer, a magnetoresistive cell, and a magnetoresistive memory device including a region having a relatively low concentration of boron (B) and a region having a relatively high concentration of boron (B), and methods of fabricating the same.\",\n \"DESCRIPTION OF RELATED ART Magnetoresistive random access memory (MRAM) devices, in particular, spin transfer torque MRAM (STT-MRAM) devices, are being spotlighted as a next-generation memory to replace dynamic random access memory (DRAM) devices because MRAM devices are operated at a low current level, enable random access, and have non-volatile characteristics.\",\n \"Present technical challenges associated with the MRAM devices include preserving data for a long time and reducing power consumption.\",\n \"It is known that retention characteristics for preserving data for a long time become better as a magnetization direction of a free magnetic layer (free layer) is verticalized, or made more vertical.\",\n \"However, in order to reduce power consumption, it is advantageous for the magnetization direction of the free layer to be horizontal to so that the direction of the magnetization of the free layer changes, or switches, at a low current level.\",\n \"The magnetization direction of the free layer may be changed based on a concentration of boron (B) in the free layer.\",\n \"According to various embodiments of the subject matter disclosed herein, the free layer may include regions having different concentrations of boron (B).\",\n \"Accordingly, data retention characteristics may be improved, and power consumption may be reduced.\",\n \"SUMMARY Embodiments disclosed herein provide a free layer including a region having a relatively low concentration of boron (B) and a region having a relatively high concentration of boron (B), and a magnetoresistive cell having the free layer and a magnetoresistive memory device having the free layer.\",\n \"Embodiments disclosed herein provide a free layer including a substantially boron-free region and a boron-containing region, and a magnetoresistive cell having the free layer and a magnetoresistive memory device having the free layer.\",\n \"Embodiments disclosed herein provide methods of fabricating a free layer including a region having a relatively low concentration of boron (B) and a region having a relatively high concentration of boron (B), and methods of fabricating a magnetoresistive cell having the free layer and fabricating a magnetoresistive memory device having the free layer.\",\n \"Embodiments disclosed herein provide methods of fabricating a free layer including a substantially boron-free region and a boron-containing region, and methods of fabricating a magnetoresistive cell having the free layer, and fabricating a magnetoresistive memory device having the free layer.\",\n \"Embodiments disclosed herein provide methods of fabricating a free layer having a gradated concentration of boron (B), and methods of fabricating a magnetoresistive cell having the free layer, and fabricating a magnetoresistive memory device having the free layer.\",\n \"The technical features of the embodiments disclosed herein are not limited to the above disclosure; other features and advantages may become apparent to those of ordinary skill in the art based on the following descriptions.\",\n \"In accordance with an aspect of the subject matter disclosed herein, a method of forming a magnetoresistive memory device includes forming a magnetic layer, forming a tunneling barrier layer on the magnetic layer, forming a first preliminary free magnetic layer (free layer) containing boron (B) on the tunneling barrier layer, forming a first buffer layer on the first preliminary free layer, performing a first annealing process to transition the first preliminary free layer to form a second preliminary free layer and the first buffer layer to form a first boride layer, performing an etching process to remove the first boride layer, forming a second buffer layer on the second preliminary free layer, performing a second annealing process to transition the second preliminary free layer to form a free layer and the second buffer layer to form a second boride layer, and performing an oxidation process to transition the second boride layer to an oxide layer.\",\n \"In accordance with another aspect of the subject matter disclosed herein, a method of forming a magnetoresistive memory device includes forming a magnetic layer, forming a tunneling barrier layer on the magnetic layer, forming a first preliminary free magnetic layer (free layer) containing boron (B) on the tunneling barrier layer, forming a first buffer layer on the first preliminary free layer, performing a first annealing process to transition the first preliminary free layer to form a second preliminary free layer and the first buffer layer to form a first boride layer, performing a first etching process to remove the first boride layer, forming a second buffer layer on the second preliminary free layer, performing a second annealing process to transition the second preliminary free layer to form a free layer and the second buffer layer to form a second boride layer, performing a second etching process to remove the second boride layer, and forming an oxide layer on the free layer.\",\n \"In accordance with still another aspect of the subject matter disclosed herein, a magnetoresistive memory device includes a magnetoresistive cell disposed on a lower electrode and an upper electrode disposed on the magnetoresistive cell.\",\n \"The magnetoresistive cell includes a magnetic layer, a tunneling barrier layer disposed on the magnetic layer, a free magnetic layer (free layer) disposed on the tunneling barrier layer, an oxide layer disposed on the free layer, and a capping layer disposed on the oxide layer.\",\n \"The free layer includes a first region having a relatively low concentration of boron (B) and disposed to be close to the tunneling barrier layer and a second region having a relatively high concentration of boron (B) and disposed to be far from the tunneling barrier layer.\",\n \"In accordance with still another aspect of the subject matter disclosed herein, a magnetoresistive memory device includes a magnetoresistive cell disposed on a lower electrode, and an upper electrode disposed on the magnetoresistive cell.\",\n \"The magnetoresistive cell includes a magnetic layer, a tunneling barrier layer disposed on the magnetic layer, a free magnetic layer (free layer) disposed on the tunneling barrier layer, an oxide layer including boron (B) and disposed on the free layer, and a capping layer disposed on the oxide layer.\",\n \"The free layer has a gradually gradated concentration of boron (B) from a lower portion having a relatively low concentration of boron (B) to an upper portion having a relatively high concentration of boron (B).\",\n \"In accordance with an aspect of the subject matter disclosed herein, a magnetoresistive memory cell comprises: a ferromagnetic layer in which the ferromagnetic layer comprises a first surface and a second surface that is opposite the first surface of the ferromagnetic layer; a tunnel barrier layer on the ferromagnetic layer in which the tunnel barrier comprises a first surface and a second surface that is opposite the first surface of the tunnel barrier layer and in which the first surface of the tunnel barrier layer is proximate to the second surface of the ferromagnetic layer; and a free magnetic layer on the tunnel barrier layer in which the free magnetic layer comprises a first surface and a second surface that is opposite the first surface of the free magnetic layer, in which the first surface of the free magnetic layer is proximate to the second surface of the tunnel barrier layer, in which the free magnetic layer further comprises a first region that is proximate to the second surface of the tunnel barrier layer and a second region that is distal to the second surface of the tunnel barrier layer, and in which the first region comprises a concentration of boron that is less that a concentration of boron of the second region.\",\n \"In accordance with an aspect of the subject matter disclosed herein, a method of forming a magnetoresistive memory device comprises: forming a ferromagnetic layer in which the ferromagnetic layer comprising a first surface and a second surface that is opposite the first surface of the ferromagnetic layer; forming a tunnel barrier layer on the ferromagnetic layer in which the tunnel barrier comprises a first surface and a second surface that is opposite the first surface of the tunnel barrier layer, in which the first surface of the tunnel barrier layer is proximate to the second surface of the ferromagnetic layer; and forming a free magnetic layer on the tunnel barrier layer in which the free magnetic layer comprises a first surface and a second surface that is opposite the first surface of the free magnetic layer, in which the first surface of the free magnetic layer is proximate to the second surface of the tunnel barrier layer, the free magnetic layer further comprises a first region that is proximate to the second surface of the tunnel barrier layer and a second region that is distal to the second surface of the tunnel barrier layer, and in which the first region comprises a concentration of boron that is less that a concentration of boron of the second region.\",\n \"Details of other embodiments are included in the detailed description and drawings.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The foregoing and other features and advantages of the subject matter disclosed herein will be apparent from the more particular description of example embodiments, as illustrated in the accompanying drawings in which like reference numerals denote the same respective parts throughout the different views.\",\n \"The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the subject matter disclosed herein.\",\n \"In the drawings: FIG.\",\n \"1 is an equivalent circuit diagram of a unit cell of a magnetoresistive random access memory (MRAM) in accordance with the subject matter disclosed herein; FIGS.\",\n \"2A and 2B are vertical cross-sectional views schematically illustrating MRAM devices 200A and 200B in accordance with embodiments disclosed herein; FIGS.\",\n \"3A and 3B are vertical cross-sectional views conceptually illustrating free layers 130A and 130B with regard to the concentration of boron (B) in accordance with various embodiments disclosed herein; FIGS.\",\n \"4A and 4B conceptually illustrate magnetization directions of the free layers 130A and 130B of magnetoresistive cells 100A and 100B in accordance with various embodiments disclosed herein; FIGS.\",\n \"5A to 5P are vertical cross-sectional views for schematically describing a method of fabricating an MRAM in accordance with the subject matter disclosed herein; FIG.\",\n \"6 shows a flow diagram for a process 600 of fabricating an MRAM in accordance with the subject matter disclosed herein; FIG.\",\n \"7 illustrates a method of fabricating an MRAM in accordance with an extended embodiment disclosed herein; FIG.\",\n \"8 is a block diagram schematically depicting components that may include one or more magnetoresistive cells formed according to the subject matter disclosed herein; and FIG.\",\n \"9 is a block diagram schematically depicting an electronic system that includes one or more magnetoresistive memory cells according to the subject matter disclosed herein.\",\n \"DETAILED DESCRIPTION OF THE EMBODIMENTS Various embodiments will now be described more fully with reference to the accompanying drawings in which some embodiments are shown.\",\n \"The subject matter disclosed herein may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein.\",\n \"Rather, these embodiments are disclosed so that this disclosure is thorough and complete and fully conveys the subject matter disclosed herein to those skilled in the art.\",\n \"Accordingly, all such modifications are intended to be included within the scope of the claimed subject matter.\",\n \"The terminology used herein to describe the disclosed embodiments is not intended to limit the scope of the claimed subject matter.\",\n \"The use herein of a singular form should not preclude the presence of more than one referent.\",\n \"In other words, elements of the disclosed embodiments referred to in the singular form may number one or more, unless the context clearly indicates otherwise.\",\n \"It shall be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including,” when used herein, specify the presence of stated elements, components, steps, operations, and/or devices, but do not preclude the presence or addition of one or more other elements, components, steps, operations, and/or devices.\",\n \"Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper,” and the like may be used herein to describe the relationship of one element or feature to another, as illustrated in the drawings.\",\n \"It shall be understood that such descriptions are intended to encompass different orientations in use or operation in addition to orientations depicted in the drawings.\",\n \"For example, if a device is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features.\",\n \"Thus, the term “below” is intended to mean both above and below depending upon overall device orientation.\",\n \"Additionally, references to a direction that is referred to a vertical direction may refer to a direction in a figure that is parallel or substantially parallel to a direction from the bottom of the figure to the top of the figure.\",\n \"Similarly, references to a direction that is referred to a horizontal direction may refer to a direction in a figure that is parallel or substantially parallel to a direction from left to right in the figure.\",\n \"Embodiments are described herein with reference to cross-sectional views and/or planar views that are schematic illustrations of idealized embodiments and intermediate structures.\",\n \"In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity.\",\n \"As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected.\",\n \"Thus, embodiments should not be construed as limited to the particular shapes of regions illustrated herein, but are to include deviations in shapes that result, for example, from manufacturing variations.\",\n \"For example, an etched region illustrated as a rectangle will, typically, have rounded or curved features.\",\n \"Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the claimed subject matter.\",\n \"Like numerals refer to like elements throughout the specification.\",\n \"Accordingly, the same numerals and similar numerals may be described with reference to other drawings, even if not specifically described in a corresponding drawing.\",\n \"Further, when a numeral is not marked in a drawing, the numeral may be described with reference to other drawings.\",\n \"FIG.\",\n \"1 is an equivalent circuit diagram of a unit cell of a magnetoresistive random access memory (MRAM) in accordance with an embodiment of the subject matter disclosed herein.\",\n \"Referring to FIG.\",\n \"1, an MRAM in accordance with an embodiment may include a source line SL, a switching device Sw, a word line WL, a variable resistor Rv, and a bit line BL.\",\n \"The switching device Sw may include a transistor.\",\n \"When a voltage is applied to the word line WL to turn the switching device Sw on, a current may be supplied to the bit line BL from the source line SL via the variable resistor Rv.\",\n \"Based on a resistance value of the variable resistor Rv, the amount of current supplied to the bit line BL may change.\",\n \"Here, the amount of current may indicate a logic “1” or a logic “0”.\",\n \"The variable resistor Rv, for example, a magnetoresistive cell, may have either a high resistance state or a low resistance state based on the amount of current supplied from the source line SL.\",\n \"FIGS.\",\n \"2A and 2B respectively are vertical cross-sectional views schematically illustrating MRAMs 200A and 200B in accordance with embodiments disclosed herein.\",\n \"Referring to FIG.\",\n \"2A, the MRAM 200A in accordance with an embodiment may include an isolation region 12 defining an active region 11 in a substrate 10, a gate structure 25 formed on the active region 11 of the substrate 10, a source interconnection 50, a lower electrode 56, a magnetoresistive cell 100A, an upper electrode 60, and a bit line 70.The gate structure 25 may include a gate insulating layer 26 formed directly on a surface of the active region 11, a gate electrode 27 disposed on the gate insulating layer 26, a gate capping layer 28 disposed on the gate electrode 27, and gate spacers 29 formed on side surfaces of the gate insulating layer 26, the gate electrode 27 and the gate capping layer 28.The gate insulating layer 26 may include silicon oxide (SiO2) or a metal oxide, such as, but not limited to, hafnium oxide (HfO).\",\n \"The gate electrode 27 may include a conductive material, such as silicon, a metal, a metal alloy and/or a metal silicide.\",\n \"The gate capping layer 28 may include an insulating material, such as silicon nitride (SiN), that is denser and more solid than silicon oxide (SiO2).\",\n \"The gate spacers 29 may include silicon nitride (SiN), silicon boron nitride (SiBN), and/or silicon carbon nitride (SiCN).\",\n \"A source area 21 and a drain area 22 may be disposed in the substrate 10 at both sides of the gate structure 25.The source area 21 and the drain area 22 may include a dopant, such as boron (B), phosphorous (P), and/or arsenic (As), to have conductivity.\",\n \"The MRAM 200A may further include a lower interlayer insulating layer 31 covering the gate structure 25.The lower interlayer insulating layer 31 may include silicon oxide (SiO2).\",\n \"The structure formed by the gate structure 25, the source area 21 and the drain area 22 may correspond to the switching device Sw depicted in FIG.\",\n \"1.The MRAM 200A may further include a source contact plug 41 connected to the source area 21 by passing vertically through the lower interlayer insulating layer 31 and a drain contact plug 42 connected to the drain area 22 by passing vertically through the lower interlayer insulating layer 31.The source contact plug 41 and the drain contact plug 42 may include a conductive material, such as silicon, a metal, a metal alloy, and/or a metal silicide.\",\n \"The source contact plug 41 and the drain contact plug 42 may have substantially pillar shapes.\",\n \"Upper surfaces of the lower interlayer insulating layer 31, the source contact plug 41, and the drain contact plug 42 may be coplanar or substantially coplanar.\",\n \"The source interconnection 50 may be disposed on the source contact plug 41 and the lower interlayer insulating layer 31.The source interconnection 50 may extend substantially horizontally and may substantially have a line shape in a top view.\",\n \"The source interconnection 50 may include a conductive material, such as silicon, a metal, a metal alloy, and/or a metal silicide.\",\n \"The MRAM 200A may further include a lower electrode pad 55 disposed on the drain contact plug 42.The lower electrode pad 55 may have substantially a circular, a tetragonal, or a polygonal shape in a top view.\",\n \"The lower electrode pad 55 may be disposed at substantially the same level as the source interconnection 50.The lower electrode pad 55 may also include a conductive material, such as silicon, a metal, a metal alloy, and/or a metal silicide.\",\n \"The lower electrode pad 55 may include substantially the same material as the source interconnection 50.The MRAM 200A may further include an intermediate interlayer insulating layer 32 covering the source interconnection 50 and the lower electrode pad 55.The intermediate interlayer insulating layer 32 may include silicon oxide (SiO2) and/or silicon nitride (SiN).\",\n \"The lower electrode 56 may be connected to the lower electrode pad 55 by passing in a vertical direction through the intermediate interlayer insulating layer 32.The lower electrode 56 may have substantially a pillar shape.\",\n \"The lower electrode 56 may include a conductive material, such as silicon, a metal, a metal alloy, and/or a metal silicide.\",\n \"The magnetoresistive cell 100A may be disposed on the lower electrode 56 and the intermediate interlayer insulating layer 32.The magnetoresistive cell 100A may include a ferromagnetic layer 110, a tunneling barrier layer 120, a free magnetic layer (free layer) 130, an oxide layer 140, a capping layer 150 and a hardmask 160.In other embodiments, one of the capping layer 150 or the hardmask 160 may be omitted.\",\n \"The ferromagnetic layer 110 may include a seed layer 111, a pinning layer 112, a synthetic anti-ferromagnetic (SAF) layer 113 and a pinned layer 114.The seed layer 111 may provide crystallinity or a crystal orientation for the pinning layer 112.The seed layer 111 may include a tantalum (Ta) layer and/or a ruthenium (Ru) layer.\",\n \"For example, the seed layer 111 may be formed as a double layer that includes a lower tantalum (Ta) layer and an upper ruthenium (Ru) layer disposed on the lower tantalum (Ta) layer.\",\n \"Alternatively, the seed layer 111 may be formed of only a tantalum (Ta) layer or a ruthenium (Ru) layer.\",\n \"The pinning layer 112 may include a cobalt platinum (CoPt) or cobalt palladium (CoPd) based alloy, or a laminate of cobalt platinum (CoPt) and cobalt palladium (CoPd).\",\n \"The SAF layer 113 may include an anti-ferromagnetic metal, such as ruthenium (Ru).\",\n \"The pinned layer 114 may include a cobalt iron (CoFe) based material.\",\n \"For example, the pinned layer 114 may include cobalt iron boron (CoFeB).\",\n \"In other embodiments, the pinned layer 114 may include a CoFeB/Ta/CoFeB multilayer.\",\n \"In still other embodiments, the pinned layer 114 may include a Co/B/CoFeB multilayer or a Co/W/CoFeB/W/CoFeB multilayer.\",\n \"The tunneling barrier layer 120 may include magnesium oxide (MgO).\",\n \"For example, the tunneling barrier layer 120 may be formed by depositing magnesium (Mg) on the pinned layer 114, and oxidizing the deposited magnesium (Mg).\",\n \"The free magnetic layer (free layer) 130 may include one of a CoFe layer, a CoFeB layer, a CoFe/CoFeB multilayer, a CoFeB/W/CoFeB multilayer, and a CoFe/W/CoFeB multilayer.\",\n \"For example, a lower portion of the free layer 130 may include a CoFe layer containing a very low concentration of boron (B) or a substantially boron-free CoFe layer, and an upper portion of the free layer 130 may include a CoFeB layer.\",\n \"That is, a concentration of boron in the upper portion of the free layer 130 may be different from a concentration of boron in the lower portion of the free layer 130.For example, the lower portion of the free layer 130 may have a relatively low concentration of boron (B), and the upper portion of the free layer 130 may have a relatively high concentration of boron (B).\",\n \"In some embodiments, the lower portion of the free layer 130 may be a substantially boron-free region.\",\n \"In other embodiments, the lower portion of the free layer 130 may have a relatively high concentration of boron (B), and the upper portion of the free layer 130 may have a relatively low concentration of boron (B).\",\n \"In some embodiments, the upper portion of the free layer 130 may be a substantially boron-free region.\",\n \"Additionally, a free layer 130 having low concentration of boron (B) may have a crystallized state, and a free layer 130 having high concentration of boron (B) may have an amorphous state.\",\n \"The oxide layer 140 may include tantalum oxide (TaO), zirconium oxide (ZrO), titanium oxide (TiO), vanadium oxide (VO), yttrium oxide (YO), scandium oxide (ScO), molybdenum oxide (MoO) and/or magnesium oxide (MgO).\",\n \"In some embodiments, the oxide layer 140 may include a borated oxide.\",\n \"For example, the oxide layer 140 may include tantalum boron oxide (TaBO), zirconium boron oxide (ZrBO), titanium boron oxide (TiBO), vanadium boron oxide (VBO), yttrium boron oxide (YBO), scandium boron oxide (ScBO), molybdenum boron oxide (MoBO), magnesium boron oxide (MgBO), cobalt boron oxide (CoBO), cobalt iron boron oxide ((CoFe)BO), or other various metal boron oxides.\",\n \"For example, the oxide layer 140 may include a metal having a lower boride-forming energy than that of cobalt (Co) and/or iron (Fe).\",\n \"The capping layer 150 may include a metal, such as tantalum (Ta) or ruthenium (Ru).\",\n \"The hardmask 160 may include a metal such as tungsten (W), an alloy and/or a metal compound.\",\n \"The MRAM 200A may further include a liner 170 surrounding side surfaces of the magnetoresistive cell 100A.\",\n \"The liner 170 may also be conformally formed on the intermediate interlayer insulating layer 32.The liner 170 may include a metal oxide, such as aluminum oxide (Al2O3) or silicon nitride (SiN).\",\n \"The MRAM 200A may further include an upper interlayer insulating layer 33 surrounding the magnetoresistive cell 100A.\",\n \"The upper interlayer insulating layer 33 may include silicon oxide (SiO2).\",\n \"The upper electrode 60 may be in contact with upper and side surfaces of the hardmask 160 by passing in a substantially vertical direction through the upper interlayer insulating layer 33 and an upper portion of a side surface of the capping layer 150.The upper electrode 60 may include an upper electrode barrier layer 61 and an upper electrode plug 65.The upper electrode barrier layer 61 may include titanium (Ti), tantalum (Ta), titanium nitride (TiN), tantalum nitride (TaN) and/or another barrier metal or metal compound.\",\n \"The upper electrode plug 65 may include a metal, such as tungsten (W) or copper (Cu).\",\n \"The bit line 70 may be disposed to be in contact with the upper electrode 60 on the upper interlayer insulating layer 33.The bit line 70 may extend substantially horizontally.\",\n \"The bit line 70 may include a bit line barrier layer 71 in direct contact with the upper electrode 60, and a bit line interconnection 75 disposed on the bit line barrier layer 71.The bit line barrier layer 71 may include titanium (Ti), tantalum (Ta), titanium nitride (TiN), tantalum nitride (TaN) and/or another barrier metal or metal compound.\",\n \"The bit line interconnection 75 may include a metal, such as tungsten (W) or copper (Cu).\",\n \"Referring to FIG.\",\n \"2B, the MRAM 200B in accordance with an embodiment disclosed herein may include a magnetoresistive cell 100B in which the hardmask 160 is omitted as compared to the MRAM 200A illustrated in FIG.\",\n \"2A.\",\n \"FIGS.\",\n \"3A and 3B respectively depict vertical cross-sectional views conceptually illustrating free layers 130A and 130B with respect to a concentration of boron (B) in accordance with various embodiments disclosed herein.\",\n \"The free layers 130A and 130B may correspond to the free layers 130 depicted in FIGS.\",\n \"2A and 2B.\",\n \"Referring to FIG.\",\n \"3A, the free layer 130A in accordance with an embodiment disclosed herein may include a lower free layer 130L having a relatively low concentration of boron (B) and an upper free layer 130U having a relatively high concentration of boron (B).\",\n \"The lower free layer 130L may be thicker (in a vertical direction in FIG.\",\n \"3A) than the upper free layer 130U.\",\n \"The lower free layer 130L may be a substantially boron-free layer.\",\n \"For example, the lower free layer 130L may include a CoFe layer, whereas the upper free layer 130U may include a CoFeB layer.\",\n \"Referring to FIG.\",\n \"3B, the free layer 130B in accordance with an embodiment disclosed herein may include a multilayer of free layers 130L, 130M and 130U.\",\n \"For example, the free layer 130B may include a lower free layer 130L, an intermediate free layer 130M and an upper free layer 130U.\",\n \"A concentration of boron (B) in the lower free layer 130L may be relatively low, a concentration of boron (B) in the upper free layer 130U may be relatively high, and a concentration of boron (B) in the intermediate free layer 130M may be between the concentration of boron (B) in the lower free layer 130L and the concentration of boron (B) in the upper free layer 130U.\",\n \"In one embodiment, the lower free layer 130L may be a substantially boron-free layer.\",\n \"In some embodiments, the free layer 130B may be formed by more layers each having different concentrations of boron (B) than depicted in FIG.\",\n \"3B.\",\n \"Referring again to FIGS.\",\n \"3A and 3B, the free layers 130A and 130B in accordance with various embodiments disclosed herein may have concentrations of boron (B) that gradually or continuous increase through the free layers 130A and 130B.\",\n \"For example, the dashed boundary lines depicted between the lower free layer 130L, the intermediate free layer 130M and the upper free layer 130U may be hypothetical.\",\n \"The embodiments disclosed herein that are described with reference to FIGS.\",\n \"3A and 3B, show that the free layers 130A and 130B may have different characteristics according to different concentrations of boron (B).\",\n \"In some embodiments, the free layers 130A and 130B may each be formed in to have more layers than depicted in FIGS.\",\n \"3A and 3B.\",\n \"FIGS.\",\n \"4A and 4B respectively depict conceptual magnetization directions of the respective areas, or layers, forming free layers 130A and 130B of magnetoresistive cells 100A and 100B in accordance with various embodiments disclosed herein.\",\n \"A magnetization direction of each area, or layer, of the free layers 130A and 130B may be conceptually depicted using arrows, as shown in FIGS.\",\n \"4A and 4B.\",\n \"According to the embodiments disclosed herein, a magnetization direction of the pinned layer 114 is considered to be vertical or substantially vertical.\",\n \"Referring to FIG.\",\n \"4A, the free layer 130A of the magnetoresistive cell 100A in accordance with an embodiment disclosed herein may include a lower portion L having a vertical magnetization direction and an upper portion U having a magnetization direction that is oblique, or inclined, to a vertical magnetization direction.\",\n \"For example, the lower portion L and the upper portion U of FIG.\",\n \"4A may respectively correspond to the lower free layer 130L and the upper free layer 130U of FIG.\",\n \"3A.\",\n \"Based on the concentration of boron (B), the magnetization directions of the respective layers of the free layer 130A may be different.\",\n \"More specifically, as the concentration of boron (B) decreases, the magnetization direction may become vertically oriented, and as the concentration of boron (B) increases, the magnetization direction may become more inclined with respect to the vertical (i.e., tending to become horizontally oriented).\",\n \"That is, as the concentration of boron (B) decreases, the direction of magnetization of a layer may become oriented in a substantially vertical direction (i.e., in a direction that is substantially parallel to a direction from bottom to top in FIG.\",\n \"4A), and as the concentration of boron (B) increases, the direction of magnetization may become more inclined with respect to the vertical direction (i.e., in a direction that is tending to become more horizontal and more parallel to a direction from right to left in FIG.\",\n \"4A) Accordingly, the lower portion L may be a region including a relatively low concentration of boron (B), and the upper portion U may be a region including a relatively high concentration of boron (B).\",\n \"For example, the lower portion L may be a substantially boron-free region, and the upper portion U may comprise a relatively high concentration of boron (B).\",\n \"In one embodiment, the lower portion L may include a CoFe layer, and the upper portion U may include a CoFeB layer.\",\n \"In other words, the lower portion L may be a relatively more crystallized region, whereas the upper portion U may be a relatively less crystallized region.\",\n \"In FIG.\",\n \"4A(A), the magnetization directions of the layers forming the free layer 130A are conceptually depicted for the situation in which the free layer 130A is in a low-resistance state.\",\n \"In FIG.\",\n \"4A(B), the magnetization directions of the layers forming the free layer 130A are conceptually depicted for the situation in which the free layer 130A is in a high resistance state.\",\n \"Referring to FIG.\",\n \"4A(A), if the magnetization directions of the layers forming the free layer 130A are the same as the magnetization direction of the pinned layer 114, the free layer 130A may be in a low-resistance state.\",\n \"Referring to FIG.\",\n \"4A(B), if the magnetization directions of the layers forming the free layer 130A are opposite to the magnetization direction of the pinned layer 114, the free layer 130A may be in a high-resistance state.\",\n \"Accordingly, depending on the magnetization direction of the free layer 130A with respect to the magnetization direction of the pinned layer 114, the magnetoresistive cell 100A may have a logic “1” state or a logic “0” state.\",\n \"As the magnetization direction of a layer forming the free layer 130A becomes vertical, the magnetization direction of that layer may be hard to change.\",\n \"For example, when the magnetization direction of the lower portion L of the free layer 130A is vertical, retention characteristics of the lower portion L of the free layer 130A may be improved.\",\n \"As the magnetization direction of a layer forming the free layer 130A become more horizontal, damping characteristics, that is, switching characteristics, of the free layer 130A may be improved, or made easier.\",\n \"That is, as the magnetization direction of a layer forming the free layer 130A become horizontal, the magnetization direction of the layer may more easily change.\",\n \"For example, the magnetization direction of the upper portion U of the free layer 130A, which has a relatively higher concentration of boron (B), may be easily switched, or changed, by a relatively small current.\",\n \"Accordingly, the free layer 130A of the magnetoresistive cell 100A in accordance with an embodiment disclosed herein may have two magnetization directions in which each layer of the free layer 130A comprises correspondingly different concentrations of boron (B).\",\n \"Accordingly, retention characteristics or switching characteristics may be excellent in comparison to the case in which a free layer of a magnetoresistive cell has a single (horizontal) magnetization direction.\",\n \"If the free layer 130A has only one magnetization direction, switching characteristics may be poor if retention characteristics are good or, on the other hand, retention characteristics may be poor if switching characteristics are good.\",\n \"Thus, if all of the magnetization directions of the free layer 130A are oblique with respect to a vertical direction (i.e., tending toward horizontal), the switching characteristics may be good, but the retention characteristics may be poor because the collective magnetization directions of the layers forming the free layer 130A are easily changed by a small current.\",\n \"Additionally, if all of the magnetization directions of the layers forming the free layer 130A are vertical, the retention characteristics may be good, but the switching characteristics may be poor because the collective magnetization directions of the layers forming the free layer 130A are hard to change.\",\n \"Accordingly, the free layer 130A in accordance with an embodiment disclosed herein may have superior retention characteristics in comparison to a free layer that has magnetization directions that are all in a direction that is oblique to a vertical direction, and may have superior switching characteristics in comparison to a free layer that has magnetization directions that are all in a vertical direction.\",\n \"Referring to FIG.\",\n \"4B, the free layer 130B of the magnetoresistive cell 100B in accordance with an embodiment disclosed herein may include a lower portion L having a vertical magnetization direction, an intermediate portion M having a slightly inclined magnetization direction, and an upper portion U having a heavily inclined magnetization direction.\",\n \"For example, the lower portion L, the intermediate portion M, and the upper portion U may respectively correspond to the lower free layer 130L, the intermediate free layer 130M, and the upper free layer 130U depicted in FIG.\",\n \"3B.\",\n \"In FIG.\",\n \"4B(A), the magnetization directions of the layers forming the free layer 130B are conceptually depicted for a situation in which the free layer 130B is in a low-resistance.\",\n \"In FIG.\",\n \"4B(B), the magnetization directions of the layers forming the free layer 130B are conceptually depicted for a situation in which the free layer 130B is in a high-resistance state.\",\n \"Based on differences in the concentration of boron (B), the magnetization directions of the layers forming the free layer 130B may be different.\",\n \"More specifically, the lower portion L, which has a relatively low concentration of boron (B) (for example, a substantially boron-free region), may have a vertical magnetization direction.\",\n \"The intermediate portion M, which has an intermediate concentration of boron (B), may have a slightly inclined magnetization direction.\",\n \"The upper portion U, which has a relatively high concentration of boron (B), may have a more significant inclined magnetization direction than the inclination of the magnetization direction of the intermediate portion M. The embodiments disclosed herein that are described with reference to FIGS.\",\n \"4A and 4B, show that the magnetization directions of the free layers 130A and 130B may be set based on different concentrations of boron (B).\",\n \"FIGS.\",\n \"5A to 5P are vertical cross-sectional views for schematically describing a method of fabricating an MRAM in accordance with an embodiment of the subject matter disclosed herein.\",\n \"FIG.\",\n \"6 shows a flow diagram for a process 600 of fabricating an MRAM in accordance with the subject matter disclosed herein.\",\n \"At operation 601, a switching device Sw may be formed on a substrate 10.Referring to FIG.\",\n \"5A, the method of fabricating the MRAM in accordance with an embodiment disclosed herein may include forming an isolation region 12 defining an active region 11 on a substrate 10 using well-known techniques.\",\n \"A gate structure 25 is formed on the active region 11 using well-known techniques.\",\n \"A source area 21 and a drain area 22 are formed using well-known techniques in the active region 11 at both sides of the gate structure 25.A lower interlayer insulating layer 31 covering the gate structure 25 is formed using well-known techniques.\",\n \"The substrate 10 may include a silicon wafer, a silicon-on-insulator (SOI) wafer or a semiconductor wafer having an epitaxial growth layer such as SiGe.\",\n \"The isolation region 12 may include an insulating material, such as silicon oxide and/or silicon nitride, that fills a trench 12t.\",\n \"The gate structure 25 may include a gate insulating layer 26 directly formed on the substrate 10 using well-known techniques.\",\n \"A gate electrode 27 may be formed on the gate insulating layer 26 using well-known techniques.\",\n \"A gate capping layer 28 is formed on the gate electrode 27 using well-known techniques.\",\n \"Gate spacers 29 are formed using well-known techniques on side surfaces of the gate insulating layer 26, the gate electrode 27 and the gate capping layer 28.The gate insulating layer 26 may include oxidized silicon and/or a metal oxide.\",\n \"The gate electrode 27 may include a conductive material, such as polysilicon, a metal, a metal alloy and/or a metal silicide.\",\n \"The gate capping layer 28 and the gate spacers 29 may include silicon nitride, silicon oxynitride and/or silicon oxide.\",\n \"The source area 21 and the drain area 22 may be formed using well-known techniques adjacent to both sides of the gate structure 25.The source area 21 and the drain area 22 may include a dopant, such as boron (B), phosphorous (P), and/or arsenic (As).\",\n \"A lower interlayer insulating layer 31 may be formed using well-known techniques on the gate structure 25, the source area 21 and the drain area 22.The lower interlayer insulation layer 31 may include silicon oxide, such as tetraethylorthosilicate (TEOS) or high density plasma (HDP) oxide.\",\n \"At operation 602 in FIG.\",\n \"6, source and drain contact plugs 41 and 42, a source interconnection 50 and a lower electrode pad 55 may be formed.\",\n \"Referring to FIG.\",\n \"5B, the method may further include forming a source contact plug 41 in contact with the source area 21 by passing vertically through the lower interlayer insulating layer 31 using well-known techniques.\",\n \"A drain contact plug 42 may be formed in contact with the drain area 22 by passing vertically the lower interlayer insulating layer 31 using well-known techniques.\",\n \"A source interconnection 50 may be formed on the source contact plug 41 using well-known techniques.\",\n \"A lower electrode pad 55 may be formed on the drain contact plug 42 using well-known techniques.\",\n \"The source contact plug 41 and the drain contact plug 42 may include a conductive material, such as polysilicon, a metal, a metal alloy and/or a metal silicide.\",\n \"The method may include performing a planarization process, such as chemical mechanical polishing (CMP), until upper surfaces of the lower interlayer insulating layer 31, the source contact plug 41, and the drain contact plug 42 are coplanar or substantially coplanar.\",\n \"The source interconnection 50 and the lower electrode pad 55 may include a conductive material, such as polysilicon, a metal, a metal alloy and/or a metal silicide.\",\n \"The source interconnection 50 may have a horizontally-extending line shape (i.e., in a direction substantially parallel to a direction into FIG.\",\n \"5B.\",\n \"The lower electrode pad 55 may have a circular or polygonal shape in a top view.\",\n \"At operation 603 in FIG.\",\n \"6, a lower electrode 56 may be formed.\",\n \"Referring to FIG.\",\n \"5C, the method may include forming an intermediate interlayer insulating layer 32 covering the source interconnection 50 and the lower electrode pad 55 using well-known techniques.\",\n \"A lower electrode 56 may be formed using well-known techniques that is electrically connected to the lower electrode pad 55 by passing through the intermediate interlayer insulating layer 32 in substantially a vertical direction.\",\n \"The intermediate interlayer insulating layer 32 may include an insulating material, for example, silicon oxide such as TEOS or HDP oxide.\",\n \"The lower electrode 56 may include a conductive material, such as polysilicon, a metal, a metal alloy and/or a metal silicide.\",\n \"The method may include performing a planarization process, such as CMP, until upper surfaces of the intermediate interlayer insulating layer 32 and the lower electrode 56 are coplanar or substantially coplanar.\",\n \"At operation 604 in FIG.\",\n \"6, layers for a ferromagnetic layer 110 may be formed.\",\n \"Referring to FIG.\",\n \"5D, the method may include forming a ferromagnetic layer 110 on the lower electrode 56 and the intermediate interlayer insulating layer 32 using well-known techniques.\",\n \"The formation of the ferromagnetic layer 110 may include using well-known techniques to form a seed layer 111, a pinning layer 112 on the seed layer 111, an SAF layer 113 on the pinning layer 112, and a pinned layer 114 on the SAF layer 113.The seed layer 111 may include a tantalum (Ta) layer and/or ruthenium (Ru) layer.\",\n \"The seed layer 111, for example, may be formed in a single layer that includes tantalum (Ta) or ruthenium (Ru), or a double layer that includes a lower tantalum (Ta) layer and an upper ruthenium (Ru) layer disposed on the lower tantalum (Ta) layer.\",\n \"The pinning layer 112 may include a CoPt layer, a CoPd layer, an alloy layer of CoPt and CoPd, and/or a multilayer in which CoPt layers and CoPd layers are alternately stacked.\",\n \"The SAF layer 113 may include an anti-ferromagnetic metal, such as ruthenium (Ru).\",\n \"The pinned layer 114 may include a CoFe-based material.\",\n \"For example, the pinned layer 114 may include CoFeB.\",\n \"In other embodiments, the pinned layer 114 may include a CoFeB/Ta/CoFeB multilayer.\",\n \"In still other embodiments, the pinned layer 114 may include a Co/B/CoFeB multilayer or a Co/W/CoFeB/W/CoFeB multilayer.\",\n \"The formation of the seed layer 111, the pinning layer 112, the SAF layer 113, and the pinned layer 114 may include performing a well-known physical vapor deposition (PVD) process, such as sputtering.\",\n \"In other embodiments, the pinning layer 112 may be formed by a metallic organic chemical vapor deposition (MOCVD) process.\",\n \"At operation 605 in FIG.\",\n \"6, a tunnel barrier layer 120 and a first preliminary free layer 131 may be formed.\",\n \"Referring to FIG.\",\n \"5E, the method may include forming a tunneling barrier layer 120 on the ferromagnetic layer 110, forming a first preliminary free layer 131 on the tunneling barrier layer 120, and forming a first buffer layer 141 on the first preliminary free layer 131 using well-known techniques.\",\n \"The tunneling barrier layer 120 may include magnesium oxide (MgO).\",\n \"More specifically, the tunneling barrier layer 120 may be formed by a magnesium (Mg) layer on the ferromagnetic layer 110 by performing a well-known deposition process, and oxidizing the magnesium (Mg) layer by performing a well-known oxidation process.\",\n \"The first preliminary free layer 131 may include a CoFeB single layer, or a CoFeB/W/CoFeB multilayer.\",\n \"The first preliminary free layer 131 may be formed by a well-known PVD process, such as sputtering.\",\n \"The first buffer layer 141 may include a material having a lower boride-forming energy than that of cobalt (Co) or iron (Fe).\",\n \"For example, the first buffer layer 141 may include any one of tantalum (Ta), hafnium (HD, zirconium (Zr), titanium (Ti), vanadium (V), yttrium (Y), scandium (Sc), molybdenum (Mo), and magnesium (Mg).\",\n \"According to an embodiment, the first buffer layer 141 may include tantalum (Ta).\",\n \"The first buffer layer 141 may be formed to have a thickness (in a vertical direction in FIG.\",\n \"5E) that is capable of adequately absorbing boron atoms in the first preliminary free layer 131.For example, the first buffer layer 141 may have a thickness of several atomic layers, that is, several Ångstroms or several tens of nanometers.\",\n \"In other embodiments, the first buffer layer 141 may be formed in such a manner that atoms forming the first buffer layer 141 are implanted or absorbed in the first preliminary free layer 131 or formed to have a single atomic layer.\",\n \"At operation 606 in FIG.\",\n \"6, a first annealing process may be performed.\",\n \"Referring to FIG.\",\n \"5F, the method may include performing a first annealing process so that boron (B) in the first preliminary free layer 131 is absorbed and diffused into the first buffer layer 141.Accordingly, the first buffer layer 141 may transition into a first boride layer 141a, and the first preliminary free layer 131 may transition into a second preliminary free layer 132 having a lower concentration of boron (B) than the first preliminary free layer 131.The first boride layer 141a may include a material of the first buffer layer 141 and boron (B).\",\n \"For example, the first boride layer 141a may include tantalum boron (TaB), zirconium boron (ZrB), titanium boron (TiB), vanadium boron (VB), yttrium boron (YB), scandium boron (ScB), molybdenum boron (MoB), magnesium boron (MgB), cobalt boron (CoB), cobalt iron boron (CoFeB), or various other metal boride layers.\",\n \"The boron (B) concentration in the second preliminary free layer 132 may be gradated.\",\n \"That is, the concentration of boron (B) in the second preliminary free layer 132 may change from a relatively low concentration in a lower portion and a relatively higher concentration in an upper portion.\",\n \"For example, a lower portion L of the second preliminary free layer 132 may have a relatively low concentration of boron (B), and an upper portion U of the second preliminary free layer 132 may have a relatively high concentration of boron (B).\",\n \"The first annealing process may include heating the first preliminary free layer 131 to about 250 to about 500° C. under an atmospheric pressure or a vacuum.\",\n \"The first annealing process may include a rapidly thermal anneal (RTA) process using a halogen lamp.\",\n \"The first annealing process may be performed for about 10 to about 600 seconds.\",\n \"As the temperature of annealing increases, the annealing time may correspondingly decrease, and as the temperature of annealing decreases, the annealing time may correspondingly increase.\",\n \"The first annealing process may be performed at a temperature that is lower than a melting point of the first buffer layer 141.At operation 607 in FIG.\",\n \"6, the first boride layer 141a may be removed.\",\n \"Referring to FIG.\",\n \"5G, the method may include removing the first boride layer 141a by performing an etching process.\",\n \"The etching process may include a physical sputtering etching process using argon (Ar) or the like.\",\n \"Referring to FIGS.\",\n \"5F and 5G, the process of forming the first buffer layer 141, the first annealing process, and the etching process may be performed repeatedly.\",\n \"For example, the method may include repeatedly performing the processes described with reference to FIGS.\",\n \"5F and 5G until the concentration of boron (B) in the first preliminary free layer 131 is reduced to a desired level.\",\n \"As the processes are repeated, the concentration of boron (B) in the lower portion L of the first preliminary free layer 131 may be gradually reduced to near zero, and the concentration of boron (B) in the upper portion U of the first preliminary free layer 131 also may be gradually reduced while being maintained at a higher boron (B) concentration level than the concentration of boron (B) in the lower portion L of the first preliminary free layer 131.At operation 608 in FIG.\",\n \"6, a second buffer layer 142 may be formed on the second preliminary free layer 132.Referring to FIG.\",\n \"5H, the method may include forming second buffer layer 142 on the second preliminary free layer 132.The first buffer layer 141 may include a material having a lower boride-forming energy than that of cobalt (Co) or iron (Fe).\",\n \"For example, the second buffer layer 142 may include the same material as the first buffer layer 141.At operation 609 in FIG.\",\n \"6, a second annealing process may be performed.\",\n \"Referring to FIG.\",\n \"5I, the method may include performing a second annealing process that additionally diffuses boron (B) in the second preliminary free layer 132 into the second buffer layer 142.Accordingly, the second buffer layer 142 may transition into a second boride layer 142a, and the second preliminary free layer 132 may transition into a free layer 130.The second annealing process may be performed similar to the first annealing process.\",\n \"The second boride layer 142a may include the same material as the first boride layer 141a.\",\n \"At operation 610, an oxidation process may be formed.\",\n \"Referring to FIG.\",\n \"5J, the method may include performing an oxidation process to transition the second boride layer 142a into an oxide layer 140.The oxidation process may include naturally oxidizing the second boride layer 142a by appropriately flowing O2 gas in a chamber at room temperature.\",\n \"When heating the second boride layer 142a or flowing oxide radicals (O*) in the chamber, the second boride layer 142a may be very rapidly oxidized.\",\n \"Accordingly, the oxidation process may include a natural oxidation process so that the second boride layer 142a is slowly oxidized.\",\n \"Additionally, in order to control an oxidation rate, an inert gas such as helium (He), neon (Ne), argon (Ar), or xenon (Xe), or a nitrogen (N2) gas may flow into the chamber simultaneously with the oxygen (O2) gas.\",\n \"The oxide layer 140 may include the materials in the first and second buffer layers 141 and 142 and an oxide.\",\n \"For example, the oxide layer 140 may include tantalum oxide (TaO), zirconium oxide (ZrO), titanium oxide (TiO), vanadium oxide (VO), yttrium oxide (YO), scandium oxide (ScO), molybdenum oxide (MoO), magnesium oxide (MgO), cobalt oxide (CoO), cobalt iron oxide (CoFeO), or other various metal oxides.\",\n \"In some embodiments, the oxide layer 140 may further include boron (B).\",\n \"For example, the oxide layer 140 may include tantalum boron oxide (TaBO), zirconium boron oxide (ZrBO), titanium boron oxide (TiBO), vanadium boron oxide (VBO), yttrium boron oxide (YBO), scandium boron oxide (ScBO), molybdenum boron oxide (MoBO), magnesium boron oxide (MgBO), cobalt boron oxide (CoBO), cobalt iron boron oxide ((CoFe)BO), or other various metal boron oxide.\",\n \"At operation 611, a capping layer 150 may be formed on the oxide layer 140.Referring to FIG.\",\n \"5K, the method may include forming a capping layer 150 on the oxide layer 140.The capping layer 150 may include a metal, such as tantalum (Ta).\",\n \"The capping layer 150 may be formed by performing a well-known PVD process, such as sputtering.\",\n \"At operation 612, a hardmask 160 is formed on the capping layer 150.Referring to FIG.\",\n \"5L, the method may include forming a hardmask 160 on the capping layer 150 using a well-known technique.\",\n \"The hardmask 160 may include tantalum (T), titanium (Ti), ruthenium (Ru), and/or another metal.\",\n \"At operation 613, magnetoresistive cells 100 may be formed.\",\n \"Referring to FIG.\",\n \"5M, the method may include using a well-known etching technique to form a magnetoresistive cell 100 by etching the capping layer 150, the free layer 130, the tunneling barrier layer 120, and the ferromagnetic layer 110 using the hardmask 160 as an etch mask.\",\n \"The hardmask 160 may remain on the capping layer 150.In other embodiments, the hardmask 160 may be removed.\",\n \"At operation 614, a liner 170 may be formed surrounding the magnetoresistive cells 100.Referring to FIG.\",\n \"5N, the method may include forming a liner 170 conformally surrounding the magnetoresistive cell 100 using a well-known technique.\",\n \"An upper interlayer insulating layer 33 may be formed covering the magnetoresistive cell 100 and the liner 170 using a well-known technique.\",\n \"The liner 170 may be conformally formed on upper and side surfaces of the magnetoresistive cell and an upper surface of the intermediate interlayer insulating layer 32.The liner 170 may include a metal oxide, such as aluminum oxide (Al2O3) or silicon nitride (SiN).\",\n \"The upper interlayer insulating layer 33 may include silicon oxide (SiO2).\",\n \"At operation 615, an upper electrode hole 60H may be formed.\",\n \"Referring to FIG.\",\n \"5O, the method may include forming using a well-known technique an upper electrode hole 60H that exposes the hardmask 160 of the magnetoresistive cell 100 that passes substantially vertically through the upper interlayer insulating layer 33 and the liner 170.The upper electrode hole 60H may expose upper and side surfaces of the hardmask 160.The upper electrode hole 60H may partially expose a side surface of the capping layer 150.A diameter, or horizontal width, of the upper electrode hole 60H may be greater than a horizontal width or a horizontal length of an upper surface of the hardmask 160 of the magnetoresistive cell 100.At operation 616, an upper electrode plug 65 may be formed.\",\n \"Referring to FIG.\",\n \"5P, the method may include conformally forming an upper electrode barrier layer 61 on sidewalls of the upper electrode hole 60H and the upper surface of the hardmask 160 using a well-known technique.\",\n \"An upper electrode plug 65 may be formed using a well-known technique that fills the upper electrode hole 60H in the upper electrode barrier layer 61.The upper electrode barrier layer 61 may include titanium (Ti), tantalum (Ta), titanium nitride (TiN), tantalum nitride (TaN) or another barrier metal or metal compound.\",\n \"The upper electrode plug 65 may include a metal, such as tungsten (W) or copper (Cu).\",\n \"Next, referring again to FIGS.\",\n \"2A and 3A, the method may include forming a bit line 70 on the upper electrode 60 and the upper interlayer insulating layer 33 using a well-known technique.\",\n \"The formation of the bit line 70 may include conformally forming a bit line barrier layer 71 and forming a bit line interconnection 75 on the bit line barrier layer 71.The bit line barrier layer 71 may include titanium (Ti), tantalum (Ta), titanium nitride (TiN), tantalum nitride (TaN), or another barrier metal or metal compound.\",\n \"The bit line interconnection 75 may include a metal, such as tungsten (W) or copper (Cu).\",\n \"FIG.\",\n \"6 illustrates a method of fabricating an MRAM in accordance with another embodiment disclosed herein.\",\n \"Referring to FIG.\",\n \"6, the method of fabricating the MRAM in accordance with an embodiment disclosed herein may include forming the first buffer layer 141 on the first preliminary free layer 131 by performing the processes described with reference to FIGS.\",\n \"5A to 5E.\",\n \"Additionally, boron (B) atoms may be diffused in the first and second preliminary free layers 131 and 132 into the first and second buffer layers 141 and 142 to form the free layer 130B, as depicted in FIG.\",\n \"3B, by repeatedly performing the processes described with reference to FIGS.\",\n \"5F to 5I.\",\n \"In an embodiment, a third buffer layer and a third preliminary free layer may temporarily be formed.\",\n \"Next, the method may include performing the processes described with reference to FIGS.\",\n \"5J to 5P, and forming a bit line 70 on the upper electrode 60 and the upper interlayer insulating layer 33, referring again to FIGS.\",\n \"2A and 3B.\",\n \"FIG.\",\n \"8 is a block diagram schematically depicting components that may include one or more magnetoresistive cells formed according to the subject matter disclosed herein.\",\n \"In detail, the electronic circuit board 1200 may include a microprocessor 1230 disposed on a circuit board 1225, a main storage circuit 1235 and a supplementary storage circuit 1240 that communicate with the microprocessor 1230, an input signal processing circuit 1245 that transfers a command to the microprocessor 1230, an output signal processing circuit 1250 that receives a command from the microprocessor 1230, and a communication signal processing unit 1255 that exchanges an electrical signal with other circuit boards.\",\n \"It may be understood that each of arrows refers to a path through an electrical signal is transferred.\",\n \"The microprocessor 1230 may receive and process various electrical signals to output a result of the processing and may control the other elements of the electronic circuit board 1200.It may be understood that the microprocessor 1230 is, for example, a central processing unit (CPU) and a main control unit (MCU).\",\n \"The main storage circuit 1235 may temporarily store data, which is always or frequently required by the microprocessor 1230, before-processing data, and after-processing data.\",\n \"The main storage circuit 1235 may need a fast response, and thus may be configured with a semiconductor memory chip.\",\n \"In detail, the main storage circuit 1235 may be a semiconductor memory called a cache.\",\n \"The main storage circuit 1235 may be configured with static random access memory (SRAM), dynamic random access memory (DRAM), resistive random access memory (RRAM), a magnetoresistive random access memory (MRAM) and application semiconductor memories thereof (for example, a utilized RAM, a ferro-electric RAM, a fast cycle RAM, a phase changeable RAM, a magnetic RAM, and/or the like) or may be configured with other semiconductor memories.\",\n \"In one embodiment, the main storage circuit 1235 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.\",\n \"Additionally, the main storage circuit 1235 may include a random access memory (RAM) irrespective of volatility/non-volatility capabilities.\",\n \"In the present embodiment, the main storage circuit 1235 may include one or more semiconductor chips, semiconductor packages, or semiconductor modules according to the exemplary embodiments.\",\n \"The supplementary storage circuit 1240 may be a large-capacity storage element and may be configured with a nonvolatile semiconductor memory, such as flash memory or the like, or a hard disk drive using a magnetic field.\",\n \"Alternatively, the supplementary storage circuit 1240 may be configured with a compact disk drive using light.\",\n \"Although the supplementary storage circuit 1240 does not need a fast speed in comparison with the main storage circuit 1235, the supplementary storage circuit 1240 may be applied to a case of needing to store large-scale data.\",\n \"The supplementary storage circuit 1240 may include a nonvolatile storage element irrespective of random/nonrandom capabilities.\",\n \"In one embodiment, the supplementary storage circuit 1240 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.\",\n \"The input signal processing circuit 1245 may convert an external command into an electrical signal or may transfer an electrical signal, transferred from the outside, to the microprocessor 1230.A command or an electrical signal transferred from the outside may be an operation command, an electrical signal that is to be processed, or data that are to be stored.\",\n \"The input signal processing circuit 1245 may be a terminal signal processing circuit that processes a signal transmitted from a keyboard, a mouse, a touch pad, an image recognition device, or various sensors, an image signal processing circuit that processes an image signal transferred from a scanner or a camera, various sensors, an input signal interface, or the like.\",\n \"The output signal processing circuit 1250 may be an element for transmitting an electrical signal, generated through processing by the microprocessor 1230, to the outside.\",\n \"For example, the output signal processing circuit 1250 may be a graphic card, an image processor, an optical converter, a beam panel card, one of various functional interface circuits, or the like.\",\n \"The communication circuit 1255 may be an element for directly exchanging an electrical signal with other electronic systems or other circuit boards without undergoing the input signal processing circuit 1245 or the output signal processing circuit 1250.For example, the communication circuit 1255 may include a modem, a LAN card, various interfaces, and/or the like of a personal computer (PC) system.\",\n \"The communication circuit 1255 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.\",\n \"FIG.\",\n \"9 is a block diagram schematically depicting an electronic system 1300 that includes one or more magnetoresistive memory cells according to the subject matter disclosed herein.\",\n \"In detail, the electronic system 1300 according to an embodiment may include a control unit 1365, an input unit 1370, an output unit 1375, and a storage unit 1380.Also, the electronic system 1300 may further include a communication unit 1385 and/or an operation unit 1390.The control unit 1365 may overall control the electronic system 1300 and elements.\",\n \"The control unit 1365 may be understood as a CPU or a central control unit, and may include the electronic circuit board 1200 (see FIG.\",\n \"8).\",\n \"Also, the control unit 1365 may include a semiconductor device that may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.\",\n \"The input unit 1370 may transfer an electrical command signal to the control unit 1365.The input unit 1370 may be a keyboard, a keypad, a touch pad, an image recognizer such as a scanner, or various input sensors.\",\n \"The input unit 1370 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.\",\n \"The output unit 1375 may receive the electrical command signal from the control unit 1365 to output a result of processing by the electronic system 1300.The output unit 1375 may be a monitor, a printer, a beam irradiator, or one of various mechanical devices.\",\n \"The output unit 1375 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.\",\n \"The storage unit 1380 may be an element for temporarily or permanently storing an electrical signal, which is to be processed by the control unit 1165, and an electrical signal generated through processing by the control unit 1165.The storage unit 1380 may be physically or electrically connected or coupled to the control unit 1365.The storage unit 1380 may be a semiconductor memory, a magnetic storage device such as a hard disk or the like, an optical storage device such as a compact disk or the like, a server having a data storing function, or the like.\",\n \"Also, the storage unit 1380 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.\",\n \"The communication unit 1385 may receive an electrical command signal from the control unit 1365 and may transfer the electrical command signal to another electronic system, or may receive an electrical command signal from the other electronic system.\",\n \"The communication unit 1385 may be a modem, a wired transmission/reception device, such as an LAN card, a wireless transmission/reception device such as a Wibro interface, an infrared port, or the like.\",\n \"Also, the communication unit 1385 may include one or more magnetoresistive memory cells according to the subject matter disclosed herein.\",\n \"The operation unit 1390 may perform a physical or mechanical operation according to a command of the control unit 1365.For example, the operation unit 1390 may be an element, which performs a mechanical operation, such as a plotter, an indicator, an up/down operation, or the like.\",\n \"The electronic system 1300 according to an exemplary embodiment may include a computer, a network server, a networking printer, or a scanner, a wireless controller, a mobile communication terminal, an exchanger, an electronic device performs a programmed operation, and/or the like.\",\n \"Moreover, the electronic system 1300 may be applied to mobile phones, MP3 players, navigation devices, portable multimedia players (PMPs), solid state disks (SSDs), household appliances, etc.\",\n \"As set forth above, since a magnetoresistive cell and an MRAM in accordance with embodiments disclosed herein include an oxide layer containing boron (B) on a free layer, physical characteristics of the free layer may be maintained and/or improved.\",\n \"Additionally, a method of forming a free layer, a magnetoresistive cell, and an MRAM in accordance with embodiments disclosed herein may include forming a preliminary free magnetic layer that includes boron (B), and forming a free layer magnetic layer by removing boron (B) from the preliminary free layer.\",\n \"Accordingly, the resulting free layer may include both a crystallized and substantially boron-free region, and an amorphous and boron-containing region.\",\n \"Further, the method of forming a free layer, a magnetoresistive cell, and an MRAM in accordance with the embodiments disclosed herein may include forming a preliminary free magnetic layer that includes boron (B), forming a buffer layer absorbing boron (B) on the preliminary free magnetic layer, and forming an oxide layer by oxidizing the boron-absorbed buffer layer.\",\n \"Accordingly, the process of forming the free layer, the magnetoresistive cell, and an MRAM and the magnetoresistive cell formed thereby may have excellent characteristics.\",\n \"The foregoing was for illustration of the embodiments only and is not to be construed as limiting thereof.\",\n \"Although a few embodiments have been described, those skilled in the art will readily appreciate that many modifications are possible without materially departing from the novel teachings and advantages.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870854"}}},{"rowIdx":4493660,"cells":{"text":{"kind":"list like","value":[["Three-Dimensional Vertical One-Time-Programmable Memory Comprising No Separate Diode Layer","The present invention discloses a three-dimensional vertical read-only memory (3D-OTPV) comprising no separate diode layer.","It comprises a plurality of vertical address line, a plurality of memory holes through said vertical address line, a plurality of antifuse layers and vertical address lines in said memory holes.","The memory holes comprise no separate diode layer.","The horizontal and vertical address lines comprise different metallic materials."],["1.A three-dimensional vertical read-only memory (3D-OTPV), comprising: a semiconductor substrate comprising a substrate circuit; a plurality of vertically stacked horizontal address lines above said semiconductor circuit, said horizontal address lines comprising a first metallic material; at least a memory hole through said plurality of horizontal address lines; an antifuse layer formed on the sidewall of said memory hole, wherein said antifuse layer is irreversibly switched from a high-resistance state to a low-resistance state during programming; a vertical address line formed by filling at least a conductive material in said memory hole, said vertical address lines comprising a second metallic material; a plurality of OTP cells formed at the intersections of said horizontal address lines and said vertical address line; said first and second metallic materials are different metallic materials.","2.The 3D-OTPV according to claim 1, wherein said first and second metallic materials have different work functions.","3.The 3D-OTPV according to claim 1, wherein said first metallic material, said antifuse layer and said second metallic material form a diode during programming.","4.The 3D-OTPV according to claim 3, wherein the resistance of said diode is substantially lower than when the applied voltage has a magnitude smaller than or a polarity opposite to that of the read voltage.","5.The 3D-OTPV according to claim 4, wherein all OTP cells coupled to a selected horizontal address line are read out in a single read cycle.","6.The 3D-OTPV according to claim 5, wherein the voltage on said selected horizontal address line is VR; and the output toggles when the voltage on a selected vertical address line reaches VT. 7.The 3D-OTPV according to claim 6, wherein the I-V characteristics of said diode satisfies I(VR)>>n*I(−VT), wherein n is the number of OTP cells on a horizontal address line.","8.The 3D-OTPV according to claim 1, wherein said OTP cells form an OTP string.","9.The 3D-OTPV according to claim 8, further comprising a vertical transistor coupled to said OTP string.","10.The 3D-OTPV according to claim 9, wherein said vertical transistor is formed in a first portion of said memory hole, and said OTP string is formed in a second portion of said memory hole.","11.The 3D-OTPV according to claim 1, wherein said OTP cells have more than two states, the OTP cells in different states having different resistance value after programming."],[" BACKGROUND "],[" SUMMARY OF THE INVENTION The present invention discloses three-dimensional vertical one-time-programmable memory (3D-OTP V ) comprising no separate diode layer.","It comprises a plurality of vertical OTP strings formed side-by-side on the substrate circuit.","Each OTP string is vertical to the substrate and comprises a plurality of vertically stacked OTP cells.","To be more specific, the 3D-OTP V comprises a plurality of vertically stacked horizontal address lines (word lines).","After the memory holes penetrating these horizontal address lines are formed, the sidewall of each memory hole is covered with an antifuse layer before the memory hole is filled with at least a conductive material, which comprises a metallic material or a doped semiconductor material.","The conductive material in each memory hole forms a vertical address line (bit line).","The OTP cells are formed at the intersections of the word lines and the bit lines.","To minimize the size of the memory holes, the OTP cell of the present invention comprises no diode layer.","Without diode layer, fewer layers (two instead of three) are formed inside the memory holes.","As a result, the manufacturing process inside the memory holes becomes simpler.","In addition, smaller memory holes will improve the storage density of the 3D-OTP V .","In the OTP cell of the present invention, a diode is formed naturally between the horizontal and vertical address lines.","This naturally formed diode, referred to a built-in diode, generally has a poor quality and is leaky.","To address this issue, the present invention discloses a full-read mode.","For the full-read mode, all OTP cells on a selected word line are read out during a read cycle.","The read cycle includes two read phases: a pre-charge phase and a read-out phase.","During the pre-charge phase, all address lines (including all word and all bit lines) in an OTP array are charged to a pre-determined voltage.","During the read-out phase, after its voltage is raised to the read voltage V R , a selected word line starts to charge all bit lines through the associated OTP cells.","By measuring the voltage change on the bit lines, the states of the associated OTP cells can be determined.","Accordingly, the present invention discloses a three-dimensional vertical read-only memory (3D-OTP V ), comprising: a semiconductor substrate comprising a substrate circuit; a plurality of vertically stacked horizontal address lines above said semiconductor circuit, said horizontal address lines comprising a first metallic material; at least a memory hole through said plurality of horizontal address lines; an antifuse layer formed on the sidewall of said memory hole, wherein said antifuse layer is irreversibly switched from a high-resistance state to a low-resistance state during programming; a vertical address line formed by filling at least a conductive material in said memory hole, said vertical address lines comprising a second metallic material; a plurality of OTP cells formed at the intersections of said horizontal address lines and said vertical address line; said first and second metallic materials are different metallic materials."],["CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation-in-part of “Three-Dimensional Vertical One-Time-Programmable Memory”, application Ser.","No.","15/488,489, filed on Apr.","16, 2017, which claims priority from Chinese Patent Application 201610234999.5, filed on Apr.","16, 2016, in the State Intellectual Property Office of the People's Republic of China (CN), the disclosure of which is incorporated herein by reference in its entirety.","This application also claims priority from Chinese Patent Application 201810022003.3, filed on Jan. 10, 2018; Chinese Patent Application 201810024499.8, filed on Jan. 10, 2018; in the State Intellectual Property Office of the People's Republic of China (CN), the disclosure of which are incorporated herein by references in their entireties.","BACKGROUND 1.Technical Field of the Invention The present invention relates to the field of integrated circuit, and more particularly to one-time-programmable memory (OTP).","2.Prior Art Three-dimensional one-time-programmable memory (3D-OTP) is a monolithic semiconductor memory.","It comprises a plurality of vertically stacked OTP cells.","In a conventional OTP, the OTP cells are formed on a two-dimensional (2-D) plane (i.e.","on a semiconductor substrate).","In contrast, the OTP cells of the 3D-OTP are formed in a three-dimensional (3-D) space.","The 3D-OPT has a large storage density and a low storage cost.","Because the 3D-OTP has a long data retention, it is suitable for long-term data storage.","U.S. patent application Ser.","No.","15/360,895 filed by Hsu on Nov. 23, 2016 discloses a 3-D vertical memory.","It comprises a plurality of horizontal address lines vertically stacked above each other, a plurality of memory holes penetrating the horizontal address lines, a programmable layer (e.g.","an antifuse layer) and a selector layer covering the sidewall of each memory hole, and a plurality of vertical address lines formed in the memory holes.","It should be noted that the selector (or, selector layer) is also referred to as diode (or, diode layer), steering element, quasi-conduction layer, or other names in other patents and patent applications.","All of them refer to a broad class of diode-like devices whose resistance at the read voltage (i.e.","the read resistance) is substantially lower than when the applied voltage has a magnitude smaller than or a polarity opposite to that of the read voltage.","Throughout this specification, the term “diode” is used for this class of devices.","The 3-D vertical memory of Hsu uses a cross-point array.","In order to minimize cross-talk between memory cells, the memory cell of Hsu comprises a separate diode layer (i.e.","selector).","A good-quality diode layer is generally thick.","For example, a P-N thin-film diode with a good rectifying ratio is at least 100 nm thick.","When a diode layer with such a thickness is formed in the memory hole, the diameter of the memory hole becomes large (>200 nm).","This leads to a lower storage density.","Objects and Advantages It is a principle object of the present invention to provide a 3D-OTP with a large storage capacity.","It is a further object of the present invention to simplify the manufacturing process inside the memory holes.","It is a further object of the present invention to minimize the size of the memory holes.","It is a further object of the present invention to provide a properly working 3D-OTP even with leaky OTP cells.","In accordance with these and other objects of the present invention, the present invention discloses a three-dimensional vertical one-time-programmable memory (3D-OTPV) comprising no separate diode layer.","SUMMARY OF THE INVENTION The present invention discloses three-dimensional vertical one-time-programmable memory (3D-OTPV) comprising no separate diode layer.","It comprises a plurality of vertical OTP strings formed side-by-side on the substrate circuit.","Each OTP string is vertical to the substrate and comprises a plurality of vertically stacked OTP cells.","To be more specific, the 3D-OTPV comprises a plurality of vertically stacked horizontal address lines (word lines).","After the memory holes penetrating these horizontal address lines are formed, the sidewall of each memory hole is covered with an antifuse layer before the memory hole is filled with at least a conductive material, which comprises a metallic material or a doped semiconductor material.","The conductive material in each memory hole forms a vertical address line (bit line).","The OTP cells are formed at the intersections of the word lines and the bit lines.","To minimize the size of the memory holes, the OTP cell of the present invention comprises no diode layer.","Without diode layer, fewer layers (two instead of three) are formed inside the memory holes.","As a result, the manufacturing process inside the memory holes becomes simpler.","In addition, smaller memory holes will improve the storage density of the 3D-OTPV.","In the OTP cell of the present invention, a diode is formed naturally between the horizontal and vertical address lines.","This naturally formed diode, referred to a built-in diode, generally has a poor quality and is leaky.","To address this issue, the present invention discloses a full-read mode.","For the full-read mode, all OTP cells on a selected word line are read out during a read cycle.","The read cycle includes two read phases: a pre-charge phase and a read-out phase.","During the pre-charge phase, all address lines (including all word and all bit lines) in an OTP array are charged to a pre-determined voltage.","During the read-out phase, after its voltage is raised to the read voltage VR, a selected word line starts to charge all bit lines through the associated OTP cells.","By measuring the voltage change on the bit lines, the states of the associated OTP cells can be determined.","Accordingly, the present invention discloses a three-dimensional vertical read-only memory (3D-OTPV), comprising: a semiconductor substrate comprising a substrate circuit; a plurality of vertically stacked horizontal address lines above said semiconductor circuit, said horizontal address lines comprising a first metallic material; at least a memory hole through said plurality of horizontal address lines; an antifuse layer formed on the sidewall of said memory hole, wherein said antifuse layer is irreversibly switched from a high-resistance state to a low-resistance state during programming; a vertical address line formed by filling at least a conductive material in said memory hole, said vertical address lines comprising a second metallic material; a plurality of OTP cells formed at the intersections of said horizontal address lines and said vertical address line; said first and second metallic materials are different metallic materials.","BRIEF DESCRIPTION OF THE DRAWINGS FIG.","1A is a z-x cross-sectional view of a first preferred 3D-OTPV; FIG.","1B is its x-y cross-sectional view along the cutline AA′; FIG.","1C is a z-x cross-sectional view of a preferred OTP cell; FIGS.","2A-2C are cross-sectional views of the first preferred 3D-OTPV at three manufacturing steps; FIG.","3A is a symbol of the OTP cell; FIG.","3B is a circuit block diagram of a first preferred read-out circuit for an OTP array; FIG.","3C is its signal timing diagram; FIG.","3D shows the current-voltage (I-V) characteristic of a preferred diode layer; FIG.","4A is a z-x cross-sectional view of a second preferred 3D-OTPV; FIG.","4B is its x-y cross-sectional view along the cutline CC′; FIG.","4C is a circuit block diagram of a second preferred read-out circuit for an OTP array; FIG.","5 is a cross-sectional view of a multi-bit-per-cell 3D-OTPV.","It should be noted that all the drawings are schematic and not drawn to scale.","Relative dimensions and proportions of parts of the device structures in the figures have been shown exaggerated or reduced in size for the sake of clarity and convenience in the drawings.","The same reference symbols are generally used to refer to corresponding or similar features in the different embodiments.","The symbol “/” means a relationship of “and” or “or”.","Throughout the present invention, the phrase “on the substrate” means the active elements of a circuit are formed on the surface of the substrate, although the interconnects between these active elements are formed above the substrate and do not touch the substrate; the phrase “above the substrate” means the active elements are formed above the substrate and do not touch the substrate.","DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Those of ordinary skills in the art will realize that the following description of the present invention is illustrative only and is not intended to be in any way limiting.","Other embodiments of the invention will readily suggest themselves to such skilled persons from an examination of the within disclosure.","Referring now to FIG.","1A-1C, a first preferred three-dimensional vertical one-time-programmable memory (3D-OTPV) comprising no separate diode layer is disclosed.","It comprises a plurality of vertical OTP strings 1A, 1B .",".",".","(referred to as OTP strings) formed side-by-side on the substrate circuit 0K.","Each OTP string (e.g.","1A) is vertical to the substrate 0 and comprises a plurality of vertically stacked OTP cells 1aa-1ha.","The preferred embodiment shown in this figure is an OTP array 10, which is a collection of all OT cells sharing at least an address line.","It comprises a plurality of vertically stacked horizontal address lines (word lines) 8a-8h.","After the memory holes 2a-2d penetrating these horizontal address lines 8a-8h are formed, the sidewalls of the memory holes 2a-2d are covered with an antifuse layer 6a-6d before the memory holes 2a-2d are filled with at least a conductive material, which comprise a metallic material or a doped semiconductor material.","The conductive material in the memory holes 2a-2d form vertical address lines (bit lines) 4a-4d.","The OTP cells 1aa-1ha on the OTP string 1A are formed at the intersections of the word lines 8a-8h and the bit line 4a.","In the OTP cell 1aa, the antifuse layer 6a is a thin layer of insulating dielectric.","During programming, a conductive filament 11, which has a low resistance, is irreversibly formed therein.","As an example, the antifuse layer 6a comprises silicon oxide or silicon nitride.","The thickness of the antifuse layer 6a is small, typically in the range of several nanometers to tens of nanometers.","For reason of simplicity, except for the OTP cell 1aa, the conductive filaments in other OTP cells are not drawn.","FIG.","1B is its x-y cross-sectional view along the cutline AA′.","Each of the horizontal address lines (word lines) 8a, 8a′ is a conductive plate.","The horizontal address line 8a is coupled with eight vertical address lines (bit lines) 4a-4h.","Eight OTP cells 1aa-1ah are formed at the intersections of the horizontal address 8a and the vertical address lines 4a-4h.","All OTP cells 1aa-1ah coupled with a single horizontal address line 8a form an OTP-cell set 1a.","Because the horizontal address line 8a is wide, it can be formed by a low-resolution photolithography (e.g.","with feature size >60 nm).","To minimize the size of the memory holes, the OTP cell of the present invention does not comprise a separate diode layer.","As shown in FIG.","1C, the OTP cell 1aa comprises a separate antifuse layer 6a, but no separate diode layer.","Because no diode layer is formed on the sidewall of the memory hole 2a, the manufacturing process inside the memory hole 2a becomes simpler.","In addition, smaller memory hole 2a will improve the storage density of 3D-OTPV.","In the present invention, diode is formed naturally between the horizontal address line 8a and the vertical address line 4a.","This diode is referred to as built-in diode.","In a first preferred embodiment, the horizontal address line 8a comprises a P-type semiconductor material, while the vertical address line 4a comprises an N-type semiconductor material.","The built-in diode is a semiconductor diode.","In a second preferred embodiment, the horizontal address line 8a comprises a metallic material, while the vertical address line 4a comprises a semiconductor material.","The built-in diode is a Schottky diode.","In a third preferred embodiment, the horizontal address line 8a comprises a semiconductor material, while the vertical address line 4a comprises a metallic material.","The built-in diode is a Schottky diode.","Alternatively, in a fourth preferred embodiment, the horizontal address line 8a comprises a first metallic material, while the vertical address line 4a comprises a second metallic material.","The first and second metallic materials are different metallic materials.","For example, the first and second metallic materials have different work functions.","During programming, when the antifuse layer 6a breaks down at location 11, the metallic material from one of the address lines (e.g.","the second metallic material from the vertical address line 4a) reacts with the antifuse material (e.g.","silicon oxide) to form a metallic compound (e.g.","metal oxide of the second metallic material).","As a result, a diode comprising the first metallic material, the metallic compound, and the second metallic material will be formed between the horizontal address line 8a and the vertical address line 4a.","Referring now to FIGS.","2A-2C, three manufacturing steps for the preferred 3D-OTPV are shown.","First of all, vertically stacked horizontal address-line layers 12a-12h are formed in continuously forming steps (FIG.","2A).","To be more specific, after the substrate circuit 0K (including transistors and the associated interconnects) are planarized, a first horizontal address-line layer 12a is formed.","The first horizontal address-line layer 12a is just a plain layer of conductive materials and contains no patterns.","Then a first insulating layer 5a is formed on the first horizontal address-line layer 12a.","Similarly, the first insulating layer 5a contains no patterns.","Repeating the above process until alternate layers of the horizontal address-line layers and the insulating layers (a total of M layers) are formed.","“Continuously forming steps” means that these forming steps (for the horizontal address-line layer and the insulating layer) are carried out continuously without any in-between pattern-transfer steps (including photolithography).","Without any in-between pattern-transfer steps, excellent planarization can be achieve.","As a result, the 3D-OTPV comprising tens to hundreds of horizontal address-line layers can be formed.","This is significantly more than the 3D-OPTH.","A first etching step is performed through all horizontal address-line layers 12a-12h to form a stack of horizontal address lines 8a-8h in (FIG.","2B).","This is followed by a second etching step to form memory holes 2a-2d through all horizontal address lines 8a-8h (FIG.","2C).","The sidewall of the memory holes 2a-2d is covered by an antifuse layers 6a-6d before the memory holes 2a-2d are filled with at least a conductive material to form the vertical address lines 4a-4d (FIG.","1A).","FIG.","3A is a symbol of the OTP cell 1.The OTP cell 1, located between a word line 8 and a bit line 4, comprises an antifuse 12 and a diode 14.The resistance of the antifuse 12 is irreversibly switched from high to low during programming.","The resistance of the diode 14 at the read voltage is substantially lower than when the applied voltage has a magnitude smaller than or polarity opposite to that of the read voltage.","The diode 14 is formed naturally between the word line 8 and the bit lines 4.This naturally formed diode 14, referred to a built-in diode, generally has a poor quality and is leaky.","To address this issue, the present invention discloses a full-read mode.","For the full-read mode, all OTP cells on a selected word line are read out during a read cycle.","FIG.","3B discloses a first preferred read-out circuit for an OTP array 10.It runs in the full-read mode.","In this preferred embodiment, the horizontal address lines 8a-8h are word lines, while the vertical address lines 4a-4h are bit lines.","An OTP array 10 comprises the word lines 8a-8h, the bit lines 4a-4h, and the OTP cells 1aa-1ad .",".",".","located at their intersections.","Its peripheral circuits (located on the substrate 0 and is not part of the OTP array 10) comprise a multiplexor 40 and an amplifier 30.In this preferred embodiment, the multiplexor 40 is a 4-to-1 multiplexor.","FIG.","3C is its signal timing diagram.","A read cycle T includes two read phases: a pre-charge phase tpre and a read-out phase tR.","During the pre-charge phase tpre, all address lines 8a-8h, 4a-4h in the OTP array 10 are charged to a pre-determined voltage (e.g.","an input bias voltage Vi of the amplifier 30).","During the read-out phase tR, all bit lines 4a-4h are floating.","The voltage on a selected word line (e.g.","8a) is raised to the read voltage VR, while voltage on other word lines 8b-8h remains at the input bias voltage Vi.","After this, the selected word line 8a starts to charge all bit lines 4a-4h through the OTP cells 1aa .",".",".","and the voltages on the bit lines 4a-4h begin to rise.","The multiplexor 40 sends the voltage on each bit line (e.g.","4a) to the amplifier 30.When this voltage exceeds the threshold voltage VT of the amplifier 30, the output VO is toggled.","At the end of the read cycle T, the states of all OTP cells 1aa-1ah in the OTP-cell set 1a are determined.","FIG.","3D shows the current-voltage (I-V) characteristic of a preferred diode layer.","Because the VT of the amplifier 30 is relatively small (˜0.1V or smaller), the voltage changes delta(V) on the bit lines 4a-4h during the above measurement are small, i.e.","delta(V)˜VT.","The reverse voltage on the unselected OTP cells (e.g.","1 ca) is ˜VT.","As long as the I-V characteristic of the diode satisfies I(VR)>>n*I(−VT), the 3D-OTPV would work properly.","Here, n is the number of OTP cells on a bit line (e.g.","4a).","It should be noted that, because the value of VR (several volts) is far larger than that of the −VT (˜0.1V), even if the OTP cells are leaky, the above condition can be easily met.","To facilitate address decoding, vertical transistors are formed on the sidewalls of the memory holes.","FIGS.","4A-4C disclose a second preferred 3D-OTPV 10 comprising vertical transistors 3aa-3ad.","The vertical transistor 3aa is a pass transistor comprising a gate 7a, a gate dielectric 6a and a channel 9a (FIG.","4A).","The channel 9a is formed in the semiconductor material filled in the memory hole 2a.","Its doping could be same as, lighter than, or opposite to that of the vertical address line 4a.","The gate 7a surrounds the memory holes 2a, 2e and controls the pass transistors 3aa, 3ae (FIG.","4B); the gate 7b surrounds the memory holes 2b, 2f and controls the pass transistors 3ab, 3af; the gate 7c surrounds the memory holes 2c, 2g and controls the pass transistors 3ac, 3ag; the gate 7d surrounds the memory holes 2e, 2h and controls the pass transistors 3ae, 3ah.","The pass transistors 3aa-3ah form at least a decoding stage (FIG.","4C).","In one preferred embodiment, when the voltage on the gate 7a is high while the voltages on the gates 7b-7d are low, only the pass transistors 3aa, 3ae are turn on, with other pass transistors off.","The substrate multiplexor 40′ is a 2-to-1 multiplexor which selects a signal from the bit lines 4a, 4e.","By forming vertical transistors 3aa-3d in the memory holes 2a-2d, the decoder design could be simplified.","FIG.","5 discloses a multi-bit-per-cell 3D-OTPV.","It comprises a plurality of OTP cells 1aa-1ah.","In this preferred embodiment, the OTP cells 1aa-1ah have four states: ‘0’, ‘1’, ‘2’, ‘3’.","The OTP cells 1aa-1ah in different states are programmed by different programming currents and therefore, have different resistance.","The OTP cells 1ac, 1ae, 1ah are in the state ‘0’.","Being un-programmed, their antifuse layers 6c, 6e, 6h are intact.","Other OTP cells are programmed.","Among them, the OTP cells 1ab, 1ag are in the state ‘1’, which have the largest resistance as the conductive filaments 11b are the thinnest; the OTP cell 1aa is in the state ‘3’, which has the smallest resistance as the conductive filament 11d is the thickest; the OTP cells 1ad, 1af are in the state ‘2, which have an intermediate resistance as the size of its conductive filament 11c is between those of 11b and 11d.","While illustrative embodiments have been shown and described, it would be apparent to those skilled in the art that many more modifications than that have been mentioned above are possible without departing from the inventive concepts set forth therein.","The invention, therefore, is not to be limited except in the spirit of the appended claims."]],"string":"[\n [\n \"Three-Dimensional Vertical One-Time-Programmable Memory Comprising No Separate Diode Layer\",\n \"The present invention discloses a three-dimensional vertical read-only memory (3D-OTPV) comprising no separate diode layer.\",\n \"It comprises a plurality of vertical address line, a plurality of memory holes through said vertical address line, a plurality of antifuse layers and vertical address lines in said memory holes.\",\n \"The memory holes comprise no separate diode layer.\",\n \"The horizontal and vertical address lines comprise different metallic materials.\"\n ],\n [\n \"1.A three-dimensional vertical read-only memory (3D-OTPV), comprising: a semiconductor substrate comprising a substrate circuit; a plurality of vertically stacked horizontal address lines above said semiconductor circuit, said horizontal address lines comprising a first metallic material; at least a memory hole through said plurality of horizontal address lines; an antifuse layer formed on the sidewall of said memory hole, wherein said antifuse layer is irreversibly switched from a high-resistance state to a low-resistance state during programming; a vertical address line formed by filling at least a conductive material in said memory hole, said vertical address lines comprising a second metallic material; a plurality of OTP cells formed at the intersections of said horizontal address lines and said vertical address line; said first and second metallic materials are different metallic materials.\",\n \"2.The 3D-OTPV according to claim 1, wherein said first and second metallic materials have different work functions.\",\n \"3.The 3D-OTPV according to claim 1, wherein said first metallic material, said antifuse layer and said second metallic material form a diode during programming.\",\n \"4.The 3D-OTPV according to claim 3, wherein the resistance of said diode is substantially lower than when the applied voltage has a magnitude smaller than or a polarity opposite to that of the read voltage.\",\n \"5.The 3D-OTPV according to claim 4, wherein all OTP cells coupled to a selected horizontal address line are read out in a single read cycle.\",\n \"6.The 3D-OTPV according to claim 5, wherein the voltage on said selected horizontal address line is VR; and the output toggles when the voltage on a selected vertical address line reaches VT. 7.The 3D-OTPV according to claim 6, wherein the I-V characteristics of said diode satisfies I(VR)>>n*I(−VT), wherein n is the number of OTP cells on a horizontal address line.\",\n \"8.The 3D-OTPV according to claim 1, wherein said OTP cells form an OTP string.\",\n \"9.The 3D-OTPV according to claim 8, further comprising a vertical transistor coupled to said OTP string.\",\n \"10.The 3D-OTPV according to claim 9, wherein said vertical transistor is formed in a first portion of said memory hole, and said OTP string is formed in a second portion of said memory hole.\",\n \"11.The 3D-OTPV according to claim 1, wherein said OTP cells have more than two states, the OTP cells in different states having different resistance value after programming.\"\n ],\n [\n \" BACKGROUND \"\n ],\n [\n \" SUMMARY OF THE INVENTION The present invention discloses three-dimensional vertical one-time-programmable memory (3D-OTP V ) comprising no separate diode layer.\",\n \"It comprises a plurality of vertical OTP strings formed side-by-side on the substrate circuit.\",\n \"Each OTP string is vertical to the substrate and comprises a plurality of vertically stacked OTP cells.\",\n \"To be more specific, the 3D-OTP V comprises a plurality of vertically stacked horizontal address lines (word lines).\",\n \"After the memory holes penetrating these horizontal address lines are formed, the sidewall of each memory hole is covered with an antifuse layer before the memory hole is filled with at least a conductive material, which comprises a metallic material or a doped semiconductor material.\",\n \"The conductive material in each memory hole forms a vertical address line (bit line).\",\n \"The OTP cells are formed at the intersections of the word lines and the bit lines.\",\n \"To minimize the size of the memory holes, the OTP cell of the present invention comprises no diode layer.\",\n \"Without diode layer, fewer layers (two instead of three) are formed inside the memory holes.\",\n \"As a result, the manufacturing process inside the memory holes becomes simpler.\",\n \"In addition, smaller memory holes will improve the storage density of the 3D-OTP V .\",\n \"In the OTP cell of the present invention, a diode is formed naturally between the horizontal and vertical address lines.\",\n \"This naturally formed diode, referred to a built-in diode, generally has a poor quality and is leaky.\",\n \"To address this issue, the present invention discloses a full-read mode.\",\n \"For the full-read mode, all OTP cells on a selected word line are read out during a read cycle.\",\n \"The read cycle includes two read phases: a pre-charge phase and a read-out phase.\",\n \"During the pre-charge phase, all address lines (including all word and all bit lines) in an OTP array are charged to a pre-determined voltage.\",\n \"During the read-out phase, after its voltage is raised to the read voltage V R , a selected word line starts to charge all bit lines through the associated OTP cells.\",\n \"By measuring the voltage change on the bit lines, the states of the associated OTP cells can be determined.\",\n \"Accordingly, the present invention discloses a three-dimensional vertical read-only memory (3D-OTP V ), comprising: a semiconductor substrate comprising a substrate circuit; a plurality of vertically stacked horizontal address lines above said semiconductor circuit, said horizontal address lines comprising a first metallic material; at least a memory hole through said plurality of horizontal address lines; an antifuse layer formed on the sidewall of said memory hole, wherein said antifuse layer is irreversibly switched from a high-resistance state to a low-resistance state during programming; a vertical address line formed by filling at least a conductive material in said memory hole, said vertical address lines comprising a second metallic material; a plurality of OTP cells formed at the intersections of said horizontal address lines and said vertical address line; said first and second metallic materials are different metallic materials.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation-in-part of “Three-Dimensional Vertical One-Time-Programmable Memory”, application Ser.\",\n \"No.\",\n \"15/488,489, filed on Apr.\",\n \"16, 2017, which claims priority from Chinese Patent Application 201610234999.5, filed on Apr.\",\n \"16, 2016, in the State Intellectual Property Office of the People's Republic of China (CN), the disclosure of which is incorporated herein by reference in its entirety.\",\n \"This application also claims priority from Chinese Patent Application 201810022003.3, filed on Jan. 10, 2018; Chinese Patent Application 201810024499.8, filed on Jan. 10, 2018; in the State Intellectual Property Office of the People's Republic of China (CN), the disclosure of which are incorporated herein by references in their entireties.\",\n \"BACKGROUND 1.Technical Field of the Invention The present invention relates to the field of integrated circuit, and more particularly to one-time-programmable memory (OTP).\",\n \"2.Prior Art Three-dimensional one-time-programmable memory (3D-OTP) is a monolithic semiconductor memory.\",\n \"It comprises a plurality of vertically stacked OTP cells.\",\n \"In a conventional OTP, the OTP cells are formed on a two-dimensional (2-D) plane (i.e.\",\n \"on a semiconductor substrate).\",\n \"In contrast, the OTP cells of the 3D-OTP are formed in a three-dimensional (3-D) space.\",\n \"The 3D-OPT has a large storage density and a low storage cost.\",\n \"Because the 3D-OTP has a long data retention, it is suitable for long-term data storage.\",\n \"U.S. patent application Ser.\",\n \"No.\",\n \"15/360,895 filed by Hsu on Nov. 23, 2016 discloses a 3-D vertical memory.\",\n \"It comprises a plurality of horizontal address lines vertically stacked above each other, a plurality of memory holes penetrating the horizontal address lines, a programmable layer (e.g.\",\n \"an antifuse layer) and a selector layer covering the sidewall of each memory hole, and a plurality of vertical address lines formed in the memory holes.\",\n \"It should be noted that the selector (or, selector layer) is also referred to as diode (or, diode layer), steering element, quasi-conduction layer, or other names in other patents and patent applications.\",\n \"All of them refer to a broad class of diode-like devices whose resistance at the read voltage (i.e.\",\n \"the read resistance) is substantially lower than when the applied voltage has a magnitude smaller than or a polarity opposite to that of the read voltage.\",\n \"Throughout this specification, the term “diode” is used for this class of devices.\",\n \"The 3-D vertical memory of Hsu uses a cross-point array.\",\n \"In order to minimize cross-talk between memory cells, the memory cell of Hsu comprises a separate diode layer (i.e.\",\n \"selector).\",\n \"A good-quality diode layer is generally thick.\",\n \"For example, a P-N thin-film diode with a good rectifying ratio is at least 100 nm thick.\",\n \"When a diode layer with such a thickness is formed in the memory hole, the diameter of the memory hole becomes large (>200 nm).\",\n \"This leads to a lower storage density.\",\n \"Objects and Advantages It is a principle object of the present invention to provide a 3D-OTP with a large storage capacity.\",\n \"It is a further object of the present invention to simplify the manufacturing process inside the memory holes.\",\n \"It is a further object of the present invention to minimize the size of the memory holes.\",\n \"It is a further object of the present invention to provide a properly working 3D-OTP even with leaky OTP cells.\",\n \"In accordance with these and other objects of the present invention, the present invention discloses a three-dimensional vertical one-time-programmable memory (3D-OTPV) comprising no separate diode layer.\",\n \"SUMMARY OF THE INVENTION The present invention discloses three-dimensional vertical one-time-programmable memory (3D-OTPV) comprising no separate diode layer.\",\n \"It comprises a plurality of vertical OTP strings formed side-by-side on the substrate circuit.\",\n \"Each OTP string is vertical to the substrate and comprises a plurality of vertically stacked OTP cells.\",\n \"To be more specific, the 3D-OTPV comprises a plurality of vertically stacked horizontal address lines (word lines).\",\n \"After the memory holes penetrating these horizontal address lines are formed, the sidewall of each memory hole is covered with an antifuse layer before the memory hole is filled with at least a conductive material, which comprises a metallic material or a doped semiconductor material.\",\n \"The conductive material in each memory hole forms a vertical address line (bit line).\",\n \"The OTP cells are formed at the intersections of the word lines and the bit lines.\",\n \"To minimize the size of the memory holes, the OTP cell of the present invention comprises no diode layer.\",\n \"Without diode layer, fewer layers (two instead of three) are formed inside the memory holes.\",\n \"As a result, the manufacturing process inside the memory holes becomes simpler.\",\n \"In addition, smaller memory holes will improve the storage density of the 3D-OTPV.\",\n \"In the OTP cell of the present invention, a diode is formed naturally between the horizontal and vertical address lines.\",\n \"This naturally formed diode, referred to a built-in diode, generally has a poor quality and is leaky.\",\n \"To address this issue, the present invention discloses a full-read mode.\",\n \"For the full-read mode, all OTP cells on a selected word line are read out during a read cycle.\",\n \"The read cycle includes two read phases: a pre-charge phase and a read-out phase.\",\n \"During the pre-charge phase, all address lines (including all word and all bit lines) in an OTP array are charged to a pre-determined voltage.\",\n \"During the read-out phase, after its voltage is raised to the read voltage VR, a selected word line starts to charge all bit lines through the associated OTP cells.\",\n \"By measuring the voltage change on the bit lines, the states of the associated OTP cells can be determined.\",\n \"Accordingly, the present invention discloses a three-dimensional vertical read-only memory (3D-OTPV), comprising: a semiconductor substrate comprising a substrate circuit; a plurality of vertically stacked horizontal address lines above said semiconductor circuit, said horizontal address lines comprising a first metallic material; at least a memory hole through said plurality of horizontal address lines; an antifuse layer formed on the sidewall of said memory hole, wherein said antifuse layer is irreversibly switched from a high-resistance state to a low-resistance state during programming; a vertical address line formed by filling at least a conductive material in said memory hole, said vertical address lines comprising a second metallic material; a plurality of OTP cells formed at the intersections of said horizontal address lines and said vertical address line; said first and second metallic materials are different metallic materials.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS FIG.\",\n \"1A is a z-x cross-sectional view of a first preferred 3D-OTPV; FIG.\",\n \"1B is its x-y cross-sectional view along the cutline AA′; FIG.\",\n \"1C is a z-x cross-sectional view of a preferred OTP cell; FIGS.\",\n \"2A-2C are cross-sectional views of the first preferred 3D-OTPV at three manufacturing steps; FIG.\",\n \"3A is a symbol of the OTP cell; FIG.\",\n \"3B is a circuit block diagram of a first preferred read-out circuit for an OTP array; FIG.\",\n \"3C is its signal timing diagram; FIG.\",\n \"3D shows the current-voltage (I-V) characteristic of a preferred diode layer; FIG.\",\n \"4A is a z-x cross-sectional view of a second preferred 3D-OTPV; FIG.\",\n \"4B is its x-y cross-sectional view along the cutline CC′; FIG.\",\n \"4C is a circuit block diagram of a second preferred read-out circuit for an OTP array; FIG.\",\n \"5 is a cross-sectional view of a multi-bit-per-cell 3D-OTPV.\",\n \"It should be noted that all the drawings are schematic and not drawn to scale.\",\n \"Relative dimensions and proportions of parts of the device structures in the figures have been shown exaggerated or reduced in size for the sake of clarity and convenience in the drawings.\",\n \"The same reference symbols are generally used to refer to corresponding or similar features in the different embodiments.\",\n \"The symbol “/” means a relationship of “and” or “or”.\",\n \"Throughout the present invention, the phrase “on the substrate” means the active elements of a circuit are formed on the surface of the substrate, although the interconnects between these active elements are formed above the substrate and do not touch the substrate; the phrase “above the substrate” means the active elements are formed above the substrate and do not touch the substrate.\",\n \"DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Those of ordinary skills in the art will realize that the following description of the present invention is illustrative only and is not intended to be in any way limiting.\",\n \"Other embodiments of the invention will readily suggest themselves to such skilled persons from an examination of the within disclosure.\",\n \"Referring now to FIG.\",\n \"1A-1C, a first preferred three-dimensional vertical one-time-programmable memory (3D-OTPV) comprising no separate diode layer is disclosed.\",\n \"It comprises a plurality of vertical OTP strings 1A, 1B .\",\n \".\",\n \".\",\n \"(referred to as OTP strings) formed side-by-side on the substrate circuit 0K.\",\n \"Each OTP string (e.g.\",\n \"1A) is vertical to the substrate 0 and comprises a plurality of vertically stacked OTP cells 1aa-1ha.\",\n \"The preferred embodiment shown in this figure is an OTP array 10, which is a collection of all OT cells sharing at least an address line.\",\n \"It comprises a plurality of vertically stacked horizontal address lines (word lines) 8a-8h.\",\n \"After the memory holes 2a-2d penetrating these horizontal address lines 8a-8h are formed, the sidewalls of the memory holes 2a-2d are covered with an antifuse layer 6a-6d before the memory holes 2a-2d are filled with at least a conductive material, which comprise a metallic material or a doped semiconductor material.\",\n \"The conductive material in the memory holes 2a-2d form vertical address lines (bit lines) 4a-4d.\",\n \"The OTP cells 1aa-1ha on the OTP string 1A are formed at the intersections of the word lines 8a-8h and the bit line 4a.\",\n \"In the OTP cell 1aa, the antifuse layer 6a is a thin layer of insulating dielectric.\",\n \"During programming, a conductive filament 11, which has a low resistance, is irreversibly formed therein.\",\n \"As an example, the antifuse layer 6a comprises silicon oxide or silicon nitride.\",\n \"The thickness of the antifuse layer 6a is small, typically in the range of several nanometers to tens of nanometers.\",\n \"For reason of simplicity, except for the OTP cell 1aa, the conductive filaments in other OTP cells are not drawn.\",\n \"FIG.\",\n \"1B is its x-y cross-sectional view along the cutline AA′.\",\n \"Each of the horizontal address lines (word lines) 8a, 8a′ is a conductive plate.\",\n \"The horizontal address line 8a is coupled with eight vertical address lines (bit lines) 4a-4h.\",\n \"Eight OTP cells 1aa-1ah are formed at the intersections of the horizontal address 8a and the vertical address lines 4a-4h.\",\n \"All OTP cells 1aa-1ah coupled with a single horizontal address line 8a form an OTP-cell set 1a.\",\n \"Because the horizontal address line 8a is wide, it can be formed by a low-resolution photolithography (e.g.\",\n \"with feature size >60 nm).\",\n \"To minimize the size of the memory holes, the OTP cell of the present invention does not comprise a separate diode layer.\",\n \"As shown in FIG.\",\n \"1C, the OTP cell 1aa comprises a separate antifuse layer 6a, but no separate diode layer.\",\n \"Because no diode layer is formed on the sidewall of the memory hole 2a, the manufacturing process inside the memory hole 2a becomes simpler.\",\n \"In addition, smaller memory hole 2a will improve the storage density of 3D-OTPV.\",\n \"In the present invention, diode is formed naturally between the horizontal address line 8a and the vertical address line 4a.\",\n \"This diode is referred to as built-in diode.\",\n \"In a first preferred embodiment, the horizontal address line 8a comprises a P-type semiconductor material, while the vertical address line 4a comprises an N-type semiconductor material.\",\n \"The built-in diode is a semiconductor diode.\",\n \"In a second preferred embodiment, the horizontal address line 8a comprises a metallic material, while the vertical address line 4a comprises a semiconductor material.\",\n \"The built-in diode is a Schottky diode.\",\n \"In a third preferred embodiment, the horizontal address line 8a comprises a semiconductor material, while the vertical address line 4a comprises a metallic material.\",\n \"The built-in diode is a Schottky diode.\",\n \"Alternatively, in a fourth preferred embodiment, the horizontal address line 8a comprises a first metallic material, while the vertical address line 4a comprises a second metallic material.\",\n \"The first and second metallic materials are different metallic materials.\",\n \"For example, the first and second metallic materials have different work functions.\",\n \"During programming, when the antifuse layer 6a breaks down at location 11, the metallic material from one of the address lines (e.g.\",\n \"the second metallic material from the vertical address line 4a) reacts with the antifuse material (e.g.\",\n \"silicon oxide) to form a metallic compound (e.g.\",\n \"metal oxide of the second metallic material).\",\n \"As a result, a diode comprising the first metallic material, the metallic compound, and the second metallic material will be formed between the horizontal address line 8a and the vertical address line 4a.\",\n \"Referring now to FIGS.\",\n \"2A-2C, three manufacturing steps for the preferred 3D-OTPV are shown.\",\n \"First of all, vertically stacked horizontal address-line layers 12a-12h are formed in continuously forming steps (FIG.\",\n \"2A).\",\n \"To be more specific, after the substrate circuit 0K (including transistors and the associated interconnects) are planarized, a first horizontal address-line layer 12a is formed.\",\n \"The first horizontal address-line layer 12a is just a plain layer of conductive materials and contains no patterns.\",\n \"Then a first insulating layer 5a is formed on the first horizontal address-line layer 12a.\",\n \"Similarly, the first insulating layer 5a contains no patterns.\",\n \"Repeating the above process until alternate layers of the horizontal address-line layers and the insulating layers (a total of M layers) are formed.\",\n \"“Continuously forming steps” means that these forming steps (for the horizontal address-line layer and the insulating layer) are carried out continuously without any in-between pattern-transfer steps (including photolithography).\",\n \"Without any in-between pattern-transfer steps, excellent planarization can be achieve.\",\n \"As a result, the 3D-OTPV comprising tens to hundreds of horizontal address-line layers can be formed.\",\n \"This is significantly more than the 3D-OPTH.\",\n \"A first etching step is performed through all horizontal address-line layers 12a-12h to form a stack of horizontal address lines 8a-8h in (FIG.\",\n \"2B).\",\n \"This is followed by a second etching step to form memory holes 2a-2d through all horizontal address lines 8a-8h (FIG.\",\n \"2C).\",\n \"The sidewall of the memory holes 2a-2d is covered by an antifuse layers 6a-6d before the memory holes 2a-2d are filled with at least a conductive material to form the vertical address lines 4a-4d (FIG.\",\n \"1A).\",\n \"FIG.\",\n \"3A is a symbol of the OTP cell 1.The OTP cell 1, located between a word line 8 and a bit line 4, comprises an antifuse 12 and a diode 14.The resistance of the antifuse 12 is irreversibly switched from high to low during programming.\",\n \"The resistance of the diode 14 at the read voltage is substantially lower than when the applied voltage has a magnitude smaller than or polarity opposite to that of the read voltage.\",\n \"The diode 14 is formed naturally between the word line 8 and the bit lines 4.This naturally formed diode 14, referred to a built-in diode, generally has a poor quality and is leaky.\",\n \"To address this issue, the present invention discloses a full-read mode.\",\n \"For the full-read mode, all OTP cells on a selected word line are read out during a read cycle.\",\n \"FIG.\",\n \"3B discloses a first preferred read-out circuit for an OTP array 10.It runs in the full-read mode.\",\n \"In this preferred embodiment, the horizontal address lines 8a-8h are word lines, while the vertical address lines 4a-4h are bit lines.\",\n \"An OTP array 10 comprises the word lines 8a-8h, the bit lines 4a-4h, and the OTP cells 1aa-1ad .\",\n \".\",\n \".\",\n \"located at their intersections.\",\n \"Its peripheral circuits (located on the substrate 0 and is not part of the OTP array 10) comprise a multiplexor 40 and an amplifier 30.In this preferred embodiment, the multiplexor 40 is a 4-to-1 multiplexor.\",\n \"FIG.\",\n \"3C is its signal timing diagram.\",\n \"A read cycle T includes two read phases: a pre-charge phase tpre and a read-out phase tR.\",\n \"During the pre-charge phase tpre, all address lines 8a-8h, 4a-4h in the OTP array 10 are charged to a pre-determined voltage (e.g.\",\n \"an input bias voltage Vi of the amplifier 30).\",\n \"During the read-out phase tR, all bit lines 4a-4h are floating.\",\n \"The voltage on a selected word line (e.g.\",\n \"8a) is raised to the read voltage VR, while voltage on other word lines 8b-8h remains at the input bias voltage Vi.\",\n \"After this, the selected word line 8a starts to charge all bit lines 4a-4h through the OTP cells 1aa .\",\n \".\",\n \".\",\n \"and the voltages on the bit lines 4a-4h begin to rise.\",\n \"The multiplexor 40 sends the voltage on each bit line (e.g.\",\n \"4a) to the amplifier 30.When this voltage exceeds the threshold voltage VT of the amplifier 30, the output VO is toggled.\",\n \"At the end of the read cycle T, the states of all OTP cells 1aa-1ah in the OTP-cell set 1a are determined.\",\n \"FIG.\",\n \"3D shows the current-voltage (I-V) characteristic of a preferred diode layer.\",\n \"Because the VT of the amplifier 30 is relatively small (˜0.1V or smaller), the voltage changes delta(V) on the bit lines 4a-4h during the above measurement are small, i.e.\",\n \"delta(V)˜VT.\",\n \"The reverse voltage on the unselected OTP cells (e.g.\",\n \"1 ca) is ˜VT.\",\n \"As long as the I-V characteristic of the diode satisfies I(VR)>>n*I(−VT), the 3D-OTPV would work properly.\",\n \"Here, n is the number of OTP cells on a bit line (e.g.\",\n \"4a).\",\n \"It should be noted that, because the value of VR (several volts) is far larger than that of the −VT (˜0.1V), even if the OTP cells are leaky, the above condition can be easily met.\",\n \"To facilitate address decoding, vertical transistors are formed on the sidewalls of the memory holes.\",\n \"FIGS.\",\n \"4A-4C disclose a second preferred 3D-OTPV 10 comprising vertical transistors 3aa-3ad.\",\n \"The vertical transistor 3aa is a pass transistor comprising a gate 7a, a gate dielectric 6a and a channel 9a (FIG.\",\n \"4A).\",\n \"The channel 9a is formed in the semiconductor material filled in the memory hole 2a.\",\n \"Its doping could be same as, lighter than, or opposite to that of the vertical address line 4a.\",\n \"The gate 7a surrounds the memory holes 2a, 2e and controls the pass transistors 3aa, 3ae (FIG.\",\n \"4B); the gate 7b surrounds the memory holes 2b, 2f and controls the pass transistors 3ab, 3af; the gate 7c surrounds the memory holes 2c, 2g and controls the pass transistors 3ac, 3ag; the gate 7d surrounds the memory holes 2e, 2h and controls the pass transistors 3ae, 3ah.\",\n \"The pass transistors 3aa-3ah form at least a decoding stage (FIG.\",\n \"4C).\",\n \"In one preferred embodiment, when the voltage on the gate 7a is high while the voltages on the gates 7b-7d are low, only the pass transistors 3aa, 3ae are turn on, with other pass transistors off.\",\n \"The substrate multiplexor 40′ is a 2-to-1 multiplexor which selects a signal from the bit lines 4a, 4e.\",\n \"By forming vertical transistors 3aa-3d in the memory holes 2a-2d, the decoder design could be simplified.\",\n \"FIG.\",\n \"5 discloses a multi-bit-per-cell 3D-OTPV.\",\n \"It comprises a plurality of OTP cells 1aa-1ah.\",\n \"In this preferred embodiment, the OTP cells 1aa-1ah have four states: ‘0’, ‘1’, ‘2’, ‘3’.\",\n \"The OTP cells 1aa-1ah in different states are programmed by different programming currents and therefore, have different resistance.\",\n \"The OTP cells 1ac, 1ae, 1ah are in the state ‘0’.\",\n \"Being un-programmed, their antifuse layers 6c, 6e, 6h are intact.\",\n \"Other OTP cells are programmed.\",\n \"Among them, the OTP cells 1ab, 1ag are in the state ‘1’, which have the largest resistance as the conductive filaments 11b are the thinnest; the OTP cell 1aa is in the state ‘3’, which has the smallest resistance as the conductive filament 11d is the thickest; the OTP cells 1ad, 1af are in the state ‘2, which have an intermediate resistance as the size of its conductive filament 11c is between those of 11b and 11d.\",\n \"While illustrative embodiments have been shown and described, it would be apparent to those skilled in the art that many more modifications than that have been mentioned above are possible without departing from the inventive concepts set forth therein.\",\n \"The invention, therefore, is not to be limited except in the spirit of the appended claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870855"}}},{"rowIdx":4493661,"cells":{"text":{"kind":"list like","value":[["UV DOSIMETRY SYSTEM WITH SENSOR DATA CORRECTION","A UV exposure dosimetry system includes at least one UV sensor that measures the UV irradiance intensity.","The system can generate extrapolated UV intensity data based on measured UV intensity data to correct unreliable UV measurement due to inconsistent irradiation of UV light.","The system integrates the extrapolated UV intensity data over time to calculate real-time UV dosage and vitamin D production by taking into account factors including UV sensor location, body surface area, clothing coverage, and sunscreen usage.","Based on the measurement, the system can predict the time remaining to skin burn and the time remaining to reach daily goal of vitamin D production.","The system is also adapted to measure sun exposure time based on the corrected UV intensity over a period of time.","The UV dosimetry system supports multi-user control through an advanced and user friendly input and output interface."],["1.A device comprising: a UV sensing unit configured to measure an irradiating UV intensity; a shade detector embedded within the device configured to detect if a user of the device is in a shaded condition or an unshaded condition; and a computing unit adapted to correct the measured irradiating UV intensity if the user is determined to be in the unshaded condition; wherein the computing unit is further adapted to measure a sun exposure time based on the corrected UV intensity over a period of time.","2.The device of claim 1, wherein the shade detector comprises a temperature sensor configured to measure an ambient temperature, and the computing unit is adapted to detect a change of the user's environment if a newly measured ambient temperature is determined to deviate significantly from a trend of recently measured ambient temperature.","3.The device of claim 2, wherein the shade detector detects the user changes to the shaded condition if the computing unit detects the change of the user's environment, and a low UV intensity is detected.","4.The device of claim 2, wherein the shade detector detects the user changes to the unshaded condition if the computing unit detects the change of the user's environment, and a high UV intensity is detected.","5.The device of claim 3, wherein the low UV intensity is detected if the measured irradiating UV intensity is below a predefined low UV intensity threshold, or if the measured irradiating UV intensity decreases by more than a first percentage of a first reference value, wherein the first reference value can be an average, median, or max of a plurality of most recent UV intensity data measured over a predefined duration of time.","6.The device of claim 4, wherein the high UV intensity is detected if the measured irradiating UV intensity is above a predefined high UV intensity threshold, or if the measured irradiating UV intensity increases by more than a second percentage of a second reference value, wherein the second reference value can be an average, median, or max of a plurality of most recent UV intensity data measured over a predefined duration of time.","7.The device of claim 2, wherein the determination of significant deviation is based on comparison of a difference between the newly measured ambient temperature and the trend of recently measured ambient temperature with a temperature deviation threshold.","8.The device of claim 7, wherein the trend of recently measured ambient temperature comprises an average or median temperature of a plurality of ambient temperature data measured within a most recent time window, wherein the time window has a predefined duration.","9.The device of claim 8, wherein the temperature deviation threshold can be any one of a predetermined temperature, a predefined percentage of an average or a median temperature of the plurality of ambient temperature data, a standard deviation of the plurality of ambient temperature data multiplied by a first scaling factor, an average absolute deviation of the plurality of ambient temperature data multiplied by a second scaling factor, and a median absolute deviation of the plurality of ambient temperature data multiplied by a third scaling factor.","10.The device of claim 1, wherein the sun exposure time measures an accumulated time when the corrected UV intensity is greater than a predefined UV intensity threshold.","11.A non-transitory computer readable medium having computer executable instructions stored therein, said instructions control at least one processor to implement a method, the method comprising: measuring a UV intensity irradiating on a device; detecting if a user of the device is in a shaded condition or an unshaded condition based on a shade detector embedded in the device; correcting the measured irradiating UV intensity if the user is detected to be in the unshaded condition; and measuring a sun exposure time based on the corrected UV intensity over a period of time.","12.The non-transitory computer readable medium of claim 11, wherein the shade detector comprises a temperature sensor configured to measure an ambient temperature, and the device is adapted to detect a change of the user's environment if a newly measured ambient temperature is determined to deviate significantly from a trend of recently measured ambient temperature.","13.The non-transitory computer readable medium of claim 12, wherein the device detects the user changes to the shaded condition if a newly measured ambient temperature deviates significantly from a trend of recently measured ambient temperature, and a low UV intensity is detected.","14.The non-transitory computer readable medium of claim 12, wherein the user is detected to change to the unshaded condition if the newly measured ambient temperature deviates significantly from the trend of recently measured ambient temperature, and a high UV intensity is detected.","15.The non-transitory computer readable medium of claim 13, wherein the low UV intensity is detected if the measured irradiating UV intensity is below a predefined low UV intensity threshold, or if the measured irradiating UV intensity decreases by more than a first percentage of a first reference value, wherein the first reference value can be an average, median, or max of a plurality of most recent UV intensity data measured over a predefined period of time.","16.The non-transitory computer readable medium of claim 14, wherein the high UV intensity is detected if the measured irradiating UV intensity is above a predefined high UV intensity threshold, or if the measured irradiating UV intensity increases by more than a second percentage of a second reference value, wherein the second reference value can be an average, median, or max of a plurality of most recent UV intensity data measured over a predefined period of time.","17.The non-transitory computer readable medium of claim 12, wherein the determination of significant deviation is based on comparison of a difference between the newly measured ambient temperature and the trend of recently measured ambient temperature with a temperature deviation threshold.","18.The non-transitory computer readable medium of claim 13, wherein the trend of recently measured ambient temperature comprises an average or median temperature of a plurality of ambient temperature data measured within a most recent time window, wherein the time window has a predefined duration.","19.The non-transitory computer readable medium of claim 18, wherein the temperature deviation threshold can be any one of a predetermined temperature, a predefined percentage of an average or a median temperature of the plurality of ambient temperature data, a standard deviation of the plurality of ambient temperature data multiplied by a first scaling factor, an average absolute deviation of the plurality of ambient temperature data multiplied by a second scaling factor, and a median absolute deviation of the plurality of ambient temperature data multiplied by a third scaling factor.","20.The non-transitory computer readable medium of claim 11, wherein the sun exposure time measures an accumulated time when the corrected UV intensity is greater than a predefined UV intensity threshold."],[" 2.BACKGROUND "],[" 3.SUMMARY OF THE INVENTION The challenges described above are solved by the present invention as described below.","It is an objective of this invention to provide a system and method for monitoring a person's UV exposure, and using such information to provide feedback and guidance to the user for achieving optimal balance between the risk and benefits of UV exposure.","It is another objective of this invention to provide a system and method for dynamic estimation of a person's safe sun exposure time.","It is a further objective of this invention to provide a system and method for calculating a person's vitamin D production resulting from UV exposure.","It is yet a further objective of this invention to provide a system and method for dynamic calculating the effective SPF of the applied sunscreen.","Another objective of this invention is to provide a system and method for calculating a person's exposed body surface area corresponding to common clothing choices.","A further objective of this invention is to provide a system and method for correcting unreliable UV measurement data.","Yet a further objective of this invention is to provide a system and method for calculating a person's the daily sun exposure time.","Yet it is also an objective of this invention to provide a system and method for providing predictive information to the user to guide optimal sun exposure in the near future.","According to some embodiments of this invention, a personal UV dosimetry system comprises a wearable unit and a mobile computing device.","The wearable unit comprises a circuitry for measuring the irradiating UV intensity, and the wearable unit is capable of wirelessly communicating with the mobile computing device.","The mobile computing device has the software application that can display, store, edit, analyze, and provide summary report of the data collected by the wearable unit, and may further communicate with a remote server, which can save the measured data in a secure database, and such data becomes accessible from other mobile devices or directly from a webpage protected by a password.","According to an alternative embodiment of this invention, the UV dosimetry system is an integrated wearable device that comprises both a UV sensing unit and a computing unit.","In other words, all the functions of the mobile computing unit described above are physically integrated with the UV sensing unit, thus eliminating the need of two separate units and the wireless communication between them.","By analyzing the measured UV intensity data, the UV dosimetry system not only can calculate the real-time UV index (UVI), but also UV dose actually received by the subject and vitamin D production within a time period, taking into account of various factors such as the skin type, the sunscreen usage, the sensor location, etc.","By analyzing data about UV dose and vitamin D production, the UV dosimetry system calculates a new metric that can quantitatively evaluate the optimal balance of UV exposure, by taking into account of both skin damage and vitamin D production effects of UV light.","The new metric is preferably calculated and displayed in real-time by a wearable UV dosimeter that provides a visual feedback and guidance to the user for achieving optimal balance between the risk and benefits of UV exposure.","The UV dosimetry system has a number of unique features, including real-time estimation of the safe sun exposure time, and calculation of cutaneous vitamin D production due to UV exposure.","The UV dosimetry system implements advanced algorithms to improve the accuracy of calculation by taking into account of dynamic behavior of SPF, exposed body surface area, and signal processing of UV intensity data to reject or correct unreliable measurement.","The UV dosimetry system also calculates the daily sun exposure time (SET), thus allowing user to potentially correlate SET with her/his mood of the day.","Moreover, the UV dosimetry system can be individually customized by taking into account various factors, such as the subject's skin type, age, body surface area, and clothing coverage, the usage of sunscreen, the location of the wearable unit, etc.","In addition, the UV dosimetry system can provide predictive information based on available forecast data to advise user what time and how long to stay outside in the next few days to avoid sun damage and to generate sufficient vitamin D. The unique advantages of the present invention will be appreciated by people of ordinary skill in the art after referring to the written description of the invention in conjunction with the illustrative drawings."],["CLAIM OF PRIORITY This is a continuation of U.S. patent application Ser.","No.","15/187,797, which is a continuation in part of U.S. patent application Ser.","No.","14/575,983, filed Dec. 18, 2014, now U.S. Pat.","No.","9,383,256 issued Jul.","5, 2016, which claims priority to Provisional Application No.","61/918,153, filed on Dec. 19, 2013, the complete disclosures of each of which are hereby incorporated by reference.","1.FIELD OF THE INVENTION The present invention relates generally to a system and methods for measuring the ultraviolet (UV) irradiation dosage and usage of such information for calculating the vitamin D production, for analyzing and displaying related UV information, and for guiding users to achieve optimal UV exposure.","2.BACKGROUND Optimal Balance of Sun Exposure UV exposure is known to have both detrimental and beneficial effect.","Over exposure to sunlight can cause sunburn, skin aging, and skin cancer, whereas insufficient sunlight exposure can lead to vitamin D deficiency, which is associated with many health maladies.","Therefore, there has been a growing consensus among many public health organizations that there needs to be a balance between the risks of having too much and the risks of having too little sunlight.","However, the goal of achieving optimal balance of UV exposure remains elusive, since there is no definition of what is considered to be the optimal UV dosage, and consequently there is no quantitative means to assess whether a person's UV exposure is optimal or suboptimal.","Therefore, there is a need to provide a system and method for quantitative evaluation the optimal balance of UV exposure, by taking into account both skin damage and vitamin D production effects of UV light.","However, to develop a solution for this problem, there are several additional challenges that need to be overcome, as described below.","Safe Sun Exposure Time One of the challenges is to quantify the damaging effect of UV exposure, which can be immediate and long-term.","Sunburn is noticeable 3-4 hours after over exposure of UV light, peaking at around 24 hours.","The long-term effects of excessive UV exposure include photo-aging, immunosuppression, and carcinogenicity.","Since sunburn is a frequent detrimental effect on human skin, the CIE erythemal action spectrum is often recommended for use in assessing the skin damaging effect of UV radiation.","The minimal erythemal dose (MED) is used to describe the erythemal potential of UV radiation, and 1 MED is defined as the effective UV dose that causes a perceptible reddening of previously unexposed human skin.","The MED is known to vary between individuals, and is affected by many factors such as the skin type.","Therefore, personalized UV irradiance dose monitoring is important.","For a UV monitoring system, it is important to predict how long a person can safely stay exposed to sunlight before getting sunburn.","The time to skin burn is a dynamic parameter.","It is affected by the time varying intensity of UV irradiance.","It also depends on the accumulated UV dose already received by the person.","Moreover, it can be modified by the person's behaviors, such as seeking the shade, changing clothing coverage, applying the sunscreen, etc.","To the best knowledge of the inventors, there is no existing solution for dynamic estimation of a person's safe sun exposure time.","Cutaneous Vitamin D Synthesis Another challenge is to quantify the UV induced cutaneous vitamin D synthesis.","Vitamin D, commonly known as the sunshine vitamin, actually functions as a hormone.","Its main biologic function in people is to maintain serum calcium and phosphorus concentration within the normal range.","Sufficient vitamin D is not only important for bone health, but also may decrease the incidence of diabetes, inhibit some autoimmune diseases such as multiple sclerosis, reduce the mortality from common cancers and cardiovascular diseases, among many other health benefits.","However, studies have shown that many people do not go outside enough to meet their minimum vitamin D needs.","In fact, vitamin D deficiency is now recognized as a pandemic.","Therefore, there is a need for a solution to calculate daily vitamin D production resulting from UV exposure, and to provide user useful information to determine if vitamin D supplement is necessary, and if so, how much is necessary.","Effective Sun Protection Factor A person's UV exposure is affected by the usage of sunscreen.","The sun protection factor (SPF) is widely used to measure the effectiveness of a sunscreen in affording photoprotection to subjects exposed to sources of UV radiation that may produce cutaneous erythema.","According to the U.S. Food and Drug Administration and international protocols, SPF shall be determined by using a prescribed sunscreen application thickness of 2.0 mg/cm2.However, many studies have shown that users typically apply much less sunscreen during leisure time than the suggested 2.0 mg/cm2, typically between 0.5 and 1.5 mg/cm2.Moreover, after a sunscreen is applied to the skin, it is commonly removed to a greater or lesser extend because of activities such as swimming, toweling, or excessive sweating and rubbing.","Thus, frequent and regular reapplication of sunscreen is often recommended for users who experience extended period of sun exposure, but the optimal frequency and amount of sunscreen reapplication remain inconclusive.","For these reasons, the effective SPF of a sunscreen product often actually deviates from the labeled SPF.","Therefore, a solution is needed for dynamic calculation the effective SPF of the applied sunscreen.","This is important for at least two reasons.","First, it allows more accurate estimation of the accumulated UV dose received by the subject, thus can help user to better protect against skin damage caused by over exposure of UV radiance.","Second, since a high SPF sunscreen dramatically reduces the skin's capability to synthesize vitamin D, knowing the effective SPF allows more accurate estimation of the vitamin D production.","Exposed Body Surface Area Because only skin surface exposed to sunlight can synthesize vitamin D, different clothing choices can significantly affect the amount of vitamin D production in a person.","Therefore, to estimate the amount of cutaneous vitamin D synthesis based on the UV dosage, it is important to know the percentage of exposed body surface area, taking into account of various options of clothing coverage.","Consequently, there is a need for a solution to efficiently calculate the exposed body surface area corresponding to common clothing choices in order to accurately measure a user's vitamin D production.","Reliable UV Sensor Measurement Yet another challenge is to reject or correct unreliable UV sensor measurement.","If the UV sensor is not aligned with the direct solar irradiance, the sensor measurement may underestimate the UV intensity at surfaces that are normal to the sunlight.","In particular, the angle sensitivity of UV sensor with respect to sunlight poses a practical challenge for a wearable UV dosimeter, since its orientation can change anytime as the user varies position and/or posture while the sun irradiance angle also varies constantly.","Even subtle change of sensor orientation and/or the shade coverage caused by user movement can dramatically change the sensor measurement.","Thus the direct measurement from the wearable UV dosimeter may be less than the actual UV intensity on the user's body surface that is normal to the sun light.","On the other hand, when the subject moves to indoor or into the shade, the low UV intensity measured by the UV sensor indeed correctly reflects the actual UV intensity on user's body surface.","Therefore, in order to more accurately estimate the UV dosage received by the user, a solution is needed to determine if measured UV intensity data should be corrected, and filter out the unreliable UV sensor measurement data if such correction is needed.","Sun Exposure Time Solar radiation has been used since ancient times to treat various diseases.","Although the beneficial effects of solar radiation are mainly mediated via UV induced vitamin D production in skin, several other pathways may exist for the action of UV radiation on humans.","In particular, exposure to sunlight has mood enhancing effect, which is believed to be mediated through the release of serotonin.","Research has shown that the rate of production of serotonin by the brain was directly related to the prevailing duration of bright sunlight, and rose rapidly with increased luminosity.","The concept—that sunlight has beneficial effects on the serotonin system and the mood and stability of humans—is consistent with the idea that serotonin is involved in homeostasis in humans and contributes to the emergence of mind.","Therefore, there is a need for a solution to calculate the daily sun exposure time (SET), thus allowing user to potentially correlate SET with her/his mood of the day.","Such a feature may not only reveal the likely correlation between mood and SET, but also provides the user guidance to enhance mood by consciously adjusting SET.","Prediction of Optimal Sun Exposure Time While it is helpful for a person to obtain instant feedback on received UV dose and cutaneous vitamin D production and use such information as a guidance to optimize sun exposure, more benefits can be gained if the person knows in advance how to spend time outdoors in the near future for optimal sun experience.","For example, it would be very helpful if a person knows what time and how long to stay outside in the next few days to avoid sun damage and to generate sufficient vitamin D. Therefore, there is a need for a solution to provide the user predictive information on optimal sun exposure in the near future, so that the user can plan ahead based on such information.","3.SUMMARY OF THE INVENTION The challenges described above are solved by the present invention as described below.","It is an objective of this invention to provide a system and method for monitoring a person's UV exposure, and using such information to provide feedback and guidance to the user for achieving optimal balance between the risk and benefits of UV exposure.","It is another objective of this invention to provide a system and method for dynamic estimation of a person's safe sun exposure time.","It is a further objective of this invention to provide a system and method for calculating a person's vitamin D production resulting from UV exposure.","It is yet a further objective of this invention to provide a system and method for dynamic calculating the effective SPF of the applied sunscreen.","Another objective of this invention is to provide a system and method for calculating a person's exposed body surface area corresponding to common clothing choices.","A further objective of this invention is to provide a system and method for correcting unreliable UV measurement data.","Yet a further objective of this invention is to provide a system and method for calculating a person's the daily sun exposure time.","Yet it is also an objective of this invention to provide a system and method for providing predictive information to the user to guide optimal sun exposure in the near future.","According to some embodiments of this invention, a personal UV dosimetry system comprises a wearable unit and a mobile computing device.","The wearable unit comprises a circuitry for measuring the irradiating UV intensity, and the wearable unit is capable of wirelessly communicating with the mobile computing device.","The mobile computing device has the software application that can display, store, edit, analyze, and provide summary report of the data collected by the wearable unit, and may further communicate with a remote server, which can save the measured data in a secure database, and such data becomes accessible from other mobile devices or directly from a webpage protected by a password.","According to an alternative embodiment of this invention, the UV dosimetry system is an integrated wearable device that comprises both a UV sensing unit and a computing unit.","In other words, all the functions of the mobile computing unit described above are physically integrated with the UV sensing unit, thus eliminating the need of two separate units and the wireless communication between them.","By analyzing the measured UV intensity data, the UV dosimetry system not only can calculate the real-time UV index (UVI), but also UV dose actually received by the subject and vitamin D production within a time period, taking into account of various factors such as the skin type, the sunscreen usage, the sensor location, etc.","By analyzing data about UV dose and vitamin D production, the UV dosimetry system calculates a new metric that can quantitatively evaluate the optimal balance of UV exposure, by taking into account of both skin damage and vitamin D production effects of UV light.","The new metric is preferably calculated and displayed in real-time by a wearable UV dosimeter that provides a visual feedback and guidance to the user for achieving optimal balance between the risk and benefits of UV exposure.","The UV dosimetry system has a number of unique features, including real-time estimation of the safe sun exposure time, and calculation of cutaneous vitamin D production due to UV exposure.","The UV dosimetry system implements advanced algorithms to improve the accuracy of calculation by taking into account of dynamic behavior of SPF, exposed body surface area, and signal processing of UV intensity data to reject or correct unreliable measurement.","The UV dosimetry system also calculates the daily sun exposure time (SET), thus allowing user to potentially correlate SET with her/his mood of the day.","Moreover, the UV dosimetry system can be individually customized by taking into account various factors, such as the subject's skin type, age, body surface area, and clothing coverage, the usage of sunscreen, the location of the wearable unit, etc.","In addition, the UV dosimetry system can provide predictive information based on available forecast data to advise user what time and how long to stay outside in the next few days to avoid sun damage and to generate sufficient vitamin D. The unique advantages of the present invention will be appreciated by people of ordinary skill in the art after referring to the written description of the invention in conjunction with the illustrative drawings.","4.BRIEF DESCRIPTION OF THE DRAWINGS FIG.","1 shows the high level block diagram of the UV dosimeter system comprising a wearable unit and a mobile computing device.","FIG.","2 shows the high level operation flowchart of the application software program running on the wearable unit and the application software program running on the mobile computing device, and the communication between thereof.","FIG.","3 shows the 3D view of UV exposure score (UVES) as a function of pvd (percentage of vitamin D production toward the user-defined daily goal) and puv (percentage of accumulated UV dose against the limit of safe UV dose).","FIG.","4 illustrates the concept of estimating the slope of UV dose accumulation based on linear regression of the most recent UV dose accumulation curve.","FIG.","5 illustrates the concept of adjusting vector length for calculating the slope of UV dose curve that has a flat segment followed by an upward increase.","FIG.","6 illustrates that the actual UV intensity irradiated on the subject over a short period of time can be extrapolated based on the limited numbers of correct measurement of UV intensity obtained during that short time window.","FIG.","7 illustrates temporal interpolation of UVI or UV intensity at any given time of day based on the forecast UVI data.","FIG.","8 illustrates correction of measured UV intensity data based on measurement of ambient temperature.","5.DETAILED DESCRIPTION General Description of the System Components According to a typical embodiment of this invention, the personal UV dosimetry system comprises a UV sensing unit and a mobile computing unit.","The UV sensing unit comprises a circuitry for measuring the irradiating UV intensity.","The UV sensing unit is capable of wirelessly and bi-directionally communicating with the mobile computing unit, such as a smart phone or a tablet computer.","As known in the art, the mobile computing unit usually has rechargeable battery, a built-in camera, a location/navigation system such as the Global Positioning System (GPS), a user interface for receiving user input and generating various types of output, including but are not limited to, high resolution display, user notifications (e.g.","via sound, vibration, text message, etc).","The mobile computing unit may also have one or more built-in sensors such as a temperature sensor, an acceleration sensor, a gyroscope sensor, a UV sensor, a light sensor, etc.","The mobile computing unit runs an operating system (e.g.","iOS, Android, etc.)","and is capable of wireless connection to a communication network.","The mobile computing unit has the software application that can display, store, edit, analyze, and provide summary report of the data collected by the UV sensing unit.","The UV measurement data collected by the UV sensing unit and analyzed by the mobile computing unit includes not only UVI, but also UV dose actually received by the subject and vitamin D production within a time period, taking into account of various factors such as skin type, sunscreen usage, etc.","In addition, the mobile computing unit can simultaneously track multiple users and/or multiple UV sensing units.","Yet according to another embodiment of this invention, the UV dosimetry system is an integrated device that comprises both the UV sensing unit and the mobile computing unit.","In other words, all the functions of the mobile computing unit described above are physically integrated together with the UV sensing unit, thus eliminating the need of two separate units and the wireless communication between them.","For the purpose of illustration, we describe in the following the UV dosimetry system comprising two separate units (i.e.","the UV sensing unit and the mobile computing device) as an example, while it should be understood that the same concept also applies to the UV dosimetry system with integrated UV sensing unit and the mobile computing unit.","According to one embodiment of this invention, the UV sensing unit is a wearable unit, which is a stand-alone, miniature device with aesthetic design, and is preferably waterproof.","The wearable unit has a plurality of connecting mechanisms (e.g.","clip, button, adhesive surface, etc.)","that enable it to be easily adapted to be worn by an individual at various body parts.","For example, the wearable unit can be worn as a clothing button, or a necklace, or wrist band, or hat accessory, etc.","According to another embodiment of this invention, the UV sensing unit is integrated with another article of manufacture.","For example, the UV sensing unit can be a built-in unit of a cooler, a beach chair, an umbrella, a pair of eye classes or goggles, a key chain, a dog leash, a headband, a roof-top weather station, etc.","In another example, the UV sensing unit can be woven into the clothing such as shirts, jackets, scarf, etc., to be part of the so-called smart clothing.","By embedding the UV sensing unit in textiles, the UV dosimetry system can become truly wearable.","In the following, we describe the UV dosimetry system by referring a wearable unit as an example of the UV sensing unit, although it should be understood that the UV sensing unit can take different forms as disclosed above.","FIG.","1 shows the high level block diagram of the UV dosimeter system comprising a wearable unit 200 and a mobile computing device 100.The UV radiation can be detected by one or more built-in UV sensors 210, which transform incident radiant UV signals into standard electrical signals.","Semiconductor UV sensors fabricated using Silicon, Silicon-Carbide, Gallium-Nitride, Gallium-Arsenide and Germanium may be used as UV sensors due to their wide band-gap properties.","The UV signals corresponding to the UV radiation intensity may be further digitized by an analog-to-digital converter 230.Other sensors 220 such as temperature sensors and humidity sensors can be included into the unit for enhanced system features.","For example, as described in more details below, a temperature sensor may be built adjacent to the UV sensor to detect user's environmental change and facilitate processing of measured UV intensity data.","All detected sensing signals are processed by a microprocessor 250, and the acquired sensor data can be temporarily stored in a local memory circuit.","The arranged data is then wirelessly sent to the mobile computing device for post data processing.","A wireless communication unit 240 employing a wireless technology standard such as Bluetooth technology can be used to wirelessly transmit and receive data between the wearable unit 200 and the mobile computing device 100.Battery cells 270 such as a battery button cell can be used to power the wearable unit 200.Energy harvesters such as thermal electric generator or solar cell can be used as an alternative source of energy to power the wearable unit.","The battery measurement block 260 may be included for enhanced features including monitoring the battery usage and determining device false operating conditions.","General Description of the System Operation As shown in FIG.","2, the application program 600 running on the wearable unit controls the operation of the wearable unit 200.After the wearable unit 200 is turned on, the application program 600 starts advertising the data 610 through the wireless communication protocol 610 to pair with the mobile computing unit 100.The mobile application program 500 running on the mobile computing device 100 then tries to discover the advertising data pocket 510 to pair with the wearable unit 200.Once the broadcasting data is detected, an authentication process begins where both wearable unit 200 and mobile computing device 100 exchange the data to establish a connection.","Several connection processes may be attempted until the connection is established, and the pair of wearable unit 200 and the mobile computing unit 100 identify and register with each other (620, 520) by respective application programs.","The mobile application program 500 can notify users for a status of this pairing process.","The mobile application program 500 can keep a record of the previous registered wearable units 200, thus the pairing process can be expedited in the future.","Through the mobile application program 500, the user can edit modes of operation as well as personal information 525 such as the skin type, age, wearable position, and sun protection factor (SPF), etc.","Some user information can be detected by employing a mobile computing peripheral unit.","For example, the skin type may be detected by analyzing an image captured by a mobile computing camera.","SPF lotion data can be detected by scanning the barcode on a lotion bottle.","Based on received UV data 535 measured and sent from the wearable unit 200 and the entered user information 525, the mobile application program 500 can calculate the UVI, UV dose, and the amount of vitamin D production 540.Users can change the personal information 555 such as sunscreen usage and clothing coverage at any time so that the updated user information can be used for calculating UV dose and vitamin D production.","User can also check the UV dose and related information such as vitamin D production through the mobile application program 500 anytime.","The application program features will be described later in this disclosure.","The wireless data communication between the wearable unit 200 and the mobile computing device 100 is automatically running in the background to make the mobile application program 500 user friendly and easy to use.","General Description of the Communication Protocol Both mobile computing device 100 and wearable unit 200 are linked together through a communication protocol as demonstrated in the high level flowchart shown in FIG.","2.After the pairing connection process is established, the user programmable modes of operation 525 corresponding to commands and configurations for the wearable unit 200 such as the UV sample time, number of the UV data samples and UV data resolution are wirelessly transmitted 530 to the wearable unit 200 to determine if configuration update is necessary 625.Based on the received commands 625, the wearable unit 200 will either keep previous configurations 630 or set new configurations 635 for measuring UV data 640.These configurations determine how the UV data is measured and how often the data is wirelessly transmitted to the mobile computing device 100.For example, if a user wants to know the current UVI irradiating on the wearable unit 200, the data can be immediately sampled and transmitted to the mobile computing device 100.If the mobile computing device 100 is not in close proximity of the user 645, the sampled UV data can be temporarily stored in the local memory 650 of the wearable unit 200 for later transmission whenever the mobile computing device 100 is within the range to establish a pairing connection.","In order to save the wearable unit battery consumption, all or parts of the electronic circuitries especially the wireless communication circuit could be powered down into a sleep mode 665, which consumes a minimal power.","The wearable unit 200 goes into sleep mode whenever there is no active data sampling/processing or communication with the mobile computing device 100, and typically wakes up automatically 675 according to configured sampling period and communication protocol.","A limited data processing and calculation on the wearable unit 200 can be implemented to reduce a firmware complexity on the microprocessor 250 and minimize the wake-up time for power saving.","Therefore, most of the post data processing such as calculation of UV dose and vitamin D generation can be performed in the mobile computing device 100 as illustrated in FIG.","2.The results of the calculation can be sent back to the wearable unit 200 through wireless communication.","Alternatively, if the mobile computing device 100 is out of the communication range of the wearable unit 200, the data processing and calculation could be performed by the microprocessor 250 on the wearable unit 200.If the calculated data results in a necessary user alert 545, the alarm mechanism is activated.","The alarm mechanism could be an alarm sound, flashing screen/light or vibration generated by the mobile computing device 100, or the wearable unit 200, or both.","For example, the alarm can be generated by the mobile computing device 100 to display related alarm information 550.Meanwhile, an alarm command 660 can be sent to the wearable unit 200 which also generates a user perceptible light and/or vibration alert 670.As shown in FIG.","2, communication between the wearable unit 200 and the mobile computing device 100 is periodic for maintaining connection.","The polling mechanism where one device broadcasts data and waits for another device acknowledges is used for notifying the connection status.","If the time between broadcasting and waiting for acknowledgment is beyond a programmable communication time-out, connection is lost.","With several failing reconnection attempts, the sampled UV data is then stored in the local memory circuit 650.Whenever the mobile computing device 100 is within the range 645 to establish a successful connection, the previously stored data is automatically transmitted 655 to the mobile computing device 100.By evaluating the received signal strength sent by the wearable unit 200, the mobile device 100 can implement the electronic leash function to estimate the distance to the wearable unit 200 and determine if it is within or outside the communication range.","Since the wearable unit 200 and the mobile computing device 100 are coupled together via wireless communication, the periodic status updates such as electronic leash notification, battery indication and memory indication can be wirelessly transmitted along with the measured UV data.","Alarm can be generated by the wearable unit 200, or the mobile computing device 100, or both to alert the user of abnormal system conditions (e.g.","memory full, low battery, communication lost, etc.).","Therefore, it allows the UV dosimetry system operate without any interruptions due to electronic unleash, low battery or lack of memory.","As a result, the accuracy and reliability of the system increases.","General Description of the User Interface The wearable unit is by default in a sleep mode and the user can activate the measurement of the UVI, UV dose, and vitamin D production.","The mobile device app can start, pause, resume, stop, and reset the measurement.","The wearable unit can also start, pause, resume, and reset the measurements with user input, such as finger taps on a touch sensing area.","For example, different numbers and/or sequences of taps can mean different commands.","The mobile device and the wearable unit can trigger sound, light, or vibration alarms when the accumulated UV dose is close to the harmful level.","The wearable unit can also indicate the status or measurement results such as UVI, for example, with a few LEDs laid out in a circle or line.","The mobile device can instantly query the measurements from the wearable unit.","It can also display, store, edit, analyze, and provide summary report of the data collected by the wearable unit.","The mobile application syncs with a remote server to save the sensor measurement data in a secure database.","This data becomes accessible from other mobile devices or directly from a webpage protected by a password.","Using a software application, the data can be analyzed and presented in easy to understand graphs, tables, and summary reports.","The user can share the data through social media, email, or text message.","Annotations can be added to the data for tagging purposes.","For example, through annotation, the user can then remember when the data has been taken.","The user can also annotate relevant events such as applying a sunscreen lotion, changing clothes, staying indoors, taking vitamin D supplement, etc.","The UV dosimetry system can accurately measure the location specific UVI in real time, which is more precise than the UVI forecast predicted by weather services.","The UVI measurement by a user wearing the wearable unit can be posted in crowd sourcing websites or on a dedicated server and shared in the mobile device app so that anybody can access it.","Since the UVI measurement could be misleading, e.g.","if the user is in the shade, the app takes into account the forecasted UVI and/or the temperature of the device to decide if the measurement is valid or not.","If it is valid then it is pushed to the servers.","Otherwise it is discarded.","The mobile device also provides a user interface that allows user to change profile settings (e.g.","age, gender, height, weight, etc.)","and/or programming parameters.","For example, user can select options and/or parameters that affect the calculation of UV dose and vitamin D production, such as clothing coverage, sunscreen type, etc.","Method for Multi-User Management Multiple users can take advantage of one single wearable unit.","The mobile application can create several accounts protected by a password.","Each account saves its own data associated with one individual user.","In addition, each account can create several profiles for the associated user.","A profile is a configuration for a specific measurement of UV dose and/or vitamin D production.","For example, it can include the clothes type worn and the sunscreen SPF used.","Profiles are used to avoid setting the same parameters multiple times.","The mobile application can also track several wearable units at the same time.","Each wearable unit can trigger a different alarm and an electronic leash allows the app to detect when a wearable unit is out of range by setting a sound, vibration, or light alarm on the mobile device and/or the wearable unit.","Multi-user tracking is convenient, for example, for a parent or a caregiver to monitor UV exposure of several children.","In addition, by utilizing the electronic leash function, the mobile device can operate in a search mode that allows the mobile app to find a lost wearable unit.","Optimal Balance of UV Exposure This invention provides a novel solution for monitoring a person's UV exposure, and using such information to provide feedback and guidance to the user to optimize his/her sun experience.","Specifically, in this section, we describe a method which can be implemented in the UV dosimetry system to quantitatively evaluate the optimal balance of UV exposure, by taking into account of both skin damage and vitamin D production effects of UV light.","The described new metrics can be calculated and displayed in real-time by a UV dosimetry system that provides a visual feedback and guidance to the user for achieving optimal balance between the risk and benefits of UV exposure.","One new metric is termed UV exposure score (UVES), which is a normalized index ranging from 0 to 1 (or 0-100 by applying a scale factor 100).","Higher UVES indicates improved UV balance whereas lower UVES indicates less optimal UV balance (obviously, it is equivalent to define UVES in the complementary form 1−UVES, so that lower value indicates improved UV balance whereas higher value indicates less optimal UV balance).","For example, the UVES can be defined as: UVES=pvdV·(1−puvU) (1) where pvd is the percentage of vitamin D production toward the daily goal, puv is the percentage of accumulated UV dose against the limit of safe UV dose, and V and U are two positive parameters that can be predefined or programmed by the user.","Clearly, UVES is the product of two terms, pvdV and 1−puvU, which respectively quantify the benefit of UV (e.g.","vitamin D production) and residual risk of UV damage (e.g.","sunburn).","The weight of these two terms can be adjusted by parameters V and U, which can be predefined or programmed by the user of the UV dosimetry system.","The method of calculating vitamin D production is described below in the section titled “Calculation of Cutaneous Vitamin D Synthesis.” The daily goal of vitamin D production (in unit of IU) is defined by the user, and pvdV is limited to the upper ceiling 1.0 (i.e.","pvdV is fixed to 1 when the synthesis of vitamin D exceeds the daily goal).","The method of calculating the accumulated UV dose is described below in the section titled “Calculation of Safe Sun Exposure Time.” The limit of safe UV dose is defined by the user, typically being set to the user-specific minimal erythemal dose (MED).","Similarly, puvU is limited to the upper ceiling 1.0 (i.e.","1−puvU is fixed to 0 when the accumulated UV dose exceeds the limit of safe UV dose).","For the purpose of illustration, FIG.","3 shows the 3D view of UVES as a function of pvd and puv.","Alternatively, a 2D view of UVES can be displayed in grey scale or color-coded.","As examples, two simulated trajectories of accumulated UV dose and amount of vitamin D production over a period of time are also shown.","As can be seen, while one trajectory 810 progressively reaches the optimal state (high UVES)—evidenced by exceeding the goal of vitamin D production (pvd>100%) and not reaching limit of safe UV dose (puv<100%), the other trajectory 820 fails to climb to the optimal state—the vitamin D production is less than 70% of the daily goal, and the accumulated UV dose is near the limit of safe UV dose.","Therefore, the composite metric UVES provides a quantitative means to characterize the degree of balance between the benefit and risk of UV exposure.","Users can use this metric as a guidance to optimize their sun exposure.","In addition, daily log of the UVES can provide a historical view and trending analysis of the overall sun exposure experience.","An alternative metric is termed UV balance index (UVBI), which ranges from −1 to 1.More negative UVBI (approaching −1) indicates lower vitamin D production, whereas more positive UVBI (approaching 1) indicates higher risk of sunburn (obviously, it is equivalent to define UVBI using the opposite form −UVBI, so that more positive value indicates lower vitamin D production, whereas more negative value indicates higher risk of sunburn).","The optimal balance of UV exposure is reflected by UVBI value that is close to zero.","Unlike UVES, UVBI can differentiate two sub-optimal UV exposure conditions (low production of vitamin D vs. high risk of sunburn).","As an example, UVBI can be defined as: UVBI=(1−puvU)(pvdV−1)+W·puvU (2) where W is a weighting function that as described below.","Similarly, pvd is the percentage of vitamin D production toward the daily goal, puv is the percentage of accumulated UV dose against the limit of safe UV dose, and V and U are two positive parameters that can be predefined or programmed by the user.","Likewise, both pvdV and puvU have the upper ceiling of 1.0.Note the first term (1−puvU)(pvdV−1) approaches 0 when either puvU or pvdV approaches 1, thus UVBI will be determined by the second term W·puvU in these two conditions.","The weighting function W can be user defined such that it satisfies the following criteria: (a) If puv approaches or exceeds 1 (puvU→1), then UVBI approaches 1.","(b) If puv is sufficiently smaller than 1 (puvU<1−ε, where 0<ε<1) AND pvd approaches or exceeds 1 (pvdV→1), then UVBI approaches 0.","(c) Otherwise, UVBI approaches −1 as pvd approaches 0 (pvdV→0).","One exemplary definition of the weighting function is to set W=0 if condition puv<0.85 OR (puv<1 AND pvd<0.75) is met, or set W=puv otherwise.","Another exemplary definition of the weighting function is to set W=0 if condition puv<0.75 OR (puv2+pvd2<1.44 AND pvd<0.9) is met, or set W=puv otherwise.","The purpose of conditional setting W to zero is to avoid or minimize the effect of numerical cancellation between the first and second terms in equation (2).","Clearly, the weighting function can be defined by many other means as long as the three criteria described above are met.","Calculation of Safe Sun Exposure Time For a wearable UV dosimetry system, an essential feature is to predict how long the user can safely stay exposed to sun light before getting sun burn.","The time to skin burn is a dynamic parameter.","It is affected by the time varying intensity of UV irradiance.","It also depends on the accumulated UV dose already received by the user.","Moreover, it can be modified by the user's behaviors, such as seeking the shade, changing clothing coverage, applying the sunscreen, etc.","This section describes a method for dynamic estimation of the safe sun exposure time in a UV dosimetry system.","The UV sensor embedded in the UV sensing unit generates output of UV intensity (unit: J/m2) over time, which can be represented as a time series that has the sampling interval Ts.","The device then calculates the accumulated UV dose by integrating the UV intensity over time based on the trapezoidal rule.","D ( t ) = [ ∑ k = 0 t ( I k + I k + 1 ) · ( t k + 1 - t k ) ] / 2 ( 3 ) where D(t) is the accumulated dose from predefined time 0 until time t, Ik+1 and Ik are respective UV intensity readings at two consecutive sample times tk+1 and tk.","The accumulated UV dose and the time are reset at predefined time of day.","For example, the elapsed time is typically reset to 0 at midnight, and the accumulated UV dose is cleared at the time reset.","Typically, tk+1−tk=Ts when all regularly sampled data are available, but the time gap may be greater than Ts in case of missed data, e.g.","due to data loss during wireless transmission or rejection of invalid data due to measurement noise.","When the time gap is greater than a predefined threshold Δ, the UV intensity can be assumed to be zero within the time gap.","Alternatively, the UV intensity can be assumed to remain the same as the last valid sample.","Yet another alternative is to assume the UV intensity gradually decrease from the last valid sample to zero in a linear or nonlinear fashion.","Assuming there is no additional protection (e.g.","sunscreen use or clothing coverage) for the skin area near the UV sensing unit, the safe sun exposure time can be expressed in terms of time to skin burn (T2SB), which is defined as: T2SB=[p·MED−D(t)]/b (4) where p is a positive coefficient that is user-programmable, MED is the predefined minimal erythemal dose that is dependent on user's skin type according to the Fitzpatrick scale, and b is the projected slope of UV dose accumulation.","Note the product p·MED defines the maximum UV dose that is considered safe for the user, where the parameter p allows user to specify the scale in terms of MED that the user can tolerate.","For example, the maximum safe UV dose is 1 MED when p=1, or 1.5 MED when p=1.5, or 0.9 MED when p=0.9.As illustrated in FIG.","4, the projected slope of UV dose accumulation may be obtained based on the linear regression of the most recent UV dose accumulation curve.","Denote T the time vector ranging from time t−δ to time t, and D the UV dose vector ranging from D(t−δ) at time t−δ, to D(t) at time t, where δ can be a predefined constant or a user-programmable parameter, then the projected slope b is calculated as: b=[NΣ(D·T)−(ΣD)·(ΣT)]/[N(ΣT2)−(ΣT)2] (5) where N is the total number of samples between time t−δ and time t (note: each sample has a pair of sample time and UV dose value).","Two special cases need to be considered when t<δ (i.e.","at the beginning of the day, shortly after the midnight) or when D(t)−D(t−δ)=0, which means there is no UV exposure in the past δ duration, hence the slope b=0 (i.e.","the UV dose segment is flat).","In such cases, the projected T2SB is infinite.","If the UV dose increases after a flat segment, equation (5) can be similarly used to calculate the new slope.","However, the vector length of T and D are reduced, and then they gradually increase until reaching the full length N. This can be illustrated in FIG.","5, which shows a portion of UV dose curve with a flat segment followed by an upward increase.","In this example, each sample of UV dose curve (solid line) is marked by a circle.","The UV dose curve remains flat until its last sample 840.Then the UV dose curve starts to increase from sample 841.For illustration purpose, the vector length N is set to 8 in this example.","The slope b remains zero throughout the flat segment, including its last 8 samples 850.Upon detecting an increase of the UV dose at sample 841, the vector length is reduced to 4 in this example.","Thus the slope is evaluated using only a group of 4 samples 851.As new UV dose values are available after sample 841, the vector length starts to increase toward its original length (N=8).","As illustrated in the figure, for the sample 842, the slope is evaluated using a group of 5 samples 842; for the sample 843, the slope is evaluated using a group of 6 samples 843; for the sample 844, the slope is evaluated using a group of 7 samples 854; and for the sample 845, the slope is evaluated using a group of 8 samples 855.This adaptive adjustment of vector length for calculating slope is important because while the linear regression allows smooth projection of T2SB (i.e.","noise tolerant), shortening vector length after a flat segment allows quick adaptation of rising UV dose curve after sudden exposure to sunlight.","Yet in another embodiment, the projected slope of UV dose accumulation is based on the current or recent UV intensity, instead of based on linear regression analysis of the UV dose accumulation curve.","Specifically, the projected slope of UV dose accumulation is the product of UV intensity (I) and the sampling interval (Ts), i.e.","b=I×Ts.","This assumes that the UV intensity remains the same for the foreseeable near future.","In one example, I is the device measured current UV intensity.","In another example, I is the extrapolated UV intensity value based on the most recent measurement of UV intensity in a short time window.","The method of calculating the extrapolated UV intensity value in a short time window is described below in the section titled “Extrapolation of UV Sensor Output”.","Yet in another example, I is the forecasted or crowd sourced UV intensity value that is time and location specific to the user.","This is useful when the user is staying indoor or in the shade but wants to have a rough estimate of T2SB should he or she goes outside to get exposed to sunlight, without actually measuring the UV intensity using the device.","When the UV sensor is not aligned with the direct solar irradiance, measurements may understate the UV intensity at surface that is normal to the sun light.","Therefore, the measured UV intensity, as well as the calculated accumulated UV dose D(t) will vary depending on where the UV sensing unit is worn (or maybe the sensor is just located nearby but not worn on the body).","There are many variables affecting the UV irradiance angle, such as the solar zenith angle, the orientation and body movement of the subject, and the environment surrounding the subject (e.g.","shade, light reflections, etc).","While it may be impractical to account for all these factors in real time, scaling the sensor measured UV intensity or dose by a sensor location factor (SLF) may provide a reasonable estimate of the UV intensity or D(t) at different body surface areas.","For example, if the UV sensor is worn on user's wrist facing outward, the sensor measured UV dose at the wrist will need to be multiplied by a site-specific SLF to derive the UV dose at an uncovered body area, such as the face, shoulder, chest, legs, etc.","The determination of SLF at different body parts is ideally through a calibration phrase, when a plurality of UV sensors are worn by the user at different locations for a certain period of time, and the ratios between UV dose readings from these sensors are used to determine site-specific SLF.","Typically, default values of SLF for different sensor locations can be predefined based on an experimental study involving a group of subjects.","Similar approach is described in the paper authored by Thieden et al.","“The wrist is a reliable body site for personal dosimetry of ultraviolet radiation.” Photodermatol Photoimmunol Photomed 2000; 16: 57-61.As expected, a user may experience skin burn earlier on the face or shoulder than on the arms or legs because the actual UV dose varies among different body parts.","Therefore, the safe sun exposure time T2SB will depend on which part of the body surface is uncovered, and is calculated based on the highest accumulated UV dose D(t) that is adjusted for SLF.","Another factor that affects the safe sun exposure time is the topical application of sunscreen.","Usage of sunscreen with high skin SPF can significantly block or absorb UV radiation, thus prolong the time to skin burn (T2SB).","In general, for an uncovered skin area with adequate sunscreen application, the safe sun exposure time calculated above is adjusted by multiplying the SPF of the sunscreen.","Thus, if the calculated T2SB without sunscreen is 10 minutes, then the safe sun exposure time will be 150 minutes after proper application of sunscreen with the SPF 15.Note, however, the effective SPF is not only dependent on the product labeling, but also the frequency and amount of sunscreen applied, the binding property of the sunscreen, the elapsed time since last sunscreen application, and so on.","The method for calculating effective SPF is described below in the section titled “Calculation of Effective SPF”.","Calculation of Cutaneous Vitamin D Synthesis A UV dosimetry system that can calculate the daily vitamin D production resulting from solar UV exposure will provide useful information for the user to determine if vitamin D supplement is necessary, and if so, how much is necessary.","Such quantitative information will offer user objective guidance to achieve optimal balance of sun exposure, and prescribe behavioral changes in maintaining personal health.","This section describes a method for calculating daily vitamin D production from UV light in a UV dosimetry system.","The formula for calculating the amount of vitamin D produced by people from an average daily UV exposure was originally described by Godar et al.","(Environ Health Perspect 2012; 120:139-143).","Instead of relying on daily average UV dose derived from a sample population, more accurate estimation of individual's daily cutaneous vitamin D synthesis (DVD) due to UV exposure can be obtained by integrating the subject's instantaneous vitamin D production rate over a day using the trapezoidal rule: DVD = ∑ k [ ( V k + V k + 1 ) · ( t k + 1 - t k ) ] / 2 ( 6 ) where Vk+1 and Vk are respective vitamin D production rate at two consecutive sample times tk+1 and tk.","The DVD and time are reset at predefined time of day.","For example, the elapsed time is typically reset to 0 at midnight, and DVD is cleared at the time reset and accumulates over 24 hours.","Obviously, vitamin D production over different time intervals (e.g.","hourly, etc.)","can be similarly calculated.","Typically, tk+1−tk equals the device sampling interval when all regularly sampled data are available, but the time gap may be greater than the sampling interval in case of missed data, e.g.","due to data loss during wireless transmission or rejection of invalid data due to measurement noise.","When the time gap is greater than a predefined threshold Δ, the vitamin D production rate can be assumed to be zero within the time gap.","Alternatively, the vitamin D production rate can be assumed to remain the same as the last valid sample.","Yet another alternative is to assume the vitamin D production rate gradually decrease from the last valid sample to zero in a linear or nonlinear fashion.","At any given time instant, the vitamin D production rate (V) is calculated as: V = C · cf · sf · af · bf · ∑ s ( I s · pBSA s / eSPF s ) ( 7 ) where C=49 is a constant which is derived from a reference value corresponding to the approximate amount of vitamin D generated (measured in ×100 IU) by a typical young female subject having Fitzpatrick skin type II with a whole body exposure to nearly uniform UV irradiance at the intensity of 320 J/m2.As described in details below, cf is the action spectrum conversion factor, sf is the skin type factor, of is the age factor, and bf is the body surface area factor.","The summation term represents the total contribution of vitamin D production from all exposed body surface area, which is divided into multiple parts (e.g.","face, chest, arms, legs, etc).","For each part of exposed body surface area (s), the corresponding UV intensity (Is), its percentage of total body surface area (pBSAs), and the effective sun protection factor (eSPFs) of the applied sunscreen are considered for the calculation.","The action spectrum conversion factor cf changes erythemally weighted to previtamin D3 weighted UV doses.","For general calculation, cf can be simplified to be a constant 1.0, that is, the differences between wavelength contributions estimated by the erythmal action spectrum and the previtamin D action spectrum are ignored.","Alternatively, cf can be determined by linear interpolation of values reported by Pope et al (Photochem Photobiol 2008; 84:1277-1283), by taking into account of season and the user's latitude.","Increased skin pigment can greatly reduce the capacity of skin to synthesize vitamin D. Thus the UV dose required to make the same amount of vitamin D varies by skin type.","Using Fitzpatrick skin type II as the reference, the skin type factor sf can be determined, as described by Godar et al.","(Environ Health Perspect 2012; 120:139-143), based on the respective minimum erythmal dose (MED) values.","It has also been known that aging significantly affects the capability of human skin to produce vitamin D. Compared to a 20 years old adult, a 70 years old person has about 75% reduced capacity to make vitamin D in the skin.","The age-dependent capability of vitamin D production can be characterized by age factor af which can be fixed to 1.0 for age <20 years and 0.10 for age >80 years, and decreases following a linear model for age between 20-80 years: af=1−0.015·(age−20) (8) The amount of vitamin D production in a person depends on how much skin is exposed to UV light.","Given the same percentage of skin area exposure, a person with a larger body surface area (BSA) will produce more vitamin D than a person with a smaller BSA.","The body surface area factor bf is the ratio of a person's BSA to 1.7 m2, which is approximately the BSA of a typical female subject.","A person's BSA can be calculated based on the formula of DuBois and DuBois.","Hence the body surface area factor bf is calculated as: bf=0.20247×H0.725×W0.425/1.7 (9) where the person's height (H) is in meters and weight (W) is in kilograms.","Only skin surface exposed to UV light can synthesize vitamin D. The total BSA can be divided into different parts, for example, based on the Lund and Browder chart, which specifies the approximate percentage of each part's surface area relative to the total BSA.","Different clothing choices can affect the percentage of body surface area that is exposed.","Specification of various body parts and their corresponding percentages of body surface area corresponding to common clothing choices are described in the following section titled “Calculation of Exposed Body Surface Area”.","In a simplified scenario, the UV intensity measured by the wearable UV sensor is assumed to be uniform over the exposed body surface, and the sunscreen application is also assumed to be uniform.","Then equation to calculate the vitamin D production rate can be simplified to: V=C·cf·sf·af·bf·I·pBSA/eSPF (10) where I is the UV intensity, pBSA is the percentage of total BSA being exposed to UV light, and eSPF is the effective SPF of the applied sunscreen.","Note the effective SPF is not only dependent on the product labeling, but also the frequency and amount of sunscreen applied, the binding property of the sunscreen, the elapsed time since last sunscreen application, etc.","The method for calculating eSPF is described below in the section titled “Calculation of Effective SPF”.","Also note that the measured UV intensity at the sensor wearing location may be different from the actual UV intensity at a different body area due to varying solar irradiance angle.","As described above in the section titled “Calculating of Safe Sun Exposure Time”, scaling the sensor measured UV intensity by a sensor location factor (SLF) may provide a reasonable estimate of the UV intensity at different body surface areas, and the SLF at different body parts can be determined through a calibration phrase.","As another example, a user may apply sunscreen over some, but not all exposed body surface areas.","Thus the eSPF at different parts of body surface may vary significantly.","Knowing the vitamin D production rate (V) and the daily goal of vitamin D amount (DGVD) which can be programmed by the user, the device can also estimate the time remaining to reach the DGVD (T2VD).","Specifically, at any time of the day, T2VD can be calculated by dividing the difference between DGVD and the accumulated vitamin D production at that time by a projected slope of vitamin D accumulation.","This calculation can be performed in a way that is similar to the method of calculating the time to skin burn (T2SB) as described above in the section titled “Calculation of Safe Sun Exposure Time”.","For example, at any time of the day, the device can calculate the projected slope of vitamin D accumulation based on linear regression analysis of accumulated vitamin D production curve in the preceding time interval.","Alternatively, the device can set the projected slope of vitamin D accumulation to the product of sampling interval and the vitamin D production rate (V).","The vitamin D production rate (V) can be calculated using equations (7) or (10), where the UV intensity can be currently measured value, or the extrapolated value based on the most recent measurement of UV intensity in a short time window.","The method of calculating the extrapolated UV intensity value in a short time window is described below in the section titled “Extrapolation of UV Sensor Output”.","Yet in an alternative embodiment, the vitamin D production rate (V) is calculated based on the forecasted or crowd-sourced UV intensity value that is time and location specific to the user.","This could be useful when the user is staying indoor or in the shade but wants to have a rough estimate of T2VD should he or she goes outside to get exposed to sunlight, without actual measuring the UV intensity using the device.","Calculation of Effective SPF As noted above, the effective SPF of a sunscreen product often actually deviates from the labeled SPF, due to some common factors including the amount of sunscreen initially applied, binding property of the sunscreen, reapplication of the sunscreen, and time elapsed since previous sunscreen application, etc.","This section describes a method for calculating the effective SPF in a UV dosimetry system.","After initial application of sunscreen, it is removed from the skin by clothing or sweating such that the thickness remaining on the skin decreases with time in an exponential manner.","This can be mathematically modeled by: x(t)=x(0)·exp(−λt) (11) where x(t) is the sunscreen thickness at time t, x(0) is the initially applied sunscreen thickness, λ, is rate constant for sunscreen removal that is related to the substantivity half-life of the sunscreen, which characterizes the binding capability of the sunscreen, and can be approximately determined based on such factors as the type of sunscreen, and the activity of the subject (toweling, sweating, swimming, etc.).","When sunscreen is reapplied at time T, the newly applied sunscreen amount a is added to the remaining sunscreen x(T), and the time course of sunscreen thickness follows the same exponential curve for t>T.","The relationship between sunscreen application thickness and the resulting SPF has been investigated by a number of studies.","The results have been variable ranging from an exponential relationship between SPF and applied thickness, to a logarithmic relationship, and through to an approximately linear relationship.","Depending on the spectral absorption profile of the product, the relationship could vary.","For example, a linear relationship of the SPF and the sunscreen application thickness can be modeled by: SPFE=1+(SPFL−1)·x/2 (12) where SPFE denotes the effective SPF, SPFL is the labeled SPF of the sunscreen product, and x is the sunscreen thickness which can be calculated from equations described above.","Based on this model, the sunscreen achieves its labeled SPF value when the application amount is 2 mg/cm2 as specified in the international protocol.","The unit intercept on SPF axis implies no additional sun screen protection when no sunscreen is applied (i.e., x=0).","Calculation of Exposed Body Surface Area To estimate the amount of cutaneous vitamin D synthesis, it is important to calculate the percentage of exposed body surface area, taking into account of various options of clothing coverage.","This section describes the method to calculate the exposed body surface area in a UV dosimetry system.","A person's total body surface area (BSA) can be calculated using the DuBois and DuBois formula.","BSA=0.20247×H0.725×W0.425 (13) where the person's height (H) is in meters and weight (W) is in kilograms.","The total BSA can be divided into different body parts based on the Lund and Browder chart, which specifies the approximate percentage of each part's surface area relative to the total BSA and is known to be age dependent.","Age is a main factor affecting the percentage values in the Lund and Browder chart because the ratio of the surface area of the head to the surface area of the limbs is typically larger in children than that of an adult.","To estimate the surface area of various body parts different ages, linearly interpolated values can be found between ages on the Lund-Browder charts.","Different clothing choices can affect the percentage of total BSA that is exposed.","The UV dosimetry system may allow user to select different clothing combinations for different parts of the body by browsing through or toggling between various clothing options.","For example, the user can toggle between “with hat” and “no hat” to indicate coverage or exposure of head.","Likewise, the user can select “bare chest”, “short sleeve”, or “long sleeve” to represent different degrees of upper body coverage.","Clothing coverage for other parts of the body surface can be similarly defined.","The selection of clothing options can vary in number and styles.","Each selected clothing option can have a predefined surface area coverage percentage for the selected body part.","A lookup table can be predefined that lists the approximate percentage values of skin exposure of various body parts as a result of common clothing choices.","An empty cell in the table indicates the skin surface of the body part (e.g.","in the row) is not affected by the corresponding clothing option (e.g.","in the column).","In contrast, a value of zero in the cell means no skin exposure for the corresponding body part, i.e.","it is completely covered by the clothing.","To calculate the percentage of a person's exposed BSA relative to the total BSA, each body part's BSA percentage (obtained from the Lund and Browder chart) is multiplied by the body part's skin exposure percentage value based on the corresponding clothing choice, and then these weighted terms are summed.","Correction of Measured UV Intensity While it is a common sense that the UV sensor should not be obstructed from the sun for accurate measurement, in practical use the device may experience changing angle of the irradiating sunlight and/or temporary shading of the device.","The design of a UV dosimetry system takes this variability into account, by at least partially compensating for the body movement and temporary obstruction of the UV sensor.","On the other hand, when the subject moves to indoor or into the shade, the low UV intensity measured by the UV sensor can indeed correctly reflects the actual UV intensity irradiating on the user's body surface.","This section describes a system and method to determine if the user is in a shaded condition or an unshaded condition, and correct the unreliable UV measurement in a UV dosimetry system based on signal processing of the sensor measured data if the user is in an unshaded condition.","When the UV sensor measured UV intensity is low, there can be two possibilities, and correspondingly different approaches need to be applied for these two conditions: (1) User is in a shaded condition (e.g., user stays indoor or in the shade).","In this case, the UV sensor measured UV intensity can correctly reflect the actual UV intensity irradiated on user's body surface.","Thus data correction may not be needed, and the UV sensor measured UV intensity can be directly used for calculating the UV dose received by the user.","(2) User is in an unshaded condition (e.g., user is under direct sunlight exposure) but the UV sensor is not directly facing the sunlight or is temporarily covered by the shade due to posture change and/or movement.","In this case, the UV sensor measured UV intensity can underestimate the actual UV intensity irradiated on user's body surface.","Thus, data correction can be needed to correct the unreliably measured UV intensity data.","As described herein, the term “shaded condition” refers to a condition that a user of the UV dosimetry system, as well as the UV dosimetry system itself, are generally shielded from the UV source (e.g., sun or tanning lamp).","For example, when a user of the UV dosimetry system stays indoor or under a shade, the user as well as the UV dosimetry system may receive little or no UV radiation from the sun.","The term “unshaded condition” refers to a condition that a user of the UV dosimetry system is at least partially exposed to a UV source (e.g., sun or tanning lamp), but the UV dosimetry system itself can be temporarily shielded from the UV source.","For example, when a user of the UV dosimetry system stays outdoor, the user can be exposed to UV radiation from the sun but the UV dosimetry system can be temporarily shielded from the UV radiation due to posture change and/or body movement of the user.","Therefore, it is important to determine if a measured low UV intensity is caused by the environment (e.g., in shaded condition, thus data correction may not be needed) or by unreliable UV sensor reading (e.g., in unshaded condition, thus data correction can be needed).","To distinguish these two conditions, a shade detector can be used.","One exemplary, though non-exclusive shade detector can be implemented by integrating a temperature sensor together with the UV sensor, and the UV dosimetry system can be configured to use the ambient temperature measured by the temperature sensor to differentiate between shaded condition and unshaded condition, and control the processing of UV measurement data as describe more fully below.","FIG.","8 schematically illustrates correcting measured UV intensity data based on the measurement of ambient temperature.","As shown in this example, at time t951, the user changes from a first unshaded condition 951 to a first shaded condition 952.At time t952, the user changes from the first shaded condition 952 to a second unshaded condition 953.Then at time t952, the user changes from the second unshaded condition 953 to a second shaded condition 954.Similarly, at time t954, the user changes from the second shaded condition 954 to a third unshaded condition 955.According to some embodiments, the UV dosimeter system can determine if a user of the system is in shaded condition or unshaded condition based on, at least partially, analyzing the measured UV intensity data and temperature data.","As illustrated in FIG.","8, the ambient temperature measured in shaded conditions (e.g., 952, 954) significantly deviates from the ambient temperature measured in unshaded conditions (e.g., 951, 953, 955).","Thus, significant deviation of measured ambient temperature (e.g., at t951, t952, t953 and t954) can indicate a change of user's environment.","According to some embodiments, if significant deviation of measured ambient temperature is accompanied by a low UV intensity measurement (e.g., low UV intensity 961 is measured at or immediately after t951), then it can be determined that the user changes to a shaded condition.","Similarly, if significant deviation of measured ambient temperature is accompanied by a high UV intensity measurement (e.g., high UV intensity 963 is measured at or immediately after t952), then it can be determined that the user changes to an unshaded condition.","According to some embodiments, after detecting the user's change to a shaded condition (e.g., at t951), the user can be determined to remain in the shaded condition (e.g., 952) until the detection of user's change to an unshaded condition (e.g., at t952) Similarly, after detecting the user's change to an unshaded condition (e.g., at t952), the user can be determined to remain in the unshaded condition (e.g., 953) until the detection of user's change to a shaded condition (e.g., at t953).","In certain embodiments, a low UV intensity (e.g., 961) can be detected if the measured UV intensity is below a predefined low UV intensity threshold, or if the measured UV intensity decreases by more than a predefined percentage of a reference value, wherein the reference value can be an average, median, or max of the most recent UV intensity data measured over a predefined period of time (e.g., 60 seconds).","Similarly, a high UV intensity (e.g., 963) can be detected if the measured UV intensity is higher than a predefined high UV intensity threshold, or if the measured UV intensity increases by more than a predefined percentage of an average, median, or max of the most recent UV intensity data measured over a predefined period of time (e.g., 60 seconds).","Thus, if a low UV intensity is measured in the shaded condition (e.g., 952, 954), UV intensity data correction may not be needed, as the measured UV intensity can actually reflect the UV intensity irradiating on the user.","On the other hand, if a low UV intensity (e.g., 962) is measured in unshaded condition (e.g., 951), then the low UV intensity can be caused by unreliable UV sensor measurement.","In this scenario, corrected UV intensity data can be generated by extrapolating the measured UV intensity data, as described more fully below.","Corrected UV intensity data can be used to calculate the UV dose and related measures (e.g., Vitamin D production, etc.).","In some embodiments, the temperature sensor can be adjacent to the UV sensor and is located inside the wearable unit, which can send the measured temperature data to the mobile computing unit for processing.","Alternatively, the temperature sensor can be integrated in the mobile computing unit (e.g., a smartphone), which can directly process the temperature data measured by the integrated temperature sensor.","In some other embodiments, temperature sensors can be present in both the wearable unit and the mobile computing unit.","In this case, the mobile computing unit can use temperature data measured by the temperature sensor that is physically closer to the UV sensor (e.g., the temperature sensor that is adjacent to the UV sensor and is located inside the wearable unit) for data processing.","The temperature sensor can continuously measure the local ambient temperature.","It can keep a buffer of most recently measured temperature data wherein the buffer length can correspond to a predefined duration (e.g.","60 seconds).","The UV dosimetry system can calculate and maintain the average temperature (avg_T) and/or median temperature (med_T) within the data buffer.","Similarly, the UV dosimetry system can also calculate the standard deviation of temperature (STD_T), and/or median absolute deviation of temperature (MAD_T), and/or average absolute deviation of temperature (AAD_T) within the data buffer.","Here, for a plurality of temperature measurement data samples T1, T2, .",".",".",", Tn, the MAD_T can be calculated as the median of the absolute deviations from the temperature data's median, i.e., MAD_T=median (|Ti−median (Ti)|), where i=1, 2, .",".",".",", n. The AAD_T can be calculated as the mean of the absolute deviations from the temperature data's mean, i.e., AAD_T=mean (|Ti−mean (Ti)|), where i=1, 2, .",".",".",", n. The UV dosimetry system can continuously compare the newly acquired temperature data (new_T) with the calculated average temperature (avg_T) and/or median temperature (med_T) of the most recent data stored in the data buffer, to determine if the newly acquired temperature data (new_T) is consistent with (comparable to), or significantly deviates from the trend of the recent temperature measurement.","In certain embodiments, the trend of the recent temperature measurement can be represented by the average temperature (avg_T).","In some other embodiments, the trend of the recent temperature measurement can be represented by the medial temperature (med_T).","If the newly acquired temperate data (new_T) significantly deviates from the trend of the recent temperature measurement, then it can imply the user moves to a new environment that has a different ambient temperature than previously stayed environment.","For example, new_T can be significantly higher than avg_T (or med_T) when the UV dosimetry system is brought from a cold outdoor environment to a warmer indoor environment, or new_T can be significantly lower than avg_T (or med_T) when the UV dosimetry system is brought from a hot outdoor environment to a cooler indoor environment.","Thus, if the corresponding UV intensity data measured by the UV sensor is low, the underlying cause can be caused by environmental change (e.g.","user changes to a shaded condition).","On the other hand, if the newly acquired temperate data (new_T) is comparable to the trend of the recent temperature measurement, then it can imply the user stays in the same environment.","Thus, if the corresponding UV intensity data measured by the UV sensor is low, the underlying cause can be caused by an orientation change of the UV sensor with respect to the sunlight or temporary shading caused by body movement while the user is in an unshaded condition.","A variety of measures can be used to determine if the newly acquired temperate data (new_T) is comparable to or significantly different from the trend of the recent temperature measurement.","For example, new_T can be determined to be significantly different from avg_T or med_T if their respective absolute difference, |new_T−avg_T| or |new_T−med_T| is greater than a predefined temperature threshold (e.g., 0.1 degree in Celsius scale, 0.5 degree in Fahrenheit, etc.","), otherwise new_T can be considered to be comparable to avg_T or med_T.","In another example, new_T can be determined to be significantly different from avg_T or med_T if their respective absolute difference is greater than a predefined percentage (e.g., 1%) of avg_T or med_T, otherwise new_T can be considered to be comparable to avg_T or med_T.","Yet in a further example, new_T can be determined to be significantly different from avg_T if the absolute difference |new_T−avg_T| is greater than the standard deviation of temperature (STD_T) multiplied by a predefined factor (e.g., 2), or new_T can be determined to be significantly different from avg_T if the absolute difference |new_T−avg_T| is greater than the average absolute deviation (AAD_T) multiplied by a predefined factor (e.g., 1.5).","Otherwise, new_T can be considered to be comparable to avg_T.","Alternatively, new_T can be determined to be significantly different from med_T if the absolute difference |new_T−med_T| is greater than the median absolute deviation of temperature (MAD_T) multiplied by a predefined factor (e.g., 1.5).","Otherwise, new_T can be considered to be comparable to med_T.","It shall be understood that the measures described above are meant to illustrate the general principles taught in this disclosure, thus they shall not be considered to be limiting.","Other measures of data dispersion that are known to the art can also be applied, within the scope of this disclosure, to determine if the newly acquired temperature data (new_T) is comparable to, or deviate from the trend of the recent temperature measurement.","If the newly acquired temperature data is determined to be comparable to or consistent with the trend of the recent temperature measurement, then the UV dosimetry system can be considered to remain in the same environment.","Otherwise, if the newly acquired temperature data is determined to deviate from the trend of the recent temperature measurement, then the UV dosimetry system can be considered to be moved to a different environment.","Therefore, data correction may not be needed if the low UV intensity measured by the UV sensor can be determined to be caused by a user's change of environment, e.g., when the user changes to a shaded condition.","Otherwise, if the user is in an unshaded condition, the low UV intensity measured by the UV sensor can be due to oblique angle of the UV sensor with respect to the sunlight or temporary coverage by the body shade of the user.","Thus, proper data correction can be performed by extrapolating measured UV data as described below.","The UV sensor embedded in the UV dosimetry system can generate real time output of UV intensity.","To estimate the actual UV intensity irradiated on the subject, the UV intensity measured by the UV sensor can be extrapolated by means of statistical analysis of the data, based on two basic assumptions: (1) The actual UV intensity received by the subject is quasi-static, that is, the rate of change of UV intensity irradiated on the subject is slow over a short duration.","(2) When the subject is exposed to the sunlight, the wearable UV sensor will have proper alignment with the solar irradiance at least for a very brief period of time during the short duration when actual UV intensity is stable.","Therefore, although the wearable UV sensor may often measure lower than actual UV intensity due to the changing body position and/or shade coverage, as long as the user is non-stationary so that the sensor can have good alignment with the sunlight from time to time, even if briefly, the device may have correct or nearly correct measurement of the actual UV intensity.","On the other hand, it is important to note that even though the sensor measured UV intensity is below the actual value, the underestimation may be limited since it is likely that not all exposed body surface is normal to the sunlight.","In other words, part of the exposed body surface may indeed receive less UV exposure due to its non-normal orientation and/or shade coverage.","Based on the above assumptions, the actual UV intensity irradiated on the subject over a short period of time can be extrapolated based on the limited numbers of correct measurement of UV intensity obtained during that short time window.","The extrapolation method is described below with reference to FIG.","6.Assume the device measures M samples of UV intensity values over a short time window T (e.g.","T=60 s, corresponding to M=60 for a sampling frequency of 1 Hz).","Data extrapolation performed in this time window (as described below) will be repeated for the next time window, which can be overlapping or non-overlapping with the current time window.","A programmable UV intensity threshold TH (e.g.","0.5 UVI, or 12.5 mW/m2) defines the boundary above which the measured UV intensity is likely more representative of the actual value whereas below which the sensor output is likely an underestimate of the true UV intensity.","Further denote the maximal UV intensity value among the M samples is UVMAX, which is assumed to be obtained when the sensor is best aligned with the solar irradiance during the short time window T. Also, when the device comprises multiple UV sensors that measure the UV intensity at different angles, the UVMAX can be taken as the maximum UV intensity value measured by all UV sensors during the short time window.","The device counts the number of samples (G) in the short window T that have measured UV intensity greater or equal to the threshold TH.","Higher count of G indicates higher probability and confidence that the measured ≥TH values reflect the true UV intensity whereas smaller G implies vice versa.","The count G is compared to another predefined thresholds C (e.g.","C=8 for M=60).","If the count G is greater than 0 (i.e.","at least one sample of measured UV intensity is above TH), then the extrapolated UV intensity of all M samples in the short time window T is set to MIN(G,C)/C×UVMAX where MIN( ) is the function that returns the minimum value.","In other words, the extrapolated UV intensity of all M samples is set to UVMAX if G≥C.","If 1t1).","Further denote dt the duration between t1 and t2 that contributes to SET, which is the time period between t1 and t2 when UVI is greater than or equal to UVILT.","Based on the values of UVI1 and UVI2, dt can be calculated according to different conditions: (1) dt=0 if both UVI1 and UVI2 are less than UVILT (i.e.","no sun exposure between t1 and t2); (2) dt=t2-t1 if both UVI1 and UVI2 are greater than or equal to UVILT (i.e.","continuous sun exposure between t1 and t2); (3) dt is calculated as a fraction of the duration between t1 and t2 based on linear interpolation if UVI1 is below while UVI2 is above UVILT, or if UVI2 is below while UVI1 is above UVILT.","Yet in a simpler version, the calculation of dt in condition (3) above can be approximated as (t2−t1)/2.This is appropriate when sampling interval is sufficiently small.","During normal operation, the device resets SET to zero at midnight, and accumulates dt into SET anytime when device measured UVI is greater than or equal to UVILT until the end of the day.","Typically, the device measures the UV intensity and converts it to UVI at the sampling interval.","However, the time gap between two consecutive measurements may be greater than the sampling interval in case of missed data, e.g.","due to data loss during wireless transmission or rejection of invalid data due to measurement noise.","When the time gap is greater than a predefined threshold Δ, the UVI may be assumed to be zero within the time gap.","Alternatively, the UVI can be assumed to remain the same as the last valid sample.","Yet another alternative is to assume the UVI gradually decrease from the last valid sample to zero in a linear or nonlinear fashion.","Method to Predict Optimal Sun Exposure Time While it is helpful for a person to obtain instant feedback on received UV dose and cutaneous vitamin D production, and use such information as a guidance to optimize sun exposure, more benefits can be gained if the person can plan ahead for optimal sun experience.","This section describes a method for predicting the effects of sun exposure to the user in the next few days in a UV dosimetry system.","According to a preferred embodiment of this invention, the UV dosimetry system retrieves forecasted UVI data for the next few days corresponding to the user's location from trusted sources or official websites, e.g., www.epa.gov, www.weather.gov, etc.","The user's location can be automatically determined via GPS integrated in the mobile computing device of the UV dosimetry system.","In addition, the user's location can be specified by the user through the input interface of the UV dosimetry system.","This is helpful if the user plans to travel to a different location and wants to predict the effects of sun exposure at the new location.","The forecasted UVI data often has limited temporal and spatial resolution.","For example, the forecasted UVI data is often presented hourly, and it is only presented for selected cities and/or areas associated with certain zip codes.","To overcome this challenge, linear or nonlinear (e.g.","spline) interpolation can be used to obtain forecasted UVI data at specific time and location with higher resolution.","For example, FIG.","7 illustrates the concept of temporal interpolation of UVI data.","In this example, the forecast 24-hour UVI data is available for a specific location.","While the forecast data is only available hourly (labelled in circles), the UVI or UV intensity at any given time of day 915 (labelled in a triangle) can be interpolated between UVI values of adjacent time points 910 and 920.Since 1 UVI corresponds to UV intensity of 25 mW/m2, the interpolated UV intensity (which can be expressed in continuous values) is preferred than interpolated UVI (which can only be expressed in discrete values).","For spatial interpolation of UVI, a geographic map can be generated with a specified latitude-longitude grid which has a high spatial resolution.","The UVI at a specific target location without forecast data can be interpolated from neighboring grid points that have forecast UVI data available.","Therefore, the UV dosimetry system can predict UV intensity at specific location and given time of day by means of interpolation of the forecast UVI data.","According to one embodiment of this invention, the UV dosimetry system estimates the user received UV dose and generated vitamin D in the near future (e.g.","next day) based on the predicted UV intensity data for a plural of hypothetical UV exposure scenarios.","Each hypothetical UV exposure scenario corresponds to a combination of start time and duration of UV exposure, and the corresponding user characteristics such as the clothing coverage, sunscreen usage, and wearing location of the UV sensing unit.","These hypothetical scenarios can be predefined by the user, or can be edited by the user through the user interface of the portable computing device.","For example, the user can predefine the scenarios based on his/her past habit or routine of UV exposure, or add/delete/modify the scenarios arbitrarily, e.g.","20 minutes sun exposure starting at 9 am, 10 minutes sun exposure starting at 10 am plus 5 minutes exposure starting at 12 noon, etc.","The user characteristics (e.g.","clothing coverage, sunscreen usage, and wearing location) associated with each episode of UV exposure can be predefined or edited by the user.","Therefore, for each of the hypothetical UV exposure scenarios, the UV dosimetry system can estimate the corresponding UV dose received by the user and vitamin D production.","The method of calculating the accumulated UV dose is described above in the section titled “Calculation of Safe Sun Exposure Time”, and the method of calculating vitamin D production is described above in the section titled “Calculation of Cutaneous Vitamin D Synthesis.” Based on the estimated UV dose and vitamin D production, the UV dosimetry system can evaluate the composite metric UVES and/or UVBI for each of the hypothetical UV exposure scenarios as described above in the section titled “Optimal Balance of UV Exposure”.","Consequently, the UV dosimetry system can provide the user a ranked list of hypothetical UV exposure scenarios based on the calculated composite metric UVES and/or UVBI, such that the scenario ranked high on the list is more preferred (i.e.","more balanced with respect to the risk of sun burn and benefit of vitamin D production) than the scenario ranked low on the list, and the user can use such a ranked list as a guide to plan ahead for future sun exposure.","According to another embodiment of this invention, the UV dosimetry system can estimate the safe sun exposure time, the amount of vitamin D generated during the safe sun exposure time, and the duration of sun exposure needed to reach user-defined daily goal of vitamin D production, for a plural of hypothetical UV exposure scenarios.","Different from the embodiment described above, each hypothetical UV exposure scenario corresponds to a start time of UV exposure, and the corresponding user characteristics (e.g.","clothing coverage, sunscreen usage, and wearing location of the UV sensing unit), but the duration of UV exposure is not defined.","Similarly, these hypothetical scenarios can be predefined by the user, or can be edited by the user through the user interface of the portable computing device.","For each of the hypothetical UV exposure scenarios, the UV dosimetry system estimates the safe sun exposure time (e.g.","time to sun burn), the amount of vitamin D generated during the safe sun exposure time, and the duration of sun exposure needed to reach user-defined daily goal of vitamin D production.","For example, the UV dosimetry system may estimate for one scenario, the user will have 20 minutes safe sun exposure time, generate 800 IU of vitamin D during that period, and need only 10 minutes of sun exposure to reach the user-defined daily goal of 400 IU vitamin D. Thus the user can plan to enjoy the sun exposure, knowing he/she will get enough vitamin D before having the risk of sunburn in this scenario.","In another scenario, the UV dosimetry system may estimate that the user will have only 10 minutes of safe sun exposure time, generate 500 IU of vitamin D during that period, and will need 25 minutes of sun exposure to reach the user-defined daily goal of 1000 IU vitamin D. Thus the user can plan to limit the sun exposure time and take vitamin D supplement for this scenario.","Similarly, the method of calculating the safe sun exposure time is described above in the section titled “Calculation of Safe Sun Exposure Time”, and the method of calculating vitamin D production is described above in the section titled “Calculation of Cutaneous Vitamin D Synthesis.” Method for Crowd Sourcing of UVI Data According to this invention, UVI at various geographical locations is measured and updated in real-time by a large number of UV measurement devices, or UV meters, by means of crowd sourcing method.","People who are using UV meters such as the disclosed UV dosimetry system, are encouraged to provide the real-time UVI data together with the time (e.g.","using the build-in clock of the mobile device) and location information (e.g.","via GPS embedded in the mobile computing device) through the wireless network to a remote server, for example, in exchange for a credit or discount coupon to be used toward certain products or services.","Users who opt to provide data can be anonymous to protect their identities.","The remote server maintains a database containing the data transmitted from the UV meters.","A user “pushes” the measured data (UVI, time, location) to the remote server in triggered mode, automatic mode, or mixed mode.","In triggered mode, the user initiates the data transmission by sending a command through the user input interface of the mobile computing unit to instruct the mobile application start the communication session.","In automatic mode, the mobile application is configured to exchange data with the remote server on periodic basis, e.g.","at programmed time of the day or at programmed time intervals.","In mixed mode, both manual triggered and automatic data transmission are supported.","Frequency of the data transmission can be limited (e.g.","not more than 1 time per X minutes, where X is a programmable parameter that defines the shortest duration between two consecutive data transmissions) to prevent repeated transmission of the same UVI data.","In one embodiment, the UV dosimetry system also has a build-in temperature sensing unit such as a temperature sensor, and the measured temperature data is also sent to the remote server, together with the measured UVI data and the time and location information of the measurement.","The remote server runs a database management software operative to analyze the data transmitted from the UV meters including UVI, time, location, and/or temperature measurement, and generates UVI maps for other users to use.","The UVI maps are preferably updated periodically according to a predefined time interval.","According to this disclosure, the remote server maintains a database that aggregates the data transmitted from the UV measurement devices.","The database management software controls the quality of the data collection through a plurality of filters with programmable parameter settings.","Quality control of crowd sourced data is important because invalid UVI measurements may be inadvertently sent by the users.","For example, a person staying indoors or under the shade may not measure the actual UVI in the local area accurately.","Such misleading UVI data shall be excluded from the database.","In one exemplary embodiment, the database management software in the remote server retrieves forecasted UVI data and/or temperature data at different time and geographical locations from trusted sources or official websites, e.g., www.epa.gov, www.weather.gov, etc.","User transmitted UVI measurement and/or temperature measurement data are compared with the forecast data at the corresponding time and location.","Here, the corresponding time means that the difference between the time of the forecast data and the time of the UVI and/or temperature measurement is below a predefined time limit, e.g.","10 minutes, and the corresponding location means the distance between the location of the forecast data and the location of the UVI and/or temperature measurement is shorter than a predefined distance limit, e.g.","1 mile.","User transmitted measurement data is deemed invalid if there is substantial deviation between measured data and the corresponding forecast data, e.g.","if they differ by more than a predefined tolerance value.","In another exemplary embodiment, the official forecast data is only used as a reference to reject invalid measurement data when the sample size of the measurement data at specific time period and location is limited.","As more user transmitted measurement data at specific time period and location is available and included in the database, the weight of using official forecast data as a reference is reduced.","Meanwhile, more weight is given to the user transmitted data, which can self-serve as the reference to reject invalid user input.","For example, when the sample size of UVI and/or temperature data measured during a specific time period and from a specific location is sufficiently large (e.g.","greater than a predefined threshold), the expected normal range of UVI and/or temperature at said specific time period and location can be calculated based on the statistical distribution of the measured UVI and/or temperature data (e.g.","the mean and standard deviation, or the median and inter-quartile range).","Outlier measurement data falling outside the expected normal range will then be deemed invalid.","For the UVI (or temperature) data at specific time and specific location, the sample size is defined as the total number of UVI (or temperature) data measured during a time period that is close to said specific time (e.g.","within a predefined time interval), and from a region that is centered around said location (e.g.","within a predefined distance).","Through crowd sourcing, the UVI data is updated in the remote server database in real-time, and the UVI map can be updated periodically according to a predefined frequency.","As more users contribute to the database, the reliability and accuracy of the data increases.","The coverage of the UVI data on the map can be as broad as the users can go and the spatial resolution can be as fine as the GPS allows.","It also allows people who do not have a UV measurement device to obtain real-time UVI information by accessing the crowd sourced UVI database through a communication network, such as the internet.","While the invention has been described with reference to exemplary embodiments, it shall be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.","In addition, many modifications may be made to adapt a particular situation or component to the teachings of the invention without departing from its scope.","Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims, wherein reference to an element in the singular, such as by use of the article “a” or “an” is not intended to mean “one and only one” unless specifically so stated, but rather “one or more”.","All patent and non-patent literature cited herein is hereby incorporated by references in its entirety for all purposes.","As used herein, “and/or” means “and” or “or”, as well as “and” and “or.” Moreover, any and all patent and non-patent literature cited herein is hereby incorporated by references in its entirety for all purposes."]],"string":"[\n [\n \"UV DOSIMETRY SYSTEM WITH SENSOR DATA CORRECTION\",\n \"A UV exposure dosimetry system includes at least one UV sensor that measures the UV irradiance intensity.\",\n \"The system can generate extrapolated UV intensity data based on measured UV intensity data to correct unreliable UV measurement due to inconsistent irradiation of UV light.\",\n \"The system integrates the extrapolated UV intensity data over time to calculate real-time UV dosage and vitamin D production by taking into account factors including UV sensor location, body surface area, clothing coverage, and sunscreen usage.\",\n \"Based on the measurement, the system can predict the time remaining to skin burn and the time remaining to reach daily goal of vitamin D production.\",\n \"The system is also adapted to measure sun exposure time based on the corrected UV intensity over a period of time.\",\n \"The UV dosimetry system supports multi-user control through an advanced and user friendly input and output interface.\"\n ],\n [\n \"1.A device comprising: a UV sensing unit configured to measure an irradiating UV intensity; a shade detector embedded within the device configured to detect if a user of the device is in a shaded condition or an unshaded condition; and a computing unit adapted to correct the measured irradiating UV intensity if the user is determined to be in the unshaded condition; wherein the computing unit is further adapted to measure a sun exposure time based on the corrected UV intensity over a period of time.\",\n \"2.The device of claim 1, wherein the shade detector comprises a temperature sensor configured to measure an ambient temperature, and the computing unit is adapted to detect a change of the user's environment if a newly measured ambient temperature is determined to deviate significantly from a trend of recently measured ambient temperature.\",\n \"3.The device of claim 2, wherein the shade detector detects the user changes to the shaded condition if the computing unit detects the change of the user's environment, and a low UV intensity is detected.\",\n \"4.The device of claim 2, wherein the shade detector detects the user changes to the unshaded condition if the computing unit detects the change of the user's environment, and a high UV intensity is detected.\",\n \"5.The device of claim 3, wherein the low UV intensity is detected if the measured irradiating UV intensity is below a predefined low UV intensity threshold, or if the measured irradiating UV intensity decreases by more than a first percentage of a first reference value, wherein the first reference value can be an average, median, or max of a plurality of most recent UV intensity data measured over a predefined duration of time.\",\n \"6.The device of claim 4, wherein the high UV intensity is detected if the measured irradiating UV intensity is above a predefined high UV intensity threshold, or if the measured irradiating UV intensity increases by more than a second percentage of a second reference value, wherein the second reference value can be an average, median, or max of a plurality of most recent UV intensity data measured over a predefined duration of time.\",\n \"7.The device of claim 2, wherein the determination of significant deviation is based on comparison of a difference between the newly measured ambient temperature and the trend of recently measured ambient temperature with a temperature deviation threshold.\",\n \"8.The device of claim 7, wherein the trend of recently measured ambient temperature comprises an average or median temperature of a plurality of ambient temperature data measured within a most recent time window, wherein the time window has a predefined duration.\",\n \"9.The device of claim 8, wherein the temperature deviation threshold can be any one of a predetermined temperature, a predefined percentage of an average or a median temperature of the plurality of ambient temperature data, a standard deviation of the plurality of ambient temperature data multiplied by a first scaling factor, an average absolute deviation of the plurality of ambient temperature data multiplied by a second scaling factor, and a median absolute deviation of the plurality of ambient temperature data multiplied by a third scaling factor.\",\n \"10.The device of claim 1, wherein the sun exposure time measures an accumulated time when the corrected UV intensity is greater than a predefined UV intensity threshold.\",\n \"11.A non-transitory computer readable medium having computer executable instructions stored therein, said instructions control at least one processor to implement a method, the method comprising: measuring a UV intensity irradiating on a device; detecting if a user of the device is in a shaded condition or an unshaded condition based on a shade detector embedded in the device; correcting the measured irradiating UV intensity if the user is detected to be in the unshaded condition; and measuring a sun exposure time based on the corrected UV intensity over a period of time.\",\n \"12.The non-transitory computer readable medium of claim 11, wherein the shade detector comprises a temperature sensor configured to measure an ambient temperature, and the device is adapted to detect a change of the user's environment if a newly measured ambient temperature is determined to deviate significantly from a trend of recently measured ambient temperature.\",\n \"13.The non-transitory computer readable medium of claim 12, wherein the device detects the user changes to the shaded condition if a newly measured ambient temperature deviates significantly from a trend of recently measured ambient temperature, and a low UV intensity is detected.\",\n \"14.The non-transitory computer readable medium of claim 12, wherein the user is detected to change to the unshaded condition if the newly measured ambient temperature deviates significantly from the trend of recently measured ambient temperature, and a high UV intensity is detected.\",\n \"15.The non-transitory computer readable medium of claim 13, wherein the low UV intensity is detected if the measured irradiating UV intensity is below a predefined low UV intensity threshold, or if the measured irradiating UV intensity decreases by more than a first percentage of a first reference value, wherein the first reference value can be an average, median, or max of a plurality of most recent UV intensity data measured over a predefined period of time.\",\n \"16.The non-transitory computer readable medium of claim 14, wherein the high UV intensity is detected if the measured irradiating UV intensity is above a predefined high UV intensity threshold, or if the measured irradiating UV intensity increases by more than a second percentage of a second reference value, wherein the second reference value can be an average, median, or max of a plurality of most recent UV intensity data measured over a predefined period of time.\",\n \"17.The non-transitory computer readable medium of claim 12, wherein the determination of significant deviation is based on comparison of a difference between the newly measured ambient temperature and the trend of recently measured ambient temperature with a temperature deviation threshold.\",\n \"18.The non-transitory computer readable medium of claim 13, wherein the trend of recently measured ambient temperature comprises an average or median temperature of a plurality of ambient temperature data measured within a most recent time window, wherein the time window has a predefined duration.\",\n \"19.The non-transitory computer readable medium of claim 18, wherein the temperature deviation threshold can be any one of a predetermined temperature, a predefined percentage of an average or a median temperature of the plurality of ambient temperature data, a standard deviation of the plurality of ambient temperature data multiplied by a first scaling factor, an average absolute deviation of the plurality of ambient temperature data multiplied by a second scaling factor, and a median absolute deviation of the plurality of ambient temperature data multiplied by a third scaling factor.\",\n \"20.The non-transitory computer readable medium of claim 11, wherein the sun exposure time measures an accumulated time when the corrected UV intensity is greater than a predefined UV intensity threshold.\"\n ],\n [\n \" 2.BACKGROUND \"\n ],\n [\n \" 3.SUMMARY OF THE INVENTION The challenges described above are solved by the present invention as described below.\",\n \"It is an objective of this invention to provide a system and method for monitoring a person's UV exposure, and using such information to provide feedback and guidance to the user for achieving optimal balance between the risk and benefits of UV exposure.\",\n \"It is another objective of this invention to provide a system and method for dynamic estimation of a person's safe sun exposure time.\",\n \"It is a further objective of this invention to provide a system and method for calculating a person's vitamin D production resulting from UV exposure.\",\n \"It is yet a further objective of this invention to provide a system and method for dynamic calculating the effective SPF of the applied sunscreen.\",\n \"Another objective of this invention is to provide a system and method for calculating a person's exposed body surface area corresponding to common clothing choices.\",\n \"A further objective of this invention is to provide a system and method for correcting unreliable UV measurement data.\",\n \"Yet a further objective of this invention is to provide a system and method for calculating a person's the daily sun exposure time.\",\n \"Yet it is also an objective of this invention to provide a system and method for providing predictive information to the user to guide optimal sun exposure in the near future.\",\n \"According to some embodiments of this invention, a personal UV dosimetry system comprises a wearable unit and a mobile computing device.\",\n \"The wearable unit comprises a circuitry for measuring the irradiating UV intensity, and the wearable unit is capable of wirelessly communicating with the mobile computing device.\",\n \"The mobile computing device has the software application that can display, store, edit, analyze, and provide summary report of the data collected by the wearable unit, and may further communicate with a remote server, which can save the measured data in a secure database, and such data becomes accessible from other mobile devices or directly from a webpage protected by a password.\",\n \"According to an alternative embodiment of this invention, the UV dosimetry system is an integrated wearable device that comprises both a UV sensing unit and a computing unit.\",\n \"In other words, all the functions of the mobile computing unit described above are physically integrated with the UV sensing unit, thus eliminating the need of two separate units and the wireless communication between them.\",\n \"By analyzing the measured UV intensity data, the UV dosimetry system not only can calculate the real-time UV index (UVI), but also UV dose actually received by the subject and vitamin D production within a time period, taking into account of various factors such as the skin type, the sunscreen usage, the sensor location, etc.\",\n \"By analyzing data about UV dose and vitamin D production, the UV dosimetry system calculates a new metric that can quantitatively evaluate the optimal balance of UV exposure, by taking into account of both skin damage and vitamin D production effects of UV light.\",\n \"The new metric is preferably calculated and displayed in real-time by a wearable UV dosimeter that provides a visual feedback and guidance to the user for achieving optimal balance between the risk and benefits of UV exposure.\",\n \"The UV dosimetry system has a number of unique features, including real-time estimation of the safe sun exposure time, and calculation of cutaneous vitamin D production due to UV exposure.\",\n \"The UV dosimetry system implements advanced algorithms to improve the accuracy of calculation by taking into account of dynamic behavior of SPF, exposed body surface area, and signal processing of UV intensity data to reject or correct unreliable measurement.\",\n \"The UV dosimetry system also calculates the daily sun exposure time (SET), thus allowing user to potentially correlate SET with her/his mood of the day.\",\n \"Moreover, the UV dosimetry system can be individually customized by taking into account various factors, such as the subject's skin type, age, body surface area, and clothing coverage, the usage of sunscreen, the location of the wearable unit, etc.\",\n \"In addition, the UV dosimetry system can provide predictive information based on available forecast data to advise user what time and how long to stay outside in the next few days to avoid sun damage and to generate sufficient vitamin D. The unique advantages of the present invention will be appreciated by people of ordinary skill in the art after referring to the written description of the invention in conjunction with the illustrative drawings.\"\n ],\n [\n \"CLAIM OF PRIORITY This is a continuation of U.S. patent application Ser.\",\n \"No.\",\n \"15/187,797, which is a continuation in part of U.S. patent application Ser.\",\n \"No.\",\n \"14/575,983, filed Dec. 18, 2014, now U.S. Pat.\",\n \"No.\",\n \"9,383,256 issued Jul.\",\n \"5, 2016, which claims priority to Provisional Application No.\",\n \"61/918,153, filed on Dec. 19, 2013, the complete disclosures of each of which are hereby incorporated by reference.\",\n \"1.FIELD OF THE INVENTION The present invention relates generally to a system and methods for measuring the ultraviolet (UV) irradiation dosage and usage of such information for calculating the vitamin D production, for analyzing and displaying related UV information, and for guiding users to achieve optimal UV exposure.\",\n \"2.BACKGROUND Optimal Balance of Sun Exposure UV exposure is known to have both detrimental and beneficial effect.\",\n \"Over exposure to sunlight can cause sunburn, skin aging, and skin cancer, whereas insufficient sunlight exposure can lead to vitamin D deficiency, which is associated with many health maladies.\",\n \"Therefore, there has been a growing consensus among many public health organizations that there needs to be a balance between the risks of having too much and the risks of having too little sunlight.\",\n \"However, the goal of achieving optimal balance of UV exposure remains elusive, since there is no definition of what is considered to be the optimal UV dosage, and consequently there is no quantitative means to assess whether a person's UV exposure is optimal or suboptimal.\",\n \"Therefore, there is a need to provide a system and method for quantitative evaluation the optimal balance of UV exposure, by taking into account both skin damage and vitamin D production effects of UV light.\",\n \"However, to develop a solution for this problem, there are several additional challenges that need to be overcome, as described below.\",\n \"Safe Sun Exposure Time One of the challenges is to quantify the damaging effect of UV exposure, which can be immediate and long-term.\",\n \"Sunburn is noticeable 3-4 hours after over exposure of UV light, peaking at around 24 hours.\",\n \"The long-term effects of excessive UV exposure include photo-aging, immunosuppression, and carcinogenicity.\",\n \"Since sunburn is a frequent detrimental effect on human skin, the CIE erythemal action spectrum is often recommended for use in assessing the skin damaging effect of UV radiation.\",\n \"The minimal erythemal dose (MED) is used to describe the erythemal potential of UV radiation, and 1 MED is defined as the effective UV dose that causes a perceptible reddening of previously unexposed human skin.\",\n \"The MED is known to vary between individuals, and is affected by many factors such as the skin type.\",\n \"Therefore, personalized UV irradiance dose monitoring is important.\",\n \"For a UV monitoring system, it is important to predict how long a person can safely stay exposed to sunlight before getting sunburn.\",\n \"The time to skin burn is a dynamic parameter.\",\n \"It is affected by the time varying intensity of UV irradiance.\",\n \"It also depends on the accumulated UV dose already received by the person.\",\n \"Moreover, it can be modified by the person's behaviors, such as seeking the shade, changing clothing coverage, applying the sunscreen, etc.\",\n \"To the best knowledge of the inventors, there is no existing solution for dynamic estimation of a person's safe sun exposure time.\",\n \"Cutaneous Vitamin D Synthesis Another challenge is to quantify the UV induced cutaneous vitamin D synthesis.\",\n \"Vitamin D, commonly known as the sunshine vitamin, actually functions as a hormone.\",\n \"Its main biologic function in people is to maintain serum calcium and phosphorus concentration within the normal range.\",\n \"Sufficient vitamin D is not only important for bone health, but also may decrease the incidence of diabetes, inhibit some autoimmune diseases such as multiple sclerosis, reduce the mortality from common cancers and cardiovascular diseases, among many other health benefits.\",\n \"However, studies have shown that many people do not go outside enough to meet their minimum vitamin D needs.\",\n \"In fact, vitamin D deficiency is now recognized as a pandemic.\",\n \"Therefore, there is a need for a solution to calculate daily vitamin D production resulting from UV exposure, and to provide user useful information to determine if vitamin D supplement is necessary, and if so, how much is necessary.\",\n \"Effective Sun Protection Factor A person's UV exposure is affected by the usage of sunscreen.\",\n \"The sun protection factor (SPF) is widely used to measure the effectiveness of a sunscreen in affording photoprotection to subjects exposed to sources of UV radiation that may produce cutaneous erythema.\",\n \"According to the U.S. Food and Drug Administration and international protocols, SPF shall be determined by using a prescribed sunscreen application thickness of 2.0 mg/cm2.However, many studies have shown that users typically apply much less sunscreen during leisure time than the suggested 2.0 mg/cm2, typically between 0.5 and 1.5 mg/cm2.Moreover, after a sunscreen is applied to the skin, it is commonly removed to a greater or lesser extend because of activities such as swimming, toweling, or excessive sweating and rubbing.\",\n \"Thus, frequent and regular reapplication of sunscreen is often recommended for users who experience extended period of sun exposure, but the optimal frequency and amount of sunscreen reapplication remain inconclusive.\",\n \"For these reasons, the effective SPF of a sunscreen product often actually deviates from the labeled SPF.\",\n \"Therefore, a solution is needed for dynamic calculation the effective SPF of the applied sunscreen.\",\n \"This is important for at least two reasons.\",\n \"First, it allows more accurate estimation of the accumulated UV dose received by the subject, thus can help user to better protect against skin damage caused by over exposure of UV radiance.\",\n \"Second, since a high SPF sunscreen dramatically reduces the skin's capability to synthesize vitamin D, knowing the effective SPF allows more accurate estimation of the vitamin D production.\",\n \"Exposed Body Surface Area Because only skin surface exposed to sunlight can synthesize vitamin D, different clothing choices can significantly affect the amount of vitamin D production in a person.\",\n \"Therefore, to estimate the amount of cutaneous vitamin D synthesis based on the UV dosage, it is important to know the percentage of exposed body surface area, taking into account of various options of clothing coverage.\",\n \"Consequently, there is a need for a solution to efficiently calculate the exposed body surface area corresponding to common clothing choices in order to accurately measure a user's vitamin D production.\",\n \"Reliable UV Sensor Measurement Yet another challenge is to reject or correct unreliable UV sensor measurement.\",\n \"If the UV sensor is not aligned with the direct solar irradiance, the sensor measurement may underestimate the UV intensity at surfaces that are normal to the sunlight.\",\n \"In particular, the angle sensitivity of UV sensor with respect to sunlight poses a practical challenge for a wearable UV dosimeter, since its orientation can change anytime as the user varies position and/or posture while the sun irradiance angle also varies constantly.\",\n \"Even subtle change of sensor orientation and/or the shade coverage caused by user movement can dramatically change the sensor measurement.\",\n \"Thus the direct measurement from the wearable UV dosimeter may be less than the actual UV intensity on the user's body surface that is normal to the sun light.\",\n \"On the other hand, when the subject moves to indoor or into the shade, the low UV intensity measured by the UV sensor indeed correctly reflects the actual UV intensity on user's body surface.\",\n \"Therefore, in order to more accurately estimate the UV dosage received by the user, a solution is needed to determine if measured UV intensity data should be corrected, and filter out the unreliable UV sensor measurement data if such correction is needed.\",\n \"Sun Exposure Time Solar radiation has been used since ancient times to treat various diseases.\",\n \"Although the beneficial effects of solar radiation are mainly mediated via UV induced vitamin D production in skin, several other pathways may exist for the action of UV radiation on humans.\",\n \"In particular, exposure to sunlight has mood enhancing effect, which is believed to be mediated through the release of serotonin.\",\n \"Research has shown that the rate of production of serotonin by the brain was directly related to the prevailing duration of bright sunlight, and rose rapidly with increased luminosity.\",\n \"The concept—that sunlight has beneficial effects on the serotonin system and the mood and stability of humans—is consistent with the idea that serotonin is involved in homeostasis in humans and contributes to the emergence of mind.\",\n \"Therefore, there is a need for a solution to calculate the daily sun exposure time (SET), thus allowing user to potentially correlate SET with her/his mood of the day.\",\n \"Such a feature may not only reveal the likely correlation between mood and SET, but also provides the user guidance to enhance mood by consciously adjusting SET.\",\n \"Prediction of Optimal Sun Exposure Time While it is helpful for a person to obtain instant feedback on received UV dose and cutaneous vitamin D production and use such information as a guidance to optimize sun exposure, more benefits can be gained if the person knows in advance how to spend time outdoors in the near future for optimal sun experience.\",\n \"For example, it would be very helpful if a person knows what time and how long to stay outside in the next few days to avoid sun damage and to generate sufficient vitamin D. Therefore, there is a need for a solution to provide the user predictive information on optimal sun exposure in the near future, so that the user can plan ahead based on such information.\",\n \"3.SUMMARY OF THE INVENTION The challenges described above are solved by the present invention as described below.\",\n \"It is an objective of this invention to provide a system and method for monitoring a person's UV exposure, and using such information to provide feedback and guidance to the user for achieving optimal balance between the risk and benefits of UV exposure.\",\n \"It is another objective of this invention to provide a system and method for dynamic estimation of a person's safe sun exposure time.\",\n \"It is a further objective of this invention to provide a system and method for calculating a person's vitamin D production resulting from UV exposure.\",\n \"It is yet a further objective of this invention to provide a system and method for dynamic calculating the effective SPF of the applied sunscreen.\",\n \"Another objective of this invention is to provide a system and method for calculating a person's exposed body surface area corresponding to common clothing choices.\",\n \"A further objective of this invention is to provide a system and method for correcting unreliable UV measurement data.\",\n \"Yet a further objective of this invention is to provide a system and method for calculating a person's the daily sun exposure time.\",\n \"Yet it is also an objective of this invention to provide a system and method for providing predictive information to the user to guide optimal sun exposure in the near future.\",\n \"According to some embodiments of this invention, a personal UV dosimetry system comprises a wearable unit and a mobile computing device.\",\n \"The wearable unit comprises a circuitry for measuring the irradiating UV intensity, and the wearable unit is capable of wirelessly communicating with the mobile computing device.\",\n \"The mobile computing device has the software application that can display, store, edit, analyze, and provide summary report of the data collected by the wearable unit, and may further communicate with a remote server, which can save the measured data in a secure database, and such data becomes accessible from other mobile devices or directly from a webpage protected by a password.\",\n \"According to an alternative embodiment of this invention, the UV dosimetry system is an integrated wearable device that comprises both a UV sensing unit and a computing unit.\",\n \"In other words, all the functions of the mobile computing unit described above are physically integrated with the UV sensing unit, thus eliminating the need of two separate units and the wireless communication between them.\",\n \"By analyzing the measured UV intensity data, the UV dosimetry system not only can calculate the real-time UV index (UVI), but also UV dose actually received by the subject and vitamin D production within a time period, taking into account of various factors such as the skin type, the sunscreen usage, the sensor location, etc.\",\n \"By analyzing data about UV dose and vitamin D production, the UV dosimetry system calculates a new metric that can quantitatively evaluate the optimal balance of UV exposure, by taking into account of both skin damage and vitamin D production effects of UV light.\",\n \"The new metric is preferably calculated and displayed in real-time by a wearable UV dosimeter that provides a visual feedback and guidance to the user for achieving optimal balance between the risk and benefits of UV exposure.\",\n \"The UV dosimetry system has a number of unique features, including real-time estimation of the safe sun exposure time, and calculation of cutaneous vitamin D production due to UV exposure.\",\n \"The UV dosimetry system implements advanced algorithms to improve the accuracy of calculation by taking into account of dynamic behavior of SPF, exposed body surface area, and signal processing of UV intensity data to reject or correct unreliable measurement.\",\n \"The UV dosimetry system also calculates the daily sun exposure time (SET), thus allowing user to potentially correlate SET with her/his mood of the day.\",\n \"Moreover, the UV dosimetry system can be individually customized by taking into account various factors, such as the subject's skin type, age, body surface area, and clothing coverage, the usage of sunscreen, the location of the wearable unit, etc.\",\n \"In addition, the UV dosimetry system can provide predictive information based on available forecast data to advise user what time and how long to stay outside in the next few days to avoid sun damage and to generate sufficient vitamin D. The unique advantages of the present invention will be appreciated by people of ordinary skill in the art after referring to the written description of the invention in conjunction with the illustrative drawings.\",\n \"4.BRIEF DESCRIPTION OF THE DRAWINGS FIG.\",\n \"1 shows the high level block diagram of the UV dosimeter system comprising a wearable unit and a mobile computing device.\",\n \"FIG.\",\n \"2 shows the high level operation flowchart of the application software program running on the wearable unit and the application software program running on the mobile computing device, and the communication between thereof.\",\n \"FIG.\",\n \"3 shows the 3D view of UV exposure score (UVES) as a function of pvd (percentage of vitamin D production toward the user-defined daily goal) and puv (percentage of accumulated UV dose against the limit of safe UV dose).\",\n \"FIG.\",\n \"4 illustrates the concept of estimating the slope of UV dose accumulation based on linear regression of the most recent UV dose accumulation curve.\",\n \"FIG.\",\n \"5 illustrates the concept of adjusting vector length for calculating the slope of UV dose curve that has a flat segment followed by an upward increase.\",\n \"FIG.\",\n \"6 illustrates that the actual UV intensity irradiated on the subject over a short period of time can be extrapolated based on the limited numbers of correct measurement of UV intensity obtained during that short time window.\",\n \"FIG.\",\n \"7 illustrates temporal interpolation of UVI or UV intensity at any given time of day based on the forecast UVI data.\",\n \"FIG.\",\n \"8 illustrates correction of measured UV intensity data based on measurement of ambient temperature.\",\n \"5.DETAILED DESCRIPTION General Description of the System Components According to a typical embodiment of this invention, the personal UV dosimetry system comprises a UV sensing unit and a mobile computing unit.\",\n \"The UV sensing unit comprises a circuitry for measuring the irradiating UV intensity.\",\n \"The UV sensing unit is capable of wirelessly and bi-directionally communicating with the mobile computing unit, such as a smart phone or a tablet computer.\",\n \"As known in the art, the mobile computing unit usually has rechargeable battery, a built-in camera, a location/navigation system such as the Global Positioning System (GPS), a user interface for receiving user input and generating various types of output, including but are not limited to, high resolution display, user notifications (e.g.\",\n \"via sound, vibration, text message, etc).\",\n \"The mobile computing unit may also have one or more built-in sensors such as a temperature sensor, an acceleration sensor, a gyroscope sensor, a UV sensor, a light sensor, etc.\",\n \"The mobile computing unit runs an operating system (e.g.\",\n \"iOS, Android, etc.)\",\n \"and is capable of wireless connection to a communication network.\",\n \"The mobile computing unit has the software application that can display, store, edit, analyze, and provide summary report of the data collected by the UV sensing unit.\",\n \"The UV measurement data collected by the UV sensing unit and analyzed by the mobile computing unit includes not only UVI, but also UV dose actually received by the subject and vitamin D production within a time period, taking into account of various factors such as skin type, sunscreen usage, etc.\",\n \"In addition, the mobile computing unit can simultaneously track multiple users and/or multiple UV sensing units.\",\n \"Yet according to another embodiment of this invention, the UV dosimetry system is an integrated device that comprises both the UV sensing unit and the mobile computing unit.\",\n \"In other words, all the functions of the mobile computing unit described above are physically integrated together with the UV sensing unit, thus eliminating the need of two separate units and the wireless communication between them.\",\n \"For the purpose of illustration, we describe in the following the UV dosimetry system comprising two separate units (i.e.\",\n \"the UV sensing unit and the mobile computing device) as an example, while it should be understood that the same concept also applies to the UV dosimetry system with integrated UV sensing unit and the mobile computing unit.\",\n \"According to one embodiment of this invention, the UV sensing unit is a wearable unit, which is a stand-alone, miniature device with aesthetic design, and is preferably waterproof.\",\n \"The wearable unit has a plurality of connecting mechanisms (e.g.\",\n \"clip, button, adhesive surface, etc.)\",\n \"that enable it to be easily adapted to be worn by an individual at various body parts.\",\n \"For example, the wearable unit can be worn as a clothing button, or a necklace, or wrist band, or hat accessory, etc.\",\n \"According to another embodiment of this invention, the UV sensing unit is integrated with another article of manufacture.\",\n \"For example, the UV sensing unit can be a built-in unit of a cooler, a beach chair, an umbrella, a pair of eye classes or goggles, a key chain, a dog leash, a headband, a roof-top weather station, etc.\",\n \"In another example, the UV sensing unit can be woven into the clothing such as shirts, jackets, scarf, etc., to be part of the so-called smart clothing.\",\n \"By embedding the UV sensing unit in textiles, the UV dosimetry system can become truly wearable.\",\n \"In the following, we describe the UV dosimetry system by referring a wearable unit as an example of the UV sensing unit, although it should be understood that the UV sensing unit can take different forms as disclosed above.\",\n \"FIG.\",\n \"1 shows the high level block diagram of the UV dosimeter system comprising a wearable unit 200 and a mobile computing device 100.The UV radiation can be detected by one or more built-in UV sensors 210, which transform incident radiant UV signals into standard electrical signals.\",\n \"Semiconductor UV sensors fabricated using Silicon, Silicon-Carbide, Gallium-Nitride, Gallium-Arsenide and Germanium may be used as UV sensors due to their wide band-gap properties.\",\n \"The UV signals corresponding to the UV radiation intensity may be further digitized by an analog-to-digital converter 230.Other sensors 220 such as temperature sensors and humidity sensors can be included into the unit for enhanced system features.\",\n \"For example, as described in more details below, a temperature sensor may be built adjacent to the UV sensor to detect user's environmental change and facilitate processing of measured UV intensity data.\",\n \"All detected sensing signals are processed by a microprocessor 250, and the acquired sensor data can be temporarily stored in a local memory circuit.\",\n \"The arranged data is then wirelessly sent to the mobile computing device for post data processing.\",\n \"A wireless communication unit 240 employing a wireless technology standard such as Bluetooth technology can be used to wirelessly transmit and receive data between the wearable unit 200 and the mobile computing device 100.Battery cells 270 such as a battery button cell can be used to power the wearable unit 200.Energy harvesters such as thermal electric generator or solar cell can be used as an alternative source of energy to power the wearable unit.\",\n \"The battery measurement block 260 may be included for enhanced features including monitoring the battery usage and determining device false operating conditions.\",\n \"General Description of the System Operation As shown in FIG.\",\n \"2, the application program 600 running on the wearable unit controls the operation of the wearable unit 200.After the wearable unit 200 is turned on, the application program 600 starts advertising the data 610 through the wireless communication protocol 610 to pair with the mobile computing unit 100.The mobile application program 500 running on the mobile computing device 100 then tries to discover the advertising data pocket 510 to pair with the wearable unit 200.Once the broadcasting data is detected, an authentication process begins where both wearable unit 200 and mobile computing device 100 exchange the data to establish a connection.\",\n \"Several connection processes may be attempted until the connection is established, and the pair of wearable unit 200 and the mobile computing unit 100 identify and register with each other (620, 520) by respective application programs.\",\n \"The mobile application program 500 can notify users for a status of this pairing process.\",\n \"The mobile application program 500 can keep a record of the previous registered wearable units 200, thus the pairing process can be expedited in the future.\",\n \"Through the mobile application program 500, the user can edit modes of operation as well as personal information 525 such as the skin type, age, wearable position, and sun protection factor (SPF), etc.\",\n \"Some user information can be detected by employing a mobile computing peripheral unit.\",\n \"For example, the skin type may be detected by analyzing an image captured by a mobile computing camera.\",\n \"SPF lotion data can be detected by scanning the barcode on a lotion bottle.\",\n \"Based on received UV data 535 measured and sent from the wearable unit 200 and the entered user information 525, the mobile application program 500 can calculate the UVI, UV dose, and the amount of vitamin D production 540.Users can change the personal information 555 such as sunscreen usage and clothing coverage at any time so that the updated user information can be used for calculating UV dose and vitamin D production.\",\n \"User can also check the UV dose and related information such as vitamin D production through the mobile application program 500 anytime.\",\n \"The application program features will be described later in this disclosure.\",\n \"The wireless data communication between the wearable unit 200 and the mobile computing device 100 is automatically running in the background to make the mobile application program 500 user friendly and easy to use.\",\n \"General Description of the Communication Protocol Both mobile computing device 100 and wearable unit 200 are linked together through a communication protocol as demonstrated in the high level flowchart shown in FIG.\",\n \"2.After the pairing connection process is established, the user programmable modes of operation 525 corresponding to commands and configurations for the wearable unit 200 such as the UV sample time, number of the UV data samples and UV data resolution are wirelessly transmitted 530 to the wearable unit 200 to determine if configuration update is necessary 625.Based on the received commands 625, the wearable unit 200 will either keep previous configurations 630 or set new configurations 635 for measuring UV data 640.These configurations determine how the UV data is measured and how often the data is wirelessly transmitted to the mobile computing device 100.For example, if a user wants to know the current UVI irradiating on the wearable unit 200, the data can be immediately sampled and transmitted to the mobile computing device 100.If the mobile computing device 100 is not in close proximity of the user 645, the sampled UV data can be temporarily stored in the local memory 650 of the wearable unit 200 for later transmission whenever the mobile computing device 100 is within the range to establish a pairing connection.\",\n \"In order to save the wearable unit battery consumption, all or parts of the electronic circuitries especially the wireless communication circuit could be powered down into a sleep mode 665, which consumes a minimal power.\",\n \"The wearable unit 200 goes into sleep mode whenever there is no active data sampling/processing or communication with the mobile computing device 100, and typically wakes up automatically 675 according to configured sampling period and communication protocol.\",\n \"A limited data processing and calculation on the wearable unit 200 can be implemented to reduce a firmware complexity on the microprocessor 250 and minimize the wake-up time for power saving.\",\n \"Therefore, most of the post data processing such as calculation of UV dose and vitamin D generation can be performed in the mobile computing device 100 as illustrated in FIG.\",\n \"2.The results of the calculation can be sent back to the wearable unit 200 through wireless communication.\",\n \"Alternatively, if the mobile computing device 100 is out of the communication range of the wearable unit 200, the data processing and calculation could be performed by the microprocessor 250 on the wearable unit 200.If the calculated data results in a necessary user alert 545, the alarm mechanism is activated.\",\n \"The alarm mechanism could be an alarm sound, flashing screen/light or vibration generated by the mobile computing device 100, or the wearable unit 200, or both.\",\n \"For example, the alarm can be generated by the mobile computing device 100 to display related alarm information 550.Meanwhile, an alarm command 660 can be sent to the wearable unit 200 which also generates a user perceptible light and/or vibration alert 670.As shown in FIG.\",\n \"2, communication between the wearable unit 200 and the mobile computing device 100 is periodic for maintaining connection.\",\n \"The polling mechanism where one device broadcasts data and waits for another device acknowledges is used for notifying the connection status.\",\n \"If the time between broadcasting and waiting for acknowledgment is beyond a programmable communication time-out, connection is lost.\",\n \"With several failing reconnection attempts, the sampled UV data is then stored in the local memory circuit 650.Whenever the mobile computing device 100 is within the range 645 to establish a successful connection, the previously stored data is automatically transmitted 655 to the mobile computing device 100.By evaluating the received signal strength sent by the wearable unit 200, the mobile device 100 can implement the electronic leash function to estimate the distance to the wearable unit 200 and determine if it is within or outside the communication range.\",\n \"Since the wearable unit 200 and the mobile computing device 100 are coupled together via wireless communication, the periodic status updates such as electronic leash notification, battery indication and memory indication can be wirelessly transmitted along with the measured UV data.\",\n \"Alarm can be generated by the wearable unit 200, or the mobile computing device 100, or both to alert the user of abnormal system conditions (e.g.\",\n \"memory full, low battery, communication lost, etc.).\",\n \"Therefore, it allows the UV dosimetry system operate without any interruptions due to electronic unleash, low battery or lack of memory.\",\n \"As a result, the accuracy and reliability of the system increases.\",\n \"General Description of the User Interface The wearable unit is by default in a sleep mode and the user can activate the measurement of the UVI, UV dose, and vitamin D production.\",\n \"The mobile device app can start, pause, resume, stop, and reset the measurement.\",\n \"The wearable unit can also start, pause, resume, and reset the measurements with user input, such as finger taps on a touch sensing area.\",\n \"For example, different numbers and/or sequences of taps can mean different commands.\",\n \"The mobile device and the wearable unit can trigger sound, light, or vibration alarms when the accumulated UV dose is close to the harmful level.\",\n \"The wearable unit can also indicate the status or measurement results such as UVI, for example, with a few LEDs laid out in a circle or line.\",\n \"The mobile device can instantly query the measurements from the wearable unit.\",\n \"It can also display, store, edit, analyze, and provide summary report of the data collected by the wearable unit.\",\n \"The mobile application syncs with a remote server to save the sensor measurement data in a secure database.\",\n \"This data becomes accessible from other mobile devices or directly from a webpage protected by a password.\",\n \"Using a software application, the data can be analyzed and presented in easy to understand graphs, tables, and summary reports.\",\n \"The user can share the data through social media, email, or text message.\",\n \"Annotations can be added to the data for tagging purposes.\",\n \"For example, through annotation, the user can then remember when the data has been taken.\",\n \"The user can also annotate relevant events such as applying a sunscreen lotion, changing clothes, staying indoors, taking vitamin D supplement, etc.\",\n \"The UV dosimetry system can accurately measure the location specific UVI in real time, which is more precise than the UVI forecast predicted by weather services.\",\n \"The UVI measurement by a user wearing the wearable unit can be posted in crowd sourcing websites or on a dedicated server and shared in the mobile device app so that anybody can access it.\",\n \"Since the UVI measurement could be misleading, e.g.\",\n \"if the user is in the shade, the app takes into account the forecasted UVI and/or the temperature of the device to decide if the measurement is valid or not.\",\n \"If it is valid then it is pushed to the servers.\",\n \"Otherwise it is discarded.\",\n \"The mobile device also provides a user interface that allows user to change profile settings (e.g.\",\n \"age, gender, height, weight, etc.)\",\n \"and/or programming parameters.\",\n \"For example, user can select options and/or parameters that affect the calculation of UV dose and vitamin D production, such as clothing coverage, sunscreen type, etc.\",\n \"Method for Multi-User Management Multiple users can take advantage of one single wearable unit.\",\n \"The mobile application can create several accounts protected by a password.\",\n \"Each account saves its own data associated with one individual user.\",\n \"In addition, each account can create several profiles for the associated user.\",\n \"A profile is a configuration for a specific measurement of UV dose and/or vitamin D production.\",\n \"For example, it can include the clothes type worn and the sunscreen SPF used.\",\n \"Profiles are used to avoid setting the same parameters multiple times.\",\n \"The mobile application can also track several wearable units at the same time.\",\n \"Each wearable unit can trigger a different alarm and an electronic leash allows the app to detect when a wearable unit is out of range by setting a sound, vibration, or light alarm on the mobile device and/or the wearable unit.\",\n \"Multi-user tracking is convenient, for example, for a parent or a caregiver to monitor UV exposure of several children.\",\n \"In addition, by utilizing the electronic leash function, the mobile device can operate in a search mode that allows the mobile app to find a lost wearable unit.\",\n \"Optimal Balance of UV Exposure This invention provides a novel solution for monitoring a person's UV exposure, and using such information to provide feedback and guidance to the user to optimize his/her sun experience.\",\n \"Specifically, in this section, we describe a method which can be implemented in the UV dosimetry system to quantitatively evaluate the optimal balance of UV exposure, by taking into account of both skin damage and vitamin D production effects of UV light.\",\n \"The described new metrics can be calculated and displayed in real-time by a UV dosimetry system that provides a visual feedback and guidance to the user for achieving optimal balance between the risk and benefits of UV exposure.\",\n \"One new metric is termed UV exposure score (UVES), which is a normalized index ranging from 0 to 1 (or 0-100 by applying a scale factor 100).\",\n \"Higher UVES indicates improved UV balance whereas lower UVES indicates less optimal UV balance (obviously, it is equivalent to define UVES in the complementary form 1−UVES, so that lower value indicates improved UV balance whereas higher value indicates less optimal UV balance).\",\n \"For example, the UVES can be defined as: UVES=pvdV·(1−puvU) (1) where pvd is the percentage of vitamin D production toward the daily goal, puv is the percentage of accumulated UV dose against the limit of safe UV dose, and V and U are two positive parameters that can be predefined or programmed by the user.\",\n \"Clearly, UVES is the product of two terms, pvdV and 1−puvU, which respectively quantify the benefit of UV (e.g.\",\n \"vitamin D production) and residual risk of UV damage (e.g.\",\n \"sunburn).\",\n \"The weight of these two terms can be adjusted by parameters V and U, which can be predefined or programmed by the user of the UV dosimetry system.\",\n \"The method of calculating vitamin D production is described below in the section titled “Calculation of Cutaneous Vitamin D Synthesis.” The daily goal of vitamin D production (in unit of IU) is defined by the user, and pvdV is limited to the upper ceiling 1.0 (i.e.\",\n \"pvdV is fixed to 1 when the synthesis of vitamin D exceeds the daily goal).\",\n \"The method of calculating the accumulated UV dose is described below in the section titled “Calculation of Safe Sun Exposure Time.” The limit of safe UV dose is defined by the user, typically being set to the user-specific minimal erythemal dose (MED).\",\n \"Similarly, puvU is limited to the upper ceiling 1.0 (i.e.\",\n \"1−puvU is fixed to 0 when the accumulated UV dose exceeds the limit of safe UV dose).\",\n \"For the purpose of illustration, FIG.\",\n \"3 shows the 3D view of UVES as a function of pvd and puv.\",\n \"Alternatively, a 2D view of UVES can be displayed in grey scale or color-coded.\",\n \"As examples, two simulated trajectories of accumulated UV dose and amount of vitamin D production over a period of time are also shown.\",\n \"As can be seen, while one trajectory 810 progressively reaches the optimal state (high UVES)—evidenced by exceeding the goal of vitamin D production (pvd>100%) and not reaching limit of safe UV dose (puv<100%), the other trajectory 820 fails to climb to the optimal state—the vitamin D production is less than 70% of the daily goal, and the accumulated UV dose is near the limit of safe UV dose.\",\n \"Therefore, the composite metric UVES provides a quantitative means to characterize the degree of balance between the benefit and risk of UV exposure.\",\n \"Users can use this metric as a guidance to optimize their sun exposure.\",\n \"In addition, daily log of the UVES can provide a historical view and trending analysis of the overall sun exposure experience.\",\n \"An alternative metric is termed UV balance index (UVBI), which ranges from −1 to 1.More negative UVBI (approaching −1) indicates lower vitamin D production, whereas more positive UVBI (approaching 1) indicates higher risk of sunburn (obviously, it is equivalent to define UVBI using the opposite form −UVBI, so that more positive value indicates lower vitamin D production, whereas more negative value indicates higher risk of sunburn).\",\n \"The optimal balance of UV exposure is reflected by UVBI value that is close to zero.\",\n \"Unlike UVES, UVBI can differentiate two sub-optimal UV exposure conditions (low production of vitamin D vs. high risk of sunburn).\",\n \"As an example, UVBI can be defined as: UVBI=(1−puvU)(pvdV−1)+W·puvU (2) where W is a weighting function that as described below.\",\n \"Similarly, pvd is the percentage of vitamin D production toward the daily goal, puv is the percentage of accumulated UV dose against the limit of safe UV dose, and V and U are two positive parameters that can be predefined or programmed by the user.\",\n \"Likewise, both pvdV and puvU have the upper ceiling of 1.0.Note the first term (1−puvU)(pvdV−1) approaches 0 when either puvU or pvdV approaches 1, thus UVBI will be determined by the second term W·puvU in these two conditions.\",\n \"The weighting function W can be user defined such that it satisfies the following criteria: (a) If puv approaches or exceeds 1 (puvU→1), then UVBI approaches 1.\",\n \"(b) If puv is sufficiently smaller than 1 (puvU<1−ε, where 0<ε<1) AND pvd approaches or exceeds 1 (pvdV→1), then UVBI approaches 0.\",\n \"(c) Otherwise, UVBI approaches −1 as pvd approaches 0 (pvdV→0).\",\n \"One exemplary definition of the weighting function is to set W=0 if condition puv<0.85 OR (puv<1 AND pvd<0.75) is met, or set W=puv otherwise.\",\n \"Another exemplary definition of the weighting function is to set W=0 if condition puv<0.75 OR (puv2+pvd2<1.44 AND pvd<0.9) is met, or set W=puv otherwise.\",\n \"The purpose of conditional setting W to zero is to avoid or minimize the effect of numerical cancellation between the first and second terms in equation (2).\",\n \"Clearly, the weighting function can be defined by many other means as long as the three criteria described above are met.\",\n \"Calculation of Safe Sun Exposure Time For a wearable UV dosimetry system, an essential feature is to predict how long the user can safely stay exposed to sun light before getting sun burn.\",\n \"The time to skin burn is a dynamic parameter.\",\n \"It is affected by the time varying intensity of UV irradiance.\",\n \"It also depends on the accumulated UV dose already received by the user.\",\n \"Moreover, it can be modified by the user's behaviors, such as seeking the shade, changing clothing coverage, applying the sunscreen, etc.\",\n \"This section describes a method for dynamic estimation of the safe sun exposure time in a UV dosimetry system.\",\n \"The UV sensor embedded in the UV sensing unit generates output of UV intensity (unit: J/m2) over time, which can be represented as a time series that has the sampling interval Ts.\",\n \"The device then calculates the accumulated UV dose by integrating the UV intensity over time based on the trapezoidal rule.\",\n \"D ( t ) = [ ∑ k = 0 t ( I k + I k + 1 ) · ( t k + 1 - t k ) ] / 2 ( 3 ) where D(t) is the accumulated dose from predefined time 0 until time t, Ik+1 and Ik are respective UV intensity readings at two consecutive sample times tk+1 and tk.\",\n \"The accumulated UV dose and the time are reset at predefined time of day.\",\n \"For example, the elapsed time is typically reset to 0 at midnight, and the accumulated UV dose is cleared at the time reset.\",\n \"Typically, tk+1−tk=Ts when all regularly sampled data are available, but the time gap may be greater than Ts in case of missed data, e.g.\",\n \"due to data loss during wireless transmission or rejection of invalid data due to measurement noise.\",\n \"When the time gap is greater than a predefined threshold Δ, the UV intensity can be assumed to be zero within the time gap.\",\n \"Alternatively, the UV intensity can be assumed to remain the same as the last valid sample.\",\n \"Yet another alternative is to assume the UV intensity gradually decrease from the last valid sample to zero in a linear or nonlinear fashion.\",\n \"Assuming there is no additional protection (e.g.\",\n \"sunscreen use or clothing coverage) for the skin area near the UV sensing unit, the safe sun exposure time can be expressed in terms of time to skin burn (T2SB), which is defined as: T2SB=[p·MED−D(t)]/b (4) where p is a positive coefficient that is user-programmable, MED is the predefined minimal erythemal dose that is dependent on user's skin type according to the Fitzpatrick scale, and b is the projected slope of UV dose accumulation.\",\n \"Note the product p·MED defines the maximum UV dose that is considered safe for the user, where the parameter p allows user to specify the scale in terms of MED that the user can tolerate.\",\n \"For example, the maximum safe UV dose is 1 MED when p=1, or 1.5 MED when p=1.5, or 0.9 MED when p=0.9.As illustrated in FIG.\",\n \"4, the projected slope of UV dose accumulation may be obtained based on the linear regression of the most recent UV dose accumulation curve.\",\n \"Denote T the time vector ranging from time t−δ to time t, and D the UV dose vector ranging from D(t−δ) at time t−δ, to D(t) at time t, where δ can be a predefined constant or a user-programmable parameter, then the projected slope b is calculated as: b=[NΣ(D·T)−(ΣD)·(ΣT)]/[N(ΣT2)−(ΣT)2] (5) where N is the total number of samples between time t−δ and time t (note: each sample has a pair of sample time and UV dose value).\",\n \"Two special cases need to be considered when t<δ (i.e.\",\n \"at the beginning of the day, shortly after the midnight) or when D(t)−D(t−δ)=0, which means there is no UV exposure in the past δ duration, hence the slope b=0 (i.e.\",\n \"the UV dose segment is flat).\",\n \"In such cases, the projected T2SB is infinite.\",\n \"If the UV dose increases after a flat segment, equation (5) can be similarly used to calculate the new slope.\",\n \"However, the vector length of T and D are reduced, and then they gradually increase until reaching the full length N. This can be illustrated in FIG.\",\n \"5, which shows a portion of UV dose curve with a flat segment followed by an upward increase.\",\n \"In this example, each sample of UV dose curve (solid line) is marked by a circle.\",\n \"The UV dose curve remains flat until its last sample 840.Then the UV dose curve starts to increase from sample 841.For illustration purpose, the vector length N is set to 8 in this example.\",\n \"The slope b remains zero throughout the flat segment, including its last 8 samples 850.Upon detecting an increase of the UV dose at sample 841, the vector length is reduced to 4 in this example.\",\n \"Thus the slope is evaluated using only a group of 4 samples 851.As new UV dose values are available after sample 841, the vector length starts to increase toward its original length (N=8).\",\n \"As illustrated in the figure, for the sample 842, the slope is evaluated using a group of 5 samples 842; for the sample 843, the slope is evaluated using a group of 6 samples 843; for the sample 844, the slope is evaluated using a group of 7 samples 854; and for the sample 845, the slope is evaluated using a group of 8 samples 855.This adaptive adjustment of vector length for calculating slope is important because while the linear regression allows smooth projection of T2SB (i.e.\",\n \"noise tolerant), shortening vector length after a flat segment allows quick adaptation of rising UV dose curve after sudden exposure to sunlight.\",\n \"Yet in another embodiment, the projected slope of UV dose accumulation is based on the current or recent UV intensity, instead of based on linear regression analysis of the UV dose accumulation curve.\",\n \"Specifically, the projected slope of UV dose accumulation is the product of UV intensity (I) and the sampling interval (Ts), i.e.\",\n \"b=I×Ts.\",\n \"This assumes that the UV intensity remains the same for the foreseeable near future.\",\n \"In one example, I is the device measured current UV intensity.\",\n \"In another example, I is the extrapolated UV intensity value based on the most recent measurement of UV intensity in a short time window.\",\n \"The method of calculating the extrapolated UV intensity value in a short time window is described below in the section titled “Extrapolation of UV Sensor Output”.\",\n \"Yet in another example, I is the forecasted or crowd sourced UV intensity value that is time and location specific to the user.\",\n \"This is useful when the user is staying indoor or in the shade but wants to have a rough estimate of T2SB should he or she goes outside to get exposed to sunlight, without actually measuring the UV intensity using the device.\",\n \"When the UV sensor is not aligned with the direct solar irradiance, measurements may understate the UV intensity at surface that is normal to the sun light.\",\n \"Therefore, the measured UV intensity, as well as the calculated accumulated UV dose D(t) will vary depending on where the UV sensing unit is worn (or maybe the sensor is just located nearby but not worn on the body).\",\n \"There are many variables affecting the UV irradiance angle, such as the solar zenith angle, the orientation and body movement of the subject, and the environment surrounding the subject (e.g.\",\n \"shade, light reflections, etc).\",\n \"While it may be impractical to account for all these factors in real time, scaling the sensor measured UV intensity or dose by a sensor location factor (SLF) may provide a reasonable estimate of the UV intensity or D(t) at different body surface areas.\",\n \"For example, if the UV sensor is worn on user's wrist facing outward, the sensor measured UV dose at the wrist will need to be multiplied by a site-specific SLF to derive the UV dose at an uncovered body area, such as the face, shoulder, chest, legs, etc.\",\n \"The determination of SLF at different body parts is ideally through a calibration phrase, when a plurality of UV sensors are worn by the user at different locations for a certain period of time, and the ratios between UV dose readings from these sensors are used to determine site-specific SLF.\",\n \"Typically, default values of SLF for different sensor locations can be predefined based on an experimental study involving a group of subjects.\",\n \"Similar approach is described in the paper authored by Thieden et al.\",\n \"“The wrist is a reliable body site for personal dosimetry of ultraviolet radiation.” Photodermatol Photoimmunol Photomed 2000; 16: 57-61.As expected, a user may experience skin burn earlier on the face or shoulder than on the arms or legs because the actual UV dose varies among different body parts.\",\n \"Therefore, the safe sun exposure time T2SB will depend on which part of the body surface is uncovered, and is calculated based on the highest accumulated UV dose D(t) that is adjusted for SLF.\",\n \"Another factor that affects the safe sun exposure time is the topical application of sunscreen.\",\n \"Usage of sunscreen with high skin SPF can significantly block or absorb UV radiation, thus prolong the time to skin burn (T2SB).\",\n \"In general, for an uncovered skin area with adequate sunscreen application, the safe sun exposure time calculated above is adjusted by multiplying the SPF of the sunscreen.\",\n \"Thus, if the calculated T2SB without sunscreen is 10 minutes, then the safe sun exposure time will be 150 minutes after proper application of sunscreen with the SPF 15.Note, however, the effective SPF is not only dependent on the product labeling, but also the frequency and amount of sunscreen applied, the binding property of the sunscreen, the elapsed time since last sunscreen application, and so on.\",\n \"The method for calculating effective SPF is described below in the section titled “Calculation of Effective SPF”.\",\n \"Calculation of Cutaneous Vitamin D Synthesis A UV dosimetry system that can calculate the daily vitamin D production resulting from solar UV exposure will provide useful information for the user to determine if vitamin D supplement is necessary, and if so, how much is necessary.\",\n \"Such quantitative information will offer user objective guidance to achieve optimal balance of sun exposure, and prescribe behavioral changes in maintaining personal health.\",\n \"This section describes a method for calculating daily vitamin D production from UV light in a UV dosimetry system.\",\n \"The formula for calculating the amount of vitamin D produced by people from an average daily UV exposure was originally described by Godar et al.\",\n \"(Environ Health Perspect 2012; 120:139-143).\",\n \"Instead of relying on daily average UV dose derived from a sample population, more accurate estimation of individual's daily cutaneous vitamin D synthesis (DVD) due to UV exposure can be obtained by integrating the subject's instantaneous vitamin D production rate over a day using the trapezoidal rule: DVD = ∑ k [ ( V k + V k + 1 ) · ( t k + 1 - t k ) ] / 2 ( 6 ) where Vk+1 and Vk are respective vitamin D production rate at two consecutive sample times tk+1 and tk.\",\n \"The DVD and time are reset at predefined time of day.\",\n \"For example, the elapsed time is typically reset to 0 at midnight, and DVD is cleared at the time reset and accumulates over 24 hours.\",\n \"Obviously, vitamin D production over different time intervals (e.g.\",\n \"hourly, etc.)\",\n \"can be similarly calculated.\",\n \"Typically, tk+1−tk equals the device sampling interval when all regularly sampled data are available, but the time gap may be greater than the sampling interval in case of missed data, e.g.\",\n \"due to data loss during wireless transmission or rejection of invalid data due to measurement noise.\",\n \"When the time gap is greater than a predefined threshold Δ, the vitamin D production rate can be assumed to be zero within the time gap.\",\n \"Alternatively, the vitamin D production rate can be assumed to remain the same as the last valid sample.\",\n \"Yet another alternative is to assume the vitamin D production rate gradually decrease from the last valid sample to zero in a linear or nonlinear fashion.\",\n \"At any given time instant, the vitamin D production rate (V) is calculated as: V = C · cf · sf · af · bf · ∑ s ( I s · pBSA s / eSPF s ) ( 7 ) where C=49 is a constant which is derived from a reference value corresponding to the approximate amount of vitamin D generated (measured in ×100 IU) by a typical young female subject having Fitzpatrick skin type II with a whole body exposure to nearly uniform UV irradiance at the intensity of 320 J/m2.As described in details below, cf is the action spectrum conversion factor, sf is the skin type factor, of is the age factor, and bf is the body surface area factor.\",\n \"The summation term represents the total contribution of vitamin D production from all exposed body surface area, which is divided into multiple parts (e.g.\",\n \"face, chest, arms, legs, etc).\",\n \"For each part of exposed body surface area (s), the corresponding UV intensity (Is), its percentage of total body surface area (pBSAs), and the effective sun protection factor (eSPFs) of the applied sunscreen are considered for the calculation.\",\n \"The action spectrum conversion factor cf changes erythemally weighted to previtamin D3 weighted UV doses.\",\n \"For general calculation, cf can be simplified to be a constant 1.0, that is, the differences between wavelength contributions estimated by the erythmal action spectrum and the previtamin D action spectrum are ignored.\",\n \"Alternatively, cf can be determined by linear interpolation of values reported by Pope et al (Photochem Photobiol 2008; 84:1277-1283), by taking into account of season and the user's latitude.\",\n \"Increased skin pigment can greatly reduce the capacity of skin to synthesize vitamin D. Thus the UV dose required to make the same amount of vitamin D varies by skin type.\",\n \"Using Fitzpatrick skin type II as the reference, the skin type factor sf can be determined, as described by Godar et al.\",\n \"(Environ Health Perspect 2012; 120:139-143), based on the respective minimum erythmal dose (MED) values.\",\n \"It has also been known that aging significantly affects the capability of human skin to produce vitamin D. Compared to a 20 years old adult, a 70 years old person has about 75% reduced capacity to make vitamin D in the skin.\",\n \"The age-dependent capability of vitamin D production can be characterized by age factor af which can be fixed to 1.0 for age <20 years and 0.10 for age >80 years, and decreases following a linear model for age between 20-80 years: af=1−0.015·(age−20) (8) The amount of vitamin D production in a person depends on how much skin is exposed to UV light.\",\n \"Given the same percentage of skin area exposure, a person with a larger body surface area (BSA) will produce more vitamin D than a person with a smaller BSA.\",\n \"The body surface area factor bf is the ratio of a person's BSA to 1.7 m2, which is approximately the BSA of a typical female subject.\",\n \"A person's BSA can be calculated based on the formula of DuBois and DuBois.\",\n \"Hence the body surface area factor bf is calculated as: bf=0.20247×H0.725×W0.425/1.7 (9) where the person's height (H) is in meters and weight (W) is in kilograms.\",\n \"Only skin surface exposed to UV light can synthesize vitamin D. The total BSA can be divided into different parts, for example, based on the Lund and Browder chart, which specifies the approximate percentage of each part's surface area relative to the total BSA.\",\n \"Different clothing choices can affect the percentage of body surface area that is exposed.\",\n \"Specification of various body parts and their corresponding percentages of body surface area corresponding to common clothing choices are described in the following section titled “Calculation of Exposed Body Surface Area”.\",\n \"In a simplified scenario, the UV intensity measured by the wearable UV sensor is assumed to be uniform over the exposed body surface, and the sunscreen application is also assumed to be uniform.\",\n \"Then equation to calculate the vitamin D production rate can be simplified to: V=C·cf·sf·af·bf·I·pBSA/eSPF (10) where I is the UV intensity, pBSA is the percentage of total BSA being exposed to UV light, and eSPF is the effective SPF of the applied sunscreen.\",\n \"Note the effective SPF is not only dependent on the product labeling, but also the frequency and amount of sunscreen applied, the binding property of the sunscreen, the elapsed time since last sunscreen application, etc.\",\n \"The method for calculating eSPF is described below in the section titled “Calculation of Effective SPF”.\",\n \"Also note that the measured UV intensity at the sensor wearing location may be different from the actual UV intensity at a different body area due to varying solar irradiance angle.\",\n \"As described above in the section titled “Calculating of Safe Sun Exposure Time”, scaling the sensor measured UV intensity by a sensor location factor (SLF) may provide a reasonable estimate of the UV intensity at different body surface areas, and the SLF at different body parts can be determined through a calibration phrase.\",\n \"As another example, a user may apply sunscreen over some, but not all exposed body surface areas.\",\n \"Thus the eSPF at different parts of body surface may vary significantly.\",\n \"Knowing the vitamin D production rate (V) and the daily goal of vitamin D amount (DGVD) which can be programmed by the user, the device can also estimate the time remaining to reach the DGVD (T2VD).\",\n \"Specifically, at any time of the day, T2VD can be calculated by dividing the difference between DGVD and the accumulated vitamin D production at that time by a projected slope of vitamin D accumulation.\",\n \"This calculation can be performed in a way that is similar to the method of calculating the time to skin burn (T2SB) as described above in the section titled “Calculation of Safe Sun Exposure Time”.\",\n \"For example, at any time of the day, the device can calculate the projected slope of vitamin D accumulation based on linear regression analysis of accumulated vitamin D production curve in the preceding time interval.\",\n \"Alternatively, the device can set the projected slope of vitamin D accumulation to the product of sampling interval and the vitamin D production rate (V).\",\n \"The vitamin D production rate (V) can be calculated using equations (7) or (10), where the UV intensity can be currently measured value, or the extrapolated value based on the most recent measurement of UV intensity in a short time window.\",\n \"The method of calculating the extrapolated UV intensity value in a short time window is described below in the section titled “Extrapolation of UV Sensor Output”.\",\n \"Yet in an alternative embodiment, the vitamin D production rate (V) is calculated based on the forecasted or crowd-sourced UV intensity value that is time and location specific to the user.\",\n \"This could be useful when the user is staying indoor or in the shade but wants to have a rough estimate of T2VD should he or she goes outside to get exposed to sunlight, without actual measuring the UV intensity using the device.\",\n \"Calculation of Effective SPF As noted above, the effective SPF of a sunscreen product often actually deviates from the labeled SPF, due to some common factors including the amount of sunscreen initially applied, binding property of the sunscreen, reapplication of the sunscreen, and time elapsed since previous sunscreen application, etc.\",\n \"This section describes a method for calculating the effective SPF in a UV dosimetry system.\",\n \"After initial application of sunscreen, it is removed from the skin by clothing or sweating such that the thickness remaining on the skin decreases with time in an exponential manner.\",\n \"This can be mathematically modeled by: x(t)=x(0)·exp(−λt) (11) where x(t) is the sunscreen thickness at time t, x(0) is the initially applied sunscreen thickness, λ, is rate constant for sunscreen removal that is related to the substantivity half-life of the sunscreen, which characterizes the binding capability of the sunscreen, and can be approximately determined based on such factors as the type of sunscreen, and the activity of the subject (toweling, sweating, swimming, etc.).\",\n \"When sunscreen is reapplied at time T, the newly applied sunscreen amount a is added to the remaining sunscreen x(T), and the time course of sunscreen thickness follows the same exponential curve for t>T.\",\n \"The relationship between sunscreen application thickness and the resulting SPF has been investigated by a number of studies.\",\n \"The results have been variable ranging from an exponential relationship between SPF and applied thickness, to a logarithmic relationship, and through to an approximately linear relationship.\",\n \"Depending on the spectral absorption profile of the product, the relationship could vary.\",\n \"For example, a linear relationship of the SPF and the sunscreen application thickness can be modeled by: SPFE=1+(SPFL−1)·x/2 (12) where SPFE denotes the effective SPF, SPFL is the labeled SPF of the sunscreen product, and x is the sunscreen thickness which can be calculated from equations described above.\",\n \"Based on this model, the sunscreen achieves its labeled SPF value when the application amount is 2 mg/cm2 as specified in the international protocol.\",\n \"The unit intercept on SPF axis implies no additional sun screen protection when no sunscreen is applied (i.e., x=0).\",\n \"Calculation of Exposed Body Surface Area To estimate the amount of cutaneous vitamin D synthesis, it is important to calculate the percentage of exposed body surface area, taking into account of various options of clothing coverage.\",\n \"This section describes the method to calculate the exposed body surface area in a UV dosimetry system.\",\n \"A person's total body surface area (BSA) can be calculated using the DuBois and DuBois formula.\",\n \"BSA=0.20247×H0.725×W0.425 (13) where the person's height (H) is in meters and weight (W) is in kilograms.\",\n \"The total BSA can be divided into different body parts based on the Lund and Browder chart, which specifies the approximate percentage of each part's surface area relative to the total BSA and is known to be age dependent.\",\n \"Age is a main factor affecting the percentage values in the Lund and Browder chart because the ratio of the surface area of the head to the surface area of the limbs is typically larger in children than that of an adult.\",\n \"To estimate the surface area of various body parts different ages, linearly interpolated values can be found between ages on the Lund-Browder charts.\",\n \"Different clothing choices can affect the percentage of total BSA that is exposed.\",\n \"The UV dosimetry system may allow user to select different clothing combinations for different parts of the body by browsing through or toggling between various clothing options.\",\n \"For example, the user can toggle between “with hat” and “no hat” to indicate coverage or exposure of head.\",\n \"Likewise, the user can select “bare chest”, “short sleeve”, or “long sleeve” to represent different degrees of upper body coverage.\",\n \"Clothing coverage for other parts of the body surface can be similarly defined.\",\n \"The selection of clothing options can vary in number and styles.\",\n \"Each selected clothing option can have a predefined surface area coverage percentage for the selected body part.\",\n \"A lookup table can be predefined that lists the approximate percentage values of skin exposure of various body parts as a result of common clothing choices.\",\n \"An empty cell in the table indicates the skin surface of the body part (e.g.\",\n \"in the row) is not affected by the corresponding clothing option (e.g.\",\n \"in the column).\",\n \"In contrast, a value of zero in the cell means no skin exposure for the corresponding body part, i.e.\",\n \"it is completely covered by the clothing.\",\n \"To calculate the percentage of a person's exposed BSA relative to the total BSA, each body part's BSA percentage (obtained from the Lund and Browder chart) is multiplied by the body part's skin exposure percentage value based on the corresponding clothing choice, and then these weighted terms are summed.\",\n \"Correction of Measured UV Intensity While it is a common sense that the UV sensor should not be obstructed from the sun for accurate measurement, in practical use the device may experience changing angle of the irradiating sunlight and/or temporary shading of the device.\",\n \"The design of a UV dosimetry system takes this variability into account, by at least partially compensating for the body movement and temporary obstruction of the UV sensor.\",\n \"On the other hand, when the subject moves to indoor or into the shade, the low UV intensity measured by the UV sensor can indeed correctly reflects the actual UV intensity irradiating on the user's body surface.\",\n \"This section describes a system and method to determine if the user is in a shaded condition or an unshaded condition, and correct the unreliable UV measurement in a UV dosimetry system based on signal processing of the sensor measured data if the user is in an unshaded condition.\",\n \"When the UV sensor measured UV intensity is low, there can be two possibilities, and correspondingly different approaches need to be applied for these two conditions: (1) User is in a shaded condition (e.g., user stays indoor or in the shade).\",\n \"In this case, the UV sensor measured UV intensity can correctly reflect the actual UV intensity irradiated on user's body surface.\",\n \"Thus data correction may not be needed, and the UV sensor measured UV intensity can be directly used for calculating the UV dose received by the user.\",\n \"(2) User is in an unshaded condition (e.g., user is under direct sunlight exposure) but the UV sensor is not directly facing the sunlight or is temporarily covered by the shade due to posture change and/or movement.\",\n \"In this case, the UV sensor measured UV intensity can underestimate the actual UV intensity irradiated on user's body surface.\",\n \"Thus, data correction can be needed to correct the unreliably measured UV intensity data.\",\n \"As described herein, the term “shaded condition” refers to a condition that a user of the UV dosimetry system, as well as the UV dosimetry system itself, are generally shielded from the UV source (e.g., sun or tanning lamp).\",\n \"For example, when a user of the UV dosimetry system stays indoor or under a shade, the user as well as the UV dosimetry system may receive little or no UV radiation from the sun.\",\n \"The term “unshaded condition” refers to a condition that a user of the UV dosimetry system is at least partially exposed to a UV source (e.g., sun or tanning lamp), but the UV dosimetry system itself can be temporarily shielded from the UV source.\",\n \"For example, when a user of the UV dosimetry system stays outdoor, the user can be exposed to UV radiation from the sun but the UV dosimetry system can be temporarily shielded from the UV radiation due to posture change and/or body movement of the user.\",\n \"Therefore, it is important to determine if a measured low UV intensity is caused by the environment (e.g., in shaded condition, thus data correction may not be needed) or by unreliable UV sensor reading (e.g., in unshaded condition, thus data correction can be needed).\",\n \"To distinguish these two conditions, a shade detector can be used.\",\n \"One exemplary, though non-exclusive shade detector can be implemented by integrating a temperature sensor together with the UV sensor, and the UV dosimetry system can be configured to use the ambient temperature measured by the temperature sensor to differentiate between shaded condition and unshaded condition, and control the processing of UV measurement data as describe more fully below.\",\n \"FIG.\",\n \"8 schematically illustrates correcting measured UV intensity data based on the measurement of ambient temperature.\",\n \"As shown in this example, at time t951, the user changes from a first unshaded condition 951 to a first shaded condition 952.At time t952, the user changes from the first shaded condition 952 to a second unshaded condition 953.Then at time t952, the user changes from the second unshaded condition 953 to a second shaded condition 954.Similarly, at time t954, the user changes from the second shaded condition 954 to a third unshaded condition 955.According to some embodiments, the UV dosimeter system can determine if a user of the system is in shaded condition or unshaded condition based on, at least partially, analyzing the measured UV intensity data and temperature data.\",\n \"As illustrated in FIG.\",\n \"8, the ambient temperature measured in shaded conditions (e.g., 952, 954) significantly deviates from the ambient temperature measured in unshaded conditions (e.g., 951, 953, 955).\",\n \"Thus, significant deviation of measured ambient temperature (e.g., at t951, t952, t953 and t954) can indicate a change of user's environment.\",\n \"According to some embodiments, if significant deviation of measured ambient temperature is accompanied by a low UV intensity measurement (e.g., low UV intensity 961 is measured at or immediately after t951), then it can be determined that the user changes to a shaded condition.\",\n \"Similarly, if significant deviation of measured ambient temperature is accompanied by a high UV intensity measurement (e.g., high UV intensity 963 is measured at or immediately after t952), then it can be determined that the user changes to an unshaded condition.\",\n \"According to some embodiments, after detecting the user's change to a shaded condition (e.g., at t951), the user can be determined to remain in the shaded condition (e.g., 952) until the detection of user's change to an unshaded condition (e.g., at t952) Similarly, after detecting the user's change to an unshaded condition (e.g., at t952), the user can be determined to remain in the unshaded condition (e.g., 953) until the detection of user's change to a shaded condition (e.g., at t953).\",\n \"In certain embodiments, a low UV intensity (e.g., 961) can be detected if the measured UV intensity is below a predefined low UV intensity threshold, or if the measured UV intensity decreases by more than a predefined percentage of a reference value, wherein the reference value can be an average, median, or max of the most recent UV intensity data measured over a predefined period of time (e.g., 60 seconds).\",\n \"Similarly, a high UV intensity (e.g., 963) can be detected if the measured UV intensity is higher than a predefined high UV intensity threshold, or if the measured UV intensity increases by more than a predefined percentage of an average, median, or max of the most recent UV intensity data measured over a predefined period of time (e.g., 60 seconds).\",\n \"Thus, if a low UV intensity is measured in the shaded condition (e.g., 952, 954), UV intensity data correction may not be needed, as the measured UV intensity can actually reflect the UV intensity irradiating on the user.\",\n \"On the other hand, if a low UV intensity (e.g., 962) is measured in unshaded condition (e.g., 951), then the low UV intensity can be caused by unreliable UV sensor measurement.\",\n \"In this scenario, corrected UV intensity data can be generated by extrapolating the measured UV intensity data, as described more fully below.\",\n \"Corrected UV intensity data can be used to calculate the UV dose and related measures (e.g., Vitamin D production, etc.).\",\n \"In some embodiments, the temperature sensor can be adjacent to the UV sensor and is located inside the wearable unit, which can send the measured temperature data to the mobile computing unit for processing.\",\n \"Alternatively, the temperature sensor can be integrated in the mobile computing unit (e.g., a smartphone), which can directly process the temperature data measured by the integrated temperature sensor.\",\n \"In some other embodiments, temperature sensors can be present in both the wearable unit and the mobile computing unit.\",\n \"In this case, the mobile computing unit can use temperature data measured by the temperature sensor that is physically closer to the UV sensor (e.g., the temperature sensor that is adjacent to the UV sensor and is located inside the wearable unit) for data processing.\",\n \"The temperature sensor can continuously measure the local ambient temperature.\",\n \"It can keep a buffer of most recently measured temperature data wherein the buffer length can correspond to a predefined duration (e.g.\",\n \"60 seconds).\",\n \"The UV dosimetry system can calculate and maintain the average temperature (avg_T) and/or median temperature (med_T) within the data buffer.\",\n \"Similarly, the UV dosimetry system can also calculate the standard deviation of temperature (STD_T), and/or median absolute deviation of temperature (MAD_T), and/or average absolute deviation of temperature (AAD_T) within the data buffer.\",\n \"Here, for a plurality of temperature measurement data samples T1, T2, .\",\n \".\",\n \".\",\n \", Tn, the MAD_T can be calculated as the median of the absolute deviations from the temperature data's median, i.e., MAD_T=median (|Ti−median (Ti)|), where i=1, 2, .\",\n \".\",\n \".\",\n \", n. The AAD_T can be calculated as the mean of the absolute deviations from the temperature data's mean, i.e., AAD_T=mean (|Ti−mean (Ti)|), where i=1, 2, .\",\n \".\",\n \".\",\n \", n. The UV dosimetry system can continuously compare the newly acquired temperature data (new_T) with the calculated average temperature (avg_T) and/or median temperature (med_T) of the most recent data stored in the data buffer, to determine if the newly acquired temperature data (new_T) is consistent with (comparable to), or significantly deviates from the trend of the recent temperature measurement.\",\n \"In certain embodiments, the trend of the recent temperature measurement can be represented by the average temperature (avg_T).\",\n \"In some other embodiments, the trend of the recent temperature measurement can be represented by the medial temperature (med_T).\",\n \"If the newly acquired temperate data (new_T) significantly deviates from the trend of the recent temperature measurement, then it can imply the user moves to a new environment that has a different ambient temperature than previously stayed environment.\",\n \"For example, new_T can be significantly higher than avg_T (or med_T) when the UV dosimetry system is brought from a cold outdoor environment to a warmer indoor environment, or new_T can be significantly lower than avg_T (or med_T) when the UV dosimetry system is brought from a hot outdoor environment to a cooler indoor environment.\",\n \"Thus, if the corresponding UV intensity data measured by the UV sensor is low, the underlying cause can be caused by environmental change (e.g.\",\n \"user changes to a shaded condition).\",\n \"On the other hand, if the newly acquired temperate data (new_T) is comparable to the trend of the recent temperature measurement, then it can imply the user stays in the same environment.\",\n \"Thus, if the corresponding UV intensity data measured by the UV sensor is low, the underlying cause can be caused by an orientation change of the UV sensor with respect to the sunlight or temporary shading caused by body movement while the user is in an unshaded condition.\",\n \"A variety of measures can be used to determine if the newly acquired temperate data (new_T) is comparable to or significantly different from the trend of the recent temperature measurement.\",\n \"For example, new_T can be determined to be significantly different from avg_T or med_T if their respective absolute difference, |new_T−avg_T| or |new_T−med_T| is greater than a predefined temperature threshold (e.g., 0.1 degree in Celsius scale, 0.5 degree in Fahrenheit, etc.\",\n \"), otherwise new_T can be considered to be comparable to avg_T or med_T.\",\n \"In another example, new_T can be determined to be significantly different from avg_T or med_T if their respective absolute difference is greater than a predefined percentage (e.g., 1%) of avg_T or med_T, otherwise new_T can be considered to be comparable to avg_T or med_T.\",\n \"Yet in a further example, new_T can be determined to be significantly different from avg_T if the absolute difference |new_T−avg_T| is greater than the standard deviation of temperature (STD_T) multiplied by a predefined factor (e.g., 2), or new_T can be determined to be significantly different from avg_T if the absolute difference |new_T−avg_T| is greater than the average absolute deviation (AAD_T) multiplied by a predefined factor (e.g., 1.5).\",\n \"Otherwise, new_T can be considered to be comparable to avg_T.\",\n \"Alternatively, new_T can be determined to be significantly different from med_T if the absolute difference |new_T−med_T| is greater than the median absolute deviation of temperature (MAD_T) multiplied by a predefined factor (e.g., 1.5).\",\n \"Otherwise, new_T can be considered to be comparable to med_T.\",\n \"It shall be understood that the measures described above are meant to illustrate the general principles taught in this disclosure, thus they shall not be considered to be limiting.\",\n \"Other measures of data dispersion that are known to the art can also be applied, within the scope of this disclosure, to determine if the newly acquired temperature data (new_T) is comparable to, or deviate from the trend of the recent temperature measurement.\",\n \"If the newly acquired temperature data is determined to be comparable to or consistent with the trend of the recent temperature measurement, then the UV dosimetry system can be considered to remain in the same environment.\",\n \"Otherwise, if the newly acquired temperature data is determined to deviate from the trend of the recent temperature measurement, then the UV dosimetry system can be considered to be moved to a different environment.\",\n \"Therefore, data correction may not be needed if the low UV intensity measured by the UV sensor can be determined to be caused by a user's change of environment, e.g., when the user changes to a shaded condition.\",\n \"Otherwise, if the user is in an unshaded condition, the low UV intensity measured by the UV sensor can be due to oblique angle of the UV sensor with respect to the sunlight or temporary coverage by the body shade of the user.\",\n \"Thus, proper data correction can be performed by extrapolating measured UV data as described below.\",\n \"The UV sensor embedded in the UV dosimetry system can generate real time output of UV intensity.\",\n \"To estimate the actual UV intensity irradiated on the subject, the UV intensity measured by the UV sensor can be extrapolated by means of statistical analysis of the data, based on two basic assumptions: (1) The actual UV intensity received by the subject is quasi-static, that is, the rate of change of UV intensity irradiated on the subject is slow over a short duration.\",\n \"(2) When the subject is exposed to the sunlight, the wearable UV sensor will have proper alignment with the solar irradiance at least for a very brief period of time during the short duration when actual UV intensity is stable.\",\n \"Therefore, although the wearable UV sensor may often measure lower than actual UV intensity due to the changing body position and/or shade coverage, as long as the user is non-stationary so that the sensor can have good alignment with the sunlight from time to time, even if briefly, the device may have correct or nearly correct measurement of the actual UV intensity.\",\n \"On the other hand, it is important to note that even though the sensor measured UV intensity is below the actual value, the underestimation may be limited since it is likely that not all exposed body surface is normal to the sunlight.\",\n \"In other words, part of the exposed body surface may indeed receive less UV exposure due to its non-normal orientation and/or shade coverage.\",\n \"Based on the above assumptions, the actual UV intensity irradiated on the subject over a short period of time can be extrapolated based on the limited numbers of correct measurement of UV intensity obtained during that short time window.\",\n \"The extrapolation method is described below with reference to FIG.\",\n \"6.Assume the device measures M samples of UV intensity values over a short time window T (e.g.\",\n \"T=60 s, corresponding to M=60 for a sampling frequency of 1 Hz).\",\n \"Data extrapolation performed in this time window (as described below) will be repeated for the next time window, which can be overlapping or non-overlapping with the current time window.\",\n \"A programmable UV intensity threshold TH (e.g.\",\n \"0.5 UVI, or 12.5 mW/m2) defines the boundary above which the measured UV intensity is likely more representative of the actual value whereas below which the sensor output is likely an underestimate of the true UV intensity.\",\n \"Further denote the maximal UV intensity value among the M samples is UVMAX, which is assumed to be obtained when the sensor is best aligned with the solar irradiance during the short time window T. Also, when the device comprises multiple UV sensors that measure the UV intensity at different angles, the UVMAX can be taken as the maximum UV intensity value measured by all UV sensors during the short time window.\",\n \"The device counts the number of samples (G) in the short window T that have measured UV intensity greater or equal to the threshold TH.\",\n \"Higher count of G indicates higher probability and confidence that the measured ≥TH values reflect the true UV intensity whereas smaller G implies vice versa.\",\n \"The count G is compared to another predefined thresholds C (e.g.\",\n \"C=8 for M=60).\",\n \"If the count G is greater than 0 (i.e.\",\n \"at least one sample of measured UV intensity is above TH), then the extrapolated UV intensity of all M samples in the short time window T is set to MIN(G,C)/C×UVMAX where MIN( ) is the function that returns the minimum value.\",\n \"In other words, the extrapolated UV intensity of all M samples is set to UVMAX if G≥C.\",\n \"If 1t1).\",\n \"Further denote dt the duration between t1 and t2 that contributes to SET, which is the time period between t1 and t2 when UVI is greater than or equal to UVILT.\",\n \"Based on the values of UVI1 and UVI2, dt can be calculated according to different conditions: (1) dt=0 if both UVI1 and UVI2 are less than UVILT (i.e.\",\n \"no sun exposure between t1 and t2); (2) dt=t2-t1 if both UVI1 and UVI2 are greater than or equal to UVILT (i.e.\",\n \"continuous sun exposure between t1 and t2); (3) dt is calculated as a fraction of the duration between t1 and t2 based on linear interpolation if UVI1 is below while UVI2 is above UVILT, or if UVI2 is below while UVI1 is above UVILT.\",\n \"Yet in a simpler version, the calculation of dt in condition (3) above can be approximated as (t2−t1)/2.This is appropriate when sampling interval is sufficiently small.\",\n \"During normal operation, the device resets SET to zero at midnight, and accumulates dt into SET anytime when device measured UVI is greater than or equal to UVILT until the end of the day.\",\n \"Typically, the device measures the UV intensity and converts it to UVI at the sampling interval.\",\n \"However, the time gap between two consecutive measurements may be greater than the sampling interval in case of missed data, e.g.\",\n \"due to data loss during wireless transmission or rejection of invalid data due to measurement noise.\",\n \"When the time gap is greater than a predefined threshold Δ, the UVI may be assumed to be zero within the time gap.\",\n \"Alternatively, the UVI can be assumed to remain the same as the last valid sample.\",\n \"Yet another alternative is to assume the UVI gradually decrease from the last valid sample to zero in a linear or nonlinear fashion.\",\n \"Method to Predict Optimal Sun Exposure Time While it is helpful for a person to obtain instant feedback on received UV dose and cutaneous vitamin D production, and use such information as a guidance to optimize sun exposure, more benefits can be gained if the person can plan ahead for optimal sun experience.\",\n \"This section describes a method for predicting the effects of sun exposure to the user in the next few days in a UV dosimetry system.\",\n \"According to a preferred embodiment of this invention, the UV dosimetry system retrieves forecasted UVI data for the next few days corresponding to the user's location from trusted sources or official websites, e.g., www.epa.gov, www.weather.gov, etc.\",\n \"The user's location can be automatically determined via GPS integrated in the mobile computing device of the UV dosimetry system.\",\n \"In addition, the user's location can be specified by the user through the input interface of the UV dosimetry system.\",\n \"This is helpful if the user plans to travel to a different location and wants to predict the effects of sun exposure at the new location.\",\n \"The forecasted UVI data often has limited temporal and spatial resolution.\",\n \"For example, the forecasted UVI data is often presented hourly, and it is only presented for selected cities and/or areas associated with certain zip codes.\",\n \"To overcome this challenge, linear or nonlinear (e.g.\",\n \"spline) interpolation can be used to obtain forecasted UVI data at specific time and location with higher resolution.\",\n \"For example, FIG.\",\n \"7 illustrates the concept of temporal interpolation of UVI data.\",\n \"In this example, the forecast 24-hour UVI data is available for a specific location.\",\n \"While the forecast data is only available hourly (labelled in circles), the UVI or UV intensity at any given time of day 915 (labelled in a triangle) can be interpolated between UVI values of adjacent time points 910 and 920.Since 1 UVI corresponds to UV intensity of 25 mW/m2, the interpolated UV intensity (which can be expressed in continuous values) is preferred than interpolated UVI (which can only be expressed in discrete values).\",\n \"For spatial interpolation of UVI, a geographic map can be generated with a specified latitude-longitude grid which has a high spatial resolution.\",\n \"The UVI at a specific target location without forecast data can be interpolated from neighboring grid points that have forecast UVI data available.\",\n \"Therefore, the UV dosimetry system can predict UV intensity at specific location and given time of day by means of interpolation of the forecast UVI data.\",\n \"According to one embodiment of this invention, the UV dosimetry system estimates the user received UV dose and generated vitamin D in the near future (e.g.\",\n \"next day) based on the predicted UV intensity data for a plural of hypothetical UV exposure scenarios.\",\n \"Each hypothetical UV exposure scenario corresponds to a combination of start time and duration of UV exposure, and the corresponding user characteristics such as the clothing coverage, sunscreen usage, and wearing location of the UV sensing unit.\",\n \"These hypothetical scenarios can be predefined by the user, or can be edited by the user through the user interface of the portable computing device.\",\n \"For example, the user can predefine the scenarios based on his/her past habit or routine of UV exposure, or add/delete/modify the scenarios arbitrarily, e.g.\",\n \"20 minutes sun exposure starting at 9 am, 10 minutes sun exposure starting at 10 am plus 5 minutes exposure starting at 12 noon, etc.\",\n \"The user characteristics (e.g.\",\n \"clothing coverage, sunscreen usage, and wearing location) associated with each episode of UV exposure can be predefined or edited by the user.\",\n \"Therefore, for each of the hypothetical UV exposure scenarios, the UV dosimetry system can estimate the corresponding UV dose received by the user and vitamin D production.\",\n \"The method of calculating the accumulated UV dose is described above in the section titled “Calculation of Safe Sun Exposure Time”, and the method of calculating vitamin D production is described above in the section titled “Calculation of Cutaneous Vitamin D Synthesis.” Based on the estimated UV dose and vitamin D production, the UV dosimetry system can evaluate the composite metric UVES and/or UVBI for each of the hypothetical UV exposure scenarios as described above in the section titled “Optimal Balance of UV Exposure”.\",\n \"Consequently, the UV dosimetry system can provide the user a ranked list of hypothetical UV exposure scenarios based on the calculated composite metric UVES and/or UVBI, such that the scenario ranked high on the list is more preferred (i.e.\",\n \"more balanced with respect to the risk of sun burn and benefit of vitamin D production) than the scenario ranked low on the list, and the user can use such a ranked list as a guide to plan ahead for future sun exposure.\",\n \"According to another embodiment of this invention, the UV dosimetry system can estimate the safe sun exposure time, the amount of vitamin D generated during the safe sun exposure time, and the duration of sun exposure needed to reach user-defined daily goal of vitamin D production, for a plural of hypothetical UV exposure scenarios.\",\n \"Different from the embodiment described above, each hypothetical UV exposure scenario corresponds to a start time of UV exposure, and the corresponding user characteristics (e.g.\",\n \"clothing coverage, sunscreen usage, and wearing location of the UV sensing unit), but the duration of UV exposure is not defined.\",\n \"Similarly, these hypothetical scenarios can be predefined by the user, or can be edited by the user through the user interface of the portable computing device.\",\n \"For each of the hypothetical UV exposure scenarios, the UV dosimetry system estimates the safe sun exposure time (e.g.\",\n \"time to sun burn), the amount of vitamin D generated during the safe sun exposure time, and the duration of sun exposure needed to reach user-defined daily goal of vitamin D production.\",\n \"For example, the UV dosimetry system may estimate for one scenario, the user will have 20 minutes safe sun exposure time, generate 800 IU of vitamin D during that period, and need only 10 minutes of sun exposure to reach the user-defined daily goal of 400 IU vitamin D. Thus the user can plan to enjoy the sun exposure, knowing he/she will get enough vitamin D before having the risk of sunburn in this scenario.\",\n \"In another scenario, the UV dosimetry system may estimate that the user will have only 10 minutes of safe sun exposure time, generate 500 IU of vitamin D during that period, and will need 25 minutes of sun exposure to reach the user-defined daily goal of 1000 IU vitamin D. Thus the user can plan to limit the sun exposure time and take vitamin D supplement for this scenario.\",\n \"Similarly, the method of calculating the safe sun exposure time is described above in the section titled “Calculation of Safe Sun Exposure Time”, and the method of calculating vitamin D production is described above in the section titled “Calculation of Cutaneous Vitamin D Synthesis.” Method for Crowd Sourcing of UVI Data According to this invention, UVI at various geographical locations is measured and updated in real-time by a large number of UV measurement devices, or UV meters, by means of crowd sourcing method.\",\n \"People who are using UV meters such as the disclosed UV dosimetry system, are encouraged to provide the real-time UVI data together with the time (e.g.\",\n \"using the build-in clock of the mobile device) and location information (e.g.\",\n \"via GPS embedded in the mobile computing device) through the wireless network to a remote server, for example, in exchange for a credit or discount coupon to be used toward certain products or services.\",\n \"Users who opt to provide data can be anonymous to protect their identities.\",\n \"The remote server maintains a database containing the data transmitted from the UV meters.\",\n \"A user “pushes” the measured data (UVI, time, location) to the remote server in triggered mode, automatic mode, or mixed mode.\",\n \"In triggered mode, the user initiates the data transmission by sending a command through the user input interface of the mobile computing unit to instruct the mobile application start the communication session.\",\n \"In automatic mode, the mobile application is configured to exchange data with the remote server on periodic basis, e.g.\",\n \"at programmed time of the day or at programmed time intervals.\",\n \"In mixed mode, both manual triggered and automatic data transmission are supported.\",\n \"Frequency of the data transmission can be limited (e.g.\",\n \"not more than 1 time per X minutes, where X is a programmable parameter that defines the shortest duration between two consecutive data transmissions) to prevent repeated transmission of the same UVI data.\",\n \"In one embodiment, the UV dosimetry system also has a build-in temperature sensing unit such as a temperature sensor, and the measured temperature data is also sent to the remote server, together with the measured UVI data and the time and location information of the measurement.\",\n \"The remote server runs a database management software operative to analyze the data transmitted from the UV meters including UVI, time, location, and/or temperature measurement, and generates UVI maps for other users to use.\",\n \"The UVI maps are preferably updated periodically according to a predefined time interval.\",\n \"According to this disclosure, the remote server maintains a database that aggregates the data transmitted from the UV measurement devices.\",\n \"The database management software controls the quality of the data collection through a plurality of filters with programmable parameter settings.\",\n \"Quality control of crowd sourced data is important because invalid UVI measurements may be inadvertently sent by the users.\",\n \"For example, a person staying indoors or under the shade may not measure the actual UVI in the local area accurately.\",\n \"Such misleading UVI data shall be excluded from the database.\",\n \"In one exemplary embodiment, the database management software in the remote server retrieves forecasted UVI data and/or temperature data at different time and geographical locations from trusted sources or official websites, e.g., www.epa.gov, www.weather.gov, etc.\",\n \"User transmitted UVI measurement and/or temperature measurement data are compared with the forecast data at the corresponding time and location.\",\n \"Here, the corresponding time means that the difference between the time of the forecast data and the time of the UVI and/or temperature measurement is below a predefined time limit, e.g.\",\n \"10 minutes, and the corresponding location means the distance between the location of the forecast data and the location of the UVI and/or temperature measurement is shorter than a predefined distance limit, e.g.\",\n \"1 mile.\",\n \"User transmitted measurement data is deemed invalid if there is substantial deviation between measured data and the corresponding forecast data, e.g.\",\n \"if they differ by more than a predefined tolerance value.\",\n \"In another exemplary embodiment, the official forecast data is only used as a reference to reject invalid measurement data when the sample size of the measurement data at specific time period and location is limited.\",\n \"As more user transmitted measurement data at specific time period and location is available and included in the database, the weight of using official forecast data as a reference is reduced.\",\n \"Meanwhile, more weight is given to the user transmitted data, which can self-serve as the reference to reject invalid user input.\",\n \"For example, when the sample size of UVI and/or temperature data measured during a specific time period and from a specific location is sufficiently large (e.g.\",\n \"greater than a predefined threshold), the expected normal range of UVI and/or temperature at said specific time period and location can be calculated based on the statistical distribution of the measured UVI and/or temperature data (e.g.\",\n \"the mean and standard deviation, or the median and inter-quartile range).\",\n \"Outlier measurement data falling outside the expected normal range will then be deemed invalid.\",\n \"For the UVI (or temperature) data at specific time and specific location, the sample size is defined as the total number of UVI (or temperature) data measured during a time period that is close to said specific time (e.g.\",\n \"within a predefined time interval), and from a region that is centered around said location (e.g.\",\n \"within a predefined distance).\",\n \"Through crowd sourcing, the UVI data is updated in the remote server database in real-time, and the UVI map can be updated periodically according to a predefined frequency.\",\n \"As more users contribute to the database, the reliability and accuracy of the data increases.\",\n \"The coverage of the UVI data on the map can be as broad as the users can go and the spatial resolution can be as fine as the GPS allows.\",\n \"It also allows people who do not have a UV measurement device to obtain real-time UVI information by accessing the crowd sourced UVI database through a communication network, such as the internet.\",\n \"While the invention has been described with reference to exemplary embodiments, it shall be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.\",\n \"In addition, many modifications may be made to adapt a particular situation or component to the teachings of the invention without departing from its scope.\",\n \"Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims, wherein reference to an element in the singular, such as by use of the article “a” or “an” is not intended to mean “one and only one” unless specifically so stated, but rather “one or more”.\",\n \"All patent and non-patent literature cited herein is hereby incorporated by references in its entirety for all purposes.\",\n \"As used herein, “and/or” means “and” or “or”, as well as “and” and “or.” Moreover, any and all patent and non-patent literature cited herein is hereby incorporated by references in its entirety for all purposes.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870856"}}},{"rowIdx":4493662,"cells":{"text":{"kind":"list like","value":[["ROBOT SECURITY INSPECTION METHOD BASED ON ENVIRONMENT MAP AND ROBOT THEREOF","The present disclosure provides a robot security inspection method based on an environment map and a robot thereof.","The method includes: establishing a two-dimensional planar map of an entire monitored region, planning a monitoring route, determining the position of the robot at the current monitored region, and moving to perform inspection according to the planed monitoring route.","With the robot security inspection method based on an environment map and the robot thereof according to the present disclosure, traversing-based inspection may be performed according to the environment map, thereby preventing the dead space in the monitoring; dangerous factors may be proactively detected and security policy conformation may be conducted; the dangerous factors may be proactively tracked; and the robot is capable of normally operating even without auxiliary illumination at night."],["1.A robot security inspection method based on an environment map, comprising: S3: in a course where a robot inspects a monitored region according to a monitoring route, acquiring current depth data if a predetermined photographing time interval is reached; S4: determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position; S5: performing a corresponding operation according to the abnormal factor if the abnormal factor is present; or S6: continuing to inspect the monitored region according to the monitoring route if the abnormal factor is not present.","2.The robot security inspection method based on an environment map according to claim 1, wherein prior to step S3, the method further comprises: S1: upon receipt of a map establishment instruction, traversing, by the robot, the monitored region, and establishing the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and S2: planning the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.","3.The robot security inspection method based on an environment map according to claim 2, wherein step S1 comprises the following steps: S11: upon receipt of the map establishment instruction, traversing, by the robot, the monitored region, and acquiring the depth data of each obstacle in the monitored region during the traversing; S12: projecting the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and S13: establishing the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.","4.The robot security inspection method based on an environment map according to claim 1, wherein: step S4 comprises the following steps: S41: judging whether there is an obstacle not marked in the two-dimensional planar map, considering that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or considering that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and step S5 comprises the following steps: S510: if there is an obstacle not marked, marking the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, and updating the two-dimensional planar map; and S511: updating the monitoring route according to the current position and the updated two-dimensional planar map, and inspecting the monitored region according to the updated monitoring route.","5.The robot security inspection method based on an environment map according to claim 1, wherein step S4 comprises the following steps: S42: judging whether human skeleton data is identified, considering that the abnormal factor is present if the human skeleton data is identified, or considering that the abnormal factor is not present if the human skeleton data is not identified; and step S5 comprises the following steps: S520: moving towards a living body corresponding to the human skeleton data if the human skeleton data is identified; S521: acquiring a current facial feature of the living body; S522: matching the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired; S523: considering that the abnormal factor is not present if the matching is successful; and S524: performing a tracking operation for the living body and generating alarm information if the matching is unsuccessful.","6.The robot security inspection method based on an environment map according to claim 5, wherein following step S521, the method further comprises: S525: acquiring password information from the living body if the current facial feature of the living body is not successfully acquired; S526: matching the acquired password information with predetermined password information in a predetermined password database; S523: considering that the abnormal factor is not present if the matching is successful; and S524: performing the tracking operation for the living body and generating the alarm information if the matching is unsuccessful.","7.The robot security inspection method based on an environment map according to claim 1, further comprising: S7: in the course where the robot inspects the monitored region according to the monitoring route, acquiring a current smoke concentration value if a predetermined detection time interval is reached; S8: judging whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; S9: generating alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold; or S10: continuing to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.","8.A robot, comprising: a data acquiring module, configured to, in a course where a robot inspects a monitored region according to a monitoring route, acquire current depth data if a predetermined photographing time interval is reached; a judging module, configured to determine, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judge whether an abnormal factor is present at the current position; and an executing module, configured to perform a corresponding operation according to the abnormal factor if the abnormal factor is present, or continue to inspect the monitored region according to the monitoring route if the abnormal factor is not present.","9.The robot according to claim 8, wherein the executing module comprises: a map establishing submodule, configured to, upon receipt of a map establishment instruction, traverse the monitored region, and establish the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and a route planning submodule, configured to plan the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.","10.The robot according to claim 9, wherein: the data acquiring module is further configured to, upon receipt of the map establishment instruction, traverse the monitored region and acquire the depth data of each obstacle in the monitored region during the traversing; and the map establishing submodule is further configured to project the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and establish the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.","11.The robot according to claim 8, wherein the judging module is further configured to judge whether there is an obstacle not marked in the two-dimensional planar map, consider that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or consider that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and the executing module is further configured to, if there is an obstacle not marked, mark the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, update the two-dimensional planar map, update the monitoring route according to the current position and the updated two-dimensional planar map, and inspect the monitored region according to the updated monitoring route.","12.The robot according to claim 8, wherein the judging module is further configured to judge whether human skeleton data is identified, consider that the abnormal factor is present if the human skeleton data is identified, or consider that the abnormal factor is not present if the human skeleton data is not identified; and the executing module is further configured to move towards a living body corresponding to the human skeleton data if the human skeleton data is identified; acquire a current facial feature of the living body; and match the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired, consider that the abnormal factor is not present if the matching is successful, perform a tracking operation for the living body and generating alarm information if the matching is unsuccessful.","13.The robot according to claim 12, wherein the executing module is further configured to: acquire password information from the living body if the current facial feature of the living body is not successfully acquired; and match the acquired password information with predetermined password information in a predetermined password database, consider that the abnormal factor is not present if the matching is successful, and perform the tracking operation for the living body and generate the alarm information if the matching is unsuccessful.","14.The robot according to claim 8, further comprising: a smoke detecting module, configured to, in the course where the robot inspects the monitored region according to the monitoring route, acquire a current smoke concentration value if a predetermined detection time interval is reached; wherein the judging module is further configured to judge whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; and wherein the executing module is further configured to generate alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold, or continue to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold."],[" BACKGROUND At present, the passive video monitoring method is mostly used in the security monitoring field.","Generally, a camera is mounted at a specific monitoring spot, images at the monitoring spots are displayed in a centralized manner in a specific region, and insecure factors are checked by manual reviewing images photographed by all the cameras.","This method has many defects: 1) the monitored images need to be manually checked constantly, and thus visual fatigue may cause misjudgment of the insecure factors.","2) The visual angle of the camera is relatively fixed and large-range movements may not be implemented; if a large-scale scenario needs to be monitored, a lot of cameras need to be deployed, and monitoring dead space is may be caused.","3) In case of detecting insecure factors, active tracking may not be practiced in the video monitoring mode.","4) The monitoring cameras are mostly RGB cameras and do not have the night vision function, and thus night monitoring capabilities are greatly lowered, and auxiliary illumination is generally needed, thereby causing many adverse impacts."],[" SUMMARY The technical problem to be solved by the present disclosure is to provide a robot security inspection method based on an environment map and a robot thereof.","With the method and the robot, active uninterrupted monitoring is implemented, and active tracking of insecure is practiced.","To achieve the above objectives, the present disclosure provides a robot security inspection method based on an environment map.","The method includes: S 3 : in a course where a robot inspects a monitored region according to a monitoring route, acquiring current depth data if a predetermined photographing time interval is reached; S 4 : determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position; S 5 : performing a corresponding operation according to the abnormal factor if the abnormal factor is present; or S 6 : continuing to inspect the monitored region according to the monitoring route if the abnormal factor is not present.","Further, prior to step S 3 , the method further includes: S 1 : upon receipt of a map establishment instruction, traversing, by the robot, the monitored region, and establishing the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and S 2 : planning the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.","Further, step S 1 specifically includes the following steps: S 11 : upon receipt of the map establishment instruction, traversing, by the robot, the monitored region, and acquiring the depth data of each obstacle in the monitored region during the traversing; S 12 : projecting the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and S 13 : establishing the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.","Further, step S 4 of determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position includes the following steps: S 41 : judging whether there is an obstacle not marked in the two-dimensional planar map, considering that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or considering that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and step S 5 includes the following steps: S 510 : if there is an obstacle not marked, marking the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, and updating the two-dimensional planar map; and S 511 : updating the monitoring route according to the current position and the updated two-dimensional planar map, and inspecting the monitored region according to the updated monitoring route.","Further, step S 4 of determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position includes the following steps: S 42 : judging whether human skeleton data is identified, considering that the abnormal factor is present if the human skeleton data is identified, or considering that the abnormal factor is not present if the human skeleton data is not identified; and step S 5 includes the following steps: S 520 : moving towards a living body corresponding to the human skeleton data if the human skeleton data is identified; S 521 : acquiring a current facial feature of the living body; S 522 : matching the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired; S 523 : considering that the abnormal factor is not present if the matching is successful; and S 524 : performing a tracking operation for the living body and generating alarm information if the matching is unsuccessful.","Further, following step S 521 , the method further includes: S 525 : acquiring password information from the living body if the current facial feature of the living body is not successfully acquired; S 526 : matching the acquired password information with predetermined password information in a predetermined password database; S 523 : considering that the abnormal factor is not present if the matching is successful; and S 524 : performing the tracking operation for the living body and generating the alarm information if the matching is unsuccessful.","Further, the method further includes: S 7 : in the course where the robot inspects the monitored region according to the monitoring route, acquiring a current smoke concentration value if a predetermined detection time interval is reached; S 8 : judging whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; S 9 : generating alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold; or S 10 : continuing to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.","The present disclosure further provides a robot.","The robot includes: a data acquiring module, configured to: in a course where a robot inspects a monitored region according to a monitoring route, acquire current depth data if a predetermined photographing time interval is reached; a judging module, configured to: determine, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judge whether an abnormal factor is present at the current position; and an executing module, configured to: perform a corresponding operation according to the abnormal factor if the abnormal factor is present, or continue to inspect the monitored region according to the monitoring route if the abnormal factor is not present.","Further, the executing module includes: a map establishing submodule, configured to, upon receipt of a map establishment instruction, traverse the monitored region, and establish the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and a route planning submodule, configured to plan the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.","Further, the data acquiring module is further configured to, upon receipt of the map establishment instruction, traverse the monitored region and acquire the depth data of each obstacle in the monitored region during the traversing; and the map establishing submodule is further configured to project the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and establish the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.","Further, the judging module is further configured to: judge whether there is an obstacle not marked in the two-dimensional planar map, consider that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or consider that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and the executing module is further configured to, if there is an obstacle not marked, mark the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, update the two-dimensional planar map, update the monitoring route according to the current position and the updated two-dimensional planar map, and inspect the monitored region according to the updated monitoring route.","Further, the judging module is further configured to: judge whether human skeleton data is identified, consider that the abnormal factor is present if the human skeleton data is identified, or consider that the abnormal factor is not present if the human skeleton data is not identified; and the executing module is further configured to: move towards a living body corresponding to the human skeleton data if the human skeleton data is identified; acquire a current facial feature of the living body; and match the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired, consider that the abnormal factor is not present if the matching is successful, perform a tracking operation for the living body and generating alarm information if the matching is unsuccessful.","Further, the executing module is further configured to: acquire password information from the living body if the current facial feature of the living body is not successfully acquired; and match the acquired password information with predetermined password information in a predetermined password database, consider that the abnormal factor is not present if the matching is successful, and perform the tracking operation for the living body and generate the alarm information if the matching is unsuccessful.","Further, the robot further includes: a smoke detecting module, configured to, in the course where the robot inspects the monitored region according to the monitoring route, acquire a current smoke concentration value if a predetermined detection time interval is reached; wherein the judging module is further configured to judge whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; and wherein the executing module is further configured to: generate alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold, or continue to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.","With the robot security inspection method based on an environment map and the robot thereof according to the present disclosure, traversing-based inspection may be performed according to the environment map, thereby preventing the dead space in the monitoring; insecure factors may be proactively detected and security policy conformation may be conducted; the insecure factors may be proactively tracked; and the robot is capable of normally operating even without auxiliary illumination at night.","The method and the robot according to the present disclosure have a strong initiative, implement active defense against the insecure factors, and greatly improve effectiveness, timeliness and stability of secrete visits and inspections."],["CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation application of international patent application No.","PCT/CN2017/108725, filed on Oct. 31, 2017, which is based upon and claims priority of Chinese Patent Application No.","201611154363.6, filed before Chinese Patent Office on Dec. 14, 2016 and entitled “ROBOT SECURITY INSPECTION METHOD BASED ON ENVIRONMENT MAP AND ROBOT THEREOF”, the entire contents of which are incorporated herein by reference.","TECHNICAL FIELD The present disclosure relates to the technical field of security monitoring, and in particular, relates to a robot security inspection method based on an environment map and a robot thereof.","BACKGROUND At present, the passive video monitoring method is mostly used in the security monitoring field.","Generally, a camera is mounted at a specific monitoring spot, images at the monitoring spots are displayed in a centralized manner in a specific region, and insecure factors are checked by manual reviewing images photographed by all the cameras.","This method has many defects: 1) the monitored images need to be manually checked constantly, and thus visual fatigue may cause misjudgment of the insecure factors.","2) The visual angle of the camera is relatively fixed and large-range movements may not be implemented; if a large-scale scenario needs to be monitored, a lot of cameras need to be deployed, and monitoring dead space is may be caused.","3) In case of detecting insecure factors, active tracking may not be practiced in the video monitoring mode.","4) The monitoring cameras are mostly RGB cameras and do not have the night vision function, and thus night monitoring capabilities are greatly lowered, and auxiliary illumination is generally needed, thereby causing many adverse impacts.","SUMMARY The technical problem to be solved by the present disclosure is to provide a robot security inspection method based on an environment map and a robot thereof.","With the method and the robot, active uninterrupted monitoring is implemented, and active tracking of insecure is practiced.","To achieve the above objectives, the present disclosure provides a robot security inspection method based on an environment map.","The method includes: S3: in a course where a robot inspects a monitored region according to a monitoring route, acquiring current depth data if a predetermined photographing time interval is reached; S4: determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position; S5: performing a corresponding operation according to the abnormal factor if the abnormal factor is present; or S6: continuing to inspect the monitored region according to the monitoring route if the abnormal factor is not present.","Further, prior to step S3, the method further includes: S1: upon receipt of a map establishment instruction, traversing, by the robot, the monitored region, and establishing the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and S2: planning the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.","Further, step S1 specifically includes the following steps: S11: upon receipt of the map establishment instruction, traversing, by the robot, the monitored region, and acquiring the depth data of each obstacle in the monitored region during the traversing; S12: projecting the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and S13: establishing the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.","Further, step S4 of determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position includes the following steps: S41: judging whether there is an obstacle not marked in the two-dimensional planar map, considering that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or considering that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and step S5 includes the following steps: S510: if there is an obstacle not marked, marking the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, and updating the two-dimensional planar map; and S511: updating the monitoring route according to the current position and the updated two-dimensional planar map, and inspecting the monitored region according to the updated monitoring route.","Further, step S4 of determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position includes the following steps: S42: judging whether human skeleton data is identified, considering that the abnormal factor is present if the human skeleton data is identified, or considering that the abnormal factor is not present if the human skeleton data is not identified; and step S5 includes the following steps: S520: moving towards a living body corresponding to the human skeleton data if the human skeleton data is identified; S521: acquiring a current facial feature of the living body; S522: matching the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired; S523: considering that the abnormal factor is not present if the matching is successful; and S524: performing a tracking operation for the living body and generating alarm information if the matching is unsuccessful.","Further, following step S521, the method further includes: S525: acquiring password information from the living body if the current facial feature of the living body is not successfully acquired; S526: matching the acquired password information with predetermined password information in a predetermined password database; S523: considering that the abnormal factor is not present if the matching is successful; and S524: performing the tracking operation for the living body and generating the alarm information if the matching is unsuccessful.","Further, the method further includes: S7: in the course where the robot inspects the monitored region according to the monitoring route, acquiring a current smoke concentration value if a predetermined detection time interval is reached; S8: judging whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; S9: generating alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold; or S10: continuing to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.","The present disclosure further provides a robot.","The robot includes: a data acquiring module, configured to: in a course where a robot inspects a monitored region according to a monitoring route, acquire current depth data if a predetermined photographing time interval is reached; a judging module, configured to: determine, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judge whether an abnormal factor is present at the current position; and an executing module, configured to: perform a corresponding operation according to the abnormal factor if the abnormal factor is present, or continue to inspect the monitored region according to the monitoring route if the abnormal factor is not present.","Further, the executing module includes: a map establishing submodule, configured to, upon receipt of a map establishment instruction, traverse the monitored region, and establish the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and a route planning submodule, configured to plan the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.","Further, the data acquiring module is further configured to, upon receipt of the map establishment instruction, traverse the monitored region and acquire the depth data of each obstacle in the monitored region during the traversing; and the map establishing submodule is further configured to project the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and establish the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.","Further, the judging module is further configured to: judge whether there is an obstacle not marked in the two-dimensional planar map, consider that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or consider that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and the executing module is further configured to, if there is an obstacle not marked, mark the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, update the two-dimensional planar map, update the monitoring route according to the current position and the updated two-dimensional planar map, and inspect the monitored region according to the updated monitoring route.","Further, the judging module is further configured to: judge whether human skeleton data is identified, consider that the abnormal factor is present if the human skeleton data is identified, or consider that the abnormal factor is not present if the human skeleton data is not identified; and the executing module is further configured to: move towards a living body corresponding to the human skeleton data if the human skeleton data is identified; acquire a current facial feature of the living body; and match the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired, consider that the abnormal factor is not present if the matching is successful, perform a tracking operation for the living body and generating alarm information if the matching is unsuccessful.","Further, the executing module is further configured to: acquire password information from the living body if the current facial feature of the living body is not successfully acquired; and match the acquired password information with predetermined password information in a predetermined password database, consider that the abnormal factor is not present if the matching is successful, and perform the tracking operation for the living body and generate the alarm information if the matching is unsuccessful.","Further, the robot further includes: a smoke detecting module, configured to, in the course where the robot inspects the monitored region according to the monitoring route, acquire a current smoke concentration value if a predetermined detection time interval is reached; wherein the judging module is further configured to judge whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; and wherein the executing module is further configured to: generate alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold, or continue to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.","With the robot security inspection method based on an environment map and the robot thereof according to the present disclosure, traversing-based inspection may be performed according to the environment map, thereby preventing the dead space in the monitoring; insecure factors may be proactively detected and security policy conformation may be conducted; the insecure factors may be proactively tracked; and the robot is capable of normally operating even without auxiliary illumination at night.","The method and the robot according to the present disclosure have a strong initiative, implement active defense against the insecure factors, and greatly improve effectiveness, timeliness and stability of secrete visits and inspections.","BRIEF DESCRIPTION OF THE DRAWINGS FIG.","1 is a flowchart of a robot security inspection method based on an environment map according to an embodiment of the present disclosure; FIG.","2 is a schematic diagram of robot displacement in the security inspection method as illustrated in FIG.","1; FIG.","3 is a schematic diagram of human body identification according to an embodiment of the present disclosure; FIG.","4 is a schematic diagram of face recognition and voice identity authentication according to the present disclosure; FIG.","5 is a schematic structural diagram of a robot according to the present disclosure; FIG.","6 is a flowchart of a robot security inspection method based on an environment map according to an embodiment of the present disclosure; FIG.","7 is a partial flowchart of a robot security inspection method based on an environment map according to an embodiment of the present disclosure; FIG.","8 is a flowchart of a robot security inspection method based on an environment map according to another embodiment of the present disclosure; FIG.","9 is a partial flowchart of a robot security inspection method based on an environment map according to an embodiment of the present disclosure; FIG.","10 is a partial flowchart of a robot security inspection method based on an environment map according to an embodiment of the present disclosure; FIG.","11 is a schematic structural diagram of a robot according to an embodiment of the present disclosure; and FIG.","12 is a schematic structural diagram of a robot according to another embodiment of the present disclosure.","DETAILED DESCRIPTION A robot security inspection method based on an environment map and a robot thereof according to the present disclosure are hereinafter described in detail with reference to the accompanying drawings.","In an embodiment of the present disclosure, as illustrated in FIG.","6 and FIG.","1, a robot security inspection method based on an environment map includes the following steps: S3: in a course where a robot inspects a monitored region according to a monitoring route, acquiring current depth data if a predetermined photographing time interval is reached; S4: determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position; S5: performing a corresponding operation according to the abnormal factor if the abnormal factor is present; or S6: continuing to inspect the monitored region according to the monitoring route if the abnormal factor is not present.","Specifically, when the robot starts inspection, a two-dimensional planar map (which may be uploaded by a user or may be drawn by the robot according to an instruction, or the like) and a monitoring route (which may be defined by the user, or may be planned by the robot according to an inspection starting point, an inspection endpoint and the two-dimensional planar map, or the like) of the monitored region for inspection may be provided.","In the course where the robot inspects the monitored region according to the monitoring route, a depth camera mounted on the robot may acquire a depth image (that is, the current depth data) that may be photographed at the current position thereof according to a specific photographing frequency (which may also be understood as a predetermined photographing time interval).","The depth image refers to three-dimensional special coordinate data of a photographed obstacle (or a spatial object) in the monitored region relative to the depth camera.","The current depth data may be converted, such that the depth data is converted into corresponding two-dimensional laser radar data (laser radar data may reflect a profile of the obstacle).","The two-dimensional laser radar data is compared with the two-dimensional planar map according to the current odometer information, such that the current location of the robot in the current two-dimensional planar map is determined.","The robot matches the current depth data acquired by the current depth camera with a previously established two-dimensional planar map, such that the position of the robot in the current monitored region is determined.","The robot moves and carries out the inspection according to the planed monitoring route.","The current position of the robot is determined by the robot by tracking position and posture of the robot in the two-dimensional planar map of the monitored region based on adaptive Monte Carlo localization (AMCL) and a particle filter according to the laser radar data corresponding to the current depth data and the current odometer information.","The odometer information refers to angles executed by a motion mechanism such as a motor in the robot, a rotation count and the like.","The odometer information is recorded in any robot that is capable of walking.","Generally, the obstacle is located according to the profile of the obstacle that is obtained by conversion of the current depth data.","The current odometer information is needed for the sake of ensuring that a more accurate position may be determined in the two-dimensional planar map.","For example, the current depth data may be the profile of a chair whereas there are three chairs in the two-dimensional planar map; in this case, the chair needs to be located according to the current odometer information, such that the current position of the robot in the two-dimensional planar map is determined.","The current odometer information may indicate that the motor walks for 10 meters leftward and then walks for 5 meters rightward, such that the current position in the two-dimensional planar map is determined according to the profile of a chair parsed according to current attempt data.","In addition to determining the current position according to the current depth data, the current odometer information and the two-dimensional planar map, whether an abnormal factor is present at the current position may be further judged according to the current data, for example, whether a person (a living body) is detected, and whether a new obstacle and the like that is not marked in the two-dimensional planar map is detected during the inspection.","In this way, different operations are performed according to different abnormal factors.","If everything is normal, the robot continues the inspection according to the monitoring route.","In this embodiment, the robot may inspect the monitored region according to the monitoring route, such that labor force is reduced and no camera needs to be deployed in the monitored region, in addition, if an abnormal factor is detected during the inspection, some measures may be timely taken.","In another embodiment of the present disclosure, based on the above embodiment, as illustrated in FIG.","8, prior to step S3, the method further includes: S1: upon receipt of a map establishment instruction, traversing, by the robot, the monitored region, and establishing the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and S2: planning the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.","Specifically, when the robot desires to inspect a monitored region, the two-dimensional planar map of this monitored region needs to be inevitably acquired, to plan the monitoring route and determine the current position during the inspection and the like.","In this embodiment, the two-dimensional planar map is established by the robot, and prior to the normal inspection, an operating personnel controls the robot to traverse the monitored region to be inspected.","When the robot walks in the monitored region, the robot acquires depth data of each obstacle in the monitored region by using the depth camera mounted on the head of the robot, and then establishes the two-dimensional planar map according to the acquired odometer information corresponding to the depth data.","In this way, the robot may establish the two-dimensional planar map while walking.","After the robot traverses the monitored region, the two-dimensional planar map is established.","Nevertheless, prior to the normal inspection, a random route-changing program inside the robot may control the robot to traverse the monitored region, so as to establish the two-dimensional planar map.","After the two-dimensional planar map is acquired, the operating personnel may input the inspection starting point and the inspection endpoint, such that the robot plans the monitoring route according to the two-dimensional planar map, which is more intelligent and labor-saving.","During planning of the monitoring route by the robot according to the established two-dimensional planar map, the Dijkstra optimal path algorithm is employed to calculate a least-expenditure path from the inspection starting point to the inspection endpoint in the two-dimensional planar map, and use the path as the monitoring route of the robot.","Preferably, as illustrated in FIG.","8, step S1 specifically includes the following steps: S11: upon receipt of the map establishment instruction, traversing, by the robot, the monitored region, and acquiring the depth data of each obstacle in the monitored region during the traversing; S12: projecting the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and S13: establishing the two-dimensional planar map of the monitored region according to the laser radar data (the corresponding depth data) and odometer information corresponding to the laser radar data.","Specifically, the two-dimensional planar map (that is, a two-dimensional grid map) of an unknown environment (that is, a monitored region) is established by using the Gmapping algorithm in the simultaneous localization and mapping (SLAM), and the specific process is as follows: 1) The depth camera may acquire a depth image (that is, the depth data, or depth distance data) during the course of traversing the monitored region, and may convert three-dimensional spatial depth data into two-dimensional laser radar data by projecting the depth data within the predetermined height range onto the horizontal plane of the depth camera.","For example, if the height from the depth camera to the ground is Z=50 cm, and the predetermined height range is set to 0 to 100 cm, the depth data satisfying the height of 0 to 100 cm is projected onto the horizontal plane with the height of Z=50, such that the corresponding two-dimensional laser radar data is acquired.","2) The Gmapping algorithm finally constructs the two-dimensional grid map of the unknown environment (that is, the two-dimensional planar map of the monitored region) by virtue of particle filtering according to the laser radar data obtained upon conversion in combination with the odometer information of the robot.","As illustrated in FIG.","2, in the course where the robot carries out security inspection, four pieces of information are mainly included: (1) a two-dimensional planar map of an inspection environment (that is, the monitored region) established by the robot; (2) an inspection starting position (inspection starting point) A; (3) an inspection destination position (inspection endpoint) B; and (4) an inspection path (that is, the monitoring route) planed by the robot from the inspection starting point A to the inspection endpoint B.","In another embodiment of the present disclosure, based on the above embodiment, as illustrated in FIG.","7, step S4 of determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position includes the following steps: S41: judging whether there is an obstacle not marked in the two-dimensional planar map, considering that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or considering that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and step S5 includes the following steps: S510: if there is an obstacle not marked, marking the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, and updating the two-dimensional planar map; and S511: updating the monitoring route according to the current position and the updated two-dimensional planar map, and inspecting the monitored region according to the updated monitoring route.","Specifically, if there is no abnormal factor, the robot may carry out inspection according to the monitoring route in combination with the current position.","However, if there is no obstacle not marked in the two-dimensional planar map during the progress of the robot, it is considered that an abnormal factor is detected, and the obstacle may be marked in the two-dimensional planar map to update the two-dimensional planar map of the monitored region.","The obstacle not marked is marked in the two-dimensional planar map by using the same method for establishing the two-dimensional planar map.","After the two-dimensional planar map is updated, the robot may re-plan the monitoring route according to the current position, the endpoint of the original monitoring route and the updated two-dimensional planar map, and continue the inspection according to the current position and the updated monitoring route.","The robot may update the monitoring route thereof according to the updated two-dimensional planar map.","Therefore, the inspection is more flexible and achieves a better inspection result.","In another embodiment of the present disclosure, based on the above embodiment, as illustrated in FIG.","9, step S4 of determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position includes the following steps: S42: judging whether human skeleton data is identified, considering that the abnormal factor is present if the human skeleton data is identified, or considering that the abnormal factor is not present if the human skeleton data is not identified; and step S5 includes the following steps: S520: moving towards a living body corresponding to the human skeleton data if the human skeleton data is identified; S521: acquiring a current facial feature of the living body; S522: matching the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired; S523: considering that the abnormal factor is not present if the matching is successful; and S524: performing the tracking operation for the living body and generating the alarm information if the matching is unsuccessful.","Specifically, in addition to judging whether there is an obstacle not marked in the two-dimensional planar map according to the current depth data, the robot may further judge whether human skeleton data is identified, such that whether there is a living body during the inspection is judged, to judge whether the abnormal factor is present at the current position.","Whether there is an obstacle not marked is firstly judged, and then whether the human skeleton data is identified is judged; or whether the human skeleton data is identified is firstly judged, and then whether there is an obstacle not marked is judged; or the two judgments are performed parallelly.","The time sequence of the judgments is not specifically limited.","As illustrated in FIG.","3, using a living body as an example, identification of human skeleton data is as follows: The human skeleton data has been identified if the current depth image (that is, the current depth data) acquired by the depth camera includes lines as illustrated in FIG.","3.Once the human skeleton data is identified, it is considered that the robot has detected an abnormal factor, and the robot may perform a corresponding operation according to the identified skeleton data.","As illustrated in FIG.","4, using a living body as an example, after the human skeleton data is detected, since whether the person is a secure factor or not needs to be judged, the robot needs to approach this person to acquire the current facial feature of the person, and judge whether the current living body is a secure factor is judged by means of face recognition.","The face recognition may include the following steps: When the robot detects the human skeleton data, the robots approaches the person, and detects the current facial feature of the person by using an RGB camera of the robot.","The current facial feature is matched with various facial features stored in a predetermined living body facial feature database; if the matching is successful, identity verification is completed and the person is not tracked; and if the matching is unsuccessful, the person is identified as a dangerous factor (a stranger).","The predetermined living body facial feature database may store a plurality of predetermined facial features, wherein the plurality of predetermined facial features pertain to different persons and may probably appear in the monitored region.","If the current facial feature fails to successfully match with any of the predetermined facial features, this person is a stranger and is a dangerous factor.","As such, the person needs to be tracked, and alarm information needs to be generated.","Generation of the alarm information is performing a corresponding operation according to a predefined security policy or a guardian operation.","For example, the predefined security policy is generating a buzzer alarm, and the guardian operation is sending the alarm information or the like to the guardian.","If the current facial feature successfully matches with any of the predetermined facial features, the person is not a dangerous factor and no abnormal factor is present.","As such, the robot may continue the inspection according to the monitoring route.","If the robot deviates from the monitoring route during acquisition of the current facial feature, the robot may return to the origin upon judging that no abnormal factor is present, and continue the inspection according to the monitoring route; or the robot may determine the current position, and re-plans the monitoring route or the like according to the current position and the inspection terminal.","Preferably, following step S521, the method further includes the following steps: S525: acquiring password information from the living body if the current facial feature of the living body is not successfully acquired; S526: matching the acquired password information with predetermined password information in a predetermined password database; S523: considering that the abnormal factor is not present if the matching is successful; and S524: performing the tracking operation for the living body and generating the alarm information if the matching is unsuccessful.","Specifically, in case of night and insufficient light, the RGB camera fails to normally identify the face of a person under test, and perform identity verification for the person under test by virtue of voice password.","When the robot finds that the current facial feature of the living body fails to be successfully acquired, the robot may acquire password information from the living body.","For example, the robot asks the living body for the password information; upon hearing the voice message from the robot, the living body may report the password information; and the robot receives the password information reported by the living body via the microphone array, and then matches the received password information with predetermined password information stored in a predetermined password database.","The predetermined password database may store a plurality of pieces of predetermined password information.","The matching is considered to be successful as long as the password information reported by the living body matches with any of the plurality of pieces of predetermined password information, and the matching is considered to be unsuccessful as long as the password information reported by the living body fails to match with any of plurality of pieces of predetermined password information.","The predetermined password information may be a sentence, a song title or the like, which may be freely defined by the guardian (that is, the user of the robot).","When the matching is successful, the robot considers that the current living body is not a dangerous factor and no abnormal factor is present, and in this case, the robot continues the inspection according to the monitoring route; and when the matching is unsuccessful, the robot considers that the current living body is a dangerous factor, performing a tacking operation for the living body and generates alarm information.","Generation of the alarm information is performing a corresponding operation according to a predefined security policy or a guardian operation.","For example, the predefined security policy is generating a buzzer alarm, and the guardian operation is sending the alarm information or the like to the guardian.","In another embodiment of the present disclosure, based on the above embodiment, as illustrated in FIG.","10, the method further includes the following steps: S7: in the course where the robot inspects the monitored region according to the monitoring route, acquiring a current smoke concentration value if a predetermined detection time interval is reached; S8: judging whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; S9: generating alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold; or S10: continuing to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.","Specifically, in the course where the robot carries out inspection according to the monitoring route, a smoke sensor thereof may measure the smoke concentration value of the monitored region, and the robot may judge the acquired current smoke concentration value.","If the smoke concentration value exceeds the predetermined smoke concentration threshold, the robot considers that a dangerous factor is present and generates alarm information.","Generation of the alarm information is performing a corresponding operation according to a predefined security policy or a guardian operation.","For example, the predefined security policy is generating a buzzer alarm, and the guardian operation is sending the alarm information or the like to the guardian.","Judgment of the current smoke concentration value, identification of the human skeleton data and detection of the obstacle not marked may be performed parallelly, or may be performed according to a time sequence.","For example, when the current position is determined, whether a current smoke attempt value exceeds the predetermined smoke concentration threshold is firstly judged; if the current smoke attempt value exceeds the predetermined smoke concentration threshold, the robot generates alarm information and waits for the guardian to process; if the current smoke attempt value does not exceed the predetermined smoke concentration threshold, whether the human skeleton data is identified is judged; if the human skeleton data is identified, the robot acquires the current facial feature or password information and performs matching thereof; if the matching is unsuccessful, the robot performs a tacking operation, and generates alarm information; if the matching is successful, the robot further judges whether an obstacle not marked is detected; if no obstacle not marked is detected, the robot continues the inspection according to the monitoring route and repeats the above steps; and if the obstacle not marked is detected, the robot updates the two-dimensional planar map, carries out the inspection according to the updated monitoring route and repeats the above steps.","Inspection by using the robot reduces the labor force, and achieves flexible monitoring.","The depth camera has the night vision function, is capable of feeding back, generating alarms and proactively tracking abnormal factors, smoke concentrations and the like, and thus achieves a better monitoring effect.","As illustrated in FIG.","5, a robot for use in the security inspection method according to the above technical solution includes: a depth camera 1, mainly configured to acquire depth data of an indoor object relative to the robot, and an internal structure of a living body, so as to establish a two-dimensional grid map of a monitored region and locate the robot; wherein since the depth camera employs an infrared ray structure to detect the depth of the object, in the dark night, the depth camera is still capable of operating; an RGB camera 2, configured to acquire a color image of the monitored region for face recognition and scenario view; a smoke sensor 3, configured to sense smoke in the monitored region; a microphone array 4, configured to pick up an external sound or make an approximate judgment for the direction of a sound source; and a speaker 5, configured to play sounds, such as inquiries and alarms.","In another embodiment of the present disclosure, as illustrated in FIG.","11, a robot includes: a data acquiring module 10, configured to, in a course wherein a robot inspects a monitored region according to a monitoring route, acquire current depth data if a predetermined photographing time interval is reached; wherein the current depth data includes: distance data of an obstacle relative to the robot in a current monitoring region, and an internal structure of a living body (if there is a living body); a judging module 20, configured to, determine, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judge whether an abnormal factor is present at the current position; and an executing module 30, configured to, perform a corresponding operation according to the abnormal factor if the abnormal factor is present, or continue to inspect the monitored region according to the monitoring route if the abnormal factor is not present.","Specifically, when the robot starts inspection, a two-dimensional planar map (which may be uploaded by a user or may be drawn by the robot according to an instruction, or the like) and a monitoring route (which may be defined by the user, or may be planned by the robot according to an inspection starting point, an inspection endpoint and the two-dimensional planar map, or the like) of the monitored region for inspection may be provided.","The data acquiring module is the depth camera of the robot.","In the course where the robot inspects the monitored region according to the monitoring route, a depth camera mounted on the robot may acquire a depth image (that is, the current depth data) that may be photographed at the current position thereof according to a specific photographing frequency (which may also be understood as a predetermined photographing time interval).","The depth image refers to three-dimensional special coordinate data of a photographed obstacle (or a spatial object) in the monitored region relative to the depth camera.","The current depth data may be converted, such that the depth data is converted into corresponding two-dimensional laser radar data (laser radar data may reflect a profile of the obstacle).","The two-dimensional laser radar data is compared with the two-dimensional planar map according to the current odometer information, such that the current location of the robot in the current two-dimensional planar map is determined.","The robot matches the current depth data acquired by the current depth camera with a previously established two-dimensional planar map, such that the position of the robot in the current monitored region is determined.","The robot moves and carries out the inspection according to the planed monitoring route.","The current position of the robot is determined by the robot by tracking position and posture of the robot in the two-dimensional planar map of the monitored region based on adaptive Monte Carlo localization (AMCL) and a particle filter according to the laser radar data corresponding to the current depth data and the current odometer information.","The odometer information refers to angles executed by a motion mechanism such as a motor in the robot, a rotation count and the like.","The odometer information is recorded in any robot that is capable of walking.","Generally, the obstacle is located according to the profile of the obstacle that is obtained by conversion of the current depth data.","The current odometer information is needed for the sake of ensuring that a more accurate position may be determined in the two-dimensional planar map.","For example, the current depth data may be the profile of a chair whereas there are three chairs in the two-dimensional planar map; in this case, the chair needs to be located according to the current odometer information, such that the current position of the robot in the two-dimensional planar map is determined.","The current odometer information may indicate that the motor walks for 15 meters leftward and then walks for 7 meters rightward, such that the current position in the two-dimensional planar map is determined according to the profile of a chair parsed according to current attempt data.","In addition to determining the current position according to the current depth data, the current odometer information and the two-dimensional planar map, whether an abnormal factor is present at the current position may be further judged according to the current data, for example, whether a person (a living body) is detected, and whether a new obstacle and the like that is not marked in the two-dimensional planar map is detected during the inspection.","In this way, different operations are performed according to different abnormal factors.","If everything is normal, the robot continues the inspection according to the monitoring route.","In this embodiment, the robot may inspect the monitored region according to the monitoring route, such that labor force is reduced and no camera needs to be deployed in the monitored region, in addition, if an abnormal factor is detected during the inspection, an action may be timely taken.","In another embodiment of the present disclosure, based on the above embodiment, as illustrated in FIG.","12, the executing module 30 includes: a map establishing submodule 31, configured to, upon receipt of a map establishment instruction, traverse the monitored region, and establish the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and a route planning submodule 32, configured to plan the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.","Specifically, when the robot desires to inspect a monitored region, the two-dimensional planar map of this monitored region needs to be inevitably acquired, to plan the monitoring route and determine the current position during the inspection and the like.","In this embodiment, the two-dimensional planar map is established by the robot, and prior to the normal inspection, an operating personnel controls the robot to traverse the monitored region to be inspected.","When the robot walks in the monitored region, the robot acquires depth data of each obstacle in the monitored region by using the depth camera mounted on the head of the robot, and then establishes the two-dimensional planar map according to the acquired odometer information corresponding to the depth data.","In this way, the robot may establish the two-dimensional planar map while walking.","After the robot traverses the monitored region, the two-dimensional planar map is established.","Nevertheless, prior to the normal inspection, a random route-changing program inside the robot may control the robot to traverse the monitored region, so as to establish the two-dimensional planar map.","After the two-dimensional planar map is acquired, the operating personnel may input the inspection starting point and the inspection endpoint, such that the robot plans the monitoring route according to the two-dimensional planar map, which is more intelligent and labor-saving.","During planning of the monitoring route by the robot according to the established two-dimensional planar map, the Dijkstra optimal path algorithm is employed to calculate a least-expenditure path from the inspection starting point to the inspection endpoint in the two-dimensional planar map, and use the path as the monitoring route of the robot.","Preferably, the data acquiring module 10 is further configured to, upon receipt of the map establishment instruction, traverse the monitored region, and acquire the depth data of each obstacle in the monitored region during the traversing; and the map establishing submodule 31 is further configured to, project the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data (the corresponding depth data); and establish the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.","Specifically, the two-dimensional planar map (that is, a two-dimensional grid map) of an unknown environment (that is, a monitored region) is established by using the Gmapping algorithm in the simultaneous localization and mapping (SLAM), and the specific process is as follows: 1) The depth camera may acquire a depth image (that is, the depth data, or depth distance data) in the course of traversing the monitored region, and may convert three-dimensional spatial depth data into two-dimensional laser radar data by projecting the depth data within the predetermined height range onto the horizontal plane of the depth camera.","For example, if the height from the depth camera to the ground is Z=50 cm, and the predetermined height range is set to 0 to 100 cm, the depth data satisfying the height of 0 to 100 cm is projected onto the horizontal plane with the height of Z=50, such that the corresponding two-dimensional laser radar data is acquired.","2) The Gmapping algorithm finally constructs the two-dimensional grid map of the unknown environment (that is, the two-dimensional planar map of the monitored region) by virtue of particle filtering according to the laser radar data obtained upon conversion in combination with the odometer information of the robot.","In another embodiment of the present disclosure, based on the above embodiment, the judging module 20 is further configured to, judge whether there is an obstacle not marked in the two-dimensional planar map, consider that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or consider that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and the executing module 30 is further configured to, if there is an obstacle not marked, mark the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, update the two-dimensional planar map, update the monitoring route according to the current position and the updated two-dimensional planar map, and inspect the monitored region according to the updated monitoring route.","Specifically, if there is no abnormal factor, the robot may carry out inspection according to the monitoring route in combination with the current position.","However, if there is no obstacle not marked in the two-dimensional planar map during the progress of the robot, it is considered that an abnormal factor is detected, and the obstacle may be marked in the two-dimensional planar map to update the two-dimensional planar map of the monitored region.","The obstacle not marked is marked in the two-dimensional planar map by using the same method for establishing the two-dimensional planar map.","After the two-dimensional planar map is updated, the robot may re-plan the monitoring route according to the current position, the endpoint of the original monitoring route and the updated two-dimensional planar map, and continue the inspection according to the current position and the updated monitoring route.","The robot may update the monitoring route thereof according to the updated two-dimensional planar map.","Therefore, the inspection is more flexible and achieves a better inspection result.","In another embodiment of the present disclosure, based on the above embodiment, the judging module 20 is further configured to: judge whether human skeleton data is identified, consider that the abnormal factor is present if the human skeleton data is identified, or consider that the abnormal factor is not present if the human skeleton data is not identified; and the executing module 30 is further configured to: move towards a living body corresponding to the human skeleton data if the human skeleton data is identified; acquire a current facial feature of the living body; match the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired, consider that the abnormal factor is not present if the matching is successful, perform a tracking operation for the living body and generating alarm information if the matching is unsuccessful.","Specifically, in addition to judging whether there is an obstacle not marked in the two-dimensional planar map according to the current depth data, the robot may further judge whether human skeleton data is identified, such that whether there is a living body during the inspection is judged, to judge whether the abnormal factor is present at the current position.","Whether there is an obstacle not marked is firstly judged, and then whether the human skeleton data is identified is judged; or whether the human skeleton data is identified is firstly judged, and then whether there is an obstacle not marked is judged; or the two judgments are performed parallelly.","The time sequence of the judgments is not specifically limited.","The RGB camera of the robot acquires the current facial feature of the living body.","The predetermined living body facial feature database may store a plurality of predetermined facial features, wherein the plurality of predetermined facial features pertain to different persons and may probably appear in the monitored region.","If the current facial feature fails to successfully match any of the predetermined facial features, this person is a stranger and is a dangerous factor.","As such, the person needs to be tracked, and alarm information needs to be generated.","Generation of the alarm information is performing a corresponding operation according to a predefined security policy or a guardian operation.","For example, the predefined security policy is generating a buzzer (or speaker) alarm, and the guardian operation is sending the alarm information or the like to the guardian.","If the current facial feature successfully matches with any of the predetermined facial features, the person is not a dangerous factor and no abnormal factor is present.","As such, the robot may continue the inspection according to the monitoring route.","If the robot deviates from the monitoring route during acquisition of the current facial feature, the robot may return to the origin upon judging that no abnormal factor is present, and continue the inspection according to the monitoring route; or the robot may determine the current position, and re-plans the monitoring route or the like according to the current position and the inspection terminal.","Preferably, the executing module 30 is further configured to: acquire password information from the living body if the current facial feature of the living body is not successfully acquired; and match the acquired password information with predetermined password information in a predetermined password database, consider that the abnormal factor is not present if the matching is successful, and perform the tracking operation for the living body and generate the alarm information if the matching is unsuccessful.","Specifically, the living body is queried by using the speaker, and the password information is acquired by using the microphone array.","In case of night and insufficient light, the RGB camera fails to normally identify the face of a person under test, and perform identity verification for the person under test by virtue of voice password.","When the robot finds that the current facial feature of the living body fails to be successfully acquired, the robot may acquire password information from the living body.","For example, the robot asks the living body for the password information; upon hearing the voice message from the robot, the living body may report the password information; and the robot receives the password information reported by the living body via the microphone array, and then matches the received password information with predetermined password information stored in a predetermined password database.","The predetermined password database may store a plurality of pieces of predetermined password information.","The matching is considered to be successful as long as the password information reported by the living body matches with any of the plurality of pieces of predetermined password information, and the matching is considered to be unsuccessful as long as the password information reported by the living body fails to match with any of plurality of pieces of predetermined password information.","The predetermined password information may be a sentence, a song title or the like, which may be freely defined by the guardian (that is, the user of the robot).","When the matching is successful, the robot considers that the current living body is not a dangerous factor and no abnormal factor is present, and in this case, the robot continues the inspection according to the monitoring route; and when the matching is unsuccessful, the robot considers that the current living body is a dangerous factor, performs a tacking operation for the living body and generates alarm information.","Generation of the alarm information is performing a corresponding operation according to a predefined security policy or a guardian operation.","For example, the predefined security policy is generating a buzzer alarm, and the guardian operation is sending the alarm information or the like to the guardian.","In another embodiment of the present disclosure, based on the above embodiment, as illustrated in FIG.","12, the robot further includes: a smoke detecting module 40, configured to, in the course where the robot inspects the monitored region according to the monitoring route, acquire a current smoke concentration value if a detection photographing time interval is reached; wherein the judging module 20 is further configured to judge whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; and wherein the executing module 30 is further configured to generate alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold, and continue to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.","Specifically, the smoke detecting module is a smoke sensor of the robot.","The smoke sensor may acquires the current smoke concentration value at a predetermined frequency, that is, in the course where the robot inspects the monitored region according to the monitoring route, the smoke detecting module acquires the current smoke concentration value if the predetermined detection time interval is reached.","In the course where the robot carries out inspection according to the monitoring route, a smoke sensor thereof may measure the smoke concentration value of the monitored region, and the robot may judge the acquired current smoke concentration value.","If the smoke concentration value exceeds the predetermined smoke concentration threshold, the robot considers that a dangerous factor is present and generates alarm information.","Generation of the alarm information is performing a corresponding operation according to a predefined security policy or a guardian operation.","For example, the predefined security policy is generating a buzzer alarm, and the guardian operation is sending the alarm information or the like to the guardian.","Judgment of the current smoke concentration value, identification of the human skeleton data and detection of the obstacle not marked may be performed parallelly, or may be performed according to a time sequence.","For example, when the current position is determined, whether a current smoke attempt value exceeds the predetermined smoke concentration threshold is firstly judged; if the current smoke attempt value exceeds the predetermined smoke concentration threshold, the robot generates alarm information and waits for the guardian to process; if the current smoke attempt value does not exceed the predetermined smoke concentration threshold, whether the human skeleton data is identified is judged; if the human skeleton data is identified, the robot acquires the current facial feature or password information and performs matching thereof; if the matching is unsuccessful, the robot performs a tacking operation, and generates alarm information; if the matching is successful, the robot further judges whether an obstacle not marked is detected; if no obstacle not marked is detected, the robot continues the inspection according to the monitoring route and repeats the above steps; and if the obstacle not marked is detected, the robot updates the two-dimensional planar map, carries out the inspection according to the updated monitoring route and repeats the above steps.","Inspection by using the robot reduces the labor force, and achieves flexible monitoring.","The depth camera has the night vision function, is capable of feeding back, generating alarms and proactively tracking abnormal factors, smoke concentrations and the like, and thus achieves a better monitoring effect.","The above embodiments are merely used to illustrate the technical solutions of the present disclosure, instead of limiting the protection scope of the present disclosure.","Any modification, equivalent replacement, or improvement made without departing from the spirit and principle of the present disclosure should fall within the protection scope defined by the appended claims of the present disclosure."]],"string":"[\n [\n \"ROBOT SECURITY INSPECTION METHOD BASED ON ENVIRONMENT MAP AND ROBOT THEREOF\",\n \"The present disclosure provides a robot security inspection method based on an environment map and a robot thereof.\",\n \"The method includes: establishing a two-dimensional planar map of an entire monitored region, planning a monitoring route, determining the position of the robot at the current monitored region, and moving to perform inspection according to the planed monitoring route.\",\n \"With the robot security inspection method based on an environment map and the robot thereof according to the present disclosure, traversing-based inspection may be performed according to the environment map, thereby preventing the dead space in the monitoring; dangerous factors may be proactively detected and security policy conformation may be conducted; the dangerous factors may be proactively tracked; and the robot is capable of normally operating even without auxiliary illumination at night.\"\n ],\n [\n \"1.A robot security inspection method based on an environment map, comprising: S3: in a course where a robot inspects a monitored region according to a monitoring route, acquiring current depth data if a predetermined photographing time interval is reached; S4: determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position; S5: performing a corresponding operation according to the abnormal factor if the abnormal factor is present; or S6: continuing to inspect the monitored region according to the monitoring route if the abnormal factor is not present.\",\n \"2.The robot security inspection method based on an environment map according to claim 1, wherein prior to step S3, the method further comprises: S1: upon receipt of a map establishment instruction, traversing, by the robot, the monitored region, and establishing the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and S2: planning the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.\",\n \"3.The robot security inspection method based on an environment map according to claim 2, wherein step S1 comprises the following steps: S11: upon receipt of the map establishment instruction, traversing, by the robot, the monitored region, and acquiring the depth data of each obstacle in the monitored region during the traversing; S12: projecting the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and S13: establishing the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.\",\n \"4.The robot security inspection method based on an environment map according to claim 1, wherein: step S4 comprises the following steps: S41: judging whether there is an obstacle not marked in the two-dimensional planar map, considering that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or considering that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and step S5 comprises the following steps: S510: if there is an obstacle not marked, marking the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, and updating the two-dimensional planar map; and S511: updating the monitoring route according to the current position and the updated two-dimensional planar map, and inspecting the monitored region according to the updated monitoring route.\",\n \"5.The robot security inspection method based on an environment map according to claim 1, wherein step S4 comprises the following steps: S42: judging whether human skeleton data is identified, considering that the abnormal factor is present if the human skeleton data is identified, or considering that the abnormal factor is not present if the human skeleton data is not identified; and step S5 comprises the following steps: S520: moving towards a living body corresponding to the human skeleton data if the human skeleton data is identified; S521: acquiring a current facial feature of the living body; S522: matching the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired; S523: considering that the abnormal factor is not present if the matching is successful; and S524: performing a tracking operation for the living body and generating alarm information if the matching is unsuccessful.\",\n \"6.The robot security inspection method based on an environment map according to claim 5, wherein following step S521, the method further comprises: S525: acquiring password information from the living body if the current facial feature of the living body is not successfully acquired; S526: matching the acquired password information with predetermined password information in a predetermined password database; S523: considering that the abnormal factor is not present if the matching is successful; and S524: performing the tracking operation for the living body and generating the alarm information if the matching is unsuccessful.\",\n \"7.The robot security inspection method based on an environment map according to claim 1, further comprising: S7: in the course where the robot inspects the monitored region according to the monitoring route, acquiring a current smoke concentration value if a predetermined detection time interval is reached; S8: judging whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; S9: generating alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold; or S10: continuing to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.\",\n \"8.A robot, comprising: a data acquiring module, configured to, in a course where a robot inspects a monitored region according to a monitoring route, acquire current depth data if a predetermined photographing time interval is reached; a judging module, configured to determine, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judge whether an abnormal factor is present at the current position; and an executing module, configured to perform a corresponding operation according to the abnormal factor if the abnormal factor is present, or continue to inspect the monitored region according to the monitoring route if the abnormal factor is not present.\",\n \"9.The robot according to claim 8, wherein the executing module comprises: a map establishing submodule, configured to, upon receipt of a map establishment instruction, traverse the monitored region, and establish the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and a route planning submodule, configured to plan the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.\",\n \"10.The robot according to claim 9, wherein: the data acquiring module is further configured to, upon receipt of the map establishment instruction, traverse the monitored region and acquire the depth data of each obstacle in the monitored region during the traversing; and the map establishing submodule is further configured to project the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and establish the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.\",\n \"11.The robot according to claim 8, wherein the judging module is further configured to judge whether there is an obstacle not marked in the two-dimensional planar map, consider that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or consider that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and the executing module is further configured to, if there is an obstacle not marked, mark the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, update the two-dimensional planar map, update the monitoring route according to the current position and the updated two-dimensional planar map, and inspect the monitored region according to the updated monitoring route.\",\n \"12.The robot according to claim 8, wherein the judging module is further configured to judge whether human skeleton data is identified, consider that the abnormal factor is present if the human skeleton data is identified, or consider that the abnormal factor is not present if the human skeleton data is not identified; and the executing module is further configured to move towards a living body corresponding to the human skeleton data if the human skeleton data is identified; acquire a current facial feature of the living body; and match the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired, consider that the abnormal factor is not present if the matching is successful, perform a tracking operation for the living body and generating alarm information if the matching is unsuccessful.\",\n \"13.The robot according to claim 12, wherein the executing module is further configured to: acquire password information from the living body if the current facial feature of the living body is not successfully acquired; and match the acquired password information with predetermined password information in a predetermined password database, consider that the abnormal factor is not present if the matching is successful, and perform the tracking operation for the living body and generate the alarm information if the matching is unsuccessful.\",\n \"14.The robot according to claim 8, further comprising: a smoke detecting module, configured to, in the course where the robot inspects the monitored region according to the monitoring route, acquire a current smoke concentration value if a predetermined detection time interval is reached; wherein the judging module is further configured to judge whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; and wherein the executing module is further configured to generate alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold, or continue to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.\"\n ],\n [\n \" BACKGROUND At present, the passive video monitoring method is mostly used in the security monitoring field.\",\n \"Generally, a camera is mounted at a specific monitoring spot, images at the monitoring spots are displayed in a centralized manner in a specific region, and insecure factors are checked by manual reviewing images photographed by all the cameras.\",\n \"This method has many defects: 1) the monitored images need to be manually checked constantly, and thus visual fatigue may cause misjudgment of the insecure factors.\",\n \"2) The visual angle of the camera is relatively fixed and large-range movements may not be implemented; if a large-scale scenario needs to be monitored, a lot of cameras need to be deployed, and monitoring dead space is may be caused.\",\n \"3) In case of detecting insecure factors, active tracking may not be practiced in the video monitoring mode.\",\n \"4) The monitoring cameras are mostly RGB cameras and do not have the night vision function, and thus night monitoring capabilities are greatly lowered, and auxiliary illumination is generally needed, thereby causing many adverse impacts.\"\n ],\n [\n \" SUMMARY The technical problem to be solved by the present disclosure is to provide a robot security inspection method based on an environment map and a robot thereof.\",\n \"With the method and the robot, active uninterrupted monitoring is implemented, and active tracking of insecure is practiced.\",\n \"To achieve the above objectives, the present disclosure provides a robot security inspection method based on an environment map.\",\n \"The method includes: S 3 : in a course where a robot inspects a monitored region according to a monitoring route, acquiring current depth data if a predetermined photographing time interval is reached; S 4 : determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position; S 5 : performing a corresponding operation according to the abnormal factor if the abnormal factor is present; or S 6 : continuing to inspect the monitored region according to the monitoring route if the abnormal factor is not present.\",\n \"Further, prior to step S 3 , the method further includes: S 1 : upon receipt of a map establishment instruction, traversing, by the robot, the monitored region, and establishing the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and S 2 : planning the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.\",\n \"Further, step S 1 specifically includes the following steps: S 11 : upon receipt of the map establishment instruction, traversing, by the robot, the monitored region, and acquiring the depth data of each obstacle in the monitored region during the traversing; S 12 : projecting the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and S 13 : establishing the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.\",\n \"Further, step S 4 of determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position includes the following steps: S 41 : judging whether there is an obstacle not marked in the two-dimensional planar map, considering that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or considering that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and step S 5 includes the following steps: S 510 : if there is an obstacle not marked, marking the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, and updating the two-dimensional planar map; and S 511 : updating the monitoring route according to the current position and the updated two-dimensional planar map, and inspecting the monitored region according to the updated monitoring route.\",\n \"Further, step S 4 of determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position includes the following steps: S 42 : judging whether human skeleton data is identified, considering that the abnormal factor is present if the human skeleton data is identified, or considering that the abnormal factor is not present if the human skeleton data is not identified; and step S 5 includes the following steps: S 520 : moving towards a living body corresponding to the human skeleton data if the human skeleton data is identified; S 521 : acquiring a current facial feature of the living body; S 522 : matching the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired; S 523 : considering that the abnormal factor is not present if the matching is successful; and S 524 : performing a tracking operation for the living body and generating alarm information if the matching is unsuccessful.\",\n \"Further, following step S 521 , the method further includes: S 525 : acquiring password information from the living body if the current facial feature of the living body is not successfully acquired; S 526 : matching the acquired password information with predetermined password information in a predetermined password database; S 523 : considering that the abnormal factor is not present if the matching is successful; and S 524 : performing the tracking operation for the living body and generating the alarm information if the matching is unsuccessful.\",\n \"Further, the method further includes: S 7 : in the course where the robot inspects the monitored region according to the monitoring route, acquiring a current smoke concentration value if a predetermined detection time interval is reached; S 8 : judging whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; S 9 : generating alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold; or S 10 : continuing to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.\",\n \"The present disclosure further provides a robot.\",\n \"The robot includes: a data acquiring module, configured to: in a course where a robot inspects a monitored region according to a monitoring route, acquire current depth data if a predetermined photographing time interval is reached; a judging module, configured to: determine, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judge whether an abnormal factor is present at the current position; and an executing module, configured to: perform a corresponding operation according to the abnormal factor if the abnormal factor is present, or continue to inspect the monitored region according to the monitoring route if the abnormal factor is not present.\",\n \"Further, the executing module includes: a map establishing submodule, configured to, upon receipt of a map establishment instruction, traverse the monitored region, and establish the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and a route planning submodule, configured to plan the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.\",\n \"Further, the data acquiring module is further configured to, upon receipt of the map establishment instruction, traverse the monitored region and acquire the depth data of each obstacle in the monitored region during the traversing; and the map establishing submodule is further configured to project the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and establish the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.\",\n \"Further, the judging module is further configured to: judge whether there is an obstacle not marked in the two-dimensional planar map, consider that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or consider that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and the executing module is further configured to, if there is an obstacle not marked, mark the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, update the two-dimensional planar map, update the monitoring route according to the current position and the updated two-dimensional planar map, and inspect the monitored region according to the updated monitoring route.\",\n \"Further, the judging module is further configured to: judge whether human skeleton data is identified, consider that the abnormal factor is present if the human skeleton data is identified, or consider that the abnormal factor is not present if the human skeleton data is not identified; and the executing module is further configured to: move towards a living body corresponding to the human skeleton data if the human skeleton data is identified; acquire a current facial feature of the living body; and match the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired, consider that the abnormal factor is not present if the matching is successful, perform a tracking operation for the living body and generating alarm information if the matching is unsuccessful.\",\n \"Further, the executing module is further configured to: acquire password information from the living body if the current facial feature of the living body is not successfully acquired; and match the acquired password information with predetermined password information in a predetermined password database, consider that the abnormal factor is not present if the matching is successful, and perform the tracking operation for the living body and generate the alarm information if the matching is unsuccessful.\",\n \"Further, the robot further includes: a smoke detecting module, configured to, in the course where the robot inspects the monitored region according to the monitoring route, acquire a current smoke concentration value if a predetermined detection time interval is reached; wherein the judging module is further configured to judge whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; and wherein the executing module is further configured to: generate alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold, or continue to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.\",\n \"With the robot security inspection method based on an environment map and the robot thereof according to the present disclosure, traversing-based inspection may be performed according to the environment map, thereby preventing the dead space in the monitoring; insecure factors may be proactively detected and security policy conformation may be conducted; the insecure factors may be proactively tracked; and the robot is capable of normally operating even without auxiliary illumination at night.\",\n \"The method and the robot according to the present disclosure have a strong initiative, implement active defense against the insecure factors, and greatly improve effectiveness, timeliness and stability of secrete visits and inspections.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation application of international patent application No.\",\n \"PCT/CN2017/108725, filed on Oct. 31, 2017, which is based upon and claims priority of Chinese Patent Application No.\",\n \"201611154363.6, filed before Chinese Patent Office on Dec. 14, 2016 and entitled “ROBOT SECURITY INSPECTION METHOD BASED ON ENVIRONMENT MAP AND ROBOT THEREOF”, the entire contents of which are incorporated herein by reference.\",\n \"TECHNICAL FIELD The present disclosure relates to the technical field of security monitoring, and in particular, relates to a robot security inspection method based on an environment map and a robot thereof.\",\n \"BACKGROUND At present, the passive video monitoring method is mostly used in the security monitoring field.\",\n \"Generally, a camera is mounted at a specific monitoring spot, images at the monitoring spots are displayed in a centralized manner in a specific region, and insecure factors are checked by manual reviewing images photographed by all the cameras.\",\n \"This method has many defects: 1) the monitored images need to be manually checked constantly, and thus visual fatigue may cause misjudgment of the insecure factors.\",\n \"2) The visual angle of the camera is relatively fixed and large-range movements may not be implemented; if a large-scale scenario needs to be monitored, a lot of cameras need to be deployed, and monitoring dead space is may be caused.\",\n \"3) In case of detecting insecure factors, active tracking may not be practiced in the video monitoring mode.\",\n \"4) The monitoring cameras are mostly RGB cameras and do not have the night vision function, and thus night monitoring capabilities are greatly lowered, and auxiliary illumination is generally needed, thereby causing many adverse impacts.\",\n \"SUMMARY The technical problem to be solved by the present disclosure is to provide a robot security inspection method based on an environment map and a robot thereof.\",\n \"With the method and the robot, active uninterrupted monitoring is implemented, and active tracking of insecure is practiced.\",\n \"To achieve the above objectives, the present disclosure provides a robot security inspection method based on an environment map.\",\n \"The method includes: S3: in a course where a robot inspects a monitored region according to a monitoring route, acquiring current depth data if a predetermined photographing time interval is reached; S4: determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position; S5: performing a corresponding operation according to the abnormal factor if the abnormal factor is present; or S6: continuing to inspect the monitored region according to the monitoring route if the abnormal factor is not present.\",\n \"Further, prior to step S3, the method further includes: S1: upon receipt of a map establishment instruction, traversing, by the robot, the monitored region, and establishing the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and S2: planning the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.\",\n \"Further, step S1 specifically includes the following steps: S11: upon receipt of the map establishment instruction, traversing, by the robot, the monitored region, and acquiring the depth data of each obstacle in the monitored region during the traversing; S12: projecting the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and S13: establishing the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.\",\n \"Further, step S4 of determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position includes the following steps: S41: judging whether there is an obstacle not marked in the two-dimensional planar map, considering that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or considering that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and step S5 includes the following steps: S510: if there is an obstacle not marked, marking the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, and updating the two-dimensional planar map; and S511: updating the monitoring route according to the current position and the updated two-dimensional planar map, and inspecting the monitored region according to the updated monitoring route.\",\n \"Further, step S4 of determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position includes the following steps: S42: judging whether human skeleton data is identified, considering that the abnormal factor is present if the human skeleton data is identified, or considering that the abnormal factor is not present if the human skeleton data is not identified; and step S5 includes the following steps: S520: moving towards a living body corresponding to the human skeleton data if the human skeleton data is identified; S521: acquiring a current facial feature of the living body; S522: matching the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired; S523: considering that the abnormal factor is not present if the matching is successful; and S524: performing a tracking operation for the living body and generating alarm information if the matching is unsuccessful.\",\n \"Further, following step S521, the method further includes: S525: acquiring password information from the living body if the current facial feature of the living body is not successfully acquired; S526: matching the acquired password information with predetermined password information in a predetermined password database; S523: considering that the abnormal factor is not present if the matching is successful; and S524: performing the tracking operation for the living body and generating the alarm information if the matching is unsuccessful.\",\n \"Further, the method further includes: S7: in the course where the robot inspects the monitored region according to the monitoring route, acquiring a current smoke concentration value if a predetermined detection time interval is reached; S8: judging whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; S9: generating alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold; or S10: continuing to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.\",\n \"The present disclosure further provides a robot.\",\n \"The robot includes: a data acquiring module, configured to: in a course where a robot inspects a monitored region according to a monitoring route, acquire current depth data if a predetermined photographing time interval is reached; a judging module, configured to: determine, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judge whether an abnormal factor is present at the current position; and an executing module, configured to: perform a corresponding operation according to the abnormal factor if the abnormal factor is present, or continue to inspect the monitored region according to the monitoring route if the abnormal factor is not present.\",\n \"Further, the executing module includes: a map establishing submodule, configured to, upon receipt of a map establishment instruction, traverse the monitored region, and establish the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and a route planning submodule, configured to plan the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.\",\n \"Further, the data acquiring module is further configured to, upon receipt of the map establishment instruction, traverse the monitored region and acquire the depth data of each obstacle in the monitored region during the traversing; and the map establishing submodule is further configured to project the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and establish the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.\",\n \"Further, the judging module is further configured to: judge whether there is an obstacle not marked in the two-dimensional planar map, consider that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or consider that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and the executing module is further configured to, if there is an obstacle not marked, mark the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, update the two-dimensional planar map, update the monitoring route according to the current position and the updated two-dimensional planar map, and inspect the monitored region according to the updated monitoring route.\",\n \"Further, the judging module is further configured to: judge whether human skeleton data is identified, consider that the abnormal factor is present if the human skeleton data is identified, or consider that the abnormal factor is not present if the human skeleton data is not identified; and the executing module is further configured to: move towards a living body corresponding to the human skeleton data if the human skeleton data is identified; acquire a current facial feature of the living body; and match the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired, consider that the abnormal factor is not present if the matching is successful, perform a tracking operation for the living body and generating alarm information if the matching is unsuccessful.\",\n \"Further, the executing module is further configured to: acquire password information from the living body if the current facial feature of the living body is not successfully acquired; and match the acquired password information with predetermined password information in a predetermined password database, consider that the abnormal factor is not present if the matching is successful, and perform the tracking operation for the living body and generate the alarm information if the matching is unsuccessful.\",\n \"Further, the robot further includes: a smoke detecting module, configured to, in the course where the robot inspects the monitored region according to the monitoring route, acquire a current smoke concentration value if a predetermined detection time interval is reached; wherein the judging module is further configured to judge whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; and wherein the executing module is further configured to: generate alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold, or continue to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.\",\n \"With the robot security inspection method based on an environment map and the robot thereof according to the present disclosure, traversing-based inspection may be performed according to the environment map, thereby preventing the dead space in the monitoring; insecure factors may be proactively detected and security policy conformation may be conducted; the insecure factors may be proactively tracked; and the robot is capable of normally operating even without auxiliary illumination at night.\",\n \"The method and the robot according to the present disclosure have a strong initiative, implement active defense against the insecure factors, and greatly improve effectiveness, timeliness and stability of secrete visits and inspections.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS FIG.\",\n \"1 is a flowchart of a robot security inspection method based on an environment map according to an embodiment of the present disclosure; FIG.\",\n \"2 is a schematic diagram of robot displacement in the security inspection method as illustrated in FIG.\",\n \"1; FIG.\",\n \"3 is a schematic diagram of human body identification according to an embodiment of the present disclosure; FIG.\",\n \"4 is a schematic diagram of face recognition and voice identity authentication according to the present disclosure; FIG.\",\n \"5 is a schematic structural diagram of a robot according to the present disclosure; FIG.\",\n \"6 is a flowchart of a robot security inspection method based on an environment map according to an embodiment of the present disclosure; FIG.\",\n \"7 is a partial flowchart of a robot security inspection method based on an environment map according to an embodiment of the present disclosure; FIG.\",\n \"8 is a flowchart of a robot security inspection method based on an environment map according to another embodiment of the present disclosure; FIG.\",\n \"9 is a partial flowchart of a robot security inspection method based on an environment map according to an embodiment of the present disclosure; FIG.\",\n \"10 is a partial flowchart of a robot security inspection method based on an environment map according to an embodiment of the present disclosure; FIG.\",\n \"11 is a schematic structural diagram of a robot according to an embodiment of the present disclosure; and FIG.\",\n \"12 is a schematic structural diagram of a robot according to another embodiment of the present disclosure.\",\n \"DETAILED DESCRIPTION A robot security inspection method based on an environment map and a robot thereof according to the present disclosure are hereinafter described in detail with reference to the accompanying drawings.\",\n \"In an embodiment of the present disclosure, as illustrated in FIG.\",\n \"6 and FIG.\",\n \"1, a robot security inspection method based on an environment map includes the following steps: S3: in a course where a robot inspects a monitored region according to a monitoring route, acquiring current depth data if a predetermined photographing time interval is reached; S4: determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position; S5: performing a corresponding operation according to the abnormal factor if the abnormal factor is present; or S6: continuing to inspect the monitored region according to the monitoring route if the abnormal factor is not present.\",\n \"Specifically, when the robot starts inspection, a two-dimensional planar map (which may be uploaded by a user or may be drawn by the robot according to an instruction, or the like) and a monitoring route (which may be defined by the user, or may be planned by the robot according to an inspection starting point, an inspection endpoint and the two-dimensional planar map, or the like) of the monitored region for inspection may be provided.\",\n \"In the course where the robot inspects the monitored region according to the monitoring route, a depth camera mounted on the robot may acquire a depth image (that is, the current depth data) that may be photographed at the current position thereof according to a specific photographing frequency (which may also be understood as a predetermined photographing time interval).\",\n \"The depth image refers to three-dimensional special coordinate data of a photographed obstacle (or a spatial object) in the monitored region relative to the depth camera.\",\n \"The current depth data may be converted, such that the depth data is converted into corresponding two-dimensional laser radar data (laser radar data may reflect a profile of the obstacle).\",\n \"The two-dimensional laser radar data is compared with the two-dimensional planar map according to the current odometer information, such that the current location of the robot in the current two-dimensional planar map is determined.\",\n \"The robot matches the current depth data acquired by the current depth camera with a previously established two-dimensional planar map, such that the position of the robot in the current monitored region is determined.\",\n \"The robot moves and carries out the inspection according to the planed monitoring route.\",\n \"The current position of the robot is determined by the robot by tracking position and posture of the robot in the two-dimensional planar map of the monitored region based on adaptive Monte Carlo localization (AMCL) and a particle filter according to the laser radar data corresponding to the current depth data and the current odometer information.\",\n \"The odometer information refers to angles executed by a motion mechanism such as a motor in the robot, a rotation count and the like.\",\n \"The odometer information is recorded in any robot that is capable of walking.\",\n \"Generally, the obstacle is located according to the profile of the obstacle that is obtained by conversion of the current depth data.\",\n \"The current odometer information is needed for the sake of ensuring that a more accurate position may be determined in the two-dimensional planar map.\",\n \"For example, the current depth data may be the profile of a chair whereas there are three chairs in the two-dimensional planar map; in this case, the chair needs to be located according to the current odometer information, such that the current position of the robot in the two-dimensional planar map is determined.\",\n \"The current odometer information may indicate that the motor walks for 10 meters leftward and then walks for 5 meters rightward, such that the current position in the two-dimensional planar map is determined according to the profile of a chair parsed according to current attempt data.\",\n \"In addition to determining the current position according to the current depth data, the current odometer information and the two-dimensional planar map, whether an abnormal factor is present at the current position may be further judged according to the current data, for example, whether a person (a living body) is detected, and whether a new obstacle and the like that is not marked in the two-dimensional planar map is detected during the inspection.\",\n \"In this way, different operations are performed according to different abnormal factors.\",\n \"If everything is normal, the robot continues the inspection according to the monitoring route.\",\n \"In this embodiment, the robot may inspect the monitored region according to the monitoring route, such that labor force is reduced and no camera needs to be deployed in the monitored region, in addition, if an abnormal factor is detected during the inspection, some measures may be timely taken.\",\n \"In another embodiment of the present disclosure, based on the above embodiment, as illustrated in FIG.\",\n \"8, prior to step S3, the method further includes: S1: upon receipt of a map establishment instruction, traversing, by the robot, the monitored region, and establishing the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and S2: planning the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.\",\n \"Specifically, when the robot desires to inspect a monitored region, the two-dimensional planar map of this monitored region needs to be inevitably acquired, to plan the monitoring route and determine the current position during the inspection and the like.\",\n \"In this embodiment, the two-dimensional planar map is established by the robot, and prior to the normal inspection, an operating personnel controls the robot to traverse the monitored region to be inspected.\",\n \"When the robot walks in the monitored region, the robot acquires depth data of each obstacle in the monitored region by using the depth camera mounted on the head of the robot, and then establishes the two-dimensional planar map according to the acquired odometer information corresponding to the depth data.\",\n \"In this way, the robot may establish the two-dimensional planar map while walking.\",\n \"After the robot traverses the monitored region, the two-dimensional planar map is established.\",\n \"Nevertheless, prior to the normal inspection, a random route-changing program inside the robot may control the robot to traverse the monitored region, so as to establish the two-dimensional planar map.\",\n \"After the two-dimensional planar map is acquired, the operating personnel may input the inspection starting point and the inspection endpoint, such that the robot plans the monitoring route according to the two-dimensional planar map, which is more intelligent and labor-saving.\",\n \"During planning of the monitoring route by the robot according to the established two-dimensional planar map, the Dijkstra optimal path algorithm is employed to calculate a least-expenditure path from the inspection starting point to the inspection endpoint in the two-dimensional planar map, and use the path as the monitoring route of the robot.\",\n \"Preferably, as illustrated in FIG.\",\n \"8, step S1 specifically includes the following steps: S11: upon receipt of the map establishment instruction, traversing, by the robot, the monitored region, and acquiring the depth data of each obstacle in the monitored region during the traversing; S12: projecting the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data; and S13: establishing the two-dimensional planar map of the monitored region according to the laser radar data (the corresponding depth data) and odometer information corresponding to the laser radar data.\",\n \"Specifically, the two-dimensional planar map (that is, a two-dimensional grid map) of an unknown environment (that is, a monitored region) is established by using the Gmapping algorithm in the simultaneous localization and mapping (SLAM), and the specific process is as follows: 1) The depth camera may acquire a depth image (that is, the depth data, or depth distance data) during the course of traversing the monitored region, and may convert three-dimensional spatial depth data into two-dimensional laser radar data by projecting the depth data within the predetermined height range onto the horizontal plane of the depth camera.\",\n \"For example, if the height from the depth camera to the ground is Z=50 cm, and the predetermined height range is set to 0 to 100 cm, the depth data satisfying the height of 0 to 100 cm is projected onto the horizontal plane with the height of Z=50, such that the corresponding two-dimensional laser radar data is acquired.\",\n \"2) The Gmapping algorithm finally constructs the two-dimensional grid map of the unknown environment (that is, the two-dimensional planar map of the monitored region) by virtue of particle filtering according to the laser radar data obtained upon conversion in combination with the odometer information of the robot.\",\n \"As illustrated in FIG.\",\n \"2, in the course where the robot carries out security inspection, four pieces of information are mainly included: (1) a two-dimensional planar map of an inspection environment (that is, the monitored region) established by the robot; (2) an inspection starting position (inspection starting point) A; (3) an inspection destination position (inspection endpoint) B; and (4) an inspection path (that is, the monitoring route) planed by the robot from the inspection starting point A to the inspection endpoint B.\",\n \"In another embodiment of the present disclosure, based on the above embodiment, as illustrated in FIG.\",\n \"7, step S4 of determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position includes the following steps: S41: judging whether there is an obstacle not marked in the two-dimensional planar map, considering that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or considering that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and step S5 includes the following steps: S510: if there is an obstacle not marked, marking the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, and updating the two-dimensional planar map; and S511: updating the monitoring route according to the current position and the updated two-dimensional planar map, and inspecting the monitored region according to the updated monitoring route.\",\n \"Specifically, if there is no abnormal factor, the robot may carry out inspection according to the monitoring route in combination with the current position.\",\n \"However, if there is no obstacle not marked in the two-dimensional planar map during the progress of the robot, it is considered that an abnormal factor is detected, and the obstacle may be marked in the two-dimensional planar map to update the two-dimensional planar map of the monitored region.\",\n \"The obstacle not marked is marked in the two-dimensional planar map by using the same method for establishing the two-dimensional planar map.\",\n \"After the two-dimensional planar map is updated, the robot may re-plan the monitoring route according to the current position, the endpoint of the original monitoring route and the updated two-dimensional planar map, and continue the inspection according to the current position and the updated monitoring route.\",\n \"The robot may update the monitoring route thereof according to the updated two-dimensional planar map.\",\n \"Therefore, the inspection is more flexible and achieves a better inspection result.\",\n \"In another embodiment of the present disclosure, based on the above embodiment, as illustrated in FIG.\",\n \"9, step S4 of determining, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judging whether an abnormal factor is present at the current position includes the following steps: S42: judging whether human skeleton data is identified, considering that the abnormal factor is present if the human skeleton data is identified, or considering that the abnormal factor is not present if the human skeleton data is not identified; and step S5 includes the following steps: S520: moving towards a living body corresponding to the human skeleton data if the human skeleton data is identified; S521: acquiring a current facial feature of the living body; S522: matching the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired; S523: considering that the abnormal factor is not present if the matching is successful; and S524: performing the tracking operation for the living body and generating the alarm information if the matching is unsuccessful.\",\n \"Specifically, in addition to judging whether there is an obstacle not marked in the two-dimensional planar map according to the current depth data, the robot may further judge whether human skeleton data is identified, such that whether there is a living body during the inspection is judged, to judge whether the abnormal factor is present at the current position.\",\n \"Whether there is an obstacle not marked is firstly judged, and then whether the human skeleton data is identified is judged; or whether the human skeleton data is identified is firstly judged, and then whether there is an obstacle not marked is judged; or the two judgments are performed parallelly.\",\n \"The time sequence of the judgments is not specifically limited.\",\n \"As illustrated in FIG.\",\n \"3, using a living body as an example, identification of human skeleton data is as follows: The human skeleton data has been identified if the current depth image (that is, the current depth data) acquired by the depth camera includes lines as illustrated in FIG.\",\n \"3.Once the human skeleton data is identified, it is considered that the robot has detected an abnormal factor, and the robot may perform a corresponding operation according to the identified skeleton data.\",\n \"As illustrated in FIG.\",\n \"4, using a living body as an example, after the human skeleton data is detected, since whether the person is a secure factor or not needs to be judged, the robot needs to approach this person to acquire the current facial feature of the person, and judge whether the current living body is a secure factor is judged by means of face recognition.\",\n \"The face recognition may include the following steps: When the robot detects the human skeleton data, the robots approaches the person, and detects the current facial feature of the person by using an RGB camera of the robot.\",\n \"The current facial feature is matched with various facial features stored in a predetermined living body facial feature database; if the matching is successful, identity verification is completed and the person is not tracked; and if the matching is unsuccessful, the person is identified as a dangerous factor (a stranger).\",\n \"The predetermined living body facial feature database may store a plurality of predetermined facial features, wherein the plurality of predetermined facial features pertain to different persons and may probably appear in the monitored region.\",\n \"If the current facial feature fails to successfully match with any of the predetermined facial features, this person is a stranger and is a dangerous factor.\",\n \"As such, the person needs to be tracked, and alarm information needs to be generated.\",\n \"Generation of the alarm information is performing a corresponding operation according to a predefined security policy or a guardian operation.\",\n \"For example, the predefined security policy is generating a buzzer alarm, and the guardian operation is sending the alarm information or the like to the guardian.\",\n \"If the current facial feature successfully matches with any of the predetermined facial features, the person is not a dangerous factor and no abnormal factor is present.\",\n \"As such, the robot may continue the inspection according to the monitoring route.\",\n \"If the robot deviates from the monitoring route during acquisition of the current facial feature, the robot may return to the origin upon judging that no abnormal factor is present, and continue the inspection according to the monitoring route; or the robot may determine the current position, and re-plans the monitoring route or the like according to the current position and the inspection terminal.\",\n \"Preferably, following step S521, the method further includes the following steps: S525: acquiring password information from the living body if the current facial feature of the living body is not successfully acquired; S526: matching the acquired password information with predetermined password information in a predetermined password database; S523: considering that the abnormal factor is not present if the matching is successful; and S524: performing the tracking operation for the living body and generating the alarm information if the matching is unsuccessful.\",\n \"Specifically, in case of night and insufficient light, the RGB camera fails to normally identify the face of a person under test, and perform identity verification for the person under test by virtue of voice password.\",\n \"When the robot finds that the current facial feature of the living body fails to be successfully acquired, the robot may acquire password information from the living body.\",\n \"For example, the robot asks the living body for the password information; upon hearing the voice message from the robot, the living body may report the password information; and the robot receives the password information reported by the living body via the microphone array, and then matches the received password information with predetermined password information stored in a predetermined password database.\",\n \"The predetermined password database may store a plurality of pieces of predetermined password information.\",\n \"The matching is considered to be successful as long as the password information reported by the living body matches with any of the plurality of pieces of predetermined password information, and the matching is considered to be unsuccessful as long as the password information reported by the living body fails to match with any of plurality of pieces of predetermined password information.\",\n \"The predetermined password information may be a sentence, a song title or the like, which may be freely defined by the guardian (that is, the user of the robot).\",\n \"When the matching is successful, the robot considers that the current living body is not a dangerous factor and no abnormal factor is present, and in this case, the robot continues the inspection according to the monitoring route; and when the matching is unsuccessful, the robot considers that the current living body is a dangerous factor, performing a tacking operation for the living body and generates alarm information.\",\n \"Generation of the alarm information is performing a corresponding operation according to a predefined security policy or a guardian operation.\",\n \"For example, the predefined security policy is generating a buzzer alarm, and the guardian operation is sending the alarm information or the like to the guardian.\",\n \"In another embodiment of the present disclosure, based on the above embodiment, as illustrated in FIG.\",\n \"10, the method further includes the following steps: S7: in the course where the robot inspects the monitored region according to the monitoring route, acquiring a current smoke concentration value if a predetermined detection time interval is reached; S8: judging whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; S9: generating alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold; or S10: continuing to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.\",\n \"Specifically, in the course where the robot carries out inspection according to the monitoring route, a smoke sensor thereof may measure the smoke concentration value of the monitored region, and the robot may judge the acquired current smoke concentration value.\",\n \"If the smoke concentration value exceeds the predetermined smoke concentration threshold, the robot considers that a dangerous factor is present and generates alarm information.\",\n \"Generation of the alarm information is performing a corresponding operation according to a predefined security policy or a guardian operation.\",\n \"For example, the predefined security policy is generating a buzzer alarm, and the guardian operation is sending the alarm information or the like to the guardian.\",\n \"Judgment of the current smoke concentration value, identification of the human skeleton data and detection of the obstacle not marked may be performed parallelly, or may be performed according to a time sequence.\",\n \"For example, when the current position is determined, whether a current smoke attempt value exceeds the predetermined smoke concentration threshold is firstly judged; if the current smoke attempt value exceeds the predetermined smoke concentration threshold, the robot generates alarm information and waits for the guardian to process; if the current smoke attempt value does not exceed the predetermined smoke concentration threshold, whether the human skeleton data is identified is judged; if the human skeleton data is identified, the robot acquires the current facial feature or password information and performs matching thereof; if the matching is unsuccessful, the robot performs a tacking operation, and generates alarm information; if the matching is successful, the robot further judges whether an obstacle not marked is detected; if no obstacle not marked is detected, the robot continues the inspection according to the monitoring route and repeats the above steps; and if the obstacle not marked is detected, the robot updates the two-dimensional planar map, carries out the inspection according to the updated monitoring route and repeats the above steps.\",\n \"Inspection by using the robot reduces the labor force, and achieves flexible monitoring.\",\n \"The depth camera has the night vision function, is capable of feeding back, generating alarms and proactively tracking abnormal factors, smoke concentrations and the like, and thus achieves a better monitoring effect.\",\n \"As illustrated in FIG.\",\n \"5, a robot for use in the security inspection method according to the above technical solution includes: a depth camera 1, mainly configured to acquire depth data of an indoor object relative to the robot, and an internal structure of a living body, so as to establish a two-dimensional grid map of a monitored region and locate the robot; wherein since the depth camera employs an infrared ray structure to detect the depth of the object, in the dark night, the depth camera is still capable of operating; an RGB camera 2, configured to acquire a color image of the monitored region for face recognition and scenario view; a smoke sensor 3, configured to sense smoke in the monitored region; a microphone array 4, configured to pick up an external sound or make an approximate judgment for the direction of a sound source; and a speaker 5, configured to play sounds, such as inquiries and alarms.\",\n \"In another embodiment of the present disclosure, as illustrated in FIG.\",\n \"11, a robot includes: a data acquiring module 10, configured to, in a course wherein a robot inspects a monitored region according to a monitoring route, acquire current depth data if a predetermined photographing time interval is reached; wherein the current depth data includes: distance data of an obstacle relative to the robot in a current monitoring region, and an internal structure of a living body (if there is a living body); a judging module 20, configured to, determine, according to the current depth data, current odometer information and a two-dimensional planar map of the monitored region, a current position of the robot in the two-dimensional planar map, and judge whether an abnormal factor is present at the current position; and an executing module 30, configured to, perform a corresponding operation according to the abnormal factor if the abnormal factor is present, or continue to inspect the monitored region according to the monitoring route if the abnormal factor is not present.\",\n \"Specifically, when the robot starts inspection, a two-dimensional planar map (which may be uploaded by a user or may be drawn by the robot according to an instruction, or the like) and a monitoring route (which may be defined by the user, or may be planned by the robot according to an inspection starting point, an inspection endpoint and the two-dimensional planar map, or the like) of the monitored region for inspection may be provided.\",\n \"The data acquiring module is the depth camera of the robot.\",\n \"In the course where the robot inspects the monitored region according to the monitoring route, a depth camera mounted on the robot may acquire a depth image (that is, the current depth data) that may be photographed at the current position thereof according to a specific photographing frequency (which may also be understood as a predetermined photographing time interval).\",\n \"The depth image refers to three-dimensional special coordinate data of a photographed obstacle (or a spatial object) in the monitored region relative to the depth camera.\",\n \"The current depth data may be converted, such that the depth data is converted into corresponding two-dimensional laser radar data (laser radar data may reflect a profile of the obstacle).\",\n \"The two-dimensional laser radar data is compared with the two-dimensional planar map according to the current odometer information, such that the current location of the robot in the current two-dimensional planar map is determined.\",\n \"The robot matches the current depth data acquired by the current depth camera with a previously established two-dimensional planar map, such that the position of the robot in the current monitored region is determined.\",\n \"The robot moves and carries out the inspection according to the planed monitoring route.\",\n \"The current position of the robot is determined by the robot by tracking position and posture of the robot in the two-dimensional planar map of the monitored region based on adaptive Monte Carlo localization (AMCL) and a particle filter according to the laser radar data corresponding to the current depth data and the current odometer information.\",\n \"The odometer information refers to angles executed by a motion mechanism such as a motor in the robot, a rotation count and the like.\",\n \"The odometer information is recorded in any robot that is capable of walking.\",\n \"Generally, the obstacle is located according to the profile of the obstacle that is obtained by conversion of the current depth data.\",\n \"The current odometer information is needed for the sake of ensuring that a more accurate position may be determined in the two-dimensional planar map.\",\n \"For example, the current depth data may be the profile of a chair whereas there are three chairs in the two-dimensional planar map; in this case, the chair needs to be located according to the current odometer information, such that the current position of the robot in the two-dimensional planar map is determined.\",\n \"The current odometer information may indicate that the motor walks for 15 meters leftward and then walks for 7 meters rightward, such that the current position in the two-dimensional planar map is determined according to the profile of a chair parsed according to current attempt data.\",\n \"In addition to determining the current position according to the current depth data, the current odometer information and the two-dimensional planar map, whether an abnormal factor is present at the current position may be further judged according to the current data, for example, whether a person (a living body) is detected, and whether a new obstacle and the like that is not marked in the two-dimensional planar map is detected during the inspection.\",\n \"In this way, different operations are performed according to different abnormal factors.\",\n \"If everything is normal, the robot continues the inspection according to the monitoring route.\",\n \"In this embodiment, the robot may inspect the monitored region according to the monitoring route, such that labor force is reduced and no camera needs to be deployed in the monitored region, in addition, if an abnormal factor is detected during the inspection, an action may be timely taken.\",\n \"In another embodiment of the present disclosure, based on the above embodiment, as illustrated in FIG.\",\n \"12, the executing module 30 includes: a map establishing submodule 31, configured to, upon receipt of a map establishment instruction, traverse the monitored region, and establish the two-dimensional planar map of the monitored region according to depth data of each obstacle in the monitored region and odometer information corresponding to the depth data acquired during the traversing; and a route planning submodule 32, configured to plan the monitoring route according to an inspection starting point, an inspection endpoint and the two-dimensional planar map.\",\n \"Specifically, when the robot desires to inspect a monitored region, the two-dimensional planar map of this monitored region needs to be inevitably acquired, to plan the monitoring route and determine the current position during the inspection and the like.\",\n \"In this embodiment, the two-dimensional planar map is established by the robot, and prior to the normal inspection, an operating personnel controls the robot to traverse the monitored region to be inspected.\",\n \"When the robot walks in the monitored region, the robot acquires depth data of each obstacle in the monitored region by using the depth camera mounted on the head of the robot, and then establishes the two-dimensional planar map according to the acquired odometer information corresponding to the depth data.\",\n \"In this way, the robot may establish the two-dimensional planar map while walking.\",\n \"After the robot traverses the monitored region, the two-dimensional planar map is established.\",\n \"Nevertheless, prior to the normal inspection, a random route-changing program inside the robot may control the robot to traverse the monitored region, so as to establish the two-dimensional planar map.\",\n \"After the two-dimensional planar map is acquired, the operating personnel may input the inspection starting point and the inspection endpoint, such that the robot plans the monitoring route according to the two-dimensional planar map, which is more intelligent and labor-saving.\",\n \"During planning of the monitoring route by the robot according to the established two-dimensional planar map, the Dijkstra optimal path algorithm is employed to calculate a least-expenditure path from the inspection starting point to the inspection endpoint in the two-dimensional planar map, and use the path as the monitoring route of the robot.\",\n \"Preferably, the data acquiring module 10 is further configured to, upon receipt of the map establishment instruction, traverse the monitored region, and acquire the depth data of each obstacle in the monitored region during the traversing; and the map establishing submodule 31 is further configured to, project the depth data within a predetermined height range onto a predetermined horizontal plane to obtain corresponding two-dimensional laser radar data (the corresponding depth data); and establish the two-dimensional planar map of the monitored region according to the laser radar data and odometer information corresponding to the laser radar data.\",\n \"Specifically, the two-dimensional planar map (that is, a two-dimensional grid map) of an unknown environment (that is, a monitored region) is established by using the Gmapping algorithm in the simultaneous localization and mapping (SLAM), and the specific process is as follows: 1) The depth camera may acquire a depth image (that is, the depth data, or depth distance data) in the course of traversing the monitored region, and may convert three-dimensional spatial depth data into two-dimensional laser radar data by projecting the depth data within the predetermined height range onto the horizontal plane of the depth camera.\",\n \"For example, if the height from the depth camera to the ground is Z=50 cm, and the predetermined height range is set to 0 to 100 cm, the depth data satisfying the height of 0 to 100 cm is projected onto the horizontal plane with the height of Z=50, such that the corresponding two-dimensional laser radar data is acquired.\",\n \"2) The Gmapping algorithm finally constructs the two-dimensional grid map of the unknown environment (that is, the two-dimensional planar map of the monitored region) by virtue of particle filtering according to the laser radar data obtained upon conversion in combination with the odometer information of the robot.\",\n \"In another embodiment of the present disclosure, based on the above embodiment, the judging module 20 is further configured to, judge whether there is an obstacle not marked in the two-dimensional planar map, consider that the abnormal factor is present if there is an obstacle not marked in the two-dimensional planar map, or consider that the abnormal factor is not present if there is no obstacle not marked in the two-dimensional planar map; and the executing module 30 is further configured to, if there is an obstacle not marked, mark the obstacle not marked in the two-dimensional planar map according to the current depth data and the current odometer information, update the two-dimensional planar map, update the monitoring route according to the current position and the updated two-dimensional planar map, and inspect the monitored region according to the updated monitoring route.\",\n \"Specifically, if there is no abnormal factor, the robot may carry out inspection according to the monitoring route in combination with the current position.\",\n \"However, if there is no obstacle not marked in the two-dimensional planar map during the progress of the robot, it is considered that an abnormal factor is detected, and the obstacle may be marked in the two-dimensional planar map to update the two-dimensional planar map of the monitored region.\",\n \"The obstacle not marked is marked in the two-dimensional planar map by using the same method for establishing the two-dimensional planar map.\",\n \"After the two-dimensional planar map is updated, the robot may re-plan the monitoring route according to the current position, the endpoint of the original monitoring route and the updated two-dimensional planar map, and continue the inspection according to the current position and the updated monitoring route.\",\n \"The robot may update the monitoring route thereof according to the updated two-dimensional planar map.\",\n \"Therefore, the inspection is more flexible and achieves a better inspection result.\",\n \"In another embodiment of the present disclosure, based on the above embodiment, the judging module 20 is further configured to: judge whether human skeleton data is identified, consider that the abnormal factor is present if the human skeleton data is identified, or consider that the abnormal factor is not present if the human skeleton data is not identified; and the executing module 30 is further configured to: move towards a living body corresponding to the human skeleton data if the human skeleton data is identified; acquire a current facial feature of the living body; match the current facial feature with a predetermined facial feature in a predetermined living body facial feature database if the current facial feature of the living body is successfully acquired, consider that the abnormal factor is not present if the matching is successful, perform a tracking operation for the living body and generating alarm information if the matching is unsuccessful.\",\n \"Specifically, in addition to judging whether there is an obstacle not marked in the two-dimensional planar map according to the current depth data, the robot may further judge whether human skeleton data is identified, such that whether there is a living body during the inspection is judged, to judge whether the abnormal factor is present at the current position.\",\n \"Whether there is an obstacle not marked is firstly judged, and then whether the human skeleton data is identified is judged; or whether the human skeleton data is identified is firstly judged, and then whether there is an obstacle not marked is judged; or the two judgments are performed parallelly.\",\n \"The time sequence of the judgments is not specifically limited.\",\n \"The RGB camera of the robot acquires the current facial feature of the living body.\",\n \"The predetermined living body facial feature database may store a plurality of predetermined facial features, wherein the plurality of predetermined facial features pertain to different persons and may probably appear in the monitored region.\",\n \"If the current facial feature fails to successfully match any of the predetermined facial features, this person is a stranger and is a dangerous factor.\",\n \"As such, the person needs to be tracked, and alarm information needs to be generated.\",\n \"Generation of the alarm information is performing a corresponding operation according to a predefined security policy or a guardian operation.\",\n \"For example, the predefined security policy is generating a buzzer (or speaker) alarm, and the guardian operation is sending the alarm information or the like to the guardian.\",\n \"If the current facial feature successfully matches with any of the predetermined facial features, the person is not a dangerous factor and no abnormal factor is present.\",\n \"As such, the robot may continue the inspection according to the monitoring route.\",\n \"If the robot deviates from the monitoring route during acquisition of the current facial feature, the robot may return to the origin upon judging that no abnormal factor is present, and continue the inspection according to the monitoring route; or the robot may determine the current position, and re-plans the monitoring route or the like according to the current position and the inspection terminal.\",\n \"Preferably, the executing module 30 is further configured to: acquire password information from the living body if the current facial feature of the living body is not successfully acquired; and match the acquired password information with predetermined password information in a predetermined password database, consider that the abnormal factor is not present if the matching is successful, and perform the tracking operation for the living body and generate the alarm information if the matching is unsuccessful.\",\n \"Specifically, the living body is queried by using the speaker, and the password information is acquired by using the microphone array.\",\n \"In case of night and insufficient light, the RGB camera fails to normally identify the face of a person under test, and perform identity verification for the person under test by virtue of voice password.\",\n \"When the robot finds that the current facial feature of the living body fails to be successfully acquired, the robot may acquire password information from the living body.\",\n \"For example, the robot asks the living body for the password information; upon hearing the voice message from the robot, the living body may report the password information; and the robot receives the password information reported by the living body via the microphone array, and then matches the received password information with predetermined password information stored in a predetermined password database.\",\n \"The predetermined password database may store a plurality of pieces of predetermined password information.\",\n \"The matching is considered to be successful as long as the password information reported by the living body matches with any of the plurality of pieces of predetermined password information, and the matching is considered to be unsuccessful as long as the password information reported by the living body fails to match with any of plurality of pieces of predetermined password information.\",\n \"The predetermined password information may be a sentence, a song title or the like, which may be freely defined by the guardian (that is, the user of the robot).\",\n \"When the matching is successful, the robot considers that the current living body is not a dangerous factor and no abnormal factor is present, and in this case, the robot continues the inspection according to the monitoring route; and when the matching is unsuccessful, the robot considers that the current living body is a dangerous factor, performs a tacking operation for the living body and generates alarm information.\",\n \"Generation of the alarm information is performing a corresponding operation according to a predefined security policy or a guardian operation.\",\n \"For example, the predefined security policy is generating a buzzer alarm, and the guardian operation is sending the alarm information or the like to the guardian.\",\n \"In another embodiment of the present disclosure, based on the above embodiment, as illustrated in FIG.\",\n \"12, the robot further includes: a smoke detecting module 40, configured to, in the course where the robot inspects the monitored region according to the monitoring route, acquire a current smoke concentration value if a detection photographing time interval is reached; wherein the judging module 20 is further configured to judge whether the current smoke concentration value exceeds a predetermined smoke concentration threshold; and wherein the executing module 30 is further configured to generate alarm information if the current smoke concentration value exceeds the predetermined smoke concentration threshold, and continue to inspect the monitored region according to the monitoring route if the smoke concentration value does not exceed the predetermined smoke concentration threshold.\",\n \"Specifically, the smoke detecting module is a smoke sensor of the robot.\",\n \"The smoke sensor may acquires the current smoke concentration value at a predetermined frequency, that is, in the course where the robot inspects the monitored region according to the monitoring route, the smoke detecting module acquires the current smoke concentration value if the predetermined detection time interval is reached.\",\n \"In the course where the robot carries out inspection according to the monitoring route, a smoke sensor thereof may measure the smoke concentration value of the monitored region, and the robot may judge the acquired current smoke concentration value.\",\n \"If the smoke concentration value exceeds the predetermined smoke concentration threshold, the robot considers that a dangerous factor is present and generates alarm information.\",\n \"Generation of the alarm information is performing a corresponding operation according to a predefined security policy or a guardian operation.\",\n \"For example, the predefined security policy is generating a buzzer alarm, and the guardian operation is sending the alarm information or the like to the guardian.\",\n \"Judgment of the current smoke concentration value, identification of the human skeleton data and detection of the obstacle not marked may be performed parallelly, or may be performed according to a time sequence.\",\n \"For example, when the current position is determined, whether a current smoke attempt value exceeds the predetermined smoke concentration threshold is firstly judged; if the current smoke attempt value exceeds the predetermined smoke concentration threshold, the robot generates alarm information and waits for the guardian to process; if the current smoke attempt value does not exceed the predetermined smoke concentration threshold, whether the human skeleton data is identified is judged; if the human skeleton data is identified, the robot acquires the current facial feature or password information and performs matching thereof; if the matching is unsuccessful, the robot performs a tacking operation, and generates alarm information; if the matching is successful, the robot further judges whether an obstacle not marked is detected; if no obstacle not marked is detected, the robot continues the inspection according to the monitoring route and repeats the above steps; and if the obstacle not marked is detected, the robot updates the two-dimensional planar map, carries out the inspection according to the updated monitoring route and repeats the above steps.\",\n \"Inspection by using the robot reduces the labor force, and achieves flexible monitoring.\",\n \"The depth camera has the night vision function, is capable of feeding back, generating alarms and proactively tracking abnormal factors, smoke concentrations and the like, and thus achieves a better monitoring effect.\",\n \"The above embodiments are merely used to illustrate the technical solutions of the present disclosure, instead of limiting the protection scope of the present disclosure.\",\n \"Any modification, equivalent replacement, or improvement made without departing from the spirit and principle of the present disclosure should fall within the protection scope defined by the appended claims of the present disclosure.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870857"}}},{"rowIdx":4493663,"cells":{"text":{"kind":"list like","value":[["System and Method For Providing a Coach with Live Training Data of an Athlete as the Athlete is Performing a Swimming Workout","An athlete tracking system and method for tracking an athlete during training sessions, such as swim training.","The system includes a mobile tracking device wearable around the athlete's chest, and a training log server for maintaining an athlete profile that includes a training record updatable by the athlete and a training plan supplied by a coach."],["1.A method for providing a coach with live training data of an athlete as the athlete is performing a swimming workout, the method comprising: creating an athlete profile on a training log server of a computer web-based platform, the training log server being configured to maintain a plurality of athlete profiles, the athlete profile including a training record having a plurality predefined fields, at least one of the fields corresponding to a distance aspect of an athlete's workout, at least another of the fields corresponding to a time aspect of the athlete's workout; updating, at the platform, a training record in the athlete profile with workout data from a mobile tracking device worn by the athlete around the athlete's chest as the athlete is performing the swimming workout, the workout data including a distance aspect and a time aspect; and permitting the coach to log onto the platform and view the training record of the athlete profile as the athlete is performing the swimming workout.","2.The method of claim 1, further comprising receiving, at the platform, at least one workout created by the selected coach and associating the workout with the athlete profile.","3.The method of claim 2, further comprising comparing the workout data for a given day with a planned workout forming part of a training plan and determining whether the athlete completed the workout as planned.","4.The method of claim 3, further comprising generating a graphical representation comparing the athlete's actual workout to the planned workout.","5.The method of claim 3, further comprising automatically deleting the workout after receiving an indication that the workout was completed by the athlete.","6.The method of claim 1, wherein the updating of the training record includes calculating a cumulative training distance for a selected interval of time using the distance aspect of the workout data from the athlete.","7.The method of claim 1, further comprising generating a calendar and populating the calendar with portions of a training plan.","8.The method of claim 1, where the tracking device is a GPS-enabled tracking device.","9.The method of claim 1, further comprising monitoring the athlete's performance during a competition and providing the coach with live data on the progress of the athlete during the competition.","10.An athlete tracking system configured to sync with an online training log of an athlete, comprising: a body strap configured to be worn about the athlete's chest, said body strap including a mobile training computer having a processor, GPS circuitry configured to permit said processor to track a position of the athlete throughout a duration of a training session, a memory, a first wireless communications radio configured for peer-to-peer communications, and a second wireless communications radio configured for non-peer-to-peer communications; and a bike computer configured to mount on a bike, said bike computer including a display and circuitry configured to receive a data stream from said mobile training computer.","11.The athlete tracking system of claim 10, wherein said first wireless communications radio is configured for peer-to-peer communications with a smart phone.","12.The athlete tracking system of claim 10, wherein said second wireless communications radio is configured to access the internet through a Wi-Fi connection to facilitate syncing of the mobile training computer with the online training log.","13.The athlete tracking system of claim 10, wherein the GPS circuitry is configured to enable live updating of the online training log as the athlete is training.","14.The athlete tracking system of claim 10, wherein said memory is configured to store training data used to update the online training log.","15.The athlete tracking system of claim 10, wherein said mobile training computer is configured to track the athlete in water during a training session.","16.The athlete tracking system of claim 10, further comprising a training log server configured to maintain a plurality of athlete profiles, each athlete profile including a training record having a plurality of fields that each correspond to a component of a training workout, said training log server being synced to said mobile training computer so that data from the mobile training computer is entered into said training record as the athlete is training.","17.The athlete tracking system of claim 16, further comprising a processor programmed to receive workout data supplied by the mobile training computer and update the training record with the workout data, the workout data including both a distance aspect and a time aspect, said processor being configured to receive a training plan from a coach and associate the training plan with the athlete profile so that the athlete may view the training plan."],[" BACKGROUND OF THE INVENTION Athletes training for a competition usually enlist the assistance of a coach to help them prepare for an upcoming competition, or to enhance their personal fitness.","Often, the athlete becomes attached to a particular coach, but then has to move to a different city for any number of reasons.","This can disrupt the athlete's training, leading to a loss of fitness, and a loss of personal time in trying to find a replacement coach in the new area in which the athlete finds themselves.","The present invention in one or more preferred embodiments seeks to provide an athlete with the ability to maintain their current relationship with a preferred coach regardless of their physical location."],[" SUMMARY The present invention in one preferred aspect is directed to a web-based platform tailored to providing access to information regarding athletic or sporting events and personal training information.","The system may include an activity calendar, which is personalizable, a training log, a media portal containing photos of a participant in an event, and a rankings generator configured to rank a user against other users within given set of parameters.","As used herein, “configured” includes creating, changing, or modifying a program on a computer or network of computers so that the computer or network of computers behave according to a set of instructions.","The programming to accomplish the various embodiments described herein will be apparent to a person of ordinary skill in the art after reviewing the present specification, and for simplicity, is not detailed herein.","It will be appreciated that in one or more embodiments, the system may include one or more work stations at a back end for use by a platform operator, one or more local client computers for access by users, and a communications network that facilitates communication between the platform, the work stations at the back end, and the client computers.","Preferably, the work stations and client computers will include a display and means for entering information, such as a keyboard and/or voice activated data entry.","Means for accessing the platform by users may include, but is not limited to personal computers and mobile devices such as tablets and smartphones, and other user devices capable of communicating over a communications network such as the Internet.","In one preferred aspect, the present invention is directed to a web-based platform for personalizing a training regimen of an athlete.","The system preferably includes a training log server configured to maintain a plurality athlete profiles, each athlete profile including a training record having a plurality of fields that each correspond to an aspect of a workout in which the athlete participated, one of the fields corresponding to a distance aspect of the workout, another of the fields corresponding to a time aspect of the workout.","The system preferably further includes a processor programmed to receive workout data supplied by the athlete and update the training record with the workout data, the workout data including both a distance aspect and a time aspect.","The processor is configured to permit the athlete to grant access to the training record to a coach so that the coach may log onto the platform and view the training record.","The processor is further configured to receive a training plan from the coach and associate the training plan with the athlete profile so that the athlete may view the training plan.","The processor may be programmed to cumulatively track at least one aspect of the athlete's workouts.","The processor may be programmed to generate a calendar incorporating at least a portion of the training plan.","The calendar may be presented as a monthly calendar.","The processor may be programmed to send a message to the athlete once the training plan has been uploaded to the platform and associated with the athlete profile.","The processor may be programmed to send a message to the coach once the athlete updates their training record.","The processor may be programmed to permit the athlete to selectively restrict access by the coach to portions of the training record.","The platform further preferably includes a media portal configured to receive media from at least one of the athlete and the coach and associate the media with the athlete profile.","In another preferred aspect, the present invention is directed to a method for personalizing a training regimen of an athlete using a computer web-based platform, the platform including a processor and a training log server configured to maintain a plurality of athlete profiles.","The method preferably includes creating an athlete profile on the training log server, the athlete profile including a training record having a plurality predefined fields, at least one of the fields corresponding to a distance aspect of an athlete's workout, at least another of the fields corresponding to a time aspect of the athlete's workout; receiving, at the platform, workout data from the athlete, the workout data including a distance aspect and a time aspect; updating the training record of the athlete profile by associating each aspect of the workout data with the corresponding field in a training record; permitting a coach to log onto the platform and view the athlete profile; and uploading a training plan from the coach to the platform and associating the training plan with the athlete profile.","The updating of the training record preferably includes calculating a cumulative training distance for a selected interval of time using the distance aspect of the workout data from the athlete.","The method preferably further includes generating a calendar and populating the calendar with portions of the training plan.","The method further preferably includes sending a message to the coach after the training record has been updated.","The method further preferably includes sending a message to the athlete after the training plan has been uploaded to the platform and associated with the athlete profile.","The method further preferably includes comparing the workout data for a given day with a planned workout forming part of the training plan and determining whether the athlete completed the workout as planned.","The method further preferably includes generating a graphical representation comparing the athlete's actual workout to the planned workout.","The workout data preferably includes data identifying a training route.","The workout data preferably includes an aspect identifying a category of workout activity.","The present disclosure in another preferred aspect sets forth a system and method for transferring an athlete's training data from a bike computer to an online training log associated with the athlete.","The system includes a bike computer mountable on a bike ridden by the athlete, the bike computer being configured to store training data accumulated during the course of a training session, the bike computer including a wireless transceiver configured for peer-to-peer communication.","The system also includes a mobile communications device having a processor and a wireless communications transceiver, the processor being configured to receive the training data from the bike computer and format the training data for transfer to the athlete's online training log.","The system also includes a web-based platform including a processor configured to receive the training data from the mobile communications device and store the training data in a training log server, the training log server having a plurality of athlete profiles, at least one of which corresponds to the athlete uploading the training data.","The wireless communications transceiver of the bike computer may utilize Wi-Fi Direct.","The wireless communications transceiver of the bike computer may utilize Bluetooth.","The mobile communications device may be paired with the bike computer.","The mobile communications device may be a smart phone.","The mobile communications device may be a tablet.","The processor of the mobile communications device may be programmed to display the formatted training data on a display of the mobile communications device.","The bike computer may be programmed to send a discovery message to the mobile communications device and automatically transfer the training data after a communications link has been established with the mobile communications device.","The bike computer may be configured to establish a peer-to-peer communications link with more than one mobile communications device.","The training data transferred to the mobile communications device may include GPS-based data.","The present disclosure in an additional preferred aspect sets forth a method for updating an online training log of a user.","The method includes establishing a peer-to-peer communications link between a mobile training computer and a mobile communications device, the mobile training computer being sized and configured to be mounted on the user's bike; transferring training data stored on the mobile training computer to the mobile communications device using the peer-to-peer communications link; formatting the training data for transfer from the mobile communications device to a web-based platform; and uploading the formatted training data to the web-based platform to update the online training log of the user.","The mobile training computer may be a bike computer.","The peer-to-peer communications link may be established using Wi-Fi Direct.","The peer-to-peer communications link may be established using Bluetooth.","The training data may be uploaded to the online training log without a USB interface.","The training data may be transferred automatically to the mobile communications device once the peer-to-peer communications link is established.","The present disclosure in further preferred aspect sets forth a system for transferring an athlete's training data from a bike computer to an online training log associated with the athlete.","The system includes a bike computer mountable on a bike ridden by the athlete, the bike computer being configured to store training data accumulated during the course of a training session, the bike computer including a wireless communications means for transmitting the training data; a mobile communications device having a processor and a wireless communications transceiver, the processor being configured to receive the training data from the bike computer and format the training data for transfer to the athlete's online training log; and a web-based platform including a processor configured to receive the training data from the mobile communications device and store the training data in a training log server, the training log server having a plurality of athlete profiles, at least one of which corresponds to the athlete uploading the training data.","The present disclosure in an additional preferred aspect sets forth a bike computer for collecting and transmitting an athlete's training data accumulated during a training session.","The bike computer includes at least one sensor for measuring data associated with a parameter of the athlete's training session; a processor configured to collect the training data from the at least one sensor; a memory for storing the training data collected by the processor; and a wireless communications means for transmitting the training data to a training log.","The bike computer may include a mount configured to detachably secure the bike computer to a bike.","The at least one sensor may include a cadence sensor.","The at least one sensor may include a heart rate sensor.","It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.","The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate several embodiments of the invention and together with the description, serve to explain the principles of the invention."],["CROSS-REFERENCE TO RELATED APPLICATIONS This Application is a continuation of U.S. application Ser.","No.","15/162,613, which is a continuation of U.S. application Ser.","No.","14/054,879, now U.S. Pat.","No.","9,345,948, which claims the benefit of U.S.","Provisional Application No.","61/715,847, the entire contents of each being incorporated by reference herein.","FIELD OF THE INVENTION The present invention relates to improvements in a system for storing training data entered by an athlete, associating information with the athlete that is related to the athlete's participation in training and/or racing activities, and generating a profile specific to the athlete for use by the athlete and/or a coach.","BACKGROUND OF THE INVENTION Athletes training for a competition usually enlist the assistance of a coach to help them prepare for an upcoming competition, or to enhance their personal fitness.","Often, the athlete becomes attached to a particular coach, but then has to move to a different city for any number of reasons.","This can disrupt the athlete's training, leading to a loss of fitness, and a loss of personal time in trying to find a replacement coach in the new area in which the athlete finds themselves.","The present invention in one or more preferred embodiments seeks to provide an athlete with the ability to maintain their current relationship with a preferred coach regardless of their physical location.","SUMMARY The present invention in one preferred aspect is directed to a web-based platform tailored to providing access to information regarding athletic or sporting events and personal training information.","The system may include an activity calendar, which is personalizable, a training log, a media portal containing photos of a participant in an event, and a rankings generator configured to rank a user against other users within given set of parameters.","As used herein, “configured” includes creating, changing, or modifying a program on a computer or network of computers so that the computer or network of computers behave according to a set of instructions.","The programming to accomplish the various embodiments described herein will be apparent to a person of ordinary skill in the art after reviewing the present specification, and for simplicity, is not detailed herein.","It will be appreciated that in one or more embodiments, the system may include one or more work stations at a back end for use by a platform operator, one or more local client computers for access by users, and a communications network that facilitates communication between the platform, the work stations at the back end, and the client computers.","Preferably, the work stations and client computers will include a display and means for entering information, such as a keyboard and/or voice activated data entry.","Means for accessing the platform by users may include, but is not limited to personal computers and mobile devices such as tablets and smartphones, and other user devices capable of communicating over a communications network such as the Internet.","In one preferred aspect, the present invention is directed to a web-based platform for personalizing a training regimen of an athlete.","The system preferably includes a training log server configured to maintain a plurality athlete profiles, each athlete profile including a training record having a plurality of fields that each correspond to an aspect of a workout in which the athlete participated, one of the fields corresponding to a distance aspect of the workout, another of the fields corresponding to a time aspect of the workout.","The system preferably further includes a processor programmed to receive workout data supplied by the athlete and update the training record with the workout data, the workout data including both a distance aspect and a time aspect.","The processor is configured to permit the athlete to grant access to the training record to a coach so that the coach may log onto the platform and view the training record.","The processor is further configured to receive a training plan from the coach and associate the training plan with the athlete profile so that the athlete may view the training plan.","The processor may be programmed to cumulatively track at least one aspect of the athlete's workouts.","The processor may be programmed to generate a calendar incorporating at least a portion of the training plan.","The calendar may be presented as a monthly calendar.","The processor may be programmed to send a message to the athlete once the training plan has been uploaded to the platform and associated with the athlete profile.","The processor may be programmed to send a message to the coach once the athlete updates their training record.","The processor may be programmed to permit the athlete to selectively restrict access by the coach to portions of the training record.","The platform further preferably includes a media portal configured to receive media from at least one of the athlete and the coach and associate the media with the athlete profile.","In another preferred aspect, the present invention is directed to a method for personalizing a training regimen of an athlete using a computer web-based platform, the platform including a processor and a training log server configured to maintain a plurality of athlete profiles.","The method preferably includes creating an athlete profile on the training log server, the athlete profile including a training record having a plurality predefined fields, at least one of the fields corresponding to a distance aspect of an athlete's workout, at least another of the fields corresponding to a time aspect of the athlete's workout; receiving, at the platform, workout data from the athlete, the workout data including a distance aspect and a time aspect; updating the training record of the athlete profile by associating each aspect of the workout data with the corresponding field in a training record; permitting a coach to log onto the platform and view the athlete profile; and uploading a training plan from the coach to the platform and associating the training plan with the athlete profile.","The updating of the training record preferably includes calculating a cumulative training distance for a selected interval of time using the distance aspect of the workout data from the athlete.","The method preferably further includes generating a calendar and populating the calendar with portions of the training plan.","The method further preferably includes sending a message to the coach after the training record has been updated.","The method further preferably includes sending a message to the athlete after the training plan has been uploaded to the platform and associated with the athlete profile.","The method further preferably includes comparing the workout data for a given day with a planned workout forming part of the training plan and determining whether the athlete completed the workout as planned.","The method further preferably includes generating a graphical representation comparing the athlete's actual workout to the planned workout.","The workout data preferably includes data identifying a training route.","The workout data preferably includes an aspect identifying a category of workout activity.","The present disclosure in another preferred aspect sets forth a system and method for transferring an athlete's training data from a bike computer to an online training log associated with the athlete.","The system includes a bike computer mountable on a bike ridden by the athlete, the bike computer being configured to store training data accumulated during the course of a training session, the bike computer including a wireless transceiver configured for peer-to-peer communication.","The system also includes a mobile communications device having a processor and a wireless communications transceiver, the processor being configured to receive the training data from the bike computer and format the training data for transfer to the athlete's online training log.","The system also includes a web-based platform including a processor configured to receive the training data from the mobile communications device and store the training data in a training log server, the training log server having a plurality of athlete profiles, at least one of which corresponds to the athlete uploading the training data.","The wireless communications transceiver of the bike computer may utilize Wi-Fi Direct.","The wireless communications transceiver of the bike computer may utilize Bluetooth.","The mobile communications device may be paired with the bike computer.","The mobile communications device may be a smart phone.","The mobile communications device may be a tablet.","The processor of the mobile communications device may be programmed to display the formatted training data on a display of the mobile communications device.","The bike computer may be programmed to send a discovery message to the mobile communications device and automatically transfer the training data after a communications link has been established with the mobile communications device.","The bike computer may be configured to establish a peer-to-peer communications link with more than one mobile communications device.","The training data transferred to the mobile communications device may include GPS-based data.","The present disclosure in an additional preferred aspect sets forth a method for updating an online training log of a user.","The method includes establishing a peer-to-peer communications link between a mobile training computer and a mobile communications device, the mobile training computer being sized and configured to be mounted on the user's bike; transferring training data stored on the mobile training computer to the mobile communications device using the peer-to-peer communications link; formatting the training data for transfer from the mobile communications device to a web-based platform; and uploading the formatted training data to the web-based platform to update the online training log of the user.","The mobile training computer may be a bike computer.","The peer-to-peer communications link may be established using Wi-Fi Direct.","The peer-to-peer communications link may be established using Bluetooth.","The training data may be uploaded to the online training log without a USB interface.","The training data may be transferred automatically to the mobile communications device once the peer-to-peer communications link is established.","The present disclosure in further preferred aspect sets forth a system for transferring an athlete's training data from a bike computer to an online training log associated with the athlete.","The system includes a bike computer mountable on a bike ridden by the athlete, the bike computer being configured to store training data accumulated during the course of a training session, the bike computer including a wireless communications means for transmitting the training data; a mobile communications device having a processor and a wireless communications transceiver, the processor being configured to receive the training data from the bike computer and format the training data for transfer to the athlete's online training log; and a web-based platform including a processor configured to receive the training data from the mobile communications device and store the training data in a training log server, the training log server having a plurality of athlete profiles, at least one of which corresponds to the athlete uploading the training data.","The present disclosure in an additional preferred aspect sets forth a bike computer for collecting and transmitting an athlete's training data accumulated during a training session.","The bike computer includes at least one sensor for measuring data associated with a parameter of the athlete's training session; a processor configured to collect the training data from the at least one sensor; a memory for storing the training data collected by the processor; and a wireless communications means for transmitting the training data to a training log.","The bike computer may include a mount configured to detachably secure the bike computer to a bike.","The at least one sensor may include a cadence sensor.","The at least one sensor may include a heart rate sensor.","It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.","The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate several embodiments of the invention and together with the description, serve to explain the principles of the invention.","BRIEF DESCRIPTION OF THE FIGURES FIG.","1 is a diagram of system components in accordance with a preferred embodiment of the present invention.","FIG.","2A is a preferred embodiment of a graphical user interface with fields for events for use in generating an activity calendar.","FIG.","2B is a preferred embodiment of a graphical user interface with fields for portions of a training plan for use in generating an activity calendar.","FIG.","3 is a front view of the activity calendar generated by the graphical user interfaces of FIGS.","2A and 2B.","FIG.","4 is a preferred embodiment of a graphical user interface for use in generating a personal training log.","FIG.","5 is a preferred embodiment of a graphical user interface for use in generating a summary portion of the personal training log of FIG.","4.FIG.","6 is a preferred embodiment of a graphical user interface for use in creating a new route portion of the personal training log of FIG.","4.FIG.","7 is a preferred embodiment of a graphical user interface for use in generating an equipment tracker portion of the personal training log of FIG.","4.FIG.","8 is a preferred embodiment of a graphical user interface for use in generating a coaching dashboard in accordance with another preferred embodiment of the present invention.","FIG.","9 is system pictoral diagram showing the interaction between a user, the platform of FIG.","1, and a local workstation of a coach.","DETAILED DESCRIPTION OF THE DRAWINGS Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings.","FIG.","1 shows a preferred embodiment of a system 100 that includes a computer web-based platform 102 for preferably providing a user with access to an array of information regarding upcoming event information, event results, training plans and workouts, rankings information and media pertinent to the user's participation in a given event.","Platform 102 preferably includes a processor 104, a database server 106 for maintaining an events database 108 that includes a listing of athletic events, a results database 110 that includes results of athletic competitions, a user database 112 that includes records of registered users, a media database 114, a training log server 116, a training log database 118, and a rankings generator 120.The preferred components of platform 102 and their interaction with each other are described further below.","Platform 102 is preferably a computer web-based system accessible by content providers and users.","Content providers are preferably individuals or entities that upload or otherwise provide content or data to the platform relating to one or more athletic events or training activities.","Content may include, but is not limited to results from athletic competitions, training plans and workouts supplied by a third party such as a coach, and media content such as photographs or video from third party providers.","As used herein, a third party is a person or business entity that provides content on a commercial basis.","Athletic events may include, but are not limited to running races, bike races, swim meets, triathlons, duathlons and other competitions pitting an individual or team against other individuals or teams.","Users are preferably individuals or entities desiring access to the content provided by the content providers.","Such users may include an individual interested in an upcoming event, a race result, a training plan or workout, and/or media pertaining to an event.","Users may also include individuals such as athletes who supply data to the platform pertaining to their training in order to generate a training log, or coaches who supply or upload a training plan to the platform for purposes of coaching an athlete.","In the examples that follow, the platform will be described for use with athletic events and activities relating to running, swimming, biking, triathlons and duathlons.","It will be appreciated that the platform may be modified for other athletic events or activities as desired.","Platform 102 preferably includes multiple features accessible by content suppliers and users.","For example only, platform 102 preferably includes an activity calendar 122, a results page, a training log 124, a rankings generator 120 and a media portal.","To facilitate access to these and other features, database server 106 preferably maintains multiple databases of information.","It will be appreciated that information may be stored in a cloud as an alternative to a database, or in addition to a database.","Event information for activity calendar 122 is preferably maintained in event database 108.Database 108 preferably includes data for each event.","Such data may include, but is not limited to category of event (e.g., running, biking, swimming, triathlon), sub-category of event (e.g., for running, 5K, 10K, half-marathon, etc.","), date and time, location, contact information and registration details, which may include a link to a site where a user may register for the event.","Information for the results page is preferably maintained in results database 110.Database 110 preferably includes records of results for specified events.","Such records may be organized by event name, event category, event sub-category, date, geographic area, and/or event organizer or sub-contractor.","Each record preferably contains the results of all participants who complete the competition.","Such results may be organized by gender, over-all placing, placing within a predetermined age group, and/or geographic area (e.g.","residence of a participant).","Information relating to user access is preferably maintained in user database 112.Database 112 preferably includes records of registered users.","Each record preferably includes a record identifier; personal details of the user, such as name, address, gender and age; and access level, for example, cost-free access or subscription level access.","Database 112 is useful for when a user accesses the platform and desires to access particular information which may be restricted depending upon the level of access of the user.","To facilitate access to the platform features, platform 102 preferably includes a processor 104 programmed to determine a content supplier or user's access to the platform.","Access to platform 102 is preferably determined by whether an individual or entity is a platform operator, content supplier and/or a user.","A platform operator has access to the entire platform.","On the supply side of the platform, a content supplier may have access to create a record relating to an athletic event for listing in the activity calendar.","A content supplier may also have access to upload event data such as race results, training plans which may include workouts, or media information such as photographs of a participant.","As used herein, a workout is an activity where the user or athlete physically exerts themselves for the purpose of maintaining or improving their health or fitness.","On the consumer side of the platform, a user may have several levels of access.","For example only, a user may have unrestricted access to some features of platform 102, such as the activity calendar.","Other features of the platform may be configured for restricted access, which require a user to register with the platform by providing log-in details, for example, a user name and password.","The log-in details are preferably stored in user database 112 and assigned a record identifier.","Additional features of platform 102 may be configured for access only by users who are subscribers, i.e., pay a fee for access.","Examples of restricted access features may include results data and/or media data.","Examples of subscription-only features may include rankings data.","Subscribers may be given access to all features of platform 102, while registered users may be given access only to unrestricted features and restricted features that are not subscriber-only features.","It will be appreciated that the levels of access may be varied from feature to feature as desired.","Processor 104 is preferably configured to receive a request for access by a user and determine whether the access is restricted.","If access is restricted, Processor 104 preferably requests the user to log in, or create a login if the user is a new user.","Once processor 104 has determined that the user is a registered user (i.e., the user has provided or created a correct login), the registered user is granted access to the restricted access features of platform 102.If the feature requires a subscription-only access, processor 104 will grant access to the user upon a determination that the user is a subscriber.","Additionally, processor 104 may offer the registered user an opportunity to become a subscriber if the registered user attempts to access a subscription-only feature and is not a subscriber.","Referring to FIGS.","1 to 3, platform 102 preferably includes an activity calendar 122 as one of its features.","Processor 104 preferably is programmed to use information stored in events database 108 and/or training log database 118 to generate a graphical user interface listing athletic events and training activities.","The athletic events are preferably organized by event category, sub-category, date, event title, location and contact information.","The training activities are preferably organized by activity type (e.g., running, swimming, cycling, weight training), workout type (e.g.","interval workout, long distance run or ride, swim sets), and training venue and/or route.","The activity calendar is preferably personalizable, i.e., a user may select desired events and organize the listing to include only the selected events.","For example only, as shown in FIG.","2A, the activity calendar includes a means for selecting desired events, which in this example, includes a column of boxes, each box corresponding to a listed event, which the user may select by clicking on the box.","Upon completing the desired selections, the user may instruct processor 104 to generate a calendar view 123 showing the selected events in a calendar format, such as shown in FIG.","3.The activity calendar may send automated reminders to registered users of upcoming selected events.","Such reminders may include one or more links to permit the user to access an event website or register for selected event.","Calendar view 123 is preferably configured to be updated with additional or replacement desired events.","Events listed in the activity calendar and/or shown in the calendar view may include links to permit the user to access an event website or register for selected event.","The activity calendar preferably includes activities from a training plan uploaded to platform 102.For example, referring to FIG.","2B, data from selected fields in training plan record 125 is used to populate the activity calendar.","Processor 104 may then generate calendar view 123 showing one or more workouts from training plan record 125.Referring to FIGS.","1 and 4, platform 102 preferably includes a training log 124 as one of its features.","Training log 124 is preferably maintained by training log server 116 and includes a plurality of training records preferably stored at training log database 118.Processor 104 preferably is programmed to generate a graphical user interface having a plurality of fields and functions.","The functions preferably include a “Summary” function 126 for summarizing training and/or racing data, a “Records” function for tracking a user's best performance data and an “Equipment Tracker” 130 for tracking the wear of various equipment used by the user.","Each of these functions is described in greater detail below.","In order to optimize use of one or more of the functions, a user must enter data into the platform.","As shown in FIG.","4, fields may be provided for date and activity in the training record.","The date field may be automatically updated with the current date using the user's computer or mobile device.","The activity field may be filled in or selected by the user from a predefined listing of activities, for example, running, swimming, biking, weight training, other, or racing.","Each activity may be listed by its full name, or may be abbreviated to a single code (e.g., “R” for running, “B” for biking, etc.).","A user may select from a menu the activity name or code for entry into the activity field.","Once the user enters or selects the activity name or code, processor 104 generates additional fields for the user to fill in.","The additional fields are preferably optimized for the particular activity selected.","For example only, if running is the selected activity, the fields generated preferably include “Route,” “Distance,” “Time” and “Notes” as shown in FIG.","4.The “Route” field may be an open field in which the user may enter a description of the training route, or may be configured to receive a route name or code corresponding to a route which the user previously described and stored, for example, using a “create new route” feature 128 described in greater detail below.","For example, a user may describe and store a training route corresponding to the user's run along the ocean, and associate the route with a route name or code “OR.” When the user subsequently enters information into the route field, the user may simply enter or select “OR” and the route information will be associated with the particular training log record being created.","The “Distance” field preferably relates to the total distance the user travelled during the training activity.","The “Distance” field may be automatically filled upon selection or entry of the route title or code, or modified independently of the route field.","The “Time” field corresponds to the user's total training time for that activity.","The “Notes” field is an open field which the user may enter notes regarding the training activity.","Other fields may be added, for example, a heart rate field, a difficulty rating field, and/or a weather field.","For a swimming activity, processor 104 may generate fields relating to location, distance, time, notes and whether a wetsuit was used.","For a biking activity, processor 104 may generate fields relating to route, distance, time, maximum speed, average speed, power and heart rate.","As with the running activity, the “Route” field may be automatically filled upon entry or selection of the route name or code, or modified independently of the route field.","For the racing activity, processor 104 is preferably configured to generate fields relating to event category (e.g., running, biking, swimming, triathlon, duathlon, etc.","), event sub-category and/or distance, splits, finish time, placing (over-all and age group) and notes.","It will be appreciated that the number and type of activities may be varied as desired.","Further, the number and type of fields may be modified as desired.","Referring to FIGS.","4 and 5, the graphical user interface for training log 124 preferably includes a “Summary” function 126.Summary function 126 preferably automatically tracks and updates the user's data.","In order to facilitate tracking of the user's data, the data stored for each field in database 118 is associated with a code, which processor 104 uses to maintain a running tally depending upon the type of code.","Preferably summary function 126 is organized into racing activities and training activities.","Using running and biking as examples of training activities, processor 104 preferably updates a running tally for distance and time with each instance a new running or biking record is added to the user's training log.","The running tally may be configured for one or more predetermined time periods.","For example only, a running tally may be configured for weekly, monthly, annual, week-to-date, month-to-date and/or year-to-date for distance and/or time per an activity.","For example only, if a user desires to learn what their year-to-date distance is for biking, the user may select the “Summary” function and select a “Training Activities” function.","The “Training Activities” function preferably generates an activity field.","Selecting the activity name or entering the activity code into the field preferably generates a summary specific to the activity.","For example, with running and biking activities, a training information field and a time period field will be generated.","The user may then have the option of selecting one or more types of training information (e.g., distance and training time) for a selected time period (e.g., weekly, monthly, year-to-date, etc.).","Upon making the selections, processor 104 generates a summary using the selection criteria entered by the user.","The summary is preferably in a list form and preferably includes a graphical representation of the summary such as shown in FIG.","5.Referring to FIG.","4, the training log preferably is configured with a “Records” function.","The “Records” function preferably tracks a user's best performance data for a particular category of activity, for example, training and/or racing.","For a training activity, the “Records” function, through processor 104 and training log database 118, stores the user's best performance record for a given activity.","For example, for a training run where a user runs the “OC” route multiple times, each time the “OC” route is run by the user, the training time is entered by the user and processor 104 compares the newly entered time with prior times associated with the “OC” route.","If a newly entered time for the “OC” route is less than any of the times currently of record for the “OC” route, the best time for the “OC” route is updated with the new best time and the date that the best time occurred.","If a user wishes to see what their best time is for a particular route, they may choose the running activity on a pull-down menu labelled “route.” The pull-down menu will preferably be populated with the routes created from a “create new route” option 128, described in further detail below.","When the user chooses a route from the pull-down menu, the records function will display the best time for that route and the date recorded for that time.","Similar best performance records may be maintained for times for other activities such as biking and swimming.","Best performance records may be customized and maintained depending upon the training activity.","For example, for running, biking and swimming, separate best performance records are preferably maintained for fastest time and longest distance.","For biking in particular, best performance records are preferably additionally maintained for best average speed and best maximum speed.","For swimming, best times may be recorded for set training distances.","If the category of activity relates to racing, the “Records” function is preferably configured to compare and update a user's best performance for a given race activity (e.g., running, biking, swimming, triathlon, etc.","), sub-category and/or distance, splits, finish time, placing (over-all and age group) using methodology similar to that described above in relation to the training activity best records, but modified for the race environment.","Examples of sub-categories of races for running include 5K, 10K, half-marathon, marathon, trailing running and track.","Examples of races for cycling include road, track, cyclo-cross, mountain and BMX.","Examples of sub-categories for races for swimming include open water and pool.","Examples of sub-categories of races for multi-sport include triathlon (sprint, international, half-iron distance, iron distance), duathlon (sprint, international, long-distance), aquathon, aquabike, and off-road.","A running tally on placings is preferably maintained.","Placings may be maintained for over-all placing in a competition, placing within an age group (typically 5-year increments commencing from age 20), a “best placing percentage,” and career wins.","The “Records” function is preferably configured to determine the “best” placings of the user within a given race.","For example, if a user places 150th over-all out of a running race of 1,500 participants, the placing is preferably recorded as being in the top 10%.","A subsequent placing of 100th out of 2,000 participants is preferably recorded as being in the top 5% and designated as the new best race placing.","Similar place-tracking may be maintained within age groups.","For career wins, the records function may track the number of first place wins over the span of their athletic career.","The records function may also track age-group wins (i.e., the number of times the user wins their age-group).","Referring to FIGS.","4 and 6, platform 102 is preferably configured so that the user may create and record a route which may be used to later associate training data.","Accessing link 128 will generate fields for the user to enter information pertaining to the route.","A pull-down menu of activities such as running, cycling and swimming may permit the user to select an activity.","Preferably, there will be two fields where the user enters information: a first field for entry of a route title or code, and a second one for entry of a route description.","Once a route has been created and saved under the user-defined title or code, it will preferably be in a list of routes which will appear in the pull-down menu for the training log entries when entering training information.","Referring to FIGS.","4 and 7, the training log is preferably configured with an “Equipment Tracker” function 130.Equipment tracker function 130 tracks usage of various equipment used by the user during training and/or racing activities.","For example, for running, the equipment tracker function 130 is preferably configured to track usage of running shoes and/or orthotics.","For shoes, fields for brand, date of first use, notes, and warning distance may be filled by the user.","This feature will track distance according to the distance logged when the user enters a distance for their run based on the dated entered in the date of first use field.","The warning distance feature will cause a warning message to appear next time the user logs into their training log.","The warning message will appear when the tally for the distance matches the warning distance value entered by the user.","If desired, the warning message may be electronically communicated over a network to the user, for example, by e-mail or texting.","For orthotics, fields will preferably be available for date of first use, notes and warning distance.","For biking, the equipment tracker function 130 is preferably configured to track usage of one or more of a bike, a chain, a pair of tires, distance travelled since the last tune-up of the bike, cassette and odometer batteries.","For the bike, fields will preferably be available for brand, date of first use, and notes.","This feature will track distance according to the distance logged when the user enters a distance for their cycling based on the date entered in the date of first use field.","For the chain, fields will preferably be available for date of first use, notes and warning distance.","For tires, fields will preferably be available for date of first use, notes, warning distance.","The tires category may be sub-divided into racing and training.","For distance since last tune-up, fields will preferably be available for date of tune-up, notes and warning distance.","This feature will track distance according to the distance logged when the user enters a distance for their cycling based on the date entered in the date of tune-up field.","For the cassette, fields will preferably be available for date of first use and notes.","For odometer batteries, fields will preferably be available for date of first use and notes.","For swimming, equipment tracker function 130 is preferably configured to track usage of a pair of swimming goggles, wetsuit and swimsuit.","Usage may be based on distance, time or a combination thereof.","For goggles, fields will preferably be available for brand, date of first use and notes.","This feature will track distance according to the distance logged when the user enters a distance for their swimming based on the date entered in the date of first use field.","For wetsuit, dates will preferably be available for brand, date of first use and notes.","This feature will track distance according to the distance logged when the user enters a distance for their swimming based on the date entered in the date of first use field and the user checks the box for “wetsuit used” option appearing on either the swim training or swim racing (open water) screen.","For swimsuit, fields will preferably be available for brand, date of first use and notes.","It will be appreciated that programmed functions of the training log may be varied as desired.","One or more of the functions described above may be omitted, or additional functions may be programmed into the training log.","Moreover, though described in relation to running, swimming, biking and triathlons, it will be appreciated that the training log may be adapted for other activities, such as a training gateway described below.","In another preferred aspect of the present invention, platform 102 is preferably configured to function as a training gateway or nexus between an athlete and a coach.","In order to maintain or improve fitness and athletic performance, athletes often associate themselves with a coach.","Sometimes the coach is located at a remote location that renders it impractical for the athlete to attend a coaching session in person.","Nonetheless, the athlete may obtain the benefit of a workout program generated by the coach by utilizing platform 102 as a training gateway.","To facilitate implementation of a training plan between a coach and an athlete, platform 102 may be configured to maintain an athlete profile that combines portions of the user information stored at user database 112 and training records populated by use of training log 124.Referring to FIG.","1, trailing log server 116 is preferably configured to maintain a plurality of athlete profiles.","Each athlete profile preferably includes personal information such as that stored in user database 112 (described above), and a training record having a plurality of fields that each correspond to an aspect of a workout in which the athlete participated.","The training records are preferably stored in training log database 118 and preferably populated such as described above with respect to training log 124.The athlete profile is preferably configured to receive a training plan uploaded by a third party such as a coach.","The athlete associated with the athlete profile has preferably preselected the coach and/or training plan, and either uploaded the training plan themselves, or granted access to the coach to upload the training plan to their athlete profile.","To complete the process of associating the training plan with the athlete profile, data from the training plan is preferably tagged for inclusion in fields reserved for training plan data.","Thereafter, the athlete may view the uploaded training plan in their athlete profile.","Processor 104 is preferably configured to send a notice to the athlete once the training plan has been uploaded and associated with the athlete profile.","The notice may take many forms, for example, an e-mail, text message, or other forms of electronic messaging and/or print notification.","The training plan preferably includes at least one workout.","More preferably, the training plan includes a plurality of workouts configured to be completed over a predetermined interval of time.","For example, a coach may have a training plan that includes one to three workouts over a predetermined number of days, months or seasons.","It will be appreciated that only a single workout may be uploaded at a time if desired.","For example, a coach may wish to upload a single workout per a day to the athlete profile.","Preferably, the athlete receives notification that a new training plan or workout has been associated with their athlete profile.","The athlete logs onto the platform, views their athlete profile, and takes note of the training plan or workout uploaded to the athlete profile by their coach.","The athlete may then perform a scheduled workout, and after the workout, enter aspects of the completed workout into training log 124 to update the training record.","Examples of fields used in the training record are illustrated in FIG.","4 and may include a field corresponding to a distance aspect and/or a time aspect of the workout.","The distance aspect may include the distance covered by the athlete during a training run or ride, or swum by an athlete in a body of water.","The time aspect may include the interval of time to cover the distance trained.","It will be appreciated that the distance and/or time may be sub-divided without departing from the scope of the present invention.","For example, during a track workout, an athlete may record a plurality of timed distances.","It will be appreciated that the training record may be configured with many fields including, but not limited to activity type (e.g., running, swimming, cycling, weight training), route, venue (e.g., city, park or pool), heart rate, and/or weather conditions.","After the athlete updates the training record via training log 124, processor 104 preferably notifies the coach that the athlete has completed a workout.","The notification may take any of the forms described above in relation to the notification provided to the athlete of the presence of the training plan or workout.","The coach, after viewing the training record of the athlete, may alter an existing training plan on the athlete profile, or replace the existing training plan with a new training plan.","It will be appreciated that if only a single workout is associated with the athlete profile, processor 104 may be configured to automatically delete the planned workout from the athlete profile once the athlete enters data indicating that the planned workout was completed.","Likewise, at the end of a planned training cycle, the training plan may be automatically deleted from the athlete profile once all workouts have been completed.","Referring to FIGS.","8 and 9, on the provider side of the training gateway, a provider such as a coach preferably accesses one or more athlete profiles 132 through a user interface generated by processor 104 as a coaching dashboard 134.The coaching dashboard preferably includes a link to each athlete profile which the coach is authorized to access.","Coaching dashboard 134 preferably includes a link to a training plan database 136, which is preferably maintained by platform 102 as shown in FIG.","9.Training plan database 136 preferably is configured to store one or more training plans or workouts.","It will be appreciated that the training plan database may be locally maintained at a workstation 138 of the coach.","Referring to FIG.","8, the coach, preferably taking into account the demographics and goals of the athlete, preferably designs or selects a training plan or workout for the athlete, and through the dashboard, uploads the training plan or workout to the selected athlete profile.","After being notified that the athlete has completed the training cycle associated with the training plan, or one or more workouts, the coach may modify an existing plan on the athlete profile, or completely replace an existing training plan or workout in the athlete profile with a new training plan or workout.","The coach may associate a training plan or workout for a single athlete, a plurality of individual athletes, and/or a group of athletes simultaneously.","For example, in FIG.","8, the training group Pacific Coast Group is selected via a pull down menu, and a time frame for the month of May is selected with a training plan (training plan 1A) for athletes 1, 2 and 3, who are members of the Pacific Coast Group.","Athletes 1, 2 and 3 may be co-located in the same geographic vicinity, or widely dispersed around the country.","As shown in FIG.","1, platform 102 preferably includes a rankings generator 120.Details of a preferred rankings generator are found in U.S. application Ser.","No.","13/484,213, filed May 30, 2012, entitled “System and Method for Providing an Athlete with a Performance Profile,” the entire disclosure of which is incorporated by reference herein.","Referring to FIG.","1, platform 102 may be configured to permit media content providers to upload to media database 114 media specific to a registered user, which the registered user may access once logged-in.","Details of a preferred medial portal are found in U.S. application Ser.","No.","13/484,213.Platform 102 is preferably programmed to automatically notify a registered user, more preferably, a subscriber, upon the uploading of results into results database 110.Platform 102 is further preferably configured to automatically notify a registered user upon the availability of media specific to the registered user.","The media may become available upon uploading the media to the media database, or by a media content provider leaving an indication in the registered user's account that the media is available for access through a link to the media provider's website.","The foregoing description is by way of example only, and may be varied considerably without departing from the scope of the present invention.","For example only, the platform may be optimized for use with hand-held mobile devices.","For example, a registered user may access their own training log while at the gym or immediately after a workout and update their training log remotely.","Additionally, the training log may be updated automatically with a GPS device in sync with training log feature 124.For example, a cyclist or runner may wear a GPS-enabled device which is Internet ready so that as the user is training, training data is being communicated “live” to the user's personal training log on the platform.","Upon finishing the training activity, the user may access a summary of the training activity.","It will be appreciated that the device may communicate with the platform only after the training activity is complete to do a data dump in order to reduce Internet usage.","The training gateway may be varied without departing from the scope of the present invention.","For example only, referring to FIG.","9, an athlete may wear a tracking device 140, such as a GPS enabled tracking device, that provides live updates to platform 102.Coaching dashboard 134 may be configured to provide the coach with live training information as the athlete is performing the workout.","It will be appreciated that the live data feed provided by the tracking device may be used to monitor an athlete's performance during a competition and provide the coach with live data on the progress of the athlete during the competition.","An example of a system for providing a live feed to a training log is described in U.S.","Provisional Application No.","61/705,232, filed Sep. 25, 2012, entitled “Interface and Method for Updating an Athlete Training Log,” the entire disclosure of which is incorporated by reference herein.","In another preferred aspect, a system and method for transferring an athlete's training data from a bike computer to an online training log associated with the athlete is set forth.","The system includes a mobile training computer, a mobile communications device, and a computer web-based platform.","The preferred components of the system and their interaction with each other are described further below.","The mobile training computer preferably includes a processor, a memory and a transceiver.","Structurally, the mobile training computer is preferably sized and configured to be mounted on a user's bike.","More preferably, the mobile training computer is adapted to be worn on the wrist of the user, and configured to be detached from the user and attached to the bike.","The mobile training computer preferably includes Global Positioning System (GPS) hardware configured to permit the processor to track the position of the user throughout the duration of a training session, whether in the water or on land.","The transceiver is preferably a peer-to-peer wireless communications radio.","Preferably, the transceiver is configured to utilize Wi-Fi Direct to establish a peer-to-peer communications link with the mobile communications device.","It will be appreciated that the transceiver may be configured to utilize other peer-to-peer communications protocols without departing from the scope of the present invention.","For example only, the transceiver may be configured to utilize Bluetooth and/or near field communications.","The specific details of the Wi-Fi Direct, Bluetooth and near field communications protocols would be appreciated by those of ordinary skill in the art and therefore are not repeated here.","The mobile communications device is preferably a personal device such as a smart phone or tablet.","Preferably, the mobile communications device is capable of establishing a wireless communications link using a communications network such as a satellite or cellular network.","It will be appreciated that the mobile communications device may be configured to transfer data without utilizing a cellular network, for example only, by utilizing a local Wi-Fi network.","The platform is preferably a computer web-based system accessible by the user through the Internet.","The platform includes a processor and a training log server configured to store a plurality of user profiles.","It will be appreciated that although data is shown stored at a remote location on the platform, data may also be stored in a cloud, or at one or more locations physically remote from the processor.","In another preferred aspect, an exemplary method for transferring data from the mobile training computer and updating the user's online training log stored at training the log server is set forth.","A peer-to-peer communications link is established between the mobile training computer and the mobile communications device.","Preferably, the communications link is established utilizing a peer-to-peer transceiver located in the mobile training computer.","More preferably, the communications link is established using Wi-Fi Direct, Bluetooth or near field communications.","Next, the training data stored on the mobile training computer is transferred to the mobile communications device using the peer-to-peer communications link.","The training data is then formatted for transfer from the mobile communications device to the web-based platform.","Thereafter, the formatted training data is uploaded to the web-based platform to update the online training log of the user.","It will be appreciated that the steps described above may be performed in a different order, varied, or certain steps omitted entirely without departing from the scope of the present invention.","For example only, the data transferred from the mobile training computer may be transferred onto the online training log without any special formatting.","If desired, training data may be transferred using an ordinary Wi-Fi connection between the mobile training computer and the platform.","For example, the mobile training computer may be detached from the wrist of the user or the mount on the bike, and brought within a Wi-Fi hotspot.","Thereafter, the training information may be uploaded into the user's online training log.","The mobile training computer may be fitted with a non-peer-to-peer wireless communications link capable of accessing the Internet.","For example, the mobile training computer may be fitted with a conventional Wi-Fi radio instead of, or in addition to a peer-to-peer configured radio transceiver.","The mobile communications device may be fitted with a peer-to-peer configured radio transceiver.","A peer-to-peer link may be established using either the mobile communications device or the mobile training computer.","The mobile training computer may be worn on the user, for example, with a body strap at the wrist or about the user's chest.","In the latter example, the mobile training computer may be configured to transmit information for display on a bike computer on the user's bike.","As most of the circuitry is being worn by the user, the size of the bike computer may be greatly reduced, essentially to a display with a minimum of circuitry necessary to receive a data stream from the wearable mobile training computer.","The mobile training computer may be configured to be worn on other areas of the body, such as the ankle or around the head.","The “Summary” function may be modified to provide visual representations of training history in terms of pie charts and other visual aids.","Additional fields may be added for weight, heart rate, difficulty rating and weather if desired.","Annual reports may be generated and printed for each registered user as desired.","The “Equipment Tracker” function may be modified to allow a user to enter their own equipment for tracking.","Additionally, a “notes” field may be provided to permit the user to describe the brand of equipment, or other information as desired by the user.","The warning distance feature may be configured to send a notification to the user via an electronic communication such as e-mail or texting.","If desired, the warning described above may appear on the display of the mobile training computer.","The warning may be transferred to the mobile training computer through the communications link established between the mobile communications device and the platform and/or between the communications device and the mobile training computer.","Various parameters may be tracked by the mobile training computer and the warning distance stored locally by the mobile training computer and displayed on its display.","The personalized calendar feature may be configured to determine if a registered user is within a predetermined distance from a competition, and provide the user with information regarding hotels and restaurants within a predetermined radius of the site of the competition.","For example, if a registered user lives 75 miles away from a competition for which the user entered, the platform may send or e-mail the user information on all hotels within a 5 mile radius of the site of the competition.","Moreover, the platform may be configured to determine vacancy information for the hotels and provide the user with hotel information for hotels still having vacancy.","The platform may be configured to notify a registered user of the forecasted weather at the site of the competition a set number of days before the competition, for example, one, two and/or three days before the competition date.","The weather forecast may include hourly forecasts if desired.","The platform may be configured for use with activities other than running, cycling, swimming or multisport.","For example only, the platform may be configured for use with weight training, kayaking, crew, hiking, mountain climbing, golf, tennis, martial arts, and other sports.","Information normally stored at a physical location may be stored in a cloud, considerably reducing the hardware needed for memory requirements often associated with large volumes of data.","The features described with respect to one embodiment may be applied to other embodiments, or combined with or interchanged with the features of other embodiments, as appropriate, without departing from the scope of the present invention.","Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein.","It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims."]],"string":"[\n [\n \"System and Method For Providing a Coach with Live Training Data of an Athlete as the Athlete is Performing a Swimming Workout\",\n \"An athlete tracking system and method for tracking an athlete during training sessions, such as swim training.\",\n \"The system includes a mobile tracking device wearable around the athlete's chest, and a training log server for maintaining an athlete profile that includes a training record updatable by the athlete and a training plan supplied by a coach.\"\n ],\n [\n \"1.A method for providing a coach with live training data of an athlete as the athlete is performing a swimming workout, the method comprising: creating an athlete profile on a training log server of a computer web-based platform, the training log server being configured to maintain a plurality of athlete profiles, the athlete profile including a training record having a plurality predefined fields, at least one of the fields corresponding to a distance aspect of an athlete's workout, at least another of the fields corresponding to a time aspect of the athlete's workout; updating, at the platform, a training record in the athlete profile with workout data from a mobile tracking device worn by the athlete around the athlete's chest as the athlete is performing the swimming workout, the workout data including a distance aspect and a time aspect; and permitting the coach to log onto the platform and view the training record of the athlete profile as the athlete is performing the swimming workout.\",\n \"2.The method of claim 1, further comprising receiving, at the platform, at least one workout created by the selected coach and associating the workout with the athlete profile.\",\n \"3.The method of claim 2, further comprising comparing the workout data for a given day with a planned workout forming part of a training plan and determining whether the athlete completed the workout as planned.\",\n \"4.The method of claim 3, further comprising generating a graphical representation comparing the athlete's actual workout to the planned workout.\",\n \"5.The method of claim 3, further comprising automatically deleting the workout after receiving an indication that the workout was completed by the athlete.\",\n \"6.The method of claim 1, wherein the updating of the training record includes calculating a cumulative training distance for a selected interval of time using the distance aspect of the workout data from the athlete.\",\n \"7.The method of claim 1, further comprising generating a calendar and populating the calendar with portions of a training plan.\",\n \"8.The method of claim 1, where the tracking device is a GPS-enabled tracking device.\",\n \"9.The method of claim 1, further comprising monitoring the athlete's performance during a competition and providing the coach with live data on the progress of the athlete during the competition.\",\n \"10.An athlete tracking system configured to sync with an online training log of an athlete, comprising: a body strap configured to be worn about the athlete's chest, said body strap including a mobile training computer having a processor, GPS circuitry configured to permit said processor to track a position of the athlete throughout a duration of a training session, a memory, a first wireless communications radio configured for peer-to-peer communications, and a second wireless communications radio configured for non-peer-to-peer communications; and a bike computer configured to mount on a bike, said bike computer including a display and circuitry configured to receive a data stream from said mobile training computer.\",\n \"11.The athlete tracking system of claim 10, wherein said first wireless communications radio is configured for peer-to-peer communications with a smart phone.\",\n \"12.The athlete tracking system of claim 10, wherein said second wireless communications radio is configured to access the internet through a Wi-Fi connection to facilitate syncing of the mobile training computer with the online training log.\",\n \"13.The athlete tracking system of claim 10, wherein the GPS circuitry is configured to enable live updating of the online training log as the athlete is training.\",\n \"14.The athlete tracking system of claim 10, wherein said memory is configured to store training data used to update the online training log.\",\n \"15.The athlete tracking system of claim 10, wherein said mobile training computer is configured to track the athlete in water during a training session.\",\n \"16.The athlete tracking system of claim 10, further comprising a training log server configured to maintain a plurality of athlete profiles, each athlete profile including a training record having a plurality of fields that each correspond to a component of a training workout, said training log server being synced to said mobile training computer so that data from the mobile training computer is entered into said training record as the athlete is training.\",\n \"17.The athlete tracking system of claim 16, further comprising a processor programmed to receive workout data supplied by the mobile training computer and update the training record with the workout data, the workout data including both a distance aspect and a time aspect, said processor being configured to receive a training plan from a coach and associate the training plan with the athlete profile so that the athlete may view the training plan.\"\n ],\n [\n \" BACKGROUND OF THE INVENTION Athletes training for a competition usually enlist the assistance of a coach to help them prepare for an upcoming competition, or to enhance their personal fitness.\",\n \"Often, the athlete becomes attached to a particular coach, but then has to move to a different city for any number of reasons.\",\n \"This can disrupt the athlete's training, leading to a loss of fitness, and a loss of personal time in trying to find a replacement coach in the new area in which the athlete finds themselves.\",\n \"The present invention in one or more preferred embodiments seeks to provide an athlete with the ability to maintain their current relationship with a preferred coach regardless of their physical location.\"\n ],\n [\n \" SUMMARY The present invention in one preferred aspect is directed to a web-based platform tailored to providing access to information regarding athletic or sporting events and personal training information.\",\n \"The system may include an activity calendar, which is personalizable, a training log, a media portal containing photos of a participant in an event, and a rankings generator configured to rank a user against other users within given set of parameters.\",\n \"As used herein, “configured” includes creating, changing, or modifying a program on a computer or network of computers so that the computer or network of computers behave according to a set of instructions.\",\n \"The programming to accomplish the various embodiments described herein will be apparent to a person of ordinary skill in the art after reviewing the present specification, and for simplicity, is not detailed herein.\",\n \"It will be appreciated that in one or more embodiments, the system may include one or more work stations at a back end for use by a platform operator, one or more local client computers for access by users, and a communications network that facilitates communication between the platform, the work stations at the back end, and the client computers.\",\n \"Preferably, the work stations and client computers will include a display and means for entering information, such as a keyboard and/or voice activated data entry.\",\n \"Means for accessing the platform by users may include, but is not limited to personal computers and mobile devices such as tablets and smartphones, and other user devices capable of communicating over a communications network such as the Internet.\",\n \"In one preferred aspect, the present invention is directed to a web-based platform for personalizing a training regimen of an athlete.\",\n \"The system preferably includes a training log server configured to maintain a plurality athlete profiles, each athlete profile including a training record having a plurality of fields that each correspond to an aspect of a workout in which the athlete participated, one of the fields corresponding to a distance aspect of the workout, another of the fields corresponding to a time aspect of the workout.\",\n \"The system preferably further includes a processor programmed to receive workout data supplied by the athlete and update the training record with the workout data, the workout data including both a distance aspect and a time aspect.\",\n \"The processor is configured to permit the athlete to grant access to the training record to a coach so that the coach may log onto the platform and view the training record.\",\n \"The processor is further configured to receive a training plan from the coach and associate the training plan with the athlete profile so that the athlete may view the training plan.\",\n \"The processor may be programmed to cumulatively track at least one aspect of the athlete's workouts.\",\n \"The processor may be programmed to generate a calendar incorporating at least a portion of the training plan.\",\n \"The calendar may be presented as a monthly calendar.\",\n \"The processor may be programmed to send a message to the athlete once the training plan has been uploaded to the platform and associated with the athlete profile.\",\n \"The processor may be programmed to send a message to the coach once the athlete updates their training record.\",\n \"The processor may be programmed to permit the athlete to selectively restrict access by the coach to portions of the training record.\",\n \"The platform further preferably includes a media portal configured to receive media from at least one of the athlete and the coach and associate the media with the athlete profile.\",\n \"In another preferred aspect, the present invention is directed to a method for personalizing a training regimen of an athlete using a computer web-based platform, the platform including a processor and a training log server configured to maintain a plurality of athlete profiles.\",\n \"The method preferably includes creating an athlete profile on the training log server, the athlete profile including a training record having a plurality predefined fields, at least one of the fields corresponding to a distance aspect of an athlete's workout, at least another of the fields corresponding to a time aspect of the athlete's workout; receiving, at the platform, workout data from the athlete, the workout data including a distance aspect and a time aspect; updating the training record of the athlete profile by associating each aspect of the workout data with the corresponding field in a training record; permitting a coach to log onto the platform and view the athlete profile; and uploading a training plan from the coach to the platform and associating the training plan with the athlete profile.\",\n \"The updating of the training record preferably includes calculating a cumulative training distance for a selected interval of time using the distance aspect of the workout data from the athlete.\",\n \"The method preferably further includes generating a calendar and populating the calendar with portions of the training plan.\",\n \"The method further preferably includes sending a message to the coach after the training record has been updated.\",\n \"The method further preferably includes sending a message to the athlete after the training plan has been uploaded to the platform and associated with the athlete profile.\",\n \"The method further preferably includes comparing the workout data for a given day with a planned workout forming part of the training plan and determining whether the athlete completed the workout as planned.\",\n \"The method further preferably includes generating a graphical representation comparing the athlete's actual workout to the planned workout.\",\n \"The workout data preferably includes data identifying a training route.\",\n \"The workout data preferably includes an aspect identifying a category of workout activity.\",\n \"The present disclosure in another preferred aspect sets forth a system and method for transferring an athlete's training data from a bike computer to an online training log associated with the athlete.\",\n \"The system includes a bike computer mountable on a bike ridden by the athlete, the bike computer being configured to store training data accumulated during the course of a training session, the bike computer including a wireless transceiver configured for peer-to-peer communication.\",\n \"The system also includes a mobile communications device having a processor and a wireless communications transceiver, the processor being configured to receive the training data from the bike computer and format the training data for transfer to the athlete's online training log.\",\n \"The system also includes a web-based platform including a processor configured to receive the training data from the mobile communications device and store the training data in a training log server, the training log server having a plurality of athlete profiles, at least one of which corresponds to the athlete uploading the training data.\",\n \"The wireless communications transceiver of the bike computer may utilize Wi-Fi Direct.\",\n \"The wireless communications transceiver of the bike computer may utilize Bluetooth.\",\n \"The mobile communications device may be paired with the bike computer.\",\n \"The mobile communications device may be a smart phone.\",\n \"The mobile communications device may be a tablet.\",\n \"The processor of the mobile communications device may be programmed to display the formatted training data on a display of the mobile communications device.\",\n \"The bike computer may be programmed to send a discovery message to the mobile communications device and automatically transfer the training data after a communications link has been established with the mobile communications device.\",\n \"The bike computer may be configured to establish a peer-to-peer communications link with more than one mobile communications device.\",\n \"The training data transferred to the mobile communications device may include GPS-based data.\",\n \"The present disclosure in an additional preferred aspect sets forth a method for updating an online training log of a user.\",\n \"The method includes establishing a peer-to-peer communications link between a mobile training computer and a mobile communications device, the mobile training computer being sized and configured to be mounted on the user's bike; transferring training data stored on the mobile training computer to the mobile communications device using the peer-to-peer communications link; formatting the training data for transfer from the mobile communications device to a web-based platform; and uploading the formatted training data to the web-based platform to update the online training log of the user.\",\n \"The mobile training computer may be a bike computer.\",\n \"The peer-to-peer communications link may be established using Wi-Fi Direct.\",\n \"The peer-to-peer communications link may be established using Bluetooth.\",\n \"The training data may be uploaded to the online training log without a USB interface.\",\n \"The training data may be transferred automatically to the mobile communications device once the peer-to-peer communications link is established.\",\n \"The present disclosure in further preferred aspect sets forth a system for transferring an athlete's training data from a bike computer to an online training log associated with the athlete.\",\n \"The system includes a bike computer mountable on a bike ridden by the athlete, the bike computer being configured to store training data accumulated during the course of a training session, the bike computer including a wireless communications means for transmitting the training data; a mobile communications device having a processor and a wireless communications transceiver, the processor being configured to receive the training data from the bike computer and format the training data for transfer to the athlete's online training log; and a web-based platform including a processor configured to receive the training data from the mobile communications device and store the training data in a training log server, the training log server having a plurality of athlete profiles, at least one of which corresponds to the athlete uploading the training data.\",\n \"The present disclosure in an additional preferred aspect sets forth a bike computer for collecting and transmitting an athlete's training data accumulated during a training session.\",\n \"The bike computer includes at least one sensor for measuring data associated with a parameter of the athlete's training session; a processor configured to collect the training data from the at least one sensor; a memory for storing the training data collected by the processor; and a wireless communications means for transmitting the training data to a training log.\",\n \"The bike computer may include a mount configured to detachably secure the bike computer to a bike.\",\n \"The at least one sensor may include a cadence sensor.\",\n \"The at least one sensor may include a heart rate sensor.\",\n \"It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.\",\n \"The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate several embodiments of the invention and together with the description, serve to explain the principles of the invention.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This Application is a continuation of U.S. application Ser.\",\n \"No.\",\n \"15/162,613, which is a continuation of U.S. application Ser.\",\n \"No.\",\n \"14/054,879, now U.S. Pat.\",\n \"No.\",\n \"9,345,948, which claims the benefit of U.S.\",\n \"Provisional Application No.\",\n \"61/715,847, the entire contents of each being incorporated by reference herein.\",\n \"FIELD OF THE INVENTION The present invention relates to improvements in a system for storing training data entered by an athlete, associating information with the athlete that is related to the athlete's participation in training and/or racing activities, and generating a profile specific to the athlete for use by the athlete and/or a coach.\",\n \"BACKGROUND OF THE INVENTION Athletes training for a competition usually enlist the assistance of a coach to help them prepare for an upcoming competition, or to enhance their personal fitness.\",\n \"Often, the athlete becomes attached to a particular coach, but then has to move to a different city for any number of reasons.\",\n \"This can disrupt the athlete's training, leading to a loss of fitness, and a loss of personal time in trying to find a replacement coach in the new area in which the athlete finds themselves.\",\n \"The present invention in one or more preferred embodiments seeks to provide an athlete with the ability to maintain their current relationship with a preferred coach regardless of their physical location.\",\n \"SUMMARY The present invention in one preferred aspect is directed to a web-based platform tailored to providing access to information regarding athletic or sporting events and personal training information.\",\n \"The system may include an activity calendar, which is personalizable, a training log, a media portal containing photos of a participant in an event, and a rankings generator configured to rank a user against other users within given set of parameters.\",\n \"As used herein, “configured” includes creating, changing, or modifying a program on a computer or network of computers so that the computer or network of computers behave according to a set of instructions.\",\n \"The programming to accomplish the various embodiments described herein will be apparent to a person of ordinary skill in the art after reviewing the present specification, and for simplicity, is not detailed herein.\",\n \"It will be appreciated that in one or more embodiments, the system may include one or more work stations at a back end for use by a platform operator, one or more local client computers for access by users, and a communications network that facilitates communication between the platform, the work stations at the back end, and the client computers.\",\n \"Preferably, the work stations and client computers will include a display and means for entering information, such as a keyboard and/or voice activated data entry.\",\n \"Means for accessing the platform by users may include, but is not limited to personal computers and mobile devices such as tablets and smartphones, and other user devices capable of communicating over a communications network such as the Internet.\",\n \"In one preferred aspect, the present invention is directed to a web-based platform for personalizing a training regimen of an athlete.\",\n \"The system preferably includes a training log server configured to maintain a plurality athlete profiles, each athlete profile including a training record having a plurality of fields that each correspond to an aspect of a workout in which the athlete participated, one of the fields corresponding to a distance aspect of the workout, another of the fields corresponding to a time aspect of the workout.\",\n \"The system preferably further includes a processor programmed to receive workout data supplied by the athlete and update the training record with the workout data, the workout data including both a distance aspect and a time aspect.\",\n \"The processor is configured to permit the athlete to grant access to the training record to a coach so that the coach may log onto the platform and view the training record.\",\n \"The processor is further configured to receive a training plan from the coach and associate the training plan with the athlete profile so that the athlete may view the training plan.\",\n \"The processor may be programmed to cumulatively track at least one aspect of the athlete's workouts.\",\n \"The processor may be programmed to generate a calendar incorporating at least a portion of the training plan.\",\n \"The calendar may be presented as a monthly calendar.\",\n \"The processor may be programmed to send a message to the athlete once the training plan has been uploaded to the platform and associated with the athlete profile.\",\n \"The processor may be programmed to send a message to the coach once the athlete updates their training record.\",\n \"The processor may be programmed to permit the athlete to selectively restrict access by the coach to portions of the training record.\",\n \"The platform further preferably includes a media portal configured to receive media from at least one of the athlete and the coach and associate the media with the athlete profile.\",\n \"In another preferred aspect, the present invention is directed to a method for personalizing a training regimen of an athlete using a computer web-based platform, the platform including a processor and a training log server configured to maintain a plurality of athlete profiles.\",\n \"The method preferably includes creating an athlete profile on the training log server, the athlete profile including a training record having a plurality predefined fields, at least one of the fields corresponding to a distance aspect of an athlete's workout, at least another of the fields corresponding to a time aspect of the athlete's workout; receiving, at the platform, workout data from the athlete, the workout data including a distance aspect and a time aspect; updating the training record of the athlete profile by associating each aspect of the workout data with the corresponding field in a training record; permitting a coach to log onto the platform and view the athlete profile; and uploading a training plan from the coach to the platform and associating the training plan with the athlete profile.\",\n \"The updating of the training record preferably includes calculating a cumulative training distance for a selected interval of time using the distance aspect of the workout data from the athlete.\",\n \"The method preferably further includes generating a calendar and populating the calendar with portions of the training plan.\",\n \"The method further preferably includes sending a message to the coach after the training record has been updated.\",\n \"The method further preferably includes sending a message to the athlete after the training plan has been uploaded to the platform and associated with the athlete profile.\",\n \"The method further preferably includes comparing the workout data for a given day with a planned workout forming part of the training plan and determining whether the athlete completed the workout as planned.\",\n \"The method further preferably includes generating a graphical representation comparing the athlete's actual workout to the planned workout.\",\n \"The workout data preferably includes data identifying a training route.\",\n \"The workout data preferably includes an aspect identifying a category of workout activity.\",\n \"The present disclosure in another preferred aspect sets forth a system and method for transferring an athlete's training data from a bike computer to an online training log associated with the athlete.\",\n \"The system includes a bike computer mountable on a bike ridden by the athlete, the bike computer being configured to store training data accumulated during the course of a training session, the bike computer including a wireless transceiver configured for peer-to-peer communication.\",\n \"The system also includes a mobile communications device having a processor and a wireless communications transceiver, the processor being configured to receive the training data from the bike computer and format the training data for transfer to the athlete's online training log.\",\n \"The system also includes a web-based platform including a processor configured to receive the training data from the mobile communications device and store the training data in a training log server, the training log server having a plurality of athlete profiles, at least one of which corresponds to the athlete uploading the training data.\",\n \"The wireless communications transceiver of the bike computer may utilize Wi-Fi Direct.\",\n \"The wireless communications transceiver of the bike computer may utilize Bluetooth.\",\n \"The mobile communications device may be paired with the bike computer.\",\n \"The mobile communications device may be a smart phone.\",\n \"The mobile communications device may be a tablet.\",\n \"The processor of the mobile communications device may be programmed to display the formatted training data on a display of the mobile communications device.\",\n \"The bike computer may be programmed to send a discovery message to the mobile communications device and automatically transfer the training data after a communications link has been established with the mobile communications device.\",\n \"The bike computer may be configured to establish a peer-to-peer communications link with more than one mobile communications device.\",\n \"The training data transferred to the mobile communications device may include GPS-based data.\",\n \"The present disclosure in an additional preferred aspect sets forth a method for updating an online training log of a user.\",\n \"The method includes establishing a peer-to-peer communications link between a mobile training computer and a mobile communications device, the mobile training computer being sized and configured to be mounted on the user's bike; transferring training data stored on the mobile training computer to the mobile communications device using the peer-to-peer communications link; formatting the training data for transfer from the mobile communications device to a web-based platform; and uploading the formatted training data to the web-based platform to update the online training log of the user.\",\n \"The mobile training computer may be a bike computer.\",\n \"The peer-to-peer communications link may be established using Wi-Fi Direct.\",\n \"The peer-to-peer communications link may be established using Bluetooth.\",\n \"The training data may be uploaded to the online training log without a USB interface.\",\n \"The training data may be transferred automatically to the mobile communications device once the peer-to-peer communications link is established.\",\n \"The present disclosure in further preferred aspect sets forth a system for transferring an athlete's training data from a bike computer to an online training log associated with the athlete.\",\n \"The system includes a bike computer mountable on a bike ridden by the athlete, the bike computer being configured to store training data accumulated during the course of a training session, the bike computer including a wireless communications means for transmitting the training data; a mobile communications device having a processor and a wireless communications transceiver, the processor being configured to receive the training data from the bike computer and format the training data for transfer to the athlete's online training log; and a web-based platform including a processor configured to receive the training data from the mobile communications device and store the training data in a training log server, the training log server having a plurality of athlete profiles, at least one of which corresponds to the athlete uploading the training data.\",\n \"The present disclosure in an additional preferred aspect sets forth a bike computer for collecting and transmitting an athlete's training data accumulated during a training session.\",\n \"The bike computer includes at least one sensor for measuring data associated with a parameter of the athlete's training session; a processor configured to collect the training data from the at least one sensor; a memory for storing the training data collected by the processor; and a wireless communications means for transmitting the training data to a training log.\",\n \"The bike computer may include a mount configured to detachably secure the bike computer to a bike.\",\n \"The at least one sensor may include a cadence sensor.\",\n \"The at least one sensor may include a heart rate sensor.\",\n \"It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.\",\n \"The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate several embodiments of the invention and together with the description, serve to explain the principles of the invention.\",\n \"BRIEF DESCRIPTION OF THE FIGURES FIG.\",\n \"1 is a diagram of system components in accordance with a preferred embodiment of the present invention.\",\n \"FIG.\",\n \"2A is a preferred embodiment of a graphical user interface with fields for events for use in generating an activity calendar.\",\n \"FIG.\",\n \"2B is a preferred embodiment of a graphical user interface with fields for portions of a training plan for use in generating an activity calendar.\",\n \"FIG.\",\n \"3 is a front view of the activity calendar generated by the graphical user interfaces of FIGS.\",\n \"2A and 2B.\",\n \"FIG.\",\n \"4 is a preferred embodiment of a graphical user interface for use in generating a personal training log.\",\n \"FIG.\",\n \"5 is a preferred embodiment of a graphical user interface for use in generating a summary portion of the personal training log of FIG.\",\n \"4.FIG.\",\n \"6 is a preferred embodiment of a graphical user interface for use in creating a new route portion of the personal training log of FIG.\",\n \"4.FIG.\",\n \"7 is a preferred embodiment of a graphical user interface for use in generating an equipment tracker portion of the personal training log of FIG.\",\n \"4.FIG.\",\n \"8 is a preferred embodiment of a graphical user interface for use in generating a coaching dashboard in accordance with another preferred embodiment of the present invention.\",\n \"FIG.\",\n \"9 is system pictoral diagram showing the interaction between a user, the platform of FIG.\",\n \"1, and a local workstation of a coach.\",\n \"DETAILED DESCRIPTION OF THE DRAWINGS Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings.\",\n \"FIG.\",\n \"1 shows a preferred embodiment of a system 100 that includes a computer web-based platform 102 for preferably providing a user with access to an array of information regarding upcoming event information, event results, training plans and workouts, rankings information and media pertinent to the user's participation in a given event.\",\n \"Platform 102 preferably includes a processor 104, a database server 106 for maintaining an events database 108 that includes a listing of athletic events, a results database 110 that includes results of athletic competitions, a user database 112 that includes records of registered users, a media database 114, a training log server 116, a training log database 118, and a rankings generator 120.The preferred components of platform 102 and their interaction with each other are described further below.\",\n \"Platform 102 is preferably a computer web-based system accessible by content providers and users.\",\n \"Content providers are preferably individuals or entities that upload or otherwise provide content or data to the platform relating to one or more athletic events or training activities.\",\n \"Content may include, but is not limited to results from athletic competitions, training plans and workouts supplied by a third party such as a coach, and media content such as photographs or video from third party providers.\",\n \"As used herein, a third party is a person or business entity that provides content on a commercial basis.\",\n \"Athletic events may include, but are not limited to running races, bike races, swim meets, triathlons, duathlons and other competitions pitting an individual or team against other individuals or teams.\",\n \"Users are preferably individuals or entities desiring access to the content provided by the content providers.\",\n \"Such users may include an individual interested in an upcoming event, a race result, a training plan or workout, and/or media pertaining to an event.\",\n \"Users may also include individuals such as athletes who supply data to the platform pertaining to their training in order to generate a training log, or coaches who supply or upload a training plan to the platform for purposes of coaching an athlete.\",\n \"In the examples that follow, the platform will be described for use with athletic events and activities relating to running, swimming, biking, triathlons and duathlons.\",\n \"It will be appreciated that the platform may be modified for other athletic events or activities as desired.\",\n \"Platform 102 preferably includes multiple features accessible by content suppliers and users.\",\n \"For example only, platform 102 preferably includes an activity calendar 122, a results page, a training log 124, a rankings generator 120 and a media portal.\",\n \"To facilitate access to these and other features, database server 106 preferably maintains multiple databases of information.\",\n \"It will be appreciated that information may be stored in a cloud as an alternative to a database, or in addition to a database.\",\n \"Event information for activity calendar 122 is preferably maintained in event database 108.Database 108 preferably includes data for each event.\",\n \"Such data may include, but is not limited to category of event (e.g., running, biking, swimming, triathlon), sub-category of event (e.g., for running, 5K, 10K, half-marathon, etc.\",\n \"), date and time, location, contact information and registration details, which may include a link to a site where a user may register for the event.\",\n \"Information for the results page is preferably maintained in results database 110.Database 110 preferably includes records of results for specified events.\",\n \"Such records may be organized by event name, event category, event sub-category, date, geographic area, and/or event organizer or sub-contractor.\",\n \"Each record preferably contains the results of all participants who complete the competition.\",\n \"Such results may be organized by gender, over-all placing, placing within a predetermined age group, and/or geographic area (e.g.\",\n \"residence of a participant).\",\n \"Information relating to user access is preferably maintained in user database 112.Database 112 preferably includes records of registered users.\",\n \"Each record preferably includes a record identifier; personal details of the user, such as name, address, gender and age; and access level, for example, cost-free access or subscription level access.\",\n \"Database 112 is useful for when a user accesses the platform and desires to access particular information which may be restricted depending upon the level of access of the user.\",\n \"To facilitate access to the platform features, platform 102 preferably includes a processor 104 programmed to determine a content supplier or user's access to the platform.\",\n \"Access to platform 102 is preferably determined by whether an individual or entity is a platform operator, content supplier and/or a user.\",\n \"A platform operator has access to the entire platform.\",\n \"On the supply side of the platform, a content supplier may have access to create a record relating to an athletic event for listing in the activity calendar.\",\n \"A content supplier may also have access to upload event data such as race results, training plans which may include workouts, or media information such as photographs of a participant.\",\n \"As used herein, a workout is an activity where the user or athlete physically exerts themselves for the purpose of maintaining or improving their health or fitness.\",\n \"On the consumer side of the platform, a user may have several levels of access.\",\n \"For example only, a user may have unrestricted access to some features of platform 102, such as the activity calendar.\",\n \"Other features of the platform may be configured for restricted access, which require a user to register with the platform by providing log-in details, for example, a user name and password.\",\n \"The log-in details are preferably stored in user database 112 and assigned a record identifier.\",\n \"Additional features of platform 102 may be configured for access only by users who are subscribers, i.e., pay a fee for access.\",\n \"Examples of restricted access features may include results data and/or media data.\",\n \"Examples of subscription-only features may include rankings data.\",\n \"Subscribers may be given access to all features of platform 102, while registered users may be given access only to unrestricted features and restricted features that are not subscriber-only features.\",\n \"It will be appreciated that the levels of access may be varied from feature to feature as desired.\",\n \"Processor 104 is preferably configured to receive a request for access by a user and determine whether the access is restricted.\",\n \"If access is restricted, Processor 104 preferably requests the user to log in, or create a login if the user is a new user.\",\n \"Once processor 104 has determined that the user is a registered user (i.e., the user has provided or created a correct login), the registered user is granted access to the restricted access features of platform 102.If the feature requires a subscription-only access, processor 104 will grant access to the user upon a determination that the user is a subscriber.\",\n \"Additionally, processor 104 may offer the registered user an opportunity to become a subscriber if the registered user attempts to access a subscription-only feature and is not a subscriber.\",\n \"Referring to FIGS.\",\n \"1 to 3, platform 102 preferably includes an activity calendar 122 as one of its features.\",\n \"Processor 104 preferably is programmed to use information stored in events database 108 and/or training log database 118 to generate a graphical user interface listing athletic events and training activities.\",\n \"The athletic events are preferably organized by event category, sub-category, date, event title, location and contact information.\",\n \"The training activities are preferably organized by activity type (e.g., running, swimming, cycling, weight training), workout type (e.g.\",\n \"interval workout, long distance run or ride, swim sets), and training venue and/or route.\",\n \"The activity calendar is preferably personalizable, i.e., a user may select desired events and organize the listing to include only the selected events.\",\n \"For example only, as shown in FIG.\",\n \"2A, the activity calendar includes a means for selecting desired events, which in this example, includes a column of boxes, each box corresponding to a listed event, which the user may select by clicking on the box.\",\n \"Upon completing the desired selections, the user may instruct processor 104 to generate a calendar view 123 showing the selected events in a calendar format, such as shown in FIG.\",\n \"3.The activity calendar may send automated reminders to registered users of upcoming selected events.\",\n \"Such reminders may include one or more links to permit the user to access an event website or register for selected event.\",\n \"Calendar view 123 is preferably configured to be updated with additional or replacement desired events.\",\n \"Events listed in the activity calendar and/or shown in the calendar view may include links to permit the user to access an event website or register for selected event.\",\n \"The activity calendar preferably includes activities from a training plan uploaded to platform 102.For example, referring to FIG.\",\n \"2B, data from selected fields in training plan record 125 is used to populate the activity calendar.\",\n \"Processor 104 may then generate calendar view 123 showing one or more workouts from training plan record 125.Referring to FIGS.\",\n \"1 and 4, platform 102 preferably includes a training log 124 as one of its features.\",\n \"Training log 124 is preferably maintained by training log server 116 and includes a plurality of training records preferably stored at training log database 118.Processor 104 preferably is programmed to generate a graphical user interface having a plurality of fields and functions.\",\n \"The functions preferably include a “Summary” function 126 for summarizing training and/or racing data, a “Records” function for tracking a user's best performance data and an “Equipment Tracker” 130 for tracking the wear of various equipment used by the user.\",\n \"Each of these functions is described in greater detail below.\",\n \"In order to optimize use of one or more of the functions, a user must enter data into the platform.\",\n \"As shown in FIG.\",\n \"4, fields may be provided for date and activity in the training record.\",\n \"The date field may be automatically updated with the current date using the user's computer or mobile device.\",\n \"The activity field may be filled in or selected by the user from a predefined listing of activities, for example, running, swimming, biking, weight training, other, or racing.\",\n \"Each activity may be listed by its full name, or may be abbreviated to a single code (e.g., “R” for running, “B” for biking, etc.).\",\n \"A user may select from a menu the activity name or code for entry into the activity field.\",\n \"Once the user enters or selects the activity name or code, processor 104 generates additional fields for the user to fill in.\",\n \"The additional fields are preferably optimized for the particular activity selected.\",\n \"For example only, if running is the selected activity, the fields generated preferably include “Route,” “Distance,” “Time” and “Notes” as shown in FIG.\",\n \"4.The “Route” field may be an open field in which the user may enter a description of the training route, or may be configured to receive a route name or code corresponding to a route which the user previously described and stored, for example, using a “create new route” feature 128 described in greater detail below.\",\n \"For example, a user may describe and store a training route corresponding to the user's run along the ocean, and associate the route with a route name or code “OR.” When the user subsequently enters information into the route field, the user may simply enter or select “OR” and the route information will be associated with the particular training log record being created.\",\n \"The “Distance” field preferably relates to the total distance the user travelled during the training activity.\",\n \"The “Distance” field may be automatically filled upon selection or entry of the route title or code, or modified independently of the route field.\",\n \"The “Time” field corresponds to the user's total training time for that activity.\",\n \"The “Notes” field is an open field which the user may enter notes regarding the training activity.\",\n \"Other fields may be added, for example, a heart rate field, a difficulty rating field, and/or a weather field.\",\n \"For a swimming activity, processor 104 may generate fields relating to location, distance, time, notes and whether a wetsuit was used.\",\n \"For a biking activity, processor 104 may generate fields relating to route, distance, time, maximum speed, average speed, power and heart rate.\",\n \"As with the running activity, the “Route” field may be automatically filled upon entry or selection of the route name or code, or modified independently of the route field.\",\n \"For the racing activity, processor 104 is preferably configured to generate fields relating to event category (e.g., running, biking, swimming, triathlon, duathlon, etc.\",\n \"), event sub-category and/or distance, splits, finish time, placing (over-all and age group) and notes.\",\n \"It will be appreciated that the number and type of activities may be varied as desired.\",\n \"Further, the number and type of fields may be modified as desired.\",\n \"Referring to FIGS.\",\n \"4 and 5, the graphical user interface for training log 124 preferably includes a “Summary” function 126.Summary function 126 preferably automatically tracks and updates the user's data.\",\n \"In order to facilitate tracking of the user's data, the data stored for each field in database 118 is associated with a code, which processor 104 uses to maintain a running tally depending upon the type of code.\",\n \"Preferably summary function 126 is organized into racing activities and training activities.\",\n \"Using running and biking as examples of training activities, processor 104 preferably updates a running tally for distance and time with each instance a new running or biking record is added to the user's training log.\",\n \"The running tally may be configured for one or more predetermined time periods.\",\n \"For example only, a running tally may be configured for weekly, monthly, annual, week-to-date, month-to-date and/or year-to-date for distance and/or time per an activity.\",\n \"For example only, if a user desires to learn what their year-to-date distance is for biking, the user may select the “Summary” function and select a “Training Activities” function.\",\n \"The “Training Activities” function preferably generates an activity field.\",\n \"Selecting the activity name or entering the activity code into the field preferably generates a summary specific to the activity.\",\n \"For example, with running and biking activities, a training information field and a time period field will be generated.\",\n \"The user may then have the option of selecting one or more types of training information (e.g., distance and training time) for a selected time period (e.g., weekly, monthly, year-to-date, etc.).\",\n \"Upon making the selections, processor 104 generates a summary using the selection criteria entered by the user.\",\n \"The summary is preferably in a list form and preferably includes a graphical representation of the summary such as shown in FIG.\",\n \"5.Referring to FIG.\",\n \"4, the training log preferably is configured with a “Records” function.\",\n \"The “Records” function preferably tracks a user's best performance data for a particular category of activity, for example, training and/or racing.\",\n \"For a training activity, the “Records” function, through processor 104 and training log database 118, stores the user's best performance record for a given activity.\",\n \"For example, for a training run where a user runs the “OC” route multiple times, each time the “OC” route is run by the user, the training time is entered by the user and processor 104 compares the newly entered time with prior times associated with the “OC” route.\",\n \"If a newly entered time for the “OC” route is less than any of the times currently of record for the “OC” route, the best time for the “OC” route is updated with the new best time and the date that the best time occurred.\",\n \"If a user wishes to see what their best time is for a particular route, they may choose the running activity on a pull-down menu labelled “route.” The pull-down menu will preferably be populated with the routes created from a “create new route” option 128, described in further detail below.\",\n \"When the user chooses a route from the pull-down menu, the records function will display the best time for that route and the date recorded for that time.\",\n \"Similar best performance records may be maintained for times for other activities such as biking and swimming.\",\n \"Best performance records may be customized and maintained depending upon the training activity.\",\n \"For example, for running, biking and swimming, separate best performance records are preferably maintained for fastest time and longest distance.\",\n \"For biking in particular, best performance records are preferably additionally maintained for best average speed and best maximum speed.\",\n \"For swimming, best times may be recorded for set training distances.\",\n \"If the category of activity relates to racing, the “Records” function is preferably configured to compare and update a user's best performance for a given race activity (e.g., running, biking, swimming, triathlon, etc.\",\n \"), sub-category and/or distance, splits, finish time, placing (over-all and age group) using methodology similar to that described above in relation to the training activity best records, but modified for the race environment.\",\n \"Examples of sub-categories of races for running include 5K, 10K, half-marathon, marathon, trailing running and track.\",\n \"Examples of races for cycling include road, track, cyclo-cross, mountain and BMX.\",\n \"Examples of sub-categories for races for swimming include open water and pool.\",\n \"Examples of sub-categories of races for multi-sport include triathlon (sprint, international, half-iron distance, iron distance), duathlon (sprint, international, long-distance), aquathon, aquabike, and off-road.\",\n \"A running tally on placings is preferably maintained.\",\n \"Placings may be maintained for over-all placing in a competition, placing within an age group (typically 5-year increments commencing from age 20), a “best placing percentage,” and career wins.\",\n \"The “Records” function is preferably configured to determine the “best” placings of the user within a given race.\",\n \"For example, if a user places 150th over-all out of a running race of 1,500 participants, the placing is preferably recorded as being in the top 10%.\",\n \"A subsequent placing of 100th out of 2,000 participants is preferably recorded as being in the top 5% and designated as the new best race placing.\",\n \"Similar place-tracking may be maintained within age groups.\",\n \"For career wins, the records function may track the number of first place wins over the span of their athletic career.\",\n \"The records function may also track age-group wins (i.e., the number of times the user wins their age-group).\",\n \"Referring to FIGS.\",\n \"4 and 6, platform 102 is preferably configured so that the user may create and record a route which may be used to later associate training data.\",\n \"Accessing link 128 will generate fields for the user to enter information pertaining to the route.\",\n \"A pull-down menu of activities such as running, cycling and swimming may permit the user to select an activity.\",\n \"Preferably, there will be two fields where the user enters information: a first field for entry of a route title or code, and a second one for entry of a route description.\",\n \"Once a route has been created and saved under the user-defined title or code, it will preferably be in a list of routes which will appear in the pull-down menu for the training log entries when entering training information.\",\n \"Referring to FIGS.\",\n \"4 and 7, the training log is preferably configured with an “Equipment Tracker” function 130.Equipment tracker function 130 tracks usage of various equipment used by the user during training and/or racing activities.\",\n \"For example, for running, the equipment tracker function 130 is preferably configured to track usage of running shoes and/or orthotics.\",\n \"For shoes, fields for brand, date of first use, notes, and warning distance may be filled by the user.\",\n \"This feature will track distance according to the distance logged when the user enters a distance for their run based on the dated entered in the date of first use field.\",\n \"The warning distance feature will cause a warning message to appear next time the user logs into their training log.\",\n \"The warning message will appear when the tally for the distance matches the warning distance value entered by the user.\",\n \"If desired, the warning message may be electronically communicated over a network to the user, for example, by e-mail or texting.\",\n \"For orthotics, fields will preferably be available for date of first use, notes and warning distance.\",\n \"For biking, the equipment tracker function 130 is preferably configured to track usage of one or more of a bike, a chain, a pair of tires, distance travelled since the last tune-up of the bike, cassette and odometer batteries.\",\n \"For the bike, fields will preferably be available for brand, date of first use, and notes.\",\n \"This feature will track distance according to the distance logged when the user enters a distance for their cycling based on the date entered in the date of first use field.\",\n \"For the chain, fields will preferably be available for date of first use, notes and warning distance.\",\n \"For tires, fields will preferably be available for date of first use, notes, warning distance.\",\n \"The tires category may be sub-divided into racing and training.\",\n \"For distance since last tune-up, fields will preferably be available for date of tune-up, notes and warning distance.\",\n \"This feature will track distance according to the distance logged when the user enters a distance for their cycling based on the date entered in the date of tune-up field.\",\n \"For the cassette, fields will preferably be available for date of first use and notes.\",\n \"For odometer batteries, fields will preferably be available for date of first use and notes.\",\n \"For swimming, equipment tracker function 130 is preferably configured to track usage of a pair of swimming goggles, wetsuit and swimsuit.\",\n \"Usage may be based on distance, time or a combination thereof.\",\n \"For goggles, fields will preferably be available for brand, date of first use and notes.\",\n \"This feature will track distance according to the distance logged when the user enters a distance for their swimming based on the date entered in the date of first use field.\",\n \"For wetsuit, dates will preferably be available for brand, date of first use and notes.\",\n \"This feature will track distance according to the distance logged when the user enters a distance for their swimming based on the date entered in the date of first use field and the user checks the box for “wetsuit used” option appearing on either the swim training or swim racing (open water) screen.\",\n \"For swimsuit, fields will preferably be available for brand, date of first use and notes.\",\n \"It will be appreciated that programmed functions of the training log may be varied as desired.\",\n \"One or more of the functions described above may be omitted, or additional functions may be programmed into the training log.\",\n \"Moreover, though described in relation to running, swimming, biking and triathlons, it will be appreciated that the training log may be adapted for other activities, such as a training gateway described below.\",\n \"In another preferred aspect of the present invention, platform 102 is preferably configured to function as a training gateway or nexus between an athlete and a coach.\",\n \"In order to maintain or improve fitness and athletic performance, athletes often associate themselves with a coach.\",\n \"Sometimes the coach is located at a remote location that renders it impractical for the athlete to attend a coaching session in person.\",\n \"Nonetheless, the athlete may obtain the benefit of a workout program generated by the coach by utilizing platform 102 as a training gateway.\",\n \"To facilitate implementation of a training plan between a coach and an athlete, platform 102 may be configured to maintain an athlete profile that combines portions of the user information stored at user database 112 and training records populated by use of training log 124.Referring to FIG.\",\n \"1, trailing log server 116 is preferably configured to maintain a plurality of athlete profiles.\",\n \"Each athlete profile preferably includes personal information such as that stored in user database 112 (described above), and a training record having a plurality of fields that each correspond to an aspect of a workout in which the athlete participated.\",\n \"The training records are preferably stored in training log database 118 and preferably populated such as described above with respect to training log 124.The athlete profile is preferably configured to receive a training plan uploaded by a third party such as a coach.\",\n \"The athlete associated with the athlete profile has preferably preselected the coach and/or training plan, and either uploaded the training plan themselves, or granted access to the coach to upload the training plan to their athlete profile.\",\n \"To complete the process of associating the training plan with the athlete profile, data from the training plan is preferably tagged for inclusion in fields reserved for training plan data.\",\n \"Thereafter, the athlete may view the uploaded training plan in their athlete profile.\",\n \"Processor 104 is preferably configured to send a notice to the athlete once the training plan has been uploaded and associated with the athlete profile.\",\n \"The notice may take many forms, for example, an e-mail, text message, or other forms of electronic messaging and/or print notification.\",\n \"The training plan preferably includes at least one workout.\",\n \"More preferably, the training plan includes a plurality of workouts configured to be completed over a predetermined interval of time.\",\n \"For example, a coach may have a training plan that includes one to three workouts over a predetermined number of days, months or seasons.\",\n \"It will be appreciated that only a single workout may be uploaded at a time if desired.\",\n \"For example, a coach may wish to upload a single workout per a day to the athlete profile.\",\n \"Preferably, the athlete receives notification that a new training plan or workout has been associated with their athlete profile.\",\n \"The athlete logs onto the platform, views their athlete profile, and takes note of the training plan or workout uploaded to the athlete profile by their coach.\",\n \"The athlete may then perform a scheduled workout, and after the workout, enter aspects of the completed workout into training log 124 to update the training record.\",\n \"Examples of fields used in the training record are illustrated in FIG.\",\n \"4 and may include a field corresponding to a distance aspect and/or a time aspect of the workout.\",\n \"The distance aspect may include the distance covered by the athlete during a training run or ride, or swum by an athlete in a body of water.\",\n \"The time aspect may include the interval of time to cover the distance trained.\",\n \"It will be appreciated that the distance and/or time may be sub-divided without departing from the scope of the present invention.\",\n \"For example, during a track workout, an athlete may record a plurality of timed distances.\",\n \"It will be appreciated that the training record may be configured with many fields including, but not limited to activity type (e.g., running, swimming, cycling, weight training), route, venue (e.g., city, park or pool), heart rate, and/or weather conditions.\",\n \"After the athlete updates the training record via training log 124, processor 104 preferably notifies the coach that the athlete has completed a workout.\",\n \"The notification may take any of the forms described above in relation to the notification provided to the athlete of the presence of the training plan or workout.\",\n \"The coach, after viewing the training record of the athlete, may alter an existing training plan on the athlete profile, or replace the existing training plan with a new training plan.\",\n \"It will be appreciated that if only a single workout is associated with the athlete profile, processor 104 may be configured to automatically delete the planned workout from the athlete profile once the athlete enters data indicating that the planned workout was completed.\",\n \"Likewise, at the end of a planned training cycle, the training plan may be automatically deleted from the athlete profile once all workouts have been completed.\",\n \"Referring to FIGS.\",\n \"8 and 9, on the provider side of the training gateway, a provider such as a coach preferably accesses one or more athlete profiles 132 through a user interface generated by processor 104 as a coaching dashboard 134.The coaching dashboard preferably includes a link to each athlete profile which the coach is authorized to access.\",\n \"Coaching dashboard 134 preferably includes a link to a training plan database 136, which is preferably maintained by platform 102 as shown in FIG.\",\n \"9.Training plan database 136 preferably is configured to store one or more training plans or workouts.\",\n \"It will be appreciated that the training plan database may be locally maintained at a workstation 138 of the coach.\",\n \"Referring to FIG.\",\n \"8, the coach, preferably taking into account the demographics and goals of the athlete, preferably designs or selects a training plan or workout for the athlete, and through the dashboard, uploads the training plan or workout to the selected athlete profile.\",\n \"After being notified that the athlete has completed the training cycle associated with the training plan, or one or more workouts, the coach may modify an existing plan on the athlete profile, or completely replace an existing training plan or workout in the athlete profile with a new training plan or workout.\",\n \"The coach may associate a training plan or workout for a single athlete, a plurality of individual athletes, and/or a group of athletes simultaneously.\",\n \"For example, in FIG.\",\n \"8, the training group Pacific Coast Group is selected via a pull down menu, and a time frame for the month of May is selected with a training plan (training plan 1A) for athletes 1, 2 and 3, who are members of the Pacific Coast Group.\",\n \"Athletes 1, 2 and 3 may be co-located in the same geographic vicinity, or widely dispersed around the country.\",\n \"As shown in FIG.\",\n \"1, platform 102 preferably includes a rankings generator 120.Details of a preferred rankings generator are found in U.S. application Ser.\",\n \"No.\",\n \"13/484,213, filed May 30, 2012, entitled “System and Method for Providing an Athlete with a Performance Profile,” the entire disclosure of which is incorporated by reference herein.\",\n \"Referring to FIG.\",\n \"1, platform 102 may be configured to permit media content providers to upload to media database 114 media specific to a registered user, which the registered user may access once logged-in.\",\n \"Details of a preferred medial portal are found in U.S. application Ser.\",\n \"No.\",\n \"13/484,213.Platform 102 is preferably programmed to automatically notify a registered user, more preferably, a subscriber, upon the uploading of results into results database 110.Platform 102 is further preferably configured to automatically notify a registered user upon the availability of media specific to the registered user.\",\n \"The media may become available upon uploading the media to the media database, or by a media content provider leaving an indication in the registered user's account that the media is available for access through a link to the media provider's website.\",\n \"The foregoing description is by way of example only, and may be varied considerably without departing from the scope of the present invention.\",\n \"For example only, the platform may be optimized for use with hand-held mobile devices.\",\n \"For example, a registered user may access their own training log while at the gym or immediately after a workout and update their training log remotely.\",\n \"Additionally, the training log may be updated automatically with a GPS device in sync with training log feature 124.For example, a cyclist or runner may wear a GPS-enabled device which is Internet ready so that as the user is training, training data is being communicated “live” to the user's personal training log on the platform.\",\n \"Upon finishing the training activity, the user may access a summary of the training activity.\",\n \"It will be appreciated that the device may communicate with the platform only after the training activity is complete to do a data dump in order to reduce Internet usage.\",\n \"The training gateway may be varied without departing from the scope of the present invention.\",\n \"For example only, referring to FIG.\",\n \"9, an athlete may wear a tracking device 140, such as a GPS enabled tracking device, that provides live updates to platform 102.Coaching dashboard 134 may be configured to provide the coach with live training information as the athlete is performing the workout.\",\n \"It will be appreciated that the live data feed provided by the tracking device may be used to monitor an athlete's performance during a competition and provide the coach with live data on the progress of the athlete during the competition.\",\n \"An example of a system for providing a live feed to a training log is described in U.S.\",\n \"Provisional Application No.\",\n \"61/705,232, filed Sep. 25, 2012, entitled “Interface and Method for Updating an Athlete Training Log,” the entire disclosure of which is incorporated by reference herein.\",\n \"In another preferred aspect, a system and method for transferring an athlete's training data from a bike computer to an online training log associated with the athlete is set forth.\",\n \"The system includes a mobile training computer, a mobile communications device, and a computer web-based platform.\",\n \"The preferred components of the system and their interaction with each other are described further below.\",\n \"The mobile training computer preferably includes a processor, a memory and a transceiver.\",\n \"Structurally, the mobile training computer is preferably sized and configured to be mounted on a user's bike.\",\n \"More preferably, the mobile training computer is adapted to be worn on the wrist of the user, and configured to be detached from the user and attached to the bike.\",\n \"The mobile training computer preferably includes Global Positioning System (GPS) hardware configured to permit the processor to track the position of the user throughout the duration of a training session, whether in the water or on land.\",\n \"The transceiver is preferably a peer-to-peer wireless communications radio.\",\n \"Preferably, the transceiver is configured to utilize Wi-Fi Direct to establish a peer-to-peer communications link with the mobile communications device.\",\n \"It will be appreciated that the transceiver may be configured to utilize other peer-to-peer communications protocols without departing from the scope of the present invention.\",\n \"For example only, the transceiver may be configured to utilize Bluetooth and/or near field communications.\",\n \"The specific details of the Wi-Fi Direct, Bluetooth and near field communications protocols would be appreciated by those of ordinary skill in the art and therefore are not repeated here.\",\n \"The mobile communications device is preferably a personal device such as a smart phone or tablet.\",\n \"Preferably, the mobile communications device is capable of establishing a wireless communications link using a communications network such as a satellite or cellular network.\",\n \"It will be appreciated that the mobile communications device may be configured to transfer data without utilizing a cellular network, for example only, by utilizing a local Wi-Fi network.\",\n \"The platform is preferably a computer web-based system accessible by the user through the Internet.\",\n \"The platform includes a processor and a training log server configured to store a plurality of user profiles.\",\n \"It will be appreciated that although data is shown stored at a remote location on the platform, data may also be stored in a cloud, or at one or more locations physically remote from the processor.\",\n \"In another preferred aspect, an exemplary method for transferring data from the mobile training computer and updating the user's online training log stored at training the log server is set forth.\",\n \"A peer-to-peer communications link is established between the mobile training computer and the mobile communications device.\",\n \"Preferably, the communications link is established utilizing a peer-to-peer transceiver located in the mobile training computer.\",\n \"More preferably, the communications link is established using Wi-Fi Direct, Bluetooth or near field communications.\",\n \"Next, the training data stored on the mobile training computer is transferred to the mobile communications device using the peer-to-peer communications link.\",\n \"The training data is then formatted for transfer from the mobile communications device to the web-based platform.\",\n \"Thereafter, the formatted training data is uploaded to the web-based platform to update the online training log of the user.\",\n \"It will be appreciated that the steps described above may be performed in a different order, varied, or certain steps omitted entirely without departing from the scope of the present invention.\",\n \"For example only, the data transferred from the mobile training computer may be transferred onto the online training log without any special formatting.\",\n \"If desired, training data may be transferred using an ordinary Wi-Fi connection between the mobile training computer and the platform.\",\n \"For example, the mobile training computer may be detached from the wrist of the user or the mount on the bike, and brought within a Wi-Fi hotspot.\",\n \"Thereafter, the training information may be uploaded into the user's online training log.\",\n \"The mobile training computer may be fitted with a non-peer-to-peer wireless communications link capable of accessing the Internet.\",\n \"For example, the mobile training computer may be fitted with a conventional Wi-Fi radio instead of, or in addition to a peer-to-peer configured radio transceiver.\",\n \"The mobile communications device may be fitted with a peer-to-peer configured radio transceiver.\",\n \"A peer-to-peer link may be established using either the mobile communications device or the mobile training computer.\",\n \"The mobile training computer may be worn on the user, for example, with a body strap at the wrist or about the user's chest.\",\n \"In the latter example, the mobile training computer may be configured to transmit information for display on a bike computer on the user's bike.\",\n \"As most of the circuitry is being worn by the user, the size of the bike computer may be greatly reduced, essentially to a display with a minimum of circuitry necessary to receive a data stream from the wearable mobile training computer.\",\n \"The mobile training computer may be configured to be worn on other areas of the body, such as the ankle or around the head.\",\n \"The “Summary” function may be modified to provide visual representations of training history in terms of pie charts and other visual aids.\",\n \"Additional fields may be added for weight, heart rate, difficulty rating and weather if desired.\",\n \"Annual reports may be generated and printed for each registered user as desired.\",\n \"The “Equipment Tracker” function may be modified to allow a user to enter their own equipment for tracking.\",\n \"Additionally, a “notes” field may be provided to permit the user to describe the brand of equipment, or other information as desired by the user.\",\n \"The warning distance feature may be configured to send a notification to the user via an electronic communication such as e-mail or texting.\",\n \"If desired, the warning described above may appear on the display of the mobile training computer.\",\n \"The warning may be transferred to the mobile training computer through the communications link established between the mobile communications device and the platform and/or between the communications device and the mobile training computer.\",\n \"Various parameters may be tracked by the mobile training computer and the warning distance stored locally by the mobile training computer and displayed on its display.\",\n \"The personalized calendar feature may be configured to determine if a registered user is within a predetermined distance from a competition, and provide the user with information regarding hotels and restaurants within a predetermined radius of the site of the competition.\",\n \"For example, if a registered user lives 75 miles away from a competition for which the user entered, the platform may send or e-mail the user information on all hotels within a 5 mile radius of the site of the competition.\",\n \"Moreover, the platform may be configured to determine vacancy information for the hotels and provide the user with hotel information for hotels still having vacancy.\",\n \"The platform may be configured to notify a registered user of the forecasted weather at the site of the competition a set number of days before the competition, for example, one, two and/or three days before the competition date.\",\n \"The weather forecast may include hourly forecasts if desired.\",\n \"The platform may be configured for use with activities other than running, cycling, swimming or multisport.\",\n \"For example only, the platform may be configured for use with weight training, kayaking, crew, hiking, mountain climbing, golf, tennis, martial arts, and other sports.\",\n \"Information normally stored at a physical location may be stored in a cloud, considerably reducing the hardware needed for memory requirements often associated with large volumes of data.\",\n \"The features described with respect to one embodiment may be applied to other embodiments, or combined with or interchanged with the features of other embodiments, as appropriate, without departing from the scope of the present invention.\",\n \"Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein.\",\n \"It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870858"}}},{"rowIdx":4493664,"cells":{"text":{"kind":"list like","value":[["Method for On-line Imaging of Mesophase Particles","On-line detection of mesophase particles employs a laser diode light source to illuminate a target area with a pulsed laser linearly or circularly polarized probe beam.","Analysis of images determines extent of presence the birefringent mesophase particles, which are precursors to coking in catalytic hydrocracking processes.","The inherently polarized low-coherence, unfocused but sufficiently collimated, pulsed laser beam yield sharp imaging with high depth of field of very small mesophase particles that are present in a moving, dark reactor liquid environment."],["1.A method of converting a heavy hydrocarbon feed into light hydrocarbon products comprising the steps of: (a) mixing a heavy hydrocarbons liquid feed with catalyst particles to form a slurry; (b) hydrocracking heavy hydrocarbons in the slurry in the presence of hydrogen in a reactor to produce a hydrocracked slurry product comprising lighter hydrocarbon products wherein the slurry product is withdrawn from the reactor; (c) monitoring mesophase particles in the reactor by (i) directing a pulsed laser probe beam from a laser diode light source along a first beam path into a continuous reactor fluid stream wherein the probe beam comprises linearly polarized light such that an output beam emerges from the continuous reactor fluid stream along a second beam path, (ii) obtaining an image of the mesophase particles in the continuous reactor fluid stream, and (iii) analyzing the image to determine at least one of volume fraction or size distribution of mesophase particles in the continuous reactor fluid stream; and (d) adjusting reactor conditions to reduce levels of mesophase particles formed during hydrocracking.","2.The method of claim 1 wherein the laser diode light source generates a pulsed laser probe beam without employing a polarizer filter.","3.","(canceled) 4.A method of converting a heavy hydrocarbon feed into light hydrocarbon products comprising the steps of: (a) mixing a heavy hydrocarbons liquid feed with catalyst particles to form a slurry; (b) hydrocracking heavy hydrocarbons in the slurry in the presence of hydrogen in a reactor to produce a hydrocracked slurry product comprising lighter hydrocarbon products wherein the slurry product is withdrawn from the reactor; (c) monitoring mesophase particles in the reactor by (i) directing a pulsed laser probe beam from a laser diode light source along a first beam path into a continuous reactor fluid stream wherein the probe beam comprises circularly polarized light and a quarter-wave plate converts linearly polarized light from the laser diode light source into circularly polarized light such that an output beam emerges from the continuous reactor fluid stream along a second beam path, (ii) obtaining an image of the mesophase particles in the continuous reactor fluid stream, and (iii) analyzing the image to determine at least one of volume fraction or size distribution of mesophase particles in the continuous reactor fluid stream; and (d) adjusting reactor conditions to reduce levels of mesophase particles formed during hydrocracking.","5.The method of claim 1 wherein the probe beam is reflected from a target area in the reactor fluid stream to form the output beam.","6.The method of claim 1 wherein the probe beam is transmitted through a target area in the reactor fluid stream to form the output beam.","7.The method of claim 1 wherein the probe beam illuminates a target area in the reactor fluid stream that is about 20 to 25 sq.","mm.","8.The method of claim 1 wherein the laser diode light source comprises a plurality of laser bars wherein each laser bar comprises one or more laser diodes and wherein the laser bars each emit a laser beam that is multiplexed to form the pulsed laser probe beam.","9.The method of claim 8 wherein each laser bar emits light of a different wavelength.","10.The method of claim 4 wherein the laser diode light source generates a pulsed laser probe beam without employing a polarizer filter.","11.The method of claim 4 wherein the probe beam is reflected from a target area in the reactor fluid stream to form the output beam.","12.The method of claim 4 wherein the probe beam is transmitted through a target area in the reactor fluid stream to form the output beam.","13.The method of claim 4 wherein the probe beam illuminates a target area in the reactor fluid stream that is about 20 to 25 sq.","mm.","14.The method of claim 4 wherein the laser diode light source comprises a plurality of laser bars wherein each laser bar comprises one or more laser diodes and wherein the laser bars each emit a laser beam that is multiplexed to form the pulsed laser probe beam and wherein each laser bar emits light of a different wavelength.","15.A method of converting a heavy hydrocarbon feed into light hydrocarbon products comprising the steps of: (a) mixing a heavy hydrocarbons liquid feed with catalyst particles to form a slurry; (b) hydrocracking heavy hydrocarbons in the slurry in the presence of hydrogen in a reactor to produce a hydrocracked slurry product comprising lighter hydrocarbon products wherein the slurry product is withdrawn from the reactor; (c) monitoring mesophase particles in the reactor by (i) directing a pulsed laser probe beam from a laser diode light source along a first beam path into a target area in a continuous reactor fluid stream, wherein the target area is about 20 to 25 sq.","mm, and wherein the probe beam comprises linearly polarized light or circularly polarized light such that an output beam emerges from the continuous reactor fluid stream along a second beam path, (ii) obtaining an image of the mesophase particles in the continuous reactor fluid stream, and (iii) analyzing the image to determine at least one of volume fraction or size distribution of mesophase particles in the continuous reactor fluid stream; and (d) adjusting reactor conditions to reduce levels of mesophase particles formed during hydrocracking.","16.The method of claim 15 wherein the laser diode light source generates a pulsed laser probe beam without employing a polarizer filter.","17.The method of claim 15 wherein the laser diode light source comprises a plurality of laser bars wherein each laser bar comprises one or more laser diodes and wherein the laser bars each emit a laser beam that is multiplexed to form the pulsed laser probe beam.","18.The method of claim 17 wherein each laser bar emits light of a different wavelength.","19.A method of converting a heavy hydrocarbon feed into light hydrocarbon products comprising the steps of: (a) mixing a heavy hydrocarbons liquid feed with catalyst particles to form a slurry; (b) hydrocracking heavy hydrocarbons in the slurry in the presence of hydrogen in a reactor to produce a hydrocracked slurry product comprising lighter hydrocarbon products wherein the slurry product is withdrawn from the reactor; (c) monitoring mesophase particles in the reactor by (i) directing a pulsed laser probe beam from a laser diode light source along a first beam path into a continuous reactor fluid stream wherein the probe beam comprises linearly polarized light or circularly polarized light such that an output beam emerges from the continuous reactor fluid stream along a second beam path, wherein the laser diode light source comprises a plurality of laser bars wherein each laser bar comprises one or more laser diodes and wherein the laser bars each emit a laser beam that is multiplexed to form the pulsed laser probe beam and wherein each laser bar emits light of a different wavelength (ii) obtaining an image of the mesophase particles in the continuous reactor fluid stream, and (iii) analyzing the image to determine at least one of volume fraction or size distribution of mesophase particles in the continuous reactor fluid stream; and (d) adjusting reactor conditions to reduce levels of mesophase particles formed during hydrocracking.","20.The method of claim 19 wherein the laser diode light source generates a pulsed laser probe beam without employing a polarizer filter.","21.The method of claim 19 wherein the probe beam illuminates a target area in the reactor fluid stream that is about 20 to 25 sq.","mm."],[" BACKGROUND OF THE INVENTION In heavy oil upgrading, heavier materials are converted to lighter fractions and most of the sulfur, nitrogen and metals must be removed.","Heavy oils include materials such as petroleum crude oil, atmospheric tower bottoms products, vacuum tower bottoms products, heavy cycle oils, shale oils, coal derived liquids, crude oil residuum, topped crude oils and the heavy bituminous oils extracted from oil sands.","Most residual oil feedstocks which are to be upgraded contain some level of asphaltenes which are typically understood to be heptane insoluble compounds.","Asphaltenes are high molecular weight compounds containing heteroatoms which impart polarity.","Heavy oil is upgraded in a primary upgrading unit before it can be further processed into useable products.","Primary upgrading units known in the art include coking processes, such as delayed or fluidized coking, and hydrogen addition processes such as ebullated bed or slurry hydrocracking (SHC).","In SHC, a three-phase mixture of heavy liquid oil feed cracks in the presence of gaseous hydrogen over solid catalyst to produce lighter products under pressure at an elevated temperature.","During an SHC reaction, it is important to minimize coking.","Under certain process conditions, the asphaltenes can self-associate, or flocculate to form larger molecules, generate a mesophase and precipitate out of solution to form coke.","Mesophase is a semi-crystalline carbonaceous material defined as round, anisotropic particles.","The presence of mesophase can serve as a warning that operating conditions are too severe in the SHC reactor and that coke formation is likely to occur under prevailing condition.","The formation of mesophase particles is typically monitored by labor-intensive laboratory analysis that entail several hours of delay to actual process events.","Industry is in need of a fast, on-line method of monitoring the volume fraction and size distribution of mesophase particles."],[" SUMMARY OF THE INVENTION The present invention is based in part on the recognition that obtaining sharp imaging with high depth of field of very small mesophase particles that are present in a moving, dark (high light absorption) reactor liquid environment can be achieved by using illumination from an inherently polarized, low-coherence, unfocused but sufficiently collimated, pulsed laser beam.","Mesophase particles in many chemical processes are precursors before coking.","They are anisotropic liquid crystal particles which consist of layered structures of polyaromatics.","These particles behave like an emulsion: particles can grow, coalesce and develop into coke in reactors.","The structures of mesophase particles make them visible using cross-polarized light microscopy.","Mesophase particles are birefrigent so they turn incident linearly polarized light into elliptically polarized light which can be observed in reflection or transmission behind a linear polarizer mounted 90 degrees with respect to the incident polarization direction.","Only changed polarization states will be observed.","The on-line cross-polarized light imaging technique enables precise measurements of mesophase particle volume fraction and particle size distribution in the reactor liquid.","The pulsed laser beam can be directly used for linear-polarized light imaging or for circular-polarized light imaging preferably with the use of quarter-wave plates.","In one aspect, the invention is directed to an on-line method for detection of mesophase particles formed in a hydrocarbon conversion reactor that includes the steps of: (a) establishing a continuous reactor fluid stream containing mesophase particles; (b) employing a laser diode light source to illuminate a target area of the reactor fluid stream with a pulsed laser probe beam along a first beam path that comprises linearly polarized light or circularly polarized light such that an output beam emerges (either reflected or transmitted) from the target area along a second beam path; (c) obtaining an image of the mesophase particles in the continuous reactor fluid stream; and (d) analyzing the image to determine at least one of (i) volume fraction or (ii) size distribution of mesophase particles in the continuous reactor fluid stream.","In another aspect, the invention is directed to a method of converting a heavy hydrocarbon feed into light hydrocarbon products that includes the steps of: (a) mixing a heavy hydrocarbons liquid feed with catalyst particles to form a slurry; (b) hydrocracking heavy hydrocarbons in the slurry in the presence of hydrogen in a reactor to produce a hydrocracked slurry product comprising lighter hydrocarbon products wherein the slurry product is withdrawn from the reactor; (c) monitoring mesophase particles in the reactor by (i) directing a pulsed laser probe beam from a laser diode light source along a first beam path into a continuous reactor fluid stream wherein the probe beam comprises linearly polarized light or circularly polarized light such that an output beam emerges from the continuous reactor fluid stream along a second beam path, (ii) obtaining an image of the mesophase particles in the continuous reactor fluid stream, and (iii) analyzing the image to determine at least one of volume fraction or size distribution of mesophase particles in the continuous reactor fluid stream; and (d) adjusting reactor conditions to reduce levels of mesophase particles formed during hydrocracking.","In yet another aspect, the invention is directed to a system for in-situ monitoring of mesophase particles formed in a hydrocarbon conversion reactor which generates a reactor fluid that includes: a laser diode light source that directs a pulsed laser probe beam comprising linearly polarized light or circularly polarized light along a first beam path into the reactor fluid such that an output beam emerges from the reactor fluid along a second beam path; a polarizing filter positioned in the second beam path that filters the output beam; a camera that detects the second beam path after passing the polarizing filter and generates signals that represent images of the mesophase particles in the reactor fluid; and means for analyzing the signals to determine at least one of volume fraction or size distribution of mesophase particles in the reactor fluid.","An inherently polarized illumination comprises a linearly polarized radiation with known polarization direction and sufficient polarization level, which is preferably more than 90%.","Depending on their configuration, laser sources can produce laser radiation that is randomly polarized or not randomly polarized.","In a preferred embodiment as described herein, the laser source used is a linearly polarized laser.","Image acquisition using a low coherence laser light source avoids the speckle phenomenon when imaging mesophase particles.","Speckle can lead to significant amounts of bright spots on the image which makes it difficult to detect mesophase particles which also appear bright.","An unfocused laser source generates light that is not focused on a single spot and which is advantageous for illuminating an area for area-scan imaging.","In addition, employing a sufficiently collimated laser beam is important for maintaining adequate illumination intensity which is not overly dependent on the target distance.","For example, while it feasible to attain a sufficiently wide but still very collimated beam from a sharply focused single-emitter laser using lens optics, it would be very difficult to avoid speckle using such an arrangement.","With the present invention, using a laser illuminator in which a wider beam is constructed by combining multiple diode emitters is able to overcome coherence artifacts.","A laser illuminator can be configured to achieve the desired level of low-coherence by through angle diversity by (i) employing a large number of emitters which diversifies the laser path lengths and angles and/or (ii) using a diffuser which randomizes the spatial angle of distribution that is accompanied by a slight decollimation of the illumination.","Another technique to insure low-coherence laser illumination is through wavelength diversity which is also achieved by using a large number of emitters.","Each unique emitter, which comprises an individual laser bar, generates radiation with a wavelength that is slightly different.","The reason is that the laser bars are not completely identical due to the nature of the manufacturing process.","With the present invention, an “unfocused” laser beam is not employed to illuminate the smallest possible spot in the fluid.","For the lens and imaging geometry employed, the laser beam should be sufficiently collimated so that the size of the beam is not excessively large in comparison to the target area.","Preferably the laser beam diameter should be less than twice the target area image diameter.","If the laser beam diameter is too large, laser energy is wasted and the illumination intensity is not adequate which result in less than optimum motion freezing or the depth of field (DOF) becomes too low.","Using a high-power pulsed illumination allows for a smaller lens aperture, which leads to a higher DOF.","The laser beam however should be large enough so as to avoid edge effects (vignetting) and be tolerant of relative vibration of the camera and illuminator.","By employing proper laser pulse durations and camera pixel resolution, motion of mesophase particles in a reactor flow channel can be “frozen” with the inventive cross-polarizer imaging techniques.","A high DOF renders measurements less sensitive to vibrations and permits a deeper test channel to be used.","A thicker portion of the reactor liquid being in focus near to sight window leads to the higher probability of detecting mesophase particles."],["REFERENCE TO RELATED APPLICATION This application is a divisional application of U.S. patent application Ser.","No.","15/226,340 which was filed on Aug. 2, 2016, which is incorporated herein by reference.","FIELD OF THE INVENTION The present invention generally relates to sensors and methods for detecting the presence of mesophase particles, which are precursors of coking, and more particularly to techniques of using an inherently polarized, unfocused but sufficiently collimated, pulsed laser beam illumination for on-line linear-polarized light imaging and circular-polarized light imaging of the mesophase particles.","BACKGROUND OF THE INVENTION In heavy oil upgrading, heavier materials are converted to lighter fractions and most of the sulfur, nitrogen and metals must be removed.","Heavy oils include materials such as petroleum crude oil, atmospheric tower bottoms products, vacuum tower bottoms products, heavy cycle oils, shale oils, coal derived liquids, crude oil residuum, topped crude oils and the heavy bituminous oils extracted from oil sands.","Most residual oil feedstocks which are to be upgraded contain some level of asphaltenes which are typically understood to be heptane insoluble compounds.","Asphaltenes are high molecular weight compounds containing heteroatoms which impart polarity.","Heavy oil is upgraded in a primary upgrading unit before it can be further processed into useable products.","Primary upgrading units known in the art include coking processes, such as delayed or fluidized coking, and hydrogen addition processes such as ebullated bed or slurry hydrocracking (SHC).","In SHC, a three-phase mixture of heavy liquid oil feed cracks in the presence of gaseous hydrogen over solid catalyst to produce lighter products under pressure at an elevated temperature.","During an SHC reaction, it is important to minimize coking.","Under certain process conditions, the asphaltenes can self-associate, or flocculate to form larger molecules, generate a mesophase and precipitate out of solution to form coke.","Mesophase is a semi-crystalline carbonaceous material defined as round, anisotropic particles.","The presence of mesophase can serve as a warning that operating conditions are too severe in the SHC reactor and that coke formation is likely to occur under prevailing condition.","The formation of mesophase particles is typically monitored by labor-intensive laboratory analysis that entail several hours of delay to actual process events.","Industry is in need of a fast, on-line method of monitoring the volume fraction and size distribution of mesophase particles.","SUMMARY OF THE INVENTION The present invention is based in part on the recognition that obtaining sharp imaging with high depth of field of very small mesophase particles that are present in a moving, dark (high light absorption) reactor liquid environment can be achieved by using illumination from an inherently polarized, low-coherence, unfocused but sufficiently collimated, pulsed laser beam.","Mesophase particles in many chemical processes are precursors before coking.","They are anisotropic liquid crystal particles which consist of layered structures of polyaromatics.","These particles behave like an emulsion: particles can grow, coalesce and develop into coke in reactors.","The structures of mesophase particles make them visible using cross-polarized light microscopy.","Mesophase particles are birefrigent so they turn incident linearly polarized light into elliptically polarized light which can be observed in reflection or transmission behind a linear polarizer mounted 90 degrees with respect to the incident polarization direction.","Only changed polarization states will be observed.","The on-line cross-polarized light imaging technique enables precise measurements of mesophase particle volume fraction and particle size distribution in the reactor liquid.","The pulsed laser beam can be directly used for linear-polarized light imaging or for circular-polarized light imaging preferably with the use of quarter-wave plates.","In one aspect, the invention is directed to an on-line method for detection of mesophase particles formed in a hydrocarbon conversion reactor that includes the steps of: (a) establishing a continuous reactor fluid stream containing mesophase particles; (b) employing a laser diode light source to illuminate a target area of the reactor fluid stream with a pulsed laser probe beam along a first beam path that comprises linearly polarized light or circularly polarized light such that an output beam emerges (either reflected or transmitted) from the target area along a second beam path; (c) obtaining an image of the mesophase particles in the continuous reactor fluid stream; and (d) analyzing the image to determine at least one of (i) volume fraction or (ii) size distribution of mesophase particles in the continuous reactor fluid stream.","In another aspect, the invention is directed to a method of converting a heavy hydrocarbon feed into light hydrocarbon products that includes the steps of: (a) mixing a heavy hydrocarbons liquid feed with catalyst particles to form a slurry; (b) hydrocracking heavy hydrocarbons in the slurry in the presence of hydrogen in a reactor to produce a hydrocracked slurry product comprising lighter hydrocarbon products wherein the slurry product is withdrawn from the reactor; (c) monitoring mesophase particles in the reactor by (i) directing a pulsed laser probe beam from a laser diode light source along a first beam path into a continuous reactor fluid stream wherein the probe beam comprises linearly polarized light or circularly polarized light such that an output beam emerges from the continuous reactor fluid stream along a second beam path, (ii) obtaining an image of the mesophase particles in the continuous reactor fluid stream, and (iii) analyzing the image to determine at least one of volume fraction or size distribution of mesophase particles in the continuous reactor fluid stream; and (d) adjusting reactor conditions to reduce levels of mesophase particles formed during hydrocracking.","In yet another aspect, the invention is directed to a system for in-situ monitoring of mesophase particles formed in a hydrocarbon conversion reactor which generates a reactor fluid that includes: a laser diode light source that directs a pulsed laser probe beam comprising linearly polarized light or circularly polarized light along a first beam path into the reactor fluid such that an output beam emerges from the reactor fluid along a second beam path; a polarizing filter positioned in the second beam path that filters the output beam; a camera that detects the second beam path after passing the polarizing filter and generates signals that represent images of the mesophase particles in the reactor fluid; and means for analyzing the signals to determine at least one of volume fraction or size distribution of mesophase particles in the reactor fluid.","An inherently polarized illumination comprises a linearly polarized radiation with known polarization direction and sufficient polarization level, which is preferably more than 90%.","Depending on their configuration, laser sources can produce laser radiation that is randomly polarized or not randomly polarized.","In a preferred embodiment as described herein, the laser source used is a linearly polarized laser.","Image acquisition using a low coherence laser light source avoids the speckle phenomenon when imaging mesophase particles.","Speckle can lead to significant amounts of bright spots on the image which makes it difficult to detect mesophase particles which also appear bright.","An unfocused laser source generates light that is not focused on a single spot and which is advantageous for illuminating an area for area-scan imaging.","In addition, employing a sufficiently collimated laser beam is important for maintaining adequate illumination intensity which is not overly dependent on the target distance.","For example, while it feasible to attain a sufficiently wide but still very collimated beam from a sharply focused single-emitter laser using lens optics, it would be very difficult to avoid speckle using such an arrangement.","With the present invention, using a laser illuminator in which a wider beam is constructed by combining multiple diode emitters is able to overcome coherence artifacts.","A laser illuminator can be configured to achieve the desired level of low-coherence by through angle diversity by (i) employing a large number of emitters which diversifies the laser path lengths and angles and/or (ii) using a diffuser which randomizes the spatial angle of distribution that is accompanied by a slight decollimation of the illumination.","Another technique to insure low-coherence laser illumination is through wavelength diversity which is also achieved by using a large number of emitters.","Each unique emitter, which comprises an individual laser bar, generates radiation with a wavelength that is slightly different.","The reason is that the laser bars are not completely identical due to the nature of the manufacturing process.","With the present invention, an “unfocused” laser beam is not employed to illuminate the smallest possible spot in the fluid.","For the lens and imaging geometry employed, the laser beam should be sufficiently collimated so that the size of the beam is not excessively large in comparison to the target area.","Preferably the laser beam diameter should be less than twice the target area image diameter.","If the laser beam diameter is too large, laser energy is wasted and the illumination intensity is not adequate which result in less than optimum motion freezing or the depth of field (DOF) becomes too low.","Using a high-power pulsed illumination allows for a smaller lens aperture, which leads to a higher DOF.","The laser beam however should be large enough so as to avoid edge effects (vignetting) and be tolerant of relative vibration of the camera and illuminator.","By employing proper laser pulse durations and camera pixel resolution, motion of mesophase particles in a reactor flow channel can be “frozen” with the inventive cross-polarizer imaging techniques.","A high DOF renders measurements less sensitive to vibrations and permits a deeper test channel to be used.","A thicker portion of the reactor liquid being in focus near to sight window leads to the higher probability of detecting mesophase particles.","BRIEF DESCRIPTION OF THE DRAWINGS FIG.","1 shows an on-line system for linear-polarized light imaging using obliquely (directional) reflected illumination imaging; FIG.","2 shows an on-line system for linear-polarized light imaging using reflected illumination imaging (coaxial); FIG.","3 shows an on-line system for linear-polarized light imaging using transillumination; FIG.","4 shows an on-line system for circular-polarized light imaging using obliquely (directional) reflected illumination imaging; FIG.","5 shows an on-line system for circular-polarized light imaging using reflected illumination imaging (coaxial); FIG.","6 shows an on-line system for circular-polarized light imaging using transillumination; and FIG.","7 is a flow diagram of a catalytic slurry hydrocracking process being monitored for mesophase particles.","DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS FIG.","1 illustrates a linear-polarized light imaging system 10 for in-situ monitoring of mesophase particles 2 that are present in a moving reactor liquid that is flowing through channel 4 which is defined by window 8 and channel wall 6.The window and channel wall can be a part of side-stream from a reactor chamber with known cross sectional dimensions at the area where the laser beam illuminates a target area in the reactor liquid.","The flow rate through the side-stream can be measured by sensor 14.Thus the volumetric flow rate through the channel can be calculated.","Window 8 is made of material such as glass or sapphire which is transparent to the laser light.","For linear-polarized light imaging, a laser illuminator 12 directs a laser probe beam 22 through window 8 and into channel 4.A preferred laser illuminator 12 combines the output of a plurality of laser bars 12A, 12B, 12C, by spatial multiplexing to become substantially parallel with an optical axis, while individually rotating the polarization of each diode output so that the combined output has substantially a single (linear) polarization.","Each laser bar comprises one or more diode lasers.","An exemplary laser illuminator configured with a plurality of laser bars is described in U.S. Pat.","No.","7,817,693 to Alahautala et al, which is incorporated herein by reference.","A suitable laser illuminator is commercially available as the Cavilux Smart model from Cavitar Oy (Valkeakoski, FI).","The pulsed laser beam 22 preferably has pulse duration of about 10 ns to 10 μs.","The required pulse duration depends on image resolution of the imaging device (camera) 16 used and the mesophase velocity of the reactor fluid in channel 4 that is adjacent widow 8.For example, if one pixel movement of the reactor liquid or fluid is permitted for the camera, which results in acceptable blur, the pulse direction ΔT BACKGROUND OF THE INVENTION In heavy oil upgrading, heavier materials are converted to lighter fractions and most of the sulfur, nitrogen and metals must be removed.\",\n \"Heavy oils include materials such as petroleum crude oil, atmospheric tower bottoms products, vacuum tower bottoms products, heavy cycle oils, shale oils, coal derived liquids, crude oil residuum, topped crude oils and the heavy bituminous oils extracted from oil sands.\",\n \"Most residual oil feedstocks which are to be upgraded contain some level of asphaltenes which are typically understood to be heptane insoluble compounds.\",\n \"Asphaltenes are high molecular weight compounds containing heteroatoms which impart polarity.\",\n \"Heavy oil is upgraded in a primary upgrading unit before it can be further processed into useable products.\",\n \"Primary upgrading units known in the art include coking processes, such as delayed or fluidized coking, and hydrogen addition processes such as ebullated bed or slurry hydrocracking (SHC).\",\n \"In SHC, a three-phase mixture of heavy liquid oil feed cracks in the presence of gaseous hydrogen over solid catalyst to produce lighter products under pressure at an elevated temperature.\",\n \"During an SHC reaction, it is important to minimize coking.\",\n \"Under certain process conditions, the asphaltenes can self-associate, or flocculate to form larger molecules, generate a mesophase and precipitate out of solution to form coke.\",\n \"Mesophase is a semi-crystalline carbonaceous material defined as round, anisotropic particles.\",\n \"The presence of mesophase can serve as a warning that operating conditions are too severe in the SHC reactor and that coke formation is likely to occur under prevailing condition.\",\n \"The formation of mesophase particles is typically monitored by labor-intensive laboratory analysis that entail several hours of delay to actual process events.\",\n \"Industry is in need of a fast, on-line method of monitoring the volume fraction and size distribution of mesophase particles.\"\n ],\n [\n \" SUMMARY OF THE INVENTION The present invention is based in part on the recognition that obtaining sharp imaging with high depth of field of very small mesophase particles that are present in a moving, dark (high light absorption) reactor liquid environment can be achieved by using illumination from an inherently polarized, low-coherence, unfocused but sufficiently collimated, pulsed laser beam.\",\n \"Mesophase particles in many chemical processes are precursors before coking.\",\n \"They are anisotropic liquid crystal particles which consist of layered structures of polyaromatics.\",\n \"These particles behave like an emulsion: particles can grow, coalesce and develop into coke in reactors.\",\n \"The structures of mesophase particles make them visible using cross-polarized light microscopy.\",\n \"Mesophase particles are birefrigent so they turn incident linearly polarized light into elliptically polarized light which can be observed in reflection or transmission behind a linear polarizer mounted 90 degrees with respect to the incident polarization direction.\",\n \"Only changed polarization states will be observed.\",\n \"The on-line cross-polarized light imaging technique enables precise measurements of mesophase particle volume fraction and particle size distribution in the reactor liquid.\",\n \"The pulsed laser beam can be directly used for linear-polarized light imaging or for circular-polarized light imaging preferably with the use of quarter-wave plates.\",\n \"In one aspect, the invention is directed to an on-line method for detection of mesophase particles formed in a hydrocarbon conversion reactor that includes the steps of: (a) establishing a continuous reactor fluid stream containing mesophase particles; (b) employing a laser diode light source to illuminate a target area of the reactor fluid stream with a pulsed laser probe beam along a first beam path that comprises linearly polarized light or circularly polarized light such that an output beam emerges (either reflected or transmitted) from the target area along a second beam path; (c) obtaining an image of the mesophase particles in the continuous reactor fluid stream; and (d) analyzing the image to determine at least one of (i) volume fraction or (ii) size distribution of mesophase particles in the continuous reactor fluid stream.\",\n \"In another aspect, the invention is directed to a method of converting a heavy hydrocarbon feed into light hydrocarbon products that includes the steps of: (a) mixing a heavy hydrocarbons liquid feed with catalyst particles to form a slurry; (b) hydrocracking heavy hydrocarbons in the slurry in the presence of hydrogen in a reactor to produce a hydrocracked slurry product comprising lighter hydrocarbon products wherein the slurry product is withdrawn from the reactor; (c) monitoring mesophase particles in the reactor by (i) directing a pulsed laser probe beam from a laser diode light source along a first beam path into a continuous reactor fluid stream wherein the probe beam comprises linearly polarized light or circularly polarized light such that an output beam emerges from the continuous reactor fluid stream along a second beam path, (ii) obtaining an image of the mesophase particles in the continuous reactor fluid stream, and (iii) analyzing the image to determine at least one of volume fraction or size distribution of mesophase particles in the continuous reactor fluid stream; and (d) adjusting reactor conditions to reduce levels of mesophase particles formed during hydrocracking.\",\n \"In yet another aspect, the invention is directed to a system for in-situ monitoring of mesophase particles formed in a hydrocarbon conversion reactor which generates a reactor fluid that includes: a laser diode light source that directs a pulsed laser probe beam comprising linearly polarized light or circularly polarized light along a first beam path into the reactor fluid such that an output beam emerges from the reactor fluid along a second beam path; a polarizing filter positioned in the second beam path that filters the output beam; a camera that detects the second beam path after passing the polarizing filter and generates signals that represent images of the mesophase particles in the reactor fluid; and means for analyzing the signals to determine at least one of volume fraction or size distribution of mesophase particles in the reactor fluid.\",\n \"An inherently polarized illumination comprises a linearly polarized radiation with known polarization direction and sufficient polarization level, which is preferably more than 90%.\",\n \"Depending on their configuration, laser sources can produce laser radiation that is randomly polarized or not randomly polarized.\",\n \"In a preferred embodiment as described herein, the laser source used is a linearly polarized laser.\",\n \"Image acquisition using a low coherence laser light source avoids the speckle phenomenon when imaging mesophase particles.\",\n \"Speckle can lead to significant amounts of bright spots on the image which makes it difficult to detect mesophase particles which also appear bright.\",\n \"An unfocused laser source generates light that is not focused on a single spot and which is advantageous for illuminating an area for area-scan imaging.\",\n \"In addition, employing a sufficiently collimated laser beam is important for maintaining adequate illumination intensity which is not overly dependent on the target distance.\",\n \"For example, while it feasible to attain a sufficiently wide but still very collimated beam from a sharply focused single-emitter laser using lens optics, it would be very difficult to avoid speckle using such an arrangement.\",\n \"With the present invention, using a laser illuminator in which a wider beam is constructed by combining multiple diode emitters is able to overcome coherence artifacts.\",\n \"A laser illuminator can be configured to achieve the desired level of low-coherence by through angle diversity by (i) employing a large number of emitters which diversifies the laser path lengths and angles and/or (ii) using a diffuser which randomizes the spatial angle of distribution that is accompanied by a slight decollimation of the illumination.\",\n \"Another technique to insure low-coherence laser illumination is through wavelength diversity which is also achieved by using a large number of emitters.\",\n \"Each unique emitter, which comprises an individual laser bar, generates radiation with a wavelength that is slightly different.\",\n \"The reason is that the laser bars are not completely identical due to the nature of the manufacturing process.\",\n \"With the present invention, an “unfocused” laser beam is not employed to illuminate the smallest possible spot in the fluid.\",\n \"For the lens and imaging geometry employed, the laser beam should be sufficiently collimated so that the size of the beam is not excessively large in comparison to the target area.\",\n \"Preferably the laser beam diameter should be less than twice the target area image diameter.\",\n \"If the laser beam diameter is too large, laser energy is wasted and the illumination intensity is not adequate which result in less than optimum motion freezing or the depth of field (DOF) becomes too low.\",\n \"Using a high-power pulsed illumination allows for a smaller lens aperture, which leads to a higher DOF.\",\n \"The laser beam however should be large enough so as to avoid edge effects (vignetting) and be tolerant of relative vibration of the camera and illuminator.\",\n \"By employing proper laser pulse durations and camera pixel resolution, motion of mesophase particles in a reactor flow channel can be “frozen” with the inventive cross-polarizer imaging techniques.\",\n \"A high DOF renders measurements less sensitive to vibrations and permits a deeper test channel to be used.\",\n \"A thicker portion of the reactor liquid being in focus near to sight window leads to the higher probability of detecting mesophase particles.\"\n ],\n [\n \"REFERENCE TO RELATED APPLICATION This application is a divisional application of U.S. patent application Ser.\",\n \"No.\",\n \"15/226,340 which was filed on Aug. 2, 2016, which is incorporated herein by reference.\",\n \"FIELD OF THE INVENTION The present invention generally relates to sensors and methods for detecting the presence of mesophase particles, which are precursors of coking, and more particularly to techniques of using an inherently polarized, unfocused but sufficiently collimated, pulsed laser beam illumination for on-line linear-polarized light imaging and circular-polarized light imaging of the mesophase particles.\",\n \"BACKGROUND OF THE INVENTION In heavy oil upgrading, heavier materials are converted to lighter fractions and most of the sulfur, nitrogen and metals must be removed.\",\n \"Heavy oils include materials such as petroleum crude oil, atmospheric tower bottoms products, vacuum tower bottoms products, heavy cycle oils, shale oils, coal derived liquids, crude oil residuum, topped crude oils and the heavy bituminous oils extracted from oil sands.\",\n \"Most residual oil feedstocks which are to be upgraded contain some level of asphaltenes which are typically understood to be heptane insoluble compounds.\",\n \"Asphaltenes are high molecular weight compounds containing heteroatoms which impart polarity.\",\n \"Heavy oil is upgraded in a primary upgrading unit before it can be further processed into useable products.\",\n \"Primary upgrading units known in the art include coking processes, such as delayed or fluidized coking, and hydrogen addition processes such as ebullated bed or slurry hydrocracking (SHC).\",\n \"In SHC, a three-phase mixture of heavy liquid oil feed cracks in the presence of gaseous hydrogen over solid catalyst to produce lighter products under pressure at an elevated temperature.\",\n \"During an SHC reaction, it is important to minimize coking.\",\n \"Under certain process conditions, the asphaltenes can self-associate, or flocculate to form larger molecules, generate a mesophase and precipitate out of solution to form coke.\",\n \"Mesophase is a semi-crystalline carbonaceous material defined as round, anisotropic particles.\",\n \"The presence of mesophase can serve as a warning that operating conditions are too severe in the SHC reactor and that coke formation is likely to occur under prevailing condition.\",\n \"The formation of mesophase particles is typically monitored by labor-intensive laboratory analysis that entail several hours of delay to actual process events.\",\n \"Industry is in need of a fast, on-line method of monitoring the volume fraction and size distribution of mesophase particles.\",\n \"SUMMARY OF THE INVENTION The present invention is based in part on the recognition that obtaining sharp imaging with high depth of field of very small mesophase particles that are present in a moving, dark (high light absorption) reactor liquid environment can be achieved by using illumination from an inherently polarized, low-coherence, unfocused but sufficiently collimated, pulsed laser beam.\",\n \"Mesophase particles in many chemical processes are precursors before coking.\",\n \"They are anisotropic liquid crystal particles which consist of layered structures of polyaromatics.\",\n \"These particles behave like an emulsion: particles can grow, coalesce and develop into coke in reactors.\",\n \"The structures of mesophase particles make them visible using cross-polarized light microscopy.\",\n \"Mesophase particles are birefrigent so they turn incident linearly polarized light into elliptically polarized light which can be observed in reflection or transmission behind a linear polarizer mounted 90 degrees with respect to the incident polarization direction.\",\n \"Only changed polarization states will be observed.\",\n \"The on-line cross-polarized light imaging technique enables precise measurements of mesophase particle volume fraction and particle size distribution in the reactor liquid.\",\n \"The pulsed laser beam can be directly used for linear-polarized light imaging or for circular-polarized light imaging preferably with the use of quarter-wave plates.\",\n \"In one aspect, the invention is directed to an on-line method for detection of mesophase particles formed in a hydrocarbon conversion reactor that includes the steps of: (a) establishing a continuous reactor fluid stream containing mesophase particles; (b) employing a laser diode light source to illuminate a target area of the reactor fluid stream with a pulsed laser probe beam along a first beam path that comprises linearly polarized light or circularly polarized light such that an output beam emerges (either reflected or transmitted) from the target area along a second beam path; (c) obtaining an image of the mesophase particles in the continuous reactor fluid stream; and (d) analyzing the image to determine at least one of (i) volume fraction or (ii) size distribution of mesophase particles in the continuous reactor fluid stream.\",\n \"In another aspect, the invention is directed to a method of converting a heavy hydrocarbon feed into light hydrocarbon products that includes the steps of: (a) mixing a heavy hydrocarbons liquid feed with catalyst particles to form a slurry; (b) hydrocracking heavy hydrocarbons in the slurry in the presence of hydrogen in a reactor to produce a hydrocracked slurry product comprising lighter hydrocarbon products wherein the slurry product is withdrawn from the reactor; (c) monitoring mesophase particles in the reactor by (i) directing a pulsed laser probe beam from a laser diode light source along a first beam path into a continuous reactor fluid stream wherein the probe beam comprises linearly polarized light or circularly polarized light such that an output beam emerges from the continuous reactor fluid stream along a second beam path, (ii) obtaining an image of the mesophase particles in the continuous reactor fluid stream, and (iii) analyzing the image to determine at least one of volume fraction or size distribution of mesophase particles in the continuous reactor fluid stream; and (d) adjusting reactor conditions to reduce levels of mesophase particles formed during hydrocracking.\",\n \"In yet another aspect, the invention is directed to a system for in-situ monitoring of mesophase particles formed in a hydrocarbon conversion reactor which generates a reactor fluid that includes: a laser diode light source that directs a pulsed laser probe beam comprising linearly polarized light or circularly polarized light along a first beam path into the reactor fluid such that an output beam emerges from the reactor fluid along a second beam path; a polarizing filter positioned in the second beam path that filters the output beam; a camera that detects the second beam path after passing the polarizing filter and generates signals that represent images of the mesophase particles in the reactor fluid; and means for analyzing the signals to determine at least one of volume fraction or size distribution of mesophase particles in the reactor fluid.\",\n \"An inherently polarized illumination comprises a linearly polarized radiation with known polarization direction and sufficient polarization level, which is preferably more than 90%.\",\n \"Depending on their configuration, laser sources can produce laser radiation that is randomly polarized or not randomly polarized.\",\n \"In a preferred embodiment as described herein, the laser source used is a linearly polarized laser.\",\n \"Image acquisition using a low coherence laser light source avoids the speckle phenomenon when imaging mesophase particles.\",\n \"Speckle can lead to significant amounts of bright spots on the image which makes it difficult to detect mesophase particles which also appear bright.\",\n \"An unfocused laser source generates light that is not focused on a single spot and which is advantageous for illuminating an area for area-scan imaging.\",\n \"In addition, employing a sufficiently collimated laser beam is important for maintaining adequate illumination intensity which is not overly dependent on the target distance.\",\n \"For example, while it feasible to attain a sufficiently wide but still very collimated beam from a sharply focused single-emitter laser using lens optics, it would be very difficult to avoid speckle using such an arrangement.\",\n \"With the present invention, using a laser illuminator in which a wider beam is constructed by combining multiple diode emitters is able to overcome coherence artifacts.\",\n \"A laser illuminator can be configured to achieve the desired level of low-coherence by through angle diversity by (i) employing a large number of emitters which diversifies the laser path lengths and angles and/or (ii) using a diffuser which randomizes the spatial angle of distribution that is accompanied by a slight decollimation of the illumination.\",\n \"Another technique to insure low-coherence laser illumination is through wavelength diversity which is also achieved by using a large number of emitters.\",\n \"Each unique emitter, which comprises an individual laser bar, generates radiation with a wavelength that is slightly different.\",\n \"The reason is that the laser bars are not completely identical due to the nature of the manufacturing process.\",\n \"With the present invention, an “unfocused” laser beam is not employed to illuminate the smallest possible spot in the fluid.\",\n \"For the lens and imaging geometry employed, the laser beam should be sufficiently collimated so that the size of the beam is not excessively large in comparison to the target area.\",\n \"Preferably the laser beam diameter should be less than twice the target area image diameter.\",\n \"If the laser beam diameter is too large, laser energy is wasted and the illumination intensity is not adequate which result in less than optimum motion freezing or the depth of field (DOF) becomes too low.\",\n \"Using a high-power pulsed illumination allows for a smaller lens aperture, which leads to a higher DOF.\",\n \"The laser beam however should be large enough so as to avoid edge effects (vignetting) and be tolerant of relative vibration of the camera and illuminator.\",\n \"By employing proper laser pulse durations and camera pixel resolution, motion of mesophase particles in a reactor flow channel can be “frozen” with the inventive cross-polarizer imaging techniques.\",\n \"A high DOF renders measurements less sensitive to vibrations and permits a deeper test channel to be used.\",\n \"A thicker portion of the reactor liquid being in focus near to sight window leads to the higher probability of detecting mesophase particles.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS FIG.\",\n \"1 shows an on-line system for linear-polarized light imaging using obliquely (directional) reflected illumination imaging; FIG.\",\n \"2 shows an on-line system for linear-polarized light imaging using reflected illumination imaging (coaxial); FIG.\",\n \"3 shows an on-line system for linear-polarized light imaging using transillumination; FIG.\",\n \"4 shows an on-line system for circular-polarized light imaging using obliquely (directional) reflected illumination imaging; FIG.\",\n \"5 shows an on-line system for circular-polarized light imaging using reflected illumination imaging (coaxial); FIG.\",\n \"6 shows an on-line system for circular-polarized light imaging using transillumination; and FIG.\",\n \"7 is a flow diagram of a catalytic slurry hydrocracking process being monitored for mesophase particles.\",\n \"DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS FIG.\",\n \"1 illustrates a linear-polarized light imaging system 10 for in-situ monitoring of mesophase particles 2 that are present in a moving reactor liquid that is flowing through channel 4 which is defined by window 8 and channel wall 6.The window and channel wall can be a part of side-stream from a reactor chamber with known cross sectional dimensions at the area where the laser beam illuminates a target area in the reactor liquid.\",\n \"The flow rate through the side-stream can be measured by sensor 14.Thus the volumetric flow rate through the channel can be calculated.\",\n \"Window 8 is made of material such as glass or sapphire which is transparent to the laser light.\",\n \"For linear-polarized light imaging, a laser illuminator 12 directs a laser probe beam 22 through window 8 and into channel 4.A preferred laser illuminator 12 combines the output of a plurality of laser bars 12A, 12B, 12C, by spatial multiplexing to become substantially parallel with an optical axis, while individually rotating the polarization of each diode output so that the combined output has substantially a single (linear) polarization.\",\n \"Each laser bar comprises one or more diode lasers.\",\n \"An exemplary laser illuminator configured with a plurality of laser bars is described in U.S. Pat.\",\n \"No.\",\n \"7,817,693 to Alahautala et al, which is incorporated herein by reference.\",\n \"A suitable laser illuminator is commercially available as the Cavilux Smart model from Cavitar Oy (Valkeakoski, FI).\",\n \"The pulsed laser beam 22 preferably has pulse duration of about 10 ns to 10 μs.\",\n \"The required pulse duration depends on image resolution of the imaging device (camera) 16 used and the mesophase velocity of the reactor fluid in channel 4 that is adjacent widow 8.For example, if one pixel movement of the reactor liquid or fluid is permitted for the camera, which results in acceptable blur, the pulse direction ΔT BACKGROUND A printed circuit board (PCB) generally includes a circuit layer for transmitting electric signals and connecting electronic components.","A circuit line width of a PCB production process is limited to a thickness of copper traces.","Only thin copper is used to form fine conductive traces."],[" BRIEF DESCRIPTION OF THE DRAWINGS Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.","FIG.","1 illustrates a flexible base copper provided as a foil on a roll.","FIG.","2 is a cross-sectional view of a single side copper cladding substrate.","FIG.","3 is a cross-sectional view of a photosensitive film laminated to a first surface of the base copper foil.","FIG.","4 is a cross-sectional view of the photosensitive film exposed, developed, and etched as a shielding layer on the first surface.","FIG.","5 is a cross-sectional view of a plating copper layer formed on openings of the shielding layer, using a copper plating method.","FIG.","6 is a cross-sectional view of the shielding layer removed from the first surface.","FIG.","7 is a cross-sectional view of a first protecting layer laminated on the first conductive trace pattern.","FIG.","8 is a cross-sectional view of a supporting sheet removed from the base copper foil.","FIG.","9 is a cross-sectional view of the base copper foil reduced using a gridding method.","FIG.","10 is a cross-sectional view of a photosensitive film laminated to a third surface of the copper sheet.","FIG.","11 is a cross-sectional view of a second shielding layer formed on the third surface.","FIG.","12 is a cross-sectional view of a copper plating layer formed on the openings using an electroplating method.","FIG.","13 is a cross-sectional view of the second shielding layer removed to form the second conductive trace pattern on the third surface.","FIG.","14 is a cross-sectional view of the base copper foil etched to form a base conductive trace pattern.","FIG.","15 is a cross-sectional view of a second protecting layer laminated on the second conductive trace pattern, a printed circuit board with high-capacity copper circuit being thereby obtained.","FIG.","16 illustrates a flowchart of a manufacturing method for a printed circuit board with high-capacity copper circuit.","detailed-description description=\"Detailed Description\" end=\"lead\"?"],["This application is a divisional application of a commonly-assigned application entitled “PRINTED CIRCUIT BOARD WITH HIGH-CAPACITY COPPER CIRCUIT AND METHOD FOR MANUFACTURING SAME” filed on 2016-12-29 with application Ser.","No.","15/394,735.The above-identified application is incorporated herein by reference.","TECHNICAL FIELD The subject matter herein generally relates to printed circuit boards.","BACKGROUND A printed circuit board (PCB) generally includes a circuit layer for transmitting electric signals and connecting electronic components.","A circuit line width of a PCB production process is limited to a thickness of copper traces.","Only thin copper is used to form fine conductive traces.","BRIEF DESCRIPTION OF THE DRAWINGS Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.","FIG.","1 illustrates a flexible base copper provided as a foil on a roll.","FIG.","2 is a cross-sectional view of a single side copper cladding substrate.","FIG.","3 is a cross-sectional view of a photosensitive film laminated to a first surface of the base copper foil.","FIG.","4 is a cross-sectional view of the photosensitive film exposed, developed, and etched as a shielding layer on the first surface.","FIG.","5 is a cross-sectional view of a plating copper layer formed on openings of the shielding layer, using a copper plating method.","FIG.","6 is a cross-sectional view of the shielding layer removed from the first surface.","FIG.","7 is a cross-sectional view of a first protecting layer laminated on the first conductive trace pattern.","FIG.","8 is a cross-sectional view of a supporting sheet removed from the base copper foil.","FIG.","9 is a cross-sectional view of the base copper foil reduced using a gridding method.","FIG.","10 is a cross-sectional view of a photosensitive film laminated to a third surface of the copper sheet.","FIG.","11 is a cross-sectional view of a second shielding layer formed on the third surface.","FIG.","12 is a cross-sectional view of a copper plating layer formed on the openings using an electroplating method.","FIG.","13 is a cross-sectional view of the second shielding layer removed to form the second conductive trace pattern on the third surface.","FIG.","14 is a cross-sectional view of the base copper foil etched to form a base conductive trace pattern.","FIG.","15 is a cross-sectional view of a second protecting layer laminated on the second conductive trace pattern, a printed circuit board with high-capacity copper circuit being thereby obtained.","FIG.","16 illustrates a flowchart of a manufacturing method for a printed circuit board with high-capacity copper circuit.","DETAILED DESCRIPTION It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements.","In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein.","However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details.","In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described.","Also, the description is not to be considered as limiting the scope of the embodiments described herein.","The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.","Several definitions that apply throughout this disclosure will now be presented.","The term “substantially” is defined as essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact.","For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder.","The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.","The references “a plurality of” and “a number of” mean “at least two.” FIG.","15 illustrates a printed circuit board with high-capacity copper circuit 100 according to a first exemplary embodiment.","The printed circuit board with high-capacity copper circuit 100 includes a conductive trace 20, a first protecting layer 150, and a second protecting layer 160.The first protecting layer 150 and the second protecting layer 160 are formed on opposite sides of the conductive trace 20.The conductive trace 20 includes a base conductive trace pattern 120, a first conductive trace pattern 130, and a second conductive trace pattern 140.The base conductive trace pattern 120 is sandwiched between the first conductive trace pattern 130 and the second conductive trace pattern 140.In this exemplary embodiment, the first conductive trace pattern 130 and the second conductive trace pattern 140 are directly formed on opposite surfaces of the base copper conductive trace pattern 120 by using a copper plating method, for example.","The first conductive trace pattern 130 and the second conductive trace pattern 140 are in electrically contact with the base conductive trace pattern 120.A line width of the base conductive trace pattern 120, a line width of the first conductive trace pattern 130, and a line width of the second conductive trace pattern 140 are substantially the same.","A thickness of the first conductive trace pattern 130 is equal to a thickness of the second conductive trace pattern 140.In the illustrated embodiment, a thickness of the first conductive trace pattern 130 and a thickness of the second conductive trace pattern 140 are in a range from about 60 to 70 microns (i.e., 60 to 70*10̂-6 meters).","The first protecting layer 150 covers the first conductive trace pattern 130, and fills in the first gaps 132 between the first conductive trace pattern 130.The second protecting layer 160 covers the second conductive trace pattern 140, and fills in the second gaps 142 between the second conductive trace pattern 140 and the third gaps 122 between the base conductive trace pattern 120.In the illustrated embodiment, the first protecting layer 150 is a Cover Layer (CVL), and includes a base layer 152 and an adhering layer 154 formed on the base layer 152.FIG.","16 illustrates a flowchart of a manufacturing method in accordance with a second exemplary embodiment.","An exemplary method 200 for manufacturing the thick copper circuit 100 (shown in FIG.","15) is provided by way of an example, as there are a variety of ways to carry out the method.","Additionally, the illustrated order of blocks is by way of example only.","The order of the blocks may change.","The method 200 can begin at block 201, as shown in FIG.","16.At block 201, with reference to FIG.","1 and FIG.","2, a copper cladding substrate 10 is provided.","The single side copper cladding substrate 10 includes a supporting sheet 11 and a base copper foil 12.The base copper foil 12 includes a first surface 121 and a second surface 123 opposite to the first surface 121.The supporting sheet 11 is located on the second surface 123.The supporting sheet 11 is selected from a group consisting of polyethylene glycol terephthalate (PET), poly naphthalene dicarboxylic acid glycol ester (PEN), and polyimide (PI).","In the illustrated embodiment, a method of providing the single side copper cladding substrate 10 includes the following steps.","First, as shown in FIG.","1, a roll (roll 101) of flexible base copper foil 12 is provided and the base copper foil 12 is unrolled.","The thickness of the base copper foil 12 is about 18 micrometers.","The base copper foil 12 includes the first surface 121 and the second surface 123 opposite to the first surface 121.Second, the supporting sheet 11 is laminated to the second surface 123, and the base copper foil 12 adhering to the supporting sheet 11 is cut to a required size, thereby forming a plurality of pieces of the single side copper cladding substrate 10.In other embodiments, the supporting sheet 11 is provided from a wrapped roll and the supporting sheet 11 is unrolled.","A copper plating method, or a copper deposition method or a sputtering process can then be used to form the base copper foil 12 on the supporting sheet 11, creating a single side copper cladding substrate 10.At block 202, with reference to FIG.","3 to FIG.","6, a first conductive trace pattern 130 is formed on the first surface 121 by using a copper electroplating method, for example.","A first conductive circuit pattern is formed on a first surface of the base copper foil 12.In the illustrated embodiment, a method for forming the first conductive trace pattern 130 is as follows: As shown in FIG.","3, a photosensitive film 110 is adhered to the first surface 121, a thickness of the photosensitive film 110 is about 75 microns.","As shown in FIG.","4, the photosensitive film 110 is exposed, developed, and etched.","As a result, a first shielding layer 112 is formed on the first surface 121.The first shielding layer 112 includes a plurality of openings 114.The openings 114 expose portions of the base copper foil 12.With reference to FIG.","5, a copper layer is formed in the openings 114 by using a electroplating method, for example.","The plated copper layer forms the first conductive trace pattern 130.With reference to FIG.","6, the first shielding layer 112 is removed from the first surface 121.The first conductive trace pattern 130 is situated on the surface 121 of the base copper foil 12.At block 203, with reference to FIG.","7, a first protecting layer 150 is applied on the first conductive trace pattern 130.The first protecting layer 150 protects the first conductive trace pattern 130 from oxidation, scratches, and so on.","In the illustrated embodiment, the first protecting layer 150 is CoverLay (CVL), and includes a base layer 152 and an adhering layer 154 formed on the base layer 152.The adhering layer 154 fills in the first gaps 132 formed by the base copper foil 12 and the first conductive trace pattern 130, and covers the first conductive trace pattern 130.In another exemplary embodiment, the first protecting layer 150 is a solder mask.","At block 204, with reference to FIG.","8 and FIG.","9, the supporting sheet 11 (as shown in FIG.","7) is removed from the base copper foil 12, and thickness of the base copper foil 12 is reduced by using a gridding method, for example.","A thickness of the base copper foil 12 is reduced.","The second surface 123 is removed by grinding, resulting in a third surface 125.In this way, a thickness of the base copper foil 12 is retained to be about 2 to 6 microns.","At block 205, with reference to FIG.","10 to FIG.","13, a second conductive trace pattern 140 is formed on the third surface 125.The shape of the second conductive trace pattern 140 is the same as the shape of the first conductive trace pattern 130, and a thickness of the second conductive trace pattern 140 is substantially equal to a thickness of the first conductive trace pattern 130.In the illustrated embodiment, the second conductive trace pattern 140 is formed using the same method as that used for the first conductive trace pattern 130.That is to say, the second conductive trace pattern 140 is formed in the following way.","Firstly, as shown in FIG.","10, a photosensitive film 115 is laminated to the third surface 125.Secondly, the photosensitive film 115 is exposed, developed, and etched to form a second shielding layer 116 on the third surface 125, as shown in FIG.","11.The second shielding layer 116 includes a plurality of openings 118, the openings 118 are configured to expose portions of the base copper foil 12.As shown in FIG.","12, a copper layer is formed in the openings 118 by using an electroplating method, for example.","The plating copper layer is configured to form the second conductive trace pattern 140.As shown in FIG.","13, the second shielding layer 116 is removed from the base copper foil 12, the second conductive trace pattern 140 being on the third surface 125.The respective thicknesses of the first conductive trace pattern 130 and of the second conductive trace pattern 140 are in a range from about 60 to 70 microns.","At block 206, with reference to FIG.","14, the base copper foil 12 exposed in parts by the third gaps 122, is removed by etching The remaining portions of the base copper foil 12 form a base conductive trace pattern 120, a thickness of the base conductive trace pattern is about 2-6 microns, in a preferred embodiment, a thickness of the base conductive trace pattern is about 2 microns.","The third gaps 122 between the base conductive trace pattern 120, the first gaps 132 between the first conductive trace pattern 130, and the second gaps 142 between the second conductive trace pattern 140 are aligned with each other.","That is, the widths of the traces of the base conductive trace pattern 120, of the first conductive trace pattern 130, and of the second conductive trace pattern 140 are substantially the same.","The base conductive trace pattern 120, the first conductive trace pattern 130, and the second conductive trace pattern 140 together form the conductive trace 20.A thickness of the conductive trace 20 is about 122 microns to 146 microns.","In a preferred embodiment, a thickness of the conductive trace 20 is about 125 microns.","A width of each of the first gaps 132 of the first conductive trace pattern 130 is about 100 um or 130 um.","At block 207, with reference to FIG.","15, a second protecting layer 160 is applied on the second conductive trace pattern 140.The second protecting layer 160 also fills in the second gaps 142 between the second conductive trace pattern 140, and the third gaps 122 between the base conductive trace pattern 120.The circuit conductive 20 is formed by using an etching method and an electroplating method, for example.","A thickness of the conductive trace 20 is about 125 microns .","Thereby, the printed circuit board with thick copper circuit 100 is obtained.","When the printed circuit board with thick copper circuit 100 is in use, openings are formed in the first protective layer 150 and second protection layer 160 by a laser cutting method, and parts of the conductive trace 20 are exposed.","The exposed portions can be used as electrical pads, and electronic components can be arranged on such pads.","The embodiments shown and described above are only examples.","Therefore, many such details are neither shown nor described.","Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, including in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including the full extent established by the broad general meaning of the terms used in the claims.","It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims."]],"string":"[\n [\n \"PRINTED CIRCUIT BOARD WITH HIGH-CAPACITY COPPER CIRCUIT\",\n \"A printed circuit board with high-capacity and high-current copper circuit includes a conductive trace, a first protecting layer, and a second protecting layer on opposite sides of the conductive trace.\",\n \"The conductive trace includes a basic conductive trace pattern, a first conductive trace pattern, and a second conductive trace pattern.\",\n \"The first and second conductive trace patterns are directly formed on opposite surfaces of the basic copper conductive trace pattern.\",\n \"A width of trace of the first conductive trace pattern is the same as a line width of the second conductive trace pattern.\"\n ],\n [\n \"1.A printed circuit board with high-capacity copper circuit comprising: a conductive trace; a first protecting layer and a second protecting layer respectively formed on two opposite sides of the conductive trace, wherein the conductive trace comprising: a base conductive trace pattern, a first conductive trace pattern and a second conductive trace pattern, wherein the first conductive trace pattern and the second conductive trace pattern are directly formed on two opposite sides of the base copper conductive trace pattern, and wherein a trace width of the first conductive trace pattern is the same as a trace width of the second conductive trace pattern, and is the same as a trace width of the base conductive trace pattern.\",\n \"2.The printed circuit board of claim 1, wherein the first conductive trace pattern is in electrically contacted with the base conductive trace pattern.\",\n \"3.The printed circuit board of claim 1, wherein the second conductive trace pattern is in electrically contacted with the base conductive trace pattern.\",\n \"4.The printed circuit board of claim 1, wherein a thickness of the first conductive trace pattern is the same as a thickness of the second conductive trace pattern.\",\n \"5.The printed circuit board of claim 1, wherein the first protecting layer and the second protecting layer are pre-pregnant or solder mask.\",\n \"6.The printed circuit board of claim 1, wherein the first protecting layer is filled with the first gaps between the first conductive trace pattern, the second protecting layer is filled with first gaps between the first conductive trace pattern the second gaps between the second conductive trace pattern and the third gaps between the base conductive trace pattern.\",\n \"7.The printed circuit board of claim 4, wherein a thickness of the first conductive trace pattern is in a range from about 60 to 70 microns.\",\n \"8.The printed circuit board of claim 2, wherein a thickness of the base conductive trace pattern is in a range from about 2 to 6 microns.\",\n \"9.The printed circuit board of claim 2, wherein the first conductive trace pattern and the second conductive trace pattern are formed on the base copper conductive trace pattern using copper electroplating method or a chemical vapor deposition method.\",\n \"10.The printed circuit board of claim 2, wherein a shape of the first conductive trace is the same as a shape of the second conductive trace pattern.\",\n \"11.The printed circuit board of claim 1, wherein a width of the first gaps is about 100 um or 130 um.\"\n ],\n [\n \" BACKGROUND A printed circuit board (PCB) generally includes a circuit layer for transmitting electric signals and connecting electronic components.\",\n \"A circuit line width of a PCB production process is limited to a thickness of copper traces.\",\n \"Only thin copper is used to form fine conductive traces.\"\n ],\n [\n \" BRIEF DESCRIPTION OF THE DRAWINGS Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.\",\n \"FIG.\",\n \"1 illustrates a flexible base copper provided as a foil on a roll.\",\n \"FIG.\",\n \"2 is a cross-sectional view of a single side copper cladding substrate.\",\n \"FIG.\",\n \"3 is a cross-sectional view of a photosensitive film laminated to a first surface of the base copper foil.\",\n \"FIG.\",\n \"4 is a cross-sectional view of the photosensitive film exposed, developed, and etched as a shielding layer on the first surface.\",\n \"FIG.\",\n \"5 is a cross-sectional view of a plating copper layer formed on openings of the shielding layer, using a copper plating method.\",\n \"FIG.\",\n \"6 is a cross-sectional view of the shielding layer removed from the first surface.\",\n \"FIG.\",\n \"7 is a cross-sectional view of a first protecting layer laminated on the first conductive trace pattern.\",\n \"FIG.\",\n \"8 is a cross-sectional view of a supporting sheet removed from the base copper foil.\",\n \"FIG.\",\n \"9 is a cross-sectional view of the base copper foil reduced using a gridding method.\",\n \"FIG.\",\n \"10 is a cross-sectional view of a photosensitive film laminated to a third surface of the copper sheet.\",\n \"FIG.\",\n \"11 is a cross-sectional view of a second shielding layer formed on the third surface.\",\n \"FIG.\",\n \"12 is a cross-sectional view of a copper plating layer formed on the openings using an electroplating method.\",\n \"FIG.\",\n \"13 is a cross-sectional view of the second shielding layer removed to form the second conductive trace pattern on the third surface.\",\n \"FIG.\",\n \"14 is a cross-sectional view of the base copper foil etched to form a base conductive trace pattern.\",\n \"FIG.\",\n \"15 is a cross-sectional view of a second protecting layer laminated on the second conductive trace pattern, a printed circuit board with high-capacity copper circuit being thereby obtained.\",\n \"FIG.\",\n \"16 illustrates a flowchart of a manufacturing method for a printed circuit board with high-capacity copper circuit.\",\n \"detailed-description description=\\\"Detailed Description\\\" end=\\\"lead\\\"?\"\n ],\n [\n \"This application is a divisional application of a commonly-assigned application entitled “PRINTED CIRCUIT BOARD WITH HIGH-CAPACITY COPPER CIRCUIT AND METHOD FOR MANUFACTURING SAME” filed on 2016-12-29 with application Ser.\",\n \"No.\",\n \"15/394,735.The above-identified application is incorporated herein by reference.\",\n \"TECHNICAL FIELD The subject matter herein generally relates to printed circuit boards.\",\n \"BACKGROUND A printed circuit board (PCB) generally includes a circuit layer for transmitting electric signals and connecting electronic components.\",\n \"A circuit line width of a PCB production process is limited to a thickness of copper traces.\",\n \"Only thin copper is used to form fine conductive traces.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.\",\n \"FIG.\",\n \"1 illustrates a flexible base copper provided as a foil on a roll.\",\n \"FIG.\",\n \"2 is a cross-sectional view of a single side copper cladding substrate.\",\n \"FIG.\",\n \"3 is a cross-sectional view of a photosensitive film laminated to a first surface of the base copper foil.\",\n \"FIG.\",\n \"4 is a cross-sectional view of the photosensitive film exposed, developed, and etched as a shielding layer on the first surface.\",\n \"FIG.\",\n \"5 is a cross-sectional view of a plating copper layer formed on openings of the shielding layer, using a copper plating method.\",\n \"FIG.\",\n \"6 is a cross-sectional view of the shielding layer removed from the first surface.\",\n \"FIG.\",\n \"7 is a cross-sectional view of a first protecting layer laminated on the first conductive trace pattern.\",\n \"FIG.\",\n \"8 is a cross-sectional view of a supporting sheet removed from the base copper foil.\",\n \"FIG.\",\n \"9 is a cross-sectional view of the base copper foil reduced using a gridding method.\",\n \"FIG.\",\n \"10 is a cross-sectional view of a photosensitive film laminated to a third surface of the copper sheet.\",\n \"FIG.\",\n \"11 is a cross-sectional view of a second shielding layer formed on the third surface.\",\n \"FIG.\",\n \"12 is a cross-sectional view of a copper plating layer formed on the openings using an electroplating method.\",\n \"FIG.\",\n \"13 is a cross-sectional view of the second shielding layer removed to form the second conductive trace pattern on the third surface.\",\n \"FIG.\",\n \"14 is a cross-sectional view of the base copper foil etched to form a base conductive trace pattern.\",\n \"FIG.\",\n \"15 is a cross-sectional view of a second protecting layer laminated on the second conductive trace pattern, a printed circuit board with high-capacity copper circuit being thereby obtained.\",\n \"FIG.\",\n \"16 illustrates a flowchart of a manufacturing method for a printed circuit board with high-capacity copper circuit.\",\n \"DETAILED DESCRIPTION It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements.\",\n \"In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein.\",\n \"However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details.\",\n \"In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described.\",\n \"Also, the description is not to be considered as limiting the scope of the embodiments described herein.\",\n \"The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.\",\n \"Several definitions that apply throughout this disclosure will now be presented.\",\n \"The term “substantially” is defined as essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact.\",\n \"For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder.\",\n \"The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.\",\n \"The references “a plurality of” and “a number of” mean “at least two.” FIG.\",\n \"15 illustrates a printed circuit board with high-capacity copper circuit 100 according to a first exemplary embodiment.\",\n \"The printed circuit board with high-capacity copper circuit 100 includes a conductive trace 20, a first protecting layer 150, and a second protecting layer 160.The first protecting layer 150 and the second protecting layer 160 are formed on opposite sides of the conductive trace 20.The conductive trace 20 includes a base conductive trace pattern 120, a first conductive trace pattern 130, and a second conductive trace pattern 140.The base conductive trace pattern 120 is sandwiched between the first conductive trace pattern 130 and the second conductive trace pattern 140.In this exemplary embodiment, the first conductive trace pattern 130 and the second conductive trace pattern 140 are directly formed on opposite surfaces of the base copper conductive trace pattern 120 by using a copper plating method, for example.\",\n \"The first conductive trace pattern 130 and the second conductive trace pattern 140 are in electrically contact with the base conductive trace pattern 120.A line width of the base conductive trace pattern 120, a line width of the first conductive trace pattern 130, and a line width of the second conductive trace pattern 140 are substantially the same.\",\n \"A thickness of the first conductive trace pattern 130 is equal to a thickness of the second conductive trace pattern 140.In the illustrated embodiment, a thickness of the first conductive trace pattern 130 and a thickness of the second conductive trace pattern 140 are in a range from about 60 to 70 microns (i.e., 60 to 70*10̂-6 meters).\",\n \"The first protecting layer 150 covers the first conductive trace pattern 130, and fills in the first gaps 132 between the first conductive trace pattern 130.The second protecting layer 160 covers the second conductive trace pattern 140, and fills in the second gaps 142 between the second conductive trace pattern 140 and the third gaps 122 between the base conductive trace pattern 120.In the illustrated embodiment, the first protecting layer 150 is a Cover Layer (CVL), and includes a base layer 152 and an adhering layer 154 formed on the base layer 152.FIG.\",\n \"16 illustrates a flowchart of a manufacturing method in accordance with a second exemplary embodiment.\",\n \"An exemplary method 200 for manufacturing the thick copper circuit 100 (shown in FIG.\",\n \"15) is provided by way of an example, as there are a variety of ways to carry out the method.\",\n \"Additionally, the illustrated order of blocks is by way of example only.\",\n \"The order of the blocks may change.\",\n \"The method 200 can begin at block 201, as shown in FIG.\",\n \"16.At block 201, with reference to FIG.\",\n \"1 and FIG.\",\n \"2, a copper cladding substrate 10 is provided.\",\n \"The single side copper cladding substrate 10 includes a supporting sheet 11 and a base copper foil 12.The base copper foil 12 includes a first surface 121 and a second surface 123 opposite to the first surface 121.The supporting sheet 11 is located on the second surface 123.The supporting sheet 11 is selected from a group consisting of polyethylene glycol terephthalate (PET), poly naphthalene dicarboxylic acid glycol ester (PEN), and polyimide (PI).\",\n \"In the illustrated embodiment, a method of providing the single side copper cladding substrate 10 includes the following steps.\",\n \"First, as shown in FIG.\",\n \"1, a roll (roll 101) of flexible base copper foil 12 is provided and the base copper foil 12 is unrolled.\",\n \"The thickness of the base copper foil 12 is about 18 micrometers.\",\n \"The base copper foil 12 includes the first surface 121 and the second surface 123 opposite to the first surface 121.Second, the supporting sheet 11 is laminated to the second surface 123, and the base copper foil 12 adhering to the supporting sheet 11 is cut to a required size, thereby forming a plurality of pieces of the single side copper cladding substrate 10.In other embodiments, the supporting sheet 11 is provided from a wrapped roll and the supporting sheet 11 is unrolled.\",\n \"A copper plating method, or a copper deposition method or a sputtering process can then be used to form the base copper foil 12 on the supporting sheet 11, creating a single side copper cladding substrate 10.At block 202, with reference to FIG.\",\n \"3 to FIG.\",\n \"6, a first conductive trace pattern 130 is formed on the first surface 121 by using a copper electroplating method, for example.\",\n \"A first conductive circuit pattern is formed on a first surface of the base copper foil 12.In the illustrated embodiment, a method for forming the first conductive trace pattern 130 is as follows: As shown in FIG.\",\n \"3, a photosensitive film 110 is adhered to the first surface 121, a thickness of the photosensitive film 110 is about 75 microns.\",\n \"As shown in FIG.\",\n \"4, the photosensitive film 110 is exposed, developed, and etched.\",\n \"As a result, a first shielding layer 112 is formed on the first surface 121.The first shielding layer 112 includes a plurality of openings 114.The openings 114 expose portions of the base copper foil 12.With reference to FIG.\",\n \"5, a copper layer is formed in the openings 114 by using a electroplating method, for example.\",\n \"The plated copper layer forms the first conductive trace pattern 130.With reference to FIG.\",\n \"6, the first shielding layer 112 is removed from the first surface 121.The first conductive trace pattern 130 is situated on the surface 121 of the base copper foil 12.At block 203, with reference to FIG.\",\n \"7, a first protecting layer 150 is applied on the first conductive trace pattern 130.The first protecting layer 150 protects the first conductive trace pattern 130 from oxidation, scratches, and so on.\",\n \"In the illustrated embodiment, the first protecting layer 150 is CoverLay (CVL), and includes a base layer 152 and an adhering layer 154 formed on the base layer 152.The adhering layer 154 fills in the first gaps 132 formed by the base copper foil 12 and the first conductive trace pattern 130, and covers the first conductive trace pattern 130.In another exemplary embodiment, the first protecting layer 150 is a solder mask.\",\n \"At block 204, with reference to FIG.\",\n \"8 and FIG.\",\n \"9, the supporting sheet 11 (as shown in FIG.\",\n \"7) is removed from the base copper foil 12, and thickness of the base copper foil 12 is reduced by using a gridding method, for example.\",\n \"A thickness of the base copper foil 12 is reduced.\",\n \"The second surface 123 is removed by grinding, resulting in a third surface 125.In this way, a thickness of the base copper foil 12 is retained to be about 2 to 6 microns.\",\n \"At block 205, with reference to FIG.\",\n \"10 to FIG.\",\n \"13, a second conductive trace pattern 140 is formed on the third surface 125.The shape of the second conductive trace pattern 140 is the same as the shape of the first conductive trace pattern 130, and a thickness of the second conductive trace pattern 140 is substantially equal to a thickness of the first conductive trace pattern 130.In the illustrated embodiment, the second conductive trace pattern 140 is formed using the same method as that used for the first conductive trace pattern 130.That is to say, the second conductive trace pattern 140 is formed in the following way.\",\n \"Firstly, as shown in FIG.\",\n \"10, a photosensitive film 115 is laminated to the third surface 125.Secondly, the photosensitive film 115 is exposed, developed, and etched to form a second shielding layer 116 on the third surface 125, as shown in FIG.\",\n \"11.The second shielding layer 116 includes a plurality of openings 118, the openings 118 are configured to expose portions of the base copper foil 12.As shown in FIG.\",\n \"12, a copper layer is formed in the openings 118 by using an electroplating method, for example.\",\n \"The plating copper layer is configured to form the second conductive trace pattern 140.As shown in FIG.\",\n \"13, the second shielding layer 116 is removed from the base copper foil 12, the second conductive trace pattern 140 being on the third surface 125.The respective thicknesses of the first conductive trace pattern 130 and of the second conductive trace pattern 140 are in a range from about 60 to 70 microns.\",\n \"At block 206, with reference to FIG.\",\n \"14, the base copper foil 12 exposed in parts by the third gaps 122, is removed by etching The remaining portions of the base copper foil 12 form a base conductive trace pattern 120, a thickness of the base conductive trace pattern is about 2-6 microns, in a preferred embodiment, a thickness of the base conductive trace pattern is about 2 microns.\",\n \"The third gaps 122 between the base conductive trace pattern 120, the first gaps 132 between the first conductive trace pattern 130, and the second gaps 142 between the second conductive trace pattern 140 are aligned with each other.\",\n \"That is, the widths of the traces of the base conductive trace pattern 120, of the first conductive trace pattern 130, and of the second conductive trace pattern 140 are substantially the same.\",\n \"The base conductive trace pattern 120, the first conductive trace pattern 130, and the second conductive trace pattern 140 together form the conductive trace 20.A thickness of the conductive trace 20 is about 122 microns to 146 microns.\",\n \"In a preferred embodiment, a thickness of the conductive trace 20 is about 125 microns.\",\n \"A width of each of the first gaps 132 of the first conductive trace pattern 130 is about 100 um or 130 um.\",\n \"At block 207, with reference to FIG.\",\n \"15, a second protecting layer 160 is applied on the second conductive trace pattern 140.The second protecting layer 160 also fills in the second gaps 142 between the second conductive trace pattern 140, and the third gaps 122 between the base conductive trace pattern 120.The circuit conductive 20 is formed by using an etching method and an electroplating method, for example.\",\n \"A thickness of the conductive trace 20 is about 125 microns .\",\n \"Thereby, the printed circuit board with thick copper circuit 100 is obtained.\",\n \"When the printed circuit board with thick copper circuit 100 is in use, openings are formed in the first protective layer 150 and second protection layer 160 by a laser cutting method, and parts of the conductive trace 20 are exposed.\",\n \"The exposed portions can be used as electrical pads, and electronic components can be arranged on such pads.\",\n \"The embodiments shown and described above are only examples.\",\n \"Therefore, many such details are neither shown nor described.\",\n \"Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, including in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including the full extent established by the broad general meaning of the terms used in the claims.\",\n \"It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870865"}}},{"rowIdx":4493666,"cells":{"text":{"kind":"list like","value":[["Vehicle Service Contract Rating Method and Algorithm System","In an embodiment, a method is provided.","The method includes receiving a request for a vehicle service contract.","The request includes a mileage of a vehicle, a type of the vehicle, a custom requested coverage for the vehicle and a custom requested term of the vehicle service contract.","The method also includes analyzing specific vehicle details from request for vehicle service contract.","The method further includes calculating a custom quote for the vehicle service contract based on the mileage of the vehicle, the type of vehicle, a custom requested coverage and a custom requested term of the vehicle service contract.","The method also includes providing the custom quote for vehicle service contract to a consumer.","The method further includes receiving a request to complete vehicle service contract based on custom quote from consumer.","The method includes issuing vehicle service contract to consumer based on custom quote and request to complete the vehicle service contract from consumer."],["1.A method, comprising: receiving a request for a vehicle service contract, the request including a mileage of a vehicle, a type of the vehicle, a custom requested coverage for the vehicle and a custom requested term of the vehicle service contract; analyzing specific vehicle details from request for vehicle service contract; calculating a custom quote for vehicle service contract based on mileage of vehicle, type of vehicle, custom requested coverage and custom requested term of vehicle service contract; providing the custom quote for vehicle service contract to a consumer; receiving request to complete vehicle service contract based on custom quote from consumer; and issuing vehicle service contract to consumer based on custom quote and request to complete vehicle service contract from consumer.","2.The method of claim 1, further comprising: receiving a request for coverage of a repair based on the vehicle service contract; verifying coverage of the repair based on the vehicle service contract; authorizing coverage of the repair based on the vehicle service contract; receiving confirmation of completion of the repair based on the vehicle service contract; and providing payment at a predetermined rate responsive to confirmation of completion of the repair based on the vehicle service contract.","3.The method of claim 2, wherein: confirmation of completion of the repair based on the vehicle service contract includes documentation from an entity asserting that the entity completed repairs to the vehicle of the request for vehicle service contract.","4.The method of claim 3, wherein: calculating the custom quote for the vehicle service contract based on a factor multiplied by mileage of vehicle enumerated in miles, type of vehicle, custom requested coverage and a factor multiplied by custom requested term of vehicle service contract enumerated in calendar days.","5.The method of claim 4, wherein: calculating the custom quote for the vehicle service contract further based on a factor for any requested powertrain coverage and a factor for any requested non-powertrain coverage.","6.The method of claim 5, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for present mileage of the vehicle.","7.The method of claim 6, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for a deductible amount of the vehicle service contract.","8.The method of claim 7, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for a minimum premium for the vehicle service contract.","9.The method of claim 8, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for present age of the vehicle enumerated in days.","10.The method of claim 9, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for a vehicle class of the vehicle.","11.The method of claim 1, wherein: calculating the custom quote for the vehicle service contract further based on a factor for any requested powertrain coverage and a factor for any requested non-powertrain coverage.","12.The method of claim 11, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for present mileage of the vehicle enumerated in miles and present age of the vehicle enumerated in days.","13.The method of claim 12, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for a vehicle class of the vehicle.","14.The method of claim 13, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for a deductible amount of the vehicle service contract and a minimum premium for the vehicle service contract.","15.A method, comprising: receiving a request for a vehicle service contract, the request including a mileage of a vehicle, a type of the vehicle, a custom requested coverage for the vehicle and a custom requested term of the vehicle service contract; analyzing specific vehicle details from request for vehicle service contract; calculating a custom quote for vehicle service contract based on mileage of vehicle enumerated in miles, type of vehicle, custom requested coverage, custom requested term of vehicle service contract enumerated in days, a factor for any requested powertrain coverage, a factor for any requested non-powertrain coverage, a factor adjusting for present mileage of the vehicle enumerated in miles, a factor adjusting for present age of the vehicle enumerated in days, a factor adjusting for a vehicle class of the vehicle, a factor adjusting for a deductible amount of the vehicle service contract and a minimum premium for the vehicle service contract; providing the custom quote for vehicle service contract to a consumer; receiving request to complete vehicle service contract based on custom quote from consumer; issuing vehicle service contract to consumer based on custom quote and request to complete vehicle service contract from consumer; receiving a request for coverage of a repair based on the vehicle service contract; verifying coverage of the repair based on the vehicle service contract; authorizing coverage of the repair based on the vehicle service contract; receiving confirmation of completion of the repair based on the vehicle service contract including documentation from an entity asserting that the entity completed repairs to the vehicle of the request for vehicle service contract; and providing payment at a predetermined rate responsive to confirmation of completion of the repair based on the vehicle service contract.","16.A method, comprising: receiving a request for a vehicle service contract, the request including a mileage of a vehicle, a type of the vehicle, a custom requested coverage for the vehicle and a custom requested term of the vehicle service contract; analyzing specific vehicle details from request for vehicle service contract; calculating a custom quote for vehicle service contract based on covered mileage of vehicle enumerated in miles, type of vehicle, custom requested coverage, custom requested term of vehicle service contract enumerated in days, a factor for any requested powertrain coverage, a factor for any requested non-powertrain coverage, a factor adjusting for present mileage of the vehicle enumerated in miles, and a factor adjusting for present age of the vehicle enumerated in days; providing the custom quote for vehicle service contract to a consumer; receiving request to complete vehicle service contract based on custom quote from consumer; issuing vehicle service contract to consumer based on custom quote and request to complete vehicle service contract from consumer; receiving a request for coverage of a repair based on the vehicle service contract; verifying coverage of the repair based on the vehicle service contract; authorizing coverage of the repair based on the vehicle service contract; receiving confirmation of completion of the repair based on the vehicle service contract including documentation from an entity asserting that the entity completed repairs to the vehicle of the request for vehicle service contract; and providing payment at a predetermined rate responsive to confirmation of completion of the repair based on the vehicle service contract.","17.The method of claim 16, wherein: calculating a custom quote for vehicle service contract further based on a factor adjusting for a vehicle class of the vehicle, a factor adjusting for a deductible amount of the vehicle service contract and a minimum premium for the vehicle service contract."],[" BACKGROUND "],[" SUMMARY In an embodiment, a method is provided.","The method includes receiving a request for a vehicle service contract.","The request includes a mileage of a vehicle, a type of the vehicle, a custom requested coverage for the vehicle and a custom requested term of the vehicle service contract.","The method also includes analyzing specific vehicle details from request for vehicle service contract.","The method further includes calculating a custom quote for the vehicle service contract based on the mileage of the vehicle, the type of vehicle, a custom requested coverage and a custom requested term of the vehicle service contract.","The method also includes providing the custom quote for vehicle service contract to a consumer.","The method further includes receiving a request to complete vehicle service contract based on custom quote from consumer.","The method includes issuing vehicle service contract to consumer based on custom quote and request to complete the vehicle service contract from consumer.","Calculating a custom quote for a vehicle service contract may be based on mileage of vehicle enumerated in miles, type of vehicle, custom requested coverage, custom requested term of vehicle service contract enumerated in days, a factor for any requested powertrain coverage, a factor for any requested non-powertrain coverage, a factor adjusting for present Mile age of the vehicle enumerated in miles, a factor adjusting for present age of the vehicle enumerated in days, a factor adjusting for a vehicle class of the vehicle, a factor adjusting for a deductible amount of the vehicle service contract and a minimum premium for the vehicle service contract."],["BACKGROUND 1.Field of Invention The present invention relates to the field of methods for pricing vehicle service contract insurance coverage through unique rating calculations and a computer algorithm system therefor.","2.Description of Related Art Currently, manufacturers have provided warranties in the form of a manufacturer warranty for a period of time, or, in the case of a vehicle such as a car, various warranty periods for different components or component groups.","An example for cars is a bumper-to-bumper warranty for all components of the car.","Tire warranties are provided separately from the tire manufacturer, or are provided by the tire manufacturer through the car manufacturer.","Prior art extended warranties or vehicle service contracts by manufacturers or independent administrators are not customizable to the extent of our new model.","Some customers are looking for more coverage, and don't mind paying for it, and some are looking for less coverage, to reduce costs, or if they know they will be modifying the vehicle to outside of the warranty terms.","In addition, manufacturer warranties are usually voided with modifications to a vehicle, but runny users want to modify their vehicle for a unique look, faster performance or more capable off-road performance with a lift kit.","Vehicle service contract plans are typically designed with the oversight of an actuary to determine the possibility of loss on the vehicle service contract, in order to maintain profitability.","This is in conjunction with history of vehicle defects, to further information the likelihood of loss.","Based on the consumer's driving habits, there is a need in the art for a more flexible vehicle service contract insurance program for cars and other consumer goods.","SUMMARY In an embodiment, a method is provided.","The method includes receiving a request for a vehicle service contract.","The request includes a mileage of a vehicle, a type of the vehicle, a custom requested coverage for the vehicle and a custom requested term of the vehicle service contract.","The method also includes analyzing specific vehicle details from request for vehicle service contract.","The method further includes calculating a custom quote for the vehicle service contract based on the mileage of the vehicle, the type of vehicle, a custom requested coverage and a custom requested term of the vehicle service contract.","The method also includes providing the custom quote for vehicle service contract to a consumer.","The method further includes receiving a request to complete vehicle service contract based on custom quote from consumer.","The method includes issuing vehicle service contract to consumer based on custom quote and request to complete the vehicle service contract from consumer.","Calculating a custom quote for a vehicle service contract may be based on mileage of vehicle enumerated in miles, type of vehicle, custom requested coverage, custom requested term of vehicle service contract enumerated in days, a factor for any requested powertrain coverage, a factor for any requested non-powertrain coverage, a factor adjusting for present Mile age of the vehicle enumerated in miles, a factor adjusting for present age of the vehicle enumerated in days, a factor adjusting for a vehicle class of the vehicle, a factor adjusting for a deductible amount of the vehicle service contract and a minimum premium for the vehicle service contract.","BRIEF DESCRIPTION OF THE DRAWINGS For a more complete understanding of the present invention, the objects and advantages thereof, reference is now made to the ensuing descriptions taken in connection with the accompanying drawings briefly described as follows.","FIG.","1 illustrates an embodiment of a system that may be used in providing a vehicle service contract for an item.","FIG.","2 illustrates an embodiment of stem that may be used in administering requests related to a vehicle service contract.","FIG.","3 illustrates an embodiment of a system that may combine the systems of FIGS.","1 and 2.FIG.","4 illustrates an embodiment of a process of providing a vehicle service contract.","FIG.","5 illustrates another embodiment of a process of providing a vehicle service contract.","FIG.","6 illustrates an embodiment of a process off fulfilling requests under a vehicle service contract.","FIG.","7 illustrates another embodiment of a process of fulfilling requests under a vehicle service contract.","FIG.","8 illustrates an embodiment of a system which may be used to provide a vehicle service contract.","FIG.","9 illustrates an embodiment of a process which may be used to provide a quote for a vehicle service contract.","FIG.","10 illustrates an embodiment of a computer or similar device which may be used to implement some of all of the processes described herein.","FIG.","11 illustrates an embodiment of a system or network which may be used with the device of FIG.","10.DETAILED DESCRIPTION In various embodiments, a vehicle service contract coverage method and system is provided.","Various embodiments of the invention and potential advantages may he understood by referring to the various figures, wherein like reference numerals refer to like elements.","Other aspects of the embodiments will be apparent as available from a combination of the various embodiments, such as the processes of FIGS.","4 and 6 or 5 and 7, for example.","A vehicle service contract provides a form of insurance against problems with a vehicle.","For example, a vehicle service contract may provide for routine maintenance of an automobile, or may provide for repair or replacement of a personal device such as a mobile phone, for example.","Flexible aspects of the insurance for an automobile include term, expiration, mileage and deductible, for example.","The terms may be customizable and may provide for commercial use, overheating repair, emissions, diagnostic, safety restraint coverage, lift kit, sensor coverage, and, in case the car breaks down, towing and roadside assistance, as well as maintenance.","A beneficial vehicle service contract program may provide access to agents, including on a full-time or 24-hour basis.","The agents may track the vehicle service contract beneficiary from the phone number and immediately look up the vehicle service contract to determine the extent of the customer's coverage and to help the customer with a claim or other information.","The customers may communicate with agents using user devices, such as portable devices or computers.","The model may create powertrain and non-powertrain components, which are calculated separately though in a similar manner, for example.","All coverages (even powertrain only) may have both components in the calculation.","Referring to FIG.","1, an embodiment of a system that may be used in providing a vehicle service contract is illustrated.","System 100 provides for gathering of information upon request for a vehicle service contract, interaction and issuing of a vehicle service contract.","A user or consumer 150 may interact with a producer or agent 130 to request a vehicle service contract.","A producer or agent 130 may be a cashier at a store, salesperson at a car dealership, or an agent taking requests over a phone, for example.","The consumer 150 and producer 130 provide information about the specific item to be warranted to an analysis engine 160.The analysis engine 160 receives the collected information about the specific item 110 from the consumer 150, producer 130, and potentially from third party sources such as a telecommunications carrier or a motor vehicle regulatory agency, for example.","Analysis engine 160 also receives coefficients for data 120 as part of a set of known aggregate data about types of vehicles.","Analysis engine 160 then compares the specific item data 110 with the general data 120 to determine an appropriate vehicle service contract in terms of overall coverage, deductible, and premium.","Some of a deductible, coverage details and premium may be specified as part of the specific item data 110 to indicate What a customer is willing to consider, for example.","Vehicle service contract administrator 170 then receives information from the analysis engine 160 and works with producer 130 to issue a vehicle service contract to consumer 150.This may then provide for protection and peace of mind for the consumer 150.It may also provide for a level of cost certainty for the consumer 150.Vehicle service contract program oversight 180 also monitors the results of analysis engine 160, and provides feedback to update general data 120 and may interact with actuarial survey and analysis 140 to update general data set 120 over time, for example.","Additionally vehicle service contract oversight 180 may be able to step in to change transactions with vehicle service contract administrator 170 in unusual circumstances in some embodiments.","Moreover, warrant program oversight 180 and vehicle service contract administration 170 may be provided by the same entity or different entities, varying from one embodiment to another.","Turning to FIG.","2, a consumer 150 may take a vehicle to a merchant 215 to request replacement of a damaged item, or to a repair shop 205 to request repair in system 200.In order to invoke vehicle service contract coverage, the consumer 150, or the vendor (either merchant 215 or shop 205) may contact vehicle service contract administrator 170.Vehicle service contract administrator 170 determines whether coverage is available, such as whether a vehicle service contract exists and is in force for a specific vehicle, and provides that information to the vendor (205 or 215) and/or consumer 150.Further details may specify the type of coverage available and limits of compensation, for example.","Vehicle service contract program oversight 180 may also monitor these transactions to determine if the vehicle service contract program is being used properly.","[0027] FIG.","3 illustrates how the various different systems 100 and 200 may interact and combine to form an overall system 300 which may receive vehicle service contract requests, issue warranties, receive coverage requests, provide coverage, receive financing requests and provide financing, for example.","Thus, system 300 may provide for receiving a request from a consumer through a process leading to replacement of a device or repair of a car, for example.","Additionally, payments may be processed along the way for initial premiums, periodic installments, repair or replacement costs, and other reimbursement, for example.","Processes implemented for the systems of FIGS.","1-3 may be implemented in a variety of ways in various embodiments.","FIG.","4 illustrates a process in an embodiment.","Process 400 includes receiving specific consumer data with a request for a vehicle service contract, analyzing the data in comparison to general data, providing customized vehicle service contract quotation options, concluding a vehicle service contract transaction, and issuing a vehicle service contract.","At module 410, a consumer requests a vehicle service contract and provides initial data specific to the item to be warranted.","At module 420, the system analyzes the specific data in comparison to general data such as wear per mile or lifetime of a device after a certain amount opine, for example.","At module 430, a customized vehicle service contract quotation is provided.","This may include options for amount of time, levels of coverage, and levels of deductibles, for example.","At module 440, a vehicle service contract transaction is concluded, such as through payment of a premium or financing of a premium, for example.","At module 450, the vehicle service contract is issued.","Process 500 of FIG.","5 provides a similar process to process 400, with some additional parts of the process.","The customized quotation is provided to a producer acting as intermediary for a consumer at module 425, and acceptance of the (or a) quote is provided through a request to bind from the producer at module 435.The producer also provides financing details at module 438, leading to conclusion of the vehicle service contract transaction at 440.Moreover, the process concludes with reporting of data for vehicle service contract program oversight at module 460.Process 600 of FIG.","5 provides for a simple embodiment of a process of fulfilling a request for a vehicle service contract.","At module 610, a vehicle service contract request is received, such as from a merchant.","At module 620, coverage is checked, and at module 630, the administrator signals that coverage is present and causes the merchant to fulfill the vehicle service contract request.","This may involve replacing a defective device, repairing a device, or repairing a vehicle, for example.","This may also involve administering a deductible or reimbursement rather than straight payment to a merchant, for example.","Process 700 provides a more complex embodiment in FIG.","7.After checking eligibility, merchant action is authorized at module 625, and a merchant provides a signal indicating completion of that action at module 635.At module 640, merchant payment is arranged based on satisfactory completion of fulfillment of the vehicle service contract request.","Additionally, at module 645, data on the performance of the merchant, type of service and type of vehicle may be reported to the vehicle service contract administrator and vehicle service contract oversight.","Types of action may include repair and part replacement for an automobile, for example.","System 800 further illustrates the calculation system for the vehicle service contract.","FIG.","8 illustrates an embodiment of a system which may be used to provide a vehicle service contract.","System 800 analyzes various input sources to determine an appropriate premium for a vehicle service contract for a vehicle.","Analysis module 805 receives inputs from a consumer (potentially through a third party) along with inputs from historical databases, and then determines a premium based on those inputs.","Consumer inputs may include age of vehicle 810, present mileage 820, requested deductible 830, requested coverage term 850 and requested coverage mileage 860, for example.","Other inputs ma include vehicle class information 840, powertrain factors for the vehicle 870 and non-powertrain factors for the vehicle 880.Moreover, a minimum premium 890 may be specified to indicate a floor for a price for a vehicle service contract.","Analysis module 805 then calculates a custom premium based on the various inputs, providing for a premium specific to the vehicle, current mileage, age, and requested parameters such as length of the vehicle service contract and mileage covered by the vehicle service contract.","FIG.","9 illustrates an embodiment of a process which may be used to provide a quote for a vehicle service contract.","Process 900 may implement a process of calculating a premium similar to that executed by system 800, for example.","Process 900 is provided as a series of modules, which may be implemented as software, executed by hardware, or a combination of the two, and may be implemented in serial, parallel or some combination of serial and parallel processing.","Process 900 initiates with receipt of a request for a vehicle service contract (not shown).","At module 910, an age of a vehicle is provided, and at module 920, current mileage of a vehicle is provided.","A deductible is requested by a consumer at module 930, which may be a custom deductible that is factored into calculations.","Similarly, the current mileage and age of the vehicle are calculated on a per mile basis or a per month basis to determine a starting point for a premium.","At module 940, a vehicle class is provided, determining the type of vehicle to be covered.","This further affects the premium based on the factors of module 910,920 and 930.At module 950 and 960 a coverage term (in time) and mileage are received from a consumer, determining what the consumer wishes to cover for the vehicle—how many miles and over how many months or years, for example.","The coverage terms in time and mileage are then converted into factors which scale the expected cost of a vehicle service At module 970, powertrain factors are received, such as historical issues with the vehicle class of module 940 or known features and options of the vehicle class of 940.The premium is further modified based on higher- or lower-cost aspects of the powertrain factors of module 970.The powertrain factors are similar calculated into the premium, either by adding additional premium cost or multiplying the premium depending on whether these factors add to the cost or scale the cost over time.","For example, expected problems at a threshold mileage may add to a cost if the vehicle service contract will cover that many miles, and known wear and tear issues may scale over time or mileage, for example.","Similarly, at module 980, non-powertrain factors are received, such as presence of optional components or known issues with a vehicle class from module 940 which are not related to the powertrain of the vehicle.","The non-powertrain factors are similar calculated into the premium, either by adding additional premium cost or multiplying the premium depending on whether the non-powertrain factors add to the cost or scale the cost over time.","The following description of FIGS.","10-11 is intended to provide an overview of device hardware and other operating components suitable for performing the methods of the invention described above and hereafter, but is not intended to limit the applicable environments.","Similarly, the hardware and other operating components may be suitable as part of the apparatuses described above.","The invention can be practiced with other system configurations, including personal computers, multiprocessor systems, microprocessor-based or programmable consumer electronics, network PCs, minicomputers, mainframe computers, and the like.","The invention can also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a communications network.","FIG.","10 shows several computer systems that are coupled together through a network 1005, such as the internet, along with a cellular or other wireless network and related cellular or other wireless devices.","The term “internet” as used herein refers to a network of networks which uses certain protocols, such as the TCP/IP protocol, and possibly other protocols such as the hypertext transfer protocol (HTTP) for hypertext markup language (HTML) documents that make up the world wide web (web).","The physical connections of the internet and the protocols and communication procedures of the internet are well known to those of skill in the art.","Access to the internet 1005 is typically provided by internet service providers (ISP), such as the ISPs 1010 and 1015.Users on client systems, such as client computer systems 1030, 1050, and 1060 obtain access to the internet through the internet service providers, such as ISPs 1010 and 1015.Access to the internet allows users of the client computer systems to exchange information, receive and send e-mails, and view documents, such as documents which have been prepared in the HTML format.","These documents are often provided by web servers, such as web server 1020 which is considered to he “on” the internet.","Often these web servers are provided by the ISPs, such as ISP 1010, although a computer system can be set up and connected to the internet without that system also being an ISP.","The web server 1020 is typically at least one computer system which operates as a server computer system and is configured to operate with the protocols of the world wide web and is coupled to the internet.","Optionally, the web server 1020 can be part of an ISP which provides access to the internet for client systems.","The web server 1020 is shown coupled to the server computer system 1025 which itself is coupled to web content 1095, which can be considered a form of a media database.","While two computer systems 1020 and 1025 are shown in FIG.","10, the web server system 1020 and the server computer system 1025 can be one computer system having different software components providing the web server functionality and the server functionality provided by the server computer system 1025 which will be described further below.","Cellular network interface 1043 provides an interface between a cellular network and corresponding cellular devices 1044 1046 and 1048 on one side, and network 1005 on the other side.","Thus cellular devices 1044, 1046 and 1048, which may be personal devices including cellular telephones, two-way pagers, personal digital assistants or other similar devices, may connect with network 1005 and exchange information such as email, content, or HTTP-formatted data, for example.","Cellular network interface 1043 is representative of wireless networking in general.","In various embodiments such an interface may also be implemented as a wireless interface such as a Bluetooth interface, IEEE 802.11 interface, or some other form of wireless network.","Similarly, devices such as devices 1044, 1046 and 1048 may be implemented to communicate via the Bluetooth or 802.11 protocols, for example.","Other Dedicated Wireless Networks may also be Implemented in a Similar Fashion.","Cellular network interface 1043 is coupled to computer 1040, which communicates with network 1005 through modem interface 1045.Computer 1040 may be a personal computer, server computer or the like, and serves as a gateway.","Thus, computer 1040 may be similar to client computers 1050 and 1060 or to gateway computer 1075, for example.","Software or content may then be uploaded or downloaded through the connection provided by interface 1043, computer 1040 and modem 1045.","[0045] Client computer systems 1030, 1050, and 1060 can each, with the appropriate web browsing software, view HTML pages provided by the web server 1020.The ISP 1010 provides internet connectivity to the client computer system 1030 through the modem interface 1035 which can be considered part of the client computer system 1030.The client computer system can be a personal computer system, a network computer, a web tv system, or other such computer system.","Similarly, the ISP 1015 provides internet connectivity for client systems 1050 and 1060, although as shown in FIG.","10, the connections are not the same as for more directly connected computer systems.","Client computer systems 1050 and 1060 are part of a LAN coupled through a gateway computer 1075.While FIG.","10 shows the interfaces 1035 and 1045 as generically as a “modem,” each of these interfaces can be an analog modem, isdn modem cable modem, satellite transmission interface (e.g.","“direct PC”), or other interfaces for coupling a computer system to other computer systems.","Client computer systems 1050 and 1060 are coupled to a LAN 1070 through network interfaces 1055 and 1065, which can be ethernet network or other network interfaces.","The LAN 1070 is also coupled to a gateway computer system 1075 which can provide firewall and other internet related services for the local area network.","This gateway computer system 1075 is coupled to the ISP 1015 to provide Internet connectivity to the client computer systems 1050 and 1060.The gateway computer system 1075 can be a conventional server computer system.","Also, the web server system 1020 can be a conventional server computer system.","Alternatively, a server computer system 1080 can be directly coupled to the LAN 1070 through a network interface 1085 to provide files 1090 and other services to the clients 1050, 1060, without the need to connect to the internet through the gateway system 1075.FIG.","11 shows one example of a personal device that can be used as a cellular telephone (1044, 1046 or 1048) or similar personal device, or may be used as a more conventional personal computer, as an embedded processor or local console, or as a PDA, for example.","Such a device can be used to perform many functions depending on implementation, such as monitoring functions, user interface functions, telephone communications, two-way pager communications, personal organizing, or similar functions.","The system 1100 of FIG.","11 may also be used to implement other devices such as a personal computer, network computer, or other similar systems.","The computer system 1100 interfaces to external systems through the communications interface 1120.In a cellular telephone, this interface is typically a radio interface for communication with a cellular network, and may also include some form of cabled interface for use with an immediately available personal computer.","In a two-way pager, the communications interface 1120 is typically a radio interface for communication with a data transmission network, but may similarly include a cabled or cradled interface as well.","In a personal digital assistant, communications interface 1120 typically includes a cradled or cabled interface, and may also include some form of radio interface such as a Bluetooth or 802.11 interface, or a cellular radio interface for example.","The computer system 1100 includes a processor 1110, Which can be a conventional microprocessor such as an Intel pentium-based microprocessor or other microprocessor, a Texas Instruments digital signal processor, or some combination of the various types or processors.","Memory 1140 is coupled to the processor 1110 by a bus 11100.Memory 1140 can he dynamic random access memory (dram) and can also include static ram (sram), or may include FLASH EEPROM, too.","The bus 1170 couples the processor 1110 to the memory 1140, also to non-volatile storage 1150, to display controller 1130, and to the input/output (I/O) controller 1160.Note that the display controller 1130 and I/O controller 1160 may be integrated together, and the display may also provide input.","The display controller 1130 controls in the conventional manner a display on a display device 1135 which typically is a liquid crystal display (LCD) or similar flat-panel, small form factor display.","The input/output devices 1155 can include a keyboard, or stylus and touch-screen, and may sometimes be extended to include disk drives, printers, a scanner, and other input and output devices, including a mouse or other pointing device.","The display controller 1130 and the I/O controller 1160 can be implemented with conventional well known technology.","A digital image input device 1165 can be a digital camera which is coupled to an I/O controller 1160 in order to allow images from the digital camera to be input into the device 1100.The non-volatile storage 1150 is often a FLASH memory or read-only memory, or some combination of the two.","A magnetic hard disk, an optical disk, or another form of storage for large amounts of data may also be used in some embodiments, though the form factors for such devices typically preclude installation as a permanent component of the device 1100.Rather, a mass storage device on another computer is typically used in conjunction with the more limited storage of the device 1100.Some of this data is often written, by a direct memory access process, into memory 1140 during execution of software in the device 1100.One of skill in the art will immediately recognize that the terms “machine-readable medium” or “computer-readable medium” includes any type of storage device that is accessible by the processor 1110 and also encompasses a carrier wave that encodes a data signal.","Alternatively, a physical medium may be used as a machine-readable medium or computer-readable medium.","The device 1100 is one example of many possible devices which have different architectures.","For example, devices based on an lintel microprocessor often have multiple buses, one of which can be an input/output (I/O) bus for the peripherals and one that directly connects the processor 1110 and the memory 1140 (often referred to as a memory bus).","The buses are connected together through bridge components that perform any necessary translation clue to differing bus protocols.","In addition, the device 1100 is controlled by operating system software which includes a file management system, such as a disk operating system, which is part of the operating system software.","One example of an operating system software with its associated file management system software is the family of operating systems known as Windows(r) from Microsoft Corporation of Redmond, Wash., and their associated file management systems.","Another example of an operating system software with its associated file management system softs are is the Apple OS(r) operating system and its associated file management system.","The file management system is typically stored in the non-volatile storage 1150 and causes the processor 1110 to execute the various acts required by the operating system to input and output data and to store data in memory, including storing files on the non-volatile storage 1150.Other operating systems may be provided by makers of devices, and those operating systems typically will have device-specific features which are not part of similar operating systems on similar devices Similarly, WinCE® or Palm® operating systems may be adapted to specific devices of specific device capabilities.","Device 1100 may be integrated onto a single chip or set of chips in some embodiments, and typically is fitted into a small form factor for use as a personal device.","Thus, it is not uncommon for a processor, bus, onboard memory, and display/I-O controllers to all be integrated onto a single chip.","Alternatively, functions may be split into several chips with point-to-point interconnection, causing the bus to be logically apparent but not physically obvious from inspection of either the actual device or related schematics.","Some portions of the detailed description are presented in terms of algorithms and symbolic representations of operations on data bits within a computer memory.","These algorithmic descriptions and representations are the means used by those skilled in the data processing arts to most effectively convey the substance of their work to others Skilled in the art.","An algorithm is here, and generally, conceived to be a self-consistent sequence of operations leading to a desired result.","The operations are those requiring physical manipulations of physical quantities.","Usually, though not necessarily, these quantities take the form of electrical or magnetic signals capable of being stored, transferred, combined, compared, and otherwise manipulated.","It has proven convenient at times, principally for reasons of common usage, to refer to these signals as bits, values, elements, symbols, characters, terms, numbers, or the like.","It should be borne in mind, however, that all of these and similar terms are to be associated with the appropriate physical quantities and are merely convenient labels applied to these quantities.","Unless specifically stated otherwise as apparent from the following discussion, it is appreciated that throughout the description, discussions utilizing terms such as “processing” or “computing” or “calculating” or “determining” or “displaying” or the like, refer to the action and processes of a computer system, or similar electronic computing device, that manipulates and transforms data represented as physical (electronic) quantities within the computer system's registers and memories into other data similarly represented as physical quantities within the computer system memories or registers or other such information storage, transmission or display devices.","[0058] The present invention, in some embodiments, also relates to apparatus for performing the operations herein.","This apparatus may be specially constructed for the required purposes, or it may comprise a general purpose computer selectively activated or reconfigured by a computer program stored in the computer.","Such a computer program may be stored in a computer readable storage medium, such as, but is not limited to, any type of disk including floppy disks, optical disks, CD-ROMs, and magnetic-optical disks, read-only memories (ROMs), random access memories (RAMs), EPROMs, EEPROMs, magnetic or optical cards, or any type of media suitable for storing electronic instructions, and each coupled to a computer system bus.","The algorithms and displays presented herein are not inherently related to any particular computer or other apparatus.","Various general purpose systems may be used with programs in accordance with the teachings herein, or it may prove convenient to construct more specialized apparatus to perform the required method steps.","The required structure for a variety of these systems will appear from the description below.","In addition, the present invention is not described with reference to any particular programming language, and various embodiments may thus be implemented using a variety of programming languages.","It is, therefore, apparent that there is provided, in accordance with the various embodiments disclosed herein, methods, systems and computer readable media for computerized vehicle service contract service offerings having enhanced flexibility.","While the disclosed subject matter has been described in conjunction with a number of embodiments, it is evident that many alternatives, modifications and variations would be, or are, apparent to those of ordinary skill in the applicable arts.","Accordingly, Applicant intends to embrace all such alternatives, modifications, equivalents and variations that are within the spirit and scope of the disclosed subject matter.","The invention has been described herein using specific embodiments for the purposes of illustration only.","It will be readily apparent to one of ordinary skill in the art, however, that the principles of the invention can be embodied in other ways.","Therefore, the invention should not be regarded as being limited in scope to the specific embodiments disclosed herein, but instead as being fully commensurate in scope with the following claims."]],"string":"[\n [\n \"Vehicle Service Contract Rating Method and Algorithm System\",\n \"In an embodiment, a method is provided.\",\n \"The method includes receiving a request for a vehicle service contract.\",\n \"The request includes a mileage of a vehicle, a type of the vehicle, a custom requested coverage for the vehicle and a custom requested term of the vehicle service contract.\",\n \"The method also includes analyzing specific vehicle details from request for vehicle service contract.\",\n \"The method further includes calculating a custom quote for the vehicle service contract based on the mileage of the vehicle, the type of vehicle, a custom requested coverage and a custom requested term of the vehicle service contract.\",\n \"The method also includes providing the custom quote for vehicle service contract to a consumer.\",\n \"The method further includes receiving a request to complete vehicle service contract based on custom quote from consumer.\",\n \"The method includes issuing vehicle service contract to consumer based on custom quote and request to complete the vehicle service contract from consumer.\"\n ],\n [\n \"1.A method, comprising: receiving a request for a vehicle service contract, the request including a mileage of a vehicle, a type of the vehicle, a custom requested coverage for the vehicle and a custom requested term of the vehicle service contract; analyzing specific vehicle details from request for vehicle service contract; calculating a custom quote for vehicle service contract based on mileage of vehicle, type of vehicle, custom requested coverage and custom requested term of vehicle service contract; providing the custom quote for vehicle service contract to a consumer; receiving request to complete vehicle service contract based on custom quote from consumer; and issuing vehicle service contract to consumer based on custom quote and request to complete vehicle service contract from consumer.\",\n \"2.The method of claim 1, further comprising: receiving a request for coverage of a repair based on the vehicle service contract; verifying coverage of the repair based on the vehicle service contract; authorizing coverage of the repair based on the vehicle service contract; receiving confirmation of completion of the repair based on the vehicle service contract; and providing payment at a predetermined rate responsive to confirmation of completion of the repair based on the vehicle service contract.\",\n \"3.The method of claim 2, wherein: confirmation of completion of the repair based on the vehicle service contract includes documentation from an entity asserting that the entity completed repairs to the vehicle of the request for vehicle service contract.\",\n \"4.The method of claim 3, wherein: calculating the custom quote for the vehicle service contract based on a factor multiplied by mileage of vehicle enumerated in miles, type of vehicle, custom requested coverage and a factor multiplied by custom requested term of vehicle service contract enumerated in calendar days.\",\n \"5.The method of claim 4, wherein: calculating the custom quote for the vehicle service contract further based on a factor for any requested powertrain coverage and a factor for any requested non-powertrain coverage.\",\n \"6.The method of claim 5, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for present mileage of the vehicle.\",\n \"7.The method of claim 6, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for a deductible amount of the vehicle service contract.\",\n \"8.The method of claim 7, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for a minimum premium for the vehicle service contract.\",\n \"9.The method of claim 8, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for present age of the vehicle enumerated in days.\",\n \"10.The method of claim 9, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for a vehicle class of the vehicle.\",\n \"11.The method of claim 1, wherein: calculating the custom quote for the vehicle service contract further based on a factor for any requested powertrain coverage and a factor for any requested non-powertrain coverage.\",\n \"12.The method of claim 11, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for present mileage of the vehicle enumerated in miles and present age of the vehicle enumerated in days.\",\n \"13.The method of claim 12, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for a vehicle class of the vehicle.\",\n \"14.The method of claim 13, wherein: calculating the custom quote for the vehicle service contract further based on a factor adjusting for a deductible amount of the vehicle service contract and a minimum premium for the vehicle service contract.\",\n \"15.A method, comprising: receiving a request for a vehicle service contract, the request including a mileage of a vehicle, a type of the vehicle, a custom requested coverage for the vehicle and a custom requested term of the vehicle service contract; analyzing specific vehicle details from request for vehicle service contract; calculating a custom quote for vehicle service contract based on mileage of vehicle enumerated in miles, type of vehicle, custom requested coverage, custom requested term of vehicle service contract enumerated in days, a factor for any requested powertrain coverage, a factor for any requested non-powertrain coverage, a factor adjusting for present mileage of the vehicle enumerated in miles, a factor adjusting for present age of the vehicle enumerated in days, a factor adjusting for a vehicle class of the vehicle, a factor adjusting for a deductible amount of the vehicle service contract and a minimum premium for the vehicle service contract; providing the custom quote for vehicle service contract to a consumer; receiving request to complete vehicle service contract based on custom quote from consumer; issuing vehicle service contract to consumer based on custom quote and request to complete vehicle service contract from consumer; receiving a request for coverage of a repair based on the vehicle service contract; verifying coverage of the repair based on the vehicle service contract; authorizing coverage of the repair based on the vehicle service contract; receiving confirmation of completion of the repair based on the vehicle service contract including documentation from an entity asserting that the entity completed repairs to the vehicle of the request for vehicle service contract; and providing payment at a predetermined rate responsive to confirmation of completion of the repair based on the vehicle service contract.\",\n \"16.A method, comprising: receiving a request for a vehicle service contract, the request including a mileage of a vehicle, a type of the vehicle, a custom requested coverage for the vehicle and a custom requested term of the vehicle service contract; analyzing specific vehicle details from request for vehicle service contract; calculating a custom quote for vehicle service contract based on covered mileage of vehicle enumerated in miles, type of vehicle, custom requested coverage, custom requested term of vehicle service contract enumerated in days, a factor for any requested powertrain coverage, a factor for any requested non-powertrain coverage, a factor adjusting for present mileage of the vehicle enumerated in miles, and a factor adjusting for present age of the vehicle enumerated in days; providing the custom quote for vehicle service contract to a consumer; receiving request to complete vehicle service contract based on custom quote from consumer; issuing vehicle service contract to consumer based on custom quote and request to complete vehicle service contract from consumer; receiving a request for coverage of a repair based on the vehicle service contract; verifying coverage of the repair based on the vehicle service contract; authorizing coverage of the repair based on the vehicle service contract; receiving confirmation of completion of the repair based on the vehicle service contract including documentation from an entity asserting that the entity completed repairs to the vehicle of the request for vehicle service contract; and providing payment at a predetermined rate responsive to confirmation of completion of the repair based on the vehicle service contract.\",\n \"17.The method of claim 16, wherein: calculating a custom quote for vehicle service contract further based on a factor adjusting for a vehicle class of the vehicle, a factor adjusting for a deductible amount of the vehicle service contract and a minimum premium for the vehicle service contract.\"\n ],\n [\n \" BACKGROUND \"\n ],\n [\n \" SUMMARY In an embodiment, a method is provided.\",\n \"The method includes receiving a request for a vehicle service contract.\",\n \"The request includes a mileage of a vehicle, a type of the vehicle, a custom requested coverage for the vehicle and a custom requested term of the vehicle service contract.\",\n \"The method also includes analyzing specific vehicle details from request for vehicle service contract.\",\n \"The method further includes calculating a custom quote for the vehicle service contract based on the mileage of the vehicle, the type of vehicle, a custom requested coverage and a custom requested term of the vehicle service contract.\",\n \"The method also includes providing the custom quote for vehicle service contract to a consumer.\",\n \"The method further includes receiving a request to complete vehicle service contract based on custom quote from consumer.\",\n \"The method includes issuing vehicle service contract to consumer based on custom quote and request to complete the vehicle service contract from consumer.\",\n \"Calculating a custom quote for a vehicle service contract may be based on mileage of vehicle enumerated in miles, type of vehicle, custom requested coverage, custom requested term of vehicle service contract enumerated in days, a factor for any requested powertrain coverage, a factor for any requested non-powertrain coverage, a factor adjusting for present Mile age of the vehicle enumerated in miles, a factor adjusting for present age of the vehicle enumerated in days, a factor adjusting for a vehicle class of the vehicle, a factor adjusting for a deductible amount of the vehicle service contract and a minimum premium for the vehicle service contract.\"\n ],\n [\n \"BACKGROUND 1.Field of Invention The present invention relates to the field of methods for pricing vehicle service contract insurance coverage through unique rating calculations and a computer algorithm system therefor.\",\n \"2.Description of Related Art Currently, manufacturers have provided warranties in the form of a manufacturer warranty for a period of time, or, in the case of a vehicle such as a car, various warranty periods for different components or component groups.\",\n \"An example for cars is a bumper-to-bumper warranty for all components of the car.\",\n \"Tire warranties are provided separately from the tire manufacturer, or are provided by the tire manufacturer through the car manufacturer.\",\n \"Prior art extended warranties or vehicle service contracts by manufacturers or independent administrators are not customizable to the extent of our new model.\",\n \"Some customers are looking for more coverage, and don't mind paying for it, and some are looking for less coverage, to reduce costs, or if they know they will be modifying the vehicle to outside of the warranty terms.\",\n \"In addition, manufacturer warranties are usually voided with modifications to a vehicle, but runny users want to modify their vehicle for a unique look, faster performance or more capable off-road performance with a lift kit.\",\n \"Vehicle service contract plans are typically designed with the oversight of an actuary to determine the possibility of loss on the vehicle service contract, in order to maintain profitability.\",\n \"This is in conjunction with history of vehicle defects, to further information the likelihood of loss.\",\n \"Based on the consumer's driving habits, there is a need in the art for a more flexible vehicle service contract insurance program for cars and other consumer goods.\",\n \"SUMMARY In an embodiment, a method is provided.\",\n \"The method includes receiving a request for a vehicle service contract.\",\n \"The request includes a mileage of a vehicle, a type of the vehicle, a custom requested coverage for the vehicle and a custom requested term of the vehicle service contract.\",\n \"The method also includes analyzing specific vehicle details from request for vehicle service contract.\",\n \"The method further includes calculating a custom quote for the vehicle service contract based on the mileage of the vehicle, the type of vehicle, a custom requested coverage and a custom requested term of the vehicle service contract.\",\n \"The method also includes providing the custom quote for vehicle service contract to a consumer.\",\n \"The method further includes receiving a request to complete vehicle service contract based on custom quote from consumer.\",\n \"The method includes issuing vehicle service contract to consumer based on custom quote and request to complete the vehicle service contract from consumer.\",\n \"Calculating a custom quote for a vehicle service contract may be based on mileage of vehicle enumerated in miles, type of vehicle, custom requested coverage, custom requested term of vehicle service contract enumerated in days, a factor for any requested powertrain coverage, a factor for any requested non-powertrain coverage, a factor adjusting for present Mile age of the vehicle enumerated in miles, a factor adjusting for present age of the vehicle enumerated in days, a factor adjusting for a vehicle class of the vehicle, a factor adjusting for a deductible amount of the vehicle service contract and a minimum premium for the vehicle service contract.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS For a more complete understanding of the present invention, the objects and advantages thereof, reference is now made to the ensuing descriptions taken in connection with the accompanying drawings briefly described as follows.\",\n \"FIG.\",\n \"1 illustrates an embodiment of a system that may be used in providing a vehicle service contract for an item.\",\n \"FIG.\",\n \"2 illustrates an embodiment of stem that may be used in administering requests related to a vehicle service contract.\",\n \"FIG.\",\n \"3 illustrates an embodiment of a system that may combine the systems of FIGS.\",\n \"1 and 2.FIG.\",\n \"4 illustrates an embodiment of a process of providing a vehicle service contract.\",\n \"FIG.\",\n \"5 illustrates another embodiment of a process of providing a vehicle service contract.\",\n \"FIG.\",\n \"6 illustrates an embodiment of a process off fulfilling requests under a vehicle service contract.\",\n \"FIG.\",\n \"7 illustrates another embodiment of a process of fulfilling requests under a vehicle service contract.\",\n \"FIG.\",\n \"8 illustrates an embodiment of a system which may be used to provide a vehicle service contract.\",\n \"FIG.\",\n \"9 illustrates an embodiment of a process which may be used to provide a quote for a vehicle service contract.\",\n \"FIG.\",\n \"10 illustrates an embodiment of a computer or similar device which may be used to implement some of all of the processes described herein.\",\n \"FIG.\",\n \"11 illustrates an embodiment of a system or network which may be used with the device of FIG.\",\n \"10.DETAILED DESCRIPTION In various embodiments, a vehicle service contract coverage method and system is provided.\",\n \"Various embodiments of the invention and potential advantages may he understood by referring to the various figures, wherein like reference numerals refer to like elements.\",\n \"Other aspects of the embodiments will be apparent as available from a combination of the various embodiments, such as the processes of FIGS.\",\n \"4 and 6 or 5 and 7, for example.\",\n \"A vehicle service contract provides a form of insurance against problems with a vehicle.\",\n \"For example, a vehicle service contract may provide for routine maintenance of an automobile, or may provide for repair or replacement of a personal device such as a mobile phone, for example.\",\n \"Flexible aspects of the insurance for an automobile include term, expiration, mileage and deductible, for example.\",\n \"The terms may be customizable and may provide for commercial use, overheating repair, emissions, diagnostic, safety restraint coverage, lift kit, sensor coverage, and, in case the car breaks down, towing and roadside assistance, as well as maintenance.\",\n \"A beneficial vehicle service contract program may provide access to agents, including on a full-time or 24-hour basis.\",\n \"The agents may track the vehicle service contract beneficiary from the phone number and immediately look up the vehicle service contract to determine the extent of the customer's coverage and to help the customer with a claim or other information.\",\n \"The customers may communicate with agents using user devices, such as portable devices or computers.\",\n \"The model may create powertrain and non-powertrain components, which are calculated separately though in a similar manner, for example.\",\n \"All coverages (even powertrain only) may have both components in the calculation.\",\n \"Referring to FIG.\",\n \"1, an embodiment of a system that may be used in providing a vehicle service contract is illustrated.\",\n \"System 100 provides for gathering of information upon request for a vehicle service contract, interaction and issuing of a vehicle service contract.\",\n \"A user or consumer 150 may interact with a producer or agent 130 to request a vehicle service contract.\",\n \"A producer or agent 130 may be a cashier at a store, salesperson at a car dealership, or an agent taking requests over a phone, for example.\",\n \"The consumer 150 and producer 130 provide information about the specific item to be warranted to an analysis engine 160.The analysis engine 160 receives the collected information about the specific item 110 from the consumer 150, producer 130, and potentially from third party sources such as a telecommunications carrier or a motor vehicle regulatory agency, for example.\",\n \"Analysis engine 160 also receives coefficients for data 120 as part of a set of known aggregate data about types of vehicles.\",\n \"Analysis engine 160 then compares the specific item data 110 with the general data 120 to determine an appropriate vehicle service contract in terms of overall coverage, deductible, and premium.\",\n \"Some of a deductible, coverage details and premium may be specified as part of the specific item data 110 to indicate What a customer is willing to consider, for example.\",\n \"Vehicle service contract administrator 170 then receives information from the analysis engine 160 and works with producer 130 to issue a vehicle service contract to consumer 150.This may then provide for protection and peace of mind for the consumer 150.It may also provide for a level of cost certainty for the consumer 150.Vehicle service contract program oversight 180 also monitors the results of analysis engine 160, and provides feedback to update general data 120 and may interact with actuarial survey and analysis 140 to update general data set 120 over time, for example.\",\n \"Additionally vehicle service contract oversight 180 may be able to step in to change transactions with vehicle service contract administrator 170 in unusual circumstances in some embodiments.\",\n \"Moreover, warrant program oversight 180 and vehicle service contract administration 170 may be provided by the same entity or different entities, varying from one embodiment to another.\",\n \"Turning to FIG.\",\n \"2, a consumer 150 may take a vehicle to a merchant 215 to request replacement of a damaged item, or to a repair shop 205 to request repair in system 200.In order to invoke vehicle service contract coverage, the consumer 150, or the vendor (either merchant 215 or shop 205) may contact vehicle service contract administrator 170.Vehicle service contract administrator 170 determines whether coverage is available, such as whether a vehicle service contract exists and is in force for a specific vehicle, and provides that information to the vendor (205 or 215) and/or consumer 150.Further details may specify the type of coverage available and limits of compensation, for example.\",\n \"Vehicle service contract program oversight 180 may also monitor these transactions to determine if the vehicle service contract program is being used properly.\",\n \"[0027] FIG.\",\n \"3 illustrates how the various different systems 100 and 200 may interact and combine to form an overall system 300 which may receive vehicle service contract requests, issue warranties, receive coverage requests, provide coverage, receive financing requests and provide financing, for example.\",\n \"Thus, system 300 may provide for receiving a request from a consumer through a process leading to replacement of a device or repair of a car, for example.\",\n \"Additionally, payments may be processed along the way for initial premiums, periodic installments, repair or replacement costs, and other reimbursement, for example.\",\n \"Processes implemented for the systems of FIGS.\",\n \"1-3 may be implemented in a variety of ways in various embodiments.\",\n \"FIG.\",\n \"4 illustrates a process in an embodiment.\",\n \"Process 400 includes receiving specific consumer data with a request for a vehicle service contract, analyzing the data in comparison to general data, providing customized vehicle service contract quotation options, concluding a vehicle service contract transaction, and issuing a vehicle service contract.\",\n \"At module 410, a consumer requests a vehicle service contract and provides initial data specific to the item to be warranted.\",\n \"At module 420, the system analyzes the specific data in comparison to general data such as wear per mile or lifetime of a device after a certain amount opine, for example.\",\n \"At module 430, a customized vehicle service contract quotation is provided.\",\n \"This may include options for amount of time, levels of coverage, and levels of deductibles, for example.\",\n \"At module 440, a vehicle service contract transaction is concluded, such as through payment of a premium or financing of a premium, for example.\",\n \"At module 450, the vehicle service contract is issued.\",\n \"Process 500 of FIG.\",\n \"5 provides a similar process to process 400, with some additional parts of the process.\",\n \"The customized quotation is provided to a producer acting as intermediary for a consumer at module 425, and acceptance of the (or a) quote is provided through a request to bind from the producer at module 435.The producer also provides financing details at module 438, leading to conclusion of the vehicle service contract transaction at 440.Moreover, the process concludes with reporting of data for vehicle service contract program oversight at module 460.Process 600 of FIG.\",\n \"5 provides for a simple embodiment of a process of fulfilling a request for a vehicle service contract.\",\n \"At module 610, a vehicle service contract request is received, such as from a merchant.\",\n \"At module 620, coverage is checked, and at module 630, the administrator signals that coverage is present and causes the merchant to fulfill the vehicle service contract request.\",\n \"This may involve replacing a defective device, repairing a device, or repairing a vehicle, for example.\",\n \"This may also involve administering a deductible or reimbursement rather than straight payment to a merchant, for example.\",\n \"Process 700 provides a more complex embodiment in FIG.\",\n \"7.After checking eligibility, merchant action is authorized at module 625, and a merchant provides a signal indicating completion of that action at module 635.At module 640, merchant payment is arranged based on satisfactory completion of fulfillment of the vehicle service contract request.\",\n \"Additionally, at module 645, data on the performance of the merchant, type of service and type of vehicle may be reported to the vehicle service contract administrator and vehicle service contract oversight.\",\n \"Types of action may include repair and part replacement for an automobile, for example.\",\n \"System 800 further illustrates the calculation system for the vehicle service contract.\",\n \"FIG.\",\n \"8 illustrates an embodiment of a system which may be used to provide a vehicle service contract.\",\n \"System 800 analyzes various input sources to determine an appropriate premium for a vehicle service contract for a vehicle.\",\n \"Analysis module 805 receives inputs from a consumer (potentially through a third party) along with inputs from historical databases, and then determines a premium based on those inputs.\",\n \"Consumer inputs may include age of vehicle 810, present mileage 820, requested deductible 830, requested coverage term 850 and requested coverage mileage 860, for example.\",\n \"Other inputs ma include vehicle class information 840, powertrain factors for the vehicle 870 and non-powertrain factors for the vehicle 880.Moreover, a minimum premium 890 may be specified to indicate a floor for a price for a vehicle service contract.\",\n \"Analysis module 805 then calculates a custom premium based on the various inputs, providing for a premium specific to the vehicle, current mileage, age, and requested parameters such as length of the vehicle service contract and mileage covered by the vehicle service contract.\",\n \"FIG.\",\n \"9 illustrates an embodiment of a process which may be used to provide a quote for a vehicle service contract.\",\n \"Process 900 may implement a process of calculating a premium similar to that executed by system 800, for example.\",\n \"Process 900 is provided as a series of modules, which may be implemented as software, executed by hardware, or a combination of the two, and may be implemented in serial, parallel or some combination of serial and parallel processing.\",\n \"Process 900 initiates with receipt of a request for a vehicle service contract (not shown).\",\n \"At module 910, an age of a vehicle is provided, and at module 920, current mileage of a vehicle is provided.\",\n \"A deductible is requested by a consumer at module 930, which may be a custom deductible that is factored into calculations.\",\n \"Similarly, the current mileage and age of the vehicle are calculated on a per mile basis or a per month basis to determine a starting point for a premium.\",\n \"At module 940, a vehicle class is provided, determining the type of vehicle to be covered.\",\n \"This further affects the premium based on the factors of module 910,920 and 930.At module 950 and 960 a coverage term (in time) and mileage are received from a consumer, determining what the consumer wishes to cover for the vehicle—how many miles and over how many months or years, for example.\",\n \"The coverage terms in time and mileage are then converted into factors which scale the expected cost of a vehicle service At module 970, powertrain factors are received, such as historical issues with the vehicle class of module 940 or known features and options of the vehicle class of 940.The premium is further modified based on higher- or lower-cost aspects of the powertrain factors of module 970.The powertrain factors are similar calculated into the premium, either by adding additional premium cost or multiplying the premium depending on whether these factors add to the cost or scale the cost over time.\",\n \"For example, expected problems at a threshold mileage may add to a cost if the vehicle service contract will cover that many miles, and known wear and tear issues may scale over time or mileage, for example.\",\n \"Similarly, at module 980, non-powertrain factors are received, such as presence of optional components or known issues with a vehicle class from module 940 which are not related to the powertrain of the vehicle.\",\n \"The non-powertrain factors are similar calculated into the premium, either by adding additional premium cost or multiplying the premium depending on whether the non-powertrain factors add to the cost or scale the cost over time.\",\n \"The following description of FIGS.\",\n \"10-11 is intended to provide an overview of device hardware and other operating components suitable for performing the methods of the invention described above and hereafter, but is not intended to limit the applicable environments.\",\n \"Similarly, the hardware and other operating components may be suitable as part of the apparatuses described above.\",\n \"The invention can be practiced with other system configurations, including personal computers, multiprocessor systems, microprocessor-based or programmable consumer electronics, network PCs, minicomputers, mainframe computers, and the like.\",\n \"The invention can also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a communications network.\",\n \"FIG.\",\n \"10 shows several computer systems that are coupled together through a network 1005, such as the internet, along with a cellular or other wireless network and related cellular or other wireless devices.\",\n \"The term “internet” as used herein refers to a network of networks which uses certain protocols, such as the TCP/IP protocol, and possibly other protocols such as the hypertext transfer protocol (HTTP) for hypertext markup language (HTML) documents that make up the world wide web (web).\",\n \"The physical connections of the internet and the protocols and communication procedures of the internet are well known to those of skill in the art.\",\n \"Access to the internet 1005 is typically provided by internet service providers (ISP), such as the ISPs 1010 and 1015.Users on client systems, such as client computer systems 1030, 1050, and 1060 obtain access to the internet through the internet service providers, such as ISPs 1010 and 1015.Access to the internet allows users of the client computer systems to exchange information, receive and send e-mails, and view documents, such as documents which have been prepared in the HTML format.\",\n \"These documents are often provided by web servers, such as web server 1020 which is considered to he “on” the internet.\",\n \"Often these web servers are provided by the ISPs, such as ISP 1010, although a computer system can be set up and connected to the internet without that system also being an ISP.\",\n \"The web server 1020 is typically at least one computer system which operates as a server computer system and is configured to operate with the protocols of the world wide web and is coupled to the internet.\",\n \"Optionally, the web server 1020 can be part of an ISP which provides access to the internet for client systems.\",\n \"The web server 1020 is shown coupled to the server computer system 1025 which itself is coupled to web content 1095, which can be considered a form of a media database.\",\n \"While two computer systems 1020 and 1025 are shown in FIG.\",\n \"10, the web server system 1020 and the server computer system 1025 can be one computer system having different software components providing the web server functionality and the server functionality provided by the server computer system 1025 which will be described further below.\",\n \"Cellular network interface 1043 provides an interface between a cellular network and corresponding cellular devices 1044 1046 and 1048 on one side, and network 1005 on the other side.\",\n \"Thus cellular devices 1044, 1046 and 1048, which may be personal devices including cellular telephones, two-way pagers, personal digital assistants or other similar devices, may connect with network 1005 and exchange information such as email, content, or HTTP-formatted data, for example.\",\n \"Cellular network interface 1043 is representative of wireless networking in general.\",\n \"In various embodiments such an interface may also be implemented as a wireless interface such as a Bluetooth interface, IEEE 802.11 interface, or some other form of wireless network.\",\n \"Similarly, devices such as devices 1044, 1046 and 1048 may be implemented to communicate via the Bluetooth or 802.11 protocols, for example.\",\n \"Other Dedicated Wireless Networks may also be Implemented in a Similar Fashion.\",\n \"Cellular network interface 1043 is coupled to computer 1040, which communicates with network 1005 through modem interface 1045.Computer 1040 may be a personal computer, server computer or the like, and serves as a gateway.\",\n \"Thus, computer 1040 may be similar to client computers 1050 and 1060 or to gateway computer 1075, for example.\",\n \"Software or content may then be uploaded or downloaded through the connection provided by interface 1043, computer 1040 and modem 1045.\",\n \"[0045] Client computer systems 1030, 1050, and 1060 can each, with the appropriate web browsing software, view HTML pages provided by the web server 1020.The ISP 1010 provides internet connectivity to the client computer system 1030 through the modem interface 1035 which can be considered part of the client computer system 1030.The client computer system can be a personal computer system, a network computer, a web tv system, or other such computer system.\",\n \"Similarly, the ISP 1015 provides internet connectivity for client systems 1050 and 1060, although as shown in FIG.\",\n \"10, the connections are not the same as for more directly connected computer systems.\",\n \"Client computer systems 1050 and 1060 are part of a LAN coupled through a gateway computer 1075.While FIG.\",\n \"10 shows the interfaces 1035 and 1045 as generically as a “modem,” each of these interfaces can be an analog modem, isdn modem cable modem, satellite transmission interface (e.g.\",\n \"“direct PC”), or other interfaces for coupling a computer system to other computer systems.\",\n \"Client computer systems 1050 and 1060 are coupled to a LAN 1070 through network interfaces 1055 and 1065, which can be ethernet network or other network interfaces.\",\n \"The LAN 1070 is also coupled to a gateway computer system 1075 which can provide firewall and other internet related services for the local area network.\",\n \"This gateway computer system 1075 is coupled to the ISP 1015 to provide Internet connectivity to the client computer systems 1050 and 1060.The gateway computer system 1075 can be a conventional server computer system.\",\n \"Also, the web server system 1020 can be a conventional server computer system.\",\n \"Alternatively, a server computer system 1080 can be directly coupled to the LAN 1070 through a network interface 1085 to provide files 1090 and other services to the clients 1050, 1060, without the need to connect to the internet through the gateway system 1075.FIG.\",\n \"11 shows one example of a personal device that can be used as a cellular telephone (1044, 1046 or 1048) or similar personal device, or may be used as a more conventional personal computer, as an embedded processor or local console, or as a PDA, for example.\",\n \"Such a device can be used to perform many functions depending on implementation, such as monitoring functions, user interface functions, telephone communications, two-way pager communications, personal organizing, or similar functions.\",\n \"The system 1100 of FIG.\",\n \"11 may also be used to implement other devices such as a personal computer, network computer, or other similar systems.\",\n \"The computer system 1100 interfaces to external systems through the communications interface 1120.In a cellular telephone, this interface is typically a radio interface for communication with a cellular network, and may also include some form of cabled interface for use with an immediately available personal computer.\",\n \"In a two-way pager, the communications interface 1120 is typically a radio interface for communication with a data transmission network, but may similarly include a cabled or cradled interface as well.\",\n \"In a personal digital assistant, communications interface 1120 typically includes a cradled or cabled interface, and may also include some form of radio interface such as a Bluetooth or 802.11 interface, or a cellular radio interface for example.\",\n \"The computer system 1100 includes a processor 1110, Which can be a conventional microprocessor such as an Intel pentium-based microprocessor or other microprocessor, a Texas Instruments digital signal processor, or some combination of the various types or processors.\",\n \"Memory 1140 is coupled to the processor 1110 by a bus 11100.Memory 1140 can he dynamic random access memory (dram) and can also include static ram (sram), or may include FLASH EEPROM, too.\",\n \"The bus 1170 couples the processor 1110 to the memory 1140, also to non-volatile storage 1150, to display controller 1130, and to the input/output (I/O) controller 1160.Note that the display controller 1130 and I/O controller 1160 may be integrated together, and the display may also provide input.\",\n \"The display controller 1130 controls in the conventional manner a display on a display device 1135 which typically is a liquid crystal display (LCD) or similar flat-panel, small form factor display.\",\n \"The input/output devices 1155 can include a keyboard, or stylus and touch-screen, and may sometimes be extended to include disk drives, printers, a scanner, and other input and output devices, including a mouse or other pointing device.\",\n \"The display controller 1130 and the I/O controller 1160 can be implemented with conventional well known technology.\",\n \"A digital image input device 1165 can be a digital camera which is coupled to an I/O controller 1160 in order to allow images from the digital camera to be input into the device 1100.The non-volatile storage 1150 is often a FLASH memory or read-only memory, or some combination of the two.\",\n \"A magnetic hard disk, an optical disk, or another form of storage for large amounts of data may also be used in some embodiments, though the form factors for such devices typically preclude installation as a permanent component of the device 1100.Rather, a mass storage device on another computer is typically used in conjunction with the more limited storage of the device 1100.Some of this data is often written, by a direct memory access process, into memory 1140 during execution of software in the device 1100.One of skill in the art will immediately recognize that the terms “machine-readable medium” or “computer-readable medium” includes any type of storage device that is accessible by the processor 1110 and also encompasses a carrier wave that encodes a data signal.\",\n \"Alternatively, a physical medium may be used as a machine-readable medium or computer-readable medium.\",\n \"The device 1100 is one example of many possible devices which have different architectures.\",\n \"For example, devices based on an lintel microprocessor often have multiple buses, one of which can be an input/output (I/O) bus for the peripherals and one that directly connects the processor 1110 and the memory 1140 (often referred to as a memory bus).\",\n \"The buses are connected together through bridge components that perform any necessary translation clue to differing bus protocols.\",\n \"In addition, the device 1100 is controlled by operating system software which includes a file management system, such as a disk operating system, which is part of the operating system software.\",\n \"One example of an operating system software with its associated file management system software is the family of operating systems known as Windows(r) from Microsoft Corporation of Redmond, Wash., and their associated file management systems.\",\n \"Another example of an operating system software with its associated file management system softs are is the Apple OS(r) operating system and its associated file management system.\",\n \"The file management system is typically stored in the non-volatile storage 1150 and causes the processor 1110 to execute the various acts required by the operating system to input and output data and to store data in memory, including storing files on the non-volatile storage 1150.Other operating systems may be provided by makers of devices, and those operating systems typically will have device-specific features which are not part of similar operating systems on similar devices Similarly, WinCE® or Palm® operating systems may be adapted to specific devices of specific device capabilities.\",\n \"Device 1100 may be integrated onto a single chip or set of chips in some embodiments, and typically is fitted into a small form factor for use as a personal device.\",\n \"Thus, it is not uncommon for a processor, bus, onboard memory, and display/I-O controllers to all be integrated onto a single chip.\",\n \"Alternatively, functions may be split into several chips with point-to-point interconnection, causing the bus to be logically apparent but not physically obvious from inspection of either the actual device or related schematics.\",\n \"Some portions of the detailed description are presented in terms of algorithms and symbolic representations of operations on data bits within a computer memory.\",\n \"These algorithmic descriptions and representations are the means used by those skilled in the data processing arts to most effectively convey the substance of their work to others Skilled in the art.\",\n \"An algorithm is here, and generally, conceived to be a self-consistent sequence of operations leading to a desired result.\",\n \"The operations are those requiring physical manipulations of physical quantities.\",\n \"Usually, though not necessarily, these quantities take the form of electrical or magnetic signals capable of being stored, transferred, combined, compared, and otherwise manipulated.\",\n \"It has proven convenient at times, principally for reasons of common usage, to refer to these signals as bits, values, elements, symbols, characters, terms, numbers, or the like.\",\n \"It should be borne in mind, however, that all of these and similar terms are to be associated with the appropriate physical quantities and are merely convenient labels applied to these quantities.\",\n \"Unless specifically stated otherwise as apparent from the following discussion, it is appreciated that throughout the description, discussions utilizing terms such as “processing” or “computing” or “calculating” or “determining” or “displaying” or the like, refer to the action and processes of a computer system, or similar electronic computing device, that manipulates and transforms data represented as physical (electronic) quantities within the computer system's registers and memories into other data similarly represented as physical quantities within the computer system memories or registers or other such information storage, transmission or display devices.\",\n \"[0058] The present invention, in some embodiments, also relates to apparatus for performing the operations herein.\",\n \"This apparatus may be specially constructed for the required purposes, or it may comprise a general purpose computer selectively activated or reconfigured by a computer program stored in the computer.\",\n \"Such a computer program may be stored in a computer readable storage medium, such as, but is not limited to, any type of disk including floppy disks, optical disks, CD-ROMs, and magnetic-optical disks, read-only memories (ROMs), random access memories (RAMs), EPROMs, EEPROMs, magnetic or optical cards, or any type of media suitable for storing electronic instructions, and each coupled to a computer system bus.\",\n \"The algorithms and displays presented herein are not inherently related to any particular computer or other apparatus.\",\n \"Various general purpose systems may be used with programs in accordance with the teachings herein, or it may prove convenient to construct more specialized apparatus to perform the required method steps.\",\n \"The required structure for a variety of these systems will appear from the description below.\",\n \"In addition, the present invention is not described with reference to any particular programming language, and various embodiments may thus be implemented using a variety of programming languages.\",\n \"It is, therefore, apparent that there is provided, in accordance with the various embodiments disclosed herein, methods, systems and computer readable media for computerized vehicle service contract service offerings having enhanced flexibility.\",\n \"While the disclosed subject matter has been described in conjunction with a number of embodiments, it is evident that many alternatives, modifications and variations would be, or are, apparent to those of ordinary skill in the applicable arts.\",\n \"Accordingly, Applicant intends to embrace all such alternatives, modifications, equivalents and variations that are within the spirit and scope of the disclosed subject matter.\",\n \"The invention has been described herein using specific embodiments for the purposes of illustration only.\",\n \"It will be readily apparent to one of ordinary skill in the art, however, that the principles of the invention can be embodied in other ways.\",\n \"Therefore, the invention should not be regarded as being limited in scope to the specific embodiments disclosed herein, but instead as being fully commensurate in scope with the following claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870869"}}},{"rowIdx":4493667,"cells":{"text":{"kind":"list like","value":[["ELECTRICAL CONNECTOR HAVING SEPARATE GROUNDING PIECES","An electrical connector includes an insulative housing having a base and a tongue, an upper and lower rows of contacts mounted in the insulative housing and exposed upon the tongue and a pair of grounding pieces separated from each other and retained in the insulative housing between the two rows of contacts.","Each grounding piece includes a securing portion disposed in the mating tongue and defines an abutment exposed upon corresponding side face of the mating tongue.","The pair of grounding pieces are far away from corresponding power contacts along the transverse direction thereby resulting that the grounding pieces are wholly offset from the power contacts in the vertical direction so as to avoid the power contacts from electrical sparkle."],["1.An electrical connector comprising: an insulative housing having a base and a mating tongue with a thickened step at a root to the base; a first row and a second row of contacts disposed in the insulative housing and comprising contact portions exposed upon the mating tongue and arranged along a transverse direction and tail portions out of the base, each row of contacts at least are categoried with two grounding contacts at two outermost positions and two power contacts at inner sides of corresponding grounding contacts along the transverse direction; and a pair of grounding pieces disposed the insulative housing and between and discrete from the first and second rows of the contacts, each grounding piece comprising a securing portion disposed in the mating tongue and defines an abutment exposed upon corresponding side face of the mating tongue; wherein the pair of grounding pieces are completely separated from each other and each grounding piece is located between and isolated from corresponding grounding contacts in a vertical direction perpendicular to the transverse direction and are far away from corresponding power contacts along the transverse direction thereby resulting that the grounding pieces are wholly offset from the power contacts in the vertical direction.","2.The electrical connector as claimed in claim 1, wherein there is no contacts between the grounding contact and corresponding power in each of the first and second rows of the contacts.","3.The electrical connector as claimed in claim 2, wherein there are two signal contacts and one detect contact between the two power contacts of each row of the contacts in the transverse direction.","4.The electrical connector as claimed in claim 1, further comprising an outer shell, wherein the outer shell is retained around the base and surrounds the mating tongue, thereby defining an insertion space between the outer shell and the mating tongue.","5.The electrical connector as claimed in claim 4, wherein the outer shell is conductive and cast.","6.The electrical connector as claimed in claim 1, wherein each of securing portion includes an enlarged front head and the abutment is formed at an outermost of the front head, the front head is enlarged at an inner side thereof in the transverse direction.","7.The electrical connector as claimed in claim 6, wherein the front head defines a hole therein.","8.The electrical connector as claimed in claim 7, wherein each of the securing portion define a leg contacting directly an outer shell surrounding the insulative housing and defining an insertion space between the outer shell and the mating tongue.","9.The electrical connector as claimed in claim 6, wherein each of the grounding piece define a leg bending from the securing portion for connecting to a printed circuit board, the securing portion define a hole near the leg.","10.The electrical connector as claimed in claim 1, further comprising an inner shell, wherein the inner shell fitly surrounds the thickened step.","11.An electrical connector for high power transmission, comprising: an insulative housing having a base and a mating tongue with a thickened step at a root to the base; and a row of first contacts and a row of second contacts with contacting portions arranged on opposite side surfaces of the mating tongue in a transverse direction and tail legs out of the base, each row of contact at least comprising two power contacts respectively; a pair of latching arms distinct from each other and embedded in insulative housing and located between and distinct from the two rows of contacts, each latching arms defines a latching abutment exposed upon corresponding side face of the mating tongue; wherein latching arms are deviate from corresponding power contacts, thereby the latching arms are wholly offset from the power contacts in a direction perpendicular to the mating tongue.","12.The electrical connector as claimed in claim 11, wherein the latching arm defines an enlarged front head.","13.The electrical connector as claimed in claim 12, wherein the front head defined a hole filled with insulating material of the insulative housing.","14.The electrical connector as claimed in claim 13, wherein the latching arm defines a recess at outer side thereof, which corresponds to the thickened step.","15.The electrical connector as claimed in claim 14, wherein the latching arm defines an inward project at inner side thereof, which is located at a root of the mating tongue.","16.An electrical connector comprising: a housing including a base, and a tongue extending form the base in a front-to-back direction and forming opposite first and second surfaces on the tongue in a vertical direction perpendicular to the front-to-back direction; a plurality of first contacts disposed in the housing and arranged in a first row along a transverse direction perpendicular to both the vertical direction and the front-to-back direction with first contacting portions exposed upon the first surface, the first contacts including a pair of first grounding contacts respectively located on two opposite lateral sides of the housing, a pair of first power contacts and a pair of first signal contacts between the pair of first grounding contacts in the transverse direction; a plurality of second contacts disposed in the housing and arranged in a second row along the transverse direction with second contacting portions exposed upon the second surface, the second contacts including a pair of second grounding contacts respectively located on the two opposite lateral sides of the housing, a pair of second power contacts and a pair of second signal contacts between said pair of second grounding contacts in said transverse direction; and a pair of latching arm embedded within a middle level and located on two opposite lateral sides of the mating tongue, and respectively aligned with the corresponding first grounding contacts and second grounding contacts in the vertical direction; wherein in the tongue, no metallic means is located between the first contacts and the second contacts in the vertical direction except the pair of grounding pieces are located essentially respectively between the pair of first grounding contacts and the pair of second grounding contacts in the vertical direction; where the latching arms are dimensioned not to overlap with the first and second power contacts wholly in the vertical direction so as to avoid the power contacts from electrical sparkle.","17.The electrical connector as claimed in claim 16, wherein a thickness of each of the first power contacts and the second power contacts is not less than 0.16 mm.","18.The electrical connector as claimed in claim 16, further comprising an outer shielding shell enclosing the housing, wherein each of the pair of latching arms includes a leg mechanically and electrically contacting the outer shielding shell.","19.The electrical connector as claimed in claim 16, wherein each of the pair of latching arms includes a leg extending downwardly for mounting to a printed circuit board."],[" BACKGROUND OF THE INVENTION "],[" SUMMARY OF THE INVENTION An electrical connector comprises an insulative housing having a base and a tongue, an upper and lower rows of contacts mounted in the insulative housing and exposed upon the tongue and a pair of grounding pieces separated from each other and retained in the insulative housing between the two rows of contacts.","Each grounding piece comprises a securing portion disposed in the mating tongue and defines an abutment exposed upon corresponding side face of the mating tongue.","The pair of grounding pieces are far away from corresponding power contacts along the transverse direction thereby resulting that the grounding pieces are wholly offset from the power contacts in the vertical direction so as to avoid the power contacts from electrical sparkle."],["CROSS REFERENCE TO RELATED APPLICATIONS This application is a continuation of the co-pending application Ser.","No.","15/400,965 filed on Jan. 7, 2017, the contents of which are incorporated entirely herein by reference.","BACKGROUND OF THE INVENTION 1.Field of the Invention The present invention relates to an electrical connector having an adequately configured grounding piece with respect to contacts thereof.","2.Description of Related Arts China Patent No.","203859324, issued on Oct. 1, 2014, discloses an electrical connector having an insulative housing, an upper and lower rows of contacts in the insulative housing, a center grounding/shielding piece between the upper and lower rows of contacts, and an outer metallic shell.","The grounding piece has a main body, a pair of side tabs bent from the main body, and a rear portion for engaging and therefore grounding to the outer shell.","In the case that the tongue portion of the housing to which the contacts and the grounding piece are mounted is relatively thin and the desired high current is to be conducted by the contacts for quick charging, there is concern that the main body of the grounding piece might be situated too close to the contacts with a potential risk of shorting.","SUMMARY OF THE INVENTION An electrical connector comprises an insulative housing having a base and a tongue, an upper and lower rows of contacts mounted in the insulative housing and exposed upon the tongue and a pair of grounding pieces separated from each other and retained in the insulative housing between the two rows of contacts.","Each grounding piece comprises a securing portion disposed in the mating tongue and defines an abutment exposed upon corresponding side face of the mating tongue.","The pair of grounding pieces are far away from corresponding power contacts along the transverse direction thereby resulting that the grounding pieces are wholly offset from the power contacts in the vertical direction so as to avoid the power contacts from electrical sparkle.","BRIEF DESCRIPTION OF THE DRAWING FIG.","1 is a perspective view of an electrical connector in accordance with the present invention; FIG.","2 is another perspective view of the electrical connector of FIG.","1; FIG.","3 is a front plan view of the electrical connector of FIG.","1; FIG.","4 is an exploded view of the electrical connector of FIG.","1; FIG.","5 is a further exploded view of FIG.","4; FIG.","6 is a view similar to FIG.","5 but from a different perspective; FIG.","7 is a cross-sectional view of the electrical connector of FIG.","1 taken along line 7-7; FIG.","8(A) is a cross-sectional view of the electrical connector of FIG.","3 taken along line 8A-8A; FIG.","8(B) is a cross-sectional view of the electrical connector of FIG.","3 taken along line 8B-8B; FIG.","9 is a view showing relationship between an upper and lower rows of contacts and a pair of separated grounding pieces; FIG.","10 is a view similar to FIG.","9 but from a different perspective; FIG.","11 is a perspective view of a pair of separated grounding pieces according to another embodiment of the present invention; FIG.","12 is an exploded perspective view of the initial terminal module of the electrical connector of the first embodiment of FIG.","1; and FIG.","13 is a cross-sectional view of the electrical connector of FIG.","1 along line 13-13 to show no traditional shielding plate located between the upper row of contacts and the lower row of contacts wherein the thickness of the contacts is increased compared with that of the traditional contact.","FIG.","14 is a top plan view of FIG.","1 without the outer shell and the insulating housing to show the relationship of the upper and lower contacts and the grounding pieces.","DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Referring to FIGS.","1 to 13, an electrical connector defines at a front thereof an insertion space 500 for receiving a mating connector.","In the embodiment of FIGS.","1 to 13, the electrical connector comprises an insulative housing 10 having a base 13 and a mating tongue 19, a plurality of contacts 2 including an upper/first row of contacts 21 and a lower/second row of contacts 22 mounted in the insulative housing 10, a metallic element including a pair of grounding pieces (or latch arms) 3 separated from each other and mounted in the insulative housing 10 between the upper and lower rows of contacts, and an outer shielding shell 5 enclosing the insulative housing 10.The mating tongue 19 defines a thickened step 191 at a root of the base 13.The electrical connector further comprises an upper and lower inner shells 41 and 42 enclosing the thickened step 191 and a sealing element 6 applied to a rear of the insulative housing 10.The insulative housing 10 is constructed of a first insert-molding 11 and a second insert-molding 16 wherein the first insert-molding 11 with the contacts 2 is regarded as the initial terminal module while the housing 10 with the contacts 2 is regarded as the complete terminal module.","The first insert-molding 11 is constructed of the base 13 and a first tongue portion 12.The first tongue portion 12 has a front part 121, a rear part 122, and a plurality of holes through the front and rear parts 121 and 122.The front part 121 has a pair of grooves 1212 at two opposite sides thereof and a pair of protrusions 1211 in front of the grooves 1212.The base 13 includes a front wall 131, a rear wall 132, a front step 14, a rear extension 15, and a groove 151 generally between the wall 132 and the extension 15 where the sealing element 6 is formed.","The rear part 122 is connected with the front step 14.The second insert-molding 16 constitutes a second tongue portion 17 and has a front part 171 and a rear part 172.The first and second tongue portions 12 and 17 together form the tongue of the insulative housing 10.Each row of the upper/first and lower/second rows of contacts 21 and 22 include a pair of grounding contacts 23, a pair of power contacts 24, a pair of signal contacts 25, and one detect contact 26.The grounding contacts 23 of either the upper row of contacts 21 or the lower row of contacts 22 are arranged at two outermost positions, i.e., the opposite lateral sides of the housing 10 or the tongue, and respective power contacts 24, signal contacts 25, and detect contact 26 are arranged between associated pair of grounding contacts 23.The contact 21 or 22 has a thickness of about 0.2 mm.","Each contact 21 or 22 has a contact portion 27, a securing portion 28, and a tail portion 29.The contact portion 27 has an embedded end 271.The pair of grounding pieces/latching arms 3 are separated from each other and each has a securing portion 31 and a leg 33 extending rearwardly.","The securing portion 31 has an abutment 312 extending sidewardly outward for latchable engagement with a deflectable latch of a plug connector mateable with the subject electrical connector.","Please notes, as best shown in FIGS.","9 and 10, each securing portion 31 of the latching arm 31 includes an enlarged front head 313, that is, the front head is enlarged at an inner side thereof in the transverse direction.","The latching abutment 312 is formed at an outermost of the front head 313 and a hole 3132 for pass of the insulating material of the housing 10.The front heads 313 enlarge contacting areas of the securing portions 31 in the insulating housing 10 so as to ensure the securing portions 31 in the insulating housing after thousands of the engagement of the deflectable latch of the plug connector and the latching arms.","The latching arm defines a recess 314 at outer side thereof, which corresponds to the thickened step, and an inward project 315 at inner side thereof, which is located at a root of the mating tongue.","The upper and lower inner shells 41 and 42 are conductive for grounding purpose and each shell includes a first main part 43, a second main part 44, a connection 45, and a pair of securing parts 46.The first and second main parts 43 and 44 are parallel to each other.","The pair of securing parts 46 of the upper inner shell 41 are interlocked to the pair of securing parts 46 of the lower inner shell 42.The outer shielding shell 5 is also conductive and has a pair of grounding posts 54.The outer shielding shell 5 is generally tubular and has an interior surface 51, together the tongue of the insulative housing 10, to form an insertion space 500.The outer shielding shell 5 further has four lugs 52 on the interior surface 51 and a pair of stops 53.The upper and lower rows of contacts 21 and 22 and the grounding pieces 3 are insert molded with the insulative housing 10 in a generally known manner to expose the contact portions 27 to the tongue.","Each of the pair of grounding pieces 3 is aligned between a corresponding grounding contact 23 of the upper row of contacts 21 and a corresponding grounding contact 23 of the lower row of contacts 22 so that the grounding pieces are positioned away from the other contacts.","The securing portion 31 of the grounding piece 3 is secured in the first tongue portion 12 and the base 13 while the leg 33 of the grounding piece 3 extends out of the rear wall 132 of the base 13.The abutment 312 is exposed out of the protrusion 1211 and in the groove 1212 so that in use a grounding function can be achieved while the protrusion 1211 and the groove 1212 will not be damaged by an inserted mating connector.","As best shown in FIG.","14, the pair of latching arms 3 are located between and isolated from the grounding contacts 23 in the vertical direction and separate from the power contacts 24 along the transverse direction, resulting that the latching arms 3 are disposed offset from the power contacts 24 in the vertical direction, which avoid the power contacts with larger power current up to 10 A from electrical sparkle.","The first main parts 43 of the upper and lower inner shells 41 and 42 enclose the rear part 122 of the first tongue portion 12 while the second main parts 44 of the upper and lower inner shells 41 and 42 enclose the base 13.The insulative housing 10 together with insert molded contacts 21 and 22 and grounding pieces 3 is mounted to the outer shielding shell 5 until the lugs 52 are abutted by the front wall 131 of the base 13.It is noted that a front surface of the lug 52 is located forwardly of the front step 14 of the base 13 so that an over-inserted mating connector will push, if any, the lugs 52 instead of the front step 14 of the base 13, thus preventing any potential damage to the insulative housing 10.Moreover, the second main parts 44 of the upper and lower inner shells 41 and 42 are welded, and therefore grounded, to the interior surface 51 of the outer shielding shell 5.The leg 33 of the grounding piece 3 extends out of the rear wall 132 of the base 13 through the sealing element 6 formed in the groove 151 within the outer shielding shell 5.The outer shielding shell 5 is grounded to a printed circuit board to which the electrical connector is mounted by way of the grounding posts 54.In a first embodiment of the grounding piece 3, the leg 33 has a contacting portion 34 for contacting directly with the outer shielding shell 5 for grounding purpose.","The contacting portion 34 is located behind the sealing element 6.In a second embodiment shown in FIG.","11, the grounding piece 3′ has a leg 33′ adapted for connecting to the printed circuit board to which the electrical connector is mounted for grounding purpose.","It should be noted that as disclosed in the USB Type C electrical connector specification issued on Mar.","25, 2016 which is being submitted with Information Statement Disclosure of this application, in the traditional connector a thickness of mating tongue is essentially 0.6 mm, the thickness of the upper/lower contact is around 0.15 mm, the thickness of the shielding plate is around 0.10 mm or less, and a distance between the upper/lower contact and the shielding plate is around 0.15˜0.175 mm Understandably, such a relatively tiny distance is not fit for a relatively high current flowing through the contact.","Anyhow, a variation version of the Type C connector is desired by the user to have the less number of the contacts while having capability of quick charging/power effect.","In other words, the twenty four contacts of the traditional connector are deemed too many, and only some of them with the specific functions are required for achieving the general signal transmission and the high power transmission.","From the technical viewpoint, the corresponding contact should enlarge the cross-sectional for carrying the higher current to implement the quick charging effect.","Understandably, the pitch of the remaining contacts is fixed and no space between the adjacent two contacts is available for allowing the contact to enlarge its dimension in the transverse direction.","Some connector makers try to use the expensive material for better conductivity thereof for compromising such a high current situation even though it is uneconomic.","The invention uses another approach wherein the contact is intentionally thickened in the vertical direction to enlarge the cross-section of the contact for carrying high current thereof.","Understandably, because the mating height in the vertical direction should remain same as the typical/traditional connector, the increased thickness of the contact should inwardly invade the insulative tongue.","Therefore, on one hand, because the traditional connector is equipped with the metallic shielding plate between two (upper and lower) rows of contacts in the vertical direction for shielding and grounding, the thickened contact may inevitably shorten the distance between the contact and the shielding plate in the vertical direction, i.e., less than the aforementioned 0.15˜0.175 mm, thus significantly increasing the shorting risk, and it is especially true under the high current delivery.","On the other hand, in the variation design for the low level use, because the high speed transmission differential pair contacts are not required and can be removed from the traditional full-pin arrangement, the shielding effect provided by the shielding plate is no longer needed.","Therefore, in the invention, the traditional shielding plate is intentionally removed, and only a pair of grounding pieces 3 remain on two opposite lateral side regions and between the (upper and lower) corresponding grounding contact 23 in the vertical direction for latching with the corresponding plug connector and grounding consideration.","Therefore, without the shielding plate, the distance between the respective upper and lower power contacts 24 aligned in the vertical direction, each of which has a larger thickness and carries the higher current, is relatively large without possibility of shorting therebetween.","In fact, a distance in the vertical direction between the thickened upper power contact 24 and the corresponding thickened lower power contact 24 aligned in the same vertical plane, is not less than 0.3 mm which is clearly larger than 0.15˜0.175 mm defined between the upper/lower contact and the shielding plate along the vertical direction in the traditional connector.","Therefore, the structure of the invention is fit to carry the high current for quick charging compared with the traditional connector.","In the embodiment, the contact 21 or 22 having a preferable thickness of about 0.2 mm may implement quick changing of a 10 ampere current.","Anyhow, a thickness of 0.16 mm may be also another approach.","Therefore, a range between 0.16 mm and 0.22 mm may be acceptable.","In this embodiment, a thickness of the first contact 21 or the second contact 22 is larger than that of the grounding piece 3.The thickness of the grounding piece 3 is larger than that of the inner shell 41, 42.Anyhow, the thickness of the outer shielding shell 5 around the insertion space 500, is two time of that of the first contact 21 or the second contact 22.Under this arrangement, the whole connector is not only structurally strong enough but also can be easily and economically made.","It should be understood that in FIG.","8(B) even if the grounding piece 3 is very closer to the upper/lower grounding contact 23 in the vertical direction, there is no shorting risk because both of them are grounded without power delivery.","However, the disclosure is illustrative only, changes may be made in detail, especially in matter of shape, size, and arrangement of parts within the principles of the invention."]],"string":"[\n [\n \"ELECTRICAL CONNECTOR HAVING SEPARATE GROUNDING PIECES\",\n \"An electrical connector includes an insulative housing having a base and a tongue, an upper and lower rows of contacts mounted in the insulative housing and exposed upon the tongue and a pair of grounding pieces separated from each other and retained in the insulative housing between the two rows of contacts.\",\n \"Each grounding piece includes a securing portion disposed in the mating tongue and defines an abutment exposed upon corresponding side face of the mating tongue.\",\n \"The pair of grounding pieces are far away from corresponding power contacts along the transverse direction thereby resulting that the grounding pieces are wholly offset from the power contacts in the vertical direction so as to avoid the power contacts from electrical sparkle.\"\n ],\n [\n \"1.An electrical connector comprising: an insulative housing having a base and a mating tongue with a thickened step at a root to the base; a first row and a second row of contacts disposed in the insulative housing and comprising contact portions exposed upon the mating tongue and arranged along a transverse direction and tail portions out of the base, each row of contacts at least are categoried with two grounding contacts at two outermost positions and two power contacts at inner sides of corresponding grounding contacts along the transverse direction; and a pair of grounding pieces disposed the insulative housing and between and discrete from the first and second rows of the contacts, each grounding piece comprising a securing portion disposed in the mating tongue and defines an abutment exposed upon corresponding side face of the mating tongue; wherein the pair of grounding pieces are completely separated from each other and each grounding piece is located between and isolated from corresponding grounding contacts in a vertical direction perpendicular to the transverse direction and are far away from corresponding power contacts along the transverse direction thereby resulting that the grounding pieces are wholly offset from the power contacts in the vertical direction.\",\n \"2.The electrical connector as claimed in claim 1, wherein there is no contacts between the grounding contact and corresponding power in each of the first and second rows of the contacts.\",\n \"3.The electrical connector as claimed in claim 2, wherein there are two signal contacts and one detect contact between the two power contacts of each row of the contacts in the transverse direction.\",\n \"4.The electrical connector as claimed in claim 1, further comprising an outer shell, wherein the outer shell is retained around the base and surrounds the mating tongue, thereby defining an insertion space between the outer shell and the mating tongue.\",\n \"5.The electrical connector as claimed in claim 4, wherein the outer shell is conductive and cast.\",\n \"6.The electrical connector as claimed in claim 1, wherein each of securing portion includes an enlarged front head and the abutment is formed at an outermost of the front head, the front head is enlarged at an inner side thereof in the transverse direction.\",\n \"7.The electrical connector as claimed in claim 6, wherein the front head defines a hole therein.\",\n \"8.The electrical connector as claimed in claim 7, wherein each of the securing portion define a leg contacting directly an outer shell surrounding the insulative housing and defining an insertion space between the outer shell and the mating tongue.\",\n \"9.The electrical connector as claimed in claim 6, wherein each of the grounding piece define a leg bending from the securing portion for connecting to a printed circuit board, the securing portion define a hole near the leg.\",\n \"10.The electrical connector as claimed in claim 1, further comprising an inner shell, wherein the inner shell fitly surrounds the thickened step.\",\n \"11.An electrical connector for high power transmission, comprising: an insulative housing having a base and a mating tongue with a thickened step at a root to the base; and a row of first contacts and a row of second contacts with contacting portions arranged on opposite side surfaces of the mating tongue in a transverse direction and tail legs out of the base, each row of contact at least comprising two power contacts respectively; a pair of latching arms distinct from each other and embedded in insulative housing and located between and distinct from the two rows of contacts, each latching arms defines a latching abutment exposed upon corresponding side face of the mating tongue; wherein latching arms are deviate from corresponding power contacts, thereby the latching arms are wholly offset from the power contacts in a direction perpendicular to the mating tongue.\",\n \"12.The electrical connector as claimed in claim 11, wherein the latching arm defines an enlarged front head.\",\n \"13.The electrical connector as claimed in claim 12, wherein the front head defined a hole filled with insulating material of the insulative housing.\",\n \"14.The electrical connector as claimed in claim 13, wherein the latching arm defines a recess at outer side thereof, which corresponds to the thickened step.\",\n \"15.The electrical connector as claimed in claim 14, wherein the latching arm defines an inward project at inner side thereof, which is located at a root of the mating tongue.\",\n \"16.An electrical connector comprising: a housing including a base, and a tongue extending form the base in a front-to-back direction and forming opposite first and second surfaces on the tongue in a vertical direction perpendicular to the front-to-back direction; a plurality of first contacts disposed in the housing and arranged in a first row along a transverse direction perpendicular to both the vertical direction and the front-to-back direction with first contacting portions exposed upon the first surface, the first contacts including a pair of first grounding contacts respectively located on two opposite lateral sides of the housing, a pair of first power contacts and a pair of first signal contacts between the pair of first grounding contacts in the transverse direction; a plurality of second contacts disposed in the housing and arranged in a second row along the transverse direction with second contacting portions exposed upon the second surface, the second contacts including a pair of second grounding contacts respectively located on the two opposite lateral sides of the housing, a pair of second power contacts and a pair of second signal contacts between said pair of second grounding contacts in said transverse direction; and a pair of latching arm embedded within a middle level and located on two opposite lateral sides of the mating tongue, and respectively aligned with the corresponding first grounding contacts and second grounding contacts in the vertical direction; wherein in the tongue, no metallic means is located between the first contacts and the second contacts in the vertical direction except the pair of grounding pieces are located essentially respectively between the pair of first grounding contacts and the pair of second grounding contacts in the vertical direction; where the latching arms are dimensioned not to overlap with the first and second power contacts wholly in the vertical direction so as to avoid the power contacts from electrical sparkle.\",\n \"17.The electrical connector as claimed in claim 16, wherein a thickness of each of the first power contacts and the second power contacts is not less than 0.16 mm.\",\n \"18.The electrical connector as claimed in claim 16, further comprising an outer shielding shell enclosing the housing, wherein each of the pair of latching arms includes a leg mechanically and electrically contacting the outer shielding shell.\",\n \"19.The electrical connector as claimed in claim 16, wherein each of the pair of latching arms includes a leg extending downwardly for mounting to a printed circuit board.\"\n ],\n [\n \" BACKGROUND OF THE INVENTION \"\n ],\n [\n \" SUMMARY OF THE INVENTION An electrical connector comprises an insulative housing having a base and a tongue, an upper and lower rows of contacts mounted in the insulative housing and exposed upon the tongue and a pair of grounding pieces separated from each other and retained in the insulative housing between the two rows of contacts.\",\n \"Each grounding piece comprises a securing portion disposed in the mating tongue and defines an abutment exposed upon corresponding side face of the mating tongue.\",\n \"The pair of grounding pieces are far away from corresponding power contacts along the transverse direction thereby resulting that the grounding pieces are wholly offset from the power contacts in the vertical direction so as to avoid the power contacts from electrical sparkle.\"\n ],\n [\n \"CROSS REFERENCE TO RELATED APPLICATIONS This application is a continuation of the co-pending application Ser.\",\n \"No.\",\n \"15/400,965 filed on Jan. 7, 2017, the contents of which are incorporated entirely herein by reference.\",\n \"BACKGROUND OF THE INVENTION 1.Field of the Invention The present invention relates to an electrical connector having an adequately configured grounding piece with respect to contacts thereof.\",\n \"2.Description of Related Arts China Patent No.\",\n \"203859324, issued on Oct. 1, 2014, discloses an electrical connector having an insulative housing, an upper and lower rows of contacts in the insulative housing, a center grounding/shielding piece between the upper and lower rows of contacts, and an outer metallic shell.\",\n \"The grounding piece has a main body, a pair of side tabs bent from the main body, and a rear portion for engaging and therefore grounding to the outer shell.\",\n \"In the case that the tongue portion of the housing to which the contacts and the grounding piece are mounted is relatively thin and the desired high current is to be conducted by the contacts for quick charging, there is concern that the main body of the grounding piece might be situated too close to the contacts with a potential risk of shorting.\",\n \"SUMMARY OF THE INVENTION An electrical connector comprises an insulative housing having a base and a tongue, an upper and lower rows of contacts mounted in the insulative housing and exposed upon the tongue and a pair of grounding pieces separated from each other and retained in the insulative housing between the two rows of contacts.\",\n \"Each grounding piece comprises a securing portion disposed in the mating tongue and defines an abutment exposed upon corresponding side face of the mating tongue.\",\n \"The pair of grounding pieces are far away from corresponding power contacts along the transverse direction thereby resulting that the grounding pieces are wholly offset from the power contacts in the vertical direction so as to avoid the power contacts from electrical sparkle.\",\n \"BRIEF DESCRIPTION OF THE DRAWING FIG.\",\n \"1 is a perspective view of an electrical connector in accordance with the present invention; FIG.\",\n \"2 is another perspective view of the electrical connector of FIG.\",\n \"1; FIG.\",\n \"3 is a front plan view of the electrical connector of FIG.\",\n \"1; FIG.\",\n \"4 is an exploded view of the electrical connector of FIG.\",\n \"1; FIG.\",\n \"5 is a further exploded view of FIG.\",\n \"4; FIG.\",\n \"6 is a view similar to FIG.\",\n \"5 but from a different perspective; FIG.\",\n \"7 is a cross-sectional view of the electrical connector of FIG.\",\n \"1 taken along line 7-7; FIG.\",\n \"8(A) is a cross-sectional view of the electrical connector of FIG.\",\n \"3 taken along line 8A-8A; FIG.\",\n \"8(B) is a cross-sectional view of the electrical connector of FIG.\",\n \"3 taken along line 8B-8B; FIG.\",\n \"9 is a view showing relationship between an upper and lower rows of contacts and a pair of separated grounding pieces; FIG.\",\n \"10 is a view similar to FIG.\",\n \"9 but from a different perspective; FIG.\",\n \"11 is a perspective view of a pair of separated grounding pieces according to another embodiment of the present invention; FIG.\",\n \"12 is an exploded perspective view of the initial terminal module of the electrical connector of the first embodiment of FIG.\",\n \"1; and FIG.\",\n \"13 is a cross-sectional view of the electrical connector of FIG.\",\n \"1 along line 13-13 to show no traditional shielding plate located between the upper row of contacts and the lower row of contacts wherein the thickness of the contacts is increased compared with that of the traditional contact.\",\n \"FIG.\",\n \"14 is a top plan view of FIG.\",\n \"1 without the outer shell and the insulating housing to show the relationship of the upper and lower contacts and the grounding pieces.\",\n \"DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Referring to FIGS.\",\n \"1 to 13, an electrical connector defines at a front thereof an insertion space 500 for receiving a mating connector.\",\n \"In the embodiment of FIGS.\",\n \"1 to 13, the electrical connector comprises an insulative housing 10 having a base 13 and a mating tongue 19, a plurality of contacts 2 including an upper/first row of contacts 21 and a lower/second row of contacts 22 mounted in the insulative housing 10, a metallic element including a pair of grounding pieces (or latch arms) 3 separated from each other and mounted in the insulative housing 10 between the upper and lower rows of contacts, and an outer shielding shell 5 enclosing the insulative housing 10.The mating tongue 19 defines a thickened step 191 at a root of the base 13.The electrical connector further comprises an upper and lower inner shells 41 and 42 enclosing the thickened step 191 and a sealing element 6 applied to a rear of the insulative housing 10.The insulative housing 10 is constructed of a first insert-molding 11 and a second insert-molding 16 wherein the first insert-molding 11 with the contacts 2 is regarded as the initial terminal module while the housing 10 with the contacts 2 is regarded as the complete terminal module.\",\n \"The first insert-molding 11 is constructed of the base 13 and a first tongue portion 12.The first tongue portion 12 has a front part 121, a rear part 122, and a plurality of holes through the front and rear parts 121 and 122.The front part 121 has a pair of grooves 1212 at two opposite sides thereof and a pair of protrusions 1211 in front of the grooves 1212.The base 13 includes a front wall 131, a rear wall 132, a front step 14, a rear extension 15, and a groove 151 generally between the wall 132 and the extension 15 where the sealing element 6 is formed.\",\n \"The rear part 122 is connected with the front step 14.The second insert-molding 16 constitutes a second tongue portion 17 and has a front part 171 and a rear part 172.The first and second tongue portions 12 and 17 together form the tongue of the insulative housing 10.Each row of the upper/first and lower/second rows of contacts 21 and 22 include a pair of grounding contacts 23, a pair of power contacts 24, a pair of signal contacts 25, and one detect contact 26.The grounding contacts 23 of either the upper row of contacts 21 or the lower row of contacts 22 are arranged at two outermost positions, i.e., the opposite lateral sides of the housing 10 or the tongue, and respective power contacts 24, signal contacts 25, and detect contact 26 are arranged between associated pair of grounding contacts 23.The contact 21 or 22 has a thickness of about 0.2 mm.\",\n \"Each contact 21 or 22 has a contact portion 27, a securing portion 28, and a tail portion 29.The contact portion 27 has an embedded end 271.The pair of grounding pieces/latching arms 3 are separated from each other and each has a securing portion 31 and a leg 33 extending rearwardly.\",\n \"The securing portion 31 has an abutment 312 extending sidewardly outward for latchable engagement with a deflectable latch of a plug connector mateable with the subject electrical connector.\",\n \"Please notes, as best shown in FIGS.\",\n \"9 and 10, each securing portion 31 of the latching arm 31 includes an enlarged front head 313, that is, the front head is enlarged at an inner side thereof in the transverse direction.\",\n \"The latching abutment 312 is formed at an outermost of the front head 313 and a hole 3132 for pass of the insulating material of the housing 10.The front heads 313 enlarge contacting areas of the securing portions 31 in the insulating housing 10 so as to ensure the securing portions 31 in the insulating housing after thousands of the engagement of the deflectable latch of the plug connector and the latching arms.\",\n \"The latching arm defines a recess 314 at outer side thereof, which corresponds to the thickened step, and an inward project 315 at inner side thereof, which is located at a root of the mating tongue.\",\n \"The upper and lower inner shells 41 and 42 are conductive for grounding purpose and each shell includes a first main part 43, a second main part 44, a connection 45, and a pair of securing parts 46.The first and second main parts 43 and 44 are parallel to each other.\",\n \"The pair of securing parts 46 of the upper inner shell 41 are interlocked to the pair of securing parts 46 of the lower inner shell 42.The outer shielding shell 5 is also conductive and has a pair of grounding posts 54.The outer shielding shell 5 is generally tubular and has an interior surface 51, together the tongue of the insulative housing 10, to form an insertion space 500.The outer shielding shell 5 further has four lugs 52 on the interior surface 51 and a pair of stops 53.The upper and lower rows of contacts 21 and 22 and the grounding pieces 3 are insert molded with the insulative housing 10 in a generally known manner to expose the contact portions 27 to the tongue.\",\n \"Each of the pair of grounding pieces 3 is aligned between a corresponding grounding contact 23 of the upper row of contacts 21 and a corresponding grounding contact 23 of the lower row of contacts 22 so that the grounding pieces are positioned away from the other contacts.\",\n \"The securing portion 31 of the grounding piece 3 is secured in the first tongue portion 12 and the base 13 while the leg 33 of the grounding piece 3 extends out of the rear wall 132 of the base 13.The abutment 312 is exposed out of the protrusion 1211 and in the groove 1212 so that in use a grounding function can be achieved while the protrusion 1211 and the groove 1212 will not be damaged by an inserted mating connector.\",\n \"As best shown in FIG.\",\n \"14, the pair of latching arms 3 are located between and isolated from the grounding contacts 23 in the vertical direction and separate from the power contacts 24 along the transverse direction, resulting that the latching arms 3 are disposed offset from the power contacts 24 in the vertical direction, which avoid the power contacts with larger power current up to 10 A from electrical sparkle.\",\n \"The first main parts 43 of the upper and lower inner shells 41 and 42 enclose the rear part 122 of the first tongue portion 12 while the second main parts 44 of the upper and lower inner shells 41 and 42 enclose the base 13.The insulative housing 10 together with insert molded contacts 21 and 22 and grounding pieces 3 is mounted to the outer shielding shell 5 until the lugs 52 are abutted by the front wall 131 of the base 13.It is noted that a front surface of the lug 52 is located forwardly of the front step 14 of the base 13 so that an over-inserted mating connector will push, if any, the lugs 52 instead of the front step 14 of the base 13, thus preventing any potential damage to the insulative housing 10.Moreover, the second main parts 44 of the upper and lower inner shells 41 and 42 are welded, and therefore grounded, to the interior surface 51 of the outer shielding shell 5.The leg 33 of the grounding piece 3 extends out of the rear wall 132 of the base 13 through the sealing element 6 formed in the groove 151 within the outer shielding shell 5.The outer shielding shell 5 is grounded to a printed circuit board to which the electrical connector is mounted by way of the grounding posts 54.In a first embodiment of the grounding piece 3, the leg 33 has a contacting portion 34 for contacting directly with the outer shielding shell 5 for grounding purpose.\",\n \"The contacting portion 34 is located behind the sealing element 6.In a second embodiment shown in FIG.\",\n \"11, the grounding piece 3′ has a leg 33′ adapted for connecting to the printed circuit board to which the electrical connector is mounted for grounding purpose.\",\n \"It should be noted that as disclosed in the USB Type C electrical connector specification issued on Mar.\",\n \"25, 2016 which is being submitted with Information Statement Disclosure of this application, in the traditional connector a thickness of mating tongue is essentially 0.6 mm, the thickness of the upper/lower contact is around 0.15 mm, the thickness of the shielding plate is around 0.10 mm or less, and a distance between the upper/lower contact and the shielding plate is around 0.15˜0.175 mm Understandably, such a relatively tiny distance is not fit for a relatively high current flowing through the contact.\",\n \"Anyhow, a variation version of the Type C connector is desired by the user to have the less number of the contacts while having capability of quick charging/power effect.\",\n \"In other words, the twenty four contacts of the traditional connector are deemed too many, and only some of them with the specific functions are required for achieving the general signal transmission and the high power transmission.\",\n \"From the technical viewpoint, the corresponding contact should enlarge the cross-sectional for carrying the higher current to implement the quick charging effect.\",\n \"Understandably, the pitch of the remaining contacts is fixed and no space between the adjacent two contacts is available for allowing the contact to enlarge its dimension in the transverse direction.\",\n \"Some connector makers try to use the expensive material for better conductivity thereof for compromising such a high current situation even though it is uneconomic.\",\n \"The invention uses another approach wherein the contact is intentionally thickened in the vertical direction to enlarge the cross-section of the contact for carrying high current thereof.\",\n \"Understandably, because the mating height in the vertical direction should remain same as the typical/traditional connector, the increased thickness of the contact should inwardly invade the insulative tongue.\",\n \"Therefore, on one hand, because the traditional connector is equipped with the metallic shielding plate between two (upper and lower) rows of contacts in the vertical direction for shielding and grounding, the thickened contact may inevitably shorten the distance between the contact and the shielding plate in the vertical direction, i.e., less than the aforementioned 0.15˜0.175 mm, thus significantly increasing the shorting risk, and it is especially true under the high current delivery.\",\n \"On the other hand, in the variation design for the low level use, because the high speed transmission differential pair contacts are not required and can be removed from the traditional full-pin arrangement, the shielding effect provided by the shielding plate is no longer needed.\",\n \"Therefore, in the invention, the traditional shielding plate is intentionally removed, and only a pair of grounding pieces 3 remain on two opposite lateral side regions and between the (upper and lower) corresponding grounding contact 23 in the vertical direction for latching with the corresponding plug connector and grounding consideration.\",\n \"Therefore, without the shielding plate, the distance between the respective upper and lower power contacts 24 aligned in the vertical direction, each of which has a larger thickness and carries the higher current, is relatively large without possibility of shorting therebetween.\",\n \"In fact, a distance in the vertical direction between the thickened upper power contact 24 and the corresponding thickened lower power contact 24 aligned in the same vertical plane, is not less than 0.3 mm which is clearly larger than 0.15˜0.175 mm defined between the upper/lower contact and the shielding plate along the vertical direction in the traditional connector.\",\n \"Therefore, the structure of the invention is fit to carry the high current for quick charging compared with the traditional connector.\",\n \"In the embodiment, the contact 21 or 22 having a preferable thickness of about 0.2 mm may implement quick changing of a 10 ampere current.\",\n \"Anyhow, a thickness of 0.16 mm may be also another approach.\",\n \"Therefore, a range between 0.16 mm and 0.22 mm may be acceptable.\",\n \"In this embodiment, a thickness of the first contact 21 or the second contact 22 is larger than that of the grounding piece 3.The thickness of the grounding piece 3 is larger than that of the inner shell 41, 42.Anyhow, the thickness of the outer shielding shell 5 around the insertion space 500, is two time of that of the first contact 21 or the second contact 22.Under this arrangement, the whole connector is not only structurally strong enough but also can be easily and economically made.\",\n \"It should be understood that in FIG.\",\n \"8(B) even if the grounding piece 3 is very closer to the upper/lower grounding contact 23 in the vertical direction, there is no shorting risk because both of them are grounded without power delivery.\",\n \"However, the disclosure is illustrative only, changes may be made in detail, especially in matter of shape, size, and arrangement of parts within the principles of the invention.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870878"}}},{"rowIdx":4493668,"cells":{"text":{"kind":"list like","value":[["DISPLAY PANEL AND MANUFACTURING METHOD THEREOF","A display panel includes a substrate, a plurality of thin film transistors (TFTs), a plurality common electrodes, a plurality of common electrode lines, a plurality of coupling electrodes, and a plurality of pixel electrodes.","Each of the TFTs comprises a gate, a source, a drain and a channel layer coupling the source to the drain.","The gate, the common electrodes, and the common electrode lines are formed on a surface of the substrate and are separated from each other.","Each of the coupling electrodes couples a corresponding common electrode to a corresponding common electrode line, and a space is defined between the corresponding common electrode and the corresponding common electrode line."],["1.A display panel comprising: a substrate, a plurality of thin film transistors (TFTs), a plurality common electrodes, a plurality of common electrode lines, a plurality of coupling electrodes, and a plurality of pixel electrodes, wherein each of the plurality of TFTs comprises a gate electrode, a source electrode, a drain electrode and a channel layer coupling the source electrode to the drain electrode; the gate electrode, the common electrodes, and the common electrode lines are formed on a surface of the substrate and are separated from each other; each of the coupling electrodes couples a corresponding common electrode to a corresponding common electrode line, wherein a space is defined between the corresponding common electrode and the corresponding common electrode line.","2.The display panel according to claim 1, wherein the common electrodes are made of transparent conductive materials.","3.The display panel according to claim 2, wherein each of the pixel electrodes defines a plurality of slits to corporate with the common electrodes to form a parallel electrical field.","4.The display panel according to claim 1, wherein the common electrodes are made of transparent conductive films.","5.The display panel according to claim 1, wherein the display panel comprises a display area and a border area surrounding the display area, and the pixel electrodes are located in the display area.","6.The display panel according to claim 5, further comprising a plurality of gate lines and a plurality of data lines, the plurality of gate lines and the plurality of data lines are intersected with each other to define a plurality of pixel units in the display area, and each of the plurality of TFTs is located in a corresponding pixel unit and is coupled to a corresponding gate line and a corresponding data line.","7.The display panel according to claim 6, wherein at least one of the common electrode lines is located within each of the pixel units and is parallel with the date lines.","8.The display panel according to claim 1, wherein further comprising a flat layer which covers the channel layer, the source electrode, and the drain electrode of each of the TFTs, the flat layer defines a plurality of first contact holes, each of the plurality of first contact holes is between one of the plurality of common electrode lines and one of the plurality of common electrodes, each of the plurality of coupling electrodes is coupled between the corresponding common electrode and the corresponding common electrode line by one of the plurality of first contact holes.","9.The display panel according to claim 8, wherein the flat layer defines a plurality of second contact holes, each of the plurality of pixel electrodes is coupled to the drain electrode of a corresponding TFT by one of the plurality of second contact holes.","10.The display panel according to claim 1, wherein the display panel is an in-plane switching (IPS) mode liquid crystal display (LCD) panel."],[" BACKGROUND In-plane switching (IPS) mode liquid crystal display (LCD) panels are becoming more and more popular because they can present a wider viewing angle to a viewer than twisted nematic (TN) mode LCD panels.","Generally, in a method for manufacturing the IPS mode LCD panel, a plurality of photomask may be used in different photo etching processes (PEPs) to form different circuit patterns of the IPS mode LCD panel."],[" BRIEF DESCRIPTION OF THE DRAWINGS Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.","FIG.","1 illustrates a partial plan view of a display panel having a display area and a border area.","FIG.","2 illustrates is a cross-sectional view taken along line II-II of FIG.","1 .","FIG.","3 is an enlarged view of a circle region III of FIG.","2 .","FIG.","4 illustrates a flowchart of a method for manufacturing the display panel 1 of FIG.","1 and FIG.","2 .","FIG.","5 illustrates a diagrammatic view of a metal layer is formed on a substrate and a first photoresist layer is formed on the metal layer.","FIG.","6 illustrates a diagrammatic view of an exposure and development process is performed to pattern the photoresist layer.","FIG.","7 illustrates a diagrammatic view of a plurality of photoresist patterns are formed on the metal layer.","FIG.","8 illustrates a diagrammatic view of a plurality of gates and a plurality of common electrode lines are form on the substrate.","FIG.","9 illustrates a diagrammatic view of a layer of conductive materials is coated on the substrate and the photoresist patterns.","FIG.","10 illustrates a diagrammatic view of the photoresist patterns and a portion of the conductive materials on the photoresist pattern are removed from the substrate.","FIG.","11 illustrates a diagrammatic view of a second photoresist layer is formed on the substrate and covers the gates, the common electrodes, and the common electrode lines.","FIG.","12 illustrates a diagrammatic view of a portion of the second photoresist layer corresponding with the border area BB is removed.","FIG.","13 illustrates a diagrammatic view of a portion of the conductive materials corresponding with the border area of the display panel is removed.","detailed-description description=\"Detailed Description\" end=\"lead\"?"],["CROSS-REFERENCE TO RELATED APPLICATIONS This application is a divisional application of U.S. Ser.","No.","14/750,177, filed Jun.","25, 2015 the contents of which are hereby incorporated by reference.","The patent application Ser.","No.","14/750,177 in turn claims the benefit of priority under 35 USC 119 from Chinese Patent Application No.","201410434066.1 filed on Aug. 29, 2014.FIELD The subject matter herein generally relates to a display panel a method for manufacturing the display panel.","BACKGROUND In-plane switching (IPS) mode liquid crystal display (LCD) panels are becoming more and more popular because they can present a wider viewing angle to a viewer than twisted nematic (TN) mode LCD panels.","Generally, in a method for manufacturing the IPS mode LCD panel, a plurality of photomask may be used in different photo etching processes (PEPs) to form different circuit patterns of the IPS mode LCD panel.","BRIEF DESCRIPTION OF THE DRAWINGS Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.","FIG.","1 illustrates a partial plan view of a display panel having a display area and a border area.","FIG.","2 illustrates is a cross-sectional view taken along line II-II of FIG.","1.FIG.","3 is an enlarged view of a circle region III of FIG.","2.FIG.","4 illustrates a flowchart of a method for manufacturing the display panel 1 of FIG.","1 and FIG.","2.FIG.","5 illustrates a diagrammatic view of a metal layer is formed on a substrate and a first photoresist layer is formed on the metal layer.","FIG.","6 illustrates a diagrammatic view of an exposure and development process is performed to pattern the photoresist layer.","FIG.","7 illustrates a diagrammatic view of a plurality of photoresist patterns are formed on the metal layer.","FIG.","8 illustrates a diagrammatic view of a plurality of gates and a plurality of common electrode lines are form on the substrate.","FIG.","9 illustrates a diagrammatic view of a layer of conductive materials is coated on the substrate and the photoresist patterns.","FIG.","10 illustrates a diagrammatic view of the photoresist patterns and a portion of the conductive materials on the photoresist pattern are removed from the substrate.","FIG.","11 illustrates a diagrammatic view of a second photoresist layer is formed on the substrate and covers the gates, the common electrodes, and the common electrode lines.","FIG.","12 illustrates a diagrammatic view of a portion of the second photoresist layer corresponding with the border area BB is removed.","FIG.","13 illustrates a diagrammatic view of a portion of the conductive materials corresponding with the border area of the display panel is removed.","DETAILED DESCRIPTION It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements.","In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein.","However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details.","In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described.","The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features.","The description is not to be considered as limiting the scope of the embodiments described herein.","The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections.","The connection can be such that the objects are permanently connected or releasably connected.","The term “comprising”, when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.","The present disclosure is described in relation to a display panel and a method for manufacturing the same.","Referring to FIG.","1 and FIG.","2, FIG.","1 illustrates a partial plan view of a display panel 1, FIG.","2 is a cross-sectional view taken along line II-II of FIG.","1.In at least one embodiment, the display panel 1 can include a substrate 11, a plurality of gate lines 10, a plurality of data lines 12, a plurality of thin film transistors (TFTs) 13, a plurality of common electrodes 14, a plurality of common electrode lines 15, a plurality of coupling electrodes 16, and a plurality of pixel electrodes 17.The display panel 1 can be composed of a display area AA and a border area BB (also called non-display area or non-active area) surrounding the display area AA.","The gate lines 10 and the data lines 12 are intersected with each other to define a plurality of pixel units 40 within the display area AA.","At least one of the common electrode line 15 is located in each of the pixel units 40.In at least one embodiment, the gate lines 10 are arranged in parallel, the data lines 12 are arrange in parallel as well as the gate lines 10, and the common electrode lines 15 are also arranged in parallel.","The common electrode lines 15 can be in parallel with the data lines 12.The gate lines 10 can extend along a first direction while the data lines 12 can extend along a second direction perpendicular with the first direction.","Thus, the pixel unit 40 is rectangular.","Each pixel electrode 17 is located within a corresponding pixel unit 40 and is electrically coupled to corresponding TFT 13.The pixel electrode 17 can be made of transparent materials, such as indium tin oxide (ITO).","The common electrode 14 can be located in the display area AA of the display panel 1.The common electrode 14 is coupled to the at least one common electrode line 15 within a corresponding pixel unit 40 via a corresponding electrode 16, but the common electrode 14 is not contacted with the at least one common electrode line 15 within the corresponding pixel unit 40.In this embodiment, since short circuit issues may happen in the border area BB if the common electrode lines 15 extend to the border area BB, the common electrode lines 15 are located within the display area AA.","Each of the TFTs 13 is located in a corresponding pixel unit 40 and is coupled to a corresponding gate line 10 and a corresponding data line 12.Each TFT 13 can include a gate 130, a gate insulation layer 132, a source 134, a drain 136, a channel layer 137 and a flat layer 138.The channel layer 137 is coupled between the source 134 and the drain 136.In at least one embodiment, the TFTs 13 can be bottom-gate TFTs.","The gate 130 is formed on the substrate 11 and is coupled with a corresponding data line 10.The common electrodes 14 and the common electrodes lines 15 both are formed on the substrate 11 as well as the gate 130.The gate 130, the common electrodes 14, and the common electrode lines 15 are separated from each other to avoid electrical connections therebetween.","The gate insulation layer 132 is coated on the substrate 11 and covers the gate 130 of each TFT 13, the common electrodes 14, and the common electrode 1 lines 15.The channel layer 137 is located on the gate insulation layer 132 and corresponds with the gate 130.The source 134 and the drain 135 are formed on the gate insulation layer 132 and are respectively coupled at opposite sides of the channel layer 137.The source 134 is coupled to a corresponding data line 12.The flat layer 138 is coated on the gate insulation layer 132 and covers the channel layer 137, the source 134 and the drain 136.The flat layer 138 defines a plurality of first contact holes 1380 and a plurality of second contact holes 1382 respectively corresponding with the drain 136 of each of the TFTs 13 and the common electrode lines 15.The pixel electrode 17 is coupled to the drain 136 via the first contact hole 1380.The coupling electrode 16 is coupled between a corresponding common electrode 14 and a corresponding common electrode line 15 via the second contact hole 1382.In this embodiment, as shown in FIG.","3, a space S is defined between the corresponding common electrode 14 and the corresponding common electrode line 15, thereby separating the corresponding common electrode 14 from the corresponding common electrode line 15.Each pixel electrode 17 defines a plurality of slits 170 to corporate with the common electrode 14 within a corresponding pixel unit 40 to form a parallel electrical field.","Thus, the display panel 1 can be an in-plane switching (IPS) mode liquid crystal display (LCD) panel.","FIG.","4 illustrates a flowchart of a method for manufacturing the display panel 1 of FIG.","1 and FIG.","2.The method is provided by way of example, as there are a variety of ways to carry out the method.","Each block shown in FIG.","4 represents one or more processes, methods, or subroutines which are carried out in the example method.","Furthermore, the order of blocks is illustrative only and the order of the blocks can change.","Additional blocks can be added or fewer blocks may be utilized without departing from the scope of this disclosure.","The example method can begin at block 301.At block 301, a substrate 11 is provided.","The substrate can be a transparent substrate such as glass substrate or a plastic substrate.","In other embodiments, the substrate 11 can be a translucent substrate, a non-transparent substrate or a flexible substrate.","At block 302, as shown in FIG.","5, a metal layer 22 is formed on the substrate 11 and a first photoresist layer 25 is formed on the metal layer 22 At block 303, referring to FIG.","6 and FIG.","7, the first photoresist layer 25 is patterned by an exposure and development process using a photomask 23 to form a plurality of photoresist patterns 250 on the metal layer 22.The photomask 23 can be made of metal materials.","At block 304, as shown FIG.","8, the metal layer 22 is etched to form a plurality of gates 130 and a plurality of common electrode lines 15 on the substrate 11 which are covered the photoresist patterns 250.In this embodiment, only one gate 130 and one common electrode line 15 are shown in FIG.","8.Each gate 130 and each electrode line 15 are covered by the photoresist patterns 250.In at least one embodiment, the metal layer 22 can be etched by an over etching process.","Thus, an area of the gate 130 is less than an area of a corresponding photoresist pattern 250 which covers the gate 130.For example, as shown in FIG.","8, a distance β is defined between an edge the gate 130 and a corresponding edge of the photoresist pattern 250 which covers the gate 130.Accordingly, an area of the common electrode line 15 is less than that of a corresponding photoresist pattern 250 which covers the common electrode line 15.At block 305, as shown in FIG.","9, a layer of conductive materials 140 is coated on the substrate 11 and the photoresist patterns 250.In this embodiment, the layer of conductive materials 140 is coated on surfaces of the photoresist patterns 250 away from the substrate and is coated on a portion of a surface of the substrate 11 which is not covered by the photoresist patterns 250.The conductive materials 140 can be transparent conductive materials, such as transparent conductive films made of indium tin oxide (ITO).","The conductive materials 140 serve as common electrodes 14 of the display panel 1.Since a distance β is defined between an edge of the gate 130 and a corresponding edge of the photoresist pattern 250 which covers the gate 130, the conductive materials 140 will not contact with the gates 130.Further, since the area of the common electrode line 15 is less than that of a corresponding photoresist pattern 250 covering the common electrode line 15, the conductive materials 140 will not contact with the gates 130.At block 306, as shown in FIG.","10, the photoresist patterns 250 and a portion of the conductive materials 140 on the photoresist pattern 250 are removed from the substrate 11.Thus, the other portion of the conductive materials 140 maintained on the substrate 11 form the common electrodes 14.At block 307, as shown in FIG.","11, a second photoresist layer 35 is formed on the substrate 11 and covers the gates 130, the common electrodes 14, and the common electrode lines 15.At block 308, as shown in FIG.","12, a portion of the second photoresist layer 35 corresponding with the border area BB is removed.","In at least one embodiment, an exposure process is first performed to expose the second photoresist layer 35 from a side of the substrate 11 away from the second photoresist layer 35 using an ultraviolet photomask 26, and then a development process is utilized to remove the portion of the second photoresist layer 35 corresponding with the border area BB.","At block 309, as shown in FIG.","13, a portion of the conductive materials 140 corresponding with the border area BB is removed by an etching process.","Then, the other portion of the second photoresist layer 35 coated on the substrate 11 corresponding with the display area AA is removed to expose the common electrodes 14 in the display area AA.","At block 310, a gate insulation layer 132 is formed on the substrate 11 to cover the gates 130, the common electrodes 14, and the common electrode lines 15.At block 311, a plurality of channel layers 137 are formed on the gate insulation layer 132 corresponding with the gates 130.At block 312, a plurality of sources 134 and drains 136 of the TFTs 13 are respectively formed on the gate insulation layer 132.The source 134 and the drain 136 are respectively coupled at opposite sides of a corresponding channel layer 137.At block 313, a flat layer 138 is formed on the gate insulation layer 132 to cover the channel layers 137, the sources 134, and the drains 136.At block 314, a plurality of first contact holes 1380 corresponding with the drains 136 and a plurality of second contact holes 1382 corresponding with the common electrode lines 15 and the common electrodes 14 are formed on the flat layer 138.At block 315, a plurality of pixel electrodes 17 and a plurality of coupling electrodes 16 are formed on the flat layer 138.Each pixel electrode 17 is electrically coupled with a corresponding drain via a corresponding first contact hole 1380.Each coupling electrode 16 is coupled with a corresponding common electrode 14 and a corresponding common electrode line 15 via a corresponding second contact hole 1382, thereby making an electrical connection between the corresponding common electrode 14 and the corresponding common electrode line 15.As described above, the gates 130 and the common electrodes 14 can be formed in a same exposure process using the photomask 22.Therefore, the cost for manufacturing the display panel 1 in the above mentioned method can be decreased compared with a traditional manufacturing method of the display panel 1."]],"string":"[\n [\n \"DISPLAY PANEL AND MANUFACTURING METHOD THEREOF\",\n \"A display panel includes a substrate, a plurality of thin film transistors (TFTs), a plurality common electrodes, a plurality of common electrode lines, a plurality of coupling electrodes, and a plurality of pixel electrodes.\",\n \"Each of the TFTs comprises a gate, a source, a drain and a channel layer coupling the source to the drain.\",\n \"The gate, the common electrodes, and the common electrode lines are formed on a surface of the substrate and are separated from each other.\",\n \"Each of the coupling electrodes couples a corresponding common electrode to a corresponding common electrode line, and a space is defined between the corresponding common electrode and the corresponding common electrode line.\"\n ],\n [\n \"1.A display panel comprising: a substrate, a plurality of thin film transistors (TFTs), a plurality common electrodes, a plurality of common electrode lines, a plurality of coupling electrodes, and a plurality of pixel electrodes, wherein each of the plurality of TFTs comprises a gate electrode, a source electrode, a drain electrode and a channel layer coupling the source electrode to the drain electrode; the gate electrode, the common electrodes, and the common electrode lines are formed on a surface of the substrate and are separated from each other; each of the coupling electrodes couples a corresponding common electrode to a corresponding common electrode line, wherein a space is defined between the corresponding common electrode and the corresponding common electrode line.\",\n \"2.The display panel according to claim 1, wherein the common electrodes are made of transparent conductive materials.\",\n \"3.The display panel according to claim 2, wherein each of the pixel electrodes defines a plurality of slits to corporate with the common electrodes to form a parallel electrical field.\",\n \"4.The display panel according to claim 1, wherein the common electrodes are made of transparent conductive films.\",\n \"5.The display panel according to claim 1, wherein the display panel comprises a display area and a border area surrounding the display area, and the pixel electrodes are located in the display area.\",\n \"6.The display panel according to claim 5, further comprising a plurality of gate lines and a plurality of data lines, the plurality of gate lines and the plurality of data lines are intersected with each other to define a plurality of pixel units in the display area, and each of the plurality of TFTs is located in a corresponding pixel unit and is coupled to a corresponding gate line and a corresponding data line.\",\n \"7.The display panel according to claim 6, wherein at least one of the common electrode lines is located within each of the pixel units and is parallel with the date lines.\",\n \"8.The display panel according to claim 1, wherein further comprising a flat layer which covers the channel layer, the source electrode, and the drain electrode of each of the TFTs, the flat layer defines a plurality of first contact holes, each of the plurality of first contact holes is between one of the plurality of common electrode lines and one of the plurality of common electrodes, each of the plurality of coupling electrodes is coupled between the corresponding common electrode and the corresponding common electrode line by one of the plurality of first contact holes.\",\n \"9.The display panel according to claim 8, wherein the flat layer defines a plurality of second contact holes, each of the plurality of pixel electrodes is coupled to the drain electrode of a corresponding TFT by one of the plurality of second contact holes.\",\n \"10.The display panel according to claim 1, wherein the display panel is an in-plane switching (IPS) mode liquid crystal display (LCD) panel.\"\n ],\n [\n \" BACKGROUND In-plane switching (IPS) mode liquid crystal display (LCD) panels are becoming more and more popular because they can present a wider viewing angle to a viewer than twisted nematic (TN) mode LCD panels.\",\n \"Generally, in a method for manufacturing the IPS mode LCD panel, a plurality of photomask may be used in different photo etching processes (PEPs) to form different circuit patterns of the IPS mode LCD panel.\"\n ],\n [\n \" BRIEF DESCRIPTION OF THE DRAWINGS Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.\",\n \"FIG.\",\n \"1 illustrates a partial plan view of a display panel having a display area and a border area.\",\n \"FIG.\",\n \"2 illustrates is a cross-sectional view taken along line II-II of FIG.\",\n \"1 .\",\n \"FIG.\",\n \"3 is an enlarged view of a circle region III of FIG.\",\n \"2 .\",\n \"FIG.\",\n \"4 illustrates a flowchart of a method for manufacturing the display panel 1 of FIG.\",\n \"1 and FIG.\",\n \"2 .\",\n \"FIG.\",\n \"5 illustrates a diagrammatic view of a metal layer is formed on a substrate and a first photoresist layer is formed on the metal layer.\",\n \"FIG.\",\n \"6 illustrates a diagrammatic view of an exposure and development process is performed to pattern the photoresist layer.\",\n \"FIG.\",\n \"7 illustrates a diagrammatic view of a plurality of photoresist patterns are formed on the metal layer.\",\n \"FIG.\",\n \"8 illustrates a diagrammatic view of a plurality of gates and a plurality of common electrode lines are form on the substrate.\",\n \"FIG.\",\n \"9 illustrates a diagrammatic view of a layer of conductive materials is coated on the substrate and the photoresist patterns.\",\n \"FIG.\",\n \"10 illustrates a diagrammatic view of the photoresist patterns and a portion of the conductive materials on the photoresist pattern are removed from the substrate.\",\n \"FIG.\",\n \"11 illustrates a diagrammatic view of a second photoresist layer is formed on the substrate and covers the gates, the common electrodes, and the common electrode lines.\",\n \"FIG.\",\n \"12 illustrates a diagrammatic view of a portion of the second photoresist layer corresponding with the border area BB is removed.\",\n \"FIG.\",\n \"13 illustrates a diagrammatic view of a portion of the conductive materials corresponding with the border area of the display panel is removed.\",\n \"detailed-description description=\\\"Detailed Description\\\" end=\\\"lead\\\"?\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a divisional application of U.S. Ser.\",\n \"No.\",\n \"14/750,177, filed Jun.\",\n \"25, 2015 the contents of which are hereby incorporated by reference.\",\n \"The patent application Ser.\",\n \"No.\",\n \"14/750,177 in turn claims the benefit of priority under 35 USC 119 from Chinese Patent Application No.\",\n \"201410434066.1 filed on Aug. 29, 2014.FIELD The subject matter herein generally relates to a display panel a method for manufacturing the display panel.\",\n \"BACKGROUND In-plane switching (IPS) mode liquid crystal display (LCD) panels are becoming more and more popular because they can present a wider viewing angle to a viewer than twisted nematic (TN) mode LCD panels.\",\n \"Generally, in a method for manufacturing the IPS mode LCD panel, a plurality of photomask may be used in different photo etching processes (PEPs) to form different circuit patterns of the IPS mode LCD panel.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.\",\n \"FIG.\",\n \"1 illustrates a partial plan view of a display panel having a display area and a border area.\",\n \"FIG.\",\n \"2 illustrates is a cross-sectional view taken along line II-II of FIG.\",\n \"1.FIG.\",\n \"3 is an enlarged view of a circle region III of FIG.\",\n \"2.FIG.\",\n \"4 illustrates a flowchart of a method for manufacturing the display panel 1 of FIG.\",\n \"1 and FIG.\",\n \"2.FIG.\",\n \"5 illustrates a diagrammatic view of a metal layer is formed on a substrate and a first photoresist layer is formed on the metal layer.\",\n \"FIG.\",\n \"6 illustrates a diagrammatic view of an exposure and development process is performed to pattern the photoresist layer.\",\n \"FIG.\",\n \"7 illustrates a diagrammatic view of a plurality of photoresist patterns are formed on the metal layer.\",\n \"FIG.\",\n \"8 illustrates a diagrammatic view of a plurality of gates and a plurality of common electrode lines are form on the substrate.\",\n \"FIG.\",\n \"9 illustrates a diagrammatic view of a layer of conductive materials is coated on the substrate and the photoresist patterns.\",\n \"FIG.\",\n \"10 illustrates a diagrammatic view of the photoresist patterns and a portion of the conductive materials on the photoresist pattern are removed from the substrate.\",\n \"FIG.\",\n \"11 illustrates a diagrammatic view of a second photoresist layer is formed on the substrate and covers the gates, the common electrodes, and the common electrode lines.\",\n \"FIG.\",\n \"12 illustrates a diagrammatic view of a portion of the second photoresist layer corresponding with the border area BB is removed.\",\n \"FIG.\",\n \"13 illustrates a diagrammatic view of a portion of the conductive materials corresponding with the border area of the display panel is removed.\",\n \"DETAILED DESCRIPTION It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements.\",\n \"In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein.\",\n \"However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details.\",\n \"In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described.\",\n \"The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features.\",\n \"The description is not to be considered as limiting the scope of the embodiments described herein.\",\n \"The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections.\",\n \"The connection can be such that the objects are permanently connected or releasably connected.\",\n \"The term “comprising”, when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.\",\n \"The present disclosure is described in relation to a display panel and a method for manufacturing the same.\",\n \"Referring to FIG.\",\n \"1 and FIG.\",\n \"2, FIG.\",\n \"1 illustrates a partial plan view of a display panel 1, FIG.\",\n \"2 is a cross-sectional view taken along line II-II of FIG.\",\n \"1.In at least one embodiment, the display panel 1 can include a substrate 11, a plurality of gate lines 10, a plurality of data lines 12, a plurality of thin film transistors (TFTs) 13, a plurality of common electrodes 14, a plurality of common electrode lines 15, a plurality of coupling electrodes 16, and a plurality of pixel electrodes 17.The display panel 1 can be composed of a display area AA and a border area BB (also called non-display area or non-active area) surrounding the display area AA.\",\n \"The gate lines 10 and the data lines 12 are intersected with each other to define a plurality of pixel units 40 within the display area AA.\",\n \"At least one of the common electrode line 15 is located in each of the pixel units 40.In at least one embodiment, the gate lines 10 are arranged in parallel, the data lines 12 are arrange in parallel as well as the gate lines 10, and the common electrode lines 15 are also arranged in parallel.\",\n \"The common electrode lines 15 can be in parallel with the data lines 12.The gate lines 10 can extend along a first direction while the data lines 12 can extend along a second direction perpendicular with the first direction.\",\n \"Thus, the pixel unit 40 is rectangular.\",\n \"Each pixel electrode 17 is located within a corresponding pixel unit 40 and is electrically coupled to corresponding TFT 13.The pixel electrode 17 can be made of transparent materials, such as indium tin oxide (ITO).\",\n \"The common electrode 14 can be located in the display area AA of the display panel 1.The common electrode 14 is coupled to the at least one common electrode line 15 within a corresponding pixel unit 40 via a corresponding electrode 16, but the common electrode 14 is not contacted with the at least one common electrode line 15 within the corresponding pixel unit 40.In this embodiment, since short circuit issues may happen in the border area BB if the common electrode lines 15 extend to the border area BB, the common electrode lines 15 are located within the display area AA.\",\n \"Each of the TFTs 13 is located in a corresponding pixel unit 40 and is coupled to a corresponding gate line 10 and a corresponding data line 12.Each TFT 13 can include a gate 130, a gate insulation layer 132, a source 134, a drain 136, a channel layer 137 and a flat layer 138.The channel layer 137 is coupled between the source 134 and the drain 136.In at least one embodiment, the TFTs 13 can be bottom-gate TFTs.\",\n \"The gate 130 is formed on the substrate 11 and is coupled with a corresponding data line 10.The common electrodes 14 and the common electrodes lines 15 both are formed on the substrate 11 as well as the gate 130.The gate 130, the common electrodes 14, and the common electrode lines 15 are separated from each other to avoid electrical connections therebetween.\",\n \"The gate insulation layer 132 is coated on the substrate 11 and covers the gate 130 of each TFT 13, the common electrodes 14, and the common electrode 1 lines 15.The channel layer 137 is located on the gate insulation layer 132 and corresponds with the gate 130.The source 134 and the drain 135 are formed on the gate insulation layer 132 and are respectively coupled at opposite sides of the channel layer 137.The source 134 is coupled to a corresponding data line 12.The flat layer 138 is coated on the gate insulation layer 132 and covers the channel layer 137, the source 134 and the drain 136.The flat layer 138 defines a plurality of first contact holes 1380 and a plurality of second contact holes 1382 respectively corresponding with the drain 136 of each of the TFTs 13 and the common electrode lines 15.The pixel electrode 17 is coupled to the drain 136 via the first contact hole 1380.The coupling electrode 16 is coupled between a corresponding common electrode 14 and a corresponding common electrode line 15 via the second contact hole 1382.In this embodiment, as shown in FIG.\",\n \"3, a space S is defined between the corresponding common electrode 14 and the corresponding common electrode line 15, thereby separating the corresponding common electrode 14 from the corresponding common electrode line 15.Each pixel electrode 17 defines a plurality of slits 170 to corporate with the common electrode 14 within a corresponding pixel unit 40 to form a parallel electrical field.\",\n \"Thus, the display panel 1 can be an in-plane switching (IPS) mode liquid crystal display (LCD) panel.\",\n \"FIG.\",\n \"4 illustrates a flowchart of a method for manufacturing the display panel 1 of FIG.\",\n \"1 and FIG.\",\n \"2.The method is provided by way of example, as there are a variety of ways to carry out the method.\",\n \"Each block shown in FIG.\",\n \"4 represents one or more processes, methods, or subroutines which are carried out in the example method.\",\n \"Furthermore, the order of blocks is illustrative only and the order of the blocks can change.\",\n \"Additional blocks can be added or fewer blocks may be utilized without departing from the scope of this disclosure.\",\n \"The example method can begin at block 301.At block 301, a substrate 11 is provided.\",\n \"The substrate can be a transparent substrate such as glass substrate or a plastic substrate.\",\n \"In other embodiments, the substrate 11 can be a translucent substrate, a non-transparent substrate or a flexible substrate.\",\n \"At block 302, as shown in FIG.\",\n \"5, a metal layer 22 is formed on the substrate 11 and a first photoresist layer 25 is formed on the metal layer 22 At block 303, referring to FIG.\",\n \"6 and FIG.\",\n \"7, the first photoresist layer 25 is patterned by an exposure and development process using a photomask 23 to form a plurality of photoresist patterns 250 on the metal layer 22.The photomask 23 can be made of metal materials.\",\n \"At block 304, as shown FIG.\",\n \"8, the metal layer 22 is etched to form a plurality of gates 130 and a plurality of common electrode lines 15 on the substrate 11 which are covered the photoresist patterns 250.In this embodiment, only one gate 130 and one common electrode line 15 are shown in FIG.\",\n \"8.Each gate 130 and each electrode line 15 are covered by the photoresist patterns 250.In at least one embodiment, the metal layer 22 can be etched by an over etching process.\",\n \"Thus, an area of the gate 130 is less than an area of a corresponding photoresist pattern 250 which covers the gate 130.For example, as shown in FIG.\",\n \"8, a distance β is defined between an edge the gate 130 and a corresponding edge of the photoresist pattern 250 which covers the gate 130.Accordingly, an area of the common electrode line 15 is less than that of a corresponding photoresist pattern 250 which covers the common electrode line 15.At block 305, as shown in FIG.\",\n \"9, a layer of conductive materials 140 is coated on the substrate 11 and the photoresist patterns 250.In this embodiment, the layer of conductive materials 140 is coated on surfaces of the photoresist patterns 250 away from the substrate and is coated on a portion of a surface of the substrate 11 which is not covered by the photoresist patterns 250.The conductive materials 140 can be transparent conductive materials, such as transparent conductive films made of indium tin oxide (ITO).\",\n \"The conductive materials 140 serve as common electrodes 14 of the display panel 1.Since a distance β is defined between an edge of the gate 130 and a corresponding edge of the photoresist pattern 250 which covers the gate 130, the conductive materials 140 will not contact with the gates 130.Further, since the area of the common electrode line 15 is less than that of a corresponding photoresist pattern 250 covering the common electrode line 15, the conductive materials 140 will not contact with the gates 130.At block 306, as shown in FIG.\",\n \"10, the photoresist patterns 250 and a portion of the conductive materials 140 on the photoresist pattern 250 are removed from the substrate 11.Thus, the other portion of the conductive materials 140 maintained on the substrate 11 form the common electrodes 14.At block 307, as shown in FIG.\",\n \"11, a second photoresist layer 35 is formed on the substrate 11 and covers the gates 130, the common electrodes 14, and the common electrode lines 15.At block 308, as shown in FIG.\",\n \"12, a portion of the second photoresist layer 35 corresponding with the border area BB is removed.\",\n \"In at least one embodiment, an exposure process is first performed to expose the second photoresist layer 35 from a side of the substrate 11 away from the second photoresist layer 35 using an ultraviolet photomask 26, and then a development process is utilized to remove the portion of the second photoresist layer 35 corresponding with the border area BB.\",\n \"At block 309, as shown in FIG.\",\n \"13, a portion of the conductive materials 140 corresponding with the border area BB is removed by an etching process.\",\n \"Then, the other portion of the second photoresist layer 35 coated on the substrate 11 corresponding with the display area AA is removed to expose the common electrodes 14 in the display area AA.\",\n \"At block 310, a gate insulation layer 132 is formed on the substrate 11 to cover the gates 130, the common electrodes 14, and the common electrode lines 15.At block 311, a plurality of channel layers 137 are formed on the gate insulation layer 132 corresponding with the gates 130.At block 312, a plurality of sources 134 and drains 136 of the TFTs 13 are respectively formed on the gate insulation layer 132.The source 134 and the drain 136 are respectively coupled at opposite sides of a corresponding channel layer 137.At block 313, a flat layer 138 is formed on the gate insulation layer 132 to cover the channel layers 137, the sources 134, and the drains 136.At block 314, a plurality of first contact holes 1380 corresponding with the drains 136 and a plurality of second contact holes 1382 corresponding with the common electrode lines 15 and the common electrodes 14 are formed on the flat layer 138.At block 315, a plurality of pixel electrodes 17 and a plurality of coupling electrodes 16 are formed on the flat layer 138.Each pixel electrode 17 is electrically coupled with a corresponding drain via a corresponding first contact hole 1380.Each coupling electrode 16 is coupled with a corresponding common electrode 14 and a corresponding common electrode line 15 via a corresponding second contact hole 1382, thereby making an electrical connection between the corresponding common electrode 14 and the corresponding common electrode line 15.As described above, the gates 130 and the common electrodes 14 can be formed in a same exposure process using the photomask 22.Therefore, the cost for manufacturing the display panel 1 in the above mentioned method can be decreased compared with a traditional manufacturing method of the display panel 1.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870886"}}},{"rowIdx":4493669,"cells":{"text":{"kind":"list like","value":[["BATTERY CELL HOUSING AND METHOD FOR PRODUCTION OF SAME","A battery cell housing which delimits an interior chamber for receiving a core material providing electrical energy.","The battery cell housing consists of a housing shell and a housing cover.","The housing shell has a floor and a housing shell wall extending coaxially to a housing axis, proceeding from the floor.","The housing cover has a pot or bowl-shaped form.","The housing cover is inserted into the housing shell wall at a distance from the floor after the core material has been introduced.","The housing shell wall is mechanically connected to the housing cover by a folded joint, preferably a double folded joint.","There is no integrally joined connection according to the invention.","The folded joint is implemented radially inward toward the housing axis and is located closer to the housing axis than the outer surface of the housing shell wall, when viewed radially to the housing axis."],["1.A battery cell housing (15) comprising: an interior chamber (18) for the accommodation of a core material (19) that provides electrical energy, a housing shell (16) that has a floor (20) and a housing shell wall (21) enclosing a housing axis (G), said housing shell wall having a hollow cylindrical circumferential section (22) extending in axial direction (A) away from the floor (20) and having a connecting section (23) adjoining the circumferential section (22) on the axial side opposite the floor (20), said connecting section (23) delimiting a housing opening (24), a housing cover (17) that has a cover part (29) extending obliquely or at a right angle relative to the axial direction (A) and has an edge part (30) adjoining the cover part (29) and surrounding the housing axis (G), wherein the outside dimension of the edge part (30) corresponds at most to the inside dimension of the connecting section (23) of the housing shell wall (21), wherein the cover part (29) of the housing cover (17) is surrounded by the circumferential section (22) of the housing shell wall (21), and the edge part (30) is connected to the connecting section (23) of the housing shell wall (21) by a folded joint (31) that is flanged inward toward the housing axis (G), so that the housing opening (24) is closed.","2.The battery cell housing of claim 1, characterized in that the folded joint (31) is arranged completely inside a region delimited by a curved surface of a hollow cylinder (M), wherein the outside surface of the circumferential section (22) extends along the curved surface of the hollow cylinder (M).","3.The battery cell housing of claim 2, characterized in that the housing shell (16), as well as the housing cover (17), are arranged completely within a region delimited by the curved surface of the hollow cylinder (M), wherein the outside surface of the circumferential section (22) extends along the curved surface of the hollow cylinder (M).","4.The battery cell housing of claim 1, characterized in that the inside dimension and/or the outside dimension of the circumferential section (22) of the housing shell wall (21) is constant.","5.The battery cell housing of the claim 1, characterized in that at least one support projection (34) for the housing cover (17) is provided on the inside surface of the housing shell wall (21) or the circumferential section (22), facing the interior chamber (18).","6.The battery cell housing of claim 1, characterized in that the folded joint (31) is configured as a double folded joint.","7.The battery cell housing of claim 1, characterized in that the housing cover (17) and/or the housing shell (16) is made in one piece without seams or joints respectively.","8.The battery cell housing of claim 1, characterized in that the edge part (30) of the housing cover (17) has a first cover fold section (45) and a second cover fold section (46) which are arranged coaxially relative to each other.","9.The battery cell housing of claim 1, characterized in that the connecting section (23) of the housing shell wall (21) has a first shell fold section (47) and a second shell fold section (48) which are arranged coaxially relative to each other.","10.The battery cell housing of claim 9, characterized in that the edge part (30) of the housing cover (17) has a first cover fold section (45) and a second cover fold section (46) which are arranged coaxially relative to each other and that the first shell fold section (47) is arranged between the first cover fold section (45) and the second cover fold section (46).","11.The battery cell housing of claim 9, characterized in that the edge part (30) of the housing cover (17) has a first cover fold section (45) and a second cover fold section (46) which are arranged coaxially relative to each other and that the second cover fold section (46) is arranged between the first shell fold section (47) and the circumferential section (22) of the housing shell wall (21).","12.The battery cell housing of claim 9, characterized in that the edge part (30) of the housing cover (17) has a first cover fold section (45) and a second cover fold section (46) which are arranged coaxially relative to each other and that the first cover fold section (45) is arranged between the first shell fold section (47) and the second shell fold section (48).","13.A method for the production of a battery cell housing (15) having an interior chamber (18) for the accommodation of a core material (19) providing electrical energy, said method comprising the following steps: providing a housing shell (16) that has a floor (20) and a housing shell wall (21) surrounding a housing axis (G), said housing shell wall having a hollow cylindrical circumferential section (22) extending in axial direction (A) away from the floor (20) and having a connecting section (23) adjoining the circumferential section (22) on the axial side opposite the floor (20), said connecting section (23) delimiting a housing opening (24), providing a housing cover (16) that has a cover part (29) extending obliquely or at a right angle relative to the axial direction (A) and has an edge part (30) adjoining the cover part (29) and surrounding the housing axis (G), wherein the outside dimension of the edge part (30) corresponds at most to the inside dimension of the connecting section (23) of the housing shell wall (21), inserting the housing cover (17) into the housing shell wall (21), so that the connecting section (23) surrounds the edge part (30), implementing a folded joint between the connecting section (23) and the edge part (30), wherein the connecting section (23) and the edge part (30) are flanged inward toward the housing axis (G)."],[" BACKGROUND OF THE INVENTION The invention relates to a battery cell housing for the accommodation of a core material that provides electrical energy.","Furthermore, the invention relates to a method for the production of the battery cell housing.","The battery cell housing comprises a housing shell and a housing cover connected to the housing shell.","With the connection established, the housing shell and the housing cover enclose an interior chamber, in which the core material is located.","The housing cover and the housing shell are connected to each other in a suitable manner.","Frequently, the housing cover is connected in a substance-to-substance bonded manner to the housing shell.","Furthermore known have been battery cell housings wherein the housing cover is connected to a circumferential wall via a folded joint.","Such a battery cell housing has been known from publication DE 10 2010 030 993 A1.In this case, it is disadvantageous that the fold projects beyond the outside dimensions of the circumferential wall adjoining the fold and thus enlarges the space taken up by the battery cell housing in this installation region.","If several battery cell housings are arranged next to each other, the circumferential walls cannot be in contact with each other due to the fold, and/or they cannot be randomly arranged next to each other but display—depending on the size of the fold—a minimum distance from each other.","Publication DE 699 28 674 T2 suggests that a folded joint be provided between the housing cover and the housing shell in a region in which the circumferential wall is drawn inward and the interior chamber in the region of the housing opening is tapered.","The folded joint implemented toward the outside is arranged in the region displaying the radially smallest dimension and thus does not project beyond the clearance zone of the battery cell housing.","However, it has been found that the conical constriction must occur before the introduction of the core material in the battery cell housing.","Otherwise dirt particles may enter the interior chamber and impair the electrical or electronic function of the core material.","The introduction of the core material following the constriction is also disadvantageous.","In a housing shell with a housing wall that tapers or constricts toward the housing opening, a cylindrically contoured core material of a solid substance will potentially no longer fill the entire interior chamber, so that the energy density of the battery cell is reduced.","This known battery cell housing is thus especially suitable for at least partially liquid or gelatinous core materials.","Publication DE 601 05 076 T2 suggests a battery cell housing, wherein a positive-locking connection is established between a circumferential wall of a housing shell and a housing cover in that a connecting section of the housing shell wall is constricted inward toward the housing axis.","The housing cover is axially enclosed between the constriction and an axial end section that is molded inward.","The radial constriction is as disadvantageous as the constriction described hereinabove.","Considering this prior art, the object to be achieved by the present invention may be viewed to be the provision of a battery cell housing that maximizes the available interior space for the core material and, at the same time, ensures a small design and a simple production."],[" SUMMARY OF THE INVENTION This object is achieved by a battery cell housing and by a method for the production of the battery cell housing displaying the features of the claims.","The invention relates to a battery cell housing 15 which delimits an interior chamber 18 for receiving a core material 19 providing electrical energy.","The battery cell housing 15 consists of a housing shell 16 and a housing cover 17 .","The housing shell 16 has a floor 20 and a housing shell wall 21 extending coaxially to a housing axis G, proceeding from the floor.","The housing cover 17 has a pot or bowl-shaped form.","The housing cover is inserted into the housing shell wall 21 at a distance from the floor 20 after the core material 19 has been introduced.","The housing shell wall 21 is mechanically connected to the housing cover 17 by a folded joint 31 , preferably a double folded joint.","There is no integrally joined connection according to the invention.","The folded joint 31 is implemented radially inward toward the housing axis G and is located closer to the housing axis G than the outer surface of the housing shell wall 21 , when viewed radially to the housing axis G. The battery cell housing comprises an interior chamber for the accommodation of a core material that provides electrical energy.","The core material may consist of a solid substance, a gel or a fluid.","The battery cell housing according to the invention is also particularly suitable for a wound element of a solid core material that is also referred to as a “jelly roll” or a “Swiss roll”.","The battery cell housing comprises a housing shell and a housing cover connected to the housing shell by means of a folded joint.","Preferably, the battery cell housing consists of only these two parts.","The housing shell has a floor and a housing shell wall adjoining the floor, said housing shell wall enclosing a housing axis.","The housing shell wall has a hollow cylindrical circumferential section that adjoins the floor and extends in axial direction away from the floor.","On the axial side opposite the floor, a connecting section of the housing shell wall adjoins the hollow cylindrical circumferential section.","The connecting section delimits a housing opening.","Prior to connecting the housing shell to the housing cover, the connecting section is also hollow cylindrical and has the same inside diameter and/or outside diameter as the circumferential section.","Before being connected to the housing cover, the circumferential section and the connecting section have a cross-section in the form of a circular cylinder.","Also, other cylindrical cross-sectional forms can be used such as polygonal or arcuate cross-sections, or cross-sections that are linear and curved in different parts can be used alternatively.","In a preferred embodiment the housing shell wall comprises at least one pair of opposing parallel plane wall sections that are connected via wall sections that are curved, at least in some parts, in order to form the housing shell wall.","Each wall section that is curved at least in some sections may have a constant radius of curvature in the curved regions.","Each wall section that is curved in at least in some parts—viewed in cross-section—may have the form of a circular arc, for example have the contour of a semi-circle.","At least each wall section that is curved in at least some parts may, alternatively, also have several regions of curvature.","The radius of curvature of each region of a wall section that is curved in at least in some parts and adjoins a plane wall section, amounts to preferably 4 times the thickness of the circumferential section of the housing shell wall.","The radius of curvature of each region of a wall section that is curved in at least in some parts and adjoins a plane wall section, is preferably half as great as half the distance between opposite plane wall sections.","The housing cover has a cover part extending obliquely or, preferably, at a right angle, relative to the axial direction.","Adjoining the cover part, there is an edge part.","The edge part encloses the housing axis in the form of a ring.","The edge part may consist of several sections and, for example, comprise a hollow cylindrical lateral section that is connected to the cover part.","On the axial side opposite the cover part, the lateral section may have a flange section that extends obliquely or at a right angle relative to the axial direction, inward toward the housing axis.","The outside dimension of the edge part is at most as great as the inside dimension of the connecting section, so that the housing cover can be inserted in the connecting section of the housing shell wall and can be connected to the connecting section by creating a folded joint.","With the connection established, the cover part of the housing cover is arranged in such a manner that it is enclosed by the hollow cylindrical circumferential section.","Between the floor of the housing shell and the cover part, the interior chamber is cylindrical and preferably has a constant interior cross-sectional area and, in accordance with the example, a constant inside diameter.","The folded joint is produced between the connecting section and the edge part by folding the connecting section, as well as well as edge part, inward toward the housing axis.","Preferably, the folded joint is a double folded joint.","Consequently, the folded joint—viewed from the circumferential section—is located farther inside relative to the housing axis, above the cover part of the housing cover.","Before implementing the folded joint, the maximum possible opening cross-section of the housing opening is available.","Therefore, it is also possible to introduce solid core material into the interior chamber, said core material maximally filling the interior chamber at a right angle relative to the axial direction or the housing axis and thus making possible a high energy density of the battery cell.","Furthermore, the folded joint does not project beyond the cylindrical clearance zone of the battery cell housing, so that several battery cell housings can be arranged very tightly next to each other and, if necessary, in contact with each other, in the installation space of a battery.","The housing shell and the housing cover are electrically isolated at least relative to the interior chamber.","To accomplish this, they may be provided with a coating.","The housing shell and the housing cover may also be coated toward the outside or be electrically isolated.","For example, the housing shell and the housing cover can be made of a sheet metal material by shaping, said material having, on one or on both sheet sides, an electrically isolating coating.","This isolation may also be accomplished by applying a coating after the housing shell or the housing cover have been produced.","It is preferred if the folded joint is arranged completely within a region delimited by the curved surface of a hollow cylinder.","The curved surface of the hollow cylinder is a surface into which extends the outside surface of the circumferential section and which encloses the entire battery cell housing in axial direction.","Preferably, the housing shell, as well as the housing cover, is located completely within the region delimited by the curved surface of the hollow cylinder.","The battery cell housing and the housing shell, respectively, and the housing cover are preferably made of a metal or a metal alloy that may contain steel or aluminum, for example.","The housing shell may be produced from a blank by means of a deforming process, for example by impact extrusion or ironing.","The battery cell housing can be used for any type of electrical energy storage such as, for example, a disposable battery, a rechargeable battery, a capacitor, etc.","In one embodiment, the inside dimensions and/or the outside dimension of the circumferential section of the shell housing wall is constant.","Viewed in cross-section, the inside contour and the outside contour of the circumferential preferably have the form of a circle.","It is also possible to provide at least one support projection for the housing cover at a location of the circumferential section of the shell housing wall in order to specify the position of housing cover within the housing shell wall, before the folded joint is made.","The at least one support projection may be produced, for example, by changing the thickness of the housing shell wall.","The at least one support projection can also be produced by local shaping of the circumferential section.","The at least one support projection may be closed in the form of a ring in circumferential direction around the housing axis, or several support projections—at least three—may be provided at a distance from each other in circumferential direction.","The housing cover and/or the housing shell may be made in one piece or integrally, without seams and joints.","It is advantageous if the edge part of the housing cover has a first cover fold section and a second cover fold section that—with the connection with the connecting section established—are arranged coaxially relative to each other.","The connecting section of the housing shell wall may have a first shell fold section and a second shell fold section that—with the connection with the housing cover established—are arranged coaxially relative to each other.","In doing so, it is advantageous if the first shell fold section is arranged between the first cover fold section and the second cover fold section and preferably abuts directly against the two cover fold sections.","Preferably, the second cover fold section may be arranged between the first shell fold section and the circumferential section of the housing shell wall and preferably abuts directly against the shell fold section and the circumferential section.","Furthermore, the first cover fold section may be located between the first shell fold section and the second shell fold section and preferably abuts directly against the two shell fold sections.","Due to the one or more embodiments of the folded joint, it is possible to achieve a tight connection between the housing cover and the housing shell, said connection being produced in a simple manner.","The exemplary embodiment provides that the thicknesses of the starting sheet metal, of which the housing shell and the housing cover are made, are the same.","In order to create the connection of the housing shell described hereinabove and the housing cover described hereinabove, it is possible to proceed as follows: In unshaped condition, the circumferential section, as well as the connecting section, each have the form of a hollow cylinder—preferably with the same outside dimensions.","The inside dimension of the connecting section is at least as great as the inside dimension of the circumferential section.","Consequently, the maximum cross-section is available for the insertion of the core material on the housing opening.","Upon introducing the core material into the housing shell, the interior chamber is closed in that the housing shell is connected to the housing cover by producing the folded joint.","In order to produce the folded joint, the housing cover is inserted along the housing axis into the housing shell, so that the housing shell wall encloses the housing cover in circumferential direction.","In this position, the connecting section of the housing shell wall is located, at least partially in axial direction, above the housing shell cover.","The folded joint is produced with the aid of a folding device using one or more tools.","The connecting section and at least one flange section of the edge part are folded over or flanged inward toward the housing axis, as a result of which an interlocking connection is formed.","The connecting section and the edge section may be pressed or squeezed together at a right angle relative to the housing axis in order to improve the folded joint."],["CROSS-REFERENCE TO RELATED APPLICATIONS This is a continuation-in-part application of pending international application PCT/EP2016/065816 filed Jul.","5, 2016, and claiming the priority of German application No.","102015111572.7 filed Jul.","16, 2015.The said International application PCT/EP2016/065816 and German application No.","102015111572.7 are both incorporated herein by reference in their entireties as though fully set forth.","BACKGROUND OF THE INVENTION The invention relates to a battery cell housing for the accommodation of a core material that provides electrical energy.","Furthermore, the invention relates to a method for the production of the battery cell housing.","The battery cell housing comprises a housing shell and a housing cover connected to the housing shell.","With the connection established, the housing shell and the housing cover enclose an interior chamber, in which the core material is located.","The housing cover and the housing shell are connected to each other in a suitable manner.","Frequently, the housing cover is connected in a substance-to-substance bonded manner to the housing shell.","Furthermore known have been battery cell housings wherein the housing cover is connected to a circumferential wall via a folded joint.","Such a battery cell housing has been known from publication DE 10 2010 030 993 A1.In this case, it is disadvantageous that the fold projects beyond the outside dimensions of the circumferential wall adjoining the fold and thus enlarges the space taken up by the battery cell housing in this installation region.","If several battery cell housings are arranged next to each other, the circumferential walls cannot be in contact with each other due to the fold, and/or they cannot be randomly arranged next to each other but display—depending on the size of the fold—a minimum distance from each other.","Publication DE 699 28 674 T2 suggests that a folded joint be provided between the housing cover and the housing shell in a region in which the circumferential wall is drawn inward and the interior chamber in the region of the housing opening is tapered.","The folded joint implemented toward the outside is arranged in the region displaying the radially smallest dimension and thus does not project beyond the clearance zone of the battery cell housing.","However, it has been found that the conical constriction must occur before the introduction of the core material in the battery cell housing.","Otherwise dirt particles may enter the interior chamber and impair the electrical or electronic function of the core material.","The introduction of the core material following the constriction is also disadvantageous.","In a housing shell with a housing wall that tapers or constricts toward the housing opening, a cylindrically contoured core material of a solid substance will potentially no longer fill the entire interior chamber, so that the energy density of the battery cell is reduced.","This known battery cell housing is thus especially suitable for at least partially liquid or gelatinous core materials.","Publication DE 601 05 076 T2 suggests a battery cell housing, wherein a positive-locking connection is established between a circumferential wall of a housing shell and a housing cover in that a connecting section of the housing shell wall is constricted inward toward the housing axis.","The housing cover is axially enclosed between the constriction and an axial end section that is molded inward.","The radial constriction is as disadvantageous as the constriction described hereinabove.","Considering this prior art, the object to be achieved by the present invention may be viewed to be the provision of a battery cell housing that maximizes the available interior space for the core material and, at the same time, ensures a small design and a simple production.","SUMMARY OF THE INVENTION This object is achieved by a battery cell housing and by a method for the production of the battery cell housing displaying the features of the claims.","The invention relates to a battery cell housing 15 which delimits an interior chamber 18 for receiving a core material 19 providing electrical energy.","The battery cell housing 15 consists of a housing shell 16 and a housing cover 17.The housing shell 16 has a floor 20 and a housing shell wall 21 extending coaxially to a housing axis G, proceeding from the floor.","The housing cover 17 has a pot or bowl-shaped form.","The housing cover is inserted into the housing shell wall 21 at a distance from the floor 20 after the core material 19 has been introduced.","The housing shell wall 21 is mechanically connected to the housing cover 17 by a folded joint 31, preferably a double folded joint.","There is no integrally joined connection according to the invention.","The folded joint 31 is implemented radially inward toward the housing axis G and is located closer to the housing axis G than the outer surface of the housing shell wall 21, when viewed radially to the housing axis G. The battery cell housing comprises an interior chamber for the accommodation of a core material that provides electrical energy.","The core material may consist of a solid substance, a gel or a fluid.","The battery cell housing according to the invention is also particularly suitable for a wound element of a solid core material that is also referred to as a “jelly roll” or a “Swiss roll”.","The battery cell housing comprises a housing shell and a housing cover connected to the housing shell by means of a folded joint.","Preferably, the battery cell housing consists of only these two parts.","The housing shell has a floor and a housing shell wall adjoining the floor, said housing shell wall enclosing a housing axis.","The housing shell wall has a hollow cylindrical circumferential section that adjoins the floor and extends in axial direction away from the floor.","On the axial side opposite the floor, a connecting section of the housing shell wall adjoins the hollow cylindrical circumferential section.","The connecting section delimits a housing opening.","Prior to connecting the housing shell to the housing cover, the connecting section is also hollow cylindrical and has the same inside diameter and/or outside diameter as the circumferential section.","Before being connected to the housing cover, the circumferential section and the connecting section have a cross-section in the form of a circular cylinder.","Also, other cylindrical cross-sectional forms can be used such as polygonal or arcuate cross-sections, or cross-sections that are linear and curved in different parts can be used alternatively.","In a preferred embodiment the housing shell wall comprises at least one pair of opposing parallel plane wall sections that are connected via wall sections that are curved, at least in some parts, in order to form the housing shell wall.","Each wall section that is curved at least in some sections may have a constant radius of curvature in the curved regions.","Each wall section that is curved in at least in some parts—viewed in cross-section—may have the form of a circular arc, for example have the contour of a semi-circle.","At least each wall section that is curved in at least some parts may, alternatively, also have several regions of curvature.","The radius of curvature of each region of a wall section that is curved in at least in some parts and adjoins a plane wall section, amounts to preferably 4 times the thickness of the circumferential section of the housing shell wall.","The radius of curvature of each region of a wall section that is curved in at least in some parts and adjoins a plane wall section, is preferably half as great as half the distance between opposite plane wall sections.","The housing cover has a cover part extending obliquely or, preferably, at a right angle, relative to the axial direction.","Adjoining the cover part, there is an edge part.","The edge part encloses the housing axis in the form of a ring.","The edge part may consist of several sections and, for example, comprise a hollow cylindrical lateral section that is connected to the cover part.","On the axial side opposite the cover part, the lateral section may have a flange section that extends obliquely or at a right angle relative to the axial direction, inward toward the housing axis.","The outside dimension of the edge part is at most as great as the inside dimension of the connecting section, so that the housing cover can be inserted in the connecting section of the housing shell wall and can be connected to the connecting section by creating a folded joint.","With the connection established, the cover part of the housing cover is arranged in such a manner that it is enclosed by the hollow cylindrical circumferential section.","Between the floor of the housing shell and the cover part, the interior chamber is cylindrical and preferably has a constant interior cross-sectional area and, in accordance with the example, a constant inside diameter.","The folded joint is produced between the connecting section and the edge part by folding the connecting section, as well as well as edge part, inward toward the housing axis.","Preferably, the folded joint is a double folded joint.","Consequently, the folded joint—viewed from the circumferential section—is located farther inside relative to the housing axis, above the cover part of the housing cover.","Before implementing the folded joint, the maximum possible opening cross-section of the housing opening is available.","Therefore, it is also possible to introduce solid core material into the interior chamber, said core material maximally filling the interior chamber at a right angle relative to the axial direction or the housing axis and thus making possible a high energy density of the battery cell.","Furthermore, the folded joint does not project beyond the cylindrical clearance zone of the battery cell housing, so that several battery cell housings can be arranged very tightly next to each other and, if necessary, in contact with each other, in the installation space of a battery.","The housing shell and the housing cover are electrically isolated at least relative to the interior chamber.","To accomplish this, they may be provided with a coating.","The housing shell and the housing cover may also be coated toward the outside or be electrically isolated.","For example, the housing shell and the housing cover can be made of a sheet metal material by shaping, said material having, on one or on both sheet sides, an electrically isolating coating.","This isolation may also be accomplished by applying a coating after the housing shell or the housing cover have been produced.","It is preferred if the folded joint is arranged completely within a region delimited by the curved surface of a hollow cylinder.","The curved surface of the hollow cylinder is a surface into which extends the outside surface of the circumferential section and which encloses the entire battery cell housing in axial direction.","Preferably, the housing shell, as well as the housing cover, is located completely within the region delimited by the curved surface of the hollow cylinder.","The battery cell housing and the housing shell, respectively, and the housing cover are preferably made of a metal or a metal alloy that may contain steel or aluminum, for example.","The housing shell may be produced from a blank by means of a deforming process, for example by impact extrusion or ironing.","The battery cell housing can be used for any type of electrical energy storage such as, for example, a disposable battery, a rechargeable battery, a capacitor, etc.","In one embodiment, the inside dimensions and/or the outside dimension of the circumferential section of the shell housing wall is constant.","Viewed in cross-section, the inside contour and the outside contour of the circumferential preferably have the form of a circle.","It is also possible to provide at least one support projection for the housing cover at a location of the circumferential section of the shell housing wall in order to specify the position of housing cover within the housing shell wall, before the folded joint is made.","The at least one support projection may be produced, for example, by changing the thickness of the housing shell wall.","The at least one support projection can also be produced by local shaping of the circumferential section.","The at least one support projection may be closed in the form of a ring in circumferential direction around the housing axis, or several support projections—at least three—may be provided at a distance from each other in circumferential direction.","The housing cover and/or the housing shell may be made in one piece or integrally, without seams and joints.","It is advantageous if the edge part of the housing cover has a first cover fold section and a second cover fold section that—with the connection with the connecting section established—are arranged coaxially relative to each other.","The connecting section of the housing shell wall may have a first shell fold section and a second shell fold section that—with the connection with the housing cover established—are arranged coaxially relative to each other.","In doing so, it is advantageous if the first shell fold section is arranged between the first cover fold section and the second cover fold section and preferably abuts directly against the two cover fold sections.","Preferably, the second cover fold section may be arranged between the first shell fold section and the circumferential section of the housing shell wall and preferably abuts directly against the shell fold section and the circumferential section.","Furthermore, the first cover fold section may be located between the first shell fold section and the second shell fold section and preferably abuts directly against the two shell fold sections.","Due to the one or more embodiments of the folded joint, it is possible to achieve a tight connection between the housing cover and the housing shell, said connection being produced in a simple manner.","The exemplary embodiment provides that the thicknesses of the starting sheet metal, of which the housing shell and the housing cover are made, are the same.","In order to create the connection of the housing shell described hereinabove and the housing cover described hereinabove, it is possible to proceed as follows: In unshaped condition, the circumferential section, as well as the connecting section, each have the form of a hollow cylinder—preferably with the same outside dimensions.","The inside dimension of the connecting section is at least as great as the inside dimension of the circumferential section.","Consequently, the maximum cross-section is available for the insertion of the core material on the housing opening.","Upon introducing the core material into the housing shell, the interior chamber is closed in that the housing shell is connected to the housing cover by producing the folded joint.","In order to produce the folded joint, the housing cover is inserted along the housing axis into the housing shell, so that the housing shell wall encloses the housing cover in circumferential direction.","In this position, the connecting section of the housing shell wall is located, at least partially in axial direction, above the housing shell cover.","The folded joint is produced with the aid of a folding device using one or more tools.","The connecting section and at least one flange section of the edge part are folded over or flanged inward toward the housing axis, as a result of which an interlocking connection is formed.","The connecting section and the edge section may be pressed or squeezed together at a right angle relative to the housing axis in order to improve the folded joint.","BRIEF DESCRIPTION OF THE DRAWINGS Advantageous embodiments of the invention result from the claims, the description and the drawings.","Hereinafter, preferred embodiments of the invention are explained in detail with reference to the appended drawings.","They show in: FIG.","1 a schematic perspective representation of an exemplary embodiment of a battery cell housing, FIG.","2 a representation, partially in section, of the folded joint between a housing cover and a housing shell in the case of the battery cell housing according to FIG.","1—in region II, FIG.","3 an exploded view of the battery cell housing of FIG.","1, FIG.","4 a partial view of a longitudinal section through the exemplary embodiment of the battery cell housing of FIGS.","1 to 3, prior to the implementation of the folded joint, FIG.","5a an exemplary embodiment of a battery cell housing that has been modified compared with FIG.","4, with a shell housing wall having a thickness that changes at one point, FIG.","5b an exemplary embodiment of a battery cell housing that has been modified compared with FIG.","5a, wherein a separate installation part is provided as the support for the housing cover, FIGS.","6 to 8 a schematic exemplary illustration of different stages of the production of a folded joint with the aid of a folding device, FIG.","9 a longitudinal section through an exemplary embodiment of the battery cell housing in the region of the housing cover, with the folded joint established, FIGS.","10 and 11 perspective partial representations of respectively one exemplary embodiment of the floor of the battery cell housing, FIG.","12 a schematic plan view onto the housing cover parallel to the housing axes, of several of the battery cell housings, and FIGS.","13 to 15 schematic illustrations of cross-sections through a housing shell.","DETAILED DESCRIPTION OF THE INVENTION FIGS.","1 and 3 show an exemplary embodiment of a cylindrical battery cell housing 15 that, in accordance with the example, has the form of a circular cylinder.","The battery cell housing 15 comprises a housing shell 16 and a housing cover 17.In the exemplary embodiment, the battery cell housing 15 consists only of these two parts 16, 17.The battery cell housing 15 delimits an interior chamber 18 that is disposed and provided for the accommodation of core material and, preferably, a solid core material 19.The solid core material 19 may be, for example a wound body that is also referred to as a “jelly roll” or a “Swiss roll”.","As illustrated by FIG.","3, the solid core material 19 has a cylindrical contour and, in accordance with the example, the contour of a circular cylinder.","The inside diameter of the interior chamber 18 corresponds to the outside diameter of the solid core material 19, apart from a necessary clearance.","The housing shell 16 has a floor 20, as well as a housing shell wall 21 surrounding a housing axis G. The housing axis G extends in an axial direction A.","The direction radial to the housing axis G is referred to as the radial direction R. The housing shell wall 21 adjoins the floor 20 and completely surrounds the floor 20 in circumferential direction around the housing axis G. The housing shell wall 21 has—adjoining the floor 20—a circumferential section having the contour of a hollow cylinder.","The inside diameter of the circumferential section 22 specifies the inside diameter of the interior chamber 18.On the axial side, opposite the floor 20, the circumferential section 22 transitions into a connecting section 23.The connecting section 23—in not deformed initial condition of the housing shell 16 (FIG.","3)—also has the form of a hollow cylinder and, in one exemplary embodiment, can have the same inside diameter and the same outside diameter as the circumferential section 22.The connecting section 23 delimits a housing opening 24 through which the core material 19 can be introduced into the housing shell 16.In the exemplary embodiment, the cross-section of the housing opening 24 is circular and, in not deformed condition of the housing shell 16, corresponds to the inside diameter of the connecting section 23 and, in accordance with the example, also to the inside diameter of the circumferential section 22, as well as of the interior chamber 18.Consequently, the complete inner chamber cross-section is available for the introduction of the core material 19.FIGS.","13 to 15 show, as examples, different cylindrical forms of the housing shell 16, in cross-section through the circumferential section 22.As already explained, the housing shell may have the cross-section of a circular cylinder (FIG.","13), Alternatively thereto, it is also possible to design a housing shell 16 with a polygonal cross-section.","A hexagon is shown only as an example in FIG.","14.The number of corners may be varied.","The polygonal cross-section may be regular or irregular.","A cylindrical form of the housing shell with an oval or “race-track-shaped” cross-section is schematically shown by FIG.","15.The housing shell wall 21 and the circumferential section 22, respectively, have oppositely located parallel plane wall sections 22a.","The two plane wall sections 22a are at a distance from each other.","They are connected to each other by several—two according to the example—curved wall sections 22b.","In the exemplary embodiment, each curved wall section 22b has a constant radius of curvature.","Viewed in cross-section, each curved wall section 22b has the form of a semi-circle.","Alternatively thereto, it is also possible that each plane wall section 22a is adjoined on both sides by a curved wall section 22b each, the latter having the same radius of curvature and being connected to each other via a transition wall section.","For example, the transition wall section may be plane or have another configuration.","The radius of curvature of the at least partially curved wall sections 22b corresponds at most to half the distance between the two plane wall sections 22a and may also be smaller if the curved regions are connected to each other by another region.","In the exemplary embodiment, the radius of curvature is at least four times as large as the wall thickness of the circumferential section 22.Preferably, the connecting section 23—in its not deformed condition before the connection with the housing cover 17 is produced—has the same cross-section as that of the circumferential section 22 of the housing shell wall 21, as illustrated by FIGS.","13 to 15.With reference to FIGS.","3 and 4, the housing cover 17 has a cover part 29 that extends in radial direction R in the exemplary embodiment.","The cover part 29 could also extend, at least in some parts, in a manner oblique to the housing axis G. An edge part 30 adjoins the cover part 29.The edge part 30 is disposed to form a folded joint 31 with the connecting section 23 of the housing shell wall 21 (FIGS.","2 and 9).","FIG.","4 shows the housing cover 17 in its non-deformed initial condition.","In its non-deformed initial condition, the housing cover 17 has the form resembling that of a pot or bowl.","In this initial condition, the edge part 30 is formed by a lateral section 32 and a flange section 33.The lateral section 32 extends coaxially with respect to the housing axis G and forms a hollow cylindrical part of the housing cover 17, as long as said cover is still not deformed.","The flange section 33 has the form of a ring that surrounds the housing axis G. In the exemplary embodiment, the flange section 33 extends in a radial plane.","It could also have a conical form and be oriented inclined with respect to the housing axis G. Preferably, when the folded joint 31 is being implemented, the flange section 33 is reshaped together with the connecting section 23.The lateral section 32 can remain at least substantially non-deformed.","For the production of the battery cell, the core material 19 is introduced into the housing shell 16 and arranged there in the interior chamber 18.Subsequently, the housing cover 17 is arranged above the core material 19 inside the housing shell wall 21.Initially, the housing cover 17 is in its starting condition described hereinabove.","In order to arrange the housing cover 17 in a defined position, there may be at least one support projection 34 that extends away from the housing shell wall 21 and, in particular, from the circumferential section 22, in radial direction R toward the housing axis G. For example, it is sufficient to provide—in circumferential direction distributed around the housing axis G—several and, as in the example, three support projections 34.For example, they may also be produced following the introduction of the core material by pressing in the housing shell wall 21 due to a deforming force F. Inasmuch as the support projections 34 are not associated with the folded joint 32, they may be very small in radial direction R and, for example, have a radial dimension that corresponds to at most 1.0 times or 1.5 times, or 2.0 times the thickness of the circumferential section 22 at this point.","For example, the support projections 34—viewed from the inside—may be concave and—viewed from the outside—convex in the circumferential section 22 of the housing shell wall 21.FIG.","4 shows, schematically, bump-shaped support projections 34 in dashed lines.","Alternatively thereto, it is also possible to increase the thickness of the housing shell wall 21 at the point where the cover part 29 of the housing cover 17 is to be located and thus form an annular support projection.","In doing so, the support projection may extend in a radial plane R or be obliquely inclined relative to the housing axis G. FIG.","5a shows, schematically, a ring-shaped, closed support projection 34 that is formed by a thickness change of the housing shell wall 21.FIG.","5b shows an exemplary embodiment, wherein the support projection 34 is formed by an insert part 35 that, preferably is made of plastic material.","For example, the insert part 35 may have the form of a hollow cylinder.","The outside diameter of the insert part 35 may essentially correspond to the inside diameter of the circumferential section 22 of the housing shell wall 21.The upper edge of the insert part 35 may extend in a plane at a right angle relative to the housing axis G or be inclined relative thereto, so that said insert part is seated on the curved surface of a cone.","The insert part 35 may be inserted before the introduction of the core material 19 into the housing shell 16 of the battery cell housing 15.As is shown by FIGS.","4 and 5a and 5b, the housing cover 17 has a maximum outside radius that—apart from a required clearance—corresponds to the inside radius of the housing wall section 21 in the region of the housing opening 24, at least up to the point where the cover part 29 of the housing shell 16 is to be arranged, i.e., for example, up to the at least one support projection 34.After arranging the housing cover 17 in the housing shell 16, the folded joint 31 is implemented between the connecting section 23 of the housing shell wall 21 and the edge part 30 and, in particular, the flange section 33.The process is illustrated in a highly simplified manner by FIGS.","6 to 8.In order to produce the folded joint 31, a folding device 38 comprising several tools is used.","FIGS.","6 and 7 show both a first tool 39 and a second tool 40.The two tools 39, 40 come into contact from opposite radial sides.","The first tool 39 is cylindrical in some sections and presses against the outside of the housing shell wall 21 in the region in which the housing cover 17 is located.","The second tool 40 extends into the pot-shaped housing cover 17.The reforming process to produce the folded joint 31 is accomplished with the tools of the folding device 38.During a first, not illustrated, step the housing shell wall 21 is angled inward in the connecting section 23, so that said wall abuts against the flange section 33 or extends over the flange section 33.The second tool 40 has a concave recess, for example a concave annular groove, into which extend the ends of the connecting section 23 and the flange section 33 associated radially with the housing axis G. In doing so, the connecting section 23 is moved or folded around the radially inner edge of the flange section 33, as it were, by means of the second tool 40.With the continued movement of the tools 39, 40, the flange section 33 is bent over at a bending location, so that its free edge initially faces in an oblique direction toward the cover part 29 (FIG.","7).","As an alternative to the above-described rolling of the connecting section 23 and the housing cover 17 and the flange section 33, respectively, it is possible to implement the interlocking intermediate step shown by FIG.","7 also by means of an upsetting process with a movement in the direction of the housing axis G. For further shaping, the second tool 40—in accordance with the example or if the second tool 40 does not have the desired form—is replaced by a third tool 41 having a concave recess or annular groove in the form that the folded joint 31 is ultimately to have, and that, for example, is slightly greater in axial direction than the concave recess of the second tool 40.The first tool 39 and the third tool 41 are pressed against each other in radial direction, so that the edge part 30 and, in particular, the flange section 33 are tightly pressed together with the connecting section 23, and the folded joint 31 is produced.","Independent of the various methods of producing the folded joint 31, the housing part 17 and the housing shell 15 are pressed together in a pressure-sealed manner.","The completed folded joint 31, for example, is schematically illustrated by FIGS.","2 and 9.In accordance with the example, the connection between the housing cover 17 and the housing shell 16 is effected only by means of the folded joint 31.A substance-to-substance connection is not provided.","Due to the reforming process during the implementation of the folded joint 31, a first cover fold section 45 has formed on the edge part 30 and a second cover fold section 46 has formed, in which case the second cover fold section 46 coaxially encloses the first cover fold section 45.The first cover fold section 45 adjoins the free edge of the reshaped flange section 33.The second cover fold section 45 is represented by a region of the lateral section 32 that adjoins the flange section 33.A first shell fold section 47, as well as a second shell fold section 48, have been formed on the connecting section 23.The first shell fold section 47 coaxially encloses the second shell fold section 48.The first shell fold section 47 is arranged between the two cover fold sections 45, 46 and is directly in contact therewith or is clamped between the two cover fold sections 45, 46.Analogously, the first cover fold section 45 is arranged between the two shell fold sections 47, 48 and is directly in contact with these or is clamped between these.","The fold sections 45, 46, 47, 48 extend coaxially relative to the housing axis G in axial direction A.","The second cover fold section 46 is coaxially surrounded by the circumferential section 22 of the housing shell wall 21 and is in direct contact therewith.","A transition section is provided between the two cover fold sections 45, 46, said transition section being curved at least in some parts.","Analogously thereto, there is a transition section between the two shell fold sections 47, 48, said transition section being curved in at least some parts.","Furthermore, the second shell fold section 48 is connected to the circumferential section 22 of the housing shell wall via a transition section that is curved at least in some parts and on which the upper edge 50 of the battery cell housing 15 is formed.","The upper edge 50 is arranged in axial direction A at a distance from the cover part 29 of the housing cover 17 (FIGS.","2 and 9).","This distance is a function of the free space x in axial direction A between the cover part 29 and the transition section from the first shell fold section 47 to the second shell fold section 47 that is required by the tools 40, 41 during the production of the folded joint (FIG.","8).","In accordance with the example, both the housing cover 17 and the housing shell 16 are produced without seams and joints.","The housing cover 17 and the housing shell 16 may consist of metal or a metal alloy that contains steel or aluminum.","The housing cover 17, as well the housing shell 16 are electrically isolated with respect to the interior chamber 18.To accomplish this, an electrically isolating coating may be provided.","This coating may already be present on the starting sheet metal from which the housing cover 17 and the housing shell 16, respectively, are produced.","The battery cell housing 15 may also be completely covered by an electrically isolating coating.","The folded joint 31 is located completely within the axial clearance zone of the battery cell housing 15.In other words: a hollow cylindrical curved surface M extending coaxially with respect to the housing axis G is defined, said curved surface completely holding the battery cell housing 15.The curved surface of the hollow cylinder M defines a cylindrical region B around the housing axis G, from which region the folded joint 31 does not project.","In accordance with the example, the entire battery cell housing 15 is located within this region B.","In doing so, the curved surface of the hollow cylinder M has a radius in radial direction R that corresponds to the outside radius of the circumferential section 22 of the housing shell wall 21.The curved surface of the hollow cylinder M and the resultant, defined region B are illustrated schematically by FIG.","9.FIGS.","10 and 11 show different embodiments of the floor 20 of the housing shell 16.As in the exemplary embodiments according to FIGS.","1 and 3, the floor 20 may have the configuration of a plate or disk and extend essentially in a radial plane (FIG.","11.).","Alternatively thereto, it is also possible for the floor 20 to be inclined at least in some parts or extend at a right angle relative to the radial direction R. For the formation of a battery pole, it may also have an essentially cylindrical recess—viewed from the interior chamber 18.Looking from the outside onto the battery cell housing 15, this results in an elevation 51, which is shown, for example, by FIG.","10.FIG.","12 shows, greatly schematized, the arrangement of several battery cell housings 15.FIG.","12 shows the battery cell housing 15—looking in axial direction A from the top onto the housing cover 17 and the cover part 29 of the housing cover 17, respectively.","The upper edge 50 formed by the folded joint 31 can also be seen.","The battery cell housings 15 can be connected—depending on the embodiment of the battery—electrically in series and/or in parallel.","This is a function of the desired battery voltage and the desired battery power, respectively.","As illustrated by FIG.","12, the battery cell housings 15 can be arranged very tightly next to each other.","As a result of the fact that the folded joint 31 does not project beyond the curved surface of the hollow cylinder M, the battery cell housings 15 have a cylindrical contour and can be arranged tightly next to each other, requiring minimal space.","The adjacent battery cell housings 15 may abut against each other.","In modification of the illustration of FIG.","12, they may also be arranged at a defined distance from each other.","The intermediate spaces between the battery cell housings 15 can be filled with a filling material 53.The filling material may be a material that is a good heat conductor, For example, a mixture of resin with particles that are good heat conductors or a powder that is a good heat conductor may be used.","The particles or the powder that is admixed to the resin may contain boron nitrite and/or copper and/or other metals and/or hydrocarbon.","Instead of the particles or powder, it is also possible to use other bodies such as, for example, rods, of the mentioned materials between the battery cell housings 15.The filling material 53 may also be used for the production of a heat sink and, for example, contain a phase-changing material (PCM) such as, for example, sodium acetate or the like.","The invention relates to a battery cell housing 15 which delimits an interior chamber 18 for receiving a core material 19 providing electrical energy.","The battery cell housing 15 consists of a housing shell 16 and a housing cover 17.The housing shell 16 has a floor 20 and a housing shell wall 21 extending coaxially to a housing axis G, proceeding from the floor.","The housing cover 17 has a pot or bowl-shaped form.","The housing cover is inserted into the housing shell wall 21 at a distance from the floor 20 after the core material 19 has been introduced.","The housing shell wall 21 is mechanically connected to the housing cover 17 by a folded joint 31, preferably a double folded joint.","There is no integrally joined connection according to the invention.","The folded joint 31 is implemented radially inward toward the housing axis G and is located closer to the housing axis G than the outer surface of the housing shell wall 21, when viewed radially to the housing axis G. LIST OF REFERENCE SIGNS 15 Battery cell housing 16 Housing shell 17 Housing cover 18 Interior chamber 19 Core material 20 Floor 21 Housing shell wall 22 Circumferential section 23 Connecting section 24 Housing opening 29 Cover part 30 Edge part 31 Folded joint 32 Lateral section 33 Flange section 34 Support projection 35 Insert part 38 Folding device 39 First tool 40 Second tool 41 Third tool 45 First cover fold section 46 Second cover fold section 47 First shell fold section 48 Second shell fold section 50 Upper edge 51 Elevation 53 Filling material A Axial direction B Region F Forming force G Housing axis M Curved surface of hollow cylinder R Radial direction x Free space"]],"string":"[\n [\n \"BATTERY CELL HOUSING AND METHOD FOR PRODUCTION OF SAME\",\n \"A battery cell housing which delimits an interior chamber for receiving a core material providing electrical energy.\",\n \"The battery cell housing consists of a housing shell and a housing cover.\",\n \"The housing shell has a floor and a housing shell wall extending coaxially to a housing axis, proceeding from the floor.\",\n \"The housing cover has a pot or bowl-shaped form.\",\n \"The housing cover is inserted into the housing shell wall at a distance from the floor after the core material has been introduced.\",\n \"The housing shell wall is mechanically connected to the housing cover by a folded joint, preferably a double folded joint.\",\n \"There is no integrally joined connection according to the invention.\",\n \"The folded joint is implemented radially inward toward the housing axis and is located closer to the housing axis than the outer surface of the housing shell wall, when viewed radially to the housing axis.\"\n ],\n [\n \"1.A battery cell housing (15) comprising: an interior chamber (18) for the accommodation of a core material (19) that provides electrical energy, a housing shell (16) that has a floor (20) and a housing shell wall (21) enclosing a housing axis (G), said housing shell wall having a hollow cylindrical circumferential section (22) extending in axial direction (A) away from the floor (20) and having a connecting section (23) adjoining the circumferential section (22) on the axial side opposite the floor (20), said connecting section (23) delimiting a housing opening (24), a housing cover (17) that has a cover part (29) extending obliquely or at a right angle relative to the axial direction (A) and has an edge part (30) adjoining the cover part (29) and surrounding the housing axis (G), wherein the outside dimension of the edge part (30) corresponds at most to the inside dimension of the connecting section (23) of the housing shell wall (21), wherein the cover part (29) of the housing cover (17) is surrounded by the circumferential section (22) of the housing shell wall (21), and the edge part (30) is connected to the connecting section (23) of the housing shell wall (21) by a folded joint (31) that is flanged inward toward the housing axis (G), so that the housing opening (24) is closed.\",\n \"2.The battery cell housing of claim 1, characterized in that the folded joint (31) is arranged completely inside a region delimited by a curved surface of a hollow cylinder (M), wherein the outside surface of the circumferential section (22) extends along the curved surface of the hollow cylinder (M).\",\n \"3.The battery cell housing of claim 2, characterized in that the housing shell (16), as well as the housing cover (17), are arranged completely within a region delimited by the curved surface of the hollow cylinder (M), wherein the outside surface of the circumferential section (22) extends along the curved surface of the hollow cylinder (M).\",\n \"4.The battery cell housing of claim 1, characterized in that the inside dimension and/or the outside dimension of the circumferential section (22) of the housing shell wall (21) is constant.\",\n \"5.The battery cell housing of the claim 1, characterized in that at least one support projection (34) for the housing cover (17) is provided on the inside surface of the housing shell wall (21) or the circumferential section (22), facing the interior chamber (18).\",\n \"6.The battery cell housing of claim 1, characterized in that the folded joint (31) is configured as a double folded joint.\",\n \"7.The battery cell housing of claim 1, characterized in that the housing cover (17) and/or the housing shell (16) is made in one piece without seams or joints respectively.\",\n \"8.The battery cell housing of claim 1, characterized in that the edge part (30) of the housing cover (17) has a first cover fold section (45) and a second cover fold section (46) which are arranged coaxially relative to each other.\",\n \"9.The battery cell housing of claim 1, characterized in that the connecting section (23) of the housing shell wall (21) has a first shell fold section (47) and a second shell fold section (48) which are arranged coaxially relative to each other.\",\n \"10.The battery cell housing of claim 9, characterized in that the edge part (30) of the housing cover (17) has a first cover fold section (45) and a second cover fold section (46) which are arranged coaxially relative to each other and that the first shell fold section (47) is arranged between the first cover fold section (45) and the second cover fold section (46).\",\n \"11.The battery cell housing of claim 9, characterized in that the edge part (30) of the housing cover (17) has a first cover fold section (45) and a second cover fold section (46) which are arranged coaxially relative to each other and that the second cover fold section (46) is arranged between the first shell fold section (47) and the circumferential section (22) of the housing shell wall (21).\",\n \"12.The battery cell housing of claim 9, characterized in that the edge part (30) of the housing cover (17) has a first cover fold section (45) and a second cover fold section (46) which are arranged coaxially relative to each other and that the first cover fold section (45) is arranged between the first shell fold section (47) and the second shell fold section (48).\",\n \"13.A method for the production of a battery cell housing (15) having an interior chamber (18) for the accommodation of a core material (19) providing electrical energy, said method comprising the following steps: providing a housing shell (16) that has a floor (20) and a housing shell wall (21) surrounding a housing axis (G), said housing shell wall having a hollow cylindrical circumferential section (22) extending in axial direction (A) away from the floor (20) and having a connecting section (23) adjoining the circumferential section (22) on the axial side opposite the floor (20), said connecting section (23) delimiting a housing opening (24), providing a housing cover (16) that has a cover part (29) extending obliquely or at a right angle relative to the axial direction (A) and has an edge part (30) adjoining the cover part (29) and surrounding the housing axis (G), wherein the outside dimension of the edge part (30) corresponds at most to the inside dimension of the connecting section (23) of the housing shell wall (21), inserting the housing cover (17) into the housing shell wall (21), so that the connecting section (23) surrounds the edge part (30), implementing a folded joint between the connecting section (23) and the edge part (30), wherein the connecting section (23) and the edge part (30) are flanged inward toward the housing axis (G).\"\n ],\n [\n \" BACKGROUND OF THE INVENTION The invention relates to a battery cell housing for the accommodation of a core material that provides electrical energy.\",\n \"Furthermore, the invention relates to a method for the production of the battery cell housing.\",\n \"The battery cell housing comprises a housing shell and a housing cover connected to the housing shell.\",\n \"With the connection established, the housing shell and the housing cover enclose an interior chamber, in which the core material is located.\",\n \"The housing cover and the housing shell are connected to each other in a suitable manner.\",\n \"Frequently, the housing cover is connected in a substance-to-substance bonded manner to the housing shell.\",\n \"Furthermore known have been battery cell housings wherein the housing cover is connected to a circumferential wall via a folded joint.\",\n \"Such a battery cell housing has been known from publication DE 10 2010 030 993 A1.In this case, it is disadvantageous that the fold projects beyond the outside dimensions of the circumferential wall adjoining the fold and thus enlarges the space taken up by the battery cell housing in this installation region.\",\n \"If several battery cell housings are arranged next to each other, the circumferential walls cannot be in contact with each other due to the fold, and/or they cannot be randomly arranged next to each other but display—depending on the size of the fold—a minimum distance from each other.\",\n \"Publication DE 699 28 674 T2 suggests that a folded joint be provided between the housing cover and the housing shell in a region in which the circumferential wall is drawn inward and the interior chamber in the region of the housing opening is tapered.\",\n \"The folded joint implemented toward the outside is arranged in the region displaying the radially smallest dimension and thus does not project beyond the clearance zone of the battery cell housing.\",\n \"However, it has been found that the conical constriction must occur before the introduction of the core material in the battery cell housing.\",\n \"Otherwise dirt particles may enter the interior chamber and impair the electrical or electronic function of the core material.\",\n \"The introduction of the core material following the constriction is also disadvantageous.\",\n \"In a housing shell with a housing wall that tapers or constricts toward the housing opening, a cylindrically contoured core material of a solid substance will potentially no longer fill the entire interior chamber, so that the energy density of the battery cell is reduced.\",\n \"This known battery cell housing is thus especially suitable for at least partially liquid or gelatinous core materials.\",\n \"Publication DE 601 05 076 T2 suggests a battery cell housing, wherein a positive-locking connection is established between a circumferential wall of a housing shell and a housing cover in that a connecting section of the housing shell wall is constricted inward toward the housing axis.\",\n \"The housing cover is axially enclosed between the constriction and an axial end section that is molded inward.\",\n \"The radial constriction is as disadvantageous as the constriction described hereinabove.\",\n \"Considering this prior art, the object to be achieved by the present invention may be viewed to be the provision of a battery cell housing that maximizes the available interior space for the core material and, at the same time, ensures a small design and a simple production.\"\n ],\n [\n \" SUMMARY OF THE INVENTION This object is achieved by a battery cell housing and by a method for the production of the battery cell housing displaying the features of the claims.\",\n \"The invention relates to a battery cell housing 15 which delimits an interior chamber 18 for receiving a core material 19 providing electrical energy.\",\n \"The battery cell housing 15 consists of a housing shell 16 and a housing cover 17 .\",\n \"The housing shell 16 has a floor 20 and a housing shell wall 21 extending coaxially to a housing axis G, proceeding from the floor.\",\n \"The housing cover 17 has a pot or bowl-shaped form.\",\n \"The housing cover is inserted into the housing shell wall 21 at a distance from the floor 20 after the core material 19 has been introduced.\",\n \"The housing shell wall 21 is mechanically connected to the housing cover 17 by a folded joint 31 , preferably a double folded joint.\",\n \"There is no integrally joined connection according to the invention.\",\n \"The folded joint 31 is implemented radially inward toward the housing axis G and is located closer to the housing axis G than the outer surface of the housing shell wall 21 , when viewed radially to the housing axis G. The battery cell housing comprises an interior chamber for the accommodation of a core material that provides electrical energy.\",\n \"The core material may consist of a solid substance, a gel or a fluid.\",\n \"The battery cell housing according to the invention is also particularly suitable for a wound element of a solid core material that is also referred to as a “jelly roll” or a “Swiss roll”.\",\n \"The battery cell housing comprises a housing shell and a housing cover connected to the housing shell by means of a folded joint.\",\n \"Preferably, the battery cell housing consists of only these two parts.\",\n \"The housing shell has a floor and a housing shell wall adjoining the floor, said housing shell wall enclosing a housing axis.\",\n \"The housing shell wall has a hollow cylindrical circumferential section that adjoins the floor and extends in axial direction away from the floor.\",\n \"On the axial side opposite the floor, a connecting section of the housing shell wall adjoins the hollow cylindrical circumferential section.\",\n \"The connecting section delimits a housing opening.\",\n \"Prior to connecting the housing shell to the housing cover, the connecting section is also hollow cylindrical and has the same inside diameter and/or outside diameter as the circumferential section.\",\n \"Before being connected to the housing cover, the circumferential section and the connecting section have a cross-section in the form of a circular cylinder.\",\n \"Also, other cylindrical cross-sectional forms can be used such as polygonal or arcuate cross-sections, or cross-sections that are linear and curved in different parts can be used alternatively.\",\n \"In a preferred embodiment the housing shell wall comprises at least one pair of opposing parallel plane wall sections that are connected via wall sections that are curved, at least in some parts, in order to form the housing shell wall.\",\n \"Each wall section that is curved at least in some sections may have a constant radius of curvature in the curved regions.\",\n \"Each wall section that is curved in at least in some parts—viewed in cross-section—may have the form of a circular arc, for example have the contour of a semi-circle.\",\n \"At least each wall section that is curved in at least some parts may, alternatively, also have several regions of curvature.\",\n \"The radius of curvature of each region of a wall section that is curved in at least in some parts and adjoins a plane wall section, amounts to preferably 4 times the thickness of the circumferential section of the housing shell wall.\",\n \"The radius of curvature of each region of a wall section that is curved in at least in some parts and adjoins a plane wall section, is preferably half as great as half the distance between opposite plane wall sections.\",\n \"The housing cover has a cover part extending obliquely or, preferably, at a right angle, relative to the axial direction.\",\n \"Adjoining the cover part, there is an edge part.\",\n \"The edge part encloses the housing axis in the form of a ring.\",\n \"The edge part may consist of several sections and, for example, comprise a hollow cylindrical lateral section that is connected to the cover part.\",\n \"On the axial side opposite the cover part, the lateral section may have a flange section that extends obliquely or at a right angle relative to the axial direction, inward toward the housing axis.\",\n \"The outside dimension of the edge part is at most as great as the inside dimension of the connecting section, so that the housing cover can be inserted in the connecting section of the housing shell wall and can be connected to the connecting section by creating a folded joint.\",\n \"With the connection established, the cover part of the housing cover is arranged in such a manner that it is enclosed by the hollow cylindrical circumferential section.\",\n \"Between the floor of the housing shell and the cover part, the interior chamber is cylindrical and preferably has a constant interior cross-sectional area and, in accordance with the example, a constant inside diameter.\",\n \"The folded joint is produced between the connecting section and the edge part by folding the connecting section, as well as well as edge part, inward toward the housing axis.\",\n \"Preferably, the folded joint is a double folded joint.\",\n \"Consequently, the folded joint—viewed from the circumferential section—is located farther inside relative to the housing axis, above the cover part of the housing cover.\",\n \"Before implementing the folded joint, the maximum possible opening cross-section of the housing opening is available.\",\n \"Therefore, it is also possible to introduce solid core material into the interior chamber, said core material maximally filling the interior chamber at a right angle relative to the axial direction or the housing axis and thus making possible a high energy density of the battery cell.\",\n \"Furthermore, the folded joint does not project beyond the cylindrical clearance zone of the battery cell housing, so that several battery cell housings can be arranged very tightly next to each other and, if necessary, in contact with each other, in the installation space of a battery.\",\n \"The housing shell and the housing cover are electrically isolated at least relative to the interior chamber.\",\n \"To accomplish this, they may be provided with a coating.\",\n \"The housing shell and the housing cover may also be coated toward the outside or be electrically isolated.\",\n \"For example, the housing shell and the housing cover can be made of a sheet metal material by shaping, said material having, on one or on both sheet sides, an electrically isolating coating.\",\n \"This isolation may also be accomplished by applying a coating after the housing shell or the housing cover have been produced.\",\n \"It is preferred if the folded joint is arranged completely within a region delimited by the curved surface of a hollow cylinder.\",\n \"The curved surface of the hollow cylinder is a surface into which extends the outside surface of the circumferential section and which encloses the entire battery cell housing in axial direction.\",\n \"Preferably, the housing shell, as well as the housing cover, is located completely within the region delimited by the curved surface of the hollow cylinder.\",\n \"The battery cell housing and the housing shell, respectively, and the housing cover are preferably made of a metal or a metal alloy that may contain steel or aluminum, for example.\",\n \"The housing shell may be produced from a blank by means of a deforming process, for example by impact extrusion or ironing.\",\n \"The battery cell housing can be used for any type of electrical energy storage such as, for example, a disposable battery, a rechargeable battery, a capacitor, etc.\",\n \"In one embodiment, the inside dimensions and/or the outside dimension of the circumferential section of the shell housing wall is constant.\",\n \"Viewed in cross-section, the inside contour and the outside contour of the circumferential preferably have the form of a circle.\",\n \"It is also possible to provide at least one support projection for the housing cover at a location of the circumferential section of the shell housing wall in order to specify the position of housing cover within the housing shell wall, before the folded joint is made.\",\n \"The at least one support projection may be produced, for example, by changing the thickness of the housing shell wall.\",\n \"The at least one support projection can also be produced by local shaping of the circumferential section.\",\n \"The at least one support projection may be closed in the form of a ring in circumferential direction around the housing axis, or several support projections—at least three—may be provided at a distance from each other in circumferential direction.\",\n \"The housing cover and/or the housing shell may be made in one piece or integrally, without seams and joints.\",\n \"It is advantageous if the edge part of the housing cover has a first cover fold section and a second cover fold section that—with the connection with the connecting section established—are arranged coaxially relative to each other.\",\n \"The connecting section of the housing shell wall may have a first shell fold section and a second shell fold section that—with the connection with the housing cover established—are arranged coaxially relative to each other.\",\n \"In doing so, it is advantageous if the first shell fold section is arranged between the first cover fold section and the second cover fold section and preferably abuts directly against the two cover fold sections.\",\n \"Preferably, the second cover fold section may be arranged between the first shell fold section and the circumferential section of the housing shell wall and preferably abuts directly against the shell fold section and the circumferential section.\",\n \"Furthermore, the first cover fold section may be located between the first shell fold section and the second shell fold section and preferably abuts directly against the two shell fold sections.\",\n \"Due to the one or more embodiments of the folded joint, it is possible to achieve a tight connection between the housing cover and the housing shell, said connection being produced in a simple manner.\",\n \"The exemplary embodiment provides that the thicknesses of the starting sheet metal, of which the housing shell and the housing cover are made, are the same.\",\n \"In order to create the connection of the housing shell described hereinabove and the housing cover described hereinabove, it is possible to proceed as follows: In unshaped condition, the circumferential section, as well as the connecting section, each have the form of a hollow cylinder—preferably with the same outside dimensions.\",\n \"The inside dimension of the connecting section is at least as great as the inside dimension of the circumferential section.\",\n \"Consequently, the maximum cross-section is available for the insertion of the core material on the housing opening.\",\n \"Upon introducing the core material into the housing shell, the interior chamber is closed in that the housing shell is connected to the housing cover by producing the folded joint.\",\n \"In order to produce the folded joint, the housing cover is inserted along the housing axis into the housing shell, so that the housing shell wall encloses the housing cover in circumferential direction.\",\n \"In this position, the connecting section of the housing shell wall is located, at least partially in axial direction, above the housing shell cover.\",\n \"The folded joint is produced with the aid of a folding device using one or more tools.\",\n \"The connecting section and at least one flange section of the edge part are folded over or flanged inward toward the housing axis, as a result of which an interlocking connection is formed.\",\n \"The connecting section and the edge section may be pressed or squeezed together at a right angle relative to the housing axis in order to improve the folded joint.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This is a continuation-in-part application of pending international application PCT/EP2016/065816 filed Jul.\",\n \"5, 2016, and claiming the priority of German application No.\",\n \"102015111572.7 filed Jul.\",\n \"16, 2015.The said International application PCT/EP2016/065816 and German application No.\",\n \"102015111572.7 are both incorporated herein by reference in their entireties as though fully set forth.\",\n \"BACKGROUND OF THE INVENTION The invention relates to a battery cell housing for the accommodation of a core material that provides electrical energy.\",\n \"Furthermore, the invention relates to a method for the production of the battery cell housing.\",\n \"The battery cell housing comprises a housing shell and a housing cover connected to the housing shell.\",\n \"With the connection established, the housing shell and the housing cover enclose an interior chamber, in which the core material is located.\",\n \"The housing cover and the housing shell are connected to each other in a suitable manner.\",\n \"Frequently, the housing cover is connected in a substance-to-substance bonded manner to the housing shell.\",\n \"Furthermore known have been battery cell housings wherein the housing cover is connected to a circumferential wall via a folded joint.\",\n \"Such a battery cell housing has been known from publication DE 10 2010 030 993 A1.In this case, it is disadvantageous that the fold projects beyond the outside dimensions of the circumferential wall adjoining the fold and thus enlarges the space taken up by the battery cell housing in this installation region.\",\n \"If several battery cell housings are arranged next to each other, the circumferential walls cannot be in contact with each other due to the fold, and/or they cannot be randomly arranged next to each other but display—depending on the size of the fold—a minimum distance from each other.\",\n \"Publication DE 699 28 674 T2 suggests that a folded joint be provided between the housing cover and the housing shell in a region in which the circumferential wall is drawn inward and the interior chamber in the region of the housing opening is tapered.\",\n \"The folded joint implemented toward the outside is arranged in the region displaying the radially smallest dimension and thus does not project beyond the clearance zone of the battery cell housing.\",\n \"However, it has been found that the conical constriction must occur before the introduction of the core material in the battery cell housing.\",\n \"Otherwise dirt particles may enter the interior chamber and impair the electrical or electronic function of the core material.\",\n \"The introduction of the core material following the constriction is also disadvantageous.\",\n \"In a housing shell with a housing wall that tapers or constricts toward the housing opening, a cylindrically contoured core material of a solid substance will potentially no longer fill the entire interior chamber, so that the energy density of the battery cell is reduced.\",\n \"This known battery cell housing is thus especially suitable for at least partially liquid or gelatinous core materials.\",\n \"Publication DE 601 05 076 T2 suggests a battery cell housing, wherein a positive-locking connection is established between a circumferential wall of a housing shell and a housing cover in that a connecting section of the housing shell wall is constricted inward toward the housing axis.\",\n \"The housing cover is axially enclosed between the constriction and an axial end section that is molded inward.\",\n \"The radial constriction is as disadvantageous as the constriction described hereinabove.\",\n \"Considering this prior art, the object to be achieved by the present invention may be viewed to be the provision of a battery cell housing that maximizes the available interior space for the core material and, at the same time, ensures a small design and a simple production.\",\n \"SUMMARY OF THE INVENTION This object is achieved by a battery cell housing and by a method for the production of the battery cell housing displaying the features of the claims.\",\n \"The invention relates to a battery cell housing 15 which delimits an interior chamber 18 for receiving a core material 19 providing electrical energy.\",\n \"The battery cell housing 15 consists of a housing shell 16 and a housing cover 17.The housing shell 16 has a floor 20 and a housing shell wall 21 extending coaxially to a housing axis G, proceeding from the floor.\",\n \"The housing cover 17 has a pot or bowl-shaped form.\",\n \"The housing cover is inserted into the housing shell wall 21 at a distance from the floor 20 after the core material 19 has been introduced.\",\n \"The housing shell wall 21 is mechanically connected to the housing cover 17 by a folded joint 31, preferably a double folded joint.\",\n \"There is no integrally joined connection according to the invention.\",\n \"The folded joint 31 is implemented radially inward toward the housing axis G and is located closer to the housing axis G than the outer surface of the housing shell wall 21, when viewed radially to the housing axis G. The battery cell housing comprises an interior chamber for the accommodation of a core material that provides electrical energy.\",\n \"The core material may consist of a solid substance, a gel or a fluid.\",\n \"The battery cell housing according to the invention is also particularly suitable for a wound element of a solid core material that is also referred to as a “jelly roll” or a “Swiss roll”.\",\n \"The battery cell housing comprises a housing shell and a housing cover connected to the housing shell by means of a folded joint.\",\n \"Preferably, the battery cell housing consists of only these two parts.\",\n \"The housing shell has a floor and a housing shell wall adjoining the floor, said housing shell wall enclosing a housing axis.\",\n \"The housing shell wall has a hollow cylindrical circumferential section that adjoins the floor and extends in axial direction away from the floor.\",\n \"On the axial side opposite the floor, a connecting section of the housing shell wall adjoins the hollow cylindrical circumferential section.\",\n \"The connecting section delimits a housing opening.\",\n \"Prior to connecting the housing shell to the housing cover, the connecting section is also hollow cylindrical and has the same inside diameter and/or outside diameter as the circumferential section.\",\n \"Before being connected to the housing cover, the circumferential section and the connecting section have a cross-section in the form of a circular cylinder.\",\n \"Also, other cylindrical cross-sectional forms can be used such as polygonal or arcuate cross-sections, or cross-sections that are linear and curved in different parts can be used alternatively.\",\n \"In a preferred embodiment the housing shell wall comprises at least one pair of opposing parallel plane wall sections that are connected via wall sections that are curved, at least in some parts, in order to form the housing shell wall.\",\n \"Each wall section that is curved at least in some sections may have a constant radius of curvature in the curved regions.\",\n \"Each wall section that is curved in at least in some parts—viewed in cross-section—may have the form of a circular arc, for example have the contour of a semi-circle.\",\n \"At least each wall section that is curved in at least some parts may, alternatively, also have several regions of curvature.\",\n \"The radius of curvature of each region of a wall section that is curved in at least in some parts and adjoins a plane wall section, amounts to preferably 4 times the thickness of the circumferential section of the housing shell wall.\",\n \"The radius of curvature of each region of a wall section that is curved in at least in some parts and adjoins a plane wall section, is preferably half as great as half the distance between opposite plane wall sections.\",\n \"The housing cover has a cover part extending obliquely or, preferably, at a right angle, relative to the axial direction.\",\n \"Adjoining the cover part, there is an edge part.\",\n \"The edge part encloses the housing axis in the form of a ring.\",\n \"The edge part may consist of several sections and, for example, comprise a hollow cylindrical lateral section that is connected to the cover part.\",\n \"On the axial side opposite the cover part, the lateral section may have a flange section that extends obliquely or at a right angle relative to the axial direction, inward toward the housing axis.\",\n \"The outside dimension of the edge part is at most as great as the inside dimension of the connecting section, so that the housing cover can be inserted in the connecting section of the housing shell wall and can be connected to the connecting section by creating a folded joint.\",\n \"With the connection established, the cover part of the housing cover is arranged in such a manner that it is enclosed by the hollow cylindrical circumferential section.\",\n \"Between the floor of the housing shell and the cover part, the interior chamber is cylindrical and preferably has a constant interior cross-sectional area and, in accordance with the example, a constant inside diameter.\",\n \"The folded joint is produced between the connecting section and the edge part by folding the connecting section, as well as well as edge part, inward toward the housing axis.\",\n \"Preferably, the folded joint is a double folded joint.\",\n \"Consequently, the folded joint—viewed from the circumferential section—is located farther inside relative to the housing axis, above the cover part of the housing cover.\",\n \"Before implementing the folded joint, the maximum possible opening cross-section of the housing opening is available.\",\n \"Therefore, it is also possible to introduce solid core material into the interior chamber, said core material maximally filling the interior chamber at a right angle relative to the axial direction or the housing axis and thus making possible a high energy density of the battery cell.\",\n \"Furthermore, the folded joint does not project beyond the cylindrical clearance zone of the battery cell housing, so that several battery cell housings can be arranged very tightly next to each other and, if necessary, in contact with each other, in the installation space of a battery.\",\n \"The housing shell and the housing cover are electrically isolated at least relative to the interior chamber.\",\n \"To accomplish this, they may be provided with a coating.\",\n \"The housing shell and the housing cover may also be coated toward the outside or be electrically isolated.\",\n \"For example, the housing shell and the housing cover can be made of a sheet metal material by shaping, said material having, on one or on both sheet sides, an electrically isolating coating.\",\n \"This isolation may also be accomplished by applying a coating after the housing shell or the housing cover have been produced.\",\n \"It is preferred if the folded joint is arranged completely within a region delimited by the curved surface of a hollow cylinder.\",\n \"The curved surface of the hollow cylinder is a surface into which extends the outside surface of the circumferential section and which encloses the entire battery cell housing in axial direction.\",\n \"Preferably, the housing shell, as well as the housing cover, is located completely within the region delimited by the curved surface of the hollow cylinder.\",\n \"The battery cell housing and the housing shell, respectively, and the housing cover are preferably made of a metal or a metal alloy that may contain steel or aluminum, for example.\",\n \"The housing shell may be produced from a blank by means of a deforming process, for example by impact extrusion or ironing.\",\n \"The battery cell housing can be used for any type of electrical energy storage such as, for example, a disposable battery, a rechargeable battery, a capacitor, etc.\",\n \"In one embodiment, the inside dimensions and/or the outside dimension of the circumferential section of the shell housing wall is constant.\",\n \"Viewed in cross-section, the inside contour and the outside contour of the circumferential preferably have the form of a circle.\",\n \"It is also possible to provide at least one support projection for the housing cover at a location of the circumferential section of the shell housing wall in order to specify the position of housing cover within the housing shell wall, before the folded joint is made.\",\n \"The at least one support projection may be produced, for example, by changing the thickness of the housing shell wall.\",\n \"The at least one support projection can also be produced by local shaping of the circumferential section.\",\n \"The at least one support projection may be closed in the form of a ring in circumferential direction around the housing axis, or several support projections—at least three—may be provided at a distance from each other in circumferential direction.\",\n \"The housing cover and/or the housing shell may be made in one piece or integrally, without seams and joints.\",\n \"It is advantageous if the edge part of the housing cover has a first cover fold section and a second cover fold section that—with the connection with the connecting section established—are arranged coaxially relative to each other.\",\n \"The connecting section of the housing shell wall may have a first shell fold section and a second shell fold section that—with the connection with the housing cover established—are arranged coaxially relative to each other.\",\n \"In doing so, it is advantageous if the first shell fold section is arranged between the first cover fold section and the second cover fold section and preferably abuts directly against the two cover fold sections.\",\n \"Preferably, the second cover fold section may be arranged between the first shell fold section and the circumferential section of the housing shell wall and preferably abuts directly against the shell fold section and the circumferential section.\",\n \"Furthermore, the first cover fold section may be located between the first shell fold section and the second shell fold section and preferably abuts directly against the two shell fold sections.\",\n \"Due to the one or more embodiments of the folded joint, it is possible to achieve a tight connection between the housing cover and the housing shell, said connection being produced in a simple manner.\",\n \"The exemplary embodiment provides that the thicknesses of the starting sheet metal, of which the housing shell and the housing cover are made, are the same.\",\n \"In order to create the connection of the housing shell described hereinabove and the housing cover described hereinabove, it is possible to proceed as follows: In unshaped condition, the circumferential section, as well as the connecting section, each have the form of a hollow cylinder—preferably with the same outside dimensions.\",\n \"The inside dimension of the connecting section is at least as great as the inside dimension of the circumferential section.\",\n \"Consequently, the maximum cross-section is available for the insertion of the core material on the housing opening.\",\n \"Upon introducing the core material into the housing shell, the interior chamber is closed in that the housing shell is connected to the housing cover by producing the folded joint.\",\n \"In order to produce the folded joint, the housing cover is inserted along the housing axis into the housing shell, so that the housing shell wall encloses the housing cover in circumferential direction.\",\n \"In this position, the connecting section of the housing shell wall is located, at least partially in axial direction, above the housing shell cover.\",\n \"The folded joint is produced with the aid of a folding device using one or more tools.\",\n \"The connecting section and at least one flange section of the edge part are folded over or flanged inward toward the housing axis, as a result of which an interlocking connection is formed.\",\n \"The connecting section and the edge section may be pressed or squeezed together at a right angle relative to the housing axis in order to improve the folded joint.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS Advantageous embodiments of the invention result from the claims, the description and the drawings.\",\n \"Hereinafter, preferred embodiments of the invention are explained in detail with reference to the appended drawings.\",\n \"They show in: FIG.\",\n \"1 a schematic perspective representation of an exemplary embodiment of a battery cell housing, FIG.\",\n \"2 a representation, partially in section, of the folded joint between a housing cover and a housing shell in the case of the battery cell housing according to FIG.\",\n \"1—in region II, FIG.\",\n \"3 an exploded view of the battery cell housing of FIG.\",\n \"1, FIG.\",\n \"4 a partial view of a longitudinal section through the exemplary embodiment of the battery cell housing of FIGS.\",\n \"1 to 3, prior to the implementation of the folded joint, FIG.\",\n \"5a an exemplary embodiment of a battery cell housing that has been modified compared with FIG.\",\n \"4, with a shell housing wall having a thickness that changes at one point, FIG.\",\n \"5b an exemplary embodiment of a battery cell housing that has been modified compared with FIG.\",\n \"5a, wherein a separate installation part is provided as the support for the housing cover, FIGS.\",\n \"6 to 8 a schematic exemplary illustration of different stages of the production of a folded joint with the aid of a folding device, FIG.\",\n \"9 a longitudinal section through an exemplary embodiment of the battery cell housing in the region of the housing cover, with the folded joint established, FIGS.\",\n \"10 and 11 perspective partial representations of respectively one exemplary embodiment of the floor of the battery cell housing, FIG.\",\n \"12 a schematic plan view onto the housing cover parallel to the housing axes, of several of the battery cell housings, and FIGS.\",\n \"13 to 15 schematic illustrations of cross-sections through a housing shell.\",\n \"DETAILED DESCRIPTION OF THE INVENTION FIGS.\",\n \"1 and 3 show an exemplary embodiment of a cylindrical battery cell housing 15 that, in accordance with the example, has the form of a circular cylinder.\",\n \"The battery cell housing 15 comprises a housing shell 16 and a housing cover 17.In the exemplary embodiment, the battery cell housing 15 consists only of these two parts 16, 17.The battery cell housing 15 delimits an interior chamber 18 that is disposed and provided for the accommodation of core material and, preferably, a solid core material 19.The solid core material 19 may be, for example a wound body that is also referred to as a “jelly roll” or a “Swiss roll”.\",\n \"As illustrated by FIG.\",\n \"3, the solid core material 19 has a cylindrical contour and, in accordance with the example, the contour of a circular cylinder.\",\n \"The inside diameter of the interior chamber 18 corresponds to the outside diameter of the solid core material 19, apart from a necessary clearance.\",\n \"The housing shell 16 has a floor 20, as well as a housing shell wall 21 surrounding a housing axis G. The housing axis G extends in an axial direction A.\",\n \"The direction radial to the housing axis G is referred to as the radial direction R. The housing shell wall 21 adjoins the floor 20 and completely surrounds the floor 20 in circumferential direction around the housing axis G. The housing shell wall 21 has—adjoining the floor 20—a circumferential section having the contour of a hollow cylinder.\",\n \"The inside diameter of the circumferential section 22 specifies the inside diameter of the interior chamber 18.On the axial side, opposite the floor 20, the circumferential section 22 transitions into a connecting section 23.The connecting section 23—in not deformed initial condition of the housing shell 16 (FIG.\",\n \"3)—also has the form of a hollow cylinder and, in one exemplary embodiment, can have the same inside diameter and the same outside diameter as the circumferential section 22.The connecting section 23 delimits a housing opening 24 through which the core material 19 can be introduced into the housing shell 16.In the exemplary embodiment, the cross-section of the housing opening 24 is circular and, in not deformed condition of the housing shell 16, corresponds to the inside diameter of the connecting section 23 and, in accordance with the example, also to the inside diameter of the circumferential section 22, as well as of the interior chamber 18.Consequently, the complete inner chamber cross-section is available for the introduction of the core material 19.FIGS.\",\n \"13 to 15 show, as examples, different cylindrical forms of the housing shell 16, in cross-section through the circumferential section 22.As already explained, the housing shell may have the cross-section of a circular cylinder (FIG.\",\n \"13), Alternatively thereto, it is also possible to design a housing shell 16 with a polygonal cross-section.\",\n \"A hexagon is shown only as an example in FIG.\",\n \"14.The number of corners may be varied.\",\n \"The polygonal cross-section may be regular or irregular.\",\n \"A cylindrical form of the housing shell with an oval or “race-track-shaped” cross-section is schematically shown by FIG.\",\n \"15.The housing shell wall 21 and the circumferential section 22, respectively, have oppositely located parallel plane wall sections 22a.\",\n \"The two plane wall sections 22a are at a distance from each other.\",\n \"They are connected to each other by several—two according to the example—curved wall sections 22b.\",\n \"In the exemplary embodiment, each curved wall section 22b has a constant radius of curvature.\",\n \"Viewed in cross-section, each curved wall section 22b has the form of a semi-circle.\",\n \"Alternatively thereto, it is also possible that each plane wall section 22a is adjoined on both sides by a curved wall section 22b each, the latter having the same radius of curvature and being connected to each other via a transition wall section.\",\n \"For example, the transition wall section may be plane or have another configuration.\",\n \"The radius of curvature of the at least partially curved wall sections 22b corresponds at most to half the distance between the two plane wall sections 22a and may also be smaller if the curved regions are connected to each other by another region.\",\n \"In the exemplary embodiment, the radius of curvature is at least four times as large as the wall thickness of the circumferential section 22.Preferably, the connecting section 23—in its not deformed condition before the connection with the housing cover 17 is produced—has the same cross-section as that of the circumferential section 22 of the housing shell wall 21, as illustrated by FIGS.\",\n \"13 to 15.With reference to FIGS.\",\n \"3 and 4, the housing cover 17 has a cover part 29 that extends in radial direction R in the exemplary embodiment.\",\n \"The cover part 29 could also extend, at least in some parts, in a manner oblique to the housing axis G. An edge part 30 adjoins the cover part 29.The edge part 30 is disposed to form a folded joint 31 with the connecting section 23 of the housing shell wall 21 (FIGS.\",\n \"2 and 9).\",\n \"FIG.\",\n \"4 shows the housing cover 17 in its non-deformed initial condition.\",\n \"In its non-deformed initial condition, the housing cover 17 has the form resembling that of a pot or bowl.\",\n \"In this initial condition, the edge part 30 is formed by a lateral section 32 and a flange section 33.The lateral section 32 extends coaxially with respect to the housing axis G and forms a hollow cylindrical part of the housing cover 17, as long as said cover is still not deformed.\",\n \"The flange section 33 has the form of a ring that surrounds the housing axis G. In the exemplary embodiment, the flange section 33 extends in a radial plane.\",\n \"It could also have a conical form and be oriented inclined with respect to the housing axis G. Preferably, when the folded joint 31 is being implemented, the flange section 33 is reshaped together with the connecting section 23.The lateral section 32 can remain at least substantially non-deformed.\",\n \"For the production of the battery cell, the core material 19 is introduced into the housing shell 16 and arranged there in the interior chamber 18.Subsequently, the housing cover 17 is arranged above the core material 19 inside the housing shell wall 21.Initially, the housing cover 17 is in its starting condition described hereinabove.\",\n \"In order to arrange the housing cover 17 in a defined position, there may be at least one support projection 34 that extends away from the housing shell wall 21 and, in particular, from the circumferential section 22, in radial direction R toward the housing axis G. For example, it is sufficient to provide—in circumferential direction distributed around the housing axis G—several and, as in the example, three support projections 34.For example, they may also be produced following the introduction of the core material by pressing in the housing shell wall 21 due to a deforming force F. Inasmuch as the support projections 34 are not associated with the folded joint 32, they may be very small in radial direction R and, for example, have a radial dimension that corresponds to at most 1.0 times or 1.5 times, or 2.0 times the thickness of the circumferential section 22 at this point.\",\n \"For example, the support projections 34—viewed from the inside—may be concave and—viewed from the outside—convex in the circumferential section 22 of the housing shell wall 21.FIG.\",\n \"4 shows, schematically, bump-shaped support projections 34 in dashed lines.\",\n \"Alternatively thereto, it is also possible to increase the thickness of the housing shell wall 21 at the point where the cover part 29 of the housing cover 17 is to be located and thus form an annular support projection.\",\n \"In doing so, the support projection may extend in a radial plane R or be obliquely inclined relative to the housing axis G. FIG.\",\n \"5a shows, schematically, a ring-shaped, closed support projection 34 that is formed by a thickness change of the housing shell wall 21.FIG.\",\n \"5b shows an exemplary embodiment, wherein the support projection 34 is formed by an insert part 35 that, preferably is made of plastic material.\",\n \"For example, the insert part 35 may have the form of a hollow cylinder.\",\n \"The outside diameter of the insert part 35 may essentially correspond to the inside diameter of the circumferential section 22 of the housing shell wall 21.The upper edge of the insert part 35 may extend in a plane at a right angle relative to the housing axis G or be inclined relative thereto, so that said insert part is seated on the curved surface of a cone.\",\n \"The insert part 35 may be inserted before the introduction of the core material 19 into the housing shell 16 of the battery cell housing 15.As is shown by FIGS.\",\n \"4 and 5a and 5b, the housing cover 17 has a maximum outside radius that—apart from a required clearance—corresponds to the inside radius of the housing wall section 21 in the region of the housing opening 24, at least up to the point where the cover part 29 of the housing shell 16 is to be arranged, i.e., for example, up to the at least one support projection 34.After arranging the housing cover 17 in the housing shell 16, the folded joint 31 is implemented between the connecting section 23 of the housing shell wall 21 and the edge part 30 and, in particular, the flange section 33.The process is illustrated in a highly simplified manner by FIGS.\",\n \"6 to 8.In order to produce the folded joint 31, a folding device 38 comprising several tools is used.\",\n \"FIGS.\",\n \"6 and 7 show both a first tool 39 and a second tool 40.The two tools 39, 40 come into contact from opposite radial sides.\",\n \"The first tool 39 is cylindrical in some sections and presses against the outside of the housing shell wall 21 in the region in which the housing cover 17 is located.\",\n \"The second tool 40 extends into the pot-shaped housing cover 17.The reforming process to produce the folded joint 31 is accomplished with the tools of the folding device 38.During a first, not illustrated, step the housing shell wall 21 is angled inward in the connecting section 23, so that said wall abuts against the flange section 33 or extends over the flange section 33.The second tool 40 has a concave recess, for example a concave annular groove, into which extend the ends of the connecting section 23 and the flange section 33 associated radially with the housing axis G. In doing so, the connecting section 23 is moved or folded around the radially inner edge of the flange section 33, as it were, by means of the second tool 40.With the continued movement of the tools 39, 40, the flange section 33 is bent over at a bending location, so that its free edge initially faces in an oblique direction toward the cover part 29 (FIG.\",\n \"7).\",\n \"As an alternative to the above-described rolling of the connecting section 23 and the housing cover 17 and the flange section 33, respectively, it is possible to implement the interlocking intermediate step shown by FIG.\",\n \"7 also by means of an upsetting process with a movement in the direction of the housing axis G. For further shaping, the second tool 40—in accordance with the example or if the second tool 40 does not have the desired form—is replaced by a third tool 41 having a concave recess or annular groove in the form that the folded joint 31 is ultimately to have, and that, for example, is slightly greater in axial direction than the concave recess of the second tool 40.The first tool 39 and the third tool 41 are pressed against each other in radial direction, so that the edge part 30 and, in particular, the flange section 33 are tightly pressed together with the connecting section 23, and the folded joint 31 is produced.\",\n \"Independent of the various methods of producing the folded joint 31, the housing part 17 and the housing shell 15 are pressed together in a pressure-sealed manner.\",\n \"The completed folded joint 31, for example, is schematically illustrated by FIGS.\",\n \"2 and 9.In accordance with the example, the connection between the housing cover 17 and the housing shell 16 is effected only by means of the folded joint 31.A substance-to-substance connection is not provided.\",\n \"Due to the reforming process during the implementation of the folded joint 31, a first cover fold section 45 has formed on the edge part 30 and a second cover fold section 46 has formed, in which case the second cover fold section 46 coaxially encloses the first cover fold section 45.The first cover fold section 45 adjoins the free edge of the reshaped flange section 33.The second cover fold section 45 is represented by a region of the lateral section 32 that adjoins the flange section 33.A first shell fold section 47, as well as a second shell fold section 48, have been formed on the connecting section 23.The first shell fold section 47 coaxially encloses the second shell fold section 48.The first shell fold section 47 is arranged between the two cover fold sections 45, 46 and is directly in contact therewith or is clamped between the two cover fold sections 45, 46.Analogously, the first cover fold section 45 is arranged between the two shell fold sections 47, 48 and is directly in contact with these or is clamped between these.\",\n \"The fold sections 45, 46, 47, 48 extend coaxially relative to the housing axis G in axial direction A.\",\n \"The second cover fold section 46 is coaxially surrounded by the circumferential section 22 of the housing shell wall 21 and is in direct contact therewith.\",\n \"A transition section is provided between the two cover fold sections 45, 46, said transition section being curved at least in some parts.\",\n \"Analogously thereto, there is a transition section between the two shell fold sections 47, 48, said transition section being curved in at least some parts.\",\n \"Furthermore, the second shell fold section 48 is connected to the circumferential section 22 of the housing shell wall via a transition section that is curved at least in some parts and on which the upper edge 50 of the battery cell housing 15 is formed.\",\n \"The upper edge 50 is arranged in axial direction A at a distance from the cover part 29 of the housing cover 17 (FIGS.\",\n \"2 and 9).\",\n \"This distance is a function of the free space x in axial direction A between the cover part 29 and the transition section from the first shell fold section 47 to the second shell fold section 47 that is required by the tools 40, 41 during the production of the folded joint (FIG.\",\n \"8).\",\n \"In accordance with the example, both the housing cover 17 and the housing shell 16 are produced without seams and joints.\",\n \"The housing cover 17 and the housing shell 16 may consist of metal or a metal alloy that contains steel or aluminum.\",\n \"The housing cover 17, as well the housing shell 16 are electrically isolated with respect to the interior chamber 18.To accomplish this, an electrically isolating coating may be provided.\",\n \"This coating may already be present on the starting sheet metal from which the housing cover 17 and the housing shell 16, respectively, are produced.\",\n \"The battery cell housing 15 may also be completely covered by an electrically isolating coating.\",\n \"The folded joint 31 is located completely within the axial clearance zone of the battery cell housing 15.In other words: a hollow cylindrical curved surface M extending coaxially with respect to the housing axis G is defined, said curved surface completely holding the battery cell housing 15.The curved surface of the hollow cylinder M defines a cylindrical region B around the housing axis G, from which region the folded joint 31 does not project.\",\n \"In accordance with the example, the entire battery cell housing 15 is located within this region B.\",\n \"In doing so, the curved surface of the hollow cylinder M has a radius in radial direction R that corresponds to the outside radius of the circumferential section 22 of the housing shell wall 21.The curved surface of the hollow cylinder M and the resultant, defined region B are illustrated schematically by FIG.\",\n \"9.FIGS.\",\n \"10 and 11 show different embodiments of the floor 20 of the housing shell 16.As in the exemplary embodiments according to FIGS.\",\n \"1 and 3, the floor 20 may have the configuration of a plate or disk and extend essentially in a radial plane (FIG.\",\n \"11.).\",\n \"Alternatively thereto, it is also possible for the floor 20 to be inclined at least in some parts or extend at a right angle relative to the radial direction R. For the formation of a battery pole, it may also have an essentially cylindrical recess—viewed from the interior chamber 18.Looking from the outside onto the battery cell housing 15, this results in an elevation 51, which is shown, for example, by FIG.\",\n \"10.FIG.\",\n \"12 shows, greatly schematized, the arrangement of several battery cell housings 15.FIG.\",\n \"12 shows the battery cell housing 15—looking in axial direction A from the top onto the housing cover 17 and the cover part 29 of the housing cover 17, respectively.\",\n \"The upper edge 50 formed by the folded joint 31 can also be seen.\",\n \"The battery cell housings 15 can be connected—depending on the embodiment of the battery—electrically in series and/or in parallel.\",\n \"This is a function of the desired battery voltage and the desired battery power, respectively.\",\n \"As illustrated by FIG.\",\n \"12, the battery cell housings 15 can be arranged very tightly next to each other.\",\n \"As a result of the fact that the folded joint 31 does not project beyond the curved surface of the hollow cylinder M, the battery cell housings 15 have a cylindrical contour and can be arranged tightly next to each other, requiring minimal space.\",\n \"The adjacent battery cell housings 15 may abut against each other.\",\n \"In modification of the illustration of FIG.\",\n \"12, they may also be arranged at a defined distance from each other.\",\n \"The intermediate spaces between the battery cell housings 15 can be filled with a filling material 53.The filling material may be a material that is a good heat conductor, For example, a mixture of resin with particles that are good heat conductors or a powder that is a good heat conductor may be used.\",\n \"The particles or the powder that is admixed to the resin may contain boron nitrite and/or copper and/or other metals and/or hydrocarbon.\",\n \"Instead of the particles or powder, it is also possible to use other bodies such as, for example, rods, of the mentioned materials between the battery cell housings 15.The filling material 53 may also be used for the production of a heat sink and, for example, contain a phase-changing material (PCM) such as, for example, sodium acetate or the like.\",\n \"The invention relates to a battery cell housing 15 which delimits an interior chamber 18 for receiving a core material 19 providing electrical energy.\",\n \"The battery cell housing 15 consists of a housing shell 16 and a housing cover 17.The housing shell 16 has a floor 20 and a housing shell wall 21 extending coaxially to a housing axis G, proceeding from the floor.\",\n \"The housing cover 17 has a pot or bowl-shaped form.\",\n \"The housing cover is inserted into the housing shell wall 21 at a distance from the floor 20 after the core material 19 has been introduced.\",\n \"The housing shell wall 21 is mechanically connected to the housing cover 17 by a folded joint 31, preferably a double folded joint.\",\n \"There is no integrally joined connection according to the invention.\",\n \"The folded joint 31 is implemented radially inward toward the housing axis G and is located closer to the housing axis G than the outer surface of the housing shell wall 21, when viewed radially to the housing axis G. LIST OF REFERENCE SIGNS 15 Battery cell housing 16 Housing shell 17 Housing cover 18 Interior chamber 19 Core material 20 Floor 21 Housing shell wall 22 Circumferential section 23 Connecting section 24 Housing opening 29 Cover part 30 Edge part 31 Folded joint 32 Lateral section 33 Flange section 34 Support projection 35 Insert part 38 Folding device 39 First tool 40 Second tool 41 Third tool 45 First cover fold section 46 Second cover fold section 47 First shell fold section 48 Second shell fold section 50 Upper edge 51 Elevation 53 Filling material A Axial direction B Region F Forming force G Housing axis M Curved surface of hollow cylinder R Radial direction x Free space\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870888"}}},{"rowIdx":4493670,"cells":{"text":{"kind":"list like","value":[["Device for Treating an Object with Plasma","A system for treating an object with plasma includes a vacuum processing chamber having a holder on which the object to be treated is placed, at least two subassemblies each including at least one plasma source able to generate a plasma and being supplied with radio-frequency power Pi and with a gas i of independent flow rate ni.","The plasma generated by one of the subassemblies is a partially ionized gas or gas mixture of different chemical nature from the plasma generated by the other subassembly or subassemblies.","A process for selectively treating a composite object employing such a device is described."],["1.A system for the treatment of an object by plasma comprising: a treatment vacuum chamber having a support on which the object to be treated is placed; and at least two subassemblies each comprising at least one plasma source allowing a plasma to be generated, each plasma source of a subassembly being supplied by radio frequency power Pi and independently by a gas i at a flow-rate ni, wherein plasma generated by one subassembly is a partially ionized gas or a gas mixture, of a different chemical nature from plasma generated by the other subassembly or subassemblies.","2.The system according to claim 1 wherein each source of plasma of a subassembly comprises: a gas inlet system; a discharge chamber made of a plasma-inert material; a device for coupling the radiofrequency (RF) power to the discharge chamber; and a gas outlet.","3.The system according to claim 1 further comprising a control device to control each of the subassemblies depending upon a specific parameterization by application of radiofrequency power Pi and/or a flow-rate of gas ni specific to each subassembly.","4.The system according to claim 1 wherein each subassembly comprises a gas inlet specific to the subassembly connected to the gas inlet of each plasma source of the subassembly.","5.The system according to claim 1 wherein each subassembly comprises a conducting element connected to the coupling device of each plasma source of the subassembly.","6.The system according to claim 1 wherein the subassemblies are arranged along concentric rings.","7.The system according to claim 1 wherein the subassemblies are arranged in parallel.","8.The system according to claim 7 wherein each subassembly comprises at least two plasma sources, each plasma source comprising two chambers in series."],[" BACKGROUND The invention concerns the domain of plasma surface processing.","By plasma surface processing is understood, in the sense of the present invention, different types of applications.","Applications can notably be cited consisting of the removal (or etching) of materials (and in particular materials such as photosensitive resins, metals, dielectrics or again semiconductors, etc.","), the etching of structures such as holes or trenches in a silicon substrate or a layer comprised of metals, dielectrics or other substances, typically following a surface pattern printed in a photosensitive resin by photolithography, or again applications consisting of the removal of sacrificial layers.","Applications can again be cited consisting of the cleaning of residues and of contaminants, or the activation of surfaces (that is the physical and/or chemical modification of the “extreme surface”), or again the passivation of surfaces (that is the protection against physical and/or chemical attack of the latter).","These applications concern notably the micro-electronics and semi-conductor domain, but also e.g.","the fabrication of flat screens and photovoltaic panels."],[" SUMMARY A plasma is a partially ionized gas containing electrically charged species (ions and electrons) as well as electrically neutral but very chemically active species, free radicals: these are atoms and molecules in an electronically “excited” state but not having lost an electron.","By means of these radicals and/or ions and of a controlled vacuum environment, the plasma offers unique possibilities for the depositing, etching and removal of materials.","At the current time, there exist two dominant types of plasma technology for the surface processing of semi-conductors: micro-wave plasmas and inductively coupled plasmas.","Each of the present technologies presents advantages and inconveniences.","The principal advantage of micro-wave plasmas comes from their ability to generate a high density of active chemical species (greater than 10 17 cm −3 ).","This technology presents numerous inconveniences, however, such as the complexity of the plasma source and the non-uniformity of the processing.","The plasma source necessitates the vertical assembly of numerous parts (wave-guide, magnetron, etc.","), that generates a significant bulk and renders it unreliable.","In addition, the plasma source is positioned upstream (with respect to the gas flow) and in the center of a processing chamber, and this provides insufficient uniformity of the density of active plasma species, and therefore the processing of the substrate (positioned in the processing chamber), between the center of the chamber (where the density of active species is very high) and its edge (where the density of active species is very low).","Moreover, this type of plasma source presents the inconvenience of requiring very high electrical power, as well as very high gas flow-rates.","All these inconveniences make this plasma process expensive, difficult to make reliable and difficult to control.","Inductively Coupled Plasmas or ICPs are easier to implement than micro-wave plasmas: the technology is simpler, less expensive and more easily controllable than micro-wave technology.","However, the principal inconvenience of this technology comes from the low density of chemically active species (about 10 15 cm −3 ) thus obtained.","Moreover, like micro-wave plasmas, ICP plasmas suffer from the problem of non-uniformity in the density of active species between the center of the chamber (where the density of active species is higher) and its edge (where the density of active species is lower), that makes the surface processing non-uniform.","Processing speeds required by users impose the use of high power RF generators that are very costly and which lead to the heating of the gases used.","Lastly, depending upon the design of the processing chamber, the plasma generated by the ICP sources can induce significant ionic bombardment of the substrates (for example semi-conductor wafers) whether voluntarily (RIE mode (reactive ion etching)) or not.","One of the major problems encountered by current plasma technologies is therefore that of the non-uniformity of the density of active species and consequently that of the design of a device adapted to the increase in size of substrates (or scale-up).","In fact, the passage from 200 mm diameter substrates to 300 mm diameter substrates has already been difficult and very costly for equipment manufacturers implementing plasma technology.","This change of size of substrates has in fact necessitated a considerable increase in the size of plasma sources whether Inductively Coupled plasma sources (or ICP) or micro-wave sources, and the addition of miscellaneous parts such as diffusers or magnets to artificially reduce the lack of uniformity.","These two technologies (ICP and micro-wave) are therefore very costly today and complex for the users thereof, the manufacturers of semiconductors.","The feasibility of passage from 300 mm diameter substrates to 450 mm diameter substrates is therefore a complex problem that still remains to be solved.","Moreover, ICP and micro-wave sources attain a rate of dissociation of the gas that does not exceed 30%, which causes considerable dilution of the active species generated and very high consumption of gas.","They are used in a unitary fashion: a single source is used per processing chamber and the size of the source is proportional to the volume treated.","All of this imposes the implementation of voluminous sources that operate at high power, creating undesirable thermal effects on the substrates and significantly increasing the cost of these systems.","Amongst these two types of sources, micro-wave plasmas are the most dense in terms of chemically active species but control of the process is difficult.","Consequently, ICP plasma technology at medium chemically active species density is dominant today.","Moreover, plasmas contain, other than free radicals that are electrically neutral, ions, electrons and UV radiation in the form of energetic photons that damage semi-conductor devices.","The latter become more and more sensitive to this damage with miniaturization on the nanometer scale.","The presence of metal on the substrate (or “wafer”) can produce the risk of coupling with the micro-waves and very high heating that damages the components.","This is the case of ultra-sensitive structures of micro-electro-mechanical systems (also designated by the acronym MEMS), as well as three-dimensional assemblies and interconnections that will be implemented in future generations of semi-conductors.","Lastly, in the framework of the fabrication of integrated circuits, it is known to plasma process semi-conductor devices composed of an assembly of very different materials, present notably in the form of a stack of thin layers.","To fabricate an integrated circuit from a semi-conductor device, the plasma processing must act on a single material, leaving the other materials of the assembly unaffected.","This is what is called selectivity.","This characteristic is not sufficiently raised at this time, which degrades the performance of components.","For the fabrication of integrated circuits on a silicon wafer (which is the normal base material used for fabricating integrated circuit wafers), the level of integration of the integrated circuits on the nanometer scale today imposes new technologies of surface processing with extreme sensitivity, that is without consuming the other exposed materials.","The problem of selectivity is particularly important with the use of stacks of metallic grids and dielectric grids of type “high k” and dielectric interconnection networks of type “low-k”.","These materials are particularly susceptible to physico-chemical modifications and loss of material.","Up until the present, a slight loss of material caused by the surface processing was tolerated as it did not have a negative impact on the performance of the circuit and the principal objective was to clean off all undesirable materials and contaminants.","Today, the surface processing, in particular stripping and cleaning, can directly impact the performance of integrated circuits by the modification of dimensions and/or of materials.","An additional objective for surface processings is therefore to minimize and control these modifications.","The problems of selectivity have therefore been more and more present because of the decrease of the size of integrated circuits and the use of new materials, in particular for logic components, typically microprocessors, and memory circuits.","Current plasma technologies suffer therefore from four major inconveniences: damage to the devices by ionized species, low density of chemically active species notably for ICP plasmas, low uniformity and lack of selectivity.","There exists therefore a real need for a plasma processing system compensating for these faults, inconveniences and obstacles of the prior art and in particular aiming to increase the selectivity of plasma processings and to improve the uniformity of plasma processings notably for substrates of large diameter such as 300 or 450 mm.","A person skilled in the art knows plasma processing systems using a plurality of plasma sources, such as e.g.","that described in the American patent application US 2005/0178746.The system aims to improve the uniformity of the plasma processing by putting in parallel a plurality of plasma sources emitting the same chemically homogeneous plasma.","The present invention has therefore the subject matter of supplying a system for the plasma processing of an object and a process implementing such a device that will remedy these inconveniences.","To resolve these faults and inconveniences, the applicant has developed a system of plasma processing comprising a processing vacuum chamber and a plurality of plasma sources configured in independent subassemblies each generating a chemically different plasma.","More particularly, the present invention has as subject matter a system for plasma processing of an object, said system comprising: a processing vacuum chamber comprising a support on which the object to be processed is placed; and at least two subassemblies each comprising at least one plasma source allowing a plasma to be generated, each plasma source of a subassembly being supplied independently by radiofrequency power Pi and by a flow-rate ni of gas i.","According to the invention, the plasma generated by a subassembly is a partially ionized gas or gas mixture of different chemical nature from the plasma generated by the other subassembly or subassemblies.","Advantageously, each plasma source of a subassembly comprises: a gas inlet system; a discharge chamber in a material inert to the plasma, e.g.","in the form of a tube; a device for coupling the radiofrequency (RF) power to the discharge chamber; and a gas outlet.","Advantageously, a control device controls each of the subassemblies depending upon a specific configuration by application of radiofrequency power Pi and/or a flow-rate of gas ni, specific to each subassembly.","Advantageously, each subassembly comprises a gas inlet specific to the subassembly connected to the gas inlet of each plasma source of the subassembly.","Advantageously, each subassembly comprises a conductor element connected to the coupling device of each plasma source of the subassembly.","Advantageously, the subassemblies are arranged as concentric rings.","Advantageously, the subassemblies are arranged in parallel.","Advantageously, in each subassembly comprising at least two plasma sources, each plasma source comprises at least two discharge chambers in series.","The present invention also has the subject matter of a selective plasma processing method for processing a composite object comprising at least two different materials A and B, said process implementing a processing system according to the invention and comprising the following steps: a step of generating a first plasma by a first of the subassemblies and processing of the object using said first plasma; a step of generating a second plasma by a second of the subassemblies and processing of the object using said second plasma; By composite object, it is understood, as defined by the present invention, an assembly of materials of very different nature, being able notably to take the form of a stack of thin films.","As an example of composite objects able to be processed by the process of the invention, semiconductor-devices, and in particular, silicon wafers comprising transistor structures and materials and other constituting elements of integrated circuits overlapped by one or a plurality of silicon oxide SiO 2 layers overlapped by silicon nitride Si 3 N 4 , can be cited.","Advantageously, the steps of generation of plasma are repeated alternately, or with a partial or total overlap, and preferably with a partial overlap of steps of at most 25%.","According to a particularly advantageous embodiment, the process according to the invention may consist of an etching treatment of the composite object, said composite object comprising at least two layers of different materials A and B, the layer of material A overlapping at least partially the layer of material B, said process comprising; the processing using the first plasma of at least a first zone of the object comprising, on the surface, the material B, said processing using the first plasma consisting of a step of passivation or activation of material B, and the processing using the second plasma of at least a second zone of the object comprising, on the surface, the material A, said processing using the second plasma consisting of a partial or total removal of material A, that can lead to the formation of a zone comprising the material B on the surface when the removal of the material A is total, said process able to start either with a step of passivation or activation using the first plasma, or with a step of removal using the second plasma.","As an example of a composite object being selectively etched according to the process of the invention, spacers (more particularly the thinning or removal of spacers), STI (“Shallow Trench Isolation”) structures (more particularly the total or partial removal “pull back” of the STI mask), transistors and advanced CMOS circuits (processors, memories) comprising layers of silicon nitride Si 3 N 4 (material A) on layers of silicon oxide SiO 2 (material B) can be cited, the silicon nitride often being a sacrificial material.","This embodiment of the process of the invention presents the major advantage of allying high selectivity with a high etching speed.","Selectivity is understood in the present invention to be the ratio of the speed of etching of the target material (material A, e.g.","Si 3 N 4 ) to the speed of etching of another exposed material or material that can be exposed during the processing (here the material B, for example SiO 2 ), that ideally should not be etched.","This is a fundamental property of processes of removal of material (or etching) that is critical as much for “dry” type processes such as the plasma process according to the invention as for “wet” processes e.g.","using phosphoric acid.","For example, the fabrication of advanced CMOS circuits (processors, memories) necessitates the removal of silicon nitride Si 3 N 4 with very high selectivity, in particular compared to SiO 2 and/or Si: the removal of Si 3 N 4 must not damage the other materials.","At this time, the two processes used to perform this step of the removal of silicon nitride are on the one hand “wet” processes using phosphoric acid, and on the other hand, “dry” plasma processes with a fluorocarbon plasma containing a gas mixture C x F y H z /O 2 /H 2 /N 2 .","These current processes do not allow a very high selectivity in the removal of silicon nitride to be achieved as it is typically only 50.Moreover, the fabrication of an Si 3 N 4 spacer is done by directional etching of the previously deposited Si 3 N 4 layer.","According to the scientific research article “Plasma Etch Challenges for FinFET transistors” published by the company Lam in the journal, Solid State Technology—April 2012 (pages 15, 16, 17 and 26), the principal difficulty of current etching processes resides in obtaining a spacer with a very specific shape, without consuming the silicon substrate.","The solution proposed in this article for obtaining this objective consists in modulating the plasma conditions (“time modulation of plasma parameters”).","For example, sync pulsing is a technique consisting of switching on/off the power of the RF source and the RF power of the substrate carrier with a period of about 100 .mu.s.","This type of directional etching is often used for the later removal of the spacer.","However, such a process presents the inconvenience of inducing a loss of silicon at the foot of the spacer as well as the faceting of neighboring patterns such as the edge of the active area or the edge of the grid.","The etching process according to the invention resolves the inconveniences of the prior art and allows the allying of a high sensitivity with a high etching speed.","Advantageously the steps of processing using the first plasma and the processing using the second plasma are performed in an alternate manner according to a periodicity varying between 0.5 second and 120 seconds, and preferably from 2 to 30 seconds, so as to repeat the sequence of the plasma processing steps a plurality of times until the desired removal of material A is obtained.","Advantageously the ratio of the duration of the activation step or the passivation step to the duration of the removal varies between 0.1 and 10 and preferably between 0.5 and 2.The subject matter of the present invention is again an etched composite object likely to be obtained by the process of etching such as defined above.","It could be notably an integrated-circuit wafer, or a substrate for a flat screen, or a substrate for solar cells, or a substrate for an electronically printed device."],["CROSS REFERENCES TO RELATED APPLICATIONS This application is a divisional of U.S. patent application Ser.","No.","14/415,976 entitled: Device for Treating an Object with Plasma which claims priority from and is related to commonly owned International Application No.","PCT/FR2013/051768 filed Jul.","22, 2013 and French Patent Application No.","1257037 filed Jul.","20, 2012, the entire contents of each are incorporated herein by reference.","BACKGROUND The invention concerns the domain of plasma surface processing.","By plasma surface processing is understood, in the sense of the present invention, different types of applications.","Applications can notably be cited consisting of the removal (or etching) of materials (and in particular materials such as photosensitive resins, metals, dielectrics or again semiconductors, etc.","), the etching of structures such as holes or trenches in a silicon substrate or a layer comprised of metals, dielectrics or other substances, typically following a surface pattern printed in a photosensitive resin by photolithography, or again applications consisting of the removal of sacrificial layers.","Applications can again be cited consisting of the cleaning of residues and of contaminants, or the activation of surfaces (that is the physical and/or chemical modification of the “extreme surface”), or again the passivation of surfaces (that is the protection against physical and/or chemical attack of the latter).","These applications concern notably the micro-electronics and semi-conductor domain, but also e.g.","the fabrication of flat screens and photovoltaic panels.","SUMMARY A plasma is a partially ionized gas containing electrically charged species (ions and electrons) as well as electrically neutral but very chemically active species, free radicals: these are atoms and molecules in an electronically “excited” state but not having lost an electron.","By means of these radicals and/or ions and of a controlled vacuum environment, the plasma offers unique possibilities for the depositing, etching and removal of materials.","At the current time, there exist two dominant types of plasma technology for the surface processing of semi-conductors: micro-wave plasmas and inductively coupled plasmas.","Each of the present technologies presents advantages and inconveniences.","The principal advantage of micro-wave plasmas comes from their ability to generate a high density of active chemical species (greater than 1017 cm−3).","This technology presents numerous inconveniences, however, such as the complexity of the plasma source and the non-uniformity of the processing.","The plasma source necessitates the vertical assembly of numerous parts (wave-guide, magnetron, etc.","), that generates a significant bulk and renders it unreliable.","In addition, the plasma source is positioned upstream (with respect to the gas flow) and in the center of a processing chamber, and this provides insufficient uniformity of the density of active plasma species, and therefore the processing of the substrate (positioned in the processing chamber), between the center of the chamber (where the density of active species is very high) and its edge (where the density of active species is very low).","Moreover, this type of plasma source presents the inconvenience of requiring very high electrical power, as well as very high gas flow-rates.","All these inconveniences make this plasma process expensive, difficult to make reliable and difficult to control.","Inductively Coupled Plasmas or ICPs are easier to implement than micro-wave plasmas: the technology is simpler, less expensive and more easily controllable than micro-wave technology.","However, the principal inconvenience of this technology comes from the low density of chemically active species (about 1015 cm−3) thus obtained.","Moreover, like micro-wave plasmas, ICP plasmas suffer from the problem of non-uniformity in the density of active species between the center of the chamber (where the density of active species is higher) and its edge (where the density of active species is lower), that makes the surface processing non-uniform.","Processing speeds required by users impose the use of high power RF generators that are very costly and which lead to the heating of the gases used.","Lastly, depending upon the design of the processing chamber, the plasma generated by the ICP sources can induce significant ionic bombardment of the substrates (for example semi-conductor wafers) whether voluntarily (RIE mode (reactive ion etching)) or not.","One of the major problems encountered by current plasma technologies is therefore that of the non-uniformity of the density of active species and consequently that of the design of a device adapted to the increase in size of substrates (or scale-up).","In fact, the passage from 200 mm diameter substrates to 300 mm diameter substrates has already been difficult and very costly for equipment manufacturers implementing plasma technology.","This change of size of substrates has in fact necessitated a considerable increase in the size of plasma sources whether Inductively Coupled plasma sources (or ICP) or micro-wave sources, and the addition of miscellaneous parts such as diffusers or magnets to artificially reduce the lack of uniformity.","These two technologies (ICP and micro-wave) are therefore very costly today and complex for the users thereof, the manufacturers of semiconductors.","The feasibility of passage from 300 mm diameter substrates to 450 mm diameter substrates is therefore a complex problem that still remains to be solved.","Moreover, ICP and micro-wave sources attain a rate of dissociation of the gas that does not exceed 30%, which causes considerable dilution of the active species generated and very high consumption of gas.","They are used in a unitary fashion: a single source is used per processing chamber and the size of the source is proportional to the volume treated.","All of this imposes the implementation of voluminous sources that operate at high power, creating undesirable thermal effects on the substrates and significantly increasing the cost of these systems.","Amongst these two types of sources, micro-wave plasmas are the most dense in terms of chemically active species but control of the process is difficult.","Consequently, ICP plasma technology at medium chemically active species density is dominant today.","Moreover, plasmas contain, other than free radicals that are electrically neutral, ions, electrons and UV radiation in the form of energetic photons that damage semi-conductor devices.","The latter become more and more sensitive to this damage with miniaturization on the nanometer scale.","The presence of metal on the substrate (or “wafer”) can produce the risk of coupling with the micro-waves and very high heating that damages the components.","This is the case of ultra-sensitive structures of micro-electro-mechanical systems (also designated by the acronym MEMS), as well as three-dimensional assemblies and interconnections that will be implemented in future generations of semi-conductors.","Lastly, in the framework of the fabrication of integrated circuits, it is known to plasma process semi-conductor devices composed of an assembly of very different materials, present notably in the form of a stack of thin layers.","To fabricate an integrated circuit from a semi-conductor device, the plasma processing must act on a single material, leaving the other materials of the assembly unaffected.","This is what is called selectivity.","This characteristic is not sufficiently raised at this time, which degrades the performance of components.","For the fabrication of integrated circuits on a silicon wafer (which is the normal base material used for fabricating integrated circuit wafers), the level of integration of the integrated circuits on the nanometer scale today imposes new technologies of surface processing with extreme sensitivity, that is without consuming the other exposed materials.","The problem of selectivity is particularly important with the use of stacks of metallic grids and dielectric grids of type “high k” and dielectric interconnection networks of type “low-k”.","These materials are particularly susceptible to physico-chemical modifications and loss of material.","Up until the present, a slight loss of material caused by the surface processing was tolerated as it did not have a negative impact on the performance of the circuit and the principal objective was to clean off all undesirable materials and contaminants.","Today, the surface processing, in particular stripping and cleaning, can directly impact the performance of integrated circuits by the modification of dimensions and/or of materials.","An additional objective for surface processings is therefore to minimize and control these modifications.","The problems of selectivity have therefore been more and more present because of the decrease of the size of integrated circuits and the use of new materials, in particular for logic components, typically microprocessors, and memory circuits.","Current plasma technologies suffer therefore from four major inconveniences: damage to the devices by ionized species, low density of chemically active species notably for ICP plasmas, low uniformity and lack of selectivity.","There exists therefore a real need for a plasma processing system compensating for these faults, inconveniences and obstacles of the prior art and in particular aiming to increase the selectivity of plasma processings and to improve the uniformity of plasma processings notably for substrates of large diameter such as 300 or 450 mm.","A person skilled in the art knows plasma processing systems using a plurality of plasma sources, such as e.g.","that described in the American patent application US 2005/0178746.The system aims to improve the uniformity of the plasma processing by putting in parallel a plurality of plasma sources emitting the same chemically homogeneous plasma.","The present invention has therefore the subject matter of supplying a system for the plasma processing of an object and a process implementing such a device that will remedy these inconveniences.","To resolve these faults and inconveniences, the applicant has developed a system of plasma processing comprising a processing vacuum chamber and a plurality of plasma sources configured in independent subassemblies each generating a chemically different plasma.","More particularly, the present invention has as subject matter a system for plasma processing of an object, said system comprising: a processing vacuum chamber comprising a support on which the object to be processed is placed; and at least two subassemblies each comprising at least one plasma source allowing a plasma to be generated, each plasma source of a subassembly being supplied independently by radiofrequency power Pi and by a flow-rate ni of gas i.","According to the invention, the plasma generated by a subassembly is a partially ionized gas or gas mixture of different chemical nature from the plasma generated by the other subassembly or subassemblies.","Advantageously, each plasma source of a subassembly comprises: a gas inlet system; a discharge chamber in a material inert to the plasma, e.g.","in the form of a tube; a device for coupling the radiofrequency (RF) power to the discharge chamber; and a gas outlet.","Advantageously, a control device controls each of the subassemblies depending upon a specific configuration by application of radiofrequency power Pi and/or a flow-rate of gas ni, specific to each subassembly.","Advantageously, each subassembly comprises a gas inlet specific to the subassembly connected to the gas inlet of each plasma source of the subassembly.","Advantageously, each subassembly comprises a conductor element connected to the coupling device of each plasma source of the subassembly.","Advantageously, the subassemblies are arranged as concentric rings.","Advantageously, the subassemblies are arranged in parallel.","Advantageously, in each subassembly comprising at least two plasma sources, each plasma source comprises at least two discharge chambers in series.","The present invention also has the subject matter of a selective plasma processing method for processing a composite object comprising at least two different materials A and B, said process implementing a processing system according to the invention and comprising the following steps: a step of generating a first plasma by a first of the subassemblies and processing of the object using said first plasma; a step of generating a second plasma by a second of the subassemblies and processing of the object using said second plasma; By composite object, it is understood, as defined by the present invention, an assembly of materials of very different nature, being able notably to take the form of a stack of thin films.","As an example of composite objects able to be processed by the process of the invention, semiconductor-devices, and in particular, silicon wafers comprising transistor structures and materials and other constituting elements of integrated circuits overlapped by one or a plurality of silicon oxide SiO2 layers overlapped by silicon nitride Si3N4, can be cited.","Advantageously, the steps of generation of plasma are repeated alternately, or with a partial or total overlap, and preferably with a partial overlap of steps of at most 25%.","According to a particularly advantageous embodiment, the process according to the invention may consist of an etching treatment of the composite object, said composite object comprising at least two layers of different materials A and B, the layer of material A overlapping at least partially the layer of material B, said process comprising; the processing using the first plasma of at least a first zone of the object comprising, on the surface, the material B, said processing using the first plasma consisting of a step of passivation or activation of material B, and the processing using the second plasma of at least a second zone of the object comprising, on the surface, the material A, said processing using the second plasma consisting of a partial or total removal of material A, that can lead to the formation of a zone comprising the material B on the surface when the removal of the material A is total, said process able to start either with a step of passivation or activation using the first plasma, or with a step of removal using the second plasma.","As an example of a composite object being selectively etched according to the process of the invention, spacers (more particularly the thinning or removal of spacers), STI (“Shallow Trench Isolation”) structures (more particularly the total or partial removal “pull back” of the STI mask), transistors and advanced CMOS circuits (processors, memories) comprising layers of silicon nitride Si3N4 (material A) on layers of silicon oxide SiO2 (material B) can be cited, the silicon nitride often being a sacrificial material.","This embodiment of the process of the invention presents the major advantage of allying high selectivity with a high etching speed.","Selectivity is understood in the present invention to be the ratio of the speed of etching of the target material (material A, e.g.","Si3N4) to the speed of etching of another exposed material or material that can be exposed during the processing (here the material B, for example SiO2), that ideally should not be etched.","This is a fundamental property of processes of removal of material (or etching) that is critical as much for “dry” type processes such as the plasma process according to the invention as for “wet” processes e.g.","using phosphoric acid.","For example, the fabrication of advanced CMOS circuits (processors, memories) necessitates the removal of silicon nitride Si3N4 with very high selectivity, in particular compared to SiO2 and/or Si: the removal of Si3N4 must not damage the other materials.","At this time, the two processes used to perform this step of the removal of silicon nitride are on the one hand “wet” processes using phosphoric acid, and on the other hand, “dry” plasma processes with a fluorocarbon plasma containing a gas mixture CxFyHz/O2/H2/N2.These current processes do not allow a very high selectivity in the removal of silicon nitride to be achieved as it is typically only 50.Moreover, the fabrication of an Si3N4 spacer is done by directional etching of the previously deposited Si3N4 layer.","According to the scientific research article “Plasma Etch Challenges for FinFET transistors” published by the company Lam in the journal, Solid State Technology—April 2012 (pages 15, 16, 17 and 26), the principal difficulty of current etching processes resides in obtaining a spacer with a very specific shape, without consuming the silicon substrate.","The solution proposed in this article for obtaining this objective consists in modulating the plasma conditions (“time modulation of plasma parameters”).","For example, sync pulsing is a technique consisting of switching on/off the power of the RF source and the RF power of the substrate carrier with a period of about 100 .mu.s.","This type of directional etching is often used for the later removal of the spacer.","However, such a process presents the inconvenience of inducing a loss of silicon at the foot of the spacer as well as the faceting of neighboring patterns such as the edge of the active area or the edge of the grid.","The etching process according to the invention resolves the inconveniences of the prior art and allows the allying of a high sensitivity with a high etching speed.","Advantageously the steps of processing using the first plasma and the processing using the second plasma are performed in an alternate manner according to a periodicity varying between 0.5 second and 120 seconds, and preferably from 2 to 30 seconds, so as to repeat the sequence of the plasma processing steps a plurality of times until the desired removal of material A is obtained.","Advantageously the ratio of the duration of the activation step or the passivation step to the duration of the removal varies between 0.1 and 10 and preferably between 0.5 and 2.The subject matter of the present invention is again an etched composite object likely to be obtained by the process of etching such as defined above.","It could be notably an integrated-circuit wafer, or a substrate for a flat screen, or a substrate for solar cells, or a substrate for an electronically printed device.","BRIEF DESCRIPTION OF THE DRAWINGS Other advantages and particularities of the present invention will result from the following description, given as a non-limiting example and made with reference to the attached figures and to the examples: FIG.","1 is a cross-sectional functional view of a processing chamber according to an embodiment corresponding to a plasma processing system of the prior art; FIG.","2 is a cross-sectional functional view of a plasma source of the system shown in FIG.","1; FIG.","3 is a functional perspective view of a configuration of plasma sources in two independent subassemblies according to an embodiment of the invention; FIG.","4 is a perspective functional view of a plasma source of a system of plasma processing according to another embodiment of the invention, comprising two discharge chambers in series; FIG.","5 shows a plasma etching machine of the prior art, that is implemented in the comparative example 2; FIG.","6 shows another plasma etching machine of the prior art, that is implemented in the comparative example 3; FIG.","7 shows the selectivity and etching speed obtained by the process implementing the machine of FIG.","6 (comparative example 3); FIG.","8 shows the evolutions of the etching speed and of the selectivity as a function of the gas mixture measured during the process implemented in the comparative example 3; FIGS.","9 and 10 show the use of two plasma source assemblies of the device according to the invention implemented in the examples according to the invention; FIGS.","11A, 11B, 11C shown the timing chart of the operation of the two subassemblies of FIG.","10; FIGS.","12 to 14 show the results obtained with the process described in the examples according to the invention and implementing the device shown schematically in FIGS.","9 and 10; and FIG.","15 shows the result of the etching according to the process described on a silicon oxide layer overlapped with silicon nitride for the fabrication of insulating composite structures.","DETAILED DESCRIPTION Such as shown in FIG.","1, a device for plasma processing according to the prior art consists of different elements: a processing chamber 10, an assembly 20 of plasma sources 201, 202, 203, a system of gas dispersion gas 30 and/or of isolation of the processing chamber 10 from damaging species generated by each of the plasma sources, a gas confinement system 31, and a pumping system 40.The processing chamber 10 is composed of a chamber of specially processed material so as not to interact with the active species created in the plasma and with a shape adapted to the processing of the desired parts, that could be cylindrical, cubic or of another form that will allow the industrial use of the chamber.","One of the faces of the processing chamber is intended for loading.","It is a “door”.","Other faces are intended for the entry of species, it is there that the plasma sources 201, 202, 203 are attached and another face most often opposite the sources or at the base of the chamber 10 is intended for pumping the chamber.","Each plasma source, such as represented in FIG.","2, is here composed of a gas inlet system 25, a discharge chamber in the form of a tube 201, 202, 203 and a material, inert to the plasma and the diameter of which is adapted to optimize the transfer of radiofrequency power by induction via a coupling device 26 (e.g.","an antenna) with several coils connected to a tuner and an RF generator upstream, and an insulating discharge capacitor downstream, not shown.","The vacuum in the processing chamber 10 necessary for the creation of the plasma and for the circulation of the gases, is obtained by pumping using a pump 40.The pump 40 is e.g.","a roughing pump or a turbomolecular pump connected to the base of the chamber 10, most often facing the sources 201, 202, 203.The gas, enriched with active species, circulates in the chamber 10 before being pumped.","In FIG.","3, a functional perspective view of a configuration of plasma sources in two independent subassemblies 21, 22 according to an embodiment of the processing system according to the invention is shown.","In the embodiment illustrated in FIG.","3, the subassemblies 21, 22 are arranged according to concentric rings.","Other configurations are, however, possible depending upon the desired final result to be obtained.","Each subassembly 21, 22 comprises at least one plasma source allowing a plasma to be generated.","FIG.","3 shows that each subassembly comprises three plasma sources 210, 211 and 212 for subassembly 21 and 220, 221 and 222 for the subassembly 22).","In the subassembly 21, each source comprises a single discharge chamber (here in the form of a tube), while in the subassembly 22, each source 220, 221 and 222 comprises two discharge chambers in series (also here in the form of tubes: tubes 2201 and 2202 as illustrated in FIG.","4).","Each plasma source of a subassembly is supplied independently by radiofrequency power Pi and by a gas i with flow-rate ni.","The plasma generated by a subassembly (e.g.","the subassembly 21) is a partially ionized gas or a gas mixture of different chemical nature from the plasma generated by the other subassembly 22.A control device controls each of the subassemblies 21, 22 depending upon a specific configuration by application of radiofrequency power and a gas flow rate specific to each subassembly.","The plasma processing system according to the invention allows the plasma sources to be controlled independently of one another by applying a different radiofrequency power and/or gas flow-rate for each subassembly of sources, in order to be able to control the uniformity of processing, notably between the center and the edge of a part to process.","The different plasma sources 210, 211, 212, 220, 221, 222 are advantageously of small size with discharge chambers of small size, here in the form of small-diameter tubes, thus allowing their multiplication in a subassembly (in the case where a source comprises a single discharge chamber, here in the form of a tube) or the multiplication of sources (in the case where a source comprises discharge chambers in series).","The multiplication of sources in addition allows the number of active species generated by said subassembly in the processing chamber to be increased.","It also allows the processing to be optimized and homogenized even for large-diameter wafers.","In fact, by the adequate combination of the diffusion cones of the sources, using their overlap and/or their superposition, and by the management of the circulation of gas via the pumping of the chamber, it is possible to obtain a uniform processing of the surfaces.","On the other hand, these plasma sources can be placed in different strategic places so as to correspond to the form to be processed, for the optimization of its processing or the uniformity of its processing.","With regard to the configuration of the plasma sources in independent subassemblies, their small bulk, and the independent management of the subassemblies, both in gas and in radiofrequency power, it is possible to allocate, in the plasma processing system, different subassemblies to different geometrical zones in the processing chamber.","These zones being independent from one another, they are more or less activated, both in gas and radiofrequency power, so as to allow control of the action of the localized activated species in the processing chamber 10.Thus, in working by zone and with independent subassemblies, the geometry of the process is actively controlled.","Not only does this arrangement allow the uniformity of the process to be controlled across the substrate, but the process can be developed without limit for the size of the object to process, in particular for the diameter of wafers from 300 mm to 450 mm, by adding additional peripheral zones one after the other.","For substrates or wafers of 300 mm diameter, a processing system can be used comprising, for example, two subassemblies arranged in two concentric rings, as illustrated in FIG.","3.The central ring 21 is here comprised of three discharge chambers (here in the form of tubes 210, 211 and 212) comprising plasma sources (generally between one and six discharge chambers) arranged in the center of the source and supplied by radiofrequency power PI and by a gas comprised of a mixture of, e.g., O2, Ar, CF4, CHF3, NF3, H2O, H2, Cl2, CF3Br, CxHyFz, etc., mixed in a block F1, where F1 implements a mixing operation with a gas 1 of flow-rate 1.1, a gas 2 of flow-rate 2.1, a gas 3 of flow-rate 3.1, etc.","up to a gas n of flow-rate n.1.A second ring 22 surrounds the central ring, that is comprised of, for example, three sources (but preferably between four and eight sources), each comprising two discharge chambers in series, the ring 22 being concentric with the central ring 21.The different discharge chambers (here in the form of tubes) of the ring 22 are supplied by radiofrequency power P2 and by a gas mixed in a block F2, here a mixture of e.g.","gaseous O2, Ar, CF4, CHF3, NF3, H2O, Hz, Cl2, CF3Br, CxHyFz, etc., where the block F2 implements a mixing operation with a gas 1 of flow-rate 1.2, a gas 2 of flow-rate 2.2, a gas 3 of flow-rate 3.2, etc.","up to a gas n of flow-rate n.2.It is possible also to use three or more zones, in 300 mm.","For wafers of 450 mm in diameter, one or several concentric rings of plasma sources can advantageously be added (each ring corresponding to a subassembly) to those already existing depending upon the requirements of uniformity, using the same principle.","For example, a third ring 23 can be used, surrounding the ring 22 previously described, this ring 23 comprising eight to sixteen discharge chambers (here in the form of tubes), the tubes being supplied by radiofrequency power P3 and by gases mixed in a block F3, said gases being for example O2, Ar, CF4, CHF3, NF3, H2O, H2, Cl2, CF3Br, CxHyFz, etc., where the block F3 implements a mixing operation with a gas 1 of flow-rate 1.3, a gas 2 of flow-rate 2.3, a gas 3 of flow-rate 3.3, etc.","up to a gas n of flow-rate n.3.The uniformity of the processes is ensured by the independent control of different zones of the source in terms of gas flow-rate F1, F2, F3 and radiofrequency power P1, P2, P3.For that, each ring corresponds to a subassembly of sources, which subassembly comprises a gas inlet that is specific to said subassembly, connected to the gas inlet of each plasma source of the subassembly considered.","A control device controls the flow-rate of gas in the gas inlet of each subassembly.","The control device additionally controls the mixture of gas injected in the gas inlet of each subassembly.","In terms of electrical implementation, each subassembly comprises here a conducting element connected to the antenna 26 of each discharge chamber (here in the form of a tube) of the subassembly.","The control device controls the radiofrequency power supplied to the conducting element of a subassembly.","According to an advantageous arrangement, in addition, the substrate is turned to average the speed of processing and thus to improve uniformity.","According to another advantageous arrangement, concentric rings in anodized aluminum or quartz are typically added between each source and the substrate to process, typically in the upper part of the processing chamber 10, these rings being showerheads, such showerheads being used currently in semi-conductor fabrication equipment, to distribute the injection of chemical species over hundreds of injection points.","Such rings are formed, with small holes pierced into the lower face thereof, opposite the substrate to process.","In the present case, they allow the uniformity of the processing to be improved even more and even reduce the number of discharge chambers necessary to process a substrate of 300 mm and 450 mm.","According to another advantageous arrangement, the parameters of the gas flow-rate and radiofrequency power are adjusted from a measurement of the performance in terms of uniformity of the process.","Using a device for measuring the local performances of the process, whether for example directly by spectroscopy or indirectly by thickness measurement, it is possible, by multiplexing the sources, to actively correct the process so as to optimize the quality of the processing in terms of speed, of homogeneity and of uniformity while guaranteeing the innocuousness of the processing.","Such an adjustment of parameters of gas flow and of radiofrequency power is e.g.","performed in the form of a closed cycle or in the form of a feed forward cycle.","A feed forward adjustment consists here in measuring the state of the surface of the wafer prior to processing (such as e.g.","the thickness of the resin) so as to adjust the processing parameters to compensate for the non-uniformity already present.","The closed cycle consists here of measuring the state of the surface of the wafer following processing in order to adjust the process parameters before processing the following wafer.","The advantages brought by the plasma processing system described are notably a better uniformity and a better efficiency in terms of processing speed.","In addition, the multiplexing of sources allows independent control of the flow of active species in terms of quantity, dissociation rate, chemical composition and of energy over certain work zones and thus allows the processing of sensitive components to be actively corrected.","The system, therefore, allows substrates to be processed without limit of size, which procures a very large potential of applications, beyond the applications of cleaning and stripping.","The system also allows a uniform distribution of the gaseous flux of active species to be obtained.","It allows the efficiency of residue cleaning and etching speeds to be improved, while increasing considerably the selectivity compared to current performances.","The selectivity is the ratio of the etching speed of the target material (e.g.","silicon nitride Si3N4) to the etching speed of another exposed material, that ideally must not be etched (e.g.","silicon oxide SiO2).","Selectivity is critical and must be constantly increased, with the appearance of new generations of technology.","The device, with the multiple discharge chambers thereof, (here in the form of tubes) allows the selectivity of plasma processes to be increased by independently controlling the etching speed of the target material and that of one or more other exposed materials.","The device allows infinite selectivity to be obtained.","In particular, the alternate use or partial overlap of a stripping plasma generated by a subassembly and of a passivation plasma generated by another subassembly allows this selectivity to be substantially increased.","EXAMPLES Products Silicon semiconductor substrates (wafers), overlapped by a layer of silicon nitride (Si3N4) as target material to be etched, and by a layer of silicon oxide SiO2 as material not to be etched, or by composite zones of the preceding materials; Silicon semiconductor substrates (wafers), overlapped by a layer of silicon oxide SiO2 (material not to be etched) overlapped by a layer of Si3N4 (target material to be etched); Silicon semiconductor substrates (wafers) comprising composite zones of the preceding stacks Test: Measurement of Selectivity The selectivity is measured by taking the ratio, after processing, of the thickness removed from material A compared to the thickness removed from material B for the same processing time.","This can also be expressed in the form of the ratio of the etching or stripping speeds of the two materials.","Comparative Example 1 Substrates of silicon overlapped by a layer of silicon nitride (Si3N4) and substrates of silicon overlapped by a layer of silicon oxide (SiO2) have been respectively etched by phosphoric acid wet processing.","Results A selectivity of 50:1 was obtained.","Comparative Example 2 In order to determine the etching speed of SiO2, an Si substrate covered only in SiO2 is used, i.e.","SiO2/Si, from which SiO2 is partially removed.","In order to determine the etching speed of Si3N4 an Si substrate covered only in Si3N4 is used, i.e.","Si3N4/Si or most frequently an Si substrate with Si3N4 on SiO2 i.e.","Si3N4/SiO2/Si, from which Si3N4 is partially removed.","The process is then applied to the real structure on an Si substrate.","The real structure is most often a composite, that is to say made of SiO2 zones and Si3N4/SiO2 zones.","The geometry and the topography of the zones depend on the fabrication step (FIG.","15 is an example thereof).","Test wafers such as described above were etched by the plasma process of the prior art presented by the IMEC R&D Centre (Belgium) during the PESM 2012 conference in Grenoble.","The plasma etching processing was performed in an etching machine of the company Lam Research such as illustrated in FIG.","5: it comprises a single discharge chamber and a single chemistry.","Results plasma (gas mixture used) NF3/02/CH3F Speed v1 of etching of Si3N4 44 nm/min Speed v2 of etching of SiO2 0.8 nm/min Selectivity v1/v2 55:1 Comparative Example 3 The applicant has performed selective etching experiments of Si3N4 based on equipment comprising a plasma source comprised of several discharge chambers (here in the form of tubes) such as illustrated in FIG.","6.In this device, the discharge tubes are all connected in parallel and controlled by a single generator.","It was not possible to independently control the tubes, that is, to apply a different RF power to the different tubes.","The active gases of type O2, N2, CF4, etc.","are mixed prior to being injected into the discharge tubes.","It was also not possible to inject different gases into different tubes.","The plasma source used by the applicant, while being composed of a plurality of discharge tubes, generates a single type of plasma in the processing chamber, just like traditional plasma sources (micro-wave or by inductive coupling).","FIG.","7 demonstrates the selectivity and the etching speed as a function of different gas mixtures.","This figure shows that: the addition of O2 is the principal parameter for increasing the etching speed of Si3N4; and the addition of H2 greatly improves the Si3N4:SiO2 selectivity, but the etching speed of Si3N4 remains low.","FIG.","8 demonstrates the selectivity and the etching speed as a function of the amount of H2 in the gas mixture.","It is noted that: the etching speed of Si3N4 and the Si3N4:SiO2 selectivity are closely correlated: the etching speed of Si3N4 decreases when the SiO2 selectivity increases.","It is not possible to de-correlate the two in a traditional plasma source configuration (that is, generating a single type of plasma in the processing chamber); the etching speed of Si3N4 is about 80 .ANG./min for a selectivity Si3N4:SiO2 of 110:1; the etching speed of Si3N4 is about 250 .ANG./min for a selectivity Si3N4:SiO2 of about 35:1.Comparative examples demonstrate therefore that it is not possible to ally high selectivity with high etching speed (see the results presented in FIG.","8 and comparative example 2).","Example 1 According to the Invention Substrates of silicon covered in silicon oxide and/or covered in silicon nitride (Si3N4/SiO2) such as previously described, were etched using the plasma etching process according to an embodiment of the invention, comprising the repetition of the two following fundamental steps until obtaining the desired result: passivation step: it serves to protect (or “passivate”) certain surfaces from chemical attack taking place during the etching step.","Passivation consists of depositing, onto the substrate, a polymer of type e.g.","CxFyHz(e.g.","CF4, or C4F8 or C2F6, CHF3, CH3F, etc.","), removal or etching step: It serves to remove (“etch”) a material, either partially or entirely.","During step 2, the passivation layer can be partially or entirely removed, the duration of each step being of the order of several seconds if not several tens of seconds but also could be extremely short, of the order of 0.1 s. This process is implemented using a plasma processing device according to the invention comprising two subassemblies of different plasma sources (here represented by tubes 1 and 2 in FIG.","9), each tube performing a step (passivation or etching) of the invention (as illustrated in FIG.","10).","The time charts of the operation of each source are shown in FIGS.","11A, 11B and 11C, respectively for an operation with alternating steps of removal and passivation with no overlap, (FIG.","11A), for an operation with steps of removal and passivation with partial overlap (FIG.","11B) and steps of removal and passivation with total overlap (FIG.","11C).","As shown in FIGS.","12 to 14, the process described allows the etching speed of Si3N4 to be controlled without apparent consumption of SiO2; the etching speed of Si3N4 is about 120 .ANG./min for a selectivity Si3N4:SiO2 of about 700:1 with a CF4/O2/H2 plasma.","These tests demonstrate therefore that the plasma etching process according to the invention allows the speed of etching of Si3N4 and that of SiO2 to be controlled independently and thus very high selectivity to be obtained.","The experimental conditions of the etching tests according to the invention are detailed below and illustrated in FIGS.","11A, 11B and 11C.","Processes used per tube: values Min Max Passivation step (Tube 2) Conditions 1 RF power = 120 W 80 360 Flow-rate CF4 = 40 sccm 20 80 Flow-rate H, = 13.5 sccm 5 30 tON2 = 20 sec 2 35 Period 2 = 35 sec 3 80 Conditions 2 RF power = 360 W 120 360 Flow-rate C4F8 = 45 sccm 20 50 Flow-rate 02 = 5 sccm 20 tON2 = 20 sec 35 Period 2 = 35 sec 80 Conditions 3 RF power = 240 W 120 360 Flow-rate C2F6 = 30 sccm 30 70 Flow-rate 02 = 0 sccm 0 5 tON2 = 20 sec 2 35 Period 2 = 35 sec 3 50 Removal step (Tube 1) Conditions 1 RF power = 120 W 120 360 Flow-rate CF4 = 40 sccm 20 80 Flow-rate 02 = 5 sccm 0 10 tON1 = 15 sec 1 35 Period 1 = 35 sec 3 85 Conditions 2 RF power = 240 W 120 360 Flow-rate CHF3 = 40 sccm 0 100 Flow-rate 02 = 30 sccm 0 60 tON1 = 15 sec 1 35 Period 1 = 35 sec 3 85 Other Parameters: Temperature of substrate=between 135° C. and 150° C. Pressure=200 mTorr to 1 Torr Total processing time=from 1 min to 3 min RF power=50 to 1000 W/discharge tube and up to 5000 W for a subassembly composed of a plurality of discharge tubes.","Gas flow-rate=1 sccm to 5000 sccm tON=0.1 sec to 30 sec Other Plasma Gases that can be Used in the Frame of the Present Invention: for the passivation step: CF4, CHF3, CH3F, C2F6, C4F8, CF3Br, HBr with or without Hz, with or without N2, and their mixtures for the etching step: CF4, CHF3, CH3F, NF3, Cl2, HBr, SF6, with or without O2, with or without N2, and their mixtures Additive gases: O2, N2, Ar, Hz, Xe, He Example 2 According to the Invention From substrates composed of silicon covered by silicon oxide and/or covered in silicon nitride, the silicon nitride Si3N4 layer, serving as a mask for the fabrication of composite so-called STI (shallow trench isolation) structures, was selectively etched.","To do this, the sequence of steps of passivation and removal implementing conditions 1 of example 1 was repeated eight times, for a period of 7 and 15 seconds respectively.","The composite structure before the removal is illustrated in FIG.","15A (left), while that after processing is illustrated in FIG.","15B (right).","Silicon nitride Si3N4 is referenced as 151 and silicon oxide as 153.A suppression of silicon nitride is noted while the silicon oxide is intact."]],"string":"[\n [\n \"Device for Treating an Object with Plasma\",\n \"A system for treating an object with plasma includes a vacuum processing chamber having a holder on which the object to be treated is placed, at least two subassemblies each including at least one plasma source able to generate a plasma and being supplied with radio-frequency power Pi and with a gas i of independent flow rate ni.\",\n \"The plasma generated by one of the subassemblies is a partially ionized gas or gas mixture of different chemical nature from the plasma generated by the other subassembly or subassemblies.\",\n \"A process for selectively treating a composite object employing such a device is described.\"\n ],\n [\n \"1.A system for the treatment of an object by plasma comprising: a treatment vacuum chamber having a support on which the object to be treated is placed; and at least two subassemblies each comprising at least one plasma source allowing a plasma to be generated, each plasma source of a subassembly being supplied by radio frequency power Pi and independently by a gas i at a flow-rate ni, wherein plasma generated by one subassembly is a partially ionized gas or a gas mixture, of a different chemical nature from plasma generated by the other subassembly or subassemblies.\",\n \"2.The system according to claim 1 wherein each source of plasma of a subassembly comprises: a gas inlet system; a discharge chamber made of a plasma-inert material; a device for coupling the radiofrequency (RF) power to the discharge chamber; and a gas outlet.\",\n \"3.The system according to claim 1 further comprising a control device to control each of the subassemblies depending upon a specific parameterization by application of radiofrequency power Pi and/or a flow-rate of gas ni specific to each subassembly.\",\n \"4.The system according to claim 1 wherein each subassembly comprises a gas inlet specific to the subassembly connected to the gas inlet of each plasma source of the subassembly.\",\n \"5.The system according to claim 1 wherein each subassembly comprises a conducting element connected to the coupling device of each plasma source of the subassembly.\",\n \"6.The system according to claim 1 wherein the subassemblies are arranged along concentric rings.\",\n \"7.The system according to claim 1 wherein the subassemblies are arranged in parallel.\",\n \"8.The system according to claim 7 wherein each subassembly comprises at least two plasma sources, each plasma source comprising two chambers in series.\"\n ],\n [\n \" BACKGROUND The invention concerns the domain of plasma surface processing.\",\n \"By plasma surface processing is understood, in the sense of the present invention, different types of applications.\",\n \"Applications can notably be cited consisting of the removal (or etching) of materials (and in particular materials such as photosensitive resins, metals, dielectrics or again semiconductors, etc.\",\n \"), the etching of structures such as holes or trenches in a silicon substrate or a layer comprised of metals, dielectrics or other substances, typically following a surface pattern printed in a photosensitive resin by photolithography, or again applications consisting of the removal of sacrificial layers.\",\n \"Applications can again be cited consisting of the cleaning of residues and of contaminants, or the activation of surfaces (that is the physical and/or chemical modification of the “extreme surface”), or again the passivation of surfaces (that is the protection against physical and/or chemical attack of the latter).\",\n \"These applications concern notably the micro-electronics and semi-conductor domain, but also e.g.\",\n \"the fabrication of flat screens and photovoltaic panels.\"\n ],\n [\n \" SUMMARY A plasma is a partially ionized gas containing electrically charged species (ions and electrons) as well as electrically neutral but very chemically active species, free radicals: these are atoms and molecules in an electronically “excited” state but not having lost an electron.\",\n \"By means of these radicals and/or ions and of a controlled vacuum environment, the plasma offers unique possibilities for the depositing, etching and removal of materials.\",\n \"At the current time, there exist two dominant types of plasma technology for the surface processing of semi-conductors: micro-wave plasmas and inductively coupled plasmas.\",\n \"Each of the present technologies presents advantages and inconveniences.\",\n \"The principal advantage of micro-wave plasmas comes from their ability to generate a high density of active chemical species (greater than 10 17 cm −3 ).\",\n \"This technology presents numerous inconveniences, however, such as the complexity of the plasma source and the non-uniformity of the processing.\",\n \"The plasma source necessitates the vertical assembly of numerous parts (wave-guide, magnetron, etc.\",\n \"), that generates a significant bulk and renders it unreliable.\",\n \"In addition, the plasma source is positioned upstream (with respect to the gas flow) and in the center of a processing chamber, and this provides insufficient uniformity of the density of active plasma species, and therefore the processing of the substrate (positioned in the processing chamber), between the center of the chamber (where the density of active species is very high) and its edge (where the density of active species is very low).\",\n \"Moreover, this type of plasma source presents the inconvenience of requiring very high electrical power, as well as very high gas flow-rates.\",\n \"All these inconveniences make this plasma process expensive, difficult to make reliable and difficult to control.\",\n \"Inductively Coupled Plasmas or ICPs are easier to implement than micro-wave plasmas: the technology is simpler, less expensive and more easily controllable than micro-wave technology.\",\n \"However, the principal inconvenience of this technology comes from the low density of chemically active species (about 10 15 cm −3 ) thus obtained.\",\n \"Moreover, like micro-wave plasmas, ICP plasmas suffer from the problem of non-uniformity in the density of active species between the center of the chamber (where the density of active species is higher) and its edge (where the density of active species is lower), that makes the surface processing non-uniform.\",\n \"Processing speeds required by users impose the use of high power RF generators that are very costly and which lead to the heating of the gases used.\",\n \"Lastly, depending upon the design of the processing chamber, the plasma generated by the ICP sources can induce significant ionic bombardment of the substrates (for example semi-conductor wafers) whether voluntarily (RIE mode (reactive ion etching)) or not.\",\n \"One of the major problems encountered by current plasma technologies is therefore that of the non-uniformity of the density of active species and consequently that of the design of a device adapted to the increase in size of substrates (or scale-up).\",\n \"In fact, the passage from 200 mm diameter substrates to 300 mm diameter substrates has already been difficult and very costly for equipment manufacturers implementing plasma technology.\",\n \"This change of size of substrates has in fact necessitated a considerable increase in the size of plasma sources whether Inductively Coupled plasma sources (or ICP) or micro-wave sources, and the addition of miscellaneous parts such as diffusers or magnets to artificially reduce the lack of uniformity.\",\n \"These two technologies (ICP and micro-wave) are therefore very costly today and complex for the users thereof, the manufacturers of semiconductors.\",\n \"The feasibility of passage from 300 mm diameter substrates to 450 mm diameter substrates is therefore a complex problem that still remains to be solved.\",\n \"Moreover, ICP and micro-wave sources attain a rate of dissociation of the gas that does not exceed 30%, which causes considerable dilution of the active species generated and very high consumption of gas.\",\n \"They are used in a unitary fashion: a single source is used per processing chamber and the size of the source is proportional to the volume treated.\",\n \"All of this imposes the implementation of voluminous sources that operate at high power, creating undesirable thermal effects on the substrates and significantly increasing the cost of these systems.\",\n \"Amongst these two types of sources, micro-wave plasmas are the most dense in terms of chemically active species but control of the process is difficult.\",\n \"Consequently, ICP plasma technology at medium chemically active species density is dominant today.\",\n \"Moreover, plasmas contain, other than free radicals that are electrically neutral, ions, electrons and UV radiation in the form of energetic photons that damage semi-conductor devices.\",\n \"The latter become more and more sensitive to this damage with miniaturization on the nanometer scale.\",\n \"The presence of metal on the substrate (or “wafer”) can produce the risk of coupling with the micro-waves and very high heating that damages the components.\",\n \"This is the case of ultra-sensitive structures of micro-electro-mechanical systems (also designated by the acronym MEMS), as well as three-dimensional assemblies and interconnections that will be implemented in future generations of semi-conductors.\",\n \"Lastly, in the framework of the fabrication of integrated circuits, it is known to plasma process semi-conductor devices composed of an assembly of very different materials, present notably in the form of a stack of thin layers.\",\n \"To fabricate an integrated circuit from a semi-conductor device, the plasma processing must act on a single material, leaving the other materials of the assembly unaffected.\",\n \"This is what is called selectivity.\",\n \"This characteristic is not sufficiently raised at this time, which degrades the performance of components.\",\n \"For the fabrication of integrated circuits on a silicon wafer (which is the normal base material used for fabricating integrated circuit wafers), the level of integration of the integrated circuits on the nanometer scale today imposes new technologies of surface processing with extreme sensitivity, that is without consuming the other exposed materials.\",\n \"The problem of selectivity is particularly important with the use of stacks of metallic grids and dielectric grids of type “high k” and dielectric interconnection networks of type “low-k”.\",\n \"These materials are particularly susceptible to physico-chemical modifications and loss of material.\",\n \"Up until the present, a slight loss of material caused by the surface processing was tolerated as it did not have a negative impact on the performance of the circuit and the principal objective was to clean off all undesirable materials and contaminants.\",\n \"Today, the surface processing, in particular stripping and cleaning, can directly impact the performance of integrated circuits by the modification of dimensions and/or of materials.\",\n \"An additional objective for surface processings is therefore to minimize and control these modifications.\",\n \"The problems of selectivity have therefore been more and more present because of the decrease of the size of integrated circuits and the use of new materials, in particular for logic components, typically microprocessors, and memory circuits.\",\n \"Current plasma technologies suffer therefore from four major inconveniences: damage to the devices by ionized species, low density of chemically active species notably for ICP plasmas, low uniformity and lack of selectivity.\",\n \"There exists therefore a real need for a plasma processing system compensating for these faults, inconveniences and obstacles of the prior art and in particular aiming to increase the selectivity of plasma processings and to improve the uniformity of plasma processings notably for substrates of large diameter such as 300 or 450 mm.\",\n \"A person skilled in the art knows plasma processing systems using a plurality of plasma sources, such as e.g.\",\n \"that described in the American patent application US 2005/0178746.The system aims to improve the uniformity of the plasma processing by putting in parallel a plurality of plasma sources emitting the same chemically homogeneous plasma.\",\n \"The present invention has therefore the subject matter of supplying a system for the plasma processing of an object and a process implementing such a device that will remedy these inconveniences.\",\n \"To resolve these faults and inconveniences, the applicant has developed a system of plasma processing comprising a processing vacuum chamber and a plurality of plasma sources configured in independent subassemblies each generating a chemically different plasma.\",\n \"More particularly, the present invention has as subject matter a system for plasma processing of an object, said system comprising: a processing vacuum chamber comprising a support on which the object to be processed is placed; and at least two subassemblies each comprising at least one plasma source allowing a plasma to be generated, each plasma source of a subassembly being supplied independently by radiofrequency power Pi and by a flow-rate ni of gas i.\",\n \"According to the invention, the plasma generated by a subassembly is a partially ionized gas or gas mixture of different chemical nature from the plasma generated by the other subassembly or subassemblies.\",\n \"Advantageously, each plasma source of a subassembly comprises: a gas inlet system; a discharge chamber in a material inert to the plasma, e.g.\",\n \"in the form of a tube; a device for coupling the radiofrequency (RF) power to the discharge chamber; and a gas outlet.\",\n \"Advantageously, a control device controls each of the subassemblies depending upon a specific configuration by application of radiofrequency power Pi and/or a flow-rate of gas ni, specific to each subassembly.\",\n \"Advantageously, each subassembly comprises a gas inlet specific to the subassembly connected to the gas inlet of each plasma source of the subassembly.\",\n \"Advantageously, each subassembly comprises a conductor element connected to the coupling device of each plasma source of the subassembly.\",\n \"Advantageously, the subassemblies are arranged as concentric rings.\",\n \"Advantageously, the subassemblies are arranged in parallel.\",\n \"Advantageously, in each subassembly comprising at least two plasma sources, each plasma source comprises at least two discharge chambers in series.\",\n \"The present invention also has the subject matter of a selective plasma processing method for processing a composite object comprising at least two different materials A and B, said process implementing a processing system according to the invention and comprising the following steps: a step of generating a first plasma by a first of the subassemblies and processing of the object using said first plasma; a step of generating a second plasma by a second of the subassemblies and processing of the object using said second plasma; By composite object, it is understood, as defined by the present invention, an assembly of materials of very different nature, being able notably to take the form of a stack of thin films.\",\n \"As an example of composite objects able to be processed by the process of the invention, semiconductor-devices, and in particular, silicon wafers comprising transistor structures and materials and other constituting elements of integrated circuits overlapped by one or a plurality of silicon oxide SiO 2 layers overlapped by silicon nitride Si 3 N 4 , can be cited.\",\n \"Advantageously, the steps of generation of plasma are repeated alternately, or with a partial or total overlap, and preferably with a partial overlap of steps of at most 25%.\",\n \"According to a particularly advantageous embodiment, the process according to the invention may consist of an etching treatment of the composite object, said composite object comprising at least two layers of different materials A and B, the layer of material A overlapping at least partially the layer of material B, said process comprising; the processing using the first plasma of at least a first zone of the object comprising, on the surface, the material B, said processing using the first plasma consisting of a step of passivation or activation of material B, and the processing using the second plasma of at least a second zone of the object comprising, on the surface, the material A, said processing using the second plasma consisting of a partial or total removal of material A, that can lead to the formation of a zone comprising the material B on the surface when the removal of the material A is total, said process able to start either with a step of passivation or activation using the first plasma, or with a step of removal using the second plasma.\",\n \"As an example of a composite object being selectively etched according to the process of the invention, spacers (more particularly the thinning or removal of spacers), STI (“Shallow Trench Isolation”) structures (more particularly the total or partial removal “pull back” of the STI mask), transistors and advanced CMOS circuits (processors, memories) comprising layers of silicon nitride Si 3 N 4 (material A) on layers of silicon oxide SiO 2 (material B) can be cited, the silicon nitride often being a sacrificial material.\",\n \"This embodiment of the process of the invention presents the major advantage of allying high selectivity with a high etching speed.\",\n \"Selectivity is understood in the present invention to be the ratio of the speed of etching of the target material (material A, e.g.\",\n \"Si 3 N 4 ) to the speed of etching of another exposed material or material that can be exposed during the processing (here the material B, for example SiO 2 ), that ideally should not be etched.\",\n \"This is a fundamental property of processes of removal of material (or etching) that is critical as much for “dry” type processes such as the plasma process according to the invention as for “wet” processes e.g.\",\n \"using phosphoric acid.\",\n \"For example, the fabrication of advanced CMOS circuits (processors, memories) necessitates the removal of silicon nitride Si 3 N 4 with very high selectivity, in particular compared to SiO 2 and/or Si: the removal of Si 3 N 4 must not damage the other materials.\",\n \"At this time, the two processes used to perform this step of the removal of silicon nitride are on the one hand “wet” processes using phosphoric acid, and on the other hand, “dry” plasma processes with a fluorocarbon plasma containing a gas mixture C x F y H z /O 2 /H 2 /N 2 .\",\n \"These current processes do not allow a very high selectivity in the removal of silicon nitride to be achieved as it is typically only 50.Moreover, the fabrication of an Si 3 N 4 spacer is done by directional etching of the previously deposited Si 3 N 4 layer.\",\n \"According to the scientific research article “Plasma Etch Challenges for FinFET transistors” published by the company Lam in the journal, Solid State Technology—April 2012 (pages 15, 16, 17 and 26), the principal difficulty of current etching processes resides in obtaining a spacer with a very specific shape, without consuming the silicon substrate.\",\n \"The solution proposed in this article for obtaining this objective consists in modulating the plasma conditions (“time modulation of plasma parameters”).\",\n \"For example, sync pulsing is a technique consisting of switching on/off the power of the RF source and the RF power of the substrate carrier with a period of about 100 .mu.s.\",\n \"This type of directional etching is often used for the later removal of the spacer.\",\n \"However, such a process presents the inconvenience of inducing a loss of silicon at the foot of the spacer as well as the faceting of neighboring patterns such as the edge of the active area or the edge of the grid.\",\n \"The etching process according to the invention resolves the inconveniences of the prior art and allows the allying of a high sensitivity with a high etching speed.\",\n \"Advantageously the steps of processing using the first plasma and the processing using the second plasma are performed in an alternate manner according to a periodicity varying between 0.5 second and 120 seconds, and preferably from 2 to 30 seconds, so as to repeat the sequence of the plasma processing steps a plurality of times until the desired removal of material A is obtained.\",\n \"Advantageously the ratio of the duration of the activation step or the passivation step to the duration of the removal varies between 0.1 and 10 and preferably between 0.5 and 2.The subject matter of the present invention is again an etched composite object likely to be obtained by the process of etching such as defined above.\",\n \"It could be notably an integrated-circuit wafer, or a substrate for a flat screen, or a substrate for solar cells, or a substrate for an electronically printed device.\"\n ],\n [\n \"CROSS REFERENCES TO RELATED APPLICATIONS This application is a divisional of U.S. patent application Ser.\",\n \"No.\",\n \"14/415,976 entitled: Device for Treating an Object with Plasma which claims priority from and is related to commonly owned International Application No.\",\n \"PCT/FR2013/051768 filed Jul.\",\n \"22, 2013 and French Patent Application No.\",\n \"1257037 filed Jul.\",\n \"20, 2012, the entire contents of each are incorporated herein by reference.\",\n \"BACKGROUND The invention concerns the domain of plasma surface processing.\",\n \"By plasma surface processing is understood, in the sense of the present invention, different types of applications.\",\n \"Applications can notably be cited consisting of the removal (or etching) of materials (and in particular materials such as photosensitive resins, metals, dielectrics or again semiconductors, etc.\",\n \"), the etching of structures such as holes or trenches in a silicon substrate or a layer comprised of metals, dielectrics or other substances, typically following a surface pattern printed in a photosensitive resin by photolithography, or again applications consisting of the removal of sacrificial layers.\",\n \"Applications can again be cited consisting of the cleaning of residues and of contaminants, or the activation of surfaces (that is the physical and/or chemical modification of the “extreme surface”), or again the passivation of surfaces (that is the protection against physical and/or chemical attack of the latter).\",\n \"These applications concern notably the micro-electronics and semi-conductor domain, but also e.g.\",\n \"the fabrication of flat screens and photovoltaic panels.\",\n \"SUMMARY A plasma is a partially ionized gas containing electrically charged species (ions and electrons) as well as electrically neutral but very chemically active species, free radicals: these are atoms and molecules in an electronically “excited” state but not having lost an electron.\",\n \"By means of these radicals and/or ions and of a controlled vacuum environment, the plasma offers unique possibilities for the depositing, etching and removal of materials.\",\n \"At the current time, there exist two dominant types of plasma technology for the surface processing of semi-conductors: micro-wave plasmas and inductively coupled plasmas.\",\n \"Each of the present technologies presents advantages and inconveniences.\",\n \"The principal advantage of micro-wave plasmas comes from their ability to generate a high density of active chemical species (greater than 1017 cm−3).\",\n \"This technology presents numerous inconveniences, however, such as the complexity of the plasma source and the non-uniformity of the processing.\",\n \"The plasma source necessitates the vertical assembly of numerous parts (wave-guide, magnetron, etc.\",\n \"), that generates a significant bulk and renders it unreliable.\",\n \"In addition, the plasma source is positioned upstream (with respect to the gas flow) and in the center of a processing chamber, and this provides insufficient uniformity of the density of active plasma species, and therefore the processing of the substrate (positioned in the processing chamber), between the center of the chamber (where the density of active species is very high) and its edge (where the density of active species is very low).\",\n \"Moreover, this type of plasma source presents the inconvenience of requiring very high electrical power, as well as very high gas flow-rates.\",\n \"All these inconveniences make this plasma process expensive, difficult to make reliable and difficult to control.\",\n \"Inductively Coupled Plasmas or ICPs are easier to implement than micro-wave plasmas: the technology is simpler, less expensive and more easily controllable than micro-wave technology.\",\n \"However, the principal inconvenience of this technology comes from the low density of chemically active species (about 1015 cm−3) thus obtained.\",\n \"Moreover, like micro-wave plasmas, ICP plasmas suffer from the problem of non-uniformity in the density of active species between the center of the chamber (where the density of active species is higher) and its edge (where the density of active species is lower), that makes the surface processing non-uniform.\",\n \"Processing speeds required by users impose the use of high power RF generators that are very costly and which lead to the heating of the gases used.\",\n \"Lastly, depending upon the design of the processing chamber, the plasma generated by the ICP sources can induce significant ionic bombardment of the substrates (for example semi-conductor wafers) whether voluntarily (RIE mode (reactive ion etching)) or not.\",\n \"One of the major problems encountered by current plasma technologies is therefore that of the non-uniformity of the density of active species and consequently that of the design of a device adapted to the increase in size of substrates (or scale-up).\",\n \"In fact, the passage from 200 mm diameter substrates to 300 mm diameter substrates has already been difficult and very costly for equipment manufacturers implementing plasma technology.\",\n \"This change of size of substrates has in fact necessitated a considerable increase in the size of plasma sources whether Inductively Coupled plasma sources (or ICP) or micro-wave sources, and the addition of miscellaneous parts such as diffusers or magnets to artificially reduce the lack of uniformity.\",\n \"These two technologies (ICP and micro-wave) are therefore very costly today and complex for the users thereof, the manufacturers of semiconductors.\",\n \"The feasibility of passage from 300 mm diameter substrates to 450 mm diameter substrates is therefore a complex problem that still remains to be solved.\",\n \"Moreover, ICP and micro-wave sources attain a rate of dissociation of the gas that does not exceed 30%, which causes considerable dilution of the active species generated and very high consumption of gas.\",\n \"They are used in a unitary fashion: a single source is used per processing chamber and the size of the source is proportional to the volume treated.\",\n \"All of this imposes the implementation of voluminous sources that operate at high power, creating undesirable thermal effects on the substrates and significantly increasing the cost of these systems.\",\n \"Amongst these two types of sources, micro-wave plasmas are the most dense in terms of chemically active species but control of the process is difficult.\",\n \"Consequently, ICP plasma technology at medium chemically active species density is dominant today.\",\n \"Moreover, plasmas contain, other than free radicals that are electrically neutral, ions, electrons and UV radiation in the form of energetic photons that damage semi-conductor devices.\",\n \"The latter become more and more sensitive to this damage with miniaturization on the nanometer scale.\",\n \"The presence of metal on the substrate (or “wafer”) can produce the risk of coupling with the micro-waves and very high heating that damages the components.\",\n \"This is the case of ultra-sensitive structures of micro-electro-mechanical systems (also designated by the acronym MEMS), as well as three-dimensional assemblies and interconnections that will be implemented in future generations of semi-conductors.\",\n \"Lastly, in the framework of the fabrication of integrated circuits, it is known to plasma process semi-conductor devices composed of an assembly of very different materials, present notably in the form of a stack of thin layers.\",\n \"To fabricate an integrated circuit from a semi-conductor device, the plasma processing must act on a single material, leaving the other materials of the assembly unaffected.\",\n \"This is what is called selectivity.\",\n \"This characteristic is not sufficiently raised at this time, which degrades the performance of components.\",\n \"For the fabrication of integrated circuits on a silicon wafer (which is the normal base material used for fabricating integrated circuit wafers), the level of integration of the integrated circuits on the nanometer scale today imposes new technologies of surface processing with extreme sensitivity, that is without consuming the other exposed materials.\",\n \"The problem of selectivity is particularly important with the use of stacks of metallic grids and dielectric grids of type “high k” and dielectric interconnection networks of type “low-k”.\",\n \"These materials are particularly susceptible to physico-chemical modifications and loss of material.\",\n \"Up until the present, a slight loss of material caused by the surface processing was tolerated as it did not have a negative impact on the performance of the circuit and the principal objective was to clean off all undesirable materials and contaminants.\",\n \"Today, the surface processing, in particular stripping and cleaning, can directly impact the performance of integrated circuits by the modification of dimensions and/or of materials.\",\n \"An additional objective for surface processings is therefore to minimize and control these modifications.\",\n \"The problems of selectivity have therefore been more and more present because of the decrease of the size of integrated circuits and the use of new materials, in particular for logic components, typically microprocessors, and memory circuits.\",\n \"Current plasma technologies suffer therefore from four major inconveniences: damage to the devices by ionized species, low density of chemically active species notably for ICP plasmas, low uniformity and lack of selectivity.\",\n \"There exists therefore a real need for a plasma processing system compensating for these faults, inconveniences and obstacles of the prior art and in particular aiming to increase the selectivity of plasma processings and to improve the uniformity of plasma processings notably for substrates of large diameter such as 300 or 450 mm.\",\n \"A person skilled in the art knows plasma processing systems using a plurality of plasma sources, such as e.g.\",\n \"that described in the American patent application US 2005/0178746.The system aims to improve the uniformity of the plasma processing by putting in parallel a plurality of plasma sources emitting the same chemically homogeneous plasma.\",\n \"The present invention has therefore the subject matter of supplying a system for the plasma processing of an object and a process implementing such a device that will remedy these inconveniences.\",\n \"To resolve these faults and inconveniences, the applicant has developed a system of plasma processing comprising a processing vacuum chamber and a plurality of plasma sources configured in independent subassemblies each generating a chemically different plasma.\",\n \"More particularly, the present invention has as subject matter a system for plasma processing of an object, said system comprising: a processing vacuum chamber comprising a support on which the object to be processed is placed; and at least two subassemblies each comprising at least one plasma source allowing a plasma to be generated, each plasma source of a subassembly being supplied independently by radiofrequency power Pi and by a flow-rate ni of gas i.\",\n \"According to the invention, the plasma generated by a subassembly is a partially ionized gas or gas mixture of different chemical nature from the plasma generated by the other subassembly or subassemblies.\",\n \"Advantageously, each plasma source of a subassembly comprises: a gas inlet system; a discharge chamber in a material inert to the plasma, e.g.\",\n \"in the form of a tube; a device for coupling the radiofrequency (RF) power to the discharge chamber; and a gas outlet.\",\n \"Advantageously, a control device controls each of the subassemblies depending upon a specific configuration by application of radiofrequency power Pi and/or a flow-rate of gas ni, specific to each subassembly.\",\n \"Advantageously, each subassembly comprises a gas inlet specific to the subassembly connected to the gas inlet of each plasma source of the subassembly.\",\n \"Advantageously, each subassembly comprises a conductor element connected to the coupling device of each plasma source of the subassembly.\",\n \"Advantageously, the subassemblies are arranged as concentric rings.\",\n \"Advantageously, the subassemblies are arranged in parallel.\",\n \"Advantageously, in each subassembly comprising at least two plasma sources, each plasma source comprises at least two discharge chambers in series.\",\n \"The present invention also has the subject matter of a selective plasma processing method for processing a composite object comprising at least two different materials A and B, said process implementing a processing system according to the invention and comprising the following steps: a step of generating a first plasma by a first of the subassemblies and processing of the object using said first plasma; a step of generating a second plasma by a second of the subassemblies and processing of the object using said second plasma; By composite object, it is understood, as defined by the present invention, an assembly of materials of very different nature, being able notably to take the form of a stack of thin films.\",\n \"As an example of composite objects able to be processed by the process of the invention, semiconductor-devices, and in particular, silicon wafers comprising transistor structures and materials and other constituting elements of integrated circuits overlapped by one or a plurality of silicon oxide SiO2 layers overlapped by silicon nitride Si3N4, can be cited.\",\n \"Advantageously, the steps of generation of plasma are repeated alternately, or with a partial or total overlap, and preferably with a partial overlap of steps of at most 25%.\",\n \"According to a particularly advantageous embodiment, the process according to the invention may consist of an etching treatment of the composite object, said composite object comprising at least two layers of different materials A and B, the layer of material A overlapping at least partially the layer of material B, said process comprising; the processing using the first plasma of at least a first zone of the object comprising, on the surface, the material B, said processing using the first plasma consisting of a step of passivation or activation of material B, and the processing using the second plasma of at least a second zone of the object comprising, on the surface, the material A, said processing using the second plasma consisting of a partial or total removal of material A, that can lead to the formation of a zone comprising the material B on the surface when the removal of the material A is total, said process able to start either with a step of passivation or activation using the first plasma, or with a step of removal using the second plasma.\",\n \"As an example of a composite object being selectively etched according to the process of the invention, spacers (more particularly the thinning or removal of spacers), STI (“Shallow Trench Isolation”) structures (more particularly the total or partial removal “pull back” of the STI mask), transistors and advanced CMOS circuits (processors, memories) comprising layers of silicon nitride Si3N4 (material A) on layers of silicon oxide SiO2 (material B) can be cited, the silicon nitride often being a sacrificial material.\",\n \"This embodiment of the process of the invention presents the major advantage of allying high selectivity with a high etching speed.\",\n \"Selectivity is understood in the present invention to be the ratio of the speed of etching of the target material (material A, e.g.\",\n \"Si3N4) to the speed of etching of another exposed material or material that can be exposed during the processing (here the material B, for example SiO2), that ideally should not be etched.\",\n \"This is a fundamental property of processes of removal of material (or etching) that is critical as much for “dry” type processes such as the plasma process according to the invention as for “wet” processes e.g.\",\n \"using phosphoric acid.\",\n \"For example, the fabrication of advanced CMOS circuits (processors, memories) necessitates the removal of silicon nitride Si3N4 with very high selectivity, in particular compared to SiO2 and/or Si: the removal of Si3N4 must not damage the other materials.\",\n \"At this time, the two processes used to perform this step of the removal of silicon nitride are on the one hand “wet” processes using phosphoric acid, and on the other hand, “dry” plasma processes with a fluorocarbon plasma containing a gas mixture CxFyHz/O2/H2/N2.These current processes do not allow a very high selectivity in the removal of silicon nitride to be achieved as it is typically only 50.Moreover, the fabrication of an Si3N4 spacer is done by directional etching of the previously deposited Si3N4 layer.\",\n \"According to the scientific research article “Plasma Etch Challenges for FinFET transistors” published by the company Lam in the journal, Solid State Technology—April 2012 (pages 15, 16, 17 and 26), the principal difficulty of current etching processes resides in obtaining a spacer with a very specific shape, without consuming the silicon substrate.\",\n \"The solution proposed in this article for obtaining this objective consists in modulating the plasma conditions (“time modulation of plasma parameters”).\",\n \"For example, sync pulsing is a technique consisting of switching on/off the power of the RF source and the RF power of the substrate carrier with a period of about 100 .mu.s.\",\n \"This type of directional etching is often used for the later removal of the spacer.\",\n \"However, such a process presents the inconvenience of inducing a loss of silicon at the foot of the spacer as well as the faceting of neighboring patterns such as the edge of the active area or the edge of the grid.\",\n \"The etching process according to the invention resolves the inconveniences of the prior art and allows the allying of a high sensitivity with a high etching speed.\",\n \"Advantageously the steps of processing using the first plasma and the processing using the second plasma are performed in an alternate manner according to a periodicity varying between 0.5 second and 120 seconds, and preferably from 2 to 30 seconds, so as to repeat the sequence of the plasma processing steps a plurality of times until the desired removal of material A is obtained.\",\n \"Advantageously the ratio of the duration of the activation step or the passivation step to the duration of the removal varies between 0.1 and 10 and preferably between 0.5 and 2.The subject matter of the present invention is again an etched composite object likely to be obtained by the process of etching such as defined above.\",\n \"It could be notably an integrated-circuit wafer, or a substrate for a flat screen, or a substrate for solar cells, or a substrate for an electronically printed device.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS Other advantages and particularities of the present invention will result from the following description, given as a non-limiting example and made with reference to the attached figures and to the examples: FIG.\",\n \"1 is a cross-sectional functional view of a processing chamber according to an embodiment corresponding to a plasma processing system of the prior art; FIG.\",\n \"2 is a cross-sectional functional view of a plasma source of the system shown in FIG.\",\n \"1; FIG.\",\n \"3 is a functional perspective view of a configuration of plasma sources in two independent subassemblies according to an embodiment of the invention; FIG.\",\n \"4 is a perspective functional view of a plasma source of a system of plasma processing according to another embodiment of the invention, comprising two discharge chambers in series; FIG.\",\n \"5 shows a plasma etching machine of the prior art, that is implemented in the comparative example 2; FIG.\",\n \"6 shows another plasma etching machine of the prior art, that is implemented in the comparative example 3; FIG.\",\n \"7 shows the selectivity and etching speed obtained by the process implementing the machine of FIG.\",\n \"6 (comparative example 3); FIG.\",\n \"8 shows the evolutions of the etching speed and of the selectivity as a function of the gas mixture measured during the process implemented in the comparative example 3; FIGS.\",\n \"9 and 10 show the use of two plasma source assemblies of the device according to the invention implemented in the examples according to the invention; FIGS.\",\n \"11A, 11B, 11C shown the timing chart of the operation of the two subassemblies of FIG.\",\n \"10; FIGS.\",\n \"12 to 14 show the results obtained with the process described in the examples according to the invention and implementing the device shown schematically in FIGS.\",\n \"9 and 10; and FIG.\",\n \"15 shows the result of the etching according to the process described on a silicon oxide layer overlapped with silicon nitride for the fabrication of insulating composite structures.\",\n \"DETAILED DESCRIPTION Such as shown in FIG.\",\n \"1, a device for plasma processing according to the prior art consists of different elements: a processing chamber 10, an assembly 20 of plasma sources 201, 202, 203, a system of gas dispersion gas 30 and/or of isolation of the processing chamber 10 from damaging species generated by each of the plasma sources, a gas confinement system 31, and a pumping system 40.The processing chamber 10 is composed of a chamber of specially processed material so as not to interact with the active species created in the plasma and with a shape adapted to the processing of the desired parts, that could be cylindrical, cubic or of another form that will allow the industrial use of the chamber.\",\n \"One of the faces of the processing chamber is intended for loading.\",\n \"It is a “door”.\",\n \"Other faces are intended for the entry of species, it is there that the plasma sources 201, 202, 203 are attached and another face most often opposite the sources or at the base of the chamber 10 is intended for pumping the chamber.\",\n \"Each plasma source, such as represented in FIG.\",\n \"2, is here composed of a gas inlet system 25, a discharge chamber in the form of a tube 201, 202, 203 and a material, inert to the plasma and the diameter of which is adapted to optimize the transfer of radiofrequency power by induction via a coupling device 26 (e.g.\",\n \"an antenna) with several coils connected to a tuner and an RF generator upstream, and an insulating discharge capacitor downstream, not shown.\",\n \"The vacuum in the processing chamber 10 necessary for the creation of the plasma and for the circulation of the gases, is obtained by pumping using a pump 40.The pump 40 is e.g.\",\n \"a roughing pump or a turbomolecular pump connected to the base of the chamber 10, most often facing the sources 201, 202, 203.The gas, enriched with active species, circulates in the chamber 10 before being pumped.\",\n \"In FIG.\",\n \"3, a functional perspective view of a configuration of plasma sources in two independent subassemblies 21, 22 according to an embodiment of the processing system according to the invention is shown.\",\n \"In the embodiment illustrated in FIG.\",\n \"3, the subassemblies 21, 22 are arranged according to concentric rings.\",\n \"Other configurations are, however, possible depending upon the desired final result to be obtained.\",\n \"Each subassembly 21, 22 comprises at least one plasma source allowing a plasma to be generated.\",\n \"FIG.\",\n \"3 shows that each subassembly comprises three plasma sources 210, 211 and 212 for subassembly 21 and 220, 221 and 222 for the subassembly 22).\",\n \"In the subassembly 21, each source comprises a single discharge chamber (here in the form of a tube), while in the subassembly 22, each source 220, 221 and 222 comprises two discharge chambers in series (also here in the form of tubes: tubes 2201 and 2202 as illustrated in FIG.\",\n \"4).\",\n \"Each plasma source of a subassembly is supplied independently by radiofrequency power Pi and by a gas i with flow-rate ni.\",\n \"The plasma generated by a subassembly (e.g.\",\n \"the subassembly 21) is a partially ionized gas or a gas mixture of different chemical nature from the plasma generated by the other subassembly 22.A control device controls each of the subassemblies 21, 22 depending upon a specific configuration by application of radiofrequency power and a gas flow rate specific to each subassembly.\",\n \"The plasma processing system according to the invention allows the plasma sources to be controlled independently of one another by applying a different radiofrequency power and/or gas flow-rate for each subassembly of sources, in order to be able to control the uniformity of processing, notably between the center and the edge of a part to process.\",\n \"The different plasma sources 210, 211, 212, 220, 221, 222 are advantageously of small size with discharge chambers of small size, here in the form of small-diameter tubes, thus allowing their multiplication in a subassembly (in the case where a source comprises a single discharge chamber, here in the form of a tube) or the multiplication of sources (in the case where a source comprises discharge chambers in series).\",\n \"The multiplication of sources in addition allows the number of active species generated by said subassembly in the processing chamber to be increased.\",\n \"It also allows the processing to be optimized and homogenized even for large-diameter wafers.\",\n \"In fact, by the adequate combination of the diffusion cones of the sources, using their overlap and/or their superposition, and by the management of the circulation of gas via the pumping of the chamber, it is possible to obtain a uniform processing of the surfaces.\",\n \"On the other hand, these plasma sources can be placed in different strategic places so as to correspond to the form to be processed, for the optimization of its processing or the uniformity of its processing.\",\n \"With regard to the configuration of the plasma sources in independent subassemblies, their small bulk, and the independent management of the subassemblies, both in gas and in radiofrequency power, it is possible to allocate, in the plasma processing system, different subassemblies to different geometrical zones in the processing chamber.\",\n \"These zones being independent from one another, they are more or less activated, both in gas and radiofrequency power, so as to allow control of the action of the localized activated species in the processing chamber 10.Thus, in working by zone and with independent subassemblies, the geometry of the process is actively controlled.\",\n \"Not only does this arrangement allow the uniformity of the process to be controlled across the substrate, but the process can be developed without limit for the size of the object to process, in particular for the diameter of wafers from 300 mm to 450 mm, by adding additional peripheral zones one after the other.\",\n \"For substrates or wafers of 300 mm diameter, a processing system can be used comprising, for example, two subassemblies arranged in two concentric rings, as illustrated in FIG.\",\n \"3.The central ring 21 is here comprised of three discharge chambers (here in the form of tubes 210, 211 and 212) comprising plasma sources (generally between one and six discharge chambers) arranged in the center of the source and supplied by radiofrequency power PI and by a gas comprised of a mixture of, e.g., O2, Ar, CF4, CHF3, NF3, H2O, H2, Cl2, CF3Br, CxHyFz, etc., mixed in a block F1, where F1 implements a mixing operation with a gas 1 of flow-rate 1.1, a gas 2 of flow-rate 2.1, a gas 3 of flow-rate 3.1, etc.\",\n \"up to a gas n of flow-rate n.1.A second ring 22 surrounds the central ring, that is comprised of, for example, three sources (but preferably between four and eight sources), each comprising two discharge chambers in series, the ring 22 being concentric with the central ring 21.The different discharge chambers (here in the form of tubes) of the ring 22 are supplied by radiofrequency power P2 and by a gas mixed in a block F2, here a mixture of e.g.\",\n \"gaseous O2, Ar, CF4, CHF3, NF3, H2O, Hz, Cl2, CF3Br, CxHyFz, etc., where the block F2 implements a mixing operation with a gas 1 of flow-rate 1.2, a gas 2 of flow-rate 2.2, a gas 3 of flow-rate 3.2, etc.\",\n \"up to a gas n of flow-rate n.2.It is possible also to use three or more zones, in 300 mm.\",\n \"For wafers of 450 mm in diameter, one or several concentric rings of plasma sources can advantageously be added (each ring corresponding to a subassembly) to those already existing depending upon the requirements of uniformity, using the same principle.\",\n \"For example, a third ring 23 can be used, surrounding the ring 22 previously described, this ring 23 comprising eight to sixteen discharge chambers (here in the form of tubes), the tubes being supplied by radiofrequency power P3 and by gases mixed in a block F3, said gases being for example O2, Ar, CF4, CHF3, NF3, H2O, H2, Cl2, CF3Br, CxHyFz, etc., where the block F3 implements a mixing operation with a gas 1 of flow-rate 1.3, a gas 2 of flow-rate 2.3, a gas 3 of flow-rate 3.3, etc.\",\n \"up to a gas n of flow-rate n.3.The uniformity of the processes is ensured by the independent control of different zones of the source in terms of gas flow-rate F1, F2, F3 and radiofrequency power P1, P2, P3.For that, each ring corresponds to a subassembly of sources, which subassembly comprises a gas inlet that is specific to said subassembly, connected to the gas inlet of each plasma source of the subassembly considered.\",\n \"A control device controls the flow-rate of gas in the gas inlet of each subassembly.\",\n \"The control device additionally controls the mixture of gas injected in the gas inlet of each subassembly.\",\n \"In terms of electrical implementation, each subassembly comprises here a conducting element connected to the antenna 26 of each discharge chamber (here in the form of a tube) of the subassembly.\",\n \"The control device controls the radiofrequency power supplied to the conducting element of a subassembly.\",\n \"According to an advantageous arrangement, in addition, the substrate is turned to average the speed of processing and thus to improve uniformity.\",\n \"According to another advantageous arrangement, concentric rings in anodized aluminum or quartz are typically added between each source and the substrate to process, typically in the upper part of the processing chamber 10, these rings being showerheads, such showerheads being used currently in semi-conductor fabrication equipment, to distribute the injection of chemical species over hundreds of injection points.\",\n \"Such rings are formed, with small holes pierced into the lower face thereof, opposite the substrate to process.\",\n \"In the present case, they allow the uniformity of the processing to be improved even more and even reduce the number of discharge chambers necessary to process a substrate of 300 mm and 450 mm.\",\n \"According to another advantageous arrangement, the parameters of the gas flow-rate and radiofrequency power are adjusted from a measurement of the performance in terms of uniformity of the process.\",\n \"Using a device for measuring the local performances of the process, whether for example directly by spectroscopy or indirectly by thickness measurement, it is possible, by multiplexing the sources, to actively correct the process so as to optimize the quality of the processing in terms of speed, of homogeneity and of uniformity while guaranteeing the innocuousness of the processing.\",\n \"Such an adjustment of parameters of gas flow and of radiofrequency power is e.g.\",\n \"performed in the form of a closed cycle or in the form of a feed forward cycle.\",\n \"A feed forward adjustment consists here in measuring the state of the surface of the wafer prior to processing (such as e.g.\",\n \"the thickness of the resin) so as to adjust the processing parameters to compensate for the non-uniformity already present.\",\n \"The closed cycle consists here of measuring the state of the surface of the wafer following processing in order to adjust the process parameters before processing the following wafer.\",\n \"The advantages brought by the plasma processing system described are notably a better uniformity and a better efficiency in terms of processing speed.\",\n \"In addition, the multiplexing of sources allows independent control of the flow of active species in terms of quantity, dissociation rate, chemical composition and of energy over certain work zones and thus allows the processing of sensitive components to be actively corrected.\",\n \"The system, therefore, allows substrates to be processed without limit of size, which procures a very large potential of applications, beyond the applications of cleaning and stripping.\",\n \"The system also allows a uniform distribution of the gaseous flux of active species to be obtained.\",\n \"It allows the efficiency of residue cleaning and etching speeds to be improved, while increasing considerably the selectivity compared to current performances.\",\n \"The selectivity is the ratio of the etching speed of the target material (e.g.\",\n \"silicon nitride Si3N4) to the etching speed of another exposed material, that ideally must not be etched (e.g.\",\n \"silicon oxide SiO2).\",\n \"Selectivity is critical and must be constantly increased, with the appearance of new generations of technology.\",\n \"The device, with the multiple discharge chambers thereof, (here in the form of tubes) allows the selectivity of plasma processes to be increased by independently controlling the etching speed of the target material and that of one or more other exposed materials.\",\n \"The device allows infinite selectivity to be obtained.\",\n \"In particular, the alternate use or partial overlap of a stripping plasma generated by a subassembly and of a passivation plasma generated by another subassembly allows this selectivity to be substantially increased.\",\n \"EXAMPLES Products Silicon semiconductor substrates (wafers), overlapped by a layer of silicon nitride (Si3N4) as target material to be etched, and by a layer of silicon oxide SiO2 as material not to be etched, or by composite zones of the preceding materials; Silicon semiconductor substrates (wafers), overlapped by a layer of silicon oxide SiO2 (material not to be etched) overlapped by a layer of Si3N4 (target material to be etched); Silicon semiconductor substrates (wafers) comprising composite zones of the preceding stacks Test: Measurement of Selectivity The selectivity is measured by taking the ratio, after processing, of the thickness removed from material A compared to the thickness removed from material B for the same processing time.\",\n \"This can also be expressed in the form of the ratio of the etching or stripping speeds of the two materials.\",\n \"Comparative Example 1 Substrates of silicon overlapped by a layer of silicon nitride (Si3N4) and substrates of silicon overlapped by a layer of silicon oxide (SiO2) have been respectively etched by phosphoric acid wet processing.\",\n \"Results A selectivity of 50:1 was obtained.\",\n \"Comparative Example 2 In order to determine the etching speed of SiO2, an Si substrate covered only in SiO2 is used, i.e.\",\n \"SiO2/Si, from which SiO2 is partially removed.\",\n \"In order to determine the etching speed of Si3N4 an Si substrate covered only in Si3N4 is used, i.e.\",\n \"Si3N4/Si or most frequently an Si substrate with Si3N4 on SiO2 i.e.\",\n \"Si3N4/SiO2/Si, from which Si3N4 is partially removed.\",\n \"The process is then applied to the real structure on an Si substrate.\",\n \"The real structure is most often a composite, that is to say made of SiO2 zones and Si3N4/SiO2 zones.\",\n \"The geometry and the topography of the zones depend on the fabrication step (FIG.\",\n \"15 is an example thereof).\",\n \"Test wafers such as described above were etched by the plasma process of the prior art presented by the IMEC R&D Centre (Belgium) during the PESM 2012 conference in Grenoble.\",\n \"The plasma etching processing was performed in an etching machine of the company Lam Research such as illustrated in FIG.\",\n \"5: it comprises a single discharge chamber and a single chemistry.\",\n \"Results plasma (gas mixture used) NF3/02/CH3F Speed v1 of etching of Si3N4 44 nm/min Speed v2 of etching of SiO2 0.8 nm/min Selectivity v1/v2 55:1 Comparative Example 3 The applicant has performed selective etching experiments of Si3N4 based on equipment comprising a plasma source comprised of several discharge chambers (here in the form of tubes) such as illustrated in FIG.\",\n \"6.In this device, the discharge tubes are all connected in parallel and controlled by a single generator.\",\n \"It was not possible to independently control the tubes, that is, to apply a different RF power to the different tubes.\",\n \"The active gases of type O2, N2, CF4, etc.\",\n \"are mixed prior to being injected into the discharge tubes.\",\n \"It was also not possible to inject different gases into different tubes.\",\n \"The plasma source used by the applicant, while being composed of a plurality of discharge tubes, generates a single type of plasma in the processing chamber, just like traditional plasma sources (micro-wave or by inductive coupling).\",\n \"FIG.\",\n \"7 demonstrates the selectivity and the etching speed as a function of different gas mixtures.\",\n \"This figure shows that: the addition of O2 is the principal parameter for increasing the etching speed of Si3N4; and the addition of H2 greatly improves the Si3N4:SiO2 selectivity, but the etching speed of Si3N4 remains low.\",\n \"FIG.\",\n \"8 demonstrates the selectivity and the etching speed as a function of the amount of H2 in the gas mixture.\",\n \"It is noted that: the etching speed of Si3N4 and the Si3N4:SiO2 selectivity are closely correlated: the etching speed of Si3N4 decreases when the SiO2 selectivity increases.\",\n \"It is not possible to de-correlate the two in a traditional plasma source configuration (that is, generating a single type of plasma in the processing chamber); the etching speed of Si3N4 is about 80 .ANG./min for a selectivity Si3N4:SiO2 of 110:1; the etching speed of Si3N4 is about 250 .ANG./min for a selectivity Si3N4:SiO2 of about 35:1.Comparative examples demonstrate therefore that it is not possible to ally high selectivity with high etching speed (see the results presented in FIG.\",\n \"8 and comparative example 2).\",\n \"Example 1 According to the Invention Substrates of silicon covered in silicon oxide and/or covered in silicon nitride (Si3N4/SiO2) such as previously described, were etched using the plasma etching process according to an embodiment of the invention, comprising the repetition of the two following fundamental steps until obtaining the desired result: passivation step: it serves to protect (or “passivate”) certain surfaces from chemical attack taking place during the etching step.\",\n \"Passivation consists of depositing, onto the substrate, a polymer of type e.g.\",\n \"CxFyHz(e.g.\",\n \"CF4, or C4F8 or C2F6, CHF3, CH3F, etc.\",\n \"), removal or etching step: It serves to remove (“etch”) a material, either partially or entirely.\",\n \"During step 2, the passivation layer can be partially or entirely removed, the duration of each step being of the order of several seconds if not several tens of seconds but also could be extremely short, of the order of 0.1 s. This process is implemented using a plasma processing device according to the invention comprising two subassemblies of different plasma sources (here represented by tubes 1 and 2 in FIG.\",\n \"9), each tube performing a step (passivation or etching) of the invention (as illustrated in FIG.\",\n \"10).\",\n \"The time charts of the operation of each source are shown in FIGS.\",\n \"11A, 11B and 11C, respectively for an operation with alternating steps of removal and passivation with no overlap, (FIG.\",\n \"11A), for an operation with steps of removal and passivation with partial overlap (FIG.\",\n \"11B) and steps of removal and passivation with total overlap (FIG.\",\n \"11C).\",\n \"As shown in FIGS.\",\n \"12 to 14, the process described allows the etching speed of Si3N4 to be controlled without apparent consumption of SiO2; the etching speed of Si3N4 is about 120 .ANG./min for a selectivity Si3N4:SiO2 of about 700:1 with a CF4/O2/H2 plasma.\",\n \"These tests demonstrate therefore that the plasma etching process according to the invention allows the speed of etching of Si3N4 and that of SiO2 to be controlled independently and thus very high selectivity to be obtained.\",\n \"The experimental conditions of the etching tests according to the invention are detailed below and illustrated in FIGS.\",\n \"11A, 11B and 11C.\",\n \"Processes used per tube: values Min Max Passivation step (Tube 2) Conditions 1 RF power = 120 W 80 360 Flow-rate CF4 = 40 sccm 20 80 Flow-rate H, = 13.5 sccm 5 30 tON2 = 20 sec 2 35 Period 2 = 35 sec 3 80 Conditions 2 RF power = 360 W 120 360 Flow-rate C4F8 = 45 sccm 20 50 Flow-rate 02 = 5 sccm 20 tON2 = 20 sec 35 Period 2 = 35 sec 80 Conditions 3 RF power = 240 W 120 360 Flow-rate C2F6 = 30 sccm 30 70 Flow-rate 02 = 0 sccm 0 5 tON2 = 20 sec 2 35 Period 2 = 35 sec 3 50 Removal step (Tube 1) Conditions 1 RF power = 120 W 120 360 Flow-rate CF4 = 40 sccm 20 80 Flow-rate 02 = 5 sccm 0 10 tON1 = 15 sec 1 35 Period 1 = 35 sec 3 85 Conditions 2 RF power = 240 W 120 360 Flow-rate CHF3 = 40 sccm 0 100 Flow-rate 02 = 30 sccm 0 60 tON1 = 15 sec 1 35 Period 1 = 35 sec 3 85 Other Parameters: Temperature of substrate=between 135° C. and 150° C. Pressure=200 mTorr to 1 Torr Total processing time=from 1 min to 3 min RF power=50 to 1000 W/discharge tube and up to 5000 W for a subassembly composed of a plurality of discharge tubes.\",\n \"Gas flow-rate=1 sccm to 5000 sccm tON=0.1 sec to 30 sec Other Plasma Gases that can be Used in the Frame of the Present Invention: for the passivation step: CF4, CHF3, CH3F, C2F6, C4F8, CF3Br, HBr with or without Hz, with or without N2, and their mixtures for the etching step: CF4, CHF3, CH3F, NF3, Cl2, HBr, SF6, with or without O2, with or without N2, and their mixtures Additive gases: O2, N2, Ar, Hz, Xe, He Example 2 According to the Invention From substrates composed of silicon covered by silicon oxide and/or covered in silicon nitride, the silicon nitride Si3N4 layer, serving as a mask for the fabrication of composite so-called STI (shallow trench isolation) structures, was selectively etched.\",\n \"To do this, the sequence of steps of passivation and removal implementing conditions 1 of example 1 was repeated eight times, for a period of 7 and 15 seconds respectively.\",\n \"The composite structure before the removal is illustrated in FIG.\",\n \"15A (left), while that after processing is illustrated in FIG.\",\n \"15B (right).\",\n \"Silicon nitride Si3N4 is referenced as 151 and silicon oxide as 153.A suppression of silicon nitride is noted while the silicon oxide is intact.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870890"}}},{"rowIdx":4493671,"cells":{"text":{"kind":"list like","value":[["Window Shade","A window covering specially designed and configured to indoor residential shutters is disclosed.","The window cover is deployed and stowed via a spool and provides a user with more control over light transmission, solar transmission and view through properties, as desired.","In a preferred embodiment, a rectilinear housing hides the fabric cover in its stowed position and also houses a small electric motor.","Also, the fabric covering is provided at a rear to a widow shutter having adjustable slats."],["1.A window shade device for light transmission and climate control comprising a window shutter, the window shutter comprising: a four-sided frame for positioning about an inside of a window frame; a plurality of slats rotatably coupled to the frame, the plurality of slats having an open position and a closed position; a covering fabric, configured to the frame, the covering fabric providing at least a partial filter for light transmission through the window shutter; and a vertical link bar coupled to a leading edge of each of the plurality of slats for transitioning the plurality of slats from the open position to the closed position and wherein in the open position the covering fabric is positioned at an opposite edge with respect to the leading edge of each of the plurality of slats.","2.The window shade device for light transmission and climate control of claim 1, the four-sided frame comprising: an outer frame having four sides; and an inner frame having four sides, wherein the inner frame is hingedly connected to the outer frame, and further wherein the covering fabric is coupled to the outer frame.","3.The window shade device for light transmission and climate control of claim 1, further comprising a cylindrical rotatable spool configured at an upper portion of the four sided frame, wherein the covering fabric is configured at an upper portion of the outer frame via the spool positioned horizontally, and wherein the covering fabric extends from the spool in a deployed position, and wherein the covering fabric is wound about the spool in a stowed position.","4.The window shade device for light transmission and climate control of claim 3, further comprising: an electric motor coupled to and providing rotational motion to the spool; a reinforcement frame coupled to and about the outer frame at a rear thereof; and a cylindrical battery pack, the pack configured as a housing for one or more battery devices, the cylindrical battery pact further, the battery pack attached a lateral side of the four-sided frame, the battery pack further attached adjacent to the reinforcement frame.","5.The window shade device for light transmission and climate control of claim 3, further comprising a rectilinear housing for containing and surrounding the spool and electric motor.","6.The window shade device for light transmission and climate control of claim 5, wherein the reinforcement frame attaches to the rectilinear housing at an upper portion thereof.","7.The window shade device for light transmission and climate control of claim 1 wherein the plurality of slats removably touch the fabric cover to assist the fabric cover to remain taut, further wherein the stats and tilt bar are both made from ridged material.","8.A window shade device for light transmission and climate control comprising: a four sided frame; a cylindrical rotatable spool configured horizontally at an upper portion of the four sided frame; and a covering fabric providing at least a partial transmission of light, the covering fabric extending from the spool in a deployed position, and the covering fabric wound about the spool in a stowed position.","9.The window shade device for light transmission and climate control of claim 6, further comprising: an electric motor coupled and providing rotational motion to the spool; and a cylindrical battery pack, the pack configured as a housing for one or more battery devices.","10.The window shade device for light transmission and climate control of claim 7, wherein the battery pack is configured to a lateral side of the four sided frame and wherein the window shade device further comprises a rectilinear housing for containing the spool and electric motor."],[" BACKGROUND OF THE INVENTION "],[" BRIEF SUMMARY OF THE INVENTION The present invention specifically addresses and alleviates the above mentioned deficiencies associated with the prior art.","More particularly, the present invention in a first aspect, is directed to an improved window shutter, or rather a window shade device, for light transmission and climate control comprising a window shutter, the window shutter comprising: a four-sided frame for positioning about an inside of a window frame; a plurality of slats rotatably coupled to the frame, the plurality of slats having an open position and a closed position; and a covering fabric, configured to the frame, the covering fabric providing at least a partial filter for light transmission through the window shutter.","Further to the window shutter and the slats, a vertical link bar is coupled to a leading edge of each of the plurality of slats for transitioning the plurality of slats from the open position to the closed position.","Hence, in the open position the covering fabric is positioned at an opposite edge with respect to the leading edge of each of the plurality of slats.","Accordingly, the fabric cover can be made positioned adjacent to a window pane while the vertical link bar is positioned at the interior of a home.","The window shade device for light transmission and climate control in this aspect is additionally characterized in that the four-sided frame comprises: an outer frame having four sides; and an inner frame (or, door) having four sides, wherein the inner frame is hingedly connected to the outer frame, and further wherein the covering fabric is coupled to the outer frame.","The window shade device for light transmission and climate control in this aspect, is additionally characterized as comprising a cylindrical rotatable spool configured at an upper portion of the four sided frame, wherein the covering fabric is configured at an upper portion of the outer frame via the spool positioned horizontally, and wherein the covering fabric extends from the spool in a deployed position, and wherein the covering fabric is wound about the spool in a stowed position.","Still further in this first aspect, the invention is characterized as in that it comprises an electric motor coupled to and providing rotational motion to the spool; a reinforcement frame is coupled about the outer frame at a rear thereof; and a cylindrical battery pack, the pack configured as a housing for one or more battery devices.","The cylindrical battery pact is further attached a lateral side of the four-sided frame; and the battery pack is further attached adjacent to the reinforcement frame.","Yet still further, the invention in this aspect may be characterized in that it additionally comprises a rectilinear housing for containing and covering the spool and electric motor.","In a second aspect, the invention is characterized as a window shade device for light transmission and climate control that comprises: a four sided frame; a cylindrical rotatable spool configured horizontally at an upper portion of the four sided frame; and a covering fabric providing at least a partial transmission of light, the covering fabric extending downwardly from the spool in a deployed position, and the covering fabric wound about the spool in a stowed position.","The window shade device for light transmission and climate control in this second aspect is additionally characterized as comprising: an electric motor coupled to and providing rotational motion to the spool; and a cylindrical battery pack, the pack configured as a housing for one or more battery devices.","Also importantly, the battery pack is configured to a lateral side of the four sided frame; and the window shade device further has a rectilinear housing for containing the spool and electric motor.","These, as well as other advantages of the present invention will be more apparent from the following description and drawings.","It is understood that changes in the specific structure shown and described may be made within the scope of the claims, without departing from the spirit of the invention.","While the apparatus and method has or will be described for the sake of grammatical fluidity with functional explanations, it is to be expressly understood that the claims, unless expressly formulated under 35 USC 112, are not to be construed as necessarily limited in any way by the construction of “means” or “steps” limitations, but are to be accorded the full scope of the meaning and equivalents of the definition provided by the claims under the judicial doctrine of equivalents, and in the case where the claims are expressly formulated under 35 USC 112 are to be accorded full statutory equivalents under 35 USC 112.The invention can be better visualized by turning now to the following drawings wherein like elements are referenced by like numerals."],["PRIORITY CLAIM This patent application is a continuation-in-part application containing subject matter that claims benefit of the priority date of pending U.S. Des.","patent application Ser.","No.","29/546,238 filed on Nov. 20, 2015, entitled SHUTTER FABRIC COVER which in turn is a continuation-in-part of U.S. Des.","patent application Ser.","No 29/492,983 filed on Jun.","4, 2014 entitled SHUTTER FABRIC COVER, which in turn is a continuation-in-part application of U.S. patent application Ser.","No.","13/423,070 filed on Mar.","16, 2012 entitled, SOLAR SHUTTER, now U.S. Pat.","No.","8,997,824, which claims benefit of priority date of U.S. Prov.","Pat.","App.","Ser.","No.","61/453,322 filed on Mar.","16, 2011; and accordingly, all of these patents or patent applications are hereby expressly incorporated by reference.","BACKGROUND OF THE INVENTION Field of the Invention The present invention pertains generally to devices for improving comfort and ambiance in domestic homes in addition to saving energy.","More particularly, the invention relates to novel devices for solar screening to indoor shutters providing optimum lighting, privacy and climate control.","Description of the Prior Art Window coverings for privacy and light control have been known in various forms and designs.","One relatively common form of window covering consists of vertical or horizontal slats usually made from metal or vinyl, also referred to as “blinds.” More specifically, Venetian blinds are a well liked design for regulating light and air in which horizontal (or vertical) slats are coupled by a chord and can rotate in unison nearly 180 degrees.","Several designs for window coverings have been proposed by Toti including U.S. Pat.","No.","7,222,655, entitled “Window Covering System,” which was awarded patent protection in 2006.According to Toti, over the past several years, pleated shade system have become popular form of window treatment.","One version of a pleated shade system is made available from Versol USA, Inc. under the trademark RIDEAU, utilizes a prepleated fabric with strong, permanently set pleats that pack very tightly.","Toti further suggests that this and related designs are problematic in that the pleats retain residual tension much like a spring.","A more recent example employs a suction means to a window covering for attachment directly to a window, according to U.S. Pat.","App.","No.","2010/0116447, entitled “Blind for A Window,” to Thompson.","In this example, the inventor seems to be most concerned with convenience and less concerned about whether the solution is aesthetically pleasing.","Another example was set forth in U.S. Pat.","No.","7,059,482, entitled “Window Covering Sample Display Device and Method,” to Reid et al, that was also awarded patent protection in 2006.Therein, window coverings are attached directly to their windows via suction cups mounted to a rear of the device.","Further according to Reid and his co-inventors, the past several decades have been marked by tremendous growth in the types of window covering materials that are available to purchasers.","Starting with roller shades and slatted horizontal blinds, the field of window coverings has blossomed to include a wide array of different types of coverings.","These have included pleated shades, Roman shades, cellular shades and many others.","Also known to window coverings are shutters, or interior shutters more particularly.","Interior shutters have horizontal louvers or slats to control sun light, air flow, visibility etc.","Typically, the louvers or slats have their collective angle controlled by a tilt bar.","Additionally, interior shutters may hinge on either side of a window so that they can be opened to allow full light access.","Most interior designers would consider these shutters to be aesthetically pleasing to the inside environment providing a plantation or European style atmosphere.","One problem with indoor shutters is that they can provide an annoying glare even when fully closed due to light rays through cracks.","Also, as with some other forms of window coverings, lines of glare, such as that on a television or computer screen, can be annoying even when sun light is less than its peak intensity.","Accordingly, it is an object of the present invention to provide a window covering system to shutters that artfully combines the hard look of a shutter with the soft elegance of fabric.","It is a further object of the present invention to provide a window covering system wherein many different fabrics could be chosen to provide a variety of pattern/color options as well as different light and solar transmission, and view through properties.","It is still further an object of the present invention to provide a window covering system that can be easily manipulated and changed based on the particular desires of a user at a particular time.","Still further, it is an object of the present invention to provide a fabric cover that can be deployed when desired and stowed when not in use.","It is yet further an object of the present invention to provide a window covering for interior shutters that is relatively easy to manufacture and comparatively cost effective.","BRIEF SUMMARY OF THE INVENTION The present invention specifically addresses and alleviates the above mentioned deficiencies associated with the prior art.","More particularly, the present invention in a first aspect, is directed to an improved window shutter, or rather a window shade device, for light transmission and climate control comprising a window shutter, the window shutter comprising: a four-sided frame for positioning about an inside of a window frame; a plurality of slats rotatably coupled to the frame, the plurality of slats having an open position and a closed position; and a covering fabric, configured to the frame, the covering fabric providing at least a partial filter for light transmission through the window shutter.","Further to the window shutter and the slats, a vertical link bar is coupled to a leading edge of each of the plurality of slats for transitioning the plurality of slats from the open position to the closed position.","Hence, in the open position the covering fabric is positioned at an opposite edge with respect to the leading edge of each of the plurality of slats.","Accordingly, the fabric cover can be made positioned adjacent to a window pane while the vertical link bar is positioned at the interior of a home.","The window shade device for light transmission and climate control in this aspect is additionally characterized in that the four-sided frame comprises: an outer frame having four sides; and an inner frame (or, door) having four sides, wherein the inner frame is hingedly connected to the outer frame, and further wherein the covering fabric is coupled to the outer frame.","The window shade device for light transmission and climate control in this aspect, is additionally characterized as comprising a cylindrical rotatable spool configured at an upper portion of the four sided frame, wherein the covering fabric is configured at an upper portion of the outer frame via the spool positioned horizontally, and wherein the covering fabric extends from the spool in a deployed position, and wherein the covering fabric is wound about the spool in a stowed position.","Still further in this first aspect, the invention is characterized as in that it comprises an electric motor coupled to and providing rotational motion to the spool; a reinforcement frame is coupled about the outer frame at a rear thereof; and a cylindrical battery pack, the pack configured as a housing for one or more battery devices.","The cylindrical battery pact is further attached a lateral side of the four-sided frame; and the battery pack is further attached adjacent to the reinforcement frame.","Yet still further, the invention in this aspect may be characterized in that it additionally comprises a rectilinear housing for containing and covering the spool and electric motor.","In a second aspect, the invention is characterized as a window shade device for light transmission and climate control that comprises: a four sided frame; a cylindrical rotatable spool configured horizontally at an upper portion of the four sided frame; and a covering fabric providing at least a partial transmission of light, the covering fabric extending downwardly from the spool in a deployed position, and the covering fabric wound about the spool in a stowed position.","The window shade device for light transmission and climate control in this second aspect is additionally characterized as comprising: an electric motor coupled to and providing rotational motion to the spool; and a cylindrical battery pack, the pack configured as a housing for one or more battery devices.","Also importantly, the battery pack is configured to a lateral side of the four sided frame; and the window shade device further has a rectilinear housing for containing the spool and electric motor.","These, as well as other advantages of the present invention will be more apparent from the following description and drawings.","It is understood that changes in the specific structure shown and described may be made within the scope of the claims, without departing from the spirit of the invention.","While the apparatus and method has or will be described for the sake of grammatical fluidity with functional explanations, it is to be expressly understood that the claims, unless expressly formulated under 35 USC 112, are not to be construed as necessarily limited in any way by the construction of “means” or “steps” limitations, but are to be accorded the full scope of the meaning and equivalents of the definition provided by the claims under the judicial doctrine of equivalents, and in the case where the claims are expressly formulated under 35 USC 112 are to be accorded full statutory equivalents under 35 USC 112.The invention can be better visualized by turning now to the following drawings wherein like elements are referenced by like numerals.","BRIEF DESCRIPTION OF THE DRAWINGS The novel features of this invention, as well as the invention itself, both as to its structure and its operation, will be best understood from the accompanying drawings, taken in conjunction with the accompanying description, in which similar reference characters refer to similar parts, and in which: FIG.","1 is a perspective view of a hinged interior window shutter of the present invention with a fabric cover at a rear thereof; FIG.","2 is a top plan view thereof; FIG.","3 is a profile view of the first preferred embodiment; FIG.","4 is an elevational view of the first preferred embodiment; FIG.","5 is an enlarged perspective illustration of FIG.","1 having a hinged shutter door in an open position; FIG.","6 is a rear perspective view of a window cover in a preferred position; and FIG.","7 is a second rear perspective view of the invention with the fabric cover in a stowed position.","DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Various inventive features are described below that can each be used independently of one another or in combination with other features.","Initially, with reference to FIG.","1, a preferred device and system 10 of the present invention is illustrated in perspective.","Illustrated is a window shade 10 configured window shutter having a four-sided outer frame 11 configured about an inner frame 12, or alternatively a door 12.Also in the preferred embodiment, the inner frame is also a hinged window shutter door having a plurality of slats 13 rotatably coupled to the door 12.As shown throughout the illustrations, the slats 13 are fully open and light is filtered through a window covering 14 of the present invention.","It should be appreciated that light and privacy control can be achieve by translating the tilt bar 15 to reposition the slats 13.FIG.","2 shows a top plan view of the device and system 10 particularly showing a reinforcement frame 16 situated behind the outer frame 11.Housing 21 is provided to stow the fabric cover 14 when not deployed.","With regard to FIG.","3, a profile view is shown with the louvers/slats 13 fully open.","Optionally, the slats 13 removeably touch the window covering 14 such that they assist the covering 14 to be taut in the open position.","Importantly, the slats 13 are rigid, made from wood for example, to assist this affect.","The tilt bar 15 is also comprised of rigid material.","Further, the window covering 14 does not impede shutter 10 operation to any degree.","The coverings 14 comprise high quality textured fabric providing a soft elegance to the traditional hard look of an interior shutter.","Also in a preferred embodiment, the fabric cover 14 is semi-transparent and a partial light filter.","A complete light filter would be largely redundant and undesirable since the shutter slats 13 could simply be closed for that desired effect.","Yet further is shall be appreciated the shutter device 10 of the present invention can be easily configured inside an existing window frame comprising typical plane glass usual to residential applications.","Hence, the plane glass would be situated behind the fabric cover 14 in the profile FIG.","3 so that the fabric cover 14 would be between the shutter frame 11 and the actual plane glass.","FIG.","4 illustrates a front elevational view of the first preferred invention embodiment of the window cover 14 configured to a window shutter 10.As further contemplated herein, various coverings 14 having different colors and screening properties are optional to a user.","For example, a minimum or maximum solar or light transmission may be optimal depending upon summer or winter seasonal weather conditions.","Further, light transmission properties would depend on the amount of natural light desired by the user based on subjective preference.","FIG.","5 provides an enlarged perspective illustration similar to FIG.","1 however showing the hinged shutter door 12 in an open position.","In this preferred position, the window shutter device and system 10 provides a smooth and elegant feel to an interior room, particularly with the cover 14 in full view (FIG.","5) and fully deployed.","FIG.","5 further illustrates how a covering 14 of the present invention will not affect indoor shutter 12, 13, 15 operation to the user at the window interior.","Regarding FIG.","6, a rear perspective view of the preferred embodiment is shown with the window covering 14 again fully deployed, further wherein a portion of a spool housing 21 is removed to reveal internal contents.","Specifically, the rectilinear housing 21 is provided to contain a rotatable and cylindrical spool 23 of the invention embodiment.","The housing 21 is attached to an upper portion of the outer shutter frame 11 with the reinforcement frame 16 coupled around the housing.","Also further, the cylindrical spool 23 is attached at an upper portion of the outer frame 11, with the housing 21 constructed around the spool 23.In turn, the spool 23 is coupled to an electric motor 24 providing rotational motion to the spool to deploy the covering fabric 14, or with the motor 24 in the reverse direction, wind up and store the covering fabric 14 within the housing 21.It shall be appreciated that the motor may be actuated by any known means, such as contact switch, or remote ratio signals, or the like.","Further as shown in the illustrations, the cover 14 could be easily removed and replaced with another having a different color, pattern, light, or solar transmission properties.","The solar shutter system comprises an indoor shutter 10 to be configured to a window frame, the indoor shutter 10 further comprising an outside frame 11 hingedly coupled to an inside frame 12, the inside frame 12 comprising louvers 13, and a window covering 14 attached to an upper portion of the outer frame 11.Additionally regarding FIG.","6, a cylindrical battery pack 22 is provided outside of the spool housing 21 at a lateral side of the outer frame 11 and adjacent to reinforcement frame 16 (FIG.","2).","In a preferred embodiment, the pack 22 is configured to house one or more battery devices.","The battery pack 22 provides power to and completes an electrical circuit with the motor 24.And, it shall be appreciated that the battery pack 22 could be configured inside the rectilinear housing.","FIG.","7 is provided to illustrate the fabric cover 14 in a stowed position, however with dashed lines.","The cover 14 will be completely hidden from view as it is secured within the spool and motor housing 21.It should be understood, of course, that the foregoing relates to exemplary embodiments of the invention and that modifications may be made without departing from the spirit and scope of the invention as set forth in the following claims.","Many alterations and modifications may be made by those having ordinary skill in the art without departing from the spirit and scope of the invention.","Therefore, it must be understood that the illustrated embodiments have been set forth only for the purposes of example and that it should not be taken as limiting the invention as defined by the following claims.","For example, notwithstanding the fact that the elements of a claim are set forth below in a certain combination, it must be expressly understood that the invention includes other combinations of fewer, more or different elements, which are disclosed in above even when not initially claimed in such combinations.","While the particular Window Shade as herein shown and disclosed in detail is fully capable of obtaining the objects and providing the advantages herein before stated, it is to be understood that it is merely illustrative of the presently preferred embodiments of the invention and that no limitations are intended to the details of construction or design herein shown other than as described in the appended claims.","Insubstantial changes from the claimed subject matter as viewed by a person with ordinary skill in the art, now known or later devised, are expressly contemplated as being equivalently within the scope of the claims.","Therefore, obvious substitutions now or later known to one with ordinary skill in the art are defined to be within the scope of the defined elements."]],"string":"[\n [\n \"Window Shade\",\n \"A window covering specially designed and configured to indoor residential shutters is disclosed.\",\n \"The window cover is deployed and stowed via a spool and provides a user with more control over light transmission, solar transmission and view through properties, as desired.\",\n \"In a preferred embodiment, a rectilinear housing hides the fabric cover in its stowed position and also houses a small electric motor.\",\n \"Also, the fabric covering is provided at a rear to a widow shutter having adjustable slats.\"\n ],\n [\n \"1.A window shade device for light transmission and climate control comprising a window shutter, the window shutter comprising: a four-sided frame for positioning about an inside of a window frame; a plurality of slats rotatably coupled to the frame, the plurality of slats having an open position and a closed position; a covering fabric, configured to the frame, the covering fabric providing at least a partial filter for light transmission through the window shutter; and a vertical link bar coupled to a leading edge of each of the plurality of slats for transitioning the plurality of slats from the open position to the closed position and wherein in the open position the covering fabric is positioned at an opposite edge with respect to the leading edge of each of the plurality of slats.\",\n \"2.The window shade device for light transmission and climate control of claim 1, the four-sided frame comprising: an outer frame having four sides; and an inner frame having four sides, wherein the inner frame is hingedly connected to the outer frame, and further wherein the covering fabric is coupled to the outer frame.\",\n \"3.The window shade device for light transmission and climate control of claim 1, further comprising a cylindrical rotatable spool configured at an upper portion of the four sided frame, wherein the covering fabric is configured at an upper portion of the outer frame via the spool positioned horizontally, and wherein the covering fabric extends from the spool in a deployed position, and wherein the covering fabric is wound about the spool in a stowed position.\",\n \"4.The window shade device for light transmission and climate control of claim 3, further comprising: an electric motor coupled to and providing rotational motion to the spool; a reinforcement frame coupled to and about the outer frame at a rear thereof; and a cylindrical battery pack, the pack configured as a housing for one or more battery devices, the cylindrical battery pact further, the battery pack attached a lateral side of the four-sided frame, the battery pack further attached adjacent to the reinforcement frame.\",\n \"5.The window shade device for light transmission and climate control of claim 3, further comprising a rectilinear housing for containing and surrounding the spool and electric motor.\",\n \"6.The window shade device for light transmission and climate control of claim 5, wherein the reinforcement frame attaches to the rectilinear housing at an upper portion thereof.\",\n \"7.The window shade device for light transmission and climate control of claim 1 wherein the plurality of slats removably touch the fabric cover to assist the fabric cover to remain taut, further wherein the stats and tilt bar are both made from ridged material.\",\n \"8.A window shade device for light transmission and climate control comprising: a four sided frame; a cylindrical rotatable spool configured horizontally at an upper portion of the four sided frame; and a covering fabric providing at least a partial transmission of light, the covering fabric extending from the spool in a deployed position, and the covering fabric wound about the spool in a stowed position.\",\n \"9.The window shade device for light transmission and climate control of claim 6, further comprising: an electric motor coupled and providing rotational motion to the spool; and a cylindrical battery pack, the pack configured as a housing for one or more battery devices.\",\n \"10.The window shade device for light transmission and climate control of claim 7, wherein the battery pack is configured to a lateral side of the four sided frame and wherein the window shade device further comprises a rectilinear housing for containing the spool and electric motor.\"\n ],\n [\n \" BACKGROUND OF THE INVENTION \"\n ],\n [\n \" BRIEF SUMMARY OF THE INVENTION The present invention specifically addresses and alleviates the above mentioned deficiencies associated with the prior art.\",\n \"More particularly, the present invention in a first aspect, is directed to an improved window shutter, or rather a window shade device, for light transmission and climate control comprising a window shutter, the window shutter comprising: a four-sided frame for positioning about an inside of a window frame; a plurality of slats rotatably coupled to the frame, the plurality of slats having an open position and a closed position; and a covering fabric, configured to the frame, the covering fabric providing at least a partial filter for light transmission through the window shutter.\",\n \"Further to the window shutter and the slats, a vertical link bar is coupled to a leading edge of each of the plurality of slats for transitioning the plurality of slats from the open position to the closed position.\",\n \"Hence, in the open position the covering fabric is positioned at an opposite edge with respect to the leading edge of each of the plurality of slats.\",\n \"Accordingly, the fabric cover can be made positioned adjacent to a window pane while the vertical link bar is positioned at the interior of a home.\",\n \"The window shade device for light transmission and climate control in this aspect is additionally characterized in that the four-sided frame comprises: an outer frame having four sides; and an inner frame (or, door) having four sides, wherein the inner frame is hingedly connected to the outer frame, and further wherein the covering fabric is coupled to the outer frame.\",\n \"The window shade device for light transmission and climate control in this aspect, is additionally characterized as comprising a cylindrical rotatable spool configured at an upper portion of the four sided frame, wherein the covering fabric is configured at an upper portion of the outer frame via the spool positioned horizontally, and wherein the covering fabric extends from the spool in a deployed position, and wherein the covering fabric is wound about the spool in a stowed position.\",\n \"Still further in this first aspect, the invention is characterized as in that it comprises an electric motor coupled to and providing rotational motion to the spool; a reinforcement frame is coupled about the outer frame at a rear thereof; and a cylindrical battery pack, the pack configured as a housing for one or more battery devices.\",\n \"The cylindrical battery pact is further attached a lateral side of the four-sided frame; and the battery pack is further attached adjacent to the reinforcement frame.\",\n \"Yet still further, the invention in this aspect may be characterized in that it additionally comprises a rectilinear housing for containing and covering the spool and electric motor.\",\n \"In a second aspect, the invention is characterized as a window shade device for light transmission and climate control that comprises: a four sided frame; a cylindrical rotatable spool configured horizontally at an upper portion of the four sided frame; and a covering fabric providing at least a partial transmission of light, the covering fabric extending downwardly from the spool in a deployed position, and the covering fabric wound about the spool in a stowed position.\",\n \"The window shade device for light transmission and climate control in this second aspect is additionally characterized as comprising: an electric motor coupled to and providing rotational motion to the spool; and a cylindrical battery pack, the pack configured as a housing for one or more battery devices.\",\n \"Also importantly, the battery pack is configured to a lateral side of the four sided frame; and the window shade device further has a rectilinear housing for containing the spool and electric motor.\",\n \"These, as well as other advantages of the present invention will be more apparent from the following description and drawings.\",\n \"It is understood that changes in the specific structure shown and described may be made within the scope of the claims, without departing from the spirit of the invention.\",\n \"While the apparatus and method has or will be described for the sake of grammatical fluidity with functional explanations, it is to be expressly understood that the claims, unless expressly formulated under 35 USC 112, are not to be construed as necessarily limited in any way by the construction of “means” or “steps” limitations, but are to be accorded the full scope of the meaning and equivalents of the definition provided by the claims under the judicial doctrine of equivalents, and in the case where the claims are expressly formulated under 35 USC 112 are to be accorded full statutory equivalents under 35 USC 112.The invention can be better visualized by turning now to the following drawings wherein like elements are referenced by like numerals.\"\n ],\n [\n \"PRIORITY CLAIM This patent application is a continuation-in-part application containing subject matter that claims benefit of the priority date of pending U.S. Des.\",\n \"patent application Ser.\",\n \"No.\",\n \"29/546,238 filed on Nov. 20, 2015, entitled SHUTTER FABRIC COVER which in turn is a continuation-in-part of U.S. Des.\",\n \"patent application Ser.\",\n \"No 29/492,983 filed on Jun.\",\n \"4, 2014 entitled SHUTTER FABRIC COVER, which in turn is a continuation-in-part application of U.S. patent application Ser.\",\n \"No.\",\n \"13/423,070 filed on Mar.\",\n \"16, 2012 entitled, SOLAR SHUTTER, now U.S. Pat.\",\n \"No.\",\n \"8,997,824, which claims benefit of priority date of U.S. Prov.\",\n \"Pat.\",\n \"App.\",\n \"Ser.\",\n \"No.\",\n \"61/453,322 filed on Mar.\",\n \"16, 2011; and accordingly, all of these patents or patent applications are hereby expressly incorporated by reference.\",\n \"BACKGROUND OF THE INVENTION Field of the Invention The present invention pertains generally to devices for improving comfort and ambiance in domestic homes in addition to saving energy.\",\n \"More particularly, the invention relates to novel devices for solar screening to indoor shutters providing optimum lighting, privacy and climate control.\",\n \"Description of the Prior Art Window coverings for privacy and light control have been known in various forms and designs.\",\n \"One relatively common form of window covering consists of vertical or horizontal slats usually made from metal or vinyl, also referred to as “blinds.” More specifically, Venetian blinds are a well liked design for regulating light and air in which horizontal (or vertical) slats are coupled by a chord and can rotate in unison nearly 180 degrees.\",\n \"Several designs for window coverings have been proposed by Toti including U.S. Pat.\",\n \"No.\",\n \"7,222,655, entitled “Window Covering System,” which was awarded patent protection in 2006.According to Toti, over the past several years, pleated shade system have become popular form of window treatment.\",\n \"One version of a pleated shade system is made available from Versol USA, Inc. under the trademark RIDEAU, utilizes a prepleated fabric with strong, permanently set pleats that pack very tightly.\",\n \"Toti further suggests that this and related designs are problematic in that the pleats retain residual tension much like a spring.\",\n \"A more recent example employs a suction means to a window covering for attachment directly to a window, according to U.S. Pat.\",\n \"App.\",\n \"No.\",\n \"2010/0116447, entitled “Blind for A Window,” to Thompson.\",\n \"In this example, the inventor seems to be most concerned with convenience and less concerned about whether the solution is aesthetically pleasing.\",\n \"Another example was set forth in U.S. Pat.\",\n \"No.\",\n \"7,059,482, entitled “Window Covering Sample Display Device and Method,” to Reid et al, that was also awarded patent protection in 2006.Therein, window coverings are attached directly to their windows via suction cups mounted to a rear of the device.\",\n \"Further according to Reid and his co-inventors, the past several decades have been marked by tremendous growth in the types of window covering materials that are available to purchasers.\",\n \"Starting with roller shades and slatted horizontal blinds, the field of window coverings has blossomed to include a wide array of different types of coverings.\",\n \"These have included pleated shades, Roman shades, cellular shades and many others.\",\n \"Also known to window coverings are shutters, or interior shutters more particularly.\",\n \"Interior shutters have horizontal louvers or slats to control sun light, air flow, visibility etc.\",\n \"Typically, the louvers or slats have their collective angle controlled by a tilt bar.\",\n \"Additionally, interior shutters may hinge on either side of a window so that they can be opened to allow full light access.\",\n \"Most interior designers would consider these shutters to be aesthetically pleasing to the inside environment providing a plantation or European style atmosphere.\",\n \"One problem with indoor shutters is that they can provide an annoying glare even when fully closed due to light rays through cracks.\",\n \"Also, as with some other forms of window coverings, lines of glare, such as that on a television or computer screen, can be annoying even when sun light is less than its peak intensity.\",\n \"Accordingly, it is an object of the present invention to provide a window covering system to shutters that artfully combines the hard look of a shutter with the soft elegance of fabric.\",\n \"It is a further object of the present invention to provide a window covering system wherein many different fabrics could be chosen to provide a variety of pattern/color options as well as different light and solar transmission, and view through properties.\",\n \"It is still further an object of the present invention to provide a window covering system that can be easily manipulated and changed based on the particular desires of a user at a particular time.\",\n \"Still further, it is an object of the present invention to provide a fabric cover that can be deployed when desired and stowed when not in use.\",\n \"It is yet further an object of the present invention to provide a window covering for interior shutters that is relatively easy to manufacture and comparatively cost effective.\",\n \"BRIEF SUMMARY OF THE INVENTION The present invention specifically addresses and alleviates the above mentioned deficiencies associated with the prior art.\",\n \"More particularly, the present invention in a first aspect, is directed to an improved window shutter, or rather a window shade device, for light transmission and climate control comprising a window shutter, the window shutter comprising: a four-sided frame for positioning about an inside of a window frame; a plurality of slats rotatably coupled to the frame, the plurality of slats having an open position and a closed position; and a covering fabric, configured to the frame, the covering fabric providing at least a partial filter for light transmission through the window shutter.\",\n \"Further to the window shutter and the slats, a vertical link bar is coupled to a leading edge of each of the plurality of slats for transitioning the plurality of slats from the open position to the closed position.\",\n \"Hence, in the open position the covering fabric is positioned at an opposite edge with respect to the leading edge of each of the plurality of slats.\",\n \"Accordingly, the fabric cover can be made positioned adjacent to a window pane while the vertical link bar is positioned at the interior of a home.\",\n \"The window shade device for light transmission and climate control in this aspect is additionally characterized in that the four-sided frame comprises: an outer frame having four sides; and an inner frame (or, door) having four sides, wherein the inner frame is hingedly connected to the outer frame, and further wherein the covering fabric is coupled to the outer frame.\",\n \"The window shade device for light transmission and climate control in this aspect, is additionally characterized as comprising a cylindrical rotatable spool configured at an upper portion of the four sided frame, wherein the covering fabric is configured at an upper portion of the outer frame via the spool positioned horizontally, and wherein the covering fabric extends from the spool in a deployed position, and wherein the covering fabric is wound about the spool in a stowed position.\",\n \"Still further in this first aspect, the invention is characterized as in that it comprises an electric motor coupled to and providing rotational motion to the spool; a reinforcement frame is coupled about the outer frame at a rear thereof; and a cylindrical battery pack, the pack configured as a housing for one or more battery devices.\",\n \"The cylindrical battery pact is further attached a lateral side of the four-sided frame; and the battery pack is further attached adjacent to the reinforcement frame.\",\n \"Yet still further, the invention in this aspect may be characterized in that it additionally comprises a rectilinear housing for containing and covering the spool and electric motor.\",\n \"In a second aspect, the invention is characterized as a window shade device for light transmission and climate control that comprises: a four sided frame; a cylindrical rotatable spool configured horizontally at an upper portion of the four sided frame; and a covering fabric providing at least a partial transmission of light, the covering fabric extending downwardly from the spool in a deployed position, and the covering fabric wound about the spool in a stowed position.\",\n \"The window shade device for light transmission and climate control in this second aspect is additionally characterized as comprising: an electric motor coupled to and providing rotational motion to the spool; and a cylindrical battery pack, the pack configured as a housing for one or more battery devices.\",\n \"Also importantly, the battery pack is configured to a lateral side of the four sided frame; and the window shade device further has a rectilinear housing for containing the spool and electric motor.\",\n \"These, as well as other advantages of the present invention will be more apparent from the following description and drawings.\",\n \"It is understood that changes in the specific structure shown and described may be made within the scope of the claims, without departing from the spirit of the invention.\",\n \"While the apparatus and method has or will be described for the sake of grammatical fluidity with functional explanations, it is to be expressly understood that the claims, unless expressly formulated under 35 USC 112, are not to be construed as necessarily limited in any way by the construction of “means” or “steps” limitations, but are to be accorded the full scope of the meaning and equivalents of the definition provided by the claims under the judicial doctrine of equivalents, and in the case where the claims are expressly formulated under 35 USC 112 are to be accorded full statutory equivalents under 35 USC 112.The invention can be better visualized by turning now to the following drawings wherein like elements are referenced by like numerals.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The novel features of this invention, as well as the invention itself, both as to its structure and its operation, will be best understood from the accompanying drawings, taken in conjunction with the accompanying description, in which similar reference characters refer to similar parts, and in which: FIG.\",\n \"1 is a perspective view of a hinged interior window shutter of the present invention with a fabric cover at a rear thereof; FIG.\",\n \"2 is a top plan view thereof; FIG.\",\n \"3 is a profile view of the first preferred embodiment; FIG.\",\n \"4 is an elevational view of the first preferred embodiment; FIG.\",\n \"5 is an enlarged perspective illustration of FIG.\",\n \"1 having a hinged shutter door in an open position; FIG.\",\n \"6 is a rear perspective view of a window cover in a preferred position; and FIG.\",\n \"7 is a second rear perspective view of the invention with the fabric cover in a stowed position.\",\n \"DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Various inventive features are described below that can each be used independently of one another or in combination with other features.\",\n \"Initially, with reference to FIG.\",\n \"1, a preferred device and system 10 of the present invention is illustrated in perspective.\",\n \"Illustrated is a window shade 10 configured window shutter having a four-sided outer frame 11 configured about an inner frame 12, or alternatively a door 12.Also in the preferred embodiment, the inner frame is also a hinged window shutter door having a plurality of slats 13 rotatably coupled to the door 12.As shown throughout the illustrations, the slats 13 are fully open and light is filtered through a window covering 14 of the present invention.\",\n \"It should be appreciated that light and privacy control can be achieve by translating the tilt bar 15 to reposition the slats 13.FIG.\",\n \"2 shows a top plan view of the device and system 10 particularly showing a reinforcement frame 16 situated behind the outer frame 11.Housing 21 is provided to stow the fabric cover 14 when not deployed.\",\n \"With regard to FIG.\",\n \"3, a profile view is shown with the louvers/slats 13 fully open.\",\n \"Optionally, the slats 13 removeably touch the window covering 14 such that they assist the covering 14 to be taut in the open position.\",\n \"Importantly, the slats 13 are rigid, made from wood for example, to assist this affect.\",\n \"The tilt bar 15 is also comprised of rigid material.\",\n \"Further, the window covering 14 does not impede shutter 10 operation to any degree.\",\n \"The coverings 14 comprise high quality textured fabric providing a soft elegance to the traditional hard look of an interior shutter.\",\n \"Also in a preferred embodiment, the fabric cover 14 is semi-transparent and a partial light filter.\",\n \"A complete light filter would be largely redundant and undesirable since the shutter slats 13 could simply be closed for that desired effect.\",\n \"Yet further is shall be appreciated the shutter device 10 of the present invention can be easily configured inside an existing window frame comprising typical plane glass usual to residential applications.\",\n \"Hence, the plane glass would be situated behind the fabric cover 14 in the profile FIG.\",\n \"3 so that the fabric cover 14 would be between the shutter frame 11 and the actual plane glass.\",\n \"FIG.\",\n \"4 illustrates a front elevational view of the first preferred invention embodiment of the window cover 14 configured to a window shutter 10.As further contemplated herein, various coverings 14 having different colors and screening properties are optional to a user.\",\n \"For example, a minimum or maximum solar or light transmission may be optimal depending upon summer or winter seasonal weather conditions.\",\n \"Further, light transmission properties would depend on the amount of natural light desired by the user based on subjective preference.\",\n \"FIG.\",\n \"5 provides an enlarged perspective illustration similar to FIG.\",\n \"1 however showing the hinged shutter door 12 in an open position.\",\n \"In this preferred position, the window shutter device and system 10 provides a smooth and elegant feel to an interior room, particularly with the cover 14 in full view (FIG.\",\n \"5) and fully deployed.\",\n \"FIG.\",\n \"5 further illustrates how a covering 14 of the present invention will not affect indoor shutter 12, 13, 15 operation to the user at the window interior.\",\n \"Regarding FIG.\",\n \"6, a rear perspective view of the preferred embodiment is shown with the window covering 14 again fully deployed, further wherein a portion of a spool housing 21 is removed to reveal internal contents.\",\n \"Specifically, the rectilinear housing 21 is provided to contain a rotatable and cylindrical spool 23 of the invention embodiment.\",\n \"The housing 21 is attached to an upper portion of the outer shutter frame 11 with the reinforcement frame 16 coupled around the housing.\",\n \"Also further, the cylindrical spool 23 is attached at an upper portion of the outer frame 11, with the housing 21 constructed around the spool 23.In turn, the spool 23 is coupled to an electric motor 24 providing rotational motion to the spool to deploy the covering fabric 14, or with the motor 24 in the reverse direction, wind up and store the covering fabric 14 within the housing 21.It shall be appreciated that the motor may be actuated by any known means, such as contact switch, or remote ratio signals, or the like.\",\n \"Further as shown in the illustrations, the cover 14 could be easily removed and replaced with another having a different color, pattern, light, or solar transmission properties.\",\n \"The solar shutter system comprises an indoor shutter 10 to be configured to a window frame, the indoor shutter 10 further comprising an outside frame 11 hingedly coupled to an inside frame 12, the inside frame 12 comprising louvers 13, and a window covering 14 attached to an upper portion of the outer frame 11.Additionally regarding FIG.\",\n \"6, a cylindrical battery pack 22 is provided outside of the spool housing 21 at a lateral side of the outer frame 11 and adjacent to reinforcement frame 16 (FIG.\",\n \"2).\",\n \"In a preferred embodiment, the pack 22 is configured to house one or more battery devices.\",\n \"The battery pack 22 provides power to and completes an electrical circuit with the motor 24.And, it shall be appreciated that the battery pack 22 could be configured inside the rectilinear housing.\",\n \"FIG.\",\n \"7 is provided to illustrate the fabric cover 14 in a stowed position, however with dashed lines.\",\n \"The cover 14 will be completely hidden from view as it is secured within the spool and motor housing 21.It should be understood, of course, that the foregoing relates to exemplary embodiments of the invention and that modifications may be made without departing from the spirit and scope of the invention as set forth in the following claims.\",\n \"Many alterations and modifications may be made by those having ordinary skill in the art without departing from the spirit and scope of the invention.\",\n \"Therefore, it must be understood that the illustrated embodiments have been set forth only for the purposes of example and that it should not be taken as limiting the invention as defined by the following claims.\",\n \"For example, notwithstanding the fact that the elements of a claim are set forth below in a certain combination, it must be expressly understood that the invention includes other combinations of fewer, more or different elements, which are disclosed in above even when not initially claimed in such combinations.\",\n \"While the particular Window Shade as herein shown and disclosed in detail is fully capable of obtaining the objects and providing the advantages herein before stated, it is to be understood that it is merely illustrative of the presently preferred embodiments of the invention and that no limitations are intended to the details of construction or design herein shown other than as described in the appended claims.\",\n \"Insubstantial changes from the claimed subject matter as viewed by a person with ordinary skill in the art, now known or later devised, are expressly contemplated as being equivalently within the scope of the claims.\",\n \"Therefore, obvious substitutions now or later known to one with ordinary skill in the art are defined to be within the scope of the defined elements.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870898"}}},{"rowIdx":4493672,"cells":{"text":{"kind":"list like","value":[["Nitride Light Emitting Diode and Growth Method","A nitride light emitting diode includes a substrate and a nitride buffer layer, an n-type layer, a quantum well light emitting layer, and a p-type layer over the substrate.","The n-type layer is a superlattice structure formed by alternating undoped AlGaN layers and n-type doped GaN layers.","The Al component of the undoped AlGaN layer is controlled to produce first stress that offsets the second stress produced by the n-type doped GaN layer, reducing crystal defects and wrapping caused by impurity doping of the n-type layer.","Growth temperature and pressure of the n-type layer are controlled such that thickness of the n-type doped GaN layer is greater than that of the undoped AlGaN layer to improve surface roughness of the undoped AlGaN layer and form an n-type doped GaN layer with a flat surface.","Series resistance, crystal defects and wrapping, and optoelectronic properties of the device are therefore improved."],["1.A nitride light emitting diode comprising: a substrate and a buffer layer; an n-type layer; a quantum well light emitting layer and a p-type layer over the substrate, wherein: the n-type layer is a superlattice structure formed by alternating undoped AlGaN layers and n-type doped GaN layers; and a first stress produced by the undoped AlGaN layers offsets a second stress produced by the n-type doped GaN layer.","2.The nitride light emitting diode of claim 1, wherein Al component of the undoped AlGaN layer is adjusted such that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer offset each other.","3.The nitride light emitting diode of claim 1, wherein a doping concentration of the n-type doped GaN layer is higher than or equal to 1×1020/cm3.4.The nitride light emitting diode of claim 1, wherein a thickness of the n-type doped GaN layer of the superlattice structure is greater than that of the undoped AlGaN layer, to thereby adjust surface flatness of the superlattice structure and improve crystal quality of the superlattice structure.","5.The nitride light emitting diode of claim 1, wherein a thickness ratio of the undoped AlGaN layer and the n-type doped GaN layer is 1:2-1:4.6.The nitride light emitting diode of claim 1, wherein a thickness of the n-type doped GaN layer is 5 Å-150 Å.","7.The nitride light emitting diode of claim 1, wherein Al component in the undoped AlGaN layer is 3%-8%.","8.The nitride light emitting diode of claim 1, wherein number of cycles of the superlattice structure is 60-150.9.A method of growing a nitride light emitting diode, the method comprising: S1: providing a substrate; S2: growing a buffer layer over the substrate; S3: growing an n-type layer over the nitride buffer layer; and S4: continuing to grow a quantum well light emitting layer and a p-type layer over the n-type layer; wherein: the n-type layer formed in step S3) is a superlattice structure formed by alternating undoped AlGaN layers and n-type doped GaN layers; and a first stress generated by the undoped AlGaN layers offsets a second stress generated by the n-type doped GaN layers.","10.The method of claim 9, wherein Al component of the undoped AlGaN layers is adjusted such that the first stress produced by the undoped AlGaN layers and the second stress produced by the n-type doped GaN layers offset each other.","11.The method of claim 9, wherein growth conditions of step S3 include: temperature is higher than 1050° C., and pressure is below 100 torr.","12.The method of claim 9, wherein doping concentration of the n-type doped GaN layer is higher than or equal to 1×1020/cm3.13.The method of claim 9, wherein a thickness of the n-type GaN layer is greater than that of the undoped AlGaN layer to thereby adjust surface flatness of the superlattice structure and improve crystal quality of the superlattice structure.","14.The method of claim 9, wherein component of the AlGaN layer is 3%-8%.","15.Alight-emitting system including a plurality of nitride light emitting diodes, each diode comprising: a substrate and a buffer layer; an n-type layer; a quantum well light emitting layer and a p-type layer over the substrate, wherein: the n-type layer is a superlattice structure formed by alternating undoped AlGaN layers and n-type doped GaN layers; and a first stress produced by the undoped AlGaN layers offsets a second stress produced by the n-type doped GaN layer.","16.The system of claim 15, wherein Al component of the undoped AlGaN layer is adjusted such that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer offset each other.","17.The system of claim 15, wherein a doping concentration of the n-type doped GaN layer is higher than or equal to 1×1020/cm3.18.The system of claim 15, wherein a thickness of the n-type doped GaN layer of the superlattice structure is greater than that of the undoped AlGaN layer, to thereby adjust surface flatness of the superlattice structure and improve crystal quality of the superlattice structure.","19.The system of claim 15, wherein a thickness ratio of the undoped AlGaN layer and the n-type doped GaN layer is 1:2-1:4.20.The system of claim 15, wherein: a thickness of the n-type doped GaN layer is 5 Å-150 Å; Al component in the undoped AlGaN layer is 3%-8%; and number of cycles of the superlattice structure is 60-150."],[" BACKGROUND As application of the nitride semiconductor component extends widely, aside from high luminance, it is also important to increase static withstand voltage and reduce operation voltage.","In particular, when large-size and high-power chips are applied in lighting and backlight sources, it requires to reduce voltage and improve light emitting luminance under rated driving current for effective reduction of power consumption.","Chinese Patent CN201310032282.9 discloses an epitaxial structure with large-size chip light effect and growth method thereof, which keeps total thickness of original n-type GaN and changes Si-doping method of the n-type GaN layer.","Through periodic alternating growth of Si-doping and non-Si-doping, the Si-doped GaN is of low resistance, and non-Si-doped GaN is of high resistance.","The n-type GaN with high and low resistance enhances lateral spreading capacity of electrons during current transmission.","On the one hand, it solves current crowding, and reduces driving voltage; on the other hand, it homogenizes quantum well current to enlarge total light emitting area and improve luminance and light effects."],[" SUMMARY The inventors of the present disclosure have recognized that, although the aforesaid patent reduces chip driving voltage by solving current crowding to some extent, it fails to essentially improve poor electrical conductivity of GaN materials and meet market demands on LEDs with low energy consumption, and high driving voltage of chip due to high series resistance remains to be solved.","Therefore, it is urgent to provide a technology capable of dramatically reducing working voltage of chip to meet market demands on low power and low energy consumption.","Given the above demands, the present invention provides a nitride light emitting diode and growth method thereof, where doping concentration of the n-type doped GaN layer is enhanced to above 1×10 20 /cm 3 to reduce series resistance and contact resistance of the light emitting diode and to reduce working voltage of the chip.","Meanwhile, to improve crystal defect and wrapping due to high doping concentration of the n-type doped GaN layer, a superlattice structure with alternating undoped AlGaN layer and n-type doped GaN layer is formed under high temperature and low pressure; wherein, doping concentration of the n-type doped GaN layer is adjusted so that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer different from the first stress offset each other, which reduces crystal defect and wrapping.","On the other hand, thickness of the undoped AlGaN layer and the n-type doped GaN layer is controlled to adjust surface flatness of the superlattice structure; in this way, lattice quality of the superlattice structure is improved; lattice mismatch with subsequent epitaxial layer is reduced; and crack and wrapping due to large first stress are eliminated.","Meanwhile, the n-type layer is a superlattice structure with alternating undoped AlGaN layer and n-type doped GaN layer to effectively disperse electrical field, and improve antistatic capacity.","In an aspect, a nitride light emitting diode is provided, including a substrate and a buffer layer, an n-type layer, a quantum well light emitting layer and a p-type layer over the substrate, wherein, the n-type layer is a superlattice structure formed by alternating undoped AlGaN layer and n-type doped GaN layer, wherein, the first stress produced by the undoped AlGaN layer offsets the second stress produced by the n-type doped GaN layer so as to reduce crystal defect and wrapping caused by n-type layer doping.","In some embodiments, the Al component of the undoped AlGaN layer is controlled such that the first stress produced and the second stress produced by the n-type doped GaN layer offset each other.","In some embodiments, doping concentration of the n-type doped GaN layer is higher than or equal to 1×10 20 /cm 3 .","In some embodiments, doping concentration of the n-type doped GaN layer is 1×10 20 /cm 3 -1×10 22 /cm 3 .","In some embodiments, thickness of the n-type GaN layer is greater than that of the undoped AlGaN layer for adjusting surface flatness of the superlattice structure and improving crystal quality of the superlattice structure.","In some embodiments, thickness ratio of the undoped AlGaN layer and the n-type GaN layer is 1: 2-1:4.In some embodiments, thickness of the n-type GaN layer is 5 Å-150 Å.","In some embodiments, Al component of the undoped AlGaN layer is 3%-8%.","In some embodiments, the n-type doping impurity is Si, Ge, Sn or Pb.","In some embodiments, number of cycles of the superlattice structure layer is 60-150.Meanwhile, the present invention also provides a fabrication method for a nitride light emitting diode, comprising: S1.providing a substrate; S2.growing a buffer layer over the substrate; S3.growing an n-type layer over the nitride buffer layer; S4.growing a quantum well light emitting layer and a p-type layer over the N-type layer; wherein, the n-type layer in step S3) is a superlattice structure with alternating undoped AlGaN and n-type doped GaN layer, wherein, the first stress produced by the undoped AlGaN layer offsets the second stress produced by the n-type doped GaN layer, thereby reducing crystal defect and wrapping caused by doping of the N-type layer.","In some embodiments, the Al component of the undoped AlGaN layer is controlled so that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer offset each other.","In some embodiments, temperature of the reaction chamber during epitaxial growth is higher than 1050° C., and pressure is below 100 torr.","In some embodiments, doping concentration of the n-type doped GaN layer is higher than or equals to 1×10 20 /cm 3 , and further, the doping concentration scope is 1×10 20 /cm 3 -1×10 22 /cm 3 .","In some embodiments, thickness of the n-type GaN layer is greater than that of the undoped AlGaN layer for adjusting surface flatness of the superlattice structure and improving crystal quality of the superlattice structure.","Further, ratio thickness of the undoped AlGaN layer and the n-type GaN layer is 1: 2-1:4, wherein, thickness of the n-type GaN layer is 5 Å-150 Å.","In some embodiments, Al component of the AlGaN layer is 3%-8%.","In some embodiments, the n-type doping impurity is Si, Ge, Sn, or Pb.","In some embodiments, number of cycles of the superlattice structure layer is 60-150.In another aspect, a light-emitting system is provided including a plurality of the nitride light-emitting diodes.","The light-emitting system can be used in the field of, for example, lighting, display, signage, etc.","Various embodiments of the present disclosure can have one or more of the following advantageous effects: 1) the n-type layer is a superlattice structure with alternating undoped AlGaN layer and n-type doped GaN layer so that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer offset each other, thus reducing crystal defect and wrapping of the n-type layer due to high doping concentration, such as dark spot on the surface and atomization; 2) doping concentration of the n-type layer is above 1×10 20 /cm 3 , which reduces series resistance of the crystal, and further reduces driving voltage; 3) thickness of the undoped AlGaN layer and the n-type doped GaN layer is controlled to the extent that thickness of the undoped AlGaN layer is less than that of the n-type doped GaN layer, for adjusting surface flatness of the superlattice structure, thereby improving crystal quality of the superlattice structure, reducing lattice mismatch with subsequent epitaxial layer and crack and crystal wrapping due to large tensile stress; and 4) the superlattice structure formed by the undoped AlGaN layer and the n-type doped GaN layer can effectively disperse electric field so as to improve antistatic capacity and device stability."],["CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a continuation of, and claims priority to, PCT/CN2016/097870 filed on Sep. 2, 2016, which claims priority to Chinese Patent Application No.","201510921681.X filed on Dec. 14, 2015.The disclosures of these applications are hereby incorporated by reference in their entirety.","BACKGROUND As application of the nitride semiconductor component extends widely, aside from high luminance, it is also important to increase static withstand voltage and reduce operation voltage.","In particular, when large-size and high-power chips are applied in lighting and backlight sources, it requires to reduce voltage and improve light emitting luminance under rated driving current for effective reduction of power consumption.","Chinese Patent CN201310032282.9 discloses an epitaxial structure with large-size chip light effect and growth method thereof, which keeps total thickness of original n-type GaN and changes Si-doping method of the n-type GaN layer.","Through periodic alternating growth of Si-doping and non-Si-doping, the Si-doped GaN is of low resistance, and non-Si-doped GaN is of high resistance.","The n-type GaN with high and low resistance enhances lateral spreading capacity of electrons during current transmission.","On the one hand, it solves current crowding, and reduces driving voltage; on the other hand, it homogenizes quantum well current to enlarge total light emitting area and improve luminance and light effects.","SUMMARY The inventors of the present disclosure have recognized that, although the aforesaid patent reduces chip driving voltage by solving current crowding to some extent, it fails to essentially improve poor electrical conductivity of GaN materials and meet market demands on LEDs with low energy consumption, and high driving voltage of chip due to high series resistance remains to be solved.","Therefore, it is urgent to provide a technology capable of dramatically reducing working voltage of chip to meet market demands on low power and low energy consumption.","Given the above demands, the present invention provides a nitride light emitting diode and growth method thereof, where doping concentration of the n-type doped GaN layer is enhanced to above 1×1020/cm3 to reduce series resistance and contact resistance of the light emitting diode and to reduce working voltage of the chip.","Meanwhile, to improve crystal defect and wrapping due to high doping concentration of the n-type doped GaN layer, a superlattice structure with alternating undoped AlGaN layer and n-type doped GaN layer is formed under high temperature and low pressure; wherein, doping concentration of the n-type doped GaN layer is adjusted so that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer different from the first stress offset each other, which reduces crystal defect and wrapping.","On the other hand, thickness of the undoped AlGaN layer and the n-type doped GaN layer is controlled to adjust surface flatness of the superlattice structure; in this way, lattice quality of the superlattice structure is improved; lattice mismatch with subsequent epitaxial layer is reduced; and crack and wrapping due to large first stress are eliminated.","Meanwhile, the n-type layer is a superlattice structure with alternating undoped AlGaN layer and n-type doped GaN layer to effectively disperse electrical field, and improve antistatic capacity.","In an aspect, a nitride light emitting diode is provided, including a substrate and a buffer layer, an n-type layer, a quantum well light emitting layer and a p-type layer over the substrate, wherein, the n-type layer is a superlattice structure formed by alternating undoped AlGaN layer and n-type doped GaN layer, wherein, the first stress produced by the undoped AlGaN layer offsets the second stress produced by the n-type doped GaN layer so as to reduce crystal defect and wrapping caused by n-type layer doping.","In some embodiments, the Al component of the undoped AlGaN layer is controlled such that the first stress produced and the second stress produced by the n-type doped GaN layer offset each other.","In some embodiments, doping concentration of the n-type doped GaN layer is higher than or equal to 1×1020/cm3.In some embodiments, doping concentration of the n-type doped GaN layer is 1×1020/cm3-1×1022/cm3.In some embodiments, thickness of the n-type GaN layer is greater than that of the undoped AlGaN layer for adjusting surface flatness of the superlattice structure and improving crystal quality of the superlattice structure.","In some embodiments, thickness ratio of the undoped AlGaN layer and the n-type GaN layer is 1: 2-1:4.In some embodiments, thickness of the n-type GaN layer is 5 Å-150 Å.","In some embodiments, Al component of the undoped AlGaN layer is 3%-8%.","In some embodiments, the n-type doping impurity is Si, Ge, Sn or Pb.","In some embodiments, number of cycles of the superlattice structure layer is 60-150.Meanwhile, the present invention also provides a fabrication method for a nitride light emitting diode, comprising: S1.providing a substrate; S2.growing a buffer layer over the substrate; S3.growing an n-type layer over the nitride buffer layer; S4.growing a quantum well light emitting layer and a p-type layer over the N-type layer; wherein, the n-type layer in step S3) is a superlattice structure with alternating undoped AlGaN and n-type doped GaN layer, wherein, the first stress produced by the undoped AlGaN layer offsets the second stress produced by the n-type doped GaN layer, thereby reducing crystal defect and wrapping caused by doping of the N-type layer.","In some embodiments, the Al component of the undoped AlGaN layer is controlled so that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer offset each other.","In some embodiments, temperature of the reaction chamber during epitaxial growth is higher than 1050° C., and pressure is below 100 torr.","In some embodiments, doping concentration of the n-type doped GaN layer is higher than or equals to 1×1020/cm3, and further, the doping concentration scope is 1×1020/cm3-1×1022/cm3.In some embodiments, thickness of the n-type GaN layer is greater than that of the undoped AlGaN layer for adjusting surface flatness of the superlattice structure and improving crystal quality of the superlattice structure.","Further, ratio thickness of the undoped AlGaN layer and the n-type GaN layer is 1: 2-1:4, wherein, thickness of the n-type GaN layer is 5 Å-150 Å.","In some embodiments, Al component of the AlGaN layer is 3%-8%.","In some embodiments, the n-type doping impurity is Si, Ge, Sn, or Pb.","In some embodiments, number of cycles of the superlattice structure layer is 60-150.In another aspect, a light-emitting system is provided including a plurality of the nitride light-emitting diodes.","The light-emitting system can be used in the field of, for example, lighting, display, signage, etc.","Various embodiments of the present disclosure can have one or more of the following advantageous effects: 1) the n-type layer is a superlattice structure with alternating undoped AlGaN layer and n-type doped GaN layer so that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer offset each other, thus reducing crystal defect and wrapping of the n-type layer due to high doping concentration, such as dark spot on the surface and atomization; 2) doping concentration of the n-type layer is above 1×1020/cm3, which reduces series resistance of the crystal, and further reduces driving voltage; 3) thickness of the undoped AlGaN layer and the n-type doped GaN layer is controlled to the extent that thickness of the undoped AlGaN layer is less than that of the n-type doped GaN layer, for adjusting surface flatness of the superlattice structure, thereby improving crystal quality of the superlattice structure, reducing lattice mismatch with subsequent epitaxial layer and crack and crystal wrapping due to large tensile stress; and 4) the superlattice structure formed by the undoped AlGaN layer and the n-type doped GaN layer can effectively disperse electric field so as to improve antistatic capacity and device stability.","BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and constitute a part of this specification, together with the embodiments, are therefore to be considered in all respects as illustrative and not restrictive.","In addition, the drawings are merely illustrative, which are not drawn to scale.","FIG.","1 is a structural diagram of the nitride light emitting diode according to some embodiments.","FIG.","2 is a structural diagram of an N-type layer according to the present invention.","FIG.","3 is a growth flow diagram of the nitride light emitting diode according to some embodiments.","FIG.","4 is a structural diagram of a nitride light emitting diode formed according to the growth process of the nitride light emitting diode.","In the drawings: 10: substrate; 20: buffer layer; 30: u-GaN layer; 40: n-type layer; 41: undoped AlGaN layer; 42: n-type doped GaN layer; 50: quantum well light emitting layer; 60: p-type layer; 70: n electrode; 80: p electrode.","DETAILED DESCRIPTION Various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings and embodiments.","Referring to FIG.","1, a nitride light emitting diode comprises a substrate 10, and a nitride buffer layer 20, an n-type layer 40, a quantum well light emitting layer 50 and a p-type layer 60 over the substrate 10.In this embodiment, the nitride light emitting diode also comprises a u-GaN layer 30 between the nitride buffer layer 20 and the n-type layer 40, wherein, the substrate 10 can be any one of a sapphire plain substrate, a sapphire patterned substrate, a SiC substrate, a GaN substrate, a Si substrate, a glass substrate or a metal substrate; the nitride buffer layer 20 is a single-layer structure or a superlattice structure, and the component material is one or more of GaN, AlN, AlGaN or AlxMyGal-x-yN (x>0,y>0), where, M is In, Si or metal; and the p-type layer 60 is an Mg-doped GaN layer.","In the prior art, in the n-type layer 40 of epitaxial growth, the n-type doping concentration is generally less than 1×1019/cm3, because when n-type doping is higher than 1×1020/cm3, the crystal would appear surface defect and wrapping, such as dark spot and atomization; as doping concentration increases, series resistance of the n-type layer 40 decreases, thus further decreasing voltage of the overall light emitting diode.","Therefore, given the reversed impact of the doping concentration on the crystal quality and the series resistance, some embodiments of the present disclosure solve the important problem of decreasing surface defect and wrapping of the crystal while increasing doping concentration to reduce series resistance.","Referring to FIG.","2, to solve the surface defect and wrapping of the crystal when doping concentration is high, such as dark spot and atomization, in this embodiment, the n-type layer 40 is a superlattice structure with alternating undoped AlGaN layer 41 and n-type doped GaN layer 42, wherein, the first stress produced by the undoped AlGaN layer 41 and the second stress produced by the n-type doped GaN layer 42 in the superlattice structure offset each other, so as to reduce crystal defect and wrapping of the n-type layer due to doping, wherein, the n-type doping material is Si, Ge, Sn or Pb.","In this embodiment, Si is preferred.","The first stress and the second stress are of same or different stress.","In this embodiment, the first stress produced by the undoped AlGaN layer 41 and the second stress produced by the n-type doped GaN layer 42 are different, where the first stress is tensile stress, and the second stress is pressure stress.","Referring further to FIG.","2, tensile stress produced by the undoped AlGaN layer 41 increases as Al component increases, and pressure stress produced by the n-type doped GaN layer 42 increases as Si doping concentration and thickness increase.","Therefore, in this embodiment, Al component of the undoped AlGaN layer 41, Si concentration of the n-type doped GaN layer 42 and thickness of the n-type doped GaN layer 42 and the undoped AlGaN layer 41 are adjusted so that the tensile stress produced by the undoped AlGaN layer 41 and the pressure stress produced by the n-type doped GaN layer 42 offset each other.","Specifically, Al component of the undoped AlGaN layer 41 is 3%-8%, and Si doping concentration is 1×1020/cm3-1×1022/cm3.As Si doping of the n-type doped GaN layer 42 is higher than common 1×1019/cm3, the n-type GaN layer 42 and the undoped AlGaN layer 41 in one circle are of thin layer structure so that pressure stress produced by the n-type GaN layer 42 and tensile stress produced by the undoped AlGaN layer 41 in one circle can be completely released and offset each other; specifically, the n-type GaN layer 42 is 5 Å-150 Å thick, thickness ratio of the undoped AlGaN layer 41 and the n-type GaN layer 42 is 1: 2-1:4; number of cycles of the superlattice structure with the undoped AlGaN layer 41 and the n-type doped GaN layer 42 is set to 60-150 without changing conventional total thickness of the N-type layer 40 (in general 1 μm-2.5 μm).","Thickness of the n-type GaN layer 42 is larger than that of the undoped AlGaN layer 41.In one circle, an n-type doped GaN layer 42 with flat surface is formed to adjust the surface flatness of the superlattice structure, and to inhibit lattice defect extension; on the other hand, tensile stress produced by the undoped AlGaN layer 41 is so high that pressure stress produced by the n-type doped GaN layer 42 cannot be offset, thus producing cracks.","Referring to FIGS.","3-4, to fabricate an aforesaid nitride light emitting diode, the embodiment provides a growth method, specifically: S1.provide a substrate 10; S2.grow a nitride buffer layer 20 over the substrate 10; S3.grow an n-type layer 40 over the nitride buffer layer 20; S4.grow a quantum well light emitting layer 50 and a p-type layer 60 over the n-type layer 40.The n-type layer 40 formed in step S3 is a superlattice structure with alternating undoped AlGaN 41 and n-type doped GaN layer 42, wherein, the first stress produced by the undoped AlGaN layer 41 and the second stress produced by the n-type doped GaN layer 42 different from the first stress in the superlattice structure offset each other, thus reducing crystal defect and wrapping of the N-type layer 40 due to doping.","In this embodiment, step S1 also comprises high-temperature treatment of the substrate 10 under 1100-1200° C. hydrogen atmosphere to remove impurity on surface of the substrate 10; in general, step S4) is followed by chip fabrication process; for example, an n electrode 70 and a p electrode 80 are fabricated over the n-type layer 40 and the p-type layer 60 through coating, development, etching and deposition.","In this embodiment, it is preferred to grow a GaN buffer layer 20 over the sapphire substrate under low temperature.","As the sapphire substrate and the GaN are of heterostructure, to further buffer the extension of lattice mismatch defect between the substrate and the GaN epitaxial layer, a high-temperature u-GaN layer 30 is grown after step S2) to improve bottom lattice quality.","Then, continue to grow a superlattice structure of undoped AlGaN and n-type doped GaN over the u-GaN layer 30.Adjust the reaction chamber temperature to above 1,050° C. and pressure below 100 torr.","Control the carrier gas flow.","Grow the undoped AlGaN layer 41, and then grow an n-type doped GaN layer 42 with n-type doped concentration higher than or equal to 1×1020/cm3 over the undoped AlGaN layer 41, and repeat this for 60-150 cycles.","Wherein, the first stress produced by the undoped AlGaN layer 41 and the second stress produced by the n-type doped GaN layer 42 different from the first stress offset each other to reduce the crystal defect and wrapping caused by n-type doped concentration higher than or equal to 1×1020/cm3.Other parameters and functional mechanisms of the structure produced by this method are same as those aforesaid, which are not repeated.","In this embodiment, the doping concentration of the n-type layer 40 is controlled higher than or equal to 1×1020/cm3, to substantially reduce series resistance of the light emitting diode, and further reduce driving voltage of the chip.","Then, the n-type layer 40 with single growth method is changed to a superlattice structure formed by a undoped AlGaN layer 41 and an n-type doped GaN layer 42 to reduce crystal defect and wrapping caused by n-type doping concentration higher than or equal to 1×1020/cm3 so as to further improve photoelectric property of the device.","Although specific embodiments have been described above in detail, the description is merely for purposes of illustration.","It should be appreciated, therefore, that many aspects described above are not intended as required or essential elements unless explicitly stated otherwise.","Various modifications of, and equivalent acts corresponding to, the disclosed aspects of the exemplary embodiments, in addition to those described above, can be made by a person of ordinary skill in the art, having the benefit of the present disclosure, without departing from the spirit and scope of the disclosure defined in the following claims, the scope of which is to be accorded the broadest interpretation so as to encompass such modifications and equivalent structures."]],"string":"[\n [\n \"Nitride Light Emitting Diode and Growth Method\",\n \"A nitride light emitting diode includes a substrate and a nitride buffer layer, an n-type layer, a quantum well light emitting layer, and a p-type layer over the substrate.\",\n \"The n-type layer is a superlattice structure formed by alternating undoped AlGaN layers and n-type doped GaN layers.\",\n \"The Al component of the undoped AlGaN layer is controlled to produce first stress that offsets the second stress produced by the n-type doped GaN layer, reducing crystal defects and wrapping caused by impurity doping of the n-type layer.\",\n \"Growth temperature and pressure of the n-type layer are controlled such that thickness of the n-type doped GaN layer is greater than that of the undoped AlGaN layer to improve surface roughness of the undoped AlGaN layer and form an n-type doped GaN layer with a flat surface.\",\n \"Series resistance, crystal defects and wrapping, and optoelectronic properties of the device are therefore improved.\"\n ],\n [\n \"1.A nitride light emitting diode comprising: a substrate and a buffer layer; an n-type layer; a quantum well light emitting layer and a p-type layer over the substrate, wherein: the n-type layer is a superlattice structure formed by alternating undoped AlGaN layers and n-type doped GaN layers; and a first stress produced by the undoped AlGaN layers offsets a second stress produced by the n-type doped GaN layer.\",\n \"2.The nitride light emitting diode of claim 1, wherein Al component of the undoped AlGaN layer is adjusted such that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer offset each other.\",\n \"3.The nitride light emitting diode of claim 1, wherein a doping concentration of the n-type doped GaN layer is higher than or equal to 1×1020/cm3.4.The nitride light emitting diode of claim 1, wherein a thickness of the n-type doped GaN layer of the superlattice structure is greater than that of the undoped AlGaN layer, to thereby adjust surface flatness of the superlattice structure and improve crystal quality of the superlattice structure.\",\n \"5.The nitride light emitting diode of claim 1, wherein a thickness ratio of the undoped AlGaN layer and the n-type doped GaN layer is 1:2-1:4.6.The nitride light emitting diode of claim 1, wherein a thickness of the n-type doped GaN layer is 5 Å-150 Å.\",\n \"7.The nitride light emitting diode of claim 1, wherein Al component in the undoped AlGaN layer is 3%-8%.\",\n \"8.The nitride light emitting diode of claim 1, wherein number of cycles of the superlattice structure is 60-150.9.A method of growing a nitride light emitting diode, the method comprising: S1: providing a substrate; S2: growing a buffer layer over the substrate; S3: growing an n-type layer over the nitride buffer layer; and S4: continuing to grow a quantum well light emitting layer and a p-type layer over the n-type layer; wherein: the n-type layer formed in step S3) is a superlattice structure formed by alternating undoped AlGaN layers and n-type doped GaN layers; and a first stress generated by the undoped AlGaN layers offsets a second stress generated by the n-type doped GaN layers.\",\n \"10.The method of claim 9, wherein Al component of the undoped AlGaN layers is adjusted such that the first stress produced by the undoped AlGaN layers and the second stress produced by the n-type doped GaN layers offset each other.\",\n \"11.The method of claim 9, wherein growth conditions of step S3 include: temperature is higher than 1050° C., and pressure is below 100 torr.\",\n \"12.The method of claim 9, wherein doping concentration of the n-type doped GaN layer is higher than or equal to 1×1020/cm3.13.The method of claim 9, wherein a thickness of the n-type GaN layer is greater than that of the undoped AlGaN layer to thereby adjust surface flatness of the superlattice structure and improve crystal quality of the superlattice structure.\",\n \"14.The method of claim 9, wherein component of the AlGaN layer is 3%-8%.\",\n \"15.Alight-emitting system including a plurality of nitride light emitting diodes, each diode comprising: a substrate and a buffer layer; an n-type layer; a quantum well light emitting layer and a p-type layer over the substrate, wherein: the n-type layer is a superlattice structure formed by alternating undoped AlGaN layers and n-type doped GaN layers; and a first stress produced by the undoped AlGaN layers offsets a second stress produced by the n-type doped GaN layer.\",\n \"16.The system of claim 15, wherein Al component of the undoped AlGaN layer is adjusted such that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer offset each other.\",\n \"17.The system of claim 15, wherein a doping concentration of the n-type doped GaN layer is higher than or equal to 1×1020/cm3.18.The system of claim 15, wherein a thickness of the n-type doped GaN layer of the superlattice structure is greater than that of the undoped AlGaN layer, to thereby adjust surface flatness of the superlattice structure and improve crystal quality of the superlattice structure.\",\n \"19.The system of claim 15, wherein a thickness ratio of the undoped AlGaN layer and the n-type doped GaN layer is 1:2-1:4.20.The system of claim 15, wherein: a thickness of the n-type doped GaN layer is 5 Å-150 Å; Al component in the undoped AlGaN layer is 3%-8%; and number of cycles of the superlattice structure is 60-150.\"\n ],\n [\n \" BACKGROUND As application of the nitride semiconductor component extends widely, aside from high luminance, it is also important to increase static withstand voltage and reduce operation voltage.\",\n \"In particular, when large-size and high-power chips are applied in lighting and backlight sources, it requires to reduce voltage and improve light emitting luminance under rated driving current for effective reduction of power consumption.\",\n \"Chinese Patent CN201310032282.9 discloses an epitaxial structure with large-size chip light effect and growth method thereof, which keeps total thickness of original n-type GaN and changes Si-doping method of the n-type GaN layer.\",\n \"Through periodic alternating growth of Si-doping and non-Si-doping, the Si-doped GaN is of low resistance, and non-Si-doped GaN is of high resistance.\",\n \"The n-type GaN with high and low resistance enhances lateral spreading capacity of electrons during current transmission.\",\n \"On the one hand, it solves current crowding, and reduces driving voltage; on the other hand, it homogenizes quantum well current to enlarge total light emitting area and improve luminance and light effects.\"\n ],\n [\n \" SUMMARY The inventors of the present disclosure have recognized that, although the aforesaid patent reduces chip driving voltage by solving current crowding to some extent, it fails to essentially improve poor electrical conductivity of GaN materials and meet market demands on LEDs with low energy consumption, and high driving voltage of chip due to high series resistance remains to be solved.\",\n \"Therefore, it is urgent to provide a technology capable of dramatically reducing working voltage of chip to meet market demands on low power and low energy consumption.\",\n \"Given the above demands, the present invention provides a nitride light emitting diode and growth method thereof, where doping concentration of the n-type doped GaN layer is enhanced to above 1×10 20 /cm 3 to reduce series resistance and contact resistance of the light emitting diode and to reduce working voltage of the chip.\",\n \"Meanwhile, to improve crystal defect and wrapping due to high doping concentration of the n-type doped GaN layer, a superlattice structure with alternating undoped AlGaN layer and n-type doped GaN layer is formed under high temperature and low pressure; wherein, doping concentration of the n-type doped GaN layer is adjusted so that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer different from the first stress offset each other, which reduces crystal defect and wrapping.\",\n \"On the other hand, thickness of the undoped AlGaN layer and the n-type doped GaN layer is controlled to adjust surface flatness of the superlattice structure; in this way, lattice quality of the superlattice structure is improved; lattice mismatch with subsequent epitaxial layer is reduced; and crack and wrapping due to large first stress are eliminated.\",\n \"Meanwhile, the n-type layer is a superlattice structure with alternating undoped AlGaN layer and n-type doped GaN layer to effectively disperse electrical field, and improve antistatic capacity.\",\n \"In an aspect, a nitride light emitting diode is provided, including a substrate and a buffer layer, an n-type layer, a quantum well light emitting layer and a p-type layer over the substrate, wherein, the n-type layer is a superlattice structure formed by alternating undoped AlGaN layer and n-type doped GaN layer, wherein, the first stress produced by the undoped AlGaN layer offsets the second stress produced by the n-type doped GaN layer so as to reduce crystal defect and wrapping caused by n-type layer doping.\",\n \"In some embodiments, the Al component of the undoped AlGaN layer is controlled such that the first stress produced and the second stress produced by the n-type doped GaN layer offset each other.\",\n \"In some embodiments, doping concentration of the n-type doped GaN layer is higher than or equal to 1×10 20 /cm 3 .\",\n \"In some embodiments, doping concentration of the n-type doped GaN layer is 1×10 20 /cm 3 -1×10 22 /cm 3 .\",\n \"In some embodiments, thickness of the n-type GaN layer is greater than that of the undoped AlGaN layer for adjusting surface flatness of the superlattice structure and improving crystal quality of the superlattice structure.\",\n \"In some embodiments, thickness ratio of the undoped AlGaN layer and the n-type GaN layer is 1: 2-1:4.In some embodiments, thickness of the n-type GaN layer is 5 Å-150 Å.\",\n \"In some embodiments, Al component of the undoped AlGaN layer is 3%-8%.\",\n \"In some embodiments, the n-type doping impurity is Si, Ge, Sn or Pb.\",\n \"In some embodiments, number of cycles of the superlattice structure layer is 60-150.Meanwhile, the present invention also provides a fabrication method for a nitride light emitting diode, comprising: S1.providing a substrate; S2.growing a buffer layer over the substrate; S3.growing an n-type layer over the nitride buffer layer; S4.growing a quantum well light emitting layer and a p-type layer over the N-type layer; wherein, the n-type layer in step S3) is a superlattice structure with alternating undoped AlGaN and n-type doped GaN layer, wherein, the first stress produced by the undoped AlGaN layer offsets the second stress produced by the n-type doped GaN layer, thereby reducing crystal defect and wrapping caused by doping of the N-type layer.\",\n \"In some embodiments, the Al component of the undoped AlGaN layer is controlled so that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer offset each other.\",\n \"In some embodiments, temperature of the reaction chamber during epitaxial growth is higher than 1050° C., and pressure is below 100 torr.\",\n \"In some embodiments, doping concentration of the n-type doped GaN layer is higher than or equals to 1×10 20 /cm 3 , and further, the doping concentration scope is 1×10 20 /cm 3 -1×10 22 /cm 3 .\",\n \"In some embodiments, thickness of the n-type GaN layer is greater than that of the undoped AlGaN layer for adjusting surface flatness of the superlattice structure and improving crystal quality of the superlattice structure.\",\n \"Further, ratio thickness of the undoped AlGaN layer and the n-type GaN layer is 1: 2-1:4, wherein, thickness of the n-type GaN layer is 5 Å-150 Å.\",\n \"In some embodiments, Al component of the AlGaN layer is 3%-8%.\",\n \"In some embodiments, the n-type doping impurity is Si, Ge, Sn, or Pb.\",\n \"In some embodiments, number of cycles of the superlattice structure layer is 60-150.In another aspect, a light-emitting system is provided including a plurality of the nitride light-emitting diodes.\",\n \"The light-emitting system can be used in the field of, for example, lighting, display, signage, etc.\",\n \"Various embodiments of the present disclosure can have one or more of the following advantageous effects: 1) the n-type layer is a superlattice structure with alternating undoped AlGaN layer and n-type doped GaN layer so that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer offset each other, thus reducing crystal defect and wrapping of the n-type layer due to high doping concentration, such as dark spot on the surface and atomization; 2) doping concentration of the n-type layer is above 1×10 20 /cm 3 , which reduces series resistance of the crystal, and further reduces driving voltage; 3) thickness of the undoped AlGaN layer and the n-type doped GaN layer is controlled to the extent that thickness of the undoped AlGaN layer is less than that of the n-type doped GaN layer, for adjusting surface flatness of the superlattice structure, thereby improving crystal quality of the superlattice structure, reducing lattice mismatch with subsequent epitaxial layer and crack and crystal wrapping due to large tensile stress; and 4) the superlattice structure formed by the undoped AlGaN layer and the n-type doped GaN layer can effectively disperse electric field so as to improve antistatic capacity and device stability.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a continuation of, and claims priority to, PCT/CN2016/097870 filed on Sep. 2, 2016, which claims priority to Chinese Patent Application No.\",\n \"201510921681.X filed on Dec. 14, 2015.The disclosures of these applications are hereby incorporated by reference in their entirety.\",\n \"BACKGROUND As application of the nitride semiconductor component extends widely, aside from high luminance, it is also important to increase static withstand voltage and reduce operation voltage.\",\n \"In particular, when large-size and high-power chips are applied in lighting and backlight sources, it requires to reduce voltage and improve light emitting luminance under rated driving current for effective reduction of power consumption.\",\n \"Chinese Patent CN201310032282.9 discloses an epitaxial structure with large-size chip light effect and growth method thereof, which keeps total thickness of original n-type GaN and changes Si-doping method of the n-type GaN layer.\",\n \"Through periodic alternating growth of Si-doping and non-Si-doping, the Si-doped GaN is of low resistance, and non-Si-doped GaN is of high resistance.\",\n \"The n-type GaN with high and low resistance enhances lateral spreading capacity of electrons during current transmission.\",\n \"On the one hand, it solves current crowding, and reduces driving voltage; on the other hand, it homogenizes quantum well current to enlarge total light emitting area and improve luminance and light effects.\",\n \"SUMMARY The inventors of the present disclosure have recognized that, although the aforesaid patent reduces chip driving voltage by solving current crowding to some extent, it fails to essentially improve poor electrical conductivity of GaN materials and meet market demands on LEDs with low energy consumption, and high driving voltage of chip due to high series resistance remains to be solved.\",\n \"Therefore, it is urgent to provide a technology capable of dramatically reducing working voltage of chip to meet market demands on low power and low energy consumption.\",\n \"Given the above demands, the present invention provides a nitride light emitting diode and growth method thereof, where doping concentration of the n-type doped GaN layer is enhanced to above 1×1020/cm3 to reduce series resistance and contact resistance of the light emitting diode and to reduce working voltage of the chip.\",\n \"Meanwhile, to improve crystal defect and wrapping due to high doping concentration of the n-type doped GaN layer, a superlattice structure with alternating undoped AlGaN layer and n-type doped GaN layer is formed under high temperature and low pressure; wherein, doping concentration of the n-type doped GaN layer is adjusted so that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer different from the first stress offset each other, which reduces crystal defect and wrapping.\",\n \"On the other hand, thickness of the undoped AlGaN layer and the n-type doped GaN layer is controlled to adjust surface flatness of the superlattice structure; in this way, lattice quality of the superlattice structure is improved; lattice mismatch with subsequent epitaxial layer is reduced; and crack and wrapping due to large first stress are eliminated.\",\n \"Meanwhile, the n-type layer is a superlattice structure with alternating undoped AlGaN layer and n-type doped GaN layer to effectively disperse electrical field, and improve antistatic capacity.\",\n \"In an aspect, a nitride light emitting diode is provided, including a substrate and a buffer layer, an n-type layer, a quantum well light emitting layer and a p-type layer over the substrate, wherein, the n-type layer is a superlattice structure formed by alternating undoped AlGaN layer and n-type doped GaN layer, wherein, the first stress produced by the undoped AlGaN layer offsets the second stress produced by the n-type doped GaN layer so as to reduce crystal defect and wrapping caused by n-type layer doping.\",\n \"In some embodiments, the Al component of the undoped AlGaN layer is controlled such that the first stress produced and the second stress produced by the n-type doped GaN layer offset each other.\",\n \"In some embodiments, doping concentration of the n-type doped GaN layer is higher than or equal to 1×1020/cm3.In some embodiments, doping concentration of the n-type doped GaN layer is 1×1020/cm3-1×1022/cm3.In some embodiments, thickness of the n-type GaN layer is greater than that of the undoped AlGaN layer for adjusting surface flatness of the superlattice structure and improving crystal quality of the superlattice structure.\",\n \"In some embodiments, thickness ratio of the undoped AlGaN layer and the n-type GaN layer is 1: 2-1:4.In some embodiments, thickness of the n-type GaN layer is 5 Å-150 Å.\",\n \"In some embodiments, Al component of the undoped AlGaN layer is 3%-8%.\",\n \"In some embodiments, the n-type doping impurity is Si, Ge, Sn or Pb.\",\n \"In some embodiments, number of cycles of the superlattice structure layer is 60-150.Meanwhile, the present invention also provides a fabrication method for a nitride light emitting diode, comprising: S1.providing a substrate; S2.growing a buffer layer over the substrate; S3.growing an n-type layer over the nitride buffer layer; S4.growing a quantum well light emitting layer and a p-type layer over the N-type layer; wherein, the n-type layer in step S3) is a superlattice structure with alternating undoped AlGaN and n-type doped GaN layer, wherein, the first stress produced by the undoped AlGaN layer offsets the second stress produced by the n-type doped GaN layer, thereby reducing crystal defect and wrapping caused by doping of the N-type layer.\",\n \"In some embodiments, the Al component of the undoped AlGaN layer is controlled so that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer offset each other.\",\n \"In some embodiments, temperature of the reaction chamber during epitaxial growth is higher than 1050° C., and pressure is below 100 torr.\",\n \"In some embodiments, doping concentration of the n-type doped GaN layer is higher than or equals to 1×1020/cm3, and further, the doping concentration scope is 1×1020/cm3-1×1022/cm3.In some embodiments, thickness of the n-type GaN layer is greater than that of the undoped AlGaN layer for adjusting surface flatness of the superlattice structure and improving crystal quality of the superlattice structure.\",\n \"Further, ratio thickness of the undoped AlGaN layer and the n-type GaN layer is 1: 2-1:4, wherein, thickness of the n-type GaN layer is 5 Å-150 Å.\",\n \"In some embodiments, Al component of the AlGaN layer is 3%-8%.\",\n \"In some embodiments, the n-type doping impurity is Si, Ge, Sn, or Pb.\",\n \"In some embodiments, number of cycles of the superlattice structure layer is 60-150.In another aspect, a light-emitting system is provided including a plurality of the nitride light-emitting diodes.\",\n \"The light-emitting system can be used in the field of, for example, lighting, display, signage, etc.\",\n \"Various embodiments of the present disclosure can have one or more of the following advantageous effects: 1) the n-type layer is a superlattice structure with alternating undoped AlGaN layer and n-type doped GaN layer so that the first stress produced by the undoped AlGaN layer and the second stress produced by the n-type doped GaN layer offset each other, thus reducing crystal defect and wrapping of the n-type layer due to high doping concentration, such as dark spot on the surface and atomization; 2) doping concentration of the n-type layer is above 1×1020/cm3, which reduces series resistance of the crystal, and further reduces driving voltage; 3) thickness of the undoped AlGaN layer and the n-type doped GaN layer is controlled to the extent that thickness of the undoped AlGaN layer is less than that of the n-type doped GaN layer, for adjusting surface flatness of the superlattice structure, thereby improving crystal quality of the superlattice structure, reducing lattice mismatch with subsequent epitaxial layer and crack and crystal wrapping due to large tensile stress; and 4) the superlattice structure formed by the undoped AlGaN layer and the n-type doped GaN layer can effectively disperse electric field so as to improve antistatic capacity and device stability.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and constitute a part of this specification, together with the embodiments, are therefore to be considered in all respects as illustrative and not restrictive.\",\n \"In addition, the drawings are merely illustrative, which are not drawn to scale.\",\n \"FIG.\",\n \"1 is a structural diagram of the nitride light emitting diode according to some embodiments.\",\n \"FIG.\",\n \"2 is a structural diagram of an N-type layer according to the present invention.\",\n \"FIG.\",\n \"3 is a growth flow diagram of the nitride light emitting diode according to some embodiments.\",\n \"FIG.\",\n \"4 is a structural diagram of a nitride light emitting diode formed according to the growth process of the nitride light emitting diode.\",\n \"In the drawings: 10: substrate; 20: buffer layer; 30: u-GaN layer; 40: n-type layer; 41: undoped AlGaN layer; 42: n-type doped GaN layer; 50: quantum well light emitting layer; 60: p-type layer; 70: n electrode; 80: p electrode.\",\n \"DETAILED DESCRIPTION Various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings and embodiments.\",\n \"Referring to FIG.\",\n \"1, a nitride light emitting diode comprises a substrate 10, and a nitride buffer layer 20, an n-type layer 40, a quantum well light emitting layer 50 and a p-type layer 60 over the substrate 10.In this embodiment, the nitride light emitting diode also comprises a u-GaN layer 30 between the nitride buffer layer 20 and the n-type layer 40, wherein, the substrate 10 can be any one of a sapphire plain substrate, a sapphire patterned substrate, a SiC substrate, a GaN substrate, a Si substrate, a glass substrate or a metal substrate; the nitride buffer layer 20 is a single-layer structure or a superlattice structure, and the component material is one or more of GaN, AlN, AlGaN or AlxMyGal-x-yN (x>0,y>0), where, M is In, Si or metal; and the p-type layer 60 is an Mg-doped GaN layer.\",\n \"In the prior art, in the n-type layer 40 of epitaxial growth, the n-type doping concentration is generally less than 1×1019/cm3, because when n-type doping is higher than 1×1020/cm3, the crystal would appear surface defect and wrapping, such as dark spot and atomization; as doping concentration increases, series resistance of the n-type layer 40 decreases, thus further decreasing voltage of the overall light emitting diode.\",\n \"Therefore, given the reversed impact of the doping concentration on the crystal quality and the series resistance, some embodiments of the present disclosure solve the important problem of decreasing surface defect and wrapping of the crystal while increasing doping concentration to reduce series resistance.\",\n \"Referring to FIG.\",\n \"2, to solve the surface defect and wrapping of the crystal when doping concentration is high, such as dark spot and atomization, in this embodiment, the n-type layer 40 is a superlattice structure with alternating undoped AlGaN layer 41 and n-type doped GaN layer 42, wherein, the first stress produced by the undoped AlGaN layer 41 and the second stress produced by the n-type doped GaN layer 42 in the superlattice structure offset each other, so as to reduce crystal defect and wrapping of the n-type layer due to doping, wherein, the n-type doping material is Si, Ge, Sn or Pb.\",\n \"In this embodiment, Si is preferred.\",\n \"The first stress and the second stress are of same or different stress.\",\n \"In this embodiment, the first stress produced by the undoped AlGaN layer 41 and the second stress produced by the n-type doped GaN layer 42 are different, where the first stress is tensile stress, and the second stress is pressure stress.\",\n \"Referring further to FIG.\",\n \"2, tensile stress produced by the undoped AlGaN layer 41 increases as Al component increases, and pressure stress produced by the n-type doped GaN layer 42 increases as Si doping concentration and thickness increase.\",\n \"Therefore, in this embodiment, Al component of the undoped AlGaN layer 41, Si concentration of the n-type doped GaN layer 42 and thickness of the n-type doped GaN layer 42 and the undoped AlGaN layer 41 are adjusted so that the tensile stress produced by the undoped AlGaN layer 41 and the pressure stress produced by the n-type doped GaN layer 42 offset each other.\",\n \"Specifically, Al component of the undoped AlGaN layer 41 is 3%-8%, and Si doping concentration is 1×1020/cm3-1×1022/cm3.As Si doping of the n-type doped GaN layer 42 is higher than common 1×1019/cm3, the n-type GaN layer 42 and the undoped AlGaN layer 41 in one circle are of thin layer structure so that pressure stress produced by the n-type GaN layer 42 and tensile stress produced by the undoped AlGaN layer 41 in one circle can be completely released and offset each other; specifically, the n-type GaN layer 42 is 5 Å-150 Å thick, thickness ratio of the undoped AlGaN layer 41 and the n-type GaN layer 42 is 1: 2-1:4; number of cycles of the superlattice structure with the undoped AlGaN layer 41 and the n-type doped GaN layer 42 is set to 60-150 without changing conventional total thickness of the N-type layer 40 (in general 1 μm-2.5 μm).\",\n \"Thickness of the n-type GaN layer 42 is larger than that of the undoped AlGaN layer 41.In one circle, an n-type doped GaN layer 42 with flat surface is formed to adjust the surface flatness of the superlattice structure, and to inhibit lattice defect extension; on the other hand, tensile stress produced by the undoped AlGaN layer 41 is so high that pressure stress produced by the n-type doped GaN layer 42 cannot be offset, thus producing cracks.\",\n \"Referring to FIGS.\",\n \"3-4, to fabricate an aforesaid nitride light emitting diode, the embodiment provides a growth method, specifically: S1.provide a substrate 10; S2.grow a nitride buffer layer 20 over the substrate 10; S3.grow an n-type layer 40 over the nitride buffer layer 20; S4.grow a quantum well light emitting layer 50 and a p-type layer 60 over the n-type layer 40.The n-type layer 40 formed in step S3 is a superlattice structure with alternating undoped AlGaN 41 and n-type doped GaN layer 42, wherein, the first stress produced by the undoped AlGaN layer 41 and the second stress produced by the n-type doped GaN layer 42 different from the first stress in the superlattice structure offset each other, thus reducing crystal defect and wrapping of the N-type layer 40 due to doping.\",\n \"In this embodiment, step S1 also comprises high-temperature treatment of the substrate 10 under 1100-1200° C. hydrogen atmosphere to remove impurity on surface of the substrate 10; in general, step S4) is followed by chip fabrication process; for example, an n electrode 70 and a p electrode 80 are fabricated over the n-type layer 40 and the p-type layer 60 through coating, development, etching and deposition.\",\n \"In this embodiment, it is preferred to grow a GaN buffer layer 20 over the sapphire substrate under low temperature.\",\n \"As the sapphire substrate and the GaN are of heterostructure, to further buffer the extension of lattice mismatch defect between the substrate and the GaN epitaxial layer, a high-temperature u-GaN layer 30 is grown after step S2) to improve bottom lattice quality.\",\n \"Then, continue to grow a superlattice structure of undoped AlGaN and n-type doped GaN over the u-GaN layer 30.Adjust the reaction chamber temperature to above 1,050° C. and pressure below 100 torr.\",\n \"Control the carrier gas flow.\",\n \"Grow the undoped AlGaN layer 41, and then grow an n-type doped GaN layer 42 with n-type doped concentration higher than or equal to 1×1020/cm3 over the undoped AlGaN layer 41, and repeat this for 60-150 cycles.\",\n \"Wherein, the first stress produced by the undoped AlGaN layer 41 and the second stress produced by the n-type doped GaN layer 42 different from the first stress offset each other to reduce the crystal defect and wrapping caused by n-type doped concentration higher than or equal to 1×1020/cm3.Other parameters and functional mechanisms of the structure produced by this method are same as those aforesaid, which are not repeated.\",\n \"In this embodiment, the doping concentration of the n-type layer 40 is controlled higher than or equal to 1×1020/cm3, to substantially reduce series resistance of the light emitting diode, and further reduce driving voltage of the chip.\",\n \"Then, the n-type layer 40 with single growth method is changed to a superlattice structure formed by a undoped AlGaN layer 41 and an n-type doped GaN layer 42 to reduce crystal defect and wrapping caused by n-type doping concentration higher than or equal to 1×1020/cm3 so as to further improve photoelectric property of the device.\",\n \"Although specific embodiments have been described above in detail, the description is merely for purposes of illustration.\",\n \"It should be appreciated, therefore, that many aspects described above are not intended as required or essential elements unless explicitly stated otherwise.\",\n \"Various modifications of, and equivalent acts corresponding to, the disclosed aspects of the exemplary embodiments, in addition to those described above, can be made by a person of ordinary skill in the art, having the benefit of the present disclosure, without departing from the spirit and scope of the disclosure defined in the following claims, the scope of which is to be accorded the broadest interpretation so as to encompass such modifications and equivalent structures.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870899"}}},{"rowIdx":4493673,"cells":{"text":{"kind":"list like","value":[["CONTROLLER ARRANGEMENT, METHOD AND COMPUTER PROGRAM","A controller arrangement comprising a transceiver capable of communication via a wireless communication network, a controller arranged to control a physical entity at which the controller arrangement is arranged, and an interface between the transceiver and the controller is disclosed.","The transceiver is arranged to provide information via the interface about present or imminent interrupts in the communication via the wireless network.","The controller is arranged to operate in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.","A method and computer program are also disclosed."],["1: A controller arrangement comprising a transceiver capable of communication via a wireless communication network; a controller arranged to control a physical entity at which the controller arrangement is arranged; and an interface between the transceiver and the controller, wherein the transceiver is arranged to provide information via the interface about present or imminent interrupts in the communication via the wireless network, and the controller is arranged to operate in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.","2: The controller arrangement of claim 1, wherein the wireless communication network comprises a cellular communication network and the transceiver provides the information about present or imminent interrupts in the communication based on mobility management information associated with the wireless communication network.","3.","(canceled) 4: The controller arrangement of claim 2, wherein the mobility management information associated with the wireless communication network comprises instructions provided from a node of the wireless communication network.","5: The controller arrangement of claim 2, wherein the mobility management information associated with the wireless communication network comprises indications on a completed task provided from the transceiver.","6: The controller arrangement of claim 1, wherein the wireless communication network comprises a short range communication network and the transceiver provides the information about present or imminent interrupts in the communication based on connection state information in relation to an access point of the wireless communication network.","7: The controller arrangement of claim 6, wherein the connection state information in relation to the access point of the wireless communication network comprises any of: in-synchronization with the access point; out-of-synchronization with the access point; scanning for access points ongoing; reconnection to an access point ongoing; authentication process; and association process.","8: The controller arrangement of claim 1, wherein the second state comprises: a first sub-state when the information indicates that interrupts are present or imminent during predetermined periods, wherein the first sub-state includes open loop control from the remote entity via the wireless communication network in conjunction with the autonomous control operations by the controller, and a second sub-state when the information indicates that interrupts are present or imminent during an unknown time, wherein the second sub-state includes the autonomous control operations by the controller without control from the remote entity via the wireless communication network.","9.","(canceled) 10: The controller arrangement of claim 8, wherein the first sub-state is when a duration of the interrupt is known and below a threshold, and the second sub-state is when the duration of the interrupt is unknown or above the threshold.","11: A method of a controller arrangement comprising a transceiver capable of communication via a wireless communication network and a controller arranged to control a physical entity at which the controller arrangement is arranged, the method comprising: providing information by the transceiver to the controller about present or imminent interrupts in the communication via the wireless network; and operating the controller in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.","12: The method of claim 11, wherein the providing of the information about present or imminent interrupts in the communication is based on mobility management information associated with the wireless communication network.","13.","(canceled) 14: The method of claim 12, wherein the mobility management information associated with the wireless communication network comprises instructions provided from a node of the wireless communication network.","15: The method of claim 12, wherein the mobility management information associated with the wireless communication network comprises indications on a completed task provided from the transceiver.","16: The method of claim 11, wherein the wireless communication network comprises a short range communication network and providing of the information by the transceiver about present or imminent interrupts in the communication is based on connection state information in relation to an access point of the wireless communication network.","17: The method of claim 16, wherein the connection state information in relation to the access point of the wireless communication network comprises any of: in-synchronization with the access point; out-of-synchronization with the access point; scanning for access points ongoing; reconnection to an access point ongoing; authentication process; and association process.","18: The method of claim 11, wherein the second state comprises: a first sub-state when the information indicates that interrupts are present or imminent during predetermined periods, wherein the operating of the controller in the first sub-state includes open loop control from the remote entity via the wireless communication network in conjunction with the autonomous control operations by the controller, and a second sub-state when the information indicates that interrupts are present or imminent during an unknown time, wherein the operating of the controller in the second sub-state includes the autonomous control operations by the controller without control from the remote entity via the wireless communication network.","19.","(canceled)"],[" BACKGROUND A traditional control system can basically be seen as a controller providing a control signal to one or more actuators affecting a physical entity, such as a machine or process, wherein one or more sensors determine actual conditions of the physical entity and provide feedback signals to the controller which compares, using a more or less complex control model, the conditions with desired conditions to provide the control signal with aim to make the actual conditions agree with the desired conditions.","Sometimes, it is desirable to provide remote control via a network, e.g.","a wireless network.","Traditionally, distributed automation systems have been connected using physical wires but with advent of technologies such as WiFi, Bluetooth, ZigBee, WirelessHART etc., wireless control have become commonplace.","An important factor for automation systems is latency and with cellular systems of fourth generation coming down to round trip delays at around 20-40 milliseconds cellular technologies are becoming an interesting alternative that in addition to existing solutions offer better range, mobility and centralized management.","FIG.","1 shows a distributed control system 100 where a sensor 102 and an actuator 104 are connected to a control node 106 over a network 108 for performing control of a process 110 .","The performance of the system 100 is highly dependent on information about communication delays 112 , 114 .","If the network 108 is wireless the system 100 must also handle the case when connectivity is lost.","FIG.","2 shows a hierarchical control system 200 with a local controller 202 and a supervisory controller 204 .","This setup is common in for example robotics and the process industry.","The local controller 202 may be a standard PID (Proportional Integral Derivative) controller and the supervisory controller 204 provides set point values.","In the robotics case the trajectory may be remotely generated and while the control loops for the individual joints execute locally.","Another example is coordination of autonomous aerial vehicles, as disclosed by A. Bemporad and C. Rocchi in the article “Decentralized Hybrid Model Predictive Control of a Formation of Unmanned Aerial Vehicles”, where the supervisory controller 204 runs a model predictive controller (MPC) for generating trajectories, mission planning and handle collision avoidance and the actual flight control system (stabilization, etc.)","runs locally by the local controller 202 .","Control systems may be arranged to operate in different modes and where each mode possibly corresponds to a different control strategy.","A number of examples of hybrid control systems are disclosed in the PhD Thesis by Jorgen Malmborg, “Analysis and Design of Hybrid Control Systems”, Lund University.","For example the hybrid controller in FIG.","3 , which is represented as a Grafcet diagram with four states and two control modes.","One mode is using an optimal approach (Opt Controller), e.g.","when changing set point, and a PID controller (PID Controller) when the system output is close to the set-point.","In the case of the autonomous aerial vehicles, as discussed in in the article “Decentralized Hybrid Model Predictive Control of a Formation of Unmanned Aerial Vehicles” by A. Bemporad and C. Rocchi, a hybrid control strategy may be applied to handle loss of connectivity.","From the discussion above, the need of an approach how to handle distributed control in view of connectivity is evident."],[" SUMMARY The invention is based on the understanding that control via a wireless network may imply delays that are not compatible with the control task.","The inventors have found that by adapting control approach based on state of communication over the network, efficient control may be provided also where a supervisory controller is involved in the control via a wireless communication network.","According to a first aspect, there is provided a controller arrangement comprising a transceiver capable of communication via a wireless communication network, a controller arranged to control a physical entity at which the controller arrangement is arranged, and an interface between the transceiver and the controller.","The transceiver is arranged to provide information via the interface about present or imminent interrupts in the communication via the wireless network.","The controller is arranged to operate in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.","The wireless communication network may comprise a cellular communication network and the transceiver may provide the information about present or imminent interrupts in the communication based on mobility management information associated with the wireless communication network.","The mobility management information associated with the wireless communication network may comprise any of measurement execute instruction, handover execute instruction, measurement completed, handover completed, release connection with redirect instruction, release connection with redirect completed, connection reestablishment instruction, and connection reestablishment completed.","The mobility management information associated with the wireless communication network may comprise instructions provided from a node of the wireless communication network.","The mobility management information associated with the wireless communication network may comprise indications on a completed task provided from the transceiver.","The wireless communication network may comprise a short range communication network and the transceiver may provide the information about present or imminent interrupts in the communication based on connection state information in relation to an access point of the wireless communication network.","The connection state information in relation to the access point of the wireless communication network may comprise any of in-synchronization with the access point, out-of-synchronization with the access point, scanning for access points ongoing, reconnection to an access point ongoing, authentication process, and association process.","The second state may comprise a first sub-state when the information indicates that interrupts are present or imminent during predetermined periods, wherein the first sub-state includes open loop control from the remote entity via the wireless communication network in conjunction with the autonomous control operations by the controller, and a second sub-state when the information indicates that interrupts are present or imminent during an unknown time, wherein the second sub-state includes the autonomous control operations by the controller without control from the remote entity via the wireless communication network.","The first sub-state may be when the information indicates that the transceiver is to be connected to the same node of the wireless communication network after the interrupt as before the interrupt, and the second sub-state may be when the information indicates that the transceiver is to be connected to another node of the wireless communication network after the interrupt than before the interrupt.","The first sub-state may be when a duration of the interrupt is known and below a threshold, and the second sub-state may be when the duration of the interrupt is unknown or above the threshold.","According to a second aspect, there is provided a method of a controller arrangement comprising a transceiver capable of communication via a wireless communication network and a controller arranged to control a physical entity at which the controller arrangement is arranged.","The method comprises providing information by the transceiver to the controller about present or imminent interrupts in the communication via the wireless network, and operating the controller in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.","The providing of the information about present or imminent interrupts in the communication may be based on mobility management information associated with the wireless communication network.","The mobility management information associated with the wireless communication network may comprise any of measurement execute instruction, handover execute instruction, measurement completed, handover completed, release connection with redirect instruction, release connection with redirect completed, connection reestablishment instruction, and connection reestablishment completed.","The mobility management information associated with the wireless communication network may comprise instructions provided from a node of the wireless communication network.","The mobility management information associated with the wireless communication network may comprise indications on a completed task provided from the transceiver.","The wireless communication network may comprise a short range communication network and providing of the information by the transceiver about present or imminent interrupts in the communication may be based on connection state information in relation to an access point of the wireless communication network.","The connection state information in relation to the access point of the wireless communication network may comprise any of in-synchronization with the access point, out-of-synchronization with the access point, scanning for access points ongoing, reconnection to an access point ongoing, authentication process, and association process.","The second state may comprises a first sub-state when the information indicates that interrupts are present or imminent during predetermined periods, wherein the operating of the controller in the first sub-state includes open loop control from the remote entity via the wireless communication network in conjunction with the autonomous control operations by the controller, and a second sub-state when the information indicates that interrupts are present or imminent during an unknown time, wherein the operating of the controller in the second sub-state includes the autonomous control operations by the controller without control from the remote entity via the wireless communication network.","The first sub-state may be when the information indicates that the transceiver is to be connected to the same node of the wireless communication network after the interrupt as before the interrupt, and the second sub-state may be when the information indicates that the transceiver is to be connected to another node of the wireless communication network after the interrupt than before the interrupt.","The first sub-state may be when a duration of the interrupt is known and below a threshold, and the second sub-state may be when the duration of the interrupt is unknown or above the threshold.","According to a third aspect, there is provided a computer program comprising instructions which, when executed on a processor of a communication apparatus, causes the communication apparatus to perform the method according to the second aspect."],["TECHNICAL FIELD The present invention generally relates to a controller arrangement comprising a transceiver capable of communication via a wireless communication network, a controller arranged to control a physical entity at which the controller arrangement is arranged, and an interface between the transceiver and the controller, method of such a controller arrangement, and a computer program for implementing the method.","BACKGROUND A traditional control system can basically be seen as a controller providing a control signal to one or more actuators affecting a physical entity, such as a machine or process, wherein one or more sensors determine actual conditions of the physical entity and provide feedback signals to the controller which compares, using a more or less complex control model, the conditions with desired conditions to provide the control signal with aim to make the actual conditions agree with the desired conditions.","Sometimes, it is desirable to provide remote control via a network, e.g.","a wireless network.","Traditionally, distributed automation systems have been connected using physical wires but with advent of technologies such as WiFi, Bluetooth, ZigBee, WirelessHART etc., wireless control have become commonplace.","An important factor for automation systems is latency and with cellular systems of fourth generation coming down to round trip delays at around 20-40 milliseconds cellular technologies are becoming an interesting alternative that in addition to existing solutions offer better range, mobility and centralized management.","FIG.","1 shows a distributed control system 100 where a sensor 102 and an actuator 104 are connected to a control node 106 over a network 108 for performing control of a process 110.The performance of the system 100 is highly dependent on information about communication delays 112, 114.If the network 108 is wireless the system 100 must also handle the case when connectivity is lost.","FIG.","2 shows a hierarchical control system 200 with a local controller 202 and a supervisory controller 204.This setup is common in for example robotics and the process industry.","The local controller 202 may be a standard PID (Proportional Integral Derivative) controller and the supervisory controller 204 provides set point values.","In the robotics case the trajectory may be remotely generated and while the control loops for the individual joints execute locally.","Another example is coordination of autonomous aerial vehicles, as disclosed by A. Bemporad and C. Rocchi in the article “Decentralized Hybrid Model Predictive Control of a Formation of Unmanned Aerial Vehicles”, where the supervisory controller 204 runs a model predictive controller (MPC) for generating trajectories, mission planning and handle collision avoidance and the actual flight control system (stabilization, etc.)","runs locally by the local controller 202.Control systems may be arranged to operate in different modes and where each mode possibly corresponds to a different control strategy.","A number of examples of hybrid control systems are disclosed in the PhD Thesis by Jorgen Malmborg, “Analysis and Design of Hybrid Control Systems”, Lund University.","For example the hybrid controller in FIG.","3, which is represented as a Grafcet diagram with four states and two control modes.","One mode is using an optimal approach (Opt Controller), e.g.","when changing set point, and a PID controller (PID Controller) when the system output is close to the set-point.","In the case of the autonomous aerial vehicles, as discussed in in the article “Decentralized Hybrid Model Predictive Control of a Formation of Unmanned Aerial Vehicles” by A. Bemporad and C. Rocchi, a hybrid control strategy may be applied to handle loss of connectivity.","From the discussion above, the need of an approach how to handle distributed control in view of connectivity is evident.","SUMMARY The invention is based on the understanding that control via a wireless network may imply delays that are not compatible with the control task.","The inventors have found that by adapting control approach based on state of communication over the network, efficient control may be provided also where a supervisory controller is involved in the control via a wireless communication network.","According to a first aspect, there is provided a controller arrangement comprising a transceiver capable of communication via a wireless communication network, a controller arranged to control a physical entity at which the controller arrangement is arranged, and an interface between the transceiver and the controller.","The transceiver is arranged to provide information via the interface about present or imminent interrupts in the communication via the wireless network.","The controller is arranged to operate in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.","The wireless communication network may comprise a cellular communication network and the transceiver may provide the information about present or imminent interrupts in the communication based on mobility management information associated with the wireless communication network.","The mobility management information associated with the wireless communication network may comprise any of measurement execute instruction, handover execute instruction, measurement completed, handover completed, release connection with redirect instruction, release connection with redirect completed, connection reestablishment instruction, and connection reestablishment completed.","The mobility management information associated with the wireless communication network may comprise instructions provided from a node of the wireless communication network.","The mobility management information associated with the wireless communication network may comprise indications on a completed task provided from the transceiver.","The wireless communication network may comprise a short range communication network and the transceiver may provide the information about present or imminent interrupts in the communication based on connection state information in relation to an access point of the wireless communication network.","The connection state information in relation to the access point of the wireless communication network may comprise any of in-synchronization with the access point, out-of-synchronization with the access point, scanning for access points ongoing, reconnection to an access point ongoing, authentication process, and association process.","The second state may comprise a first sub-state when the information indicates that interrupts are present or imminent during predetermined periods, wherein the first sub-state includes open loop control from the remote entity via the wireless communication network in conjunction with the autonomous control operations by the controller, and a second sub-state when the information indicates that interrupts are present or imminent during an unknown time, wherein the second sub-state includes the autonomous control operations by the controller without control from the remote entity via the wireless communication network.","The first sub-state may be when the information indicates that the transceiver is to be connected to the same node of the wireless communication network after the interrupt as before the interrupt, and the second sub-state may be when the information indicates that the transceiver is to be connected to another node of the wireless communication network after the interrupt than before the interrupt.","The first sub-state may be when a duration of the interrupt is known and below a threshold, and the second sub-state may be when the duration of the interrupt is unknown or above the threshold.","According to a second aspect, there is provided a method of a controller arrangement comprising a transceiver capable of communication via a wireless communication network and a controller arranged to control a physical entity at which the controller arrangement is arranged.","The method comprises providing information by the transceiver to the controller about present or imminent interrupts in the communication via the wireless network, and operating the controller in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.","The providing of the information about present or imminent interrupts in the communication may be based on mobility management information associated with the wireless communication network.","The mobility management information associated with the wireless communication network may comprise any of measurement execute instruction, handover execute instruction, measurement completed, handover completed, release connection with redirect instruction, release connection with redirect completed, connection reestablishment instruction, and connection reestablishment completed.","The mobility management information associated with the wireless communication network may comprise instructions provided from a node of the wireless communication network.","The mobility management information associated with the wireless communication network may comprise indications on a completed task provided from the transceiver.","The wireless communication network may comprise a short range communication network and providing of the information by the transceiver about present or imminent interrupts in the communication may be based on connection state information in relation to an access point of the wireless communication network.","The connection state information in relation to the access point of the wireless communication network may comprise any of in-synchronization with the access point, out-of-synchronization with the access point, scanning for access points ongoing, reconnection to an access point ongoing, authentication process, and association process.","The second state may comprises a first sub-state when the information indicates that interrupts are present or imminent during predetermined periods, wherein the operating of the controller in the first sub-state includes open loop control from the remote entity via the wireless communication network in conjunction with the autonomous control operations by the controller, and a second sub-state when the information indicates that interrupts are present or imminent during an unknown time, wherein the operating of the controller in the second sub-state includes the autonomous control operations by the controller without control from the remote entity via the wireless communication network.","The first sub-state may be when the information indicates that the transceiver is to be connected to the same node of the wireless communication network after the interrupt as before the interrupt, and the second sub-state may be when the information indicates that the transceiver is to be connected to another node of the wireless communication network after the interrupt than before the interrupt.","The first sub-state may be when a duration of the interrupt is known and below a threshold, and the second sub-state may be when the duration of the interrupt is unknown or above the threshold.","According to a third aspect, there is provided a computer program comprising instructions which, when executed on a processor of a communication apparatus, causes the communication apparatus to perform the method according to the second aspect.","BRIEF DESCRIPTION OF THE DRAWINGS The above, as well as additional objects, features and advantages of the present invention, will be better understood through the following illustrative and non-limiting detailed description of preferred embodiments of the present invention, with reference to the appended drawings.","FIG.","1 schematically illustrates a distributed control system.","FIG.","2 shows a hierarchical control system.","FIG.","3 is a Grafcet diagram illustrating a hybrid controller.","FIG.","4 schematically illustrates a controller arrangement according to an embodiment and a supervisory controller acting via a wireless network.","FIG.","5 schematically illustrates a controller arrangement in a situation where no interrupts are present or imminent.","FIG.","6 schematically illustrates a controller arrangement in a situation where interrupts are present or imminent.","FIG.","7 schematically illustrates a controller arrangement in a situation where interrupts are present or imminent.","FIG.","8 is a state diagram illustrating three states.","FIG.","9 shows some principle communication modes related to mobility and handover (HO), with timings related to LTE.","FIG.","10 shows a mobile controller unit which handles sensing and actuation and is connected to a supervisory control system in the cloud.","FIG.","11 shows a state machine describing the states of the communication channel.","FIG.","12 illustrates an example of a HO process.","FIGS.","13 to 16 illustrate interrupts in a mobility scenario according to embodiments.","FIG.","17 is a flow chart schematically illustrating a method according to embodiments.","FIG.","18 is a flow chart illustrating an example of a method.","FIG.","19 is a flow chart illustrating an example of a method for a short range wireless network context.","FIG.","20 is a flow chart illustrating an example of a method for a cellular wireless network context.","FIG.","21 schematically illustrates a computer-readable medium comprising a computer program with instructions, which when executed on the illustrated processing means causes the processing means to perform methods of embodiments.","DETAILED DESCRIPTION FIG.","4 schematically illustrates a controller arrangement 400 according to an embodiment and a supervisory controller 450 acting via a wireless communication network 440.The controller arrangement 400 comprises a transceiver 402, a local controller 404 and an interface 406 between the transceiver 402 and the local controller 404.The transceiver 402 is capable of communication via the wireless communication network 440, as indicated by antenna 408 of the transceiver 402 and antenna 442 of the wireless communication network 440.The local controller 404 is arranged to control a physical entity 410, e.g.","a machine and/or a process.","For this, the controller arrangement 400 is arranged in vicinity of the physical entity 410, such that a control signal 412 is provided to one or more actuators 414 which act on the physical entity 410.One or more sensors 416 monitor actual states, values, etc.","of the physical entity 410 and provide sensor signal(s) 418 to the controller arrangement 400.The supervisory controller 450 is arranged to provide control information and control signals to the controller arrangement 400 via the wireless communication network 440 such that the control signal 412 may emanate from the supervisory controller 450, at least partially as for example discussed in the introductory portion of this disclosure.","In FIG.","4 it is illustrated that all control signals 412 are provided by or through the local controller 404, but control signals 412 emanating from the supervisory controller 450 may also be provided to the actuator(s) 414 without involving the local controller 404.In such cases, some of the control signals 412 may for example be provided directly from the interface 406 to the actuator(s) 414.Similar, the supervisory controller 450 is arranged to receive information about sensor values and/or states, and optionally also states of the local controller 404, via the wireless communication network 440.The transceiver 402 is arranged to provide information via the interface 406 about present or imminent interrupts in the communication via the wireless communication network 440.For example, when the wireless communication network comprises a cellular communication network, the transceiver may provide the information about present or imminent interrupts in the communication based on mobility management information associated with the wireless communication network.","The mobility management information may for example comprises any of measurement execute instruction, handover execute instruction, measurement completed, handover completed, etc.","Examples will be further discussed with reference to e.g.","FIGS.","8 to 12.The local controller 404 is arranged to operate in at least a first state when the information indicates that no interrupts are present or imminent.","The first state includes closed loop control from the supervisory controller 450 via the wireless communication network 440.The local controller 404 is arranged to operate in a second state when the information indicates that interrupts are present or imminent.","The second state includes autonomous control operations by the local controller 404.The second state may comprise different sub-states depending on the nature of the present or imminent interrupts in communication.","For example, a first sub-state may be when the information indicates that interrupts are present or imminent during predetermined periods, wherein open loop control from the supervisory controller 450 may be performed via the wireless communication network 440 in conjunction with the autonomous control operations by the local controller 404 when in the first sub-state, and a second sub-state may be when the information indicates that interrupts are present or imminent during an unknown time, wherein autonomous control operations may be performed by the local controller 404, i.e.","without control from the supervisory control, when in the second sub-state.","Further sub-states may be applied, e.g.","based on known or estimated durations of interrupts wherein the autonomous control approach depends on the known or estimated duration.","Estimated duration may in this case be based on historical data, e.g.","for the actual location of the controller arrangement 400, and thus the transceiver 402.Here, the states or sub-states including autonomous control discussed above may include that one or some of the one or more actuators 414 are disabled and/or put in some fail-safe position or state.","This may provide for robust control also without the closed-loop supervisory control although some control features may be omitted.","The design of this may depend on the nature of the physical entity 410.Considering the example above, the first sub-state may be applied when the information indicates that the transceiver is to be connected to the same node of the wireless communication network after the interrupt as before the interrupt, e.g.","for a cellular communication system 440, and the second sub-state is when the information indicates that the transceiver is to be connected to another node of the wireless communication network after the interrupt than before the interrupt, e.g.","for a handover situation in the cellular communication system 440.Another consideration of the example above may be that the first sub-state is applied when a duration of the interrupt is known and below a threshold, and the second sub-state is applied when the duration of the interrupt is unknown or above the threshold.","For the application of the approach demonstrated above, there is a need for information exchange between the communication handling parts, i.e.","associated with the transceiver 402, and the control handling parts, i.e.","the local controller 404.This is handled by the interface 406.The interface 406 may be a physical entity, but may as well be a functional or logical entity implemented in the transceiver 402 and/or the local controller 404.However, for the understanding of the function of the interface 406, it will be explained as a physical entity, but from that understanding, an implementation in the transceiver 402 and/or the local controller 404 should be readily understood by an artisan.","The interface 406 receives a control data signal 420 from the transceiver 402.The control data is payload information demodulated and extracted by the transceiver from transmissions from the supervisory controller 450 via the wireless communication network 440.The control data is routed to the local controller and/or directly to the actuator(s) 414 as a control signal 422.The interface 406 also receives information from the control handling parts, including the sensor(s), about values and/or states of the physical entity 410 and/or the local control thereof.","This information may include the sensor signals 418 and an information signal 424 provided by the local controller 404.Data required or desired by the supervisory controller 450 is extracted and possibly packaged and transmitted as a data signal 426 to the transceiver 402 for transmission to the supervisory controller 450 via the wireless communication network 440.The interface 406 also receives a communication state signal 428 from the transceiver 402, which includes information about any present or imminent communication interrupts.","This information may be directly derived from control signalling information available in the transceiver or may already be processed to agree with the states/sub-states discussed above.","The interface 406 may process the received information to provide a control approach signal 430 to the local controller 404.The control approach signal 430 may be in any form usable for the local controller 404 to determine its preferred way of operating.","That is, the information may be raw data about the communication state such that the local controller 404 itself determines the way of operating, status information, e.g.","indicating one of the states or sub-states as discussed above, or direct control signals for controlling e.g.","multiplexers etc.","of the local controller 404.FIG.","5 schematically illustrates the controller arrangement 400 in a situation where no interrupts are present or imminent.","Here, only the control elements are shown since only one communication state is discussed.","Furthermore, the communication parts are only illustrated by the divided connection lines to the supervisory controller 450.This state includes closed loop control from the supervisory controller 450, wherein a control signal 452 is provided to the local controller 404, and/or directly to the actuator(s) 414, such that the actuator(s) 414 receives the control signal 412.The actuator(s) 414 affects, based thereon, the physical entity 410, which in turn is monitored by the sensor(s) 416.The sensor(s) provide a sensor signal 418 that is provided to the supervisory controller 450.That is, a closed loop control from the supervisory controller 450 is provided.","As discussed in the introductory part of this disclosure, some parts of the physical entity may still be desired to be handled by the local controller 404 although a closed loop control is provided from the supervisory controller 450, and the sensor signal 418 is thus also provided to the local controller 404.FIG.","6 schematically illustrates the controller arrangement 400 in a situation where interrupts are present or imminent.","This situation may be seen as the second sub-state of the second state in the example discussed above, i.e.","the interrupt is of such character that the local controller 404 will perform autonomous control.","Thus, the control loop only includes the local controller 404 providing the control signal 412 to the actuator(s) 414 which based thereon affects the physical entity 410.The sensor(s) 416 monitor the physical entity and provide the sensor signal 418 to the local controller 404.FIG.","7 schematically illustrates the controller arrangement 400 in a situation where interrupts are present or imminent.","This situation may be seen as the first sub-state of the second state in the example discussed above, i.e.","the interrupt is of such character that the local controller 404 will perform some kind of hybrid control, i.e.","autonomous control by the local controller 404 and open loop control from the supervisory controller 450.Thus, the provision of information to and from the supervisory controller 450 is illustrated as dashed lines indicating that time-critical control is disabled and only the open loop control is applicable.","An example for the context of a cellular communication network will now be given with reference to FIGS.","8 to 12 in which a limited number of states and sub-states are demonstrated to align with the functional description of the operation with reference to FIGS.","5 to 7.It should be noted that further states and sub-states are feasible and should be adapted to the particular features and needs of the communication system and the control system.","FIG.","8 is a state diagram illustrating three states: Normal, Limited and Off-line.","Here, the state Normal may be representing the first state discussed in the example above and the function may correspond to that demonstrated with reference to FIG.","5.The state Off-line may be representing the second state, first sub-state, discussed in the example above and the function may correspond to that demonstrated with reference to FIG.","6.The state Limited may be representing the second state, second sub-state, discussed in the example above and the function may correspond to that demonstrated with reference to FIG.","7.One central feature of cellular systems is seamless mobility, i.e.","the possibility for the transceiver to move between serving base stations (Node Bs, eNode Bs, etc.","depending on used Radio Access Technology (RAT), hereafter referred to as network (NW) nodes which thus refers to nodes of the access network) “without” interrupt of the ongoing service.","Without interrupt should be interpreted as that the application is not interrupted, since on the physical layer it will be a necessary interrupt in the communication between the device and the NW node.","FIG.","9 shows some principle communication modes related to mobility and handover (HO), with timings related to LTE.","Other systems, such as WCDMA and GSM, have similar principles, but may use other timings.","In the Normal mode, the transceiver is connected to the NW node and the uplink (UL) and downlink (DL) communication are made without any interrupt.","Typically a low cost transceiver is not able to communicate on two different carrier frequencies simultaneously.","Therefore, in case inter-frequency (IF) or inter-RAT (IRAT) HO is needed, due to the transceiver going out of coverage of serving cell and no strong intra frequency cells exists, the transceiver triggers IF/IRAT measurement.","Then the NW node configures measurement gaps, which may be 6 ms every 40 or 80 ms in LTE, where the transceiver can switch frequency and do IF/IRAT measurements.","During these 6 ms there is no possibility for UL or DL communication with the NW node, and hence the communication with the NW node is Limited.","Finally when a HO have been triggered by the modem, i.e.","a neighbouring cell either intra- or inter-frequency or IRAT has become sufficiently strong compared to the current serving cell, the transceiver reports that to the NW node, i.e.","as a “HO event”, and the NW node transmits a HO execute Radio Resource Control (RRC) message, which means “do HO to a target cell”, to the transceiver, and the transceiver starts to synchronize to the target cell.","During the HO operation, for the supervisory control application demonstrated above, the transceiver is considered to be Off-line since the duration for a HO operation may be long in sense of control operations.","Once being in-synchronization, the transceiver then makes a random access transmission to the NW node and the connection to the new cell is initiated.","Once a HO message complete message is transmitted from the transceiver to the NW node, the UL/DL data communication can start again, i.e.","return to Normal.","Hence, during this synchronization and initialization period, that may last, normally an in advance unknown time, between 10-1000 ms depending on HO type, i.e.","IRAT takes longer than LTE intra frequency HO, the transceiver is Off-line with regard to the NW node, and so particularly in sense of the controller application, and no data communication in UL and DL is possible.","Sometimes a regular HO process is substituted with a procedure where connection is released with a redirection instruction, and then a connection reestablishment, depending on network settings, wherein the procedure and thus the interrupt may take even longer time.","Here, it is to be noted that not every measurement leads to a HO event, and the measurement operation may be considered complete and the state may return to Normal.","Further, it is to be noted that a HO event also can occur without the measurement procedure demonstrated above, wherein a transition may be directly from Normal to Off-line.","Thus, the transitions between the states, which are also referenced to in some examples below, can for the cellular example be defined as Handover-Execute (HE)—Emitted when the transceiver is ordered to perform a hand-over.","After this event the mobile unit is not connected to the network until HC (see below) occurs.","Handover-Complete (HC)—Emitted when the hand-over is complete and the transceiver is yet again connected to the network.","Measure-Execute (ME)—Emitted when the transceiver is ordered to perform a link quality measurement on another Radio Access Technology (RAT) or other carrier frequency.","After this event the connectivity is degraded until e.g.","MC (see below) occurs.","Measure-Complete (MC)—Emitted when the measurement gaps are complete and the link quality is restored.","All events may contain additional data, including current bandwidth etc.","One possible setup presented in FIG.","10, which shows a mobile controller unit, which handles sensing and actuation and is connected to a supervisory control system in the cloud.","On the mobile node there a local controller application (“App Unit”) that receives events from the Wireless Connectivity Unit (WCU), which in this case corresponds to a cellular modem.","FIG.","10 shows an example employing the approach demonstrated above.","A mobile controller unit 1000, which handles sensing and actuation and is connected to a supervisory controller 1010, e.g.","implemented in the cloud.","On the mobile controller unit 1000 there is a local controller application (“App Unit”) 1002, illustrated by a state diagram similar to that shown in FIG.","8, which receives events from a Wireless Connectivity Unit (WCU) 1004, which in this case corresponds to a cellular modem, i.e.","a transceiver as demonstrated above, which also connects to the supervisory controller 1010 via a wireless network 1006.For the easier understanding of this disclosure, FIG.","12 illustrates an example of a HO process.","The corresponding states HE, HC, ME, MC can be mapped to received or transmitted Radio Resource Control/Management (RRC/RRM) messages in the mobile.","For example HE corresponds to RRC Connection configuration, including HO information and is received in the WCU 1004 after transmission of measurement report including HO event from the WCU and HC corresponds to RRC Connection Reconfiguration Complete.","Furthermore, ME corresponds to RRC Connection configuration, including measurement gap information and received in the device after transmission of measurement report including event for triggering IRAT/IF measurement from the WCU 1004, and MC corresponds to RRC Connection Reconfiguration Complete.","Once such message is transmitted (or received) by the mobility management unit in the WCU 1004, that information is fed from the WCU 1004 to the application unit using the new interface and protocol.","FIG.","11 shows a state machine describing the states of the communication channel.","“RRM HO event Transmitted from Device” corresponds to Measurement Reports, prior to HO decision in FIG.","12 and “HO execution” and “HO complete” to RRC Connection configuration and RRC Connection Reconfiguration Complete message, respectively, in FIG.","12.Corresponding mapping between the state transitions in FIG.","11 and RRC messages for the measurement gaps can also be found in the 3GPP specifications.","FIG.","11 may also be seen as a more detailed example, and in the context of 3GPP LTE, of what is illustrated in FIG.","8.Consider a transceiver, e.g.","the WCU 1004 as illustrated in FIG.","10, operating in a first state 1100 where UL/DL connection is without any interrupt.","Upon an RRM IF measurement event transmitted from the transceiver to the NW node, e.g.","triggered by a signal-to-noise ratio (SNR) being below a threshold, the transceiver enters a second state 1102 where the transceiver knows that interrupts in the connection is imminent and can provide that information to the control mechanism as discussed above.","Upon receiving RRM IF measurement execution information from the NW node, the transceiver enters a third state 1104 where inter-frequency measurements take place periodically, e.g.","6-10 ms each 40 or 80 ms, wherein connection is limited due to the inability to communicate during the measurements.","If the signal from the serving NW node becomes strong again, e.g.","the SNR becomes above the threshold, the transceiver may return to the first state 1100 and the control mechanism is informed accordingly.","If the transceiver found a more promising NW node by the measurements, it may send an RRM IF HO event to the NW node and the transceiver enters a fourth state 1106 where inter-frequency HO is triggered and the control mechanism is informed that a longer interrupt is imminent.","When the transceiver receives RRM IF HO execution information from the NW node, the transceiver enters a fifth state 1108 wherein the transceiver synchronizes etc.","with the target NW node.","This may take a longer time, say a couple of 100's of ms, and the time is hard to predict.","When connected to the target NW node, HO is completed and the transceiver returns to the first state 1100 and the control mechanism is informed accordingly.","Consider the transceiver operating in the first state 1100 and an RRM HO event is transmitted from the transceiver to the NW node directly, i.e.","without the measurements demonstrated above, the transceiver enters a sixth state 1110 where an intra-frequency HO event is triggered.","The control mechanism is informed that a longer interrupt is imminent.","When the transceiver receives RRM HO execution information from the NW node, the transceiver enters a seventh state 1112 where intra-frequency HO is performed wherein the transceiver synchronizes etc.","with the target NW node.","This may take a longer time, say a couple of 100's of ms, and the time is hard to predict.","When connected to the target NW node, HO is completed and the transceiver returns to the first state 1100 and the control mechanism is informed accordingly.","FIGS.","13 to 16 illustrate interrupts in a mobility scenario according to embodiments.","FIGS.","13 to 16 have been drawn to have resemblance with FIG.","10 of elements for the easier understanding impact of the mobility scenario to control states.","The mobility scenario may include different handover situations in a cellular wireless communication network, including also inter-RAT handover between cellular RATs.","As mentioned above, a regular HO process may be substituted with a procedure where connection is released with a redirection, and then a connection reestablishment, depending on network settings, wherein the procedure and thus the interrupt may take even longer time.","The mobility scenario may also include short range communication network where connection is moved between access points of the wireless communication network.","The mobility scenario may also include that connection is moved between a cellular communication network node and a network node, e.g.","an access point, of a short range communication network, and vice versa.","FIG.","13 illustrates that connection without interrupts is ongoing.","For a local control system, illustrated by a state diagram similar to that illustrated with reference to FIGS.","8 and 10, this operates in a first state employing closed loop control from a supervisory controller.","The current state is indicated by a dot in the state diagram.","FIG.","14 then illustrates that the controller arrangement and thus the transceiver has moved in relation to nodes of the communication network, and the transceiver has started to make measurements on neighbouring network nodes.","A measurement execute, ME, instruction causes the state to change to a limited connection state, as indicated by the dot in the state diagram, and the local controller starts to perform control more autonomous, e.g.","with aid of open loop control from the supervisory controller.","FIG.","15 illustrates that a handover execute, HE, instruction is received and the state is changed to an off-line state, as indicated by the dot, since no communication is available for some time, e.g.","10-1000 ms.","The time is normally hard to estimate, and also the open loop control from the supervisory controller cannot be relied on.","Thus, the local controller is left to perform autonomous control.","FIG.","16 illustrates that the transceiver has synchronized to the target network node and a handover complete, HC, may be issued.","The state thus returns to normal state wherein control again may be performed as closed loop control from the supervisory controller via the target network node.","The scenario illustrated with reference to FIGS.","13 to 16 has been described in the context of a cellular network by the reference to the handover procedure, but similar may apply for a short range wireless communication network where the transceiver makes transitions between different access points when moving.","In some short range wireless communication systems, mobility does not rely on signalling for handover, and the states may for example be defined for synchronization states of the transceiver to the different access points, whether authentication and/or association is to be performed, measurements performed on other access points, estimated back-off times, etc.","or a combination of any of these.","The transitions between states for the controller is however similar where communication for some periods may by limited or be considered as off-line for the time constraints of control operations.","It is to be noted that a wireless connectivity unit of a controller arrangement as demonstrated above may be arranged both for operation in cellular and short range communication networks where communication is selected where desired backhaul properties are provided.","Thus, a combination of the features above may be provided such that the controller arrangement is enabled to operate via the desired network.","Thus, for a transition between the network types, an interrupt is also caused, which is most likely to be such that the second sub-state of the second state is entered during that interrupt.","An exception is where the wireless transceiver unit is capable of keeping connection running with both the network types at the same time and the transition of the backhaul can be switched swiftly.","FIG.","17 is a flow chart schematically illustrating a method according to embodiments for a controller arrangement as described by the variants above.","Information about present or imminent interrupts in communication is provided 1700 by a wireless connectivity unit, i.e.","a transceiver of the controller arrangement.","This information may for example be based, as demonstrated above, on signalling, estimates, etc.","by the wireless connectivity unit.","The controller is then operated 1702 in a state corresponding to the information.","In addition to the already demonstrated variants of the approach, some examples will be given with reference to FIGS.","18 and 19.The skilled reader will however understand from the disclosure above that observed parameters of the communication may be substituted with others indicating nature of interrupts, and that only two states (without the sub-states) for operating the controller are also a feasible implementation, as well as that an implementation with more states and/or sub-states for operating the controller is feasible for a situation where the nature of the interrupts is defined with greater granularity.","FIG.","18 is a flow chart illustrating an example of a method for the example of two states wherein the second state comprises two sub-states as also exemplified above, i.e.","the controller may be operated for the different states similar to what has been described above.","Information about any interrupts is gained 1800.Based on the information, it is determined 1802 whether any interrupt is present or imminent.","If no interrupt is present or imminent, the controller is operated 1804 in the first state, i.e.","including closed loop control from the supervisory controller.","If interrupt is present or imminent, it is determined 1806 whether duration of interrupt(s) is unknown or above a threshold, i.e.","uncertain or impossible for the supervisory controller to perform control, the controller is operated 1808 in the second state, and in the second sub-state of the second state, i.e.","the local controller will have to act autonomously during the interrupt.","If the duration is below the threshold (implicating that the duration is known or reliably estimated), it is determined 1810 whether (or that, since there might not be any cases where this determination emanates in a “NO”, depending on the implementation) limited interrupts are present wherein the controller is operated 1812 in the first sub-state of the second state, i.e.","the supervisory controller may perform an open loop control and the local controller may perform some control tasks autonomously.","Whichever state the controller is operated in, a change in the communication situation is monitored 1814, and upon a change in the communication situation, the process returns to gaining 1800 the information thereabout and determine proper operation of the controller.","FIG.","19 is a flow chart illustrating an example of a method similar to the one demonstrated with reference to FIG.","18, but here more specifically in an example of a short range wireless network context.","Information about communication status is gained 1900 with the aim to detect or forecast any interrupts in the communication.","Based on the information, it is determined 1902 whether communication with an access point is reliable, i.e.","whether any interrupt is present or imminent.","If no interrupt is present or imminent, the controller is operated 1904 in the first state, i.e.","including closed loop control from the supervisory controller.","If interrupt is present or imminent, it is for example determined 1906 whether an authentication and/or association procedure is to be made, wherein duration of the interrupt is unknown or inherently above the threshold, i.e.","uncertain or impossible for the supervisory controller to perform control.","The controller is then operated 1908 in the second state, and in the second sub-state of the second state, i.e.","the local controller will have to act autonomously during the interrupt.","If no such time consuming activity or hard-to-predict duration is present or imminent, it is determined 1910 whether for example an estimate of back-off time is above the threshold.","If the estimated time is above the threshold, the controller is operated 1908 in the second state, and in the second sub-state of the second state.","If the estimated time is below the threshold, the controller is operated 1912 in the first sub-state of the second state, i.e.","the supervisory controller may perform an open loop control and the local controller may perform some control tasks autonomously.","Whichever state the controller is operated in, a change in the communication situation is monitored 1914, and upon a change in the communication situation, the process returns to gaining 1900 the information thereabout and determine proper operation of the controller.","FIG.","20 is a flow chart illustrating an example of a method similar to the one demonstrated with reference to FIG.","18, but here more specifically in an example of a cellular wireless network context.","Information about communication status, i.e.","measurement and handover process, is gained 2000 with the aim to detect or forecast any interrupts in the communication.","Based on the information, it is determined 2002 whether a handover execute (HE) or measurement execute (ME) is issued, i.e.","whether any interrupt is present or imminent.","If no interrupt is present or imminent, i.e.","no HE or ME issued, the controller is operated 2004 in the first state, i.e.","including closed loop control from the supervisory controller.","If HE or ME is issued, an interrupt is present or imminent, it is determined 2006 whether HE is issued, wherein duration of the interrupt is unknown or inherently above the threshold, i.e.","uncertain or impossible for the supervisory controller to perform control.","The controller is then operated 2008 in the second state, and in the second sub-state of the second state, i.e.","the local controller will have to act autonomously during the interrupt.","If no such time consuming activity or hard-to-predict duration is present or imminent, it is determined 2010 whether ME is issued.","If ME is issued, the controller is operated 1912 in the first sub-state of the second state, i.e.","the supervisory controller may perform an open loop control and the local controller may perform some control tasks autonomously.","Here, the “NO” option of the determination 2010 logically seems like an empty amount in light of the determinations 2002 and 2006.However, for some implementations, the determination 2002 may for some implementations include further events, which also may implicate further checks (not shown) resulting in further selectable operation states for the controller.","Thus, the “NO” option here is to be considered as a symbol for such further optional checks.","Whichever state the controller is operated in, a change in the communication situation is monitored 2014, and upon a change in the communication situation, the process returns to gaining 2000 the information thereabout and determine proper operation of the controller.","The methods according to the present invention are suitable for implementation with aid of processing means, such as computers and/or processors.","Therefore, there is provided computer programs, comprising instructions arranged to cause the processor or computer to perform the steps of any of the methods according to any of the embodiments described above, particularly those with reference to FIG.","17 to 20.The computer programs preferably comprises program code which is stored on a computer readable medium 2100, as illustrated in FIG.","21, which can be loaded and executed by a processing means, processor, or computer 2102 to cause it to perform the methods, respectively, according to embodiments of the present invention, preferably as any of the embodiments described with reference to FIGS.","17 to 20.The computer 2102 and computer program product 2100 can be arranged to execute the program code sequentially where actions of the any of the methods are performed stepwise.","The processing means, processor, or computer 2102 is preferably what normally is referred to as an embedded system.","Thus, the depicted computer readable medium 2100 and computer 2102 in FIG.","21 should be construed to be for illustrative purposes only to provide understanding of the principle, and not to be construed as any direct illustration of the elements.","For example, the processing means 2102 may be distributed between the local controller, the interface and the transceiver, or when the interface is implemented in the controller or the transceiver, or distributed thembetween, the processing means 2102 may be distributed between the local controller and the transceiver.","For some embodiments, the local controller may house the processing means 2102."]],"string":"[\n [\n \"CONTROLLER ARRANGEMENT, METHOD AND COMPUTER PROGRAM\",\n \"A controller arrangement comprising a transceiver capable of communication via a wireless communication network, a controller arranged to control a physical entity at which the controller arrangement is arranged, and an interface between the transceiver and the controller is disclosed.\",\n \"The transceiver is arranged to provide information via the interface about present or imminent interrupts in the communication via the wireless network.\",\n \"The controller is arranged to operate in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.\",\n \"A method and computer program are also disclosed.\"\n ],\n [\n \"1: A controller arrangement comprising a transceiver capable of communication via a wireless communication network; a controller arranged to control a physical entity at which the controller arrangement is arranged; and an interface between the transceiver and the controller, wherein the transceiver is arranged to provide information via the interface about present or imminent interrupts in the communication via the wireless network, and the controller is arranged to operate in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.\",\n \"2: The controller arrangement of claim 1, wherein the wireless communication network comprises a cellular communication network and the transceiver provides the information about present or imminent interrupts in the communication based on mobility management information associated with the wireless communication network.\",\n \"3.\",\n \"(canceled) 4: The controller arrangement of claim 2, wherein the mobility management information associated with the wireless communication network comprises instructions provided from a node of the wireless communication network.\",\n \"5: The controller arrangement of claim 2, wherein the mobility management information associated with the wireless communication network comprises indications on a completed task provided from the transceiver.\",\n \"6: The controller arrangement of claim 1, wherein the wireless communication network comprises a short range communication network and the transceiver provides the information about present or imminent interrupts in the communication based on connection state information in relation to an access point of the wireless communication network.\",\n \"7: The controller arrangement of claim 6, wherein the connection state information in relation to the access point of the wireless communication network comprises any of: in-synchronization with the access point; out-of-synchronization with the access point; scanning for access points ongoing; reconnection to an access point ongoing; authentication process; and association process.\",\n \"8: The controller arrangement of claim 1, wherein the second state comprises: a first sub-state when the information indicates that interrupts are present or imminent during predetermined periods, wherein the first sub-state includes open loop control from the remote entity via the wireless communication network in conjunction with the autonomous control operations by the controller, and a second sub-state when the information indicates that interrupts are present or imminent during an unknown time, wherein the second sub-state includes the autonomous control operations by the controller without control from the remote entity via the wireless communication network.\",\n \"9.\",\n \"(canceled) 10: The controller arrangement of claim 8, wherein the first sub-state is when a duration of the interrupt is known and below a threshold, and the second sub-state is when the duration of the interrupt is unknown or above the threshold.\",\n \"11: A method of a controller arrangement comprising a transceiver capable of communication via a wireless communication network and a controller arranged to control a physical entity at which the controller arrangement is arranged, the method comprising: providing information by the transceiver to the controller about present or imminent interrupts in the communication via the wireless network; and operating the controller in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.\",\n \"12: The method of claim 11, wherein the providing of the information about present or imminent interrupts in the communication is based on mobility management information associated with the wireless communication network.\",\n \"13.\",\n \"(canceled) 14: The method of claim 12, wherein the mobility management information associated with the wireless communication network comprises instructions provided from a node of the wireless communication network.\",\n \"15: The method of claim 12, wherein the mobility management information associated with the wireless communication network comprises indications on a completed task provided from the transceiver.\",\n \"16: The method of claim 11, wherein the wireless communication network comprises a short range communication network and providing of the information by the transceiver about present or imminent interrupts in the communication is based on connection state information in relation to an access point of the wireless communication network.\",\n \"17: The method of claim 16, wherein the connection state information in relation to the access point of the wireless communication network comprises any of: in-synchronization with the access point; out-of-synchronization with the access point; scanning for access points ongoing; reconnection to an access point ongoing; authentication process; and association process.\",\n \"18: The method of claim 11, wherein the second state comprises: a first sub-state when the information indicates that interrupts are present or imminent during predetermined periods, wherein the operating of the controller in the first sub-state includes open loop control from the remote entity via the wireless communication network in conjunction with the autonomous control operations by the controller, and a second sub-state when the information indicates that interrupts are present or imminent during an unknown time, wherein the operating of the controller in the second sub-state includes the autonomous control operations by the controller without control from the remote entity via the wireless communication network.\",\n \"19.\",\n \"(canceled)\"\n ],\n [\n \" BACKGROUND A traditional control system can basically be seen as a controller providing a control signal to one or more actuators affecting a physical entity, such as a machine or process, wherein one or more sensors determine actual conditions of the physical entity and provide feedback signals to the controller which compares, using a more or less complex control model, the conditions with desired conditions to provide the control signal with aim to make the actual conditions agree with the desired conditions.\",\n \"Sometimes, it is desirable to provide remote control via a network, e.g.\",\n \"a wireless network.\",\n \"Traditionally, distributed automation systems have been connected using physical wires but with advent of technologies such as WiFi, Bluetooth, ZigBee, WirelessHART etc., wireless control have become commonplace.\",\n \"An important factor for automation systems is latency and with cellular systems of fourth generation coming down to round trip delays at around 20-40 milliseconds cellular technologies are becoming an interesting alternative that in addition to existing solutions offer better range, mobility and centralized management.\",\n \"FIG.\",\n \"1 shows a distributed control system 100 where a sensor 102 and an actuator 104 are connected to a control node 106 over a network 108 for performing control of a process 110 .\",\n \"The performance of the system 100 is highly dependent on information about communication delays 112 , 114 .\",\n \"If the network 108 is wireless the system 100 must also handle the case when connectivity is lost.\",\n \"FIG.\",\n \"2 shows a hierarchical control system 200 with a local controller 202 and a supervisory controller 204 .\",\n \"This setup is common in for example robotics and the process industry.\",\n \"The local controller 202 may be a standard PID (Proportional Integral Derivative) controller and the supervisory controller 204 provides set point values.\",\n \"In the robotics case the trajectory may be remotely generated and while the control loops for the individual joints execute locally.\",\n \"Another example is coordination of autonomous aerial vehicles, as disclosed by A. Bemporad and C. Rocchi in the article “Decentralized Hybrid Model Predictive Control of a Formation of Unmanned Aerial Vehicles”, where the supervisory controller 204 runs a model predictive controller (MPC) for generating trajectories, mission planning and handle collision avoidance and the actual flight control system (stabilization, etc.)\",\n \"runs locally by the local controller 202 .\",\n \"Control systems may be arranged to operate in different modes and where each mode possibly corresponds to a different control strategy.\",\n \"A number of examples of hybrid control systems are disclosed in the PhD Thesis by Jorgen Malmborg, “Analysis and Design of Hybrid Control Systems”, Lund University.\",\n \"For example the hybrid controller in FIG.\",\n \"3 , which is represented as a Grafcet diagram with four states and two control modes.\",\n \"One mode is using an optimal approach (Opt Controller), e.g.\",\n \"when changing set point, and a PID controller (PID Controller) when the system output is close to the set-point.\",\n \"In the case of the autonomous aerial vehicles, as discussed in in the article “Decentralized Hybrid Model Predictive Control of a Formation of Unmanned Aerial Vehicles” by A. Bemporad and C. Rocchi, a hybrid control strategy may be applied to handle loss of connectivity.\",\n \"From the discussion above, the need of an approach how to handle distributed control in view of connectivity is evident.\"\n ],\n [\n \" SUMMARY The invention is based on the understanding that control via a wireless network may imply delays that are not compatible with the control task.\",\n \"The inventors have found that by adapting control approach based on state of communication over the network, efficient control may be provided also where a supervisory controller is involved in the control via a wireless communication network.\",\n \"According to a first aspect, there is provided a controller arrangement comprising a transceiver capable of communication via a wireless communication network, a controller arranged to control a physical entity at which the controller arrangement is arranged, and an interface between the transceiver and the controller.\",\n \"The transceiver is arranged to provide information via the interface about present or imminent interrupts in the communication via the wireless network.\",\n \"The controller is arranged to operate in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.\",\n \"The wireless communication network may comprise a cellular communication network and the transceiver may provide the information about present or imminent interrupts in the communication based on mobility management information associated with the wireless communication network.\",\n \"The mobility management information associated with the wireless communication network may comprise any of measurement execute instruction, handover execute instruction, measurement completed, handover completed, release connection with redirect instruction, release connection with redirect completed, connection reestablishment instruction, and connection reestablishment completed.\",\n \"The mobility management information associated with the wireless communication network may comprise instructions provided from a node of the wireless communication network.\",\n \"The mobility management information associated with the wireless communication network may comprise indications on a completed task provided from the transceiver.\",\n \"The wireless communication network may comprise a short range communication network and the transceiver may provide the information about present or imminent interrupts in the communication based on connection state information in relation to an access point of the wireless communication network.\",\n \"The connection state information in relation to the access point of the wireless communication network may comprise any of in-synchronization with the access point, out-of-synchronization with the access point, scanning for access points ongoing, reconnection to an access point ongoing, authentication process, and association process.\",\n \"The second state may comprise a first sub-state when the information indicates that interrupts are present or imminent during predetermined periods, wherein the first sub-state includes open loop control from the remote entity via the wireless communication network in conjunction with the autonomous control operations by the controller, and a second sub-state when the information indicates that interrupts are present or imminent during an unknown time, wherein the second sub-state includes the autonomous control operations by the controller without control from the remote entity via the wireless communication network.\",\n \"The first sub-state may be when the information indicates that the transceiver is to be connected to the same node of the wireless communication network after the interrupt as before the interrupt, and the second sub-state may be when the information indicates that the transceiver is to be connected to another node of the wireless communication network after the interrupt than before the interrupt.\",\n \"The first sub-state may be when a duration of the interrupt is known and below a threshold, and the second sub-state may be when the duration of the interrupt is unknown or above the threshold.\",\n \"According to a second aspect, there is provided a method of a controller arrangement comprising a transceiver capable of communication via a wireless communication network and a controller arranged to control a physical entity at which the controller arrangement is arranged.\",\n \"The method comprises providing information by the transceiver to the controller about present or imminent interrupts in the communication via the wireless network, and operating the controller in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.\",\n \"The providing of the information about present or imminent interrupts in the communication may be based on mobility management information associated with the wireless communication network.\",\n \"The mobility management information associated with the wireless communication network may comprise any of measurement execute instruction, handover execute instruction, measurement completed, handover completed, release connection with redirect instruction, release connection with redirect completed, connection reestablishment instruction, and connection reestablishment completed.\",\n \"The mobility management information associated with the wireless communication network may comprise instructions provided from a node of the wireless communication network.\",\n \"The mobility management information associated with the wireless communication network may comprise indications on a completed task provided from the transceiver.\",\n \"The wireless communication network may comprise a short range communication network and providing of the information by the transceiver about present or imminent interrupts in the communication may be based on connection state information in relation to an access point of the wireless communication network.\",\n \"The connection state information in relation to the access point of the wireless communication network may comprise any of in-synchronization with the access point, out-of-synchronization with the access point, scanning for access points ongoing, reconnection to an access point ongoing, authentication process, and association process.\",\n \"The second state may comprises a first sub-state when the information indicates that interrupts are present or imminent during predetermined periods, wherein the operating of the controller in the first sub-state includes open loop control from the remote entity via the wireless communication network in conjunction with the autonomous control operations by the controller, and a second sub-state when the information indicates that interrupts are present or imminent during an unknown time, wherein the operating of the controller in the second sub-state includes the autonomous control operations by the controller without control from the remote entity via the wireless communication network.\",\n \"The first sub-state may be when the information indicates that the transceiver is to be connected to the same node of the wireless communication network after the interrupt as before the interrupt, and the second sub-state may be when the information indicates that the transceiver is to be connected to another node of the wireless communication network after the interrupt than before the interrupt.\",\n \"The first sub-state may be when a duration of the interrupt is known and below a threshold, and the second sub-state may be when the duration of the interrupt is unknown or above the threshold.\",\n \"According to a third aspect, there is provided a computer program comprising instructions which, when executed on a processor of a communication apparatus, causes the communication apparatus to perform the method according to the second aspect.\"\n ],\n [\n \"TECHNICAL FIELD The present invention generally relates to a controller arrangement comprising a transceiver capable of communication via a wireless communication network, a controller arranged to control a physical entity at which the controller arrangement is arranged, and an interface between the transceiver and the controller, method of such a controller arrangement, and a computer program for implementing the method.\",\n \"BACKGROUND A traditional control system can basically be seen as a controller providing a control signal to one or more actuators affecting a physical entity, such as a machine or process, wherein one or more sensors determine actual conditions of the physical entity and provide feedback signals to the controller which compares, using a more or less complex control model, the conditions with desired conditions to provide the control signal with aim to make the actual conditions agree with the desired conditions.\",\n \"Sometimes, it is desirable to provide remote control via a network, e.g.\",\n \"a wireless network.\",\n \"Traditionally, distributed automation systems have been connected using physical wires but with advent of technologies such as WiFi, Bluetooth, ZigBee, WirelessHART etc., wireless control have become commonplace.\",\n \"An important factor for automation systems is latency and with cellular systems of fourth generation coming down to round trip delays at around 20-40 milliseconds cellular technologies are becoming an interesting alternative that in addition to existing solutions offer better range, mobility and centralized management.\",\n \"FIG.\",\n \"1 shows a distributed control system 100 where a sensor 102 and an actuator 104 are connected to a control node 106 over a network 108 for performing control of a process 110.The performance of the system 100 is highly dependent on information about communication delays 112, 114.If the network 108 is wireless the system 100 must also handle the case when connectivity is lost.\",\n \"FIG.\",\n \"2 shows a hierarchical control system 200 with a local controller 202 and a supervisory controller 204.This setup is common in for example robotics and the process industry.\",\n \"The local controller 202 may be a standard PID (Proportional Integral Derivative) controller and the supervisory controller 204 provides set point values.\",\n \"In the robotics case the trajectory may be remotely generated and while the control loops for the individual joints execute locally.\",\n \"Another example is coordination of autonomous aerial vehicles, as disclosed by A. Bemporad and C. Rocchi in the article “Decentralized Hybrid Model Predictive Control of a Formation of Unmanned Aerial Vehicles”, where the supervisory controller 204 runs a model predictive controller (MPC) for generating trajectories, mission planning and handle collision avoidance and the actual flight control system (stabilization, etc.)\",\n \"runs locally by the local controller 202.Control systems may be arranged to operate in different modes and where each mode possibly corresponds to a different control strategy.\",\n \"A number of examples of hybrid control systems are disclosed in the PhD Thesis by Jorgen Malmborg, “Analysis and Design of Hybrid Control Systems”, Lund University.\",\n \"For example the hybrid controller in FIG.\",\n \"3, which is represented as a Grafcet diagram with four states and two control modes.\",\n \"One mode is using an optimal approach (Opt Controller), e.g.\",\n \"when changing set point, and a PID controller (PID Controller) when the system output is close to the set-point.\",\n \"In the case of the autonomous aerial vehicles, as discussed in in the article “Decentralized Hybrid Model Predictive Control of a Formation of Unmanned Aerial Vehicles” by A. Bemporad and C. Rocchi, a hybrid control strategy may be applied to handle loss of connectivity.\",\n \"From the discussion above, the need of an approach how to handle distributed control in view of connectivity is evident.\",\n \"SUMMARY The invention is based on the understanding that control via a wireless network may imply delays that are not compatible with the control task.\",\n \"The inventors have found that by adapting control approach based on state of communication over the network, efficient control may be provided also where a supervisory controller is involved in the control via a wireless communication network.\",\n \"According to a first aspect, there is provided a controller arrangement comprising a transceiver capable of communication via a wireless communication network, a controller arranged to control a physical entity at which the controller arrangement is arranged, and an interface between the transceiver and the controller.\",\n \"The transceiver is arranged to provide information via the interface about present or imminent interrupts in the communication via the wireless network.\",\n \"The controller is arranged to operate in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.\",\n \"The wireless communication network may comprise a cellular communication network and the transceiver may provide the information about present or imminent interrupts in the communication based on mobility management information associated with the wireless communication network.\",\n \"The mobility management information associated with the wireless communication network may comprise any of measurement execute instruction, handover execute instruction, measurement completed, handover completed, release connection with redirect instruction, release connection with redirect completed, connection reestablishment instruction, and connection reestablishment completed.\",\n \"The mobility management information associated with the wireless communication network may comprise instructions provided from a node of the wireless communication network.\",\n \"The mobility management information associated with the wireless communication network may comprise indications on a completed task provided from the transceiver.\",\n \"The wireless communication network may comprise a short range communication network and the transceiver may provide the information about present or imminent interrupts in the communication based on connection state information in relation to an access point of the wireless communication network.\",\n \"The connection state information in relation to the access point of the wireless communication network may comprise any of in-synchronization with the access point, out-of-synchronization with the access point, scanning for access points ongoing, reconnection to an access point ongoing, authentication process, and association process.\",\n \"The second state may comprise a first sub-state when the information indicates that interrupts are present or imminent during predetermined periods, wherein the first sub-state includes open loop control from the remote entity via the wireless communication network in conjunction with the autonomous control operations by the controller, and a second sub-state when the information indicates that interrupts are present or imminent during an unknown time, wherein the second sub-state includes the autonomous control operations by the controller without control from the remote entity via the wireless communication network.\",\n \"The first sub-state may be when the information indicates that the transceiver is to be connected to the same node of the wireless communication network after the interrupt as before the interrupt, and the second sub-state may be when the information indicates that the transceiver is to be connected to another node of the wireless communication network after the interrupt than before the interrupt.\",\n \"The first sub-state may be when a duration of the interrupt is known and below a threshold, and the second sub-state may be when the duration of the interrupt is unknown or above the threshold.\",\n \"According to a second aspect, there is provided a method of a controller arrangement comprising a transceiver capable of communication via a wireless communication network and a controller arranged to control a physical entity at which the controller arrangement is arranged.\",\n \"The method comprises providing information by the transceiver to the controller about present or imminent interrupts in the communication via the wireless network, and operating the controller in at least a first state when the information indicates that no interrupts are present or imminent, wherein the first state includes closed loop control from a remote entity via the wireless communication network, and a second state when the information indicates that interrupts are present or imminent, wherein the second state includes autonomous control operations by the controller.\",\n \"The providing of the information about present or imminent interrupts in the communication may be based on mobility management information associated with the wireless communication network.\",\n \"The mobility management information associated with the wireless communication network may comprise any of measurement execute instruction, handover execute instruction, measurement completed, handover completed, release connection with redirect instruction, release connection with redirect completed, connection reestablishment instruction, and connection reestablishment completed.\",\n \"The mobility management information associated with the wireless communication network may comprise instructions provided from a node of the wireless communication network.\",\n \"The mobility management information associated with the wireless communication network may comprise indications on a completed task provided from the transceiver.\",\n \"The wireless communication network may comprise a short range communication network and providing of the information by the transceiver about present or imminent interrupts in the communication may be based on connection state information in relation to an access point of the wireless communication network.\",\n \"The connection state information in relation to the access point of the wireless communication network may comprise any of in-synchronization with the access point, out-of-synchronization with the access point, scanning for access points ongoing, reconnection to an access point ongoing, authentication process, and association process.\",\n \"The second state may comprises a first sub-state when the information indicates that interrupts are present or imminent during predetermined periods, wherein the operating of the controller in the first sub-state includes open loop control from the remote entity via the wireless communication network in conjunction with the autonomous control operations by the controller, and a second sub-state when the information indicates that interrupts are present or imminent during an unknown time, wherein the operating of the controller in the second sub-state includes the autonomous control operations by the controller without control from the remote entity via the wireless communication network.\",\n \"The first sub-state may be when the information indicates that the transceiver is to be connected to the same node of the wireless communication network after the interrupt as before the interrupt, and the second sub-state may be when the information indicates that the transceiver is to be connected to another node of the wireless communication network after the interrupt than before the interrupt.\",\n \"The first sub-state may be when a duration of the interrupt is known and below a threshold, and the second sub-state may be when the duration of the interrupt is unknown or above the threshold.\",\n \"According to a third aspect, there is provided a computer program comprising instructions which, when executed on a processor of a communication apparatus, causes the communication apparatus to perform the method according to the second aspect.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The above, as well as additional objects, features and advantages of the present invention, will be better understood through the following illustrative and non-limiting detailed description of preferred embodiments of the present invention, with reference to the appended drawings.\",\n \"FIG.\",\n \"1 schematically illustrates a distributed control system.\",\n \"FIG.\",\n \"2 shows a hierarchical control system.\",\n \"FIG.\",\n \"3 is a Grafcet diagram illustrating a hybrid controller.\",\n \"FIG.\",\n \"4 schematically illustrates a controller arrangement according to an embodiment and a supervisory controller acting via a wireless network.\",\n \"FIG.\",\n \"5 schematically illustrates a controller arrangement in a situation where no interrupts are present or imminent.\",\n \"FIG.\",\n \"6 schematically illustrates a controller arrangement in a situation where interrupts are present or imminent.\",\n \"FIG.\",\n \"7 schematically illustrates a controller arrangement in a situation where interrupts are present or imminent.\",\n \"FIG.\",\n \"8 is a state diagram illustrating three states.\",\n \"FIG.\",\n \"9 shows some principle communication modes related to mobility and handover (HO), with timings related to LTE.\",\n \"FIG.\",\n \"10 shows a mobile controller unit which handles sensing and actuation and is connected to a supervisory control system in the cloud.\",\n \"FIG.\",\n \"11 shows a state machine describing the states of the communication channel.\",\n \"FIG.\",\n \"12 illustrates an example of a HO process.\",\n \"FIGS.\",\n \"13 to 16 illustrate interrupts in a mobility scenario according to embodiments.\",\n \"FIG.\",\n \"17 is a flow chart schematically illustrating a method according to embodiments.\",\n \"FIG.\",\n \"18 is a flow chart illustrating an example of a method.\",\n \"FIG.\",\n \"19 is a flow chart illustrating an example of a method for a short range wireless network context.\",\n \"FIG.\",\n \"20 is a flow chart illustrating an example of a method for a cellular wireless network context.\",\n \"FIG.\",\n \"21 schematically illustrates a computer-readable medium comprising a computer program with instructions, which when executed on the illustrated processing means causes the processing means to perform methods of embodiments.\",\n \"DETAILED DESCRIPTION FIG.\",\n \"4 schematically illustrates a controller arrangement 400 according to an embodiment and a supervisory controller 450 acting via a wireless communication network 440.The controller arrangement 400 comprises a transceiver 402, a local controller 404 and an interface 406 between the transceiver 402 and the local controller 404.The transceiver 402 is capable of communication via the wireless communication network 440, as indicated by antenna 408 of the transceiver 402 and antenna 442 of the wireless communication network 440.The local controller 404 is arranged to control a physical entity 410, e.g.\",\n \"a machine and/or a process.\",\n \"For this, the controller arrangement 400 is arranged in vicinity of the physical entity 410, such that a control signal 412 is provided to one or more actuators 414 which act on the physical entity 410.One or more sensors 416 monitor actual states, values, etc.\",\n \"of the physical entity 410 and provide sensor signal(s) 418 to the controller arrangement 400.The supervisory controller 450 is arranged to provide control information and control signals to the controller arrangement 400 via the wireless communication network 440 such that the control signal 412 may emanate from the supervisory controller 450, at least partially as for example discussed in the introductory portion of this disclosure.\",\n \"In FIG.\",\n \"4 it is illustrated that all control signals 412 are provided by or through the local controller 404, but control signals 412 emanating from the supervisory controller 450 may also be provided to the actuator(s) 414 without involving the local controller 404.In such cases, some of the control signals 412 may for example be provided directly from the interface 406 to the actuator(s) 414.Similar, the supervisory controller 450 is arranged to receive information about sensor values and/or states, and optionally also states of the local controller 404, via the wireless communication network 440.The transceiver 402 is arranged to provide information via the interface 406 about present or imminent interrupts in the communication via the wireless communication network 440.For example, when the wireless communication network comprises a cellular communication network, the transceiver may provide the information about present or imminent interrupts in the communication based on mobility management information associated with the wireless communication network.\",\n \"The mobility management information may for example comprises any of measurement execute instruction, handover execute instruction, measurement completed, handover completed, etc.\",\n \"Examples will be further discussed with reference to e.g.\",\n \"FIGS.\",\n \"8 to 12.The local controller 404 is arranged to operate in at least a first state when the information indicates that no interrupts are present or imminent.\",\n \"The first state includes closed loop control from the supervisory controller 450 via the wireless communication network 440.The local controller 404 is arranged to operate in a second state when the information indicates that interrupts are present or imminent.\",\n \"The second state includes autonomous control operations by the local controller 404.The second state may comprise different sub-states depending on the nature of the present or imminent interrupts in communication.\",\n \"For example, a first sub-state may be when the information indicates that interrupts are present or imminent during predetermined periods, wherein open loop control from the supervisory controller 450 may be performed via the wireless communication network 440 in conjunction with the autonomous control operations by the local controller 404 when in the first sub-state, and a second sub-state may be when the information indicates that interrupts are present or imminent during an unknown time, wherein autonomous control operations may be performed by the local controller 404, i.e.\",\n \"without control from the supervisory control, when in the second sub-state.\",\n \"Further sub-states may be applied, e.g.\",\n \"based on known or estimated durations of interrupts wherein the autonomous control approach depends on the known or estimated duration.\",\n \"Estimated duration may in this case be based on historical data, e.g.\",\n \"for the actual location of the controller arrangement 400, and thus the transceiver 402.Here, the states or sub-states including autonomous control discussed above may include that one or some of the one or more actuators 414 are disabled and/or put in some fail-safe position or state.\",\n \"This may provide for robust control also without the closed-loop supervisory control although some control features may be omitted.\",\n \"The design of this may depend on the nature of the physical entity 410.Considering the example above, the first sub-state may be applied when the information indicates that the transceiver is to be connected to the same node of the wireless communication network after the interrupt as before the interrupt, e.g.\",\n \"for a cellular communication system 440, and the second sub-state is when the information indicates that the transceiver is to be connected to another node of the wireless communication network after the interrupt than before the interrupt, e.g.\",\n \"for a handover situation in the cellular communication system 440.Another consideration of the example above may be that the first sub-state is applied when a duration of the interrupt is known and below a threshold, and the second sub-state is applied when the duration of the interrupt is unknown or above the threshold.\",\n \"For the application of the approach demonstrated above, there is a need for information exchange between the communication handling parts, i.e.\",\n \"associated with the transceiver 402, and the control handling parts, i.e.\",\n \"the local controller 404.This is handled by the interface 406.The interface 406 may be a physical entity, but may as well be a functional or logical entity implemented in the transceiver 402 and/or the local controller 404.However, for the understanding of the function of the interface 406, it will be explained as a physical entity, but from that understanding, an implementation in the transceiver 402 and/or the local controller 404 should be readily understood by an artisan.\",\n \"The interface 406 receives a control data signal 420 from the transceiver 402.The control data is payload information demodulated and extracted by the transceiver from transmissions from the supervisory controller 450 via the wireless communication network 440.The control data is routed to the local controller and/or directly to the actuator(s) 414 as a control signal 422.The interface 406 also receives information from the control handling parts, including the sensor(s), about values and/or states of the physical entity 410 and/or the local control thereof.\",\n \"This information may include the sensor signals 418 and an information signal 424 provided by the local controller 404.Data required or desired by the supervisory controller 450 is extracted and possibly packaged and transmitted as a data signal 426 to the transceiver 402 for transmission to the supervisory controller 450 via the wireless communication network 440.The interface 406 also receives a communication state signal 428 from the transceiver 402, which includes information about any present or imminent communication interrupts.\",\n \"This information may be directly derived from control signalling information available in the transceiver or may already be processed to agree with the states/sub-states discussed above.\",\n \"The interface 406 may process the received information to provide a control approach signal 430 to the local controller 404.The control approach signal 430 may be in any form usable for the local controller 404 to determine its preferred way of operating.\",\n \"That is, the information may be raw data about the communication state such that the local controller 404 itself determines the way of operating, status information, e.g.\",\n \"indicating one of the states or sub-states as discussed above, or direct control signals for controlling e.g.\",\n \"multiplexers etc.\",\n \"of the local controller 404.FIG.\",\n \"5 schematically illustrates the controller arrangement 400 in a situation where no interrupts are present or imminent.\",\n \"Here, only the control elements are shown since only one communication state is discussed.\",\n \"Furthermore, the communication parts are only illustrated by the divided connection lines to the supervisory controller 450.This state includes closed loop control from the supervisory controller 450, wherein a control signal 452 is provided to the local controller 404, and/or directly to the actuator(s) 414, such that the actuator(s) 414 receives the control signal 412.The actuator(s) 414 affects, based thereon, the physical entity 410, which in turn is monitored by the sensor(s) 416.The sensor(s) provide a sensor signal 418 that is provided to the supervisory controller 450.That is, a closed loop control from the supervisory controller 450 is provided.\",\n \"As discussed in the introductory part of this disclosure, some parts of the physical entity may still be desired to be handled by the local controller 404 although a closed loop control is provided from the supervisory controller 450, and the sensor signal 418 is thus also provided to the local controller 404.FIG.\",\n \"6 schematically illustrates the controller arrangement 400 in a situation where interrupts are present or imminent.\",\n \"This situation may be seen as the second sub-state of the second state in the example discussed above, i.e.\",\n \"the interrupt is of such character that the local controller 404 will perform autonomous control.\",\n \"Thus, the control loop only includes the local controller 404 providing the control signal 412 to the actuator(s) 414 which based thereon affects the physical entity 410.The sensor(s) 416 monitor the physical entity and provide the sensor signal 418 to the local controller 404.FIG.\",\n \"7 schematically illustrates the controller arrangement 400 in a situation where interrupts are present or imminent.\",\n \"This situation may be seen as the first sub-state of the second state in the example discussed above, i.e.\",\n \"the interrupt is of such character that the local controller 404 will perform some kind of hybrid control, i.e.\",\n \"autonomous control by the local controller 404 and open loop control from the supervisory controller 450.Thus, the provision of information to and from the supervisory controller 450 is illustrated as dashed lines indicating that time-critical control is disabled and only the open loop control is applicable.\",\n \"An example for the context of a cellular communication network will now be given with reference to FIGS.\",\n \"8 to 12 in which a limited number of states and sub-states are demonstrated to align with the functional description of the operation with reference to FIGS.\",\n \"5 to 7.It should be noted that further states and sub-states are feasible and should be adapted to the particular features and needs of the communication system and the control system.\",\n \"FIG.\",\n \"8 is a state diagram illustrating three states: Normal, Limited and Off-line.\",\n \"Here, the state Normal may be representing the first state discussed in the example above and the function may correspond to that demonstrated with reference to FIG.\",\n \"5.The state Off-line may be representing the second state, first sub-state, discussed in the example above and the function may correspond to that demonstrated with reference to FIG.\",\n \"6.The state Limited may be representing the second state, second sub-state, discussed in the example above and the function may correspond to that demonstrated with reference to FIG.\",\n \"7.One central feature of cellular systems is seamless mobility, i.e.\",\n \"the possibility for the transceiver to move between serving base stations (Node Bs, eNode Bs, etc.\",\n \"depending on used Radio Access Technology (RAT), hereafter referred to as network (NW) nodes which thus refers to nodes of the access network) “without” interrupt of the ongoing service.\",\n \"Without interrupt should be interpreted as that the application is not interrupted, since on the physical layer it will be a necessary interrupt in the communication between the device and the NW node.\",\n \"FIG.\",\n \"9 shows some principle communication modes related to mobility and handover (HO), with timings related to LTE.\",\n \"Other systems, such as WCDMA and GSM, have similar principles, but may use other timings.\",\n \"In the Normal mode, the transceiver is connected to the NW node and the uplink (UL) and downlink (DL) communication are made without any interrupt.\",\n \"Typically a low cost transceiver is not able to communicate on two different carrier frequencies simultaneously.\",\n \"Therefore, in case inter-frequency (IF) or inter-RAT (IRAT) HO is needed, due to the transceiver going out of coverage of serving cell and no strong intra frequency cells exists, the transceiver triggers IF/IRAT measurement.\",\n \"Then the NW node configures measurement gaps, which may be 6 ms every 40 or 80 ms in LTE, where the transceiver can switch frequency and do IF/IRAT measurements.\",\n \"During these 6 ms there is no possibility for UL or DL communication with the NW node, and hence the communication with the NW node is Limited.\",\n \"Finally when a HO have been triggered by the modem, i.e.\",\n \"a neighbouring cell either intra- or inter-frequency or IRAT has become sufficiently strong compared to the current serving cell, the transceiver reports that to the NW node, i.e.\",\n \"as a “HO event”, and the NW node transmits a HO execute Radio Resource Control (RRC) message, which means “do HO to a target cell”, to the transceiver, and the transceiver starts to synchronize to the target cell.\",\n \"During the HO operation, for the supervisory control application demonstrated above, the transceiver is considered to be Off-line since the duration for a HO operation may be long in sense of control operations.\",\n \"Once being in-synchronization, the transceiver then makes a random access transmission to the NW node and the connection to the new cell is initiated.\",\n \"Once a HO message complete message is transmitted from the transceiver to the NW node, the UL/DL data communication can start again, i.e.\",\n \"return to Normal.\",\n \"Hence, during this synchronization and initialization period, that may last, normally an in advance unknown time, between 10-1000 ms depending on HO type, i.e.\",\n \"IRAT takes longer than LTE intra frequency HO, the transceiver is Off-line with regard to the NW node, and so particularly in sense of the controller application, and no data communication in UL and DL is possible.\",\n \"Sometimes a regular HO process is substituted with a procedure where connection is released with a redirection instruction, and then a connection reestablishment, depending on network settings, wherein the procedure and thus the interrupt may take even longer time.\",\n \"Here, it is to be noted that not every measurement leads to a HO event, and the measurement operation may be considered complete and the state may return to Normal.\",\n \"Further, it is to be noted that a HO event also can occur without the measurement procedure demonstrated above, wherein a transition may be directly from Normal to Off-line.\",\n \"Thus, the transitions between the states, which are also referenced to in some examples below, can for the cellular example be defined as Handover-Execute (HE)—Emitted when the transceiver is ordered to perform a hand-over.\",\n \"After this event the mobile unit is not connected to the network until HC (see below) occurs.\",\n \"Handover-Complete (HC)—Emitted when the hand-over is complete and the transceiver is yet again connected to the network.\",\n \"Measure-Execute (ME)—Emitted when the transceiver is ordered to perform a link quality measurement on another Radio Access Technology (RAT) or other carrier frequency.\",\n \"After this event the connectivity is degraded until e.g.\",\n \"MC (see below) occurs.\",\n \"Measure-Complete (MC)—Emitted when the measurement gaps are complete and the link quality is restored.\",\n \"All events may contain additional data, including current bandwidth etc.\",\n \"One possible setup presented in FIG.\",\n \"10, which shows a mobile controller unit, which handles sensing and actuation and is connected to a supervisory control system in the cloud.\",\n \"On the mobile node there a local controller application (“App Unit”) that receives events from the Wireless Connectivity Unit (WCU), which in this case corresponds to a cellular modem.\",\n \"FIG.\",\n \"10 shows an example employing the approach demonstrated above.\",\n \"A mobile controller unit 1000, which handles sensing and actuation and is connected to a supervisory controller 1010, e.g.\",\n \"implemented in the cloud.\",\n \"On the mobile controller unit 1000 there is a local controller application (“App Unit”) 1002, illustrated by a state diagram similar to that shown in FIG.\",\n \"8, which receives events from a Wireless Connectivity Unit (WCU) 1004, which in this case corresponds to a cellular modem, i.e.\",\n \"a transceiver as demonstrated above, which also connects to the supervisory controller 1010 via a wireless network 1006.For the easier understanding of this disclosure, FIG.\",\n \"12 illustrates an example of a HO process.\",\n \"The corresponding states HE, HC, ME, MC can be mapped to received or transmitted Radio Resource Control/Management (RRC/RRM) messages in the mobile.\",\n \"For example HE corresponds to RRC Connection configuration, including HO information and is received in the WCU 1004 after transmission of measurement report including HO event from the WCU and HC corresponds to RRC Connection Reconfiguration Complete.\",\n \"Furthermore, ME corresponds to RRC Connection configuration, including measurement gap information and received in the device after transmission of measurement report including event for triggering IRAT/IF measurement from the WCU 1004, and MC corresponds to RRC Connection Reconfiguration Complete.\",\n \"Once such message is transmitted (or received) by the mobility management unit in the WCU 1004, that information is fed from the WCU 1004 to the application unit using the new interface and protocol.\",\n \"FIG.\",\n \"11 shows a state machine describing the states of the communication channel.\",\n \"“RRM HO event Transmitted from Device” corresponds to Measurement Reports, prior to HO decision in FIG.\",\n \"12 and “HO execution” and “HO complete” to RRC Connection configuration and RRC Connection Reconfiguration Complete message, respectively, in FIG.\",\n \"12.Corresponding mapping between the state transitions in FIG.\",\n \"11 and RRC messages for the measurement gaps can also be found in the 3GPP specifications.\",\n \"FIG.\",\n \"11 may also be seen as a more detailed example, and in the context of 3GPP LTE, of what is illustrated in FIG.\",\n \"8.Consider a transceiver, e.g.\",\n \"the WCU 1004 as illustrated in FIG.\",\n \"10, operating in a first state 1100 where UL/DL connection is without any interrupt.\",\n \"Upon an RRM IF measurement event transmitted from the transceiver to the NW node, e.g.\",\n \"triggered by a signal-to-noise ratio (SNR) being below a threshold, the transceiver enters a second state 1102 where the transceiver knows that interrupts in the connection is imminent and can provide that information to the control mechanism as discussed above.\",\n \"Upon receiving RRM IF measurement execution information from the NW node, the transceiver enters a third state 1104 where inter-frequency measurements take place periodically, e.g.\",\n \"6-10 ms each 40 or 80 ms, wherein connection is limited due to the inability to communicate during the measurements.\",\n \"If the signal from the serving NW node becomes strong again, e.g.\",\n \"the SNR becomes above the threshold, the transceiver may return to the first state 1100 and the control mechanism is informed accordingly.\",\n \"If the transceiver found a more promising NW node by the measurements, it may send an RRM IF HO event to the NW node and the transceiver enters a fourth state 1106 where inter-frequency HO is triggered and the control mechanism is informed that a longer interrupt is imminent.\",\n \"When the transceiver receives RRM IF HO execution information from the NW node, the transceiver enters a fifth state 1108 wherein the transceiver synchronizes etc.\",\n \"with the target NW node.\",\n \"This may take a longer time, say a couple of 100's of ms, and the time is hard to predict.\",\n \"When connected to the target NW node, HO is completed and the transceiver returns to the first state 1100 and the control mechanism is informed accordingly.\",\n \"Consider the transceiver operating in the first state 1100 and an RRM HO event is transmitted from the transceiver to the NW node directly, i.e.\",\n \"without the measurements demonstrated above, the transceiver enters a sixth state 1110 where an intra-frequency HO event is triggered.\",\n \"The control mechanism is informed that a longer interrupt is imminent.\",\n \"When the transceiver receives RRM HO execution information from the NW node, the transceiver enters a seventh state 1112 where intra-frequency HO is performed wherein the transceiver synchronizes etc.\",\n \"with the target NW node.\",\n \"This may take a longer time, say a couple of 100's of ms, and the time is hard to predict.\",\n \"When connected to the target NW node, HO is completed and the transceiver returns to the first state 1100 and the control mechanism is informed accordingly.\",\n \"FIGS.\",\n \"13 to 16 illustrate interrupts in a mobility scenario according to embodiments.\",\n \"FIGS.\",\n \"13 to 16 have been drawn to have resemblance with FIG.\",\n \"10 of elements for the easier understanding impact of the mobility scenario to control states.\",\n \"The mobility scenario may include different handover situations in a cellular wireless communication network, including also inter-RAT handover between cellular RATs.\",\n \"As mentioned above, a regular HO process may be substituted with a procedure where connection is released with a redirection, and then a connection reestablishment, depending on network settings, wherein the procedure and thus the interrupt may take even longer time.\",\n \"The mobility scenario may also include short range communication network where connection is moved between access points of the wireless communication network.\",\n \"The mobility scenario may also include that connection is moved between a cellular communication network node and a network node, e.g.\",\n \"an access point, of a short range communication network, and vice versa.\",\n \"FIG.\",\n \"13 illustrates that connection without interrupts is ongoing.\",\n \"For a local control system, illustrated by a state diagram similar to that illustrated with reference to FIGS.\",\n \"8 and 10, this operates in a first state employing closed loop control from a supervisory controller.\",\n \"The current state is indicated by a dot in the state diagram.\",\n \"FIG.\",\n \"14 then illustrates that the controller arrangement and thus the transceiver has moved in relation to nodes of the communication network, and the transceiver has started to make measurements on neighbouring network nodes.\",\n \"A measurement execute, ME, instruction causes the state to change to a limited connection state, as indicated by the dot in the state diagram, and the local controller starts to perform control more autonomous, e.g.\",\n \"with aid of open loop control from the supervisory controller.\",\n \"FIG.\",\n \"15 illustrates that a handover execute, HE, instruction is received and the state is changed to an off-line state, as indicated by the dot, since no communication is available for some time, e.g.\",\n \"10-1000 ms.\",\n \"The time is normally hard to estimate, and also the open loop control from the supervisory controller cannot be relied on.\",\n \"Thus, the local controller is left to perform autonomous control.\",\n \"FIG.\",\n \"16 illustrates that the transceiver has synchronized to the target network node and a handover complete, HC, may be issued.\",\n \"The state thus returns to normal state wherein control again may be performed as closed loop control from the supervisory controller via the target network node.\",\n \"The scenario illustrated with reference to FIGS.\",\n \"13 to 16 has been described in the context of a cellular network by the reference to the handover procedure, but similar may apply for a short range wireless communication network where the transceiver makes transitions between different access points when moving.\",\n \"In some short range wireless communication systems, mobility does not rely on signalling for handover, and the states may for example be defined for synchronization states of the transceiver to the different access points, whether authentication and/or association is to be performed, measurements performed on other access points, estimated back-off times, etc.\",\n \"or a combination of any of these.\",\n \"The transitions between states for the controller is however similar where communication for some periods may by limited or be considered as off-line for the time constraints of control operations.\",\n \"It is to be noted that a wireless connectivity unit of a controller arrangement as demonstrated above may be arranged both for operation in cellular and short range communication networks where communication is selected where desired backhaul properties are provided.\",\n \"Thus, a combination of the features above may be provided such that the controller arrangement is enabled to operate via the desired network.\",\n \"Thus, for a transition between the network types, an interrupt is also caused, which is most likely to be such that the second sub-state of the second state is entered during that interrupt.\",\n \"An exception is where the wireless transceiver unit is capable of keeping connection running with both the network types at the same time and the transition of the backhaul can be switched swiftly.\",\n \"FIG.\",\n \"17 is a flow chart schematically illustrating a method according to embodiments for a controller arrangement as described by the variants above.\",\n \"Information about present or imminent interrupts in communication is provided 1700 by a wireless connectivity unit, i.e.\",\n \"a transceiver of the controller arrangement.\",\n \"This information may for example be based, as demonstrated above, on signalling, estimates, etc.\",\n \"by the wireless connectivity unit.\",\n \"The controller is then operated 1702 in a state corresponding to the information.\",\n \"In addition to the already demonstrated variants of the approach, some examples will be given with reference to FIGS.\",\n \"18 and 19.The skilled reader will however understand from the disclosure above that observed parameters of the communication may be substituted with others indicating nature of interrupts, and that only two states (without the sub-states) for operating the controller are also a feasible implementation, as well as that an implementation with more states and/or sub-states for operating the controller is feasible for a situation where the nature of the interrupts is defined with greater granularity.\",\n \"FIG.\",\n \"18 is a flow chart illustrating an example of a method for the example of two states wherein the second state comprises two sub-states as also exemplified above, i.e.\",\n \"the controller may be operated for the different states similar to what has been described above.\",\n \"Information about any interrupts is gained 1800.Based on the information, it is determined 1802 whether any interrupt is present or imminent.\",\n \"If no interrupt is present or imminent, the controller is operated 1804 in the first state, i.e.\",\n \"including closed loop control from the supervisory controller.\",\n \"If interrupt is present or imminent, it is determined 1806 whether duration of interrupt(s) is unknown or above a threshold, i.e.\",\n \"uncertain or impossible for the supervisory controller to perform control, the controller is operated 1808 in the second state, and in the second sub-state of the second state, i.e.\",\n \"the local controller will have to act autonomously during the interrupt.\",\n \"If the duration is below the threshold (implicating that the duration is known or reliably estimated), it is determined 1810 whether (or that, since there might not be any cases where this determination emanates in a “NO”, depending on the implementation) limited interrupts are present wherein the controller is operated 1812 in the first sub-state of the second state, i.e.\",\n \"the supervisory controller may perform an open loop control and the local controller may perform some control tasks autonomously.\",\n \"Whichever state the controller is operated in, a change in the communication situation is monitored 1814, and upon a change in the communication situation, the process returns to gaining 1800 the information thereabout and determine proper operation of the controller.\",\n \"FIG.\",\n \"19 is a flow chart illustrating an example of a method similar to the one demonstrated with reference to FIG.\",\n \"18, but here more specifically in an example of a short range wireless network context.\",\n \"Information about communication status is gained 1900 with the aim to detect or forecast any interrupts in the communication.\",\n \"Based on the information, it is determined 1902 whether communication with an access point is reliable, i.e.\",\n \"whether any interrupt is present or imminent.\",\n \"If no interrupt is present or imminent, the controller is operated 1904 in the first state, i.e.\",\n \"including closed loop control from the supervisory controller.\",\n \"If interrupt is present or imminent, it is for example determined 1906 whether an authentication and/or association procedure is to be made, wherein duration of the interrupt is unknown or inherently above the threshold, i.e.\",\n \"uncertain or impossible for the supervisory controller to perform control.\",\n \"The controller is then operated 1908 in the second state, and in the second sub-state of the second state, i.e.\",\n \"the local controller will have to act autonomously during the interrupt.\",\n \"If no such time consuming activity or hard-to-predict duration is present or imminent, it is determined 1910 whether for example an estimate of back-off time is above the threshold.\",\n \"If the estimated time is above the threshold, the controller is operated 1908 in the second state, and in the second sub-state of the second state.\",\n \"If the estimated time is below the threshold, the controller is operated 1912 in the first sub-state of the second state, i.e.\",\n \"the supervisory controller may perform an open loop control and the local controller may perform some control tasks autonomously.\",\n \"Whichever state the controller is operated in, a change in the communication situation is monitored 1914, and upon a change in the communication situation, the process returns to gaining 1900 the information thereabout and determine proper operation of the controller.\",\n \"FIG.\",\n \"20 is a flow chart illustrating an example of a method similar to the one demonstrated with reference to FIG.\",\n \"18, but here more specifically in an example of a cellular wireless network context.\",\n \"Information about communication status, i.e.\",\n \"measurement and handover process, is gained 2000 with the aim to detect or forecast any interrupts in the communication.\",\n \"Based on the information, it is determined 2002 whether a handover execute (HE) or measurement execute (ME) is issued, i.e.\",\n \"whether any interrupt is present or imminent.\",\n \"If no interrupt is present or imminent, i.e.\",\n \"no HE or ME issued, the controller is operated 2004 in the first state, i.e.\",\n \"including closed loop control from the supervisory controller.\",\n \"If HE or ME is issued, an interrupt is present or imminent, it is determined 2006 whether HE is issued, wherein duration of the interrupt is unknown or inherently above the threshold, i.e.\",\n \"uncertain or impossible for the supervisory controller to perform control.\",\n \"The controller is then operated 2008 in the second state, and in the second sub-state of the second state, i.e.\",\n \"the local controller will have to act autonomously during the interrupt.\",\n \"If no such time consuming activity or hard-to-predict duration is present or imminent, it is determined 2010 whether ME is issued.\",\n \"If ME is issued, the controller is operated 1912 in the first sub-state of the second state, i.e.\",\n \"the supervisory controller may perform an open loop control and the local controller may perform some control tasks autonomously.\",\n \"Here, the “NO” option of the determination 2010 logically seems like an empty amount in light of the determinations 2002 and 2006.However, for some implementations, the determination 2002 may for some implementations include further events, which also may implicate further checks (not shown) resulting in further selectable operation states for the controller.\",\n \"Thus, the “NO” option here is to be considered as a symbol for such further optional checks.\",\n \"Whichever state the controller is operated in, a change in the communication situation is monitored 2014, and upon a change in the communication situation, the process returns to gaining 2000 the information thereabout and determine proper operation of the controller.\",\n \"The methods according to the present invention are suitable for implementation with aid of processing means, such as computers and/or processors.\",\n \"Therefore, there is provided computer programs, comprising instructions arranged to cause the processor or computer to perform the steps of any of the methods according to any of the embodiments described above, particularly those with reference to FIG.\",\n \"17 to 20.The computer programs preferably comprises program code which is stored on a computer readable medium 2100, as illustrated in FIG.\",\n \"21, which can be loaded and executed by a processing means, processor, or computer 2102 to cause it to perform the methods, respectively, according to embodiments of the present invention, preferably as any of the embodiments described with reference to FIGS.\",\n \"17 to 20.The computer 2102 and computer program product 2100 can be arranged to execute the program code sequentially where actions of the any of the methods are performed stepwise.\",\n \"The processing means, processor, or computer 2102 is preferably what normally is referred to as an embedded system.\",\n \"Thus, the depicted computer readable medium 2100 and computer 2102 in FIG.\",\n \"21 should be construed to be for illustrative purposes only to provide understanding of the principle, and not to be construed as any direct illustration of the elements.\",\n \"For example, the processing means 2102 may be distributed between the local controller, the interface and the transceiver, or when the interface is implemented in the controller or the transceiver, or distributed thembetween, the processing means 2102 may be distributed between the local controller and the transceiver.\",\n \"For some embodiments, the local controller may house the processing means 2102.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870907"}}},{"rowIdx":4493674,"cells":{"text":{"kind":"list like","value":[["Legacy Card","This invention is directed toward a card that is used by a person wishing to leave a tangible or intangible item to a future recipient and beneficiary(ies).","The user creates a Moment online, which is then sealed in a Moment Capsule by a company owning or licensing this invention.","The user designates a recipient and beneficiary(ies) of the Moment, and sets a triggering date or event for the Moment to be delivered to the beneficiary.","The company creates a physical “Legacy Card” which is mailed to the user and/or the beneficiary or executor, upon which information identifying the Moment is stored.","A human resource element reviews each application for a Legacy Card, then refers out any potentially problematic “gifts”, receives advice from an appropriate professional, then incorporates that advice into the search software to improve the product over time."],["1.A system for distributing content consisting of: a storage medium a scheduled delivery component a software component, a human resource component, and, a legacy card, where the storage medium is a non-transitory computer readable storage medium, where the scheduled delivery component consists of a triggering component, and where the software component consists of both a docketing component and a search component, and additionally comprises a programming logic, where the docketing component consists of a processor executing programming logic for interfacing with a user, the programming logic configured to accept a user identifier, a recipient identifier, a beneficiary(ies) identifier, a content, and a trigger event; generate a unique identifier; and save the user identifier, the recipient identifier, the beneficiary(ies) identifier, the executor identifier, the content, the trigger event, and the unique identifier to the non-transitory computer readable storage medium; where the search component scans an application for a Legacy Card submitted by a prospective client for one or more keywords and phrases that have been programmed into the search component to search for one or more risk factors with the application, and renders a risk assessment, where the human resource element comprises at least one Legacy Card employee who reviews the search component and performs an analysis of the one or more risk factors and the risk assessment, and then renders a judgement on the application, where, based on the judgement rendered by the at least one Legacy Care employee, where a positive review results in the one or more Legacy Care employee approving the application and where a negative review results in the one or more Legacy Card employees taking an additional contact action, where the additional contact action consists of contacting one or more additional professionals who provide one or more items of professional advice to the at least one Legacy Card employee, and where the at least one Legacy Card employee uses the one or more items of professional advice to update the search component, and a legacy card, where the legacy card comprises a recipient identifier, a beneficiary(ies) identifier, an executor identifier, a trigger event, and a unique identifier.","2.The system of claim 1, where the risk assessment contains one or more estate planning issues, the at least one Legacy Card employee contacts at least one Estate Planning Attorney, and where the least one Estate Planning Attorney is notified by the at least one Legacy Card employee, and where the at least one Estate Planning Attorney provides an Estate Planning advice to the at least one Legacy Card employee and to the prospective client, where the Estate Planning advice is used by the at least one Legacy Card employee to make a modification to the search component, such that the search component becomes more effective over time.","3.The system of claim 1, where the risk assessment contains one or more intellectual property issues, then at least one Legacy Card employee contacts at least one Intellectual Property Attorney, and where the least one Intellectual Property Attorney is notified by the at least one Legacy Card employee, and where the at least one Intellectual Property Attorney provides an Intellectual Property advice to the at least one Legacy Card employee and to the prospective client, where the Intellectual Property advice is used by the at least one Legacy Card employee to make a modification to the search component, such that the search component becomes more effective over time.","4.The system of claim 1, where the risk assessment contains one or more securities issues, the at least one Legacy Card employee contacts at least one Securities Attorney, and where the least one Securities Attorney is notified by the at least one Legacy Card employee, and where the at least one Securities Attorney provides a Securities Advice to the at least one Legacy Card employee and to the prospective client, where the Securities Advice is used by the at least one Legacy Card employee to make a modification to the search component, such that the search component becomes more effective over time.","5.A system for distributing content comprising: a storage medium a scheduled delivery component a software component, a human resource component, and, a legacy card, where the storage medium is a non-transitory computer readable storage medium, where the scheduled delivery component consists of a triggering component, and where the software component comprises both a docketing component and a search component, where the docketing component comprises a processor executing programming logic for interfacing with a user, the programming logic configured to accept a user identifier, a recipient identifier, a beneficiary(ies) identifier, content, and a trigger event; generate a unique identifier; and save the user identifier, recipient identifier, beneficiary(ies) identifier, executor identifier, content, trigger event, and unique identifier to the non-transitory computer readable storage medium; where the search component scans an application for a Legacy Card submitted by a prospective client for one or more keywords and phrases that have been programmed into the search component to search for one or more risk factors with the application, and renders a risk assessment, where the human resource element comprises at least one Legacy Card employee who reviews the search component and performs an analysis of the one or more risk factors and the risk assessment, and then renders a judgement on the application, where, based on the judgement rendered by the at least one Legacy Care employee, he/she takes an additional contact action when the judgement is a negative judgement, where the additional contact action comprises contacting one or more additional professionals who provide one or more items of professional advice to the at least one Legacy Card employee, where the one or more items of professional advice provided by the one or more additional professionals is used by the at least one Legacy Card employee to modify the search component, such that the search component is improved over time, and a legacy card, where the legacy card comprises the recipient identifier, the beneficiary(ies) identifier, the executor identifier, the trigger event, and the unique identifier.","6.The system of claim 5, further comprising a words-in-waiting card, where the words in waiting card comprises a content, and where the trigger event is a specific date.","7.The system of claim 6, wherein the programming logic is further configured to provide access to the content after the trigger event and upon receipt of the recipient identifier, the beneficiary(ies) identifier, and the executor identifier.","8.The system of claim 6, wherein the non-transitory computer readable storage medium comprises a database whereby the programming logic is configured to save the user identifier, the recipient identifier, the beneficiary(ies) identifier, the executor identifier, the content, the trigger event, and the unique identifier to the database.","9.The system of claim 8, where the content comprises a content identifier, where the content identifier references one or more items of tangible personal property, where the recipient identifier is a name of a recipient.","10.The system of claim 8, where the recipient identifier comprises a name and a mailing address of a recipient, and where the address of the recipient primary identifier comprises an electronic mail address.","11.The system of claim 10, wherein the programming logic is further configured to accept a recipient update request, where the recipient update request comprises a second recipient identifier and the unique identifier; and saves the second recipient identifier to the non-transitory computer readable storage medium using the unique identifier, and, where a human resource advises/validate update requests based on time passing.","12.The system of claim 12, where the beneficiary(ies) identifier is a name of a beneficiary(ies).","13.The system of claim 12, where the beneficiary(ies) identifier comprises a name and a mailing address of a beneficiary(ies).","14.The system of claim 5, where the address of the beneficiary(ies) primary identifier comprises an electronic mail address and where the programming logic is further configured to accept a beneficiary(ies) update request, where the beneficiary(ies) update request comprises a second beneficiary(ies) identifier and the unique identifier; and save the second beneficiary(ies) identifier to the non-transitory computer readable storage medium using the unique identifier, and, where a human resource advises and validates the update requests.","15.The system of claim 5, wherein the executor identifier is a name of an executor, wherein the executor identifier comprises of a name and mailing address of an executor, wherein the address of the executor is the primary identifier comprises of an electronic mail address, wherein the programming logic is further configured to accept an executor update request, where the executor update request comprises a second executor identifier and the unique identifier; and save the second executor identifier to the non-transitory computer readable storage medium using the unique identifier, and where a human resource advises and validates update requests, wherein the unique identifier of the legacy card is encoded, wherein the encoded unique identifier of the legacy card is formatted as a barcode, identification number or similar identifier 16.The system of claim 5, where the risk assessment contains one or more estate planning issues, the at least one Legacy Card employee contacts at least one Estate Planning Attorney, and where the least one Estate Planning Attorney is notified by the at least one Legacy Card employee, and where the at least one Estate Planning Attorney provides an Estate Planning advice to the at least one Legacy Card employee and to the prospective client, where the Estate Planning advice is used by the at least one Legacy Card employee to make a modification to the search component, such that the search component becomes more effective over time.","17.The system of claim 5, where the risk assessment contains one or more intellectual property issues, then at least one Legacy Card employee contacts at least one Intellectual Property Attorney, and where the least one Intellectual Property Attorney is notified by the at least one Legacy Card employee, and where the at least one Intellectual Property Attorney provides an Intellectual Property advice to the at least one Legacy Card employee and to the prospective client, where the Intellectual Property advice is used by the at least one Legacy Card employee to make a modification to the search component, such that the search component becomes more effective over time.","18.The system of claim 5, where the risk assessment contains one or more securities issues, the at least one Legacy Card employee contacts at least one Securities Attorney, and where the least one Securities Attorney is notified by the at least one Legacy Card employee, and where the at least one Securities Attorney provides a Securities Advice to the at least one Legacy Card employee and to the prospective client, where the Securities Advice is used by the at least one Legacy Card employee to make a modification to the search component, such that the search component becomes more effective over time.","19.A system for distributing content comprising: a storage medium a scheduled delivery component a software component, a human resource component, and, a legacy card, where the search component scans an application for a Legacy Card submitted by a prospective client for one or more keywords and phrases that have been programmed into the search component to search for one or more risk factors with the application, and renders a risk assessment, where the human resource element comprises at least one Legacy Card employee who reviews the search component and performs an analysis of the one or more risk factors and the risk assessment, and then renders a judgement on the application, where, based on the judgement rendered by the at least one Legacy Care employee, he/she takes an additional contact action when the judgement is a negative judgement, where the additional contact action comprises contacting one or more additional professionals who provide one or more items of professional advice to the at least one Legacy Card employee, where the one or more items of professional advice provided by the one or more additional professionals is used by the at least one Legacy Card employee to modify the search component, such that the search component is improved over time, 20.The system of claim 19, where the storage medium is a non-transitory computer readable storage medium, where the scheduled delivery component consists of a triggering component, and where the software component comprises both a docketing component and a search component, where the docketing component comprises a processor executing programming logic for interfacing with a user, the programming logic configured to accept a user identifier, a recipient identifier, a beneficiary(ies) identifier, content, and a trigger event; generate a unique identifier; and save the user identifier, recipient identifier, beneficiary(ies) identifier, executor identifier, content, trigger event, and unique identifier to the non-transitory computer readable storage medium, and, where the legacy card comprises the recipient identifier, the beneficiary(ies) identifier, the executor identifier, the trigger event, and the unique identifier."],[" BACKGROUND OF THE INVENTION "],[" BRIEF SUMMARY OF THE INVENTION A person wanting to create a Legacy Card for a future gift fills out an application, which is reviewed by the Legacy Card's software, which scans it for potential problems, such as terms frequently associated with tax evasion, or items for which “gifting” is often problematic.","For example, if the software finds the term “patent”, it would notify the Legacy Card employee of this issue.","The Legacy Card employee could review the findings and make a risk assessment and then render a judgement on whether there is not a significant problem (positive judgement) or whether there may be a significant enough problem to warrant referring the issue to an outside professional (negative judgement).","In the example of a patent issue, the Legacy Card employee could refer this to an intellectual property attorney, who could then counsel the applicant on making sure any maintenance fees were paid such that the gift of a patent would result in the gift of a valid patent.","When the Legacy Card employee refers out a matter to an outside professional, the Legacy Card employee will take the advice rendered by the outside professional and use that to update the searching software, such that the ability of Legacy Card to ferret out problems at an early stage becomes better and better over time.","FIG.","1 is a general flowchart of the invention according to a preferred form of the invention.","The general goal of the card and the use of the card is to create a personal archive that can become active at a later date to the benefit of another person.","The invention proceeds as follows.","A user of the invention ( 1 , 11 , 22 ) decides to leave some sort of legacy ( 10 , 20 , 31 ) to another person—the “Recipient” ( 4 , 14 , 25 ) or “Beneficiary(ies)” ( 5 , 15 , 26 )—and begins by purchasing a “Moment Capsule” or “Moment” ( 2 , 12 , 23 ) from the company that owns the invention or licenses rights to it “the company”.","The user receives a software prompt asking if there is any at legal risk content being created ( 3 , 13 , 24 ) if yes, user is provided the appropriate contact info or advisement and reminded of terms of use.","If no, user may continue to next step.","The user ( 1 , 11 , 22 ) then, through the company's online platform ( 2 , 12 , 23 ), creates the “moment” ( 3 , 13 , 24 ) and the moment is stored by the company in electronic format ( 8 , 18 , 29 ).","Storing data in electronic format is well known in the industry and this invention includes embodiments using any of the currently available data storage means and methods to create and store these moments.","An algorithm is applied to the user creator content to assess risk and provided with a risk score, in cases where risk-score is mid or high a pathway of Levels is employed where specific subject matters are introduced for further guidance on how to proceed legally ( 3 , 13 , 24 ).","The original designee of the Moment is called the Recipient ( 4 , 14 , 25 ), but the user ( 1 , 11 , 22 ) of the invention can designate additional or alternate beneficiaries ( 5 , 15 , 26 ) as well.","Indeed, the invention also contemplates that the original Recipient ( 4 , 14 , 25 ) can even name additional Recipients ( 4 , 14 , 25 ) and/or Beneficiaries ( 5 , 15 , 26 ).","To simplify the use of the legacy card ( 10 , 20 , 31 ), all those who are in line to receive a Moment ( 6 , 16 , 27 ) will be referred to as Recipients ( 4 , 14 , 25 ) and Beneficiary(ies) ( 5 , 15 , 26 ) The “Moment” can be basically anything, ranging from a letter or other personal communication not limited to images and video to a gift or bequest ( 3 , 13 , 24 ) not withstanding any legal risks.","The moment can be set to be given to the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) at a certain date “To Tom on his 21 st birthday” or to be triggered by a certain event “Should Tom marry and have a child, this moment shall trigger on his first child's first birthday” ( 8 , 18 , 29 ).","The Moment is not only stored online on the company's database ( 6 , 16 , 27 ), but also sent to the recipient ( 4 , 14 , 25 ) and/or beneficiary(ies) ( 5 , 15 , 26 ), or to some person (such as an estate planning attorney) ( 32 ) or entity (such as a bank or trust holder) ( 21 ) that has been designated to oversee gifts and other interactions with recipients ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ).","Depending on the user's desire ( 1 , 11 , 22 ), the user ( 1 , 11 , 22 ) and even recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) may have the option to create ( 3 , 13 , 24 ), review ( 7 , 17 , 28 ), search ( 6 , 16 , 27 ), notify for viewing ( 8 , 18 , 29 ), and store Moment Capsules on the platform ( 6 , 16 , 27 ).","The company owning or using this invention ( 6 , 21 , 32 ) provides an online platform where, after the user purchases the Moment Capsule ( 2 , 12 , 23 ), the user ( 1 , 11 , 22 ) can create the moment in a number of ways ( 3 , 13 , 24 ).","First, the user ( 1 , 11 , 22 ) can choose from a variety of templates, frameworks and designs supplied by the company and type directly onto the template and/or upload pictures, images, video and other documents ( 3 , 13 , 24 ).","Second, the user ( 1 , 11 , 22 ) can personally create the Moment “offline” and then upload the entire moment onto the company's server ( 3 , 13 , 24 ).","Third, the user ( 1 , 11 , 22 ) can cooperate with other people to jointly create a grouping of Moments—either offline to be later loaded onto the company's server, or jointly created on the company's templates ( 3 , 13 , 24 ).","No matter how the Moment is created, the user(s) ( 1 , 11 , 22 ) can select from a variety of fonts, sizes, colors, clip art, upload other content in other formats, and other known elements in word processing, graphic design, and video production software ( 3 , 13 , 24 ).","The company has a variety of means, such as docketing software, to “seal” the Moment into a Moment Capsule, which is then scheduled for release ( 8 , 18 , 29 ) to the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) at some date in the future ( 8 , 18 , 29 ).","As previously mentioned, the future date could be a set date (“Jan.","1, 2025”), such as a certain future date, a birthday, an anniversary, or some other special occasion with a fixed, certain date ( 8 , 18 , 29 ).","The date could also be an open-ended future date contingent upon a certain event (“10 years from the day I die”), or a future date contingency upon an uncertain occurrence or occurrence (“10 years from the day I die or the date that Tom marries and has his first child, whichever occurs first”) ( 8 , 18 , 29 ).","The Moment Capsule could also be scheduled to be delivered upon random events, and could be delivered in staggered stages as well ( 8 , 18 , 29 ).","The role of an estate planner ( FIG.","3 ) comes into play here to avoid the dreaded Rule Against Perpetuities and other estate planning problems.","Users ( 1 , 11 , 22 ) will work with the company to add recipients ( 4 , 14 , 25 ) and beneficiaries ( 5 , 15 , 26 ) for future notification of the Moments ( 8 , 18 , 29 ).","The company will store, for perpetuity, the Moments in Moment Capsules which can be read/re-read/shared ( 6 , 16 , 27 ) by both the recipients ( 4 , 14 , 25 ) and beneficiaries ( 5 , 15 , 26 ), and for their future generations ( 6 , 16 , 27 ).","The Moment Capsules will be stored on a redundant cloud database for perpetuity, with multiple backups in case of failure of one database ( 8 , 18 , 29 ).","Should one of more of the companies storing the Moment Capsules go out of business, the company could contract with an estate planning attorney ( 32 ), bank, ( 21 ) or other trust holder ( 21 ) for that person/organization to step in an either transfer the Moment Capsules to another company, or take over the trust obligations personally.","Turning to the actual legacy card itself ( 10 , 20 , 31 , FIG.","5 ), the invention contemplates a physical card ( 35 , 36 ).","In a preferred embodiment, the card is the approximate size and shape as a credit card or gift card, but other sizes and shapes are contemplated ( FIG.","5 ).","One preferred embodiment calls for the card to be made of plastic, the approximate length, width and height of a credit card, and to have a unique watermark such as a Holokote watermark of the company on it ( 35 , 36 ).","However, it should be stressed that there are no limits to the material make-up of the card and can therefore be made of any physical material as contemplated.","The company then creates a “Words in Waiting” card with a unique identification indicia, such as a number, a scan code, a QR code, or some other known means of personalizing a card ( 9 , 19 , 30 , FIG.","4, 33, 34 ).","The Words in Waiting card ( 33 , 34 ) serves as physical reminder that the Moments exist on company's database in Moment Capsules ( 6 , 16 , 27 ), and that at least one of these Moment Capsules has been designated for that particular recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) (multiple recipients are also contemplate, but for sake of simplicity, we are using one recipient for these examples).","The physical “card” is created by the company upon finalization and sealing of each Moment Capsule ( 9 , 19 , 30 , FIG.","4, 33, 34 ).","Users of the invention ( 1 , 11 , 22 ) will also have the option of ordering a “Legacy Card” from the company ( 10 , 20 , 31 , FIG.","5 ).","The Legacy Card ( 10 , 20 , 31 , FIG.","5 ) will serve as a sort of will/trust card giving notice that Moments from this user exists on the company's database ( 6 , 16 , 27 ), and that Moments will be triggered on a certain date ( 8 , 18 , 29 ).","An estate planning attorney ( 32 ) or Bank ( 21 ) or other trust holder ( 21 ) can work with the company to assist in transferring any property or items designated in the Moment Capsule to the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ).","The Legacy Card ( 10 , 20 , 31 , FIG.","5 ) will have personal identifiable data and the master customer identification to link all Moment Capsules created by the user ( 35 , 36 ).","The company's database ( 6 , 16 , 27 ) also has means to link all Moment Capsules directed toward a particular recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ).","Users ( 1 , 11 , 22 ) will also have the option of ordering a “hard copy” version of the Moment ( FIG.","6 ) to send on the specified date or event (with postal mail timing variations) ( 8 , 18 , 29 ) at an incremental cost to a recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ).","Users ( 1 , 11 , 22 ) may also order a hard copy of the Moment to be delivered to them for safe storage as well ( FIG.","6, 37, 38 ).","Should the user ( 1 , 11 , 22 ) order a hard copy, the hard copy of the Moment will be physically mailed to the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) upon the triggering date ( 8 , 18 , 29 ) printed in paper and sealed in wax ( FIG.","6, 37, 38 ).","Other means of making the physical delivery of the Moment more ceremonial, such as messenger delivery, drone delivery, or having the moment delivered to a recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) place of work, etc.","are contemplated.","Again, while one preferred embodiment of the invention is used for purposes of illustration, there are no limits to the material make-up of the “hard copy” and can therefore be made of any physical material and delivered by any means to the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) as contemplated.","Once the user ( 1 , 11 , 22 ) seals up the Moment in a Moment Capsule ( 3 , 13 , 24 ), the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) can, at the option of the user ( 1 , 11 , 22 ), be notified that a Moment for his/her benefit has been created ( 8 , 18 , 29 ).","The personal identification of the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ), such as address, phone number, email address, is provided by the user ( 1 , 11 , 22 ).","It is highly advised that the user ( 1 , 11 , 22 ) agree to have the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) notified, as this will give notice that a Moment is waiting for him/her, and give the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) an incentive to keep the company notified of changes in address, phone number, email address, etc.","User recipients ( 4 , 14 , 25 ) and beneficiary(ies) contact info will be advised/validated by the Wax & Seal Team, and/or Bank or other Trust Holder, Estate Planning Attorney at routine passing of time in order to maintain the latest and relevant contact info.","The user ( 1 , 11 , 22 ), the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) can set reminder preferences with the company to request any other news relating to Words in Waiting ( 9 , 19 , 30 , FIG.","4 ), Moments ( 6 , 16 , 27 ) and other notifications ( 8 , 18 , 29 ).","Recipients ( 4 , 14 , 25 ) and Beneficiary(ies) ( 5 , 15 , 26 ) will have the option to order from the company a more formalized copy of the Words in Waiting ( 9 , 19 , 30 , FIG.","4 )/Moments ( 6 , 16 , 27 ), such as framed versions, photo books, and other known uses of memorializing events, however the items described are merely for purposes of illustration and not intended to be limiting in any manner—there are no limits to the material make-up of the Moment and can therefore be made of any physical material as contemplated.","Benefits to the user ( 1 , 11 , 22 ) of this invention are considerable.","First, because the Moment Capsules are sold on an “as needed” basis, there are not ongoing subscription costs, and no need for a user to put a credit card on file with the company ( 2 , 12 , 23 ).","Second, because the company provides a physical card ( FIG.","4, 33, 34 , FIG.","5, 35, 36 ) with each Moment Capsule and binds all created Moment Capsules to a Legacy card ( FIG.","5, 35, 36 ), there is less chance that the Moment will be lost in time and no one will remember to activate it ( 6 , 16 , 27 ).","An additional component of the invention can offer a subscription model as an option in the future based on demand.","FIG.","2 is a flowchart showing how a bank or other trust holder could participate in the legacy process.","In this example, the user ( 11 ) of the invention uses a bank ( 21 ) or other trust holder ( 21 ) to hold any physical or financial aspects of the Moment, such that once the triggering event or date is reached ( 18 ), the bank ( 21 ) or other trust holder ( 21 ) “breaks open” the Moment Capsule and delivers its contents ( 16 ) to the recipient ( 14 ) and beneficiary(ies) ( 15 ).","The bank ( 21 ) or other trust holder ( 21 ) is kept abreast of the issues and events surrounding this particular Moment through the Words in Waiting card ( 19 , FIG.","4, 33, 34 ) and the Legacy Card ( 20 , FIG.","5, 35, 36 ) which will permit it access to the company's database ( 16 ) with respect to this particular Moment and Moment Capsule ( 16 ).","FIG.","3 is a flowchart showing how an estate planning attorney could participate in the legacy process.","In this flowchart, an estate planning attorney ( 32 ) is used to assist in the designation of assets to be transferred from a user ( 22 ) to a recipient ( 25 ) and beneficiary(ies) ( 26 ), and in the actual release of the assets to the recipient ( 25 ) and beneficiary(ies) ( 26 ) upon the opening of the Moment Capsule as triggered by a specific date or event ( 29 ) FIG.","4 is an example of a “Words in Waiting” card.","On this card, the personalized message that provides a brief indication as to what is stored from the user ( FIG.","4, 33, 34 ) to the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) is displayed.","FIG.","5 is an example of a “Legacy” card.","The Legacy card displays the unique identification ( FIG.","5, 35, 36 ) for this user ( 1 , 11 , 22 ) and all Moments created.","The user can set preferences as to how Moment content will be reviewed by a named Executor ( 35 , 36 , 10 , 20 , 31 , 6 , 16 , 27 ).","For example, the user ( 1 , 11 , 22 ) can decide that he/she would want the Executor ( FIG.","5, 35, 36 ) to have knowledge of the Moments and recipients ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) but may not want content divulged.","The user can set preferences in a number of different ways as to the release of the Moment content ( 6 , 16 , 27 ).","Executors ( 10 , 20 , 31 ) contact info will be advised/validated by the Wax & Seal Team and/or Bank or other Trust Holder, Estate Planning Attorney at routine passing of time in order to maintain the latest and relevant contact info.","FIG.","6 is an example of a “hard copy” Moment being delivered under wax and seal ( 37 , 38 ) It should be understood that while the preferred embodiments of the invention are described in some detail herein, the present disclosure is made by way of example only and that variations and changes thereto are possible without departing from the subject matter coming within the scope of the following claims, and a reasonable equivalency thereof, which claims I regard as my invention.","All of the material in this patent document is subject to copyright protection under the copyright laws of the United States and other countries.","The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in official governmental records but, otherwise, all other copyright rights whatsoever are reserved.","detailed-description description=\"Detailed Description\" end=\"tail\"?"],["CROSS REFERENCE TO RELATED APPLICATIONS This application claims priority back to U.S. application Ser.","No.","15/373,674 filed Dec. 9, 2016 the contents of which are incorporated by reference into this application.","STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was not federally sponsored.","BACKGROUND OF THE INVENTION Field of the Invention This invention relates to a card, referred to generally as a legacy card, and a method of using the legacy card to accomplish a number of desired goals.","The basic premise under which the legacy card works is that people would like to leave memories and in some cases items (items that pose no legal risks i.e.","securities, intellectual property, avoidance of probate), to others in the future.","The invention includes a software prompt that asks the user creator if there is any legal risk content created as a reminder of the terms of use.","The invention applies a software algorithm that scores the user creator content for legal risk levels based on keywords (i.e.","securities, 401k, account numbers, countries that are frequently used for hiding assets—Switzerland, Cayman Islands, China, etc.)","in English and other languages and additional attributes that signal risk.","The algorithm also looks for items that a person may be trying to gift where there are potential problems with the gift, such as intellectual property items such as “patents”, “trademarks” and “copyrights”, or “securities”.","The algorithm could even search for estate planning terms which often cause inheritance problems such as “Rule Against Perpetuities”.","This algorithm improves on an ongoing basis as it builds a translation memory of risk keywords/attributes to be utilized each time it scores user creator content.","Overtime the algorithm becomes more intelligent as it adds keywords/attributes that signal risk.","In this case user creator content follows a pathway of levels: Level 1 includes a software prompt, algorithm, and scoring effort.","If risk is determined, user creator content is assigned to Level 2 where the appropriate subject matter expert is introduced for guidance and as the subject matter narrows in the exploration of risk additional subject matter experts may be introduced to mitigate risk and ensure that the user creator content intent is legally valid.","It is important to note that these risk factors require educated, certified, and credible subject matter experts to provide relevant and valid guidance.","This invention is for the specific use of memory keeping.","For example, a grandparent not expecting to live to a grandchild's 50th birthday might want to leave that grandchild a memory or other written document that would be delivered to the grandchild on that grandchild's 50th birthday.","There are estate plans that handle the future delivery of assets from a donor to a beneficiary, but these are often done in a purely business transaction manner.","Thus, there exists a need for a means by which people can leave “memories” and gifts to a person, for future delivery, that can be personalized and yet kept safely until the time is ready for their delivery.","The current invention provides just such a solution by having a card that is used by a person (user) wishing to leave a tangible or intangible item to a future beneficiary.","A company owns or licenses the invention, and allows users to create one or more “Moments” online, which are then sealed in Moment Capsules by the company owning or licensing this invention.","The user designates a recipient and beneficiary(ies) for each Moment, and sets a specific date, triggering date or event such as a life event or holiday for the Moment to be delivered to the recipient and beneficiary(ies).","The company creates a physical “Legacy Card” which is mailed to the user, upon which information identifying the Moment is stored, and a “Words in Waiting” card that transmits a brief message indicating what may be in the Moment Capsule for the recipient and beneficiary(ies).","Through these physical cards, the user sets up a future gift of thoughts, images, video, or even, optionally, tangible assets such as property or money if allowed under that state's laws or through advisement of a bank or other trustee or estate planning attorney who can advise the user appropriately.","To ensure that user creator content poses no legal risk, as described in [0001] and [0002] the invention employs a pathway of levels that include a software prompt, intelligent algorithm, risk scoring, and introduction/guidance from subject matter experts.","There has thus been outlined, rather broadly, the more important features of the invention in order that the detailed description thereof may be better understood, and in order that the present contribution to the art may be better appreciated.","There are additional features of the invention that will be described hereinafter and which will form the subject matter of the claims appended hereto.","The features listed herein and other features, aspects and advantages of the present invention will become better understood with reference to the following description and appended claims.","The accompanying drawings, which are incorporated in and constitute part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.","It should be understood the while the preferred embodiments of the invention are described in some detail herein, the present disclosure is made by way of example only and that variations and changes thereto are possible without departing from the subject matter coming within the scope of the following claims, and a reasonable equivalency thereof, which claims I regard as my invention.","BRIEF DESCRIPTION OF THE FIGURES One preferred form of the invention will now be described with reference to the accompanying drawings.","FIG.","1 is a general flowchart of the invention according to a preferred form of the invention.","FIG.","2 is a flowchart showing how a bank or other trust holder could participate in the legacy process.","FIG.","3 is a flowchart showing how an estate planning attorney could participate in the legacy process.","FIG.","4 is an example of a “Words in Waiting” card.","FIG.","5 is an example of a “Legacy” card.","FIG.","6 is an example of a hard copy Moment being delivered under wax and seal.","DETAILED DESCRIPTION OF THE FIGURES Many aspects of the invention can be better understood with references made to the drawings below.","The components in the drawings are not necessarily drawn to scale.","Instead, emphasis is placed upon clearly illustrating the components of the present invention.","Moreover, like reference numerals designate corresponding parts through the several views in the drawings.","Before explaining at least one embodiment of the invention, it is to be understood that the embodiments of the invention are not limited in their application to the details of construction and to the arrangement of the components set forth in the following description or illustrated in the drawings.","The embodiments of the invention are capable of being practiced and carried out in various ways.","In addition, the phraseology and terminology employed herein are for the purpose of description and should not be regarded as limiting.","BRIEF SUMMARY OF THE INVENTION A person wanting to create a Legacy Card for a future gift fills out an application, which is reviewed by the Legacy Card's software, which scans it for potential problems, such as terms frequently associated with tax evasion, or items for which “gifting” is often problematic.","For example, if the software finds the term “patent”, it would notify the Legacy Card employee of this issue.","The Legacy Card employee could review the findings and make a risk assessment and then render a judgement on whether there is not a significant problem (positive judgement) or whether there may be a significant enough problem to warrant referring the issue to an outside professional (negative judgement).","In the example of a patent issue, the Legacy Card employee could refer this to an intellectual property attorney, who could then counsel the applicant on making sure any maintenance fees were paid such that the gift of a patent would result in the gift of a valid patent.","When the Legacy Card employee refers out a matter to an outside professional, the Legacy Card employee will take the advice rendered by the outside professional and use that to update the searching software, such that the ability of Legacy Card to ferret out problems at an early stage becomes better and better over time.","FIG.","1 is a general flowchart of the invention according to a preferred form of the invention.","The general goal of the card and the use of the card is to create a personal archive that can become active at a later date to the benefit of another person.","The invention proceeds as follows.","A user of the invention (1, 11, 22) decides to leave some sort of legacy (10, 20, 31) to another person—the “Recipient” (4, 14, 25) or “Beneficiary(ies)” (5, 15, 26)—and begins by purchasing a “Moment Capsule” or “Moment” (2, 12, 23) from the company that owns the invention or licenses rights to it “the company”.","The user receives a software prompt asking if there is any at legal risk content being created (3,13, 24) if yes, user is provided the appropriate contact info or advisement and reminded of terms of use.","If no, user may continue to next step.","The user (1, 11, 22) then, through the company's online platform (2, 12, 23), creates the “moment” (3, 13, 24) and the moment is stored by the company in electronic format (8, 18, 29).","Storing data in electronic format is well known in the industry and this invention includes embodiments using any of the currently available data storage means and methods to create and store these moments.","An algorithm is applied to the user creator content to assess risk and provided with a risk score, in cases where risk-score is mid or high a pathway of Levels is employed where specific subject matters are introduced for further guidance on how to proceed legally (3, 13,24).","The original designee of the Moment is called the Recipient (4, 14, 25), but the user (1, 11, 22) of the invention can designate additional or alternate beneficiaries (5, 15, 26) as well.","Indeed, the invention also contemplates that the original Recipient (4, 14, 25) can even name additional Recipients (4, 14, 25) and/or Beneficiaries (5, 15, 26).","To simplify the use of the legacy card (10, 20, 31), all those who are in line to receive a Moment (6, 16, 27) will be referred to as Recipients (4, 14, 25) and Beneficiary(ies) (5, 15, 26) The “Moment” can be basically anything, ranging from a letter or other personal communication not limited to images and video to a gift or bequest (3, 13, 24) not withstanding any legal risks.","The moment can be set to be given to the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) at a certain date “To Tom on his 21st birthday” or to be triggered by a certain event “Should Tom marry and have a child, this moment shall trigger on his first child's first birthday” (8, 18, 29).","The Moment is not only stored online on the company's database (6, 16, 27), but also sent to the recipient (4, 14, 25) and/or beneficiary(ies) (5, 15, 26), or to some person (such as an estate planning attorney) (32) or entity (such as a bank or trust holder) (21) that has been designated to oversee gifts and other interactions with recipients (4, 14, 25) and beneficiary(ies) (5, 15, 26).","Depending on the user's desire (1, 11, 22), the user (1, 11, 22) and even recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) may have the option to create (3, 13, 24), review (7, 17, 28), search (6, 16, 27), notify for viewing (8, 18, 29), and store Moment Capsules on the platform (6, 16, 27).","The company owning or using this invention (6, 21, 32) provides an online platform where, after the user purchases the Moment Capsule (2, 12, 23), the user (1, 11, 22) can create the moment in a number of ways (3, 13, 24).","First, the user (1, 11, 22) can choose from a variety of templates, frameworks and designs supplied by the company and type directly onto the template and/or upload pictures, images, video and other documents (3, 13, 24).","Second, the user (1, 11, 22) can personally create the Moment “offline” and then upload the entire moment onto the company's server (3, 13, 24).","Third, the user (1, 11, 22) can cooperate with other people to jointly create a grouping of Moments—either offline to be later loaded onto the company's server, or jointly created on the company's templates (3, 13, 24).","No matter how the Moment is created, the user(s) (1, 11, 22) can select from a variety of fonts, sizes, colors, clip art, upload other content in other formats, and other known elements in word processing, graphic design, and video production software (3, 13, 24).","The company has a variety of means, such as docketing software, to “seal” the Moment into a Moment Capsule, which is then scheduled for release (8, 18, 29) to the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) at some date in the future (8, 18, 29).","As previously mentioned, the future date could be a set date (“Jan.","1, 2025”), such as a certain future date, a birthday, an anniversary, or some other special occasion with a fixed, certain date (8, 18, 29).","The date could also be an open-ended future date contingent upon a certain event (“10 years from the day I die”), or a future date contingency upon an uncertain occurrence or occurrence (“10 years from the day I die or the date that Tom marries and has his first child, whichever occurs first”) (8, 18, 29).","The Moment Capsule could also be scheduled to be delivered upon random events, and could be delivered in staggered stages as well (8, 18, 29).","The role of an estate planner (FIG.","3) comes into play here to avoid the dreaded Rule Against Perpetuities and other estate planning problems.","Users (1, 11, 22) will work with the company to add recipients (4,14, 25) and beneficiaries (5, 15, 26) for future notification of the Moments (8, 18, 29).","The company will store, for perpetuity, the Moments in Moment Capsules which can be read/re-read/shared (6, 16, 27) by both the recipients (4, 14, 25) and beneficiaries (5, 15, 26), and for their future generations (6, 16, 27).","The Moment Capsules will be stored on a redundant cloud database for perpetuity, with multiple backups in case of failure of one database (8, 18, 29).","Should one of more of the companies storing the Moment Capsules go out of business, the company could contract with an estate planning attorney (32), bank, (21) or other trust holder (21) for that person/organization to step in an either transfer the Moment Capsules to another company, or take over the trust obligations personally.","Turning to the actual legacy card itself (10, 20, 31, FIG.","5), the invention contemplates a physical card (35, 36).","In a preferred embodiment, the card is the approximate size and shape as a credit card or gift card, but other sizes and shapes are contemplated (FIG.","5).","One preferred embodiment calls for the card to be made of plastic, the approximate length, width and height of a credit card, and to have a unique watermark such as a Holokote watermark of the company on it (35, 36).","However, it should be stressed that there are no limits to the material make-up of the card and can therefore be made of any physical material as contemplated.","The company then creates a “Words in Waiting” card with a unique identification indicia, such as a number, a scan code, a QR code, or some other known means of personalizing a card (9, 19, 30, FIG.","4, 33, 34).","The Words in Waiting card (33,34) serves as physical reminder that the Moments exist on company's database in Moment Capsules (6, 16, 27), and that at least one of these Moment Capsules has been designated for that particular recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) (multiple recipients are also contemplate, but for sake of simplicity, we are using one recipient for these examples).","The physical “card” is created by the company upon finalization and sealing of each Moment Capsule (9, 19, 30, FIG.","4, 33, 34).","Users of the invention (1, 11, 22) will also have the option of ordering a “Legacy Card” from the company (10, 20, 31, FIG.","5).","The Legacy Card (10, 20, 31, FIG.","5) will serve as a sort of will/trust card giving notice that Moments from this user exists on the company's database (6, 16, 27), and that Moments will be triggered on a certain date (8, 18, 29).","An estate planning attorney (32) or Bank (21) or other trust holder (21) can work with the company to assist in transferring any property or items designated in the Moment Capsule to the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26).","The Legacy Card (10, 20, 31, FIG.","5) will have personal identifiable data and the master customer identification to link all Moment Capsules created by the user (35, 36).","The company's database (6, 16, 27) also has means to link all Moment Capsules directed toward a particular recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26).","Users (1, 11, 22) will also have the option of ordering a “hard copy” version of the Moment (FIG.","6) to send on the specified date or event (with postal mail timing variations) (8, 18, 29) at an incremental cost to a recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26).","Users (1, 11, 22) may also order a hard copy of the Moment to be delivered to them for safe storage as well (FIG.","6, 37, 38).","Should the user (1, 11, 22) order a hard copy, the hard copy of the Moment will be physically mailed to the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) upon the triggering date (8, 18, 29) printed in paper and sealed in wax (FIG.","6, 37, 38).","Other means of making the physical delivery of the Moment more ceremonial, such as messenger delivery, drone delivery, or having the moment delivered to a recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) place of work, etc.","are contemplated.","Again, while one preferred embodiment of the invention is used for purposes of illustration, there are no limits to the material make-up of the “hard copy” and can therefore be made of any physical material and delivered by any means to the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) as contemplated.","Once the user (1, 11, 22) seals up the Moment in a Moment Capsule (3, 13, 24), the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) can, at the option of the user (1, 11, 22), be notified that a Moment for his/her benefit has been created (8, 18, 29).","The personal identification of the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26), such as address, phone number, email address, is provided by the user (1, 11, 22).","It is highly advised that the user (1, 11, 22) agree to have the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) notified, as this will give notice that a Moment is waiting for him/her, and give the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) an incentive to keep the company notified of changes in address, phone number, email address, etc.","User recipients (4,14, 25) and beneficiary(ies) contact info will be advised/validated by the Wax & Seal Team, and/or Bank or other Trust Holder, Estate Planning Attorney at routine passing of time in order to maintain the latest and relevant contact info.","The user (1, 11, 22), the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) can set reminder preferences with the company to request any other news relating to Words in Waiting (9, 19, 30, FIG.","4), Moments (6, 16, 27) and other notifications (8, 18, 29).","Recipients (4, 14, 25) and Beneficiary(ies) (5, 15, 26) will have the option to order from the company a more formalized copy of the Words in Waiting (9, 19, 30, FIG.","4)/Moments (6, 16, 27), such as framed versions, photo books, and other known uses of memorializing events, however the items described are merely for purposes of illustration and not intended to be limiting in any manner—there are no limits to the material make-up of the Moment and can therefore be made of any physical material as contemplated.","Benefits to the user (1, 11, 22) of this invention are considerable.","First, because the Moment Capsules are sold on an “as needed” basis, there are not ongoing subscription costs, and no need for a user to put a credit card on file with the company (2, 12, 23).","Second, because the company provides a physical card (FIG.","4, 33, 34, FIG.","5, 35, 36) with each Moment Capsule and binds all created Moment Capsules to a Legacy card (FIG.","5, 35, 36), there is less chance that the Moment will be lost in time and no one will remember to activate it (6, 16, 27).","An additional component of the invention can offer a subscription model as an option in the future based on demand.","FIG.","2 is a flowchart showing how a bank or other trust holder could participate in the legacy process.","In this example, the user (11) of the invention uses a bank (21) or other trust holder (21) to hold any physical or financial aspects of the Moment, such that once the triggering event or date is reached (18), the bank (21) or other trust holder (21) “breaks open” the Moment Capsule and delivers its contents (16) to the recipient (14) and beneficiary(ies) (15).","The bank (21) or other trust holder (21) is kept abreast of the issues and events surrounding this particular Moment through the Words in Waiting card (19, FIG.","4, 33, 34) and the Legacy Card (20, FIG.","5, 35, 36) which will permit it access to the company's database (16) with respect to this particular Moment and Moment Capsule (16).","FIG.","3 is a flowchart showing how an estate planning attorney could participate in the legacy process.","In this flowchart, an estate planning attorney (32) is used to assist in the designation of assets to be transferred from a user (22) to a recipient (25) and beneficiary(ies) (26), and in the actual release of the assets to the recipient (25) and beneficiary(ies) (26) upon the opening of the Moment Capsule as triggered by a specific date or event (29) FIG.","4 is an example of a “Words in Waiting” card.","On this card, the personalized message that provides a brief indication as to what is stored from the user (FIG.","4, 33, 34) to the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) is displayed.","FIG.","5 is an example of a “Legacy” card.","The Legacy card displays the unique identification (FIG.","5, 35, 36) for this user (1, 11, 22) and all Moments created.","The user can set preferences as to how Moment content will be reviewed by a named Executor (35, 36, 10, 20, 31, 6, 16, 27).","For example, the user (1, 11, 22) can decide that he/she would want the Executor (FIG.","5, 35, 36) to have knowledge of the Moments and recipients (4, 14, 25) and beneficiary(ies) (5, 15, 26) but may not want content divulged.","The user can set preferences in a number of different ways as to the release of the Moment content (6, 16, 27).","Executors (10, 20, 31) contact info will be advised/validated by the Wax & Seal Team and/or Bank or other Trust Holder, Estate Planning Attorney at routine passing of time in order to maintain the latest and relevant contact info.","FIG.","6 is an example of a “hard copy” Moment being delivered under wax and seal (37, 38) It should be understood that while the preferred embodiments of the invention are described in some detail herein, the present disclosure is made by way of example only and that variations and changes thereto are possible without departing from the subject matter coming within the scope of the following claims, and a reasonable equivalency thereof, which claims I regard as my invention.","All of the material in this patent document is subject to copyright protection under the copyright laws of the United States and other countries.","The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in official governmental records but, otherwise, all other copyright rights whatsoever are reserved."]],"string":"[\n [\n \"Legacy Card\",\n \"This invention is directed toward a card that is used by a person wishing to leave a tangible or intangible item to a future recipient and beneficiary(ies).\",\n \"The user creates a Moment online, which is then sealed in a Moment Capsule by a company owning or licensing this invention.\",\n \"The user designates a recipient and beneficiary(ies) of the Moment, and sets a triggering date or event for the Moment to be delivered to the beneficiary.\",\n \"The company creates a physical “Legacy Card” which is mailed to the user and/or the beneficiary or executor, upon which information identifying the Moment is stored.\",\n \"A human resource element reviews each application for a Legacy Card, then refers out any potentially problematic “gifts”, receives advice from an appropriate professional, then incorporates that advice into the search software to improve the product over time.\"\n ],\n [\n \"1.A system for distributing content consisting of: a storage medium a scheduled delivery component a software component, a human resource component, and, a legacy card, where the storage medium is a non-transitory computer readable storage medium, where the scheduled delivery component consists of a triggering component, and where the software component consists of both a docketing component and a search component, and additionally comprises a programming logic, where the docketing component consists of a processor executing programming logic for interfacing with a user, the programming logic configured to accept a user identifier, a recipient identifier, a beneficiary(ies) identifier, a content, and a trigger event; generate a unique identifier; and save the user identifier, the recipient identifier, the beneficiary(ies) identifier, the executor identifier, the content, the trigger event, and the unique identifier to the non-transitory computer readable storage medium; where the search component scans an application for a Legacy Card submitted by a prospective client for one or more keywords and phrases that have been programmed into the search component to search for one or more risk factors with the application, and renders a risk assessment, where the human resource element comprises at least one Legacy Card employee who reviews the search component and performs an analysis of the one or more risk factors and the risk assessment, and then renders a judgement on the application, where, based on the judgement rendered by the at least one Legacy Care employee, where a positive review results in the one or more Legacy Care employee approving the application and where a negative review results in the one or more Legacy Card employees taking an additional contact action, where the additional contact action consists of contacting one or more additional professionals who provide one or more items of professional advice to the at least one Legacy Card employee, and where the at least one Legacy Card employee uses the one or more items of professional advice to update the search component, and a legacy card, where the legacy card comprises a recipient identifier, a beneficiary(ies) identifier, an executor identifier, a trigger event, and a unique identifier.\",\n \"2.The system of claim 1, where the risk assessment contains one or more estate planning issues, the at least one Legacy Card employee contacts at least one Estate Planning Attorney, and where the least one Estate Planning Attorney is notified by the at least one Legacy Card employee, and where the at least one Estate Planning Attorney provides an Estate Planning advice to the at least one Legacy Card employee and to the prospective client, where the Estate Planning advice is used by the at least one Legacy Card employee to make a modification to the search component, such that the search component becomes more effective over time.\",\n \"3.The system of claim 1, where the risk assessment contains one or more intellectual property issues, then at least one Legacy Card employee contacts at least one Intellectual Property Attorney, and where the least one Intellectual Property Attorney is notified by the at least one Legacy Card employee, and where the at least one Intellectual Property Attorney provides an Intellectual Property advice to the at least one Legacy Card employee and to the prospective client, where the Intellectual Property advice is used by the at least one Legacy Card employee to make a modification to the search component, such that the search component becomes more effective over time.\",\n \"4.The system of claim 1, where the risk assessment contains one or more securities issues, the at least one Legacy Card employee contacts at least one Securities Attorney, and where the least one Securities Attorney is notified by the at least one Legacy Card employee, and where the at least one Securities Attorney provides a Securities Advice to the at least one Legacy Card employee and to the prospective client, where the Securities Advice is used by the at least one Legacy Card employee to make a modification to the search component, such that the search component becomes more effective over time.\",\n \"5.A system for distributing content comprising: a storage medium a scheduled delivery component a software component, a human resource component, and, a legacy card, where the storage medium is a non-transitory computer readable storage medium, where the scheduled delivery component consists of a triggering component, and where the software component comprises both a docketing component and a search component, where the docketing component comprises a processor executing programming logic for interfacing with a user, the programming logic configured to accept a user identifier, a recipient identifier, a beneficiary(ies) identifier, content, and a trigger event; generate a unique identifier; and save the user identifier, recipient identifier, beneficiary(ies) identifier, executor identifier, content, trigger event, and unique identifier to the non-transitory computer readable storage medium; where the search component scans an application for a Legacy Card submitted by a prospective client for one or more keywords and phrases that have been programmed into the search component to search for one or more risk factors with the application, and renders a risk assessment, where the human resource element comprises at least one Legacy Card employee who reviews the search component and performs an analysis of the one or more risk factors and the risk assessment, and then renders a judgement on the application, where, based on the judgement rendered by the at least one Legacy Care employee, he/she takes an additional contact action when the judgement is a negative judgement, where the additional contact action comprises contacting one or more additional professionals who provide one or more items of professional advice to the at least one Legacy Card employee, where the one or more items of professional advice provided by the one or more additional professionals is used by the at least one Legacy Card employee to modify the search component, such that the search component is improved over time, and a legacy card, where the legacy card comprises the recipient identifier, the beneficiary(ies) identifier, the executor identifier, the trigger event, and the unique identifier.\",\n \"6.The system of claim 5, further comprising a words-in-waiting card, where the words in waiting card comprises a content, and where the trigger event is a specific date.\",\n \"7.The system of claim 6, wherein the programming logic is further configured to provide access to the content after the trigger event and upon receipt of the recipient identifier, the beneficiary(ies) identifier, and the executor identifier.\",\n \"8.The system of claim 6, wherein the non-transitory computer readable storage medium comprises a database whereby the programming logic is configured to save the user identifier, the recipient identifier, the beneficiary(ies) identifier, the executor identifier, the content, the trigger event, and the unique identifier to the database.\",\n \"9.The system of claim 8, where the content comprises a content identifier, where the content identifier references one or more items of tangible personal property, where the recipient identifier is a name of a recipient.\",\n \"10.The system of claim 8, where the recipient identifier comprises a name and a mailing address of a recipient, and where the address of the recipient primary identifier comprises an electronic mail address.\",\n \"11.The system of claim 10, wherein the programming logic is further configured to accept a recipient update request, where the recipient update request comprises a second recipient identifier and the unique identifier; and saves the second recipient identifier to the non-transitory computer readable storage medium using the unique identifier, and, where a human resource advises/validate update requests based on time passing.\",\n \"12.The system of claim 12, where the beneficiary(ies) identifier is a name of a beneficiary(ies).\",\n \"13.The system of claim 12, where the beneficiary(ies) identifier comprises a name and a mailing address of a beneficiary(ies).\",\n \"14.The system of claim 5, where the address of the beneficiary(ies) primary identifier comprises an electronic mail address and where the programming logic is further configured to accept a beneficiary(ies) update request, where the beneficiary(ies) update request comprises a second beneficiary(ies) identifier and the unique identifier; and save the second beneficiary(ies) identifier to the non-transitory computer readable storage medium using the unique identifier, and, where a human resource advises and validates the update requests.\",\n \"15.The system of claim 5, wherein the executor identifier is a name of an executor, wherein the executor identifier comprises of a name and mailing address of an executor, wherein the address of the executor is the primary identifier comprises of an electronic mail address, wherein the programming logic is further configured to accept an executor update request, where the executor update request comprises a second executor identifier and the unique identifier; and save the second executor identifier to the non-transitory computer readable storage medium using the unique identifier, and where a human resource advises and validates update requests, wherein the unique identifier of the legacy card is encoded, wherein the encoded unique identifier of the legacy card is formatted as a barcode, identification number or similar identifier 16.The system of claim 5, where the risk assessment contains one or more estate planning issues, the at least one Legacy Card employee contacts at least one Estate Planning Attorney, and where the least one Estate Planning Attorney is notified by the at least one Legacy Card employee, and where the at least one Estate Planning Attorney provides an Estate Planning advice to the at least one Legacy Card employee and to the prospective client, where the Estate Planning advice is used by the at least one Legacy Card employee to make a modification to the search component, such that the search component becomes more effective over time.\",\n \"17.The system of claim 5, where the risk assessment contains one or more intellectual property issues, then at least one Legacy Card employee contacts at least one Intellectual Property Attorney, and where the least one Intellectual Property Attorney is notified by the at least one Legacy Card employee, and where the at least one Intellectual Property Attorney provides an Intellectual Property advice to the at least one Legacy Card employee and to the prospective client, where the Intellectual Property advice is used by the at least one Legacy Card employee to make a modification to the search component, such that the search component becomes more effective over time.\",\n \"18.The system of claim 5, where the risk assessment contains one or more securities issues, the at least one Legacy Card employee contacts at least one Securities Attorney, and where the least one Securities Attorney is notified by the at least one Legacy Card employee, and where the at least one Securities Attorney provides a Securities Advice to the at least one Legacy Card employee and to the prospective client, where the Securities Advice is used by the at least one Legacy Card employee to make a modification to the search component, such that the search component becomes more effective over time.\",\n \"19.A system for distributing content comprising: a storage medium a scheduled delivery component a software component, a human resource component, and, a legacy card, where the search component scans an application for a Legacy Card submitted by a prospective client for one or more keywords and phrases that have been programmed into the search component to search for one or more risk factors with the application, and renders a risk assessment, where the human resource element comprises at least one Legacy Card employee who reviews the search component and performs an analysis of the one or more risk factors and the risk assessment, and then renders a judgement on the application, where, based on the judgement rendered by the at least one Legacy Care employee, he/she takes an additional contact action when the judgement is a negative judgement, where the additional contact action comprises contacting one or more additional professionals who provide one or more items of professional advice to the at least one Legacy Card employee, where the one or more items of professional advice provided by the one or more additional professionals is used by the at least one Legacy Card employee to modify the search component, such that the search component is improved over time, 20.The system of claim 19, where the storage medium is a non-transitory computer readable storage medium, where the scheduled delivery component consists of a triggering component, and where the software component comprises both a docketing component and a search component, where the docketing component comprises a processor executing programming logic for interfacing with a user, the programming logic configured to accept a user identifier, a recipient identifier, a beneficiary(ies) identifier, content, and a trigger event; generate a unique identifier; and save the user identifier, recipient identifier, beneficiary(ies) identifier, executor identifier, content, trigger event, and unique identifier to the non-transitory computer readable storage medium, and, where the legacy card comprises the recipient identifier, the beneficiary(ies) identifier, the executor identifier, the trigger event, and the unique identifier.\"\n ],\n [\n \" BACKGROUND OF THE INVENTION \"\n ],\n [\n \" BRIEF SUMMARY OF THE INVENTION A person wanting to create a Legacy Card for a future gift fills out an application, which is reviewed by the Legacy Card's software, which scans it for potential problems, such as terms frequently associated with tax evasion, or items for which “gifting” is often problematic.\",\n \"For example, if the software finds the term “patent”, it would notify the Legacy Card employee of this issue.\",\n \"The Legacy Card employee could review the findings and make a risk assessment and then render a judgement on whether there is not a significant problem (positive judgement) or whether there may be a significant enough problem to warrant referring the issue to an outside professional (negative judgement).\",\n \"In the example of a patent issue, the Legacy Card employee could refer this to an intellectual property attorney, who could then counsel the applicant on making sure any maintenance fees were paid such that the gift of a patent would result in the gift of a valid patent.\",\n \"When the Legacy Card employee refers out a matter to an outside professional, the Legacy Card employee will take the advice rendered by the outside professional and use that to update the searching software, such that the ability of Legacy Card to ferret out problems at an early stage becomes better and better over time.\",\n \"FIG.\",\n \"1 is a general flowchart of the invention according to a preferred form of the invention.\",\n \"The general goal of the card and the use of the card is to create a personal archive that can become active at a later date to the benefit of another person.\",\n \"The invention proceeds as follows.\",\n \"A user of the invention ( 1 , 11 , 22 ) decides to leave some sort of legacy ( 10 , 20 , 31 ) to another person—the “Recipient” ( 4 , 14 , 25 ) or “Beneficiary(ies)” ( 5 , 15 , 26 )—and begins by purchasing a “Moment Capsule” or “Moment” ( 2 , 12 , 23 ) from the company that owns the invention or licenses rights to it “the company”.\",\n \"The user receives a software prompt asking if there is any at legal risk content being created ( 3 , 13 , 24 ) if yes, user is provided the appropriate contact info or advisement and reminded of terms of use.\",\n \"If no, user may continue to next step.\",\n \"The user ( 1 , 11 , 22 ) then, through the company's online platform ( 2 , 12 , 23 ), creates the “moment” ( 3 , 13 , 24 ) and the moment is stored by the company in electronic format ( 8 , 18 , 29 ).\",\n \"Storing data in electronic format is well known in the industry and this invention includes embodiments using any of the currently available data storage means and methods to create and store these moments.\",\n \"An algorithm is applied to the user creator content to assess risk and provided with a risk score, in cases where risk-score is mid or high a pathway of Levels is employed where specific subject matters are introduced for further guidance on how to proceed legally ( 3 , 13 , 24 ).\",\n \"The original designee of the Moment is called the Recipient ( 4 , 14 , 25 ), but the user ( 1 , 11 , 22 ) of the invention can designate additional or alternate beneficiaries ( 5 , 15 , 26 ) as well.\",\n \"Indeed, the invention also contemplates that the original Recipient ( 4 , 14 , 25 ) can even name additional Recipients ( 4 , 14 , 25 ) and/or Beneficiaries ( 5 , 15 , 26 ).\",\n \"To simplify the use of the legacy card ( 10 , 20 , 31 ), all those who are in line to receive a Moment ( 6 , 16 , 27 ) will be referred to as Recipients ( 4 , 14 , 25 ) and Beneficiary(ies) ( 5 , 15 , 26 ) The “Moment” can be basically anything, ranging from a letter or other personal communication not limited to images and video to a gift or bequest ( 3 , 13 , 24 ) not withstanding any legal risks.\",\n \"The moment can be set to be given to the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) at a certain date “To Tom on his 21 st birthday” or to be triggered by a certain event “Should Tom marry and have a child, this moment shall trigger on his first child's first birthday” ( 8 , 18 , 29 ).\",\n \"The Moment is not only stored online on the company's database ( 6 , 16 , 27 ), but also sent to the recipient ( 4 , 14 , 25 ) and/or beneficiary(ies) ( 5 , 15 , 26 ), or to some person (such as an estate planning attorney) ( 32 ) or entity (such as a bank or trust holder) ( 21 ) that has been designated to oversee gifts and other interactions with recipients ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ).\",\n \"Depending on the user's desire ( 1 , 11 , 22 ), the user ( 1 , 11 , 22 ) and even recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) may have the option to create ( 3 , 13 , 24 ), review ( 7 , 17 , 28 ), search ( 6 , 16 , 27 ), notify for viewing ( 8 , 18 , 29 ), and store Moment Capsules on the platform ( 6 , 16 , 27 ).\",\n \"The company owning or using this invention ( 6 , 21 , 32 ) provides an online platform where, after the user purchases the Moment Capsule ( 2 , 12 , 23 ), the user ( 1 , 11 , 22 ) can create the moment in a number of ways ( 3 , 13 , 24 ).\",\n \"First, the user ( 1 , 11 , 22 ) can choose from a variety of templates, frameworks and designs supplied by the company and type directly onto the template and/or upload pictures, images, video and other documents ( 3 , 13 , 24 ).\",\n \"Second, the user ( 1 , 11 , 22 ) can personally create the Moment “offline” and then upload the entire moment onto the company's server ( 3 , 13 , 24 ).\",\n \"Third, the user ( 1 , 11 , 22 ) can cooperate with other people to jointly create a grouping of Moments—either offline to be later loaded onto the company's server, or jointly created on the company's templates ( 3 , 13 , 24 ).\",\n \"No matter how the Moment is created, the user(s) ( 1 , 11 , 22 ) can select from a variety of fonts, sizes, colors, clip art, upload other content in other formats, and other known elements in word processing, graphic design, and video production software ( 3 , 13 , 24 ).\",\n \"The company has a variety of means, such as docketing software, to “seal” the Moment into a Moment Capsule, which is then scheduled for release ( 8 , 18 , 29 ) to the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) at some date in the future ( 8 , 18 , 29 ).\",\n \"As previously mentioned, the future date could be a set date (“Jan.\",\n \"1, 2025”), such as a certain future date, a birthday, an anniversary, or some other special occasion with a fixed, certain date ( 8 , 18 , 29 ).\",\n \"The date could also be an open-ended future date contingent upon a certain event (“10 years from the day I die”), or a future date contingency upon an uncertain occurrence or occurrence (“10 years from the day I die or the date that Tom marries and has his first child, whichever occurs first”) ( 8 , 18 , 29 ).\",\n \"The Moment Capsule could also be scheduled to be delivered upon random events, and could be delivered in staggered stages as well ( 8 , 18 , 29 ).\",\n \"The role of an estate planner ( FIG.\",\n \"3 ) comes into play here to avoid the dreaded Rule Against Perpetuities and other estate planning problems.\",\n \"Users ( 1 , 11 , 22 ) will work with the company to add recipients ( 4 , 14 , 25 ) and beneficiaries ( 5 , 15 , 26 ) for future notification of the Moments ( 8 , 18 , 29 ).\",\n \"The company will store, for perpetuity, the Moments in Moment Capsules which can be read/re-read/shared ( 6 , 16 , 27 ) by both the recipients ( 4 , 14 , 25 ) and beneficiaries ( 5 , 15 , 26 ), and for their future generations ( 6 , 16 , 27 ).\",\n \"The Moment Capsules will be stored on a redundant cloud database for perpetuity, with multiple backups in case of failure of one database ( 8 , 18 , 29 ).\",\n \"Should one of more of the companies storing the Moment Capsules go out of business, the company could contract with an estate planning attorney ( 32 ), bank, ( 21 ) or other trust holder ( 21 ) for that person/organization to step in an either transfer the Moment Capsules to another company, or take over the trust obligations personally.\",\n \"Turning to the actual legacy card itself ( 10 , 20 , 31 , FIG.\",\n \"5 ), the invention contemplates a physical card ( 35 , 36 ).\",\n \"In a preferred embodiment, the card is the approximate size and shape as a credit card or gift card, but other sizes and shapes are contemplated ( FIG.\",\n \"5 ).\",\n \"One preferred embodiment calls for the card to be made of plastic, the approximate length, width and height of a credit card, and to have a unique watermark such as a Holokote watermark of the company on it ( 35 , 36 ).\",\n \"However, it should be stressed that there are no limits to the material make-up of the card and can therefore be made of any physical material as contemplated.\",\n \"The company then creates a “Words in Waiting” card with a unique identification indicia, such as a number, a scan code, a QR code, or some other known means of personalizing a card ( 9 , 19 , 30 , FIG.\",\n \"4, 33, 34 ).\",\n \"The Words in Waiting card ( 33 , 34 ) serves as physical reminder that the Moments exist on company's database in Moment Capsules ( 6 , 16 , 27 ), and that at least one of these Moment Capsules has been designated for that particular recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) (multiple recipients are also contemplate, but for sake of simplicity, we are using one recipient for these examples).\",\n \"The physical “card” is created by the company upon finalization and sealing of each Moment Capsule ( 9 , 19 , 30 , FIG.\",\n \"4, 33, 34 ).\",\n \"Users of the invention ( 1 , 11 , 22 ) will also have the option of ordering a “Legacy Card” from the company ( 10 , 20 , 31 , FIG.\",\n \"5 ).\",\n \"The Legacy Card ( 10 , 20 , 31 , FIG.\",\n \"5 ) will serve as a sort of will/trust card giving notice that Moments from this user exists on the company's database ( 6 , 16 , 27 ), and that Moments will be triggered on a certain date ( 8 , 18 , 29 ).\",\n \"An estate planning attorney ( 32 ) or Bank ( 21 ) or other trust holder ( 21 ) can work with the company to assist in transferring any property or items designated in the Moment Capsule to the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ).\",\n \"The Legacy Card ( 10 , 20 , 31 , FIG.\",\n \"5 ) will have personal identifiable data and the master customer identification to link all Moment Capsules created by the user ( 35 , 36 ).\",\n \"The company's database ( 6 , 16 , 27 ) also has means to link all Moment Capsules directed toward a particular recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ).\",\n \"Users ( 1 , 11 , 22 ) will also have the option of ordering a “hard copy” version of the Moment ( FIG.\",\n \"6 ) to send on the specified date or event (with postal mail timing variations) ( 8 , 18 , 29 ) at an incremental cost to a recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ).\",\n \"Users ( 1 , 11 , 22 ) may also order a hard copy of the Moment to be delivered to them for safe storage as well ( FIG.\",\n \"6, 37, 38 ).\",\n \"Should the user ( 1 , 11 , 22 ) order a hard copy, the hard copy of the Moment will be physically mailed to the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) upon the triggering date ( 8 , 18 , 29 ) printed in paper and sealed in wax ( FIG.\",\n \"6, 37, 38 ).\",\n \"Other means of making the physical delivery of the Moment more ceremonial, such as messenger delivery, drone delivery, or having the moment delivered to a recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) place of work, etc.\",\n \"are contemplated.\",\n \"Again, while one preferred embodiment of the invention is used for purposes of illustration, there are no limits to the material make-up of the “hard copy” and can therefore be made of any physical material and delivered by any means to the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) as contemplated.\",\n \"Once the user ( 1 , 11 , 22 ) seals up the Moment in a Moment Capsule ( 3 , 13 , 24 ), the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) can, at the option of the user ( 1 , 11 , 22 ), be notified that a Moment for his/her benefit has been created ( 8 , 18 , 29 ).\",\n \"The personal identification of the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ), such as address, phone number, email address, is provided by the user ( 1 , 11 , 22 ).\",\n \"It is highly advised that the user ( 1 , 11 , 22 ) agree to have the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) notified, as this will give notice that a Moment is waiting for him/her, and give the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) an incentive to keep the company notified of changes in address, phone number, email address, etc.\",\n \"User recipients ( 4 , 14 , 25 ) and beneficiary(ies) contact info will be advised/validated by the Wax & Seal Team, and/or Bank or other Trust Holder, Estate Planning Attorney at routine passing of time in order to maintain the latest and relevant contact info.\",\n \"The user ( 1 , 11 , 22 ), the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) can set reminder preferences with the company to request any other news relating to Words in Waiting ( 9 , 19 , 30 , FIG.\",\n \"4 ), Moments ( 6 , 16 , 27 ) and other notifications ( 8 , 18 , 29 ).\",\n \"Recipients ( 4 , 14 , 25 ) and Beneficiary(ies) ( 5 , 15 , 26 ) will have the option to order from the company a more formalized copy of the Words in Waiting ( 9 , 19 , 30 , FIG.\",\n \"4 )/Moments ( 6 , 16 , 27 ), such as framed versions, photo books, and other known uses of memorializing events, however the items described are merely for purposes of illustration and not intended to be limiting in any manner—there are no limits to the material make-up of the Moment and can therefore be made of any physical material as contemplated.\",\n \"Benefits to the user ( 1 , 11 , 22 ) of this invention are considerable.\",\n \"First, because the Moment Capsules are sold on an “as needed” basis, there are not ongoing subscription costs, and no need for a user to put a credit card on file with the company ( 2 , 12 , 23 ).\",\n \"Second, because the company provides a physical card ( FIG.\",\n \"4, 33, 34 , FIG.\",\n \"5, 35, 36 ) with each Moment Capsule and binds all created Moment Capsules to a Legacy card ( FIG.\",\n \"5, 35, 36 ), there is less chance that the Moment will be lost in time and no one will remember to activate it ( 6 , 16 , 27 ).\",\n \"An additional component of the invention can offer a subscription model as an option in the future based on demand.\",\n \"FIG.\",\n \"2 is a flowchart showing how a bank or other trust holder could participate in the legacy process.\",\n \"In this example, the user ( 11 ) of the invention uses a bank ( 21 ) or other trust holder ( 21 ) to hold any physical or financial aspects of the Moment, such that once the triggering event or date is reached ( 18 ), the bank ( 21 ) or other trust holder ( 21 ) “breaks open” the Moment Capsule and delivers its contents ( 16 ) to the recipient ( 14 ) and beneficiary(ies) ( 15 ).\",\n \"The bank ( 21 ) or other trust holder ( 21 ) is kept abreast of the issues and events surrounding this particular Moment through the Words in Waiting card ( 19 , FIG.\",\n \"4, 33, 34 ) and the Legacy Card ( 20 , FIG.\",\n \"5, 35, 36 ) which will permit it access to the company's database ( 16 ) with respect to this particular Moment and Moment Capsule ( 16 ).\",\n \"FIG.\",\n \"3 is a flowchart showing how an estate planning attorney could participate in the legacy process.\",\n \"In this flowchart, an estate planning attorney ( 32 ) is used to assist in the designation of assets to be transferred from a user ( 22 ) to a recipient ( 25 ) and beneficiary(ies) ( 26 ), and in the actual release of the assets to the recipient ( 25 ) and beneficiary(ies) ( 26 ) upon the opening of the Moment Capsule as triggered by a specific date or event ( 29 ) FIG.\",\n \"4 is an example of a “Words in Waiting” card.\",\n \"On this card, the personalized message that provides a brief indication as to what is stored from the user ( FIG.\",\n \"4, 33, 34 ) to the recipient ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) is displayed.\",\n \"FIG.\",\n \"5 is an example of a “Legacy” card.\",\n \"The Legacy card displays the unique identification ( FIG.\",\n \"5, 35, 36 ) for this user ( 1 , 11 , 22 ) and all Moments created.\",\n \"The user can set preferences as to how Moment content will be reviewed by a named Executor ( 35 , 36 , 10 , 20 , 31 , 6 , 16 , 27 ).\",\n \"For example, the user ( 1 , 11 , 22 ) can decide that he/she would want the Executor ( FIG.\",\n \"5, 35, 36 ) to have knowledge of the Moments and recipients ( 4 , 14 , 25 ) and beneficiary(ies) ( 5 , 15 , 26 ) but may not want content divulged.\",\n \"The user can set preferences in a number of different ways as to the release of the Moment content ( 6 , 16 , 27 ).\",\n \"Executors ( 10 , 20 , 31 ) contact info will be advised/validated by the Wax & Seal Team and/or Bank or other Trust Holder, Estate Planning Attorney at routine passing of time in order to maintain the latest and relevant contact info.\",\n \"FIG.\",\n \"6 is an example of a “hard copy” Moment being delivered under wax and seal ( 37 , 38 ) It should be understood that while the preferred embodiments of the invention are described in some detail herein, the present disclosure is made by way of example only and that variations and changes thereto are possible without departing from the subject matter coming within the scope of the following claims, and a reasonable equivalency thereof, which claims I regard as my invention.\",\n \"All of the material in this patent document is subject to copyright protection under the copyright laws of the United States and other countries.\",\n \"The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in official governmental records but, otherwise, all other copyright rights whatsoever are reserved.\",\n \"detailed-description description=\\\"Detailed Description\\\" end=\\\"tail\\\"?\"\n ],\n [\n \"CROSS REFERENCE TO RELATED APPLICATIONS This application claims priority back to U.S. application Ser.\",\n \"No.\",\n \"15/373,674 filed Dec. 9, 2016 the contents of which are incorporated by reference into this application.\",\n \"STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was not federally sponsored.\",\n \"BACKGROUND OF THE INVENTION Field of the Invention This invention relates to a card, referred to generally as a legacy card, and a method of using the legacy card to accomplish a number of desired goals.\",\n \"The basic premise under which the legacy card works is that people would like to leave memories and in some cases items (items that pose no legal risks i.e.\",\n \"securities, intellectual property, avoidance of probate), to others in the future.\",\n \"The invention includes a software prompt that asks the user creator if there is any legal risk content created as a reminder of the terms of use.\",\n \"The invention applies a software algorithm that scores the user creator content for legal risk levels based on keywords (i.e.\",\n \"securities, 401k, account numbers, countries that are frequently used for hiding assets—Switzerland, Cayman Islands, China, etc.)\",\n \"in English and other languages and additional attributes that signal risk.\",\n \"The algorithm also looks for items that a person may be trying to gift where there are potential problems with the gift, such as intellectual property items such as “patents”, “trademarks” and “copyrights”, or “securities”.\",\n \"The algorithm could even search for estate planning terms which often cause inheritance problems such as “Rule Against Perpetuities”.\",\n \"This algorithm improves on an ongoing basis as it builds a translation memory of risk keywords/attributes to be utilized each time it scores user creator content.\",\n \"Overtime the algorithm becomes more intelligent as it adds keywords/attributes that signal risk.\",\n \"In this case user creator content follows a pathway of levels: Level 1 includes a software prompt, algorithm, and scoring effort.\",\n \"If risk is determined, user creator content is assigned to Level 2 where the appropriate subject matter expert is introduced for guidance and as the subject matter narrows in the exploration of risk additional subject matter experts may be introduced to mitigate risk and ensure that the user creator content intent is legally valid.\",\n \"It is important to note that these risk factors require educated, certified, and credible subject matter experts to provide relevant and valid guidance.\",\n \"This invention is for the specific use of memory keeping.\",\n \"For example, a grandparent not expecting to live to a grandchild's 50th birthday might want to leave that grandchild a memory or other written document that would be delivered to the grandchild on that grandchild's 50th birthday.\",\n \"There are estate plans that handle the future delivery of assets from a donor to a beneficiary, but these are often done in a purely business transaction manner.\",\n \"Thus, there exists a need for a means by which people can leave “memories” and gifts to a person, for future delivery, that can be personalized and yet kept safely until the time is ready for their delivery.\",\n \"The current invention provides just such a solution by having a card that is used by a person (user) wishing to leave a tangible or intangible item to a future beneficiary.\",\n \"A company owns or licenses the invention, and allows users to create one or more “Moments” online, which are then sealed in Moment Capsules by the company owning or licensing this invention.\",\n \"The user designates a recipient and beneficiary(ies) for each Moment, and sets a specific date, triggering date or event such as a life event or holiday for the Moment to be delivered to the recipient and beneficiary(ies).\",\n \"The company creates a physical “Legacy Card” which is mailed to the user, upon which information identifying the Moment is stored, and a “Words in Waiting” card that transmits a brief message indicating what may be in the Moment Capsule for the recipient and beneficiary(ies).\",\n \"Through these physical cards, the user sets up a future gift of thoughts, images, video, or even, optionally, tangible assets such as property or money if allowed under that state's laws or through advisement of a bank or other trustee or estate planning attorney who can advise the user appropriately.\",\n \"To ensure that user creator content poses no legal risk, as described in [0001] and [0002] the invention employs a pathway of levels that include a software prompt, intelligent algorithm, risk scoring, and introduction/guidance from subject matter experts.\",\n \"There has thus been outlined, rather broadly, the more important features of the invention in order that the detailed description thereof may be better understood, and in order that the present contribution to the art may be better appreciated.\",\n \"There are additional features of the invention that will be described hereinafter and which will form the subject matter of the claims appended hereto.\",\n \"The features listed herein and other features, aspects and advantages of the present invention will become better understood with reference to the following description and appended claims.\",\n \"The accompanying drawings, which are incorporated in and constitute part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.\",\n \"It should be understood the while the preferred embodiments of the invention are described in some detail herein, the present disclosure is made by way of example only and that variations and changes thereto are possible without departing from the subject matter coming within the scope of the following claims, and a reasonable equivalency thereof, which claims I regard as my invention.\",\n \"BRIEF DESCRIPTION OF THE FIGURES One preferred form of the invention will now be described with reference to the accompanying drawings.\",\n \"FIG.\",\n \"1 is a general flowchart of the invention according to a preferred form of the invention.\",\n \"FIG.\",\n \"2 is a flowchart showing how a bank or other trust holder could participate in the legacy process.\",\n \"FIG.\",\n \"3 is a flowchart showing how an estate planning attorney could participate in the legacy process.\",\n \"FIG.\",\n \"4 is an example of a “Words in Waiting” card.\",\n \"FIG.\",\n \"5 is an example of a “Legacy” card.\",\n \"FIG.\",\n \"6 is an example of a hard copy Moment being delivered under wax and seal.\",\n \"DETAILED DESCRIPTION OF THE FIGURES Many aspects of the invention can be better understood with references made to the drawings below.\",\n \"The components in the drawings are not necessarily drawn to scale.\",\n \"Instead, emphasis is placed upon clearly illustrating the components of the present invention.\",\n \"Moreover, like reference numerals designate corresponding parts through the several views in the drawings.\",\n \"Before explaining at least one embodiment of the invention, it is to be understood that the embodiments of the invention are not limited in their application to the details of construction and to the arrangement of the components set forth in the following description or illustrated in the drawings.\",\n \"The embodiments of the invention are capable of being practiced and carried out in various ways.\",\n \"In addition, the phraseology and terminology employed herein are for the purpose of description and should not be regarded as limiting.\",\n \"BRIEF SUMMARY OF THE INVENTION A person wanting to create a Legacy Card for a future gift fills out an application, which is reviewed by the Legacy Card's software, which scans it for potential problems, such as terms frequently associated with tax evasion, or items for which “gifting” is often problematic.\",\n \"For example, if the software finds the term “patent”, it would notify the Legacy Card employee of this issue.\",\n \"The Legacy Card employee could review the findings and make a risk assessment and then render a judgement on whether there is not a significant problem (positive judgement) or whether there may be a significant enough problem to warrant referring the issue to an outside professional (negative judgement).\",\n \"In the example of a patent issue, the Legacy Card employee could refer this to an intellectual property attorney, who could then counsel the applicant on making sure any maintenance fees were paid such that the gift of a patent would result in the gift of a valid patent.\",\n \"When the Legacy Card employee refers out a matter to an outside professional, the Legacy Card employee will take the advice rendered by the outside professional and use that to update the searching software, such that the ability of Legacy Card to ferret out problems at an early stage becomes better and better over time.\",\n \"FIG.\",\n \"1 is a general flowchart of the invention according to a preferred form of the invention.\",\n \"The general goal of the card and the use of the card is to create a personal archive that can become active at a later date to the benefit of another person.\",\n \"The invention proceeds as follows.\",\n \"A user of the invention (1, 11, 22) decides to leave some sort of legacy (10, 20, 31) to another person—the “Recipient” (4, 14, 25) or “Beneficiary(ies)” (5, 15, 26)—and begins by purchasing a “Moment Capsule” or “Moment” (2, 12, 23) from the company that owns the invention or licenses rights to it “the company”.\",\n \"The user receives a software prompt asking if there is any at legal risk content being created (3,13, 24) if yes, user is provided the appropriate contact info or advisement and reminded of terms of use.\",\n \"If no, user may continue to next step.\",\n \"The user (1, 11, 22) then, through the company's online platform (2, 12, 23), creates the “moment” (3, 13, 24) and the moment is stored by the company in electronic format (8, 18, 29).\",\n \"Storing data in electronic format is well known in the industry and this invention includes embodiments using any of the currently available data storage means and methods to create and store these moments.\",\n \"An algorithm is applied to the user creator content to assess risk and provided with a risk score, in cases where risk-score is mid or high a pathway of Levels is employed where specific subject matters are introduced for further guidance on how to proceed legally (3, 13,24).\",\n \"The original designee of the Moment is called the Recipient (4, 14, 25), but the user (1, 11, 22) of the invention can designate additional or alternate beneficiaries (5, 15, 26) as well.\",\n \"Indeed, the invention also contemplates that the original Recipient (4, 14, 25) can even name additional Recipients (4, 14, 25) and/or Beneficiaries (5, 15, 26).\",\n \"To simplify the use of the legacy card (10, 20, 31), all those who are in line to receive a Moment (6, 16, 27) will be referred to as Recipients (4, 14, 25) and Beneficiary(ies) (5, 15, 26) The “Moment” can be basically anything, ranging from a letter or other personal communication not limited to images and video to a gift or bequest (3, 13, 24) not withstanding any legal risks.\",\n \"The moment can be set to be given to the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) at a certain date “To Tom on his 21st birthday” or to be triggered by a certain event “Should Tom marry and have a child, this moment shall trigger on his first child's first birthday” (8, 18, 29).\",\n \"The Moment is not only stored online on the company's database (6, 16, 27), but also sent to the recipient (4, 14, 25) and/or beneficiary(ies) (5, 15, 26), or to some person (such as an estate planning attorney) (32) or entity (such as a bank or trust holder) (21) that has been designated to oversee gifts and other interactions with recipients (4, 14, 25) and beneficiary(ies) (5, 15, 26).\",\n \"Depending on the user's desire (1, 11, 22), the user (1, 11, 22) and even recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) may have the option to create (3, 13, 24), review (7, 17, 28), search (6, 16, 27), notify for viewing (8, 18, 29), and store Moment Capsules on the platform (6, 16, 27).\",\n \"The company owning or using this invention (6, 21, 32) provides an online platform where, after the user purchases the Moment Capsule (2, 12, 23), the user (1, 11, 22) can create the moment in a number of ways (3, 13, 24).\",\n \"First, the user (1, 11, 22) can choose from a variety of templates, frameworks and designs supplied by the company and type directly onto the template and/or upload pictures, images, video and other documents (3, 13, 24).\",\n \"Second, the user (1, 11, 22) can personally create the Moment “offline” and then upload the entire moment onto the company's server (3, 13, 24).\",\n \"Third, the user (1, 11, 22) can cooperate with other people to jointly create a grouping of Moments—either offline to be later loaded onto the company's server, or jointly created on the company's templates (3, 13, 24).\",\n \"No matter how the Moment is created, the user(s) (1, 11, 22) can select from a variety of fonts, sizes, colors, clip art, upload other content in other formats, and other known elements in word processing, graphic design, and video production software (3, 13, 24).\",\n \"The company has a variety of means, such as docketing software, to “seal” the Moment into a Moment Capsule, which is then scheduled for release (8, 18, 29) to the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) at some date in the future (8, 18, 29).\",\n \"As previously mentioned, the future date could be a set date (“Jan.\",\n \"1, 2025”), such as a certain future date, a birthday, an anniversary, or some other special occasion with a fixed, certain date (8, 18, 29).\",\n \"The date could also be an open-ended future date contingent upon a certain event (“10 years from the day I die”), or a future date contingency upon an uncertain occurrence or occurrence (“10 years from the day I die or the date that Tom marries and has his first child, whichever occurs first”) (8, 18, 29).\",\n \"The Moment Capsule could also be scheduled to be delivered upon random events, and could be delivered in staggered stages as well (8, 18, 29).\",\n \"The role of an estate planner (FIG.\",\n \"3) comes into play here to avoid the dreaded Rule Against Perpetuities and other estate planning problems.\",\n \"Users (1, 11, 22) will work with the company to add recipients (4,14, 25) and beneficiaries (5, 15, 26) for future notification of the Moments (8, 18, 29).\",\n \"The company will store, for perpetuity, the Moments in Moment Capsules which can be read/re-read/shared (6, 16, 27) by both the recipients (4, 14, 25) and beneficiaries (5, 15, 26), and for their future generations (6, 16, 27).\",\n \"The Moment Capsules will be stored on a redundant cloud database for perpetuity, with multiple backups in case of failure of one database (8, 18, 29).\",\n \"Should one of more of the companies storing the Moment Capsules go out of business, the company could contract with an estate planning attorney (32), bank, (21) or other trust holder (21) for that person/organization to step in an either transfer the Moment Capsules to another company, or take over the trust obligations personally.\",\n \"Turning to the actual legacy card itself (10, 20, 31, FIG.\",\n \"5), the invention contemplates a physical card (35, 36).\",\n \"In a preferred embodiment, the card is the approximate size and shape as a credit card or gift card, but other sizes and shapes are contemplated (FIG.\",\n \"5).\",\n \"One preferred embodiment calls for the card to be made of plastic, the approximate length, width and height of a credit card, and to have a unique watermark such as a Holokote watermark of the company on it (35, 36).\",\n \"However, it should be stressed that there are no limits to the material make-up of the card and can therefore be made of any physical material as contemplated.\",\n \"The company then creates a “Words in Waiting” card with a unique identification indicia, such as a number, a scan code, a QR code, or some other known means of personalizing a card (9, 19, 30, FIG.\",\n \"4, 33, 34).\",\n \"The Words in Waiting card (33,34) serves as physical reminder that the Moments exist on company's database in Moment Capsules (6, 16, 27), and that at least one of these Moment Capsules has been designated for that particular recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) (multiple recipients are also contemplate, but for sake of simplicity, we are using one recipient for these examples).\",\n \"The physical “card” is created by the company upon finalization and sealing of each Moment Capsule (9, 19, 30, FIG.\",\n \"4, 33, 34).\",\n \"Users of the invention (1, 11, 22) will also have the option of ordering a “Legacy Card” from the company (10, 20, 31, FIG.\",\n \"5).\",\n \"The Legacy Card (10, 20, 31, FIG.\",\n \"5) will serve as a sort of will/trust card giving notice that Moments from this user exists on the company's database (6, 16, 27), and that Moments will be triggered on a certain date (8, 18, 29).\",\n \"An estate planning attorney (32) or Bank (21) or other trust holder (21) can work with the company to assist in transferring any property or items designated in the Moment Capsule to the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26).\",\n \"The Legacy Card (10, 20, 31, FIG.\",\n \"5) will have personal identifiable data and the master customer identification to link all Moment Capsules created by the user (35, 36).\",\n \"The company's database (6, 16, 27) also has means to link all Moment Capsules directed toward a particular recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26).\",\n \"Users (1, 11, 22) will also have the option of ordering a “hard copy” version of the Moment (FIG.\",\n \"6) to send on the specified date or event (with postal mail timing variations) (8, 18, 29) at an incremental cost to a recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26).\",\n \"Users (1, 11, 22) may also order a hard copy of the Moment to be delivered to them for safe storage as well (FIG.\",\n \"6, 37, 38).\",\n \"Should the user (1, 11, 22) order a hard copy, the hard copy of the Moment will be physically mailed to the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) upon the triggering date (8, 18, 29) printed in paper and sealed in wax (FIG.\",\n \"6, 37, 38).\",\n \"Other means of making the physical delivery of the Moment more ceremonial, such as messenger delivery, drone delivery, or having the moment delivered to a recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) place of work, etc.\",\n \"are contemplated.\",\n \"Again, while one preferred embodiment of the invention is used for purposes of illustration, there are no limits to the material make-up of the “hard copy” and can therefore be made of any physical material and delivered by any means to the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) as contemplated.\",\n \"Once the user (1, 11, 22) seals up the Moment in a Moment Capsule (3, 13, 24), the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) can, at the option of the user (1, 11, 22), be notified that a Moment for his/her benefit has been created (8, 18, 29).\",\n \"The personal identification of the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26), such as address, phone number, email address, is provided by the user (1, 11, 22).\",\n \"It is highly advised that the user (1, 11, 22) agree to have the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) notified, as this will give notice that a Moment is waiting for him/her, and give the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) an incentive to keep the company notified of changes in address, phone number, email address, etc.\",\n \"User recipients (4,14, 25) and beneficiary(ies) contact info will be advised/validated by the Wax & Seal Team, and/or Bank or other Trust Holder, Estate Planning Attorney at routine passing of time in order to maintain the latest and relevant contact info.\",\n \"The user (1, 11, 22), the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) can set reminder preferences with the company to request any other news relating to Words in Waiting (9, 19, 30, FIG.\",\n \"4), Moments (6, 16, 27) and other notifications (8, 18, 29).\",\n \"Recipients (4, 14, 25) and Beneficiary(ies) (5, 15, 26) will have the option to order from the company a more formalized copy of the Words in Waiting (9, 19, 30, FIG.\",\n \"4)/Moments (6, 16, 27), such as framed versions, photo books, and other known uses of memorializing events, however the items described are merely for purposes of illustration and not intended to be limiting in any manner—there are no limits to the material make-up of the Moment and can therefore be made of any physical material as contemplated.\",\n \"Benefits to the user (1, 11, 22) of this invention are considerable.\",\n \"First, because the Moment Capsules are sold on an “as needed” basis, there are not ongoing subscription costs, and no need for a user to put a credit card on file with the company (2, 12, 23).\",\n \"Second, because the company provides a physical card (FIG.\",\n \"4, 33, 34, FIG.\",\n \"5, 35, 36) with each Moment Capsule and binds all created Moment Capsules to a Legacy card (FIG.\",\n \"5, 35, 36), there is less chance that the Moment will be lost in time and no one will remember to activate it (6, 16, 27).\",\n \"An additional component of the invention can offer a subscription model as an option in the future based on demand.\",\n \"FIG.\",\n \"2 is a flowchart showing how a bank or other trust holder could participate in the legacy process.\",\n \"In this example, the user (11) of the invention uses a bank (21) or other trust holder (21) to hold any physical or financial aspects of the Moment, such that once the triggering event or date is reached (18), the bank (21) or other trust holder (21) “breaks open” the Moment Capsule and delivers its contents (16) to the recipient (14) and beneficiary(ies) (15).\",\n \"The bank (21) or other trust holder (21) is kept abreast of the issues and events surrounding this particular Moment through the Words in Waiting card (19, FIG.\",\n \"4, 33, 34) and the Legacy Card (20, FIG.\",\n \"5, 35, 36) which will permit it access to the company's database (16) with respect to this particular Moment and Moment Capsule (16).\",\n \"FIG.\",\n \"3 is a flowchart showing how an estate planning attorney could participate in the legacy process.\",\n \"In this flowchart, an estate planning attorney (32) is used to assist in the designation of assets to be transferred from a user (22) to a recipient (25) and beneficiary(ies) (26), and in the actual release of the assets to the recipient (25) and beneficiary(ies) (26) upon the opening of the Moment Capsule as triggered by a specific date or event (29) FIG.\",\n \"4 is an example of a “Words in Waiting” card.\",\n \"On this card, the personalized message that provides a brief indication as to what is stored from the user (FIG.\",\n \"4, 33, 34) to the recipient (4, 14, 25) and beneficiary(ies) (5, 15, 26) is displayed.\",\n \"FIG.\",\n \"5 is an example of a “Legacy” card.\",\n \"The Legacy card displays the unique identification (FIG.\",\n \"5, 35, 36) for this user (1, 11, 22) and all Moments created.\",\n \"The user can set preferences as to how Moment content will be reviewed by a named Executor (35, 36, 10, 20, 31, 6, 16, 27).\",\n \"For example, the user (1, 11, 22) can decide that he/she would want the Executor (FIG.\",\n \"5, 35, 36) to have knowledge of the Moments and recipients (4, 14, 25) and beneficiary(ies) (5, 15, 26) but may not want content divulged.\",\n \"The user can set preferences in a number of different ways as to the release of the Moment content (6, 16, 27).\",\n \"Executors (10, 20, 31) contact info will be advised/validated by the Wax & Seal Team and/or Bank or other Trust Holder, Estate Planning Attorney at routine passing of time in order to maintain the latest and relevant contact info.\",\n \"FIG.\",\n \"6 is an example of a “hard copy” Moment being delivered under wax and seal (37, 38) It should be understood that while the preferred embodiments of the invention are described in some detail herein, the present disclosure is made by way of example only and that variations and changes thereto are possible without departing from the subject matter coming within the scope of the following claims, and a reasonable equivalency thereof, which claims I regard as my invention.\",\n \"All of the material in this patent document is subject to copyright protection under the copyright laws of the United States and other countries.\",\n \"The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in official governmental records but, otherwise, all other copyright rights whatsoever are reserved.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870909"}}},{"rowIdx":4493675,"cells":{"text":{"kind":"list like","value":[["Takedown Assembly For Assault Rifle","The present invention is directed toward a firearm takedown assembly.","The preferred embodiment of the firearm takedown assembly comprises a docking plate configured to be removably secured to a firearm and a lever pivotably attached to the docking plate.","The assembly may further comprise a pivot pin, wherein the lever is connected to the pivot pin.","The lever is utilized to remove a takedown pin from the upper and lower receiver of the firearm so that a user may quickly disassembly the firearm.","When the user desires to reassembly the user may thumb the lever to reinsert the takedown pin into the upper and lower receiver."],["1) A firearm comprising a) a lower receiver; b) an upper receiver; c) a lever pivotably attached to a portion of said firearm; d) a takedown pin attached to an end of said lever, wherein said take down pin is configured to secure said lower receiver to said upper receiver; e) wherein said lever is configured to alternate said takedown pin from a closed position wherein said takedown pin is engaged with said lower receiver and upper receiver and an open position wherein said takedown pin is disengaged from said lower receiver and upper receiver.","2) The firearm as in claim 1 wherein said lever is pivotably attached to said lower receiver.","3) The firearm as in claim 1 wherein said lever is pivotably attached to said upper receiver.","4) The firearm as in claim 1 further comprising a docking plate removably secured to a portion of said firearm and wherein said lever is pivotably attached to said docking plate.","5) The firearm as in claim 4 further comprising a pivot pin attached to said docking plate and said lever.","6) The firearm as in claim 5 wherein said docking plate further comprises a central aperture for mounting said docking plate on a buffer tube of said firearm and wherein said docking plate is mounted on said firearm.","7) A firearm comprising a) a lower receiver; b) an upper receiver; and c) an accessory comprising a lever pivotably attached to an external surface of said firearm, said lever having a first end and a second end, wherein when said lever is utilized on said firearm said first end of said lever is connected to a takedown pin, wherein said takedown pin is configured to secure a portion of said upper receiver to a portion of said lower receiver.","8) The firearm as in claim 7 wherein said accessory is attached to a portion of said upper receiver.","9) The firearm as in claim 7 wherein said accessory is attached to a portion of said lower receiver.","10) A method of opening an action of a firearm, said firearm comprising an upper receiver and a lower receiver, said method comprising a) pressing a first end of a lever pivotably attached to an external surface of said firearm in a direction toward said firearm, wherein said second end of said lever is connected to a takedown pin, wherein said takedown pin is configured to secure said upper receiver to said lower receiver, whereby pressing said first end of said lever toward said firearm moves said takedown pin to a disengaged position permitting said upper receiver to at least partially detach from said lower receiver.","11) The method as in claim 10 further comprising at least partially separating said upper receiver from said lower receiver.","12) The method as in claim 11 further comprising fully joining said upper receiver to said lower receiver.","13) The method as in claim 12 further comprising pressing said first end of said lever in a direction away from said firearm, whereby pressing said first end of said lever away from said firearm moves said takedown pin to an engaged position securing said upper receiver to said lower receiver."],[" BACKGROUND OF INVENTION Semi-automatic firearms have been known for a long time.","The first semi-automatic rifle was introduced in 1885.The M-16 automatic rifle has been used by the military for years.","A civilian version of the M-16 is known as the AR-15 and is a semi-automatic rifle.","The AR-15 has been manufactured and sold to civilians for many years.","Standard AR-15 semi-automatic rifles are manufactured and distributed with an upper receiver and a lower receiver.","The upper receiver and lower receiver are normally attached together at two locations by locking pins which pass through holes in the upper receiver and lower receiver.","A locking pin in the front is known as the front takedown pin.","A locking pin in the rear is known as the rear takedown pin.","A user who wants to remove the upper receiver from the lower receiver to clean the internal action of the firearm must first remove the rear takedown pin and front takedown pin to allow access to the action of the firearm.","Alternatively, if the user removes only the rear takedown pin, then the upper receiver can pivot away from the lower receiver with the front takedown pin acting as the pivot point.","Removing only the rear takedown pin allows a user to quickly separate the upper receiver from the lower receiver.","However, this process has its flaws.","A user can accidentally misplace the rear takedown pin.","This would prevent the user from quickly reinserting the rear takedown pin and utilizing the firearm.","What is needed is a firearm accessory which allows a user to remove the rear takedown pin to separate the upper receiver from the lower receiver without needed to completely removing the rear takedown pin from the complete firearm assembly."],[" SUMMARY OF THE INVENTION The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed innovation.","This summary is not an extensive overview, and it is not intended to identify key/critical elements or to delineate the scope thereof.","Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.","The invention is directed toward a firearm takedown assembly.","The firearm takedown assembly comprises a docking plate configured to be removably secured to a firearm and a lever pivotably attached to the docking plate.","The assembly may further comprise a pivot pin, wherein the lever is connected to the pivot pin.","In another embodiment the assembly may further comprise a takedown pin.","The takedown pin further may also comprise a groove extending along at least a portion of the takedown pin.","In another embodiment the docking plate further comprises a central aperture for mounting the docking plate to a rear buffer tube of a firearm.","The docking plate may further comprise one or more protrusions, wherein each of the one or more protrusions has a pivot pin hole for receiving the pivot pin.","In addition the lever may further comprise a pivot plate extending from a side of the lever, the pivot plate having a pivot hole for receiving the pivot pin.","The lever may also further comprise an end aperture disposed at an end of the lever.","In another embodiment the assembly further comprises a spring configured to return the lever to a predetermined position.","In addition the assembly may further comprise one or more screws for attaching the docking plate to the firearm.","The invention is also directed toward a firearm comprising a lower receiver, an upper receiver, a lever pivotably attached to a portion of the firearm, and a takedown pin attached to an end of the lever.","The take down pin is configured to secure the lower receiver to the upper receiver.","The lever is configured to alternate the takedown pin from a closed position wherein the takedown pin is engaged with the lower receiver and upper receiver and an open position wherein the takedown pin is disengaged from the lower receiver and upper receiver.","The firearm may further comprise a docking plate removably secured to a portion of the firearm and wherein the lever is pivotably attached to the docking plate.","In addition the firearm may further comprise a pivot pin attached to the docking plate and the lever.","In another embodiment of the firearm, the docking plate further comprises a central aperture for mounting the docking plate on a buffer tube of the firearm.","The invention is also directed toward a firearm accessory comprising a lever configured to be pivotably attached to an external surface of a firearm, the lever having a first end and a second end, wherein when the lever is utilized on the firearm the first end of the lever is connected to a takedown pin, wherein the takedown pin is configured to secure an upper receiver of a firearm to a lower receiver of a firearm.","The invention is also directed toward a method of opening an action of a firearm, the firearm comprising an upper receiver and a lower receiver, the method comprising pressing a first end of a lever pivotably attached to an external surface of the firearm in a direction toward the firearm, wherein the second end of the lever is connected to a takedown pin, wherein the takedown pin is configured to secure the upper receiver to the lower receiver, whereby pressing the first end of the lever toward the firearm moves the takedown pin to a disengaged position permitting the upper receiver to at least partially detach from the lower receiver.","The method may further comprise at least partially separating the upper receiver from the lower receiver.","The method may further comprise fully joining the upper receiver to the lower receiver.","The method may further comprise pressing the first end of the lever in a direction away from the firearm, whereby pressing the first end of the lever away from the firearm moves the takedown pin to an engaged position securing the upper receiver to the lower receiver.","Still other embodiments of the present invention will become readily apparent to those skilled in this art from the following description wherein there is shown and described the embodiments of this invention, simply by way of illustration of the best modes suited to carry out the invention.","As it will be realized, the invention is capable of other different embodiments and its several details are capable of modifications in various obvious aspects all without departing from the scope of the invention.","Accordingly, the drawing and descriptions will be regarded as illustrative in nature and not as restrictive."],["PRIORITY This application is a continuation of U.S. application Ser.","No.","15/490,943, filed Apr.","19, 2017, the disclosure of which is hereby incorporated by reference.","U.S. application Ser.","No.","15/490,943 claims priority to U.S.","Provisional Patent Application Ser.","No.","62/384,168, filed Sep. 6, 2016, the disclosure of which is hereby incorporated by reference.","FIELD OF THE INVENTION The invention is directed to a firearm accessory and more specifically to a rear mounted takedown assembly for an assault rifle which permits the quick and easy separation and unification of a top receiver and lower receiver of an assault rifle.","BACKGROUND OF INVENTION Semi-automatic firearms have been known for a long time.","The first semi-automatic rifle was introduced in 1885.The M-16 automatic rifle has been used by the military for years.","A civilian version of the M-16 is known as the AR-15 and is a semi-automatic rifle.","The AR-15 has been manufactured and sold to civilians for many years.","Standard AR-15 semi-automatic rifles are manufactured and distributed with an upper receiver and a lower receiver.","The upper receiver and lower receiver are normally attached together at two locations by locking pins which pass through holes in the upper receiver and lower receiver.","A locking pin in the front is known as the front takedown pin.","A locking pin in the rear is known as the rear takedown pin.","A user who wants to remove the upper receiver from the lower receiver to clean the internal action of the firearm must first remove the rear takedown pin and front takedown pin to allow access to the action of the firearm.","Alternatively, if the user removes only the rear takedown pin, then the upper receiver can pivot away from the lower receiver with the front takedown pin acting as the pivot point.","Removing only the rear takedown pin allows a user to quickly separate the upper receiver from the lower receiver.","However, this process has its flaws.","A user can accidentally misplace the rear takedown pin.","This would prevent the user from quickly reinserting the rear takedown pin and utilizing the firearm.","What is needed is a firearm accessory which allows a user to remove the rear takedown pin to separate the upper receiver from the lower receiver without needed to completely removing the rear takedown pin from the complete firearm assembly.","SUMMARY OF THE INVENTION The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed innovation.","This summary is not an extensive overview, and it is not intended to identify key/critical elements or to delineate the scope thereof.","Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.","The invention is directed toward a firearm takedown assembly.","The firearm takedown assembly comprises a docking plate configured to be removably secured to a firearm and a lever pivotably attached to the docking plate.","The assembly may further comprise a pivot pin, wherein the lever is connected to the pivot pin.","In another embodiment the assembly may further comprise a takedown pin.","The takedown pin further may also comprise a groove extending along at least a portion of the takedown pin.","In another embodiment the docking plate further comprises a central aperture for mounting the docking plate to a rear buffer tube of a firearm.","The docking plate may further comprise one or more protrusions, wherein each of the one or more protrusions has a pivot pin hole for receiving the pivot pin.","In addition the lever may further comprise a pivot plate extending from a side of the lever, the pivot plate having a pivot hole for receiving the pivot pin.","The lever may also further comprise an end aperture disposed at an end of the lever.","In another embodiment the assembly further comprises a spring configured to return the lever to a predetermined position.","In addition the assembly may further comprise one or more screws for attaching the docking plate to the firearm.","The invention is also directed toward a firearm comprising a lower receiver, an upper receiver, a lever pivotably attached to a portion of the firearm, and a takedown pin attached to an end of the lever.","The take down pin is configured to secure the lower receiver to the upper receiver.","The lever is configured to alternate the takedown pin from a closed position wherein the takedown pin is engaged with the lower receiver and upper receiver and an open position wherein the takedown pin is disengaged from the lower receiver and upper receiver.","The firearm may further comprise a docking plate removably secured to a portion of the firearm and wherein the lever is pivotably attached to the docking plate.","In addition the firearm may further comprise a pivot pin attached to the docking plate and the lever.","In another embodiment of the firearm, the docking plate further comprises a central aperture for mounting the docking plate on a buffer tube of the firearm.","The invention is also directed toward a firearm accessory comprising a lever configured to be pivotably attached to an external surface of a firearm, the lever having a first end and a second end, wherein when the lever is utilized on the firearm the first end of the lever is connected to a takedown pin, wherein the takedown pin is configured to secure an upper receiver of a firearm to a lower receiver of a firearm.","The invention is also directed toward a method of opening an action of a firearm, the firearm comprising an upper receiver and a lower receiver, the method comprising pressing a first end of a lever pivotably attached to an external surface of the firearm in a direction toward the firearm, wherein the second end of the lever is connected to a takedown pin, wherein the takedown pin is configured to secure the upper receiver to the lower receiver, whereby pressing the first end of the lever toward the firearm moves the takedown pin to a disengaged position permitting the upper receiver to at least partially detach from the lower receiver.","The method may further comprise at least partially separating the upper receiver from the lower receiver.","The method may further comprise fully joining the upper receiver to the lower receiver.","The method may further comprise pressing the first end of the lever in a direction away from the firearm, whereby pressing the first end of the lever away from the firearm moves the takedown pin to an engaged position securing the upper receiver to the lower receiver.","Still other embodiments of the present invention will become readily apparent to those skilled in this art from the following description wherein there is shown and described the embodiments of this invention, simply by way of illustration of the best modes suited to carry out the invention.","As it will be realized, the invention is capable of other different embodiments and its several details are capable of modifications in various obvious aspects all without departing from the scope of the invention.","Accordingly, the drawing and descriptions will be regarded as illustrative in nature and not as restrictive.","BRIEF DESCRIPTION OF THE DRAWINGS Various exemplary embodiments of this invention will be described in detail, wherein like reference numerals refer to identical or similar components, with reference to the following figures, wherein: FIG.","1A is a top right perspective view of the rear takedown assembly; FIG.","1B is a bottom right perspective view thereof; FIG.","1C is a is a right plan view thereof; FIG.","1D is a left plan view thereof; FIG.","1E is a front plan view thereof; FIG.","1F is a bottom plan view thereof; FIG.","2 is a front exploded view thereof; FIG.","3 is a bottom right perspective exploded view thereof; FIG.","4 is a top right perspective exploded view thereof; FIG.","5 is a top left perspective exploded view thereof; FIG.","6 is a bottom left perspective exploded view thereof; FIG.","7 is a top right perspective view of the rear takedown assembly mounted on a lower receiver; FIG.","8 is a front plan view thereof; FIG.","9 is a right plan view thereof; FIG.","10A is a top plan view of the preferred embodiment of the pin; FIG.","10B is a side plan view thereof; and FIG.","10C is a top perspective view thereof.","DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT The claimed subject matter is now described with reference to the drawings.","In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the claimed subject matter.","It may be evident, however, that the claimed subject matter may be practiced with or without any combination of these specific details, without departing from the spirit and scope of this invention and the claims.","Referring to FIG.","1A-FIG.","6, the preferred embodiment of the invention is displayed.","The invention is directed toward a rear mounted takedown assembly 100.The takedown assembly 100 may come in any configuration which permits a rear takedown pin to be removed and reinserted into the upper and lower receiver of the firearm.","In the preferred embodiment the takedown assembly 100 comprises a docking plate 110, a lever 120, a pivot pin 130, and a takedown pin 140.Referring to FIGS.","3-6, the separate components of the takedown assembly 100 are illustrated in detail.","The docking plate 110 is a mounting unit configured to mount the takedown assembly 100 onto the firearm.","The docking plate 110 may be in any configuration permitting the takedown assembly 100 to be mounted onto the firearm.","In the preferred embodiment, the docking plate 110 has a central aperture 112.The central aperture 112 is configured to receive a buffer tube from a firearm.","The central aperture 112 is preferably circular in shape but may be any size and shape.","The central aperture 112 may have one or more protrusions extending into central aperture 112 to keep the docking plate 110 fixed onto the buffer tube and prevent the docking plate 110 from rotating about the buffer tube.","In other embodiments the docking plate 110 may not have a central aperture 112 and instead be attached directly to the upper receiver or directly to the lower receiver by a known means, such as with screws or adhesive.","In this way the docking assembly 100 may stay attached to either the upper receiver or lower receiver when the upper receiver is separated from the lower receiver.","In the preferred embodiment, the docking plate 110 may also have a slot 116.The slot 116 traverses the docking plate 110 horizontally.","The slot 116 is formed by two protrusions extending outward from the plane of the docking plate 110.In other embodiments there may be only one protrusion extending from the docking plate 100.The protrusions forming the slot 116 permit the lever 120 to be attached to the docking plate 110.Extending vertically through the protrusions is a pivot pin hole 114.The pivot pin hole 114 is configured to receive the pivot pin 130.The lever 120 is an elongated arm.","The lever 120 may be in any size and shape.","In the preferred embodiment the lever 120 has a pivot plate 122.The pivot plate 122 is configured to fit within the slot 116 of the docking plate 110.If the docking plate 110 does not have a slot 116 then the pivot plate 122 abuts the protrusion of the docking plate 110.In the preferred embodiment the pivot plate 122 has a pivot pin hole 124 configured to receive the pivot pin 130.The lever 120 also has an end aperture 126.The end aperture 126 is configured to receive the takedown pin 140.The pivot pin 130 may be any size and shape.","In the preferred embodiment the pivot pin 130 is a long cylindrical member.","The pivot pin 130 may also have a flange 132 disposed at one end of the pivot pin 130.The pivot pin 130 may have threading about the end of the pivot pin 130 distal from the flange 132.The pivot pin 130 is configured to pass through the pivot pin hole 124 of the lever 120 and the pivot pin hole 114 of the docking plate 110.The pivot pin 130 thus attaches the lever 120 to the docking plate 110.The lever 120 then pivots back and forth about the pivot pin 130.The takedown pin 140 may be any size and shape.","In the preferred embodiment the takedown pin 140 is an elongated cylindrical member.","In one embodiment the takedown pin 140 is a standard OEM style of takedown pin.","The takedown pin 140 has a flange 144.The body of the takedown pin 140 fits through the end aperture 126 of the lever 120 and extends into rear takedown pin holes of the upper and lower receiver.","In the preferred embodiment illustrated the takedown pin 140 has a groove 142.The groove 142 is configured to receive a detent pin in the lower receiver.","Referring to FIGS.","7-9, the takedown assembly 100 is mounted on the lower receiver 200.The takedown assembly 100 is mounted on a rear section of the lower receiver 200.In other embodiments the takedown assembly is mounted on the upper receiver of the firearm.","The invention is also directed toward a method for retrofitting an existing firearm with the takedown assembly 100.First the user removed the OEM takedown pin.","Next the user mounts the takedown assembly 100 to the lower receiver or the upper receiver of the firearm.","The user may mount the takedown assembly 100 by screwing the takedown assembly 100 to the firearm, using adhesive to attach the takedown assembly 100 to the firearm, or sliding the buffer tube through the central aperture 112 of the docking plate 110.The user then inserts the takedown pin 140 of the takedown assembly 100 into the receiver holes in the upper and lower receiver.","If the user decides to use the OEM takedown pin then the user can insert the OEM takedown pin into the end aperture 126 of the lever 120.To utilize the invention after it is installed the user pushed on the end of the lever 120 distal from the takedown pin 140.The lever 120 pivots about the pivot pin 130, moving the proximal end of the lever 120 away from the firearm.","The movement of the proximal end of the lever 120 pulls the takedown pin 140 out of the receiver holes in the upper and lower receiver.","The user can then rotate the upper receiver away from the lower receiver.","The user may rotate the upper receiver a large distance away from the lower receiver or only a small distance.","When the user is ready to fire the firearm again, the user rotates the upper receiver back in place against the lower receiver.","The user then pushes the distal end of the lever 120 outward and away from the firearm.","The lever 120 pivots about the pivot pin 130, causing the proximal end of the lever 120 to move towards the firearm.","As the proximal end of the lever 120 moves towards the firearm, the lever 120 pushes the takedown pin 140 back into place into the receiver holes in the upper and lower receiver.","The firearm action is now closed and locked together and the user may fire the firearm.","The takedown assembly may have additional components which enhance the functionality of the takedown assembly.","For instance, the takedown assembly may have a spring attached between the lever 120 and the docking plate 110 which automatically causes the lever 120 to return to the closed position where the takedown pin 140 is engaged with the upper receiver and lower receiver.","The spring may also be disposed around the pivot pin 130 with one end of the spring pushing against a portion of the lever 120 and the other end of the spring pushing against the docking plate 110.In another embodiment of the invention the takedown pin 140 is an extension protruding from the end of the lever 120 such that the lever 120 and takedown pin 140 are one coformed component.","In another embodiment of the invention the assembly may not have a docking plate 110.In this embodiment the lever 120 is directly attached to either the upper receiver or the lower receiver 200.This embodiment of the invention would be best utilized as part of an OEM component attached to a firearm sold from a manufacturer rather than an assembly for retrofitting a previously manufactured firearm.","The lever 120 may be directly connected to any surface of the firearm or may be mounted on one or more components which are themselves attached to the surface of the firearm.","The takedown assembly 100 may be made from any type of material such as metal or polymer.","In the preferred embodiment the takedown pin 140 is made from a polyoxymethylene, a thermoplastic which was developed for high stiffness and low friction.","This material is known by a variety of tradenames such as Delrin, Celcon, Ramtal, Duracon, Kepital, and Hostaform.","The polyoxymethylene is a low friction and self-lubricating material which enhances the functionality of the takedown pin 140.As a metal takedown pin 140 is moved in and out of the receiver holes of the upper receiver and lower receiver, the takedown pin becomes worn and friction between the takedown pin 140 and the receivers can cause the takedown pin 140 to become stuck or difficult to remove.","Lubricants such as gun oil can help solve this problem but lubricants are short lived and can eventually wear away—providing only a short term solution to the problem.","The use of polyoxymethylene solves this solution by allowing the takedown pin 140 to have an inherently lower amount of friction against the receivers.","Also, as the takedown pin 140 is moved against the receivers, the polyoxymethylene releases a small amount of lubricant from the material, providing a long term solution to the problem of sticking.","In addition the use of polyoxymethylene protects the upper receiver and lower receiver.","This is because the hole holding the takedown pin can wear down and break from overuse if the takedown pin is made of metal and is removed and inserted repeatedly.","The invention may be utilized for any takedown pin.","The preferred embodiment of the invention is utilized to remove and insert a rear takedown pin.","However, the same invention may be utilized to remove and insert a front takedown pin as well.","The invention may be used on either the rear takedown pin or the front takedown pin, or on both takedown pins simultaneously.","Referring to FIGS.","10A-C, the preferred embodiment of the takedown pin 140 is illustrated.","In the preferred embodiment of the takedown pin 140, the takedown pin 140 has a flange 144 and a groove 142.The flange 144 provides an external surface of the takedown pin 140 for a user to grab and remove the takedown pin 140 if the user desires.","The flange 144 also provides a connection point for the lever 120 to remove the takedown pin 140 from the lower receiver 200.The groove 142 may be any depth and shape.","A detent pin from the lower receiver (not shown) is disposed within the groove 142 which prevents the takedown pin 140 from being fully removed from the receivers.","In the preferred embodiment the outer end of the groove 140 has an outer recess 146.The outer recess 146 is a depression further into the groove 142 which holds the detent pin and prevents the takedown pin 140 from unintentionally being removed from the receivers.","The inner end of the groove 142 has an inner recess 148.As illustrated in the preferred embodiment, the inner recess 148 has a triangular shape which operates as a ramp for the detent pin.","The ramp shape of the inner recess 148 ensures that the detent pin does not hold the takedown pin 140 in an unengaged position.","The ramp shape ensures that the takedown pin 140 is easily reinserted into the upper receiver and lower receiver when the user desires to reattach the upper receiver and lower receiver.","In the preferred embodiment, the detent pin cannot get stuck at the inner recess 148 but slides upward along the ramp through the groove 142 to the outer recess 146.Other embodiments to the invention are possible without departing from the spirit of the invention.","For instance, the invention may utilize a single lever 120 and single takedown pin 140 entering from one side of the firearm.","In other embodiments of the invention there may be a lever 120 on each side of the firearm, with each lever having a takedown pin 140 inserted into the firearm.","In other embodiments the lever 120 is connected to a connection unit which holds the takedown pin 140 rather than being connected directly to the takedown pin 140.What has been described above includes examples of the claimed subject matter.","It is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing the claimed subject matter, but one of ordinary skill in the art can recognize that many further combinations and permutations of such matter are possible.","Accordingly, the claimed subject matter is intended to embrace all such alterations, modifications and variations that fall within the spirit and scope of the appended claims.","Furthermore, to the extent that the term “includes” is used in either the detailed description or the claims, such term is intended to be inclusive in a manner similar to the term “comprising” as “comprising” is interpreted when employed as a transitional word in a claim.","The foregoing method descriptions and the process flow diagrams are provided merely as illustrative examples and are not intended to require or imply that the steps of the various embodiments must be performed in the order presented.","As will be appreciated by one of skill in the art the order of steps in the foregoing embodiments may be performed in any order.","Words such as “thereafter,” “then,” “next,” etc.","are not intended to limit the order of the steps; these words are simply used to guide the reader through the description of the methods.","Further, any reference to claim elements in the singular, for example, using the articles “a,” “an” or “the” is not to be construed as limiting the element to the singular.","The preceding description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention.","Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention.","Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the following claims and the principles and novel features disclosed herein."]],"string":"[\n [\n \"Takedown Assembly For Assault Rifle\",\n \"The present invention is directed toward a firearm takedown assembly.\",\n \"The preferred embodiment of the firearm takedown assembly comprises a docking plate configured to be removably secured to a firearm and a lever pivotably attached to the docking plate.\",\n \"The assembly may further comprise a pivot pin, wherein the lever is connected to the pivot pin.\",\n \"The lever is utilized to remove a takedown pin from the upper and lower receiver of the firearm so that a user may quickly disassembly the firearm.\",\n \"When the user desires to reassembly the user may thumb the lever to reinsert the takedown pin into the upper and lower receiver.\"\n ],\n [\n \"1) A firearm comprising a) a lower receiver; b) an upper receiver; c) a lever pivotably attached to a portion of said firearm; d) a takedown pin attached to an end of said lever, wherein said take down pin is configured to secure said lower receiver to said upper receiver; e) wherein said lever is configured to alternate said takedown pin from a closed position wherein said takedown pin is engaged with said lower receiver and upper receiver and an open position wherein said takedown pin is disengaged from said lower receiver and upper receiver.\",\n \"2) The firearm as in claim 1 wherein said lever is pivotably attached to said lower receiver.\",\n \"3) The firearm as in claim 1 wherein said lever is pivotably attached to said upper receiver.\",\n \"4) The firearm as in claim 1 further comprising a docking plate removably secured to a portion of said firearm and wherein said lever is pivotably attached to said docking plate.\",\n \"5) The firearm as in claim 4 further comprising a pivot pin attached to said docking plate and said lever.\",\n \"6) The firearm as in claim 5 wherein said docking plate further comprises a central aperture for mounting said docking plate on a buffer tube of said firearm and wherein said docking plate is mounted on said firearm.\",\n \"7) A firearm comprising a) a lower receiver; b) an upper receiver; and c) an accessory comprising a lever pivotably attached to an external surface of said firearm, said lever having a first end and a second end, wherein when said lever is utilized on said firearm said first end of said lever is connected to a takedown pin, wherein said takedown pin is configured to secure a portion of said upper receiver to a portion of said lower receiver.\",\n \"8) The firearm as in claim 7 wherein said accessory is attached to a portion of said upper receiver.\",\n \"9) The firearm as in claim 7 wherein said accessory is attached to a portion of said lower receiver.\",\n \"10) A method of opening an action of a firearm, said firearm comprising an upper receiver and a lower receiver, said method comprising a) pressing a first end of a lever pivotably attached to an external surface of said firearm in a direction toward said firearm, wherein said second end of said lever is connected to a takedown pin, wherein said takedown pin is configured to secure said upper receiver to said lower receiver, whereby pressing said first end of said lever toward said firearm moves said takedown pin to a disengaged position permitting said upper receiver to at least partially detach from said lower receiver.\",\n \"11) The method as in claim 10 further comprising at least partially separating said upper receiver from said lower receiver.\",\n \"12) The method as in claim 11 further comprising fully joining said upper receiver to said lower receiver.\",\n \"13) The method as in claim 12 further comprising pressing said first end of said lever in a direction away from said firearm, whereby pressing said first end of said lever away from said firearm moves said takedown pin to an engaged position securing said upper receiver to said lower receiver.\"\n ],\n [\n \" BACKGROUND OF INVENTION Semi-automatic firearms have been known for a long time.\",\n \"The first semi-automatic rifle was introduced in 1885.The M-16 automatic rifle has been used by the military for years.\",\n \"A civilian version of the M-16 is known as the AR-15 and is a semi-automatic rifle.\",\n \"The AR-15 has been manufactured and sold to civilians for many years.\",\n \"Standard AR-15 semi-automatic rifles are manufactured and distributed with an upper receiver and a lower receiver.\",\n \"The upper receiver and lower receiver are normally attached together at two locations by locking pins which pass through holes in the upper receiver and lower receiver.\",\n \"A locking pin in the front is known as the front takedown pin.\",\n \"A locking pin in the rear is known as the rear takedown pin.\",\n \"A user who wants to remove the upper receiver from the lower receiver to clean the internal action of the firearm must first remove the rear takedown pin and front takedown pin to allow access to the action of the firearm.\",\n \"Alternatively, if the user removes only the rear takedown pin, then the upper receiver can pivot away from the lower receiver with the front takedown pin acting as the pivot point.\",\n \"Removing only the rear takedown pin allows a user to quickly separate the upper receiver from the lower receiver.\",\n \"However, this process has its flaws.\",\n \"A user can accidentally misplace the rear takedown pin.\",\n \"This would prevent the user from quickly reinserting the rear takedown pin and utilizing the firearm.\",\n \"What is needed is a firearm accessory which allows a user to remove the rear takedown pin to separate the upper receiver from the lower receiver without needed to completely removing the rear takedown pin from the complete firearm assembly.\"\n ],\n [\n \" SUMMARY OF THE INVENTION The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed innovation.\",\n \"This summary is not an extensive overview, and it is not intended to identify key/critical elements or to delineate the scope thereof.\",\n \"Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.\",\n \"The invention is directed toward a firearm takedown assembly.\",\n \"The firearm takedown assembly comprises a docking plate configured to be removably secured to a firearm and a lever pivotably attached to the docking plate.\",\n \"The assembly may further comprise a pivot pin, wherein the lever is connected to the pivot pin.\",\n \"In another embodiment the assembly may further comprise a takedown pin.\",\n \"The takedown pin further may also comprise a groove extending along at least a portion of the takedown pin.\",\n \"In another embodiment the docking plate further comprises a central aperture for mounting the docking plate to a rear buffer tube of a firearm.\",\n \"The docking plate may further comprise one or more protrusions, wherein each of the one or more protrusions has a pivot pin hole for receiving the pivot pin.\",\n \"In addition the lever may further comprise a pivot plate extending from a side of the lever, the pivot plate having a pivot hole for receiving the pivot pin.\",\n \"The lever may also further comprise an end aperture disposed at an end of the lever.\",\n \"In another embodiment the assembly further comprises a spring configured to return the lever to a predetermined position.\",\n \"In addition the assembly may further comprise one or more screws for attaching the docking plate to the firearm.\",\n \"The invention is also directed toward a firearm comprising a lower receiver, an upper receiver, a lever pivotably attached to a portion of the firearm, and a takedown pin attached to an end of the lever.\",\n \"The take down pin is configured to secure the lower receiver to the upper receiver.\",\n \"The lever is configured to alternate the takedown pin from a closed position wherein the takedown pin is engaged with the lower receiver and upper receiver and an open position wherein the takedown pin is disengaged from the lower receiver and upper receiver.\",\n \"The firearm may further comprise a docking plate removably secured to a portion of the firearm and wherein the lever is pivotably attached to the docking plate.\",\n \"In addition the firearm may further comprise a pivot pin attached to the docking plate and the lever.\",\n \"In another embodiment of the firearm, the docking plate further comprises a central aperture for mounting the docking plate on a buffer tube of the firearm.\",\n \"The invention is also directed toward a firearm accessory comprising a lever configured to be pivotably attached to an external surface of a firearm, the lever having a first end and a second end, wherein when the lever is utilized on the firearm the first end of the lever is connected to a takedown pin, wherein the takedown pin is configured to secure an upper receiver of a firearm to a lower receiver of a firearm.\",\n \"The invention is also directed toward a method of opening an action of a firearm, the firearm comprising an upper receiver and a lower receiver, the method comprising pressing a first end of a lever pivotably attached to an external surface of the firearm in a direction toward the firearm, wherein the second end of the lever is connected to a takedown pin, wherein the takedown pin is configured to secure the upper receiver to the lower receiver, whereby pressing the first end of the lever toward the firearm moves the takedown pin to a disengaged position permitting the upper receiver to at least partially detach from the lower receiver.\",\n \"The method may further comprise at least partially separating the upper receiver from the lower receiver.\",\n \"The method may further comprise fully joining the upper receiver to the lower receiver.\",\n \"The method may further comprise pressing the first end of the lever in a direction away from the firearm, whereby pressing the first end of the lever away from the firearm moves the takedown pin to an engaged position securing the upper receiver to the lower receiver.\",\n \"Still other embodiments of the present invention will become readily apparent to those skilled in this art from the following description wherein there is shown and described the embodiments of this invention, simply by way of illustration of the best modes suited to carry out the invention.\",\n \"As it will be realized, the invention is capable of other different embodiments and its several details are capable of modifications in various obvious aspects all without departing from the scope of the invention.\",\n \"Accordingly, the drawing and descriptions will be regarded as illustrative in nature and not as restrictive.\"\n ],\n [\n \"PRIORITY This application is a continuation of U.S. application Ser.\",\n \"No.\",\n \"15/490,943, filed Apr.\",\n \"19, 2017, the disclosure of which is hereby incorporated by reference.\",\n \"U.S. application Ser.\",\n \"No.\",\n \"15/490,943 claims priority to U.S.\",\n \"Provisional Patent Application Ser.\",\n \"No.\",\n \"62/384,168, filed Sep. 6, 2016, the disclosure of which is hereby incorporated by reference.\",\n \"FIELD OF THE INVENTION The invention is directed to a firearm accessory and more specifically to a rear mounted takedown assembly for an assault rifle which permits the quick and easy separation and unification of a top receiver and lower receiver of an assault rifle.\",\n \"BACKGROUND OF INVENTION Semi-automatic firearms have been known for a long time.\",\n \"The first semi-automatic rifle was introduced in 1885.The M-16 automatic rifle has been used by the military for years.\",\n \"A civilian version of the M-16 is known as the AR-15 and is a semi-automatic rifle.\",\n \"The AR-15 has been manufactured and sold to civilians for many years.\",\n \"Standard AR-15 semi-automatic rifles are manufactured and distributed with an upper receiver and a lower receiver.\",\n \"The upper receiver and lower receiver are normally attached together at two locations by locking pins which pass through holes in the upper receiver and lower receiver.\",\n \"A locking pin in the front is known as the front takedown pin.\",\n \"A locking pin in the rear is known as the rear takedown pin.\",\n \"A user who wants to remove the upper receiver from the lower receiver to clean the internal action of the firearm must first remove the rear takedown pin and front takedown pin to allow access to the action of the firearm.\",\n \"Alternatively, if the user removes only the rear takedown pin, then the upper receiver can pivot away from the lower receiver with the front takedown pin acting as the pivot point.\",\n \"Removing only the rear takedown pin allows a user to quickly separate the upper receiver from the lower receiver.\",\n \"However, this process has its flaws.\",\n \"A user can accidentally misplace the rear takedown pin.\",\n \"This would prevent the user from quickly reinserting the rear takedown pin and utilizing the firearm.\",\n \"What is needed is a firearm accessory which allows a user to remove the rear takedown pin to separate the upper receiver from the lower receiver without needed to completely removing the rear takedown pin from the complete firearm assembly.\",\n \"SUMMARY OF THE INVENTION The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed innovation.\",\n \"This summary is not an extensive overview, and it is not intended to identify key/critical elements or to delineate the scope thereof.\",\n \"Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.\",\n \"The invention is directed toward a firearm takedown assembly.\",\n \"The firearm takedown assembly comprises a docking plate configured to be removably secured to a firearm and a lever pivotably attached to the docking plate.\",\n \"The assembly may further comprise a pivot pin, wherein the lever is connected to the pivot pin.\",\n \"In another embodiment the assembly may further comprise a takedown pin.\",\n \"The takedown pin further may also comprise a groove extending along at least a portion of the takedown pin.\",\n \"In another embodiment the docking plate further comprises a central aperture for mounting the docking plate to a rear buffer tube of a firearm.\",\n \"The docking plate may further comprise one or more protrusions, wherein each of the one or more protrusions has a pivot pin hole for receiving the pivot pin.\",\n \"In addition the lever may further comprise a pivot plate extending from a side of the lever, the pivot plate having a pivot hole for receiving the pivot pin.\",\n \"The lever may also further comprise an end aperture disposed at an end of the lever.\",\n \"In another embodiment the assembly further comprises a spring configured to return the lever to a predetermined position.\",\n \"In addition the assembly may further comprise one or more screws for attaching the docking plate to the firearm.\",\n \"The invention is also directed toward a firearm comprising a lower receiver, an upper receiver, a lever pivotably attached to a portion of the firearm, and a takedown pin attached to an end of the lever.\",\n \"The take down pin is configured to secure the lower receiver to the upper receiver.\",\n \"The lever is configured to alternate the takedown pin from a closed position wherein the takedown pin is engaged with the lower receiver and upper receiver and an open position wherein the takedown pin is disengaged from the lower receiver and upper receiver.\",\n \"The firearm may further comprise a docking plate removably secured to a portion of the firearm and wherein the lever is pivotably attached to the docking plate.\",\n \"In addition the firearm may further comprise a pivot pin attached to the docking plate and the lever.\",\n \"In another embodiment of the firearm, the docking plate further comprises a central aperture for mounting the docking plate on a buffer tube of the firearm.\",\n \"The invention is also directed toward a firearm accessory comprising a lever configured to be pivotably attached to an external surface of a firearm, the lever having a first end and a second end, wherein when the lever is utilized on the firearm the first end of the lever is connected to a takedown pin, wherein the takedown pin is configured to secure an upper receiver of a firearm to a lower receiver of a firearm.\",\n \"The invention is also directed toward a method of opening an action of a firearm, the firearm comprising an upper receiver and a lower receiver, the method comprising pressing a first end of a lever pivotably attached to an external surface of the firearm in a direction toward the firearm, wherein the second end of the lever is connected to a takedown pin, wherein the takedown pin is configured to secure the upper receiver to the lower receiver, whereby pressing the first end of the lever toward the firearm moves the takedown pin to a disengaged position permitting the upper receiver to at least partially detach from the lower receiver.\",\n \"The method may further comprise at least partially separating the upper receiver from the lower receiver.\",\n \"The method may further comprise fully joining the upper receiver to the lower receiver.\",\n \"The method may further comprise pressing the first end of the lever in a direction away from the firearm, whereby pressing the first end of the lever away from the firearm moves the takedown pin to an engaged position securing the upper receiver to the lower receiver.\",\n \"Still other embodiments of the present invention will become readily apparent to those skilled in this art from the following description wherein there is shown and described the embodiments of this invention, simply by way of illustration of the best modes suited to carry out the invention.\",\n \"As it will be realized, the invention is capable of other different embodiments and its several details are capable of modifications in various obvious aspects all without departing from the scope of the invention.\",\n \"Accordingly, the drawing and descriptions will be regarded as illustrative in nature and not as restrictive.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS Various exemplary embodiments of this invention will be described in detail, wherein like reference numerals refer to identical or similar components, with reference to the following figures, wherein: FIG.\",\n \"1A is a top right perspective view of the rear takedown assembly; FIG.\",\n \"1B is a bottom right perspective view thereof; FIG.\",\n \"1C is a is a right plan view thereof; FIG.\",\n \"1D is a left plan view thereof; FIG.\",\n \"1E is a front plan view thereof; FIG.\",\n \"1F is a bottom plan view thereof; FIG.\",\n \"2 is a front exploded view thereof; FIG.\",\n \"3 is a bottom right perspective exploded view thereof; FIG.\",\n \"4 is a top right perspective exploded view thereof; FIG.\",\n \"5 is a top left perspective exploded view thereof; FIG.\",\n \"6 is a bottom left perspective exploded view thereof; FIG.\",\n \"7 is a top right perspective view of the rear takedown assembly mounted on a lower receiver; FIG.\",\n \"8 is a front plan view thereof; FIG.\",\n \"9 is a right plan view thereof; FIG.\",\n \"10A is a top plan view of the preferred embodiment of the pin; FIG.\",\n \"10B is a side plan view thereof; and FIG.\",\n \"10C is a top perspective view thereof.\",\n \"DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT The claimed subject matter is now described with reference to the drawings.\",\n \"In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the claimed subject matter.\",\n \"It may be evident, however, that the claimed subject matter may be practiced with or without any combination of these specific details, without departing from the spirit and scope of this invention and the claims.\",\n \"Referring to FIG.\",\n \"1A-FIG.\",\n \"6, the preferred embodiment of the invention is displayed.\",\n \"The invention is directed toward a rear mounted takedown assembly 100.The takedown assembly 100 may come in any configuration which permits a rear takedown pin to be removed and reinserted into the upper and lower receiver of the firearm.\",\n \"In the preferred embodiment the takedown assembly 100 comprises a docking plate 110, a lever 120, a pivot pin 130, and a takedown pin 140.Referring to FIGS.\",\n \"3-6, the separate components of the takedown assembly 100 are illustrated in detail.\",\n \"The docking plate 110 is a mounting unit configured to mount the takedown assembly 100 onto the firearm.\",\n \"The docking plate 110 may be in any configuration permitting the takedown assembly 100 to be mounted onto the firearm.\",\n \"In the preferred embodiment, the docking plate 110 has a central aperture 112.The central aperture 112 is configured to receive a buffer tube from a firearm.\",\n \"The central aperture 112 is preferably circular in shape but may be any size and shape.\",\n \"The central aperture 112 may have one or more protrusions extending into central aperture 112 to keep the docking plate 110 fixed onto the buffer tube and prevent the docking plate 110 from rotating about the buffer tube.\",\n \"In other embodiments the docking plate 110 may not have a central aperture 112 and instead be attached directly to the upper receiver or directly to the lower receiver by a known means, such as with screws or adhesive.\",\n \"In this way the docking assembly 100 may stay attached to either the upper receiver or lower receiver when the upper receiver is separated from the lower receiver.\",\n \"In the preferred embodiment, the docking plate 110 may also have a slot 116.The slot 116 traverses the docking plate 110 horizontally.\",\n \"The slot 116 is formed by two protrusions extending outward from the plane of the docking plate 110.In other embodiments there may be only one protrusion extending from the docking plate 100.The protrusions forming the slot 116 permit the lever 120 to be attached to the docking plate 110.Extending vertically through the protrusions is a pivot pin hole 114.The pivot pin hole 114 is configured to receive the pivot pin 130.The lever 120 is an elongated arm.\",\n \"The lever 120 may be in any size and shape.\",\n \"In the preferred embodiment the lever 120 has a pivot plate 122.The pivot plate 122 is configured to fit within the slot 116 of the docking plate 110.If the docking plate 110 does not have a slot 116 then the pivot plate 122 abuts the protrusion of the docking plate 110.In the preferred embodiment the pivot plate 122 has a pivot pin hole 124 configured to receive the pivot pin 130.The lever 120 also has an end aperture 126.The end aperture 126 is configured to receive the takedown pin 140.The pivot pin 130 may be any size and shape.\",\n \"In the preferred embodiment the pivot pin 130 is a long cylindrical member.\",\n \"The pivot pin 130 may also have a flange 132 disposed at one end of the pivot pin 130.The pivot pin 130 may have threading about the end of the pivot pin 130 distal from the flange 132.The pivot pin 130 is configured to pass through the pivot pin hole 124 of the lever 120 and the pivot pin hole 114 of the docking plate 110.The pivot pin 130 thus attaches the lever 120 to the docking plate 110.The lever 120 then pivots back and forth about the pivot pin 130.The takedown pin 140 may be any size and shape.\",\n \"In the preferred embodiment the takedown pin 140 is an elongated cylindrical member.\",\n \"In one embodiment the takedown pin 140 is a standard OEM style of takedown pin.\",\n \"The takedown pin 140 has a flange 144.The body of the takedown pin 140 fits through the end aperture 126 of the lever 120 and extends into rear takedown pin holes of the upper and lower receiver.\",\n \"In the preferred embodiment illustrated the takedown pin 140 has a groove 142.The groove 142 is configured to receive a detent pin in the lower receiver.\",\n \"Referring to FIGS.\",\n \"7-9, the takedown assembly 100 is mounted on the lower receiver 200.The takedown assembly 100 is mounted on a rear section of the lower receiver 200.In other embodiments the takedown assembly is mounted on the upper receiver of the firearm.\",\n \"The invention is also directed toward a method for retrofitting an existing firearm with the takedown assembly 100.First the user removed the OEM takedown pin.\",\n \"Next the user mounts the takedown assembly 100 to the lower receiver or the upper receiver of the firearm.\",\n \"The user may mount the takedown assembly 100 by screwing the takedown assembly 100 to the firearm, using adhesive to attach the takedown assembly 100 to the firearm, or sliding the buffer tube through the central aperture 112 of the docking plate 110.The user then inserts the takedown pin 140 of the takedown assembly 100 into the receiver holes in the upper and lower receiver.\",\n \"If the user decides to use the OEM takedown pin then the user can insert the OEM takedown pin into the end aperture 126 of the lever 120.To utilize the invention after it is installed the user pushed on the end of the lever 120 distal from the takedown pin 140.The lever 120 pivots about the pivot pin 130, moving the proximal end of the lever 120 away from the firearm.\",\n \"The movement of the proximal end of the lever 120 pulls the takedown pin 140 out of the receiver holes in the upper and lower receiver.\",\n \"The user can then rotate the upper receiver away from the lower receiver.\",\n \"The user may rotate the upper receiver a large distance away from the lower receiver or only a small distance.\",\n \"When the user is ready to fire the firearm again, the user rotates the upper receiver back in place against the lower receiver.\",\n \"The user then pushes the distal end of the lever 120 outward and away from the firearm.\",\n \"The lever 120 pivots about the pivot pin 130, causing the proximal end of the lever 120 to move towards the firearm.\",\n \"As the proximal end of the lever 120 moves towards the firearm, the lever 120 pushes the takedown pin 140 back into place into the receiver holes in the upper and lower receiver.\",\n \"The firearm action is now closed and locked together and the user may fire the firearm.\",\n \"The takedown assembly may have additional components which enhance the functionality of the takedown assembly.\",\n \"For instance, the takedown assembly may have a spring attached between the lever 120 and the docking plate 110 which automatically causes the lever 120 to return to the closed position where the takedown pin 140 is engaged with the upper receiver and lower receiver.\",\n \"The spring may also be disposed around the pivot pin 130 with one end of the spring pushing against a portion of the lever 120 and the other end of the spring pushing against the docking plate 110.In another embodiment of the invention the takedown pin 140 is an extension protruding from the end of the lever 120 such that the lever 120 and takedown pin 140 are one coformed component.\",\n \"In another embodiment of the invention the assembly may not have a docking plate 110.In this embodiment the lever 120 is directly attached to either the upper receiver or the lower receiver 200.This embodiment of the invention would be best utilized as part of an OEM component attached to a firearm sold from a manufacturer rather than an assembly for retrofitting a previously manufactured firearm.\",\n \"The lever 120 may be directly connected to any surface of the firearm or may be mounted on one or more components which are themselves attached to the surface of the firearm.\",\n \"The takedown assembly 100 may be made from any type of material such as metal or polymer.\",\n \"In the preferred embodiment the takedown pin 140 is made from a polyoxymethylene, a thermoplastic which was developed for high stiffness and low friction.\",\n \"This material is known by a variety of tradenames such as Delrin, Celcon, Ramtal, Duracon, Kepital, and Hostaform.\",\n \"The polyoxymethylene is a low friction and self-lubricating material which enhances the functionality of the takedown pin 140.As a metal takedown pin 140 is moved in and out of the receiver holes of the upper receiver and lower receiver, the takedown pin becomes worn and friction between the takedown pin 140 and the receivers can cause the takedown pin 140 to become stuck or difficult to remove.\",\n \"Lubricants such as gun oil can help solve this problem but lubricants are short lived and can eventually wear away—providing only a short term solution to the problem.\",\n \"The use of polyoxymethylene solves this solution by allowing the takedown pin 140 to have an inherently lower amount of friction against the receivers.\",\n \"Also, as the takedown pin 140 is moved against the receivers, the polyoxymethylene releases a small amount of lubricant from the material, providing a long term solution to the problem of sticking.\",\n \"In addition the use of polyoxymethylene protects the upper receiver and lower receiver.\",\n \"This is because the hole holding the takedown pin can wear down and break from overuse if the takedown pin is made of metal and is removed and inserted repeatedly.\",\n \"The invention may be utilized for any takedown pin.\",\n \"The preferred embodiment of the invention is utilized to remove and insert a rear takedown pin.\",\n \"However, the same invention may be utilized to remove and insert a front takedown pin as well.\",\n \"The invention may be used on either the rear takedown pin or the front takedown pin, or on both takedown pins simultaneously.\",\n \"Referring to FIGS.\",\n \"10A-C, the preferred embodiment of the takedown pin 140 is illustrated.\",\n \"In the preferred embodiment of the takedown pin 140, the takedown pin 140 has a flange 144 and a groove 142.The flange 144 provides an external surface of the takedown pin 140 for a user to grab and remove the takedown pin 140 if the user desires.\",\n \"The flange 144 also provides a connection point for the lever 120 to remove the takedown pin 140 from the lower receiver 200.The groove 142 may be any depth and shape.\",\n \"A detent pin from the lower receiver (not shown) is disposed within the groove 142 which prevents the takedown pin 140 from being fully removed from the receivers.\",\n \"In the preferred embodiment the outer end of the groove 140 has an outer recess 146.The outer recess 146 is a depression further into the groove 142 which holds the detent pin and prevents the takedown pin 140 from unintentionally being removed from the receivers.\",\n \"The inner end of the groove 142 has an inner recess 148.As illustrated in the preferred embodiment, the inner recess 148 has a triangular shape which operates as a ramp for the detent pin.\",\n \"The ramp shape of the inner recess 148 ensures that the detent pin does not hold the takedown pin 140 in an unengaged position.\",\n \"The ramp shape ensures that the takedown pin 140 is easily reinserted into the upper receiver and lower receiver when the user desires to reattach the upper receiver and lower receiver.\",\n \"In the preferred embodiment, the detent pin cannot get stuck at the inner recess 148 but slides upward along the ramp through the groove 142 to the outer recess 146.Other embodiments to the invention are possible without departing from the spirit of the invention.\",\n \"For instance, the invention may utilize a single lever 120 and single takedown pin 140 entering from one side of the firearm.\",\n \"In other embodiments of the invention there may be a lever 120 on each side of the firearm, with each lever having a takedown pin 140 inserted into the firearm.\",\n \"In other embodiments the lever 120 is connected to a connection unit which holds the takedown pin 140 rather than being connected directly to the takedown pin 140.What has been described above includes examples of the claimed subject matter.\",\n \"It is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing the claimed subject matter, but one of ordinary skill in the art can recognize that many further combinations and permutations of such matter are possible.\",\n \"Accordingly, the claimed subject matter is intended to embrace all such alterations, modifications and variations that fall within the spirit and scope of the appended claims.\",\n \"Furthermore, to the extent that the term “includes” is used in either the detailed description or the claims, such term is intended to be inclusive in a manner similar to the term “comprising” as “comprising” is interpreted when employed as a transitional word in a claim.\",\n \"The foregoing method descriptions and the process flow diagrams are provided merely as illustrative examples and are not intended to require or imply that the steps of the various embodiments must be performed in the order presented.\",\n \"As will be appreciated by one of skill in the art the order of steps in the foregoing embodiments may be performed in any order.\",\n \"Words such as “thereafter,” “then,” “next,” etc.\",\n \"are not intended to limit the order of the steps; these words are simply used to guide the reader through the description of the methods.\",\n \"Further, any reference to claim elements in the singular, for example, using the articles “a,” “an” or “the” is not to be construed as limiting the element to the singular.\",\n \"The preceding description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention.\",\n \"Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention.\",\n \"Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the following claims and the principles and novel features disclosed herein.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870916"}}},{"rowIdx":4493676,"cells":{"text":{"kind":"list like","value":[["Systems, Apparatus, and Methods for Spectral Imaging","A spectral imaging system includes an autocorrelator to generate different autocorrelations when the moving reflector in the autocorrelator is at different positions so as to reconstruct spectral images.","The system also includes a position measurement system to measure the actual positions of the moving reflector when autocorrelations are taken.","These actual locations, instead of the desired locations in conventional methods, are then used to reconstruct the spectral image.","This approach can address the misalignment of the moving reflector from its desired location (due to external disturbances, slow actuator dynamics, and other factors) in conventional spectral imaging techniques and allow the development of high-resolution, high-stability, portable imaging spectrometers for the general public."],["1.A spectral imaging system comprising: a beam splitter to receive an input light beam reflected or scattered from a sample and to split the input light beam into a first portion and a second portion; a first reflector, in optical communication with the beam splitter, to reflect the first portion of the input light beam; a second reflector, in optical communication with the beam splitter, to reflect the second portion of the input light beam; an actuator, operably coupled to the second reflector, to move the second reflector along a propagation direction of the second portion of the input light beam; a position measurement system, operably coupled to the second reflector, to measure a position of the second reflector; a detector, disposed at an intersection between the first portion of the input light beam and the second portion of the input light beam, to detect an interference pattern created by the first portion of the input light beam and the second portion of the input light beam; and a processor, operably coupled to the position measurement system and the detector, to generate a spectral image of the sample based at least in part on the position acquired by the position measurement system and the interference pattern acquired by the detector.","2.The spectral imaging system of claim 1, wherein the actuator is configured to place the second reflector at a plurality of non-uniformly spaced positions.","3.The spectral imaging system of claim 1, wherein the actuator is configured to move the second reflector to more than 30 positions per second, and wherein the detector is configured to operate at a frame rate greater than 30 fps.","4.The spectral imaging system of claim 1, wherein the actuator is configured to move the second reflector at a step size substantially equal to or greater than 1 μm.","5.The spectral imaging system of claim 1, wherein the actuator is configure to move the second reflector through a distance of about 0.5 mm to about 3 mm.","6.The spectral imaging system of claim 1, wherein the position measurement system comprises: a laser, in optical communication with the first mirror and the second mirror via the beam splitter, to transmit a probe laser beam through the beam splitter, the beam splitter directing a first part of the probe laser beam toward the first reflector and a second part of the probe laser beam toward the second reflector; and an array of photodiodes, in optical communication with the first reflector and the second reflector via the beam splitter, to detect a probe interference pattern formed by the first part of the probe laser beam after reflection from the first reflector and the second part of the probe laser beam after reflection from the second reflector.","7.The spectral imaging system of claim 6, wherein the laser source comprises a vertical-cavity surface-emitting laser.","8.The spectral imaging system of claim 6, wherein the probe laser beam has a linewidth of less than 0.1 nm.","9.The spectral imaging system of claim 1, wherein the processor is configured to estimate the spectral image of the sample using at least one of a least squares method, an adaptive sampling method, and an iterative sampling method.","10.The spectral imaging system of claim 1, further comprising: a piezoelectric actuator, operably coupled to at least one of the first reflector and the second reflector, to move the at least one of the first reflector and the second reflector toward a desired position.","11.A method of spectral imaging, the method comprising: splitting an input light beam reflected or scattered from a sample with a beam splitter into a first portion and a second portion; reflecting the first portion of the input light beam with a first reflector; reflecting the second portion of the input light beam with a second reflector, the second reflector being at a first position in a plurality of positions along a propagation direction of the second portion of the input light beam; performing measurement of the first position of the second reflector; detecting a first interference pattern created by the first portion of the input light beam and the second portion of the input light beam when the second reflector is at the first position; moving the second reflector to a second position in the plurality of positions along the propagation direction of the second portion of the input light beam; performing measurement of the second position of the second reflector; detecting a second interference pattern created by the first portion of the input light beam and the second portion of the input light beam when the second reflector is at the second position; generating a spectral image of the sample based at least in part on the measurement of the first position, the measurement of the second position, the first interference pattern, and the second interference pattern.","12.The method of claim 11, wherein the first plurality of positions are non-uniformly spaced along the propagation direction of the second portion of the input light beam.","13.The method of claim 11, wherein moving the second reflector comprises moving the second reflector to more than 30 positions per second, and the method further comprises detecting a plurality of interference patterns at a frame rate greater than 30 fps.","14.The method of claim 11, wherein moving the second reflector comprises moving the second reflector at a step size substantially equal to or greater than 1 μm.","15.The method of claim 11, wherein moving the second reflector comprises moving the second reflector through a distance of about 0.5 mm to about 3 mm.","16.The method of claim 11, wherein performing the measurement of the first position comprises: directing a first part of a probe laser beam toward the first reflector and directing a second part of the probe laser beam toward the second reflector; interfering the first part of the probe laser beam after reflection from the first reflector and the second part of the probe laser beam after reflection from the second reflector to form a probe interference pattern; detecting the probe interference pattern using an array of photodiodes; and estimating the first position of the second reflector based at least in part on the probe interference pattern.","17.The method of claim 16, further comprising: emitting the probe laser beam from a vertical-cavity surface-emitting laser.","18.The method of claim 16, wherein the probe laser beam has a linewidth less than 0.1 nm.","19.The method of claim 11, wherein generating the spectral image of the sample comprises generating the spectral image using at least one of a least squares method, an adaptive sampling method, and an iterative sampling method.","20.The method of claim 11, further comprising: adjusting at least one of the first reflector or the second reflector toward a desired position using a piezoelectric actuator.","21.A spectral imaging system comprising: an autocorrelator to create an autocorrelation pattern of an input light beam reflected or scattered from a sample, the autocorrelator comprising: a beam splitter to split the input light beam into a first portion and a second portion; a first reflector to reflect the first portion of the input light beam; a second reflector to reflect the second portion of the input light beam; and a detector, disposed at an intersection between the first portion of the input light beam and the second portion of the input light beam, to detect an autocorrelation pattern created by the first portion of the input light beam and the second portion of the input light beam; a positioning and measurement system operably coupled to the second reflector, the positioning and measurement system comprising: an actuator to place the second reflector at a plurality of positions non-uniformly spaced along a propagation direction of the second portion of the input light beam; a laser source to emit a probe laser beam toward the beam splitter, the beam splitter directing a first part of the probe laser beam toward the first reflector and directing a second part of the probe laser beam toward the second reflector; and an array of photodiodes, in optical communication with the first reflector and the second reflector via the beam splitter, to detect a probe interference pattern formed by the first part of the probe laser beam after reflection from the first reflector and the second part of the probe laser beam after reflection from the second reflector; and a processor, operably coupled to the autocorrelator and the positioning and measurement system, to estimate the plurality of positions of the second reflector based at least in part on the probe interference pattern and further to generate a spectral image of the sample based at least in part on the plurality of positions of the second reflector and the autocorrelation pattern of the input light beam."],[" BACKGROUND An imaging spectrometer is a device that can take a series of images that include information from a variety of wavelengths of light at fine spectral resolution.","When an imaging spectrometer device senses different types of input light, such as ambient light for absorption measurements or laser light for fluorescence or Raman measurements, it can differentiate between materials that are usually indistinguishable to the naked eye in a nondestructive, non-contact manner.","Compared to single-point instruments, an imaging spectrometer can monitor many points at the same time and be much more easily positioned relative to the object of interest, vastly improving usability.","The ability to switch between regular and hyperspectral imaging makes it possible to align the spectrometer with respect to the sample without an additional alignment camera.","Faster imaging spectrometer systems can be incorporated with image stabilization and object tracking algorithms to account for human or object motion, which can be difficult for a non-imaging system.","Being able to select the wavelength resolution on the fly and to obtain high spectral resolution images (e.g., with resolutions of 1.6 cm −1 for Raman spectroscopy to 70 cm −1 for low resolution spectroscopy) is also desirable for practical applications.","Due to the above advantages, imaging spectrometers can be useful in many applications, such as space probes, biological imaging, air pollution investigation, and health care monitoring, among others.","However, existing imaging spectrometers are usually bulky and not readily accessible to the general population, since they are typically mounted to optical tables and include complex components to reject external vibrations."],[" SUMMARY Systems, apparatus, and methods described herein are directed to spectral imaging.","In one example, a spectral imaging system includes a beam splitter to receive an input light beam reflected or scattered from a sample and to split the input light beam into a first portion and a second portion.","A first reflector is in optical communication with the beam splitter to reflect the first portion of the input light beam and a second reflector is in optical communication with the beam splitter to reflect the second portion of the input light beam.","The system also includes an actuator, operably coupled to the second reflector, to move the second reflector along a propagation direction of the second portion of the input light beam.","A position measurement system is operably coupled to the second reflector to measure a position of the second reflector.","A detector is disposed at an intersection between the first portion of the input light beam and the second portion of the input light beam to detect an interference pattern created by the first portion of the input light beam and the second portion of the input light beam.","The system further includes a processor, operably coupled to the position measurement system and the detector, to generate a spectral image of the sample based at least in part on the position acquired by the position measurement system and the interference pattern acquired by the detector.","In another example, a method of spectral imaging includes splitting an input light beam reflected or scattered from a sample with a beam splitter into a first portion and a second portion.","The method also includes reflecting the first portion of the input light beam with a first reflector and reflecting the second portion of the input light beam with a second reflector.","The second reflector is at a first position in a plurality of positions along a propagation direction of the second portion of the input light beam.","The method further includes performing measurement of the first position of the second reflector and detecting a first interference pattern created by the first portion of the input light beam and the second portion of the input light beam when the second reflector is at the first position.","The method also includes moving the second reflector to a second position in the plurality of positions along the propagation direction of the second portion of the input light beam and performing measurement of the second position of the second reflector.","A second interference pattern is created by the first portion of the input light beam and the second portion of the input light beam when the second reflector is at the second position.","The method further includes generating a spectral image of the sample based at least in part on the measurement of the first position, the measurement of the second position, the first interference pattern, and the second interference pattern.","More spectral images can then be generated by combining the previously acquired interference patterns with additional interference patterns acquired at subsequent actual positions.","In yet another example, a spectral imaging system includes an autocorrelator to create an autocorrelation pattern of an input light beam reflected or scattered from a sample.","The autocorrelator includes a beam splitter to split the input light beam into a first portion and a second portion, a first reflector to reflect the first portion of the input light beam, a second reflector to reflect the second portion of the input light beam, and a detector, disposed at an intersection between the first portion of the input light beam and the second portion of the input light beam, to detect an autocorrelation pattern created by the first portion of the input light beam and the second portion of the input light beam.","The spectral imaging system also includes a positioning and measurement system operably coupled to the second reflector.","The positioning and measurement system includes an actuator to place the second reflector at a plurality of positions non-uniformly spaced along a propagation direction of the second portion of the input light beam.","The positioning and measurement system also includes a laser source to emit a probe laser beam toward the beam splitter.","The beam splitter directs a first part of the probe laser beam toward the first reflector and directing a second part of the probe laser beam toward the second reflector.","An array of photodiodes is in optical communication with the first reflector and the second reflector via the beam splitter to detect a probe interference pattern formed by the first part of the probe laser beam after reflection from the first reflector and the second part of the probe laser beam after reflection from the second reflector.","The spectral imaging system further includes a processor, operably coupled to the autocorrelator and the positioning and measurement system, to estimate the plurality of positions of the second reflector based at least in part on the probe interference pattern.","The processor also generates a spectral image of the sample based at least in part on the plurality of positions of the second reflector and the autocorrelation pattern of the input light beam.","It should be appreciated that all combinations of the foregoing concepts and additional concepts discussed in greater detail below (provided such concepts are not mutually inconsistent) are contemplated as being part of the inventive subject matter disclosed herein.","In particular, all combinations of claimed subject matter appearing at the end of this disclosure are contemplated as being part of the inventive subject matter disclosed herein.","It should also be appreciated that terminology explicitly employed herein that also may appear in any disclosure incorporated by reference should be accorded a meaning most consistent with the particular concepts disclosed herein."],["CROSS-REFERENCES TO RELATED APPLICATIONS This application is a bypass continuation of International Application No.","PCT/US2016/042512, filed Jul.","15, 2016, and entitled “SYSTEMS, APPARATUS, AND METHODS FOR SPECTRAL IMAGING,” which in turn claims the priority benefit, under 35 U.S.C.","§ 119(e), of U.S.","Application No.","62/192,824, filed Jul.","15, 2015, entitled “MINIATURE, HIGH-SPEED IMAGING TRANSFORM SPECTROMETERS AND ADVANCED SAMPLING ALGORITHMS.” Each of these applications is hereby incorporated herein by reference in its entirety.","BACKGROUND An imaging spectrometer is a device that can take a series of images that include information from a variety of wavelengths of light at fine spectral resolution.","When an imaging spectrometer device senses different types of input light, such as ambient light for absorption measurements or laser light for fluorescence or Raman measurements, it can differentiate between materials that are usually indistinguishable to the naked eye in a nondestructive, non-contact manner.","Compared to single-point instruments, an imaging spectrometer can monitor many points at the same time and be much more easily positioned relative to the object of interest, vastly improving usability.","The ability to switch between regular and hyperspectral imaging makes it possible to align the spectrometer with respect to the sample without an additional alignment camera.","Faster imaging spectrometer systems can be incorporated with image stabilization and object tracking algorithms to account for human or object motion, which can be difficult for a non-imaging system.","Being able to select the wavelength resolution on the fly and to obtain high spectral resolution images (e.g., with resolutions of 1.6 cm−1 for Raman spectroscopy to 70 cm−1 for low resolution spectroscopy) is also desirable for practical applications.","Due to the above advantages, imaging spectrometers can be useful in many applications, such as space probes, biological imaging, air pollution investigation, and health care monitoring, among others.","However, existing imaging spectrometers are usually bulky and not readily accessible to the general population, since they are typically mounted to optical tables and include complex components to reject external vibrations.","SUMMARY Systems, apparatus, and methods described herein are directed to spectral imaging.","In one example, a spectral imaging system includes a beam splitter to receive an input light beam reflected or scattered from a sample and to split the input light beam into a first portion and a second portion.","A first reflector is in optical communication with the beam splitter to reflect the first portion of the input light beam and a second reflector is in optical communication with the beam splitter to reflect the second portion of the input light beam.","The system also includes an actuator, operably coupled to the second reflector, to move the second reflector along a propagation direction of the second portion of the input light beam.","A position measurement system is operably coupled to the second reflector to measure a position of the second reflector.","A detector is disposed at an intersection between the first portion of the input light beam and the second portion of the input light beam to detect an interference pattern created by the first portion of the input light beam and the second portion of the input light beam.","The system further includes a processor, operably coupled to the position measurement system and the detector, to generate a spectral image of the sample based at least in part on the position acquired by the position measurement system and the interference pattern acquired by the detector.","In another example, a method of spectral imaging includes splitting an input light beam reflected or scattered from a sample with a beam splitter into a first portion and a second portion.","The method also includes reflecting the first portion of the input light beam with a first reflector and reflecting the second portion of the input light beam with a second reflector.","The second reflector is at a first position in a plurality of positions along a propagation direction of the second portion of the input light beam.","The method further includes performing measurement of the first position of the second reflector and detecting a first interference pattern created by the first portion of the input light beam and the second portion of the input light beam when the second reflector is at the first position.","The method also includes moving the second reflector to a second position in the plurality of positions along the propagation direction of the second portion of the input light beam and performing measurement of the second position of the second reflector.","A second interference pattern is created by the first portion of the input light beam and the second portion of the input light beam when the second reflector is at the second position.","The method further includes generating a spectral image of the sample based at least in part on the measurement of the first position, the measurement of the second position, the first interference pattern, and the second interference pattern.","More spectral images can then be generated by combining the previously acquired interference patterns with additional interference patterns acquired at subsequent actual positions.","In yet another example, a spectral imaging system includes an autocorrelator to create an autocorrelation pattern of an input light beam reflected or scattered from a sample.","The autocorrelator includes a beam splitter to split the input light beam into a first portion and a second portion, a first reflector to reflect the first portion of the input light beam, a second reflector to reflect the second portion of the input light beam, and a detector, disposed at an intersection between the first portion of the input light beam and the second portion of the input light beam, to detect an autocorrelation pattern created by the first portion of the input light beam and the second portion of the input light beam.","The spectral imaging system also includes a positioning and measurement system operably coupled to the second reflector.","The positioning and measurement system includes an actuator to place the second reflector at a plurality of positions non-uniformly spaced along a propagation direction of the second portion of the input light beam.","The positioning and measurement system also includes a laser source to emit a probe laser beam toward the beam splitter.","The beam splitter directs a first part of the probe laser beam toward the first reflector and directing a second part of the probe laser beam toward the second reflector.","An array of photodiodes is in optical communication with the first reflector and the second reflector via the beam splitter to detect a probe interference pattern formed by the first part of the probe laser beam after reflection from the first reflector and the second part of the probe laser beam after reflection from the second reflector.","The spectral imaging system further includes a processor, operably coupled to the autocorrelator and the positioning and measurement system, to estimate the plurality of positions of the second reflector based at least in part on the probe interference pattern.","The processor also generates a spectral image of the sample based at least in part on the plurality of positions of the second reflector and the autocorrelation pattern of the input light beam.","It should be appreciated that all combinations of the foregoing concepts and additional concepts discussed in greater detail below (provided such concepts are not mutually inconsistent) are contemplated as being part of the inventive subject matter disclosed herein.","In particular, all combinations of claimed subject matter appearing at the end of this disclosure are contemplated as being part of the inventive subject matter disclosed herein.","It should also be appreciated that terminology explicitly employed herein that also may appear in any disclosure incorporated by reference should be accorded a meaning most consistent with the particular concepts disclosed herein.","BRIEF DESCRIPTION OF THE DRAWINGS The skilled artisan will understand that the drawings primarily are for illustrative purposes and are not intended to limit the scope of the inventive subject matter described herein.","The drawings are not necessarily to scale; in some instances, various aspects of the inventive subject matter disclosed herein may be shown exaggerated or enlarged in the drawings to facilitate an understanding of different features.","In the drawings, like reference characters generally refer to like features (e.g., functionally similar and/or structurally similar elements).","FIG.","1A shows a schematic of spectral imaging systems including a position measurement system.","FIGS.","1B and 1C show an example implementation of the imaging system shown in FIG.","1A.","FIGS.","1D and 1E illustrate a full spectrometer system including electronics.","FIGS.","2A-2B shows a schematic of a motor design that can be used to move reflectors in the system shown in FIG.","1A.","FIG.","2C shows experimental results of linear translations of the motor shown in FIGS.","2A-2B as a function of input voltage.","FIGS.","2D and 2E show a schematic of a motor including symmetric flexures with more output force, higher stiffness, and more symmetric motion that can be used to move reflectors in the system shown in FIG.","1A.","FIG.","3A shows a schematic of a reflector position measurement system using two-signal encoders.","FIGS.","3B and 3C illustrate measurement of reflector positions and tilt using the system shown in FIG.","3A.","FIG.","4A shows an example of photodiode signals acquired using the system shown in FIG.","3A.","FIG.","4B shows a Lissajous plot of the photodiode signals shown in FIG.","4A.","FIGS.","4C and 4D show position and phase change, respectively, of the moving mirror calculated from the data shown in FIGS.","4A and 4B.","FIG.","5A shows a schematic of a reflector position measurement system using four-signal encoders.","FIGS.","5B and 5C illustrate measurements of reflector positions, tip, and tilt using the system shown in FIG.","5A.","FIGS.","6A-6E show schematics of a multi-axis piezoelectric actuator that can be used to fine tune the moving reflector in the system shown in FIG.","1A.","FIG.","7 illustrates a method of spectral imaging using actual positions of the moving reflector for image reconstruction.","FIGS.","8A-8D show experimental results of reconstructed spectral images using desired positions and actual positions of the moving reflector in an imaging spectrometer.","FIG.","9 illustrates a method of adaptive sampling.","FIG.","10 illustrates a method of digital filtering to create color images from black-and-white raw images.","DETAILED DESCRIPTION Overview As introduced above, an imaging spectrometer, such as a Fourier transform spectrometer, usually takes several data points at different autocorrelations of the input light.","Autocorrelations of the input light can be achieved using an autocorrelator including a beam splitter to split the input light into two portions and two reflectors, each of which reflects a corresponding portion of the input light toward a detector.","The two portions, after reflection by the two reflectors, then combine at the detector to form an interference pattern (also referred to as an autocorrelation pattern).","By moving one of the reflectors (also referred to as the moving reflector) to different locations, different autocorrelations can be acquired.","A spectral image can then be reconstructed using the different autocorrelation patterns acquired when the moving reflector is at different locations.","In conventional spectral imaging, the moving reflector is usually moved by a motor to a series of desired locations and the subsequent reconstruction of the spectral image also uses these desired locations of the moving reflector.","In addition, these desired locations of the moving reflector are also uniformly spaced to simplify actuation and subsequent calculation during reconstruction.","However, the actual location of the moving reflector usually deviates from the desired location, due to, for example, mechanical vibration, slow motor dynamics, thermal misalignment, or a combination thereof.","The deviation of the actual location in turn can decrease the accuracy of the reconstructed spectral image.","One way to address the misalignment of the moving reflector is to increase the precision and increase the bandwidth of the motor that drives the moving reflector.","For example, a piezoelectric actuator can be used to fine tune the position of the moving reflector.","The actuator speed is usually faster than the image acquisition rate such that each image can be taken when the moving reflector is at a distinct location.","For example, if the desired frame rate (spectral sampling rate) is 2000 fps, then the actuator bandwidth can be about 2 kHz to about 20 kHz or more.","As the acquisition rate of the imaging spectrometer increases, it can be challenging for piezoelectric actuators to operate at sufficiently high speeds due to the limitations imposed by, for example, the finite response time of piezoelectric materials or other limitations on the mechanical components in the piezoelectric actuator.","In addition, high-speed piezoelectric actuators can be costly and bulky as well, thereby further hindering the miniaturization of the imaging spectrometers.","Systems, apparatus, and methods described herein employ another approach to address the misalignment of the moving reflector.","Instead of improving the movement accuracy of the moving reflector using expensive and bulky actuators, this approach takes into account the position deviations of the moving reflector when reconstructing of the spectral image.","More specifically, the approach uses a position measurement system to measure the actual locations of the moving reflector when autocorrelation images are taken by the imaging spectrometer.","These actual locations, instead of the desired locations in conventional methods, are then used to reconstruct the spectral image using the autocorrelation images.","In other words, this approach lives with inaccuracies in the positions of the moving reflector and can tolerate a wide range of misalignment of the moving reflector from its desired locations.","Using actual locations of the moving reflector for image reconstruction can allow the development of miniature, portable imaging spectrometers that have the relatively high spectral resolutions for making scientific measurements without some of the burdensome vibration rejection components.","The spectrometer can also be mounted inside other packages, such as an endoscope, smart phone, scanner gun, microscope, or telescope.","A spectrometer that can be small enough to fit in the palm of the hand or at the end of an endoscope would enable a host of new applications.","FIG.","1A shows a schematic of a spectral imaging system 100 including a position measurement system 150.The system 100 includes a beam splitter 110 to receive input light 101, which can be light reflected, scattered, or emitted from an object or scene to be imaged.","The beam splitter 110 divides the input light 101 into two portions.","The first portion is directed by the beam splitter 110 to a first reflector 120 and the second portion is directed to a second reflector 120.The two reflectors 120 and 130 reflect the corresponding portion of the input light beam 101 toward an aperture 164 and a lens 162 behind the aperture 164.A detector 160, placed at the focal plane of the lens 162, detects interference patterns (also referred to as autocorrelation patterns in this example) created by the first portion and the second portion of the input light 101.An actuator 140 is coupled to the second reflector 130 (also referred to as the moving reflector) to move the second reflector 130 to different positions along the propagation direction of the second portion of the input light 101.At each position of the moving reflector 130, the detector 160 can take one or more autocorrelation patterns.","A processor 170 is in communication with the detector 160 to receive the autocorrelation patterns acquired by the detector 160 and to generate a spectral image of the object based on these autocorrelation patterns.","The position measurement system 150 shown in FIG.","1A employs an optical technique to determine the position of the reflector 130.The position measurement system 150 includes a laser 151 to provide a probe laser beam 105 (or simply probe beam 105), which propagates to a lens 152 for collimation before arriving at a probe beam splitter 153.Part of the probe beam 105 is reflected by the probe beam splitter 153 toward a mirror 154, which further reflects the probe beam 105 toward the beam splitter 110.The probe laser beam 105 then travels through a similar beam path as travelled by the input light 101.More specifically, the first reflector 120 reflects one part of the probe laser beam 105 and the second reflector 130 reflects another part of the probe laser beam 105.The two parts of the probe laser beam, after reflection by the corresponding reflector 120/130, propagate back to the mirror 154 and through the probe beam splitter 153.A negative lens 155 then expands the probe laser beam 105.Two probe detectors 156a and 156b are placed after the negative lens 155 to detect the interference pattern generated by the two parts of the probe laser beam 105.In one example, the laser 151 can include a HeNe laser.","In another example, the laser 151 can include a Nd:YAG laser with a frequency doubling crystal to deliver laser beams at 532 nm.","In yet another example, the laser 151 can include a vertical-cavity surface-emitting laser (VCSEL).","For example, a surface mount 0603 package VCSEL at 850 nm with a bandwidth of about 0.057 nm to about 0.1 nm full-width-at-half-maximums (FWHM) can be used as the laser 151.The spectral resolution of the system 150 using this VCSEL laser can be about 1.38 cm−1 to 0.788 cm−1 without the use of any spectral line correction algorithms.","This small laser would also enable the miniaturization of the imaging spectrometer.","It can be desirable for the laser 151 to emit the probe laser beam 105 with a narrow linewidth.","In general, a narrower linewidth of the probe laser beam 105 can lead to a finer resolution position measurement of the moving reflector 130.In one example, the linewidth of the probe laser beam 105 can be less than 5 nm (e.g., less than 5 nm, less than 3 nm, less than 2 nm, or less than 1 nm, including any value and sub ranges in between).","In another example, the linewidth of the probe laser beam 105 can be less than 0.5 nm (e.g., less than 0.5 nm, less than 0.3 nm, less than 0.2 nm, less than 0.1 nm, less than 0.08 nm, or less than 0.05 nm, including any values and sub ranges in between).","The position and tilt of the reflectors 120 and 130 can be determined as follows.","When one reflector (e.g., 120) is tilted with respect to the other reflector (e.g., 130), the paths of the probe laser beam 105 reflected from those two reflectors 120 and 130 change accordingly, thereby projecting an interference pattern on the probe plane.","This interferometric pattern can be sinusoidal with a period that is a function of the relative position of the two reflectors 120 and 130 as well as the relative tilt.","When the moving reflector 130 is translated, the dark and bright portions of the light can translate left or right.","By placing the two photodiodes 156a and 156b at different locations on this interferometric pattern, it is possible to measure two parts of this sinusoidal curve with a fixed phase delay.","With two signals, it is possible to calculate the position and direction of propagation by using an analog encoder scheme where the phase delay resulting from a tilt angle is found through calibration (see, e.g., FIGS.","3A-4B).","The two detectors 156a and 156b are also in communication with the processor 170, which can determine the actual positions of the moving reflector 130 from the detector measurements.","In addition, using the actual positions of the moving reflector 130, the processor 170 can further reconstruct the spectral image of the object.","Since the actual positions of the moving reflector 130 can be accurately monitored by the position measurement system 150 and used in subsequent spectral image reconstruction, potential misalignment of the moving reflector 130 may no longer be a concern to users.","In FIG.","1A, the system 100 uses a single-pass Michelson interferometer to generate autocorrelation patterns of the input light 101.In practice, several other configurations can also be used to generate autocorrelation.","In one example, the system 100 can use a double-pass Michelson interferometer to generate autocorrelation of the input light 101.In another example, a common path Sagnac can be used to generate autocorrelation of the input light 101.In yet another example, the system 100 can use an electro-optic modulator style interferometer.","More details about different types of autocorrelator can be found in U.S. patent application Ser.","No.","14/933,666, entitled “Methods, systems, and apparatus for imaging spectroscopy,” which is hereby incorporated herein by reference in its entirety.","FIGS.","1B and 1C show an assembled view and an exploded view, respectively, of an imaging device 103 that can use the imaging system 100 shown in FIG.","1A.","The device 103 includes a spectrometer layer 143 that can include optical setup similar to that shown in FIG.","1A.","A sensor layer 157a including high speed camera board 157b and a photodiode board 157c (collectively referred to as sensors 157) are coupled to the spectrometer layer 143a to detect autocorrelation patterns created in the spectrometer layer 143.The sensors 157 can also measure positions of reflectors in the spectrometer layer 143 so as to facilitate subsequent image reconstruction.","A motor 123a and motor adjustment flexures 123b (collectively referred to as motors 123) are coupled to the spectrometer layer 143 to move the reflectors in the spectrometer layer 143.The motors 123 and the sensors 157 are coupled to opposite sides of the spectrometer layer 143 so as to effectively use the space in the device 103.The device 103 also includes a piezoelectric flexure layer 113 to adjust the tip, tilt, and translation of the reflectors in the spectrometer layer 143 at higher precisions.","The device 103 further includes a top cover 133 and a base 163 to enclose the various components, thereby resulting in a compact and portable device 103 as shown in FIG.","1B.","FIG.","1D shows a photo of the imaging device 103 described above.","FIG.","1E shows the full embodiment including processing electronics 173 and power electronics 183 in a hand-held format.","Actuators to Move the Reflector The actuator 140 in the system 100 is for moving the moving reflector 130.In practice, it can be desirable for the actuator 140 to travel at least several millimeters, have a positioning resolution on the order of micrometers, and have a high bandwidth to move quickly.","Traditionally, imaging spectrometers sweep through the different positions of the moving reflector and control only the speed at which the actuator moves, without controlling the positions.","These spectrometers typically use fast sampling on fast photodiodes in a continuous fashion.","In contrast, the system 100 takes snapshots rather than continuous data.","Therefore, it can be desirable to hold the moving reflector 130 in position during each snapshot (also referred to as exposure time for each image).","Since the approach described herein uses actual positions of the moving reflector 130 to reconstruct the spectral image, the requirements on the position resolution of the actuator 140 can be relaxed and the actual positions of the moving reflector 130 can be spaced non-uniformly.","In one example, the variation of the spacing between adjacent positions of the moving reflector 130 can be more than 10%.","In another example, the spacing variation can be greater than 50%.","In yet another example, the spacing variation can be greater than 100% (e.g., greater than 100%, greater than 150%, greater than 200%, or greater than 250%).","In principle, this approach can allow any spacing of the actual positions of the moving reflector 130.The actual positions can also be under-sampled (i.e., sampled at a lower frequency than the Nyquist frequency, see sections below).","One theoretical limitation can be based on information content.","For example, the moving reflector 130 can be placed at a plurality of non-uniformly spaced positions with sufficient informational content to allow for a unique solution when reconstructing the spectral image.","The actuator 140 can operate at various frequencies, which can be defined as the number of movements made by the moving reflector 130 per second.","For example, the actuator 140 can operate at a speed greater than 20 Hz (e.g., greater than 20 Hz, greater than 30 Hz, greater than 50 Hz, greater than 100 Hz, greater than 150 Hz, greater than 200 Hz, greater than 300 Hz, greater than 500 Hz, greater than 750 Hz, greater than 1000 Hz, or greater than 2000 Hz, including any values and sub ranges in between).","The detector 160 can operate at similar frame rate to acquire image each time the moving reflector 130 is placed at a different position.","For example, the detector 160 can acquire images at a frame rate greater than 20 frames per second (fps) (e.g., e.g., greater than 20 fps, greater than 30 fps, greater than 50 fps, greater than 100 fps, greater than 150 fps, greater than 200 fps, greater than 300 fps, greater than 500 fps, greater than 750 fps, greater than 1000 fps, or greater than 2000 fps, including any values and sub ranges in between).","The actuator 140 can also operate at various step sizes.","For example, the step size of the actuator 140 can be substantially equal to or greater than 0.1 μm (e.g., 0.1 μm, 0.2 μm, 0.3 μm, 0.5 μm, 0.8 μm, 1 μm, 1.2 μm, 1.5 μm, 2 μm, 3 μm, 5 μm, or longer, including any values and sub ranges in between).","In practice, the step size can depend on the characteristics of the actuator 140.For example, if the dynamics are slow (for example, a slow slew rate), then the step sizes can be small.","If the dynamics are faster (for example, a fast slew rate), the step sizes can be larger.","One region of steps sizes, in which approaches described herein can be advantageous, is where the measured position is sufficiently different from the desired position.","Sufficiently different is when the deviation of the desired position is a significant proportion of the wavelength of interest.","For example, if the wavelength of interest is 500 nm and the desired wavelength accuracy is better than 20 nm, then the desired positioning accuracy should be better than 10 nm.","If the positioning accuracy of the actuator 140 is worse than 10 nm, then conventional methods may not work, but approaches described herein can still use the actuator 140 because potential misalignment is addressed in the subsequent reconstruction stages.","In other words, approaches described herein can use actuators that may not otherwise usable in conventional spectral imaging methods.","The dynamic range of the actuator 140 (also referred to as the range of travel) can depend on, for example, the desired spectral resolution of the system 100.In general, a larger range of travel can lead to finer spectral resolution.","For example, the rage of travel of the actuator 140 can be about 0.1 mm to about 10 mm (e.g., 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.7 mm, 1.0 mm, 1.2 mm, 1.5 mm, 2 mm, 3 mm, 5 mm, 8 mm, or 10 mm, including any values and sub ranges in between).","Voice Coil Motors for Moving Mirrors FIGS.","2A-2B show schematics of motor 200 that can be used as the actuator 140 in the system 100.The motor 200 includes one or more permanent magnets 210 disposed within a coil 220 that is disposed on a coil holder 225 (also referred to as a bobbin).","The magnets 210 and the coil 220 are enclosed in a housing 240 (which is also the back iron or actuator yoke of the motor which steers the magnetic field lines).","Four flexures 230 are located on each side of the actuator and suspend the coil 220 via the coil holder 225 such that there is little to no friction between the bobbin of the coil 220 and the housing 240.The flexures 230 also function as a return spring to move the coil 220 back to its original position after when needed.","In operation, if no current is applied to the coil 220, as shown in FIG.","2A, the coil 220 stays in the middle of the housing 240.When an electric current is applied to the coil 220, the Lorenz force between the magnets 210 and the coil 220 can displace the coil 220, as illustrated in FIG.","2B.","Therefore, the motor 200 is also referred to as a linear Lorenz force voice coil motor.","The motor 200 can be relatively small for a desired stroke (i.e., range of movement of the coil 220).","It can also operate with relatively low friction, which may cause unpredictable parasitic rotation on the reflectors.","In addition, the motor 200 uses a cube-like geometry, which can be manufactured using wire electrical discharge machining (EDM), can be easy to assemble, and can easily accommodate high rotational-stiffness blade flexures.","By attaching reflectors at some point closer to the coil 220, the resulting imaging spectrometers can also be made smaller.","In one example, the housing 240 (sometimes also referred to as an actuator yoke) can be made from low-carbon 1018 steel, which typically has a high magnetic permeability.","The flexures 230 can be made from thin 300 series stainless steel shim stock, which can be manufactured with a wire EDM if clamped to thicker pieces of metal on the top and bottom.","Although this material may be slightly paramagnetic, the high yield strength to Young's modulus ratio makes it a suitable material for blade flexures.","FIG.","2C shows experimental results of linear translation of the motor 200 as a function of input voltage to the motor for different blade flexure thicknesses.","In general, thicker flexures can make it more difficult to move the coil 220, at a given applied voltage.","As shown in FIG.","2C, a motor having 50 μm thick flexures can move 1427.7 μm per applied volt and a motor having 100 μm can move 371.99 μm per applied volt.","The motor 200 can have a resolution on the order of 1 μm or finer (e.g., 0.5 μm, 0.3 μm, 0.1 μm, 50 nm, 10 nm, 0.1 nm or finer).","In addition to the voice coil motor 200 illustrated in FIGS.","2A-2C, several other types of actuators can also be used to move the moving reflector in the imaging system 100.In one example, the system 100 can use stepper motors.","In another example, the system 100 can use Microelectromechanical system (MEMS) pop-up mirrors.","More information of MEMS pop-up mirrors can be found in U.S. Pat.","No.","6,396,975, entitled “MEMS optical cross-connect switch,” which is hereby incorporated herein by reference in its entirety.","In yet another example, the system 100 can use rotary to linear conversion motors.","FIGS.","2D and 2E show a perspective view and a side view, respectively, of a motor 201 that can be used as the actuator 140 in the system 100.The motor 201 includes one set of flexures 231a coupled to a top housing 241a and a second set of flexures 231b coupled to a bottom housing 241b.","The flexures 231a and 231b are coupled to the coil 221 on opposite sides of the coil 221.This configuration using two sets of flexures 231a and 231b can increase stiffness, increase speed, and improve symmetry in the motion.","The motor 201 also includes two sets of yokes: a vertical yoke 251a and a horizontal yoke 251b to increase the output force.","A magnet set 211 is placed directly into the yoke 251a and 251b to increase the magnetic field magnitude and hence the force produced at the coil 221.Measurement of Reflector Positions Using Two-Signal Encoders The position measurement system 150 in the system 100 can use analog encoders to determine location and tilt of the reflectors 120 and/or 130.An analog encoder basically includes an array of detectors (e.g., detectors 156a and 156b), such as photodiodes placed in the interference pattern generated by the probe laser beam 105.In one example, the analog encoders can include two detectors placed in a one-dimensional array.","In another example, the analog encoders can include four detectors placed in a 2×2 array.","In yet another example, the analog encoders can include any other configurations such as a 2×3 array, a 2×4 array, or a 3×4 array, among others.","FIG.","3A shows a schematic of a position measurement system 300 using two-signal encoders.","The system 300 includes a beam splitter 310 to receive a probe beam 305 and divide the probe beam 305 into two parts.","One part of the probe beam 305 is reflected by a first reflector 320 and the other part of the probe beam 305 is reflected by a second reflector 330.The first reflector 320 can have a tilt angle θ, and the second reflector 330 can move between two positions 330a and 330b.","The two parts of the probe beam 305 after reflections from the corresponding reflector 320 and 330 are combined by the beam splitter 310 and directed to two detectors 356a and 356b, which sense interference patterns generated by the two parts of the probe beam 305.FIG.","3B shows an example of an interferometric pattern in the probe plane where the two detectors 356a and 356b are placed.","The locations of the two detectors 356a and 356b are also indicated in FIG.","3B.","FIG.","3C shows the intensity distribution of the interferometric pattern shown in FIG.","3B along the horizontal direction (i.e., along the distance of the probe plane).","In operation, when one reflector (e.g., 320) in the system 300 is tilted with respect to the second reflector (e.g., 330), the light reflected from the reflectors 303a and 303b do not follow the coincident paths, thereby projecting an interference pattern on the probe plane as shown in FIG.","3B.","This interferometric pattern can be a sinusoid (see, e.g., FIG.","3C) whose frequency and phase varies as a function of the relative position of the two reflectors 320 and 330 as well as the relative tilt.","When the moving reflector 330 is translated between positions 330a and 330b, the dark and bright portions of the light translate left or right.","By placing two photodiodes 356a and 356b in different locations on this interferometric pattern, two parts of this sinusoidal curve can be measured with a fixed phase delay.","With two signals from the two detectors 356a and 356b, the position and direction of travel can be calculated by using an analog encoder scheme where the phase delay resulting from a tilt angle θ can be found through calibration.","Without being bound by any particular theory or mode of operation, the signal at the two photodiodes can be used to calculate the relative position using the following scheme where the two signals at positions 1 and 2 are a(z) and b(z), respectively: a ( z ) = cos ( 2 π z λ ) ( 1 ) b ( z ) = sin ( 2 π z λ - φ ) = sin ( 2 π z λ ) cos ( φ ) - cos ( 2 π z λ ) sin ( φ ) ( 2 ) The phase difference between the two signals can be a function of tilt angle θ and the distance between the two sensors d, φ = - π 2 + 2 π λ Δ ( 3 ) Δ = d tan ( θ ) ( 4 ) In order to solve for the position z, the two measured signals can be divided and the position can be found by taking an inverse tangent: b ( z ) a ( z ) = tan ( 2 π z λ ) cos ( φ ) - sin ( φ ) ( 5 ) resulting in the final equation for determining the relative position of the two mirrors, z = λ 2 π tan - 1 ( b ( z ) + a ( z ) sin ( φ ) a ( z ) cos ( φ ) ) ( 6 ) In order to solve this equation, the input data can first be scaled such that the data is between −1 and +1.Then the position can be calculated by using the arctangent function with two arguments, with proper unwrapping of the phase of the output data.","The relative phase delay can be calibrated by running a fast ramp on the actuator.","Then a Lissajou plot can be made from the two signals and a quick fit can be made to determine the phase delay.","This calibration step can take about 2 seconds to complete with the user interface.","Because the imaging system and the motor flexure system are relatively stable, the calibration can remain valid for a long time.","FIGS.","4A-4D show an example set of experimental data using the system 300.FIG.","4A shows photodiode signals acquired by the two detectors 356a and 356b.","FIG.","4B shows a Lissajou plot of the photodiode signals shown in FIG.","4A.","FIGS.","4C and 4D show the position and phase change of the moving reflector 330 calculated from the photodiode signals shown in FIG.","4A.","Data shown in FIGS.","4A-4D is acquired when a weak cantilever is used to hold the reflector 330, which can cause the reflector 330 to tilt back and forth as a function of the reflector velocity due to drag.","Since the trace of the Lissajou plot does not go over itself, this shows that the phase changes over time due to mirror tilt.","By calculating the instantaneous phase difference and the velocity of the reflector 330, it is clear that the two signals match up well.","This effect disappears when the component holding the reflector 330 is strengthened, thereby changing the Lissajou plot into a perfect oval with a constant phase delay.","The system 300, theoretically, can have infinite positioning resolution.","In practice, the positioning resolution can be limited by, for example, the resolution of the analog-to-digital converter (ADC) used to measure its magnitude, as well as the inherent noise in the circuit system and on the photodiodes 356a and 356b (e.g.","dark current).","The resolution limitation for a single photodiode 356a or 356b can be roughly Δz=λ/(2(ΔV/Vmax)BADC), which is a function of the reference wavelength A and the number of bits of the ADC between the signal maximum and signal minimum (ΔV/Vmax)BADC.","The maximum positioning resolution for this wavelength can be approximately 0.1 nm for a 12-bit ADC.","Measurement of Reflector Positions Using Four-Signal Encoders FIG.","5A shows a schematic of a position measurement system 500 using four-signal encoders.","The system 500 includes a beam splitter 510 to receive a probe beam 505 and divide the probe beam 505 into two parts.","A first reflector 520 reflects the first part of the probe beam 505 and a second reflector 530 reflects the second part of the probe beam 505.The second reflector 530 can move between two positions 530a and 530b.","The two parts of the probe beam 505 after reflections from the corresponding reflector 520 and 530 are combined by the beam splitter 510 and directed to four detectors 556a, 556b, 556c, and 556d, which sense an interference pattern generated by the two parts of the probe beam 505.The four detectors 556a to 556d also define a two-dimensional probe plane.","FIG.","5B shows an example of an interferometric pattern on the probe plane where the four detectors 556a to 556d are placed.","The locations of the four detectors 556a to 556d are also indicated in FIG.","5B.","FIG.","5C shows the intensity distribution of the interferometric pattern shown in FIG.","5B along two directions.","One direction is defined by the two detectors 556a and 556b (e.g., from 556a to 556b), and the other direction is defined by the two detectors 556c and 556d (e.g., from 556c to 556d).","With a two-dimensional probe plane, the interferometric pattern can be tilted and can be projected differently on the four photodiodes 556a to 556d with a relative phase difference in the tip direction and in the tilt direction.","The signals on the four sensors can be defined as: a ( z ) = cos ( 2 π z λ ) ( 7 ) b ( z ) = sin ( 2 π z λ - φ ab ) ( 8 ) c ( z ) = sin ( 2 π z λ - φ ac ) ( 9 ) d ( z ) = sin ( 2 π z λ - φ ad ) ( 10 ) The positions calculated by comparing the signals between each of these points are: z ab = λ 2 π tan - 1 ( b ( z ) + a ( z ) sin ( φ ab ) a ( z ) cos ( φ ab ) ) ( 11 ) z ac = λ 2 π tan - 1 ( c ( z ) + a ( z ) sin ( φ ac ) a ( z ) cos ( φ ac ) ) ( 12 ) z bd = λ 2 π tan - 1 ( d ( z ) + b ( z ) sin ( φ bd ) b ( z ) cos ( φ bd ) ) ( 13 ) z cd = λ 2 π tan - 1 ( d ( z ) + c ( z ) sin ( φ cd ) c ( z ) cos ( φ cd ) ) ( 14 ) The relative phase angles between the signals are then: φ ab = - π 2 + 2 π λ Δ x ( 15 ) φ ac = - π 2 + 2 π λ Δ y ( 16 ) φ bd = - π 2 + 2 π λ Δ y ( 17 ) φ cd = - π 2 + 2 π λ Δ x ( 18 ) φ ad = - π 2 + 2 π λ ( Δ x + Δ y ) ( 19 ) The phase differences are based on the x and y distance between the four sensors as well as the relative tip θx and tilt θy such that: Δx=zbd−zac=dx tan(θx) (20) Δy=zcd−zab=dy tan(θy) (21) Other than the interferometric measurement system described above, various other measurements systems can also be used to monitor the position of the moving reflector 130 in the system 100.In one example, a Linear Variable Differential Transformer (LVDT) can be used to measure positions of the moving reflector 130.In another example, the position of the moving reflector 130 can be monitored by a potentiometer, which can have a wiper contact linked to a mechanical shaft.","The shaft can be mechanically coupled to the moving reflector.","The movement of the shaft, induced by the movement of the moving reflector, can cause the resistance value between the wiper and the two end connections of the potentiometer to change, thereby providing an electrical signal that is dependent on the position of the shaft.","In yet another example, the moving reflector 130 can be coupled to a confocal sensor to measure its positions.","For example, a confocal position sensor can use a polychromatic white light that is focused onto the target surface by a multi-lens optical system.","The target surface can be the back surface of the moving reflector 130, the holder of the moving reflector 130, or any other surface that can move together with the moving reflector 130.The multi-lens optical system can disperse the light into monochromatic stages (colors) along the measurement axis.","A specific distance to the target can be assigned to each wavelength in a factory calibration.","Typically, only the wavelength which is exactly focused on the target is used for the measurement.","In other words, detecting the wavelength of the lighted reflected by the target surface can provide distance information of the target surface.","In yet another example, a capacitive displacement sensor can be employed to detect position of the moving reflector 130.For example, the capacitive displacement sensor can include a conductive surface placed near another conductive surface attached to the moving reflector 130.As the moving reflector 130 moves, the capacitance between the two conductive surfaces changes accordingly, thereby providing distance information between the two conductive surfaces.","Piezoelectric Actuators For linear actuator implementations such as the motor 200 shown in FIGS.","2A-2B, angular misalignment as a function of actuator travel almost always exists.","As described above, reconstructing the spectral image using actual positions, instead of desired positions, of the moving reflector in imaging spectrometers can compensate the effects of this misalignment.","Nevertheless, using optional piezoelectric actuators can further improve the accuracy of the spectral imaging systems.","The piezoelectric actuators can be combined with the motor 200 shown in FIGS.","2A-2B, where the motor 200 provides high stroke and the piezoelectric actuators provide fast dynamics.","FIGS.","6A-6C show schematics of a piezoelectric actuator 600 that can be used in the imaging system 100 to fine tune the position of the reflector 120 and/or the reflector 130.FIG.","6A shows a perspective view of the actuator 600 and FIGS.","6B-6C show a close-up view of each axis (e.g., translation, tip, and tilt) of the actuator 600.The actuator 600 includes three sub-actuators: a tip sub-actuator 610 to provide tip movement, a tilt subs-actuator 620 to provide tilt movement, and a translation sub-actuator 630 to provide translation movement.","Each sub-actuator 610 to 630 is in charge of one degree of freedom.","Each sub-actuator 610, 620, and 630 also includes a corresponding piezoelectric material 612, 622, and 632, and two screws 614, 624, and 634.Similarly, the screws 614 in the tip sub-actuator 610 and the screws 624 in the tilt sub-actuator 620 are used to apply a small preload to the sub-actuators and to help change zero point of the alignment.","To prevent the screw from damaging the piezoelectric materials 612 and 622, an additional stainless steel plate can be placed at the end of the sub-actuators 610 and 620 to help distribute point loads.","The translation actuator works slightly differently.","When it expands, it can force the flexures 636 to stretch and causes a contraction in the orthogonal direction.","The screws 634 are used to apply a preload to the piezoelectric material 632.This arrangement can be used to amplify translation and is a function of the angle between the flexure and the piezoelectric actuator θT3: Δ y Δ x = - cot ( θ T3 ) ( 22 ) As the piezoelectric actuator expands in the x-direction (indicated in FIG.","6C), the contraction in the y-direction can be a function of the angle.","As the angle becomes shallower, the displacement becomes larger.","At an angle of about 30 degrees, the contraction can be 1.7 times the expansion of the piezoelectric material 632.In practice, the deformation of other mechanical components may limit the contraction.","FIGS.","6D and 6E illustrate another piezoelectric actuation system 601 using four actuators 611a, 611b, 611c, and 611d.","The four actuators 611a to 611d are disposed in parallel with each other.","Motions that can be achieved by the four actuators 611a to 611d include translation 621a, tip 621b, and tilt 621c, as illustrated in FIG.","6D.","FIG.","6E also shows a mirror 631 and the corresponding motions including translation 621a, tip 621b, and tilt 621c.","Parallel actuators can achieve higher bandwidths due to increased system stiffness between the piezoelectric actuators 611a to 611d and the location of the mirror 631.Here, four piezoelectric actuators 611a to 611d act together to move the mirror 631.If all four piezoelectric actuators 611a to 611d expand, then the mirror 631 translates.","If only the top two actuators 611a and 611b or the bottom two actuators 611c and 611d expand, then the mirror 631 tips.","If only the left two actuators 611a and 611c or the right two actuators 611b and 611d expand, then the mirror 631 tilts.","The actuation system 601 also allows for both positive and negative tip and tilt and does not require a preload force or preload voltage for those motions.","Methods of Spectral Imaging Using Actual Positions of the Moving Reflector FIG.","7 illustrates a method 700 of spectral imaging using actual locations of the moving reflector.","At step 710 of the method 700, a splitter can split an input light beam, which can be reflected, scattered, or emitted by an object to be imaged, into two portions: a first portion and a second portion.","A first reflector then reflects the first portion of the input light beam and a second reflector reflects the second portion of the input light beam, at step 720.The first portion and the second portion of the input light beam, after reflection by the corresponding reflector, can interact at a detector plane to form an interference pattern (also referred to as an autocorrelation).","At step 730 of the method 700, the second reflector is moved to a first position (e.g., using an actuator), which is measured at step 740.A detector then detects a first interference pattern, at step 750, when the second reflector is at the first position.","Similarly, at step 760 of the method 700, an actuator can move the second reflector to a second position, which is measured at step 770.The detector then detects a second interference pattern, at step 780, when the second reflector is at the second position.","The loop of moving the second reflector, measuring the position of the second reflector, and acquiring autocorrelation can be repeated many times until a sufficient number of autocorrelations are acquired for image reconstruction at step 790.The reconstruction of the spectral image uses the acquired autocorrelations as well as the measured actual positions of the second reflector.","FIGS.","8A-8D show experimental results of spectral imaging using actual positions of the moving reflector for reconstruction.","The data is taken at a frame rate of 2010 fps.","FIG.","8A shows the reconstructed spectral images when data is taken at a step size of 0.2 μm and the moving reflector is controlled by only a motor.","Spectrum 801 is reconstructed using desired positions of the moving reflector, while spectrum 802 is reconstructed using measured positions of the moving reflector.","FIG.","8B shows the reconstructed spectral images when data is taken at a step size of 0.2 μm and the moving reflector is controlled by a motor and a piezoelectric actuator.","Spectrum 803 is reconstructed using desired positions of the moving reflector, while spectrum 804 is reconstructed using measured positions of the moving reflector.","FIG.","8C shows the reconstructed spectral images when data is taken at a step size of 1 μm and the moving reflector is controlled by a motor only.","Spectrum 805 is reconstructed using desired positions of the moving reflector, while spectrum 806 is reconstructed using measured positions of the moving reflector.","FIG.","8D shows the reconstructed spectral images when data is taken at a step size of 1 μm and the moving reflector is controlled by a motor and a piezoelectric actuator.","Spectrum 807 is reconstructed using desired positions of the moving reflector, while spectrum 808 is reconstructed using measured positions of the moving reflector.","FIGS.","8A-8D show that at step sizes of 1.0 μm, the motor-only control method produces extra peaks in the data that are not present when hybrid control (motor and piezoelectric actuator) is used.","The extra peaks in the data can be eliminated by calculating the Fourier transforms using the measured positions rather than using the equally spaced desired positions.","Since the motor only controller may not accurately position the mirror at 2010 fps, the measured position and desired positions are very different.","By using a least squares solver or any other solver (e.g., an adaptive sampling method, and an iterative sampling method) that is capable of incorporating the sampling location, the error due to positioning inaccuracies can be removed.","The method 700 illustrated in FIG.","7 can also be useful in developing small imaging spectrometers for handheld applications, where either the spectrometer or the source being tested may be held by a human.","Humans are not good at maintaining accurate positions and are a source of vibrations.","Therefore, it is helpful to consider the effects of disturbances caused by humans on the measurement accuracy.","Conventional methods to address human disturbances include image tracking (e.g., edge tracking) and machine vision methods.","However, there is a challenge in using these methods for spectral imaging because the edges of interferograms tend to move from image to image for some experiments.","For situations where there is no tilt, the image brightness can instead change from image to image.","Alternative methods for image tracking can be used for these cases.","One approach to the problem can be sampling at a rate that is significantly faster than the rate of human motion.","For example, if only 10 frames are required to make the spectral image with the desired spectral resolution and if the human motion was on the order of 5 Hz, it is possible to sample at 2000 fps and obtain all the desired images in 5 ms.","This is much faster than frequency of the human motion so the objects of interest may not have moved much from frame to frame.","By sampling quickly, human motion disturbances can be rejected.","In addition, the blur from human motion can be removed if the sampling is faster.","In order to push the limits of the sampling rate, the approached used in the method 700 can be utilized to obtain accurate spectra at speeds that may be beyond the capabilities of the actuator.","Irregular Sampling In spectral imaging techniques, the Fourier transform can be used to convert interference patterns into spectra.","This transform, however, has many limitations.","First the data is usually sampled at evenly spaced intervals at the Nyquist frequency, which usually means a large number of samples are taken to generate a spectral image.","For example, if a 5 nm resolution at λ0=850 nm is desired, over 700 samples would be taken.","If the camera is sampling at 30 frames per second, gathering a full hyperspectral image may take up to 23 seconds.","Even for a high-speed camera at 2000 frames per second, a video rate spectrum may not be achieved.","This is a clear limitation of Fourier transform methods that utilize traditional uniform sampling at the Nyquist frequency.","In order to reduce the sampling rate while maintaining the desired resolution, a variety of irregular sampling methods can be used.","Examples of irregular sampling techniques include under-sampling, non-uniform sampling, optimal sampling, adaptive sampling, and recursive update techniques.","These methods can be used in conjunction with advanced solution methods other than the fast Fourier transform (FFT) or the discrete Fourier transform (DFT).","The advanced solution methods include techniques like the L1 or L2 (least squares) techniques or fast digital filtering methods for real-time custom color filtering.","Generalized Solution The solution method presented here can be derived from fast orthogonalization techniques used for sampling Fourier transform data and for solving Volterra kernels.","The general solution for any sampling method can be obtained from setting up the problem in an equation of the form: y(n)=Σm=1MAmPm(n)+e(n) (23) with matrix form Y=PA+E, where P1(n)=1, P2i(n)=cos(ωiz(n)/c), P2i+1(n)=sin(ωiz(n)/c).","Here y(n) is the intensity of the interferometric pattern acquired by the detector (e.g., detector 160 shown in FIG.","1A) while the moving reflector 130 is at location z(n), e(n) is the error and Am contains the spectral information (i.e., the coefficient for spectral component at wavelength λm).","The matrix Pm is constructed from real trigonometric polynomials and contains the guesses for different frequencies ωi and the locations where measurements are taken z.","To convert frequencies to wavelengths, the equation λi=2πν/(ωi) can be used, where ν=c/n1 is the refractive index of the material propagating the input light beam.","Note that equation (23) is a Hartley transform and not a Fourier transform as all constants are real.","Also note that there is no restriction on sampling interval thereby allowing non-uniform sampling.","Many possible ways can be used to solve equation (23) and derive the spectral information contained in Am.","For example, an L2 norm solution, also known as least square (LS) method can be used, in which case: Â=(PTP)−1PTY (24) Once the solution A is acquired, the results can be mapped back to a magnitude and phase so as to reconstruct a spectral image: Ji=√{square root over (A2i2+A2i+12)} (25) ζi=tan−1(A2i+1/A2i) (26) Note that there is no restriction on sampling interval thereby allowing non-uniform sampling and under-sampling.","The flexible form of the matrix P allows for any choice of desired frequencies, even no-continuous groups of frequencies indicating many different sets of spectral limits, thereby enabling adaptive sampling.","This matrix form can also be used for recursive update algorithms.","Because the true relative phase content of the input light is not preserved in an interferometric measurement, it is therefore not necessary to preserve the phase content in the transform.","The phase information can therefore be ignored.","The magnitude information can map directly to the spectrum of the measurement.","If the amount of data acquired is more than twice the number of wavelengths present in the data (and wavelengths queried), then the L2 algorithm can be used.","If the data are sparse, and the amount of data acquired is less than twice the number of wavelengths queried, then an L1 method or an adaptive or iterative L2 algorithm can be used.","Non-Baseband Sampling Methods In traditional Fourier transform sampling methods, the sampling is usually half the spacing of the lowest wavelength of interest in order to avoid aliasing (Nyquist sampling λmin 2Δz), the maximum wavelength is equal to the sampling range λmax=NΔz, and the number of samples obtained at this spacing determines the resolution of the spectrum.","The wavenumber (generally presented in units of cm−1), which is the inverse of the wavelength υ=1/λ, can be used to determine the resolution of the spectrum: Δ v = 1 z max - z min ≈ Δλ λ 2 ( 27 ) If the sampling is equally spaced, then Δυ=1/(NΔz) is also true.","The wavelength resolution is approximately Δλ≈λ2/(NΔz) at any given wavelength λ.","This wavelength range with this resolution can be defined as baseband sampling.","By looking at these equations, it is clear that resolution is driven only by the range of sampling.","Therefore, it may be possible to ignore the Nyquist sampling limit to achieve a desired wavelength resolution by under-sampling the spectrum if the incoming light is limited only to a certain band of wavelengths.","For example, if silicon-based photodiodes are used, the wavelengths can be limited to between about 300 nm and about 1100 nm.","If the band limits λmax and λmin are known, then the Shannon non-baseband sampling rate can be: Δ z = 1 2 λ min [ λ max λ max - λ min ] ( 28 ) The brackets in this equation indicate taking the integer floor value of the ratio inside the brackets.","By utilizing the known band limits of the spectrum, the number of samples for reconstructing the spectrum can be reduced by three to five times, thereby increasing the sampling speed.","Under-sampling or non-baseband sampling is a technique where the sampling interval is larger than the Nyquist sampling interval.","Traditionally, this type of sampling is discouraged because it tends to cause aliased data to fold into un-aliased data.","However, if the band limits of the system are known, it is possible to prevent folding and use the aliased data directly.","This technique can dramatically cut down on the number of data points and can dramatically increase the spectra update rate.","Another method that can be used with known band limits is the optical under-sampling method.","Because of trade-off in terms of speed and noise, a cost function can be created to determine the optimal under-sampling interval for a given weight of importance of noise relative to sampling and computation time.","For example, the system can be restricted to a constant spectral resolution with a constant set of desired spectral points.","An optimal under-sampling interval can be determined using a cost function where the noise ratio f(Δz), data acquisition time g(Δz), and solution time h(Δz) are considered with relative scaling constants K1, K2 and K3, respectively.","The sampling interval region can be restricted by the Nyquist sampling rate, the maximum possible sampling step size, the maximum allowable sampling time, and the maximum allowable signal to noise ratio: arg min Δ z K 1 f ( Δ z ) + K 2 g ( Δ z ) + K 3 h ( Δ z ) subject to Δ z ∈ [ max ( Δ z Nyquist , T max ) , min ( Δ z Shannon , SNR max ) ] .","( 29 ) Adaptive Under-Sampling In many cases, nothing is known about the spectra before the data are obtained.","In this case, it is possible to slowly learn more and more about the spectrum as the data is acquired and adapt the sampling intervals as more information is obtained.","Adaptive under-sampling takes advantage of the fact that the act of obtaining more data points in the spectra automatically yields more spectral data.","Since there is more information about the underlying spectrum, it is then possible to tailor the input to converge on the optimal, wider sampling interval over a single sampling sweep, thereby producing the desired spectral resolution faster.","For example, a controller implementing adaptive sampling may slowly increase the sampling interval as it learns more about the underlying spectra.","Existing adaptive sampling methods are typically purely mathematical solution techniques and do not provide direction on how the data should be adaptively sampled.","The spectral data obtained from imaging Fourier transform spectra presents a unique case where the true underlying spectrum is fixed for a given sample and can be sampled adaptively at any desired position at any time.","In addition, the spectra can have incoherent or broadband data concentrated at the center of the interferometer alignment, which is treated differently than the narrowband data.","These factors lead to a unique adaptive under-sampling algorithm that can be effectively implemented for imaging Fourier transform spectrometers.","FIG.","9 illustrates a method 900 of adaptive sampling that can be executed by a controller or other processor of or coupled to a spectral imaging device.","At the first step 910, a user determines the desired resolution and initial sampling rate, which is related to the known band limits λmax and λmin: Δ z 0 = 1 2 λ min [ λ max λ ma x - λ min ] where z i = z i - 1 + Δ z 0 .","( 30 ) Then a small number of initial samples No are collected near the interferogram center at step 920 of the method 900.Once this is completed, the low-resolution spectra is calculated, at step 930, using the generalized solver.","Using the small number of initial samples can also force the system to sample the center of the interferogram more heavily, thereby capturing more of the broadband spectral data.","When this result is obtained, the controller proceeds to step 940, where the limits (locations in the spectra where information exists and the value is above δL) can be determined, thereby allowing the calculation of the occupancy (ratio of occupied to total spectral data points).","Determining the occupancy in turn allows the selection of the next sampling step with some relaxation term R≥1 and an occupancy Γi=Noccupiedi/Ntotali where, Δ z _ ≤ 1 2 λ min R Γ i [ λ max λ ma x - λ min ] And z i = z i - 1 + Δ z i .","( 31 ) Once some samples are taken, the method proceeds to step 950, where the spectra are recalculated using the method outlined above and the procedures are repeated until the desired resolution is achieved.","Note here that an L2 norm algorithm requires that the limits become smaller (only occupied parts of the spectra are set up in the calculation of ωi) because there would otherwise not be enough data to solve the problem.","An L1 norm algorithm would not have such a restriction but would run much slower.","The shrinking limits in the algorithm make the L2 norm solution feasible.","In addition, the controller can continue until the limits stop changing or at some predefined number of iterations.","The controller can then switch to constant sampling at the maximum interval until the final desired resolution is reached.","Recursive Spectral Update For many applications, it can be desirable to do continuous spectral sampling.","When the spectrum of the image changes slightly during the acquisition process, it may not be desirable to completely resample the spectra.","Instead, old data points from the interferogram can be forgotten and replaced with information from new data points.","This allows a gradual adaptation or recursive updating of the calculated spectra and gives the user intermediate information about the system.","While adaptive sampling reduces the number of images necessary to produce a full spectral image, recursive sampling can be used to update the spectral information between full spectral images.","For example, if 500 images taken at 2000 frames per second are used to create a single full spectral image, the full spectral image rate can be 4 full spectra per second.","If the controller/processor uses a recursive sampling algorithm, it can make small updates to the spectral image after each image.","This allows the recursively sampled full spectral image rate to be as high as 40 (update group size of 50) up to 2000 (update group size of 1) frames per second.","This can be useful for pushing the spectral update to the user at faster rates.","Possible applications include video monitoring of changes in biological fluorescence to events during chemical mixing causing changes in the Raman spectra.","Alterations in blood oxygen content of an entire image as a function of heart rate could also be monitored.","Digital Filtering Unlike other methods that attempt to improve sampling speed or update rates, the digital filtering methods presented in this section attempt to create color images from the “black and white” data obtained from the spectrometer in a fast and effective manner that does not require taking a full FFT or solving the LS equations.","The digital filtering method uses a lower (minimal) number of simple calculations per pixel and tracks motions at video rates while reproducing color images from the black and white data.","Examples of applications include tracking different fluorescent peaks, tracking different Raman peaks while collecting a minimal amount of data, and simply converting data from a black and white camera to color without the use of Bayer masks or rotating filter disks.","The digital filter methods described herein can create color images from any set of wavelength bands and can assign as many colors to as many wavelength bands as desired.","In general, broadband colors, similar to the Bayer filters in traditional color cameras, can be relatively quick and easy to reproduce from interferometric data because those filters are so broad that only a few terms are needed to create a filter for those wavelengths.","It can be more challenging when there are narrowband colors, such as two laser wavelengths that are very close together and a third that is further away.","FIG.","10 illustrates a method 1000 of digital filtering and creating color images from black-and-white images.","This method can be performed by suitably programmed or operated versions of the spectral imaging device described above.","At step 1010 of the method 1000, a processor/controller acquires black-and-white images (the total number of images is denoted as M).","Light beams that create these black-and-white images (also referred to as raw images) can include three spectral components: one at 532 nm, another at 808 nm, and a third component at 850 nm.","Once the raw images are obtained, a filter receives each raw image and splits the image into different pixels.","Each pixel is passed through three different bandpass filters that cover distinct wavelength ranges, at step 1020.The output of the filter is then sent to a moving average filter and the resulting data can be reconstructed into a color image, at step 1030.A series of black-and-white images with interferometric data therefore can become a series of color images through this process.","At least two types of filters can be used here: one filter includes uniform sampling and the other filter includes non-uniform sampling.","There are two major classes of digital filters, infinite impulse response (IIR) filters and finite impulse response (FIR) filters.","The following sections teach how different filters can be designed so that black and white video can be converted to color video in real time with some fixed delay.","To design the high pass, low pass, or bandpass filters, the wavelengths of interest and the bandwidths of those wavelengths are required.","To reduce ambiguity between different filters for different colors, the overlap of multiple filters should be minimized.","Once the filters for a particular sampling scheme (either uniform or non-uniform) are obtained, the digital filter plus the moving average step can be used on each pixel of the black and white video to determine the intensity for each wavelength of interest.","This can be combined to form the color video.","Uniform Sampling Digital filters, in this case, work on time series data.","For example, a very simple digital filter could take an average of two data points (intensity levels on one pixel at two different times) at samples n and n−1 to produce an output for sample n. An IIR filter works by considering the data from both the input data (raw pixel intensities at different time steps) and the previously created output data from the previous time steps.","This is then used to create a new output for the current time step.","With being bound by any particular theory or mode of operation, an IIR filter has a transmission function of the form: y ( n ) = 1 a 0 ∑ i = 0 Q b b i x ( n - i ) - ∑ j = 1 Q a b j y ( n - j ) ( 32 ) with both feed-forward filter coefficients bi and feedback filter coefficients aj.","Generally, fewer terms are necessary in the IIR domain than in the FIR domain for similar filter cutoffs due to the feedback terms.","These IIR filters can be generally more difficult to convert from any time-domain design using a bilinear transform or Tustin transform and are much more straightforward to design directly in the digital domain.","In one example, a digital IIR filter based on an analog Butterworth filter can be designed for the wavelength at 532 nm because it is sufficiently far away from the other two wavelengths.","Elliptical filters can be designed for the 808 nm and 850 nm filters.","Elliptical filters usually have sharper cutoffs for the same filter order but have more ripples.","The wider the filter in frequency space, the less delay there is in time.","For this reason, the edges of the red and green filters can be used to separate the 808 nm from the 850 nm while allowing the filters to be fairly wide overall.","In general, these filters can track motions up to about 40 fps when video is taken at 2010 fps.","An FIR filter works by considering only the input data (raw pixel intensities at different time steps) in the creation of the output for the current time step.","FIR filters generally use more computations for the similar filter cutoff characteristics but they can have a constant delay equal to half their filter order.","For FIR filters, the order is Qb.","FIR filters are also easier to generate from continuous domain filter designs.","An FIR filter has the form: y(n)=Σi=0Qbbix(n−i) (33) In one example, the red and green filters can be very narrow and have an order of Qb=100 samples (delay of 50 samples).","The blue filter can be much broader and has an order of 30 (delay of 15).","Because these filters normally do not have a flat region, it can be challenging to use just the edges of the filter to separate the two wavelengths as with the IIR filter.","For this same reason, the rejection ratio of the green filter for information at 850 nm and the red filter for information at 808 nm can be potentially lower for the FIR designs.","Non-Uniform IIR Digital Filtering Filters with the ability to handle non-uniform spacing can be used to correct for those small positioning errors and can be further used for other applications with non-uniform sampling, such as adaptive sampling or random sampling schemes.","One example of such filter can be IIR filter.","To create a non-uniform sampling IIR filter, a consistent master design can be created in the continuous domain and converted to the digital domain.","The more accurate conversion processes may use a Tustin transform, which involves a matrix inversion, although there are some other approximations that are slightly more efficient.","A continuous domain filter design in state space form can be converted to the digital domain.","Here, the input vector is x(z), the output vector is y(z), the state variable is w(z) and they are all a function of position z: dw ( z ) dz = A d w ( z ) + B d x ( z ) ( 34 ) y ( z ) = C d w ( z ) + D d x ( z ) ( 35 ) There are several possible approximations that can be made.","The first is an Euler approximation, wn=(I+ΔznAd)wn-1+BdΔznxn-1 (36) yn=Cdwn+Ddxn (37) The second type of approximation is the bilinear approximation or Tustin transform: w n - w n - 1 Δ z n = A d w n + w n - 1 2 + B d x n + x n - 1 2 ( 38 ) which has a solution of the form: w n = ( I - Δ z n 2 A d ) - 1 ( I + Δ z n 2 A d ) w n - 1 + 1 2 Δ z n ( I - Δ z n 2 A d ) - 1 B d ( x n + x n - 1 ) ( 39 ) y n = C d w n + D d x n ( 40 ) Non-Uniform FIR Digital Filtering One benefit of using FIR filter designs for non-uniform sampling filter designs is that FIR models translate easily from continuous domain designs.","After creating a continuous domain filter, it is possible to simply resample the filter at different points corresponding to the non-uniform sampling points.","From a time-domain or frequency domain master filter (with all windowing removed), two vectors can be generated.","The first vector can be the master filter and the second vector can be the associated uniformly sampling space vector.","In general, the master filter can be over-sampled slightly to improve resampling accuracy later.","For uniform spacing, the master filter vector is: bi=bimΔz (41) The non-uniform filter can be slightly more complex.","Because the sampling is non-uniform, it can be desirable for the filter to have the same non-uniform spacing as the sampling.","If the sampling position vector is known then: b i = b i m Δ z i or b i = b i m + b i + 1 m 2 Δ z i ( 42 ) where the first equation uses the instantaneous value and the second equation uses the trapezoid rule.","The master filter can be resampled every time the filter is updated (once for each new frame) which can take longer to compute but is relatively simple to execute.","The same filter design described in the uniform-sampling FIR filter can be modified for use with this non-uniform FIR filter scheme.","CONCLUSION While various inventive embodiments have been described and illustrated herein, those of ordinary skill in the art will readily envision a variety of other means and/or structures for performing the function and/or obtaining the results and/or one or more of the advantages described herein, and each of such variations and/or modifications is deemed to be within the scope of the inventive embodiments described herein.","More generally, those skilled in the art will readily appreciate that all parameters, dimensions, materials, and configurations described herein are meant to be exemplary and that the actual parameters, dimensions, materials, and/or configurations will depend upon the specific application or applications for which the inventive teachings is/are used.","Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many equivalents to the specific inventive embodiments described herein.","It is, therefore, to be understood that the foregoing embodiments are presented by way of example only and that, within the scope of the appended claims and equivalents thereto, inventive embodiments may be practiced otherwise than as specifically described and claimed.","Inventive embodiments of the present disclosure are directed to each individual feature, system, article, material, kit, and/or method described herein.","In addition, any combination of two or more such features, systems, articles, materials, kits, and/or methods, if such features, systems, articles, materials, kits, and/or methods are not mutually inconsistent, is included within the inventive scope of the present disclosure.","Also, various inventive concepts may be embodied as one or more methods, of which an example has been provided.","The acts performed as part of the method may be ordered in any suitable way.","Accordingly, embodiments may be constructed in which acts are performed in an order different than illustrated, which may include performing some acts simultaneously, even though shown as sequential acts in illustrative embodiments.","All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and/or ordinary meanings of the defined terms.","The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.” The phrase “and/or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases.","Multiple elements listed with “and/or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined.","Other elements may optionally be present other than the elements specifically identified by the “and/or” clause, whether related or unrelated to those elements specifically identified.","Thus, as a non-limiting example, a reference to “A and/or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.","As used herein in the specification and in the claims, “or” should be understood to have the same meaning as “and/or” as defined above.","For example, when separating items in a list, “or” or “and/or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items.","Only terms clearly indicated to the contrary, such as “only one of” or “exactly one of,” or, when used in the claims, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements.","In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e.","“one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of” “Consisting essentially of,” when used in the claims, shall have its ordinary meaning as used in the field of patent law.","As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements.","This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified.","Thus, as a non-limiting example, “at least one of A and B” (or, equivalently, “at least one of A or B,” or, equivalently “at least one of A and/or B”) can refer, in one embodiment, to at least one, optionally including more than one, A, with no B present (and optionally including elements other than B); in another embodiment, to at least one, optionally including more than one, B, with no A present (and optionally including elements other than A); in yet another embodiment, to at least one, optionally including more than one, A, and at least one, optionally including more than one, B (and optionally including other elements); etc.","In the claims, as well as in the specification above, all transitional phrases such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “holding,” “composed of,” and the like are to be understood to be open-ended, i.e., to mean including but not limited to.","Only the transitional phrases “consisting of” and “consisting essentially of” shall be closed or semi-closed transitional phrases, respectively, as set forth in the United States Patent Office Manual of Patent Examining Procedures, Section 2111.03."]],"string":"[\n [\n \"Systems, Apparatus, and Methods for Spectral Imaging\",\n \"A spectral imaging system includes an autocorrelator to generate different autocorrelations when the moving reflector in the autocorrelator is at different positions so as to reconstruct spectral images.\",\n \"The system also includes a position measurement system to measure the actual positions of the moving reflector when autocorrelations are taken.\",\n \"These actual locations, instead of the desired locations in conventional methods, are then used to reconstruct the spectral image.\",\n \"This approach can address the misalignment of the moving reflector from its desired location (due to external disturbances, slow actuator dynamics, and other factors) in conventional spectral imaging techniques and allow the development of high-resolution, high-stability, portable imaging spectrometers for the general public.\"\n ],\n [\n \"1.A spectral imaging system comprising: a beam splitter to receive an input light beam reflected or scattered from a sample and to split the input light beam into a first portion and a second portion; a first reflector, in optical communication with the beam splitter, to reflect the first portion of the input light beam; a second reflector, in optical communication with the beam splitter, to reflect the second portion of the input light beam; an actuator, operably coupled to the second reflector, to move the second reflector along a propagation direction of the second portion of the input light beam; a position measurement system, operably coupled to the second reflector, to measure a position of the second reflector; a detector, disposed at an intersection between the first portion of the input light beam and the second portion of the input light beam, to detect an interference pattern created by the first portion of the input light beam and the second portion of the input light beam; and a processor, operably coupled to the position measurement system and the detector, to generate a spectral image of the sample based at least in part on the position acquired by the position measurement system and the interference pattern acquired by the detector.\",\n \"2.The spectral imaging system of claim 1, wherein the actuator is configured to place the second reflector at a plurality of non-uniformly spaced positions.\",\n \"3.The spectral imaging system of claim 1, wherein the actuator is configured to move the second reflector to more than 30 positions per second, and wherein the detector is configured to operate at a frame rate greater than 30 fps.\",\n \"4.The spectral imaging system of claim 1, wherein the actuator is configured to move the second reflector at a step size substantially equal to or greater than 1 μm.\",\n \"5.The spectral imaging system of claim 1, wherein the actuator is configure to move the second reflector through a distance of about 0.5 mm to about 3 mm.\",\n \"6.The spectral imaging system of claim 1, wherein the position measurement system comprises: a laser, in optical communication with the first mirror and the second mirror via the beam splitter, to transmit a probe laser beam through the beam splitter, the beam splitter directing a first part of the probe laser beam toward the first reflector and a second part of the probe laser beam toward the second reflector; and an array of photodiodes, in optical communication with the first reflector and the second reflector via the beam splitter, to detect a probe interference pattern formed by the first part of the probe laser beam after reflection from the first reflector and the second part of the probe laser beam after reflection from the second reflector.\",\n \"7.The spectral imaging system of claim 6, wherein the laser source comprises a vertical-cavity surface-emitting laser.\",\n \"8.The spectral imaging system of claim 6, wherein the probe laser beam has a linewidth of less than 0.1 nm.\",\n \"9.The spectral imaging system of claim 1, wherein the processor is configured to estimate the spectral image of the sample using at least one of a least squares method, an adaptive sampling method, and an iterative sampling method.\",\n \"10.The spectral imaging system of claim 1, further comprising: a piezoelectric actuator, operably coupled to at least one of the first reflector and the second reflector, to move the at least one of the first reflector and the second reflector toward a desired position.\",\n \"11.A method of spectral imaging, the method comprising: splitting an input light beam reflected or scattered from a sample with a beam splitter into a first portion and a second portion; reflecting the first portion of the input light beam with a first reflector; reflecting the second portion of the input light beam with a second reflector, the second reflector being at a first position in a plurality of positions along a propagation direction of the second portion of the input light beam; performing measurement of the first position of the second reflector; detecting a first interference pattern created by the first portion of the input light beam and the second portion of the input light beam when the second reflector is at the first position; moving the second reflector to a second position in the plurality of positions along the propagation direction of the second portion of the input light beam; performing measurement of the second position of the second reflector; detecting a second interference pattern created by the first portion of the input light beam and the second portion of the input light beam when the second reflector is at the second position; generating a spectral image of the sample based at least in part on the measurement of the first position, the measurement of the second position, the first interference pattern, and the second interference pattern.\",\n \"12.The method of claim 11, wherein the first plurality of positions are non-uniformly spaced along the propagation direction of the second portion of the input light beam.\",\n \"13.The method of claim 11, wherein moving the second reflector comprises moving the second reflector to more than 30 positions per second, and the method further comprises detecting a plurality of interference patterns at a frame rate greater than 30 fps.\",\n \"14.The method of claim 11, wherein moving the second reflector comprises moving the second reflector at a step size substantially equal to or greater than 1 μm.\",\n \"15.The method of claim 11, wherein moving the second reflector comprises moving the second reflector through a distance of about 0.5 mm to about 3 mm.\",\n \"16.The method of claim 11, wherein performing the measurement of the first position comprises: directing a first part of a probe laser beam toward the first reflector and directing a second part of the probe laser beam toward the second reflector; interfering the first part of the probe laser beam after reflection from the first reflector and the second part of the probe laser beam after reflection from the second reflector to form a probe interference pattern; detecting the probe interference pattern using an array of photodiodes; and estimating the first position of the second reflector based at least in part on the probe interference pattern.\",\n \"17.The method of claim 16, further comprising: emitting the probe laser beam from a vertical-cavity surface-emitting laser.\",\n \"18.The method of claim 16, wherein the probe laser beam has a linewidth less than 0.1 nm.\",\n \"19.The method of claim 11, wherein generating the spectral image of the sample comprises generating the spectral image using at least one of a least squares method, an adaptive sampling method, and an iterative sampling method.\",\n \"20.The method of claim 11, further comprising: adjusting at least one of the first reflector or the second reflector toward a desired position using a piezoelectric actuator.\",\n \"21.A spectral imaging system comprising: an autocorrelator to create an autocorrelation pattern of an input light beam reflected or scattered from a sample, the autocorrelator comprising: a beam splitter to split the input light beam into a first portion and a second portion; a first reflector to reflect the first portion of the input light beam; a second reflector to reflect the second portion of the input light beam; and a detector, disposed at an intersection between the first portion of the input light beam and the second portion of the input light beam, to detect an autocorrelation pattern created by the first portion of the input light beam and the second portion of the input light beam; a positioning and measurement system operably coupled to the second reflector, the positioning and measurement system comprising: an actuator to place the second reflector at a plurality of positions non-uniformly spaced along a propagation direction of the second portion of the input light beam; a laser source to emit a probe laser beam toward the beam splitter, the beam splitter directing a first part of the probe laser beam toward the first reflector and directing a second part of the probe laser beam toward the second reflector; and an array of photodiodes, in optical communication with the first reflector and the second reflector via the beam splitter, to detect a probe interference pattern formed by the first part of the probe laser beam after reflection from the first reflector and the second part of the probe laser beam after reflection from the second reflector; and a processor, operably coupled to the autocorrelator and the positioning and measurement system, to estimate the plurality of positions of the second reflector based at least in part on the probe interference pattern and further to generate a spectral image of the sample based at least in part on the plurality of positions of the second reflector and the autocorrelation pattern of the input light beam.\"\n ],\n [\n \" BACKGROUND An imaging spectrometer is a device that can take a series of images that include information from a variety of wavelengths of light at fine spectral resolution.\",\n \"When an imaging spectrometer device senses different types of input light, such as ambient light for absorption measurements or laser light for fluorescence or Raman measurements, it can differentiate between materials that are usually indistinguishable to the naked eye in a nondestructive, non-contact manner.\",\n \"Compared to single-point instruments, an imaging spectrometer can monitor many points at the same time and be much more easily positioned relative to the object of interest, vastly improving usability.\",\n \"The ability to switch between regular and hyperspectral imaging makes it possible to align the spectrometer with respect to the sample without an additional alignment camera.\",\n \"Faster imaging spectrometer systems can be incorporated with image stabilization and object tracking algorithms to account for human or object motion, which can be difficult for a non-imaging system.\",\n \"Being able to select the wavelength resolution on the fly and to obtain high spectral resolution images (e.g., with resolutions of 1.6 cm −1 for Raman spectroscopy to 70 cm −1 for low resolution spectroscopy) is also desirable for practical applications.\",\n \"Due to the above advantages, imaging spectrometers can be useful in many applications, such as space probes, biological imaging, air pollution investigation, and health care monitoring, among others.\",\n \"However, existing imaging spectrometers are usually bulky and not readily accessible to the general population, since they are typically mounted to optical tables and include complex components to reject external vibrations.\"\n ],\n [\n \" SUMMARY Systems, apparatus, and methods described herein are directed to spectral imaging.\",\n \"In one example, a spectral imaging system includes a beam splitter to receive an input light beam reflected or scattered from a sample and to split the input light beam into a first portion and a second portion.\",\n \"A first reflector is in optical communication with the beam splitter to reflect the first portion of the input light beam and a second reflector is in optical communication with the beam splitter to reflect the second portion of the input light beam.\",\n \"The system also includes an actuator, operably coupled to the second reflector, to move the second reflector along a propagation direction of the second portion of the input light beam.\",\n \"A position measurement system is operably coupled to the second reflector to measure a position of the second reflector.\",\n \"A detector is disposed at an intersection between the first portion of the input light beam and the second portion of the input light beam to detect an interference pattern created by the first portion of the input light beam and the second portion of the input light beam.\",\n \"The system further includes a processor, operably coupled to the position measurement system and the detector, to generate a spectral image of the sample based at least in part on the position acquired by the position measurement system and the interference pattern acquired by the detector.\",\n \"In another example, a method of spectral imaging includes splitting an input light beam reflected or scattered from a sample with a beam splitter into a first portion and a second portion.\",\n \"The method also includes reflecting the first portion of the input light beam with a first reflector and reflecting the second portion of the input light beam with a second reflector.\",\n \"The second reflector is at a first position in a plurality of positions along a propagation direction of the second portion of the input light beam.\",\n \"The method further includes performing measurement of the first position of the second reflector and detecting a first interference pattern created by the first portion of the input light beam and the second portion of the input light beam when the second reflector is at the first position.\",\n \"The method also includes moving the second reflector to a second position in the plurality of positions along the propagation direction of the second portion of the input light beam and performing measurement of the second position of the second reflector.\",\n \"A second interference pattern is created by the first portion of the input light beam and the second portion of the input light beam when the second reflector is at the second position.\",\n \"The method further includes generating a spectral image of the sample based at least in part on the measurement of the first position, the measurement of the second position, the first interference pattern, and the second interference pattern.\",\n \"More spectral images can then be generated by combining the previously acquired interference patterns with additional interference patterns acquired at subsequent actual positions.\",\n \"In yet another example, a spectral imaging system includes an autocorrelator to create an autocorrelation pattern of an input light beam reflected or scattered from a sample.\",\n \"The autocorrelator includes a beam splitter to split the input light beam into a first portion and a second portion, a first reflector to reflect the first portion of the input light beam, a second reflector to reflect the second portion of the input light beam, and a detector, disposed at an intersection between the first portion of the input light beam and the second portion of the input light beam, to detect an autocorrelation pattern created by the first portion of the input light beam and the second portion of the input light beam.\",\n \"The spectral imaging system also includes a positioning and measurement system operably coupled to the second reflector.\",\n \"The positioning and measurement system includes an actuator to place the second reflector at a plurality of positions non-uniformly spaced along a propagation direction of the second portion of the input light beam.\",\n \"The positioning and measurement system also includes a laser source to emit a probe laser beam toward the beam splitter.\",\n \"The beam splitter directs a first part of the probe laser beam toward the first reflector and directing a second part of the probe laser beam toward the second reflector.\",\n \"An array of photodiodes is in optical communication with the first reflector and the second reflector via the beam splitter to detect a probe interference pattern formed by the first part of the probe laser beam after reflection from the first reflector and the second part of the probe laser beam after reflection from the second reflector.\",\n \"The spectral imaging system further includes a processor, operably coupled to the autocorrelator and the positioning and measurement system, to estimate the plurality of positions of the second reflector based at least in part on the probe interference pattern.\",\n \"The processor also generates a spectral image of the sample based at least in part on the plurality of positions of the second reflector and the autocorrelation pattern of the input light beam.\",\n \"It should be appreciated that all combinations of the foregoing concepts and additional concepts discussed in greater detail below (provided such concepts are not mutually inconsistent) are contemplated as being part of the inventive subject matter disclosed herein.\",\n \"In particular, all combinations of claimed subject matter appearing at the end of this disclosure are contemplated as being part of the inventive subject matter disclosed herein.\",\n \"It should also be appreciated that terminology explicitly employed herein that also may appear in any disclosure incorporated by reference should be accorded a meaning most consistent with the particular concepts disclosed herein.\"\n ],\n [\n \"CROSS-REFERENCES TO RELATED APPLICATIONS This application is a bypass continuation of International Application No.\",\n \"PCT/US2016/042512, filed Jul.\",\n \"15, 2016, and entitled “SYSTEMS, APPARATUS, AND METHODS FOR SPECTRAL IMAGING,” which in turn claims the priority benefit, under 35 U.S.C.\",\n \"§ 119(e), of U.S.\",\n \"Application No.\",\n \"62/192,824, filed Jul.\",\n \"15, 2015, entitled “MINIATURE, HIGH-SPEED IMAGING TRANSFORM SPECTROMETERS AND ADVANCED SAMPLING ALGORITHMS.” Each of these applications is hereby incorporated herein by reference in its entirety.\",\n \"BACKGROUND An imaging spectrometer is a device that can take a series of images that include information from a variety of wavelengths of light at fine spectral resolution.\",\n \"When an imaging spectrometer device senses different types of input light, such as ambient light for absorption measurements or laser light for fluorescence or Raman measurements, it can differentiate between materials that are usually indistinguishable to the naked eye in a nondestructive, non-contact manner.\",\n \"Compared to single-point instruments, an imaging spectrometer can monitor many points at the same time and be much more easily positioned relative to the object of interest, vastly improving usability.\",\n \"The ability to switch between regular and hyperspectral imaging makes it possible to align the spectrometer with respect to the sample without an additional alignment camera.\",\n \"Faster imaging spectrometer systems can be incorporated with image stabilization and object tracking algorithms to account for human or object motion, which can be difficult for a non-imaging system.\",\n \"Being able to select the wavelength resolution on the fly and to obtain high spectral resolution images (e.g., with resolutions of 1.6 cm−1 for Raman spectroscopy to 70 cm−1 for low resolution spectroscopy) is also desirable for practical applications.\",\n \"Due to the above advantages, imaging spectrometers can be useful in many applications, such as space probes, biological imaging, air pollution investigation, and health care monitoring, among others.\",\n \"However, existing imaging spectrometers are usually bulky and not readily accessible to the general population, since they are typically mounted to optical tables and include complex components to reject external vibrations.\",\n \"SUMMARY Systems, apparatus, and methods described herein are directed to spectral imaging.\",\n \"In one example, a spectral imaging system includes a beam splitter to receive an input light beam reflected or scattered from a sample and to split the input light beam into a first portion and a second portion.\",\n \"A first reflector is in optical communication with the beam splitter to reflect the first portion of the input light beam and a second reflector is in optical communication with the beam splitter to reflect the second portion of the input light beam.\",\n \"The system also includes an actuator, operably coupled to the second reflector, to move the second reflector along a propagation direction of the second portion of the input light beam.\",\n \"A position measurement system is operably coupled to the second reflector to measure a position of the second reflector.\",\n \"A detector is disposed at an intersection between the first portion of the input light beam and the second portion of the input light beam to detect an interference pattern created by the first portion of the input light beam and the second portion of the input light beam.\",\n \"The system further includes a processor, operably coupled to the position measurement system and the detector, to generate a spectral image of the sample based at least in part on the position acquired by the position measurement system and the interference pattern acquired by the detector.\",\n \"In another example, a method of spectral imaging includes splitting an input light beam reflected or scattered from a sample with a beam splitter into a first portion and a second portion.\",\n \"The method also includes reflecting the first portion of the input light beam with a first reflector and reflecting the second portion of the input light beam with a second reflector.\",\n \"The second reflector is at a first position in a plurality of positions along a propagation direction of the second portion of the input light beam.\",\n \"The method further includes performing measurement of the first position of the second reflector and detecting a first interference pattern created by the first portion of the input light beam and the second portion of the input light beam when the second reflector is at the first position.\",\n \"The method also includes moving the second reflector to a second position in the plurality of positions along the propagation direction of the second portion of the input light beam and performing measurement of the second position of the second reflector.\",\n \"A second interference pattern is created by the first portion of the input light beam and the second portion of the input light beam when the second reflector is at the second position.\",\n \"The method further includes generating a spectral image of the sample based at least in part on the measurement of the first position, the measurement of the second position, the first interference pattern, and the second interference pattern.\",\n \"More spectral images can then be generated by combining the previously acquired interference patterns with additional interference patterns acquired at subsequent actual positions.\",\n \"In yet another example, a spectral imaging system includes an autocorrelator to create an autocorrelation pattern of an input light beam reflected or scattered from a sample.\",\n \"The autocorrelator includes a beam splitter to split the input light beam into a first portion and a second portion, a first reflector to reflect the first portion of the input light beam, a second reflector to reflect the second portion of the input light beam, and a detector, disposed at an intersection between the first portion of the input light beam and the second portion of the input light beam, to detect an autocorrelation pattern created by the first portion of the input light beam and the second portion of the input light beam.\",\n \"The spectral imaging system also includes a positioning and measurement system operably coupled to the second reflector.\",\n \"The positioning and measurement system includes an actuator to place the second reflector at a plurality of positions non-uniformly spaced along a propagation direction of the second portion of the input light beam.\",\n \"The positioning and measurement system also includes a laser source to emit a probe laser beam toward the beam splitter.\",\n \"The beam splitter directs a first part of the probe laser beam toward the first reflector and directing a second part of the probe laser beam toward the second reflector.\",\n \"An array of photodiodes is in optical communication with the first reflector and the second reflector via the beam splitter to detect a probe interference pattern formed by the first part of the probe laser beam after reflection from the first reflector and the second part of the probe laser beam after reflection from the second reflector.\",\n \"The spectral imaging system further includes a processor, operably coupled to the autocorrelator and the positioning and measurement system, to estimate the plurality of positions of the second reflector based at least in part on the probe interference pattern.\",\n \"The processor also generates a spectral image of the sample based at least in part on the plurality of positions of the second reflector and the autocorrelation pattern of the input light beam.\",\n \"It should be appreciated that all combinations of the foregoing concepts and additional concepts discussed in greater detail below (provided such concepts are not mutually inconsistent) are contemplated as being part of the inventive subject matter disclosed herein.\",\n \"In particular, all combinations of claimed subject matter appearing at the end of this disclosure are contemplated as being part of the inventive subject matter disclosed herein.\",\n \"It should also be appreciated that terminology explicitly employed herein that also may appear in any disclosure incorporated by reference should be accorded a meaning most consistent with the particular concepts disclosed herein.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The skilled artisan will understand that the drawings primarily are for illustrative purposes and are not intended to limit the scope of the inventive subject matter described herein.\",\n \"The drawings are not necessarily to scale; in some instances, various aspects of the inventive subject matter disclosed herein may be shown exaggerated or enlarged in the drawings to facilitate an understanding of different features.\",\n \"In the drawings, like reference characters generally refer to like features (e.g., functionally similar and/or structurally similar elements).\",\n \"FIG.\",\n \"1A shows a schematic of spectral imaging systems including a position measurement system.\",\n \"FIGS.\",\n \"1B and 1C show an example implementation of the imaging system shown in FIG.\",\n \"1A.\",\n \"FIGS.\",\n \"1D and 1E illustrate a full spectrometer system including electronics.\",\n \"FIGS.\",\n \"2A-2B shows a schematic of a motor design that can be used to move reflectors in the system shown in FIG.\",\n \"1A.\",\n \"FIG.\",\n \"2C shows experimental results of linear translations of the motor shown in FIGS.\",\n \"2A-2B as a function of input voltage.\",\n \"FIGS.\",\n \"2D and 2E show a schematic of a motor including symmetric flexures with more output force, higher stiffness, and more symmetric motion that can be used to move reflectors in the system shown in FIG.\",\n \"1A.\",\n \"FIG.\",\n \"3A shows a schematic of a reflector position measurement system using two-signal encoders.\",\n \"FIGS.\",\n \"3B and 3C illustrate measurement of reflector positions and tilt using the system shown in FIG.\",\n \"3A.\",\n \"FIG.\",\n \"4A shows an example of photodiode signals acquired using the system shown in FIG.\",\n \"3A.\",\n \"FIG.\",\n \"4B shows a Lissajous plot of the photodiode signals shown in FIG.\",\n \"4A.\",\n \"FIGS.\",\n \"4C and 4D show position and phase change, respectively, of the moving mirror calculated from the data shown in FIGS.\",\n \"4A and 4B.\",\n \"FIG.\",\n \"5A shows a schematic of a reflector position measurement system using four-signal encoders.\",\n \"FIGS.\",\n \"5B and 5C illustrate measurements of reflector positions, tip, and tilt using the system shown in FIG.\",\n \"5A.\",\n \"FIGS.\",\n \"6A-6E show schematics of a multi-axis piezoelectric actuator that can be used to fine tune the moving reflector in the system shown in FIG.\",\n \"1A.\",\n \"FIG.\",\n \"7 illustrates a method of spectral imaging using actual positions of the moving reflector for image reconstruction.\",\n \"FIGS.\",\n \"8A-8D show experimental results of reconstructed spectral images using desired positions and actual positions of the moving reflector in an imaging spectrometer.\",\n \"FIG.\",\n \"9 illustrates a method of adaptive sampling.\",\n \"FIG.\",\n \"10 illustrates a method of digital filtering to create color images from black-and-white raw images.\",\n \"DETAILED DESCRIPTION Overview As introduced above, an imaging spectrometer, such as a Fourier transform spectrometer, usually takes several data points at different autocorrelations of the input light.\",\n \"Autocorrelations of the input light can be achieved using an autocorrelator including a beam splitter to split the input light into two portions and two reflectors, each of which reflects a corresponding portion of the input light toward a detector.\",\n \"The two portions, after reflection by the two reflectors, then combine at the detector to form an interference pattern (also referred to as an autocorrelation pattern).\",\n \"By moving one of the reflectors (also referred to as the moving reflector) to different locations, different autocorrelations can be acquired.\",\n \"A spectral image can then be reconstructed using the different autocorrelation patterns acquired when the moving reflector is at different locations.\",\n \"In conventional spectral imaging, the moving reflector is usually moved by a motor to a series of desired locations and the subsequent reconstruction of the spectral image also uses these desired locations of the moving reflector.\",\n \"In addition, these desired locations of the moving reflector are also uniformly spaced to simplify actuation and subsequent calculation during reconstruction.\",\n \"However, the actual location of the moving reflector usually deviates from the desired location, due to, for example, mechanical vibration, slow motor dynamics, thermal misalignment, or a combination thereof.\",\n \"The deviation of the actual location in turn can decrease the accuracy of the reconstructed spectral image.\",\n \"One way to address the misalignment of the moving reflector is to increase the precision and increase the bandwidth of the motor that drives the moving reflector.\",\n \"For example, a piezoelectric actuator can be used to fine tune the position of the moving reflector.\",\n \"The actuator speed is usually faster than the image acquisition rate such that each image can be taken when the moving reflector is at a distinct location.\",\n \"For example, if the desired frame rate (spectral sampling rate) is 2000 fps, then the actuator bandwidth can be about 2 kHz to about 20 kHz or more.\",\n \"As the acquisition rate of the imaging spectrometer increases, it can be challenging for piezoelectric actuators to operate at sufficiently high speeds due to the limitations imposed by, for example, the finite response time of piezoelectric materials or other limitations on the mechanical components in the piezoelectric actuator.\",\n \"In addition, high-speed piezoelectric actuators can be costly and bulky as well, thereby further hindering the miniaturization of the imaging spectrometers.\",\n \"Systems, apparatus, and methods described herein employ another approach to address the misalignment of the moving reflector.\",\n \"Instead of improving the movement accuracy of the moving reflector using expensive and bulky actuators, this approach takes into account the position deviations of the moving reflector when reconstructing of the spectral image.\",\n \"More specifically, the approach uses a position measurement system to measure the actual locations of the moving reflector when autocorrelation images are taken by the imaging spectrometer.\",\n \"These actual locations, instead of the desired locations in conventional methods, are then used to reconstruct the spectral image using the autocorrelation images.\",\n \"In other words, this approach lives with inaccuracies in the positions of the moving reflector and can tolerate a wide range of misalignment of the moving reflector from its desired locations.\",\n \"Using actual locations of the moving reflector for image reconstruction can allow the development of miniature, portable imaging spectrometers that have the relatively high spectral resolutions for making scientific measurements without some of the burdensome vibration rejection components.\",\n \"The spectrometer can also be mounted inside other packages, such as an endoscope, smart phone, scanner gun, microscope, or telescope.\",\n \"A spectrometer that can be small enough to fit in the palm of the hand or at the end of an endoscope would enable a host of new applications.\",\n \"FIG.\",\n \"1A shows a schematic of a spectral imaging system 100 including a position measurement system 150.The system 100 includes a beam splitter 110 to receive input light 101, which can be light reflected, scattered, or emitted from an object or scene to be imaged.\",\n \"The beam splitter 110 divides the input light 101 into two portions.\",\n \"The first portion is directed by the beam splitter 110 to a first reflector 120 and the second portion is directed to a second reflector 120.The two reflectors 120 and 130 reflect the corresponding portion of the input light beam 101 toward an aperture 164 and a lens 162 behind the aperture 164.A detector 160, placed at the focal plane of the lens 162, detects interference patterns (also referred to as autocorrelation patterns in this example) created by the first portion and the second portion of the input light 101.An actuator 140 is coupled to the second reflector 130 (also referred to as the moving reflector) to move the second reflector 130 to different positions along the propagation direction of the second portion of the input light 101.At each position of the moving reflector 130, the detector 160 can take one or more autocorrelation patterns.\",\n \"A processor 170 is in communication with the detector 160 to receive the autocorrelation patterns acquired by the detector 160 and to generate a spectral image of the object based on these autocorrelation patterns.\",\n \"The position measurement system 150 shown in FIG.\",\n \"1A employs an optical technique to determine the position of the reflector 130.The position measurement system 150 includes a laser 151 to provide a probe laser beam 105 (or simply probe beam 105), which propagates to a lens 152 for collimation before arriving at a probe beam splitter 153.Part of the probe beam 105 is reflected by the probe beam splitter 153 toward a mirror 154, which further reflects the probe beam 105 toward the beam splitter 110.The probe laser beam 105 then travels through a similar beam path as travelled by the input light 101.More specifically, the first reflector 120 reflects one part of the probe laser beam 105 and the second reflector 130 reflects another part of the probe laser beam 105.The two parts of the probe laser beam, after reflection by the corresponding reflector 120/130, propagate back to the mirror 154 and through the probe beam splitter 153.A negative lens 155 then expands the probe laser beam 105.Two probe detectors 156a and 156b are placed after the negative lens 155 to detect the interference pattern generated by the two parts of the probe laser beam 105.In one example, the laser 151 can include a HeNe laser.\",\n \"In another example, the laser 151 can include a Nd:YAG laser with a frequency doubling crystal to deliver laser beams at 532 nm.\",\n \"In yet another example, the laser 151 can include a vertical-cavity surface-emitting laser (VCSEL).\",\n \"For example, a surface mount 0603 package VCSEL at 850 nm with a bandwidth of about 0.057 nm to about 0.1 nm full-width-at-half-maximums (FWHM) can be used as the laser 151.The spectral resolution of the system 150 using this VCSEL laser can be about 1.38 cm−1 to 0.788 cm−1 without the use of any spectral line correction algorithms.\",\n \"This small laser would also enable the miniaturization of the imaging spectrometer.\",\n \"It can be desirable for the laser 151 to emit the probe laser beam 105 with a narrow linewidth.\",\n \"In general, a narrower linewidth of the probe laser beam 105 can lead to a finer resolution position measurement of the moving reflector 130.In one example, the linewidth of the probe laser beam 105 can be less than 5 nm (e.g., less than 5 nm, less than 3 nm, less than 2 nm, or less than 1 nm, including any value and sub ranges in between).\",\n \"In another example, the linewidth of the probe laser beam 105 can be less than 0.5 nm (e.g., less than 0.5 nm, less than 0.3 nm, less than 0.2 nm, less than 0.1 nm, less than 0.08 nm, or less than 0.05 nm, including any values and sub ranges in between).\",\n \"The position and tilt of the reflectors 120 and 130 can be determined as follows.\",\n \"When one reflector (e.g., 120) is tilted with respect to the other reflector (e.g., 130), the paths of the probe laser beam 105 reflected from those two reflectors 120 and 130 change accordingly, thereby projecting an interference pattern on the probe plane.\",\n \"This interferometric pattern can be sinusoidal with a period that is a function of the relative position of the two reflectors 120 and 130 as well as the relative tilt.\",\n \"When the moving reflector 130 is translated, the dark and bright portions of the light can translate left or right.\",\n \"By placing the two photodiodes 156a and 156b at different locations on this interferometric pattern, it is possible to measure two parts of this sinusoidal curve with a fixed phase delay.\",\n \"With two signals, it is possible to calculate the position and direction of propagation by using an analog encoder scheme where the phase delay resulting from a tilt angle is found through calibration (see, e.g., FIGS.\",\n \"3A-4B).\",\n \"The two detectors 156a and 156b are also in communication with the processor 170, which can determine the actual positions of the moving reflector 130 from the detector measurements.\",\n \"In addition, using the actual positions of the moving reflector 130, the processor 170 can further reconstruct the spectral image of the object.\",\n \"Since the actual positions of the moving reflector 130 can be accurately monitored by the position measurement system 150 and used in subsequent spectral image reconstruction, potential misalignment of the moving reflector 130 may no longer be a concern to users.\",\n \"In FIG.\",\n \"1A, the system 100 uses a single-pass Michelson interferometer to generate autocorrelation patterns of the input light 101.In practice, several other configurations can also be used to generate autocorrelation.\",\n \"In one example, the system 100 can use a double-pass Michelson interferometer to generate autocorrelation of the input light 101.In another example, a common path Sagnac can be used to generate autocorrelation of the input light 101.In yet another example, the system 100 can use an electro-optic modulator style interferometer.\",\n \"More details about different types of autocorrelator can be found in U.S. patent application Ser.\",\n \"No.\",\n \"14/933,666, entitled “Methods, systems, and apparatus for imaging spectroscopy,” which is hereby incorporated herein by reference in its entirety.\",\n \"FIGS.\",\n \"1B and 1C show an assembled view and an exploded view, respectively, of an imaging device 103 that can use the imaging system 100 shown in FIG.\",\n \"1A.\",\n \"The device 103 includes a spectrometer layer 143 that can include optical setup similar to that shown in FIG.\",\n \"1A.\",\n \"A sensor layer 157a including high speed camera board 157b and a photodiode board 157c (collectively referred to as sensors 157) are coupled to the spectrometer layer 143a to detect autocorrelation patterns created in the spectrometer layer 143.The sensors 157 can also measure positions of reflectors in the spectrometer layer 143 so as to facilitate subsequent image reconstruction.\",\n \"A motor 123a and motor adjustment flexures 123b (collectively referred to as motors 123) are coupled to the spectrometer layer 143 to move the reflectors in the spectrometer layer 143.The motors 123 and the sensors 157 are coupled to opposite sides of the spectrometer layer 143 so as to effectively use the space in the device 103.The device 103 also includes a piezoelectric flexure layer 113 to adjust the tip, tilt, and translation of the reflectors in the spectrometer layer 143 at higher precisions.\",\n \"The device 103 further includes a top cover 133 and a base 163 to enclose the various components, thereby resulting in a compact and portable device 103 as shown in FIG.\",\n \"1B.\",\n \"FIG.\",\n \"1D shows a photo of the imaging device 103 described above.\",\n \"FIG.\",\n \"1E shows the full embodiment including processing electronics 173 and power electronics 183 in a hand-held format.\",\n \"Actuators to Move the Reflector The actuator 140 in the system 100 is for moving the moving reflector 130.In practice, it can be desirable for the actuator 140 to travel at least several millimeters, have a positioning resolution on the order of micrometers, and have a high bandwidth to move quickly.\",\n \"Traditionally, imaging spectrometers sweep through the different positions of the moving reflector and control only the speed at which the actuator moves, without controlling the positions.\",\n \"These spectrometers typically use fast sampling on fast photodiodes in a continuous fashion.\",\n \"In contrast, the system 100 takes snapshots rather than continuous data.\",\n \"Therefore, it can be desirable to hold the moving reflector 130 in position during each snapshot (also referred to as exposure time for each image).\",\n \"Since the approach described herein uses actual positions of the moving reflector 130 to reconstruct the spectral image, the requirements on the position resolution of the actuator 140 can be relaxed and the actual positions of the moving reflector 130 can be spaced non-uniformly.\",\n \"In one example, the variation of the spacing between adjacent positions of the moving reflector 130 can be more than 10%.\",\n \"In another example, the spacing variation can be greater than 50%.\",\n \"In yet another example, the spacing variation can be greater than 100% (e.g., greater than 100%, greater than 150%, greater than 200%, or greater than 250%).\",\n \"In principle, this approach can allow any spacing of the actual positions of the moving reflector 130.The actual positions can also be under-sampled (i.e., sampled at a lower frequency than the Nyquist frequency, see sections below).\",\n \"One theoretical limitation can be based on information content.\",\n \"For example, the moving reflector 130 can be placed at a plurality of non-uniformly spaced positions with sufficient informational content to allow for a unique solution when reconstructing the spectral image.\",\n \"The actuator 140 can operate at various frequencies, which can be defined as the number of movements made by the moving reflector 130 per second.\",\n \"For example, the actuator 140 can operate at a speed greater than 20 Hz (e.g., greater than 20 Hz, greater than 30 Hz, greater than 50 Hz, greater than 100 Hz, greater than 150 Hz, greater than 200 Hz, greater than 300 Hz, greater than 500 Hz, greater than 750 Hz, greater than 1000 Hz, or greater than 2000 Hz, including any values and sub ranges in between).\",\n \"The detector 160 can operate at similar frame rate to acquire image each time the moving reflector 130 is placed at a different position.\",\n \"For example, the detector 160 can acquire images at a frame rate greater than 20 frames per second (fps) (e.g., e.g., greater than 20 fps, greater than 30 fps, greater than 50 fps, greater than 100 fps, greater than 150 fps, greater than 200 fps, greater than 300 fps, greater than 500 fps, greater than 750 fps, greater than 1000 fps, or greater than 2000 fps, including any values and sub ranges in between).\",\n \"The actuator 140 can also operate at various step sizes.\",\n \"For example, the step size of the actuator 140 can be substantially equal to or greater than 0.1 μm (e.g., 0.1 μm, 0.2 μm, 0.3 μm, 0.5 μm, 0.8 μm, 1 μm, 1.2 μm, 1.5 μm, 2 μm, 3 μm, 5 μm, or longer, including any values and sub ranges in between).\",\n \"In practice, the step size can depend on the characteristics of the actuator 140.For example, if the dynamics are slow (for example, a slow slew rate), then the step sizes can be small.\",\n \"If the dynamics are faster (for example, a fast slew rate), the step sizes can be larger.\",\n \"One region of steps sizes, in which approaches described herein can be advantageous, is where the measured position is sufficiently different from the desired position.\",\n \"Sufficiently different is when the deviation of the desired position is a significant proportion of the wavelength of interest.\",\n \"For example, if the wavelength of interest is 500 nm and the desired wavelength accuracy is better than 20 nm, then the desired positioning accuracy should be better than 10 nm.\",\n \"If the positioning accuracy of the actuator 140 is worse than 10 nm, then conventional methods may not work, but approaches described herein can still use the actuator 140 because potential misalignment is addressed in the subsequent reconstruction stages.\",\n \"In other words, approaches described herein can use actuators that may not otherwise usable in conventional spectral imaging methods.\",\n \"The dynamic range of the actuator 140 (also referred to as the range of travel) can depend on, for example, the desired spectral resolution of the system 100.In general, a larger range of travel can lead to finer spectral resolution.\",\n \"For example, the rage of travel of the actuator 140 can be about 0.1 mm to about 10 mm (e.g., 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.7 mm, 1.0 mm, 1.2 mm, 1.5 mm, 2 mm, 3 mm, 5 mm, 8 mm, or 10 mm, including any values and sub ranges in between).\",\n \"Voice Coil Motors for Moving Mirrors FIGS.\",\n \"2A-2B show schematics of motor 200 that can be used as the actuator 140 in the system 100.The motor 200 includes one or more permanent magnets 210 disposed within a coil 220 that is disposed on a coil holder 225 (also referred to as a bobbin).\",\n \"The magnets 210 and the coil 220 are enclosed in a housing 240 (which is also the back iron or actuator yoke of the motor which steers the magnetic field lines).\",\n \"Four flexures 230 are located on each side of the actuator and suspend the coil 220 via the coil holder 225 such that there is little to no friction between the bobbin of the coil 220 and the housing 240.The flexures 230 also function as a return spring to move the coil 220 back to its original position after when needed.\",\n \"In operation, if no current is applied to the coil 220, as shown in FIG.\",\n \"2A, the coil 220 stays in the middle of the housing 240.When an electric current is applied to the coil 220, the Lorenz force between the magnets 210 and the coil 220 can displace the coil 220, as illustrated in FIG.\",\n \"2B.\",\n \"Therefore, the motor 200 is also referred to as a linear Lorenz force voice coil motor.\",\n \"The motor 200 can be relatively small for a desired stroke (i.e., range of movement of the coil 220).\",\n \"It can also operate with relatively low friction, which may cause unpredictable parasitic rotation on the reflectors.\",\n \"In addition, the motor 200 uses a cube-like geometry, which can be manufactured using wire electrical discharge machining (EDM), can be easy to assemble, and can easily accommodate high rotational-stiffness blade flexures.\",\n \"By attaching reflectors at some point closer to the coil 220, the resulting imaging spectrometers can also be made smaller.\",\n \"In one example, the housing 240 (sometimes also referred to as an actuator yoke) can be made from low-carbon 1018 steel, which typically has a high magnetic permeability.\",\n \"The flexures 230 can be made from thin 300 series stainless steel shim stock, which can be manufactured with a wire EDM if clamped to thicker pieces of metal on the top and bottom.\",\n \"Although this material may be slightly paramagnetic, the high yield strength to Young's modulus ratio makes it a suitable material for blade flexures.\",\n \"FIG.\",\n \"2C shows experimental results of linear translation of the motor 200 as a function of input voltage to the motor for different blade flexure thicknesses.\",\n \"In general, thicker flexures can make it more difficult to move the coil 220, at a given applied voltage.\",\n \"As shown in FIG.\",\n \"2C, a motor having 50 μm thick flexures can move 1427.7 μm per applied volt and a motor having 100 μm can move 371.99 μm per applied volt.\",\n \"The motor 200 can have a resolution on the order of 1 μm or finer (e.g., 0.5 μm, 0.3 μm, 0.1 μm, 50 nm, 10 nm, 0.1 nm or finer).\",\n \"In addition to the voice coil motor 200 illustrated in FIGS.\",\n \"2A-2C, several other types of actuators can also be used to move the moving reflector in the imaging system 100.In one example, the system 100 can use stepper motors.\",\n \"In another example, the system 100 can use Microelectromechanical system (MEMS) pop-up mirrors.\",\n \"More information of MEMS pop-up mirrors can be found in U.S. Pat.\",\n \"No.\",\n \"6,396,975, entitled “MEMS optical cross-connect switch,” which is hereby incorporated herein by reference in its entirety.\",\n \"In yet another example, the system 100 can use rotary to linear conversion motors.\",\n \"FIGS.\",\n \"2D and 2E show a perspective view and a side view, respectively, of a motor 201 that can be used as the actuator 140 in the system 100.The motor 201 includes one set of flexures 231a coupled to a top housing 241a and a second set of flexures 231b coupled to a bottom housing 241b.\",\n \"The flexures 231a and 231b are coupled to the coil 221 on opposite sides of the coil 221.This configuration using two sets of flexures 231a and 231b can increase stiffness, increase speed, and improve symmetry in the motion.\",\n \"The motor 201 also includes two sets of yokes: a vertical yoke 251a and a horizontal yoke 251b to increase the output force.\",\n \"A magnet set 211 is placed directly into the yoke 251a and 251b to increase the magnetic field magnitude and hence the force produced at the coil 221.Measurement of Reflector Positions Using Two-Signal Encoders The position measurement system 150 in the system 100 can use analog encoders to determine location and tilt of the reflectors 120 and/or 130.An analog encoder basically includes an array of detectors (e.g., detectors 156a and 156b), such as photodiodes placed in the interference pattern generated by the probe laser beam 105.In one example, the analog encoders can include two detectors placed in a one-dimensional array.\",\n \"In another example, the analog encoders can include four detectors placed in a 2×2 array.\",\n \"In yet another example, the analog encoders can include any other configurations such as a 2×3 array, a 2×4 array, or a 3×4 array, among others.\",\n \"FIG.\",\n \"3A shows a schematic of a position measurement system 300 using two-signal encoders.\",\n \"The system 300 includes a beam splitter 310 to receive a probe beam 305 and divide the probe beam 305 into two parts.\",\n \"One part of the probe beam 305 is reflected by a first reflector 320 and the other part of the probe beam 305 is reflected by a second reflector 330.The first reflector 320 can have a tilt angle θ, and the second reflector 330 can move between two positions 330a and 330b.\",\n \"The two parts of the probe beam 305 after reflections from the corresponding reflector 320 and 330 are combined by the beam splitter 310 and directed to two detectors 356a and 356b, which sense interference patterns generated by the two parts of the probe beam 305.FIG.\",\n \"3B shows an example of an interferometric pattern in the probe plane where the two detectors 356a and 356b are placed.\",\n \"The locations of the two detectors 356a and 356b are also indicated in FIG.\",\n \"3B.\",\n \"FIG.\",\n \"3C shows the intensity distribution of the interferometric pattern shown in FIG.\",\n \"3B along the horizontal direction (i.e., along the distance of the probe plane).\",\n \"In operation, when one reflector (e.g., 320) in the system 300 is tilted with respect to the second reflector (e.g., 330), the light reflected from the reflectors 303a and 303b do not follow the coincident paths, thereby projecting an interference pattern on the probe plane as shown in FIG.\",\n \"3B.\",\n \"This interferometric pattern can be a sinusoid (see, e.g., FIG.\",\n \"3C) whose frequency and phase varies as a function of the relative position of the two reflectors 320 and 330 as well as the relative tilt.\",\n \"When the moving reflector 330 is translated between positions 330a and 330b, the dark and bright portions of the light translate left or right.\",\n \"By placing two photodiodes 356a and 356b in different locations on this interferometric pattern, two parts of this sinusoidal curve can be measured with a fixed phase delay.\",\n \"With two signals from the two detectors 356a and 356b, the position and direction of travel can be calculated by using an analog encoder scheme where the phase delay resulting from a tilt angle θ can be found through calibration.\",\n \"Without being bound by any particular theory or mode of operation, the signal at the two photodiodes can be used to calculate the relative position using the following scheme where the two signals at positions 1 and 2 are a(z) and b(z), respectively: a ( z ) = cos ( 2 π z λ ) ( 1 ) b ( z ) = sin ( 2 π z λ - φ ) = sin ( 2 π z λ ) cos ( φ ) - cos ( 2 π z λ ) sin ( φ ) ( 2 ) The phase difference between the two signals can be a function of tilt angle θ and the distance between the two sensors d, φ = - π 2 + 2 π λ Δ ( 3 ) Δ = d tan ( θ ) ( 4 ) In order to solve for the position z, the two measured signals can be divided and the position can be found by taking an inverse tangent: b ( z ) a ( z ) = tan ( 2 π z λ ) cos ( φ ) - sin ( φ ) ( 5 ) resulting in the final equation for determining the relative position of the two mirrors, z = λ 2 π tan - 1 ( b ( z ) + a ( z ) sin ( φ ) a ( z ) cos ( φ ) ) ( 6 ) In order to solve this equation, the input data can first be scaled such that the data is between −1 and +1.Then the position can be calculated by using the arctangent function with two arguments, with proper unwrapping of the phase of the output data.\",\n \"The relative phase delay can be calibrated by running a fast ramp on the actuator.\",\n \"Then a Lissajou plot can be made from the two signals and a quick fit can be made to determine the phase delay.\",\n \"This calibration step can take about 2 seconds to complete with the user interface.\",\n \"Because the imaging system and the motor flexure system are relatively stable, the calibration can remain valid for a long time.\",\n \"FIGS.\",\n \"4A-4D show an example set of experimental data using the system 300.FIG.\",\n \"4A shows photodiode signals acquired by the two detectors 356a and 356b.\",\n \"FIG.\",\n \"4B shows a Lissajou plot of the photodiode signals shown in FIG.\",\n \"4A.\",\n \"FIGS.\",\n \"4C and 4D show the position and phase change of the moving reflector 330 calculated from the photodiode signals shown in FIG.\",\n \"4A.\",\n \"Data shown in FIGS.\",\n \"4A-4D is acquired when a weak cantilever is used to hold the reflector 330, which can cause the reflector 330 to tilt back and forth as a function of the reflector velocity due to drag.\",\n \"Since the trace of the Lissajou plot does not go over itself, this shows that the phase changes over time due to mirror tilt.\",\n \"By calculating the instantaneous phase difference and the velocity of the reflector 330, it is clear that the two signals match up well.\",\n \"This effect disappears when the component holding the reflector 330 is strengthened, thereby changing the Lissajou plot into a perfect oval with a constant phase delay.\",\n \"The system 300, theoretically, can have infinite positioning resolution.\",\n \"In practice, the positioning resolution can be limited by, for example, the resolution of the analog-to-digital converter (ADC) used to measure its magnitude, as well as the inherent noise in the circuit system and on the photodiodes 356a and 356b (e.g.\",\n \"dark current).\",\n \"The resolution limitation for a single photodiode 356a or 356b can be roughly Δz=λ/(2(ΔV/Vmax)BADC), which is a function of the reference wavelength A and the number of bits of the ADC between the signal maximum and signal minimum (ΔV/Vmax)BADC.\",\n \"The maximum positioning resolution for this wavelength can be approximately 0.1 nm for a 12-bit ADC.\",\n \"Measurement of Reflector Positions Using Four-Signal Encoders FIG.\",\n \"5A shows a schematic of a position measurement system 500 using four-signal encoders.\",\n \"The system 500 includes a beam splitter 510 to receive a probe beam 505 and divide the probe beam 505 into two parts.\",\n \"A first reflector 520 reflects the first part of the probe beam 505 and a second reflector 530 reflects the second part of the probe beam 505.The second reflector 530 can move between two positions 530a and 530b.\",\n \"The two parts of the probe beam 505 after reflections from the corresponding reflector 520 and 530 are combined by the beam splitter 510 and directed to four detectors 556a, 556b, 556c, and 556d, which sense an interference pattern generated by the two parts of the probe beam 505.The four detectors 556a to 556d also define a two-dimensional probe plane.\",\n \"FIG.\",\n \"5B shows an example of an interferometric pattern on the probe plane where the four detectors 556a to 556d are placed.\",\n \"The locations of the four detectors 556a to 556d are also indicated in FIG.\",\n \"5B.\",\n \"FIG.\",\n \"5C shows the intensity distribution of the interferometric pattern shown in FIG.\",\n \"5B along two directions.\",\n \"One direction is defined by the two detectors 556a and 556b (e.g., from 556a to 556b), and the other direction is defined by the two detectors 556c and 556d (e.g., from 556c to 556d).\",\n \"With a two-dimensional probe plane, the interferometric pattern can be tilted and can be projected differently on the four photodiodes 556a to 556d with a relative phase difference in the tip direction and in the tilt direction.\",\n \"The signals on the four sensors can be defined as: a ( z ) = cos ( 2 π z λ ) ( 7 ) b ( z ) = sin ( 2 π z λ - φ ab ) ( 8 ) c ( z ) = sin ( 2 π z λ - φ ac ) ( 9 ) d ( z ) = sin ( 2 π z λ - φ ad ) ( 10 ) The positions calculated by comparing the signals between each of these points are: z ab = λ 2 π tan - 1 ( b ( z ) + a ( z ) sin ( φ ab ) a ( z ) cos ( φ ab ) ) ( 11 ) z ac = λ 2 π tan - 1 ( c ( z ) + a ( z ) sin ( φ ac ) a ( z ) cos ( φ ac ) ) ( 12 ) z bd = λ 2 π tan - 1 ( d ( z ) + b ( z ) sin ( φ bd ) b ( z ) cos ( φ bd ) ) ( 13 ) z cd = λ 2 π tan - 1 ( d ( z ) + c ( z ) sin ( φ cd ) c ( z ) cos ( φ cd ) ) ( 14 ) The relative phase angles between the signals are then: φ ab = - π 2 + 2 π λ Δ x ( 15 ) φ ac = - π 2 + 2 π λ Δ y ( 16 ) φ bd = - π 2 + 2 π λ Δ y ( 17 ) φ cd = - π 2 + 2 π λ Δ x ( 18 ) φ ad = - π 2 + 2 π λ ( Δ x + Δ y ) ( 19 ) The phase differences are based on the x and y distance between the four sensors as well as the relative tip θx and tilt θy such that: Δx=zbd−zac=dx tan(θx) (20) Δy=zcd−zab=dy tan(θy) (21) Other than the interferometric measurement system described above, various other measurements systems can also be used to monitor the position of the moving reflector 130 in the system 100.In one example, a Linear Variable Differential Transformer (LVDT) can be used to measure positions of the moving reflector 130.In another example, the position of the moving reflector 130 can be monitored by a potentiometer, which can have a wiper contact linked to a mechanical shaft.\",\n \"The shaft can be mechanically coupled to the moving reflector.\",\n \"The movement of the shaft, induced by the movement of the moving reflector, can cause the resistance value between the wiper and the two end connections of the potentiometer to change, thereby providing an electrical signal that is dependent on the position of the shaft.\",\n \"In yet another example, the moving reflector 130 can be coupled to a confocal sensor to measure its positions.\",\n \"For example, a confocal position sensor can use a polychromatic white light that is focused onto the target surface by a multi-lens optical system.\",\n \"The target surface can be the back surface of the moving reflector 130, the holder of the moving reflector 130, or any other surface that can move together with the moving reflector 130.The multi-lens optical system can disperse the light into monochromatic stages (colors) along the measurement axis.\",\n \"A specific distance to the target can be assigned to each wavelength in a factory calibration.\",\n \"Typically, only the wavelength which is exactly focused on the target is used for the measurement.\",\n \"In other words, detecting the wavelength of the lighted reflected by the target surface can provide distance information of the target surface.\",\n \"In yet another example, a capacitive displacement sensor can be employed to detect position of the moving reflector 130.For example, the capacitive displacement sensor can include a conductive surface placed near another conductive surface attached to the moving reflector 130.As the moving reflector 130 moves, the capacitance between the two conductive surfaces changes accordingly, thereby providing distance information between the two conductive surfaces.\",\n \"Piezoelectric Actuators For linear actuator implementations such as the motor 200 shown in FIGS.\",\n \"2A-2B, angular misalignment as a function of actuator travel almost always exists.\",\n \"As described above, reconstructing the spectral image using actual positions, instead of desired positions, of the moving reflector in imaging spectrometers can compensate the effects of this misalignment.\",\n \"Nevertheless, using optional piezoelectric actuators can further improve the accuracy of the spectral imaging systems.\",\n \"The piezoelectric actuators can be combined with the motor 200 shown in FIGS.\",\n \"2A-2B, where the motor 200 provides high stroke and the piezoelectric actuators provide fast dynamics.\",\n \"FIGS.\",\n \"6A-6C show schematics of a piezoelectric actuator 600 that can be used in the imaging system 100 to fine tune the position of the reflector 120 and/or the reflector 130.FIG.\",\n \"6A shows a perspective view of the actuator 600 and FIGS.\",\n \"6B-6C show a close-up view of each axis (e.g., translation, tip, and tilt) of the actuator 600.The actuator 600 includes three sub-actuators: a tip sub-actuator 610 to provide tip movement, a tilt subs-actuator 620 to provide tilt movement, and a translation sub-actuator 630 to provide translation movement.\",\n \"Each sub-actuator 610 to 630 is in charge of one degree of freedom.\",\n \"Each sub-actuator 610, 620, and 630 also includes a corresponding piezoelectric material 612, 622, and 632, and two screws 614, 624, and 634.Similarly, the screws 614 in the tip sub-actuator 610 and the screws 624 in the tilt sub-actuator 620 are used to apply a small preload to the sub-actuators and to help change zero point of the alignment.\",\n \"To prevent the screw from damaging the piezoelectric materials 612 and 622, an additional stainless steel plate can be placed at the end of the sub-actuators 610 and 620 to help distribute point loads.\",\n \"The translation actuator works slightly differently.\",\n \"When it expands, it can force the flexures 636 to stretch and causes a contraction in the orthogonal direction.\",\n \"The screws 634 are used to apply a preload to the piezoelectric material 632.This arrangement can be used to amplify translation and is a function of the angle between the flexure and the piezoelectric actuator θT3: Δ y Δ x = - cot ( θ T3 ) ( 22 ) As the piezoelectric actuator expands in the x-direction (indicated in FIG.\",\n \"6C), the contraction in the y-direction can be a function of the angle.\",\n \"As the angle becomes shallower, the displacement becomes larger.\",\n \"At an angle of about 30 degrees, the contraction can be 1.7 times the expansion of the piezoelectric material 632.In practice, the deformation of other mechanical components may limit the contraction.\",\n \"FIGS.\",\n \"6D and 6E illustrate another piezoelectric actuation system 601 using four actuators 611a, 611b, 611c, and 611d.\",\n \"The four actuators 611a to 611d are disposed in parallel with each other.\",\n \"Motions that can be achieved by the four actuators 611a to 611d include translation 621a, tip 621b, and tilt 621c, as illustrated in FIG.\",\n \"6D.\",\n \"FIG.\",\n \"6E also shows a mirror 631 and the corresponding motions including translation 621a, tip 621b, and tilt 621c.\",\n \"Parallel actuators can achieve higher bandwidths due to increased system stiffness between the piezoelectric actuators 611a to 611d and the location of the mirror 631.Here, four piezoelectric actuators 611a to 611d act together to move the mirror 631.If all four piezoelectric actuators 611a to 611d expand, then the mirror 631 translates.\",\n \"If only the top two actuators 611a and 611b or the bottom two actuators 611c and 611d expand, then the mirror 631 tips.\",\n \"If only the left two actuators 611a and 611c or the right two actuators 611b and 611d expand, then the mirror 631 tilts.\",\n \"The actuation system 601 also allows for both positive and negative tip and tilt and does not require a preload force or preload voltage for those motions.\",\n \"Methods of Spectral Imaging Using Actual Positions of the Moving Reflector FIG.\",\n \"7 illustrates a method 700 of spectral imaging using actual locations of the moving reflector.\",\n \"At step 710 of the method 700, a splitter can split an input light beam, which can be reflected, scattered, or emitted by an object to be imaged, into two portions: a first portion and a second portion.\",\n \"A first reflector then reflects the first portion of the input light beam and a second reflector reflects the second portion of the input light beam, at step 720.The first portion and the second portion of the input light beam, after reflection by the corresponding reflector, can interact at a detector plane to form an interference pattern (also referred to as an autocorrelation).\",\n \"At step 730 of the method 700, the second reflector is moved to a first position (e.g., using an actuator), which is measured at step 740.A detector then detects a first interference pattern, at step 750, when the second reflector is at the first position.\",\n \"Similarly, at step 760 of the method 700, an actuator can move the second reflector to a second position, which is measured at step 770.The detector then detects a second interference pattern, at step 780, when the second reflector is at the second position.\",\n \"The loop of moving the second reflector, measuring the position of the second reflector, and acquiring autocorrelation can be repeated many times until a sufficient number of autocorrelations are acquired for image reconstruction at step 790.The reconstruction of the spectral image uses the acquired autocorrelations as well as the measured actual positions of the second reflector.\",\n \"FIGS.\",\n \"8A-8D show experimental results of spectral imaging using actual positions of the moving reflector for reconstruction.\",\n \"The data is taken at a frame rate of 2010 fps.\",\n \"FIG.\",\n \"8A shows the reconstructed spectral images when data is taken at a step size of 0.2 μm and the moving reflector is controlled by only a motor.\",\n \"Spectrum 801 is reconstructed using desired positions of the moving reflector, while spectrum 802 is reconstructed using measured positions of the moving reflector.\",\n \"FIG.\",\n \"8B shows the reconstructed spectral images when data is taken at a step size of 0.2 μm and the moving reflector is controlled by a motor and a piezoelectric actuator.\",\n \"Spectrum 803 is reconstructed using desired positions of the moving reflector, while spectrum 804 is reconstructed using measured positions of the moving reflector.\",\n \"FIG.\",\n \"8C shows the reconstructed spectral images when data is taken at a step size of 1 μm and the moving reflector is controlled by a motor only.\",\n \"Spectrum 805 is reconstructed using desired positions of the moving reflector, while spectrum 806 is reconstructed using measured positions of the moving reflector.\",\n \"FIG.\",\n \"8D shows the reconstructed spectral images when data is taken at a step size of 1 μm and the moving reflector is controlled by a motor and a piezoelectric actuator.\",\n \"Spectrum 807 is reconstructed using desired positions of the moving reflector, while spectrum 808 is reconstructed using measured positions of the moving reflector.\",\n \"FIGS.\",\n \"8A-8D show that at step sizes of 1.0 μm, the motor-only control method produces extra peaks in the data that are not present when hybrid control (motor and piezoelectric actuator) is used.\",\n \"The extra peaks in the data can be eliminated by calculating the Fourier transforms using the measured positions rather than using the equally spaced desired positions.\",\n \"Since the motor only controller may not accurately position the mirror at 2010 fps, the measured position and desired positions are very different.\",\n \"By using a least squares solver or any other solver (e.g., an adaptive sampling method, and an iterative sampling method) that is capable of incorporating the sampling location, the error due to positioning inaccuracies can be removed.\",\n \"The method 700 illustrated in FIG.\",\n \"7 can also be useful in developing small imaging spectrometers for handheld applications, where either the spectrometer or the source being tested may be held by a human.\",\n \"Humans are not good at maintaining accurate positions and are a source of vibrations.\",\n \"Therefore, it is helpful to consider the effects of disturbances caused by humans on the measurement accuracy.\",\n \"Conventional methods to address human disturbances include image tracking (e.g., edge tracking) and machine vision methods.\",\n \"However, there is a challenge in using these methods for spectral imaging because the edges of interferograms tend to move from image to image for some experiments.\",\n \"For situations where there is no tilt, the image brightness can instead change from image to image.\",\n \"Alternative methods for image tracking can be used for these cases.\",\n \"One approach to the problem can be sampling at a rate that is significantly faster than the rate of human motion.\",\n \"For example, if only 10 frames are required to make the spectral image with the desired spectral resolution and if the human motion was on the order of 5 Hz, it is possible to sample at 2000 fps and obtain all the desired images in 5 ms.\",\n \"This is much faster than frequency of the human motion so the objects of interest may not have moved much from frame to frame.\",\n \"By sampling quickly, human motion disturbances can be rejected.\",\n \"In addition, the blur from human motion can be removed if the sampling is faster.\",\n \"In order to push the limits of the sampling rate, the approached used in the method 700 can be utilized to obtain accurate spectra at speeds that may be beyond the capabilities of the actuator.\",\n \"Irregular Sampling In spectral imaging techniques, the Fourier transform can be used to convert interference patterns into spectra.\",\n \"This transform, however, has many limitations.\",\n \"First the data is usually sampled at evenly spaced intervals at the Nyquist frequency, which usually means a large number of samples are taken to generate a spectral image.\",\n \"For example, if a 5 nm resolution at λ0=850 nm is desired, over 700 samples would be taken.\",\n \"If the camera is sampling at 30 frames per second, gathering a full hyperspectral image may take up to 23 seconds.\",\n \"Even for a high-speed camera at 2000 frames per second, a video rate spectrum may not be achieved.\",\n \"This is a clear limitation of Fourier transform methods that utilize traditional uniform sampling at the Nyquist frequency.\",\n \"In order to reduce the sampling rate while maintaining the desired resolution, a variety of irregular sampling methods can be used.\",\n \"Examples of irregular sampling techniques include under-sampling, non-uniform sampling, optimal sampling, adaptive sampling, and recursive update techniques.\",\n \"These methods can be used in conjunction with advanced solution methods other than the fast Fourier transform (FFT) or the discrete Fourier transform (DFT).\",\n \"The advanced solution methods include techniques like the L1 or L2 (least squares) techniques or fast digital filtering methods for real-time custom color filtering.\",\n \"Generalized Solution The solution method presented here can be derived from fast orthogonalization techniques used for sampling Fourier transform data and for solving Volterra kernels.\",\n \"The general solution for any sampling method can be obtained from setting up the problem in an equation of the form: y(n)=Σm=1MAmPm(n)+e(n) (23) with matrix form Y=PA+E, where P1(n)=1, P2i(n)=cos(ωiz(n)/c), P2i+1(n)=sin(ωiz(n)/c).\",\n \"Here y(n) is the intensity of the interferometric pattern acquired by the detector (e.g., detector 160 shown in FIG.\",\n \"1A) while the moving reflector 130 is at location z(n), e(n) is the error and Am contains the spectral information (i.e., the coefficient for spectral component at wavelength λm).\",\n \"The matrix Pm is constructed from real trigonometric polynomials and contains the guesses for different frequencies ωi and the locations where measurements are taken z.\",\n \"To convert frequencies to wavelengths, the equation λi=2πν/(ωi) can be used, where ν=c/n1 is the refractive index of the material propagating the input light beam.\",\n \"Note that equation (23) is a Hartley transform and not a Fourier transform as all constants are real.\",\n \"Also note that there is no restriction on sampling interval thereby allowing non-uniform sampling.\",\n \"Many possible ways can be used to solve equation (23) and derive the spectral information contained in Am.\",\n \"For example, an L2 norm solution, also known as least square (LS) method can be used, in which case: Â=(PTP)−1PTY (24) Once the solution A is acquired, the results can be mapped back to a magnitude and phase so as to reconstruct a spectral image: Ji=√{square root over (A2i2+A2i+12)} (25) ζi=tan−1(A2i+1/A2i) (26) Note that there is no restriction on sampling interval thereby allowing non-uniform sampling and under-sampling.\",\n \"The flexible form of the matrix P allows for any choice of desired frequencies, even no-continuous groups of frequencies indicating many different sets of spectral limits, thereby enabling adaptive sampling.\",\n \"This matrix form can also be used for recursive update algorithms.\",\n \"Because the true relative phase content of the input light is not preserved in an interferometric measurement, it is therefore not necessary to preserve the phase content in the transform.\",\n \"The phase information can therefore be ignored.\",\n \"The magnitude information can map directly to the spectrum of the measurement.\",\n \"If the amount of data acquired is more than twice the number of wavelengths present in the data (and wavelengths queried), then the L2 algorithm can be used.\",\n \"If the data are sparse, and the amount of data acquired is less than twice the number of wavelengths queried, then an L1 method or an adaptive or iterative L2 algorithm can be used.\",\n \"Non-Baseband Sampling Methods In traditional Fourier transform sampling methods, the sampling is usually half the spacing of the lowest wavelength of interest in order to avoid aliasing (Nyquist sampling λmin 2Δz), the maximum wavelength is equal to the sampling range λmax=NΔz, and the number of samples obtained at this spacing determines the resolution of the spectrum.\",\n \"The wavenumber (generally presented in units of cm−1), which is the inverse of the wavelength υ=1/λ, can be used to determine the resolution of the spectrum: Δ v = 1 z max - z min ≈ Δλ λ 2 ( 27 ) If the sampling is equally spaced, then Δυ=1/(NΔz) is also true.\",\n \"The wavelength resolution is approximately Δλ≈λ2/(NΔz) at any given wavelength λ.\",\n \"This wavelength range with this resolution can be defined as baseband sampling.\",\n \"By looking at these equations, it is clear that resolution is driven only by the range of sampling.\",\n \"Therefore, it may be possible to ignore the Nyquist sampling limit to achieve a desired wavelength resolution by under-sampling the spectrum if the incoming light is limited only to a certain band of wavelengths.\",\n \"For example, if silicon-based photodiodes are used, the wavelengths can be limited to between about 300 nm and about 1100 nm.\",\n \"If the band limits λmax and λmin are known, then the Shannon non-baseband sampling rate can be: Δ z = 1 2 λ min [ λ max λ max - λ min ] ( 28 ) The brackets in this equation indicate taking the integer floor value of the ratio inside the brackets.\",\n \"By utilizing the known band limits of the spectrum, the number of samples for reconstructing the spectrum can be reduced by three to five times, thereby increasing the sampling speed.\",\n \"Under-sampling or non-baseband sampling is a technique where the sampling interval is larger than the Nyquist sampling interval.\",\n \"Traditionally, this type of sampling is discouraged because it tends to cause aliased data to fold into un-aliased data.\",\n \"However, if the band limits of the system are known, it is possible to prevent folding and use the aliased data directly.\",\n \"This technique can dramatically cut down on the number of data points and can dramatically increase the spectra update rate.\",\n \"Another method that can be used with known band limits is the optical under-sampling method.\",\n \"Because of trade-off in terms of speed and noise, a cost function can be created to determine the optimal under-sampling interval for a given weight of importance of noise relative to sampling and computation time.\",\n \"For example, the system can be restricted to a constant spectral resolution with a constant set of desired spectral points.\",\n \"An optimal under-sampling interval can be determined using a cost function where the noise ratio f(Δz), data acquisition time g(Δz), and solution time h(Δz) are considered with relative scaling constants K1, K2 and K3, respectively.\",\n \"The sampling interval region can be restricted by the Nyquist sampling rate, the maximum possible sampling step size, the maximum allowable sampling time, and the maximum allowable signal to noise ratio: arg min Δ z K 1 f ( Δ z ) + K 2 g ( Δ z ) + K 3 h ( Δ z ) subject to Δ z ∈ [ max ( Δ z Nyquist , T max ) , min ( Δ z Shannon , SNR max ) ] .\",\n \"( 29 ) Adaptive Under-Sampling In many cases, nothing is known about the spectra before the data are obtained.\",\n \"In this case, it is possible to slowly learn more and more about the spectrum as the data is acquired and adapt the sampling intervals as more information is obtained.\",\n \"Adaptive under-sampling takes advantage of the fact that the act of obtaining more data points in the spectra automatically yields more spectral data.\",\n \"Since there is more information about the underlying spectrum, it is then possible to tailor the input to converge on the optimal, wider sampling interval over a single sampling sweep, thereby producing the desired spectral resolution faster.\",\n \"For example, a controller implementing adaptive sampling may slowly increase the sampling interval as it learns more about the underlying spectra.\",\n \"Existing adaptive sampling methods are typically purely mathematical solution techniques and do not provide direction on how the data should be adaptively sampled.\",\n \"The spectral data obtained from imaging Fourier transform spectra presents a unique case where the true underlying spectrum is fixed for a given sample and can be sampled adaptively at any desired position at any time.\",\n \"In addition, the spectra can have incoherent or broadband data concentrated at the center of the interferometer alignment, which is treated differently than the narrowband data.\",\n \"These factors lead to a unique adaptive under-sampling algorithm that can be effectively implemented for imaging Fourier transform spectrometers.\",\n \"FIG.\",\n \"9 illustrates a method 900 of adaptive sampling that can be executed by a controller or other processor of or coupled to a spectral imaging device.\",\n \"At the first step 910, a user determines the desired resolution and initial sampling rate, which is related to the known band limits λmax and λmin: Δ z 0 = 1 2 λ min [ λ max λ ma x - λ min ] where z i = z i - 1 + Δ z 0 .\",\n \"( 30 ) Then a small number of initial samples No are collected near the interferogram center at step 920 of the method 900.Once this is completed, the low-resolution spectra is calculated, at step 930, using the generalized solver.\",\n \"Using the small number of initial samples can also force the system to sample the center of the interferogram more heavily, thereby capturing more of the broadband spectral data.\",\n \"When this result is obtained, the controller proceeds to step 940, where the limits (locations in the spectra where information exists and the value is above δL) can be determined, thereby allowing the calculation of the occupancy (ratio of occupied to total spectral data points).\",\n \"Determining the occupancy in turn allows the selection of the next sampling step with some relaxation term R≥1 and an occupancy Γi=Noccupiedi/Ntotali where, Δ z _ ≤ 1 2 λ min R Γ i [ λ max λ ma x - λ min ] And z i = z i - 1 + Δ z i .\",\n \"( 31 ) Once some samples are taken, the method proceeds to step 950, where the spectra are recalculated using the method outlined above and the procedures are repeated until the desired resolution is achieved.\",\n \"Note here that an L2 norm algorithm requires that the limits become smaller (only occupied parts of the spectra are set up in the calculation of ωi) because there would otherwise not be enough data to solve the problem.\",\n \"An L1 norm algorithm would not have such a restriction but would run much slower.\",\n \"The shrinking limits in the algorithm make the L2 norm solution feasible.\",\n \"In addition, the controller can continue until the limits stop changing or at some predefined number of iterations.\",\n \"The controller can then switch to constant sampling at the maximum interval until the final desired resolution is reached.\",\n \"Recursive Spectral Update For many applications, it can be desirable to do continuous spectral sampling.\",\n \"When the spectrum of the image changes slightly during the acquisition process, it may not be desirable to completely resample the spectra.\",\n \"Instead, old data points from the interferogram can be forgotten and replaced with information from new data points.\",\n \"This allows a gradual adaptation or recursive updating of the calculated spectra and gives the user intermediate information about the system.\",\n \"While adaptive sampling reduces the number of images necessary to produce a full spectral image, recursive sampling can be used to update the spectral information between full spectral images.\",\n \"For example, if 500 images taken at 2000 frames per second are used to create a single full spectral image, the full spectral image rate can be 4 full spectra per second.\",\n \"If the controller/processor uses a recursive sampling algorithm, it can make small updates to the spectral image after each image.\",\n \"This allows the recursively sampled full spectral image rate to be as high as 40 (update group size of 50) up to 2000 (update group size of 1) frames per second.\",\n \"This can be useful for pushing the spectral update to the user at faster rates.\",\n \"Possible applications include video monitoring of changes in biological fluorescence to events during chemical mixing causing changes in the Raman spectra.\",\n \"Alterations in blood oxygen content of an entire image as a function of heart rate could also be monitored.\",\n \"Digital Filtering Unlike other methods that attempt to improve sampling speed or update rates, the digital filtering methods presented in this section attempt to create color images from the “black and white” data obtained from the spectrometer in a fast and effective manner that does not require taking a full FFT or solving the LS equations.\",\n \"The digital filtering method uses a lower (minimal) number of simple calculations per pixel and tracks motions at video rates while reproducing color images from the black and white data.\",\n \"Examples of applications include tracking different fluorescent peaks, tracking different Raman peaks while collecting a minimal amount of data, and simply converting data from a black and white camera to color without the use of Bayer masks or rotating filter disks.\",\n \"The digital filter methods described herein can create color images from any set of wavelength bands and can assign as many colors to as many wavelength bands as desired.\",\n \"In general, broadband colors, similar to the Bayer filters in traditional color cameras, can be relatively quick and easy to reproduce from interferometric data because those filters are so broad that only a few terms are needed to create a filter for those wavelengths.\",\n \"It can be more challenging when there are narrowband colors, such as two laser wavelengths that are very close together and a third that is further away.\",\n \"FIG.\",\n \"10 illustrates a method 1000 of digital filtering and creating color images from black-and-white images.\",\n \"This method can be performed by suitably programmed or operated versions of the spectral imaging device described above.\",\n \"At step 1010 of the method 1000, a processor/controller acquires black-and-white images (the total number of images is denoted as M).\",\n \"Light beams that create these black-and-white images (also referred to as raw images) can include three spectral components: one at 532 nm, another at 808 nm, and a third component at 850 nm.\",\n \"Once the raw images are obtained, a filter receives each raw image and splits the image into different pixels.\",\n \"Each pixel is passed through three different bandpass filters that cover distinct wavelength ranges, at step 1020.The output of the filter is then sent to a moving average filter and the resulting data can be reconstructed into a color image, at step 1030.A series of black-and-white images with interferometric data therefore can become a series of color images through this process.\",\n \"At least two types of filters can be used here: one filter includes uniform sampling and the other filter includes non-uniform sampling.\",\n \"There are two major classes of digital filters, infinite impulse response (IIR) filters and finite impulse response (FIR) filters.\",\n \"The following sections teach how different filters can be designed so that black and white video can be converted to color video in real time with some fixed delay.\",\n \"To design the high pass, low pass, or bandpass filters, the wavelengths of interest and the bandwidths of those wavelengths are required.\",\n \"To reduce ambiguity between different filters for different colors, the overlap of multiple filters should be minimized.\",\n \"Once the filters for a particular sampling scheme (either uniform or non-uniform) are obtained, the digital filter plus the moving average step can be used on each pixel of the black and white video to determine the intensity for each wavelength of interest.\",\n \"This can be combined to form the color video.\",\n \"Uniform Sampling Digital filters, in this case, work on time series data.\",\n \"For example, a very simple digital filter could take an average of two data points (intensity levels on one pixel at two different times) at samples n and n−1 to produce an output for sample n. An IIR filter works by considering the data from both the input data (raw pixel intensities at different time steps) and the previously created output data from the previous time steps.\",\n \"This is then used to create a new output for the current time step.\",\n \"With being bound by any particular theory or mode of operation, an IIR filter has a transmission function of the form: y ( n ) = 1 a 0 ∑ i = 0 Q b b i x ( n - i ) - ∑ j = 1 Q a b j y ( n - j ) ( 32 ) with both feed-forward filter coefficients bi and feedback filter coefficients aj.\",\n \"Generally, fewer terms are necessary in the IIR domain than in the FIR domain for similar filter cutoffs due to the feedback terms.\",\n \"These IIR filters can be generally more difficult to convert from any time-domain design using a bilinear transform or Tustin transform and are much more straightforward to design directly in the digital domain.\",\n \"In one example, a digital IIR filter based on an analog Butterworth filter can be designed for the wavelength at 532 nm because it is sufficiently far away from the other two wavelengths.\",\n \"Elliptical filters can be designed for the 808 nm and 850 nm filters.\",\n \"Elliptical filters usually have sharper cutoffs for the same filter order but have more ripples.\",\n \"The wider the filter in frequency space, the less delay there is in time.\",\n \"For this reason, the edges of the red and green filters can be used to separate the 808 nm from the 850 nm while allowing the filters to be fairly wide overall.\",\n \"In general, these filters can track motions up to about 40 fps when video is taken at 2010 fps.\",\n \"An FIR filter works by considering only the input data (raw pixel intensities at different time steps) in the creation of the output for the current time step.\",\n \"FIR filters generally use more computations for the similar filter cutoff characteristics but they can have a constant delay equal to half their filter order.\",\n \"For FIR filters, the order is Qb.\",\n \"FIR filters are also easier to generate from continuous domain filter designs.\",\n \"An FIR filter has the form: y(n)=Σi=0Qbbix(n−i) (33) In one example, the red and green filters can be very narrow and have an order of Qb=100 samples (delay of 50 samples).\",\n \"The blue filter can be much broader and has an order of 30 (delay of 15).\",\n \"Because these filters normally do not have a flat region, it can be challenging to use just the edges of the filter to separate the two wavelengths as with the IIR filter.\",\n \"For this same reason, the rejection ratio of the green filter for information at 850 nm and the red filter for information at 808 nm can be potentially lower for the FIR designs.\",\n \"Non-Uniform IIR Digital Filtering Filters with the ability to handle non-uniform spacing can be used to correct for those small positioning errors and can be further used for other applications with non-uniform sampling, such as adaptive sampling or random sampling schemes.\",\n \"One example of such filter can be IIR filter.\",\n \"To create a non-uniform sampling IIR filter, a consistent master design can be created in the continuous domain and converted to the digital domain.\",\n \"The more accurate conversion processes may use a Tustin transform, which involves a matrix inversion, although there are some other approximations that are slightly more efficient.\",\n \"A continuous domain filter design in state space form can be converted to the digital domain.\",\n \"Here, the input vector is x(z), the output vector is y(z), the state variable is w(z) and they are all a function of position z: dw ( z ) dz = A d w ( z ) + B d x ( z ) ( 34 ) y ( z ) = C d w ( z ) + D d x ( z ) ( 35 ) There are several possible approximations that can be made.\",\n \"The first is an Euler approximation, wn=(I+ΔznAd)wn-1+BdΔznxn-1 (36) yn=Cdwn+Ddxn (37) The second type of approximation is the bilinear approximation or Tustin transform: w n - w n - 1 Δ z n = A d w n + w n - 1 2 + B d x n + x n - 1 2 ( 38 ) which has a solution of the form: w n = ( I - Δ z n 2 A d ) - 1 ( I + Δ z n 2 A d ) w n - 1 + 1 2 Δ z n ( I - Δ z n 2 A d ) - 1 B d ( x n + x n - 1 ) ( 39 ) y n = C d w n + D d x n ( 40 ) Non-Uniform FIR Digital Filtering One benefit of using FIR filter designs for non-uniform sampling filter designs is that FIR models translate easily from continuous domain designs.\",\n \"After creating a continuous domain filter, it is possible to simply resample the filter at different points corresponding to the non-uniform sampling points.\",\n \"From a time-domain or frequency domain master filter (with all windowing removed), two vectors can be generated.\",\n \"The first vector can be the master filter and the second vector can be the associated uniformly sampling space vector.\",\n \"In general, the master filter can be over-sampled slightly to improve resampling accuracy later.\",\n \"For uniform spacing, the master filter vector is: bi=bimΔz (41) The non-uniform filter can be slightly more complex.\",\n \"Because the sampling is non-uniform, it can be desirable for the filter to have the same non-uniform spacing as the sampling.\",\n \"If the sampling position vector is known then: b i = b i m Δ z i or b i = b i m + b i + 1 m 2 Δ z i ( 42 ) where the first equation uses the instantaneous value and the second equation uses the trapezoid rule.\",\n \"The master filter can be resampled every time the filter is updated (once for each new frame) which can take longer to compute but is relatively simple to execute.\",\n \"The same filter design described in the uniform-sampling FIR filter can be modified for use with this non-uniform FIR filter scheme.\",\n \"CONCLUSION While various inventive embodiments have been described and illustrated herein, those of ordinary skill in the art will readily envision a variety of other means and/or structures for performing the function and/or obtaining the results and/or one or more of the advantages described herein, and each of such variations and/or modifications is deemed to be within the scope of the inventive embodiments described herein.\",\n \"More generally, those skilled in the art will readily appreciate that all parameters, dimensions, materials, and configurations described herein are meant to be exemplary and that the actual parameters, dimensions, materials, and/or configurations will depend upon the specific application or applications for which the inventive teachings is/are used.\",\n \"Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many equivalents to the specific inventive embodiments described herein.\",\n \"It is, therefore, to be understood that the foregoing embodiments are presented by way of example only and that, within the scope of the appended claims and equivalents thereto, inventive embodiments may be practiced otherwise than as specifically described and claimed.\",\n \"Inventive embodiments of the present disclosure are directed to each individual feature, system, article, material, kit, and/or method described herein.\",\n \"In addition, any combination of two or more such features, systems, articles, materials, kits, and/or methods, if such features, systems, articles, materials, kits, and/or methods are not mutually inconsistent, is included within the inventive scope of the present disclosure.\",\n \"Also, various inventive concepts may be embodied as one or more methods, of which an example has been provided.\",\n \"The acts performed as part of the method may be ordered in any suitable way.\",\n \"Accordingly, embodiments may be constructed in which acts are performed in an order different than illustrated, which may include performing some acts simultaneously, even though shown as sequential acts in illustrative embodiments.\",\n \"All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and/or ordinary meanings of the defined terms.\",\n \"The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.” The phrase “and/or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases.\",\n \"Multiple elements listed with “and/or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined.\",\n \"Other elements may optionally be present other than the elements specifically identified by the “and/or” clause, whether related or unrelated to those elements specifically identified.\",\n \"Thus, as a non-limiting example, a reference to “A and/or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.\",\n \"As used herein in the specification and in the claims, “or” should be understood to have the same meaning as “and/or” as defined above.\",\n \"For example, when separating items in a list, “or” or “and/or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items.\",\n \"Only terms clearly indicated to the contrary, such as “only one of” or “exactly one of,” or, when used in the claims, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements.\",\n \"In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e.\",\n \"“one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of” “Consisting essentially of,” when used in the claims, shall have its ordinary meaning as used in the field of patent law.\",\n \"As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements.\",\n \"This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified.\",\n \"Thus, as a non-limiting example, “at least one of A and B” (or, equivalently, “at least one of A or B,” or, equivalently “at least one of A and/or B”) can refer, in one embodiment, to at least one, optionally including more than one, A, with no B present (and optionally including elements other than B); in another embodiment, to at least one, optionally including more than one, B, with no A present (and optionally including elements other than A); in yet another embodiment, to at least one, optionally including more than one, A, and at least one, optionally including more than one, B (and optionally including other elements); etc.\",\n \"In the claims, as well as in the specification above, all transitional phrases such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “holding,” “composed of,” and the like are to be understood to be open-ended, i.e., to mean including but not limited to.\",\n \"Only the transitional phrases “consisting of” and “consisting essentially of” shall be closed or semi-closed transitional phrases, respectively, as set forth in the United States Patent Office Manual of Patent Examining Procedures, Section 2111.03.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870920"}}},{"rowIdx":4493677,"cells":{"text":{"kind":"list like","value":[["Efficient Infrared Absorption System for Edge Sealing Medium Density Fiberboard (MDF) and Other Engineered Wood Laminates Using Powder and Liquid Coatings","The present invention has to do with an efficient system for coating and caring engineered wood products (EWP) in general, and the edges of EWPs in particular.","An efficient system for coating and curing coatings is provided."],["1.A production line for electrostatic deposition and curing of a material on a product having a plurality of edges and faces, the production line having a continuous conveyor track comprises: preheat oven comprising: at least one preheat catalytic heater, and wherein the preheat oven is adaptable to heat the product to approximately 200 degrees Fahrenheit; a primer booth, wherein the primer booth is adaptable to deposit the material to coat at least one of the plurality of edges and faces of the heated product, and wherein the primer booth is connectable to the preheat oven via the continuous conveyor track; a gel oven comprising at least one gel oven catalytic heater, wherein the gel oven is adaptable to heat the material coated product conveyed from the primer booth to approximately 300 degrees Fahrenheit, and wherein the gel oven is connectable to the primer booth via the continuous conveyor track; a top coat booth wherein the top coat booth is adaptable to top coat the plurality of faces and edges of the heated material coated product conveyed from the gel oven with a top coat material, and wherein the top coat, booth is connectable to the gel oven via the continuous conveyor track; and a hybrid cure oven, wherein the cure oven is adaptable to heat, the top coated product conveyed from the top coat booth to approximately 300 degrees Fahrenheit, and wherein the hybrid cure oven is connectable to the top coat booth via the continuous conveyor track.","2.The continuous conveyor track production line as in claim 21 wherein the primer booth is adaptable to electrostatically powder coat at least one of the plurality of faces and edges.","3.The continuous conveyor track production line as in claim 21 wherein the primer booth is adaptable to liquid coat at least one of the plurality of faces and edges.","4.The continuous conveyor track production line as in claim 21 wherein the hybrid cure oven comprises: at least one edge sealing oven, wherein the at least one edge sealing oven comprises: at least one focused infrared (IR) emitter assembly for radiating IR energy onto at least one of the plurality of edges, wherein the at least one focused infrared (IR) emitter assembly is selected from the group consisting of emitters adaptable to emitting a first, radiation emission within a first infrared range of a spectra absorbed by a first molecule and emitters adaptable to emitting a second radiation emission within the first infrared range of the spectra absorbed by the first molecule; and wherein the at least one focused IR emitter assembly further comprises a reflector.","5.The edge sealing oven as in claim 4 wherein the reflector comprises a radiation doubling reflector for substantially doubling the emitted IR energy radiated onto the at least one of the plurality of edges.","6.The edge sealing oven as in claim 4 wherein the doubling reflector comprises a reflector selected from the group consisting of a gold reflector and an opaque quartz glass reflector.","7.The edge sealing oven as in claim 4 wherein the at least one focused infrared (IR) emitter assembly selected from the group consisting of emitters adaptable to emitting the first radiation emission within the first infrared range of the spectra absorbed by the first molecule further comprises at least one focused infrared (IR) emitter assembly consisting of emitters adaptable to emitting a radiation, emission within the first infrared range of the spectra absorbed by a first water molecule.","8.The edge sealing oven as in claim 4 wherein the at least one focused infrared (IR) emitter assembly selected from the group consisting of emitters adaptable to emitting the first radiation emission within the first infrared range of the spectra absorbed by the first molecule further comprises at least one focused infrared (IR) emitter assembly consisting, of emitters adaptable to emitting a radiation emission within the first infrared range of the spectra absorbed by a first polyethylene molecule.","9.The edge sealing oven as in claim 4 wherein the at least one focused infrared (IR) emitter assembly selected from the group consisting of emitters adaptable to emitting the first radiation emission within the first infrared range of the spectra absorbed by the first molecule further comprises at least one focused infrared (IR) emitter assembly consisting of emitters adaptable to emitting a radiation emission within the first infrared range of the spectra absorbed by a first polyvinyl Chloride molecule.","10.The edge sealing oven as in claim 4 wherein the at least one focused infrared (IR) emitter assembly further comprises a transmission medium.","11.The edge sealing oven as in claim 10 wherein the transmission medium comprises a Fresnel lens.","12.A hybrid cure oven for curing of a material on a product having a plurality of edges and faces, the hybrid cure oven comprising: at least one infrared edge sealing oven, wherein the at least one infrared edge sealing oven comprises at least one quartz glass infrared emitter; at least one infrared catalytic heater oven; and a continuous conveyor track connecting the at least one infrared edge sealing oven and the at least one infrared catalytic heater oven.","13.The hybrid cure oven as in claim 12 wherein the at least one edge sealing oven comprises a plurality of air knifes.","14.The hybrid cure oven as in claim 12 wherein the at least one edge sealing oven comprises: at least one focused infrared (IR) emitter assembly for radiating IR, energy onto at least one of the plurality of edges, wherein the at least one focused infrared (IR) emitter assembly is selected from the group consisting of emitters adaptable to emitting a first radiation emission within a first infrared range of a spectra absorbed by a first molecule and emitters adaptable to emitting a second radiation emission within the first infrared range of the spectra absorbed by the first molecule; and wherein the at least one focused JR emitter assembly further comprises a reflector, wherein the reflector comprises an IR radiation multiplying reflector for effectively multiplying the emitted IR energy radiated onto the at least one of the plurality of edges.","15.The hybrid cure oven as in claim 14 wherein the at least one focused infrared (IR) emitter assembly further comprises a first transmission medium and wherein the transmission medium comprises a focusing lens.","16.The hybrid cure oven as in claim 15 wherein the focusing lens comprises a Fresnel lens.","17.The hybrid cure oven as in claim 14 wherein the at least one focused infrared (IR) emitter assembly further comprises a second transmission medium and wherein the second transmission medium comprises quartz glass.","18.The hybrid cure oven as in claim 14 wherein the at least one focused infrared (IR) emitter assembly selected from the group consisting of emitters adaptable to emitting the first radiation emission within the first infrared range of the spectra absorbed by the first molecule further comprises at least one focused infrared (IR) emitter assembly consisting, of emitters adaptable to emitting a radiation emission within the first infrared range of the spectra absorbed by the first molecule selected from the group of water, polyethylene and polyvinyl Chloride."],[" BACKGROUND "],[" BRIEF SUMMARY The foregoing and other problems are overcome, and other advantages are realized, in accordance with the presently preferred embodiments of these teachings.","The invention is directed towards an efficient production line for curing an epoxy powder or liquid primer.","The production line includes an edge sealing oven vestibule or booth having at least one focused infrared (IR) emitter assembly.","The focused IR emitter assembly is adaptable to emit IR energy field or pattern substantially matched to a predetermined absorption characteristic of the epoxy powder or liquid primer.","The focused IR emitter assembly is adaptable to emit the focused IR energy field comprising substantially a 60 degree arc.","A focused infrared apparatus for curing a primer coated edge is provided.","The apparatus includes at least one focused infrared (IR) emitter assembly adaptable to emit IR energy substantially matched to a predetermined absorption characteristic of the primer and is adaptable to emit a focused IR energy pattern substantially focused on the primer coated edge.","The invention is also directed towards an apparatus for edge curing engineered wood products (EWP) with trailing and leading edges and supported by a conveyor track.","The apparatus includes a first infrared (IR) emitter assembly having a plurality of infrared emitters for emitting IR energy; and, a first reflector adaptable to reflect the IR energy emitted by the first plurality of IR emitters.","The apparatus also includes a second infrared emitter assembly having a second plurality of infrared emitters for emitting IR energy; and, a second reflector adaptable to reflect the IR energy emitted by the second plurality of IR emitters.","The first IR emitter assembly and the second IR emitter assembly are disposed on opposite sides of the conveyor track and offset from a common axis by a predetermined amount, and are adaptable to overlap respective IR energy fields onto the trailing edge of the EWP."],["CROSS-REFERENCE TO RELATED APPLICATIONS The present application is related to, claims the earliest available effective filing date(s) from (e.g., claims earliest available priority dates for other than provisional patent applications; claims benefits under 35 USC § 119(e) for provisional patent applications), and incorporates by reference in its entirety all subject matter of the following listed application(s) (the “Related Applications”) to the extent such subject matter is not inconsistent herewith; the present application also claims the earliest available effective filing date(s) from, and also incorporates by reference in its entirety all subject matter of any and all parent, grandparent, great-grandparent, etc.","applications of the Related Application(s) to the extent such subject matter is not inconsistent herewith: This application is a continuation-in-part patent application of pending application Ser.","No.","15/382,686, filed 18 Dec. 2016 entitled “Efficient Infrared Absorption Systems and Methods for Edge Sealing Medium Density Fiberboard (MDF) and Other Engineered Wood Laminates Using Powder and Liquid Coatings naming Michael J. Chapman as inventor, which is a divisional patent application of pending application Ser.","No.","14/855,234, filed 15 Sep. 2015 entitled “Efficient Infrared Absorption.","Systems and Methods for Edge Sealing Medium Density Fiberboard (MDF) and Other Engineered Wood Laminates Using Powder and Liquid Coatings naming Michael J. Chapman as inventor.","BACKGROUND 1.Field of Use This invention relates to an improved apparatus for infrared heating and curing powder coatings on porous wood products, such as medium density fiberboard (MDF).","More specifically, the invention relates to a novel arrangement of infrared heaters for efficiently heating and curing powdered coatings on MDF board.","2.Description of Prior Art (Background) For the past twenty-five years powder coating of metal parts has become a popular method of finishing.","There are numerous suppliers of the powder coating catering to all segments of the metal industry, ranging from automotive to architectural to marine applications.","Powder on metal has become a mature industry.","The principle method of applying powder to metal parts charges the powder particles via a powder spray gun.","The charged particles are then attracted to metal parts that are earthed via a grounded hanging device on a conveying system.","Wood, or engineered wood products (EWP), such as medium density fiberboard (MDF) are not naturally as conductive as typical metal parts.","MDF is made to become conductive by preheating the MDF to a range that is between about 150 and 250 degrees Fahrenheit.","Preheating the MDF activates the moisture content of the MDF (typically about 5-10%) causing it to become conductive.","Thus, charged powder will attach to a properly grounded MDF board.","Once the powder is attached to the board, the method of curing has been by either heating the powder in a convection oven for a certain period of time or by infrared heat for a period of time that is less than that of a convection oven.","The infrared heat source has been either electric resistance heaters or catalytic heaters.","In recent years, catalytic heaters have attracted considerable attention as the preferred choice of infrared heat sources.","Curing powder coatings on medium density fiberboard (MDF) using an infrared heat source has given rise to certain difficult problems.","MDF board is available in various thicknesses ranging from one-quarter (¼) inch through to two inches, for example.","With all thicknesses, the face surfaces of the MDF board are of a considerable higher density than the core of the board.","The greater the thickness of the MDF board, the greater the difference is between the core density and the face surface density.","MDF board has a certain amount of naturally occurring porosity within the board structure and hence a characteristic moisture content.","The greater the thickness, the greater the porosity due to the lower core density.","When heating powder coated MDF board to cause the powder or liquid to cure, the board is typically hanging in a vertical position.","As the board heats, the entrapped moisture expands and out-gases through the edges of the board, typically from the center of the core in the area of lowest density.","During the curing process using a conventional catalytic heating oven, the face surfaces of the board are easily heated, while the edges, especially the vertical edges, do not receive a full direct line of site of infrared energy.","As a result, the edges of the board are the last to cure as compared to the face surfaces.","This leads to an occurrence where the expanding moisture, which is out-gassing from inside the board, bubbles and forms blisters along the side edges of the board.","These blisters occur because the powder at the edges has not reached a degree of cure, as compared to the face of the board, which would prevent the blisters from forming.","Furthermore, powder coatings, going through the curing process, first turn to liquid and then a gel stage followed by a curing stage where the powder reaches its full cured properties.","However, the liquefied powder will be drawn into the edges of the MDF in a similar manner to a wood edge grain absorbing liquids.","The result is an undesirable different look and feel to that of the coated and cured face sides of the MDF board and EWP's.","In general the edges will display pitting and/or protruding fibers.","Depending on the method of cutting and sanding, of the edges of the MDF board the fibers will protrude in varying degrees.","The degree of this protrusion is dependent on the density across the board thickness and a number of other factors to do with the physical properties of the board—fiber type and length, percentage and type of glue used and the MDF board and/or the EWP's manufacturing process in general.","Thus, the manufacturing and pre-finishing processes for the MDF board, along with the precise application of the powder thickness on the edges, contribute too many variables that may produce sub-standard edge finishes, resulting in waste and low yields.","To compensate for the issues associated with powder coating the edges of MDF boards the present state of the art employs a two coat process.","First a powder prime coat is applied to the edges and faces of the MDF, partially cured, followed by a powder top coat and then the two coats are co-cured together.","The end result provides an acceptable edge finish that mitigates, but doesn't eliminate the undesirable variables mentioned above.","It will be appreciated, that while it is only the edges of the MDF board that require the prime coat, the entire board is primed as part of the overall process; resulting in an unnecessary expenses since the primer coat adds no extra cosmetic benefit to the face sides of the MDF board.","Additionally, there is the extra capital equipment cost of the primer powder application station and associated primer curing oven.","Thus, there exists a need for a system and method for the edge treatment, of MDF boards and EWPs to maintain a high quality powder or liquid coated MDF board while reducing associated manufacturing expenses.","BRIEF SUMMARY The foregoing and other problems are overcome, and other advantages are realized, in accordance with the presently preferred embodiments of these teachings.","The invention is directed towards an efficient production line for curing an epoxy powder or liquid primer.","The production line includes an edge sealing oven vestibule or booth having at least one focused infrared (IR) emitter assembly.","The focused IR emitter assembly is adaptable to emit IR energy field or pattern substantially matched to a predetermined absorption characteristic of the epoxy powder or liquid primer.","The focused IR emitter assembly is adaptable to emit the focused IR energy field comprising substantially a 60 degree arc.","A focused infrared apparatus for curing a primer coated edge is provided.","The apparatus includes at least one focused infrared (IR) emitter assembly adaptable to emit IR energy substantially matched to a predetermined absorption characteristic of the primer and is adaptable to emit a focused IR energy pattern substantially focused on the primer coated edge.","The invention is also directed towards an apparatus for edge curing engineered wood products (EWP) with trailing and leading edges and supported by a conveyor track.","The apparatus includes a first infrared (IR) emitter assembly having a plurality of infrared emitters for emitting IR energy; and, a first reflector adaptable to reflect the IR energy emitted by the first plurality of IR emitters.","The apparatus also includes a second infrared emitter assembly having a second plurality of infrared emitters for emitting IR energy; and, a second reflector adaptable to reflect the IR energy emitted by the second plurality of IR emitters.","The first IR emitter assembly and the second IR emitter assembly are disposed on opposite sides of the conveyor track and offset from a common axis by a predetermined amount, and are adaptable to overlap respective IR energy fields onto the trailing edge of the EWP.","BRIEF DESCRIPTION OF THE DRAWINGS The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification.","The foregoing and other objects, features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which: FIG.","1 is a pictorial view of an edge sealing oven incorporating features of the present invention: FIG.","2 is a pictorial view of the edge sealing oven shown in FIG.","1 showing placement of one bank of infrared sources; FIG.","3 is top down view of the edge sealing oven shown in FIG.","1 showing relative placement and radiation angles of the infrared sources; FIG.","4 is top down view of an infrared source shown in FIG.","2 or FIG.","3; FIG.","5A is a perspective view of an infrared source shown in FIG.","2 or FIG.","3; FIG.","5B is a side view of an infrared source shown in FIG.","2 or FIG.","3; FIG.","5C is a frontal view of an infrared source shown in FIG.","2 or FIG.","3; FIG.","6 illustrates examples of infrared emission spectra of some infrared sources that may be used in accordance with the edge sealing oven shown in FIG.","1; FIG.","7 illustrates a temperature profile of an MDF board as it transits the edge sealing oven shown in FIG.","1; FIG.","8 is a diagram layout of a MDF board powder coating production line in accordance with one embodiment of the present invention; and FIG.","9 is a pictorial view of a hybrid multi-section oven incorporating the edge sealing oven shown in FIG.","1.DETAILED DESCRIPTION The following brief definition of terms shall apply throughout the application: The term “outer” or “outside” refers to a direction away from a user, while the term “inner” or “inside” refers to a direction towards a user; The term “comprising” means including but not limited to, and should be interpreted in the manner it is typically used in the patent context; The phrases “in one embodiment,” “according to one embodiment,” and the like generally mean that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present invention, and may be included in more than one embodiment of the present invention (importantly, such phrases do not necessarily refer to the same embodiment); If the specification describes something as “exemplary” or an “example,” it should be understood that refers to a non-exclusive example; and If the specification states a component or feature “may,” “can,” “could,” “should,” “preferably,” “possibly,” “typically,” “optionally,” “for example,” or “might” (or other such language) be included or have a characteristic, that particular component or feature is not required to be included or to have the characteristic.","The term “cure”, “cured” or “curing” shall be understood to mean the hardening of a suitable edge covering material.","Further, curing may be brought about by chemical additives, ultraviolet radiation (UV), or applied heat.","Referring now to FIG.","1 there is shown a pictorial view of an edge sealing oven vestibule 10 incorporating features of the present invention.","Included are vestibule hood 116, left vestibule 114, left air knife 214, right vestibule 112, right air knife 215, convection oven 1115, and wheels 118.Air knife 214 and air knife 215 provide gas flows 214A and 215A, respectively.","Gas flows 214A, 214B may be any suitable gas flow, such as, for example, high pressure air.","Referring also to FIG.","2 there is shown a pictorial view of the edge sealing oven shown in FIG.","1 showing placement of one bank of infrared sources 116A, 116B.","Referring also to FIG.","3 there is shown a top down view of the edge sealing oven 10 shown in FIG.","1 showing relative placement and radiation angles of the infrared sources.","The infrared sources 114A, 114B, 116A, and 116B are situated in housings 115A, 115B, 117A and 117B, respectively.","It will be appreciated that said infrared sources are rotatable within their respective housing, thus the housing is adapted to allow the outward and unobstructed expression of the full radiation pattern emitted by the infrared source.","As shown in FIG.","3, the infrared sources, e.g., 114A and 116A, are located on opposite sides of the product 33 and set at a predetermined angle to radiate infrared energy onto the trailing edge 33B of product 33 and wherein the radiated infrared energy is a focused infrared energy pattern or field comprising substantially a 60 degree arc.","It will be understood that any suitable focused infrared energy pattern may be used.","Also, as shown in FIG.","3, the infrared sources, e.g., 114A and 116A are staggered, or offset from a common axis, on either side of travel of product 33 by a predetermined amount 131.It will be appreciated that offsetting infrared sources by predetermined amount 131 controls the amount of combined or overlapped infrared energy imposed on trailing edge 33B.","Also shown in FIG.","3 is an example of a coated product 33.Coated product 33 may include faces 33A and 33C.","In general coated product 33 will include trailing edge 33B and leading edge 33D.","It will be understood trailing and leading edges are defined according to the direction of travel through the edge sealing oven 10 as depicted by arrow 37.Referring also to FIG.","4 there is shown a top down view of an infrared source 40 shown in FIG.","2 or FIG.","3.The infrared source 40 may be any suitable focused infrared source, such as, for example, a short wave, medium wave, or long wave infrared emitter.","It will also be appreciated that edge sealing ovens incorporating features of the present invention may utilize multiple groups or pluralities of infrared sources that optimally perform a desired function.","For example, a first plurality of focused infrared sources may have a short wave emission wavelength that preferentially interacts with a predetermined absorption characteristic of a surface or edge of an MDF board, while a second plurality of infrared sources may have medium wave emission wavelength that preferentially interacts with a second predetermined absorption characteristic of an edge or face of the MDF board.","Accordingly operations on an MDF board may be efficiently performed without expending energy emitting large amounts of radiation at unnecessary wave lengths.","Still referring to FIG.","4, infrared source 40 includes fixture 41 and infrared assembly 42.Fixture 41 may be any suitable fixture for holding infrared assembly 42 and adaptable to rotating within respective housing (see FIG.","3).","Focused infrared assembly 42 includes infrared emitter 5A1, transmission medium 5A2, and reflector 5A3.Infrared assembly 42 is adapted to emit a focused infrared energy pattern comprising a 60 degree arc.","Infrared emitter 5A1 may be any suitable IR emitter for heating MDF boards 33.For example, infrared emitter 5A1 may be any suitable short wave, medium wave, or long wave IR emitter.","For example, the IR emitter 5A1 may be a resistive element, a chromium alloy filament, or a tungsten filament.","In alternate embodiments, IR emitter may include single or a pair of heating filaments.","Still referring to FIG.","4, transmission medium 5A2 may be any suitable medium which substantially allows the IR energy emitted by IR emitter 5A1 to transition from its source to the MDF board to be heated.","For example, the transmission medium may be any suitable transparent or semi-transparent quartz glass.","It will also be appreciated that the transmission medium may be suitably shaped or formed to direct or focus the IR energy.","For example, the transmission medium 5A2 may contain characteristics of a focusing lens, such as, for example, a Fresnel lens.","Still referring to FIG.","4, reflector 5A3 may be any suitable reflector for reflecting IR energy generated by IR emitter 5A1 through transmission medium 5A2.For example, reflector 5A3 may comprise a gold coated reflector and/or an aluminum reflector.","It will be appreciated that a gold coated reflector can almost double the effective radiation arriving at the edge 33B of the MDF board 33.Still referring to FIG.","4, reflector 5A3 may be an opaque quartz glass located directly on the emitter 5A1 and therefore needs not be brought into the correct position first as is the case with external reflectors.","It will also be appreciated that the transmission medium 5A2 and/or the reflector 5A3 may be suitably shaped or formed to direct, focus, or concentrate the IR energy onto a particular area of an MDF board.","For example, the transmission medium 5A2 may contain characteristics of a Fresnel lens.","Referring also to FIG.","5A there is shown a perspective view of infrared assembly 42 shown in FIG.","4.Infrared assembly may be any suitable focused infrared assembly such as, for example, a tubular assembly.","Referring also to FIG.","5B there is shown a side view of infrared assembly 42 shown in FIG.","4.Reflector 5A3 may be any suitable reflector material such as, for example, gold, ceramic, or any suitable manmade or natural material.","Referring also to FIG.","5C there is shown a frontal view of infrared assembly 42 shown in FIG.","4.It will be appreciated that infrared assembly may include any suitable number of IR emitters 5A1.Referring also to FIG.","6 there is shown an illustration of examples of infrared emission spectra of some infrared sources that may be used in accordance with the edge sealing oven shown in FIG.","1.Absorption patterns of various powders or liquids that may be exposed to radiation from infrared sources within a hybrid oven 90 (see FIG.","9) in accordance with the present invention are illustrated.","These materials, as well as others, may comprise components of an item to be cured and/or dried.","As polyethylene is a material that may frequently be encountered in the MDF powdering process the absorption spectrum for polyethylene 560 is illustrated, showing the wavelengths at which polyethylene preferentially absorbs infrared radiation.","Infrared sources may be selected to preferentially interact with polyethylene (if the intention is to heat the polyethylene) or to avoid absorption by polyethylene (if the intention is to avoid heating the polyethylene).","Infrared sources may be selected for use in an oven in accordance with the present invention based upon the rate at which radiation from those sources will, or will not, interact with typical powders or liquids.","Still referring to FIG.","6, an absorption spectrum for water 580 is also illustrated.","As briefly described above, ovens in accordance with the present invention may frequently be employed to evaporate water from an MDF board for curing and/or drying purposes.","Accordingly, infrared sources used in an oven in accordance with the present invention may be preferentially selected from sources having a relatively high amount of emissions within the mid infrared range of the spectra highly absorbed by water molecules.","Conversely, if the evaporation of water is not desired, sources that emit lesser amounts of radiation in a range of the spectrum preferentially absorbed by water molecules may be selected.","Still referring to FIG.","6, there is illustrated a few other examples of the emission spectra of infrared sources that may be used in an oven in accordance with the invention.","The present invention may utilize various types of sources with similar or different emission spectra than depicted in the example of FIG.","6.For example, a halogen based near infrared source may provide an emission spectrum similar to that depicted as 510.A short wave infrared source may provide an emission spectrum such as that depicted as 520, while a fast response medium wave infrared source may provide a spectrum such as depicted as 530.An exemplary carbon infrared source may provide an emission spectrum such as depicted as 540, while a medium wave source may provide a spectrum such as depicted as 550.As illustrated in FIG.","6, each of these exemplary infrared sources produce an emission spectrum with a range of wavelengths, depicted along the x-axis, and a relative radiation power for a given source depicted along the y-axis.","The radiative power depicted on the y-axis relates to the wavelength (or frequency) of the radiation in a known fashion.","As can be seen in FIG.","6, each of these example sources has a peak emitted wavelength outside of the visible region of electromagnetic radiation while emitting at a range of other wavelengths.","However, infrared sources with narrower or broader emission spectra may be used in accordance with the present invention.","Further, the effective relative power of different types of sources used in accordance with the present invention may varied by using different wattages, different numbers of sources of a given type, different densities of sources, and different distances of sources from an item to be cured Referring also to FIG.","7 there is shown an illustration of a temperature profile of an MDF board as it transits the edge sealing oven shown in FIG.","1; Referring also to FIG.","8, there is shown a diagram layout of an EWP powder coating production line 10 for coating and curing EWPs or MDF boards 11A.","MDF boards 11A are mounted on continuously moving conveyor track 13 at point A1.It will be appreciated that any suitable EWP may be used and that MDF and EWP are often used interchangeably.","The MDF board 11A is moved by conveyor track 13 to preheat oven 12.Preheat oven 12 heats the MDF board 11A to approximately 200 degrees Fahrenheit in approximately 1.5 minutes.","It will be appreciated that the conveyor track 13 can operate at any suitable line speed.","For example, the conveyor track can continuously operate at a speed of 6 feet per minute.","Preheated MDF board 11B exiting preheat oven 12 at point A is at approximately 200 degrees Fahrenheit and thus conductive which allows powder to electrostatically adhere to the board.","Conveyor track 13 moves preheated board 11B from point A to point B in about 2 minutes where the preheated MDF board 11B enters primer booth 14 at approximately 100 degrees Fahrenheit.","Primer booth or vestibule 14 electrostatically epoxy powder coats the face and edges of MDF board 11B in approximately 1.5 minutes.","Exiting primer booth 14 the primed MDF board 11C is conveyed by conveyor track 13 from point C to point D in approximately 2 minutes where the primed MDF board 11C enters a hybrid multi-section infrared gel oven 16.The infrared catalytic heater portion of the hybrid multi-section infrared gel oven is described in U.S. Pat.","No.","7,159,535 and incorporated herein.","In general, heat is produced when a gaseous fuel is brought into contact with a catalyst in the presence of air containing a normal level of oxygen.","Typically, the fuels are natural gas, propane and butane, for example.","Generally, the gaseous fuel is fed through a bottom of the catalytic heater and is dispersed at atmospheric pressure into contact with a porous active layer.","This active layer contains a catalyst which may be platinum, for example.","Oxygen from the atmosphere enters the porous catalytic layer and reacts with the gaseous fuel, promoted by the catalyst.","This reaction releases the BTU content in the fuel in the form of infrared heat.","The chemical reaction that occurs during the oxidation reduction process produces temperatures within the catalyst of from about 500 to 1000 degrees Fahrenheit (F.).","The by-products of the reaction include carbon dioxide and water vapor.","In approximately 3 minutes the 3-section infrared gel oven 16 heats the primed MDF board 11C to approximately 300 degrees Fahrenheit causing the epoxy powder on the MDF board 11C to gel or partially liquefy.","Exiting the gel oven 16, the gelled MDF board 11D is conveyed from point E to point F by conveyor track 13 in approximately 8 minutes where the gelled MDF board 11D enters the top coat booth 18 at approximately 130 degrees Fahrenheit.","The top coat booth 18 top coats the gelled MDF board 11D with another powder layer on all faces and edges of the gelled MDF board 11D in approximately 1.5 minutes.","Exiting the topcoat booth 18 at point G the top coated MDF board 11E is conveyed to point H where the board 11E enters the multi-section hybrid cure oven 19 (see also FIG.","9—item 90).","The multi-section hybrid cure oven 19 heats the top coated MDF board 11E to approximately 300 degrees Fahrenheit in approximately 5.5 minutes which cures and hardens the previously applied primer coat and the previously applied top coat.","Exiting the multi-section hybrid cure oven 19 at point I the cured MDF board 11F is conveyed to point J approximately 20 minutes allowing for the cured MDF board 11F exiting the cure oven 19 at approximately 300 degrees Fahrenheit to air cool.","At point J the cooled and cured MDF board 11F is removed from conveyor track 13.Referring also to FIG.","9 there is shown a pictorial view of a hybrid multi-section oven 90 incorporating the edge sealing oven 10 shown in FIG.","1.It will be appreciated that the hybrid multi-section oven 90 may comprise any suitable number of edge sealing ovens 10 as described herein and any suitable number of curing ovens 92.It will be further appreciated that the infrared sources within the hybrid multi-section oven 90 may operate with different heating parameters.","Heating parameters may comprise, but are not limited to, a peak spectral wavelength, an output power, a distance between one or more infrared sources and an item to be heated, a density of infrared sources within an area of an oven, a shape of infrared sources, an arrangement of infrared sources relative to an item to be heated, and air flow rate around an item to be heated, a relative humidity of air around an item to be heated, etc.","Different heating zones and/or different pluralities of infrared sources may share all, some or no heating parameters.","For example, different pluralities of infrared sources may operate at different peak spectrums, and may have different spectral spreads (see FIG.","6).","By way of further example, different pluralities of infrared sources may be spaced at different distances from an MDF board with greater numbers of sources per linear distance through the oven.","Yet further variation is possible by selecting or controlling the power output of individual infrared sources.","For example, a first plurality of infrared sources may operate predominately in the mid infrared region, while a second plurality of infrared sources may operate in the near infrared portion of the spectrum.","The plurality of mid infrared sources may be operated at a first wattage, while the plurality of near infrared sources may be operated at a second wattage.","Similarly, the plurality of mid infrared sources may be positioned at a first distance from an MDF board to be cured with a first linear distance between individual sources of the plurality of infrared sources of the mid infrared plurality, while the plurality of near infrared sources may be positioned at a second distance from an MDF board to be cured with a second linear spacing.","Still referring to FIG.","9 The peak wavelength of one or more infrared source used in hybrid oven 90 in accordance with the present invention may be selected based upon the stage of a curing and/or drying process to be performed using a given source.","Different stages of curing and/or drying may involve different edges or faces of the MDF board to be cured and/or dried.","For example, one or more mid infrared sources may be used at an early stage of an oven in order to quickly dry MDF board, as water molecules readily absorb mid infrared radiation, thereby evaporating, the water molecules.","Other types of materials, such as polyethylene, may preferentially absorb mid infrared radiation, thereby enabling such materials to be rapidly heated using mid infrared sources.","Other types of materials may preferentially absorb other wavelengths, and infrared sources strongly emitting, at those wavelengths may be selected to heat such materials.","Based upon the heating to be performed, energy restrictions, time limitations, materials used, etc., different types of sources in different arrangements and numbers/densities may be used at various stages of an oven in accordance with the present invention.","In alternate embodiments MDF board edges 33B may be pre-primed by a liquid primer.","It will be understood that the liquid primer may be cured by any suitable method, such as heat curing (e.g., infrared absorption), for example; or, by chemical reaction from catalyst curing and accelerators.","It will be also be understood that the liquid primer may be any suitable liquid primer such as PVA glue or other solvent based liquid such as, for example, a lacquer or enamel based primer.","It will also be understood that the liquid primer may be a suitable water based primer.","Property characteristics of a suitable primer, water based or solvent based, include, but are not limited to, the capacity to be cured prior to any liquid induced deformation of the MDF board; and, after curing, sufficient mechanical strength (which may be measured by hardness, toughness, stiffness and/or creep, or strength) to resist any deformation of the cured primer due to out-gassing or water vaporization discussed earlier.","Suitable primers, water or solvent based, may also include particulate matter such as resins, polymerized synthetics or chemically modified natural resins including, thermoplastic and/or thermosetting polymers.","Suitable primers may also include amorphous solid particulate matter, such as, for example, glass or nanostructured materials, which may or may not, exhibit glass-liquid transition.","It should be understood that the foregoing description is only illustrative of the invention.","Thus, various alternatives and modifications can be devised by those skilled in the art without departing from the invention.","For example, the EWP boards are often flat, however the same application technique applies to molded.","EWP components as in the case of molded plywood seats that are also stacked to expose the multiple layers of edges in a similar uniform fashion.","Accordingly, the present invention is intended to embrace all such alternatives, modifications and variances that fall within the scope of the appended claims.","For example, any engineered wood product (EWP) having non-uniform densities may be edge coated as described herein.","Additionally, the section headings used herein are provided for consistency with the suggestions under 37 C.F.R.","1.77 or to otherwise provide, organizational cues.","These headings shall not limit or characterize the invention(s) set out in any claims that may issue from this disclosure.","Specifically and by way of example, although the headings might refer to a “Field,” the claims should not, be limited by the language chosen under this heading to describe the so-called field.","Further, a description of a technology in the “Background” is not to be construed as an admission that certain technology is prior art to any invention(s) in this disclosure.","Neither is the “Summary” to be considered as a limiting characterization of the invention(s) set forth in issued claims.","Furthermore, any reference in this disclosure to “invention” in the singular should not be used to argue that there is only a single point of novelty in this disclosure.","Multiple inventions may be set forth according to the limitations of the multiple claims issuing from this disclosure, and such claims accordingly define the invention(s), and their equivalents, that are protected thereby.","In all instances, the scope of the claims shall be considered on their own merits in light of this disclosure, but should not be constrained by the headings set forth herein.","Finally, it will be understood that use of broader terms such as comprises, includes, and having should be understood to provide support for narrower terms such as consisting of, consisting essentially of, and comprised substantially of Use of the term “optionally,” “may,” “might,” “possibly,” and the like with respect to any element of an embodiment means that the element is not required, or alternatively, the element is required, both alternatives being within the scope of the embodiment(s).","Also, references to examples are merely provided for illustrative purposes, and are not intended to be exclusive."]],"string":"[\n [\n \"Efficient Infrared Absorption System for Edge Sealing Medium Density Fiberboard (MDF) and Other Engineered Wood Laminates Using Powder and Liquid Coatings\",\n \"The present invention has to do with an efficient system for coating and caring engineered wood products (EWP) in general, and the edges of EWPs in particular.\",\n \"An efficient system for coating and curing coatings is provided.\"\n ],\n [\n \"1.A production line for electrostatic deposition and curing of a material on a product having a plurality of edges and faces, the production line having a continuous conveyor track comprises: preheat oven comprising: at least one preheat catalytic heater, and wherein the preheat oven is adaptable to heat the product to approximately 200 degrees Fahrenheit; a primer booth, wherein the primer booth is adaptable to deposit the material to coat at least one of the plurality of edges and faces of the heated product, and wherein the primer booth is connectable to the preheat oven via the continuous conveyor track; a gel oven comprising at least one gel oven catalytic heater, wherein the gel oven is adaptable to heat the material coated product conveyed from the primer booth to approximately 300 degrees Fahrenheit, and wherein the gel oven is connectable to the primer booth via the continuous conveyor track; a top coat booth wherein the top coat booth is adaptable to top coat the plurality of faces and edges of the heated material coated product conveyed from the gel oven with a top coat material, and wherein the top coat, booth is connectable to the gel oven via the continuous conveyor track; and a hybrid cure oven, wherein the cure oven is adaptable to heat, the top coated product conveyed from the top coat booth to approximately 300 degrees Fahrenheit, and wherein the hybrid cure oven is connectable to the top coat booth via the continuous conveyor track.\",\n \"2.The continuous conveyor track production line as in claim 21 wherein the primer booth is adaptable to electrostatically powder coat at least one of the plurality of faces and edges.\",\n \"3.The continuous conveyor track production line as in claim 21 wherein the primer booth is adaptable to liquid coat at least one of the plurality of faces and edges.\",\n \"4.The continuous conveyor track production line as in claim 21 wherein the hybrid cure oven comprises: at least one edge sealing oven, wherein the at least one edge sealing oven comprises: at least one focused infrared (IR) emitter assembly for radiating IR energy onto at least one of the plurality of edges, wherein the at least one focused infrared (IR) emitter assembly is selected from the group consisting of emitters adaptable to emitting a first, radiation emission within a first infrared range of a spectra absorbed by a first molecule and emitters adaptable to emitting a second radiation emission within the first infrared range of the spectra absorbed by the first molecule; and wherein the at least one focused IR emitter assembly further comprises a reflector.\",\n \"5.The edge sealing oven as in claim 4 wherein the reflector comprises a radiation doubling reflector for substantially doubling the emitted IR energy radiated onto the at least one of the plurality of edges.\",\n \"6.The edge sealing oven as in claim 4 wherein the doubling reflector comprises a reflector selected from the group consisting of a gold reflector and an opaque quartz glass reflector.\",\n \"7.The edge sealing oven as in claim 4 wherein the at least one focused infrared (IR) emitter assembly selected from the group consisting of emitters adaptable to emitting the first radiation emission within the first infrared range of the spectra absorbed by the first molecule further comprises at least one focused infrared (IR) emitter assembly consisting of emitters adaptable to emitting a radiation, emission within the first infrared range of the spectra absorbed by a first water molecule.\",\n \"8.The edge sealing oven as in claim 4 wherein the at least one focused infrared (IR) emitter assembly selected from the group consisting of emitters adaptable to emitting the first radiation emission within the first infrared range of the spectra absorbed by the first molecule further comprises at least one focused infrared (IR) emitter assembly consisting, of emitters adaptable to emitting a radiation emission within the first infrared range of the spectra absorbed by a first polyethylene molecule.\",\n \"9.The edge sealing oven as in claim 4 wherein the at least one focused infrared (IR) emitter assembly selected from the group consisting of emitters adaptable to emitting the first radiation emission within the first infrared range of the spectra absorbed by the first molecule further comprises at least one focused infrared (IR) emitter assembly consisting of emitters adaptable to emitting a radiation emission within the first infrared range of the spectra absorbed by a first polyvinyl Chloride molecule.\",\n \"10.The edge sealing oven as in claim 4 wherein the at least one focused infrared (IR) emitter assembly further comprises a transmission medium.\",\n \"11.The edge sealing oven as in claim 10 wherein the transmission medium comprises a Fresnel lens.\",\n \"12.A hybrid cure oven for curing of a material on a product having a plurality of edges and faces, the hybrid cure oven comprising: at least one infrared edge sealing oven, wherein the at least one infrared edge sealing oven comprises at least one quartz glass infrared emitter; at least one infrared catalytic heater oven; and a continuous conveyor track connecting the at least one infrared edge sealing oven and the at least one infrared catalytic heater oven.\",\n \"13.The hybrid cure oven as in claim 12 wherein the at least one edge sealing oven comprises a plurality of air knifes.\",\n \"14.The hybrid cure oven as in claim 12 wherein the at least one edge sealing oven comprises: at least one focused infrared (IR) emitter assembly for radiating IR, energy onto at least one of the plurality of edges, wherein the at least one focused infrared (IR) emitter assembly is selected from the group consisting of emitters adaptable to emitting a first radiation emission within a first infrared range of a spectra absorbed by a first molecule and emitters adaptable to emitting a second radiation emission within the first infrared range of the spectra absorbed by the first molecule; and wherein the at least one focused JR emitter assembly further comprises a reflector, wherein the reflector comprises an IR radiation multiplying reflector for effectively multiplying the emitted IR energy radiated onto the at least one of the plurality of edges.\",\n \"15.The hybrid cure oven as in claim 14 wherein the at least one focused infrared (IR) emitter assembly further comprises a first transmission medium and wherein the transmission medium comprises a focusing lens.\",\n \"16.The hybrid cure oven as in claim 15 wherein the focusing lens comprises a Fresnel lens.\",\n \"17.The hybrid cure oven as in claim 14 wherein the at least one focused infrared (IR) emitter assembly further comprises a second transmission medium and wherein the second transmission medium comprises quartz glass.\",\n \"18.The hybrid cure oven as in claim 14 wherein the at least one focused infrared (IR) emitter assembly selected from the group consisting of emitters adaptable to emitting the first radiation emission within the first infrared range of the spectra absorbed by the first molecule further comprises at least one focused infrared (IR) emitter assembly consisting, of emitters adaptable to emitting a radiation emission within the first infrared range of the spectra absorbed by the first molecule selected from the group of water, polyethylene and polyvinyl Chloride.\"\n ],\n [\n \" BACKGROUND \"\n ],\n [\n \" BRIEF SUMMARY The foregoing and other problems are overcome, and other advantages are realized, in accordance with the presently preferred embodiments of these teachings.\",\n \"The invention is directed towards an efficient production line for curing an epoxy powder or liquid primer.\",\n \"The production line includes an edge sealing oven vestibule or booth having at least one focused infrared (IR) emitter assembly.\",\n \"The focused IR emitter assembly is adaptable to emit IR energy field or pattern substantially matched to a predetermined absorption characteristic of the epoxy powder or liquid primer.\",\n \"The focused IR emitter assembly is adaptable to emit the focused IR energy field comprising substantially a 60 degree arc.\",\n \"A focused infrared apparatus for curing a primer coated edge is provided.\",\n \"The apparatus includes at least one focused infrared (IR) emitter assembly adaptable to emit IR energy substantially matched to a predetermined absorption characteristic of the primer and is adaptable to emit a focused IR energy pattern substantially focused on the primer coated edge.\",\n \"The invention is also directed towards an apparatus for edge curing engineered wood products (EWP) with trailing and leading edges and supported by a conveyor track.\",\n \"The apparatus includes a first infrared (IR) emitter assembly having a plurality of infrared emitters for emitting IR energy; and, a first reflector adaptable to reflect the IR energy emitted by the first plurality of IR emitters.\",\n \"The apparatus also includes a second infrared emitter assembly having a second plurality of infrared emitters for emitting IR energy; and, a second reflector adaptable to reflect the IR energy emitted by the second plurality of IR emitters.\",\n \"The first IR emitter assembly and the second IR emitter assembly are disposed on opposite sides of the conveyor track and offset from a common axis by a predetermined amount, and are adaptable to overlap respective IR energy fields onto the trailing edge of the EWP.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS The present application is related to, claims the earliest available effective filing date(s) from (e.g., claims earliest available priority dates for other than provisional patent applications; claims benefits under 35 USC § 119(e) for provisional patent applications), and incorporates by reference in its entirety all subject matter of the following listed application(s) (the “Related Applications”) to the extent such subject matter is not inconsistent herewith; the present application also claims the earliest available effective filing date(s) from, and also incorporates by reference in its entirety all subject matter of any and all parent, grandparent, great-grandparent, etc.\",\n \"applications of the Related Application(s) to the extent such subject matter is not inconsistent herewith: This application is a continuation-in-part patent application of pending application Ser.\",\n \"No.\",\n \"15/382,686, filed 18 Dec. 2016 entitled “Efficient Infrared Absorption Systems and Methods for Edge Sealing Medium Density Fiberboard (MDF) and Other Engineered Wood Laminates Using Powder and Liquid Coatings naming Michael J. Chapman as inventor, which is a divisional patent application of pending application Ser.\",\n \"No.\",\n \"14/855,234, filed 15 Sep. 2015 entitled “Efficient Infrared Absorption.\",\n \"Systems and Methods for Edge Sealing Medium Density Fiberboard (MDF) and Other Engineered Wood Laminates Using Powder and Liquid Coatings naming Michael J. Chapman as inventor.\",\n \"BACKGROUND 1.Field of Use This invention relates to an improved apparatus for infrared heating and curing powder coatings on porous wood products, such as medium density fiberboard (MDF).\",\n \"More specifically, the invention relates to a novel arrangement of infrared heaters for efficiently heating and curing powdered coatings on MDF board.\",\n \"2.Description of Prior Art (Background) For the past twenty-five years powder coating of metal parts has become a popular method of finishing.\",\n \"There are numerous suppliers of the powder coating catering to all segments of the metal industry, ranging from automotive to architectural to marine applications.\",\n \"Powder on metal has become a mature industry.\",\n \"The principle method of applying powder to metal parts charges the powder particles via a powder spray gun.\",\n \"The charged particles are then attracted to metal parts that are earthed via a grounded hanging device on a conveying system.\",\n \"Wood, or engineered wood products (EWP), such as medium density fiberboard (MDF) are not naturally as conductive as typical metal parts.\",\n \"MDF is made to become conductive by preheating the MDF to a range that is between about 150 and 250 degrees Fahrenheit.\",\n \"Preheating the MDF activates the moisture content of the MDF (typically about 5-10%) causing it to become conductive.\",\n \"Thus, charged powder will attach to a properly grounded MDF board.\",\n \"Once the powder is attached to the board, the method of curing has been by either heating the powder in a convection oven for a certain period of time or by infrared heat for a period of time that is less than that of a convection oven.\",\n \"The infrared heat source has been either electric resistance heaters or catalytic heaters.\",\n \"In recent years, catalytic heaters have attracted considerable attention as the preferred choice of infrared heat sources.\",\n \"Curing powder coatings on medium density fiberboard (MDF) using an infrared heat source has given rise to certain difficult problems.\",\n \"MDF board is available in various thicknesses ranging from one-quarter (¼) inch through to two inches, for example.\",\n \"With all thicknesses, the face surfaces of the MDF board are of a considerable higher density than the core of the board.\",\n \"The greater the thickness of the MDF board, the greater the difference is between the core density and the face surface density.\",\n \"MDF board has a certain amount of naturally occurring porosity within the board structure and hence a characteristic moisture content.\",\n \"The greater the thickness, the greater the porosity due to the lower core density.\",\n \"When heating powder coated MDF board to cause the powder or liquid to cure, the board is typically hanging in a vertical position.\",\n \"As the board heats, the entrapped moisture expands and out-gases through the edges of the board, typically from the center of the core in the area of lowest density.\",\n \"During the curing process using a conventional catalytic heating oven, the face surfaces of the board are easily heated, while the edges, especially the vertical edges, do not receive a full direct line of site of infrared energy.\",\n \"As a result, the edges of the board are the last to cure as compared to the face surfaces.\",\n \"This leads to an occurrence where the expanding moisture, which is out-gassing from inside the board, bubbles and forms blisters along the side edges of the board.\",\n \"These blisters occur because the powder at the edges has not reached a degree of cure, as compared to the face of the board, which would prevent the blisters from forming.\",\n \"Furthermore, powder coatings, going through the curing process, first turn to liquid and then a gel stage followed by a curing stage where the powder reaches its full cured properties.\",\n \"However, the liquefied powder will be drawn into the edges of the MDF in a similar manner to a wood edge grain absorbing liquids.\",\n \"The result is an undesirable different look and feel to that of the coated and cured face sides of the MDF board and EWP's.\",\n \"In general the edges will display pitting and/or protruding fibers.\",\n \"Depending on the method of cutting and sanding, of the edges of the MDF board the fibers will protrude in varying degrees.\",\n \"The degree of this protrusion is dependent on the density across the board thickness and a number of other factors to do with the physical properties of the board—fiber type and length, percentage and type of glue used and the MDF board and/or the EWP's manufacturing process in general.\",\n \"Thus, the manufacturing and pre-finishing processes for the MDF board, along with the precise application of the powder thickness on the edges, contribute too many variables that may produce sub-standard edge finishes, resulting in waste and low yields.\",\n \"To compensate for the issues associated with powder coating the edges of MDF boards the present state of the art employs a two coat process.\",\n \"First a powder prime coat is applied to the edges and faces of the MDF, partially cured, followed by a powder top coat and then the two coats are co-cured together.\",\n \"The end result provides an acceptable edge finish that mitigates, but doesn't eliminate the undesirable variables mentioned above.\",\n \"It will be appreciated, that while it is only the edges of the MDF board that require the prime coat, the entire board is primed as part of the overall process; resulting in an unnecessary expenses since the primer coat adds no extra cosmetic benefit to the face sides of the MDF board.\",\n \"Additionally, there is the extra capital equipment cost of the primer powder application station and associated primer curing oven.\",\n \"Thus, there exists a need for a system and method for the edge treatment, of MDF boards and EWPs to maintain a high quality powder or liquid coated MDF board while reducing associated manufacturing expenses.\",\n \"BRIEF SUMMARY The foregoing and other problems are overcome, and other advantages are realized, in accordance with the presently preferred embodiments of these teachings.\",\n \"The invention is directed towards an efficient production line for curing an epoxy powder or liquid primer.\",\n \"The production line includes an edge sealing oven vestibule or booth having at least one focused infrared (IR) emitter assembly.\",\n \"The focused IR emitter assembly is adaptable to emit IR energy field or pattern substantially matched to a predetermined absorption characteristic of the epoxy powder or liquid primer.\",\n \"The focused IR emitter assembly is adaptable to emit the focused IR energy field comprising substantially a 60 degree arc.\",\n \"A focused infrared apparatus for curing a primer coated edge is provided.\",\n \"The apparatus includes at least one focused infrared (IR) emitter assembly adaptable to emit IR energy substantially matched to a predetermined absorption characteristic of the primer and is adaptable to emit a focused IR energy pattern substantially focused on the primer coated edge.\",\n \"The invention is also directed towards an apparatus for edge curing engineered wood products (EWP) with trailing and leading edges and supported by a conveyor track.\",\n \"The apparatus includes a first infrared (IR) emitter assembly having a plurality of infrared emitters for emitting IR energy; and, a first reflector adaptable to reflect the IR energy emitted by the first plurality of IR emitters.\",\n \"The apparatus also includes a second infrared emitter assembly having a second plurality of infrared emitters for emitting IR energy; and, a second reflector adaptable to reflect the IR energy emitted by the second plurality of IR emitters.\",\n \"The first IR emitter assembly and the second IR emitter assembly are disposed on opposite sides of the conveyor track and offset from a common axis by a predetermined amount, and are adaptable to overlap respective IR energy fields onto the trailing edge of the EWP.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification.\",\n \"The foregoing and other objects, features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which: FIG.\",\n \"1 is a pictorial view of an edge sealing oven incorporating features of the present invention: FIG.\",\n \"2 is a pictorial view of the edge sealing oven shown in FIG.\",\n \"1 showing placement of one bank of infrared sources; FIG.\",\n \"3 is top down view of the edge sealing oven shown in FIG.\",\n \"1 showing relative placement and radiation angles of the infrared sources; FIG.\",\n \"4 is top down view of an infrared source shown in FIG.\",\n \"2 or FIG.\",\n \"3; FIG.\",\n \"5A is a perspective view of an infrared source shown in FIG.\",\n \"2 or FIG.\",\n \"3; FIG.\",\n \"5B is a side view of an infrared source shown in FIG.\",\n \"2 or FIG.\",\n \"3; FIG.\",\n \"5C is a frontal view of an infrared source shown in FIG.\",\n \"2 or FIG.\",\n \"3; FIG.\",\n \"6 illustrates examples of infrared emission spectra of some infrared sources that may be used in accordance with the edge sealing oven shown in FIG.\",\n \"1; FIG.\",\n \"7 illustrates a temperature profile of an MDF board as it transits the edge sealing oven shown in FIG.\",\n \"1; FIG.\",\n \"8 is a diagram layout of a MDF board powder coating production line in accordance with one embodiment of the present invention; and FIG.\",\n \"9 is a pictorial view of a hybrid multi-section oven incorporating the edge sealing oven shown in FIG.\",\n \"1.DETAILED DESCRIPTION The following brief definition of terms shall apply throughout the application: The term “outer” or “outside” refers to a direction away from a user, while the term “inner” or “inside” refers to a direction towards a user; The term “comprising” means including but not limited to, and should be interpreted in the manner it is typically used in the patent context; The phrases “in one embodiment,” “according to one embodiment,” and the like generally mean that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present invention, and may be included in more than one embodiment of the present invention (importantly, such phrases do not necessarily refer to the same embodiment); If the specification describes something as “exemplary” or an “example,” it should be understood that refers to a non-exclusive example; and If the specification states a component or feature “may,” “can,” “could,” “should,” “preferably,” “possibly,” “typically,” “optionally,” “for example,” or “might” (or other such language) be included or have a characteristic, that particular component or feature is not required to be included or to have the characteristic.\",\n \"The term “cure”, “cured” or “curing” shall be understood to mean the hardening of a suitable edge covering material.\",\n \"Further, curing may be brought about by chemical additives, ultraviolet radiation (UV), or applied heat.\",\n \"Referring now to FIG.\",\n \"1 there is shown a pictorial view of an edge sealing oven vestibule 10 incorporating features of the present invention.\",\n \"Included are vestibule hood 116, left vestibule 114, left air knife 214, right vestibule 112, right air knife 215, convection oven 1115, and wheels 118.Air knife 214 and air knife 215 provide gas flows 214A and 215A, respectively.\",\n \"Gas flows 214A, 214B may be any suitable gas flow, such as, for example, high pressure air.\",\n \"Referring also to FIG.\",\n \"2 there is shown a pictorial view of the edge sealing oven shown in FIG.\",\n \"1 showing placement of one bank of infrared sources 116A, 116B.\",\n \"Referring also to FIG.\",\n \"3 there is shown a top down view of the edge sealing oven 10 shown in FIG.\",\n \"1 showing relative placement and radiation angles of the infrared sources.\",\n \"The infrared sources 114A, 114B, 116A, and 116B are situated in housings 115A, 115B, 117A and 117B, respectively.\",\n \"It will be appreciated that said infrared sources are rotatable within their respective housing, thus the housing is adapted to allow the outward and unobstructed expression of the full radiation pattern emitted by the infrared source.\",\n \"As shown in FIG.\",\n \"3, the infrared sources, e.g., 114A and 116A, are located on opposite sides of the product 33 and set at a predetermined angle to radiate infrared energy onto the trailing edge 33B of product 33 and wherein the radiated infrared energy is a focused infrared energy pattern or field comprising substantially a 60 degree arc.\",\n \"It will be understood that any suitable focused infrared energy pattern may be used.\",\n \"Also, as shown in FIG.\",\n \"3, the infrared sources, e.g., 114A and 116A are staggered, or offset from a common axis, on either side of travel of product 33 by a predetermined amount 131.It will be appreciated that offsetting infrared sources by predetermined amount 131 controls the amount of combined or overlapped infrared energy imposed on trailing edge 33B.\",\n \"Also shown in FIG.\",\n \"3 is an example of a coated product 33.Coated product 33 may include faces 33A and 33C.\",\n \"In general coated product 33 will include trailing edge 33B and leading edge 33D.\",\n \"It will be understood trailing and leading edges are defined according to the direction of travel through the edge sealing oven 10 as depicted by arrow 37.Referring also to FIG.\",\n \"4 there is shown a top down view of an infrared source 40 shown in FIG.\",\n \"2 or FIG.\",\n \"3.The infrared source 40 may be any suitable focused infrared source, such as, for example, a short wave, medium wave, or long wave infrared emitter.\",\n \"It will also be appreciated that edge sealing ovens incorporating features of the present invention may utilize multiple groups or pluralities of infrared sources that optimally perform a desired function.\",\n \"For example, a first plurality of focused infrared sources may have a short wave emission wavelength that preferentially interacts with a predetermined absorption characteristic of a surface or edge of an MDF board, while a second plurality of infrared sources may have medium wave emission wavelength that preferentially interacts with a second predetermined absorption characteristic of an edge or face of the MDF board.\",\n \"Accordingly operations on an MDF board may be efficiently performed without expending energy emitting large amounts of radiation at unnecessary wave lengths.\",\n \"Still referring to FIG.\",\n \"4, infrared source 40 includes fixture 41 and infrared assembly 42.Fixture 41 may be any suitable fixture for holding infrared assembly 42 and adaptable to rotating within respective housing (see FIG.\",\n \"3).\",\n \"Focused infrared assembly 42 includes infrared emitter 5A1, transmission medium 5A2, and reflector 5A3.Infrared assembly 42 is adapted to emit a focused infrared energy pattern comprising a 60 degree arc.\",\n \"Infrared emitter 5A1 may be any suitable IR emitter for heating MDF boards 33.For example, infrared emitter 5A1 may be any suitable short wave, medium wave, or long wave IR emitter.\",\n \"For example, the IR emitter 5A1 may be a resistive element, a chromium alloy filament, or a tungsten filament.\",\n \"In alternate embodiments, IR emitter may include single or a pair of heating filaments.\",\n \"Still referring to FIG.\",\n \"4, transmission medium 5A2 may be any suitable medium which substantially allows the IR energy emitted by IR emitter 5A1 to transition from its source to the MDF board to be heated.\",\n \"For example, the transmission medium may be any suitable transparent or semi-transparent quartz glass.\",\n \"It will also be appreciated that the transmission medium may be suitably shaped or formed to direct or focus the IR energy.\",\n \"For example, the transmission medium 5A2 may contain characteristics of a focusing lens, such as, for example, a Fresnel lens.\",\n \"Still referring to FIG.\",\n \"4, reflector 5A3 may be any suitable reflector for reflecting IR energy generated by IR emitter 5A1 through transmission medium 5A2.For example, reflector 5A3 may comprise a gold coated reflector and/or an aluminum reflector.\",\n \"It will be appreciated that a gold coated reflector can almost double the effective radiation arriving at the edge 33B of the MDF board 33.Still referring to FIG.\",\n \"4, reflector 5A3 may be an opaque quartz glass located directly on the emitter 5A1 and therefore needs not be brought into the correct position first as is the case with external reflectors.\",\n \"It will also be appreciated that the transmission medium 5A2 and/or the reflector 5A3 may be suitably shaped or formed to direct, focus, or concentrate the IR energy onto a particular area of an MDF board.\",\n \"For example, the transmission medium 5A2 may contain characteristics of a Fresnel lens.\",\n \"Referring also to FIG.\",\n \"5A there is shown a perspective view of infrared assembly 42 shown in FIG.\",\n \"4.Infrared assembly may be any suitable focused infrared assembly such as, for example, a tubular assembly.\",\n \"Referring also to FIG.\",\n \"5B there is shown a side view of infrared assembly 42 shown in FIG.\",\n \"4.Reflector 5A3 may be any suitable reflector material such as, for example, gold, ceramic, or any suitable manmade or natural material.\",\n \"Referring also to FIG.\",\n \"5C there is shown a frontal view of infrared assembly 42 shown in FIG.\",\n \"4.It will be appreciated that infrared assembly may include any suitable number of IR emitters 5A1.Referring also to FIG.\",\n \"6 there is shown an illustration of examples of infrared emission spectra of some infrared sources that may be used in accordance with the edge sealing oven shown in FIG.\",\n \"1.Absorption patterns of various powders or liquids that may be exposed to radiation from infrared sources within a hybrid oven 90 (see FIG.\",\n \"9) in accordance with the present invention are illustrated.\",\n \"These materials, as well as others, may comprise components of an item to be cured and/or dried.\",\n \"As polyethylene is a material that may frequently be encountered in the MDF powdering process the absorption spectrum for polyethylene 560 is illustrated, showing the wavelengths at which polyethylene preferentially absorbs infrared radiation.\",\n \"Infrared sources may be selected to preferentially interact with polyethylene (if the intention is to heat the polyethylene) or to avoid absorption by polyethylene (if the intention is to avoid heating the polyethylene).\",\n \"Infrared sources may be selected for use in an oven in accordance with the present invention based upon the rate at which radiation from those sources will, or will not, interact with typical powders or liquids.\",\n \"Still referring to FIG.\",\n \"6, an absorption spectrum for water 580 is also illustrated.\",\n \"As briefly described above, ovens in accordance with the present invention may frequently be employed to evaporate water from an MDF board for curing and/or drying purposes.\",\n \"Accordingly, infrared sources used in an oven in accordance with the present invention may be preferentially selected from sources having a relatively high amount of emissions within the mid infrared range of the spectra highly absorbed by water molecules.\",\n \"Conversely, if the evaporation of water is not desired, sources that emit lesser amounts of radiation in a range of the spectrum preferentially absorbed by water molecules may be selected.\",\n \"Still referring to FIG.\",\n \"6, there is illustrated a few other examples of the emission spectra of infrared sources that may be used in an oven in accordance with the invention.\",\n \"The present invention may utilize various types of sources with similar or different emission spectra than depicted in the example of FIG.\",\n \"6.For example, a halogen based near infrared source may provide an emission spectrum similar to that depicted as 510.A short wave infrared source may provide an emission spectrum such as that depicted as 520, while a fast response medium wave infrared source may provide a spectrum such as depicted as 530.An exemplary carbon infrared source may provide an emission spectrum such as depicted as 540, while a medium wave source may provide a spectrum such as depicted as 550.As illustrated in FIG.\",\n \"6, each of these exemplary infrared sources produce an emission spectrum with a range of wavelengths, depicted along the x-axis, and a relative radiation power for a given source depicted along the y-axis.\",\n \"The radiative power depicted on the y-axis relates to the wavelength (or frequency) of the radiation in a known fashion.\",\n \"As can be seen in FIG.\",\n \"6, each of these example sources has a peak emitted wavelength outside of the visible region of electromagnetic radiation while emitting at a range of other wavelengths.\",\n \"However, infrared sources with narrower or broader emission spectra may be used in accordance with the present invention.\",\n \"Further, the effective relative power of different types of sources used in accordance with the present invention may varied by using different wattages, different numbers of sources of a given type, different densities of sources, and different distances of sources from an item to be cured Referring also to FIG.\",\n \"7 there is shown an illustration of a temperature profile of an MDF board as it transits the edge sealing oven shown in FIG.\",\n \"1; Referring also to FIG.\",\n \"8, there is shown a diagram layout of an EWP powder coating production line 10 for coating and curing EWPs or MDF boards 11A.\",\n \"MDF boards 11A are mounted on continuously moving conveyor track 13 at point A1.It will be appreciated that any suitable EWP may be used and that MDF and EWP are often used interchangeably.\",\n \"The MDF board 11A is moved by conveyor track 13 to preheat oven 12.Preheat oven 12 heats the MDF board 11A to approximately 200 degrees Fahrenheit in approximately 1.5 minutes.\",\n \"It will be appreciated that the conveyor track 13 can operate at any suitable line speed.\",\n \"For example, the conveyor track can continuously operate at a speed of 6 feet per minute.\",\n \"Preheated MDF board 11B exiting preheat oven 12 at point A is at approximately 200 degrees Fahrenheit and thus conductive which allows powder to electrostatically adhere to the board.\",\n \"Conveyor track 13 moves preheated board 11B from point A to point B in about 2 minutes where the preheated MDF board 11B enters primer booth 14 at approximately 100 degrees Fahrenheit.\",\n \"Primer booth or vestibule 14 electrostatically epoxy powder coats the face and edges of MDF board 11B in approximately 1.5 minutes.\",\n \"Exiting primer booth 14 the primed MDF board 11C is conveyed by conveyor track 13 from point C to point D in approximately 2 minutes where the primed MDF board 11C enters a hybrid multi-section infrared gel oven 16.The infrared catalytic heater portion of the hybrid multi-section infrared gel oven is described in U.S. Pat.\",\n \"No.\",\n \"7,159,535 and incorporated herein.\",\n \"In general, heat is produced when a gaseous fuel is brought into contact with a catalyst in the presence of air containing a normal level of oxygen.\",\n \"Typically, the fuels are natural gas, propane and butane, for example.\",\n \"Generally, the gaseous fuel is fed through a bottom of the catalytic heater and is dispersed at atmospheric pressure into contact with a porous active layer.\",\n \"This active layer contains a catalyst which may be platinum, for example.\",\n \"Oxygen from the atmosphere enters the porous catalytic layer and reacts with the gaseous fuel, promoted by the catalyst.\",\n \"This reaction releases the BTU content in the fuel in the form of infrared heat.\",\n \"The chemical reaction that occurs during the oxidation reduction process produces temperatures within the catalyst of from about 500 to 1000 degrees Fahrenheit (F.).\",\n \"The by-products of the reaction include carbon dioxide and water vapor.\",\n \"In approximately 3 minutes the 3-section infrared gel oven 16 heats the primed MDF board 11C to approximately 300 degrees Fahrenheit causing the epoxy powder on the MDF board 11C to gel or partially liquefy.\",\n \"Exiting the gel oven 16, the gelled MDF board 11D is conveyed from point E to point F by conveyor track 13 in approximately 8 minutes where the gelled MDF board 11D enters the top coat booth 18 at approximately 130 degrees Fahrenheit.\",\n \"The top coat booth 18 top coats the gelled MDF board 11D with another powder layer on all faces and edges of the gelled MDF board 11D in approximately 1.5 minutes.\",\n \"Exiting the topcoat booth 18 at point G the top coated MDF board 11E is conveyed to point H where the board 11E enters the multi-section hybrid cure oven 19 (see also FIG.\",\n \"9—item 90).\",\n \"The multi-section hybrid cure oven 19 heats the top coated MDF board 11E to approximately 300 degrees Fahrenheit in approximately 5.5 minutes which cures and hardens the previously applied primer coat and the previously applied top coat.\",\n \"Exiting the multi-section hybrid cure oven 19 at point I the cured MDF board 11F is conveyed to point J approximately 20 minutes allowing for the cured MDF board 11F exiting the cure oven 19 at approximately 300 degrees Fahrenheit to air cool.\",\n \"At point J the cooled and cured MDF board 11F is removed from conveyor track 13.Referring also to FIG.\",\n \"9 there is shown a pictorial view of a hybrid multi-section oven 90 incorporating the edge sealing oven 10 shown in FIG.\",\n \"1.It will be appreciated that the hybrid multi-section oven 90 may comprise any suitable number of edge sealing ovens 10 as described herein and any suitable number of curing ovens 92.It will be further appreciated that the infrared sources within the hybrid multi-section oven 90 may operate with different heating parameters.\",\n \"Heating parameters may comprise, but are not limited to, a peak spectral wavelength, an output power, a distance between one or more infrared sources and an item to be heated, a density of infrared sources within an area of an oven, a shape of infrared sources, an arrangement of infrared sources relative to an item to be heated, and air flow rate around an item to be heated, a relative humidity of air around an item to be heated, etc.\",\n \"Different heating zones and/or different pluralities of infrared sources may share all, some or no heating parameters.\",\n \"For example, different pluralities of infrared sources may operate at different peak spectrums, and may have different spectral spreads (see FIG.\",\n \"6).\",\n \"By way of further example, different pluralities of infrared sources may be spaced at different distances from an MDF board with greater numbers of sources per linear distance through the oven.\",\n \"Yet further variation is possible by selecting or controlling the power output of individual infrared sources.\",\n \"For example, a first plurality of infrared sources may operate predominately in the mid infrared region, while a second plurality of infrared sources may operate in the near infrared portion of the spectrum.\",\n \"The plurality of mid infrared sources may be operated at a first wattage, while the plurality of near infrared sources may be operated at a second wattage.\",\n \"Similarly, the plurality of mid infrared sources may be positioned at a first distance from an MDF board to be cured with a first linear distance between individual sources of the plurality of infrared sources of the mid infrared plurality, while the plurality of near infrared sources may be positioned at a second distance from an MDF board to be cured with a second linear spacing.\",\n \"Still referring to FIG.\",\n \"9 The peak wavelength of one or more infrared source used in hybrid oven 90 in accordance with the present invention may be selected based upon the stage of a curing and/or drying process to be performed using a given source.\",\n \"Different stages of curing and/or drying may involve different edges or faces of the MDF board to be cured and/or dried.\",\n \"For example, one or more mid infrared sources may be used at an early stage of an oven in order to quickly dry MDF board, as water molecules readily absorb mid infrared radiation, thereby evaporating, the water molecules.\",\n \"Other types of materials, such as polyethylene, may preferentially absorb mid infrared radiation, thereby enabling such materials to be rapidly heated using mid infrared sources.\",\n \"Other types of materials may preferentially absorb other wavelengths, and infrared sources strongly emitting, at those wavelengths may be selected to heat such materials.\",\n \"Based upon the heating to be performed, energy restrictions, time limitations, materials used, etc., different types of sources in different arrangements and numbers/densities may be used at various stages of an oven in accordance with the present invention.\",\n \"In alternate embodiments MDF board edges 33B may be pre-primed by a liquid primer.\",\n \"It will be understood that the liquid primer may be cured by any suitable method, such as heat curing (e.g., infrared absorption), for example; or, by chemical reaction from catalyst curing and accelerators.\",\n \"It will be also be understood that the liquid primer may be any suitable liquid primer such as PVA glue or other solvent based liquid such as, for example, a lacquer or enamel based primer.\",\n \"It will also be understood that the liquid primer may be a suitable water based primer.\",\n \"Property characteristics of a suitable primer, water based or solvent based, include, but are not limited to, the capacity to be cured prior to any liquid induced deformation of the MDF board; and, after curing, sufficient mechanical strength (which may be measured by hardness, toughness, stiffness and/or creep, or strength) to resist any deformation of the cured primer due to out-gassing or water vaporization discussed earlier.\",\n \"Suitable primers, water or solvent based, may also include particulate matter such as resins, polymerized synthetics or chemically modified natural resins including, thermoplastic and/or thermosetting polymers.\",\n \"Suitable primers may also include amorphous solid particulate matter, such as, for example, glass or nanostructured materials, which may or may not, exhibit glass-liquid transition.\",\n \"It should be understood that the foregoing description is only illustrative of the invention.\",\n \"Thus, various alternatives and modifications can be devised by those skilled in the art without departing from the invention.\",\n \"For example, the EWP boards are often flat, however the same application technique applies to molded.\",\n \"EWP components as in the case of molded plywood seats that are also stacked to expose the multiple layers of edges in a similar uniform fashion.\",\n \"Accordingly, the present invention is intended to embrace all such alternatives, modifications and variances that fall within the scope of the appended claims.\",\n \"For example, any engineered wood product (EWP) having non-uniform densities may be edge coated as described herein.\",\n \"Additionally, the section headings used herein are provided for consistency with the suggestions under 37 C.F.R.\",\n \"1.77 or to otherwise provide, organizational cues.\",\n \"These headings shall not limit or characterize the invention(s) set out in any claims that may issue from this disclosure.\",\n \"Specifically and by way of example, although the headings might refer to a “Field,” the claims should not, be limited by the language chosen under this heading to describe the so-called field.\",\n \"Further, a description of a technology in the “Background” is not to be construed as an admission that certain technology is prior art to any invention(s) in this disclosure.\",\n \"Neither is the “Summary” to be considered as a limiting characterization of the invention(s) set forth in issued claims.\",\n \"Furthermore, any reference in this disclosure to “invention” in the singular should not be used to argue that there is only a single point of novelty in this disclosure.\",\n \"Multiple inventions may be set forth according to the limitations of the multiple claims issuing from this disclosure, and such claims accordingly define the invention(s), and their equivalents, that are protected thereby.\",\n \"In all instances, the scope of the claims shall be considered on their own merits in light of this disclosure, but should not be constrained by the headings set forth herein.\",\n \"Finally, it will be understood that use of broader terms such as comprises, includes, and having should be understood to provide support for narrower terms such as consisting of, consisting essentially of, and comprised substantially of Use of the term “optionally,” “may,” “might,” “possibly,” and the like with respect to any element of an embodiment means that the element is not required, or alternatively, the element is required, both alternatives being within the scope of the embodiment(s).\",\n \"Also, references to examples are merely provided for illustrative purposes, and are not intended to be exclusive.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870929"}}},{"rowIdx":4493678,"cells":{"text":{"kind":"list like","value":[["MOLDED POCKET IN TRANSACTION CARD CONSTRUCTION","Methods and apparatuses are provided for manufacturing a transaction card.","The disclosed methods and apparatuses may be used to form a transaction card frame within a mold.","The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame.","The one or more recessed portions may be configured for affixing one or more electronic components."],["1-20.","(canceled) 21.A method of manufacturing a transaction card, the method comprising: forming a transaction card frame within a mold, the transaction card frame including: a front side having a first surface; a rear side opposite the front side; and a recessed portion within the first surface, the recessed portion configured for affixing one or more electronic components and including a second surface recessed a first depth from the first surface; wherein forming the transaction card includes: filling a cavity in the mold with heated material; cooling the mold; and removing the card from the mold.","22.The method of claim 21, further comprising forming the recessed portion within the first surface by forming a third surface at a second depth from the first surface.","23.The method of claim 22, wherein forming the third surface includes removing material using a milling operation.","24.The method of claim 22, wherein the second depth is greater than the first depth.","25.The method of claim 22, wherein the first depth is greater than the second depth.","26.The method of claim 22, wherein the first depth is 0.19-0.23 mm, and the second depth is 0.60-0.64 mm.","27.The method of claim 21, wherein forming the transaction card frame within the mold comprises injection molding the transaction card frame within the mold using a thermoplastic or a thermosetting polymer.","28.The method of claim 22, wherein second and third surfaces are formed within the mold.","29.The method of claim 21, wherein the mold is constructed of steel or aluminum.","30.The method of claim 21, further including: injecting the heated material into the mold via a channel and a gate disposed within the mold, the mold including two separable plates; separating the two plates; and removing excess material left on the card frame by the gate.","31.The method of claim 30, wherein removing the excess material includes a sanding, buffing, grinding, or milling operation.","32.The method of claim 21, further including: injecting the heated material into the mold, the mold including two separable plates; separating the two plates; driving a pin through a through hole disposed in the mold to release the card frame from the mold; and removing excess material left on the card frame by the pin or a gate.","33.The method of claim 32, wherein removing the excess material includes a sanding, buffing, grinding, or milling operation.","34.The method of claim 21, wherein: a mark is left on a surface within the recessed portion; and the method further includes covering the mark by installing an electronic component into the recessed portion.","35.The method of claim 34, wherein the electronic component is an EMV chip.","36.The method of claim 21, further including covering a mark left on the card frame by applying a magnetic strip to the card frame to cover the marks.","37.The method of claim 21, further including removing a mark left on the card during a process of adding a recessed surface to the card frame via a milling process.","38.The method of claim 37, further including applying a magnetic strip to the recessed surface.","39.The method of claim 21, further including affixing an electronic component within the recessed portion of the first surface.","40.The method of claim 39, wherein affixing the electronic component comprises use of an adhesive, a press fitting, a screw, or a clamp.","41.The method of claim 21, wherein the mold includes a first plate, a second plate, a channel extending through a thickness of the first plate, and a gate connected to the channel, the method further comprising: joining the first and second plates to define the cavity within the mold; filling the cavity by injecting the heated material through the channel and the gate; separating the first and second plates; driving a pin through a through hole disposed in the mold to release the card frame from the mold; and removing excess material left on the card frame by the channel, pin, through hole, or gate."],[" BACKGROUND Transaction cards, such as credit and debit cards, have increasingly become a primary means for customers to complete financial transactions.","Typically, transaction cards are cut from laminated sheets of polyvinyl chloride (PVC) or polycarbonate (PC), or other similar materials.","After the overall shape of the card is formed, the card may be modified to add functional and/or visual features.","For example, a magnetic strip may be affixed to one side, the card may be stamped with the card number and customer name, and color or a design may be added for appearance.","Many transaction card providers are moving away from using magnetic strip technology and now additionally or alternatively include more advanced electronic components attached to or embedded within a transaction card.","For example, some transaction cards include microchips (e.g., Europay, Mastercard, and Visa (EMV) chips) that more securely and efficiently manage card and customer information.","While the chips provide several advantages to customers, they can increase the complexity and cost of transaction card manufacturing.","For example, manufacturing a transaction card that includes an electronic component (such as an EMV chip) may include additional steps to create space(s) for the component and steps to secure the component within the space(s).","Often, a process known as milling and embedding is used.","In this process, a computer numerical control (CNC) machine is used to mill away a space, called a pocket, of a desired size for accommodating or receiving an electronic component (e.g., an EMV chip).","The term “pocket” refers to a recessed portion of a structure and may include a base portion, one or more walls projecting from the base portion, and an opening formed by the one or more walls.","The term “pocket” may also refer to a cavity, a hole, or a container.","The component is then embedded or secured into the space (i.e., pocket) using a hot press adhesive.","The milling and embedding processes are typically performed together in an in-line machine.","In addition, as transaction cards increase in prevalence, expectations for transaction card quality have increased.","Transaction cards have increasingly been made to meet higher standards regarding materials, manufacturing tolerances, and overall “fit and finish.” Accordingly, tolerance of defects in transaction cards related to manufacturing processes has decreased over time.","The present disclosure is directed to overcoming one or more of the problems set forth above and/or other problems associated with conventional transaction card construction."],[" SUMMARY The disclosed embodiments relate to a process for constructing a transaction card that includes a molded pocket.","Consistent with a disclosed embodiment, a method of manufacturing a transaction card is provided.","The method may include forming a transaction card frame within a mold, the transaction card frame including at least one recessed portion within a first surface; and affixing at least one electronic component to an interior of the at least one recessed portion.","Consistent with another disclosed embodiment, a mold for molding a transaction card is provided.","The mold may include a first plate and a second plate.","The first plate and second plate may be joined together, forming a cavity for receiving a material for forming a transaction card frame.","The first plate and the second plate of the mold may include structures that define a shape and dimension of at least one recessed portion to be formed within a first surface of the transaction card frame, the at least one recessed portion configured for affixing at least one electronic component.","It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosed embodiments, as claimed."],["PRIORITY CLAIM This application is a continuation of U.S. application Ser.","No.","15/293,270, filed Oct. 13, 2016, which claims the benefit of U.S. provisional patent application No.","62/241,636, filed Oct. 14, 2015.The aforementioned applications are incorporated herein by reference in their entireties.","TECHNICAL FIELD The disclosed embodiments generally relate to transaction card construction, and particularly, to molding a pocket into a transaction card.","BACKGROUND Transaction cards, such as credit and debit cards, have increasingly become a primary means for customers to complete financial transactions.","Typically, transaction cards are cut from laminated sheets of polyvinyl chloride (PVC) or polycarbonate (PC), or other similar materials.","After the overall shape of the card is formed, the card may be modified to add functional and/or visual features.","For example, a magnetic strip may be affixed to one side, the card may be stamped with the card number and customer name, and color or a design may be added for appearance.","Many transaction card providers are moving away from using magnetic strip technology and now additionally or alternatively include more advanced electronic components attached to or embedded within a transaction card.","For example, some transaction cards include microchips (e.g., Europay, Mastercard, and Visa (EMV) chips) that more securely and efficiently manage card and customer information.","While the chips provide several advantages to customers, they can increase the complexity and cost of transaction card manufacturing.","For example, manufacturing a transaction card that includes an electronic component (such as an EMV chip) may include additional steps to create space(s) for the component and steps to secure the component within the space(s).","Often, a process known as milling and embedding is used.","In this process, a computer numerical control (CNC) machine is used to mill away a space, called a pocket, of a desired size for accommodating or receiving an electronic component (e.g., an EMV chip).","The term “pocket” refers to a recessed portion of a structure and may include a base portion, one or more walls projecting from the base portion, and an opening formed by the one or more walls.","The term “pocket” may also refer to a cavity, a hole, or a container.","The component is then embedded or secured into the space (i.e., pocket) using a hot press adhesive.","The milling and embedding processes are typically performed together in an in-line machine.","In addition, as transaction cards increase in prevalence, expectations for transaction card quality have increased.","Transaction cards have increasingly been made to meet higher standards regarding materials, manufacturing tolerances, and overall “fit and finish.” Accordingly, tolerance of defects in transaction cards related to manufacturing processes has decreased over time.","The present disclosure is directed to overcoming one or more of the problems set forth above and/or other problems associated with conventional transaction card construction.","SUMMARY The disclosed embodiments relate to a process for constructing a transaction card that includes a molded pocket.","Consistent with a disclosed embodiment, a method of manufacturing a transaction card is provided.","The method may include forming a transaction card frame within a mold, the transaction card frame including at least one recessed portion within a first surface; and affixing at least one electronic component to an interior of the at least one recessed portion.","Consistent with another disclosed embodiment, a mold for molding a transaction card is provided.","The mold may include a first plate and a second plate.","The first plate and second plate may be joined together, forming a cavity for receiving a material for forming a transaction card frame.","The first plate and the second plate of the mold may include structures that define a shape and dimension of at least one recessed portion to be formed within a first surface of the transaction card frame, the at least one recessed portion configured for affixing at least one electronic component.","It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosed embodiments, as claimed.","BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate disclosed embodiments and, together with the description, serve to explain the disclosed embodiments.","In the drawings: FIG.","1 is a block diagram of an exemplary transaction system, consistent with disclosed embodiments; FIG.","2A is a front view of an exemplary transaction card frame, consistent with disclosed embodiments; FIG.","2B is a back view of an exemplary transaction card frame, consistent with disclosed embodiments; FIG.","3 is a cross-sectional view of the exemplary transaction card frame FIG.","2A taken along line 3-3, consistent with disclosed embodiments; FIG.","4A is a schematic perspective view of a first plate of an exemplary mold for producing transaction card frames, consistent with disclosed embodiments; FIG.","4B is a schematic perspective view of a second plate of an exemplary mold for producing transaction card frames, consistent with disclosed embodiments; FIG.","5A is a perspective view of the first plate and the second plate of the exemplary mold shown in FIGS.","4A and 4B stacked together, consistent with disclosed embodiments; FIG.","5B is a cross-sectional view of the exemplary mold of FIG.","5A taken along line 5-5, consistent with disclosed embodiments; FIG.","6A is a perspective view of a first plate of an exemplary mold for producing transaction card frames, consistent with disclosed embodiments; FIG.","6B is perspective view of a second plate of an exemplary mold for producing transaction card frames, consistent with disclosed embodiments; FIG.","7A is a perspective view of the first plate and the second plate of the exemplary mold shown in FIGS.","6A and 6B stacked together, consistent with disclosed embodiments; FIG.","7B is a cross-sectional view of the exemplary mold of FIG.","7A taken along line 6-6, consistent with disclosed embodiments; FIG.","8A is a perspective view of a first plate of an exemplary mold for producing transaction card frames, consistent with disclosed embodiments; FIG.","8B is a perspective view of a second plate of an exemplary mold for producing transaction card frames, consistent with disclosed embodiments; FIG.","9A is a perspective view of the first plate and the second plate of the exemplary mold shown in FIGS.","8A and 8B stacked together, consistent with disclosed embodiments; FIG.","9B is a cross-sectional view of the exemplary mold of FIG.","9A taken along line 8-8, consistent with disclosed embodiments; and FIG.","10 is a flowchart showing an exemplary method for forming a transaction card, consistent with the disclosed embodiments.","DETAILED DESCRIPTION Reference will now be made in detail to the disclosed embodiments, examples of which are illustrated in the accompanying drawings.","Wherever convenient, the same reference numbers will be used throughout the drawings to refer to the same or like parts.","Disclosed embodiments include apparatuses and methods for manufacturing a transaction card.","For example, disclosed embodiments include a mold for injection molding or compression molding of a transaction card frame including a pocket (or a recessed portion) to accommodate (or receive, affix) an electronic component.","Various methods may be used to manufacture the transaction card frame out of different types of materials that are suitable for satisfying certain criteria or preferences.","In addition, the disclosed embodiments may reduce costs or complexity of card manufacturing when compared to traditional processes.","The term “transaction card,” as used herein, may refer to any physical card product that is configured to provide information, such as financial information (e.g., card numbers, account numbers, etc.","), quasi-financial information (e.g., rewards balance, discount information, etc.)","and/or individual-identifying information (e.g., name, address, etc.","), when the card is read by a card reader.","Examples of transaction cards include credit cards, debit cards, gift cards, rewards cards, frequent flyer cards, merchant-specific cards, discount cards, identification cards, and driver's licenses, but are not limited thereto.","Transaction cards may be flat objects configured to slide through a card reader, inserted into a card reading slot, or otherwise physically interact with a card reading device.","Cards may be manufactured to size tolerances intended to allow the cards to slide through, fit inside, or otherwise physically interact with such a device.","For example, a transaction card may be manufactured to conform to the ISO/IEC 7810 ID-1 standard, and have dimensions of 85.60 mm×53.98 mm×0.76 mm.","This standard is merely exemplary, as other standards may be used, and some cards may deviate from a standard in such a way that they may still properly interact with certain card reading devices.","FIG.","1 illustrates an exemplary transaction system 10.Transaction system 10 may include a computing system configured to receive and send information between the components of transaction system 10 and with components outside of transaction system 10.Transaction system 10 may include a financial service provider system 12 and a merchant system 14 communicating with each other through a network 16.Transaction system 10 may include additional and/or alternative components.","Financial service provider system 12 may include one or more computer systems associated with an entity that provides financial services.","For example, the entity may be a bank, credit union, credit card issuer, or other type of financial service entity that generates, provides, manages, and/or maintains financial service accounts for one or more customers.","Financial service accounts may include, for example, credit card accounts, checking accounts, savings accounts, loan accounts, reward accounts, and any other types of financial service accounts.","Financial service accounts may be associated with physical financial service transaction cards, such as credit or debit cards that customers use to perform financial service transactions, such as purchasing goods and/or services online or at a point of sale (POS) terminal.","Financial service accounts may also be associated with electronic financial products and services, such as a digital wallet or similar account that may be used to perform electronic transactions, such as purchasing goods and/or services online.","Merchant system 14 may include one or more computer systems associated with a merchant.","For example, merchant system 14 may be associated with an entity that provides goods and/or services (e.g., a retail store).","The merchant may include brick-and-mortar location(s) that a customer may physically visit and purchase goods and services using the transaction cards.","Such physical locations may include computing devices (e.g., merchant system 14) that perform financial service transactions with customers (e.g., POS terminal(s), kiosks, etc.).","Additionally or alternatively, merchant system 14 may be associated with a merchant who provides an electronic shopping environment, such as a website or other online platforms that consumers may access using a computer through browser software, a mobile application, or similar software.","Merchant system 14 may include a client device, such as a laptop computer, desktop computer, smart phone, or tablet, which a customer may operate to access the electronic shopping mechanism.","Network 16 may include any type of network configured to facilitate communications and data exchange between components of transaction system 10, such as, for example, financial service provider system 12 and merchant system 14.Network 16 may include a Local Area Network (LAN) or a Wide Area Network (WAN), such as the Internet.","Network 16 may be a single network or a combination of networks.","Network 16 is not limited to the above examples and transaction system 10 may implement any type of network that allows entities (shown and not shown) of transaction system 10 to exchange data and information.","Transaction system 10 may be configured to conduct a transaction using a transaction card 20.In some embodiments, financial service provider system 12 may provide transaction card 20 to a customer for use in conducting transactions associated with a financial service account held by the customer.","For example, the customer may use transaction card 20 at a merchant location to make a purchase.","During the course of the purchase, information may be transferred from transaction card 20 to merchant system 14 (e.g., a point of sale device).","Merchant system 14 may communicate with financial service provider system 12 via network 16 to verify the information and to complete or deny the transaction.","For example, merchant system 14 may receive account information from transaction card 20.Merchant system 14 may transmit the account information and a purchase amount, among other transaction information, to financial service provider system 12.Financial service provider system 12 may settle the transaction by transferring funds from the customer's financial service account to a financial service account associated with the merchant.","While transaction system 10 and transaction card 20 are depicted and described in relation to transactions that involve customers, merchants, and financial service providers, it should be understood that the these entities are used only as an example to illustrate one environment in which transaction card 20 may be used.","Transaction card 20 is not limited to financial products and may be any physical card product that is configured to provide information to another device when read by a card reader.","For example, transaction card 20 may be an identification card configured to provide information to a device in order to identify the holder of the card (e.g., driver's license).","In some embodiments, transaction card 20 may further include an electronic component 22.As used herein, an “electronic component” may be one or more devices and/or elements configured to receive, store, process, provide, transfer, send, delete, and/or generate information.","For example, electronic component 22 may be a microchip (e.g., EMV chip), a communication device (e.g., Near Field Communication (NFC) antenna, Bluetooth® device, WiFi device), a magnetic strip, a barcode, Quick Response (QR) code, etc.","Electronic component 22 may be secured (or affixed, attached) to a transaction card frame 24 (or card frame 24) in such a way that allows card frame 24 to carry electronic component 22 while maintaining a utility of electronic component 22 (i.e., allowing electronic component 22 to interact with merchant system 14).","FIG.","2A is a front view of an exemplary transaction card frame 24.FIG.","2B is a rear view of the card frame 24.FIG.","2A shows a front side 202 of card frame 24 and FIG.","2B shows a rear side 204 of card frame 24.As shown in FIG.","2A, card frame 24 includes a pocket 206 configured to accommodate (or receive, affix, or secure) electronic component 22.Pocket 206 may include features that accommodate a particular geometry of electronic component 22 or enable electronic component 22 to be fixed (or secured, affixed, attached, or embedded) to card frame 24.Card frame 24 may include an upper surface 208 (or first surface 208).","Pocket 206 may include a second surface 210 recessed a first depth from first surface 208 of card frame 24.Pocket 206 may also include a third surface 212.Third surface 212 may be recessed a second depth from first surface 208.The second depth may be greater than the first depth.","That is, third surface 212 may form a base portion of pocket 206, and second surface 210 may form an elevated surface at a certain height above third surface 212.The dimensions and depths of second surface 210 and third surface 212 may be set based on a plurality of criteria such as the size of a particular electronic component, industry standards, manufacturing tolerances, or other considerations.","Based on the geometry of the electronic component to be embedded in pocket 206, pocket 206 may include fewer (e.g., one) or more (e.g., three, four, etc.)","surfaces recessed from first surface 208.For example, in some embodiments, pocket 206 may be configured to accommodate a microchip, such as an EMV chip.","In these embodiments, first surface 208 may be referred to as P0.Second surface 210 may be referred to as P1 and used as a glue layer for a contact plate of the EMV chip.","Third surface 212 may be referred to as P2 and used as a deeper pocket to accommodate the depth of the EMV chip itself.","FIG.","3 illustrates a cross-sectional view of an exemplary embodiment of card frame 24 shown in FIG.","2 taken along line 3-3.FIG.","3 includes a magnified view of pocket 206 which illustrates surfaces 208, 210, and 212.As shown in the magnified view of pocket 206, second surface 210 is recessed a first depth H1 from first surface 208, and third surface 212 is recessed a second depth H2 from first surface 208.The dimensions (e.g., widths and heights or depths) of surfaces 208, 210, and 212 may vary based on the dimensions of the electronic component.","For example, in some embodiments, first depth H1 may be 0.21 mm (with an error tolerance of +/−0.02 mm), and second depth H2 may be 0.62 mm (with an error tolerance of +/−0.02 mm).","Card frame 24 may be manufactured using a molding process, such as an injection molding process or a compression molding process.","Although injection molding is discussed in detail as an example of the molding process, some features discussed below may also be applied to the compression molding process.","During an injection molding process, any material suitable for injection molding, such as thermoplastic and thermosetting polymers, may be used for forming card frame 24.Injection and/or ejection molds used to form card frame 24 may include structures for forming pocket 206 within card frame 24 either without additional milling, or with reduced milling steps than required by conventional transaction card manufacturing processes.","FIG.","4A is a schematic perspective view of a first plate 402 (or first component) of an exemplary mold 400 for manufacturing card frame 24, and FIG.","4B is a schematic perspective view of a second plate 404 (or second component) of mold 400.Mold 400 may be constructed of any material or materials suitable for use as an injection or compression mold, such as various grades of steel or aluminum.","First plate 402 includes a surface 406 that defines surface 208 of card frame 24.In some embodiments, surface 406 is substantially flat.","Surface 406 may include a protrusion structure 408 protruding from the rest of surface 406.Protrusion structure 408 defines the shape and dimension of pocket 206.For example, protrusion structure 408 may include a first protrusion portion 410 (also shown in FIG.","5B) protruding a first distance from surface 406.The first distance may be substantially the same as the first depth H1 shown in FIG.","3.The first protrusion portion 410 defines second surface 210 of pocket 206.Protrusion structure 408 may include a second protrusion portion 412 (also shown in FIG.","5B) protruding a second distance from surface 406.The second distance may be greater than the first distance.","The second distance may be substantially the same as the second depth H2 shown in FIG.","3.The second protrusion portion 412 defines third surface 212 of pocket 206.First plate 402 may include a gate 414 formed on surface 406.Gate 414 is an opening on surface 406, and is configured to receive a material for forming card frame 24 during the injection molding process.","Gate 414 may be connected with a channel 504 (shown in FIG.","5B) extending throughout the thickness of first plate 402.Second plate 404 may include a through hole for receiving a pin 416.Second plate 402 may include a surface 418.Surface 418 may include a shape corresponding to rear side 204 of card frame 24 and may define rear side 204.FIG.","5A is a perspective view of first plate 402 and second plate 404 of mold 400 shown in FIGS.","4A and 4B stacked or joined together.","FIG.","5B is a cross-sectional view of mold 400 of FIG.","5A taken along line 5-5.As shown in FIG.","5B, when the first plate 402 and second plate 404 are joined together, surface 406 and surface 418 define a space or cavity 502 for receiving a material for forming card frame 24 during an injection molding process.","Cavity 502 has substantially the same three-dimensional shape and dimensions as card frame 24.As shown in FIG.","5B, protrusion structure 408 and surface 418 defines the shape and dimension of pocket 206.As shown in FIG.","5B, gate 414 may be connected with channel 504 for receiving a material for constructing or forming card frame 24 during a molding process.","Pin 416 is accommodated within a through hole formed within second plate 404.Pin 416 may be configured for releasing molded card frame 24 from mold 400.During manufacturing, a material for constructing card frame 24 may be heated and injected through channel 504 and gate 414 such that the material fills cavity 502, thereby forming card frame 24 including pocket 206 that includes one or more surfaces recessed from first surface 208.In some embodiments, the surfaces included in pocket 206 recessed from first surface 208 may be formed during the same molding process using the same mold.","Mold 400 may then be cooled to harden the material.","First plate 402 and second plate 404 may be separated and pin 416 may be extended into the through hole formed in second plate 404 to separate the hardened material of card frame 24 from second plate 404.In some embodiments, one or more surfaces of pocket 206 may be formed by a molding process, and one or more surfaces of pocket 206 may be formed by a milling process.","For example, surface 210 may be formed by molding, whereas surface 212 may be formed by milling.","Alternatively, surface 210 may be formed by milling, whereas surface 212 may be formed by molding.","In some embodiments an electronic component may be added to pocket 206 without additional milling.","As an example, mold 400 may produce card frame 24 of appropriate dimensions such that an EMV chip may be affixed within pocket 206 as a next step in a transaction card manufacturing process after removing card frame 24 from mold 400.In other embodiments, after separating card frame 24 from mold 400, further steps may be performed on card frame 24.For example, undesired or excessive materials may be milled away from the interior of the recessed portion.","In some embodiments, gate 414 may leave marks on card frame 24 as a result of separating hardened material left in channel 504 from card frame 24.Further, material may seep into margins between an ejection pin and one or more of the surfaces of mold 400, resulting in marks on a surface of card frame 24.Marks such as those left by a gate or ejection pin are often viewed as undesirable defects.","Such defects may be minor such that they are considered acceptable or imperceptible or alternatively may be removed by corrective steps such as sanding, buffing, grinding, or milling.","In some embodiments, components of mold 400 may be arranged to allow steps for removing defects to be combined with other steps involved in manufacturing transaction card 20.For example gates and/or ejection pins may be located strategically such that any marks that may be left on card frame 24 may be covered by a component later affixed to card frame 24, painted or printed over, or removed in a subsequent milling step.","This principle is illustrated in further detail in FIGS.","6-9.FIG.","6A is a perspective view of a first plate 602 of an exemplary mold 600 for producing transaction card frames.","FIG.","6B is a perspective view of a second plate 604 of mold 600.Mold 600 may include structures and functions similar to mold 400, and may be used in the same or similar process for forming card frame 24 as discussed above in connection with mold 400.First plate 602 and second plate 604 may include structures similar to those of mold 400, except for the location of the gate and pins.","Similar to mold 400, mold 600 may include first surface 606 configured to define first surface 208 of card frame 24.First surface 606 may include a protrusion structure 608, which may be similar to protrusion structure 408, configured for defining the shape and dimension of pocket 206.For example, protrusion structure 608 may include a protrusion portion 610 for defining a recessed surface (e.g., surface 212) in pocket 206.Additional protrusion portions, such as one similar to protrusion portion 412, may also be included in protrusion structure 608.Second plate 604 may include a surface 618, which may be similar to surface 418 of second plate 404.As shown in FIG.","6A, first plate may include a gate 614 disposed at a suitable portion of protrusion structure 608, which defines pocket 206.For example, gate 614 may be disposed at a surface of protrusion portion 610 of protrusion structure 608, which may define a base portion or surface (e.g., surface 212) of pocket 206.Gate 614 may be disposed such that an undesired mark left by gate 614 during manufacturing may be removed or hidden by the installation of electronic component 22.Thus, any location on protrusion structure 608 that corresponds to a location within an interior of pocket 206 may be suitable for gate 614, if a mark left at the gate 614 will be hidden by the electronic component 22 after the electronic component 22 is installed or embedded within pocket 206.As shown in FIG.","6B, second plate 604 may include a surface 618, which may be similar to surface 418 of mold 400.Second plate 604 may include two through holes for receiving two pins 616.The pins may be used for ejecting card frame 24 after the material for forming card frame 24 has been hardened.","Fewer or additional through holes may be included in second plate 604.The locations of the through holes may be different from the location of the through hole included in second plate 404.FIG.","7A is a perspective view of first plate 602 and second plate 604 shown in FIGS.","6A and 6B joined together to form mold 600.FIG.","7B is a cross-sectional view of mold 600 shown in FIG.","7A taken along line 6-6.As shown in FIG.","7B, when joined together, surface 606 and surface 618 may form a space or cavity 702 for receiving a material for forming card frame 24 during an injection molding process.","Cavity 702 may have substantially the same three-dimensional shape and dimensions as card frame 24.Protrusion structure 608 and surface 618 define the shape and dimension of pocket 206.During manufacturing, a material for constructing card frame 24 may be heated and injected through channel 704 and gate 614, similar to the process described above in relation to FIGS.","4A-5B.","Upon separation of plates 602 and 604, gate 614 may leave a mark on a surface (e.g., surface 212) of card frame 24.However, the gate mark may be covered by the installation of an electronic component into pocket 206.Alternatively, the gate mark and an area surrounding the gate mark may be removed by, for example, milling or cutting.","This may be achieved, for example, during a process for creating a surface (e.g., surface 210 or 212) on the resulting card frame 24.Thus, the steps of removing the gate mark and forming a specified surface to accommodate an electronic component may be combined.","Referring back to FIG.","6B, pins 616 may leave marks on card frame 24.However, in some embodiments, pins 616 may be disposed such that the resulting marks may be eliminated by the application of a component, to transaction card 20.For example, a magnetic strip may be applied onto card frame 24 at a location that covers the marks.","Alternatively, a recessed surface may be, for example, cut or milled into the surface of card frame 24 prior to application of a magnetic strip.","The step of adding the recessed surface may also remove the marks left by pins 616.FIG.","8A is a perspective view of a first plate 804 of an exemplary mold 800 for producing transaction card frames.","FIG.","8B is a perspective view of a second plate 802 of mold 800.Mold 800 may include structures and functions similar to mold 400 or mold 600, and may be used in the same or similar process for forming card frame 24 as discussed above in connection with mold 400 or 600.Different features included in molds 400, 600, and 800 may be combined.","First plate 804 may include a surface 806 that defines a shape of first surface 208 of card frame 24.Similar to surfaces 406 and 606 shown in FIGS.","4A and 6A, surface 806 may include a protrusion structure 808 protruding from the rest of surface 806.Protrusion structure 808 may include one or more protrusion portions that define the shape and dimension of pocket 206.For example, protrusion structure 808 may include a protrusion portion 810 that defines a surface (e.g., surface 212) of pocket 206.First plate 804 may include a through hole for receiving a pin 816 for ejecting finished card frame 24.The through hole may be disposed at any suitable location on a surface of protrusion structure 808, such as on a surface of protrusion portion 810, which corresponds to an interior of pocket 206 to be formed.","In this way, any mark left by pin 816 may be hidden when an electronic component is installed or embedded within pocket 206.After card frame 24 is formed in an injection molding process, pin 816 may be extended into the through hole located at a location corresponding to the interior of the recessed portion to release the card frame from the mold.","As shown in FIG.","8B, second plate 802 may include a surface 818, which may be similar to surface 418 and 618.Surface 818 may be configured for defining rear side 204 of card frame 24.Surface 818 may include one or more gates 814.Similar to gates 414 and 614, gates 814 may be connected with one or more channels (not shown in FIG.","8B) for receiving a material for forming card frame 24.Gates 814 may be disposed in line with pin 816, or may be disposed at locations that are not in line with pin 816.FIG.","9A is a perspective view of the first plate 804 and the second plate 802 of mold 800 shown in FIGS.","8A and 8B stacked or joined together.","FIG.","9B is a cross-sectional view of mold 800 of FIG.","9A taken along line 8-8.As shown in FIG.","9B, when joined together, surfaces 806 and 818 define a space or cavity 902 configured to receive a material for forming card frame 24 during an injection molding process.","The cavity 902 has substantially the same shape and dimensions as card frame 24.Protrusion structure 808 and surface 818 define the shape and dimension of pocket 206.Pin 816 is disposed within a through hole that includes an opening on a surface of protrusion portion 810 at a location corresponding to pocket 206.Any mark left by pin 816 may be covered by electronic component 22 when electronic component 22 is installed or embedded within pocket 206.Gates 814 and channels are not shown in the cross-sectional view in FIG.","9B, because they are not located in line with pin 816 (or the through hole for receiving the pin).","Referring back to FIG.","8B, a material for constructing card frame 24 may be heated and injected through gates 814, similar to the process described above.","Upon separation of plates 802 and 804, pin 816 may leave a mark on a surface (e.g., surface 212) of card frame 24.The mark may be removed using the steps described above, or the mark may be hidden by the installation of an electronic component into pocket 206.In addition, gates 814 may leave marks on a surface (e.g.","surface 208) of card frame 24.An area surrounding these marks may be removed to create an additional surface on the resulting card frame 24, for example, for installing a magnetic strip, thereby removing the marks.","While illustrative embodiments have been described herein, the scope includes any and all embodiments having equivalent elements, modifications, omissions, combinations (e.g., of aspects across various embodiments), adaptations or alterations based on the present disclosure.","For example, in some embodiments, a compression molding process may be used to form card frame 24 instead of an injection molding process.","In such embodiments, injection gates, such as gates 414, 614, and 814, may not be included in mold 400.Instead, material for forming card frame 24 may be placed in mold 400 and compressed to conform to the shape of a cavity of the mold (e.g., cavity 502, 702, 902, etc.).","In the compression molding process, pocket 206 may be formed by corresponding structures on the mold, and may not require milling during the formation of pocket 206.FIG.","10 is a flowchart showing an exemplary method 1000 for forming a transaction card.","Method 1000 may include forming a transaction card frame within a mold, the transaction card frame including at least one recessed portion within a first surface (step 1010).","The mold may be any of mold 400, 600, and 800 disclosed above.","In some embodiments, forming the transaction card frame within the mold may include injection molding the transaction card frame using any of mold 400, 600, or 800.Injection molding the transaction card frame using the mold may include injecting a material for forming the transaction card frame through a gate disposed in the mold at a location corresponding to the at least one recessed portion.","In some embodiments, forming the transaction card frame within the mold may include compression molding the transaction card frame within the mold.","The mold may include a structure for molding the at least one recessed portion within the first surface of the transaction card frame, and forming the transaction card frame within the mold may include forming the at least one recessed portion within the mold for affixing the at least one electronic component.","In some embodiments, forming the at least one recessed portion within the mold for affixing the at least one electronic component does not involve milling to form the at least one recessed portion.","Method 1000 may also include affixing at least one electronic component to an interior of the at least one recessed portion (step 1020).","The electronic component may be affixed to the interior of the recessed portion using any suitable methods, such as adhering using an adhesive, press fitting, screwing, clamping, etc.","The elements in the claims are to be interpreted broadly based on the language employed in the claims and not limited to examples described in the present specification or during the prosecution of the application, which examples are to be construed as non-exclusive.","It is intended, therefore, that the specification and examples be considered as example only, with a true scope and spirit being indicated by the following claims and their full scope of equivalents."]],"string":"[\n [\n \"MOLDED POCKET IN TRANSACTION CARD CONSTRUCTION\",\n \"Methods and apparatuses are provided for manufacturing a transaction card.\",\n \"The disclosed methods and apparatuses may be used to form a transaction card frame within a mold.\",\n \"The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame.\",\n \"The one or more recessed portions may be configured for affixing one or more electronic components.\"\n ],\n [\n \"1-20.\",\n \"(canceled) 21.A method of manufacturing a transaction card, the method comprising: forming a transaction card frame within a mold, the transaction card frame including: a front side having a first surface; a rear side opposite the front side; and a recessed portion within the first surface, the recessed portion configured for affixing one or more electronic components and including a second surface recessed a first depth from the first surface; wherein forming the transaction card includes: filling a cavity in the mold with heated material; cooling the mold; and removing the card from the mold.\",\n \"22.The method of claim 21, further comprising forming the recessed portion within the first surface by forming a third surface at a second depth from the first surface.\",\n \"23.The method of claim 22, wherein forming the third surface includes removing material using a milling operation.\",\n \"24.The method of claim 22, wherein the second depth is greater than the first depth.\",\n \"25.The method of claim 22, wherein the first depth is greater than the second depth.\",\n \"26.The method of claim 22, wherein the first depth is 0.19-0.23 mm, and the second depth is 0.60-0.64 mm.\",\n \"27.The method of claim 21, wherein forming the transaction card frame within the mold comprises injection molding the transaction card frame within the mold using a thermoplastic or a thermosetting polymer.\",\n \"28.The method of claim 22, wherein second and third surfaces are formed within the mold.\",\n \"29.The method of claim 21, wherein the mold is constructed of steel or aluminum.\",\n \"30.The method of claim 21, further including: injecting the heated material into the mold via a channel and a gate disposed within the mold, the mold including two separable plates; separating the two plates; and removing excess material left on the card frame by the gate.\",\n \"31.The method of claim 30, wherein removing the excess material includes a sanding, buffing, grinding, or milling operation.\",\n \"32.The method of claim 21, further including: injecting the heated material into the mold, the mold including two separable plates; separating the two plates; driving a pin through a through hole disposed in the mold to release the card frame from the mold; and removing excess material left on the card frame by the pin or a gate.\",\n \"33.The method of claim 32, wherein removing the excess material includes a sanding, buffing, grinding, or milling operation.\",\n \"34.The method of claim 21, wherein: a mark is left on a surface within the recessed portion; and the method further includes covering the mark by installing an electronic component into the recessed portion.\",\n \"35.The method of claim 34, wherein the electronic component is an EMV chip.\",\n \"36.The method of claim 21, further including covering a mark left on the card frame by applying a magnetic strip to the card frame to cover the marks.\",\n \"37.The method of claim 21, further including removing a mark left on the card during a process of adding a recessed surface to the card frame via a milling process.\",\n \"38.The method of claim 37, further including applying a magnetic strip to the recessed surface.\",\n \"39.The method of claim 21, further including affixing an electronic component within the recessed portion of the first surface.\",\n \"40.The method of claim 39, wherein affixing the electronic component comprises use of an adhesive, a press fitting, a screw, or a clamp.\",\n \"41.The method of claim 21, wherein the mold includes a first plate, a second plate, a channel extending through a thickness of the first plate, and a gate connected to the channel, the method further comprising: joining the first and second plates to define the cavity within the mold; filling the cavity by injecting the heated material through the channel and the gate; separating the first and second plates; driving a pin through a through hole disposed in the mold to release the card frame from the mold; and removing excess material left on the card frame by the channel, pin, through hole, or gate.\"\n ],\n [\n \" BACKGROUND Transaction cards, such as credit and debit cards, have increasingly become a primary means for customers to complete financial transactions.\",\n \"Typically, transaction cards are cut from laminated sheets of polyvinyl chloride (PVC) or polycarbonate (PC), or other similar materials.\",\n \"After the overall shape of the card is formed, the card may be modified to add functional and/or visual features.\",\n \"For example, a magnetic strip may be affixed to one side, the card may be stamped with the card number and customer name, and color or a design may be added for appearance.\",\n \"Many transaction card providers are moving away from using magnetic strip technology and now additionally or alternatively include more advanced electronic components attached to or embedded within a transaction card.\",\n \"For example, some transaction cards include microchips (e.g., Europay, Mastercard, and Visa (EMV) chips) that more securely and efficiently manage card and customer information.\",\n \"While the chips provide several advantages to customers, they can increase the complexity and cost of transaction card manufacturing.\",\n \"For example, manufacturing a transaction card that includes an electronic component (such as an EMV chip) may include additional steps to create space(s) for the component and steps to secure the component within the space(s).\",\n \"Often, a process known as milling and embedding is used.\",\n \"In this process, a computer numerical control (CNC) machine is used to mill away a space, called a pocket, of a desired size for accommodating or receiving an electronic component (e.g., an EMV chip).\",\n \"The term “pocket” refers to a recessed portion of a structure and may include a base portion, one or more walls projecting from the base portion, and an opening formed by the one or more walls.\",\n \"The term “pocket” may also refer to a cavity, a hole, or a container.\",\n \"The component is then embedded or secured into the space (i.e., pocket) using a hot press adhesive.\",\n \"The milling and embedding processes are typically performed together in an in-line machine.\",\n \"In addition, as transaction cards increase in prevalence, expectations for transaction card quality have increased.\",\n \"Transaction cards have increasingly been made to meet higher standards regarding materials, manufacturing tolerances, and overall “fit and finish.” Accordingly, tolerance of defects in transaction cards related to manufacturing processes has decreased over time.\",\n \"The present disclosure is directed to overcoming one or more of the problems set forth above and/or other problems associated with conventional transaction card construction.\"\n ],\n [\n \" SUMMARY The disclosed embodiments relate to a process for constructing a transaction card that includes a molded pocket.\",\n \"Consistent with a disclosed embodiment, a method of manufacturing a transaction card is provided.\",\n \"The method may include forming a transaction card frame within a mold, the transaction card frame including at least one recessed portion within a first surface; and affixing at least one electronic component to an interior of the at least one recessed portion.\",\n \"Consistent with another disclosed embodiment, a mold for molding a transaction card is provided.\",\n \"The mold may include a first plate and a second plate.\",\n \"The first plate and second plate may be joined together, forming a cavity for receiving a material for forming a transaction card frame.\",\n \"The first plate and the second plate of the mold may include structures that define a shape and dimension of at least one recessed portion to be formed within a first surface of the transaction card frame, the at least one recessed portion configured for affixing at least one electronic component.\",\n \"It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosed embodiments, as claimed.\"\n ],\n [\n \"PRIORITY CLAIM This application is a continuation of U.S. application Ser.\",\n \"No.\",\n \"15/293,270, filed Oct. 13, 2016, which claims the benefit of U.S. provisional patent application No.\",\n \"62/241,636, filed Oct. 14, 2015.The aforementioned applications are incorporated herein by reference in their entireties.\",\n \"TECHNICAL FIELD The disclosed embodiments generally relate to transaction card construction, and particularly, to molding a pocket into a transaction card.\",\n \"BACKGROUND Transaction cards, such as credit and debit cards, have increasingly become a primary means for customers to complete financial transactions.\",\n \"Typically, transaction cards are cut from laminated sheets of polyvinyl chloride (PVC) or polycarbonate (PC), or other similar materials.\",\n \"After the overall shape of the card is formed, the card may be modified to add functional and/or visual features.\",\n \"For example, a magnetic strip may be affixed to one side, the card may be stamped with the card number and customer name, and color or a design may be added for appearance.\",\n \"Many transaction card providers are moving away from using magnetic strip technology and now additionally or alternatively include more advanced electronic components attached to or embedded within a transaction card.\",\n \"For example, some transaction cards include microchips (e.g., Europay, Mastercard, and Visa (EMV) chips) that more securely and efficiently manage card and customer information.\",\n \"While the chips provide several advantages to customers, they can increase the complexity and cost of transaction card manufacturing.\",\n \"For example, manufacturing a transaction card that includes an electronic component (such as an EMV chip) may include additional steps to create space(s) for the component and steps to secure the component within the space(s).\",\n \"Often, a process known as milling and embedding is used.\",\n \"In this process, a computer numerical control (CNC) machine is used to mill away a space, called a pocket, of a desired size for accommodating or receiving an electronic component (e.g., an EMV chip).\",\n \"The term “pocket” refers to a recessed portion of a structure and may include a base portion, one or more walls projecting from the base portion, and an opening formed by the one or more walls.\",\n \"The term “pocket” may also refer to a cavity, a hole, or a container.\",\n \"The component is then embedded or secured into the space (i.e., pocket) using a hot press adhesive.\",\n \"The milling and embedding processes are typically performed together in an in-line machine.\",\n \"In addition, as transaction cards increase in prevalence, expectations for transaction card quality have increased.\",\n \"Transaction cards have increasingly been made to meet higher standards regarding materials, manufacturing tolerances, and overall “fit and finish.” Accordingly, tolerance of defects in transaction cards related to manufacturing processes has decreased over time.\",\n \"The present disclosure is directed to overcoming one or more of the problems set forth above and/or other problems associated with conventional transaction card construction.\",\n \"SUMMARY The disclosed embodiments relate to a process for constructing a transaction card that includes a molded pocket.\",\n \"Consistent with a disclosed embodiment, a method of manufacturing a transaction card is provided.\",\n \"The method may include forming a transaction card frame within a mold, the transaction card frame including at least one recessed portion within a first surface; and affixing at least one electronic component to an interior of the at least one recessed portion.\",\n \"Consistent with another disclosed embodiment, a mold for molding a transaction card is provided.\",\n \"The mold may include a first plate and a second plate.\",\n \"The first plate and second plate may be joined together, forming a cavity for receiving a material for forming a transaction card frame.\",\n \"The first plate and the second plate of the mold may include structures that define a shape and dimension of at least one recessed portion to be formed within a first surface of the transaction card frame, the at least one recessed portion configured for affixing at least one electronic component.\",\n \"It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosed embodiments, as claimed.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate disclosed embodiments and, together with the description, serve to explain the disclosed embodiments.\",\n \"In the drawings: FIG.\",\n \"1 is a block diagram of an exemplary transaction system, consistent with disclosed embodiments; FIG.\",\n \"2A is a front view of an exemplary transaction card frame, consistent with disclosed embodiments; FIG.\",\n \"2B is a back view of an exemplary transaction card frame, consistent with disclosed embodiments; FIG.\",\n \"3 is a cross-sectional view of the exemplary transaction card frame FIG.\",\n \"2A taken along line 3-3, consistent with disclosed embodiments; FIG.\",\n \"4A is a schematic perspective view of a first plate of an exemplary mold for producing transaction card frames, consistent with disclosed embodiments; FIG.\",\n \"4B is a schematic perspective view of a second plate of an exemplary mold for producing transaction card frames, consistent with disclosed embodiments; FIG.\",\n \"5A is a perspective view of the first plate and the second plate of the exemplary mold shown in FIGS.\",\n \"4A and 4B stacked together, consistent with disclosed embodiments; FIG.\",\n \"5B is a cross-sectional view of the exemplary mold of FIG.\",\n \"5A taken along line 5-5, consistent with disclosed embodiments; FIG.\",\n \"6A is a perspective view of a first plate of an exemplary mold for producing transaction card frames, consistent with disclosed embodiments; FIG.\",\n \"6B is perspective view of a second plate of an exemplary mold for producing transaction card frames, consistent with disclosed embodiments; FIG.\",\n \"7A is a perspective view of the first plate and the second plate of the exemplary mold shown in FIGS.\",\n \"6A and 6B stacked together, consistent with disclosed embodiments; FIG.\",\n \"7B is a cross-sectional view of the exemplary mold of FIG.\",\n \"7A taken along line 6-6, consistent with disclosed embodiments; FIG.\",\n \"8A is a perspective view of a first plate of an exemplary mold for producing transaction card frames, consistent with disclosed embodiments; FIG.\",\n \"8B is a perspective view of a second plate of an exemplary mold for producing transaction card frames, consistent with disclosed embodiments; FIG.\",\n \"9A is a perspective view of the first plate and the second plate of the exemplary mold shown in FIGS.\",\n \"8A and 8B stacked together, consistent with disclosed embodiments; FIG.\",\n \"9B is a cross-sectional view of the exemplary mold of FIG.\",\n \"9A taken along line 8-8, consistent with disclosed embodiments; and FIG.\",\n \"10 is a flowchart showing an exemplary method for forming a transaction card, consistent with the disclosed embodiments.\",\n \"DETAILED DESCRIPTION Reference will now be made in detail to the disclosed embodiments, examples of which are illustrated in the accompanying drawings.\",\n \"Wherever convenient, the same reference numbers will be used throughout the drawings to refer to the same or like parts.\",\n \"Disclosed embodiments include apparatuses and methods for manufacturing a transaction card.\",\n \"For example, disclosed embodiments include a mold for injection molding or compression molding of a transaction card frame including a pocket (or a recessed portion) to accommodate (or receive, affix) an electronic component.\",\n \"Various methods may be used to manufacture the transaction card frame out of different types of materials that are suitable for satisfying certain criteria or preferences.\",\n \"In addition, the disclosed embodiments may reduce costs or complexity of card manufacturing when compared to traditional processes.\",\n \"The term “transaction card,” as used herein, may refer to any physical card product that is configured to provide information, such as financial information (e.g., card numbers, account numbers, etc.\",\n \"), quasi-financial information (e.g., rewards balance, discount information, etc.)\",\n \"and/or individual-identifying information (e.g., name, address, etc.\",\n \"), when the card is read by a card reader.\",\n \"Examples of transaction cards include credit cards, debit cards, gift cards, rewards cards, frequent flyer cards, merchant-specific cards, discount cards, identification cards, and driver's licenses, but are not limited thereto.\",\n \"Transaction cards may be flat objects configured to slide through a card reader, inserted into a card reading slot, or otherwise physically interact with a card reading device.\",\n \"Cards may be manufactured to size tolerances intended to allow the cards to slide through, fit inside, or otherwise physically interact with such a device.\",\n \"For example, a transaction card may be manufactured to conform to the ISO/IEC 7810 ID-1 standard, and have dimensions of 85.60 mm×53.98 mm×0.76 mm.\",\n \"This standard is merely exemplary, as other standards may be used, and some cards may deviate from a standard in such a way that they may still properly interact with certain card reading devices.\",\n \"FIG.\",\n \"1 illustrates an exemplary transaction system 10.Transaction system 10 may include a computing system configured to receive and send information between the components of transaction system 10 and with components outside of transaction system 10.Transaction system 10 may include a financial service provider system 12 and a merchant system 14 communicating with each other through a network 16.Transaction system 10 may include additional and/or alternative components.\",\n \"Financial service provider system 12 may include one or more computer systems associated with an entity that provides financial services.\",\n \"For example, the entity may be a bank, credit union, credit card issuer, or other type of financial service entity that generates, provides, manages, and/or maintains financial service accounts for one or more customers.\",\n \"Financial service accounts may include, for example, credit card accounts, checking accounts, savings accounts, loan accounts, reward accounts, and any other types of financial service accounts.\",\n \"Financial service accounts may be associated with physical financial service transaction cards, such as credit or debit cards that customers use to perform financial service transactions, such as purchasing goods and/or services online or at a point of sale (POS) terminal.\",\n \"Financial service accounts may also be associated with electronic financial products and services, such as a digital wallet or similar account that may be used to perform electronic transactions, such as purchasing goods and/or services online.\",\n \"Merchant system 14 may include one or more computer systems associated with a merchant.\",\n \"For example, merchant system 14 may be associated with an entity that provides goods and/or services (e.g., a retail store).\",\n \"The merchant may include brick-and-mortar location(s) that a customer may physically visit and purchase goods and services using the transaction cards.\",\n \"Such physical locations may include computing devices (e.g., merchant system 14) that perform financial service transactions with customers (e.g., POS terminal(s), kiosks, etc.).\",\n \"Additionally or alternatively, merchant system 14 may be associated with a merchant who provides an electronic shopping environment, such as a website or other online platforms that consumers may access using a computer through browser software, a mobile application, or similar software.\",\n \"Merchant system 14 may include a client device, such as a laptop computer, desktop computer, smart phone, or tablet, which a customer may operate to access the electronic shopping mechanism.\",\n \"Network 16 may include any type of network configured to facilitate communications and data exchange between components of transaction system 10, such as, for example, financial service provider system 12 and merchant system 14.Network 16 may include a Local Area Network (LAN) or a Wide Area Network (WAN), such as the Internet.\",\n \"Network 16 may be a single network or a combination of networks.\",\n \"Network 16 is not limited to the above examples and transaction system 10 may implement any type of network that allows entities (shown and not shown) of transaction system 10 to exchange data and information.\",\n \"Transaction system 10 may be configured to conduct a transaction using a transaction card 20.In some embodiments, financial service provider system 12 may provide transaction card 20 to a customer for use in conducting transactions associated with a financial service account held by the customer.\",\n \"For example, the customer may use transaction card 20 at a merchant location to make a purchase.\",\n \"During the course of the purchase, information may be transferred from transaction card 20 to merchant system 14 (e.g., a point of sale device).\",\n \"Merchant system 14 may communicate with financial service provider system 12 via network 16 to verify the information and to complete or deny the transaction.\",\n \"For example, merchant system 14 may receive account information from transaction card 20.Merchant system 14 may transmit the account information and a purchase amount, among other transaction information, to financial service provider system 12.Financial service provider system 12 may settle the transaction by transferring funds from the customer's financial service account to a financial service account associated with the merchant.\",\n \"While transaction system 10 and transaction card 20 are depicted and described in relation to transactions that involve customers, merchants, and financial service providers, it should be understood that the these entities are used only as an example to illustrate one environment in which transaction card 20 may be used.\",\n \"Transaction card 20 is not limited to financial products and may be any physical card product that is configured to provide information to another device when read by a card reader.\",\n \"For example, transaction card 20 may be an identification card configured to provide information to a device in order to identify the holder of the card (e.g., driver's license).\",\n \"In some embodiments, transaction card 20 may further include an electronic component 22.As used herein, an “electronic component” may be one or more devices and/or elements configured to receive, store, process, provide, transfer, send, delete, and/or generate information.\",\n \"For example, electronic component 22 may be a microchip (e.g., EMV chip), a communication device (e.g., Near Field Communication (NFC) antenna, Bluetooth® device, WiFi device), a magnetic strip, a barcode, Quick Response (QR) code, etc.\",\n \"Electronic component 22 may be secured (or affixed, attached) to a transaction card frame 24 (or card frame 24) in such a way that allows card frame 24 to carry electronic component 22 while maintaining a utility of electronic component 22 (i.e., allowing electronic component 22 to interact with merchant system 14).\",\n \"FIG.\",\n \"2A is a front view of an exemplary transaction card frame 24.FIG.\",\n \"2B is a rear view of the card frame 24.FIG.\",\n \"2A shows a front side 202 of card frame 24 and FIG.\",\n \"2B shows a rear side 204 of card frame 24.As shown in FIG.\",\n \"2A, card frame 24 includes a pocket 206 configured to accommodate (or receive, affix, or secure) electronic component 22.Pocket 206 may include features that accommodate a particular geometry of electronic component 22 or enable electronic component 22 to be fixed (or secured, affixed, attached, or embedded) to card frame 24.Card frame 24 may include an upper surface 208 (or first surface 208).\",\n \"Pocket 206 may include a second surface 210 recessed a first depth from first surface 208 of card frame 24.Pocket 206 may also include a third surface 212.Third surface 212 may be recessed a second depth from first surface 208.The second depth may be greater than the first depth.\",\n \"That is, third surface 212 may form a base portion of pocket 206, and second surface 210 may form an elevated surface at a certain height above third surface 212.The dimensions and depths of second surface 210 and third surface 212 may be set based on a plurality of criteria such as the size of a particular electronic component, industry standards, manufacturing tolerances, or other considerations.\",\n \"Based on the geometry of the electronic component to be embedded in pocket 206, pocket 206 may include fewer (e.g., one) or more (e.g., three, four, etc.)\",\n \"surfaces recessed from first surface 208.For example, in some embodiments, pocket 206 may be configured to accommodate a microchip, such as an EMV chip.\",\n \"In these embodiments, first surface 208 may be referred to as P0.Second surface 210 may be referred to as P1 and used as a glue layer for a contact plate of the EMV chip.\",\n \"Third surface 212 may be referred to as P2 and used as a deeper pocket to accommodate the depth of the EMV chip itself.\",\n \"FIG.\",\n \"3 illustrates a cross-sectional view of an exemplary embodiment of card frame 24 shown in FIG.\",\n \"2 taken along line 3-3.FIG.\",\n \"3 includes a magnified view of pocket 206 which illustrates surfaces 208, 210, and 212.As shown in the magnified view of pocket 206, second surface 210 is recessed a first depth H1 from first surface 208, and third surface 212 is recessed a second depth H2 from first surface 208.The dimensions (e.g., widths and heights or depths) of surfaces 208, 210, and 212 may vary based on the dimensions of the electronic component.\",\n \"For example, in some embodiments, first depth H1 may be 0.21 mm (with an error tolerance of +/−0.02 mm), and second depth H2 may be 0.62 mm (with an error tolerance of +/−0.02 mm).\",\n \"Card frame 24 may be manufactured using a molding process, such as an injection molding process or a compression molding process.\",\n \"Although injection molding is discussed in detail as an example of the molding process, some features discussed below may also be applied to the compression molding process.\",\n \"During an injection molding process, any material suitable for injection molding, such as thermoplastic and thermosetting polymers, may be used for forming card frame 24.Injection and/or ejection molds used to form card frame 24 may include structures for forming pocket 206 within card frame 24 either without additional milling, or with reduced milling steps than required by conventional transaction card manufacturing processes.\",\n \"FIG.\",\n \"4A is a schematic perspective view of a first plate 402 (or first component) of an exemplary mold 400 for manufacturing card frame 24, and FIG.\",\n \"4B is a schematic perspective view of a second plate 404 (or second component) of mold 400.Mold 400 may be constructed of any material or materials suitable for use as an injection or compression mold, such as various grades of steel or aluminum.\",\n \"First plate 402 includes a surface 406 that defines surface 208 of card frame 24.In some embodiments, surface 406 is substantially flat.\",\n \"Surface 406 may include a protrusion structure 408 protruding from the rest of surface 406.Protrusion structure 408 defines the shape and dimension of pocket 206.For example, protrusion structure 408 may include a first protrusion portion 410 (also shown in FIG.\",\n \"5B) protruding a first distance from surface 406.The first distance may be substantially the same as the first depth H1 shown in FIG.\",\n \"3.The first protrusion portion 410 defines second surface 210 of pocket 206.Protrusion structure 408 may include a second protrusion portion 412 (also shown in FIG.\",\n \"5B) protruding a second distance from surface 406.The second distance may be greater than the first distance.\",\n \"The second distance may be substantially the same as the second depth H2 shown in FIG.\",\n \"3.The second protrusion portion 412 defines third surface 212 of pocket 206.First plate 402 may include a gate 414 formed on surface 406.Gate 414 is an opening on surface 406, and is configured to receive a material for forming card frame 24 during the injection molding process.\",\n \"Gate 414 may be connected with a channel 504 (shown in FIG.\",\n \"5B) extending throughout the thickness of first plate 402.Second plate 404 may include a through hole for receiving a pin 416.Second plate 402 may include a surface 418.Surface 418 may include a shape corresponding to rear side 204 of card frame 24 and may define rear side 204.FIG.\",\n \"5A is a perspective view of first plate 402 and second plate 404 of mold 400 shown in FIGS.\",\n \"4A and 4B stacked or joined together.\",\n \"FIG.\",\n \"5B is a cross-sectional view of mold 400 of FIG.\",\n \"5A taken along line 5-5.As shown in FIG.\",\n \"5B, when the first plate 402 and second plate 404 are joined together, surface 406 and surface 418 define a space or cavity 502 for receiving a material for forming card frame 24 during an injection molding process.\",\n \"Cavity 502 has substantially the same three-dimensional shape and dimensions as card frame 24.As shown in FIG.\",\n \"5B, protrusion structure 408 and surface 418 defines the shape and dimension of pocket 206.As shown in FIG.\",\n \"5B, gate 414 may be connected with channel 504 for receiving a material for constructing or forming card frame 24 during a molding process.\",\n \"Pin 416 is accommodated within a through hole formed within second plate 404.Pin 416 may be configured for releasing molded card frame 24 from mold 400.During manufacturing, a material for constructing card frame 24 may be heated and injected through channel 504 and gate 414 such that the material fills cavity 502, thereby forming card frame 24 including pocket 206 that includes one or more surfaces recessed from first surface 208.In some embodiments, the surfaces included in pocket 206 recessed from first surface 208 may be formed during the same molding process using the same mold.\",\n \"Mold 400 may then be cooled to harden the material.\",\n \"First plate 402 and second plate 404 may be separated and pin 416 may be extended into the through hole formed in second plate 404 to separate the hardened material of card frame 24 from second plate 404.In some embodiments, one or more surfaces of pocket 206 may be formed by a molding process, and one or more surfaces of pocket 206 may be formed by a milling process.\",\n \"For example, surface 210 may be formed by molding, whereas surface 212 may be formed by milling.\",\n \"Alternatively, surface 210 may be formed by milling, whereas surface 212 may be formed by molding.\",\n \"In some embodiments an electronic component may be added to pocket 206 without additional milling.\",\n \"As an example, mold 400 may produce card frame 24 of appropriate dimensions such that an EMV chip may be affixed within pocket 206 as a next step in a transaction card manufacturing process after removing card frame 24 from mold 400.In other embodiments, after separating card frame 24 from mold 400, further steps may be performed on card frame 24.For example, undesired or excessive materials may be milled away from the interior of the recessed portion.\",\n \"In some embodiments, gate 414 may leave marks on card frame 24 as a result of separating hardened material left in channel 504 from card frame 24.Further, material may seep into margins between an ejection pin and one or more of the surfaces of mold 400, resulting in marks on a surface of card frame 24.Marks such as those left by a gate or ejection pin are often viewed as undesirable defects.\",\n \"Such defects may be minor such that they are considered acceptable or imperceptible or alternatively may be removed by corrective steps such as sanding, buffing, grinding, or milling.\",\n \"In some embodiments, components of mold 400 may be arranged to allow steps for removing defects to be combined with other steps involved in manufacturing transaction card 20.For example gates and/or ejection pins may be located strategically such that any marks that may be left on card frame 24 may be covered by a component later affixed to card frame 24, painted or printed over, or removed in a subsequent milling step.\",\n \"This principle is illustrated in further detail in FIGS.\",\n \"6-9.FIG.\",\n \"6A is a perspective view of a first plate 602 of an exemplary mold 600 for producing transaction card frames.\",\n \"FIG.\",\n \"6B is a perspective view of a second plate 604 of mold 600.Mold 600 may include structures and functions similar to mold 400, and may be used in the same or similar process for forming card frame 24 as discussed above in connection with mold 400.First plate 602 and second plate 604 may include structures similar to those of mold 400, except for the location of the gate and pins.\",\n \"Similar to mold 400, mold 600 may include first surface 606 configured to define first surface 208 of card frame 24.First surface 606 may include a protrusion structure 608, which may be similar to protrusion structure 408, configured for defining the shape and dimension of pocket 206.For example, protrusion structure 608 may include a protrusion portion 610 for defining a recessed surface (e.g., surface 212) in pocket 206.Additional protrusion portions, such as one similar to protrusion portion 412, may also be included in protrusion structure 608.Second plate 604 may include a surface 618, which may be similar to surface 418 of second plate 404.As shown in FIG.\",\n \"6A, first plate may include a gate 614 disposed at a suitable portion of protrusion structure 608, which defines pocket 206.For example, gate 614 may be disposed at a surface of protrusion portion 610 of protrusion structure 608, which may define a base portion or surface (e.g., surface 212) of pocket 206.Gate 614 may be disposed such that an undesired mark left by gate 614 during manufacturing may be removed or hidden by the installation of electronic component 22.Thus, any location on protrusion structure 608 that corresponds to a location within an interior of pocket 206 may be suitable for gate 614, if a mark left at the gate 614 will be hidden by the electronic component 22 after the electronic component 22 is installed or embedded within pocket 206.As shown in FIG.\",\n \"6B, second plate 604 may include a surface 618, which may be similar to surface 418 of mold 400.Second plate 604 may include two through holes for receiving two pins 616.The pins may be used for ejecting card frame 24 after the material for forming card frame 24 has been hardened.\",\n \"Fewer or additional through holes may be included in second plate 604.The locations of the through holes may be different from the location of the through hole included in second plate 404.FIG.\",\n \"7A is a perspective view of first plate 602 and second plate 604 shown in FIGS.\",\n \"6A and 6B joined together to form mold 600.FIG.\",\n \"7B is a cross-sectional view of mold 600 shown in FIG.\",\n \"7A taken along line 6-6.As shown in FIG.\",\n \"7B, when joined together, surface 606 and surface 618 may form a space or cavity 702 for receiving a material for forming card frame 24 during an injection molding process.\",\n \"Cavity 702 may have substantially the same three-dimensional shape and dimensions as card frame 24.Protrusion structure 608 and surface 618 define the shape and dimension of pocket 206.During manufacturing, a material for constructing card frame 24 may be heated and injected through channel 704 and gate 614, similar to the process described above in relation to FIGS.\",\n \"4A-5B.\",\n \"Upon separation of plates 602 and 604, gate 614 may leave a mark on a surface (e.g., surface 212) of card frame 24.However, the gate mark may be covered by the installation of an electronic component into pocket 206.Alternatively, the gate mark and an area surrounding the gate mark may be removed by, for example, milling or cutting.\",\n \"This may be achieved, for example, during a process for creating a surface (e.g., surface 210 or 212) on the resulting card frame 24.Thus, the steps of removing the gate mark and forming a specified surface to accommodate an electronic component may be combined.\",\n \"Referring back to FIG.\",\n \"6B, pins 616 may leave marks on card frame 24.However, in some embodiments, pins 616 may be disposed such that the resulting marks may be eliminated by the application of a component, to transaction card 20.For example, a magnetic strip may be applied onto card frame 24 at a location that covers the marks.\",\n \"Alternatively, a recessed surface may be, for example, cut or milled into the surface of card frame 24 prior to application of a magnetic strip.\",\n \"The step of adding the recessed surface may also remove the marks left by pins 616.FIG.\",\n \"8A is a perspective view of a first plate 804 of an exemplary mold 800 for producing transaction card frames.\",\n \"FIG.\",\n \"8B is a perspective view of a second plate 802 of mold 800.Mold 800 may include structures and functions similar to mold 400 or mold 600, and may be used in the same or similar process for forming card frame 24 as discussed above in connection with mold 400 or 600.Different features included in molds 400, 600, and 800 may be combined.\",\n \"First plate 804 may include a surface 806 that defines a shape of first surface 208 of card frame 24.Similar to surfaces 406 and 606 shown in FIGS.\",\n \"4A and 6A, surface 806 may include a protrusion structure 808 protruding from the rest of surface 806.Protrusion structure 808 may include one or more protrusion portions that define the shape and dimension of pocket 206.For example, protrusion structure 808 may include a protrusion portion 810 that defines a surface (e.g., surface 212) of pocket 206.First plate 804 may include a through hole for receiving a pin 816 for ejecting finished card frame 24.The through hole may be disposed at any suitable location on a surface of protrusion structure 808, such as on a surface of protrusion portion 810, which corresponds to an interior of pocket 206 to be formed.\",\n \"In this way, any mark left by pin 816 may be hidden when an electronic component is installed or embedded within pocket 206.After card frame 24 is formed in an injection molding process, pin 816 may be extended into the through hole located at a location corresponding to the interior of the recessed portion to release the card frame from the mold.\",\n \"As shown in FIG.\",\n \"8B, second plate 802 may include a surface 818, which may be similar to surface 418 and 618.Surface 818 may be configured for defining rear side 204 of card frame 24.Surface 818 may include one or more gates 814.Similar to gates 414 and 614, gates 814 may be connected with one or more channels (not shown in FIG.\",\n \"8B) for receiving a material for forming card frame 24.Gates 814 may be disposed in line with pin 816, or may be disposed at locations that are not in line with pin 816.FIG.\",\n \"9A is a perspective view of the first plate 804 and the second plate 802 of mold 800 shown in FIGS.\",\n \"8A and 8B stacked or joined together.\",\n \"FIG.\",\n \"9B is a cross-sectional view of mold 800 of FIG.\",\n \"9A taken along line 8-8.As shown in FIG.\",\n \"9B, when joined together, surfaces 806 and 818 define a space or cavity 902 configured to receive a material for forming card frame 24 during an injection molding process.\",\n \"The cavity 902 has substantially the same shape and dimensions as card frame 24.Protrusion structure 808 and surface 818 define the shape and dimension of pocket 206.Pin 816 is disposed within a through hole that includes an opening on a surface of protrusion portion 810 at a location corresponding to pocket 206.Any mark left by pin 816 may be covered by electronic component 22 when electronic component 22 is installed or embedded within pocket 206.Gates 814 and channels are not shown in the cross-sectional view in FIG.\",\n \"9B, because they are not located in line with pin 816 (or the through hole for receiving the pin).\",\n \"Referring back to FIG.\",\n \"8B, a material for constructing card frame 24 may be heated and injected through gates 814, similar to the process described above.\",\n \"Upon separation of plates 802 and 804, pin 816 may leave a mark on a surface (e.g., surface 212) of card frame 24.The mark may be removed using the steps described above, or the mark may be hidden by the installation of an electronic component into pocket 206.In addition, gates 814 may leave marks on a surface (e.g.\",\n \"surface 208) of card frame 24.An area surrounding these marks may be removed to create an additional surface on the resulting card frame 24, for example, for installing a magnetic strip, thereby removing the marks.\",\n \"While illustrative embodiments have been described herein, the scope includes any and all embodiments having equivalent elements, modifications, omissions, combinations (e.g., of aspects across various embodiments), adaptations or alterations based on the present disclosure.\",\n \"For example, in some embodiments, a compression molding process may be used to form card frame 24 instead of an injection molding process.\",\n \"In such embodiments, injection gates, such as gates 414, 614, and 814, may not be included in mold 400.Instead, material for forming card frame 24 may be placed in mold 400 and compressed to conform to the shape of a cavity of the mold (e.g., cavity 502, 702, 902, etc.).\",\n \"In the compression molding process, pocket 206 may be formed by corresponding structures on the mold, and may not require milling during the formation of pocket 206.FIG.\",\n \"10 is a flowchart showing an exemplary method 1000 for forming a transaction card.\",\n \"Method 1000 may include forming a transaction card frame within a mold, the transaction card frame including at least one recessed portion within a first surface (step 1010).\",\n \"The mold may be any of mold 400, 600, and 800 disclosed above.\",\n \"In some embodiments, forming the transaction card frame within the mold may include injection molding the transaction card frame using any of mold 400, 600, or 800.Injection molding the transaction card frame using the mold may include injecting a material for forming the transaction card frame through a gate disposed in the mold at a location corresponding to the at least one recessed portion.\",\n \"In some embodiments, forming the transaction card frame within the mold may include compression molding the transaction card frame within the mold.\",\n \"The mold may include a structure for molding the at least one recessed portion within the first surface of the transaction card frame, and forming the transaction card frame within the mold may include forming the at least one recessed portion within the mold for affixing the at least one electronic component.\",\n \"In some embodiments, forming the at least one recessed portion within the mold for affixing the at least one electronic component does not involve milling to form the at least one recessed portion.\",\n \"Method 1000 may also include affixing at least one electronic component to an interior of the at least one recessed portion (step 1020).\",\n \"The electronic component may be affixed to the interior of the recessed portion using any suitable methods, such as adhering using an adhesive, press fitting, screwing, clamping, etc.\",\n \"The elements in the claims are to be interpreted broadly based on the language employed in the claims and not limited to examples described in the present specification or during the prosecution of the application, which examples are to be construed as non-exclusive.\",\n \"It is intended, therefore, that the specification and examples be considered as example only, with a true scope and spirit being indicated by the following claims and their full scope of equivalents.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870936"}}},{"rowIdx":4493679,"cells":{"text":{"kind":"list like","value":[["INFRARED IMAGE SENSOR COMPONENT AND MANUFACTURING METHOD THEREOF","An infrared image sensor component includes a semiconductor substrate, an active pixel region disposed on the semiconductor substrate for receiving an infrared ray, and a transistor coupled to the active pixel region.","The transistor includes a gate and a source/drain stressor disposed adjacent to the gate.","The active pixel region includes a III-V compound material."],["1.An infrared image sensor component comprising: a semiconductor substrate; an active pixel region disposed on the semiconductor substrate for receiving an infrared ray, wherein the active pixel region comprises a III-V compound material; a transistor coupled to the active pixel region, wherein the transistor comprises: a gate; and a source/drain stressor disposed adjacent to the gate.","2.The infrared image sensor component of claim 1, wherein the active pixel region comprises a first III-V compound layer and a second III-V compound layer on the first III-V compound layer.","3.The infrared image sensor component of claim 2, wherein the first III-V compound layer and the second III-V compound layer have different energy gaps.","4.The infrared image sensor component of claim 2, wherein an energy gap of the first III-V compound layer is narrower than an energy gap of the second III-V compound layer.","5.The infrared image sensor component of claim 2, wherein the active pixel region further comprises a third III-V compound layer on the second III-V compound layer.","6.The infrared image sensor component of claim 5, wherein an energy gap of the second III-V compound layer is narrower than an energy gap of the third III-V compound layer.","7.The infrared image sensor component of claim 5, wherein an energy gap of the second III-V compound layer is narrower than an energy gap of the first III-V compound layer.","8.The infrared image sensor component of claim 5, wherein the active pixel region further comprises a fourth III-V compound layer on the third III-V compound layer.","9.The infrared image sensor component of claim 8, wherein an energy gap of the fourth III-V compound layer is wider than an energy gap of the third III-V compound layer.","10.The infrared image sensor component of claim 1, wherein the active pixel region has an energy gap in a gradient distribution.","11.An infrared image sensor component comprising: a semiconductor substrate; a III-V compound layer on the semiconductor substrate, wherein the III-V compound layer has an energy gap in a gradient distribution; and a transistor coupled to the III-V compound layer.","12.The infrared image sensor component of claim 11, wherein the energy gap of the III-V compound layer gradually decreases from a top of the III-V compound layer to a bottom of the III-V compound layer.","13.The infrared image sensor component of claim 11, wherein the energy gap of the III-V compound layer gradually increases from a top of the III-V compound layer to a bottom of the III-V compound layer.","14.The infrared image sensor component of claim 11, wherein the transistor comprises: a gate disposed on the III-V compound layer; and a source and a drain disposed at opposite sides of the gate, wherein the drain is coupled to the III-V compound layer.","15.The infrared image sensor component of claim 14, further comprising: at least one pattern shielding the gate and the drain.","16.A method of manufacturing an infrared image sensor component, the method comprising: forming a first III-V compound layer on a semiconductor substrate; forming a second III-V compound layer on the first III-V compound layer, wherein the second III-V compound layer has an energy gap different from that of the first III-V compound layer; and forming a transistor on the second III-V compound layer.","17.The method of claim 16, further comprising: forming at least one pattern above the transistor, wherein a portion of the second III-V compound layer is free from coverage by the pattern.","18.The method of claim 16, wherein forming the transistor comprises: forming a gate on the second III-V compound layer; and forming an ohmic metal contact adjacent to the gate and coupled to the second III-V compound layer.","19.The method of claim 16, wherein forming the transistor comprises: forming a gate on the second III-V compound layer; and forming a source/drain stressor adjacent to the gate and coupled to the second III-V compound layer.","20.The method of claim 16, further comprising: forming an optical lens above the second III-V compound layer."],[" BACKGROUND The semiconductor integrated circuit (IC) industry has experienced exponential growth.","Technological advances in IC materials and design have produced generations of ICs where each generation has smaller and more complex circuits than the previous generation.","In semiconductor technologies, image sensors are used for sensing a volume of exposed light projected towards the semiconductor substrate.","Complementary metal-oxide-semiconductor (CMOS) image sensor devices are widely used in various applications such as digital still camera (DSC) applications.","These devices utilize an array of active pixels or image sensor cells, including photodiode elements and MOS transistors, to collect photo energy to convert images to streams of digital data."],[" BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures.","It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale.","In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.","FIG.","1A to FIG.","1E are local cross-sectional views of different stages of a method of manufacturing an infrared image sensor component, in accordance with some embodiments of the disclosure.","FIG.","2 is a local cross-sectional view of an infrared image sensor component, in accordance with some embodiments of the disclosure.","FIG.","3A to FIG.","3F are local cross-sectional views of different stages of fabricating an infrared image sensor component, in accordance with some other embodiments of the disclosure.","FIG.","4 to FIG.","11 are local cross-sectional views of an infrared image sensor component, in accordance with different embodiments of the disclosure.","detailed-description description=\"Detailed Description\" end=\"lead\"?"],["RELATED APPLICATIONS This application is a continuation of U.S. application Ser.","No.","15/051,600, filed Feb. 23, 2016, now U.S. Pat.","No.","9,871,067, issued Jan. 16, 2018, which are herein incorporated by reference in their entireties.","BACKGROUND The semiconductor integrated circuit (IC) industry has experienced exponential growth.","Technological advances in IC materials and design have produced generations of ICs where each generation has smaller and more complex circuits than the previous generation.","In semiconductor technologies, image sensors are used for sensing a volume of exposed light projected towards the semiconductor substrate.","Complementary metal-oxide-semiconductor (CMOS) image sensor devices are widely used in various applications such as digital still camera (DSC) applications.","These devices utilize an array of active pixels or image sensor cells, including photodiode elements and MOS transistors, to collect photo energy to convert images to streams of digital data.","BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures.","It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale.","In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.","FIG.","1A to FIG.","1E are local cross-sectional views of different stages of a method of manufacturing an infrared image sensor component, in accordance with some embodiments of the disclosure.","FIG.","2 is a local cross-sectional view of an infrared image sensor component, in accordance with some embodiments of the disclosure.","FIG.","3A to FIG.","3F are local cross-sectional views of different stages of fabricating an infrared image sensor component, in accordance with some other embodiments of the disclosure.","FIG.","4 to FIG.","11 are local cross-sectional views of an infrared image sensor component, in accordance with different embodiments of the disclosure.","DETAILED DESCRIPTION The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter.","Specific examples of components and arrangements are described below to simplify the present disclosure.","These are, of course, merely examples and are not intended to be limiting.","For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact.","In addition, the present disclosure may repeat reference numerals and/or letters in the various examples.","This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.","Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.","The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.","The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.","The present disclosure is related to an infrared image senor component.","The infrared sensor component includes a substrate, a III-V compound layer disposed on the substrate as an active pixel region, and a plurality of transistors formed on the III-V compound layer.","The III-V compound layer is made of III-V groups materials, which have wide infrared wavelength coverage, large absorption coefficient in the infrared region, and high carrier mobility.","Therefore, the performance of the infrared image sensor component can be improved accordingly.","FIG.","1A to FIG.","1E are local cross-sectional views of different stages of a method of manufacturing an infrared image sensor component, in accordance with some embodiments of the disclosure.","Reference is made to FIG.","1A.","A III-V compound layer 120 is formed on a substrate 110.The substrate 110 is a semiconductor substrate.","In some embodiments, the semiconductor substrate is made of, for example, silicon; a compound semiconductor, such as silicon carbide, indium arsenide, or indium phosphide; or an alloy semiconductor, such as silicon germanium carbide, gallium arsenic phosphide, or gallium indium phosphide.","The substrate 110 may optionally include various doped regions, dielectric features, or multilevel interconnects in the semiconductor substrate.","The III-V compound layer 120 is made from the III-V groups in the periodic table of elements.","In some embodiments, the III-V compound layer 120 is a single layer having a tuned energy gap.","In some other embodiments, the III-V compound layer 120 is a combination of multiple III-V material layers with wide and narrow energy gap.","In yet some other embodiments, the III-V compound layer 120 may have gradient energy gap.","The III-V compound layer 120 or each of the layers of the III-V compound layer 120 is made of material selected from a group consisting of InwAlxGayAsz, InwAlxGayPz, InwAlxGaySbz, InwAlxAsyPz, InwAlxPySbz, InwGaxAsyPz, InwGaxPySbz, AlwGaxAsyPz, AlwGaxPySbz, InwAsxPySbz, AlwAsxPySbz, GawAsxPySbz, in which w+x+y+z=1.The III-V compound layer 120 can be epitaxially grown by a number of processes including, but not limited to, molecular beam epitaxy (MBE), or metal organic chemical vapor deposition (MOCVD), also known as metal organic vapor phase epitaxy (MOVPE), using appropriate precursors.","The thickness of the III-V compound layer 120 is in a ranged from about 0.1 g m to about 10 g m. Reference is made to FIG.","1B.","At least one transistor 130 is formed on the III-V compound layer 120.The transistors 130 are formed in an array and are arranged corresponding to the pixels of the infrared image sensor component 100.In some embodiments, the transistor 130 can be a metal-oxide-semiconductor (MOS) device.","Each of the transistors 130 includes a control gate 132 formed on the III-V compound layer 120, and two doped regions 134, and 136 formed in the III-V compound layer 120 and disposed at opposite sides of the control gate 132.The doped regions 134, and 136 may be doped with impurities.","The transistor 130 further includes a gate isolation 138 formed between the control gate 132 and the III-V compound layer 120.The transistor 130 further includes sidewalls 135 formed at opposite side surfaces of the control gate 132.In some embodiments, the transistor 130 is a complementary metal-oxide-semiconductor (CMOS) device.","An exemplary method of fabricating the transistor 130 begins at, for instant, forming a photoresist layer on the surface of the III-V compound layer 120.In some embodiments, the III-V compound layer 120 is a P-type layer which includes P-type impurity.","The photoresist layer is performed by masking, exposing and developing to define the region for subsequent ion injection, then respectively form a N-type doped regions 134, and 136 in the III-V compound layer 120 by ion injection.","The photoresist layer is removed by, such as stripping, after the N-type doped regions 134, and 136 are formed.","The doping impurity of forming the N-type doped regions 134, and 136 can be P, As, Si, Ge, C, O, S, Se, Te, or Sb.","The doped regions 134, and 136 are generally formed of a low or high concentration impurity region.","In some embodiments, the doped regions 134, 136 are regarded as source/drain regions.","In some embodiments, the doped region 134 is extended longer than the doped region 136.The N-type doped region 134 and the underlying portion of P-type III-V compound layer 120 may detect incident light.","An isolation layer is further formed on the surfaces of the III-V compound layer 120 by using a low temperature process, in which the isolation layer may be silicon oxide.","A conductive layer is further formed on the isolation layer, in which the conductive layer can be doped polycrystalline silicon, tungsten, titanium nitride, or other suitable materials.","One or more etching processes are performed to the isolation layer and the conductive layer thereby forming gate isolation 138 and the control gate 132 thereon.","Then the sidewalls 135 are formed at the sides of the control gate 132.The infrared image sensor component 100 further includes at least one shallow trench isolation structure 180.The shallow trench isolation structure 180 is at least formed in the III-V compound layer 120.In some embodiments, the shallow trench isolation structure 180 is formed in the III-V compound layer 120 and in the semiconductor substrate 110.The shallow trench isolation structure 180 is formed next to the doped region 134 to separate the adjacent pixels.","The material of the shallow trench isolation structure 180 can be dielectric, such as oxide.","Reference is made to FIG.","1C.","A plurality of patterns 140 and a plurality of dielectric layers 150 are sequentially formed on the III-V compound layer 120 and on the transistors 130.The patterns 140 provide functions including wiring and light shielding.","The patterns 140 are formed by depositing a conductive layer and etching the conductive layer.","The material of the conductive layer may be metal, such as W, Cu, or Co.","The dielectric layer 150 is made of insulating material with high transmittance to improve light transmittance.","The dielectric layer 150 can be made of silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, low-dielectric constant dielectric material or a combination thereof.","The dielectric layer 150 can be formed by a deposition process, such as an ALD process, a CVD process, or a PVD process.","The patterns 140 are formed for shielding a portion of the transistors 130 and a portion of the III-V compound layer 120.Namely, only the doped region 134 and a portion of the III-V compound layer 120 are exposed from the patterns 140.The doped region 134 and the exposed portion of the III-V compound layer 120 are utilized as active pixel region 120′ for sensing the light including infrared ray.","The active pixel region 120′ receives light to generate and accumulate photocharges, and a logic element (not illustrated) may detect electric signals transmitted from the corresponding active pixel region 120′.","The energy gap of the active pixel region 120′ can be tuned by the composition of the III-V compound layer 120 and the doped region 134.The energy gap of the active pixel region 120′ is tuned corresponding to the wavelength of the incident light such as infrared ray.","The active pixel region 120′ absorbs incident light and accumulates charges corresponding to an amount and/or intensity of the light.","The active pixel regions 120′ is coupled with the transistors 130.The transistor 130 includes the control gate 132, and doped regions 134, and 136.The doped region 134 and the under lying III-V compound layer 120 construct the active pixel region 120′ for receiving the charges generated by the active pixel region 120′.","The charges are transferred to the doped region 136 through the conducted control gate 132.In some embodiments, doped region 136 generally has parasitic capacitance, so charges may accumulate at the doped region 136.The potential of the doped region 136 can be changed by the accumulated charges, and therefore the amount of charges is detected through the change in electric potential of the doped region 136.In order to prevent light current leakage, the patterns 140 are formed to shield the portion other than the active pixel region 120′.","In some embodiments, the patterns 140 are formed covering the control gate 132, and the doped regions 136.The active pixel region 120′ and the doped region 134 are exposed from the patterns 140 to receive the incident light, such as infrared ray.","Reference is made to FIG.","1D.","An infrared filter 160 is disposed on the dielectric layer 150.The infrared filter 160 is an infrared ray pass filter which passes infrared light while blocking other wavelengths.","In some embodiments, the infrared filter 160 is formed of a material capable of blocking out all light except for the spectrum that falls between 800 nanometers and 1000 nanometers.","Reference is made to FIG.","1E, an optical lens 170 is formed on the infrared filter 160.The optical lens 170 is formed of thermosetting resin and may have a predetermined curvature radius.","The curvature radius of the optical lens 170 can be different depending on the depth of the active pixel region 120′, and the wavelength of incident light.","The optical lens 170 changes the path of incident light and collects light onto the active pixel region 120′.","Using the III-V compound layer 120 as the active pixel region 120′ may reduce the thickness of the infrared image sensor component 100.Comparing with the embodiments of silicon substrate having p-n junction diodes, the III-V compound layer 120 provides wider infrared response.","Namely, the III-V compound material has wider infrared wavelength coverage than the silicon, such that the infrared ray including near infrared ray, and middle infrared ray can be detected by the III-V compound layer 120.Also, the III-V compound material has larger absorption coefficient in the infrared region than the silicon, such that the thickness of the III-V compound layer 120 is thinner than the p-n junction diodes.","Furthermore, the III-V compound material provides higher carrier mobility than the silicon, thus the pixel response of the infrared image sensor component 100 using the III-V compound layer 120 is faster than that of using the silicon substrate with p-n junction diodes.","Reference is made to FIG.","2, which a local cross-sectional view of an infrared image sensor component of some embodiments of the disclosure.","The transistor 130 may include epitaxy structures 131 and 133 instead of the doped regions 134 and 136.In order to form the epitaxy structures 131 and 133, a plurality of openings are formed at opposite sides the control gate 132 and in the III-V compound layer 120, and then an epitaxy is performed to grow the epitaxy structures 131 and 133 are formed in the openings.","The source/drain stressors form at least parts of the epitaxy structures 131 and 133.In the embodiments in which the transistor 130 is an nMOS device, the epitaxy structures 131 and 133 may include silicon phosphorous (SiP), silicon carbide (SiC), or the like.","In the embodiments in which the transistor is a pMOS device, the epitaxy structures 131 and 133 may include silicon germanium (SiGe).","The patterns 140 are formed to shield the control gate 132 and the epitaxy structure 133 and to expose the epitaxy structure 131 and a portion of the III-V compound layer 120.The uncovered III-V compound layer 120 can be utilized as active pixel region 120′ to receive the infrared ray and generate photocharges.","The epitaxy structure 131 is coupled to the active pixel region 120′, thus the charges are received by the epitaxy structure 131 and is further transferred to the epitaxy structure 133 through the conducted control gate 132, and a logic element (not illustrated) may detect electric signals transmitted from the corresponding active pixel region 120′.","The active pixel regions and the transistors of the infrared image sensor component may have various modifications.","For example, FIG.","3A to FIG.","3F show local cross-sectional views of different stages of fabricating an infrared image sensor component, in accordance with some other embodiments of the disclosure.","The method begins at FIG.","3A, at least one III-V compound layer is formed on a semiconductor substrate 210.In some embodiments, a first III-V compound layer 220, and a second III-V compound layer 230 are formed on a semiconductor substrate 210.In some embodiments, the semiconductor substrate 210 is made of, for example, silicon; a compound semiconductor, such as silicon carbide, indium arsenide, or indium phosphide; or an alloy semiconductor, such as silicon germanium carbide, gallium arsenic phosphide, or gallium indium phosphide.","The semiconductor substrate 210 may also include various doped regions, dielectric features, or multilevel interconnects in the semiconductor substrate.","The first III-V compound layer 220 and the second III-V compound layer 230 are compounds made from the III-V groups in the periodic table of elements.","However, the first III-V compound layer 220 and the second III-V compound layer 230 are different from each other in composition.","The first III-V compound layer 220 and the second III-V compound layer 230 can be respectively epitaxially grown by a number of processes including, but not limited to, metal organic chemical vapor deposition (MOCVD), also known as metal organic vapor phase epitaxy (MOVPE), using appropriate precursors.","The first III-V compound layer 220 and the second III-V compound layer 230 directly contact each other.","Different composition of III-V compound materials causes the layers to have different energy gaps.","An energy gap discontinuity between the first III-V compound layer 220 and the second III-V compound layer 230, along with the piezo-electric effect, creates a very thin layer 240 of highly mobile conducting electrons in the first III-V compound layer 220.The thin layer 240 contributes to a conductive two dimensional electron gas (2DEG) layer near the junction of the two layers.","The thin layer 240 (also referred to as the 2DEG layer 240) allows charge to flow through the component.","A third III-V compound layer 250 is further formed on the second III-V compound layer 230.In some embodiments, the third III-V compound layer 250 is a doped III-V compound layer, such a p-type doped GaN layer (also referred to as the doped GaN layer 250).","The doped GaN layer 250 can be epitaxially grown by MOCVD using appropriate aluminum, nitrogen and gallium precursors.","The aluminum precursor includes trimethylaluminum (TMA), triethylaluminum (TEA), or suitable chemical precursors.","Exemplary gallium containing precursors are trimethlgallium (TMG), triethylgallium (TEG) or other suitable chemical precursors.","Exemplary nitrogen precursors include, but are not limited to, phenyl hydrazine, dimethylhydrazine, tertiarybutylamine, ammonia, or other suitable chemical precursors.","The second III-V compound layer 230 can also be referred to as a barrier layer.","Reference is made to FIG.","3B.","The doped third III-V compound layer 250 is patterned for defining at least one doped III-V compound region 252 on the second III-V compound layer 230.The 2DEG layer 240 under the doped III-V compound region 252 is removed.","In some embodiments, a mask layer, such as a photoresist layer is formed on the doped third III-V compound layer 250, and the mask layer is patterned by a lithography process to form a plurality of features and a plurality of openings defined by the features on doped third III-V compound layer 250.The pattern of the mask layer is formed according to a predetermined integrated circuit pattern.","The lithography process may include photoresist coating, exposing, post-exposure baking, and developing.","Then, an etching process is performed to define the doped III-V compound region 252.A shallow trench isolation structure 212 is formed in the first III-V compound layer 220 and the second III-V compound layer 230 to define an active pixel region of a pixel.","In some embodiments, the shallow trench isolation structure 212 is further formed in the semiconductor substrate 210.The shallow trench isolation structure 212 is a dielectric material, such as oxide.","The active pixel region is defined between the III-V doped compound region 252 and the shallow trench isolation structure 212.A dielectric layer 260 is formed on the doped III-V compound region 252 and on the second III-V compound layer 230.The dielectric layer 260 can be made of silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, low-dielectric constant dielectric material or a combination thereof.","The dielectric layer 260 can be formed by a deposition process, such as an ALD process, a CVD process, or a PVD process.","The dielectric layer 260 is further patterned to define a plurality of openings 262 in the dielectric layer 260.The dielectric layer 260 is selectively etched and cleaned to define the openings 262.Exemplary etching processes include sputter etching, reactive gas etching, chemical etching and ion milling.","The openings 262 are formed at opposite sides of the doped III-V compound region 252.The openings 262 are led into the second III-V compound layer 230.Namely, the thickness of the second III-V compound layer 230 under the openings 262 is thinner than other portions of the second III-V compound layer 230.Reference is made to FIG.","3C.","A plurality of ohmic metal contacts 270, 272 are formed in the openings 262.The ohmic metal contacts 270, 272 can be formed by depositing a ohmic contact layer on the dielectric layer 260 and in the openings 262, and patterning ohmic contact layer.","The deposition process can be sputter deposition, evaporation or chemical vapor deposition (CVD).","Exemplary ohmic metals include, but are not limited to, Ta, TaN, Pd, W, WSi2, Ti, Al, TiN, AlCu, AlSiCu and Cu.","In some embodiments, the ohmic contacts 270, 272 connect to the second III-V compound layer 230 directly.","The ohmic contacts 270, 272 are utilized as a part of drain electrode and a source electrode.","Reference is made to FIG.","3D.","The dielectric layer 260 on the III-V doped compound region 252 is etched thereby forming another opening therein.","A gate metal stack 274 is further formed in the opening as a gate electrode.","The gate metal stack 274 results in a device yielding an enhancement mode (E-mode) device.","In the embodiment depicted in FIG.","2D, the gate metal stack 274, the source and drain contacts 270, 272, and the 2DEG layer 240 (as a channel) in the first III-V compound layer 220 are configured as an E-mode transistor 255, which is a normally off device, and when a positive voltage applied to the gate stack for forward bias is great enough, the E-mode transistor is turned on.","Reference is made to FIG.","3E.","A plurality of dielectric layers 280 and a plurality of patterns 282 are sequentially formed on dielectric layer 260 and on the transistor 255.The patterns 282 can be conductive patterns and provide functions including wiring and light shielding.","The patterns 282 are formed by depositing a conductive layer and etching the conductive layer.","The material of the conductive layer may be metal, such as W, Cu, or Co.","The dielectric layers 280 are made of insulating material with high transmittance to improve light transmittance.","The dielectric layers 280 can be made of silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, low-dielectric constant dielectric material or a combination thereof.","The dielectric layers 280 can be formed by a deposition process, such as an ALD process, a CVD process, or a PVD process.","The patterns 280 are formed for shielding a portion of the transistors and a portion of the second III-V compound layer 230.Namely, only portions of the III-V compound layer 230 are exposed from the patterns 282.The exposed portion of the second III-V compound layer 230 and the underlying 2DEG layer 240 are utilized as active pixel region 230′ for sensing the light including infrared ray.","The active pixel region 230′ receives light to generate and accumulate photocharges, and a logic element (not illustrated) may detect electric signals transmitted from the corresponding active pixel region 230.The energy gap of the active pixel region 230′ can be tuned by the composition of the first III-V compound layer 220 and the second III-V compound layer 230.The energy gap of the active pixel region 230′ is tuned corresponding to the wavelength of the incident light such as infrared ray.","The active pixel region 230′ absorbs incident light and accumulates charges corresponding to an amount and/or intensity of the light.","The active pixel regions 230′ is coupled with the transistors 255.The ohmic metal contact 270 is regarded as source and is connected to the active pixel region 230′ for receiving the charges generated by the active pixel region 230′.","The charges are transferred to the ohmic metal contact 272 through the conducted control gate 252.In some embodiments, charges may accumulate at the ohmic metal contact 272, which is regarded as drain.","The potential of the ohmic metal contact 272 can be changed by the accumulated charges, and therefore the amount of charges is detected through the change in electric potential of the ohmic metal contact 272.In order to prevent light current leakage, the patterns 282 are formed to shield the portion other than the active pixel region 230′.","In some embodiments, the patterns 282 are formed covering the doped III-V compound region 252 and the gate metal stack 274 (e.g., the gate), and the ohmic metal contact 272 (e.g., the drain).","The active pixel region 230′ and the ohmic metal contact 270 between the active pixel region 230′ and the doped III-V compound region 252 are exposed from the patterns 282 to receive the incident light, such as infrared ray.","Reference is made to FIG.","3F.","An infrared filter 290 is disposed on the dielectric layer 280, and an optical lens 292 is formed on the infrared filter 290.The infrared filter 290 is an infrared ray pass filter.","The curvature radius of the optical lens 292 can be different depending on the depth of the active pixel region 230′, and the wavelength of incident light.","The optical lens 292 changes the path of incident light and collects light onto the active pixel region 230′.","The composition of the III-V compound layers can be modified to tune the energy gap of the III-V compound layers.","The composition of the III-V compound layers can be modified by changing the materials of the III-V compound layer, changing the thickness of the III-V compound layer, and/or changing the concentration of the III-V compound layer.","Different combinations of the III-V compound layers may result in different response wavelength of the active pixel region.","Variations of the combination of the III-V compound layers are discussed in following embodiments.","FIG.","4 to FIG.","11 are local cross-sectional views of an infrared image sensor component, in accordance with different embodiments of the disclosure.","Referring to FIG.","4, an infrared image sensor component 400 including an active pixel region 420′ formed on a semiconductor substrate 410, and a transistor 430 coupled to the active pixel region 420′ is provided.","The active pixel region 420′ is the portion of a III-V compound layer stack 420 uncovered by the patterns.","The III-V compound layer stack 420 includes a plurality of III-V compound layers 422, 424, and 426, which can be grown by performing a plurality of epitaxially growing processes.","The semiconductor substrate 410 can be a silicon substrate.","The III-V compound layers 422 and 426 are made of III-V compound having wide energy gap, and the III-V compound layer 424 is made of III-V compound having narrow energy gap.","However, the composition of the III-V compound layers 422, 426 may be the same or different.","The III-V compound layer 426 is formed on and in contact with the semiconductor substrate 410.The III-V compound layer 424 with narrow energy gap is sandwiched between the III-V compound layers 422, 426 with wide energy gap.","The thickness of the III-V compound layers 422, 424, and 426 may be different.","Referring to FIG.","5, an infrared image sensor component 500 including an active pixel region 520′ formed on a semiconductor substrate 510, and a transistor 530 coupled to the active pixel region 520′ is provided.","The active pixel region 520′ is the portion of a III-V compound layer stack 520 uncovered by the patterns.","The III-V compound layer stack 520 is a multi-layer structure including a plurality of first III-V compound layers 522, and a plurality of second III-V compound layers 524, which can be grown by performing a plurality of epitaxially growing processes.","The semiconductor substrate 510 can be a silicon substrate.","The first III-V compound layers 522 are made of III-V compound having wide energy gap, and the second III-V compound layers 524 are made of III-V compound having narrow energy gap.","In some embodiments, the transistor 530 is formed on the first III-V compound layer 522.The number of the first III-V compound layers 522 can be equal to the number of the second III-V compound layers 524.The first III-V compound layers 522 and the second compound layers 524 are arranged in pair, and the second III-V compound layers 522 with narrow energy gap are respectively sandwiched between the adjacent two of the first III-V compound layers 524 with wide energy gap.","The thickness of the first III-V compound layers 522 and thickness of the second III-V compound layers 524 may be substantially the same (except for the uppermost layer 522).","Referring to FIG.","6, an infrared image sensor component 600 including an active pixel region 620′ formed on a semiconductor substrate 610, and a transistor 630 coupled to the active pixel region 620′ is provided.","The active pixel region 620′ is the portion of a III-V compound layer stack 620 uncovered by the patterns.","The III-V compound layer stack 620 is a multi-layer structure including a plurality of III-V compound layers 621, 622, 623, 624, 625, and 626.The III-V compound layers 621, 622, 623, 624, 625, and 626 are sequentially formed on the semiconductor substrate 610 by performing a plurality of epitaxially growing processes, in which the III-V compound layer 626 is in contact with the semiconductor substrate 610.The energy gap of the III-V compound layers 621, 622, 623, 624, 625, and 626 is sequentially increased, from bottom to top.","Namely, the III-V compound layer 626 has the narrowest energy gap among the layers of the III-V compound layer stack 620, and III-V compound layer 621 has the widest energy gap among the layers of the III-V compound layer stack 620.The thickness of the III-V compound layers 622, 623, 624, 625, and 626 can be substantially the same and uniform.","Therefore, the III-V compound layer stack 620 can be regarded as having a gradient increasing energy gap, from bottom to top.","Referring to FIG.","7, an infrared image sensor component 700 including an active pixel region 720′ formed on a semiconductor substrate 710, and a transistor 730 coupled to the active pixel region 720′ is provided.","The active pixel region 720′ is the portion of a III-V compound layer stack 720 uncovered by the patterns.","The III-V compound layer stack 720 is a multi-layer structure including a plurality of III-V compound layers 721, 722, 723, 724, 725, and 726.The III-V compound layers 721, 722, 723, 724, 725, and 726 are sequentially formed on the semiconductor substrate 710 by performing a plurality of epitaxially growing processes, in which the III-V compound layer 726 is in contact with the semiconductor substrate 710.The energy gap of the III-V compound layers 721, 722, 723, 724, 725, and 726 is sequentially decreased, from bottom to top.","Namely, the III-V compound layer 721 has the narrowest energy gap among the layers of the III-V compound layer stack 720, and III-V compound layer 726 has the widest energy gap among the layers of the III-V compound layer stack 720.The thickness of the III-V compound layers 722, 723, 724, 725, and 726 can be substantially the same and uniform.","Therefore, the III-V compound layer stack 720 can be regarded as having a gradient decreasing energy gap, from bottom to top.","Referring to FIG.","8, an infrared image sensor component 800 including an active pixel region 820′ formed on a semiconductor substrate 810, and a transistor 830 coupled to the active pixel region 820′ is provided.","The active pixel region 820′ is the portion of a III-V compound layer stack 820 uncovered by the patterns.","The III-V compound layer stack 820 is a multi-layer structure including a plurality of III-V compound layers 821, 822, 823, 824, 825, 826, and 827.The III-V compound layers 821, 822, 823, 824, 825, 826, and 827 are sequentially formed on the semiconductor substrate 810 by performing a plurality of epitaxially growing processes, in which the III-V compound layer 827 is in contact with the semiconductor substrate 810.The energy gap of the layers of the III-V compound layer stack 820 is sequentially decreased, from bottom to middle, and energy gap of the layers of the III-V compound layer stack is sequentially increased, from middle to top.","Namely, the III-V compound layer 824 at the middle of the III-V compound layer stack 820 may have the narrowest energy gap among the layers of the III-V compound layer stack 820.The III-V compound layer 821, and 827 at opposite sides of the III-V compound layer stack 820 may have the widest energy gap among the layers of the III-V compound layer stack 820.Referring to FIG.","9, an infrared image sensor component 900 including an active pixel region 920′ formed on a semiconductor substrate 910, and a transistor 930 coupled to the active pixel region 920′ is provided.","The active pixel region 920′ is the portion of a III-V compound layer stack 920 uncovered by the patterns.","The III-V compound layer stack 920 is a multi-layer structure including a first III-V compound layer 922 and a second III-V compound layer 924, in which the second III-V compound layer 924 is disposed between the first III-V compound layer 922 and the semiconductor substrate 910.The energy gap of the first III-V compound layer 922 is different from that of the second III-V compound layer 924 thereby forming a 2DEG layer therebetween.","The thickness of the first III-V compound layer 922 is thinner than that of the second III-V compound layer 924.The energy gap of the first III-V compound layer 922 is substantially consistent since the energy gap of the second III-V compound layer 924 is in a gradient distribution.","In some embodiment, the energy gap of the second III-V compound layer 924 is gradually increased from top to bottom.","Namely, the portion of the second III-V compound layer 924 close to the first III-V compound layer 922 has a smaller energy gap since the portion of the second III-V compound layer 924 close to the semiconductor substrate 910 has a larger energy gap.","Referring to FIG.","10, an infrared image sensor component 1000 including an active pixel region 1020′ formed on a semiconductor substrate 1010, and a transistor 1030 coupled to the active pixel region 1020′ is provided.","The active pixel region 1020′ is the portion of a III-V compound layer stack 1020 uncovered by the patterns.","The III-V compound layer stack 1020 is a multi-layer structure including a first III-V compound layer 1022 and a second III-V compound layer 1024, in which the second III-V compound layer 1024 is disposed between the first III-V compound layer 1022 and the semiconductor substrate 1010.The energy gap of the first III-V compound layer 1022 is different from that of the second III-V compound layer 1024 thereby forming a 2DEG layer therebetween.","The thickness of the first III-V compound layer 1022 is thinner than that of the second III-V compound layer 1024.The energy gap of the first III-V compound layer 1022 is substantially consistent since the energy gap of the second III-V compound layer 1024 is in a gradient distribution.","In some embodiment, the energy gap of the second III-V compound layer 1024 is gradually decreased from top to bottom.","Namely, the portion of the second III-V compound layer 1024 close to the first III-V compound layer 1022 has a larger energy gap since the portion of the second III-V compound layer 1024 close to the semiconductor substrate 1010 has a smaller energy gap.","Referring to FIG.","11, an infrared image sensor component 1100 including an active pixel region 1120′ formed on a semiconductor substrate 1110, and a transistor 1130 coupled to the active pixel region 1120′ is provided.","The active pixel region 1120′ is the portion of a III-V compound layer stack 1120 uncovered by the patterns.","The III-V compound layer stack 1120 is a multi-layer structure including a first III-V compound layer 1122 and a second III-V compound layer 1124, in which the second III-V compound layer 1124 is disposed between the first III-V compound layer 1122 and the semiconductor substrate 1110.The energy gap of the first III-V compound layer 1122 is different from that of the second III-V compound layer 1124 thereby forming a 2DEG layer therebetween.","The thickness of the first III-V compound layer 1122 is thinner than that of the second III-V compound layer 1124.The energy gap of the first III-V compound layer 1122 is substantially consistent since the energy gap of the second III-V compound layer 1124 is in a gradient distribution.","In some embodiment, the energy gap of the second III-V compound layer 1124 is gradually decreased from top to middle, and is further gradually increased from middle to bottom.","Namely, the portions of the second III-V compound layer 1124 close to the first III-V compound layer 1122 and close to the semiconductor substrate 1110 have a larger energy gap since the middle portion of the second III-V compound layer 1124 has a smaller energy gap.","The infrared image sensor component includes at least one III-V compound layer on the semiconductor substrate, in which the portion of the III-V compound layer(s) uncovered by the patterns is utilized as active pixel region for detecting the incident infrared ray.","The infrared image sensor component includes at least one transistor coupled to the active pixel region, and charge generated by the active pixel region is transmitted to the transistor.","The III-V compound material has wider infrared wavelength coverage than the silicon, larger absorption coefficient in the infrared region than the silicon, and higher carrier mobility than the silicon, thus performance of the infrared image sensor component is improved accordingly.","According to an aspect of the disclosure, an infrared image sensor component includes a semiconductor substrate, an active pixel region disposed on the semiconductor substrate for receiving an infrared ray, in which the active pixel region includes a III-V compound material, and a transistor coupled to the active pixel region.","The transistor includes a gate and a source/drain stressor disposed adjacent to the gate.","According to some embodiments, the active pixel region includes a first III-V compound layer and a second III-V compound layer on the first III-V compound layer.","According to some embodiments, the first III-V compound layer and the second III-V compound layer have different energy gaps.","According to some embodiments, an energy gap of the first III-V compound layer is narrower than an energy gap of the second III-V compound layer.","According to some embodiments, the active pixel region further includes a third III-V compound layer on the second III-V compound layer.","According to some embodiments, an energy gap of the second III-V compound layer is narrower than an energy gap of the third III-V compound layer.","According to some embodiments, an energy gap of the second III-V compound layer is narrower than an energy gap of the first III-V compound layer.","According to some embodiments, the active pixel region further includes a fourth III-V compound layer on the third III-V compound layer.","According to some embodiments, an energy gap of the fourth III-V compound layer is wider than an energy gap of the third III-V compound layer.","According to some embodiments, the active pixel region has an energy gap in a gradient distribution.","According to an aspect of the disclosure, an infrared image sensor component includes a semiconductor substrate, a III-V compound layer on the semiconductor substrate, wherein the III-V compound layer has an energy gap in a gradient distribution, and a transistor coupled to the III-V compound layer.","According to some embodiments, the energy gap of the III-V compound layer gradually decreases from a top of the III-V compound layer to a bottom of the III-V compound layer.","According to some embodiments, the energy gap of the III-V compound layer gradually increases from a top of the III-V compound layer to a bottom of the III-V compound layer.","According to some embodiments, the transistor includes a gate disposed on the III-V compound layer and a source and a drain disposed at opposite sides of the gate.","The drain is coupled to the III-V compound layer.","According to some embodiments, the infrared image sensor component further includes at least one pattern shielding the gate and the drain.","According to some embodiments of the disclosure, a method of manufacturing an infrared image sensor component includes forming a first III-V compound layer on a semiconductor substrate, forming a second III-V compound layer on the first III-V compound layer, in which the second III-V compound layer has an energy gap different from that of the first III-V compound layer; and forming a transistor on the second III-V compound layer.","According to some embodiments, the method further includes forming at least one pattern above the transistor, in which a portion of the second III-V compound layer is free from coverage by the pattern.","According to some embodiments, forming the transistor includes forming a gate on the second III-V compound layer, and forming an ohmic metal contact adjacent to the gate and coupled to the second III-V compound layer.","According to some embodiments, forming the transistor includes forming a gate on the second III-V compound layer, and forming a source/drain stressor adjacent to the gate and coupled to the second III-V compound layer.","According to some embodiments, the method further includes forming an optical lens above the second III-V compound layer.","The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure.","Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein.","Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure."]],"string":"[\n [\n \"INFRARED IMAGE SENSOR COMPONENT AND MANUFACTURING METHOD THEREOF\",\n \"An infrared image sensor component includes a semiconductor substrate, an active pixel region disposed on the semiconductor substrate for receiving an infrared ray, and a transistor coupled to the active pixel region.\",\n \"The transistor includes a gate and a source/drain stressor disposed adjacent to the gate.\",\n \"The active pixel region includes a III-V compound material.\"\n ],\n [\n \"1.An infrared image sensor component comprising: a semiconductor substrate; an active pixel region disposed on the semiconductor substrate for receiving an infrared ray, wherein the active pixel region comprises a III-V compound material; a transistor coupled to the active pixel region, wherein the transistor comprises: a gate; and a source/drain stressor disposed adjacent to the gate.\",\n \"2.The infrared image sensor component of claim 1, wherein the active pixel region comprises a first III-V compound layer and a second III-V compound layer on the first III-V compound layer.\",\n \"3.The infrared image sensor component of claim 2, wherein the first III-V compound layer and the second III-V compound layer have different energy gaps.\",\n \"4.The infrared image sensor component of claim 2, wherein an energy gap of the first III-V compound layer is narrower than an energy gap of the second III-V compound layer.\",\n \"5.The infrared image sensor component of claim 2, wherein the active pixel region further comprises a third III-V compound layer on the second III-V compound layer.\",\n \"6.The infrared image sensor component of claim 5, wherein an energy gap of the second III-V compound layer is narrower than an energy gap of the third III-V compound layer.\",\n \"7.The infrared image sensor component of claim 5, wherein an energy gap of the second III-V compound layer is narrower than an energy gap of the first III-V compound layer.\",\n \"8.The infrared image sensor component of claim 5, wherein the active pixel region further comprises a fourth III-V compound layer on the third III-V compound layer.\",\n \"9.The infrared image sensor component of claim 8, wherein an energy gap of the fourth III-V compound layer is wider than an energy gap of the third III-V compound layer.\",\n \"10.The infrared image sensor component of claim 1, wherein the active pixel region has an energy gap in a gradient distribution.\",\n \"11.An infrared image sensor component comprising: a semiconductor substrate; a III-V compound layer on the semiconductor substrate, wherein the III-V compound layer has an energy gap in a gradient distribution; and a transistor coupled to the III-V compound layer.\",\n \"12.The infrared image sensor component of claim 11, wherein the energy gap of the III-V compound layer gradually decreases from a top of the III-V compound layer to a bottom of the III-V compound layer.\",\n \"13.The infrared image sensor component of claim 11, wherein the energy gap of the III-V compound layer gradually increases from a top of the III-V compound layer to a bottom of the III-V compound layer.\",\n \"14.The infrared image sensor component of claim 11, wherein the transistor comprises: a gate disposed on the III-V compound layer; and a source and a drain disposed at opposite sides of the gate, wherein the drain is coupled to the III-V compound layer.\",\n \"15.The infrared image sensor component of claim 14, further comprising: at least one pattern shielding the gate and the drain.\",\n \"16.A method of manufacturing an infrared image sensor component, the method comprising: forming a first III-V compound layer on a semiconductor substrate; forming a second III-V compound layer on the first III-V compound layer, wherein the second III-V compound layer has an energy gap different from that of the first III-V compound layer; and forming a transistor on the second III-V compound layer.\",\n \"17.The method of claim 16, further comprising: forming at least one pattern above the transistor, wherein a portion of the second III-V compound layer is free from coverage by the pattern.\",\n \"18.The method of claim 16, wherein forming the transistor comprises: forming a gate on the second III-V compound layer; and forming an ohmic metal contact adjacent to the gate and coupled to the second III-V compound layer.\",\n \"19.The method of claim 16, wherein forming the transistor comprises: forming a gate on the second III-V compound layer; and forming a source/drain stressor adjacent to the gate and coupled to the second III-V compound layer.\",\n \"20.The method of claim 16, further comprising: forming an optical lens above the second III-V compound layer.\"\n ],\n [\n \" BACKGROUND The semiconductor integrated circuit (IC) industry has experienced exponential growth.\",\n \"Technological advances in IC materials and design have produced generations of ICs where each generation has smaller and more complex circuits than the previous generation.\",\n \"In semiconductor technologies, image sensors are used for sensing a volume of exposed light projected towards the semiconductor substrate.\",\n \"Complementary metal-oxide-semiconductor (CMOS) image sensor devices are widely used in various applications such as digital still camera (DSC) applications.\",\n \"These devices utilize an array of active pixels or image sensor cells, including photodiode elements and MOS transistors, to collect photo energy to convert images to streams of digital data.\"\n ],\n [\n \" BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures.\",\n \"It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale.\",\n \"In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.\",\n \"FIG.\",\n \"1A to FIG.\",\n \"1E are local cross-sectional views of different stages of a method of manufacturing an infrared image sensor component, in accordance with some embodiments of the disclosure.\",\n \"FIG.\",\n \"2 is a local cross-sectional view of an infrared image sensor component, in accordance with some embodiments of the disclosure.\",\n \"FIG.\",\n \"3A to FIG.\",\n \"3F are local cross-sectional views of different stages of fabricating an infrared image sensor component, in accordance with some other embodiments of the disclosure.\",\n \"FIG.\",\n \"4 to FIG.\",\n \"11 are local cross-sectional views of an infrared image sensor component, in accordance with different embodiments of the disclosure.\",\n \"detailed-description description=\\\"Detailed Description\\\" end=\\\"lead\\\"?\"\n ],\n [\n \"RELATED APPLICATIONS This application is a continuation of U.S. application Ser.\",\n \"No.\",\n \"15/051,600, filed Feb. 23, 2016, now U.S. Pat.\",\n \"No.\",\n \"9,871,067, issued Jan. 16, 2018, which are herein incorporated by reference in their entireties.\",\n \"BACKGROUND The semiconductor integrated circuit (IC) industry has experienced exponential growth.\",\n \"Technological advances in IC materials and design have produced generations of ICs where each generation has smaller and more complex circuits than the previous generation.\",\n \"In semiconductor technologies, image sensors are used for sensing a volume of exposed light projected towards the semiconductor substrate.\",\n \"Complementary metal-oxide-semiconductor (CMOS) image sensor devices are widely used in various applications such as digital still camera (DSC) applications.\",\n \"These devices utilize an array of active pixels or image sensor cells, including photodiode elements and MOS transistors, to collect photo energy to convert images to streams of digital data.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures.\",\n \"It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale.\",\n \"In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.\",\n \"FIG.\",\n \"1A to FIG.\",\n \"1E are local cross-sectional views of different stages of a method of manufacturing an infrared image sensor component, in accordance with some embodiments of the disclosure.\",\n \"FIG.\",\n \"2 is a local cross-sectional view of an infrared image sensor component, in accordance with some embodiments of the disclosure.\",\n \"FIG.\",\n \"3A to FIG.\",\n \"3F are local cross-sectional views of different stages of fabricating an infrared image sensor component, in accordance with some other embodiments of the disclosure.\",\n \"FIG.\",\n \"4 to FIG.\",\n \"11 are local cross-sectional views of an infrared image sensor component, in accordance with different embodiments of the disclosure.\",\n \"DETAILED DESCRIPTION The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter.\",\n \"Specific examples of components and arrangements are described below to simplify the present disclosure.\",\n \"These are, of course, merely examples and are not intended to be limiting.\",\n \"For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact.\",\n \"In addition, the present disclosure may repeat reference numerals and/or letters in the various examples.\",\n \"This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.\",\n \"Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.\",\n \"The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.\",\n \"The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.\",\n \"The present disclosure is related to an infrared image senor component.\",\n \"The infrared sensor component includes a substrate, a III-V compound layer disposed on the substrate as an active pixel region, and a plurality of transistors formed on the III-V compound layer.\",\n \"The III-V compound layer is made of III-V groups materials, which have wide infrared wavelength coverage, large absorption coefficient in the infrared region, and high carrier mobility.\",\n \"Therefore, the performance of the infrared image sensor component can be improved accordingly.\",\n \"FIG.\",\n \"1A to FIG.\",\n \"1E are local cross-sectional views of different stages of a method of manufacturing an infrared image sensor component, in accordance with some embodiments of the disclosure.\",\n \"Reference is made to FIG.\",\n \"1A.\",\n \"A III-V compound layer 120 is formed on a substrate 110.The substrate 110 is a semiconductor substrate.\",\n \"In some embodiments, the semiconductor substrate is made of, for example, silicon; a compound semiconductor, such as silicon carbide, indium arsenide, or indium phosphide; or an alloy semiconductor, such as silicon germanium carbide, gallium arsenic phosphide, or gallium indium phosphide.\",\n \"The substrate 110 may optionally include various doped regions, dielectric features, or multilevel interconnects in the semiconductor substrate.\",\n \"The III-V compound layer 120 is made from the III-V groups in the periodic table of elements.\",\n \"In some embodiments, the III-V compound layer 120 is a single layer having a tuned energy gap.\",\n \"In some other embodiments, the III-V compound layer 120 is a combination of multiple III-V material layers with wide and narrow energy gap.\",\n \"In yet some other embodiments, the III-V compound layer 120 may have gradient energy gap.\",\n \"The III-V compound layer 120 or each of the layers of the III-V compound layer 120 is made of material selected from a group consisting of InwAlxGayAsz, InwAlxGayPz, InwAlxGaySbz, InwAlxAsyPz, InwAlxPySbz, InwGaxAsyPz, InwGaxPySbz, AlwGaxAsyPz, AlwGaxPySbz, InwAsxPySbz, AlwAsxPySbz, GawAsxPySbz, in which w+x+y+z=1.The III-V compound layer 120 can be epitaxially grown by a number of processes including, but not limited to, molecular beam epitaxy (MBE), or metal organic chemical vapor deposition (MOCVD), also known as metal organic vapor phase epitaxy (MOVPE), using appropriate precursors.\",\n \"The thickness of the III-V compound layer 120 is in a ranged from about 0.1 g m to about 10 g m. Reference is made to FIG.\",\n \"1B.\",\n \"At least one transistor 130 is formed on the III-V compound layer 120.The transistors 130 are formed in an array and are arranged corresponding to the pixels of the infrared image sensor component 100.In some embodiments, the transistor 130 can be a metal-oxide-semiconductor (MOS) device.\",\n \"Each of the transistors 130 includes a control gate 132 formed on the III-V compound layer 120, and two doped regions 134, and 136 formed in the III-V compound layer 120 and disposed at opposite sides of the control gate 132.The doped regions 134, and 136 may be doped with impurities.\",\n \"The transistor 130 further includes a gate isolation 138 formed between the control gate 132 and the III-V compound layer 120.The transistor 130 further includes sidewalls 135 formed at opposite side surfaces of the control gate 132.In some embodiments, the transistor 130 is a complementary metal-oxide-semiconductor (CMOS) device.\",\n \"An exemplary method of fabricating the transistor 130 begins at, for instant, forming a photoresist layer on the surface of the III-V compound layer 120.In some embodiments, the III-V compound layer 120 is a P-type layer which includes P-type impurity.\",\n \"The photoresist layer is performed by masking, exposing and developing to define the region for subsequent ion injection, then respectively form a N-type doped regions 134, and 136 in the III-V compound layer 120 by ion injection.\",\n \"The photoresist layer is removed by, such as stripping, after the N-type doped regions 134, and 136 are formed.\",\n \"The doping impurity of forming the N-type doped regions 134, and 136 can be P, As, Si, Ge, C, O, S, Se, Te, or Sb.\",\n \"The doped regions 134, and 136 are generally formed of a low or high concentration impurity region.\",\n \"In some embodiments, the doped regions 134, 136 are regarded as source/drain regions.\",\n \"In some embodiments, the doped region 134 is extended longer than the doped region 136.The N-type doped region 134 and the underlying portion of P-type III-V compound layer 120 may detect incident light.\",\n \"An isolation layer is further formed on the surfaces of the III-V compound layer 120 by using a low temperature process, in which the isolation layer may be silicon oxide.\",\n \"A conductive layer is further formed on the isolation layer, in which the conductive layer can be doped polycrystalline silicon, tungsten, titanium nitride, or other suitable materials.\",\n \"One or more etching processes are performed to the isolation layer and the conductive layer thereby forming gate isolation 138 and the control gate 132 thereon.\",\n \"Then the sidewalls 135 are formed at the sides of the control gate 132.The infrared image sensor component 100 further includes at least one shallow trench isolation structure 180.The shallow trench isolation structure 180 is at least formed in the III-V compound layer 120.In some embodiments, the shallow trench isolation structure 180 is formed in the III-V compound layer 120 and in the semiconductor substrate 110.The shallow trench isolation structure 180 is formed next to the doped region 134 to separate the adjacent pixels.\",\n \"The material of the shallow trench isolation structure 180 can be dielectric, such as oxide.\",\n \"Reference is made to FIG.\",\n \"1C.\",\n \"A plurality of patterns 140 and a plurality of dielectric layers 150 are sequentially formed on the III-V compound layer 120 and on the transistors 130.The patterns 140 provide functions including wiring and light shielding.\",\n \"The patterns 140 are formed by depositing a conductive layer and etching the conductive layer.\",\n \"The material of the conductive layer may be metal, such as W, Cu, or Co.\",\n \"The dielectric layer 150 is made of insulating material with high transmittance to improve light transmittance.\",\n \"The dielectric layer 150 can be made of silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, low-dielectric constant dielectric material or a combination thereof.\",\n \"The dielectric layer 150 can be formed by a deposition process, such as an ALD process, a CVD process, or a PVD process.\",\n \"The patterns 140 are formed for shielding a portion of the transistors 130 and a portion of the III-V compound layer 120.Namely, only the doped region 134 and a portion of the III-V compound layer 120 are exposed from the patterns 140.The doped region 134 and the exposed portion of the III-V compound layer 120 are utilized as active pixel region 120′ for sensing the light including infrared ray.\",\n \"The active pixel region 120′ receives light to generate and accumulate photocharges, and a logic element (not illustrated) may detect electric signals transmitted from the corresponding active pixel region 120′.\",\n \"The energy gap of the active pixel region 120′ can be tuned by the composition of the III-V compound layer 120 and the doped region 134.The energy gap of the active pixel region 120′ is tuned corresponding to the wavelength of the incident light such as infrared ray.\",\n \"The active pixel region 120′ absorbs incident light and accumulates charges corresponding to an amount and/or intensity of the light.\",\n \"The active pixel regions 120′ is coupled with the transistors 130.The transistor 130 includes the control gate 132, and doped regions 134, and 136.The doped region 134 and the under lying III-V compound layer 120 construct the active pixel region 120′ for receiving the charges generated by the active pixel region 120′.\",\n \"The charges are transferred to the doped region 136 through the conducted control gate 132.In some embodiments, doped region 136 generally has parasitic capacitance, so charges may accumulate at the doped region 136.The potential of the doped region 136 can be changed by the accumulated charges, and therefore the amount of charges is detected through the change in electric potential of the doped region 136.In order to prevent light current leakage, the patterns 140 are formed to shield the portion other than the active pixel region 120′.\",\n \"In some embodiments, the patterns 140 are formed covering the control gate 132, and the doped regions 136.The active pixel region 120′ and the doped region 134 are exposed from the patterns 140 to receive the incident light, such as infrared ray.\",\n \"Reference is made to FIG.\",\n \"1D.\",\n \"An infrared filter 160 is disposed on the dielectric layer 150.The infrared filter 160 is an infrared ray pass filter which passes infrared light while blocking other wavelengths.\",\n \"In some embodiments, the infrared filter 160 is formed of a material capable of blocking out all light except for the spectrum that falls between 800 nanometers and 1000 nanometers.\",\n \"Reference is made to FIG.\",\n \"1E, an optical lens 170 is formed on the infrared filter 160.The optical lens 170 is formed of thermosetting resin and may have a predetermined curvature radius.\",\n \"The curvature radius of the optical lens 170 can be different depending on the depth of the active pixel region 120′, and the wavelength of incident light.\",\n \"The optical lens 170 changes the path of incident light and collects light onto the active pixel region 120′.\",\n \"Using the III-V compound layer 120 as the active pixel region 120′ may reduce the thickness of the infrared image sensor component 100.Comparing with the embodiments of silicon substrate having p-n junction diodes, the III-V compound layer 120 provides wider infrared response.\",\n \"Namely, the III-V compound material has wider infrared wavelength coverage than the silicon, such that the infrared ray including near infrared ray, and middle infrared ray can be detected by the III-V compound layer 120.Also, the III-V compound material has larger absorption coefficient in the infrared region than the silicon, such that the thickness of the III-V compound layer 120 is thinner than the p-n junction diodes.\",\n \"Furthermore, the III-V compound material provides higher carrier mobility than the silicon, thus the pixel response of the infrared image sensor component 100 using the III-V compound layer 120 is faster than that of using the silicon substrate with p-n junction diodes.\",\n \"Reference is made to FIG.\",\n \"2, which a local cross-sectional view of an infrared image sensor component of some embodiments of the disclosure.\",\n \"The transistor 130 may include epitaxy structures 131 and 133 instead of the doped regions 134 and 136.In order to form the epitaxy structures 131 and 133, a plurality of openings are formed at opposite sides the control gate 132 and in the III-V compound layer 120, and then an epitaxy is performed to grow the epitaxy structures 131 and 133 are formed in the openings.\",\n \"The source/drain stressors form at least parts of the epitaxy structures 131 and 133.In the embodiments in which the transistor 130 is an nMOS device, the epitaxy structures 131 and 133 may include silicon phosphorous (SiP), silicon carbide (SiC), or the like.\",\n \"In the embodiments in which the transistor is a pMOS device, the epitaxy structures 131 and 133 may include silicon germanium (SiGe).\",\n \"The patterns 140 are formed to shield the control gate 132 and the epitaxy structure 133 and to expose the epitaxy structure 131 and a portion of the III-V compound layer 120.The uncovered III-V compound layer 120 can be utilized as active pixel region 120′ to receive the infrared ray and generate photocharges.\",\n \"The epitaxy structure 131 is coupled to the active pixel region 120′, thus the charges are received by the epitaxy structure 131 and is further transferred to the epitaxy structure 133 through the conducted control gate 132, and a logic element (not illustrated) may detect electric signals transmitted from the corresponding active pixel region 120′.\",\n \"The active pixel regions and the transistors of the infrared image sensor component may have various modifications.\",\n \"For example, FIG.\",\n \"3A to FIG.\",\n \"3F show local cross-sectional views of different stages of fabricating an infrared image sensor component, in accordance with some other embodiments of the disclosure.\",\n \"The method begins at FIG.\",\n \"3A, at least one III-V compound layer is formed on a semiconductor substrate 210.In some embodiments, a first III-V compound layer 220, and a second III-V compound layer 230 are formed on a semiconductor substrate 210.In some embodiments, the semiconductor substrate 210 is made of, for example, silicon; a compound semiconductor, such as silicon carbide, indium arsenide, or indium phosphide; or an alloy semiconductor, such as silicon germanium carbide, gallium arsenic phosphide, or gallium indium phosphide.\",\n \"The semiconductor substrate 210 may also include various doped regions, dielectric features, or multilevel interconnects in the semiconductor substrate.\",\n \"The first III-V compound layer 220 and the second III-V compound layer 230 are compounds made from the III-V groups in the periodic table of elements.\",\n \"However, the first III-V compound layer 220 and the second III-V compound layer 230 are different from each other in composition.\",\n \"The first III-V compound layer 220 and the second III-V compound layer 230 can be respectively epitaxially grown by a number of processes including, but not limited to, metal organic chemical vapor deposition (MOCVD), also known as metal organic vapor phase epitaxy (MOVPE), using appropriate precursors.\",\n \"The first III-V compound layer 220 and the second III-V compound layer 230 directly contact each other.\",\n \"Different composition of III-V compound materials causes the layers to have different energy gaps.\",\n \"An energy gap discontinuity between the first III-V compound layer 220 and the second III-V compound layer 230, along with the piezo-electric effect, creates a very thin layer 240 of highly mobile conducting electrons in the first III-V compound layer 220.The thin layer 240 contributes to a conductive two dimensional electron gas (2DEG) layer near the junction of the two layers.\",\n \"The thin layer 240 (also referred to as the 2DEG layer 240) allows charge to flow through the component.\",\n \"A third III-V compound layer 250 is further formed on the second III-V compound layer 230.In some embodiments, the third III-V compound layer 250 is a doped III-V compound layer, such a p-type doped GaN layer (also referred to as the doped GaN layer 250).\",\n \"The doped GaN layer 250 can be epitaxially grown by MOCVD using appropriate aluminum, nitrogen and gallium precursors.\",\n \"The aluminum precursor includes trimethylaluminum (TMA), triethylaluminum (TEA), or suitable chemical precursors.\",\n \"Exemplary gallium containing precursors are trimethlgallium (TMG), triethylgallium (TEG) or other suitable chemical precursors.\",\n \"Exemplary nitrogen precursors include, but are not limited to, phenyl hydrazine, dimethylhydrazine, tertiarybutylamine, ammonia, or other suitable chemical precursors.\",\n \"The second III-V compound layer 230 can also be referred to as a barrier layer.\",\n \"Reference is made to FIG.\",\n \"3B.\",\n \"The doped third III-V compound layer 250 is patterned for defining at least one doped III-V compound region 252 on the second III-V compound layer 230.The 2DEG layer 240 under the doped III-V compound region 252 is removed.\",\n \"In some embodiments, a mask layer, such as a photoresist layer is formed on the doped third III-V compound layer 250, and the mask layer is patterned by a lithography process to form a plurality of features and a plurality of openings defined by the features on doped third III-V compound layer 250.The pattern of the mask layer is formed according to a predetermined integrated circuit pattern.\",\n \"The lithography process may include photoresist coating, exposing, post-exposure baking, and developing.\",\n \"Then, an etching process is performed to define the doped III-V compound region 252.A shallow trench isolation structure 212 is formed in the first III-V compound layer 220 and the second III-V compound layer 230 to define an active pixel region of a pixel.\",\n \"In some embodiments, the shallow trench isolation structure 212 is further formed in the semiconductor substrate 210.The shallow trench isolation structure 212 is a dielectric material, such as oxide.\",\n \"The active pixel region is defined between the III-V doped compound region 252 and the shallow trench isolation structure 212.A dielectric layer 260 is formed on the doped III-V compound region 252 and on the second III-V compound layer 230.The dielectric layer 260 can be made of silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, low-dielectric constant dielectric material or a combination thereof.\",\n \"The dielectric layer 260 can be formed by a deposition process, such as an ALD process, a CVD process, or a PVD process.\",\n \"The dielectric layer 260 is further patterned to define a plurality of openings 262 in the dielectric layer 260.The dielectric layer 260 is selectively etched and cleaned to define the openings 262.Exemplary etching processes include sputter etching, reactive gas etching, chemical etching and ion milling.\",\n \"The openings 262 are formed at opposite sides of the doped III-V compound region 252.The openings 262 are led into the second III-V compound layer 230.Namely, the thickness of the second III-V compound layer 230 under the openings 262 is thinner than other portions of the second III-V compound layer 230.Reference is made to FIG.\",\n \"3C.\",\n \"A plurality of ohmic metal contacts 270, 272 are formed in the openings 262.The ohmic metal contacts 270, 272 can be formed by depositing a ohmic contact layer on the dielectric layer 260 and in the openings 262, and patterning ohmic contact layer.\",\n \"The deposition process can be sputter deposition, evaporation or chemical vapor deposition (CVD).\",\n \"Exemplary ohmic metals include, but are not limited to, Ta, TaN, Pd, W, WSi2, Ti, Al, TiN, AlCu, AlSiCu and Cu.\",\n \"In some embodiments, the ohmic contacts 270, 272 connect to the second III-V compound layer 230 directly.\",\n \"The ohmic contacts 270, 272 are utilized as a part of drain electrode and a source electrode.\",\n \"Reference is made to FIG.\",\n \"3D.\",\n \"The dielectric layer 260 on the III-V doped compound region 252 is etched thereby forming another opening therein.\",\n \"A gate metal stack 274 is further formed in the opening as a gate electrode.\",\n \"The gate metal stack 274 results in a device yielding an enhancement mode (E-mode) device.\",\n \"In the embodiment depicted in FIG.\",\n \"2D, the gate metal stack 274, the source and drain contacts 270, 272, and the 2DEG layer 240 (as a channel) in the first III-V compound layer 220 are configured as an E-mode transistor 255, which is a normally off device, and when a positive voltage applied to the gate stack for forward bias is great enough, the E-mode transistor is turned on.\",\n \"Reference is made to FIG.\",\n \"3E.\",\n \"A plurality of dielectric layers 280 and a plurality of patterns 282 are sequentially formed on dielectric layer 260 and on the transistor 255.The patterns 282 can be conductive patterns and provide functions including wiring and light shielding.\",\n \"The patterns 282 are formed by depositing a conductive layer and etching the conductive layer.\",\n \"The material of the conductive layer may be metal, such as W, Cu, or Co.\",\n \"The dielectric layers 280 are made of insulating material with high transmittance to improve light transmittance.\",\n \"The dielectric layers 280 can be made of silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, low-dielectric constant dielectric material or a combination thereof.\",\n \"The dielectric layers 280 can be formed by a deposition process, such as an ALD process, a CVD process, or a PVD process.\",\n \"The patterns 280 are formed for shielding a portion of the transistors and a portion of the second III-V compound layer 230.Namely, only portions of the III-V compound layer 230 are exposed from the patterns 282.The exposed portion of the second III-V compound layer 230 and the underlying 2DEG layer 240 are utilized as active pixel region 230′ for sensing the light including infrared ray.\",\n \"The active pixel region 230′ receives light to generate and accumulate photocharges, and a logic element (not illustrated) may detect electric signals transmitted from the corresponding active pixel region 230.The energy gap of the active pixel region 230′ can be tuned by the composition of the first III-V compound layer 220 and the second III-V compound layer 230.The energy gap of the active pixel region 230′ is tuned corresponding to the wavelength of the incident light such as infrared ray.\",\n \"The active pixel region 230′ absorbs incident light and accumulates charges corresponding to an amount and/or intensity of the light.\",\n \"The active pixel regions 230′ is coupled with the transistors 255.The ohmic metal contact 270 is regarded as source and is connected to the active pixel region 230′ for receiving the charges generated by the active pixel region 230′.\",\n \"The charges are transferred to the ohmic metal contact 272 through the conducted control gate 252.In some embodiments, charges may accumulate at the ohmic metal contact 272, which is regarded as drain.\",\n \"The potential of the ohmic metal contact 272 can be changed by the accumulated charges, and therefore the amount of charges is detected through the change in electric potential of the ohmic metal contact 272.In order to prevent light current leakage, the patterns 282 are formed to shield the portion other than the active pixel region 230′.\",\n \"In some embodiments, the patterns 282 are formed covering the doped III-V compound region 252 and the gate metal stack 274 (e.g., the gate), and the ohmic metal contact 272 (e.g., the drain).\",\n \"The active pixel region 230′ and the ohmic metal contact 270 between the active pixel region 230′ and the doped III-V compound region 252 are exposed from the patterns 282 to receive the incident light, such as infrared ray.\",\n \"Reference is made to FIG.\",\n \"3F.\",\n \"An infrared filter 290 is disposed on the dielectric layer 280, and an optical lens 292 is formed on the infrared filter 290.The infrared filter 290 is an infrared ray pass filter.\",\n \"The curvature radius of the optical lens 292 can be different depending on the depth of the active pixel region 230′, and the wavelength of incident light.\",\n \"The optical lens 292 changes the path of incident light and collects light onto the active pixel region 230′.\",\n \"The composition of the III-V compound layers can be modified to tune the energy gap of the III-V compound layers.\",\n \"The composition of the III-V compound layers can be modified by changing the materials of the III-V compound layer, changing the thickness of the III-V compound layer, and/or changing the concentration of the III-V compound layer.\",\n \"Different combinations of the III-V compound layers may result in different response wavelength of the active pixel region.\",\n \"Variations of the combination of the III-V compound layers are discussed in following embodiments.\",\n \"FIG.\",\n \"4 to FIG.\",\n \"11 are local cross-sectional views of an infrared image sensor component, in accordance with different embodiments of the disclosure.\",\n \"Referring to FIG.\",\n \"4, an infrared image sensor component 400 including an active pixel region 420′ formed on a semiconductor substrate 410, and a transistor 430 coupled to the active pixel region 420′ is provided.\",\n \"The active pixel region 420′ is the portion of a III-V compound layer stack 420 uncovered by the patterns.\",\n \"The III-V compound layer stack 420 includes a plurality of III-V compound layers 422, 424, and 426, which can be grown by performing a plurality of epitaxially growing processes.\",\n \"The semiconductor substrate 410 can be a silicon substrate.\",\n \"The III-V compound layers 422 and 426 are made of III-V compound having wide energy gap, and the III-V compound layer 424 is made of III-V compound having narrow energy gap.\",\n \"However, the composition of the III-V compound layers 422, 426 may be the same or different.\",\n \"The III-V compound layer 426 is formed on and in contact with the semiconductor substrate 410.The III-V compound layer 424 with narrow energy gap is sandwiched between the III-V compound layers 422, 426 with wide energy gap.\",\n \"The thickness of the III-V compound layers 422, 424, and 426 may be different.\",\n \"Referring to FIG.\",\n \"5, an infrared image sensor component 500 including an active pixel region 520′ formed on a semiconductor substrate 510, and a transistor 530 coupled to the active pixel region 520′ is provided.\",\n \"The active pixel region 520′ is the portion of a III-V compound layer stack 520 uncovered by the patterns.\",\n \"The III-V compound layer stack 520 is a multi-layer structure including a plurality of first III-V compound layers 522, and a plurality of second III-V compound layers 524, which can be grown by performing a plurality of epitaxially growing processes.\",\n \"The semiconductor substrate 510 can be a silicon substrate.\",\n \"The first III-V compound layers 522 are made of III-V compound having wide energy gap, and the second III-V compound layers 524 are made of III-V compound having narrow energy gap.\",\n \"In some embodiments, the transistor 530 is formed on the first III-V compound layer 522.The number of the first III-V compound layers 522 can be equal to the number of the second III-V compound layers 524.The first III-V compound layers 522 and the second compound layers 524 are arranged in pair, and the second III-V compound layers 522 with narrow energy gap are respectively sandwiched between the adjacent two of the first III-V compound layers 524 with wide energy gap.\",\n \"The thickness of the first III-V compound layers 522 and thickness of the second III-V compound layers 524 may be substantially the same (except for the uppermost layer 522).\",\n \"Referring to FIG.\",\n \"6, an infrared image sensor component 600 including an active pixel region 620′ formed on a semiconductor substrate 610, and a transistor 630 coupled to the active pixel region 620′ is provided.\",\n \"The active pixel region 620′ is the portion of a III-V compound layer stack 620 uncovered by the patterns.\",\n \"The III-V compound layer stack 620 is a multi-layer structure including a plurality of III-V compound layers 621, 622, 623, 624, 625, and 626.The III-V compound layers 621, 622, 623, 624, 625, and 626 are sequentially formed on the semiconductor substrate 610 by performing a plurality of epitaxially growing processes, in which the III-V compound layer 626 is in contact with the semiconductor substrate 610.The energy gap of the III-V compound layers 621, 622, 623, 624, 625, and 626 is sequentially increased, from bottom to top.\",\n \"Namely, the III-V compound layer 626 has the narrowest energy gap among the layers of the III-V compound layer stack 620, and III-V compound layer 621 has the widest energy gap among the layers of the III-V compound layer stack 620.The thickness of the III-V compound layers 622, 623, 624, 625, and 626 can be substantially the same and uniform.\",\n \"Therefore, the III-V compound layer stack 620 can be regarded as having a gradient increasing energy gap, from bottom to top.\",\n \"Referring to FIG.\",\n \"7, an infrared image sensor component 700 including an active pixel region 720′ formed on a semiconductor substrate 710, and a transistor 730 coupled to the active pixel region 720′ is provided.\",\n \"The active pixel region 720′ is the portion of a III-V compound layer stack 720 uncovered by the patterns.\",\n \"The III-V compound layer stack 720 is a multi-layer structure including a plurality of III-V compound layers 721, 722, 723, 724, 725, and 726.The III-V compound layers 721, 722, 723, 724, 725, and 726 are sequentially formed on the semiconductor substrate 710 by performing a plurality of epitaxially growing processes, in which the III-V compound layer 726 is in contact with the semiconductor substrate 710.The energy gap of the III-V compound layers 721, 722, 723, 724, 725, and 726 is sequentially decreased, from bottom to top.\",\n \"Namely, the III-V compound layer 721 has the narrowest energy gap among the layers of the III-V compound layer stack 720, and III-V compound layer 726 has the widest energy gap among the layers of the III-V compound layer stack 720.The thickness of the III-V compound layers 722, 723, 724, 725, and 726 can be substantially the same and uniform.\",\n \"Therefore, the III-V compound layer stack 720 can be regarded as having a gradient decreasing energy gap, from bottom to top.\",\n \"Referring to FIG.\",\n \"8, an infrared image sensor component 800 including an active pixel region 820′ formed on a semiconductor substrate 810, and a transistor 830 coupled to the active pixel region 820′ is provided.\",\n \"The active pixel region 820′ is the portion of a III-V compound layer stack 820 uncovered by the patterns.\",\n \"The III-V compound layer stack 820 is a multi-layer structure including a plurality of III-V compound layers 821, 822, 823, 824, 825, 826, and 827.The III-V compound layers 821, 822, 823, 824, 825, 826, and 827 are sequentially formed on the semiconductor substrate 810 by performing a plurality of epitaxially growing processes, in which the III-V compound layer 827 is in contact with the semiconductor substrate 810.The energy gap of the layers of the III-V compound layer stack 820 is sequentially decreased, from bottom to middle, and energy gap of the layers of the III-V compound layer stack is sequentially increased, from middle to top.\",\n \"Namely, the III-V compound layer 824 at the middle of the III-V compound layer stack 820 may have the narrowest energy gap among the layers of the III-V compound layer stack 820.The III-V compound layer 821, and 827 at opposite sides of the III-V compound layer stack 820 may have the widest energy gap among the layers of the III-V compound layer stack 820.Referring to FIG.\",\n \"9, an infrared image sensor component 900 including an active pixel region 920′ formed on a semiconductor substrate 910, and a transistor 930 coupled to the active pixel region 920′ is provided.\",\n \"The active pixel region 920′ is the portion of a III-V compound layer stack 920 uncovered by the patterns.\",\n \"The III-V compound layer stack 920 is a multi-layer structure including a first III-V compound layer 922 and a second III-V compound layer 924, in which the second III-V compound layer 924 is disposed between the first III-V compound layer 922 and the semiconductor substrate 910.The energy gap of the first III-V compound layer 922 is different from that of the second III-V compound layer 924 thereby forming a 2DEG layer therebetween.\",\n \"The thickness of the first III-V compound layer 922 is thinner than that of the second III-V compound layer 924.The energy gap of the first III-V compound layer 922 is substantially consistent since the energy gap of the second III-V compound layer 924 is in a gradient distribution.\",\n \"In some embodiment, the energy gap of the second III-V compound layer 924 is gradually increased from top to bottom.\",\n \"Namely, the portion of the second III-V compound layer 924 close to the first III-V compound layer 922 has a smaller energy gap since the portion of the second III-V compound layer 924 close to the semiconductor substrate 910 has a larger energy gap.\",\n \"Referring to FIG.\",\n \"10, an infrared image sensor component 1000 including an active pixel region 1020′ formed on a semiconductor substrate 1010, and a transistor 1030 coupled to the active pixel region 1020′ is provided.\",\n \"The active pixel region 1020′ is the portion of a III-V compound layer stack 1020 uncovered by the patterns.\",\n \"The III-V compound layer stack 1020 is a multi-layer structure including a first III-V compound layer 1022 and a second III-V compound layer 1024, in which the second III-V compound layer 1024 is disposed between the first III-V compound layer 1022 and the semiconductor substrate 1010.The energy gap of the first III-V compound layer 1022 is different from that of the second III-V compound layer 1024 thereby forming a 2DEG layer therebetween.\",\n \"The thickness of the first III-V compound layer 1022 is thinner than that of the second III-V compound layer 1024.The energy gap of the first III-V compound layer 1022 is substantially consistent since the energy gap of the second III-V compound layer 1024 is in a gradient distribution.\",\n \"In some embodiment, the energy gap of the second III-V compound layer 1024 is gradually decreased from top to bottom.\",\n \"Namely, the portion of the second III-V compound layer 1024 close to the first III-V compound layer 1022 has a larger energy gap since the portion of the second III-V compound layer 1024 close to the semiconductor substrate 1010 has a smaller energy gap.\",\n \"Referring to FIG.\",\n \"11, an infrared image sensor component 1100 including an active pixel region 1120′ formed on a semiconductor substrate 1110, and a transistor 1130 coupled to the active pixel region 1120′ is provided.\",\n \"The active pixel region 1120′ is the portion of a III-V compound layer stack 1120 uncovered by the patterns.\",\n \"The III-V compound layer stack 1120 is a multi-layer structure including a first III-V compound layer 1122 and a second III-V compound layer 1124, in which the second III-V compound layer 1124 is disposed between the first III-V compound layer 1122 and the semiconductor substrate 1110.The energy gap of the first III-V compound layer 1122 is different from that of the second III-V compound layer 1124 thereby forming a 2DEG layer therebetween.\",\n \"The thickness of the first III-V compound layer 1122 is thinner than that of the second III-V compound layer 1124.The energy gap of the first III-V compound layer 1122 is substantially consistent since the energy gap of the second III-V compound layer 1124 is in a gradient distribution.\",\n \"In some embodiment, the energy gap of the second III-V compound layer 1124 is gradually decreased from top to middle, and is further gradually increased from middle to bottom.\",\n \"Namely, the portions of the second III-V compound layer 1124 close to the first III-V compound layer 1122 and close to the semiconductor substrate 1110 have a larger energy gap since the middle portion of the second III-V compound layer 1124 has a smaller energy gap.\",\n \"The infrared image sensor component includes at least one III-V compound layer on the semiconductor substrate, in which the portion of the III-V compound layer(s) uncovered by the patterns is utilized as active pixel region for detecting the incident infrared ray.\",\n \"The infrared image sensor component includes at least one transistor coupled to the active pixel region, and charge generated by the active pixel region is transmitted to the transistor.\",\n \"The III-V compound material has wider infrared wavelength coverage than the silicon, larger absorption coefficient in the infrared region than the silicon, and higher carrier mobility than the silicon, thus performance of the infrared image sensor component is improved accordingly.\",\n \"According to an aspect of the disclosure, an infrared image sensor component includes a semiconductor substrate, an active pixel region disposed on the semiconductor substrate for receiving an infrared ray, in which the active pixel region includes a III-V compound material, and a transistor coupled to the active pixel region.\",\n \"The transistor includes a gate and a source/drain stressor disposed adjacent to the gate.\",\n \"According to some embodiments, the active pixel region includes a first III-V compound layer and a second III-V compound layer on the first III-V compound layer.\",\n \"According to some embodiments, the first III-V compound layer and the second III-V compound layer have different energy gaps.\",\n \"According to some embodiments, an energy gap of the first III-V compound layer is narrower than an energy gap of the second III-V compound layer.\",\n \"According to some embodiments, the active pixel region further includes a third III-V compound layer on the second III-V compound layer.\",\n \"According to some embodiments, an energy gap of the second III-V compound layer is narrower than an energy gap of the third III-V compound layer.\",\n \"According to some embodiments, an energy gap of the second III-V compound layer is narrower than an energy gap of the first III-V compound layer.\",\n \"According to some embodiments, the active pixel region further includes a fourth III-V compound layer on the third III-V compound layer.\",\n \"According to some embodiments, an energy gap of the fourth III-V compound layer is wider than an energy gap of the third III-V compound layer.\",\n \"According to some embodiments, the active pixel region has an energy gap in a gradient distribution.\",\n \"According to an aspect of the disclosure, an infrared image sensor component includes a semiconductor substrate, a III-V compound layer on the semiconductor substrate, wherein the III-V compound layer has an energy gap in a gradient distribution, and a transistor coupled to the III-V compound layer.\",\n \"According to some embodiments, the energy gap of the III-V compound layer gradually decreases from a top of the III-V compound layer to a bottom of the III-V compound layer.\",\n \"According to some embodiments, the energy gap of the III-V compound layer gradually increases from a top of the III-V compound layer to a bottom of the III-V compound layer.\",\n \"According to some embodiments, the transistor includes a gate disposed on the III-V compound layer and a source and a drain disposed at opposite sides of the gate.\",\n \"The drain is coupled to the III-V compound layer.\",\n \"According to some embodiments, the infrared image sensor component further includes at least one pattern shielding the gate and the drain.\",\n \"According to some embodiments of the disclosure, a method of manufacturing an infrared image sensor component includes forming a first III-V compound layer on a semiconductor substrate, forming a second III-V compound layer on the first III-V compound layer, in which the second III-V compound layer has an energy gap different from that of the first III-V compound layer; and forming a transistor on the second III-V compound layer.\",\n \"According to some embodiments, the method further includes forming at least one pattern above the transistor, in which a portion of the second III-V compound layer is free from coverage by the pattern.\",\n \"According to some embodiments, forming the transistor includes forming a gate on the second III-V compound layer, and forming an ohmic metal contact adjacent to the gate and coupled to the second III-V compound layer.\",\n \"According to some embodiments, forming the transistor includes forming a gate on the second III-V compound layer, and forming a source/drain stressor adjacent to the gate and coupled to the second III-V compound layer.\",\n \"According to some embodiments, the method further includes forming an optical lens above the second III-V compound layer.\",\n \"The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure.\",\n \"Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein.\",\n \"Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870940"}}},{"rowIdx":4493680,"cells":{"text":{"kind":"list like","value":[["Systems And Processes For Treating Textiles With An Antimicrobial Agent","According to an aspect of the present disclosure, a method of treating a textile with an antimicrobial agent over a plurality of laundry cycles each including a wash cycle and a treatment cycle.","The method includes (a) receiving a textile in a wash system for a first laundry cycle, (b) initiating a wash cycle comprising a detergent, (c) initiating a post-detergent treatment cycle comprising dosing the textile with a solution having a predetermined concentration of an antimicrobial agent that comprises a metallic ion, and (c) repeating steps (a)-(c) for each of a plurality of additional laundry cycles.","The predetermined concentration is insufficient to achieve a predetermined antimicrobial efficacy for the textile due to the first laundry cycle alone but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of the first laundry cycle and one or more of the plurality of additional laundry cycles."],["1-25.","(canceled) 26.A method of reducing a microbial load in an inventory of textiles comprising a plurality of pieces at a healthcare facility, the method comprising: (a) receiving a first portion comprising a portion of the plurality of pieces of the inventory; (b) initiating a laundry cycle comprising a wash cycle and a treatment cycle, wherein the treatment cycle comprises a solution having a predetermined concentration of an antimicrobial agent that comprises a metallic ion; (c) receiving a subsequent portion of the inventory and repeating steps (b) in a subsequent laundry cycle for the subsequent portion, and (d) repeating step (c) until a predetermined amount of the pieces of the inventory have achieved the predetermined antimicrobial efficacy, thereby reducing the antimicrobial load of the inventory.","27.The method of claim 26, wherein a single laundry cycle is insufficient to achieve the predetermined antimicrobial efficacy.","28.The method of claim 26, wherein the subsequent portion includes a plurality of pieces from the first portion.","29.The method of claim 26, wherein the predetermined amount of the pieces comprises at least 50% of the inventory.","30.The method of claim 26, wherein the predetermined antimicrobial efficacy is achieved when the textile is infused with at least approximately 1 mg of metallic ion per kg of textile.","31.The method of claim 26, wherein the solution comprises water treated by deionization or reverse osmosis.","32-51.","(canceled)"],[" BACKGROUND Microbial contamination of textiles can contribute to the spread of infectious diseases, including healthcare associated infections, which are among the leading causes of preventable deaths in the United States and are associated with a substantial increase in health care costs each year.","In other instances, microbial contaminations can cause unsightly stains and unpleasant odors.","In one prior approach to providing a textile having antimicrobial properties, the textile is treated with an antimicrobial agent during a textile manufacturing process.","For example, the fibers of the textile are embedded or coated with antimicrobial agent during the manufacturing process.","However, the total amount of antimicrobial agent is fixed at the point of conversion of the fibers into a textile and the efficacy declines over time as the antimicrobial agent in the fabric is washed away when laundered and never restored.","Moreover, this approach has proven to be unsatisfactory to market participants.","In addition to the efficacy/performance issues noted above, these products require commercial linen users, such as hospitals and other health care delivery facilities, to make a large upfront capital investment to purchase a new, antimicrobial agent-impregnated, linen inventory and discard existing and otherwise useable inventory.","Further, the products may exhibit a soiled off-white discoloration appearance, may be uncomfortable to the touch, and are known to be difficult to launder, dry and press verses traditional linens."],[" SUMMARY In one aspect, the disclosure is directed to a method of treating a textile with an antimicrobial agent over a plurality of laundry cycles including a wash cycle and a treatment cycle.","The method includes the steps of (a) receiving a textile in a wash system for a first laundry cycle, (b) initiating a wash cycle including a detergent, (c) initiating a post-detergent treatment cycle including dosing the textile with a solution having a predetermined concentration of an antimicrobial agent that includes a metallic ion, and repeating steps (a)-(c) for each of a plurality of additional laundry cycles, wherein the predetermined concentration is insufficient to achieve a predetermined antimicrobial efficacy for the textile due to the first laundry cycle alone but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of the first laundry cycle and one or more of the plurality of additional laundry cycles.","The treatment cycle may be a rinse cycle.","The textile may include an inventory of plurality of pieces.","The metallic ion may be a silver ion.","In various embodiments of the disclosure, the predetermined antimicrobial efficacy is achieved when the textile is infused with at least approximately 0.6 mg of metallic ion per kg of textile.","The plurality of laundry cycles may include at least three cycles to provide the predetermined concentration in the textile.","The predetermined concentration is such that a content of the antimicrobial agent infused into the textile is less than approximately 0.5 mg of metallic ion per kg of textile in response to steps (a)-(c) performed for the first laundry cycle.","The predetermined concentration is approximately 0.5 mg to approximately 50 mg of antimicrobial agent per kilogram of textile.","In an example method of the disclosure, the textile is dosed with the antimicrobial solution by diluting a concentrated metal ion solution in a container of the wash system containing the textile.","The diluting is accomplished by transferring the concentrated metal ion solution to the container at a rate of approximately 1 ml/sec to 30 ml/sec.","The concentrate maybe transferred over a dosing period of 15 seconds to 120 seconds.","In some instance, the dosing may include different or several dosing rates, for example, transfer rates between about 5 ml/min and about 1000 ml/min.","Another aspect of the disclosure is directed to method for treating a textile with an antimicrobial agent wherein the quality of the water used in the method is taking into consideration.","The method includes (a) measuring a quality of a water source for a washing system, (b) providing, in a first container, a first solution having a first predetermined liquid concentration of an antimicrobial agent that includes a metallic ion, such as a silver ion; (c) determining an amount of the first solution to transfer from the first container to the second container based on the measured quality of the water; (d) transferring, from the first container to the second container, the determined amount of the first solution to provide a second solution having a second liquid concentration of the antimicrobial agent in the second container; and (e) submerging the textile in the second solution at least one of prior to, during or after step (d) to infuse the textile with the antimicrobial agent.","In one embodiment, steps (a)-(e) may be performed for an initial laundry cycle and steps (b), (d), and (e) are repeating in a plurality of subsequent laundry cycles, In the method, the second solution may include the water from the water source and the first solution.","The method may also include providing an amount of the water from the water source to the second container prior to transferring the first solution from the first container to the second container, and measuring the quality of water using a sensor located in the second container.","The determined amount of the first solution may be inversely related to the measured quality of the water such that a greater amount of the first solution is determined in response to a measurement of poor quality of water than is determined in response to a measurement of good quality of water.","For example, the first predetermined liquid concentration may be approximately 200 PPM to approximately 5000 PPM.","Also, the amount of the first solution may be determined such that the second concentration of the second solution is approximately 7.6 PPM (aq) to approximately 115 PPM (aq) responsive to the measured quality of water having a Relative Water Quality (RWQ) number of approximately 0 RWQ to approximately 5 RWQ.","The submerging the textile in the second solution may include agitating the textile for between 30 seconds and 120 seconds.","A further aspect of the disclosure is a method of reducing a microbial load in an inventory of textiles comprising a plurality of pieces at a healthcare facility.","The method includes (a) receiving a first portion including a portion of the plurality of pieces of the inventory in a wash basin for a laundry cycle; (b) initiating the laundry cycle including a wash cycle and a treatment cycle, wherein the treatment cycle includes a solution having a predetermined concentration of an antimicrobial agent that comprises a metallic ion; (c) receiving a subsequent portion of the inventory and repeating steps (a) and (b) in a subsequent laundry cycle for the subsequent portion, and repeating step (c) until a predetermined amount of the pieces of the inventory have achieved the predetermined antimicrobial efficacy, thereby reducing the antimicrobial load of the inventory.","In various embodiments, the subsequent portion may include a plurality of pieces from the first portion.","The predetermined amount of the pieces may include at least 50% of the inventory.","In other embodiments, a single laundry cycle is insufficient to achieve the predetermined antimicrobial efficacy.","The predetermined antimicrobial efficacy may be achieved when the textile is infused with at least approximately 1 mg of metallic ion per kg of textile.","In yet another aspect, the disclosure is directed to a method of protecting individuals in contact with healthcare facility linen inventory from a healthcare acquired infection.","The method includes (a) receiving, in one or more batches at a healthcare facility, an inventory of washable, non-disposable textiles that contact patients and healthcare workers; (b) washing each batch using a detergent; and (c) for each batch, after washing the batch, treating the batch with a solution including a predetermined liquid concentration of a metallic ion to reduce the microbial load on the textiles in the batch and improve a resistance of the textiles in the batch to microbial contamination responsible for a healthcare acquired infections.","The predetermined concentration may be such that a content of the antimicrobial agent infused into each textile is less than approximately 0.5 mg 0.75 mg of metallic ion per kg of textile in response to (c) performed during an initial laundering process and the method further includes repeating steps (a)-(c) at least once to incrementally increase the content of the antimicrobial agent infused into each textile to greater than 1 mg of metallic ion per kg of textile.","The solution may include water treated by deionization or reverse osmosis.","In various embodiments, the method may include treating clean textiles that have not entered the healthcare facility.","Textiles may be a mixture of clean textiles and soiled textiles.","The predetermined concentration of metallic ion may be achieved in a single treatment or the predetermined concentration of the metallic ion may be achieved after two or more treatments.","Still further, the disclosure is directed to a method of infusing textiles with an antimicrobial agent.","The method includes (a) providing a tunnel washer having an intake, a discharge, and a plurality of modules that segment an interior of the tunnel washer between the intake and the discharge, wherein the plurality of modules include an initial module at the intake a final module at the discharge; (b) moving the textile from the intake to the discharge through the plurality of modules; (c) washing the textile with a detergent at a wash module of the plurality of modules; (d) after washing the textile at the first module, rinsing the textile at a rinse module of the plurality of modules; and (e) treating the textile with a solution having a predetermined concentration of an antimicrobial agent at a treatment module, wherein the antimicrobial agent includes a metallic ion.","The method may further include (f) extracting excess fluid, including at least a portion of the solution, from the textile after the treatment module; and (g) providing at least a portion of the extracted excess fluid to at least one of the rinse module or the wash module for processing a subsequent textile.","The solution may include water treated by distillation, deionization or reverse osmosis.","Even further, the disclosure is directed to a method of reducing the amount of silver required to reduce the antimicrobial burden in a textile subjected to a repeated wash cycles.","The method includes, following a plurality of the wash cycles, treating the textile in a treatment cycle including a solution having predetermined concentration of an antimicrobial agent that includes a metallic ion, wherein the predetermined concentration is insufficient to achieve a predetermined antimicrobial efficacy for the textile in a first treatment cycle but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of a first treatment cycle and one or more of the plurality of additional treatment cycles.","Another aspect of the disclosure is directed to a method for detecting the presence of silver in a textile.","The method includes dispensing a first solution and the second solution onto separate areas of the textile and comparing the color of the dispensed first solution and the dispensed second solution.","The first solution includes Cadion B, a buffer sufficient to maintain a pH in the range of from about 8 to about 10, and a surfactant.","The second solution comprises Cadion B, a buffer sufficient to maintain a pH in the range of from about 8 to about 10, a surfactant, and a complexing agent, wherein formation of a complex of the complexing agent and silver is a more favorable than formation of a complex of Cadion B and silver.","One or both solutions may also include a masking agent, such as ethylenediaminetetraacetic acid (EDTA) or cyclohexanediaminetetraacetic acid (CDTA).","One or both solutions may also include a water-miscible organic solvent, such as 1-methyl-2-pyrrolidinone.","The complexing agent may be sodium thiosulfate.","The surfactant may be TWEEN® 20 or TRITON™ X-100.The buffer may include one or more of potassium tetraborate, citric acid, and sodium citrate."],["FIELD The disclosure is directed to systems and methods for treating textiles with antimicrobial agents.","BACKGROUND Microbial contamination of textiles can contribute to the spread of infectious diseases, including healthcare associated infections, which are among the leading causes of preventable deaths in the United States and are associated with a substantial increase in health care costs each year.","In other instances, microbial contaminations can cause unsightly stains and unpleasant odors.","In one prior approach to providing a textile having antimicrobial properties, the textile is treated with an antimicrobial agent during a textile manufacturing process.","For example, the fibers of the textile are embedded or coated with antimicrobial agent during the manufacturing process.","However, the total amount of antimicrobial agent is fixed at the point of conversion of the fibers into a textile and the efficacy declines over time as the antimicrobial agent in the fabric is washed away when laundered and never restored.","Moreover, this approach has proven to be unsatisfactory to market participants.","In addition to the efficacy/performance issues noted above, these products require commercial linen users, such as hospitals and other health care delivery facilities, to make a large upfront capital investment to purchase a new, antimicrobial agent-impregnated, linen inventory and discard existing and otherwise useable inventory.","Further, the products may exhibit a soiled off-white discoloration appearance, may be uncomfortable to the touch, and are known to be difficult to launder, dry and press verses traditional linens.","SUMMARY In one aspect, the disclosure is directed to a method of treating a textile with an antimicrobial agent over a plurality of laundry cycles including a wash cycle and a treatment cycle.","The method includes the steps of (a) receiving a textile in a wash system for a first laundry cycle, (b) initiating a wash cycle including a detergent, (c) initiating a post-detergent treatment cycle including dosing the textile with a solution having a predetermined concentration of an antimicrobial agent that includes a metallic ion, and repeating steps (a)-(c) for each of a plurality of additional laundry cycles, wherein the predetermined concentration is insufficient to achieve a predetermined antimicrobial efficacy for the textile due to the first laundry cycle alone but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of the first laundry cycle and one or more of the plurality of additional laundry cycles.","The treatment cycle may be a rinse cycle.","The textile may include an inventory of plurality of pieces.","The metallic ion may be a silver ion.","In various embodiments of the disclosure, the predetermined antimicrobial efficacy is achieved when the textile is infused with at least approximately 0.6 mg of metallic ion per kg of textile.","The plurality of laundry cycles may include at least three cycles to provide the predetermined concentration in the textile.","The predetermined concentration is such that a content of the antimicrobial agent infused into the textile is less than approximately 0.5 mg of metallic ion per kg of textile in response to steps (a)-(c) performed for the first laundry cycle.","The predetermined concentration is approximately 0.5 mg to approximately 50 mg of antimicrobial agent per kilogram of textile.","In an example method of the disclosure, the textile is dosed with the antimicrobial solution by diluting a concentrated metal ion solution in a container of the wash system containing the textile.","The diluting is accomplished by transferring the concentrated metal ion solution to the container at a rate of approximately 1 ml/sec to 30 ml/sec.","The concentrate maybe transferred over a dosing period of 15 seconds to 120 seconds.","In some instance, the dosing may include different or several dosing rates, for example, transfer rates between about 5 ml/min and about 1000 ml/min.","Another aspect of the disclosure is directed to method for treating a textile with an antimicrobial agent wherein the quality of the water used in the method is taking into consideration.","The method includes (a) measuring a quality of a water source for a washing system, (b) providing, in a first container, a first solution having a first predetermined liquid concentration of an antimicrobial agent that includes a metallic ion, such as a silver ion; (c) determining an amount of the first solution to transfer from the first container to the second container based on the measured quality of the water; (d) transferring, from the first container to the second container, the determined amount of the first solution to provide a second solution having a second liquid concentration of the antimicrobial agent in the second container; and (e) submerging the textile in the second solution at least one of prior to, during or after step (d) to infuse the textile with the antimicrobial agent.","In one embodiment, steps (a)-(e) may be performed for an initial laundry cycle and steps (b), (d), and (e) are repeating in a plurality of subsequent laundry cycles, In the method, the second solution may include the water from the water source and the first solution.","The method may also include providing an amount of the water from the water source to the second container prior to transferring the first solution from the first container to the second container, and measuring the quality of water using a sensor located in the second container.","The determined amount of the first solution may be inversely related to the measured quality of the water such that a greater amount of the first solution is determined in response to a measurement of poor quality of water than is determined in response to a measurement of good quality of water.","For example, the first predetermined liquid concentration may be approximately 200 PPM to approximately 5000 PPM.","Also, the amount of the first solution may be determined such that the second concentration of the second solution is approximately 7.6 PPM (aq) to approximately 115 PPM (aq) responsive to the measured quality of water having a Relative Water Quality (RWQ) number of approximately 0 RWQ to approximately 5 RWQ.","The submerging the textile in the second solution may include agitating the textile for between 30 seconds and 120 seconds.","A further aspect of the disclosure is a method of reducing a microbial load in an inventory of textiles comprising a plurality of pieces at a healthcare facility.","The method includes (a) receiving a first portion including a portion of the plurality of pieces of the inventory in a wash basin for a laundry cycle; (b) initiating the laundry cycle including a wash cycle and a treatment cycle, wherein the treatment cycle includes a solution having a predetermined concentration of an antimicrobial agent that comprises a metallic ion; (c) receiving a subsequent portion of the inventory and repeating steps (a) and (b) in a subsequent laundry cycle for the subsequent portion, and repeating step (c) until a predetermined amount of the pieces of the inventory have achieved the predetermined antimicrobial efficacy, thereby reducing the antimicrobial load of the inventory.","In various embodiments, the subsequent portion may include a plurality of pieces from the first portion.","The predetermined amount of the pieces may include at least 50% of the inventory.","In other embodiments, a single laundry cycle is insufficient to achieve the predetermined antimicrobial efficacy.","The predetermined antimicrobial efficacy may be achieved when the textile is infused with at least approximately 1 mg of metallic ion per kg of textile.","In yet another aspect, the disclosure is directed to a method of protecting individuals in contact with healthcare facility linen inventory from a healthcare acquired infection.","The method includes (a) receiving, in one or more batches at a healthcare facility, an inventory of washable, non-disposable textiles that contact patients and healthcare workers; (b) washing each batch using a detergent; and (c) for each batch, after washing the batch, treating the batch with a solution including a predetermined liquid concentration of a metallic ion to reduce the microbial load on the textiles in the batch and improve a resistance of the textiles in the batch to microbial contamination responsible for a healthcare acquired infections.","The predetermined concentration may be such that a content of the antimicrobial agent infused into each textile is less than approximately 0.5 mg 0.75 mg of metallic ion per kg of textile in response to (c) performed during an initial laundering process and the method further includes repeating steps (a)-(c) at least once to incrementally increase the content of the antimicrobial agent infused into each textile to greater than 1 mg of metallic ion per kg of textile.","The solution may include water treated by deionization or reverse osmosis.","In various embodiments, the method may include treating clean textiles that have not entered the healthcare facility.","Textiles may be a mixture of clean textiles and soiled textiles.","The predetermined concentration of metallic ion may be achieved in a single treatment or the predetermined concentration of the metallic ion may be achieved after two or more treatments.","Still further, the disclosure is directed to a method of infusing textiles with an antimicrobial agent.","The method includes (a) providing a tunnel washer having an intake, a discharge, and a plurality of modules that segment an interior of the tunnel washer between the intake and the discharge, wherein the plurality of modules include an initial module at the intake a final module at the discharge; (b) moving the textile from the intake to the discharge through the plurality of modules; (c) washing the textile with a detergent at a wash module of the plurality of modules; (d) after washing the textile at the first module, rinsing the textile at a rinse module of the plurality of modules; and (e) treating the textile with a solution having a predetermined concentration of an antimicrobial agent at a treatment module, wherein the antimicrobial agent includes a metallic ion.","The method may further include (f) extracting excess fluid, including at least a portion of the solution, from the textile after the treatment module; and (g) providing at least a portion of the extracted excess fluid to at least one of the rinse module or the wash module for processing a subsequent textile.","The solution may include water treated by distillation, deionization or reverse osmosis.","Even further, the disclosure is directed to a method of reducing the amount of silver required to reduce the antimicrobial burden in a textile subjected to a repeated wash cycles.","The method includes, following a plurality of the wash cycles, treating the textile in a treatment cycle including a solution having predetermined concentration of an antimicrobial agent that includes a metallic ion, wherein the predetermined concentration is insufficient to achieve a predetermined antimicrobial efficacy for the textile in a first treatment cycle but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of a first treatment cycle and one or more of the plurality of additional treatment cycles.","Another aspect of the disclosure is directed to a method for detecting the presence of silver in a textile.","The method includes dispensing a first solution and the second solution onto separate areas of the textile and comparing the color of the dispensed first solution and the dispensed second solution.","The first solution includes Cadion B, a buffer sufficient to maintain a pH in the range of from about 8 to about 10, and a surfactant.","The second solution comprises Cadion B, a buffer sufficient to maintain a pH in the range of from about 8 to about 10, a surfactant, and a complexing agent, wherein formation of a complex of the complexing agent and silver is a more favorable than formation of a complex of Cadion B and silver.","One or both solutions may also include a masking agent, such as ethylenediaminetetraacetic acid (EDTA) or cyclohexanediaminetetraacetic acid (CDTA).","One or both solutions may also include a water-miscible organic solvent, such as 1-methyl-2-pyrrolidinone.","The complexing agent may be sodium thiosulfate.","The surfactant may be TWEEN® 20 or TRITON™ X-100.The buffer may include one or more of potassium tetraborate, citric acid, and sodium citrate.","BRIEF DESCRIPTION OF THE DRAWINGS FIG.","1 is a simplified block diagram of an example washer system according to aspects of the disclosure.","FIG.","2 is a chart illustrating an example model for determining an antimicrobial dosage based on measured water quality according to aspects of the disclosure.","FIG.","3 is a flowchart of an example process for treating textiles with an antimicrobial agent according to aspects of the disclosure.","FIG.","4 is a flowchart of another example process for treating textiles with an antimicrobial agent according to aspects of the disclosure.","FIG.","5 is a flowchart of yet another example process for treating textiles with an antimicrobial agent according to aspects of the disclosure.","FIG.","6 is a flowchart of a further example process for treating textiles with an antimicrobial agent according to aspects of the disclosure.","FIG.","7 is a flowchart of another example process for treating textiles with an antimicrobial agent according to aspects of the disclosure.","FIG.","8 shows the average CFU/plate for aerobic bacterial colonies before (control) and after silver application.","Plates had a surface area of 28.27 cm2.FIG.","9 shows the average CFU/plate for S. aureus colonies before (control) and after silver application.","Plates had a surface area of 28.27 cm2.FIG.","10 shows the average CFU/plate for MRSA colonies before (control) and after silver application.","Plates had a surface area of 28.27 cm2.While the invention is susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the Figures and will be described in detail herein.","It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed.","Rather, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.","It should be understood that other embodiments may include more or less of each element shown in a given Figure.","Further, some of the illustrated elements may be combined or omitted.","Yet further, an example embodiment may include elements that are not illustrated in the Figures.","DESCRIPTION The following description describes various features and functions of the disclosed systems and methods with reference to the accompanying figures.","In the Figures, similar symbols typically identify similar components, unless context dictates otherwise.","The illustrative systems and methods described herein are not meant to be limiting.","It will be readily understood that certain aspects of the disclosed systems and methods can be arranged and combined in a wide variety of different configurations, all of which are contemplated herein.","According to aspects of the disclosure, systems and processes are described and illustrated for treating textiles with an antimicrobial agent.","The terms fabric, linen, and textile are used interchangeably herein.","Aspects of the disclosure may be described in the context of a single textile for ease of description; however, it should be understood that such aspects can be extended to include processes and devices in the context of multiple textiles such as an inventory of textiles having multiple pieces.","The systems and processes for treating textiles with the antimicrobial agent can mitigate healthcare associated infections (HAIs).","HAIs are infections that people acquire while they are receiving treatment in a health care setting for other ailments.","HAIs may be caused by any infectious agent, including bacteria, fungi, and viruses, as well as other less common types of pathogens.","HAIs can be acquired anywhere health care is delivered, including inpatient acute care hospitals, outpatient settings such as ambulatory surgical centers and end-stage renal disease facilities, and long-term care facilities such as nursing homes and rehabilitation centers.","In addition, those persons in contact with soiled laundry from a healthcare facility, including care givers and persons in the laundry supply chain, are at risk of infection.","The disclosure is also related to treating textiles from other sources other than health care facilities.","For example, garments worn by sports teams are known for harboring infection agents.","In essence, the devices and method of the disclosure can be used to treat textiles from any source that could benefit from lowering of the microbial content of the textiles.","Accordingly, one aspect of the disclosure is directed to method of treating a textile with an antimicrobial agent over a plurality of laundry cycles including a wash cycle and a post-wash/post-detergent treatment cycle that provides for dosing the textile with a solution having a predetermined concentration of an antimicrobial agent that includes a metallic ion, such as for example a silver ion.","In this aspect, the predetermined concentration of the agent is insufficient to achieve a predetermined antimicrobial efficacy for the textile due to the first laundry cycle alone but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of the first laundry cycle and one or more additional laundry cycles.","The laundry cycle may include additional cycles, for example a prewash cycle, a rinse cycle, or the treatment cycle may be combined with the rinse cycle.","In an example method of the disclosure, the textile is dosed with the antimicrobial solution by diluting a concentrated metal ion solution in a container of the wash system containing the textile.","The diluting is accomplished by transferring the concentrated metal ion solution to the container at a rate of approximately 1 ml/sec to 30 ml/sec.","The concentrate maybe transferred over a dosing period of 15 seconds to 120 seconds.","In some instance, the dosing may include different or several dosing rates, for example, transfer rates between about 5 ml/min and about 1000 ml/min.","The method for treating a textile with an antimicrobial agent may include consideration of the water quality used in an antimicrobial solution and/or the treatment bath.","Accordingly, the quality of a water source for the washing system may be determined, for example, in association with providing a first solution having a first predetermined liquid concentration of an antimicrobial agent that includes a metallic ion to a first container.","For example, a concentrated silver ion solution may be added to a first container to create a first solution.","The amount of the first solution that is transferred from the first container to a second container to create a second solution, for instance the treatment bath, is determined based on the measured quality of the water.","The determined amount of the first solution is used to create the second solution with a second liquid concentration of the antimicrobial agent in the second container.","The textile is submerged in the second solution (or precursor) prior to, during and/or after the solution is created in or provided to the second container.","For example, the first solution is added to a rinse solution that includes the textiles, or the rinse solution may be replaced in the container with the second solution.","Water from the water source may be provided to the second container prior to transferring the first solution from the first container to the second container.","A sensor may be located in the second container to measure the quality of the water provided in the second container.","When water quality is consistent, the determination and use of the water quality in a first laundry cycle may be used in second or subsequent cycles.","The determined amount of the first solution may be inversely related to the measured quality of the water such that a greater amount of the first solution for use in the second solution is determined in response to a measurement of poor quality of water than is determined in response to a measurement of good quality of water.","In some embodiment, the second solution may include the water from the water source and the first solution.","The amount of the first solution may be determined such that the second concentration of the second solution is approximately 7.6 PPM (aq) to approximately 115 PPM (aq) responsive to the measured quality of water.","For example, the first predetermined liquid concentration may be approximately 200 PPM to approximately 5000 PPM.","At least one of the first solution or the second solution may include water treated by distillation, deionization or reverse osmosis.","The time that the textile spends in the second solution depends on a number of factors including concentration of anti-microbial agent in the solution, water quality, and textile type.","From a commercial perspective, the textile should spend as little as time as possible to achieve the desired level of antimicrobial agent in the textile.","For example, the textile may spend between 30 seconds and 120 seconds, which may include agitation.","Another aspect of the disclosure involves a method of reducing a microbial load in an inventory of textiles including a plurality of pieces at a healthcare facility.","Pieces refers to individual gowns, sheet, towels, uniforms, lab coats and other textiles associated with the facility.","The method receiving a first portion of the plurality of pieces of the inventory in a wash basin for a laundry cycle, which includes a wash cycle and a treatment cycle.","The treatment cycle includes submerging the textiles in a solution having a predetermined concentration of an antimicrobial agent that includes a metallic ion, for example a silver ion.","The method also includes receiving a subsequent portion of the inventory, which may include pieces from the first portion of the inventory, and repeating step laundry cycle.","Regular treatment of portions of a textile inventory will result in all, almost all, most or many of the pieces of the inventory achieving an antimicrobial efficacy, thereby reducing the antimicrobial load of the inventory.","In general, a predetermined number of pieces or percentage of the inventory can be defined as requiring a predetermined amount of antimicrobial efficacy.","For example, regular treatment of portions of an inventory can result in at least 50%, at least 75%, at least 85%, at least 95%, at least 99%, or 100% of all of the pieces of textile in inventory achieving a predetermined level of antimicrobial efficacy.","In one example the predetermined antimicrobial efficacy may be achieved when the textile is infused with at least approximately 1 mg of metallic ion per kg of textile.","Methods of the disclosure require the use of the antimicrobial solution, which may be supplied to the laundry facility in several ways.","A supplier can deliver pre-prepared dilute solutions for direct addition to a treatment cycle, or the supplier can deliver a concentrate that may require dilution before addition to a treatment cycle.","In addition, solutions may be created on-site using a variety of known methods for creating metallic ion solutions.","Suppliers of wash chemistry often provide instructions, hardware and software for implementing laundry cycles.","Accordingly, in one aspect, the disclosure is directed to a method for treating a textile with an antimicrobial agent that includes providing an antimicrobial solution to a laundry facility and instructing the facility on a method for treating the textiles as described herein.","For instance, the instruction may include the steps for treating a textile with an antimicrobial agent over a plurality of laundry cycles including a wash cycle and a post-wash/post-detergent treatment cycle that provides for dosing the textile with a solution having a predetermined concentration of an antimicrobial agent that includes a metallic ion, such as for example a silver ion.","In this aspect, the instructions may provide the parameters for a predetermined concentration of the agent in the treatment cycle that is insufficient to achieve a predetermined antimicrobial efficacy for the textile due to the first laundry cycle alone but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of the first laundry cycle and one or more additional laundry cycles.","The instructions may also include information regarding rates of addition of ion solutions to the treatment bath.","The instructions can include steps for monitoring water quality associated with a process for treating textiles with an antimicrobial agent.","As an example, the disclosure is directed to the delivery of an antimicrobial agent to a laundry facility with instructions for treating textiles to a with the antimicrobial agent, wherein the instructions include steps for measuring the quality of the facilities water source and for adjusting the concentration of the antimicrobial agent in a treatment cycle based upon the quality of the water.","The instructions may also include steps for treating an inventory of laundry from a healthcare facility, wherein the steps include receiving portions of the healthcare facilities laundry inventory and processing those portions until a predetermined number of pieces of the inventory achieve a predetermined antimicrobial efficacy.","The instructions may include the predetermined number of pieces and the predetermined efficacy.","The disclosure is applicable to all types of laundry systems.","For example, the systems and processes of the disclosure can be utilized to treat an inventory of washable, non-disposable textiles in a batch by batch process.","For instance, batch-type laundry systems are described in U.S. Pat.","No.","8,641,967, U.S. Patent Appl.","Publication No.","2015/0159314, Patent Appl.","Publication No.","2015/0159319, Patent Appl.","Publication No.","2015/0047718, and U.S. application Ser.","No.","13/968,084 filed Aug. 15, 2013, which are incorporated by reference in their entirety.","In an exemplary aspect, a washer system includes a continuous batch washer (i.e., tunnel washer) that implements or improves antimicrobial treatment of a textile during a laundry cycle.","The tunnel washer includes an intake, a discharge, and a plurality of modules that segment an interior of the tunnel washer between the intake and the discharge.","The plurality of modules include at least one wash module in which the textile is washed with a detergent and at least one rinse module in which the textile is rinsed after being washed.","A rinse module or a last module before the discharge may be a treatment module in which the textile is treated with an antimicrobial agent.","By treating the textile with the antimicrobial agent in the rinse module or a last module before the discharge, greater amounts of antimicrobial agent are retained by the textile upon completion of the laundry cycle.","This is, in part, because treating the textile in the rinse module or a last module mitigates leaching of antimicrobial agent content from the textile, which would otherwise occur if the textile was treated before or during a wash cycle.","Further advantage may be obtained by treating the textile with the antimicrobial agent in a last module after a rinse cycle to ensure that some of antimicrobial agent is not rinsed away.","In some additional or alternative aspects of the disclosure, after treating the textile, the textile is subjected to an extraction device operable to extract fluids, for example rinse water, from the textile.","The extracted fluids may contain excess antimicrobial agent that was not infused into the textile.","Advantageously, the washer system may recirculate the extracted fluids back into the tunnel washer so as to substantially reduce (or eliminate) wasted antimicrobial agent.","Additionally, recirculating the extracted fluids reduces the amount of antimicrobial agent content in waste water effluent, thus mitigating the extent to which waste water effluent needs to be treated to comply with environmental regulations.","In some implementations, at least a portion of the extracted fluid is provided to a rinse module.","In additional or alternative implementations, at least a portion of the extracted fluid is provided to other areas of the tunnel washer such as, for example, the intake or a pre-wash module.","In further additional or alternative implementations, at least a portion of the extracted fluid is provided to the treatment module.","In further additional or alternative aspects of the disclosure, the washer system can measure a quality of the water and, based on the measured water quality, determine a dosage or concentration of antimicrobial agent in a treatment cycle for treating the textile.","The washer system may then controllably adjust an amount of antimicrobial agent in the treatment cycle to achieve the determined dosage and treat the textile.","In this way, problems associated with poor or changed water quality can be mitigated during treatment of the textile from batch to batch, day to day, and so on.","According to additional or alternative aspects of the disclosure, a process for treating a textile with an antimicrobial agent is provided.","In particular, a process is provided for incrementally loading a textile to an efficacious antimicrobial content level over multiple laundry cycles.","This approach provides substantial cost savings over the useful life of the textile as compared to existing antimicrobial treatment approaches.","For instance, the typical useful life of a linen processed in a commercial laundry may be less than 35 wash cycles.","Over the life of the linen, the process requires less antimicrobial agent to maintain the antimicrobial efficacy than other approaches.","Referring now to FIG.","1, a simplified block diagram of an example washer system 100 is illustrated according aspects of the disclosure.","As shown in FIG.","1, the washer system 100 includes a tunnel washer 112 having an intake 114 at a first end and a discharge 116 at a second end.","The intake 114 receives one or more textiles to be washed and treated.","In one example, the intake 114 can be in the form of a hopper that can receive a batch of textiles into the tunnel washer 112.The discharge 116 facilitates transferring clean, treated textiles from the tunnel washer 112 to a fluid-extraction device 118.In one example, the discharge 116 can be in the form of a slide or a chute that transports the washed textiles towards the fluid-extraction device 118.In another example, the discharge 116 can include a receptacle for holding the washed textiles until the fluid-extraction device 118 is ready to receive the washed textiles.","The fluid-extraction device 118 can be, for example, a centrifugal extractor and/or a mechanical press.","The tunnel washer 112 includes an outer housing 117, which defines an interior of the tunnel washer 112.The interior of the tunnel washer 112 is segmented by a plurality of modules 120A-120F between the intake 114 and the discharge 116.In the illustrated example, the modules 120A-120F are formed as a plurality of rotating drums separated from each other by lateral side walls.","During operation, the textiles to be washed and treated sequentially move through the modules 120A-120F in the direction of arrow A, entering the outer housing 117 at the intake 114 and exiting the outer housing 117 at the discharge 116.To do so, the modules 120A-120F transfer textiles from one module to the next by a top transfer arrangement and/or a bottom transfer arrangement.","For example, the drums may have inlets and outlets on opposing sides of the drums so that the textiles may be transferred through the outlet in one drum into the inlet in the next drum.","In some implementations, each drum can further include a scoop-like member mounted within the drum to facilitate transferring the textiles via the inlets and outlets.","The scoop-like members can be configured such that oscillating the drums within a limited range of rotation does not transfer the textiles between drums, but instead imparts mechanical action to the textiles to promote the wash and treatment process.","However, when the drums are rotated beyond the limited range of rotation, the scoop-like members receive and transport the textiles to the outlets of the drums.","In this way, the textiles entering the tunnel washer 112 at the intake 114 are transported through each of the modules 120A-120F in sequence to the discharge 116.Although the modules 120A-120F are described as rotating drums in the above example, it should be understood that the modules 120A-120F can be formed in other ways such as, for example, by an Archimedean screw within the outer housing 117.Additionally, it should be understood that the modules 120A-120F can have a single-drum construction (i.e., a single drum containing both the fluids and the textiles), a double-drum construction (i.e., each module has a stationary, exterior drum to hold fluids and a rotating, perforated inner drum to move textiles in the fluids), or a combination of single- and double-drum constructions.","In practice, the tunnel washer 112 can include one or more pre-wash modules, one or more main wash modules, one or more rinse modules, one or more neutralization modules, and/or one or more treatment modules according to aspects of the disclosure.","The pre-wash module(s) define a pre-wash zone of the tunnel washer 112, the main wash module(s) define a main wash zone, the rinse module(s) define a rinse zone, the neutralization module(s) define a neutralization zone, and the treatment module(s) define a treatment zone of the tunnel washer 112.The number of modules utilized to form these zones in the tunnel washer 112 may vary in different example implementations.","In the illustrated example, the tunnel washer 112 has a pre-wash zone provided by the intake 114 as described in further detail below.","The pre-wash zone facilitates initial wetting of the textiles and, optionally, applying heat and wash chemistry early in the process to remove soil from the textiles prior to entering the main wash zone.","The tunnel washer 112 has a main wash zone formed by a first module 120A, a second module 120B, and a third module 120C.","The modules 120A-120C of the main wash zone may apply heat, steam, wash agents (e.g., a detergent, alkali, bleach, etc.","), and/or mechanical action to facilitate removing soil from the textiles.","The tunnel washer 112 next includes a rinse zone formed by a fourth module 120D and a fifth module 120E.","The modules 120D-120E of the rinse zone facilitate removing residual wash agents carried over during transfer of the textiles from the main wash zone.","The tunnel washer 112 lastly includes a treatment zone formed by a sixth module 120F in which the textiles are treated with the antimicrobial agent.","By treating the textile with the antimicrobial agent in the last module 120F before the discharge 116, greater amounts of antimicrobial agent are retained by the textile upon completion of the laundry cycle.","This is, in part, because treating the textile in the last module 120F mitigates leaching of antimicrobial agent content from the textile, which would otherwise occur if the textile was further washed or rinsed after being treated with the antimicrobial agent.","In other embodiments, the rinse module and treatment module are combined, such that rinsing the textiles and treating the textiles with an antimicrobial agent occurs in the same module or modules.","Indeed, in some aspects, the solution used to treat the textiles also performs the functions of a rinse to remove residual wash agents from the textiles.","Although the illustrated example has six modules, it should be understood that the tunnel washer 112 can have more or fewer modules according to alternative aspects of the disclosure.","For instance, in some alternative examples, the tunnel washer 112 can have eight to twelve modules.","It also should be understood that, in some alternative examples, the pre-wash functions can be provided in one or more pre-wash module(s) instead of the intake 114.And it should be understood that, in some alternative examples, the tunnel washer 112 can include a neutralization zone, between the rinse zone and the treatment zone, to facilitate neutralizing residual alkali, detergent, and/or bleach carried over during transfer of the textiles from the rinse zone.","In some examples, the neutralization zone may be further utilized to apply a softener and/or starch to the textiles.","To facilitate adding, removing, and/or transferring water and chemicals in the modules 120A-120F, the tunnel washer 112 can include one or more drains, water sources, chemical sources, fluid tanks, flow lines, valves, pumps, nozzles, and/or weir plates.","In the illustrated example, the washer system 100 includes a fresh water source 122, a polished water source 124, and a tempered water source 126.The fresh water source 122 can provide, for example, cold fresh water (e.g., water supplied by a municipality).","The polished water source 124 can provide water treated by one or more filtration processes such as, for example, a deionization process, a reverse osmosis process, a granulated activated carbon (GAC) filtration process, a distillation process, or a combination thereof.","The tempered water source 126 can provide water that has been heated, for example, to a temperature between approximately 85 degrees Fahrenheit and approximately 100 degrees Fahrenheit (i.e., between approximately 29 degrees Celsius and 43 degrees Celsius).","Also, in the illustrated example, a flow line 130 provides fresh water from the fresh water source 122 to the fifth module 120E, a flow line 132 provides polished water from the polished water source 124 to the fifth module 120E, and a flow line 134 provides tempered water from the tempered water source 126 to the fifth module 120E.","Although the flow lines 130, 132, 134 are illustrated as separate from one another, one or more of the flow lines 130, 132, 134 may be coupled so as to provide a mixture of fresh water, polished water, and/or tempered water to the fifth module 120E in other examples.","In general, the amount and/or composition of fluid supplied by the sources 122, 124, 126 at a given time may be based on various criteria such as, for example, a measurement of an amount of total dissolved solids (TDS), a hardness, an anions species, etc.","by one or more sensors (not shown) in one or more modules 120A-120E.","To supply the modules 120A-120D with fluids, the tunnel washer 112 counterflows fluids from the fifth module 120E towards the intake 114.In this way, the textiles continuously encounter cleaner fluids as the textiles are progressed through the tunnel washer 112 from the intake 114 to the discharge 116.Depending on the construction of the modules 120A-120E, the tunnel washer 112 may transfer fluids by direct counterflow (e.g., fluid flowing through or over lateral side walls due to gravity) and/or indirect counterflow (e.g., via external flow lines and pumps between the modules 120A-120E).","Commercially available examples of indirect counterflow systems are the CBW® Tunnel Washer and the PBW® Tunnel Washer, including PULSEFLOW® technology (Pellerin Milnor Corporation, Kenner, La.).","In the illustrated example, a combination of direct counterflow and indirect counterflow can be employed to achieve example fluid levels shown in FIG.","1 for each module 120A-120E.","In particular, direct counterflow is utilized for transferring fluids within the rinse zone and for transferring fluids within the main wash zone, whereas indirect counterflow is utilized for transferring fluids from the treatment zone or rinse zone to the main wash zone.","This arrangement may help to separate the rinse and wash zones.","In one non-limiting implementation of the illustrated example, the fluid within the fifth module 120E can counterflow back to the fourth module 120D via a weir plate (not shown).","The fluid within the fourth module 120D can counterflow back to the third module 120C via a pump (not shown).","Using a pump allows the fluid level in the third module 120C to be higher than the fluid level in the fourth module 120D, as shown in FIG.","1.The fluid in the third module 120C then can counterflow back to the second module 120B and the fluid in the second module 120B can counterflow back to the first module 120A via weir plates.","The first module 120A may include a weir plate that facilitates transferring excess fluids in the first module 120A to a drain 154.It should be understood that other example implementations for counterflowing fluids from the fifth module 120E to the first module 120A are possible.","The washer system 100 also includes an antimicrobial agent source 128.The antimicrobial agent source 128 can include any device suitable for holding and/or supplying an antimicrobial agent to the tunnel washer 112.Example devices and processes for supplying the antimicrobial agent to the tunnel washer 112 are described in U.S. Pat.","No.","8,641,967, U.S. Patent Appl.","Publication No.","2015/0159314, Patent Appl.","Publication No.","2015/0159319, Patent Appl.","Publication No.","2015/0047718, and U.S. application Ser.","No.","13/968,084 filed Aug. 15, 2013, the contents of which are incorporated by reference in their entirety.","In some of such examples, the antimicrobial source 128 may dilute the antimicrobial agent from a first concentration to a second, lower concentration prior to supplying the antimicrobial agent to the tunnel washer 112.In other examples, the antimicrobial agent can be received in the antimicrobial agent source 128 in the same concentration in which it is supplied to the tunnel washer 128.In some aspects, the antimicrobial agent can include a metallic ion such as, for example, silver ions.","For instance, the antimicrobial agent can include silver nitrate, silver acetate, silver oxide, silver chloride, silver carbonate, silver sulfate, etc.","One benefit to using an antimicrobial agent including silver ions is that such antimicrobial agents may cause less skin irritation and may be less detectable by a user than other antimicrobial agents.","Nonetheless, it should be understood that other antimicrobial agents can be utilized such as, for example, other metallic ions (e.g., copper, zinc, etc.).","The washer system 100 further includes a flow line 136 for providing an antimicrobial solution from the antimicrobial agent source 128 to the sixth module 120F.","The antimicrobial solution may include a concentration of antimicrobial agent.","A flow meter 137 and a flow control device 139 can be coupled to the flow line 136 to respectively monitor and control the amount of antimicrobial solution (and, thus, the amount of antimicrobial agent) that is provided from the antimicrobial source 128 to the sixth module 120F.","The flow control device 139 can include, for example, a peristaltic pump, a diaphragm pump, a solenoid valve, etc.","The sixth module 120F may be initially filled with a combination of fresh water and antimicrobial solution from the fresh water source 122 and the antimicrobial agent source 128, respectively.","A flow line from the fresh water source 122 to the sixth module 120F is omitted for clarity of illustration.","After the initial setup, additional fluids may be supplied to the sixth module 120F via the transfer of textiles from the fifth module 120E and the antimicrobial agent source 128.In one aspect, the antimicrobial solution from the antimicrobial agent source 128 is added to fresh water or other process water in the treatment module 120F.","The concentration of the antimicrobial agent (i.e., the dosage of antimicrobial agent) applied to textiles in the module 120F may be expressed in terms of mg of antimicrobial agent per Kg of textile in the module 120F (i.e., a dry weight concentration) or, alternatively, in terms of parts per million (PPM) in an aqueous solution (i.e., a liquid concentration).","In some examples, the antimicrobial solution can be controllably added to the module 120F to achieve a concentration of approximately 0.5 to approximately 50 mg of antimicrobial agent per 1 Kg of textile in the module 120F.","In other examples, the antimicrobial agent can be applied to textiles at a concentration greater than approximately 8 mg antimicrobial agent per 1 Kg of textile and, in still other examples, a concentration greater than approximately 10 mg antimicrobial agent per 1 Kg of textile.","In some implementations, the concentration utilized for a particular batch of textiles may be based on the type of textile materials in the batch as different materials may have different uptake yield rates, which reflects the percent of the antimicrobial agent that becomes associated with the textile during the treatment.","Table 1 illustrates example yields for example dosages of textiles of different materials.","TABLE 1 Silver Content (mg/kg) Linen Dosage Yield Type Batch (mg/kg) 1 2 3 AVG (%) Cotton Lot 1 1 1.1 0.8 1.3 1.1 107 Lot 2 1 0.7 0.8 0.7 0.7 73 Lot 3 1 0.7 0.7 0.8 0.7 73 Cotton/Poly Lot 1 1.5 1.1 1.0 1.1 1.1 71 Blend Lot 2 1.5 0.9 1.9 2.9 1.9 127 Lot 3 1 0.9 0.9 0.9 0.9 90 Spandex Lot 1 3.4 1.4 1.6 1.6 1.5 45 Lot 2 3.4 1.5 1.7 1.6 1.6 47 Lot 3 3.4 1.6 1.6 1.6 1.6 47 Polyester Lot 1 3.4 nd 0.6 nd 0.6 18 Lot 2 3.4 0.7 0.8 0.6 0.7 21 Lot 3 3.4 1 0.9 0.9 0.9 27 Lot 4 4 0.9 0.9 0.9 0.9 23 Nylon Lot 1 35 1.6 1.8 1.5 1.6 5 Spandex Lot 2 35 1.4 1.3 1.4 1.4 4 Blend Lot 3 35 1.2 1.4 1.3 1.3 4 100% Lot 1 35 0.9 0.9 0.9 0.9 3 Nylon Lot 2 35 0.9 0.8 0.8 0.8 2 Lot 3 35 1 0.9 1.1 1.0 3 100% Lot 1 35 0.7 0.6 0.7 0.7 2 Microfiber Lot 2 35 0.5 0.6 0.6 0.6 2 Lot 3 35 0.9 0.8 0.7 0.8 2 In Table 1, the dosage reflects the amount of silver ion per kg of textile in the each batch of a treatment cycle a pilot plant study.","Silver nitrate was added in an amount that provides the appropriate ion weight.","The volume of batch liquid was approximately 25 liters and the amount of the textile was approximately 0.25 kg.","It should be understood that Table 1 reflects exemplary dosage values that can be used for the textile materials shown, and other dosages are contemplated For example, in some implementations, a batch of textiles of a particular material may be dosed at a dosage value that differs by about plus or minus 50% from the dosage value listed in Table 1 for the same material, depending on the desired silver content of the treated textile and/or the target antimicrobial efficacy sought to be achieved.","Other example implementations are also possible.","In general, the volume of the liquid in each batch is not critical to the antimicrobial update (yield) by the textile.","Typically, industrial applications involve treatment batch sizes of about 500-1000 liters, for example about 600 L, for textile loads of about 150 kg.","It has been found that moderate adjustment of the liquid volume of the treatment batch does not substantially affect yield.","The rate of addition of the antimicrobial solution to the module can be controlled to ensure that all of the textile in the module is uniformly treated.","In some examples, the treatment cycle lasts between about 30 seconds and about 2.5 minutes.","Therefore, to achieve a uniform dose of agent throughout the textile load, the addition of the antimicrobial solution to the module may be affected prior to the first 90 seconds of the treatment cycle.","In some aspects, the antimicrobial solution is added to the module at a fixed rate.","As one example, the antimicrobial solution having a concentration of about 2,000 PPM (aq) to about 15,000 PPM (aq), more particularly about 4000-15000 PPM, is added to a treatment module containing about, for example, 600 liters of liquid and 150 Kg of textile at a rate of about 30 ml/minute for about 2.5 minutes.","In other examples, the antimicrobial agent can be added to the module at a rate between about 5 ml/min to about 50 ml/min for a period of time between about 15 seconds to about 150 seconds.","In one particular non limiting example, a 600 liter liquid bath having a liquid antimicrobial agent concentration of 2 PPM (aq) is achieved by adding a 1000 ml solution having an agent concentration of 1,200 PPM for 2.5 minute at rate of 400 ml/min.","At this concentration, assuming a theoretical 100% yield, the textiles would be infused with 8 mg/kg of antimicrobial agent.","In other aspects, the antimicrobial solution is added to the module at a variable rate, which further improves the uniformity of the antimicrobial agent on the finished textile.","In one example, the antimicrobial agent can be added to the module containing 600 liters of liquid at a rate of about 5 ml/min for about 15 seconds to about 60 seconds followed by a rate of about 20 ml/min for about 15 seconds to about 90 seconds.","As noted above, after the textiles are treated in the sixth module 120F, the textiles are transferred to the fluid-extraction device 118 via the discharge 116.The fluid-extraction device 118 extracts fluids from the textiles.","In some examples, the extracted fluids may be drained as waste water effluent.","One problem with such an approach is that the extracted fluids may contain excess antimicrobial agent that was not retained within the textiles.","If the effluent is not treated, the excess antimicrobial agent may be released into waterways.","Above certain concentrations, antimicrobial agents may be a problematic pollutant for many fresh- and salt-water organisms.","For this reason, many governmental regulations require operators to treat effluent if the concentration of antimicrobial agent is greater than a proscribed limit (e.g., 10 mg per kg).","Unfortunately, effluent treatment can be prohibitively expensive for many laundry operators.","Additionally, in some instances, draining the extracted fluids may unnecessarily waste substantial amounts of antimicrobial agent, increasing the cost to treat textiles.","According to some aspects of the disclosure, the washer system 100 can address these problems associated with excess antimicrobial agent in the extracted fluids.","In particular, the washer system 100 can collect the extracted fluids from the fluid-extraction device 118 and recirculate the extracted fluids back into the tunnel washer 112.Advantageously, recirculating the extracted fluids mitigates wasted antimicrobial agent and the extent to which waste water effluent needs to be treated to comply with environmental regulations.","In the illustrated example, the extracted fluids are collected in a press-water-recovery (PWR) tank 138.As shown in FIG.","1, the PWR tank 138 can provide at least a portion of the extracted fluid to the fifth module 120E in the rinse zone via a flow line 140.Providing antimicrobial agent (e.g., silver ions) to a module 120E preceding the treatment module 120F may allow the antimicrobial agent to bind or chelate to contaminants or other inhibiting ions in the fluid of module 120E, thereby facilitating a more accurate treatment of the textiles in the treatment module 120F.","Additionally, providing the antimicrobial agent to the module 120E may facilitate greater uniformity of antimicrobial agent distribution in the textiles.","Also, as shown in FIG.","1, the PWR tank 138 can also provide at least a portion of the extracted fluid to a flush tank 142 via a flow line 144.The flush tank 142 may also receive fresh water from the fresh water source 122 via a flow line 146.The flush tank 142 may then provide a mixture of fresh water and the extracted water (which may contain excess antimicrobial agent) to the intake 114 via a flow line 148.In this way, the flush tank 142 can provide fluids to the intake 114, which allow the intake 114 to function as a pre-wash module when textiles are received in the intake 114.Providing the antimicrobial agent in the intake 114 can facilitate uniformity of antimicrobial agent distribution and more accurate treatment of the textiles in subsequent modules.","In general, increasing the number of exposures of the textile to the antimicrobial agent can facilitate improving the uniformity of antimicrobial agent distribution in the textile.","To provide the extracted fluids to the fifth module 150E and/or the flush tank 142, the washer system 100 can include one or more pumps and/or valves (which are not shown for clarity of illustration).","Although the extracted fluids may be provided to the intake 114 and/or the fifth module 120E in the illustrated example, it should be understood that the extracted fluids can be similarly provided to other modules in other examples.","For instance, in another example, at least portion of the extracted fluids can be additionally or alternatively provided by the PWR tank 138 to the sixth module 120F in the treatment zone.","According to additional or alternative aspects of the disclosure, the washer system 100 can include additional features that help to mitigate problems associated with poor water quality.","During the treatment process, the metallic ions of the antimicrobial agent may attach to a textile via electrostatic dipole interactions or other interactions including mechanical interaction.","For some fabrics, the positive charge from the metallic ions is attracted to the slight-negative dipole on the polymer backbone of textile fibers.","Generally, contaminants present in poor quality water reduce the probability that the antimicrobial metallic ions will affix to bonding sites of the textile.","This is, in part, because some metallic ions may affix to cationic contaminants instead of the textile.","Thus, to achieve a desired level of antimicrobial agent content in the textiles, the textiles may need to be treated with greater amounts of antimicrobial agent when water quality is poor as compared to when water quality is good.","To address problems associated with poor or changed quality water, the washer system 100 can include one or more sensors that measure a quality of water in the system 100 and, based on the measured water quality, dynamically control the amount of antimicrobial agent utilized in a treatment cycle.","For example, in the washer system 100 shown in FIG.","1, a first water quality sensor 150A is located in the sixth module 120F and a second water quality sensor 150B is located along the flow line 130.The water quality sensors 150A, 150B may be communicatively coupled to a processor 152.In this way, the water quality sensors 150A, 150B may measure the quality of water in the sixth module 120F and the flow line 130, respectively, and transmit a water-quality signal to the processor 152 indicating the measured water quality.","A commercially available example of a water quality sensor is the EXAxt SC450 Conductivity/Resistivity Analyser (Yokogawa North America, Inc., Sugar Land, Tex.).","The processor 152 may then process the water-quality signals to determine an amount of antimicrobial agent to be used for a treatment cycles or a plurality of treatment cycles.","In some examples, the sensors 150A, 150B can measure one or more water quality parameters such as, for instance, a water hardness (e.g., a calcium and/or magnesium concentration), a pH, and/or a total dissolved solids (TDS) concentration.","The measured water quality parameters may be weighted and combined by the processor 152 to generate a Relative Water Quality (RWQ) number.","In one implementation, a higher RWQ may indicate a higher hardness, TDS level, and/or pH.","It has been discovered that as the RWQ increases, an exponentially higher dosage of antimicrobial agent is required to maintain or achieve an efficacious level of antimicrobial agent in the textiles.","As such, the processor 152 can be configured to apply one or more algorithms with the RWQ as an input and an antimicrobial dosage as an output.","A chart illustrating one example algorithm for determining a dosage of antimicrobial agent (mg antimicrobial agent to Kg textile) based on measured water quality is shown in FIG.","2.It should be understood that other examples are also possible.","In an alternative aspect to address water quality, the system can add polished water to the system prior to the textiles entering the treatment zone.","Accordingly prior to the textiles entering the treatment zone, the textiles are subjected to polished water.","By the time the textiles enter the treatment zone, water of poor quality associated with the textiles is replaced with polished water, therefore enhancing the effectiveness of the treatment zone.","The processor 152 can be further communicatively coupled to the flow control device 139, which controls the amount of antimicrobial agent that is provided from the antimicrobial agent source 128 to the sixth module 120F.","In particular, the processor 152 can provide control signals to the flow control device 139 to cause the flow control device 139 to increase the antimicrobial agent in the sixth module 120F so as to achieve the determined dosage of antimicrobial agent.","To determine an amount of antimicrobial agent to add to the sixth module 120F, the washer system 100 can include a conductivity measurement probe 158 in the sixth module 120F.","The conductivity probe 158 can measure a conductivity of the fluid in the sixth module 120F, which can provide an indication of the amount of antimicrobial agent in the fluid.","The processor 152 can be communicatively coupled to the conductivity measurement probe 158, receive signals indicating the measured conductivity, determine the amount of antimicrobial agent in the sixth module 120F based on the received signals, and then determine the amount of antimicrobial agent that needs to be added from the antimicrobial agent source 128 to achieve the determined dosage.","In one example, the determined dosage can be a dosage that is expected to achieve a target level of efficacy as a result of the treatment cycle.","Although illustrated example includes a water quality sensor 150A in the sixth module 120F and a water quality sensor 150B in the flow line 130, it should be understood that the washer system 100 can include more or fewer water quality sensors in other examples.","The processor 152 may include a general-purpose processor (e.g., a microprocessor) and/or a special-purpose processor (e.g., a digital signal processor (DSP)).","The processor 152 may further include a data storage unit having one or more volatile, non-volatile, removable, and/or non-removable storage components, such as magnetic, optical, or flash storage, and/or may be integrated in whole or in part with processor 152.Further, data storage unit may take the form of a non-transitory computer-readable storage medium, having stored thereon program instructions (e.g., compiled or non-compiled program logic and/or machine code) that, when executed by processor 152, cause the washer system 100 to perform one or more acts and/or functions, such as those described in this disclosure.","As such, washer system 100 may be configured to perform one or more acts and/or functions, such as those described in this disclosure.","Such program instructions may define and/or be part of a discrete software application that can be executed in response to certain inputs being received from a communication interface and/or a user interface, for instance.","Data storage unit may also store other types of data, such as those types described in this disclosure.","Although not shown in FIG.","1 for clarity of illustration, the washer system can further include a user interface to facilitate interaction with a user of washer system 100, if applicable.","As such, the user interface may include input components such as a keyboard, a keypad, a mouse, a touch-sensitive panel, a microphone, and/or a camera, and/or output components such as a display device (which, for example, may be combined with a touch-sensitive panel), a sound speaker, and/or a haptic feedback system.","Referring now to FIGS.","3-7, example processes are illustrated and described for treating textiles with an antimicrobial agent according to various aspects of the disclosure.","It should be understood that, according to alternative aspects of the disclosure, the processes of FIGS.","3-7 can omit steps, include additional steps, and/or modify the order of steps presented above.","Additionally, it is contemplated that one or more of the steps presented below can be performed simultaneously.","It should also be understood that the example processes of FIGS.","3-7 can correspond to at least some instructions that can be executed by the processor 152 to perform the below described functions.","FIG.","3 illustrates an example flowchart for using a washer system, including a tunnel washer (e.g., the washer system 100), to treat a textile with an antimicrobial agent according to some aspects of the disclosure.","At block 202, a textile is received in the intake 114.With the textile in the intake 114, the washer system 100 may provide fluid from the flush tank 142 to the intake 114 to perform a pre-wash cycle on the textile.","During the pre-wash cycle, the fluid in the intake 114 may facilitate initial wetting of the textile prior to the main wash zone.","At block 204, the tunnel washer 112 transports the textile from the intake 114 to the wash zone.","At block 206, the textile is washed with a detergent and, optionally, other wash chemicals, steam, and/or heat in each of the modules 120A-120C of the wash zone.","The detergent can be provided to the wash zone modules 120A-120C from a detergent source 156 as shown in FIG.","1.As the textile is progressed through the modules 120A-120C, the wash fluids counterflow from the third module 120C to the first module 120A (i.e., in the direction of arrow B in FIG.","1), where excess wash fluids are drained via the drain 154.At block 208, the textile is transferred from the wash zone to the rinse zone.","In the example of FIG.","1, the textile is transferred from the third module 120C to the fourth module 120D.","At block 210, the textile is rinsed in each of rinse zone modules 120D, 120E with rinse fluids provided by the fresh water source 122, the polished water source 124, and/or the tempered water source 126.Optionally, the textile may additionally or alternatively be rinsed by fluids provided by the PWR tank 138.In particular, the rinse fluids are provided to the last module 120E of the rinse zone so that the rinse fluids counterflow back to the beginning of the rinse zone at module 120D.","In this way, the textile may be progressively rinsed in cleaner rinse fluids as it moves through the tunnel washer 112.At block 212, the textile is transferred from the rinse zone to the treatment zone.","In doing so, a portion of the rinse fluids may be transferred with the textile into the treatment zone module 120F.","At block 214, the textile is submerged in a treatment solution including the antimicrobial agent.","At block 216, the antimicrobial agent source 128 may optionally provide additional antimicrobial agent to the treatment zone module 120F (if necessary) to achieve a treatment solution having a predetermined dosage of antimicrobial agent.","At block 218, the textile is transferred, via the discharge 116, to the fluid-extraction device 118.At block 220, the fluid-extraction device 118 extracts excess fluids from the textile.","At block 222, the textile may then be transported to other components for drying and/or finishing (e.g., folding).","In the example washer system 100 described above, the treatment of the textile with antimicrobial agent is described as being performed in a treatment module that is separate from the rinse modules.","It should be understood that according to additional or alternative aspects, the treatment functions can be performed in the last rinse module.","For example, the treatment may be performed in the last rinse module, which transfers fluids to other modules via counterflow.","At block 224, the PWR tank 138 may receive the extracted fluids from the fluid-extraction device 118.At block 226, the PWR tank 138 may recirculate at least a portion of the extracted fluids back into the tunnel washer 112.For example, the PWR tank 138 may recirculate at least a portion of the extracted fluids back to the fifth module 120E in the rinse zone (or a combined rinse/treatment zone), and/or at to the flush tank 142 for use in the intake 114 as described above.","FIG.","4 illustrates another example flowchart for treating a textile according to additional or alternative aspects of the disclosure.","At block 302, the washer system receives a textile to be washed and treated.","At block 304, the textile is washed with a detergent during a wash cycle in the washer system.","At block 306, the textile is rinsed in the washer system to remove the detergent from the textile.","At block 308, one or more sensors measure a quality of water to be used in a treatment cycle.","At block 310, a processor determines a dosage of antimicrobial agent to apply to the textile based on the measured quality of water at block 308.At block 312, the washer system adjusts an amount of antimicrobial agent in a treatment solution to achieve the determined dosage.","At block 314, the textile is treated with the treatment solution having the determined dosage of antimicrobial agent.","At block 316, the washer system extracts excess fluids from the textile.","Aspects of the disclosure are described above in the context of the washer system 100, which includes a tunnel washer 112 having a plurality of modules 120A-120F.","However, these aspects of the disclosure can be extended to systems and processes in the context of washer-extraction devices.","For example, according to alternative aspects, the one or more water quality sensors can be provided in a washer-extraction device, which may control an amount of antimicrobial agent utilized in a treatment cycle based on water quality measurements.","As noted above, this process can substantially mitigate problems associated with poor and changed water quality used for antimicrobial treatment of textiles.","Thus, in some instances, two batches of textiles that are substantially the same may nonetheless be treated with different amounts of antimicrobial agent where the water quality in the washer system is different for each batch.","In some aspects, regardless of the wash system employed, the disclosure is directed to achieving a textile having desired level (i.e., predetermined or target level) of antimicrobial efficacy with a single treatment cycle.","In addition, the washer system 100 may be configured to incrementally load the textile with antimicrobial agent to a desired efficacious level over a plurality of treatment cycles.","Stated differently, the textile may not achieve a desired, predetermined or target level of antimicrobial efficacy as a result of only a single initial treatment cycle.","While an incremental loading approach may require more time than a single cycle approach to initially achieve a textile with a target level of anti-microbial agent that will mitigate microbial infections, it has been found that incremental loading provides substantial cost savings and ecological benefits over the useful life of the textile as compared to the single cycle approach.","In single cycle approaches, treatment solutions may contain a concentration of approximately 2 parts per million (PPM) to about 100 PPM.","Although such high concentrations of antimicrobial agent may be beneficial for an initial treatment cycle, the same concentrations provide substantially diminished benefits with each successive treatment cycle on the same pieces textile.","In particular, once a certain level of antimicrobial agent content or uniformity is achieved in the textile, further increases in antimicrobial agent content may provide negligible (if any) additional benefit.","Therefore, repeated treatment cycles involving a moderate dose of an antimicrobial agent can achieve the same antimicrobial efficacy as repeated cycles involving high doses of agent, albeit it may take more than one moderate dose cycle to achieve the desired efficacy.","In contrast to single cycle antimicrobial treatment approaches, the incremental-loading-to-efficacy approach of the disclosure utilizes substantially less antimicrobial agent during each treatment cycle.","For example, according to some examples, the concentration of the antimicrobial agent in the treatment solution can be approximately 3 PPM to approximately 8 PPM.","Accordingly, the more times a textile is treated using the incremental-loading-to-efficacy approach, the greater the cost savings realized as compared to approaches using dosing concentrations that may achieve a desired anti-microbial efficacy in a single treatment.","Moreover, by reducing the amount of antimicrobial agent used per treatment cycle, less antimicrobial agent is likely to be drained to waste.","In some examples, the predetermined efficacious level can be approximately 0.6 mg of antimicrobial agent per kg of textile.","In other examples, the predetermined efficacious level can be approximately 0.75 mg of antimicrobial agent (e.g., silver ion) per kg of textile.","In still other examples, the predetermined efficacious level can be approximately 1.3 mg antimicrobial agent per 1 Kg textile, approximately 1.5 mg antimicrobial agent per 1 Kg textile, approximately 1.7 mg antimicrobial agent per 1 Kg textile, approximately 2 mg antimicrobial agent per 1 Kg textile, approximately 3 mg antimicrobial agent per 1 Kg textile, or approximately 4 mg antimicrobial agent per 1 Kg textile.","In some examples, the amount of antimicrobial agent utilized per treatment cycle can be determined to facilitate maintaining a textile at or above the desired, predetermined, or target efficacious level.","When previously treated textiles are washed and rinsed the washer system 100, some antimicrobial agent previously contained within the textile washes out.","Accordingly, in some examples, the amount of antimicrobial agent employed per treatment cycle may be less than an amount required to achieve a target efficacy after a single laundry cycle and greater than or equal to an amount required to replace the antimicrobial agent that is expected to leach from the textile during laundry cycles after efficacy is achieved.","In one example implementations, the amount of antimicrobial agent utilized per treatment cycle is selected such that the textile maintains a content level of approximately 1 mg of antimicrobial agent per kg of textile to approximately 15 mg of antimicrobial agent per kg of textile, for instance 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14 or mg/Kg.","In another example implementation, the amount of antimicrobial agent utilized per treatment cycle is selected such that the textile maintains a content level of approximately 5 mg of antimicrobial agent per kg of textile to approximately 10 mg of antimicrobial agent per kg of textile.","Depending on the type of textile being laundered, the concentration of the antimicrobial agent in the treatment cycle can be about 0.5 mg of antimicrobial agent per kg of textile to about 30 mg of antimicrobial agent per kg of textile.","For example, the concentration of the antimicrobial agent in the treatment cycle can be approximately 20% to approximately 90% lower than the dosage values shown in Table 1.In other examples, the concentration of the antimicrobial agent in the treatment cycle can be such that the textile achieves a content level of about 0.2 mg/kg, about 0.3 mg/kg, about 0.4 mg/kg, about 0.5 mg/kg, about 0.6 mg/kg, about 0.7 mg/kg, or about 0.8 mg/kg after the first treatment cycle.","At such concentrations, multiple laundry/treatment cycles may be required to achieve the predetermined level of antimicrobial agent in the textile.","In some embodiments, a desired level of the antimicrobial agent in the textile (e.g., between about 1.0 mg/kg to about 2.0 mg/kg) can be achieved in a single treatment cycle.","In various embodiments, newly manufactured textiles or previously untreated laundry is treated in a first treatment cycle that infuses the textile with less than 1 mg antimicrobial agent per kilogram of textile.","Repeated treatment cycles on the laundry raises the antimicrobial agent in the textiles from about 1 mg/Kg to about 5 mg/Kg of antimicrobial agent per kilogram of textile.","In some examples, the amount of antimicrobial agent utilized per treatment cycle can be determined so that the predetermined efficacious level is achieved only after a predetermined number of treatment cycles.","For instance, the predetermined number of treatment cycles can be two treatment cycles, three treatment cycles, four treatment cycles, five treatment cycles, 10 treatment cycles, or 30 treatment cycles according to various examples.","Other examples are also possible.","As noted above, the amount of antimicrobial agent in the textile may continue to increase or reach a steady state with each successive treatment cycle when existing antimicrobial treatment approaches are employed.","In such approaches, the textiles may become discolored when loaded with too much antimicrobial agent (e.g., greater than 100 mg/kg of textile).","Accordingly, a further benefit to the incremental-loading-to-efficacy approach is that the textiles can be treated a substantially greater number of times without causing distortion in color in the textile.","For example, in some instances, textiles can be treated more than 30 times, more than 50 times, or more than 100 times without causing distortion in color to the textiles when the incremental-loading-to-efficacy approach of the disclosure is employed.","Referring now to FIG.","5, an example flowchart for treating a textile with an antimicrobial agent over a plurality of laundry cycles is illustrated according to some aspects of the disclosure.","At block 402, the washer system receives the textile for a laundry cycle.","At block 404, the washer system washes the textile with a detergent.","At block 406, the washer system doses the textile with a solution having a predetermined concentration of an antimicrobial agent.","The process is then repeated for a plurality of additional laundry cycles.","The predetermined concentration is insufficient to achieve a predetermined antimicrobial efficacy for the textile due to the first laundry cycle alone (i.e., due to the first iteration of blocks 402-406) but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of the first laundry cycle and one or more of the plurality of additional laundry cycles.","In some examples, the process can include providing the textile to a customer and then receiving the textile back from the customer between each laundry cycle.","In other examples, the process may further include providing the textile to a customer only after the textile achieves the predetermined antimicrobial efficacy (e.g., after multiple laundry cycle(s)).","According to still further aspects of the disclosure, a process for protecting a laundry supply chain is provided.","It is known that healthcare associated infections are a growing concern with some pathogens being virtually untreatable with conventional methods.","With such healthcare associated infections, the harmful microbes are often carried in the linens and clothing used within a hospital.","Conventional laundry methods are known to be unreliable to effectively disinfect or sanitize laundry.","Even so if such methods were effective, once hospital textiles have been laundered and treated, they are susceptible to recontamination.","Pathogens carried by these textiles can infect hospital patients and even cause death.","Since most hospital patients spend the majority of their time between the sheets of a hospital bed or in a hospital gown, hospital linens are the core of the overall hospital environment for the patient, and a primary site in the battle against infection.","To combat such infections, and to protect not only patients, but healthcare workers and anyone in contact with hospital laundry (including laundry staff), the loading of an antimicrobial agent into an inventory of a laundry from a healthcare facility can protect the complete supply chain for such inventory.","Not only does the antimicrobial agent kill pathogens in soiled laundry during the laundry process, the agent infused into the textiles protects the textiles against new pathogens that come in contact with the textiles.","This treatment may also act as textile preservative, protecting the textiles from storage based microbial and fungal growth.","Referring now to FIG.","6, an example flowchart for protecting individuals in contact with healthcare facility linens from a healthcare associated infection is illustrated according to some aspects.","At block 502, substantially all washable, non-disposable textiles that contact patients and healthcare workers are collected in one or more batches at a healthcare facility.","At block 504, each batch is washed using a washer system (e.g., the washer system 100) using a detergent.","At block 506, each batch is treated with a treatment solution including a predetermined concentration of an antimicrobial agent to reduce the microbial load on the textiles in the batch and improve a resistance of the textiles in the batch to microbial contamination responsible for healthcare associated infections.","By treating substantially all washable, non-disposable textiles at a healthcare facility, healthcare associated infections may be reduced.","In addition, microbial discharge to the environment may be reduced.","Referring to FIG.","7, another example flowchart for reducing a microbial load in an inventory of textiles including a plurality of pieces at a healthcare facility is illustrated according to some aspects.","At block 602, the washer system receives a first portion of the plurality of pieces of the inventory in a wash basin of the washer system for a laundry cycle.","At block 604, the washer system initiates the laundry cycle.","The laundry cycle includes a wash cycle and a treatment cycle.","The treatment cycle includes a solution having a predetermined concentration of an antimicrobial agent.","At block 606, the washer system receives and treats a subsequent portion of the inventory.","At block 608, it is determined whether a predetermined amount of the pieces of the inventory have achieved a predetermined efficacy, thereby reducing the antimicrobial load of the entire inventory.","In one example, the predetermined amount of pieces is approximately 50%-90% of the inventory, for example, 50%, 60%, 70%, 80% or 90% of the inventory.","In order to determine whether textiles have been subject to the antimicrobial treatments as described herein, an additional aspect of the disclosure is a method of detecting the presence of an efficacious amount of silver in a textile.","The method uses two solutions, a first solution and a second solution.","The first solution includes the following reagents: Cadion 2B (CAS No.","6708-61-8), a buffer sufficient to maintain a pH in the range of from about 8 to about 10, and a surfactant.","The second solution includes Cadion 2B, a buffer sufficient to maintain a pH in the range of from about 8 to about 10, a surfactant, and a complexing agent.","The method relies upon the formation of a complex of the complexing agent and silver, wherein the formation of the agent/silver complex is more favorable than formation of a complex of Cadion 2B and silver.","As part of the method, the solutions are dispensed on to separate areas of the textile and the color of the dispensed first solution is compared to the color of the dispensed second solution.","Solution A in contacted with a silver-impregnated textile results in a visible color change of the solution due to the formation of a red-violet complex of Cadion 2B and silver, while contacting Solution B with a silver-impregnated textile does not result in a visible color change of the solution due to favorable formation of a complex of the complexing agent and silver.","In some aspects, a difference in the color of Solution A and Solution B after dispensation onto a textile indicates an efficacious of silver.","In some aspects, the amount of Cadion 2B included in Solution A or Solution B is any amount in which a change in the color of the solution is visible upon exposure to silver.","In some embodiments, Solution A or Solution B may contain Cadion 2B in a range of about 0.001 wt % to about 0.005 wt %, or about 0.002 wt % to about 0.004 wt %, or about 0.002 wt %, or about 0.003 wt %, or about 0.004 wt %.","In some embodiments, Solution A or Solution B may further comprise a masking agent to react with chemical species that may interfere with the detection of silver.","In some embodiments, the masking agent is ethylenediaminetetraacetic acid (EDTA), cyclohexanediaminetetraacetic acid (CDTA), diethylenetriaminepentaacetic acid (DTPA), nitrilotriacetic acid (NTA), or N-(hydroxyethyl)-ethylenediaminetriacetic acid (HEDTA).","In some aspects, Solution A or Solution B may contain the masking agent in a range of about 0.5 wt % to about 1.6 wt %, or about 0.9 wt % to about 1.2 wt %, or about 0.9 wt %, or about 1.0 wt %, or about 1.1 wt %.","In some embodiments, Solution A or Solution B may further comprise a water-miscible organic solvent.","In some aspects, the water-miscible organic solvent may function as a solubilizer.","In some embodiments, the water-miscible organic solvent is N-methyl-2-pyrrolidone, polyethylene glycol 400 (PEG400), N,N-dimethylacetamide (DMA), or dimethylsulfoxide (DMSO).","In some aspects, Solution A or Solution B may contain the water-miscible solvent in a range of about 2.5 vol % to about 3.2 vol %, or about 2.7 vol % to about 3.0 vol %, or about 2.7 vol %, or about 2.8 vol %, or about 2.9 vol %, or about 3.0 vol %.","In some aspects, the complexing agent may be any compound for which the formation of a complex of the compound and silver is more favorable than formation of a complex of Cadion 2B and silver.","In some embodiments, the complexing agent is thiosulfate, ammonia, or cyanide.","In some aspects, Solution B may contain the complexing agent in a range of about 0.3 wt % to about 0.9 wt %, or about 0.5 wt % to about 0.7 wt %, or about 0.5 wt %, or about 0.6 wt %, or about 0.7 wt %.","In some aspects, the surfactant of Solution A or Solution B may be any non-ionic surfactant.","In some embodiments, the surfactant of Solution A or Solution B is TWEEN® 20, TWEEN® 80, TRITON™ X-100, n-dodecyl β-D-maltoside (DDM), digitonin, sarkosyl, or sodium dodecyl sulfate (SDS).","In some aspects, Solution A or Solution B may contain the surfactant in a range of about 0.5 vol % to about 1.4 vol %, or about 0.75 vol % to about 1.15 vol %, or about 0.8 vol %, or about 0.9 vol %, or about 1.0 vol %, or about 1.1 vol %.","In some aspects, the buffer of Solution A or Solution B may be any buffer sufficient to maintain a pH in the range of from about 8 to about 10.In some embodiments, the buffer may comprise one or more of potassium tetraborate, sodium borate, citric acid, sodium citrate, hydrochloric acid, sodium hydroxide, sodium carbonate, sodium bicarbonate, monosodium phosphate, monopotassium phosphate, dipotassium phosphate, or potassium chloride.","EXAMPLES Example 1: Silver Treatment of Hospital Textiles A system for the application of silver ions to textiles as described herein (SILVACLEAN® system from Applied Silver, Hayward, Calif.) was installed at a Healthcare Laundry Accreditation Council (HLAC) accredited laundry facility serving three different hospitals.","Following a wash cycle, sheets and patient gowns were allowed to soak for approximately two minutes in a bath containing silver at a concentration between 1.7 and 1.8 mg Ag per liter of wash liquor (i.e., about 1.7-1.8 ppm) before the textiles were extracted and dried.","Textiles were dosed to contain between 1.3 and 15 mg Ag per kilogram (e.g., between 8 and 10 mg Ag per kilogram).","The textiles were analyzed daily via inductively coupled plasma-atomic emission spectrometry (ICP-AES) to ensure treatment within target range.","Example 2: Reduction of Microbial Bioburden of Hospital Textiles Sheets and gowns, which were selected over other types of hospital textiles because they have easily identifiable patient-facing surfaces, were sampled before and after patient use (referred to as pre- and post-patient use, respectively).","Pre-patient use samples were randomly selected from clean linen storage carts in multiple hospital wards, which were selected based on hospital layout and sampling logistics.","A set of gowns and sheets were selected each day using a random number generator to select ward, cart, stack within the cart, and item within the stack.","Pre-patient use samples were handled with clean nitrile gloves and placed in clean plastic bags for transport to the sampling room where microbiologic samples were collected.","Post-patient use samples were sampled after patient discharge, following patient transfer, or after routine bed linen and gown changes.","Microbiologic sampling was carried out immediately after discharge, before beds were stripped and cleaned by the housekeeping staff.","The hospital directed patients to leave gowns open on the bed so that both the fitted bottom sheet and gown could be sampled without directly handling the item.","Used textiles in each hospital were sampled for approximately 10 days between the hours of 9 a.m. and 5 p.m. Two samples were collected from each textile item at pre-defined, patient-facing locations.","On bottom fitted sheets, samples were taken in the center middle of the sheet, both upper and lower, roughly corresponding to a supine patient's mid and lower back.","On gowns, one sample was taken in the center chest area and another in the center of the suprapubic region.","If the target sample area was visibly soiled, the sample was taken on the same sheet or gown, but in a directly adjacent unsoiled area.","Samples were collected using three types of culture media: non-selective Tryptic Soy Agar (TSA) was used for total aerobic colony count, S. aureus selective Baird-Parker Agar to quantify S. aureus, and MRSA selective HARDYCHROM™ MRSA media (all Hardy Diagnostics, Santa Maria, Calif.).","Plates had a surface area of 28.27 cm2.A random number generator was used to assign textiles to specific sampling media, ensuring approximately 20% of total samples would be on selective media (10% S. aureus and 10% MRSA).","Contact plate sampling was carried out using the instructions for use provided by the manufacturer.","The plate was held in place for five seconds, lifted from the sheet, and then immediately re-capped.","Contact plates were incubated for 24 hours in aerobic conditions at 37° C. and total colony forming units (CFU) per plate were then enumerated by an independent lab.","If the colony counts were greater than 300, the count was recorded as 300 CFU/plate.","This was done to limit the effect of outliers and because plates with more than 300 CFU/plate could not be counted reliably.","The average of two sampling sites per textile was calculated, resulting in a single measure for each gown and sheet.","The Wilcoxon rank-sum test was used to compare means in each group and Fisher's exact test was used to compare the proportions of textiles from which bacterial colonies were isolated.","To control for the three different hospital sites and ward types, mixed-effects logistic models were constructed to study the association between silver treatment and the isolation of bacteria for each culture media used (non-selective, S. aureus, and MRSA).","For all models, the dependent variable was the isolation of bacteria on the specific media type.","The independent variables included were presence or absence of silver treatment, if the textile was pre or post-patient use, and the ward where the samples had been collected.","Wards were simplified to two levels: non-monitored wards (which included non-critical medical/surgical floors, labor and delivery, acute rehabilitation, and non-monitored pediatric beds) and more critical care oriented monitored wards (including telemetry wards, intensive care units, and cardiac care units).","First, mixed-effects models that consisted of a single independent variable controlling for hospital clustering as a random effect were constructed.","A multivariate mixed-effects logistic model was then constructed, using information-theoretic model selection to generate all possible combinations of the selected independent variables.","The model with the lowest corrected Akaike information criterion was selected (See, Burnham & Anderson, “Model selection and multimodel inference: a practical information-theoretic approach,” 2nd ed., New York: Springer Verlag (2002)).","Multicollinearity between independent variables in multivariate models was assessed using variance inflation factors.","Analysis was conducted in R (R Core Team, 2015) utilizing the lme4 package (Bates et al., 2015) for logistic mixed effects models and the MuMIn package for information-theoretic model selection (Barton, 2015).","(R Core Team, 2015: R: A language and environment for statistical computing.","R Foundation for Statistical Computing, Vienna, Austria.","Bates, D., Maechler, M., Bolker, B., Walker, S., 2015: lme4: Linear mixed-effects models using Eigen and S4.R package version 1.1-9.Barton, K., 2015: MuMIn: Multi-Model Inference.","R package version 1.15.1.)","A total of 1,912 gowns and 2,074 sheets were included in the analysis.","Fifty-nine percent of the gown samples (1,133/1,912) and 51% percent of the sheet samples (1,059/2,074) were collected pre-patient use.","Staphylococcus aureus specific cultures were obtained on 9.5% of gowns (181/1912) and 8.3% of sheets (173/2074).","MRSA specific cultures were obtained on 10% of gowns (193/1912) and 9% of sheets (187/2074).","Example 3: Aerobic Bacterial Colony Isolation Before and after Silver Application More bacteria were isolated from textiles that had been used by patients.","Before silver application, 8 times more aerobic bacterial colonies were isolated on non-selective media from post-patient use gowns compared to pre-patient use (113.2+6.4 CFU/plate compared to 14+0.6 CFU/plate, p<0.0001), and slightly more than 10 times more aerobic bacterial colonies were isolated from sheets post-patient use compared to pre-patient use sheets (54.8+3.2 CFU/plate compared to 5.2+0.5 CFU/plate, p<0.0001).","Fewer total aerobic bacterial colonies were isolated on non-selective culture media on textiles treated with silver (See, FIG.","8).","On pre-patient use gowns, an average of 14+0.6 CFU/plate were isolated before silver treatment compared to an average of 1.5+0.07 CFU/plate in the silver treated group, representing an 89% reduction (p<0.0001).","Before silver treatment, an average of 5.2+0.5 CFU/plate were isolated from pre-patient use sheets compared to an average of 0.6+0.06 CFU/plate in the silver treated group, representing an 88% reduction (p<0.0001).","In gowns sampled after patient use, there was a 45% reduction in bacteria isolated on the silver treated gowns compared to gowns sampled before silver treatment (113.2+6.4 CFU/plate before silver treatment compared to 62.7+3.6 CFU/plate, p<0.0001).","In sheets sampled after patient use, there was a 30% reduction in bacteria isolated, with an average of 54.8+3.2 CFU/plate before silver treatment compared to an average of 38.3+2.9 CFU/plate after silver treatment (p=0.0001).","The proportion of pre-patient use gowns from which at least one aerobic bacterial colony was isolated (See, Table 2) fell from 93% (432/466) to 72% (330/459) after silver treatment (Fisher's exact test, p<0.0001).","In post-patient use gowns, the proportion fell from 98% (303/310) to 93% (281/303) after silver treatment (p=0.0002).","The proportion of sheets with at least one aerobic bacterial colony decreased from 89% (406/454) to 50% (230/457) after silver treatment (p<0.0001) in the pre-patient use group and from 99% (406/409) to 94% (372/394) in the post-patient use group (p<0.0001).","TABLE 2 Proportion of Textiles with Bacterial Isolates Before (Control) and After Silver Treatment None Textile Culture Isolated, Isolated, p Type Media Group n(%) n(%) Value* Pre-Use All Control 432 (93%) 34 (7%) — Gowns aerobic Silver 330 (72%) 129 (28%) <0.0001 S. aureus Control 28 (53%) 25 (47%) — Silver 0 (0%) 45 (100%) <0.0001 MRSA Control 18 (29%) 45 (71%) — Silver 1 (2%) 46 (98%) 0.0002 Post-Use All Control 303 (98%) 7 (2%) — Gowns aerobic Silver 281 (93%) 22 (7%) 0.003 S. aureus Control 29 (83%) 6 (17%) — Silver 23 (48%) 25 (52%) 0.001 MRSA Control 9 (26%) 25 (74%) — Silver 0 (0%) 49 (100%) 0.0001 Pre-Use All Control 406 (89%) 48 (11%) — Sheets aerobic Silver 230 (50%) 227 (50%) <0.0001 S. aureus Control 5 (23%) 17 (77%) — Silver 0 (0%) 46 (100%) 0.002 MRSA Control 2 (6%) 31 (94%) — Silver 0 (0%) 47 (100%) 0.16 Post-Use All Control 406 (99%) 3 (1%) — Sheets aerobic Silver 372 (94%) 22 (6%) <0.0001 S. aureus Control 38 (84%) 7 (16%) — Silver 32 (53%) 28 (47%) 0.0008 MRSA Control 9 (21%) 34 (79%) — Silver 7 (11%) 57 (89%) 0.17 *Fisher's exact test, significance considered to be <0.05 In an unadjusted mixed-effects logistic model controlling only for hospital site clustering (See, Table 3), the presence of silver was associated with decreased isolation of aerobic bacteria on non-selective media (odds ratio [OR] 0.1, 95% Confidence Interval [CI] 0.1-0.2).","In the best-fit multivariable mixed-effects logistic model for isolation of aerobic bacterial colonies on non-selective media, isolation of colonies was more likely on post-patient use textiles (adjusted OR 9.5, 95% CI 7.1-13) and gowns (adjusted OR 1.5, 95% CI 1.5-2.3) and less likely after silver treatment (adjusted OR 0.1, 95% CI 0.1-0.2).","While textiles in critical care areas appeared to be more likely to have colonies isolated in the initial unadjusted model, this variable did not improve model fit in the fully adjusted model, suggesting confounding from other independent variables explained the initial finding.","TABLE 3 Unadjusted and Adjusted Mixed-Effects Logistic Models All Aerobic Unadjusted Adjusted %(n) (OR, 95% CI) (OR, 95% CI) Ward Type Non-Monitored 83% (2191) Ref — Monitored 95% (569) 4.1 (2.8-6.1)* — Patient Exposure Pre-Use 76% (1298) Ref Ref Post-Use 96% (1362) 7.9 (5.9-10.6)* 9.5 (7.1-13.0)* Textile Type Sheet 82% (1414) Ref Ref Gown 87% (1346) 1.5 (1.2-1.8)* 1.8 (1.5-2.3)* Silver Treatment Absent 94% (1547) Ref Ref Present 75% (1213) 0.1 (0.1-0.2)* 0.1 (0.1-0.2)* Abbreviations: OR, Odds ratio; CI, Confidence Interval; *p < 0.05 The proportion of pre-patient use sheets deemed hygienically clean (<20 CFU/dm2, TRSA Standard for Producing Hygienically Clean Reusable Textiles for Use in the Healthcare Industry) increased from 74% (334/454) to 99% (453/457) after silver treatment.","The proportion of pre-patient use gowns deemed hygienically clean increased from 30% (139/466) to 98% (448/459) after silver treatment.","Results are summarized in Table 4.TABLE 4 Hygienically Clean Test, Non-Selective Culture Media Textile Type Group Pass, n (%) Fail, n (%) Pre-Use Sheets Control 334 (74%) 120 (36%) Silver 453 (99%) 4 (1%) Pre-Use Gowns Control 139 (30%) 327 (70%) Silver 448 (98%) 11 (2%) Example 4: S. aureus Isolation Before and after Silver Application Fewer Staphylococcus aureus colonies were isolated on textiles sampled after silver treatment (See, FIG.","9).","There was a 100% reduction in S. aureus in gowns (2.8+0.3 CFU/plate compared to no S. aureus isolated after silver treatment, p<0.0001) and sheets prior to patient use (0.6+0.4 CFU/plate compared to no S. aureus isolated after silver treatment, p=0.009).","In post-patient use gowns there was a 89% reduction in S. aureus colonies isolated, with an average of 30.7+5.1 CFU/plate isolated before silver treatment and 3.3+0.4 CFU/plate after treatment (p<0.0001).","There was a 74% reduction in the average number of S. aureus colonies isolated from sheets after patient use, with 18.1+5.1 CFU/plate isolated before silver treatment compared to 4.7+2.5 CFU/plate in the silver treated sheets (p<0.0001).","The proportion of pre-patient use gowns from which at least one colony of S. aureus was isolated (See, Table 2) fell from 53% (28/53) to 0% (0/45) after silver treatment (Fisher's exact test, p<0.0001).","In post-patient use gowns, the proportion fell from 83% (29/35) to 48% (23/48) after silver treatment (p=0.001).","The proportion of sheets with at least one colony of S. aureus decreased from 23% (5/22) to 0% (0/46) after silver treatment (p=0.002) in the pre-patient use group and from 84% (38/45) to 53% (32/60) in the post-patient use group (p=0.0008).","In an unadjusted mixed-effects logistic model controlling only for hospital site clustering (See, Table 5), the presence of silver was associated with decreased isolation of S. aureus colonies (OR 0.2, 95% CI 0.1-0.3).","In the best-fit multivariable mixed-effects logistic model for isolation of S. aureus, isolation of bacteria was more likely on post-patient use textiles (adjusted OR 11.9, 95% CI 6.1-23.4) and textiles in intensive care settings (adjusted OR 3.9, 95% CI 2.1-7.8) and less likely after silver treatment (adjusted OR 0.1, 95% CI 0.05-0.2).","TABLE 5 Unadjusted and Adjusted Mixed-Effects Logistic Models S. aureus Specific Media Unadjusted Adjusted %(n) (OR, 95% CI) (OR, 95% CI) Ward Type Non-Monitored 34% (94) Ref Ref Monitored 79% (61) 7.2 (3.9-13.3)* 3.9 (2.1-7.8)* Patient Exposure Pre-Use 20% (33) Ref Ref Post-Use 65% (122) 9.7 (5.7-16.7)* 11.9 (6.1-23.4)* Textile Type Sheet 43% (75) Ref — Gown 44% (80) 0.9 (0.6-1.4) — Silver Treatment Absent 64% (100) Ref Ref Present 27% (55) 0.2 (0.1-0.3)* 0.1 (0.05-0.2)* Abbreviations: OR, Odds ratio; CI, Confidence Interval; *p < 0.05 Example 5: MRSA Isolation Before and after Silver Application While average colony counts of MRSA were much lower than colony counts on non-selective aerobic plates and S. aureus plates, the average number of MRSA colonies isolated per plate decreased after silver treatment (See, FIG.","10).","Before patient use, there was a 97% reduction in the average number of MRSA colonies on gowns (average of 0.4+0.04 CFU/plate compared with 0.01+0.001 CFU/plate on silver treated gowns, p=0.0002) and a 100% reduction on sheets (average of 0.07+0.06 CFU/plate compared with no MRSA isolated on the silver treated sheets, p=0.09).","After patient use, there was a 100% reduction in the average number of MRSA colonies on gowns (average of 0.7+0.1 CFU/plate compared with no MRSA isolated on the silver treated gowns, p=0.0001) and a 80% reduction on sheets (0.5+0.3 CFU/plate compared with 0.1+0.04 CFU/plate on the silver treated sheets, p=0.14).","The proportion of gowns with at least one colony of MRSA (See, Table 2) decreased from 29% (18/63) to 2% (1/47) after silver treatment (p=0.0002) in the pre-patient use group and from 26% (9/34) to 0% (0/49) after silver treatment (p=0.0001) in the post-patient use group.","The proportion of sheets with at least one colony of MRSA decreased from 2% (2/32) to 0% (0/47) after silver treatment (p=0.16) in the pre-patient use group and from 21% (9/33) to 11% (7/64) in the post-patient use group (p=0.17).","In an unadjusted mixed-effects logistic model controlling only for hospital site clustering (See, Table 6), the presence of silver was associated with decreased isolation of MRSA (OR 0.3, 95% CI 0.1-0.9).","In the best-fit multivariable mixed-effects logistic model for isolation of MRSA, only the presence or absence of silver was predictive of MRSA isolation.","TABLE 6 Unadjusted and Adjusted Mixed-Effects Logistic Models MRSA Specific Media Unadjusted Adjusted %(n) (OR, 95% CI) (OR, 95% CI) Ward Type Non-Monitored 9% (27) Ref — Monitored 21% (19) 1.6 (0.8-3.2) — Patient Exposure Pre-Use 11% (21) Ref — Post-Use 13% (25) 1.5 (0.8-2.9) — Textile Type Sheet 10% (18) Ref — Gown 14% (28) 1.2 (0.6-2.4) — Silver Treatment Absent 22% (38) Ref Ref Present 4% (8) 0.3 (0.1-0.9)* 0.3 (0.1-0.9)* Abbreviations: OR, Odds ratio; CI, Confidence Interval; *p < 0.05 Example 6: Silver Detection in Treated Textiles A pass/fail method for detecting the presence of silver in a SILVACLEAN® treated textile was used to confirm the silver content of treated textiles.","The detection kit includes two solutions, labeled Solution A and Solution B.","Solution A and Solution B both include Cadion 2B (CAS No.","6708-61-8), which, in the presence of a surfactant at pH ˜9.6, forms a red-violet complex with silver.","Solution B, which serves as a control solution, further includes sodium thiosulfate, which binds silver more strongly than Cadion B and prevents any color change.","Solution A was prepared by dissolving 1.56 g of Solution A Dry Components (See, Table 7) and 1.9 mL of Solution A Liquid Components (See, Table 8) in 50 mL H2O.","TABLE 7 Solution A Dry Components Compound Percent Range (w/w) Potassium Borate 50%-60% Citric Acid 1%-5% Cadion 2B <0.1% CDTA, Disodium Magnesium Salt 30%-40% Sodium Citrate 10%-20% TABLE 8 Solution A Liquid Components Compound Percent Range (w/w) 1-Methyl-2-pyrrolidinone 70%-80% TWEEN ® 20 Polyoxyethylene (20) 20%-20% Sorbitanmonolaurate Solution B was prepared by transferring 25 mL of Solution A to a second vessel and adding 0.14 g sodium thiosulfate.","Solution A and Solution B were stored in dropper bottles.","The directions for use are as follows: 1.Ensure adequate lighting directly over the observation area.","2.Wearing Nitrile gloves and eye protection, remove both bottles (labeled Solution A and Solution B) from test kit.","3.Fold sample textile three times over itself (gather at least 8 layers) and place multi-layered section into the well-lit observation area.","4.Remove caps from both bottles and prepare to test.","5.Place 3 drops of Solution A onto a single spot, immediately place 3 drops of Solution B onto a spot located at least 1″ to the right of the previous drops.","Spots should not merge.","6.Replace caps and return bottles to package.","7.In 30 seconds, review the spots for color change.","After following the above directions, a difference in color indicates that that an efficacious level of silver is present in the tested textile.","While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art.","The various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated by the following claims."]],"string":"[\n [\n \"Systems And Processes For Treating Textiles With An Antimicrobial Agent\",\n \"According to an aspect of the present disclosure, a method of treating a textile with an antimicrobial agent over a plurality of laundry cycles each including a wash cycle and a treatment cycle.\",\n \"The method includes (a) receiving a textile in a wash system for a first laundry cycle, (b) initiating a wash cycle comprising a detergent, (c) initiating a post-detergent treatment cycle comprising dosing the textile with a solution having a predetermined concentration of an antimicrobial agent that comprises a metallic ion, and (c) repeating steps (a)-(c) for each of a plurality of additional laundry cycles.\",\n \"The predetermined concentration is insufficient to achieve a predetermined antimicrobial efficacy for the textile due to the first laundry cycle alone but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of the first laundry cycle and one or more of the plurality of additional laundry cycles.\"\n ],\n [\n \"1-25.\",\n \"(canceled) 26.A method of reducing a microbial load in an inventory of textiles comprising a plurality of pieces at a healthcare facility, the method comprising: (a) receiving a first portion comprising a portion of the plurality of pieces of the inventory; (b) initiating a laundry cycle comprising a wash cycle and a treatment cycle, wherein the treatment cycle comprises a solution having a predetermined concentration of an antimicrobial agent that comprises a metallic ion; (c) receiving a subsequent portion of the inventory and repeating steps (b) in a subsequent laundry cycle for the subsequent portion, and (d) repeating step (c) until a predetermined amount of the pieces of the inventory have achieved the predetermined antimicrobial efficacy, thereby reducing the antimicrobial load of the inventory.\",\n \"27.The method of claim 26, wherein a single laundry cycle is insufficient to achieve the predetermined antimicrobial efficacy.\",\n \"28.The method of claim 26, wherein the subsequent portion includes a plurality of pieces from the first portion.\",\n \"29.The method of claim 26, wherein the predetermined amount of the pieces comprises at least 50% of the inventory.\",\n \"30.The method of claim 26, wherein the predetermined antimicrobial efficacy is achieved when the textile is infused with at least approximately 1 mg of metallic ion per kg of textile.\",\n \"31.The method of claim 26, wherein the solution comprises water treated by deionization or reverse osmosis.\",\n \"32-51.\",\n \"(canceled)\"\n ],\n [\n \" BACKGROUND Microbial contamination of textiles can contribute to the spread of infectious diseases, including healthcare associated infections, which are among the leading causes of preventable deaths in the United States and are associated with a substantial increase in health care costs each year.\",\n \"In other instances, microbial contaminations can cause unsightly stains and unpleasant odors.\",\n \"In one prior approach to providing a textile having antimicrobial properties, the textile is treated with an antimicrobial agent during a textile manufacturing process.\",\n \"For example, the fibers of the textile are embedded or coated with antimicrobial agent during the manufacturing process.\",\n \"However, the total amount of antimicrobial agent is fixed at the point of conversion of the fibers into a textile and the efficacy declines over time as the antimicrobial agent in the fabric is washed away when laundered and never restored.\",\n \"Moreover, this approach has proven to be unsatisfactory to market participants.\",\n \"In addition to the efficacy/performance issues noted above, these products require commercial linen users, such as hospitals and other health care delivery facilities, to make a large upfront capital investment to purchase a new, antimicrobial agent-impregnated, linen inventory and discard existing and otherwise useable inventory.\",\n \"Further, the products may exhibit a soiled off-white discoloration appearance, may be uncomfortable to the touch, and are known to be difficult to launder, dry and press verses traditional linens.\"\n ],\n [\n \" SUMMARY In one aspect, the disclosure is directed to a method of treating a textile with an antimicrobial agent over a plurality of laundry cycles including a wash cycle and a treatment cycle.\",\n \"The method includes the steps of (a) receiving a textile in a wash system for a first laundry cycle, (b) initiating a wash cycle including a detergent, (c) initiating a post-detergent treatment cycle including dosing the textile with a solution having a predetermined concentration of an antimicrobial agent that includes a metallic ion, and repeating steps (a)-(c) for each of a plurality of additional laundry cycles, wherein the predetermined concentration is insufficient to achieve a predetermined antimicrobial efficacy for the textile due to the first laundry cycle alone but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of the first laundry cycle and one or more of the plurality of additional laundry cycles.\",\n \"The treatment cycle may be a rinse cycle.\",\n \"The textile may include an inventory of plurality of pieces.\",\n \"The metallic ion may be a silver ion.\",\n \"In various embodiments of the disclosure, the predetermined antimicrobial efficacy is achieved when the textile is infused with at least approximately 0.6 mg of metallic ion per kg of textile.\",\n \"The plurality of laundry cycles may include at least three cycles to provide the predetermined concentration in the textile.\",\n \"The predetermined concentration is such that a content of the antimicrobial agent infused into the textile is less than approximately 0.5 mg of metallic ion per kg of textile in response to steps (a)-(c) performed for the first laundry cycle.\",\n \"The predetermined concentration is approximately 0.5 mg to approximately 50 mg of antimicrobial agent per kilogram of textile.\",\n \"In an example method of the disclosure, the textile is dosed with the antimicrobial solution by diluting a concentrated metal ion solution in a container of the wash system containing the textile.\",\n \"The diluting is accomplished by transferring the concentrated metal ion solution to the container at a rate of approximately 1 ml/sec to 30 ml/sec.\",\n \"The concentrate maybe transferred over a dosing period of 15 seconds to 120 seconds.\",\n \"In some instance, the dosing may include different or several dosing rates, for example, transfer rates between about 5 ml/min and about 1000 ml/min.\",\n \"Another aspect of the disclosure is directed to method for treating a textile with an antimicrobial agent wherein the quality of the water used in the method is taking into consideration.\",\n \"The method includes (a) measuring a quality of a water source for a washing system, (b) providing, in a first container, a first solution having a first predetermined liquid concentration of an antimicrobial agent that includes a metallic ion, such as a silver ion; (c) determining an amount of the first solution to transfer from the first container to the second container based on the measured quality of the water; (d) transferring, from the first container to the second container, the determined amount of the first solution to provide a second solution having a second liquid concentration of the antimicrobial agent in the second container; and (e) submerging the textile in the second solution at least one of prior to, during or after step (d) to infuse the textile with the antimicrobial agent.\",\n \"In one embodiment, steps (a)-(e) may be performed for an initial laundry cycle and steps (b), (d), and (e) are repeating in a plurality of subsequent laundry cycles, In the method, the second solution may include the water from the water source and the first solution.\",\n \"The method may also include providing an amount of the water from the water source to the second container prior to transferring the first solution from the first container to the second container, and measuring the quality of water using a sensor located in the second container.\",\n \"The determined amount of the first solution may be inversely related to the measured quality of the water such that a greater amount of the first solution is determined in response to a measurement of poor quality of water than is determined in response to a measurement of good quality of water.\",\n \"For example, the first predetermined liquid concentration may be approximately 200 PPM to approximately 5000 PPM.\",\n \"Also, the amount of the first solution may be determined such that the second concentration of the second solution is approximately 7.6 PPM (aq) to approximately 115 PPM (aq) responsive to the measured quality of water having a Relative Water Quality (RWQ) number of approximately 0 RWQ to approximately 5 RWQ.\",\n \"The submerging the textile in the second solution may include agitating the textile for between 30 seconds and 120 seconds.\",\n \"A further aspect of the disclosure is a method of reducing a microbial load in an inventory of textiles comprising a plurality of pieces at a healthcare facility.\",\n \"The method includes (a) receiving a first portion including a portion of the plurality of pieces of the inventory in a wash basin for a laundry cycle; (b) initiating the laundry cycle including a wash cycle and a treatment cycle, wherein the treatment cycle includes a solution having a predetermined concentration of an antimicrobial agent that comprises a metallic ion; (c) receiving a subsequent portion of the inventory and repeating steps (a) and (b) in a subsequent laundry cycle for the subsequent portion, and repeating step (c) until a predetermined amount of the pieces of the inventory have achieved the predetermined antimicrobial efficacy, thereby reducing the antimicrobial load of the inventory.\",\n \"In various embodiments, the subsequent portion may include a plurality of pieces from the first portion.\",\n \"The predetermined amount of the pieces may include at least 50% of the inventory.\",\n \"In other embodiments, a single laundry cycle is insufficient to achieve the predetermined antimicrobial efficacy.\",\n \"The predetermined antimicrobial efficacy may be achieved when the textile is infused with at least approximately 1 mg of metallic ion per kg of textile.\",\n \"In yet another aspect, the disclosure is directed to a method of protecting individuals in contact with healthcare facility linen inventory from a healthcare acquired infection.\",\n \"The method includes (a) receiving, in one or more batches at a healthcare facility, an inventory of washable, non-disposable textiles that contact patients and healthcare workers; (b) washing each batch using a detergent; and (c) for each batch, after washing the batch, treating the batch with a solution including a predetermined liquid concentration of a metallic ion to reduce the microbial load on the textiles in the batch and improve a resistance of the textiles in the batch to microbial contamination responsible for a healthcare acquired infections.\",\n \"The predetermined concentration may be such that a content of the antimicrobial agent infused into each textile is less than approximately 0.5 mg 0.75 mg of metallic ion per kg of textile in response to (c) performed during an initial laundering process and the method further includes repeating steps (a)-(c) at least once to incrementally increase the content of the antimicrobial agent infused into each textile to greater than 1 mg of metallic ion per kg of textile.\",\n \"The solution may include water treated by deionization or reverse osmosis.\",\n \"In various embodiments, the method may include treating clean textiles that have not entered the healthcare facility.\",\n \"Textiles may be a mixture of clean textiles and soiled textiles.\",\n \"The predetermined concentration of metallic ion may be achieved in a single treatment or the predetermined concentration of the metallic ion may be achieved after two or more treatments.\",\n \"Still further, the disclosure is directed to a method of infusing textiles with an antimicrobial agent.\",\n \"The method includes (a) providing a tunnel washer having an intake, a discharge, and a plurality of modules that segment an interior of the tunnel washer between the intake and the discharge, wherein the plurality of modules include an initial module at the intake a final module at the discharge; (b) moving the textile from the intake to the discharge through the plurality of modules; (c) washing the textile with a detergent at a wash module of the plurality of modules; (d) after washing the textile at the first module, rinsing the textile at a rinse module of the plurality of modules; and (e) treating the textile with a solution having a predetermined concentration of an antimicrobial agent at a treatment module, wherein the antimicrobial agent includes a metallic ion.\",\n \"The method may further include (f) extracting excess fluid, including at least a portion of the solution, from the textile after the treatment module; and (g) providing at least a portion of the extracted excess fluid to at least one of the rinse module or the wash module for processing a subsequent textile.\",\n \"The solution may include water treated by distillation, deionization or reverse osmosis.\",\n \"Even further, the disclosure is directed to a method of reducing the amount of silver required to reduce the antimicrobial burden in a textile subjected to a repeated wash cycles.\",\n \"The method includes, following a plurality of the wash cycles, treating the textile in a treatment cycle including a solution having predetermined concentration of an antimicrobial agent that includes a metallic ion, wherein the predetermined concentration is insufficient to achieve a predetermined antimicrobial efficacy for the textile in a first treatment cycle but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of a first treatment cycle and one or more of the plurality of additional treatment cycles.\",\n \"Another aspect of the disclosure is directed to a method for detecting the presence of silver in a textile.\",\n \"The method includes dispensing a first solution and the second solution onto separate areas of the textile and comparing the color of the dispensed first solution and the dispensed second solution.\",\n \"The first solution includes Cadion B, a buffer sufficient to maintain a pH in the range of from about 8 to about 10, and a surfactant.\",\n \"The second solution comprises Cadion B, a buffer sufficient to maintain a pH in the range of from about 8 to about 10, a surfactant, and a complexing agent, wherein formation of a complex of the complexing agent and silver is a more favorable than formation of a complex of Cadion B and silver.\",\n \"One or both solutions may also include a masking agent, such as ethylenediaminetetraacetic acid (EDTA) or cyclohexanediaminetetraacetic acid (CDTA).\",\n \"One or both solutions may also include a water-miscible organic solvent, such as 1-methyl-2-pyrrolidinone.\",\n \"The complexing agent may be sodium thiosulfate.\",\n \"The surfactant may be TWEEN® 20 or TRITON™ X-100.The buffer may include one or more of potassium tetraborate, citric acid, and sodium citrate.\"\n ],\n [\n \"FIELD The disclosure is directed to systems and methods for treating textiles with antimicrobial agents.\",\n \"BACKGROUND Microbial contamination of textiles can contribute to the spread of infectious diseases, including healthcare associated infections, which are among the leading causes of preventable deaths in the United States and are associated with a substantial increase in health care costs each year.\",\n \"In other instances, microbial contaminations can cause unsightly stains and unpleasant odors.\",\n \"In one prior approach to providing a textile having antimicrobial properties, the textile is treated with an antimicrobial agent during a textile manufacturing process.\",\n \"For example, the fibers of the textile are embedded or coated with antimicrobial agent during the manufacturing process.\",\n \"However, the total amount of antimicrobial agent is fixed at the point of conversion of the fibers into a textile and the efficacy declines over time as the antimicrobial agent in the fabric is washed away when laundered and never restored.\",\n \"Moreover, this approach has proven to be unsatisfactory to market participants.\",\n \"In addition to the efficacy/performance issues noted above, these products require commercial linen users, such as hospitals and other health care delivery facilities, to make a large upfront capital investment to purchase a new, antimicrobial agent-impregnated, linen inventory and discard existing and otherwise useable inventory.\",\n \"Further, the products may exhibit a soiled off-white discoloration appearance, may be uncomfortable to the touch, and are known to be difficult to launder, dry and press verses traditional linens.\",\n \"SUMMARY In one aspect, the disclosure is directed to a method of treating a textile with an antimicrobial agent over a plurality of laundry cycles including a wash cycle and a treatment cycle.\",\n \"The method includes the steps of (a) receiving a textile in a wash system for a first laundry cycle, (b) initiating a wash cycle including a detergent, (c) initiating a post-detergent treatment cycle including dosing the textile with a solution having a predetermined concentration of an antimicrobial agent that includes a metallic ion, and repeating steps (a)-(c) for each of a plurality of additional laundry cycles, wherein the predetermined concentration is insufficient to achieve a predetermined antimicrobial efficacy for the textile due to the first laundry cycle alone but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of the first laundry cycle and one or more of the plurality of additional laundry cycles.\",\n \"The treatment cycle may be a rinse cycle.\",\n \"The textile may include an inventory of plurality of pieces.\",\n \"The metallic ion may be a silver ion.\",\n \"In various embodiments of the disclosure, the predetermined antimicrobial efficacy is achieved when the textile is infused with at least approximately 0.6 mg of metallic ion per kg of textile.\",\n \"The plurality of laundry cycles may include at least three cycles to provide the predetermined concentration in the textile.\",\n \"The predetermined concentration is such that a content of the antimicrobial agent infused into the textile is less than approximately 0.5 mg of metallic ion per kg of textile in response to steps (a)-(c) performed for the first laundry cycle.\",\n \"The predetermined concentration is approximately 0.5 mg to approximately 50 mg of antimicrobial agent per kilogram of textile.\",\n \"In an example method of the disclosure, the textile is dosed with the antimicrobial solution by diluting a concentrated metal ion solution in a container of the wash system containing the textile.\",\n \"The diluting is accomplished by transferring the concentrated metal ion solution to the container at a rate of approximately 1 ml/sec to 30 ml/sec.\",\n \"The concentrate maybe transferred over a dosing period of 15 seconds to 120 seconds.\",\n \"In some instance, the dosing may include different or several dosing rates, for example, transfer rates between about 5 ml/min and about 1000 ml/min.\",\n \"Another aspect of the disclosure is directed to method for treating a textile with an antimicrobial agent wherein the quality of the water used in the method is taking into consideration.\",\n \"The method includes (a) measuring a quality of a water source for a washing system, (b) providing, in a first container, a first solution having a first predetermined liquid concentration of an antimicrobial agent that includes a metallic ion, such as a silver ion; (c) determining an amount of the first solution to transfer from the first container to the second container based on the measured quality of the water; (d) transferring, from the first container to the second container, the determined amount of the first solution to provide a second solution having a second liquid concentration of the antimicrobial agent in the second container; and (e) submerging the textile in the second solution at least one of prior to, during or after step (d) to infuse the textile with the antimicrobial agent.\",\n \"In one embodiment, steps (a)-(e) may be performed for an initial laundry cycle and steps (b), (d), and (e) are repeating in a plurality of subsequent laundry cycles, In the method, the second solution may include the water from the water source and the first solution.\",\n \"The method may also include providing an amount of the water from the water source to the second container prior to transferring the first solution from the first container to the second container, and measuring the quality of water using a sensor located in the second container.\",\n \"The determined amount of the first solution may be inversely related to the measured quality of the water such that a greater amount of the first solution is determined in response to a measurement of poor quality of water than is determined in response to a measurement of good quality of water.\",\n \"For example, the first predetermined liquid concentration may be approximately 200 PPM to approximately 5000 PPM.\",\n \"Also, the amount of the first solution may be determined such that the second concentration of the second solution is approximately 7.6 PPM (aq) to approximately 115 PPM (aq) responsive to the measured quality of water having a Relative Water Quality (RWQ) number of approximately 0 RWQ to approximately 5 RWQ.\",\n \"The submerging the textile in the second solution may include agitating the textile for between 30 seconds and 120 seconds.\",\n \"A further aspect of the disclosure is a method of reducing a microbial load in an inventory of textiles comprising a plurality of pieces at a healthcare facility.\",\n \"The method includes (a) receiving a first portion including a portion of the plurality of pieces of the inventory in a wash basin for a laundry cycle; (b) initiating the laundry cycle including a wash cycle and a treatment cycle, wherein the treatment cycle includes a solution having a predetermined concentration of an antimicrobial agent that comprises a metallic ion; (c) receiving a subsequent portion of the inventory and repeating steps (a) and (b) in a subsequent laundry cycle for the subsequent portion, and repeating step (c) until a predetermined amount of the pieces of the inventory have achieved the predetermined antimicrobial efficacy, thereby reducing the antimicrobial load of the inventory.\",\n \"In various embodiments, the subsequent portion may include a plurality of pieces from the first portion.\",\n \"The predetermined amount of the pieces may include at least 50% of the inventory.\",\n \"In other embodiments, a single laundry cycle is insufficient to achieve the predetermined antimicrobial efficacy.\",\n \"The predetermined antimicrobial efficacy may be achieved when the textile is infused with at least approximately 1 mg of metallic ion per kg of textile.\",\n \"In yet another aspect, the disclosure is directed to a method of protecting individuals in contact with healthcare facility linen inventory from a healthcare acquired infection.\",\n \"The method includes (a) receiving, in one or more batches at a healthcare facility, an inventory of washable, non-disposable textiles that contact patients and healthcare workers; (b) washing each batch using a detergent; and (c) for each batch, after washing the batch, treating the batch with a solution including a predetermined liquid concentration of a metallic ion to reduce the microbial load on the textiles in the batch and improve a resistance of the textiles in the batch to microbial contamination responsible for a healthcare acquired infections.\",\n \"The predetermined concentration may be such that a content of the antimicrobial agent infused into each textile is less than approximately 0.5 mg 0.75 mg of metallic ion per kg of textile in response to (c) performed during an initial laundering process and the method further includes repeating steps (a)-(c) at least once to incrementally increase the content of the antimicrobial agent infused into each textile to greater than 1 mg of metallic ion per kg of textile.\",\n \"The solution may include water treated by deionization or reverse osmosis.\",\n \"In various embodiments, the method may include treating clean textiles that have not entered the healthcare facility.\",\n \"Textiles may be a mixture of clean textiles and soiled textiles.\",\n \"The predetermined concentration of metallic ion may be achieved in a single treatment or the predetermined concentration of the metallic ion may be achieved after two or more treatments.\",\n \"Still further, the disclosure is directed to a method of infusing textiles with an antimicrobial agent.\",\n \"The method includes (a) providing a tunnel washer having an intake, a discharge, and a plurality of modules that segment an interior of the tunnel washer between the intake and the discharge, wherein the plurality of modules include an initial module at the intake a final module at the discharge; (b) moving the textile from the intake to the discharge through the plurality of modules; (c) washing the textile with a detergent at a wash module of the plurality of modules; (d) after washing the textile at the first module, rinsing the textile at a rinse module of the plurality of modules; and (e) treating the textile with a solution having a predetermined concentration of an antimicrobial agent at a treatment module, wherein the antimicrobial agent includes a metallic ion.\",\n \"The method may further include (f) extracting excess fluid, including at least a portion of the solution, from the textile after the treatment module; and (g) providing at least a portion of the extracted excess fluid to at least one of the rinse module or the wash module for processing a subsequent textile.\",\n \"The solution may include water treated by distillation, deionization or reverse osmosis.\",\n \"Even further, the disclosure is directed to a method of reducing the amount of silver required to reduce the antimicrobial burden in a textile subjected to a repeated wash cycles.\",\n \"The method includes, following a plurality of the wash cycles, treating the textile in a treatment cycle including a solution having predetermined concentration of an antimicrobial agent that includes a metallic ion, wherein the predetermined concentration is insufficient to achieve a predetermined antimicrobial efficacy for the textile in a first treatment cycle but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of a first treatment cycle and one or more of the plurality of additional treatment cycles.\",\n \"Another aspect of the disclosure is directed to a method for detecting the presence of silver in a textile.\",\n \"The method includes dispensing a first solution and the second solution onto separate areas of the textile and comparing the color of the dispensed first solution and the dispensed second solution.\",\n \"The first solution includes Cadion B, a buffer sufficient to maintain a pH in the range of from about 8 to about 10, and a surfactant.\",\n \"The second solution comprises Cadion B, a buffer sufficient to maintain a pH in the range of from about 8 to about 10, a surfactant, and a complexing agent, wherein formation of a complex of the complexing agent and silver is a more favorable than formation of a complex of Cadion B and silver.\",\n \"One or both solutions may also include a masking agent, such as ethylenediaminetetraacetic acid (EDTA) or cyclohexanediaminetetraacetic acid (CDTA).\",\n \"One or both solutions may also include a water-miscible organic solvent, such as 1-methyl-2-pyrrolidinone.\",\n \"The complexing agent may be sodium thiosulfate.\",\n \"The surfactant may be TWEEN® 20 or TRITON™ X-100.The buffer may include one or more of potassium tetraborate, citric acid, and sodium citrate.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS FIG.\",\n \"1 is a simplified block diagram of an example washer system according to aspects of the disclosure.\",\n \"FIG.\",\n \"2 is a chart illustrating an example model for determining an antimicrobial dosage based on measured water quality according to aspects of the disclosure.\",\n \"FIG.\",\n \"3 is a flowchart of an example process for treating textiles with an antimicrobial agent according to aspects of the disclosure.\",\n \"FIG.\",\n \"4 is a flowchart of another example process for treating textiles with an antimicrobial agent according to aspects of the disclosure.\",\n \"FIG.\",\n \"5 is a flowchart of yet another example process for treating textiles with an antimicrobial agent according to aspects of the disclosure.\",\n \"FIG.\",\n \"6 is a flowchart of a further example process for treating textiles with an antimicrobial agent according to aspects of the disclosure.\",\n \"FIG.\",\n \"7 is a flowchart of another example process for treating textiles with an antimicrobial agent according to aspects of the disclosure.\",\n \"FIG.\",\n \"8 shows the average CFU/plate for aerobic bacterial colonies before (control) and after silver application.\",\n \"Plates had a surface area of 28.27 cm2.FIG.\",\n \"9 shows the average CFU/plate for S. aureus colonies before (control) and after silver application.\",\n \"Plates had a surface area of 28.27 cm2.FIG.\",\n \"10 shows the average CFU/plate for MRSA colonies before (control) and after silver application.\",\n \"Plates had a surface area of 28.27 cm2.While the invention is susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the Figures and will be described in detail herein.\",\n \"It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed.\",\n \"Rather, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.\",\n \"It should be understood that other embodiments may include more or less of each element shown in a given Figure.\",\n \"Further, some of the illustrated elements may be combined or omitted.\",\n \"Yet further, an example embodiment may include elements that are not illustrated in the Figures.\",\n \"DESCRIPTION The following description describes various features and functions of the disclosed systems and methods with reference to the accompanying figures.\",\n \"In the Figures, similar symbols typically identify similar components, unless context dictates otherwise.\",\n \"The illustrative systems and methods described herein are not meant to be limiting.\",\n \"It will be readily understood that certain aspects of the disclosed systems and methods can be arranged and combined in a wide variety of different configurations, all of which are contemplated herein.\",\n \"According to aspects of the disclosure, systems and processes are described and illustrated for treating textiles with an antimicrobial agent.\",\n \"The terms fabric, linen, and textile are used interchangeably herein.\",\n \"Aspects of the disclosure may be described in the context of a single textile for ease of description; however, it should be understood that such aspects can be extended to include processes and devices in the context of multiple textiles such as an inventory of textiles having multiple pieces.\",\n \"The systems and processes for treating textiles with the antimicrobial agent can mitigate healthcare associated infections (HAIs).\",\n \"HAIs are infections that people acquire while they are receiving treatment in a health care setting for other ailments.\",\n \"HAIs may be caused by any infectious agent, including bacteria, fungi, and viruses, as well as other less common types of pathogens.\",\n \"HAIs can be acquired anywhere health care is delivered, including inpatient acute care hospitals, outpatient settings such as ambulatory surgical centers and end-stage renal disease facilities, and long-term care facilities such as nursing homes and rehabilitation centers.\",\n \"In addition, those persons in contact with soiled laundry from a healthcare facility, including care givers and persons in the laundry supply chain, are at risk of infection.\",\n \"The disclosure is also related to treating textiles from other sources other than health care facilities.\",\n \"For example, garments worn by sports teams are known for harboring infection agents.\",\n \"In essence, the devices and method of the disclosure can be used to treat textiles from any source that could benefit from lowering of the microbial content of the textiles.\",\n \"Accordingly, one aspect of the disclosure is directed to method of treating a textile with an antimicrobial agent over a plurality of laundry cycles including a wash cycle and a post-wash/post-detergent treatment cycle that provides for dosing the textile with a solution having a predetermined concentration of an antimicrobial agent that includes a metallic ion, such as for example a silver ion.\",\n \"In this aspect, the predetermined concentration of the agent is insufficient to achieve a predetermined antimicrobial efficacy for the textile due to the first laundry cycle alone but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of the first laundry cycle and one or more additional laundry cycles.\",\n \"The laundry cycle may include additional cycles, for example a prewash cycle, a rinse cycle, or the treatment cycle may be combined with the rinse cycle.\",\n \"In an example method of the disclosure, the textile is dosed with the antimicrobial solution by diluting a concentrated metal ion solution in a container of the wash system containing the textile.\",\n \"The diluting is accomplished by transferring the concentrated metal ion solution to the container at a rate of approximately 1 ml/sec to 30 ml/sec.\",\n \"The concentrate maybe transferred over a dosing period of 15 seconds to 120 seconds.\",\n \"In some instance, the dosing may include different or several dosing rates, for example, transfer rates between about 5 ml/min and about 1000 ml/min.\",\n \"The method for treating a textile with an antimicrobial agent may include consideration of the water quality used in an antimicrobial solution and/or the treatment bath.\",\n \"Accordingly, the quality of a water source for the washing system may be determined, for example, in association with providing a first solution having a first predetermined liquid concentration of an antimicrobial agent that includes a metallic ion to a first container.\",\n \"For example, a concentrated silver ion solution may be added to a first container to create a first solution.\",\n \"The amount of the first solution that is transferred from the first container to a second container to create a second solution, for instance the treatment bath, is determined based on the measured quality of the water.\",\n \"The determined amount of the first solution is used to create the second solution with a second liquid concentration of the antimicrobial agent in the second container.\",\n \"The textile is submerged in the second solution (or precursor) prior to, during and/or after the solution is created in or provided to the second container.\",\n \"For example, the first solution is added to a rinse solution that includes the textiles, or the rinse solution may be replaced in the container with the second solution.\",\n \"Water from the water source may be provided to the second container prior to transferring the first solution from the first container to the second container.\",\n \"A sensor may be located in the second container to measure the quality of the water provided in the second container.\",\n \"When water quality is consistent, the determination and use of the water quality in a first laundry cycle may be used in second or subsequent cycles.\",\n \"The determined amount of the first solution may be inversely related to the measured quality of the water such that a greater amount of the first solution for use in the second solution is determined in response to a measurement of poor quality of water than is determined in response to a measurement of good quality of water.\",\n \"In some embodiment, the second solution may include the water from the water source and the first solution.\",\n \"The amount of the first solution may be determined such that the second concentration of the second solution is approximately 7.6 PPM (aq) to approximately 115 PPM (aq) responsive to the measured quality of water.\",\n \"For example, the first predetermined liquid concentration may be approximately 200 PPM to approximately 5000 PPM.\",\n \"At least one of the first solution or the second solution may include water treated by distillation, deionization or reverse osmosis.\",\n \"The time that the textile spends in the second solution depends on a number of factors including concentration of anti-microbial agent in the solution, water quality, and textile type.\",\n \"From a commercial perspective, the textile should spend as little as time as possible to achieve the desired level of antimicrobial agent in the textile.\",\n \"For example, the textile may spend between 30 seconds and 120 seconds, which may include agitation.\",\n \"Another aspect of the disclosure involves a method of reducing a microbial load in an inventory of textiles including a plurality of pieces at a healthcare facility.\",\n \"Pieces refers to individual gowns, sheet, towels, uniforms, lab coats and other textiles associated with the facility.\",\n \"The method receiving a first portion of the plurality of pieces of the inventory in a wash basin for a laundry cycle, which includes a wash cycle and a treatment cycle.\",\n \"The treatment cycle includes submerging the textiles in a solution having a predetermined concentration of an antimicrobial agent that includes a metallic ion, for example a silver ion.\",\n \"The method also includes receiving a subsequent portion of the inventory, which may include pieces from the first portion of the inventory, and repeating step laundry cycle.\",\n \"Regular treatment of portions of a textile inventory will result in all, almost all, most or many of the pieces of the inventory achieving an antimicrobial efficacy, thereby reducing the antimicrobial load of the inventory.\",\n \"In general, a predetermined number of pieces or percentage of the inventory can be defined as requiring a predetermined amount of antimicrobial efficacy.\",\n \"For example, regular treatment of portions of an inventory can result in at least 50%, at least 75%, at least 85%, at least 95%, at least 99%, or 100% of all of the pieces of textile in inventory achieving a predetermined level of antimicrobial efficacy.\",\n \"In one example the predetermined antimicrobial efficacy may be achieved when the textile is infused with at least approximately 1 mg of metallic ion per kg of textile.\",\n \"Methods of the disclosure require the use of the antimicrobial solution, which may be supplied to the laundry facility in several ways.\",\n \"A supplier can deliver pre-prepared dilute solutions for direct addition to a treatment cycle, or the supplier can deliver a concentrate that may require dilution before addition to a treatment cycle.\",\n \"In addition, solutions may be created on-site using a variety of known methods for creating metallic ion solutions.\",\n \"Suppliers of wash chemistry often provide instructions, hardware and software for implementing laundry cycles.\",\n \"Accordingly, in one aspect, the disclosure is directed to a method for treating a textile with an antimicrobial agent that includes providing an antimicrobial solution to a laundry facility and instructing the facility on a method for treating the textiles as described herein.\",\n \"For instance, the instruction may include the steps for treating a textile with an antimicrobial agent over a plurality of laundry cycles including a wash cycle and a post-wash/post-detergent treatment cycle that provides for dosing the textile with a solution having a predetermined concentration of an antimicrobial agent that includes a metallic ion, such as for example a silver ion.\",\n \"In this aspect, the instructions may provide the parameters for a predetermined concentration of the agent in the treatment cycle that is insufficient to achieve a predetermined antimicrobial efficacy for the textile due to the first laundry cycle alone but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of the first laundry cycle and one or more additional laundry cycles.\",\n \"The instructions may also include information regarding rates of addition of ion solutions to the treatment bath.\",\n \"The instructions can include steps for monitoring water quality associated with a process for treating textiles with an antimicrobial agent.\",\n \"As an example, the disclosure is directed to the delivery of an antimicrobial agent to a laundry facility with instructions for treating textiles to a with the antimicrobial agent, wherein the instructions include steps for measuring the quality of the facilities water source and for adjusting the concentration of the antimicrobial agent in a treatment cycle based upon the quality of the water.\",\n \"The instructions may also include steps for treating an inventory of laundry from a healthcare facility, wherein the steps include receiving portions of the healthcare facilities laundry inventory and processing those portions until a predetermined number of pieces of the inventory achieve a predetermined antimicrobial efficacy.\",\n \"The instructions may include the predetermined number of pieces and the predetermined efficacy.\",\n \"The disclosure is applicable to all types of laundry systems.\",\n \"For example, the systems and processes of the disclosure can be utilized to treat an inventory of washable, non-disposable textiles in a batch by batch process.\",\n \"For instance, batch-type laundry systems are described in U.S. Pat.\",\n \"No.\",\n \"8,641,967, U.S. Patent Appl.\",\n \"Publication No.\",\n \"2015/0159314, Patent Appl.\",\n \"Publication No.\",\n \"2015/0159319, Patent Appl.\",\n \"Publication No.\",\n \"2015/0047718, and U.S. application Ser.\",\n \"No.\",\n \"13/968,084 filed Aug. 15, 2013, which are incorporated by reference in their entirety.\",\n \"In an exemplary aspect, a washer system includes a continuous batch washer (i.e., tunnel washer) that implements or improves antimicrobial treatment of a textile during a laundry cycle.\",\n \"The tunnel washer includes an intake, a discharge, and a plurality of modules that segment an interior of the tunnel washer between the intake and the discharge.\",\n \"The plurality of modules include at least one wash module in which the textile is washed with a detergent and at least one rinse module in which the textile is rinsed after being washed.\",\n \"A rinse module or a last module before the discharge may be a treatment module in which the textile is treated with an antimicrobial agent.\",\n \"By treating the textile with the antimicrobial agent in the rinse module or a last module before the discharge, greater amounts of antimicrobial agent are retained by the textile upon completion of the laundry cycle.\",\n \"This is, in part, because treating the textile in the rinse module or a last module mitigates leaching of antimicrobial agent content from the textile, which would otherwise occur if the textile was treated before or during a wash cycle.\",\n \"Further advantage may be obtained by treating the textile with the antimicrobial agent in a last module after a rinse cycle to ensure that some of antimicrobial agent is not rinsed away.\",\n \"In some additional or alternative aspects of the disclosure, after treating the textile, the textile is subjected to an extraction device operable to extract fluids, for example rinse water, from the textile.\",\n \"The extracted fluids may contain excess antimicrobial agent that was not infused into the textile.\",\n \"Advantageously, the washer system may recirculate the extracted fluids back into the tunnel washer so as to substantially reduce (or eliminate) wasted antimicrobial agent.\",\n \"Additionally, recirculating the extracted fluids reduces the amount of antimicrobial agent content in waste water effluent, thus mitigating the extent to which waste water effluent needs to be treated to comply with environmental regulations.\",\n \"In some implementations, at least a portion of the extracted fluid is provided to a rinse module.\",\n \"In additional or alternative implementations, at least a portion of the extracted fluid is provided to other areas of the tunnel washer such as, for example, the intake or a pre-wash module.\",\n \"In further additional or alternative implementations, at least a portion of the extracted fluid is provided to the treatment module.\",\n \"In further additional or alternative aspects of the disclosure, the washer system can measure a quality of the water and, based on the measured water quality, determine a dosage or concentration of antimicrobial agent in a treatment cycle for treating the textile.\",\n \"The washer system may then controllably adjust an amount of antimicrobial agent in the treatment cycle to achieve the determined dosage and treat the textile.\",\n \"In this way, problems associated with poor or changed water quality can be mitigated during treatment of the textile from batch to batch, day to day, and so on.\",\n \"According to additional or alternative aspects of the disclosure, a process for treating a textile with an antimicrobial agent is provided.\",\n \"In particular, a process is provided for incrementally loading a textile to an efficacious antimicrobial content level over multiple laundry cycles.\",\n \"This approach provides substantial cost savings over the useful life of the textile as compared to existing antimicrobial treatment approaches.\",\n \"For instance, the typical useful life of a linen processed in a commercial laundry may be less than 35 wash cycles.\",\n \"Over the life of the linen, the process requires less antimicrobial agent to maintain the antimicrobial efficacy than other approaches.\",\n \"Referring now to FIG.\",\n \"1, a simplified block diagram of an example washer system 100 is illustrated according aspects of the disclosure.\",\n \"As shown in FIG.\",\n \"1, the washer system 100 includes a tunnel washer 112 having an intake 114 at a first end and a discharge 116 at a second end.\",\n \"The intake 114 receives one or more textiles to be washed and treated.\",\n \"In one example, the intake 114 can be in the form of a hopper that can receive a batch of textiles into the tunnel washer 112.The discharge 116 facilitates transferring clean, treated textiles from the tunnel washer 112 to a fluid-extraction device 118.In one example, the discharge 116 can be in the form of a slide or a chute that transports the washed textiles towards the fluid-extraction device 118.In another example, the discharge 116 can include a receptacle for holding the washed textiles until the fluid-extraction device 118 is ready to receive the washed textiles.\",\n \"The fluid-extraction device 118 can be, for example, a centrifugal extractor and/or a mechanical press.\",\n \"The tunnel washer 112 includes an outer housing 117, which defines an interior of the tunnel washer 112.The interior of the tunnel washer 112 is segmented by a plurality of modules 120A-120F between the intake 114 and the discharge 116.In the illustrated example, the modules 120A-120F are formed as a plurality of rotating drums separated from each other by lateral side walls.\",\n \"During operation, the textiles to be washed and treated sequentially move through the modules 120A-120F in the direction of arrow A, entering the outer housing 117 at the intake 114 and exiting the outer housing 117 at the discharge 116.To do so, the modules 120A-120F transfer textiles from one module to the next by a top transfer arrangement and/or a bottom transfer arrangement.\",\n \"For example, the drums may have inlets and outlets on opposing sides of the drums so that the textiles may be transferred through the outlet in one drum into the inlet in the next drum.\",\n \"In some implementations, each drum can further include a scoop-like member mounted within the drum to facilitate transferring the textiles via the inlets and outlets.\",\n \"The scoop-like members can be configured such that oscillating the drums within a limited range of rotation does not transfer the textiles between drums, but instead imparts mechanical action to the textiles to promote the wash and treatment process.\",\n \"However, when the drums are rotated beyond the limited range of rotation, the scoop-like members receive and transport the textiles to the outlets of the drums.\",\n \"In this way, the textiles entering the tunnel washer 112 at the intake 114 are transported through each of the modules 120A-120F in sequence to the discharge 116.Although the modules 120A-120F are described as rotating drums in the above example, it should be understood that the modules 120A-120F can be formed in other ways such as, for example, by an Archimedean screw within the outer housing 117.Additionally, it should be understood that the modules 120A-120F can have a single-drum construction (i.e., a single drum containing both the fluids and the textiles), a double-drum construction (i.e., each module has a stationary, exterior drum to hold fluids and a rotating, perforated inner drum to move textiles in the fluids), or a combination of single- and double-drum constructions.\",\n \"In practice, the tunnel washer 112 can include one or more pre-wash modules, one or more main wash modules, one or more rinse modules, one or more neutralization modules, and/or one or more treatment modules according to aspects of the disclosure.\",\n \"The pre-wash module(s) define a pre-wash zone of the tunnel washer 112, the main wash module(s) define a main wash zone, the rinse module(s) define a rinse zone, the neutralization module(s) define a neutralization zone, and the treatment module(s) define a treatment zone of the tunnel washer 112.The number of modules utilized to form these zones in the tunnel washer 112 may vary in different example implementations.\",\n \"In the illustrated example, the tunnel washer 112 has a pre-wash zone provided by the intake 114 as described in further detail below.\",\n \"The pre-wash zone facilitates initial wetting of the textiles and, optionally, applying heat and wash chemistry early in the process to remove soil from the textiles prior to entering the main wash zone.\",\n \"The tunnel washer 112 has a main wash zone formed by a first module 120A, a second module 120B, and a third module 120C.\",\n \"The modules 120A-120C of the main wash zone may apply heat, steam, wash agents (e.g., a detergent, alkali, bleach, etc.\",\n \"), and/or mechanical action to facilitate removing soil from the textiles.\",\n \"The tunnel washer 112 next includes a rinse zone formed by a fourth module 120D and a fifth module 120E.\",\n \"The modules 120D-120E of the rinse zone facilitate removing residual wash agents carried over during transfer of the textiles from the main wash zone.\",\n \"The tunnel washer 112 lastly includes a treatment zone formed by a sixth module 120F in which the textiles are treated with the antimicrobial agent.\",\n \"By treating the textile with the antimicrobial agent in the last module 120F before the discharge 116, greater amounts of antimicrobial agent are retained by the textile upon completion of the laundry cycle.\",\n \"This is, in part, because treating the textile in the last module 120F mitigates leaching of antimicrobial agent content from the textile, which would otherwise occur if the textile was further washed or rinsed after being treated with the antimicrobial agent.\",\n \"In other embodiments, the rinse module and treatment module are combined, such that rinsing the textiles and treating the textiles with an antimicrobial agent occurs in the same module or modules.\",\n \"Indeed, in some aspects, the solution used to treat the textiles also performs the functions of a rinse to remove residual wash agents from the textiles.\",\n \"Although the illustrated example has six modules, it should be understood that the tunnel washer 112 can have more or fewer modules according to alternative aspects of the disclosure.\",\n \"For instance, in some alternative examples, the tunnel washer 112 can have eight to twelve modules.\",\n \"It also should be understood that, in some alternative examples, the pre-wash functions can be provided in one or more pre-wash module(s) instead of the intake 114.And it should be understood that, in some alternative examples, the tunnel washer 112 can include a neutralization zone, between the rinse zone and the treatment zone, to facilitate neutralizing residual alkali, detergent, and/or bleach carried over during transfer of the textiles from the rinse zone.\",\n \"In some examples, the neutralization zone may be further utilized to apply a softener and/or starch to the textiles.\",\n \"To facilitate adding, removing, and/or transferring water and chemicals in the modules 120A-120F, the tunnel washer 112 can include one or more drains, water sources, chemical sources, fluid tanks, flow lines, valves, pumps, nozzles, and/or weir plates.\",\n \"In the illustrated example, the washer system 100 includes a fresh water source 122, a polished water source 124, and a tempered water source 126.The fresh water source 122 can provide, for example, cold fresh water (e.g., water supplied by a municipality).\",\n \"The polished water source 124 can provide water treated by one or more filtration processes such as, for example, a deionization process, a reverse osmosis process, a granulated activated carbon (GAC) filtration process, a distillation process, or a combination thereof.\",\n \"The tempered water source 126 can provide water that has been heated, for example, to a temperature between approximately 85 degrees Fahrenheit and approximately 100 degrees Fahrenheit (i.e., between approximately 29 degrees Celsius and 43 degrees Celsius).\",\n \"Also, in the illustrated example, a flow line 130 provides fresh water from the fresh water source 122 to the fifth module 120E, a flow line 132 provides polished water from the polished water source 124 to the fifth module 120E, and a flow line 134 provides tempered water from the tempered water source 126 to the fifth module 120E.\",\n \"Although the flow lines 130, 132, 134 are illustrated as separate from one another, one or more of the flow lines 130, 132, 134 may be coupled so as to provide a mixture of fresh water, polished water, and/or tempered water to the fifth module 120E in other examples.\",\n \"In general, the amount and/or composition of fluid supplied by the sources 122, 124, 126 at a given time may be based on various criteria such as, for example, a measurement of an amount of total dissolved solids (TDS), a hardness, an anions species, etc.\",\n \"by one or more sensors (not shown) in one or more modules 120A-120E.\",\n \"To supply the modules 120A-120D with fluids, the tunnel washer 112 counterflows fluids from the fifth module 120E towards the intake 114.In this way, the textiles continuously encounter cleaner fluids as the textiles are progressed through the tunnel washer 112 from the intake 114 to the discharge 116.Depending on the construction of the modules 120A-120E, the tunnel washer 112 may transfer fluids by direct counterflow (e.g., fluid flowing through or over lateral side walls due to gravity) and/or indirect counterflow (e.g., via external flow lines and pumps between the modules 120A-120E).\",\n \"Commercially available examples of indirect counterflow systems are the CBW® Tunnel Washer and the PBW® Tunnel Washer, including PULSEFLOW® technology (Pellerin Milnor Corporation, Kenner, La.).\",\n \"In the illustrated example, a combination of direct counterflow and indirect counterflow can be employed to achieve example fluid levels shown in FIG.\",\n \"1 for each module 120A-120E.\",\n \"In particular, direct counterflow is utilized for transferring fluids within the rinse zone and for transferring fluids within the main wash zone, whereas indirect counterflow is utilized for transferring fluids from the treatment zone or rinse zone to the main wash zone.\",\n \"This arrangement may help to separate the rinse and wash zones.\",\n \"In one non-limiting implementation of the illustrated example, the fluid within the fifth module 120E can counterflow back to the fourth module 120D via a weir plate (not shown).\",\n \"The fluid within the fourth module 120D can counterflow back to the third module 120C via a pump (not shown).\",\n \"Using a pump allows the fluid level in the third module 120C to be higher than the fluid level in the fourth module 120D, as shown in FIG.\",\n \"1.The fluid in the third module 120C then can counterflow back to the second module 120B and the fluid in the second module 120B can counterflow back to the first module 120A via weir plates.\",\n \"The first module 120A may include a weir plate that facilitates transferring excess fluids in the first module 120A to a drain 154.It should be understood that other example implementations for counterflowing fluids from the fifth module 120E to the first module 120A are possible.\",\n \"The washer system 100 also includes an antimicrobial agent source 128.The antimicrobial agent source 128 can include any device suitable for holding and/or supplying an antimicrobial agent to the tunnel washer 112.Example devices and processes for supplying the antimicrobial agent to the tunnel washer 112 are described in U.S. Pat.\",\n \"No.\",\n \"8,641,967, U.S. Patent Appl.\",\n \"Publication No.\",\n \"2015/0159314, Patent Appl.\",\n \"Publication No.\",\n \"2015/0159319, Patent Appl.\",\n \"Publication No.\",\n \"2015/0047718, and U.S. application Ser.\",\n \"No.\",\n \"13/968,084 filed Aug. 15, 2013, the contents of which are incorporated by reference in their entirety.\",\n \"In some of such examples, the antimicrobial source 128 may dilute the antimicrobial agent from a first concentration to a second, lower concentration prior to supplying the antimicrobial agent to the tunnel washer 112.In other examples, the antimicrobial agent can be received in the antimicrobial agent source 128 in the same concentration in which it is supplied to the tunnel washer 128.In some aspects, the antimicrobial agent can include a metallic ion such as, for example, silver ions.\",\n \"For instance, the antimicrobial agent can include silver nitrate, silver acetate, silver oxide, silver chloride, silver carbonate, silver sulfate, etc.\",\n \"One benefit to using an antimicrobial agent including silver ions is that such antimicrobial agents may cause less skin irritation and may be less detectable by a user than other antimicrobial agents.\",\n \"Nonetheless, it should be understood that other antimicrobial agents can be utilized such as, for example, other metallic ions (e.g., copper, zinc, etc.).\",\n \"The washer system 100 further includes a flow line 136 for providing an antimicrobial solution from the antimicrobial agent source 128 to the sixth module 120F.\",\n \"The antimicrobial solution may include a concentration of antimicrobial agent.\",\n \"A flow meter 137 and a flow control device 139 can be coupled to the flow line 136 to respectively monitor and control the amount of antimicrobial solution (and, thus, the amount of antimicrobial agent) that is provided from the antimicrobial source 128 to the sixth module 120F.\",\n \"The flow control device 139 can include, for example, a peristaltic pump, a diaphragm pump, a solenoid valve, etc.\",\n \"The sixth module 120F may be initially filled with a combination of fresh water and antimicrobial solution from the fresh water source 122 and the antimicrobial agent source 128, respectively.\",\n \"A flow line from the fresh water source 122 to the sixth module 120F is omitted for clarity of illustration.\",\n \"After the initial setup, additional fluids may be supplied to the sixth module 120F via the transfer of textiles from the fifth module 120E and the antimicrobial agent source 128.In one aspect, the antimicrobial solution from the antimicrobial agent source 128 is added to fresh water or other process water in the treatment module 120F.\",\n \"The concentration of the antimicrobial agent (i.e., the dosage of antimicrobial agent) applied to textiles in the module 120F may be expressed in terms of mg of antimicrobial agent per Kg of textile in the module 120F (i.e., a dry weight concentration) or, alternatively, in terms of parts per million (PPM) in an aqueous solution (i.e., a liquid concentration).\",\n \"In some examples, the antimicrobial solution can be controllably added to the module 120F to achieve a concentration of approximately 0.5 to approximately 50 mg of antimicrobial agent per 1 Kg of textile in the module 120F.\",\n \"In other examples, the antimicrobial agent can be applied to textiles at a concentration greater than approximately 8 mg antimicrobial agent per 1 Kg of textile and, in still other examples, a concentration greater than approximately 10 mg antimicrobial agent per 1 Kg of textile.\",\n \"In some implementations, the concentration utilized for a particular batch of textiles may be based on the type of textile materials in the batch as different materials may have different uptake yield rates, which reflects the percent of the antimicrobial agent that becomes associated with the textile during the treatment.\",\n \"Table 1 illustrates example yields for example dosages of textiles of different materials.\",\n \"TABLE 1 Silver Content (mg/kg) Linen Dosage Yield Type Batch (mg/kg) 1 2 3 AVG (%) Cotton Lot 1 1 1.1 0.8 1.3 1.1 107 Lot 2 1 0.7 0.8 0.7 0.7 73 Lot 3 1 0.7 0.7 0.8 0.7 73 Cotton/Poly Lot 1 1.5 1.1 1.0 1.1 1.1 71 Blend Lot 2 1.5 0.9 1.9 2.9 1.9 127 Lot 3 1 0.9 0.9 0.9 0.9 90 Spandex Lot 1 3.4 1.4 1.6 1.6 1.5 45 Lot 2 3.4 1.5 1.7 1.6 1.6 47 Lot 3 3.4 1.6 1.6 1.6 1.6 47 Polyester Lot 1 3.4 nd 0.6 nd 0.6 18 Lot 2 3.4 0.7 0.8 0.6 0.7 21 Lot 3 3.4 1 0.9 0.9 0.9 27 Lot 4 4 0.9 0.9 0.9 0.9 23 Nylon Lot 1 35 1.6 1.8 1.5 1.6 5 Spandex Lot 2 35 1.4 1.3 1.4 1.4 4 Blend Lot 3 35 1.2 1.4 1.3 1.3 4 100% Lot 1 35 0.9 0.9 0.9 0.9 3 Nylon Lot 2 35 0.9 0.8 0.8 0.8 2 Lot 3 35 1 0.9 1.1 1.0 3 100% Lot 1 35 0.7 0.6 0.7 0.7 2 Microfiber Lot 2 35 0.5 0.6 0.6 0.6 2 Lot 3 35 0.9 0.8 0.7 0.8 2 In Table 1, the dosage reflects the amount of silver ion per kg of textile in the each batch of a treatment cycle a pilot plant study.\",\n \"Silver nitrate was added in an amount that provides the appropriate ion weight.\",\n \"The volume of batch liquid was approximately 25 liters and the amount of the textile was approximately 0.25 kg.\",\n \"It should be understood that Table 1 reflects exemplary dosage values that can be used for the textile materials shown, and other dosages are contemplated For example, in some implementations, a batch of textiles of a particular material may be dosed at a dosage value that differs by about plus or minus 50% from the dosage value listed in Table 1 for the same material, depending on the desired silver content of the treated textile and/or the target antimicrobial efficacy sought to be achieved.\",\n \"Other example implementations are also possible.\",\n \"In general, the volume of the liquid in each batch is not critical to the antimicrobial update (yield) by the textile.\",\n \"Typically, industrial applications involve treatment batch sizes of about 500-1000 liters, for example about 600 L, for textile loads of about 150 kg.\",\n \"It has been found that moderate adjustment of the liquid volume of the treatment batch does not substantially affect yield.\",\n \"The rate of addition of the antimicrobial solution to the module can be controlled to ensure that all of the textile in the module is uniformly treated.\",\n \"In some examples, the treatment cycle lasts between about 30 seconds and about 2.5 minutes.\",\n \"Therefore, to achieve a uniform dose of agent throughout the textile load, the addition of the antimicrobial solution to the module may be affected prior to the first 90 seconds of the treatment cycle.\",\n \"In some aspects, the antimicrobial solution is added to the module at a fixed rate.\",\n \"As one example, the antimicrobial solution having a concentration of about 2,000 PPM (aq) to about 15,000 PPM (aq), more particularly about 4000-15000 PPM, is added to a treatment module containing about, for example, 600 liters of liquid and 150 Kg of textile at a rate of about 30 ml/minute for about 2.5 minutes.\",\n \"In other examples, the antimicrobial agent can be added to the module at a rate between about 5 ml/min to about 50 ml/min for a period of time between about 15 seconds to about 150 seconds.\",\n \"In one particular non limiting example, a 600 liter liquid bath having a liquid antimicrobial agent concentration of 2 PPM (aq) is achieved by adding a 1000 ml solution having an agent concentration of 1,200 PPM for 2.5 minute at rate of 400 ml/min.\",\n \"At this concentration, assuming a theoretical 100% yield, the textiles would be infused with 8 mg/kg of antimicrobial agent.\",\n \"In other aspects, the antimicrobial solution is added to the module at a variable rate, which further improves the uniformity of the antimicrobial agent on the finished textile.\",\n \"In one example, the antimicrobial agent can be added to the module containing 600 liters of liquid at a rate of about 5 ml/min for about 15 seconds to about 60 seconds followed by a rate of about 20 ml/min for about 15 seconds to about 90 seconds.\",\n \"As noted above, after the textiles are treated in the sixth module 120F, the textiles are transferred to the fluid-extraction device 118 via the discharge 116.The fluid-extraction device 118 extracts fluids from the textiles.\",\n \"In some examples, the extracted fluids may be drained as waste water effluent.\",\n \"One problem with such an approach is that the extracted fluids may contain excess antimicrobial agent that was not retained within the textiles.\",\n \"If the effluent is not treated, the excess antimicrobial agent may be released into waterways.\",\n \"Above certain concentrations, antimicrobial agents may be a problematic pollutant for many fresh- and salt-water organisms.\",\n \"For this reason, many governmental regulations require operators to treat effluent if the concentration of antimicrobial agent is greater than a proscribed limit (e.g., 10 mg per kg).\",\n \"Unfortunately, effluent treatment can be prohibitively expensive for many laundry operators.\",\n \"Additionally, in some instances, draining the extracted fluids may unnecessarily waste substantial amounts of antimicrobial agent, increasing the cost to treat textiles.\",\n \"According to some aspects of the disclosure, the washer system 100 can address these problems associated with excess antimicrobial agent in the extracted fluids.\",\n \"In particular, the washer system 100 can collect the extracted fluids from the fluid-extraction device 118 and recirculate the extracted fluids back into the tunnel washer 112.Advantageously, recirculating the extracted fluids mitigates wasted antimicrobial agent and the extent to which waste water effluent needs to be treated to comply with environmental regulations.\",\n \"In the illustrated example, the extracted fluids are collected in a press-water-recovery (PWR) tank 138.As shown in FIG.\",\n \"1, the PWR tank 138 can provide at least a portion of the extracted fluid to the fifth module 120E in the rinse zone via a flow line 140.Providing antimicrobial agent (e.g., silver ions) to a module 120E preceding the treatment module 120F may allow the antimicrobial agent to bind or chelate to contaminants or other inhibiting ions in the fluid of module 120E, thereby facilitating a more accurate treatment of the textiles in the treatment module 120F.\",\n \"Additionally, providing the antimicrobial agent to the module 120E may facilitate greater uniformity of antimicrobial agent distribution in the textiles.\",\n \"Also, as shown in FIG.\",\n \"1, the PWR tank 138 can also provide at least a portion of the extracted fluid to a flush tank 142 via a flow line 144.The flush tank 142 may also receive fresh water from the fresh water source 122 via a flow line 146.The flush tank 142 may then provide a mixture of fresh water and the extracted water (which may contain excess antimicrobial agent) to the intake 114 via a flow line 148.In this way, the flush tank 142 can provide fluids to the intake 114, which allow the intake 114 to function as a pre-wash module when textiles are received in the intake 114.Providing the antimicrobial agent in the intake 114 can facilitate uniformity of antimicrobial agent distribution and more accurate treatment of the textiles in subsequent modules.\",\n \"In general, increasing the number of exposures of the textile to the antimicrobial agent can facilitate improving the uniformity of antimicrobial agent distribution in the textile.\",\n \"To provide the extracted fluids to the fifth module 150E and/or the flush tank 142, the washer system 100 can include one or more pumps and/or valves (which are not shown for clarity of illustration).\",\n \"Although the extracted fluids may be provided to the intake 114 and/or the fifth module 120E in the illustrated example, it should be understood that the extracted fluids can be similarly provided to other modules in other examples.\",\n \"For instance, in another example, at least portion of the extracted fluids can be additionally or alternatively provided by the PWR tank 138 to the sixth module 120F in the treatment zone.\",\n \"According to additional or alternative aspects of the disclosure, the washer system 100 can include additional features that help to mitigate problems associated with poor water quality.\",\n \"During the treatment process, the metallic ions of the antimicrobial agent may attach to a textile via electrostatic dipole interactions or other interactions including mechanical interaction.\",\n \"For some fabrics, the positive charge from the metallic ions is attracted to the slight-negative dipole on the polymer backbone of textile fibers.\",\n \"Generally, contaminants present in poor quality water reduce the probability that the antimicrobial metallic ions will affix to bonding sites of the textile.\",\n \"This is, in part, because some metallic ions may affix to cationic contaminants instead of the textile.\",\n \"Thus, to achieve a desired level of antimicrobial agent content in the textiles, the textiles may need to be treated with greater amounts of antimicrobial agent when water quality is poor as compared to when water quality is good.\",\n \"To address problems associated with poor or changed quality water, the washer system 100 can include one or more sensors that measure a quality of water in the system 100 and, based on the measured water quality, dynamically control the amount of antimicrobial agent utilized in a treatment cycle.\",\n \"For example, in the washer system 100 shown in FIG.\",\n \"1, a first water quality sensor 150A is located in the sixth module 120F and a second water quality sensor 150B is located along the flow line 130.The water quality sensors 150A, 150B may be communicatively coupled to a processor 152.In this way, the water quality sensors 150A, 150B may measure the quality of water in the sixth module 120F and the flow line 130, respectively, and transmit a water-quality signal to the processor 152 indicating the measured water quality.\",\n \"A commercially available example of a water quality sensor is the EXAxt SC450 Conductivity/Resistivity Analyser (Yokogawa North America, Inc., Sugar Land, Tex.).\",\n \"The processor 152 may then process the water-quality signals to determine an amount of antimicrobial agent to be used for a treatment cycles or a plurality of treatment cycles.\",\n \"In some examples, the sensors 150A, 150B can measure one or more water quality parameters such as, for instance, a water hardness (e.g., a calcium and/or magnesium concentration), a pH, and/or a total dissolved solids (TDS) concentration.\",\n \"The measured water quality parameters may be weighted and combined by the processor 152 to generate a Relative Water Quality (RWQ) number.\",\n \"In one implementation, a higher RWQ may indicate a higher hardness, TDS level, and/or pH.\",\n \"It has been discovered that as the RWQ increases, an exponentially higher dosage of antimicrobial agent is required to maintain or achieve an efficacious level of antimicrobial agent in the textiles.\",\n \"As such, the processor 152 can be configured to apply one or more algorithms with the RWQ as an input and an antimicrobial dosage as an output.\",\n \"A chart illustrating one example algorithm for determining a dosage of antimicrobial agent (mg antimicrobial agent to Kg textile) based on measured water quality is shown in FIG.\",\n \"2.It should be understood that other examples are also possible.\",\n \"In an alternative aspect to address water quality, the system can add polished water to the system prior to the textiles entering the treatment zone.\",\n \"Accordingly prior to the textiles entering the treatment zone, the textiles are subjected to polished water.\",\n \"By the time the textiles enter the treatment zone, water of poor quality associated with the textiles is replaced with polished water, therefore enhancing the effectiveness of the treatment zone.\",\n \"The processor 152 can be further communicatively coupled to the flow control device 139, which controls the amount of antimicrobial agent that is provided from the antimicrobial agent source 128 to the sixth module 120F.\",\n \"In particular, the processor 152 can provide control signals to the flow control device 139 to cause the flow control device 139 to increase the antimicrobial agent in the sixth module 120F so as to achieve the determined dosage of antimicrobial agent.\",\n \"To determine an amount of antimicrobial agent to add to the sixth module 120F, the washer system 100 can include a conductivity measurement probe 158 in the sixth module 120F.\",\n \"The conductivity probe 158 can measure a conductivity of the fluid in the sixth module 120F, which can provide an indication of the amount of antimicrobial agent in the fluid.\",\n \"The processor 152 can be communicatively coupled to the conductivity measurement probe 158, receive signals indicating the measured conductivity, determine the amount of antimicrobial agent in the sixth module 120F based on the received signals, and then determine the amount of antimicrobial agent that needs to be added from the antimicrobial agent source 128 to achieve the determined dosage.\",\n \"In one example, the determined dosage can be a dosage that is expected to achieve a target level of efficacy as a result of the treatment cycle.\",\n \"Although illustrated example includes a water quality sensor 150A in the sixth module 120F and a water quality sensor 150B in the flow line 130, it should be understood that the washer system 100 can include more or fewer water quality sensors in other examples.\",\n \"The processor 152 may include a general-purpose processor (e.g., a microprocessor) and/or a special-purpose processor (e.g., a digital signal processor (DSP)).\",\n \"The processor 152 may further include a data storage unit having one or more volatile, non-volatile, removable, and/or non-removable storage components, such as magnetic, optical, or flash storage, and/or may be integrated in whole or in part with processor 152.Further, data storage unit may take the form of a non-transitory computer-readable storage medium, having stored thereon program instructions (e.g., compiled or non-compiled program logic and/or machine code) that, when executed by processor 152, cause the washer system 100 to perform one or more acts and/or functions, such as those described in this disclosure.\",\n \"As such, washer system 100 may be configured to perform one or more acts and/or functions, such as those described in this disclosure.\",\n \"Such program instructions may define and/or be part of a discrete software application that can be executed in response to certain inputs being received from a communication interface and/or a user interface, for instance.\",\n \"Data storage unit may also store other types of data, such as those types described in this disclosure.\",\n \"Although not shown in FIG.\",\n \"1 for clarity of illustration, the washer system can further include a user interface to facilitate interaction with a user of washer system 100, if applicable.\",\n \"As such, the user interface may include input components such as a keyboard, a keypad, a mouse, a touch-sensitive panel, a microphone, and/or a camera, and/or output components such as a display device (which, for example, may be combined with a touch-sensitive panel), a sound speaker, and/or a haptic feedback system.\",\n \"Referring now to FIGS.\",\n \"3-7, example processes are illustrated and described for treating textiles with an antimicrobial agent according to various aspects of the disclosure.\",\n \"It should be understood that, according to alternative aspects of the disclosure, the processes of FIGS.\",\n \"3-7 can omit steps, include additional steps, and/or modify the order of steps presented above.\",\n \"Additionally, it is contemplated that one or more of the steps presented below can be performed simultaneously.\",\n \"It should also be understood that the example processes of FIGS.\",\n \"3-7 can correspond to at least some instructions that can be executed by the processor 152 to perform the below described functions.\",\n \"FIG.\",\n \"3 illustrates an example flowchart for using a washer system, including a tunnel washer (e.g., the washer system 100), to treat a textile with an antimicrobial agent according to some aspects of the disclosure.\",\n \"At block 202, a textile is received in the intake 114.With the textile in the intake 114, the washer system 100 may provide fluid from the flush tank 142 to the intake 114 to perform a pre-wash cycle on the textile.\",\n \"During the pre-wash cycle, the fluid in the intake 114 may facilitate initial wetting of the textile prior to the main wash zone.\",\n \"At block 204, the tunnel washer 112 transports the textile from the intake 114 to the wash zone.\",\n \"At block 206, the textile is washed with a detergent and, optionally, other wash chemicals, steam, and/or heat in each of the modules 120A-120C of the wash zone.\",\n \"The detergent can be provided to the wash zone modules 120A-120C from a detergent source 156 as shown in FIG.\",\n \"1.As the textile is progressed through the modules 120A-120C, the wash fluids counterflow from the third module 120C to the first module 120A (i.e., in the direction of arrow B in FIG.\",\n \"1), where excess wash fluids are drained via the drain 154.At block 208, the textile is transferred from the wash zone to the rinse zone.\",\n \"In the example of FIG.\",\n \"1, the textile is transferred from the third module 120C to the fourth module 120D.\",\n \"At block 210, the textile is rinsed in each of rinse zone modules 120D, 120E with rinse fluids provided by the fresh water source 122, the polished water source 124, and/or the tempered water source 126.Optionally, the textile may additionally or alternatively be rinsed by fluids provided by the PWR tank 138.In particular, the rinse fluids are provided to the last module 120E of the rinse zone so that the rinse fluids counterflow back to the beginning of the rinse zone at module 120D.\",\n \"In this way, the textile may be progressively rinsed in cleaner rinse fluids as it moves through the tunnel washer 112.At block 212, the textile is transferred from the rinse zone to the treatment zone.\",\n \"In doing so, a portion of the rinse fluids may be transferred with the textile into the treatment zone module 120F.\",\n \"At block 214, the textile is submerged in a treatment solution including the antimicrobial agent.\",\n \"At block 216, the antimicrobial agent source 128 may optionally provide additional antimicrobial agent to the treatment zone module 120F (if necessary) to achieve a treatment solution having a predetermined dosage of antimicrobial agent.\",\n \"At block 218, the textile is transferred, via the discharge 116, to the fluid-extraction device 118.At block 220, the fluid-extraction device 118 extracts excess fluids from the textile.\",\n \"At block 222, the textile may then be transported to other components for drying and/or finishing (e.g., folding).\",\n \"In the example washer system 100 described above, the treatment of the textile with antimicrobial agent is described as being performed in a treatment module that is separate from the rinse modules.\",\n \"It should be understood that according to additional or alternative aspects, the treatment functions can be performed in the last rinse module.\",\n \"For example, the treatment may be performed in the last rinse module, which transfers fluids to other modules via counterflow.\",\n \"At block 224, the PWR tank 138 may receive the extracted fluids from the fluid-extraction device 118.At block 226, the PWR tank 138 may recirculate at least a portion of the extracted fluids back into the tunnel washer 112.For example, the PWR tank 138 may recirculate at least a portion of the extracted fluids back to the fifth module 120E in the rinse zone (or a combined rinse/treatment zone), and/or at to the flush tank 142 for use in the intake 114 as described above.\",\n \"FIG.\",\n \"4 illustrates another example flowchart for treating a textile according to additional or alternative aspects of the disclosure.\",\n \"At block 302, the washer system receives a textile to be washed and treated.\",\n \"At block 304, the textile is washed with a detergent during a wash cycle in the washer system.\",\n \"At block 306, the textile is rinsed in the washer system to remove the detergent from the textile.\",\n \"At block 308, one or more sensors measure a quality of water to be used in a treatment cycle.\",\n \"At block 310, a processor determines a dosage of antimicrobial agent to apply to the textile based on the measured quality of water at block 308.At block 312, the washer system adjusts an amount of antimicrobial agent in a treatment solution to achieve the determined dosage.\",\n \"At block 314, the textile is treated with the treatment solution having the determined dosage of antimicrobial agent.\",\n \"At block 316, the washer system extracts excess fluids from the textile.\",\n \"Aspects of the disclosure are described above in the context of the washer system 100, which includes a tunnel washer 112 having a plurality of modules 120A-120F.\",\n \"However, these aspects of the disclosure can be extended to systems and processes in the context of washer-extraction devices.\",\n \"For example, according to alternative aspects, the one or more water quality sensors can be provided in a washer-extraction device, which may control an amount of antimicrobial agent utilized in a treatment cycle based on water quality measurements.\",\n \"As noted above, this process can substantially mitigate problems associated with poor and changed water quality used for antimicrobial treatment of textiles.\",\n \"Thus, in some instances, two batches of textiles that are substantially the same may nonetheless be treated with different amounts of antimicrobial agent where the water quality in the washer system is different for each batch.\",\n \"In some aspects, regardless of the wash system employed, the disclosure is directed to achieving a textile having desired level (i.e., predetermined or target level) of antimicrobial efficacy with a single treatment cycle.\",\n \"In addition, the washer system 100 may be configured to incrementally load the textile with antimicrobial agent to a desired efficacious level over a plurality of treatment cycles.\",\n \"Stated differently, the textile may not achieve a desired, predetermined or target level of antimicrobial efficacy as a result of only a single initial treatment cycle.\",\n \"While an incremental loading approach may require more time than a single cycle approach to initially achieve a textile with a target level of anti-microbial agent that will mitigate microbial infections, it has been found that incremental loading provides substantial cost savings and ecological benefits over the useful life of the textile as compared to the single cycle approach.\",\n \"In single cycle approaches, treatment solutions may contain a concentration of approximately 2 parts per million (PPM) to about 100 PPM.\",\n \"Although such high concentrations of antimicrobial agent may be beneficial for an initial treatment cycle, the same concentrations provide substantially diminished benefits with each successive treatment cycle on the same pieces textile.\",\n \"In particular, once a certain level of antimicrobial agent content or uniformity is achieved in the textile, further increases in antimicrobial agent content may provide negligible (if any) additional benefit.\",\n \"Therefore, repeated treatment cycles involving a moderate dose of an antimicrobial agent can achieve the same antimicrobial efficacy as repeated cycles involving high doses of agent, albeit it may take more than one moderate dose cycle to achieve the desired efficacy.\",\n \"In contrast to single cycle antimicrobial treatment approaches, the incremental-loading-to-efficacy approach of the disclosure utilizes substantially less antimicrobial agent during each treatment cycle.\",\n \"For example, according to some examples, the concentration of the antimicrobial agent in the treatment solution can be approximately 3 PPM to approximately 8 PPM.\",\n \"Accordingly, the more times a textile is treated using the incremental-loading-to-efficacy approach, the greater the cost savings realized as compared to approaches using dosing concentrations that may achieve a desired anti-microbial efficacy in a single treatment.\",\n \"Moreover, by reducing the amount of antimicrobial agent used per treatment cycle, less antimicrobial agent is likely to be drained to waste.\",\n \"In some examples, the predetermined efficacious level can be approximately 0.6 mg of antimicrobial agent per kg of textile.\",\n \"In other examples, the predetermined efficacious level can be approximately 0.75 mg of antimicrobial agent (e.g., silver ion) per kg of textile.\",\n \"In still other examples, the predetermined efficacious level can be approximately 1.3 mg antimicrobial agent per 1 Kg textile, approximately 1.5 mg antimicrobial agent per 1 Kg textile, approximately 1.7 mg antimicrobial agent per 1 Kg textile, approximately 2 mg antimicrobial agent per 1 Kg textile, approximately 3 mg antimicrobial agent per 1 Kg textile, or approximately 4 mg antimicrobial agent per 1 Kg textile.\",\n \"In some examples, the amount of antimicrobial agent utilized per treatment cycle can be determined to facilitate maintaining a textile at or above the desired, predetermined, or target efficacious level.\",\n \"When previously treated textiles are washed and rinsed the washer system 100, some antimicrobial agent previously contained within the textile washes out.\",\n \"Accordingly, in some examples, the amount of antimicrobial agent employed per treatment cycle may be less than an amount required to achieve a target efficacy after a single laundry cycle and greater than or equal to an amount required to replace the antimicrobial agent that is expected to leach from the textile during laundry cycles after efficacy is achieved.\",\n \"In one example implementations, the amount of antimicrobial agent utilized per treatment cycle is selected such that the textile maintains a content level of approximately 1 mg of antimicrobial agent per kg of textile to approximately 15 mg of antimicrobial agent per kg of textile, for instance 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14 or mg/Kg.\",\n \"In another example implementation, the amount of antimicrobial agent utilized per treatment cycle is selected such that the textile maintains a content level of approximately 5 mg of antimicrobial agent per kg of textile to approximately 10 mg of antimicrobial agent per kg of textile.\",\n \"Depending on the type of textile being laundered, the concentration of the antimicrobial agent in the treatment cycle can be about 0.5 mg of antimicrobial agent per kg of textile to about 30 mg of antimicrobial agent per kg of textile.\",\n \"For example, the concentration of the antimicrobial agent in the treatment cycle can be approximately 20% to approximately 90% lower than the dosage values shown in Table 1.In other examples, the concentration of the antimicrobial agent in the treatment cycle can be such that the textile achieves a content level of about 0.2 mg/kg, about 0.3 mg/kg, about 0.4 mg/kg, about 0.5 mg/kg, about 0.6 mg/kg, about 0.7 mg/kg, or about 0.8 mg/kg after the first treatment cycle.\",\n \"At such concentrations, multiple laundry/treatment cycles may be required to achieve the predetermined level of antimicrobial agent in the textile.\",\n \"In some embodiments, a desired level of the antimicrobial agent in the textile (e.g., between about 1.0 mg/kg to about 2.0 mg/kg) can be achieved in a single treatment cycle.\",\n \"In various embodiments, newly manufactured textiles or previously untreated laundry is treated in a first treatment cycle that infuses the textile with less than 1 mg antimicrobial agent per kilogram of textile.\",\n \"Repeated treatment cycles on the laundry raises the antimicrobial agent in the textiles from about 1 mg/Kg to about 5 mg/Kg of antimicrobial agent per kilogram of textile.\",\n \"In some examples, the amount of antimicrobial agent utilized per treatment cycle can be determined so that the predetermined efficacious level is achieved only after a predetermined number of treatment cycles.\",\n \"For instance, the predetermined number of treatment cycles can be two treatment cycles, three treatment cycles, four treatment cycles, five treatment cycles, 10 treatment cycles, or 30 treatment cycles according to various examples.\",\n \"Other examples are also possible.\",\n \"As noted above, the amount of antimicrobial agent in the textile may continue to increase or reach a steady state with each successive treatment cycle when existing antimicrobial treatment approaches are employed.\",\n \"In such approaches, the textiles may become discolored when loaded with too much antimicrobial agent (e.g., greater than 100 mg/kg of textile).\",\n \"Accordingly, a further benefit to the incremental-loading-to-efficacy approach is that the textiles can be treated a substantially greater number of times without causing distortion in color in the textile.\",\n \"For example, in some instances, textiles can be treated more than 30 times, more than 50 times, or more than 100 times without causing distortion in color to the textiles when the incremental-loading-to-efficacy approach of the disclosure is employed.\",\n \"Referring now to FIG.\",\n \"5, an example flowchart for treating a textile with an antimicrobial agent over a plurality of laundry cycles is illustrated according to some aspects of the disclosure.\",\n \"At block 402, the washer system receives the textile for a laundry cycle.\",\n \"At block 404, the washer system washes the textile with a detergent.\",\n \"At block 406, the washer system doses the textile with a solution having a predetermined concentration of an antimicrobial agent.\",\n \"The process is then repeated for a plurality of additional laundry cycles.\",\n \"The predetermined concentration is insufficient to achieve a predetermined antimicrobial efficacy for the textile due to the first laundry cycle alone (i.e., due to the first iteration of blocks 402-406) but sufficient to achieve the predetermined antimicrobial efficacy for the textile due to a combination of the first laundry cycle and one or more of the plurality of additional laundry cycles.\",\n \"In some examples, the process can include providing the textile to a customer and then receiving the textile back from the customer between each laundry cycle.\",\n \"In other examples, the process may further include providing the textile to a customer only after the textile achieves the predetermined antimicrobial efficacy (e.g., after multiple laundry cycle(s)).\",\n \"According to still further aspects of the disclosure, a process for protecting a laundry supply chain is provided.\",\n \"It is known that healthcare associated infections are a growing concern with some pathogens being virtually untreatable with conventional methods.\",\n \"With such healthcare associated infections, the harmful microbes are often carried in the linens and clothing used within a hospital.\",\n \"Conventional laundry methods are known to be unreliable to effectively disinfect or sanitize laundry.\",\n \"Even so if such methods were effective, once hospital textiles have been laundered and treated, they are susceptible to recontamination.\",\n \"Pathogens carried by these textiles can infect hospital patients and even cause death.\",\n \"Since most hospital patients spend the majority of their time between the sheets of a hospital bed or in a hospital gown, hospital linens are the core of the overall hospital environment for the patient, and a primary site in the battle against infection.\",\n \"To combat such infections, and to protect not only patients, but healthcare workers and anyone in contact with hospital laundry (including laundry staff), the loading of an antimicrobial agent into an inventory of a laundry from a healthcare facility can protect the complete supply chain for such inventory.\",\n \"Not only does the antimicrobial agent kill pathogens in soiled laundry during the laundry process, the agent infused into the textiles protects the textiles against new pathogens that come in contact with the textiles.\",\n \"This treatment may also act as textile preservative, protecting the textiles from storage based microbial and fungal growth.\",\n \"Referring now to FIG.\",\n \"6, an example flowchart for protecting individuals in contact with healthcare facility linens from a healthcare associated infection is illustrated according to some aspects.\",\n \"At block 502, substantially all washable, non-disposable textiles that contact patients and healthcare workers are collected in one or more batches at a healthcare facility.\",\n \"At block 504, each batch is washed using a washer system (e.g., the washer system 100) using a detergent.\",\n \"At block 506, each batch is treated with a treatment solution including a predetermined concentration of an antimicrobial agent to reduce the microbial load on the textiles in the batch and improve a resistance of the textiles in the batch to microbial contamination responsible for healthcare associated infections.\",\n \"By treating substantially all washable, non-disposable textiles at a healthcare facility, healthcare associated infections may be reduced.\",\n \"In addition, microbial discharge to the environment may be reduced.\",\n \"Referring to FIG.\",\n \"7, another example flowchart for reducing a microbial load in an inventory of textiles including a plurality of pieces at a healthcare facility is illustrated according to some aspects.\",\n \"At block 602, the washer system receives a first portion of the plurality of pieces of the inventory in a wash basin of the washer system for a laundry cycle.\",\n \"At block 604, the washer system initiates the laundry cycle.\",\n \"The laundry cycle includes a wash cycle and a treatment cycle.\",\n \"The treatment cycle includes a solution having a predetermined concentration of an antimicrobial agent.\",\n \"At block 606, the washer system receives and treats a subsequent portion of the inventory.\",\n \"At block 608, it is determined whether a predetermined amount of the pieces of the inventory have achieved a predetermined efficacy, thereby reducing the antimicrobial load of the entire inventory.\",\n \"In one example, the predetermined amount of pieces is approximately 50%-90% of the inventory, for example, 50%, 60%, 70%, 80% or 90% of the inventory.\",\n \"In order to determine whether textiles have been subject to the antimicrobial treatments as described herein, an additional aspect of the disclosure is a method of detecting the presence of an efficacious amount of silver in a textile.\",\n \"The method uses two solutions, a first solution and a second solution.\",\n \"The first solution includes the following reagents: Cadion 2B (CAS No.\",\n \"6708-61-8), a buffer sufficient to maintain a pH in the range of from about 8 to about 10, and a surfactant.\",\n \"The second solution includes Cadion 2B, a buffer sufficient to maintain a pH in the range of from about 8 to about 10, a surfactant, and a complexing agent.\",\n \"The method relies upon the formation of a complex of the complexing agent and silver, wherein the formation of the agent/silver complex is more favorable than formation of a complex of Cadion 2B and silver.\",\n \"As part of the method, the solutions are dispensed on to separate areas of the textile and the color of the dispensed first solution is compared to the color of the dispensed second solution.\",\n \"Solution A in contacted with a silver-impregnated textile results in a visible color change of the solution due to the formation of a red-violet complex of Cadion 2B and silver, while contacting Solution B with a silver-impregnated textile does not result in a visible color change of the solution due to favorable formation of a complex of the complexing agent and silver.\",\n \"In some aspects, a difference in the color of Solution A and Solution B after dispensation onto a textile indicates an efficacious of silver.\",\n \"In some aspects, the amount of Cadion 2B included in Solution A or Solution B is any amount in which a change in the color of the solution is visible upon exposure to silver.\",\n \"In some embodiments, Solution A or Solution B may contain Cadion 2B in a range of about 0.001 wt % to about 0.005 wt %, or about 0.002 wt % to about 0.004 wt %, or about 0.002 wt %, or about 0.003 wt %, or about 0.004 wt %.\",\n \"In some embodiments, Solution A or Solution B may further comprise a masking agent to react with chemical species that may interfere with the detection of silver.\",\n \"In some embodiments, the masking agent is ethylenediaminetetraacetic acid (EDTA), cyclohexanediaminetetraacetic acid (CDTA), diethylenetriaminepentaacetic acid (DTPA), nitrilotriacetic acid (NTA), or N-(hydroxyethyl)-ethylenediaminetriacetic acid (HEDTA).\",\n \"In some aspects, Solution A or Solution B may contain the masking agent in a range of about 0.5 wt % to about 1.6 wt %, or about 0.9 wt % to about 1.2 wt %, or about 0.9 wt %, or about 1.0 wt %, or about 1.1 wt %.\",\n \"In some embodiments, Solution A or Solution B may further comprise a water-miscible organic solvent.\",\n \"In some aspects, the water-miscible organic solvent may function as a solubilizer.\",\n \"In some embodiments, the water-miscible organic solvent is N-methyl-2-pyrrolidone, polyethylene glycol 400 (PEG400), N,N-dimethylacetamide (DMA), or dimethylsulfoxide (DMSO).\",\n \"In some aspects, Solution A or Solution B may contain the water-miscible solvent in a range of about 2.5 vol % to about 3.2 vol %, or about 2.7 vol % to about 3.0 vol %, or about 2.7 vol %, or about 2.8 vol %, or about 2.9 vol %, or about 3.0 vol %.\",\n \"In some aspects, the complexing agent may be any compound for which the formation of a complex of the compound and silver is more favorable than formation of a complex of Cadion 2B and silver.\",\n \"In some embodiments, the complexing agent is thiosulfate, ammonia, or cyanide.\",\n \"In some aspects, Solution B may contain the complexing agent in a range of about 0.3 wt % to about 0.9 wt %, or about 0.5 wt % to about 0.7 wt %, or about 0.5 wt %, or about 0.6 wt %, or about 0.7 wt %.\",\n \"In some aspects, the surfactant of Solution A or Solution B may be any non-ionic surfactant.\",\n \"In some embodiments, the surfactant of Solution A or Solution B is TWEEN® 20, TWEEN® 80, TRITON™ X-100, n-dodecyl β-D-maltoside (DDM), digitonin, sarkosyl, or sodium dodecyl sulfate (SDS).\",\n \"In some aspects, Solution A or Solution B may contain the surfactant in a range of about 0.5 vol % to about 1.4 vol %, or about 0.75 vol % to about 1.15 vol %, or about 0.8 vol %, or about 0.9 vol %, or about 1.0 vol %, or about 1.1 vol %.\",\n \"In some aspects, the buffer of Solution A or Solution B may be any buffer sufficient to maintain a pH in the range of from about 8 to about 10.In some embodiments, the buffer may comprise one or more of potassium tetraborate, sodium borate, citric acid, sodium citrate, hydrochloric acid, sodium hydroxide, sodium carbonate, sodium bicarbonate, monosodium phosphate, monopotassium phosphate, dipotassium phosphate, or potassium chloride.\",\n \"EXAMPLES Example 1: Silver Treatment of Hospital Textiles A system for the application of silver ions to textiles as described herein (SILVACLEAN® system from Applied Silver, Hayward, Calif.) was installed at a Healthcare Laundry Accreditation Council (HLAC) accredited laundry facility serving three different hospitals.\",\n \"Following a wash cycle, sheets and patient gowns were allowed to soak for approximately two minutes in a bath containing silver at a concentration between 1.7 and 1.8 mg Ag per liter of wash liquor (i.e., about 1.7-1.8 ppm) before the textiles were extracted and dried.\",\n \"Textiles were dosed to contain between 1.3 and 15 mg Ag per kilogram (e.g., between 8 and 10 mg Ag per kilogram).\",\n \"The textiles were analyzed daily via inductively coupled plasma-atomic emission spectrometry (ICP-AES) to ensure treatment within target range.\",\n \"Example 2: Reduction of Microbial Bioburden of Hospital Textiles Sheets and gowns, which were selected over other types of hospital textiles because they have easily identifiable patient-facing surfaces, were sampled before and after patient use (referred to as pre- and post-patient use, respectively).\",\n \"Pre-patient use samples were randomly selected from clean linen storage carts in multiple hospital wards, which were selected based on hospital layout and sampling logistics.\",\n \"A set of gowns and sheets were selected each day using a random number generator to select ward, cart, stack within the cart, and item within the stack.\",\n \"Pre-patient use samples were handled with clean nitrile gloves and placed in clean plastic bags for transport to the sampling room where microbiologic samples were collected.\",\n \"Post-patient use samples were sampled after patient discharge, following patient transfer, or after routine bed linen and gown changes.\",\n \"Microbiologic sampling was carried out immediately after discharge, before beds were stripped and cleaned by the housekeeping staff.\",\n \"The hospital directed patients to leave gowns open on the bed so that both the fitted bottom sheet and gown could be sampled without directly handling the item.\",\n \"Used textiles in each hospital were sampled for approximately 10 days between the hours of 9 a.m. and 5 p.m. Two samples were collected from each textile item at pre-defined, patient-facing locations.\",\n \"On bottom fitted sheets, samples were taken in the center middle of the sheet, both upper and lower, roughly corresponding to a supine patient's mid and lower back.\",\n \"On gowns, one sample was taken in the center chest area and another in the center of the suprapubic region.\",\n \"If the target sample area was visibly soiled, the sample was taken on the same sheet or gown, but in a directly adjacent unsoiled area.\",\n \"Samples were collected using three types of culture media: non-selective Tryptic Soy Agar (TSA) was used for total aerobic colony count, S. aureus selective Baird-Parker Agar to quantify S. aureus, and MRSA selective HARDYCHROM™ MRSA media (all Hardy Diagnostics, Santa Maria, Calif.).\",\n \"Plates had a surface area of 28.27 cm2.A random number generator was used to assign textiles to specific sampling media, ensuring approximately 20% of total samples would be on selective media (10% S. aureus and 10% MRSA).\",\n \"Contact plate sampling was carried out using the instructions for use provided by the manufacturer.\",\n \"The plate was held in place for five seconds, lifted from the sheet, and then immediately re-capped.\",\n \"Contact plates were incubated for 24 hours in aerobic conditions at 37° C. and total colony forming units (CFU) per plate were then enumerated by an independent lab.\",\n \"If the colony counts were greater than 300, the count was recorded as 300 CFU/plate.\",\n \"This was done to limit the effect of outliers and because plates with more than 300 CFU/plate could not be counted reliably.\",\n \"The average of two sampling sites per textile was calculated, resulting in a single measure for each gown and sheet.\",\n \"The Wilcoxon rank-sum test was used to compare means in each group and Fisher's exact test was used to compare the proportions of textiles from which bacterial colonies were isolated.\",\n \"To control for the three different hospital sites and ward types, mixed-effects logistic models were constructed to study the association between silver treatment and the isolation of bacteria for each culture media used (non-selective, S. aureus, and MRSA).\",\n \"For all models, the dependent variable was the isolation of bacteria on the specific media type.\",\n \"The independent variables included were presence or absence of silver treatment, if the textile was pre or post-patient use, and the ward where the samples had been collected.\",\n \"Wards were simplified to two levels: non-monitored wards (which included non-critical medical/surgical floors, labor and delivery, acute rehabilitation, and non-monitored pediatric beds) and more critical care oriented monitored wards (including telemetry wards, intensive care units, and cardiac care units).\",\n \"First, mixed-effects models that consisted of a single independent variable controlling for hospital clustering as a random effect were constructed.\",\n \"A multivariate mixed-effects logistic model was then constructed, using information-theoretic model selection to generate all possible combinations of the selected independent variables.\",\n \"The model with the lowest corrected Akaike information criterion was selected (See, Burnham & Anderson, “Model selection and multimodel inference: a practical information-theoretic approach,” 2nd ed., New York: Springer Verlag (2002)).\",\n \"Multicollinearity between independent variables in multivariate models was assessed using variance inflation factors.\",\n \"Analysis was conducted in R (R Core Team, 2015) utilizing the lme4 package (Bates et al., 2015) for logistic mixed effects models and the MuMIn package for information-theoretic model selection (Barton, 2015).\",\n \"(R Core Team, 2015: R: A language and environment for statistical computing.\",\n \"R Foundation for Statistical Computing, Vienna, Austria.\",\n \"Bates, D., Maechler, M., Bolker, B., Walker, S., 2015: lme4: Linear mixed-effects models using Eigen and S4.R package version 1.1-9.Barton, K., 2015: MuMIn: Multi-Model Inference.\",\n \"R package version 1.15.1.)\",\n \"A total of 1,912 gowns and 2,074 sheets were included in the analysis.\",\n \"Fifty-nine percent of the gown samples (1,133/1,912) and 51% percent of the sheet samples (1,059/2,074) were collected pre-patient use.\",\n \"Staphylococcus aureus specific cultures were obtained on 9.5% of gowns (181/1912) and 8.3% of sheets (173/2074).\",\n \"MRSA specific cultures were obtained on 10% of gowns (193/1912) and 9% of sheets (187/2074).\",\n \"Example 3: Aerobic Bacterial Colony Isolation Before and after Silver Application More bacteria were isolated from textiles that had been used by patients.\",\n \"Before silver application, 8 times more aerobic bacterial colonies were isolated on non-selective media from post-patient use gowns compared to pre-patient use (113.2+6.4 CFU/plate compared to 14+0.6 CFU/plate, p<0.0001), and slightly more than 10 times more aerobic bacterial colonies were isolated from sheets post-patient use compared to pre-patient use sheets (54.8+3.2 CFU/plate compared to 5.2+0.5 CFU/plate, p<0.0001).\",\n \"Fewer total aerobic bacterial colonies were isolated on non-selective culture media on textiles treated with silver (See, FIG.\",\n \"8).\",\n \"On pre-patient use gowns, an average of 14+0.6 CFU/plate were isolated before silver treatment compared to an average of 1.5+0.07 CFU/plate in the silver treated group, representing an 89% reduction (p<0.0001).\",\n \"Before silver treatment, an average of 5.2+0.5 CFU/plate were isolated from pre-patient use sheets compared to an average of 0.6+0.06 CFU/plate in the silver treated group, representing an 88% reduction (p<0.0001).\",\n \"In gowns sampled after patient use, there was a 45% reduction in bacteria isolated on the silver treated gowns compared to gowns sampled before silver treatment (113.2+6.4 CFU/plate before silver treatment compared to 62.7+3.6 CFU/plate, p<0.0001).\",\n \"In sheets sampled after patient use, there was a 30% reduction in bacteria isolated, with an average of 54.8+3.2 CFU/plate before silver treatment compared to an average of 38.3+2.9 CFU/plate after silver treatment (p=0.0001).\",\n \"The proportion of pre-patient use gowns from which at least one aerobic bacterial colony was isolated (See, Table 2) fell from 93% (432/466) to 72% (330/459) after silver treatment (Fisher's exact test, p<0.0001).\",\n \"In post-patient use gowns, the proportion fell from 98% (303/310) to 93% (281/303) after silver treatment (p=0.0002).\",\n \"The proportion of sheets with at least one aerobic bacterial colony decreased from 89% (406/454) to 50% (230/457) after silver treatment (p<0.0001) in the pre-patient use group and from 99% (406/409) to 94% (372/394) in the post-patient use group (p<0.0001).\",\n \"TABLE 2 Proportion of Textiles with Bacterial Isolates Before (Control) and After Silver Treatment None Textile Culture Isolated, Isolated, p Type Media Group n(%) n(%) Value* Pre-Use All Control 432 (93%) 34 (7%) — Gowns aerobic Silver 330 (72%) 129 (28%) <0.0001 S. aureus Control 28 (53%) 25 (47%) — Silver 0 (0%) 45 (100%) <0.0001 MRSA Control 18 (29%) 45 (71%) — Silver 1 (2%) 46 (98%) 0.0002 Post-Use All Control 303 (98%) 7 (2%) — Gowns aerobic Silver 281 (93%) 22 (7%) 0.003 S. aureus Control 29 (83%) 6 (17%) — Silver 23 (48%) 25 (52%) 0.001 MRSA Control 9 (26%) 25 (74%) — Silver 0 (0%) 49 (100%) 0.0001 Pre-Use All Control 406 (89%) 48 (11%) — Sheets aerobic Silver 230 (50%) 227 (50%) <0.0001 S. aureus Control 5 (23%) 17 (77%) — Silver 0 (0%) 46 (100%) 0.002 MRSA Control 2 (6%) 31 (94%) — Silver 0 (0%) 47 (100%) 0.16 Post-Use All Control 406 (99%) 3 (1%) — Sheets aerobic Silver 372 (94%) 22 (6%) <0.0001 S. aureus Control 38 (84%) 7 (16%) — Silver 32 (53%) 28 (47%) 0.0008 MRSA Control 9 (21%) 34 (79%) — Silver 7 (11%) 57 (89%) 0.17 *Fisher's exact test, significance considered to be <0.05 In an unadjusted mixed-effects logistic model controlling only for hospital site clustering (See, Table 3), the presence of silver was associated with decreased isolation of aerobic bacteria on non-selective media (odds ratio [OR] 0.1, 95% Confidence Interval [CI] 0.1-0.2).\",\n \"In the best-fit multivariable mixed-effects logistic model for isolation of aerobic bacterial colonies on non-selective media, isolation of colonies was more likely on post-patient use textiles (adjusted OR 9.5, 95% CI 7.1-13) and gowns (adjusted OR 1.5, 95% CI 1.5-2.3) and less likely after silver treatment (adjusted OR 0.1, 95% CI 0.1-0.2).\",\n \"While textiles in critical care areas appeared to be more likely to have colonies isolated in the initial unadjusted model, this variable did not improve model fit in the fully adjusted model, suggesting confounding from other independent variables explained the initial finding.\",\n \"TABLE 3 Unadjusted and Adjusted Mixed-Effects Logistic Models All Aerobic Unadjusted Adjusted %(n) (OR, 95% CI) (OR, 95% CI) Ward Type Non-Monitored 83% (2191) Ref — Monitored 95% (569) 4.1 (2.8-6.1)* — Patient Exposure Pre-Use 76% (1298) Ref Ref Post-Use 96% (1362) 7.9 (5.9-10.6)* 9.5 (7.1-13.0)* Textile Type Sheet 82% (1414) Ref Ref Gown 87% (1346) 1.5 (1.2-1.8)* 1.8 (1.5-2.3)* Silver Treatment Absent 94% (1547) Ref Ref Present 75% (1213) 0.1 (0.1-0.2)* 0.1 (0.1-0.2)* Abbreviations: OR, Odds ratio; CI, Confidence Interval; *p < 0.05 The proportion of pre-patient use sheets deemed hygienically clean (<20 CFU/dm2, TRSA Standard for Producing Hygienically Clean Reusable Textiles for Use in the Healthcare Industry) increased from 74% (334/454) to 99% (453/457) after silver treatment.\",\n \"The proportion of pre-patient use gowns deemed hygienically clean increased from 30% (139/466) to 98% (448/459) after silver treatment.\",\n \"Results are summarized in Table 4.TABLE 4 Hygienically Clean Test, Non-Selective Culture Media Textile Type Group Pass, n (%) Fail, n (%) Pre-Use Sheets Control 334 (74%) 120 (36%) Silver 453 (99%) 4 (1%) Pre-Use Gowns Control 139 (30%) 327 (70%) Silver 448 (98%) 11 (2%) Example 4: S. aureus Isolation Before and after Silver Application Fewer Staphylococcus aureus colonies were isolated on textiles sampled after silver treatment (See, FIG.\",\n \"9).\",\n \"There was a 100% reduction in S. aureus in gowns (2.8+0.3 CFU/plate compared to no S. aureus isolated after silver treatment, p<0.0001) and sheets prior to patient use (0.6+0.4 CFU/plate compared to no S. aureus isolated after silver treatment, p=0.009).\",\n \"In post-patient use gowns there was a 89% reduction in S. aureus colonies isolated, with an average of 30.7+5.1 CFU/plate isolated before silver treatment and 3.3+0.4 CFU/plate after treatment (p<0.0001).\",\n \"There was a 74% reduction in the average number of S. aureus colonies isolated from sheets after patient use, with 18.1+5.1 CFU/plate isolated before silver treatment compared to 4.7+2.5 CFU/plate in the silver treated sheets (p<0.0001).\",\n \"The proportion of pre-patient use gowns from which at least one colony of S. aureus was isolated (See, Table 2) fell from 53% (28/53) to 0% (0/45) after silver treatment (Fisher's exact test, p<0.0001).\",\n \"In post-patient use gowns, the proportion fell from 83% (29/35) to 48% (23/48) after silver treatment (p=0.001).\",\n \"The proportion of sheets with at least one colony of S. aureus decreased from 23% (5/22) to 0% (0/46) after silver treatment (p=0.002) in the pre-patient use group and from 84% (38/45) to 53% (32/60) in the post-patient use group (p=0.0008).\",\n \"In an unadjusted mixed-effects logistic model controlling only for hospital site clustering (See, Table 5), the presence of silver was associated with decreased isolation of S. aureus colonies (OR 0.2, 95% CI 0.1-0.3).\",\n \"In the best-fit multivariable mixed-effects logistic model for isolation of S. aureus, isolation of bacteria was more likely on post-patient use textiles (adjusted OR 11.9, 95% CI 6.1-23.4) and textiles in intensive care settings (adjusted OR 3.9, 95% CI 2.1-7.8) and less likely after silver treatment (adjusted OR 0.1, 95% CI 0.05-0.2).\",\n \"TABLE 5 Unadjusted and Adjusted Mixed-Effects Logistic Models S. aureus Specific Media Unadjusted Adjusted %(n) (OR, 95% CI) (OR, 95% CI) Ward Type Non-Monitored 34% (94) Ref Ref Monitored 79% (61) 7.2 (3.9-13.3)* 3.9 (2.1-7.8)* Patient Exposure Pre-Use 20% (33) Ref Ref Post-Use 65% (122) 9.7 (5.7-16.7)* 11.9 (6.1-23.4)* Textile Type Sheet 43% (75) Ref — Gown 44% (80) 0.9 (0.6-1.4) — Silver Treatment Absent 64% (100) Ref Ref Present 27% (55) 0.2 (0.1-0.3)* 0.1 (0.05-0.2)* Abbreviations: OR, Odds ratio; CI, Confidence Interval; *p < 0.05 Example 5: MRSA Isolation Before and after Silver Application While average colony counts of MRSA were much lower than colony counts on non-selective aerobic plates and S. aureus plates, the average number of MRSA colonies isolated per plate decreased after silver treatment (See, FIG.\",\n \"10).\",\n \"Before patient use, there was a 97% reduction in the average number of MRSA colonies on gowns (average of 0.4+0.04 CFU/plate compared with 0.01+0.001 CFU/plate on silver treated gowns, p=0.0002) and a 100% reduction on sheets (average of 0.07+0.06 CFU/plate compared with no MRSA isolated on the silver treated sheets, p=0.09).\",\n \"After patient use, there was a 100% reduction in the average number of MRSA colonies on gowns (average of 0.7+0.1 CFU/plate compared with no MRSA isolated on the silver treated gowns, p=0.0001) and a 80% reduction on sheets (0.5+0.3 CFU/plate compared with 0.1+0.04 CFU/plate on the silver treated sheets, p=0.14).\",\n \"The proportion of gowns with at least one colony of MRSA (See, Table 2) decreased from 29% (18/63) to 2% (1/47) after silver treatment (p=0.0002) in the pre-patient use group and from 26% (9/34) to 0% (0/49) after silver treatment (p=0.0001) in the post-patient use group.\",\n \"The proportion of sheets with at least one colony of MRSA decreased from 2% (2/32) to 0% (0/47) after silver treatment (p=0.16) in the pre-patient use group and from 21% (9/33) to 11% (7/64) in the post-patient use group (p=0.17).\",\n \"In an unadjusted mixed-effects logistic model controlling only for hospital site clustering (See, Table 6), the presence of silver was associated with decreased isolation of MRSA (OR 0.3, 95% CI 0.1-0.9).\",\n \"In the best-fit multivariable mixed-effects logistic model for isolation of MRSA, only the presence or absence of silver was predictive of MRSA isolation.\",\n \"TABLE 6 Unadjusted and Adjusted Mixed-Effects Logistic Models MRSA Specific Media Unadjusted Adjusted %(n) (OR, 95% CI) (OR, 95% CI) Ward Type Non-Monitored 9% (27) Ref — Monitored 21% (19) 1.6 (0.8-3.2) — Patient Exposure Pre-Use 11% (21) Ref — Post-Use 13% (25) 1.5 (0.8-2.9) — Textile Type Sheet 10% (18) Ref — Gown 14% (28) 1.2 (0.6-2.4) — Silver Treatment Absent 22% (38) Ref Ref Present 4% (8) 0.3 (0.1-0.9)* 0.3 (0.1-0.9)* Abbreviations: OR, Odds ratio; CI, Confidence Interval; *p < 0.05 Example 6: Silver Detection in Treated Textiles A pass/fail method for detecting the presence of silver in a SILVACLEAN® treated textile was used to confirm the silver content of treated textiles.\",\n \"The detection kit includes two solutions, labeled Solution A and Solution B.\",\n \"Solution A and Solution B both include Cadion 2B (CAS No.\",\n \"6708-61-8), which, in the presence of a surfactant at pH ˜9.6, forms a red-violet complex with silver.\",\n \"Solution B, which serves as a control solution, further includes sodium thiosulfate, which binds silver more strongly than Cadion B and prevents any color change.\",\n \"Solution A was prepared by dissolving 1.56 g of Solution A Dry Components (See, Table 7) and 1.9 mL of Solution A Liquid Components (See, Table 8) in 50 mL H2O.\",\n \"TABLE 7 Solution A Dry Components Compound Percent Range (w/w) Potassium Borate 50%-60% Citric Acid 1%-5% Cadion 2B <0.1% CDTA, Disodium Magnesium Salt 30%-40% Sodium Citrate 10%-20% TABLE 8 Solution A Liquid Components Compound Percent Range (w/w) 1-Methyl-2-pyrrolidinone 70%-80% TWEEN ® 20 Polyoxyethylene (20) 20%-20% Sorbitanmonolaurate Solution B was prepared by transferring 25 mL of Solution A to a second vessel and adding 0.14 g sodium thiosulfate.\",\n \"Solution A and Solution B were stored in dropper bottles.\",\n \"The directions for use are as follows: 1.Ensure adequate lighting directly over the observation area.\",\n \"2.Wearing Nitrile gloves and eye protection, remove both bottles (labeled Solution A and Solution B) from test kit.\",\n \"3.Fold sample textile three times over itself (gather at least 8 layers) and place multi-layered section into the well-lit observation area.\",\n \"4.Remove caps from both bottles and prepare to test.\",\n \"5.Place 3 drops of Solution A onto a single spot, immediately place 3 drops of Solution B onto a spot located at least 1″ to the right of the previous drops.\",\n \"Spots should not merge.\",\n \"6.Replace caps and return bottles to package.\",\n \"7.In 30 seconds, review the spots for color change.\",\n \"After following the above directions, a difference in color indicates that that an efficacious level of silver is present in the tested textile.\",\n \"While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art.\",\n \"The various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated by the following claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870944"}}},{"rowIdx":4493681,"cells":{"text":{"kind":"list like","value":[["Semi-polar LED Epitaxial Structure and Fabrication Method","A semi-polar LED epitaxial structure includes, from bottom to up: a sapphire substrate; a semiconductor bottom layer structure; and a semiconductor functional layer; wherein: a surface of the semiconductor bottom structure has V pits; and a side of the V pits is a semi-polar surface, corresponding to (1-101) family of crystal planes.","A fabrication method includes: providing a sapphire substrate; growing a semiconductor bottom structure over the sapphire substrate to form V pits on a surface, wherein a side of the V pits is a semi-polar surface, corresponding to (1-101) family of crystal planes; and growing a semiconductor functional layer over the semi-polar surface of the semiconductor bottom structure."],["1.A semi-polar LED epitaxial structure, comprising from bottom to up: a sapphire substrate; a semiconductor bottom layer structure; and a semiconductor functional layer; wherein: a surface of the semiconductor bottom structure has V pits; and a side of the V pits is a semi-polar surface, corresponding to (1-101) family of crystal planes.","2.The semi-polar LED epitaxial structure of claim 1, wherein the sapphire substrate is a patterned sapphire substrate or a flat sapphire substrate.","3.The semi-polar LED epitaxial structure of claim 1, wherein the sapphire substrate is a patterned sapphire substrate, wherein, the pattern density is consistent with the V pit density.","4.The semi-polar LED epitaxial structure of claim 1, wherein the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.","5.The semi-polar LED epitaxial structure of claim 1, wherein the semiconductor functional layer material includes GaN-based semiconductor material.","6.The semi-polar LED epitaxial structure of claim 1, wherein the V pits are nanometer V pits, wherein.","7.The semi-polar LED epitaxial structure of claim 6, wherein the sapphire substrate is a nanometer patterned sapphire substrate, and wire diameter size of the nanometer V pits is 100-1000 nm.","8.The semi-polar LED epitaxial structure of claim 6, wherein the sapphire substrate is a flat sapphire substrate, and wire diameter size of the nanometer V pits is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.","9.The semi-polar LED epitaxial structure of claim 6, wherein the semiconductor functional layer comprises a first semiconductor functional layer and a second semiconductor functional layer, and the first semiconductor functional layer surface has the nanometer V pits.","10.A fabrication method of a semi-polar LED epitaxial structure, the method comprising: (1) providing a sapphire substrate; (2) growing a semiconductor bottom structure over the sapphire substrate to form V pits on a surface, wherein a side of the V pits is a semi-polar surface, corresponding to (1-101) family of crystal planes; and (3) growing a semiconductor functional layer over the semi-polar surface of the semiconductor bottom structure.","11.The fabrication method of claim 10, wherein: the sapphire substrate is a patterned sapphire substrate, and density of the V pit is adjusted by the pattern density of the patterned sapphire substrate.","12.The fabrication method of claim 10, wherein the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.","13.The fabrication method of claim 10, wherein in step (2), control the growth temperature low (within 1,100° C.) and growth rate fast (above 3 μm/h) to form a V pit on the surface of the semiconductor bottom structure.","14.The fabrication method of claim 10, wherein increase growth rate of the semi-polar surface in step (3) to 5-10 times of that of a conventional polar surface, or extend the growth time to 5-10 times of that of a conventional polar surface.","15.The fabrication method of claim 10, wherein the V pits are nanometer V pits.","16.The fabrication method of claim 15, wherein the sapphire substrate is a nanometer patterned sapphire substrate, and density of the V pit is adjusted by the pattern density of the nanometer patterned sapphire substrate.","17.The fabrication method of claim 15, wherein the sapphire substrate is a nanometer patterned sapphire substrate, and wire diameter size of the nanometer V pit is 100-1000 nm.","18.The fabrication method of claim 15, wherein the sapphire substrate is a flat sapphire substrate, and wire diameter size of the nanometer V pit is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.","19.The fabrication method of claim 15, wherein in step (2), control the growth temperature low (within 1100° C.) and growth rate fast (above 3 μm/h) to form a nanometer V pit on the surface of the semiconductor bottom structure.","20.The fabrication method of claim 15, wherein: the semiconductor functional layer comprises a first semiconductor functional layer and a second semiconductor functional layer, wherein, the first semiconductor functional layer surface has the nanometer V pits; and the nanometer V pits of the first semiconductor functional layer are obtained by quickening growth rate of the semi-polar surface to 5-10 times of that of a conventional polar surface, or extend the growth time to 5-10 times of that of a conventional polar surface."],[" BACKGROUND LED is a semiconductor solid light-emitting device, using semiconductor PN junction as the light emitting material for direct photovoltaic conversion.","By far, polar GaN-based LED technology has been industrialized for over 20 years with tremendous improvements in performance.","Yet, polar LED encounters performance bottleneck for photoelectric conversion efficiency can hardly improve dramatically after reaching 60%.","At present, it is commonly believed that insurmountable polarization effect of polar LED device would influence LED light emitting efficiency.","In recent years, numerous studies and literature reports have been made on semi-polar and non-polar materials and devices."],[" SUMMARY The inventors of the present disclosure have recognized that, main problems include that it is rather difficult to grow GaN materials on the semi-polar surface or non-polar surface.","Two common methods for obtaining the semi-polar and non-polar GaN materials are as shown below: one is to obtain semi-polar or non-polar GaN film through non-polar and semi-polar sapphire; and the second is to obtain corresponding device through homoepitaxy by slicing semi-polar and non-polar surface of a homogeneous substrate.","Through the first technology, it is hard to obtain high material quality; and the second technology has high material quality but the cost is high.","Selective area epitaxy is another complex technology for growing semi-polar surface or non-polar surface; then, fabricate semi-polar or non-polar device over the semi-polar surface after in-situ growth; this process is complex and requires auxiliary materials and second epitaxial growth.","From this point of view, how to obtain high quality materials is the main barrier of semi-polar and non-polar LEDs.","Various embodiments of the present disclosure provide a semi-polar LED in-situ grown on the C-plane sapphire substrate and a fabrication method thereof, wherein, the surface of the semiconductor bottom structure is controlled to form a V pit (including nanometer V pit) over the sapphire plane or the patterned substrate through epitaxial growth to further fabricate a semiconductor functional layer at the V pit side to finally form a semi-polar LED epitaxial structure.","According to one aspect of the present disclosure, provide a semi-polar LED, comprising from bottom to up: a sapphire substrate, a semiconductor bottom structure and a semiconductor functional layer, wherein, the surface of the semiconductor bottom structure has a V pit, and the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes.","In some embodiments, the sapphire substrate is a patterned sapphire substrate or a flat sapphire substrate.","In some embodiments, the sapphire substrate is a patterned sapphire substrate, wherein, the pattern density is consistent with the V pit density.","In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.","In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.","According to a second aspect of the present disclosure, a fabrication method of a semi-polar LED includes: (1) providing a sapphire substrate; (2) growing a semiconductor bottom structure over the sapphire substrate to form a V pit on the surface, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes; and (3) growing a semiconductor functional layer over the semiconductor bottom structure.","In some embodiments, the sapphire substrate is a patterned sapphire substrate or a flat sapphire substrate.","In some embodiments, density of the V pit is adjusted by the pattern density of the patterned sapphire substrate.","In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.","In some embodiments, in step (2), control the growth temperature low (within 1,100° C.) and growth rate fast (above 3 μm/h) to form a V pit on the surface of the semiconductor bottom structure.","In some embodiments, quicken growth rate of the semi-polar surface in step (3) to 5-10 times of that of a conventional polar surface, or extend the growth time to 5-10 times of that of a conventional polar surface.","In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.","According to a third aspect of the present disclosure, a semi-polar LED is provided, including from bottom to up: a sapphire substrate, a semiconductor bottom layer structure and a semiconductor functional layer, wherein: the surface of the semiconductor bottom structure has a nanometer V pit, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes.","In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate or a flat sapphire substrate.","In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate, and wire diameter size of the nanometer V pit is 100-1,000 nm.","In some embodiments, the sapphire substrate is a flat sapphire substrate, and wire diameter size of the nanometer V pit is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.","In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.","In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.","In some embodiments, the semiconductor functional layer comprises a first semiconductor functional layer and a second semiconductor functional layer, wherein, the first semiconductor functional layer surface has a nanometer V pit.","According to a fourth aspect of the present invention, a fabrication method of a semi-polar LED is provided, comprising: (1) providing a sapphire substrate; (2) growing a semiconductor bottom structure over the sapphire substrate to form a nanometer V pit on the surface, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes; and (3) growing a semiconductor functional layer over the semiconductor bottom structure.","In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate or a flat sapphire substrate.","In some embodiments, density of the V pit is adjusted by the pattern density of the nanometer patterned sapphire substrate.","In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate, and wire diameter size of the nanometer V pit is 100-1000 nm.","In some embodiments, the sapphire substrate is a flat sapphire substrate, and wire diameter size of the nanometer V pit is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.","In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an uGaN layer, an nGaN layer or any combination thereof.","In some embodiments, in step (2), control the growth temperature low (within 1,100° C.) and growth rate fast (above 3 μm/h) to form a nanometer V pit on the surface of the semiconductor bottom structure.","In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.","In some embodiments, the semiconductor functional layer comprises a first semiconductor functional layer and a second semiconductor functional layer, wherein, the first semiconductor functional layer surface has a nanometer V pit.","In some embodiments, the nanometer V pit of the first semiconductor functional layer is obtained by quickening growth rate of the semi-polar surface to 5-10 times of that of a conventional polar surface, or extend the growth time to 5-10 times of that of a conventional polar surface.","Compared with conventional technologies, the conduction band and the valence band of the LED epitaxial structure having a conventional polar surface (001) are bent due to polarization electric field, so that the reciprocal spaces of the bottom of the conduction band and the top of the valence band are not in a same position, which similarly changes to indirect band gap semiconductor light emitting (in the case of AlInGaN-based materials, it is direct band gap light emitting material).","Consequently, the radiant composition light emitting efficiency is reduced, and non-radiant composition probability increases.","Various embodiments of the present disclosure can have one or more of the following technical effects: (1) the fabrication process is simplified as it requires neither selective area epitaxy nor secondary epitaxy; (2) the semi-polar surface is (1-101) family of crystal planes.","The reciprocal spaces of the smooth bottom of the conduction band and the top of the valence band have large overlapping area, which greatly increases radiation compound efficiency; (3) the semi-polar surface is exposed by adjusting the material growth process without restricting substrate geometrical shape, thus fabricating a semi-polar surface material with high operability and low cost.","(4) form a semiconductor functional layer over the surface of the semiconductor bottom structure having a nanometer V pit so that the obtained epitaxial structure can combine with the existing chip fabrication for facilitating semiconductor light-emitting devices such as LED chips."],["CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a continuation of, and claims priority to, PCT/CN2016/111663 filed on Dec. 23, 2016, which claims priority to Chinese Patent Application Nos.","CN 201610030333.8 and CN 201610030332.3, both filed on Jan. 18, 2016.The disclosures of these applications are hereby incorporated by reference in their entirety.","BACKGROUND LED is a semiconductor solid light-emitting device, using semiconductor PN junction as the light emitting material for direct photovoltaic conversion.","By far, polar GaN-based LED technology has been industrialized for over 20 years with tremendous improvements in performance.","Yet, polar LED encounters performance bottleneck for photoelectric conversion efficiency can hardly improve dramatically after reaching 60%.","At present, it is commonly believed that insurmountable polarization effect of polar LED device would influence LED light emitting efficiency.","In recent years, numerous studies and literature reports have been made on semi-polar and non-polar materials and devices.","SUMMARY The inventors of the present disclosure have recognized that, main problems include that it is rather difficult to grow GaN materials on the semi-polar surface or non-polar surface.","Two common methods for obtaining the semi-polar and non-polar GaN materials are as shown below: one is to obtain semi-polar or non-polar GaN film through non-polar and semi-polar sapphire; and the second is to obtain corresponding device through homoepitaxy by slicing semi-polar and non-polar surface of a homogeneous substrate.","Through the first technology, it is hard to obtain high material quality; and the second technology has high material quality but the cost is high.","Selective area epitaxy is another complex technology for growing semi-polar surface or non-polar surface; then, fabricate semi-polar or non-polar device over the semi-polar surface after in-situ growth; this process is complex and requires auxiliary materials and second epitaxial growth.","From this point of view, how to obtain high quality materials is the main barrier of semi-polar and non-polar LEDs.","Various embodiments of the present disclosure provide a semi-polar LED in-situ grown on the C-plane sapphire substrate and a fabrication method thereof, wherein, the surface of the semiconductor bottom structure is controlled to form a V pit (including nanometer V pit) over the sapphire plane or the patterned substrate through epitaxial growth to further fabricate a semiconductor functional layer at the V pit side to finally form a semi-polar LED epitaxial structure.","According to one aspect of the present disclosure, provide a semi-polar LED, comprising from bottom to up: a sapphire substrate, a semiconductor bottom structure and a semiconductor functional layer, wherein, the surface of the semiconductor bottom structure has a V pit, and the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes.","In some embodiments, the sapphire substrate is a patterned sapphire substrate or a flat sapphire substrate.","In some embodiments, the sapphire substrate is a patterned sapphire substrate, wherein, the pattern density is consistent with the V pit density.","In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.","In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.","According to a second aspect of the present disclosure, a fabrication method of a semi-polar LED includes: (1) providing a sapphire substrate; (2) growing a semiconductor bottom structure over the sapphire substrate to form a V pit on the surface, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes; and (3) growing a semiconductor functional layer over the semiconductor bottom structure.","In some embodiments, the sapphire substrate is a patterned sapphire substrate or a flat sapphire substrate.","In some embodiments, density of the V pit is adjusted by the pattern density of the patterned sapphire substrate.","In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.","In some embodiments, in step (2), control the growth temperature low (within 1,100° C.) and growth rate fast (above 3 μm/h) to form a V pit on the surface of the semiconductor bottom structure.","In some embodiments, quicken growth rate of the semi-polar surface in step (3) to 5-10 times of that of a conventional polar surface, or extend the growth time to 5-10 times of that of a conventional polar surface.","In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.","According to a third aspect of the present disclosure, a semi-polar LED is provided, including from bottom to up: a sapphire substrate, a semiconductor bottom layer structure and a semiconductor functional layer, wherein: the surface of the semiconductor bottom structure has a nanometer V pit, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes.","In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate or a flat sapphire substrate.","In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate, and wire diameter size of the nanometer V pit is 100-1,000 nm.","In some embodiments, the sapphire substrate is a flat sapphire substrate, and wire diameter size of the nanometer V pit is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.","In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.","In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.","In some embodiments, the semiconductor functional layer comprises a first semiconductor functional layer and a second semiconductor functional layer, wherein, the first semiconductor functional layer surface has a nanometer V pit.","According to a fourth aspect of the present invention, a fabrication method of a semi-polar LED is provided, comprising: (1) providing a sapphire substrate; (2) growing a semiconductor bottom structure over the sapphire substrate to form a nanometer V pit on the surface, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes; and (3) growing a semiconductor functional layer over the semiconductor bottom structure.","In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate or a flat sapphire substrate.","In some embodiments, density of the V pit is adjusted by the pattern density of the nanometer patterned sapphire substrate.","In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate, and wire diameter size of the nanometer V pit is 100-1000 nm.","In some embodiments, the sapphire substrate is a flat sapphire substrate, and wire diameter size of the nanometer V pit is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.","In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an uGaN layer, an nGaN layer or any combination thereof.","In some embodiments, in step (2), control the growth temperature low (within 1,100° C.) and growth rate fast (above 3 μm/h) to form a nanometer V pit on the surface of the semiconductor bottom structure.","In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.","In some embodiments, the semiconductor functional layer comprises a first semiconductor functional layer and a second semiconductor functional layer, wherein, the first semiconductor functional layer surface has a nanometer V pit.","In some embodiments, the nanometer V pit of the first semiconductor functional layer is obtained by quickening growth rate of the semi-polar surface to 5-10 times of that of a conventional polar surface, or extend the growth time to 5-10 times of that of a conventional polar surface.","Compared with conventional technologies, the conduction band and the valence band of the LED epitaxial structure having a conventional polar surface (001) are bent due to polarization electric field, so that the reciprocal spaces of the bottom of the conduction band and the top of the valence band are not in a same position, which similarly changes to indirect band gap semiconductor light emitting (in the case of AlInGaN-based materials, it is direct band gap light emitting material).","Consequently, the radiant composition light emitting efficiency is reduced, and non-radiant composition probability increases.","Various embodiments of the present disclosure can have one or more of the following technical effects: (1) the fabrication process is simplified as it requires neither selective area epitaxy nor secondary epitaxy; (2) the semi-polar surface is (1-101) family of crystal planes.","The reciprocal spaces of the smooth bottom of the conduction band and the top of the valence band have large overlapping area, which greatly increases radiation compound efficiency; (3) the semi-polar surface is exposed by adjusting the material growth process without restricting substrate geometrical shape, thus fabricating a semi-polar surface material with high operability and low cost.","(4) form a semiconductor functional layer over the surface of the semiconductor bottom structure having a nanometer V pit so that the obtained epitaxial structure can combine with the existing chip fabrication for facilitating semiconductor light-emitting devices such as LED chips.","BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and constitute a part of this specification, together with the embodiments, are therefore to be considered in all respects as illustrative and not restrictive.","In addition, the drawings are merely illustrative, which are not drawn to scale.","In the drawings: 11, 21, 31, 41, 51, 61: sapphire substrate; 12, 22, 32, 42, 52, 62: buffer layer; 13, 23, 33, 43, 53, 63: first u-GaN layer; 14, 24, 34, 44, 54, 64: second u-GaN layer; 15, 25, 35, 45, 55, 65: n-GaN layer; 16, 26, 36, 46, 56, 66: semiconductor functional layer; 17, 27, 37, 47, 57, 67: V pit side (corresponding to the (1-101) family of crystal planes); 461: 661: first semiconductor functional layer; 462: 662: second semiconductor functional layer.","FIG.","1 is a sectional view illustrating a first step of fabricating the LED epitaxial structure fabricated according to Embodiment 1; FIG.","2 illustrates a second step; FIG.","3 illustrates a third step; FIG.","4 illustrates a fourth step; FIG.","5 is a sectional view of an LED epitaxial structure according to Embodiment 2; FIG.","6 is a sectional view diagram of the LED epitaxial structure according to Embodiment 3; FIG.","7 is a sectional view illustrating a first step of fabricating the LED epitaxial structure fabricated according to Embodiment 4; FIG.","8 illustrates a second step; FIG.","9 illustrates a third step; FIG.","10 illustrates a fourth step; FIG.","11 is a sectional view of an LED epitaxial structure according to Embodiment 5; FIG.","12 is a sectional view diagram of the LED epitaxial structure according to Embodiment 6; FIG.","13 is a sectional view diagram of the LED epitaxial structure according to Embodiment 7; and FIG.","14 is a sectional view diagram of the LED epitaxial structure according to Embodiment 8 of the present disclosure.","DETAILED DESCRIPTION Various embodiments of the present disclosure will be explained in details with reference to the accompanying drawings.","Before further description, it should be understood, however, that various modifications and changes may be made to these embodiments.","Therefore, the present invention is not limited to the embodiments below.","It should also be noted that the scope of the present disclosure should still be subjected to the scope defined in the claims and the embodiments are merely for purposes of illustration, rather than restricting.","Unless otherwise specified, all technical and scientific words shall have the same meanings as understood by persons skilled in the art.","Embodiment 1 Referring to FIGS.","1-5, this embodiment provides a fabrication method of a GaN semi-polar LED, which addresses the problem of difficult growth of semi-polar materials and high cost of homogeneous semi-polar material.","The technical scheme below takes a patterned sapphire substrate as an example.","The fabrication method comprises steps below: Referring to FIG.","1, provide a sapphire substrate 11 (Sapphire), and put it into a metal organic chemical vapor deposition (MOCVD) device; rise temperature to 1,000-1,200° C. for treating 3-10 minutes amid hydrogen atmosphere; employ a patterned sapphire substrate (PSS) to obtain a regular surface V pit (dent) array, which corresponds to each patterned substrate bulge (island).","V pit density can be adjusted through pattern density of the patterned substrate.","When the pattern density of the patterned substrate is determined, the V pit density is same, and then size of each V pit is determined, namely, the PSS pattern density is kept consistent with the V pit; employ a flat sapphire substrate (FSS) to obtain a semi-polar surface LED, where V pits on the surface are of different sizes and in random distribution; however, the density is influenced by buffer layer thickness and annealing conditions of the buffer layer: the thicker is the buffer layer, the lower is annealing temperature, and then, annealing time becomes shorter, island density is higher, and subsequent V pit density is higher; and vice versa.","Lower temperature to 500-600° C., and input ammonia and trimethyl gallium, and grow a 20-50 nm AlInGaN low-temperature buffer layer 12 (buffer) for stress release; then, switch off trimethyl gallium; wherein, the epitaxial growth method can be CVD (chemical vapor deposition), PECVD (plasma enhanced chemical vapor deposition), MBE (molecular beam epitaxy), and HVPE (hydride vapor phase epitaxy).","This embodiment prefers to use MOCVD, but is not limited to this method.","Referring to FIG.","2, grow a semiconductor bottom structure having a V pit over the low-temperature buffer layer 12 through epitaxial growth, wherein, the V pit side 17 is a semi-polar surface, corresponding to the (1-101) family of crystal planes.","Specifically, rise temperature to 1,000-1,100° C., and anneal for 1-5 minute.","Then, input trimethyl gallium for growing a 1-2 μm thick non-doping GaN 13 (the first uGaN layer); this layer is referred to as a 3D mode GaN growth layer; control growth temperature within 1,050° C., chamber pressure at 500 torr, and growth rate above 3 μm/h to obtain a large number of V pits.","The V pits can cover the entire epitaxial surface, and the C plane is completely disappeared; or, the V pits can partially cover the surface; in this embodiment, it is preferred that the V pits cover the entire epitaxial surface, having no C plane.","Referring to FIG.","3, control temperature within 1,100° C. and chamber pressure at 300 torr to grow a 1-2 μm thick non-doping GaN 14 (the second uGaN layer).","This layer is referred to as a 2D mode GaN growth layer; control growth rate above 4 μm/h, and the V pits cover the entire surface.","Referring to FIG.","4, lower temperature to about 1050° C., and chamber pressure at 300 torr; grow a 1.5-4 μm thick gallium nitride, and input silicane for doping to form an N-type GaN 15 (nGaN layer); or, grow an uGaN/nGaN superlattice to replace the fully doped nGaN; provide electronic injection; control growth rate above 5 μm/h; and after growth of nGaN, the epitaxial surface is fully occupied by the V pits.","Referring to FIG.","5, continue to grow a semiconductor functional layer over the surface of the semiconductor bottom structure having a V pit.","In this embodiment, GaN-based semiconductor material is preferred, and the structural layer is SLs/MQWs/pAlGaN/pGaN/p++, which serves as the functional layer.","Specifically, lower temperature to 770-870° C., and grow 15-30 circles of InGaN/GaN superlattice layers (SLs), wherein, InGaN thickness in each circle ranges from 1 to 3 nm, and GaN thickness range is 2.5-8 nm.","This superlattice layer serves as the low-temperature stress release layer for stress release; as epitaxial deposition rate of the semi-polar surface is only 1/10-⅕ that of the polar surface; fabricate an epitaxial layer having a thickness equivalent to that formed through a conventional method (polar growth); growth rate on the semi-polar surface can be quickened by 5-10 times by regulating source gas flow, or growth time is extended to 5-10 times that of conventional time; control temperature within 750-900° C., and continue to grow 5-15 circles of InGaN/GaN multiquantum well layers (MQWs), serving as the light emitting layer; growth rate is same as that of the low-temperature stress release layer (InGaN/GaN superlattice layer); control temperature within 800-950° C., and grow a p-type AlGaN electron blocking layer (pAlGaN) to block electron expansion; growth rate is same as that of the low-temperature stress release layer; rise temperature to 900-1050° C.; grow the p-type GaN layer (pGaN), and provide hole injection; the growth rate is same as that of the low-temperature pressure stress layer (InGaN/GaN superlattice layer); under 900-1,050° C., grow a heavily-doped p-type GaN contact layer (p++), which is easily for subsequent fabrication of common transparent electrode (such as ITO) of LED device to form ohmic contact; the growth rate is same as the treatment method of the low-temperature stress release layer (InGaN/GaN superlattice layer).","It should be noted that, the p-type GaN layer and the heavily-doped p-type GaN contact layer (p++) require growth conditions different from the p-type layer of conventional C-plane LED.","During growth of the p-type layer of a conventional C-plane LED, a large amount of hydrogen is input for filling (filling up) the V pit; in this embodiment, pGaN is grown in nitrogen conditions or little hydrogen to avoid filling up the V pit.","Embodiment 2 Referring to FIG.","5, a LED epitaxial structure is provided, comprising from bottom to up: a sapphire substrate 11, a buffer layer 12, a semiconductor bottom structure having a V pit which comprises a first u-GaN layer 13, a second u-GaN layer 14 and an nGaN layer 15, and a semiconductor functional layer 16 comprising SLs/MQWs/pAlGaN/pGaN/p++.","Specifically, the sapphire substrate 11 in this embodiment can be a patterned sapphire substrate (PSS), or a flat sapphire substrate (FSS).","In this embodiment, a PSS substrate is preferred.","The limited range of characteristic size (circle) is 1-10 μm, but is not limited to this range.","The buffer layer 12 material is AlInGaN semiconductor layer, formed over the sapphire substrate 11, which eliminates the lattice mismatch caused by lattice constant difference between the sapphire substrate 11 and the first-conductive type semiconductor layer, thus improving epitaxial growth quality.","A semiconductor bottom structure having a V pit is formed over the buffer layer 12, wherein, the semiconductor bottom structure comprises from bottom to up: a 1-2 μm thick non-doping GaN 13 (the first uGaN layer), a 1-2 μm thick non-doping GaN 14 (the second uGaN layer) and a 1.5-4 μm thick N-type GaN 15 (nGaN layer).","V pits are formed on the surface of each structure layer, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes.","SLs, MQWs, pAlGaN, pGaN and p++ form a semiconductor functional layer 16, which are formed on the nGaN surface of the V pits in successive.","Embodiment 3 Referring to FIG.","6, the difference between this embodiment and Embodiment 1 is that: The first uGaN layer 13 with 3D mode growth of the patterned sapphire substrate in Embodiment 1 forms a 2D film between sapphire substrates (at the interval) and the pattern top forms a V pit; in this embodiment, after depositing a buffer layer 22 on the flat sapphire substrate, rise temperature to 1,000-1,100° C. Under this temperature, anneal for 1-5 minutes.","Take the nucleation island on the sapphire substrate surface (not shown in the figure) as the nucleation center of the first uGaN layer 23; form a plurality of V pits with different sizes and in random distribution through 3D mode growth; later step is same as Embodiment 1.To sum up, various embodiments of the present disclosure can simplify fabrication process as it requires neither selective area epitaxy nor secondary epitaxy; in addition, the semi-polar surface is a (1-101) family of crystal planes, reciprocal spaces of the smooth bottom of the conduction band and the top of the valence band have large overlapping area, which greatly increases radiation compound efficiency; the semi-polar surface is exposed by adjusting the material growth process without restricting substrate geometrical shape, thus fabricating a semi-polar surface material with high operability and low cost.","Embodiment 4 Referring to FIGS.","7-12, this embodiment provides a fabrication method of GaN semi-polar LED epitaxial structure, which addresses the problem of difficult growth of semi-polar materials and high cost of homogeneous semi-polar material.","The technical scheme below takes nanometer sapphire substrate as an example.","The fabrication method comprises steps below: Referring to FIG.","7, provide a nanometer patterned sapphire substrate 31 (Sapphire), and put it into a metal organic chemical vapor deposition (MOCVD) device, and rise temperature to 1,000-1,200° C. for treating 3-10 minutes under hydrogen atmosphere; use a nanometer patterned sapphire substrate (PSS) to obtain regular surface V pit (dent) array; the wire diameter of the PSS pattern is 100-1,000 nm, and pattern height is 300-2000 nm, and the interval is ⅕-½ of the circle size; under this size, the pattern neither influences existing chip fabrication nor subsequent photoetching process such as chip electrode fabrication.","If the pattern wire diameter size is small (<100 nm), V pit is small, and low-temperature functional layers at the V pit bottom are overlapped, wherein, the overlapping portion occupies highly proportion of the inner wall of the entire V pit, which is of poor lighting, thus influencing lighting efficiency of the device, therefore, the size shall not be too small; if the wire diameter size of the pattern is too large (>1,000 nm), combination degree of the epitaxial structure and the existing chip process is low, which is not easy to fabricate a LED device; corresponding to each PSS bulge (island), density of the V pit can be adjusted according to the pattern density; when the pattern density of the patterned substrate is determined, the V pit density is same; and size of each V pit is determined correspondingly, and the wire diameter size of the V pit is 100-1,000 m; when a plane substrate is used, a semi-polar surface LED can be obtained, where, V pits on the surface are of different sizes and in random distribution; however, the density is influenced by buffer layer thickness and annealing conditions of the buffer layer: the thicker is the buffer layer, the lower is annealing temperature, and then, annealing time becomes shorter, island density is higher, and subsequent V pit density is higher; and vice versa.","Lower temperature to 500-600° C., and input ammonia and trimethyl gallium, and grow a 20-50 nm AlInGaN low-temperature buffer layer 32 (buffer) for stress release; then, switch off trimethyl gallium; wherein, the epitaxial growth method can be CVD (chemical vapor deposition), PECVD (plasma enhanced chemical vapor deposition), MBE (molecular beam epitaxy), and HVPE (hydride vapor phase epitaxy).","This embodiment prefers to use MOCVD, but is not limited to this method.","Referring to FIG.","8, grow a semiconductor bottom structure having a V pit over the low-temperature buffer layer 32 through epitaxial growth, wherein, the V pit side 17 is a semi-polar surface, corresponding to the (1-101) family of crystal planes.","Specifically, rise temperature to 870-970° C., and anneal for 5 s-2 min.","Then, input trimethyl gallium for growing a 1-2 μm thick non-doping GaN 33 (the first u-GaN layer); this layer is referred to as a 3D mode GaN growth layer; control growth temperature within 1,050° C., chamber pressure at 500 torr, and growth rate above 3 μm/h to obtain a large number of nanometer V pits.","The V pits can cover the entire epitaxial surface, and the C plane is completely disappeared; or, the V pits can partially cover most of the surface; in this embodiment, it is preferred that the nanometer V pits cover the entire epitaxial surface, having no C plane.","Referring to FIG.","9, control temperature within 1,100° C. and chamber pressure at 300 torr to grow a 1-2 μm thick non-doping GaN 34 (the second uGaN layer).","This layer is referred to as a 2D mode GaN growth layer; control growth rate above 4 μm/h, and the nanometer V pits cover the entire surface.","Referring to FIG.","10, lower temperature to about 1,050° C., and chamber pressure at 300 torr; grow a 1.5-4 μm thick gallium nitride, and input silicane for doping to form an N-type GaN 35 (nGaN layer); or, grow an uGaN/nGaN superlattice to replace the fully doped nGaN; provide electronic injection; control growth rate above 5 μm/h; and after growth of nGaN, the epitaxial surface is fully occupied by the nanometer V pits.","Referring to FIG.","11, continue to grow a semiconductor functional layer 36 over the surface of the semiconductor bottom structure having a nanometer V pit.","In this embodiment, GaN-based semiconductor material is preferred, and the structural layer is SLs/MQWs/pAlGaN/pGaN/p++, which serves as the functional layer.","Specifically, lower temperature to 770-870° C., and grow 15-30 circles of InGaN/GaN superlattice layers (SLs), wherein, InGaN thickness in each circle ranges from 1 to 3 nm, and GaN thickness range is 2.5-8 nm.","This superlattice layer serves as the low-temperature stress release layer for stress release; as epitaxial deposition rate of the semi-polar surface is only 1/10-⅕ that of the polar surface, fabricate an epitaxial layer having a thickness equivalent to that formed through the conventional method (polar growth); growth rate on the semi-polar surface can be quickened by 5-10 times by regulating source gas flow, or growth time is extended to 5-10 times that of conventional time; control temperature within 750-900° C., and continue to grow 5-15 circles of InGaN/GaN multiquantum well layers (MQWs), serving as the light emitting layer; growth rate is same as that of the low-temperature stress release layer (InGaN/GaN superlattice layer); control temperature within 800-950° C., and grow a p-type AlGaN electron blocking layer (pAlGaN) to block electron expansion; growth rate is same as that of the low-temperature stress release layer; rise temperature to 900-1050° C.; grow the p-type GaN layer (pGaN), and provide hole injection; the growth rate is same as that of the low-temperature pressure stress layer (InGaN/GaN superlattice layer); under 900-1,050° C., grow a heavily-doped p-type GaN contact layer (p++), which is easily for subsequent fabrication of common transparent electrode (such as ITO) of LED device to form ohmic contact; the growth rate is same as the treatment method of the low-temperature stress release layer (InGaN/GaN superlattice layer).","It should be noted that, the p-type GaN layer and the heavily-doped p-type GaN contact layer (p++) require growth conditions different from the p-type layer of conventional C-plane LED.","During growth of the p-type layer of a conventional C-plane LED, a large amount of hydrogen is input for filling in the V pit; in this embodiment, pGaN is grown in nitrogen conditions or little hydrogen to avoid filling the V pit.","Embodiment 5 Referring to FIG.","11, an LED epitaxial structure is provided, comprising from bottom to up: a sapphire substrate 31, a buffer layer 32, a semiconductor bottom structure having nanometer V pits, which comprises a first u-GaN layer 33, a second u-GaN layer 34 and an n-GaN layer 35, a semiconductor functional layer 36 comprising SLs/MQWs/pAlGaN/pGaN/p++ and an electrode structure (not shown).","Specifically, the sapphire substrate 31 in this embodiment can be a patterned sapphire substrate (PSS) or a flat sapphire substrate (FSS).","The wire diameter of the PSS pattern is 100-1,000 nm, and pattern height is 300-2,000 nm, and the interval is ⅕-½ of the circle size; under this size, the pattern neither influences existing chip fabrication nor subsequent photoetching process such as chip electrode fabrication.","If the pattern wire diameter size is small (<100 nm), V pit is small, and low-temperature functional layers at the V pit bottom are overlapped, wherein, the overlapping portion occupies highly proportion of the inner wall proportion of the entire V pit, which is of poor lighting, thus influencing lighting efficiency of the device, therefore, the size shall not be too small; if the wire diameter size of the pattern is too large (>1,000 nm), combination degree of the epitaxial structure and the existing chip process is low, which is not easy to fabricate a LED device.","The buffer layer 32 material is AlInGaN semiconductor layer, formed over the sapphire substrate 31, which eliminates the lattice mismatch caused by lattice constant difference between the sapphire substrate 31 and the first-conductive type semiconductor layer, thus improving epitaxial growth quality.","A semiconductor bottom structure having a nanometer V pit formed over the buffer layer 32, wherein, the semiconductor bottom structure comprises from bottom to up: a 1-2 μm thick non-doping GaN 33 (the first uGaN layer), 1-2 μm thick non-doping GaN 34 (the second uGaN layer) and a 1.5-4 μm thick N-type GaN 35 (nGaN layer).","Nanometer V pits are formed on the surface of each structure layer, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes.","The wire diameter size of the V pit is 100-1,000 nm.","The SLs, MQWs, pAlGaN, pGaN and p++ form a semiconductor functional layer 36, which are formed over the nGaN surface of the nanometer V pit to obtain corresponding nanometer V pit on the surface of the semiconductor functional layer 36.The epitaxial structure formed through this method can combine with the existing chip fabrication.","In addition, the structure has surface roughening effect and the light extraction efficiency is high.","Embodiment 6 Referring to FIG.","12, the difference between this embodiment and Embodiment 4 is that: The surface of the semiconductor functional layer 36 in Embodiment 4 has nanometer V pit.","The semiconductor functional layer 46 in this embodiment comprises a first semiconductor functional layer 461 and a second semiconductor functional layer 462, wherein, the first semiconductor functional layer 461 comprises SLs, MQWs and pAlGaN.","The growth method is same as Embodiment 4, namely, quicken growth rate of the semi-polar surface to 5-10 times of the conventional polar surface or extend growth time to 5-10 times of the conventional polar surface to obtain nanometer V pits over the first semiconductor functional layer; the second semiconductor functional layer 462 comprises pGaN and p++, which employs conventional p-type GaN growth mode (2D mode growth with growth temperature surrounding 950° C. by inputting a large amount of H2).","Fill in surfaces of the nanometer V pits after the first semiconductor functional layer is grown so that the epitaxial structure can completely combine with conventional chip.","Embodiment 7 Referring to FIG.","13, the difference between this embodiment and Embodiment 4 is that: The first u-GaN layer with 3D mode growth of the patterned sapphire substrate in Embodiment 4 forms a 2D film between sapphire substrates (at the interval) and the pattern top forms a V pit; in this embodiment, after depositing a buffer layer 52 on the flat sapphire substrate (FSS) 51, rise temperature to 990-1,000° C. Under this temperature, anneal for 5 s-5 minutes.","Take the nucleation island on the sapphire substrate surface (not shown in the figure) as the nucleation center of the first u-GaN layer 53.Use 3D mode for growth so as to grow a plurality of nanometer V pits with different sizes and in random distribution.","For nanometer sapphire pattern substrate, density of the nanometer V pit directly corresponds to the sapphire pattern circle; for flat sapphire substrate, density of the nanometer V pit depends on growth conditions of the buffer layer; by controlling growth temperature and rate, a large number of nanometer V pits of different sizes are formed in random; the wire diameter size of the nanometer V pit is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.","In some too small V pits (such as less than 100 nm), light emitting efficiency is poor; in some too big V pits (such as approximate 1,000 nm), it brings negative effect on chip fabrication, and influences light-emitting device performance; subsequent embodiments are same as Embodiment 4.Embodiment 8 Referring to FIG.","14, the difference between this embodiment and Embodiment 6 is that: The sapphire substrate 41 in Embodiment 6 is a patterned sapphire substrate (PSS), and the sapphire substrate 61 in this embodiment is a flat sapphire substrate (FSS).","To sum up, various embodiments of the present disclosure control growth conditions of the bottom layer structure to control size/distribution of V pits, and matches subsequent design of semiconductor functional layer to combine with conventional chip fabrication.","It simplifies fabrication process as it requires neither selective area epitaxy nor secondary epitaxy; in addition, the semi-polar surface is a (1-101) family of crystal planes, and reciprocal spaces of the smooth bottom of the conduction band and the top of the valence band have large overlapping area, which greatly increases radiation compound efficiency; the semi-polar surface is exposed by adjusting the material growth process without restricting substrate geometrical shape, thus fabricating a semi-polar surface material with high operability and low cost.","Although specific embodiments have been described above in detail, the description is merely for purposes of illustration.","It should be appreciated, therefore, that many aspects described above are not intended as required or essential elements unless explicitly stated otherwise.","Various modifications of, and equivalent acts corresponding to, the disclosed aspects of the exemplary embodiments, in addition to those described above, can be made by a person of ordinary skill in the art, having the benefit of the present disclosure, without departing from the spirit and scope of the disclosure defined in the following claims, the scope of which is to be accorded the broadest interpretation so as to encompass such modifications and equivalent structures."]],"string":"[\n [\n \"Semi-polar LED Epitaxial Structure and Fabrication Method\",\n \"A semi-polar LED epitaxial structure includes, from bottom to up: a sapphire substrate; a semiconductor bottom layer structure; and a semiconductor functional layer; wherein: a surface of the semiconductor bottom structure has V pits; and a side of the V pits is a semi-polar surface, corresponding to (1-101) family of crystal planes.\",\n \"A fabrication method includes: providing a sapphire substrate; growing a semiconductor bottom structure over the sapphire substrate to form V pits on a surface, wherein a side of the V pits is a semi-polar surface, corresponding to (1-101) family of crystal planes; and growing a semiconductor functional layer over the semi-polar surface of the semiconductor bottom structure.\"\n ],\n [\n \"1.A semi-polar LED epitaxial structure, comprising from bottom to up: a sapphire substrate; a semiconductor bottom layer structure; and a semiconductor functional layer; wherein: a surface of the semiconductor bottom structure has V pits; and a side of the V pits is a semi-polar surface, corresponding to (1-101) family of crystal planes.\",\n \"2.The semi-polar LED epitaxial structure of claim 1, wherein the sapphire substrate is a patterned sapphire substrate or a flat sapphire substrate.\",\n \"3.The semi-polar LED epitaxial structure of claim 1, wherein the sapphire substrate is a patterned sapphire substrate, wherein, the pattern density is consistent with the V pit density.\",\n \"4.The semi-polar LED epitaxial structure of claim 1, wherein the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.\",\n \"5.The semi-polar LED epitaxial structure of claim 1, wherein the semiconductor functional layer material includes GaN-based semiconductor material.\",\n \"6.The semi-polar LED epitaxial structure of claim 1, wherein the V pits are nanometer V pits, wherein.\",\n \"7.The semi-polar LED epitaxial structure of claim 6, wherein the sapphire substrate is a nanometer patterned sapphire substrate, and wire diameter size of the nanometer V pits is 100-1000 nm.\",\n \"8.The semi-polar LED epitaxial structure of claim 6, wherein the sapphire substrate is a flat sapphire substrate, and wire diameter size of the nanometer V pits is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.\",\n \"9.The semi-polar LED epitaxial structure of claim 6, wherein the semiconductor functional layer comprises a first semiconductor functional layer and a second semiconductor functional layer, and the first semiconductor functional layer surface has the nanometer V pits.\",\n \"10.A fabrication method of a semi-polar LED epitaxial structure, the method comprising: (1) providing a sapphire substrate; (2) growing a semiconductor bottom structure over the sapphire substrate to form V pits on a surface, wherein a side of the V pits is a semi-polar surface, corresponding to (1-101) family of crystal planes; and (3) growing a semiconductor functional layer over the semi-polar surface of the semiconductor bottom structure.\",\n \"11.The fabrication method of claim 10, wherein: the sapphire substrate is a patterned sapphire substrate, and density of the V pit is adjusted by the pattern density of the patterned sapphire substrate.\",\n \"12.The fabrication method of claim 10, wherein the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.\",\n \"13.The fabrication method of claim 10, wherein in step (2), control the growth temperature low (within 1,100° C.) and growth rate fast (above 3 μm/h) to form a V pit on the surface of the semiconductor bottom structure.\",\n \"14.The fabrication method of claim 10, wherein increase growth rate of the semi-polar surface in step (3) to 5-10 times of that of a conventional polar surface, or extend the growth time to 5-10 times of that of a conventional polar surface.\",\n \"15.The fabrication method of claim 10, wherein the V pits are nanometer V pits.\",\n \"16.The fabrication method of claim 15, wherein the sapphire substrate is a nanometer patterned sapphire substrate, and density of the V pit is adjusted by the pattern density of the nanometer patterned sapphire substrate.\",\n \"17.The fabrication method of claim 15, wherein the sapphire substrate is a nanometer patterned sapphire substrate, and wire diameter size of the nanometer V pit is 100-1000 nm.\",\n \"18.The fabrication method of claim 15, wherein the sapphire substrate is a flat sapphire substrate, and wire diameter size of the nanometer V pit is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.\",\n \"19.The fabrication method of claim 15, wherein in step (2), control the growth temperature low (within 1100° C.) and growth rate fast (above 3 μm/h) to form a nanometer V pit on the surface of the semiconductor bottom structure.\",\n \"20.The fabrication method of claim 15, wherein: the semiconductor functional layer comprises a first semiconductor functional layer and a second semiconductor functional layer, wherein, the first semiconductor functional layer surface has the nanometer V pits; and the nanometer V pits of the first semiconductor functional layer are obtained by quickening growth rate of the semi-polar surface to 5-10 times of that of a conventional polar surface, or extend the growth time to 5-10 times of that of a conventional polar surface.\"\n ],\n [\n \" BACKGROUND LED is a semiconductor solid light-emitting device, using semiconductor PN junction as the light emitting material for direct photovoltaic conversion.\",\n \"By far, polar GaN-based LED technology has been industrialized for over 20 years with tremendous improvements in performance.\",\n \"Yet, polar LED encounters performance bottleneck for photoelectric conversion efficiency can hardly improve dramatically after reaching 60%.\",\n \"At present, it is commonly believed that insurmountable polarization effect of polar LED device would influence LED light emitting efficiency.\",\n \"In recent years, numerous studies and literature reports have been made on semi-polar and non-polar materials and devices.\"\n ],\n [\n \" SUMMARY The inventors of the present disclosure have recognized that, main problems include that it is rather difficult to grow GaN materials on the semi-polar surface or non-polar surface.\",\n \"Two common methods for obtaining the semi-polar and non-polar GaN materials are as shown below: one is to obtain semi-polar or non-polar GaN film through non-polar and semi-polar sapphire; and the second is to obtain corresponding device through homoepitaxy by slicing semi-polar and non-polar surface of a homogeneous substrate.\",\n \"Through the first technology, it is hard to obtain high material quality; and the second technology has high material quality but the cost is high.\",\n \"Selective area epitaxy is another complex technology for growing semi-polar surface or non-polar surface; then, fabricate semi-polar or non-polar device over the semi-polar surface after in-situ growth; this process is complex and requires auxiliary materials and second epitaxial growth.\",\n \"From this point of view, how to obtain high quality materials is the main barrier of semi-polar and non-polar LEDs.\",\n \"Various embodiments of the present disclosure provide a semi-polar LED in-situ grown on the C-plane sapphire substrate and a fabrication method thereof, wherein, the surface of the semiconductor bottom structure is controlled to form a V pit (including nanometer V pit) over the sapphire plane or the patterned substrate through epitaxial growth to further fabricate a semiconductor functional layer at the V pit side to finally form a semi-polar LED epitaxial structure.\",\n \"According to one aspect of the present disclosure, provide a semi-polar LED, comprising from bottom to up: a sapphire substrate, a semiconductor bottom structure and a semiconductor functional layer, wherein, the surface of the semiconductor bottom structure has a V pit, and the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes.\",\n \"In some embodiments, the sapphire substrate is a patterned sapphire substrate or a flat sapphire substrate.\",\n \"In some embodiments, the sapphire substrate is a patterned sapphire substrate, wherein, the pattern density is consistent with the V pit density.\",\n \"In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.\",\n \"In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.\",\n \"According to a second aspect of the present disclosure, a fabrication method of a semi-polar LED includes: (1) providing a sapphire substrate; (2) growing a semiconductor bottom structure over the sapphire substrate to form a V pit on the surface, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes; and (3) growing a semiconductor functional layer over the semiconductor bottom structure.\",\n \"In some embodiments, the sapphire substrate is a patterned sapphire substrate or a flat sapphire substrate.\",\n \"In some embodiments, density of the V pit is adjusted by the pattern density of the patterned sapphire substrate.\",\n \"In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.\",\n \"In some embodiments, in step (2), control the growth temperature low (within 1,100° C.) and growth rate fast (above 3 μm/h) to form a V pit on the surface of the semiconductor bottom structure.\",\n \"In some embodiments, quicken growth rate of the semi-polar surface in step (3) to 5-10 times of that of a conventional polar surface, or extend the growth time to 5-10 times of that of a conventional polar surface.\",\n \"In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.\",\n \"According to a third aspect of the present disclosure, a semi-polar LED is provided, including from bottom to up: a sapphire substrate, a semiconductor bottom layer structure and a semiconductor functional layer, wherein: the surface of the semiconductor bottom structure has a nanometer V pit, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes.\",\n \"In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate or a flat sapphire substrate.\",\n \"In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate, and wire diameter size of the nanometer V pit is 100-1,000 nm.\",\n \"In some embodiments, the sapphire substrate is a flat sapphire substrate, and wire diameter size of the nanometer V pit is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.\",\n \"In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.\",\n \"In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.\",\n \"In some embodiments, the semiconductor functional layer comprises a first semiconductor functional layer and a second semiconductor functional layer, wherein, the first semiconductor functional layer surface has a nanometer V pit.\",\n \"According to a fourth aspect of the present invention, a fabrication method of a semi-polar LED is provided, comprising: (1) providing a sapphire substrate; (2) growing a semiconductor bottom structure over the sapphire substrate to form a nanometer V pit on the surface, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes; and (3) growing a semiconductor functional layer over the semiconductor bottom structure.\",\n \"In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate or a flat sapphire substrate.\",\n \"In some embodiments, density of the V pit is adjusted by the pattern density of the nanometer patterned sapphire substrate.\",\n \"In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate, and wire diameter size of the nanometer V pit is 100-1000 nm.\",\n \"In some embodiments, the sapphire substrate is a flat sapphire substrate, and wire diameter size of the nanometer V pit is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.\",\n \"In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an uGaN layer, an nGaN layer or any combination thereof.\",\n \"In some embodiments, in step (2), control the growth temperature low (within 1,100° C.) and growth rate fast (above 3 μm/h) to form a nanometer V pit on the surface of the semiconductor bottom structure.\",\n \"In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.\",\n \"In some embodiments, the semiconductor functional layer comprises a first semiconductor functional layer and a second semiconductor functional layer, wherein, the first semiconductor functional layer surface has a nanometer V pit.\",\n \"In some embodiments, the nanometer V pit of the first semiconductor functional layer is obtained by quickening growth rate of the semi-polar surface to 5-10 times of that of a conventional polar surface, or extend the growth time to 5-10 times of that of a conventional polar surface.\",\n \"Compared with conventional technologies, the conduction band and the valence band of the LED epitaxial structure having a conventional polar surface (001) are bent due to polarization electric field, so that the reciprocal spaces of the bottom of the conduction band and the top of the valence band are not in a same position, which similarly changes to indirect band gap semiconductor light emitting (in the case of AlInGaN-based materials, it is direct band gap light emitting material).\",\n \"Consequently, the radiant composition light emitting efficiency is reduced, and non-radiant composition probability increases.\",\n \"Various embodiments of the present disclosure can have one or more of the following technical effects: (1) the fabrication process is simplified as it requires neither selective area epitaxy nor secondary epitaxy; (2) the semi-polar surface is (1-101) family of crystal planes.\",\n \"The reciprocal spaces of the smooth bottom of the conduction band and the top of the valence band have large overlapping area, which greatly increases radiation compound efficiency; (3) the semi-polar surface is exposed by adjusting the material growth process without restricting substrate geometrical shape, thus fabricating a semi-polar surface material with high operability and low cost.\",\n \"(4) form a semiconductor functional layer over the surface of the semiconductor bottom structure having a nanometer V pit so that the obtained epitaxial structure can combine with the existing chip fabrication for facilitating semiconductor light-emitting devices such as LED chips.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a continuation of, and claims priority to, PCT/CN2016/111663 filed on Dec. 23, 2016, which claims priority to Chinese Patent Application Nos.\",\n \"CN 201610030333.8 and CN 201610030332.3, both filed on Jan. 18, 2016.The disclosures of these applications are hereby incorporated by reference in their entirety.\",\n \"BACKGROUND LED is a semiconductor solid light-emitting device, using semiconductor PN junction as the light emitting material for direct photovoltaic conversion.\",\n \"By far, polar GaN-based LED technology has been industrialized for over 20 years with tremendous improvements in performance.\",\n \"Yet, polar LED encounters performance bottleneck for photoelectric conversion efficiency can hardly improve dramatically after reaching 60%.\",\n \"At present, it is commonly believed that insurmountable polarization effect of polar LED device would influence LED light emitting efficiency.\",\n \"In recent years, numerous studies and literature reports have been made on semi-polar and non-polar materials and devices.\",\n \"SUMMARY The inventors of the present disclosure have recognized that, main problems include that it is rather difficult to grow GaN materials on the semi-polar surface or non-polar surface.\",\n \"Two common methods for obtaining the semi-polar and non-polar GaN materials are as shown below: one is to obtain semi-polar or non-polar GaN film through non-polar and semi-polar sapphire; and the second is to obtain corresponding device through homoepitaxy by slicing semi-polar and non-polar surface of a homogeneous substrate.\",\n \"Through the first technology, it is hard to obtain high material quality; and the second technology has high material quality but the cost is high.\",\n \"Selective area epitaxy is another complex technology for growing semi-polar surface or non-polar surface; then, fabricate semi-polar or non-polar device over the semi-polar surface after in-situ growth; this process is complex and requires auxiliary materials and second epitaxial growth.\",\n \"From this point of view, how to obtain high quality materials is the main barrier of semi-polar and non-polar LEDs.\",\n \"Various embodiments of the present disclosure provide a semi-polar LED in-situ grown on the C-plane sapphire substrate and a fabrication method thereof, wherein, the surface of the semiconductor bottom structure is controlled to form a V pit (including nanometer V pit) over the sapphire plane or the patterned substrate through epitaxial growth to further fabricate a semiconductor functional layer at the V pit side to finally form a semi-polar LED epitaxial structure.\",\n \"According to one aspect of the present disclosure, provide a semi-polar LED, comprising from bottom to up: a sapphire substrate, a semiconductor bottom structure and a semiconductor functional layer, wherein, the surface of the semiconductor bottom structure has a V pit, and the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes.\",\n \"In some embodiments, the sapphire substrate is a patterned sapphire substrate or a flat sapphire substrate.\",\n \"In some embodiments, the sapphire substrate is a patterned sapphire substrate, wherein, the pattern density is consistent with the V pit density.\",\n \"In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.\",\n \"In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.\",\n \"According to a second aspect of the present disclosure, a fabrication method of a semi-polar LED includes: (1) providing a sapphire substrate; (2) growing a semiconductor bottom structure over the sapphire substrate to form a V pit on the surface, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes; and (3) growing a semiconductor functional layer over the semiconductor bottom structure.\",\n \"In some embodiments, the sapphire substrate is a patterned sapphire substrate or a flat sapphire substrate.\",\n \"In some embodiments, density of the V pit is adjusted by the pattern density of the patterned sapphire substrate.\",\n \"In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.\",\n \"In some embodiments, in step (2), control the growth temperature low (within 1,100° C.) and growth rate fast (above 3 μm/h) to form a V pit on the surface of the semiconductor bottom structure.\",\n \"In some embodiments, quicken growth rate of the semi-polar surface in step (3) to 5-10 times of that of a conventional polar surface, or extend the growth time to 5-10 times of that of a conventional polar surface.\",\n \"In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.\",\n \"According to a third aspect of the present disclosure, a semi-polar LED is provided, including from bottom to up: a sapphire substrate, a semiconductor bottom layer structure and a semiconductor functional layer, wherein: the surface of the semiconductor bottom structure has a nanometer V pit, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes.\",\n \"In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate or a flat sapphire substrate.\",\n \"In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate, and wire diameter size of the nanometer V pit is 100-1,000 nm.\",\n \"In some embodiments, the sapphire substrate is a flat sapphire substrate, and wire diameter size of the nanometer V pit is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.\",\n \"In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an u-GaN layer, an n-GaN layer or any combination thereof.\",\n \"In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.\",\n \"In some embodiments, the semiconductor functional layer comprises a first semiconductor functional layer and a second semiconductor functional layer, wherein, the first semiconductor functional layer surface has a nanometer V pit.\",\n \"According to a fourth aspect of the present invention, a fabrication method of a semi-polar LED is provided, comprising: (1) providing a sapphire substrate; (2) growing a semiconductor bottom structure over the sapphire substrate to form a nanometer V pit on the surface, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes; and (3) growing a semiconductor functional layer over the semiconductor bottom structure.\",\n \"In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate or a flat sapphire substrate.\",\n \"In some embodiments, density of the V pit is adjusted by the pattern density of the nanometer patterned sapphire substrate.\",\n \"In some embodiments, the sapphire substrate is a nanometer patterned sapphire substrate, and wire diameter size of the nanometer V pit is 100-1000 nm.\",\n \"In some embodiments, the sapphire substrate is a flat sapphire substrate, and wire diameter size of the nanometer V pit is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.\",\n \"In some embodiments, the semiconductor bottom layer structure comprises a buffer layer, an uGaN layer, an nGaN layer or any combination thereof.\",\n \"In some embodiments, in step (2), control the growth temperature low (within 1,100° C.) and growth rate fast (above 3 μm/h) to form a nanometer V pit on the surface of the semiconductor bottom structure.\",\n \"In some embodiments, the semiconductor functional layer material includes GaN-based semiconductor material.\",\n \"In some embodiments, the semiconductor functional layer comprises a first semiconductor functional layer and a second semiconductor functional layer, wherein, the first semiconductor functional layer surface has a nanometer V pit.\",\n \"In some embodiments, the nanometer V pit of the first semiconductor functional layer is obtained by quickening growth rate of the semi-polar surface to 5-10 times of that of a conventional polar surface, or extend the growth time to 5-10 times of that of a conventional polar surface.\",\n \"Compared with conventional technologies, the conduction band and the valence band of the LED epitaxial structure having a conventional polar surface (001) are bent due to polarization electric field, so that the reciprocal spaces of the bottom of the conduction band and the top of the valence band are not in a same position, which similarly changes to indirect band gap semiconductor light emitting (in the case of AlInGaN-based materials, it is direct band gap light emitting material).\",\n \"Consequently, the radiant composition light emitting efficiency is reduced, and non-radiant composition probability increases.\",\n \"Various embodiments of the present disclosure can have one or more of the following technical effects: (1) the fabrication process is simplified as it requires neither selective area epitaxy nor secondary epitaxy; (2) the semi-polar surface is (1-101) family of crystal planes.\",\n \"The reciprocal spaces of the smooth bottom of the conduction band and the top of the valence band have large overlapping area, which greatly increases radiation compound efficiency; (3) the semi-polar surface is exposed by adjusting the material growth process without restricting substrate geometrical shape, thus fabricating a semi-polar surface material with high operability and low cost.\",\n \"(4) form a semiconductor functional layer over the surface of the semiconductor bottom structure having a nanometer V pit so that the obtained epitaxial structure can combine with the existing chip fabrication for facilitating semiconductor light-emitting devices such as LED chips.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and constitute a part of this specification, together with the embodiments, are therefore to be considered in all respects as illustrative and not restrictive.\",\n \"In addition, the drawings are merely illustrative, which are not drawn to scale.\",\n \"In the drawings: 11, 21, 31, 41, 51, 61: sapphire substrate; 12, 22, 32, 42, 52, 62: buffer layer; 13, 23, 33, 43, 53, 63: first u-GaN layer; 14, 24, 34, 44, 54, 64: second u-GaN layer; 15, 25, 35, 45, 55, 65: n-GaN layer; 16, 26, 36, 46, 56, 66: semiconductor functional layer; 17, 27, 37, 47, 57, 67: V pit side (corresponding to the (1-101) family of crystal planes); 461: 661: first semiconductor functional layer; 462: 662: second semiconductor functional layer.\",\n \"FIG.\",\n \"1 is a sectional view illustrating a first step of fabricating the LED epitaxial structure fabricated according to Embodiment 1; FIG.\",\n \"2 illustrates a second step; FIG.\",\n \"3 illustrates a third step; FIG.\",\n \"4 illustrates a fourth step; FIG.\",\n \"5 is a sectional view of an LED epitaxial structure according to Embodiment 2; FIG.\",\n \"6 is a sectional view diagram of the LED epitaxial structure according to Embodiment 3; FIG.\",\n \"7 is a sectional view illustrating a first step of fabricating the LED epitaxial structure fabricated according to Embodiment 4; FIG.\",\n \"8 illustrates a second step; FIG.\",\n \"9 illustrates a third step; FIG.\",\n \"10 illustrates a fourth step; FIG.\",\n \"11 is a sectional view of an LED epitaxial structure according to Embodiment 5; FIG.\",\n \"12 is a sectional view diagram of the LED epitaxial structure according to Embodiment 6; FIG.\",\n \"13 is a sectional view diagram of the LED epitaxial structure according to Embodiment 7; and FIG.\",\n \"14 is a sectional view diagram of the LED epitaxial structure according to Embodiment 8 of the present disclosure.\",\n \"DETAILED DESCRIPTION Various embodiments of the present disclosure will be explained in details with reference to the accompanying drawings.\",\n \"Before further description, it should be understood, however, that various modifications and changes may be made to these embodiments.\",\n \"Therefore, the present invention is not limited to the embodiments below.\",\n \"It should also be noted that the scope of the present disclosure should still be subjected to the scope defined in the claims and the embodiments are merely for purposes of illustration, rather than restricting.\",\n \"Unless otherwise specified, all technical and scientific words shall have the same meanings as understood by persons skilled in the art.\",\n \"Embodiment 1 Referring to FIGS.\",\n \"1-5, this embodiment provides a fabrication method of a GaN semi-polar LED, which addresses the problem of difficult growth of semi-polar materials and high cost of homogeneous semi-polar material.\",\n \"The technical scheme below takes a patterned sapphire substrate as an example.\",\n \"The fabrication method comprises steps below: Referring to FIG.\",\n \"1, provide a sapphire substrate 11 (Sapphire), and put it into a metal organic chemical vapor deposition (MOCVD) device; rise temperature to 1,000-1,200° C. for treating 3-10 minutes amid hydrogen atmosphere; employ a patterned sapphire substrate (PSS) to obtain a regular surface V pit (dent) array, which corresponds to each patterned substrate bulge (island).\",\n \"V pit density can be adjusted through pattern density of the patterned substrate.\",\n \"When the pattern density of the patterned substrate is determined, the V pit density is same, and then size of each V pit is determined, namely, the PSS pattern density is kept consistent with the V pit; employ a flat sapphire substrate (FSS) to obtain a semi-polar surface LED, where V pits on the surface are of different sizes and in random distribution; however, the density is influenced by buffer layer thickness and annealing conditions of the buffer layer: the thicker is the buffer layer, the lower is annealing temperature, and then, annealing time becomes shorter, island density is higher, and subsequent V pit density is higher; and vice versa.\",\n \"Lower temperature to 500-600° C., and input ammonia and trimethyl gallium, and grow a 20-50 nm AlInGaN low-temperature buffer layer 12 (buffer) for stress release; then, switch off trimethyl gallium; wherein, the epitaxial growth method can be CVD (chemical vapor deposition), PECVD (plasma enhanced chemical vapor deposition), MBE (molecular beam epitaxy), and HVPE (hydride vapor phase epitaxy).\",\n \"This embodiment prefers to use MOCVD, but is not limited to this method.\",\n \"Referring to FIG.\",\n \"2, grow a semiconductor bottom structure having a V pit over the low-temperature buffer layer 12 through epitaxial growth, wherein, the V pit side 17 is a semi-polar surface, corresponding to the (1-101) family of crystal planes.\",\n \"Specifically, rise temperature to 1,000-1,100° C., and anneal for 1-5 minute.\",\n \"Then, input trimethyl gallium for growing a 1-2 μm thick non-doping GaN 13 (the first uGaN layer); this layer is referred to as a 3D mode GaN growth layer; control growth temperature within 1,050° C., chamber pressure at 500 torr, and growth rate above 3 μm/h to obtain a large number of V pits.\",\n \"The V pits can cover the entire epitaxial surface, and the C plane is completely disappeared; or, the V pits can partially cover the surface; in this embodiment, it is preferred that the V pits cover the entire epitaxial surface, having no C plane.\",\n \"Referring to FIG.\",\n \"3, control temperature within 1,100° C. and chamber pressure at 300 torr to grow a 1-2 μm thick non-doping GaN 14 (the second uGaN layer).\",\n \"This layer is referred to as a 2D mode GaN growth layer; control growth rate above 4 μm/h, and the V pits cover the entire surface.\",\n \"Referring to FIG.\",\n \"4, lower temperature to about 1050° C., and chamber pressure at 300 torr; grow a 1.5-4 μm thick gallium nitride, and input silicane for doping to form an N-type GaN 15 (nGaN layer); or, grow an uGaN/nGaN superlattice to replace the fully doped nGaN; provide electronic injection; control growth rate above 5 μm/h; and after growth of nGaN, the epitaxial surface is fully occupied by the V pits.\",\n \"Referring to FIG.\",\n \"5, continue to grow a semiconductor functional layer over the surface of the semiconductor bottom structure having a V pit.\",\n \"In this embodiment, GaN-based semiconductor material is preferred, and the structural layer is SLs/MQWs/pAlGaN/pGaN/p++, which serves as the functional layer.\",\n \"Specifically, lower temperature to 770-870° C., and grow 15-30 circles of InGaN/GaN superlattice layers (SLs), wherein, InGaN thickness in each circle ranges from 1 to 3 nm, and GaN thickness range is 2.5-8 nm.\",\n \"This superlattice layer serves as the low-temperature stress release layer for stress release; as epitaxial deposition rate of the semi-polar surface is only 1/10-⅕ that of the polar surface; fabricate an epitaxial layer having a thickness equivalent to that formed through a conventional method (polar growth); growth rate on the semi-polar surface can be quickened by 5-10 times by regulating source gas flow, or growth time is extended to 5-10 times that of conventional time; control temperature within 750-900° C., and continue to grow 5-15 circles of InGaN/GaN multiquantum well layers (MQWs), serving as the light emitting layer; growth rate is same as that of the low-temperature stress release layer (InGaN/GaN superlattice layer); control temperature within 800-950° C., and grow a p-type AlGaN electron blocking layer (pAlGaN) to block electron expansion; growth rate is same as that of the low-temperature stress release layer; rise temperature to 900-1050° C.; grow the p-type GaN layer (pGaN), and provide hole injection; the growth rate is same as that of the low-temperature pressure stress layer (InGaN/GaN superlattice layer); under 900-1,050° C., grow a heavily-doped p-type GaN contact layer (p++), which is easily for subsequent fabrication of common transparent electrode (such as ITO) of LED device to form ohmic contact; the growth rate is same as the treatment method of the low-temperature stress release layer (InGaN/GaN superlattice layer).\",\n \"It should be noted that, the p-type GaN layer and the heavily-doped p-type GaN contact layer (p++) require growth conditions different from the p-type layer of conventional C-plane LED.\",\n \"During growth of the p-type layer of a conventional C-plane LED, a large amount of hydrogen is input for filling (filling up) the V pit; in this embodiment, pGaN is grown in nitrogen conditions or little hydrogen to avoid filling up the V pit.\",\n \"Embodiment 2 Referring to FIG.\",\n \"5, a LED epitaxial structure is provided, comprising from bottom to up: a sapphire substrate 11, a buffer layer 12, a semiconductor bottom structure having a V pit which comprises a first u-GaN layer 13, a second u-GaN layer 14 and an nGaN layer 15, and a semiconductor functional layer 16 comprising SLs/MQWs/pAlGaN/pGaN/p++.\",\n \"Specifically, the sapphire substrate 11 in this embodiment can be a patterned sapphire substrate (PSS), or a flat sapphire substrate (FSS).\",\n \"In this embodiment, a PSS substrate is preferred.\",\n \"The limited range of characteristic size (circle) is 1-10 μm, but is not limited to this range.\",\n \"The buffer layer 12 material is AlInGaN semiconductor layer, formed over the sapphire substrate 11, which eliminates the lattice mismatch caused by lattice constant difference between the sapphire substrate 11 and the first-conductive type semiconductor layer, thus improving epitaxial growth quality.\",\n \"A semiconductor bottom structure having a V pit is formed over the buffer layer 12, wherein, the semiconductor bottom structure comprises from bottom to up: a 1-2 μm thick non-doping GaN 13 (the first uGaN layer), a 1-2 μm thick non-doping GaN 14 (the second uGaN layer) and a 1.5-4 μm thick N-type GaN 15 (nGaN layer).\",\n \"V pits are formed on the surface of each structure layer, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes.\",\n \"SLs, MQWs, pAlGaN, pGaN and p++ form a semiconductor functional layer 16, which are formed on the nGaN surface of the V pits in successive.\",\n \"Embodiment 3 Referring to FIG.\",\n \"6, the difference between this embodiment and Embodiment 1 is that: The first uGaN layer 13 with 3D mode growth of the patterned sapphire substrate in Embodiment 1 forms a 2D film between sapphire substrates (at the interval) and the pattern top forms a V pit; in this embodiment, after depositing a buffer layer 22 on the flat sapphire substrate, rise temperature to 1,000-1,100° C. Under this temperature, anneal for 1-5 minutes.\",\n \"Take the nucleation island on the sapphire substrate surface (not shown in the figure) as the nucleation center of the first uGaN layer 23; form a plurality of V pits with different sizes and in random distribution through 3D mode growth; later step is same as Embodiment 1.To sum up, various embodiments of the present disclosure can simplify fabrication process as it requires neither selective area epitaxy nor secondary epitaxy; in addition, the semi-polar surface is a (1-101) family of crystal planes, reciprocal spaces of the smooth bottom of the conduction band and the top of the valence band have large overlapping area, which greatly increases radiation compound efficiency; the semi-polar surface is exposed by adjusting the material growth process without restricting substrate geometrical shape, thus fabricating a semi-polar surface material with high operability and low cost.\",\n \"Embodiment 4 Referring to FIGS.\",\n \"7-12, this embodiment provides a fabrication method of GaN semi-polar LED epitaxial structure, which addresses the problem of difficult growth of semi-polar materials and high cost of homogeneous semi-polar material.\",\n \"The technical scheme below takes nanometer sapphire substrate as an example.\",\n \"The fabrication method comprises steps below: Referring to FIG.\",\n \"7, provide a nanometer patterned sapphire substrate 31 (Sapphire), and put it into a metal organic chemical vapor deposition (MOCVD) device, and rise temperature to 1,000-1,200° C. for treating 3-10 minutes under hydrogen atmosphere; use a nanometer patterned sapphire substrate (PSS) to obtain regular surface V pit (dent) array; the wire diameter of the PSS pattern is 100-1,000 nm, and pattern height is 300-2000 nm, and the interval is ⅕-½ of the circle size; under this size, the pattern neither influences existing chip fabrication nor subsequent photoetching process such as chip electrode fabrication.\",\n \"If the pattern wire diameter size is small (<100 nm), V pit is small, and low-temperature functional layers at the V pit bottom are overlapped, wherein, the overlapping portion occupies highly proportion of the inner wall of the entire V pit, which is of poor lighting, thus influencing lighting efficiency of the device, therefore, the size shall not be too small; if the wire diameter size of the pattern is too large (>1,000 nm), combination degree of the epitaxial structure and the existing chip process is low, which is not easy to fabricate a LED device; corresponding to each PSS bulge (island), density of the V pit can be adjusted according to the pattern density; when the pattern density of the patterned substrate is determined, the V pit density is same; and size of each V pit is determined correspondingly, and the wire diameter size of the V pit is 100-1,000 m; when a plane substrate is used, a semi-polar surface LED can be obtained, where, V pits on the surface are of different sizes and in random distribution; however, the density is influenced by buffer layer thickness and annealing conditions of the buffer layer: the thicker is the buffer layer, the lower is annealing temperature, and then, annealing time becomes shorter, island density is higher, and subsequent V pit density is higher; and vice versa.\",\n \"Lower temperature to 500-600° C., and input ammonia and trimethyl gallium, and grow a 20-50 nm AlInGaN low-temperature buffer layer 32 (buffer) for stress release; then, switch off trimethyl gallium; wherein, the epitaxial growth method can be CVD (chemical vapor deposition), PECVD (plasma enhanced chemical vapor deposition), MBE (molecular beam epitaxy), and HVPE (hydride vapor phase epitaxy).\",\n \"This embodiment prefers to use MOCVD, but is not limited to this method.\",\n \"Referring to FIG.\",\n \"8, grow a semiconductor bottom structure having a V pit over the low-temperature buffer layer 32 through epitaxial growth, wherein, the V pit side 17 is a semi-polar surface, corresponding to the (1-101) family of crystal planes.\",\n \"Specifically, rise temperature to 870-970° C., and anneal for 5 s-2 min.\",\n \"Then, input trimethyl gallium for growing a 1-2 μm thick non-doping GaN 33 (the first u-GaN layer); this layer is referred to as a 3D mode GaN growth layer; control growth temperature within 1,050° C., chamber pressure at 500 torr, and growth rate above 3 μm/h to obtain a large number of nanometer V pits.\",\n \"The V pits can cover the entire epitaxial surface, and the C plane is completely disappeared; or, the V pits can partially cover most of the surface; in this embodiment, it is preferred that the nanometer V pits cover the entire epitaxial surface, having no C plane.\",\n \"Referring to FIG.\",\n \"9, control temperature within 1,100° C. and chamber pressure at 300 torr to grow a 1-2 μm thick non-doping GaN 34 (the second uGaN layer).\",\n \"This layer is referred to as a 2D mode GaN growth layer; control growth rate above 4 μm/h, and the nanometer V pits cover the entire surface.\",\n \"Referring to FIG.\",\n \"10, lower temperature to about 1,050° C., and chamber pressure at 300 torr; grow a 1.5-4 μm thick gallium nitride, and input silicane for doping to form an N-type GaN 35 (nGaN layer); or, grow an uGaN/nGaN superlattice to replace the fully doped nGaN; provide electronic injection; control growth rate above 5 μm/h; and after growth of nGaN, the epitaxial surface is fully occupied by the nanometer V pits.\",\n \"Referring to FIG.\",\n \"11, continue to grow a semiconductor functional layer 36 over the surface of the semiconductor bottom structure having a nanometer V pit.\",\n \"In this embodiment, GaN-based semiconductor material is preferred, and the structural layer is SLs/MQWs/pAlGaN/pGaN/p++, which serves as the functional layer.\",\n \"Specifically, lower temperature to 770-870° C., and grow 15-30 circles of InGaN/GaN superlattice layers (SLs), wherein, InGaN thickness in each circle ranges from 1 to 3 nm, and GaN thickness range is 2.5-8 nm.\",\n \"This superlattice layer serves as the low-temperature stress release layer for stress release; as epitaxial deposition rate of the semi-polar surface is only 1/10-⅕ that of the polar surface, fabricate an epitaxial layer having a thickness equivalent to that formed through the conventional method (polar growth); growth rate on the semi-polar surface can be quickened by 5-10 times by regulating source gas flow, or growth time is extended to 5-10 times that of conventional time; control temperature within 750-900° C., and continue to grow 5-15 circles of InGaN/GaN multiquantum well layers (MQWs), serving as the light emitting layer; growth rate is same as that of the low-temperature stress release layer (InGaN/GaN superlattice layer); control temperature within 800-950° C., and grow a p-type AlGaN electron blocking layer (pAlGaN) to block electron expansion; growth rate is same as that of the low-temperature stress release layer; rise temperature to 900-1050° C.; grow the p-type GaN layer (pGaN), and provide hole injection; the growth rate is same as that of the low-temperature pressure stress layer (InGaN/GaN superlattice layer); under 900-1,050° C., grow a heavily-doped p-type GaN contact layer (p++), which is easily for subsequent fabrication of common transparent electrode (such as ITO) of LED device to form ohmic contact; the growth rate is same as the treatment method of the low-temperature stress release layer (InGaN/GaN superlattice layer).\",\n \"It should be noted that, the p-type GaN layer and the heavily-doped p-type GaN contact layer (p++) require growth conditions different from the p-type layer of conventional C-plane LED.\",\n \"During growth of the p-type layer of a conventional C-plane LED, a large amount of hydrogen is input for filling in the V pit; in this embodiment, pGaN is grown in nitrogen conditions or little hydrogen to avoid filling the V pit.\",\n \"Embodiment 5 Referring to FIG.\",\n \"11, an LED epitaxial structure is provided, comprising from bottom to up: a sapphire substrate 31, a buffer layer 32, a semiconductor bottom structure having nanometer V pits, which comprises a first u-GaN layer 33, a second u-GaN layer 34 and an n-GaN layer 35, a semiconductor functional layer 36 comprising SLs/MQWs/pAlGaN/pGaN/p++ and an electrode structure (not shown).\",\n \"Specifically, the sapphire substrate 31 in this embodiment can be a patterned sapphire substrate (PSS) or a flat sapphire substrate (FSS).\",\n \"The wire diameter of the PSS pattern is 100-1,000 nm, and pattern height is 300-2,000 nm, and the interval is ⅕-½ of the circle size; under this size, the pattern neither influences existing chip fabrication nor subsequent photoetching process such as chip electrode fabrication.\",\n \"If the pattern wire diameter size is small (<100 nm), V pit is small, and low-temperature functional layers at the V pit bottom are overlapped, wherein, the overlapping portion occupies highly proportion of the inner wall proportion of the entire V pit, which is of poor lighting, thus influencing lighting efficiency of the device, therefore, the size shall not be too small; if the wire diameter size of the pattern is too large (>1,000 nm), combination degree of the epitaxial structure and the existing chip process is low, which is not easy to fabricate a LED device.\",\n \"The buffer layer 32 material is AlInGaN semiconductor layer, formed over the sapphire substrate 31, which eliminates the lattice mismatch caused by lattice constant difference between the sapphire substrate 31 and the first-conductive type semiconductor layer, thus improving epitaxial growth quality.\",\n \"A semiconductor bottom structure having a nanometer V pit formed over the buffer layer 32, wherein, the semiconductor bottom structure comprises from bottom to up: a 1-2 μm thick non-doping GaN 33 (the first uGaN layer), 1-2 μm thick non-doping GaN 34 (the second uGaN layer) and a 1.5-4 μm thick N-type GaN 35 (nGaN layer).\",\n \"Nanometer V pits are formed on the surface of each structure layer, wherein, the V pit side is a semi-polar surface, corresponding to (1-101) family of crystal planes.\",\n \"The wire diameter size of the V pit is 100-1,000 nm.\",\n \"The SLs, MQWs, pAlGaN, pGaN and p++ form a semiconductor functional layer 36, which are formed over the nGaN surface of the nanometer V pit to obtain corresponding nanometer V pit on the surface of the semiconductor functional layer 36.The epitaxial structure formed through this method can combine with the existing chip fabrication.\",\n \"In addition, the structure has surface roughening effect and the light extraction efficiency is high.\",\n \"Embodiment 6 Referring to FIG.\",\n \"12, the difference between this embodiment and Embodiment 4 is that: The surface of the semiconductor functional layer 36 in Embodiment 4 has nanometer V pit.\",\n \"The semiconductor functional layer 46 in this embodiment comprises a first semiconductor functional layer 461 and a second semiconductor functional layer 462, wherein, the first semiconductor functional layer 461 comprises SLs, MQWs and pAlGaN.\",\n \"The growth method is same as Embodiment 4, namely, quicken growth rate of the semi-polar surface to 5-10 times of the conventional polar surface or extend growth time to 5-10 times of the conventional polar surface to obtain nanometer V pits over the first semiconductor functional layer; the second semiconductor functional layer 462 comprises pGaN and p++, which employs conventional p-type GaN growth mode (2D mode growth with growth temperature surrounding 950° C. by inputting a large amount of H2).\",\n \"Fill in surfaces of the nanometer V pits after the first semiconductor functional layer is grown so that the epitaxial structure can completely combine with conventional chip.\",\n \"Embodiment 7 Referring to FIG.\",\n \"13, the difference between this embodiment and Embodiment 4 is that: The first u-GaN layer with 3D mode growth of the patterned sapphire substrate in Embodiment 4 forms a 2D film between sapphire substrates (at the interval) and the pattern top forms a V pit; in this embodiment, after depositing a buffer layer 52 on the flat sapphire substrate (FSS) 51, rise temperature to 990-1,000° C. Under this temperature, anneal for 5 s-5 minutes.\",\n \"Take the nucleation island on the sapphire substrate surface (not shown in the figure) as the nucleation center of the first u-GaN layer 53.Use 3D mode for growth so as to grow a plurality of nanometer V pits with different sizes and in random distribution.\",\n \"For nanometer sapphire pattern substrate, density of the nanometer V pit directly corresponds to the sapphire pattern circle; for flat sapphire substrate, density of the nanometer V pit depends on growth conditions of the buffer layer; by controlling growth temperature and rate, a large number of nanometer V pits of different sizes are formed in random; the wire diameter size of the nanometer V pit is in normal distribution, and peak size of normal distribution corresponds to 550±10 nm.\",\n \"In some too small V pits (such as less than 100 nm), light emitting efficiency is poor; in some too big V pits (such as approximate 1,000 nm), it brings negative effect on chip fabrication, and influences light-emitting device performance; subsequent embodiments are same as Embodiment 4.Embodiment 8 Referring to FIG.\",\n \"14, the difference between this embodiment and Embodiment 6 is that: The sapphire substrate 41 in Embodiment 6 is a patterned sapphire substrate (PSS), and the sapphire substrate 61 in this embodiment is a flat sapphire substrate (FSS).\",\n \"To sum up, various embodiments of the present disclosure control growth conditions of the bottom layer structure to control size/distribution of V pits, and matches subsequent design of semiconductor functional layer to combine with conventional chip fabrication.\",\n \"It simplifies fabrication process as it requires neither selective area epitaxy nor secondary epitaxy; in addition, the semi-polar surface is a (1-101) family of crystal planes, and reciprocal spaces of the smooth bottom of the conduction band and the top of the valence band have large overlapping area, which greatly increases radiation compound efficiency; the semi-polar surface is exposed by adjusting the material growth process without restricting substrate geometrical shape, thus fabricating a semi-polar surface material with high operability and low cost.\",\n \"Although specific embodiments have been described above in detail, the description is merely for purposes of illustration.\",\n \"It should be appreciated, therefore, that many aspects described above are not intended as required or essential elements unless explicitly stated otherwise.\",\n \"Various modifications of, and equivalent acts corresponding to, the disclosed aspects of the exemplary embodiments, in addition to those described above, can be made by a person of ordinary skill in the art, having the benefit of the present disclosure, without departing from the spirit and scope of the disclosure defined in the following claims, the scope of which is to be accorded the broadest interpretation so as to encompass such modifications and equivalent structures.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870949"}}},{"rowIdx":4493682,"cells":{"text":{"kind":"list like","value":[["Method for Selling Products with a Chance for Total Refund","A method performed by a processing device running on a server that enables a seller to present on a website a deal for selling products at a certain price, to presents continuously in real time the updated total number of buyers, to states that a person who will buy the product will receive a specific personal number which is equal to the updated total number of buyers plus one, to presents in the website a legal obligation that if in the future the updated total number of buyers will be equal to the specific personal number of the person when doubled by pre-determined number, then the person will be entitled to receives a specific or total refund or a specific sum of money."],["1.A method performed by a processing device running on a server, comprising: (a) enabling a seller to present on a website a deal for selling products at a certain price; (b) presenting continuously in real time on the website an updated total number of buyers who already have bought the product in the deal; (c) stating that a person who will buy the product in the deal will receive a specific personal number which is equal to said updated total number of buyers plus one; (d) presenting in the website a legal obligation to said person that if and when in the future an updated total number of buyers will be equal to the specific personal number of said person when doubled by pre-determined number, then said person will be entitled to receives a specific or total refund of the price or a specific sum of money; and (e) presenting in advanced said pre-determined number in the website, enabling said person to be aware of the numerical size of said pre-determined number before buying the product in the deal.","2.A method performed by a processing device running on a server, comprising: (a) enabling an entrepreneur to present on a website a deal for investing a certain amount of money in a specific enterprise with obligation for a specific return for each investment; (b) presenting continuously in real time on the web site an updated total number of investors who already have invested said certain amount of money in the deal; (c) stating that a person who will invest said certain amount of money in the deal will receive a specific personal number which is equal to said updated total number of investors plus one; (d) presenting in the website a legal obligation to said person that if and when in the future an updated total number of investors will be equal to the specific personal number of said person when doubled by pre-determined number, then said person will be entitled to receives a specific sum of money beyond said specific return for each investment; and (e) presenting in advanced said pre-determined number in the website, enabling said person to be aware of the numerical size of said pre-determined number before investing in the deal.","3.A method performed by a processing device running on a server, comprising: (a) enabling a seller to present on a website a deal for selling gambling tickets at a certain price; (b) presenting continuously in real time on the web site an updated total number of buyers who already have bought the gambling ticket in the deal; (c) stating that a person who will buy the gambling ticket in the deal will receive a specific personal number which is equal to said updated total number of buyers plus one; (d) presenting in the website a legal obligation to said person that if and when in the future an updated total number of buyers will be equal to the specific personal number of said person when doubled by pre-determined number, then said person will be entitled to receives a specific sum of money; and (e) presenting in advanced said pre-determined number in the website, enabling said person to be aware of the numerical size of said pre-determined number before buying the gambling ticket in the deal."],[" BACKGROUND ART There are many known methods for selling products and services that includes incentives to the public to buy those products or services.","For the sake of fluency the term “product” in this application and in the claims refers and includes also “services”.","For example, the “one plus one” method which means that the buyer may buy two products at the price of one; the “card method” when the buyers receives point per each purchase that may be used as a currency for buying products; a method of “shopping group” when the final price of the product depends on the final amount of buyers; and so on.","U.S. Pat.","No.","6,631,356 (hereinafter “Patent 356”) described a method for providing equal discount to all the buyers in a deal, with a promise that as much as the total number of the buyers in the deal will be greater, then the equal discount for each buyer will increase.","On the other hand, the method subject matter of the present invention has a different structure.","First, the buyer in the deal of Patent cannot receive a total refund, whereas the buyer in the deal of the present invention has the chance to receive a total refund.","Second, the total discount that the seller in the deal of Patent 356 may be relatively increase as much as more buyers join the deal, whereas the total discount that the seller in the deal of the present invention remains relatively the same regardless the amount of buyers who joined the deal.","The present patent application discloses a method for a deal in which a buyer has the chance to get full refund or even more."],["RELATED APPLICATIONS This application is a continuation in part of U.S. patent application Ser.","No.","15/345,848 filed on 8 Nov. 2016.TECHNICAL FIELD The present patent application refers to a method for a marketing deal in which a buyer has the chance to get full refund or even more if and when in the future the total number of buyers will be equal or greater that a pre-determined number that the specific number of that buyer.","This method provides a marketing tool to give customers great discount or even total refund without increasing the marketing cost of the seller.","BACKGROUND ART There are many known methods for selling products and services that includes incentives to the public to buy those products or services.","For the sake of fluency the term “product” in this application and in the claims refers and includes also “services”.","For example, the “one plus one” method which means that the buyer may buy two products at the price of one; the “card method” when the buyers receives point per each purchase that may be used as a currency for buying products; a method of “shopping group” when the final price of the product depends on the final amount of buyers; and so on.","U.S. Pat.","No.","6,631,356 (hereinafter “Patent 356”) described a method for providing equal discount to all the buyers in a deal, with a promise that as much as the total number of the buyers in the deal will be greater, then the equal discount for each buyer will increase.","On the other hand, the method subject matter of the present invention has a different structure.","First, the buyer in the deal of Patent cannot receive a total refund, whereas the buyer in the deal of the present invention has the chance to receive a total refund.","Second, the total discount that the seller in the deal of Patent 356 may be relatively increase as much as more buyers join the deal, whereas the total discount that the seller in the deal of the present invention remains relatively the same regardless the amount of buyers who joined the deal.","The present patent application discloses a method for a deal in which a buyer has the chance to get full refund or even more.","DESCRIPTION OF THE DRAWINGS The intention of the drawings attached to the application is not to limit the scope of the invention and its application.","The drawings are intended only to illustrate the invention and they constitute only one of its many possible implementations.","FIG.","1 illustrates an example of the method for purchasing a product.","FIG.","2 illustrates an example of the method for purchasing a gambling ticket.","FIG.","3 illustrates schematically the server (100), the website (200), the product (300), the price (400), the updated total number of buyers (500) and the pre-determined number (600).","FIG.","4 illustrates an example of the method for investments in crowd-funding.","THE INVENTION The main object of the present invention is to provide a method performed on a processing device running on a server that enables a seller with the possibility to provide earliest buyers with bigger discount or even full refund.","The method includes inter alia the followings: The business owner, who is the seller, creates a deal, which is presented on a web site.","The updated number of buyers in the deal are continuously counted and presented in real time in the website.","The deal promises, bigger discount if and when the updated number of buyers, will be x times bigger than the customer number, that he has got when he joined the deal as a buyer.","The number x may be any number that the seller choose and may be for example a number between the numbers 1 to 1,000,000, and when x is lower the deal is more attractive.","In other words, the method subject matter of the present inventions is in fact a method performed by a processing device running on a server, comprising the following steps: (a) The method enables a seller to present on a website a deal for selling products at a certain price.","(b) The method enables to present continuously in real time on the website the updated total number of buyers who already have bought the product in the deal.","(c) The seller states in the website that the person who will buy now the product in the deal will receive a specific personal number which is equal to the updated total number of buyers plus one.","(d) The seller presents in the website a legal obligation to that person that if and when in the future the updated total number of buyers will be equal to the specific personal number of that person when doubled by pre-determined number, then that person will be entitled to receives a specific or total refund of the price that he pay for the product or even a specific sum of money that may be higher than the price of the product.","(e) The seller presents in advanced the pre-determined number in the website, for enabling that person to be aware of the numerical size of that pre-determined number before buying the product in the deal.","The pre-determined number can be any number that the seller may choose.","For example, in case when the normal price of the product is $50 USD and normally the seller agrees to sell it at $40 USD, means in a discount of 20%, then the seller may choose the number 5 as the pre-determined number.","In this way the total theoretical discount of every 5 persons will be shifted to the first one of them.","Thus, creating the hope, that may be fulfilled by time being that that person will receive a total refund.","Indeed, that person is aware to the fact that if he will be a buyer number 2 to 5, in that example, he will actually pay the whole price, $50 USD, but he may take the chance that in the future he may be number one and then will receive a total refund, means, the whole or nothing concept.","That may increase the incentive in the public to buy the product in that deal.","For example: the seller may present on the website the slogan: “Buy product, cost $50 and get back $50, if the number of buyers in the deal will be 5 times larger than your specific personal number which will be equal to the updated total number of buyers plus one.","The method does not increase the total discount that the seller is willing to give.","When the seller agrees to give 10 dollars discount to each buyer, then in case of 5 buyers he agrees in fact to give a total discount of $50 UDS but under this method this total discount will be given to that buyer instead of share it between those five buyers.","The purpose of this method subject matter of the present patent application is to create a marketing tool to give to the buyers a possibility to get larger discount or even a refund without increasing the marketing cost.","The method to give bigger discount, of this invention is: a business owner creates a deal, on a website.","The updated total number of buyers in the deal is counted continuously and presented to the customers.","Each customer who bought the product in the deal receives a specific personal number which is equal to the updated total number of buyers plus one.","The deal promises a bigger discount if the total number of buyers in the future, will be x times bigger than the specific personal number.","When x is lower the deal is more attractive.","The deal may be limited in time or unlimited.","When the deal is limited by time then only part of the buyers may get the discount or refund, and when the deal is not limited by time then theoretically many buyers have a good chance to get that discount or refund, as long as more people continuous to buy the product in the deal.","FIG.","1 illustrates an example of the deal when the price of the product is $50 USD and the legal obligation of the seller is to give back that $50 USD to buyer number 1, means the first buyer, if and when the total number of buyers will be five.","FIG.","2 illustrates another example for selling a gambling ticket that cost $50 USD and the seller promise to give back the sum of $100 USD to each buyer if and when the updated total number of buyers in the future will be five times bigger that the specific personal number of that buyer.","In such case, even that the gambling ticket of the buyer does not win the gambling, he still has the chance to get a full refund plus a win of $50 UDS.","In such case, the seller gives back the sum of $100 USD only to one gambler from that group of five gamblers, means that the seller got $250 and gives back $100 and so he earns 150$ from each group of five gamblers.","Gambler number 1 will win 100 $ when will be 5 gamblers.","Gambler number 2 will win 100$ when will be 10 gamblers (2×5).","gambler number 3 will win 100$ when will be 15 gamblers in this deal (3×5) and so on .",".",".",".","FIG.","3 illustrates schematically the server (100), the website (200), the product (300), the price (400), the updated total number of buyers (500) and the pre-determined number (600).","The concept of the method subject matter of the present invention may be applied also on a crowd-funding, by enabling an entrepreneur to present on a website a deal for investing a certain amount of money in a specific enterprise with obligation for a specific return for each investment; to continuously presents in real time on the website an updated total number of investors who already have invested said certain amount of money in the deal; to states that a person who will invest that certain amount of money in the deal will receive a specific personal number which is equal to the updated total number of investors plus one; to presents in the website a legal obligation to that person that if and when in the future an updated total number of investors in the deal will be equal to the specific personal number of that person when doubled by pre-determined number, then that person will be entitled to receives a specific sum of money beyond the amount of return for each investment, and to present in advanced the pre-determined number in the website, enabling that person to be aware of the numerical size of the pre-determined number before investing in the deal.","FIG.","4 illustrates schematically an example that when the investment unit is $1,000 and the pre-determined number is 10, then for example an investor number 3 will receives full refund of $1,000 when the updated total number of investors is 30."]],"string":"[\n [\n \"Method for Selling Products with a Chance for Total Refund\",\n \"A method performed by a processing device running on a server that enables a seller to present on a website a deal for selling products at a certain price, to presents continuously in real time the updated total number of buyers, to states that a person who will buy the product will receive a specific personal number which is equal to the updated total number of buyers plus one, to presents in the website a legal obligation that if in the future the updated total number of buyers will be equal to the specific personal number of the person when doubled by pre-determined number, then the person will be entitled to receives a specific or total refund or a specific sum of money.\"\n ],\n [\n \"1.A method performed by a processing device running on a server, comprising: (a) enabling a seller to present on a website a deal for selling products at a certain price; (b) presenting continuously in real time on the website an updated total number of buyers who already have bought the product in the deal; (c) stating that a person who will buy the product in the deal will receive a specific personal number which is equal to said updated total number of buyers plus one; (d) presenting in the website a legal obligation to said person that if and when in the future an updated total number of buyers will be equal to the specific personal number of said person when doubled by pre-determined number, then said person will be entitled to receives a specific or total refund of the price or a specific sum of money; and (e) presenting in advanced said pre-determined number in the website, enabling said person to be aware of the numerical size of said pre-determined number before buying the product in the deal.\",\n \"2.A method performed by a processing device running on a server, comprising: (a) enabling an entrepreneur to present on a website a deal for investing a certain amount of money in a specific enterprise with obligation for a specific return for each investment; (b) presenting continuously in real time on the web site an updated total number of investors who already have invested said certain amount of money in the deal; (c) stating that a person who will invest said certain amount of money in the deal will receive a specific personal number which is equal to said updated total number of investors plus one; (d) presenting in the website a legal obligation to said person that if and when in the future an updated total number of investors will be equal to the specific personal number of said person when doubled by pre-determined number, then said person will be entitled to receives a specific sum of money beyond said specific return for each investment; and (e) presenting in advanced said pre-determined number in the website, enabling said person to be aware of the numerical size of said pre-determined number before investing in the deal.\",\n \"3.A method performed by a processing device running on a server, comprising: (a) enabling a seller to present on a website a deal for selling gambling tickets at a certain price; (b) presenting continuously in real time on the web site an updated total number of buyers who already have bought the gambling ticket in the deal; (c) stating that a person who will buy the gambling ticket in the deal will receive a specific personal number which is equal to said updated total number of buyers plus one; (d) presenting in the website a legal obligation to said person that if and when in the future an updated total number of buyers will be equal to the specific personal number of said person when doubled by pre-determined number, then said person will be entitled to receives a specific sum of money; and (e) presenting in advanced said pre-determined number in the website, enabling said person to be aware of the numerical size of said pre-determined number before buying the gambling ticket in the deal.\"\n ],\n [\n \" BACKGROUND ART There are many known methods for selling products and services that includes incentives to the public to buy those products or services.\",\n \"For the sake of fluency the term “product” in this application and in the claims refers and includes also “services”.\",\n \"For example, the “one plus one” method which means that the buyer may buy two products at the price of one; the “card method” when the buyers receives point per each purchase that may be used as a currency for buying products; a method of “shopping group” when the final price of the product depends on the final amount of buyers; and so on.\",\n \"U.S. Pat.\",\n \"No.\",\n \"6,631,356 (hereinafter “Patent 356”) described a method for providing equal discount to all the buyers in a deal, with a promise that as much as the total number of the buyers in the deal will be greater, then the equal discount for each buyer will increase.\",\n \"On the other hand, the method subject matter of the present invention has a different structure.\",\n \"First, the buyer in the deal of Patent cannot receive a total refund, whereas the buyer in the deal of the present invention has the chance to receive a total refund.\",\n \"Second, the total discount that the seller in the deal of Patent 356 may be relatively increase as much as more buyers join the deal, whereas the total discount that the seller in the deal of the present invention remains relatively the same regardless the amount of buyers who joined the deal.\",\n \"The present patent application discloses a method for a deal in which a buyer has the chance to get full refund or even more.\"\n ],\n [\n \"RELATED APPLICATIONS This application is a continuation in part of U.S. patent application Ser.\",\n \"No.\",\n \"15/345,848 filed on 8 Nov. 2016.TECHNICAL FIELD The present patent application refers to a method for a marketing deal in which a buyer has the chance to get full refund or even more if and when in the future the total number of buyers will be equal or greater that a pre-determined number that the specific number of that buyer.\",\n \"This method provides a marketing tool to give customers great discount or even total refund without increasing the marketing cost of the seller.\",\n \"BACKGROUND ART There are many known methods for selling products and services that includes incentives to the public to buy those products or services.\",\n \"For the sake of fluency the term “product” in this application and in the claims refers and includes also “services”.\",\n \"For example, the “one plus one” method which means that the buyer may buy two products at the price of one; the “card method” when the buyers receives point per each purchase that may be used as a currency for buying products; a method of “shopping group” when the final price of the product depends on the final amount of buyers; and so on.\",\n \"U.S. Pat.\",\n \"No.\",\n \"6,631,356 (hereinafter “Patent 356”) described a method for providing equal discount to all the buyers in a deal, with a promise that as much as the total number of the buyers in the deal will be greater, then the equal discount for each buyer will increase.\",\n \"On the other hand, the method subject matter of the present invention has a different structure.\",\n \"First, the buyer in the deal of Patent cannot receive a total refund, whereas the buyer in the deal of the present invention has the chance to receive a total refund.\",\n \"Second, the total discount that the seller in the deal of Patent 356 may be relatively increase as much as more buyers join the deal, whereas the total discount that the seller in the deal of the present invention remains relatively the same regardless the amount of buyers who joined the deal.\",\n \"The present patent application discloses a method for a deal in which a buyer has the chance to get full refund or even more.\",\n \"DESCRIPTION OF THE DRAWINGS The intention of the drawings attached to the application is not to limit the scope of the invention and its application.\",\n \"The drawings are intended only to illustrate the invention and they constitute only one of its many possible implementations.\",\n \"FIG.\",\n \"1 illustrates an example of the method for purchasing a product.\",\n \"FIG.\",\n \"2 illustrates an example of the method for purchasing a gambling ticket.\",\n \"FIG.\",\n \"3 illustrates schematically the server (100), the website (200), the product (300), the price (400), the updated total number of buyers (500) and the pre-determined number (600).\",\n \"FIG.\",\n \"4 illustrates an example of the method for investments in crowd-funding.\",\n \"THE INVENTION The main object of the present invention is to provide a method performed on a processing device running on a server that enables a seller with the possibility to provide earliest buyers with bigger discount or even full refund.\",\n \"The method includes inter alia the followings: The business owner, who is the seller, creates a deal, which is presented on a web site.\",\n \"The updated number of buyers in the deal are continuously counted and presented in real time in the website.\",\n \"The deal promises, bigger discount if and when the updated number of buyers, will be x times bigger than the customer number, that he has got when he joined the deal as a buyer.\",\n \"The number x may be any number that the seller choose and may be for example a number between the numbers 1 to 1,000,000, and when x is lower the deal is more attractive.\",\n \"In other words, the method subject matter of the present inventions is in fact a method performed by a processing device running on a server, comprising the following steps: (a) The method enables a seller to present on a website a deal for selling products at a certain price.\",\n \"(b) The method enables to present continuously in real time on the website the updated total number of buyers who already have bought the product in the deal.\",\n \"(c) The seller states in the website that the person who will buy now the product in the deal will receive a specific personal number which is equal to the updated total number of buyers plus one.\",\n \"(d) The seller presents in the website a legal obligation to that person that if and when in the future the updated total number of buyers will be equal to the specific personal number of that person when doubled by pre-determined number, then that person will be entitled to receives a specific or total refund of the price that he pay for the product or even a specific sum of money that may be higher than the price of the product.\",\n \"(e) The seller presents in advanced the pre-determined number in the website, for enabling that person to be aware of the numerical size of that pre-determined number before buying the product in the deal.\",\n \"The pre-determined number can be any number that the seller may choose.\",\n \"For example, in case when the normal price of the product is $50 USD and normally the seller agrees to sell it at $40 USD, means in a discount of 20%, then the seller may choose the number 5 as the pre-determined number.\",\n \"In this way the total theoretical discount of every 5 persons will be shifted to the first one of them.\",\n \"Thus, creating the hope, that may be fulfilled by time being that that person will receive a total refund.\",\n \"Indeed, that person is aware to the fact that if he will be a buyer number 2 to 5, in that example, he will actually pay the whole price, $50 USD, but he may take the chance that in the future he may be number one and then will receive a total refund, means, the whole or nothing concept.\",\n \"That may increase the incentive in the public to buy the product in that deal.\",\n \"For example: the seller may present on the website the slogan: “Buy product, cost $50 and get back $50, if the number of buyers in the deal will be 5 times larger than your specific personal number which will be equal to the updated total number of buyers plus one.\",\n \"The method does not increase the total discount that the seller is willing to give.\",\n \"When the seller agrees to give 10 dollars discount to each buyer, then in case of 5 buyers he agrees in fact to give a total discount of $50 UDS but under this method this total discount will be given to that buyer instead of share it between those five buyers.\",\n \"The purpose of this method subject matter of the present patent application is to create a marketing tool to give to the buyers a possibility to get larger discount or even a refund without increasing the marketing cost.\",\n \"The method to give bigger discount, of this invention is: a business owner creates a deal, on a website.\",\n \"The updated total number of buyers in the deal is counted continuously and presented to the customers.\",\n \"Each customer who bought the product in the deal receives a specific personal number which is equal to the updated total number of buyers plus one.\",\n \"The deal promises a bigger discount if the total number of buyers in the future, will be x times bigger than the specific personal number.\",\n \"When x is lower the deal is more attractive.\",\n \"The deal may be limited in time or unlimited.\",\n \"When the deal is limited by time then only part of the buyers may get the discount or refund, and when the deal is not limited by time then theoretically many buyers have a good chance to get that discount or refund, as long as more people continuous to buy the product in the deal.\",\n \"FIG.\",\n \"1 illustrates an example of the deal when the price of the product is $50 USD and the legal obligation of the seller is to give back that $50 USD to buyer number 1, means the first buyer, if and when the total number of buyers will be five.\",\n \"FIG.\",\n \"2 illustrates another example for selling a gambling ticket that cost $50 USD and the seller promise to give back the sum of $100 USD to each buyer if and when the updated total number of buyers in the future will be five times bigger that the specific personal number of that buyer.\",\n \"In such case, even that the gambling ticket of the buyer does not win the gambling, he still has the chance to get a full refund plus a win of $50 UDS.\",\n \"In such case, the seller gives back the sum of $100 USD only to one gambler from that group of five gamblers, means that the seller got $250 and gives back $100 and so he earns 150$ from each group of five gamblers.\",\n \"Gambler number 1 will win 100 $ when will be 5 gamblers.\",\n \"Gambler number 2 will win 100$ when will be 10 gamblers (2×5).\",\n \"gambler number 3 will win 100$ when will be 15 gamblers in this deal (3×5) and so on .\",\n \".\",\n \".\",\n \".\",\n \"FIG.\",\n \"3 illustrates schematically the server (100), the website (200), the product (300), the price (400), the updated total number of buyers (500) and the pre-determined number (600).\",\n \"The concept of the method subject matter of the present invention may be applied also on a crowd-funding, by enabling an entrepreneur to present on a website a deal for investing a certain amount of money in a specific enterprise with obligation for a specific return for each investment; to continuously presents in real time on the website an updated total number of investors who already have invested said certain amount of money in the deal; to states that a person who will invest that certain amount of money in the deal will receive a specific personal number which is equal to the updated total number of investors plus one; to presents in the website a legal obligation to that person that if and when in the future an updated total number of investors in the deal will be equal to the specific personal number of that person when doubled by pre-determined number, then that person will be entitled to receives a specific sum of money beyond the amount of return for each investment, and to present in advanced the pre-determined number in the website, enabling that person to be aware of the numerical size of the pre-determined number before investing in the deal.\",\n \"FIG.\",\n \"4 illustrates schematically an example that when the investment unit is $1,000 and the pre-determined number is 10, then for example an investor number 3 will receives full refund of $1,000 when the updated total number of investors is 30.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870954"}}},{"rowIdx":4493683,"cells":{"text":{"kind":"list like","value":[["PUSH-BUTTON STRUCTURE AND ELECTRONIC ATOMIZER HAVING SAME","The present disclosure provides a push-button structure.","The push-button structure includes a support, a push-button, and a slide block.","The push-button is connected to the support and has a push direction.","The slide block is connected to the support in a sliding manner along a direction perpendicular to the push direction of the push-button, and the slide block is capable for sliding and has a locking position and an unlocking position.","The push-button is provided with a first locking portion at one side facing the slide block.","The slide block is provided with a second locking portion fitting the first locking portion.","When the slide block slides to the locking position, the first locking portion is locked to the second locking portion.","When the slide block slides to the unlocking position, the first locking portion is unlocked from the second locking portion."],["1.A push-button structure, comprising: a support; a push-button, the push-button being connected to the support and having a push direction; and a slide block, the slide block being connected to the support in a sliding manner along a direction perpendicular to the push direction of the push-button, and the slide block being capable of sliding and having a locking position and an unlocking position; the push-button being provided with a first locking portion at one side facing the slide block; the slide block being provided with a second locking portion fitting the first locking portion; when the slide block is located at the locking position, the first locking portion being locked to the second locking portion; and when the slide block is located at the unlocking position, the first locking portion being unlocked from the second locking portion.","2.The push-button structure according to claim 1, wherein the slide block is arranged at one side the push-button in the push direction; the first locking portion comprises a first protrusion portion projecting in the direction towards the slide block, and the second locking portion comprises a second protrusion portion projecting in the direction towards the push-button; when the slide block is located at the locking portion, the first protrusion portion has an end surface abutted against an end surface of the second protrusion portion; and when the slide block is located at the unlocking position, the first protrusion portion is staggered from the second protrusion portion.","3.The push-button structure according to claim 2, wherein the slide block defines two locating grooves at one side far away from the second protrusion portion, and the two locating grooves are arranged spaced apart from each other along the slide direction of the slide block; the support is provided with an elastic locating protrusion fitting the locating groove, and the slide block is abutted against the elastic locating protrusion in a sliding manner; when the slide block is located at the locking position, the elastic locating protrusion is accommodated in one locating groove; when the slide block is located at the unlocking position, the elastic locating protrusion is accommodated in the other locating groove.","4.The push-button structure according to claim 3, wherein the push-button structure further comprises an elastic sheet fixed on the support, and the elastic sheet is provided with the elastic locating protrusion.","5.The push-button structure according to claim 3, wherein the support defines a recess, an elastic element is arranged in the recess, the elastic element has one end abutted against a bottom wall of the recess and the other end abutted against the elastic locating protrusion.","6.The push-button structure according to claim 5, wherein the elastic locating protrusion is a steel ball.","7.The push-button structure according to claim 2, wherein each of the first protrusion portion and the second protrusion portion is provided with an arc transitional surface configured for connecting one side surface thereof to the end surface thereof; when the slide block is located at the unlocking position, the arc transitional surface of the first protrusion portion and the arc transitional surface of the second protrusion portion are configured to be arranged facing each other.","8.The push-button structure according to claim 1, wherein the first locking portion defines an insert groove at one side thereof, and the second locking portion is provided with an insert element fitting the insert groove; when the slide block is located at the locking position, the insert element is inserted into the insert groove; when the slide block is located at the unlocking position, the insert element is disengaged from the insert groove.","9.The push-button structure according to claim 1, wherein the support further defines a mounting hole, the slide block is provided with a toggle portion, and the toggle portion is configured to extend out the mounting hole and slide in the mounting hole.","10.An electronic atomizer, comprising the push-button structure according to claim 1."],[" BACKGROUND In the field of electronic cigarettes, many factories design a big area on the electronic cigarette into a push-button for smoking for the convenience of use.","Thus, a push-button structure integrated into the electronic cigarette is formed.","Since the push-button is relatively big, the push-button is easy to be pressed by other contact objects to cause an improper operation, while providing convenience for users.","At present, solutions for this problem available on the market are realized by software.","The software sets a time interval.","If no user pushes the push-button within the set time interval, the software locks the vapor system automatically.","The software also sets a time interval between continuous pushing, and a number of times of pushing.","When the push-button is pushed continuously and when both the time interval and the number of times of pushing reach set values, the vapor system is unlocked automatically.","However, when the electronic cigarette is put in a pocket or bag, the push-button is easy to be pressed continuously by other contact objects to unlock automatically, thereby causing an improper operation."],[" SUMMARY The present disclosure mainly aims to provide a push-button structure, so that an electronic atomizer having the same push-button structure can effectively prevent the impacts caused by improper operation of the push-button by manual execution of simple locking and unlocking operations.","In order to achieve the above aim, the present disclosure provides a push-button structure.","The push-button structure includes a support, a push-button, and a slide block.","The push-button is configured to be connected to the support and have a push direction.","The slide block is configured to be connected to the support in a sliding manner along a direction perpendicular to the push direction of the push-button, and the slide block is capable for sliding and has a locking position and an unlocking position.","The push-button is provided with a first locking portion at one side facing the slide block.","The slide block is provided with a second locking portion fitting the first locking portion.","When the slide block is located at the locking position, the first locking portion is locked to the second locking portion; and when the slide block is located at the unlocking position, the first locking portion is unlocked from the second locking portion.","Preferably, the slide block is arranged at one side the push-button in the push direction.","The first locking portion includes a first protrusion portion projecting in the direction towards the slide block, and the second locking portion includes a second protrusion portion projecting in the direction towards the push-button.","When the slide block is located at the locking portion, the first protrusion portion has an end surface abutted against an end surface of the second protrusion portion; and when the slide block is located at the unlocking position, the first protrusion portion is staggered from the second protrusion portion.","Preferably, the slide block defines two locating grooves at one side far away from the second protrusion portion, and the two locating grooves are arranged spaced apart from each other along the slide direction of the slide block.","The support is provided with an elastic locating protrusion fitting the locating groove, and the slide block is abutted against the elastic locating protrusion in a sliding manner.","When the slide block is located at the locking position, the elastic locating protrusion is accommodated in one locating groove; when the slide block is located at the unlocking position, the elastic locating protrusion is accommodated in the other locating groove.","Preferably, the push-button structure further includes an elastic sheet fixed on the support, and the elastic sheet is provided with the elastic locating protrusion.","Preferably, the support defines a recess, an elastic element is arranged in the recess, the elastic element has one end abutted against a bottom wall of the recess and the other end abutted against the elastic locating protrusion.","Preferably, the elastic locating protrusion is a steel ball.","Preferably, each of the first protrusion portion and the second protrusion portion is provided with an arc transitional surface configured for connecting one side surface thereof to the end surface thereof; when the slide block is located at the unlocking position, the arc transitional surface of the first protrusion portion and the arc transitional surface of the second protrusion portion are configured to be arranged facing each other.","Preferably, the first locking portion defines an insert groove at one side thereof, and the second locking portion is provided with an insert element fitting the insert groove.","When the slide block is located at the locking position, the insert element is inserted into the insert groove; when the slide block is located at the unlocking position, the insert element is disengaged from the insert groove.","Preferably, the support further defines a mounting hole, the slide block is provided with a toggle portion, and the toggle portion is configured to extend out the mounting hole and slide in the mounting hole.","The present disclosure further provides an electronic atomizer.","The electronic atomizer includes the push-button structure above.","According to the technical scheme of the present disclosure, the slide block slides relative to the support and has the locking position and the unlocking position.","The slide block locks and unlocks the push-button when the slide block is located at the locking position and the unlocking position respectively, so that the push-button is in a locked state and an unlocked state.","In the unlocked state, the push-button can be used normally.","In the locked state, the first locking portion is locked to the second locking portion, which makes the push-button and the slide block fixed relative to each other.","Since the slide direction of the slide block is perpendicular to the push direction of the push-button, the slide block cannot move along the push direction of the push-button.","At such time, the push-button cannot move either, as a result, the push-button in such state is protected and the occurrence of improper operation is prevented.","According to the push-button structure, the push-button is capable of switching between the locked state and the unlocked state by toggling the slide block manually.","The mechanical operation is simple and reliable and can effectively prevent inconveniences caused by improper operation of the push-button."],["CROSS REFERENCE TO RELATED APPLICATIONS The present application claims priority to Chinese Patent Application CN 201621247628.2 filed on Nov. 18, 2016.TECHNICAL FIELD The present disclosure relates to the technical field of electronic atomizers, and particularly to a push-button structure and an electronic atomizer having the same push-button structure.","BACKGROUND In the field of electronic cigarettes, many factories design a big area on the electronic cigarette into a push-button for smoking for the convenience of use.","Thus, a push-button structure integrated into the electronic cigarette is formed.","Since the push-button is relatively big, the push-button is easy to be pressed by other contact objects to cause an improper operation, while providing convenience for users.","At present, solutions for this problem available on the market are realized by software.","The software sets a time interval.","If no user pushes the push-button within the set time interval, the software locks the vapor system automatically.","The software also sets a time interval between continuous pushing, and a number of times of pushing.","When the push-button is pushed continuously and when both the time interval and the number of times of pushing reach set values, the vapor system is unlocked automatically.","However, when the electronic cigarette is put in a pocket or bag, the push-button is easy to be pressed continuously by other contact objects to unlock automatically, thereby causing an improper operation.","SUMMARY The present disclosure mainly aims to provide a push-button structure, so that an electronic atomizer having the same push-button structure can effectively prevent the impacts caused by improper operation of the push-button by manual execution of simple locking and unlocking operations.","In order to achieve the above aim, the present disclosure provides a push-button structure.","The push-button structure includes a support, a push-button, and a slide block.","The push-button is configured to be connected to the support and have a push direction.","The slide block is configured to be connected to the support in a sliding manner along a direction perpendicular to the push direction of the push-button, and the slide block is capable for sliding and has a locking position and an unlocking position.","The push-button is provided with a first locking portion at one side facing the slide block.","The slide block is provided with a second locking portion fitting the first locking portion.","When the slide block is located at the locking position, the first locking portion is locked to the second locking portion; and when the slide block is located at the unlocking position, the first locking portion is unlocked from the second locking portion.","Preferably, the slide block is arranged at one side the push-button in the push direction.","The first locking portion includes a first protrusion portion projecting in the direction towards the slide block, and the second locking portion includes a second protrusion portion projecting in the direction towards the push-button.","When the slide block is located at the locking portion, the first protrusion portion has an end surface abutted against an end surface of the second protrusion portion; and when the slide block is located at the unlocking position, the first protrusion portion is staggered from the second protrusion portion.","Preferably, the slide block defines two locating grooves at one side far away from the second protrusion portion, and the two locating grooves are arranged spaced apart from each other along the slide direction of the slide block.","The support is provided with an elastic locating protrusion fitting the locating groove, and the slide block is abutted against the elastic locating protrusion in a sliding manner.","When the slide block is located at the locking position, the elastic locating protrusion is accommodated in one locating groove; when the slide block is located at the unlocking position, the elastic locating protrusion is accommodated in the other locating groove.","Preferably, the push-button structure further includes an elastic sheet fixed on the support, and the elastic sheet is provided with the elastic locating protrusion.","Preferably, the support defines a recess, an elastic element is arranged in the recess, the elastic element has one end abutted against a bottom wall of the recess and the other end abutted against the elastic locating protrusion.","Preferably, the elastic locating protrusion is a steel ball.","Preferably, each of the first protrusion portion and the second protrusion portion is provided with an arc transitional surface configured for connecting one side surface thereof to the end surface thereof; when the slide block is located at the unlocking position, the arc transitional surface of the first protrusion portion and the arc transitional surface of the second protrusion portion are configured to be arranged facing each other.","Preferably, the first locking portion defines an insert groove at one side thereof, and the second locking portion is provided with an insert element fitting the insert groove.","When the slide block is located at the locking position, the insert element is inserted into the insert groove; when the slide block is located at the unlocking position, the insert element is disengaged from the insert groove.","Preferably, the support further defines a mounting hole, the slide block is provided with a toggle portion, and the toggle portion is configured to extend out the mounting hole and slide in the mounting hole.","The present disclosure further provides an electronic atomizer.","The electronic atomizer includes the push-button structure above.","According to the technical scheme of the present disclosure, the slide block slides relative to the support and has the locking position and the unlocking position.","The slide block locks and unlocks the push-button when the slide block is located at the locking position and the unlocking position respectively, so that the push-button is in a locked state and an unlocked state.","In the unlocked state, the push-button can be used normally.","In the locked state, the first locking portion is locked to the second locking portion, which makes the push-button and the slide block fixed relative to each other.","Since the slide direction of the slide block is perpendicular to the push direction of the push-button, the slide block cannot move along the push direction of the push-button.","At such time, the push-button cannot move either, as a result, the push-button in such state is protected and the occurrence of improper operation is prevented.","According to the push-button structure, the push-button is capable of switching between the locked state and the unlocked state by toggling the slide block manually.","The mechanical operation is simple and reliable and can effectively prevent inconveniences caused by improper operation of the push-button.","BRIEF DESCRIPTION OF THE DRAWINGS For a better understanding of the embodiments of the present disclosure or the technical scheme in the prior art, accompanying drawings needed in the description of the embodiments or the prior art are simply illustrated below.","Obviously, the accompanying drawings described below are some embodiments of the present disclosure.","For the ordinary skill in the field, other accompanying drawings may be obtained according to the structure shown in these accompanying drawings without creative work.","FIG.","1 is a structure diagram of an embodiment of an electronic atomizer of the present disclosure.","FIG.","2 is an exploded view of a partial structure of the electronic atomizer shown in FIG.","1.FIG.","3 is a top view of a slide block shown in FIG.","1 located at an unlocking position.","FIG.","4 is a partial cross-sectional view of an electronic atomizer shown in FIG.","3.FIG.","5 is a top view of a slide block shown in FIG.","1 located at a locking position.","FIG.","6 is a partial cross-sectional view of an electronic atomizer shown in FIG.","5.Description of reference numbers Refer- Refer- ence ence number Part number Part 100 Push-button structure 313 Locating groove 10 Support 32 Toggle portion 11 Mounting hole 33 Locking position 20 Push-button 34 Unlocking position 21 First locking portion 40 Elastic sheet 211 First protrusion portion 41 Elastic locating protrusion 212 First abutment surface 50 Mouthpiece assembly 30 Slide block 51 Mouthpiece base 31 Second locking portion 52 Mouthpiece 311 Second protrusion portion 60 Main body 312 Second abutment surface 200 Electronic atomizer The implementation of aims, the function features and the advantages of the present disclosure are described below in further detail in conjunction with embodiments with reference to the drawings.","DETAILED DESCRIPTION A clear and complete description as below is provided for the technical scheme in the embodiments of the present disclosure in conjunction with the drawings in the embodiments of the present disclosure.","Obviously, the embodiments described hereinafter are simply part embodiments of the present disclosure, but all the embodiments.","All other embodiments obtained by the ordinary skill in the art based on the embodiments in the present disclosure without creative work are intended to be included in the scope of protection of the present disclosure.","It should be noted that all directional indications (such as top, bottom, left, right, front, behind .",".",". )","in the embodiments of the present disclosure are merely to illustrate a relative position relation, a relative motion condition, etc.","between each part in a certain state (for example, the state shown in the drawings).","If the state changes, the directional indication changes accordingly.","In the present disclosure, unless otherwise specifically stated and defined, terms “connected”, “fixed”, etc.","should be interpreted expansively.","For example, “fixed” may be fixed connection, also may be detachable connection, or integration; may be mechanical connection, also may be electrical connection; may be direct connection, also may be indirect connection through an intermediate, and may be internal communication between two elements or interaction of two elements, unless otherwise specifically defined.","The ordinary skill in this field can understand the specific implication of the above terms in the present disclosure according to specific conditions.","In addition, if terms “first”, “second”, etc.","appear in the present disclosure, they are merely for the purpose of description, but cannot be understood as the indication or implication of relative importance or as the implicit indication of the number of the designated technical features; therefore, features defined by “first” and “second” may specifically or implicitly include at least one such feature.","In addition, technical schemes of each embodiment of the present disclosure may be combined mutually; however, this must be carried out on the basis that the ordinary skill in this field can implement the combination.","When the combination of technical schemes has a conflict or cannot be implemented, it should be considered that such combination of technical schemes does not exist and is not in the scope of protection claimed by the present disclosure.","The present disclosure provides a push-button structure 100.Referring to FIG.","6, the push-button structure 100 includes a support 10, a push-button 20, and a slide block 30.The push-button 20 is configured to be connected to the support 10 and has a push direction.","The slide block 30 is configured to be connected to the support 10 in a sliding manner along a direction perpendicular to the push direction of the push-button 20, and the slide block 30 is capable for sliding and has a locking position 33 and an unlocking position 34 (referring to FIG.","3 and FIG.","5).","The push-button 20 is provided with a first locking portion 21 at one side facing the slide block 30.The slide block 30 is provided with a second locking portion 31 fitting the first locking portion 21.When the slide block 30 slides to the locking position 33, the first locking portion 21 is locked to the second locking portion 31, so that the push-button 20 is in a locked state; and when the slide block 30 slides to the unlocking position 34, the first locking portion 21 is unlocked from the second locking portion 31, so that the push-button 20 is in an unlocked state.","Referring to FIG.","4 and FIG.","6, according to the technical scheme of the present disclosure, the slide block 30 of the push-button structure 100 slides relative to the support 10 and has the locking position 33 and the unlocking position 34.The slide block 30 locks and unlocks the push-button 20 when the slide block is located at the locking position 33 and the unlocking position 34 respectively, so that the push-button 20 is in a locked state and an unlocked state.","In the unlocked state, the push-button 20 can be used normally.","In the locked state, the first locking portion 21 is locked to the second locking portion 31, which makes the push-button 20 and the slide block 30 fixed relative to each other.","Since the slide direction of the slide block 30 is perpendicular to the push direction of the push-button 20, the slide block 30 cannot move along the push direction of the push-button 20.At such time, the push-button 20 cannot move either, as a result, the push-button 20 in such state is protected and the occurrence of improper operation is prevented.","According to the push-button structure 100, the push-button 20 is capable of switching between the locked state and the unlocked state by toggling the slide block 30 manually.","The mechanical operation is simple and reliable and can effectively prevent inconveniences caused by improper operation of the push-button 20.In the present embodiment, the slide block 30 is arranged at one side the push-button 20 in the push direction.","The first locking portion 21 includes a first protrusion portion 211 projecting in the direction towards the slide block 30, and the second locking portion 31 includes a second protrusion portion 311 projecting in the direction towards the push-button 20.Referring to FIG.","5 and FIG.","6, when the slide block 30 slides to the locking portion 33, the first protrusion portion 211 has an end surface abutted against an end surface of the second protrusion portion 311.Referring to FIG.","3 and FIG.","4, when the slide block 30 slides to the unlocking position 34, the first protrusion portion 211 is staggered from the second protrusion portion 311.The first locking portion 21 further includes a first abutment surface 212 adjacent to the first protrusion portion 211.The second locking portion 31 further includes a second abutment surface 312 adjacent to the second protrusion portion 311.The first protrusion portion 211 is projected from the first abutment surface 212 in the direction towards the slide block 30.The second protrusion portion 311 is projected from the second abutment surface 312 in the direction towards the push-button 20.Referring to FIG.","4, when the slide block 30 slides to the unlocking position 34, the first protrusion portion 211 and the second abutment surface 312 are configured to be arranged facing each other and have a gap therebetween, and the second protrusion portion 311 and the first abutment surface 212 are configured to be arranged facing each other and have a gap therebetween.","The gap is capable of ensuring the normal push of the push-button 20.The structure that the first locking portion 21 and the second locking portion 31 are locked to each other is designed as a structure that the first protrusion portion 211 and the second protrusion portion 311 are abutted against each other.","The first protrusion portion 211 and the second protrusion portion 311 are simple in structure, have high structural strength and can achieve a good locking effect.","Preferably, in order to improve the comfort of sliding the slide block back and forth between the locking position and the unlocking position, each of the first protrusion portion and the second protrusion portion is provided with an arc transitional surface (not shown in the drawings) configured for connecting one side surface thereof to the end surface thereof.","When the slide block slides to the unlocking position, the arc transitional surface of the first protrusion portion and the arc transitional surface of the second protrusion portion are configured to be arranged facing each other.","When the slide block 30 slides to the unlocking position 34, the first protrusion portion 211 and the second protrusion portion 311 are staggered from each other.","Both the first protrusion portion and the second protrusion portion are provided with an arc transitional surface at opposing positions.","During the process that a user slides the slide block 30 from the unlocking position to the locking position, the arc transitional surface located on the first protrusion portion 211 contacts the arc transitional surface located on the second protrusion portion 311 first.","Under the action of the slide fitting of the two arc transitional surfaces, the end surface of the first protrusion portion 211 is easier to reach the end surface of the second protrusion portion 311, so that the use feel is better in the process of sliding the slide block 30 from the unlocking position to the locking position.","Likewise, during the process that a user slides the slide block 30 from the locking position to the unlocking position, the user feel is smoother under the action of the slide fitting of the two arc transitional surfaces.","The user experience is further improved.","The structure that the first locking portion and the second locking portion are locked to each other can also be designed as a structure in another embodiment (not shown in the drawings) of the present disclosure, besides the structure that the first protrusion portion 211 and the second protrusion portion 311 are abutted against each other.","The first locking portion defines an insert groove at one side thereof, and the second locking portion is provided with an insert element fitting the insert groove.","When the slide block slides to the locking position, the insert element is inserted into the insert groove; when the slide block slides to the unlocking position, the insert element is disengaged from the insert groove.","Such structure can also allow the slide block to lock and unlock the push-button respectively during the sliding process, and the push-button has a good locking effect in the locked state.","Referring to FIG.","6, in the present embodiment, the slide block 30 defines two locating grooves 313 at one side far away from the second protrusion portion 311, and the two locating grooves 313 are arranged spaced apart from each other along the slide direction of the slide block 30.Referring to FIG.","4, the support 10 is provided with an elastic locating protrusion 41 fitting the locating groove 313, and the slide block 30 is abutted against the elastic locating protrusion 41 in a sliding manner.","When the slide block 30 slides to the locking position 33, the elastic locating protrusion 41 is accommodated in one locating groove 313; when the slide block 30 slides to the unlocking position 34, the elastic locating protrusion 41 is accommodated in the other locating groove 313.If the structure that the slide block 30 slides relative to the support 10 and has the locking position 33 and the unlocking position 34 is designed as the structure that the elastic locating protrusion 41 fits the two locating grooves 313, a user can slide the slide block 30 between the locking position 33 and the unlocking position 34 with a slight force, to let the push-button 20 enter the locked state and the unlocked state.","When the slide block 30 is at the locking position 33 and the unlocking position 34, the elastic locating protrusion 41 is clamped in one locating groove 313, which achieves a use feel of clamping.","Thus, the user has a good use feel when operating the slide block 30, a fool-proof effect is achieved and the user experience is improved.","Referring to FIG.","4 and FIG.","6, the push-button structure 100 further includes an elastic sheet 40 fixed on the support 10, and the elastic sheet 40 is provided with the elastic locating protrusion 41.The elastic sheet 40 is stamped and formed by a precise hardware mould.","The elastic sheet 40 is arranged to allow the elastic locating protrusion 41 to be formed thereon, so that the forming mode of the elastic locating protrusion 41 is simple, the structure of the support 10 is simple and the cost of the push-button structure 100 is lowered.","The structure that the slide block slides relative to the support can also be designed as the following structure.","In another embodiment (not shown in the drawings) of the present disclosure, the support defines a recess, an elastic element is arranged in the recess, and the elastic element has one end abutted against a bottom wall of the recess and the other end abutted against the elastic locating protrusion.","The elastic element can select various common parts having elasticity.","In the present embodiment, the elastic element selects a spring preferably, and the elastic locating protrusion selects a steel ball preferably.","The elastic locating protrusion can also be a part having one end provided with a curve and the other end inserted into the spring.","The end provided with a curve is accommodated in the locating groove, to facilitate the sliding of the slide block.","The elastic locating protrusion in this structure can also allow the slide block to reach the locking position and the unlocking position effectively during the process of the slide block sliding relative to the support.","Referring to FIG.","2, in the present embodiment of the present disclosure, the support 10 further defines a mounting hole 11, the slide block 30 is provided with a toggle portion 32, and the toggle portion 32 is configured to extend out the mounting hole 11 and slide relative to the mounting hole 11.The toggle portion 32 extends out from the mounting hole 11, for a user to operate the slide block 30 conveniently.","The present disclosure further provides an electronic atomizer 200.The electronic atomizer 200 includes the push-button structure 100.The specific structure of the push-button structure 100 can be referred to the above embodiments.","Since the present electronic atomizer 200 employs all technical schemes of the above embodiments, the electronic atomizer at least has all the beneficial effects brought by the technical schemes of the above embodiments.","No further description is needed here.","Referring to FIG.","1 and FIG.","2, the electronic atomizer 200 includes a mouthpiece assembly 50, a support 10 and a main body 60.The main body 60 is configured to be mounted on the support 10.The mouthpiece assembly 50 includes a mouthpiece base 51 mounted on the main body 60 and a mouthpiece 52 connected to the mouthpiece base 51.The push-button 20 is mounted on one side of the support 10 and covers such side.","The push-button 20 has a big size relative to the electronic atomizer 200, so that a user can operate the push-button 20 conveniently.","Of course, the push-button 20 can also be designed into other forms, for example, common mechanical buttons.","The support 10 defines a mounting hole 11 at one side adjacent to the push-button 20.The toggle portion 32 of the slide block 30 is configured to extend out the mounting hole 11.In the present embodiment, the mounting hole 11 and the slide block 30 are located at, but are not limited to, one side of the mouthpiece 52.The slide block 30 can be arranged at any position at the peripheral of the push-button 20 to realize the technical effect of the present technical scheme.","Referring to FIG.","1, the push-button 20 is provided with a first locking portion 21 at one end adjacent to the slide block 30.The slide block 30 is provided with a second locking portion 31 at one side facing the push-button 20.The first locking portion 21 and the second locking portion 31 are both covered within the support 10.The slide block 30 is made of metal materials, so that a user has a good use feel when operating the slide block 30.The above are preferred embodiments of the present disclosure merely and are not intended to limit the patent scope of the present disclosure.","Any equivalent structures made according to the description and the accompanying drawings of the present disclosure without departing from the idea of the present disclosure, or any equivalent structures applied in other relevant technical fields directly or indirectly are intended to be included in the patent protection scope of the present disclosure."]],"string":"[\n [\n \"PUSH-BUTTON STRUCTURE AND ELECTRONIC ATOMIZER HAVING SAME\",\n \"The present disclosure provides a push-button structure.\",\n \"The push-button structure includes a support, a push-button, and a slide block.\",\n \"The push-button is connected to the support and has a push direction.\",\n \"The slide block is connected to the support in a sliding manner along a direction perpendicular to the push direction of the push-button, and the slide block is capable for sliding and has a locking position and an unlocking position.\",\n \"The push-button is provided with a first locking portion at one side facing the slide block.\",\n \"The slide block is provided with a second locking portion fitting the first locking portion.\",\n \"When the slide block slides to the locking position, the first locking portion is locked to the second locking portion.\",\n \"When the slide block slides to the unlocking position, the first locking portion is unlocked from the second locking portion.\"\n ],\n [\n \"1.A push-button structure, comprising: a support; a push-button, the push-button being connected to the support and having a push direction; and a slide block, the slide block being connected to the support in a sliding manner along a direction perpendicular to the push direction of the push-button, and the slide block being capable of sliding and having a locking position and an unlocking position; the push-button being provided with a first locking portion at one side facing the slide block; the slide block being provided with a second locking portion fitting the first locking portion; when the slide block is located at the locking position, the first locking portion being locked to the second locking portion; and when the slide block is located at the unlocking position, the first locking portion being unlocked from the second locking portion.\",\n \"2.The push-button structure according to claim 1, wherein the slide block is arranged at one side the push-button in the push direction; the first locking portion comprises a first protrusion portion projecting in the direction towards the slide block, and the second locking portion comprises a second protrusion portion projecting in the direction towards the push-button; when the slide block is located at the locking portion, the first protrusion portion has an end surface abutted against an end surface of the second protrusion portion; and when the slide block is located at the unlocking position, the first protrusion portion is staggered from the second protrusion portion.\",\n \"3.The push-button structure according to claim 2, wherein the slide block defines two locating grooves at one side far away from the second protrusion portion, and the two locating grooves are arranged spaced apart from each other along the slide direction of the slide block; the support is provided with an elastic locating protrusion fitting the locating groove, and the slide block is abutted against the elastic locating protrusion in a sliding manner; when the slide block is located at the locking position, the elastic locating protrusion is accommodated in one locating groove; when the slide block is located at the unlocking position, the elastic locating protrusion is accommodated in the other locating groove.\",\n \"4.The push-button structure according to claim 3, wherein the push-button structure further comprises an elastic sheet fixed on the support, and the elastic sheet is provided with the elastic locating protrusion.\",\n \"5.The push-button structure according to claim 3, wherein the support defines a recess, an elastic element is arranged in the recess, the elastic element has one end abutted against a bottom wall of the recess and the other end abutted against the elastic locating protrusion.\",\n \"6.The push-button structure according to claim 5, wherein the elastic locating protrusion is a steel ball.\",\n \"7.The push-button structure according to claim 2, wherein each of the first protrusion portion and the second protrusion portion is provided with an arc transitional surface configured for connecting one side surface thereof to the end surface thereof; when the slide block is located at the unlocking position, the arc transitional surface of the first protrusion portion and the arc transitional surface of the second protrusion portion are configured to be arranged facing each other.\",\n \"8.The push-button structure according to claim 1, wherein the first locking portion defines an insert groove at one side thereof, and the second locking portion is provided with an insert element fitting the insert groove; when the slide block is located at the locking position, the insert element is inserted into the insert groove; when the slide block is located at the unlocking position, the insert element is disengaged from the insert groove.\",\n \"9.The push-button structure according to claim 1, wherein the support further defines a mounting hole, the slide block is provided with a toggle portion, and the toggle portion is configured to extend out the mounting hole and slide in the mounting hole.\",\n \"10.An electronic atomizer, comprising the push-button structure according to claim 1.\"\n ],\n [\n \" BACKGROUND In the field of electronic cigarettes, many factories design a big area on the electronic cigarette into a push-button for smoking for the convenience of use.\",\n \"Thus, a push-button structure integrated into the electronic cigarette is formed.\",\n \"Since the push-button is relatively big, the push-button is easy to be pressed by other contact objects to cause an improper operation, while providing convenience for users.\",\n \"At present, solutions for this problem available on the market are realized by software.\",\n \"The software sets a time interval.\",\n \"If no user pushes the push-button within the set time interval, the software locks the vapor system automatically.\",\n \"The software also sets a time interval between continuous pushing, and a number of times of pushing.\",\n \"When the push-button is pushed continuously and when both the time interval and the number of times of pushing reach set values, the vapor system is unlocked automatically.\",\n \"However, when the electronic cigarette is put in a pocket or bag, the push-button is easy to be pressed continuously by other contact objects to unlock automatically, thereby causing an improper operation.\"\n ],\n [\n \" SUMMARY The present disclosure mainly aims to provide a push-button structure, so that an electronic atomizer having the same push-button structure can effectively prevent the impacts caused by improper operation of the push-button by manual execution of simple locking and unlocking operations.\",\n \"In order to achieve the above aim, the present disclosure provides a push-button structure.\",\n \"The push-button structure includes a support, a push-button, and a slide block.\",\n \"The push-button is configured to be connected to the support and have a push direction.\",\n \"The slide block is configured to be connected to the support in a sliding manner along a direction perpendicular to the push direction of the push-button, and the slide block is capable for sliding and has a locking position and an unlocking position.\",\n \"The push-button is provided with a first locking portion at one side facing the slide block.\",\n \"The slide block is provided with a second locking portion fitting the first locking portion.\",\n \"When the slide block is located at the locking position, the first locking portion is locked to the second locking portion; and when the slide block is located at the unlocking position, the first locking portion is unlocked from the second locking portion.\",\n \"Preferably, the slide block is arranged at one side the push-button in the push direction.\",\n \"The first locking portion includes a first protrusion portion projecting in the direction towards the slide block, and the second locking portion includes a second protrusion portion projecting in the direction towards the push-button.\",\n \"When the slide block is located at the locking portion, the first protrusion portion has an end surface abutted against an end surface of the second protrusion portion; and when the slide block is located at the unlocking position, the first protrusion portion is staggered from the second protrusion portion.\",\n \"Preferably, the slide block defines two locating grooves at one side far away from the second protrusion portion, and the two locating grooves are arranged spaced apart from each other along the slide direction of the slide block.\",\n \"The support is provided with an elastic locating protrusion fitting the locating groove, and the slide block is abutted against the elastic locating protrusion in a sliding manner.\",\n \"When the slide block is located at the locking position, the elastic locating protrusion is accommodated in one locating groove; when the slide block is located at the unlocking position, the elastic locating protrusion is accommodated in the other locating groove.\",\n \"Preferably, the push-button structure further includes an elastic sheet fixed on the support, and the elastic sheet is provided with the elastic locating protrusion.\",\n \"Preferably, the support defines a recess, an elastic element is arranged in the recess, the elastic element has one end abutted against a bottom wall of the recess and the other end abutted against the elastic locating protrusion.\",\n \"Preferably, the elastic locating protrusion is a steel ball.\",\n \"Preferably, each of the first protrusion portion and the second protrusion portion is provided with an arc transitional surface configured for connecting one side surface thereof to the end surface thereof; when the slide block is located at the unlocking position, the arc transitional surface of the first protrusion portion and the arc transitional surface of the second protrusion portion are configured to be arranged facing each other.\",\n \"Preferably, the first locking portion defines an insert groove at one side thereof, and the second locking portion is provided with an insert element fitting the insert groove.\",\n \"When the slide block is located at the locking position, the insert element is inserted into the insert groove; when the slide block is located at the unlocking position, the insert element is disengaged from the insert groove.\",\n \"Preferably, the support further defines a mounting hole, the slide block is provided with a toggle portion, and the toggle portion is configured to extend out the mounting hole and slide in the mounting hole.\",\n \"The present disclosure further provides an electronic atomizer.\",\n \"The electronic atomizer includes the push-button structure above.\",\n \"According to the technical scheme of the present disclosure, the slide block slides relative to the support and has the locking position and the unlocking position.\",\n \"The slide block locks and unlocks the push-button when the slide block is located at the locking position and the unlocking position respectively, so that the push-button is in a locked state and an unlocked state.\",\n \"In the unlocked state, the push-button can be used normally.\",\n \"In the locked state, the first locking portion is locked to the second locking portion, which makes the push-button and the slide block fixed relative to each other.\",\n \"Since the slide direction of the slide block is perpendicular to the push direction of the push-button, the slide block cannot move along the push direction of the push-button.\",\n \"At such time, the push-button cannot move either, as a result, the push-button in such state is protected and the occurrence of improper operation is prevented.\",\n \"According to the push-button structure, the push-button is capable of switching between the locked state and the unlocked state by toggling the slide block manually.\",\n \"The mechanical operation is simple and reliable and can effectively prevent inconveniences caused by improper operation of the push-button.\"\n ],\n [\n \"CROSS REFERENCE TO RELATED APPLICATIONS The present application claims priority to Chinese Patent Application CN 201621247628.2 filed on Nov. 18, 2016.TECHNICAL FIELD The present disclosure relates to the technical field of electronic atomizers, and particularly to a push-button structure and an electronic atomizer having the same push-button structure.\",\n \"BACKGROUND In the field of electronic cigarettes, many factories design a big area on the electronic cigarette into a push-button for smoking for the convenience of use.\",\n \"Thus, a push-button structure integrated into the electronic cigarette is formed.\",\n \"Since the push-button is relatively big, the push-button is easy to be pressed by other contact objects to cause an improper operation, while providing convenience for users.\",\n \"At present, solutions for this problem available on the market are realized by software.\",\n \"The software sets a time interval.\",\n \"If no user pushes the push-button within the set time interval, the software locks the vapor system automatically.\",\n \"The software also sets a time interval between continuous pushing, and a number of times of pushing.\",\n \"When the push-button is pushed continuously and when both the time interval and the number of times of pushing reach set values, the vapor system is unlocked automatically.\",\n \"However, when the electronic cigarette is put in a pocket or bag, the push-button is easy to be pressed continuously by other contact objects to unlock automatically, thereby causing an improper operation.\",\n \"SUMMARY The present disclosure mainly aims to provide a push-button structure, so that an electronic atomizer having the same push-button structure can effectively prevent the impacts caused by improper operation of the push-button by manual execution of simple locking and unlocking operations.\",\n \"In order to achieve the above aim, the present disclosure provides a push-button structure.\",\n \"The push-button structure includes a support, a push-button, and a slide block.\",\n \"The push-button is configured to be connected to the support and have a push direction.\",\n \"The slide block is configured to be connected to the support in a sliding manner along a direction perpendicular to the push direction of the push-button, and the slide block is capable for sliding and has a locking position and an unlocking position.\",\n \"The push-button is provided with a first locking portion at one side facing the slide block.\",\n \"The slide block is provided with a second locking portion fitting the first locking portion.\",\n \"When the slide block is located at the locking position, the first locking portion is locked to the second locking portion; and when the slide block is located at the unlocking position, the first locking portion is unlocked from the second locking portion.\",\n \"Preferably, the slide block is arranged at one side the push-button in the push direction.\",\n \"The first locking portion includes a first protrusion portion projecting in the direction towards the slide block, and the second locking portion includes a second protrusion portion projecting in the direction towards the push-button.\",\n \"When the slide block is located at the locking portion, the first protrusion portion has an end surface abutted against an end surface of the second protrusion portion; and when the slide block is located at the unlocking position, the first protrusion portion is staggered from the second protrusion portion.\",\n \"Preferably, the slide block defines two locating grooves at one side far away from the second protrusion portion, and the two locating grooves are arranged spaced apart from each other along the slide direction of the slide block.\",\n \"The support is provided with an elastic locating protrusion fitting the locating groove, and the slide block is abutted against the elastic locating protrusion in a sliding manner.\",\n \"When the slide block is located at the locking position, the elastic locating protrusion is accommodated in one locating groove; when the slide block is located at the unlocking position, the elastic locating protrusion is accommodated in the other locating groove.\",\n \"Preferably, the push-button structure further includes an elastic sheet fixed on the support, and the elastic sheet is provided with the elastic locating protrusion.\",\n \"Preferably, the support defines a recess, an elastic element is arranged in the recess, the elastic element has one end abutted against a bottom wall of the recess and the other end abutted against the elastic locating protrusion.\",\n \"Preferably, the elastic locating protrusion is a steel ball.\",\n \"Preferably, each of the first protrusion portion and the second protrusion portion is provided with an arc transitional surface configured for connecting one side surface thereof to the end surface thereof; when the slide block is located at the unlocking position, the arc transitional surface of the first protrusion portion and the arc transitional surface of the second protrusion portion are configured to be arranged facing each other.\",\n \"Preferably, the first locking portion defines an insert groove at one side thereof, and the second locking portion is provided with an insert element fitting the insert groove.\",\n \"When the slide block is located at the locking position, the insert element is inserted into the insert groove; when the slide block is located at the unlocking position, the insert element is disengaged from the insert groove.\",\n \"Preferably, the support further defines a mounting hole, the slide block is provided with a toggle portion, and the toggle portion is configured to extend out the mounting hole and slide in the mounting hole.\",\n \"The present disclosure further provides an electronic atomizer.\",\n \"The electronic atomizer includes the push-button structure above.\",\n \"According to the technical scheme of the present disclosure, the slide block slides relative to the support and has the locking position and the unlocking position.\",\n \"The slide block locks and unlocks the push-button when the slide block is located at the locking position and the unlocking position respectively, so that the push-button is in a locked state and an unlocked state.\",\n \"In the unlocked state, the push-button can be used normally.\",\n \"In the locked state, the first locking portion is locked to the second locking portion, which makes the push-button and the slide block fixed relative to each other.\",\n \"Since the slide direction of the slide block is perpendicular to the push direction of the push-button, the slide block cannot move along the push direction of the push-button.\",\n \"At such time, the push-button cannot move either, as a result, the push-button in such state is protected and the occurrence of improper operation is prevented.\",\n \"According to the push-button structure, the push-button is capable of switching between the locked state and the unlocked state by toggling the slide block manually.\",\n \"The mechanical operation is simple and reliable and can effectively prevent inconveniences caused by improper operation of the push-button.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS For a better understanding of the embodiments of the present disclosure or the technical scheme in the prior art, accompanying drawings needed in the description of the embodiments or the prior art are simply illustrated below.\",\n \"Obviously, the accompanying drawings described below are some embodiments of the present disclosure.\",\n \"For the ordinary skill in the field, other accompanying drawings may be obtained according to the structure shown in these accompanying drawings without creative work.\",\n \"FIG.\",\n \"1 is a structure diagram of an embodiment of an electronic atomizer of the present disclosure.\",\n \"FIG.\",\n \"2 is an exploded view of a partial structure of the electronic atomizer shown in FIG.\",\n \"1.FIG.\",\n \"3 is a top view of a slide block shown in FIG.\",\n \"1 located at an unlocking position.\",\n \"FIG.\",\n \"4 is a partial cross-sectional view of an electronic atomizer shown in FIG.\",\n \"3.FIG.\",\n \"5 is a top view of a slide block shown in FIG.\",\n \"1 located at a locking position.\",\n \"FIG.\",\n \"6 is a partial cross-sectional view of an electronic atomizer shown in FIG.\",\n \"5.Description of reference numbers Refer- Refer- ence ence number Part number Part 100 Push-button structure 313 Locating groove 10 Support 32 Toggle portion 11 Mounting hole 33 Locking position 20 Push-button 34 Unlocking position 21 First locking portion 40 Elastic sheet 211 First protrusion portion 41 Elastic locating protrusion 212 First abutment surface 50 Mouthpiece assembly 30 Slide block 51 Mouthpiece base 31 Second locking portion 52 Mouthpiece 311 Second protrusion portion 60 Main body 312 Second abutment surface 200 Electronic atomizer The implementation of aims, the function features and the advantages of the present disclosure are described below in further detail in conjunction with embodiments with reference to the drawings.\",\n \"DETAILED DESCRIPTION A clear and complete description as below is provided for the technical scheme in the embodiments of the present disclosure in conjunction with the drawings in the embodiments of the present disclosure.\",\n \"Obviously, the embodiments described hereinafter are simply part embodiments of the present disclosure, but all the embodiments.\",\n \"All other embodiments obtained by the ordinary skill in the art based on the embodiments in the present disclosure without creative work are intended to be included in the scope of protection of the present disclosure.\",\n \"It should be noted that all directional indications (such as top, bottom, left, right, front, behind .\",\n \".\",\n \". )\",\n \"in the embodiments of the present disclosure are merely to illustrate a relative position relation, a relative motion condition, etc.\",\n \"between each part in a certain state (for example, the state shown in the drawings).\",\n \"If the state changes, the directional indication changes accordingly.\",\n \"In the present disclosure, unless otherwise specifically stated and defined, terms “connected”, “fixed”, etc.\",\n \"should be interpreted expansively.\",\n \"For example, “fixed” may be fixed connection, also may be detachable connection, or integration; may be mechanical connection, also may be electrical connection; may be direct connection, also may be indirect connection through an intermediate, and may be internal communication between two elements or interaction of two elements, unless otherwise specifically defined.\",\n \"The ordinary skill in this field can understand the specific implication of the above terms in the present disclosure according to specific conditions.\",\n \"In addition, if terms “first”, “second”, etc.\",\n \"appear in the present disclosure, they are merely for the purpose of description, but cannot be understood as the indication or implication of relative importance or as the implicit indication of the number of the designated technical features; therefore, features defined by “first” and “second” may specifically or implicitly include at least one such feature.\",\n \"In addition, technical schemes of each embodiment of the present disclosure may be combined mutually; however, this must be carried out on the basis that the ordinary skill in this field can implement the combination.\",\n \"When the combination of technical schemes has a conflict or cannot be implemented, it should be considered that such combination of technical schemes does not exist and is not in the scope of protection claimed by the present disclosure.\",\n \"The present disclosure provides a push-button structure 100.Referring to FIG.\",\n \"6, the push-button structure 100 includes a support 10, a push-button 20, and a slide block 30.The push-button 20 is configured to be connected to the support 10 and has a push direction.\",\n \"The slide block 30 is configured to be connected to the support 10 in a sliding manner along a direction perpendicular to the push direction of the push-button 20, and the slide block 30 is capable for sliding and has a locking position 33 and an unlocking position 34 (referring to FIG.\",\n \"3 and FIG.\",\n \"5).\",\n \"The push-button 20 is provided with a first locking portion 21 at one side facing the slide block 30.The slide block 30 is provided with a second locking portion 31 fitting the first locking portion 21.When the slide block 30 slides to the locking position 33, the first locking portion 21 is locked to the second locking portion 31, so that the push-button 20 is in a locked state; and when the slide block 30 slides to the unlocking position 34, the first locking portion 21 is unlocked from the second locking portion 31, so that the push-button 20 is in an unlocked state.\",\n \"Referring to FIG.\",\n \"4 and FIG.\",\n \"6, according to the technical scheme of the present disclosure, the slide block 30 of the push-button structure 100 slides relative to the support 10 and has the locking position 33 and the unlocking position 34.The slide block 30 locks and unlocks the push-button 20 when the slide block is located at the locking position 33 and the unlocking position 34 respectively, so that the push-button 20 is in a locked state and an unlocked state.\",\n \"In the unlocked state, the push-button 20 can be used normally.\",\n \"In the locked state, the first locking portion 21 is locked to the second locking portion 31, which makes the push-button 20 and the slide block 30 fixed relative to each other.\",\n \"Since the slide direction of the slide block 30 is perpendicular to the push direction of the push-button 20, the slide block 30 cannot move along the push direction of the push-button 20.At such time, the push-button 20 cannot move either, as a result, the push-button 20 in such state is protected and the occurrence of improper operation is prevented.\",\n \"According to the push-button structure 100, the push-button 20 is capable of switching between the locked state and the unlocked state by toggling the slide block 30 manually.\",\n \"The mechanical operation is simple and reliable and can effectively prevent inconveniences caused by improper operation of the push-button 20.In the present embodiment, the slide block 30 is arranged at one side the push-button 20 in the push direction.\",\n \"The first locking portion 21 includes a first protrusion portion 211 projecting in the direction towards the slide block 30, and the second locking portion 31 includes a second protrusion portion 311 projecting in the direction towards the push-button 20.Referring to FIG.\",\n \"5 and FIG.\",\n \"6, when the slide block 30 slides to the locking portion 33, the first protrusion portion 211 has an end surface abutted against an end surface of the second protrusion portion 311.Referring to FIG.\",\n \"3 and FIG.\",\n \"4, when the slide block 30 slides to the unlocking position 34, the first protrusion portion 211 is staggered from the second protrusion portion 311.The first locking portion 21 further includes a first abutment surface 212 adjacent to the first protrusion portion 211.The second locking portion 31 further includes a second abutment surface 312 adjacent to the second protrusion portion 311.The first protrusion portion 211 is projected from the first abutment surface 212 in the direction towards the slide block 30.The second protrusion portion 311 is projected from the second abutment surface 312 in the direction towards the push-button 20.Referring to FIG.\",\n \"4, when the slide block 30 slides to the unlocking position 34, the first protrusion portion 211 and the second abutment surface 312 are configured to be arranged facing each other and have a gap therebetween, and the second protrusion portion 311 and the first abutment surface 212 are configured to be arranged facing each other and have a gap therebetween.\",\n \"The gap is capable of ensuring the normal push of the push-button 20.The structure that the first locking portion 21 and the second locking portion 31 are locked to each other is designed as a structure that the first protrusion portion 211 and the second protrusion portion 311 are abutted against each other.\",\n \"The first protrusion portion 211 and the second protrusion portion 311 are simple in structure, have high structural strength and can achieve a good locking effect.\",\n \"Preferably, in order to improve the comfort of sliding the slide block back and forth between the locking position and the unlocking position, each of the first protrusion portion and the second protrusion portion is provided with an arc transitional surface (not shown in the drawings) configured for connecting one side surface thereof to the end surface thereof.\",\n \"When the slide block slides to the unlocking position, the arc transitional surface of the first protrusion portion and the arc transitional surface of the second protrusion portion are configured to be arranged facing each other.\",\n \"When the slide block 30 slides to the unlocking position 34, the first protrusion portion 211 and the second protrusion portion 311 are staggered from each other.\",\n \"Both the first protrusion portion and the second protrusion portion are provided with an arc transitional surface at opposing positions.\",\n \"During the process that a user slides the slide block 30 from the unlocking position to the locking position, the arc transitional surface located on the first protrusion portion 211 contacts the arc transitional surface located on the second protrusion portion 311 first.\",\n \"Under the action of the slide fitting of the two arc transitional surfaces, the end surface of the first protrusion portion 211 is easier to reach the end surface of the second protrusion portion 311, so that the use feel is better in the process of sliding the slide block 30 from the unlocking position to the locking position.\",\n \"Likewise, during the process that a user slides the slide block 30 from the locking position to the unlocking position, the user feel is smoother under the action of the slide fitting of the two arc transitional surfaces.\",\n \"The user experience is further improved.\",\n \"The structure that the first locking portion and the second locking portion are locked to each other can also be designed as a structure in another embodiment (not shown in the drawings) of the present disclosure, besides the structure that the first protrusion portion 211 and the second protrusion portion 311 are abutted against each other.\",\n \"The first locking portion defines an insert groove at one side thereof, and the second locking portion is provided with an insert element fitting the insert groove.\",\n \"When the slide block slides to the locking position, the insert element is inserted into the insert groove; when the slide block slides to the unlocking position, the insert element is disengaged from the insert groove.\",\n \"Such structure can also allow the slide block to lock and unlock the push-button respectively during the sliding process, and the push-button has a good locking effect in the locked state.\",\n \"Referring to FIG.\",\n \"6, in the present embodiment, the slide block 30 defines two locating grooves 313 at one side far away from the second protrusion portion 311, and the two locating grooves 313 are arranged spaced apart from each other along the slide direction of the slide block 30.Referring to FIG.\",\n \"4, the support 10 is provided with an elastic locating protrusion 41 fitting the locating groove 313, and the slide block 30 is abutted against the elastic locating protrusion 41 in a sliding manner.\",\n \"When the slide block 30 slides to the locking position 33, the elastic locating protrusion 41 is accommodated in one locating groove 313; when the slide block 30 slides to the unlocking position 34, the elastic locating protrusion 41 is accommodated in the other locating groove 313.If the structure that the slide block 30 slides relative to the support 10 and has the locking position 33 and the unlocking position 34 is designed as the structure that the elastic locating protrusion 41 fits the two locating grooves 313, a user can slide the slide block 30 between the locking position 33 and the unlocking position 34 with a slight force, to let the push-button 20 enter the locked state and the unlocked state.\",\n \"When the slide block 30 is at the locking position 33 and the unlocking position 34, the elastic locating protrusion 41 is clamped in one locating groove 313, which achieves a use feel of clamping.\",\n \"Thus, the user has a good use feel when operating the slide block 30, a fool-proof effect is achieved and the user experience is improved.\",\n \"Referring to FIG.\",\n \"4 and FIG.\",\n \"6, the push-button structure 100 further includes an elastic sheet 40 fixed on the support 10, and the elastic sheet 40 is provided with the elastic locating protrusion 41.The elastic sheet 40 is stamped and formed by a precise hardware mould.\",\n \"The elastic sheet 40 is arranged to allow the elastic locating protrusion 41 to be formed thereon, so that the forming mode of the elastic locating protrusion 41 is simple, the structure of the support 10 is simple and the cost of the push-button structure 100 is lowered.\",\n \"The structure that the slide block slides relative to the support can also be designed as the following structure.\",\n \"In another embodiment (not shown in the drawings) of the present disclosure, the support defines a recess, an elastic element is arranged in the recess, and the elastic element has one end abutted against a bottom wall of the recess and the other end abutted against the elastic locating protrusion.\",\n \"The elastic element can select various common parts having elasticity.\",\n \"In the present embodiment, the elastic element selects a spring preferably, and the elastic locating protrusion selects a steel ball preferably.\",\n \"The elastic locating protrusion can also be a part having one end provided with a curve and the other end inserted into the spring.\",\n \"The end provided with a curve is accommodated in the locating groove, to facilitate the sliding of the slide block.\",\n \"The elastic locating protrusion in this structure can also allow the slide block to reach the locking position and the unlocking position effectively during the process of the slide block sliding relative to the support.\",\n \"Referring to FIG.\",\n \"2, in the present embodiment of the present disclosure, the support 10 further defines a mounting hole 11, the slide block 30 is provided with a toggle portion 32, and the toggle portion 32 is configured to extend out the mounting hole 11 and slide relative to the mounting hole 11.The toggle portion 32 extends out from the mounting hole 11, for a user to operate the slide block 30 conveniently.\",\n \"The present disclosure further provides an electronic atomizer 200.The electronic atomizer 200 includes the push-button structure 100.The specific structure of the push-button structure 100 can be referred to the above embodiments.\",\n \"Since the present electronic atomizer 200 employs all technical schemes of the above embodiments, the electronic atomizer at least has all the beneficial effects brought by the technical schemes of the above embodiments.\",\n \"No further description is needed here.\",\n \"Referring to FIG.\",\n \"1 and FIG.\",\n \"2, the electronic atomizer 200 includes a mouthpiece assembly 50, a support 10 and a main body 60.The main body 60 is configured to be mounted on the support 10.The mouthpiece assembly 50 includes a mouthpiece base 51 mounted on the main body 60 and a mouthpiece 52 connected to the mouthpiece base 51.The push-button 20 is mounted on one side of the support 10 and covers such side.\",\n \"The push-button 20 has a big size relative to the electronic atomizer 200, so that a user can operate the push-button 20 conveniently.\",\n \"Of course, the push-button 20 can also be designed into other forms, for example, common mechanical buttons.\",\n \"The support 10 defines a mounting hole 11 at one side adjacent to the push-button 20.The toggle portion 32 of the slide block 30 is configured to extend out the mounting hole 11.In the present embodiment, the mounting hole 11 and the slide block 30 are located at, but are not limited to, one side of the mouthpiece 52.The slide block 30 can be arranged at any position at the peripheral of the push-button 20 to realize the technical effect of the present technical scheme.\",\n \"Referring to FIG.\",\n \"1, the push-button 20 is provided with a first locking portion 21 at one end adjacent to the slide block 30.The slide block 30 is provided with a second locking portion 31 at one side facing the push-button 20.The first locking portion 21 and the second locking portion 31 are both covered within the support 10.The slide block 30 is made of metal materials, so that a user has a good use feel when operating the slide block 30.The above are preferred embodiments of the present disclosure merely and are not intended to limit the patent scope of the present disclosure.\",\n \"Any equivalent structures made according to the description and the accompanying drawings of the present disclosure without departing from the idea of the present disclosure, or any equivalent structures applied in other relevant technical fields directly or indirectly are intended to be included in the patent protection scope of the present disclosure.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870955"}}},{"rowIdx":4493684,"cells":{"text":{"kind":"list like","value":[["UNDERWATER STATION","An underwater station that may include a filter manipulator that is arranged to input, without human intervention, a filter into a pool cleaning robot that is located in a filter replacement position and to assist, without human intervention, in positioning the filter at a filtering position in which the filter is at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path."],["1.An underwater station, comprising: a filter manipulator that is arranged to input, without human intervention, a filter into a pool cleaning robot that is located in a filter replacement position and to assist, without human intervention, in positioning the filter at a filtering position in which the filter is at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.","2.The underwater station according to claim 1 wherein the filter manipulator is arranged to position, without human intervention, the filter at the filtering position.","3.The underwater station according to claim 1 wherein the filter manipulator is arranged to receive multiple filters and to feed, without human intervention, at least two filters in the robot.","4.The underwater station according to claim 1 wherein the filter manipulator comprises a filter storage module that is arranged to store multiple used filters after the used filters were outputted from the pool cleaning robot.","5.The underwater station according to claim 1 wherein the filter manipulator comprises a filter storage module that is arranged to store multiple filters before the multiple filters are inputted to the pool cleaning robot.","6.The underwater station according to claim 1 wherein the filter manipulator comprises a filter storage module that is arranged to store multiple used filters after the used filters were outputted from the pool cleaning robot and is arranged to store multiple filters before the multiple filters are inputted to the pool cleaning robot.","7.The underwater station according to claim 1 wherein the filter manipulator comprises a filter storage module that is arranged to store multiple filters and a movement mechanism.","8.The underwater station according to claim 7 wherein the movement mechanism is arranged to move, without human intervention, at least one of the filter storage module and the filter in order to input the filter into the pool cleaning robot.","9.The underwater station according to claim 7 wherein the movement mechanism is further arranged to assist, without human intervention, in moving the filter within the housing thereby placing another filter of the multiple filters at the filtering position.","10.The underwater station according to claim 1 wherein the filter manipulator is arranged to assist, without human intervention, in an outputting of the filter from the robot.","11.The underwater station according to claim 1 further comprising a processing module for processing, without human intervention, used filters that were outputted from the pool cleaning robot.","12.The underwater station according to claim 11 wherein the processing module is arranged to compress the used filters.","13.The underwater station according to claim 12 wherein the processing module is arranged to shred the used filters.","14.The underwater station according to claim 12 wherein the processing module is arranged to sanitize the used filters.","15.A method for autonomous underwater operation, the method comprises performing in an autonomous manner, without human intervention, by an underwater station, at least one operation out of pool cleaning robot filter replacement and cordless pool cleaning robot charging.","16.The method according to claim 15 comprising storing, at the filter storage module, multiple used filters after the used filters were outputted from the pool cleaning robot.","17.The method according to claim 15 further comprising processing, by a processing module of the underwater station and without human intervention, used filters that were outputted from the pool cleaning robot.","18.The method according to claim 17 wherein the processing comprises compressing, without human intervention, the used filters.","19.The method according to claim 17 wherein the processing comprises shredding, without human intervention, the used filters.","20.The method according to claim 17 wherein the processing comprises sanitizing, without human intervention, the used filters."],[" BACKGROUND OF THE INVENTION Pool cleaning robots are adapted for use for cleaning a pool while being connected to electrical power cables or to a hose of a suction system.","The hose and/or power cable can get tangled and may temporarily limit the usage of the pool.","Once a filter of a pool cleaning robot is clogged the pool cleaning robot is manually taken out of the pool and its filter can be washed by a user of the pool cleaning robot.","Taking a pool cleaning robot out of the pool is a time and effort consuming operation that is not very fond by the users.","In many cases the users delay these manual operations or even skip them causing the pool cleaning robot to operate in a sub-optimal manner.","There is a growing need to provide autonomous robots that require a lesser amount of human intervention in their maintenance."],[" SUMMARY OF THE INVENTION According to an embodiment of the invention there may be provided a pool cleaning robot that may include first and second fluid openings, with a fluid path between the first fluid opening and the second fluid opening; a turbine at least partially disposed within the fluid path so as to extract energy from flow of fluid through the fluid path; an electrical generator for providing electrical power thereto and adapted to be driven by the turbine; a rechargeable power source arranged to be charged by the electrical generator and to supply electrical power during at least one period of time during which the turbine does not extract energy from the flow of fluid; and a controller that may be arranged to direct the pool cleaning robot to be positioned in a certain location in which a flow level of fluid that may be circulated by a pool fluid circulation system may be higher than a flow level of the fluid within a majority of the pool, wherein when positioned at the certain location the fluid that may be circulated by the pool fluid circulation system passes through the fluid path.","The pool cleaning robot may include a sensor that may be arranged to sense a location of the pool cleaning robot within the pool.","The when positioned in the certain location the pool cleaning robot may be in proximity to a drain located at a bottom of the pool.","The controller may be arranged to position the pool cleaning robot in contact with an underwater station thereby reaching the certain location.","The pool cleaning robot may include a sensor that may be arranged to sense radiation emitted by the underwater station and thereby assist in directing the pool cleaning robot towards the underwater station.","The controller may be arranged to direct the pool cleaning robot to be positioned in the certain location, wherein in the certain location the flow level of fluid that may be circulated by the pool fluid circulation system may be a highest flow level in the pool.","According to an embodiment of the invention there may be provided a pool cleaning robot that may include a second fluid opening; a first fluid opening, with a fluid path between the first fluid opening and the second fluid opening; a turbine at least partially disposed within the fluid path so as to extract energy from flow of fluid through the fluid path; an electrical generator for providing electrical power thereto and adapted to be driven by the turbine; a rechargeable power source arranged to be charged by the electrical generator and to supply electrical power during at least one period of time during which the turbine does not extract energy from the flow of fluid; and a controller that may be arranged to direct the pool cleaning robot to be positioned in proximity to a drain of the pool, wherein when in proximity to the drain of the pool the fluid that may be sucked by the drain passes through the fluid path.","The pool cleaning robot further may include a sensor for sensing information about a vicinity of the pool cleaning robot.","The pool cleaning robot may include an acoustic sensor that may be arranged to provide sonic intensity information about the noise variations in the pool, when the pool cleaning robot moves along the bottom of the pool, and wherein the controller may be arranged to direct the pool cleaning robot towards the drain in response to the sonic information.","The pool cleaning robot may include a gyrocompass that may be arranged to provide directional information, and wherein the controller may be arranged to direct the pool cleaning robot towards the drain in response to the directional information.","According to an embodiment of the invention there may be provided an underwater station that for charging a pool cleaning robot, may include an electrical power supply module for converting to electrical energy a flow of fluid that may be induced by a pool fluid circulation system; and a first contactless charging element that may be arranged to (a) be fed by the electrical supply module and (b) generate an electromagnetic field during at least one period during which a second contactless charging element of the pool cleaning robot may be within a charging range from the first contactless charging element, and wherein the electromagnetic field charges the second contactless charging element.","The electrical power supply module may include (a) a turbine at least partially disposed within a fluid path in which the flow of fluid passes so as to extract energy from the flow of fluid and (b) an electrical generator for providing power thereto and adapted to be driven by the turbine.","The turbine, the electrical generator and the first contactless charging element may be included within an underwater station.","The turbine and the electrical generator may not be not included in an underwater station and wherein the first contactless charging element may be included in the underwater station.","The at least one of the turbine, electrical generator and the first contactless charging element may be a part of an underwater station.","The first contactless charging element may be an induction coil.","According to an embodiment of the invention there may be provided a pool cleaning robot that may include a housing that may have a first fluid opening and a second fluid opening; a filter; a rotor coupled to the filter and positioned within an enclosure; a motor-generator module coupled to the rotor; wherein when operating in a first operational mode the motor-generator may be arranged to rotate the rotor and the filter core; wherein when operating in a second operational mode the rotor-generator may be arranged to be rotated by the rotor and to generate electrical power.","The rotor may be positioned between the motor-generator and the filter.","The filter may be positioned between the rotor and the motor-generator.","The pool cleaning robot may include an opening sealed by a uni-directional valve that allows fluid from the rotor to exit the enclosure.","The filter may include a filter core that may be at least partially located within the housing and may include an one or more inlets, an one or more outlets and at least one filtering element positioned between the one or more inlets and the an one or more outlets.","The rotor may be spaced apart from the motor-generator and the filter.","The pool cleaning robot may include a turbine, an electrical generator and a controller that may be arranged to direct the pool cleaning robot to be positioned in a certain location in which a flow level of fluid that may be circulated by a pool fluid circulation system may be higher than a flow level of the fluid within a majority of the pool, wherein when positioned at the certain location the fluid that may be circulated by the pool fluid circulation system passes through a fluid path in which the turbine may be a least partially positioned thereby rotating the turbine.","When positioned in the certain location the pool cleaning robot may be in proximity to a drain located at a bottom of the pool.","The controller may be arranged to position the pool cleaning robot in contact with an underwater station thereby reaching the certain location.","The controller may be arranged to direct the pool cleaning robot to be positioned in the certain location, wherein in the certain location the flow level of fluid that may be circulated by the pool fluid circulation system may be a highest flow level in the pool.","According to an embodiment of the invention there may be provided an underwater station that, may include a first contactless charging element that may be arranged to (a) be fed by the electrical supply module and (b) generate an electromagnetic field during at least one period during which a second contactless charging element of a pool cleaning robot may be within a charging range from the first contactless charging element, and wherein the electromagnetic field charges the second contactless charging element; and an interface for contacting the pool cleaning robot during a charging of the pool cleaning robot by the first contactless charging element.","The underwater station may include multiple spaced apart radiation sources for emitting electromagnetic radiation.","The interface may be a platform on which the pool cleaning robot may be mounted during the charging.","The platform may include a flat surface and a rail leading to the flat surface.","The underwater station may include a sanitizer for sanitizing used filters.","The underwater station may include a floating unit for attaching floating material to used filters.","According to an embodiment of the invention there may be provided a pool cleaning robot may include a housing; and a filter manipulator that may be at least partially located within the housing and may be arranged to (a) receive a filter and (b) introduce a movement between the filter and the housing thereby positioning the filter within a filtering position in which the filter may be at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.","The filter manipulator may be arranged to receive the filter and at least one additional filter and to position the filter at the filtering position.","The filter manipulator may include a filter storage module that may include multiple compartments for receiving multiple filters including the filter.","The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the storage module.","The movement mechanism may be arranged to move the filter storage module thereby placing another filter of the multiple filters in the filtering position.","The filter storage module may have a radial symmetry.","The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the filter without moving the storage module.","The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the filter and by moving the storage module.","The filter manipulator may be completely within the housing.","The filter manipulator may be arranged to dispose the filter from the pool cleaning robot.","The housing may include a first filter opening for receiving the filter; and wherein the filter manipulator that may be arranged to receive the filter supplied through the first filter opening.","The filter manipulator may be arranged to dispose the filter from the robot through the first filter opening.","The filter manipulator may be arranged to dispose the filter from the robot through a second filter opening that differs from the first filter opening.","The filter manipulator may include rails for conveying the filter within the housing.","The pool cleaning robot may include a detector that may be arranged to sense a cleanliness level of the filter and a controller that may be arranged to determine whether to replace the filter in response to the cleanliness level of the filter.","The filter may be a first filter; wherein the filter manipulator may be arranged to receive the first filter and a second filter and to position the second filter in a non-filtering position.","The pool cleaning robot may include a processing module that may be arranged to process the filter after the filter may be replaced by another filter thereby becoming a used filter.","The pool cleaning robot may include wherein the processing module may be arranged to compress the used filter.","The processing module may be arranged to shred the used filter.","The processing module may be arranged to sanitize the used filter.","According to an embodiment of the invention there may be provided a pool cleaning robot may include a housing; and a filter storage module that may be at least partially located within the housing and may be arranged to (a) receive multiple filters and (b) hold the multiple filters so that at least one of the multiple filters may be positioned in a filtering position in which the filter may be at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.","The housing may include a first filter opening for receiving the multiple filters.","The first filter opening may be located at a bottom of the housing.","The first filter opening may be located at a sidewall of the housing.","The housing may include at least one second filter opening for outputting the multiple filters from the housing.","The housing may include a first filter opening for receiving the multiple filters and a second filter opening for outputting the multiple filters from the housing, wherein the first filter opening faces the second filter opening.","The filter storage module may be arranged to hold the multiple filters so that at least one other filter of the multiple filters may be positioned at a non-filtering position.","According to an embodiment of the invention there may be provided an underwater station that, may include a filter manipulator that may be arranged to input a filter into a pool cleaning robot that may be located in a filter replacement position and to assist in positioning the filter at a filtering position in which the filter may be at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.","The filter manipulator may be arranged to position the filter at the filtering position.","The filter manipulator may be arranged to receive multiple filters and to feed at least two filters in the robot.","The filter manipulator may include a filter storage module that may be arranged to store multiple used filters after the used filters were outputted from the pool cleaning robot.","The filter manipulator may include a filter storage module that may be arranged to store multiple filters before the multiple filters may be inputted to the pool cleaning robot.","The filter manipulator may include a filter storage module that may be arranged to store multiple used filters after the used filters were outputted from the pool cleaning robot and may be arranged to store multiple filters before the multiple filters may be inputted to the pool cleaning robot.","The filter manipulator may include a filter storage module that may be arranged to store multiple filters and a movement mechanism.","The movement mechanism may be arranged to move at least one of the filter storage module and the filter in order to input the filter into the pool cleaning robot.","The movement mechanism may be arranged to assist in moving the filter within the housing thereby placing another filter of the multiple filters at the filtering position.","The filter storage module may have a radial symmetry.","The movement mechanism may include (a) a rotation unit that may be arranged to rotate the filter storage module thereby positioning the filter in front of a filter opening formed in the pool cleaning robot, and (b) an insertion and ejection module that may be arranged to cause the filter to pass through the filter opening.","The filter opening may be formed at the bottom of the pool cleaning robot and wherein the insertion and ejection module may be arranged to lift the filter through the filter opening.","The movement mechanism may be arranged to input the filter in the pool cleaning robot by moving the filter without moving the storage module.","The filter manipulator may be arranged to assist in an outputting of the filter from the robot.","The underwater station may include a processing module for processing used filters that were outputted from the pool cleaning robot.","The processing module may be arranged to compress the used filters.","The processing module may be arranged to shred the used filters.","The processing module may be arranged to sanitize the used filters.","According to an embodiment of the invention there may be provided a pool cleaning robot that may include a housing that may have a first fluid opening and a second fluid opening; a filter that may include a filter core that may be at least partially located within the housing and may include an one or more inlets, an one or more outlets and at least one filtering element positioned between the one or more inlets and the an one or more outlets ; and a filter core rotator that may be arranged to rotate the filter core during at least one period in which the filter core filters fluid that enters through the one or more inlets to output filtered fluid via the one or more outlets .","The filter core may be radially symmetrical and wherein the one or more inlets may be positioned at a center of the filter core.","The filter core rotator may be arranged to rotate the filter core about the center of the filter core.","The filter core rotator may be arranged to rotate a perforated pole that may be positioned at the center of the filter core and thereby cause the filter core to rotate.","The perforated pole may include choppers.","The pool cleaning robot may include a filter core enclosure that may include at least one opening to allow filtered fluid to pass through, wherein the filter core enclosure surrounds the filter core.","The filter core and the filter core enclosure may be radially symmetrical.","The filter core may be radially symmetrical and wherein the filter core enclosure may be not radially symmetrical.","The housing may include a filter opening for receiving the filter core; and once positioned in the pool cleaning robot the filter core enclosure closes the filter opening.","The at least one filtering element may be oriented in relation to the one or more inlets.","The at least one filtering element may be multiple filtering elements that may include disk shaped filtering elements that may be oriented in relation to each other.","The at least one filtering elements may include disk shaped filtering elements, wherein even filtering elements may be parallel to each other, odd filtering elements may be parallel to each other and oriented in relation to the even filtering elements.","The pool cleaning robot may include a filter housing that may be arranged to receive the filter core and the filter core enclosure.","The filter housing may be connected to at least one out of (a) the filter core rotator and (b) a gear coupled to the filter core rotator.","The at least one of the filter core rotator and the gear may be arranged to contact the filter core enclosure when the filter core enclosure may be located within the filter housing.","The filter housing may include a filter opening for receiving the filter.\\ The filter housing may be arranged to close the filter opening once located within the pool cleaning robot.","The filter housing may be arranged to close the filter opening once located in a non-filtering position within the pool cleaning robot.","The pool cleaning robot may include a filter manipulator that may be at least partially located within the housing and may be arranged to (a) receive the filter and (b) introduce a movement between the filter and the housing thereby positioning the filter within a filtering position in which the filter core filters fluid that enters through the one or more inlets to output filtered fluid via the one or more outlets.","The filter manipulator may include a filter storage module that may include multiple compartments for receiving multiple filters including the filter.","The filter manipulator may include a movement mechanism that may be arranged to introduce a movement between the filter and the housing by moving the filter storage module.","The movement mechanism may be arranged to move the filter storage module thereby placing another filter of the multiple filters in the filtering position.","The filter storage module may have a radial symmetry.","The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the filter without moving the storage module.","The filter manipulator may be arranged to dispose the filter from the robot.","The housing may include a first filter opening for receiving the filter; and wherein the filter manipulator may be arranged to receive the filter supplied through the first filter opening.","The pool cleaning robot may include a processing module that may be arranged to process the filter after the filter may be replaced by another filter thereby becoming a used filter.","The filter core may include choppers.","The at least one filter element may include a fine filter and a gross filter.","The filter core rotator may include a rotor.","The rotor may be arranged to rotate the filter core, wherein the rotor may be rotated by a flow of fluid induced by a pool fluid circulation system.","The rotor may be arranged to rotate a motor-generator module.","The pool cleaning robot may include a motor-generator module that may be arranged to rotate the rotor and the filter core when operating in a first operational mode.","The pool cleaning robot may include an opening sealed by a uni-directional valve that allows fluid form the rotor to exit the pool cleaning robot.","The rotor may be positioned above the filter core.","The rotor may be positioned below the filter core.","According to an embodiment of the invention there may be provided a method for autonomous underwater operation, the method may include performing in an autonomous manner, by at least one of a pool cleaning robot and an underwater station, at least one operation out of pool cleaning robot filter replacement and cordless pool cleaning robot charging.","According to an embodiment of the invention there may be provided a method for filtering fluid by a filter of a pool cleaning robot, the method may include filtering fluid by a filter of a pool cleaning robot, wherein the filter fulfils at least one of the following (i) it may have a filter core that may be rotated by a filter core rotator when the filter applied a filtering operation, (ii) may be positioned in a filtering position while at least one other filter of the pool cleaning robot may be positioned within the pool cleaning robot in a non-filtering position, (iii) may be positioned in a filtering position when the pool cleaning robot and by a filter manipulator."],["RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser.","No.","14/433,859 filing date Apr.","7, 2015 which is a national phase application of PCT patent application serial number PCT/IL2013/051055 international filing date Dec. 22, 2013 which claims priority from U.S. provisional patent Ser.","No.","61/745,556 filing date Dec. 22, 2012, all being incorporated herein by reference.","FIELD OF THE INVENTION This invention relates to pool cleaning robots, and particularly to autonomous pool cleaning robots.","BACKGROUND OF THE INVENTION Pool cleaning robots are adapted for use for cleaning a pool while being connected to electrical power cables or to a hose of a suction system.","The hose and/or power cable can get tangled and may temporarily limit the usage of the pool.","Once a filter of a pool cleaning robot is clogged the pool cleaning robot is manually taken out of the pool and its filter can be washed by a user of the pool cleaning robot.","Taking a pool cleaning robot out of the pool is a time and effort consuming operation that is not very fond by the users.","In many cases the users delay these manual operations or even skip them causing the pool cleaning robot to operate in a sub-optimal manner.","There is a growing need to provide autonomous robots that require a lesser amount of human intervention in their maintenance.","SUMMARY OF THE INVENTION According to an embodiment of the invention there may be provided a pool cleaning robot that may include first and second fluid openings, with a fluid path between the first fluid opening and the second fluid opening; a turbine at least partially disposed within the fluid path so as to extract energy from flow of fluid through the fluid path; an electrical generator for providing electrical power thereto and adapted to be driven by the turbine; a rechargeable power source arranged to be charged by the electrical generator and to supply electrical power during at least one period of time during which the turbine does not extract energy from the flow of fluid; and a controller that may be arranged to direct the pool cleaning robot to be positioned in a certain location in which a flow level of fluid that may be circulated by a pool fluid circulation system may be higher than a flow level of the fluid within a majority of the pool, wherein when positioned at the certain location the fluid that may be circulated by the pool fluid circulation system passes through the fluid path.","The pool cleaning robot may include a sensor that may be arranged to sense a location of the pool cleaning robot within the pool.","The when positioned in the certain location the pool cleaning robot may be in proximity to a drain located at a bottom of the pool.","The controller may be arranged to position the pool cleaning robot in contact with an underwater station thereby reaching the certain location.","The pool cleaning robot may include a sensor that may be arranged to sense radiation emitted by the underwater station and thereby assist in directing the pool cleaning robot towards the underwater station.","The controller may be arranged to direct the pool cleaning robot to be positioned in the certain location, wherein in the certain location the flow level of fluid that may be circulated by the pool fluid circulation system may be a highest flow level in the pool.","According to an embodiment of the invention there may be provided a pool cleaning robot that may include a second fluid opening; a first fluid opening, with a fluid path between the first fluid opening and the second fluid opening; a turbine at least partially disposed within the fluid path so as to extract energy from flow of fluid through the fluid path; an electrical generator for providing electrical power thereto and adapted to be driven by the turbine; a rechargeable power source arranged to be charged by the electrical generator and to supply electrical power during at least one period of time during which the turbine does not extract energy from the flow of fluid; and a controller that may be arranged to direct the pool cleaning robot to be positioned in proximity to a drain of the pool, wherein when in proximity to the drain of the pool the fluid that may be sucked by the drain passes through the fluid path.","The pool cleaning robot further may include a sensor for sensing information about a vicinity of the pool cleaning robot.","The pool cleaning robot may include an acoustic sensor that may be arranged to provide sonic intensity information about the noise variations in the pool, when the pool cleaning robot moves along the bottom of the pool, and wherein the controller may be arranged to direct the pool cleaning robot towards the drain in response to the sonic information.","The pool cleaning robot may include a gyrocompass that may be arranged to provide directional information, and wherein the controller may be arranged to direct the pool cleaning robot towards the drain in response to the directional information.","According to an embodiment of the invention there may be provided an underwater station that for charging a pool cleaning robot, may include an electrical power supply module for converting to electrical energy a flow of fluid that may be induced by a pool fluid circulation system; and a first contactless charging element that may be arranged to (a) be fed by the electrical supply module and (b) generate an electromagnetic field during at least one period during which a second contactless charging element of the pool cleaning robot may be within a charging range from the first contactless charging element, and wherein the electromagnetic field charges the second contactless charging element.","The electrical power supply module may include (a) a turbine at least partially disposed within a fluid path in which the flow of fluid passes so as to extract energy from the flow of fluid and (b) an electrical generator for providing power thereto and adapted to be driven by the turbine.","The turbine, the electrical generator and the first contactless charging element may be included within an underwater station.","The turbine and the electrical generator may not be not included in an underwater station and wherein the first contactless charging element may be included in the underwater station.","The at least one of the turbine, electrical generator and the first contactless charging element may be a part of an underwater station.","The first contactless charging element may be an induction coil.","According to an embodiment of the invention there may be provided a pool cleaning robot that may include a housing that may have a first fluid opening and a second fluid opening; a filter; a rotor coupled to the filter and positioned within an enclosure; a motor-generator module coupled to the rotor; wherein when operating in a first operational mode the motor-generator may be arranged to rotate the rotor and the filter core; wherein when operating in a second operational mode the rotor-generator may be arranged to be rotated by the rotor and to generate electrical power.","The rotor may be positioned between the motor-generator and the filter.","The filter may be positioned between the rotor and the motor-generator.","The pool cleaning robot may include an opening sealed by a uni-directional valve that allows fluid from the rotor to exit the enclosure.","The filter may include a filter core that may be at least partially located within the housing and may include an one or more inlets, an one or more outlets and at least one filtering element positioned between the one or more inlets and the an one or more outlets.","The rotor may be spaced apart from the motor-generator and the filter.","The pool cleaning robot may include a turbine, an electrical generator and a controller that may be arranged to direct the pool cleaning robot to be positioned in a certain location in which a flow level of fluid that may be circulated by a pool fluid circulation system may be higher than a flow level of the fluid within a majority of the pool, wherein when positioned at the certain location the fluid that may be circulated by the pool fluid circulation system passes through a fluid path in which the turbine may be a least partially positioned thereby rotating the turbine.","When positioned in the certain location the pool cleaning robot may be in proximity to a drain located at a bottom of the pool.","The controller may be arranged to position the pool cleaning robot in contact with an underwater station thereby reaching the certain location.","The controller may be arranged to direct the pool cleaning robot to be positioned in the certain location, wherein in the certain location the flow level of fluid that may be circulated by the pool fluid circulation system may be a highest flow level in the pool.","According to an embodiment of the invention there may be provided an underwater station that, may include a first contactless charging element that may be arranged to (a) be fed by the electrical supply module and (b) generate an electromagnetic field during at least one period during which a second contactless charging element of a pool cleaning robot may be within a charging range from the first contactless charging element, and wherein the electromagnetic field charges the second contactless charging element; and an interface for contacting the pool cleaning robot during a charging of the pool cleaning robot by the first contactless charging element.","The underwater station may include multiple spaced apart radiation sources for emitting electromagnetic radiation.","The interface may be a platform on which the pool cleaning robot may be mounted during the charging.","The platform may include a flat surface and a rail leading to the flat surface.","The underwater station may include a sanitizer for sanitizing used filters.","The underwater station may include a floating unit for attaching floating material to used filters.","According to an embodiment of the invention there may be provided a pool cleaning robot may include a housing; and a filter manipulator that may be at least partially located within the housing and may be arranged to (a) receive a filter and (b) introduce a movement between the filter and the housing thereby positioning the filter within a filtering position in which the filter may be at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.","The filter manipulator may be arranged to receive the filter and at least one additional filter and to position the filter at the filtering position.","The filter manipulator may include a filter storage module that may include multiple compartments for receiving multiple filters including the filter.","The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the storage module.","The movement mechanism may be arranged to move the filter storage module thereby placing another filter of the multiple filters in the filtering position.","The filter storage module may have a radial symmetry.","The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the filter without moving the storage module.","The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the filter and by moving the storage module.","The filter manipulator may be completely within the housing.","The filter manipulator may be arranged to dispose the filter from the pool cleaning robot.","The housing may include a first filter opening for receiving the filter; and wherein the filter manipulator that may be arranged to receive the filter supplied through the first filter opening.","The filter manipulator may be arranged to dispose the filter from the robot through the first filter opening.","The filter manipulator may be arranged to dispose the filter from the robot through a second filter opening that differs from the first filter opening.","The filter manipulator may include rails for conveying the filter within the housing.","The pool cleaning robot may include a detector that may be arranged to sense a cleanliness level of the filter and a controller that may be arranged to determine whether to replace the filter in response to the cleanliness level of the filter.","The filter may be a first filter; wherein the filter manipulator may be arranged to receive the first filter and a second filter and to position the second filter in a non-filtering position.","The pool cleaning robot may include a processing module that may be arranged to process the filter after the filter may be replaced by another filter thereby becoming a used filter.","The pool cleaning robot may include wherein the processing module may be arranged to compress the used filter.","The processing module may be arranged to shred the used filter.","The processing module may be arranged to sanitize the used filter.","According to an embodiment of the invention there may be provided a pool cleaning robot may include a housing; and a filter storage module that may be at least partially located within the housing and may be arranged to (a) receive multiple filters and (b) hold the multiple filters so that at least one of the multiple filters may be positioned in a filtering position in which the filter may be at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.","The housing may include a first filter opening for receiving the multiple filters.","The first filter opening may be located at a bottom of the housing.","The first filter opening may be located at a sidewall of the housing.","The housing may include at least one second filter opening for outputting the multiple filters from the housing.","The housing may include a first filter opening for receiving the multiple filters and a second filter opening for outputting the multiple filters from the housing, wherein the first filter opening faces the second filter opening.","The filter storage module may be arranged to hold the multiple filters so that at least one other filter of the multiple filters may be positioned at a non-filtering position.","According to an embodiment of the invention there may be provided an underwater station that, may include a filter manipulator that may be arranged to input a filter into a pool cleaning robot that may be located in a filter replacement position and to assist in positioning the filter at a filtering position in which the filter may be at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.","The filter manipulator may be arranged to position the filter at the filtering position.","The filter manipulator may be arranged to receive multiple filters and to feed at least two filters in the robot.","The filter manipulator may include a filter storage module that may be arranged to store multiple used filters after the used filters were outputted from the pool cleaning robot.","The filter manipulator may include a filter storage module that may be arranged to store multiple filters before the multiple filters may be inputted to the pool cleaning robot.","The filter manipulator may include a filter storage module that may be arranged to store multiple used filters after the used filters were outputted from the pool cleaning robot and may be arranged to store multiple filters before the multiple filters may be inputted to the pool cleaning robot.","The filter manipulator may include a filter storage module that may be arranged to store multiple filters and a movement mechanism.","The movement mechanism may be arranged to move at least one of the filter storage module and the filter in order to input the filter into the pool cleaning robot.","The movement mechanism may be arranged to assist in moving the filter within the housing thereby placing another filter of the multiple filters at the filtering position.","The filter storage module may have a radial symmetry.","The movement mechanism may include (a) a rotation unit that may be arranged to rotate the filter storage module thereby positioning the filter in front of a filter opening formed in the pool cleaning robot, and (b) an insertion and ejection module that may be arranged to cause the filter to pass through the filter opening.","The filter opening may be formed at the bottom of the pool cleaning robot and wherein the insertion and ejection module may be arranged to lift the filter through the filter opening.","The movement mechanism may be arranged to input the filter in the pool cleaning robot by moving the filter without moving the storage module.","The filter manipulator may be arranged to assist in an outputting of the filter from the robot.","The underwater station may include a processing module for processing used filters that were outputted from the pool cleaning robot.","The processing module may be arranged to compress the used filters.","The processing module may be arranged to shred the used filters.","The processing module may be arranged to sanitize the used filters.","According to an embodiment of the invention there may be provided a pool cleaning robot that may include a housing that may have a first fluid opening and a second fluid opening; a filter that may include a filter core that may be at least partially located within the housing and may include an one or more inlets, an one or more outlets and at least one filtering element positioned between the one or more inlets and the an one or more outlets ; and a filter core rotator that may be arranged to rotate the filter core during at least one period in which the filter core filters fluid that enters through the one or more inlets to output filtered fluid via the one or more outlets .","The filter core may be radially symmetrical and wherein the one or more inlets may be positioned at a center of the filter core.","The filter core rotator may be arranged to rotate the filter core about the center of the filter core.","The filter core rotator may be arranged to rotate a perforated pole that may be positioned at the center of the filter core and thereby cause the filter core to rotate.","The perforated pole may include choppers.","The pool cleaning robot may include a filter core enclosure that may include at least one opening to allow filtered fluid to pass through, wherein the filter core enclosure surrounds the filter core.","The filter core and the filter core enclosure may be radially symmetrical.","The filter core may be radially symmetrical and wherein the filter core enclosure may be not radially symmetrical.","The housing may include a filter opening for receiving the filter core; and once positioned in the pool cleaning robot the filter core enclosure closes the filter opening.","The at least one filtering element may be oriented in relation to the one or more inlets.","The at least one filtering element may be multiple filtering elements that may include disk shaped filtering elements that may be oriented in relation to each other.","The at least one filtering elements may include disk shaped filtering elements, wherein even filtering elements may be parallel to each other, odd filtering elements may be parallel to each other and oriented in relation to the even filtering elements.","The pool cleaning robot may include a filter housing that may be arranged to receive the filter core and the filter core enclosure.","The filter housing may be connected to at least one out of (a) the filter core rotator and (b) a gear coupled to the filter core rotator.","The at least one of the filter core rotator and the gear may be arranged to contact the filter core enclosure when the filter core enclosure may be located within the filter housing.","The filter housing may include a filter opening for receiving the filter.\\ The filter housing may be arranged to close the filter opening once located within the pool cleaning robot.","The filter housing may be arranged to close the filter opening once located in a non-filtering position within the pool cleaning robot.","The pool cleaning robot may include a filter manipulator that may be at least partially located within the housing and may be arranged to (a) receive the filter and (b) introduce a movement between the filter and the housing thereby positioning the filter within a filtering position in which the filter core filters fluid that enters through the one or more inlets to output filtered fluid via the one or more outlets.","The filter manipulator may include a filter storage module that may include multiple compartments for receiving multiple filters including the filter.","The filter manipulator may include a movement mechanism that may be arranged to introduce a movement between the filter and the housing by moving the filter storage module.","The movement mechanism may be arranged to move the filter storage module thereby placing another filter of the multiple filters in the filtering position.","The filter storage module may have a radial symmetry.","The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the filter without moving the storage module.","The filter manipulator may be arranged to dispose the filter from the robot.","The housing may include a first filter opening for receiving the filter; and wherein the filter manipulator may be arranged to receive the filter supplied through the first filter opening.","The pool cleaning robot may include a processing module that may be arranged to process the filter after the filter may be replaced by another filter thereby becoming a used filter.","The filter core may include choppers.","The at least one filter element may include a fine filter and a gross filter.","The filter core rotator may include a rotor.","The rotor may be arranged to rotate the filter core, wherein the rotor may be rotated by a flow of fluid induced by a pool fluid circulation system.","The rotor may be arranged to rotate a motor-generator module.","The pool cleaning robot may include a motor-generator module that may be arranged to rotate the rotor and the filter core when operating in a first operational mode.","The pool cleaning robot may include an opening sealed by a uni-directional valve that allows fluid form the rotor to exit the pool cleaning robot.","The rotor may be positioned above the filter core.","The rotor may be positioned below the filter core.","According to an embodiment of the invention there may be provided a method for autonomous underwater operation, the method may include performing in an autonomous manner, by at least one of a pool cleaning robot and an underwater station, at least one operation out of pool cleaning robot filter replacement and cordless pool cleaning robot charging.","According to an embodiment of the invention there may be provided a method for filtering fluid by a filter of a pool cleaning robot, the method may include filtering fluid by a filter of a pool cleaning robot, wherein the filter fulfils at least one of the following (i) it may have a filter core that may be rotated by a filter core rotator when the filter applied a filtering operation, (ii) may be positioned in a filtering position while at least one other filter of the pool cleaning robot may be positioned within the pool cleaning robot in a non-filtering position, (iii) may be positioned in a filtering position when the pool cleaning robot and by a filter manipulator.","BRIEF DESCRIPTION OF THE DRAWINGS In order to understand the invention and to see how it may be carried out in practice, an embodiment will now be described, by way of a non-limiting example only, with reference to the accompanying drawings, in which: FIG.","1 illustrates a pool cleaning robot and an underwater station according to an embodiment of the invention; FIG.","2A illustrates a portion of a pool, a pool cleaning robot and a drain of the pool according to an embodiment of the invention; FIG.","2B illustrates a portion of a pool and a pool cleaning robot that is positioned on top of a drain of the pool according to an embodiment of the invention; FIG.","2C illustrates a portion of a pool cleaning robot that is positioned on top of a drain of the pool according to an embodiment of the invention; FIG.","3A illustrates a portion of a pool, a pool cleaning robot and an underwater station according to an embodiment of the invention; FIG.","3B illustrates a portion of a pool and pool cleaning robot that is wirelessly charged by an underwater station while being positioned on a platform of the underwater station according to an embodiment of the invention; FIG.","4A illustrates a portion of a pool, a pool cleaning robot, an underwater station, a turbine, an electrical generator that feeds the underwater station and a tube of a pool fluid circulation system according to an embodiment of the invention; FIG.","4B illustrates a portion of a pool, a pool cleaning robot, an underwater station, a turbine, an electrical generator that form a part of the underwater station and a tube of a pool fluid circulation system according to an embodiment of the invention; FIG.","4C illustrates a portion of a pool, a pool cleaning robot that includes a turbine and an electrical generator and a tube of a pool fluid circulation system according to an embodiment of the invention; FIG.","5A illustrates a pool cleaning robot that includes multiple filters according to an embodiment of the invention; FIG.","5B illustrates a bottom of a housing of a pool cleaning robot that includes multiple filters according to an embodiment of the invention; FIG.","5C illustrates a pool cleaning robot that includes a filter according to an embodiment of the invention; FIG.","6A illustrates a pool cleaning robot, an underwater station and multiple filters according to an embodiment of the invention; FIG.","6B illustrates a pool cleaning robot, an underwater station and multiple filters according to an embodiment of the invention; FIG.","7A illustrates an underwater station that comprises a filter manipulator according to an embodiment of the invention; FIG.","7B illustrates an underwater station that comprises a filter manipulator that elevates a filter to be inserted into a pool cleaning robot according to an embodiment of the invention; FIG.","7C illustrates an underwater station that comprises a filter manipulator and pool cleaning robot that is positioned on a platform of the underwater station and is fed by a filter according to an embodiment of the invention; FIG.","7D illustrates an underwater station that comprises a filter manipulator and pool cleaning robot that is positioned on a platform of the underwater station after being fed by a filter according to an embodiment of the invention; FIG.","8 illustrates a pool cleaning robot that comprises a filter according to an embodiment of the invention; FIG.","9 illustrates a filter having a filter core with a zigzag shaped array of filtering elements, a perforated pole and a gear that assist in rotating a core of the filter according to an embodiment of the invention; FIG.","10 illustrates a filter a filter core with zigzag shaped array of filtering elements, a gear and a perforated pole that assist in rotating the filter and a filter core rotator according to an embodiment of the invention; FIG.","11A illustrates a pool cleaning robot that includes multiple filters, a gear and a filter core rotator according to an embodiment of the invention; FIG.","11B illustrates multiple filters positioned within a pool cleaning robot, a gear and a filter core rotator according to an embodiment of the invention; FIG.","12 illustrates a filter, a gear and a perforated pole, a filter core rotator while the filter core is being inserted to (or extracted from) the filter housing according to an embodiment of the invention; FIG.","13A illustrates a filter, a gear, a perforated pole, choppers, and a filter core rotator according to an embodiment of the invention; FIG.","13B illustrates a bottom of the perforated pole and choppers according to an embodiment of the invention; FIG.","14 illustrates a filter having a filter core that includes a fine filtering element and a coarse filtering element, a gear, a perforated pole, and a filter core rotator according to an embodiment of the invention; FIG.","15 illustrates a filter having a filter core that includes a filtering element and blades , a gear, a perforated pole, choppers and a filter core rotator according to an embodiment of the invention; FIG.","16A illustrates a filter having a filter core that includes a zigzag shaped array of filtering elements, a perforated pole, a motor/generator that functions as a motor and acts as a filter core rotator and a turbine rotator, a rotor that acts as a turbine and is positioned below the filter and an enclosure that has a first opening below the turbine and a second opening that is selectively sealed by a uni-directional valve; FIG.","16B illustrates a filter having a filter core that includes a zigzag shaped array of filtering elements, a perforated pole, a motor/generator that functions as a generator, a rotor that acts as an impeller and is positioned below the filter and an enclosure that has a first opening below the turbine and a second opening that is selectively sealed by a uni-directional valve; FIG.","17A is a cross sectional view of a filter having a filter core, a perforated pole, a motor/generator that functions as a motor and acts as a filter core rotator and a turbine rotator, a rotor that acts as a turbine and is positioned below the filter and an enclosure that has a first opening below the turbine and a second opening that is selectively sealed by a uni-directional valve; FIG.","17B is a cross sectional view of a filter having a filter core, a perforated pole, a motor/generator that functions as a generator, a rotor that acts as an impeller and is positioned below the filter and an enclosure that has a first opening below the turbine and a second opening that is selectively sealed by a uni-directional valve; FIG.","17C is a cross sectional view of a pool cleaning robot according to an embodiment of the invention; FIG.","17D is a cross sectional view of a pool cleaning robot according to an embodiment of the invention; FIG.","17E is a cross sectional view of a filter having a filter core, a perforated pole, a motor/generator that functions as a motor and acts as a filter core rotator and a turbine rotator, a rotor that acts as a turbine and is positioned above the filter and an enclosure that has a first opening below the turbine and a second opening that is selectively sealed by a uni-directional valve; FIG.","17F is a cross sectional view of a filter having a filter core, a perforated pole, a motor/generator that functions as a generator, a rotor that acts as an impeller and is positioned above the filter and an enclosure that has a first opening below the turbine and a second opening that is selectively sealed by a uni-directional valve; FIG.","18A illustrates various components of a pool cleaning robot according to an embodiment of the invention; FIG.","18B illustrates power supply modules of a pool cleaning robot according to various embodiments of the invention; FIG.","18C illustrates drive and steering modules a pool cleaning robot according to various embodiments of the invention; FIG.","18D illustrates fluid control modules of a pool cleaning robot according to various embodiments of the invention; FIG.","18E illustrates sensors of a sensing and communication module of a pool cleaning robot according to various embodiments of the invention; FIG.","18F illustrates various components of a pool cleaning robot according to an embodiment of the invention; FIG.","18G illustrates various components of a pool cleaning robot according to an embodiment of the invention; FIG.","18H illustrates various components of a pool cleaning robot according to an embodiment of the invention; FIG.","19A illustrates various components of an underwater station according to an embodiment of the invention; FIG.","19B illustrates various components of an underwater station according to an embodiment of the invention; FIG.","20 illustrates a pool, a poll pool cleaning robot and a pool fluid circulation system according to an embodiment of the invention; FIG.","21 illustrates a method according to an embodiment of the invention; and FIG.","22 illustrates a method according to an embodiment of the invention.","DETAILED DESCRIPTION OF EMBODIMENTS According to various embodiments of the invention there is provided a pool cleaning robot that is autonomous.","The pool cleaning robot can be being charged while being underwater.","Contactless Underwater Charging of a Pool Cleaning Robot FIGS.","1 and 3A illustrate a pool cleaning robot 100 that approaches an underwater station 200 according to an embodiment of the invention.","FIG.","3B illustrates a pool cleaning robot 100 that is mounted on an underwater station 200 according to an embodiment of the invention.","The underwater station of FIG.","1 is illustrated as including an erect portion 230, a platform 230 on which the pool cleaning robot can mount, a first contactless charging element 210, and radiation sources 241 and 242.Radiation sources 241 and 242 may be spaced apart from each other and are arranged to emit radiation (such as ultrasonic radiation) that can be detected by sensor 110 of pool cleaning robot 100 and allow the pool cleaning robot 100 to navigate towards the underwater station 200.The pool cleaning robot 100 may compare between the radiation received from the different radiation sources (241 and 242) and direct itself toward the underwater station 200.The radiation sources 241 and 242 may emit radiation of different frequencies, in different points of time and the like.","The platform 230 is illustrated as including flat surface 221 and rails 222 that ease the mounting of the pool cleaning robot on the flat surface 221.A first contactless charging element 210 may be connected to the platform 220, embedded in the platform 220 or otherwise included in the underwater station 200 and may be used to charge the pool cleaning robot 100 that in turn has a second contactless charging element (denoted 150 in FIGS.","3A and 3B) to facilitate the contactless charging of the pool cleaning robot 100.FIGS.","3A and 3B also illustrate a cable 402 that feeds the underwater station with electrical power.","This electrical power can be supplied to the first contactless charging element 210.FIG.","1 also illustrates a holding element such as ring 9 that can be contacted when the pool cleaning robot 100 is taken out of the pool.","Charging a Pool Cleaning Robot using a Flow of Fluid that Induced by a Pool Fluid Circulation System A pool cleaning robot may be charged using a flow of fluid that is induced by a pool fluid circulation system.","A turbine that is rotated by the flow of fluid can be included in the pool cleaning robot (as shown in FIGS.","2A, 2B, 2C and 4C), can be included in an underwater station (as shown in FIG.","4B) or can be coupled to the underwater pool cleaning robot (as shown in FIG.","4A).","FIG.","2C illustrates a pool cleaning robot 100 while FIGS.","2A and 2B illustrate the pool cleaning robot 100 as well as a portion of a pool 300 and a drain 302 of the pool according to an embodiment of the invention.","In FIG.","2A the pool cleaning robot 100 is near the drain 302 while in FIG.","2B the pool cleaning robot is on top of the drain (not shown).","FIG.","2A also illustrates a communication module 306 for communication with the pool cleaning robot 100.Referring to FIG.","2C—pool cleaning robot 100 includes turbine 120, housing 104, first fluid opening 101 and second fluid opening 102 formed in the housing 104, electrical generator 122, pump motor 132, impeller 133, rechargeable power source such as battery 135, drive motor 124 and first track 141.Non-limiting examples of additional and/or alternative components and modules of the pool cleaning robot 100 are illustrated in FIGS.","18A-18H.","The turbine 120 is positioned above a first fluid opening 101 formed at the bottom of the pool cleaning robot 100 and below second fluid opening 102.The turbine 120 is at least partially disposed within a fluid path formed between the first fluid opening 101 so as to extract energy from flow of fluid through the fluid path.","Electrical generator 122 is arranged to provide electrical power thereto and adapted to be driven by the turbine 120.The rechargeable power source 135 is arranged to be charged by the electrical generator 122 and to supply electrical power during at least one period of time during which the turbine 120 does not extract energy from the flow of fluid.","When positioned in proximity of the drain 302, fluid is sucked from second fluid outlet 102, through the fluid path and exits the pool cleaning robot via the first fluid opening 101 thereby rotating the turbine 120.It is noted that charging the pool cleaning robot 100 by the drain 302 is an example of charging the pool cleaning robot by a flow of fluid that is induced by a pool fluid circulation system (denoted 333 in FIG.","20A).","Yet for another example—pool cleaning robot may be located in proximity (or in contact with) an output of a tube (denoted 408 in FIG.","4C) of the pool fluid circulation system.","It is expected that the pool cleaning robot 100 needs to be relatively proximate (few centimeters till few tenths of centimeters) from an inlet or outlet of the pool fluid circulation system in order that a sufficient amount of flow of fluid is induced to flow through the fluid path and thereby rotating turbine 120.Accordingly—the charging may occur when the pool cleaning robot 100 is positioned in a certain location in which a flow level of fluid that is circulated by a pool fluid circulation system is higher than a flow level of the fluid within a majority of the pool or even be the highest flow level in the pool.","When positioned at the certain location the fluid that is circulated by the pool fluid circulation system passes through the fluid path formed in the pool cleaning robot.","FIG.","4A illustrates a portion of a pool 300, a pool cleaning robot 100, an underwater station 200, a turbine 404, an electrical generator 406 that feeds the underwater station 200 with electrical power via cable 401 and a tube 408 of a pool fluid circulation system according to an embodiment of the invention.","Turbine 404 and electrical generator 406 are submerged and do not belong to the underwater station 200 or to the pool cleaning robot 100.Tube 408 can direct a jet of fluid towards turbine 404 or may such fluid from the pool.","Turbine has an outlet 410 for allowing fluid that is jetted by the tube 408 to enter the pool and/or to allow fluid sucked through tube 408 to enter turbine 404.FIG.","4B illustrates a portion of a pool 300, a pool cleaning robot 100, an underwater station 200 as well as a turbine 404 and an electrical generator 406 that form a part of the underwater station 200 that feeds the underwater station according to an embodiment of the invention.","Turbine 404 is rotated by a flow of fluid induced by tube 408 of the pool fluid circulation system.","FIG.","4C illustrates a portion of a pool 300, tube 408 and a pool cleaning robot 100 that includes turbine 404 and electrical generator 406 according to an embodiment of the invention.","The turbine 404 is rotated by a flow of fluid induced by tube 408 of the pool fluid circulation system.","This may require the pool cleaning robot to direct turbine 404 (facing one of the sides of the pool cleaning robot—but not its bottom) to be positioned near the opening of tube 408.Underwater Filter Replacement Additionally or alternatively, filters of the pool cleaning robot can be inserted to the pool cleaning robot underwater, ejected from the pool cleaning robot underwater, replaced underwater and/or processed underwater.","The insertion and/or the ejection and/or the replacement of the filters can be executed by the robot, by an underwater station of by a combination of both.","FIG.","5A illustrates a pool cleaning robot 100 that includes multiple filters 170, 172 and 174 according to an embodiment of the invention.","FIG.","5B illustrates a bottom of a housing 104 of a pool cleaning robot 100 that includes multiple filters according to an embodiment of the invention.","FIG.","5C illustrates a pool cleaning robot 100 that includes a single filter 170 according to an embodiment of the invention.","Filter 172 may be used to filter the fluid that passes through the pool cleaning robot 100—as may be regarded as being in a filtering position.","The fluid may enter through fluid opening 117 (see FIG.","5B).","Filters 172 and 174 may be regarded as being in a non-filtering position.","Alternatively—more than one of the filters 170, 172 and 174 can be used for concurrently filtering fluid that passes through the pool cleaning robot 100.Alternatively—filter 170 or filter 174 can be used for filtering while filter 172 is not be used for filtering—when positioned at the center of the pool cleaning robot 100.Filters 170, 172 and 174 may be inserted through a first filter opening 160 formed in the housing of the pool cleaning robot 100.Filters 170, 172 and 174 may be ejected (outputted) from the pool cleaning robot through the first filter opening 160 or (As illustrated in FIGS.","5A and 5C)—through a second filter opening (denoted 162 formed in the housing of the pool cleaning robot 100).","Between insertion and ejection the filters of FIGS.","5A and 5C follow a linear path (delimited by rails 169) that is normal to the longitudinal axis of the pool cleaning robot.","It is noted that other paths (non-linear, other linear paths) can be provided.","Filter openings may be positioned in various locations of the housing—including the bottom of the housing, the upper portion of the housing or any side portions (sidewalls) of the housing.","FIGS.","5A-5C merely illustrates a non-limiting of the locations of such filter openings.","FIG.","5A also illustrates a sanitizing unit 72 that is arranged to irradiate a filter with ultraviolet radiation or perform any other sanitizing process.","Referring to FIG.","5C—first filter opening 160 is equipped with a first door 164 and a spring mechanism 166 that allows the first door 164 to open when a filter is inserted to the pool cleaning robot 100 and to be closed (thereby closing the first filter opening 160) after the filter is inserted.","Second filter opening 162 is equipped with a second door 168 and a spring mechanism 169 that allows the second door 168 to open when a filter is extracted/ejected/outputted from the pool cleaning robot 100 and to be closed (thereby closing the second filter opening 162) after the filter is extracted/ejected/outputted.","It is noted that a filter opening can be closed by the filter (or by the filter housing)—as illustrated in FIG.","5A.","FIG.","6A and 6B illustrates a pool cleaning robot 100, an underwater station 200 and multiple filters 176 and 177 according to an embodiment of the invention.","The pool cleaning robot 100 is mounted on the underwater station 200.Filters 176 are stored in a first filter storage module 272 and then fed to the pool cleaning robot 100 by a first filter manipulator that is represented by arm 261.Filters are ejected from the pool cleaning robot 100 by the first filter manipulator (if the same movement used for inserting filters can also eject filters) or by a second filter manipulator that is represented by arm 263 that pushes used filters into underwater station housing 250.FIGS.","6A and 6B also illustrate a compressor (represented by arm 265) that compresses a used filter before the used filter enters underwater station housing 250.The underwater station 200 is further illustrated as including underwater station housing 250 and filter ejection module 240 from which used filters can be ejected or otherwise taken outside the pool.","The underwater station 200 is illustrated as including a duct 240 through which used filters can float, ejected or taken outside the pool.","The underwater station 200 may include processing elements located within the housing 250 (or outside the housing) for sanitizing, shredding, compressing, and/or attaching floating elements to used filters.","FIG.","7A-7D illustrate an underwater station 200 during various stages of a loading process of a filter into a pool cleaning robot 100 according to an embodiment of the invention.","FIG.","7C and 7D also illustrate the pool cleaning robot 100 that is being loaded with a filter.","The underwater station 200 includes a filter manipulator that includes a arm 266 for elevating a filter from a filter storage module 270 that may have a radially symmetrical shape (annular, cylindrical and the like) that has multiple compartments 273 for storing multiple filters 176.The filter storage module 270 is rotated about its center by a movement module that has an axel denoted 274 for rotating the filter storage module 270 about its axis—thereby selecting a selected filter to be inserted to the pool cleaning robot 100 via an opening formed at the bottom of the housing of the pool cleaning robot.","The selected filter is positioned in proximity to arm 266 in order to allow arm 266 to elevate the filter into the pool cleaning robot 100.FIG.","7A illustrates a positioning of a selected filter near arm 266.Figured 7B-7C illustrates phases in the lifting process and FIG.","7D shows the end of the lifting process.","An opposite process may be used to extract a used filter from the pool cleaning robot 100—the arm 266 contacts the filter and lowers it to an empty compartment of the filter storage module 270.FIG.","8 illustrates a pool cleaning robot 100 that comprises a filter manipulator 180 and multiple filters according to an embodiment of the invention.","The filter manipulator 180 includes a filter storage module 182 that has multiple compartments for storing multiple filters.","The filter storage module 182 may be have a radially symmetrical shape (annular, cylindrical and the like) and is rotated about its center by a movement module that has an axel denoted 184 for rotating the filter storage module 180 about its axis—thereby placing a selected filter in a filtering position.","The entire filter storage module 182 can be manually or automatically replaced.","The latter can be executed by an underwater station or by the pool cleaning robot itself.","Filter having a Rotatable Core According to various embodiments of the invention there are provided filters that have filter cores that are rotatable.","The rotation may introduce a centrifugal force that pushes compresses dirt towards the exterior of the filter and/or towards filtering elements of the filter and improves the filtering process.","FIG.","9 illustrates a filter 500 that includes a filter core 510, a filter core enclosure 530 and filter housing 540.It is noted that in various figures (for example FIGS.","9, 10, 12, 13A, 13B, 14, 15, 16A, 16B) there is illustrated a gap between the filter enclosure 530 and the filter housing 540.Such a gap may not exist or otherwise fluid can be prevented from passing through the gap unfiltered and enter various parts of the pool cleaning robot.","The filter core 510 is at least partially located within the filter housing 540 and includes one or more inlets 511, one or more outlets 513 and at least one filtering element (such as the zigzag array of filtering elements 516) that is positioned between the one or more inlets 511 and the an one or more outlets 513.The filter core enclosure 530 includes openings 532 that facilitate a flow of fluid to and from the filter core 510.The filter core enclosure 530 includes a gear 518 that meshes with another gear 550.The other gear may be rotatably connected to the filter housing 540 and is rotated by a filter core rotator (denoted 552 in FIG.","11B).","The filter housing 540 includes filter housing openings 542 that facilitates a flow of fluid to and from the filter core enclosure 530.FIG.","9 illustrates a cylindrical shaped filter core enclosure and a filter housing having a cylindrical interior and a rectangular shaped exterior.","The filter core 510, the filter enclosure 530 and the filter housing 540 can be of different shapes.","FIG.","9 also illustrated a perforated pole 560 that is located at the center of the filter core 510.The perforated pole 560 can be regarded as belonging to filter 500 or as not belonging to the filter 500.The perforated pole 560 can be attached to the filter 500 in a detachable or non-detachable manner.","For example an actuator and a spring may be provided for detaching or locking the filter.","FIG.","10 illustrates filter 500 as having (or being connected to) a perforated pole 560 that is connected to axel 562 that has a gear 564 at its top.","Gear 564 is rotated by another gear 554 connected to filter core rotator 552.In FIG.","10 the filter housing 540 is not connected to gear 550 and the filter enclosure 530 does not include a gear.","FIGS.","11A and 11B illustrate a pool cleaning robot 100 that includes multiple filters 170, 172 and 174, a gear 550 of filter 172 that is positioned in a filtering position and is rotated by filter core rotator 552 according to an embodiment of the invention.","FIG.","12 illustrates filter 500 as having (or being connected to) a perforated pole 560 that is connected to axel 562 that has a gear 564 at its top.","Gear 564 is rotated by another gear 554 connected to filter core rotator 552.The filter core rotator 552 may be a pump motor, a drive motor or be mechanically coupled to one of these motors.","The filter core 510 can be inserted to (or extracted from) the filter housing 540.The filter housing 540 can be part of the filter and/or can be a part of the pool cleaning robot FIG.","13A illustrates a filter 500, a gear 550, a perforated pole 560, choppers 570, and a filter core rotator 552 according to an embodiment of the invention.","FIG.","13B illustrates an area of filter 510 that includes choppers 570.The choppers 570 are connected to an input of the perforated pole 570 so then when the perforated core is rotated the choppers chop debris that enters the filter 500 via the perforated pole 560.The input of the perforated pole 560 can be positioned directly above an opening such as fluid opening 117 of FIG.","5B Choppers 570 are shown as having fin like shape and are facing each other.","There may be one or more choppers.","Different choppers 570 can have different shapes and/or sizes.","The choppers can be connected to the filter core or other parts of the filter.","Choppers can be positioned at different heights of the perforated pole or filter.","The choppers may be attached as propellers to axle 558.FIG.","14 illustrates filter 500 as having (or being connected to) a perforated pole 560 that is connected to axel 562 that has a gear 564 at its top.","Gear 564 is rotated by another gear 554 connected to filter core rotator 552.The filter core 510 includes filtering elements that are a fine filter element 595 and a coarse (or gross) filtering element 594 both are illustrated as being a cylindrical shaped meshes.","Fluid from the one or more inlets of the filter are filtered by the gross filtering element 594 before being filtered by the fine filtering element 595.The gross and fine filtering elements by differ from each other by the size of particles they block.","The gross filtering mesh may be constructed of 200 microns pore size and the fine mesh may be of 50 microns pore size.","Other pore sizes can be provided.","FIG.","15 illustrates filter 500 as having (or being connected to) a perforated pole 560 that is connected to axel 562 that has a gear 564 at its top.","Gear 564 is rotated by another gear 554 connected to filter core rotator 552.The filter 500 includes blades 577 that may be connected to various other parts of the filter 510.Additionally or alternatively the blades 577 are connected to an inner cylindrical frame (not shown) that may be parallel to the perforated pole 560, may contact the perforated pole 560, may be spaced apart from the perforated pole 560, may be connected to and/or held by the filter core enclosure 530 (for example—held by the floor, bottom and/or sidewall of the filter core enclosure).","When the perforated pole 560 is not connected to the blades and the filter core 510 the perforated pole 560 may remain in the pool cleaning robot after ejection of the filter core 510 and accumulated dirt can be serviced efficiently and washed off the blades.","The blades 557 may extend along the entire filter enclosure 530 and are positioned between the perforated pole 560 and the filtering element 594.The blades 577 form a rotor.","When the filter core 510 is rotated by filter core rotator 552 these blades may cause the filter core 510 to act as a turbine and assist the flow of water into the filter core.","Dual Mode Motor-Generator And Dual-Mode Rotor FIGS.","16A, 17A and 17E illustrate a filter 500, a rotor 590 that functions as an impeller, a motor/generator 559 that functions as a motor for rotating the filter core 510 and the rotor 590, and an enclosure 595 not shown that surrounds the rotor and has (a) a first opening 102 located below the rotor 590 and (b) a second opening 593 that is selectively sealed by a uni-directional valve 592, according to an embodiment of the invention.","Alternatively, the first and second openings 102 and 593 may be formed in the bottom of the pool cleaning robot 100 and the enclosure 595 may be located above the bottom in a manner that the bottom and the enclosure may provide a closed environment (except the openings 102 and 593).","In FIG.","16A the filter 500 is positioned between the rotor 590 and the motor/generator 559.In FIG.","17A the rotor 590 is positioned between the filter 500 and the motor/generator 559.An axle/spindle 558 connects the motor/generator 559 to the perforated pole 560.In this mode of operation fluid is directed by the rotor to enter the filter 500 and to exit filter 500 after being filtered.","In this mode of operation the uni-directional valve 592 seals the second opening 593.In FIG.","17E the filter 500 (or the filter 500 and the rotor 590) can be fed to the pool cleaning robot via opening 802 formed in a bottom 803 of the pool cleaning robot.","Once inserted in the pool cleaning robot connecting elements (such as elastic ring 801 placed in a space formed by connecting element 804 may hold the filter 500.FIGS.","16B, 17B and 17F illustrate a filter 500, a rotor 590 that functions as a turbine, a motor/generator 559 that functions as a generator for generating electrical energy, and an enclosure 595 that surrounds the rotor and has a first opening 102 above the rotor 590 and a second opening 593 that is selectively sealed by a uni-directional valve 592, according to an embodiment of the invention.","Alternatively, the first and second openings 102 and 593 may be formed in the bottom of the pool cleaning robot 100 and the enclosure 595 may be located above the bottom in a manner that the bottom and the enclosure may provide a closed environment (except the openings 102 and 593).","In FIG.","16B the filter 500 is positioned between the rotor 590 and the motor/generator 559.In FIG.","17B the rotor 590 is positioned between the filter 500 and the motor/generator 559.In this mode fluid is sucked (for example by a drain of a pool) through second opening 593 and rotates the rotor 590 that in turn rotates motor/generator 599.The uni-directional valve 592 is open.","In FIG.","17F the filter 500 (or the filter 500 and the rotor 590) can be fed to the pool cleaning robot via opening 802 formed in a bottom 803 of the pool cleaning robot.","Once inserted in the pool cleaning robot connecting elements (such as elastic ring 801 placed in a space formed by connecting element 804 may hold the filter 500.FIG.","17C is a cross sectional view of pool cleaning robot 100 according to an embodiment of the invention.","The pool cleaning robot 100 includes housing 104 filter 500, a rotor 590 that functions as an impeller, a motor/generator 559 that functions as a motor for rotating the filter core (part of filter 500) and the rotor 590, electrical generator 122 and turbine 120 that are spaced apart from filter 500 and are positioned above another opening of the housing.","In this mode of operation fluid is directed by the rotor 590 to enter the filter 500 and to exit filter 500 after being filtered.","In this mode of operation a uni-directional valve (not shown) seals the opening below turbine 120.FIG.","17D is a cross sectional view of pool cleaning robot 100 according to an embodiment of the invention.","The pool cleaning robot 100 includes housing 104 filter 500, a rotor 590 that functions as a turbine, a motor/generator 559 that functions as an electrical generator and the rotor 590, an electrical generator 122 and turbine 120 that are spaced apart from filter 500 and are positioned above another opening of the housing.","The opening below the turbine 120 is opened and fluid is sucked (for example by drain 302 of a pool) through opening 102 into the pool cleaning robot and out of the pool cleaning robot to drain 302 thereby rotating the rotor 590 that in turn rotates motor/generator 599 and rotating turbine 120.Any one or a combination of the filter 500 and the rotor 590 of FIGS.","16A, 16B, 17A, 17B, 17C, 17D, 17E and 17F can be replaced underwater (or above the water) through openings formed in the pool cleaning robot.","This is illustrated by opening 802 formed in the bottom of the housing in FIGS.","17E and 17F.","The opening can be formed in sidewall of the pool cleaning robot.","When any filter is provided into the pool cleaning robot (for example, any one of the filters illustrated in FIGS.","5A, 5C, 6A, 6B, 7A, 7B, 7C, 7D, 12, 17E and 17F) it can be held to its position by any known fastening or holding element known in the art such as pins, blots, stripes, rails, springs and the like.","Additionally or alternatively the opening through which the filter is inserted can close or at least partially close the opening through which the filter entered.","For example, after a filter has been inserted from the bottom of the pool cleaning robot, it may be fastened by vertical elements that contact the upper part of the filter, the filter opening may close, the filter can be inserted into vertical or otherwise erect rails and the like.","FIG.","18A illustrates various components of a pool cleaning robot 100 according to an embodiment of the invention.","The pool cleaning robot 100 is illustrated as including controller 101, drive and steering module 20, power supply module 40, fluid control module 30, sensing and communication module 50 and brushing module 90.The controller 101 is arranged to control the operation of the pool cleaning robot 100 and especially control the various modules 20, 30, 40 and 50.For example, the controller 101 may be arranged to navigate the pool cleaning robot 100 to direct the pool cleaning robot to be positioned in a certain location in which a flow level of fluid that is circulated by a pool fluid circulation system is higher than a flow level of the fluid within a majority of the pool (for example- to be in proximity to a drain of the pool), wherein when positioned at the certain location the fluid that is circulated by a pool fluid circulation system passes through a fluid path formed in the pool cleaning robot and thereby rotate a turbine.","FIG.","18B illustrates power supply modules 40 of a pool cleaning robot 100 according to various embodiments of the invention.","The power supply module 40 is configured to provide electrical power to various power consuming components such as controller 101, motors, sensors, and the like.","It may receive the electrical power or generate it.","One power supply module 40 includes a second contactless charging element 150 and a rechargeable power source 135 (see, for example FIGS.","3A-3B and 4A-4C).","Another power supply module 40 includes a turbine 120, electrical generator 122 and a rechargeable power source 135 (see, for example FIGS.","2A-2C).","A further power supply module 40 includes a rotor 590 that acts as a turbine, a motor/generator 559 that acts as a generator and a rechargeable power source 135 (see, for example FIGS.","16A-16B and 17A-17B).","FIG.","18C illustrates drive and steering modules 20 of a pool cleaning robot according to various embodiments of the invention.","Drive and steering module 20 is arranged to move the pool cleaning robot 100.It may include one or more motors, one or more wheels or tracks and one or more transmissions that convey movements introduced by motors to the one or more wheels and/or one or more tracks.","One drive and steering module 20 includes first drive motor 124, second drive motor 125, first transmission 127, second transmission 129, first track 141 and second track 143.Some of these components are shown in FIGS.","1, 2A-2C, 3A-3C, 4A-4B and the like.","The pool cleaning robot 100 may include a brushing module (denoted 90 in FIG.","18A) that may include one or more brushing wheels such as brushing wheels 108 that are rotated (directly or indirectly) by first and second tracks 141 and 143.The direction of movement of the pool cleaning robot 100 can be controlled by individually controlling the movement of first and second tracks 141 and 143.Another drive and steering module 20 includes first drive motor 124, first transmission 127, first track 141, second track 143, brushing wheels (not shown) and steering elements 107.Steering elements 107 can include fins, imbalance introduction elements, controllable fluid jet elements and the like.","Non-limiting examples of steering elements are provided in U.S. patent application Ser.","No.","14/023,544 filed Sep. 11, 2013 which is incorporated herein by reference.","Any other steering elements known in the art can be used.","FIG.","18D illustrates fluid control modules 30 of a pool cleaning robot according to various embodiments of the invention.","A fluid control module 30 is arranged to control a flow of fluid within the pool cleaning robot and to filter said fluid.","It may include, any combination of the following: a. Impeller 133 and pump motor 132 for inducing fluid to flow through the pool cleaning robot 100 (see, for example FIG.","2C).","b. Rotor 590 that acts as an impeller and a motor/generator 559 that acts as a motor (see, for example, FIGS.","16A, 16B, 17A, 17B, 17C, 17D).","c. Filter 170, 172, 174 or 500.The filter may have, for example, a filter core 510, a filter enclosure 530 and a filter housing 540.d.","A filter core rotating element 552 (see, for example, FIGS.","10, 12 and 14).","e. Filter manipulator 180 (see, for example, FIG.","8).","FIG.","18E illustrates sensors of a sensing and communication module 50 of a pool cleaning robot according to various embodiments of the invention.","The sensing and communication module 50 may include one or more of the following sensors: a.","Underwater station radiation sensor 110 for sensing radiation from an underwater station (see, FIG.","1).","b. Ultrasonic transceiver 51 for sensing a flow of fluid in the pool—that is expected to be relatively high near the drain of other flow inducing elements of a pool fluid circulation system.","c. Acoustic sensor 52 that may include an acoustic emitter and an acoustic detector to provide information about the area of the pool the pool cleaning robot 100 is passing on.","d. Gyrocompass 53 or multiple gyrocompasses for providing directional information.","e. Accelerometer 54.f.","Step counter 56 for measuring movement of the pool cleaning robot.","g. Orientation sensor 56 for sensing the orientation of the pool cleaning robot 100.h.","Communication unit 59 for communication with the underwater station 200, or with other elements in the pool (see element 306 of FIG.","2A) or outside the pool.","FIG.","18F illustrates various components of a pool cleaning robot 100 according to an embodiment of the invention.","This is an example of combination of controller 101 and various components of the drive and steering module 20, power supply module 40, fluid control module 30, sensing and communication module 50 and brushing module 90.In FIG.","18F the pool cleaning robot 100 includes controller 101, sensing and communication module 50, filter 170, filter manipulator 180, filter core rotating element 520, rechargeable power source 135, second contactless charging element 150, impeller 133, pump motor 132, first and second drive motors 124 and 125, first and second transmissions 127 and 129, first and second tracks 141 and 143.FIG.","18G illustrates various components of a pool cleaning robot 100 according to an embodiment of the invention.","In FIG.","18G the pool cleaning robot 100 includes controller 101, sensing and communication module 50, filter 170, filter manipulator 180, rechargeable power source 135, electrical generator 122, turbine 120, impeller 133, pump motor 132, first drive motor 124, steering elements 107, first transmission 127, first and second tracks 141 and 143 and brushing module 90.FIG.","18H illustrates various components of a pool cleaning robot 100 according to an embodiment of the invention.","This is an example of combination of controller 101, drive and steering module 20, power supply module 40, fluid control module 30, sensing and communication module 50, brushing module 90 and a processing module 70.The processing module 70 is arranged to process filters (not shown).","The processing module 70 may include at least one out of: sanitizing unit 72 that is arranged to irradiate a filter with ultraviolet radiation or perform any other sanitizing process, compressor 74 for compressing a used filter (for example- filter 174 of FIG.","5A), a shredder 76 for shredding a user filter a portion of the filter (its core), and a float inducing module 78 for attaching a floating material (foam, balloon that is inflated) to a user filter and the like.","The processing module 70 can be part of any of the pool cleaning robots illustrated in any previous figures or in any other text of the specification.","FIG.","19A illustrates various components of an underwater station 200 according to an embodiment of the invention.","The underwater station 200 includes an underwater station controller 740, an underwater station filter manipulation module 760, a sensing and communication module 720, a power supply module 207, and an underwater processing module 700.The underwater station controller 740 controls the various modules of the underwater station 200.It can, for example, use information from sensing and communication module 720 for sensing when a pool cleaning robot is positioned within a charging range from a first contactless charging element and control a provision of power to said first contactless charging element.","It may initiate, control and stop a filter insertion process to a pool cleaning robot and/or a filter ejection process from a pool cleaning robot and the like.","The sensing and communication module 720 may include one or more sensors for sensing the location of the pool cleaning robot 100, the status of various operations (processing filters, feeding or extracting filters) and the like.","This information may be fed to the underwater station controller 740.This module communicates with the pool cleaning robot or other devices in or outside the pool.","The power supply module 207 supplies power to the various modules of the underwater station 200 and may also feed (in a contactless or a contact based manner) a pool cleaning robot.","The underwater processing module 700 may perform at least one out of: sanitizing of pre-used or used filters, compressing used filters, shredding user filters attaching a floating material (foam, balloon that is inflated) to a user filters and the like.","FIG.","19B illustrates various components of an underwater station 200 according to an embodiment of the invention.","This figure illustrates multiple components per each module of the underwater station 200.Any combination of any components can be provided.","The underwater station filter manipulation module 760 may include at least one out of a. In-housing manipulator 711 for manipulating filters within housing 250.b.","Filter manipulators such as 260, 262 and 264.Each may include movement modules (261, 263, 265 and 275) and storage modules (272 and 270).","i. Filter manipulator 260 is arranged to store and manipulate pre-used filters (including inserting the pre-used filters to a pool cleaning robot 100, providing and/or arranging filters to/within filter storage module 272, ejecting filters from a pool cleaning robot (see, arm 261 of FIGS.","6A and 6B).","ii.","Filter manipulator 262 is arranged to store and manipulate used-filters (extract from pool cleaning robot, direct used filter towards housing and/or compressor or other processing element).","See, for example, FIGS.","6A-6B.","iii.","Filter manipulator 264 is arranged to store and manipulate filters.","See, for example, FIGS.","7A-7D.","The sensing and communication module 720 may include at least one out of weight sensor 721, ultrasonic transceiver 722, proximity sensor 723, cleanliness sensor 724 and communication unit 725.The sensors 721, 722, 723 are arranged to sense the location of a pool cleaning robot 100 and/or evaluate wherein the pool cleaning robot is positioned in a docking position in which it can be charged and/or receive or extract filters.","Cleanliness filter 724 may sense the cleanliness of pre-used filters and/or used filters.","It may indicate that an extracted filter is clean enough to be used and cause the controller 740 to control a process of returning the used filter to the pool cleaning robot 100 via one of the filter manipulators.","The communication unit 725 may be arranged to communicate with the pool cleaning robot or other devices in or outside the pool.","It may include, for example radiation sources 241 and 242 of FIG.","1.The power supply module 207 may include at least one of the following: a.","Electrical cable 402 (FIG.","3A).","b.","Turbine 404 (FIG.","4B).","c. Electrical generator 406 (FIG.","2B).","d. Rechargeable power source 405.e.","First contactless charging element (such as a coil) 210 (see FIG.","1).","The underwater processing module 700 may include at least one of the following: a. Ejector 707 for ejecting used filters from the underwater station 200.b.","Floater 709 for attaching or otherwise associating a used filter with floating materials (foam, inflated balloon).","c. Compressor 701 and/or 265 (see FIGS.","6A-6B).","d. Shredder 703.e.","Sanitizer 705.FIG.","20A illustrates a pool 300, a pool cleaning robot 100 and a pool fluid circulation system that includes drain 302, fluid pipes 304, filter 330, temperature control unit 320 and circulating pump 310 and tube 408.Any type of pool fluid circulation system can be utilized for the purposes of this invention.","A pool can be regarded as a swimming pool, any type of pool or any type of vessel, container, enclosure that may contain fluid.","Any combination of any components of any pool cleaning robot illustrated in any of the figures may be provided.","Any reference to any pool cleaning robot is applied mutatis mutandis to a method for operating the pool cleaning robot.","Any combination of any components of any underwater systems can be provided.","Any reference to any underwater system is applied mutatis mutandis to a method for operating the pool cleaning robot.","FIG.","21 illustrates method 400 according to an embodiment of the invention.","Method 400 is autonomous operation.","Method 400 includes step 410 of performing, by at least one of a pool cleaning robot and an underwater station, in an autonomous manner at least one out of pool cleaning robot filter replacement and pool cleaning robot charging.","The term autonomous may mean without human intervention.","The pool cleaning robot charging is applied on a pool cleaning robot that is not constantly connected to a cord that extends outside the pool and constantly supplies to the pool cleaning robot electrical energy or supplied to the pool cleaning robot a constant a flow of fluid.","For example, executing the process at least partially illustrated in any one of FIGS.","1, 2A, 2B, 2C, 3A, 3B, 4A, 4B may amount to performing in an autonomous manner a pool cleaning robot charging.","Yet for another example, executing the process at least partially illustrated in any one of FIGS.","6A, 6B, 7A, 7B, 7C, 7D, 8 and 12 may amount to performing in an autonomous manner a pool cleaning robot filter replacement.","FIG.","22 illustrates method 500 according to an embodiment of the invention.","Method 500 includes stage 510 of filtering fluid by a pool cleaning robot by using a filter that fulfils at least one of the following: (i) it has a filter core that is rotated by a filter core rotator when the filter applied a filtering operation, (ii) is positioned in a filtering position while at least one other filter of the pool cleaning robot is positioned within the pool cleaning robot in a non-filtering position, (iii) is positioned in a filtering position when the pool cleaning robot and by a filter manipulator.","For example, the filtering can be executed by any one of the filters illustrated in FIGS.","5A, 5C, 6A, 6B, 7A, 7B, 7C, 7D, 8, 9, 10, 11A, 11B, 12, 13A, 13B, 16A, 16B, 17A-17F.","Moreover, the terms “front,” “back,” “top,” “bottom,” “over,” “under” and the like in the description and in the claims, if any, are used for descriptive purposes and not necessarily for describing permanent relative positions.","It is understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in other orientations than those illustrated or otherwise described herein.","Those skilled in the art will recognize that the boundaries between logic blocks are merely illustrative and that alternative embodiments may merge logic blocks or circuit elements or impose an alternate decomposition of functionality upon various logic blocks or circuit elements.","Thus, it is to be understood that the architectures depicted herein are merely exemplary, and that in fact many other architectures may be implemented which achieve the same functionality.","Any arrangement of components to achieve the same functionality is effectively “associated” such that the desired functionality is achieved.","Hence, any two components herein combined to achieve a particular functionality may be seen as “associated with” each other such that the desired functionality is achieved, irrespective of architectures or intermedial components.","Likewise, any two components so associated can also be viewed as being “operably connected,” or “operably coupled,” to each other to achieve the desired functionality.","Furthermore, those skilled in the art will recognize that boundaries between the above described operations merely illustrative.","The multiple operations may be combined into a single operation, a single operation may be distributed in additional operations and operations may be executed at least partially overlapping in time.","Moreover, alternative embodiments may include multiple instances of a particular operation, and the order of operations may be altered in various other embodiments.","Also for example, in one embodiment, the illustrated examples may be implemented as circuitry located on a single integrated circuit or within a same device.","Alternatively, the examples may be implemented as any number of separate integrated circuits or separate devices interconnected with each other in a suitable manner.","Also for example, the examples, or portions thereof, may implemented as soft or code representations of physical circuitry or of logical representations convertible into physical circuitry, such as in a hardware description language of any appropriate type.","However, other modifications, variations and alternatives are also possible.","The specifications and drawings are, accordingly, to be regarded in an illustrative rather than in a restrictive sense.","In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.","The word ‘comprising’ does not exclude the presence of other elements or steps then those listed in a claim.","Furthermore, the terms “a” or “an,” as used herein, are defined as one or more than one.","Also, the use of introductory phrases such as “at least one” and “one or more” in the claims should not be construed to imply that the introduction of another claim element by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim element to inventions containing only one such element, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an.” The same holds true for the use of definite articles.","Unless stated otherwise, terms such as “first” and “second” are used to arbitrarily distinguish between the elements such terms describe.","Thus, these terms are not necessarily intended to indicate temporal or other prioritization of such elements.","The mere fact that certain measures are recited in mutually different claims does not indicate that a combination of these measures cannot be used to advantage.","While certain features of the invention have been illustrated and described herein, many modifications, substitutions, changes, and equivalents will now occur to those of ordinary skill in the art.","It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.","Those skilled in the art to which this invention pertains will readily appreciate that numerous changes, variations and modifications can be made without departing from the scope of the invention mutatis mutandis."]],"string":"[\n [\n \"UNDERWATER STATION\",\n \"An underwater station that may include a filter manipulator that is arranged to input, without human intervention, a filter into a pool cleaning robot that is located in a filter replacement position and to assist, without human intervention, in positioning the filter at a filtering position in which the filter is at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.\"\n ],\n [\n \"1.An underwater station, comprising: a filter manipulator that is arranged to input, without human intervention, a filter into a pool cleaning robot that is located in a filter replacement position and to assist, without human intervention, in positioning the filter at a filtering position in which the filter is at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.\",\n \"2.The underwater station according to claim 1 wherein the filter manipulator is arranged to position, without human intervention, the filter at the filtering position.\",\n \"3.The underwater station according to claim 1 wherein the filter manipulator is arranged to receive multiple filters and to feed, without human intervention, at least two filters in the robot.\",\n \"4.The underwater station according to claim 1 wherein the filter manipulator comprises a filter storage module that is arranged to store multiple used filters after the used filters were outputted from the pool cleaning robot.\",\n \"5.The underwater station according to claim 1 wherein the filter manipulator comprises a filter storage module that is arranged to store multiple filters before the multiple filters are inputted to the pool cleaning robot.\",\n \"6.The underwater station according to claim 1 wherein the filter manipulator comprises a filter storage module that is arranged to store multiple used filters after the used filters were outputted from the pool cleaning robot and is arranged to store multiple filters before the multiple filters are inputted to the pool cleaning robot.\",\n \"7.The underwater station according to claim 1 wherein the filter manipulator comprises a filter storage module that is arranged to store multiple filters and a movement mechanism.\",\n \"8.The underwater station according to claim 7 wherein the movement mechanism is arranged to move, without human intervention, at least one of the filter storage module and the filter in order to input the filter into the pool cleaning robot.\",\n \"9.The underwater station according to claim 7 wherein the movement mechanism is further arranged to assist, without human intervention, in moving the filter within the housing thereby placing another filter of the multiple filters at the filtering position.\",\n \"10.The underwater station according to claim 1 wherein the filter manipulator is arranged to assist, without human intervention, in an outputting of the filter from the robot.\",\n \"11.The underwater station according to claim 1 further comprising a processing module for processing, without human intervention, used filters that were outputted from the pool cleaning robot.\",\n \"12.The underwater station according to claim 11 wherein the processing module is arranged to compress the used filters.\",\n \"13.The underwater station according to claim 12 wherein the processing module is arranged to shred the used filters.\",\n \"14.The underwater station according to claim 12 wherein the processing module is arranged to sanitize the used filters.\",\n \"15.A method for autonomous underwater operation, the method comprises performing in an autonomous manner, without human intervention, by an underwater station, at least one operation out of pool cleaning robot filter replacement and cordless pool cleaning robot charging.\",\n \"16.The method according to claim 15 comprising storing, at the filter storage module, multiple used filters after the used filters were outputted from the pool cleaning robot.\",\n \"17.The method according to claim 15 further comprising processing, by a processing module of the underwater station and without human intervention, used filters that were outputted from the pool cleaning robot.\",\n \"18.The method according to claim 17 wherein the processing comprises compressing, without human intervention, the used filters.\",\n \"19.The method according to claim 17 wherein the processing comprises shredding, without human intervention, the used filters.\",\n \"20.The method according to claim 17 wherein the processing comprises sanitizing, without human intervention, the used filters.\"\n ],\n [\n \" BACKGROUND OF THE INVENTION Pool cleaning robots are adapted for use for cleaning a pool while being connected to electrical power cables or to a hose of a suction system.\",\n \"The hose and/or power cable can get tangled and may temporarily limit the usage of the pool.\",\n \"Once a filter of a pool cleaning robot is clogged the pool cleaning robot is manually taken out of the pool and its filter can be washed by a user of the pool cleaning robot.\",\n \"Taking a pool cleaning robot out of the pool is a time and effort consuming operation that is not very fond by the users.\",\n \"In many cases the users delay these manual operations or even skip them causing the pool cleaning robot to operate in a sub-optimal manner.\",\n \"There is a growing need to provide autonomous robots that require a lesser amount of human intervention in their maintenance.\"\n ],\n [\n \" SUMMARY OF THE INVENTION According to an embodiment of the invention there may be provided a pool cleaning robot that may include first and second fluid openings, with a fluid path between the first fluid opening and the second fluid opening; a turbine at least partially disposed within the fluid path so as to extract energy from flow of fluid through the fluid path; an electrical generator for providing electrical power thereto and adapted to be driven by the turbine; a rechargeable power source arranged to be charged by the electrical generator and to supply electrical power during at least one period of time during which the turbine does not extract energy from the flow of fluid; and a controller that may be arranged to direct the pool cleaning robot to be positioned in a certain location in which a flow level of fluid that may be circulated by a pool fluid circulation system may be higher than a flow level of the fluid within a majority of the pool, wherein when positioned at the certain location the fluid that may be circulated by the pool fluid circulation system passes through the fluid path.\",\n \"The pool cleaning robot may include a sensor that may be arranged to sense a location of the pool cleaning robot within the pool.\",\n \"The when positioned in the certain location the pool cleaning robot may be in proximity to a drain located at a bottom of the pool.\",\n \"The controller may be arranged to position the pool cleaning robot in contact with an underwater station thereby reaching the certain location.\",\n \"The pool cleaning robot may include a sensor that may be arranged to sense radiation emitted by the underwater station and thereby assist in directing the pool cleaning robot towards the underwater station.\",\n \"The controller may be arranged to direct the pool cleaning robot to be positioned in the certain location, wherein in the certain location the flow level of fluid that may be circulated by the pool fluid circulation system may be a highest flow level in the pool.\",\n \"According to an embodiment of the invention there may be provided a pool cleaning robot that may include a second fluid opening; a first fluid opening, with a fluid path between the first fluid opening and the second fluid opening; a turbine at least partially disposed within the fluid path so as to extract energy from flow of fluid through the fluid path; an electrical generator for providing electrical power thereto and adapted to be driven by the turbine; a rechargeable power source arranged to be charged by the electrical generator and to supply electrical power during at least one period of time during which the turbine does not extract energy from the flow of fluid; and a controller that may be arranged to direct the pool cleaning robot to be positioned in proximity to a drain of the pool, wherein when in proximity to the drain of the pool the fluid that may be sucked by the drain passes through the fluid path.\",\n \"The pool cleaning robot further may include a sensor for sensing information about a vicinity of the pool cleaning robot.\",\n \"The pool cleaning robot may include an acoustic sensor that may be arranged to provide sonic intensity information about the noise variations in the pool, when the pool cleaning robot moves along the bottom of the pool, and wherein the controller may be arranged to direct the pool cleaning robot towards the drain in response to the sonic information.\",\n \"The pool cleaning robot may include a gyrocompass that may be arranged to provide directional information, and wherein the controller may be arranged to direct the pool cleaning robot towards the drain in response to the directional information.\",\n \"According to an embodiment of the invention there may be provided an underwater station that for charging a pool cleaning robot, may include an electrical power supply module for converting to electrical energy a flow of fluid that may be induced by a pool fluid circulation system; and a first contactless charging element that may be arranged to (a) be fed by the electrical supply module and (b) generate an electromagnetic field during at least one period during which a second contactless charging element of the pool cleaning robot may be within a charging range from the first contactless charging element, and wherein the electromagnetic field charges the second contactless charging element.\",\n \"The electrical power supply module may include (a) a turbine at least partially disposed within a fluid path in which the flow of fluid passes so as to extract energy from the flow of fluid and (b) an electrical generator for providing power thereto and adapted to be driven by the turbine.\",\n \"The turbine, the electrical generator and the first contactless charging element may be included within an underwater station.\",\n \"The turbine and the electrical generator may not be not included in an underwater station and wherein the first contactless charging element may be included in the underwater station.\",\n \"The at least one of the turbine, electrical generator and the first contactless charging element may be a part of an underwater station.\",\n \"The first contactless charging element may be an induction coil.\",\n \"According to an embodiment of the invention there may be provided a pool cleaning robot that may include a housing that may have a first fluid opening and a second fluid opening; a filter; a rotor coupled to the filter and positioned within an enclosure; a motor-generator module coupled to the rotor; wherein when operating in a first operational mode the motor-generator may be arranged to rotate the rotor and the filter core; wherein when operating in a second operational mode the rotor-generator may be arranged to be rotated by the rotor and to generate electrical power.\",\n \"The rotor may be positioned between the motor-generator and the filter.\",\n \"The filter may be positioned between the rotor and the motor-generator.\",\n \"The pool cleaning robot may include an opening sealed by a uni-directional valve that allows fluid from the rotor to exit the enclosure.\",\n \"The filter may include a filter core that may be at least partially located within the housing and may include an one or more inlets, an one or more outlets and at least one filtering element positioned between the one or more inlets and the an one or more outlets.\",\n \"The rotor may be spaced apart from the motor-generator and the filter.\",\n \"The pool cleaning robot may include a turbine, an electrical generator and a controller that may be arranged to direct the pool cleaning robot to be positioned in a certain location in which a flow level of fluid that may be circulated by a pool fluid circulation system may be higher than a flow level of the fluid within a majority of the pool, wherein when positioned at the certain location the fluid that may be circulated by the pool fluid circulation system passes through a fluid path in which the turbine may be a least partially positioned thereby rotating the turbine.\",\n \"When positioned in the certain location the pool cleaning robot may be in proximity to a drain located at a bottom of the pool.\",\n \"The controller may be arranged to position the pool cleaning robot in contact with an underwater station thereby reaching the certain location.\",\n \"The controller may be arranged to direct the pool cleaning robot to be positioned in the certain location, wherein in the certain location the flow level of fluid that may be circulated by the pool fluid circulation system may be a highest flow level in the pool.\",\n \"According to an embodiment of the invention there may be provided an underwater station that, may include a first contactless charging element that may be arranged to (a) be fed by the electrical supply module and (b) generate an electromagnetic field during at least one period during which a second contactless charging element of a pool cleaning robot may be within a charging range from the first contactless charging element, and wherein the electromagnetic field charges the second contactless charging element; and an interface for contacting the pool cleaning robot during a charging of the pool cleaning robot by the first contactless charging element.\",\n \"The underwater station may include multiple spaced apart radiation sources for emitting electromagnetic radiation.\",\n \"The interface may be a platform on which the pool cleaning robot may be mounted during the charging.\",\n \"The platform may include a flat surface and a rail leading to the flat surface.\",\n \"The underwater station may include a sanitizer for sanitizing used filters.\",\n \"The underwater station may include a floating unit for attaching floating material to used filters.\",\n \"According to an embodiment of the invention there may be provided a pool cleaning robot may include a housing; and a filter manipulator that may be at least partially located within the housing and may be arranged to (a) receive a filter and (b) introduce a movement between the filter and the housing thereby positioning the filter within a filtering position in which the filter may be at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.\",\n \"The filter manipulator may be arranged to receive the filter and at least one additional filter and to position the filter at the filtering position.\",\n \"The filter manipulator may include a filter storage module that may include multiple compartments for receiving multiple filters including the filter.\",\n \"The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the storage module.\",\n \"The movement mechanism may be arranged to move the filter storage module thereby placing another filter of the multiple filters in the filtering position.\",\n \"The filter storage module may have a radial symmetry.\",\n \"The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the filter without moving the storage module.\",\n \"The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the filter and by moving the storage module.\",\n \"The filter manipulator may be completely within the housing.\",\n \"The filter manipulator may be arranged to dispose the filter from the pool cleaning robot.\",\n \"The housing may include a first filter opening for receiving the filter; and wherein the filter manipulator that may be arranged to receive the filter supplied through the first filter opening.\",\n \"The filter manipulator may be arranged to dispose the filter from the robot through the first filter opening.\",\n \"The filter manipulator may be arranged to dispose the filter from the robot through a second filter opening that differs from the first filter opening.\",\n \"The filter manipulator may include rails for conveying the filter within the housing.\",\n \"The pool cleaning robot may include a detector that may be arranged to sense a cleanliness level of the filter and a controller that may be arranged to determine whether to replace the filter in response to the cleanliness level of the filter.\",\n \"The filter may be a first filter; wherein the filter manipulator may be arranged to receive the first filter and a second filter and to position the second filter in a non-filtering position.\",\n \"The pool cleaning robot may include a processing module that may be arranged to process the filter after the filter may be replaced by another filter thereby becoming a used filter.\",\n \"The pool cleaning robot may include wherein the processing module may be arranged to compress the used filter.\",\n \"The processing module may be arranged to shred the used filter.\",\n \"The processing module may be arranged to sanitize the used filter.\",\n \"According to an embodiment of the invention there may be provided a pool cleaning robot may include a housing; and a filter storage module that may be at least partially located within the housing and may be arranged to (a) receive multiple filters and (b) hold the multiple filters so that at least one of the multiple filters may be positioned in a filtering position in which the filter may be at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.\",\n \"The housing may include a first filter opening for receiving the multiple filters.\",\n \"The first filter opening may be located at a bottom of the housing.\",\n \"The first filter opening may be located at a sidewall of the housing.\",\n \"The housing may include at least one second filter opening for outputting the multiple filters from the housing.\",\n \"The housing may include a first filter opening for receiving the multiple filters and a second filter opening for outputting the multiple filters from the housing, wherein the first filter opening faces the second filter opening.\",\n \"The filter storage module may be arranged to hold the multiple filters so that at least one other filter of the multiple filters may be positioned at a non-filtering position.\",\n \"According to an embodiment of the invention there may be provided an underwater station that, may include a filter manipulator that may be arranged to input a filter into a pool cleaning robot that may be located in a filter replacement position and to assist in positioning the filter at a filtering position in which the filter may be at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.\",\n \"The filter manipulator may be arranged to position the filter at the filtering position.\",\n \"The filter manipulator may be arranged to receive multiple filters and to feed at least two filters in the robot.\",\n \"The filter manipulator may include a filter storage module that may be arranged to store multiple used filters after the used filters were outputted from the pool cleaning robot.\",\n \"The filter manipulator may include a filter storage module that may be arranged to store multiple filters before the multiple filters may be inputted to the pool cleaning robot.\",\n \"The filter manipulator may include a filter storage module that may be arranged to store multiple used filters after the used filters were outputted from the pool cleaning robot and may be arranged to store multiple filters before the multiple filters may be inputted to the pool cleaning robot.\",\n \"The filter manipulator may include a filter storage module that may be arranged to store multiple filters and a movement mechanism.\",\n \"The movement mechanism may be arranged to move at least one of the filter storage module and the filter in order to input the filter into the pool cleaning robot.\",\n \"The movement mechanism may be arranged to assist in moving the filter within the housing thereby placing another filter of the multiple filters at the filtering position.\",\n \"The filter storage module may have a radial symmetry.\",\n \"The movement mechanism may include (a) a rotation unit that may be arranged to rotate the filter storage module thereby positioning the filter in front of a filter opening formed in the pool cleaning robot, and (b) an insertion and ejection module that may be arranged to cause the filter to pass through the filter opening.\",\n \"The filter opening may be formed at the bottom of the pool cleaning robot and wherein the insertion and ejection module may be arranged to lift the filter through the filter opening.\",\n \"The movement mechanism may be arranged to input the filter in the pool cleaning robot by moving the filter without moving the storage module.\",\n \"The filter manipulator may be arranged to assist in an outputting of the filter from the robot.\",\n \"The underwater station may include a processing module for processing used filters that were outputted from the pool cleaning robot.\",\n \"The processing module may be arranged to compress the used filters.\",\n \"The processing module may be arranged to shred the used filters.\",\n \"The processing module may be arranged to sanitize the used filters.\",\n \"According to an embodiment of the invention there may be provided a pool cleaning robot that may include a housing that may have a first fluid opening and a second fluid opening; a filter that may include a filter core that may be at least partially located within the housing and may include an one or more inlets, an one or more outlets and at least one filtering element positioned between the one or more inlets and the an one or more outlets ; and a filter core rotator that may be arranged to rotate the filter core during at least one period in which the filter core filters fluid that enters through the one or more inlets to output filtered fluid via the one or more outlets .\",\n \"The filter core may be radially symmetrical and wherein the one or more inlets may be positioned at a center of the filter core.\",\n \"The filter core rotator may be arranged to rotate the filter core about the center of the filter core.\",\n \"The filter core rotator may be arranged to rotate a perforated pole that may be positioned at the center of the filter core and thereby cause the filter core to rotate.\",\n \"The perforated pole may include choppers.\",\n \"The pool cleaning robot may include a filter core enclosure that may include at least one opening to allow filtered fluid to pass through, wherein the filter core enclosure surrounds the filter core.\",\n \"The filter core and the filter core enclosure may be radially symmetrical.\",\n \"The filter core may be radially symmetrical and wherein the filter core enclosure may be not radially symmetrical.\",\n \"The housing may include a filter opening for receiving the filter core; and once positioned in the pool cleaning robot the filter core enclosure closes the filter opening.\",\n \"The at least one filtering element may be oriented in relation to the one or more inlets.\",\n \"The at least one filtering element may be multiple filtering elements that may include disk shaped filtering elements that may be oriented in relation to each other.\",\n \"The at least one filtering elements may include disk shaped filtering elements, wherein even filtering elements may be parallel to each other, odd filtering elements may be parallel to each other and oriented in relation to the even filtering elements.\",\n \"The pool cleaning robot may include a filter housing that may be arranged to receive the filter core and the filter core enclosure.\",\n \"The filter housing may be connected to at least one out of (a) the filter core rotator and (b) a gear coupled to the filter core rotator.\",\n \"The at least one of the filter core rotator and the gear may be arranged to contact the filter core enclosure when the filter core enclosure may be located within the filter housing.\",\n \"The filter housing may include a filter opening for receiving the filter.\\\\ The filter housing may be arranged to close the filter opening once located within the pool cleaning robot.\",\n \"The filter housing may be arranged to close the filter opening once located in a non-filtering position within the pool cleaning robot.\",\n \"The pool cleaning robot may include a filter manipulator that may be at least partially located within the housing and may be arranged to (a) receive the filter and (b) introduce a movement between the filter and the housing thereby positioning the filter within a filtering position in which the filter core filters fluid that enters through the one or more inlets to output filtered fluid via the one or more outlets.\",\n \"The filter manipulator may include a filter storage module that may include multiple compartments for receiving multiple filters including the filter.\",\n \"The filter manipulator may include a movement mechanism that may be arranged to introduce a movement between the filter and the housing by moving the filter storage module.\",\n \"The movement mechanism may be arranged to move the filter storage module thereby placing another filter of the multiple filters in the filtering position.\",\n \"The filter storage module may have a radial symmetry.\",\n \"The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the filter without moving the storage module.\",\n \"The filter manipulator may be arranged to dispose the filter from the robot.\",\n \"The housing may include a first filter opening for receiving the filter; and wherein the filter manipulator may be arranged to receive the filter supplied through the first filter opening.\",\n \"The pool cleaning robot may include a processing module that may be arranged to process the filter after the filter may be replaced by another filter thereby becoming a used filter.\",\n \"The filter core may include choppers.\",\n \"The at least one filter element may include a fine filter and a gross filter.\",\n \"The filter core rotator may include a rotor.\",\n \"The rotor may be arranged to rotate the filter core, wherein the rotor may be rotated by a flow of fluid induced by a pool fluid circulation system.\",\n \"The rotor may be arranged to rotate a motor-generator module.\",\n \"The pool cleaning robot may include a motor-generator module that may be arranged to rotate the rotor and the filter core when operating in a first operational mode.\",\n \"The pool cleaning robot may include an opening sealed by a uni-directional valve that allows fluid form the rotor to exit the pool cleaning robot.\",\n \"The rotor may be positioned above the filter core.\",\n \"The rotor may be positioned below the filter core.\",\n \"According to an embodiment of the invention there may be provided a method for autonomous underwater operation, the method may include performing in an autonomous manner, by at least one of a pool cleaning robot and an underwater station, at least one operation out of pool cleaning robot filter replacement and cordless pool cleaning robot charging.\",\n \"According to an embodiment of the invention there may be provided a method for filtering fluid by a filter of a pool cleaning robot, the method may include filtering fluid by a filter of a pool cleaning robot, wherein the filter fulfils at least one of the following (i) it may have a filter core that may be rotated by a filter core rotator when the filter applied a filtering operation, (ii) may be positioned in a filtering position while at least one other filter of the pool cleaning robot may be positioned within the pool cleaning robot in a non-filtering position, (iii) may be positioned in a filtering position when the pool cleaning robot and by a filter manipulator.\"\n ],\n [\n \"RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser.\",\n \"No.\",\n \"14/433,859 filing date Apr.\",\n \"7, 2015 which is a national phase application of PCT patent application serial number PCT/IL2013/051055 international filing date Dec. 22, 2013 which claims priority from U.S. provisional patent Ser.\",\n \"No.\",\n \"61/745,556 filing date Dec. 22, 2012, all being incorporated herein by reference.\",\n \"FIELD OF THE INVENTION This invention relates to pool cleaning robots, and particularly to autonomous pool cleaning robots.\",\n \"BACKGROUND OF THE INVENTION Pool cleaning robots are adapted for use for cleaning a pool while being connected to electrical power cables or to a hose of a suction system.\",\n \"The hose and/or power cable can get tangled and may temporarily limit the usage of the pool.\",\n \"Once a filter of a pool cleaning robot is clogged the pool cleaning robot is manually taken out of the pool and its filter can be washed by a user of the pool cleaning robot.\",\n \"Taking a pool cleaning robot out of the pool is a time and effort consuming operation that is not very fond by the users.\",\n \"In many cases the users delay these manual operations or even skip them causing the pool cleaning robot to operate in a sub-optimal manner.\",\n \"There is a growing need to provide autonomous robots that require a lesser amount of human intervention in their maintenance.\",\n \"SUMMARY OF THE INVENTION According to an embodiment of the invention there may be provided a pool cleaning robot that may include first and second fluid openings, with a fluid path between the first fluid opening and the second fluid opening; a turbine at least partially disposed within the fluid path so as to extract energy from flow of fluid through the fluid path; an electrical generator for providing electrical power thereto and adapted to be driven by the turbine; a rechargeable power source arranged to be charged by the electrical generator and to supply electrical power during at least one period of time during which the turbine does not extract energy from the flow of fluid; and a controller that may be arranged to direct the pool cleaning robot to be positioned in a certain location in which a flow level of fluid that may be circulated by a pool fluid circulation system may be higher than a flow level of the fluid within a majority of the pool, wherein when positioned at the certain location the fluid that may be circulated by the pool fluid circulation system passes through the fluid path.\",\n \"The pool cleaning robot may include a sensor that may be arranged to sense a location of the pool cleaning robot within the pool.\",\n \"The when positioned in the certain location the pool cleaning robot may be in proximity to a drain located at a bottom of the pool.\",\n \"The controller may be arranged to position the pool cleaning robot in contact with an underwater station thereby reaching the certain location.\",\n \"The pool cleaning robot may include a sensor that may be arranged to sense radiation emitted by the underwater station and thereby assist in directing the pool cleaning robot towards the underwater station.\",\n \"The controller may be arranged to direct the pool cleaning robot to be positioned in the certain location, wherein in the certain location the flow level of fluid that may be circulated by the pool fluid circulation system may be a highest flow level in the pool.\",\n \"According to an embodiment of the invention there may be provided a pool cleaning robot that may include a second fluid opening; a first fluid opening, with a fluid path between the first fluid opening and the second fluid opening; a turbine at least partially disposed within the fluid path so as to extract energy from flow of fluid through the fluid path; an electrical generator for providing electrical power thereto and adapted to be driven by the turbine; a rechargeable power source arranged to be charged by the electrical generator and to supply electrical power during at least one period of time during which the turbine does not extract energy from the flow of fluid; and a controller that may be arranged to direct the pool cleaning robot to be positioned in proximity to a drain of the pool, wherein when in proximity to the drain of the pool the fluid that may be sucked by the drain passes through the fluid path.\",\n \"The pool cleaning robot further may include a sensor for sensing information about a vicinity of the pool cleaning robot.\",\n \"The pool cleaning robot may include an acoustic sensor that may be arranged to provide sonic intensity information about the noise variations in the pool, when the pool cleaning robot moves along the bottom of the pool, and wherein the controller may be arranged to direct the pool cleaning robot towards the drain in response to the sonic information.\",\n \"The pool cleaning robot may include a gyrocompass that may be arranged to provide directional information, and wherein the controller may be arranged to direct the pool cleaning robot towards the drain in response to the directional information.\",\n \"According to an embodiment of the invention there may be provided an underwater station that for charging a pool cleaning robot, may include an electrical power supply module for converting to electrical energy a flow of fluid that may be induced by a pool fluid circulation system; and a first contactless charging element that may be arranged to (a) be fed by the electrical supply module and (b) generate an electromagnetic field during at least one period during which a second contactless charging element of the pool cleaning robot may be within a charging range from the first contactless charging element, and wherein the electromagnetic field charges the second contactless charging element.\",\n \"The electrical power supply module may include (a) a turbine at least partially disposed within a fluid path in which the flow of fluid passes so as to extract energy from the flow of fluid and (b) an electrical generator for providing power thereto and adapted to be driven by the turbine.\",\n \"The turbine, the electrical generator and the first contactless charging element may be included within an underwater station.\",\n \"The turbine and the electrical generator may not be not included in an underwater station and wherein the first contactless charging element may be included in the underwater station.\",\n \"The at least one of the turbine, electrical generator and the first contactless charging element may be a part of an underwater station.\",\n \"The first contactless charging element may be an induction coil.\",\n \"According to an embodiment of the invention there may be provided a pool cleaning robot that may include a housing that may have a first fluid opening and a second fluid opening; a filter; a rotor coupled to the filter and positioned within an enclosure; a motor-generator module coupled to the rotor; wherein when operating in a first operational mode the motor-generator may be arranged to rotate the rotor and the filter core; wherein when operating in a second operational mode the rotor-generator may be arranged to be rotated by the rotor and to generate electrical power.\",\n \"The rotor may be positioned between the motor-generator and the filter.\",\n \"The filter may be positioned between the rotor and the motor-generator.\",\n \"The pool cleaning robot may include an opening sealed by a uni-directional valve that allows fluid from the rotor to exit the enclosure.\",\n \"The filter may include a filter core that may be at least partially located within the housing and may include an one or more inlets, an one or more outlets and at least one filtering element positioned between the one or more inlets and the an one or more outlets.\",\n \"The rotor may be spaced apart from the motor-generator and the filter.\",\n \"The pool cleaning robot may include a turbine, an electrical generator and a controller that may be arranged to direct the pool cleaning robot to be positioned in a certain location in which a flow level of fluid that may be circulated by a pool fluid circulation system may be higher than a flow level of the fluid within a majority of the pool, wherein when positioned at the certain location the fluid that may be circulated by the pool fluid circulation system passes through a fluid path in which the turbine may be a least partially positioned thereby rotating the turbine.\",\n \"When positioned in the certain location the pool cleaning robot may be in proximity to a drain located at a bottom of the pool.\",\n \"The controller may be arranged to position the pool cleaning robot in contact with an underwater station thereby reaching the certain location.\",\n \"The controller may be arranged to direct the pool cleaning robot to be positioned in the certain location, wherein in the certain location the flow level of fluid that may be circulated by the pool fluid circulation system may be a highest flow level in the pool.\",\n \"According to an embodiment of the invention there may be provided an underwater station that, may include a first contactless charging element that may be arranged to (a) be fed by the electrical supply module and (b) generate an electromagnetic field during at least one period during which a second contactless charging element of a pool cleaning robot may be within a charging range from the first contactless charging element, and wherein the electromagnetic field charges the second contactless charging element; and an interface for contacting the pool cleaning robot during a charging of the pool cleaning robot by the first contactless charging element.\",\n \"The underwater station may include multiple spaced apart radiation sources for emitting electromagnetic radiation.\",\n \"The interface may be a platform on which the pool cleaning robot may be mounted during the charging.\",\n \"The platform may include a flat surface and a rail leading to the flat surface.\",\n \"The underwater station may include a sanitizer for sanitizing used filters.\",\n \"The underwater station may include a floating unit for attaching floating material to used filters.\",\n \"According to an embodiment of the invention there may be provided a pool cleaning robot may include a housing; and a filter manipulator that may be at least partially located within the housing and may be arranged to (a) receive a filter and (b) introduce a movement between the filter and the housing thereby positioning the filter within a filtering position in which the filter may be at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.\",\n \"The filter manipulator may be arranged to receive the filter and at least one additional filter and to position the filter at the filtering position.\",\n \"The filter manipulator may include a filter storage module that may include multiple compartments for receiving multiple filters including the filter.\",\n \"The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the storage module.\",\n \"The movement mechanism may be arranged to move the filter storage module thereby placing another filter of the multiple filters in the filtering position.\",\n \"The filter storage module may have a radial symmetry.\",\n \"The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the filter without moving the storage module.\",\n \"The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the filter and by moving the storage module.\",\n \"The filter manipulator may be completely within the housing.\",\n \"The filter manipulator may be arranged to dispose the filter from the pool cleaning robot.\",\n \"The housing may include a first filter opening for receiving the filter; and wherein the filter manipulator that may be arranged to receive the filter supplied through the first filter opening.\",\n \"The filter manipulator may be arranged to dispose the filter from the robot through the first filter opening.\",\n \"The filter manipulator may be arranged to dispose the filter from the robot through a second filter opening that differs from the first filter opening.\",\n \"The filter manipulator may include rails for conveying the filter within the housing.\",\n \"The pool cleaning robot may include a detector that may be arranged to sense a cleanliness level of the filter and a controller that may be arranged to determine whether to replace the filter in response to the cleanliness level of the filter.\",\n \"The filter may be a first filter; wherein the filter manipulator may be arranged to receive the first filter and a second filter and to position the second filter in a non-filtering position.\",\n \"The pool cleaning robot may include a processing module that may be arranged to process the filter after the filter may be replaced by another filter thereby becoming a used filter.\",\n \"The pool cleaning robot may include wherein the processing module may be arranged to compress the used filter.\",\n \"The processing module may be arranged to shred the used filter.\",\n \"The processing module may be arranged to sanitize the used filter.\",\n \"According to an embodiment of the invention there may be provided a pool cleaning robot may include a housing; and a filter storage module that may be at least partially located within the housing and may be arranged to (a) receive multiple filters and (b) hold the multiple filters so that at least one of the multiple filters may be positioned in a filtering position in which the filter may be at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.\",\n \"The housing may include a first filter opening for receiving the multiple filters.\",\n \"The first filter opening may be located at a bottom of the housing.\",\n \"The first filter opening may be located at a sidewall of the housing.\",\n \"The housing may include at least one second filter opening for outputting the multiple filters from the housing.\",\n \"The housing may include a first filter opening for receiving the multiple filters and a second filter opening for outputting the multiple filters from the housing, wherein the first filter opening faces the second filter opening.\",\n \"The filter storage module may be arranged to hold the multiple filters so that at least one other filter of the multiple filters may be positioned at a non-filtering position.\",\n \"According to an embodiment of the invention there may be provided an underwater station that, may include a filter manipulator that may be arranged to input a filter into a pool cleaning robot that may be located in a filter replacement position and to assist in positioning the filter at a filtering position in which the filter may be at least partially disposed within a fluid path formed between a first fluid opening and a second fluid opening of the housing thereby allowing the filter to apply a filtering operation on fluid that passes through the fluid path.\",\n \"The filter manipulator may be arranged to position the filter at the filtering position.\",\n \"The filter manipulator may be arranged to receive multiple filters and to feed at least two filters in the robot.\",\n \"The filter manipulator may include a filter storage module that may be arranged to store multiple used filters after the used filters were outputted from the pool cleaning robot.\",\n \"The filter manipulator may include a filter storage module that may be arranged to store multiple filters before the multiple filters may be inputted to the pool cleaning robot.\",\n \"The filter manipulator may include a filter storage module that may be arranged to store multiple used filters after the used filters were outputted from the pool cleaning robot and may be arranged to store multiple filters before the multiple filters may be inputted to the pool cleaning robot.\",\n \"The filter manipulator may include a filter storage module that may be arranged to store multiple filters and a movement mechanism.\",\n \"The movement mechanism may be arranged to move at least one of the filter storage module and the filter in order to input the filter into the pool cleaning robot.\",\n \"The movement mechanism may be arranged to assist in moving the filter within the housing thereby placing another filter of the multiple filters at the filtering position.\",\n \"The filter storage module may have a radial symmetry.\",\n \"The movement mechanism may include (a) a rotation unit that may be arranged to rotate the filter storage module thereby positioning the filter in front of a filter opening formed in the pool cleaning robot, and (b) an insertion and ejection module that may be arranged to cause the filter to pass through the filter opening.\",\n \"The filter opening may be formed at the bottom of the pool cleaning robot and wherein the insertion and ejection module may be arranged to lift the filter through the filter opening.\",\n \"The movement mechanism may be arranged to input the filter in the pool cleaning robot by moving the filter without moving the storage module.\",\n \"The filter manipulator may be arranged to assist in an outputting of the filter from the robot.\",\n \"The underwater station may include a processing module for processing used filters that were outputted from the pool cleaning robot.\",\n \"The processing module may be arranged to compress the used filters.\",\n \"The processing module may be arranged to shred the used filters.\",\n \"The processing module may be arranged to sanitize the used filters.\",\n \"According to an embodiment of the invention there may be provided a pool cleaning robot that may include a housing that may have a first fluid opening and a second fluid opening; a filter that may include a filter core that may be at least partially located within the housing and may include an one or more inlets, an one or more outlets and at least one filtering element positioned between the one or more inlets and the an one or more outlets ; and a filter core rotator that may be arranged to rotate the filter core during at least one period in which the filter core filters fluid that enters through the one or more inlets to output filtered fluid via the one or more outlets .\",\n \"The filter core may be radially symmetrical and wherein the one or more inlets may be positioned at a center of the filter core.\",\n \"The filter core rotator may be arranged to rotate the filter core about the center of the filter core.\",\n \"The filter core rotator may be arranged to rotate a perforated pole that may be positioned at the center of the filter core and thereby cause the filter core to rotate.\",\n \"The perforated pole may include choppers.\",\n \"The pool cleaning robot may include a filter core enclosure that may include at least one opening to allow filtered fluid to pass through, wherein the filter core enclosure surrounds the filter core.\",\n \"The filter core and the filter core enclosure may be radially symmetrical.\",\n \"The filter core may be radially symmetrical and wherein the filter core enclosure may be not radially symmetrical.\",\n \"The housing may include a filter opening for receiving the filter core; and once positioned in the pool cleaning robot the filter core enclosure closes the filter opening.\",\n \"The at least one filtering element may be oriented in relation to the one or more inlets.\",\n \"The at least one filtering element may be multiple filtering elements that may include disk shaped filtering elements that may be oriented in relation to each other.\",\n \"The at least one filtering elements may include disk shaped filtering elements, wherein even filtering elements may be parallel to each other, odd filtering elements may be parallel to each other and oriented in relation to the even filtering elements.\",\n \"The pool cleaning robot may include a filter housing that may be arranged to receive the filter core and the filter core enclosure.\",\n \"The filter housing may be connected to at least one out of (a) the filter core rotator and (b) a gear coupled to the filter core rotator.\",\n \"The at least one of the filter core rotator and the gear may be arranged to contact the filter core enclosure when the filter core enclosure may be located within the filter housing.\",\n \"The filter housing may include a filter opening for receiving the filter.\\\\ The filter housing may be arranged to close the filter opening once located within the pool cleaning robot.\",\n \"The filter housing may be arranged to close the filter opening once located in a non-filtering position within the pool cleaning robot.\",\n \"The pool cleaning robot may include a filter manipulator that may be at least partially located within the housing and may be arranged to (a) receive the filter and (b) introduce a movement between the filter and the housing thereby positioning the filter within a filtering position in which the filter core filters fluid that enters through the one or more inlets to output filtered fluid via the one or more outlets.\",\n \"The filter manipulator may include a filter storage module that may include multiple compartments for receiving multiple filters including the filter.\",\n \"The filter manipulator may include a movement mechanism that may be arranged to introduce a movement between the filter and the housing by moving the filter storage module.\",\n \"The movement mechanism may be arranged to move the filter storage module thereby placing another filter of the multiple filters in the filtering position.\",\n \"The filter storage module may have a radial symmetry.\",\n \"The filter manipulator may include a movement mechanism that may be arranged to introduce the movement between the filter and the housing by moving the filter without moving the storage module.\",\n \"The filter manipulator may be arranged to dispose the filter from the robot.\",\n \"The housing may include a first filter opening for receiving the filter; and wherein the filter manipulator may be arranged to receive the filter supplied through the first filter opening.\",\n \"The pool cleaning robot may include a processing module that may be arranged to process the filter after the filter may be replaced by another filter thereby becoming a used filter.\",\n \"The filter core may include choppers.\",\n \"The at least one filter element may include a fine filter and a gross filter.\",\n \"The filter core rotator may include a rotor.\",\n \"The rotor may be arranged to rotate the filter core, wherein the rotor may be rotated by a flow of fluid induced by a pool fluid circulation system.\",\n \"The rotor may be arranged to rotate a motor-generator module.\",\n \"The pool cleaning robot may include a motor-generator module that may be arranged to rotate the rotor and the filter core when operating in a first operational mode.\",\n \"The pool cleaning robot may include an opening sealed by a uni-directional valve that allows fluid form the rotor to exit the pool cleaning robot.\",\n \"The rotor may be positioned above the filter core.\",\n \"The rotor may be positioned below the filter core.\",\n \"According to an embodiment of the invention there may be provided a method for autonomous underwater operation, the method may include performing in an autonomous manner, by at least one of a pool cleaning robot and an underwater station, at least one operation out of pool cleaning robot filter replacement and cordless pool cleaning robot charging.\",\n \"According to an embodiment of the invention there may be provided a method for filtering fluid by a filter of a pool cleaning robot, the method may include filtering fluid by a filter of a pool cleaning robot, wherein the filter fulfils at least one of the following (i) it may have a filter core that may be rotated by a filter core rotator when the filter applied a filtering operation, (ii) may be positioned in a filtering position while at least one other filter of the pool cleaning robot may be positioned within the pool cleaning robot in a non-filtering position, (iii) may be positioned in a filtering position when the pool cleaning robot and by a filter manipulator.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS In order to understand the invention and to see how it may be carried out in practice, an embodiment will now be described, by way of a non-limiting example only, with reference to the accompanying drawings, in which: FIG.\",\n \"1 illustrates a pool cleaning robot and an underwater station according to an embodiment of the invention; FIG.\",\n \"2A illustrates a portion of a pool, a pool cleaning robot and a drain of the pool according to an embodiment of the invention; FIG.\",\n \"2B illustrates a portion of a pool and a pool cleaning robot that is positioned on top of a drain of the pool according to an embodiment of the invention; FIG.\",\n \"2C illustrates a portion of a pool cleaning robot that is positioned on top of a drain of the pool according to an embodiment of the invention; FIG.\",\n \"3A illustrates a portion of a pool, a pool cleaning robot and an underwater station according to an embodiment of the invention; FIG.\",\n \"3B illustrates a portion of a pool and pool cleaning robot that is wirelessly charged by an underwater station while being positioned on a platform of the underwater station according to an embodiment of the invention; FIG.\",\n \"4A illustrates a portion of a pool, a pool cleaning robot, an underwater station, a turbine, an electrical generator that feeds the underwater station and a tube of a pool fluid circulation system according to an embodiment of the invention; FIG.\",\n \"4B illustrates a portion of a pool, a pool cleaning robot, an underwater station, a turbine, an electrical generator that form a part of the underwater station and a tube of a pool fluid circulation system according to an embodiment of the invention; FIG.\",\n \"4C illustrates a portion of a pool, a pool cleaning robot that includes a turbine and an electrical generator and a tube of a pool fluid circulation system according to an embodiment of the invention; FIG.\",\n \"5A illustrates a pool cleaning robot that includes multiple filters according to an embodiment of the invention; FIG.\",\n \"5B illustrates a bottom of a housing of a pool cleaning robot that includes multiple filters according to an embodiment of the invention; FIG.\",\n \"5C illustrates a pool cleaning robot that includes a filter according to an embodiment of the invention; FIG.\",\n \"6A illustrates a pool cleaning robot, an underwater station and multiple filters according to an embodiment of the invention; FIG.\",\n \"6B illustrates a pool cleaning robot, an underwater station and multiple filters according to an embodiment of the invention; FIG.\",\n \"7A illustrates an underwater station that comprises a filter manipulator according to an embodiment of the invention; FIG.\",\n \"7B illustrates an underwater station that comprises a filter manipulator that elevates a filter to be inserted into a pool cleaning robot according to an embodiment of the invention; FIG.\",\n \"7C illustrates an underwater station that comprises a filter manipulator and pool cleaning robot that is positioned on a platform of the underwater station and is fed by a filter according to an embodiment of the invention; FIG.\",\n \"7D illustrates an underwater station that comprises a filter manipulator and pool cleaning robot that is positioned on a platform of the underwater station after being fed by a filter according to an embodiment of the invention; FIG.\",\n \"8 illustrates a pool cleaning robot that comprises a filter according to an embodiment of the invention; FIG.\",\n \"9 illustrates a filter having a filter core with a zigzag shaped array of filtering elements, a perforated pole and a gear that assist in rotating a core of the filter according to an embodiment of the invention; FIG.\",\n \"10 illustrates a filter a filter core with zigzag shaped array of filtering elements, a gear and a perforated pole that assist in rotating the filter and a filter core rotator according to an embodiment of the invention; FIG.\",\n \"11A illustrates a pool cleaning robot that includes multiple filters, a gear and a filter core rotator according to an embodiment of the invention; FIG.\",\n \"11B illustrates multiple filters positioned within a pool cleaning robot, a gear and a filter core rotator according to an embodiment of the invention; FIG.\",\n \"12 illustrates a filter, a gear and a perforated pole, a filter core rotator while the filter core is being inserted to (or extracted from) the filter housing according to an embodiment of the invention; FIG.\",\n \"13A illustrates a filter, a gear, a perforated pole, choppers, and a filter core rotator according to an embodiment of the invention; FIG.\",\n \"13B illustrates a bottom of the perforated pole and choppers according to an embodiment of the invention; FIG.\",\n \"14 illustrates a filter having a filter core that includes a fine filtering element and a coarse filtering element, a gear, a perforated pole, and a filter core rotator according to an embodiment of the invention; FIG.\",\n \"15 illustrates a filter having a filter core that includes a filtering element and blades , a gear, a perforated pole, choppers and a filter core rotator according to an embodiment of the invention; FIG.\",\n \"16A illustrates a filter having a filter core that includes a zigzag shaped array of filtering elements, a perforated pole, a motor/generator that functions as a motor and acts as a filter core rotator and a turbine rotator, a rotor that acts as a turbine and is positioned below the filter and an enclosure that has a first opening below the turbine and a second opening that is selectively sealed by a uni-directional valve; FIG.\",\n \"16B illustrates a filter having a filter core that includes a zigzag shaped array of filtering elements, a perforated pole, a motor/generator that functions as a generator, a rotor that acts as an impeller and is positioned below the filter and an enclosure that has a first opening below the turbine and a second opening that is selectively sealed by a uni-directional valve; FIG.\",\n \"17A is a cross sectional view of a filter having a filter core, a perforated pole, a motor/generator that functions as a motor and acts as a filter core rotator and a turbine rotator, a rotor that acts as a turbine and is positioned below the filter and an enclosure that has a first opening below the turbine and a second opening that is selectively sealed by a uni-directional valve; FIG.\",\n \"17B is a cross sectional view of a filter having a filter core, a perforated pole, a motor/generator that functions as a generator, a rotor that acts as an impeller and is positioned below the filter and an enclosure that has a first opening below the turbine and a second opening that is selectively sealed by a uni-directional valve; FIG.\",\n \"17C is a cross sectional view of a pool cleaning robot according to an embodiment of the invention; FIG.\",\n \"17D is a cross sectional view of a pool cleaning robot according to an embodiment of the invention; FIG.\",\n \"17E is a cross sectional view of a filter having a filter core, a perforated pole, a motor/generator that functions as a motor and acts as a filter core rotator and a turbine rotator, a rotor that acts as a turbine and is positioned above the filter and an enclosure that has a first opening below the turbine and a second opening that is selectively sealed by a uni-directional valve; FIG.\",\n \"17F is a cross sectional view of a filter having a filter core, a perforated pole, a motor/generator that functions as a generator, a rotor that acts as an impeller and is positioned above the filter and an enclosure that has a first opening below the turbine and a second opening that is selectively sealed by a uni-directional valve; FIG.\",\n \"18A illustrates various components of a pool cleaning robot according to an embodiment of the invention; FIG.\",\n \"18B illustrates power supply modules of a pool cleaning robot according to various embodiments of the invention; FIG.\",\n \"18C illustrates drive and steering modules a pool cleaning robot according to various embodiments of the invention; FIG.\",\n \"18D illustrates fluid control modules of a pool cleaning robot according to various embodiments of the invention; FIG.\",\n \"18E illustrates sensors of a sensing and communication module of a pool cleaning robot according to various embodiments of the invention; FIG.\",\n \"18F illustrates various components of a pool cleaning robot according to an embodiment of the invention; FIG.\",\n \"18G illustrates various components of a pool cleaning robot according to an embodiment of the invention; FIG.\",\n \"18H illustrates various components of a pool cleaning robot according to an embodiment of the invention; FIG.\",\n \"19A illustrates various components of an underwater station according to an embodiment of the invention; FIG.\",\n \"19B illustrates various components of an underwater station according to an embodiment of the invention; FIG.\",\n \"20 illustrates a pool, a poll pool cleaning robot and a pool fluid circulation system according to an embodiment of the invention; FIG.\",\n \"21 illustrates a method according to an embodiment of the invention; and FIG.\",\n \"22 illustrates a method according to an embodiment of the invention.\",\n \"DETAILED DESCRIPTION OF EMBODIMENTS According to various embodiments of the invention there is provided a pool cleaning robot that is autonomous.\",\n \"The pool cleaning robot can be being charged while being underwater.\",\n \"Contactless Underwater Charging of a Pool Cleaning Robot FIGS.\",\n \"1 and 3A illustrate a pool cleaning robot 100 that approaches an underwater station 200 according to an embodiment of the invention.\",\n \"FIG.\",\n \"3B illustrates a pool cleaning robot 100 that is mounted on an underwater station 200 according to an embodiment of the invention.\",\n \"The underwater station of FIG.\",\n \"1 is illustrated as including an erect portion 230, a platform 230 on which the pool cleaning robot can mount, a first contactless charging element 210, and radiation sources 241 and 242.Radiation sources 241 and 242 may be spaced apart from each other and are arranged to emit radiation (such as ultrasonic radiation) that can be detected by sensor 110 of pool cleaning robot 100 and allow the pool cleaning robot 100 to navigate towards the underwater station 200.The pool cleaning robot 100 may compare between the radiation received from the different radiation sources (241 and 242) and direct itself toward the underwater station 200.The radiation sources 241 and 242 may emit radiation of different frequencies, in different points of time and the like.\",\n \"The platform 230 is illustrated as including flat surface 221 and rails 222 that ease the mounting of the pool cleaning robot on the flat surface 221.A first contactless charging element 210 may be connected to the platform 220, embedded in the platform 220 or otherwise included in the underwater station 200 and may be used to charge the pool cleaning robot 100 that in turn has a second contactless charging element (denoted 150 in FIGS.\",\n \"3A and 3B) to facilitate the contactless charging of the pool cleaning robot 100.FIGS.\",\n \"3A and 3B also illustrate a cable 402 that feeds the underwater station with electrical power.\",\n \"This electrical power can be supplied to the first contactless charging element 210.FIG.\",\n \"1 also illustrates a holding element such as ring 9 that can be contacted when the pool cleaning robot 100 is taken out of the pool.\",\n \"Charging a Pool Cleaning Robot using a Flow of Fluid that Induced by a Pool Fluid Circulation System A pool cleaning robot may be charged using a flow of fluid that is induced by a pool fluid circulation system.\",\n \"A turbine that is rotated by the flow of fluid can be included in the pool cleaning robot (as shown in FIGS.\",\n \"2A, 2B, 2C and 4C), can be included in an underwater station (as shown in FIG.\",\n \"4B) or can be coupled to the underwater pool cleaning robot (as shown in FIG.\",\n \"4A).\",\n \"FIG.\",\n \"2C illustrates a pool cleaning robot 100 while FIGS.\",\n \"2A and 2B illustrate the pool cleaning robot 100 as well as a portion of a pool 300 and a drain 302 of the pool according to an embodiment of the invention.\",\n \"In FIG.\",\n \"2A the pool cleaning robot 100 is near the drain 302 while in FIG.\",\n \"2B the pool cleaning robot is on top of the drain (not shown).\",\n \"FIG.\",\n \"2A also illustrates a communication module 306 for communication with the pool cleaning robot 100.Referring to FIG.\",\n \"2C—pool cleaning robot 100 includes turbine 120, housing 104, first fluid opening 101 and second fluid opening 102 formed in the housing 104, electrical generator 122, pump motor 132, impeller 133, rechargeable power source such as battery 135, drive motor 124 and first track 141.Non-limiting examples of additional and/or alternative components and modules of the pool cleaning robot 100 are illustrated in FIGS.\",\n \"18A-18H.\",\n \"The turbine 120 is positioned above a first fluid opening 101 formed at the bottom of the pool cleaning robot 100 and below second fluid opening 102.The turbine 120 is at least partially disposed within a fluid path formed between the first fluid opening 101 so as to extract energy from flow of fluid through the fluid path.\",\n \"Electrical generator 122 is arranged to provide electrical power thereto and adapted to be driven by the turbine 120.The rechargeable power source 135 is arranged to be charged by the electrical generator 122 and to supply electrical power during at least one period of time during which the turbine 120 does not extract energy from the flow of fluid.\",\n \"When positioned in proximity of the drain 302, fluid is sucked from second fluid outlet 102, through the fluid path and exits the pool cleaning robot via the first fluid opening 101 thereby rotating the turbine 120.It is noted that charging the pool cleaning robot 100 by the drain 302 is an example of charging the pool cleaning robot by a flow of fluid that is induced by a pool fluid circulation system (denoted 333 in FIG.\",\n \"20A).\",\n \"Yet for another example—pool cleaning robot may be located in proximity (or in contact with) an output of a tube (denoted 408 in FIG.\",\n \"4C) of the pool fluid circulation system.\",\n \"It is expected that the pool cleaning robot 100 needs to be relatively proximate (few centimeters till few tenths of centimeters) from an inlet or outlet of the pool fluid circulation system in order that a sufficient amount of flow of fluid is induced to flow through the fluid path and thereby rotating turbine 120.Accordingly—the charging may occur when the pool cleaning robot 100 is positioned in a certain location in which a flow level of fluid that is circulated by a pool fluid circulation system is higher than a flow level of the fluid within a majority of the pool or even be the highest flow level in the pool.\",\n \"When positioned at the certain location the fluid that is circulated by the pool fluid circulation system passes through the fluid path formed in the pool cleaning robot.\",\n \"FIG.\",\n \"4A illustrates a portion of a pool 300, a pool cleaning robot 100, an underwater station 200, a turbine 404, an electrical generator 406 that feeds the underwater station 200 with electrical power via cable 401 and a tube 408 of a pool fluid circulation system according to an embodiment of the invention.\",\n \"Turbine 404 and electrical generator 406 are submerged and do not belong to the underwater station 200 or to the pool cleaning robot 100.Tube 408 can direct a jet of fluid towards turbine 404 or may such fluid from the pool.\",\n \"Turbine has an outlet 410 for allowing fluid that is jetted by the tube 408 to enter the pool and/or to allow fluid sucked through tube 408 to enter turbine 404.FIG.\",\n \"4B illustrates a portion of a pool 300, a pool cleaning robot 100, an underwater station 200 as well as a turbine 404 and an electrical generator 406 that form a part of the underwater station 200 that feeds the underwater station according to an embodiment of the invention.\",\n \"Turbine 404 is rotated by a flow of fluid induced by tube 408 of the pool fluid circulation system.\",\n \"FIG.\",\n \"4C illustrates a portion of a pool 300, tube 408 and a pool cleaning robot 100 that includes turbine 404 and electrical generator 406 according to an embodiment of the invention.\",\n \"The turbine 404 is rotated by a flow of fluid induced by tube 408 of the pool fluid circulation system.\",\n \"This may require the pool cleaning robot to direct turbine 404 (facing one of the sides of the pool cleaning robot—but not its bottom) to be positioned near the opening of tube 408.Underwater Filter Replacement Additionally or alternatively, filters of the pool cleaning robot can be inserted to the pool cleaning robot underwater, ejected from the pool cleaning robot underwater, replaced underwater and/or processed underwater.\",\n \"The insertion and/or the ejection and/or the replacement of the filters can be executed by the robot, by an underwater station of by a combination of both.\",\n \"FIG.\",\n \"5A illustrates a pool cleaning robot 100 that includes multiple filters 170, 172 and 174 according to an embodiment of the invention.\",\n \"FIG.\",\n \"5B illustrates a bottom of a housing 104 of a pool cleaning robot 100 that includes multiple filters according to an embodiment of the invention.\",\n \"FIG.\",\n \"5C illustrates a pool cleaning robot 100 that includes a single filter 170 according to an embodiment of the invention.\",\n \"Filter 172 may be used to filter the fluid that passes through the pool cleaning robot 100—as may be regarded as being in a filtering position.\",\n \"The fluid may enter through fluid opening 117 (see FIG.\",\n \"5B).\",\n \"Filters 172 and 174 may be regarded as being in a non-filtering position.\",\n \"Alternatively—more than one of the filters 170, 172 and 174 can be used for concurrently filtering fluid that passes through the pool cleaning robot 100.Alternatively—filter 170 or filter 174 can be used for filtering while filter 172 is not be used for filtering—when positioned at the center of the pool cleaning robot 100.Filters 170, 172 and 174 may be inserted through a first filter opening 160 formed in the housing of the pool cleaning robot 100.Filters 170, 172 and 174 may be ejected (outputted) from the pool cleaning robot through the first filter opening 160 or (As illustrated in FIGS.\",\n \"5A and 5C)—through a second filter opening (denoted 162 formed in the housing of the pool cleaning robot 100).\",\n \"Between insertion and ejection the filters of FIGS.\",\n \"5A and 5C follow a linear path (delimited by rails 169) that is normal to the longitudinal axis of the pool cleaning robot.\",\n \"It is noted that other paths (non-linear, other linear paths) can be provided.\",\n \"Filter openings may be positioned in various locations of the housing—including the bottom of the housing, the upper portion of the housing or any side portions (sidewalls) of the housing.\",\n \"FIGS.\",\n \"5A-5C merely illustrates a non-limiting of the locations of such filter openings.\",\n \"FIG.\",\n \"5A also illustrates a sanitizing unit 72 that is arranged to irradiate a filter with ultraviolet radiation or perform any other sanitizing process.\",\n \"Referring to FIG.\",\n \"5C—first filter opening 160 is equipped with a first door 164 and a spring mechanism 166 that allows the first door 164 to open when a filter is inserted to the pool cleaning robot 100 and to be closed (thereby closing the first filter opening 160) after the filter is inserted.\",\n \"Second filter opening 162 is equipped with a second door 168 and a spring mechanism 169 that allows the second door 168 to open when a filter is extracted/ejected/outputted from the pool cleaning robot 100 and to be closed (thereby closing the second filter opening 162) after the filter is extracted/ejected/outputted.\",\n \"It is noted that a filter opening can be closed by the filter (or by the filter housing)—as illustrated in FIG.\",\n \"5A.\",\n \"FIG.\",\n \"6A and 6B illustrates a pool cleaning robot 100, an underwater station 200 and multiple filters 176 and 177 according to an embodiment of the invention.\",\n \"The pool cleaning robot 100 is mounted on the underwater station 200.Filters 176 are stored in a first filter storage module 272 and then fed to the pool cleaning robot 100 by a first filter manipulator that is represented by arm 261.Filters are ejected from the pool cleaning robot 100 by the first filter manipulator (if the same movement used for inserting filters can also eject filters) or by a second filter manipulator that is represented by arm 263 that pushes used filters into underwater station housing 250.FIGS.\",\n \"6A and 6B also illustrate a compressor (represented by arm 265) that compresses a used filter before the used filter enters underwater station housing 250.The underwater station 200 is further illustrated as including underwater station housing 250 and filter ejection module 240 from which used filters can be ejected or otherwise taken outside the pool.\",\n \"The underwater station 200 is illustrated as including a duct 240 through which used filters can float, ejected or taken outside the pool.\",\n \"The underwater station 200 may include processing elements located within the housing 250 (or outside the housing) for sanitizing, shredding, compressing, and/or attaching floating elements to used filters.\",\n \"FIG.\",\n \"7A-7D illustrate an underwater station 200 during various stages of a loading process of a filter into a pool cleaning robot 100 according to an embodiment of the invention.\",\n \"FIG.\",\n \"7C and 7D also illustrate the pool cleaning robot 100 that is being loaded with a filter.\",\n \"The underwater station 200 includes a filter manipulator that includes a arm 266 for elevating a filter from a filter storage module 270 that may have a radially symmetrical shape (annular, cylindrical and the like) that has multiple compartments 273 for storing multiple filters 176.The filter storage module 270 is rotated about its center by a movement module that has an axel denoted 274 for rotating the filter storage module 270 about its axis—thereby selecting a selected filter to be inserted to the pool cleaning robot 100 via an opening formed at the bottom of the housing of the pool cleaning robot.\",\n \"The selected filter is positioned in proximity to arm 266 in order to allow arm 266 to elevate the filter into the pool cleaning robot 100.FIG.\",\n \"7A illustrates a positioning of a selected filter near arm 266.Figured 7B-7C illustrates phases in the lifting process and FIG.\",\n \"7D shows the end of the lifting process.\",\n \"An opposite process may be used to extract a used filter from the pool cleaning robot 100—the arm 266 contacts the filter and lowers it to an empty compartment of the filter storage module 270.FIG.\",\n \"8 illustrates a pool cleaning robot 100 that comprises a filter manipulator 180 and multiple filters according to an embodiment of the invention.\",\n \"The filter manipulator 180 includes a filter storage module 182 that has multiple compartments for storing multiple filters.\",\n \"The filter storage module 182 may be have a radially symmetrical shape (annular, cylindrical and the like) and is rotated about its center by a movement module that has an axel denoted 184 for rotating the filter storage module 180 about its axis—thereby placing a selected filter in a filtering position.\",\n \"The entire filter storage module 182 can be manually or automatically replaced.\",\n \"The latter can be executed by an underwater station or by the pool cleaning robot itself.\",\n \"Filter having a Rotatable Core According to various embodiments of the invention there are provided filters that have filter cores that are rotatable.\",\n \"The rotation may introduce a centrifugal force that pushes compresses dirt towards the exterior of the filter and/or towards filtering elements of the filter and improves the filtering process.\",\n \"FIG.\",\n \"9 illustrates a filter 500 that includes a filter core 510, a filter core enclosure 530 and filter housing 540.It is noted that in various figures (for example FIGS.\",\n \"9, 10, 12, 13A, 13B, 14, 15, 16A, 16B) there is illustrated a gap between the filter enclosure 530 and the filter housing 540.Such a gap may not exist or otherwise fluid can be prevented from passing through the gap unfiltered and enter various parts of the pool cleaning robot.\",\n \"The filter core 510 is at least partially located within the filter housing 540 and includes one or more inlets 511, one or more outlets 513 and at least one filtering element (such as the zigzag array of filtering elements 516) that is positioned between the one or more inlets 511 and the an one or more outlets 513.The filter core enclosure 530 includes openings 532 that facilitate a flow of fluid to and from the filter core 510.The filter core enclosure 530 includes a gear 518 that meshes with another gear 550.The other gear may be rotatably connected to the filter housing 540 and is rotated by a filter core rotator (denoted 552 in FIG.\",\n \"11B).\",\n \"The filter housing 540 includes filter housing openings 542 that facilitates a flow of fluid to and from the filter core enclosure 530.FIG.\",\n \"9 illustrates a cylindrical shaped filter core enclosure and a filter housing having a cylindrical interior and a rectangular shaped exterior.\",\n \"The filter core 510, the filter enclosure 530 and the filter housing 540 can be of different shapes.\",\n \"FIG.\",\n \"9 also illustrated a perforated pole 560 that is located at the center of the filter core 510.The perforated pole 560 can be regarded as belonging to filter 500 or as not belonging to the filter 500.The perforated pole 560 can be attached to the filter 500 in a detachable or non-detachable manner.\",\n \"For example an actuator and a spring may be provided for detaching or locking the filter.\",\n \"FIG.\",\n \"10 illustrates filter 500 as having (or being connected to) a perforated pole 560 that is connected to axel 562 that has a gear 564 at its top.\",\n \"Gear 564 is rotated by another gear 554 connected to filter core rotator 552.In FIG.\",\n \"10 the filter housing 540 is not connected to gear 550 and the filter enclosure 530 does not include a gear.\",\n \"FIGS.\",\n \"11A and 11B illustrate a pool cleaning robot 100 that includes multiple filters 170, 172 and 174, a gear 550 of filter 172 that is positioned in a filtering position and is rotated by filter core rotator 552 according to an embodiment of the invention.\",\n \"FIG.\",\n \"12 illustrates filter 500 as having (or being connected to) a perforated pole 560 that is connected to axel 562 that has a gear 564 at its top.\",\n \"Gear 564 is rotated by another gear 554 connected to filter core rotator 552.The filter core rotator 552 may be a pump motor, a drive motor or be mechanically coupled to one of these motors.\",\n \"The filter core 510 can be inserted to (or extracted from) the filter housing 540.The filter housing 540 can be part of the filter and/or can be a part of the pool cleaning robot FIG.\",\n \"13A illustrates a filter 500, a gear 550, a perforated pole 560, choppers 570, and a filter core rotator 552 according to an embodiment of the invention.\",\n \"FIG.\",\n \"13B illustrates an area of filter 510 that includes choppers 570.The choppers 570 are connected to an input of the perforated pole 570 so then when the perforated core is rotated the choppers chop debris that enters the filter 500 via the perforated pole 560.The input of the perforated pole 560 can be positioned directly above an opening such as fluid opening 117 of FIG.\",\n \"5B Choppers 570 are shown as having fin like shape and are facing each other.\",\n \"There may be one or more choppers.\",\n \"Different choppers 570 can have different shapes and/or sizes.\",\n \"The choppers can be connected to the filter core or other parts of the filter.\",\n \"Choppers can be positioned at different heights of the perforated pole or filter.\",\n \"The choppers may be attached as propellers to axle 558.FIG.\",\n \"14 illustrates filter 500 as having (or being connected to) a perforated pole 560 that is connected to axel 562 that has a gear 564 at its top.\",\n \"Gear 564 is rotated by another gear 554 connected to filter core rotator 552.The filter core 510 includes filtering elements that are a fine filter element 595 and a coarse (or gross) filtering element 594 both are illustrated as being a cylindrical shaped meshes.\",\n \"Fluid from the one or more inlets of the filter are filtered by the gross filtering element 594 before being filtered by the fine filtering element 595.The gross and fine filtering elements by differ from each other by the size of particles they block.\",\n \"The gross filtering mesh may be constructed of 200 microns pore size and the fine mesh may be of 50 microns pore size.\",\n \"Other pore sizes can be provided.\",\n \"FIG.\",\n \"15 illustrates filter 500 as having (or being connected to) a perforated pole 560 that is connected to axel 562 that has a gear 564 at its top.\",\n \"Gear 564 is rotated by another gear 554 connected to filter core rotator 552.The filter 500 includes blades 577 that may be connected to various other parts of the filter 510.Additionally or alternatively the blades 577 are connected to an inner cylindrical frame (not shown) that may be parallel to the perforated pole 560, may contact the perforated pole 560, may be spaced apart from the perforated pole 560, may be connected to and/or held by the filter core enclosure 530 (for example—held by the floor, bottom and/or sidewall of the filter core enclosure).\",\n \"When the perforated pole 560 is not connected to the blades and the filter core 510 the perforated pole 560 may remain in the pool cleaning robot after ejection of the filter core 510 and accumulated dirt can be serviced efficiently and washed off the blades.\",\n \"The blades 557 may extend along the entire filter enclosure 530 and are positioned between the perforated pole 560 and the filtering element 594.The blades 577 form a rotor.\",\n \"When the filter core 510 is rotated by filter core rotator 552 these blades may cause the filter core 510 to act as a turbine and assist the flow of water into the filter core.\",\n \"Dual Mode Motor-Generator And Dual-Mode Rotor FIGS.\",\n \"16A, 17A and 17E illustrate a filter 500, a rotor 590 that functions as an impeller, a motor/generator 559 that functions as a motor for rotating the filter core 510 and the rotor 590, and an enclosure 595 not shown that surrounds the rotor and has (a) a first opening 102 located below the rotor 590 and (b) a second opening 593 that is selectively sealed by a uni-directional valve 592, according to an embodiment of the invention.\",\n \"Alternatively, the first and second openings 102 and 593 may be formed in the bottom of the pool cleaning robot 100 and the enclosure 595 may be located above the bottom in a manner that the bottom and the enclosure may provide a closed environment (except the openings 102 and 593).\",\n \"In FIG.\",\n \"16A the filter 500 is positioned between the rotor 590 and the motor/generator 559.In FIG.\",\n \"17A the rotor 590 is positioned between the filter 500 and the motor/generator 559.An axle/spindle 558 connects the motor/generator 559 to the perforated pole 560.In this mode of operation fluid is directed by the rotor to enter the filter 500 and to exit filter 500 after being filtered.\",\n \"In this mode of operation the uni-directional valve 592 seals the second opening 593.In FIG.\",\n \"17E the filter 500 (or the filter 500 and the rotor 590) can be fed to the pool cleaning robot via opening 802 formed in a bottom 803 of the pool cleaning robot.\",\n \"Once inserted in the pool cleaning robot connecting elements (such as elastic ring 801 placed in a space formed by connecting element 804 may hold the filter 500.FIGS.\",\n \"16B, 17B and 17F illustrate a filter 500, a rotor 590 that functions as a turbine, a motor/generator 559 that functions as a generator for generating electrical energy, and an enclosure 595 that surrounds the rotor and has a first opening 102 above the rotor 590 and a second opening 593 that is selectively sealed by a uni-directional valve 592, according to an embodiment of the invention.\",\n \"Alternatively, the first and second openings 102 and 593 may be formed in the bottom of the pool cleaning robot 100 and the enclosure 595 may be located above the bottom in a manner that the bottom and the enclosure may provide a closed environment (except the openings 102 and 593).\",\n \"In FIG.\",\n \"16B the filter 500 is positioned between the rotor 590 and the motor/generator 559.In FIG.\",\n \"17B the rotor 590 is positioned between the filter 500 and the motor/generator 559.In this mode fluid is sucked (for example by a drain of a pool) through second opening 593 and rotates the rotor 590 that in turn rotates motor/generator 599.The uni-directional valve 592 is open.\",\n \"In FIG.\",\n \"17F the filter 500 (or the filter 500 and the rotor 590) can be fed to the pool cleaning robot via opening 802 formed in a bottom 803 of the pool cleaning robot.\",\n \"Once inserted in the pool cleaning robot connecting elements (such as elastic ring 801 placed in a space formed by connecting element 804 may hold the filter 500.FIG.\",\n \"17C is a cross sectional view of pool cleaning robot 100 according to an embodiment of the invention.\",\n \"The pool cleaning robot 100 includes housing 104 filter 500, a rotor 590 that functions as an impeller, a motor/generator 559 that functions as a motor for rotating the filter core (part of filter 500) and the rotor 590, electrical generator 122 and turbine 120 that are spaced apart from filter 500 and are positioned above another opening of the housing.\",\n \"In this mode of operation fluid is directed by the rotor 590 to enter the filter 500 and to exit filter 500 after being filtered.\",\n \"In this mode of operation a uni-directional valve (not shown) seals the opening below turbine 120.FIG.\",\n \"17D is a cross sectional view of pool cleaning robot 100 according to an embodiment of the invention.\",\n \"The pool cleaning robot 100 includes housing 104 filter 500, a rotor 590 that functions as a turbine, a motor/generator 559 that functions as an electrical generator and the rotor 590, an electrical generator 122 and turbine 120 that are spaced apart from filter 500 and are positioned above another opening of the housing.\",\n \"The opening below the turbine 120 is opened and fluid is sucked (for example by drain 302 of a pool) through opening 102 into the pool cleaning robot and out of the pool cleaning robot to drain 302 thereby rotating the rotor 590 that in turn rotates motor/generator 599 and rotating turbine 120.Any one or a combination of the filter 500 and the rotor 590 of FIGS.\",\n \"16A, 16B, 17A, 17B, 17C, 17D, 17E and 17F can be replaced underwater (or above the water) through openings formed in the pool cleaning robot.\",\n \"This is illustrated by opening 802 formed in the bottom of the housing in FIGS.\",\n \"17E and 17F.\",\n \"The opening can be formed in sidewall of the pool cleaning robot.\",\n \"When any filter is provided into the pool cleaning robot (for example, any one of the filters illustrated in FIGS.\",\n \"5A, 5C, 6A, 6B, 7A, 7B, 7C, 7D, 12, 17E and 17F) it can be held to its position by any known fastening or holding element known in the art such as pins, blots, stripes, rails, springs and the like.\",\n \"Additionally or alternatively the opening through which the filter is inserted can close or at least partially close the opening through which the filter entered.\",\n \"For example, after a filter has been inserted from the bottom of the pool cleaning robot, it may be fastened by vertical elements that contact the upper part of the filter, the filter opening may close, the filter can be inserted into vertical or otherwise erect rails and the like.\",\n \"FIG.\",\n \"18A illustrates various components of a pool cleaning robot 100 according to an embodiment of the invention.\",\n \"The pool cleaning robot 100 is illustrated as including controller 101, drive and steering module 20, power supply module 40, fluid control module 30, sensing and communication module 50 and brushing module 90.The controller 101 is arranged to control the operation of the pool cleaning robot 100 and especially control the various modules 20, 30, 40 and 50.For example, the controller 101 may be arranged to navigate the pool cleaning robot 100 to direct the pool cleaning robot to be positioned in a certain location in which a flow level of fluid that is circulated by a pool fluid circulation system is higher than a flow level of the fluid within a majority of the pool (for example- to be in proximity to a drain of the pool), wherein when positioned at the certain location the fluid that is circulated by a pool fluid circulation system passes through a fluid path formed in the pool cleaning robot and thereby rotate a turbine.\",\n \"FIG.\",\n \"18B illustrates power supply modules 40 of a pool cleaning robot 100 according to various embodiments of the invention.\",\n \"The power supply module 40 is configured to provide electrical power to various power consuming components such as controller 101, motors, sensors, and the like.\",\n \"It may receive the electrical power or generate it.\",\n \"One power supply module 40 includes a second contactless charging element 150 and a rechargeable power source 135 (see, for example FIGS.\",\n \"3A-3B and 4A-4C).\",\n \"Another power supply module 40 includes a turbine 120, electrical generator 122 and a rechargeable power source 135 (see, for example FIGS.\",\n \"2A-2C).\",\n \"A further power supply module 40 includes a rotor 590 that acts as a turbine, a motor/generator 559 that acts as a generator and a rechargeable power source 135 (see, for example FIGS.\",\n \"16A-16B and 17A-17B).\",\n \"FIG.\",\n \"18C illustrates drive and steering modules 20 of a pool cleaning robot according to various embodiments of the invention.\",\n \"Drive and steering module 20 is arranged to move the pool cleaning robot 100.It may include one or more motors, one or more wheels or tracks and one or more transmissions that convey movements introduced by motors to the one or more wheels and/or one or more tracks.\",\n \"One drive and steering module 20 includes first drive motor 124, second drive motor 125, first transmission 127, second transmission 129, first track 141 and second track 143.Some of these components are shown in FIGS.\",\n \"1, 2A-2C, 3A-3C, 4A-4B and the like.\",\n \"The pool cleaning robot 100 may include a brushing module (denoted 90 in FIG.\",\n \"18A) that may include one or more brushing wheels such as brushing wheels 108 that are rotated (directly or indirectly) by first and second tracks 141 and 143.The direction of movement of the pool cleaning robot 100 can be controlled by individually controlling the movement of first and second tracks 141 and 143.Another drive and steering module 20 includes first drive motor 124, first transmission 127, first track 141, second track 143, brushing wheels (not shown) and steering elements 107.Steering elements 107 can include fins, imbalance introduction elements, controllable fluid jet elements and the like.\",\n \"Non-limiting examples of steering elements are provided in U.S. patent application Ser.\",\n \"No.\",\n \"14/023,544 filed Sep. 11, 2013 which is incorporated herein by reference.\",\n \"Any other steering elements known in the art can be used.\",\n \"FIG.\",\n \"18D illustrates fluid control modules 30 of a pool cleaning robot according to various embodiments of the invention.\",\n \"A fluid control module 30 is arranged to control a flow of fluid within the pool cleaning robot and to filter said fluid.\",\n \"It may include, any combination of the following: a. Impeller 133 and pump motor 132 for inducing fluid to flow through the pool cleaning robot 100 (see, for example FIG.\",\n \"2C).\",\n \"b. Rotor 590 that acts as an impeller and a motor/generator 559 that acts as a motor (see, for example, FIGS.\",\n \"16A, 16B, 17A, 17B, 17C, 17D).\",\n \"c. Filter 170, 172, 174 or 500.The filter may have, for example, a filter core 510, a filter enclosure 530 and a filter housing 540.d.\",\n \"A filter core rotating element 552 (see, for example, FIGS.\",\n \"10, 12 and 14).\",\n \"e. Filter manipulator 180 (see, for example, FIG.\",\n \"8).\",\n \"FIG.\",\n \"18E illustrates sensors of a sensing and communication module 50 of a pool cleaning robot according to various embodiments of the invention.\",\n \"The sensing and communication module 50 may include one or more of the following sensors: a.\",\n \"Underwater station radiation sensor 110 for sensing radiation from an underwater station (see, FIG.\",\n \"1).\",\n \"b. Ultrasonic transceiver 51 for sensing a flow of fluid in the pool—that is expected to be relatively high near the drain of other flow inducing elements of a pool fluid circulation system.\",\n \"c. Acoustic sensor 52 that may include an acoustic emitter and an acoustic detector to provide information about the area of the pool the pool cleaning robot 100 is passing on.\",\n \"d. Gyrocompass 53 or multiple gyrocompasses for providing directional information.\",\n \"e. Accelerometer 54.f.\",\n \"Step counter 56 for measuring movement of the pool cleaning robot.\",\n \"g. Orientation sensor 56 for sensing the orientation of the pool cleaning robot 100.h.\",\n \"Communication unit 59 for communication with the underwater station 200, or with other elements in the pool (see element 306 of FIG.\",\n \"2A) or outside the pool.\",\n \"FIG.\",\n \"18F illustrates various components of a pool cleaning robot 100 according to an embodiment of the invention.\",\n \"This is an example of combination of controller 101 and various components of the drive and steering module 20, power supply module 40, fluid control module 30, sensing and communication module 50 and brushing module 90.In FIG.\",\n \"18F the pool cleaning robot 100 includes controller 101, sensing and communication module 50, filter 170, filter manipulator 180, filter core rotating element 520, rechargeable power source 135, second contactless charging element 150, impeller 133, pump motor 132, first and second drive motors 124 and 125, first and second transmissions 127 and 129, first and second tracks 141 and 143.FIG.\",\n \"18G illustrates various components of a pool cleaning robot 100 according to an embodiment of the invention.\",\n \"In FIG.\",\n \"18G the pool cleaning robot 100 includes controller 101, sensing and communication module 50, filter 170, filter manipulator 180, rechargeable power source 135, electrical generator 122, turbine 120, impeller 133, pump motor 132, first drive motor 124, steering elements 107, first transmission 127, first and second tracks 141 and 143 and brushing module 90.FIG.\",\n \"18H illustrates various components of a pool cleaning robot 100 according to an embodiment of the invention.\",\n \"This is an example of combination of controller 101, drive and steering module 20, power supply module 40, fluid control module 30, sensing and communication module 50, brushing module 90 and a processing module 70.The processing module 70 is arranged to process filters (not shown).\",\n \"The processing module 70 may include at least one out of: sanitizing unit 72 that is arranged to irradiate a filter with ultraviolet radiation or perform any other sanitizing process, compressor 74 for compressing a used filter (for example- filter 174 of FIG.\",\n \"5A), a shredder 76 for shredding a user filter a portion of the filter (its core), and a float inducing module 78 for attaching a floating material (foam, balloon that is inflated) to a user filter and the like.\",\n \"The processing module 70 can be part of any of the pool cleaning robots illustrated in any previous figures or in any other text of the specification.\",\n \"FIG.\",\n \"19A illustrates various components of an underwater station 200 according to an embodiment of the invention.\",\n \"The underwater station 200 includes an underwater station controller 740, an underwater station filter manipulation module 760, a sensing and communication module 720, a power supply module 207, and an underwater processing module 700.The underwater station controller 740 controls the various modules of the underwater station 200.It can, for example, use information from sensing and communication module 720 for sensing when a pool cleaning robot is positioned within a charging range from a first contactless charging element and control a provision of power to said first contactless charging element.\",\n \"It may initiate, control and stop a filter insertion process to a pool cleaning robot and/or a filter ejection process from a pool cleaning robot and the like.\",\n \"The sensing and communication module 720 may include one or more sensors for sensing the location of the pool cleaning robot 100, the status of various operations (processing filters, feeding or extracting filters) and the like.\",\n \"This information may be fed to the underwater station controller 740.This module communicates with the pool cleaning robot or other devices in or outside the pool.\",\n \"The power supply module 207 supplies power to the various modules of the underwater station 200 and may also feed (in a contactless or a contact based manner) a pool cleaning robot.\",\n \"The underwater processing module 700 may perform at least one out of: sanitizing of pre-used or used filters, compressing used filters, shredding user filters attaching a floating material (foam, balloon that is inflated) to a user filters and the like.\",\n \"FIG.\",\n \"19B illustrates various components of an underwater station 200 according to an embodiment of the invention.\",\n \"This figure illustrates multiple components per each module of the underwater station 200.Any combination of any components can be provided.\",\n \"The underwater station filter manipulation module 760 may include at least one out of a. In-housing manipulator 711 for manipulating filters within housing 250.b.\",\n \"Filter manipulators such as 260, 262 and 264.Each may include movement modules (261, 263, 265 and 275) and storage modules (272 and 270).\",\n \"i. Filter manipulator 260 is arranged to store and manipulate pre-used filters (including inserting the pre-used filters to a pool cleaning robot 100, providing and/or arranging filters to/within filter storage module 272, ejecting filters from a pool cleaning robot (see, arm 261 of FIGS.\",\n \"6A and 6B).\",\n \"ii.\",\n \"Filter manipulator 262 is arranged to store and manipulate used-filters (extract from pool cleaning robot, direct used filter towards housing and/or compressor or other processing element).\",\n \"See, for example, FIGS.\",\n \"6A-6B.\",\n \"iii.\",\n \"Filter manipulator 264 is arranged to store and manipulate filters.\",\n \"See, for example, FIGS.\",\n \"7A-7D.\",\n \"The sensing and communication module 720 may include at least one out of weight sensor 721, ultrasonic transceiver 722, proximity sensor 723, cleanliness sensor 724 and communication unit 725.The sensors 721, 722, 723 are arranged to sense the location of a pool cleaning robot 100 and/or evaluate wherein the pool cleaning robot is positioned in a docking position in which it can be charged and/or receive or extract filters.\",\n \"Cleanliness filter 724 may sense the cleanliness of pre-used filters and/or used filters.\",\n \"It may indicate that an extracted filter is clean enough to be used and cause the controller 740 to control a process of returning the used filter to the pool cleaning robot 100 via one of the filter manipulators.\",\n \"The communication unit 725 may be arranged to communicate with the pool cleaning robot or other devices in or outside the pool.\",\n \"It may include, for example radiation sources 241 and 242 of FIG.\",\n \"1.The power supply module 207 may include at least one of the following: a.\",\n \"Electrical cable 402 (FIG.\",\n \"3A).\",\n \"b.\",\n \"Turbine 404 (FIG.\",\n \"4B).\",\n \"c. Electrical generator 406 (FIG.\",\n \"2B).\",\n \"d. Rechargeable power source 405.e.\",\n \"First contactless charging element (such as a coil) 210 (see FIG.\",\n \"1).\",\n \"The underwater processing module 700 may include at least one of the following: a. Ejector 707 for ejecting used filters from the underwater station 200.b.\",\n \"Floater 709 for attaching or otherwise associating a used filter with floating materials (foam, inflated balloon).\",\n \"c. Compressor 701 and/or 265 (see FIGS.\",\n \"6A-6B).\",\n \"d. Shredder 703.e.\",\n \"Sanitizer 705.FIG.\",\n \"20A illustrates a pool 300, a pool cleaning robot 100 and a pool fluid circulation system that includes drain 302, fluid pipes 304, filter 330, temperature control unit 320 and circulating pump 310 and tube 408.Any type of pool fluid circulation system can be utilized for the purposes of this invention.\",\n \"A pool can be regarded as a swimming pool, any type of pool or any type of vessel, container, enclosure that may contain fluid.\",\n \"Any combination of any components of any pool cleaning robot illustrated in any of the figures may be provided.\",\n \"Any reference to any pool cleaning robot is applied mutatis mutandis to a method for operating the pool cleaning robot.\",\n \"Any combination of any components of any underwater systems can be provided.\",\n \"Any reference to any underwater system is applied mutatis mutandis to a method for operating the pool cleaning robot.\",\n \"FIG.\",\n \"21 illustrates method 400 according to an embodiment of the invention.\",\n \"Method 400 is autonomous operation.\",\n \"Method 400 includes step 410 of performing, by at least one of a pool cleaning robot and an underwater station, in an autonomous manner at least one out of pool cleaning robot filter replacement and pool cleaning robot charging.\",\n \"The term autonomous may mean without human intervention.\",\n \"The pool cleaning robot charging is applied on a pool cleaning robot that is not constantly connected to a cord that extends outside the pool and constantly supplies to the pool cleaning robot electrical energy or supplied to the pool cleaning robot a constant a flow of fluid.\",\n \"For example, executing the process at least partially illustrated in any one of FIGS.\",\n \"1, 2A, 2B, 2C, 3A, 3B, 4A, 4B may amount to performing in an autonomous manner a pool cleaning robot charging.\",\n \"Yet for another example, executing the process at least partially illustrated in any one of FIGS.\",\n \"6A, 6B, 7A, 7B, 7C, 7D, 8 and 12 may amount to performing in an autonomous manner a pool cleaning robot filter replacement.\",\n \"FIG.\",\n \"22 illustrates method 500 according to an embodiment of the invention.\",\n \"Method 500 includes stage 510 of filtering fluid by a pool cleaning robot by using a filter that fulfils at least one of the following: (i) it has a filter core that is rotated by a filter core rotator when the filter applied a filtering operation, (ii) is positioned in a filtering position while at least one other filter of the pool cleaning robot is positioned within the pool cleaning robot in a non-filtering position, (iii) is positioned in a filtering position when the pool cleaning robot and by a filter manipulator.\",\n \"For example, the filtering can be executed by any one of the filters illustrated in FIGS.\",\n \"5A, 5C, 6A, 6B, 7A, 7B, 7C, 7D, 8, 9, 10, 11A, 11B, 12, 13A, 13B, 16A, 16B, 17A-17F.\",\n \"Moreover, the terms “front,” “back,” “top,” “bottom,” “over,” “under” and the like in the description and in the claims, if any, are used for descriptive purposes and not necessarily for describing permanent relative positions.\",\n \"It is understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in other orientations than those illustrated or otherwise described herein.\",\n \"Those skilled in the art will recognize that the boundaries between logic blocks are merely illustrative and that alternative embodiments may merge logic blocks or circuit elements or impose an alternate decomposition of functionality upon various logic blocks or circuit elements.\",\n \"Thus, it is to be understood that the architectures depicted herein are merely exemplary, and that in fact many other architectures may be implemented which achieve the same functionality.\",\n \"Any arrangement of components to achieve the same functionality is effectively “associated” such that the desired functionality is achieved.\",\n \"Hence, any two components herein combined to achieve a particular functionality may be seen as “associated with” each other such that the desired functionality is achieved, irrespective of architectures or intermedial components.\",\n \"Likewise, any two components so associated can also be viewed as being “operably connected,” or “operably coupled,” to each other to achieve the desired functionality.\",\n \"Furthermore, those skilled in the art will recognize that boundaries between the above described operations merely illustrative.\",\n \"The multiple operations may be combined into a single operation, a single operation may be distributed in additional operations and operations may be executed at least partially overlapping in time.\",\n \"Moreover, alternative embodiments may include multiple instances of a particular operation, and the order of operations may be altered in various other embodiments.\",\n \"Also for example, in one embodiment, the illustrated examples may be implemented as circuitry located on a single integrated circuit or within a same device.\",\n \"Alternatively, the examples may be implemented as any number of separate integrated circuits or separate devices interconnected with each other in a suitable manner.\",\n \"Also for example, the examples, or portions thereof, may implemented as soft or code representations of physical circuitry or of logical representations convertible into physical circuitry, such as in a hardware description language of any appropriate type.\",\n \"However, other modifications, variations and alternatives are also possible.\",\n \"The specifications and drawings are, accordingly, to be regarded in an illustrative rather than in a restrictive sense.\",\n \"In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.\",\n \"The word ‘comprising’ does not exclude the presence of other elements or steps then those listed in a claim.\",\n \"Furthermore, the terms “a” or “an,” as used herein, are defined as one or more than one.\",\n \"Also, the use of introductory phrases such as “at least one” and “one or more” in the claims should not be construed to imply that the introduction of another claim element by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim element to inventions containing only one such element, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an.” The same holds true for the use of definite articles.\",\n \"Unless stated otherwise, terms such as “first” and “second” are used to arbitrarily distinguish between the elements such terms describe.\",\n \"Thus, these terms are not necessarily intended to indicate temporal or other prioritization of such elements.\",\n \"The mere fact that certain measures are recited in mutually different claims does not indicate that a combination of these measures cannot be used to advantage.\",\n \"While certain features of the invention have been illustrated and described herein, many modifications, substitutions, changes, and equivalents will now occur to those of ordinary skill in the art.\",\n \"It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.\",\n \"Those skilled in the art to which this invention pertains will readily appreciate that numerous changes, variations and modifications can be made without departing from the scope of the invention mutatis mutandis.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870956"}}},{"rowIdx":4493685,"cells":{"text":{"kind":"list like","value":[["Towable Watercraft With Flight Control","A towable watercraft including a body member capable of accommodating a rider's torso such that the rider's legs extend beyond an aft portion of the body member is disclosed.","A tail portion extending from the aft portion of the body member includes two foot-accommodating stirrups spaced apart from each other and spaced apart from the rearward portion of the body member.","Under tow and in flight, the watercraft is controllable by configuration of the tail portion upon movement of the rider's legs when the riders' feet are disposed in the stirrups."],["1.A towable watercraft for a human rider, the towable watercraft comprising: an inflatable body member having a top side, a front portion, a rearward portion, and opposite lateral portions located between the front portion and the rearward portion, the body member capable of accommodating a rider's torso on the top side such that the rider's legs extend beyond the rearward portion of the body member; a tow-rope hitch coupled to the body member; a flexible wedge-shaped web having a first end portion coupled to the rearward portion of the body member, the web having a second end portion extending away from the body member, a width of the first end portion of the web more narrow width than a width of the second end portion of the web; two foot-accommodating open-ended boots coupled in spaced apart relation to the second end portion of the web, each open-ended boot spaced apart from the body member and capable of accommodating the rider's foot when the rider's legs extend beyond the rearward portion of the body member, wherein, when under tow, the watercraft is an airfoil controllable in flight by configuration of the web upon movement of the rider's legs when the riders' feet are disposed in the open-ended boots.","2.The towable watercraft of claim 1, wherein the body member includes winglet portions extending from the opposite lateral portions.","3.The towable watercraft of claim 2, wherein the body member is covered by a nylon sheath.","4.The towable watercraft of claim 1, the open-ended boots are adjustably coupled to the web wherein a spacing between the open-ended boots and the body member is adjustable.","5.The towable watercraft of claim 1, wherein the web is coupled to the body member by at least one articulating point.","6.The towable watercraft of claim 1, wherein the web includes elongated members disposed along opposite lateral sides thereof, and each open-ended boot is coupled to a corresponding elongated member.","7.The towable watercraft of claim 6, wherein each elongated member is coupled to the body member.","8.The towable watercraft of claim 7 further comprising a retaining member interconnecting each elongated member to the body member.","9.The towable watercraft of claim 1, wherein the two foot-accommodating open-ended boots are movable toward and away from each other upon upon movement of the rider's legs when the riders' feet are disposed in the open-ended boots.","10.A towable watercraft comprising: a body member having a front portion, a rearward portion, and opposite lateral portions located between the front portion and the rearward portion, a tow-rope hitch coupled to the body member; a tail portion extending from the rearward portion of the body member, the tail portion flexible relative to the body member; two foot-accommodating stirrups coupled to an end portion of the tail portion, the two foot-accommodating stirrups spaced apart from each other and spaced apart from the rearward portion of the body member; wherein, when under tow and in flight, the watercraft is controllable by configuration of the tail portion upon movement of the foot-accommodating stirrups.","11.The towable watercraft of claim 10, the tail portion is a wedge-shaped member wherein a width of the tail portion near the body member is greater than a width of the tail portion near the foot-accommodating stirrups.","12.The towable watercraft of claim 11, wherein the two foot-accommodating stirrups are movable toward and away from each other and wherein the tail portion is movable relative to the body member.","13.The towable watercraft of claim 11, wherein each foot-accommodating stirrup is part of an open-ended boot.","14.The towable watercraft of claim 11, wherein the body member is an inflatable member covered by a nylon sheath.","15.The towable watercraft of claim 14, wherein the body member includes winglet portions extending from the opposite lateral portions.","16.The towable watercraft of claim 11 further comprising two elongated members, each elongated member having a first end coupled to the body member in spaced apart relation, the tail portion includes a flexible web interconnecting the two elongated members, each of the two foot-accommodating stirrups coupled to a second end portion of a correspond elongated member.","17.A towable water craft comprising: a body member having an airfoil portion including a leading portion and a trailing portion, the body member having an unassembled flexible tail portion extending from the trailing portion of the airfoil; a tow-rope hitch coupled to the leading portion of the body member; two foot-accommodating stirrups coupled to the flexible tail portion in spaced apart relation, the two foot-accommodating stirrups spaced apart from the trailing portion of the airfoil; wherein, when under tow, the watercraft is controllable in flight by configuration of the flexible tail portion upon movement of the foot-accommodating stirrups.","18.The towable watercraft of claim 17, the flexible tail portion is a wedge-shaped member wherein a width of the flexible tail portion near the airfoil portion is greater than a width of the flexible tail portion near the foot-accommodating stirrups.","19.The towable watercraft of claim 17, wherein at least the airfoil portion of the body member is inflatable.","20.The towable watercraft of claim 19, wherein the two foot-accommodating stirrups are movable toward and away from each other and wherein the tail portion is movable relative to the body member."],[" BACKGROUND Towable recreational watercraft are known generally and are typically towed across the water by a towline fastened to a moving object like a power boat.","Such watercraft have been embodied as an inner tube or inflatable body member having a towline fastened to a front portion thereof.","It's also known to cover the body member with a durable nylon material, to which a towline hitch and handles are fastened.","It is also known to tow such watercraft and other devices over snow with a snow machine.","In use, recreational watercraft accommodate one or more human riders in a seated or prone position.","When known watercraft are towed behind a power boat the watercraft may become unstable and tip from one side or the other when crossing a wake drawn behind the boat.","Windswept waves or waves caused by other boats may also cause the watercraft to tip.","There is also a tendency for such watercraft to tip or overturn when towed along a curved path, for example when towed by a power boat negotiating a tight turn.","The tendency to tip while negotiating a turn exists irrespective of the calmness of the water and is aggravated when turning in the presence of waves.","Some towable watercraft are capable of generating lift and flying above the water when towed sufficiently fast.","But such flying watercraft tend to be unstable in flight and permit little or no rider control.","The objects, features, and advantages of the disclosure will be evident from the following description of one or more embodiments herein, with reference to the accompanying drawings."],[" BRIEF DESCRIPTION OF DRAWINGS FIG.","1 is a plan view of a towable recreational craft.","FIG.","2 is a side view of a towable recreational craft.","FIG.","3 is a plan view of a stabilizing member.","FIG.","4 is a side view of a stabilizing member.","FIG.","5 is a plan view of another stabilizing member.","FIG.","6 is a perspective view of another stabilizing member.","FIG.","7 is a perspective view of another stabilizing member.","FIG.","8 is a perspective view of another stabilizing member.","FIG.","9 is a side view of another stabilizing member.","FIG.","10 is an end view of FIG.","9 .","FIG.","11 is a plan view of a towable recreational craft with a rider.","detailed-description description=\"Detailed Description\" end=\"lead\"?"],["REFERENCE TO RELATED APPLICATIONS The present application is a continuation-in-part of co-pending U.S. application Ser.","No.","14/698,783 filed on 28 Apr.","2015 entitled “Towable Recreational Craft”, now U.S. Pat.","No.","______, from which priority is claimed under 35 U.S.C.","120, the contents of which are incorporated by reference herein.","FIELD OF THE DISCLOSURE The present disclosure relates generally to towable recreational craft accommodating one or more riders and more particularly to towable water craft having improved flight control.","BACKGROUND Towable recreational watercraft are known generally and are typically towed across the water by a towline fastened to a moving object like a power boat.","Such watercraft have been embodied as an inner tube or inflatable body member having a towline fastened to a front portion thereof.","It's also known to cover the body member with a durable nylon material, to which a towline hitch and handles are fastened.","It is also known to tow such watercraft and other devices over snow with a snow machine.","In use, recreational watercraft accommodate one or more human riders in a seated or prone position.","When known watercraft are towed behind a power boat the watercraft may become unstable and tip from one side or the other when crossing a wake drawn behind the boat.","Windswept waves or waves caused by other boats may also cause the watercraft to tip.","There is also a tendency for such watercraft to tip or overturn when towed along a curved path, for example when towed by a power boat negotiating a tight turn.","The tendency to tip while negotiating a turn exists irrespective of the calmness of the water and is aggravated when turning in the presence of waves.","Some towable watercraft are capable of generating lift and flying above the water when towed sufficiently fast.","But such flying watercraft tend to be unstable in flight and permit little or no rider control.","The objects, features, and advantages of the disclosure will be evident from the following description of one or more embodiments herein, with reference to the accompanying drawings.","BRIEF DESCRIPTION OF DRAWINGS FIG.","1 is a plan view of a towable recreational craft.","FIG.","2 is a side view of a towable recreational craft.","FIG.","3 is a plan view of a stabilizing member.","FIG.","4 is a side view of a stabilizing member.","FIG.","5 is a plan view of another stabilizing member.","FIG.","6 is a perspective view of another stabilizing member.","FIG.","7 is a perspective view of another stabilizing member.","FIG.","8 is a perspective view of another stabilizing member.","FIG.","9 is a side view of another stabilizing member.","FIG.","10 is an end view of FIG.","9.FIG.","11 is a plan view of a towable recreational craft with a rider.","DETAILED DESCRIPTION While the drawings illustrate various aspects of the disclosure, the elements of the various figures are not necessarily drawn to scale.","The size, shape and dimensions of some portions, features, components and/or regions of the drawings may be disproportionate to provide clarity or to better convey or illustrate what is described herein.","FIG.","1 illustrates a towable recreational craft 100 comprising a body member 110 having a top side 102, an opposite bottom side 104, a front portion 106, and a rearward portion 108.The recreational craft could be towed across water or snow.","As shown, the body member has opposite lateral portions 110, 112 disposed between the front portion 106 and the aft or rearward portion 108.The body member may comprise a buoyant or semi-buoyant material.","The body member may be embodied as an inflatable device like a tyre inner tube or inflatable device, which may have a variety of different shapes.","An inflatable body member may be embodied as an inflatable rubber, polyvinyl chloride (PVC) or other suitable natural or synthetic material.","Alternatively, the body member may be embodied as a non-inflatable device like a closed-cell extruded polystyrene material (e.g., Styrofoam) or some other non-inflatable buoyant or semi-buoyant material.","Various other natural or synthetic materials may also be used for the body member.","The craft may include a hitch to which a towline is fastened.","In FIG.","1, a hitch 107 is fastened to the front portion of the body member.","In other embodiments, the towline is tied directly to the body member or fastened to a net disposed about the body member to distribute pulling forces applied thereto.","The illustrated body member has a generally circular shape when viewed from the top or bottom.","In other embodiments, the body member could have most any other shape.","Such other shapes include but are not limited to an oblong or oval, rectangular, triangular, square or some other polygon or quasi-polygonal shape.","Generally, the surfaces of the top and bottom sides of the body member may be flat or non-flat.","For example, the bottom side surface could be convex or concave.","The body member may also have a central keel or one or more fins or skegs extending from the bottom side thereof for directional stability.","The fins or skegs may be disposed laterally or along the centerline.","In some embodiments, the fins or skegs are adjustably retractable.","Whether the bottom side surface is concave or convex may have some bearing on the placement of any fins or skegs.","The top side surface of the body member is generally configured to accommodate one or more riders in the prone position with legs and feet extending from the aft and lateral portions of the body member.","Thus the top surface may have a flat, convex, or concave configuration.","In one particular embodiment, the top surface has a somewhat concave recess extending between the front and rearward portions of the body member.","In another embodiment, the top surface has two or more generally side-by-side concave recessed portions for accommodating two side-by-side riders.","A centerline of the concave recesses may be parallel or divergent toward the rearward portion of the body member.","In one embodiment the inflatable or non-inflatable body member is covered with another material like nylon or PVC or some other material.","For example, the body member may be encapsulated by a nylon or neoprene sheath, or a plastic shell or some other material.","FIG.","1 shows a portion of the sheath or shell 111 removed from the body member.","The body member may also be covered by a combination of these and other materials.","A sheath-type covering may include an opening through which to accommodate the body member.","Such an opening may be securely closeable with a zipper, or buttons, or by mating hook and loop straps like Velcro, or by some other secure fastening mechanism.","The opening in the sheath may be relatively small to accommodate an inflatable body member, but the opening could be relatively large to accommodate a non-inflatable body member.","Alternatively, a shell-type covering may be fastened to, or integrally formed about, the body member.","For example, a non-inflatable body member may include a shell made of plastic or some other durable material fastened thereto by an adhesive or by separate molding operations or by other means.","Alternatively, the body member has no such covering.","The materials selected will depend on consideration of the intended use or application of the craft.","For applications where the craft is towed over snow, for example, materials having less frictional drag may be advantageous.","In some applications however some drag may be desirable for directional stability.","In some embodiments, the body member includes a handle disposed at or near the front portion thereof for grasping by a rider.","The handle could take many forms.","For example, there could be a single elongated handle for grasping by one or more riders.","Alternatively, the handle could be embodied as a pair of handles, one for grasping by each hand of the rider.","FIG.","1 illustrates the body member having two sets of handles 113, 114 on the top side near the front portion.","In this embodiment, each pair of handles accommodates a corresponding one of two riders in a prone position.","In embodiments where the body member includes a sheath, the handles may be embodied as straps sewn, riveted or otherwise fastened to the sheath.","Alternatively, the one or more handles may be embodied as an integral part of the body member or a plastic shell thereof.","For example, such handles could be formed as a unitary part of the body member by a molding process or by some other process.","In embodiments devoid of a sheath or shell covering the buoyant body member, the one or more handles may be fastened directly to the body member.","In other embodiments, the watercraft is devoid of handles, wherein the rider merely grasps a front portion of the body member with his or her arms.","In one embodiment, the body member includes one or more stabilizing members movably coupled thereto.","The stabilizing member extends generally away from the body member and is movable between a position extending away from the rearward portion of the body member and a position extending away from one or both the lateral portions of the body member.","Each stabilizing member includes a foot-accommodating portion spaced apart from the body member.","In operation, a rider assumes a prone position on the top side of the body member with the rider's legs extending from the rearward portion thereof.","The rider is positioned to grasp the recreational craft with his or her hands or arms as discussed above.","One or both of the rider's feet are disposed in a foot-accommodating portion of the one or more stabilizing members.","For the case where there are two stabilizing members, each foot is disposed in a foot-accommodating member of a corresponding stabilizing member.","The articulating nature of the stabilizing members allows the user's legs to move independently between the aft position and the lateral sides 110, 112 of the body member thereby providing improved stability as the recreational craft is towed across the water or snow as shown in FIG.","11.The positioning of the rider's leg or legs toward the lateral portion of the body member will reduce the likelihood that the body member will tip, for example while negotiating a turn or rough water.","For the case where there is a single stabilizing member, the foot accommodating member may be sized to accommodate both feet of the rider.","The articulating nature of the single stabilizing member allows the rider's legs to move in unison from side to side, thereby providing stability as the craft is towed across the water or snow.","Alternatively, the the rider could alternate which foot is disposed in the foot-accommodating portion of the single stabilizing member depending on which side of the body member the rider wants to position the stabilizing member for stability, while allowing the other leg to extend from the aft portion of the body member.","In one embodiment, the one or more stabilizing members include a directional guiding member extending from a bottom side thereof.","The stabilizing member is disposed a sufficient distance from the body member to allow the directional guiding member to extend into the water or snow and to provide rudder-like functionality as the craft is towed.","The directional guiding member could be part of the foot-accommodating member or a discrete member separate therefrom.","In either case, the directional guiding member is maintained in the water or snow by downward pressure from the rider's foot disposed in the foot-accommodating portion of the stabilizing member.","Thus the directional guiding member provides the rider a measure of control over the direction of the craft.","In FIG.","1, the body member includes two pair of stabilizing members extending from the aft portion of the body member.","In this embodiment, the first pair of stabilizing members 120 accommodates one rider and the second pair of stabilizing members 122 accommodates an adjacent rider.","The pairs of stabilizing member 120, 122 are shown disposed symmetrically about a centerline of the body member.","In another embodiment, only a single pair of stabilizing members, for example, members 121, 123 in FIG.","1, are disposed symmetrically about the centerline to accommodate a single rider.","In another embodiment, a single stabilizing member, not shown, extends from the aft portion of the body member to accommodate a single rider as discussed above.","The one or more stabilizing members are movably fastened to corresponding retaining members formed in or fastened to the body member.","In FIG.","1, the stabilizing member is embodied as a strap fastened to a retaining member 124 embodied as a ring or rectangular or D-shaped member fastened to the body member by an anchor 126.In this embodiment, the one side of the retaining member is captured by the anchor 126 and the other side of the retaining member retains the stabilizing member.","A curved shape retaining member may better accommodate articulation of the stabilizing member.","In one embodiment, the one or more stabilizing member are embodied as straps formed of a nylon material.","In some applications the stabilizing strap is strengthened with a carbon fiber cloth or other reinforcing material captured between layers of the strap.","The stabilizing strap may be fastened to the retaining member (e.g., the D-shaped member) by forming a loop that captures the retaining member upon sewing or riveting or otherwise fastening together mating portions of the strap.","In FIG.","1, the one or more anchors 126 are fastened directly to, or formed integrally with, the body member.","In embodiments where the body member includes an outer sheath, the anchors and sheath may constitute a unitary member.","Alternatively, the anchors may be discrete parts that are sewn, riveted or otherwise fastened to the sheath.","In some applications the anchor is strengthened with a carbon fiber cloth or other reinforcing material captured between layers of the anchor and between layers of the sheath at least in the region where the anchor is fastened thereto.","Alternatively, the stabilizing strap may be attached directly to the sheath without the intermediate retaining member.","In other embodiments, the retaining members are integrally formed with the body member.","For example, the retaining members may be formed as part of the body member, or as part of a body member shell, in a molding or other forming operation.","In other embodiments, the stabilizing member may have other forms.","For example, the stabilizing member could be embodied as a cord with one end fastened to the body member wherein the other end fastened is fastened to, or is integrally formed with, a foot accommodating portion.","The cord could be made of nylon or some other material with suitable tensile strength.","The cord could be rigid or flexible.","A rigid cord would require a movable coupling to the body member, for example with a retaining ring.","A flexible cord could be anchored directly to the body member without the need for an intermediate retaining member.","Various other mechanisms and materials may be employed to form the one or more stabilizing members and to fasten them to the body member or to a sheath or covering disposed about the body member.","In one embodiment, the foot-accommodating member comprises a stirrup into which the user's foot is disposed.","FIG.","3 is plan view of a stabilizing member portion 302 embodied as a strap having a stirrup 304 fastened to an end thereof.","The stirrup has a relatively flat portion 305 that supports the user's foot.","FIG.","4 is side view of a stabilizing member portion 402 embodied as a strap looped through a stirrup 404.The strap has mating portions stitched, riveted or otherwise fastened together to capture the stirrup.","FIG.","4 shows the foot support 405 having increased surface area to more comfortably accommodate the user's foot.","In one embodiment, the stabilizing member is made of nylon, or a carbon fiber reinforced material or other suitably strong material.","FIG.","5 illustrates a stabilizing member embodied as a strap 502 including an open loop 504 formed at the distal end thereof into which the user's foot may be disposed.","In embodiments where the strap comprises a flexible material like nylon, a rigid member 506 may be embedded between layers of material to provide greater rigidity to the stirrup and to reduce a tendency of the non-rigid stirrup to clamp the user's foot when under load.","The stirrup of FIGS.","3 and 4 may be made of plastic, carbon fiber or some other material having suitable strength, durability and water resistance.","In FIG.","6, the stabilizing member is embodied as a cord 602 with a stirrup 604 disposed at the distal end thereof.","The stabilizing member and stirrup may constitute a unitary member or the stirrup may be a discrete part fastened to the stabilizing member.","In FIG.","7, the stirrup is part of a foot-accommodating pocket 702 protruding from a bottom side of the stabilizing member 703.The pocket is accessible via an opening 704 on a top side of the stabilizing member.","In FIG.","7, the pocket is a open-ended boot-like member formed integrally with, or fastened to, the stabilizing member.","A toe portion of the pocket may be fully or partially closed to fully or partially protect the user's feet.","For aquatic applications, a closed-ended boot may have one or more holes to permit fluid drainage while still providing substantial foot protection.","In one embodiment, the pocket is a non-rigid material, like nylon, that is integrally formed with a stabilizing member comprising the same or similar material.","For example, the pocket could be formed integrally with a strap portion of the stabilizing member.","Alternatively, the boot could be formed of a rigid or semi-rigid material like plastic, or rubber, or some other suitable material that is fastened to the stabilizing member.","In one embodiment, the boot has a relatively rigid outer shell with a softer inner lining for greater comfort.","The inner lining could be formed of foam rubber or some other suitable material.","In one embodiment, a plastic boot is sewn, riveted or otherwise fastened to a strap-shaped stabilizing member.","FIG.","6 illustrates the stirrup fastened to a cord wherein the stirrup has a fully or partially closed end portion 606.The cord could be flexible or rigid.","If the stabilizing member is inflexible, then it could be movably coupled to the body member by a retaining member to permit articulation as discussed herein.","In one embodiment, the foot-accommodating portion is adjustably spaced apart from the body member.","An adjustable foot-accommodating portion accommodates different sized riders and it accommodates different positioning of the rider on the body member.","In one embodiment, shown in FIG.","3, adjustment is provided for a strap-like stabilizing member using an adjustable tension buckle 306 disposed between the foot-accommodating portion and the body member.","In this embodiment, the strap is looped through a retaining member and threaded through the adjustable tension buckle, wherein the strap length is adjustable by feeding more or less strap through the buckle.","Such a buckle could be implemented in the embodiments of FIG.","3 and FIG.","7.In another embodiment, adjustment is provided by a plurality of foot-accommodating portions spaced apart along the stabilizing member at different locations from the body member wherein the rider could utilize the foot-accommodating member at the most appropriate distance from the body member.","For example, multiple stirrups could be linked together with intervening strap portions as shown in broken lines in FIG.","3.Similarly adjustment could be provided with multiple pockets arranged in series along the stabilizing member of FIG.","7.In the alternative embodiment of FIG.","8, adjustability is provided by an open-ended rigid or semi-rigid boot 802 removably disposed in any one of several openings 804, 806 or 808 formed along the stabilizing member.","The boot could be retained in the opening by friction fit or by Velcro or by clamping a portion of the stabilizing member between a flange of the boot and a mating ring or strip or material.","The ring or material strip could be fastened to the flange using removable bolts or other fasteners.","In one embodiment, an outer portion of the boot constitutes the directional guiding member extending from the stabilizing member.","FIG.","9 illustrates the boot 902 having a fin shaped portion 903.The fin provides the rider with a measure of control over how the stabilizing member and to some extent the body member track over the snow or water.","Alternatively, the directional guiding member may be a discrete member spaced separate and apart from the boot, for example toward a distal end of the stabilizing member away from the body member.","In some embodiments, drag produced by the boot is reduced by providing an elongated tapered portion 904 (shown in broken lines) extending from the boot toward the body member.","The tapered portion may be an integral part of the boot or the tapered portion may be a separate part that is fastened to the boot and or the stabilizing member.","The tapered portion could also be an integral part of the stabilizing member or the tapered portions could be formed unitarily with the stabilizing member.","In some embodiments, one or more winglets extend laterally from a lower portion of a boot.","The one or more winglets are used mostly for aquatic applications and are optional.","The winglets are positioned to remain under water, enabling the rider to better maintain the boot or stabilizing member in the water.","In one embodiment, a single winglet extends from an aft portion of a lower part of the boot.","The winglet may also extend from lateral sides or an aft portion of the fin or directional guiding member.","FIG.","9 also illustrates the directional guiding member including laterally extending winglets 906.FIG.","10 is a front view of the boot 902 having a fin-shaped portion 903 as shown in FIG.","9.The fin and winglets can be embodied as separate accessories fastened to the boot or directional guiding member or the one or more winglets can be an integral part of the fin or the boot or both.","In some towable watercraft embodiments, the watercraft functions as an airfoil that generates lift when towed by a tow-line drawn by a motor boat or some other towing mechanism.","At sufficient speed, the watercraft and rider will take flight like a kite.","Increasing the size (e.g., diameter) of the body member will decrease the speed at which the body member will generate lift.","In FIG.","11, the body member includes optional winglet portions show in broken lines extending from the lateral portions of the body member.","The winglet portions improve lift and stability during flight.","The winglet portions may be an integral unassembled part of the body member or the winglet portions and body member may form an assembly.","In other embodiments, the winged-body member may resemble an archetypal wing.","In one implementation, the body member with winglet portions or other wing is a unitary inflatable member, which may be covered with a nylon material as described herein.","Alternatively, the winged-body member is formed of a non-inflatable buoyant material as described herein.","In FIG.","11, the body member is capable of accommodating a rider's torso on a top side thereof such that the rider's legs extend beyond the aft portion of the body member.","In some embodiments where an inflatable body member functions as an airfoil, a spacing between the handles (e.g., handles 113 and 114 in FIG.","1) may be increased so that the handles are spaced laterally toward the lateral edges of the body member (e.g., toward the winglet tips).","Such spacing provides increased leverage for the rider to deform portions of the body member (e.g., the winglet portions) thereby providing a measure of control over the watercraft in flight.","The body member may also include a crease along which flexing may occur to facilitate deformation of each winglets by the user.","In FIG.","11, the crease may be disposed toward of tips of the winglet portions and the handles may be located outwardly of the creases thereby enabling the rider to bend the winglet portions up or down along the crease.","In some embodiments in which the towable watercraft functions as an airfoil, a configurable tail portion extends from the aft portion of the body member.","In one form, the tail portion has a wedge shape with a relatively narrow width near the body member and a greater width farther away from the body member.","In FIG.","11, the flexible tail portion of this alternative embodiment is shown in broken lines between the elongated members to which the stirrups are coupled.","The flexible tail portion may be an unassembled integral part of the body member or it may be part of an assembly.","In one implementation, the flexible tail portion is embodied as a wedge-shaped web having an end portion with a relatively narrow width coupled to the body member and a relatively wide portion extending away from the body member.","The web is coupled to the body member by at least one point.","Coupling the web to the body member at multiple points will distribute the load over a greater area thereby reducing wear at the assembly interface.","The flexible tail may be coupled to the body member at one or more points using corresponding articulating retaining members, examples of which are described herein in connection with coupling the elongated members 121 and 123 to the body member.","In some embodiments, the web includes elongated members disposed along opposite lateral sides thereof as shown in FIG.","11.The elongated members may be embodied as straps or other materials described herein and may be used to couple the flexible web to the body member as described herein in connection with the elongated body members 121 and 123 shown in FIG.","1.The elongated body members may be assembled with the web by stitching or other fastening mechanism.","Alternatively, the elongated members may be an integral unassembled part of the web.","Such a web and any straps may be embodied as a nylon or other durable and water repellent material.","Alternatively, the tail portion may be an integral part of a sheath disposed about the body member, thereby eliminating the need for straps or other mechanisms for coupling the tail portion to the body member.","In another embodiment, the tail portion is an unassembled integral part of the body member.","In these embodiments, both the body member and the tail portion may be inflatable.","Alternatively, only the body member may be inflatable and the tail portion may be non-inflatable.","The towable watercraft configured to function as an airfoil including a flexible tail portion extending from the aft portion of the body member also includes two foot-accommodating stirrups coupled to an end portion of the flexible tail.","The two foot-accommodating stirrups are spaced apart from each other and spaced apart from the rearward portion of the body member.","In some embodiments, each foot-accommodating stirrup is part of an open-ended boot as described herein.","Each stirrup or open-ended boot is capable of accommodating the rider's foot when the rider's legs extend beyond the aft or rearward portion of the body member.","The flexible nature of the tail portion or web permits the two foot-accommodating stirrups or open-ended boots to move toward and away from each other upon upon movement of the rider's legs when the riders' feet are disposed in the open-ended boots.","In embodiments wherein the flexible tail portion includes include elongated members disposed on lateral sides thereof, the stirrups or open-ended boots may be coupled to corresponding end portions of the elongated members as described herein.","In some embodiments, the stirrups or open-ended boots are adjustably coupled to the web wherein a spacing between the open-ended boots and the body member is adjustable.","The stirrups may be adjustably coupled to the strap portions extending from the web by adjustable tension buckles as described herein.","When under tow, the watercraft is controllable in flight by configuration of the tail portion upon movement of the rider's legs when the riders' feet are disposed in the stirrups or open-ended boots.","The rider can move the tail portion relative to the body member upon movement of the foot-accommodating stirrups.","The rider can change the shape of the tail portion when in flight by moving the stirrups toward or away from each other.","The rider can also raise or lower the tail portion relative to a plane of the body member to control the pitch of the watercraft in flight.","For example, the rider may move the tail portion up or down by bending at the knees, bending at the waste, or arching the back to move the legs backwards.","The rider may roll the watercraft in flight by twisting the legs relative to the rider's waist, or upon raising one leg while lower the other leg, or by a combination of such movements.","A yaw motion of the watercraft in flight may be attained by swinging one or both legs toward one of the lateral portions of the body member.","Additional control may be exercised by combinations of these actions.","Further in-flight control may be attained by deforming the winglets or other portions of the body member when manipulating the tail portion as described above.","Thus the rider has a measure of control over the altitude and direction of travel of the airborne watercraft as described herein.","While the disclosure and what are presently considered to be the best modes have been described in a manner that establishes possession thereof by the inventor and that enables those of ordinary skill in the art to make and use the same, it will be understood and appreciated that there are many equivalents to the embodiments disclosed herein and that myriad modifications and variations may be made thereto without departing from the scope and spirit of the disclosure, which is to be limited not by the exemplary embodiments but by the appended claims."]],"string":"[\n [\n \"Towable Watercraft With Flight Control\",\n \"A towable watercraft including a body member capable of accommodating a rider's torso such that the rider's legs extend beyond an aft portion of the body member is disclosed.\",\n \"A tail portion extending from the aft portion of the body member includes two foot-accommodating stirrups spaced apart from each other and spaced apart from the rearward portion of the body member.\",\n \"Under tow and in flight, the watercraft is controllable by configuration of the tail portion upon movement of the rider's legs when the riders' feet are disposed in the stirrups.\"\n ],\n [\n \"1.A towable watercraft for a human rider, the towable watercraft comprising: an inflatable body member having a top side, a front portion, a rearward portion, and opposite lateral portions located between the front portion and the rearward portion, the body member capable of accommodating a rider's torso on the top side such that the rider's legs extend beyond the rearward portion of the body member; a tow-rope hitch coupled to the body member; a flexible wedge-shaped web having a first end portion coupled to the rearward portion of the body member, the web having a second end portion extending away from the body member, a width of the first end portion of the web more narrow width than a width of the second end portion of the web; two foot-accommodating open-ended boots coupled in spaced apart relation to the second end portion of the web, each open-ended boot spaced apart from the body member and capable of accommodating the rider's foot when the rider's legs extend beyond the rearward portion of the body member, wherein, when under tow, the watercraft is an airfoil controllable in flight by configuration of the web upon movement of the rider's legs when the riders' feet are disposed in the open-ended boots.\",\n \"2.The towable watercraft of claim 1, wherein the body member includes winglet portions extending from the opposite lateral portions.\",\n \"3.The towable watercraft of claim 2, wherein the body member is covered by a nylon sheath.\",\n \"4.The towable watercraft of claim 1, the open-ended boots are adjustably coupled to the web wherein a spacing between the open-ended boots and the body member is adjustable.\",\n \"5.The towable watercraft of claim 1, wherein the web is coupled to the body member by at least one articulating point.\",\n \"6.The towable watercraft of claim 1, wherein the web includes elongated members disposed along opposite lateral sides thereof, and each open-ended boot is coupled to a corresponding elongated member.\",\n \"7.The towable watercraft of claim 6, wherein each elongated member is coupled to the body member.\",\n \"8.The towable watercraft of claim 7 further comprising a retaining member interconnecting each elongated member to the body member.\",\n \"9.The towable watercraft of claim 1, wherein the two foot-accommodating open-ended boots are movable toward and away from each other upon upon movement of the rider's legs when the riders' feet are disposed in the open-ended boots.\",\n \"10.A towable watercraft comprising: a body member having a front portion, a rearward portion, and opposite lateral portions located between the front portion and the rearward portion, a tow-rope hitch coupled to the body member; a tail portion extending from the rearward portion of the body member, the tail portion flexible relative to the body member; two foot-accommodating stirrups coupled to an end portion of the tail portion, the two foot-accommodating stirrups spaced apart from each other and spaced apart from the rearward portion of the body member; wherein, when under tow and in flight, the watercraft is controllable by configuration of the tail portion upon movement of the foot-accommodating stirrups.\",\n \"11.The towable watercraft of claim 10, the tail portion is a wedge-shaped member wherein a width of the tail portion near the body member is greater than a width of the tail portion near the foot-accommodating stirrups.\",\n \"12.The towable watercraft of claim 11, wherein the two foot-accommodating stirrups are movable toward and away from each other and wherein the tail portion is movable relative to the body member.\",\n \"13.The towable watercraft of claim 11, wherein each foot-accommodating stirrup is part of an open-ended boot.\",\n \"14.The towable watercraft of claim 11, wherein the body member is an inflatable member covered by a nylon sheath.\",\n \"15.The towable watercraft of claim 14, wherein the body member includes winglet portions extending from the opposite lateral portions.\",\n \"16.The towable watercraft of claim 11 further comprising two elongated members, each elongated member having a first end coupled to the body member in spaced apart relation, the tail portion includes a flexible web interconnecting the two elongated members, each of the two foot-accommodating stirrups coupled to a second end portion of a correspond elongated member.\",\n \"17.A towable water craft comprising: a body member having an airfoil portion including a leading portion and a trailing portion, the body member having an unassembled flexible tail portion extending from the trailing portion of the airfoil; a tow-rope hitch coupled to the leading portion of the body member; two foot-accommodating stirrups coupled to the flexible tail portion in spaced apart relation, the two foot-accommodating stirrups spaced apart from the trailing portion of the airfoil; wherein, when under tow, the watercraft is controllable in flight by configuration of the flexible tail portion upon movement of the foot-accommodating stirrups.\",\n \"18.The towable watercraft of claim 17, the flexible tail portion is a wedge-shaped member wherein a width of the flexible tail portion near the airfoil portion is greater than a width of the flexible tail portion near the foot-accommodating stirrups.\",\n \"19.The towable watercraft of claim 17, wherein at least the airfoil portion of the body member is inflatable.\",\n \"20.The towable watercraft of claim 19, wherein the two foot-accommodating stirrups are movable toward and away from each other and wherein the tail portion is movable relative to the body member.\"\n ],\n [\n \" BACKGROUND Towable recreational watercraft are known generally and are typically towed across the water by a towline fastened to a moving object like a power boat.\",\n \"Such watercraft have been embodied as an inner tube or inflatable body member having a towline fastened to a front portion thereof.\",\n \"It's also known to cover the body member with a durable nylon material, to which a towline hitch and handles are fastened.\",\n \"It is also known to tow such watercraft and other devices over snow with a snow machine.\",\n \"In use, recreational watercraft accommodate one or more human riders in a seated or prone position.\",\n \"When known watercraft are towed behind a power boat the watercraft may become unstable and tip from one side or the other when crossing a wake drawn behind the boat.\",\n \"Windswept waves or waves caused by other boats may also cause the watercraft to tip.\",\n \"There is also a tendency for such watercraft to tip or overturn when towed along a curved path, for example when towed by a power boat negotiating a tight turn.\",\n \"The tendency to tip while negotiating a turn exists irrespective of the calmness of the water and is aggravated when turning in the presence of waves.\",\n \"Some towable watercraft are capable of generating lift and flying above the water when towed sufficiently fast.\",\n \"But such flying watercraft tend to be unstable in flight and permit little or no rider control.\",\n \"The objects, features, and advantages of the disclosure will be evident from the following description of one or more embodiments herein, with reference to the accompanying drawings.\"\n ],\n [\n \" BRIEF DESCRIPTION OF DRAWINGS FIG.\",\n \"1 is a plan view of a towable recreational craft.\",\n \"FIG.\",\n \"2 is a side view of a towable recreational craft.\",\n \"FIG.\",\n \"3 is a plan view of a stabilizing member.\",\n \"FIG.\",\n \"4 is a side view of a stabilizing member.\",\n \"FIG.\",\n \"5 is a plan view of another stabilizing member.\",\n \"FIG.\",\n \"6 is a perspective view of another stabilizing member.\",\n \"FIG.\",\n \"7 is a perspective view of another stabilizing member.\",\n \"FIG.\",\n \"8 is a perspective view of another stabilizing member.\",\n \"FIG.\",\n \"9 is a side view of another stabilizing member.\",\n \"FIG.\",\n \"10 is an end view of FIG.\",\n \"9 .\",\n \"FIG.\",\n \"11 is a plan view of a towable recreational craft with a rider.\",\n \"detailed-description description=\\\"Detailed Description\\\" end=\\\"lead\\\"?\"\n ],\n [\n \"REFERENCE TO RELATED APPLICATIONS The present application is a continuation-in-part of co-pending U.S. application Ser.\",\n \"No.\",\n \"14/698,783 filed on 28 Apr.\",\n \"2015 entitled “Towable Recreational Craft”, now U.S. Pat.\",\n \"No.\",\n \"______, from which priority is claimed under 35 U.S.C.\",\n \"120, the contents of which are incorporated by reference herein.\",\n \"FIELD OF THE DISCLOSURE The present disclosure relates generally to towable recreational craft accommodating one or more riders and more particularly to towable water craft having improved flight control.\",\n \"BACKGROUND Towable recreational watercraft are known generally and are typically towed across the water by a towline fastened to a moving object like a power boat.\",\n \"Such watercraft have been embodied as an inner tube or inflatable body member having a towline fastened to a front portion thereof.\",\n \"It's also known to cover the body member with a durable nylon material, to which a towline hitch and handles are fastened.\",\n \"It is also known to tow such watercraft and other devices over snow with a snow machine.\",\n \"In use, recreational watercraft accommodate one or more human riders in a seated or prone position.\",\n \"When known watercraft are towed behind a power boat the watercraft may become unstable and tip from one side or the other when crossing a wake drawn behind the boat.\",\n \"Windswept waves or waves caused by other boats may also cause the watercraft to tip.\",\n \"There is also a tendency for such watercraft to tip or overturn when towed along a curved path, for example when towed by a power boat negotiating a tight turn.\",\n \"The tendency to tip while negotiating a turn exists irrespective of the calmness of the water and is aggravated when turning in the presence of waves.\",\n \"Some towable watercraft are capable of generating lift and flying above the water when towed sufficiently fast.\",\n \"But such flying watercraft tend to be unstable in flight and permit little or no rider control.\",\n \"The objects, features, and advantages of the disclosure will be evident from the following description of one or more embodiments herein, with reference to the accompanying drawings.\",\n \"BRIEF DESCRIPTION OF DRAWINGS FIG.\",\n \"1 is a plan view of a towable recreational craft.\",\n \"FIG.\",\n \"2 is a side view of a towable recreational craft.\",\n \"FIG.\",\n \"3 is a plan view of a stabilizing member.\",\n \"FIG.\",\n \"4 is a side view of a stabilizing member.\",\n \"FIG.\",\n \"5 is a plan view of another stabilizing member.\",\n \"FIG.\",\n \"6 is a perspective view of another stabilizing member.\",\n \"FIG.\",\n \"7 is a perspective view of another stabilizing member.\",\n \"FIG.\",\n \"8 is a perspective view of another stabilizing member.\",\n \"FIG.\",\n \"9 is a side view of another stabilizing member.\",\n \"FIG.\",\n \"10 is an end view of FIG.\",\n \"9.FIG.\",\n \"11 is a plan view of a towable recreational craft with a rider.\",\n \"DETAILED DESCRIPTION While the drawings illustrate various aspects of the disclosure, the elements of the various figures are not necessarily drawn to scale.\",\n \"The size, shape and dimensions of some portions, features, components and/or regions of the drawings may be disproportionate to provide clarity or to better convey or illustrate what is described herein.\",\n \"FIG.\",\n \"1 illustrates a towable recreational craft 100 comprising a body member 110 having a top side 102, an opposite bottom side 104, a front portion 106, and a rearward portion 108.The recreational craft could be towed across water or snow.\",\n \"As shown, the body member has opposite lateral portions 110, 112 disposed between the front portion 106 and the aft or rearward portion 108.The body member may comprise a buoyant or semi-buoyant material.\",\n \"The body member may be embodied as an inflatable device like a tyre inner tube or inflatable device, which may have a variety of different shapes.\",\n \"An inflatable body member may be embodied as an inflatable rubber, polyvinyl chloride (PVC) or other suitable natural or synthetic material.\",\n \"Alternatively, the body member may be embodied as a non-inflatable device like a closed-cell extruded polystyrene material (e.g., Styrofoam) or some other non-inflatable buoyant or semi-buoyant material.\",\n \"Various other natural or synthetic materials may also be used for the body member.\",\n \"The craft may include a hitch to which a towline is fastened.\",\n \"In FIG.\",\n \"1, a hitch 107 is fastened to the front portion of the body member.\",\n \"In other embodiments, the towline is tied directly to the body member or fastened to a net disposed about the body member to distribute pulling forces applied thereto.\",\n \"The illustrated body member has a generally circular shape when viewed from the top or bottom.\",\n \"In other embodiments, the body member could have most any other shape.\",\n \"Such other shapes include but are not limited to an oblong or oval, rectangular, triangular, square or some other polygon or quasi-polygonal shape.\",\n \"Generally, the surfaces of the top and bottom sides of the body member may be flat or non-flat.\",\n \"For example, the bottom side surface could be convex or concave.\",\n \"The body member may also have a central keel or one or more fins or skegs extending from the bottom side thereof for directional stability.\",\n \"The fins or skegs may be disposed laterally or along the centerline.\",\n \"In some embodiments, the fins or skegs are adjustably retractable.\",\n \"Whether the bottom side surface is concave or convex may have some bearing on the placement of any fins or skegs.\",\n \"The top side surface of the body member is generally configured to accommodate one or more riders in the prone position with legs and feet extending from the aft and lateral portions of the body member.\",\n \"Thus the top surface may have a flat, convex, or concave configuration.\",\n \"In one particular embodiment, the top surface has a somewhat concave recess extending between the front and rearward portions of the body member.\",\n \"In another embodiment, the top surface has two or more generally side-by-side concave recessed portions for accommodating two side-by-side riders.\",\n \"A centerline of the concave recesses may be parallel or divergent toward the rearward portion of the body member.\",\n \"In one embodiment the inflatable or non-inflatable body member is covered with another material like nylon or PVC or some other material.\",\n \"For example, the body member may be encapsulated by a nylon or neoprene sheath, or a plastic shell or some other material.\",\n \"FIG.\",\n \"1 shows a portion of the sheath or shell 111 removed from the body member.\",\n \"The body member may also be covered by a combination of these and other materials.\",\n \"A sheath-type covering may include an opening through which to accommodate the body member.\",\n \"Such an opening may be securely closeable with a zipper, or buttons, or by mating hook and loop straps like Velcro, or by some other secure fastening mechanism.\",\n \"The opening in the sheath may be relatively small to accommodate an inflatable body member, but the opening could be relatively large to accommodate a non-inflatable body member.\",\n \"Alternatively, a shell-type covering may be fastened to, or integrally formed about, the body member.\",\n \"For example, a non-inflatable body member may include a shell made of plastic or some other durable material fastened thereto by an adhesive or by separate molding operations or by other means.\",\n \"Alternatively, the body member has no such covering.\",\n \"The materials selected will depend on consideration of the intended use or application of the craft.\",\n \"For applications where the craft is towed over snow, for example, materials having less frictional drag may be advantageous.\",\n \"In some applications however some drag may be desirable for directional stability.\",\n \"In some embodiments, the body member includes a handle disposed at or near the front portion thereof for grasping by a rider.\",\n \"The handle could take many forms.\",\n \"For example, there could be a single elongated handle for grasping by one or more riders.\",\n \"Alternatively, the handle could be embodied as a pair of handles, one for grasping by each hand of the rider.\",\n \"FIG.\",\n \"1 illustrates the body member having two sets of handles 113, 114 on the top side near the front portion.\",\n \"In this embodiment, each pair of handles accommodates a corresponding one of two riders in a prone position.\",\n \"In embodiments where the body member includes a sheath, the handles may be embodied as straps sewn, riveted or otherwise fastened to the sheath.\",\n \"Alternatively, the one or more handles may be embodied as an integral part of the body member or a plastic shell thereof.\",\n \"For example, such handles could be formed as a unitary part of the body member by a molding process or by some other process.\",\n \"In embodiments devoid of a sheath or shell covering the buoyant body member, the one or more handles may be fastened directly to the body member.\",\n \"In other embodiments, the watercraft is devoid of handles, wherein the rider merely grasps a front portion of the body member with his or her arms.\",\n \"In one embodiment, the body member includes one or more stabilizing members movably coupled thereto.\",\n \"The stabilizing member extends generally away from the body member and is movable between a position extending away from the rearward portion of the body member and a position extending away from one or both the lateral portions of the body member.\",\n \"Each stabilizing member includes a foot-accommodating portion spaced apart from the body member.\",\n \"In operation, a rider assumes a prone position on the top side of the body member with the rider's legs extending from the rearward portion thereof.\",\n \"The rider is positioned to grasp the recreational craft with his or her hands or arms as discussed above.\",\n \"One or both of the rider's feet are disposed in a foot-accommodating portion of the one or more stabilizing members.\",\n \"For the case where there are two stabilizing members, each foot is disposed in a foot-accommodating member of a corresponding stabilizing member.\",\n \"The articulating nature of the stabilizing members allows the user's legs to move independently between the aft position and the lateral sides 110, 112 of the body member thereby providing improved stability as the recreational craft is towed across the water or snow as shown in FIG.\",\n \"11.The positioning of the rider's leg or legs toward the lateral portion of the body member will reduce the likelihood that the body member will tip, for example while negotiating a turn or rough water.\",\n \"For the case where there is a single stabilizing member, the foot accommodating member may be sized to accommodate both feet of the rider.\",\n \"The articulating nature of the single stabilizing member allows the rider's legs to move in unison from side to side, thereby providing stability as the craft is towed across the water or snow.\",\n \"Alternatively, the the rider could alternate which foot is disposed in the foot-accommodating portion of the single stabilizing member depending on which side of the body member the rider wants to position the stabilizing member for stability, while allowing the other leg to extend from the aft portion of the body member.\",\n \"In one embodiment, the one or more stabilizing members include a directional guiding member extending from a bottom side thereof.\",\n \"The stabilizing member is disposed a sufficient distance from the body member to allow the directional guiding member to extend into the water or snow and to provide rudder-like functionality as the craft is towed.\",\n \"The directional guiding member could be part of the foot-accommodating member or a discrete member separate therefrom.\",\n \"In either case, the directional guiding member is maintained in the water or snow by downward pressure from the rider's foot disposed in the foot-accommodating portion of the stabilizing member.\",\n \"Thus the directional guiding member provides the rider a measure of control over the direction of the craft.\",\n \"In FIG.\",\n \"1, the body member includes two pair of stabilizing members extending from the aft portion of the body member.\",\n \"In this embodiment, the first pair of stabilizing members 120 accommodates one rider and the second pair of stabilizing members 122 accommodates an adjacent rider.\",\n \"The pairs of stabilizing member 120, 122 are shown disposed symmetrically about a centerline of the body member.\",\n \"In another embodiment, only a single pair of stabilizing members, for example, members 121, 123 in FIG.\",\n \"1, are disposed symmetrically about the centerline to accommodate a single rider.\",\n \"In another embodiment, a single stabilizing member, not shown, extends from the aft portion of the body member to accommodate a single rider as discussed above.\",\n \"The one or more stabilizing members are movably fastened to corresponding retaining members formed in or fastened to the body member.\",\n \"In FIG.\",\n \"1, the stabilizing member is embodied as a strap fastened to a retaining member 124 embodied as a ring or rectangular or D-shaped member fastened to the body member by an anchor 126.In this embodiment, the one side of the retaining member is captured by the anchor 126 and the other side of the retaining member retains the stabilizing member.\",\n \"A curved shape retaining member may better accommodate articulation of the stabilizing member.\",\n \"In one embodiment, the one or more stabilizing member are embodied as straps formed of a nylon material.\",\n \"In some applications the stabilizing strap is strengthened with a carbon fiber cloth or other reinforcing material captured between layers of the strap.\",\n \"The stabilizing strap may be fastened to the retaining member (e.g., the D-shaped member) by forming a loop that captures the retaining member upon sewing or riveting or otherwise fastening together mating portions of the strap.\",\n \"In FIG.\",\n \"1, the one or more anchors 126 are fastened directly to, or formed integrally with, the body member.\",\n \"In embodiments where the body member includes an outer sheath, the anchors and sheath may constitute a unitary member.\",\n \"Alternatively, the anchors may be discrete parts that are sewn, riveted or otherwise fastened to the sheath.\",\n \"In some applications the anchor is strengthened with a carbon fiber cloth or other reinforcing material captured between layers of the anchor and between layers of the sheath at least in the region where the anchor is fastened thereto.\",\n \"Alternatively, the stabilizing strap may be attached directly to the sheath without the intermediate retaining member.\",\n \"In other embodiments, the retaining members are integrally formed with the body member.\",\n \"For example, the retaining members may be formed as part of the body member, or as part of a body member shell, in a molding or other forming operation.\",\n \"In other embodiments, the stabilizing member may have other forms.\",\n \"For example, the stabilizing member could be embodied as a cord with one end fastened to the body member wherein the other end fastened is fastened to, or is integrally formed with, a foot accommodating portion.\",\n \"The cord could be made of nylon or some other material with suitable tensile strength.\",\n \"The cord could be rigid or flexible.\",\n \"A rigid cord would require a movable coupling to the body member, for example with a retaining ring.\",\n \"A flexible cord could be anchored directly to the body member without the need for an intermediate retaining member.\",\n \"Various other mechanisms and materials may be employed to form the one or more stabilizing members and to fasten them to the body member or to a sheath or covering disposed about the body member.\",\n \"In one embodiment, the foot-accommodating member comprises a stirrup into which the user's foot is disposed.\",\n \"FIG.\",\n \"3 is plan view of a stabilizing member portion 302 embodied as a strap having a stirrup 304 fastened to an end thereof.\",\n \"The stirrup has a relatively flat portion 305 that supports the user's foot.\",\n \"FIG.\",\n \"4 is side view of a stabilizing member portion 402 embodied as a strap looped through a stirrup 404.The strap has mating portions stitched, riveted or otherwise fastened together to capture the stirrup.\",\n \"FIG.\",\n \"4 shows the foot support 405 having increased surface area to more comfortably accommodate the user's foot.\",\n \"In one embodiment, the stabilizing member is made of nylon, or a carbon fiber reinforced material or other suitably strong material.\",\n \"FIG.\",\n \"5 illustrates a stabilizing member embodied as a strap 502 including an open loop 504 formed at the distal end thereof into which the user's foot may be disposed.\",\n \"In embodiments where the strap comprises a flexible material like nylon, a rigid member 506 may be embedded between layers of material to provide greater rigidity to the stirrup and to reduce a tendency of the non-rigid stirrup to clamp the user's foot when under load.\",\n \"The stirrup of FIGS.\",\n \"3 and 4 may be made of plastic, carbon fiber or some other material having suitable strength, durability and water resistance.\",\n \"In FIG.\",\n \"6, the stabilizing member is embodied as a cord 602 with a stirrup 604 disposed at the distal end thereof.\",\n \"The stabilizing member and stirrup may constitute a unitary member or the stirrup may be a discrete part fastened to the stabilizing member.\",\n \"In FIG.\",\n \"7, the stirrup is part of a foot-accommodating pocket 702 protruding from a bottom side of the stabilizing member 703.The pocket is accessible via an opening 704 on a top side of the stabilizing member.\",\n \"In FIG.\",\n \"7, the pocket is a open-ended boot-like member formed integrally with, or fastened to, the stabilizing member.\",\n \"A toe portion of the pocket may be fully or partially closed to fully or partially protect the user's feet.\",\n \"For aquatic applications, a closed-ended boot may have one or more holes to permit fluid drainage while still providing substantial foot protection.\",\n \"In one embodiment, the pocket is a non-rigid material, like nylon, that is integrally formed with a stabilizing member comprising the same or similar material.\",\n \"For example, the pocket could be formed integrally with a strap portion of the stabilizing member.\",\n \"Alternatively, the boot could be formed of a rigid or semi-rigid material like plastic, or rubber, or some other suitable material that is fastened to the stabilizing member.\",\n \"In one embodiment, the boot has a relatively rigid outer shell with a softer inner lining for greater comfort.\",\n \"The inner lining could be formed of foam rubber or some other suitable material.\",\n \"In one embodiment, a plastic boot is sewn, riveted or otherwise fastened to a strap-shaped stabilizing member.\",\n \"FIG.\",\n \"6 illustrates the stirrup fastened to a cord wherein the stirrup has a fully or partially closed end portion 606.The cord could be flexible or rigid.\",\n \"If the stabilizing member is inflexible, then it could be movably coupled to the body member by a retaining member to permit articulation as discussed herein.\",\n \"In one embodiment, the foot-accommodating portion is adjustably spaced apart from the body member.\",\n \"An adjustable foot-accommodating portion accommodates different sized riders and it accommodates different positioning of the rider on the body member.\",\n \"In one embodiment, shown in FIG.\",\n \"3, adjustment is provided for a strap-like stabilizing member using an adjustable tension buckle 306 disposed between the foot-accommodating portion and the body member.\",\n \"In this embodiment, the strap is looped through a retaining member and threaded through the adjustable tension buckle, wherein the strap length is adjustable by feeding more or less strap through the buckle.\",\n \"Such a buckle could be implemented in the embodiments of FIG.\",\n \"3 and FIG.\",\n \"7.In another embodiment, adjustment is provided by a plurality of foot-accommodating portions spaced apart along the stabilizing member at different locations from the body member wherein the rider could utilize the foot-accommodating member at the most appropriate distance from the body member.\",\n \"For example, multiple stirrups could be linked together with intervening strap portions as shown in broken lines in FIG.\",\n \"3.Similarly adjustment could be provided with multiple pockets arranged in series along the stabilizing member of FIG.\",\n \"7.In the alternative embodiment of FIG.\",\n \"8, adjustability is provided by an open-ended rigid or semi-rigid boot 802 removably disposed in any one of several openings 804, 806 or 808 formed along the stabilizing member.\",\n \"The boot could be retained in the opening by friction fit or by Velcro or by clamping a portion of the stabilizing member between a flange of the boot and a mating ring or strip or material.\",\n \"The ring or material strip could be fastened to the flange using removable bolts or other fasteners.\",\n \"In one embodiment, an outer portion of the boot constitutes the directional guiding member extending from the stabilizing member.\",\n \"FIG.\",\n \"9 illustrates the boot 902 having a fin shaped portion 903.The fin provides the rider with a measure of control over how the stabilizing member and to some extent the body member track over the snow or water.\",\n \"Alternatively, the directional guiding member may be a discrete member spaced separate and apart from the boot, for example toward a distal end of the stabilizing member away from the body member.\",\n \"In some embodiments, drag produced by the boot is reduced by providing an elongated tapered portion 904 (shown in broken lines) extending from the boot toward the body member.\",\n \"The tapered portion may be an integral part of the boot or the tapered portion may be a separate part that is fastened to the boot and or the stabilizing member.\",\n \"The tapered portion could also be an integral part of the stabilizing member or the tapered portions could be formed unitarily with the stabilizing member.\",\n \"In some embodiments, one or more winglets extend laterally from a lower portion of a boot.\",\n \"The one or more winglets are used mostly for aquatic applications and are optional.\",\n \"The winglets are positioned to remain under water, enabling the rider to better maintain the boot or stabilizing member in the water.\",\n \"In one embodiment, a single winglet extends from an aft portion of a lower part of the boot.\",\n \"The winglet may also extend from lateral sides or an aft portion of the fin or directional guiding member.\",\n \"FIG.\",\n \"9 also illustrates the directional guiding member including laterally extending winglets 906.FIG.\",\n \"10 is a front view of the boot 902 having a fin-shaped portion 903 as shown in FIG.\",\n \"9.The fin and winglets can be embodied as separate accessories fastened to the boot or directional guiding member or the one or more winglets can be an integral part of the fin or the boot or both.\",\n \"In some towable watercraft embodiments, the watercraft functions as an airfoil that generates lift when towed by a tow-line drawn by a motor boat or some other towing mechanism.\",\n \"At sufficient speed, the watercraft and rider will take flight like a kite.\",\n \"Increasing the size (e.g., diameter) of the body member will decrease the speed at which the body member will generate lift.\",\n \"In FIG.\",\n \"11, the body member includes optional winglet portions show in broken lines extending from the lateral portions of the body member.\",\n \"The winglet portions improve lift and stability during flight.\",\n \"The winglet portions may be an integral unassembled part of the body member or the winglet portions and body member may form an assembly.\",\n \"In other embodiments, the winged-body member may resemble an archetypal wing.\",\n \"In one implementation, the body member with winglet portions or other wing is a unitary inflatable member, which may be covered with a nylon material as described herein.\",\n \"Alternatively, the winged-body member is formed of a non-inflatable buoyant material as described herein.\",\n \"In FIG.\",\n \"11, the body member is capable of accommodating a rider's torso on a top side thereof such that the rider's legs extend beyond the aft portion of the body member.\",\n \"In some embodiments where an inflatable body member functions as an airfoil, a spacing between the handles (e.g., handles 113 and 114 in FIG.\",\n \"1) may be increased so that the handles are spaced laterally toward the lateral edges of the body member (e.g., toward the winglet tips).\",\n \"Such spacing provides increased leverage for the rider to deform portions of the body member (e.g., the winglet portions) thereby providing a measure of control over the watercraft in flight.\",\n \"The body member may also include a crease along which flexing may occur to facilitate deformation of each winglets by the user.\",\n \"In FIG.\",\n \"11, the crease may be disposed toward of tips of the winglet portions and the handles may be located outwardly of the creases thereby enabling the rider to bend the winglet portions up or down along the crease.\",\n \"In some embodiments in which the towable watercraft functions as an airfoil, a configurable tail portion extends from the aft portion of the body member.\",\n \"In one form, the tail portion has a wedge shape with a relatively narrow width near the body member and a greater width farther away from the body member.\",\n \"In FIG.\",\n \"11, the flexible tail portion of this alternative embodiment is shown in broken lines between the elongated members to which the stirrups are coupled.\",\n \"The flexible tail portion may be an unassembled integral part of the body member or it may be part of an assembly.\",\n \"In one implementation, the flexible tail portion is embodied as a wedge-shaped web having an end portion with a relatively narrow width coupled to the body member and a relatively wide portion extending away from the body member.\",\n \"The web is coupled to the body member by at least one point.\",\n \"Coupling the web to the body member at multiple points will distribute the load over a greater area thereby reducing wear at the assembly interface.\",\n \"The flexible tail may be coupled to the body member at one or more points using corresponding articulating retaining members, examples of which are described herein in connection with coupling the elongated members 121 and 123 to the body member.\",\n \"In some embodiments, the web includes elongated members disposed along opposite lateral sides thereof as shown in FIG.\",\n \"11.The elongated members may be embodied as straps or other materials described herein and may be used to couple the flexible web to the body member as described herein in connection with the elongated body members 121 and 123 shown in FIG.\",\n \"1.The elongated body members may be assembled with the web by stitching or other fastening mechanism.\",\n \"Alternatively, the elongated members may be an integral unassembled part of the web.\",\n \"Such a web and any straps may be embodied as a nylon or other durable and water repellent material.\",\n \"Alternatively, the tail portion may be an integral part of a sheath disposed about the body member, thereby eliminating the need for straps or other mechanisms for coupling the tail portion to the body member.\",\n \"In another embodiment, the tail portion is an unassembled integral part of the body member.\",\n \"In these embodiments, both the body member and the tail portion may be inflatable.\",\n \"Alternatively, only the body member may be inflatable and the tail portion may be non-inflatable.\",\n \"The towable watercraft configured to function as an airfoil including a flexible tail portion extending from the aft portion of the body member also includes two foot-accommodating stirrups coupled to an end portion of the flexible tail.\",\n \"The two foot-accommodating stirrups are spaced apart from each other and spaced apart from the rearward portion of the body member.\",\n \"In some embodiments, each foot-accommodating stirrup is part of an open-ended boot as described herein.\",\n \"Each stirrup or open-ended boot is capable of accommodating the rider's foot when the rider's legs extend beyond the aft or rearward portion of the body member.\",\n \"The flexible nature of the tail portion or web permits the two foot-accommodating stirrups or open-ended boots to move toward and away from each other upon upon movement of the rider's legs when the riders' feet are disposed in the open-ended boots.\",\n \"In embodiments wherein the flexible tail portion includes include elongated members disposed on lateral sides thereof, the stirrups or open-ended boots may be coupled to corresponding end portions of the elongated members as described herein.\",\n \"In some embodiments, the stirrups or open-ended boots are adjustably coupled to the web wherein a spacing between the open-ended boots and the body member is adjustable.\",\n \"The stirrups may be adjustably coupled to the strap portions extending from the web by adjustable tension buckles as described herein.\",\n \"When under tow, the watercraft is controllable in flight by configuration of the tail portion upon movement of the rider's legs when the riders' feet are disposed in the stirrups or open-ended boots.\",\n \"The rider can move the tail portion relative to the body member upon movement of the foot-accommodating stirrups.\",\n \"The rider can change the shape of the tail portion when in flight by moving the stirrups toward or away from each other.\",\n \"The rider can also raise or lower the tail portion relative to a plane of the body member to control the pitch of the watercraft in flight.\",\n \"For example, the rider may move the tail portion up or down by bending at the knees, bending at the waste, or arching the back to move the legs backwards.\",\n \"The rider may roll the watercraft in flight by twisting the legs relative to the rider's waist, or upon raising one leg while lower the other leg, or by a combination of such movements.\",\n \"A yaw motion of the watercraft in flight may be attained by swinging one or both legs toward one of the lateral portions of the body member.\",\n \"Additional control may be exercised by combinations of these actions.\",\n \"Further in-flight control may be attained by deforming the winglets or other portions of the body member when manipulating the tail portion as described above.\",\n \"Thus the rider has a measure of control over the altitude and direction of travel of the airborne watercraft as described herein.\",\n \"While the disclosure and what are presently considered to be the best modes have been described in a manner that establishes possession thereof by the inventor and that enables those of ordinary skill in the art to make and use the same, it will be understood and appreciated that there are many equivalents to the embodiments disclosed herein and that myriad modifications and variations may be made thereto without departing from the scope and spirit of the disclosure, which is to be limited not by the exemplary embodiments but by the appended claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870969"}}},{"rowIdx":4493686,"cells":{"text":{"kind":"list like","value":[["APPARATUS FOR DETECTING LEAKAGE IN DIGITALLY MODULATED SYSTEMS","In a method for detecting leakage in a digital cable system, at least one first signal is inserted on the cable system.","The at least one first signal has an amplitude multiple tens of dB below the digital channel power of the digital channels carried on the cable system.","A second signal containing the first signal is received.","The second signal is converted to an intermediate frequency (IF) signal.","The IF signal is digitized and samples of the digitized IF signal are obtained.","Digitized samples of a third signal at the nominal frequency of the first signal at maximum amplitude converted to the IF are provided.","The digitized IF signal and the digitized samples of a third signal at the nominal frequency of the first signal at maximum amplitude converted to the IF are correlated.","The presence of the inserted first signal is detected based upon the result of the correlation.","In another method, a pair of first signals are inserted on the cable system.","The pair of first signals are spaced apart a fixed frequency and with amplitudes multiple tens of dB below the digital channel power of the digital channels carried on the cable system.","A second signal containing the first signal is received and converted to an intermediate frequency (IF) signal.","The IF signal is digitized, samples of the digitized IF signal are obtained, and a large scale Fast Fourier Transform (FFT) is applied to the samples to generate an FFT output.","The FFT output is examined for generally equally sized signals separated from each other by the fixed frequency in the FFT output.","If generally equally sized signals separated from each other by the fixed frequency are detected in the FFT output, a decision is made that the second signal represents detected leakage from the digital cable system."],["1-35.","(canceled) 36.A system for tagging a digital CATV signal, the system comprising: a tag receiver comprising: an antenna configured to receive a wireless signal, first circuitry configured to convert the second signal to an intermediate frequency (IF) signal, second circuitry configured to digitize the IF signal to create a digitized IF signal, and obtain samples of the digitized IF signal, third circuitry configured to apply a large scale Fast Fourier Transform (FFT) to the second signal to generate an FFT output, examine the FFT output for generally equally sized signals separated from each other by a fixed frequency in the FFT output and determine whether the FFT output includes generally equally sized signals separated from each other by the fixed frequency of the FFT output, and fourth circuitry configured to indicate that the second signal represents detected leakage from the digital cable system when the FFT output includes generally equally sized signals separated from each other by the fixed frequency of the FFT output.","37.The system of claim 36, further comprising a tag generator configured to insert a pair of signals spaced apart a fixed frequency and with amplitudes multiple tens of dB below a digital channel power of digital channels carried on the digital cable system, wherein the pair of signals are present in the second signal when the FFT output includes generally equally sized signals separated from each other by the fixed frequency of the FFT output.","38.The system of claim 37, wherein the tag generator includes a signal combiner configured to be coupled to a CATV plant to place a digital channel tag including the pair of signals on the CATV plant.","39.The system of claim 36, wherein the first circuitry comprises a first filter having an input port coupled to the antenna, a first frequency source having an output port coupled to a first mixer, a second filter coupled to an output port of the first mixer and a first input port of a second mixer, a second frequency source coupled to a second input port of the second mixer, and a third filter coupled to an output port of the second mixer.","40.The system of claim 36, wherein the fourth circuitry includes a display configured to display a visual indication that the second signal represents detected leakage from the digital cable system when the FFT output includes generally equally sized signals separated from each other by the fixed frequency of the FFT output.","41.A system for detecting leakage in a digital cable system, the system comprising: a tag generator configured to insert at least one first signal with an amplitude multiple tens of dB below a digital channel power of digital channels carried on the digital cable system, and a tag receiver comprising: an antenna configured to receive a second signal containing the at least one first signal, first circuitry configured to convert the second signal to an intermediate frequency (IF) signal, second circuitry configured to digitize the IF signal to create a digitized IF signal and obtain samples of the digitized IF signal, and third circuitry configured to provide a set of digitized samples of a third signal at a nominal frequency or nominal frequencies of the at least one first signal at maximum amplitude converted to the IF, correlate the digitized IF signal and the digitized samples of the third signal at the nominal frequency or nominal frequencies of the at least one first signal at maximum amplitude converted to the IF, and detect the presence of the inserted at least one first signal based upon the result of the correlation."],[" BACKGROUND This invention relates to methods for detecting egress from cable systems that have deployed digital signals.","Various types of leakage detection equipment for cable systems are known.","There are, for example, the devices illustrated and described in: published U.S. patent applications 2008/0133308; 2008/0033698; and, 2006/0248565; and, U.S. Pat.","Nos.","7,945,939; 7,788,050; 7,548,201; 7,415,367; 7,395,548; 6,833,859; 6,804,826; 6,801,162; 6,600,515; 6,313,874; 6,018,358; 5,777,662; 5,608,428; and, 4,072,899.The disclosures of the cited references are incorporated herein by reference.","No representation is intended by this listing that an exhaustive search of all pertinent prior art has been made or that no better art than that listed exists, and no such representation should be inferred.","This listing does not constitute a representation that the material listed is pertinent, and no such representation should be inferred."],[" SUMMARY A method for detecting leakage in a digital cable system comprises inserting at least one first signal with an amplitude multiple tens of dB below the digital channel power of the digital channels carried on the cable system.","The method further comprises receiving a second signal containing the at least one first signal, converting the second signal to an intermediate frequency (IF) signal, digitizing the IF signal, obtaining samples of the digitized IF signal, and providing a set of digitized samples of a third signal at the nominal frequency or frequencies of the at least one first signal at maximum amplitude converted to the IF.","The method further comprises correlating the digitized IF signal and the digitized samples of a third signal at the nominal frequency or frequencies of the at least one first signal at maximum amplitude converted to the IF, and detecting the presence of the inserted at least one first signal based upon the result of the correlation.","Illustratively, the method further includes sweeping the at least one first signal to promote correlation with the digitized samples of a third signal.","Illustratively, sweeping the at least one first signal comprises sweeping the at least one first signal at the transmitting device.","Illustratively, sweeping the at least one first signal comprises sweeping the at least one first signal at the receiving device.","Illustratively, converting the second signal to an IF signal comprises converting the second signal to an IF signal having a bandwidth of about 100 KHz.","Illustratively, converting the second signal to an IF signal comprises converting the second signal to an IF signal having a frequency greater than about 0.2% of the digitizing frequency of the IF.","Illustratively, inserting the at least one first signal comprises inserting the at least one first signal below the digital channel signal channel.","Illustratively, inserting the at least one first signal comprises inserting the at least one first signal above the digital channel signal channel.","Illustratively, detecting the presence of the inserted at least one first signal based upon the result of the correlation comprises detecting the presence of the inserted at least one first signal within an ˜250 ms window.","Illustratively, obtaining samples of the digitized IF signal comprises obtaining samples of the digitized IF signal using an A/D converter.","Illustratively, obtaining samples of the digitized IF signal comprises obtaining samples of the digitized IF signal using an A/D converter having a first sampling rate and then upsampling the data to a second, higher sample rate.","Illustratively, converting the second signal to an IF signal comprises converting the second signal to a 455 KHz IF.","According to another aspect, a method for detecting leakage in a digital cable system comprises inserting a pair of first signals spaced apart a fixed frequency and with amplitudes multiple tens of dB below the digital channel power of the digital channels carried on the cable system, receiving a second signal containing the first signals, converting the second signal to an IF signal and digitizing the IF signal; obtaining samples of the digitized IF signal.","The method further comprises applying a large scale Fast Fourier Transform (hereinafter sometimes FFT) to the second signal to generate an FFT output, examining the FFT output for generally equally sized signals separated from each other by the fixed frequency in the FFT output, and, if generally equally sized signals separated from each other by the fixed frequency are detected in the FFT output, deciding that the second signal represents detected leakage from the digital cable system.","Illustratively, the FFT has a sample size on the order of at least about 32 kilosamples (32 Ksamples).","Illustratively, converting the second signal to an IF signal comprises converting the second signal to an IF signal having a bandwidth of about 15 KHz.","Illustratively, inserting a pair of first signals spaced apart a fixed frequency comprises inserting the pair of first signals between adjacent digital channel signal channels.","Illustratively, obtaining samples of the digitized IF signal comprises obtaining samples of the digitized IF signal using an A/D converter.","Illustratively, converting the second signal to an IF signal comprises converting the second signal to a 10.7 MHz IF.","According to another aspect, apparatus is provided for tagging a digital CATV signal.","The apparatus comprises a controller, a first source of a first frequency and a second source of a second frequency.","The first frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to an input port of a first fixed attenuator.","The second frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to a first input port of a first variable attenuator.","The first variable attenuator further includes a second input port for receiving signals from the controller.","An output port of the first fixed attenuator is coupled to a first input port of a first signal combiner.","An output port of the first variable attenuator is coupled to a second input port of the first signal combiner to combine the signals from first fixed attenuator and the first variable attenuator at an output port of the first signal combiner.","An output port of the first signal combiner is coupled to a CATV plant to place the digital channel tag on the CATV plant.","The switch further includes a second input port for receiving signals from the controller.","Illustratively, the output port of the first signal combiner is coupled to a first input port of a switch.","The switch further includes a second input port for receiving signals from the controller.","The digital channel tag is provided at an output port of the switch Illustratively, the output port of the first signal combiner is coupled to an input port of a second variable attenuator.","The second variable attenuator further includes a second input port for receiving signals from the controller.","An output port of the second variable attenuator is coupled to the first input port of the switch.","Illustratively, the first frequency source first input port is coupled to the controller to receive first frequency tuning instructions from the controller.","Illustratively, the second frequency source first input port is coupled to the controller to receive second frequency tuning instructions from the controller.","Illustratively, the output port of the first signal combiner is coupled to a first input port of a diplex filter.","The apparatus further comprises a third frequency source.","The third frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to an input port of a second fixed attenuator.","The second fixed attenuator includes an output port coupled to a first input port of a second signal combiner.","A fourth frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to a first input port of a second variable attenuator.","The second variable attenuator further includes a second input port for receiving signals from the controller.","An output port of the second signal combiner is coupled to the first input port of the switch.","Illustratively, the third frequency source first input port is coupled to the controller to receive third frequency tuning instructions from the controller.","Illustratively, the fourth frequency source first input port is coupled to the controller to receive fourth frequency tuning instructions from the controller.","According to another aspect, apparatus is provided for determining whether a received signal is a digital CATV tag inserted between adjacent digital CATV channels.","The apparatus includes an apparatus input port for receiving the signal, and a first filter having an input port coupled to the apparatus input port.","A first mixer has a first input port, a second input port and an output port.","A first frequency source has an output port coupled to the first input port of the first mixer.","A second filter has an input port coupled to the output port of the first mixer and an output port coupled to a first input port of a second mixer.","The second mixer further includes a second input port and an output port.","A second frequency source is coupled to the second input port of the second mixer.","A third filter has an input port and an output port.","The third filter input port is coupled to the output port of the second mixer and the third filter output port is coupled to the apparatus output port.","An indication whether the received signal is a digital CATV tag inserted between adjacent digital CATV channels appears at the apparatus output port.","Illustratively, the first filter comprises first and fourth filters.","The first filter has an input port coupled to a first output port of a first switch.","The fourth filter has an input port coupled to a second output port of the first switch.","Illustratively, the first filter comprises first and fifth filters.","The first filter has an output port coupled to a first input port of a second switch.","The fifth filter has an output port coupled to a second input port of the second switch.","Illustratively, the second filter having an input port coupled to the output port of the first mixer and an output port coupled to a first input port of a second mixer comprises a second filter having an input port coupled to the output port of the first mixer and a fourth filter having an input port coupled to the output port of the second filter and an output port coupled to the first input port of the second mixer.","Illustratively, the third filter comprises a third filter having an input port and an output port and a sixth filter having an input port and an output port.","The third filter input port is coupled to the output port of the second mixer.","The sixth filter input port is coupled to the output port of the third filter.","The sixth filter output port is coupled to the apparatus output port.","Illustratively, the sixth filter having an input port and an output port coupled to the apparatus output port comprises a sixth filter and a seventh filter.","The sixth filter has an input port coupled to the third filter output port and an output port coupled to an input port of the seventh filter.","The seventh filter output port is coupled to the apparatus output port."],["CROSS REFERENCE TO RELATED APPLICATIONS This application claims the benefit of the Jun.","27, 2011 filing date of U.S. Ser.","No.","61/501,423, the Nov. 29, 2011 filing date of U.S. Ser.","No.","61/564,429 and the Jan. 30, 2012 filing date of U.S. Ser.","No.","61/592,195.The disclosures of U.S. Ser.","No.","61/501,423, U.S. Ser.","No.","61/564,429 and U.S. Ser.","No.","61/592,195 are incorporated herein by reference.","BACKGROUND This invention relates to methods for detecting egress from cable systems that have deployed digital signals.","Various types of leakage detection equipment for cable systems are known.","There are, for example, the devices illustrated and described in: published U.S. patent applications 2008/0133308; 2008/0033698; and, 2006/0248565; and, U.S. Pat.","Nos.","7,945,939; 7,788,050; 7,548,201; 7,415,367; 7,395,548; 6,833,859; 6,804,826; 6,801,162; 6,600,515; 6,313,874; 6,018,358; 5,777,662; 5,608,428; and, 4,072,899.The disclosures of the cited references are incorporated herein by reference.","No representation is intended by this listing that an exhaustive search of all pertinent prior art has been made or that no better art than that listed exists, and no such representation should be inferred.","This listing does not constitute a representation that the material listed is pertinent, and no such representation should be inferred.","SUMMARY A method for detecting leakage in a digital cable system comprises inserting at least one first signal with an amplitude multiple tens of dB below the digital channel power of the digital channels carried on the cable system.","The method further comprises receiving a second signal containing the at least one first signal, converting the second signal to an intermediate frequency (IF) signal, digitizing the IF signal, obtaining samples of the digitized IF signal, and providing a set of digitized samples of a third signal at the nominal frequency or frequencies of the at least one first signal at maximum amplitude converted to the IF.","The method further comprises correlating the digitized IF signal and the digitized samples of a third signal at the nominal frequency or frequencies of the at least one first signal at maximum amplitude converted to the IF, and detecting the presence of the inserted at least one first signal based upon the result of the correlation.","Illustratively, the method further includes sweeping the at least one first signal to promote correlation with the digitized samples of a third signal.","Illustratively, sweeping the at least one first signal comprises sweeping the at least one first signal at the transmitting device.","Illustratively, sweeping the at least one first signal comprises sweeping the at least one first signal at the receiving device.","Illustratively, converting the second signal to an IF signal comprises converting the second signal to an IF signal having a bandwidth of about 100 KHz.","Illustratively, converting the second signal to an IF signal comprises converting the second signal to an IF signal having a frequency greater than about 0.2% of the digitizing frequency of the IF.","Illustratively, inserting the at least one first signal comprises inserting the at least one first signal below the digital channel signal channel.","Illustratively, inserting the at least one first signal comprises inserting the at least one first signal above the digital channel signal channel.","Illustratively, detecting the presence of the inserted at least one first signal based upon the result of the correlation comprises detecting the presence of the inserted at least one first signal within an ˜250 ms window.","Illustratively, obtaining samples of the digitized IF signal comprises obtaining samples of the digitized IF signal using an A/D converter.","Illustratively, obtaining samples of the digitized IF signal comprises obtaining samples of the digitized IF signal using an A/D converter having a first sampling rate and then upsampling the data to a second, higher sample rate.","Illustratively, converting the second signal to an IF signal comprises converting the second signal to a 455 KHz IF.","According to another aspect, a method for detecting leakage in a digital cable system comprises inserting a pair of first signals spaced apart a fixed frequency and with amplitudes multiple tens of dB below the digital channel power of the digital channels carried on the cable system, receiving a second signal containing the first signals, converting the second signal to an IF signal and digitizing the IF signal; obtaining samples of the digitized IF signal.","The method further comprises applying a large scale Fast Fourier Transform (hereinafter sometimes FFT) to the second signal to generate an FFT output, examining the FFT output for generally equally sized signals separated from each other by the fixed frequency in the FFT output, and, if generally equally sized signals separated from each other by the fixed frequency are detected in the FFT output, deciding that the second signal represents detected leakage from the digital cable system.","Illustratively, the FFT has a sample size on the order of at least about 32 kilosamples (32 Ksamples).","Illustratively, converting the second signal to an IF signal comprises converting the second signal to an IF signal having a bandwidth of about 15 KHz.","Illustratively, inserting a pair of first signals spaced apart a fixed frequency comprises inserting the pair of first signals between adjacent digital channel signal channels.","Illustratively, obtaining samples of the digitized IF signal comprises obtaining samples of the digitized IF signal using an A/D converter.","Illustratively, converting the second signal to an IF signal comprises converting the second signal to a 10.7 MHz IF.","According to another aspect, apparatus is provided for tagging a digital CATV signal.","The apparatus comprises a controller, a first source of a first frequency and a second source of a second frequency.","The first frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to an input port of a first fixed attenuator.","The second frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to a first input port of a first variable attenuator.","The first variable attenuator further includes a second input port for receiving signals from the controller.","An output port of the first fixed attenuator is coupled to a first input port of a first signal combiner.","An output port of the first variable attenuator is coupled to a second input port of the first signal combiner to combine the signals from first fixed attenuator and the first variable attenuator at an output port of the first signal combiner.","An output port of the first signal combiner is coupled to a CATV plant to place the digital channel tag on the CATV plant.","The switch further includes a second input port for receiving signals from the controller.","Illustratively, the output port of the first signal combiner is coupled to a first input port of a switch.","The switch further includes a second input port for receiving signals from the controller.","The digital channel tag is provided at an output port of the switch Illustratively, the output port of the first signal combiner is coupled to an input port of a second variable attenuator.","The second variable attenuator further includes a second input port for receiving signals from the controller.","An output port of the second variable attenuator is coupled to the first input port of the switch.","Illustratively, the first frequency source first input port is coupled to the controller to receive first frequency tuning instructions from the controller.","Illustratively, the second frequency source first input port is coupled to the controller to receive second frequency tuning instructions from the controller.","Illustratively, the output port of the first signal combiner is coupled to a first input port of a diplex filter.","The apparatus further comprises a third frequency source.","The third frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to an input port of a second fixed attenuator.","The second fixed attenuator includes an output port coupled to a first input port of a second signal combiner.","A fourth frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to a first input port of a second variable attenuator.","The second variable attenuator further includes a second input port for receiving signals from the controller.","An output port of the second signal combiner is coupled to the first input port of the switch.","Illustratively, the third frequency source first input port is coupled to the controller to receive third frequency tuning instructions from the controller.","Illustratively, the fourth frequency source first input port is coupled to the controller to receive fourth frequency tuning instructions from the controller.","According to another aspect, apparatus is provided for determining whether a received signal is a digital CATV tag inserted between adjacent digital CATV channels.","The apparatus includes an apparatus input port for receiving the signal, and a first filter having an input port coupled to the apparatus input port.","A first mixer has a first input port, a second input port and an output port.","A first frequency source has an output port coupled to the first input port of the first mixer.","A second filter has an input port coupled to the output port of the first mixer and an output port coupled to a first input port of a second mixer.","The second mixer further includes a second input port and an output port.","A second frequency source is coupled to the second input port of the second mixer.","A third filter has an input port and an output port.","The third filter input port is coupled to the output port of the second mixer and the third filter output port is coupled to the apparatus output port.","An indication whether the received signal is a digital CATV tag inserted between adjacent digital CATV channels appears at the apparatus output port.","Illustratively, the first filter comprises first and fourth filters.","The first filter has an input port coupled to a first output port of a first switch.","The fourth filter has an input port coupled to a second output port of the first switch.","Illustratively, the first filter comprises first and fifth filters.","The first filter has an output port coupled to a first input port of a second switch.","The fifth filter has an output port coupled to a second input port of the second switch.","Illustratively, the second filter having an input port coupled to the output port of the first mixer and an output port coupled to a first input port of a second mixer comprises a second filter having an input port coupled to the output port of the first mixer and a fourth filter having an input port coupled to the output port of the second filter and an output port coupled to the first input port of the second mixer.","Illustratively, the third filter comprises a third filter having an input port and an output port and a sixth filter having an input port and an output port.","The third filter input port is coupled to the output port of the second mixer.","The sixth filter input port is coupled to the output port of the third filter.","The sixth filter output port is coupled to the apparatus output port.","Illustratively, the sixth filter having an input port and an output port coupled to the apparatus output port comprises a sixth filter and a seventh filter.","The sixth filter has an input port coupled to the third filter output port and an output port coupled to an input port of the seventh filter.","The seventh filter output port is coupled to the apparatus output port.","BRIEF DESCRIPTION OF THE DRAWINGS The invention may best be understood by referring to the following detailed description and accompanying drawings which illustrate the invention.","In the drawings: FIG.","1 illustrates three signals plotted on the same x axis; FIGS.","2a-g illustrate a block diagram of a tagger circuit board; FIGS.","3a-g illustrate a block diagram of a tag receiver μC board; FIG.","4 illustrates a system level block diagram; FIG.","5 illustrates a waveform useful in understanding the invention; FIG.","6 illustrates a described method; FIG.","7 illustrates another described method; FIG.","8 illustrates another waveform useful in understanding the invention; and, FIG.","9 illustrates a much enlarged view of a portion of the waveform illustrated in FIG.","8.DETAILED DESCRIPTION Broadcasters face tremendous revenue pressure to convert to fully digital systems.","This revenue pressure is driving the conversion.","Once a system converts, legacy egress detection equipment will no longer accurately detect and identify leakage, and must be replaced by equipment and methods that can reliably detect egress in the digital environment.","The described methods are very low cost and are minimally invasive to the broadcast system.","The inserted signals are at levels below the detection thresholds of currently deployed broadcast equipment.","The described methods permit the broadcaster to utilize the forward, or downstream, bandwidth of the cable system fully, without any dedicated bandwidth requirements.","The described systems contemplate the insertion of one or more continuous wave (hereinafter sometimes CW) signals with (an) amplitude(s) multiple tens of dB down, for example, −30 dB down, 40 dB down, and so on, from the digital channel power.","The level(s) chosen will be one(s) that provide(s) the user with minimal or no signal impairment.","The inserted carrier(s) can be located on either side of the digital signal channel.","To detect the presence of the CW signals radiated from the cable system as leakage with the correlation-based detection methods described herein, a leakage receiver will have an IF bandwidth in the range of 100 KHz to receive the CW signal(s) and convert it (them) to (an) IF frequency (frequencies) permitting obtaining of digital samples of the received leakage signal.","To detect the presence of the CW signals radiated from the cable system as leakage with the FFT detection method described herein, a leakage receiver will have a very narrow IF bandwidth while still accommodating a realistic amount of signal placement inaccuracy.","A 15 KHz bandwidth is currently contemplated as necessary to accommodate analysis of the 700 MHz band to receive the CW signal(s) and convert it (them) to (an) IF frequency (frequencies) permitting obtaining of digital samples of the received signal using the FFT-based detection method described herein.","An A/D converter is used to obtain a sample window of the combined ambient noise and CW signal(s).","A sample window of a signal at the same frequency as the CW signal at maximum amplitude is then used in a correlation algorithm and compared to the sample window of the digitized received combined ambient noise and CW signal.","Given enough continuous samples of both windows, the presence of the inserted CW signal(s) can be detected, even in the presence of noise that is of significantly higher amplitude than the CW signal(s).","Certain relationships become apparent.","For example, given that the number of samples for the windows can be doubled (allowing for more time), a +6 dB improvement in the perceived carrier-to-noise ratio (hereinafter sometimes C/N) of the CW signal can be achieved.","This same effect can be used to advantage if the effective sampling rate can be doubled without increasing the amount of time sampled.","So it will be appreciated that if the sampling rate is sufficiently high, allowing for a sufficient number of samples per unit time, the C/N can be improved so that, even if the inserted signal is well below the level of the noise, the inserted signal can still be detected.","It is believed that the wider the bandwidth of the combined ambient noise and CW signal(s) the better.","This is so because the narrower the bandwidth of the combined samples the more closely the output becomes essentially single frequency.","But essentially single frequency is exactly what the CW signal is.","Since the inserted CW signal is a single frequency but is potentially lower than the noise in amplitude it becomes practically impossible to detect it reliably.","With wider band noise, the coherency to a single frequency becomes less over the total sample window for the noise components but remains essentially unchanged for the inserted CW, making it detectable.","It is also believed that the IF of the receiving device must be greater than 0.2% of the sampling frequency in order to be detectable.","If the IF of the receiving device is not greater than 0.2% of the sampling frequency, then the detection envelop of the desired signal (the inserted CW carrier) begins to exhibit very low frequency lobes that can no longer be filtered out and still permit the system to remain responsive.","IF of the receiving device greater than 0.2% of the sampling frequency is easily achieved by selecting an IF which is an appreciable percentage of the sampling rate.","Another observation with this method is that for significant C/N improvements (large sample size), the detection bandwidth becomes quite narrow (on the order of ±1 Hz).","This characteristic of the method requires considerable frequency accuracy in the transmitting and receiving devices.","This narrow detection bandwidth is not practical for real systems given any number of accuracy detriments which occur normally.","However, this accuracy requirements can be mitigated by slowly sweeping the inserted CW carrier(s) across the sample bandwidth (approximately ±1 KHz) in order that there will be alignment, with its resultant correlation, at some point within the approximately ±1 Hz detection bandwidth.","A sweep rate of approximately 2 to 3 Hz provides enough of a sample window length to perform the detection.","Either the transmitting or receiving device's frequency can be swept to produce this effect.","In order for the system to be responsive in a mobile application, the field detection portion of the system must detect the presence of the signal within an ˜250 ms window.","Also, in order to achieve adequate signal to noise margin for the measurement, 20-30 Ksamples must be collected.","Given the issues cited in the previous paragraph, all of the required samples must fit within the small portion of the time window during which the particular 2 Hz detection bandwidth being observed is swept.","So if it is assumed that the sweep rate is 2 Hz and the swept bandwidth will be 2 KHz total, this gives 250 μs (2 Hz/2 KHz=1/1000 of the ˜250 ms window) of time where the frequency will be matched closely enough to be detectable.","The peak value of detection will be obtained in the middle 1 Hz of the bandwidth, so enough samples need to be fitted into that window to obtain the detected leak level.","This means that 20-30 Ksamples need to be fitted into the ˜125 μs (250 μs/2) window.","Thus, the effective sampling rate must be in the ˜160 to ˜240 Msps (20 Ksamples/125 μs≤effective sampling rate≤30 Ksamples/125 μs) range to achieve detection quickly enough.","This sampling frequency can be achieved by either sampling at that rate with a high speed A/D converter or using a slower A/D converter and upsampling the data to create the faster sample rate.","Since the sampling frequency does not bear any significant relationship to the frequency being detected other than the >0.2% of sampling frequency requirement mentioned earlier, almost any IF, 455 KHz, 10.7 MHz, etc., could be used, as long as it meets the >0.2% of sampling frequency requirement.","In the simulation below, 455 KHz was used as the IF, since 455 KHz IF is very common.","The filter bandwidth used was sufficiently wide to admit input noise which, as mentioned above, is important to the ability to detect the inserted CW.","FIG.","1 plots three signals 20, 22, 24 on the same x axis.","The x axis can be referred to as number of samples, which for a given sample rate equates to time.","The signal 20 is the “noise only” signal with no reference trace inserted and is seen significantly below the other two for most of the graph's x axis.","The signal 22 that appears as a trapezoid is the result of the proposed detection algorithm given only the inserted CW reference signal with no noise at all, making signal 22 essentially the ideal detection envelope.","The signal 24 is the result given the reference signal 22 and the noise 20 combined as would occur normally.","As can clearly be seen from FIG.","1, an envelope level 22 well above the “noise” floor 20 with good C/N margin is quickly reached.","The simulation results were achieved using the following Matlab® code segments: Fs = 2e6; %sample frequency of the ADC simlength =30000; %number of samples in use Fc =455e3; %actual frequency of inserted signal Fref =455e3; %frequency we are looking for kTB = −174 + 10*log10(48.828125); % assume receiver RBW of 48.828125Hz for a 1024 FFT and 50ohm system fbp = filterbp1; bp = fbp.Numerator; flp = filterlp1; lp1 = flp.Numerator; flp = filterlp2; lp2 = flp.Numerator; fhp = filterhp1; hp1 = fhp.Numerator; s = cos(2*pi*[0:simlength]*Fc/Fs); tx = s*10{circumflex over ( )}((−30 −118 − 10*log10(mean(s.{circumflex over ( )}2)))/20); sref = cos(2*pi*[0:simlength]*Fref/Fs); noise = 2*rand(1,length(tx)+ length(bp)); meannoise = mean(noise); noise = noise−meannoise; ns = noise; % apply wideband noise ns = ns(length(bp):length(bp)+length(tx)−1); ns1 = ns*10{circumflex over ( )}(( kTB − 10*log10(mean(ns.","{circumflex over ( )}2)) + 21.4)/20); clear ns; clear noise; clear fbp; clear bp; clear flp; clear fhp; modsq = 0.5 + 0.5*(square([0:length(s)−1]*2000/Fs,50)); modpulse = [zeros(1,5000) ones(1,simlength−10000) zeros(1,5001)]; modsig = modpulse.","*sref; % this is the reference waveform for convolution clear modpulse; clear sref; clear modsq; s=tx; clear tx; clear mod1; clear lp2; clear hp1; pksig=filter(lp1,1,abs(xcorr(s,modsig))); pknoise=filter(lp1,1,abs(xcorr(ns1,modsig))); pksignoise=filter(lp1,1,abs(xcorr(s+ns1,modsig))); clear lp1; cndB = 20*log10(abs(pksignoise−pknoise)); AND: function Hd = filterbp1 %FILTERBP1 Returns a discrete-time filter object.","% % MATLAB Code % Generated by MATLAB(R) 7.11.1 and the Signal Processing Toolbox 6.14.% % Generated on: 02-Jun-2011 15:45:50 % % Equiripple Bandpass filter designed using the FIRPM function.","% All frequency values are in Hz.","Fs = 2000000; % Sampling Frequency Fstop1 = 140000; % First Stopband Frequency Fpass1 = 151000; % First Passband Frequency Fpass2 = 759000; % Second Passband Frequency Fstop2 = 770000; % Second Stopband Frequency Dstop1 = 0.001; % First Stopband Attenuation Dpass = 0.0057563991496; % Passband Ripple Dstop2 = 0.001; % Second Stopband Attenuation dens = 20; % Density Factor % Calculate the order from the parameters using FIRPMORD.","[N, Fo, Ao, W] = firpmord([Fstop1 Fpass1 Fpass2 Fstop2]/(Fs/2), [0 1 ... 0], [Dstop1 Dpass Dstop2]); % Calculate the coefficients using the FIRPM function.","b = firpm(N, Fo, Ao, W, {dens}); Hd = dfilt.dffir(b); % [EOF] AND: function Hd = filterhp1 %FILTERHP1 Returns a discrete-time filter object.","% % MATLAB Code % Generated by MATLAB(R) 7.11.1 and the Signal Processing Toolbox 6.14.% % Generated on: 26-May-2011 09:41:35 % % Equiripple Highpass filter designed using the FIRPM function.","% All frequency values are in Hz.","Fs = 50000; % Sampling Frequency Fstop = 200; % Stopband Frequency Fpass = 400; % Passband Frequency Dstop = 0.0001; % Stopband Attenuation Dpass = 0.057501127785; % Passband Ripple dens = 20; % Density Factor % Calculate the order from the parameters using FIRPMORD.","[N, Fo, Ao, W] = firpmord([Fstop, Fpass]/(Fs/2), [0 1], [Dstop, Dpass]); % Calculate the coefficients using the FIRPM function.","b = firpm(N, Fo, Ao, W, {dens}); Hd = dfilt.dffir(b); % [EOF] AND: function Hd = filterlp1 %FILTERLP1 Returns a discrete-time filter object.","% % MATLAB Code % Generated by MATLAB(R) 7.11.1 and the Signal Processing Toolbox 6.14.% % Generated on: 25-May-2011 08:41:18 % % Equiripple Lowpass filter designed using the FIRPM function.","% All frequency values are in Hz.","Fs = 50000; % Sampling Frequency Fpass = 5; % Passband Frequency Fstop = 100; % Stopband Frequency Dpass = 0.057501127785; % Passband Ripple Dstop = 0.01; % Stopband Attenuation dens =20; % Density Factor % Calculate the order from the parameters using FIRPMORD.","[N, Fo, Ao, W] = firpmord([Fpass, Fstop]/(Fs/2), [1 0], [Dpass, Dstop]); % Calculate the coefficients using the FIRPM function.","b = firpm(N, Fo, Ao, W, {dens}); Hd = dfilt.dffir(b); % [EOF] AND: function Hd = filterlp2 %FILTERLP2 Returns a discrete-time filter object.","% % MATLAB Code % Generated by MATLAB(R) 7.11.1 and the Signal Processing Toolbox 6.14.% % Generated on: 26-May-2011 09:40:31 % % Equiripple Lowpass filter designed using the FIRPM function.","% All frequency values are in Hz.","Fs = 50000; % Sampling Frequency Fpass = 400; % Passband Frequency Fstop = 600; % Stopband Frequency Dpass = 0.057501127785; % Passband Ripple Dstop = 0.0001; % Stopband Attenuation dens = 20; % Density Factor % Calculate the order from the parameters using FIRPMORD.","[N, Fo, Ao, W] = firpmord([Fpass, Fstop]/(Fs/2), [1 0], [Dpass, Dstop]); % Calculate the coefficients using the FIRPM function.","b = firpm(N, Fo, Ao, W, {dens}); Hd = dfilt.dffir(b); % [EOF] A few factors can influence the outcome of the simulation.","For example, the outcome is heavily dependent on the level of the inserted signal versus the level of the noise.","If the noise level of the system is higher than that assumed in the above simulation, due, for example, to the noise figure of the receiver involved, or due to the adjacent digital channels having enough carrier drift to place them slightly closer to the inserted signal(s), then the signal-to-noise (hereinafter sometimes S/N) margin is decreased and the measurement may be compromised.","However, as mentioned before, all that need be done to compensate for this is to use a combination of increasing the number of samples in the window and increasing the sample rate until the issue is resolved.","The system is robust against these possible issues.","This robustness is accomplished by using the best possible noise figure for the receiver, as well as by processing as many samples as possible to maximize the S/N ratio.","Since a single inserted CW carrier can be interfered with by a narrow band ingress signal in the same frequency, it is further contemplated to insert a second CW carrier at the same amplitude as the first but offset in frequency in order to gain more certainty that the signal(s) being detected is (are) the one(s) being inserted, and not an off-air ingress event.","By comparing the detection results of two or more well-matched inserted signals, the user may be more confident not only of the detected level, but also that the signals being detected are the inserted CW carriers.","This method also permits the user to choose the spacing between the inserted CW carriers which can be varied, for example, from cable system operator to cable system operator, to provide a unique “tag” to distinguish one cable system from another using a different spacing, for example, in overbuilt situations.","Since the signals will be swept with known spacing across the sample bandwidth enough to ensure detection, care must be taken to make sure the separation of the two (or more) CW frequencies is great enough that the wrong signal is not detected in either (any) one of the two (or more) detectors, even after all system frequency offsets and drifts are factored in.","Although the inserted signal(s) is (are) described as CW signals, sweeping it (them) through 2 to 3 Hz as described is essentially frequency modulation.","Other modulations of the inserted signals may be employed without adversely affecting detectability.","For example, a 1 or 2 Hz amplitude modulation can be placed on the inserted signal without affecting detectability.","In other cases, AM, FM or phase modulation is performed using a predetermined modulation sequence to cause spreading of the inserted signal to reduce inserted signal accuracy issues in the same way as is being addressed in the described embodiment using the 2 to 3 Hz sweep.","Another method for detecting the low level tag utilizes the same A/D converter.","However, instead of changing the sample rate of the incoming data, the incoming data rate remains unchanged.","In this embodiment, noise suppression is achieved by applying a large scale FFT, for example, one on the order of 32 Ksamples in size or larger to the incoming data.","The exact size of the FFT is not important.","There is no upper limit, other than the capacity of the hardware with which the method is implemented.","An FFT of 32 Ksamples in size produces a suitable C/N margin for the inserted CW signals.","Simulation using Matlab® software has produced good results with sizes at or above 32 Ksamples being used.","Increasing the number of samples beyond 32 Ksamples improves the C/N margin, up to the storage and precision limits of the hardware that is used to implement the design.","The FFT output is basically a full frequency spectrum representation of the samples obtained from the A/D converter.","The method according to this embodiment then looks at the FFT output for more or less equal amplitude CW signals at the programmed frequency separation from each other in the spectrum.","The spacing of the signals from each other can be programmed over some practical range and used as a unique identification for systems which are overbuilt, in a manner similar to the AM tagging scheme described in, for example, U.S. Pat.","No.","5,608,428.The frequency location issues described above in connection with the first method which required sweeping the signal through the detection bandwidth, do not exist with this method.","This makes the headend equipment/transmitter simpler than would be required by the first method.","Those issues do not exist with this method by virtue of the frequency spectrum analysis since the spectrum will identify the signals regardless of exactly where they occur.","All that is necessary is to scan the FFT output for, and locate, more or less equal amplitude pulses at the programmed frequency separation from each other regardless of where they appear in the spectrum to insure that they are the inserted carriers by virtue of the spacing between them and their substantially equal amplitudes.","If these criteria are not met, the signal will not be interpreted as detected leakage by the system.","If these criteria are met, the signal will be interpreted as detected leakage by the system.","The primary advantage of this method is that it permits the use of lower sample rate data, which reduces the size, cost, and power consumption of the circuit required to analyze the data.","Also, by removing the previously described frequency error problem which attended the first method, the size, cost and power consumption were reduced, not only for the field piece but also for the headend equipment as well.","A block diagram of the tagger 31 is illustrated in FIGS.","2a-g.","Referring first to FIG.","2a, the tagger board 30 includes a microcontroller (hereinafter sometimes μC) 32 providing: switch controls for switching between a digital channel tagging environment and an analog channel tagging environment; four phase locked loop (hereinafter sometimes PLL) Lock Detects; an attenuator latch enable and low voltage attenuator latch enable; a PLL Clock output and low voltage copy; a PLL Data output and low voltage copy; a PLL Latch Enable output and four PLL low voltage Latch Enables; an RF board power source; and a Common Ground Connection.","The tagger board 30 further includes a digital-to-analog converter (hereinafter sometimes DAC) 34 whose output is an analog tag for coupling to the tagger 31's RF board, FIGS.","2b-g.","The tagger 31 includes circuits for tagging an analog channel with an analog tag in the manner taught by, inter glia, U.S. Pat.","No.","5,608,428.These circuits include a controllable switch 33 (FIG.","2c) having an analog channel input port 34 with +60 dBmV maximum input amplitude and a frequency f, 107 MHz≤f≤157.5 MHz.","Switch 33 also includes a CW signal input port 36, a switch control 1 input port 38 and a switch control 2 input port 40 from μC 32.Switch 33 illustratively is a Peregrine Semiconductor type PE4280 75Ω terminating SPDT switch.","A 16 MHz reference oscillator 42 (FIG.","2b) has an output port 44 coupled to an input port 46 of a PLL 48.Other input ports 50, 52 and 54, respectively, of PLL 48 are coupled to DATA 3.3V, CLocK 3.3V and PLL 48 LoadEnable 3.3V.","An output port 60 of PLL 48 is coupled to an input port 62 of a Voltage Controlled Oscillator (hereinafter sometimes VCO) 64.PLL 48 illustratively is an Analog Devices ADF4116 PLL having a 3.125 KHz step.","PLL 48 also outputs at a port 65 a PLL1 LOCK DETECT signal to μC 32.An output port 66 of VCO 64 is coupled to an input port 68 of an amplifier 70.An output port 72 of amplifier 70 is coupled to an input port 74 of a digital attenuator 76 and to a phase detect input port 78 of PLL 48.Amplifier 70 illustratively is a Sirenza Microdevices type SGC-2363 amplifier.","Other input ports 80, 82, 84, respectively, of digital attenuator 76 are coupled to DATA 3.3V, CLK 3.3V and ATTeNuator 2-LE 3.3V.","An output port 86 of digital attenuator 76 is coupled to an input port 88 of an amplifier 90.Digital attenuator 76 illustratively is a Peregrine Semiconductor type PE43701 digital attenuator.","Amplifier 90 illustratively is an RF Micro Devices type CXE1089Z amplifier.","An output port 92 of amplifier 90 is coupled to an input port 94 of a low pass filter 96 (fc=160 MHz).","An output port 98 of filter 96 is coupled to port 36 of switch 33.An output port 102 of switch 33 is coupled to an input port 104 of a voltage controlled attenuator (hereinafter sometimes VCA) 106.Another input port 108 of VCA 106 is coupled to an output port of the μC board 30's D/A converter 34.An output port 110 of VCA 106 is coupled to an input port 112 of an amplifier 114.An output port 116 of amplifier 114 is coupled to an input port 118 of a low pass filter 120 (fc=160 MHz).","Amplifier 90 illustratively is an RF Micro Devices type CXE1089Z amplifier.","VCA 106 illustratively is an RF Micro Devices type RFSA3013 voltage controlled attenuator.","An output port 122 of filter 120 provides an analog channel tagged output of +40 dBmV to +60 dBmV at frequency f, 107 MHz≤f≤157.5 MHz.","The tagged signal may either be a CW signal (when the switches of switch 33 are in one position) or a tagged analog channel signal (when the switches of switch 33 are in another position).","The tagger 31 also includes circuits for placing the described CW tag(s) between digital channels.","Referring to FIGS.","2d-e, the output port 44 of 16 MHz reference oscillator 42 is coupled to input ports 120, 122, 124, 126, respectively, of PLLs 128, 130, 132, 134.PLL 128 has additional input ports 136, 138 and 140 which are coupled, respectively, to DATA2.5V, CLK2.5V and PLL2-LE2.5V.","PLL 130 has additional input ports 137, 139 and 141 which are coupled, respectively, to DATA2.5V, CLK2.5V and PLL3-LE2.5V.","Each of PLLs 128, 130 illustratively is a Texas Instruments LMX2485E low power dual PLL with a 156.25 Hz step.","Only one PLL of each LMX2485E IC is used.","Output ports 144, 146 of PLL 128 respectively supply tuning voltage to an input port 147 of a VCO 148 and PLL 2 LOCK DETECT to μC 32.Output ports 150, 152 of PLL 130 respectively supply tuning voltage to an input port 153 of a VCO 154 and PLL 3 LOCK DETECT to μC 32.VCOs 148, 154 illustratively are Maxim type MAX2606 VCOs.","An output port 156 of VCO 148 provides frequency/phase feedback to PLL 128.An output port 158 of VCO 148 is coupled to an input port 160 of a fixed attenuator pad 161.An output port 163 of VCO 154 provides frequency/phase feedback to PLL 130.An output port 164 of VCO 154 is coupled to an input port 166 of a variable attenuator 168, illustratively a Peregrine Semiconductor type PE43601 digital attenuator.","Additional input ports 170, 172, 174, respectively, of variable attenuator 168 receive DATA3.3V, CLK3.3V and ATTN2-LE3.3V signals from μC 32.The output ports 162 and 178 of fixed attenuator pad 161 and variable attenuator 168 are coupled to input ports 180, 182 of a resistive combiner 184 to combine the signals from fixed attenuator pad 161 and variable attenuator 168 in the manner to be described in connection with FIGS.","8 and 9.An output port 186 of combiner 184 is coupled to an input port 188 of a variable attenuator 189, illustratively a Peregrine Semiconductor type PE43601 digital attenuator.","Additional ports 190, 192, 194, respectively, of variable attenuator pad 189 receive DATA3.3V, CLK3.3V and ATTN2-LE3.3V signals from μC 32.An output port 196 of variable attenuator pad 189 is coupled to an input port 198 (FIG.","2f) of an amplifier 200, illustratively an RF Micro Devices type CXE1089Z amplifier.","An output port 202 of amplifier 200 is coupled to an input port 204 of a low pass filter 206 (fc=160 MHz).","An output port 208 of filter 206 is coupled to an input port 209 of an amplifier 210, illustratively an Analog Devices type CXE1089Z amplifier.","An output port 212 of amplifier 210 is coupled to an input port 214 of the low pass filter section 216 (fc=300 MHz) of a diplex filter 218.Referring to FIG.","2e, PLL 132 has additional input ports 220, 222 and 224 which are coupled, respectively, to DATA3.3V, CLK3.3V and PLL4-LE3.3V.","PLL 134 has additional input ports 228, 230 and 232 which are coupled, respectively, to DATA2.5V, CLK2.5V and PLL5-LE2.5V with a 156.25 Hz step.","PLLs 132, 134 illustratively are Texas Instruments LMX2351LQ1515E PLLs.","An output port 236 of PLL 132 supplies PLL 4 LOCK DETECT to μC 32.An output port 238 of PLL 134 supplies PLL 5 LOCK DETECT to μC 32.An output port 240 of PLL 132 is coupled to an input port 242 of a fixed attenuator pad 244.An output port 246 of PLL 134 is coupled to an input port 248 of a variable attenuator 250, illustratively a Peregrine Semiconductor type PE43601 digital attenuator.","Additional ports 252, 254, 256, respectively, of variable attenuator 250 receive DATA3.3V, CLK3.3V and ATTN2-LE3.3V signals from μC 32.The output ports 258, 260 of fixed attenuator pad 244 and variable attenuator 250 are coupled to respective input ports 262 and 263 of a resistive combiner 265.An output port 267 of combiner 265 is coupled to an input port 269 of a low pass filter 264 (fc=800 MHz).","An output port 266 of filter 264 is coupled to an input port 271 of an amplifier 268, illustratively an RF Micro Devices type CXE1089Z amplifier.","An output port 270 of amplifier 268 is coupled to an input port 272 (FIG.","2f) of the high pass filter section 274 (fc=300 MHz) of diplex filter 218.An output port 276 of filter 218 is coupled to an input port 278 of a digital attenuator 280, illustratively, a Peregrine Semiconductor PE4304 digital attenuator.","Additional input ports 282, 284, 286, respectively, of variable attenuator 280 receive DATA2.5V, CLK2.5V and OUTputATTeNuator-LE2.5V signals from μC 32.An output port 290 of attenuator 280 is coupled to an input port 292 of a switch 294, illustratively, a Peregrine Semiconductor type PE4270 switch.","A digital channel tag of +20 to +40 dBmV, 138 MHz to 142 MHz or 746 MHz to 762 MHz, of the type described herein is thus provided at an output port 296 of switch 294.Switch 294 also includes a port 298 for receiving RF OUTput control signal from μC 32.A block diagram of the tag receiver is illustrated in FIGS.","3a-g. As illustrated there, and as described in greater detail in U.S. Ser.","No.","61/592,195, the disclosure of which is hereby incorporated herein by reference, the tag receiver μC board 336 (FIG.","3a) includes: two digital-to-analog converter (hereinafter sometimes DAC) outputs; an Antenna Select feature; a Band Select feature; an RF Enable feature; an RF board Identity Resistor input that permits the μC 338 on board 336 to identify the type of RF board to which the μC board 336 is coupled, based upon the output from the identity resistor(s); a PLL Clock output; a PLL Data output; a PLL Latch Enable output; an RF board power source input; and a Common Ground Connection.","The μC board 336 further includes a field programmable gate array (hereinafter sometimes FPGA) 340, and an analog-to-digital converter (hereinafter sometimes ADC) 342 for receiving IF output from the tag receiver's RF board and A/D converting the IF for processing by the FPGA 340 and coupling to the μC 338.Although described in greater detail in U.S. Ser.","No.","61/592,195, in summary, IF from the tag receiver's RF board is analog-to-digital converted by the ADC 342.The ADC 342 outputs are processed by the FPGA 340 as described in U.S. Ser.","No.","61/592,195.The results of the processing are provided to the μC 338 for further processing, display, and storage.","The μC 338 determines which of the antenna inputs is in use via the Antenna Select.","The DAC outputs are used to tune an input filter of a low frequency band.","The Band Select output determines which of the RF input bands is active.","The RF Enable is used to turn the RF board on or off depending on the use of the device.","As noted above, the RF board Identity Resistor input indicates to the μC 338 which revision of RF board the μC board 336 is coupled to, in case there are differences between RF board revisions that might affect the control of the RF board.","The PLL Clock output, the PLL Data output and PLL Latch Enable control the RF frequency.","The RF board power source provides the power necessary to activate all of the circuitry contained on the RF board.","The Common Ground Connection is a common reference for signals shared between the μC and RF boards.","Referring now particularly to FIG.","3b, a first antenna 400 such as, for example, a so-called “rubber ducky” antenna, is coupled through electrostatic discharge protection (hereinafter sometimes ESD protection) 402 which may be, for example, a Raychem PESD0603 bi-directional ESD protector, to an input port 404 of a switch 406 which may be, for example, a Hittite Microwave Corporation HMC545 switch.","A second antenna 408, here a mobile mount antenna, is coupled through ESD protection 410 which may be, for example, a Raychem PESD0603 bi-directional ESD protector, to another input port 412 of switch 406.The position of switch 406 thus determines which antenna 400, 408 will be the source of the signal for further processing.","An output port 414 of switch 406 is coupled to an input port 416 of a switch 418 which may be, for example, a Hittite Microwave Corporation HMC545 switch.","An output port 420 of switch 418 is coupled to an input port 422 of a bandpass filter 424 such as, for example, a TriQuint part number 856866 surface acoustic wave (hereinafter sometimes SAW) filter having a 756 MHz center frequency and a 20 MHz bandwidth.","The signal supplied to port 422 will have a frequency in the range of about 746 MHz to 762 MHz.","Another output port 426 of switch 418 is coupled to an input port 428 of a tunable bandpass filter 430 such as, for example, a varactor tuned LC bandpass filter having an adjustable center frequency in the range of 138 MHz to 142 MHz.","The signal supplied to port 428 will have a frequency in this range.","Referring now to FIGS.","3b-c, the output port 432 of bandpass filter 424 is coupled to an input port 434 of an RF amplifier 436 which may be, for example, an RF Micro Devices SGC4563 amplifier.","An output port 438 of amplifier 436 is coupled to an input port 440 of a bandpass filter 442 such as, for example, a TriQuint part number 856866 SAW filter having a 756 MHz center frequency and a 20 MHz bandwidth.","An output port 444 of filter 442 is coupled to an input port 445 of an RF amplifier 446 which may be, for example, an RF Micro Devices SGC2463 amplifier.","An output port 447 of amplifier 446 is coupled to an input port 448 of a switch 450 which may be, for example, a Hittite Microwave Corporation HMC545 switch.","Continuing to refer to FIGS.","3b-c, an output port 452 of filter 430 is coupled to an input port 454 of an RF amplifier 456 which may be, for example, an RF Micro Devices SGC4563 amplifier.","An output port 458 of amplifier 456 is coupled to an input port 460 of a bandpass filter 462 such as, for example, an Oscilent part 813-SL140.0M-05 bandpass filter having a 142 MHz center frequency and a 4.8 MHz bandwidth.","An output port 464 of filter 462 is coupled to an input port 466 of an RF amplifier 468 such as, for example, an RF Micro Devices SGC2463 amplifier.","An output port 469 of amplifier 468 is coupled to an input port 470 of switch 450.The circuitry described so far is thus capable of receiving and processing signals in the 746-762 MHz band as well as in the 138-142 MHz band.","The positions of the switches 418, 450 determine which of these bands is passed for further processing.","Referring now to FIGS.","3c-d, an output port 472 of switch 450 is coupled to an input port 474 of a mixer 476 which may be, for example, a Mini-Circuits ADE-2 mixer.","Referring to FIG.","3e, the local oscillator (hereinafter sometimes LO) signal for mixer 476 is provided from a dual PLL IC 478 such as, for example, an Analog Devices ADF4208 dual RF PLL frequency synthesizer.","Input ports 480, 482, 484 of PLL IC 478 receive PLL-DATA, PLL-CLocK and PLL-LatchEnable signals, respectively, from μC 338.Referring to FIG.","3f, an OSCillator input port 488 of PLL IC 478 receives oscillator signal from an output port 489 of a reference oscillator 490 such as, for example, a Vectron VT-803-FAJ-5070-16M0000000 16 MHz reference oscillator IC.","Output from the PLL IC 478 to the μC 338 is provided through a PLL lock detect output port 492.Referring back to FIG.","3e, an IF-PLL2 output port 494 of PLL IC 478 is coupled to an input port 495 of a PLL loop filter #1, 496.An output port 498 of filter 496 is coupled to an input port 499 of a voltage controlled oscillator 500 which may be, for example, a Maxim MAX2606 VCO.","An output port 502 of VCO 500 is coupled to an input port 504 of an amplifier 506 which may be, for example, a Maxim MAX2471 differential output VCO buffer amplifier.","An output port 508 of amplifier 506 is coupled to an input port 510, FIGS.","3d-e, of an RF amplifier 512 such as, for example, an RF Micro Devices SGC2463 amplifier.","An output port 514 of amplifier 512 is coupled to an input port 516 of mixer 476.In HighBand mode, a signal having a frequency in the 431 MHz to 447 MHz range is provided to port 516.In the LowBand mode, a signal having a frequency in the 453 MHz to 457 MHz range is provided to port 516.Another output port 518 of amplifier 506 is coupled to a phase lock input port 520 of PLL IC 478.An output port 522 of mixer 476 is coupled to an input port 524 of a 375 MHz LC lowpass filter 526.An output port 528 of filter 526 is coupled to an input port 530 of an RF amplifier 532 which may be, for example, an RF Micro Devices SGC2463 amplifier.","An output port 534 of amplifier 532 is coupled to an input port 536 of a bandpass filter 538 such as, for example, an EPCOS B3792 315 MHz center frequency, 300 KHz bandwidth SAW filter.","An output port 540 of filter 538 is coupled to an input port 544 of an RF amplifier 546 such as, for example, an RF Micro Devices SGC2463 amplifier.","An output port 548 of amplifier 546 is coupled to an input port 550 of a mixer 552 such as, for example, a Mini-Circuits ADE-2 mixer.","Referring back to FIG.","3f, an RF-PLL2 output port 554 of PLL IC 478 is coupled to an input port 556 of a PLL loop filter #2, 558.An output port 560 of filter 558 is coupled to an input port 562 of a voltage controlled oscillator 564 which may be, for example, a Maxim MAX2606 VCO.","An output port 566 of VCO 564 is coupled to an input port 568 of an amplifier 570 which may be, for example, a Maxim MAX2471 differential output VCO buffer amplifier.","An output port 572 of amplifier 570 is coupled to an input port 574 (FIGS.","3d and 3f) of an RF amplifier 576 such as, for example, an RF Micro Devices SGC2463 amplifier.","An output port 578 of amplifier 576 is coupled to an input port 580 (FIGS.","3d and 3g) of mixer 552.The signal supplied to port 580 has a frequency of 325.7 MHz.","Another output port 582 (FIG.","3f) of amplifier 570 is coupled to a phase lock input port 584 of PLL IC 478.Referring now to FIG.","3g, an output port 586 of mixer 552 is coupled to an input port 588 of a 25 MHz LC lowpass filter 590.An output port 592 of filter 590 is coupled to an input port 594 of an RF amplifier 596 such as, for example, an Analog Devices AD8001 video amplifier.","An output port 598 of amplifier 596 is coupled to an input port 600 of a bandpass filter 602 having a 10.7 MHz center frequency and a 15 KHz bandwidth.","Illustratively, bandpass filter 602 is an ECS-10.7-15B, four pole 10.7 MHz crystal filter.","An output port 604 of filter 602 is coupled to an input port 606 of an RF amplifier 608 such as, for example, an Analog Devices AD8001 video amplifier.","An output port 610 of amplifier 608 is coupled to an input port 612 of a bandpass filter 614 having a 10.7 MHz center frequency and a 15 KHz bandwidth.","Illustratively, bandpass filter 614 is an ECS-10.7-15B, four pole 10.7 MHz crystal filter.","The 10.7 MHz signal appearing at an output port 616 of filter 614 is coupled to a 10.7 MHz input port 618 on the μC 338, FIG.","3a.","FIG.","4 illustrates a system level block diagram.","As illustrated in FIG.","4, the existing cable system signals may be digital, analog, or mixed.","The tagger 31 of the present invention is typically located at the headend 650 of the cable plant 652 so that signal leakage from the cable plant 652 will include the continuous wave (hereinafter sometimes CW) signals inserted between digital channels by the tagger 31.FIG.","5 illustrates an example of insertion of two CW signals 654, 656 into the notch 43 dB below channel signal level 658 between two adjacent digital channels 660, 662.So, at the tagger 31, the tag signals 654, 656 are inserted into digital signal channel plans at about −43 dB.","Illustratively the inserted tag signals 654, 656 are of the same amplitude or in a known amplitude ratio or relationship, and spaced apart a known frequency from each other.","Thus, when the cable plant 652 leaks signal into the environment, the tag signals 654, 656 will be present in the leak.","The signals may be at or below the tag receiver noise floor due, for example, to the relatively small magnitude of the leak, or to the leak being observed from a distance.","The mobile receiver 657 employs one of at least two different analysis methods to detect the tag signals 654, 656.The illustrated methods are convolution and FFT analysis.","Both of these methods reduce the noise floor by employing a large sample window of the signal.","The convolution method is illustrated in FIG.","6.According to this method, the received RF is converted 661 to IF having a bandwidth (hereinafter sometimes BW) ≥100 KHz.","The IF is analog-to-digital converted 663, for example, to 1.6 megasamples/sec.","(hereinafter sometimes Msps) and upsampled 664, for example, ×100, to, for example, 160 Msps.","This digital signal is then convolved 666 against a ≥20 Ksample A/D converted window of the particular CW frequency or frequencies 654, 656 with which the digital channels 660, 662 are tagged.","If a single signal 654 is used for tagging, only one convolution 666 is required.","If two tagging signals 654, 656 are used, two convolutions 666 are required, and so on.","The output of the convolution method is quite highly frequency selective (˜±1Hz BW) and thus requires the tagger 31 to sweep the A/D converted tag signal(s) sample(s) through the bandwidth of the receiver at a known rate to be detected.","The convolution method thus produces pulses at the known sweep rate as the A/D converted tag signal is swept through the detection bandwidth.","This will be true for each detector used.","The noise floor required for comparison can be obtained from the output of the detector when no pulse is present.","The pulse train produced by the convolution method must rise above a known threshold when compared to the noise floor of the pulse train.","Additionally, the convolution method requires a check of the remaining known (implicit) signal attributes, namely, equal or nearly equal amplitude and known sweep rate.","If either of these additional signal attributes is not detected, the received signal is considered to be a noise signal rather than a leakage signal.","The frequency separation criteria are met by using two detectors with spacing matching the frequency spacing produced by the tagger 31.The FFT method is illustrated in FIG.","7.According to this method, the received RF is converted 670 to IF having a bandwidth ≤15 kHz.","The IF is then analog-to-digital converted 672 (illustratively, to 80 Ksps) and is passed through a, for example, ≥32 Kpoint FFT 674.The output of the FFT method includes all of the signals 654, 656 inserted by the tagger 31 regardless of location.","Thus the signal does not need to be swept.","Rather, the tag signal 654, 656 can be detected by a sweeping analysis of the data to find the tag signals 654, 656 wherever they may be.","The FFT method produces a frequency spectrum similar to the output 654, 656 of the tagger 31.Since only the rough locations of the tag signals 654, 656 are known, all of the possible locations where the signal 654, 656 should be scanned to look for the controllable attributes (signals that rise above a particular threshold when compared to noise, equal or nearly equal amplitude, known frequency separation) of the signal.","FIG.","8 illustrates a simulated FFT method.","The dual CW carriers 654, 656 are identifiable in the middle portion of the spectrum.","This example illustrates dual tag carriers 654, 656 with a frequency separation of 625 Hz.","The method contemplates that the dual tag carriers 654, 656 may be varied by the user among a limited number of frequency separation choices.","This list of choices might, for example, include dual tag carriers 654, 656 with optional 625 Hz and 156.25 Hz spacing.","Of course, the options could include more choices if necessary or desirable.","At present, test systems have 625 Hz and 156.25 Hz as the only options.","Having two tag carriers 654, 656 with two spacing options 625 Hz and 156.25 Hz permits discrimination between two cable systems overbuilt in the same area.","In this situation, the overbuilt systems would use different tag separations, in this example, one 625 Hz separation and the other 156.25 Hz separation.","In the majority of cases, providing two tag carriers with two spacing options will not be a significant limitation since at the leak location one system will likely be radiating comparatively much higher levels than the other, such that only one of the two separations would show up in the FIG.","8 spectrum.","However, in the instances in which the amplitudes of the tags 654, 656 from both systems are nearly the same, the described tagging method will permit discrimination between the sets of carrier tags 654, 656 by the spacing, in this case, either 625 Hz and 156.25 Hz, between the carriers 654, 656.This method may be made even more robust through the addition of an amplitude matching requirement.","For instance, and as illustrated in FIG.","9, a much enlarged view of a detail of the spectrum illustrated in FIG.","8, the detected carriers 654, 656 are not exactly the same amplitude.","The levels 690, 692, respectively, of the carrier 654, 656 peaks fall within a tolerance window which permits a relatively small amount of amplitude variation high or low relative to the other member of the detected carrier pair 654, 656.For example the window might be ±2 dB.","In FIG.","9, the amplitude 690 of carrier 654 at 22.5 dB is about 0.25 dB below the amplitude 692 of carrier 656 and would be considered amplitude matched to the right carrier 656.This is in addition to the carriers 654, 656 being at the correct frequency spacing, again, in the illustrated case, either 625 Hz or 156.25 Hz, including a reasonable tolerance of, for example, ±12 Hz.","Some factors influencing the reliability of the FFT scheme include system noise that approaches the amplitudes of the carrier 654, 656 pair, other overbuilt systems radiating into the environment, and non-system sources of noise radiating at the frequency or frequencies of interest."]],"string":"[\n [\n \"APPARATUS FOR DETECTING LEAKAGE IN DIGITALLY MODULATED SYSTEMS\",\n \"In a method for detecting leakage in a digital cable system, at least one first signal is inserted on the cable system.\",\n \"The at least one first signal has an amplitude multiple tens of dB below the digital channel power of the digital channels carried on the cable system.\",\n \"A second signal containing the first signal is received.\",\n \"The second signal is converted to an intermediate frequency (IF) signal.\",\n \"The IF signal is digitized and samples of the digitized IF signal are obtained.\",\n \"Digitized samples of a third signal at the nominal frequency of the first signal at maximum amplitude converted to the IF are provided.\",\n \"The digitized IF signal and the digitized samples of a third signal at the nominal frequency of the first signal at maximum amplitude converted to the IF are correlated.\",\n \"The presence of the inserted first signal is detected based upon the result of the correlation.\",\n \"In another method, a pair of first signals are inserted on the cable system.\",\n \"The pair of first signals are spaced apart a fixed frequency and with amplitudes multiple tens of dB below the digital channel power of the digital channels carried on the cable system.\",\n \"A second signal containing the first signal is received and converted to an intermediate frequency (IF) signal.\",\n \"The IF signal is digitized, samples of the digitized IF signal are obtained, and a large scale Fast Fourier Transform (FFT) is applied to the samples to generate an FFT output.\",\n \"The FFT output is examined for generally equally sized signals separated from each other by the fixed frequency in the FFT output.\",\n \"If generally equally sized signals separated from each other by the fixed frequency are detected in the FFT output, a decision is made that the second signal represents detected leakage from the digital cable system.\"\n ],\n [\n \"1-35.\",\n \"(canceled) 36.A system for tagging a digital CATV signal, the system comprising: a tag receiver comprising: an antenna configured to receive a wireless signal, first circuitry configured to convert the second signal to an intermediate frequency (IF) signal, second circuitry configured to digitize the IF signal to create a digitized IF signal, and obtain samples of the digitized IF signal, third circuitry configured to apply a large scale Fast Fourier Transform (FFT) to the second signal to generate an FFT output, examine the FFT output for generally equally sized signals separated from each other by a fixed frequency in the FFT output and determine whether the FFT output includes generally equally sized signals separated from each other by the fixed frequency of the FFT output, and fourth circuitry configured to indicate that the second signal represents detected leakage from the digital cable system when the FFT output includes generally equally sized signals separated from each other by the fixed frequency of the FFT output.\",\n \"37.The system of claim 36, further comprising a tag generator configured to insert a pair of signals spaced apart a fixed frequency and with amplitudes multiple tens of dB below a digital channel power of digital channels carried on the digital cable system, wherein the pair of signals are present in the second signal when the FFT output includes generally equally sized signals separated from each other by the fixed frequency of the FFT output.\",\n \"38.The system of claim 37, wherein the tag generator includes a signal combiner configured to be coupled to a CATV plant to place a digital channel tag including the pair of signals on the CATV plant.\",\n \"39.The system of claim 36, wherein the first circuitry comprises a first filter having an input port coupled to the antenna, a first frequency source having an output port coupled to a first mixer, a second filter coupled to an output port of the first mixer and a first input port of a second mixer, a second frequency source coupled to a second input port of the second mixer, and a third filter coupled to an output port of the second mixer.\",\n \"40.The system of claim 36, wherein the fourth circuitry includes a display configured to display a visual indication that the second signal represents detected leakage from the digital cable system when the FFT output includes generally equally sized signals separated from each other by the fixed frequency of the FFT output.\",\n \"41.A system for detecting leakage in a digital cable system, the system comprising: a tag generator configured to insert at least one first signal with an amplitude multiple tens of dB below a digital channel power of digital channels carried on the digital cable system, and a tag receiver comprising: an antenna configured to receive a second signal containing the at least one first signal, first circuitry configured to convert the second signal to an intermediate frequency (IF) signal, second circuitry configured to digitize the IF signal to create a digitized IF signal and obtain samples of the digitized IF signal, and third circuitry configured to provide a set of digitized samples of a third signal at a nominal frequency or nominal frequencies of the at least one first signal at maximum amplitude converted to the IF, correlate the digitized IF signal and the digitized samples of the third signal at the nominal frequency or nominal frequencies of the at least one first signal at maximum amplitude converted to the IF, and detect the presence of the inserted at least one first signal based upon the result of the correlation.\"\n ],\n [\n \" BACKGROUND This invention relates to methods for detecting egress from cable systems that have deployed digital signals.\",\n \"Various types of leakage detection equipment for cable systems are known.\",\n \"There are, for example, the devices illustrated and described in: published U.S. patent applications 2008/0133308; 2008/0033698; and, 2006/0248565; and, U.S. Pat.\",\n \"Nos.\",\n \"7,945,939; 7,788,050; 7,548,201; 7,415,367; 7,395,548; 6,833,859; 6,804,826; 6,801,162; 6,600,515; 6,313,874; 6,018,358; 5,777,662; 5,608,428; and, 4,072,899.The disclosures of the cited references are incorporated herein by reference.\",\n \"No representation is intended by this listing that an exhaustive search of all pertinent prior art has been made or that no better art than that listed exists, and no such representation should be inferred.\",\n \"This listing does not constitute a representation that the material listed is pertinent, and no such representation should be inferred.\"\n ],\n [\n \" SUMMARY A method for detecting leakage in a digital cable system comprises inserting at least one first signal with an amplitude multiple tens of dB below the digital channel power of the digital channels carried on the cable system.\",\n \"The method further comprises receiving a second signal containing the at least one first signal, converting the second signal to an intermediate frequency (IF) signal, digitizing the IF signal, obtaining samples of the digitized IF signal, and providing a set of digitized samples of a third signal at the nominal frequency or frequencies of the at least one first signal at maximum amplitude converted to the IF.\",\n \"The method further comprises correlating the digitized IF signal and the digitized samples of a third signal at the nominal frequency or frequencies of the at least one first signal at maximum amplitude converted to the IF, and detecting the presence of the inserted at least one first signal based upon the result of the correlation.\",\n \"Illustratively, the method further includes sweeping the at least one first signal to promote correlation with the digitized samples of a third signal.\",\n \"Illustratively, sweeping the at least one first signal comprises sweeping the at least one first signal at the transmitting device.\",\n \"Illustratively, sweeping the at least one first signal comprises sweeping the at least one first signal at the receiving device.\",\n \"Illustratively, converting the second signal to an IF signal comprises converting the second signal to an IF signal having a bandwidth of about 100 KHz.\",\n \"Illustratively, converting the second signal to an IF signal comprises converting the second signal to an IF signal having a frequency greater than about 0.2% of the digitizing frequency of the IF.\",\n \"Illustratively, inserting the at least one first signal comprises inserting the at least one first signal below the digital channel signal channel.\",\n \"Illustratively, inserting the at least one first signal comprises inserting the at least one first signal above the digital channel signal channel.\",\n \"Illustratively, detecting the presence of the inserted at least one first signal based upon the result of the correlation comprises detecting the presence of the inserted at least one first signal within an ˜250 ms window.\",\n \"Illustratively, obtaining samples of the digitized IF signal comprises obtaining samples of the digitized IF signal using an A/D converter.\",\n \"Illustratively, obtaining samples of the digitized IF signal comprises obtaining samples of the digitized IF signal using an A/D converter having a first sampling rate and then upsampling the data to a second, higher sample rate.\",\n \"Illustratively, converting the second signal to an IF signal comprises converting the second signal to a 455 KHz IF.\",\n \"According to another aspect, a method for detecting leakage in a digital cable system comprises inserting a pair of first signals spaced apart a fixed frequency and with amplitudes multiple tens of dB below the digital channel power of the digital channels carried on the cable system, receiving a second signal containing the first signals, converting the second signal to an IF signal and digitizing the IF signal; obtaining samples of the digitized IF signal.\",\n \"The method further comprises applying a large scale Fast Fourier Transform (hereinafter sometimes FFT) to the second signal to generate an FFT output, examining the FFT output for generally equally sized signals separated from each other by the fixed frequency in the FFT output, and, if generally equally sized signals separated from each other by the fixed frequency are detected in the FFT output, deciding that the second signal represents detected leakage from the digital cable system.\",\n \"Illustratively, the FFT has a sample size on the order of at least about 32 kilosamples (32 Ksamples).\",\n \"Illustratively, converting the second signal to an IF signal comprises converting the second signal to an IF signal having a bandwidth of about 15 KHz.\",\n \"Illustratively, inserting a pair of first signals spaced apart a fixed frequency comprises inserting the pair of first signals between adjacent digital channel signal channels.\",\n \"Illustratively, obtaining samples of the digitized IF signal comprises obtaining samples of the digitized IF signal using an A/D converter.\",\n \"Illustratively, converting the second signal to an IF signal comprises converting the second signal to a 10.7 MHz IF.\",\n \"According to another aspect, apparatus is provided for tagging a digital CATV signal.\",\n \"The apparatus comprises a controller, a first source of a first frequency and a second source of a second frequency.\",\n \"The first frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to an input port of a first fixed attenuator.\",\n \"The second frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to a first input port of a first variable attenuator.\",\n \"The first variable attenuator further includes a second input port for receiving signals from the controller.\",\n \"An output port of the first fixed attenuator is coupled to a first input port of a first signal combiner.\",\n \"An output port of the first variable attenuator is coupled to a second input port of the first signal combiner to combine the signals from first fixed attenuator and the first variable attenuator at an output port of the first signal combiner.\",\n \"An output port of the first signal combiner is coupled to a CATV plant to place the digital channel tag on the CATV plant.\",\n \"The switch further includes a second input port for receiving signals from the controller.\",\n \"Illustratively, the output port of the first signal combiner is coupled to a first input port of a switch.\",\n \"The switch further includes a second input port for receiving signals from the controller.\",\n \"The digital channel tag is provided at an output port of the switch Illustratively, the output port of the first signal combiner is coupled to an input port of a second variable attenuator.\",\n \"The second variable attenuator further includes a second input port for receiving signals from the controller.\",\n \"An output port of the second variable attenuator is coupled to the first input port of the switch.\",\n \"Illustratively, the first frequency source first input port is coupled to the controller to receive first frequency tuning instructions from the controller.\",\n \"Illustratively, the second frequency source first input port is coupled to the controller to receive second frequency tuning instructions from the controller.\",\n \"Illustratively, the output port of the first signal combiner is coupled to a first input port of a diplex filter.\",\n \"The apparatus further comprises a third frequency source.\",\n \"The third frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to an input port of a second fixed attenuator.\",\n \"The second fixed attenuator includes an output port coupled to a first input port of a second signal combiner.\",\n \"A fourth frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to a first input port of a second variable attenuator.\",\n \"The second variable attenuator further includes a second input port for receiving signals from the controller.\",\n \"An output port of the second signal combiner is coupled to the first input port of the switch.\",\n \"Illustratively, the third frequency source first input port is coupled to the controller to receive third frequency tuning instructions from the controller.\",\n \"Illustratively, the fourth frequency source first input port is coupled to the controller to receive fourth frequency tuning instructions from the controller.\",\n \"According to another aspect, apparatus is provided for determining whether a received signal is a digital CATV tag inserted between adjacent digital CATV channels.\",\n \"The apparatus includes an apparatus input port for receiving the signal, and a first filter having an input port coupled to the apparatus input port.\",\n \"A first mixer has a first input port, a second input port and an output port.\",\n \"A first frequency source has an output port coupled to the first input port of the first mixer.\",\n \"A second filter has an input port coupled to the output port of the first mixer and an output port coupled to a first input port of a second mixer.\",\n \"The second mixer further includes a second input port and an output port.\",\n \"A second frequency source is coupled to the second input port of the second mixer.\",\n \"A third filter has an input port and an output port.\",\n \"The third filter input port is coupled to the output port of the second mixer and the third filter output port is coupled to the apparatus output port.\",\n \"An indication whether the received signal is a digital CATV tag inserted between adjacent digital CATV channels appears at the apparatus output port.\",\n \"Illustratively, the first filter comprises first and fourth filters.\",\n \"The first filter has an input port coupled to a first output port of a first switch.\",\n \"The fourth filter has an input port coupled to a second output port of the first switch.\",\n \"Illustratively, the first filter comprises first and fifth filters.\",\n \"The first filter has an output port coupled to a first input port of a second switch.\",\n \"The fifth filter has an output port coupled to a second input port of the second switch.\",\n \"Illustratively, the second filter having an input port coupled to the output port of the first mixer and an output port coupled to a first input port of a second mixer comprises a second filter having an input port coupled to the output port of the first mixer and a fourth filter having an input port coupled to the output port of the second filter and an output port coupled to the first input port of the second mixer.\",\n \"Illustratively, the third filter comprises a third filter having an input port and an output port and a sixth filter having an input port and an output port.\",\n \"The third filter input port is coupled to the output port of the second mixer.\",\n \"The sixth filter input port is coupled to the output port of the third filter.\",\n \"The sixth filter output port is coupled to the apparatus output port.\",\n \"Illustratively, the sixth filter having an input port and an output port coupled to the apparatus output port comprises a sixth filter and a seventh filter.\",\n \"The sixth filter has an input port coupled to the third filter output port and an output port coupled to an input port of the seventh filter.\",\n \"The seventh filter output port is coupled to the apparatus output port.\"\n ],\n [\n \"CROSS REFERENCE TO RELATED APPLICATIONS This application claims the benefit of the Jun.\",\n \"27, 2011 filing date of U.S. Ser.\",\n \"No.\",\n \"61/501,423, the Nov. 29, 2011 filing date of U.S. Ser.\",\n \"No.\",\n \"61/564,429 and the Jan. 30, 2012 filing date of U.S. Ser.\",\n \"No.\",\n \"61/592,195.The disclosures of U.S. Ser.\",\n \"No.\",\n \"61/501,423, U.S. Ser.\",\n \"No.\",\n \"61/564,429 and U.S. Ser.\",\n \"No.\",\n \"61/592,195 are incorporated herein by reference.\",\n \"BACKGROUND This invention relates to methods for detecting egress from cable systems that have deployed digital signals.\",\n \"Various types of leakage detection equipment for cable systems are known.\",\n \"There are, for example, the devices illustrated and described in: published U.S. patent applications 2008/0133308; 2008/0033698; and, 2006/0248565; and, U.S. Pat.\",\n \"Nos.\",\n \"7,945,939; 7,788,050; 7,548,201; 7,415,367; 7,395,548; 6,833,859; 6,804,826; 6,801,162; 6,600,515; 6,313,874; 6,018,358; 5,777,662; 5,608,428; and, 4,072,899.The disclosures of the cited references are incorporated herein by reference.\",\n \"No representation is intended by this listing that an exhaustive search of all pertinent prior art has been made or that no better art than that listed exists, and no such representation should be inferred.\",\n \"This listing does not constitute a representation that the material listed is pertinent, and no such representation should be inferred.\",\n \"SUMMARY A method for detecting leakage in a digital cable system comprises inserting at least one first signal with an amplitude multiple tens of dB below the digital channel power of the digital channels carried on the cable system.\",\n \"The method further comprises receiving a second signal containing the at least one first signal, converting the second signal to an intermediate frequency (IF) signal, digitizing the IF signal, obtaining samples of the digitized IF signal, and providing a set of digitized samples of a third signal at the nominal frequency or frequencies of the at least one first signal at maximum amplitude converted to the IF.\",\n \"The method further comprises correlating the digitized IF signal and the digitized samples of a third signal at the nominal frequency or frequencies of the at least one first signal at maximum amplitude converted to the IF, and detecting the presence of the inserted at least one first signal based upon the result of the correlation.\",\n \"Illustratively, the method further includes sweeping the at least one first signal to promote correlation with the digitized samples of a third signal.\",\n \"Illustratively, sweeping the at least one first signal comprises sweeping the at least one first signal at the transmitting device.\",\n \"Illustratively, sweeping the at least one first signal comprises sweeping the at least one first signal at the receiving device.\",\n \"Illustratively, converting the second signal to an IF signal comprises converting the second signal to an IF signal having a bandwidth of about 100 KHz.\",\n \"Illustratively, converting the second signal to an IF signal comprises converting the second signal to an IF signal having a frequency greater than about 0.2% of the digitizing frequency of the IF.\",\n \"Illustratively, inserting the at least one first signal comprises inserting the at least one first signal below the digital channel signal channel.\",\n \"Illustratively, inserting the at least one first signal comprises inserting the at least one first signal above the digital channel signal channel.\",\n \"Illustratively, detecting the presence of the inserted at least one first signal based upon the result of the correlation comprises detecting the presence of the inserted at least one first signal within an ˜250 ms window.\",\n \"Illustratively, obtaining samples of the digitized IF signal comprises obtaining samples of the digitized IF signal using an A/D converter.\",\n \"Illustratively, obtaining samples of the digitized IF signal comprises obtaining samples of the digitized IF signal using an A/D converter having a first sampling rate and then upsampling the data to a second, higher sample rate.\",\n \"Illustratively, converting the second signal to an IF signal comprises converting the second signal to a 455 KHz IF.\",\n \"According to another aspect, a method for detecting leakage in a digital cable system comprises inserting a pair of first signals spaced apart a fixed frequency and with amplitudes multiple tens of dB below the digital channel power of the digital channels carried on the cable system, receiving a second signal containing the first signals, converting the second signal to an IF signal and digitizing the IF signal; obtaining samples of the digitized IF signal.\",\n \"The method further comprises applying a large scale Fast Fourier Transform (hereinafter sometimes FFT) to the second signal to generate an FFT output, examining the FFT output for generally equally sized signals separated from each other by the fixed frequency in the FFT output, and, if generally equally sized signals separated from each other by the fixed frequency are detected in the FFT output, deciding that the second signal represents detected leakage from the digital cable system.\",\n \"Illustratively, the FFT has a sample size on the order of at least about 32 kilosamples (32 Ksamples).\",\n \"Illustratively, converting the second signal to an IF signal comprises converting the second signal to an IF signal having a bandwidth of about 15 KHz.\",\n \"Illustratively, inserting a pair of first signals spaced apart a fixed frequency comprises inserting the pair of first signals between adjacent digital channel signal channels.\",\n \"Illustratively, obtaining samples of the digitized IF signal comprises obtaining samples of the digitized IF signal using an A/D converter.\",\n \"Illustratively, converting the second signal to an IF signal comprises converting the second signal to a 10.7 MHz IF.\",\n \"According to another aspect, apparatus is provided for tagging a digital CATV signal.\",\n \"The apparatus comprises a controller, a first source of a first frequency and a second source of a second frequency.\",\n \"The first frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to an input port of a first fixed attenuator.\",\n \"The second frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to a first input port of a first variable attenuator.\",\n \"The first variable attenuator further includes a second input port for receiving signals from the controller.\",\n \"An output port of the first fixed attenuator is coupled to a first input port of a first signal combiner.\",\n \"An output port of the first variable attenuator is coupled to a second input port of the first signal combiner to combine the signals from first fixed attenuator and the first variable attenuator at an output port of the first signal combiner.\",\n \"An output port of the first signal combiner is coupled to a CATV plant to place the digital channel tag on the CATV plant.\",\n \"The switch further includes a second input port for receiving signals from the controller.\",\n \"Illustratively, the output port of the first signal combiner is coupled to a first input port of a switch.\",\n \"The switch further includes a second input port for receiving signals from the controller.\",\n \"The digital channel tag is provided at an output port of the switch Illustratively, the output port of the first signal combiner is coupled to an input port of a second variable attenuator.\",\n \"The second variable attenuator further includes a second input port for receiving signals from the controller.\",\n \"An output port of the second variable attenuator is coupled to the first input port of the switch.\",\n \"Illustratively, the first frequency source first input port is coupled to the controller to receive first frequency tuning instructions from the controller.\",\n \"Illustratively, the second frequency source first input port is coupled to the controller to receive second frequency tuning instructions from the controller.\",\n \"Illustratively, the output port of the first signal combiner is coupled to a first input port of a diplex filter.\",\n \"The apparatus further comprises a third frequency source.\",\n \"The third frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to an input port of a second fixed attenuator.\",\n \"The second fixed attenuator includes an output port coupled to a first input port of a second signal combiner.\",\n \"A fourth frequency source has a first input port, a first output port for supplying signals to the controller, and a second output port coupled to a first input port of a second variable attenuator.\",\n \"The second variable attenuator further includes a second input port for receiving signals from the controller.\",\n \"An output port of the second signal combiner is coupled to the first input port of the switch.\",\n \"Illustratively, the third frequency source first input port is coupled to the controller to receive third frequency tuning instructions from the controller.\",\n \"Illustratively, the fourth frequency source first input port is coupled to the controller to receive fourth frequency tuning instructions from the controller.\",\n \"According to another aspect, apparatus is provided for determining whether a received signal is a digital CATV tag inserted between adjacent digital CATV channels.\",\n \"The apparatus includes an apparatus input port for receiving the signal, and a first filter having an input port coupled to the apparatus input port.\",\n \"A first mixer has a first input port, a second input port and an output port.\",\n \"A first frequency source has an output port coupled to the first input port of the first mixer.\",\n \"A second filter has an input port coupled to the output port of the first mixer and an output port coupled to a first input port of a second mixer.\",\n \"The second mixer further includes a second input port and an output port.\",\n \"A second frequency source is coupled to the second input port of the second mixer.\",\n \"A third filter has an input port and an output port.\",\n \"The third filter input port is coupled to the output port of the second mixer and the third filter output port is coupled to the apparatus output port.\",\n \"An indication whether the received signal is a digital CATV tag inserted between adjacent digital CATV channels appears at the apparatus output port.\",\n \"Illustratively, the first filter comprises first and fourth filters.\",\n \"The first filter has an input port coupled to a first output port of a first switch.\",\n \"The fourth filter has an input port coupled to a second output port of the first switch.\",\n \"Illustratively, the first filter comprises first and fifth filters.\",\n \"The first filter has an output port coupled to a first input port of a second switch.\",\n \"The fifth filter has an output port coupled to a second input port of the second switch.\",\n \"Illustratively, the second filter having an input port coupled to the output port of the first mixer and an output port coupled to a first input port of a second mixer comprises a second filter having an input port coupled to the output port of the first mixer and a fourth filter having an input port coupled to the output port of the second filter and an output port coupled to the first input port of the second mixer.\",\n \"Illustratively, the third filter comprises a third filter having an input port and an output port and a sixth filter having an input port and an output port.\",\n \"The third filter input port is coupled to the output port of the second mixer.\",\n \"The sixth filter input port is coupled to the output port of the third filter.\",\n \"The sixth filter output port is coupled to the apparatus output port.\",\n \"Illustratively, the sixth filter having an input port and an output port coupled to the apparatus output port comprises a sixth filter and a seventh filter.\",\n \"The sixth filter has an input port coupled to the third filter output port and an output port coupled to an input port of the seventh filter.\",\n \"The seventh filter output port is coupled to the apparatus output port.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The invention may best be understood by referring to the following detailed description and accompanying drawings which illustrate the invention.\",\n \"In the drawings: FIG.\",\n \"1 illustrates three signals plotted on the same x axis; FIGS.\",\n \"2a-g illustrate a block diagram of a tagger circuit board; FIGS.\",\n \"3a-g illustrate a block diagram of a tag receiver μC board; FIG.\",\n \"4 illustrates a system level block diagram; FIG.\",\n \"5 illustrates a waveform useful in understanding the invention; FIG.\",\n \"6 illustrates a described method; FIG.\",\n \"7 illustrates another described method; FIG.\",\n \"8 illustrates another waveform useful in understanding the invention; and, FIG.\",\n \"9 illustrates a much enlarged view of a portion of the waveform illustrated in FIG.\",\n \"8.DETAILED DESCRIPTION Broadcasters face tremendous revenue pressure to convert to fully digital systems.\",\n \"This revenue pressure is driving the conversion.\",\n \"Once a system converts, legacy egress detection equipment will no longer accurately detect and identify leakage, and must be replaced by equipment and methods that can reliably detect egress in the digital environment.\",\n \"The described methods are very low cost and are minimally invasive to the broadcast system.\",\n \"The inserted signals are at levels below the detection thresholds of currently deployed broadcast equipment.\",\n \"The described methods permit the broadcaster to utilize the forward, or downstream, bandwidth of the cable system fully, without any dedicated bandwidth requirements.\",\n \"The described systems contemplate the insertion of one or more continuous wave (hereinafter sometimes CW) signals with (an) amplitude(s) multiple tens of dB down, for example, −30 dB down, 40 dB down, and so on, from the digital channel power.\",\n \"The level(s) chosen will be one(s) that provide(s) the user with minimal or no signal impairment.\",\n \"The inserted carrier(s) can be located on either side of the digital signal channel.\",\n \"To detect the presence of the CW signals radiated from the cable system as leakage with the correlation-based detection methods described herein, a leakage receiver will have an IF bandwidth in the range of 100 KHz to receive the CW signal(s) and convert it (them) to (an) IF frequency (frequencies) permitting obtaining of digital samples of the received leakage signal.\",\n \"To detect the presence of the CW signals radiated from the cable system as leakage with the FFT detection method described herein, a leakage receiver will have a very narrow IF bandwidth while still accommodating a realistic amount of signal placement inaccuracy.\",\n \"A 15 KHz bandwidth is currently contemplated as necessary to accommodate analysis of the 700 MHz band to receive the CW signal(s) and convert it (them) to (an) IF frequency (frequencies) permitting obtaining of digital samples of the received signal using the FFT-based detection method described herein.\",\n \"An A/D converter is used to obtain a sample window of the combined ambient noise and CW signal(s).\",\n \"A sample window of a signal at the same frequency as the CW signal at maximum amplitude is then used in a correlation algorithm and compared to the sample window of the digitized received combined ambient noise and CW signal.\",\n \"Given enough continuous samples of both windows, the presence of the inserted CW signal(s) can be detected, even in the presence of noise that is of significantly higher amplitude than the CW signal(s).\",\n \"Certain relationships become apparent.\",\n \"For example, given that the number of samples for the windows can be doubled (allowing for more time), a +6 dB improvement in the perceived carrier-to-noise ratio (hereinafter sometimes C/N) of the CW signal can be achieved.\",\n \"This same effect can be used to advantage if the effective sampling rate can be doubled without increasing the amount of time sampled.\",\n \"So it will be appreciated that if the sampling rate is sufficiently high, allowing for a sufficient number of samples per unit time, the C/N can be improved so that, even if the inserted signal is well below the level of the noise, the inserted signal can still be detected.\",\n \"It is believed that the wider the bandwidth of the combined ambient noise and CW signal(s) the better.\",\n \"This is so because the narrower the bandwidth of the combined samples the more closely the output becomes essentially single frequency.\",\n \"But essentially single frequency is exactly what the CW signal is.\",\n \"Since the inserted CW signal is a single frequency but is potentially lower than the noise in amplitude it becomes practically impossible to detect it reliably.\",\n \"With wider band noise, the coherency to a single frequency becomes less over the total sample window for the noise components but remains essentially unchanged for the inserted CW, making it detectable.\",\n \"It is also believed that the IF of the receiving device must be greater than 0.2% of the sampling frequency in order to be detectable.\",\n \"If the IF of the receiving device is not greater than 0.2% of the sampling frequency, then the detection envelop of the desired signal (the inserted CW carrier) begins to exhibit very low frequency lobes that can no longer be filtered out and still permit the system to remain responsive.\",\n \"IF of the receiving device greater than 0.2% of the sampling frequency is easily achieved by selecting an IF which is an appreciable percentage of the sampling rate.\",\n \"Another observation with this method is that for significant C/N improvements (large sample size), the detection bandwidth becomes quite narrow (on the order of ±1 Hz).\",\n \"This characteristic of the method requires considerable frequency accuracy in the transmitting and receiving devices.\",\n \"This narrow detection bandwidth is not practical for real systems given any number of accuracy detriments which occur normally.\",\n \"However, this accuracy requirements can be mitigated by slowly sweeping the inserted CW carrier(s) across the sample bandwidth (approximately ±1 KHz) in order that there will be alignment, with its resultant correlation, at some point within the approximately ±1 Hz detection bandwidth.\",\n \"A sweep rate of approximately 2 to 3 Hz provides enough of a sample window length to perform the detection.\",\n \"Either the transmitting or receiving device's frequency can be swept to produce this effect.\",\n \"In order for the system to be responsive in a mobile application, the field detection portion of the system must detect the presence of the signal within an ˜250 ms window.\",\n \"Also, in order to achieve adequate signal to noise margin for the measurement, 20-30 Ksamples must be collected.\",\n \"Given the issues cited in the previous paragraph, all of the required samples must fit within the small portion of the time window during which the particular 2 Hz detection bandwidth being observed is swept.\",\n \"So if it is assumed that the sweep rate is 2 Hz and the swept bandwidth will be 2 KHz total, this gives 250 μs (2 Hz/2 KHz=1/1000 of the ˜250 ms window) of time where the frequency will be matched closely enough to be detectable.\",\n \"The peak value of detection will be obtained in the middle 1 Hz of the bandwidth, so enough samples need to be fitted into that window to obtain the detected leak level.\",\n \"This means that 20-30 Ksamples need to be fitted into the ˜125 μs (250 μs/2) window.\",\n \"Thus, the effective sampling rate must be in the ˜160 to ˜240 Msps (20 Ksamples/125 μs≤effective sampling rate≤30 Ksamples/125 μs) range to achieve detection quickly enough.\",\n \"This sampling frequency can be achieved by either sampling at that rate with a high speed A/D converter or using a slower A/D converter and upsampling the data to create the faster sample rate.\",\n \"Since the sampling frequency does not bear any significant relationship to the frequency being detected other than the >0.2% of sampling frequency requirement mentioned earlier, almost any IF, 455 KHz, 10.7 MHz, etc., could be used, as long as it meets the >0.2% of sampling frequency requirement.\",\n \"In the simulation below, 455 KHz was used as the IF, since 455 KHz IF is very common.\",\n \"The filter bandwidth used was sufficiently wide to admit input noise which, as mentioned above, is important to the ability to detect the inserted CW.\",\n \"FIG.\",\n \"1 plots three signals 20, 22, 24 on the same x axis.\",\n \"The x axis can be referred to as number of samples, which for a given sample rate equates to time.\",\n \"The signal 20 is the “noise only” signal with no reference trace inserted and is seen significantly below the other two for most of the graph's x axis.\",\n \"The signal 22 that appears as a trapezoid is the result of the proposed detection algorithm given only the inserted CW reference signal with no noise at all, making signal 22 essentially the ideal detection envelope.\",\n \"The signal 24 is the result given the reference signal 22 and the noise 20 combined as would occur normally.\",\n \"As can clearly be seen from FIG.\",\n \"1, an envelope level 22 well above the “noise” floor 20 with good C/N margin is quickly reached.\",\n \"The simulation results were achieved using the following Matlab® code segments: Fs = 2e6; %sample frequency of the ADC simlength =30000; %number of samples in use Fc =455e3; %actual frequency of inserted signal Fref =455e3; %frequency we are looking for kTB = −174 + 10*log10(48.828125); % assume receiver RBW of 48.828125Hz for a 1024 FFT and 50ohm system fbp = filterbp1; bp = fbp.Numerator; flp = filterlp1; lp1 = flp.Numerator; flp = filterlp2; lp2 = flp.Numerator; fhp = filterhp1; hp1 = fhp.Numerator; s = cos(2*pi*[0:simlength]*Fc/Fs); tx = s*10{circumflex over ( )}((−30 −118 − 10*log10(mean(s.{circumflex over ( )}2)))/20); sref = cos(2*pi*[0:simlength]*Fref/Fs); noise = 2*rand(1,length(tx)+ length(bp)); meannoise = mean(noise); noise = noise−meannoise; ns = noise; % apply wideband noise ns = ns(length(bp):length(bp)+length(tx)−1); ns1 = ns*10{circumflex over ( )}(( kTB − 10*log10(mean(ns.\",\n \"{circumflex over ( )}2)) + 21.4)/20); clear ns; clear noise; clear fbp; clear bp; clear flp; clear fhp; modsq = 0.5 + 0.5*(square([0:length(s)−1]*2000/Fs,50)); modpulse = [zeros(1,5000) ones(1,simlength−10000) zeros(1,5001)]; modsig = modpulse.\",\n \"*sref; % this is the reference waveform for convolution clear modpulse; clear sref; clear modsq; s=tx; clear tx; clear mod1; clear lp2; clear hp1; pksig=filter(lp1,1,abs(xcorr(s,modsig))); pknoise=filter(lp1,1,abs(xcorr(ns1,modsig))); pksignoise=filter(lp1,1,abs(xcorr(s+ns1,modsig))); clear lp1; cndB = 20*log10(abs(pksignoise−pknoise)); AND: function Hd = filterbp1 %FILTERBP1 Returns a discrete-time filter object.\",\n \"% % MATLAB Code % Generated by MATLAB(R) 7.11.1 and the Signal Processing Toolbox 6.14.% % Generated on: 02-Jun-2011 15:45:50 % % Equiripple Bandpass filter designed using the FIRPM function.\",\n \"% All frequency values are in Hz.\",\n \"Fs = 2000000; % Sampling Frequency Fstop1 = 140000; % First Stopband Frequency Fpass1 = 151000; % First Passband Frequency Fpass2 = 759000; % Second Passband Frequency Fstop2 = 770000; % Second Stopband Frequency Dstop1 = 0.001; % First Stopband Attenuation Dpass = 0.0057563991496; % Passband Ripple Dstop2 = 0.001; % Second Stopband Attenuation dens = 20; % Density Factor % Calculate the order from the parameters using FIRPMORD.\",\n \"[N, Fo, Ao, W] = firpmord([Fstop1 Fpass1 Fpass2 Fstop2]/(Fs/2), [0 1 ... 0], [Dstop1 Dpass Dstop2]); % Calculate the coefficients using the FIRPM function.\",\n \"b = firpm(N, Fo, Ao, W, {dens}); Hd = dfilt.dffir(b); % [EOF] AND: function Hd = filterhp1 %FILTERHP1 Returns a discrete-time filter object.\",\n \"% % MATLAB Code % Generated by MATLAB(R) 7.11.1 and the Signal Processing Toolbox 6.14.% % Generated on: 26-May-2011 09:41:35 % % Equiripple Highpass filter designed using the FIRPM function.\",\n \"% All frequency values are in Hz.\",\n \"Fs = 50000; % Sampling Frequency Fstop = 200; % Stopband Frequency Fpass = 400; % Passband Frequency Dstop = 0.0001; % Stopband Attenuation Dpass = 0.057501127785; % Passband Ripple dens = 20; % Density Factor % Calculate the order from the parameters using FIRPMORD.\",\n \"[N, Fo, Ao, W] = firpmord([Fstop, Fpass]/(Fs/2), [0 1], [Dstop, Dpass]); % Calculate the coefficients using the FIRPM function.\",\n \"b = firpm(N, Fo, Ao, W, {dens}); Hd = dfilt.dffir(b); % [EOF] AND: function Hd = filterlp1 %FILTERLP1 Returns a discrete-time filter object.\",\n \"% % MATLAB Code % Generated by MATLAB(R) 7.11.1 and the Signal Processing Toolbox 6.14.% % Generated on: 25-May-2011 08:41:18 % % Equiripple Lowpass filter designed using the FIRPM function.\",\n \"% All frequency values are in Hz.\",\n \"Fs = 50000; % Sampling Frequency Fpass = 5; % Passband Frequency Fstop = 100; % Stopband Frequency Dpass = 0.057501127785; % Passband Ripple Dstop = 0.01; % Stopband Attenuation dens =20; % Density Factor % Calculate the order from the parameters using FIRPMORD.\",\n \"[N, Fo, Ao, W] = firpmord([Fpass, Fstop]/(Fs/2), [1 0], [Dpass, Dstop]); % Calculate the coefficients using the FIRPM function.\",\n \"b = firpm(N, Fo, Ao, W, {dens}); Hd = dfilt.dffir(b); % [EOF] AND: function Hd = filterlp2 %FILTERLP2 Returns a discrete-time filter object.\",\n \"% % MATLAB Code % Generated by MATLAB(R) 7.11.1 and the Signal Processing Toolbox 6.14.% % Generated on: 26-May-2011 09:40:31 % % Equiripple Lowpass filter designed using the FIRPM function.\",\n \"% All frequency values are in Hz.\",\n \"Fs = 50000; % Sampling Frequency Fpass = 400; % Passband Frequency Fstop = 600; % Stopband Frequency Dpass = 0.057501127785; % Passband Ripple Dstop = 0.0001; % Stopband Attenuation dens = 20; % Density Factor % Calculate the order from the parameters using FIRPMORD.\",\n \"[N, Fo, Ao, W] = firpmord([Fpass, Fstop]/(Fs/2), [1 0], [Dpass, Dstop]); % Calculate the coefficients using the FIRPM function.\",\n \"b = firpm(N, Fo, Ao, W, {dens}); Hd = dfilt.dffir(b); % [EOF] A few factors can influence the outcome of the simulation.\",\n \"For example, the outcome is heavily dependent on the level of the inserted signal versus the level of the noise.\",\n \"If the noise level of the system is higher than that assumed in the above simulation, due, for example, to the noise figure of the receiver involved, or due to the adjacent digital channels having enough carrier drift to place them slightly closer to the inserted signal(s), then the signal-to-noise (hereinafter sometimes S/N) margin is decreased and the measurement may be compromised.\",\n \"However, as mentioned before, all that need be done to compensate for this is to use a combination of increasing the number of samples in the window and increasing the sample rate until the issue is resolved.\",\n \"The system is robust against these possible issues.\",\n \"This robustness is accomplished by using the best possible noise figure for the receiver, as well as by processing as many samples as possible to maximize the S/N ratio.\",\n \"Since a single inserted CW carrier can be interfered with by a narrow band ingress signal in the same frequency, it is further contemplated to insert a second CW carrier at the same amplitude as the first but offset in frequency in order to gain more certainty that the signal(s) being detected is (are) the one(s) being inserted, and not an off-air ingress event.\",\n \"By comparing the detection results of two or more well-matched inserted signals, the user may be more confident not only of the detected level, but also that the signals being detected are the inserted CW carriers.\",\n \"This method also permits the user to choose the spacing between the inserted CW carriers which can be varied, for example, from cable system operator to cable system operator, to provide a unique “tag” to distinguish one cable system from another using a different spacing, for example, in overbuilt situations.\",\n \"Since the signals will be swept with known spacing across the sample bandwidth enough to ensure detection, care must be taken to make sure the separation of the two (or more) CW frequencies is great enough that the wrong signal is not detected in either (any) one of the two (or more) detectors, even after all system frequency offsets and drifts are factored in.\",\n \"Although the inserted signal(s) is (are) described as CW signals, sweeping it (them) through 2 to 3 Hz as described is essentially frequency modulation.\",\n \"Other modulations of the inserted signals may be employed without adversely affecting detectability.\",\n \"For example, a 1 or 2 Hz amplitude modulation can be placed on the inserted signal without affecting detectability.\",\n \"In other cases, AM, FM or phase modulation is performed using a predetermined modulation sequence to cause spreading of the inserted signal to reduce inserted signal accuracy issues in the same way as is being addressed in the described embodiment using the 2 to 3 Hz sweep.\",\n \"Another method for detecting the low level tag utilizes the same A/D converter.\",\n \"However, instead of changing the sample rate of the incoming data, the incoming data rate remains unchanged.\",\n \"In this embodiment, noise suppression is achieved by applying a large scale FFT, for example, one on the order of 32 Ksamples in size or larger to the incoming data.\",\n \"The exact size of the FFT is not important.\",\n \"There is no upper limit, other than the capacity of the hardware with which the method is implemented.\",\n \"An FFT of 32 Ksamples in size produces a suitable C/N margin for the inserted CW signals.\",\n \"Simulation using Matlab® software has produced good results with sizes at or above 32 Ksamples being used.\",\n \"Increasing the number of samples beyond 32 Ksamples improves the C/N margin, up to the storage and precision limits of the hardware that is used to implement the design.\",\n \"The FFT output is basically a full frequency spectrum representation of the samples obtained from the A/D converter.\",\n \"The method according to this embodiment then looks at the FFT output for more or less equal amplitude CW signals at the programmed frequency separation from each other in the spectrum.\",\n \"The spacing of the signals from each other can be programmed over some practical range and used as a unique identification for systems which are overbuilt, in a manner similar to the AM tagging scheme described in, for example, U.S. Pat.\",\n \"No.\",\n \"5,608,428.The frequency location issues described above in connection with the first method which required sweeping the signal through the detection bandwidth, do not exist with this method.\",\n \"This makes the headend equipment/transmitter simpler than would be required by the first method.\",\n \"Those issues do not exist with this method by virtue of the frequency spectrum analysis since the spectrum will identify the signals regardless of exactly where they occur.\",\n \"All that is necessary is to scan the FFT output for, and locate, more or less equal amplitude pulses at the programmed frequency separation from each other regardless of where they appear in the spectrum to insure that they are the inserted carriers by virtue of the spacing between them and their substantially equal amplitudes.\",\n \"If these criteria are not met, the signal will not be interpreted as detected leakage by the system.\",\n \"If these criteria are met, the signal will be interpreted as detected leakage by the system.\",\n \"The primary advantage of this method is that it permits the use of lower sample rate data, which reduces the size, cost, and power consumption of the circuit required to analyze the data.\",\n \"Also, by removing the previously described frequency error problem which attended the first method, the size, cost and power consumption were reduced, not only for the field piece but also for the headend equipment as well.\",\n \"A block diagram of the tagger 31 is illustrated in FIGS.\",\n \"2a-g.\",\n \"Referring first to FIG.\",\n \"2a, the tagger board 30 includes a microcontroller (hereinafter sometimes μC) 32 providing: switch controls for switching between a digital channel tagging environment and an analog channel tagging environment; four phase locked loop (hereinafter sometimes PLL) Lock Detects; an attenuator latch enable and low voltage attenuator latch enable; a PLL Clock output and low voltage copy; a PLL Data output and low voltage copy; a PLL Latch Enable output and four PLL low voltage Latch Enables; an RF board power source; and a Common Ground Connection.\",\n \"The tagger board 30 further includes a digital-to-analog converter (hereinafter sometimes DAC) 34 whose output is an analog tag for coupling to the tagger 31's RF board, FIGS.\",\n \"2b-g.\",\n \"The tagger 31 includes circuits for tagging an analog channel with an analog tag in the manner taught by, inter glia, U.S. Pat.\",\n \"No.\",\n \"5,608,428.These circuits include a controllable switch 33 (FIG.\",\n \"2c) having an analog channel input port 34 with +60 dBmV maximum input amplitude and a frequency f, 107 MHz≤f≤157.5 MHz.\",\n \"Switch 33 also includes a CW signal input port 36, a switch control 1 input port 38 and a switch control 2 input port 40 from μC 32.Switch 33 illustratively is a Peregrine Semiconductor type PE4280 75Ω terminating SPDT switch.\",\n \"A 16 MHz reference oscillator 42 (FIG.\",\n \"2b) has an output port 44 coupled to an input port 46 of a PLL 48.Other input ports 50, 52 and 54, respectively, of PLL 48 are coupled to DATA 3.3V, CLocK 3.3V and PLL 48 LoadEnable 3.3V.\",\n \"An output port 60 of PLL 48 is coupled to an input port 62 of a Voltage Controlled Oscillator (hereinafter sometimes VCO) 64.PLL 48 illustratively is an Analog Devices ADF4116 PLL having a 3.125 KHz step.\",\n \"PLL 48 also outputs at a port 65 a PLL1 LOCK DETECT signal to μC 32.An output port 66 of VCO 64 is coupled to an input port 68 of an amplifier 70.An output port 72 of amplifier 70 is coupled to an input port 74 of a digital attenuator 76 and to a phase detect input port 78 of PLL 48.Amplifier 70 illustratively is a Sirenza Microdevices type SGC-2363 amplifier.\",\n \"Other input ports 80, 82, 84, respectively, of digital attenuator 76 are coupled to DATA 3.3V, CLK 3.3V and ATTeNuator 2-LE 3.3V.\",\n \"An output port 86 of digital attenuator 76 is coupled to an input port 88 of an amplifier 90.Digital attenuator 76 illustratively is a Peregrine Semiconductor type PE43701 digital attenuator.\",\n \"Amplifier 90 illustratively is an RF Micro Devices type CXE1089Z amplifier.\",\n \"An output port 92 of amplifier 90 is coupled to an input port 94 of a low pass filter 96 (fc=160 MHz).\",\n \"An output port 98 of filter 96 is coupled to port 36 of switch 33.An output port 102 of switch 33 is coupled to an input port 104 of a voltage controlled attenuator (hereinafter sometimes VCA) 106.Another input port 108 of VCA 106 is coupled to an output port of the μC board 30's D/A converter 34.An output port 110 of VCA 106 is coupled to an input port 112 of an amplifier 114.An output port 116 of amplifier 114 is coupled to an input port 118 of a low pass filter 120 (fc=160 MHz).\",\n \"Amplifier 90 illustratively is an RF Micro Devices type CXE1089Z amplifier.\",\n \"VCA 106 illustratively is an RF Micro Devices type RFSA3013 voltage controlled attenuator.\",\n \"An output port 122 of filter 120 provides an analog channel tagged output of +40 dBmV to +60 dBmV at frequency f, 107 MHz≤f≤157.5 MHz.\",\n \"The tagged signal may either be a CW signal (when the switches of switch 33 are in one position) or a tagged analog channel signal (when the switches of switch 33 are in another position).\",\n \"The tagger 31 also includes circuits for placing the described CW tag(s) between digital channels.\",\n \"Referring to FIGS.\",\n \"2d-e, the output port 44 of 16 MHz reference oscillator 42 is coupled to input ports 120, 122, 124, 126, respectively, of PLLs 128, 130, 132, 134.PLL 128 has additional input ports 136, 138 and 140 which are coupled, respectively, to DATA2.5V, CLK2.5V and PLL2-LE2.5V.\",\n \"PLL 130 has additional input ports 137, 139 and 141 which are coupled, respectively, to DATA2.5V, CLK2.5V and PLL3-LE2.5V.\",\n \"Each of PLLs 128, 130 illustratively is a Texas Instruments LMX2485E low power dual PLL with a 156.25 Hz step.\",\n \"Only one PLL of each LMX2485E IC is used.\",\n \"Output ports 144, 146 of PLL 128 respectively supply tuning voltage to an input port 147 of a VCO 148 and PLL 2 LOCK DETECT to μC 32.Output ports 150, 152 of PLL 130 respectively supply tuning voltage to an input port 153 of a VCO 154 and PLL 3 LOCK DETECT to μC 32.VCOs 148, 154 illustratively are Maxim type MAX2606 VCOs.\",\n \"An output port 156 of VCO 148 provides frequency/phase feedback to PLL 128.An output port 158 of VCO 148 is coupled to an input port 160 of a fixed attenuator pad 161.An output port 163 of VCO 154 provides frequency/phase feedback to PLL 130.An output port 164 of VCO 154 is coupled to an input port 166 of a variable attenuator 168, illustratively a Peregrine Semiconductor type PE43601 digital attenuator.\",\n \"Additional input ports 170, 172, 174, respectively, of variable attenuator 168 receive DATA3.3V, CLK3.3V and ATTN2-LE3.3V signals from μC 32.The output ports 162 and 178 of fixed attenuator pad 161 and variable attenuator 168 are coupled to input ports 180, 182 of a resistive combiner 184 to combine the signals from fixed attenuator pad 161 and variable attenuator 168 in the manner to be described in connection with FIGS.\",\n \"8 and 9.An output port 186 of combiner 184 is coupled to an input port 188 of a variable attenuator 189, illustratively a Peregrine Semiconductor type PE43601 digital attenuator.\",\n \"Additional ports 190, 192, 194, respectively, of variable attenuator pad 189 receive DATA3.3V, CLK3.3V and ATTN2-LE3.3V signals from μC 32.An output port 196 of variable attenuator pad 189 is coupled to an input port 198 (FIG.\",\n \"2f) of an amplifier 200, illustratively an RF Micro Devices type CXE1089Z amplifier.\",\n \"An output port 202 of amplifier 200 is coupled to an input port 204 of a low pass filter 206 (fc=160 MHz).\",\n \"An output port 208 of filter 206 is coupled to an input port 209 of an amplifier 210, illustratively an Analog Devices type CXE1089Z amplifier.\",\n \"An output port 212 of amplifier 210 is coupled to an input port 214 of the low pass filter section 216 (fc=300 MHz) of a diplex filter 218.Referring to FIG.\",\n \"2e, PLL 132 has additional input ports 220, 222 and 224 which are coupled, respectively, to DATA3.3V, CLK3.3V and PLL4-LE3.3V.\",\n \"PLL 134 has additional input ports 228, 230 and 232 which are coupled, respectively, to DATA2.5V, CLK2.5V and PLL5-LE2.5V with a 156.25 Hz step.\",\n \"PLLs 132, 134 illustratively are Texas Instruments LMX2351LQ1515E PLLs.\",\n \"An output port 236 of PLL 132 supplies PLL 4 LOCK DETECT to μC 32.An output port 238 of PLL 134 supplies PLL 5 LOCK DETECT to μC 32.An output port 240 of PLL 132 is coupled to an input port 242 of a fixed attenuator pad 244.An output port 246 of PLL 134 is coupled to an input port 248 of a variable attenuator 250, illustratively a Peregrine Semiconductor type PE43601 digital attenuator.\",\n \"Additional ports 252, 254, 256, respectively, of variable attenuator 250 receive DATA3.3V, CLK3.3V and ATTN2-LE3.3V signals from μC 32.The output ports 258, 260 of fixed attenuator pad 244 and variable attenuator 250 are coupled to respective input ports 262 and 263 of a resistive combiner 265.An output port 267 of combiner 265 is coupled to an input port 269 of a low pass filter 264 (fc=800 MHz).\",\n \"An output port 266 of filter 264 is coupled to an input port 271 of an amplifier 268, illustratively an RF Micro Devices type CXE1089Z amplifier.\",\n \"An output port 270 of amplifier 268 is coupled to an input port 272 (FIG.\",\n \"2f) of the high pass filter section 274 (fc=300 MHz) of diplex filter 218.An output port 276 of filter 218 is coupled to an input port 278 of a digital attenuator 280, illustratively, a Peregrine Semiconductor PE4304 digital attenuator.\",\n \"Additional input ports 282, 284, 286, respectively, of variable attenuator 280 receive DATA2.5V, CLK2.5V and OUTputATTeNuator-LE2.5V signals from μC 32.An output port 290 of attenuator 280 is coupled to an input port 292 of a switch 294, illustratively, a Peregrine Semiconductor type PE4270 switch.\",\n \"A digital channel tag of +20 to +40 dBmV, 138 MHz to 142 MHz or 746 MHz to 762 MHz, of the type described herein is thus provided at an output port 296 of switch 294.Switch 294 also includes a port 298 for receiving RF OUTput control signal from μC 32.A block diagram of the tag receiver is illustrated in FIGS.\",\n \"3a-g. As illustrated there, and as described in greater detail in U.S. Ser.\",\n \"No.\",\n \"61/592,195, the disclosure of which is hereby incorporated herein by reference, the tag receiver μC board 336 (FIG.\",\n \"3a) includes: two digital-to-analog converter (hereinafter sometimes DAC) outputs; an Antenna Select feature; a Band Select feature; an RF Enable feature; an RF board Identity Resistor input that permits the μC 338 on board 336 to identify the type of RF board to which the μC board 336 is coupled, based upon the output from the identity resistor(s); a PLL Clock output; a PLL Data output; a PLL Latch Enable output; an RF board power source input; and a Common Ground Connection.\",\n \"The μC board 336 further includes a field programmable gate array (hereinafter sometimes FPGA) 340, and an analog-to-digital converter (hereinafter sometimes ADC) 342 for receiving IF output from the tag receiver's RF board and A/D converting the IF for processing by the FPGA 340 and coupling to the μC 338.Although described in greater detail in U.S. Ser.\",\n \"No.\",\n \"61/592,195, in summary, IF from the tag receiver's RF board is analog-to-digital converted by the ADC 342.The ADC 342 outputs are processed by the FPGA 340 as described in U.S. Ser.\",\n \"No.\",\n \"61/592,195.The results of the processing are provided to the μC 338 for further processing, display, and storage.\",\n \"The μC 338 determines which of the antenna inputs is in use via the Antenna Select.\",\n \"The DAC outputs are used to tune an input filter of a low frequency band.\",\n \"The Band Select output determines which of the RF input bands is active.\",\n \"The RF Enable is used to turn the RF board on or off depending on the use of the device.\",\n \"As noted above, the RF board Identity Resistor input indicates to the μC 338 which revision of RF board the μC board 336 is coupled to, in case there are differences between RF board revisions that might affect the control of the RF board.\",\n \"The PLL Clock output, the PLL Data output and PLL Latch Enable control the RF frequency.\",\n \"The RF board power source provides the power necessary to activate all of the circuitry contained on the RF board.\",\n \"The Common Ground Connection is a common reference for signals shared between the μC and RF boards.\",\n \"Referring now particularly to FIG.\",\n \"3b, a first antenna 400 such as, for example, a so-called “rubber ducky” antenna, is coupled through electrostatic discharge protection (hereinafter sometimes ESD protection) 402 which may be, for example, a Raychem PESD0603 bi-directional ESD protector, to an input port 404 of a switch 406 which may be, for example, a Hittite Microwave Corporation HMC545 switch.\",\n \"A second antenna 408, here a mobile mount antenna, is coupled through ESD protection 410 which may be, for example, a Raychem PESD0603 bi-directional ESD protector, to another input port 412 of switch 406.The position of switch 406 thus determines which antenna 400, 408 will be the source of the signal for further processing.\",\n \"An output port 414 of switch 406 is coupled to an input port 416 of a switch 418 which may be, for example, a Hittite Microwave Corporation HMC545 switch.\",\n \"An output port 420 of switch 418 is coupled to an input port 422 of a bandpass filter 424 such as, for example, a TriQuint part number 856866 surface acoustic wave (hereinafter sometimes SAW) filter having a 756 MHz center frequency and a 20 MHz bandwidth.\",\n \"The signal supplied to port 422 will have a frequency in the range of about 746 MHz to 762 MHz.\",\n \"Another output port 426 of switch 418 is coupled to an input port 428 of a tunable bandpass filter 430 such as, for example, a varactor tuned LC bandpass filter having an adjustable center frequency in the range of 138 MHz to 142 MHz.\",\n \"The signal supplied to port 428 will have a frequency in this range.\",\n \"Referring now to FIGS.\",\n \"3b-c, the output port 432 of bandpass filter 424 is coupled to an input port 434 of an RF amplifier 436 which may be, for example, an RF Micro Devices SGC4563 amplifier.\",\n \"An output port 438 of amplifier 436 is coupled to an input port 440 of a bandpass filter 442 such as, for example, a TriQuint part number 856866 SAW filter having a 756 MHz center frequency and a 20 MHz bandwidth.\",\n \"An output port 444 of filter 442 is coupled to an input port 445 of an RF amplifier 446 which may be, for example, an RF Micro Devices SGC2463 amplifier.\",\n \"An output port 447 of amplifier 446 is coupled to an input port 448 of a switch 450 which may be, for example, a Hittite Microwave Corporation HMC545 switch.\",\n \"Continuing to refer to FIGS.\",\n \"3b-c, an output port 452 of filter 430 is coupled to an input port 454 of an RF amplifier 456 which may be, for example, an RF Micro Devices SGC4563 amplifier.\",\n \"An output port 458 of amplifier 456 is coupled to an input port 460 of a bandpass filter 462 such as, for example, an Oscilent part 813-SL140.0M-05 bandpass filter having a 142 MHz center frequency and a 4.8 MHz bandwidth.\",\n \"An output port 464 of filter 462 is coupled to an input port 466 of an RF amplifier 468 such as, for example, an RF Micro Devices SGC2463 amplifier.\",\n \"An output port 469 of amplifier 468 is coupled to an input port 470 of switch 450.The circuitry described so far is thus capable of receiving and processing signals in the 746-762 MHz band as well as in the 138-142 MHz band.\",\n \"The positions of the switches 418, 450 determine which of these bands is passed for further processing.\",\n \"Referring now to FIGS.\",\n \"3c-d, an output port 472 of switch 450 is coupled to an input port 474 of a mixer 476 which may be, for example, a Mini-Circuits ADE-2 mixer.\",\n \"Referring to FIG.\",\n \"3e, the local oscillator (hereinafter sometimes LO) signal for mixer 476 is provided from a dual PLL IC 478 such as, for example, an Analog Devices ADF4208 dual RF PLL frequency synthesizer.\",\n \"Input ports 480, 482, 484 of PLL IC 478 receive PLL-DATA, PLL-CLocK and PLL-LatchEnable signals, respectively, from μC 338.Referring to FIG.\",\n \"3f, an OSCillator input port 488 of PLL IC 478 receives oscillator signal from an output port 489 of a reference oscillator 490 such as, for example, a Vectron VT-803-FAJ-5070-16M0000000 16 MHz reference oscillator IC.\",\n \"Output from the PLL IC 478 to the μC 338 is provided through a PLL lock detect output port 492.Referring back to FIG.\",\n \"3e, an IF-PLL2 output port 494 of PLL IC 478 is coupled to an input port 495 of a PLL loop filter #1, 496.An output port 498 of filter 496 is coupled to an input port 499 of a voltage controlled oscillator 500 which may be, for example, a Maxim MAX2606 VCO.\",\n \"An output port 502 of VCO 500 is coupled to an input port 504 of an amplifier 506 which may be, for example, a Maxim MAX2471 differential output VCO buffer amplifier.\",\n \"An output port 508 of amplifier 506 is coupled to an input port 510, FIGS.\",\n \"3d-e, of an RF amplifier 512 such as, for example, an RF Micro Devices SGC2463 amplifier.\",\n \"An output port 514 of amplifier 512 is coupled to an input port 516 of mixer 476.In HighBand mode, a signal having a frequency in the 431 MHz to 447 MHz range is provided to port 516.In the LowBand mode, a signal having a frequency in the 453 MHz to 457 MHz range is provided to port 516.Another output port 518 of amplifier 506 is coupled to a phase lock input port 520 of PLL IC 478.An output port 522 of mixer 476 is coupled to an input port 524 of a 375 MHz LC lowpass filter 526.An output port 528 of filter 526 is coupled to an input port 530 of an RF amplifier 532 which may be, for example, an RF Micro Devices SGC2463 amplifier.\",\n \"An output port 534 of amplifier 532 is coupled to an input port 536 of a bandpass filter 538 such as, for example, an EPCOS B3792 315 MHz center frequency, 300 KHz bandwidth SAW filter.\",\n \"An output port 540 of filter 538 is coupled to an input port 544 of an RF amplifier 546 such as, for example, an RF Micro Devices SGC2463 amplifier.\",\n \"An output port 548 of amplifier 546 is coupled to an input port 550 of a mixer 552 such as, for example, a Mini-Circuits ADE-2 mixer.\",\n \"Referring back to FIG.\",\n \"3f, an RF-PLL2 output port 554 of PLL IC 478 is coupled to an input port 556 of a PLL loop filter #2, 558.An output port 560 of filter 558 is coupled to an input port 562 of a voltage controlled oscillator 564 which may be, for example, a Maxim MAX2606 VCO.\",\n \"An output port 566 of VCO 564 is coupled to an input port 568 of an amplifier 570 which may be, for example, a Maxim MAX2471 differential output VCO buffer amplifier.\",\n \"An output port 572 of amplifier 570 is coupled to an input port 574 (FIGS.\",\n \"3d and 3f) of an RF amplifier 576 such as, for example, an RF Micro Devices SGC2463 amplifier.\",\n \"An output port 578 of amplifier 576 is coupled to an input port 580 (FIGS.\",\n \"3d and 3g) of mixer 552.The signal supplied to port 580 has a frequency of 325.7 MHz.\",\n \"Another output port 582 (FIG.\",\n \"3f) of amplifier 570 is coupled to a phase lock input port 584 of PLL IC 478.Referring now to FIG.\",\n \"3g, an output port 586 of mixer 552 is coupled to an input port 588 of a 25 MHz LC lowpass filter 590.An output port 592 of filter 590 is coupled to an input port 594 of an RF amplifier 596 such as, for example, an Analog Devices AD8001 video amplifier.\",\n \"An output port 598 of amplifier 596 is coupled to an input port 600 of a bandpass filter 602 having a 10.7 MHz center frequency and a 15 KHz bandwidth.\",\n \"Illustratively, bandpass filter 602 is an ECS-10.7-15B, four pole 10.7 MHz crystal filter.\",\n \"An output port 604 of filter 602 is coupled to an input port 606 of an RF amplifier 608 such as, for example, an Analog Devices AD8001 video amplifier.\",\n \"An output port 610 of amplifier 608 is coupled to an input port 612 of a bandpass filter 614 having a 10.7 MHz center frequency and a 15 KHz bandwidth.\",\n \"Illustratively, bandpass filter 614 is an ECS-10.7-15B, four pole 10.7 MHz crystal filter.\",\n \"The 10.7 MHz signal appearing at an output port 616 of filter 614 is coupled to a 10.7 MHz input port 618 on the μC 338, FIG.\",\n \"3a.\",\n \"FIG.\",\n \"4 illustrates a system level block diagram.\",\n \"As illustrated in FIG.\",\n \"4, the existing cable system signals may be digital, analog, or mixed.\",\n \"The tagger 31 of the present invention is typically located at the headend 650 of the cable plant 652 so that signal leakage from the cable plant 652 will include the continuous wave (hereinafter sometimes CW) signals inserted between digital channels by the tagger 31.FIG.\",\n \"5 illustrates an example of insertion of two CW signals 654, 656 into the notch 43 dB below channel signal level 658 between two adjacent digital channels 660, 662.So, at the tagger 31, the tag signals 654, 656 are inserted into digital signal channel plans at about −43 dB.\",\n \"Illustratively the inserted tag signals 654, 656 are of the same amplitude or in a known amplitude ratio or relationship, and spaced apart a known frequency from each other.\",\n \"Thus, when the cable plant 652 leaks signal into the environment, the tag signals 654, 656 will be present in the leak.\",\n \"The signals may be at or below the tag receiver noise floor due, for example, to the relatively small magnitude of the leak, or to the leak being observed from a distance.\",\n \"The mobile receiver 657 employs one of at least two different analysis methods to detect the tag signals 654, 656.The illustrated methods are convolution and FFT analysis.\",\n \"Both of these methods reduce the noise floor by employing a large sample window of the signal.\",\n \"The convolution method is illustrated in FIG.\",\n \"6.According to this method, the received RF is converted 661 to IF having a bandwidth (hereinafter sometimes BW) ≥100 KHz.\",\n \"The IF is analog-to-digital converted 663, for example, to 1.6 megasamples/sec.\",\n \"(hereinafter sometimes Msps) and upsampled 664, for example, ×100, to, for example, 160 Msps.\",\n \"This digital signal is then convolved 666 against a ≥20 Ksample A/D converted window of the particular CW frequency or frequencies 654, 656 with which the digital channels 660, 662 are tagged.\",\n \"If a single signal 654 is used for tagging, only one convolution 666 is required.\",\n \"If two tagging signals 654, 656 are used, two convolutions 666 are required, and so on.\",\n \"The output of the convolution method is quite highly frequency selective (˜±1Hz BW) and thus requires the tagger 31 to sweep the A/D converted tag signal(s) sample(s) through the bandwidth of the receiver at a known rate to be detected.\",\n \"The convolution method thus produces pulses at the known sweep rate as the A/D converted tag signal is swept through the detection bandwidth.\",\n \"This will be true for each detector used.\",\n \"The noise floor required for comparison can be obtained from the output of the detector when no pulse is present.\",\n \"The pulse train produced by the convolution method must rise above a known threshold when compared to the noise floor of the pulse train.\",\n \"Additionally, the convolution method requires a check of the remaining known (implicit) signal attributes, namely, equal or nearly equal amplitude and known sweep rate.\",\n \"If either of these additional signal attributes is not detected, the received signal is considered to be a noise signal rather than a leakage signal.\",\n \"The frequency separation criteria are met by using two detectors with spacing matching the frequency spacing produced by the tagger 31.The FFT method is illustrated in FIG.\",\n \"7.According to this method, the received RF is converted 670 to IF having a bandwidth ≤15 kHz.\",\n \"The IF is then analog-to-digital converted 672 (illustratively, to 80 Ksps) and is passed through a, for example, ≥32 Kpoint FFT 674.The output of the FFT method includes all of the signals 654, 656 inserted by the tagger 31 regardless of location.\",\n \"Thus the signal does not need to be swept.\",\n \"Rather, the tag signal 654, 656 can be detected by a sweeping analysis of the data to find the tag signals 654, 656 wherever they may be.\",\n \"The FFT method produces a frequency spectrum similar to the output 654, 656 of the tagger 31.Since only the rough locations of the tag signals 654, 656 are known, all of the possible locations where the signal 654, 656 should be scanned to look for the controllable attributes (signals that rise above a particular threshold when compared to noise, equal or nearly equal amplitude, known frequency separation) of the signal.\",\n \"FIG.\",\n \"8 illustrates a simulated FFT method.\",\n \"The dual CW carriers 654, 656 are identifiable in the middle portion of the spectrum.\",\n \"This example illustrates dual tag carriers 654, 656 with a frequency separation of 625 Hz.\",\n \"The method contemplates that the dual tag carriers 654, 656 may be varied by the user among a limited number of frequency separation choices.\",\n \"This list of choices might, for example, include dual tag carriers 654, 656 with optional 625 Hz and 156.25 Hz spacing.\",\n \"Of course, the options could include more choices if necessary or desirable.\",\n \"At present, test systems have 625 Hz and 156.25 Hz as the only options.\",\n \"Having two tag carriers 654, 656 with two spacing options 625 Hz and 156.25 Hz permits discrimination between two cable systems overbuilt in the same area.\",\n \"In this situation, the overbuilt systems would use different tag separations, in this example, one 625 Hz separation and the other 156.25 Hz separation.\",\n \"In the majority of cases, providing two tag carriers with two spacing options will not be a significant limitation since at the leak location one system will likely be radiating comparatively much higher levels than the other, such that only one of the two separations would show up in the FIG.\",\n \"8 spectrum.\",\n \"However, in the instances in which the amplitudes of the tags 654, 656 from both systems are nearly the same, the described tagging method will permit discrimination between the sets of carrier tags 654, 656 by the spacing, in this case, either 625 Hz and 156.25 Hz, between the carriers 654, 656.This method may be made even more robust through the addition of an amplitude matching requirement.\",\n \"For instance, and as illustrated in FIG.\",\n \"9, a much enlarged view of a detail of the spectrum illustrated in FIG.\",\n \"8, the detected carriers 654, 656 are not exactly the same amplitude.\",\n \"The levels 690, 692, respectively, of the carrier 654, 656 peaks fall within a tolerance window which permits a relatively small amount of amplitude variation high or low relative to the other member of the detected carrier pair 654, 656.For example the window might be ±2 dB.\",\n \"In FIG.\",\n \"9, the amplitude 690 of carrier 654 at 22.5 dB is about 0.25 dB below the amplitude 692 of carrier 656 and would be considered amplitude matched to the right carrier 656.This is in addition to the carriers 654, 656 being at the correct frequency spacing, again, in the illustrated case, either 625 Hz or 156.25 Hz, including a reasonable tolerance of, for example, ±12 Hz.\",\n \"Some factors influencing the reliability of the FFT scheme include system noise that approaches the amplitudes of the carrier 654, 656 pair, other overbuilt systems radiating into the environment, and non-system sources of noise radiating at the frequency or frequencies of interest.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870971"}}},{"rowIdx":4493687,"cells":{"text":{"kind":"list like","value":[["SYSTEMS AND METHODS FOR ASSISTING TWO TERMINALS TO ESTABLISH CONNECTIONS THEREBETWEEN","The present disclosure relates to systems and methods for assisting two terminals to establish connections therebetween.","The systems may perform the methods to receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal; receive second electronic signals including second structured data encoding an identification of a third terminal; and send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal."],["1.A system of electronic device configured to operating an online transportation service platform, comprising: a bus; one or more storage media electronically connected to the bus, comprising a set of instructions for assisting two other terminals to establish connections therebetween; and logic circuits configured to communicate with the one or more storage media via the bus, wherein when executing the set of instructions, the logic circuits are directed to: receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal; receive second electronic signals including second structured data encoding an identification of a third terminal; and send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.","2.The system of claim 1, wherein the first terminal is associated with a vehicle, the second terminal is associated with a transportation service provider, and the third terminal is associated with a transportation service requestor; and the logic circuits are further directed to determine that the service provider is providing a transportation service to the service requestor.","3.The system of claim 1, wherein the first structured data includes a first portion encoding an identification of the first terminal, and a second portion encoding connection information of the first terminal; and the third structured data includes a first portion encoding an identification of the third terminal, and a second portion encoding the terminal information.","4.The system of claim 3, wherein the connection information includes an authorization code to enable the first terminal to accept a connection request from the third terminal.","5.The system of claim 1, wherein the third structured data include a third portion encoding a command to direct the third terminal to initiate a process to establish a communication connection with the first terminal based on the terminal information of the first terminal.","6.The system of claim 5, wherein the communication connection between the third terminal and the first terminal is limited to unidirectional sending multimedia data from the third terminal to the first terminal.","7.The system of claim 1, wherein the first terminal is included in the second terminal.","8.A method implemented on a computing device having one or more processors and one or more storage media, the method comprising: receiving, by the one or more processors, first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal; receiving, by the one or more processors, second electronic signals including second structured data encoding an identification of a third terminal; and sending, by the one or more processors, third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.","9.The method of claim 8, wherein the first terminal is associated with a vehicle, the second terminal is associated with a transportation service provider, and the third terminal is associated with a transportation service requestor; and the method further comprising: determining, by the one or more processors, that the service provider is providing a transportation service to the service requestor.","10.The method of claim 8, wherein the first structured data includes a first portion encoding an identification of the first terminal, and a second portion encoding connection information of the first terminal; and the third structured data includes a first portion encoding an identification of the third terminal, and a second portion encoding the terminal information.","11.The method of claim 10, wherein the connection information includes an authorization code to enable the first terminal to accept a connection request from the third terminal.","12.The method of claim 8, wherein the third structured data include a third portion encoding a command to direct the third terminal to initiate a process to establish a communication connection with the first terminal based on the connection information of the first terminal.","13.The method of claim 12, wherein the communication connection between the third terminal and the first terminal is limited to unidirectional sending multimedia data from the third terminal to the first terminal.","14-20.","(canceled) 21.An electronic terminal, comprising: one or more storage media comprising a set of instructions for connecting to another terminal device associated with an on-demand transportation platform; and one or more processors configured to communicate with the one or more storage media, wherein when executing the set of instructions, the one or more processors are directed to: receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal; and generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.","22.The electronic terminal of claim 21, wherein the computer server is associated with an online on-demand transportation service platform; the target terminal is associated with a terminal of a transportation service provider who is providing a transportation service to a user of the electronic terminal.","23.The electronic terminal of claim 21, wherein the first structured data includes: a first portion encoding an identification of the target terminal, and a second portion encoding connection information of the target terminal.","24.The electronic terminal of claim 23, wherein the connection information includes an authorization code to enable the target terminal to accept a connection request from the electronic terminal.","25.The electronic terminal of claim 21, the one or more processors are further directed to: access the one or more storage media to read multimedia contents stored therein; encode the multimedia contents to second structured data; and send third electronic signals encoding the second structured data to the target terminal via the communication connection.","26.The electronic terminal of claim 21, wherein the communication connection between the electronic terminal and the target terminal is limited to unidirectional sending multimedia data from the electronic terminal to the target terminal.","27.The electronic terminal of claim 21, wherein to initiate the communication connection between the target terminal and the electronic terminal the one or more processors are directed to: send, to the target terminal, fourth electronic signals encoding a request of connecting the target terminal with the electronic terminal based on the terminal information of the target terminal; receive, from the target terminal, fifth electronic signals encoding a response of agreeing to connect the target terminal with the electronic terminal; and establish the communication connection between the target terminal and the electronic terminal based on the response.","28-40.","(canceled)"],[" BACKGROUND On-demand transportation services utilizing Internet technology, such as online taxi-hailing services, have become increasingly popular because of their convenience.","While traveling towards his/her destination in a taxi, a passenger may wish to listen to music or watch videos on his/her smartphone.","However, a phone call or a message may interrupt the music playing or video playing, and the passenger may have to hold the smartphone for long time if the time of the videos are long.","Therefore, sometimes it is inconvenient for the requestor to listen to the music or watch the videos on the smartphone in the taxi.","In addition, the above situation may also increase power consumption and reduce use of time of the requestor terminal.","Therefore, it is desirable to provide systems and methods for assisting the requestor terminal to establish connections with another terminal that can play multimedia in the requestor terminal."],[" SUMMARY Additional features will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and the accompanying drawings or may be learned by production or operation of the examples.","The features of the present disclosure may be realized and attained by practice or use of various aspects of the methodologies, instrumentalities and combinations set forth in the detailed examples discussed below.","According to a first aspect of the present disclosure, a system of electronic device may include one or more storage media and one or more processors configured to communicate with the one or more storage media.","The one or more storage media may include a set of instructions for assisting two other terminals to establish connections therebetween.","When the one or more processors executing the set of instructions, the one or more processors may be directed to perform one or more of the following operations.","The one or more processors may receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal.","The one or more processors may receive second electronic signals including second structured data encoding an identification of a third terminal.","The one or more processors may send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.","In some embodiments, the first terminal may be associated with a vehicle, the second terminal may be associated with a transportation service provider, and the third terminal may be associated with a transportation service requestor.","In some embodiments, the one or more processors may determine that the service provider is providing a transportation service to the service requestor.","In some embodiments, the first structured data may include a first portion encoding an identification of the first terminal, and a second portion encoding connection information of the first terminal.","In some embodiments, the third structured data may include a first portion encoding an identification of the third terminal, and a second portion encoding the terminal information.","In some embodiments, the connection information may include an authorization code to enable the first terminal to accept a connection request from the third terminal.","In some embodiments, the third structured data may include a third portion encoding a command to direct the third terminal to initiate a process to establish a communication connection with the first terminal based on the terminal information of the first terminal.","In some embodiments, the communication connection between the third terminal and the first terminal may be limited to unidirectional sending multimedia data from the third terminal to the first terminal.","In some embodiments, the first terminal may be included in the second terminal.","According to a second aspect of the present disclosure, a method may include one or more of the following operations.","One or more processors of an online on-demand transportation service platform may receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal.","The one or more processors may receive second electronic signals including second structured data encoding an identification of a third terminal.","The one or more processors may send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.","According to a third aspect of the present disclosure, a non-transitory computer readable medium may comprise at least one set of instructions for assisting two other terminals to establish connections therebetween.","The at least one set of instructions may be executed by one or more processors of a computer server.","The one or more processors may receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal.","The one or more processors may receive second electronic signals including second structured data encoding an identification of a third terminal.","The one or more processors may send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.","In some embodiments, the first terminal may be associated with a vehicle, the second terminal may be associated with a transportation service provider, and the third terminal may be associated with a transportation service requestor.","In some embodiments, the one or more processors may determine that the service provider is providing a transportation service to the service requestor.","In some embodiments, the first structured data may include a first portion encoding an identification of the first terminal, and a second portion encoding connection information of the first terminal.","In some embodiments, the third structured data may include a first portion encoding an identification of the third terminal, and a second portion encoding the terminal information.","In some embodiments, the connection information may include an authorization code to enable the first terminal to accept a connection request from the third terminal.","In some embodiments, the third structured data may include a third portion encoding a command to direct the third terminal to initiate a process to establish a communication connection with the first terminal based on the terminal information of the first terminal.","In some embodiments, the communication connection between the third terminal and the first terminal may be limited to unidirectional sending multimedia data from the third terminal to the first terminal.","In some embodiments, the first terminal may be included in the second terminal.","According to a fourth aspect of the present disclosure, a system of electronic device may include one or more storage media and one or more processors configured to communicate with the one or more storage media.","The one or more storage media may include a set of instructions for connecting to another terminal device associated with an on-demand transportation platform.","When the one or more processors executing the set of instructions, the one or more processors may be directed to perform one or more of the following operations.","The one or more processors may receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal.","The one or more processors may generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.","In some embodiments, the computer server may be associated with an online on-demand transportation service platform, and the target terminal may be associated with a terminal of a transportation service provider who is providing a transportation service to a user of the electronic terminal.","In some embodiments, the first structured data may include a first portion encoding an identification of the target terminal, and a second portion encoding connection information of the target terminal.","In some embodiments, the connection information may include an authorization code to enable the target terminal to accept a connection request from the electronic terminal.","In some embodiments, the one or more processors may access the one or more storage media to read multimedia contents stored therein.","The one or more processors may encode the multimedia contents to second structured data.","The one or more processors may send third electronic signals encoding the second structured data to the target terminal via the communication connection.","In some embodiments, the communication connection between the electronic terminal and the target terminal may be limited to unidirectional sending multimedia data from the electronic terminal to the target terminal.","In some embodiments, the one or more processors may send, to the target terminal, fourth electronic signals encoding a request of connecting the target terminal with the electronic terminal based on the terminal information of the target terminal.","The one or more processors may receive, from the target terminal, fifth electronic signals encoding a response of agreeing to connect the target terminal with the electronic terminal.","The one or more processors may establish the communication connection between the target terminal and the electronic terminal based on the response.","According to a fifth aspect of the present disclosure, a method may include one or more of the following operations.","One or more processors of an electronic device may receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal.","The one or more processors may generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.","According to a sixth aspect of the present disclosure, a non-transitory computer readable medium may comprise at least one set of instructions for connecting to another terminal device associated with an on-demand transportation platform.","The at least one set of instructions may be executed by one or more processors of an electronic device.","The one or more processors may receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal.","The one or more processors may generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.","In some embodiments, the computer server may be associated with an online on-demand transportation service platform, and the target terminal may be associated with a terminal of a transportation service provider who is providing a transportation service to a user of the electronic terminal.","In some embodiments, the first structured data may include a first portion encoding an identification of the target terminal, and a second portion encoding connection information of the target terminal.","In some embodiments, the connection information may include an authorization code to enable the target terminal to accept a connection request from the electronic terminal.","In some embodiments, the one or more processors may access the one or more storage media to read multimedia contents stored therein.","The one or more processors may encode the multimedia contents to second structured data.","The one or more processors may send third electronic signals encoding the second structured data to the target terminal via the communication connection.","In some embodiments, the communication connection between the electronic terminal and the target terminal may be limited to unidirectional sending multimedia data from the electronic terminal to the target terminal.","In some embodiments, the one or more processors may send, to the target terminal, fourth electronic signals encoding a request of connecting the target terminal with the electronic terminal based on the terminal information of the target terminal.","The one or more processors may receive, from the target terminal, fifth electronic signals encoding a response of agreeing to connect the target terminal with the electronic terminal.","The one or more processors may establish the communication connection between the target terminal and the electronic terminal based on the response."],["CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of International Application No.","PCT/CN2017/083747, filed on May 10, 2017, which claims priority to Chinese Application No.","201611113978.4 filed on Dec. 6, 2016, the contents of which are incorporated herein by reference in its entirety.","TECHNICAL FIELD The present disclosure generally relates to systems and methods for on-demand services, and in particular, systems and methods for assisting two terminals to establish connections therebetween.","BACKGROUND On-demand transportation services utilizing Internet technology, such as online taxi-hailing services, have become increasingly popular because of their convenience.","While traveling towards his/her destination in a taxi, a passenger may wish to listen to music or watch videos on his/her smartphone.","However, a phone call or a message may interrupt the music playing or video playing, and the passenger may have to hold the smartphone for long time if the time of the videos are long.","Therefore, sometimes it is inconvenient for the requestor to listen to the music or watch the videos on the smartphone in the taxi.","In addition, the above situation may also increase power consumption and reduce use of time of the requestor terminal.","Therefore, it is desirable to provide systems and methods for assisting the requestor terminal to establish connections with another terminal that can play multimedia in the requestor terminal.","SUMMARY Additional features will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and the accompanying drawings or may be learned by production or operation of the examples.","The features of the present disclosure may be realized and attained by practice or use of various aspects of the methodologies, instrumentalities and combinations set forth in the detailed examples discussed below.","According to a first aspect of the present disclosure, a system of electronic device may include one or more storage media and one or more processors configured to communicate with the one or more storage media.","The one or more storage media may include a set of instructions for assisting two other terminals to establish connections therebetween.","When the one or more processors executing the set of instructions, the one or more processors may be directed to perform one or more of the following operations.","The one or more processors may receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal.","The one or more processors may receive second electronic signals including second structured data encoding an identification of a third terminal.","The one or more processors may send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.","In some embodiments, the first terminal may be associated with a vehicle, the second terminal may be associated with a transportation service provider, and the third terminal may be associated with a transportation service requestor.","In some embodiments, the one or more processors may determine that the service provider is providing a transportation service to the service requestor.","In some embodiments, the first structured data may include a first portion encoding an identification of the first terminal, and a second portion encoding connection information of the first terminal.","In some embodiments, the third structured data may include a first portion encoding an identification of the third terminal, and a second portion encoding the terminal information.","In some embodiments, the connection information may include an authorization code to enable the first terminal to accept a connection request from the third terminal.","In some embodiments, the third structured data may include a third portion encoding a command to direct the third terminal to initiate a process to establish a communication connection with the first terminal based on the terminal information of the first terminal.","In some embodiments, the communication connection between the third terminal and the first terminal may be limited to unidirectional sending multimedia data from the third terminal to the first terminal.","In some embodiments, the first terminal may be included in the second terminal.","According to a second aspect of the present disclosure, a method may include one or more of the following operations.","One or more processors of an online on-demand transportation service platform may receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal.","The one or more processors may receive second electronic signals including second structured data encoding an identification of a third terminal.","The one or more processors may send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.","According to a third aspect of the present disclosure, a non-transitory computer readable medium may comprise at least one set of instructions for assisting two other terminals to establish connections therebetween.","The at least one set of instructions may be executed by one or more processors of a computer server.","The one or more processors may receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal.","The one or more processors may receive second electronic signals including second structured data encoding an identification of a third terminal.","The one or more processors may send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.","In some embodiments, the first terminal may be associated with a vehicle, the second terminal may be associated with a transportation service provider, and the third terminal may be associated with a transportation service requestor.","In some embodiments, the one or more processors may determine that the service provider is providing a transportation service to the service requestor.","In some embodiments, the first structured data may include a first portion encoding an identification of the first terminal, and a second portion encoding connection information of the first terminal.","In some embodiments, the third structured data may include a first portion encoding an identification of the third terminal, and a second portion encoding the terminal information.","In some embodiments, the connection information may include an authorization code to enable the first terminal to accept a connection request from the third terminal.","In some embodiments, the third structured data may include a third portion encoding a command to direct the third terminal to initiate a process to establish a communication connection with the first terminal based on the terminal information of the first terminal.","In some embodiments, the communication connection between the third terminal and the first terminal may be limited to unidirectional sending multimedia data from the third terminal to the first terminal.","In some embodiments, the first terminal may be included in the second terminal.","According to a fourth aspect of the present disclosure, a system of electronic device may include one or more storage media and one or more processors configured to communicate with the one or more storage media.","The one or more storage media may include a set of instructions for connecting to another terminal device associated with an on-demand transportation platform.","When the one or more processors executing the set of instructions, the one or more processors may be directed to perform one or more of the following operations.","The one or more processors may receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal.","The one or more processors may generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.","In some embodiments, the computer server may be associated with an online on-demand transportation service platform, and the target terminal may be associated with a terminal of a transportation service provider who is providing a transportation service to a user of the electronic terminal.","In some embodiments, the first structured data may include a first portion encoding an identification of the target terminal, and a second portion encoding connection information of the target terminal.","In some embodiments, the connection information may include an authorization code to enable the target terminal to accept a connection request from the electronic terminal.","In some embodiments, the one or more processors may access the one or more storage media to read multimedia contents stored therein.","The one or more processors may encode the multimedia contents to second structured data.","The one or more processors may send third electronic signals encoding the second structured data to the target terminal via the communication connection.","In some embodiments, the communication connection between the electronic terminal and the target terminal may be limited to unidirectional sending multimedia data from the electronic terminal to the target terminal.","In some embodiments, the one or more processors may send, to the target terminal, fourth electronic signals encoding a request of connecting the target terminal with the electronic terminal based on the terminal information of the target terminal.","The one or more processors may receive, from the target terminal, fifth electronic signals encoding a response of agreeing to connect the target terminal with the electronic terminal.","The one or more processors may establish the communication connection between the target terminal and the electronic terminal based on the response.","According to a fifth aspect of the present disclosure, a method may include one or more of the following operations.","One or more processors of an electronic device may receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal.","The one or more processors may generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.","According to a sixth aspect of the present disclosure, a non-transitory computer readable medium may comprise at least one set of instructions for connecting to another terminal device associated with an on-demand transportation platform.","The at least one set of instructions may be executed by one or more processors of an electronic device.","The one or more processors may receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal.","The one or more processors may generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.","In some embodiments, the computer server may be associated with an online on-demand transportation service platform, and the target terminal may be associated with a terminal of a transportation service provider who is providing a transportation service to a user of the electronic terminal.","In some embodiments, the first structured data may include a first portion encoding an identification of the target terminal, and a second portion encoding connection information of the target terminal.","In some embodiments, the connection information may include an authorization code to enable the target terminal to accept a connection request from the electronic terminal.","In some embodiments, the one or more processors may access the one or more storage media to read multimedia contents stored therein.","The one or more processors may encode the multimedia contents to second structured data.","The one or more processors may send third electronic signals encoding the second structured data to the target terminal via the communication connection.","In some embodiments, the communication connection between the electronic terminal and the target terminal may be limited to unidirectional sending multimedia data from the electronic terminal to the target terminal.","In some embodiments, the one or more processors may send, to the target terminal, fourth electronic signals encoding a request of connecting the target terminal with the electronic terminal based on the terminal information of the target terminal.","The one or more processors may receive, from the target terminal, fifth electronic signals encoding a response of agreeing to connect the target terminal with the electronic terminal.","The one or more processors may establish the communication connection between the target terminal and the electronic terminal based on the response.","BRIEF DESCRIPTION OF THE DRAWINGS The present disclosure is further described in terms of exemplary embodiments.","These exemplary embodiments are described in detail with reference to the drawings.","These embodiments are non-limiting exemplary embodiments, in which like reference numerals represent similar structures throughout the several views of the drawings, and wherein: FIG.","1 is a schematic diagram of an exemplary on-demand service system according to some embodiments of the present disclosure; FIG.","2 is a schematic diagram illustrating an exemplary computing device according to some embodiments of the present disclosure; FIG.","3 is a schematic block diagram illustrating an exemplary processing engine according to some embodiments of the present disclosure; FIG.","4 is a flowchart illustrating an exemplary process for assisting two terminals to establish connections therebetween according to some embodiments of the present disclosure; FIG.","5A is a schematic block diagram illustrating an exemplary third terminal associated with a service requestor according to some embodiments of the present disclosure; FIG.","5B is a flowchart illustrating an exemplary process for establishing a connection between two terminals according to some embodiments of the present disclosure; and FIG.","6 is a flowchart illustrating an exemplary process for initiating a process of establishing a connection between two terminals according to some embodiments of the present disclosure.","DETAILED DESCRIPTION The following description is presented to enable any person skilled in the art to make and use the present disclosure, and is provided in the context of a particular application and its requirements.","Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present disclosure.","Thus, the present disclosure is not limited to the embodiments shown, but is to be accorded the widest scope consistent with the claims.","The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting.","As used herein, the singular forms “a,” “an,” and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise.","It will be further understood that the terms “comprise,” “comprises,” and/or “comprising,” “include,” “includes,” and/or “including,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.","These and other features, and characteristics of the present disclosure, as well as the methods of operation and functions of the related elements of structure and the combination of parts and economies of manufacture, may become more apparent upon consideration of the following description with reference to the accompanying drawings, all of which form a part of this disclosure.","It is to be expressly understood, however, that the drawings are for the purpose of illustration and description only and are not intended to limit the scope of the present disclosure.","It is understood that the drawings are not to scale.","The flowcharts used in the present disclosure illustrate operations that systems implement according to some embodiments of the present disclosure.","It is to be expressly understood, the operations of the flowchart may be implemented not in order.","Conversely, the operations may be implemented in inverted order, or simultaneously.","Moreover, one or more other operations may be added to the flowcharts.","One or more operations may be removed from the flowcharts.","Moreover, while the system and method in the present disclosure is described primarily regarding assiting two terminals to establish connections there between, it should also be understood that this is only one exemplary embodiment.","The system or method of the present disclosure may be applied to any other kind of on demand service.","For example, the system or method of the present disclosure may be applied to transportation systems of different environments including land, ocean, aerospace, or the like, or any combination thereof.","The vehicle of the transportation systems may include a taxi, a private car, a hitch, a bus, a train, a bullet train, a high-speed rail, a subway, a vessel, an aircraft, a spaceship, a hot-air balloon, a driverless vehicle, or the like, or any combination thereof.","The transportation system may also include any transportation system for management and/or distribution, for example, a system for sending and/or receiving an express.","The application of the system or method of the present disclosure may include a web page, a plug-in of a browser, a client terminal, a custom system, an internal analysis system, an artificial intelligence robot, or the like, or any combination thereof.","The term “passenger,” “requestor,” “service requestor,” and “customer” in the present disclosure are used interchangeably to refer to an individual, an entity or a tool that may request or order a service.","Also, the term “driver,” “provider,” “service provider,” and “supplier” in the present disclosure are used interchangeably to refer to an individual, an entity or a tool that may provide a service or facilitate the providing of the service.","The term “user” in the present disclosure may refer to an individual, an entity or a tool that may request a service, order a service, provide a service, or facilitate the providing of the service.","For example, the user may be a passenger, a driver, an operator, or the like, or any combination thereof.","In the present disclosure, “passenger” and “passenger terminal” may be used interchangeably, and “driver” and “driver terminal” may be used interchangeably.","The term “service request” and “order” in the present disclosure are used interchangeably to refer to a request that may be initiated by a passenger, a requestor, a service requestor, a customer, a driver, a provider, a service provider, a supplier, or the like, or any combination thereof.","The service request may be accepted by any one of a passenger, a requestor, a service requestor, a customer, a driver, a provider, a service provider, or a supplier.","The service request may be chargeable or free.","The positioning technology used in the present disclosure may be based on a global positioning system (GPS), a global navigation satellite system (GLONASS), a compass navigation system (COMPASS), a Galileo positioning system, a quasi-zenith satellite system (QZSS), a wireless fidelity (WiFi) positioning technology, or the like, or any combination thereof.","One or more of the above positioning systems may be used interchangeably in the present disclosure.","An aspect of the present disclosure relates to online systems and methods for assisting a smartphone (i.e., a requestor terminal) of a passenger (i.e., a service requestor) to establish connections with a display (i.e., a multimedia player) in a vehicle (e.g., a taxi) of a service provider.","To this end, when the passenger gets into the vehicle, the passenger's smartphone or the driver's smartphone may notify a server of an online on-demand transportation service platform that the passenger is on board, and then the server may send to the smartphone information necessary to connect to the display in the vehicle, such as Bluetooth™ ID and password of that display.","With the ID and password, when the passenger watches a video, the smartphone may automatically connect to the display and send the video data to the display.","As a result, the passenger may enjoy the video without using his/her smart phone.","The technical solution of this disclosure relates to online communication.","Particularly, the technical solution relates to wirelessly sending a third-party's wireless connection information from a server of an online on-demand transportation platform.","The technology and solution rooted only in post-Internet era.","In general, a passenger may listen to music or watch videos on his/her smartphone when the passenger in a vehicle (e.g., a taxi).","If the passenger wants to connect with a display (e.g., a multimedia player or a smartphone of a driver) in the vehicle and listen to music or watch videos in the display, the passenger may ask the driver for the authorization code and/or the identification of the display.","The online on-demand service system, however, may obtain the authorization code and/or the identification of the display and send the authorization code and/or the identification to the smartphone of the passenger.","The smartphone of the passenger can connect with the display automatically based on the received authorization code and/or identification.","Therefore, through the Internet, the online on-demand transportation systems may provide a much more convenient transaction platform to assist the smartphone of the passenger to connect with the display in the vehicle automatically.","FIG.","1 is a schematic diagram of an exemplary on-demand service system 100 according to some embodiments.","For example, the on-demand service system 100 may be an online on-demand transportation service system for transportation services such as taxi hailing, chauffeur services, delivery vehicles, carpool, bus service, driver hiring and shuttle services.","The on-demand service system 100 may include a server 110, a network 120, a requestor terminal 130, a provider terminal 140, a storage 150, a positioning system 160, and a vehicle terminal 170.The server 110 may include a processing engine 112.In some embodiments, the server 110 may be a single server or a server group.","The server group may be centralized, or distributed (e.g., server 110 may be a distributed system).","In some embodiments, the server 110 may be local or remote.","For example, the server 110 may access information and/or data stored in the requestor terminal 130, the provider terminal 140, and/or the storage 150 via the network 120.As another example, the server 110 may be directly connected to the requestor terminal 130, the provider terminal 140, and/or the storage 150 to access stored information and/or data.","In some embodiments, the server 110 may be implemented on a cloud platform.","Merely by way of example, the cloud platform may include a private cloud, a public cloud, a hybrid cloud, a community cloud, a distributed cloud, an inter-cloud, a multi-cloud, or the like, or any combination thereof.","In some embodiments, the server 110 may be implemented on a computing device 200 having one or more components illustrated in FIG.","2 in the present disclosure.","In some embodiments, the server 110 may include a processing engine 112.The processing engine 112 may process information and/or data relating to the service request to perform one or more functions described in the present disclosure.","For example, the processing engine 112 may determine a reference parameter and an actual parameter associated with the service request obtained from the requestor terminal 130.In some embodiments, the processing engine 112 may include one or more processing engines (e.g., single-core processing engine(s) or multi-core processor(s)).","Merely by way of example, the processing engine 112 may include one or more hardware processors, such as a central processing unit (CPU), an application-specific integrated circuit (ASIC), an application-specific instruction-set processor (ASIP), a graphics processing unit (GPU), a physics processing unit (PPU), a digital signal processor (DSP), a field-programmable gate array (FPGA), a programmable logic device (PLD), a controller, a microcontroller unit, a reduced instruction-set computer (RISC), a microprocessor, or the like, or any combination thereof.","The network 120 may facilitate the exchange of information and/or data.","In some embodiments, one or more components in the on-demand service system 100 (e.g., the server 110, the requestor terminal 130, the provider terminal 140, the storage 150, the positioning system 160, and the vehicle terminal 170) may send information and/or data to other component(s) in the on-demand service system 100 via the network 120.For example, the server 110 may obtain/acquire service request from the requestor terminal 130 via the network 120.In some embodiments, the network 120 may be any type of wired or wireless network, or a combination thereof.","Merely by way of example, the network 130 may include a cable network, a wireline network, an optical fiber network, a telecommunications network, an intranet, the Internet, a local area network (LAN), a wide area network (WAN), a wireless local area network (WLAN), a metropolitan area network (MAN), a wide area network (WAN), a public telephone switched network (PSTN), a Bluetooth™ network, a ZigBee network, a near field communication (NFC) network, or the like, or any combination thereof.","In some embodiments, the network 120 may include one or more network access points.","For example, the network 120 may include wired or wireless network access points such as base stations and/or internet exchange points 120-1, 120-2, .",".",".",", through which one or more components of the on-demand service system 100 may be connected to the network 120 to exchange data and/or information.","In some embodiments, a requestor may be a user of the requestor terminal 130.In some embodiments, the user of the requestor terminal 130 may be someone other than the requestor.","For example, a user A of the requestor terminal 130 may use the requestor terminal 130 to send a service request for a user B, or receive service and/or information or instructions from the server 110.In some embodiments, a provider may be a user of the provider terminal 140.In some embodiments, the user of the provider terminal 140 may be someone other than the provider.","For example, a user C of the provider terminal 140 may user the provider terminal 140 to receive a service request for a user D, and/or information or instructions from the server 110.In some embodiments, “requestor” and “requestor terminal” may be used interchangeably, and “provider” and “provider terminal” may be used interchangeably.","In some embodiments, the requestor terminal 130 may include a mobile device 130-1, a tablet computer 130-2, a laptop computer 130-3, a built-in device in a motor vehicle 130-4, or the like, or any combination thereof.","In some embodiments, the mobile device 130-1 may include a smart home device, a wearable device, a mobile device, a virtual reality device, an augmented reality device, or the like, or any combination thereof.","In some embodiments, the smart home device may include a smart lighting device, a control device of an intelligent electrical apparatus, a smart monitoring device, a smart television, a smart video camera, an interphone, or the like, or any combination thereof.","In some embodiments, the wearable device may include a bracelet, footgear, glasses, a helmet, a watch, clothing, a backpack, a smart accessory, or the like, or any combination thereof.","In some embodiments, the mobile device may include a mobile phone, a personal digital assistance (PDA), a gaming device, a navigation device, a point of sale (POS) device, a laptop, a desktop, or the like, or any combination thereof.","In some embodiments, the virtual reality device and/or the augmented reality device may include a virtual reality helmet, a virtual reality glass, a virtual reality patch, an augmented reality helmet, augmented reality glasses, an augmented reality patch, or the like, or any combination thereof.","For example, the virtual reality device and/or the augmented reality device may include a Google Glass™, a RiftCon™, a Fragments™, a Gear VR™, etc.","In some embodiments, a built-in device in the motor vehicle 130-4 may include an onboard computer, an onboard television, etc.","In some embodiments, the requestor terminal 130 may be a device with positioning technology for locating the position of the requestor and/or the requestor terminal 130.In some embodiments, the provider terminal 140 may be a device that is similar to, or the same as the requestor terminal 130.In some embodiments, the provider terminal 140 may be a device utilizing positioning technology for locating the position of a user of the provider terminal 140 (e.g., a service provider) and/or the provider terminal 140.In some embodiments, the requestor terminal 130 and/or the provider terminal 140 may communicate with one or more other positioning devices to determine the position of the requestor, the requestor terminal 130, the provider, and/or the provider terminal 140.In some embodiments, the requestor terminal 130 and/or the provider terminal 140 may send positioning information to the server 110.The storage 150 may store data and/or instructions.","In some embodiments, the storage 150 may store data obtained from the requestor terminal 130 and/or the provider terminal 140.In some embodiments, the storage 150 may store data and/or instructions that the server 110 may execute or use to perform exemplary methods described in the present disclosure.","In some embodiments, storage 150 may include a mass storage, a removable storage, a volatile read-and-write memory, a read-only memory (ROM), or the like, or any combination thereof.","Exemplary mass storage may include a magnetic disk, an optical disk, a solid-state drive, etc.","Exemplary removable storage may include a flash drive, a floppy disk, an optical disk, a memory card, a zip disk, a magnetic tape, etc.","Exemplary volatile read-and-write memory may include a random access memory (RAM).","Exemplary RAM may include a dynamic RAM (DRAM), a double date rate synchronous dynamic RAM (DDR SDRAM), a static RAM (SRAM), a thyrisor RAM (T-RAM), and a zero-capacitor RAM (Z-RAM), etc.","Exemplary ROM may include a mask ROM (MROM), a programmable ROM (PROM), an erasable programmable ROM (EPROM), an electrically-erasable programmable ROM (EEPROM), a compact disk ROM (CD-ROM), and a digital versatile disk ROM, etc.","In some embodiments, the storage 150 may be implemented on a cloud platform.","Merely by way of example, the cloud platform may include a private cloud, a public cloud, a hybrid cloud, a community cloud, a distributed cloud, an inter-cloud, a multi-cloud, or the like, or any combination thereof.","In some embodiments, the storage 150 may be connected to the network 120 to communicate with one or more components in the on-demand service system 100 (e.g., the server 110, the requestor terminal 130, the provider terminal 140, etc.).","One or more components in the on-demand service system 100 may access the data or instructions stored in the storage 150 via the network 120.In some embodiments, the storage 150 may be directly connected to or communicate with one or more components in the on-demand service system 100 (e.g., the server 110, the requestor terminal 130, the provider terminal 140, etc.).","In some embodiments, the storage 150 may be part of the server 110.The positioning system 160 may determine information associated with an object, for example, one or more of the requestor terminal 130, the provider terminal 140, etc.","For example, the positioning system 160 may determine a current location of the requestor terminal 130.In some embodiments, the positioning system 160 may be a global positioning system (GPS), a global navigation satellite system (GLONASS), a compass navigation system (COMPASS), a BeiDou navigation satellite system, a Galileo positioning system, a quasi-zenith satellite system (QZSS), etc.","The information may include a location, an elevation, a velocity, or an acceleration of the object, or a current time.","The location may be in the form of coordinates, such as, latitude coordinate and longitude coordinate, etc.","The positioning system 160 may include one or more satellites, for example, a satellite 160-1, a satellite 160-2, and a satellite 160-3.The satellites 160-1 through 160-3 may determine the information mentioned above independently or jointly.","The satellite positioning system 160 may send the information mentioned above to the network 120, the requestor terminal 130, or the provider terminal 140 via wireless connections.","The vehicle terminal 170 may refer to a terminal associated with a vehicle.","The vehicle terminal 170 may include a built-in device in a vehicle.","The vehicle terminal 170 may include an MP3 player, an MP4 player, a television, a tablet computer, a laptop, a desktop computer, a mobile phone, or the like, or any combination thereof.","In some embodiments, the vehicle terminal 170 may be included in the provider terminal 140.In some embodiments, one or more components in the on-demand service system 100 (e.g., the server 110, the requestor terminal 130, the provider terminal 140, etc.)","may have permission to access the storage 150.In some embodiments, one or more components in the on-demand service system 100 may read and/or modify information relating to the requestor, provider, and/or the public when one or more conditions are met.","For example, the server 110 may read and/or modify one or more users' information after finishing a service.","As another example, the provider terminal 140 may access information relating to the requestor when receiving a service request from the requestor terminal 130, but the provider terminal 140 may not modify the relevant information of the requestor.","In some embodiments, information exchanging of one or more components in the on-demand service system 100 may be achieved by way of requesting a service.","The object of the service request may be any product.","In some embodiments, the product may be a tangible product or an immaterial product.","The tangible product may include food, medicine, commodity, chemical product, electrical appliance, clothing, car, housing, luxury, or the like, or any combination thereof.","The immaterial product may include a servicing product, a financial product, a knowledge product, an internet product, or the like, or any combination thereof.","The internet product may include an individual host product, a web product, a mobile internet product, a commercial host product, an embedded product, or the like, or any combination thereof.","The mobile internet product may be used in a software of a mobile terminal, a program, a system, or the like, or any combination thereof.","The mobile terminal may include a tablet computer, a laptop computer, a mobile phone, a personal digital assistance (PDA), a smart watch, a point of sale (POS) device, an onboard computer, an onboard television, a wearable device, or the like, or any combination thereof.","For example, the product may be any software and/or application used in the computer or mobile phone.","The software and/or application may relate to socializing, shopping, transporting, entertainment, learning, investment, or the like, or any combination thereof.","In some embodiments, the software and/or application relating to transporting may include a traveling software and/or application, a vehicle scheduling software and/or application, a mapping software and/or application, etc.","In the vehicle scheduling software and/or application, the vehicle may include a horse, a carriage, a rickshaw (e.g., a wheelbarrow, a bike, a tricycle, etc.","), a car (e.g., a taxi, a bus, a private car, etc.","), a train, a subway, a vessel, an aircraft (e.g., an airplane, a helicopter, a space shuttle, a rocket, a hot-air balloon, etc.","), or the like, or any combination thereof.","FIG.","2 is a schematic diagram illustrating exemplary hardware and software components of a computing device 200 on which the server 110, the requestor terminal 130, the vehicle terminal 170, and/or the provider terminal 140 may be implemented according to some embodiments of the present disclosure.","For example, the processing engine 112 may be implemented on the computing device 200 and configured to perform functions of the processing engine 112 disclosed in this disclosure.","The computing device 200 may be a general-purpose computer or a special-purpose computer; both may be used to implement an on-demand system for the present disclosure.","The computing device 200 may be used to implement any component of the on-demand service as described herein.","For example, the processing engine 112 may be implemented on the computing device 200, via its hardware, software program, firmware, or a combination thereof.","Although only one such computer is shown, for convenience, the computer functions relating to the on-demand service as described herein may be implemented in a distributed fashion on a number of similar platforms, to distribute the processing load.","The computing device 200, for example, may include COM ports 250 connected to and from a network connected thereto to facilitate data communications.","The computing device 200 may also include a processor 220, in the form of one or more processors, for executing program instructions.","The exemplary computer platform may include an internal communication bus 210, program storage and data storage of different forms, for example, a disk 270, and a read only memory (ROM) 230, or a random access memory (RAM) 240, for various data files to be processed and/or transmitted by the computer.","The exemplary computer platform may also include program instructions stored in the ROM 230, RAM 240, and/or any other type of non-transitory storage medium to be executed by the processor 220.The methods and/or processes of the present disclosure may be implemented as the program instructions.","The computing device 200 also includes an I/O component 260, supporting input/output between the computer and other components therein.","The computing device 200 may also receive programming and data via network communications.","Merely for illustration, only one processor is illustrated in the computing device 200.However, it should be noted that the computing device 200 in the present disclosure may also include multiple processors, thus operations and/or method steps that are performed by one processor as described in the present disclosure may also be jointly or separately performed by the multiple processors.","For example, if in the present disclosure the processor of the computing device 200 executes both step A and step B, it should be understood that step A and step B may also be performed by two different processors jointly or separately in the computing device 200 (e.g., the first processor executes step A and the second processor executes step B, or the first and second processors jointly execute steps A and B).","FIG.","3 is a schematic block diagram illustrating an exemplary processing engine 112 according to some embodiments of the present disclosure.","The processing engine 112 may include a communication module 310, a determination module 320, and a terminal identifying module 330.The communication module 310 may be configured to receive and/or send information related to a first terminal associated with a vehicle (e.g., a vehicle terminal 170 of FIG.","1), a second terminal associated with a service provider (e.g., a provider terminal 140 of FIG.","1) or a third terminal associated with a service requestor (e.g., a requestor terminal 130 of FIG.","1).","In some embodiments, the second terminal may include the first terminal.","In some embodiments, the third terminal (e.g., the service requestor terminal 130) may communicate with the processing engine 112 via an application installed in the third terminal.","The service requestor may send a request for transportation service to the processing engine 112 through the application.","In some embodiments, the transportation service may be a service of taking a subject from one location to another location using a vehicle.","The subject may include passengers and/or goods.","For example, the transportation service may be a taxi service or a delivery service.","The vehicle of the transportation systems may include a taxi, a private car, a hitch, a bus, a bike, an electric bicycle, a tricycle, a motorcycle, a train, a bullet train, a high speed train, a subway, a vessel, an aircraft, a spaceship, a hot-air balloon, a driverless vehicle, or the like, or any combination thereof.","In some embodiments, the service provider may be someone that accepts the request for transportation service from the service requestor and provides the transportation service to the service requestor using the vehicle.","For example, the service provider may be a taxi driver and the service requester may be a passenger requesting a taxi hailing service.","The second terminal (e.g., the service provider terminal 140) may communicate with the processing engine 112 via an application installed in the second terminal.","The service provider may receive the request for transportation service from the processing engine 112 and accept the request for transportation service through the application.","In some embodiments, the communication module 310 may receive terminal information of the first terminal from the second terminal.","In some embodiments, the communication module 310 may send the terminal information of the first terminal to the third terminal.","In some embodiments, the communication module 310 may send a notification to the third terminal to remind the service requestor to establish a connection between the first terminal and the third terminal.","In some embodiments, the connection between the first terminal and the third terminal may include a cable network, a wireline network, an optical fiber network, a telecommunications network, an intranet, the Internet, a local area network (LAN), a wide area network (WAN), a wireless local area network (WLAN), a metropolitan area network (MAN), a wide area network (WAN), a public telephone switched network (PSTN), a Bluetooth™ network, a ZigBee network, a near field communication (NFC) network, an infrared connection, or the like, or any combination thereof.","In some embodiments, the terminal information may include an identification of the first terminal, a connection information, or the like, or any combination thereof.","The connection information may include an authorization code to enable the first terminal to establish a connection with the third terminal.","The determination module 320 may be configured to determine when to send the terminal information of the first terminal to the third terminal.","For example, the determination module 320 may determine that the service provider is providing the transportation service to the service requestor.","The communication module 310 may send the terminal information of the first terminal to the third terminal in response to the determination.","The terminal identifying module 330 may be configured to identify the third terminal.","In some embodiments, the determination result may include an identification of the third terminal.","The terminal identifying module 330 may identify the third terminal based on the identification of the third terminal.","In some embodiments, the information related to the first terminal, the second terminal or the third terminal may be transmitted and/or received using any suitable communication protocol (e.g., the Hypertext Transfer Protocol (HTTP), Address Resolution Protocol (ARP), Dynamic Host Configuration Protocol (DHCP), File Transfer Protocol (FTP), etc.).","The modules in the processing engine 112 may be connected to or communicate with each other via a wired connection or a wireless connection.","The wired connection may include a metal cable, an optical cable, a hybrid cable, or the like, or any combination thereof.","The wireless connection may include a Local Area Network (LAN), a Wide Area Network (WAN), a Bluetooth™, a ZigBee, a Near Field Communication (NFC), an infrared connection, or the like, or any combination thereof.","Two or more of the modules may be combined as a single module, and any one of the modules may be divided into two or more units.","For example, the terminal identifying module 330 may be integrated into the determination module 320 as a single module which may both determine when to send the terminal information associated with the first terminal to the third terminal and identify the third the third terminal.","As another example, the processing engine 112 may include a storage module (not shown in FIG.","3) which may be configured to store data and/or instructions associated with the modules in the processing engine 112.One of ordinary skill in the art would understand that when an element of the on-demand service system 100 performs, the element may perform through electrical signals (e.g., current) and/or electromagnetic signals.","For example, when a requestor terminal 130 sends out a service request to the server 110, a processor of the requestor terminal 130 may generate an electrical signal encoding the request.","The processor of the requestor terminal 130 may then send the electrical signal to an output port.","If the requestor terminal 130 communicates with the server 110 via a wired network, the output port may be physically connected to a cable, which further transmit the electrical signal to an input port of the server 110.If the service terminal 130 communicates with the server 110 via a wireless network, the output port of the requestor terminal 130 may be one or more antennas, which convert the electrical signal to electromagnetic signal.","Similarly, a provider terminal 140 may receive an instruction and/or service request from the server 110 via electrical signal or electromagnet signals.","Within an electronic device, such as the requestor terminal 130, the provider terminal 140, and/or the server 110, when a processor thereof processes an instruction, sends out an instruction, and/or performs an action, the instruction and/or action is conducted via electrical signals.","For example, when the processor retrieves or saves data from a storage medium, it may send out electrical signals to a read/write device of the storage medium, which may read or write structured data in the storage medium.","The structured data may be transmitted to the processor in the form of electrical signals via a bus of the electronic device.","Here, an electrical signal may refer to one electrical signal, a series of electrical signals, and/or a plurality of discrete electrical signals.","FIG.","4 is a flowchart illustrating an exemplary process/method 400 for assisting two terminals to establish connections therebetween according to some embodiments of the present disclosure.","The process and/or method 400 may be executed by the processing engine 112 in the server 110.For example, the process and/or method 400 may be implemented as a set of instructions (e.g., an application) stored in the storage ROM 230 or RAM 240.The processor 220 may execute the set of instructions and may accordingly be directed to perform the process and/or method 400.The operations of the illustrated process/method presented below are intended to be illustrative.","In some embodiments, the process/method 400 may be accomplished with one or more additional operations not described, and/or without one or more of the operations discussed.","Additionally, the order in which the operations of the process/method as illustrated in FIG.","4 and described below is not intended to be limiting.","In step 402, the communication module 310 may receive terminal information associated with a first terminal from a second terminal.","For example, the first terminal may be a display device installed in a vehicle, and second terminal may be a driver's terminal such as a taxi driver's smartphone.","During work hours, the driver's terminal may send to the server of an online transportation service platform wireless connection ID and password of the vehicle display device.","Accordingly, in some embodiments, the terminal information may include an identification of the vehicle display device, a connection information, or the like, or any combination thereof.","The connection information may include an authorization code to enable the vehicle display device to establish a connection with the passenger's terminal.","In some embodiments, the driver's terminal may obtain the terminal information of the vehicle display device and send the terminal information of the vehicle display device to the processing engine 112.For example, the driver's terminal may establish a connection (e.g., a Bluetooth™, a Wireless Local Area Network (WLAN) or an infrared connection) with the vehicle display device.","The driver's terminal may obtain the terminal information of the vehicle display device via the connection and send the terminal information of the vehicle display device to the processing engine 112 via the network 120.In some embodiments, the communication module 310 may receive vehicle signals from the driver's terminal.","The vehicle signals include vehicle structured data encoding the terminal information associated with the vehicle display device.","In some embodiments, the vehicle structured data may include a first portion encoding the identification of the vehicle display device and a second portion encoding the connection information of the vehicle display device.","In some embodiments, the vehicle signals may be wireless signals.","In step 404, the determination module 320 may generate a determination result by determining that the service provider is providing a transportation service to a service requestor.","In some embodiments, the driver's terminal (e.g., the second terminal or the service provider terminal 140) may communicate with the processing engine 112 via an application installed in the driver's terminal.","In some embodiments, the application installed in the driver's terminal may provide an interface for the driver to send commands and/or instructions to the driver's terminal and/or the processing engine 112.For example, the driver may use the interface to send a first instruction that the driver accepts the request for transportation service from the passenger to the processing engine 112.As another example, the driver may use the interface to send a second instruction that the driver has picked up the passenger to the processing engine 112.As still another example, the driver may use the interface to send a third instruction that the driver starts to charge the passenger to the processing engine 112.Still another example, the application may be installed in the passenger's terminal, so that the passenger may use the interface to notify the processing engine 112 about his/her status about the service, as stated above, with the driver.","The determination module 320 may generate a determination result that the driver is providing a transportation service to a driver when receiving at least one of the first instruction, the second instruction or the third instruction from the driver's terminal and/or the passenger's terminal.","In some embodiments, the driver's terminal and/or the passenger's terminal may send, to the determination module 320, service signals including a first portion encoding at least one of the first instruction, the second instruction or the third instruction, a second portion encoding a command to direct the determination module 320 to generate a determination result that the driver is providing a transportation service to the service requestor, a third portion encoding an identification of the driver's terminal, and a fourth portion encoding an identification of the passenger's terminal.","In some embodiments, the determination module 320 may generate, based on the service signals from the driver's terminal and/or the passenger's terminal, determination signals including a first portion encoding the determination result that the driver is providing a transportation service to the service requestor, a second portion encoding a command to direct the terminal identification module 330 to identify the passenger's terminal, and a third portion encoding the identification of the passenger's terminal.","The determination module 320 may send the determination signals to the terminal identification module 330.In step 406, the terminal identification module 330 may identify a third terminal in response to the determination result.","In some embodiments, the determination result may include the identification of the passenger's terminal.","The terminal identifying module 330 may identify the passenger's terminal based on the identification of the passenger's terminal.","In some embodiments, the terminal identification module 330 may receive the determination signals from the determination module 320, and generate and/or confirm identification signals including a first portion encoding the identification of the passenger's terminal based on the second portion and the third portion included in the determination signals.","The identification signals may further include a second portion encoding a command to direct the communication module 310 to send the terminal information of the vehicle display device to the passenger's terminal.","The terminal identification module 330 may send the identification signals to the communication module 310.In some embodiments, the identification signals may be wireless signals.","In step 408, the communication module 310 may send the terminal information associated with the vehicle display device to the passenger's terminal.","The communication module 310 may send the information associated with the vehicle display device as a cellphone message, an e-mail, an instant communication message from a social network service, or the like, or any combination thereof.","In some embodiments, the communication module 310 may send connection signals to the passenger's terminal.","The connection signals may include connection structured data including a first portion encoding the identification of the passenger's terminal, a second portion encoding the terminal information of the vehicle display device, and a third portion encoding a command to direct the passenger's terminal to initiate a process to establish a connection with the vehicle display device based on the terminal information of the vehicle display device.","In some embodiments, the connection signals may be wireless signals.","In some embodiments, the passenger's terminal may initiate the process of establishing the connection with the vehicle display device automatically while the passenger's terminal receives the terminal information of the vehicle display device.","In some embodiments, when receiving the terminal information of the vehicle display device from the processing engine 112, the passenger's terminal may initiate the process of establishing the connection with the vehicle display device based on a notification to remind the service requestor to establish a connection between the vehicle display device and the passenger's terminal from the processing engine 112.In step 410, the communication module 310 may send, to the third terminal, a notification to remind the service requestor to establish a connection between the first terminal and the third terminal based on the terminal information.","The notification may include a cellphone message, an e-mail, a pop-up message from a social network service, or the like, or any combination thereof.","In some embodiments, the communication module 310 may perform step 410 after step 408.In some embodiments, the communication module 310 may perform step 410 and step 408 simultaneously.","It should be noted that the above description is merely provided for the purposes of illustration, and not intended to limit the scope of the present disclosure.","For persons having ordinary skills in the art, multiple variations and modifications may be made under the teachings of the present disclosure.","However, those variations and modifications do not depart from the scope of the present disclosure.","For example, one or more other optional steps (e.g., a storing step) may be added elsewhere in the exemplary process/method 400.As another example, for the condition that the process of establishing the connection between the vehicle display device and the passenger's terminal was initiated automatically in the passenger's terminal, step 410 may be optional.","FIG.","5A is a schematic block diagram illustrating an exemplary third terminal according to some embodiments of the present disclosure.","In some embodiments, the third terminal may be a requestor terminal 130 of FIG.","1.The following description in FIG.","5A will take a passenger terminal as an example of the third terminal.","The third terminal may include an I/O module 510 and a connection establishing module 520.The I/O module 510 may be configured to receive and/or send information related to the vehicle display device, the driver's terminal or the passenger's terminal.","For example, the I/O module 510 may receive terminal information of a vehicle display device (e.g., the vehicle terminal 170) from a computer server of an online on-demand transportation service platform (e.g., the processing engine 112 in the server 110).","As another example, the I/O module 510 may send, to the vehicle display device, a request of connecting the vehicle display device with the passenger's terminal (e.g., the requestor terminal 130) based on the terminal information of the vehicle display device.","As still another example, the I/O module 510 may receive, from the vehicle display device, a response of agreeing to connect the vehicle display device with the passenger's terminal.","As a further example, the I/O module 510 may send multimedia contents in the passenger's terminal to the vehicle display device.","The connection establishing module 520 may be configured to initiate a process of establishing a connection between the vehicle display device and the passenger's terminal based on the terminal information of the vehicle display device.","In some embodiments, the connection establishing module 520 may initiate the process of establishing the connection with the vehicle display device automatically while the I/O module 510 receives the terminal information of the vehicle display device.","In some embodiments, when the I/O module 510 receives the terminal information of the vehicle display device from the processing engine 112, the connection establishing module 520 may initiate the process of establishing the connection with the vehicle display device by receiving a command to initiate the process of establishing the connection with the vehicle display device input by a user (e.g., the service requestor).","The modules in the requestor terminal 130 (e.g., the passenger's terminal) may be connected to or communicate with each other via a wired connection or a wireless connection.","The wired connection may include a metal cable, an optical cable, a hybrid cable, or the like, or any combination thereof.","The wireless connection may include a Local Area Network (LAN), a Wide Area Network (WAN), a Bluetooth™, a ZigBee, a Near Field Communication (NFC), or the like, or any combination thereof.","Two or more of the modules may be combined as a single module, and any one of the modules may be divided into two or more units.","In some embodiments, the requestor terminal 130 may include a storage module (not shown in FIG.","5A) which may be configured to store data and/or instructions associated with the modules in the requestor terminal 130.FIG.","5B is a flowchart illustrating an exemplary process/method 500 for establishing a connection between two terminals according to some embodiments of the present disclosure.","The process and/or method 500 may be executed by the requestor terminal 130 (e.g., the passenger's terminal) in the server 110.For example, the requestor terminal 130 may be implemented on the computing device 200 in FIG.","2.The process and/or method 500 may be implemented as a set of instructions (e.g., an application) stored in the storage ROM 230 or RAM 240.The processor 220 may execute the set of instructions and may accordingly be directed to perform the process and/or method 500.The operations of the illustrated process/method presented below are intended to be illustrative.","In some embodiments, the process/method may be accomplished with one or more additional operations not described, and/or without one or more of the operations discussed.","Additionally, the order in which the operations of the process/method as illustrated in FIG.","5B and described below is not intended to be limiting.","In step 502, the I/O module 510 may receive terminal information of a vehicle display device from a computer server of an online on-demand transportation service platform (e.g., the processing engine 112 in the server 110).","In some embodiments, the I/O module 510 may receive the connection signals from the computer server (e.g., the processing engine 112 in the server 110).","The connection signals may include connection structured data encoding the terminal information associated with the vehicle display device.","The connection structured data may include a first portion encoding the identification of the passenger's terminal, a second portion encoding the terminal information of the vehicle display device, and a third portion encoding a command to direct the passenger's terminal to initiate a process of establishing a connection with the vehicle display device.","In step 504, the connection establishing module 520 may initiate a process of establishing a connection between the vehicle display device and the passenger's terminal based on the terminal information of the vehicle display device.","In some embodiments, the connection establishing module 520 may initiate the process of establishing the connection with the vehicle display device automatically while the I/O module 510 receives the terminal information of the vehicle display device.","In some embodiments, when the I/O module 510 receives the terminal information of the vehicle display device from the processing engine 112, the connection establishing module 520 may initiate the process of establishing the connection with the vehicle display device by receiving a command to initiate the process of establishing the connection with the vehicle display device input by a user (e.g., the service requestor).","For example, after receiving the notification to remind the service requestor to establish a connection between the passenger's terminal and the vehicle display device, the passenger's terminal may display a button of “YES” to initiate the process and a button of “NO” to refuse to initiate the process.","The service requestor may press the button of “YES” to input a command to initiate the process of establishing the connection with the vehicle display device.","The connection establishing module 520 may initiate the process of establishing the connection with the vehicle display device in response to the command.","In step 506, the I/O module 510 may send multimedia contents in the third terminal to the first terminal via the connection.","The multimedia contents may include texts, images, video stream, audio tracks, graphics, or the like, or the combination thereof.","In some embodiments, the multimedia contents in the passenger's terminal received by the vehicle display device may be played in the vehicle display device.","In some embodiments, the I/O module 510 may access the one or more storage media to read multimedia contents stored therein, encode the multimedia contents to structured data and send electronic signals encoding the structured data to the vehicle display device via the connection.","In some embodiments, the connection between the passenger's terminal and the vehicle display device is limited to unidirectional sending the multimedia data from the passenger's terminal to the vehicle display device.","Alternatively, the connection between the passenger's terminal and the vehicle display device may be bidirectional sending multimedia data from the passenger's terminal to the vehicle display device.","It should be noted that the above description is merely provided for the purposes of illustration, and not intended to limit the scope of the present disclosure.","For persons having ordinary skills in the art, multiple variations and modifications may be made under the teachings of the present disclosure.","However, those variations and modifications do not depart from the scope of the present disclosure.","For example, one or more other optional steps (e.g., a storing step) may be added elsewhere in the exemplary process/method 500.FIG.","6 is a flowchart illustrating an exemplary process/method 600 for initiating a process of establishing a connection between two terminals according to some embodiments of the present disclosure.","The process and/or method 600 may be executed by the requestor terminal 130 (e.g., the passenger's terminal) in the server 110.For example, the requestor terminal 130 may be implemented on the computing device 200 in FIG.","2.The process and/or method 600 may be implemented as a set of instructions (e.g., an application) stored in the storage ROM 230 or RAM 240.The processor 220 may execute the set of instructions and may accordingly be directed to perform the process and/or method 600.The operations of the illustrated process/method presented below are intended to be illustrative.","In some embodiments, the process/method may be accomplished with one or more additional operations not described, and/or without one or more of the operations discussed.","Additionally, the order in which the operations of the process/method as illustrated in FIG.","6 and described below is not intended to be limiting.","In some embodiments, the process and/or method 600 may initiate the process in step 504 in the process and/or method 500.In step 602, the I/O module 510 may send, to the first terminal, a request of connecting the first terminal with the third terminal based on the terminal information of the first terminal.","In some embodiments, the request of connecting the vehicle display device with the passenger's terminal may be a notification to remind the driver to connect the vehicle display device with the passenger's terminal.","In some embodiments, the I/O module 510 may send, to the vehicle display device, request signals including a first portion encoding the request of connecting the vehicle display device with the passenger's terminal based on the terminal information of the vehicle display device and a second portion encoding the terminal information of the vehicle display device.","In step 604, the I/O module 510 may receive, from the first terminal, a response of agreeing to connect the first terminal with the third terminal.","In some embodiments, after receiving the request of connecting the vehicle display device with the passenger's terminal, the vehicle display device may generate a response of agreeing to connect the vehicle display device with the passenger's terminal based on a command input by a user (e.g., the driver).","For example, after the vehicle display device receives the request of connecting the vehicle display device with the passenger's terminal, the vehicle display device and/or the driver's terminal may display a button of “YES” to agree to connect with the passenger's terminal and a button of “NO” to refuse to connect with the passenger's terminal.","The driver may press the button of “YES” to input a command of agreeing to connect with the passenger's terminal.","The vehicle display device may generate a response of agreeing to connect with the passenger's terminal in response to the command.","In some embodiments, after receiving the request of connecting the vehicle display device with the passenger's terminal, the vehicle display device may generate a response of agreeing to connect the vehicle display device to the passenger's terminal automatically.","In some embodiments, the I/O module 510 may receive, from the vehicle display device, response signals including a first portion encoding the response of agreeing to connect the vehicle display device with the passenger's terminal and a second portion encoding a command to direct the connection establishing module 520 to establish a connection between the vehicle display device and the passenger's terminal.","In step 606, the connection establishing module 520 may establish a connection between the first terminal and the third terminal based on the response.","It should be noted that the above description is merely provided for the purposes of illustration, and not intended to limit the scope of the present disclosure.","For persons having ordinary skills in the art, multiple variations and modifications may be made under the teachings of the present disclosure.","However, those variations and modifications do not depart from the scope of the present disclosure.","For example, one or more other optional steps (e.g., a storing step) may be added elsewhere in the exemplary process/method 600.Having thus described the basic concepts, it may be rather apparent to those skilled in the art after reading this detailed disclosure that the foregoing detailed disclosure is intended to be presented by way of example only and is not limiting.","Various alterations, improvements, and modifications may occur and are intended to those skilled in the art, though not expressly stated herein.","These alterations, improvements, and modifications are intended to be suggested by this disclosure, and are within the spirit and scope of the exemplary embodiments of this disclosure.","Moreover, certain terminology has been used to describe embodiments of the present disclosure.","For example, the terms “one embodiment,” “an embodiment,” and/or “some embodiments” mean that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure.","Therefore, it is emphasized and should be appreciated that two or more references to “an embodiment” or “one embodiment” or “an alternative embodiment” in various portions of this specification are not necessarily all referring to the same embodiment.","Furthermore, the particular features, structures or characteristics may be combined as suitable in one or more embodiments of the present disclosure.","Further, it will be appreciated by one skilled in the art, aspects of the present disclosure may be illustrated and described herein in any of a number of patentable classes or context including any new and useful process, machine, manufacture, or composition of matter, or any new and useful improvement thereof.","Accordingly, aspects of the present disclosure may be implemented entirely hardware, entirely software (including firmware, resident software, micro-code, etc.)","or combining software and hardware implementation that may all generally be referred to herein as a “unit,” “module,” or “system.” Furthermore, aspects of the present disclosure may take the form of a computer program product embodied in one or more computer readable media having computer readable program code embodied thereon.","A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave.","Such a propagated signal may take any of a variety of forms, including electro-magnetic, optical, or the like, or any suitable combination thereof.","A computer readable signal medium may be any computer readable medium that is not a computer readable storage medium and that may communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.","Program code embodied on a computer readable signal medium may be transmitted using any appropriate medium, including wireless, wireline, optical fiber cable, RF, or the like, or any suitable combination of the foregoing.","Computer program code for carrying out operations for aspects of the present disclosure may be written in any combination of one or more programming languages, including an object-oriented programming language such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.","NET, Python or the like, conventional procedural programming languages, such as the “C” programming language, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages such as Python, Ruby and Groovy, or other programming languages.","The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server.","In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet Service Provider) or in a cloud computing environment or offered as a service such as a Software as a Service (SaaS).","Furthermore, the recited order of processing elements or sequences, or the use of numbers, letters, or other designations therefore, is not intended to limit the claimed processes and methods to any order except as may be specified in the claims.","Although the above disclosure discusses through various examples what is currently considered to be a variety of useful embodiments of the disclosure, it is to be understood that such detail is solely for that purpose, and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover modifications and equivalent arrangements that are within the spirit and scope of the disclosed embodiments.","For example, although the implementation of various components described above may be embodied in a hardware device, it may also be implemented as a software only solution, e.g., an installation on an existing server or mobile device.","Similarly, it should be appreciated that in the foregoing description of embodiments of the present disclosure, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the various embodiments.","This method of disclosure, however, is not to be interpreted as reflecting an intention that the claimed subject matter requires more features than are expressly recited in each claim.","Rather, claimed subject matter may lie in less than all features of a single foregoing disclosed embodiment."]],"string":"[\n [\n \"SYSTEMS AND METHODS FOR ASSISTING TWO TERMINALS TO ESTABLISH CONNECTIONS THEREBETWEEN\",\n \"The present disclosure relates to systems and methods for assisting two terminals to establish connections therebetween.\",\n \"The systems may perform the methods to receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal; receive second electronic signals including second structured data encoding an identification of a third terminal; and send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.\"\n ],\n [\n \"1.A system of electronic device configured to operating an online transportation service platform, comprising: a bus; one or more storage media electronically connected to the bus, comprising a set of instructions for assisting two other terminals to establish connections therebetween; and logic circuits configured to communicate with the one or more storage media via the bus, wherein when executing the set of instructions, the logic circuits are directed to: receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal; receive second electronic signals including second structured data encoding an identification of a third terminal; and send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.\",\n \"2.The system of claim 1, wherein the first terminal is associated with a vehicle, the second terminal is associated with a transportation service provider, and the third terminal is associated with a transportation service requestor; and the logic circuits are further directed to determine that the service provider is providing a transportation service to the service requestor.\",\n \"3.The system of claim 1, wherein the first structured data includes a first portion encoding an identification of the first terminal, and a second portion encoding connection information of the first terminal; and the third structured data includes a first portion encoding an identification of the third terminal, and a second portion encoding the terminal information.\",\n \"4.The system of claim 3, wherein the connection information includes an authorization code to enable the first terminal to accept a connection request from the third terminal.\",\n \"5.The system of claim 1, wherein the third structured data include a third portion encoding a command to direct the third terminal to initiate a process to establish a communication connection with the first terminal based on the terminal information of the first terminal.\",\n \"6.The system of claim 5, wherein the communication connection between the third terminal and the first terminal is limited to unidirectional sending multimedia data from the third terminal to the first terminal.\",\n \"7.The system of claim 1, wherein the first terminal is included in the second terminal.\",\n \"8.A method implemented on a computing device having one or more processors and one or more storage media, the method comprising: receiving, by the one or more processors, first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal; receiving, by the one or more processors, second electronic signals including second structured data encoding an identification of a third terminal; and sending, by the one or more processors, third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.\",\n \"9.The method of claim 8, wherein the first terminal is associated with a vehicle, the second terminal is associated with a transportation service provider, and the third terminal is associated with a transportation service requestor; and the method further comprising: determining, by the one or more processors, that the service provider is providing a transportation service to the service requestor.\",\n \"10.The method of claim 8, wherein the first structured data includes a first portion encoding an identification of the first terminal, and a second portion encoding connection information of the first terminal; and the third structured data includes a first portion encoding an identification of the third terminal, and a second portion encoding the terminal information.\",\n \"11.The method of claim 10, wherein the connection information includes an authorization code to enable the first terminal to accept a connection request from the third terminal.\",\n \"12.The method of claim 8, wherein the third structured data include a third portion encoding a command to direct the third terminal to initiate a process to establish a communication connection with the first terminal based on the connection information of the first terminal.\",\n \"13.The method of claim 12, wherein the communication connection between the third terminal and the first terminal is limited to unidirectional sending multimedia data from the third terminal to the first terminal.\",\n \"14-20.\",\n \"(canceled) 21.An electronic terminal, comprising: one or more storage media comprising a set of instructions for connecting to another terminal device associated with an on-demand transportation platform; and one or more processors configured to communicate with the one or more storage media, wherein when executing the set of instructions, the one or more processors are directed to: receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal; and generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.\",\n \"22.The electronic terminal of claim 21, wherein the computer server is associated with an online on-demand transportation service platform; the target terminal is associated with a terminal of a transportation service provider who is providing a transportation service to a user of the electronic terminal.\",\n \"23.The electronic terminal of claim 21, wherein the first structured data includes: a first portion encoding an identification of the target terminal, and a second portion encoding connection information of the target terminal.\",\n \"24.The electronic terminal of claim 23, wherein the connection information includes an authorization code to enable the target terminal to accept a connection request from the electronic terminal.\",\n \"25.The electronic terminal of claim 21, the one or more processors are further directed to: access the one or more storage media to read multimedia contents stored therein; encode the multimedia contents to second structured data; and send third electronic signals encoding the second structured data to the target terminal via the communication connection.\",\n \"26.The electronic terminal of claim 21, wherein the communication connection between the electronic terminal and the target terminal is limited to unidirectional sending multimedia data from the electronic terminal to the target terminal.\",\n \"27.The electronic terminal of claim 21, wherein to initiate the communication connection between the target terminal and the electronic terminal the one or more processors are directed to: send, to the target terminal, fourth electronic signals encoding a request of connecting the target terminal with the electronic terminal based on the terminal information of the target terminal; receive, from the target terminal, fifth electronic signals encoding a response of agreeing to connect the target terminal with the electronic terminal; and establish the communication connection between the target terminal and the electronic terminal based on the response.\",\n \"28-40.\",\n \"(canceled)\"\n ],\n [\n \" BACKGROUND On-demand transportation services utilizing Internet technology, such as online taxi-hailing services, have become increasingly popular because of their convenience.\",\n \"While traveling towards his/her destination in a taxi, a passenger may wish to listen to music or watch videos on his/her smartphone.\",\n \"However, a phone call or a message may interrupt the music playing or video playing, and the passenger may have to hold the smartphone for long time if the time of the videos are long.\",\n \"Therefore, sometimes it is inconvenient for the requestor to listen to the music or watch the videos on the smartphone in the taxi.\",\n \"In addition, the above situation may also increase power consumption and reduce use of time of the requestor terminal.\",\n \"Therefore, it is desirable to provide systems and methods for assisting the requestor terminal to establish connections with another terminal that can play multimedia in the requestor terminal.\"\n ],\n [\n \" SUMMARY Additional features will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and the accompanying drawings or may be learned by production or operation of the examples.\",\n \"The features of the present disclosure may be realized and attained by practice or use of various aspects of the methodologies, instrumentalities and combinations set forth in the detailed examples discussed below.\",\n \"According to a first aspect of the present disclosure, a system of electronic device may include one or more storage media and one or more processors configured to communicate with the one or more storage media.\",\n \"The one or more storage media may include a set of instructions for assisting two other terminals to establish connections therebetween.\",\n \"When the one or more processors executing the set of instructions, the one or more processors may be directed to perform one or more of the following operations.\",\n \"The one or more processors may receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal.\",\n \"The one or more processors may receive second electronic signals including second structured data encoding an identification of a third terminal.\",\n \"The one or more processors may send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.\",\n \"In some embodiments, the first terminal may be associated with a vehicle, the second terminal may be associated with a transportation service provider, and the third terminal may be associated with a transportation service requestor.\",\n \"In some embodiments, the one or more processors may determine that the service provider is providing a transportation service to the service requestor.\",\n \"In some embodiments, the first structured data may include a first portion encoding an identification of the first terminal, and a second portion encoding connection information of the first terminal.\",\n \"In some embodiments, the third structured data may include a first portion encoding an identification of the third terminal, and a second portion encoding the terminal information.\",\n \"In some embodiments, the connection information may include an authorization code to enable the first terminal to accept a connection request from the third terminal.\",\n \"In some embodiments, the third structured data may include a third portion encoding a command to direct the third terminal to initiate a process to establish a communication connection with the first terminal based on the terminal information of the first terminal.\",\n \"In some embodiments, the communication connection between the third terminal and the first terminal may be limited to unidirectional sending multimedia data from the third terminal to the first terminal.\",\n \"In some embodiments, the first terminal may be included in the second terminal.\",\n \"According to a second aspect of the present disclosure, a method may include one or more of the following operations.\",\n \"One or more processors of an online on-demand transportation service platform may receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal.\",\n \"The one or more processors may receive second electronic signals including second structured data encoding an identification of a third terminal.\",\n \"The one or more processors may send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.\",\n \"According to a third aspect of the present disclosure, a non-transitory computer readable medium may comprise at least one set of instructions for assisting two other terminals to establish connections therebetween.\",\n \"The at least one set of instructions may be executed by one or more processors of a computer server.\",\n \"The one or more processors may receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal.\",\n \"The one or more processors may receive second electronic signals including second structured data encoding an identification of a third terminal.\",\n \"The one or more processors may send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.\",\n \"In some embodiments, the first terminal may be associated with a vehicle, the second terminal may be associated with a transportation service provider, and the third terminal may be associated with a transportation service requestor.\",\n \"In some embodiments, the one or more processors may determine that the service provider is providing a transportation service to the service requestor.\",\n \"In some embodiments, the first structured data may include a first portion encoding an identification of the first terminal, and a second portion encoding connection information of the first terminal.\",\n \"In some embodiments, the third structured data may include a first portion encoding an identification of the third terminal, and a second portion encoding the terminal information.\",\n \"In some embodiments, the connection information may include an authorization code to enable the first terminal to accept a connection request from the third terminal.\",\n \"In some embodiments, the third structured data may include a third portion encoding a command to direct the third terminal to initiate a process to establish a communication connection with the first terminal based on the terminal information of the first terminal.\",\n \"In some embodiments, the communication connection between the third terminal and the first terminal may be limited to unidirectional sending multimedia data from the third terminal to the first terminal.\",\n \"In some embodiments, the first terminal may be included in the second terminal.\",\n \"According to a fourth aspect of the present disclosure, a system of electronic device may include one or more storage media and one or more processors configured to communicate with the one or more storage media.\",\n \"The one or more storage media may include a set of instructions for connecting to another terminal device associated with an on-demand transportation platform.\",\n \"When the one or more processors executing the set of instructions, the one or more processors may be directed to perform one or more of the following operations.\",\n \"The one or more processors may receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal.\",\n \"The one or more processors may generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.\",\n \"In some embodiments, the computer server may be associated with an online on-demand transportation service platform, and the target terminal may be associated with a terminal of a transportation service provider who is providing a transportation service to a user of the electronic terminal.\",\n \"In some embodiments, the first structured data may include a first portion encoding an identification of the target terminal, and a second portion encoding connection information of the target terminal.\",\n \"In some embodiments, the connection information may include an authorization code to enable the target terminal to accept a connection request from the electronic terminal.\",\n \"In some embodiments, the one or more processors may access the one or more storage media to read multimedia contents stored therein.\",\n \"The one or more processors may encode the multimedia contents to second structured data.\",\n \"The one or more processors may send third electronic signals encoding the second structured data to the target terminal via the communication connection.\",\n \"In some embodiments, the communication connection between the electronic terminal and the target terminal may be limited to unidirectional sending multimedia data from the electronic terminal to the target terminal.\",\n \"In some embodiments, the one or more processors may send, to the target terminal, fourth electronic signals encoding a request of connecting the target terminal with the electronic terminal based on the terminal information of the target terminal.\",\n \"The one or more processors may receive, from the target terminal, fifth electronic signals encoding a response of agreeing to connect the target terminal with the electronic terminal.\",\n \"The one or more processors may establish the communication connection between the target terminal and the electronic terminal based on the response.\",\n \"According to a fifth aspect of the present disclosure, a method may include one or more of the following operations.\",\n \"One or more processors of an electronic device may receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal.\",\n \"The one or more processors may generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.\",\n \"According to a sixth aspect of the present disclosure, a non-transitory computer readable medium may comprise at least one set of instructions for connecting to another terminal device associated with an on-demand transportation platform.\",\n \"The at least one set of instructions may be executed by one or more processors of an electronic device.\",\n \"The one or more processors may receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal.\",\n \"The one or more processors may generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.\",\n \"In some embodiments, the computer server may be associated with an online on-demand transportation service platform, and the target terminal may be associated with a terminal of a transportation service provider who is providing a transportation service to a user of the electronic terminal.\",\n \"In some embodiments, the first structured data may include a first portion encoding an identification of the target terminal, and a second portion encoding connection information of the target terminal.\",\n \"In some embodiments, the connection information may include an authorization code to enable the target terminal to accept a connection request from the electronic terminal.\",\n \"In some embodiments, the one or more processors may access the one or more storage media to read multimedia contents stored therein.\",\n \"The one or more processors may encode the multimedia contents to second structured data.\",\n \"The one or more processors may send third electronic signals encoding the second structured data to the target terminal via the communication connection.\",\n \"In some embodiments, the communication connection between the electronic terminal and the target terminal may be limited to unidirectional sending multimedia data from the electronic terminal to the target terminal.\",\n \"In some embodiments, the one or more processors may send, to the target terminal, fourth electronic signals encoding a request of connecting the target terminal with the electronic terminal based on the terminal information of the target terminal.\",\n \"The one or more processors may receive, from the target terminal, fifth electronic signals encoding a response of agreeing to connect the target terminal with the electronic terminal.\",\n \"The one or more processors may establish the communication connection between the target terminal and the electronic terminal based on the response.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of International Application No.\",\n \"PCT/CN2017/083747, filed on May 10, 2017, which claims priority to Chinese Application No.\",\n \"201611113978.4 filed on Dec. 6, 2016, the contents of which are incorporated herein by reference in its entirety.\",\n \"TECHNICAL FIELD The present disclosure generally relates to systems and methods for on-demand services, and in particular, systems and methods for assisting two terminals to establish connections therebetween.\",\n \"BACKGROUND On-demand transportation services utilizing Internet technology, such as online taxi-hailing services, have become increasingly popular because of their convenience.\",\n \"While traveling towards his/her destination in a taxi, a passenger may wish to listen to music or watch videos on his/her smartphone.\",\n \"However, a phone call or a message may interrupt the music playing or video playing, and the passenger may have to hold the smartphone for long time if the time of the videos are long.\",\n \"Therefore, sometimes it is inconvenient for the requestor to listen to the music or watch the videos on the smartphone in the taxi.\",\n \"In addition, the above situation may also increase power consumption and reduce use of time of the requestor terminal.\",\n \"Therefore, it is desirable to provide systems and methods for assisting the requestor terminal to establish connections with another terminal that can play multimedia in the requestor terminal.\",\n \"SUMMARY Additional features will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and the accompanying drawings or may be learned by production or operation of the examples.\",\n \"The features of the present disclosure may be realized and attained by practice or use of various aspects of the methodologies, instrumentalities and combinations set forth in the detailed examples discussed below.\",\n \"According to a first aspect of the present disclosure, a system of electronic device may include one or more storage media and one or more processors configured to communicate with the one or more storage media.\",\n \"The one or more storage media may include a set of instructions for assisting two other terminals to establish connections therebetween.\",\n \"When the one or more processors executing the set of instructions, the one or more processors may be directed to perform one or more of the following operations.\",\n \"The one or more processors may receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal.\",\n \"The one or more processors may receive second electronic signals including second structured data encoding an identification of a third terminal.\",\n \"The one or more processors may send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.\",\n \"In some embodiments, the first terminal may be associated with a vehicle, the second terminal may be associated with a transportation service provider, and the third terminal may be associated with a transportation service requestor.\",\n \"In some embodiments, the one or more processors may determine that the service provider is providing a transportation service to the service requestor.\",\n \"In some embodiments, the first structured data may include a first portion encoding an identification of the first terminal, and a second portion encoding connection information of the first terminal.\",\n \"In some embodiments, the third structured data may include a first portion encoding an identification of the third terminal, and a second portion encoding the terminal information.\",\n \"In some embodiments, the connection information may include an authorization code to enable the first terminal to accept a connection request from the third terminal.\",\n \"In some embodiments, the third structured data may include a third portion encoding a command to direct the third terminal to initiate a process to establish a communication connection with the first terminal based on the terminal information of the first terminal.\",\n \"In some embodiments, the communication connection between the third terminal and the first terminal may be limited to unidirectional sending multimedia data from the third terminal to the first terminal.\",\n \"In some embodiments, the first terminal may be included in the second terminal.\",\n \"According to a second aspect of the present disclosure, a method may include one or more of the following operations.\",\n \"One or more processors of an online on-demand transportation service platform may receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal.\",\n \"The one or more processors may receive second electronic signals including second structured data encoding an identification of a third terminal.\",\n \"The one or more processors may send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.\",\n \"According to a third aspect of the present disclosure, a non-transitory computer readable medium may comprise at least one set of instructions for assisting two other terminals to establish connections therebetween.\",\n \"The at least one set of instructions may be executed by one or more processors of a computer server.\",\n \"The one or more processors may receive first electronic signals from a second terminal, the first electronic signals including first structured data encoding terminal information of a first terminal associated with the second terminal.\",\n \"The one or more processors may receive second electronic signals including second structured data encoding an identification of a third terminal.\",\n \"The one or more processors may send third electronic signals to the third terminal, the third electronic signals including third structured data encoding the terminal information of the first terminal.\",\n \"In some embodiments, the first terminal may be associated with a vehicle, the second terminal may be associated with a transportation service provider, and the third terminal may be associated with a transportation service requestor.\",\n \"In some embodiments, the one or more processors may determine that the service provider is providing a transportation service to the service requestor.\",\n \"In some embodiments, the first structured data may include a first portion encoding an identification of the first terminal, and a second portion encoding connection information of the first terminal.\",\n \"In some embodiments, the third structured data may include a first portion encoding an identification of the third terminal, and a second portion encoding the terminal information.\",\n \"In some embodiments, the connection information may include an authorization code to enable the first terminal to accept a connection request from the third terminal.\",\n \"In some embodiments, the third structured data may include a third portion encoding a command to direct the third terminal to initiate a process to establish a communication connection with the first terminal based on the terminal information of the first terminal.\",\n \"In some embodiments, the communication connection between the third terminal and the first terminal may be limited to unidirectional sending multimedia data from the third terminal to the first terminal.\",\n \"In some embodiments, the first terminal may be included in the second terminal.\",\n \"According to a fourth aspect of the present disclosure, a system of electronic device may include one or more storage media and one or more processors configured to communicate with the one or more storage media.\",\n \"The one or more storage media may include a set of instructions for connecting to another terminal device associated with an on-demand transportation platform.\",\n \"When the one or more processors executing the set of instructions, the one or more processors may be directed to perform one or more of the following operations.\",\n \"The one or more processors may receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal.\",\n \"The one or more processors may generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.\",\n \"In some embodiments, the computer server may be associated with an online on-demand transportation service platform, and the target terminal may be associated with a terminal of a transportation service provider who is providing a transportation service to a user of the electronic terminal.\",\n \"In some embodiments, the first structured data may include a first portion encoding an identification of the target terminal, and a second portion encoding connection information of the target terminal.\",\n \"In some embodiments, the connection information may include an authorization code to enable the target terminal to accept a connection request from the electronic terminal.\",\n \"In some embodiments, the one or more processors may access the one or more storage media to read multimedia contents stored therein.\",\n \"The one or more processors may encode the multimedia contents to second structured data.\",\n \"The one or more processors may send third electronic signals encoding the second structured data to the target terminal via the communication connection.\",\n \"In some embodiments, the communication connection between the electronic terminal and the target terminal may be limited to unidirectional sending multimedia data from the electronic terminal to the target terminal.\",\n \"In some embodiments, the one or more processors may send, to the target terminal, fourth electronic signals encoding a request of connecting the target terminal with the electronic terminal based on the terminal information of the target terminal.\",\n \"The one or more processors may receive, from the target terminal, fifth electronic signals encoding a response of agreeing to connect the target terminal with the electronic terminal.\",\n \"The one or more processors may establish the communication connection between the target terminal and the electronic terminal based on the response.\",\n \"According to a fifth aspect of the present disclosure, a method may include one or more of the following operations.\",\n \"One or more processors of an electronic device may receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal.\",\n \"The one or more processors may generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.\",\n \"According to a sixth aspect of the present disclosure, a non-transitory computer readable medium may comprise at least one set of instructions for connecting to another terminal device associated with an on-demand transportation platform.\",\n \"The at least one set of instructions may be executed by one or more processors of an electronic device.\",\n \"The one or more processors may receive first electronic signals from a computer server, the first electronic signals including first structured data encoding terminal information associated with a target terminal.\",\n \"The one or more processors may generate second electronic signals to initiate a communication connection between the target terminal and the electronic terminal based on the terminal information of the target terminal.\",\n \"In some embodiments, the computer server may be associated with an online on-demand transportation service platform, and the target terminal may be associated with a terminal of a transportation service provider who is providing a transportation service to a user of the electronic terminal.\",\n \"In some embodiments, the first structured data may include a first portion encoding an identification of the target terminal, and a second portion encoding connection information of the target terminal.\",\n \"In some embodiments, the connection information may include an authorization code to enable the target terminal to accept a connection request from the electronic terminal.\",\n \"In some embodiments, the one or more processors may access the one or more storage media to read multimedia contents stored therein.\",\n \"The one or more processors may encode the multimedia contents to second structured data.\",\n \"The one or more processors may send third electronic signals encoding the second structured data to the target terminal via the communication connection.\",\n \"In some embodiments, the communication connection between the electronic terminal and the target terminal may be limited to unidirectional sending multimedia data from the electronic terminal to the target terminal.\",\n \"In some embodiments, the one or more processors may send, to the target terminal, fourth electronic signals encoding a request of connecting the target terminal with the electronic terminal based on the terminal information of the target terminal.\",\n \"The one or more processors may receive, from the target terminal, fifth electronic signals encoding a response of agreeing to connect the target terminal with the electronic terminal.\",\n \"The one or more processors may establish the communication connection between the target terminal and the electronic terminal based on the response.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS The present disclosure is further described in terms of exemplary embodiments.\",\n \"These exemplary embodiments are described in detail with reference to the drawings.\",\n \"These embodiments are non-limiting exemplary embodiments, in which like reference numerals represent similar structures throughout the several views of the drawings, and wherein: FIG.\",\n \"1 is a schematic diagram of an exemplary on-demand service system according to some embodiments of the present disclosure; FIG.\",\n \"2 is a schematic diagram illustrating an exemplary computing device according to some embodiments of the present disclosure; FIG.\",\n \"3 is a schematic block diagram illustrating an exemplary processing engine according to some embodiments of the present disclosure; FIG.\",\n \"4 is a flowchart illustrating an exemplary process for assisting two terminals to establish connections therebetween according to some embodiments of the present disclosure; FIG.\",\n \"5A is a schematic block diagram illustrating an exemplary third terminal associated with a service requestor according to some embodiments of the present disclosure; FIG.\",\n \"5B is a flowchart illustrating an exemplary process for establishing a connection between two terminals according to some embodiments of the present disclosure; and FIG.\",\n \"6 is a flowchart illustrating an exemplary process for initiating a process of establishing a connection between two terminals according to some embodiments of the present disclosure.\",\n \"DETAILED DESCRIPTION The following description is presented to enable any person skilled in the art to make and use the present disclosure, and is provided in the context of a particular application and its requirements.\",\n \"Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present disclosure.\",\n \"Thus, the present disclosure is not limited to the embodiments shown, but is to be accorded the widest scope consistent with the claims.\",\n \"The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting.\",\n \"As used herein, the singular forms “a,” “an,” and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise.\",\n \"It will be further understood that the terms “comprise,” “comprises,” and/or “comprising,” “include,” “includes,” and/or “including,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.\",\n \"These and other features, and characteristics of the present disclosure, as well as the methods of operation and functions of the related elements of structure and the combination of parts and economies of manufacture, may become more apparent upon consideration of the following description with reference to the accompanying drawings, all of which form a part of this disclosure.\",\n \"It is to be expressly understood, however, that the drawings are for the purpose of illustration and description only and are not intended to limit the scope of the present disclosure.\",\n \"It is understood that the drawings are not to scale.\",\n \"The flowcharts used in the present disclosure illustrate operations that systems implement according to some embodiments of the present disclosure.\",\n \"It is to be expressly understood, the operations of the flowchart may be implemented not in order.\",\n \"Conversely, the operations may be implemented in inverted order, or simultaneously.\",\n \"Moreover, one or more other operations may be added to the flowcharts.\",\n \"One or more operations may be removed from the flowcharts.\",\n \"Moreover, while the system and method in the present disclosure is described primarily regarding assiting two terminals to establish connections there between, it should also be understood that this is only one exemplary embodiment.\",\n \"The system or method of the present disclosure may be applied to any other kind of on demand service.\",\n \"For example, the system or method of the present disclosure may be applied to transportation systems of different environments including land, ocean, aerospace, or the like, or any combination thereof.\",\n \"The vehicle of the transportation systems may include a taxi, a private car, a hitch, a bus, a train, a bullet train, a high-speed rail, a subway, a vessel, an aircraft, a spaceship, a hot-air balloon, a driverless vehicle, or the like, or any combination thereof.\",\n \"The transportation system may also include any transportation system for management and/or distribution, for example, a system for sending and/or receiving an express.\",\n \"The application of the system or method of the present disclosure may include a web page, a plug-in of a browser, a client terminal, a custom system, an internal analysis system, an artificial intelligence robot, or the like, or any combination thereof.\",\n \"The term “passenger,” “requestor,” “service requestor,” and “customer” in the present disclosure are used interchangeably to refer to an individual, an entity or a tool that may request or order a service.\",\n \"Also, the term “driver,” “provider,” “service provider,” and “supplier” in the present disclosure are used interchangeably to refer to an individual, an entity or a tool that may provide a service or facilitate the providing of the service.\",\n \"The term “user” in the present disclosure may refer to an individual, an entity or a tool that may request a service, order a service, provide a service, or facilitate the providing of the service.\",\n \"For example, the user may be a passenger, a driver, an operator, or the like, or any combination thereof.\",\n \"In the present disclosure, “passenger” and “passenger terminal” may be used interchangeably, and “driver” and “driver terminal” may be used interchangeably.\",\n \"The term “service request” and “order” in the present disclosure are used interchangeably to refer to a request that may be initiated by a passenger, a requestor, a service requestor, a customer, a driver, a provider, a service provider, a supplier, or the like, or any combination thereof.\",\n \"The service request may be accepted by any one of a passenger, a requestor, a service requestor, a customer, a driver, a provider, a service provider, or a supplier.\",\n \"The service request may be chargeable or free.\",\n \"The positioning technology used in the present disclosure may be based on a global positioning system (GPS), a global navigation satellite system (GLONASS), a compass navigation system (COMPASS), a Galileo positioning system, a quasi-zenith satellite system (QZSS), a wireless fidelity (WiFi) positioning technology, or the like, or any combination thereof.\",\n \"One or more of the above positioning systems may be used interchangeably in the present disclosure.\",\n \"An aspect of the present disclosure relates to online systems and methods for assisting a smartphone (i.e., a requestor terminal) of a passenger (i.e., a service requestor) to establish connections with a display (i.e., a multimedia player) in a vehicle (e.g., a taxi) of a service provider.\",\n \"To this end, when the passenger gets into the vehicle, the passenger's smartphone or the driver's smartphone may notify a server of an online on-demand transportation service platform that the passenger is on board, and then the server may send to the smartphone information necessary to connect to the display in the vehicle, such as Bluetooth™ ID and password of that display.\",\n \"With the ID and password, when the passenger watches a video, the smartphone may automatically connect to the display and send the video data to the display.\",\n \"As a result, the passenger may enjoy the video without using his/her smart phone.\",\n \"The technical solution of this disclosure relates to online communication.\",\n \"Particularly, the technical solution relates to wirelessly sending a third-party's wireless connection information from a server of an online on-demand transportation platform.\",\n \"The technology and solution rooted only in post-Internet era.\",\n \"In general, a passenger may listen to music or watch videos on his/her smartphone when the passenger in a vehicle (e.g., a taxi).\",\n \"If the passenger wants to connect with a display (e.g., a multimedia player or a smartphone of a driver) in the vehicle and listen to music or watch videos in the display, the passenger may ask the driver for the authorization code and/or the identification of the display.\",\n \"The online on-demand service system, however, may obtain the authorization code and/or the identification of the display and send the authorization code and/or the identification to the smartphone of the passenger.\",\n \"The smartphone of the passenger can connect with the display automatically based on the received authorization code and/or identification.\",\n \"Therefore, through the Internet, the online on-demand transportation systems may provide a much more convenient transaction platform to assist the smartphone of the passenger to connect with the display in the vehicle automatically.\",\n \"FIG.\",\n \"1 is a schematic diagram of an exemplary on-demand service system 100 according to some embodiments.\",\n \"For example, the on-demand service system 100 may be an online on-demand transportation service system for transportation services such as taxi hailing, chauffeur services, delivery vehicles, carpool, bus service, driver hiring and shuttle services.\",\n \"The on-demand service system 100 may include a server 110, a network 120, a requestor terminal 130, a provider terminal 140, a storage 150, a positioning system 160, and a vehicle terminal 170.The server 110 may include a processing engine 112.In some embodiments, the server 110 may be a single server or a server group.\",\n \"The server group may be centralized, or distributed (e.g., server 110 may be a distributed system).\",\n \"In some embodiments, the server 110 may be local or remote.\",\n \"For example, the server 110 may access information and/or data stored in the requestor terminal 130, the provider terminal 140, and/or the storage 150 via the network 120.As another example, the server 110 may be directly connected to the requestor terminal 130, the provider terminal 140, and/or the storage 150 to access stored information and/or data.\",\n \"In some embodiments, the server 110 may be implemented on a cloud platform.\",\n \"Merely by way of example, the cloud platform may include a private cloud, a public cloud, a hybrid cloud, a community cloud, a distributed cloud, an inter-cloud, a multi-cloud, or the like, or any combination thereof.\",\n \"In some embodiments, the server 110 may be implemented on a computing device 200 having one or more components illustrated in FIG.\",\n \"2 in the present disclosure.\",\n \"In some embodiments, the server 110 may include a processing engine 112.The processing engine 112 may process information and/or data relating to the service request to perform one or more functions described in the present disclosure.\",\n \"For example, the processing engine 112 may determine a reference parameter and an actual parameter associated with the service request obtained from the requestor terminal 130.In some embodiments, the processing engine 112 may include one or more processing engines (e.g., single-core processing engine(s) or multi-core processor(s)).\",\n \"Merely by way of example, the processing engine 112 may include one or more hardware processors, such as a central processing unit (CPU), an application-specific integrated circuit (ASIC), an application-specific instruction-set processor (ASIP), a graphics processing unit (GPU), a physics processing unit (PPU), a digital signal processor (DSP), a field-programmable gate array (FPGA), a programmable logic device (PLD), a controller, a microcontroller unit, a reduced instruction-set computer (RISC), a microprocessor, or the like, or any combination thereof.\",\n \"The network 120 may facilitate the exchange of information and/or data.\",\n \"In some embodiments, one or more components in the on-demand service system 100 (e.g., the server 110, the requestor terminal 130, the provider terminal 140, the storage 150, the positioning system 160, and the vehicle terminal 170) may send information and/or data to other component(s) in the on-demand service system 100 via the network 120.For example, the server 110 may obtain/acquire service request from the requestor terminal 130 via the network 120.In some embodiments, the network 120 may be any type of wired or wireless network, or a combination thereof.\",\n \"Merely by way of example, the network 130 may include a cable network, a wireline network, an optical fiber network, a telecommunications network, an intranet, the Internet, a local area network (LAN), a wide area network (WAN), a wireless local area network (WLAN), a metropolitan area network (MAN), a wide area network (WAN), a public telephone switched network (PSTN), a Bluetooth™ network, a ZigBee network, a near field communication (NFC) network, or the like, or any combination thereof.\",\n \"In some embodiments, the network 120 may include one or more network access points.\",\n \"For example, the network 120 may include wired or wireless network access points such as base stations and/or internet exchange points 120-1, 120-2, .\",\n \".\",\n \".\",\n \", through which one or more components of the on-demand service system 100 may be connected to the network 120 to exchange data and/or information.\",\n \"In some embodiments, a requestor may be a user of the requestor terminal 130.In some embodiments, the user of the requestor terminal 130 may be someone other than the requestor.\",\n \"For example, a user A of the requestor terminal 130 may use the requestor terminal 130 to send a service request for a user B, or receive service and/or information or instructions from the server 110.In some embodiments, a provider may be a user of the provider terminal 140.In some embodiments, the user of the provider terminal 140 may be someone other than the provider.\",\n \"For example, a user C of the provider terminal 140 may user the provider terminal 140 to receive a service request for a user D, and/or information or instructions from the server 110.In some embodiments, “requestor” and “requestor terminal” may be used interchangeably, and “provider” and “provider terminal” may be used interchangeably.\",\n \"In some embodiments, the requestor terminal 130 may include a mobile device 130-1, a tablet computer 130-2, a laptop computer 130-3, a built-in device in a motor vehicle 130-4, or the like, or any combination thereof.\",\n \"In some embodiments, the mobile device 130-1 may include a smart home device, a wearable device, a mobile device, a virtual reality device, an augmented reality device, or the like, or any combination thereof.\",\n \"In some embodiments, the smart home device may include a smart lighting device, a control device of an intelligent electrical apparatus, a smart monitoring device, a smart television, a smart video camera, an interphone, or the like, or any combination thereof.\",\n \"In some embodiments, the wearable device may include a bracelet, footgear, glasses, a helmet, a watch, clothing, a backpack, a smart accessory, or the like, or any combination thereof.\",\n \"In some embodiments, the mobile device may include a mobile phone, a personal digital assistance (PDA), a gaming device, a navigation device, a point of sale (POS) device, a laptop, a desktop, or the like, or any combination thereof.\",\n \"In some embodiments, the virtual reality device and/or the augmented reality device may include a virtual reality helmet, a virtual reality glass, a virtual reality patch, an augmented reality helmet, augmented reality glasses, an augmented reality patch, or the like, or any combination thereof.\",\n \"For example, the virtual reality device and/or the augmented reality device may include a Google Glass™, a RiftCon™, a Fragments™, a Gear VR™, etc.\",\n \"In some embodiments, a built-in device in the motor vehicle 130-4 may include an onboard computer, an onboard television, etc.\",\n \"In some embodiments, the requestor terminal 130 may be a device with positioning technology for locating the position of the requestor and/or the requestor terminal 130.In some embodiments, the provider terminal 140 may be a device that is similar to, or the same as the requestor terminal 130.In some embodiments, the provider terminal 140 may be a device utilizing positioning technology for locating the position of a user of the provider terminal 140 (e.g., a service provider) and/or the provider terminal 140.In some embodiments, the requestor terminal 130 and/or the provider terminal 140 may communicate with one or more other positioning devices to determine the position of the requestor, the requestor terminal 130, the provider, and/or the provider terminal 140.In some embodiments, the requestor terminal 130 and/or the provider terminal 140 may send positioning information to the server 110.The storage 150 may store data and/or instructions.\",\n \"In some embodiments, the storage 150 may store data obtained from the requestor terminal 130 and/or the provider terminal 140.In some embodiments, the storage 150 may store data and/or instructions that the server 110 may execute or use to perform exemplary methods described in the present disclosure.\",\n \"In some embodiments, storage 150 may include a mass storage, a removable storage, a volatile read-and-write memory, a read-only memory (ROM), or the like, or any combination thereof.\",\n \"Exemplary mass storage may include a magnetic disk, an optical disk, a solid-state drive, etc.\",\n \"Exemplary removable storage may include a flash drive, a floppy disk, an optical disk, a memory card, a zip disk, a magnetic tape, etc.\",\n \"Exemplary volatile read-and-write memory may include a random access memory (RAM).\",\n \"Exemplary RAM may include a dynamic RAM (DRAM), a double date rate synchronous dynamic RAM (DDR SDRAM), a static RAM (SRAM), a thyrisor RAM (T-RAM), and a zero-capacitor RAM (Z-RAM), etc.\",\n \"Exemplary ROM may include a mask ROM (MROM), a programmable ROM (PROM), an erasable programmable ROM (EPROM), an electrically-erasable programmable ROM (EEPROM), a compact disk ROM (CD-ROM), and a digital versatile disk ROM, etc.\",\n \"In some embodiments, the storage 150 may be implemented on a cloud platform.\",\n \"Merely by way of example, the cloud platform may include a private cloud, a public cloud, a hybrid cloud, a community cloud, a distributed cloud, an inter-cloud, a multi-cloud, or the like, or any combination thereof.\",\n \"In some embodiments, the storage 150 may be connected to the network 120 to communicate with one or more components in the on-demand service system 100 (e.g., the server 110, the requestor terminal 130, the provider terminal 140, etc.).\",\n \"One or more components in the on-demand service system 100 may access the data or instructions stored in the storage 150 via the network 120.In some embodiments, the storage 150 may be directly connected to or communicate with one or more components in the on-demand service system 100 (e.g., the server 110, the requestor terminal 130, the provider terminal 140, etc.).\",\n \"In some embodiments, the storage 150 may be part of the server 110.The positioning system 160 may determine information associated with an object, for example, one or more of the requestor terminal 130, the provider terminal 140, etc.\",\n \"For example, the positioning system 160 may determine a current location of the requestor terminal 130.In some embodiments, the positioning system 160 may be a global positioning system (GPS), a global navigation satellite system (GLONASS), a compass navigation system (COMPASS), a BeiDou navigation satellite system, a Galileo positioning system, a quasi-zenith satellite system (QZSS), etc.\",\n \"The information may include a location, an elevation, a velocity, or an acceleration of the object, or a current time.\",\n \"The location may be in the form of coordinates, such as, latitude coordinate and longitude coordinate, etc.\",\n \"The positioning system 160 may include one or more satellites, for example, a satellite 160-1, a satellite 160-2, and a satellite 160-3.The satellites 160-1 through 160-3 may determine the information mentioned above independently or jointly.\",\n \"The satellite positioning system 160 may send the information mentioned above to the network 120, the requestor terminal 130, or the provider terminal 140 via wireless connections.\",\n \"The vehicle terminal 170 may refer to a terminal associated with a vehicle.\",\n \"The vehicle terminal 170 may include a built-in device in a vehicle.\",\n \"The vehicle terminal 170 may include an MP3 player, an MP4 player, a television, a tablet computer, a laptop, a desktop computer, a mobile phone, or the like, or any combination thereof.\",\n \"In some embodiments, the vehicle terminal 170 may be included in the provider terminal 140.In some embodiments, one or more components in the on-demand service system 100 (e.g., the server 110, the requestor terminal 130, the provider terminal 140, etc.)\",\n \"may have permission to access the storage 150.In some embodiments, one or more components in the on-demand service system 100 may read and/or modify information relating to the requestor, provider, and/or the public when one or more conditions are met.\",\n \"For example, the server 110 may read and/or modify one or more users' information after finishing a service.\",\n \"As another example, the provider terminal 140 may access information relating to the requestor when receiving a service request from the requestor terminal 130, but the provider terminal 140 may not modify the relevant information of the requestor.\",\n \"In some embodiments, information exchanging of one or more components in the on-demand service system 100 may be achieved by way of requesting a service.\",\n \"The object of the service request may be any product.\",\n \"In some embodiments, the product may be a tangible product or an immaterial product.\",\n \"The tangible product may include food, medicine, commodity, chemical product, electrical appliance, clothing, car, housing, luxury, or the like, or any combination thereof.\",\n \"The immaterial product may include a servicing product, a financial product, a knowledge product, an internet product, or the like, or any combination thereof.\",\n \"The internet product may include an individual host product, a web product, a mobile internet product, a commercial host product, an embedded product, or the like, or any combination thereof.\",\n \"The mobile internet product may be used in a software of a mobile terminal, a program, a system, or the like, or any combination thereof.\",\n \"The mobile terminal may include a tablet computer, a laptop computer, a mobile phone, a personal digital assistance (PDA), a smart watch, a point of sale (POS) device, an onboard computer, an onboard television, a wearable device, or the like, or any combination thereof.\",\n \"For example, the product may be any software and/or application used in the computer or mobile phone.\",\n \"The software and/or application may relate to socializing, shopping, transporting, entertainment, learning, investment, or the like, or any combination thereof.\",\n \"In some embodiments, the software and/or application relating to transporting may include a traveling software and/or application, a vehicle scheduling software and/or application, a mapping software and/or application, etc.\",\n \"In the vehicle scheduling software and/or application, the vehicle may include a horse, a carriage, a rickshaw (e.g., a wheelbarrow, a bike, a tricycle, etc.\",\n \"), a car (e.g., a taxi, a bus, a private car, etc.\",\n \"), a train, a subway, a vessel, an aircraft (e.g., an airplane, a helicopter, a space shuttle, a rocket, a hot-air balloon, etc.\",\n \"), or the like, or any combination thereof.\",\n \"FIG.\",\n \"2 is a schematic diagram illustrating exemplary hardware and software components of a computing device 200 on which the server 110, the requestor terminal 130, the vehicle terminal 170, and/or the provider terminal 140 may be implemented according to some embodiments of the present disclosure.\",\n \"For example, the processing engine 112 may be implemented on the computing device 200 and configured to perform functions of the processing engine 112 disclosed in this disclosure.\",\n \"The computing device 200 may be a general-purpose computer or a special-purpose computer; both may be used to implement an on-demand system for the present disclosure.\",\n \"The computing device 200 may be used to implement any component of the on-demand service as described herein.\",\n \"For example, the processing engine 112 may be implemented on the computing device 200, via its hardware, software program, firmware, or a combination thereof.\",\n \"Although only one such computer is shown, for convenience, the computer functions relating to the on-demand service as described herein may be implemented in a distributed fashion on a number of similar platforms, to distribute the processing load.\",\n \"The computing device 200, for example, may include COM ports 250 connected to and from a network connected thereto to facilitate data communications.\",\n \"The computing device 200 may also include a processor 220, in the form of one or more processors, for executing program instructions.\",\n \"The exemplary computer platform may include an internal communication bus 210, program storage and data storage of different forms, for example, a disk 270, and a read only memory (ROM) 230, or a random access memory (RAM) 240, for various data files to be processed and/or transmitted by the computer.\",\n \"The exemplary computer platform may also include program instructions stored in the ROM 230, RAM 240, and/or any other type of non-transitory storage medium to be executed by the processor 220.The methods and/or processes of the present disclosure may be implemented as the program instructions.\",\n \"The computing device 200 also includes an I/O component 260, supporting input/output between the computer and other components therein.\",\n \"The computing device 200 may also receive programming and data via network communications.\",\n \"Merely for illustration, only one processor is illustrated in the computing device 200.However, it should be noted that the computing device 200 in the present disclosure may also include multiple processors, thus operations and/or method steps that are performed by one processor as described in the present disclosure may also be jointly or separately performed by the multiple processors.\",\n \"For example, if in the present disclosure the processor of the computing device 200 executes both step A and step B, it should be understood that step A and step B may also be performed by two different processors jointly or separately in the computing device 200 (e.g., the first processor executes step A and the second processor executes step B, or the first and second processors jointly execute steps A and B).\",\n \"FIG.\",\n \"3 is a schematic block diagram illustrating an exemplary processing engine 112 according to some embodiments of the present disclosure.\",\n \"The processing engine 112 may include a communication module 310, a determination module 320, and a terminal identifying module 330.The communication module 310 may be configured to receive and/or send information related to a first terminal associated with a vehicle (e.g., a vehicle terminal 170 of FIG.\",\n \"1), a second terminal associated with a service provider (e.g., a provider terminal 140 of FIG.\",\n \"1) or a third terminal associated with a service requestor (e.g., a requestor terminal 130 of FIG.\",\n \"1).\",\n \"In some embodiments, the second terminal may include the first terminal.\",\n \"In some embodiments, the third terminal (e.g., the service requestor terminal 130) may communicate with the processing engine 112 via an application installed in the third terminal.\",\n \"The service requestor may send a request for transportation service to the processing engine 112 through the application.\",\n \"In some embodiments, the transportation service may be a service of taking a subject from one location to another location using a vehicle.\",\n \"The subject may include passengers and/or goods.\",\n \"For example, the transportation service may be a taxi service or a delivery service.\",\n \"The vehicle of the transportation systems may include a taxi, a private car, a hitch, a bus, a bike, an electric bicycle, a tricycle, a motorcycle, a train, a bullet train, a high speed train, a subway, a vessel, an aircraft, a spaceship, a hot-air balloon, a driverless vehicle, or the like, or any combination thereof.\",\n \"In some embodiments, the service provider may be someone that accepts the request for transportation service from the service requestor and provides the transportation service to the service requestor using the vehicle.\",\n \"For example, the service provider may be a taxi driver and the service requester may be a passenger requesting a taxi hailing service.\",\n \"The second terminal (e.g., the service provider terminal 140) may communicate with the processing engine 112 via an application installed in the second terminal.\",\n \"The service provider may receive the request for transportation service from the processing engine 112 and accept the request for transportation service through the application.\",\n \"In some embodiments, the communication module 310 may receive terminal information of the first terminal from the second terminal.\",\n \"In some embodiments, the communication module 310 may send the terminal information of the first terminal to the third terminal.\",\n \"In some embodiments, the communication module 310 may send a notification to the third terminal to remind the service requestor to establish a connection between the first terminal and the third terminal.\",\n \"In some embodiments, the connection between the first terminal and the third terminal may include a cable network, a wireline network, an optical fiber network, a telecommunications network, an intranet, the Internet, a local area network (LAN), a wide area network (WAN), a wireless local area network (WLAN), a metropolitan area network (MAN), a wide area network (WAN), a public telephone switched network (PSTN), a Bluetooth™ network, a ZigBee network, a near field communication (NFC) network, an infrared connection, or the like, or any combination thereof.\",\n \"In some embodiments, the terminal information may include an identification of the first terminal, a connection information, or the like, or any combination thereof.\",\n \"The connection information may include an authorization code to enable the first terminal to establish a connection with the third terminal.\",\n \"The determination module 320 may be configured to determine when to send the terminal information of the first terminal to the third terminal.\",\n \"For example, the determination module 320 may determine that the service provider is providing the transportation service to the service requestor.\",\n \"The communication module 310 may send the terminal information of the first terminal to the third terminal in response to the determination.\",\n \"The terminal identifying module 330 may be configured to identify the third terminal.\",\n \"In some embodiments, the determination result may include an identification of the third terminal.\",\n \"The terminal identifying module 330 may identify the third terminal based on the identification of the third terminal.\",\n \"In some embodiments, the information related to the first terminal, the second terminal or the third terminal may be transmitted and/or received using any suitable communication protocol (e.g., the Hypertext Transfer Protocol (HTTP), Address Resolution Protocol (ARP), Dynamic Host Configuration Protocol (DHCP), File Transfer Protocol (FTP), etc.).\",\n \"The modules in the processing engine 112 may be connected to or communicate with each other via a wired connection or a wireless connection.\",\n \"The wired connection may include a metal cable, an optical cable, a hybrid cable, or the like, or any combination thereof.\",\n \"The wireless connection may include a Local Area Network (LAN), a Wide Area Network (WAN), a Bluetooth™, a ZigBee, a Near Field Communication (NFC), an infrared connection, or the like, or any combination thereof.\",\n \"Two or more of the modules may be combined as a single module, and any one of the modules may be divided into two or more units.\",\n \"For example, the terminal identifying module 330 may be integrated into the determination module 320 as a single module which may both determine when to send the terminal information associated with the first terminal to the third terminal and identify the third the third terminal.\",\n \"As another example, the processing engine 112 may include a storage module (not shown in FIG.\",\n \"3) which may be configured to store data and/or instructions associated with the modules in the processing engine 112.One of ordinary skill in the art would understand that when an element of the on-demand service system 100 performs, the element may perform through electrical signals (e.g., current) and/or electromagnetic signals.\",\n \"For example, when a requestor terminal 130 sends out a service request to the server 110, a processor of the requestor terminal 130 may generate an electrical signal encoding the request.\",\n \"The processor of the requestor terminal 130 may then send the electrical signal to an output port.\",\n \"If the requestor terminal 130 communicates with the server 110 via a wired network, the output port may be physically connected to a cable, which further transmit the electrical signal to an input port of the server 110.If the service terminal 130 communicates with the server 110 via a wireless network, the output port of the requestor terminal 130 may be one or more antennas, which convert the electrical signal to electromagnetic signal.\",\n \"Similarly, a provider terminal 140 may receive an instruction and/or service request from the server 110 via electrical signal or electromagnet signals.\",\n \"Within an electronic device, such as the requestor terminal 130, the provider terminal 140, and/or the server 110, when a processor thereof processes an instruction, sends out an instruction, and/or performs an action, the instruction and/or action is conducted via electrical signals.\",\n \"For example, when the processor retrieves or saves data from a storage medium, it may send out electrical signals to a read/write device of the storage medium, which may read or write structured data in the storage medium.\",\n \"The structured data may be transmitted to the processor in the form of electrical signals via a bus of the electronic device.\",\n \"Here, an electrical signal may refer to one electrical signal, a series of electrical signals, and/or a plurality of discrete electrical signals.\",\n \"FIG.\",\n \"4 is a flowchart illustrating an exemplary process/method 400 for assisting two terminals to establish connections therebetween according to some embodiments of the present disclosure.\",\n \"The process and/or method 400 may be executed by the processing engine 112 in the server 110.For example, the process and/or method 400 may be implemented as a set of instructions (e.g., an application) stored in the storage ROM 230 or RAM 240.The processor 220 may execute the set of instructions and may accordingly be directed to perform the process and/or method 400.The operations of the illustrated process/method presented below are intended to be illustrative.\",\n \"In some embodiments, the process/method 400 may be accomplished with one or more additional operations not described, and/or without one or more of the operations discussed.\",\n \"Additionally, the order in which the operations of the process/method as illustrated in FIG.\",\n \"4 and described below is not intended to be limiting.\",\n \"In step 402, the communication module 310 may receive terminal information associated with a first terminal from a second terminal.\",\n \"For example, the first terminal may be a display device installed in a vehicle, and second terminal may be a driver's terminal such as a taxi driver's smartphone.\",\n \"During work hours, the driver's terminal may send to the server of an online transportation service platform wireless connection ID and password of the vehicle display device.\",\n \"Accordingly, in some embodiments, the terminal information may include an identification of the vehicle display device, a connection information, or the like, or any combination thereof.\",\n \"The connection information may include an authorization code to enable the vehicle display device to establish a connection with the passenger's terminal.\",\n \"In some embodiments, the driver's terminal may obtain the terminal information of the vehicle display device and send the terminal information of the vehicle display device to the processing engine 112.For example, the driver's terminal may establish a connection (e.g., a Bluetooth™, a Wireless Local Area Network (WLAN) or an infrared connection) with the vehicle display device.\",\n \"The driver's terminal may obtain the terminal information of the vehicle display device via the connection and send the terminal information of the vehicle display device to the processing engine 112 via the network 120.In some embodiments, the communication module 310 may receive vehicle signals from the driver's terminal.\",\n \"The vehicle signals include vehicle structured data encoding the terminal information associated with the vehicle display device.\",\n \"In some embodiments, the vehicle structured data may include a first portion encoding the identification of the vehicle display device and a second portion encoding the connection information of the vehicle display device.\",\n \"In some embodiments, the vehicle signals may be wireless signals.\",\n \"In step 404, the determination module 320 may generate a determination result by determining that the service provider is providing a transportation service to a service requestor.\",\n \"In some embodiments, the driver's terminal (e.g., the second terminal or the service provider terminal 140) may communicate with the processing engine 112 via an application installed in the driver's terminal.\",\n \"In some embodiments, the application installed in the driver's terminal may provide an interface for the driver to send commands and/or instructions to the driver's terminal and/or the processing engine 112.For example, the driver may use the interface to send a first instruction that the driver accepts the request for transportation service from the passenger to the processing engine 112.As another example, the driver may use the interface to send a second instruction that the driver has picked up the passenger to the processing engine 112.As still another example, the driver may use the interface to send a third instruction that the driver starts to charge the passenger to the processing engine 112.Still another example, the application may be installed in the passenger's terminal, so that the passenger may use the interface to notify the processing engine 112 about his/her status about the service, as stated above, with the driver.\",\n \"The determination module 320 may generate a determination result that the driver is providing a transportation service to a driver when receiving at least one of the first instruction, the second instruction or the third instruction from the driver's terminal and/or the passenger's terminal.\",\n \"In some embodiments, the driver's terminal and/or the passenger's terminal may send, to the determination module 320, service signals including a first portion encoding at least one of the first instruction, the second instruction or the third instruction, a second portion encoding a command to direct the determination module 320 to generate a determination result that the driver is providing a transportation service to the service requestor, a third portion encoding an identification of the driver's terminal, and a fourth portion encoding an identification of the passenger's terminal.\",\n \"In some embodiments, the determination module 320 may generate, based on the service signals from the driver's terminal and/or the passenger's terminal, determination signals including a first portion encoding the determination result that the driver is providing a transportation service to the service requestor, a second portion encoding a command to direct the terminal identification module 330 to identify the passenger's terminal, and a third portion encoding the identification of the passenger's terminal.\",\n \"The determination module 320 may send the determination signals to the terminal identification module 330.In step 406, the terminal identification module 330 may identify a third terminal in response to the determination result.\",\n \"In some embodiments, the determination result may include the identification of the passenger's terminal.\",\n \"The terminal identifying module 330 may identify the passenger's terminal based on the identification of the passenger's terminal.\",\n \"In some embodiments, the terminal identification module 330 may receive the determination signals from the determination module 320, and generate and/or confirm identification signals including a first portion encoding the identification of the passenger's terminal based on the second portion and the third portion included in the determination signals.\",\n \"The identification signals may further include a second portion encoding a command to direct the communication module 310 to send the terminal information of the vehicle display device to the passenger's terminal.\",\n \"The terminal identification module 330 may send the identification signals to the communication module 310.In some embodiments, the identification signals may be wireless signals.\",\n \"In step 408, the communication module 310 may send the terminal information associated with the vehicle display device to the passenger's terminal.\",\n \"The communication module 310 may send the information associated with the vehicle display device as a cellphone message, an e-mail, an instant communication message from a social network service, or the like, or any combination thereof.\",\n \"In some embodiments, the communication module 310 may send connection signals to the passenger's terminal.\",\n \"The connection signals may include connection structured data including a first portion encoding the identification of the passenger's terminal, a second portion encoding the terminal information of the vehicle display device, and a third portion encoding a command to direct the passenger's terminal to initiate a process to establish a connection with the vehicle display device based on the terminal information of the vehicle display device.\",\n \"In some embodiments, the connection signals may be wireless signals.\",\n \"In some embodiments, the passenger's terminal may initiate the process of establishing the connection with the vehicle display device automatically while the passenger's terminal receives the terminal information of the vehicle display device.\",\n \"In some embodiments, when receiving the terminal information of the vehicle display device from the processing engine 112, the passenger's terminal may initiate the process of establishing the connection with the vehicle display device based on a notification to remind the service requestor to establish a connection between the vehicle display device and the passenger's terminal from the processing engine 112.In step 410, the communication module 310 may send, to the third terminal, a notification to remind the service requestor to establish a connection between the first terminal and the third terminal based on the terminal information.\",\n \"The notification may include a cellphone message, an e-mail, a pop-up message from a social network service, or the like, or any combination thereof.\",\n \"In some embodiments, the communication module 310 may perform step 410 after step 408.In some embodiments, the communication module 310 may perform step 410 and step 408 simultaneously.\",\n \"It should be noted that the above description is merely provided for the purposes of illustration, and not intended to limit the scope of the present disclosure.\",\n \"For persons having ordinary skills in the art, multiple variations and modifications may be made under the teachings of the present disclosure.\",\n \"However, those variations and modifications do not depart from the scope of the present disclosure.\",\n \"For example, one or more other optional steps (e.g., a storing step) may be added elsewhere in the exemplary process/method 400.As another example, for the condition that the process of establishing the connection between the vehicle display device and the passenger's terminal was initiated automatically in the passenger's terminal, step 410 may be optional.\",\n \"FIG.\",\n \"5A is a schematic block diagram illustrating an exemplary third terminal according to some embodiments of the present disclosure.\",\n \"In some embodiments, the third terminal may be a requestor terminal 130 of FIG.\",\n \"1.The following description in FIG.\",\n \"5A will take a passenger terminal as an example of the third terminal.\",\n \"The third terminal may include an I/O module 510 and a connection establishing module 520.The I/O module 510 may be configured to receive and/or send information related to the vehicle display device, the driver's terminal or the passenger's terminal.\",\n \"For example, the I/O module 510 may receive terminal information of a vehicle display device (e.g., the vehicle terminal 170) from a computer server of an online on-demand transportation service platform (e.g., the processing engine 112 in the server 110).\",\n \"As another example, the I/O module 510 may send, to the vehicle display device, a request of connecting the vehicle display device with the passenger's terminal (e.g., the requestor terminal 130) based on the terminal information of the vehicle display device.\",\n \"As still another example, the I/O module 510 may receive, from the vehicle display device, a response of agreeing to connect the vehicle display device with the passenger's terminal.\",\n \"As a further example, the I/O module 510 may send multimedia contents in the passenger's terminal to the vehicle display device.\",\n \"The connection establishing module 520 may be configured to initiate a process of establishing a connection between the vehicle display device and the passenger's terminal based on the terminal information of the vehicle display device.\",\n \"In some embodiments, the connection establishing module 520 may initiate the process of establishing the connection with the vehicle display device automatically while the I/O module 510 receives the terminal information of the vehicle display device.\",\n \"In some embodiments, when the I/O module 510 receives the terminal information of the vehicle display device from the processing engine 112, the connection establishing module 520 may initiate the process of establishing the connection with the vehicle display device by receiving a command to initiate the process of establishing the connection with the vehicle display device input by a user (e.g., the service requestor).\",\n \"The modules in the requestor terminal 130 (e.g., the passenger's terminal) may be connected to or communicate with each other via a wired connection or a wireless connection.\",\n \"The wired connection may include a metal cable, an optical cable, a hybrid cable, or the like, or any combination thereof.\",\n \"The wireless connection may include a Local Area Network (LAN), a Wide Area Network (WAN), a Bluetooth™, a ZigBee, a Near Field Communication (NFC), or the like, or any combination thereof.\",\n \"Two or more of the modules may be combined as a single module, and any one of the modules may be divided into two or more units.\",\n \"In some embodiments, the requestor terminal 130 may include a storage module (not shown in FIG.\",\n \"5A) which may be configured to store data and/or instructions associated with the modules in the requestor terminal 130.FIG.\",\n \"5B is a flowchart illustrating an exemplary process/method 500 for establishing a connection between two terminals according to some embodiments of the present disclosure.\",\n \"The process and/or method 500 may be executed by the requestor terminal 130 (e.g., the passenger's terminal) in the server 110.For example, the requestor terminal 130 may be implemented on the computing device 200 in FIG.\",\n \"2.The process and/or method 500 may be implemented as a set of instructions (e.g., an application) stored in the storage ROM 230 or RAM 240.The processor 220 may execute the set of instructions and may accordingly be directed to perform the process and/or method 500.The operations of the illustrated process/method presented below are intended to be illustrative.\",\n \"In some embodiments, the process/method may be accomplished with one or more additional operations not described, and/or without one or more of the operations discussed.\",\n \"Additionally, the order in which the operations of the process/method as illustrated in FIG.\",\n \"5B and described below is not intended to be limiting.\",\n \"In step 502, the I/O module 510 may receive terminal information of a vehicle display device from a computer server of an online on-demand transportation service platform (e.g., the processing engine 112 in the server 110).\",\n \"In some embodiments, the I/O module 510 may receive the connection signals from the computer server (e.g., the processing engine 112 in the server 110).\",\n \"The connection signals may include connection structured data encoding the terminal information associated with the vehicle display device.\",\n \"The connection structured data may include a first portion encoding the identification of the passenger's terminal, a second portion encoding the terminal information of the vehicle display device, and a third portion encoding a command to direct the passenger's terminal to initiate a process of establishing a connection with the vehicle display device.\",\n \"In step 504, the connection establishing module 520 may initiate a process of establishing a connection between the vehicle display device and the passenger's terminal based on the terminal information of the vehicle display device.\",\n \"In some embodiments, the connection establishing module 520 may initiate the process of establishing the connection with the vehicle display device automatically while the I/O module 510 receives the terminal information of the vehicle display device.\",\n \"In some embodiments, when the I/O module 510 receives the terminal information of the vehicle display device from the processing engine 112, the connection establishing module 520 may initiate the process of establishing the connection with the vehicle display device by receiving a command to initiate the process of establishing the connection with the vehicle display device input by a user (e.g., the service requestor).\",\n \"For example, after receiving the notification to remind the service requestor to establish a connection between the passenger's terminal and the vehicle display device, the passenger's terminal may display a button of “YES” to initiate the process and a button of “NO” to refuse to initiate the process.\",\n \"The service requestor may press the button of “YES” to input a command to initiate the process of establishing the connection with the vehicle display device.\",\n \"The connection establishing module 520 may initiate the process of establishing the connection with the vehicle display device in response to the command.\",\n \"In step 506, the I/O module 510 may send multimedia contents in the third terminal to the first terminal via the connection.\",\n \"The multimedia contents may include texts, images, video stream, audio tracks, graphics, or the like, or the combination thereof.\",\n \"In some embodiments, the multimedia contents in the passenger's terminal received by the vehicle display device may be played in the vehicle display device.\",\n \"In some embodiments, the I/O module 510 may access the one or more storage media to read multimedia contents stored therein, encode the multimedia contents to structured data and send electronic signals encoding the structured data to the vehicle display device via the connection.\",\n \"In some embodiments, the connection between the passenger's terminal and the vehicle display device is limited to unidirectional sending the multimedia data from the passenger's terminal to the vehicle display device.\",\n \"Alternatively, the connection between the passenger's terminal and the vehicle display device may be bidirectional sending multimedia data from the passenger's terminal to the vehicle display device.\",\n \"It should be noted that the above description is merely provided for the purposes of illustration, and not intended to limit the scope of the present disclosure.\",\n \"For persons having ordinary skills in the art, multiple variations and modifications may be made under the teachings of the present disclosure.\",\n \"However, those variations and modifications do not depart from the scope of the present disclosure.\",\n \"For example, one or more other optional steps (e.g., a storing step) may be added elsewhere in the exemplary process/method 500.FIG.\",\n \"6 is a flowchart illustrating an exemplary process/method 600 for initiating a process of establishing a connection between two terminals according to some embodiments of the present disclosure.\",\n \"The process and/or method 600 may be executed by the requestor terminal 130 (e.g., the passenger's terminal) in the server 110.For example, the requestor terminal 130 may be implemented on the computing device 200 in FIG.\",\n \"2.The process and/or method 600 may be implemented as a set of instructions (e.g., an application) stored in the storage ROM 230 or RAM 240.The processor 220 may execute the set of instructions and may accordingly be directed to perform the process and/or method 600.The operations of the illustrated process/method presented below are intended to be illustrative.\",\n \"In some embodiments, the process/method may be accomplished with one or more additional operations not described, and/or without one or more of the operations discussed.\",\n \"Additionally, the order in which the operations of the process/method as illustrated in FIG.\",\n \"6 and described below is not intended to be limiting.\",\n \"In some embodiments, the process and/or method 600 may initiate the process in step 504 in the process and/or method 500.In step 602, the I/O module 510 may send, to the first terminal, a request of connecting the first terminal with the third terminal based on the terminal information of the first terminal.\",\n \"In some embodiments, the request of connecting the vehicle display device with the passenger's terminal may be a notification to remind the driver to connect the vehicle display device with the passenger's terminal.\",\n \"In some embodiments, the I/O module 510 may send, to the vehicle display device, request signals including a first portion encoding the request of connecting the vehicle display device with the passenger's terminal based on the terminal information of the vehicle display device and a second portion encoding the terminal information of the vehicle display device.\",\n \"In step 604, the I/O module 510 may receive, from the first terminal, a response of agreeing to connect the first terminal with the third terminal.\",\n \"In some embodiments, after receiving the request of connecting the vehicle display device with the passenger's terminal, the vehicle display device may generate a response of agreeing to connect the vehicle display device with the passenger's terminal based on a command input by a user (e.g., the driver).\",\n \"For example, after the vehicle display device receives the request of connecting the vehicle display device with the passenger's terminal, the vehicle display device and/or the driver's terminal may display a button of “YES” to agree to connect with the passenger's terminal and a button of “NO” to refuse to connect with the passenger's terminal.\",\n \"The driver may press the button of “YES” to input a command of agreeing to connect with the passenger's terminal.\",\n \"The vehicle display device may generate a response of agreeing to connect with the passenger's terminal in response to the command.\",\n \"In some embodiments, after receiving the request of connecting the vehicle display device with the passenger's terminal, the vehicle display device may generate a response of agreeing to connect the vehicle display device to the passenger's terminal automatically.\",\n \"In some embodiments, the I/O module 510 may receive, from the vehicle display device, response signals including a first portion encoding the response of agreeing to connect the vehicle display device with the passenger's terminal and a second portion encoding a command to direct the connection establishing module 520 to establish a connection between the vehicle display device and the passenger's terminal.\",\n \"In step 606, the connection establishing module 520 may establish a connection between the first terminal and the third terminal based on the response.\",\n \"It should be noted that the above description is merely provided for the purposes of illustration, and not intended to limit the scope of the present disclosure.\",\n \"For persons having ordinary skills in the art, multiple variations and modifications may be made under the teachings of the present disclosure.\",\n \"However, those variations and modifications do not depart from the scope of the present disclosure.\",\n \"For example, one or more other optional steps (e.g., a storing step) may be added elsewhere in the exemplary process/method 600.Having thus described the basic concepts, it may be rather apparent to those skilled in the art after reading this detailed disclosure that the foregoing detailed disclosure is intended to be presented by way of example only and is not limiting.\",\n \"Various alterations, improvements, and modifications may occur and are intended to those skilled in the art, though not expressly stated herein.\",\n \"These alterations, improvements, and modifications are intended to be suggested by this disclosure, and are within the spirit and scope of the exemplary embodiments of this disclosure.\",\n \"Moreover, certain terminology has been used to describe embodiments of the present disclosure.\",\n \"For example, the terms “one embodiment,” “an embodiment,” and/or “some embodiments” mean that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure.\",\n \"Therefore, it is emphasized and should be appreciated that two or more references to “an embodiment” or “one embodiment” or “an alternative embodiment” in various portions of this specification are not necessarily all referring to the same embodiment.\",\n \"Furthermore, the particular features, structures or characteristics may be combined as suitable in one or more embodiments of the present disclosure.\",\n \"Further, it will be appreciated by one skilled in the art, aspects of the present disclosure may be illustrated and described herein in any of a number of patentable classes or context including any new and useful process, machine, manufacture, or composition of matter, or any new and useful improvement thereof.\",\n \"Accordingly, aspects of the present disclosure may be implemented entirely hardware, entirely software (including firmware, resident software, micro-code, etc.)\",\n \"or combining software and hardware implementation that may all generally be referred to herein as a “unit,” “module,” or “system.” Furthermore, aspects of the present disclosure may take the form of a computer program product embodied in one or more computer readable media having computer readable program code embodied thereon.\",\n \"A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave.\",\n \"Such a propagated signal may take any of a variety of forms, including electro-magnetic, optical, or the like, or any suitable combination thereof.\",\n \"A computer readable signal medium may be any computer readable medium that is not a computer readable storage medium and that may communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.\",\n \"Program code embodied on a computer readable signal medium may be transmitted using any appropriate medium, including wireless, wireline, optical fiber cable, RF, or the like, or any suitable combination of the foregoing.\",\n \"Computer program code for carrying out operations for aspects of the present disclosure may be written in any combination of one or more programming languages, including an object-oriented programming language such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.\",\n \"NET, Python or the like, conventional procedural programming languages, such as the “C” programming language, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages such as Python, Ruby and Groovy, or other programming languages.\",\n \"The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server.\",\n \"In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet Service Provider) or in a cloud computing environment or offered as a service such as a Software as a Service (SaaS).\",\n \"Furthermore, the recited order of processing elements or sequences, or the use of numbers, letters, or other designations therefore, is not intended to limit the claimed processes and methods to any order except as may be specified in the claims.\",\n \"Although the above disclosure discusses through various examples what is currently considered to be a variety of useful embodiments of the disclosure, it is to be understood that such detail is solely for that purpose, and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover modifications and equivalent arrangements that are within the spirit and scope of the disclosed embodiments.\",\n \"For example, although the implementation of various components described above may be embodied in a hardware device, it may also be implemented as a software only solution, e.g., an installation on an existing server or mobile device.\",\n \"Similarly, it should be appreciated that in the foregoing description of embodiments of the present disclosure, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the various embodiments.\",\n \"This method of disclosure, however, is not to be interpreted as reflecting an intention that the claimed subject matter requires more features than are expressly recited in each claim.\",\n \"Rather, claimed subject matter may lie in less than all features of a single foregoing disclosed embodiment.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15870985"}}},{"rowIdx":4493688,"cells":{"text":{"kind":"list like","value":[["PHENYLCARBAZOLE-BASED COMPOUNDS AND FLUORENE-BASED COMPOUNDS AND ORGANIC LIGHT EMITTING DEVICE AND FLAT PANEL DISPLAY DEVICE COMPRISING THE SAME","Provided are an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the organic layer includes a layer having at least one of the compounds having at least one carbazole group, and a flat panel display device including the organic light emitting device.","The organic light emitting device has low driving voltage, excellent current density, high brightness, excellent color purity, high efficiency, and long lifetime."],["1.An organic light emitting device, comprising: a substrate; a first electrode; a second electrode, the first electrode is a reflective electrode, or the second electrode is a reflective electrode, the remaining being semitransparent or transparent electrodes; and an organic layer interposed between the first electrode and the second electrode, the organic layer comprising: an emission layer comprising a blue emission layer; and a layer comprising at least one compound selected from the group consisting of compounds represented by Formula 3, the layer having a third region formed under the blue emission layer, the thickness of the third region being in the range of 1,000 to 1,400 Å, the layer being between the first electrode and the emission layer: R6, R7, and R8 independently being one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7, and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring, Ar3 independently being a substituted or unsubstituted C6-C30 aryl group or a substituted or unsubstituted C2-C30 heteroaryl group, each Y independently being one selected from the group consisting of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C2-C30 hetero ring, and each n independently being an integer from 0 to 5.2.The organic light emitting device of claim 1, wherein the compound represented by Formula 3 comprises a compound represented by Formula 3a: R6, R7 and R8 independently being one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; and Q4 being one selected from the group consisting of a hydrogen atom, a cyano group, a fluorine atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C2-C30 hetero ring, and a substituted or unsubstituted amino group.","3.The organic light emitting device of claim 1, wherein the compound represented by Formula 3 is any one of Compounds 46 through 62: 4.The organic light emitting device of claim 1, wherein the compound represented by Formula 3 is Compound 56: 5.The organic light emitting device of claim 1, wherein the layer comprising said at least one compound selected from the group of compounds represented by Formula 3 is one of a hole injection layer, a hole transport layer, and a single layer having hole injecting and transporting properties.","6.The organic light emitting device of claim 1, wherein the layer comprising said at least one compound selected from the group of compounds represented by Formula 3 is a hole injection layer or a hole transport layer.","7.A display device comprising the organic light emitting device of claim 1.8.The display device of claim 7, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.","9.The organic light emitting device of claim 1, the first electrode being disposed on the substrate and being a reflective electrode, the second electrode being a semitransparent or transparent electrode, and light generated in the organic layer passes through the second electrode.","10.An organic light emitting device, comprising: a substrate; a first electrode; a second electrode, the first electrode is a reflective electrode, or the second electrode is a reflective electrode, the remaining being semitransparent or transparent electrodes; and an organic layer interposed between the first electrode and the second electrode, the organic layer comprising: an emission layer comprising a blue emission layer; and a layer comprising at least one compound selected from the group consisting of compounds represented by Formula 3, the layer having a third region formed under the blue emission layer, the thickness of the third region being in the range of 1,000 to 1,400 Å, the layer being between the first electrode and the emission layer: where R6, R7 and R8 are each independently one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C4-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; Ar3 is a biphenyl group; each Y is independently one selected from the group consisting of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C4-C30 hetero ring; and each n of the Yn between the carbazole ring and the nitrogen is 1, and n of the Yn between the fluorene ring and the nitrogen is 0.11.The organic light emitting device of claim 10, wherein R6 and R7 are each a methyl group and R8 is a phenyl.","12.The organic light emitting device of claim 11, wherein the compound represented by Formula 3 has the following chemical structure: 13.The organic light emitting device of claim 10, wherein the first electrode is formed on the substrate and is a reflective electrode, the second electrode is a semitransparent or transparent electrode, and light generated in the organic layer passes through the second electrode.","14.The organic light emitting device of claim 10, wherein the layer comprising the compound represented by Formula 3 is one of a hole injection layer, a hole transport layer, and a single layer having hole injecting and transporting properties.","15.A display device comprising the organic light emitting device of claim 10.16.The display device of claim 15, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.","17.An organic light emitting device, comprising: a substrate; a first electrode; a second electrode, the first electrode is a reflective electrode, or the second electrode is a reflective electrode, the remaining being semitransparent or transparent electrodes; and an organic layer interposed between the first electrode and the second electrode, the organic layer comprising: an emission layer comprising a blue emission layer; and a region comprising at least one compound selected from the group consisting of compounds represented by Formula 3, the region having a third region formed under the blue emission layer, the thickness of the third region being in the range of 1,000 to 1,400 Å, the region being between the first electrode and the emission layer: R6, R7, and R8 independently being one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7, and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring, Ar3 independently being a substituted or unsubstituted C6-C30 aryl group or a substituted or unsubstituted C2-C30 heteroaryl group, each Y independently being one selected from the group consisting of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C2-C30 hetero ring, and each n independently being an integer from 0 to 5.18.A display device comprising the organic light emitting device of claim 17.19.The display device of claim 18, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.","20.An organic light emitting device, comprising: a substrate; a first electrode; a second electrode, the first electrode is a reflective electrode, or the second electrode is a reflective electrode, the remaining being semitransparent or transparent electrodes; and an organic layer interposed between the first electrode and the second electrode, the organic layer comprising: an emission layer comprising a blue emission layer; and a region comprising at least one compound selected from the group consisting of compounds represented by Formula 3, the region having a third region formed under the blue emission layer, the thickness of the third region being in the range of 1,000 to 1,400 Å, the region being between the first electrode and the emission layer: where R6, R7 and R8 are each independently one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C4-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; Ar3 is a biphenyl group; each Y is independently one selected from the group consisting of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C4-C30 hetero ring; and each n of the Yn between the carbazole ring and the nitrogen is 1, and n of the Yn between the fluorene ring and the nitrogen is 0.21.A display device comprising the organic light emitting device of claim 20.22.The display device of claim 21, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.","23.An organic light emitting device, comprising: a substrate; a first electrode; a second electrode, the first electrode is a reflective electrode, or the second electrode is a reflective electrode, the remaining being semitransparent or transparent electrodes; and an organic layer interposed between the first electrode and the second electrode, the organic layer comprising: an emission layer comprising a blue emission layer; and a region comprising at least one compound selected from the group consisting of compounds represented by Formula 3, the region having a third region formed under the blue emission layer, the region further comprising a hole transporting layer, the total thickness of the third region and the hole transporting layer being in the range of 1,200 to 1,600 Å, the region being between the first electrode and the emission layer: R6, R7, and R8 independently being one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7, and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring, Ar3 independently being a substituted or unsubstituted C6-C30 aryl group or a substituted or unsubstituted C2-C30 heteroaryl group, each Y independently being one selected from the group consisting of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C2-C30 hetero ring, and each n independently being an integer from 0 to 5.24.A display device comprising the organic light emitting device of claim 23.25.The display device of claim 24, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.","26.An organic light emitting device, comprising: a substrate; a first electrode; a second electrode, the first electrode is a reflective electrode, or the second electrode is a reflective electrode, the remaining being semitransparent or transparent electrodes; and an organic layer interposed between the first electrode and the second electrode, the organic layer comprising: an emission layer comprising a blue emission layer; and a region comprising at least one compound selected from the group consisting of compounds represented by Formula 3, the region having a third region formed under the blue emission layer, the region further comprising a hole transporting layer, the total thickness of the third region and the hole transporting layer being in the range of 1,200 to 1,600 Å, the region being between the first electrode and the emission layer: where R6, R7 and R8 are each independently one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C4-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; Ar3 is a biphenyl group; each Y is independently one selected from the group consisting of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C4-C30 hetero ring; and each n of the Yn between the carbazole ring and the nitrogen is 1, and n of the Yn between the fluorene ring and the nitrogen is 0.27.A display device comprising the organic light emitting device of claim 26.28.The display device of claim 27, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor."],[" BACKGROUND OF THE INVENTION "],[" SUMMARY OF THE INVENTION The present invention provides an improved organic light emitting device.","The present invention provides an organic light emitting device including an organic layer containing a compound that has excellent hole mobility between a pair of electrodes capable of generating resonance during the operation of the light emitting device, an organic light emitting device including a hole injection layer having a predetermined range of thickness between a pair of electrodes capable of generating resonance during the operation of the light emitting device, and a flat panel display device including the organic light emitting device.","According to an aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the organic layer comprises a layer including at least one of compounds represented by Formulae 1, 2, and 3 below.","Here, X is one of a substituted or unsubstituted C 1 -C 30 alkylene group, a substituted or unsubstituted C 2 -C 30 alkenylene group, a substituted or unsubstituted C 6 -C 30 arylene group, a substituted or unsubstituted C 2 -C 30 heteroarylene group, and a substituted or unsubstituted C 2 -C 30 hetero ring; Each R 1 , each R 2 , each R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are each independently one of a hydrogen atom, a substituted or unsubstituted C 1 -C 30 alkyl group, a substituted or unsubstituted C 1 -C 30 alkoxy group, a substituted or unsubstituted C 6 -C 30 aryl group, a substituted or unsubstituted C 6 -C 30 aryloxy group, a substituted or unsubstituted C 2 -C 30 hetero ring, a substituted or unsubstituted C 5 -C 30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R 1 , R 2 and R 3 can be optionally bound with one another to form a saturated or unsaturated carbon ring, R 4 and R 5 , can be optionally bound with one another to form a saturated or unsaturated carbon ring, and two or more of R 6 , R 7 and R 8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; each Ar 1 , Ar 2 and Ar 3 are each independently a substituted or unsubstituted C 6 -C 30 aryl group or a substituted or unsubstituted C 2 -C 30 heteroaryl group; each Y is independently one of a substituted or unsubstituted C 1 -C 30 alkyl group, a substituted or unsubstituted C 6 -C 30 aryl group, and a substituted or unsubstituted C 2 -C 30 hetero ring; and each n is independently an integer from 0 to 5.According to another aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer having a red emission region and a hole injection layer having a region formed under the red emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the red emission region is in the range of 1,600 to 2,200 Å.","According to another aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer having a green emission region and a hole injection layer having a region formed under the green emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the green emission region is in the range of 1,400 to 1,800 Å.","According to another aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer having a blue emission region and a hole injection layer having a region formed under the blue emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the blue emission region is in the range of 1,000 to 1,400 Å.","According to another aspect of the present invention, there is provided a flat panel display device including the organic light emitting device, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.","The organic light emitting device has low driving voltage, excellent current density, high brightness, excellent color purity, high efficiency, and long lifetime.","Particularly, the organic light emitting device has excellent lifetime."],["CROSS-REFERENCE TO RELATED APPLICATIONS This application is a Continuation of U.S. patent application Ser.","No.","15/266,959, filed on Sep. 15, 2016, which is a Continuation of U.S. patent application Ser.","No.","14/607,326, filed on Jan. 28, 2015, now issued as U.S. Pat.","No.","9,478,754, which is a Continuation of U.S. patent application Ser.","No.","13/439,586, filed on Apr.","4, 2012, now issued as U.S. Pat.","No.","8,974,922, which is a Continuation of U.S. patent application Ser.","No.","11/806,039, filed on May 29, 2007, now issued as U.S. Pat.","No.","8,188,315, which is a Continuation-in-Part of U.S. patent application Ser.","No.","11/286,421, filed on Nov. 25, 2005, now issued as U.S. Pat.","No.","8,021,764, which is a Continuation-in-Part of U.S. patent application Ser.","No.","11/181,706, filed on Jul.","13, 2005, now issued as U.S. Pat.","No.","7,431,997, which is a Continuation-in-Part of U.S. patent application Ser.","No.","11/097,182, filed on Apr.","4, 2005, now issued as U.S. Pat.","No.","7,737,627, and claims priority from and the benefit of Korean Patent Application No.","10-2006-0048306, filed on May 29, 2006, Korean Patent Application No.","10-2004-0098747, filed on Nov. 29, 2004, Korean Patent Application No.","10-2004-0054700, filed on Jul.","14, 2004, and Korean Patent Application No.","10-2004-0022877, filed on Apr.","2, 2004, each of which is hereby incorporated by reference for all purpose as if fully set forth herein.","BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an organic light emitting device and a flat panel display device, and more particularly, to an organic light emitting device including an organic layer containing a phenylcarbazole-based compound.","Description of the Related Art Organic light emitting devices are self-emission displays that emit light by recombination of electrons and holes in an organic layer made of a fluorescent or phosphorescent compound when a current is applied to the organic layer.","Organic light emitting devices are lightweight, have simple constituent elements, an easy fabrication process, superior image quality, and a wide viewing angle.","Furthermore, organic light emitting devices can realize dynamic images and high color purity.","Organic light emitting devices also have electrical properties such as low power consumption and low driving voltage suitable for portable electronic equipment.","Organic light emitting devices generally have an organic layer in the form of a multi-layer structure including an electron injection layer, an emission layer, a hole transport layer, etc.","instead of including only a single emission layer to improve efficiency and to lower driving voltage.","For example, Japanese Patent Laid-Open Publication No.","2002-252089 discloses an organic light emitting device including a hole transport layer.","However, the driving voltage, current density, brightness, color purity, efficiency and lifetime of a conventional organic light emitting device do not meet desired levels.","Accordingly, these properties must be improved.","SUMMARY OF THE INVENTION The present invention provides an improved organic light emitting device.","The present invention provides an organic light emitting device including an organic layer containing a compound that has excellent hole mobility between a pair of electrodes capable of generating resonance during the operation of the light emitting device, an organic light emitting device including a hole injection layer having a predetermined range of thickness between a pair of electrodes capable of generating resonance during the operation of the light emitting device, and a flat panel display device including the organic light emitting device.","According to an aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the organic layer comprises a layer including at least one of compounds represented by Formulae 1, 2, and 3 below.","Here, X is one of a substituted or unsubstituted C1-C30 alkylene group, a substituted or unsubstituted C2-C30 alkenylene group, a substituted or unsubstituted C6-C30 arylene group, a substituted or unsubstituted C2-C30 heteroarylene group, and a substituted or unsubstituted C2-C30 hetero ring; Each R1, each R2, each R3, R4, R5, R6, R7 and R8 are each independently one of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R1, R2 and R3 can be optionally bound with one another to form a saturated or unsaturated carbon ring, R4 and R5, can be optionally bound with one another to form a saturated or unsaturated carbon ring, and two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; each Ar1, Ar2 and Ar3 are each independently a substituted or unsubstituted C6-C30 aryl group or a substituted or unsubstituted C2-C30 heteroaryl group; each Y is independently one of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C2-C30 hetero ring; and each n is independently an integer from 0 to 5.According to another aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer having a red emission region and a hole injection layer having a region formed under the red emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the red emission region is in the range of 1,600 to 2,200 Å.","According to another aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer having a green emission region and a hole injection layer having a region formed under the green emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the green emission region is in the range of 1,400 to 1,800 Å.","According to another aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer having a blue emission region and a hole injection layer having a region formed under the blue emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the blue emission region is in the range of 1,000 to 1,400 Å.","According to another aspect of the present invention, there is provided a flat panel display device including the organic light emitting device, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.","The organic light emitting device has low driving voltage, excellent current density, high brightness, excellent color purity, high efficiency, and long lifetime.","Particularly, the organic light emitting device has excellent lifetime.","BRIEF DESCRIPTION OF THE DRAWINGS A more complete appreciation of the present invention, and many of the above and other features and advantages of the present invention, will be readily apparent as the same becomes better understood by reference to the following detailed description when considered in conjunction with the accompanying drawings in which like reference symbols indicate the same or similar components, wherein: FIG.","1 schematically illustrates a structure of an organic light emitting device according to an embodiment of the present invention; FIG.","2 schematically illustrates an organic light emitting device including an emission layer comprised of a red emission region, a green emission region, and blue emission region according to an embodiment of the present invention; and FIGS.","3 through 7 are graphs illustrating current efficiencies, luminance, and driving voltages of an organic light emitting device according to an embodiment of the present invention.","DETAILED DESCRIPTION OF THE INVENTION Hereinafter, the present invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown.","The invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.","An organic light emitting device according to an embodiment of the present invention includes a substrate, a first electrode, a second electrode and an organic layer.","The organic layer is disposed between the first electrode and the second electrode and includes an emission layer.","The organic layer can emit red, green, and/or blue light according to a material used to form the emission layer.","One of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode.","Accordingly, resonance may occur between the first electrode and the second electrode during the operation of the light emitting device.","Thus, the light generated in the organic layer between the first electrode and the second electrode resonates between the first electrode and the second electrode during the operation of the light emitting device, and the light is extracted from of the organic light emitting device.","Thus, luminance of the light and light emitting efficiency can be enhanced.","The first electrode may be formed on the substrate.","For example, the first electrode may be a reflective electrode, and the second electrode may be a semitransparent or transparent electrode.","Accordingly, the light generated in the organic layer between the first electrode and the second electrode resonates between the first electrode and the second electrode during the operation of the light emitting device, and the light is extracted through the second electrode, that is, in a direction away from the substrate.","The organic layer of the organic light emitting device according to the current embodiment of the present invention may include a layer containing a phenylcarbazole-based compound.","In particular, the organic layer may include a layer including at least one of the compounds represented by Formulae 1, 2, and 3 below.","Here, X is one of a substituted or unsubstituted C1-C30 alkylene group, a substituted or unsubstituted C2-C30 alkenylene group, a substituted or unsubstituted C6-C30 arylene group, a substituted or unsubstituted C2-C30 heteroarylene group, and a substituted or unsubstituted C2-C30 hetero ring; Each R1, each R2, each R3, R4, R5, R6, R7 and R8 are each independently one of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R1, R2 and R3 can be optionally bound with one another to form a saturated or unsaturated carbon ring, R4 and R5, can be optionally bound with one another to form a saturated or unsaturated carbon ring, and two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; each Ar1, Ar2 and Ar3 are each independently a substituted or unsubstituted C6-C30 aryl group or a substituted or unsubstituted C2-C30 heteroaryl group; each Y is independently one of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C2-C30 hetero ring; and each n is independently an integer from 0 to 5.The compounds represented by Formulae 1, 2, and 3 have a stiff carbazole group, and thus the glass transition temperature or the melting point of the compounds increases.","During the operation of the organic light emitting device according to the current embodiment of the present invention, the compounds are highly resistant to heat generated in the organic layer, between the organic layers, or between the organic layer and the electrode according to Joule's Law, and are stable in a high temperature environment.","Thus, when the compounds are used to form the organic layer of the organic light emitting device of the present embodiment, long lifetime and excellent luminance can be obtained.","In particular, the compounds represented by Formulae 1 and 2 which have two or more carbazole groups may provide long lifetime and excellent brightness.","In addition, the organic light emitting device of the present embodiment including an organic layer containing a compound represented by Formula 1, 2, or 3 has excellent stability during storage and operation.","This feature can be explained by, for example, but not limited to, a high Tg (glass transition temperature) of the compound represented by Formula 1, 2, or 3.The compound represented by Formula 1 may include a compound represented by Formula 1a below, but is not limited thereto.","Here, each R1, each R2, and each R3 are each independently one of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R1, R2 and R3 can be optionally bound with one another to form a saturated or unsaturated carbon ring; and each Q1 is independently one of a hydrogen atom, a cyano group, a fluorine atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C2-C30 hetero ring, and a substituted or unsubstituted amino group.","The compound represented by Formula 1 may include a compound represented by Formula 1b below, but is not limited thereto.","Here, each R1, each R2, and each R3 are each independently one of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R1, R2 and R3 can be optionally bound with one another to form a saturated or unsaturated carbon ring; and each Q2 is one selected from the group consisting of a hydrogen atom, a cyano group, a fluorine atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C2-C30 hetero ring, and a substituted or unsubstituted amino group.","The compound represented by Formula 2 may include a compound represented by Formula 2a below, but is not limited thereto.","Here, R4 and R5 are each independently one of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein R4, and R5 can be optionally bound with one another to form a saturated or unsaturated carbon ring; and Q3 is one of a hydrogen atom, a cyano group, a fluorine atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C2-C30 hetero ring, and a substituted or unsubstituted amino group.","The compound represented by Formula 3 may include a compound represented by Formula 3a below, but is not limited thereto.","Here, R6, R7 and R8 are each independently one of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; and Q4 is one of a hydrogen atom, a cyano group, a fluorine atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C2-C30 hetero ring, and a substituted or unsubstituted amino group.","Hereinafter, examples of the groups used to form the compounds represented by the above formulae will now be described in more detail.","Examples of the unsubstituted C1-C30 alkyl group may include a methyl group, an ethyl group, a propyl group, an isobutyl group, a sec-butyl group, a pentyl group, an iso-amyl group, and a hexyl group.","At least one hydrogen atom in the unsubstituted C1-C30 alkyl group may be substituted with a halogen atom, a C1-C30 alkyl group, a C1-C30 alkoxy group, a low alkylamino group, a hydroxy group, a nitro group, a cyano group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxyl group, a sulfonic acid group, and a phosphoric acid group.","Examples of the unsubstituted C1-C30 alkoxy group may include a methoxy group, an ethoxy group, a propoxy group, an isobutyloxy group, a sec-butyloxy group, a pentyloxy group, an iso-amyloxy group, and a hexyloxy group.","At least one hydrogen atom in the unsubstituted C1-C30 alkoxy group may be substituted with the groups described above with reference to the C1-C30 alkyl group.","The C6-C30 aryl group indicates a carbocyclic aromatic system containing one or more rings, wherein such rings may be bonded together in a pendent manner or may be fused.","The term “aryl group” may include an aromatic system such as a phenyl group, a naphthyl group, and a tetrahydronaphthyl group.","At least one hydrogen atom in the C6-C30 aryl group may be substituted with the groups described above with reference to the C1-C30 alkyl group.","The C2-C30 heteroaryl group indicates a monovalent monocyclic ring compound having 2 to 30 membered rings including C and 1 to 3 hetero atoms selected from the group consisting of N, O, P, and S, wherein such rings may be bonded together in a pendent manner or may be fused.","Examples of the C2-C30 heteroaryl group may include a pyridyl group, a thienyl group, and a furyl group.","At least one hydrogen atom in the C2-C30 heteroaryl group may be substituted with the groups described above with reference to the C1-C30 alkyl group.","Each Ar1, Ar2 and Ar3 are each independently a phenyl group, a C1-C10 alkylphenyl group, a C1-C10 alkoxyphenyl group, a halophenyl group, a cyanophenyl group, a dicyanophenyl group, a trifluoromethoxyphenyl group, an o-, m-, or p-tolyl group, an o-, m- or p-cumenyl group, a mesityl group, a phenoxyphenyl group, a (α,α-dimethylbenzene)phenyl group, a (N,N′-dimethyl)aminophenyl group, a (N,N′-diphenyl)aminophenyl group, a (C1-C10 alkylcyclohexyl)phenyl group, an (anthracenyl)phenyl group, a biphenyl group, a C1-C10 alkylbiphenyl group, a C1-C10 alkoxybiphenyl group, a pentalenyl group, an indenyl group, a naphthyl group, a C1-C10 alkylnaphthyl group, a C1-C10 alkoxynaphthyl group, a halonaphthyl group, a cyanonaphthyl group, a biphenylenyl group, a C1-C10 alkyl biphenylenyl group, a C1-C10 alkoxy biphenylenyl group, an anthracenyl group, an azulenyl group, a heptalenyl group, an acenaphthylenyl group, a phenalenyl group, a fluorenyl group, an anthraquinolyl group, a methylanthryl group, a phenanthrenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, an ethyl-chrysenyl group, a picenyl group, a perylenyl group, a chloroperylenyl group, a pentaphenyl group, a pentacenyl group, a tetraphenylenyl group, a hexaphenyl group, a hexacenyl group, a rubicenyl group, a coronenyl group, a trinaphthylenyl group, a heptaphenyl group, a heptacenyl group, a pyranthrenyl group, an ovalenyl group, a carbazolyl group, a C1-C10 alkyl carbazolyl group, a thiophenyl group, an indolyl group, a purinyl group, a benzimidazolyl group, a quinolinyl group, a benzothiophenyl group, a parathiazinyl group, a pyrrolyl group, a pyrazolyl group, an imidazolyl group, an imidazolinyl group, an oxazolyl group, a thiazolyl group, a triazolyl group, a tetrazolyl group, an oxadiazolyl group, a pyridinyl group, a pyridazinyl group, a pyrimidinyl group, a pyrazinyl group, and a thianthrenyl group, but are not limited thereto.","More particularly, the compounds represented by Formulae 1, 2, and 3 are each independently one of Compounds 1 to 62 below, but are not limited thereto.","The compound represented by Formula 1 may be synthesized through a reaction between a phenylcarbazole (B′) with a diamine (C′) according to Reaction Scheme 1 below.","Here, X, R1, R2, R3, and Ar1 are already described above, and Z can be halogen, particularly iodine (I).","The reaction can be performed in the presence of Pd2(dba)3 (dba=dibenzylideneacetone), sodium tert-butoxide and tri(tert-butyl)phosphine and at a reaction temperatures in the range of 50 to 150.The layer which is included in the organic layer and which includes at least one of the compounds represented by Formulae 1, 2, and 3 may be a hole injection layer, a hole transport layer, or a single layer having hole injecting and transporting properties.","For example, the layer included in the organic layer and including at least one of the compounds represented by Formulae 1, 2, and 3 may be a hole injection layer.","The thickness of the hole injection layer formed under the red emission layer may be in the range of 1,600 to 2,200 Å, and preferably 1,900 to 2,200 Å.","When the thickness of the hole injection layer formed under the red emission region is within the ranges described above, hole injecting and transporting properties suitable for causing resonance in a red emission layer of the organic layer can be obtained, and thus color purity, efficiency of the device, and a driving voltage of the device may be improved.","In certain embodiments, the thickness of the hole injection layer formed under the red emission layer may be 1600, 1620, 1640, 1660, 1680, 1700, 1720, 1740, 1760, 1780, 1800, 1820, 1840, 1860, 1880, 1900, 1920, 1940, 1960, 1980, 2000, 2020, 2040, 2060, 2080, 2100, 2120, 2140, 2160, 2180, or 2200 Å.","In some embodiments, the thickness of the hole injection layer formed under the red emission layer may be within a range defined by two of the foregoing thicknesses.","The thickness of the hole injection layer formed under the green emission region may be in the range of 1,400 to 1,800 Å, and preferably 1,600 to 1,800 Å.","When the thickness of the hole injection layer is within the ranges described above, hole injecting and transporting properties suitable for causing resonance in a green emission layer of the organic layer can be obtained, and thus color purity, efficiency of the device, and the driving voltage of the device may be improved.","In certain embodiments, the thickness of the hole injection layer formed under the green emission layer may be, 1400, 1420, 1440, 1460, 1480, 1500, 1520, 1540, 1560, 1580, 1600, 1620, 1640, 1660, 1680, 1700, 1720, 1740, 1760, 1780, or 1800 Å.","In some embodiments, the thickness of the hole injection layer formed under the green emission layer may be within a range defined by two of the foregoing thicknesses.","The thickness of the hole injection layer formed under the blue emission region may be in the range of 1,000 to 1,400 Å, and preferably 1,100 to 1,300 Å.","When the thickness of the hole injection layer formed under the blue emission region is within the ranges described above, hole injecting and transporting properties suitable for causing resonance in a blue emission layer of the organic layer can be obtained, and thus color purity, efficiency of the device, and the driving voltage of the device may be improved.","In certain embodiments, the thickness of the hole injection layer formed under the blue emission layer may be, 1000, 1020, 1040, 1060, 1080, 1100, 1120, 1140, 1160, 1180, 1200, 1220, 1240, 1260, 1280, 1300, 1320, 1340, 1360, 1380, or 1400 Å.","In some embodiments, the thickness of the hole injection layer formed under the blue emission layer may be within a range defined by two of the foregoing thicknesses.","The organic layer may further include a hole transport layer.","The total thickness of a region of the hole injection layer formed under a red emission region and the hole transport layer may be in the range of 2,000 to 2,400 Å, and preferably 2,100 to 2,300 Å.","The thickness of the region of the hole injection layer formed under a red emission region may be in the range of 1,600 to 2,200 Å, and preferably 1,900 to 2,200 Å.","When the total thickness of the region of the hole injection layer formed under the red emission region and the hole transport layer and/or the thickness of the region of the hole injection layer formed under the red emission region are within the ranges described above, hole injecting and transporting properties suitable for causing resonance in the red emission layer can be obtained, and thus color purity, efficiency of the device, and the driving voltage of the device may be improved.","In certain embodiments, total thickness of a region of the hole injection layer formed under the red emission region and the hole transport layer may be, 2000, 2020, 2040, 2060, 2080, 2100, 2120, 2140, 2160, 2180, 2200, 2220, 2240, 2260, 2280, 2300, 2320, 2340, 2360, 2380, or 2400 Å.","In some embodiments, the total thickness of the hole injection layer and the hole transport layer formed under the red emission layer may be within a range defined by two of the foregoing thicknesses.","The total thickness of a region of the hole injection layer formed under a green emission region and the hole transport layer may be in the range of 1,600 to 2,000 Å, and preferably 1,700 to 1,900 Å.","The thickness of the region of the hole injection layer formed under the green emission region may be in the range of 1,400 to 1,800 Å, and preferably 1,600 to 1,800 Å.","When the total thickness of the region of the hole injection layer formed under the green emission region and the hole transport layer and/or the thickness of the region of the hole injection layer formed under the green emission region are within the ranges described above, hole injecting and transporting properties suitable for causing resonance in the green emission layer can be obtained, and thus color purity, efficiency of the device, and a driving voltage of the device may be improved.","In certain embodiments, total thickness of a region of the hole injection layer formed under the green emission region and the hole transport layer may be, 1600, 1620, 1640, 1660, 1680, 1700, 1720, 1740, 1760, 1780, 1800, 1820, 1840, 1860, 1880, 1900, 1920, 1940, 1960, 1980, or 2000 Å.","In some embodiments, the total thickness of the hole injection layer and the hole transport layer formed under the green emission layer may be within a range defined by two of the foregoing thicknesses.","The total thickness of a region of the hole injection layer formed under a blur emission region and the hole transport layer may be in the range of 1,200 to 1,600 Å, and preferably 1,300 to 1,500 Å.","The thickness of the region of the hole injection layer formed under the blur emission region may be in the range of 1,000 to 1,400 Å, and preferably 1,100 to 1,300 Å.","When the total thickness of the region of the hole injection layer formed under the blur emission region and the hole transport layer and/or the thickness of the region of the hole injection layer formed under the blur emission region are within the ranges described above, hole injecting and transporting properties suitable for causing resonance in the blue emission layer can be obtained, and thus color purity, efficiency of the device, and the driving voltage of the device may be improved.","In certain embodiments, total thickness of a region of the hole injection layer formed under the blue emission region and the hole transport layer may be, 1200, 1220, 1240, 1260, 1280, 1300, 1320, 1340, 1360, 1380, 1400, 1420, 1440, 1460, 1480, 1500, 1520, 1540, 1560, 1580, or 1600 Å.","In some embodiments, the total thickness of the hole injection layer and the hole transport layer formed under the blue emission layer may be within a range defined by two of the foregoing thicknesses.","An organic light emitting device according to an embodiment of the present invention includes: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and comprising an emission layer having a red emission region and a hole injection layer having a region formed under the red emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the red emission region is in the range of 1,600 to 2,200 Å, and preferably 1,900 to 2,200 Å.","When the thickness of the region of the hole injection layer formed under the red emission region is within the ranges described above, hole injecting and transporting properties suitable for causing resonance in a red emission layer can be obtained, and thus color purity, efficiency of the device, and the driving voltage of the device may be improved.","An organic light emitting device according to an embodiment of the present invention includes: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and comprising an emission layer having a green emission region and a hole injection layer having a region formed under the green emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the green emission region is in the range of 1,400 to 1,800 Å, and preferably 1,600 to 1,800 Å.","When the thickness of the region of the hole injection layer formed under the green emission region is within the ranges described above, hole injecting and transporting properties suitable for causing resonance in the green emission layer can be obtained, and thus color purity, efficiency of the device, the driving voltage of the device may be improved.","An organic light emitting device according to an embodiment of the present invention includes: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and comprising an emission layer having a blue emission region and a hole injection layer having a region formed under the blue emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the blue emission region is in the range of 1,000 to 1,400 Å, and preferably 1,100 to 1,300 Å.","When the thickness of the region of the hole injection layer formed under the blue emission region is within the ranges described above, hole injecting and transporting properties suitable for causing resonance in the blue emission layer can be obtained, and thus color purity, efficiency of the device, and the driving voltage of the device may be improved.","Resonance can occur between the first electrode and the second electrode of an organic light emitting device according to an embodiment of the present invention during the operation thereof.","The hole injection layer of the organic layer disposed between the first electrode and the second electrode may have a specific thickness according to the color of the light emitted by the organic layer described above to obtain excellent properties such as driving voltage, current density, luminance, color purity, efficiency and lifetime of the organic light emitting device.","In an organic light emitting device according to an embodiment of the present invention, the first electrode can be formed on the substrate.","The first electrode may be a reflective electrode and the second electrode may be a semitransparent or transparent electrode.","Thus, resonance may occur between the first electrode and the second electrode during the operation of the device.","Accordingly, the light generated in the organic layer between the first electrode and the second electrode resonates between the first electrode and the second electrode during the operation of the organic light emitting device, and the light is extracted through the second electrode, that is, in a direction away from the substrate.","The organic layer of the organic light emitting device may include an emission layer and/or a hole injection layer.","The organic layer may further include at least one of a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer.","Thus, for example, an organic light emitting device according to an embodiment of the present invention may have a structure of substrate/first electrode/hole injection layer (HIL)/hole transport layer (HTL)/emission layer (EML)/hole blocking layer (HBL)/electron transport layer (ETL)/electron injection layer (EIL)/second electrode as illustrated in FIG.","1.Hereinafter, Examples and methods of manufacturing an organic light emitting device according to an embodiment of the present invention will be described with reference to the organic light emitting device illustrated in FIGS.","1 and 2.FIG.","1 schematically illustrates a structure of an organic light emitting device according to an embodiment of the present invention.","FIG.","2 schematically illustrates an organic light emitting device including red, green, and blue emission layers according to an embodiment of the present invention.","Referring to FIG.","2, a first electrode 210 is formed on a substrate 200.Here, the substrate 200, which can be any substrate that is commonly used in conventional organic light emitting devices, may be a glass substrate or a plastic substrate with excellent transparency, surface smoothness, ease of treatment, and that is waterproof.","The first electrode 210 may be a reflective electrode, a semitransparent electrode or a transparent electrode formed of a metal with excellent conductivity such as Li, Mg, Al, Al—Li, Ca, Mg—In, Mg—Ag, and Ca—Al, or a metal oxide with excellent conductivity such as ITO, IZO, and IN2O3.A combination of two or more of the metals or the metal oxides described above can also be used.","Then a pixel defining layer 214 which defines regions in which red, green, and blue emission layers will be formed is formed on predetermined regions.","The pixel defining layer 214 can be formed by deposition or coating, etc.","using inorganic materials such as a silicon oxide and a nitride or organic materials having insulating properties.","Then, a HIL 216 and a HTL 218 are sequentially formed on the first electrode 210 by thermal evaporation or spin coating according to regions which are defined by the pixel defining layer 214.The HIL 216 may include at least one of the compounds represented by Formulae 1, 2, and 3.The HTL 218 may include 1,3,5-tricarbazolylbenzene, 4,4′-biscarbazolylbiphenyl, polyvinylcarbazole, m-biscarbazolylphenyl, 4,4′-biscarbazolyl-2,2′-dimethylbiphenyl, 4,4′,4″-tri(N-carbazolyl)triphenylamine, 1,3,5-tri(2-carbazolylphenyl)benzene, 1,3,5-tris(2-carbazolyl-5-methoxyphenyl)benzene, bis(4-carbazolylphenyl)silane, N,N′-bis(3-methylphenyl)-N,N′-diphenyl-[1,1-biphenyl]-4,4′-diamine (TPD), N,N′-di(naphthalene-1-yl)-N,N′-diphenylbenzidine (α-NPD), N,N′-diphenyl-N,N′-bis(1-naphthyl)-(1,1′-biphenyl)-4,4′-diamine(NPB), IDE 320 (Idemitsu Corporation), poly(9,9-dioctylfluorene-co-N-(4-butylphenyl)diphenylamine (TFB), or poly(9,9-dioctylfluorene-co-bis-(4-butylphenyl-bis-N,N-phenyl-1,4-phenylenediamin (PFB), but is not limited to the above-described examples.","The thickness of the HIL 216 and the HTL 218 are described above.","The HIL 216 can be formed using a known method such as vacuum deposition, spin coating, casting, Langmuir Blodgett (LB), or the like.","When the HIL 216 is formed by vacuum deposition, vacuum deposition conditions may vary according to a compound that is used to form the HIL 216, and the structure and thermal properties of the HIL 216 to be formed.","In general, however, conditions for vacuum deposition may include a deposition temperature of 100-500° C., a pressure of 10−8-10−3 torr, and a deposition speed of 0.01-100 Å/sec.","When the HIL 216 is formed by spin coating, coating conditions may vary according to a compound that is used to form the HIL 216, and the structure and thermal properties of the HIL 216 to be formed.","In general, however, the coating speed may be in the range of about 2000 to 5000 rpm, and a temperature for heat treatment, which is performed to remove a solvent after coating may be in the range of about 80 to 200° C. The HTL 218 can be formed using a known method such as vacuum deposition, spin coating, casting, LB, or the like.","When the HTL 218 is formed by vacuum deposition and spin coating, conditions for deposition and coating are similar to those for formation of the HIL 216, although conditions for deposition and coating may vary according to a material that is used to form the HTL 218.Red, green and blue EMLs, 220, 225, and 230 are formed on the HTL 218.The material used to form the red, green and blue EMLs, 220, 225, and 230 is not limited.","For example, DCM1, DCM2, Eu(thenoyltrifluoroacetone)3 (Eu(TTA)3), and butyl-6-(1,1,7,7,-tetramethyljulolidyl-9-enyl)-4H-pyran (DCJTB) can be used to form the red EML 220.Alternatively, a dopant such DCJTB can be deposited with Alq3, Alq3 and rubrene can be co-deposited and a dopant can be deposited thereon, or dopants such as BTPIr or RD 61 can be deposited with 4,4′-N—N′-dicarbazole-biphenyl (CBP) to form the red EML 220, but the present invention is not limited to the above-described examples.","For example, Coumarin 6, C545T, quinacridone, and Ir(ppy)3 can be used to form the green EML 225.Alternatively, a dopant such Ir(ppy)3 can be deposited with CBP, or a dopant such as a coumarin-based material can be deposited with Alq3 as a host to form the green EML 225, but the present invention is not limited to the above-described examples.","Examples of the coumarin-based dopant may include C314S, C343S, C7, C7S, C6, C6S, C314T, and C545T.","For example, oxadiazole dimer dyes (Bis-DAPDXP), spiro compounds (Spiro-DPVBi, Spiro-6P), triarylamine compounds, bis(styryl) amine (DPVBi, DSA), CzTT, Anthracene, TPB, PPCP, DST, TPA, OXD-4, BBOT, AZM-Zn, and BH-013X (Idemitsu Corporation) which is an aromatic hydrocarbon compound containing a naphthalene moiety can be used to form the blue EML 230.Alternatively, a dopant such IDE 105 (Idemitsu Corporation) can be deposited on IDE 140 (Idemitsu Corporation) to form the blue EML 230, but the present invention is not limited to the above-described examples.","The thickness of the red, green and blue EMLs, 220, 225 and 230 may be in the range of 200 to 500 Å, and preferably 300 to 400 Å.","The thickness of each of the red, green and blue, EMLs, 220, 225 and 230 may be the same or different.","When the thickness of the red, green and blue, EMLs, 220, 225 and 230 is within the ranges described above, excellent lifetime and driving voltage of the light emitting device may be obtained.","The red, green and blue, EMLs, 220, 225 and 230 can be formed using a known method such as vacuum deposition, spin coating, casting, LB, or the like.","When the red, green and blue, EMLs, 220, 225 and 230 are formed by vacuum deposition and spin coating, conditions for deposition and coating are similar to those for formation of the HIL 216, although conditions for deposition and coating may vary according to the material that is used to form the red, green and blue, EMLs, 220, 225 and 230.A HBL (not shown) can optionally be formed on the red, green and blue, EMLs, 220, 225 and 230 by vacuum deposition or spin coating.","A material that is used to form the HBL should have a capability of transporting electrons and an ionization potential higher than the red, green and blue, EMLs, 220, 225 and 230, and thus examples of the material may include bis(2-methyl-8-quinolato)-(p-phenylphenolato)-aluminum (Balq), bathocuproine (BCP), and tris(N-aryl benzimidazole) (TPBI), but are not limited thereto.","The thickness of the HBL may be in the range of 30 to 60 Å, and preferably 40 to 50 Å.","When the thickness of the HBL is within the ranges described above, a proper hole blocking capability and the driving voltage of the device may be obtained.","The HBL can be formed using a known method such as vacuum deposition, spin coating, casting, LB, or the like.","When the HBL is formed by vacuum deposition and spin coating, conditions for deposition and coating are similar to those for formation of the HIL 216, although conditions for deposition and coating may vary according to the material that is used to form the HBL.","An ETL 240 can be optionally formed by vacuum deposition or spin coating on the red, green and blue, EMLs, 220, 225 and 230, or the HBL.","The material that is used to form the ETL 240 may be Alq3, but is not limited thereto.","The thickness of the ETL 240 may be in the range of about 100 to 400 Å, and preferably, 250 to 350 Å.","When the thickness of the ETL 240 is greater than 100 Å, proper charge balance can be maintained.","On the other hand, when the thickness of the ETL 240 is less than 400 Å, proper driving voltage of the device may be obtained.","The ETL 240 can be formed using a known method such as vacuum deposition, spin coating, casting, LB, or the like.","When the ETL 240 is formed by vacuum deposition and spin coating, conditions for deposition and coating are similar to those for formation of the HIL 216, although conditions for deposition and coating may vary according to the material that is used to form the ETL 240.An EIL 250 may be formed by vacuum deposition or spin coating on the ETL 240.The material that is used to form the EIL 250 may be BaF2, LiF, NaCl, CsF, Li2O, BaO, Liq, or the like, but is not limited thereto.","The thickness of the EIL 250 may be in the range of 2 to 100 Å, preferably, 2 to 5 Å, and more preferably 2 to 4 Å.","When the thickness of the EIL 250 is within the ranges described above, proper electron injecting capability and the driving voltage of the device may be obtained.","The EIL 250 can be formed using a known method such as vacuum deposition, spin coating, casting, LB, or the like.","When the EIL 250 is formed by vacuum deposition and spin coating, conditions for deposition and coating are similar to those for formation of the HIL 216, although conditions for deposition and coating may vary according to the material that is used to form the EIL 250.A second electrode 260 is formed on the EIL 250 by deposition to thereby complete the manufacture of the organic light-emitting device according to the current embodiment of the present invention.","The material that is used to form the second electrode 260 can be a transparent metal oxide with excellent conductivity such as ITO, IZO, SnO2, and ZnO.","Li, Mg, Al, Al—Li, Ca, Mg—In, Mg—Ag, Ca—Al can be used to form a thin film of the second electrode 260, and thus the second electrode 260 can be a reflective electrode, a semitransparent electrode, or a transparent electrode in a various manner.","The material used to form the second electrode 260 is not limited to the above-described examples.","The first electrode 210 and the second electrode 260 can be an anode or a cathode.","The organic light emitting device according to the current embodiment of the present invention can be utilized in various types of flat panel display devices such as a passive matrix organic light emitting device and an active matrix organic light emitting device.","When the organic light emitting device of the present embodiment is utilized in an active matrix organic light emitting device, the first electrode 210 as a pixel electrode that is formed on the substrate 200 can be electrically connected to a source electrode or a drain electrode of a thin film transistor.","The organic light emitting device of the present embodiment can also be utilized in a flat panel display that can realize images in two sides.","Hereinafter, the present invention will be described more specifically with reference to the following Synthesis Examples of Compounds 8, 9, 10, 11, 14, 28, 35, and 56 and Examples of an organic light emitting device according to an embodiment of the present invention will now be described in detail.","However, the Synthesis Examples and the Examples are not intended to limit the scope of the present invention.","EXAMPLES Synthesis Example 1: Synthesis of Compound 8 Compound 8 was synthesized through Reaction Scheme 2 below.","Synthesis of Intermediate A 16.7 g (100 mmol) of carbazole, 26.5 g (130 mmol) of iodobenzene, 1.9 g (10 mmol) of CuI, 138 g (1 mol) of K2CO3, and 530 mg (2 mmol) of 18-crown-6 were dissolved in 500 ml of 1,3-Dimethyl-3,4,5,6-tetrahydro-(1H)-pyrimidinone (DMPU), and heated at 170° C. for 8 hours.","After the reaction terminated, the reaction mixture was cooled to room temperature, and the resultant solid substance was filtered.","Then a small amount of ammonium hydroxide was added to the filtered solution.","The resultant was washed three times with 300 ml of diethylether, and dried in MgSO4 under reduced pressure.","As a result, a crude product was obtained.","The crude product was purified using a silica gel column chromatography to produce 22 g of Intermediate A as a white solid (yield 90%).","1H NMR (CDCl3, 400 MHz) δ (ppm) 8.12 (d, 2H), 7.58-7.53 (m, 4H), 7.46-7.42 (m, 1H), 7.38 (d, 4H), 7.30-7.26 (m, 2H); 13C NMR (CDCl3, 100 MHz) δ (ppm) 141.0, 137.9, 130.0, 127.5, 127.3, 126.0, 123.5, 120.4, 120.0, 109.9.Synthesis of Intermediate B 2.433 g (10 mmol) of Intermediate A was added to 100 ml of 80% acetic acid.","1.357 g (5.35 mmol) of iodine (I2) and 0.333 g (1.46 mmol) of o-periodic acid (H5IO6) were added thereto in the solid state.","Then, the mixture was stirred at 80° C. in a nitrogen atmosphere for 2 hours.","After the reaction terminated, the resultant solution was extracted three times with 50 ml of ethylether.","An organic layer collected from the mixture was dried over MgSO4 to to evaporate the solvent.","As a result, the dried result was purified using a silica gel column chromatography to produce 3.23 g of Intermediate B as a white solid (yield 87%).","1H NMR (CDCl3, 300 MHz) δ (ppm) 8.43 (d, 1H), 8.05 (d, 1H), 7.62 (dd, 1H), 7.61-7.75 (m, 2H), 7.51-7.43 (m, 3H), 7.41-7.35 (m, 2H), 7.27 (dd, 1H), 7.14 (d, 1H) Synthesis of Intermediate C 3.12 g (10 mmol) of 4,4′-dibromodiphenyl, 2.3 ml (25 mmol) of aniline, 2.9 g (30 mmol) of t-BuONa, 183 mg (0.2 mmol) of Pd2(dba)3, 20 mg (0.1 mmol) of P(t-Bu)3 were dissolved in 30 ml of toluene and the mixture was stirred at 90° C. for 3 hours.","The reaction mixture was cooled to room temperature, and the resultant solution was extracted three times with 30 ml of distilled water and diethylether.","A precipitate in an organic layer was filtered, washed with acetone and diethylether, and dried in a vacuum condition to produce 0.3 g of Intermediate C (yield 90%).","Intermediate C was identified by 1H-NMR.","1H NMR (DMSO-d6, 400 MHz) δ (ppm) 8.22 (s, 2H), 7.48 (d, 4H), 7.23 (t, 4H), 7.10 (dd, 8H), 6.82 (t, 2H); 13C NMR (DMSO-d6, 100 MHz) δ (ppm) 145.7, 144.3, 133.7, 131.4, 128.7, 121.2, 119.2, 118.9.Synthesis of Compound 8 912 mg (2.47 mmol) of Intermediate B, 336.4 mg (1 mmol) of Intermediate C, 300 mg (3 mmol) of t-BuONa, 40 mg (0.02 mmol) of Pd2(dba)3, 3 mg (0.01 mmol) of P(t-Bu)3 were dissolved in 5 ml of toluene and the mixture was stirred at 90° C. for 3 hours.","After the reaction terminated, the resultant mixture was cooled to room temperature, and the resultant solution was extracted three times with distilled water and 30 ml of ethylether.","An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.","As a result, the dried result was purified using a silica gel column chromatography to produce 570 mg of Compound 8 as a yellow solid (Yield 70%).","1H NMR (CDCl3, 300 MHz) δ (ppm) 7.99 (d, 2H), 7.95 (s, 2H), 7.61-7.57 (m, 8H), 7.48-7.32 (m, 12H), 7.27-7.19 (m, 8H), 7.18-7.10 (m, 8H), 6.96 (t, 2H); 13C NMR (CDCl3, 100 MHz) δ (ppm) 148.4, 147.3, 141.3, 140.4, 138.0, 137.6, 133.9, 129.9, 129.1, 127.4, 127.1, 127.0, 126.1, 125.6, 124.3, 123.0, 122.9, 122.8, 121.7, 120.5, 119.9, 118.5, 110.7, 109.9.Compound 8 was diluted in CHCl3 to a concentration of 0.2 mM and a UV Spectrum of the diluted Compound 8 was obtained.","Maximum absorption wavelengths were 353, 306 and 238 nm.","Td (decomposition temperature) and Tg (glass transition temperature) of Compound 8 were measured by performing thermal analysis using thermo gravimetric analysis (TGA) and differential scanning calorimetry (DSC) under the following conditions: N2 atmosphere, temperatures of room temperature to 600° C. (10° C./min)-TGA and of room temperature to 400° C.-DSC, and Pan Type: Pt Pan in disposable Al Pan (TGA) and disposable Al pan (DSC).","The measured Td was 494° C. and Tg was 153° C. A highest occupied molecular orbital (HOMO) level of 5.16 eV and a lowest occupied molecular orbital (LUMO) level of 2.16 eV were obtained using AC-2 that measures UV absorption spectrum and ionization potential.","Synthesis Example 2: Synthesis Compound 9 Compound 9 was synthesized through Reaction Scheme 3 below.","Intermediate D was synthesized with a yield of 85% in the same manner as in Synthesis Example 1, except that p-tolylamine was used instead of aniline in the synthesis of Intermediate C of Synthesis Example 1.Then, 2 g (Yield 80%) of Compound 9 as a yellow solid was produced in the same manner as in Synthesis Example 1, except that Intermediate D was used instead of Intermediate C in the synthesis of Compound 8 of Synthesis Example 1.1H NMR (C6D6, 300 MHz) δ (ppm) 8.14 (d, 2H), 7.64 (d, 2H), 7.47 (d, 4H), 7.38-7.28 (m, 6H), 7.27-7.25 (m, 8H), 7.23-7.01 (m, 16H), 6.96 (d, 2H), 2.19 (s, 6H); 13C NMR (C6D6, 100 MHz) δ (ppm) 149.0, 147.5, 142.6, 142.2, 139.1, 138.9, 135.1, 132.6, 130.1, 130.7, 128.1, 127.9, 127.2, 126.5, 125.9, 125.0, 124.5, 123.6, 121.8, 121.1, 119.2, 111.8, 110.8, 21.5.Compound 9 was diluted in CHCl3 to a concentration of 0.2 mM and a UV Spectrum of the diluted Compound 9 was obtained.","Maximum absorption wavelengths were 358, 309 and 253 nm.","Td and Tg of Compound 9 were measured by performing thermal analysis using TGA and DSC under the following conditions: N2 atmosphere, temperatures of room temperature to 600° C. (10° C./min)-TGA and of room temperature to 400° C.-DSC, and Pan Type: Pt Pan in disposable Al Pan (TGA) and disposable Al pan (DSC).","The measured Td was 480° C. and Tg was 155° C. A HOMO level of 5.0 eV and a LUMO level of 2.02 eV were obtained using AC-2 that measures UV absorption spectrum and ionization potential.","Synthesis Example 3: Synthesis Compound 10 Compound 10 was synthesized through Reaction Scheme 4 below.","Synthesis of Intermediate E 3.69 g (10 mmol) of Intermediate B, 1.42 g (12 mmol) of 4-aminobenzonitril, 1.44 g (15 mmol) of t-BuONa, 183 mg (0.2 mmol) of Pd2(dba)3, and 40 mg (0.2 mmol) of P(t-Bu)3 were dissolved in 50 ml of toluene and the mixture was stirred at 90° C. for 3 hours.","After the reaction terminated, the resultant mixture was cooled to room temperature, and the resultant solution was extracted three times with distilled water and 50 ml of diethylether.","An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.","As a result, the dried result was purified using a silica gel column chromatography to produce 1.8 g of Intermediate E (Yield 50%).","Synthesis of Compound 10 2.2 g (Yield 86%) of Compound 10 as a yellow solid was produced in the same manner as in Synthesis Example 1, except that Intermediate E and 4,4′-dibromodiphenyl were used instead of Intermediates B and C in the synthesis of Compound 8 of Synthesis Example 1.1H NMR (CDCl3, 300 MHz) δ (ppm) 8.02 (d, 2H), 7.97 (d, 2H), 7.64-7.48 (m, 14H), 7.43-7.39 (m, 10H), 7.29-7.22 (m, 8H), 7.03 (d, 4H); 13C NMR (CDCl3, 100 MHz) δ (ppm) 152.1, 145.6, 141.5, 138.9, 138.2, 137.3, 136.3, 133.2, 130.0, 127.9, 127.8, 127.0, 126.6, 125.8, 125.5, 124.6, 122.7, 120.5, 120.2, 119.9, 119.4, 118.9, 111.2, 110.1, 101.8.Compound 10 was diluted in CHCl3 to a concentration of 0.2 mM and a UV Spectrum of the diluted Compound 10 was obtained.","Maximum absorption wavelengths were 304 and 238 nm.","Td, Tg and Tm of Compound 10 were measured by performing thermal analysis using TGA and DSC under the following conditions: N2 atmosphere, temperatures of room temperature to 600° C. (10° C./min)-TGA and of room temperature to 400° C.-DSC, and Pan Type: Pt Pan in disposable Al Pan (TGA) and disposable Al pan (DSC).","The measured Td was 492° C., Tg was 178° C., and Tm was 263° C. A HOMO level of 5.4 eV and a LUMO level of 2.47 eV were obtained using AC-2 that measures UV absorption spectrum and ionization potential.","Synthesis Example 4: Synthesis Compound 11 Compound 11 was synthesized through Reaction Scheme 5 below.","Intermediate F was synthesized with a yield of 95% in the same manner as in Synthesis Example 1, except that 4-fluorophenylamine was used instead of aniline in the synthesis of Intermediate C of Synthesis Example 1.Then, 1.8 g (Yield 84%) of Compound 11 as a yellow solid was produced in the same manner as in Synthesis Example 1, except that Intermediate F was used instead of Intermediate C in the synthesis of Compound 8 of Synthesis Example 1.1H NMR (C6D6, 300 MHz) δ (ppm) 8.05 (s, 2H), 7.68 (d, 2H), 7.48 (d, 4H), 7.29-7.11 (m, 22H), 7.09-7.01 (m, 6H), 6.78 (t, 4H) Compound 11 was diluted in CHCl3 to a concentration of 0.2 mM and UV Spectrum of the diluted Compound 11 was obtained.","Maximum absorption wavelengths were 351, 297 and 248 nm.","Td, Tg, and Tm of Compound 11 were measured by performing thermal analysis using TGA and DSC under the following conditions: N2 atmosphere, temperatures of room temperature to 600° C. (10° C./min)-TGA and of room temperature to 400° C.-DSC, and Pan Type: Pt Pan in disposable Al Pan (TGA) and disposable Al pan (DSC).","The measured Td was 464° C., Tg was 151° C., and Tm was 299° C. A HOMO level of 5.1 eV and a LUMO level of 2.28 eV were obtained using AC-2 that measures UV absorption spectrum and ionization potential.","Synthesis Example 5: Synthesis Compound 14 Compound 14 was synthesized through Reaction Scheme 6 below.","Intermediate G was synthesized with a yield of 90% in the same manner as in Synthesis Example 1, except that 4-aminobiphenyl was used instead of aniline in the synthesis of Intermediate C of Synthesis Example 1.Then, 3.1 g (Yield 82%) of Compound 14 as a yellow solid was produced in the same manner as in Synthesis Example 1, except that Intermediate G was used instead of Intermediate C in the synthesis of Compound 8 of Synthesis Example 1.1H NMR (CD2Cl2, 300 MHz) δ (ppm) 8.02-8.01 (m, 4H), 7.65-7.56 (m, 12H), 7.51-7.46 (m, 10H), 7.43-7.36 (m, 10H), 7.32-7.17 (m, 14H), 13C NMR (CD2Cl2, 100 MHz) δ (ppm) 148.2, 147.6, 141.8, 141.0, 140.6, 138.6, 137.9, 134.5, 134.4, 130.3, 129.1, 127.9, 127.8, 127.4, 127.3, 127.0, 126.8, 126.6, 126.1, 124.7, 123.5, 123.4, 123.0, 120.8, 120.3, 119.0, 111.1, 110.3.Compound 14 was diluted in CHCl3 to a concentration of 0.2 mM and a UV Spectrum of the diluted Compound 14 was obtained.","Maximum absorption wavelength was 329 nm.","Td and Tg of Compound 14 were measured by performing thermal analysis using TGA and DSC under the following conditions: N2 atmosphere, temperatures of room temperature to 600° C. (10° C./min)-TGA and of room temperature to 400° C.-DSC, and Pan Type: Pt Pan in disposable Al Pan (TGA) and disposable Al pan (DSC).","The measured Td was 533° C. and Tg was 174° C. A HOMO level of 5.2 eV and a LUMO level of 2.27 eV were obtained using AC-2 that measures UV absorption spectrum and ionization potential.","Synthesis Example 6: Synthesis Compound 28 Compound 28 was synthesized through Reaction Scheme 7 below.","Intermediate H was synthesized with a yield of 80% in the same manner as in Synthesis Example 1, except that 3,6-dibromocarbozole was used instead of carbazole in the synthesis of Intermediate A of Synthesis Example 1.Then, Intermediate I was synthesized with a yield of 85% in the same manner as in Synthesis Example 1, except that Intermediate H was used instead of 4,4′-dibromodiphenyl in the synthesis of Intermediate C of Synthesis Example 1.Then, 2.3 g (Yield 81%) of Compound 28 as a yellow solid powder was produced in the same manner as in Synthesis Example 1, except that Intermediates B and I were used instead of Intermediates B and C in the synthesis of Compound 8 of Synthesis Example 1.1H NMR (C6D6, 300 MHz) δ (ppm) 8.13 (s, 2H), 8.04 (s, 2H), 7.65 (d, 2H), 7.39-7.31 (m, 4H), 7.27-7.22 (m, 12H), 7.19-6.99 (m, 21H), 6.82 (t, 2H); 13C NMR (C6D6, 100 MHz) δ (ppm) 150.4, 142.1, 141.9, 141.8, 138.8, 138.2, 138.0, 130.0, 129.9, 129.4, 128.3, 128.0, 127.8, 127.7, 127.3, 127.2, 127.1, 126.4, 126.3, 125.2, 125.1, 125.0, 123.8, 121.0, 120.7, 120.4, 120.2, 119.0, 117.7, 111.2, 110.9, 109.9.Compound 28 was diluted in CHCl3 to a concentration of 0.2 mM and UV Spectrum of the diluted Compound 28 was obtained.","Maximum absorption wavelengths were 315 and 248 nm.","Td and Tg of Compound 28 were measured by performing thermal analysis using TGA and DSC under the following conditions: N2 atmosphere, temperatures of room temperature to 600° C. (10° C./min)-TGA and of room temperature to 400° C.-DSC, and Pan Type: Pt Pan in disposable Al Pan (TGA) and disposable Al pan (DSC).","The measured Td was 460° C. and Tg was 175° C. A HOMO level of 5.0 eV and a LUMO level of 2.09 eV were obtained using AC-2 that measures UV absorption spectrum and ionization potential.","Synthesis Example 7: Synthesis Compound 35 Compound 35 was synthesized through Reaction Scheme 8 below.","Synthesis of Intermediate J 0.316 g (0.856 mmol) of Intermediate B, 0.142 g (1.2 mmol) of 4-aminobenzonitril were dissolved in 5 ml of toluene and 0.144 g (1.5 mmol) of t-BuONa, 0.018 g (0.02 mmol) of Pd(dba)2, and 0.004 to 0.006 g (0.02 to 0.03 mmol) of (t-Bu)3P were added thereto.","The mixture was stirred at 80° C. for 5 hours.","The resultant solution was extracted three times with 20 ml of ethylether.","An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.","As a result, the dried result was purified using a silica gel column chromatography to produce 0.218 g of Intermediate J (Yield 71%).","Synthesis of Compound 35 0.221 g (0.614 mmol) of Intermediate J, 0.332 g (0.9 mmol) of Intermediate B were dissolved in 10 ml of toluene and 0.144 g (1.5 mmol) of t-BuONa, 0.018 g (0.02 mmol) of Pd(dba)2, and 0.004 to 0.006 g (0.02 to 0.03 mmol) of (t-Bu)3P were added thereto.","The mixture was stirred at 90° C. for 6 hours.","The resultant solution was extracted three times with 30 ml of is ethylether.","An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.","As a result, the dried result was purified using a silica gel column chromatography to produce 0.236 g of Compound 35 (Yield 64%).","Compound 35 was identified by 1H-NMR.","1H-NMR (CDCl3, 400 MHz) δ (ppm) 8.05 (d, 2H), 8.03 (dd, 2H), 7.58 (m, 8H), 7.47 (m, 2H), 7.39 (m, 8H), 7.33 (dd, 2H), 7.24 (m, 2H), 6.94 (d, 2H).","Synthesis Example 8: Synthesis Compound 56 Compound 56 was synthesized through Reaction Scheme 9 below.","Synthesis of Intermediate K 13 g (53 mmol) of 2-bromofluorene was dissolved in 60 ml of acetic acid.","The reaction mixture was set 0° C., and 60 g (200 mmol) of sodium dichromate was gradually added thereto.","After 12 hours, 200 ml of distilled water was added thereto and the reaction mixture was sufficiently stirred.","The produced yellow solid was filtered and dried to produce 10 g of Intermediate K (Yield 78%).","Synthesis of Intermediate L 8 g (31.6 mmol) of Intermediate K was dissolved in 60 ml of THF.","The temperature of the reaction mixture was set to −78° C., and 38 ml (38 mmol) of 1 M phenylmagnesium bromide was gradually added thereto.","After 2 hours, the temperature was set to room temperature and stirred for 5 hours.","The reaction mixture was diluted in 50 ml of ammonium chloride solution and extracted three times with 40 ml of ethylacetate.","An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.","As a result, the dried result was purified using a silica gel column chromatography to produce 10 g of Intermediate L (Yield 95%).","Intermediate L was identified by 1H-NMR 1H NMR (CDCl3, 400 MHz) δ (ppm) 7.64 (d, 1H), 7.54-7.47 (m, 2H), 7.44 (d, 1H), 7.39-7.33 (m, 3H), 7.30-7.23 (m, 5H), 2.46 (s, 1H) Synthesis of Intermediate M 10 g (30 mmol) of Intermediate L was dissolved in 60 ml of benzene.","2.4 ml (45 mmol) of sulfuric acid diluted in a small amount of benzene was added thereto.","The reaction mixture was stirred at 80° C. for 5 hours.","After the benzene was evaporated, 1 N NaOH was added to the reaction solution to adjust the pH of the reaction solution to 7.Then, the resultant solution was extracted three times with 40 ml of ethylacetate.","An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.","As a result, the dried result was purified using a silica gel column chromatography to produce 6 g of Intermediate M (Yield 50%).","Synthesis of Intermediate O 340 mg (0.856 mmol) of Intermediate M, 142 mg (1.2 mmol) of 4-aminobenzonitril were dissolved in 5 ml of toluene and 0.144 g (1.5 mmol) of t-BuONa, 0.018 g (0.02 mmol) of Pd(dba)2, and 0.004 to 0.006 g (0.02 to 0.03 mmol) of (t-Bu)3P were added thereto.","The mixture was stirred at 80° C. for 5 hours.","The resultant solution was extracted three times with 20 ml of ethylether.","An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.","As a result, the dried result was purified using a silica gel column chromatography to produce 0.27 g of Intermediate O (Yield 73%).","Synthesis of Compound 56 267 mg (0.614 mmol) of Intermediate O, 0.332 g (0.9 mmol) of Intermediate B (refer to Synthesis Example 1) were dissolved in 10 ml of toluene and 0.144 g (1.5 mmol) of t-BuONa, 0.018 g (0.02 mmol) of Pd(dba)2, and 0.004 to 0.006 g (0.02 to 0.03 mmol) of (t-Bu)3P were added thereto.","The mixture was stirred at 90° C. for 6 hours.","The resultant solution was extracted three times with 30 ml of ethylether.","An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.","As a result, the dried result was purified using a silica gel column chromatography to produce 0.236 g of Compound 56 (Yield 57%).","Compound 56 was identified by 1H-NMR.","1H NMR (CDCl3, 400 MHz) δ (ppm) 7.97 (d, 1H), 7.90 (d, 1H), 7.69 (d, 1H), 7.65 (d, 1H), 7.60 (d, 2H), 7.56 (dd, 2H), 7.48 (m, 1H), 7.40 (d, 2H), 7.35 (m, 6H), 7.24 (m, 3H), 7.16 (m, 10H), 7.11 (dd, 1H), 6.93 (d, 2H) Example 1 An aluminium and ITO glass (SDI Co., Ltd.) substrate (1,300 Å) was cut into pieces of 50 mm×50 mm×0.7 mm in size, followed by ultrasonic cleaning in isopropyl alcohol and deionized water (5 minutes for each) and then UV/ozone cleaned (30 minutes) to produce a reflective electrode.","Then, Compound 8 was deposited on the reflective electrode to form a HIL with a thickness of 1,200 Å, and NPB was deposited on the HIL to form a HTL with a thickness of 300 Å. IDE 140 (Idemitsu Corporation) as a blue fluorescent host and IDE 105 (Idemitsu Corporation) as a blue fluorescent dopant were deposited at the same time in a weight ratio of 98:2 on the HTL to form a blue EML with a thickness of 300 Å.","Then, Balq was deposited on the blue EML to form a HBL with a thickness of 50 Å. Alq3 was deposited on the HBL to form an ETL with a thickness of 250 Å. LiF was deposited on the ETL to form an EIL with a thickness of 3 Å, and then Mg:Ag was deposited on the EIL to form a semitransparent electrode with a thickness of 180 Å.","As a result, an organic light emitting device was manufactured.","At a driving voltage of 5.5 V, the current density of the organic light emitting device was 23.0 mA/cm2, the luminance was 1,179 cd/m2, the color coordinates were (0.113, 0.130), and the light emitting efficiency was 5.13 cd/A.","Example 2 An organic light emitting device was manufactured in the same manner as in Example 1 except that Compound 9 was used instead of Compound 8 in the formation of a HIL.","At a driving voltage of 5.5 V, the current density of the organic light emitting device was 20.1 mA/cm2, the luminance was 1,021 cd/m2, the color coordinates were (0.113, 0.120), and the light emitting efficiency was 5.10 cd/A.","Example 3 An organic light emitting device was manufactured in the same manner as in Example 1 except that IDE 406 (Idemitsu Corporation) was used instead of Compound 8 in the formation of a MIL.","At a driving voltage of 5.5 V, the current density of the organic light emitting device was 46.52 mA/cm2, the luminance was 784 cd/m2, the color coordinates were (0.113, 0.125), and the light emitting efficiency was 4.74 cd/A.","Example 4 An organic light emitting device was manufactured in the same manner as in Example 1 except that Li273 (Sensient, Germany) was used instead of Compound 8 in the formation of a HIL.","At a driving voltage of 5.5 V, the current density of the organic light emitting device was 17.43 mA/cm2, the luminance was 695 cd/m2, the color coordinates were (0.122, 0.110), and the light emitting efficiency was 3.98 cd/A.","Example 5 An organic light emitting device was manufactured in the same manner as in Example 1 except that HI102 (UDC, U.S.A.) was used instead of Compound 8 in the formation of a HIL.","At a driving voltage of 5.5 V, the current density of the organic light emitting device was 0.67 mA/cm2, the luminance was 1.2 cd/m2, the color coordinates were (0.112, 0.154), and the light emitting efficiency was 0.18 cd/A.","Example 6 An organic light emitting device was manufactured in the same manner as in Example 1 except that ELM180 (ELM, Korea) was used instead of Compound 8 in the formation of a HIL.","At a driving voltage of 5.5 V, the current density of the organic light emitting device was 2.55 mA/cm2, the brightness was 52 cd/m2, the color coordinates were (0.124, 0.105), and the light emitting efficiency was 2.04 cd/A.","Referring to Examples 1 through 6, when Compound 8 or 9 was used to form the HIL or the thickness of the HIL was controlled according to an embodiment of the present invention, the hole injecting capability increased, and thus the current densities and the current efficiencies of the organic light emitting devices increased at the same driving voltage and luminance increased.","The results of the current efficiencies at the same voltage are illustrated in FIG.","3.The evaluation results for the luminance changes and driving voltage changes of the organic light emitting devices according to Examples 1 and 3 are shown in FIGS.","4 and 5.An accelerated life test was performed to measure luminance changes of the organic light emitting devices of Examples 1 and 3.The luminances were measure after 200 hours at 4,000 cd/m2 as shown in FIG.","4.The luminance of the organic light emitting device of Example 1 after 200 hours at 4,000 cd/m2 was 90.2% of the initial luminance, and the luminance of the organic light emitting device of Example 3 after 200 hours at 4,000 cd/m2 was 86.2% of the initial luminance.","FIG.","5 illustrates the accelerated life test results of the driving voltage changes after 400 hours at 4,000 cd/m2.The driving voltage of the organic light emitting device of Example 1 increased by 0.45 V and the driving voltage of the organic light emitting device of Example 3 increased by 1.65 V. Referring to FIG.","5, the organic light emitting device of Example 1 has low power consumption and low driving voltage.","Example 7 An organic light emitting device was manufactured in the same manner as in Example 1 except that Compound 11 was deposited on the electrode to form a HIL with a thickness of 1600 Å, and CBP and Ir(ppy)3 as green light emitting materials were deposited on the HTL to form a green EML with a thickness of 300 Å instead of the blue EML.","At a driving voltage of 5 V, the current density of the organic light emitting device was 7.5 mA/cm2, the luminance was 2220 cd/m2, the color coordinates were (0.244, 0.71), and the light emitting efficiency was 29.6 cd/A.","Example 8 An organic light emitting device was manufactured in the same manner as in Example 7 except that IDE 406 (Idemitsu Corporation) was used instead of Compound 11 in the formation of a HIL.","At a driving voltage of 5 V, the current density of the organic light emitting device was 7.86 mA/cm2, the luminance was 1,900 cd/m2, the color coordinates were (0.246, 0.691), and the light emitting efficiency was 23.9 cd/A.","The current efficiencies of Examples 7 and 8 are shown in FIG.","6.Example 9 An organic light emitting device was manufactured in the same manner as in Example 1 except that Compound 14 was deposited on the electrode to form a HIL with a thickness of 2000 Å, and CBP and BPTIr as red light emitting materials were deposited on the HTL to form a red EML with a thickness of 300 Å instead of the blue EML.","At a driving voltage of 5 V, the current density of the organic light emitting device was 11.8 mA/cm2, the luminance was 1,534 cd/m2, the color coordinates were (0.687, 0.310), and the light emitting efficiency was 13.0 cd/A.","Example 10 An organic light emitting device was manufactured in the same manner as in Example 9 except that IDE 406 (Idemitsu Corporation) was used instead of Compound 14 in the formation of a HIL.","At a driving voltage of 5 V, the current density of the organic light emitting device was 13.3 mA/cm2, the brightness was 1328 cd/m2, the color coordinates were (0.692, 0.306), and the light emitting efficiency was 9.98 cd/A.","The current efficiencies of Examples 9 and 10 are shown in FIG.","7.The driving voltage, efficiency, and color purity characteristics of the organic light emitting devices of Examples 1-10 were evaluated using an IVL measuring device (PhotoResearch PR650, Keithley 238).","Example 11 An organic light emitting device including red, s green, and blue EMLs was manufactured as follows.","A substrate having a thin film transistor was prepared, and a first electrode composed of Al was formed in a stripe shape with a thickness of 1000 Å.","Here, the first electrode was electrically connected to a source electrode or a drain electrode of the thin film transistor formed on the substrate.","Red, green and blue sub-pixel defining layers which define regions in which the red, green, and blue EMLs will be formed were formed on the first electrode using a silicon oxide.","Compound 8 was deposited on the regions in which the red, green and blue EML will be formed to form a HIL.","Compound 8 was deposited on the region in which the red EML will be formed to a thickness of 2000 Å, on the region in which the green EML will be formed a thickness of 1600 Å, and on the region in which the blue EML will be formed to a thickness of 1200 Å to form the HIL.","Then, NPB was deposited on the HIL to form a HTL with a thickness of 300 Å. CBP and BPTIr as red light emitting materials were deposited on the HTL to form a red EML with a thickness of 300 Å, CBP and Irppy as green light emitting materials were deposited on the HTL to form a green EML with a thickness of 300 Å, and IDE 140 (Idemitsu Corporation) and IDE 105 (Idemitsu Corporation) as blue light emitting materials were deposited on the HTL to form a blue EML with a thickness of 150 Å.","Then, Balq was deposited on the red, green and blue EMLs to form a HBL with a thickness of 50 Å. Alq3 was deposited on the HBL to form an ETL with a thickness of 250 Å. LiF was deposited on the ETL to form an EIL with a thickness of 3 Å, and then Mg:Ag was deposited on the EIL to form a semitransparent electrode with a thickness of 180 Å.","As a result, an organic light emitting device including the red, green, and blue EMLs was manufactured.","The efficiency and the color coordinates of the organic light emitting device of Example 11 were measured in the same manner as in Examples 1 through 10.The results are shown in Table 1.TABLE 1 Efficiency (cd/A) x Color Coordinate y Color Coordinate Red EML 13.4 0.68 0.32 Green EML 29.9 0.22 0.73 Blue EML 2.9 0.14 0.06 As shown in Table 1, each EML of the organic light emitting device of Example 11 exhibited excellent efficiency and color purity.","The efficiency of white light comprising a mixture of red, green, and blue light in the organic light emitting device of Example 11 was 13.0 cd/A at a luminance of 150 cd/m2 when 40% of the device was operating, and power consumption was 180 mW.","The efficiency and color purity characteristics of the organic light emitting device of Example 11 were evaluated using an IVL measuring device (PhotoResearch PR650, Keithley 238) and the power consumption was calculated.","Example 12 An organic light emitting device was manufactured in the same manner as in Example 11 except that IDE 406 (Idemitsu Corporation) was used instead of Compound 8 to form a HIL.","The efficiency and the color coordinates of the organic light emitting device of Example 12 are shown in Table 2.TABLE 2 Efficiency (cd/A) x Color Coordinate y Color Coordinate Red EML 12.1 0.67 0.32 Green EML 25.4 0.23 0.73 Blue EML 2.24 0.14 0.06 As shown in Table 2, each EML of the organic light emitting device of Example 12 exhibited excellent efficiency and color purity.","The efficiency of white light comprising a mixture of red, green, and blue light in the organic light emitting device of Example 12 was 11.0 cd/A at a brightness of 150 cd/m2 when 40% of the device was operating, and power consumption was 220 mW.","The efficiency and color purity characteristics of the organic light emitting device of Example 12 were evaluated using an IVL measuring device (PhotoResearch PR650, Keithley 238) and the power consumption was calculated.","Comparative Example 1 A substrate having a thin film transistor was prepared, and a first electrode composed of Al was formed in a stripe shape with a thickness of 1000 Å.","Here, the first electrode was electrically connected to a source electrode or a drain electrode of the thin film transistor formed on a lower portion of the substrate.","Red, green and blue pixel defining layers which define regions in which red, green, and blue emission layers will be formed were formed on the pixel electrode using a silicon oxide.","M-TDATA was deposited on the regions in which red, green and blue emission layers will be formed form a HIL with a thickness of 1000 Å.","Then NPB was deposited on the HIL to form a HTL with a thickness of 400 Å.","In addition, NPB was further deposited over the region in which green EML will be formed to a thickness of 400 Å using a photomask.","NPB was further deposited over the region in which red EML will be formed to a thickness of 800 Å.","As a result, HTL having total thickness of 1200 Å in the region in which red EML will be formed, total thickness of 800 Å in the region in which green EML will be formed an to total thickness of 400 Å in the region in which blue EML will be formed.","CBP and BPTIr as red light emitting materials were deposited on the red HTL to form a red EML with a thickness of 300 Å, CBP and Irppy as green light emitting materials were deposited on the green HTL to form a green EML with a thickness of 300 Å, and IDE 140 (Idemitsu Corporation) and IDE 105 (Idemitsu Corporation) as blue light emitting materials were deposited on the blue HTL to form a blue EML with a thickness of 150 Å.","Then, Balq was deposited on the red, green and blue EMLs to form a HBL with a thickness of 50 Å. Alq3 was deposited on the HBL to form an ETL with a thickness of 250 Å. LiF was deposited on the ETL to form an EIL with a thickness of 3 Å, and then Mg:Ag was deposited on the EIL to form a semitransparent electrode with a thickness of 180 Å.","As a result, an organic light emitting device including the red, green, and blue EMLs was manufactured.","The efficiency and the color coordinates of the organic light emitting device of Comparative Example 1 are shown in Table 3.TABLE 3 Efficiency (cd/A) x Color Coordinate y Color Coordinate Red EML 5.39 0.67 0.32 Green EML 24.45 0.21 0.72 Blue EML 1.40 0.14 0.06 As shown in Table 3, the organic light emitting device of Example 11 having a material used to form a HIL according to an embodiment of the present invention and the organic light emitting device of Example 12 having the thickness of the HIL according to an embodiment of the present invention exhibited greater efficiency and color purity than the organic light emitting device of Comparative Example 1.An organic light emitting device according to the present invention includes an organic layer containing one of the compounds represented by Formulae 1, 2, and 3 between a pair of electrodes capable of generating resonance during the operation of the device; and/or a hole injection layer having the thickness range described above between the pair of electrodes.","The organic light emitting device of the present invention has low driving voltage, excellent current density, high brightness, excellent color purity, high efficiency, and long lifetime.","In particular, the organic light emitting device of the present invention has excellent lifetime property.","A flat panel display device having enhanced reliability can be obtained by employing the organic light emitting device of the present invention.","While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims."]],"string":"[\n [\n \"PHENYLCARBAZOLE-BASED COMPOUNDS AND FLUORENE-BASED COMPOUNDS AND ORGANIC LIGHT EMITTING DEVICE AND FLAT PANEL DISPLAY DEVICE COMPRISING THE SAME\",\n \"Provided are an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the organic layer includes a layer having at least one of the compounds having at least one carbazole group, and a flat panel display device including the organic light emitting device.\",\n \"The organic light emitting device has low driving voltage, excellent current density, high brightness, excellent color purity, high efficiency, and long lifetime.\"\n ],\n [\n \"1.An organic light emitting device, comprising: a substrate; a first electrode; a second electrode, the first electrode is a reflective electrode, or the second electrode is a reflective electrode, the remaining being semitransparent or transparent electrodes; and an organic layer interposed between the first electrode and the second electrode, the organic layer comprising: an emission layer comprising a blue emission layer; and a layer comprising at least one compound selected from the group consisting of compounds represented by Formula 3, the layer having a third region formed under the blue emission layer, the thickness of the third region being in the range of 1,000 to 1,400 Å, the layer being between the first electrode and the emission layer: R6, R7, and R8 independently being one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7, and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring, Ar3 independently being a substituted or unsubstituted C6-C30 aryl group or a substituted or unsubstituted C2-C30 heteroaryl group, each Y independently being one selected from the group consisting of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C2-C30 hetero ring, and each n independently being an integer from 0 to 5.2.The organic light emitting device of claim 1, wherein the compound represented by Formula 3 comprises a compound represented by Formula 3a: R6, R7 and R8 independently being one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; and Q4 being one selected from the group consisting of a hydrogen atom, a cyano group, a fluorine atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C2-C30 hetero ring, and a substituted or unsubstituted amino group.\",\n \"3.The organic light emitting device of claim 1, wherein the compound represented by Formula 3 is any one of Compounds 46 through 62: 4.The organic light emitting device of claim 1, wherein the compound represented by Formula 3 is Compound 56: 5.The organic light emitting device of claim 1, wherein the layer comprising said at least one compound selected from the group of compounds represented by Formula 3 is one of a hole injection layer, a hole transport layer, and a single layer having hole injecting and transporting properties.\",\n \"6.The organic light emitting device of claim 1, wherein the layer comprising said at least one compound selected from the group of compounds represented by Formula 3 is a hole injection layer or a hole transport layer.\",\n \"7.A display device comprising the organic light emitting device of claim 1.8.The display device of claim 7, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.\",\n \"9.The organic light emitting device of claim 1, the first electrode being disposed on the substrate and being a reflective electrode, the second electrode being a semitransparent or transparent electrode, and light generated in the organic layer passes through the second electrode.\",\n \"10.An organic light emitting device, comprising: a substrate; a first electrode; a second electrode, the first electrode is a reflective electrode, or the second electrode is a reflective electrode, the remaining being semitransparent or transparent electrodes; and an organic layer interposed between the first electrode and the second electrode, the organic layer comprising: an emission layer comprising a blue emission layer; and a layer comprising at least one compound selected from the group consisting of compounds represented by Formula 3, the layer having a third region formed under the blue emission layer, the thickness of the third region being in the range of 1,000 to 1,400 Å, the layer being between the first electrode and the emission layer: where R6, R7 and R8 are each independently one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C4-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; Ar3 is a biphenyl group; each Y is independently one selected from the group consisting of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C4-C30 hetero ring; and each n of the Yn between the carbazole ring and the nitrogen is 1, and n of the Yn between the fluorene ring and the nitrogen is 0.11.The organic light emitting device of claim 10, wherein R6 and R7 are each a methyl group and R8 is a phenyl.\",\n \"12.The organic light emitting device of claim 11, wherein the compound represented by Formula 3 has the following chemical structure: 13.The organic light emitting device of claim 10, wherein the first electrode is formed on the substrate and is a reflective electrode, the second electrode is a semitransparent or transparent electrode, and light generated in the organic layer passes through the second electrode.\",\n \"14.The organic light emitting device of claim 10, wherein the layer comprising the compound represented by Formula 3 is one of a hole injection layer, a hole transport layer, and a single layer having hole injecting and transporting properties.\",\n \"15.A display device comprising the organic light emitting device of claim 10.16.The display device of claim 15, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.\",\n \"17.An organic light emitting device, comprising: a substrate; a first electrode; a second electrode, the first electrode is a reflective electrode, or the second electrode is a reflective electrode, the remaining being semitransparent or transparent electrodes; and an organic layer interposed between the first electrode and the second electrode, the organic layer comprising: an emission layer comprising a blue emission layer; and a region comprising at least one compound selected from the group consisting of compounds represented by Formula 3, the region having a third region formed under the blue emission layer, the thickness of the third region being in the range of 1,000 to 1,400 Å, the region being between the first electrode and the emission layer: R6, R7, and R8 independently being one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7, and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring, Ar3 independently being a substituted or unsubstituted C6-C30 aryl group or a substituted or unsubstituted C2-C30 heteroaryl group, each Y independently being one selected from the group consisting of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C2-C30 hetero ring, and each n independently being an integer from 0 to 5.18.A display device comprising the organic light emitting device of claim 17.19.The display device of claim 18, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.\",\n \"20.An organic light emitting device, comprising: a substrate; a first electrode; a second electrode, the first electrode is a reflective electrode, or the second electrode is a reflective electrode, the remaining being semitransparent or transparent electrodes; and an organic layer interposed between the first electrode and the second electrode, the organic layer comprising: an emission layer comprising a blue emission layer; and a region comprising at least one compound selected from the group consisting of compounds represented by Formula 3, the region having a third region formed under the blue emission layer, the thickness of the third region being in the range of 1,000 to 1,400 Å, the region being between the first electrode and the emission layer: where R6, R7 and R8 are each independently one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C4-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; Ar3 is a biphenyl group; each Y is independently one selected from the group consisting of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C4-C30 hetero ring; and each n of the Yn between the carbazole ring and the nitrogen is 1, and n of the Yn between the fluorene ring and the nitrogen is 0.21.A display device comprising the organic light emitting device of claim 20.22.The display device of claim 21, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.\",\n \"23.An organic light emitting device, comprising: a substrate; a first electrode; a second electrode, the first electrode is a reflective electrode, or the second electrode is a reflective electrode, the remaining being semitransparent or transparent electrodes; and an organic layer interposed between the first electrode and the second electrode, the organic layer comprising: an emission layer comprising a blue emission layer; and a region comprising at least one compound selected from the group consisting of compounds represented by Formula 3, the region having a third region formed under the blue emission layer, the region further comprising a hole transporting layer, the total thickness of the third region and the hole transporting layer being in the range of 1,200 to 1,600 Å, the region being between the first electrode and the emission layer: R6, R7, and R8 independently being one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7, and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring, Ar3 independently being a substituted or unsubstituted C6-C30 aryl group or a substituted or unsubstituted C2-C30 heteroaryl group, each Y independently being one selected from the group consisting of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C2-C30 hetero ring, and each n independently being an integer from 0 to 5.24.A display device comprising the organic light emitting device of claim 23.25.The display device of claim 24, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.\",\n \"26.An organic light emitting device, comprising: a substrate; a first electrode; a second electrode, the first electrode is a reflective electrode, or the second electrode is a reflective electrode, the remaining being semitransparent or transparent electrodes; and an organic layer interposed between the first electrode and the second electrode, the organic layer comprising: an emission layer comprising a blue emission layer; and a region comprising at least one compound selected from the group consisting of compounds represented by Formula 3, the region having a third region formed under the blue emission layer, the region further comprising a hole transporting layer, the total thickness of the third region and the hole transporting layer being in the range of 1,200 to 1,600 Å, the region being between the first electrode and the emission layer: where R6, R7 and R8 are each independently one selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C4-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; Ar3 is a biphenyl group; each Y is independently one selected from the group consisting of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C4-C30 hetero ring; and each n of the Yn between the carbazole ring and the nitrogen is 1, and n of the Yn between the fluorene ring and the nitrogen is 0.27.A display device comprising the organic light emitting device of claim 26.28.The display device of claim 27, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.\"\n ],\n [\n \" BACKGROUND OF THE INVENTION \"\n ],\n [\n \" SUMMARY OF THE INVENTION The present invention provides an improved organic light emitting device.\",\n \"The present invention provides an organic light emitting device including an organic layer containing a compound that has excellent hole mobility between a pair of electrodes capable of generating resonance during the operation of the light emitting device, an organic light emitting device including a hole injection layer having a predetermined range of thickness between a pair of electrodes capable of generating resonance during the operation of the light emitting device, and a flat panel display device including the organic light emitting device.\",\n \"According to an aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the organic layer comprises a layer including at least one of compounds represented by Formulae 1, 2, and 3 below.\",\n \"Here, X is one of a substituted or unsubstituted C 1 -C 30 alkylene group, a substituted or unsubstituted C 2 -C 30 alkenylene group, a substituted or unsubstituted C 6 -C 30 arylene group, a substituted or unsubstituted C 2 -C 30 heteroarylene group, and a substituted or unsubstituted C 2 -C 30 hetero ring; Each R 1 , each R 2 , each R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are each independently one of a hydrogen atom, a substituted or unsubstituted C 1 -C 30 alkyl group, a substituted or unsubstituted C 1 -C 30 alkoxy group, a substituted or unsubstituted C 6 -C 30 aryl group, a substituted or unsubstituted C 6 -C 30 aryloxy group, a substituted or unsubstituted C 2 -C 30 hetero ring, a substituted or unsubstituted C 5 -C 30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R 1 , R 2 and R 3 can be optionally bound with one another to form a saturated or unsaturated carbon ring, R 4 and R 5 , can be optionally bound with one another to form a saturated or unsaturated carbon ring, and two or more of R 6 , R 7 and R 8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; each Ar 1 , Ar 2 and Ar 3 are each independently a substituted or unsubstituted C 6 -C 30 aryl group or a substituted or unsubstituted C 2 -C 30 heteroaryl group; each Y is independently one of a substituted or unsubstituted C 1 -C 30 alkyl group, a substituted or unsubstituted C 6 -C 30 aryl group, and a substituted or unsubstituted C 2 -C 30 hetero ring; and each n is independently an integer from 0 to 5.According to another aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer having a red emission region and a hole injection layer having a region formed under the red emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the red emission region is in the range of 1,600 to 2,200 Å.\",\n \"According to another aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer having a green emission region and a hole injection layer having a region formed under the green emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the green emission region is in the range of 1,400 to 1,800 Å.\",\n \"According to another aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer having a blue emission region and a hole injection layer having a region formed under the blue emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the blue emission region is in the range of 1,000 to 1,400 Å.\",\n \"According to another aspect of the present invention, there is provided a flat panel display device including the organic light emitting device, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.\",\n \"The organic light emitting device has low driving voltage, excellent current density, high brightness, excellent color purity, high efficiency, and long lifetime.\",\n \"Particularly, the organic light emitting device has excellent lifetime.\"\n ],\n [\n \"CROSS-REFERENCE TO RELATED APPLICATIONS This application is a Continuation of U.S. patent application Ser.\",\n \"No.\",\n \"15/266,959, filed on Sep. 15, 2016, which is a Continuation of U.S. patent application Ser.\",\n \"No.\",\n \"14/607,326, filed on Jan. 28, 2015, now issued as U.S. Pat.\",\n \"No.\",\n \"9,478,754, which is a Continuation of U.S. patent application Ser.\",\n \"No.\",\n \"13/439,586, filed on Apr.\",\n \"4, 2012, now issued as U.S. Pat.\",\n \"No.\",\n \"8,974,922, which is a Continuation of U.S. patent application Ser.\",\n \"No.\",\n \"11/806,039, filed on May 29, 2007, now issued as U.S. Pat.\",\n \"No.\",\n \"8,188,315, which is a Continuation-in-Part of U.S. patent application Ser.\",\n \"No.\",\n \"11/286,421, filed on Nov. 25, 2005, now issued as U.S. Pat.\",\n \"No.\",\n \"8,021,764, which is a Continuation-in-Part of U.S. patent application Ser.\",\n \"No.\",\n \"11/181,706, filed on Jul.\",\n \"13, 2005, now issued as U.S. Pat.\",\n \"No.\",\n \"7,431,997, which is a Continuation-in-Part of U.S. patent application Ser.\",\n \"No.\",\n \"11/097,182, filed on Apr.\",\n \"4, 2005, now issued as U.S. Pat.\",\n \"No.\",\n \"7,737,627, and claims priority from and the benefit of Korean Patent Application No.\",\n \"10-2006-0048306, filed on May 29, 2006, Korean Patent Application No.\",\n \"10-2004-0098747, filed on Nov. 29, 2004, Korean Patent Application No.\",\n \"10-2004-0054700, filed on Jul.\",\n \"14, 2004, and Korean Patent Application No.\",\n \"10-2004-0022877, filed on Apr.\",\n \"2, 2004, each of which is hereby incorporated by reference for all purpose as if fully set forth herein.\",\n \"BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an organic light emitting device and a flat panel display device, and more particularly, to an organic light emitting device including an organic layer containing a phenylcarbazole-based compound.\",\n \"Description of the Related Art Organic light emitting devices are self-emission displays that emit light by recombination of electrons and holes in an organic layer made of a fluorescent or phosphorescent compound when a current is applied to the organic layer.\",\n \"Organic light emitting devices are lightweight, have simple constituent elements, an easy fabrication process, superior image quality, and a wide viewing angle.\",\n \"Furthermore, organic light emitting devices can realize dynamic images and high color purity.\",\n \"Organic light emitting devices also have electrical properties such as low power consumption and low driving voltage suitable for portable electronic equipment.\",\n \"Organic light emitting devices generally have an organic layer in the form of a multi-layer structure including an electron injection layer, an emission layer, a hole transport layer, etc.\",\n \"instead of including only a single emission layer to improve efficiency and to lower driving voltage.\",\n \"For example, Japanese Patent Laid-Open Publication No.\",\n \"2002-252089 discloses an organic light emitting device including a hole transport layer.\",\n \"However, the driving voltage, current density, brightness, color purity, efficiency and lifetime of a conventional organic light emitting device do not meet desired levels.\",\n \"Accordingly, these properties must be improved.\",\n \"SUMMARY OF THE INVENTION The present invention provides an improved organic light emitting device.\",\n \"The present invention provides an organic light emitting device including an organic layer containing a compound that has excellent hole mobility between a pair of electrodes capable of generating resonance during the operation of the light emitting device, an organic light emitting device including a hole injection layer having a predetermined range of thickness between a pair of electrodes capable of generating resonance during the operation of the light emitting device, and a flat panel display device including the organic light emitting device.\",\n \"According to an aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the organic layer comprises a layer including at least one of compounds represented by Formulae 1, 2, and 3 below.\",\n \"Here, X is one of a substituted or unsubstituted C1-C30 alkylene group, a substituted or unsubstituted C2-C30 alkenylene group, a substituted or unsubstituted C6-C30 arylene group, a substituted or unsubstituted C2-C30 heteroarylene group, and a substituted or unsubstituted C2-C30 hetero ring; Each R1, each R2, each R3, R4, R5, R6, R7 and R8 are each independently one of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R1, R2 and R3 can be optionally bound with one another to form a saturated or unsaturated carbon ring, R4 and R5, can be optionally bound with one another to form a saturated or unsaturated carbon ring, and two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; each Ar1, Ar2 and Ar3 are each independently a substituted or unsubstituted C6-C30 aryl group or a substituted or unsubstituted C2-C30 heteroaryl group; each Y is independently one of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C2-C30 hetero ring; and each n is independently an integer from 0 to 5.According to another aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer having a red emission region and a hole injection layer having a region formed under the red emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the red emission region is in the range of 1,600 to 2,200 Å.\",\n \"According to another aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer having a green emission region and a hole injection layer having a region formed under the green emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the green emission region is in the range of 1,400 to 1,800 Å.\",\n \"According to another aspect of the present invention, there is provided an organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer having a blue emission region and a hole injection layer having a region formed under the blue emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the blue emission region is in the range of 1,000 to 1,400 Å.\",\n \"According to another aspect of the present invention, there is provided a flat panel display device including the organic light emitting device, wherein the first electrode of the organic light emitting device is electrically connected to a source electrode or a drain electrode of a thin film transistor.\",\n \"The organic light emitting device has low driving voltage, excellent current density, high brightness, excellent color purity, high efficiency, and long lifetime.\",\n \"Particularly, the organic light emitting device has excellent lifetime.\",\n \"BRIEF DESCRIPTION OF THE DRAWINGS A more complete appreciation of the present invention, and many of the above and other features and advantages of the present invention, will be readily apparent as the same becomes better understood by reference to the following detailed description when considered in conjunction with the accompanying drawings in which like reference symbols indicate the same or similar components, wherein: FIG.\",\n \"1 schematically illustrates a structure of an organic light emitting device according to an embodiment of the present invention; FIG.\",\n \"2 schematically illustrates an organic light emitting device including an emission layer comprised of a red emission region, a green emission region, and blue emission region according to an embodiment of the present invention; and FIGS.\",\n \"3 through 7 are graphs illustrating current efficiencies, luminance, and driving voltages of an organic light emitting device according to an embodiment of the present invention.\",\n \"DETAILED DESCRIPTION OF THE INVENTION Hereinafter, the present invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown.\",\n \"The invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.\",\n \"An organic light emitting device according to an embodiment of the present invention includes a substrate, a first electrode, a second electrode and an organic layer.\",\n \"The organic layer is disposed between the first electrode and the second electrode and includes an emission layer.\",\n \"The organic layer can emit red, green, and/or blue light according to a material used to form the emission layer.\",\n \"One of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode.\",\n \"Accordingly, resonance may occur between the first electrode and the second electrode during the operation of the light emitting device.\",\n \"Thus, the light generated in the organic layer between the first electrode and the second electrode resonates between the first electrode and the second electrode during the operation of the light emitting device, and the light is extracted from of the organic light emitting device.\",\n \"Thus, luminance of the light and light emitting efficiency can be enhanced.\",\n \"The first electrode may be formed on the substrate.\",\n \"For example, the first electrode may be a reflective electrode, and the second electrode may be a semitransparent or transparent electrode.\",\n \"Accordingly, the light generated in the organic layer between the first electrode and the second electrode resonates between the first electrode and the second electrode during the operation of the light emitting device, and the light is extracted through the second electrode, that is, in a direction away from the substrate.\",\n \"The organic layer of the organic light emitting device according to the current embodiment of the present invention may include a layer containing a phenylcarbazole-based compound.\",\n \"In particular, the organic layer may include a layer including at least one of the compounds represented by Formulae 1, 2, and 3 below.\",\n \"Here, X is one of a substituted or unsubstituted C1-C30 alkylene group, a substituted or unsubstituted C2-C30 alkenylene group, a substituted or unsubstituted C6-C30 arylene group, a substituted or unsubstituted C2-C30 heteroarylene group, and a substituted or unsubstituted C2-C30 hetero ring; Each R1, each R2, each R3, R4, R5, R6, R7 and R8 are each independently one of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R1, R2 and R3 can be optionally bound with one another to form a saturated or unsaturated carbon ring, R4 and R5, can be optionally bound with one another to form a saturated or unsaturated carbon ring, and two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; each Ar1, Ar2 and Ar3 are each independently a substituted or unsubstituted C6-C30 aryl group or a substituted or unsubstituted C2-C30 heteroaryl group; each Y is independently one of a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, and a substituted or unsubstituted C2-C30 hetero ring; and each n is independently an integer from 0 to 5.The compounds represented by Formulae 1, 2, and 3 have a stiff carbazole group, and thus the glass transition temperature or the melting point of the compounds increases.\",\n \"During the operation of the organic light emitting device according to the current embodiment of the present invention, the compounds are highly resistant to heat generated in the organic layer, between the organic layers, or between the organic layer and the electrode according to Joule's Law, and are stable in a high temperature environment.\",\n \"Thus, when the compounds are used to form the organic layer of the organic light emitting device of the present embodiment, long lifetime and excellent luminance can be obtained.\",\n \"In particular, the compounds represented by Formulae 1 and 2 which have two or more carbazole groups may provide long lifetime and excellent brightness.\",\n \"In addition, the organic light emitting device of the present embodiment including an organic layer containing a compound represented by Formula 1, 2, or 3 has excellent stability during storage and operation.\",\n \"This feature can be explained by, for example, but not limited to, a high Tg (glass transition temperature) of the compound represented by Formula 1, 2, or 3.The compound represented by Formula 1 may include a compound represented by Formula 1a below, but is not limited thereto.\",\n \"Here, each R1, each R2, and each R3 are each independently one of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R1, R2 and R3 can be optionally bound with one another to form a saturated or unsaturated carbon ring; and each Q1 is independently one of a hydrogen atom, a cyano group, a fluorine atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C2-C30 hetero ring, and a substituted or unsubstituted amino group.\",\n \"The compound represented by Formula 1 may include a compound represented by Formula 1b below, but is not limited thereto.\",\n \"Here, each R1, each R2, and each R3 are each independently one of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R1, R2 and R3 can be optionally bound with one another to form a saturated or unsaturated carbon ring; and each Q2 is one selected from the group consisting of a hydrogen atom, a cyano group, a fluorine atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C2-C30 hetero ring, and a substituted or unsubstituted amino group.\",\n \"The compound represented by Formula 2 may include a compound represented by Formula 2a below, but is not limited thereto.\",\n \"Here, R4 and R5 are each independently one of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein R4, and R5 can be optionally bound with one another to form a saturated or unsaturated carbon ring; and Q3 is one of a hydrogen atom, a cyano group, a fluorine atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C2-C30 hetero ring, and a substituted or unsubstituted amino group.\",\n \"The compound represented by Formula 3 may include a compound represented by Formula 3a below, but is not limited thereto.\",\n \"Here, R6, R7 and R8 are each independently one of a hydrogen atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C1-C30 alkoxy group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C6-C30 aryloxy group, a substituted or unsubstituted C2-C30 hetero ring, a substituted or unsubstituted C5-C30 polycyclic condensed ring, a hydroxy group, a cyano group, and a substituted or unsubstituted amino group, wherein two or more of R6, R7 and R8 can be optionally bound with one another to form a saturated or unsaturated carbon ring; and Q4 is one of a hydrogen atom, a cyano group, a fluorine atom, a substituted or unsubstituted C1-C30 alkyl group, a substituted or unsubstituted C6-C30 aryl group, a substituted or unsubstituted C2-C30 hetero ring, and a substituted or unsubstituted amino group.\",\n \"Hereinafter, examples of the groups used to form the compounds represented by the above formulae will now be described in more detail.\",\n \"Examples of the unsubstituted C1-C30 alkyl group may include a methyl group, an ethyl group, a propyl group, an isobutyl group, a sec-butyl group, a pentyl group, an iso-amyl group, and a hexyl group.\",\n \"At least one hydrogen atom in the unsubstituted C1-C30 alkyl group may be substituted with a halogen atom, a C1-C30 alkyl group, a C1-C30 alkoxy group, a low alkylamino group, a hydroxy group, a nitro group, a cyano group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxyl group, a sulfonic acid group, and a phosphoric acid group.\",\n \"Examples of the unsubstituted C1-C30 alkoxy group may include a methoxy group, an ethoxy group, a propoxy group, an isobutyloxy group, a sec-butyloxy group, a pentyloxy group, an iso-amyloxy group, and a hexyloxy group.\",\n \"At least one hydrogen atom in the unsubstituted C1-C30 alkoxy group may be substituted with the groups described above with reference to the C1-C30 alkyl group.\",\n \"The C6-C30 aryl group indicates a carbocyclic aromatic system containing one or more rings, wherein such rings may be bonded together in a pendent manner or may be fused.\",\n \"The term “aryl group” may include an aromatic system such as a phenyl group, a naphthyl group, and a tetrahydronaphthyl group.\",\n \"At least one hydrogen atom in the C6-C30 aryl group may be substituted with the groups described above with reference to the C1-C30 alkyl group.\",\n \"The C2-C30 heteroaryl group indicates a monovalent monocyclic ring compound having 2 to 30 membered rings including C and 1 to 3 hetero atoms selected from the group consisting of N, O, P, and S, wherein such rings may be bonded together in a pendent manner or may be fused.\",\n \"Examples of the C2-C30 heteroaryl group may include a pyridyl group, a thienyl group, and a furyl group.\",\n \"At least one hydrogen atom in the C2-C30 heteroaryl group may be substituted with the groups described above with reference to the C1-C30 alkyl group.\",\n \"Each Ar1, Ar2 and Ar3 are each independently a phenyl group, a C1-C10 alkylphenyl group, a C1-C10 alkoxyphenyl group, a halophenyl group, a cyanophenyl group, a dicyanophenyl group, a trifluoromethoxyphenyl group, an o-, m-, or p-tolyl group, an o-, m- or p-cumenyl group, a mesityl group, a phenoxyphenyl group, a (α,α-dimethylbenzene)phenyl group, a (N,N′-dimethyl)aminophenyl group, a (N,N′-diphenyl)aminophenyl group, a (C1-C10 alkylcyclohexyl)phenyl group, an (anthracenyl)phenyl group, a biphenyl group, a C1-C10 alkylbiphenyl group, a C1-C10 alkoxybiphenyl group, a pentalenyl group, an indenyl group, a naphthyl group, a C1-C10 alkylnaphthyl group, a C1-C10 alkoxynaphthyl group, a halonaphthyl group, a cyanonaphthyl group, a biphenylenyl group, a C1-C10 alkyl biphenylenyl group, a C1-C10 alkoxy biphenylenyl group, an anthracenyl group, an azulenyl group, a heptalenyl group, an acenaphthylenyl group, a phenalenyl group, a fluorenyl group, an anthraquinolyl group, a methylanthryl group, a phenanthrenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, an ethyl-chrysenyl group, a picenyl group, a perylenyl group, a chloroperylenyl group, a pentaphenyl group, a pentacenyl group, a tetraphenylenyl group, a hexaphenyl group, a hexacenyl group, a rubicenyl group, a coronenyl group, a trinaphthylenyl group, a heptaphenyl group, a heptacenyl group, a pyranthrenyl group, an ovalenyl group, a carbazolyl group, a C1-C10 alkyl carbazolyl group, a thiophenyl group, an indolyl group, a purinyl group, a benzimidazolyl group, a quinolinyl group, a benzothiophenyl group, a parathiazinyl group, a pyrrolyl group, a pyrazolyl group, an imidazolyl group, an imidazolinyl group, an oxazolyl group, a thiazolyl group, a triazolyl group, a tetrazolyl group, an oxadiazolyl group, a pyridinyl group, a pyridazinyl group, a pyrimidinyl group, a pyrazinyl group, and a thianthrenyl group, but are not limited thereto.\",\n \"More particularly, the compounds represented by Formulae 1, 2, and 3 are each independently one of Compounds 1 to 62 below, but are not limited thereto.\",\n \"The compound represented by Formula 1 may be synthesized through a reaction between a phenylcarbazole (B′) with a diamine (C′) according to Reaction Scheme 1 below.\",\n \"Here, X, R1, R2, R3, and Ar1 are already described above, and Z can be halogen, particularly iodine (I).\",\n \"The reaction can be performed in the presence of Pd2(dba)3 (dba=dibenzylideneacetone), sodium tert-butoxide and tri(tert-butyl)phosphine and at a reaction temperatures in the range of 50 to 150.The layer which is included in the organic layer and which includes at least one of the compounds represented by Formulae 1, 2, and 3 may be a hole injection layer, a hole transport layer, or a single layer having hole injecting and transporting properties.\",\n \"For example, the layer included in the organic layer and including at least one of the compounds represented by Formulae 1, 2, and 3 may be a hole injection layer.\",\n \"The thickness of the hole injection layer formed under the red emission layer may be in the range of 1,600 to 2,200 Å, and preferably 1,900 to 2,200 Å.\",\n \"When the thickness of the hole injection layer formed under the red emission region is within the ranges described above, hole injecting and transporting properties suitable for causing resonance in a red emission layer of the organic layer can be obtained, and thus color purity, efficiency of the device, and a driving voltage of the device may be improved.\",\n \"In certain embodiments, the thickness of the hole injection layer formed under the red emission layer may be 1600, 1620, 1640, 1660, 1680, 1700, 1720, 1740, 1760, 1780, 1800, 1820, 1840, 1860, 1880, 1900, 1920, 1940, 1960, 1980, 2000, 2020, 2040, 2060, 2080, 2100, 2120, 2140, 2160, 2180, or 2200 Å.\",\n \"In some embodiments, the thickness of the hole injection layer formed under the red emission layer may be within a range defined by two of the foregoing thicknesses.\",\n \"The thickness of the hole injection layer formed under the green emission region may be in the range of 1,400 to 1,800 Å, and preferably 1,600 to 1,800 Å.\",\n \"When the thickness of the hole injection layer is within the ranges described above, hole injecting and transporting properties suitable for causing resonance in a green emission layer of the organic layer can be obtained, and thus color purity, efficiency of the device, and the driving voltage of the device may be improved.\",\n \"In certain embodiments, the thickness of the hole injection layer formed under the green emission layer may be, 1400, 1420, 1440, 1460, 1480, 1500, 1520, 1540, 1560, 1580, 1600, 1620, 1640, 1660, 1680, 1700, 1720, 1740, 1760, 1780, or 1800 Å.\",\n \"In some embodiments, the thickness of the hole injection layer formed under the green emission layer may be within a range defined by two of the foregoing thicknesses.\",\n \"The thickness of the hole injection layer formed under the blue emission region may be in the range of 1,000 to 1,400 Å, and preferably 1,100 to 1,300 Å.\",\n \"When the thickness of the hole injection layer formed under the blue emission region is within the ranges described above, hole injecting and transporting properties suitable for causing resonance in a blue emission layer of the organic layer can be obtained, and thus color purity, efficiency of the device, and the driving voltage of the device may be improved.\",\n \"In certain embodiments, the thickness of the hole injection layer formed under the blue emission layer may be, 1000, 1020, 1040, 1060, 1080, 1100, 1120, 1140, 1160, 1180, 1200, 1220, 1240, 1260, 1280, 1300, 1320, 1340, 1360, 1380, or 1400 Å.\",\n \"In some embodiments, the thickness of the hole injection layer formed under the blue emission layer may be within a range defined by two of the foregoing thicknesses.\",\n \"The organic layer may further include a hole transport layer.\",\n \"The total thickness of a region of the hole injection layer formed under a red emission region and the hole transport layer may be in the range of 2,000 to 2,400 Å, and preferably 2,100 to 2,300 Å.\",\n \"The thickness of the region of the hole injection layer formed under a red emission region may be in the range of 1,600 to 2,200 Å, and preferably 1,900 to 2,200 Å.\",\n \"When the total thickness of the region of the hole injection layer formed under the red emission region and the hole transport layer and/or the thickness of the region of the hole injection layer formed under the red emission region are within the ranges described above, hole injecting and transporting properties suitable for causing resonance in the red emission layer can be obtained, and thus color purity, efficiency of the device, and the driving voltage of the device may be improved.\",\n \"In certain embodiments, total thickness of a region of the hole injection layer formed under the red emission region and the hole transport layer may be, 2000, 2020, 2040, 2060, 2080, 2100, 2120, 2140, 2160, 2180, 2200, 2220, 2240, 2260, 2280, 2300, 2320, 2340, 2360, 2380, or 2400 Å.\",\n \"In some embodiments, the total thickness of the hole injection layer and the hole transport layer formed under the red emission layer may be within a range defined by two of the foregoing thicknesses.\",\n \"The total thickness of a region of the hole injection layer formed under a green emission region and the hole transport layer may be in the range of 1,600 to 2,000 Å, and preferably 1,700 to 1,900 Å.\",\n \"The thickness of the region of the hole injection layer formed under the green emission region may be in the range of 1,400 to 1,800 Å, and preferably 1,600 to 1,800 Å.\",\n \"When the total thickness of the region of the hole injection layer formed under the green emission region and the hole transport layer and/or the thickness of the region of the hole injection layer formed under the green emission region are within the ranges described above, hole injecting and transporting properties suitable for causing resonance in the green emission layer can be obtained, and thus color purity, efficiency of the device, and a driving voltage of the device may be improved.\",\n \"In certain embodiments, total thickness of a region of the hole injection layer formed under the green emission region and the hole transport layer may be, 1600, 1620, 1640, 1660, 1680, 1700, 1720, 1740, 1760, 1780, 1800, 1820, 1840, 1860, 1880, 1900, 1920, 1940, 1960, 1980, or 2000 Å.\",\n \"In some embodiments, the total thickness of the hole injection layer and the hole transport layer formed under the green emission layer may be within a range defined by two of the foregoing thicknesses.\",\n \"The total thickness of a region of the hole injection layer formed under a blur emission region and the hole transport layer may be in the range of 1,200 to 1,600 Å, and preferably 1,300 to 1,500 Å.\",\n \"The thickness of the region of the hole injection layer formed under the blur emission region may be in the range of 1,000 to 1,400 Å, and preferably 1,100 to 1,300 Å.\",\n \"When the total thickness of the region of the hole injection layer formed under the blur emission region and the hole transport layer and/or the thickness of the region of the hole injection layer formed under the blur emission region are within the ranges described above, hole injecting and transporting properties suitable for causing resonance in the blue emission layer can be obtained, and thus color purity, efficiency of the device, and the driving voltage of the device may be improved.\",\n \"In certain embodiments, total thickness of a region of the hole injection layer formed under the blue emission region and the hole transport layer may be, 1200, 1220, 1240, 1260, 1280, 1300, 1320, 1340, 1360, 1380, 1400, 1420, 1440, 1460, 1480, 1500, 1520, 1540, 1560, 1580, or 1600 Å.\",\n \"In some embodiments, the total thickness of the hole injection layer and the hole transport layer formed under the blue emission layer may be within a range defined by two of the foregoing thicknesses.\",\n \"An organic light emitting device according to an embodiment of the present invention includes: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and comprising an emission layer having a red emission region and a hole injection layer having a region formed under the red emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the red emission region is in the range of 1,600 to 2,200 Å, and preferably 1,900 to 2,200 Å.\",\n \"When the thickness of the region of the hole injection layer formed under the red emission region is within the ranges described above, hole injecting and transporting properties suitable for causing resonance in a red emission layer can be obtained, and thus color purity, efficiency of the device, and the driving voltage of the device may be improved.\",\n \"An organic light emitting device according to an embodiment of the present invention includes: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and comprising an emission layer having a green emission region and a hole injection layer having a region formed under the green emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the green emission region is in the range of 1,400 to 1,800 Å, and preferably 1,600 to 1,800 Å.\",\n \"When the thickness of the region of the hole injection layer formed under the green emission region is within the ranges described above, hole injecting and transporting properties suitable for causing resonance in the green emission layer can be obtained, and thus color purity, efficiency of the device, the driving voltage of the device may be improved.\",\n \"An organic light emitting device according to an embodiment of the present invention includes: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and comprising an emission layer having a blue emission region and a hole injection layer having a region formed under the blue emission region, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the thickness of the region of the hole injection layer formed under the blue emission region is in the range of 1,000 to 1,400 Å, and preferably 1,100 to 1,300 Å.\",\n \"When the thickness of the region of the hole injection layer formed under the blue emission region is within the ranges described above, hole injecting and transporting properties suitable for causing resonance in the blue emission layer can be obtained, and thus color purity, efficiency of the device, and the driving voltage of the device may be improved.\",\n \"Resonance can occur between the first electrode and the second electrode of an organic light emitting device according to an embodiment of the present invention during the operation thereof.\",\n \"The hole injection layer of the organic layer disposed between the first electrode and the second electrode may have a specific thickness according to the color of the light emitted by the organic layer described above to obtain excellent properties such as driving voltage, current density, luminance, color purity, efficiency and lifetime of the organic light emitting device.\",\n \"In an organic light emitting device according to an embodiment of the present invention, the first electrode can be formed on the substrate.\",\n \"The first electrode may be a reflective electrode and the second electrode may be a semitransparent or transparent electrode.\",\n \"Thus, resonance may occur between the first electrode and the second electrode during the operation of the device.\",\n \"Accordingly, the light generated in the organic layer between the first electrode and the second electrode resonates between the first electrode and the second electrode during the operation of the organic light emitting device, and the light is extracted through the second electrode, that is, in a direction away from the substrate.\",\n \"The organic layer of the organic light emitting device may include an emission layer and/or a hole injection layer.\",\n \"The organic layer may further include at least one of a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer.\",\n \"Thus, for example, an organic light emitting device according to an embodiment of the present invention may have a structure of substrate/first electrode/hole injection layer (HIL)/hole transport layer (HTL)/emission layer (EML)/hole blocking layer (HBL)/electron transport layer (ETL)/electron injection layer (EIL)/second electrode as illustrated in FIG.\",\n \"1.Hereinafter, Examples and methods of manufacturing an organic light emitting device according to an embodiment of the present invention will be described with reference to the organic light emitting device illustrated in FIGS.\",\n \"1 and 2.FIG.\",\n \"1 schematically illustrates a structure of an organic light emitting device according to an embodiment of the present invention.\",\n \"FIG.\",\n \"2 schematically illustrates an organic light emitting device including red, green, and blue emission layers according to an embodiment of the present invention.\",\n \"Referring to FIG.\",\n \"2, a first electrode 210 is formed on a substrate 200.Here, the substrate 200, which can be any substrate that is commonly used in conventional organic light emitting devices, may be a glass substrate or a plastic substrate with excellent transparency, surface smoothness, ease of treatment, and that is waterproof.\",\n \"The first electrode 210 may be a reflective electrode, a semitransparent electrode or a transparent electrode formed of a metal with excellent conductivity such as Li, Mg, Al, Al—Li, Ca, Mg—In, Mg—Ag, and Ca—Al, or a metal oxide with excellent conductivity such as ITO, IZO, and IN2O3.A combination of two or more of the metals or the metal oxides described above can also be used.\",\n \"Then a pixel defining layer 214 which defines regions in which red, green, and blue emission layers will be formed is formed on predetermined regions.\",\n \"The pixel defining layer 214 can be formed by deposition or coating, etc.\",\n \"using inorganic materials such as a silicon oxide and a nitride or organic materials having insulating properties.\",\n \"Then, a HIL 216 and a HTL 218 are sequentially formed on the first electrode 210 by thermal evaporation or spin coating according to regions which are defined by the pixel defining layer 214.The HIL 216 may include at least one of the compounds represented by Formulae 1, 2, and 3.The HTL 218 may include 1,3,5-tricarbazolylbenzene, 4,4′-biscarbazolylbiphenyl, polyvinylcarbazole, m-biscarbazolylphenyl, 4,4′-biscarbazolyl-2,2′-dimethylbiphenyl, 4,4′,4″-tri(N-carbazolyl)triphenylamine, 1,3,5-tri(2-carbazolylphenyl)benzene, 1,3,5-tris(2-carbazolyl-5-methoxyphenyl)benzene, bis(4-carbazolylphenyl)silane, N,N′-bis(3-methylphenyl)-N,N′-diphenyl-[1,1-biphenyl]-4,4′-diamine (TPD), N,N′-di(naphthalene-1-yl)-N,N′-diphenylbenzidine (α-NPD), N,N′-diphenyl-N,N′-bis(1-naphthyl)-(1,1′-biphenyl)-4,4′-diamine(NPB), IDE 320 (Idemitsu Corporation), poly(9,9-dioctylfluorene-co-N-(4-butylphenyl)diphenylamine (TFB), or poly(9,9-dioctylfluorene-co-bis-(4-butylphenyl-bis-N,N-phenyl-1,4-phenylenediamin (PFB), but is not limited to the above-described examples.\",\n \"The thickness of the HIL 216 and the HTL 218 are described above.\",\n \"The HIL 216 can be formed using a known method such as vacuum deposition, spin coating, casting, Langmuir Blodgett (LB), or the like.\",\n \"When the HIL 216 is formed by vacuum deposition, vacuum deposition conditions may vary according to a compound that is used to form the HIL 216, and the structure and thermal properties of the HIL 216 to be formed.\",\n \"In general, however, conditions for vacuum deposition may include a deposition temperature of 100-500° C., a pressure of 10−8-10−3 torr, and a deposition speed of 0.01-100 Å/sec.\",\n \"When the HIL 216 is formed by spin coating, coating conditions may vary according to a compound that is used to form the HIL 216, and the structure and thermal properties of the HIL 216 to be formed.\",\n \"In general, however, the coating speed may be in the range of about 2000 to 5000 rpm, and a temperature for heat treatment, which is performed to remove a solvent after coating may be in the range of about 80 to 200° C. The HTL 218 can be formed using a known method such as vacuum deposition, spin coating, casting, LB, or the like.\",\n \"When the HTL 218 is formed by vacuum deposition and spin coating, conditions for deposition and coating are similar to those for formation of the HIL 216, although conditions for deposition and coating may vary according to a material that is used to form the HTL 218.Red, green and blue EMLs, 220, 225, and 230 are formed on the HTL 218.The material used to form the red, green and blue EMLs, 220, 225, and 230 is not limited.\",\n \"For example, DCM1, DCM2, Eu(thenoyltrifluoroacetone)3 (Eu(TTA)3), and butyl-6-(1,1,7,7,-tetramethyljulolidyl-9-enyl)-4H-pyran (DCJTB) can be used to form the red EML 220.Alternatively, a dopant such DCJTB can be deposited with Alq3, Alq3 and rubrene can be co-deposited and a dopant can be deposited thereon, or dopants such as BTPIr or RD 61 can be deposited with 4,4′-N—N′-dicarbazole-biphenyl (CBP) to form the red EML 220, but the present invention is not limited to the above-described examples.\",\n \"For example, Coumarin 6, C545T, quinacridone, and Ir(ppy)3 can be used to form the green EML 225.Alternatively, a dopant such Ir(ppy)3 can be deposited with CBP, or a dopant such as a coumarin-based material can be deposited with Alq3 as a host to form the green EML 225, but the present invention is not limited to the above-described examples.\",\n \"Examples of the coumarin-based dopant may include C314S, C343S, C7, C7S, C6, C6S, C314T, and C545T.\",\n \"For example, oxadiazole dimer dyes (Bis-DAPDXP), spiro compounds (Spiro-DPVBi, Spiro-6P), triarylamine compounds, bis(styryl) amine (DPVBi, DSA), CzTT, Anthracene, TPB, PPCP, DST, TPA, OXD-4, BBOT, AZM-Zn, and BH-013X (Idemitsu Corporation) which is an aromatic hydrocarbon compound containing a naphthalene moiety can be used to form the blue EML 230.Alternatively, a dopant such IDE 105 (Idemitsu Corporation) can be deposited on IDE 140 (Idemitsu Corporation) to form the blue EML 230, but the present invention is not limited to the above-described examples.\",\n \"The thickness of the red, green and blue EMLs, 220, 225 and 230 may be in the range of 200 to 500 Å, and preferably 300 to 400 Å.\",\n \"The thickness of each of the red, green and blue, EMLs, 220, 225 and 230 may be the same or different.\",\n \"When the thickness of the red, green and blue, EMLs, 220, 225 and 230 is within the ranges described above, excellent lifetime and driving voltage of the light emitting device may be obtained.\",\n \"The red, green and blue, EMLs, 220, 225 and 230 can be formed using a known method such as vacuum deposition, spin coating, casting, LB, or the like.\",\n \"When the red, green and blue, EMLs, 220, 225 and 230 are formed by vacuum deposition and spin coating, conditions for deposition and coating are similar to those for formation of the HIL 216, although conditions for deposition and coating may vary according to the material that is used to form the red, green and blue, EMLs, 220, 225 and 230.A HBL (not shown) can optionally be formed on the red, green and blue, EMLs, 220, 225 and 230 by vacuum deposition or spin coating.\",\n \"A material that is used to form the HBL should have a capability of transporting electrons and an ionization potential higher than the red, green and blue, EMLs, 220, 225 and 230, and thus examples of the material may include bis(2-methyl-8-quinolato)-(p-phenylphenolato)-aluminum (Balq), bathocuproine (BCP), and tris(N-aryl benzimidazole) (TPBI), but are not limited thereto.\",\n \"The thickness of the HBL may be in the range of 30 to 60 Å, and preferably 40 to 50 Å.\",\n \"When the thickness of the HBL is within the ranges described above, a proper hole blocking capability and the driving voltage of the device may be obtained.\",\n \"The HBL can be formed using a known method such as vacuum deposition, spin coating, casting, LB, or the like.\",\n \"When the HBL is formed by vacuum deposition and spin coating, conditions for deposition and coating are similar to those for formation of the HIL 216, although conditions for deposition and coating may vary according to the material that is used to form the HBL.\",\n \"An ETL 240 can be optionally formed by vacuum deposition or spin coating on the red, green and blue, EMLs, 220, 225 and 230, or the HBL.\",\n \"The material that is used to form the ETL 240 may be Alq3, but is not limited thereto.\",\n \"The thickness of the ETL 240 may be in the range of about 100 to 400 Å, and preferably, 250 to 350 Å.\",\n \"When the thickness of the ETL 240 is greater than 100 Å, proper charge balance can be maintained.\",\n \"On the other hand, when the thickness of the ETL 240 is less than 400 Å, proper driving voltage of the device may be obtained.\",\n \"The ETL 240 can be formed using a known method such as vacuum deposition, spin coating, casting, LB, or the like.\",\n \"When the ETL 240 is formed by vacuum deposition and spin coating, conditions for deposition and coating are similar to those for formation of the HIL 216, although conditions for deposition and coating may vary according to the material that is used to form the ETL 240.An EIL 250 may be formed by vacuum deposition or spin coating on the ETL 240.The material that is used to form the EIL 250 may be BaF2, LiF, NaCl, CsF, Li2O, BaO, Liq, or the like, but is not limited thereto.\",\n \"The thickness of the EIL 250 may be in the range of 2 to 100 Å, preferably, 2 to 5 Å, and more preferably 2 to 4 Å.\",\n \"When the thickness of the EIL 250 is within the ranges described above, proper electron injecting capability and the driving voltage of the device may be obtained.\",\n \"The EIL 250 can be formed using a known method such as vacuum deposition, spin coating, casting, LB, or the like.\",\n \"When the EIL 250 is formed by vacuum deposition and spin coating, conditions for deposition and coating are similar to those for formation of the HIL 216, although conditions for deposition and coating may vary according to the material that is used to form the EIL 250.A second electrode 260 is formed on the EIL 250 by deposition to thereby complete the manufacture of the organic light-emitting device according to the current embodiment of the present invention.\",\n \"The material that is used to form the second electrode 260 can be a transparent metal oxide with excellent conductivity such as ITO, IZO, SnO2, and ZnO.\",\n \"Li, Mg, Al, Al—Li, Ca, Mg—In, Mg—Ag, Ca—Al can be used to form a thin film of the second electrode 260, and thus the second electrode 260 can be a reflective electrode, a semitransparent electrode, or a transparent electrode in a various manner.\",\n \"The material used to form the second electrode 260 is not limited to the above-described examples.\",\n \"The first electrode 210 and the second electrode 260 can be an anode or a cathode.\",\n \"The organic light emitting device according to the current embodiment of the present invention can be utilized in various types of flat panel display devices such as a passive matrix organic light emitting device and an active matrix organic light emitting device.\",\n \"When the organic light emitting device of the present embodiment is utilized in an active matrix organic light emitting device, the first electrode 210 as a pixel electrode that is formed on the substrate 200 can be electrically connected to a source electrode or a drain electrode of a thin film transistor.\",\n \"The organic light emitting device of the present embodiment can also be utilized in a flat panel display that can realize images in two sides.\",\n \"Hereinafter, the present invention will be described more specifically with reference to the following Synthesis Examples of Compounds 8, 9, 10, 11, 14, 28, 35, and 56 and Examples of an organic light emitting device according to an embodiment of the present invention will now be described in detail.\",\n \"However, the Synthesis Examples and the Examples are not intended to limit the scope of the present invention.\",\n \"EXAMPLES Synthesis Example 1: Synthesis of Compound 8 Compound 8 was synthesized through Reaction Scheme 2 below.\",\n \"Synthesis of Intermediate A 16.7 g (100 mmol) of carbazole, 26.5 g (130 mmol) of iodobenzene, 1.9 g (10 mmol) of CuI, 138 g (1 mol) of K2CO3, and 530 mg (2 mmol) of 18-crown-6 were dissolved in 500 ml of 1,3-Dimethyl-3,4,5,6-tetrahydro-(1H)-pyrimidinone (DMPU), and heated at 170° C. for 8 hours.\",\n \"After the reaction terminated, the reaction mixture was cooled to room temperature, and the resultant solid substance was filtered.\",\n \"Then a small amount of ammonium hydroxide was added to the filtered solution.\",\n \"The resultant was washed three times with 300 ml of diethylether, and dried in MgSO4 under reduced pressure.\",\n \"As a result, a crude product was obtained.\",\n \"The crude product was purified using a silica gel column chromatography to produce 22 g of Intermediate A as a white solid (yield 90%).\",\n \"1H NMR (CDCl3, 400 MHz) δ (ppm) 8.12 (d, 2H), 7.58-7.53 (m, 4H), 7.46-7.42 (m, 1H), 7.38 (d, 4H), 7.30-7.26 (m, 2H); 13C NMR (CDCl3, 100 MHz) δ (ppm) 141.0, 137.9, 130.0, 127.5, 127.3, 126.0, 123.5, 120.4, 120.0, 109.9.Synthesis of Intermediate B 2.433 g (10 mmol) of Intermediate A was added to 100 ml of 80% acetic acid.\",\n \"1.357 g (5.35 mmol) of iodine (I2) and 0.333 g (1.46 mmol) of o-periodic acid (H5IO6) were added thereto in the solid state.\",\n \"Then, the mixture was stirred at 80° C. in a nitrogen atmosphere for 2 hours.\",\n \"After the reaction terminated, the resultant solution was extracted three times with 50 ml of ethylether.\",\n \"An organic layer collected from the mixture was dried over MgSO4 to to evaporate the solvent.\",\n \"As a result, the dried result was purified using a silica gel column chromatography to produce 3.23 g of Intermediate B as a white solid (yield 87%).\",\n \"1H NMR (CDCl3, 300 MHz) δ (ppm) 8.43 (d, 1H), 8.05 (d, 1H), 7.62 (dd, 1H), 7.61-7.75 (m, 2H), 7.51-7.43 (m, 3H), 7.41-7.35 (m, 2H), 7.27 (dd, 1H), 7.14 (d, 1H) Synthesis of Intermediate C 3.12 g (10 mmol) of 4,4′-dibromodiphenyl, 2.3 ml (25 mmol) of aniline, 2.9 g (30 mmol) of t-BuONa, 183 mg (0.2 mmol) of Pd2(dba)3, 20 mg (0.1 mmol) of P(t-Bu)3 were dissolved in 30 ml of toluene and the mixture was stirred at 90° C. for 3 hours.\",\n \"The reaction mixture was cooled to room temperature, and the resultant solution was extracted three times with 30 ml of distilled water and diethylether.\",\n \"A precipitate in an organic layer was filtered, washed with acetone and diethylether, and dried in a vacuum condition to produce 0.3 g of Intermediate C (yield 90%).\",\n \"Intermediate C was identified by 1H-NMR.\",\n \"1H NMR (DMSO-d6, 400 MHz) δ (ppm) 8.22 (s, 2H), 7.48 (d, 4H), 7.23 (t, 4H), 7.10 (dd, 8H), 6.82 (t, 2H); 13C NMR (DMSO-d6, 100 MHz) δ (ppm) 145.7, 144.3, 133.7, 131.4, 128.7, 121.2, 119.2, 118.9.Synthesis of Compound 8 912 mg (2.47 mmol) of Intermediate B, 336.4 mg (1 mmol) of Intermediate C, 300 mg (3 mmol) of t-BuONa, 40 mg (0.02 mmol) of Pd2(dba)3, 3 mg (0.01 mmol) of P(t-Bu)3 were dissolved in 5 ml of toluene and the mixture was stirred at 90° C. for 3 hours.\",\n \"After the reaction terminated, the resultant mixture was cooled to room temperature, and the resultant solution was extracted three times with distilled water and 30 ml of ethylether.\",\n \"An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.\",\n \"As a result, the dried result was purified using a silica gel column chromatography to produce 570 mg of Compound 8 as a yellow solid (Yield 70%).\",\n \"1H NMR (CDCl3, 300 MHz) δ (ppm) 7.99 (d, 2H), 7.95 (s, 2H), 7.61-7.57 (m, 8H), 7.48-7.32 (m, 12H), 7.27-7.19 (m, 8H), 7.18-7.10 (m, 8H), 6.96 (t, 2H); 13C NMR (CDCl3, 100 MHz) δ (ppm) 148.4, 147.3, 141.3, 140.4, 138.0, 137.6, 133.9, 129.9, 129.1, 127.4, 127.1, 127.0, 126.1, 125.6, 124.3, 123.0, 122.9, 122.8, 121.7, 120.5, 119.9, 118.5, 110.7, 109.9.Compound 8 was diluted in CHCl3 to a concentration of 0.2 mM and a UV Spectrum of the diluted Compound 8 was obtained.\",\n \"Maximum absorption wavelengths were 353, 306 and 238 nm.\",\n \"Td (decomposition temperature) and Tg (glass transition temperature) of Compound 8 were measured by performing thermal analysis using thermo gravimetric analysis (TGA) and differential scanning calorimetry (DSC) under the following conditions: N2 atmosphere, temperatures of room temperature to 600° C. (10° C./min)-TGA and of room temperature to 400° C.-DSC, and Pan Type: Pt Pan in disposable Al Pan (TGA) and disposable Al pan (DSC).\",\n \"The measured Td was 494° C. and Tg was 153° C. A highest occupied molecular orbital (HOMO) level of 5.16 eV and a lowest occupied molecular orbital (LUMO) level of 2.16 eV were obtained using AC-2 that measures UV absorption spectrum and ionization potential.\",\n \"Synthesis Example 2: Synthesis Compound 9 Compound 9 was synthesized through Reaction Scheme 3 below.\",\n \"Intermediate D was synthesized with a yield of 85% in the same manner as in Synthesis Example 1, except that p-tolylamine was used instead of aniline in the synthesis of Intermediate C of Synthesis Example 1.Then, 2 g (Yield 80%) of Compound 9 as a yellow solid was produced in the same manner as in Synthesis Example 1, except that Intermediate D was used instead of Intermediate C in the synthesis of Compound 8 of Synthesis Example 1.1H NMR (C6D6, 300 MHz) δ (ppm) 8.14 (d, 2H), 7.64 (d, 2H), 7.47 (d, 4H), 7.38-7.28 (m, 6H), 7.27-7.25 (m, 8H), 7.23-7.01 (m, 16H), 6.96 (d, 2H), 2.19 (s, 6H); 13C NMR (C6D6, 100 MHz) δ (ppm) 149.0, 147.5, 142.6, 142.2, 139.1, 138.9, 135.1, 132.6, 130.1, 130.7, 128.1, 127.9, 127.2, 126.5, 125.9, 125.0, 124.5, 123.6, 121.8, 121.1, 119.2, 111.8, 110.8, 21.5.Compound 9 was diluted in CHCl3 to a concentration of 0.2 mM and a UV Spectrum of the diluted Compound 9 was obtained.\",\n \"Maximum absorption wavelengths were 358, 309 and 253 nm.\",\n \"Td and Tg of Compound 9 were measured by performing thermal analysis using TGA and DSC under the following conditions: N2 atmosphere, temperatures of room temperature to 600° C. (10° C./min)-TGA and of room temperature to 400° C.-DSC, and Pan Type: Pt Pan in disposable Al Pan (TGA) and disposable Al pan (DSC).\",\n \"The measured Td was 480° C. and Tg was 155° C. A HOMO level of 5.0 eV and a LUMO level of 2.02 eV were obtained using AC-2 that measures UV absorption spectrum and ionization potential.\",\n \"Synthesis Example 3: Synthesis Compound 10 Compound 10 was synthesized through Reaction Scheme 4 below.\",\n \"Synthesis of Intermediate E 3.69 g (10 mmol) of Intermediate B, 1.42 g (12 mmol) of 4-aminobenzonitril, 1.44 g (15 mmol) of t-BuONa, 183 mg (0.2 mmol) of Pd2(dba)3, and 40 mg (0.2 mmol) of P(t-Bu)3 were dissolved in 50 ml of toluene and the mixture was stirred at 90° C. for 3 hours.\",\n \"After the reaction terminated, the resultant mixture was cooled to room temperature, and the resultant solution was extracted three times with distilled water and 50 ml of diethylether.\",\n \"An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.\",\n \"As a result, the dried result was purified using a silica gel column chromatography to produce 1.8 g of Intermediate E (Yield 50%).\",\n \"Synthesis of Compound 10 2.2 g (Yield 86%) of Compound 10 as a yellow solid was produced in the same manner as in Synthesis Example 1, except that Intermediate E and 4,4′-dibromodiphenyl were used instead of Intermediates B and C in the synthesis of Compound 8 of Synthesis Example 1.1H NMR (CDCl3, 300 MHz) δ (ppm) 8.02 (d, 2H), 7.97 (d, 2H), 7.64-7.48 (m, 14H), 7.43-7.39 (m, 10H), 7.29-7.22 (m, 8H), 7.03 (d, 4H); 13C NMR (CDCl3, 100 MHz) δ (ppm) 152.1, 145.6, 141.5, 138.9, 138.2, 137.3, 136.3, 133.2, 130.0, 127.9, 127.8, 127.0, 126.6, 125.8, 125.5, 124.6, 122.7, 120.5, 120.2, 119.9, 119.4, 118.9, 111.2, 110.1, 101.8.Compound 10 was diluted in CHCl3 to a concentration of 0.2 mM and a UV Spectrum of the diluted Compound 10 was obtained.\",\n \"Maximum absorption wavelengths were 304 and 238 nm.\",\n \"Td, Tg and Tm of Compound 10 were measured by performing thermal analysis using TGA and DSC under the following conditions: N2 atmosphere, temperatures of room temperature to 600° C. (10° C./min)-TGA and of room temperature to 400° C.-DSC, and Pan Type: Pt Pan in disposable Al Pan (TGA) and disposable Al pan (DSC).\",\n \"The measured Td was 492° C., Tg was 178° C., and Tm was 263° C. A HOMO level of 5.4 eV and a LUMO level of 2.47 eV were obtained using AC-2 that measures UV absorption spectrum and ionization potential.\",\n \"Synthesis Example 4: Synthesis Compound 11 Compound 11 was synthesized through Reaction Scheme 5 below.\",\n \"Intermediate F was synthesized with a yield of 95% in the same manner as in Synthesis Example 1, except that 4-fluorophenylamine was used instead of aniline in the synthesis of Intermediate C of Synthesis Example 1.Then, 1.8 g (Yield 84%) of Compound 11 as a yellow solid was produced in the same manner as in Synthesis Example 1, except that Intermediate F was used instead of Intermediate C in the synthesis of Compound 8 of Synthesis Example 1.1H NMR (C6D6, 300 MHz) δ (ppm) 8.05 (s, 2H), 7.68 (d, 2H), 7.48 (d, 4H), 7.29-7.11 (m, 22H), 7.09-7.01 (m, 6H), 6.78 (t, 4H) Compound 11 was diluted in CHCl3 to a concentration of 0.2 mM and UV Spectrum of the diluted Compound 11 was obtained.\",\n \"Maximum absorption wavelengths were 351, 297 and 248 nm.\",\n \"Td, Tg, and Tm of Compound 11 were measured by performing thermal analysis using TGA and DSC under the following conditions: N2 atmosphere, temperatures of room temperature to 600° C. (10° C./min)-TGA and of room temperature to 400° C.-DSC, and Pan Type: Pt Pan in disposable Al Pan (TGA) and disposable Al pan (DSC).\",\n \"The measured Td was 464° C., Tg was 151° C., and Tm was 299° C. A HOMO level of 5.1 eV and a LUMO level of 2.28 eV were obtained using AC-2 that measures UV absorption spectrum and ionization potential.\",\n \"Synthesis Example 5: Synthesis Compound 14 Compound 14 was synthesized through Reaction Scheme 6 below.\",\n \"Intermediate G was synthesized with a yield of 90% in the same manner as in Synthesis Example 1, except that 4-aminobiphenyl was used instead of aniline in the synthesis of Intermediate C of Synthesis Example 1.Then, 3.1 g (Yield 82%) of Compound 14 as a yellow solid was produced in the same manner as in Synthesis Example 1, except that Intermediate G was used instead of Intermediate C in the synthesis of Compound 8 of Synthesis Example 1.1H NMR (CD2Cl2, 300 MHz) δ (ppm) 8.02-8.01 (m, 4H), 7.65-7.56 (m, 12H), 7.51-7.46 (m, 10H), 7.43-7.36 (m, 10H), 7.32-7.17 (m, 14H), 13C NMR (CD2Cl2, 100 MHz) δ (ppm) 148.2, 147.6, 141.8, 141.0, 140.6, 138.6, 137.9, 134.5, 134.4, 130.3, 129.1, 127.9, 127.8, 127.4, 127.3, 127.0, 126.8, 126.6, 126.1, 124.7, 123.5, 123.4, 123.0, 120.8, 120.3, 119.0, 111.1, 110.3.Compound 14 was diluted in CHCl3 to a concentration of 0.2 mM and a UV Spectrum of the diluted Compound 14 was obtained.\",\n \"Maximum absorption wavelength was 329 nm.\",\n \"Td and Tg of Compound 14 were measured by performing thermal analysis using TGA and DSC under the following conditions: N2 atmosphere, temperatures of room temperature to 600° C. (10° C./min)-TGA and of room temperature to 400° C.-DSC, and Pan Type: Pt Pan in disposable Al Pan (TGA) and disposable Al pan (DSC).\",\n \"The measured Td was 533° C. and Tg was 174° C. A HOMO level of 5.2 eV and a LUMO level of 2.27 eV were obtained using AC-2 that measures UV absorption spectrum and ionization potential.\",\n \"Synthesis Example 6: Synthesis Compound 28 Compound 28 was synthesized through Reaction Scheme 7 below.\",\n \"Intermediate H was synthesized with a yield of 80% in the same manner as in Synthesis Example 1, except that 3,6-dibromocarbozole was used instead of carbazole in the synthesis of Intermediate A of Synthesis Example 1.Then, Intermediate I was synthesized with a yield of 85% in the same manner as in Synthesis Example 1, except that Intermediate H was used instead of 4,4′-dibromodiphenyl in the synthesis of Intermediate C of Synthesis Example 1.Then, 2.3 g (Yield 81%) of Compound 28 as a yellow solid powder was produced in the same manner as in Synthesis Example 1, except that Intermediates B and I were used instead of Intermediates B and C in the synthesis of Compound 8 of Synthesis Example 1.1H NMR (C6D6, 300 MHz) δ (ppm) 8.13 (s, 2H), 8.04 (s, 2H), 7.65 (d, 2H), 7.39-7.31 (m, 4H), 7.27-7.22 (m, 12H), 7.19-6.99 (m, 21H), 6.82 (t, 2H); 13C NMR (C6D6, 100 MHz) δ (ppm) 150.4, 142.1, 141.9, 141.8, 138.8, 138.2, 138.0, 130.0, 129.9, 129.4, 128.3, 128.0, 127.8, 127.7, 127.3, 127.2, 127.1, 126.4, 126.3, 125.2, 125.1, 125.0, 123.8, 121.0, 120.7, 120.4, 120.2, 119.0, 117.7, 111.2, 110.9, 109.9.Compound 28 was diluted in CHCl3 to a concentration of 0.2 mM and UV Spectrum of the diluted Compound 28 was obtained.\",\n \"Maximum absorption wavelengths were 315 and 248 nm.\",\n \"Td and Tg of Compound 28 were measured by performing thermal analysis using TGA and DSC under the following conditions: N2 atmosphere, temperatures of room temperature to 600° C. (10° C./min)-TGA and of room temperature to 400° C.-DSC, and Pan Type: Pt Pan in disposable Al Pan (TGA) and disposable Al pan (DSC).\",\n \"The measured Td was 460° C. and Tg was 175° C. A HOMO level of 5.0 eV and a LUMO level of 2.09 eV were obtained using AC-2 that measures UV absorption spectrum and ionization potential.\",\n \"Synthesis Example 7: Synthesis Compound 35 Compound 35 was synthesized through Reaction Scheme 8 below.\",\n \"Synthesis of Intermediate J 0.316 g (0.856 mmol) of Intermediate B, 0.142 g (1.2 mmol) of 4-aminobenzonitril were dissolved in 5 ml of toluene and 0.144 g (1.5 mmol) of t-BuONa, 0.018 g (0.02 mmol) of Pd(dba)2, and 0.004 to 0.006 g (0.02 to 0.03 mmol) of (t-Bu)3P were added thereto.\",\n \"The mixture was stirred at 80° C. for 5 hours.\",\n \"The resultant solution was extracted three times with 20 ml of ethylether.\",\n \"An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.\",\n \"As a result, the dried result was purified using a silica gel column chromatography to produce 0.218 g of Intermediate J (Yield 71%).\",\n \"Synthesis of Compound 35 0.221 g (0.614 mmol) of Intermediate J, 0.332 g (0.9 mmol) of Intermediate B were dissolved in 10 ml of toluene and 0.144 g (1.5 mmol) of t-BuONa, 0.018 g (0.02 mmol) of Pd(dba)2, and 0.004 to 0.006 g (0.02 to 0.03 mmol) of (t-Bu)3P were added thereto.\",\n \"The mixture was stirred at 90° C. for 6 hours.\",\n \"The resultant solution was extracted three times with 30 ml of is ethylether.\",\n \"An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.\",\n \"As a result, the dried result was purified using a silica gel column chromatography to produce 0.236 g of Compound 35 (Yield 64%).\",\n \"Compound 35 was identified by 1H-NMR.\",\n \"1H-NMR (CDCl3, 400 MHz) δ (ppm) 8.05 (d, 2H), 8.03 (dd, 2H), 7.58 (m, 8H), 7.47 (m, 2H), 7.39 (m, 8H), 7.33 (dd, 2H), 7.24 (m, 2H), 6.94 (d, 2H).\",\n \"Synthesis Example 8: Synthesis Compound 56 Compound 56 was synthesized through Reaction Scheme 9 below.\",\n \"Synthesis of Intermediate K 13 g (53 mmol) of 2-bromofluorene was dissolved in 60 ml of acetic acid.\",\n \"The reaction mixture was set 0° C., and 60 g (200 mmol) of sodium dichromate was gradually added thereto.\",\n \"After 12 hours, 200 ml of distilled water was added thereto and the reaction mixture was sufficiently stirred.\",\n \"The produced yellow solid was filtered and dried to produce 10 g of Intermediate K (Yield 78%).\",\n \"Synthesis of Intermediate L 8 g (31.6 mmol) of Intermediate K was dissolved in 60 ml of THF.\",\n \"The temperature of the reaction mixture was set to −78° C., and 38 ml (38 mmol) of 1 M phenylmagnesium bromide was gradually added thereto.\",\n \"After 2 hours, the temperature was set to room temperature and stirred for 5 hours.\",\n \"The reaction mixture was diluted in 50 ml of ammonium chloride solution and extracted three times with 40 ml of ethylacetate.\",\n \"An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.\",\n \"As a result, the dried result was purified using a silica gel column chromatography to produce 10 g of Intermediate L (Yield 95%).\",\n \"Intermediate L was identified by 1H-NMR 1H NMR (CDCl3, 400 MHz) δ (ppm) 7.64 (d, 1H), 7.54-7.47 (m, 2H), 7.44 (d, 1H), 7.39-7.33 (m, 3H), 7.30-7.23 (m, 5H), 2.46 (s, 1H) Synthesis of Intermediate M 10 g (30 mmol) of Intermediate L was dissolved in 60 ml of benzene.\",\n \"2.4 ml (45 mmol) of sulfuric acid diluted in a small amount of benzene was added thereto.\",\n \"The reaction mixture was stirred at 80° C. for 5 hours.\",\n \"After the benzene was evaporated, 1 N NaOH was added to the reaction solution to adjust the pH of the reaction solution to 7.Then, the resultant solution was extracted three times with 40 ml of ethylacetate.\",\n \"An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.\",\n \"As a result, the dried result was purified using a silica gel column chromatography to produce 6 g of Intermediate M (Yield 50%).\",\n \"Synthesis of Intermediate O 340 mg (0.856 mmol) of Intermediate M, 142 mg (1.2 mmol) of 4-aminobenzonitril were dissolved in 5 ml of toluene and 0.144 g (1.5 mmol) of t-BuONa, 0.018 g (0.02 mmol) of Pd(dba)2, and 0.004 to 0.006 g (0.02 to 0.03 mmol) of (t-Bu)3P were added thereto.\",\n \"The mixture was stirred at 80° C. for 5 hours.\",\n \"The resultant solution was extracted three times with 20 ml of ethylether.\",\n \"An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.\",\n \"As a result, the dried result was purified using a silica gel column chromatography to produce 0.27 g of Intermediate O (Yield 73%).\",\n \"Synthesis of Compound 56 267 mg (0.614 mmol) of Intermediate O, 0.332 g (0.9 mmol) of Intermediate B (refer to Synthesis Example 1) were dissolved in 10 ml of toluene and 0.144 g (1.5 mmol) of t-BuONa, 0.018 g (0.02 mmol) of Pd(dba)2, and 0.004 to 0.006 g (0.02 to 0.03 mmol) of (t-Bu)3P were added thereto.\",\n \"The mixture was stirred at 90° C. for 6 hours.\",\n \"The resultant solution was extracted three times with 30 ml of ethylether.\",\n \"An organic layer collected from the mixture was dried over MgSO4 to evaporate the solvent.\",\n \"As a result, the dried result was purified using a silica gel column chromatography to produce 0.236 g of Compound 56 (Yield 57%).\",\n \"Compound 56 was identified by 1H-NMR.\",\n \"1H NMR (CDCl3, 400 MHz) δ (ppm) 7.97 (d, 1H), 7.90 (d, 1H), 7.69 (d, 1H), 7.65 (d, 1H), 7.60 (d, 2H), 7.56 (dd, 2H), 7.48 (m, 1H), 7.40 (d, 2H), 7.35 (m, 6H), 7.24 (m, 3H), 7.16 (m, 10H), 7.11 (dd, 1H), 6.93 (d, 2H) Example 1 An aluminium and ITO glass (SDI Co., Ltd.) substrate (1,300 Å) was cut into pieces of 50 mm×50 mm×0.7 mm in size, followed by ultrasonic cleaning in isopropyl alcohol and deionized water (5 minutes for each) and then UV/ozone cleaned (30 minutes) to produce a reflective electrode.\",\n \"Then, Compound 8 was deposited on the reflective electrode to form a HIL with a thickness of 1,200 Å, and NPB was deposited on the HIL to form a HTL with a thickness of 300 Å. IDE 140 (Idemitsu Corporation) as a blue fluorescent host and IDE 105 (Idemitsu Corporation) as a blue fluorescent dopant were deposited at the same time in a weight ratio of 98:2 on the HTL to form a blue EML with a thickness of 300 Å.\",\n \"Then, Balq was deposited on the blue EML to form a HBL with a thickness of 50 Å. Alq3 was deposited on the HBL to form an ETL with a thickness of 250 Å. LiF was deposited on the ETL to form an EIL with a thickness of 3 Å, and then Mg:Ag was deposited on the EIL to form a semitransparent electrode with a thickness of 180 Å.\",\n \"As a result, an organic light emitting device was manufactured.\",\n \"At a driving voltage of 5.5 V, the current density of the organic light emitting device was 23.0 mA/cm2, the luminance was 1,179 cd/m2, the color coordinates were (0.113, 0.130), and the light emitting efficiency was 5.13 cd/A.\",\n \"Example 2 An organic light emitting device was manufactured in the same manner as in Example 1 except that Compound 9 was used instead of Compound 8 in the formation of a HIL.\",\n \"At a driving voltage of 5.5 V, the current density of the organic light emitting device was 20.1 mA/cm2, the luminance was 1,021 cd/m2, the color coordinates were (0.113, 0.120), and the light emitting efficiency was 5.10 cd/A.\",\n \"Example 3 An organic light emitting device was manufactured in the same manner as in Example 1 except that IDE 406 (Idemitsu Corporation) was used instead of Compound 8 in the formation of a MIL.\",\n \"At a driving voltage of 5.5 V, the current density of the organic light emitting device was 46.52 mA/cm2, the luminance was 784 cd/m2, the color coordinates were (0.113, 0.125), and the light emitting efficiency was 4.74 cd/A.\",\n \"Example 4 An organic light emitting device was manufactured in the same manner as in Example 1 except that Li273 (Sensient, Germany) was used instead of Compound 8 in the formation of a HIL.\",\n \"At a driving voltage of 5.5 V, the current density of the organic light emitting device was 17.43 mA/cm2, the luminance was 695 cd/m2, the color coordinates were (0.122, 0.110), and the light emitting efficiency was 3.98 cd/A.\",\n \"Example 5 An organic light emitting device was manufactured in the same manner as in Example 1 except that HI102 (UDC, U.S.A.) was used instead of Compound 8 in the formation of a HIL.\",\n \"At a driving voltage of 5.5 V, the current density of the organic light emitting device was 0.67 mA/cm2, the luminance was 1.2 cd/m2, the color coordinates were (0.112, 0.154), and the light emitting efficiency was 0.18 cd/A.\",\n \"Example 6 An organic light emitting device was manufactured in the same manner as in Example 1 except that ELM180 (ELM, Korea) was used instead of Compound 8 in the formation of a HIL.\",\n \"At a driving voltage of 5.5 V, the current density of the organic light emitting device was 2.55 mA/cm2, the brightness was 52 cd/m2, the color coordinates were (0.124, 0.105), and the light emitting efficiency was 2.04 cd/A.\",\n \"Referring to Examples 1 through 6, when Compound 8 or 9 was used to form the HIL or the thickness of the HIL was controlled according to an embodiment of the present invention, the hole injecting capability increased, and thus the current densities and the current efficiencies of the organic light emitting devices increased at the same driving voltage and luminance increased.\",\n \"The results of the current efficiencies at the same voltage are illustrated in FIG.\",\n \"3.The evaluation results for the luminance changes and driving voltage changes of the organic light emitting devices according to Examples 1 and 3 are shown in FIGS.\",\n \"4 and 5.An accelerated life test was performed to measure luminance changes of the organic light emitting devices of Examples 1 and 3.The luminances were measure after 200 hours at 4,000 cd/m2 as shown in FIG.\",\n \"4.The luminance of the organic light emitting device of Example 1 after 200 hours at 4,000 cd/m2 was 90.2% of the initial luminance, and the luminance of the organic light emitting device of Example 3 after 200 hours at 4,000 cd/m2 was 86.2% of the initial luminance.\",\n \"FIG.\",\n \"5 illustrates the accelerated life test results of the driving voltage changes after 400 hours at 4,000 cd/m2.The driving voltage of the organic light emitting device of Example 1 increased by 0.45 V and the driving voltage of the organic light emitting device of Example 3 increased by 1.65 V. Referring to FIG.\",\n \"5, the organic light emitting device of Example 1 has low power consumption and low driving voltage.\",\n \"Example 7 An organic light emitting device was manufactured in the same manner as in Example 1 except that Compound 11 was deposited on the electrode to form a HIL with a thickness of 1600 Å, and CBP and Ir(ppy)3 as green light emitting materials were deposited on the HTL to form a green EML with a thickness of 300 Å instead of the blue EML.\",\n \"At a driving voltage of 5 V, the current density of the organic light emitting device was 7.5 mA/cm2, the luminance was 2220 cd/m2, the color coordinates were (0.244, 0.71), and the light emitting efficiency was 29.6 cd/A.\",\n \"Example 8 An organic light emitting device was manufactured in the same manner as in Example 7 except that IDE 406 (Idemitsu Corporation) was used instead of Compound 11 in the formation of a HIL.\",\n \"At a driving voltage of 5 V, the current density of the organic light emitting device was 7.86 mA/cm2, the luminance was 1,900 cd/m2, the color coordinates were (0.246, 0.691), and the light emitting efficiency was 23.9 cd/A.\",\n \"The current efficiencies of Examples 7 and 8 are shown in FIG.\",\n \"6.Example 9 An organic light emitting device was manufactured in the same manner as in Example 1 except that Compound 14 was deposited on the electrode to form a HIL with a thickness of 2000 Å, and CBP and BPTIr as red light emitting materials were deposited on the HTL to form a red EML with a thickness of 300 Å instead of the blue EML.\",\n \"At a driving voltage of 5 V, the current density of the organic light emitting device was 11.8 mA/cm2, the luminance was 1,534 cd/m2, the color coordinates were (0.687, 0.310), and the light emitting efficiency was 13.0 cd/A.\",\n \"Example 10 An organic light emitting device was manufactured in the same manner as in Example 9 except that IDE 406 (Idemitsu Corporation) was used instead of Compound 14 in the formation of a HIL.\",\n \"At a driving voltage of 5 V, the current density of the organic light emitting device was 13.3 mA/cm2, the brightness was 1328 cd/m2, the color coordinates were (0.692, 0.306), and the light emitting efficiency was 9.98 cd/A.\",\n \"The current efficiencies of Examples 9 and 10 are shown in FIG.\",\n \"7.The driving voltage, efficiency, and color purity characteristics of the organic light emitting devices of Examples 1-10 were evaluated using an IVL measuring device (PhotoResearch PR650, Keithley 238).\",\n \"Example 11 An organic light emitting device including red, s green, and blue EMLs was manufactured as follows.\",\n \"A substrate having a thin film transistor was prepared, and a first electrode composed of Al was formed in a stripe shape with a thickness of 1000 Å.\",\n \"Here, the first electrode was electrically connected to a source electrode or a drain electrode of the thin film transistor formed on the substrate.\",\n \"Red, green and blue sub-pixel defining layers which define regions in which the red, green, and blue EMLs will be formed were formed on the first electrode using a silicon oxide.\",\n \"Compound 8 was deposited on the regions in which the red, green and blue EML will be formed to form a HIL.\",\n \"Compound 8 was deposited on the region in which the red EML will be formed to a thickness of 2000 Å, on the region in which the green EML will be formed a thickness of 1600 Å, and on the region in which the blue EML will be formed to a thickness of 1200 Å to form the HIL.\",\n \"Then, NPB was deposited on the HIL to form a HTL with a thickness of 300 Å. CBP and BPTIr as red light emitting materials were deposited on the HTL to form a red EML with a thickness of 300 Å, CBP and Irppy as green light emitting materials were deposited on the HTL to form a green EML with a thickness of 300 Å, and IDE 140 (Idemitsu Corporation) and IDE 105 (Idemitsu Corporation) as blue light emitting materials were deposited on the HTL to form a blue EML with a thickness of 150 Å.\",\n \"Then, Balq was deposited on the red, green and blue EMLs to form a HBL with a thickness of 50 Å. Alq3 was deposited on the HBL to form an ETL with a thickness of 250 Å. LiF was deposited on the ETL to form an EIL with a thickness of 3 Å, and then Mg:Ag was deposited on the EIL to form a semitransparent electrode with a thickness of 180 Å.\",\n \"As a result, an organic light emitting device including the red, green, and blue EMLs was manufactured.\",\n \"The efficiency and the color coordinates of the organic light emitting device of Example 11 were measured in the same manner as in Examples 1 through 10.The results are shown in Table 1.TABLE 1 Efficiency (cd/A) x Color Coordinate y Color Coordinate Red EML 13.4 0.68 0.32 Green EML 29.9 0.22 0.73 Blue EML 2.9 0.14 0.06 As shown in Table 1, each EML of the organic light emitting device of Example 11 exhibited excellent efficiency and color purity.\",\n \"The efficiency of white light comprising a mixture of red, green, and blue light in the organic light emitting device of Example 11 was 13.0 cd/A at a luminance of 150 cd/m2 when 40% of the device was operating, and power consumption was 180 mW.\",\n \"The efficiency and color purity characteristics of the organic light emitting device of Example 11 were evaluated using an IVL measuring device (PhotoResearch PR650, Keithley 238) and the power consumption was calculated.\",\n \"Example 12 An organic light emitting device was manufactured in the same manner as in Example 11 except that IDE 406 (Idemitsu Corporation) was used instead of Compound 8 to form a HIL.\",\n \"The efficiency and the color coordinates of the organic light emitting device of Example 12 are shown in Table 2.TABLE 2 Efficiency (cd/A) x Color Coordinate y Color Coordinate Red EML 12.1 0.67 0.32 Green EML 25.4 0.23 0.73 Blue EML 2.24 0.14 0.06 As shown in Table 2, each EML of the organic light emitting device of Example 12 exhibited excellent efficiency and color purity.\",\n \"The efficiency of white light comprising a mixture of red, green, and blue light in the organic light emitting device of Example 12 was 11.0 cd/A at a brightness of 150 cd/m2 when 40% of the device was operating, and power consumption was 220 mW.\",\n \"The efficiency and color purity characteristics of the organic light emitting device of Example 12 were evaluated using an IVL measuring device (PhotoResearch PR650, Keithley 238) and the power consumption was calculated.\",\n \"Comparative Example 1 A substrate having a thin film transistor was prepared, and a first electrode composed of Al was formed in a stripe shape with a thickness of 1000 Å.\",\n \"Here, the first electrode was electrically connected to a source electrode or a drain electrode of the thin film transistor formed on a lower portion of the substrate.\",\n \"Red, green and blue pixel defining layers which define regions in which red, green, and blue emission layers will be formed were formed on the pixel electrode using a silicon oxide.\",\n \"M-TDATA was deposited on the regions in which red, green and blue emission layers will be formed form a HIL with a thickness of 1000 Å.\",\n \"Then NPB was deposited on the HIL to form a HTL with a thickness of 400 Å.\",\n \"In addition, NPB was further deposited over the region in which green EML will be formed to a thickness of 400 Å using a photomask.\",\n \"NPB was further deposited over the region in which red EML will be formed to a thickness of 800 Å.\",\n \"As a result, HTL having total thickness of 1200 Å in the region in which red EML will be formed, total thickness of 800 Å in the region in which green EML will be formed an to total thickness of 400 Å in the region in which blue EML will be formed.\",\n \"CBP and BPTIr as red light emitting materials were deposited on the red HTL to form a red EML with a thickness of 300 Å, CBP and Irppy as green light emitting materials were deposited on the green HTL to form a green EML with a thickness of 300 Å, and IDE 140 (Idemitsu Corporation) and IDE 105 (Idemitsu Corporation) as blue light emitting materials were deposited on the blue HTL to form a blue EML with a thickness of 150 Å.\",\n \"Then, Balq was deposited on the red, green and blue EMLs to form a HBL with a thickness of 50 Å. Alq3 was deposited on the HBL to form an ETL with a thickness of 250 Å. LiF was deposited on the ETL to form an EIL with a thickness of 3 Å, and then Mg:Ag was deposited on the EIL to form a semitransparent electrode with a thickness of 180 Å.\",\n \"As a result, an organic light emitting device including the red, green, and blue EMLs was manufactured.\",\n \"The efficiency and the color coordinates of the organic light emitting device of Comparative Example 1 are shown in Table 3.TABLE 3 Efficiency (cd/A) x Color Coordinate y Color Coordinate Red EML 5.39 0.67 0.32 Green EML 24.45 0.21 0.72 Blue EML 1.40 0.14 0.06 As shown in Table 3, the organic light emitting device of Example 11 having a material used to form a HIL according to an embodiment of the present invention and the organic light emitting device of Example 12 having the thickness of the HIL according to an embodiment of the present invention exhibited greater efficiency and color purity than the organic light emitting device of Comparative Example 1.An organic light emitting device according to the present invention includes an organic layer containing one of the compounds represented by Formulae 1, 2, and 3 between a pair of electrodes capable of generating resonance during the operation of the device; and/or a hole injection layer having the thickness range described above between the pair of electrodes.\",\n \"The organic light emitting device of the present invention has low driving voltage, excellent current density, high brightness, excellent color purity, high efficiency, and long lifetime.\",\n \"In particular, the organic light emitting device of the present invention has excellent lifetime property.\",\n \"A flat panel display device having enhanced reliability can be obtained by employing the organic light emitting device of the present invention.\",\n \"While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims.\"\n ]\n]"},"source":{"kind":"string","value":"Patent_15871007"}}},{"rowIdx":4493689,"cells":{"text":{"kind":"list like","value":[["BISMALEIMIDE RESINS FOR ONE DROP FILL SEALANT APPLICATION","The present invention relates to curable novel bismaleimide resins and prepolymers, methods of manufacture.","Particularly useful applications include one drop fill sealant used in liquid crystal assembly.","In particular, the inventive polymers and compositions are useful in the assembly of LCD panels."],["1.A resin comprising the structure: Wherein: R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; and n and n1 are each independently 1-10.2.A resin comprising the structure: Wherein: R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; and n1, n2, n3, and n4 are each independently 1-10.3.A resin comprising the structure: Wherein: X1 and X2 are 3-10 membered ring groups independently selected from functionalized or unfunctionalized alicycyclic groups optionally having one or more heteroatoms; n1 and n2 are each independently 1-10; R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; and R is linked to the ring structures X1 and X2 at any position with a proviso that the hydroxyl groups on X1 and X2 rings are adjacent to the maleimidoalkanoyl groups 4.A resin comprising the structure: Wherein: R is a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R1 is a carbonyl group; an aliphatic or aromatic linker which may contain one or more of ester, ether, hydroxyl or thioether groups; R2 is a substituent on the aromatic ring, which can be H, halogen, alkyl, alkyl ether, thioether group; and X1 is selected from maleimidoalkanoyl or maleimidoaroyl group.","5.A resin comprising the structure Wherein: R1 can be just a bond linking the two aromatic groups; O; carbonyl; or a multivalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R2 is an aliphatic or aromatic linker group which may contain one or more of ester, ether, hydroxyl, thioether or carbonate groups; R3 is a substituent on the aryl group, which may be H, halogen, alkyl, alkyl ether, or thio ether group; and X is a polymerizable functionality selected from maleimidoalkanoyl and maleimidoaroyl groups.","6.A resin comprising the structure Wherein: R is a divalent hydrocarbyl linker selected from linear or branched alkyls, linear or branched cycloalkyls, alkylenes, cycloalkylenes, bicycloalkylenes, tricycloalkylenes, linear or branched alkylenes, linear or branched cycloalkylenes, linear or branched alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene or heterocycloarylenes; the alkyls, cycloalkyls, alkylenes, cycloalkylenes, alkenylenes, arylenes, aralkylenes, arylbicycloalkylenes, aryltricycloalkylenes, bicycloalkylarylenes, tricycloalkylarylenes, bisphenylenes, cycloalkylarylenes, heterocycloalkylene and heterocycloarylenes can optionally contain O or S or hydroxyl group; R1 and R2 are each linear or branched aliphatic groups optionally containing heteroatoms; n=1-10; and n1 and n2 are 1-100."],[" BACKGROUND "],["